Motorola Mobility T56KL1 Cellular/ PCS WCDMA/ GSM/ EDGE Transceiver Module User Manual H24 Cell Engine Module Description

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Document Description	Exhibit 8 Users Manual
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Date Submitted	2009-08-07 00:00:00
Date Available	2010-02-03 00:00:00
Creation Date	2009-05-31 06:10:00
Producing Software	Acrobat Distiller 8.1.0 (Windows)
Document Lastmod	2009-07-30 12:13:59
Document Title	H24 Cell Engine Module Description
Document Creator	FrameMaker 8.0
Document Author:	Motorola

Technical Information
Motorola H24 Developer’s Guide
Module Hardware Description
MAY 15, 2009
6802986C38-B
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Motorola, Inc. assumes no liability resulting
from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this
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inaccuracies or omissions. Motorola, Inc. reserves the right to make changes to any products described herein and reserves the
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VENDOR COPYRIGHT
Apache Software Foundation Copyright 2004-2005 All Rights Reserved
Usage and Disclosure Restrictions
License Agreements
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High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed,
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© Copyright 2009 Motorola, Inc.
REV052604
Table of Contents
Manual Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
Target Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
Manual Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
Applicable Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
Regulatory Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii
Regulatory Statement (Safety). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii
FCC Notice to Users . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii
Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ix
Antenna and Transmission Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ix
Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
Contact Us . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xi
Text Conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xi
Field Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii
General Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii
Caring for the Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiv
Limitation of Liability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
Warranty Notification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
How to Get Warranty Service? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xvi
Claiming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xvi
Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
What is Not Covered by the Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
Installed Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xviii
Out of Warranty Repairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xviii
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xix
Chapter 1:
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Regulatory Approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
CFR 47 Part 15.19 specifies label requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
CFR 47 Part 15.21 Information to user . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
CFR 47 Part 15.105 Information to the user . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter 2:
Hardware Interface Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Digital Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Analog Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
RF Transceiver Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
WCDMA Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
GPS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
GSM Transceiver Block. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power Supply Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power On/Off Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
May 15, 2009
H24 - Module Hardware Description
Table of Contents
Turning the H24 On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Power Supply Turn-on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Turning the H24 On Using ON_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Turning the H24 On Using IGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Turning the H24 Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Turning the H24 Off Using ON_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Turning the H24 Off Using IGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Power Loss shut down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Turning the H24 Off Using AT+MPWRDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Low Power Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Activating Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Serial Interface During Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Terminating Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Temporary Termination of Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
UART Exiting of Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Serial Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Primary UART (UART1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Secondary UART (UART2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SIM Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SIM Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Handset Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Headset Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Interface to an External Speaker Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Audio Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Analog Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Digital Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Voiceband Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
A/D Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Temperature A/D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
General Purpose A/D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Controls and Indicators Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
VREF Reference Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
OFF Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Active Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Wakeup Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Antenna Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
GPRS/EGPRS - WCDMA/HSDPA Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Transmission Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
General Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Antenna Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Chapter 3:
Electrical and Environmental Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Application Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Chapter 4:
Mechanical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Board Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
ii
H24 - Module Hardware Description
May 15, 2009
Table of Contents
Interface Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
MMCX Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
U.FL Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
H24 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Chapter 5:
Service and Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Who to Contact? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Required Query Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Acronyms and Abbreviations
Index
May 15, 2009
H24 - Module Hardware Description
iii
Table of Contents
iv
H24 - Module Hardware Description
May 15, 2009
List of Figures
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
2-15
2-16
2-17
2-18
H24 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
RF Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Transmission Power Drops. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Power Supply Turn-on and Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CTS Signal During Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
WKUPI_N Signal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Serial Interface Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
UART1 Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
UART2 Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
USB Interface Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
H24 Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Handset Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Headset Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
External Speaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Voiceband Mode PCM Bus Coding Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Temperature A/D Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
WKUPO_N Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
TXEN_N Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4-1
4-2
4-3
4-4
4-5
4-6
4-7
4-8
H24 Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
H24 Interface Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mating Connector Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MMCX Connector Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Optional MMCX Cable Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
U.FL Connector Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
U.FL Mating Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
H24 Mounting Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
May 15, 2009
H24 - Module Hardware Description
51
52
53
54
55
56
57
59
List of Tables
1-1
Product Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
3-1
3-2
3-3
H24 Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Power Supply Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
H24 Operation Mode Current Consumption -GSM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WCDMA current draw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSDPA current draw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Audio modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A/D Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Controls and Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VREF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Environmental Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
14
15
16
16
16
27
33
35
37
38
41
43
44
46
4-1
4-2
4-3
4-4
H24 interface connector options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interface Connector Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
U.FL Connector Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
52
52
54
56
May 15, 2009
H24 - Module Hardware Description
vi
Preface
Manual Scope
This manual provides the electrical, mechanical and environmental requirements for properly
integrating the H24 module in a host application.
This manual gives a complete set of hardware features and functions that may be provided by
H24. The availability of any feature or function, which is described in this manual, depends on
the hardware revision and software version of a specific H24 model.
The parameters and values provided in this manual are defined under typical conditions. These
values may vary when subject to different conditions, such as SW version, network status,
application settings and environmental conditions.
Target Audience
This manual is intended for all members of the integration team who are responsible for
integrating the H24 module into the host OEM device, including representatives from hardware,
software and RF engineering disciplines.
Manual Organization
This manual contains the following chapters:
• Chapter 1 —introduces the H24 unit and provides important safety instructions.
• Chapter 2 —provides a detailed hardware description of the blocks and components
comprising the H24.
• Chapter 3 —describes the pin assignments for H24 connectors.
• Chapter 4 —describes H24 mechanical specifications and requirements.
• Chapter 5 —provides contact information for Motorola Service Support and Customer
Assistance.
Applicable Documents
• H24/G24 Developer's Kit - 6802986C39
• H24 AT Commands - 6802986C37
May 15, 2009
H24 - Module Hardware Description
vii
Regulatory Requirements
Regulatory Requirements
The Federal Communications Commission (FCC) requires application for certification of digital
devices in accordance with CFR Title 47, Part 2 and Part 15. This includes MPE calculation. As
the H24 modem is not a standalone transceiver but is an integrated module, the H24 cannot be
tested by itself for EME certification. It is, however, the integrator’s responsibility to have the
completed device tested for EME certification.
Caution:
Unauthorized repairs or modifications could result in permanent damage to the
equipment and void your warranty and your authority to operate this device under
Part 15 of the FCC Rules.
Regulatory Statement (Safety)
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating the H24 module. Manufacturers
of the cellular terminal are advised to convey the following safety information to users and
operating personnel, and to incorporate these guidelines into all manuals supplied with the
product. Failure to comply with these precautions violates safety standards of design,
manufacture and intended use of the product. Motorola assumes no liability for customer failure
to comply with these precautions.
• The H24 should not be assembled when voltage is supplied to the 70 pin connector
• The H24 must be operated at the voltages described in the technical documentation
• The H24 must not be mechanically nor electrically changed. Use of connectors should follow
the guidance of the technical documentation
• The H24 is designed to meet the EMC requirements of ETS 300342
• When integrating the H24 into a system, Motorola recommends testing the system to
ETS300342-1
• You must not remove any label from the H24
• Systems using the H24 are subject to mandatory EMC testing under directive 89/336/EEC
(to://www.newapproach.org/Directives/). Other directives, such as the LVD directive
73/23/EE, may also apply to a system using the H24 module
FCC Notice to Users
Motorola has not approved any changes or modifications to this device by the user. Any changes
or modifications could void the user's authority to operate the equipment. See 47 CFR Sec. 15.21.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation. See 47 CFR
Sec. 15.19(3).
If your mobile device or accessory has a USB connector, or is otherwise considered a computer
peripheral device whereby it can be connected to a computer for purposes of transferring data,
then it is considered a Class B device and the following statement applies:
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can
viii
H24 - Module Hardware Description
May 15, 2009
Preface
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Precautions
Interface connector and some of the module circuits are not shielded. Be sure to take appropriate
precautionary measures in order to avoid ESD while handling the module. ESD can damage the
H24 modules. Integrators need to design ESD protection on all external interfaces.
Antenna and Transmission Safety Precautions
User Operation
Do not operate your unit when a person is within 8 inches (20 centimeters) of the antenna. A
person or object within 8 inches (20 centimeters) of the antenna could impair call quality and may
cause the phone to operate at a higher power level than necessary.
May 15, 2009
Important:
The unit must be installed in a manner that provides a minimum separation distance
of 20 cm or more between the antenna and persons and must not be co-located or
operate in conjunction with any other antenna or transmitter to satisfy FCC RF
exposure requirements for mobile transmitting devices.
Important:
To comply with the FCC RF exposure limits and satisfy the categorical exclusion
requirements for mobile transmitters, the requirements described in the following
section, “Antenna Installation” , must be met.
H24 - Module Hardware Description
ix
Standards
Antenna Installation
• The antenna installation must provide a minimum separation distance of 20 cm from users
and nearby persons and must not be co-located or operating in conjunction with any other
antenna or transmitter.
• Antenna installation should be done by a professional installer and should meet all FCC
requirement as given in FCC part 15.
• The combined cable loss and antenna gain must not exceed +4.3 dBi (850 band). The
combined cable loss and antenna gain must not exceed +2.55 dBi and total system output
must not exceed 2.0W EIRP in the PCS (1900) band in order to comply with the EIRP limit
of 24.232 (b). OEM installers must be provided with antenna installation instruction and
transmitter operating conditions for satisfying RF exposure compliance.
Section 15.203 - Antenna Requirements
An intentional radiator shall be designed to ensure that no antenna other than that furnished by the
responsible party shall be used with the device. The use of a permanently attached antenna or of
an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to
comply with the provisions of this Section. The manufacturer may design the unit so that a
broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical
connector is prohibited. This requirement does not apply to carrier current devices or to de-vices
operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this
requirement does not apply to intentional radiators that must be professionally installed, such as
perimeter protection systems and some field disturbance sensors, or to other intentional radiators
which, in accordance with Section 15.31(d), must be measured at the installation site. However,
the installer shall be responsible for ensuring that the proper antenna is employed so that the
limits in this Part are not exceeded.
Standards
Electromagnetic Compatibility: Principles and Applications by David A Weston, published by
Marcel Dekker, Inc., 270 Madison Avenue, New York, NY 10016 USA.
GSM 07.07 - prETS 300 916, Digital cellular telecommunication system (Phase 2+); AT
command set for GSM Mobile Equipment (ME), Version 5.2.0 or higher, Reference
RE/SMG-040707QR1.
GSM 07.05, Digital cellular telecommunication system (Phase 2+); Use of Data Terminal
Equipment - Data Circuit terminating; Equipment (DTE-DCE) interface for Short Message
Service (SMS) and Cell Broadcast Service (CBS), Version 5.3.0, August, 1997, Reference
TS/SMG-040705QR2.
GSM 03.40, Digital cellular telecommunication system (Phase 2+); Technical realization of the
Short Message Service (SMS) Point-to-Point (PP), Version 5.3.0, July 1996, Reference
TS/SMG-040340QR2.
GSM 04.11 Digital cellular telecommunication system (Phase 2+); Point-to-Point (PP) Short
Message Service (SMS) support on mobile radio interface, Version 5.1.0, March 1996, Reference
TS/SMG-030411QR.
GSM 03.38, Digital cellular telecommunication system (Phase 2+); Alphabets and
language-specific information, Version 5.3.0, July 1996, Reference TS/SMG-040338QR2.
H24 - Module Hardware Description
May 15, 2009
Preface
GSM 11.10-1, Digital cellular telecommunication system (Phase 2); Mobile Station (MS)
Conformance specification; Part 1: Conformance specification. Draft pr ETS 300 607-1, March
1998, Reference RE/SMG-071110PR6-1.
GSM Specifications are orderable from Global Engineering Documents, 15 Inverness Way East,
Englewood, Colorado 80112-5704 USA 303-792-2181 800-624-3974.
ETSI Standard PCS - 11.10-1.
GSM 02.30 Supplementary services.
GSM 03.90 USSD stage 2.
GSM 11.14 SIM toolkit.
