THALES DIS AlS Deutschland EHS8 GSM/WCDMA Module User Manual EHS8 Rev 1 FCC x
Gemalto M2M GmbH GSM/WCDMA Module EHS8 Rev 1 FCC x
Contents
- 1. EHS8_User Manual_Rev 1(FCC)
- 2. ehs8_hio
EHS8_User Manual_Rev 1(FCC)
Cinterion® EHS8 Hardware Interface Overview Version: DocId: 02.770 EHS8_HIO_v02.770 M2M.GEMALTO.COM EHS8 Hardware Interface Overview ® Cinterion Page 2 of 42 Document Name: Cinterion® EHS8 Hardware Interface Overview Version: 02.770 Date: 2014-08-11 DocId: EHS8_HIO_v02.770 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHA LL NOT TRANSFER , COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISC LAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright © 2014, Gemalto M2M GmbH, a Gemalto Company EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 3 of 43 Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. Contents 42 Contents 1 Introduction ...........................................................................................................................8 1.1 Key Features at a Glance ..........................................................................................8 1.2 EHS8 System Overview ..........................................................................................13 2 Interface Characteristics ....................................................................................................14 2.1 Application Interface ................................................................................................14 2.1.1 USB Interface............................................................................................14 2.1.2 Serial Interface ASC0................................................................................15 2.1.3 Serial Interface ASC1................................................................................15 2.1.4 UICC/SIM/USIM Interface .........................................................................16 2.1.5 Digital Audio Interface ...............................................................................18 2.1.6 GPIO Interface ..........................................................................................18 2.1.7 I2C Interface ..............................................................................................19 2.1.8 SPI Interface .............................................................................................19 2.1.9 HSIC Interface ..........................................................................................19 2.1.10 PWM Interfaces ......................................................................................20 2.1.11 Pulse Counter .........................................................................................20 2.1.12 Status LED ..............................................................................................20 2.1.13 Fast Shutdown ........................................................................................20 2.2 RF Antenna Interface...............................................................................................21 2.2.1 Antenna Installation...................................................................................22 2.3 GPS Interface ..........................................................................................................23 2.3.1 GPS Receiver ...........................................................................................23 2.3.2 GPS Antenna ............................................................................................23 2.4 Sample Application ..................................................................................................23 3 Operating Characteristics ..................................................................................................26 3.1 Operating Modes .....................................................................................................26 3.2 Power Supply ..........................................................................................................26 4 Mechanical Dimensions, Mounting and Packaging .........................................................28 4.1 Mechanical Dimensions of EHS8 ............................................................................28 5 Regulatory and Type Approval Information ......................................................................30 5.1 Directives and Standards ........................................................................................30 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 EHS8 Hardware Interface Overview 5.2 SAR requirements specific to portable mobiles .......................................................33 5.3 Reference Equipment for Type Approval .................................................................33 5.4 Compliance with FCC and IC Rules and Regulations .............................................35 6 Document Information ........................................................................................................36 6.1 Revision History.......................................................................................................36 6.2 Related Documents .................................................................................................36 6.3 Terms and Abbreviations .........................................................................................36 6.4 Safety Precaution Notes ..........................................................................................40 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 5 of 43 Contents 42 Appendix.................................................................................................................... 