Microchip Technology BM57SPPSYC2A Bluetooth Module User Manual Manual

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BM57SPPSYC2A User Manual

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Datasheet of Bluetooth BM57SPPSyC2 Module iSSC Technologies Corp. Revision History Date Revision Content Version 2012/03/08 Preliminary Draft Version 0.2

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 3 1. Introduction Part Name: iSSC BM57SPPSyC2 Bluetooth module Part Number: BM57SPPSyC2-xxxxxx The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external components. It narrows down the module size and minimizes its cost. The optimized power designs minimize power consumption to keep low battery. The module is integrated with shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification. *Notice: 1. Changes or modifications made to this equipment not expressly approved by the Grantee of the FCC ID may void the FCC authorization to operate this equipment. 2. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains FCC ID: A8TBM57SPPSYC2A”. 1.1. Major Components - iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor) - Serial EEPROM 8K (1024*8) TSSOP 8P 1.2. Features - Bluetooth 3.0 EDR compliant - Low power 1.8V RF operation - RF transmitter output power Class 2 - RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm - Internal ROM and 4Mibts of flash - HCI over UART - I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and the iPod, iPhone and iPad) - 1 LED driver - 2.4GHz ceramic chip antenna

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 4 1.3. Application - GPS - Printers - Electric Scale - Blood Pressure Monitors - Bar code Scanner - Industrial Applications (CNC, PLC, RFID) - Embedded systems 1.4. Certifications - Bluetooth SIG: QDID B017511 http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511 - FCC ID: A8TBM57SPPSYC2A

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 5 2. Product Specification 2.1. Chipset 7x7 mm2 48 pin QFN IS1657NM 2.2. Interfaces - Multi function GPIO interface - Bluetooth RF interface - HCI over URAT up to 921600 bps - I2C for external EEPROM and authentication chip - 2/4 wires SPI interface (master/slave) for external peripherals control. (Optional) 2.3. Hardware Design Considerations - Power The module requires either a 3.3V or 5V supply voltage. (3.3V was suggested) - Power ramp-up timing restriction 1) BAT_IN : ramp-up (0 to 1.6V) < 200ms 2) PMULDO_O : PMU-logic ramp-up (0 to 1.6V) <60ms 3) VCC_RF (1.8V power domain) : RF BPOR ramp-up (0 to 1.6V) < 20ms - Power on sequence 1) BAT_IN/ BAT_IN_5V: must be first! 2) 3.3V power domain: VDD_IO/ VDD_FIO must power-up early than 1.8V power. 3) 1.8V power domain: 1V8/ VCC_RF/ VDD_XO/ 1V8_U_P 4) RST_N: digital reset released from 0 to 1.6V must be the last one. - Recommended operating conditions Rating Min Typ Max VDD_IO_x, 3.2V 3.63V SW_BTN 3.2V 4.3V BAT_IN 3.2V 4.3V - Clock Sources A high accuracy crystal with ±10ppm tolerance is connected to the BM57SPPSyC2 clock input pins. - Serial Flash and Firmware Version Firmware code is stored on chip internal flash. - Radio Characteristics Bluetooth V3.0 + EDR Frequency Band: 2402-2480 GHz Number of Channels: 79 1MHz channels

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 6 - Current Consumption Operation Mode Peak current AVG current Unit Note Peak current at TX mode 50.357 mA Peak current at RX mode 49.413 mA Standby mode (Discoverable & connectable mode 2.382 mA Deep power down mode 0.276 mA Connected + Sniff, Master (No data) 2.723 mA No data was transmitted Sniff (40 20 4 0) Connected + Sniff, Master (No data) 0.673 mA No data was transmitted Sniff (500 20 4 0) Connected + Sniff, Slave (No data) 0.745 mA No data was transmitted Sniff (500 20 3 3) iPhone parameters Data, Master 17.641 mA Data transmitted at 115200bps Data, Slave 18.025 mA Data transmitted at 115200bps - Terminal characteristics Condition : VDD_IO=3.3V Min Typ Max Unit I/O voltage levels VIL input logic levels low -0.3 0.8 V VIH input logic levels high 2.0 3.6 V VOL output logic levels low 0.4 V VOH output logic levels high 2.4 V Reset terminal VTH,res threshold voltage 1.6 V Input and tri-state current with Pull-up Resistor 65 Kohm Leakage current -10 +10 μA Vdd supply current TX mode 70 mA RX mode 70 mA