ITU-T V.25ter
GSM Data Adapter for Motorola Handsets, AT command reference, Rev 2, June 9 1997.
ETSI standard SMG31.
GSM 05.02.
ETSI 07.60.
ETSI 0.7.07 Ver. 7.5.0.
Contact Us
We at Motorola want to make this guide as helpful as possible. Keep us informed of your
comments and suggestions for improvements.
For general contact, technical support, report documentation errors and to order manuals, use this
email address:
M2M.CustomerCare@motorola.com
Motorola appreciates feedback from the users of our information.
Text Conventions
The following special paragraphs are used in this guide to point out information that must be read.
This information may be set-off from the surrounding text, but is always preceded by a bold title
in capital letters:
Note
Note: Presents additional, helpful, noncritical information that you can use.
Warning
Warning:
May 15, 2009
Presents information to warn you of a potentially hazardous situation in which there
is a possibility of personal injury.
H24 - Module Hardware Description
xi
Text Conventions
Important
Important:
Presents information to help you avoid an undesirable situation
or provides additional information to help you understand a topic or concept.
Caution
Caution:
xii
Presents information to identify a situation in which damage to software, stored
data, or equipment could occur, thus avoiding
the damage.
H24 - Module Hardware Description
May 15, 2009
Preface
Field Service
For Field Service requests, use this email address:
n2csfs01@motorola.com
General Safety
Remember!. . . safety depends on you!
The following general safety precautions must be observed during all phases of operation,
service, and repair of the equipment described in this manual. Failure to comply with these
precautions or with specific warnings elsewhere in this manual violates safety standards of
design, manufacture, and intended use of the equipment. Motorola, Inc. assumes no liability for
the customer’s failure to comply with these requirements. The safety precautions listed below
represent warnings of certain dangers of which we are aware. You, as the user of this product,
should follow these warnings and all other safety precautions necessary for the safe operation of
the equipment in your operating environment.
Ground the instrument
To minimize shock hazard, the equipment chassis and enclosure must be connected to an
electrical ground. If the equipment is supplied with a three-conductor AC power cable, the power
cable must be either plugged into an approved three-contact electrical outlet or used with a
three-contact to two-contact adapter. The three-contact to two-contact adapter must have the
grounding wire (green) firmly connected to an electrical ground (safety ground) at the power
outlet. The power jack and mating plug of the power cable must meet International
Electrotechnical Commission (IEC) safety standards.
Note: Refer to “Grounding Guideline for Cellular Radio Installations”–Motorola part no.
68P081150E62.
Do not operate in an explosive atmosphere
Do not operate the equipment in the presence of flammable gases or fumes. Operation of any
electrical equipment in such an environment constitutes a definite safety hazard.
Do not service or adjust alone
Do not attempt internal service or adjustment unless another person, capable of rendering first aid
is present.
Keep away from live circuits
Operating personnel must:
• not remove equipment covers. Only Factory Authorized Service Personnel or other qualified
maintenance personnel may remove equipment covers for internal subassembly, or
component replacement, or any internal adjustment
May 15, 2009
H24 - Module Hardware Description
xiii
Caring for the Environment
• not replace components with power cable connected. Under certain conditions, dangerous
voltages may exist even with the power cable removed
• always disconnect power and discharge circuits before touching them
Do not substitute parts or modify equipment
Because of the danger of introducing additional hazards, do not install substitute parts or perform
any unauthorized modification of equipment. Contact Motorola Warranty and Repair for service
and repair to ensure that safety features are maintained.
Dangerous procedure warnings
Warnings, such as the example below, precede potentially dangerous procedures throughout this
manual. Instructions contained in the warnings must be followed. You should also employ all
other safety precautions that you deem necessary for the operation of the equipment in your
operating environment.
Warning example:
Warning:
Dangerous voltages, capable of causing death, are present in this equipment. Use
extreme caution when handling, testing,
and adjusting.
Caring for the Environment
The following information is provided to enable regulatory compliance with the European Union
(EU) Directive 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) when using
Motorola equipment in EU countries.
Disposal of Motorola equipment in EU countries
Please do not dispose of Motorola equipment in landfill sites.
In the EU, Motorola in conjunction with a recycling partner will ensure that equipment is
collected and recycled according to the requirements of EU environmental law.
Please contact the Customer Network Resolution Center (CNRC) for assistance. The 24 hour
telephone numbers are listed at
http://mynetworksupport.motorola.com
Select Customer Network Resolution Center contact information.
Alternatively if you do not have access to CNRC or the internet, contact the Local Motorola
Office.
xiv
H24 - Module Hardware Description
May 15, 2009
Preface
Disposal of Motorola equipment in non-EU countries
In non-EU countries, dispose of Motorola equipment in accordance with national and regional
regulations.
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Limitation of Liability
The Products are not designed, intended, or authorized for use as components in systems intended
for surgical implant into the body; in other applications intended to support or sustain life; for the
planning, construction, maintenance, operation or use of any nuclear facility; for the flight,
navigation, communication of aircraft or ground support equipment; or in any other application in
which the failure of the Product could create a situation where personal injury or death may occur.
If CUSTOMER should use any Product or provide any Product to a third party for any such use,
CUSTOMER hereby agrees that MOTOROLA is not liable, in whole or in part, for any claims or
damages arising from such use, and further agrees to indemnify and hold MOTOROLA harmless
from any claim, loss, cost or damage arising from such use.
EXCEPT AS SPECIFICALLY STATED ABOVE, THE PRODUCTS ARE PROVIDED "AS IS"
AND MOTOROLA MAKES NO OTHER WARRANTIES EXPRESS, IMPLIED,
STATUTORY, OR OTHERWISE REGARDING THE PRODUCTS. MOTOROLA
SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY
AND FITNESS FOR A PARTICULAR PURPOSE, OR ARISING FROM A COURSE OF
DEALING OR USAGE OF TRADE.
Under no circumstances shall MOTOROLA be liable to CUSTOMER or any other party for any
costs, lost revenue or profits or for any other special, incidental or consequential damages, even if
MOTOROLA has been informed of such potential loss or damage. And in no event shall
MOTOROLA's liability to CUSTOMER for damages of any nature exceed the total purchase
price CUSTOMER paid for the Product at issue in the dispute, except direct damages resulting
from patent and/or copyright infringement, which shall be governed by the "INDEMNITY"
Section of this Agreement.
The preceding states MOTOROLA's entire liability for MOTOROLA's breach or failure to
perform under any provision of this Agreement.
Warranty Notification
Motorola guarantees to you, the original purchaser, the OEM module and accessories which you
have purchased from an authorized Motorola dealer (the "Products"), to be in conformance with
the applicable Motorola specifications current at the time of manufacture for a term of [1] year
from date of purchase of the Product(s) (Warranty Term).
May 15, 2009
H24 - Module Hardware Description
xv
How to Get Warranty Service?
You must inform Motorola of the lack of conformity to the applicable specifications of any of the
Products within a period of two (2) months from the date on which you detect a defect in
material, workmanship or lack of conformity and in any event within a term not to exceed the
Warranty Term, and must immediately submit the Product for service to Motorola's Authorized
Repair or Service Center. Motorola shall not be bound by Product related statements not directly
made by Motorola nor any warranty obligations applicable to the seller.
A list of the Motorola Call Center numbers is enclosed with this Product.
During the Warranty term, Motorola will, at its discretion and without extra charge, as your
exclusive remedy, repair or replace your Product which does not comply with this warranty; or
failing this, to reimburse the price of the Product but reduced to take into account the use you
have had of the Product since it was delivered. This warranty will expire at the end of the
Warranty Term.
This is the complete and exclusive warranty for a Motorola OEM module and accessories and in
lieu of all other warranties, terms and conditions, whether express or implied.
Where you purchase the product other than as a consumer, Motorola disclaims all other
warranties, terms and conditions express or implied, such as fitness for purpose and satisfactory
quality.
In no event shall Motorola be liable for damages nor loss of data in excess of the purchase price
nor for any incidental special or consequential damages* arising out of the use or inability to use
the Product, to the full extent such may be disclaimed by law.
This Warranty does not affect any statutory rights that you may have if you are a consumer, such
as a warranty of satisfactory quality and fit for the purpose for which products of the same type
are normally used under normal use and service, nor any rights against the seller of the Products
arising from your purchase and sales contract.
(*)including without limitation loss of use, loss of time, loss of data, inconvenience, commercial
loss, lost profits or savings.
How to Get Warranty Service?
In most cases the authorized Motorola dealer which sold and/or installed your Motorola OEM
module and original accessories will honor a warranty claim and/or provide warranty service.
Alternatively, for further information on how to get warranty service please contact either the
customer service department of your service provider or Motorola's service centers, listed in
Chapter 5.
Claiming
In order to claim the warranty service you must return the OEM module and/or accessories in
question to Motorola's Authorized Repair or Service Center in the original configuration and
packaging as supplied by Motorola. Please avoid leaving any supplementary items like SIM
cards. The Product should also be accompanied by a label with your name, address, and telephone
number; name of operator and a description of the problem.
In order to be eligible to receive warranty service, you must present your receipt of purchase or a
comparable substitute proof of purchase bearing the date of purchase. The phone should also
clearly display the original compatible electronic serial number (IMEI) and mechanic serial
number [MSN]. Such information is contained with the Product.
xvi
H24 - Module Hardware Description
May 15, 2009
Preface
You must ensure that all and any repairs or servicing is handled at all times by a Motorola
Authorized Service Center in accordance with the Motorola Service requirements
In some cases, you may be requested to provide additional information concerning the
maintenance of the Products by Motorola Authorized Service Centers only, therefore it is
important to keep a record of any previous repairs, and make them available if questions arise
concerning maintenance.
Conditions
This warranty will not apply if the type or serial numbers on the Product has been altered, deleted,
duplicated, removed, or made illegible. Motorola reserves the right to refuse free-of-charge
warranty service if the requested documentation can not be presented or if the information is
incomplete, illegible or incompatible with the factory records.
Repair, at Motorola's option, may include reflashing of software, the replacement of parts or
boards with functionally equivalent, reconditioned or new parts or boards. Replaced parts,
accessories, batteries, or boards are warranted for the balance of the original warranty time
period. The Warranty Term will not be extended. All original accessories, batteries, parts, and
OEM module equipment that have been replaced shall become the property of Motorola.
Motorola does not warrant the installation, maintenance or service of the products, accessories,
batteries or parts.
Motorola will not be responsible in any way for problems or damage caused by any ancillary
equipment not furnished by Motorola which is attached to or used in connection with the
Products, or for operation of Motorola equipment with any ancillary equipment and all such
equipment is expressly excluded from this warranty.
When the Product is used in conjunction with ancillary or peripheral equipment not supplied by
Motorola, Motorola does not warrant the operation of the Product/peripheral combination and
Motorola will not honor any warranty claim where the Product is used in such a combination and
it is determined by Motorola that there is no fault with the Product. Motorola specifically
disclaims any responsibility for any damage, whether or not to Motorola equipment, caused in
any way by the use of the OEM module, accessories, software applications and peripherals
(specific examples include, but are not limited to: batteries, chargers, adapters, and power
supplies) when such accessories, software applications and peripherals are not manufactured and
supplied by Motorola.
What is Not Covered by the Warranty
This warranty is not valid if the defects are due to damage, misuse, tampering, neglect or lack of
care and in case of alterations or repair carried out by unauthorized persons.
The following are examples of defects or damage not covered by this product warranty
1. Defects or damage resulting from use of the Product in other than its normal and customary
manner.
2. Defects or damage from misuse, access to incompatible sources, accident or neglect.
3. Defects or damage from improper testing, operation, maintenance, installation, adjustment,
unauthorized software applications or any alteration or modification of any kind.
4. Breakage or damage to antennas unless caused directly by defects in material or
workmanship.
May 15, 2009
H24 - Module Hardware Description
xvii
Installed Data
5. Products disassembled or repaired other than by Motorola in such a manner as to adversely
affect performance or prevent adequate inspection and testing to verify any warranty claim.
