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tuya ZT2S Module Datasheet

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ZT2S Module Datasheet

Installation guide

Hangzhou Tuya Information Technology Co.,Ltd ZT2S Zigbee module 2ANDL-ZT2S 2ANDLZT2S zt2s

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ZT2S Zigbee Module by Hangzhou Tuya Information

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ZT2S Module Datasheet
Version: 20210911
Online Version

Contents

1 Product overview

1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Module interfaces

2.1 Pin distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 Electrical parameters

3.1 Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . 9

3.2 Normal working conditions . . . . . . . . . . . . . . . . . . . . . . . 9

3.3 TX and RX power consumption . . . . . . . . . . . . . . . . . . . . . 10

3.4 Operating current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 RF parameters

4.1 Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.2 TX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.3 RX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Module power-on timing requirements

6 Antenna information

6.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 16

7 Packaging information and production instructions

7.1 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.2 Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.3 Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.4 Recommended oven temperature curve and temperature . . . . . . . 22

7.5 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

8 MOQ and packaging information

9 Appendix: Statement

Contents ZT2S is a Zigbee module that Tuya has developed. It consists of a highly integrated wireless RF chip (Z2) and some peripherals. ZT2S also contains a low-power 32-bit CPU, 1024-KB flash memory, 64-KB RAM, and rich peripherals.
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1 Product overview
1 Product overview
Based on ZT2S, you can develop Zigbee products as required.
1.1 Features
� Embedded with a low-power 32-bit CPU � Clock rate: 48 MHz � Wide operating voltage: 1.8 to 3.6V � Peripherals: 5 GPIOs, 1 UART, and 1 ADC � Zigbee connectivity
� Support 802.15.4 MAC/PHY � Operating channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250
Kbps � Up to +10dBm output power and dynamic output power > 35 dB � Onboard PCB antenna � Onboard PCB antenna with a gain of 2 dBi � Operating temperature: -40 to 85 � Support hardware encryption and AES 128
1.2 Applications
� Intelligent building � Smart household and home appliances � Smart socket and light � Industrial wireless control � Baby monitor � Intelligent bus
1.3 Change history
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Update date July 15th, 2021

Updated content
This is the first release.

Version after update
V1.0.0

1 Product overview

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2 Module interfaces
2 Module interfaces
2.1 Pin distribution
ZT2S has 2 lines of pins, 11 pins in total, with a spacing of 2 mm. The dimensions of ZT2S are: 14.99�0.35 mm (W)�17.90�0.35 mm (L) �2.80�0.15 mm (H) The thickness of the PCB is 0.8�0.1 mm.
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2 Module interfaces

2.2 Pin definition

Pin number 1

Symbol VCC

Type P

Function
Power supply pin (Typical value: 3.3V)

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Pin number 2

Symbol C2

Type I/O

GND

I/O

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2 Module interfaces
Function
Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_C2 of the IC (Pin 22)
Power supply reference ground
Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_C3 (Pin 23
Uart_RXD, which corresponds to B7 (Pin 17) on the internal IC
Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_D2 of the IC (Pin 31)
Uart_TXD, which corresponds to B1 (Pin 6) on the internal IC

2 Module interfaces

Pin number 8

Symbol C4

Type I/O
I/O

RST

I/O

SWS

I/O

Function
ADC pin, which corresponds to TL_C4 (Pin 24) on the internal IC
Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_B4 of the IC (Pin 14)
Reset pin (low active), correspond to RESETB (Pin 25) on the internal IC
Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_B5 of the IC (Pin15)
Burning pin, which corresponds to SWS (Pin 5) on the internal IC

Note:
� P indicates a power supply pin and I/O indicates an input/output pin. � If you have any special requirements on the light colour controlled by the

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2 Module interfaces PWM output, please contact the Tuya business personnel.
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3 Electrical parameters

3.1 Absolute electrical parameters

Parameter
Ts
VCC ESD voltage (human body model) ESD voltage (machine model)

Description

Minimum value

Operating

-5

temperature

Supply voltage -0.3

TAMB-25

3 Electrical parameters

Maximum value 150
3.6 2

Unit
V KV

0.5

3.2 Normal working conditions

Parameter Ta
VCC VIL VIH VOL

Minimum Description value

Operating temperature
Operating voltage
Voltage input low
Voltage input high
Voltage output low

-40
1.9 VDD*0.7 -

Typical value -
3.3 -

Maximum value
85

Unit

3.6

VDD*0.3

VDD*0.2

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3 Electrical parameters

Parameter VOH

Minimum Description value

Voltage

VDD*0.8

output high

Typical value
-

Maximum value
-

Unit V

3.3 TX and RX power consumption

Operating

status

Mode

Transmit Transmit Receive -

Rate

Transmit power/receive

Average value

250 Kbps 250 Kbps 250 Kbps

+0 dBm 4.7
+10 dBm 9.25
Constantly 7.35 receive

Peak value (Typical value)
22.91 38.78 7.61

Unit
mA mA mA

3.4 Operating current

Operating mode Fast pairing
Connected

Operating status, Ta = 25�C

Average value

Maximum value (Typical value)

Unit

The module is 9.15

9.49

in the fast

network

pairing state

The module is 8.95

9.15

connected to

the network

and in running

state.

