Acer orporated T77H389 Dual band WiFi LGA Module User Manual

Acer Incorporated Dual band WiFi LGA Module

user manual

COMPANY CONFIDENTIAL BCM4330 WLAN+BT Combo Module (Foxconn T77H389.00) Product Specification Rev 3.0 Prepared by Reviewed by Approved by Sarah Liu Ai-Ning Song Chang-Fu Lin Index
COMPANY CONFIDENTIAL 1. REVISION HISTORY ................................................................................................................................................... 3 2. INTRODUCTION .......................................................................................................................................................... 4 2.1 SCOPE ...................................................................................................................................................................... 4 2.2 FUNCTION ................................................................................................................................................................. 4 3. PRODUCT SPECIFICATION ..................................................................................................................................... 5 3.1 HARDWARE CHARACTERISTIC ................................................................................................................................. 5 3.2 HARDWARE ARCHITECTURE .................................................................................................................................... 5 3.3 ELECTRICAL SPECIFICATION .................................................................................................................................... 5 3.4 WLAN RF CHARACTERISTICS ................................................................................................................................. 6 3.4.1 IEEE802.11b .................................................................................................................................................. 6 3.4.2 IEEE802.11g .................................................................................................................................................. 7 3.4.3 IEEE802.11n HT20(2.4GHz) ....................................................................................................................... 8 3.4.5 IEEE802.11a .................................................................................................................................................. 9 3.4.6 IEEE802.11n HT20 (5GHz) ....................................................................................................................... 10 3.5 BLUETOOTH STANDARD SPECIFICATIONS ............................................................................................................. 11 3.6 LGA PIN DEFINITION .............................................................................................................................................. 11 4. SOFTWARE REQUIREMENT.................................................................................................................................. 13 5. REGULATORY ........................................................................................................................................................... 13 6. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ....................................................................... 13 6.1 TEMPERATURE ....................................................................................................................................................... 13 6.2 PCB BENDING ........................................................................................................................................................ 13 6.3 HANDLING ENVIRONMENT ....................................................................................................................................... 14 6.4 STORAGE CONDITION ............................................................................................................................................. 14 6.5 BAKING CONDITION ................................................................................................................................................ 14 6.6 SOLDERING AND REFLOW CONDITION .................................................................................................................... 14
