SIMCom Wireless Solutions SIM7000A LTE CAT-M1(eMTC) Module User Manual TempConfidential SIM7000A V1 00 20170728
Shanghai SIMCom Wireless Solutions Limited LTE CAT-M1(eMTC) Module TempConfidential SIM7000A V1 00 20170728
Contents
- 1. TempConfidential_SIM7000A__User Manual_V1 00_20170728
- 2. SIM7000A__User Manual_V1 00
TempConfidential_SIM7000A__User Manual_V1 00_20170728
SIM7000A_User Manual_V1.01 Smart Machine Smart Decision Document Title SIM7000A_User Manual Version 1.00 Date 2017-5-23 Status Released Document Control ID SIM7000A_User Manual_V1.01 Compliance Information FCC Compliance Statement: This device complies the FCC Rules . Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. This device must accept any interference received, including interference that may cause undesired operation. Product that is a radio transmitter is labeled with FCC ID. FCC Caution: (1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. (2) Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment. (3) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. (4) Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user authority to operate the equipment. (5) the modules FCC ID is not visible when installed in the host, or (6) if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: 2AJYU-SIM7000A or Contains FCC ID: 2AJYU-SIM7000A must be used. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision General Notes SIMCom offers this information as a service to its customers to support the application and engineering efforts that use the products designed by SIMCom. The information provided is based on the requirements specifically from the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, the system validation of the product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change without notice. Copyright This document contains the proprietary technical information which is the property of SIMCom Limited, copying of this document, giving it to others, the using or communication of the contents thereof are forbidden without the official authority by SIMCom. Offenders are liable to the payment of the damages. All rights are reserved in the event of grant of a patent or the registration of a utility model or design. All specifications supplied herein are subject to change without notice Copyright © SIMCom Wireless Solutions Co., Ltd. 2017 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Contents Contents............................................................................................................................................... 4 Table Index.......................................................................................................................................... 6 Figure Index........................................................................................................................................ 7 Revision History..................................................................................................................................8 Introduction..................................................................................................................................9 1.1 Product Outline....................................................................................................................... 9 1.2 Hardware Interface Overview...............................................................................................10 1.3 Hardware Block Diagram..................................................................................................... 11 1.4 Functional Overview.............................................................................................................12 Package Information................................................................................................................. 14 2.1 Pin Assignment Overview.................................................................................................... 14 2.2 Pin Description......................................................................................................................16 2.3 Mechanical Information........................................................................................................19 2.4 Footprint Recommendation.................................................................................................. 20 Interface Application.................................................................................................................21 3.1 Power Supply........................................................................................................................ 21 3.1.1 Power Supply Design Guide..........................................................................................22 3.1.2 Recommended Power Supply Circuit............................................................................22 3.1.3 Voltage Monitor............................................................................................................. 23 3.2 Power on/Power off/Reset Function.....................................................................................24 3.2.1 Power on........................................................................................................................ 24 3.2.2 Power off........................................................................................................................ 25 3.2.3 Reset Function................................................................................................................26 3.3 UART Interface.....................................................................................................................27 3.3.1 UART Design Guide......................................................................................................27 3.3.2 RI and DTR Behavior.................................................................................................... 28 3.4 USB Interface........................................................................................................................29 3.5 SIM Interface........................................................................................................................ 30 3.5.1 SIM Application Guide.................................................................................................. 30 3.5.2 Recommended SIM Card Holder.................................................................................. 31 3.6 PCM Interface.......................................................................................................................32 3.6.1 PCM timing....................................................................................................................32 3.6.2 PCM Application Guide.................................................................................................34 3.7 I2C Interface......................................................................................................................... 34 3.8 Network status...................................................................................................................... 34 3.9 Other interface...................................................................................................................... 35 3.9.1 ADC............................................................................................................................... 35 3.9.2 LDO................................................................................................................................36 RF Specifications........................................................................................................................37 4.1 LTE CAT-M1RF Specifications............................................................................................37 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 4.2 LTE CAT-M1Antenna Design Guide....................................................................................40 4.3 GNSS.................................................................................................................................... 42 4.3.1 GNSS Technical specification....................................................................................... 