RT9013 Datasheet. Www.s Manuals.com. Richtek

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RT9013
500mA, Low Dropout, Low Noise Ultra-Fast Without
Bypass Capacitor CMOS LDO Regulator
General Description
The RT9013 is a high-performance, 500mA LDO regulator,
offering extremely high PSRR and ultra-low dropout. Ideal
for portable RF and wireless applications with demanding
performance and space requirements.
The RT9013 quiescent current as low as 25μA, further
prolonging the battery life. The RT9013 also works with
low-ESR ceramic capacitors, reducing the amount of board
space necessary for power applications, critical in handheld wireless devices.
The RT9013 consumes typical 0.7μA in shutdown mode
and has fast turn-on time less than 40μs. The other features
include ultra-low dropout voltage, high output accuracy,
current limiting protection, and high ripple rejection ratio.
Available in the SC-82, SOT-23-5, SC-70-5 and WDFN-6L
2x2 package.

Ordering Information
RT9013 -

Note :

Package Type
Y : SC-82
B : SOT-23-5
U5 : SC-70-5
QW : WDFN-6L 2x2 (W-Type)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Fixed Output Voltage
12 : 1.2V
13 : 1.3V
15 : 1.5V
16 : 1.6V
:
32 : 3.2V
33 : 3.3V
1B : 1.25V
1H : 1.85V
2H : 2.85V

Richtek products are :
`

RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.

Wide Operating Voltage Ranges : 2.2V to 5.5V
Low Dropout : 250mV at 500mA
Ultra-Low-Noise for RF Application
Ultra-Fast Response in Line/Load Transient
Current Limiting Protection
Thermal Shutdown Protection
High Power Supply Rejection Ratio
Output Only 1μ
μF Capacitor Required for Stability
TTL-Logic-Controlled Shutdown Input
RoHS Compliant and 100% Lead (Pb)-Free

Applications
CDMA/GSM Cellular Handsets
Portable Information Appliances
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
Mini PCI & PCI-Express Cards
PCMCIA & New Cards

Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.

Pin Configurations
(TOP VIEW)
VIN

VOUT

4

3
2

EN

GND

SC-82
VOUT

NC

5

4
2

3

VIN GND EN

SOT-23-5 / SC-70-5
EN
GND
VIN

1
2
3

GND

`

Features

7

6
5
4

NC
NC
VOUT

WDFN-6L 2x2
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RT9013
Typical Application Circuit
VIN

VIN

CIN
1µF/X7R

VOUT

VOUT
COUT
1µF/X7R

RT9013

Chip Enable
NC

EN
Rpull_down

GND

100k

Functional Pin Description
Pin Number
Pin Name

SC-82

SOT-23-5 /
SC-70-5

WDFN-6L 2x2

3

5

4

--

4

5, 6

2

2

2,
7 (Exposed
Pad)

1

3

4

1

Pin Function

VOUT

Regulator Output.

NC

No Internal Connection.

GND

Common Ground. The exposed pad must be soldered to a
large PCB and connected to GND for maximum power
dissipation.

1

EN

Enable Input Logic, Active High. When the EN goes to a
logic low, the device will be shutdown mode.

3

VIN

Supply Input.

Function Block Diagram

EN

Current
Limit

POR
OTP

VIN
VREF

+

MOS
Driver
VOUT

GND

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RT9013
Absolute Maximum Ratings

(Note 1)

Supply Input Voltage -----------------------------------------------------------------------------------------------------EN Input Voltage ----------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
SOT-23-5 -------------------------------------------------------------------------------------------------------------------SC-70-5/ SC-82 -----------------------------------------------------------------------------------------------------------WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
SOT-23-5, θJA --------------------------------------------------------------------------------------------------------------SOT-23-5, θJC -------------------------------------------------------------------------------------------------------------SC-70-5/ SC-82, θJA -----------------------------------------------------------------------------------------------------WDFN-6L 2x2, θJA --------------------------------------------------------------------------------------------------------WDFN-6L 2x2, θJC --------------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM -------------------------------------------------------------------------------------------------------------------------MM ----------------------------------------------------------------------------------------------------------------------------

Recommended Operating Conditions

6V
6V
0.4W
0.3W
0.606W
250°C/W
25°C/W
333°C/W
165°C/W
20°C/W
260°C
150°C
−65°C to 150°C
2kV
200V

(Note 4)

Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.2V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = VOUT + 0.5V, VEN = VIN, CIN = COUT = 1μF (Ceramic, X7R), TA = 25°C unless otherwise specified)

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

2.2

--

5.5

V

Input Voltage Range

VIN

Output Noise Voltage

VON

VOUT = 1.5V, COUT = 1μF, IOUT =
0mA

--

30

--

μVRMS

Output Voltage Accuracy
(Fixed Output Voltage)

ΔVOUT

IOUT = 10mA

−2

0

+2

%

Quiescent Current

IQ

VEN = 5V, IOUT = 0mA

--

25

50

μA

Shutdown Current

ISHDN

VEN = 0V

--

0.7

1.5

μA

Current Limit

ILIM

RLOAD = 0Ω, 2.2V ≤ VIN < 2.6V

0.4

0.5

0.85

A

RLOAD = 0Ω, 2.7V ≤ VIN ≤ 5.5V

0.5

0.6

0.85

A

IOUT = 400mA, 2.2V ≤ VIN < 2.7V

--

160

320

IOUT = 500mA, 2.7V ≤ VIN ≤ 5.5V

--

250

400

--

--

0.6

Dropout Voltage

(Note 5)

(Note 6)

Load Regulation
(Note 7)
(Fixed Output Voltage)

VDROP

ΔVLOAD

1mA < IOUT < 400mA
2.2V ≤ VIN < 2.7V
1mA < IOUT < 500mA
2.7V ≤ VIN ≤ 5.5V

mV

%
--

--

1

To be continued
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RT9013
Parameter
EN Threshold Voltage

Symbol

Test Conditions

Min

Typ

Max

Logic-Low VIL

0

--

0.6

Logic-High VIH

1.6

--

5.5

--

0.1

1

μA

--

−50

--

dB

--

0.01

0.2

%/V

Enable Pin Current

IEN

Power Supply Rejection Rate

PSRR

Line Regulation

ΔVLINE

Thermal Shutdown Temperature

TSD

--

170

--

Thermal Shutdown Hysteresis

ΔT SD

--

30

--

IOUT = 100mA, f = 10kHz
VIN = (VOUT+0.5) to 5.5V,
IOUT = 1mA

Unit
V

°C

Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of JEDEC 51-3
thermal measurement standard. The case position of θJC is on the exposed pad for the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under no
load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Note 6. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) - 100mV.
Note 7. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 10mA to 500mA.

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RT9013
Typical Operating Characteristics
(CIN = COUT = 1μ/X7R, unless otherwise specified)

Output Voltage vs. Temperature
1.60

Quiescent Current vs. Temperature
30

VIN = 2.5V

1.58

Quiescent Current (uA)

1.56

Output Voltage (V)

VIN = 2.5V

28

1.54
1.52
1.50
1.48
1.46
1.44

26
24
22
20
18
16
14
12

1.42

10

1.40
-50

-25

0

25

50

75

100

-50

125

-25

Temperature (°C)

RT9013-33PQW
TJ = 125°C

TJ = 25°C
200
150

TJ = -40°C
100
50

Dropout Voltage (mV)

Dropout Voltage (mV)

250

100

125

RT9013-25PQW
TJ = 125°C

250

TJ = 25°C

200
150

TJ = -40°C

100
50
0

50

100 150 200 250 300 350 400 450 500

0

50

100 150 200 250 300 350 400 450 500

Load Current (mA)

Load Current (mA)

EN Pin Shutdown Response

Start Up

VIN = 2.5V, ILOAD = 50mA
4 RT9013-15PQW
2

Output Voltage
(V)

0

2
1
0

Time (100μs/Div)

DS9013-10 April 2011

EN Pin Voltage
(V)

0

EN Pin Voltage
(V)

75

300

0

Output Voltage
(V)

50

Dropout Voltage vs. Load Current
350

300

25

Temperature (°C)

Dropout Voltage vs. Load Current
350

0

4

VIN = 2.5V, ILOAD = 75mA
RT9013-15PQW

2
0

1.0
0.5
0

Time (5μs/Div)

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RT9013
Line Transient Response

Line Transient Response
Input Voltage
Deviation (V)

3.6
2.6

20
0
-20

VIN = 2.6V to 3.6V, ILOAD = 100mA

Output Voltage
Deviation (mV)

Output Voltage
Deviation (mV)

