Continental Automotive TIS-03 Tire Pressure Monitoring System User Manual TG1D Chrysler Functional Description V4

Continental Automotive GmbH Tire Pressure Monitoring System TG1D Chrysler Functional Description V4

User Manual

      1 of 4      Functional description   TIS-03
      2 of 4 1.  SYSTEM OVERVIEW The tire pressure monitoring system (referred as TG for Tire Guard) consists of the following units:  - Tire guard wheel unit type TIS-03 which includes an integrated pressure, temperature and acceleration sensor and a RF transmitter. - LF receiver unit which includes a LF receiver (not described in this document)   The TG monitors a vehicle's tire pressure while driving or stationary. An electronic unit (wheel unit) inside each tire, mounted to the valve stem, periodically measures the actual tire pressure. By means of RF communication, this pressure information is transmitted to the RF transmitter.  2.  TECHNICAL DESCRIPTION Carrier frequency:       433.92 MHz Number of channels:    1 Type of modulation:      Frequency Shift Keying (FSK) Baud rate:        9600bps Rated Output Power:    < 10mW Antenna:        Internal Voltage supply range :    2.1 up to 3.2V  3. TYPICAL USAGE PATTERN  3.1 AVERAGE FACTOR CALCULATION (Standard 47 CFR Part 15C (periodic intentional transmitter))  Maximum transmitting duration in whatever 100ms windows: 10.31ms   Averaging factor = 20xlog(10.31/100)=-19.73dB  4.  BLOCK DIAGRAM The block diagram below shows the main electronic units of the wheel unit:   Sensor Block Diagram              Note : The time between inter frames is always higher than the 100ms FCC window.   3 V  C R 20 5 0H R  L I THI UM  B A TT E RY Le a rnin g  LF  co il (1  axe  C o il @  1 25 K H z) R F CI RC UI T (T un n in g  C o m po n en ts) A NT E NN A  F XTH 87 0x5   (P re s sure , te m pe ra tu re,  a cc ele ratio n  s e nso r, µ co nt ro ller  &  R F  T ran s m itte r) C ry s tal:2 6 M Hz    4 3 3. 92 M H z o r 3 1 5M H z
      3 of 4  IC Block Diagram: FXTH870x5  The FXTH870x5 contains: • Microcontroller with accelerometer and pressure sensor interfaces, and RF transmitter (MCU) • Optional ranges on pressure transducers • Z-axis acceleration transducer The  MCU  interfaces  to  the  RF  transmitter  using  a  standard  memory  mapped  registers.  The transducers connect to the MCU using custom analog interfaces and inter-chip bonding wires.    5.  PICTURE
      4 of 4  6.  LABEL 1.1. USA  Continental TIS-03 FCC ID: KR5TIS-03  This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.   Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.  1.2. CANADA  Continental TIS-03 IC: 7812D-TIS03  Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
Freescale Semiconductor Document Number: FXTH870x6Data Sheet: Advance Information Rev. 1.5, 02/2015This document contains information on a new product. Specifications and information herein are subject to change without notice. An Energy-Efficient Solution by Freescale© 2014-2015 Freescale Semiconductor, Inc. All rights reserved.FXTH870x6 Tire Pressure Monitor SensorThe FXTH870x6 family is comprised of the following functions all within the same package.Features• Pressure sensor with one of two calibrated pressure ranges— 100 - 450 kPa— 100 - 900 kPa• Temperature sensor• Optional XZ- or Z-axis accelerometer with adjustable offset option• Voltage reference measured by ADC10• Six-channel, 10-bit analog-to-digital converter (ADC10) with two externalI/O inputs• 8-bit MCU— S08 Core with SIM and interrupt— 512 RAM— 8K FLASH (in addition to 8K providing factory firmware and trim data)— 64-byte, low-power, parameter registers• Dedicated state machines to sequence routine measurement andtransmission processes for reduced power consumption• Internal 315-/434-MHz RF transmitter— External crystal oscillator— PLL-based output with fractional-n divider— OOK and FSK modulation capability— Programmable data rate generator— Manchester, Bi-Phase or NRZ data encoding— 256-bit RF data buffer variable length interrupt— Direct access to RF transmitter from MCU for unique formats— Low power consumption (less than 8 mA at 434 MHz, 5 dBM at 3.0 V, 25 °C)• Differential input LF detector/decoder on independent signal pins• Seven multipurpose GPIO pins— Four pins can be connected to optional internal pullups/pulldowns and STOP4 wakeup interrupt— Two of seven pins can be connected to a channel on the ADC10— Two of seven pins can be connected to a channel on the TPM1• Real-Time Interrupt driven by LFO with interrupt intervals of8, 16, 32, 64, 128, 256, 512 or 1024 ms• Low-power, wakeup timer and periodic reset driven by LFO• Watchdog timeout with selectable times and clock sources• Two-channel general purpose timer/PWM module (TPM1)FXTH870x6Top and bottom viewTop viewPin connections24-Pin, 1-hole lid7 x 7 QFN202122232418 PTA3LFALFBBKGD/PTA4X0X11719234567PTB1PTA2PTA181RESET101112131415VDDVDDAVSSAVREGRF169PTB0N/CN/CN/CN/CN/CID Featureon top lidPTA0VSSRFVSS
FXTH870x6SensorsFreescale Semiconductor, Inc. 2• Internal oscillators— MCU bus clock of 0.5, 1, 2 and 4 MHz (1, 2, 4 and 8 MHz HFO)— Low frequency, low power time clock (LFO) with 1 ms period— Medium frequency, controller clock (MFO) of 8 sec period• Low-voltage detection• Normal temperature restart in hardware (over- or under-temperature detected by software)ORDERING INFORMATIONPart number Accelerometer axis Package Range Code1FXTH8705026T1 Z 2264 (7 x 7, 1-hole lid) 100-450 kPa $08FXTH8705116T1 XZ 2264 (7 x 7, 1-hole lid) 100-450 kPa $0CFXTH8709026T1 Z 2264 (7 x 7, 1-hole lid) 100-900 kPa $18FXTH8709116T1 XZ 2264 (7 x 7, 1-hole lid) 100-900 kPa $1CFXTH8709126T1 XZ Ext. Range 2264 (7 x 7, 1-hole lid) 100-900 kPa $1ECode1 Code0FXTH8709226T1 XZ 2264 (7 x 7, 1-hole lid) 100-900 kPa $1C Rel11Related DocumentationThe FXTH870x6 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents:1. Go to the Freescale homepage at:http://www.freescale.com/2. In the Keyword search box at the top of the page, enter the device number FXTH870x6.
