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SIM7600 Series Hardware Design V1.03 - simcom.ee
Description. [1]. SIM7500 SIM7600 Series AT. Command Manual V1.xx. AT Command Manual. [2]. ITU-T Draft new. recommendationV.25ter.
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Confidential File SIM7600 Series_Hardware Design_V1.03 SIMCom
Smart Machine Smart Decision
ocument Title
SIM7600 Series _Hardware Design
Version
1.03
Date
2019-4-30
Status
Released
Document Control ID
SIM7600 Series _Hardware Design _V1.03
tial General Notes
SIMCom offers this information as a service to its customers to support the application and
n engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
e search for additional relevant information, including any information that may be in the customer's
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
fid electronic system remains the responsibility of the customer or the customer's system integrator.
All specifications supplied herein are subject to change without notice.
n Copyright
This document contains the proprietary technical information which is the property of SIMCom
o Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
C payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
SIMCom Copyright � SIMCom Wireless Solutions Co., Ltd. 2019
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Contents
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Contents .............................................................................................................................................3
Table Index ........................................................................................................................................5
Revision History................................................................................................................................7
1 Introduction................................................................................................................................8
1.1 Product Outline .....................................................................................................................8 1.2 Hardware Interface Overview ...............................................................................................9 1.3 Hardware Block Diagram......................................................................................................9 1.4 Functional Overview ...........................................................................................................10
l 2 Package Information................................................................................................................12 tia 2.1 Pin Assignment Overview...................................................................................................12
2.2 Pin Description....................................................................................................................14 2.3 Mechanical Information ......................................................................................................18 2.4 Footprint Recommendation.................................................................................................19
n 3 Interface Application ...............................................................................................................20 e 3.1 Power Supply ......................................................................................................................20
3.1.1 Power Supply Design Guide ........................................................................................21
fid 3.1.2 Recommended Power Supply Circuit ..........................................................................22
3.1.3 Voltage Monitor............................................................................................................22 3.2 Power on/Power off/Reset Function....................................................................................23
n 3.2.1 Power on.......................................................................................................................23
3.2.2 Power off ......................................................................................................................24
o 3.2.3 Reset Function ..............................................................................................................26
3.3 UART Interface ...................................................................................................................26
C 3.3.1 UART Design Guide ....................................................................................................27
3.3.2 RI and DTR Behavior...................................................................................................28 3.4 USB Interface......................................................................................................................29 3.5 USIM Interface....................................................................................................................30
m 3.5.1 USIM Application Guide..............................................................................................30
3.6 PCM Interface .....................................................................................................................33
o 3.6.1 PCM timing ..................................................................................................................33
3.6.2 PCM Application Guide ...............................................................................................35
C3.7 SD Interface ........................................................................................................................35
3.8 I2C Interface........................................................................................................................36 3.9 SDIO Interface ....................................................................................................................37
IM3.10 SPI Interface ....................................................................................................................37 3.11 Network status .................................................................................................................37
S 3.12 Flight Mode Control ........................................................................................................38 3.13 Other interface .................................................................................................................38
3.13.1 Sink Current Source ..................................................................................................38
3.13.2 ADC ..........................................................................................................................39
3.13.3 LDO ..........................................................................................................................39
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4 RF Specifications......................................................................................................................41 4.1 GSM/UMTS/LTE RF Specifications ..................................................................................41 4.2 GSM /UMTS/LTE Antenna Design Guide..........................................................................43 4.3 GNSS ..................................................................................................................................45 4.3.1 GNSS Technical specification ......................................................................................45 4.3.2 GNSS Application Guide .............................................................................................45
5 Electrical Specifications...........................................................................................................47 5.1 Absolute maximum ratings .................................................................................................47 5.2 Operating conditions ...........................................................................................................47 5.3 Operating Mode ..................................................................................................................48 5.3.1 Operating Mode Definition ..........................................................................................48
l 5.3.2 Sleep mode ...................................................................................................................49
5.3.3 Minimum functionality mode and Flight mode............................................................49
tia 5.4 Current Consumption ..........................................................................................................50
5.5 ESD Notes...........................................................................................................................52
6 SMT Production Guide ...........................................................................................................53
n 6.1 Top and Bottom View of module ........................................................................................53
6.2 Label Information................................................................................................................53
e 6.3 Typical SMT Reflow Profile ...............................................................................................54 fid 6.4 Moisture Sensitivity Level (MSL) ......................................................................................54
6.5 Stencil Foil Design Recommendation .................................................................................55
7 Packaging..................................................................................................................................56
n Appendix ..........................................................................................................................................58 A. Reference Design......................................................................................................................58 o B. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................59 C C. Related Documents ...................................................................................................................61 D. Terms and Abbreviations..........................................................................................................63
SIMCom E. Safety Caution...........................................................................................................................65
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Table Index
Table 1: Module frequency bands ........................................................................................................................ 8 Table 2: General features ................................................................................................................................... 10 Table 3: Pin definition........................................................................................................................................ 13 Table 4: IO parameters definition....................................................................................................................... 14 Table 5: Pin description...................................................................................................................................... 14 Table 6: VBAT pins electronic characteristic ..................................................................................................... 20 Table 7: Recommended TVS list ....................................................................................................................... 21 Table 8: Power on timing and electronic characteristic...................................................................................... 24 Table 9: Power off timing and electronic characteristic ..................................................................................... 25
l Table 10: RESET pin electronic characteristic................................................................................................... 26
Table 11: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)................................................... 30
tia Table 12: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 30
Table 13: Amphenol USIM socket pin description ............................................................................................ 32 Table 14: PCM format........................................................................................................................................ 33 Table 15: PCM timing parameters(2G/3G mode) .............................................................................................. 34
n Table 16: PCM timing parameters(4G mode) .................................................................................................... 34 e Table 17: MMC/SD electronic characteristic (SD_DATA0-SD_DATA3SD_CLK and SD_CMD) * ............ 35
Table 18: NETLIGHT pin status........................................................................................................................ 37
fid Table 19: FLIGHTMODE pin status.................................................................................................................. 38
Table 20: Sink current electronic characteristic ................................................................................................. 38 Table 21: ADC1 and ADC2 electronic characteristics ....................................................................................... 39 Table 22: Electronic characteristic ..................................................................................................................... 40
n Table 23: Conducted transmission power .......................................................................................................... 41 o Table 24: Operating frequencies ........................................................................................................................ 41
Table 25: E-UTRA operating bands ................................................................................................................... 42
C Table 26: Conducted receive sensitivity............................................................................................................. 42
Table 27: Reference sensitivity (QPSK) ............................................................................................................ 43 Table 28: Trace loss ........................................................................................................................................... 43 Table 29: Recommended TVS ........................................................................................................................... 45
m Table 30: Absolute maximum ratings................................................................................................................. 47
Table 31: Recommended operating ratings ........................................................................................................ 47
o Table 32: 1.8V Digital I/O characteristics* ........................................................................................................ 47
Table 33: Operating temperature........................................................................................................................ 48 Table 34: Operating mode Definition................................................................................................................. 48
CTable 35: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 50
Table 36: The ESD performance measurement table (Temperature: 25, Humidity: 45%) ............................. 52
IMTable 37: The description of label information .................................................................................................. 54 Table 38: Moisture Sensitivity Level and Floor Life ......................................................................................... 55 Table 39: Tray size ............................................................................................................................................. 57
S Table 40: Small Carton size ............................................................................................................................... 57 Table 41: Big Carton size................................................................................................................................... 57 Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface................................................... 59 Table 43: Related Documents ............................................................................................................................ 61
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Figure Index
Figure 1: module block diagram ........................................................................................................................ 10 Figure 2: Pin assignment overview .................................................................................................................... 12 Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 18 Figure 4: Footprint recommendation (Unit: mm)............................................................................................... 19 Figure 5: VBAT voltage drop during burst emission (GSM/GPRS) .................................................................. 20 Figure 6: Power supply application circuit......................................................................................................... 21 Figure 7: Linear regulator reference circuit ....................................................................................................... 22
l Figure 8: Switching mode power supply reference circuit................................................................................. 22
Figure 9: Reference power on/off circuit ........................................................................................................... 23
tia Figure 10: Power on timing sequence ................................................................................................................ 24
Figure 11: Power off timing sequence................................................................................................................ 25 Figure 12: Reference reset circuit ...................................................................................................................... 26 Figure 13: UART full modem ............................................................................................................................ 27
n Figure 14: UART null modem ........................................................................................................................... 27 e Figure 15: Reference circuit of level shift.......................................................................................................... 27
Figure 16: Level matching circuit with triode.................................................................................................... 28
fid Figure 17: RI behaviourSMS and URC report ........................................................................................... 28
Figure 18: RI behaviourvoice call .............................................................................................................. 29 Figure 19: USB reference circuit ....................................................................................................................... 29 Figure 20: USIM interface reference circuit ...................................................................................................... 31
n Figure 21: Amphenol SIM card socket .............................................................................................................. 32 o Figure 22: PCM_SYNC timing.......................................................................................................................... 33
Figure 23: EXT codec to module timing............................................................................................................ 33
C Figure 24: Module to EXT codec timing ........................................................................................................... 34
Figure 25: Audio codec reference circuit ........................................................................................................... 35 Figure 26: SD reference circuit .......................................................................................................................... 36 Figure 27: I2C reference circuit ......................................................................................................................... 36
m Figure 28: NETLIGHT reference circuit............................................................................................................ 37
Figure 29: Flight mode switch reference circuit................................................................................................. 38
o Figure 30: ISINK reference circuit..................................................................................................................... 39
Figure 31: Antenna matching circuit (MAIN_ANT).......................................................................................... 44 Figure 32: Antenna matching circuit (AUX_ANT)............................................................................................ 44
CFigure 33: Active antenna circuit ....................................................................................................................... 46
Figure 34: Passive antenna circuit (Default) ...................................................................................................... 46
IMFigure 35: Top and bottom view of module ....................................................................................................... 53 Figure 36: Label information ............................................................................................................................. 53 Figure 37: The ramp-soak-spike reflow profile of module................................................................................. 54
S Figure 38: packaging diagram............................................................................................................................ 56 Figure 39: Tray drawing..................................................................................................................................... 56 Figure 40: Small carton drawing........................................................................................................................ 57 Figure 41: Big carton drawing ........................................................................................................................... 57
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Revision History
Data 2017-10-11
Version 1.00
2017-11-23
1.01
2018-4-11
V1.02
2019-4-30
V1.03
ile Description of change F Original
Author
Ma Honggang Gao Fan
l Modify Table2,Table15,Table 8,Table16, Table21, tia Table 26
Modify Figure 4,Figure 10 Modify 3.13.3 LDO output voltage 2.85V by default. Rename VDD_EXT to VDD_AUX
Gao Fan Yuan Shijie
en Modify table 1,2,5,15,22,34
Modify figure 4,36,37 Modify the document name
Yuan Shijie Gao Fan
nfid Update table 8;
Update table 10;
Co Updata table 30;
Ma Honggang
SIMCom
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Standard GSM
ile 1 Introduction F This document describes the electronic specifications, RF specifications, interfaces, mechanical l characteristics and testing results of the SIMCom module. With the help of this document and other
software application notes/user guides, users can understand and use module to design and develop
tia applications quickly.
