CLARUS KOREA CRC2602 ZigBee Module Unit Part (ZMP) User Manual

CLARUS KOREA Co., Ltd. ZigBee Module Unit Part (ZMP)

User Manual

- 1 - ZigBee Module Unit Part (ZMP) CRC2602OEM/Integrator Installation Instructions Version 1.2 (Dec. 2011)
- 2 - Contents 1. General specification3 1.1 Applications 3 1.2 Features 3 1.3 Block diagram 5 1.4 Pin assignment 7 1.5 I/O resources 92. 10 10 10 11 11 12 Zigbee Interface2.1 The ZigBee protocol2.2 Debug interface2.3 Power management2.4 RF frequency, output power levels and data rates 2.5 Antenna and range considerations2.6 Antenna Specifications 13 3. Electrical specification 14 3.1 Absolute maximum ratings 14 3.2 Electrical specification 15 3.3 Environmental specification 16 4. Demensions(unit = mm) 17 5. Module label information(Option) 28 6. Recommended soldering reflow profile 19 7. Mechanical specification 20 7.1 Carrier dimension 20 7.2 Taping package/reel Dimension 21 7.3 Packing box dimension22
- 3 - 1. General specificationThe  CRC2602  RF Transceiver Modem is a compact surfacemounted modules  specially designed for the ZigBee™ protocol stack for wireless star and mesh networks based on IEEE 802.15.4 compliant PHY and MAC layers providing 16channels in the 2.45 GHz world- wide license-free ISM band. The complete shielded module is only 14.5mm x 17.0mm x 2.5 mm. 256 kB flash memory, 21 digital and analog I/Os, an 8 channel 12 bit ADC, timers, UART and SPI interfaces make it possible to embed the complete application in this tiny modem. 32k, 64k, 128k flash memory options will be available. 1.1 Applications ▣ 2.4-GHz IEEE 802.15.4 Systems ▣ RF4CE Remote Control Systems ▣ ZigBee Systems ▣ Home/Building Automation ▣ Lighting Systems ▣ Industrial Control and Monitoring ▣ Low-Power Wireless Sensor Networks ▣ Consumer Electronics ▣ Health Care 1.2 Features ▣ 2.4-GHz IEEE 802.15.4 Compliant RFTransceiver ▣ Excellent Receiver Sensitivity and Robustness to Interference ▣ Programmable Output Power Up to 4.5 dBm ▣ Suitable for Systems Targeting Compliance With Worldwide Radio-FrequencyRegulations: ETSI EN 300 328 and EN 300 440 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T-66 (Japan)▣ 14.5 x 17.0 x 2.5 mm, compact shielded modem for SMD mounting ▣ High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch ▣ IR Generation Circuitry ▣ CSMA/CA Hardware Support ▣ Accurate Digital RSSI/LQI Support ▣ 256 kB flash memory, 8 kB SRAM ▣ 17 digital and analog I/Os, 8 channel 12 bit ADC ▣ High performance direct sequence spread spectrum (DSSS) RF transceiver ▣ 16 channels in the 2.45 GHz ISM band ▣ Industrial operating temperature range  –30 to 85°C
- 4 - ▣ Two Powerful USARTs With Support for Several Serial Protocols ▣ Watchdog Timer ▣ Operating voltage 2.7 ~ 3.6V ▣ Compact size - Size  14.5±0.3mm x 17.0±0.3mm- Height  2.5±0.3mm- Weight  1.2±0.5grams▣ RoHS compliant
- 5 - 1.3 Block diagram Circuit descriptionThe modem contains an IEEE 802.15.4 compliant SoC RF transceiver, external Reset, high speed oscillator and an RTC 32 kHz oscillator. The modem is intended for running the ZigBee network protocol. The application software together with the ZigBee protocol software stack can be programmed in Flash memory through a proprietary serial debugging interface. The easiest way to do this is by using an evaluation board from TI and an IAR Embedded workbench. The module includes two USART that are configurable as either SPI or UART. Totally 21 I/O
- 6 - pins are available to the user. 8 pins can be used for the internal 8-12 bit A/D converter. All of the pins have interrupt features. The MCU provides several low power modes with can be utilized to reduce the current consumption in battery operated applications. An internal 32 kHz crystal oscillator can be used for real-time clock and timer applications. For further details on the SoC transceiver (TI, CC2530), please consult the respective data sheet.
