Microchip Technology MRF89XAM9A 915MHz Ultra Low-Power Communications Device Transmitter User Manual 915 MHz Ultra Low Power Sub GHz Transceiver Module

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Date Submitted	2011-06-03 00:00:00
Date Available	2011-06-06 00:00:00
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Document Title	915 MHz Ultra Low-Power Sub-GHz Transceiver Module
Document Creator	FrameMaker 9.0
Document Author:	Microchip Technology Inc.

MRF89XAM9A
Data Sheet
915 MHz Ultra Low-Power Sub-GHz
Transceiver Module
© 2011 Microchip Technology Inc.
Preliminary
DS00000A
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
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Solutions Company are registered trademarks of Microchip
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Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN:
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS00000A-page ii
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
915 MHz Ultra Low-Power Sub-GHz Transceiver Module
Features
RF/Analog Features
• Module designed from the MRF89XA Integrated
Ultra Low-Power, Sub-GHz Transceiver IC.
• Supports MiWi™ Development Environment
Proprietary Wireless Networking Protocols
• 4-Wire Serial Peripheral Interface (SPI) with
Interrupts
• Small Size: 0.7" x 1.1" (17.8 mm x 27.9 mm),
Surface Mountable — Pin compatible with
MRF89XAM9A
• Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry and Printed Circuit Board
(PCB) Antenna
• Easy Integration into Final Product — Minimize
Product Development, Quicker Time to Market
• Compatible with Microchip’s Microcontroller
Families (PIC16, PIC18, PIC24, dsPIC33 and
PIC32)
• Radio Regulation Certified for United States
(FCC), Canada (IC) and Australia/New Zealand
(C-TICK)
• ISM Band 902–928 MHz Operation
• Modulation: FSK and OOK
• Data Rate (to conform to FCC and IC regulations):
- FSK: 50–200 kbps
- OOK: 16 kbps
• Reception sensitivity
- FSK: -107 dBm (typical) at 50 kbps
- OOK: -113 dBm (typical) at 2 kbps
• +10 dBm Typical Output Power with 21 dB Tx
Power Control Range
Operational
• Operating Voltage: 2.1–3.6V (3.3V typical)
• Temperature Range: -40°C to +85°C Industrial
• Low-Current Consumption:
- Rx mode: 3 mA (typical)
- Tx mode: 25 mA at +10 dBm (typical)
- Sleep: 0.1 µA (typical)
Media Access Controller (MAC)/
Baseband Features
• Packet handling feature with data whitening and
automatic CRC generation
• Incoming sync word (pattern) recognition
• Built-in bit synchronizer for incoming data, and clock
synchronization and recovery
• 64-byte transmit/receive FIFO with preload in Stand-by
mode
• Supports Manchester encoding/decoding
techniques
Pin diagram
GND
RESET
CSCON
IRQ0
SDI
SCK
© 2011 Microchip Technology Inc.
12
11
10
Preliminary
GND
GND
VIN
IRQ1
CSDATA
SDO
DS00000A-page 1
MRF89XAM9A
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Circuit Description ........................................................................................................................................................................ 9
3.0 Regulatory Approval ................................................................................................................................................................... 17
4.0 Electrical Characteristics ............................................................................................................................................................ 21
Appendix A: Revision History............................................................................................................................................................... 27
The Microchip Web Site ....................................................................................................................................................................... 29
Customer Change Notification Service ................................................................................................................................................ 29
Customer Support ................................................................................................................................................................................ 29
Reader Response ................................................................................................................................................................................ 30
Product Identification System............................................................................................................................................................... 31
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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Most Current Data Sheet
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http://www.microchip.com
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DS00000A-page 2
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
1.0
DEVICE OVERVIEW
1.1
The simplified block diagram of the MRF89XAM9A
module is shown in Figure 1-1. The module is based on
the Microchip Technology MRF89XA Ultra Low-Power
Sub-GHz Transceiver Integrated Circuit (IC). The
module interfaces to many popular Microchip PIC®
microcontrollers through a 3-wire serial SPI interface,
two chip selects (Configuration and Data), two
interrupts — Interrupt Request 0 (IRQ0) and Interrupt
Request 1 (IRQ1), Reset, Power and Ground as shown
in Figure 1-2. Table 1-1 provides the pin descriptions.
