Computime CT-EM2603 Zigbee Module User Manual ZigBee Ready RF Transceiver Modules

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Document ID	825672
Application ID	8DdeZB3kFsc2BCkRvgSFqw==
Document Description	Users Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	36.51kB (456331 bits)
Date Submitted	2007-08-06 00:00:00
Date Available	2007-08-06 00:00:00
Creation Date	2007-08-06 23:34:16
Producing Software	Acrobat Distiller 7.0 (Windows)
Document Lastmod	2007-08-06 23:34:47
Document Title	ZigBeeâ„¢- Ready RF Transceiver Modules
Document Creator	Acrobat PDFMaker 7.0 for Word
Document Author:	rnd-gordonqian

ZigBee- Ready RF Transceiver Modules
Table of Content
1.0 General Description.................................................................................................................2
2.0 Applications...............................................................................................................................2
3.0 Features.....................................................................................................................................2
4.0 Absolute Maximum Ratings....................................................................................................3
5.0 Recommended Operating Conditions...................................................................................3
6.0 Electrical Specifications...........................................................................................................3
7.0 Introduction................................................................................................................................4
8.0 Typical application block.........................................................................................................5
9.0 Pin Assignment.........................................................................................................................5
10.0 Pin Description..........................................................................................................................6
11.0 Block Diagram...........................................................................................................................8
12.0 Circuit Description....................................................................................................................8
13.0 SIF Module Programming and Debug Interface..................................................................9
14.0 Power Management.................................................................................................................9
15.0 RF Frequency Detail..............................................................................................................10
16.0 Antenna Design Considerations...........................................................................................10
17.0 PCB Layout Recommendations...........................................................................................13
18.0
FCC Approvals........................................................................................................................14
19.0 Mechanical Dimensions........................................................................................................15
20.0 Ordering Information..............................................................................................................15
21.0 Document Revision History...................................................................................................16
ZigBee- Ready RF Transceiver Modules
1.0 General Description
The CT-EM260 RF Transceiver Modules is compact surface mounted modules specially
designed for Ember ZigBee™ protocol stack for wireless networks, EmberZNet, based on IEEE
802.15.4 standard in the 2.4GHz world-wide ISM band. The complete module is only 20.32 x
25.52 x 3 mm（integrated antenna version）and 20.32 x 19.53 x 3mm (external antenna
version).They both integrate a 2.4GHz, IEEE 802.15.4-compliant transceiver with a 16-bit
network processor (XAP2b core) to run EmberZNet. They contain embedded Flash and
integrated RAM for program and data storage. It utilizes the non-intrusive SIF module for
powerful software debugging and programming of the network processor.
2.0 Applications
Home
automation &
building
control
Home
appliances &
alarms
Monitoring of
remote
systems
Security
systems &
lighting
controls
Sensor data
capture in
embedded
networks
3.0 Features
Complete ZigBee-ready module with or without integrated chip antenna
Integrated IEEE 802.15.4 PHY and MAC layer
12MHz XAP2b 16-bit network processor core
Non-intrusive debug interface (SIF)
SPI interface for communication and controlled by the Host using the EmberZNet Serial
Protocol (EZSP)
Internal RC oscillator for timer
High performance direct sequence spread spectrum (DSSS) RF transceiver
16 channels in the 2.4 GHz ISM band
On-chip regulator for 2.1-3.6V operation , three sleep low power modes
4.0 Absolute Maximum Ratings
Parameter
Test
Conditions
Min.
Max.
Unit
Regulator voltage (VDD_PADS)
0.3
3.6
Voltage on nSSEL INT, MOSI, MISO, SCLK,
nSSEL, PTI_EN, PTI_DATA, nHOST_INT,
SIF_CLK,
SIF_MISO,
SIF_MOSI,
nSIF_LOAD,
SDBG,
LINK_ACTIVITY,
nWAKE, nRESET
0.3
VDD_PADS+0.3
Storage temperature
- 40
+ 140
°C
Under no circumstances should the absolute maximum ratings given above be violated. Stress
exceeding one or more of the limiting values may cause permanent damage to the device.
5.0 Recommended Operating Conditions
Parameter
Test
Min.
Typ.
Max.
Unit
3.6
1.9
+ 85
°C
Conditions
Regulator input voltage (VDD_PADS)
2.1
Core input voltage (VDD_24MHZ, VDD_VCO,
VDD_RF, VDD_IF, VDD_PADSA, VDD_FLASH,
VDD_SYNTH_PRE, VDD_CORE)
1.7
Temperature range
- 40
1.8
6.0 Electrical Specifications
T=25℃, VCC = 3.0V, Fo =2450MHZ, if nothing else stated.
