Microchip Technology RN42 RN-42 User Manual Device Features

Microchip Technology Inc. RN-42 Device Features

(RN-42) User Manual_20100415

RN-42 Specification CONTENTS RN-42 Specification...............................................................................................................................1 Type： Release.........................................................................................................................1 Document： RN-42-001................................................................................................................... 1 Version： 1.0.................................................................................................................................1 Release Date： Jan 08, 2010................................................................................................................ 1 Release Record ...................................................................................................................................... 1 Device Features .....................................................................................................................................2 Description.............................................................................................................................................2 Application.............................................................................................................................................3 1Ordering Information ...................................................................................................................5 2Key Features ..................................................................................................................................5 3Block Diagram ...............................................................................................................................5 4Electrical Characteristic ...............................................................................................................6 4.1 Absolute Maximum ratings ......................................................................................................6 4.2 Recommend operation conditions ...........................................................................................6 4.3 Electrica Characteristics ..........................................................................................................6 4.4 Radio characteristics .................................................................................................................7 4.5 Digital I/O characteristics .........................................................................................................7 5Mechanical Dimensions ................................................................................................................8 6Pin Definition Descriptions ...........................................................................................................9 7Design Concerns ..........................................................................................................................12 7.1 Reset circuit .............................................................................................................................12 7.2 Factory reset PIO4 ..................................................................................................................12 7.3 Connection status ....................................................................................................................12 7.4 HCI mode .................................................................................................................................12 7.5 Using SPI bus for flash upgrade ............................................................................................12 7.6 Minimizing radio interface .....................................................................................................13 7.7 Soldering reflow profile ..........................................................................................................13 8Reference Application Schematic ..............................................................................................14 9SMT Reflow Profile .....................................................................................................................15 9.1 Reliability solder temperature chart: ....................................................................................15 9.2 Reflow temperature chart: .....................................................................................................15 Flaircomm Technologies Confidential 4
RN-42 Specification 4 Electrical Characteristic 4.1 Absolute Maximum ratings Rating Minimum Maximum Store temperature -40℃ +120℃ Operation temperature -40℃ +85℃ Power Supply -0.4 Volt DC 3.6Volt 4.2 Recommend operation conditions Rating Minimum Type Maximum Store temperature -40℃ +25℃ +85℃ Operation temperature -20℃ +25℃ +70℃ Power Supply - DC 3.3Volt DC 3.6Volt 4.3 Electrica Characteristics Parameter Min Typ. Max UnitSupply Voltage (DC) 3.0 3.3 3.6 V RX Supply Current 35 60 mA TX Supply Current 65 100 mA Average power consumption Standby/Idle (default settings) 25 mA Connected (normal mode) 30 mA Connected (low power Sniff) 8 mA Standby/Idle (Deep sleep enabled) 250uA 2.5 mA Flaircomm Technologies Confidential 6
RN-42 Specification 4.4 Radio characteristics Freq.(GHz)Bluetooth Specification Parameter Min Typ Max Units2.402 - -80 -86 dBm 2.442 - -80 -86 dBm Sensitivity @ 0.1%BER <=-70 2.480 - -80 -86 dBm 2.402 5.0 6.0 dBm 2.442 5.0 6.0 dBm RF Transmit Power <=6 2.480 5.0 6.0 dBm 2.402 - 5 75 kHz 2.442 - 5 75 kHz Initial Carrier Frequency Tolerance 75 2.480 - 5 75 kHz 20dB bandwidth for modulated carrier - 900 1000 <=1000 kHz Drift (Five slots packet) - 15 - 40 kHz Drift Rate - 13 - 20 kHz 2.402 140 165 175 kHz 2.442 140 165 175 kHz △f1avg Max Modulation >140 2.480 140 165 175 kHz 2.402 140 190 - kHz 2.442 140 190 - kHz △f2avg Min Modulation 115 2.480 140 190 - kHz 4.5 Digital I/O characteristics 2.7V<=VDD<=3.0V Min Typ. Max. Unit Input logic level LOW -0.4 - +0.8 V Input logic level HIGH 0.7VDD - VDD+0.4 V Output logic level LOW - - 0.2 V Output logic level HIGH VDD-0.2 - - V All I/O’s (except reset) default to weak pull down +0.2 +1.0 +5.0 uA Flaircomm Technologies Confidential 7