- 7 - 1.4 Pin assignment Pin  Name I/O  Description 1  P0.4 I/O  Digital I/O, P0.4 2  P0.3 I/O  Digital I/O, P0.3 3  P0.2 I/O  Digital I/O, P0.2 4  P0.1 I/O  Digital I/O, P0.1 5  GND -  System ground 6  GND -  System ground 7  VCC -  Supply voltage input.(2.7 ~ 3.6V, typically 3.3V) 8  P0.0 I/O  Digital I/O, P0.0 9  RESET -  Reset output with internal pullup 10  GND -  System ground 11  GND -  System ground 12  GND  System ground 13  GND -  System ground 14  GND -  System ground 15  GND -  System ground 16  ANT I/O  RF I/O connection to antenna, 50 Ohm 17  GND -  System ground 18  GND -  System ground
- 8 - 19 GND -  System ground 20 GND -  System ground 21 DC I/O  Debug Clock, P2.2 22 DD I/O  Debug Data, P2.1 23  P2.0 I/O  Digital I/O, P2.0 24 GND -  System ground 25 P1.7 I/O  Digital I/O, P1.7 26  P1.6 I/O  Digital I/O, P1.6 27  P1.5 I/O  Digital I/O, P1.5 28  P1.4 I/O  Digital I/O, P1.4 29  P1.3 I/O  Digital I/O, P1.3 30  P1.2 I/O  Digital I/O, P1.2 31  P1.1 I/O  Digital I/O, P1.1, 20 mA sink/source capability 32  P1.0 I/O  Digital I/O, P1.0, 20 mA sink/source capability 33 GND -  System ground 34  P0.7 I/O  Digital I/O, P0.7 35  P0.6 I/O  Digital I/O, P0.6 36  P0.5 I/O  Digital I/O, P0.5
- 9 - 1.5 I/O resources Periphery /function P0 P1 P2 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 4 3 2 1 0 ADC  A7 A6 A5 A4 A3 A2 A1 A0 T Operational Amplifier O – + Analog Comparator + – USART 0 SPI Alt. 2 C SS MO MI MO MI C SS USART 0 UART Alt. 2 RT CT TX RX TX RX RT CT USART 1 SPI Alt. 2 MI MO C SS MI MO C SS USART 1 UART Alt. 2 RX TX RT CT RX TX RT CT TIMER 1 Alt. 2 4 3 2 1 0 3 4 0 1 2 TIMER 3 Alt. 2 1 0 1 0 TIMER 4 Alt. 2 1 0 1 0 32-kHz XOSC  Q1 Q2 DEBUG  DC DD OBSSEL 5 4 3 2 1 0
- 10 - 2. ZigBee interface2.1. The ZigBee protocol The ZigBee Alliance is an association of companies working together to enable reliable, costeffective, low-power, wirelessly networked, monitoring and control products based on an open global standard. The ZigBee Alliance is a rapidly growing, non-profit industry consortium of leading semiconductor manufacturers, technology providers, OEMs and end-users worldwide. Membership is open to all. The ZigBee Alliance, in collaboration with the IEEE, is defining the network, security, and application layers above the IEEE 802.15.4 PHY and MAC layers. This cooperation has resulted in an easy-to-use, standards-based wireless network platform optimized for wireless monitoring and control applications. For more information about the ZigBee Alliance and the ZigBee standard, please consult www.zigbee.org The module is intended for using the ZigBee protocol. However, other proprietary network protocols can also be implemented using the module. The ZigBee stack implementation from TI/Chipcon/Figure 8 Wireless is recommended as it provides seamless integration with the module. However, third party stack implementations can also be used provided they support the TI/Chipcon MAC firmware. 2.2. Debugging interface The modem has a two-wire proprietary debug interface. This interface can also be used for incircuit programming of the device. For debugging the device programmer sends command <DEBUGGING_INSTR> to the icrocontroller. The instructions succeeding the debugging commando are executed by the CPU without updating the program counter. For in circuit programming the same debugging command is used, only the instruction preformed is flash programming with through the flash controller. Supply and ground must also be connected during programming or debugging. Pin  Description 21  P2.2, Debug Clock 22  P2.1, Debug Data Pin 21 and 22 can be used as normal digital I/O pins when the module is not in debugging mode.