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 7 - Baud Rate Desired baud rate Clock P Div Actual Baud rate Error Rate % 921600 48000000 13 3.50641026 923077 0.16 460800 48000000 13 7.51282051 461538 0.16 230400 48000000 13 15.525641 230769 0.16 115200 16000000 13 10.1837607 111888 -2.87 57600 16000000 13 20.8675214 58608 1.75 38400 16000000 13 31.5512821 38462 0.16 28800 16000000 13 42.2350427 28623 -0.62 19200 16000000 13 63.6025641 19231 0.16 14400 16000000 13 84.9700855 14480 0.55 9600 16000000 13 127.705128 9615 0.16 4800 16000000 13 255.910256 4808 0.16 2400 16000000 13 512.320513 2399 -0.03 - Testing Criterion NO. Testing Item Name Spec. 1 Device Initialization 2 System Verify System Power>1.6V 3 PMU LDO trim 1.8~2.1 4 Calibration LDO18 1.81~1.93V 5 Calibration LDO33 3.1~3.4V 6 RF frequency calibration < 10k Hz 7 RF TX power verify > -5 dBm 8 8852 output power -2dbm~+4dbm 9 Initial carrier test +/- 30KHz 10 Single slot sensitivity > -70dbm 11 Multi slot sensitivity > -70dbm 12 Modulation index test ‘140KHz ≦ f1avg ≦ 175KHz ≧f2max 115KHz ≧f2/f1avg 0.8

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 8 - Timing Sequence Timing Sequence for Mode selection Pin (P20, P24) under APP mode Pin No. I/O Name Description 4 I BAT_IN 3.3V power input 7 P VDD_IO Main power supply 17 I P20 System configuration, refer to P2_4, MCU do NOT drive under APP Mode 18 I P24 Boot mode selection (MCU NOT drive under APP Mode) P2_0/ P2_4: HH Æ Application LL Æ Boot mode LH Æ HCI UART mode for testing and system configuration. P20P24VDDIOPower7.28ms 41.1msP20, P24 Mode Selection Timing Diagram

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 9 Timing Sequence for Rest Pin (RST_N) under different mode 22 I RST_N External reset input (Low Active), clock period 62.5n at least. External RestWrite Flash ModeTest Mode1 msAPP ModeRST_N Timing Diagram60 ms5 ms400 ms213Ready for MCUReady for MCUReady for MCU

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 10 3. Hardware Architecture Block Diagram IS1657NM16M XTALEEPROMRTX(Class 2)I2C32 mm12.6 mmUART/ HCI InterfaceGPIO ControlAntenna Power Tree BM57 ModuleIS1657NMEEPROMVDD_IOEither OneBAT_IN is recommendedBAT_IN_5VBAT_IN5V3V~4V2BAT_IN_5VBAT_INVDD_FIOUSB_VDDLDO18_I1V8VDD_XOVCC_RFAVDD_SAR1V8_U_PLDO18_O1V8VDD_IOLDO33_O2V8 ~ 3V32V8 ~ 3V3 4. Compatibility Requirements The BM57SPPSyC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility and reliability, and software compatibility test.

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 11 5. Environmental Requirements 5.1. Temperature Conditions Operating Temperature Non-Operating Temperature Minimum -10 ℃ -40℃ Maximum +70 ℃ +80 ℃ 5.2. Humidity Conditions Operating Humidity Non-Operating Humidity Minimum 10% 5% Maximum 90% 95%

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 12 Appendix A: Dimension and Foot Print 1. Dimension • 32mm* 12.6mm* 1.86mm (Length* Width* Height) • board thickness: 0.8mm (4 layers PCB) 2. Module Foot Print 3. The mandatory layout under the module. 4. The solder stop mask

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 13 Appendix B: Product Image

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 14 Appendix C: PIN Assignment Pin # I/O Name Description 1 P GND Ground 2 I SAR_BAT Reserved 3 I BAT_IN_5V 5V power input 4 I BAT_IN 3.3V power input 5 I SW_BTN Reserved 6 P LDO33_O 3V3 LDO output 7 P VDD_IO Main power supply 8 P LDO18_O LDO18 output 9 I WAKEUP Wakeup BM57 from Shutdown State. (Low Active) It is only valid while BM57 into Shutdown State. 10 P PMULDO_O Output of PMULDO 11 O P04 UART_TX_IND: H: BM57 indicate UART data will be transmitted out after a certain timing (setting by EEPROM, default 5 ms) L: Otherwise. STATUS_IND_2: BM57 State indication , refer to P22 12 I/O P12/ SCL I2C_SCL, for Authentication Coprocessor 2.0B 13 I/O P13/ SDA I2C_SDA, for Authentication Coprocessor 2.0B 14 I/O P16 EEPROM WP Chip Antenna BM57_V21234567891011 121314171932313029282726252423222120GNDSAR_BATBAT_IN_5VBAT_INSW_BTNLDO33_OVDD_IOLDO18_OWAKEUPPMULDO_OP04P12 / SCLP13 / SDAP16USB_DM P20P24P21BT_RFGNDLED1P07P25P23P27P26HCI_TXDHCI_RXDRST_NEANP22USB_DP 181516

