Bilian Electronic BLR7601MU2 Wireless Module User Manual
Shenzhen Bilian Electronic Co., Ltd. Wireless Module
User manual
BL‐R7601MU2 Product Specification WLAN 11b/g/n USB MODULE Version: 2.0 B‐LINK ELECTRONIC CO., LTD in shenzhen Contents Contents ............................................................................................................................................................1 1:General Description........................................................................................................................................2 2: The range of applying.....................................................................................................................................2 3:Features ..........................................................................................................................................................2 4: Electrical Characteristics………………………………………………………........................................................................3 5: The main performance of product.. ................................................................................................................3 6: DC/RF characteristics.................. ....................................................................................................................4 7: The block diagram of product principle............................................................................................................5 8: The supported platform.............. ....................................................................................................................5 9: The definition of product Pin....... ...................................................................................................................5 10: The Structure and Size of product..................................................................................................................6 11: The 6th Pin connect to antenna, please refer to design demand......................................................................7 12:Tpical Solder Reflow Profil .............................................................................................................................8 B‐LINK ELECTRONIC CO., LTD in shenzhen 1. General Description BL‐R7601MU2 product Accord with FCC CE is a highly integrated Wi‐Fi single chip which supports 150 Mbps PHY rate. It fully complies with IEEE802.11n and IEEE802.11b/g stands, offering feature‐rich wireless connectivity at high standards, and delivering reliable, cost‐effective throughput from an extended distance. Optimized RF architecture and baseband algorithms provide superb performance and lower power consumption. Intelligent MAC design deploys a high efficient DMA engine and hardware data processing accelerators which offloads the host processor. BL‐R7601MU2 is designed to support standard based features in the areas of security quality of service and international regulations, giving end users the greatest performance anytime and in any circumstance. 2. The range of applying Desk‐Top PC; TV; Blue‐ray Disk; Set‐top box 3. Features Feature Power supply Implementation Clock source 40MHz Temperature range VCC_3.3V +‐0.2V Work temperature: ‐20ºC‐‐‐70°C Storage temperature ‐55°C ~ +125°C Package SMT 6 pins ■IEEE 802.11b/g/n client ■Embedded high‐performance 32‐bit RISC microprocessor ■Highly integrated RF with 55nm COMS technology ■1T1R mode with support of 150Mbps PHY rate ■Integrate high efficiency switching regulator ■Best‐in‐class power consumption performance ■IEEE 802.11d/h/k compliant ■Security support for WFA WPA/WPA2 personal, WPS2.0 ,WAPI ■Support 802.11w protected managed frames ■QOS support of WFA,WMM,WMM PS ■Support Wi‐Fi Direct ■Fully compliance with USB v2.0 High‐Speed mode ■Per packet transmit power control ■Antenna diversity ■Auto‐calibration B‐LINK ELECTRONIC CO., LTD in shenzhen 4. Electrical Characteristics Recommended operating rage DC Characteristics 5. The main performance of product Item Description The supported protocol and IEEE 802.11n, IEEE 802.11g, IEEE802.11b standard Interface type USB2.0 The range of frequency 2412 ~ 2462MHz The amount of working 1‐11 Channel Data Modulation OFDM/DBPSK/DQPSK/CCK Infrastructure, Ad‐Hoc Working Mode 135/54/48/36/24/18/12/9/6 /1M(self‐adapting) The transmitting rate DSSS Spread spectrum 54/135M:‐75dBm@10%PER, 11M:‐85dBm@8%PER Sensitivity @PER 6M: ‐88dBm@10%PER , 1M: ‐90dBm@8%PER 135M:15dBM, RF Power 54M:15dBM, 11M:19dBM Throughput 90Mbps B‐LINK ELECTRONIC CO., LTD in shenzhen Type of Antenna LED indicator The transmit distance Working Power consumption MENS(L*W*H) The chipset model Integral Antenna status indicator Indoor 100M, Outdoor 300M, according the local environment 455MW 12.3MM*13MM*1.6MM MT7601 6. DC/RF characteristics Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Frequency 2412 – 2462MHz Data rate 1, 2, 5.5, 11Mbps DC Characteristics min Typ. max. unit TX mode 239 245 249 mA Rx mode 91 92 93 mA Sleep mode 47 48 48 mA Specification : IEEE802.11g Mode OFDM Frequency 2412 ‐ 2462MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min Typ. max. unit TX mode 149 150 153 mA Rx mode 92 93 100 mA Sleep mode 46 48 49 mA Specification : IEEE802.11n Mode OFDM Frequency 2412 ‐ 2462MHz Data rate 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps DC Characteristics min Typ. max. unit TX mode 151 152 153 mA Rx mode 91 92 93 mA Sleep mode 47 48 49 mA 7.The block diagram of product principle B‐LINK ELECTRONIC CO., LTD in shenzhen 8. The supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable 9.The definition of product Pin the front side the back side Top and bottom view of BL‐R7601MU2 Ver1.0 Pin No: TYPE Description B‐LINK ELECTRONIC CO., LTD in shenzhen DC :3.3V I/O UDM‐ I/O UDP+ GND GND ANT 10.The Structure and Size of product 11: The 6th Pin connect to antenna, please refer to design demand B‐LINK ELECTRONIC CO., LTD in shenzhen Connect to the 6th pin of Module Connect to the 5th pin of Module a) The current of 3.3V power supply must be >300mA, its ripple wave must be <30mV. The GND pins of module and external antenna need to be an incorporated part. The ground plane should be larger, module and antenna should keep far away from interference source. b) The sixth pin is 2.4G high frequency output, coplanar impedance of layout line between this pin to antenna interface should be 50Ω, we suggest use arc line or straight line, and beside the line there will be ground plane that its length as shout as possible, the longest length is no more than 50mm. c) L10, C235, C236 constitute a π‐type network that we preset, please make it close to antenna interface, this π‐type network is used to match the antenna parameters and control the radiation. It should be adjusted according to the real condition when being used. Normally you can only mount L1 that its parameters are: 1NH. No need C235 . 12.Tpical Solder Reflow Profile B‐LINK ELECTRONIC CO., LTD in shenzhen B‐LINK ELECTRONIC CO., LTD in shenzhen FCC Warning The devices must be installed and used in strict accordance with the instructions as described in the user documentation that comes with the product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: S8JBLR7601MU2” When the module is installed inside another device, the user manual of this device must contain below warning statements: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This modular could be installed in the fix or mobile devices only, installed in the portable device, like USB dongle is forbidden. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. For manufacturer: The end product into which the module will be installed should be the fix or mobile devices only, the portable device, like USB dongle is forbidden. The end product into which the module will be installed should be installed and operated with a minimum distance of 20 cm between the radiator and user body.
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