Anaren A16020401 2400-2500 MHz Transceiver User Manual A43364 Users Manual 1631a 0810
Anaren, Inc. 2400-2500 MHz Transceiver A43364 Users Manual 1631a 0810
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A43364_Users_Manual_1631a 0810.pdf
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Anaren AIR for WICED A43364 Wi-Fi Module Series User’s Manual www.anaren.com/air 800-411-6596 AIR@anaren.com This page intentionally left blank. Table of Contents 1. Overview 1.1. A43364A 1.2. A43364C 1.3. A43364x Features and Beneits 1.4. Theory of Operation 1.5. Applications 2. Approvals and Usage 2.1. Product Approvals 2.1.1. U.S.: Federal Communications Commission (FCC) 2.1.1.1. FCC Labeling Requirements 2.1.1.2. End User Manual 2.1.1.3. RF Exposure 2.1.2. Canada: Industry Canada (IC) 2.1.2.1. IC Labeling Requirements 2.1.2.2. RF Exposure 2.1.3. Europe: Conformité Européenne (CE) 2.2. Potential Interference Sources 2.2.1. WLAN 2.2.2. Classic Bluetooth® 2.2.3. Microwave Ovens 2.2.4. Other Interference 2.3. Approved Usage 2.3.1. U.S. and Canada 2.3.2. Europe 3. Electrical Characteristics 3.1. Absolute Maximum Ratings 3.2. Operating Conditions 3.3. Digital I/O Characteristics 3.4. Pinout 3.5. Pin Description 3.5.1. Internal Connections Between the Radio and the Microcontroller 3.6. Recommended Layout 3.6.1. Module Usage Guidelines 3.7. Radio Module Details 3.7.1. A43364A 3.7.2. A43364C 3.8. Packaging Details 3.8.1. Matrix Tray Packaging 3.8.2. Tape-Reel Packaging 3.9. Soldering 3.9.1. Manual Mounting Procedure 3.9.2. Automated Mounting 11 13 13 13 14 14 15 16 17 17 18 18 18 19 19 19 20 20 20 1. Overview Anaren AIR for WICED Wi-Fi A43364x modules are based on the BCM43364 chipset from Cypress. They are surface-mounted 2.4GHz radio frequency (RF) transceivers incorporating Wi-Fi technology that conforms to the WLAN IEEE 802.11b/g/n. The BCM43364 chipset integrates an ARM® Cortex®-M3 processor and on-chip memory for complete WLAN subsystem functionality, minimizing the need to wake up the applications processor for standard WLAN functions. All control lines are provided at the module level for full control of the operation. Also incorporated in the modules are a STMicroelectronics STM32F412 ARM Cortex-M4-based microcontroller, two 26MHz crystals (one for the radio and the other for the microcontroller), the required RF matching and iltering for regulatory compliance, and iltering for noise reduction and sensitivity. The module is available in two variations: A43364A and A43364C. The A43364A has an integral antenna, and the A43364C uses an external antenna through a U.FL connector. Each module measures 11mm x 19mm x 2.5mm, and are footprint compatible with each other. The A43364x modules have received regulatory approvals for full modular devices in the United States (FCC), Canada (IC), and Europe (ETSI). The modular approval allows the end user to place either an A43364A or an A43364C with an approved antenna inside a inished product without having to perform costly regulatory testing for an intentional RF radiator. Section 2.3. Approved Usage has information on the requirements for the end user/integrator to fulill in order to use the modules without intentional radiator regulatory testing. 1.1. A43364A The A43364A module has an integral antenna, providing high eficiency and near-omni-directional radiation pattern. This approach offers the lowest system cost when the application allows collocation of the radio and antenna. See Figure 6 and Figure 7 for more information on antenna location and enclosure considerations. 1.2. A43364C The A43364C module has a compact antenna connector that allows for locating the antenna away from the module due to form or function, or in order to exit a metal enclosure. See Table 1 for a list of approved antennas. 1.3. A43364x Features and Beneits Features: • Single-band 802.11b/g/n with complete Wi-Fi functionality • Operating voltage: VDD = 3.0V to 4.8V (powers the radio core), VDDIO = 1.8V to 3.6V (powers MCU and radio I/O), VBAT = 1.65V to 3.6V (powers MCU’s RTC, 32kHz oscillator, and backup registers) • Operating temperature: -30°C to +85°C* • BCM43364 chipset with integrated ARM Cortex-M3 processor and on-chip memory for complete WLAN subsystem functionality • STM32F412 ARM Cortex-M4-based microcontroller with 1MB Flash and 256KB SRAM • Output power: FCC compliant up to +24.3dBm, ETSI compliant up to +19.9dBm • 37 GPIO pins available • Interfaces include: UART, SPI, I2S, I2C, USB, CAN, JTAG, ADC, PWM and GPIO • Support for secure OTA • RoHS compliant • Shielded package • LGA footprint • Small package size: 11mm x 19mm x 2.5mm • Approximate weight: 0.8 grams *Module might have degraded performance below -10°C and above +55°C due to crystal and/or chipset speciications. 