42 4.3.2 GNSS Application Guide...............................................................................................42 Electrical Specifications............................................................................................................ 44 5.1 Absolute maximum ratings...................................................................................................44 5.2 Operating conditions.............................................................................................................44 5.3 Operating Mode.................................................................................................................... 45 5.3.1 Operating Mode Definition............................................................................................45 5.3.2 Sleep mode..................................................................................................................... 46 5.3.3 Minimum functionality mode and Flight mode.............................................................46 5.4 Current Consumption............................................................................................................47 5.5 ESD Notes.............................................................................................................................48 SMT Production Guide............................................................................................................. 49 6.1 Top and Bottom View of SIM7000.......................................................................................49 6.2 Label Information................................................................................................................. 50 6.3 Typical SMT Reflow Profile.................................................................................................51 6.4 Moisture Sensitivity Level (MSL)........................................................................................51 6.5 Stencil Foil Design Recommendation.................................................................................. 52 Packaging....................................................................................................................................53 7.1 tray packaging.......................................................................................................................53 Appendix............................................................................................................................................56 A. Reference Design....................................................................................................................... 56 B. Coding Schemes and Maximum Net Data Rates over Air Interface.........错误!未定义书签。 C. Related Documents.....................................................................................................................57 D. Terms and Abbreviations........................................................................................................... 59 E. Safety Caution.............................................................................................................................61 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table Index Table 1: SIM7000 frequency bands and air interface............................................................................................ 9 Table 2: General features..................................................................................................................................... 12 Table 3: Pin definition..........................................................................................................................................15 Table 4: IO parameters definition........................................................................................................................ 16 Table 5: Pin description........................................................................................................................................16 Table 6: VBAT pins electronic characteristic.......................................................................................................21 Table 7: Recommended Zener diode list..............................................................................................................22 Table 8: Power on timing and electronic characteristic....................................................................................... 25 Table 9: Power off timing and electronic characteristic.......................................................................................26 Table 10: RESET pin electronic characteristic.................................................................................................... 27 Table 11: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V)......................................................... 30 Table 12: SIM electronic characteristic 3.0V mode (SIM_VDD=2.95V)........................................................... 30 Table 13: Amphenol SIM socket pin description................................................................................................. 31 Table 14: PCM format..........................................................................................................................................32 Table 15: PCM timing parameters....................................................................................................................... 33 Table 16: NETLIGHT pin status..........................................................................................................................35 Table 17: ADC electronic characteristics............................................................................................................. 35 Table 18: Electronic characteristic....................................................................................................................... 36 Table 19: Conducted transmission power............................................................................................................ 37 Table 20: Operating frequencies.......................................................................................................................... 37 Table 21: E-UTRA operating bands..................................................................................................................... 38 Table 22: Conducted receive sensitivity.............................................................................................................. 38 Table 23: CAT-M1 Reference sensitivity (QPSK)............................................................................................... 39 Table 24: .............................................................................................................................错误!未定义书签。 Table 25: Trace loss..............................................................................................................................................40 Table 26: Recommended TVS............................................................................................. 错误!未定义书签。 Table 27: Absolute maximum ratings.................................................................................................................. 44 Table 28: Recommended operating ratings..........................................................................................................44 Table 29: 1.8V Digital I/O characteristics*..........................................................................................................44 Table 30: Operating temperature..........................................................................................................................45 Table 31: Operating mode Definition.................................................................................................................. 