1.1 Product Outline
Aimed at the global market, the module support GSM, WCDMA, LTE-TDD and LTE-FDD. Users
n can choose the module according to the wireless network configuration. The supported radio e frequency bands are described in the following table. fid Table 1: Module frequency bands
Frequency SIM7600A SIM7600A-H SIM7600V-H SIM7600E SIM7600E-H SIM7600JC-H SIM7600SA SIM7600SA-H
850MHz
n 900MHz
o 1800M Hz
C 1900M Hz
B1
B2 WCDMA
B5
m B8
FDD B1
o FDD B2
FDD B3
C FDD B4
FDD B5
IM LTE
FDD B7
FDD B8
SFDD B12
FDD B13
FDD B18
FDD B19
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FDD B20
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FDD B26
FDD B28
TDD B38
TDD B40
TDD B41
Category
CAT1
CAT4
CAT4
CAT1
CAT4
CAT4
CAT1
With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the module can meet almost any space requirement in users' applications, such as smart phone, PDA, industrial handheld, machine-to-machine and vehicle application, etc.
l 1.2 Hardware Interface Overview tia The interfaces are described in detail in the next chapters include:
Power Supply
n USB Interface
UART Interface
e MMC/SD Interface
SDIO Interface
fid USIM Interface
GPIO ADC
n LDO Power Output
Current Sink Source
o PCM Interface
SPI Interface
C I2C Interface
1.3 Hardware Block Diagram
SIMCom The block diagram of the module is shown in the figure below.
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GNSS Antenna
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Main Antenna AUX Antenna
DDR
NAND
GNSS
Flash
GSM/UMTS/ LTE RF FEM
UMTS/LTE RF FEM
ile TX
RX
{ RF UMTS/LTE PA
DRX
l F VBAT tia VBAT
RF
Qualcomm Chip
RF Transceiver
System Power
XO 19.2MHz
Baseband
Power Management
en Figure 1: module block diagram
fid 1.4 Functional Overview
on Table 2: General features
C Feature
Implementation
SMT Interface
USIM UART SDIO
MMC/SD
I2C
USB
PCM
GPIOs Interrupt
ADC LDO
Status LED
SPI
Sink Current Source SGMII
Power On Reset
VBAT
Power supply
Single supply voltage 3.44.2V recommend 3.8V.
Power saving Radio frequency bands
SIMCom Transmitting power
Current in sleep mode : <5mA Please refer to the table 1 GSM/GPRS power class:
--GSM850: 4 (2W) --EGSM900: 4 (2W) --DCS1800: 1 (1W) --PCS1900: 1 (1W) EDGE power class: --GSM850: E2 (0.5W) --EGSM900: E2 (0.5W) --DCS1800: E1 (0.4W) --PCS1900: E1 (0.4W) UMTS power class:
--WCDMA :3 (0.25W)
LTE power class: 3 (0.25W)
Data Transmission Throughput
GPRS multi-slot class 12 EDGE multi-slot class 12
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UMTS R99 speed: 384 kbps DL/UL
HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
HSDPA/HSUPA: 2.2 Mbps(UL), 2.8 Mbps(DL)
Antenna GNSS SMS USIM interface USIM application toolkit Phonebook management Audio feature
UART interface
LTE CAT 1: 10 Mbps(DL) 5 Mbps(UL)
LTE-FDD CAT4 150 Mbps (DL)50 Mbps (UL)
ile LTE-TDD CAT4 130 Mbps (DL)35 Mbps (UL)
GSM/UMTS/LTE main antenna. UMTS/LTE auxiliary antenna
F GNSS antenna
GNSS engine (GPS,GLONASS and BD)
l Protocol: NMEA tia MT, MO, CB, Text and PDU mode
SMS storage: USIM card or ME(default) Transmission of SMS alternatively over CS or PS.
n Support identity card: 1.8V/ 3V
Support SAT class 3, GSM 11.14 Release 98
e Support USAT
Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
fid Support PCM interface
Only support PCM master mode and short frame sync, 16-bit linear data formats
n A full modem serial port by default
Baud rate: 300bps to 4Mbps(default:115200bps)
o Autobauding baud rate: 9600,19200,38400,57600,115200bps CCan be used as the AT commands or data stream channel
Support RTS/CTS hardware handshake
MMC/SD SDIO
Multiplex ability according to GSM 07.10 Multiplexer Protocol Support MMC and SD cards with 2.85 V on SD port Support SDIO with 1.8 V only on SDIO port
m USB
USB 2.0 high speed interface
o Firmware upgrade
Firmware upgrade over USB interface or FOTA
CPhysical characteristics
Size:30*30*2.9m Weight:5.7 g
IMTemperature range
Normal operation temperature: -30�C to +80�C Extended operation temperature: -40�C to +85�C* Storage temperature -45�C to +90�C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
S GPRS/UMTS/HSPA+/LTE traffic in -40 ~ +85. The performance will be reduced slightly
from the 3GPP specifications if the temperature is outside the normal operating temperature
range and still within the extreme operating temperature range.
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2 Package Information
2.1 Pin Assignment Overview
All functions of the module will be provided through 87 pads that will be connected to the
customers' platform. The following Figure is a high-level view of the pin assignment of the
module.
Confidential
File
SIMComFigure 2: Pin assignment overview
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Table 3: Pin definition
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Pin No. Pin name
1
GND
3
PWRKEY
5
GND
7
SPI_MISO
9
SPI_CS
11
USB_VBUS
13
USB_DP
15
VDD_1V8
17
USIM_DATA
19
USIM_CLK
21
SD_CMD
23
SD_DATA1
25
SD_DATA3
27
SDIO_DATA1
29
SDIO_CMD
31
SDIO_DATA3
33
GPIO3
35
HSIC_STROBE
37
GND
39
VBAT
41
GND
43
GND
45
ISINK
m 47
ADC1
49
STATUS
o 51
NETLIGHT
C53
USIM_DET
55
SCL
57
GND
IM59
AUX_ANT
S 61
GND
63
VBAT
65
GND
67
CTS
Pin No. Pin name
2
GND
4
RESET
6
SPI_CLK
8
SPI_MOSI
10
GND
12
USB_DN
14
GND
l 16
USB_ID
tia 18
USIM_RST
20
USIM_VDD
22
SD_DATA0
n 24
SD_DATA2
e 26
SD_CLK
28
SDIO_DATA2
fid 30
SDIO_DATA0
32
SDIO_CLK
34
GPIO6
n36
HSIC_DATA
o38
VBAT
C 40
GND
42
NC (RESERVED)
44
VDD_AUX
46
ADC2
48
SD_DET
50
GPIO43*
52
GPIO41
54
FLIGHTMODE
56
SDA
58
GND
60
GND
62
VBAT
64
GND
66
RTS
68
RXD
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69
RI
70
DCD
71
TXD
72
DTR
73
PCM_OUT
74
PCM_IN
75
PCM_SYNC
76
PCM_CLK
77
GND
78
GND
79
GNSS_ANT
80
GND
81
GND
82
MAIN_ANT
83
COEX1*
84
COEX2
85
BOOT_CFG0*
86
COEX3*
l 87
GPIO77
NOTE: Before the normal power up, GPIO43COEX1, COEX3 or BOOT_CFG0
tia cannot be pulled up, otherwise module will not be powered up normally.
2.2 Pin Description
en Table 4: IO parameters definition
fid Pin type
PI PO AI
n AIO o I/O
DI
C DO
Description Power input Power output Analog input Analog input/output Bidirectional input /output Digital input Digital output
DOH DOL PU
m PD
Digital output with high level Digital output with low level Pull up Pull down
o Table 5: Pin description
CPin name
Power supply
SIMVBAT
Pin No.
38,39, 62,63
Default status
PI
Description
Power supply, voltage range: 3.44.2V. LDO power output for other external circuits with Max
VDD_AUX 44
150mA current output. Its
PO
output voltage is 2.85V by
default.The voltage can be
configured from 1.7V to 3.05V
Comment
If unused, keep it open.
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by AT command.
1.8 output with Max 50mA
If unused, keep it
VDD_1V8
15
PO
current output for external circuit, such as level shift
open.
circuit.
1,2,5,
10,14,37
,40,41,4
GND
3,57,58,
Ground
60,61,64
,65,77,7 8,80,81
System Control
PWRKEY
3
RESET
4
SD interface
SD_CMD
21
SD_DATA0 22
SD_DATA1 23
SD_DATA2 24
SD_DATA3 25
SD_CLK
26
USIM interface
l DI,PU
System power on/off control input, active low.
tia DI, PU
System reset control input, active low.
The high voltage is
0.8V;
RESET has been pulled up to 1.8V via 40Kohm resistor internally.
en DO
SDIO command
I/O
fid I/O
SDIO data
I/O
I/O
n DO
SDIO clock
SIM7600A,SIM7600 A-H and SIM7600V-H do not support SD card. If unused, keep them open.
oUSIM Card data I/O, which has Cbeen pulled up via a 10KR
USIM_DATA 17
I/O,PU
USIM_RST 18
DO
om USIM_CLK 19
DO
CUSIM_VDD 20
PO
IMSPI interface
S SPI_CLK
6
DO
resistor to USIM_VDD internally. Do not pull it up or down externally. USIM Reset
USIM clock
All lines of USIM interface should be protected against ESD.