1. Overview Beneits: • • • • • • 100% RF tested in production for repeatable performance Minimal RF and protocol experience necessary Only requires a two-layer host PCB implementation FCC 15.247, IC RSS-210, and IC RSS-Gen certiied Compliant with ETSI EN 300 328 V1.9.1 No regulatory “intentional radiator” testing required, and simple certiication labeling can be used for integrating the module into an end product (end product testing is still required) 1.4. Theory of Operation The A43364x module operates in the global 2.4 GHz ISM/SRD frequency band. It can be used to implement a variety of networks, including point-to-point, point-to-multi-point, and peer-to-peer. Figure 1 below shows the functionality of A43364x module. Both modules operate in a similar manner with the exception of the antenna—the A43364A communicates through a built-in antenna, and the A43364C communicates through an external antenna attached to a U.FL antenna port. Figure 1: The functionality of the A43364x module, using an internal antenna or U.FL connector. 1. Overview The description of the functional blocks shown in Figure 1 is given as follows: • Antenna: The antenna couples energy between the air and the module. The integral antenna and the external monopole antenna—both centered at 2441.75 MHz—provide a near-omni-directional antenna pattern with high eficiency, such that the application will work in any direction. The end radiation pattern of the antenna depends on the ground plane, enclosure, and installation environment. • Matching and Filtering: The matching provides the correct loading of the transmit ampliier to achieve the highest output power and the correct loading for the receive LNA to achieve the best sensitivity. Filtering removes spurious signals to comply with regulatory requirements, provides reduced susceptibility to power supply and digital noise, and ilters out RF and high-frequency noise from the communication data and control link. • TX/RX Chain: The TX/RX chain handles transmitting and receiving of the communication data based on the radio register settings. It involves the coordination of several blocks, including the modulator, demodulator, AGC control, frequency synthesizer, and frame control. • Crystal: The crystal oscillator provides the necessary clock reference for the entire module operation. The A43364x modules use two 26 MHz crystals: one for the radio and one for the microcontroller. • Power Management: Power management ensures a stable supply for the internal functions, as well as providing means for a low-power sleep mode. Item Part Number Manufacturer Type Gain (dBi) Integral part of A43364A Anaren Integral antenna 66089-2406 Anaren Monopole whip, 6mm lead 66089-2430 Anaren Monopole whip, 30mm lead Table 1: 1 Approved Antennas 1.5. Applications • • • • • • • • Home and building automation Lighting systems Wireless sensor networks Sports monitoring Health and wellness Cloud connectivity Access control Industrial control and monitoring 2. Approvals and Usage A43364x modules meet many national regulations for worldwide Industrial Scientiic and Medical (ISM) radio bands use. In particular, the modules have been certiied to the following standards listed in this section. 2.1. Product Approvals 2.1.1. U.S.: Federal Communications Commission (FCC) A43364x modules have been tested to comply with the FCC CFR47 Part 15 subpart C “Intentional Radiators” standard and Part 15 subpart B. The modules meet the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407 released on June 26, 2000. The modular transmitter approval eliminates the need to re-perform costly intentional radiator testing when submitting an end product for certiication. (15.19a3) The A43364x modules comply with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modiications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 2.1.1.1. FCC Labeling Requirements The A43364x modules have been labeled with their own FCC identiication number (ID), and if the FCC ID is not visible when the module is installed inside another device, then the outside of the inished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: X7J-A16020401 -orContains FCC ID: X7J-A16020401 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 2.1.1.2. End User Manual The end user manual should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 