COMPANY CONFIDENTIAL 1. Revision History Date Change Note REV Note 2011-12-26 Initial release 1.0 2012-04-16 1. Update block diagram in 3.2. 2. Update Electrical Specification in 3.3. 3. Update WLAN RF Characteristics in 3.4. 4. Update Bluetooth Standard Specifications in 3.5. 5. Change LGA G6 pin definition in 3.6. 6. Update mechanical drawing. 5. Update schematic drawing. 6. update PCB layout. 2.0 2012-06-18 1. Update WLAN RF characteristics in 3.4. 2. Update Bluetooth standard specifications in 3.5. 3. Update schematic. 3.0
COMPANY CONFIDENTIAL 2. Introduction Project Name: 802.11abgn (1X1) + BT4.0 combo module This documentation describes the product specification of the WLAN+BT combo Module. WLAN is Compliant with IEEE Std. 802.11b-1999, IEEE Std. 802.11g-2003 and IEEE Std. 802.11n-2009, Bluetooth is compliant with Bluetooth 4.0+HS. It is a confidential document of Foxconn. * For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and driver to enable or disable 5GHz 2.1 Scope This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow user to switch to different vendors’ Access Points through the wireless networks and to prevent from eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data rate provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS7(HT20) with PHY data rate to 72Mbps. Bluetooth is compliant to Core Specification version 4.0. 2.2 Function  Single stream 802.11n support for 20MHz channels provide PHY layer rates up to 72Mbps.  Bluetooth supports Class 1 and Class 2 output power.  Provides a small form factor solution and ultra low power consumption to support low cost requirement.  Host interface supports: WLAN: SDIO; BT data: UART BT digital audio: PCM
COMPANY CONFIDENTIAL 3. Product Specification 3.1 Hardware Characteristic Form factor 14.5mmx14.5mm LGA Host Interface WLAN: SDIO BT: UART for data, PCM for Audio PCB 6-layer HDI design RF connector Two MHF RF connector on module 3.2 Hardware Architecture The WLAN+BT combo module is designed base on BROADCOM BCM4330 chip, the Broadcom BCM4330 is a highly integrated single chip solution for single stream dual-band WLAN and BT4.0, use two RF connector with one for antenna diversity, a 26MHz crystal is used for reference clock generation, see the block diagram as below: 3.3 Electrical Specification Absolute Maximum Ratings These specification indicate levels where permanent damage to the device can occur. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended can adversely affect long-term reliability of the device. Recommended Operating Condition Element Symbol Value Unit Minimum Typical Maximum DC supply voltage for the device VBAT_3.3V 3.0 3.3 3.6 V VDDIO for WL_VDDIO and BT_VDDIO VIO_1.8V 1.2 1.8 2.9 V Function operation is not guaranteed outside this limit, and operation outside this limit for extended periods can adversely affect long-term reliability of the device. Remark: VBAT_3.3V range is restricted by FEM SE5007BT. Rating Symbol Value Unit DC supply voltage for the device VBAT_3.3V -0.3 to 3.6 V VDDIO VIO -0.5 to 2.98 V
COMPANY CONFIDENTIAL Power-Up Sequence Timing Current Consumption TBD * Will be updated after EDVT testing. Product ID Definition Vendor ID: 0x14e4 Device ID: 0x4360 3.4 WLAN RF Characteristics 3.4.1 IEEE802.11b Items Contents Specification IEEE802.11b Mode DSSS / CCK Channel CH1 to CH13,CH14 Data rate 1, 2, 5.5, 11Mbps -TX Characteristics- Min. Typ. Max. Unit 1. Power Levels 1) Target Power@1Mbps 13 15 17 dBm 2) Target Power@2Mbps 13 15 17 dBm 3) Target Power@5.5Mbps 13 15 17 dBm 4) Target Power@11Mbps 13 15 17 dBm 2. Spectrum Mask @18dBm 1) fc-33MHz ＜ f ＜ fc-22MHz - - -50 dBr 2) fc-22MHz ＜ f ＜ fc-11MHz - - -30 dBr 3) fc+11MHz ＜ f ＜ fc+22MHz - - -30 dBr 4) fc+22MHz ＜ f ＜ fc+33MHz - - -50 dBr 3. Frequency Error -15 - +15 ppm