Power output for USIM card, its output Voltage depends on USIM card type automatically. Its output current is up to 50mA.
SPI clock output
SPI_MISO
7
DI
SPI master in/slave out data
RESERVED
SPI_MOSI
8
DO
SPI master out/slave in data
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SPI_CS
9
DO
SPI chip-select output
USB
USB_VBUS 11
DI,PD
Valid USB detection input with 3.0~5.25V detection voltage
USB_DN
12
I/O
Negative line of the differential, bi-directional USB signal.
USB_DP
13
I/O
Positive line of the differential, bi-directional USB signal.
USB_ID
16
UART interface
RTS
66
CTS
67
RXD
68
RI
69
DCD
70
TXD
71
DTR
72
I2C interface
SCL
55
SDA
56
SDIO interface SDIO_DATA1 27 SDIO_DATA2 28
DI
High-speed USB ID input
l DOL
DI,PU
tia DI,PU
DOH
DOH
n DOH
DI,PU
Request to send Clear to Send Receive Data Ring Indicator Carrier detects Transmit Data DTE get ready
fide DO
I2C clock output
I/O
I2C data input/output
on I/O
SDIO data1
CI/O
SDIO data2
Keep it open.
If unused, keep them open.
If unused, keep open, or else pull them up via 2.2K resistors to 1.8V.
SDIO_CMD 29
DO
SDIO command
SDIO_DATA0 30 SDIO_DATA3 31 SDIO_CLK 32
m HSIC interface
o HSIC_STROB
E
35
CHSIC_DATA 36
PCM interface
IMPCM_OUT 73
PCM_IN
74
PCM_SYNC 75
S PCM_CLK
76
I/O I/O DO
HSIC strobe wakeup I/O
DO DI DO DO
SDIO data0 SDIO data3 SDIO clock
HSIC strobe wakeup
HSIC data
PCM data output. PCM data input. PCM data frame sync signal. PCM data bit clock.
If use, please refer to document [27] Otherwise please keep them open.
If unused, please keep them open.
GPIO
NETLIGHT 51
DO
LED control output as network If unused, keep them
status indication.
open.
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FLIGHTMODE 54
STATUS
49
GPIO41
52
DI,PU
DO IO
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Flight Mode control input. High level(or open): Normal Mode Low level: Flight Mode
DO NOT PULL UP GPIO43 DURING NORMAL POWER UP!
Operating status output. High level: Power on and firmware ready Low level: Power off
GPIO
GPIO43
50
GPIO3
33
GPIO6
34
SD_DET
48
USIM_DET 53
GPIO77
87
RF interface
MAIN _ANT 82
GNSS_ANT 79
AUX_ANT 59
Other interface
ISINK
45
IO
GPIO
IO
GPIO
l IO
GPIO
Default: GPIO
tia Optional: SD card detecting
IO
input.
H: SD card is removed
L: SD card is inserted
Default: GPIO
n Optional: USIM card detecting
IO
input.
e H: USIM is removed
L: USIM is inserted
fid IO
GPIO
AIO
MAIN antenna soldering pad
n AI
GNSS antenna soldering pad
o AI
Auxiliary antenna soldering pad
CPI
Ground-referenced current sink.
ADC1
m ADC2
COEX1
o COEX2 CCOEX3
47
AI
46
AI
83
I/O
84
I/O
86
I/O
SIMBOOT_CFG0 85
DI,PD
Analog-digital converter input 1 Analog-digital converter input 2
RF synchronizing between Wi-Fi and LTE.
Boot configuration input. Module will be forced into USB download mode by connect 85 pin to VDD_1V8 during power up.
If unused, please keep them open.
If unused, keep them open. DO NOT PULL UP COEX1 AND COEX3 DURING NORMAL POWER UP! Do place 2 test points for debug. DO NOT PULL UP BOOT_CFG0 DURING NORMAL POWER UP!
NC
42
No connection.
Keep it open
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2.3 Mechanical Information
Confidential File The following figure shows the package outline drawing of module. SIMComFigure 3: Dimensions (Unit: mm)
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2.4 Footprint Recommendation
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Confidential File Figure 4: Footprint recommendation (Unit: mm) SIMCom
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3 Interface Application
3.1 Power Supply
The power supply pins of module include 4 pins (pin 62&63, pin 38&39) named VBAT.
The 4 VBAT pads supply the power to RF and baseband circuits directly. On VBAT pads, the ripple
current up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop is more than 300mV.
l The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase.
tia 577us
IVBAT
en VBAT
4.615ms
Burst:2A Max:300mV
fid Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)
Note: The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 �F tantalum
n capacitor (ESR=0.7) and Cf=100nF (Please refer to Figure 6--Application circuit). Co Table 6: VBAT pins electronic characteristic
Symbol
Description
Min. Typ. Max. Unit
VBAT IVBAT(peak)
m IVBAT(average)
IVBAT(sleep)
SIMCo IVBAT(power-off)
Module power voltage Module power peak current in normal mode. Module power average current in normal mode Power supply current in sleep mode Module power current in power off mode.
3.4 3.8
4.2 V
-
2
- A
Please refer to the table 34
-
-
20
uA
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3.1.1 Power Supply Design Guide
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Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit
burst, when current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF
performance may be affected.
Note: If the power supply for VBAT pins can support up to 2A, more than 300uF capacitors are
recommended .Otherwise users must use a total of 1000uF capacitors typically, in order to avoid
of the voltage drop more than 300mV.
Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band
can be used for EMC.
These capacitors should be put as close as possible to VBAT pads. Also, users should keep
l VBAT trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following
figure shows the recommended circuit. Recommend part of FB101 is BLM21PG300SN1D or
tia MPZ2012S221A
n Module VBAT 62 VBAT 63 GND 61 e GND 64 VBAT 38 fid VBAT 39 GND 37
GND 40
Cc
Cb
1uF 100uF
FB101
VBAT
Ca
TVS
100uF
Cf 100nF
Ce 100uF
Cd 100uF
n Figure 6: Power supply application circuit o In addition, in order to guard for ESD or surge protection, it is suggested to use a TVS to protect C the module.
Note: customer could only power pin 62, 63 or only power pin 38, 39, for these pins are connected inside the module.
Table 7: Recommended TVS list
om No. Manufacturer Part Number
Power dissipation Package
1
Js-ele
ESDBW5V0A1
5V
DFN1006-2L
2
Prisem
PESDHC2FD4V5BH 4.5V
DFN1006-2L
C3
Way-on
WS05DPF-B
5V
DFN1006-2L
4
Will semi
ESD5611N
5V
DFN1006-2L
IM5
Will semi
ESD56151W05
5V
SOD-323
S6
Way-on
WS4.5DPV
4.5V
DFN1610-2L
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3.1.2 Recommended Power Supply Circuit
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It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2A. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.
DC INPUT
U101 MIC29302
VBAT
l FUSE
+ C101
100uF
C102 1uF
2 Vin
1 On/Off
PWR_CTRL
3
GND
Vout 4 FB 5
R101 100K
R102 47K
+ R103 C103 C104
470R 330uF 100nF
tia Figure 7: Linear regulator reference circuit
n If there is a big voltage difference between input and output for VBAT power supply, or the e efficiency is extremely important, then a switching mode power supply will be preferable. The
following figure shows the switching mode power supply reference circuit.
fid DC INPUT Con FUSE
U101 LM2596- ADJ
1 Vin
Vout 2
+ C101 C102
5 On/Off
100uF
1uF PWR_CTRL
3
GND
FB 4
L101
FB101 VBAT
100uH R101
D102
2.2K
+ C103
270 ohm@100Mhz C104
MBR360
330uF
100nF
R102 1K
Figure 8: Switching mode power supply reference circuit
Note: The Switching Mode power supply solution for VBAT must be chosen carefully against
m Electro Magnetic Interference and ripple current from depraving RF performance. o 3.1.3 Voltage Monitor CTo monitor the VBAT voltage, the AT command "AT+CBC" can be used. IMFor monitoring the VBAT voltage outside or within a special range, the AT command
"AT+CVALARM" can be used to enable the under-voltage warning function. If users need to power off module, when the VBAT voltage is out of a range, the AT command
S "AT+CPMVT" can be used to enable under-voltage power-off function. Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1].
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3.2 Power on/Power off/Reset Function
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3.2.1 Power on
module can be powered on by pulling the PWRKEY pin down to ground.
The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be
pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode,
close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin.
Please refer to the following figure for the recommended reference circuit.
l The high voltage of PWRKEY is 0.8V
1.8V
tia Turn on / off impulse n 4.7K e 47K
PWRKEY 100
Power On / off logic
MODULE
nfid Figure 9: Reference power on/off circuit o Note: Module could be automatically power on by connecting PWRKEY pin to ground via 0R C resistor directly.
The power-on scenarios are illustrated in the following figure.
mVBAT oPWRKEY
(Input) STATUS (Output)
C UART Port SIM USB Port
Ton
Ton(status
)
Ton(uart
)
Undefined Ton(usb)
Undefined
VDD_AUX
Ton(vdd_aux)
Active Active
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Figure 10: Power on timing sequence
Table 8: Power on timing and electronic characteristic
Symbol
Parameter
Ty
Min.
Max. Unit
p.
The time of active low level impulse of PWRKEY
Ton
pin to power on module
100 500 -
ms
The time from power-on issue to STATUS pin output 12 16 -
Ton(status)
high level(indicating power up ready )
s
l Ton(uart)
The time from power-on issue to UART port ready 11 12 -
s
tia Ton(vdd_aux) The time from power-on issue to VDD_AUX ready
2.5 -
s
Ton(usb)
The time from power-on issue to USB port ready
11 12 -
s
VIH
Input high level voltage on PWRKEY pin
0.6 0.8 1.8 V
n VIL
Input low level voltage on PWRKEY pin
-0.3 0 0.5 V
fide 3.2.2 Power off
The following methods can be used to power off module. Method 1: Power off module by pulling the PWRKEY pin down to ground.
n Method 2: Power off module by AT command "AT+CPOF".
Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by
o AT command "AT+CPMVT". C Method 4: over-temperature or under-temperature automatic power off.
