Zowee Technology M8902 Tablet PC User Manual Module Spec

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Document ID	2785742
Application ID	kykrksrbnY8FnKjdA7Js6w==
Document Description	User manual_Module Spec
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Permanent Confidential	No
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Document Type	User Manual
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Filesize	32.56kB (407057 bits)
Date Submitted	2015-10-19 00:00:00
Date Available	2015-10-20 00:00:00
Creation Date	2013-12-02 17:42:03
Producing Software	Acrobat Distiller 7.0.5 (Windows)
Document Lastmod	2013-12-02 17:42:03
Document Title	Microsoft Word - RL-SM02BD-8723BS-V1.0 规格书.doc
Document Creator	PScript5.dll Version 5.2.2
Document Author:	Administrator

SPECIFICATION
IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth2.1
/3.0/4.0,with SDIO INTERFACE, and HS-UART MIXED INTERFACE
RL-SM02BD (Realtek RTL8723BS)
Combo Module
Version 1.0
http://www.rf-link.net
第 1 页 共 11 页
PRODUCT DESCRIPTION
SM02BD is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid
Array) footprint, board size is 12mm*12mm with module height of 2mm. It can be easily
manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile
device and consumer products. It provides GSPI/SDIO interface for WiFi to connect
with host processor and high speed UART interface for BT. It also has a PCM interface
for audio data transmission with direct link to external audio codec via BT controller.
The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO
technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
SM02BD uses Realtek RTL8723BS, a highly integrated WiFi/BT single MODULE based on
advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into
a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except
fewer passive components remained on
PCB.
PRODUCT FEATURES
‹ Operate at ISM frequency bands (2.4GHz)
‹ GSPI/SDIO for WiFi and UART for Bluetooth
‹ IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
802.11e, IEEE 802.11h, IEEE 802.11i
‹ Fully Qualified for Bluetooth 2.1 + EDR specification including both 2Mbps and
3Mbps modulation mode
‹ Fully qualified for Bluetooth 3.0
‹ Fully qualified for Bluetooth 4.0 Dual mode
‹ Full –speed Bluetooth operation with Piconet and Scatternet support.
‹ Enterprise level security which can apply WPA/WPA2 certification for WiFi.
‹ WiFi 1 transmitter and 1 receiver allow data rates supporting up to
150 Mbps downstream and 150 Mbps upstream PHY rates
‹ For WiFi/BT, it uses fixed path for WiFi and BT, which means one antenna assigned
for WiFi and the other is assigned for BT.
‹ Support Bluetooth adaptive power management mechanism
‹ Full-featured software utility for easy configuration and management
‹ RoHS compliance
‹ Low Halogen compliance
http://www.rf-link.net
第 2 页 共 11 页
Diagram
Temperature Limit Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Junction Temperature
http://www.rf-link.net
Minimum
-55
Maximum
+125
70
125
第 3 页 共 11 页
Units
℃
℃
℃
PRODUCT SPECIFICATIONS
Main chipset :WiFi/BT Single Chip: Realtek RTL8723BS
Functional Specifications
WiFi:
EEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d,
Standards
Bus Interface
802.11e, IEEE 802.11h, IEEE 802.11i
BT: V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0
WiFi:
GSPI/SDIO
BT: UART
802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
Data Rate