- 11 - 2.3. Power management The ZigBee protocol allows End Devices to be powered down, while Routers must be powered all the time in order to handle packet routing. Battery operated devices should be End Devices in order to reduce the power consumption to a minimum. The modem can be set in several sleep modes using the features of the MCU and turning off the RF transceiver. Sleep modes enable the application to shut down unused segments in the MCU, thereby saving power. The MCU provides various sleep modes allowing the user to tailor the power consumption to the application’s requirements. To enter any of the 3 sleep modes (power modes 1-3) available in the modem, the appropriate registers in CC2530 must be set. See datasheet for CC2530 for details. The different power modes available are: Power mode 1 – Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention. Power mode 2 – Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 1 2 μA 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention. Power mode 3 – Digital regulator off; no clocks; POR active; RAM and register retention. 2.4. RF frequency, output power levels and data rates The following table shows the RF channels as defined by the IEEE 802.15.4 standard. RF channel  Frequency 11  2405MHz 12  2410MHz 13  2415MHz 14  2420MHz 15  2425MHz 16  2430MHz 17  2435MHz 18  2440MHz 19  2445MHz 20  2450MHz 21  2455MHz 22  2460MHz 23  2465MHz 24  2470MHz 25  2475MHz 26  2480MHz For proprietary solutions (non-IEEE 802.15.4), the RF transceiver can be programmed in steps of 1 MHz. The output power level can be configured from the firmware in the range about -22 to 4.5 dBm.
- 12 - The RF transceiver uses direct sequence spread spectrum (DSSS) with 2 Mchip/s chip rate, giving a raw data rate of 250Kbit/s. The modulation format is Offset – Quadrature Phase Shift Keying (O-QPSK). The DSSS makes the communication link robust in noisy environments when sharing the same frequency band with other applications. The use of RF frequencies and maximum allowed RF power is limited by national regulations. The modem is complying with the applicable regulations for the world wide 2.45 GHz ISM band. Specifically it complies with the European Union R&TTE directive meeting EN 300 328 and EN300 440 class 2. It also meets the FCC CFR47 Part15 regulations for use in the US and the ARIB T-66 for use in Japan. 2.5. Antenna and range considerations This modem is a very compact solution containing all the critical RF parts within the modem. However, a somewhat better range can be achieved using an external antenna. Range testing using the external antenna shows these typical distances: - Compact size with a ceramic antenna working as a quarter-wave resonant antenna - Good performance with ¼ wave monopole antenna on ground plane - High performance with with 5/8 wave dipole antenna Due to the dielectric ceramic material the antenna is shorter than a normal quarter wave antenna (in air), still providing high radiation efficiency (typical 1 dBi). The antenna is matched for use in the 2.45 GHz band. The radiating part of the antenna is the white ceramic component located outside the shield can. The radiation pattern from the antenna is similar to the donut-shaped radiation from a quarter wave antenna. That is, the maximum radiation is in the plane normal to the length axis of the antenna. For best possible omni-directional radiation the module should be oriented so that the antenna is vertical. To achieve the very best range the transmitting and receiving antenna should be oriented the same way, ensuring the same polarity at both devices. However, indoors reflections of the radio waves in metallic structures tend to spread the polarisation, so even if same orientation is not possible, communication will still take place, but the range is somewhat shorter, typically by 20%. The antenna should be kept away (> 10mm) from metallic or other conductive and dielectric materials, and should never be used inside a metallic enclosure. Compared to lower frequencies, operation at 2.45 GHz is more limited to LOS. Reflections from walls and other objects may give multi-path fading resulting in dead-zones. The ZigBee mesh network topology is used to overcome this fading as it allows for alternative routing paths. The mesh network is therefore highly recommended for increased reliability and extended coverage throughout buildings. In applications where the module must be placed in a metallic enclosure, an external
