California Eastern Laboratories ZICM357SP2 ZigBee Development Kit User Manual manual

California Eastern Laboratories ZigBee Development Kit manual

manual

MeshConnect™ EM357 Mini Modules
DESCRIPTION
CEL’s MeshConnect™ EM357 Mini Modules combine high
performance RF solutions with the market's premier Zig-
Bee® stack. Available in low and high output power options
(+8dBm and +20dBm), these modules can accommodate
variable range and performance requirements. The tiny
module footprint makes them suitable for a wide range of
ZigBee applications. The MeshConnect EM357 Mini Mod-
ules are certied and qualied, enabling customers to ac-
celerate time to market by greatly reducing the design and
certication phases of development.
CEL's MeshConnect EM357 Mini Modules (ZICM357SP0,
ZICM357SP2) are based on the Ember EM357 Zigbee
compliant SOC radio IC. The IC is a single-chip solution,
compliant with ZigBee specications and IEEE 802.15.4,
a complete wireless solution for all ZigBee applications.
The IC consists of an RF transceiver with the baseband
modem, a hardwired MAC and an embedded 32-bit ARM®
Cortex™-M3 microcontroller with internal RAM (12kB) and
Flash (192kB) memory. The device provides numerous
general-purpose I/O pins and peripheral functions such as
timers and UARTs.
Integrated Transceiver Modules for ZigBee/IEEE 802.15.4
Development Kits available: ZICM-EM35X-DEV-KIT-2
The information in this document is subject to change without notice.
Document No: 0011-00-07-00-000 (Issue C)
Date Published: May 25, 2012
PRELIMINARY DATA SHEET
ORDERING INFORMATION
Part Number Order Number Description Min./Multiple
MeshConnect™
EM357 Mini Modules
ZICM357SP0-1 +8 dBm Output Power, PCB Trace antenna 330 / 330
ZICM357SP0-1C +8 dBm Output Power, with Castellation pin for external antenna 330 / 330
ZICM357SP2-1 +20 dBm Output Power, PCB Trace antenna 330 / 330
ZICM357SP2-1C +20 dBm Output Power, with Castellation pin for external antenna 330 / 330
MeshConnect™ EM357
Development Kits ZICM-EM35X-DEV-KIT-2 MeshConnect EM35x Ember Companion Kit for Ember EM35x
Development Kits 1 / 1
  FLASH

 ™-M3
 
 
 
 
MeshConnect
™
EM357 Mini Modules

EmberTM EM357 Transceiver Based Modules
•HighRFperformance:
 Up to 123 dB RF Link Budget
RX Sensitivity:
-100 dBm (ZICM357SP0)
-103 dBm (ZICM357SP2)
•DataRate:250kbps
•AdvancedCortex-M3processor
•AdvancedPowerManagement 
•16RFChannels
•Industry'spremierZigBeePro
 stack:EmberZNetPRO™

•Minifootprint:(23.9mmx16.6mm)
0.940" x 0.655"
•AntennaOptions:
1) Integrated PCB trace antenna
or
2) RF port for external antenna
•SupportsMeshnetworks
•AESencryption
•FCC,CEandICcertications
•ROHScompliant
APPLICATIONS
•SmartEnergy/GridMarkets
Thermostats
In-Home-Displays
Smart Plugs
•Buildingautomationand 
 control
•Lighting:xtureandcontrol
•Solarinverterandcontrol
•Homeautomationandcontrol
Energy Management
Security Devices
HVAC Control
•GeneralZigBeewirelesssensor
 networking
ZICM357SP0 ZICM357SP2
+8dBm +20dBm
-100dBm -103dBm
+108dB +123dB
Tx:
Rx:
Link Budget:
MeshConnect™ EM357 Mini Modules
Page 2