6. Defects or damage due to range, coverage, availability, grade of service, or operation of the
cellular system by the cellular operator.
7. Defects or damage due to moist, liquid or spills of food.
8. Control unit coil cords in the Product that are stretched or have the modular tab broken.
9. All plastic surfaces and all other externally exposed parts that are scratched or damaged due
to customer normal use.
Depending on operating conditions and your usage habits, wear and tear might take place of
components including mechanical problems related to Product housing, paint, assembly,
sub-assemblies, displays and keyboards and any accessories which are not part of the Product's
in-box configuration. The rectification of faults generated through wear and tear and the use of
consumable items like batteries beyond their Optimum Performance Time as indicated in the
product manual is considered to be your responsibility and therefore Motorola will not provide
the free Warranty repair service for these items
Installed Data
Please make and retain a note of all data you have inserted into your Product for example names,
addresses, phone numbers, user and access codes, notes etc. before submitting your Product for a
Warranty service as such data may be deleted or erased as part of the repair or service process.
Please note if you have downloaded material onto your product, these may be deleted or erased as
part of the repair process or testing process. Motorola shall not be responsible for such matters.
The repair or testing process should not affect any such material that was installed by Motorola
on your Product as a standard feature.
Out of Warranty Repairs
If you request Motorola to repair your Product any time after the Warranty term or where this
warranty does not apply due to the nature of the defect or fault, then Motorola may in its
discretion carry out such repairs subject to you paying Motorola its fees for such a repair or it may
refer you to an authorized third party to carry out such repairs.
xviii
H24 - Module Hardware Description
May 15, 2009
Preface
Revision History
Manual Number
6802986C38-B
Manual Title
H24 - Module Hardware Description
Version Information
The following table lists the manual version, date of version, and remarks about
the version.
Revision History
Version
May 15, 2009
Date Issue
Remarks
January 15, 2009
Initial Release
May 15, 2009
Minor updates throughout the manual
H24 - Module Hardware Description
xix
Revision History
xx
H24 - Module Hardware Description
May 15, 2009
Chapter 1: Introduction
The H24 is the newest member of Motorola's embedded cellular modules family.
Designed with Tri bands WCDMA & quad band GSM capabilities, which supports WCDMA
bands: B1-2100, B2-1900, B5 -850 with HSDPA capability and four GSM bands 850/900/1800/1900 MHz, with GPRS/EGPRS multislot class 12. H24 can operate on any
GSM/GPRS/EGPRS/WCDMA/HSDPA network to provide voice and data communications.
The H24 is similar to a condensed cellular phone core, which can be integrated into any system or
product that needs to transfer voice or data information over a cellular network. Thus, it
significantly enhances the system's capabilities, transforming it from a standalone, isolated
product to a powerful high-performance system with global communications capabilities.
The H24 is designed as a complete GSM/WCDMA communications solution with all the
controls, interfaces and features to support a broad range of applications:
• A powerful audio interface
• A large set of indicators and control signals
• Several advanced power-saving modes
• A variety of serial communications solutions.
All these features and interfaces are easily controlled and configured using a versatile AT
command interface that provides full control over the H24 operation.
The H24 control and indication interface extends its capabilities beyond GSM communications.
This includes an A/D and GPIO interface, and a regulated output voltage for supplying external
circuits. With these interfaces, the H24 can operate and control external applications and receive
feedback from external environment and circuits.
The H24 interface design, using a single 70 pin board-to-board connector, through which all
application interfaces are managed, facilitates fast and easy integration. It significantly shortens
the development process, and minimizes the product's time to market.
The H24 is extremely compact in size with a slim mechanical design, which makes it space
saving on the application board and easily fitted into any board design.
The advanced power supply management significantly reduces power consumption to a
necessary minimum and prolongs battery life.
May 15, 2009
H24 - Module Hardware Description
Product Specifications
Product Specifications
Important:
For safety regulations and requirements, see “Regulatory Requirements” on
page viii, “Regulatory Statement (Safety)” on page viii and “Antenna and
Transmission Safety Precautions” on page ix in “Preface” .
Note: Motorola reserves the right to change the specifications without prior notice.
Table 1-1: Product Specifications
Product Features
Operating systems:
GSM:
GSM 850/GSM 900
DCS 1800/PCS 1900
WCDMA:
B1- 2100
B2 - 1900
B5 - 850
Physical Characteristics
Size (with 3 mm connector):
45.2 x 24.4 x 5.4 mm
Mounting:
Two Ø2.4 mm holes
Weight:
10 grams
H24 - Module Hardware Description
May 15, 2009
Table 1-1: Product Specifications (Cont.)
Environmental
Operational temperature:
-30°C to +85°C
Storage temperature:
-40°C to +85°C
Performance
Operating voltage:
3.3 - 4.2 V
Current consumption:
In AT mode: TBD mA @ DRX9 (Sleep mode)
Maximum Tx output power:
GSM 850/GSM 900: Power class 4 (33 ± 2dBm)
DCS 1800/PCS 1900: Power class 1 (30 ± 2 dBm)
GSM 850/GSM 900: GPRS 4 slot up (28 ± 2 dBm)
DCS 1800/PCS 1900: GPRS 4 slot up (25 ± 2 dBm)
GSM 850/GSM 900: EGPRS 4 slot up (22 ± 2 dBm)
DCS 1800/PCS 1900: EGPRS 4 slot up (21 ± 2 dBm)
WCDMA/HSDPA
B1, B2, B5: Power class 3 (24 dBm+ 1 /-3 dB)
Interfaces
Connectors:
Single 70-pin, board-to-board
RF MMCX
RF UFL Connectors (Diversity , GPS)
SIM Card:
External USIM connectivity
1.8V/3.0 V
Serial Ports:
UART:
BR up to 4M bps (Using DM) and up to 230K bps for Data
Services
USB:
USB High-Speed device specifications, Rev. 2.0
I2C
Data Features
GPRS:
Multi-slot class 12 (4 Rx/4 Tx/5 Sum)
Max air Downlink BR 80 kbps
Coding scheme CS1-CS4
Class B
EGPRS (model dependant):
Multi-slot class 12
Max air Downlink BR 236 kbps Coding scheme
MCS1-MCS9
Class B
CSD:
Max BR 14.4 kbps
SMS:
MO/MT Text and PDU modes
Cell broadcast
Voice Features
Telephony
Digital audio
Differential analog audio lines
Vocoders
May 15, 2009
EFR/HR/FR/AMR
H24 - Module Hardware Description
Product Specifications
Table 1-1: Product Specifications (Cont.)
DTMF support
Audio control:
Echo suppression, noise suppression, side tone and gain
control
H24 - Module Hardware Description
May 15, 2009
Table 1-1: Product Specifications (Cont.)
GSM Supplementary Service
USSD Phase II
Call forwarding
Call hold, waiting and multiparty
Call diverting
Missed-call indicator
AOC
Call barring
Character Set
UTF8
UCS2
ASCII
GSM
8859-1
Control/Status Indicators
GSM/GPRS/EGPRS
coverage
Wakeup
TX enable
Reset
Antenna Detect
Features over RS232
Embedded TCP/IP stack
AT Command Set
GSM 07.05
GSM 07.07
Motorola proprietary AT commands
Accessories
Firmware data loader
Data logger
Developer Kit
May 15, 2009
H24 - Module Hardware Description
Regulatory Approvals
Regulatory Approvals
The H24 module has been tested and approved under the standards and regulations listed below:
• FCC
•
•
•
•
•
•
•
DOC
R&TTE
PTCRB
IC
CTIA
FTA
EMC
Important:
The following paragraphs must be addressed by the integrator to ensure their host is
in compliance to the H24 FCC grant and/or the FCC grant of the host device.
CFR 47 Part 15.19 specifies label requirements
The following text may be on the product, user's manual, or container.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
CFR 47 Part 15.21 Information to user
The user's manual or instruction manual for an intentional or unintentional radiator shall caution
the user that changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment. In cases where the manual is
provided only in a form other than paper, such as on a computer disk or over the Internet, the
information required by this section may be included in the manual in that alternative form,
provided the user can reasonably be expected to have the capability to access information in that
form.
CFR 47 Part 15.105 Information to the user
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the
following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
H24 - Module Hardware Description
May 15, 2009
measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
May 15, 2009
H24 - Module Hardware Description
Regulatory Approvals
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
The following paragraphs describe in details the hardware requirements for properly interfacing
and operating the H24 module.
Architecture Overview
Figure 2-1 below illustrates the primary functional components of the H24.
Figure 2-1: H24 Block Diagram
May 15, 2009
H24 - Module Hardware Description
Architecture Overview
The H24 consists of the following blocks:
Digital Block
• Micro-controller Unit (MCU) for system and user code execution.
• Digital Signal Processor (DSP) for voice and data processing.
• Serial communications interfaces.
• USB driver interface
• UART1
• UART2
• I2C
• SIM card
• Digital audio (PCM) bus interface.
• General purpose IO signals.
Analog Block
• Power Management IC (PMIC).
• Internal regulators
• 1 external regulator for customer use
• Analog audio interface management.
• Speaker, microphone
• Alert speaker
• Headset
• General purpose and dedicated A/D signals.
• A/D
• Voltage sensor
• Temperature sensor
• Real Time Clock (RTC) subsystem.
10
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
RF Transceiver Block
Figure 2-2 is a detailed RF block diagram.
P A POWER CONTR OL
GSM
PA
C OUP LE
W2 100
C OUP LE
W1 900
COUPLE
W 850
RF
MODULATOR
CPU
SSBI DATA
4xTX I Q
RF
SWITCH
SP9T
M AIN
ANLOG
RF DET
R X M AIN
INP UT
GSM R X
QUAD
SAW
RF
S WITCH
DIV
W1900
BPF
GPS
BPF
GPS
LNA
4xRX IQ_diversity
W2100
BPF
W850
BPF
GPS
4xRX IQ_ main
GPS
BPF
W2100
BPF
VC -TC XO
19.2M Hz
RF
SWITCH
W1900
BPF
Figure 2-2: RF Block Diagram
WCDMA Transceiver
• RTR6285 includes: modulator, receiver, LNAs, Mixers, VCOs, I/Q outputs and buffers for
all WCDMA bands.
• Three RF Power Amplifiers for B1-2100, B2-1900 & B5 - 850.
•
•
•
•
•
Three couplers for feedback into the Modulator for each band.
RF Switch SP9T for selecting corrected path to and from main MMCX connector.
Receive path is inside PA via internal duplexer into the RTR.
Internal LNAs for all WCDMA bands inside RTR
External switch, RF SPDT, from WB1900 & WB2100 LNA's output into one receiver's
differential input.
• Diversity path: From Diversity UFL connector via SP3T into SAW filter for WB2100,
WB1900 & WB850 fed into secondary receivers inputs inside the RTR.
GPS
• External LNA for improved GPS performances.
May 15, 2009
H24 - Module Hardware Description
11
Architecture Overview
GSM Transceiver Block
• RF power amplifier.
• 2 gain ranges for the low (850/900) and high (1800/1900) GSM bands.
• RF transceiver, which includes LNAs, Mixers, VCOs, I/Q outputs and buffers.
• Signal processing IC for transmit and receive GSM data processing.
• FEM - Front End Module.
• Includes a harmonic filter and antenna switch
• Filters - Two dual-band SAW filter that selects the required receive band and selects band
filter for low band PA input.
12
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
Operating Modes
H24 incorporates several operating modes. Each operating mode is different in the active features
and interfaces.
Table 2-1 summarizes the general characteristics of the H24 operating modes and provides
general guidelines for operation.
Table 2-1: H24 Operating Modes
Mode
Description
Features
Not Powered
VCC supply is disconnected.
The H24 is Off.
Any signals connected to the interface connector must be set low or tri-state.
Off Mode
Valid VCC supply.
RESET_N signal is enabled (low).
The H24 Interfaces are Off. Only the internal RTC timer is operating. Any signals
connected to the interface connector must be
set low or tri-stated.
Idle Mode
RESET_N signal is disabled (high).
