MICROCHIP TECHNOLOGY A090666 ATZB-900-B0 900 MHz B0, 802.15.4/Zigbee OEM-Module User Manual doc8227

Atmel Norway AS ATZB-900-B0 900 MHz B0, 802.15.4/Zigbee OEM-Module doc8227

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User Manual techn

8227C–MCU Wireless–06/09ZigBit™ 700/800/900 MHz Wireless Modules....................................................................................................................ATZB-900-B0Datasheet
ZigBit™ 700/800/900 MHz Wireless Modules 1-28227C–MCU Wireless–06/09
ZigBit™ 700/800/900 MHz Wireless Modules 1-i8227C–MCU Wireless–06/09Section 11.1 Summary............................................................................................................................ 1-11.2 Applications........................................................................................................................ 1-11.3 Key Features...................................................................................................................... 1-21.4 Benefits .............................................................................................................................. 1-21.5 Abbreviations and Acronyms ............................................................................................. 1-21.6 Related Documents............................................................................................................1-3Section 22.1 Overview ............................................................................................................................ 2-1Section 33.1 Electrical Characteristics.................................................................................................... 3-33.1.1 Absolute Maximum Ratings ................................................................................. 3-33.1.2 Test Conditions.................................................................................................... 3-33.1.3 RF Characteristics ............................................................................................... 3-43.1.4 ATmega1281V Microcontroller Characteristics ................................................... 3-43.1.5 Module Interfaces characteristics ........................................................................ 3-53.2 Physical/Environmental Characteristics and Outline.......................................................... 3-53.3 Pin Configuration................................................................................................................ 3-63.4 Mounting Information .........................................................................................................3-93.5 Soldering Profile............................................................................................................... 3-103.6 Antenna Reference Design.............................................................................................. 3-103.6.1 General recommendations ................................................................................ 3-11Section 44.1 Ordering Information ........................................................................................................ 4-12
ZigBit™ 700/800/900 MHz Wireless Modules 1-18227C–MCU Wireless–06/09Section 1Introduction1.1 SummaryZigBit™ 900 is an ultra-compact, extended range, low-power, high-sensitivity 784/868/915 MHzIEEE 802.15.4/ZigBee® OEM module, based on the innovative Atmel’s mixed-signal hardware platform.It is designed for wireless sensing, control and data acquisition applications. ZigBit modules eliminatethe need for costly and time-consuming RF development, and shortens time to market for a wide rangeof wireless applications.This module is the latest addition to the ZigBit family also represented by 2.4 GHz modules ATZB-24-A2/B0 [1], and ATZB-A24-UFL/U0 [3].1.2 ApplicationsZigBit 900 module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing,self-organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmeloffers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified softwaredevelopment platform supporting reliable, scalable, and secure wireless applications running on Atmel’sZigBit modules. SerialNet allows programming of the module via serial AT-command interface.The applications include, but are not limited to:•Building automation & monitoring– Lighting controls– Wireless smoke and CO detectors– Structural integrity monitoring•HVAC monitoring & control•Inventory management•Environmental monitoring•Security•Water metering•Industrial monitoring– Machinery condition and performance monitoring– Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.•Automated meter reading (AMR)