Parameter
Min
Typ. Max
Operating
frequency
Number
of
channels
Channel spacing
Input/output
impedance
Data rate
DSSS chip rate
Frequency
stability
Transmit power
2400
2450
Unit
Condition / Note
MHz
Programmable in 5MHz steps, 5 MHz
steps for IEEE 802.15.4 compliance
16
For IEEE 802.15.4 compliance
50
MHz
Ohm
250
+/-40
kbit/s
Mc/s
ppm
dBm
-32
Parameter
Min
Typ.
Max
For IEEE 802.15.4 compliance
Programmable from firmware
Unit
Condition / Note
Harmonic:
2nd harmonic
TBD
3rd harmonic
TBD
dBm
Spurious emission:
Complies with EN 300 328, EN 300
440, FCC CRF47 Part 15 and ARIB
STD-T66
TX 30 – 1000 MHz
1-12.75 GHz
TBD
1.8-1.9 GHz
TBD
5.15-5.3 GHz
TBD
dBm
Sensitivity
-98
dBm
Adjacent
channel
rejection +/-5 MHz
Adjacent
channel
rejection +/-10 MHz
Co-channel rejection
35/35
dB
40/40
dB
-6
Spurious
emission,
RX 30 -1000 MHz
1-12.75 GHz
Supply voltage
Current consumption,
RX
Current consumption,
TX
Quiescent current
Flash Memory
packet
Boost
at -82
at -82
dB
-57
-47
3.6
2.1
PER = 1% PER, 20byte
defined by IEEE 802.15.4
mode
IEEE 802.15.4 compliance
dBm
IEEE 802.15.4 compliance
dBm
dBm
Complies with EN 300 328, EN 300
440, FCC CRF47 Part 15 and ARIB
STD-T66
36
mA
Max RX sensitivity (boost mode)
36
mA
At max. TX power (+ 5dBm boost)
1.0
μA
Kbit
including internal RC oscillator
MCU clock frequency
RC
OSCILATOR
frequency
12
10
MHz
KHZ
7.0 Introduction
The CT-EM260 series of modules are specially designed for ZigBee application. They provide a
fast jump start design for system integrators or electronic designers wishing to use ZigBee
wireless technologies. The module contains qualified RF hardware and enough processor
power to run the EmberZNet stack or other ZigBee network stack (depending on version),
making it a powerful platform for building wireless networking products. ZigBee Coordinators
(ZC), ZigBee Routers (ZR), and ZigBee End Devices (ZED) are all supported and are
programmed onto the module together with a custom application. Minimal RF design
experience is need to use CT-EM260 modules.
8.0 Typical application block
Figure 1: Example of application circuit
9.0 Pin Assignment
Figure 2: CT-EM26500
NWAKE
NHOST_INT
NSSEL
SCLK
MISO
MOSI
Figure 3: CT-EM2601
10.0 Pin Description
Pin#
Signal
Direction
Description
SIFMISO
Serial interface, master in/slave out
SIFMOSI
Serial interface, master out/slave in
SIFLOADB
I/O
Serial interface, load strobe (open-collector with internal
pull-up)
GND
Ground
Ground
SDBG
Spare Debug signal
LINKACTIVITY
Link and Activity signal
NWAKE
Wake Interrupt signal (from Host to EM260)
NC
GND
Ground
Ground supply
10
GND
Ground
Ground supply
11
ANT
ANT
receiver input/transmitter output
12
GND
Ground
Ground supply
13
nRESET
Active low chip reset (internal pull-up)
14
NC
15
NC
Pin#
Signal
Direction
Description
Power
Pads supply (2.1-3.6V)
16
VBRD
17
NC
18
NC
19
MOSI
SPI Data, Master Out / Slave In (from Host to EM260
20
MISO
SPI Data, Master In / Slave Out (from EM260 to Host)
21
SCLK
SPI Clock (from Host to EM260)
22
NSSEL
SPI Slave Select (from Host to EM260)
23
PTIEN
Frame signal of Packet Trace Interface (PTI)
24
PTIDATA
Data signal of Packet Trace Interface (PTI)
25
NHOSTINT
Host Interrupt signal (from EM260 to Host)
26
NC
27
NC
28
NC
29
NC
30
SIFCLK
Serial interface, clock (internal pull-down)
11.0 Block Diagram
Figure 4: Block Diagram
12.0 Circuit Description
The module contains an IEEE 802.15.4 compliant RF transceiver, high speed oscillator, RC
oscillator. The module is intended to running the Ember ZigBee software or other ZigBee
network implementation, depending on the specific version.