FXTH870x6SensorsFreescale Semiconductor, Inc. 3Contents1 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  61.1 Overall Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  61.2 Multi-Chip Interface  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  61.3 System Clock Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  61.4 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  82 Pins and Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  92.1 Package Pinout  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  92.2 Recommended Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  92.3 Signal Properties  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  103 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  133.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  133.2 RUN Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  133.3 WAIT Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  133.4 ACTIVE BACKGROUND Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  133.5 STOP Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  144 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  174.1 MCU Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  174.2 Reset and Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  174.3 MCU Register Addresses and Bit Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  184.4 High Address Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  224.5 MCU Parameter Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  224.6 MCU RAM  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  224.7 FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  234.8 Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  284.9 FLASH Registers and Control Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  295 Reset, Interrupts and System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  335.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  335.2 MCU Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  335.3 Computer Operating Properly (COP) Watchdog  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  335.4 SIM Test Register (SIMTST)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  345.5 Interrupts  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  355.6 Low-Voltage Detect (LVD) System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  385.7 System Clock Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  385.8 Keyboard Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  385.9 Real Time Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  395.10 Temperature Sensor and Restart System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  405.11 Reset, Interrupt and System Control Registers And Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  405.12 System STOP Exit Status Register (SIMSES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  456 General Purpose I/O. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  466.1 Unused Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  486.2 Pin Behavior in STOP Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  486.3 General Purpose I/O Registers  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  486.4 Port A Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  486.5 Port B Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  497 Keyboard Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  517.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  517.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  517.3 Block Diagram  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  517.4 External Signal Description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  517.5 Register Definitions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  527.6 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  538 Central Processing Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  548.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  548.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  548.3 Programmer’s Model and CPU Registers  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  558.4 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  578.5 Special Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  588.6 HCS08 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  59
FXTH870x6Sensors4Freescale Semiconductor, Inc.9 Timer Pulse-Width Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  709.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  709.2 TPM1 Configuration Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  709.3 External Signal Description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  719.4 Register Definition  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  729.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  779.6 TPM1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8010 .Other MCU Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8210.1 Pressure Measurement  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8210.2 Temperature Measurements  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8310.3 Voltage Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8310.4 Optional Acceleration Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8310.5 Optional Battery Condition Check  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8310.6 Measurement Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8510.7 Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8711 Periodic Wakeup Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8911.1 Block Diagram  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8911.2 Wakeup Divider Register - PWUDIV  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9011.3 PWU Control/Status Register 0 - PWUCS0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9011.4 PWU Control/Status Register 1 - PWUCS1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9111.5 PWU Wakeup Status Register - PWUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9211.6 Functional Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9212 LF Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9312.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9412.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9412.