IntroductionZigBit™ 700/800/900 MHz Wireless Modules 1-28227C–MCU Wireless–06/091.3 Key Features•Ultra compact size (18.8 x 13.5 mm)•High RX sensitivity (-110 dBm)•Outperforming link budget (120 dB)•Up to 11 dBm output power•Very low power consumption (< 6 µA in Sleep mode)•Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM)•Wide range of interfaces (both analog and digital):– 9 spare GPIO, 2 spare IRQ lines– 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled)– UART with CTS/RTS control–USART–I2C– SPI–1-Wire– Up to 30 lines configurable as GPIO•Capability to write own MAC address into the EEPROM•Optional antenna reference designs•IEEE 802.15.4 compliant transceiver•868 / 915 MHz band•784 MHz Chinese band•BitCloud embedded software, including serial bootloader and AT command set1.4 Benefits•Over 6 km (4 miles) outdoor line-of-sight range•Small physical footprint and low profile for optimum fit in even the smallest of devices(1)•Extended battery life•Mesh networking capability•Easy-to-use low cost Evaluation Kit•Single source of support for HW and SWNote: 1. The module is to be certified1.5 Abbreviations and AcronymsADC Analog-to -Digital ConverterAPI Application Programming InterfaceBPSK Binary Phase-Shift Keying modulation schemeDC Direct CurrentDTR Data Terminal ReadyEEPROM Electrically Erasable Programmable Read-Only MemoryESD Electrostatic Discharge
IntroductionZigBit™ 700/800/900 MHz Wireless Modules 1-38227C–MCU Wireless–06/091.6 Related Documents[1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-A2/B0 Datasheet. Atmel’s doc8226.pdf[2] ZigBit™ Development Kit. User Guide. MeshNetics Doc. S-ZDK-451 - TBD[3] ZigBit™ Amplified 2.4 GHz Wireless Modules datasheet. Atmel’s doc8228.pdfGPIO General Purpose Input/OutputHVAC Heating, Ventilating and Air ConditioningHW HardwareI2C Inter-Integrated CircuitIEEE Institute of Electrical and Electrionics EngineersIRQ Interrupt RequestISM Industrial, Scientific and Medical radio bandJTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard interfaceMAC Medium Access Control layerMCU Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit moduleO-QPSK Offset Quadrature Phase-Shift Keying modulation schemeOEM Original Equipment ManufacturerOTA Over-The-Air upgradePCB Printed Circuit BoardPER Package Error RatioRAM Random Access MemoryRF Radio FrequencyRTS/CTS Request to Send/ Clear to SendRX ReceiverSMA Surface Mount AssemblySPI Serial Peripheral InterfaceSW SoftwareTTM Time To MarketTX TransmitterUART Universal Asynchronous Receiver/TransmitterUSART Universal Synchronous/Asynchronous Receiver/TransmitterUSB Universal Serial BusZDK ZigBit Development KitZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications802.15.4 The IEEE 802.15.4-2006 standard applicable to low-rate wireless Personal Area Network
IntroductionZigBit™ 700/800/900 MHz Wireless Modules 1-48227C–MCU Wireless–06/09[4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549FAVR 04/06[5] Atmel AT86RF212 Low Power 800/900 MHz Transceiver for IEEE 802.15.4b, Zigbee, and ISM Appli-cations. Preliminary specification[6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height.http://www.hirose.co.jp/cataloge_hp/e32119372.pdf[7] ZigBit 900 Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~03 TBD[8] IEEE Std 802.15.4-2006 IEEE Standard for Information technology - Part 15.4 Wireless MediumAccess Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal AreaNetworks (LR-WPANs)[9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007[10] BitCloud™ IEEE 802.15.4/ZigBee Software. AVR2050: BitCloud User Guide. Atmel’s doc8199.pdf
ZigBit™ 700/800/900 MHz Wireless Modules 2-18227C–MCU Wireless–06/09Section 2Zigbit™700/800/900 MHz Wireless Modules Overview2.1 OverviewZigBit 900 is an extended-range low-power, a low-power, high-sensitivity IEEE 802.15.4/ ZigBee-compli-ant OEM module, which occupies less than a square inch. Based on a solid combination of Atmel’s latestMCU Wireless hardware platform [5], power amplifier and low-noise amplifier, the ZigBit 900 offers supe-rior radio performance, ultra-low power consumption and exceptional ease of integration.Figure 2-1. ATZB-900-B0 Block DiagramZigBit 900 contains Atmel’s ATmega1281V Microcontroller [4] and AT86RF212 RF Transceiver [5]. Themodule features 128 Kbytes flash memory and 8 Kbytes RAM.The ZigBit 900 already contains a complete RF/MCU-related design with all the necessary passive com-ponents included. The module can be easily mounted on a simple 2-layer PCB with a minimum ofrequired external connection. Compared to a custom RF/MCU design, a module-based solution offersconsiderable savings in development time and NRE cost per unit during the design, prototyping, andmass production phases of product development.To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and develop-ment tools. The new ZigBit 900 Development Kit [7] comes with everything you need to create customapplications featuring ZigBit 900 module.The kit features MeshBean development boards (ATZB-EVB-900-SMA) with an easy-to-access exten-sion connector for attaching third party sensors and other peripherals, and a JTAG connector for easyapplication uploading and debugging.The kit also includes reference applications to speed up application development, source code for hard-ware interface layer and reference drivers for the all the module interfaces, intuitive developmentenvironment from Atmel, and comprehensive set of application notes and product documentation.