The MRF89XAM9A is an Ultra Low-Power Sub-GHz
surface mount transceiver module with integrated
crystal, internal voltage regulator, matching circuitry
and PCB antenna. The MRF89XAM9A module
operates in the United States/Canada 902–928 MHz
ISM frequency band. The integrated module design
frees the integrator from extensive RF and antenna
design, and regulatory compliance testing, allowing
quicker time to market.
The MRF89XAM9A module is compatible with
Microchip’s MiWi™ Development Environment software
stacks. The software stacks are available as a free
download, including source code, from the Microchip’s
web site http://www.microchip.com/wireless.
Data communication and module configuration are
documented in the “MRF89XA Ultra Low-Power,
Integrated Sub-GHz Transceiver” (DS70622) Data
Sheet. For more information on specific serial interface
protocol and general register definitions, refer to the
“MRF89XA Data Sheet” and see Section 1.3,
Operation for specific register settings unique to the
MRF89XAM9A module operation to maintain
regulatory compliance.
The MRF89XAM9A module has received regulatory
approvals for modular devices in the United States
(FCC) and Canada (IC). Modular approval removes the
need for expensive RF and antenna design, and allows
the end user to place the MRF89XAM9A module inside
a finished product and not require regulatory testing for
an intentional radiator (RF transmitter). To maintain
conformance, refer to module settings in Section 3.1.1,
MRF89XAM9A SETTINGS for the United States and
Section 3.2.1, MRF89XAM9A SETTINGS for Canada.
FIGURE 1-1:
Interface description
MRF89XAM9A BLOCK DIAGRAM
MRF89XAM9A Module
MRF89XA
PCB
Antenna
Matching
Circuitry
and
SAW Filter
CSCON
CSDATA
Control
Interface
SPI
RF
Digital I/O
Baseband
Power
Management
VCO
Tank
IRQ0
IRQ1
RESET
Power
Loop
Filter
12.8 MHz Crystal
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 3
MRF89XAM9A
TABLE 1-1:
PIN DESCRIPTION
Pin
Symbol
Type
Description
GND
Power
Ground
RESET
DI
Reset Pin
CSCON
DI
Serial Interface Configure Chip Select
IRQ0
DO
Interrupt Request Output
SDI
DI
Serial Interface Data Input
SCK
DI
Serial Interface Clock
SDO
DO
Serial Interface Data Output
CSDATA
DI
Serial Interface Data Chip Select
IRQ1
DO
Interrupt Request Output
10
Vin
Power
Power Supply
11
GND
Power
Ground
12
GND
Power
Ground
FIGURE 1-2:
MICROCONTROLLER TO MRF89XAM9A INTERFACE
PIC® Microcontroller
MRF89XAM9A
CSCON
I/O
CSDATA
I/O
SDI
SDO
VIN
SDO
SDI
GND
SCK
SCK
IRQ0
INTx
IRQ1
INTx
RESET
DS00000A-page 4
Preliminary
I/O
© 2011 Microchip Technology Inc.
MRF89XAM9A
1.2
Mounting Details
The MRF89XAM9A is a surface mountable module.
Module dimensions are shown in Figure 1-3. The
module PCB is 0.032" thick with castellated mounting
holes on the edge. Figure 1-4 is the recommended host
PCB footprint for the MRF89XAM9A.
The MRF89XAM9A has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the
module be mounted on the edge of the host PCB and
an area around the antenna, approximately 3.4" (8.6
cm), be kept clear of metal objects for best
performance. A host PCB ground plane around the
MRF89XAM9A acts as a counterpoise to the PCB
antenna. It is recommended to extend the ground plane
at least 0.4" (1 cm) around the module.