- 13 - antenna must be used. The RF available at a module pin must be fed to external antenna. The RF input/output is matched to 50 Ohm. If the antenna or antenna connector is placed away from the module at the motherboard, the track between the RF pin and the connector should be a 50 Ohm transmission line. On a two layer board made of FR4 the width of a microstrip transmission line should be 1.8 times the thickness of the board, assuming a dielectric constant of 4.8. The line should be run at the top of the board, and the bottom side should be a ground plane. Example: For a 1.6 mm thick FR4 board, the width of the trace on the top side should be 1.8 x 1.6 mm = 2.88 mm. The simplest antenna to use is the quarter wave whip antenna. A quarter wave whip antenna above a ground plane yields 37 Ohm impedance and a matching circuit for 50 Ohm are usually not required. A PCB antenna can be made as a copper track where the ground plane is removed on the back side. The rest of the PCB board should have a ground plane as large as possible, preferably as large (in one dimension) as the antenna itself, to make it act as a counterweight to the antenna. A quarter wavelength antenna on a PCB must be shorter than the wire antenna due to the influence of the dielectric material of the PCB. The length reduction depends on the PCB thickness and material, as well as how close to the edge of the board the antenna is placed. Typical reduction is to 75-90 % but must be found empirically. The length of a quarter-wave antenna is given in the table below. Frequency{MHz} Length of whip antenna[cm]  Length of PCB track[cm] 2450  2.9  2.25 ~ 2.7 If, for space reasons, the track is made even shorter than the resonating quarter of a wavelength, the antenna should be matched to 50 ohms using a series inductor and a shunt capacitor. Peak Gain (dBi)Avg. Gain (dBi) Total Avg. Gain (dBi)Efficiency(%)Azimuth 2.8 1.0-0.22 95Elevation 1 3.5 -0.7Elevation 2 1.7 -1.6- Chip Antenna- Gain: 3.5 dBi- Model Number: ALA931C5- Manufacture: AMOTECH2.6. Antenna Specifications
- 14 - 3. Electrical specification3.1 Absolute maximum ratings Parameter  Min  Max  Units Supply voltage, VCC  - 0.3  3.9  V Voltage on any digital pin  - 0.3  VCC+0.3 V  V RF output Power  4.5  dBm Storage temperature  -40  125  ℃ Operating temperature  - 40  125  ℃ Stresses  beyond  those  listed under  Absolute  Maximum  Ratings  may  cause  permanent  damage  to  the  device. These  are  stress  ratings  only,  and  functional  operation  of  the  device  at  these  or  any  other  conditions  beyond those indicated under Recommended Operating Conditions is not implied. Exposure to  absolute-maximum-rated conditions for extended periods may affect device reliability.
- 15 - 3.2 Electrical Specifications Parameter Min Typ  Max  Units Notes Operating frequency  2394 2507  MHz  Programmable in 1-MHz steps, 5 MHz between channels for compliance with [1] Number of channels  16  For IEEE 802.15.4 compliance Channel spacing  5  MHz  For IEEE 802.15.4 compliance Input/output impedance  50  Ohm Data rate  250  kbit/s DSSS chip rate  2  Mc/s Frequency stability  -40  40  ppm Transmit power  -22  4.5  dBm  Programmable from firmware Spurious emission, TX Max  recommended  output power setting 25 MHz–1000 MHz (outside restricted bands) 25 MHz–2400 MHz (within FCC restricted bands) 25 MHz–1000 MHz (within ETSI restricted bands) 1800–1900 MHz (ETSI restricted band) 5150–5300 MHz (ETSI restricted band) At 2 × fc and 3 × fc (FCC restricted band) At 2 × fc and 3 × fc(ETSI EN 300-440 and EN 300- 328) 1 GHz–12.75 GHz (outside restricted bands) At 2483.5 MHz and above (FCC restricted band) fc= 2480 MHz -60 -60 -60 -57 -55 -42 -31 -53 -42 dBm  Complies with EN 300 328, EN 300 440,  FCC CRF47 Part 15 and ARIB STD-T66 Error Vector Magnitude  2  % Sensitivity  -97  dBm  PER = 1%, as specified by [1] [1] requires –85 dBm Adjacent channel rejection +/- 5 MHz 49/49 dB Wanted signal –82 dBm, adjacent modulated channel at 5 MHz, PER = 1 %, as specified by  [1]. [1] requires 0 dB. Alternate channel selectivity +/- 10 MHz 57/57 dB Wanted signal –82 dBm, adjacent modulated channel at 10 MHz, PER = 1%, as specified by [1]. [1] requires 30 dB Blocking / Interferer rejection / desensitization +/- 5 MHz +/- 10 MHz +/- 20 MHz +/- 50 MHz -33/-35 -33/-35 -32/-34 -31/-34 dBm Wanted signal 3 dB above the sensitivity level,  CW jammer, PER = 1%.  Measured  according  to  EN 300 440 class 2.