CTS_N and DSR_N signals are enabled
(low).
The H24 is fully active, registered to the
GSM network and ready to communicate.
This is the default power-up mode.
Sleep Mode
RESET_N signal is high.
CTS_N signal is disabled.
The H24 is in low power mode.
The application interfaces are disabled, but,
H24 continues to monitor the GSM network.
CSD call or
GPRS/EGPRS
data
RESET_N signal is high.
TXEN_N signal is toggling.
A GSM voice or data call is in progress.When the call terminates, H24 returns
to the last operating state (Idle or Sleep).
CSD call or
WCDMA/HSDPA
data
RESET_N signal is high.
TXEN_N signal is toggling.
A GSM voice or data call is in progress.
When the call terminates, H24 returns to the
last operating state (Idle or Sleep).
May 15, 2009
H24 - Module Hardware Description
13
Power Supply
Power Supply
The H24 power supply must be a single external DC voltage source of 3.3V to 4.2V. The power
supply must be able to sustain the voltage level during a GSM transmit burst current surge, which
may reach 2.0A.
The H24 interface connector has 8 contacts for the main power supply, as described in Table 2-2.
All these contacts must be used for proper operation.
Table 2-2: Power Supply Signals
Pin #
Signal Name
Description
1-4
GND
Main ground connection for H24
module.
5-8
VCC
DC supply input for H24 module.
VIN = 3.3 V to 4.2 V
IMAX = 2 A during transmit
bursts
Maximum rise time: 8mS
AC ripple: +/-3%
Power Supply Design
Special care must be taken when designing the power supply of the H24. The single external DC
power source indirectly supplies all the digital and analog interfaces, but also directly supplies the
RF power amplifier (PA). Therefore, any degradation in the power supply performance, due to
losses, noises or transients, will directly affect the H24 performance.
The burst-mode operation of the GSM transmission and reception, draws instantaneous current
surges from the power supply, which causes temporary voltage drops of the power supply level.
The transmission bursts consume the most instantaneous current, and therefore cause the largest
voltage drop. If the voltage drops are not minimized, the frequent voltage fluctuations may
degrade the H24 performance.
14
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
Figure 2-3 illustrates the power supply behavior during GSM transmission.
Figure 2-3: Transmission Power Drops
Note: 1 TX slot is shown.
It is recommended that the voltage drops during a transmit burst will not exceed 300mV,
measured on the H24 interface connector. In any case, the H24 supply input must not drop below
the minimum operating level during a transmit burst. Dropping below the minimum operating
level may result in a low voltage detection, which will initiate an automatic power-off.
To minimize the losses and transients on the power supply lines, it is recommended to follow
these guidelines:
• Use a 1000 uF, or greater, low ESR capacitor on the H24 supply inputs. The capacitor should
be located as near to the H24 interface connector as possible.
• Use low impedance power source, cabling and board routing.
• Use cabling and routing as short as possible.
• Filter the H24 supply lines using filtering capacitors, as described in Table 2-3.
Table 2-3: Recommended Power Supply Filtering
Capacitor
May 15, 2009
Usage
Description
1000 uF
GSM Transmit current
serge
Minimizes power supply
losses during transmit
bursts- no more than
200mV.
Use maximum possible
value.
10 nF, 100 nF
Digital switching noise Filters digital logic noises
from clocks and data sources.
8.2 pF, 10 pF
1800/1900/2100 MHz
bands
Filters transmission EMI.
33 pF, 39 pF
850/900 MHz bands
Filters transmission EMI.
H24 - Module Hardware Description
15
Power Supply
Current Consumption
The tables below specify typical H24 current consumption ratings in various operating modes.
The current ratings refer to the overall H24 current consumption over the VCC supply.
Table 2-4: H24 Operation Mode Current Consumption -GSM
Supply Voltage
VIN[V]
Operating Mode
Total Current
[mA]
25°C
Powered OFF
SLEEP
IDLE
Full Power TX
3.2
80uA
3.8
100uA
4.2
110uA
3.2
NA
3.8
NA
4.2
NA
3.2
33.03
3.8
30.74
4.2
28.8
3.7
294
4.2
291
Note: WCDMA@24.3dbm
Table 2-5: WCDMA current draw
Supply Voltage [V]
Total Current [mA]
3.7
754
4.2
737
Remarks
Note: HSDPA@0dbm
Table 2-6: HSDPA current draw
Supply Voltage [V]
16
Total Current [mA]
3.7
290
4.2
262
H24 - Module Hardware Description
Remarks
May 15, 2009
Chapter 2: Hardware Interface Description
Power On/Off Operation
The H24 power on and off process includes two primary phases, which are indicated at the
interface connector by the hardware output signals RESET_N and CTS_N.
The RESET_N signal indicates whether H24 is powered on or off.
When this signal is enabled (low), H24 is powered-off. When it is disabled (high), H24 is
powered-on.
The CTS_N signal indicates the serial communications interface (UART) status. When this signal
is high, the H24 serial interface is disabled. When it is low, the serial interface is enabled, and
H24 is ready to communicate.
These same conditions apply to the CTS2_N signal with regards to the second serial interface
(UART2).
Important:
Do not operate the H24 out of its electrical or environmental limits. Refer to the
specifications chapter for details of these limits.
Turning the H24 On
When the H24 power supply is stable above the minimum operating level and H24 is powered
off, only the internal RTC timer is active.
When H24 is turned on, by any of the methods described below, it will first perform an automatic
internal system-test, during which basic functions are verified. The system-test duration is
typically TBD milliseconds. When the system-test has completed H24 resumes normal operation.
During the internal system-test process H24 may toggle several interface signals, which are
visible to the application. These signals do not represent any valid state or data, and should be
ignored by the customer application until the system-test has completed.
Power Supply Turn-on
When connecting the power supply for the first time, or when reconnecting it after a power
supply loss, H24 will power-on. The H24 is turned-on automatically when external power is
applied above the minimum operating level.
The H24 will power-off automatically, in case it is not powered-on by the ON_N or IGN signals,
after the internal system-test period (typically TBD) is completed.
If the ON_N or IGN signals are asserted during that period, H24 will respond accordingly and
continue to power-up normally.
The ON_N and IGN signals will be active and responding only after the power supply to the H24
is stable above the minimum operating level. Therefore, the ON_N and IGN signals must not be
used for at least 100 milliseconds after applying power to H24.
May 15, 2009
H24 - Module Hardware Description
17
Power On/Off Operation
Figure 2-4 illustrates the H24 power on and off upon application of a power supply, during which
the ON_N or IGN signals are not asserted.
Figure 2-4: Power Supply Turn-on and Off
Turning the H24 On Using ON_N
The ON_N input signal is set high by an internal pull-up resistor whenever a power supply is
applied to H24. Therefore, it is recommended to operate this signal using an open collector/drain
circuit connection.
Asserting the ON_N signal low for a minimum of 500 milliseconds (0.5 seconds) and a maximum
of 1.5 seconds will cause the H24 to turn-on.
Asserting the ON_N signal low for more than 1.5 seconds may cause the H24 to interpret the
signal as a power-off command, and turn off immediately after turning on.
Turning the H24 On Using IGN
The IGN input signal must be set low when not used. To turn on H24, this signal must be asserted
high. The IGN signal must remain high for the duration of the H24 operation. H24 powers down
when the IGN signal is returned to its low state.
Turning the H24 Off
There are several ways to turn the H24 off:
• Asserting the ON_N signal low for a minimum of 2 seconds.
• Setting the IGN signal low.
• Low power automatic shut down.
• AT command.
18
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
Turning the H24 Off Using ON_N
The ON_N signal is set high using an internal pull up resistor when power is applied to H24.
Asserting the ON_N signal low for a minimum of 2 seconds will turn H24 off. This will initiate a
normal power-off process, which includes disabling of all applications interfaces (UART, SIM
card, audio, etc.) and closing the network connection.
Turning the H24 Off Using IGN
The IGN signal may be used to power off H24 only if it was also used to power it on. When the
IGN signal is set low, H24 will turn off. This will initiate a normal power-off process, which
includes disabling of all applications interfaces (UART, SIM card, audio, etc.) and closing the
network connection.
The IGN signal will not power off H24 before 30 seconds have elapsed since H24 was
powered-on. This delay mechanism is implemented to protect H24 from unexpected transients on
the IGN line during power up, particularly when applying vehicle cranking waveforms.
Power Loss shut down
A low power shut down occurs when H24 senses the external power supply is below the minimal
operating limit. The module will respond by powering down automatically without notice.
This form of power-down is not recommended for regular use since the unexpected power loss
may result in loss of data.
Turning the H24 Off Using AT+MPWRDN
The AT+MPWRDN command initiates a H24 power down. This command emulates the ON_N
signal operation for power off.
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H24 - Module Hardware Description
19
Low Power Mode
Low Power Mode
The H24 incorporates an optional low power mode, called Sleep Mode, in which it operates in
minimum functionality, and therefore draws significantly less current. During low power mode
the H24 network connection is not lost. H24 continues to monitor the GSM network constantly
for any incoming calls or data.
During low power mode, all of the H24 interface signals are inactive and are kept in their
previous state, prior to activating low power mode. To save power, all the H24 internal clocks and
circuits are shut down, and therefore serial communications is limited.
Activating Low Power Mode
UART:
By default, the H24 powers on in Idle mode. In this mode the H24 interfaces and features are
functional and the module is fully active.
Low power mode is controlled by the AT+MSLEEP & ATS24 commands.
The command AT+MSLEEP=1 enable Sleep Mode (AT+MSLEEP=0 disable Sleep Mode).
The value of S24 command determines the inactive state duration required by H24, in seconds,
after which H24 will enter sleep mode.
For example:
ATS24 = 1 activates low power mode after 1 second of inactivity.
ATS24 = 5 activates low power mode after 5 seconds of inactivity.
Note: ATS24=0 will not disable sleep mode at H24.
AT+MSLEEP = 0 disables low power mode (default).
Important:
H24 will not enter low power mode in any case when there is data present on the
serial interface.Also when any network (GSM/UMTS ) activity (e.g. incoming
voice call, data session) or an internal system task is running. Only when processing
of any external or internal system task has completed, if AT+MSLEEP=1 and H24
UARTis inactive for the duration of ATS24, H24 will enter low power mode.
Important:
H24 will not enter low power mode when USB is operating. Connecting USB to the
H24 will disable the low power mode operation.
USB:
Any transaction to the USB will wake up the h24 provided the user USB stack supports
suspend/resume mechanism. In case such mechanism is not supported the user will have to wake
up the H24 with the wakeup in line prior to any transaction.
In case of resume event the SW will be responsible to all the needed configurations (endpoints
etc.) to maintain the link. In case the host USB protocols stack doesn't support resume suspend
mechanism the USB module in the H24 will not go to sleep hence the entire H24 will remain
active as long as the USB cable is connected.
Remote wake up is supported.
If USB is connected the CTS signal state will not be change when enter to Sleep Mode.
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H24 - Module Hardware Description
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Chapter 2: Hardware Interface Description
Serial Interface During Low Power Mode
During low power mode the H24 serial interfaces are disabled. This is indicated by the CTS_N
signal high state (if hardware flow control is set by AT+IFC=1,1 (or AT&K4) and CTS control is
set by AT+MSCTS=1 command).
The H24 wakes up periodically from low power mode to listen to page channel of the GSM
network for any incoming calls or data. After this short paging is completed, H24 returns to low
power mode. During this short awake period, the serial interfaces are enabled and
communications with the module is possible (if AT+IFC=1,1 (or AT&K4) & AT+MSCTS=1
commands are in use).
The CTS_N signal is alternately enabled and disabled synchronously with the network paging
cycle. CTS_N is enabled whenever H24 awakes to page the network. This indicates the H24
serial interfaces are active (see Figure 2-5).
Figure 2-5: CTS Signal During Sleep Mode
The periodical enabling and disabling of the CTS_N signal during low power mode can be
controlled by the AT+MSCTS command.
Setting AT+MSCTS=1 permanently disables the serial interface during low power mode, even
during a network page by H24. The CTS_N signal is disabled, and therefore the serial interfaces
are blocked.