40 7.1 List of Parts and Accessories........................................................................... 40 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 6 of 43 Tables 111 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Signals of the SIM interface (SMT application interface)............................... 15 GPIO lines and possible alternative assignment............................................ 17 Return loss in the active band........................................................................ 20 Overview of operating modes ........................................................................ 25 Directives ....................................................................................................... 29 Standards of North American type approval.................................................. 29 Standards of European type approval............................................................ 29 Requirements of quality ................................................................................. 30 Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................ 30 Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 31 List of parts and accessories.......................................................................... 40 Molex sales contacts (subject to change)...................................................... 41 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 7 of 43 Figures 111 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: EHS8 system overview.................................................................................. 11 USB circuit ..................................................................................................... 12 Serial interface ASC0..................................................................................... 13 Serial interface ASC1..................................................................................... 14 External UICC/SIM/USIM card holder circuit ................................................. 16 Schematic diagram of EHS8 sample application........................................... 24 EHS8– top and bottom view........................................................................... 27 Dimensions of EHS8 (all dimensions in mm)................................................. 28 Reference equipment for Type Approval ....................................................... 33 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 8 of 43 1.1 Key Features at a Glance 11 1 Introduction 11 Introduction This document1 describes the hardware of the Cinterion® EHS8 module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.1 Key Features at a Glance Feature Implementation General Frequency bands GSM class Output power GSM/GPRS/EDGE: Quad band 850/900/1800/1900MHz UMTS/HSPA+: Five band 800/850/900/1900/2100MHz Small MS Power supply +33dBm ±1dB for EGSM850 +30dBm ±1dB for GSM1900 +27dBm ±1dB for EGPRS 850(8-PSK, 1 Tx slot) +24dBm ±1dB for EGPRS 850(8-PSK, 2 Tx slot) +22dBm ±1dB for EGPRS 850(8-PSK, 3 Tx slot) +21dBm ±1dB for EGPRS 850(8-PSK, 4 Tx slot) +26dBm ±1dB for GPRS 1900(8-PSK, 1 Tx slot) +23dBm ±1dB for EGPRS 1900(8-PSK, 2 Tx slot) +21dBm ±1dB for EGPRS 1900(8-PSK, 3 Tx slot) +20dBm ±1dB for EGPRS 1900(8-PSK, 4 Tx slot) +33dBm ±1dB forGPRS 850(GMSK, 1 Tx slot) +30dBm ±1dB for GPRS 850(GMSK,2 Tx slot) +28dBm ±1dB for GPRS 850(GMSK, 3 Tx slot) +27dBm ±1dB for GPRS 850(GMSK, 4 Tx slot) +30dBm ±1dB for GPRS 1900(GMSK, 1 Tx slot) +27dBm ±1dB for GPRS 1900(GMSK, 2 Tx slot) +25dBm ±1dB for GPRS19050(GMSK, 3 Tx slot) +24dBm ±1dB for GPRS 1900(GMSK, 4Tx slot) +24dBm ±1dB for UMTS Band 2 +24dBm ±1dB for UMTS Band 5 3.3V to 4.5V Operating temperature (board temperature) Normal operation: -30°C to +85°C Extended operation: -40°C to +90°C Physical Dimensions: 27.6mm x 25.4mm x 2.2mm Weight: approx. 3.5g . The document is effective only if listed in the appropriate Release Notes as part of th e technical documentation delivered with your Gemalto M2M product. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview RoHS Page 9 of 43 All hardware components fully compliant with EU RoHS Directive HSPA features 3GPP Release 6, 7 DL 7.2Mbps, UL 5.7Mbps HSDPA Cat.8 / HSUPA Cat.6 data rates Compressed mode (CM) supported according to 3GPP TS25.212 UMTS features 3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps UL CS data rate – 64 kbps DL / 64 kbps UL Feature Implementation GSM/GPRS/EGPRS features Data transfer GPRS: • Multislot Class 12 • Full PBCCH support • Mobile Station Class B • Coding Scheme 1 – 4 EGPRS: • Multislot Class 12 • EDGE E2 power class for 8 PSK • Downlink coding schemes – CS 1-4, MCS 1-9 • Uplink coding schemes – CS 1-4, MCS 1-9 • SRB loopback and test mode B • 8-bit, 11-bit RACH • PBCCH support • 1 phase/2 phase access procedures • Link adaptation and IR • NACC, extended UL