45 Table 32: Current consumption on VBAT Pins (VBAT=3.8V)........................................................................... 47 Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%).............................. 48 Table 35: The description of label information....................................................................................................50 Table 36: Moisture Sensitivity Level and Floor Life........................................................................................... 51 Table 37: Tray size............................................................................................................................................... 54 Table 38: Small Carton size................................................................................................................................. 54 Table 39: Big Carton size.....................................................................................................................................55 Table 39: Coding Schemes and Maximum Net Data Rates over Air Interface....................错误!未定义书签。 Table 40: Related Documents.............................................................................................................................. 57 Table 41: Terms and Abbreviations......................................................................................................................59 Table 42: Safety Caution......................................................................................................................................61 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Figure Index Figure 1: SIM7000 block diagram....................................................................................................................... 11 Figure 2: Pin assignment overview...................................................................................................................... 14 Figure 3: Dimensions (Unit: mm)........................................................................................................................ 19 Figure 4: Footprint recommendation (Unit: mm)................................................................................................ 20 Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)....................................................................21 Figure 6: Power supply application circuit.......................................................................................................... 22 Figure 7: Linear regulator reference circuit......................................................................................................... 23 Figure 8: Switching mode power supply reference circuit.................................................................................. 23 Figure 9: Reference power on/off circuit............................................................................................................. 24 Figure 10: Power on timing sequence..................................................................................................................24 Figure 11: Power off timing sequence................................................................................................................. 25 Figure 12: Reference reset circuit........................................................................................................................ 26 Figure 13: UART full modem.............................................................................................................................. 27 Figure 14: UART null modem............................................................................................................................. 27 Figure 15: Reference circuit of level shift............................................................................................................28 Figure 16: RI behaviour(SMS and URC report).............................................................................................28 Figure 17: RI behaviour(voice call)................................................................................................................29 Figure 18: USB reference circuit......................................................................................................................... 29 Figure 19: SIM interface reference circuit........................................................................................................... 30 Figure 20: Amphenol SIM card socket................................................................................................................ 31 Figure 21: PCM_SYNC timing............................................................................................................................32 Figure 22: External codec to module timing........................................................................................................32 Figure 23: Module to external codec timing........................................................................................................ 33 Figure 24: Audio codec reference circuit............................................................................................................. 34 Figure 25: I2C reference circuit........................................................................................................................... 34 Figure 26: NETLIGHT reference circuit............................................................................................................. 35 Figure 27:Power on sequence of the VDD_EXT..............................................................................................36 Figure 28: Antenna matching circuit (MAIN_ANT)........................................................................................... 41 Figure 29: Active antenna circuit......................................................................................................................... 43 Figure 30: Passive antenna circuit (Default)........................................................................................................43 Figure 31: Top and bottom view of SIM7000......................................................................................................49 Figure 32: Label information............................................................................................................................... 50 Figure 33: The ramp-soak-spike reflow profile of SIM7000...............................................................................51 Figure 34: packaging diagram..............................................................................................................................53 Figure 35: Tray drawing.......................................................................................................................................54 Figure 36: Small carton drawing..........................................................................................................................54 Figure 37: Big carton drawing............................................................................................................................. 54 Figure 38: Reference design.................................................................................................................................56 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Revision History Data Version Description of change Author 2017-05-23 1.00 Original Tu Hongjun Li Ya SIM7000 _Hardware Design _V1.00 2017-05-23 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom SIM7000A module. With the help of this document and SIM7000A software application notes/user guides, users can understand and use SIM7000A module to design and develop applications quickly. 