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9412.4 Input Amplifier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9512.5 LFR Data Mode States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9512.6 Carrier Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9512.7 Auto-Zero Sequence  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9712.8 Data Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9712.9 Data Clock Recovery and Synchronization  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9712.10 Manchester Decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9712.11 Duty-Cycle For Data Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9812.12 Input Signal Envelope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9912.13 Telegram Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10012.14 Error Detection and Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10112.15 Continuous ON Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10112.16 Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10112.17 LFR Register Definition  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  10213 RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11313.1 RF Data Modes  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11313.2 RF Output Buffer Data Frame  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11413.3 Transmission Randomization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11613.4 RFM in STOP1 Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11913.5 Data Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11913.6 RF Output Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12113.7 RF Interrupt  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12213.8 Datagram Transmission Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12213.9 RFM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12313.10 RFM Control Register 1 - RFCR1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12313.11 RFM Control Register 2 - RFCR2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12413.12 RFM Control Register 3 - RFCR3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12713.13 RFM Control Register 4 - RFCR4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12813.14 RFM Control Register 5 - RFCR5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12813.15 RFM Control Register 6 - RFCR6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12913.16 RFM Control Register 7 - RFCR7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12913.17 PLL Control Registers A- PLLCR[1:0], RPAGE = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13013.18 PLL Control Registers B- PLLCR[3:2], RPAGE = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13113.19 EPR Register - EPR (RPAGE = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13213.20 RF DATA Registers - RFD[31:0]  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13313.21 VCO Calibration Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  134
FXTH870x6SensorsFreescale Semiconductor, Inc. 514 Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13514.1 Software Jump Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13514.2 Function Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13514.3 Memory Resource Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14015 Development Support  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14115.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14115.2 Background Debug Controller (BDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14115.3 Register Definition  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14616 Battery Charge Consumption Modeling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14916.1 Standby Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14916.2 Measurement Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14916.3 Transmission Events  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14916.4 Total Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14917 Electrical Specifications  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15017.1 Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15017.2 Operating Range  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15017.3 Electrical Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15117.4 Power Consumption (MCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15217.5 Control Timing  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15317.6 Voltage Measurement Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15417.7 Temperature Measurement Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15517.8 Pressure Measurement Characteristic (100 to 450 kPa ranges) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15617.9 Pressure Measurement Characteristic (100 to 900 kPa Ranges)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15717.10 Optional Acceleration Sensor Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15817.11 LFR Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16117.12 LFR Characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16217.13 LFR Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16217.14 RF Output Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16417.15 Power Consumption RF Transmissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16618 Mechanical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16818.1 Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16818.2 Media Compatibility  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16818.3 Mounting Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  16819 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17020 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  174
FXTH870x6Sensors6Freescale Semiconductor, Inc.1 General Information1.1 Overall Block DiagramThe block diagram of the FXTH870x6 is shown in Figure 1. This diagram covers all the main blocks mentioned above and their main signal interactions. Power management controls and bus control signals are not shown in this block diagram for clarity.1.2 Multi-Chip InterfaceThe FXTH870x6 contains two to three devices using the best process technology for each.• Microcontroller with accelerometer and pressure sensor interfaces, and RF transmitter (MCU)• Optional ranges on pressure transducers• Optional XZ- or Z-axis acceleration transducerAs shown in Figure 1 the MCU interfaces to the RF transmitter using a standard memory mapped registers. The transducers connect to the MCU using custom analog interfaces and inter-chip bonding wires.1.3 System Clock DistributionThe various clock sources and their distribution are shown in Figure 2. All clock sources except the low frequency oscillator, LFO, can be turned off by software control in order to conserve power.