TBF • Mobile Station Class B CSD: • V.110, RLP, non-transparent • 9.6kbps • USSD SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment GPS Features Protocol NMEA Modes Standalone GPS Assisted GPS - Control plane - E911 - User plane General Automatic power saving modes Power supply for active antenna Software EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 10 of 43 1.1 Key Features at a Glance 11 AT commands Java™ Open Platform Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M AT commands for RIL compatibility Java™ Open Platform with • Java™ profile IMP-NG & CLDC 1.1 HI • Secure data transmission via HTTPS/SSL • Multi-threading programming and multi-application execution Major benefits: seamless integration into Java applications, ease of programming, no need for application microcontroller, extremely costefficient hardware and software design – ideal platform for industrial GSM applications. The memory space available for Java programs is around 8 MB in the flash file system and around 6MB RAM. Application code and data share the space in the flash file system and in RAM. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 11 of 43 1.1 Key Features at a Glance 11 Feature Implementation Microsoft™ compatibility RIL for Pocket PC and Smartphone SIM Application Toolkit SAT Release 99 Firmware update Generic update from host application over ASC0 or USB modem. Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equipment. USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant 2 serial interfaces Audio ASC0 (shared with GPIO lines): • 8-wire modem interface with status and control lines, unbalanced, asynchronous • Adjustable baud rates: 1,200bps to 921,600bps • Autobauding: 1,200bps to 230,400bps • Supports RTS0/CTS0 hardware flow control. • Multiplex ability according to GSM 07.10 Multiplexer Protocol. ASC1 (shared with GPIO lines): • 4-wire, unbalanced asynchronous interface • Adjustable baud rates: 1,200bps to 921,60bps • Autobauding: 1,200bps to 230,400bps • Supports RTS1/CTS1 hardware flow control 1 digital interface (PCM), shared with GPIO lines UICC interface Supported SIM/USIM cards: 3V, 1.8V GPIO interface 14 GPIO lines shared with ASC0 lines, LED signalling, PWM functionality, fast shutdown and pulse counter 4 GPIO lines shared with PCM interface 4 GPIO lines shared with ASC1, SPI and HSIC interfaces I2C interface Supports I2C serial interface HSIC interface High-Speed Inter-Chip (HSIC) interface for USB chip-to-chip interconnect including Link Power Management (LPM) lines shared with GPIO lines SPI interface Serial peripheral interface, shared with GPIO lines Antenna interface pads 50 Power on/off, Reset EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 12 of 43 1.1 Key Features at a Glance 11 Power on/off Switch-on by hardware signal AUTO_ON and ON Switch-off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch-off in case of critical temperature and voltage conditions Feature Implementation Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST Special features Real time clock Timer functions via AT commands Phonebook SIM and phone TTY/CTM support Integrated CTM modem Evaluation kit Evaluation module EHS8 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75. DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the EHS8 evaluation module to the DSB75. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 13 of 43 1.2 EHS8 System Overview 11 1.2 EHS8 System Overview EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 14 of 43 2 Interface Characteristics 24 Interface Characteristics EHS8 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface EHS8 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because EHS8 is designed as a self-powered device compliant with the “Universal Serial Bus Specification Revision 2.0”1. Module SMT VREG (3V075) lin. reg. BATT+ GND USB part1) VBUS Detection only VUSB_IN RS RS DP DN Host wakeup 1) 2) 2) USB_DP 2) USB_DN RING0 All serial (including RS) and pull-up resistors for data lines are implemented. If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with EHS8 needs to be installed. . The specification is ready for download on http://www.usb.org/developers/docs/ EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 15 of 43 2.1 Application Interface 24 2.1.2 Serial Interface ASC0 EHS8 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). EHS8 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: •Port TXD @ application sends data to the module’s TXD0 signal line • Port RXD @ application receives data from the module’s RXD0 signal line Figure 3: Serial interface ASC0 Features: • Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. • ASC0 is designed for controlling GSM/UMTS voice calls, transferring data and for controlling the module with AT commands. • Full multiplexing capability allows the interface to be partitioned into virtual channels. • The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send p ulses to the host application, for example to wake up the application from power saving state. • Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 1,200bps up to 921,600bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if t he line is n ot used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. • Wake up from SLEEP mode by RTS0 activation (high to low transition). 