CHIPSEA TECHNOLOGIES CSM84F12 WIFI Module CSM84F12 User Manual
CHIPSEA TECHNOLOGIES (SHENZHEN) CORP. WIFI Module CSM84F12 Users Manual
Contents
- 1. Users Manual
- 2. User manual_CSM84F12
- 3. User manual_user RF statement
Users Manual
CSM84F12 IOT Module Data Sheet V1.0 June.2018 1 / 13 聚点滴之芯.成浩瀚之海 Table of Contents 1. Introduction .............................................................................................................................3 1.1 General Description ..........................................................................................................................3 1.2 Hardware Description ......................................................................................................................3 2. System Block Diagram ..............................................................................................................4 3. CSM84F12 Pin-out ....................................................................................................................5 3.1 Pin-out view ......................................................................................................................................5 3.2 CSM84F12 Pin Assignment and Descriptions .................................................................................5 4. Electrical Specifications ..........................................................................................................6 4.1 Absolute Maximum Ratings .............................................................................................................6 4.2 Environmental Ratings .....................................................................................................................7 4.2.1 Storage Condition .................................................................................................................................7 4.3 Thermal Characteristics ...................................................................................................................7 4.4 PMU Under Voltage Lock-out (UVLO) Characteristics ....................................................................8 4.5 Electrostatic Discharge Specifications ............................................................................................8 4.6 Recommended Operating Conditions and DC Characteristics .......................................................8 5. Electrical Specifications...................................................................................................... 10 5.1 Transmitter Characteristics for 2.4GHz Operation ...................................................................... 10 5.2 Receiver Characteristics for 2.4GHz Operation ............................................................................ 11 6. System Power Consumption............................................................................................... 11 7. Soldering Recommendations ................................................................................................. 11 Appendix A: HW Reference Design ...................................................................................................... 13 2 / 13 聚点滴之芯.成浩瀚之海 1. Introduction 1.1 General Description The CSM84F12 module is an intelligent Internet of Everything platform enables customers to add Wi-Fi to a wide variety of products with minimal development effort and cost. 1.2 Hardware Description CST84F11+CSE7761 Size: 18 x 18 x 3.5mm±0.1mm Operating voltage: 3.3 V ± 5% 16Mbit flash 192KB SRAM Support FlyOS FlyLink RF interface Internal PIFA antenna Operating temperature range: Commercial: -20°C ~ +85°C Power consumption Transmit: 290 mA @18dBm Receive: TBD Standby mode (Sleep): TBD Deep sleep: TBD Package: Golden Finger: 18 PADs Host interface: GPIO X 12,UART, SPI,UART, PWM WiFi mode support: Station Soft AP Station + Soft AP Active Power Accuracy: ±0.1% error of Reading over 8000:1 Dynamic Range. Voltage and Current Active Power Accuracy: ±0.1% error of Reading over 1000:1 Dynamic Range. 