802.11n:
MCS 0 to 7 for HT20MHz
MCS 0 to 7 for HT40MHz
BT:
1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
6,9,12,18,24,36,48,54 Mbps for High Speed
WiFi:
CSMA/CA with ACK
Media Access Control
BT: AFH, Time Division
802.11b:
CCK, DQPSK, DBPSK
802.11g:
64 QAM, 16 QAM, QPSK, BPSK
802.11n:
64 QAM, 16 QAM, QPSK, BPSK
Modulation Techniques
BT:
Network Architecture
8DPSK, π/4 DQPSK, GFSK
WiFi:
Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
Software AP
WiFi Direct
BT:
Pico Net
Scatter Net
Operating Channel
http://www.rf-link.net
WiFi 2.4GHz:
第 4 页 共 11 页
IEEE
11: (Ch. 1-11) – United States
13: (Ch. 1-13) – Europe
14: (Ch. 1-14) – Japan
BT 2.4GHz:
Ch. 0 ~78
Frequency Range
Transmit Output Power – 1x1
(Tolerance:±1.5dBm)
2.400GHz ~ 2.4835 GHz
802.11b@11Mbps
16dBm
802.11g@6Mbps
15dBm
802.11g@54Mbps
14dBm
802.11n
13dBm (MCS 0_HT20)
13dBm (MCS 7_HT20)
12dBm (MCS 0_HT40)
12dBm (MCS 7_HT40)
802.11g@54Mbps
-71dBm
802.11n
-67dBm (MCS 7_HT20)
-64dBm (MCS 7_HT40)
BT:
Max +10dBm
Receiver Sensitivity
802.11b@11Mbps
-82dBm
BT:
-89dBm@1Mbps, -90dBm@2Mbps, -83dBm@3Mbps
Security
WiFi :
WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE
802.11x, IEEE 802.11i
BT:
Simple Paring
Operating Voltage
3.3 V ±9% I/O supply voltage
OS supported
Linux/Android
Power Consumption (3.3V)
(Typical)
WiFi only
TX Mode: (Conituous mode)
85mA
(MCS7/BW40/13dBm)
RX Mode: (Conituous mode)
75mA
(MCS7/BW40/-60dBm)
Associated Idle with DTIM=1
2.1mA
Unassociated Idle:
0.1mA
RF disable Mode:
0.1mA
BT :
Inquiry & Page Scan:
0.9 mA
ACL no traffic:
7.5mA
SCO HV3:
15mA
http://www.rf-link.net
第 5 页 共 11 页
Mechanical
Dimensions (mm)
http://www.rf-link.net
Length
12
(Tolerance:±0.2mm)
Width
12
(Tolerance:±0.2mm)
Height
1.6
(Tolerance:±0.2mm)
第 6 页 共 11 页
MODULE PIN ASSIGNMENT
PIN
Function
Description
GND
Grond
WIFI/BT_ANT
WIFI/BT_ANT
NC
NC
NC
NC
NC
NC
BT_WAKE
HOST wake-up Bluetooth device
BT_HOST_WAKE
Bluetooth device to wake-up HOST
NC
NC
VABT
3.3V±0.1V(Main power voltage source input)
10
NC
NC
http://www.rf-link.net
第 7 页 共 11 页
11
NC
12
WL_DSI#
13
WL_HOST_WAKE
NC
Shared with GPIO9 This Pin Can Externally Shutdown the RTL8723BS
WLAN function when BT_DISn is Pulled Low. When this pin deasserted,
SDIO interface will be disabled. This pin can also support the WLAN Ra
dio-off function with host interface remaining connected.
WLAN to wake-up HOST
14
SD_D2
SDIO data line 2
15
SD_D3
SDIO data line 3
16
SD_CMD
SDIO command line
17
SD_CLK
SDIO CLK line
18
SD_D0
SDIO data line 0
19
SD_D1
SDIO data line 1
20
GND
Grond
21
NC
NC
22
VDD_IO
3.3V±0.1V
23
NC
24
SUSCLK_IN
25
PCM_DOUT
NC
Shared with GPIO6. External 32K or RTC clock input with 1.8V ~ 3.3V
swing. This clock source is configured by BT and WL FW, respectively.
PCM Data output
26
PCM_CLK
PCM Clock
27
PCM_DIN
PCM data input
28
PCM_SYNC
PCM sync signal
29
NC
30
26MHz_IN
31
GND
NC
Reference clock input 26MHz Active Crystals
(or if pin10/11 input ,pin30 NC )
Grond
32
NC
NC
33
GND
Grond
34
BT_DIS#
General Purpose Input/Output Pin
35
NC
NC
36
GND
Grond
37
NC
NC
38
NC
NC
39
NC
NC
40
41
NC
GND
NC
Grond
42
43
44
UART_OUT
UART_IN
UART_CTS
HOST Data output
HOST Data input
HOST_CTS
http://www.rf-link.net
第 8 页 共 11 页
WIFI\BT RF Circuit reference pictures
注:1.以上虚线框的部分需要进行天线匹配，以实际天线匹配的电子元器件参数为准.
2.以上为 RF 走线要做 50 欧姆阻抗，走线不能走 90 度，走线长度不能超过 15mm.
Note: The RF part layout must do 50 Ωimpedance.，can't get the line go 90°，can't get the line longer than 15
mm.
