California Eastern Laboratories ZIC2410P3 MeshConnect Extended Range ZigBee Module User Manual Exhibit D Users Manual per 2 1033 b3

California Eastern Laboratories MeshConnect Extended Range ZigBee Module Exhibit D Users Manual per 2 1033 b3

Exhibit D Users Manual per 2 1033 b3

Page 1MeshConnect™ Module SeriesDESCRIPTION CEL's MeshConnect™ Module Series provides high performance and low cost 2.4 GHz IEEE 802.15.4 / ZigBee modules for a broad range of wireless networks. The MeshConnect certied and quali-ed modules, enable customer to accelerate time to market by greatly reducing design and certication phases of development.CEL's MeshConnect™ radio modules leverage the advanced features of the MeshConnect™ Integrated Circuit (IC). The IC is a true single-chip solution, compliant with ZigBee specications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The IC consists of an RF transceiver with baseband modem, a hardwired MAC and an embedded 8051 microcon-troller with internal Flash memory. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UARTs and is one of the rst devices to provide an embedded Voice CODEC. This device is also ideal for low power applications.The original MeshConnect module delivers excellent performance at a surprisingly low cost. The module’s +6dBm output power means better range, more reliable transmission and fewer nodes in your network. It also makes these modules ideal for applica-tions where cost and power constraints do not allow for external power ampliers or peripheral range extension components.The MeshConnect Extended Range module adds a power ampli-er (PA) and low noise amplier (LNA) to increase range to over two miles - plus more reliable transmission and fewer nodes in your network. It is especially useful for open outdoor applica-tions where the nodes are physically far apart, or for indoor use where the nodes have to operate in a noisy RF environment. The Extended Range Module’s outstanding +123 dBm budget link ensures high quality connections even in such harsh environments. Integrated Transceiver Modules for ZigBee / IEEE 802.15.4Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1The information in this document is subject to change without notice, please conrm data is currentDocument No: 0007-00-07-00-000 (Issue C)Date Published: October 6, 2009PRELIMINARY DATA SHEETORDERING INFORMATIONPart Number Order Number DescriptionMeshConnect™ ModuleZICM2410P0-1 +6 dBm Output power, PCB Trace AntennaZICM2410P0-1C+6 dBm Output power, with U.FL Connector for external antennaZICM2410P0-KIT2-1 +6 dBm Engineering Development KitMeshConnect™ Extended Range ModuleZICM2410P2-1 +20 dBm Output power, PCB Trace AntennaZICM2410P2-1C+20 dBm Output power, with U.FL Connector for external antennaZICM2410P2-KIT1-1 Evaluation board for +20 dBm moduleAPPLICATIONSHome & Building Automation • Security• HVAC control• Lighting control• ThermostatsIndustrial Controls• Food processing controls• Trafc Management• Sensor Networks• Asset Management• Barcode reader• Patient Monitoring• Glucose monitor• High RF performance: - Up to 123.5 dB RF Link Budget - RX Sensitivity: -97 dBm and -103.5 dBm - RF TX Power:+6 dBm and +20 dBm• Scalable Data Rate: 250 kbps, 500 kbps and 1Mbps• Miniature footprint: 1” x 1.350” (25.4 mm x 34.3 mm)• Voice Codec Support: µ-law/a-law/ADPCM • 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3 µA)• Integrated PCB trace antenna• 16 RF channels• Up to 12,000 feet of range• AES 128-bit encryption• FCC, CE and IC certications• ROHS compliantFEATURES• 96 kB FLASH Memory• 8 kB SRAM• 8051 MCU core• up to 22 GPIO Pins• SPI (Master/Slave) + UARTs• I2S/PCM Interface with two 128-byte FIFOs • µ-law/a-law/ADPCM Voice Codec• 4-channel 8-bit ADC MeshConnect™ Module SeriesModule and Extended Range Module
MeshConnect™ Module SeriesPage 2MODULE BLOCK DIAGRAM16 MHz XTALRadioMicroprocessor ANTCastellation Edge ConnectorPWR RegMeshConnect™ ICModule16 MHz XTALRadioMicroprocessor ANTCastellation Edge ConnectorPWR RegMeshConnect™ ICLNAExtended Range ModulePADEVELOPMENT KITCEL's MeshConnect Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site. The MeshConnect Development Kit also serves as an invalu-able aid in application development. Through the many interface headers on the board, the user has access to all the MeshConnect module pins enabling easy connection to target systems for application development. The key components of the MeshConnect Development Kits are the CEL’s MeshConnect radio module and the interface board.The MeshConnect module contains the CEL transceiver IC, Crystals, Power Regulator and an integrated PCB antenna with a connector for an external antenna (optional). The interface board features a serial com-munication interface, a power management module, and peripherals such as potentiometers, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL’s website http://www.cel.com)Order Number DescriptionZICM2410P0-KIT2-1 +6 dBm Engineering Development Kit ZICM2410P2-KIT1 Evaluation board for +20 dBm moduleKit Contents:• Evaluation Boards w/Module (3)• Network Analyzer (1)• Antennas (1)• USB Cables (2)• Jumpers (10)• AA Batteries (4)• Universal AC/DC Power Supply (2)• Software & Technical Information CD (2)MeshConnect™ Module Development KitKit Contents:• Evaluation Boards w/Module (1)• USB Cables (1)• Jumpers (2)• Software & Technical Information CD (2)MeshConnect™ Extended Range Module Development Kit
