张修宇 SIMCOM

SIM8200EA-M2 - 4G LTE Mall

AT Command Manual. [2]. ITU-T Draft new. recommendationV.25ter. Serial asynchronous automatic dialing and control. [3]. GSM 07.10.

SIM8200EA-M2 Hardware Design V1.01

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Confidential File SIM8200EA-M2 _ Hardware Design_V1.01 SIMCom

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Document Title

SIM8200EA-M2 _ Hardware Design_V1.01

Version

V1.01

Date

2019-10-25

Status

Released

Document Control ID

SIM8200EA-M2 _ Hardware Design_V1.01

tial General Notes
SIMCom offers this information as a service to its customers to support the application and
n engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
e search for additional relevant information, including any information that may be in the customer's fid possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer's system integrator.
All specifications supplied herein are subject to change without notice.
n Copyright
This document contains the proprietary technical information which is the property of SIMCom
o Limited, copying of this document, giving it to others, the using or communication of the contents C thereof are forbidden without the official authority by SIMCom. Offenders are liable to the

payment of the damages. All rights are reserved in the event of grant of a patent or the registration of a utility model or design. All specifications supplied herein are subject to change without notice
SIMCom Copyright © SIMCom Wireless Solutions Co., Ltd. 2019

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Contents

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Contents .............................................................................................................................................3

Table Index ........................................................................................................................................5

Revision History................................................................................................................................7

1 Introduction................................................................................................................................8 1.1 Product Outline .....................................................................................................................8 1.3 Hardware Block Diagram..........................................................................................................9 1.4 Functional Overview ...............................................................................................................10
l 2 Package Information................................................................................................................12 2.1 Pin Assignment Overview ...................................................................................................12 tia 2.2 Pin Description....................................................................................................................14 2.3 Mechanical Information ......................................................................................................19
3 Interface Application ...............................................................................................................20
n 3.1 Power Supply ......................................................................................................................20 3.1.1 Power Supply Design Guide ........................................................................................20 e 3.1.2 Recommended Power Supply Circuit ..........................................................................21 3.2 Voltage Monitor.......................................................................................................................22
fid 3.3 Turn on and off module.......................................................................................................22 3.3.1 FUL_CARD_POWER_OFF# ......................................................................................22 3.3.2 Power off ......................................................................................................................23
n 3.4 Reset Function .........................................................................................................................24
3.5 WoWWAN#.............................................................................................................................25
o 3.6 USB3.1 Interface .....................................................................................................................26 C 3.7 USB2.0 Interface .....................................................................................................................26
3.8 PCIe Interface ..........................................................................................................................26 3.9 UIM Interface ..........................................................................................................................26 3.10 I2S Interface.....................................................................................................................28
3.10.1 I2S timing .................................................................................................................29
m 3.10.2 I2S reference circuit..................................................................................................29
3.11 DPR* ...............................................................................................................................30
o 3.12 I2C Interface ....................................................................................................................30
3.13 CONFIG Pins...................................................................................................................31
C3.14 LED1# .............................................................................................................................32
3.15 W_DISABLE1#...............................................................................................................33 3.16 W_DISABLE2#...............................................................................................................33
IM4 Antenna Interfaces...................................................................................................................35 4.1. Main/Diversity Antenna Interfaces.........................................................................................35
S 4.1.1. Operating Frequency........................................................................................................36 4.2. GNSS Antenna Interface ........................................................................................................37 4.3. Antenna Installation................................................................................................................37 4.3.1 Antenna Requirements ......................................................................................................37

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4.3.2. Recommended RF Connector for Antenna Installation ...................................................38

5 Electrical Specifications...........................................................................................................40 5.1 Absolute maximum ratings .................................................................................................40 5.2 Operating conditions ...........................................................................................................40 5.3 Operating Mode ..................................................................................................................41 5.3.1 Operating Mode Definition ..........................................................................................41 5.3.2 Sleep mode ...................................................................................................................42 5.3.3 Minimum functionality mode and Flight mode............................................................42 5.4 Current Consumption ..........................................................................................................43 5.5. RF Output Power....................................................................................................................46 5.6 Conducted Receive Sensitivity ................................................................................................46
l 5.5 ESD .....................................................................................................................................48 tia 6 Top and Bottom View of Module ............................................................................................49
7 Label description Information ................................................................................................50 7.1 Ordering Information ..........................................................................................................50
n 8 Packaging..................................................................................................................................51 e Appendix ..........................................................................................................................................53
A. Coding Schemes and Maximum Net Data Rates over Air Interface ........................................53
fid B. Related Documents ...................................................................................................................55
C. Terms and Abbreviations..........................................................................................................57
Con D. Safety Caution ..........................................................................................................................59 SIMCom

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Table Index

Table 1: SIM8200EA-M2 frequency bands ......................................................................................................... 8 Table 2: General features ................................................................................................................................... 10 Table 3: IO parameters definition....................................................................................................................... 14 Table 4: IO parameters definition....................................................................................................................... 14 Table 5: Pin description...................................................................................................................................... 15 Table 6: VBAT pins electronic characteristic ..................................................................................................... 20 Table 7: Recommended TVS diode list.............................................................................................................. 21 Table 8: Power on timing and electronic characteristic...................................................................................... 23 Table 9: Power off timing and electronic characteristic ..................................................................................... 24
l Table 10: RESET pin electronic characteristic................................................................................................... 25
Table 11: UIM electronic characteristic in 1.8V mode (UIM-PWR=1.8V)........................................................ 26
tia Table 12: UIM electronic characteristic 2.85V mode (UIM-PWR=2.85V)........................................................27
Table 13: I2S format .......................................................................................................................................... 28 Table 14: I2S timing parameters ........................................................................................................................ 29
n Table 15: DPR interface ..................................................................................................................................... 30
Table 16: CONFIG Pins ..................................................................................................................................... 31
e Table 17: Config interface.................................................................................................................................. 31
Table 18: LED1# pin status................................................................................................................................ 32
fid Table 19: FLIGHTMODE pin status.................................................................................................................. 33
Table 20: Antenna Port Definitions .................................................................................................................... 35 Table 21: SIM8200EA-M2 Operating frequencies ............................................................................................ 36
n Table 22: GNSS frequencies .............................................................................................................................. 37
Table 23: Recommended Antenna Characteristics ............................................................................................. 37
o Table 24: the major specifications of the RF connector ..................................................................................... 38
Table 25: Absolute maximum ratings................................................................................................................. 40
C Table 26: Recommended operating ratings ........................................................................................................ 40
Table 27: 1.8V Digital I/O characteristics* ........................................................................................................ 40 Table 28: Operating temperature........................................................................................................................ 41 Table 29: Operating mode Definition................................................................................................................. 41
m Table 30: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 43
Table 31: Conducted Output Power ................................................................................................................... 46
o Table 32:SIM8200EA-M2 Conducted RF Receiving Sensitivity....................................................................... 46
Table 33: The ESD performance measurement table (Temperature: 25, Humidity: 45%) ............................. 48
CTable 37: Label description of Module Information .......................................................................................... 50
Table 38: SIM8200EA-M2 Information............................................................................................................. 50 Table 39: Tray size ............................................................................................................................................. 52
IMTable 40: Small Carton size ............................................................................................................................... 52 Table 41: Big Carton size................................................................................................................................... 52
S Table 42: Coding Schemes and Maximum Net Data Rates over Air Interface................................................... 53 Table 43: Related Documents ............................................................................................................................ 55 Table 44: Terms and Abbreviations.................................................................................................................... 57 Table 45: Safety Caution.................................................................................................................................... 59

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Figure Index

Figure 1: Standard Module block diagram........................................................................................................... 9 Figure 2: Pin map............................................................................................................................................... 13 Figure 3: pin out diagram................................................................................................................................... 19 Figure 4: Power supply application circuit......................................................................................................... 20 Figure 5: Linear regulator reference circuit ....................................................................................................... 21 Figure 6: Switching mode power supply reference circuit ................................................................................. 21 Figure 7: Reference power on/off circuit ........................................................................................................... 22 Figure 8: Power on timing sequence .................................................................................................................. 23 Figure 9: Power off timing sequence ................................................................................................................. 24
l Figure 10: Reference reset circuit ...................................................................................................................... 24
Figure 11: WOWWAN# behaviourSMS and URC report .......................................................................... 25
tia Figure 12: WOWWAN# behaviourSMS and URC report.......................................................................... 25
Figure 13: USIM interface reference circuit ...................................................................................................... 27 Figure 14: UIM interface reference circuit with UIM_DET .............................................................................. 28
n Figure 15: I2S timing ......................................................................................................................................... 29
Figure 16: Audio codec reference circuit ........................................................................................................... 30
e Figure 17: I2C reference circuit ......................................................................................................................... 31
Figure 18: LED1# reference circuit ................................................................................................................... 32
fid Figure 19: Flight mode switch reference circuit................................................................................................. 33
Figure 20: GNSS function switch reference circuit............................................................................................ 34 Figure 21: Main/Diversity/GNSS antenna interfaces ......................................................................................... 35
n Figure 22: Antenna connector ............................................................................................................................ 38
Figure 23: Top and bottom view of Module....................................................................................................... 49
o Figure 24: Label description of Module............................................................................................................. 50
Figure 25: packaging diagram............................................................................................................................ 51
C Figure 26: Tray drawing..................................................................................................................................... 51
Figure 27: Small carton drawing........................................................................................................................ 52
SIMCom Figure 28: Big carton drawing ........................................................................................................................... 52

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Revision History

Data 2019-06-27 2019-09-25

Version 1.00 1.01

Description of change

Author

Olivier.wu

original version

Xutao.jiang

Confidential Modifytheerror

Cunbao.feng Olivier.wu

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1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

characteristics and testing results of the SIMCom M.2 card. With the help of this document and

other software application notes/user guides, users can understand and use SIM8200EA-M2 to

design and develop laptop applications quickly.