Note: If the temperature is outside the range of -30~+80, some warning will be reported via AT
port. If the temperature is outside the range of -40~+85, module will be powered off automatically.
m For details about "AT+CPOF" and "AT+CPMVT", please refer to Document [1].
These procedures will make module disconnect from the network and allow the software to enter a
o safe state, and save data before module be powered off completely. SIMCThe power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
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PWRKEY
Toff
(Input)
Toff-on Ton
STATUS
( Input )
VDD_AUX (Output)
Toff(status)
Toff(VDD_AUX) Toff(uart)
UART
Active
Undefined
USB
Toff(usb) Active
Undefined
l PWRKEY tia (Input)
STATUS ( Output )
en UART Port fid USB Port
Toff
Toff(status) Toff(uart) Active
Toff(usb) Active
Toff-on Ton
Undefined Undefined
n Figure 11: Power off timing sequence Co Table 9: Power off timing and electronic characteristic
Time value
File
Symbol
Parameter
Min. Typ. Max.
The active low level time pulse on PWRKEY pin to
Toff
power off module
2.5 -- --
om Toff(status)
The time from power-off issue to STATUS pin output 25
low level(indicating power off )*
26 -
Toff(uart)
CToff(usb)
Toff(VDD_AUX)
The time from power-off issue to UART port off The time from power-off issue to USB port off The time from power-off issue to vdd_aux off
14
15 -
27
28 -
20
-
-
Toff-on
The buffer time from power-off issue to power-on issue 0
-
-
IM*Note: The STATUS pin can be used to detect whether module is powered on or not. When
module has been powered on and firmware goes ready, STATUS will be high level, or else
S STATUS will still low level.
Unit
s
s s s s s
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3.2.3 Reset Function
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Module can be reset by pulling the RESET pin down to ground.
Note: This function is only used as an emergency reset, when AT command "AT+CPOF" and
the PWRKEY pin all have lost efficacy.
The RESET pin has been pulled up with a 40K resistor to 1.8V internally, so it does not need to
be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection
diode close to the RESET pin. Please refer to the following figure for the recommended reference
circuit.
Reset Impulse 4.7K
tial Treset
1.8V
40K RESET 100
Reset Logic
n 47K
100nF
MODULE
Confide Figure 12: Reference reset circuit
File
Table 10: RESET pin electronic characteristic
Symbol
m Treset o VIH
VIL
Description The active low level time impulse on RESET pin to reset module Input high level voltage Input low level voltage
Min. Typ. Max. Unit
100 200 500 ms
1.17 1.8 2.1 V
-0.3 0
0.8 V
C3.3 UART Interface IMModule provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE S (Data Communication Equipment). AT commands and data transmission can be performed through
UART interface.
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3.3.1 UART Design Guide
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The following figures show the reference design.
MODULE ( DCE)
HOST ( DTE)
TXD
TXD
RXD
RXD
RTS
RTS
UART
CTS DTR DCD RI
CTS UART DTR DCD RING
tial Figure 13: UART full modem
MODULE ( DCE)
fiden UART
TXD RXD RTS CTS DTR DCD RI
Wake up host
HOST ( DTE)
TXD RXD RTS CTS UART DTR DCD RING Interrupt
on Figure 14: UART null modem C The module UART is 1.8V voltage interface. If user's UART application circuit is 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
reference design.
omMODULE
TXD
C RXD RTS CTS
IM DTR DCD RI
S UART port
VDD_1V8 or External 1V8 100nF
47K
TXB0108RGYR
VCCA VCCB
OE
GND
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
3.3V
100nF
TXD_3.3V RXD_3.3V RTS_3.3V CTS_3.3V DTR_3.3V DCD_3.3V RI_3.3V 47K
File
Figure 15: Reference circuit of level shift
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customers can use another level shifter circuits as follow
Smart Machine Smart Decision
VDD_1V8 VIO_MCU
1K~4.7K
470pF_NM 4.7K
1nF
Module
Host
TXD
MCU_RXD
RXD
MCU_TXD
1nF
4.7K 1K~4.7K
l RTS
CTS
tia GPIO
GND
VDD_1V8
CTS RTS GPIO
GND
en Figure 16: Level matching circuit with triode fid Note1: User need to use high speed transistors such as MMBT3904.
Note2: module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default
n band rate is 115200bps. o 3.3.2 RI and DTR Behavior C The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU. Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming, and then it will change to low level.
m RI Idle
oHIGH
Receiving SMS and any URC report coming. AT+CFGRI=1
LOW
CRI IM Idle
HIGH
S LOW
Receiving SMS . AT+CFGRI=0
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Figure 17: RI behaviourSMS and URC report
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Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up.
RI HIGH
5900ms
100ms
LOW Idle
Ring
Establish
Hang up
Idle
the call
the call
tial Figure 18: RI behaviourvoice call
Note: For more details of AT commands about UART, please refer to document [1] and [22].
n DTR pin can be used to wake module from sleep. When module enters sleep mode, pulling down
DTR can wake module.
fide 3.4 USB Interface n The module contains a USB interface compliant with the USB2.0 specification as a peripheral, but
the USB charging function is not supported.
o module can be used as a USB device. module supports the USB suspend and resume mechanism
which can reduce power consumption. If there is no data transmission on the USB bus, module will
C enter suspend mode automatically, and will be resumed by some events such as voice call,
Com receiving SMS, etc.
Module
Sturb not longer than 2mm
USB_VBUS
0R_NM
0R_NM
USB_VBUS USB_DN USB_DP GND USB_ID
0R
0R Close to module
Host
DD+ GND
D3 D1 D2
IM Figure 19: USB reference circuit S Because of the high bit rate on USB bus, more attention should be paid to the influence of the
junction capacitance of the ESD component on USB data lines. Typically, the capacitance should
be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G
provided by On Semiconductor (www.onsemi.com ).
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D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
add a ZENER diode for surge clamping. The recommend diodes please refer to table 7.
NoteThe USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance.
3.5 USIM Interface
ile module supports both 1.8V and 3.0V USIM Cards.
Table 11: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)
F Symbol Parameter
Min.
l USIM_
VDD
LDO power output voltage 1.75
tia VIH
High-level input voltage 0.65*USIM_VDD
VIL
Low-level input voltage -0.3
n VOH
High-level output voltage USIM_VDD -0.45
e VOL
Low-level output voltage 0
Typ. Max.
Unit
1.8 1.95
V
-
USIM_VDD +0.3 V
0
0.35*USIM_VDD V
-
USIM_VDD
V
0
0.45
V
fid Table 12: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)
n Symbol Parameter
Min.
o USIM_ C VDD
LDO power output voltage 2.75
Typ. Max.
Unit
2.95 3.05
V
VIH
High-level input voltage 0.65*USIM_VDD -
USIM_VDD +0.3 V
VIL
Low-level input voltage -0.3
0
0.25*USIM_VDD V
VOH
High-level output voltage USIM_VDD -0.45 -
USIM_VDD
V
m VOL
Low-level output voltage 0
0
0.45
V
o 3.5.1 USIM Application Guide CIt is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST
(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM
IMperipheral circuit should be close to the USIM card socket. The following figure shows the 6-pin S SIM card holder reference circuit.
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Module
USIM_VDD USIM_RST USIM_CLK
USIM_DATA
22 22
22
100nF
USIM Socket
VCC RST CLK
GND VPP I/O
C707 10M006 512
22pF_NM 22pF_NM 22pF_NM
TVS
tial Figure 20: USIM interface reference circuit n Note: USIM_DATA has been pulled up with a 10K resistor to USIM_VDD in module. A 100nF e capacitor on USIM_VDD is used to reduce interference. For more details of AT commands about
USIM, please refer to document [1].USIM_CLK is very important signal, the rise time and fall
fid time of USIM_CLK should be less than 40ns, otherwise the USIM card might not be initialized Con correctly.
SIMCom
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Recommended USIM Card Holder
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It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User can visit http://www.amphenol.com for more information about the holder.
nfidential Figure 21:AmphenolSIMcard socket Co Table 13: Amphenol USIM socket pin description
Pin
Signal
Description
C1
USIM_VDD USIM Card Power supply.
C2
USIM_RST
USIM Card Reset.
m C3
USIM_CLK USIM Card Clock.
C5
GND
Connect to GND.
o C6
VPP
SIMC C7
USIM_DATA USIM Card data I/O.
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3.6 PCM Interface
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module provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format.
Table 14: PCM format
Characteristics
Specification
Line Interface Format
Linear(Fixed)
Data length
16bits(Fixed)
l PCM Clock/Sync Source
Master Mode(Fixed)
PCM Clock Rate
2048kHz2G/3G4096Khz (4G)
tia PCM Sync Format
Short sync(Fixed)
Data Ordering
MSB
Note: For more details about PCM AT commands, please refer to document [1].
n 3.6.1 PCM timing
fide module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.
Con Figure 22: PCM_SYNC timing
SIMComFigure 23: EXT codec to module timing
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Figure 24: Module to EXT codec timing Table 15: PCM timing parameters(2G/3G mode)
tial
Min.
T(sync) PCM_SYNC cycle time
�
T(synch) PCM_SYNC high level time
�
n T(syncl) PCM_SYNC low level time
�
T(clk)
PCM_CLK cycle time
�
e T(clkh) PCM_CLK high level time
�
T(clkl)
PCM_CLK low level time
�
fid T(susync) PCM_SYNC setup time high before falling edge of PCM_CLK �
T(hsync) PCM_SYNC hold time after falling edge of PCM_CLK
�
T(sudin) PCM_IN setup time before falling edge of PCM_CLK
60
n T(hdin) PCM_IN hold time after falling edge of PCM_CLK
10
o T(pdout) Delay from PCM_CLK rising to PCM_OUT valid
�
C T(zdout) Delay from PCM_CLK falling to PCM_OUT HIGH-Z
�
Typ.
Max.