FIGURE 1-3:
MODULE DETAILS
FIGURE 1-4:
RECOMMENDED PCB FOOTPRINT
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 5
MRF89XAM9A
FIGURE 1-5:
MOUNTING DETAILS
Keep area around antenna
(approximately 3.4 (6.8 cm)
inches) clear of metallic structures
for best performance
3.4”
Edge of PCB
3.4”
0.470”
0.4”
0.4”
Host PCB Top Copper Ground
Plane (Antenna Counterpoise):
Extend the host PCB top copper
ground plane under and to the left
and right side of the module at least
0.4 inches (1 cm) for best antenna
performance.
DS00000A-page 6
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
1.3
Operation
1.3.2
The MRF89XAM9A module is based on the Microchip
Technology MRF89XA Ultra Low-Power, Integrated
ISM Band Sub-GHz Transceiver IC. Data
communication and module configuration are
documented in the “MRF89XA Ultra Low-Power,
Integrated ISM Band Sub-GHz Transceiver Data
Sheet” (DS70622).
This section emphasizes operational settings that are
unique to the MRF89XAM9A module design that must
be followed for proper operation.
1.3.1
RESET
Pin 2 of the module, RESET, allows for an external
reset of the MRF89XA IC. RESET is connected to the
TEST8 pin of the MRF89XA IC. During normal
operations of the MRF89XAM9A, the RESET pin
should be held in a high impedance state. For more
information on Assertion of the RESET pin, refer to the
“Section 3.1.2 Manual Reset” of “MRF89XA Data
Sheet” (DS70622).
© 2011 Microchip Technology Inc.
CRYSTAL FREQUENCY
When calculating frequency deviation, bit rate, receiver
bandwidth, and PLL R, P and S values, use crystal
frequency fxtal = 12.8 MHz.
1.3.3
CLOCK OUTPUT (CLKOUT)
The CLKOUT pin 19 of the MRF89XA IC is not used on
the module. Ensure that the CLKOUT signal is disabled
to minimize the current consumption.
1.3.4
FREQUENCY BAND SELECT
The Frequency Band Select (FBS<1:0>) bits in the
GCONREG<4:3> should be set for target channel
range 902–915 MHz FBS<1:0> = '00' or 915–928 MHz
FBS<1:0> = '01'.
1.3.5
VCO TANK TRIM VALUE
The VCO Trim (VCOT<1:0>) bits in the
GCONREG<2:1> should be set for VCOT<1:0> = '11'
for the inductor values of the module.
Preliminary
DS00000A-page 7
MRF89XAM9A
NOTES:
DS00000A-page 8
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
2.0
CIRCUIT DESCRIPTION
2.1
Module Schematic
The MRF89XAM9A module is based on the Microchip
Technology MRF89XA Ultra Low-Power, Integrated
ISM Band sub-GHz Transceiver IC. The serial I/O
(CSCON, CSDATA, SCK, SDO and SDI), RESET,
IRQ0 and IRQ1 pins are brought out to the module
pins. Crystal X1 is a 12.8 MHz crystal with a
frequency tolerance of ±10 ppm at 25°C. The RFIO
output is matched to the SAW filter FL1 and further
matched to the PCB trace antenna.
The MRF89XAM9A module interfaces to Microchip’s
PIC16, PIC 18, PIC24, dsPIC33 and PIC32
microcontrollers with a minimum of external
components through digital only connections. An
example application schematic is shown in Figure 2-2.
Figure 2-2 illustrates the MRF89XAM9A schematics.
Table 2-1 details the Bill of Materials (BOM).
FIGURE 2-1:
MRF89XAM9A APPLICATION SCHEMATIC
+ 3.3V
Note 1
C1
0.1 μF
+ C2
1 0 μF
U1
MRF89XAM9A-I/RM
12
GND
GND
RESET
GND
CSCON
VIN
11
10
To Host
Microcontroller
IRQ0
IRQ1
SDI
CSDATA
SCK
SDO
Note:
To Host
Microcontroller
For battery powered applications, place a 10 μF capacitor in parallel with the 0.1 μF bypass
capacitor to provide a low impedance during startup sequences.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 9
MRF89XAM9A
DS00000A-page 10
Preliminary
Designators not used: C6, L5
Note:
MRF89XAM9A SCHEMATIC
FIGURE 2-2:
© 2011 Microchip Technology Inc.