2. Approvals and Usage 2.1.1.3. RF Exposure All transmitters regulated by the FCC must comply with RF exposure requirements. OET Bulletin 65: Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields provides assistance in determining whether proposed or existing transmitting facilities, operations, or devices comply with limits for human exposure to RF ields adopted by the FCC. The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance: To satisfy FCC requirements the antenna used with this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except as permitted by FCC multi-transmitter procedures. The A43364 module is intended for use in mobile devices located at a distance greater than 20cm away from the body. 2.1.2. Canada: Industry Canada (IC) A43364x modules have been certiied for use in Canada under IC Radio Standards Speciication (RSS) RSS210 and RSS-Gen. From section 3.2 RSS-Gen, Issue 3, December 2010, Modular Approval for Category I Equipment or Category II Equipment: Modular approval permits the installation of the same module in a host device or multiple host devices without the need to recertify the device. Equipment certiication for a modular device may be sought for either Category I equipment or Category II equipment. Transmitters designed as modules for the installation in a host device may obtain equipment certiication as a modular device provided that the applicable RSS is met and the following conditions in this section are met. In section 7.1.2 Transmitter Antenna, it has been mentioned that the user manuals for transmitters shall display the following notice in a visible location: Notice: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Avis: Sous la réglementation d’Industrie Canada, ce transmetteur radio ne peut fonctionner qu’en utilisant seulement une antenne d’un type et d’un maximum (ou moins) de gain approuvé pour l’émetteur par Industrie Canada. Pour réduire des potentielles interférences radio pour les autres utilisateurs, le type d’antenne et son gain doivent être choisis de sorte que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pas ce qui est nécessaire pour une communication réussie. In section 7.1.2 Transmitter Antenna, it has been mentioned that the user manuals for transmitters equipped with detachable antennas shall also contain the following notice in a visible location: 2. Approvals and Usage Notice: This radio transmitter (IC: 8975A-A16020401) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Avis: Cet émetteur radio (IC: 8975A-A16020401) a été approuvé par Industrie Canada pour fonctionner avec les types d’antennes énumérés ci-dessous avec le gain maximal admissible et l’impédance d’antenne requise pour chaque type d’antenne indiqué. Les types d’antennes ne igurant pas dans cette liste, ayant un gain supérieur au gain maximal indiqué pour ce type, sont strictement interdits pour l’utilisation avec cet appareil. Item Part Number Manufacturer Type Gain (dBi) Numéro d’article Référence Fabricant Catégorie Gain Integral part of A43364A Partie intégrante de A43364A Anaren 66089-2406 Anaren 66089-2430 Anaren Integral antenna Antenne intégrée Monopole whip, 6mm lead Antenne monopôle, longueur 6mm Monopole whip, 30mm lead Antenne monopôle, longueur 30mm 2.1.2.1. IC Labeling Requirements From section 3.2.1 RSS-Gen, Issue 3, December 2010, Labeling Requirements for the Host Device: The host device shall be properly labeled to identify the modules within the host device. The Industry Canada certiication label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certiication number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning. From section 5.2, RSS-Gen, Issue 3, December 2010, Equipment Certiication Numbers and Labels: Every unit of Category I radio apparatus certiied for marketing and use in Canada shall bear a permanent label on which is indelibly displayed the model number and Industry Canada certiication number of the equipment model (transmitter, receiver, or inseparable combination thereof). Each model shall be identiied by a unique combination of a model number and a certiication number, which are assigned as described below in this section. The label shall be securely afixed to a permanently attached part of the device, in a location where it is visible or easily accessible to the user, and shall not be readily detachable. The label shall be suficiently durable to remain fully legible and intact on the device in all normal conditions of use throughout the device’s expected lifetime. These requirements may be met