1.1 Product Outline

l Aimed at the EMEA/APAC/Brazil market, SIM8200EA-M2 supports Multi-Band 5G NR tia LTE-FDD/LTE-TDD/WCDMA, support R15 5G NSA/SA up to 4.0 Gbps data transfer. The
supported radio frequency bands are described in the following table. Table 1: SIM8200EA-M2 frequency bands

n Standard e 5G NR fid LTE(FDD)
LTE(TDD)
n WCDMA
GNSS

SIM8200EA-M2 n1,n2,n3,n5,n7,n8,n12,n20,n25,n28,n40,n41,n66.n71.n77,n78,n79 B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/ B32/B66/B71 B34/B38/B39/B40/B41/B42/B43/B48 B1/B2/B3/B4/B5/B8 GPS/GLONASS/ BeiDou/Galileo/QZSS

o With a physical dimension of 30.0*52.0*2.3 mm, SIM8200EA-M2 can meet PCI Express key B C M.2 Specification, and can meet almost any space requirement in users' applications. With M.2

Type 3052, SIM8200EA-M2 had almost all common interface integrated, such as USB2.0,USB3.1, PCIe Gen3.0, UIM(×2) card, Digital audio(I2S or PCM), I2C, GPIOs, Antenna × 6 etc. With all the interfaces, SIM8200EA-M2 can also be utilized in the industrial handheld,
SIMCom machine-to-machine laptop application and especially the CPE/AR/VR/MR.

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1.2 Hardware Block Diagram
The Block Diagram of SIM8200EA-M2 is shown as below:

M.2 KEY-B 75PIN INTERFACE

USIM x2
USB2.0 USB3.1 PCIE GEN 3.0
I2C ANTCTL0~3
DPR COEX WOWWAN LED_1 GPIOs PCM/I2S
W_Disable1_N W_Disable2_N
CONFIG0 CONFIG1 CONFIG2 CONFIG3
GND

One On Chip eSIM
UIM Interface (2.85V/1.8V)
l High Speed Interface
tia Low Speed
Peripherals (All can be configured as
GPIOs)
en GPIOs

BB

Modem
5GNR/4G/3G Modem
MODEM+Audio DSP
Processor
Qualcomm Location Gen 9V4
Baseband

4G+5G(sub-6 GHz)RF

GRFC'S RFFE'S
RF PMU

Supplies Pa sense

QLINK_0 QLINK_EN_0 QLINK_REQ_0
WMSS_RESET_ 0

Transceiver

RFFE'S Tx/Rx
GRFC'S

Cotex-A7 Application processor
subsystem

RF Front End
MMPA/ LPAF/ LPAMIDs
QDM Module
QLNA
Tuner RF Switch Diplexer/ N-Plexer

RFCLK1

fid Control
Signal

RPMh Cotex-M3

System RAM+ROM

Power System& Clock System

BBCLK 19.2MHz

8-bit NAND 16-bit LPDDR4X POWER Sleep CLK 32kHz SPMI

on MCP
NAND 4Gb
CLPDDR4X 4Gb

PMU

38.4MHz

32kHz

PMU

38.4MHz XO

FileANT0 ANT1 ANT2 ANT3 ANT4 ANT5

RESET FULL_CARD_POWER_OFF_N
VBAT__3.3v
SIMComFigure 1: Standard Module block diagram

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1.3 Functional Overview

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Table 2: General features

Feature

Implementation

Power supply

VBAT:3.34.4(TDB) Typical Power Rail: 3.3V

Power consumption Radio frequency bands Transmitting power
Data Transmission Throughput
Antenna
GNSS
SMS USIM interface USIM application toolkit

Current in sleep mode : TBD Please refer to the table 1 5GNR power class: TBD
l LTE power class: 3 (0.25W)
WCDMA power class: 3 (0.25W)
tia 5GNR: 1.5 Gbps (UL), 4 Gbps (DL)
FDD-LTE CAT20+:Max 2.4Gbps (DL), 300Mbps (UL) TDD-LTE CAT20+:Max2.4Gbps (DL), 300Mbps (UL)
n HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
5G main antenna.
e WCDMA/LTE diversity antenna
GNSS antenna
fid GNSS engine (GPS/GLONASS/ BeiDou/Galileo/QZSS)
Protocol: NMEA
MT, MO, CB, Text and PDU mode
n SMS storage: USIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
o Support identity card: 1.8V/ 2.85V CSupport SAT class 3, GSM 11.14 Release 98

Phonebook management
SIMCom Digital Audio feature

Support USAT
Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
One I2S interface with dedicated main-clock for primary digital audio, the I2S also can be configured as PCM  Half Rate (ETS 06.20)  Full Rate (ETS 06.10)  MCLK frequency: 12.288MHz (default)  Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)  WCDMA AMR-NB  VoLTE AMR-WB  Echo Cancellation  Noise Suppression

 One port PCIE interface, support PCIe Gen 3 (PCIe Gen 1/2

PCIE interface

compatible)

 High communication data rate which is up to 8 Gbps per lane.

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One USB 3.1 SuperSpeed and high-speed (for backward

compatibility)

USB

USB3.1: super speed, with data rate which is up to 10 Gbps.

USB2.0: high speed interface, support USB operations at low-speed

and full-speed, which refer to USB1.0 and USB1.1.

Firmware upgrade

Firmware upgrade over USB interface or FOTA

Physical characteristics

Size: 30*52*2.3mm Weight: TBD

Normal operation temperature: -30°C to +75°C

Temperature range

Extended operation temperature: -40°C to +85°C*

l Storage temperature -45°C to +90°C

*Note: Module is able to make and receive voice calls, data calls, SMS and make

tia GPRS/UMTS/HSPA+/LTE traffic in -40 ~ +85. The performance will be reduced slightly

from the 3GPP specifications if the temperature is outside the normal operating temperature

Confiden range and still within the extended operating temperature range.

SIMCom

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2 Package Information

2.1 Pin Assignment Overview

All functions of the M.2 card will be provided through 75 (including 8 notch pins) pads that will be

connected to the customers' platform. The following figure is the high-level view of the pin

assignment of the card.

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Confidential File SIMCom
Figure 2: Pin map

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2.2 Pin Description

Table 3: IO parameters definition

Pin type Description

PI

Power input

PO

Power output

AI

Analog input

AIO

Analog input/output

l DIO

Bidirectional digital input /output

DI

Digital input

tia DO

Digital output

DOH

Digital output with high level

DOL

Digital output with low level

n PU

Pull up

PD

Pull down

e OD

Open Drain

OC

Open collector

fid Table 4: IO parameters definition

n Voltage
domain

Parameter

Min

Typ

o VDD_P3=1.8V

VOH

High level output 1.35V

-

C VOL

Low level output 0V

-

Max
1.8V 0.45V

P3

VIH

High level input

VIL

Low level input

m Rp

Pull up/down resistor

VDD_P4=1.8V

oVOH

High level output

VOL

Low level output

CVIH

High level input

VIL

Low level input

IMP4

Rp

Pull up/down resistor

VDD_P4=2.85V

S VOH

High level output

1.2V -0.3V 80K ohm
1.44V 0V 1.26V -0.3V 360K ohm
2.28V

1.8V -
1.8V -
-

VOL

Low level output 0V

-

2.1V 0.6V 240K ohm
1.8V 0.4V 2.1V 0.36V
2.85V 0.4V

VIH

High level input 2.0V

-

3.15V

VIL

Low level input

-0.3V

-

0.57V

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Rp

Pull up/down

285K ohm

Table 5: Pin description

Pin name

Pin No.