- 16 - Parameter  Min Typ  Max Units Notes Saturation  10  dBm Spurious emission, RX 30 – 1000 MHz 1-12.75 GHz -80 -57  dBm Conducted  measurement  with  a  50-Ω  single-ended load.  Suitable  for  systems  targeting  compliance  with EN  300  328,  EN  300  440,  FCC  CFR47  Part  15  and ARIB STD-T-66. Supply voltage  2.7 3.3  3.6  V Core current consumption 3.4  mA Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. Medium CPU activity: normal flash access(1), no RAM access 6.5  8.9  mA 32-MHz XOSC running. No radio or peripherals active. Medium CPU activity: normal flash access(1), no RAM access 32-MHz XOSC running, radio in RX mode 20.5  mA  –50-dBm input power, no peripherals active, CPU idle24.3  29.6  mA -100-dBm input power (waiting for signal), no peripherals active, CPU idle 32-MHz XOSC running, radio in TX mode 28.7  mA  1-dBm output power, no peripherals active, CPU idle 33.5  39.6  mA  4.5-dBm output power, no peripherals active, CPU idle Power mode 1.  0.2  0.3  mA Digital  regulator  on;  16-MHz  RCOSC  and  32-MHz crystal  oscillator  off;  32.768-kHz  XOSC,  POR,  BOD and sleep timer active; RAM and register retention Power mode 2.  1  2  μA Digital  regulator  off;  16-MHz  RCOSC  and  32-MHz crystal  oscillator  off;  32.768-kHz  XOSC,  POR,  and sleep timer active; RAM and register retention Power mode 3.  0.4  1  μA  Digital regulator off; no clocks; POR active; RAM and register retention Flash memory  32  kB RAM memory  8  kB MCU clock frequency  32  MHz MCU low frequency crystal  32.768 kHz 3.3 Environmental specification Test  Standard Visual inspection  - Thermal shock  KS C 0225 and IEC 68-2-14 Function at various temperature  KS C 0220/0221 and IEC 68-2-1/2 Damp heat  KS C 0225 and IEC 68-2-30 Vibration  KS C 0240 and IEC 68-2-6 Metallographic investigations  IPC-QE-650
- 17 - 4. Demensions (unit = mm)
- 18 - 5. Module label information (Option)1 2 3 No. Index1Pin number index 2Manufacturer’s model name 3Manufactured year,serial number MODEL: CRC2602 FCC ID: 2AE73-CRC2602IC: 20386-CRC26024 4FCC ID, IC Certification
- 19 - 6. Recommended soldering reflow profileConsider for a long time in the soldering zone (with temperature higher than 180 °C) has to be kept as short as possible to  prevent component  and substrate damages. Peak temperature must not exceed 250 °C. (according to IPC/JEDEC J-STD-020C)
- 20 - 7. Mechanical specification7.1 Carrier dimension
- 21 - 7.2 Taping package/reel dimension
- 22 - 7.3 Packing box dimension
- 23 -FCC StatementFCC Part 15.19This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.FCC Part 15.21Any changes or modifications (including the antennas) to this device that are not expressly approved by the manufacturer may void the user’s authority to operate the equipment.FCC RF Radiation Exposure StatementThis equipment complies with FCC RF Radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.FCC Compliance Requirements with KDB996369
- 24 -i.  “Module is limited to OEM installation ONLY “ii.  “OEM integrators is responsible for ensuring that the end-user has no manual instructions to remove or install module”iii.  “FCC RF Exposure requirements:  Module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).  Separate FCC approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations.”iv.  “If (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: 2AE73-CRC2602” or “Contains FCC ID: 2AE73-CRC2602” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID.”v.  “A host product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., Bluetooth and WiFi transmitter modules may also contain digital logic functions) as appropriate.vi.  To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and is fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, the grantee (the party responsible for the module grant) shall provide guidance to the host manufacturer for compliance with the Part 15B requirements.”Information for OEM integrator
- 24 -IC StatementRSS-Gen section 8.3This radio transmitter (identify the device by certification number or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.Le présent émetteur radio (identifier le dispositif par son numéro de certification ou son numéro de modèle s'il fait partie du matériel de catégorie II) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:(1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

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