FXTH870x6SensorsFreescale Semiconductor, Inc. 7Figure 1. FXTH870x6 Overall Block Diagram8K USERFLASHMEMORYRAMMEMORY512TPM1TIMER/PWM2-CHANLVDRTITIMERMCU CORES08AVDDTEMP AVDDAVSSTEMPSENSORPRESSSENSORBANDGAPREFLFAPTA1ADC1010-BIT6-CHANTEMPBKGD/LFB64 BytePARAMETERREGISTERDATAENCODEBITRATE256-BITDATABUFFERRFAMPVCO/PLLFRACTLDIVIDERXTALOSCXIXORFMCUTRANSDUCERSVOLTREGRESTARTOSCGENPWUTIMERMFO8 SecRESETLFRECVRDXVSENSVTPV0LFO1 msLFISMIZHFO1, 2, 4 or 8MHzGPI/OKEYKBIBOARDWAKEUPMFO8KFIRMWAREMEMORYPTA0PSENSOR MEASUREMENT(SMI)RF CONTROLLERINTERFACELFO(LFR)RFMVREGPTA2VDDVDDVSSRVSSPTA3V1V2RF LVDAVDDRFVDDVREGPTB0PTB1PTA4XZXZACCEL(OPTION)ZACCEL(OPTION)
FXTH870x6Sensors8Freescale Semiconductor, Inc.Figure 2.  Clock Distribution1.4 Reference DocumentsThe FXTH870x6 utilizes the standard product MC9S08 CPU core. The user can obtain further detail on the full capabilities of this core by referring to the HCS08 Family Reference Manual (HCS08RMV1).RTISYSTEMCONTROLLOGIC 2HFO OSC1, 2, 4,  fOSC fBUSCPUBDCTPM1RAM FLASHLFRADC10MFOOSC8 SecPWUCLSA, CLKSBfLFO (1 kHz)XTLOSC26 MHzXI XO PLL VCOBITRATEDATABUFFERPRESSURESENSORTRANSDUCERSMCURTICLKSPARREGfMFOfXCOGENDX (500 kHz)LFOOSC1 mSPERIODSENSOR MEASUREMENTINTERFACEADC10CLOCKADCCLK ADC10BUSCLKS[1:0]WATCHDOGCOPCLKSZ-AXISSENSORLF4 kbps(125 kHz)RF STATEMACHINELFROOSCILL 8TCLKDIVLFOSELfMFOPTA3PTA2fLFO (1 kHz)CH0 CH1RANDOM(0 - 1 MHz)RANDOM(0 - 1 MHz)RFOUT 41.67 kHzSampling41.67 kHzSamplingand 8 MHzX-AXISSENSOR41.67 kHzSampling
FXTH870x6SensorsFreescale Semiconductor, Inc. 92 Pins and ConnectionsThis section describes the pin layout and general function of each pin.2.1 Package PinoutThe pinout for the FXTH870x6 device QFN package is shown in Figure 3 for the orientation of the pressure port up. The orientation of the internal Z-axis accelerometer is shown in Figure 4.Figure 3. FXTH870x6 QFN Package PinoutFigure 4. FXTH870x6 QFN Optional Z-axis Accelerometer Orientation2.2 Recommended ApplicationExample of a simple OOK/FSK tire pressure monitors using the internal PLL-based RF output stage is shown in Figure 5. Any of the PTA[3:0] pins can also be used as general purpose I/O pins. Any of the PTA[3:0] pins that are not used in the application should be handled as described in Section 6.1.202122232418 PTA3LFALFBBKGD/PTA4X0X11719234567PTB1PTA2PTA181RESET101112131415VDDVDDAVSSAVREGRF169PTB0N/CN/CN/CN/CN/CID Featureon top lidPTA0VSSRFVSSN/C = No Connect: Do not connect PCB pads to signal traces, power/ground or multi-layer via.Top ViewBKGD/PTA4X-AXISORIENTATION+X-XY-AXISORIENTATION+Y-YSide ViewPressurePortPOSITIVE ACCELERATION MOVES MASSIN +Z DIRECTION (VALUE INCREASES)Z-AXISORIENTATION+Z-Z
FXTH870x6Sensors10 Freescale Semiconductor, Inc.2.3 Signal PropertiesThe following sections describe the general function of each pin.Figure 5. FXTH870x6 Example Application2.3.1 VDD and VSS PinsThe digital circuits operate from a single power supply connected to the FXTH870x6 through the VDD and VSS pins. VDD is the positive supply and VSS is the ground. The conductors to the power supply should be connected to the VDD and VSS pins and locally decoupled as shown in Figure 6.Care should be taken to reduce measurement signal noise by separating the VDD, VSS, AVDD, AVSS and RVSS pins using a “star” connection such that each metal trace does not share any load currents with other external devices as shown in Figure 6.2.3.2 AVDD and AVSS PinsThe analog circuits operate from a single power supply connected to the FXTH870x6 through the AVDD and AVSS pins. AVDD is the positive supply and AVSS is the ground. The conductors to the power supply should be connected to