Electrical Description

Description

Comment

Power supply VBAT GND System Control FUL_CARD_POWER _OFF#
RESET#
W_DISABLE1#
W_DISABLE2# WOWWAN#
WAKE_ON_WWAN

2,4,70,72,74 3,5,11,27,33 ,39,45,51,57 ,71,73
6
67
8
26
23

PI

M,2 card power supply, voltage User should connect

range: 3.34.3V.

these pins together.

l Ground

tia DI,PD n P3 DI,PU fide P3 DI n P3 DI Co P3 OC

High level effective
System reset control input, active low.
WWAN RF Disable, active low
GNSS Disable,active low (WAKE_ON_WWAN) WWAN is used to wake up host, active low

It's 3.3V voltage domain but can be driven by either 1.8V or 3.3V GPIO.
RESET_N internally pulled to1.8V by 100k resistance
It's 3.3V voltage domain but can be driven by either 1.8V or 3.3V GPIO.
It's 3.3V voltage domain but can be driven by either 1.8V or 3.3V GPIO.
If unused, please keep open.

WL_TX_EN

65

P3

Configuration pins

m CONFIG_0

21

o CONFIG_1

69

CCONFIG_2

75

CONFIG_3

1

IMUSB2.0/USB3.1

S USB D+

7

DI
GND GND GND NC
AIO

USB D-

9

AIO

Adjustable WIFI coexists with N79/LAA

If unused, please keep open.

Internally connected to the ground
Internally connected to the ground
Internally connected to the ground
Not connected

SIM8200EA-M2 module is configured as WWAN USB3.1 interface type

Positive line of the differential, bi-directional USB signal.
Negative line of the differential, bi-directional USB signal.

Main communication interface. USB3.1 up to 10Gbps data rate.

USB3.1-Tx-

29

AO

USB3.1 transmit data minus

USB2.0 up to

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31

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AO

USB3.1 transmit data plus

480Mbps data rate.

USB3.1-Rx-

35

AI

USB3.1 receive data minus

USB3.1-Rx+

37

AI

USB3.1 receive data plus

PCIe interface

PETn0

41

AO

PCIe TX Differential signals Negative

PETp0

43

PERn0

47

PERp0

49

REFCLKN

53

REFCLKP

55

PCIE assistant interface

PERSTR#

50

CLKREQ#

52

PEWAKE#

54

USIM interface

UIM1-PWR

36

AO

PCIe TX Differential signals Positive

AI

PCIe RX Differential signals Negative

Support PCIe GEN 3.0, up to 8Gbps data

rate.

l AI

PCIe RX Differential signals Positive

If unused, please keep open.

tia AIO

PCIe Reference Clock signal Negative

AIO

PCIe Reference Clock signal Positive

n DI

PCIe reset signalactive low

e DIO

PCIe clock request signalactive 3.3V voltage domain

low

If unused, please keep

fid open.

DO

PCIe walk up signalactive low

Con P4 PO

Power output for USIM1 card, the voltage depends on the USIM1 card type. Its output current is up to 50mA.

USIM1 Card data I/O, which has

UIM1-DATA

34

P4

m UIM1-CLK

32

P4

o UIM1-RESET

30

P4

CSIM1_DET

66

P3

SIMUIM2_PWR

48

P4

DIO DO DO DI PO

been pulled up via a 10KR resistor to USIM_VDD internally. Do not pull it up or down externally.
USIM1 clock output
USIM1 Reset output

1.8/3.0V voltage domain, All lines of USIM interface should be protected against ESD.

USIM1 card detecting input signal which has been pulled up via a 10KR resistor to VDD_P3 internally.
Power output for USIM2 card, the voltage depends on the USIM1 card type. Its output current is up to 50mA.
USIM2 Card data I/O, which has

1.8/3.0V voltage domain, All lines of USIM interface should

been pulled up via a 10KR

be protected against

UIM2_DATA

42

P4 DIO

resistor to USIM_VDD

ESD.

internally. Do not pull it up or

down externally.

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UIM2_CLK

44

P4 DO

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UIM2_RESET

46

P4 DO

USIM2 Reset output

USIM2 card detecting input

SIM2_DET

40

P3 DI

signal which has been pulled up via a 10KR resistor to VDD_P3

internally.

ANTCTL interface

ANTCTL0

59

ANTCTL1

61

ANTCTL2

63

RFFE_SDATA

58

RFFE_SCLK

56

I2S interface

I2S_CLK

20

I2S_RX

22

I2S_TX

24

I2S_WA

28

I2S_MCLK

60

I2C 

I2C_SDA

68

I2C_SCL

38

Coex interface

COEX1

P3 DO P3 DO
l P3 DO tia P3 DIO
P3 D0

Tunable ANT CTRL0 Tunable ANT CTRL1 Tunable ANT CTRL2 Tunable ANT MIPI DATA Tunable ANT MIPI CLK

These signals are used for Antenna Control and should be routed to the appropriate
If unused, please keep them open.

n P3 DO
P3 DI
e P3 DO fid P3 DO
P3 DO

I2S clock output I2S data input I2S data output I2S word select (L/R) I2S master clock

1.8Vvoltage domain Can be multiplexed into PCM signalsIf unused, please keep them open.

n P3 DIO
P3 D0

I2C data signal I2Cclock signal

1.8Vvoltage domain If unused, please keep them open.

CoWireless coexistence of WWAN

64

P3 DI

and WiFi/BT, based on BT-sig

(COEX_RX*)

COEX2

62

P3

(COEX_TX*)

m Other pins

o LED1#

10

P3

CDPR SIMNotch

25

P3

DO OC DI

coex is tence protocol
Wireless coexistence of WWAN and WiFi/BT, based on BT-sig coex is tence protocol

If unused, please keep them open.

OCactive lowStatus indicator driver LED
The Pin is used to control SAR sensor on or offactive low, (default H) H: SAR SENSOR does not work, PA maximum power is not reduced L: SAR SENSOR work,

If unused, please keep them open.
1.8Vvoltage domain

12, 13, 14,

Notch

15, 16, 17,

Notch

18, 19

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2.3 Mechanical Information

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Confidential File The following figure shows the package outline drawing of the M.2 card. SIMCom Figure 3: pin out diagram

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3 Interface Application

3.1 Power Supply

The recommended power supply of SIM8200EA-M2 is 3.8V and the voltage ranges from 3.3V to

4.3 V. The SIM8200EA-M2 has 5 power pins and 11 Ground pins, to ensure the SIM8200EA -M2 card works normally, all the pins must be connected. The M.2 connector pin is defined to support 500mA current per pin continuously.
l Table 6: VBAT pins electronic characteristic

tia Symbol
VBAT
n IVBAT(peak)
IVBAT(power-off)

Description
Module power voltage Module power peak current in normal mode. Module power current in power off mode.

Min. Typ.

3.135 3.8

-

TDB

-

TDB

Max. Unit

4.3

V

-

A

-

uA

e 3.1.1 Power Supply Design Guide

fid Make sure that the voltage on the 3.8V pins will never drop below 3.135V, even during a transmit
burst, when current consumption may rise up to 1.0A. If the voltage drops below 3.135V, the
n module will be powered off automatically.
Note: Be sure the power supply for VBAT pins can support more than1.0A, using a total of more
o than 100uF capacitors is recommended, in order to avoid the voltage drop to lower than 3.135V. C Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band

can be used for EMC.

These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the recommended circuit.

m3.3V 2 o 3.3V 4
3.3V 70
C 3.3V 72 3.3V 74 GND
IM GND

Cd Cc

Cb

Cb

33pF 100nF 100uF 100uF

VBAT

Ca

D1

220uF 5.1V

S SIM8200EA-M.2

File

Figure 4: Power supply application circuit

Note: The test condition: The voltage of power supply for VBAT is 3.3V, Ca is 220 µF tantalum

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capacitor (ESR=0.7). In addition, in order to guard for over voltage protection, it is suggested to use a D1 diode to protect the M.2 card.

Table 7: Recommended TVS diode list

No. Manufacturer Part Number

VRWM

Package

1

JCET

ESDBW5V0A1

5V

DFN1006-2L

2

Prisemi

3

WAYON

4

WILL

l 5

WILL

tia 6

WAYON

PESDHC2FD4V5BH

4.5V

WS05DPF-B

5V

ESD5611N

5V

ESD56151W05

5V

WS4.5DPV

4.5V

DFN1006-2L DFN1006-2L DFN1006-2L SOD-323 DFN1610-2L

3.1.2 Recommended Power Supply Circuit

n It is recommended that a switching mode power supply or a linear regulator power supply is used. e It is important to make sure that all the components used in the power supply circuit can resist the
current which could be more than 4 ATBD.
fid The following figure shows the linear regulator reference circuit with 5V input and 3.3V output.

DC INPUT
Con FUSE

+ C101
100uF

C102 1uF

U101 MIC29302

2 Vin

Vout 4

GND

1 On/Off

FB 5

PWR_CTRL

3

VBAT

R101 49.9K(1%)
R102 30K(1%)

+ R103 C103 C104
470R 330uF 100nF

Figure 5: Linear regulator reference circuit

m If there is a high dropout between input and VBAT, or the efficiency is extremely important, then a
switching mode power supply will be preferable. The following figure shows the switching mode
o power supply reference circuit with 12V input and 3.3V output.