125 �
488 �
124.5 �
488 �
244 �
244 �
244 �
244 �
�
�
�
�
�
60
160 -
File
Unit
s ns s ns ns ns ns ns ns ns ns ns
Table 16: PCM timing parameters(4G mode)
m T(sync)
T(synch)
o T(syncl)
T(clk)
CT(clkh)
T(clkl)
IMT(susync) T(hsync)
S T(sudin)
PCM_SYNC cycle time PCM_SYNC high level time PCM_SYNC low level time PCM_CLK cycle time PCM_CLK high level time PCM_CLK low level time PCM_SYNC setup time high before falling edge of PCM_CLK PCM_SYNC hold time after falling edge of PCM_CLK PCM_IN setup time before falling edge of PCM_CLK
Min.
� � � � � � � � 122
Typ.
Max.
62.5 �
244 �
62.256 �
244 �
122 �
122 �
122 �
122 �
�
�
Unit
s ns s ns ns ns ns ns ns
T(hdin) PCM_IN hold time after falling edge of PCM_CLK
122 �
�
ns
T(pdout) Delay from PCM_CLK rising to PCM_OUT valid
�
�
122 ns
T(zdout) Delay from PCM_CLK falling to PCM_OUT HIGH-Z
�
�
122 ns
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3.6.2 PCM Application Guide
The following figure shows the external codec reference design.
VDD_1V8
Must reserved 0R
3.3V 3.8V VDD_1V8
for debug!
PADGND
Must reserved 0R
Module
PCM_IN
l PCM_OUT
PCM_SYNC PCM_CLK
tia SCL n SDA
2.2K
2.2K
VSSA VSSSPK
VDDA VDDSPK
for debug!
GND AGND
100pF
4.7uF
VDDD
ADCOUT DACIN FS BCLK
MCLK
MICBIAS
MIC+ MIC-
SCLK SDIO
MOUT
VSSD VREF
SPKOUT+ SPKOUT-
NAU88(C)10
1.3K
1uF 1uF
1.3K 47uF 47uF
MIC
Receiver (32) AGND
AGND AGND AGND
fide Figure 25: Audio codec reference circuit
3.7 SD Interface
n module provides a 4-bit SD/MMC interface with clock rate up to 200 MHz, The voltage of o MMC/SD interface is 2.85V, which is compatible with SDIO Card Specification (version 3.0) and C Secure Digital (Physical Layer Specification, version 3.0).It supports up to 32GB SD cards.
Table 17: MMC/SD electronic characteristic (SD_DATA0-SD_DATA3 SD_CLK and SD_CMD) *
m Symbol
Parameter
Min.
Typ. Max.
Unit
o VIH
High-level input voltage 0.65*2.85
-
2.85+0.3
V
VIL
Low-level input voltage -0.3
0
0.25*2.85
V
CVOH
High-level output voltage 2.85-0.4
2.85
2.85
V
VOL
Low-level output voltage 0
0
0.45
V
IMNote: * SD_DET is 1.8V operation voltage ,which is different from SD_DATA0-SD_DATA3
S SD_CLK or SD_CMD.
Customer should provide 2.85V for SD card and the current should more than 350mA. ESD/EMI components should be arranged beside SD card socket. Refer to the following application circuit.
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2.85V
Smart Machine Smart Decision
SD Card
Module
SD_CMD SD_DATA3 SD_DATA2 SD_DATA1 SD_DATA0
SD_CLK
VCC CMD D3 D2 D1 D0
CLK
GND GND
TVS TVS TVS TVS TVS TVS 100nF 4.7uF
tial Figure 26: SD reference circuit
SD card layout guide lines:
Protect other sensitive signals/circuits from SD card signals.
n Protect SD card signals from noisy signals (clocks, SMPS, etc.).
Up to 200 MHz clock rate, 50 nominal, �10% trace impedance
e CLK to DATA/CMD length matching < 1 mm
15�24 termination resistor on clock lines near module
fid Total routing length < 50 mm recommended
Routing distance from module clock pin to termination resistor < 5 mm
Spacing to all other signals = 2x line width
n Bus capacitance < 15 pF Co 3.8 I2C Interface
module provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400 kbps. Its operation voltage is 1.8V.
m The following figure shows the I2C bus reference design. o VDD_1V8
C Module
2.2K
2.2K
Device
SCL
IM SDA
SCL SDA
S GND
GND
File
Figure 27: I2C reference circuit
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NoteSDA and SCL do not have pull-up resistors in module. So, 2 external pull up resistors are needed in application circuit.
"AT+CRIIC and AT+CWIIC" AT commands could be used to read/write register values of the I2C peripheral devices. For more details about AT commands please refer to document [1].
3.9 SDIO Interface
Module provides a 4 bit 1.8V SDIO interface for WLAN solution with W58 module.
l Note: Special software version for CAT4 modules support this function.
tia 3.10 SPI Interface
module provides a SPI interface as a master only. Its operation voltage is 1.8V, and its clock rate is
n up to 26 MHz.
NoteThis function is reserved. For detail information please contact with FAE.
fide 3.11 Network status
The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
n following figure.
CoModule
R
VBAT
2.2K
m NETLIGHT
4.7K 47K
o Figure 28: NETLIGHT reference circuit CNote: The value of the resistor named "R" depends on the LED characteristic. IMTable 18: NETLIGHT pin status
S NETLIGHT pin status
Module status
Always On
Searching Network; Call Connect(include VOLTE,SRLTE)
200ms ON, 200ms OFF
Data Transmit; 4G registered;
800ms ON, 800ms OFF
2G/3G registered network
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OFF
Power off ;Sleep
Note: NETLIGHT output low level as "OFF", and high level as "ON".
3.12 Flight Mode Control
The FLIGHTMODE pin can be used to control module to enter or exit the Flight mode. In Flight
mode, the RF circuit is closed to prevent interference with other equipments and minimize current
consumption. Bidirectional ESD protection component is suggested to add on FLIGHTMODE pin,
its reference circuit is shown in the following figure.
l Module tia Flightmode
VDD_1V8 10K
10K
TVS
en Figure 29: Flight mode switch reference circuit
fid Table 19: FLIGHTMODE pin status
n FLIGHTMODE pin status
Input Low Level
Co Input High Level
Module operation Flight Mode: RF is closed AT+CFUN=0: RF is closed AT+CFUN=1:RF is working
3.13 Other interface
om 3.13.1 Sink Current Source
The ISINK pin is VBAT tolerant and intended to drive some passive devices, such as LCD
Cbacklight and white LED, etc. Its output current can be up to 40mA and be set by the AT command
"AT+ CLEDITST".
IMTable 20: Sink current electronic characteristic
S Symbol
Description
Min.
Typ.
Max.
Unit
VISINK
Voltage tolerant
0.5
-
VBAT
V
IISINK
Current tolerant
0
-
40
mA
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ISINK is a ground-referenced current sink. The following figure shows its reference circuit.
Module
VBAT
2.2K
ISINK
AT+ CLEDITST Control
l Figure 30: ISINK reference circuit tia Note: The sinking current can be adjusted to meet the design requirement through the AT
command "AT+ CLEDITST =<0>, <value>".The "value" ranges from 0 to 8, on behalf of the current from 0mA to 40mA by 5mA step.
n 3.13.2 ADC e module has 2 dedicated ADC pins named ADC1 and ADC2.They are available for digitizing analog fid signals such as battery voltage and so on. These electronic specifications are shown in the
following table.
n Table 21: ADC1 and ADC2 electronic characteristics
o Characteristics
Resolution
C Conversion time
Min.
Typ.
Max.
Unit
�
15
�
Bits
�
442
�
us
Input Range
0.1
1.7
V
Input serial resistance
1
�
�
M
Note: "AT+CADC" and "AT+CADC2" can be used to read the voltage of the ADC1 and ADC2
m pins, for more details, please refer to document [1].
o 3.13.3 LDO CModule has a LDO power output, named VDD_AUX. its output voltage is 2.85V by default, Users
can switch the LDO on or off by the AT command "AT+CVAUXS" and configure its output voltage
SIMby the AT command "AT+CVAUXV".
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Table 22: Electronic characteristic
Symbol
Description
Min.
Typ.
Max.
Unit
VVDD_AUX
Output voltage
1.7
2.85
3.05
V
IO
Output current
-
-
150
mA
NoteFor more details of AT commands about VDD_AUX, please refer to document [1].
Confidential
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SIMCom
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4 RF Specifications
4.1 GSM/UMTS/LTE RF Specifications
Table 23: Conducted transmission power
Frequency GSM850 EGSM900 DCS1800 PCS1900 GSM850 (8-PSK) EGSM900 (8-PSK) DCS1800 (8-PSK) PCS1900 (8-PSK) WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26
Power 33dBm �2dB 33dBm �2dB 30dBm �2dB
l 30dBm �2dB
27dBm �3dB
tia 27dBm �3dB
26dBm +3/-4dB 26dBm +3/-4dB 24dBm +1/-3dB
n 24dBm +1/-3dB
24dBm +1/-3dB 24dBm + 1/-3dB
e 23dBm +/-2.7dB
23dBm +/-2.7dB
fid 23dBm +/-2.7dB
23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB
n 23dBm +/-2.7dB
23dBm +/-2.7dB
o 23dBm +/-2.7dB
23dBm +/-2.7dB
C23dBm +/-2.7dB
Min. 5dBm � 5dB 5dBm � 5dB 0dBm � 5dB 0dBm � 5dB 5dBm � 5dB 5dBm � 5dB 0dBm �5dB 0dBm �5dB <-50dBm <-50dBm <-50dBm <-50dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm <-40dBm
23dBm +/-2.7dB
<-40dBm
LTE-FDD B28 LTE-TDD B38 LTE-TDD B40 LTE-TDD B41
23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB 23dBm +/-2.7dB
om Table 24: Operating frequencies
CFrequency
GSM850 EGSM900
IMDCS1800 PCS1900
S WCDMA B1
Receiving 869894MHz 925960MHz 18051880 MHz 1930~1990 MHz 21102170 MHz
WCDMA B2
1930~1990 MHz
<-40dBm <-40dBm <-40dBm <-40dBm
Transmission 824849 MHz 880915 MHz 17101785 MHz 1850~1910 MHz 19201980 MHz 1850~1910 MHz
WCDMA B5
869894 MHz
824849 MHz
WCDMA B8
925960 MHz
880915 MHz
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The LTE Operating frequencies are shown in the following table 24. Note: Operating frequencies of LTE TDD B41 for the module is 100MHz BW, 25552655 MHz
GPS
1574.4 1576.44 MHz
-
GLONASS
1598 1606 MHz
-
BD
1559 1563 MHz
Table 25: E-UTRA operating bands
E-UTRA Operating Band 1 2 3 4 5 7 8 12 13 18 19 20 26 28 38 40
Uplink (UL) operating band
1920 ~1980 MHz
l 1850~1910 MHz
1710 ~1785 MHz
tia 1710~1755MHz
824849 MHz
2500~2570MHz
n 880 ~915 MHz e 699~716MHz
777~787MHz
fid 815~830MHz
830~845MHz
832~862MHz
n 814~849MHz
703~748MHz
o 2570 ~2620 MHz C 2300 ~2400 MHz
Downlink (DL) operating band 2110 ~2170 MHz 1930~1990 MHz 1805 ~1880 MHz 2110~2155MHz 869894MHz 2620~2690MHz 925 ~960 MHz 728~746MHz 746~757MHz 860~875MHz 875~890MHz 791~ 821MHz 859~894MHz 758~803MHz 2570 ~2620 MHz 2300 ~2400 MHz
Duplex Mode FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD
41
2496 ~2690 MHz
2496 ~2690 MHz
TDD
Note: Operating frequencies of LTE TDD B41 for the SIM7600X-PCIE is 100MHz BW, 2555 2655 MHz
om Table 26: Conducted receive sensitivity
CFrequency
GSM850 EGSM900
IMDCS1800 PCS1900
S WCDMA B1
Receive sensitivity(Typical) < -109dBm < -109dBm < -109dBm < -109dBm < -110dBm
Receive sensitivity(MAX) 3GPP 3GPP 3GPP 3GPP 3GPP
WCDMA B2
< -110dBm
3GPP
WCDMA B5
< -110dBm
3GPP
WCDMA B8
< -110dBm
3GPP
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LTE FDD/TDD
See table 26.
