AcSiP Technology S76S LoRa Wireless Communication Module User Manual S502 SPEC

AcSiP Technology Corporation LoRa Wireless Communication Module S502 SPEC

Users Manual

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Document ID3663116
Application IDqIjZw74ISv9K7IS848x2oA==
Document DescriptionUsers Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize81.3kB (1016220 bits)
Date Submitted2017-12-05 00:00:00
Date Available2017-12-15 00:00:00
Creation Date2017-11-23 09:48:09
Producing SoftwareMicrosoft® Word 2010
Document Lastmod2017-11-29 17:33:09
Document TitleS502 SPEC
Document CreatorMicrosoft® Word 2010
Document Author: AcSiP Technology Corp.

Product Name
Version
Doc No
Date
S76S
LoRa Wireless Communication Module
901-10201
Mar 22nd, 2017
Document History
Date
Revised Contents
Revised By
Version
Chunyi
July 20th ,2016
Draft Version
Aug 25th ,2016
Revised 7.1 marking without logo
Nick
Sep 10th ,2016
Revised marking with Acsip logo
Nick
Sep 26th ,2016
Revised 4.1 footprint drawing
Nick
Oct. 7 th ,2016
Update footprint
Nick
Oct. 11 th ,2016
Add pin assignment, revise footprint and
Kenny
mechanical dimension
Mar 22nd ,2017
Modify Marking information
Kenny
Nov 13nd ,2017
Add FCC statement
Kenny
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
1 of 18
1. General Description
The S76S integrates ARM Coretex®-M0+ (32-bit RISC core operating at a 32MHz frequency) MCU with LoRaTM
modulation that provides ultra-long range spread spectrum communication and high interference immunity
whilst minimizing current consumption.
S76S can achieve a sensitivity of over -137 dBm. The high sensitivity combined with the integrated +20 dBm
power amplifier yields industry leading link budget making it optimal for any low data rate application requiring
range or robustness. LoRaTM also provides significant advantages in both blocking and selectivity over
conventional modulation techniques, solving the traditional design compromise between range, interference
immunity and energy consumption.
Feature
 Small footprint:13 mm x 11 mm x 1.1 mm
 Preamble detection
 LoRaTM Modem
 Automatic RF Sense and CAD with ultra-fast AFC
 Payload up to 128 bytes with CRC
 +20 dBm constant RF output vs. V supply
 Embedded memories (up to 192 Kbytes of
 Programmable bit rate up to 37500 bps
Flash memory and 20 Kbytes of RAM)
 High sensitivity: down to -137 dBm
 Excellent blocking immunity
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
2 of 18
1-1 Block Diagram
A simplified block diagram of the S76S module is depicted in the figure below.
1-2
Product Version
The features of S76S is detailed in the following table
Part
Frequency
Spreading
Bandwidth
Effective
Est. Sensitivity
Number
Range
Factor
(K Hz)
Bitrate (bps)
( dBm )
6 - 12
62.5 - 500
146 - 37500
-109 to -137*
S76S
902.3-914.9 MHz
Note: * LORA setting SF=12, BW=62.5k, Long-Range Mode, highest LNA gain, LnaBoost for Band 1.
1-3
Specification
Model Name
S76S
Product Description
LoRa Wireless Communication Module
Host Interface
UART
Operation Conditions
Temperature
Humidity
 Storage:-50℃ ~ +105℃
 Operating:-20℃ ~ +70℃
 Operating:10 ~ 95% (Non-Condensing)
 Storage:5 ~ 95% (Non-Condensing)
Dimension
13 mm x 11 mm x 1.1 mm
Package
LGA type
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
3 of 18
2. Electrical Characteristics
2-1. Absolute Maximum Ratings
Symbol
VDD33
Parameter
Min.
Typ.
Max.
Unit
Supply Voltage
-0.3
3.9
VIN
Input voltage on digital pins
-0.3
3.9
Pmr
RF Input Level
+10
dBm
2-2. Recommended Operating Range
Symbol
Parameter
VDD33
Supply Voltage
ML
RF Input Level
Min.
Typ.
Max.
Unit
2.0
3.3
3.6
+10
dBm
2-3. Power Consumption Characteristics
Symbol
Parameter
IDDSL
Supply current in Sleep mode
IDDST
Supply current in Standby mode
IDDR
Supply current in Receive mode
Supply current in Transmit
mode with impedance
IDDT
matching
Conditions
Typ.
Max.
TBD
Crystal oscillator enabled
17.5
RFOP = +20 dBm
127
RFOP = +17 dBm
82
RFOP = +13 dBm
65
RFOP = + 7 dBm
49
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
4 of 18
Unit
uA
9.6
mA
mA
mA
2-4. RF Characteristics
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation.
Following conditions apply unless otherwise specified:
 Supply voltage = 3.3 V.
 Temperature = 25° C.
 Frequency bands: 915 MHz
 Bandwidth (BW) = 125 kHz.
 Spreading Factor (SF) = 12.