2.1.3 Serial Interface ASC1 Four EHS8 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 16 of 43 2.1 Application Interface 24 EHS8 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: • Port TXD @ application sends data to module’s TXD1 signal line • Port RXD @ application receives data from the module’s RXD1 signal line Figure 4: Serial interface ASC1 Features • Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware han dshake. • On ASC1 no RING line is available. • Configured for 8 data bits, no parity and 1 or 2 stop bits. • ASC1 can be operated at fixed bit rates from 1,200 bps to 921,600 bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. 2.1.4 UICC/SIM/USIM Interface EHS8 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with EHS8 and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers. Table 1: Signals of the SIM interface (SMT application interface) Signal Description GND Separate ground connection for SIM card to improve EMC. CCCLK Chipcard clock CCVCC SIM supply voltage. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 17 of 43 2.1 Application Interface 24 CCIO Serial data line, input and output. CCRST Chipcard reset CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN signal is by default low and will change to highl evel if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of EHS8. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart EHS8. The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 5: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on EHS8 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 18 of 43 2.1 Application Interface 24 2.1.5 Digital Audio Interface EHS8‘s digital audio interface (DAI) can be used to connect audio devices capable of pulse code modulation (PCM). 2.1.6 GPIO Interface EHS8 offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.13), status LED (see Section 2.1.12), the PWM functionality (see Section 2.1.10), an pulse counter (see Section 2.1.11), ASC0 (see Section 2.1.2), ASC1 (see Section 2.1.3), an SPI interface (see Section 2.1.8), an HSIC interface (see Section 2.1.9) and a PCM interface (see Section 2.1.10) The following table shows the configuration variants for the GPIO pads. All variants are mutually exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 2: GPIO lines and possible alternative assignment GPIO Fast Status Shutdown LED PWM Pulse Counter ASC0 ASC1 SPI GPIO1 DTR0 GPIO2 DCD0 GPIO3 DSR0 GPIO4 GPIO5 PCM SPI_CLK FST_SHDN Status LED GPIO6 PWM2 GPIO7 PWM1 GPIO8 HSIC COUNTER GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 RXD1 MOSI AP_WAKEUP GPIO17 TXD1 MISO HOST_ACTIVE GPIO18 RTS1 GPIO19 CTS1 GPIO20 CP_WAKEUP SPI_CS SUSPEND TXDDAI EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 19 of 43 2.1 Application Interface 24 GPIO21 RXDDAI GPIO22 TFSDAI GPIO23 SCLK GPIO24 RING0 After startup, the above mentioned alternative GPIO line assignments can be configured using AT commands (see [1]). The configuration is non-volatile and available after module restart. 2.1.7 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bidirectional line. Each device connected to the bus is software addressable by a unique 7-bit address, and simple master/slave relationships exist at all times. The module operates as mastertransmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The I2C interface can be powered via the V180 line of EHS8. If connected to the V180 line, the I2C interface will properly shut down when the module enters the Power Down mode. Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. 2.1.8 SPI Interface Four EHS8 GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between EHS8 and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select line SPI_CS. 2.1.9 HSIC Interface The (USB) High Speed Inter Chip Interface can be used between the module and an external application processor and is compliant to the High Speed USB 2.0 interface with 480Mbit/s. The maximum distance between module processor and external application processor should not exceed 100mm. The HSIC interface comprises 6 lines: • Two signal lines (strobe - HSIC_STRB - and data - HSIC_DATA) are used in a source synchronous serial interface with a 240MHz clock to provide a 480Mbps USB interface. The HSIC_STRB and HSIC_DATA lines are high-speed signals and should be routed as 50 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 20 of 43 2.1 Application Interface 24 • impedance traces. The trace length of these signals should be balanced to minimize timing skew and no longer as 100mm. Four signal lines for Link Power Management (LPM). For further power reduction, the USB HSIC interface supports LPM according to the USB 2.0 standard. The LPM defines power management states and mechanisms to affect state changes that are used b y the AP_WAKEUP and CP_WAKEUP signal lines to efficiently manage bus and system power. To take advantage of the LPM feature, two further signals are needed to support power management state transitions - the SUSPEND and HOST_ACTIVE signals. 2.1.10 PWM Interfaces The GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interface lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzzers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOs see Section 2.1.6). GPIO and PWM functionality are mutually exclusive. 