Radio
Micro
Balun LPF
Castellation
Edge Connector
Ember EM357
24MHz
XTAL
Block Diagram
EM357 Mini Module (ZICM357SP0)
Radio
Micro
PA
LNA
LPF
TX/RX
Switch
Castellation
Edge Connector
Ember EM357
24MHz
XTAL
Block Diagram
EM357 Mini Module (ZICM357SP2)
DEVELOPMENT KITS
CEL's Development Kits assist users in both evaluation and
development.
Ember Companion Kit:
CEL's MeshConnect EM35x Ember Companion Kit is de-
signed to work with the Ember development kits [EM35X-
DEV and EM35X-DEV-IAR]. Each module in this CEL kit is
soldered on a carrier board making it pin-for-pin compatible
with the Ember development board.
For more information regarding MeshConnect Devel-
opment Kits, refer to the respective development kit
user guides documents. (Available at CEL’s website
)
Kit Contents:





MeshConnect™
EM35x Ember Companion Kit
DEVELOPMENT KITS ORDERING INFORMATION
Part Number Order Number Description
MeshConnect™
EM35x Ember Companion Kit ZICM-EM35X-DEV-KIT-2 MeshConnect EM35x Ember Companion Kit for Ember EM35x Dev Kits
MeshConnect™ EM357 Mini Modules
Page 3
Introduction and Overview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
Ordering Information............................................................................................................................................................................. 1
........................................................................................................................................................................... 2
Development Kit..................................................................................................................................................................................... 2
System Level Function
Transceiver IC......................................................................................................................................................................................... 4
Antenna................................................................................................................................................................................................... 4
...................................................................................................................................................................................... 4
Software/Firmware.................................................................................................................................................................................. 4

................................................................................................................................................................... 4
.................................................................................................................................................. 5
.................................................................................................................................................................................. 5
.................................................................................................................................................................................. 5
Pin Signal & Interfaces
................................................................................................................................................................ 6
I/O Pin Assignment................................................................................................................................................................................. 6
Module Dimensions................................................................................................................................................................................ 8
Module Footprint.................................................................................................................................................................................... 9
Processing......................................................................................................................................................................................... 10
................................................................................................................................................................... 11
................................................................................................................................................. 13
Quality.................................................................................................................................................................................................. 13
References & Revision History................................................................................................................................................. 14
TABLE OF CONTENTS
MeshConnect™ EM357 Mini Modules
Page 4
TRANSCEIVER IC
CEL’s MeshConnect EM357 Mini Modules use the Ember EM357 transceiver IC. This IC incorporates the RF transceiver
with the baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent
low cost high performance solution for all IEEE 802.15.4 / ZigBee applications.
For more information about the Ember EM357 IC, visit http://www.ember.com
ANTENNA
CEL’s MeshConnect EM357 Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional
conguration with a Castellation pin is available for a connection to a 50-ohm external antenna of the user’s choice.
However use of an external antenna is not covered by the module's certication. See Ordering Information on page 1.
The PCB antenna employs a topology that is compact and highly efcient. To maximize range, an adequate ground plane
must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute signicantly to the
antenna performance (it should not be directly under the module PCB Antenna). The position of the module on the host board
and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and
can result in reection, diffraction, and/or scattering of the transmitted signal.
For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging
the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the
module, up to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on
a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your
PCB layout.
Here are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metalized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or
lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the
antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne
d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les
risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de
sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une
communication satisfaisante.

CEL’s MeshConnect EM357 High Power Module (ZICM357SP2) includes a Power Amplier (PA). This PA delivers
high efciency, high gain, and high output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable
transmission for fewer nodes in a network.

CEL’s MeshConnect EM357 Mini Modules are ideal platforms for the EmberZNet PRO™, the industry’s most deployed and
eld proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee
protocol software package containing all the elements required for mesh networking applications. For more information
regarding the software development for this IC, visit http://www.ember.com
CEL provides reference software that runs multiple functions and executes various commands. The rmware allows the
execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example, users can setup a simple
ZigBee Point-to-Point network to perform Range and Packet Error Rate (PER) tests. The software can also place the module
in various operating modes, which allows for setting and/or testing various parameters.
The ZICM357SP0 uses the transceiver's Primary RF ports for transmitting and should use power mode 1.
The ZICM357SP2 uses the transceiver's Alternate RF ports for transmitting and should use power mode 2.
MeshConnect™ EM357 Mini Modules
Page 5

Description  Module 
Min 
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power ZICM357SP0
ZICM357SP2
–
–
+15
+5 dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.