SDIO interface Circuit reference pictures
http://www.rf-link.net
第 9 页 共 11 页
Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
ENVIRONMENTAL
Operating
Operating Temperature:
Relative Humidity:
0°C to +70 °C
5-90% (non-condensing)
Storage
Temperature:
Relevant Humidity:
-40°C to +80°C (non-operating)
5-95% (non-condensing)
MTBF caculation
Over 150,000hours
http://www.rf-link.net
第 10 页 共 11 页
Wifi 模块贴片装机前注意事项：
Wireless module before the SMT note:
1.When customers Open stencil must be sure the hole bigger to the
Wireless module plate, please press 1 to 1 and 0.7 mm is widened
to open outward, the thickness of 0.12 mm.
2.Can't get the wifi module bare hands when needs,must we wear
1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1 比 1 再向
外扩大 0.7mm 比例开钢网，厚度按 0.12mm.
2.有需要拿 wifi 模块时不可以光手去拿，一定要戴上手套以及静电环.
3.过炉温度要根据客户主板的大小而定，一般像平板电脑上的标准温
the gloves and static ring.
度为250+-5°，也可以做到260+-5°
3.The furnace temperature according to the size of the customer the
mainboard ,generally like to stick on a tablet standard temperature
Wifi 模块储存及使用管制应注意事项如下：
of 250 + - 5,can do 260 + - 5.
Storage and use Wifi module control should pay attention to
the following matters:
1.模块的真空包装之储存期限：
1.Module of the storage life of vacuum packaging：
1-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
1-1.Storage life：12 months. Storage conditions:<40℃. Relative
humidity:<90%R.H.
<90%R.H.
1-2.After this bag is opened , devices that will be subjected to
1-3.检查湿度卡：显示值应小于30%（蓝色）
，如：30%~40%(粉红色）
infrared reflow, vapor-phase reflow, or equivalent processing must
be :
1-3.Check
the
humidity
card
:stored
at
≦20%RH.If :30%~40%(pink)or greater than 40%(red).Labeling
module has moisture absorption.
① Mounthed within 168 hours at factory conditions of:
t≦30%℃，≦60%R.H.
② Once opened, the workshop the preservation of life for
168 hours.
1-4.If baking is required,devices may be baked for:
① Modules must be to remove module moisture problem.
② Baking temperature: 125 ℃, 8 hours.
③ After baking, put proper amount of desiccant to seal
packages.
1-5.Module vacuum packing 2000 PCS per disc.
2.Module reel packaging items as follows.
2-1.Storage life：12 months. Storage conditions:<40℃. Relative
humidity:<90%R.H.
2-2.Module apart packing after 168 hours，To launch patch need to
bake, to remove the module hygroscopic, baking temperature
conditions：125℃，8hours.
2-3.Reel packing 2000 PCS or 1000 PCS per disc.
1-2.模块包装被拆后，SMT 组装之时限：
或者大于40%（红色）表示模块已吸湿气.
① 工厂环境温度湿度管制：≦30%℃，≦60%R.H。
② 拆封后，车间的保存寿命为 168 小时.
1-4.如在拆封后的 168 个小时内未使用完，需要烘烤，烘烤条件如下：
① 模块须重新烘烤，以除去模块吸湿问题.
② 烘烤温度条件：125℃，8 小时.
③ 烘烤后，放入适量的干燥剂再密封包装.
1-5.模块真空包装每盘 2000pcs，真空包装图片<1>
2.模块卷盘包装事项如下：
2-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
2-2.模块拆开包装168小时后，如要上线贴片需要重新烘烤，以除去模
块吸湿问题，烘烤温度条件：125℃，8小时。
2-3.卷盘包装标准为每盘 2000pcs，也可以 1000pcs.
3.模块托盘包装事项如下：
3-1.保存期限：3个月，储存环境条件：温度在：<40℃，相对湿度：
<90%R.H.
3-2.模块如在 48 小时内未使用，在上线之前需要进行烘烤，烘烤温度
条件：125℃，8 小时。
3.Module pallet packaging items as follows：
3-1.Storage life ： 3 months. Storage conditions:<40℃. Relative
humidity:<90%R.H.
3-3.托盘包装每盘为 100pcs，以 1000pcs 或 2000pcs 出货.
3-2.Module if not used within 48 hours, before launch the need for
baking, baking temperature: 125 ℃, 8 hours.
3-3.Pallet packaging each plate is 100 PCS to 1000 PCS or 2000
PCS shipment.
http://www.rf-link.net
第 11 页 共 11 页

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Title                           : Microsoft Word - RL-SM02BD-8723BS-V1.0 规格书.doc
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