HP 200 G3 AiO
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HP 200 G3 AiO
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QuickSpecs HP 200 G3 AiO Overview Not all configuration components are available in all regions/countries. c05945475 — DA16184 — Worldwide — Version 7 — October 15, 2019
HP 200 G3 AiO - HP Log on selector
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1. Optical disc drive 2. Power button 3. Two (2) USB 2.0 ports 4. RJ-45 (network) jack 5. Power connector. Rear. 6. Two (2) USB 3.1 Gen 1 ports 7. HDMI out connector 8.. View
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QuickSpecs Overview HP 200 G3 AiO HP 200 G3 AiO 1. Webcam 2. Webcam privacy shutter Front 3. Microphone 4. Speakers Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 1 QuickSpecs Overview HP 200 G3 AiO HP 200 G3 AiO 1. Optical disc drive 2. Power button 3. Two (2) USB 2.0 ports 4. RJ-45 (network) jack 5. Power connector Rear 6. Two (2) USB 3.1 Gen 1 ports 7. HDMI out connector 8. Microphone/Headphone Combo Jack 9. Security cable slot Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 2 QuickSpecs HP 200 G3 AiO Features AT A GLANCE � Choice of Windows 10 Home, Windows 10 Professional, and FreeDOS � Integrated All-in-One form factor � 21.5-inch diagonal widescreen Full HD anti-glare display � Choice of Intel� 8th generation CoreTM processors, featuring integrated Intel� UHD Graphics � Up to 16GB of DDR4 Synchronous Dynamic Random-Access Memory (SDRAM) � Integrated 10/100/1000 Gigabit LAN Ethernet Controller � Wi-Fi 802.11ac wireless connectivity � Integrated HD audio card and stereo speakers � Integrated HD camera (1280 x 720) with privacy webcam shutter to ensure no accidental recording to safeguard user's privacy � Expandable storage options with up to 256GB SSD and 2TB HDD � Optional HP Slim Tray DVD Writer 8X Optical Drive � 3-in-1 Media Card Reader � TPM 2.0 support � Low halogen1 materials, ENERGY STAR� certified and EPEAT� 2019 registered. Registration may vary by country. See http://www.epeat.net for registration status by country. � Protected by HP Services. Terms and conditions vary by country. Certain restrictions and exclusions apply. 1. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low halogen. NOTE: See important legal disclosures for all listed specs in their respective features sections. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 3 QuickSpecs HP 200 G3 AiO Features OPERATING SYSTEMS Preinstalled Windows 10 Pro 641 Windows 10 Home 641 Windows 10 Home Single Language 641 Windows 10 Pro 64 (National Academic License)2 Microsoft Windows� 10 Enterprise (64 bit) Pre-installed (other) FreeDOS 1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com. 2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10 Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information. PROCESSORS Intel� 8th Generation CoreTM Processors 8th Generation Intel� CoreTM i5-8250U (1.6 GHz, 6 MB cache, 4 cores) Up to 3.4 GHz with Intel� Turbo Boost Technology 8th Generation Intel� CoreTM i3-8130U (2.2 GHz, 4 MB cache, 2 cores) Up to 3.4 GHz with Intel� Turbo Boost Technology Intel� Pentium� Processors Intel� Pentium� Silver J5005 (1.5 GHz, 4 MB cache, 4 cores) Up to 2.8 GHz Burst Frequency NOTE: Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel's numbering, branding and/or naming is not a measurement of higher performance. GRAPHICS Integrated Intel� UHD Graphics 620 Intel� UHD Graphics 605 NOTE: Intel� integrated UHD Graphics varies by processor DISPLAYS HP 200 G3 All-in-One 21.5-in FHD Display 54.61 cm (21.5") diagonal FHD anti-glare LED-backlit (1920 x 1080) Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 4 QuickSpecs HP 200 G3 AiO Features STORAGE AND DRIVES1 M.2 SATA Solid State Drives (SSD) 128GB 2280 M2 SATA Three Layer Cell Solid State Drive 256GB 2280 M2 SATA Three Layer Cell Solid State Drive M.2 PCIe NMVe Solid State Drives (SSD) 128GB 2280 PCIe NVMe Value Solid State Drive 256GB 2280 PCIe NVMe Value Solid State Drive 3.5 inch 7200RPM SATA Hard Disk Drives (HDD) 500GB 7200RPM 3.5in HDD 1TB 7200RPM 3.5in HDD 2TB 7200RPM 3.5in HDD Optical Disc Drives 9.5mm Ultra Slim DVD-Writer Media Card Reader SD Card Reader with 3-in1 Interface (Supports SD, SDHC, SDXC) NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) is reserved for system recovery software. MEMORY Maximum LPDDR4 SODIMM up to 2400MT/s Memory Slots 2 