Zigbit™700/800/900 MHz Wireless Modules OverviewZigBit™ 700/800/900 MHz Wireless Modules 2-28227C–MCU Wireless–06/09ZigBit 900 modules come bundled with BitCloud, a 2nd generation embedded software stack from Atmel.BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and control [8],[9], [10] and it provides an augmented set of APIs which, while maintaining 100% compliance with thestandard, offer extended functionality designed with developer's convenience and ease-of-use in mind.Depending on end-user design requirements, ZigBit 900 can operate as a self-contained sensor node,where it would function as a single MCU, or it can be paired with a host processor driving the moduleover a serial interface. In the former case, a user application may be used with the BitCloud softwareallowing customization of embedded applications through BitCloud’s C API.In the latter case, the host processor controls data transmission and manages module peripherals via anextensive set of SerialNet AT commands. Thus, no firmware customization is required for a successfulmodule design-in. Additionally, third-party sensors can be connected directly to the module, thusexpanding the existing set of peripheral interfaces.
ZigBit™ 700/800/900 MHz Wireless Modules 3-38227C–MCU Wireless–06/09Section 3Specifications3.1 Electrical Characteristics3.1.1 Absolute Maximum RatingsNotes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under nocircumstances must the absolute maximum ratings given in this table be violated. Stresses beyondthose listed under "Absolute Maximum Ratings" may cause permanent damage to the device.This is a stress rating only. Functional operation of the device at these or other conditions, beyond thoseindicated in the operational sections of this specification, is not implied. Exposure to absolute maximumrating conditions for extended periods may affect device reliability.2. Attention! ZigBit 900 is an ESD-sensitive device. Precaution should be taken when handling the devicein order to prevent permanent damage.3.1.2 Test Conditions Note: 1. Preliminary dataCurrent consumption actually depends on multiple factors, including but not limited to, the board designand materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends onMCU load and/or peripherals used by an application.Table 3-1. Absolute Maximum Ratings(1)(2)Parameters Min MaxVoltage on any pin, except RESET with respect to Ground -0.5V VCC +0.5VDC Current per I/O Pin 40 mADC Current DVCC and DGND pins 300 mAInput RF Level +5 dBmTable 3-2. Test conditions (unless otherwise stated), VCC =3V, Tamb =25CParameters Condition Range UnitSupply Voltage, VCC 1.8 to 3.6 VCurrent Consumption: RX mode(1) 15 mACurrent Consumption: TX mode(1) PTX = 5 dBm 20 mACurrent Consumption: Power-save mode(1) 6µA
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-48227C–MCU Wireless–06/093.1.3 RF CharacteristicsNotes: 1. Preliminary data2. IEEE 802.15.4-2006 compliant3.1.4 ATmega1281V Microcontroller CharacteristicsTable 3-3. RF CharacteristicsParameters Condition Range UnitFrequency Band779 to 787868 to 868.6902 to 928MHzNumber of Channels 15Channel Spacing 2MHzTransmitter Output Power -11 to +11 dBmReceiver Sensitivity AWGN channel, PER = 1%20 kbit/s(2)PSDU length of 20 octets-110dBm40 kbit/s(2) -108100 kbit/s(2) -101250 kbit/s(2) -100200 kbit/sPSDU length of 127 octets-97400 kbit/s -90500 kbit/s -971000 kbit/s -92On-Air Data RateBPSK modulation 20 (at 868 MHz),40 (at 915 MHz)kbpsO-QPSK modulation100 (at 868 MHz)250 (at 915 MHz and 784 MHz)TX Output/ RX Input Nominal Impedance For balanced output 100Range, outdoors(1) For balanced output 6 kmTable 3-4. ATmega1281V CharacteristicsParameters Condition Range UnitOn-chip Flash Memory size 128 KbytesOn-chip RAM size 8 KbytesOn-chip EEPROM size 4 KbytesOperation Frequency 4 MHz