COMPANY CONFIDENTIAL 4.Modulation Accuracy(EVM)@18dBm 1) 1Mbps - - -9.1 dB 2) 2Mbps - - -9.1 dB 3) 5.5Mbps - - -9.1 dB 4) 11Mbps - - -9.1 dB -RX Characteristics- Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) 1Mbps (FER≦8%) - -91 - dBm 2) 2Mbps (FER≦8%) - -90 - dBm 3) 5.5Mbps (FER≦8%) - -87 - dBm 4) 11Mbps (FER≦8%) - -85 - dBm 6. Maximum Input Level -10 -7 - dBm -Spurious Emission- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm 3.4.2 IEEE802.11g Items Contents Specification IEEE802.11g Mode OFDM Channel CH1 to CH13 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels 1) Target Power@6Mbps 11 13 15 dBm 2) Target Power@9Mbps 11 13 15 dBm 3) Target Power@12Mbps 11 13 15 dBm 4) Target Power@18Mbps 11 13 15 dBm 5) Target Power@24Mbps 11 13 15 dBm 6) Target Power@36Mbps 11 13 15 dBm 7) Target Power@48Mbps 11 13 15 dBm 8) Target Power@54Mbps 11 13 15 dBm 2. Spectrum Mask @16dBm 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -40 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@16dBm 1) 6Mbps - - -5 dB 2) 9Mbps - - -8 dB 3) 12Mbps - - -10 dB 4) 18Mbps - - -13 dB 5) 24Mbps - - -16 dB 6) 36Mbps - - -19 dB 7) 48Mbps - - -22 dB 8) 54Mbps - - -25 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) - -88 - dBm 2) 9Mbps (PER < 10%) - -86 - dBm 3) 12Mbps (PER < 10%) - -85 - dBm 4) 18Mbps (PER < 10%) - -84 - dBm 5) 24Mbps (PER < 10%) - -82 - dBm 6) 36Mbps (PER < 10%) - -78 - dBm 7) 48Mbps (PER < 10%) - -74 - dBm 8) 54Mbps (PER < 10%) - -72 - dBm
COMPANY CONFIDENTIAL 6. Maximum Input Level (PER < 10%) -20 -7 - dBm -Spurious Emission- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm 3.4.3 IEEE802.11n HT20(2.4GHz) Items Contents Specification IEEE802.11n HT20 Mode OFDM Channel CH1 to CH13 Data rate (MCS index) MCS0～MCS7 - TX Characteristics - Min. Typ. Max. Unit 1. PowerLevels 1) Target Power@MCS0 10 12 14 dBm 2) Target Power@ MCS1 10 12 14 dBm 3) Target Power@ MCS2 10 12 14 dBm 4) Target Power@ MCS3 10 12 14 dBm 5) Target Power@ MCS4 10 12 14 dBm 6) Target Power@ MCS5 10 12 14 dBm 7) Target Power@ MCS6 10 12 14 dBm 8) Target Power@ MCS7 10 12 14 dBm 2. Spectrum Mask @15dBm 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -45 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@15dBm 1) MCS0 - - -5 dB 2) MCS1 - - -10 dB 3) MCS2 - - -13 dB 4) MCS3 - - -16 dB 5) MCS4 - - -19 dB 6) MCS5 - - -22 dB 7) MCS6 - - -25 dB 8) MCS7 - - -28 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) MCS0 (PER < 10%) - -85 - dBm 2) MCS1 (PER < 10%) - -84 - dBm 3) MCS2 (PER < 10%) - -82 - dBm 4) MCS3 (PER < 10%) - -80 - dBm 5) MCS4 (PER < 10%) - -77 - dBm 6) MCS5 (PER < 10%) - -73 - dBm 7) MCS6 (PER < 10%) - -71 - dBm 8) MCS7 (PER < 10%) - -69 - dBm 6. Maximum Input Level (PER < 10%) -20 -7 - dBm -Spurious Emission- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm
COMPANY CONFIDENTIAL 3.4.5 IEEE802.11a Items Contents Specification IEEE802.11a Mode OFDM Channel lower band:5.15GHz～5.25GHz middle band:5.25GHz～5.35GHz upper band:5.745GHz～5.805GHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels Low Band 12.5 14 15.5 dBm Middle Band 12.5 14 15.5 dBm Upper Band 12.5 14 15.5 dBm 2. Spectrum Mask @ Type power 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -40 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@ Type power 1) 6Mbps - - -5 dB 2) 9Mbps - - -8 dB 3) 12Mbps - - -10 dB 4) 18Mbps - - -13 dB 5) 24Mbps - - -16 dB 6) 36Mbps - - -19 dB 7) 48Mbps - - -22 dB 8) 54Mbps - - -25 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) - -90 - dBm 2) 9Mbps (PER < 10%) - -89 - dBm 3) 12Mbps (PER < 10%) - -88 - dBm 4) 18Mbps (PER < 10%) - -86 - dBm 5) 24Mbps (PER < 10%) - -84 - dBm 6) 36Mbps (PER < 10%) - -81 - dBm 7) 48Mbps (PER < 10%) - -77 - dBm 8) 54Mbps (PER < 10%) - -75 - dBm 6. Maximum Input Level (PER < 10%) -30 -24 - dBm -Spurious Emission- Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm
COMPANY CONFIDENTIAL 3.4.6 IEEE802.11n HT20 (5GHz) * The performance will be updated after EDVT testing. Items Contents Specification IEEE802.11n HT20 Mode OFDM Channel low band:5.15GHz～5.25GHz middle band:5.25GHz～5.35GHz upper band:5.5GHz～5.825GHz Data rate (MCS index) MCS0～MCS7 - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels Low Band 11.5 13 14.5 dBm Middle Band 11.5 13 14.5 dBm Upper Band 11.5 13 14.5 dBm 2. Spectrum Mask @Type power 1) at fc +/- 11MHz - - -20 dBr 2) at fc +/- 20MHz - - -28 dBr 3) at fc > +/-30MHz - - -45 dBr 3. Frequency Error -15 - +15 ppm 4. Constellation Error(EVM)@Type power 1) MCS0 - - -5 dB 2) MCS1 - - -10 dB 3) MCS2 - - -13 dB 4) MCS3 - - -16 dB 5) MCS4 - - -19 dB 6) MCS5 - - -22 dB 7) MCS6 - - -25 dB 8) MCS7 - - -28 dB - RX Characteristics - Min. Typ. Max. Unit 5. Minimum Input Level Sensitivity 1) MCS0 (PER < 10%) - -89 - dBm 2) MCS1 (PER < 10%) - -87 - dBm 3) MCS2 (PER < 10%) - -85 - dBm 4) MCS3 (PER < 10%) - -83 - dBm 5) MCS4 (PER < 10%) - -79 - dBm 6) MCS5 (PER < 10%) - -75 - dBm 7) MCS6 (PER < 10%) - -73 - dBm 8) MCS7 (PER < 10%) - -72 - dBm 6. Maximum Input Level (PER < 10%) -30 - - dBm - RX Characteristics - Min. Typ. Max. Unit FCC(30MHz- 1GHz) - - -41.3 dBm FCC Average(1GHz – 12.75GHz) - - -41.3 dBm