MRF89XAM9A
TABLE 2-1:
MRF89XAM9A BILL OF MATERIALS
Desi
gnat
or
Value
Description
Manufacturer
Part Number
C1
0.047 µF
Capacitor, Ceramic, 10V, ±10%, X7R, SMT
0402
Murata
GRM155R71A473KA01D
C2
0.22 µF
Capacitor, Ceramic, 16V, ±10%, X7R, SMT
0402
Murata
GRM155R71C224KA12D
C3
1 µF
Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT
0603
Murata
GRM188R60J105KA01D
C4
30 pF
Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0,
SMT 0402
Johanson Technology
250R07S300JV4T
C5
1.8 pF
Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q
NP0, SMT 0402
Johanson Technology
500R07S1R8BV4
C6
—
Designator not used
—
—
C7
33 pF
Capacitor, Ceramic, 50V, ±5%, C0G, SMT
0402
Murata
GRM1555C1H330JZ01D
C8
0.1 µF
Capacitor, Ceramic, 16V, ±10%, X7R, SMT
0402
Murata
GRM155R71C104KA88D
C9
680 pF
Capacitor, Ceramic, 50V, ±5%, C0G, SMT
0402
Murata
GRM1555C1H681JA01D
C10
0.01 µF
Capacitor, Ceramic, 16V, ±10%, X7R, SMT
0402
Murata
GRM155R71C103KA01D
C11
1.0 pF
Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q
NP0, SMT 0402
Johanson Technology
500R07S1R0BV4
C12
0.9 pF
Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q
NP0, SMT 0402
Johanson Technology
500R07S0R9BV4
FL1
TA0281A
Filter, SAW, 902–928 MHz
Tai-saw Technology
TA0281A
L1
10 nH
Inductor, Ceramic, ±5%, SMT 0402
Johanson Technology
L-07C10NJV6T
L2
100 nH
Inductor, Ceramic, ±5%, SMT 0402
Johanson Technology
L-07CR10JV6T
L3
5.6 nH
Inductor, Wirewound, ±5%, SMT 0402
Johanson Technology
L-07W5N6JV4T
L4
5.6 nH
Inductor, Wirewound, ±5%, SMT 0402
Johanson Technology
L-07W5N6JV4T
L5
—
Designator not used
—
—
L6
10 nH
Inductor, Ceramic, ±5%, SMT 0402
Johanson Technology
L-07C10NJV6T
R1
1Ω
Resistor, 1%, ±100 ppm/0C, SMT 0402
Vishay/Dale
CRCW04021R00FKED
R2
100KΩ
Resistor, 5%, ±100 ppm/0C, SMT 0402
Yageo
RC0402JR-07100KL
Resistor, 1%, ±100
ppm/0C,
R3
6.8KΩ
Yageo
RC0402FR-076K8L
U1
MRF89XA
Transceiver, Ultra Low-Power, Integrated
Sub-GHz
Microchip Technology
MRF89XA-I/MQ
X1
12.8 MHz
Crystal, ±10 ppm, 15 pF, ESR 100 ohms,
SMT 5 x 3.2mm
Abracon
ABM3B-155-12.800MHz-T
© 2011 Microchip Technology Inc.
