Tekelek Europe 784 WiFi Module with integrated TCP/IP protocol stack User Manual 784 Installation Manual V1 0x
Tekelek Europe Ltd WiFi Module with integrated TCP/IP protocol stack 784 Installation Manual V1 0x
Contents
- 1. Installation Manual
- 2. User Manual Statements
Installation Manual
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| Document ID | 3312443 |
| Application ID | dB0dm38ARhtMOU5Gd7f/iQ== |
| Document Description | Installation Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 38.75kB (484398 bits) |
| Date Submitted | 2017-03-10 00:00:00 |
| Date Available | 2017-03-10 00:00:00 |
| Creation Date | 2017-12-25 13:50:04 |
| Producing Software | GPL Ghostscript 9.18 |
| Document Lastmod | 2017-12-25 13:50:04 |
| Document Title | Microsoft Word - 784 Installation Manual V1.0.docx |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | M Kirby |
784 Module Installation Manual 784 Installation Manual Author Version Status Approved by Date TS-031-01 Rory Keating 1.0 Draft 14-02-2017 Page 1 of 11 784 Module Installation Manual Modification History Rev. Date Author 1.0 09-02-2017 R. Keating Changes Input Documents and Information Ref Document ID Version Date Description 1) 2) 3) 4) References and Guidelines Ref. Document ID Date Description 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) TS-031-01 Page 2 of 11 784 Module Installation Manual Definitions and Acronyms Acronym PSU TS-031-01 Description Power Supply Unit Voltage Page 3 of 11 784 Module Installation Manual Contents Modification History .......................................................................................................................2 Input Documents and Information...............................................................................................2 References and Guidelines..........................................................................................................2 Definitions and Acronyms.............................................................................................................3 1 Pin Definitions ...............................................................................................................................5 Installing a TEK 784 Module to an Wi-fi Application PCB.....Error! Bookmark not defined. 2.1 TEK 784 Module Footprint. ..................................................................................................8 2.2 TEK 784 Module Example Footprint on carrier PCB...........................................................9 2.3 TEK784 Module Layout Recommendations.......................................................................11 2.4 SMT Recommendations. .....................................................................................................11 TS-031-01 Page 4 of 11 784 Module Installation Manual 1. 1 Pin Definitions Figure 1‐1 shows the mechanical dimensions for the 16‐pin SMD package. TS-031-01 Page 5 of 11 784 Module Installation Manual Figure 1‐2 shows the pin names for the 16‐pin SMD package. TS-031-01 Page 6 of 11 784 Module Installation Manual Table 1‐1 Pin Names and Functions Pin Name GND GND GND GPIO15 ANT VDD CHIP_PU Type I/O I/O 10 11 12 13 14 15 16 GPIO0 GPIO2 GND GND GND GND EXT_RSTB UART TXD UART RXD I/O I/O TS-031-01 Function Power Ground Power Ground Power Ground General purpose I/O 15 RF Antenna Interface Power 3.0V ~ 3.6V High: On, chip works properly Low: Off, small amount of current consumed. General purpose I/O 0 General purpose I/O 2 Power Ground Power Ground Power Ground Power Ground External reset signal (Low voltage level: Active) UART Serial Transmit UART Serial Receive Page 7 of 11 784 Module Installation Manual 2 TEK 784 Footprint 2.1 TEK 784 Module Footprint. Use the Figure 6-1 as a footprint for installing TEK 784 module on PCB. TS-031-01 Page 8 of 11 784 Module Installation Manual 2.2 TEK 784 Module Example Footprint on carrier PCB. TS-031-01 Page 9 of 11 784 Module Installation Manual TS-031-01 Page 10 of 11 784 Module Installation Manual Follow these RF trace routing recommendations: a) RF traces must have 50-Ω impedance. b) RF traces must not have sharp corners. c) RF traces must have via stitching on the ground plane beside the RF trace on both sides. d) RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. 2.3 TEK784 Module Layout Recommendations. Follow these module layout recommendations: a) b) c) d) Ensure a solid ground plane and ground vias under the module for stable system an thermal dissipation. Do not run signal traces underneath the module on the layer where the module is mounted. Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting. Run the host interfaces with ground on the adjacent layer to improve the return path. e) Route the signals as short as possible to the host. 2.4 SMT Recommendations. Table 7-3. Temperature Values for Reflow Profile Item Preheat Soldering Peak Temperature Temperature °C 140 to 200 220 250 maximum Time (s) 80 to 120 60 ± 10 10 NOTE It is not recommended to use conformal coating or similar material on the TEK 784 module. This coating can lead to localized stress on the SMT solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module. TS-031-01 Page 11 of 11
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