1.1 Product Outline The SIM7000 series modules support LTE CAT-M1 The physical dimension of SIM7000A is 24 × 24 × 2.6mm mm. And the physical dimension is compatible with the packaging of SIM900, SIM800 and SIM800F. Table 1: SIM7000A frequency bands and air interface Standard GSM Frequency SIM7000A EGSM900MHz DCS1800MHz LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD* HD-FDD LTE-FDD B6 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-TDD* LTE CAT-M1TDD B39 Category LTE-M1 GNSS Smart Machine Smart Decision 1.2 Hardware Interface Overview The interfaces are described in detail in the next chapters include: ● Power Supply ● USB Interface ● UART Interface ● SIM Interface ● ADC ● LDO Power Output ● PCM Interface ● I2C Interface ● GPIOs ● Antenna Interface SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 1.3 Hardware Block Diagram The block diagram of the SIM7000A module is shown in the figure below. Figure 1: SIM7000 block diagram SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 1.4 Functional Overview Table 2: General features Feature Implementation Power supply Power supply voltage 3.0~4.3V Power saving Current in sleep mode: 1mA Current in PSM mode: 9uA Radio frequency bands Transmitting power Please refer to the table 1 LTE CAT-M1power class: 3 (0.25W) Data Transmission Throughput LTE CAT-M1CAT M1: 300Kbps (DL) LTE CAT-M1CAT M1: 375Kbps (UL) Antenna LTE CAT-M1main antenna. GNSS antenna GNSS GNSS engine (GPS,GLONASS and BD) Protocol: NMEA SMS MT, MO, CB, Text and PDU mode SMS storage: SIM card or ME(default) SIM interface Support identity card: 1.8V/ 3V SIM application toolkit Support SAT class 3, GSM 11.14 Release 98 Support USAT Audio feature Support PCM interface Only support PCM master mode and short frame sync, 16-bit linear data formats UART interface A full modem serial port by default Baud rate: 300bps to 4Mbps(default:115200bps) Can be used as the AT commands or data stream channel Support RTS/CTS hardware handshake Multiplex ability according to GSM 07.10 Multiplexer Protocol USB USB 2.0 high speed interface Firmware upgrade Firmware upgrade over USB interface Physical characteristics Size:24 × 24 × 2.6mm Weight:3g Temperature range Normal operation temperature: -30°C to + 80°C Extended operation temperature: -40°C to + 85°C* Storage temperature -45°C to + 90°C *Note: Module is able to make and receive voice calls, data calls, SMS and make GPRS/LTE CAT-M1traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 2 Package Information 2.1 Pin Assignment Overview All functions of the SIM7000A will be provided through 68 pads that will be connected to the customers’ platform. The following Figure is a high-level view of the pin assignment of the SIM7000. Figure 2: Pin assignment overview SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table 3: Pin definition Pin No. Pin Name Pin No. Pin Name PWRKEY GND DTR RI DCD BOOT_CFG CTS RTS TXD 10 RXD 11 PCM_CLK 12 PCM_SYNC 13 PCM_DIN 14 PCM_DOUT 15 VDD_EXT 16 NRESET 17 GND 18 GND 19 NC 20 NC 21 NC 22 NC 23 MDM_LOG_TX 24 USB_VBUS 25 ADC 26 NC 27 USB_DP 28 USB_DM 29 GND 30 SIM_VDD 31 SIM_DATA 32 SIM_CLK 33 SIM_RST 34 SIM_DET 35 NC 36 NC 37 I2C_SDA 38 I2C_SCL 39 GND 40 NC 41 NC 42 NC 43 NC 44 NC 45 GND 46 GND 47 NC 48 GPIO4 49 GPIO1/UART3_RXD 50 GPIO0/UART3_TXD 51 NC 52 NETLIGHT 53 GNSS_ANT 54 GND 55 VBAT 56 VBAT 57 VBAT 58 GND 59 GND 60 RF_ANT 61 GND 62 GND 63 GND 64 GND 65 GND 66 STATUS 67 GPIO2 68 GPIO3 NOTE: Before the normal power up, BOOT_CFG cannot be pulled up. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 2.2 Pin Description Table 4: IO parameters definition Pin type Description PI Power input PO Power output AI Analog input AIO Analog input/output I/O Bidirectional input /output DI Digital input DO Digital output DOH Digital output with high level DOL Digital output with low level PU Pull up PD Pull down Table 5: Pin description Pin name Pin No. Default status Description Comment Power supply VBAT 55、56、 PI 57 VDD_EXT 15 GND 2、17、 18、29、 39、45、 46、54、 58、59、 61、62、 63、64、 65 PO Power supply, voltage range: 3.0~4.3V. LDO power output 1.8V for other external circuits with Max 50mA current output, such as level shift circuit. If unused, keep it open. Ground System Control PWRKEY NRESET 16 DI,PU System power on/off control input, active low. The efficient input level must be below 0.5V. The level is 0.8V when this PIN is floating; DI, PU System reset control input, active low. NRESET has been pulled up to 1.8V via 40Kohm resistor internally. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision SIM interface SIM_DATA 31 I/O,PU SIM Card data I/O, which has been pulled up via a 10KR resistor to SIM_VDD internally. Do not pull it up or down externally. SIM_RST 33 DO SIM Reset SIM_CLK 32 DO SIM clock PO Power output for SIM card, its output Voltage depends on SIM card type automatically. Its output current is up to 50mA. SIM_VDD SIM_DET 30 34 DI SIM card detecting input USB_VBUS 24 DI,PD Valid USB detection input with 3.5~5.25V detection voltage USB_DP 27 I/O Positive line of the differential, bi-directional USB signal. USB_DM 28 I/O Negative line of the differential, bi-directional USB signal. DTR DI,PU DTE get ready RI DOH Ring Indicator DCD CTS DOH DOH Carrier detects Clear to Send RTS DI,PU Request to send TXD DOH Transmit Data RXD 10 DI,PU Receive Data I2C_SDA 37 I/O I2C clock output I2C_SCL 38 DO I2C data input/output PCM_CLK 11 DO PCM data bit clock. PCM_SYNC 12 DO PCM data frame sync signal. PCM_DIN 13 DI PCM data input. PCM_DOUT 14 DO PCM data output. All lines of SIM interface should be protected against ESD. If used, keep a 10k Ω resistor pulling up to the VDD_EXT USB UART interface If unused, keep them open. I2C interface If unused, keep open, or else pull them up via 2.2KΩ resistors to the VDD_EXT. PCM interface SIM7000 _Hardware Design _V1.00 If unused, please keep them open. 2017-05-23 Smart Machine Smart Decision GPIO LED control output as network status indication. Operating status output. High level: Power on and firmware ready Low level: Power off Default: GPIO Optional: UART3_TXD Default: GPIO Optional: UART3_RXD NETLIGHT 52 DO STATUS 66 DO GPIO0 50 IO GPIO1 49 IO GPIO2 67 IO GPIO GPIO3 68 IO GPIO GPIO4 48 IO GPIO GNSS_ANT 53 AI GNSS antenna soldering pad RF_ANT 60 AIO MAIN antenna soldering pad If unused, keep them open. RF interface Other interface Reserve two test points for BOOT_CFG and VDD_EXT. DO NOT PULL UP BOOT_CFG DURING NORMAL POWER UP! BOOT_CFG DI,PD Boot configuration input. Module will be forced into USB download mode by connect this pin to VDD_EXT during power up. MDM_LOG_T 23 DO Module log output for SW Reserve a test point for debug. (only used for platform) this pin. ADC 25 AI Analog-digital converter input. voltage range: 0.1~1.7V. If unused, keep them open. NC 19、20、 21、 22、 26、35、 36、40、 41、 42、 43、 44、 47、 51、 No connection. Keep it open SIM7000 _Hardware Design _V1.00 2017-05-23 2.3 Mechanical Information The following figure shows the package outline drawing of SIM7000. Figure 3: Dimensions (Unit: mm) Smart Machine Smart Decision 2.4 Footprint Recommendation Figure 4: Footprint recommendation (Unit: mm) SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 3 Interface Application 3.1 Power Supply Pin 55, pin 56 and pin 57 are VBAT power input. On VBAT pads, the ripple current up to 0.6A typically due to LTE CAT-M1emission burst and up to 2A typically due to GSM/GPRS emission burst (every 4.615ms). It may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop is more than 300mV. The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase in GSM emission mode. Figure 5: VBAT voltage drop during burst emission (GSM/GPRS) Note: The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 µF tantalum capacitor (ESR=0.7Ω) and Cf =100nF (Please refer to Figure 