either by a separate label or nameplate permanently attached to the device or by permanently imprinting or impressing the label directly onto the device. The label text shall be legible without the aid of magniication, but is not required to be larger than 8-point font size. If the device is too small to meet this condition, the label information may be included in the user manual upon agreement with Industry Canada. Section 5.2 continues: 2. Approvals and Usage The model number is assigned by the applicant and shall be unique to each model of radio apparatus under that applicant’s responsibility. The model number shall be displayed on the label preceded by the text: “Model:”, so it appears as follows: Model: model number assigned by applicant Label: Contains/Contient IC: 8975A- A16020401 Notice: This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Avis: Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d’interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif. From section 7.1.4, RSS-Gen, Issue 3, December 2010, Radio Apparatus Containing Digital Circuits (ICES-003): Radio apparatus containing digital circuitry which can function separately from the operation of a transmitter or an associated transmitter, shall comply with ICES-003. In such cases, the labeling requirements of the applicable RSS apply, rather than the labelling requirements in ICES-003. For more information, visit the Industry Canada website at www.ic.gc.ca. 2.1.2.2. RF Exposure All transmitters regulated by IC must comply with RF exposure limits as set forth in RSS-102, Issue 4, Section 4, Exposure Limits. Furthermore RSS-102, Issue 4, Section 2 Certiication Requirements provides assistance in determining the speciic requirements for compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of IC RF exposure compliance: Notice: To satisfy Industry Canada requirements the antenna used with this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except as permitted by Industry Canada’s multi-transmitter procedures. The A43364 module is intended for use in mobile devices located at a distance greater than 20cm away from the body. Avis: Pour satisfaire aux exigences d’Industrie Canada l’antenne utilisée avec cet émetteur ne doit pas être colocalisée ni de fonctionner en conjonction avec une autre antenne ou un autre émetteur, sauf dans la mesure permise par les procédures multi-émetteurs de l’Industrie Canada. Le module A43336 est destiné pour être utilisé dans des appareils mobiles situés ӑ une distance supérieure 20cm éloigné du corps. 2. Approvals and Usage 2.1.3. Europe: Conformité Européenne (CE) A43364x modules have been certiied for use in European countries covered by ETSI regulations. The following tests have been performed and the module has been found to be compliant to the requirements: • Test standard ETSI EN 300 328 V1.9.1 (2015-02) 9 Maximum isotropic radiated power (normal and extreme conditions) 9 Maximum E.I.R.P. spectral density 9 Frequency range (normal and extreme conditions) 9 Transmitter spurious emissions 9 Receiver spurious emissions 9 Electro-static discharge and RF immunity (ETSI EN 301 489-17) 9 RF exposure (ETSI EN 62311:2008) 9 Safety (IEC 60950-1:2005 and EN 60950-1:2006) A helpful document that can be a starting point in understanding the use of short range devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which is downloadable from the European Radio Communications Ofice (ERO) at www.ero.dk. The end user is responsible for ensuring compliance with harmonized frequencies and labeling requirements for each country the end device is marketed and sold. For more information, see: • Radio And Telecommunications Terminal Equipment (R&TTE): ec.europa.eu/enterprise/rtte/index_en.htm • European Conference of Postal and Telecommunications Administrations (CEPT): www.cept.org/ • European Telecommunications Standards Institute (ETSI): www.etsi.org/ • European Radio Communications Ofice (ERO): www.ero.dk/ 2.2. Potential Interference Sources A43364x modules operate in the unlicensed ISM band, in which there are many other applications (e.g. WLAN, Classic Bluetooth, Bluetooth Low Energy, and microwave ovens). This can cause interference that may, in certain conditions, prohibit radio communication. Some of the most common interferences are listed below. 