DC INPUT
SIMCFUSE

U101 LM2596- ADJ

1 Vin

Vout 2

+ C101 C102

5 On/Off

100uF 1uF

PWR_CTRL

3

GND

FB 4

L101

100uH R101
D102 49.9K(1%)
MBR360
R102 30K(1%)

+ C103
330uF

C104 100nF

VBAT

Figure 6: Switching mode power supply reference circuit

File

Note: The Switching Mode power supply solution for VBAT must be chosen carefully against

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Electro Magnetic Interference and ripple current from depraving RF performance.

3.2 Voltage Monitor

To monitor the VBAT voltage, the AT command "AT+CBC" can be used. Note: For more details about voltage monitor commands, please refer to Document [1] in the appendix.

3.3 Turn on and off module

l 3.3.1 FUL_CARD_POWER_OFF# tia Module can be powered on by pulling the FUL_CARD_POWER_OFF# pin, which is 3.3V
tolerantup to high level through GPIO.
n FUL_CARD_POWER_OFF# signal is an active low input signal and will turn the module on when
asserted high (1.7 V) and will force the module to shut down when asserted low (0.2 V). This pin
e is 3.3V tolerant and can be driven by either 1.8V or 3.3V GPIO and has been pulled down internal.

fid MCU n GPIO Co (1.8V/3.3V)

Turn ON

SIM8200EA-M2
FUL_CARD_ POWER_OFF#

mFigure 7: Reference power on/off circuit o Note: Module could be automatically power on by connecting FUL_CARD_POWER_OFF# pin Cto 3.3 V via 0R resistor directly. SIMThe power-on scenarios are illustrated in the following figure.

File

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3V3

RESET# (Input)
FUL_CARD_POWER_OFF#
ile (Input)

Twait

USB Port

Power off

Ton(usb)
Undefined

l F Figure 8: Power on timing sequence

Active

tia Table 8: Power on timing and electronic characteristic

n Symbol
Twait
e Ton(usb) fid VIH n VIL

Parameter The time which is used to wait the 3.3v to be stable. The time from power-on issue to USB port ready Input high level voltage on FUL_CARD_POWER_OFF# pin Input low level voltage on FUL_CARD_POWER_OFF# pin

Min. TBD 1.0
-0.3

Typ. TBD 1.7
0

Max. -

Unit ms s

4.4 V

0.2 V

Co 3.3.2 Power off

The following methods can be used to power off the card.

 Method 1: Power off the card by holding the FUL_CARD_POWER_OFF# pin to a low level.  Method 2: Power off Module by AT command "AT+CPOF".  Method 3: over-voltage or under-voltage automatic power off.
m  Method 4: over-temperature or under-temperature automatic power off. o Note: If the temperature is outside the range of -30~+75, some warning will be reported via AT Cport. If the temperature is outside the range of -40~+85, Module will be powered off
automatically.
For details about "AT+CPOF", please refer to Document [1] in the appendix.
SIMThese procedures will make the M.2 card disconnect from the network and allow the software to

enter a safe state, and save data before the card be powered off completely.

The power off scenario by pulling down the FUL_CARD_POWER_OFF# pin is illustrated in the

following figure.

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FUL_CARD_POWER_OFF#
(Input)

ile USB Port

Ton-off
Active

Toff(USB)
Active

Power off

Figure 9: Power off timing sequence

tial F Table 9: Power off timing and electronic characteristic

Symbol
n Toff(usb) e Ton-off

Parameter
The time from power-off issue to USB port off The buffer time from power-off issue to power-on issue

Time value Unit
Min. Typ. Max.

-

TBD -

s

TBD -

-

s

fid 3.4 Reset Function

Module can be reset by pulling the RESET# pin down to ground.

on Note: This function is only used as an emergency reset, when both AT command "AT+CPOF" C and the FUL_CARD_POWER_OFF# pin have lost efficacy.

The RESET# pin has been pulled up with a resistor to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put an ESD protection diode close to the Hardware circuit RESET# pin. Please refer to the following figure for the recommended reference
m circuit.

o 1.8V

CReset Impulse IM 4.7
K

Treset
RESET#

1K

R Reset Logic

47K
S MODULE

Figure 10: Reference reset circuit

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Table 10: RESET pin electronic characteristic

Symbol
ile Treset
VIH VIL

Description The active low level impulse time on RESET_N pin to reset Module Input high level voltage Input low level voltage

Min. TBD 1.17 -0.3

Typ. Max. Unit

TBD TBD ms

1.8 2.1 V

0

0.8 V

l F 3.5 WoWWAN#

tia The WoWWAN# pin is an open collector signal which can be used as an interrupt signal to the host.
Normally it will keep high logic level until certain conditions such as receiving SMS, voice call (CSD, video) or URC reporting, then WoWWAN# will change to low logic level to inform the host (client PC), the pulse time is 1 second.
en WoWWAN# HIGH fid 1s

on LOW C Figure 11: WOWWAN# behaviourSMS and URC report

WAKE_ON_WWAN Reference circuit is recommended in the following figure.
m VCC From Host

oSIM8200EA-M2 C WoWWAN#
4.7K
BB Chip
SIM 47K

10 ~100K
Interrupt input
HOST

Figure 12: WOWWAN# behaviourSMS and URC report

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3.6 USB3.1 Interface

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The module support one integrated USB interface which complies with the USB 3.1 specifications and supports super speed up to 10Gbps. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging and voice over USB.
NoteThe USB3.1-Tx+ and USB3.1-Tx- should be routed together and the nets must be traced by 90Ohm+/-10% differential impedance. The same treatment should be needed for the routing of USB3.1-RX+ and USB3.1-RX,Four times the width between TX and RX.
l 3.7 USB2.0 Interface tia The Module implements a USB interface compliant with the USB2.0 specification. The module
supports three USB speeds: low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). But the OTG function and USB charging function are not supported.
n NoteThe USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance. e Module is used as a USB device by default. Module supports the USB suspend and resume
mechanism which can reduce power consumption. If there is no data transmission on the USB bus,
fid Module will enter suspend mode automatically, and will be resumed by some events such as voice
call, receiving SMS, etc.
n 3.8 PCIe Interface Co Under development

File

3.9 UIM Interface

There is an eSIM card on the board that is connected to the inside of the SIM2 signal line. Users
m can use eSIM card on the board or an external SIM card. Module supports both 1.8V and 2.85V
UIM Cards.
o Table 11: UIM electronic characteristic in 1.8V mode (UIM-PWR=1.8V)

CSymbol

Parameter

Min.

IMUIM-PWR VIH
S VIL

LDO power output voltage High-level input voltage Low-level input voltage

1.75 0.65*UIM-PWR -0.3

Uni Typ. Max.
t

1.8 1.95

V

-

UIM-PWR +0.3 V

0

0.35*UIM-PWR V

VOH

High-level output voltage UIM-PWR -0.45 -

UIM-PWR

V

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VOL

Low-level output voltage

0

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0

0.45

V

Table 12: UIM electronic characteristic 2.85V mode (UIM-PWR=2.85V)

Symbol Parameter

Min.

Typ. Max.

Unit

UIM-PW R

LDO power output voltage

2.75

2.85 3.05

V

VIH

High-level input voltage 0.65*UIM-PWR

-

UIM-PWR +0.3

V

VIL

Low-level input voltage

-0.3

0

0.25*UIM-PWR V

l VOH

High-level output voltage UIM-PWR -0.45

-

UIM-PWR

V

tia VOL

Low-level output voltage 0

0

0.45

V

It is recommended to use an ESD protection component such as ESDA6V1-5W6 produced by ST
n (www.st.com ) or SMF12C produced by ON SEMI (www.onsemi.com ). Note that the USIM
peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin
e SIM card holder reference circuit.

nfid Module

UIM-PWR UIM-RESET UIM-CLK
UIM-DATA

22 0
22

USIM Socket

VCC RST CLK

GND VPP I/O

C707 10M006 512

22pF 22pF 22pF
Co (NC) (NC) (NC)

100nF

TVS

File

Figure 13: USIM interface reference circuit
m The SIM Detect pin is used for detection of the UIM card hot plug in. User can select the 8-pin o UIM card holder to implement UIM card detection function. SIMCThe following figure shows the 8-pin SIM card holder reference circuit.