MeshConnect™ Module SeriesPage 3Introduction and OverviewDescription.............................................................................................................................................................................................. 1Features.................................................................................................................................................................................................. 1Applications............................................................................................................................................................................................ 1Ordering Information............................................................................................................................................................................. 1Module Block Diagram........................................................................................................................................................................... 2Development Kit..................................................................................................................................................................................... 3System Level FunctionTransceiver IC......................................................................................................................................................................................... 4Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... 5Power Amplier....................................................................................................................................................................................... 6Interface.................................................................................................................................................................................................. 6Software Tools........................................................................................................................................................................................ 6Electrical SpecicationAbsolute Maximum Ratings................................................................................................................................................................... 8Recommended (Operating Condition).................................................................................................................................................. 8DC Characteristics.................................................................................................................................................................................. 8RF Characteristics.................................................................................................................................................................................. 8Pin Signal & InterfacesPin Signals I/O Conguration................................................................................................................................................................ 9I/O Pin Assignment................................................................................................................................................................................. 9Module Dimensions................................................................................................................................................................................ 11Processing 13Agency Certications 14Shipment, Storage & Handling 15References & Revision History 16TABLE OF CONTENTS
MeshConnect™ Module SeriesPage 4TRANSCEIVER IC A true monolithic solution, the MeshConnect IC incorporates the RF transceiver with baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. With an industry best +8 dBm output power, the MeshConnect IC will support a wide a variety of applications without the need for external amplication. Combined with a highly sensitive -98 dBm receiver the MeshConnect IC leads the industry with 106 dB link budget. In addition to excellent RF performance at ZigBee (250 kbps) data rates, the IC adds high speed modes, Turbo (500 kbps) and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UARTs and is one of the rst devices to provide an embedded Voice CODEC. CEL provides its customers with the CEL ZigBee Stack as part of the software library. Also available are the hardware & software tools required to develop custom applications. The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the IC a truly distinctsingle chip solution.The Extended Range module adds both an PA and LNA to maximize RF performance. The NEC uPG2250 PA enable the Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm enabling a line of sight range over 2 miles.PS/2UART/2SPIWDTGPIO/24Timer/4PWM/2QuadKey ScanDigital RegulatorRCOscillatorClockPLL PORRF TXRF RXPLLTemp.SensorBatMonitorADC(4CH)AnalogRegulator3VCiruitryMCU(8051) FLASH96KBMODEMMACDMAADPCM VoiceFIFFOAESEnginea-lawμ-lawDATA8KBROM