2.2.1. WLAN Wireless local area networks (WLAN) are divided into a number of overlapping channels. Figure 3 below shows the channels used by WLAN; for the U.S. and Canada, only channels 1-13 may be used. Predominantly, channels 1, 6, and 11 are used to achieve non-overlapping channels. The user is therefore encouraged to select unused WLAN channels in their respective environment. Figure 3: WLAN Channels 2. Approvals and Usage 2.2.2. Classic Bluetooth® Classic Bluetooth divides the 2.402-2.480 GHz band into 79 channels, each of which is 1MHz wide. However, since Bluetooth changes channels rapidly (up to 1600 times a second), it is unlikely to cause continuous interference in a speciic channel and can be overcome by implementing a simple acknowledge/retransmit functionality. 2.2.3. Microwave Ovens A typical microwave oven uses a self-oscillating magnetron with a duty cycle below 50%, because the tube is completely off for half of every alternating current (AC) mains cycle (8.33 ms in 60 Hz countries and 10 ms in 50 Hz countries). The frequency of the microwave oven changes cyclically within each AC mains synchronized on period, and is generally not predictable. The user is encouraged to have packet transmission durations less than half the AC mains period and implement an acknowledge/retransmit method. 2.2.4. Other Interference Systems similar to the user’s system may also exist within range and may also be a source of interference. Some typical applications to consider include the following: • Alarm systems: These typically use low duty cycles and are therefore easy to avoid using acknowledge/ retransmit methods • Car alarms (internal motion sensors) • Video surveillance: These are operated on a ixed channel (determined during installation) and can be avoided by using clear channel assessment. It may be useful to change the channel used by the video surveillance equipment. 2.3. Approved Usage A43364x modules have been approved for use in the U.S., Canada, and Europe. The user is encouraged to use minimum power required to establish a link, thus minimizing interference. Changes or modiications to the module and/or operation outside the limits are prohibited and could void the user’s authority to operate the modules. 2.3.1. U.S. and Canada Within the U.S. and Canada, A43364x modules have been approved for use as digitally-modulated transmitters, for which they conform to the bandwidth (a minimum of 500 kHz 6-dB bandwidth for U.S., a maximum bandwidth of 0.5% of the carrier frequency for Canada), power spectral density (max of 8 dBm / 3 kHz), total output power (max of 1W including the antenna gain) and spurious radiation (harmonics and others including the restricted bands) requirements. Table 2 shows approved frequencies of operations with the corresponding maximum output power values. These modules must be operated at or below the indicated power levels. Using the modules with higher power levels are prohibited, and will void the user’s authority to operate the modules under current FCC/IC certiication. 2. Approvals and Usage 10 A43364A with internal antenna (2dBi gain): 802.11b CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 Power Level Index (set in software) 13 16 22 26 Measured Output Power (dBm) 22.6 22.9 23.9 24.3 24.3 24.3 23.6 21.6 21.1 19.8 18.9 802.11g CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 Power Level Index (set in software) 17 23 29 Measured Output Power (dBm) 20.0 21.7 21.9 22.2 22.2 22.2 21.6 20.1 18.2 16.5 15.2 802.11n CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 Power Level Index (set in software) 17 23 30 Measured Output Power (dBm) 19.7 21.3 21.9 22.0 22.0 22.0 21.2 19.6 18.0 16.5 14.9 A43364C with external antenna (3dBi gain): 802.11b CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 Power Level Index (set in software) 14 12 14 16 Measured Output Power (dBm) 21.1 21.9 23.3 23.4 24.0 24.3 23.8 23.3 23.3 21.6 21.3 802.11g CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 Power Level Index (set in software) 11 11 20 Measured Output Power (dBm) 19.1 20.5 21.8 22.0 22.2 22.2 22.1 22.0 20.5 19.7 17.4 802.11n CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 Power Level Index (set in software) 14 14 22 Measured Output Power (dBm) 18.0 20.5 21.1 21.9 22.0 22.0 21.9 21.6 20.6 18.8 16.9 Table 2: Approved Power Levels for FCC/IC 2. Approvals and Usage 11 Mode 802.11b 802.11g 802.11n Data Rate Peak TX Current (mA) 1 Mbps 560 11 Mbps 555 6 Mbps 420 54 Mbps 370 MCS0 415 MCS7 415 Table 3: A43364 Module Peak TX Current Consumption Please note that the speciied current consumption numbers are for radio operation only and do not include other MCU peripherals. 