Terminating Low Power Mode
Terminating the low power mode, or wake-up, is defined as the transition of the H24 operating
state from Sleep mode to Idle mode. There are several ways (using UART CTS_N signal,
WKUPI_N line or UART RX line interrupt) to wake-up H24 from low power mode as described
below.
Important:
May 15, 2009
During power saving mode the H24 internal clocks and circuits are disabled, in
order to minimize power consumption. When terminating the power saving mode,
and switching to Idle mode, H24 requires a minimal delay time to reactivate and
stabilize its internal circuits before it can respond to application data.
This delay is typically of TBD milliseconds, and is also indicated by the CTS_N
signal inactive (high) state. The delay guarantees that data on the serial interface is
not lost or misinterpreted.
H24 - Module Hardware Description
21
Low Power Mode
Temporary Termination of Low Power Mode
The WKUPI_N signal is an active low input that is set high by default. By asserting this signal
low the application can wake-up H24 from low power mode and switch to idle mode.
Low power mode may be terminated temporarily by several sources, some of which are user
initiated and others are initiated by the system.
Using the WKUPI_N signal to wake UART from Sleep Mode
The WKUPI_N signal is an active low input, that is set high by default. By asserting this signal
low the application can wake-up H24 from low power mode and switch to Idle mode.
H24 will remain in idle mode, awake and fully active, as long as WKUPI_N signal remains low.
When this signal is disabled and set high again, H24 will return to Sleep mode automatically,
according to the ATS24 settings (see Figure 2-6).
Figure 2-6: WKUPI_N Signal Operation
The WKUPI_N signal is the recommended method to temporarily wake-up H24 from low power
mode. It provides the application full control of the H24 operating mode and guarantees that data
on the serial interface will not be lost or misinterpreted.
The WKUPI_N signal can be used to wake up H24 from low power mode. If the serial interface
has been controlled by the AT+IFC=1,1 (or AT&K4) command, the application can work in
Hardware Flow Control accumulate the data in its buffer and send it to the module when the CTS
is Enabled. (Note: this method of operation works without using AT+MSCTS=1 command).
Incoming Network Data
During low power mode, H24 continues monitoring the network (GSM or UMTS) for any
incoming data, message or voice calls.
When H24 receives an indication from the network that an incoming voice call, message or data
is available, it automatically wakes up from low power mode to alert the application. When H24
has completed to process all the tasks related to the incoming data, it will automatically return to
low power mode according to the ATS24 settings.
Depending on the type of network indication and the application settings, H24 may operate in
several methods, which are configurable by AT commands, to alert the application of the
incoming data:
• Enable the WKUPO_N signal to wake-up the application from low power.
• Send data to the application over the serial interface.
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Chapter 2: Hardware Interface Description
• Enable the serial interface's Ring Indicator (RI_N) signal.
Data on the Serial interface
While H24 is temporarily awake in Idle mode, data may be transmitted on the serial interface. In
case data is being transmitted in any direction, H24 will not return to low power mode. This is
regardless of the original wake-up reason or source. H24 will remain awake while data is
transferred.
Only when the serial interface transfer is completed and the data has been processed, H24 will
return to low power mode automatically, according to the ATS24 settings (see Figure 2-7).
Figure 2-7: Serial Interface Data
UART Exiting of Low Power Mode
The H24 low power mode is enabled and disabled by the ATS24 command.
To permanently terminate the H24 low power mode, the +MSLEEP=0 command must be used.
Setting AT+MSLEEP=0 disables the currently active low power mode and switches H24 to Idle
mode.
H24 will not return to low power mode until an AT+MSLEEP=1 commands is set again.
This command can be sent only when the serial interface is active.
In case the serial interface is disabled, Hardware Flow control is OFF and WKUP_I is not used, it
must first be activated before sending this command. To reactivate the serial interface, a
temporary termination of the low power mode is required, by sending "A" (or any other AT
command) that will catch by the RX line interrupt service rotiine and will use to wake up the
module for S24 [second] (The execution of the first command after exit Sleep Mode is not
guarantied and can happened if the module was already waked by the RF paging channel).
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H24 - Module Hardware Description
23
Real Time Clock
Real Time Clock
H24 incorporates a Real Time Clock (RTC) mechanism that performs many internal functions,
one of which is keeping time. The RTC subsystem is embedded in the PMIC and operates in all of
the H24 operating modes (Off, Idle, Sleep), as long as power is supplied above the minimum
operating level.
The H24 time and date can be set using the following methods:
• Automatically retrieved from the GSM network.
In case H24 is operated in a GSM network that supports automatic time zone updating, it will
update the RTC with the local time and date upon connection to the network. The RTC will
continue to keep the time from that point.
• Using the AT+CCLK command.
Setting the time and date manually by this AT commands overrides the automatic network
update.
Once the time and date are manually updated, the RTC timer will keep the time and date
synchronized regardless of the H24 operating state.
When the power supply is disconnected from H24, the RTC timer will reset and the current time
and date will be lost. On the next H24 power-up the time and date will need to be set again
automatically or manually.
Nevertheless, there is ability to keep the RTC working while main power supply is off.
This can be done by supplying the RTC an external power of 3V to a dedicated pin in the
microprocessor.
This dedicated pin is called Vcoin.
When the main power supply is off and Vcoin is active, the RTC is still working.
The default state is that in this case (main power supply is off and Vcoin is active) the RTC will
work only for 2 sec, and will turn "off". This period can be changed by SW according to
costumer’s request.
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H24 - Module Hardware Description
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Chapter 2: Hardware Interface Description
Serial Interfaces
H24 includes three completely independent serial communications interfaces, which may be used
by the application for several purposes.
Primary UART (UART1)
The H24 primary UART is a standard 8-signal bus. The primary UART is used for all the
communications with H24 - AT commands interface, GPRS/EGPRS data and CSD data,
programming and software upgrades.
The UART signals are active low CMOS level signals. For standard RS232 communications with
a PC, an external transceiver is required.
H24 is defined as a DCE device, and the user application is defined as the DTE device. These
definitions apply for the UART signals naming conventions, and the direction of data flow, as
described in Figure 2-8.
Figure 2-8: UART1 Interface Signals
The H24 primary UART supports maximum data rate of up to 4 Mbps using the UART1DM data
mover interface and up to 230 kbps for data services using the UART1 interface.
All flow control handshakes are supported: hardware, software, or none.
Parity bit and Stop bit definitions are also supported.
The UART default port configuration is 8 data bits, 1 stop bit and no parity, with hardware flow
control and auto baud rate detect enabled.
Secondary UART (UART2)
The secondary UART is a 4-signal interface, which only provides data and flow control signals.
The secondary UART is designed, but not limited, to enhance the H24 capabilities by providing
connectivity to external devices or applications that require serial communications, such as GPS
receivers or Bluetooth wireless devices.
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H24 - Module Hardware Description
25
Serial Interfaces
The secondary UART may also be used for standard serial communications, like the primary
UART.
The UART signals are active low CMOS level signals. For standard RS232 communications with
a PC, an external transceiver is required.
H24 is defined as a DCE device, and the user application is defined as the DTE device. These
definitions apply for the UART signals naming conventions, and the direction of data flow, as
described in Figure 2-9.
Figure 2-9: UART2 Interface Signals
USB Interface
H24 incorporates a standard Universal Serial Bus (USB) interface.
The H24 USB electrical interface and protocol conform to the USB 2.0 full-speed specifications.
H24 is defined as a USB device on the USB bus and does not support hub or host functionality.
USB may be used for standard communications with H24, as done through the UART interface.
The USB interface signals are shown in Figure 2-10.
Figure 2-10: USB Interface Signals
UID determines the USB mode configuration: Host or Client.
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H24 - Module Hardware Description
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Chapter 2: Hardware Interface Description
SIM Interface
The H24 incorporates a SIM interface, which conforms to the GSM 11.11 and GSM 11.12
standards, that are based on the ISO/IEC 7816 standard. These standards define the electrical,
signaling and protocol specifications of a GSM SIM card.
H24 does not incorporate an on-board SIM card tray for SIM placement. The SIM must be
located on the user application board, external to the H24. The H24 SIM interface includes all the
necessary signals, which are routed to the interface connector, for a direct and complete
connection to an external SIM.
H24 supports dynamic detection of the SIM card, through a dedicated SIM detection signal. H24
will detect a SIM card insertion or removal upon power up or during operation by the transitions
on the SIM_PD_N signal.
SIM Connection
Table 2-7 details the SIM interface signals.
Table 2-7: SIM Interface Signals
Connected
to 70 pin
H24
Interruptible
44
SIM_RST_N
46
SIM_CLK
48
SIM_VCC
50
SIM_PD_N
52
SIM_DIO
SIM Design Guidelines
The SIM interface and signals design is extremely important for proper operation of H24 and the
SIM card. There are several design guidelines that must be followed to achieve a robust and
stable design that meets the required standards and regulations.
• Using the SIM detection signal, SIM_PD_N, is mandatory in case the SIM card is accessible
to the user and may be removed during H24 operation. To avoid any damage to the SIM or
H24, the SIM interface signals must be deactivated before the SIM card contacts are
mechanically removed from the SIM tray contacts. Therefore, the SIM_PD_N detection
signal must be disabled before the SIM is removed from its tray.
• The SIM should be located, and its signals should be routed, away from any possible EMI
sources, such as the RF antenna and digital switching signals.
• The SIM interface signals length should not exceed 100 mm between the H24 interface
connector and the SIM tray. This is to meet with EMC regulations and improve signal
integrity.
• To avoid crosstalk between the SIM clock and data signals (SIM_CLK and SIM_DIO), it is
recommended to rout them separately on the application board, and preferably isolated by a
surrounding ground plane.
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H24 - Module Hardware Description
27
SIM Interface
• The SIM card signals should be protected from ESD using very low capacitance protective
elements (zener diodes, etc.).
• The H24 interface does not support SIM programming through the VPP signal. This signal
should not be connected to H24.
• SIM voltage level will not drop below 2.7V (1.6V for 1.8V SIM card) during hot insertion.
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H24 - Module Hardware Description
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Chapter 2: Hardware Interface Description
Audio Interface
The H24 audio interface supports several audio devices and operating modes.
The audio interface's operating modes, active devices, amplification levels and speech processing
algorithms are fully controlled by the host application, through advanced programming options
and a versatile AT commands set.
The H24 supports the following audio devices:
• Two single-ended/ Differential and biased mono analog microphone inputs for use in a
variety of modes.
• Differential mono analog speaker output.
• Differential mono analog alert output. (Amplified to 1W)
• Single-ended mono analog headset output.
• A digital serial interface using PCM coding.
All the above analog audio paths with the interface to the 70 pin connector are shown in
Figure 2-11.
Figure 2-11: H24 Audio Interface
Handset Interface
Typical handset interfaces are shown in Figure 2-12. The earphone output pins are connected
directly to the handset's earphone with 2 bypass capacitors connected to ground. The capacitance
is selected de-pending on the design, typically less than 100 pF.
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H24 - Module Hardware Description
29
Audio Interface
The output power for the differential EAR1 output is typically 70 mW for a full-scale +3 dBm0
sine wave into a 32Ω speaker.
Both microphone pins require 2.2 k bias resistors and 0.1µF AC-coupling capacitors.
The positive microphone terminal is connected to the µC MICBIAS pin through one of the
2.2 kΩ resistors; this 1.8 V output provides 1 mA of bias current for the Microphone.
MICBIAS supports multiple microphones simultaneously up to 1 mA.
In case the user connect single-ended mic, he must connect it to pin 61 and short circuit pin 62 to
ground.
Figure 2-12: Handset Interface
Headset Interface
The most basic handset configuration is shown in Figure 2-13. This configuration uses an
AC-coupled mono earphone interface and a standard single-ended microphone interface.
The output power for the single-ended HPH_L/HPH_R output is typically 21.6 mW per side for a
full-scale +3 dBm0 sine wave into a 15Ω speaker.