SODIMM Available Configurations 4GB (4GB x1) 8GB (4GB x2) 8GB (8GB x1) 16GB (8GB x2) NETWORKING/COMMUNICATIONS Wireless LAN Realtek� RTL8821CE 802.11AC 1x1 Wi-Fi M.2 Card3 Ethernet (RJ-45) Integrated Realtek� RTL8111HSH-CG Gigabit Ethernet Controller 3.Wireless LAN must be bought at purchase Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 5 QuickSpecs HP 200 G3 AiO Features AUDIO/MULTIMEDIA High Definition Audio4 Integrated Realtek ALC3247 Audio Codec High performance integrated stereo speakers 3.5mm combo (microphone/headphone) jack Webcams & Mic Integrated 1MP HD (maximum resolution of 1280 x 720) webcam, Up to 30 frames/sec, microphone included 4. The side headset connector supports CTIA style headsets and is re-taskable as a Line-in, Microphone-in or Headphone-out port. Rear audio input ports are re-taskable as a Line-in or Microphone-in port. External speakers must be powered externally. Multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front and rear jacks or internal speakers. This allows for different audio applications to use separate audio ports on the system. For example, the front jacks could be used with a headset for a communications application while the rear jacks are being used with external speakers and a multimedia application. KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS Keyboards HP USB Wired Keyboard Mice HP USB Mouse PORTS/SLOTS Rear I/O Ports Two (2) USB 2.0 ports Two (2) USB 3.1 Gen 1 ports One (1) RJ-45 (network) jack One (1) HDMI out connector One (1) Microphone/Headphone Combo Jack One (1) DC in power Bottom I/O Ports One (1) 3 in 1 Card reader (SD, SDHC, SDXC) Internal I/O Ports One (1) M.2 PCIe x1 2230 (for WLAN) One (1) M.2 PCIe x4 2280/2230 (for storage) One (1) SATA storage connector Bays One (1) 3.5" internal storage drive11 Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 6 QuickSpecs Features HP 200 G3 AiO SOFTWARE AND SECURITY Lifestyle Bing Search HP ePrint5 Internet Explorer Home Page (MSN or Bing) Internet Security and Antivirus McAfee LiveSafe (30-day subscription)6 HP Support HP PC Hardware Diagnostics HP Recovery Manager HP Support Assistant (HPSA) Product Setup HP Registration HP JumpStart Security Features Trusted Platform Module (TPM) 2.0 (firmware)7,8 Security cable slot 5. HP ePrint requires an internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible printers, supported documents and image types and other HP ePrint details, see http://www.hp.com/go/businessmobileprinting. 6. 30 day trial period. Internet access required to receive updates. First update included. Subscription required for updates thereafter 7. TPM feature will not be supported on machines pre-configured with FreeDOS and Linux 8. In selected countries, machines pre-configured with Windows OS will be shipped with TPM disabled. POWER Power Supply External External 89% efficient 65-watt power adapter Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 7 QuickSpecs Features WEIGHTS & DIMENSIONS Weight 21.5 Non-Touch Product Weight (Unboxed) 21.5 Shipping Weight (Boxed) Without Stand 4.94 kg, 10.89 lbs Basic Stand 5.39 kg, 11.88 lbs 7.76 kg, 17.11 lbs HP 200 G3 AiO 21.5 Shipping Weight (Pallet) 260.52 kg, 574.35 lbs Dimension 21.5 System Dimensions (including Touch, Non- Without Stand Touch ) 490.38 x 332.66 x 56.0 mm 19.31 x 13.10 x 2.2 in Basic Stand 490.38 x 390.6 x 204.11 mm 19.31 x 15.38 x 8.04 in 21.5 Shipping Dimensions (Boxed) 21.5 Shipping Dimensions (Pallet) 23.8 Pallet Quantity (including Touch, NonTouch) 598 x 248 x 483 mm, 23.55 x 9.77 x 19.02 in 1200 x 1000 x 2067 mm, 47.24 x 39.37 x 81.38 in 32 Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 8 QuickSpecs HP 200 G3 AiO Features UNIT ENVIRONMENT AND OPERATING CONDITIONS9 � Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range. � Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow. � Never restrict airflow into the computer by blocking any vents or air intakes. � Do not stack computers on top of each other or place computers so near each other that they are subject to each other's recirculated or preheated air. � Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow. � If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply. Temperature Range Operating: 50� to 95� F (10� to 35� C)* Non-operating: -22� to 140� F(-30� to 60� C) Relative Humidity Operating: 10% to 90% (non-condensing at ambient) Non-operating: 5% to 95% (non-condensing at ambient) Maximum Altitude (unpressurized) Operating: 5000m Non-operating: 50000ft (15240 m) 9. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 9 QuickSpecs Technical Specifications - Display HP 200 G3 AiO DISPLAY HP 200 G3 All-in-One 21.5-in FHD Display 54.61 cm (21.5") diagonal FHD anti-glare LED-backlit (1920 x 1080) Type IPS WLED Backlit LCD Active area (mm) 476.064 x 267.786 Native Resolution (HxV) 1920 x 1080 Aspect ratio 16:09 Pixel pitch (HxV)(mm) 0.24795 x 0.24795 Contrast ratio (typical) 1000:1 Brightness (typical) 250nits (cd/m2) Viewing angle (typical) (HxV) 178 � x 178 � Backlight lamp life (to half 30,000 hours minimum brightness) Color support Up to 16.7 million colors with the use of FRC technology Color gamut (typical) NTSC 72% Anti-glare Yes Default color temperature Warm (6500K) NOTE: All performance specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 10 QuickSpecs HP 200 G3 AiO Technical Specifications - Storage STORAGE AND DRIVES HP 500 GB 7.2K SATA 6.0Gb/s Capacity 3.5" Hard Disk Drive Rotational Speed 500GB 7,200 rpm Interface SATA 6 Gb/s Buffer Size 32 MB Logical Blocks 976,773,169 Seek Time 11 ms (Average) Height 26.1mm (Max) Width Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm Operating Temperature 41� to 131� F (5� to 55� C) NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. HP 1 TB 7.2K SATA 6.0Gb/s Capacity 3.5" Hard Disk Drive Rotational Speed 1TB 7,200 rpm Interface SATA 6 Gb/s Buffer Size 32 MB Logical Blocks 1,953,525,169 Seek Time 13 ms (Average) Height 26.1mm (Max) Width Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm Operating Temperature 41� to 131� F (5� to 55� C) NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. HP 2 TB 7.2K SATA 6.0Gb/s Capacity 3.5" Hard Disk Drive Rotational Speed 2TB 7,200 rpm Interface SATA 6 Gb/s Buffer Size 64 MB Logical Blocks 3,907,029,168 Seek Time 13 ms (Average) Height 26.1mm (Max) Width Media diameter: 3.5 in/8.89 cm Physical size: 4 in/10.2 cm Operating Temperature 41� to 131� F (5� to 55� C) NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 11 QuickSpecs Technical Specifications - Storage HP 200 G3 AiO 128 GB 2280 M2 SATA Three Drive Weight Layer Cell Solid State Drive Capacity < 10g 128 GB Height 2.23mm Length 80mm Width 22mm Interface SATA 3.0 (6Gb/s) Maximum Sequential Read Up to 515MB/s Maximum Sequential Write Up to 320MB/s Logical Blocks 250,069,680 Operating Temperature 0� to 70�C (32� to 158�F) [ambient temp] Features DIPM; TRIM NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. 256 GB 2280 M2 SATA Three Drive Weight Layer Cell Solid State Drive Capacity < 10g 256GB Height 2.23mm Length 80mm Width 22mm Interface SATA 3.0 (6Gb/s) Maximum Sequential Read Up to 515MB/s Maximum Sequential Write Up to 450MB/s Logical Blocks 500,118,192 Operating Temperature 0� to 70�C (32� to 158�F) [ambient temp] Features DIPM; TRIM NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. 128 GB 2280 PCIe NVMe Value Drive Weight Solid State Drive Capacity < 10g 128 GB Height 2.23mm Length 80mm Width 22mm Interface PCIE Gen3 Maximum Sequential Read Up to 770MB/s Maximum Sequential Write Up to 395MB/s Logical Blocks 250,069,680 Operating Temperature 0� to 70�C (32� to 158�F) [ambient temp] Features APST; ASPM L1.2; NVME spec 1.2 NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 12 QuickSpecs HP 200 G3 AiO Technical Specifications - Storage 256 GB 2280 PCIe NVMe Value Solid State Drive Drive Weight Capacity < 10g 256 GB Height 2.23mm Length 80mm Width 22mm Interface PCIE Gen3 Maximum Sequential Read Up to 1570MB/s Maximum Sequential Write Up to 540MB/s Logical Blocks 500,118,192 Operating Temperature 0� to 70�C (32� to 158�F) [ambient temp] Features APST; ASPM L1.2; NVME spec 1.2 NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 50 GB (for Windows 10) of system disk is reserved for the system recovery software. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 13 QuickSpecs Technical Specifications - Audio HP 200 G3 AiO HIGH DEFINITION AUDIO Type HD Audio Codec Audio I/O Ports Analog Audio Internal Speaker Amplifier Internal Speaker DAC Sampling Rates ADC Sampling Rates Integrated Realtek ALC3247 Audio Codec Rear 3.5mm combo (microphone/headphone) jack (32 Ohm) supporting CTIA style headset Microphone(2K Ohm) Yes 2W per channel stereo amplifier for the internal speakers only Yes - Stereo Speaker 44.1 kHz/48 kHz/96 kHz/192 kHz 44.1 kHz/48 kHz/96 kHz/192 kHz NOTE: All performance specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower. Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 14 QuickSpecs HP 200 G3 AiO Technical Specifications � input/Output INPUT/OUTPUT DEVICES HP USB Wired Keyboard Physical Characteristics Electrical Mechanical Environmental Keys Dimensions (L x W x H) Weight Operating voltage Power consumption System interface ESD EMI - RFI Microsoft� PC 99 - 2001 Keycaps Switch actuation Switch life Switch type Key-leveling mechanisms Cable length Microsoft PC 99 - 2001 Acoustics Operating temperature Non-operating temperature Operating humidity Non-operating humidity Operating shock Non-operating shock Operating vibration Non-operating vibration Drop (out of box) Drop (in box) Approvals Ergonomic compliance Kit contents Warranty Card 104, 105 layout (depending upon country) 17.04 x 5.55 x 0.52 in (433 x 141 x13.2 mm) 1.54 lb (698g) 6 VDC, +/-5% 35mA (All LED on) USB Type A plug connector Contact Discharge: 8 KV Air Discharge: 15 KV Conforms to FCC rules for a Class B computing device Functionally compliant Low-profile design 60�10g nominal peak force with tactile feedback 11 million keystrokes (Life tester) Contamination-resistant switch membrane For all double-wide and greater-length keys 7 ft (1.8 m) Mechanically compliant 43-dBA maximum sound pressure level 50� to 122� F (10� to 50� C) -22� to 140� F (-30� to 60� C) 10% to 90% (non-condensing at ambient) 20% to 80% (non-condensing at ambient) 40 g, six surfaces 80 g, six surfaces 2-g peak acceleration 4-g peak acceleration 27 in (66 cm) on carpet, six-drop sequence 31 in (76.2 cm) on concrete, 16-drop sequence UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC TUVGS Keyboard, QSP Product Notice Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 15 QuickSpecs HP 200 G3 AiO Technical Specifications � input/Output USB Mouse Dimensions (H x L x W) Weight Environmental Electrical Mechanical 4.21 x 2.64 x 1.52 in (107 x 67 x 38.7 mmm) 0.19lb (90g) Operating temperature Non-operating temperature Operating humidity Non-operating humidity Operating shock Non-operating shock Operating vibration Non-operating vibration Operating voltage Power consumption Connector Type Resolution Sensor Tracking speed Tracking acceleration Cable length Color Regulatory Approvals 50� to 122�F (10� to 50� C) -22� to 140�F (-30� to 60� C) 10% to 90% (non condensing at ambient) 20% to 80% (non condensing at ambient) 50 g, 6 surfaces 80 g, 6 surfaces 2 g peak acceleration 4 g peak acceleration 6 VDC � 5% 12 mA USB 2.1 3D mouse (3 keys and wheel) 800, 1200, 1600 DPI Pixart PAN3606DL 31 inch/sec (max) 8G(max), 1G=9.8m/s3 7 ft (1.8 m) Jack Black UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 16 QuickSpecs HP 200 G3 AiO Technical Specifications � Networking NETWORKING/COMMUNICATIONS Realtek� RTL8111HSH-CG Gigabit Ethernet Controller Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet) Jumbo Frame 9K Auto MDI/MDIX Crossover cable detection Power Management ACPI compliant � multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption Performance Features TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status Interface PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ NIC Device Driver Name PCIe GBE Ethernet Family Controller Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 17 QuickSpecs HP 200 G3 AiO Technical Specifications � Networking WLAN Realtek� RTL8821CE 802.11AC 1x1 Wi-Fi M.2 Card Wireless LAN Standards Interoperability Frequency Band Data Rates Modulation Security1 Network Architecture Models Roaming Output Power2 Power Consumption IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac Wi-Fi certified 802.11b/g/n � 2.402 � 2.482 GHz 802.11a/n � 4.9 � 4.95 GHz (Japan) � 5.15 � 5.25 GHz � 5.25 � 5.35 GHz � 5.47 � 5.725 GHz � 5.825 � 5.850 GHz � 802.11b: 1, 2, 5.5, 11 Mbps � 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps � 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps � 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz) � 802.11ac : MCS0 ~ MCS9, (1SS and 2SS) (20MHz, 40MHz, and 80MHz) Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM � IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only � AES-CCMP: 128 bit in hardware � 802.1x authentication � WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. � WPA2 certification � IEEE 802.11i � Cisco Certified