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MODULE

UIM-PWR UIM-RESET UIM-CLK SIM Detect

UIM-DATA

MOLEX - 91228

VCC

GND

22R

RST

VPP

0R

CLK

I/O

22R

PRESENCE Deserved

22R
UIM Card
TVS1

22pF 22pF 22pF (NC) (NC) (NC)

100nF

l Figure 14: UIM interface reference circuit with UIM_DET tia If the UIM card detection function is not used, user can keep the SIM Detect pin open.
SIM card circuit is susceptible, the interference may cause the SIM card failures or some other
situations, so it is strongly recommended to follow these guidelines while designing:  Make sure that the SIM card holder should be far away from the antenna while in PCB
n layout. e  SIM traces should keep away from RF lines, VBAT and high-speed signal lines.
 The traces should be as short as possible.
fid  Keep SIM holder's GND connect to main ground directly.
 Shielding the SIM card signal by ground.  Recommended to place a 0.11uF capacitor on UIM-PWR line and keep close to the
holder.
n  The rise/fall time of UIM-CLK should not be more than 40ns.
 Add some TVS and the parasitic capacitance should not exceed 60pF.
Co 3.10 I2S Interface

Module provides an I2S interface for external codec, which comply with the requirements in the Phillips I2S Bus Specifications
m Table 13: I2S format

o Characteristics CLine Interface Format
Data length I2S Clock/Sync Source
IMI2S Clock Rate I2S MCLK rate
S Data Ordering

Specification Linear(Fixed) 16bits(Fixed) Master Mode(Fixed)
1.536 MHz (Default) 12.288MHz (Default) MSB

Note: For more details about I2S AT commands, please refer to document [1]. in the appendix.

File

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3.10.1 I2S timing

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Module supports 48 KHz I2S sampling rate and 32 bit coding signal (16 bit word length), the timing diagram is showed as following:

tial Figure 15: I2S timing
Table 14: I2S timing parameters

n Signal fide I2S_MCLK Con I2S_CLK

Paramete r Frequency T t(HC) t(LC) Frequency T t(HC) t(LC)

Description
Frequency Clock period Clock high Clock low Frequency Clock period Clock high Clock low

Min.
­ 81.380 0.45T 0.45T 8 20.83 0.45T 0.45T

Typ. Max.

12.288 81.380 ­ ­ 48 20.83 ­ ­

12.288 ­ 0.55T 0.55T 48 125 0.55T 0.55T

m I2S_WS

t(sr) t(hr) t(dtr) t(htr)

DIN/DOUT and WS input setup time DIN/DOUT and WS input hold time DIN/DOUT and WS output delay DIN/DOUT and WS output hold time

o 3.10.2 I2S reference circuit SIMCThe following figure shows the external codec reference design.

16.276 0 ­ 0

­ ­ ­ ­

­ ­ 65.10 ­

File
Unit MHz ns ns ns KHz us ns ns ns ns ns ns

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VDD_1V8

3.3V 3.3V VDD_1V8

2.2K

2.2K

VDDA

I2C1_SCL I2C1_SDA

SCLK SDIO

VDDSPK VDDD

I2S_DIN
I2S_DOUT
MODULE I2S_WS
I2S_CLK

ADCOUT DACIN FS BCLK

MICBIAS
MIC+ MIC-

2.2K
1uF 1uF

I2S_MCLK

MCLK

2.2K

MIC

MOUT

47uF

33pF

47uF

NAU88U10

Receiver

l Figure 16: Audio codec reference circuit

tia 3.11 DPR*

DPR (Dynamic Power Reduction) signal is used by SIM8200EA-M2 to assist in meeting
n regulatory SAR (Specific Absorption Rate) requirements for RF exposure. The signal is provided
by a host system proximity sensor to the wireless device to provide an input trigger causing a
e reduction in the radio transmit output power.
User can use AT command to active this function, if do not need this function, this pin can be
fid keep floating.
Table 15: DPR interface

n Pin no Pin Name

Co 25

DPR

Pin status Low
High

Function Max transmitting power will be reduced
Max transmitting power will not be reduced (default)

Floating

Max transmitting power will not be reduced

Note:* means the DRP function is under developing.

m 3.12 I2C Interface o Module provides an I2C interface compatible with I2C specification, version 5.0, with clock rate Cup to 400 kbps. Its operation voltage is 1.8V. SIMThe following figure shows the I2C bus reference design.

File

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VDD_1V8

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N C NC

I2C_SCL I2C_SDA
GND
Module

SCL SDA
GND I2C device

Figure 17: I2C reference circuit
l NoteSDA and SCL have pull-up resistors in Module. So, 2 external pull up resistors are NO
necessary in application circuit. For more details about AT commands please refer to document
tia [1]. in the appendix. n 3.13 CONFIG Pins e These signals provide the means to indicate the specific configuration of the module.
SIM8200EA-M2 is configured as WWAN-USB3.0.
Confid Table 16: CONFIG Pins

Pin no Pin Name

21

CONFIG_0

m 69

CONFIG_1

75

CONFIG_2

o 1

CONFIG_3

Description Connected to GND internally. Connected to GND internally. Connected to GND internally. No Connect internally.

CIn the M.2 specification, the 4 pins are defined as below:
Table 17: Config interface

IMConfig_0 Config_1 S (Pin 21) (Pin 69)

Config_2 (Pin 75)

Config_3 (Pin 1)

Module type and Main host interface

GND

GND

GND

GND

SSD ­ SATA

Port Configuration N/A

GND

NC

GND

GND

SSD ­ PCIe

N/A

GND

GND

NC

GND

WWAN ­ PCIe

0

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GND

NC

NC

GND

WWAN ­ PCIe

1

GND

GND

GND

NC

WWAN ­ USB 3.1

0

GND

NC

GND

NC

WWAN ­ USB 3.1

1

GND

GND

NC

NC

WWAN ­ USB 3.1

2

GND

NC

NC

NC

WWAN ­ USB 3.1

3

NC

GND

GND

GND

WWAN ­ SSIC

0

NC

NC

GND

GND

WWAN ­ SSIC

1

NC

GND

NC

GND

WWAN ­ SSIC

2

NC

NC

NC

GND

WWAN ­ SSIC

3

l NC

GND

GND

NC

WWAN ­ PCIe

2

tia NC

NC

GND

NC

WWAN ­ PCIe

3

NC

GND

NC

NC

RFU

N/A

NC

NC

NC

NC

No Module Present N/A

en 3.14 LED1# fid LED1# is open drain output and is used to allow SIM8200EA-M2 to provide network status via
LED which will be provided by the host.

on VCC C SIM8200EA-M2

omBB Chip

R LED1#

IMC Figure 18: LED1# reference circuit S Note: The value of the resistor named "R" depends on the LED characteristic.

The timing sequence is as followed:

File

Table 18: LED1# pin status

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NETLIGHT pin status Always On 200ms ON, 200ms OFF 800ms ON, 800ms OFF OFF

Smart Machine Smart Decision
Module status Searching Network; Call Connect(include VOLTE,SRLTE) Data Transmit; 4G registered; 3G registered network Power off ;Sleep

3.15 W_DISABLE1#

The W_DISABLE1# pin controls SIM8200EA-M2 to enter or exit the flight mode, when the W_DISABLE1# signal is asserted to low level, all RF functions would be disabled. When the
l W_DISABLE1# signal is not asserted, the RF function will be active if it was not disabled by tia other means such as software.
Its reference circuit is shown in the following figure.
VDD
n 4.7K

fide W_DISABLE1#

Switch

n Module

4.7K

Co Figure 19: Flight mode switch reference circuit

m Table 19: FLIGHTMODE pin status

o FLIGHTMODE pin status
Input Low Level
CInput High Level

Module operation Flight Mode: RF is closed AT+CFUN=4: RF is closed AT+CFUN=1: RF is working

IM3.16 W_DISABLE2# S The W_DISABLE2# pin controls SIM8200EA-M2 to enable or disable the GNSS function, when

the W_DISABLE2# signal is asserted to low level, the GNSS function would be disabled.

Its reference circuit is shown in the following figure.

File

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VDD_1V8

W_DISABLE2#
File Module

4.7K Switch 4.7K

Confidential Figure 20: GNSS function switch reference circuit

SIMCom

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4 Antenna Interfaces

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SIM8200EA-M2 provides a main antenna interface, a diversity antenna interface and a GNSS antenna interface. The antenna ports have an RF impedance of 50.
4.1. Main/Diversity Antenna Interfaces
The Main/Diversity/GNSS antenna interfaces are shown as below.
fidential Figure 21: Main/Diversity/GNSS antenna interfaces Con Table 20: Antenna Port Definitions

File

ANT item ANT0

ANT name LTE_LB/MB/HB_TRX

m ANT1 o ANT2

5GN41_TRX; 5G_N77/N79_TRX LTE_LB/MB/HB_DIV #1

C ANT3 IMANT4 S ANT5

LTE_MB/HB_DIV #2; 5G_N77/N79_DIV #1 LTE_MB/HB_DIV #3; 5G_N77/N79_DIV #2 5G_N77/N79_DIV #3;

GNSS

Frequency Range 617MHz~960MHz, 1710MHz~2690MHz 2496MHz~2690MHz; 3300MHz~5000MHz 617MHz~960MHz, 1710MHz~2690MHz 1710MHz~2690MHz; 3300MHz~5000MHz 1710MHz~2690MHz; 3300MHz~5000MHz 3300MHz~5000MHz; 1166MHz~1610MHz

Functional description 3G/4G/5G re-farming band signal send and receive 5G N41 band signal send and receive; 5G NR band signal send and receive
3G/4G/5G re-farming band signal receive 3G/4G/5G re-farming band signal receive; 5G NR band signal receive 3G/4G/5G re-farming band signal receive; 5G NR band signal receive 5G NR band signal receive; GNSS signal receive