RN-42 Specification 5 Mechanical Dimensions Flaircomm Technologies Confidential 8
RN-42 Specification 6 Pin Definition Descriptions Flaircomm Technologies Confidential 9
RN-42 Specification Pin Name Description Default 1 GND 2 SPI MOSI Programming only No Connect Input to RN42with weak pull down 3 PIO6 Set BT master (HIGH=auto-master mode) Set Baud rate (HIGH = force 9600, LOW = 115K or firmware setting) Input to RN42 with weak pull down 4 PIO7 Input to RN42 with 1K pull up 5 RESET Active LOW reset 6 SPI_CLK Programming only No Connect 7 PCM_CLK PCM interface No Connect 8 PCM_SYNC PCM interface No Connect 9 PCM_IN PCM interface No Connect 10 PCM_OUT PCM interface No Connect 11 VDD 3.3V regulated power input 12 GND 13 UART_RX UART receive Input Input to RN42 High level output from RN42 14 UART_TX UART transmit output UART RTS, goes HIGH to disable host transmitter 15 UART_RTS Low level output from RN4216 UART_CTS UART CTS, if set HIGH, disables transmitter Low level input to RN42 17 USB_D+ USB port Pull up 1.5K when active 18 USB_D- USB port 19 PIO2 Status, HIGH when connected, LOW otherwise Output from RN42 Input to RN42 with weak pull down 20 PIO3 Auto discovery = HIGH 21 PIO5 Status, toggles based on state, LOW on connect Output from RN42 Input to RN42 with weak pull down 22 PIO4 Set factory defaults 23 SPI_CSB Programming only No Connect 24 SPI_MISO Programming only No Connect 25 GND 26 NC RF pad keep all traces and planes clear. 27 GND 28 GND 29 GND 30 AIO0 Optional analog input Not Used 31 PIO8 Status (RF data rx/tx) Output from RN42 Flaircomm Technologies Confidential 10
RN-42 Specification Input to RN42 with weak pull down 32 PIO9 IO Input to RN42 with weak pull down 33 PIO10 IO (remote DTR signal) Input to RN42 with weak pull down 34 PIO11 IO (remote RTS signal ) 35 AIO1 Optional analog input Not Used Flaircomm Technologies Confidential 11
RN-42 Specification 7 Design Concerns 7.1 Reset circuit RN-42 contains a 1k pull up to VCC, the polarity of reset on the RN42 is ACTIVE LOW. A power on reset circuit with delay is OPTIONAL on the reset pin of the module. It should only be required if the input power supply has a very slow ramp, or tends to bounce or have instability on power up. Often a microcontroller or embedded CPU IO is available to generate reset once power is stable. If not, there are many low cost power supervisor chips available, such as MCP809, MCP102/121, and Torex XC61F. 7.2 Factory reset PIO4 It is a good idea to connect this pin to a switch, or jumper, or resistor, so it can be accessed. This pin can be used to reset the module to FACTORY DEFAULTS and is often critical in situations where the module has been mis-configured. To set Factory defaults start HIGH, then toggle times. 7.3 Connection status PIO5 is available to drive an LED, and blinks at various speeds to indicate status. PIO2 is an output which directly reflects the connection state, it goes HIGH when connected, and LOW otherwise. 7.4 HCI mode The RN42 module must be loaded with special firmware to run in HCI mode. When in HCI mode the standard SPP/DUN applications are disabled. 7.5 Using SPI bus for flash upgrade While not required, this bus is very useful for configuring advanced parameters of the Bluetooth modules, and is required for upgrading the firmware on modules. The suggested ref-design shows a 6pin header which can be implemented to gain access to this bus. A minimum-mode version could just use the SPI signals (4pins) and pickup ground and VCC from elsewhere on the design. Flaircomm Technologies Confidential 12
RN-42 Specification 7.6 Minimizing radio interface When laying out the carrier board for the RN42 module the areas under the antenna and shielding connections should not have surface traces, GND planes, or exposed vias. (See diagram to right) For optimal radio performance the antenna end of RN42 module should protrude 5mm past any metal enclosure. 7.7 Soldering reflow profile z Lead-Free Solder Reflow z Temp: 230 degree C, 30-40 seconds, Peak 250 degree C maximum. z Preheat temp: 165 +- 15 degree C, 90 to 120 seconds. z Time: Single Pass, One Time Flaircomm Technologies Confidential 13
RN-42 Specification 9 SMT Reflow Profile 9.1 Reliability solder temperature chart: 9.2 Reflow temperature chart: Flaircomm Technologies Confidential 15
Compliance Information FCC Compliance Statement: This device complies with Part 15 of the FCC Rules . Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. This device must accept any interference received, including interference that may cause undesired operation. Product that is a radio transmitter is labeled with FCC ID. FCC Caution: (1) Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. (2) Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment. (3) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. (4) Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user authority to operate the equipment. (5) Outdoor Operations in the 5.15~5.25GHz band is prohibited. NOTE: (1) This device is approved for OEM installation with specified antennas as listed in this Manual. It is the responsibility of the Installer to comply with the separation distance for satisfying RF exposure compliance. (2) This device only could work when being installed into “client devices” which could not transmit automatically, such as Notebook P.C. , with the software driver limit. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
IC Radiation Exposure Statement for Canada This equipment complies with IC radiation exposure limits set forth for an uncontrolled enviroment. To maintain compliance with IC RF exposure compliance requirements, Please avoid direct contact to the transmitting. End users must follow the specific operating instructions for satisfying RF Exposure compliance. Caution: The device is incapable of transmitting in the band 5600-5650 MHz band in Canada.

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