2.3.2. Europe For Europe, the maximum allowed output power is 20dBm with a spectral power density limit of 10dBm/MHz. A43364x modules comply with the power spectral density requirements at the power level shown in Table 4. A43364A with internal antenna (2dBi gain): 802.11b Power Level Index (set in software) EIRP (dBm) CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 39 41 41 41 41 41 43 43 43 43 43 17.2 17.0 17.0 17.0 17.0 17.0 17.0 17.0 17.0 17.0 17.0 802.11g Power Level Index (set in software) EIRP(dBm) CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 26 28 28 28 28 28 30 30 30 30 30 17.2 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 802.11n Power Level Index (set in software) EIRP (dBm) CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 26 28 28 28 28 28 30 30 30 30 30 17.1 17.0 17.0 17.0 17.0 17.0 16.9 16.9 16.9 16.9 16.9 Table 4: Approved Power Levels for ETSI 2. Approvals and Usage 12 A43364C with external antenna (3dBi gain): 802.11b Power Level Index (set in software) EIRP (dBm) CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 43 45 45 45 45 45 47 47 47 47 47 17.4 17.0 17.0 17.0 17.0 17.0 17.1 17.1 17.1 17.1 17.1 802.11g Power Level Index (set in software) EIRP(dBm) CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 30 32 32 32 32 32 34 34 34 34 34 17.2 17.1 17.1 17.1 17.1 17.1 17.0 17.0 17.0 17.0 17.0 802.11n Power Level Index (set in software) EIRP (dBm) CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 30 32 32 32 32 32 33 33 33 33 33 17.0 16.9 16.9 16.9 16.9 16.9 17.1 17.1 17.1 17.1 17.1 Table 4: Approved Power Levels for ETSI 3. Electrical Characteristics 13 3.1. Absolute Maximum Ratings Under no circumstances shall the absolute maximum ratings given in Table 5 be violated. Stress exceeding one or more of the limiting values or exposure to maximum rating conditions for extended periods may cause permanent damage to the device. Functional operation of the device at these conditions is not implied. Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. Parameter Storage temperature VDD supply voltage with respect to GND Min Max Unit -40 +125 °C -0.5 6.0 -0.3 4.0 -0.3 4.0 -0.3 4.0 -0.5 3.9 ESD (HBM) N/A 1250 ESD (CDM) N/A 300 VDDIO supply voltage with respect to GND VBAT supply voltage with respect to GND VIN with respect to GND (except GPIO_1, GPIO_2, GPIO_3, and GPIO4) VIN with respect to GND (GPIO_1, GPIO_2, GPIO_3, and GPIO_4) Caution! This assembly contains moisture sensitive devices and requires proper handling per IPC/JEDEC J-STD-033. Comments The maximum continuous voltage is 4.8V. Voltages as high as 5.0V for up to 250 seconds or as high as 6.0V for up to 10 seconds are allowed. Duration is cumulative over the lifetime of the device. Undershoot/overshoot not to exceed 25% of the duty cycle at VIN + 0.5V. Human body model contact discharge per JEDEC EID/ JESD22-A114. Charged device model contact discharge per JEDEC EIA/ JESD22-C101. Table 5: Absolute Maximum Ratings 3.2. Operating Conditions Parameter Min Max Unit Comments Ambient temperature -30 +85 °C Speciications require derating below -10°C and above +55°C. VDD supply voltage 3.0 4.8 Speciications require derating below 3.2V. VDDIO supply voltage 1.8 3.6 VBAT supply voltage 1.65 3.6 Table 6: Operating Conditions 3. Electrical Characteristics 14 3.3. Digital I/O Characteristics Parameter Min Max Unit VIL (except GPIO_1, GPIO_2, GPIO_3, GPIO4) TBD VIL (GPIO_1, GPIO_2, GPIO_3, GPIO4) 0.35xVDDIO 0.8 TBD 0.65xVDDIO 2.0 TBD 0.45 0.4 TBD VDDIO-0.45 VDDIO-0.4 VIH (except GPIO_1, GPIO_2, GPIO_3, GPIO4) VIH (GPIO_1, GPIO_2, GPIO_3, GPIO4) VOL (except GPIO_1, GPIO_2, GPIO_3, GPIO4) VOL (GPIO_1, GPIO_2, GPIO_3, GPIO4) VOH (except GPIO_1, GPIO_2, GPIO_3, GPIO4) VOH (GPIO_1, GPIO_2, GPIO_3, GPIO4) Comments VDDIO=1.8V VDDIO=3.3V VDDIO=1.8V VDDIO=3.3V VDDIO=1.8V IIO=+2mA VDDIO=3.3V IIO=+2mA VDDIO=1.8V IIO=+2mA VDDIO=3.3V IIO=+2mA Table 7: Digital I/O Characteristics 3.4. Pinout The A43364A and A43364C modules share a common pinout and footprint, thus enabling the use of the same application PCB layout for both. Below the pinout is shown: Where applicable: • NC = “No Connection” Pin is not connected internally. • DNC = “Do Not Connect” Pin reserved for internal use; ensure mating footprint pads are isolated. • GND = “Ground” Connect the maximum number possible (minimum one for proper operation). • TGND = “Thermal Ground” Connect to ground plane on PCB for optimal heat conduction out of the module. Figure 4: A43364x Module Pinout (viewed from top side) 3. Electrical Characteristics 15 3.5. Pin Description Pin Name Function GPIO DNC GND PB3/JTDO-SWO GPIO PB4/JTRST GPIO PA16/JTDI GPIO PA14/JTCK-SWCLK