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4.1.1. Operating Frequency

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Table 21: SIM8200EA-M2 Operating frequencies

Frequency Band

Uplink (UL)

Downlink (DL)

Duplex Mode

WCDMA B1

1920 ~1980 MHz

2110 ~2170 MHz

FDD

WCDMA B2

1850~1910 MHz

1930~1990 MHz

FDD

WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19

1710 ~1785 MHz

1805 ~1880 MHz

FDD

1710 ~1755 MHz

2110~ 2155 MHz

FDD

824849 MHz

869894MHz

FDD

l 880 ~915 MHz

925 ~960 MHz

FDD

tia 1920 ~1980 MHz

2110 ~2170 MHz

FDD

1850~1910MHz

1930~1990MHz

FDD

1710 ~1785 MHz

1805 ~1880 MHz

FDD

n 1710~1755MHz

2110~2155MHz

FDD

824849 MHz

869894MHz

FDD

e 2500~2570MHz

2620~2690MHz

FDD

fid 880 ~915 MHz

925 ~960 MHz

FDD

699~716MHz

729~746MHz

FDD

777~787MHz

746~756MHz

FDD

788~798MHz

758~768MHz

FDD

n 704~716MHz

734~746MHz

FDD

o 815~830MHz

860~875MHz

FDD

C 830~845MHz

875~890MHz

FDD

LTE B20

832~862MHz

791~ 821MHz

FDD

LTE B25
LTE B26
m LTE B28
LTE B29
o LTE B30
LTE B32
CLTE B34
LTE B38
IMLTE B39 LTE B40
S LTE B41

1850~1915MHz 814~849MHz 703~748MHz
2305~2315MHz
2010~2025MHz 2570 ~2620 MHz 1880~1920MHz 2300 ~2400 MHz 2496 ~2690 MHz

1930~1995MHz 859~894MHz 758~803MHz 717~728MHz 2350~2360MHz 1452~1496MHz 2010~2025MHz 2570 ~2620 MHz 1880~1920MHz 2300 ~2400 MHz 2496 ~2690 MHz

FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD

LTE B42

3400~3600MHz

3400~3600MHz

TDD

LTE B48

3550~3700MHz

3550~3700MHz

TDD

LTE B66

1710~1780MHz

2110~2200MHz

FDD

File

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LTE B71

663~698MHz

617~652MHz

FDD

5G N77

3300~4200MHz

3300~4200MHz

TDD

5G N78

3300~3800MHz

3300~3800MHz

TDD

5G N79

4400~5000MHz

4400~5000MHz

TDD

Note: LTE-FDD B29 and B32 support Rx only and are only for secondary component carrier.

4.2. GNSS Antenna Interface

The following table shows frequency specification of GNSS antenna interface.
l Table 22: GNSS frequencies

tia Type
GPS/Galileo/QZSS GLONASS
n BeiDou/Compass

Frequecy 1575.42±1.023MHz 1597.5~1605.8MHz 1561.098±2.046MHz

fide 4.3. Antenna Installation
4.3.1 Antenna Requirements
n The following table shows the requirements on main antenna, Diversity antenna and GNSS o antenna. C Table 23: Recommended Antenna Characteristics

WCDMA/LTE antenna
Passive
m Direction
Gain
o Input impedance
Efficiency
CVSWR
Cable insertion Loss <1GHz
IMCable insertion Loss 1GHz~2.2GHz S Cable insertion Loss 2.3GHz~2.7GHz

Recommended standard Omni directional > -3dBi (Avg) 50  > 30 % < 2 <1dB <1.5dB <2dB

GNSS antenna

Passive

Recommended standard

Frequency Range

1559~1609MHZ

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Direction VSWR Passive antenna gain Active antenna NF Active antenna gain Active antenna Enbeded LNA gain

Smart Machine Smart Decision RHCP or liner, RHCP is the first choice < 2 > 0 dBi < 1.5 > 0 dBi < 17 dB

Note: It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance.
l 4.3.2. Recommended RF Connector for Antenna Installation tia When choosing antennas, user should pay attentions to the connector on antenna which should match with the
connector on the module. The standard 2x2 mm size RF receptacle connectors has been used on SIM7300x. The dimension of the connector on SIM8200EA is 2.0*2.0*0.6mm, which is from Murata, and the Part Number is
n MM4829-2702B/ RA4/ RB0. Confide Shows the RF connector dimension in the following figure: IMCom Figure 22: Antenna connector S Table 24: the major specifications of the RF connector

File

Item Nominal Frequency Range
SIM8200EA-M2 card Hardware Design _V1.01

Specification DC to 6 GHz
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Smart Machine Smart Decision

Nominal Impedance

50

Temperature Rating

-40 to + 85

Initial Contact Resistance (without conductor resistance)

Center contact 20.0mmax. Outer contact 20.0mmax.

Voltage Standing Wave Ratio (V.S.W.R.)

Meet the requirements of 1.3max.(DC3GHz) 1.45max.(3GHz6GHz)

There are two kinds of coaxial cables mating the RF connector in the SIM8200EA, SIMCom recommend use
l Murata and SUZHOU KELI, and the Part Number is MXFR32HP1000 of the Murata and KLC-2058 of the Confidentia KELI.

SIMCom

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5 Electrical Specifications

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of Module are listed in the following table:

Table 25: Absolute maximum ratings

l Parameter

Min.

tia Voltage at 3.3V pins

-0.3

Voltage at digital pins (GPIO,I2C,UART, I2S)

-0.3

Voltage at digital pins (UIM)

-0.3

Voltage at FUL_CARD_POWER_OFF#

-0.3

n Voltage at RESET#

-0.3

e 5.2 Operating conditions

fid Table 26: Recommended operating ratings

Parameter

Min.

n Voltage at 3.3V

TBD

Co Table 27: 1.8V Digital I/O characteristics*

Typ. -
Typ. 3.8

Max.

Unit

TBD

V

2.1

V

3.05

V

TBD

2.1

Max.

Unit

TBD

V

Parameter Description

Min.

Typ.

Max.

Unit

VIH

High-level input voltage

VIL

Low-level input voltage

m VOH

High-level output voltage

o VOL

Low-level output voltage

CIOH

High-level output current(no pull down resistor)

Low-level output current(no pull

IMIOL

up resistor)

S IIH

Input high leakage current (no pull down resistor)

1.17 -0.3 1.35 0 -
-
-

1.8 0 2
-2
-

2.1

V

0.63

V

1.8

V

0.45

V

-

mA

-

mA

1

uA

IIL

Input low leakage current(no pull up resistor)

-1

-

-

uA

File

*Note: These parameters are for digital interface pins, such as UART, I2C, I2S, RESET#,

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Smart Machine Smart Decision
ANTCTL, COEX and GPIOs (coex, DPR, SIM DETECT, SD_DET).

The operating temperature of Module is listed in the following table.

Table 28: Operating temperature

ile Parameter

Min.

Typ.

Max.

Unit

Normal operation temperature

-30

25

75



Extended operation temperature*

-40

25

85



Storage temperature

-45

25

+90



F *Note: Module is able to make and receive voice calls, data calls, SMS and make UMTX/LTE

l traffic in -40 ~ +85. The performance will be reduced slightly from the 3GPP specifications

if the temperature is outside the normal operating temperature range and still within the extreme

tia operating temperature range.

5.3 Operating Mode

en 5.3.1 Operating Mode Definition fid The table below summarizes the various operating modes of Module product.
Table 29: Operating mode Definition

n Mode Co UMTS/LTE Sleep

Function AT command "AT+CSCLK=1" can be used to set the module to a sleep mode. In this case, the current consumption of module will be reduced to a very low level and the module can still receive paging

message and SMS.

Normal operation

UMTS/LTE Idle
m UMTS/LTE Talk oUMTS/LTE Standby CUMTS/LTE SIM Data transmission

Software is active. Module is registered to the network, and the Module is ready to communicate. Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antenna. Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings. There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level); uplink/downlink data rates, etc. AT command "AT+CFUN=0" can be used to set the Module to a

Minimum functionality

minimum functionality mode without removing the power supply. In

mode

this mode, the RF part of the Module will not work and the USIM

card will not be accessible, but the serial port and USB port are still

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Smart Machine Smart Decision

accessible. The power consumption in this mode is lower than normal mode.