Description  Module 
Min Typ 
Power Supply Voltage (VDD)2.1 3.3 3.6 VDC
Input Frequency 2405 –2480 MHz
Ambient Temperature Range -40 25 85 °C
DC CHARACTERISTICS (@ 25⁰ C, VDD = 3.3V, ZICM357SP0 TX power mode 1, ZICM357SP2 TX power mode 2)
Description ™ ZICM357SPx Module 
Min Typ 
Transmit Mode Current @ 8dBm
ZICM357SP0
–44 – mA
Transmit Mode Current @ 0dBm – 31 – mA
Receive Mode Current – 30 – mA
Transmit Mode Current @ 20dBm
ZICM357SP2
–150 – mA
Transmit Mode Current @ 0dBm – 58 – mA
Receive Mode Current – 34 – mA
Sleep Mode Current – 1– µA
RF CHARACTERISTICS (@ 25⁰ C, VDD = 3.3V, ZICM357SP0 TX power mode 1, ZICM357SP2 TX power mode 2)
Description ™ ZICM357SPx Module 
Min Typ 

RF Frequency Range 2405 –2480 MHz
RF Channels 11 – 26 –
Frequency Error Tolerance -96.2 –96.2 kHz
Transmitter
Maximum Output Power
ZICM357SP0
– 8 – dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 5 35 %
Maximum Output Power
ZICM357SP2
– 20 21 dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 5 35 %
Receiver
Sensitivity (1% PER, boost mode) ZICM357SP0 –-100 -94 dBm
Saturation (maximum input level) 0 – – dBm
Sensitivity (1% PER, normal mode) ZICM357SP2 –-103 -97 dBm
Saturation (maximum input level) -10 – – dBm
MeshConnect™ EM357 Mini Modules
Page 6

CEL’s MeshConnect module has 33 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module
Dimensions shows the layout of the 33 edge castellations.