MeshConnect™ Module SeriesPage 5CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector can be specied, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efciency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute signicantly to the antenna performance (it should not be directly under the F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor mance. Poor design affects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module. • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metalized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction.For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.There are three power down modes in the IC. Each mode can be set using the PDMODE [1:0] bits in the PDCON register and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption and wake-up sources, please refer to the IC datasheet for further information on the available power down modes. Table 8 describes the three power down modes. Table 8 – Power Down Modes PDMODE [1:0] Description Wake-Up Source Regulator for Digital block0 Active (Normal Operation) - - 1 PM1 mode Hardware Reset, Sleep Timer interrupt, External interrupt ON 2 PM2 mode Hardware Reset, Sleep Timer interrupt, External interrupt OFF (After wake-up, register conguration is required) 3 PM3 mode Hardware Reset, External interrupt OFF (After wake-up, register conguration is required) ANTENNAMODES OF OPERATION
MeshConnect™ Module SeriesPage 6POWER AMPLIFIERVOICE CODECSOFTWARE TOOLSThe orginal MeshConnect module does not incorporate an external Power Amplier and therefore the RF output port is connected directly (through matching components) to the RF antenna. As CEL’s IC IEEE 802.15.4 / ZigBee transceiver already offers the industry’s best link budget at 106 dB, even without an external PA the MeshConnect can maintain wireless connection over long distance (3,000 ft line-of-sight).The Extended Range module adds both an PA and LNA to optimize RF performance. The NEC uPG2250 PA enable the Extended Range module to output up to +20 dBm transmit power. In the receive path the addition of the UPC8233 LNA boosts the already sensitive receiver up to -103.5 dBm. The Extended Range link budget boasts a very robust 123.5 dBm enabling a line of sight range over 2 miles. INTERFACEThe MeshConnect has all major communication interfaces routed from the IC to the module edge connectors: • UART1 & UART 2 • I2S • SPI The MeshConnect IC includes three voice codec algorithms: μ-law, a-law and ADPCM.The μ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing. The a-law algorithm provides a slightly larger dynamic range than the μ-law at the cost of worse proportional distortion for small signals. Adaptive DPCM (ADPCM) is a variant of DPCM [Differential (or Delta) pulse-code modulation] that varies the size of the quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes the PCM values as differences between the current and the previous value. For audio applications this type of encoding reduces the number of bits required per sample by about 25% compared to PCM.CEL offers complete SW tools for MeshConnect that customers need to create their ZigBee application. PROFILE BUILDER • Prole Builder allows for easy creation of custom ZigBee proles for use in end-user applications. • Uses the input requirements to modify a set of ‘C’ source les which include the necessary ZigBee functions. • Output les will contain the ZigBee Device Object (ZDO) descriptors and the ZigBee Device Prole (ZDP) descriptors. • The ZDO and ZDP dene the ZigBee node and functionality.The output les can be seamlessly integrated with the CEL ZigBee stack libraries.
MeshConnect™ Module SeriesPage 7SOFTWARE TOOLS (Continued)DEVICE PROGRAMMER • Device Programmer is used to program the application rmware to the on-chip Flash program memory of the IC device. • Device Programmer supports: • ISP Mode: Download the rmware from the host PC via serial communication through the IC’s UART1 interface. • The evaluation boards utilize a USB -> Serial converter. • OTA Mode: Download the rmware from the host PC using wireless communication (Over-The-Air). • This requires two nodes, the host (connected to a PC) and the target device to be programmed.Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the aforementioned communication modes. PROFILE SIMULATOR • Prole Simulator is used to simulate and test a ZigBee network consisting of a coordinator, router and / or end devices. • Prole Simulator includes: • Device Manager: Setting parameters of a ZigBee node. • Bind Manager: Managing “bindings” in a ZigBee network. • ZStack manager: Setting parameters of a ZigBee network. • ZigBee Device Wizard: Selects network conguration during ZigBee network formation.Can be used to generate ZigBee standard primitive functions for MAC, NWK and APS layers and the ZDO and APP. PACKET ANALYZER AND WIRELESS NETWORK ANALYZER • Packet Analyzer monitors trafc over a wireless network channel by capturing RF packet data in real-time. • Packet Analyzer requires the Wireless Network Analyzer to “sniff” the RF packets. • Packet Analyzer also includes diagnostic tools: • Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE 802.15.4 channel yielding available channels. • Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame. • Packet Analyzer is capable of displaying network conguration (i.e. tree vs. star), network nodes, packet details, etc. • Can be used in conjunction with any IEEE 802.15.4 or ZigBee network. KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit). • Supports all 8051 derivatives and variants. • Easy-to-Use µVision Integrated Development Environment (IDE) supports the complete development cycle. • Supports memory banking for CODE and variables beyond the 64 kbyte threshold.Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density.