Few alternative earphone configurations are given in the following paragraphs. If the load
capacitance is greater than 100 pF due to earphones with different capacitive load used, a RC
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H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
shunt network (0.22µF and 22Ω) is recommended to prevent oscillations as shown in
Figure 2-13.
Note: In case a differential mic is used, the negative node should be connected to pin 70.
Figure 2-13: Headset Interface
Interface to an External Speaker Amplifier
The power management device can also be used as a speaker amplifier. The power management
speaker driver output power is rated at 500 mW. To use this feature as an amplifier of an audio
output, be sure to set the appropriate speaker driver analog and digital gains, and set the analog
high-pass filter corner at the resonant frequency of the far-field speaker transducer (see
Figure 2-14).
Figure 2-14: External Speaker
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H24 - Module Hardware Description
31
Audio Interface
Audio Design
The audio quality delivered by H24 is highly affected by the application audio design,
particularly when using the analog audio interface. Therefore, special care must be taken when
designing the H24 audio interface. Improper design and implementation of the audio interface
will result in poor audio quality.
Poor audio quality is a result of electrical interferences, or noises, from circuits surrounding the
audio interface. There are several possible sources for the audio noise:
• Transients and losses on the power supply
• EMI from antenna radiations
• Digital logic switching noise
Most of the audio noise originates from the GSM transmit burst current surges (217 Hz TDMA
buzz), which appear on the main power supply lines and antenna, but also indirectly penetrate the
internal application's supplies and signals. The noises are transferred into the H24's audio circuits
through the microphone input signals and then are amplified by the H24's internal audio
amplifiers.
To minimize the audio noise and improve the audio performance the microphone and speaker
signals must be designed with sufficient protection from surrounding noises.
The following guidelines should be followed to achieve best audio performance:
• Reference the microphone input circuits to the H24 AGND interface signal.
• If using single-ended audio outputs, they should be referenced to the H24 AGND interface
signal.
• Keep the audio circuits away from the antenna.
•
•
•
•
Use RF filtering capacitors on the audio signals, as described in Table 2-3.
The audio signals should not be routed adjacent to digital signals.
Isolate the audio signals by a surrounding ground plane or shields.
Filter internal supplies and signals that may indirectly affect the audio circuits, from noises
and voltage drops.
Analog Ground
The H24 interface incorporates a dedicated analog ground contact, AGND pin 59, which is
internally connected to the H24's ground. The AGND signal is intended to provide a separate
ground connection for the application's external audio devices and circuits.
This signal provides an isolated ground connection directly from H24, which is separated from
the noisy digital ground of the application. It is recommended to connect this signal to analog
audio devices and circuits used by the application. Using a separate analog ground minimizes
audio noises and improves the audio circuit's immunity from external interferences.
Digital Audio Interface
The H24 digital audio interface is a serial Pulse Code Modulation (PCM) bus, which uses linear
2's compliment coding. H24 is the PCM bus master, supplying the clock and sync signals to the
application.
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Chapter 2: Hardware Interface Description
The H24 digital interface is a 4 signal PCM bus, which includes a bit clock output signal for the
bus timing, a frame sync output signal for audio sampling timing, and serial data input and output
signals.
Important:
The PCM bus signals are shared internally by the analog audio interface and the
digital audio interface. Therefore, when using the analog audio interface the PCM
bus signals must be tri-stated or disconnected at the interface connector.
The digital audio interface supports 4 types of audio data formats, which define the PCM bus
configuration and data rates:
• Voice band audio - Intended for speech during voice calls and for mono rings and alerts.
• Stereo audio - Includes 3 audio formats that support high quality stereo ring tones and alerts.
The PCM bus configuration is defined by the audio data format that is sounded through the digital
audio path, as described in Table 2-8.
Table 2-8: Digital Audio modes
Audio Mode
Frame Sync
Sampling
Bit Clock
AT+CRTT Tones
Voice
Mono tones
Stereo low tones
Stereo high tones
Voiceband Audio
This digital voice audio format is used for speech during voice calls and for mono rings and
alerts.
The PCM bus signal's configuration for voiceband audio is:
• PCM_CLK - 2048 kHz serial clock
• PCM_FS - 8 kHz bit-wide frame-sync
• PCM_DOUT - 13-bit linear audio data output
• PCM_DIN - 13-bit linear audio data input
The analog audio is sampled at an 8 kHz rate and converted to linear 13-bit serial PCM audio
data. The serial data is transferred on the PCM bus in 16-bit word format, which includes 13
sampled data bits, and 3 added zero value bits.
The 16-bit serial data is transferred in both directions after each sync signal's falling edge. The
sync signal pulse duration is one clock period, after which the serial data is transferred in both
directions for 16 consecutive clock periods.
Following the 16-bit data transfer, the serial input and output data signals inactivate until the next
sync pulse, which occurs every 125 µS (8 kHz). It is recommended the serial data signals will be
High-Z during the inactive period.
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H24 - Module Hardware Description
33
Audio Interface
Important:
In digital audio mode the input and output gains cannot be controlled by AT
commands.
Figure 2-15 illustrates the PCM bus format of the voiceband audio configuration.
Figure 2-15: Voiceband Mode PCM Bus Coding Format
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Chapter 2: Hardware Interface Description
A/D Interface
The H24 includes 5 Analog to Digital Converter (ADC) signals with 10-bit resolution, for
environmental and electrical measurements. The ADC signals measure an analog DC voltage
level on their inputs which is converted to a 10-bit digital value for further processing by H24 or
the user application.
The A/D signals operation and reporting mechanism is defined by the AT+MMAD command.
Each A/D can be defined to provide several reports:
• A single measurement.
A single A/D measurement will take place and will be reported upon activation of the AT
command.
• An automatic periodical measurement.
The A/D measures its input signal at a rate that is defined by the user application. Every
measurement will generate an unsolicited message over the serial interface.
• An automatic periodical measurement with predefined limits.
The A/D measures its input signal at a rate that is defined by the user. The user also defines
upper and/or lower limits for the A/D measurements. Each measurement is compared to
these limits, and an unsolicited message is generated only if these limits are exceeded.
Important:
In case the defined periodical measurement rate is equal to, or shorter than, the
defined sleep mode delay settings (ATS24), H24 will not enter low power mode.
Table 2-9 below, lists the internal and external A/D signals provided by H24.
Table 2-9: A/D Signals
ADC Name
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Description
Pin #
ADC
Min
Max
Unit
ADC3
GPAD 3
47
2.6
ADC2
GPAD 2
43
2.6
ADC1
GPAD 1
37
2.6
H24 - Module Hardware Description
35
A/D Interface
Temperature A/D
The H24 incorporates an internal temperature sensor circuit, which is used to monitor the
operating temperature. The temperature is constantly monitored by H24 through a dedicated A/D
signal, which is not accessible at the interface connector. Figure 2-16 shows the temperature A/D
characteristics.
TBD
Figure 2-16: Temperature A/D Characteristics
The measured temperature level can be monitored by the user application through the TBD
command, which returns a digital decimal value that represents the measured temperature level.
The temperature is measured by thermistors at the power management, and at the RF section of
the H24.
General Purpose A/D
The H24 provides 3 general purpose A/D (GPAD) signals for customer application use. Each A/D
signal can monitor a separate external voltage and report its measured level independently to the
application, through the AT command interface.
The GPAD signals measure a DC voltage level of 0 - 2.6 V, which is converted internally to a
8-bit digital value. The user application can monitor the A/D voltage level through the TBD
command.
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Chapter 2: Hardware Interface Description
Controls and Indicators Interface
The H24 incorporates several interface signals for controlling and monitoring the module's
operation. The following paragraphs describes these signals and their operation.
Table 2-10 gives a description of the controls and indicators signals.
Table 2-10: Controls and Indicators
Connector Pin
Signal Name
Description
25
RESET_N
H24 system reset output indicator.
When high, H24 is operating.
27
VREF
2.85V regulated output.
Supplies external circuits up to
150mA.
16
WKUPO_N
Host application wake-up signal indicator.
41
ANT_DET
Antenna physical connection detect
indicator (For main antenna only).
49
GPRS/GSM/
WCDMA
Network status indicator.
39
TXEN_N
Transmission burst indication.
28, 30, 32, 34, 36,
38, 40, 42
GPIO 1-8
General purpose IO signals for customer use.
Reset
The RESET_N output signal indicates the H24's operating status. This signal is set high after
power up, when H24 is operating. It is set low when H24 is powered off.
When the RESET_N signal is low, the H24 interface signals are disabled and do not represent any
valid data or state. Furthermore, any input signals connected to the H24 interface must be
disabled (tri-state) or set low when RESET_N is low.
VREF Reference Regulator
The H24 incorporates a regulated voltage output, VREF. The regulator provides a 2.85V output
for use by the customer application. This regulator can source up to TBD mA of current to power
any external digital circuits.
Important:
May 15, 2009
The VREF regulator is powered from the H24's main power supply, and therefore
any current sourced through this regulator originates from the H24 VCC supply.
The overall VCC current consumed by H24 is directly affected by the VREF
operation. The H24 current consumption rises with respect to the current sourced
through VREF.
H24 - Module Hardware Description
37
Controls and Indicators Interface
The VREF regulator incorporates 3 operating modes that are controlled by the AT+MVREF
command. These modes define the regulator operating state relative to the H24's operating mode.
OFF Mode
In this mode the VREF regulator is disabled and its output drops to 0V, regardless of the H24
operating state.
Standby Mode
The Standby operating mode is the default mode when H24 powers on. In this mode VREF
follows the H24's operating state.
When the H24 is in low power mode, Sleep mode, the VREF regulator is also in a low power
state. In this state the VREF regulated output is limited to providing only TBD mA of current
maximum, while maintaining the 2.75V output level.
When H24 is in Idle mode, or wakes up temporarily from low power mode, the VREF regulator
returns to full operation, supplying up to TBD mA.
Active Mode
In this mode the VREF regulator is always fully active while H24 is operating, regardless of the
H24 operating mode.
Table 2-11 gives the VREF specifications.
Table 2-11: VREF Specifications
Parameter
VOUT
Conditions
Min
Typ
Max
Unit
-3%
2.85
+3%
150
mA
IOUT
Load regulation
mV/
mA
Line regulation
mV
PSRR
dB
Wakeup Out
Some applications incorporate their own power saving mode, in which they operate with minimal
functionality, including disabling of interfaces and serial communications.
The wakeup-out (WKUPO_N) signal is an active low output, which is designed to support a low
power mode feature in the host application. This signal is used by H24 to indicate that it requires
to communicate with the host application through the serial interface, due to an incoming call or
data, or an unsolicited event. Applications that incorporate a low power mode should use this
38
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
signal as an indication to switch from low power mode to normal operation, and activate the serial
interface.
The wakeup-out mechanism, using the WKUPO_N signal, is controlled by 2 AT commands (see
Figure 2-17):
• ATS102 - Defines the delay time in milliseconds that H24 will wait, after asserting the
WKUPO_N signal low, before sending data on the serial interface. This delay is required to
allow the application enough time to reactivate from low power mode and switch to normal
mode.
If ATS102=0, which is the default value, the WKUPO_N signal and mechanism is disabled.
In case the serial interface incorporates hardware flow control signals, the data will be sent
according to their state, after the ATS102 delay time has expired.
• ATS100 - Defines the application minimal wakeup duration, in seconds, for a single wakeup
event. This time definition is required to avoid frequent unnecessary wakeup events and
consequent ATS102 delays.
The application may return to low power mode after the serial interface has been inactive for
the duration set by ATS100. This duration is measured from the last data sent or received on
the serial interface.
Figure 2-17: WKUPO_N Operation
The following guidelines apply to the wakeup-out mechanism:
• H24 will set the WKUPO_N signal low to indicate that in has data to send through the serial
interface.
• H24 will start sending the data to the application after the delay defined by ATS102.
• The WKUPO_N signal will remain low while data is being sent to the host application.
• The host application should keep its serial interface active, and not switch to low power
mode, while the WKUPO_N signal is low.