Error Correction Code (EC) = 4/6.
Packet Error Rate (PER)= 1%
CRC on payload enabled.
Output power = 13 dBm in transmission.
Payload length = 64 bytes.
Preamble Length = 12 symbols (programmed register PreambleLength=8)
With matched impedances
LoRa Transmitter (Conductive)
Item
Condition
Frequency Range
Band1
Tx Power Level
PA_BOOST pin
Min.
Typ.
Max.
915
18.0
Unit
MHz
19.5
21.0
dBm
LoRa Receiver (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Band1
863
915
928
MHz
RFS_L62_HF
(Long-Range Mode, highest
SF = 6
-119
dBm
SF = 7
-114
dBm
LNA gain, LNA boost, 62.5
kHz bandwidth)
SF = 8
-127
dBm
SF = 12
-137
dBm
SF = 6
-109
dBm
SF = 7
-114
dBm
SF = 8
-117
dBm
SF = 9
-120
dBm
SF = 10
-123
dBm
SF = 11
-126
dBm
SF = 12
-128
dBm
RFS_L500_HF
(Long-Range Mode, highest
LNA gain, LNA boost, 500
kHz bandwidth)
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
5 of 18
2-5. Digital Characteristics
2-5-1. DC characteristics
Input voltage levels
Symbol Description
VIH
VIL
RPU
RPD
I/O input
high level voltage
I/O input
low level voltage
Weak pull-up
Equivalent resistor
Weak pull-down
Equivalent resistor
Conditions
Min
NRST
Typ.
Max
Unit
0.7xVDD33 -
BOOT0
0.7xVDD33 -
GPIO
0.7xVDD33 -
NRST
0.3xVDD33
BOOT0
0.14xVDD33 V
GPIO
0.3xVDD33
VIN = GND
30
45
60
KΩ
VIN =VDD33
30
45
60
KΩ
Output voltage levels
Symbol Description
Conditions
Min
Max
CMOS port / IIO = +8
mA
2.7 V≦VDD33≦3.6 V
0.4
VOL
Output low level voltage for
an I/O pin
VOH
Output high level voltage for
an I/O pin
VOL
Output low level voltage for
an I/O pin
TTL port / IIO =+ 8 mA
2.7 V≦VDD33≦3.6 V
0.4
Output high level voltage for
an I/O pin
TTL port / IIO =- 6 mA
2.7 V≦VDD33≦3.6 V
2.4
VOL
Output low level voltage for
an I/O pin
IIO = +15 mA
2.7 V≦VDD33≦3.6 V
VOH
Output high level voltage for
an I/O pin
IIO = -15 mA
2.7 V≦VDD33≦3.6 V
VDD33-1.3 -
VOL
Output low level voltage for
an I/O pin
IIO = +4 mA
1.65 V≦VDD33≦3.6 V
VOH
Output high level voltage for
an I/O pin
IIO = +4 mA
VDD33-0.45 1.65 V≦VDD33≦3.6 V
VOH
Product Name
Version
Doc No
Date
Page
Unit
VDD33-0.4 -
1.3
0.45
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
6 of 18
2-5-2.
NRST pin characteristics
The NRST pin input driver uses CMOS technology.
It is connected to a permanent pull-up resistor (RPU).
The following figure is recommended NRST pin protection circuit against parasitic resets.
Symbol
Description
VIL(NRST)
NRST input low level
voltage
VIH(NRST)
VOL(NRST)
VOL(NRST)
Vhys(NRST)
RPU
Conditions
NRST input high level
voltage
Min
Typ.
Max
Unit
VSS
0.8
1.4
VDD33
NRST output low level
voltage
IOL = 2mA
2.7V<VDD33<3.6V
0.4
NRST output low level
IOL = 1.5mA
1.65V<VDD33<2.7V
0.4
voltage
NRST schmitt trigger
10%
voltage hysteresis
VDD33
Weak pull-up
Equivalent resistor
VF
NRST Input filtered pulse
VNF
NRST Input not filtered
pulse
VIN = GND
30
VDD33 > 2.7 V
Product Name
Version
Doc No
Date
Page
45
350
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
7 of 18
mV
60
KΩ
50
nS
nS
2-5-3.
UART Interface Parameters
Baud Rate =
Data Bits =
Stop Bits =
Parity Check =
Flow Control =
38400 bps
8 bits
1 bit
None
None
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
8 of 18
3. Pin Definition
Pin
Definition
I/O
Description
NC
GND
Ground pin
GND
Ground pin
PC0
I/O
MCU pin name: PC0