SMT 0402
Preliminary
DS00000A-page 11
MRF89XAM9A
2.2
Printed Circuit Board
FIGURE 2-5:
LAYER 2 — GROUND
PLANE
FIGURE 2-6:
LAYER 3 — POWER
PLANE
The MRF89XAM9A module PCB is constructed with
high temperature FR4 material, four layers and 0.032
inches thick. The layers are shown in Figure 2-3
through Figure 2-8. The stack up of the PCB is shown
in Figure 2-9
FIGURE 2-3:
FIGURE 2-4:
TOP SILK SCREEN
TOP COPPER
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 12
MRF89XAM9A
FIGURE 2-7:
BOTTOM COPPER
FIGURE 2-9:
PCB LAYER STACK UP
FIGURE 2-8:
1/2 oz. Copper
BOTTOM SILK SCREEN
Top Copper
8 mil FR4
1/2 oz. Copper
Ground Plane
0.032”
12 mil FR4
±0.005”
1/2 oz. Copper
Power Plane
8 mil FR4
1/2 oz. Copper
© 2011 Microchip Technology Inc.
Preliminary
Bottom Copper
DS00000A-page 13
MRF89XAM9A
2.3
PCB Antenna
FIGURE 2-10:
The PCB antenna is fabricated on the top copper trace.
Figure 2-11 shows the trace dimensions. The layers
below the antenna have no copper traces. The ground
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB by following the
recommendations in Section 1.2, Mounting Details.
16.8mm
1.0mm
2.5mm
The PCB antenna was designed and simulated using
Ansoft Designer® and HFSS™ 3D full-wave solver
software by ANSYS, Inc. (www.ansoft.com). The
design goal was to create a compact, low-cost antenna
with the best radiation pattern. Figure 2-11 shows the
simulation drawing and Figure 2-12 and Figure 2-13
show the 2D and 3D radiation patterns, respectively. As
shown by the radiation patterns, the performance of the
antenna is dependant upon the orientation of the
module. Figure 2-14 shows the impedance simulation
and Figure 2-15 shows the actual impedance
measurement. The discrete matching circuitry matches
the impedance of the antenna with the SAW filter and
MRF89XA transceiver IC.
FIGURE 2-11:
PCB ANTENNA
DIMENSIONS
1.1mm
0.5mm
8.4mm
PCB ANTENNA SIMULATION DRAWING
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 14
MRF89XAM9A
FIGURE 2-12:
SIMULATED 2D RADIATION PATTERN
FIGURE 2-13:
SIMULATED 3D RADIATION PATTERN
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 15
MRF89XAM9A
FIGURE 2-14:
SIMULATED PCB ANTENNA IMPEDANCE
FIGURE 2-15:
SIMULATED PCB ANTENNA VSWR
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 16
MRF89XAM9A
3.0
REGULATORY APPROVAL
The MRF89XAM9A module has received regulatory
approvals for modular devices in the United States and
Canada. Modular approval allows the end user to place
the MRF89XAM9A module inside a finished product
and not require regulatory testing for an intentional
radiator (RF transmitter), provided no changes or
modifications are made to the module circuitry.
Changes or modifications could void the user’s
authority to operate the equipment. The end user must
comply with all of the instructions provided by the
Grantee, which indicate installation and/or operating
conditions necessary for compliance.
The user’s manual should include the following
statement:
The integrator is still responsible for testing the end
product for any additional compliance requirements
required with this module installed (digital device
emission, PC peripheral requirements, etc.) in the
specific country that the end device will be marketed.
For more information on details on regulatory
compliance, refer to the specific country radio
regulations in the following sections.
3.1
United States
The
MRF89XAM9A
has
received
Federal
Communications
Commission
(FCC)
CFR47
Telecommunications, Part 15 Subpart C “Intentional
Radiators” 15.247 and 15.249 and modular approval in
accordance with FCC Public Notice DA 00-1407
Released: June 26, 2000, Part 15 Unlicensed Modular
Transmitter Approval. The MRF89XAM9A module can
be integrated into a finished product without obtaining
subsequent and separate FCC certification.