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-58227C–MCU Wireless–06/093.1.5 Module Interfaces characteristics3.2 Physical/Environmental Characteristics and OutlineNote: 1. Minor degration of clock stability may occur.Figure 3-1. ATZB-900-B0 Mechanical drawingTable 3-5. Module Interfaces characteristicsParameters Condition Range UnitUART Maximum Baud Rate 38.4 kbpsADC Resolution/ Conversion Time In the single conversion mode 10/200 Bits/µsADC Input Resistance >1 MADC Reference Voltage (VREF) 1.0 to VCC -3 VADC Input Voltage 0 - VREF VI2C Maximum Clock 222 kHzGPIO Output Voltage (High/Low) -10/ 5 mA, VCC=3V 2.3/ 0.5 VReal Time Oscillator Frequency 32.768 kHzParameters Value CommentsSize 18.8 x 13.5 x 2.0 mm ATZB-900-B0Operating Temperature Range -20 C to +70 C-40C to +85 C operational(1)Operating Relative Humidity Range no more than 80%
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-68227C–MCU Wireless–06/093.3 Pin ConfigurationFigure 3-2. ATZB-900-B0 PinoutTable 3-6. Pin descriptionsConnector Pin Pin Name Description I/ODefault State after Power on1 SPI_CLK Reserved for stack operation(4) O2 SPI_MISO Reserved for stack operation(4) I/O3 SPI_MOSI Reserved for stack operation(4) I/O4 GPIO0 General Purpose digital Input/Output 0(2)(3)(4)(7) I/O tri-state5 GPIO1 General Purpose digital Input/Output 1(2)(3)(4)(7) I/O tri-state6 GPIO2 General Purpose digital Input/Output 2(2)(3)(4)(7) I/O tri-state7 OSC32K_OUT 32.768 kHz clock output(4)(5) O8 RESET Reset input (active low)(4)9,22,23 DGND Digital Ground10 CPU_CLKRF clock output. When module is in active state, 4 MHz signal is present on this line. While module is in the sleeping state, clock generation is also stopped(4).O11 I2C_CLK I2C serial clock output(2)(3)(4)(7) O tri-state12 I2C_DATA I2C serial clock input/output(2)(3)(4)(7) I/O tri-state13 UART_TXD UART transmit output(1)(2)(3)(4)(7) O tri-state14 UART_RXD UART receive input(1)(2)(3)(4)(7) I tri-state15 UART_RTS RTS input (Request To send) for UART hardware flow control. Active low(2)(3)(4)(7) I tri-state
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-78227C–MCU Wireless–06/09Notes: 1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex systemcontaining ZigBit 900 as its RF terminal unit), while UART_RXD pin, vice versa, is for output.2. Most of pins can be configured for general purpose I/O or for some alternate functions as described indetails in the ATmega1281V Datasheet [1].3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pindrivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [1]).4. All digital pins are provided with protection diodes to D_VCC and DGND16 UART_CTS CTS output (Clear To send) for UART hardware flow control. Active low(2)(3)(4)(7) O tri-state17 GPIO6 General Purpose digital Input/Output 6(2)(3)(4)(7) I/O tri-state18 GPIO7 General Purpose digital Input/Output 7(2)(3)(4)(7) I/O tri-state19 GPIO3 General Purpose digital Input/Output 3(2)(3)(4)(7) I/O tri-state20 GPIO4 General Purpose digital Input/Output 4(2)(3)(4)(7) I/O tri-state21 GPIO5 General Purpose digital Input/Output 5(2)(3)(4)(7) I/O tri-state24,25 D_VCC Digital Supply Voltage (VCC)(9)26 JTAG_TMS JTAG Test Mode Select(2)(3)(4)(6) I27 JTAG_TDI JTAG Test Data Input(2)(3)(4)(6) I28 JTAG_TDO JTAG Test Data Output(2)(3)(4)(6) O29 JTAG_TCK JTAG Test Clock(2)(3)(4)(6) I30 ADC_INPUT_3 ADC Input Channel 3(2)(3)(7) I tri-state31 ADC_INPUT_2 ADC Input Channel 2(2)(3)(7) I tri-state32 ADC_INPUT_1 ADC Input Channel 1(2)(3)(7) I tri-state33 BAT ADC Input Channel 0, used for battery level measurement. This pin equals VCC/3.