Extensions, all versions through CCX4 and CCX Lite � WAPI Ad-hoc (Peer to Peer) Infrastructure (Access Point Required) IEEE 802.11 compliant roaming between access points � 802.11b : +14dBm minimum � 802.11g : +12dBm minimum � 802.11a : +12dBm minimum � 802.11n HT20(2.4GHz) : +12dBm minimum � 802.11n HT40(2.4GHz) : +12dBm minimum � 802.11n HT20(5GHz) : +10dBm minimum � 802.11n HT40(5GHz) : +10dBm minimum � 802.11ac VHT80M(5GHz) : +10dBm minimum � Transmit mode2.0 W � Receive mode1.6 W � Idle mode (PSP)180 mW(WLAN Associated) � Idle mode50 mW(WLAN unassociated) � Connected Standby 10mW Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 18 QuickSpecs HP 200 G3 AiO Technical Specifications � Networking Power Management Receiver Sensitivity3 Antenna type Form Factor Dimensions Weight Operating Voltage Temperature Humidity Altitude LED Activity � Radio disabled8 mW ACPI and PCI Express compliant power management 802.11 compliant power saving mode 802.11b, 1Mbps: -93.5dBm maximum 802.11b, 11Mbps: -84dBm maximum 802.11a/g, 6Mbps: -86dBm maximum 802.11a/g, 54Mbps: -72dBm maximum 802.11n, MCS07: -67dBm maximum 802.11n, MCS15: -64dBm maximum 802.11ac, MCS0: -84dBm maximum 802.11ac, MCS9: -59dBm maximum High efficiency antenna. One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN communications PCI-Express M.2 MiniCard Type 2230: 2.3 x 22.0 x 30.0 mm Type 2230: 2.8g 3.3v +/- 9% Operating 14� to 158� F (�10� to 70� C) Non-operating �40� to 176� F (�40� to 80� C) Operating 10% to 90% (non-condensing) Non-operating 5% to 95% (non-condensing) Operating 0 to 10,000 ft (3,048 m) Non-operating 0 to 50,000 ft (15,240 m) LED Amber � Radio OFF; LED White � Radio ON 1. Check latest software/driver release for updates on supported security features. 2. Maximum output power may vary by country according to local regulations. 3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation). Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 19 QuickSpecs HP 200 G3 AiO Technical Specifications - Power POWER Efficiency Operating Voltage Range Rated Voltage Range Rated Line Frequency Operating Line Frequency Rated Input Current Rated Input Current with Energy Efficient* Power Supply DC Output Current Leakage (NFPA 99: 2102) External Power Adapter Dimensions 65W EPS, 89% average efficiency at 115V & 230Vac (Level VI) 90Vac~264Vac 100Vac~240Vac 50HZ~60HZ 47HZ~63HZ 65W1.6A 65W1.6A +19.5V Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as required for Non-Patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1. Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal polarity, as required for Non-Patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1. External power supply 65W: 113.5mm x 55mm x 30mm Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 20 QuickSpecs Technical Specifications � Miscellaneous Features HP 200 G3 AiO ADDITIONAL FEATURES SMART Technology (Self-Monitoring, Analysis and Reporting Technology) Description Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 21 QuickSpecs Technical Specifications � Environmental HP 200 G3 AiO ENVIRONMENTAL & INDUSTRY Eco-Label Certifications & declarations System Configuration Energy Consumption (in accordance with US ENERGY STAR� test method) Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured � Idle Fixed Disk � Random writes Longevity and Upgrading Batteries This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks: � IT ECO declaration � US ENERGY STAR� � EPEAT� 2019 registered where applicable. EPEAT� registration varies by country. See http://www.epeat.net for registration status by country. The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a "Typically Configured Desktop". 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz 19.076 7.123 0.468 0.302 19.109 7.146 0.503 0.348 18.911 7.074 0.46 0.292 NOTE: Energy efficiency data listed is for an ENERGY STAR� certified product if offered within the model family. HP computers marked with the ENERGY STAR� Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR� specifications for computers. If a model family does not offer ENERGY STAR� certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows� operating system. Search keyword generator on HP's 3rd party option store for solar generator accessories at http://www.hp.com/go/options 115VAC, 60Hz 65.04916 24.28943 1.59588 1.02982 230VAC, 50Hz 65.16169 24.36786 1.71523 1.18668 100VAC, 50Hz 64.48651 