CEL MeshConnect
ZICM357SPx Module
Pin Number
Ember EM357
IC Pin Number Name Notes
1, 2, 12, 31, 33 49 GROUND
3 11 PC5
Digital I/O
TX_ACTIVE - Logic-level control for PA. The EM35x baseband controls TX_
ACTIVE and drives it high when in TX mode.
Applies only to the ZICM357SP0. PC5 is a NC on the ZICM357SP2
4 12 RESET Acve Low chip reset (Input)
5 13 PC6
Digital I/O
OSC32B - 32.768 kHz crystal oscillator
nTX_ACTIVE - Inverted TX_ACTIVE signal
6 14 PC7
Digital I/O
OSC32A - 32.768 kHz crystal oscillator
OSC32_EXT - Digital 32.768 kHz clock input source
7 18 PA7
Digital I/O
TIM1C4 - Timer 1 Channel 4 input/output
REG_EN - External regulator open drain output
8 19 PB3
Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC1nCTS - UART CTS handshake of Serial Controller 1
SC1SCLK - SPI master/slave clock of Serial Controller 1
9 20 PB4
Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC1nRTS - UART RTS handshake of Serial Controller 1
SC1nSSEL - SPI slave select of Serial Controller 1
10 21 PA0
Digital I/O
TIM2C1 - Timer 2 Channel 1 input/output
SC2MOSI - SPI master data out/slave data in of Serial Controller 2
11 22 PA1
Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC2SDA - TWI data of Serial Controller 2
SC2MISO - SPI master data in/slave data out of Serial Controller 2
13 16, 23, 28, 37 VCC
14 24 PA2
Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC2SCL - TWI clock of Serial Controller 2
SC2SCLK - SPI master/slave clock of Serial Controller 2
15 25 PA3
Digital I/O
TIM2C2 - Timer 2 channel 2 input/output
SC2nSSEL - SPI slave select of Serial Controller 2
TRACECLK - Synchronous CPU trace clock
16 26 PA4
Digital I/O
ADC4 - ADC Input 4
PTI_EN - Frame signal of Packet Trace Interface (PTI)
TRACEDATA2 - Synchronous CPU trace data bit 2
17 27 PA5
Digital I/O
ADC5 - ADC Input 5
PTI_DATA - Data signal of Packet Trace Interface (PTI)
nBOOTMODE - Embedded serial bootloader acvaon out of reset
TRACEDATA3 - Synchronous CPU trace data bit 3
18 29 PA6 Digital I/O
TIM1C3 - Timer 1 channel 3 input/output
MeshConnect™ EM357 Mini Modules
Page 7
19 30 PB1
Digital I/O
SC1MISO - SPI slave data out of Serial Controller 1
SC1MOSI - SPI master data out of Serial Controller 1
SC1SDA - TWI data of Serial Controller 1
SC1TXD - UART transmit data of Serial Controller 1
TIM2C1 - Timer 2 channel 1 input/output
20 31 PB2
Digital I/O
SC1MISO - SPI master data in of Serial Controller 1
SC1MOSI - SPI slave data in of Serial Controller 1
SC1SCL - TWI clock of Serial Controller 1
SC1RXD - UART receive data of Serial Controller 1
TIM2C2 - Timer 2 channel 2 input/output
21 32 JTCK JTAG clock input from debugger
SWCLK - Serial Wire clock input/output with debugger
22 33 PC2
Digital I/O
JTD0 - JTAG data out to debugger
SWO - Serial Wire Output asynchronous trace output to debugger
23 34 PC3 Digital I/O
JTDI - JTAG data in from debugger
24 35 PC4
Digital I/O
JTMS - JTAG mode select from debugger
SWDIO - Serial Wire bidireconal data to/from debugger
25 36 PB0
Digital I/O
VREF - ADC reference input/output
IRQA - External interrupt source A
TRACECLK - Synchronous CPU trace clock
TIM1CLK - Timer 1 external clock input
TIM2MSK - Timer 2 external clock mask input
26 38 PC1
Digital I/O
ADC3 - ADC Input 3
SWO - Serial Wire Output asynchronous trace output to debugger
TRACEDATA0 - Synchronous CPU trace data bit 0
27 40 PC0
Digital I/O
JRST - JTAG reset input from debugger
IRQD - Default external interrupt source D
TRACEDATA1 - Synchronous CPU trace data bit 1
28 41 PB7
Digital I/O
ADC2 - ADC Input 2
IRQC - Default external interrupt source C
TIM1C2 - Timer 1 channel 2 input/output
29 42 PB6
Digital I/O
ADC1 - ADC Input 1
IRQB - External interrupt source B
TIM1C1 - Timer 1 channel 1 input/output
30 43 PB5
Digital I/O
ADC0 - ADC Input 0
TIM2CLK - Timer 2 external clock input
TIM1MSK - Timer 1 external clock mask input
32 NC RF Out Castellaon Pin for external Antenna
(Continued)
CEL MeshConnect
ZICM357SPx Module
PIN Number
Ember EM357
IC Pin Number Name Notes
Note: PC5 Applies only to the ZICM357SP0. PC5 is a NC on the ZICM357SP2
MeshConnect™ EM357 Mini Modules
Page 8

Note: All dimensions are +/- 0.005" unless otherwise specied.
0.655”
0.940”
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
0.062”
0.152” MAX
EM357
Series
ARM
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
EM357
Series
ARM
0000-00-00-00-000
EM300 Series Module
ZICM35xSPx
Pin 1
Pin 11 Pin 22
Pin 33
™ EM357 Mini Modules
MeshConnect™ EM357 Mini Modules


Note: Dimensions are in Inches.
Note: For layout recommendation for optimum antenna performance, refer to the Antenna section in this document.
MeshConnect™ EM357 Mini Modules
Page 10
PROCESSING

Parameters Values
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TL 60-150 sec
Tpeak 250ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-
cation. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.

Only a single reow soldering process is encouraged for host boards.