MeshConnect™ Module SeriesPage 8ABSOLUTE MAXIMUM RATINGSDescriptionMeshConnect™ ModuleMeshConnect™ Extended Range Module UnitMin Max Min MaxPower Supply Voltage (Vcc) -0.3 3.3 -0.3 3.3 VDCVoltage on any digital pin -0.3 3.3 -0.3 3.3 VDCInput RF Level 10 -6 dBmStorage Temperature -55 125 -55 125 °CReow Soldering Temperature 260 260 °C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.RECOMMENDED (OPERATING CONDITIONS) DescriptionMeshConnect™ ModuleMeshConnect™ Extended Range Module UnitMin Typ MaxOperating ambient temperature range, TA-40 25 85 °COperating Supply Voltage 2.1 3.0 VDCInput Frequency 2.405 2.48 GHzDC CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)DescriptionMeshConnect™ ModuleMeshConnect™ Extended Range Module UnitMin Typ Max Min Typ MaxVcc Supply (Vcc) 2.1 3.3 2.1 3.3 VDCRX mode Current (Vcc = 3.0V) 35 38 38 42 mATX mode Current (Vcc = 3.0V) 44 48 175 mATX mode Current (Vcc = 2.1V) 44 48 120 mASleep Mode (Deep) Current 1 4 µA RF CHARACTERISTICS (@ 25°C, VCC = 3.0V unless otherwise noted)DescriptionMeshConnect™ ModuleMeshConnect™ Extended Range Module UnitMin Typ Max Min Typ MaxFrequency Band (16 – 5MHz wide channels) 2.405 2.480 2.405 2.480 GHzRX Sensitivity for 1% PER -97 -85 -103.5 -85 dBmSaturation (maximum input level) 5 -11 dBmTX Output Power (VCC = 3.0V) 4.5 6.0 20 dBmTX Output Power (VCC = 2.1V) 4.5 6.0 15.5 dBmError Vector Magnitude 17 35 15 35 %Adjacent Channel Rejection +/- 5 MHz +/- 10 MHz3535475135354751dBFrequency Error Tolerance -96.2 96.2 -96.2 96.2 kHzOutput Power Control Range 55 55 dBOver the Air Data Rate 250 1000 250 1000 kbpsHarmonics (2nd & 3rd) -41.2 -41.2 dBm/MHz
MeshConnect™ Module SeriesPage 9PIN SIGNALS I/O PORT CONFIGURATIONMeshConnect I/O PIN ASSIGNMENTSMeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations.Pin #MeshConnect™ ModuleMeshConnect™ Extended Range ModuleType Description FunctionalityIC Pin #1 GND GND GND-RF Ground Ground N/A2 GND GND GND-RF Ground Ground N/A3 MS1 NC static control lineMode Select, Bit #1. Active Low Internal Voltage Regulator Enable: 0: Internal Voltage Regulator Enabled 1: Internal Voltage Regulator Disabled, Supply Analog and Digital Supply Voltages ExternallyNo connect 144 GND GND GND-RF Ground Ground N/A5 GND NC GND GND Ground 136 NC NC NC no connect No connect N/A7 GND GND GND-Logic Ground Ground 498 GND GND GND-Logic Ground Ground 499 GND GND GND-Logic Ground Ground 4910 GND GND GND-Logic Ground Ground 4911 GND GND GND-Logic Ground Ground 4912 ACH0 ACH0 Analog Input 1.5V Level Analog ADC0 Input ADC input 813 ACH1 ACH1 Analog Input 1.5V Level Analog ADC1 Input ADC input 914 ACH2 ACH2 Analog Input 1.5V Level Analog ADC2 Input ADC input 1015 ACH3 ACH3 Analog Input 1.5V Level Analog ADC3 Input ADC input 1116 P1_7(1) NC digital I/O Port P1.7 Digital I/O 2017 P1_6(1) NC digital I/O Port P1.6 Digital I/O 2118 P1_4 P1_4 digital I/O Port P1.4 / QUADZB / Sleep Timer OSC Buffer Input digital I/O or dedicated function port2219 P1_3 P1_3 digital I/O Port P1.3 / QUADZA / Sleep Timer OSC Buffer Output / RTCLKOUT digital I/O or dedicated function port 2320 GND GND GND-Logic Ground Ground 4921 GND GND GND-Logic Ground Ground 