The MRF89XAM9A module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring
to the enclosed module. This exterior label can use
wording as following:
3.1.1
MRF89XAM9A SETTINGS
To meet the FCC requirements, the following settings
must be observed by the integrator:
3.1.1.1
FSK Modulation
The following settings configure the MRF89XAM9A for
wideband digital modulation techniques that conform to
the requirements of Part 15.247. These settings allow
for higher radio frequency (RF) output power and
greater link budget:
• Bit Rate Setting: 50 - 200 kbps
- Transmit Power Maximum Setting:
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 17
MRF89XAM9A
3.1.1.2
OOK Modulation
The following settings configure the MRF89XAM9A for
narrowband operation that conform to the requirements
of Part 15.249. Part 15.249 requires a much lower
power setting than is allowed in Part 15.247. These settings are good for applications that require lower transmit power current consumption and shorter transmit
distances:
• Transmit Power Maximum Setting:
DS00000A-page 18
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
3.2
Canada
3.2.1
The MRF89XAM9A module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Specification (RSS) RSS-210 and RSS-Gen. Modular
approval permits the installation of a module in a host
device without the need to recertify the device.
Labeling Requirements for the Host Device (from
Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the
module within the host device.
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains
transmitter module”, or the word “Contains”, or similar
wording expressing the same meaning, as follows:
MRF89XAM9A SETTINGS
To meet Industry Canada (IC) requirements, the
following settings must be observed by the integrator:
3.2.1.1
FSK Modulation
The following settings configure the MRF89XAM9A for
wideband digital modulation techniques that conform to
the requirements of RSS-210 Issue 8 Annex 8. These
settings allow for higher radio frequency (RF) output
power and greater link budget.
• Bit Rate Setting: 50 - 200 kbps
- Transmit Power Maximum Setting:
User Manual Notice for License-Exempt Radio
Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010):
User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a
conspicuous location in the user manual or
alternatively on the device or both.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 19
MRF89XAM9A
NOTES:
DS00000A-page 20
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
4.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. -40°C to +85°C
Storage temperature .............................................................................................................................. -55°C to +125°C
Voltage on VIN with respect to VSS ................................................................................................................ -0.3V to 6V
Voltage on any combined digital and analog pin with respect to VSS (except VIN) ...........................-0.3V to (VIN + 0.3V)
Input current into pin (except VIN and VSS)........................................................................................... -25 mA to 25 mA
Electrostatic discharge with human body model .................................................................................................... 1000V
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 21
MRF89XAM9A
TABLE 4-1:
RECOMMENDED OPERATING CONDITIONS
Parameter
Min
Typ
Max
Unit
Condition
Ambient Operating Temperature
-40
—
+85
°C
—
Supply Voltage for RF, Analog and Digital Circuits
2.1
—
3.6
—
Supply Voltage for Digital I/O
2.1
—
3.6
—
Input High Voltage (VIH)
0.5 * VIN
—
VIN + 0.3
—
Input Low Voltage (VIL)
-0.3V
—
0.2 * VIN
—
—
VIN + 1.5
—
AC Peak Voltage on Open Collector Outputs (IO)(1) VIN – 1.5
Note 1:
At minimum, VIN – 1.5V should not be lower than 1.8V.
TABLE 4-2:
Symbol
CURRENT CONSUMPTION
Chip Mode
Min
Typ
Max
Unit
Condition
IDDSL
Sleep
—
0.1
µA
Sleep clock disabled, all blocks
disabled
IDDST
Idle
—
65
80
µA
Oscillator and baseband enabled
IDDFS
Frequency Synthesizer
—
1.3
1.7
mA
Frequency synthesizer running
IDDTX
Tx
—
—
25
16
30
21
mA
mA
Output power = +10 dBm
Output power = +1 dBm(1)
Rx
—
3.0
3.5
mA
—
IDDRX
Note 1:
Guaranteed by design and characterization.
DIGITAL I/O PIN INPUT SPECIFICATIONS(1)
TABLE 4-3:
Symbol
Characteristic
Min
Typ
Max
Unit
Condition
VIL
Input Low Voltage
—
—
0.2 * VIN
—
VIH
Input High Voltage
0.8 * VIN
—
—
—
-0.5
—
0.5
µA
VIL = 0V
IIL
Input Low Leakage
Current(2)
IIH
Input High Leakage Current
-0.5
—
0.5
µA
VIH = VIN, VIN = 3.7
VOL
Digital Low Output Voltage
—
—
0.1 * VIN
—
IOL = 1 mA
Digital Low Output
0.9 * VIN
—
—
IOH = -1 mA
VOH
Note 1:
2:
Measurement Conditions: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise
specified.