the AVDD and AVSS pins and locally decoupled as shown in Figure 6.FXTH870xxx0.1 µFVDDVSS3.0 VBATTERYLFCOILXTALRFRVSSXIXOC1ANTL1BKGD/PTA4LFALFBPTA1RESETGENERALPURPOSE I/OPTA0PTA2AVDDAVSSVREG470 nF0.1 µFPTA3MATCHINGNETWORKC2 C3C2, C3, C4optimizedfor crystalC5C4*R2 R3R2 and R3, <10 krecommended forhighest EMC resistanceR1PTB0PTB1L1 and matching network optimized for specific PWB and antenna layout. Recommend 0603 minimum size for L1 and other matching network inductors for maximum efficiency.C1 and R1 optimized for coil used, but recommended RC < 15.3 sec.The device C4, although drawn here as a capacitor, may be any type of passive component(s) sufficient to block or reduce unwanted external radiated signals from corrupting the crystal oscillator circuit: PCB traces for the LFA / LFB, AVDD / VDD, and VSS / AVSS pins and bypass capacitors should be minimized to reduce unwanted external radiated signals from corrupting the power input circuits.
FXTH870x6SensorsFreescale Semiconductor, Inc. 11Care should be taken to reduce measurement signal noise by separating the VDD, VSS, AVDD, AVSS and RVSS pins using a “star” connection such that each metal trace does not share any load currents with other external devices as shown in Figure 6.Figure 6. Recommended Power Supply Connections2.3.3 VREG PinThe internal regulator for the analog circuits requires an external stabilization capacitor to AVSS.2.3.4 RVSS PinPower in the RF output amplifier is returned to the supply through the RVSS pin. This conductor should be connected to the power supply as shown in Figure 6 using a “star” connection such that each metal trace does not share any load currents with other supply pins.2.3.5 RF PinThe RF pin is the RF energy data supplied by the FXTH870x6 to an external antenna.2.3.6 XO, XI PinsThe XO and XI pins are for an external crystal to be used by the internal PLL for creating the carrier frequencies and data rates for the RF pin.2.3.7 LF[A:B] PinsThe LF[A:B] pins can be used by the LF receiver (LFR) as one differential input channel for sensing low level signals from an external low frequency (LF) coil. The external LF coil should be connected between the LFA and the LFB pins.Signaling into the LFR pins can place the FXTH870x6 into various diagnostic or operational modes. The LFR is comprised of the detector and the decoder.Each LF[A:B] pin will always have an impedance of approximately 500 k to VSS due to the LFR input circuitry. The LFA/LFB pins are used by the LFR when the LFEN control bit is set and are not functional when the LFEN control bit is clear.2.3.8 PTA[1:0] PinsThe PTA[1:0] pins are general purpose I/O pins. These two pins can be configured as normal bidirectional I/O pins with programmable pullup or pulldown devices and/or wakeup interrupt capability; or one or both can be connected to the two input channels of the A/D converter module. The pulldown devices can only be activated if the wakeup interrupt capability is enabled. User software must configure the general purpose I/O pins so that they do not result in “floating” inputs as described in Section 6.1. PTA[1:02] map to keyboard Interrupt function bits [1:0].0.1 µFFXTH870xxxVDDVSSto otherBatteryIDD ILOADBypass capacitorsclosely coupled to the package pinsFXTH870xxx and Other Load Currents star connected to battery terminalsloads0.1 µFAVDDAVSSRVSSThe decoupling devices, although drawn here as 0.1 F capacitors, may be any type of passive component(s)sufficient to block or reduce unwantedexternal radiated signals from corruptingthe power input protection circuits; application tuning may be required.