The application software together with the ZigBee protocol software stack can be programmed
in Flash memory through SIF module, using an evaluation board from Ember InSight Desktop.
To support user-defined applications, the module exposes the Ember Serial API over the SPI,
which allows application development to occur on a Host microcontroller of choice. In addition
to the four SPI signals, two additional signals, nHOST_INT and nWAKE, provide an easy-to-use
handshake mechanism between the Host and the module. Also, an integrated voltage regulator,
power-on-reset circuitry, sleep timer, and low-power sleep modes are available. The deep sleep
mode draws less than 1μA need to further verification), allowing products to achieve long
battery life.
For further details on the transceiver (Ember EM260), please consult data sheet at
http://www.ember.com
13.0 SIF Module Programming and Debug Interface
SIF is a synchronous serial interface developed by Cambridge Consultants Ltd. It is the primary
programming and debug interface of the CT-260. The SIF module allows external devices to
read and write memory-mapped registers in real-time without changing the functionality or
timing of the XAP2b core.
The SIF interface provides the following:
IC production test (especially analog)
PCB production test
Firmware download
Product control and characterization
The pins are:
SIF_LOADB
SIF_CLK
SIF_MOSI
SIF_MISO
The maximum serial shift speed for the SIF interface is 48MHz. SIF interface accesses can be
initiated even when the chip is in idle, deep sleep or power down modes. An edge on
nSIF_LOAD wakes the chip to allow SIF cycles.
14.0 Power Management
The module supports four different power modes: active, idle, deep sleep, and power down.
Active mode is the normal, operating state of the module.
While in idle mode, code execution halts until any interrupt occurs. All modules including the
radio continue to operate normally. The EmberZNet stack automatically invokes idle as
appropriate.
Deep sleep mode and power down mode both power off most of the functions, including the
radio, and leave only the critical chip functions powered. The internal regulator is disabled. All
output signals are maintained in a frozen state. Upon waking from deep sleep or power down
mode, the internal regulator is re_enabled. Deep sleep and power down result in the same
sleep current consumption. The two sleep modes differ as follows: the module can wake on
both an internal timer and an external signal from deep sleep mode; power down mode can
only wake on an external signal.
15.0 RF Frequency Detail
The following table shows the RF channels as defined by the IEEE 802.15.4 standard.
RF channel
Frequency
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
2405MHz
2410MHz
2415MHz
2420MHz
2425MHz
2430MHz
2435MHz
2440MHz
2445MHz
2450MHz
2455MHz
2460MHz
2465MHz
2470MHz
2475MHz
2480MHz
The output power level can be configured in the range -32 to 5 dBm. The RF transceiver
uses direct sequence spread spectrum (DSSS) with 2 Mchip/s chip rate, giving a raw data
rate of 250 kbit/s. The modulation format is Offset – Quadrature Phase Shift Keying
(O-QPSK). It is robust even under noisy environments when sharing the same frequency
band with other applications.
The use of RF frequencies and maximum allowed RF power should according to different
national regulations. The CT-260 is complying with the applicable regulations for the world
wide 2.4GHz ISM band.
[Subject to final approval: Specifically it complies with the European Union R&TTE directive
meeting EN 300 328 and EN300 440 class 2. It also meets the FCC CFR47 Part15
regulations for use in the US and the ARIB T-66 for use in Japan.]
16.0 Antenna Design Considerations
CT-EM260 provides an integrated antenna. The design should be effective for many
applications requiring a compact solution containing all the critical RF parts within the
module. Applications requiring better range may consider an external antenna or possibly
even an external booster circuit (power amplifier).
The range testing using the integrated antenna shows a typical distance of 100 m outdoor
line-of-sight (LOS). If the application is used indoor, the range will be around 10 to 30 m,
depending on structure and building materials.
The module with antenna is matched for use in the 2.4 GHz band. Due to the dielectric
ceramic material the antenna is shorter than a normal quarter wave antenna. However, it
can still provide high radiation efficiency (typical 1 dBi). The radiating part of the antenna is
located on one side of the PCB. The radiation pattern from the antenna is shown in figure 5.