6—Application circuit). Table 6: VBAT pins electronic characteristic Symbol Description Min. Typ. Max. Unit VBAT Module power voltage 3.0 3.8 4.3 Module power peak current in GSM emission mode. 0.6 IVBAT(peak) Module power peak current in LTE CAT-M1emission mode. IVBAT(average) Module power average current in normal mode IVBAT(sleep) Power supply current in sleep mode IVBAT(power-off) Module power current in power off mode. SIM7000 _Hardware Design _V1.00 Please refer to the table 32 uA 2017-05-23 Smart Machine Smart Decision 3.1.1 Power Supply Design Guide Make sure that the voltage on the VBAT pins will never drop below 3.0V, even during a transmit burst, when current consumption may rise up to 2A. If the voltage drops below 3.0V, module will be work abnormally. Note: If the power supply for VBAT pins can support up to 2A, using a total of more than 300uF capacitors is recommended, or else users must using a total of 1000uF capacitors typically, in order to avoid the voltage drop is more than 300mV. Some multi-layer ceramic chip (MLCC) capacitors (0.1uF, 1uF) with low ESR in high frequency band can be used for EMC. These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the recommended circuit. Figure 6: Power supply application circuit In addition, for over voltage protection, it is suggested to use a zener diode with 5.1V reverse voltage and more than 500mW power dissipation. Table 7: Recommended Zener diode list No. Manufacturer Part Number Power dissipation Package On semi MMSZ5231BT1G 500mW SOD123 Prisemi PZ3D4V2H 500mW SOD323 Vishay MMSZ4689-V 500mW SOD123 Crownpo CDZ55C5V1SM 500mW 0805 3.1.2 Recommended Power Supply Circuit It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2A. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision The following figure shows the linear regulator reference circuit with 5V input and 3.8V output. Figure 7: Linear regulator reference circuit If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is extremely important, then a switching mode power supply will be preferable. The following figure shows the switching mode power supply reference circuit. Figure 8: Switching mode power supply reference circuit Note: The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic Interference and ripple current from depraving RF performance. 3.1.3 Voltage Monitor To monitor the VBAT voltage, the AT command “AT+CBC” can be used. To monitor whether the VBAT voltage is inside a special range, the AT command “AT+CBATCHK” can be used to enable the overvoltage warning function and the under-voltage warning function. The default value of the overvoltage warning function in the software is 4.3V, and the default value of the under-voltage warning function is 3.1V. When the VBAT voltage is out of the range, the module will be power off. If users need to power off SIM7000 when the VBAT voltage is out of the range, the AT command “AT+CBATCHK” can be used to enable the overvoltage power-off function and the under-voltage power-off function. The default value of the overvoltage power-off function in the software is 4.4V, and the default value of the under-voltage power-off function is 2.9V. Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1]. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 3.2 3.2.1 Power on/Power off/Reset Function Power on SIM7000 can be powered on by pulling the PWRKEY pin to ground. The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a 100nF capacitor and an ESD protection diode close to the PWRKEY pin, as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference circuit. Figure 9: Reference power on/off circuit The power-on scenarios are illustrated in the following figure. Figure 10: Power on timing sequence SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table 8: Power on timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit Ton The time of active low level impulse of PWRKEY pin to power on module 72 ms Ton(status) The time from power-on issue to STATUS pin output high level(indicating power up ready ) 4.2 Ton(uart) The time from power-on issue to UART port ready 3.5 Ton(usb) The time from power-on issue to USB port ready 3.5 VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 VIL Input low level voltage on PWRKEY pin -0.3 0.5 3.2.2 Power off The following methods can be used to power off SIM7000. ● Method 1: Power off SIM7000 by pulling the PWRKEY pin to ground. ● Method 2: Power off SIM7000 by AT command “AT+CPOWD”. ● Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by AT command “AT+CBATCHK”. ● Method 4: over-temperature or under-temperature automatic power off. Note: If the temperature is outside the range of -30~+80℃, some warning will be reported via AT port. If the temperature is outside the range of -40~+85℃, SIM7000 will be powered off automatically. For details about “AT+CPOWD” and “AT+CBATCHK”, please refer to Document [1]. These procedures will make modules disconnect from the network and allow the software to enter a safe state, and save data before module be powered off completely. The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure. Figure 11: Power off timing sequence SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table 9: Power off timing and electronic characteristic Symbol Parameter Toff Time value Min. Unit Typ. Max. The active low level time pulse on PWRKEY pin to 1.2 power off module Toff(status) The time from power-off issue to STATUS pin output low 1.3 level(indicating power off )* Toff(uart) The time from power-off issue to UART port off 1.3 Toff(usb) The time from power-off issue to USB port off 1.3 Toff-on The buffer time from power-off issue to power-on issue *Note: The STATUS pin can be used to detect whether module is powered on or not. When module has been powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low level. 3.2.3 Reset Function SIM7000 can be reset by pulling the RESET pin to ground. Note: This function is only used as an emergency reset. The RESET pin will be ineffectiveness in the power off mode. The RESET pin has been pulled up to 1.8V with a 40KΩ resistor internally. So it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the RESET pin. Please refer to the following figure for the recommended reference circuit. Figure 12: Reference reset circuit SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table 10: RESET pin electronic characteristic Symbol Description Min. Typ. Max. Unit Treset The active low level time impulse on RESET pin to reset module 50 100 500 ms VIH Input high level voltage 1.2 1.8 2.1 VIL Input low level voltage -0.3 0.8 3.3 UART Interface SIM7000 provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE (Data Communication Equipment). AT commands and data transmission can be performed through UART interface. Moreover, if users need to use two UART simultaneously, SIM7000 also provides a 2-wire UART interface multiplex from GPIO. The GPIO0 multiplex as TXD of the 2-wire UART, and the GPIO1 multiplex as RXD of the 2-wire UART. Standard version cannot support this function 3.3.1 UART Design Guide The following figures show the reference design. Figure 13: UART full modem Figure 14: UART null modem SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision The SIM7000 UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design. Figure 15: Reference circuit of level shift To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect SIM7000 to the RS-232-C interface, for example SP3238ECA, etc. Note: SIM7000 supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate is 115200bps. 3.3.2 RI and DTR Behavior The RI pin description: The RI pin can be used to interrupt output signal to inform the host controller such as application CPU. Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming, and then it will change to low level. It will stay low until the host controller clears the interrupted event with “AT+CRIRS” AT command. Figure 16: RI behaviour(SMS and URC report) SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up. Figure 17: RI behaviour(voice call) Note: For more details of AT commands about UART, please refer to document [1] and [22]. The DTR pin description: After setting the AT command “AT+CSCLK=1”, SIM7000 will enter sleep mode by pulling up the DTR pin when module is in the idle mode. In sleep mode, the UART is unavailable. When SIM7000 enters sleep mode, pulling down DTR can wake up module. 3.4 USB Interface The SIM7000 contains a USB interface compliant with the USB2.0 specification as a peripheral, but the USB charging function is not supported. SIM7000 supports the USB suspend and resume mechanism which can reduce power consumption. If there is no data transmission on the USB bus, SIM7000 will enter suspend mode automatically, and will be resumed by some events such as voice call, receiving SMS, etc. Figure 18: USB reference circuit Because of the high speed on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Typically, the capacitance of the D1 and D2 should be less than 1pF. D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could add a ZENER diode for surge clamping. Note:The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential impedance. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 3.5 SIM Interface SIM7000 supports both 1.8V and 3.0V SIM Cards. Table 11: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) Symbol Parameter Min. Typ. Max. Unit SIM_V DD LDO power output voltage 1.75 1.8 1.95 VIH High-level input voltage 0.65*SIM_VDD SIM_VDD +0.3 VIL Low-level input voltage -0.3 0.35*SIM_VDD VOH High-level output voltage SIM_VDD -0.45 SIM_VDD VOL Low-level output voltage 0.45 Table 12: SIM electronic characteristic 3.0V mode (SIM_VDD=2.95V) Symbol Parameter Min. Typ. Max. Unit SIM_V DD LDO power output voltage 2.75 2.95 3.05 VIH High-level input voltage 0.65*SIM_VDD SIM_VDD +0.3 VIL Low-level input voltage -0.3 0.25*SIM_VDD VOH High-level output voltage SIM_VDD -0.45 SIM_VDD VOL Low-level output voltage 0.45 3.5.1 SIM Application Guide It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST (www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the SIM peripheral circuit should be close to the SIM card socket. The following figure shows the 6-pin SIM card holder reference circuit. Figure 19: SIM interface reference circuit SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Note: SIM_DATA has been pulled up with a 10KΩ resistor to SIM_VDD in module. A 100nF capacitor on SIM_VDD is used to reduce interference. For more details of AT commands about SIM, please refer to document [1].SIM_CLK is very important signal, the rise time and fall time of SIM_CLK should be less than 40ns, otherwise the SIM card might not be initialized correctly. If SIM_DET is used, a 10KΩ resistor is necessary to pulling up to the power VDD_EXT. 3.5.2 Recommended SIM Card Holder It is recommended to use the 6-pin SIM socket such as C707 10M006 512 produced by Amphenol. User can visit http://www.amphenol.com for more information about the holder. Figure 20: Amphenol SIM card socket Table 13: Amphenol SIM socket pin description Pin C1 C2 C3 C5 C6 C7 Signal SIM_VDD SIM_RST SIM_CLK GND VPP SIM_DATA SIM7000 _Hardware Design _V1.00 Description SIM Card Power supply. SIM Card Reset. SIM Card Clock. Connect to GND. SIM Card data I/O. 2017-05-23 3.6 PCM Interface SIM7000 provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format. Table 14: PCM format Characteristics Specification Line Interface Format Linear(Fixed) Data length 16bits(Fixed) PCM Clock/Sync Source Master Mode(Fixed) PCM Clock Rate 2048 KHz (Fixed) PCM Sync Format Short sync(Fixed) Data Ordering MSB Note: For more details about PCM AT commands, please refer to document [1]. 3.6.1 PCM timing SIM7000 supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec. Figure 21: PCM_SYNC timing Figure 22: External codec to module timing Smart Machine Smart Decision Figure 23: Module to external codec timing Table 15: PCM timing parameters Parameter Description Min. Typ. Max. Unit T(sync) PCM_SYNC cycle time – 125 – μs T(synch) PCM_SYNC high level time – 488 – ns T(syncl) PCM_SYNC low level time – 124.5 – μs T(clk) PCM_CLK cycle time – 488 – ns T(clkh) PCM_CLK high level time – 244 – ns T(clkl) PCM_CLK low level time – 244 – ns T(susync) PCM_SYNC setup time high before falling edge – of PCM_CLK 122 – ns T(hsync) PCM_SYNC hold time after falling edge of PCM_CLK – 366 – ns T(sudin) PCM_IN setup time before falling edge of PCM_CLK 60 – – ns T(hdin) PCM_IN hold PCM_CLK 60 – – ns T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns T(zdout) Delay from PCM_CLK falling to PCM_OUT – HIGH-Z – 60 ns SIM7000 _Hardware Design _V1.00 time after falling edge of 2017-05-23 Smart Machine Smart Decision 3.6.2 PCM Application Guide The following figure shows the external codec reference design. Figure 24: Audio codec reference circuit 3.7 I2C Interface SIM7000 provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400 kbps. Its operation voltage is 1.8V. The following figure shows the I2C bus reference design. Figure 25: I2C reference circuit Note : I2C_SDA and I2C_SCL do not have pull-up resistors in module. So the two external pulling up resistors are needed in application circuit. “AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the I2C peripheral devices. For more details about AT commands please refer to document [1]. 3.8 Network status The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision following figure. Figure 26: NETLIGHT reference circuit Note: The value of the resistor named “R” depends on the LED characteristic. Table 16: NETLIGHT pin status NETLIGHT pin status 64ms ON, 800ms OFF 64ms ON, 3000ms OFF 64ms ON, 300ms OFF Module status No registered network Registered network Data transmit OFF Power off or PSM mode Note: NETLIGHT output low level as “OFF”, and high level as “ON”. 3.9 3.9.1 Other interface ADC SIM7000 has a dedicated ADC pin. It is available for digitizing analog signals such as battery voltage and so on. The electronic specifications are shown in the following table. Table 17: ADC electronic characteristics Characteristics Min. Typ. Max. Unit Resolution Conversion time – 15 – – 442 – Bits ms SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Input Range 0.1 Input serial resistance – 1.7 – MΩ Note: “AT+CADC” can be used to read the voltage of the ADC pin, for more details, please refer to document [1]. 3.9.2 LDO SIM7000 has a LDO power output named VDD_EXT. The output voltage is 1.8V. Figure 27:Power on sequence of the VDD_EXT Table 18: Electronic characteristic Symbol Description Min. Typ. Max. Unit VVDD_EXT Output voltage 1.7 1.8 1.9 IO Output current 50 mA Note:The VDD_EXT is used to the IO power in the module. The Output voltage is not supported to set. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 4 RF Specifications 4.1 LTE CAT-M1 RF Specifications Table 19: Conducted transmission power Frequency LTE-FDD B2 LTE-FDD B4 LTE-FDD B12 LTE-FDD B13 Power 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB Min. <-40dBm <-40dBm <-40dBm <-40dBm Table 20: Operating frequencies Frequency GPS L1 BAND Receiving 1574.4 ~1576.44 MHz Transmission GLONASS 1598 ~1606 MHz BD LTE CAT-M1BAND 1559 ~1563 MHz Refers to Table 21 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table 21: E-UTRA operating bands E-UTRA UL Freq. DL Freq. Duplex Mode 1920 ~1980 MHz 2110 ~2170 MHz HD-FDD 1710 ~1785 MHz 1805 ~1880 MHz HD-FDD 824 ~849 MHz 869 ~894 MHz HD-FDD 830 ~840 MHz 875 ~885 MHz HD-FDD 880 ~915 MHz 925 ~960 MHz HD-FDD 12 699 ~716 MHz 729 ~746 MHz HD-FDD 13 777 ~787 MHz 746 ~756 MHz HD-FDD 18 815 ~830 MHz 860 ~875 MHz HD-FDD 19 830 ~845 MHz 875 ~890 MHz HD-FDD 26 814 ~849 MHz 859 ~894 MHz HD-FDD 39 1880 ~1920 MHz 1880 ~1920 MHz TDD Table 22: Conducted receive sensitivity Frequency Receive sensitivity(Typical) LTE CAT-M1FDD/TDD SIM7000 _Hardware Design _V1.00 Receive sensitivity(MAX) Refers to Table 23 2017-05-23 Smart Machine Smart Decision Table 23: CAT-M1 Reference sensitivity (QPSK) E-UTRA Band REFSENS (dBm) Duplex Mode -103 HD-FDD -101 HD-FDD -100 HD-FDD -103 HD-FDD -101.5 HD-FDD -101 HD-FDD -100.5 HD-FDD 11 -103 HD-FDD 12 -100 HD-FDD 13 -100 HD-FDD 18 -103 HD-FDD 19 -103 HD-FDD 20 -100.5 HD-FDD 21 -103 HD-FDD 26 -101 HD-FDD 27 -101.5 HD-FDD 28 -101.5 HD-FDD 31 -97.3 HD-FDD 39 -103.7 TDD 41 -101.7 TDD Maximum Power Reduction (MPR) Modulation Channel bandwidth / Transmission bandwidth (NRB) MPR (dB) 1.4 3.0 10 15 20 MHz MHz MHz MHz MHz MHz QPSK >2 >2 >1 >4 ≤1 QPSK >5 >5 ≤2 16 QAM ≤2 ≤2 >1 >3 ≤1 16QAM >2 >2 >3 >5 ≤2 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 4.2 LTE CAT-M1 Antenna Design Guide Users should connect antennas to SIM7000’s antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements: Table 24: Trace loss Frequency Loss 700MHz-960MHz <0.5dB 1710MHz-2170MHz <0.9dB 2300MHz-2650MHz <1.2dB To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Figure 28: Antenna matching circuit (MAIN_ANT) In figure 28, the components L101,C106,C107 and R101 or R102 are used for antenna matching, SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision the values of components can only be achieved after the antenna tuning and usually provided by antenna vendor. By default, the L101,R101or R102 are 0 Ω resistors, and the C106, C107 are reserved for tuning. The RF test connector is used for the conducted RF performance test, and should be placed as close as to the module’s MAIN_ANT pin. The traces impedance between SIM7000 and antenna must be controlled in 50Ω. 4.3 GNSS SIM7000 merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a high-availability solution that offers industry-leading accuracy and performance. This solution performs well, even in very challenging environmental conditions where conventional GNSS receivers fail, and provides a platform to enable wireless operators to address both location-based services and emergency mandates. 4.3.1 GNSS Technical specification Tracking sensitivity: -162 dBm(GPS)/-158 dBm(GLONASS)/TBD (BD) Cold-start sensitivity: -148 dBm Accuracy (Open Sky): 2.5m (CEP50) TTFF (Open Sky) : Hot start <1s, Cold start<35s Receiver Type: 16-channel, C/A Code GPS L1 Frequency: 1575.42±1.023MHz GLONASS: 1597.5~1605.8 MHz BD: 1559.05~1563.14 MHz Update rate: Default 1 Hz GNSS data format: NMEA-0183 GNSS Current consumption : 100mA (GSM/LTE CAT-M1Sleep ,in total on VBAT pins) GNSS antenna: Passive/Active antenna Note: If the antenna is active type, the power should be given by main board because there is no power supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external LNA should be used. 4.3.2 GNSS Application Guide Users can adopt an active antenna or a passive antenna to SIM7000. If using a passive antenna, an external LNA is a must to get better performance. The following figures are the reference circuits. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Figure 29: Active antenna circuit Figure 30: Passive antenna circuit (Default) In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna and V_LNA need external power supplies which should be considered according to active antenna and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by shutting down active antennas and LNA when GNSS is not working. GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS, user should configure SIM7000 in proper operating mode by AT command. Please refer to related documents for details. SIM7000 can also get position location information through AT directly. Note: 1. GNSS is closed by default and can be started by “AT+CGNSPWR=1”. The AT command has two parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode. AGPS mode needs more support from the mobile telecommunication network. Please refer to document [24] for more details. 2. If the passive antenna is used, put the LNA close to the antenna. 3. Make sure there are no noise signals around GNSS antenna. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 5 Electrical Specifications 5.1 Absolute maximum ratings Absolute maximum rating for digital and analog pins of SIM7000 are listed in the following table: Table 26: Absolute maximum ratings Parameter Voltage at VBAT Voltage at USB_VBUS Voltage at digital pins (RESET,GPIO,I2C,UART,PCM) Voltage at digital pins (SIM) Voltage at PWRKEY 5.2 Min. -0.5 -0.5 Typ. Max. 6.0 5.85 Unit -0.3 2.1 -0.3 -0.3 3.05 1.8 Min. 3.0 3.5 Typ. 3.8 5.0 Max. 4.3 5.25 Unit Operating conditions Table 27: Recommended operating ratings Parameter Voltage at VBAT Voltage at USB_VBUS Table 28: 1.8V Digital I/O characteristics* Parameter Description Min. Typ. Max. Unit VIH High-level input voltage 1.17 1.8 2.1 VIL Low-level input voltage -0.3 0.63 VOH High-level output voltage 1.35 1.8 VOL Low-level output voltage 0.45 IOH High-level output current(no pull down resistor) mA IOL Low-level output current(no pull up resistor) -2 mA IIH Input high leakage current (no pull down resistor) uA IIL Input low leakage current(no pull up resistor) -1 uA SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision *Note: These parameters are for digital interface pins, such as GPIOs (including NETLIGHT,STATUS,SIM_DET), I2C, UART, PCM, MDM_LOG_TX and BOOT_CFG. The operating temperature of SIM7000 is listed in the following table. Table 29: Operating temperature Parameter Normal operation temperature Min. -30 Typ. 25 Max. 80 Unit ℃ Extended operation temperature* -40 25 85 ℃ Storage temperature -45 25 +90 ℃ *Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/LTE CAT-M1traffic in -40 ℃ ~ +85 ℃ . The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range. 5.3 Operating Mode 5.3.1 Operating Mode Definition The table below summarizes the various operating modes of SIM7000 product. Table 30: Operating mode Definition Normal operation Mode Function LTE CAT-M1Sleep In this case, the current consumption of module will be reduced to the minimal level and the module can still receive paging message and SMS. /LTE CAT-M1Idle Software is active. Module is registered to the network, and the module is ready to communicate. LTE CAT-M1Talk Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antenna. LTE CAT-M1Standby Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. LTEData transmission There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level); uplink/downlink data rates, etc. Minimum functionality mode SIM7000 _Hardware Design _V1.00 AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work and the SIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is lower 2017-05-23 Smart Machine Smart Decision than normal mode. Flight mode AT command “AT+CFUN=4” can be used to set the module to flight mode without removing the power supply. In this mode, the RF part of the module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode. PSM mode Setting the timer of the software can be entered PSM mode. In this mode, the module will be the least current consumption. Meanwhile, all the output of the LDO and DCDC in the module will be closed except the RTC power. And also all of the functions will be unavailable except the RTC function. RTC timer can wake up the module. Power off mode Module will go into power off mode by sending the AT command “AT+CPOWD” or pull down the PWRKEY pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible. 5.3.2 Sleep mode In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still receive paging message and SMS. Several hardware and software conditions must be satisfied together in order to let SIM7000 enter sleep mode: 1. UART condition 2. USB condition 3. Software condition Note: Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26] for more details. 