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3 Electrical parameters

Operating mode
Deep sleep

Operating status, Ta = 25�C

Average value

Maximum value (Typical value)

Unit

Deep sleep

2.8

mode, reserve

32-KB SRAM

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4 RF parameters
4.1 Basic RF features

Parameter
Operating frequency Zigbee standard Data transmission rate Antenna type

4.2 TX performance

TX performance

Parameter

Minimum value

Maximum

output power

(250Kbps)

Minimum

output power

(250Kbps)

Output power adjustment stepping

Output

spectrum

adjacent

channel

suppression

Frequency

-10

error

4 RF parameters

Description
2.405 to 2.480 GHz IEEE 802.15.4 250 Kbps PCB antenna with a gain of 2 dBi

Typical value 10

Maximum value
-

Unit dBm

-25

dBm

0.5

dBm

-31

dBc

ppm

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4.3 RX performance

RX sensitivity

Parameter

Minimum value

PER<8%, RX sensitivity (250 Kbps)

-102

4 RF parameters

Typical value -101

Maximum value
-99

Unit dBm

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5 Module power-on timing requirements
5 Module power-on timing requirements
The Z2 chip has requirements on the power-on sequence. During the power-on process, the system starts when the RST pin reaches 1.62V. At this time, the VCC needs to reach more than 1.8V within 10ms. Because the RST pin has the RC link, the VCC of the bare module is much more than 1.8V when the RST reaches 1.62V. In some cases that the large capacitance in the power driver connected to the Z2 chip module charges or discharges, if the module voltage is not fully discharged
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5 Module power-on timing requirements below 0.6V, the module will probably crash when it is restarted. It is required that the power supply pin VCC_3.3V of the module needs to be connected with a dummy load of 1K to release power quickly. You can refer to the following figure which shows parts of power-driven links.
As the voltage backflow occurs when interfaces of the module are connected to others, you can pull down the CEN or RST pin, to reduce the power consumption when the module doesn't work.
As shown above, the MCU controls the CEN or RST pin through the GPIO interface, so as to power on or off the module. When there're data to report, the GPIO interface outputs the high level, the module is powered on, the serial communication is established, and the MCU synchronizes the data to the Cloud and client end. After reporting the data, the GPIO interface outputs the low level, the module is in reset state, and the module consumes little power. Disadvantages: There is a 10-K pullup resistor in the CEN or RST pin. When the module is in reset state, there is still an input current of 330uA.
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6 Antenna information
6 Antenna information
6.1 Antenna type
ZT2S uses the PCB antenna with a gain of 2 dBi.
6.2 Antenna interference reduction
To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area of the PCB.
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6 Antenna information 17 / 29

7 Packaging information and production instructions
7 Packaging information and production instructions
7.1 Mechanical dimensions
The following figure shows the mechanical dimensions of ZT2S:
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7 Packaging information and production instructions 19 / 29

7 Packaging information and production instructions 20 / 29

7 Packaging information and production instructions
7.2 Recommended footprint
7.3 Production instructions
1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials: � Wave soldering equipment � Wave soldering fixture � Constant-temperature soldering iron � Tin bar, tin wire, and flux � Thermal profiler
3. Baking devices: 21 / 29

7 Packaging information and production instructions
� Cabinet oven � Anti-electrostatic and heat-resistant trays � Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
� The packaging bag is damaged before unpacking. � There is no humidity indicator card (HIC) in the packaging bag. � After unpacking, circles of 10% and above on the HIC become pink. � The total exposure time has lasted for over 168 hours since unpacking. � More than 12 months have passed since the sealing of the bag.
5. Baking settings:
� Temperature: 60�C and 5% RH for reel package and 125�C and 5% RH for tray package (please use the heat-resistant tray rather than plastic container)
� Time: 48 hours for reel package and 12 hours for tray package � Alarm temperature: 65�C for reel package and 135�C for tray package � Production-ready temperature after natural cooling: < 36�C � Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again. � If a batch of modules is not baked within 168 hours, do not use the wave
soldering to solder them. Because these modules are Level-3 moisturesensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.
7.4 Recommended oven temperature curve and temperature
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260�C�5�C.
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7 Packaging information and production instructions

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering

Preheat temperature Preheat time Peak contact time Temperature of tin cylinder Ramp-up slope Ramp-down slope

80 to 130 �C
75 to 100s 3 to 5s 260�5�C
2�C/s 6�C/s

Suggestions on manual soldering temperature
Soldering temperature Soldering time NA NA
NA NA

360�20�C
3s/point NA NA
NA NA

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7 Packaging information and production instructions
7.5 Storage conditions
Storage conditions for a delivered module: � The moisture-proof bag is placed in an environment where the temperature is below 40�C and the relative humidity is lower than 90%. � The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. � There is a humidity indicator card (HIC) in the packaging bag.
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7 Packaging information and production instructions 25 / 29

8 MOQ and packaging information

Product model MOQ (pcs)

ZT2S

4400

Packing method
Tape reel

Modules per reel
1100

Reels per carton
4

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9 Appendix: Statement
9 Appendix: Statement
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
� Reorient or relocate the receiving antenna. � Increase the separation between the device and receiver. � Connect the device into an outlet on a circuit different from that to which the
receiver is connected. � Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
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9 Appendix: Statement
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including "This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body". This device has got an FCC ID: 2ANDL-ZT2S. The end product must be labelled in a visible area with the following: "Contains Transmitter Module FCC ID: 2ANDL-ZT2S" . This device is intended only for OEM integrators under the following conditions: The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with
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9 Appendix: Statement the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
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