Flight mode
l File Power off

AT command "AT+CFUN=4" or pulling down the W_disable1# pin can be used to set the Module to flight mode without removing the power supply. In this mode, the RF part of the Module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode.
Module will go into power off mode by sending the AT command "AT+CPOF" or pull down the FUL_CARD_POWER_OFF# pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible.

tia 5.3.2 Sleep mode n In sleep mode, the current consumption of Module will be reduced to a very low level, and Module
can still receive paging message and SMS.
e Several hardware and software conditions must be satisfied in order to let Module enter into sleep
mode:
fid 1. UART condition
2. USB condition
3. Software condition
n Note: Before designing, pay attention to how to realize sleeping/waking function. o 5.3.3 Minimum functionality mode and Flight mode C Minimum functionality mode ceases a majority function of Module, thus minimizing the power

consumption. This mode is set by the AT command which provides a choice of the functionality levels.
m  AT+CFUN=0: Minimum functionality
 AT+CFUN=1: Full functionality (Default)
o  AT+CFUN=4: Flight mode CIf Module has been set to minimum functionality mode, the RF function and UIM card function
will be closed. In this case, the serial port and USB are still accessible, but RF function and UIM card will be unavailable.
IMIf Module has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable.
S When Module is in minimum functionality or flight mode, it can return to full functionality by the

AT command "AT+CFUN=1".

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5.4 Current Consumption

Smart Machine Smart Decision

The current consumption is listed in the table below.

Table 30: Current consumption on VBAT Pins (VBAT=3.8V)

SIM8200EA-M2 TBD

GNSS

GNSS supply current (AT+CFUN=0,with USB connection) UMTS sleep/idle mode
l WCDMA supply current tia (GNSS offwithout USB connection)
LTE sleep/idle mode LTE FDD supply current (GNSS offwithout USB connection)
n LTE TDD supply current e (GNSS offwithout USB connection)
UMTS Talk
fid WCDMA B1
WCDMA B2 WCDMA B3
n WCDMA B4
WCDMA B5
o WCDMA B8 C HSDPA data

@ -140dBmTracking Typical:TBD
Sleep mode @DRX=9 Typical: TBD Idle mode @DRX=9 Typical: TBD
Sleep mode Typical: TBD Idle mode Typical: TBD Sleep mode Typical: TBD Idle mode Typical: TBD
@Power TBD Typical: TBD @Power TBD Typical: TBD @Power TBD Typical: TBD @Power TBD Typical: TBD @Power TBD Typical: TBD @Power TBD Typical: TBD

WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4
m WCDMA B5 o WCDMA B8
LTE data
CLTE-FDD B1 IMLTE-FDD B2 S LTE-FDD B3

@Power TBD @Power TBD @Power TBD @Power TBD @Power TBD @Power TBD

Typical: TBD Typical: TBD Typical: TBD Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD
@5Mbps TBD @10Mbps TBD @20Mbps TBD
@5Mbps TBD @10Mbps TBD

Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD

@20Mbps TBD Typical: TBD

LTE-FDD B4

@5Mbps TBD Typical: TBD @10Mbps TBD Typical: TBD

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LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26
m LTE-FDD B28 Co LTE-FDD B30 IMLTE-TDD B34 S LTE-TDD B38
LTE-TDD B39

Smart Machine Smart Decision

@20Mbps TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD Typical: TBD

@10Mbps TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD
l @5Mbps TBD
@10Mbps TBD
tia @20Mbps TBD
@5Mbps TBD @10Mbps TBD @20Mbps TBD
n @5Mbps TBD
@10Mbps TBD
e @20Mbps TBD
@5Mbps TBD
fid @10Mbps TBD
@20Mbps TBD
@5Mbps TBD @10Mbps TBD @20Mbps TBD
n@5Mbps TBD
@10Mbps TBD
o@20Mbps TBD
@5Mbps TBD
C@10Mbps TBD

Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD

@20Mbps TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

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LTE-TDD B40 LTE-TDD B41 LTE-TDD B42 LTE-TDD B48 LTE-FDD B66 LTE-FDD B71 5G data 5G N1 5G N2 5G N3 5G N5 5G N7 5G N8
m 5G N12 Co 5G N20 IM5G N25 S 5G N28
5G N40

Smart Machine Smart Decision

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD Typical: TBD

@10Mbps TBD Typical: TBD

@20Mbps TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD
l @5Mbps TBD
@10Mbps TBD @20Mbps TBD
tia @5Mbps TBD
@10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD

n @5Mbps TBD e @10Mbps TBD
@20Mbps TBD
fid @5Mbps TBD
@10Mbps TBD @20Mbps TBD
@5Mbps TBD @10Mbps TBD
n@20Mbps TBD
@5Mbps TBD
o@10Mbps TBD
@20Mbps TBD
C@5Mbps TBD

Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD

@10Mbps TBD Typical: TBD

@20Mbps TBD Typical: TBD

@5Mbps TBD Typical: TBD @10Mbps TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

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Smart Machine Smart Decision

5G N41

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

5G N66

@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD

@5Mbps TBD Typical: TBD

5G N71

@10Mbps TBD Typical: TBD

@20Mbps TBD Typical: TBD

5G N77
l 5G N78 tia 5G N79

@5Mbps TBD @10Mbps TBD @20Mbps TBD
@5Mbps TBD @10Mbps TBD @20Mbps TBD
@5Mbps TBD @10Mbps TBD @20Mbps TBD

Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD
Typical: TBD Typical: TBD Typical: TBD

n 5.5. RF Output Power

e The following table shows the RF output power of SIM8200EA_M2 module. fid Table 31: Conducted Output Power

n Frequency
WCDMA Bands
o LTE-FDD Bands C LTE-TDD Bands

Max 24dBm + 1/-3dB 23dBm + 2/-2dB 23dBm + 2/-2dB

Min < -50dBm < -40dBm < -40dBm

5G Bands

23dBm + 2/-2dB

< -40dBm

5.6 Conducted Receive Sensitivity
m The following tables show conducted RF receiving sensitivity of SIM8200EA_M2module. o Table 32:SIM8200EA-M2 Conducted RF Receiving Sensitivity

CFrequency IMWCDMA B1
WCDMA B2
S WCDMA B3

Primary (Typ.)
TBD TBD TBD

Diversity (Typ.)
TBD
TBD
TBD

SIMO1(Typ.)
TBD TBD TBD

SIMO2(Worst Case)
TBD
TBD
TBD

WCDMA B4

TBD

TBD

TBD

TBD

WCDMA B5

TBD

TBD

TBD

TBD

WCDMA B8

TBD

TBD

TBD

TBD

File

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LTE-FDD B1(10M)

TBD

LTE-FDD B2(10M)

TBD

LTE-FDD B3(10M)

TBD

LTE-FDD B4(10M)

TBD

LTE-FDD B5(10M)

TBD

LTE-FDD B7(10M)

TBD

LTE-FDD B8(10M)

TBD

LTE-FDD B12(10M)

TBD

LTE-FDD B13(10M)

TBD

LTE-FDD B14(10M)

TBD

LTE-FDD B17(10M)

TBD

LTE-FDD B18(10M)

TBD

LTE-FDD B19(10M)

TBD

LTE-FDD B20(10M)

TBD

LTE-FDD B25(10M)

TBD

LTE-FDD B26(10M)

TBD

LTE-FDD B28(10M)

TBD

LTE-FDD B29(10M)

TBD

LTE-FDD B30(10M)

TBD

LTE-FDD B32(10M)

TBD

LTE-TDD B34(10M)

TBD

LTE-TDD B38(10M)

TBD

LTE-TDD B39(10M)

TBD

LTE-TDD B40(10M)

TBD

LTE-TDD B41(10M)

TBD

LTE-TDD B42(10M)

TBD

LTE-TDD B43(10M)

TBD

LTE-TDD B48(10M)

TBD

LTE-FDD B66(10M)

TBD

LTE-FDD B71(10M)

TBD

m 5G N1

TBD

5G N2

TBD

o 5G N3

TBD

5G N5

TBD

C5G N7

TBD

5G N8

TBD

5G N12

TBD

IM5G N20

TBD

5G N25

TBD

S 5G N28

TBD

5G N40

TBD

5G N41

TBD

5G N66

TBD

Smart Machine Smart Decision

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

l TBD

TBD

TBD

tia TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

n TBD

TBD

TBD

e TBD

TBD

TBD

TBD

TBD

TBD

fid TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

nTBD

TBD

TBD

oTBD

TBD

TBD

TBD

TBD

TBD

CTBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

File

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Smart Machine Smart Decision

5G N71

TBD

TBD

TBD

TBD

5G N77

TBD

TBD

TBD

TBD

5G N78

TBD

TBD

TBD

TBD

5G N79

TBD

TBD

TBD

TBD

Note: The data in above table are gotten at static condition.

1. SIMO is a smart antenna technology that uses a single antenna at the transmitter side and

multiple (two for SIM8200EA_M2) antennas at the receiver side, which can improve Rx

performance.