If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711)
MeshConnect™ EM357 Mini Modules
Page 11
AGENCY CERTIFICATIONS 
PROCESSING (Continued)

The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable
and the solder joint and module should not exceed the maximum peak reow temperature of 250 ºC.
Caution
If temperature ramps exceed the reow temperature prole, module and component damage may occur due to thermal
shock. Avoid overheating.

Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty
coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customer's own risk. The ground pins at the module perimeter should be sufcient for optimum immunity to
external RF interference.
The following Certications are in progress:
ZICM357SP0-1: FCC, IC, CE
ZICM357SP2-1: FCC, IC

This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible
d'en compromettre le fonctionnement.

Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.

The MeshConnect Module has been certied per FCC Part 15 rules and to Industry Canada license-exempt RSS Stan-
dards for integration into products without further testing or certication. To fulll the FCC and IC certication requirements,
the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on
the outside of the nal product. The MeshConnect Module is labeled with its own FCC ID Number and IC ID Number. IF the
FCC ID and the IC ID are not visible when the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording
such as the following:
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP0” or “Contains FCC ID: W7Z-ZICM357SP0”
“Contains Transmitter Module IC:8254A-ZICM357SP0" or "Contains IC: 8254A-ZICM357SP0”
or
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP2” or “Contains FCC ID: W7Z-ZICM357SP2”
“Contains Transmitter Module IC: 8254A-ZICM357SP2" or "Contains IC: 8254A-ZICM357SP2”
MeshConnect™ EM357 Mini Modules
Page 12
AGENCY CERTIFICATIONS (Continued)
The OEM of the MeshConnect Module may only use the approved antenna, (PCB Trace Antenna) that has been certied
with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with Uninten-
tional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.

The term "IC" before the certication / registration number only signies that the Industry Canada technical specications
were met.

Le terme "IC" devant le numéro de certication / d'enregistrement signie seulement que les spécications techniques Indus-
trie Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld
in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php

Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne
pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6,
disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php

The MeshConnect ZICM357SP0 module has been tested and certied for use in the European Union.

If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on le as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.
OEM Labeling Requirements
The CE mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:
· If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.
· The CE mark must be a minimum of 5mm in height
· If the use of the module is subject to restrictions in the end application, the CE
marking on the OEM product should also include the alert sign as shown in the
picture to the right.
MeshConnect™ EM357 Mini Modules
Page 13


The MeshConnect Modules are delivered in trays of 66 units (per tray).
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.

The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may de-
stroy or damage the module permanently.

The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized
in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.

MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
AGENCY CERTIFICATIONS (Continued)
Software Compliance
The ZICM357SP2 requires software restrictions to meet agency certication requirements. These restrictions have been
implemented in the sample application included with the software development kit.
If a customer is not starting with CEL's software development kit, they must implement these output power restrictions to
use the ZICM357SP2 FCC or IC certication:
  Valid TX
Power Steps

Output Power
ZICM357SP0
FCC/IC
11 - 25 8 8 dBm
26 0 1 dBm
ETSI 11 - 26 8 8 dBm
ZICM357SP2 FCC/IC
11 - 24 -2 20 dBm
25 -6 17 dBm
26 -26 -3 dBm

CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610
specication, Class II. Our modules go through JESD22 qualication processes which includes high temperature operating life
tests, mechanical shock, temperature cycling, humidity and reow testing. CEL conducts RF and DC factory testing on 100%
of all production parts.
CEL builds the quality into our products, giving our customers condence when integrating our products into their systems.
MeshConnect™ EM357 Mini Modules
Page 14
REFERENCES & REVISION HISTORY
Previous Versions  
0011-00-07-00-000
March 29, 2012 Initial preliminary datasheet. N/A
0011-00-07-00-000
(Issue A) April 11, 2012 Added FCC certication and shipping information; edited "Features" section 1, 13
0011-00-07-00-000
(Issue B) May 4, 2012 Updated Min./Multiple values 1, 13
0011-00-07-00-000
(Issue C) May 25, 2012 Updated Software Compliance table 13
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specications of CEL products. Not all products and/or types are available in every country. Please
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

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