• H24 will set the WKUPO_N signal high when it has completed sending the data.
• The application serial interface must stay active, and not switch to low power mode, for the
duration set by ATS100, after WKUPO_N is set high.
• H24 will not set the WKUPO_N signal low if it needs to send additional data during the
ATS100 delay time.
• The application may switch to low power mode after the WKUPO_N signal is set high and
the serial interface has been inactive for the duration set by ATS100.
May 15, 2009
H24 - Module Hardware Description
39
Controls and Indicators Interface
Antenna Detection
The H24 incorporates an internal antenna detection circuit, which senses the physical connection
and removal of the main antenna or antenna circuit on the H24 antenna connector. The antenna
detection state is reported to the application through the ANT_DET output signal, and may also
be queried by the ATS97 command.
The detection circuit senses DC resistance to ground on the H24 antenna connector.
A DC resistance below 100kohm (+10%) is defined as a valid antenna connection, and the
ANT_DET output signal is set high.
GPRS/EGPRS - WCDMA/HSDPA Detection
The GPRS output signal (Pin 49) indicates the network GPRS/EGPRS connection status. When
H24 is connected to a network, this signal is enabled. When H24 is not connected to the
GPRS/EGPRS network this signal is disabled.
Transmission Indicator
The TXEN_N output signal indicates when H24 is transmitting over the GSM network. This
signal follows the H24 GSM transmit bursts. This signal is set low during transmission burst, and
set high when no transmission is in progress.
Figure 2-18 shows the TXEN_N operation.
Figure 2-18: TXEN_N Operation
General Purpose I/O
The H24 incorporates 8 general purpose IO signals for the user application. Each GPIO signal
may be configured and controlled by AT command. These signals may be used to control or set
external application circuits, or to receive indications from the external application.
40
H24 - Module Hardware Description
May 15, 2009
Chapter 2: Hardware Interface Description
Antenna Interface
The H24 antenna connector is the RF interface to the GSM/WCDMA network.
The antenna interface is terminated by an MMCX connector type, which is 50Ω impedance
matched at the relevant GSM frequencies.
The antenna or antenna application must be installed properly to achieve best performance.
Table 2-12 gives the antenna interface specifications.
Table 2-12: Antenna Interface Specifications
Parameter
GSM 850
GSM 900
DCS 1800
PCS 1900
Conditions
Specifications
TX
824 - 849 MHz
RX
869 - 894 MHz
TX
880 - 915 MHz
RX
925 - 960 MHz
TX
1710 - 1785 MHz
RX
1805 - 1880 MHz
TX
1850 - 1910 MHz
RX
1930 - 1990 MHz
Gain
TBD dBi (unity) gain max
Impedance
50Ω
VSWR
Less than: 2.5:1
WCDMA B1
2100
TX
1920-1980 MHz
RX
2110 - 2170 MHz
WCDMA B2
1900
TX
1850-1910 MHz
RX
1930-1990 MHz
WCDMA B5
850
TX
824 - 849 MHz
RX
869 - 894 MHz
It is the Integrator's responsibility to design the antenna or antenna assembly used with the H24.
This will highly affect the RF performance of the H24 (dropped calls, battery consumption etc.).
The following guidelines should be followed:
• Make sure that the antenna or antenna assembly matches the Antenna Interface
Specifications.
• Use low loss RF cable and connectors keeping cable runs to a minimum.
May 15, 2009
H24 - Module Hardware Description
41
Antenna Interface
It is highly recommended to test the application in which the H24 is installed for minimum
radiated RF performance based on the tables below:
Band
GSM/GPRS
EGPRS
850/900
1800/1900
TRP [dBm]
TBD
TBD
TIS [dBm]
TBD
TBD
TRP [dBm]
TBD
TBD
TIS [dBm]
TBD
TBD
Band
WCDMA
HSDPA
42
B1-2100
B2-1900
B5-850
TRP [dBm]
TBD
TBD
TBD
TIS [dBm]
TBD
TBD
TBD
TRP [dBm]
TBD
TBD
TBD
TIS [dBm]
TBD
TBD
TBD
H24 - Module Hardware Description
May 15, 2009
Chapter 3: Electrical and Environmental Specifications
Absolute Maximum Ratings
Table 3-1 gives the maximum electrical characteristics of the H24 interface signals.
Caution:
Exceeding the values may result in permanent damage to the module.
Table 3-1: Maximum Ratings
Parameter
Conditions
VCC Supply
Caution:
May 15, 2009
Min
Max
Unit
-0.2
4.2
Digital Input Signals
(Except for IGN,
VBUS, USB_DP,
USB_DN)
H24 powered on
-0.2
2.6
Analog Input Signals
(Audio, A/D interfaces)
H24 powered on
-0.2
2.6
All Input Signals
(Except for IGN,
VBUS, USB_DP,
USB_DN)
H24 powered off
-0.2
0.2
IGN signal
-0.2
16
VBUS signal
-0.2
USB_DP, USB_DN
-0.2
It is not recommended to connect the ignition pin directly to the car’s ignition wire
without adequate protection.
H24 - Module Hardware Description
43
Environmental Specifications
Environmental Specifications
Table 3-2 gives the environmental operating conditions of the H24 module.
Caution:
Exceeding the values may result in permanent damage to the module.
Table 3-2: Environmental Ratings
Parameter
Min
Max
Unit
Ambient Operating
Temperature
-30
85
°C
Storage Temperature
-40
85
°C
ESD
Conditions
At antenna connector
Contact
Air
At interface connector
KV
±8
± 15
±1
Application Interface Specifications
Table 3-3 summarizes the DC electrical specifications of the application interface connector
signals.
44
Important:
Interface signals that are not used by the customer application must be left
unconnected. H24 incorporates the necessary internal circuitry to keep unconnected
signal in their default state. Do not connect any components to, or apply any voltage
on, signals that are not used by the application.
Important:
It is recommended to place a pull-down resistor in the customer application, on the
IGN signal. A 100 kohm resistor, or less, is acceptable.
Important:
Signals that are defined as "Do Not Use", or DNU, must remain externally
unconnected in any case. These signals are reserved for future use.
H24 - Module Hardware Description
May 15, 2009
Chapter 3: Electrical and Environmental Specifications
The following table gives a brief description of the 70 pins connector for quick integration.
GND
GND
VCC
VCC
RTS_N
RXD_N
DSR_N
CTS_N
DCD_N
DTR_N
TXD_N
RI_N
RESET_N
VREF
RXD2
TXD2
RTS2
CTS2
ADC1
TXEN_N
ANT_DET
ADC2
USB_ID
ADC3
GPRS
IGN
ON_N
HDST_INT_N
MIC2_P
AGND
MIC1_P
ALRT_N
ALRT_P
SPKR_N
SPKR_P
May 15, 2009
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
GND
GND
VCC
VCC
USB_VBUS
USB_DP
USB_DN
WKUPI_N
PCM_DIN
PCM_DOUT
PCM_CLK
PCM_FS
WKUPO_N
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
SIM_RST_N
SIM_CLK
SIM_VCC
SIM_PD_N
SIM_DIO
HEADSET_P
NC
GPS_PWR
MDDI_MSP
MIC1_N
I2C_SCL
I2C_SDA
Coin Cell
MIC2_N
H24 - Module Hardware Description
45
Application Interface Specifications
Table 3-3: Interface Specifications
Level
Signal
Name
Pin #
Active Internal
Description I/O
H/L
PU/PD Parameter Conditions
Min
Typ
Max Units
3.3
3.6
4.2
Power:
GND
Ground
VIN
VCC
DC power
supply
IMAX
VCC = 3.6 V
IOFF
68
COIN
CELL
56
NC
58
GPS ANT
POWER
27
VREF
1.8
Reference
regulator output
2.85
Control:
16
WKUPI_N
H24 wakeup
input
2.6
26
WKUPO_
Host wakeup
output
2.6
25
RESET_N
Reset signal
output
2.6
53
ON_N
On/Off switch I
51
IGN
Ignition input
VIL
0.4
VIH
3.3
16
39
TXEN_N
Transmit indicator
2.6
41
ANT_DET
Antenna presence indicator
2.6
46
H24 - Module Hardware Description
May 15, 2009
Chapter 3: Electrical and Environmental Specifications
Table 3-3: Interface Specifications (Cont.)
Level
Pin #
Signal
Name
Active Internal
Description I/O
H/L
PU/PD Parameter Conditions
Min
Typ
Max Units
GPRS
GPRS/
EGPRS coverage indicator
2.6
21
TXD_N
UART1 TXD
2.6
11
RXD_N
UART1 RXD
RTS_N
UART1 RTS
15
CTS_N
UART1 CTS
19
DTR_N
UART1 DTR
13
DSR_N
UART1 DSR
17
DCD_N
UART1 DCD
23
RI_N
UART1 RI
29
RXD2_N
UART2 RXD
2.6
31
TXD2_N
UART2 TXD
33
RTS2_N
UART2 RTS
35
CTS2_N
UART2 CTS
10
USB_VBUS
USB bus
power
12
USB_DP
USB bus
serial data
I/O
14
USB_DN
USB bus
serial data
I/O
45
USB_ID
USB bus
serial data
49
UART1:
UART2:
USB:
SIM Card:
50
SIM_PD_N
SIM presence
detect
48
SIM_VCC
SIM supply
3/1.8
44
SIM_RST_
SIM reset
3/1.8
52
SIM_DIO
SIM serial
data
I/O
46
SIM_CLK
SIM clock
May 15, 2009
H24 - Module Hardware Description
47
Application Interface Specifications
Table 3-3: Interface Specifications (Cont.)
Level
Pin #
Signal
Name
Active Internal
Description I/O
H/L
PU/PD Parameter Conditions
Min
Typ
Max Units
Digital Audio:
18
PCM_
DIN
Digital audio
receive
20
PCM_
DOUT
Digital audio
transmit
22
PCM_CLK
Digital audio
clock
24
PCM_FS
Digital audio
frame sync.
48
2.6
H24 - Module Hardware Description
May 15, 2009
Chapter 3: Electrical and Environmental Specifications
Table 3-3: Interface Specifications (Cont.)
Level
Pin #
Signal
Name
Active Internal
Description I/O
H/L
PU/PD Parameter Conditions
Min
Typ
Max Units
GPIO:
28
GPIO1
General purpose I/O
I/O
30
GPIO2
General purpose I/O
I/O
32
GPIO3
General purpose I/O
I/O
34
GPIO4
General purpose I/O
I/O
36
GPIO5
General purpose I/O
I/O
38
GPIO6
General purpose I/O
I/O
40
GPIO7
General purpose I/O
I/O
42
GPIO8
General purpose I/O
I/O
67
SPKR_N
Speaker
inverted
69
SPKR_P
Speaker
63
ALRT_N
Alert speaker
inverted
65
ALRT_P
Alert speaker
61
MIC1_P
Microphone 1
positive
62
MIC1_N
Microphone 1
negative
59
AGND
Audio ground
57
MIC2_P
Microphone 2
positive
70
MIC2_N
Microphone 2
negative
54
HPH_L
Headset
detect interrupt
55
HDST_
INT_N
Headset
detect interrupt
2.6
Audio:
May 15, 2009
H24 - Module Hardware Description
49
Application Interface Specifications
Table 3-3: Interface Specifications (Cont.)
Level
Signal
Name
Pin #
Active Internal
Description I/O
H/L
PU/PD Parameter Conditions
Min
Typ
Max Units
A/D:
37
ADC1
General purpose A/D
2.6
43
ADC2
General purpose A/D
2.6
47
ADC3
General purpose A/D
2.6
Leave this pin
disconnected
2.6
Display:
60
Special
mode
I2C:
64
I2C_SCL
66
I2C_SDA
I/O
Note 1:Per USB Specifications Rev 2.0.
Note 2:Per ISO 7816-3 IC specifications.
50
H24 - Module Hardware Description
May 15, 2009
Chapter 4: Mechanical Specifications
Board Dimensions
Figure 4-1 describes the H24 mechanical characteristics.