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3GPP
Table 27: Reference sensitivity (QPSK)
E-UTR 1.4 MHz 3 MHz 5 MHz 10 MHz A band Standard Standard Standard Standard
5 MHz Test Resort
ile 1
-
-
-100
-97
-101
2
-102.7
-99.7
-98
-95
-99
3
-101.7
-98.7
-97
-94
-99
F 4
-104.7
-101.7
-100
-97
-101
5
-103.2
-100.2
-98
-95
-99
l 7
-98
-95
-97
tia 8
-102.2
-99.2
-97
-94
-102
12
-101.7
-98.7
-97
-94
-99
13
-97
-94
-99
n 18
-100
-97
-101
19
-100
-97
-101
e 20
-97
-94
-98
26
-102.7
-99.7
-97.5
-94.5
-99
fid 28
-100.2
-98.5
-95.5
-99
38
-
-
-100
-97
-101
40
-
-
-100
-97
-101
n 41
-
-
-99
-96
-101
15 MHz Standard -95.2 -93.2 -92.2 -95.2
-93.2
-95.2 -95.2 -91.2 -92.7 -93.7 -95.2 -95.2 -94.2
20 MHz Duplex Standard Mode
-94
FDD
-92
FDD
-91
FDD
-94
FDD
FDD
-92
FDD
FDD
FDD
FDD
FDD
FDD
-90
FDD
FDD
-91
FDD
-94
TDD
-94
TDD
-93
TDD
Co 4.2 GSM /UMTS/LTE Antenna Design Guide
Users should connect antennas to module's antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50. SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements:
m Table 28: Trace loss
o Frequency C700MHz-960MHz
1710MHz-2170MHz
IM2300MHz-2650MHz
Loss <0.5dB <0.9dB <1.2dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
S circuit should be added. The following figure is the recommended circuit.
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MAIN ANT
RF connector
Matching circuit
MAIN_ANT 82 GND 41
R1
R2
C1
C2
D1
MODULE
tial Figure 31: Antenna matching circuit (MAIN_ANT)
In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of
n components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0 resistors, and the C1, C2 are reserved for tuning. The component
e D1 is a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
fid as to the module's MAIN_ANT pin. The traces impedance between module and antenna must be
controlled in 50.
n Diversity antenna Co Matching circuit
AUX_ANT 59
GND 58
m MODULE
R3
R4
C3
C4
D2
Co Figure 32: Antenna matching circuit (AUX_ANT)
In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4
IMare 0resistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for users according to application environment.
S Two TVS are recommended in the table below.
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Table 29: Recommended TVS
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Package 0201 0402
Part Number LXES03AAA1-154 LXES15AAA1-153
Vender Murata Murata
NoteSIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high bands in the designing of LTE-TDD, such as band38, band40 and band41. Because of the high insert loss of the RF cable and layout lines, the receiver sensitivity of these bands above will have risk to meet the authentication without the diversity antenna. For more details about auxiliary antenna design notice, please refer to document [25].
l 4.3 GNSS tia module merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a
high-availability solution that offers industry-leading accuracy and performance. This solution
n performs well, even in very challenging environmental conditions where conventional GNSS
receivers fail, and provides a platform to enable wireless operators to address both location-based
e services and emergency mandates. fid 4.3.1 GNSS Technical specification
Tracking sensitivity: -159 dBmGPS/-158 dBmGLONASS/-159 dBmBD
n Cold-start sensitivity: -148 dBm
Accuracy (Open Sky): 2.5m (CEP50)
o TTFF (Open Sky) : Hot start <1s, Cold start<35s
Receiver Type: 16-channel, C/A Code
C GPS L1 Frequency: 1575.42�1.023MHz
GLONASS: 1597.5~1605.8 MHz BD: 1559.05~1563.14 MHz Update rate: Default 1 Hz
m GNSS data format: NMEA-0183
GNSS Current consumption : 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins)
o GNSS antenna: Passive/Active antenna
Note: If the antenna is active type, the power should be given by main board because there is no
Cpower supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external
LNA should be used.
IM4.3.2 GNSS Application Guide S Users can adopt an active antenna or a passive antenna to module. If using a passive antenna, an
external LNA is a must to get better performance. The following figures are the reference circuits.
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VDD
10 ohm GNSS Active ANT
47nH
GND 80
GNSS_ANT
79
Matching circuit
C1
C2 33pF
GND 78
L1
L2
MODULE
GND GNSS_ANT
GND MODULE
tial Figure 33: Active antenna circuit
en 80 fid 79
78
V_LNA
LNA L3
SAW
GNSS Passive ANT
Matching circuit C1
L1
L2
Con Figure 34: Passive antenna circuit (Default)
In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the
m value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna
and V_LNA need external power supplies which should be considered according to active antenna
o and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by shutting
down active antennas and LNA when GNSS is not working. GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB
Cautomatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS,
user should configure module in proper operating mode by AT command. Please refer to related
IMdocuments for details. module can also get position location information through AT directly. Note: GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode.
S AGPS mode needs more support from the mobile telecommunication network. Please refer to
document [24] for more details.
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5 Electrical Specifications
5.1 Absolute maximum ratings
Absolute maximum rating for digital and analog pins of module are listed in the following table:
Table 30: Absolute maximum ratings
l Parameter
Min.
Typ.
Max.
Unit
Voltage at VBAT
-0.5
-
4.7
V
tia Voltage at USB_VBUS
-0.5
-
5.85
V
Voltage at digital pins (RESET,SPI,Keypad,GPIO,I2C,UART,PCM)
-0.3
-
2.1
V
Voltage at digital pins (SD,USIM)
-0.3
-
3.05
V
n Voltage at PWRKEY
-0.3
-
1.8
fide 5.2 Operating conditions
Table 31: Recommended operating ratings
n Parameter
Voltage at VBAT
o Voltage at USB_VBUS
Min.
Typ.
Max.
Unit
3.4
3.8
4.2
V
3.0
5.0
5.25
V
C Table 32: 1.8V Digital I/O characteristics*
Parameter VIH
m VIL o VOH
VOL
CIOH IMIOL S IIH
Description High-level input voltage
Low-level input voltage
High-level output voltage
Low-level output voltage
High-level output current(no pull down resistor) Low-level output current(no pull up resistor) Input high leakage current (no pull down resistor)
Min. 1.17 -0.3 1.35 0 -
-
-
Typ. 1.8 0 2
-2
-
Max.
Unit
2.1
V
0.63
V
1.8
V
0.45
V
-
mA
-
mA
1
uA
File
IIL
Input low leakage current(no pull up resistor)
-1
-
-
uA
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*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT,
FLIGHTMODE, STATUS, USIM_DET, SD_DET), SDIO, I2C, UART, PCM, COEXn, and
BOOT_CFG0.
The operating temperature of module is listed in the following table.
ile Table 33: Operating temperature
Parameter
Min.
Typ.
Max.
Unit
Normal operation temperature
-30
25
80
F Extended operation temperature*
-40
25
85
Storage temperature
-45
25
+90
l *Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/
tia UMTX/LTE traffic in -40 ~ +85. The performance will be reduced slightly from the 3GPP
specifications if the temperature is outside the normal operating temperature range and still
within the extreme operating temperature range.
n 5.3 Operating Mode
e 5.3.1 Operating Mode Definition fid The table below summarizes the various operating modes of module product.
Table 34: Operating mode Definition
on Mode C GSM /UMTS/LTE
Function In this case, the current consumption of module will be reduced to the minimal level and the module can still receive paging message and
Sleep
Normal operation
GSM/UMTS/LTE Idle
m GSM/UMTS/LTE oTalk CGPRS/EDGE/
UMTS/LTE Standby
IM GPRS/EDGE/ UMTS/LTE
S Data transmission
SMS. Software is active. Module is registered to the network, and the module is ready to communicate. Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antenna. Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level); uplink/downlink data rates, etc. AT command "AT+CFUN=0" AT+CSCLK=1 can be used to set the
Minimum functionality
module to a minimum functionality mode without removing the
mode
power supply. In this mode, the RF part of the module will not work
and the USIM card will not be accessible, but the serial port and USB
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port are still accessible. The power consumption in this mode is lower
than normal mode.