3 / 13 聚点滴之芯.成浩瀚之海 Active value Accuracy: ±0.1% error of Reading over 1000:1 Dynamic Range. On-chip 1.25 V Reference (5ppm/°C typ, <20 ppm/°C max). Leakage Function: Leakage current 30mA, < 30ms reaction time. System Calibrations Function: ±100% Calib Range Phase Compensation Funciton: ±2.56°Compensate Range, 0.02° minimum Compensating value. 2. System Block Diagram ANT 2.4G CSE7761 CST84F11 Power 3.3V 4 / 13 聚点滴之芯.成浩瀚之海 3. CSM84F12 Pin-out 3.1 Pin-out view 3.2 CSM84F12 Pin Assignment and Descriptions Symbol Type Pin ACN I/O IIN1+ Differential analog input pins for the current channel ACNOUT I/O IIN1- Differential analog input pins for the current channel Description 5 / 13 聚点滴之芯.成浩瀚之海 Symbol Type Pin ACLOUT I/O VIN- Differential analog input pins for the voltage channel GPIO1_DEBUG_TX I/O TXD GPIO3_DEBUG_RX I/O RXD RELAY2 I/O GPIO controller for relay1 RELAY1 I/O GPIO controller for relay2 RELAY_LED I/O LED for RELAY VDD 10 3.3V supply for whole module RELAY3 I/O 12 GPIO controller for relay3 Description EN I/O 13 Enable chip. 1: enable chip; 0: Shutdown Chip KEY I/O 14 key WIFI_LED I/O 15 LED to indicator statues of WIFI V2N I/O 16 V2P I/O 17 11 18 GND IIN2+ Differential analog input pins for the current channel IIN2- Differential analog input pins for the current channel Ground 4. Electrical Specifications 4.1 Absolute Maximum Ratings The absolute maximum ratings in Table 4-1 indicate levels where permanent damage to the device can occur, even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect longterm reliability of the device. Table 4-1: Absolute Maximum Ratings 6 / 13 聚点滴之芯.成浩瀚之海 Symbol (domain) Description Max Rating VDD input for EFUSE burn-in. Pull low when read mode VDD input EFUSE_VDD VBAT ACLOUT , ACNOUT , V2P, V2N Unit -0.3 to 2.75 -0.3 to 3.6 -1 to 6 4.2 Environmental Ratings The environmental ratings are shown in Table 4-2 Table 4-2 Environmental Ratings Characteristic Ambient Temperature (TA) Conditions/Comments Functional operation Value Units -20 to +85 °C 4.2.1 Storage Condition The calculated shelf life in sealed bag is 12 months if stored between 0°C and 40°C at less than 90% relative humidity (RH). After the bag is opened, devices that are subjected to solder reflow or other high temperature processes must be handled in the following manner: a) Mounted within 168-hours of factory conditions < 30 °C /60%RH b) Storage humidity needs to maintained at <10% RH c) Baking is necessary if customer exposes the component to air over 168 hours, Baking condition: 125°C / 8hrs 4.3 Thermal Characteristics Table 4-3: the thermal characteristics of the CSM84F12. Thermal characteristics without external heat sink in still air condition Symbol Description Typ. Unit TJ Maximum Junction Temperature (Plastic Package) 125 °C θJA Thermal Resistance θJA (°C /W) for JEDEC 4L system PCB 57.7 °C/W θJC Thermal Resistance θJC (°C /W) for JEDEC 4L system PCB TBD °C/W 7.9 °C/W 260 °C ΨJt Thermal Characterization parameter ΨJt (°C /W) for JEDEC 4L system PCB Maximum Lead Temperature (Soldering 10s) Notes: * Thermal characteristics without external heat sink in still air condition 7 / 13 聚点滴之芯.成浩瀚之海 4.4 PMU Under Voltage Lock-out (UVLO) Characteristics Table 4-4 PMU UVLO characteristics Symbol (domain) Description Min. Typ. Max. Unit Under Voltage Lock-Out (UVLO) Under voltage rising threshold of VBAT Under voltage falling threshold of VBAT VDD33: ball VBAT 2.95 VDD33: ball VBAT 2.85 4.5 Electrostatic Discharge Specifications This is an ESD sensitive product! Observe precaution and handle with care. Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and heel grounding straps to discharge static electricity is required when handling these devices. Table 4-5: ESD Specifications Pin Type Test Condition ESD Rating Human Body Mode refers to MIL-STD-883G Method (HBM) 3015.7 Machine Mode (MM) refers to JEDEC EIA/JESD22-A115 Unit Pass ±2.5 KV Pass ±250 4.6 Recommended Operating Conditions and DC Characteristics Table 4-6: Recommended Operating Conditions and DC Characteristics Domain (Symbol) Description Min. VDD16_DCDC_OUT LDO/Buck converter 1.6V output EFUSE_VDD DVDD12 VDD12_RTC_OUT VDD input for EFUSE burn-in. Pull low when read mode VDD output for internal digital circuit VDD output for internal RTC circuit Max. 1.7 2.25 VBAT 3.3V supply 3.14 (VIL) Input Low voltage when -0.3 8 / 13 Typ. 2.5 Unit 2.75 1.3 1.3 3.3 3.46 0.8 聚点滴之芯.成浩瀚之海 (VIH) (VT+) (VT-) (VOL) (VOH) (RPD) (IOL) (IOH) VBAT=3.3V Input High voltage when VBAT=3.3V Schmitt trigger low to high threshold voltage when VBAT=3.3V Schmitt trigger high to low threshold voltage when VBAT=3.3V Output low voltage when VBAT=3.3V Output high voltage when VBAT=3.3V Input weakly pull-down resistance when VBAT=3.3V. All GPIO pins have internal weakly pull- down option except that GPIO_5 has internal weakly pull-up option Low level output current @ VOL(max), 8mA setting Low level output current @ VOL(max), 12mA setting High level output current @ VOH(min), 8mA setting High level output current @ VOH(min), 12mA setting 9 / 13 3.6 1.6 1.74 1.89 1.27 1.4 1.56 0.4 2.4 35 51 84 KΩ 11.9 17.7 23.4 mA 15.8 23.5 31.1 mA 17.2 34.1 58.8 mA 23.9 47.2 81.5 mA 聚点滴之芯.成浩瀚之海 5. Electrical Specifications Antenna Matching RF_IO RF Port Antenna Port Figure 5-1: RF Front-End Reference Topology for RF Performance Note: All specifications are measured at the Antenna Port unless otherwise specified. 5.1 Transmitter Characteristics for 2.4GHz Operation Table 5-1 summarizes the transmitter characteristics for the CSM84F12. Table 5-1 transmitter characteristics Parameter Condition/Notes Frequency Range Min. Typ. Max. Unit 2412 2484 MHz Rx Sensitivity CCK, 1 Mbps -94.0 dBm (CCK) CCK, 11 Mbps -87.0 dBm Rx Sensitivity OFDM, 6 Mbps -91.0 dBm (OFDM) OFDM, 54 Mbps -72.0 dBm Rx Sensitivity (HT20) HT20, MCS0 -91.0 dBm HT20, MCS7 -68.0 dBm Greenfield 800nS GI Non-STBC 10 / 13 聚点滴之芯.成浩瀚之海 5.2 Receiver Characteristics for 2.4GHz Operation Table 5-2 summarizes the receiver characteristics for the CSM84F12. Notice that transmitter and especially receiver characteristics must be test under test guider. Table 5-2 receiver characteristics Parameter TX Output Power Condition/Notes Min. Typ. Max. Unit CCK, 1-11 Mbps 17.5 dBm OFDM, 54 Mbps 14.0 dBm HT20, MCS7 14.0 dBm 6. System Power Consumption Note: All results are measured at the condition that VBAT are 3.3V. Table 6-1: Power Consumption WLAN Operational Modes Typ. Unit Rx, CCK, 1 Mbps(Continuous) 91 mA Rx, OFDM, 54 Mbps(Continuous) 101 mA Rx, HT20, MCS7(Continuous) 103 mA Tx, CCK, 1 Mbps, 19dBm(Continuous) 292 mA Tx, OFDM, 54 Mbps, 16dBm(Continuous) 237 mA Tx, HT20, MCS7, 15dBm(Continuous) 239 mA Normal work(Avg) 30 mA Tx&Rx (Avg for DCDC mode, normal usage) 80 mA Tx&Rx (Avg for LDO mode, normal usage) 100 mA 7. Soldering Recommendations The CSM84F12 module can be SMT on the board following the temperature curve graph: 11 / 13 聚点滴之芯.成浩瀚之海 Figure 7-1: CSM84F12 temperature curve graph Table 7-1: Solder Profile Section Profile Section Profile Feature Pb-free Package Preheat - Temperature min (Tsmin) - Temperature max.(Tsmax) - Time (min. to max.) Tsmax ro TL - Ramp-up rate Time maintained above: - Temperature (TL) - Time 217°C 60 ~ 150 seconds Average ramp-up rate (TL to Tp) 3°C /second max. Peak Temperature (Tp) 250±5°C Time within 5℃ of actual peak temperature (tp) 20 ~ 40 seconds Ramp-down rate 6°C /second max. Time 25°C to peak temperature 8 minutes max. 150°C 200°C 60 ~ 180 seconds 3°C /second max. 12 / 13 聚点滴之芯.成浩瀚之海 Appendix A: HW Reference Design 13 / 13
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