The maximum radiation is in the plane normal to the length axis of the antenna. For best
possible omni-directional radiation the module should be oriented so that the antenna is
vertical. In order to achieve best range the transmitting and receiving antenna should be
oriented the same way with same polarity. Indoors reflections of the radio waves will affect
the range.
Figure 5:
Integrated chip antenna radiation pattern at different orientations
The antenna should be kept away (> 10mm) from metallic or other conductive and dielectric
materials, and should never be used inside a metallic enclosure.
Compared to lower frequencies, operation at 2.4GHz usually has a shorter LOS. However,
the ZigBee mesh network topology provides a more flexible and reliable network topology to
end users. The farther end device can easily be reached over a mesh network through other
full function (routing) devices. Reflections from walls and other objects may give multi-path
fading resulting in dead-zones. With mesh network, other nodes in the network can reach
devices in dead-zones. Furthermore, in the case of any failure of a single node, the system
can easily reroute to other paths. The mesh network is therefore highly recommended for
increased reliability and extended coverage.
In applications where the module must be placed in a metallic enclosure, an external
antenna must be used. The external antenna must match to 50 Ohm.
A PCB antenna can be made as a copper track where the ground plane is removed on the
back side. The rest of the PCB board should have a ground plane as large as possible,
preferably as large (in one dimension) as the antenna itself, to make it act as a reflector
mirror to the antenna. A quarter-wavelength antenna on a PCB must be shorter than the
wire antenna due to the influence of the dielectric material of the PCB. The length reduction
depends on the PCB thickness and material, as well as how close to the edge of the board
the antenna is placed. Typical reduction is to 75-90 % but specific results may vary.
The length of a quarter-wave antenna is given in the table below.
Frequency
(MHz)
Length of whip antenna
(cm)
Length of PCB track
(cm)
2450
2.9
2.2 – 2.7
If, for space reasons, the track is made even shorter than the resonating quarter of
wavelength, the antenna should be matched to 50 ohms using a series inductor and a shunt
capacitor.
17.0 PCB Layout Recommendations
For recommended layout pads for the module, please reference Mechanical Dimensions.
The area underneath the module should be covered with solder resist in order to prevent
short circuiting the test pads on the back side of the module. A solid ground plane is
preferred. Unconnected pins should be soldered to the pads, and the pads should be left
floating. For the module version with integrated antenna, the RF pad can be soldered, but
the pad should not be connected further. The two ground pads (pin10 and pin12 should be
grounded for all variants.)
When using the onboard chip antenna, careful attention is required to the layout of the PCB
where the module is mounted. In Figure 6 a mother PCB is shown with a recommended
placement of the module.
Figure 6: A recommended placement of the module on a mother PCB
(Shaded area is ground-plane on mother PCB)
18.0
FCC Approvals
The CT-EM2503 has been designed to meet all national regulations for World-wide use. Using
the integrated antenna it conforms to FCC CFR 47 Part 15 (USA).
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
The device CT-EM2503 carries FCC authorization and is marked with the FCC ID Number.
Whilst any device into which this authorized module is installed will not normally be required to
obtain FCC authorization, this does not preclude the possibility that some other form of
authorization or testing may be required for the finished device.
When the CT-EM2603 module is integrated inside another device/product, then the outside
surface of that device/product must display a label referring to the enclosed module. This exterior
label can use wording such as “Contains Transmitter Module FCC ID: DI2CT-EM2603” or
“Contains FCC ID: DI2CT-EM2603”, although any similar wording that expresses the same
meaning may be used.
FCC statement：
If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
—Consult the dealer or an experienced radio/TV technician for help.
Changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate the equipment.
19.0 Mechanical Dimensions
Figure 7: Mechanical Dimensions of CT-EM2600
Figure 8: Mechanical Dimensions of CT-EM2601/2/3 modules
20.0 Ordering Information
Ordering Part Number
Description
CT-EM2600
CT-EM2601
CT-EM2602
ZigBee-ready RF module, 1kB Flash ,External antenna
ZigBee-ready RF module, 1kB Flash, Ceramic chip antenna
ZigBee-ready RF module, 1kB Flash, PCB trace antenna
FCC/CE certificate
CT-EM2603
ZigBee-ready RF module, 1kB Flash, Ceramic chip antenna
FCC/CE certificate
21.0 Document Revision History
Document Revision
change
1.0
1.1
Draft
Add FCC approval

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