AT command "AT+CFUN=4" or pulling down the FLIGHTMODE
Flight mode
File Power off
pin can be used to set the module to flight mode without removing the power supply. In this mode, the RF part of the module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command "AT+CPOF" or pull down the PWRKEY pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible.
tial 5.3.2 Sleep mode
In sleep mode, the current consumption of module will be reduced to the minimal level, and
n module can still receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let module enter
e into sleep mode:
1. UART condition
fid 2. USB condition
3. Software condition Note: Before designing, pay attention to how to realize sleeping/waking function and refer to
n Document [26] for more details. o 5.3.3 Minimum functionality mode and Flight mode C Minimum functionality mode ceases a majority function of module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.
m AT+CFUN=0: Minimum functionality
AT+CFUN=1: Full functionality (Default)
o AT+CFUN=4: Flight mode CIf module has been set to minimum functionality mode, the RF function and USIM card function
will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be unavailable.
IMIf module has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable.
S When module is in minimum functionality or flight mode, it can return to full functionality by the AT command "AT+CFUN=1".
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5.4 Current Consumption
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The current consumption is listed in the table below.
Table 35: Current consumption on VBAT Pins (VBAT=3.8V)
GNSS
GNSS supply current
@ -140dBmTracking Typical:35mA
(AT+CFUN=0,without USB connection) GSM sleep/idle mode GSM/GPRS supply current
l (GNSS offwithout USB connection)
UMTS sleep/idle mode
tia WCDMA supply current
(GNSS offwithout USB connection) LTE sleep/idle mode
n LTE supply current
(GNSS offwithout USB connection)
e EVDO supply current
(GNSS offwithout USB connection)
fid GSM Talk
GSM850 EGSM900
n DCS1800
PCS1900
o UMTS Talk
WCDMA B1
C WCDMA B2
Sleep mode@ BS_PA_MFRMS=2 Typical: 2.8mA Idle mode@ BS_PA_MFRMS=2 Typical: 18mA
Sleep mode @DRX=9 Typical: 3.3mA Idle mode @DRX=9 Typical: 17.5mA
Sleep mode Typical: 2.3mA Idle mode Typical: 17.5mA Sleep mode Typical: 2.0mA Idle mode Typical: 17.8mA
@power level #5 Typical: 220mA @ power level #5 Typical: 230mA @power level #5 Typical: 162mA @power level #5 Typical: 190mA
@Power 24dBm Typical: 540mA @Power 24dBm Typical: 470mA
WCDMA B5
WCDMA B8 GPRS
m GSM850( 1 Rx,4 Tx )
EGSM900( 1 Rx,4 Tx )
o DCS1800( 1 Rx,4 Tx )
PCS1900( 1 Rx,4 Tx )
CGSM850( 3Rx, 2 Tx )
EGSM900( 3Rx, 2 Tx ) DCS1800( 3Rx, 2 Tx )
IMPCS1900( 3Rx, 2 Tx ) EDGE GSM850( 1 Rx,4 Tx )
S EGSM900( 1 Rx,4 Tx )
@Power 24dBm Typical: 530mA @Power 24dBm Typical: 385mA
@power level #5 Typical: 480mA @power level #5 Typical: 230mA @power level #0 Typical: 195mA @power level #0 Typical: 390mA @power level #5 Typical: 330mA @power level #5 Typical: 370mA @power level #0 Typical: 275mA @power level #0 Typical: 245mA
@power level #8 Typical: 340mA @power level #8 Typical: 400mA
DCS1800( 1 Rx,4 Tx )
@power level #2 Typical: 300mA
PCS1900( 1 Rx,4 Tx )
@power level #2 Typical: 330mA
GSM850( 3Rx, 2 Tx )
@power level #8 Typical: 280mA
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EGSM900( 3Rx, 2 Tx ) DCS1800( 3Rx, 2 Tx ) PCS1900( 3Rx, 2 Tx ) HSDPA data WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8 LTE data LTE-FDD B1
LTE-FDD B2
LTE-FDD B3
LTE-FDD B4
LTE-FDD B5
LTE-FDD B7
LTE-FDD B8 LTE-FDD B12 LTE-FDD B13
LTE-FDD B18
m LTE-FDD B19 o LTE-FDD B20 CLTE-FDD B26 SIMLTE-FDD B28
LTE-TDD B38
LTE-TDD B40
Smart Machine Smart Decision
@power level #8 Typical: 320mA @power level #2 Typical: 230mA @power level #2 Typical: 268mA
@Power 24dBm @Power 23dBm @Power 24dBm @Power 24dBm
Typical: 478mA Typical: 475mA Typical: 480mA Typical: 430mA
@5Mbps @10Mbps @20Mbps
@5Mbps
l @10Mbps
@20Mbps
tia @5Mbps
@10Mbps @20Mbps
@5Mbps
n @10Mbps
@20Mbps
e @5Mbps
@10Mbps
fid @20Mbps
@5Mbps @10Mbps @20Mbps
@5Mbps
n@10Mbps
@5Mbps
o@10Mbps
@5Mbps
C@10Mbps
22.3dBm 22.4dBm 22.4dBm
22.1dBm 22.4dBm 22.3dBm
22.2dBm 22.1dBm 22.1dBm
22.0dBm 22.1dBm 22.6dBm
22.2dBm 22.1dBm 22.1dBm
22.2dBm 22.1dBm 22.1dBm
22.8dBm 22.8dBm
22.7dBm 22.7dBm
21.9dBm 22.0dBm
Typical: 577mA Typical: 590mA Typical: 630mA
Typical: 515mA Typical: 544mA Typical:575mA
Typical: 479mA Typical: 498mA Typical: 530mA
Typical: 527mA Typical: 559mA Typical: 555mA
Typical: 610mA Typical: 600mA Typical: 630mA
Typical: 650mA Typical: 650mA Typical: 630mA
Typical: 644mA Typical: 646mA
Typical: 493mA Typical: 510mA
Typical: 505mA Typical: 497mA
@5Mbps 21.3dBm Typical: 531mA
@10Mbps 22.5dBm Typical: 523mA @15Mbps 22.6dBm Typical: 570mA
@5Mbps 22.4dBm @10Mbps 22.3dBm @15Mbps 22.5dBm
Typical: 532mA Typical: 541mA Typical: 590mA
@5Mbps 21.8dBm @10Mbps 21.8dBm @20Mbps 21.8dBm
Typical: 579mA Typical: 590mA Typical: 600mA
@5Mbps 22.4dBm @10Mbps 22.7dBm @15Mbps 22.3dBm
Typical: 525mA Typical: 570mA Typical: 580mA
@5Mbps 22.4dBm @10Mbps 22.5dBm @20Mbps 22.4dBm
Typical: 612mA Typical: 510mA Typical: 670mA
@5Mbps 21.8dBm @10Mbps 21.8dBm @20Mbps 21.8dBm
Typical: 370mA Typical: 380mA Typical: 403mA
@5Mbps 21.5dBm Typical: 407mA @10Mbps 21.7dBm Typical: 416mA
File
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LTE-TDD B41
@20Mbps
@5Mbps @10Mbps @20Mbps
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21.7dBm Typical: 444mA
21.6dBm 21.7dBm 21.7dBm
Typical: 390mA Typical: 396mA Typical: 420mA
5.5 ESD Notes
module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the users' mother board, the ESD components should be placed beside the connectors which human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The
l following table shows the module ESD measurement performance without any external ESD
component.
tia Table 36: The ESD performance measurement table (Temperature: 25, Humidity: 45%)
Part
n VBAT,GND
Antenna port
e USB fid UART Con Other PADs
Contact discharge +/-6K +/-5K +/-4K +/-3K +/-3K
Air discharge +/-12K +/-10K +/-8K +/-6K +/-6K
SIMCom
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6 SMT Production Guide
6.1 Top and Bottom View of module
fidential File Figure 35: Top and bottom view of module Con 6.2 Label Information SIMCom
Figure 36: Label information
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Table 37: The description of label information
No.
Description
A
LOGO
B
Module part number
C
Project name
D
Serial number
l E
International mobile equipment identity
F
QR code
ntia 6.3 Typical SMT Reflow Profile e SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
Confid constraints.
File
ComFigure 37: The ramp-soak-spike reflow profile of module IMNote: For more details about secondary SMT, please refer to the document [21]. S 6.4 Moisture Sensitivity Level (MSL)
module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake module for 192 hours in drying
equipment (<5% RH) at 40+5/-0�C, or 72 hours at 85+5/-5�C. Note that plastic tray is not
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heat-resistant, and only can be baked at 45� C.
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Table 38: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level Floor Life (out of bag) at factory ambient30�C/60% RH or as
(MSL)
stated
ile 1
Unlimited at 30/85% RH
2
1 year
2a
4 weeks
F 3
168 hours
4
72 hours
l 5
48 hours
tia 5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
en 6.5 Stencil Foil Design Recommendation Confid The recommended thickness of stencil foil is more than 0.15mm.