4922 GND GND GND-Logic Ground Ground 4923 P1_1 P1_1 digital I/O Port P1.1 / TXD1 digital I/O or dedicated function port2424 VCC_3V VCC_3V Power 3.0V Power supply for Analog Internal Voltage Regulator Power Input 725 P1_0 P1_0 digital I/O Port P1.0 / RXD1 digital I/O or dedicated function port 2626 P3_7 P3_7 digital I/O Port P3.7 / 12mA Drive capability / PWM3 / CTS1 / SPICSN digital I/O with high current capability 2727 P3_6 P3_6 digital I/O Port P3.6 / 12mA Drive capability /PWM2 / RTS1 / SPICLK digital I/O with high current capability 28Note: 1. Pin used on extended range module to control on board power amplier. 2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
MeshConnect™ Module SeriesPage 10MeshConnect I/O PIN ASSIGNMENTS (Continued)28 P3_5 P3_5 digital I/O Port P3.5 / T1 / CTS0 / QUADYB / SPIDO digital I/O or dedicated function port 2929 P3_4 P3_4 digital I/O Port P3.4 / T0 / RTS0 / QUADYA / SPIDI digital I/O or dedicated function port 3030 GND GND GND-Logic Ground Ground 4931 P3_3 P3_3 digital I/O Port P3.3 / INT1 (active low) digital I/O or dedicated function port 3132 P3_2 P3_2 digital I/O Port P3.2 / INT0 (active low) digital I/O or dedicated function port 3233 GND GND GND-Logic Ground Ground 4934 P3_1 P3_1 digital I/O Port P3.1 / TXD0 / QUADXB digital I/O or dedicated function port 3335 P3_0 P3_0 digital I/O Port P3.0 / RXD0 / QUADXA digital I/O or dedicated function port 3536 GND GND GND-Logic Ground Ground 4937 P0_7 P0_7 digital I/O GPIO 8051 Port P0.7 / I2STX_MCLK digital I/O 3638 P0_6 P0_6 digital I/O GPIO 8051 Port P0.6 / I2STX_BCLK digital I/O 3739 P0_5 P0_5 digital I/O GPIO 8051 Port P0.5 / I2STX_LRCLK digital I/O 3840 P0_4 P0_4 digital I/O GPIO 8051 Port P0.4 / I2STX_DO digital I/O 3941 P0_3 P0_3 digital I/O GPIO 8051 Port P0.3 / I2SRX_MCLK digital I/O 4042 P0_2 P0_2 digital I/O GPIO 8051 Port P0.2 / I2SRX_BCLK digital I/O 4143 P0_1 P0_1 digital I/O GPIO 8051 Port P0.1 / I2SRX_LRCK digital I/O 4244 P0_0 P0_0 digital I/O GPIO 8051 Port P0.0 / I2SRX_DI digital I/O 4345 DVDD_1_5(2) NC PowerOutput of Digital Internal Voltage Regulator (1.5V) / 1.5V Power supply for Digital Core(input mode @ No REG) Selected as Internal Regulator output or Regulated Voltage supply Input1946 ISP ISP Digital InputMode Select, Bit #2. Active High In-System Programming (ISP) Input: 0: Normal Mode 1: ISP ModeProgramming 1547 RESET RESET Control Reset (Active Low) Hardware Reset 1748 AVDD_1_5(2) NC PowerOutput of Analog Internal Voltage Regulator (1.5V) / 1.5V Power supply for Mixer, VGA, and LPF (input mode @ No REG) Selected as Internal Regulator output or Regulated Voltage supply Input649 GND GND GND-Logic Ground Ground 4950 GND GND GND-Logic Ground Ground 4951 GND GND GND-Logic Ground Ground 4952 GND GND GND-Logic Ground Ground 4953 GND GND GND-Logic Ground Ground 4954 NC NC NC No Connect No connect N/A55 GND GND GND-RF Ground Ground N/A56 GND GND GND-RF Ground Ground N/APin #MeshConnect™ ModuleMeshConnect™ Extended Range ModuleType Description FunctionalityIC Pin #Note: 1. Pin used on extended range module to control on board power amplier. 2. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance.