(2)(3)(7) I tri-state34 A_VREF Input/Output reference voltage for ADC I/O tri-state35 AGND Analog ground36 GPIO_1WR 1-wire interface(2)(3)(4)(7) I/O37 UART_DTR DTR input (Data Terminal Ready) for UART. Active low(2)(3)(4)(7) I tri-state38 USART0_RXD USART/SPI Receive pin(2)(3)(4)(7) I tri-state39 USART0_TXD USART /SPI Transmit pin(2)(3)(4)(7) O tri-state40 USART0_EXTCLK USART/SPI External Clock(2)(3)(4)(7) I/O tri-state41 GPIO8 General Purpose Digital Input/Output 8(2)(3)(4)(7) I/O tri-state42 IRQ_7 Digital Input Interrupt request 7(2)(3)(4)(7) I tri-state43 IRQ_6 Digital Input Interrupt request 6(2)(3)(4)(7) I tri-state44,46,48 RF GND RF Analog Ground45 RFP_IO Differential RF Input/Output I/O47 RFN_IO Differential RF Input/Output I/OTable 3-6. Pin descriptions (Continued)Connector Pin Pin Name Description I/ODefault State after Power on
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-88227C–MCU Wireless–06/095. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it isused by BitCloud. However, this signal can be used if another peripheral or host processor requires32.768 kHz clock, otherwise this pin can be disconnected.6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging andflash burning. They can be used for A/D conversion if JTAGEN fuse is disabled.7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines:GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK,I2C_DATA, UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2,ADC_INPUT_1, BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6.Additionally, four JTAG lines can be programmed with software as GPIO as well, but this requireschanging the fuse bits and will disable JTAG debugging.8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus provid-ing mechanism for power management of host processor. If this function is necessary, connection ofthis pin to external pull-down resistor is recommended to prevent the undesirable transients duringmodule reset process.9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, asshown below.10. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input oroutput pin.
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-98227C–MCU Wireless–06/09Figure 3-3. Typical Reference Schematic3.4 Mounting InformationThe below diagrams show the PCB layout recommended for ZigBit 900 module. Neither via-holes norwires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,RF_GND pins should be grounded via several holes to be located right next to the pins thus minimizinginductance and preventing both mismatch and losses.
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-108227C–MCU Wireless–06/09Figure 3-4. ATZB-900-B0 PCB Recommended Layout, Top View3.5 Soldering ProfileThe J-STD-020C-compliant soldering profile is recommended, as given below.Note: 1. The package is backward compatible with Pb/Sn soldering profile3.6 Antenna Reference DesignThis section presents PCB design which may be used to combine ZigBit 900 with an external antennaThis antenna reference designs is recommended for successful design-in.Table 3-7. Soldering Profile(1)Profile Feature Green PackageAverage ramp-up rate (217 °C to peak) 3 °C/s max.Preheat temperature 175 °C ± 25 °C 180 s max.Temperature maintained above 217 °C 60 s to 150 sTime within 5 °C of actual peak temperature 20 s to 40 sPeak temperature range 6 °C/s max.Ramp-down rate 8 minutes max.