5.3.3 Minimum functionality mode and Flight mode Minimum functionality mode ceases a majority function of the module, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels. AT+CFUN=0: Minimum functionality ● AT+CFUN=1: Full functionality (Default) ● AT+CFUN=4: Flight mode ● If SIM7000 has been set to minimum functionality mode, the RF function and SIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and SIM card will be unavailable. If SIM7000 has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision When SIM7000 is in minimum functionality or flight mode, it can return to full functionality by the AT command “AT+CFUN=1”. 5.4 Current Consumption The current consumption is listed in the table below. Table 31: Current consumption on VBAT Pins (VBAT=3.8V) GNSS GNSS supply current (AT+CFUN=0,with USB connection) Tracking Typical: 34mA LTE CAT-M1sleep/idle mode LTE CAT-M1supply current (GNSS off,without USB connection) Sleep mode Typical: 1mA Idle mode Typical: 11mA LTE CAT-M1Talk TBD TBD TBD TBD LTE CAT-M1data LTE-FDD B2 @23dbm Typical: 160mA @10dbm Typical: 116mA @0dbm Typical: 102mA LTE-FDD B4 @23dbm Typical: 168mA @10dbm Typical: 117mA @0dbm Typical: 113mA LTE-FDD B12 @23dbm Typical: 167mA @10dbm Typical: 109mA @0dbm Typical: 96mA LTE-FDD B13 @23dbm Typical: 167mA @10dbm Typical: 109mA @0dbm Typical: 98mA SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 5.5 ESD Notes SIM7000 is sensitive to ESD in the process of storage, transporting, and assembling. When SIM7000 is mounted on the users’ mother board, the ESD components should be placed beside the connectors which human body may touch, such as SIM card holder, audio jacks, switches, keys, etc. The following table shows the SIM7000 ESD measurement performance without any external ESD component. Table 32: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) Part Contact discharge Air discharge VBAT,GND +/-6K +/-12K Antenna port +/-5K +/-10K USB +/-4K +/-8K UART +/-4K +/-8K Other PADs +/-3K +/-6K SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 6 SMT Production Guide 6.1 Top and Bottom View of SIM7000 Figure 31: Top and bottom view of SIM7000 SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 6.2 Label Information Figure 32: Label information Table 33: The description of label information No. Description LOGO No.1 Pin Project name Product code Serial number International mobile equipment identity QR code SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 6.3 Typical SMT Reflow Profile SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints. Figure 33: The ramp-soak-spike reflow profile of SIM7000 Note: For more details about secondary SMT, please refer to the document [21]. 6.4 Moisture Sensitivity Level (MSL) SIM7000 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not heat-resistant, and only can be baked at 45° C. Table 34: Moisture Sensitivity Level and Floor Life Moisture Sensitivity Level Floor Life (out of bag) at factory ambient≤30°C/60% RH or as (MSL) stated Unlimited at ≦30℃/85% RH 1 year 2a 4 weeks 168 hours 72 hours 48 hours 5a 24 hours Mandatory bake before use. After bake, it must be reflowed within the SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision time limit specified on the label. NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage. 6.5 Stencil Foil Design Recommendation The recommended thickness of stencil foil is 0.15mm. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision 7 Packaging 7.1 tray packaging SIM7000 module support tray packaging (default packaging). Figure 34: packaging diagram Module tray drawing: SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Figure 35: Tray drawing Table 35: Tray size Length(±3mm) Width(±3mm) Module number 161.0 20 242.0 Small carton drawing: Figure 36: Small carton drawing Table 36: Small Carton size Length(±10mm) Width(±10mm) Height(±10mm) Module number 180 120 20*20=400 270 Big carton drawing: Figure 37: Big carton drawing SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Table 37: Big Carton size Length(±10mm) Width(±10mm) Height(±10mm) Module number 280 280 400*4=1600 380 SIM7000 _Hardware Design _V1.00 2017-05-23 Appendix A. Reference Design Refer to < SIM7000 Reference Design V1.01> for the details. Figure 38: Reference design Smart Machine Smart Decision B. Related Documents Table 38: Related Documents NO. [1] [2] Title SIM7X00 Series_AT Command Manual_V1.xx ITU-T Draft new recommendationV.25ter Description AT Command Manual Serial asynchronous automatic dialing and control Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information Digital cellular telecommunications system (Phase 2) ; Mobile Station (MS) conformance specification ; Part 1: Conformance specification [3] GSM 07.07 [4] GSM 07.10 [5] GSM 07.05 [6] GSM 11.14 [7] GSM 11.11 [8] GSM 03.38 [9] GSM 11.10 [10] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification [11] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. [12] 3GPP TS 34.121 [13] 3GPP TS 34.123-1 [14] 3GPP TS 34.123-3 [15] EN 301 908-02 V2.2.1 [16] EN 301 489-24 V1.2.1 [17] IEC/EN60950-1(2001) SIM7000 _Hardware Design _V1.00 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3: Abstract Test Suites. Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment Safety of information technology equipment (2000) 2017-05-23 Smart Machine Smart Decision [18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification [19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria [20] 2002/95/EC [21] [22] Module secondary-SMT-UGD-V1.xx SIM7X00 Series_UART_Application Note_V1.xx [23] SIM7X00 Series_USB AUDIO_Application Note_V1.xx [24] [25] [26] SIM7X00 Series_GPS_Application Note_V1.xx Antenna design guidelines for diversity receiver system SIM7X00 Series_Sleep Mode_ Application Note_V1.xx SIM7000 _Hardware Design _V1.00 Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Module secondary SMT Guidelines This document describes how to use UART interface of SIMCom modules. USB AUDIO Application Note GPS Application Note Antenna design guidelines for diversity receiver system Sleep Mode Application Note 2017-05-23 Smart Machine Smart Decision C. Terms and Abbreviations Table 39: Terms and Abbreviations Abbreviation ADC ARP BER BD BTS CS CSD CTS DAC DRX DSP DTE DTR DTX EFR EGSM EMC ESD ETS EVDO FCC FD FDMA FR GMSK GNSS GPRS GPS GSM HR HSPA I2C IMEI LTE MO MS MT NMEA PAP PBCCH PCB Description Analog-to-Digital Converter Antenna Reference Point Bit Error Rate BeiDou Base Transceiver Station Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Evolution Data Only Federal Communications Commission (U.S.) SIM fix dialing phonebook Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Global Standard for Mobile Communications Half Rate High Speed Packet Access Inter-Integrated Circuit International Mobile Equipment Identity Long Term Evolution Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated National Marine Electronics Association Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision PCS RF RMS RTC SIM SMS SMPS TDMA TE TX UART VSWR SM NC EDGE HSDPA HSUPA ZIF WCDMA VCTCXO SIM UMTS UART PSM Personal Communication System, also referred to as GSM 1900 Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service Switched-mode power supply Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook Not connect Enhanced data rates for GSM evolution High Speed Downlink Packet Access High Speed Uplink Packet Access Zero intermediate frequency Wideband Code Division Multiple Access Voltage control temperature-compensated crystal oscillator Universal subscriber identity module Universal mobile telecommunications system Universal asynchronous receiver transmitter Power save mode SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision D. Safety Caution Table 40: Safety Caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. SIM7000 _Hardware Design _V1.00 2017-05-23 Smart Machine Smart Decision Contact us: Shanghai SIMCom Wireless Solutions Ltd. Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel:+86 21 3235 3300 Fax:+86 21 3235 3020 URL:www.simcomm2m.com SIM7000 _Hardware Design _V1.00 2017-05-23
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