2. Per 3GPP specification.

5.5 ESD

l Module is sensitive to ESD in the process of storage, transporting, and assembling. When Module tia is mounted on the users' mother board, the ESD components should be placed beside the
connectors which human body may touch, such as USIM card holder, SD card holder, audio jacks, switches, USB interface, etc. The following table shows the Module ESD measurement performance without any external ESD component.

n Table 33: The ESD performance measurement table (Temperature: 25, Humidity: 45%)

e Part fid VBAT,GND
Antenna port FUL_CARD_POWER_OFF#
n USB o RESET_N C UIM Card

Contact discharge +/-TBD +/- TBD +/- TBD +/- TBD +/- TBD +/- TBD

Air discharge +/- TBD +/- TBD +/- TBD +/- TBD +/- TBD +/- TBD

Other PADs

+/- TBD

+/- TBD

SIMCom

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Smart Machine Smart Decision
6 Top and Bottom View of Module
Confidential File Figure 23: Top and bottom view of Module SIMCom

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7 Label description Information

A
B
l C tia D n E
F
nfide T o Figure 24: Label description of Module
C Table 34: Label description of Module Information

No.

Description

A

LOGO

m B

Project name

C

Product code

oD

QR code

E

Serial number

CF

International mobile equipment identity

IM7.1 Ordering Information

S Table 35: SIM8200EA-M2 Information

File

Product name SIM8200EA-M2

P/N S2-108R0

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8 Packaging

Smart Machine Smart Decision

Module support tray packaging.
fidential File Figure 25: packaging diagram Con Module tray drawing SIMCom

Figure 26: Tray drawing

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Table 36: Tray size

Smart Machine Smart Decision

Length±3mm 245.0
Small carton drawing

Width±3mm 165.0

Number 10

ential Figure 27: Small carton drawing fid Table 37: Small Carton size

Length±10mm Width±10mm

n 270

180

Co Big carton drawing

Height±10mm 120

Number
10*20=200

SIMCom Table 38: Big Carton size

Figure 28: Big carton drawing

Length±10mm Width±10mm Height±10mm

Number

380

280

280

200*4=800

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Appendix

A. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 39: Coding Schemes and Maximum Net Data Rates over Air Interface

HSDPA device category Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 Category 7 Category 8 Category 9 Category 10 Category 11 Category 12 Category 13 Category 14 Category 15 Category 16 Category 17 Category 18 Category 19
m Category 20 o Category 21
Category 22
CCategory 23
Category 24 HSUPA device category
IMCategory 1 Category 2
S Category 3

Max data ratepeak
1.2Mbps
l 1.2Mbps
1.8Mbps
tia 1.8Mbps
3.6Mbps
3.6Mbps
n 7.2Mbps e 7.2Mbps
10.2Mbps
fid 14.4Mbps
0.9Mbps
1.8Mbps
n 17.6Mbps o21.1Mbps
23.4Mbps
C28Mbps

Modulation type 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK 16QAM,QPSK QPSK QPSK 64QAM 64QAM 16QAM 16QAM

23.4Mbps

64QAM

28Mbps

64QAM

35.5Mbps

64QAM

42Mbps

64QAM

23.4Mbps

16QAM

28Mbps

16QAM

35.5Mbps

64QAM

42.2Mbps

64QAM

Max data ratepeak

Modulation type

0.96Mbps

QPSK

1.92Mbps

QPSK

1.92Mbps

QPSK

Category 4

3.84Mbps

QPSK

Category 5

3.84Mbps

QPSK

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Category 6 LTE-FDD device category (Downlink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6 LTE-FDD device category (Uplink) Category 1 Category 2 Category 3 Category 4 Category 5 Category 6
SIMCom

5.76Mbps

Smart Machine Smart Decision QPSK

Max data ratepeak

Modulation type

10Mbps

QPSK/16QAM/64QAM

50Mbps

QPSK/16QAM/64QAM

100Mbps

QPSK/16QAM/64QAM

150Mbps

QPSK/16QAM/64QAM

300Mbps 300Mbps
l Max data ratepeak tia 5Mbps
25Mbps 50Mbps
n 50Mbps
75Mbps
Confide 50Mbps

QPSK/16QAM/64QAM QPSK/16QAM/64QAM
Modulation type
QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM QPSK/16QAM/64QAM QPSK/16QAM

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B. Related Documents

Table 40: Related Documents

ile NO. Title

[1]

SIM8200EA-M2 Series_AT Command Manual_V1.xx

F [2]

ITU-T Draft new recommendationV.25ter

l [3] GSM 07.10

tia [4] GSM 07.05

n [5] GSM 11.14 fide [6] GSM 11.11
[7] GSM 03.38
n [8] GSM 11.10 Co [9] 3GPP TS 51.010-1

Description
AT Command Manual
Serial asynchronous automatic dialing and control
Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment ­ Data Circuit terminating Equipment (DTE ­ DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module ­ Mobile Equipment (SIM ­ ME) interface Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module ­ Mobile Equipment (SIM ­ ME) interface Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information Digital cellular telecommunications system (Phase 2)  Mobile Station (MS) conformance specification Part 1: Conformance specification
Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification

[10] 3GPP TS 38.401
[11] 3GPP TS 34.124
m [12] 3GPP TS 34.121 o [13] 3GPP TS 34.123-1 C[14] 3GPP TS 34.123-3 SIM[15] EN 301 908-02 V2.2.1
[16] EN 301 489-24 V1.2.1

NG-RAN; Architecture description
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD) User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for

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radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

[17] [18] [19] [20] [21]
[22]
[23]

IEC/EN60950-1(2001)
3GPP TS 51.010-1
ile GCF-CC V3.23.1
2002/95/EC
F SIM8200EA-M2 l Series_UART_Application
Note_V1.xx
tia SIM8200EA-M2
Series_GPS_Application Note_V1.xx
SIM8200EA-M2 Antenna
n design guidelines for diversity Confide receiver system

Safety of information technology equipment (2000) Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification Global Certification Forum - Certification Criteria Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) This document describes how to use UART interface of SIMCom modules.
GPS Application Note
Antenna design guidelines for diversity receiver system

SIMCom

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C. Terms and Abbreviations

Table 41: Terms and Abbreviations

Abbreviation

Description

ADC

Analog-to-Digital Converter

ARP

Antenna Reference Point

BER BTS CS CSD CTS DAC DRX DSP DTE DTR DTX EFR EGSM EMC ESD ETS EVDO FCC FD FDMA

Bit Error Rate Base Transceiver Station Coding Scheme
l Circuit Switched Data
Clear to Send
tia Digital-to-Analog Converter
Discontinuous Reception Digital Signal Processor
n Data Terminal Equipment (typically computer, terminal, printer)
Data Terminal Ready
e Discontinuous Transmission
Enhanced Full Rate
fid Enhanced GSM
Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard
n Evolution Data Only
Federal Communications Commission (U.S.)
o SIM fix dialing phonebook C Frequency Division Multiple Access

FR

Full Rate

GMSK
GNSS
GPRS
m GPS
GSM
o HR
HSPA
CHSIC
I2C
IMEI
IMLTE MDIO
S MMD

Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Global Standard for Mobile Communications Half Rate High Speed Packet Access High-speed Inter-chip Inter-Integrated Circuit International Mobile Equipment Identity Long Term Evolution Management Data Input/Output MDIO manageable device

MO

Mobile Originated

MS

Mobile Station (GSM engine), also referred to as TE

MT

Mobile Terminated

NMEA

National Marine Electronics Association

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PAP PBCCH PCB PCS RF RMS RTC SIM SMS SPI SMPS TDMA TE TX UART VSWR SM SGMII NC EDGE HSDPA HSUPA ZIF WCDMA VCTCXO USIM UMTS UART

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Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Personal Communication System, also referred to as GSM 1900 Radio Frequency Root Mean Square (value) Real Time Clock Subscriber Identification Module Short Message Service serial peripheral interface Switched-mode power supply
l Time Division Multiple Access
Terminal Equipment, also referred to as DTE
tia Transmit Direction
Universal Asynchronous Receiver & Transmitter Voltage Standing Wave Ratio SIM phonebook
n Serial gigabit media independent interface
Not connect
e Enhanced data rates for GSM evolution
High Speed Downlink Packet Access
fid High Speed Uplink Packet Access
Zero intermediate frequency Wideband Code Division Multiple Access
n Voltage control temperature-compensated crystal oscillator
Universal subscriber identity module
o Universal mobile telecommunications system C Universal asynchronous receiver transmitter

SIMCom

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D. Safety Caution

Table 42: Safety Caution

Confidential File Marks

Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular

networks and cannot be guaranteed to connect in all conditions, especially with a

mobile fee or an invalid SIM card. While you are in this condition and need
emergent help, please remember to use emergency calls. In order to make or
receive calls, the cellular terminal or mobile must be switched on and in a service
marea with adequate cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
ofeatures are in use (e.g. lock functions, fixed dialing etc.). You may have to
deactivate those features before you can make an emergency call.
CAlso, some networks require that a valid SIM card be properly inserted in the SIM cellular terminal or mobile.

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Contact us: Shanghai SIMCom Wireless Solutions Limited.

Smart Machine Smart Decision

Address: Building B, No.633 Jinzhong Road, Changning District, Shanghai P.R.China 200335 Tel: +86 21 3157 5100\3157 5200 Email: simcom@simcom.com Website: www.simcom.com
Confidential

File

SIMCom

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