Tekelek Europe 784 WiFi Module with integrated TCP/IP protocol stack User Manual 784 Installation Manual V1 0x

784 Module Installation Manual

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784 Installation Manual

Author Rory Keating

Version 1.0

Status Draft

Approved by

Date 14-02-2017

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Modification History

Rev. Date Author Changes

1.0 09-02-2017 R. Keating

Input Documents and Information

Ref Document ID Version Date Description

1)

2)

3)

4)

References and Guidelines

Ref. Document ID Date Description

1)

2)

3)

4)

5)

6)

7)

8)

9)

10)

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Definitions and Acronyms

Acronym Description

PSU Power Supply Unit

V Voltage

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Contents

Modification History.......................................................................................................................2

Input Documents and Information...............................................................................................2

References and Guidelines..........................................................................................................2

Definitions and Acronyms.............................................................................................................3

1 Pin Definitions ...............................................................................................................................5

2Installing a TEK 784 Module to an Wi-fi Application PCB.....Error! Bookmark not defined.

2.1TEK 784 Module Footprint. ..................................................................................................8

2.2TEK 784 Module Example Footprint on carrier PCB...........................................................9

2.3TEK784 Module Layout Recommendations.......................................................................11

2.4SMT Recommendations. .....................................................................................................11

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1.

1 Pin Definitions

Figure1‐1showsthemechanicaldimensionsforthe16‐pinSMDpackage.

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Figure1‐2showsthepinnamesforthe16‐pinSMDpackage.

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

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



Table1‐1PinNamesandFunctions



PinNameTypeFunction

1GNDPPowerGround

2GNDPPowerGround

3GNDPPowerGround

4GPIO15I/OGeneralpurposeI/O15

5ANTI/ORFAntennaInterface

6VDDPPower3.0V~3.6V

7CHIP_PUIHigh:On,chipworksproperly

Low:Off,smallamountofcurrentconsumed.

8GPIO0I/OGeneralpurposeI/O0

9GPIO2I/OGeneralpurposeI/O2

10GNDPPowerGround

11GNDPPowerGround

12GNDPPowerGround

13GNDPPowerGround

14EXT_RSTBIExternalresetsignal(Lowvoltagelevel:Active)

15UARTTXDOUARTSerialTransmit

16UARTRXDIUARTSerialReceive

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2 TEK 784 Footprint

2.1 TEK 784 Module Footprint.

Use the Figure 6-1 as a footprint for installing TEK 784 module on PCB.

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

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2.2 TEK 784 Module Example Footprint on carrier PCB.

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Follow these RF trace routing recommendations:

a) RF traces must have 50-Ω impedance.

b) RF traces must not have sharp corners. 

c) RF traces must have via stitching on the ground plane beside the RF trace on both sides. 

d) RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge

of the PCB product in consideration of the product enclosure material and proximity.

2.3 TEK784 Module Layout Recommendations.

Follow these module layout recommendations:

a) Ensure a solid ground plane and ground vias under the module for stable system an thermal dissipation.

b) Do not run signal traces underneath the module on the layer where the module is mounted.

c) Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting.

d) Run the host interfaces with ground on the adjacent layer to improve the return path.

e) Route the signals as short as possible to the host.

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2.4 SMT Recommendations.

Table 7-3. Temperature Values for Reflow Profile

ItemTemperature°CTime(s)

Preheat140to20080to120

Soldering22060±10

PeakTemperature250maximum10

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NOTE

It is not recommended to use conformal coating or similar material on the TEK 784 module.

This coating can lead to localized stress on the SMT solder connections inside the

module and impact the device reliability. Care should be taken during module assembly

process to the final PCB to avoid the presence of foreign material inside the module.

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Tekelek Europe 784 WiFi Module with integrated TCP/IP protocol stack User Manual 784 Installation Manual V1 0x

Tekelek Europe Ltd WiFi Module with integrated TCP/IP protocol stack 784 Installation Manual V1 0x

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