PC1
I/O
MCU pin name: PC1
PC2
I/O
MCU pin name: PC2
PC3
I/O
MCU pin name: PC3
NC
NC
10
NC
11
NC
12
NRST
13
PA0
14
GND
Ground pin
15
GND
Ground pin
16
PA2_TXD_A
I/O
MCU pin name: PA2
17
PA3_RXD_A
I/O
MCU pin name: PA3
18
PA4_SPI1_NSS
I/O
MCU pin name: PA4
19
PA5_SPI1_SCK
I/O
MCU pin name: PA5
20
PA6_SPI1_MISO
I/O
MCU pin name: PA6
21
PA7_SPI1_MOSI
I/O
MCU pin name: PA7
22
PC4
I/O
MCU pin name: PC4
23
PC5
I/O
MCU pin name: PC5
24
PB0_IO_INT1
I/O
MCU pin name: PB0
25
PB1_IO_INT2
I/O
MCU pin name: PB1
26
PC6
I/O
MCU pin name: PC6
27
PC7
I/O
MCU pin name: PC7
28
PC8
I/O
MCU pin name: PC8
29
PC9
I/O
MCU pin name: PC9
30
RXTX/RFMOD
Hardware reset pin
I/O
MCU pin name: PA0
Control signal from SX1276, which connects to internal RF switch at
the same time.
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
9 of 18
31
GND
Ground pin
32
GND
Ground pin
33
RF_ANT
34
GND
Ground pin
35
GND
Ground pin
36
PA1_RF_FEM_CPS
37
GND
38
NC
39
GND
40
NC
41
GND
42
NC
43
VDD33
Power Supply
44
VDD33
Power Supply
45
PA8_USART1_CK
I/O
MCU pin name: PA8
46
PA10_USART1_RX
I/O
MCU pin name: PA10
47
PA9_USART1_TX
I/O
MCU pin name: PA9
48
PA11_USART1_CTS
I/O
MCU pin name: PA11
49
PA12_USART1_RTS
I/O
MCU pin name: PA12
50
PA13_SWDIO
Serial wire (SWD) debug interface
51
PA14_SWCLK
Serial wire (SWD) debug interface
52
PC10
I/O
MCU pin name: PC10
53
PC11
I/O
MCU pin name: PC11
54
PC12
I/O
MCU pin name: PC12
55
PD2
I/O
MCU pin name: PD2
56
PB5
I/O
MCU pin name: PB5
57
PB6_SCL
I/O
MCU pin name: PB6
58
PB7_SDA
I/O
MCU pin name: PB7
59
BOOT0
60
PB8_IO_LED_FCT
I/O
61
GND
Ground Pin
62
GND
Ground Pin
I/O
I/O
RF I/O
MCU pin name: PA1
Ground pin
Ground pin
Ground pin
Boot mode selection pin
MCU pin name: PB8
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
10 of 18
3-1.
Pin Assignment
The SiP module will conform to the following pin map, shown in the following diagram (top view)
Product Name
Version
Doc No
Date
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S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
11 of 18
4. Mechanical Dimension
Unit: mm
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
12 of 18
4-1
Recommended Footprint
Unit: mm
TOP View
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
13 of 18
5. Recommended Reflow Profile
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
14 of 18
6. SiP Module Preparation
6-1. Handling
Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is
aligned and tested, it should be transport and storage with anti -static tray and packing. This protective
package must be remained in suitable environment until the module is assembled and soldered onto the
main board.
6-2. SMT Preparation
1. Calculated shelf life in sealed bag: 6 months at<40℃ and <90% relative humidity (RH).
2. Peak package body temperature: 250℃.
3. After bag was opened, devices that will be subjected to reflow solder or other high temperature
process must.
A.
Mounted within: 168 hours of factory conditions<30℃/60%RH.
B.
Stored at≦10%RH with N2 flow box.
4. Devices require baking, before mounting, if:
A.
Package bag does not keep in vacuumed while first time open.
B.
Humidity Indicator Card is >10% when read at 23±5℃.
C.
Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours.