COMPANY CONFIDENTIAL 3.5 Bluetooth Standard Specifications Bluetooth Core Specification version 4.0: Host interface: UART, baud rates up to 4Mbps Support all Bluetooth 4.0+HS packet types. Operating frequency range: 2400MHz ~2483.5MHz Modulation type: Basic rate 1Mbps: GFSK, Enhanced data rate 2Mbps: DQPSK Enhanced data rate 3Mbps: 8DPSK Remark: BT power level can be changed according to customer’s request by modifying hcd file. 3.6 LGA Pin Definition Bottom View Pin No. Pin Name Type Description C10 ANT_MAIN_LGA I/O Reserved LGA pin for connecting main antenna on mother board F10 ANT_AUX_LGA I/O Reserved LGA pin for connecting aux antenna on mother board E4 UART_CTS_N I UART clear to Send, active low (for BT data) E5 UART_RTS_N O UART request to Send, active low (for BT data) E6 UART_RXD I UART signal input E7 UART_TXD O UART signal output F3 VBAT_3.3V_L I Main power supply for the module, (3.3V+/-10%, together with pin J9 to supply the module ), reserve 500mA current consumption for this pin, need external 10uF decoupling cap F8 BT_GPIO1_HOSTWAKE O Signal from module to host to require Host wake up Items Contents Specification BT4.0+EDR Frequency range 2.4G~2.4835G Data rate 1Mbps, 2Mbps, 3Mbps - TX Characteristics - Min. Typ. Max. Unit 1. Power Levels BT Output Power 0 2 4 dBm 2. Minimum Input Level Sensitivity GFSK (1Mbps) - -88 - dBm DQPSK (2Mbps) - -91 - dBm 8DPSK (3Mbps) - -85 - dBm
COMPANY CONFIDENTIAL G9 BT_RST_N I External reset for BT, active low, please pull-up on host side (not left floating) G7 SDIO_SPI_SEL I Host interface mode selection, internal pull down, work with SDIO_DATA_1 and SDIO_DATA_2 together to set SDIO interface, if use SDIO, then simply pull this pin low via a 10Kohm. G6 WLAN LED O Reserve for wireless status indicator connect to WL_GPIO_1 of BCM4330 G8 BT_GPIO0_BTWAKE I BT wake up, signal from the host to module to require BT device wake-up or remain awake H9 BT_CLK_REQ_OUT O BT/WLAN reference clock request out, active high, need an external 100kohm pull-down resistor to ensure the signal is deasserted when BCM43330 powers up H5 GPIO0_WL_HOST_WAKE O Signal from WLAN device to awake the host. H8 LPO I 32.768kHz LPO clock, need for device auto frequency detection J4 BT_PCM_IN I PCM data input J5 BT_PCM_OUT O PCM data output J7 SDIO_DATA3 I/O SDIO data line 3 J8 BT_REG_ON I Power up or power down BCM4330 internal regulators used for BT, Logic high level: 1.08V~3.6V Need pull-up via a 10Kohm resistor or less (inertnal 200K pull-down) J9 VBAT_3.3V_R I Main power supply for the module, (3.3V+/-10%, together with pin F3 to supply the module ), please consider reserve for 500mA current consumption, external 10uF decoupling cap. J10 WL_REG_ON I Power up or power down BCm4330 internal regulators used for WLAN, this pin is also a low active reset for WLAN only (not for BT) Logic high level: 1.08V~3.6V Need pull-up via a 10Kohm resistor or less (inertnal 200K pull-down) K3 BT_PCM_CLK I PCM Clock K4 BT_PCM_SYNC I/O PCM sync signal K5 VIO_1.8V I VDDIO for BCM4330 I/O supply, range from 1.2V~2.9V, select 1.8V here, please consider reserve for 200mA current consumption K6 SDIO_DATA2 I/O SDIO data line 2 K7 SDIO_DATA0 I/O SDIO data line 0 K8 SDIO_CMD I/O SDIO command K9 SDIO_CLK I SDIO clock
COMPANY CONFIDENTIAL K10 SDIO_DATA1 I/O SDIO data line 1 A2,A3,A4,A5,A6,A7,A8,A9,A10,B1,B2,B3,B4,B5,B6,B7,B8,B9,B10,C1,C2,C3,C4,C5,C6,C7,C8,C9,D1,D2,D3,D4,D5,D6,D7,D8,D9,D10,E1,E2,E3,E8,E9,E10,F1,F2,F4,F5,F6,F7,F9,G1,G2,G3,G4,G5,G10,H1,H2,H3,H4,H6,H7,H10,J1,J2,J3,J6,K1,K2, GND Ground 4. Software Requirement  Nvram file for RF parameters configuration.  If use dual-band WLAN, platform need to load dual-band firmware and install dual-band driver.  If use single-band WLAN, platform need to load single-band firmware and install single-band driver. 5. Regulatory TBD 6. Environmental Requirements and Specifications 6.1 Temperature 9.1.1 Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0 °C to +70°C. 9.1.2 Non-Operating Temperature Conditions Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -10°C to +85°C. 6.2 PCB bending The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly customer.