2.1.11 Pulse Counter The GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter interface can be used, for example, as a clock (for GPIOs see Section 2.1.6). 2.1.12 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different operating modes of the module (for GPIOs see Section 2.1.6). GPIO and LED functionality are mutually exclusive. 2.1.13 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The configured FST_SHDN line is an active low control signal and must be applied for at least 10 milliseconds. If unused this line can be left open because of a configured internal pull-up resistor. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 21 of 43 2.2 RF Antenna Interface 24 2.2 RF Antenna Interface The RF interface has an impedance of 50 . EHS8 is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the EHS8 module and should be placed in the host application if the antenna does not have an impedance of 50 . Regarding the return loss EHS8 provides the following values in the active band: Table 3: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive > 8dB > 12dB Transmit not applicable > 12dB EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 22 of 43 2.2 RF Antenna Interface 24 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pad (ANT_GSM, i.e., pad #59) and its neighboring ground pads (GND, i.e., pads #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for EHS8. All RF data specified throughout this document is related to the ARP. The distance between the antenna ANT_GSM pad (#59) and its neighboring GND pads (#58, #60) has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application antenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. . For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to EHS8‘s antenna pad. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 23 of 43 2.3 GPS Interface 24 2.3 GPS Interface 2.3.1 GPS Receiver EHS8 integrates a GPS receiver that offers the full performance of GPS technology. The GPS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GPS receiver supports the NMEA protocol via ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) electronic devices including GPS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org. Depending on the receiver’s knowledge of last position, current time and ephemeris data, the receiver’s startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowledge of its last position or time, a startup takes considerably longer than if the receiver has still knowledge of its last position, time and almanac or has still access to valid ephimeris data and the precise time. 2.3.2 GPS Antenna In addition to the RF antenna interface EHS8 also has a GPS antenna interface. The GPS installation is the same as for the RF antenna interface, except for pad 224 instead of pad 59. It is possible to connect active or passive GPSS antennas. For active antennas the power is supplied by ANT_GPS_PWR; see sample application given in Figure 6. In either case the antennas must have 50 impedance. The simultaneous operation of GSM and GPS has been implemented. 2.4 Sample Application 24 2.4 Sample Application Figure 6 shows a typical example of how to integrate a EHS8 module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 24 of 43 potential interferers may be minimized by placing small capacitors (47pF) at suspected lines (e.g. RXD0, RXT0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the position of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Note: EHS8 is not intended for use with cables longer than 3m. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 6 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using EHS8 modules. 2.4 Sample Application EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 25 of 43 24 Figure 6: Schematic diagram of EHS8 sample application 3 Operating Characteristics 26 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Operating Characteristics 3.1 Operating Modes Page 26 of 43 The table below briefly summarizes the various operating modes referred to throughout the document. Table 4: Overview of operating modes Mode Function Normal GSM / operation GPRS / UMTS / HSPA SLEEP Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active communication via ASC0. GSM / GPRS / UMTS / HSPA IDLE Power saving disabled or an USB connection not suspended, but no call in progress. GSM TALK/ GSM DATA Connection between two subscribers is in progress. Power consumption depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be measured in TALK_GSM mode: DTX off, FR and no frequency hopping. GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). GPRS DATA EGPRS DATA EGPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS TALK/ UMTS DATA UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. HSPA DATA HSPA data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. Power Down Normal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage remains applied. Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). 3.2 Power Supply 26 3.2 Power Supply EHS8 needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line for the general power management. • BATT+RF with a line for the GSM power amplifier supply. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 27 of 43 Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The power supply of EHS8 has to be a single voltage source at BATT+BB and BATT+RF. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features: • • • Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 28 of 43 4 Mechanical Dimensions, Mounting and Packaging 28 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of EHS8 Figure 7 shows the top and bottom view of EHS8 and provides an overview of the board's mechanical dimensions. For further details see Figure 8. Product label Top view Bottom view Figure 7: EHS8– top and bottom view 4.1 Mechanical Dimensions of EHS8 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 29 of 43 28 Figure 8: Dimensions of EHS8 (all dimensions in mm) 5 Regulatory and Type Approval Information 34 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Regulatory and Type Approval Information 5.1 Directives and Standards Page 30 of 43 EHS8 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "EHS8 Hardware Interface Description".1 Table 5: Directives 1999/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC). The product is labeled with the CE conformity mark CE1588 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 6: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC OET Bulletin 65 (Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V5.15 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard Table 7: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station (MS) conformance specification; ETSI EN 301 511 V9.0.2 Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) GCF-CC V3.49 Global Certification Forum - Certification Criteria ETSI EN 301 489-01 V1.9.2 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements . Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 31 of 43 5.1 Directives and Standards 34 Table 7: Standards of European type approval ETSI EN 301 489-07 V1.3.1 Electromagnetic Compatibility and Electromagnetic Compatibility (EMC) services; Part 7: Specific conditions ancillary equipment of digital cellular (GSM and DCS) Radio spectrum Matters (ERM); standard for radio equipment and for mobile and portable radio and radio telecommunications systems ETSI EN 301 489-24 V1.5.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment ETSI EN 301 908-01 V5.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements of article 3.2 of the R&TTE Directive ETSI EN 301 908-02 V5.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive EN 62311:2008 Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz) IEC/EN 60950-1:2006/ A1:2010+A12:2011 IEC 60950-1:2005/ A1:2009 (second edition) Safety of information technology equipment Table 8: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes Table 9: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06). According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description. Please see Table 10 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. 5.1 Directives and Standards 34 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 32 of 43 Table 10: Toxic or hazardous substances or elements with defined concentration limits EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 33 of 43 5.2 SAR requirements specific to portable mobiles 34 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable EHS8 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below: • Portable device: A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user. • Mobile device: A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. 5.3 Reference Equipment for Type Approval 34 5.3 Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve EHS8 (including a special approval adapter for the DSB75) is shown in the following figure1: EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 34 of 43 Figure 9: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is chosen to connect the evaluation module directly to the GSM/UMTS/GPS test equipment instead of employing the SMA antenna connectors on the EHS8-DSB75 adapter as shown in Figure 9. The following products are recommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40) (for details see http://www.hirose-connectors.com/ or http://www.farnell.com/ Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) 5.4 Compliance with FCC and IC Rules and Regulations 34 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview 5.4 Page 35 of 43 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.3 will be registered under the following identifiers: FCC Identifier: QIPEHS8 Industry Canada Certification Number: 7830A-EHS8 Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating EHS8 modules are authorized to use the FCC Grants and Industry Canada Certificates of the EHS8 modules for their own final products according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID QIPEHS8", and accordingly “Contains IC 7830A-EHS8“. The integration is limited to fixed or mobile categorised host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits 2.15 (850 MHz) and 2.15 dBi (1900 MHz). IMPORTANT: Manufacturers of portable applications incorporating EHS8 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating EHS8 modules the above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product. 