Figure 4-1: H24 Mechanical Characteristics
May 15, 2009
H24 - Module Hardware Description
51
Interface Connector Specifications
Interface Connector Specifications
The H24 uses a single 70-pin, 0.5 mm pitch, board to board connector for the application
interface, as described in Table 4-1.
Table 4-1: H24 interface connector options
H24 Connector
Molex 53748-0708
Mating Connector
Molex 52991-0708
Stacking Height
3.0 mm
Figure 4-2 shows the H24 interface connectors.
Figure 4-2: H24 Interface Connectors
Table 4-2 describes the H24 interface connector characteristics.
Table 4-2: Interface Connector Specifications
52
Parameter
53748 (3.0 mm)
Contacts
70
Rows
Pitch
0.5 mm
Maximum Current
500 mA
Maximum Voltage
50 V
Contact Resistance
50 mΩ maximum
Insulation
Resistance
100 MΩ minimum
Durability
50 mated cycles
maximum
Stacking Height
3.0 mm
Mates with
Molex 52991-0708
H24 - Module Hardware Description
May 15, 2009
Chapter 4: Mechanical Specifications
Mating Connector
The mating connector incorporates the same electrical and mechanical characteristics as the
corresponding H24 interface connector, and is described in Table 4-2.
Figure 4-3 provides a reference drawing of the mating connector mechanical dimensions.
Figure 4-3: Mating Connector Dimensions
For more information on the H24 mating connector, please refer to the Molex web site at TBD.
May 15, 2009
H24 - Module Hardware Description
53
MMCX Connector Specifications
MMCX Connector Specifications
The H24 uses a standard MMCX receptacle connector for the radio interface.
Figure 4-4 shows the MMCX connector dimensions.
Figure 4-4: MMCX Connector Dimensions
Table 4-3 describes H24 RF connector characteristics.
Table 4-3: RF Connector Specifications
Parameter
Specifications
Rated Voltage
335 VRMS
Impedance
50 Ω
Contact Resistance
5 mΩ center contact
2.5 mΩ outer contact
Insulation
Resistance
1000 MΩ
Insertion Force
3.4 lbs maximum
Withdrawal Force
4.5 lbs maximum
Contact Retention
Force
4 lbs maximum
Durability
500 mated cycles maximum
Mating Connector
The RF mating connector should be a standard MMCX plug connector or cable assembly, which
corresponds to the H24 MMCX connector specifications.
Any standard MMCX connector or application from different manufacturers may be mated with
H24.
54
H24 - Module Hardware Description
May 15, 2009
Chapter 4: Mechanical Specifications
Such a cable assembly example is the Huber-Suhner PN 11_MMCX-50-1-2/111_OH, which is
illustrated in Figure 4-5.
Figure 4-5: Optional MMCX Cable Assembly
May 15, 2009
H24 - Module Hardware Description
55
U.FL Connector Specifications
U.FL Connector Specifications
The H24 uses a standard U.FL receptacle connector for the radio interface.
Figure 4-6 shows the U.FL connector dimensions.
Figure 4-6: U.FL Connector Dimensions
Table 4-4 describes the U.FL connector characteristics.
Table 4-4: U.FL Connector Specifications
Parameter
56
Specifications
Characteristic
Impedance
50 Ohms
Frequency Range
DC to 6 GHz
VSWR (mated pair)
1.30 max DC to 3 GHz
1.40 max 3 to 6 GHz (cable dependent)
Insertion Loss
(connectors only)
0.24 dB max DC to 6 GHz
H24 - Module Hardware Description
May 15, 2009
Chapter 4: Mechanical Specifications
Table 4-4: U.FL Connector Specifications (Cont.)
Parameter
Specifications
Rated voltage
60 VAC (rms) - standard recept (Styles
A, B)
Dielectric
Withstanding
Voltage
200 VAC, 50 Hz for 1 min (at sea level)
Insulation
Resistance
500 Megohms min
Contact Resistance
(connectors only)
20 milliohms max (Center)
10 milliohms max (Outer, Plug)
10 milliohms max (Outer, Receptacle)
Durability
30 cycles - standard recept (Styles A, B)
Disengagement
Force
2N min perpendicular
4N min orthogonal
Center Contact
Retention force
0.15N min
Tape/Reel
Packaging
(receptacle)
12mm carrier per EIA-481
Operating
Temperature
40°C to + 90°C
Mating Connector
The RF mating connector should be a standard U.FL plug connector or cable assembly, which
corresponds to the H24 U.FL connector specifications.
Any standard U.FL connector or application from different manufacturers may be mated with
H24.
Such a cable assembly example is the Hirose U.FL-LP-040 is U.FL-R-SMT, which is illustrated
in Figure 4-7.
Figure 4-7: U.FL Mating Connector
May 15, 2009
H24 - Module Hardware Description
57
U.FL Connector Specifications
The following table describes U.FL Mating Connector characteristics.
58
H24 - Module Hardware Description
May 15, 2009
Chapter 4: Mechanical Specifications
H24 Mounting
The H24 incorporates 2 mechanical holes for installing the module onto the application board.
The holes are 2.4 millimeters in diameter, which accommodates several types of mechanical
elements.
Several mechanical approaches may be applied to mount and fasten H24 to the application board.
Using M2 screws with suitable washers to mount the module onto spacers, a bracket or chassis is
a recommended design.
Special attention must be paid to the area surrounding the H24 mounting holes. A grounding pad
of 4.4 milimeters in diameter surrounds these holes. The diameter and area of this pad must not be
exceeded by any mechanical or electrical element. Several electrical components, which are not
shielded, are located near the holes. These components must not be in contact with the mounting
elements or with other parts of the application board, and care must be taken to avoid any
damage.
Figure 4-8 depicts the H24 mounting area.
Figure 4-8: H24 Mounting Area
The holes are used for mechanical mounting of H24 to the application board but also for
grounding support. Using conductive elements to install H24, significantly improves the overall
grounding of the module and therefore improves the H24 performance and stability.
It is required to use screws or other mechanical elements to fasten H24 to the application board,
but it is highly recommended to use conductive elements to improve the module's performance.
The preferred mounting screw head types are:
• "Allen" head with a champer - the best choice.
• "Star" head - good.
• "Philips" head - may cause damage to nearby components.
May 15, 2009
H24 - Module Hardware Description
59
H24 Mounting
60
H24 - Module Hardware Description
May 15, 2009
Chapter 5: Service and Testing
Service
This section provides contact information for any possible queries that may arise, for example:
• Have questions?
•
•
•
•
•
Having trouble getting the Developer Board set up?
Technical questions?
Configuration questions/problems?
Technical operating problems?
Need documentation?
Who to Contact?
Direct Customer. Use this following email address to contact customer assistance:
M2M.CustomerCare@motorola.com
Indirect Customer. Send requests to your distributor and not to Motorola help desk.
Required Query Information
Every new call/problem report, directly from a Direct Customer or from a distributor, should be
directed to the help desk email address noted above in “Who to Contact?” . It is recommended to
report each individual issue in a separate email. The following information is required when
reporting a problem:
• Customer name and address
• Customer contact information for this request, including:
– Name
– Telephone
– Fax number
– Mobile number
– Email address
• Product name (H24)
• Software version of the unit (ATI8i9 command) or model number
• PCB version (located on the PCB near the RF connector) TBD
In addition to the information requested above, send the following AT commands and the
HyperTerminal log with the responses:
May 15, 2009
H24 - Module Hardware Description
61
Service
•
•
•
•
•
•
•
62
AT+CMEE=2 // to get textual error message
AT+CPIN? // to get SIM card status
AT+CREG? // to see if the TXVR is registered to the network
AT+CSQ // to get the signal strength (RX level)
AT+CGSN // to read the IMEI number of the unit
AT\S // to get the setting of basic AT commands
AT+CMER=0,0,1,1 // to get messages and indicators from the handset display to the DTE
H24 - Module Hardware Description
May 15, 2009
Acronyms and Abbreviations
Abbreviation
Full Name
A AMR
Adaptive Multi Rate
A AOC
Advice of Charge
B BR
Baud Rate
B bps
Bits Per Second
C CSD
Circuit Switched Data
C CTS
Clear to Send
D DCD
Data Carrier Detect
D DCE
Data Communication Equipment (such as modems)
D DCS
Digital Cellular System (GSM in the 1800MHz band)
D DOC
Department of Communications (Canada)
D DRX
Discontinuos Reception
D DSP
Digital Signal Processor
D DSR
Data Set Ready
D DTE
Data Terminal Equipment (such as terminals, PCs and so on)
D DTMF
Dual Tone MultiFrequency
D DTR
Data Terminal Ready
D DTX
Discontinuos Transmission
E EFR
Enhanced Full Rate
E EGPRS
Enhanced General Packet Radio Service
E EGSM
Extended Global System for Mobile Communications
E EIRP
Effective Isotropic Radiated Power
May 15, 2009
H24 - Module Hrdware Description
Acr & Abbr-1
Abbreviation
Full Name
E EMC
Electromagnetic Compatibility
E EOTD
Enhanced Observed Time Difference
E EPOS
Electronic Point of Sale
E ERP
Effective Radiated Power
E ESD
Electrostatic Discharge
E ETSI
European Telecommunication Standards Institute
F FCC
Federal Communications Commission (U.S.)
F FR
Full Rate
F FTA
Full Type Approval
G GCF
GSM Certification Forum
G GPIO
General Purpose Input/Output
G GPRS
General Packet Radio Service
G GSM
Global System for Mobile Communications
H HR
Half Rate
H HSDPA
High-Speed Downlink Packet Access
IC
Integrated Circuit
L LNA
Low-noise Amplifier
M MMCX
Miniature Micro Coax
M MO
Mobile Originated
M MT
Mobile Terminated
O OEM
Original Equipment Manufacturer
P PCB
Printed Circuit Board
P PCL
Power Class Level
P PCM
Pulse Code Modulation
P PCS
Personal Communication System (also known as GSM 1900)
P PD
Pull Down
Acr & Abbr-2
H24 - Module Hrdware Description
May 15, 2009
Acronyms and Abbreviations
Abbreviation
Full Name
P PDA
Personal Data Assistant
P PDU
Packet Data Unit
P PLL
Phase-locked Loop
P PTCRB
PCS-1900 Type Certification Review Board (GSM North America)
P PU
Pull Up
R R&TTE
Radio and Telecommunications Terminal Equipment
R RMS
Root Mean Square
R RI
Ring Indicator
R RTS
Request To Send
S SAR
Specific Absorption Rate
S SIM
Subscriber Identity Module
S SMS
Short Message Service
S SPI
Serial Peripheral Interface
T TDMA
Time Division Multiple Access
T TIS
Transmitter Isotropic Sensitivity
T TRP
Transmitter Radiated Power
May 15, 2009
H24 - Module Hrdware Description
Acr & Abbr-3
Abbreviation
Full Name
U UART
Universal Asynchronous Receiver Transmitter
U USB
Universal Serial Bus
U USSD
Unstructured Supplementary Services Data
V VCC
Voltage Common Collector
V VSWR
Voltage Standing Wave Ratio
V WCDMA
Wideband Code Division Multiple Access
Acr & Abbr-4
H24 - Module Hrdware Description
May 15, 2009
Index
Antenna Installation, x
Approvals
Regulatory, 6
Block Diagram Description, 9
Environmental
Specifications, 3
H24
Abbreviations, 2
Antenna Installation, x
Block Diagram Description, 9
Product Specifications, 2
Regulatory Approvals, 6
Safety Precautions, ix
Standards, x
Terms and Abbreviations, 2
User Operation, ix
Organization of Manual, xix
Physical Specifications, 2
Precautions, ix
Product Specifications, 3
Regulatory Approvals, 6
Safety Precautions, ix
Specifications, 2
Environmental, 3
Physical, 2
Standards, x
Terms, 2
User Operation, ix
May 15, 2009
H24 - Module Hardware Description
Index-1
Index
Index-2
U-U
H24 - Module Hardware Description
May 15, 2009
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@6802986C38@
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Title                           : H24 Cell Engine Module Description
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