24.12234 1.5686 0.99572 NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) 2.3 3.2 2.3 3.3 This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: Spare parts are available throughout the warranty period and or for up to "5" years after the end of production. This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater the1ppm by weight Cadmium greater than 20ppm by weight Battery size: CR2032 (coin cell) Battery type: Lithium Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 22 QuickSpecs HP 200 G3 AiO Technical Specifications � Environmental Additional Information � This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive - 2011/65/EC. � This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive � 2002/96/EC. � This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). � Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. � This product contains 38.3% post-consumer recycled plastic (by wt.) � This product is 95.8% recycle-able when properly disposed of at end of life. Packaging Materials Material Usage External: PAPER/Corrugated 1369 Internal: PLASTIC/EPS (Expanded Polyethylene) 349 PLASTIC/Polyethylene low density 50 The plastic packaging material contains at least 100% recycled content. The corrugated paper packaging materials contains at least 80% recycled content. This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf): � Asbestos � Certain Azo Colorants � Certain Brominated Flame Retardants � may not be used as flame retardants in plastics � Cadmium � Chlorinated Hydrocarbons � Chlorinated Paraffins � Formaldehyde � Halogenated Diphenyl Methanes � Lead carbonates and sulfates � Lead and Lead compounds � Mercuric Oxide Batteries � Nickel � finishes must not be used on the external surface designed to be frequently handled or carried by the user. � Ozone Depleting Substances � Polybrominated Biphenyls (PBBs) � Polybrominated Biphenyl Ethers (PBBEs) � Polybrominated Biphenyl Oxides (PBBOs) � Polychlorinated Biphenyl (PCB) � Polychlorinated Terphenyls (PCT) � Polyvinyl Chloride (PVC) � except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. � Radioactive Substances � Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 23 QuickSpecs HP 200 G3 AiO Technical Specifications � Environmental Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging: � Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. � Eliminate the use of ozone-depleting substances (ODS) in packaging materials. � Design packaging materials for ease of disassembly. � Maximize the use of post-consumer recycled content materials in packaging materials. � Use readily recyclable packaging materials such as paper and corrugated materials. � Reduce size and weight of packages to improve transportation fuel efficiency. � Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. End-of-life Management and Recycling HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and resell HP equipment. HP, Inc. Corporate Environmental Information For more information about HP's commitment to the environment: Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html ISO 14001 certifications: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf Not all configuration components are available in all regions/countries. c05945475 -- DA16184 -- Worldwide -- Version 7 -- October 15, 2019 Page 24 QuickSpecs HP 200 G3 AiO Change Log Summary of Changes Date of change: April 30, 2018 July 2, 2018 July 20, 2018 Version History: V1 to V2 V2 to V3 V3 to V4 Update Update Update May 29, 2019 July 8, 2019 October 15, 2019 V4 to V5 V5 to V6 V6 to V7 Update Update Update Description of change: Environmental Tab Optional configurations for available memory slots fixed. Intel� Pentium� Silver J5005 added to Processors section. Intel� UHD Graphics 605 and NOTE added to Integrated in Graphics section. EPEAT references updated Internal Speaker Amplifier row added to High definition audio specs. Miscellaneous Features added Copyright � 2019 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Bluetooth is a trademark of its proprietor and used by HP Inc. under license. Intel�, Core, Celeron and Intel� vPro are trademarks of Intel� Corporation or its subsidiaries in the U.S. and/or other countries. ENERGY STAR is a registered trademark of the U.S. Environmental Protection Agency. All other trademarks are the property of their respective owners. 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