Negative current is defined as the current sourced by the pin.
DS00000A-page 22
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
TABLE 4-4:
Symbol
PLL PARAMETERS AC CHARACTERISTICS(1)
Parameter
Min
Typ
Max
Unit
Condition
Frequency Ranges
902
—
928
MHz
—
BRFSK
Bit Rate (FSK)
1.56
—
40
kbps
NRZ
BROOK
Bit Rate (OOK)
1.56
—
16
kbps
NRZ
FDFSK
Frequency Deviation (FSK)
33
50
200
kHz
—
FXTAL
Crystal Oscillator Frequency
12.8
—
MHz
—
FSSTP
Frequency Synthesizer Step
—
—
kHz
Variable, depending on the
frequency
TSOSC
Oscillator Wake-up Time
—
1.5
ms
From Sleep mode(1)
Frequency Synthesizer Wakeup Time; at most, 10 kHz
away from the target
—
500
800
µs
From Stand-by mode
Frequency Synthesizer Hop
Time; at most, 10 kHz away
from the target
—
180
—
µs
200 kHz step
—
200
—
µs
1 MHz step
—
250
—
µs
5 MHz step
FRO
TSFS
TSHOP
Note 1:
—
260
—
µs
7 MHz step
—
290
—
µs
12 MHz step
—
320
—
µs
20 MHz step
—
340
—
µs
27 MHz step
Guaranteed by design and characterization.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 23
MRF89XAM9A
RECEIVER AC CHARACTERISTICS(1)
TABLE 4-5:
Symbol
RSF
RSO
Parameter
Min
Typ
Max
Unit
Condition
Sensitivity (FSK)
—
-107
—
dBm
915 MHz, BR = 25 kbps,
fdev = 50 kHz, fc = 100 kHz
—
-103
—
dBm
915 MHz, BR = 66.7 kbps,
fdev = 100 kHz, fc = 200 kHz
—
-113
—
dBm
915 MHz, 2 kbps NRZ
fc – fo = 50 kHz, fo = 50 kHz
—
-106
—
dBm
915 MHz, 16.7 kbps NRZ
fc – fo = 100 kHz, fo = 100 kHz
Sensitivity (OOK)
CCR
Co-Channel Rejection
—
-12
—
dBc
Modulation as wanted signal
ACR
Adjacent Channel Rejection
—
27
—
dB
Offset = 300 kHz, unwanted tone is
not modulated
—
52
—
dB
Offset = 600 kHz, unwanted tone is
not modulated
—
57
—
dB
Offset = 1.2 MHz, unwanted tone is
not modulated
—
-48
—
dBm
Offset = 1 MHz, unmodulated
—
-37
—
dBm
Offset = 2 MHz, unmodulated, no
SAW
—
-33
—
dBm
Offset = 10 MHz, unmodulated, no
SAW
BI
Blocking Immunity
RXBWF
Receiver Bandwidth in FSK
Mode(2)
50
—
250
kHz
Single side BW, Polyphase Off
RXBWU
Receiver Bandwidth in OOK
Mode(2)
50
—
400
kHz
Single side BW, Polyphase On
Input Third Order Intercept
Point
—
-28
—
dBm
Interferers at 1 MHz and 1.950 MHz
offset
Receiver Wake-up Time
—
280
500
µs
From FS to Rx ready
TSRWS
Receiver Wake-up Time
—
600
900
µs
From Stand-by to Rx ready
TSRHOP
Receiver Hop Time from Rx
Ready to Rx Ready with a
Frequency Hop
—
400
—
µs
200 kHz step
—
400
—
µs
1 MHz step
—
460
—
µs
5 MHz step
—
480
—
µs
7 MHz step
—
520
—
µs
12 MHz step
—
550
—
µs
20 MHz step
—
600
—
µs
27 MHz step
RSSI Sampling Time
—
—
1/fdev
From Rx ready
RSSI Dynamic Range
—
70
—
dB
Ranging from sensitivity
ITP3
TSRWF
RSSIST
RSSTDR
Note 1:
2:
Guaranteed by design and characterization.