SIMCom
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7 Packaging
module support tray packaging.
fidential File Figure 38: packaging diagram Con Module tray drawing SIMCom
Figure 39: Tray drawing
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Table 39: Tray size
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Length�3mm 242.0
Small carton drawing
Width�3mm 161.0
Number 15
ential Figure 40: Small carton drawing fid Table 40: Small Carton size
Length�10mm Width�10mm
270
180
Con Big carton drawing
Height�10mm 120
Number 15*20=300
SIMCom Figure 41: Big carton drawing Table 41: Big Carton size
File
Length�10mm Width�10mm Height�10mm
Number
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380
280
280
300*4=1200
AARe.pfRepreetfone<rdeSinIxMce7D60e0siRgenference Design V1.X.pdf > for the details. ile Main Antenna
F TVS
LXES15AAA1-153
tial Powersupply
VBAT
R102 0R
NC C106
C101 100uF
C102 100uF
82 MAIN_ANT
NC
C107
57 GND
58 GND 60 GND
62 VBAT
63 VBAT
C103 1uF
61 GND
64 GND
n R103 4.7K
3 POWERKEY
SIM7600E e Turn on/off impulse
R104 47K
fid Reset impulse UART_TXD UART_RXD
UART_CTS UART_RTS
UART_RI
n UART_DCD
UART_DTR
o SIM_DATA
SIM_CLK SIM_RST SIM_VDD
C109 220nF
C VDD_AUX Com LDO Output:1.7-3.05V
4 RESET
71 68 67 66 69 70 72
17 19 18 20
TVS ESDA6V1W5
23 24 26 25
22 21 44
TXD RXD CTS RTS RI DCD DTR USIM_DATA USIM_CLK USIM_RST USIM_VDD
SD_DATA1 SD_DATA2 SD_CLK SD_DATA3 SD_DATA0 SD_CMD VDD_AUX
49 STATUS 52 GPIO41 53 USIM_DET 50 GPIO43 48 SD1_DET
1 GND 2 GND 5 GND 10 GND 14 GND 37 GND 40 GND 43 GND 65 GND 81 GND
IM 83 COEX1 84 COEX2
S 86 COEX3
GNSS Antenna
79 GNSS_ANT
GND 77 GND 78 GND 80 AUX_ANT 59
GND 41
L101 NC
C108 33pF
L102 NC
Div Antenna
R101 0R
C104 NC
C105 NC
NETLIGHT 51
R106 10K
R107 10K
R105
300R
Network LED Status
VBAT Power supply
FLIGHTMODE
USB_VBUS USB_DN USB_DP
54
RF ON/OFF
11
USB_VBUS
12
USB_DN
13
USB_DP
If USB interface is used Connect USB_VBUS to 3.0V-5.25V
SDIO_DATA1 27 SDIO_DATA2 28
SDIO_CMD 29 SDIO_DATA0 30 SDIO_DATA3 31
SDIO_CLK 32 GPIO3 33 GPIO6 34
HSIC_STROBE 35 HSIC_DATA 36 GPIO77 87
PCM_IN 74 PCM_SYNC 75
PCM_OUT 73 PCM_CLK 76
Audio CODEC Chip or
DSP
6 SPI_CLK SPI_MISO 7
SPI_MOSI 8 SPI_CS 9 ISINK 45
SCL SDA
55 56
ADC1 47
ADC2 46
VBAT 38 VBAT 39
VDD_1V8 15 USB_ID 16 NC 42
I2C_SCL I2C_SDA
ADC Input range:0.1~1.7V
C111 100uF
C112 100uF
VBAT Power supply
C113 100nF
BOOT_CFG0 85
Test Points
Figure 42: Reference design
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B. Coding Schemes and Maximum Net Data Rates over Air Interface
Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface
Multislot definition(GPRS/EDGE)
Slot class
1 2 3 4 5 6 7 8 9 10 11 12
GPRS coding scheme
CS 1 = 9.05 kb/s / time slot
CS 2 = 13.4 kb/s / time slot
CS 3 = 15.6 kb/s / time slot
CS 4 = 21.4 kb/s / time slot
EDGE coding scheme
MCS 1 = 8.8 kb/s/ time slot
MCS 2 = 11.2 kb/s/ time slot
MCS 3 = 14.8 kb/s/ time slot
MCS 4 = 17.6 kb/s/ time slot
MCS 5 = 22.4 kb/s/ time slot
MCS 6 = 29.6 kb/s/ time slot
m MCS 7 = 44.8 kb/s/ time slot
MCS 8 = 54.4 kb/s/ time slot
o MCS 9 = 59.2 kb/s/ time slot
HSDPA device category
CCategory 1
Category 2
IMCategory 3 Category 4
S Category 5
DL slot number
UL slot number Active slot number
1
1
2
2
1
3
2
2
3
1
2
2
l 3
2
3
3
tia 4
1
3
2
4
2
4
3
n 4
4
Max data rata4 slots
e 36.2 kb/s
fid 53.6 kb/s
62.4 kb/s
85.6 kb/s
n Max data rata4 slots
35.2 kb/s
o44.8 kb/s
C59.2 kb/s
3 4 4 4 4 5 5 5 5 5
Modulation type
GMSK
GMSK
GMSK
GMSK
Modulation type
GMSK
GMSK
GMSK
70.4 kb/s
GMSK
89.6 kb/s
8PSK
118.4 kb/s
8PSK
179.2 kb/s
8PSK
217.6 kb/s
8PSK
236.8 kb/s
8PSK
Max data ratepeak
Modulation type
1.2Mbps
16QAM,QPSK
1.2Mbps
16QAM,QPSK
1.8Mbps
16QAM,QPSK
1.8Mbps
16QAM,QPSK
3.6Mbps
16QAM,QPSK
Category 6
3.6Mbps
16QAM,QPSK
Category 7
7.2Mbps
16QAM,QPSK
Category 8
7.2Mbps
16QAM,QPSK
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File
Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19 Category 20 Category 21 Category 22 Category 23 Category 24 HSUPA device category Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 LTE-FDD device category (Downlink) Category 1 Category 2 Category 3
m Category 4 o LTE-FDD device category
(Uplink)
CCategory 1
Category 2 Category 3
SIMCategory 4
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10.2Mbps
16QAM,QPSK
14.4Mbps
16QAM,QPSK
0.9Mbps
QPSK
1.8Mbps
QPSK
17.6Mbps
64QAM
21.1Mbps
64QAM
23.4Mbps
16QAM
28Mbps 23.4Mbps 28Mbps
l 35.5Mbps tia 42Mbps
23.4Mbps 28Mbps
n 35.5Mbps
42.2Mbps
e Max data ratepeak
0.96Mbps
fid 1.92Mbps
1.92Mbps 3.84Mbps
n 3.84Mbps o5.76Mbps CMax data ratepeak
16QAM 64QAM 64QAM 64QAM 64QAM 16QAM 16QAM 64QAM 64QAM Modulation type QPSK QPSK QPSK QPSK QPSK QPSK
Modulation type
10Mbps 50Mbps 100Mbps 150Mbps
QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM QPSK/16QAM/64QAM
Max data ratepeak
Modulation type
5Mbps 25Mbps 50Mbps 50Mbps
QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM
File
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C. Related Documents
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Table 43: Related Documents
NO. [1] [2] [3] [4] [5]
[6]
[7] [8] [9] [10] [11]
Title SIM7500_SIM7600 Series_AT
ile Command Manual_V1.xx
ITU-T Draft new recommendationV.25ter
GSM 07.07
F GSM 07.10 l GSM 07.05 tia GSM 11.14 en GSM 11.11 fid GSM 03.38 n GSM 11.10
Description
AT Command Manual
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment � Data Circuit terminating Equipment (DTE � DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module � Mobile Equipment (SIM � ME) interface Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module � Mobile Equipment (SIM � ME) interface Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information Digital cellular telecommunications system (Phase 2) Mobile Station (MS) conformance specification Part 1: Conformance specification
o 3GPP TS 51.010-1
Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification
C 3GPP TS 34.124
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
[12] 3GPP TS 34.121
m [13] 3GPP TS 34.123-1 o [14] 3GPP TS 34.123-3 C[15] EN 301 908-02 V2.2.1 SIM[16] EN 301 489-24 V1.2.1
Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.
Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD)
User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
[17] IEC/EN60950-1(2001)
Safety of information technology equipment (2000)
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[18] 3GPP TS 51.010-1
Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification
[19] GCF-CC V3.23.1
Global Certification Forum - Certification Criteria
[20] [21] [22]
[23] [24] [25] [26] [27]
2002/95/EC
ile Module
secondary-SMT-UGD-V1.xx
SIM7X00 Series_UART_Application
F Note_V1.xx
SIM7100_SIM7500_SIM7600
l Series_USB
AUDIO_Application
tia Note_V1.xx
SIM7X00 Series_GPS_Application Note_V1.xx
n Antenna design guidelines for
diversity receiver system
e SIM7100_SIM7500_SIM7600
_Sleep Mode_Application
fid Note_V1.xx
7600CE-LAN-Reference
Con Design V1.0
Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
Module secondary SMT Guidelines This document describes how to use UART interface of SIMCom modules.
USB AUDIO Application Note
GPS Application Note
Antenna design guidelines for diversity receiver system Sleep Mode Application Note
HSIC Application Note
SIMCom
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D. Terms and Abbreviations
Table 44: Terms and Abbreviations
Abbreviation Description
ADC
Analog-to-Digital Converter
ARP BER BTS CS CSD CTS DAC DRX DSP DTE DTR DTX EFR EGSM EMC ESD ETS EVDO FCC FD FDMA FR
Antenna Reference Point Bit Error Rate Base Transceiver Station Coding Scheme
l Circuit Switched Data tia Clear to Send
Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor
n Data Terminal Equipment (typically computer, terminal, printer)
Data Terminal Ready
e Discontinuous Transmission
Enhanced Full Rate
fid Enhanced GSM
Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard
n Evolution Data Only
Federal Communications Commission (U.S.)
o SIM fix dialing phonebook
Frequency Division Multiple Access
C Full Rate
GMSK GNSS GPRS
m GPS
GSM
o HR
HSPA I2C
CIMEI
LTE MO
IMMS MT NMEA
S PAP
Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Global Standard for Mobile Communications Half Rate High Speed Packet Access Inter-Integrated Circuit International Mobile Equipment Identity Long Term Evolution Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated National Marine Electronics Association Password Authentication Protocol
PBCCH
Packet Switched Broadcast Control Channel
PCB
Printed Circuit Board
PCS
Personal Communication System, also referred to as GSM 1900
File
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RF RMS RTC SIM SMS SPI SMPS TDMA TE TX UART VSWR SM NC EDGE HSDPA HSUPA ZIF WCDMA VCTCXO USIM UMTS UART
Smart Machine Smart Decision
Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service serial peripheral interface Switched-mode power supply Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio
l SIM phonebook
Not connect
tia Enhanced data rates for GSM evolution
High Speed Downlink Packet Access High Speed Uplink Packet Access Zero intermediate frequency
n Wideband Code Division Multiple Access
Voltage control temperature-compensated crystal oscillator
e Universal subscriber identity module
Universal mobile telecommunications system
Confid Universal asynchronous receiver transmitter
SIMCom
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E. Safety Caution
Table 45: Safety Caution
Confidential File Marks
Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate
mcellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
ofeatures are in use (e.g. lock functions, fixed dialing etc.). You may have to
deactivate those features before you can make an emergency call.
CAlso, some networks require that a valid SIM card be properly inserted in the cellular SIM terminal or mobile.
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Contact us: Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building B, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel+86 21 3157 5200\3157 5100 Email: simcom@simcom.com URLwww.simcom.com
Confidential SIMCom
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