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 15 15 I/O USB_DP Reserved 16 I/O USB_DM Reserved 17 I P20 System configuration, refer to P2_4, No drive under APP Mode 18 I P24 Boot mode selection (No drive under APP Mode) P2_0/ P2_4: HH Æ Application LL Æ Boot mode LH Æ HCI UART mode for testing and system configuration. 19 O P21 CP_RST: Reset Authentication Coprocessor 2.0B 20 O P22 STATUS_IND: Bluetooth link status indication, P22/P04: HH Æ Power default value and Shutdown State. P22/P04: HL Æ Access State. P22/P04: LL Æ Link State w/o UART_TXD. P22/P04: LH Æ Link State with UART_TXD. 21 I EAN ROM/ Flash selection. (No drive under APP Mode) H: ROM code; L: Flash code 22 I RST_N External reset input (Low Active), clock period 62.5n at least. 23 I HCI_RXD UART_RXD 24 O HCI_TXD UART_TXD 25 I P26 UART_CTS: UART Flow Control- set HIGH to disable TX transmitter. 26 O P27 UART_RTS: UART Flow Control- go HIGH to disable host transmitter. Open data session indication- go LOW when APP session is ready. 27 I P23 LINK_DROP: Host_MCU ask to drop SPP link under Link State; One low pulse with 10 ms duration low signal to trigger SPP disconnection. Otherwise it will be set as high always. 28 I P25 Pairing Key: Device will enter Standby Mode after pull low over 240ms. 29 I P07 UART_RX_IND: L: Inform BM57 that UART data will be transmitted out after 1 ms H: Otherwise. 30 O LED1 LED1 driver 31 P GND Ground 32 RI/O BT_RF RF Port

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 17 Appendix E: Schematic EANLDO18_OC1210u/6.3VLDO33_ORST_NUSB_DPP20C810u/6.3VP27SW_BTNBT_RFANT1CAN4311851042453K21P16C41.8p/50V5V_INC119p/50VC191u/10VLDO18_OSAR_BATC139p/50VC161u/10VP25C141u/10VLDO18_OP13R34K712C151u/10VWAKEUPLDO18_OC91u/16VP04C61.2p/50VLDO33_OLDO18_OQFN48-SPP BridgeIS1657NM8486137279255211202112132935262232343328191823 38414049454474346443942101415161724 37363130P1_6/WP1V8_GNDP1_4/TX_CLS1LDO18_OPMULDO_OP1_5/RX_CLS1VDD_IOP1_2/SCLHCI_TXDP0_4WAKEUPGNDP2_1P2_21V8VDD_IOP2_7/MISOXO _ P1V8EANP0_7VDD_XOVDD_FIOP2_6/NCSP2_4P2_0RST_N VCC_RFAVDD_SARRTXEPSW_BTNNCLDO18_INBAT_IN_5VLDO33_OBAT_INRXSAR_BATP1_3/SDAUSB_DPUSB_DMUSB_VDD1V8_U_PHCI_RXD LED1XO_NP2_5/SCLKP2_3/MOSIUSB_DMP24P21L24.7nH1 2LDO33_OPMULDO_OP26C310u/6.3VLDO33_OP23HCI_RXDP12L12.7nH1 2LDO33_OLED1P07LDO18_OLDO18_OC510u/6.3VP22HCI_TXDC171u/10VLDO18_OVBAT_INX1X4P-16MHZ-HLT4132C7NP-040212 SW_BTNP21HCI_RXDP27P24P23LDO33_OP16BM57_V2123456789101112131416 1718193231302928272625242322212015GNDSAR_BATBAT_IN_5VBAT_INSW_BTNLDO33_OVDD_IOLDO18_OWAKEUPPMULDO_OP04P12 / SCLP13 / SDAP16USB_DM P20P24P21BT_RFGNDLED1P07P25P23P27P26HCI_TXDHCI_RXDRST_NEANP22USB_DPP12LED1P20P22USB_DMUSB_DPP07HCI_TXDLDO18_OP13EANP26VBAT_IN5V_INSAR_BATPMULDO_OP25RST_NP04WAKEUP

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 18 U4IS24C08A1234 5678A0A1A2GND SDASCLWPVCCP13/SDAVDD_IOVDD_IOP16R610K12P12/SCL Appendix F: Reference Schematic WAKEUP (option)ROM/ Flash selection (reserv e test point)CP_SCL (option)Pairing Key (option)HCI_TXDTP2CP_SDA (option)Sy stem conf iguration (reserv e test point)3V3Boot mode selection (reserv e test point)LED1UART_RX_IND (option)CP_RST (option)LINK_DROP (option)TP3HCI_RXDUART_RTS (option)UART_TX_IND (option)UART_CTS (option)TP1STATUS_IND (recommend)LED1LED-B12BM57_V2123456789101112131416 1718193231302928272625242322212015GNDSAR_BATBAT_IN_5VBAT_INSW_BTNLDO33_OVDD_IOLDO18_OWAKEUPPMULDO_OP04P12 / SCLP13 / SDAP16USB_DM P20P24P21BT_RFGNDLED1P07P25P23P27P26HCI_TXDHCI_RXDRST_NEANP22USB_DP4V2~3V2RST_N (option) Test Point: TP1, TP2, TP3 are recommended for future firmware, EEPROM table update if the module are welded on load board.

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 19 Appendix G: Test Board Layout Information 1. The CN1 is reserved for SMA Connector, It’s will be used only if user would like to check module RF performance. 2. The C4 components must be removed under general condition. The RF trace will output from the chip antenna on the module. Appendix H: Test Board Layout Information Top Bottom Appendix H: Label Information TBA

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 20 Appendix I: Packaging Information TBA

CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 21 Appendix I: Reversion History Version Date History 0.1 2011/12/11 Preliminary Draft Version

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