Input Voltage
Deviation (V)

VIN = 2.6V to 3.6V, ILOAD = 10mA

RT9013-15PQW

3.6
2.6

20
0
-20

Time (100μs/Div)

Time (100μs/Div)

Load Transient Response

Load Transient Response
VIN = 2.5V, ILOAD = 10mA to 300mA

Load Current
(mA)

50
0

Output Voltage
Deviation (mV)

Output Voltage
Deviation (mV)

Load Current
(mA)

VIN = 2.5V, ILOAD = 10mA to 100mA
100

50
0
-50

RT9013-15PQW

400
200
0

50
0
-50

Time (100μs/Div)

Noise

Noise
VIN = 3.0V (By Battery), ILOAD = 10mA

300

300

200

200

Noise (μV/Div)

Noise (μV/Div)

RT9013-15PQW

Time (100μs/Div)

VIN = 3.0V (By Battery), No Load

100
0
-100

100
0
-100
-200

-200
-300

RT9013-15PQW

-300

RT9013-15PQW

Time (10ms/Div)

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RT9013-15PQW

Time (10ms/Div)

DS9013-10 April 2011

RT9013
Noise
20

VIN = 3.0V (By Battery), ILOAD = 300mA

VIN = 2.5V to 2.6V

10

300

0

200

-10

100

PSRR(dB)

Noise (μV/Div)

PSRR

0
-100
-200
-300

-20
-30
-40

ILOAD = 100mA
ILOAD = 300mA

-50
-60

RT9013-15PQW

ILOAD = 10mA

-70

Time (10ms/Div)

10

100

1000

10000

100000

1000000

Frequency (Hz)

DS9013-10 April 2011

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RT9013
Applications Information
Like any low-dropout regulator, the external capacitors used
with the RT9013 must be carefully selected for regulator
stability and performance. Using a capacitor whose value
is > 1μF/X7R on the RT9013 input and the amount of
capacitance can be increased without limit. The input
capacitor must be located a distance of not more than 0.5
inch from the input pin of the IC and returned to a clean
analog ground. Any good quality ceramic can be used for
this capacitor. The capacitor with larger value and lower
ESR (equivalent series resistance) provides better PSRR
and line-transient response.
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDOs
application. The RT9013 is designed specifically to work
with low ESR ceramic output capacitor in space-saving
and performance consideration. Using a ceramic capacitor
whose value is at least 1μF with ESR is > 5mΩ on the
RT9013 output ensures stability. The RT9013 still works
well with output capacitor of other types due to the wide
stable ESR range. Figure 1. shows the curves of allowable
ESR range as a function of load current for various output
capacitor values. Output capacitor of larger capacitance
can reduce noise and improve load transient response,
stability, and PSRR. The output capacitor should be located
not more than 0.5 inch from the VOUT pin of the RT9013
and returned to a clean analog ground.

Enable
The RT9013 goes into sleep mode when the EN pin is in a
logic low condition. During this condition, the RT9013 has
an EN pin to turn on or turn off regulator, When the EN pin
is logic hight, the regulator will be turned on. The supply
current to 0.7μA typical. The EN pin may be directly tied
to VIN to keep the part on. The Enable input is CMOS
logic and cannot be left floating.
PSRR
The power supply rejection ratio (PSRR) is defined as the
gain from the input to output divided by the gain from the
supply to the output. The PSRR is found to be

⎛
⎞
PSRR = 20 × log⎜ ΔGain Error ⎟
⎝ ΔSupply ⎠
Note that when heavy load measuring, Δsupply will cause
Δtemperature. And Δtemperature will cause Δoutput
voltage. So the heavy load PSRR measuring is include
temperature effect.
Current limit
The RT9013 contains an independent current limiter, which
monitors and controls the pass transistor's gate voltage,
limiting the output current to 0.6A (typ.). The output can
be shorted to ground indefinitely without damaging the part.
Thermal Considerations

Region of Stable COUT ESR vs. Load Current
(Ω)ESR (Ω)
OUT ESR
Region of CStable
COUT

100.000
100

Unstable Range

10.000
0

1
1.000
Stable Range

For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :

0.100
0.1

0.01
0.010
COUT = 1μF

0.001
0

50

150

200

Load Current (mA)

Figure 1

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8

PD = (VIN − VOUT) x IOUT + VIN x IQ

Unstable Range
100

Thermal protection limits power dissipation in RT9013.
When the operation junction temperature exceeds 170°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.