5. If baking is required, devices may be baked for 12 hours at 125±5℃.
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
15 of 18
7. Package Information
7-1. Product Making
Figure 1 below details the standard product marking for all AcSiP Corp. products. Cross reference to the
applicable line number and table for a full detail of all the variables.
Pin 1 identifier
Acsip Logo
Product part number
Lot Code
Production date code
Year/Week
Figure 1 Standard Product Marking Diagram- TOP VIEW
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Version
Doc No
Date
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S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
16 of 18
7-2. Tray Dimension
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
17 of 18
7-3. Packing Information
7-4.
Humidity Indicator Card
Product Name
Version
Doc No
Date
Page
S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
18 of 18
8. FCC statement
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
IMPORTANT NOTE:
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Country Code selection feature to be disabled for products marketed to the US/CANADA
This device is intended only for OEM integrators under the following conditions:
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S76S
LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
19 of 18
1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
and
2) The transmitter module may not be co-located with any other transmitter or antenna,
3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for
2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the
end-user regarding to Regulatory Domain change.
As long as 3 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed
IMPORTANT NOTE
In the event that these conditions can not be met (for example certain laptop configurations or
co-location with another transmitter), then the FCC authorization is no longer considered valid and
the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed
such that 20 cm may be maintained between the antenna and users. The final end product must
be labeled in a visible area with the following: “Contains FCC ID: 2ADWC-S76S”.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module.
The end user manual shall include all required regulatory information/warning as show in this
manual.
Product Name
Version
Doc No
Date
Page
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LoRa Wireless Communication Module
901-10201
Mar 22th ,2017
20 of 18

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Create Date                     : 2017:11:23 09:48:09+08:00
Modify Date                     : 2017:11:29 17:33:09+08:00
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XMP Toolkit                     : Adobe XMP Core 5.4-c006 80.159825, 2016/09/16-03:31:08
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Creator                         : AcSiP Technology Corp.
Title                           : S502 SPEC
Creator Tool                    : Microsoft® Word 2010
Metadata Date                   : 2017:11:29 17:33:09+08:00
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EXIF Metadata provided by EXIF.tools
FCC ID Filing: 2ADWC-S76S

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