GPIO PA13/JTMS-SWDIO GPIO PA12 GPIO PA11 GPIO UART USART1_RX USART1_TX SPI SPI1_SCK SPI3_SCK SPI1_MISO SPI3_MISO SPI1_NSS SPI3_NSS I2S I2S1_CK I2S3_CK I 2C CAN USB ADC I2C2_SDA I2C4_SDA Timer Other TIM2_CH2 JTDO/TRACESWO I2S3ext_SD I2C3_SDA TIM3_CH1 JTRST I2S1_WS I2S3_WS TIM2_CH1 TIM2_ETR JTDI JTCK/SWCLK JTMS/SWDIO USART1_RTS SPI5_MISO USART6_RX USART1_CTS SPI4_MISO USART6_TX CAN1_TX USB_FS_DP TIM1_ETR CAN1_RX USB_FS_DM TIM1_CH4 10 PA10 GPIO USART1_RX USB_FS_ID TIM1_CH3 11 PA9 GPIO USART1_TX SPI5_MOSI I2S5_SD I2C3_SMBA USB_FS_VBUS TIM1_CH2 12 PA8 GPIO USART1_CK I2C3_SCL USB_FS_SOF 13 PB15 GPIO SPI2_MOSI I2S2_SD 14 PB14 GPIO USART3_RTS SPI2_MISO I2S2ext_SD I2C4_SDA 15 PB13 GPIO USART3_CTS 16 PB12 GPIO USART3_CK 17 PC5 GPIO USART3_RX 18 GND 19 PB10 GPIO USART3_TX 20 PB1 21 SPI2_SCK SPI4_SCK SPI2_NSS SPI3_SCK SPI4_NSS I2S2_CK I2S4_CK I2S2_WS I2S3_CK I2S4_WS TIM1_CH1 TIM1_CH3N TIM8_CH3N TIM12_CH2 TIM1_CH2N TIM8_CH2N TIM12_CH1 I2C4_SCL I2C4_SMBA CAN2_TX TIM1_CH1N I2C2_SMBA CAN2_RX TIM1_BKIN I2C4_SMBA SPI2_SCK I2S2_CK I2S3_MCK I2C2_SCL I2C4_SCL GPIO SPI5_NSS I2S5_WS ADC1_9 PB0 GPIO SPI5_SCK I2S5_CK ADC1_8 22 PA7 GPIO SPI1_MOSI I2S1_SD ADC1_7 23 PA6 GPIO SPI1_MISO I2S2_MCK ADC1_6 24 PA5 GPIO SPI1_SCK I2S1_CK ADC1_5 25 PA4 GPIO USART2_CK SPI1_NSS SPI3_NSS I2S1_WS I2S3_WS ADC1_4 26 PA3 GPIO USART2_RX I2S2_MCK ADC1_3 27 PA2 GPIO USART2_TX I2S2_CKIN ADC1_2 28 PA1 GPIO USART2_RTS SPI4_MOSI I2S4_SD 29 GND TIM2_CH3 ADC1_1 Table 8: A43364x Pin Descriptions with References to Chip Pins TIM1_CH3N TIM3_CH4 TIM8_CH3N TIM1_CH2N TIM3_CH3 TIM8_CH2N TIM1_CH1N TIM3_CH2 TIM8_CH1N TIM14_CH1 TIM1_BKIN TIM3_CH1 TIM8_BKIN TIM13_CH1 TIM2_CH1 TIM2_ETR TIM8_CH1N TIM2_CH4 TIM5_CH4 TIM9_CH2 TIM2_CH3 TIM5_CH3 TIM9_CH1 TIM2_CH2 TIM5_CH2 MCO_1 RTC_50Hz 3. Electrical Characteristics Pin Name 16 Function GPIO 30 PA0 GPIO 31 PC15/OSC32_OUT GPIO 32 PC14/OSC32_IN GPIO UART SPI IS IC CAN USB USART2_CTS ADC ADC1_0 Timer TIM2_CH1 TIM2_ETR TIM5_CH1 TIM8_ETR Other WKUP1 OSC32_OUT OSC32_IN I2C1_SCL I2C3_SDA I2C1_SDA I2C2_SDA 33 PB8 GPIO SPI5_MOSI I2S5_SD 34 PB9 GPIO SPI2_NSS 35 PB7 GPIO USART1_RX I2C1_SDA 36 PB6 GPIO USART1_TX I2C1_SCL 37 PB5 GPIO I2S2_WS SPI1_MOSI I2S1_SD SPI3_MOSI I2S3_SD TIM4_CH3 TIM10_CH1 TIM4_CH4 TIM11_CH1 CAN1_RX CAN1_TX TIM4_CH2 CAN2_TX TIM4_CH1 I2C1_SMBA CAN2_RX TIM3_CH2 38 GPIO_4 BCM43364 GPIO_4 39 GPIO_3 BCM43364 GPIO_3 40 GPIO_2 BCM43364 GPIO_2 41 GPIO_1 BCM43364 GPIO_1 42 VDD 43 VBAT 44 VDDIO 45 GND 46 NRST 47 TGND 48 TGND 49 TGND 50 TGND MCU HW Reset Table 8 (cont.): A43364x Pin Descriptions with References to Chip Pins 3.5.1. Internal Connections Between the Radio and the Microcontroller Pin Name Function GPIO UART SPI I2S I 2C CAN USB ADC Timer Other PC8 BCM43364 SDIO_D0 PC9 BCM43364 SDIO_D1 PC10 BCM43364 SDIO_D2 PC11 BCM43364 SDIO_D3 PC12 BCM43364 SDIO_CLK PD2 BCM43364 SDIO_CMD PC0 BCM43364 GPIO_0/WLAN_HOST_WAKE PC4 BCM43364 WL_REG_ON PC6 BCM43364 LPO_IN PH0/OSC_IN 26MHz XTAL PH1/OSC_OUT 26MHz XTAL Table 9: A43364x Internal Characteristics 3. Electrical Characteristics 17 3.6. Recommended Layout (dimensions in mm) Figure 6: 6 Mounting the Module in a Corner Figure Figure 5: Recommended PCB Footprint Figure Figure 7: 7 Mounting the Module Along an Edge NOTE: The “No GND” area is optional for A43364C modules. It may still be provided for compatibility with the internal antenna version (A43364A). 3.6.1. Module Usage Guidelines The recommended PCB layout is shown in the igures above. • If the design is using the on-module PCB antenna, the antenna’s “No GND Plane” area labeled above needs to be kept clear of copper on all layers to ensure good RF performance. • If the design is using an external antenna via the U.FL connector, it is okay to overlap the antenna area with copper. However, the design with an external antenna needs to meet appropriate regulatory requirements depending on the target geography, such as FCC, IC, MIC/TELEC, etc. Contact Anaren for additional information. In addition to the above guidelines, note the following suggestions: • Place external bypass capacitors as close as possible to the module pins. • To achieve better communication quality, keep metallic objects away from the antenna (either the on-module chip antenna or an external antenna) as much as possible. 3. Electrical Characteristics 3.7. Radio Module Details (dimensions in mm) 3.7.1. A43364A Figure 8: A43364A Dimensions 3.7.2. A43364C Figure 9: A43364C Dimensions 18 3. Electrical Characteristics 19 3.8. Packaging Details (dimensions in mm) A43364x modules are available in either matrix tray or tape-and-reel packaging for high-volume assembly. Details of packaging are provided below. 