COMPANY CONFIDENTIAL 6.3 Handling environment 6.3.1. ESD The product ESD immunity is HBM>= +/- 450 (V), MM >= +/- 100 (V). Please handle it under ESD protection environment. Note: HBM: Human Body Model/MM: Mechanical Model 6.3.2. Terminals The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering, please do not touch LGA portion by hand. 6.3.3. Falling It will cause damage on the mounted components when the product is falling or receiving drop shock. It may cause the product mal-function. 6.4 Storage Condition 6.4.1 Moisture barrier bag before opened Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. 6.4.2. Moisture barrier bag open Humidity indicator cards must be blue, <30%. 6.5 Baking Condition Products require baking before mounting if a) humidity indicator cards reads >30% b) temp <30 degree C, humidity < 70% RH, over 96 hours Baking condition: 90 degree C, 12-22 hours Baking times: 1 time 6.6 Soldering and reflow condition 1) Heating method Conventional Convection or IR/convection 2) Temperature measurement Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method. 3) Solder paste composition Sn/3.0Ag/0.5Cu 4) Allowable reflow soldering times: 2 times based on the below reflow soldering profile 5) Temperature profile Reflow soldering shall be done according to the below temperature profile. 6) Peak temp: 245 degree C
COMPANY CONFIDENTIAL Temperature profile for evaluation of solder heat resistance of a component (at solder joint)
COMPANY CONFIDENTIAL FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment. Operation on the 5.15-5.25GHz frequency band is restricted to indoor use only. The device marketed to the US/Canada is firmware limited to operate only on channel 1~11. RF Exposure Information This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of §2.1091. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, must not be collocated or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter product procedures. The end user has no manual instructions to remove or install the device and a separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. Maximum antenna gain allowed for use with this device is 2.5 dBi for 2.4GHz, 2.48dBi for 5GHz. When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: HLZ-T77H389”.
COMPANY CONFIDENTIAL IC Regulations: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement." This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than that required for successful communication. This device has been designed to operate with an antenna having a maximum gain of 2.5 dBi for 2.4GHz, 2.48dBi for 5GHz.. When the module is installed in the host device, the IC label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains IC: 1754F-T77H389”. Antenna having a higher gain is strictly prohibited per regulations of Industry Canada. The required antenna impedance is 50 ohms. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. The County Code Selection feature is disabled for products marketed in the US/Canada The device for the band 5150-5250 MHz is only for indoor usage to reduce potential for harmful interference to co-channel mobile satellite systems; the maximum antenna gain permitted (for devices in the bands 5250-5350 MHz and 5470-5725 MHz) to comply with the e.i.r.p. limit; and The maximum antenna gain permitted (for devices in the band 5725-5850 MHz) to comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate, as stated in section A9.2(3). In addition, High-power radars are allocated as primary users (meaning they have priority) of the band 5250-5350 MHz and this radar could cause interference and/or damage to LE-LAN devices. IMPORTANT NOTE: IC Radiation Exposure Statement: This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
COMPANY CONFIDENTIAL R&TTE Regulation: In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. The maximum antenna gain is 2.5 dBi for 2.4GHz, 2.48dBi for 5GHz. and the antenna separation distance is 20cm. The maximum ambient temperature for operating will not be higher than 70 ˚C. This equipment may be operated in: AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT IS LI LT LU LV MT NL NO PL PT RO SE SI SK TR

Navigation menu