SpecificationsZigBit™ 700/800/900 MHz Wireless Modules 3-118227C–MCU Wireless–06/09Figure 3-5. FCC/CE compliant RF reference design with RP-SMA connector recommended for ATZB-900-B0Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factorsare the board material and thickness, shields, the material used for enclosure, the board neighborhood,and other components adjacent to antenna.3.6.1 General recommendationsMetal enclosure should not be used. Using low profile enclosure might also affect antenna tuning. Placing high profile components next to antenna should be avoided.Having holes punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern. ZigBit 900 module should not be placed next to the consumer electronics which might interfere with ZigBit 900's RF frequency band.The board design should prevent propagation of microwave field inside the board material. Electromag-netic waves of high frequency may penetrate the board thus making the edges of the board radiate,which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must beplaced around the board's edges.The external antenna used for this product must provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter.
ZigBit™ 700/800/900 MHz Wireless Modules 4-128227C–MCU Wireless–06/09Section 4Ordering Information4.1 Ordering InformationNote: 1. Tape and Reel quantity: 200Part Number DescriptionATZB-900-B0R(1) 783/868/915 MHz IEEE802.15.4/ZigBee Wireless Module w/ Balanced RF PortAgency CertificationsSection 55.1 UNITED STATES (FCC)This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations:1. The modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:Contains FCC ID: VW4A090666The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause undesired operation.Any similar wording that expresses the same meaning may be used.2. To be used with the ATZB900B0 module, the external antennas have been tested and approved which are specified in here below. The ATZB900B0 Module may be integrated with other custom design antennas which OEM installer must authorize following the FCC 15.21 requirements. If there are major deviations on the custom design antenna, then the product which carries the ATZB900B0 module has to be recertified by the OEM of the end product.WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment.IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19).The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter.Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions(FCC 2.1093) requires separate equipment authorization.IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21).IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense (FCC section 15.105).
8227C–MCU Wireless–06/09© 2009 Atmel Corporation. All rights reserved. Atmel®, Atmel logo and combinations thereof, and others are registered trademarks or trade-marks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.Headquarters InternationalAtmel Corporation2325 Orchard ParkwaySan Jose, CA 95131USATel: 1(408) 441-0311Fax: 1(408) 487-2600Atmel AsiaUnit 1-5 & 16, 19/FBEA Tower, Millennium City 5418 Kwun Tong RoadKwun Tong, KowloonHong KongTel: (852) 2245-6100Fax: (852) 2722-1369Atmel EuropeLe Krebs8, Rue Jean-Pierre TimbaudBP 30978054 Saint-Quentin-en-Yvelines CedexFranceTel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11Atmel Japan9F, Tonetsu Shinkawa Bldg.1-24-8 ShinkawaChuo-ku, Tokyo 104-0033JapanTel: (81) 3-3523-3551Fax: (81) 3-3523-7581Product ContactWeb Sitewww.atmel.com Technical Supportavr@atmel.com Sales Contactwww.atmel.com/contactsLiterature Requestswww.atmel.com/literatureDisclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to anyintellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORYWARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULARPURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OFTHE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes norepresentations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specificationsand product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically providedotherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for useas components in applications intended to support or sustain life.5.2. EUROPEAN UNION (ETSI)The ATZB900B0 Modules has been certified for use in European Union countries. If the ATZB900B0 Modules are incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive.Furthermore, the manufacturer must maintain a copy of the ATZB900B0 Modules documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards.IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials "CE" taking the following form:󾜀The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus.The CE marking must be affixed visibly, legibly, and indelibly.More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.

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