MeshConnect™ Module SeriesPage 11Pin #MeshConnect™ ModuleMeshConnect™ Extended Range ModuleType Description FunctionalityIC Pin #MODULE DIMENSIONS1.000” 0.195”0.895”1.413”0.062”0.120”RF ShieldR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1ZICM2410P00007-00-00-00-001J2Pin 1Pin 19 Pin 38Pin 560RC25ZIC2410QN481.000” 0.195”0.895”1.413”0.062”RF ShieldR6R7U1R1C7 C7BL4L3C11R10C21C20L5R11 C23C22R8C5BC24C13C6A C1C2R5L6C6BC6L2C14C10C9 R2R9C15C16R4C17C4AXTAL1ZICM2410P00007-00-00-00-001J2Pin 1Pin 19 Pin 38Pin 560RC25ZIC2410QN48For layout recommendation for optimum antenna performance, refer to Antenna section in this document.MeshConnect™ Module / MeshConnect™ Extended Range Module w/PCB Trace AntennaMeshConnect™ Module / MeshConnect™ Extended Range Module w/U.FL Connector for external antenna
MeshConnect™ Module SeriesPage 12MODULE LAND FOOTPRINTNote: Unless otherwise specied. Dimensions are in Inches [mm].1.100 [27.94]1.000 [25.41]0.990 [22.61]0.105 [2.67]0.050 [1.27]COPPER KEEPOUT 0.361 [9.17]0.940 [23.88]1.055 [26.80]0.050 [1.27] Pitch56 x 0.040 [1.02]56 x 0.100 [2.54]
MeshConnect™ Module SeriesPage 13PROCESSINGRecommended Reow ProleParameters ValuesRamp up rate (from Tsoakmax to Tpeak) 3º/sec maxMinimum Soak Temperature 150ºC Maximum Soak Temperature 200ºCSoak Time 60-120 secTLiquidus 217ºC Time above TL 60-150 secTpeak 260 + 0ºCTime within 5º of Tpeak 20-30 secTime from 25º to Tpeak 8 min maxRamp down rate 6ºC/sec maxAchieve the brightest possible solder llets with a good shape and low contact angle.Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-cation. See IPC-A-610-D "Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias.Repeating Reow Soldering Only a single reow soldering process is encouraged for host boards.Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.
MeshConnect™ Module SeriesPage 14PendingPROCESSING (Continued)AGENCY CERTIFICATIONSHand SolderingHand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711.Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.Additional GroundingAttempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum immunity to external RF interference.FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GENThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21)Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation DistanceTo comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.OEM Responsibility to the FCC Rules and RegulationsThe MeshConnect Module has been certied per FCC Part 15 rules for integration into products without further testing or certication. To fulll the FCC certication requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the nal product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC ID: W7Z-ICP0”The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certied with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.
MeshConnect™ Module SeriesPage 15PendingAGENCY CERTIFICATIONS (Continued)SHIPMENT, HANDLING, AND STORAGEShipmentThe MeshConnect Modules are delivered in trays of 28.HandlingThe MeshConnect Modules are designed and packaged to be processed in an automated assembly line.Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect Modules are moisture-sensitive devices. Appropriate handling instruc-tions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL)MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.IC Certication — Industry Canada Statement The term "IC" before the certication / registration number only signies that the Industry Canada technical specications were met.Section 14 of RSS-210The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpCE Certication — Europe The MeshConnect RF module has been tested and certied for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required tomake a submission to the notied body for compliance testing.OEM Labeling RequirementsThe `CE' mark must be placed on the OEM product in a visible location.The CE mark shall consist of the initials “CE” with the following form: · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. · The CE mark must be a minimum of 5mm in height · The CE marking must be afxed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the “CE” marking as shown in the picture
MeshConnect™ Module SeriesPage 16REFERENCES & REVISION HISTORYPrevious Versions Changes to Current Version Page(s)0007-00-07-00-000 (Issue A) February 05, 2009 Initial preliminary datasheet. N/A0007-00-07-00-000 (Issue B) June 11, 2009 Updated Development Kit and Agency Certication 2, 14, 150007-00-07-00-000 (Issue C) October 6, 2009 Added New MeshConnect Extended Range Module AllDisclaimer • The information in this document is current as of October, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

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