This reflects the whole receiver bandwidth, as described by conditions for active and passive filters.
DS00000A-page 24
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
TABLE 4-6:
Symbol
RFOP
TRANSMITTER AC CHARACTERISTICS(1)
Description
Min
Typ
Max
Unit
Condition
RF Output Power, Programmable
with 8 Steps of typ. 3 dB
—
+12.5
—
dBm
Maximum power setting
—
-8.5
—
dBm
Minimum power setting
Phase Noise
—
-112
—
dBc/Hz
Measured with a 600 kHz
offset at the transmitter output
Transmitted Spurious
—
—
-47
dBc
At any offset between 200 kHz
and 600 kHz, unmodulated
carrier, fdev = 50 kHz
PN
TXSP
Tx2
Second Harmonic
Tx3
Third Harmonic
Tx4
Fourth Harmonic
Txn
Harmonics above Tx4
No modulation, see Note(2)
—
—
-40
dBm
FSKDEV
FSK Deviation
±33
±55
±200
kHz
Programmable
TSTWF
Transmitter Wake-up Time
—
120
500
µs
From FS to Tx ready
TSTWS
Transmitter Wake-up Time
—
600
900
µs
From Stand-by to Tx ready
Note 1:
2:
4.1
Guaranteed by design and characterization.
Transmitter in-circuit performance with SAW filter and crystal.
Timing Specification and Diagram
TABLE 4-7:
SPI TIMING SPECIFICATION(1,2)
Parameter
Min
Typ
Max
Unit
Condition
SPI Configure Clock Frequency
—
—
MHz
—
SPI Data Clock Frequency
—
—
MHz
—
Data Hold and Setup Time
—
—
µs
—
SDI Setup Time for SPI Configure
250
—
—
ns
—
SDI Setup Time for SPI Data
312
—
—
ns
—
CSCON Low to SCK Rising Edge;
SCK Falling Edge to CSCON High
500
—
—
ns
—
CSDATA Low to SCK Rising Edge;
SCK Falling Edge to CSDATA High
625
—
—
ns
—
CSCON Rising to Falling Edge
500
—
—
ns
—
CSDATA Rising to Falling Edge
625
—
—
ns
—
Note 1:
2:
Typical Values: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified.
Negative current is defined as the current sourced by the pin.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 25
MRF89XAM9A
NOTES:
DS00000A-page 26
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
APPENDIX A:
REVISION HISTORY
Revision A (May 2011)
This is the Initial release of the document.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 27
MRF89XAM9A
NOTES:
DS00000A-page 28
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
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Users of Microchip products can receive assistance
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•
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•
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CUSTOMER CHANGE NOTIFICATION
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Microchip’s customer notification service helps keep
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To register, access the Microchip web site at
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registration instructions.
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 29
MRF89XAM9A
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
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Please list the following information, and use this outline to provide us with your comments about this document.
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Application (optional):
Would you like a reply?
Device: MRF89XAM9A
Literature Number: DS00000A
Questions:
1. What are the best features of this document?
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3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
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6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS00000A-page 30
Preliminary
© 2011 Microchip Technology Inc.
MRF89XAM9A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
PART NO
Device
Example:
Module Module
Type
-X
Tape and Temperature
Reel
Range
Device
MRF89XAM9A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz
Transceiver module
Temperature
Range
a)
MRF89XAM9A-I/RM: Industrial temperature
tray.
b)
MRF89XAM9AT-I/RM: Industrial temperature
tape and reel,
= -40ºC to +85ºC (Industrial)
© 2011 Microchip Technology Inc.
Preliminary
DS00000A-page 31
Worldwide Sales and Service
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02/18/11
DS00000A-page 32
© 2011 Microchip Technology Inc.

---

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