6 Document Information 39 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Document Information 6.1 Revision History Page 36 of 43 New document: "Cinterion® EHS8 Hardware Interface Overview" Version 02.770 Chapter What is new -- Initial document setup. 6.2 [1] [2] [3] [4] [5] Related Documents EHS8 AT Command Set EHS8 Release Note Application Note 48: SMT Module Integration Application Note 40: Thermal Solutions Universal Serial Bus Specification Revision 2.0, April 27, 2000 6.3 Terms and Abbreviations Abbreviation Description ADC Analog-to-digital converter AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of EHS8 Thermistor Constant BER Bit Error Rate BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 37 of 43 6.3 Terms and Abbreviations 39 Abbreviation Description DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module) DCS 1800 Digital Cellular System, also referred to as PCN DRX Discontinuous Reception DSB Development Support Box DSP Digital Signal Processor DSR Data Set Ready DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EIRP Equivalent Isotropic Radiated Power EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPIO General Purpose Input/Output GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 38 of 43 6.3 Terms and Abbreviations 39 kbps kbits per second LED Light Emitting Diode Li-Ion/Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery LPM Link Power Management Abbreviation Description Mbps Mbits per second MMI Man Machine Interface MO Mobile Originated MS Mobile Station (GSM module), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated NTC Negative Temperature Coefficient OEM Original Equipment Manufacturer PA Power Amplifier PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PCN Personal Communications Network, also referred to as DCS 1800 PCS Personal Communication System, also referred to as GSM 1900 PDU Protocol Data Unit PLL Phase Locked Loop PPP Point-to-point protocol PSK Phase Shift Keying PSU Power Supply Unit PWM Pulse Width Modulation R&TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory RF Radio Frequency RLS Radio Link Stability RMS Root Mean Square (value) EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 39 of 43 6.3 Terms and Abbreviations 39 RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. ROM Read-only Memory RTC Real Time Clock RTS Request to Send Rx Receive Direction SAR Specific Absorption Rate SAW Surface Accoustic Wave SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMD Surface Mount Device Abbreviation Description SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface SRAM Static Random Access Memory TA Terminal adapter (e.g. GSM module) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TLS Transport Layer Security Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 40 of 43 6.4 Safety Precaution Notes 39 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating EHS8. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard. IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Page 41 of 43 7 Appendix 41 Appendix 7.1 List of Parts and Accessories Table 11: List of parts and accessories Description Supplier Ordering information EHS8 Gemalto M2M Standard module Gemalto M2M IMEI: Packaging unit (ordering) number: L30960-N2900-A300 Module label number: S30960-S2900-A300-1 DSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100 Multi-Adapter R1 for Gemalto M2M Ordering number: L30960-N0010-A100 mounting EHS8 evaluation modules onto DSB75 Approval adapter for Gemalto M2M Ordering number: L30960-N2301-A100 mounting EHS8 evaluation modules onto DSB75 Evaluation Module Gemalto M2M Ordering number: L30960-N2901-A300 (EHS8) Votronic Handset Votronic / Gemalto M2M ordering number: L36880-N8301-A107 Gemalto M2M Votronic ordering number: HH-SI-30.3/V1.1/0 SIM card holder incl. push button ejector and slide-in tray Votronic Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 12. Molex 7.1 List of Parts and Accessories 41 Table 12: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com EHS8_HIO_v02.770 Confidential / Preliminary American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 2014-08-11 Cinterion® EHS8 Hardware Interface Overview Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Page 42 of 43 Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 EHS8_HIO_v02.770 Confidential / Preliminary 2014-08-11 42 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2011 annual revenues of €2 billion and more than 10,000 employees operating out of 74 offices and 14 Research & Development centers, located in 43 countries. We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere - in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal mobile services, payment security, authenticated cloud access, identity and privacy protection, eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-tomachine (M2M) applications. Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our innovations enable our clients to offer trusted and convenient digital services to billions of individuals. Gemalto thrives with the growing number of people using its solutions to interact with the digital and wireless world. For more information please visit m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter. Gemalto M2M GmbH St.-Martin-Str. 60 81541 Munich Germany M2M.GEMALTO.COM
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