3.8.1. Matrix Tray Packaging Figure 10: A43364AxxGM and A43364CxxGM Matrix Tray Packaging Detail (27/Tray) 3.8.2. Tape-Reel Packaging Figure 11: A43364AGR and A43364CGR Tape-Reel Packaging Detail (500/Reel) 3. Electrical Characteristics 20 3.9. Soldering A43364x modules may be mounted either manually (for prototyping), or automatically for production. A no-clean tin/silver/copper (SAC) solder is recommended, however, lead-based no-clean pastes may also be used. CAUTION: A43364x modules are designed for no-clean luxes only. DO NOT use water-based luxes that require aqueous cleaning after solder. Spot cleaning with a lux remover and toothbrush may be performed with care. 3.9.1. Manual Mounting Procedure The recommended soldering method is relowing of a paste solder on a hot plate. This method works as long as the bottom of the board (where the module is to be mounted) is accessible, and there are no bottom-side components in the way. An aluminum or copper block may be placed on the hot plate surface to transfer heat to a localized area on the board where the module is mounted. The following instructions demonstrate how to mount the module: 1. Set the hot plate to the relow temperature the solder manufacturer recommends. 2. Apply solder paste to the pads on the board receiving the module. 3. Place the module carefully onto the dispensed solder. 4. Using tweezers or another holding device, carefully place the board holding module onto the hot plate surface (or metal block). 5. Apply heat until relow occurs, per solder paste manufacturer’s recommendations. 6. Carefully remove the board and place it on a heat-resistant surface to cool. 7. Check the assembly electrically to conirm there are no open or short circuits. 3.9.2. Automated Mounting The A43364x module’s recommended solder relow proile is based on IPC/JEDEC J-STD-020. Proile Feature Sn-Pb Eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max 3°C/second max Preheat: • Temperature Min (Tsmin) • Temperature Max (Tsmax) • Time (Tsmin to Tsmax) • 100°C • 150°C • 60-120 seconds • 150°C • 200°C • 60-180 seconds Time maintained above: • Temperature (TL) • Time (tL) • 183°C • 60-120 seconds • 217°C • 60-150 seconds Peak Temperature (Tp) See Table 11 See Table 12 Time within 5°C of actual peak 10-30 seconds temperature (tp)2 20-40 seconds Ramp-down rate 6°C/second max 6°C/second max Time 23°C to peak temperature 6 minutes max 8 minutes max Table 10: Classiication Relow Proiles NOTE 1: All temperatures refer to the top side of the package, measured on the package body surface. NOTE 2: Time within 5°C of actual peak temperature (tp) speciied for the relow proiles is a “supplier” minimum and a “user” maximum. 3. Electrical Characteristics 21 Figure 12: Classiication Relow Proile Volume mm3 ≥350 Volume mm3 <350 Package Thickness <2.5mm 240+0/-5°C 225+0/-5°C ≥2.5mm 225+0/-5°C 225+0/-5°C Table 11: SnPB Eutectic Process - Package Peak Relow Temperatures Package Thickness Volume mm3 <350 Volume mm3 350-2000 Volume mm3 >2000 <2.5mm 260°C* 260°C* 260°C* 1.6mm-2.5mm 260°C* 250°C* 245°C* >2.5mm 250°C* 245°C* 245°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to an including the stated classiication temperature at the rated MSL level. Table 12: Pb-free Process - Package Peak Relow Temperatures Document History Date 22 Author Change Note No./Notes 06/21/16 Subramanian Initial Draft 07/22/16 Chilbert Edited all sections, provided vector images wherever possible 07/26/16 Chilbert Provided additional edits and updated images 08/08/16 Chilbert Updated requirements for RF exposure labels in English and French, adjusted Table 2 and Table 4 for readability and clarity. Attach distributor contact information here If you have additional questions, would like samples, or would like a quote, please contact the Anaren AIR team at AIR@anaren.com For a complete list of our franchised distributors, please visit the Anaren website at: www.anaren.com/air Anaren Microwave, Inc. 6635 Kirkville Road East Syracuse, NY 13057 Tel: +1 315 432 8909 +1 800 411 6596 Fax: +1 315 432 8970 Anaren Microwave (Europe), Inc. 12 Somerset House, Suite 16 & 17 Hussar Court, Waterlooville Hampshire, England P07-7SG Tel: +44 2392 232392 Fax: +44 2392 251369 Anaren Communication Suzhou Co. Ltd. Bldg 3, No. 1 LongHui Street Suzhou Industrial Park Suzhou 215122, PR China Tel: +86 512 6274 9282 Fax: +86 512 6274 9283 1631a www.anaren.com/air 800-411-6596 AIR@anaren.com
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