250

300

The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
DS9013-10 April 2011

RT9013
PD(MAX) = ( TJ(MAX) − TA ) /θJA
Where T J(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9013 the maximum junction temperature is 125°C and
TA is the operated ambient temperature. The junction to
ambient thermal resistance θJA (θJA is layout dependent)
for WDFN-6L 2x2 package is 165°C/W, SOT-23-5 package
is 250°C/W and SC-70-5/ SC-82 package is 333°C/W on
the standard JEDEC 51-3 single-layer thermal test board.
The maximum power dissipation at TA = 25°C can be
calculated by following formula :
PD(MAX) = (125°C − 25°C) / 165°C/W = 0.606 W for
WDFN-6L 2x2 packages
PD(MAX) = (125°C − 25°C) / 250°C/W = 0.400 W for
SOT-23-5 packages
PD(MAX) = (125°C − 25°C) / 333°C/W = 0.300 W for
SC-70-5/ SC-82 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal resistance
θJA. For RT9013 package, the Figure 2 of derating curves
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation allowed.
0.7

Single Layer PCB

Power Dissipation (W)

0.6
0.5

WDFN-6L 2x2

SOT-23-5
0.4
0.3

SC-70-5/
SC-82

0.2
0.1
0
0

12.5 25 37.5 50

62.5 75

87.5 100 113 125

Ambient Temperature (°C)

Figure 2. Derating Curves for RT9013 Packages

DS9013-10 April 2011

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RT9013
Outline Dimension
D
e

H
L
B

C

b1

b

A
A1

e

Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

0.800

1.100

0.031

0.043

A1

0.000

0.100

0.000

0.004

B

1.150

1.350

0.045

0.053

b

0.150

0.400

0.006

0.016

b1

0.350

0.500

0.014

0.020

C

1.800

2.450

0.071

0.096

D

1.800

2.200

0.071

0.087

e

1.300

0.051

H

0.080

0.260

0.003

0.010

L

0.200

0.460

0.008

0.018

SC-82 Surface Mount Package

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10

DS9013-10 April 2011

RT9013

H
D
L
B

C

b
A
A1
e

Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

0.889

1.295

0.035

0.051

A1

0.000

0.152

0.000

0.006

B

1.397

1.803

0.055

0.071

b

0.356

0.559

0.014

0.022

C

2.591

2.997

0.102

0.118

D

2.692

3.099

0.106

0.122

e

0.838

1.041

0.033

0.041

H

0.080

0.254

0.003

0.010

L

0.300

0.610

0.012

0.024

SOT-23-5 Surface Mount Package

DS9013-10 April 2011

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11

RT9013

H
D
L
B

C

b
A
A1
e

Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

0.800

1.100

0.031

0.044

A1

0.000

0.100

0.000

0.004

B

1.150

1.350

0.045

0.054

b

0.150

0.400

0.006

0.016

C

1.800

2.450

0.071

0.096

D

1.800

2.250

0.071

0.089

e

0.650

0.026

H

0.080

0.260

0.003

0.010

L

0.210

0.460

0.008

0.018

SC-70-5 Surface Mount Package

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DS9013-10 April 2011

RT9013
D2

D

L

E

E2

1

2

e

1

2

1

b

A
A1

SEE DETAIL A

A3

DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters

Dimensions In Inches

Symbol
Min

Max

Min

Max

A

0.700

0.800

0.028

0.031

A1

0.000

0.050

0.000

0.002

A3

0.175

0.250

0.007

0.010

b

0.200

0.350

0.008

0.014

D

1.950

2.050

0.077

0.081

D2

1.000

1.450

0.039

0.057

E

1.950

2.050

0.077

0.081

E2

0.500

0.850

0.020

0.033

e
L

0.650
0.300

0.026
0.400

0.012

0.016

W-Type 6L DFN 2x2 Package

Richtek Technology Corporation

Richtek Technology Corporation

Headquarter

Taipei Office (Marketing)

5F, No. 20, Taiyuen Street, Chupei City

5F, No. 95, Minchiuan Road, Hsintien City

Hsinchu, Taiwan, R.O.C.

Taipei County, Taiwan, R.O.C.

Tel: (8863)5526789 Fax: (8863)5526611

Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,
specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed
by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

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