FXTH870x6Sensors12 Freescale Semiconductor, Inc.2.3.9 PTA[3:2] PinsThe PTA[3:2] pins are general purpose I/O pin. These two pins can be configured as normal bidirectional I/O pin with programmable pullup or pulldown devices and/or wakeup interrupt capability; or one or both can be connected to the two input channels of the Timer Pulse Width (TPM1) module. The pulldown devices can only be activated if the wakeup interrupt capability is enabled. User software must configure the general purpose I/O pins so that they do not result in “floating” inputs as described in Section 6.1. PTA[3:2] map to keyboard Interrupt function bits [3:2].2.3.10 BKGD/PTA4 PinThe BKGD/PTA4 pin is used to place the FXTH870x6 in the BACKGROUND DEBUG mode (BDM) to evaluate MCU code and to also transfer data to/from the internal memories. If the BKGD/PTA4 pin is held low when the FXTH870x6 comes out of a power-on reset the device will go into the ACTIVE BACKGROUND DEBUG mode (BDM).The BKGD/PTA4 pin has an internal pullup device and can connected to VDD in the application unless there is a need to enter BDM operation after the device as been soldered into the PWB. If in-circuit BDM is desired the BKGD/PTA4 pin can be left unconnected, but should be connected to VDD through a low impedance resistor (< 10 k) which can be over-driven by an external signal. This low impedance resistor reduces the possibility of getting into the debug mode in the application due to an EMC event.2.3.11 RESET PinThe RESET pin is used for test and establishing the BDM condition and providing the programming voltage source to the internal FLASH memory. This pin can also be used to direct to the MCU to the reset vector as described in Section 5.2.The RESET pin has an internal pullup device and can connected to VDD in the application unless there is a need to enter BDM operation after the device as been soldered to the PWB. If in-circuit BDM is desired the RESET pin can be left unconnected; but should be connected to VDD through a low impedance resistor (< 10 k) which can be over-driven by an external signal. This low impedance resistor reduces the possibility of getting into the debug mode in the application due to an EMC event.Activation of the external reset function occurs when the voltage on the RESET pin goes below 0.3 x VDD for at least 100 nsec before rising above 0.7 x VDD as shown in Figure 7.Figure 7. RESET Pin Timing2.3.12 PTB[1:0] PinsThe PTB[1:0] pins are general purpose I/O pins. These two pins can be configured as nominal bidirectional I/O pins with programmable pullup. User software must configure the general purpose I/O pins so that they do not result in “floating” inputs as described in Section 6.1RESET0.7 VDD0.3 VDD> 100 nsecResetInitiated
FXTH870x6SensorsFreescale Semiconductor, Inc. 133 Modes of OperationThe operating modes of the FXTH870x6 are described in this section. Entry into each mode, exit from each mode, and functionality while in each of the modes are described.3.1 Features• ACTIVE BACKGROUND DEBUG mode for code development• STOP modes:— System clocks stopped— STOP1: Power down of most internal circuits, including RAM, for maximum power savings; voltage regulator in standby— STOP4: All internal circuits powered and full voltage regulation maintained for fastest recovery3.2 RUN ModeThis is the normal operating mode for the FXTH870x6. This mode is selected when the BKGD/PTA4 pin is high at the rising edge of reset. In this mode, the CPU executes code from internal memory following a reset with execution beginning at address specified by the reset pseudo-vector ($DFFE and $DFFF).3.3 WAIT ModeThe WAIT mode is also present like other members of the Freescale S08 family members; but is not normally used by the FXTH870x6 firmware or typical TPMS applications.3.4 ACTIVE BACKGROUND ModeThe ACTIVE BACKGROUND mode functions are managed through the BACKGROUND DEBUG controller (BDC) in the HCS08 core. The BDC provides the means for analyzing MCU operation during software development.ACTIVE BACKGROUND mode is entered in any of four ways:• When the BKGD/PTA4 pin is low at the rising edge of a power up reset• When a BACKGROUND command is received through the BKGD/PTA4 pin• When a BGND instruction is executed by the CPU• When encountering a BDC breakpointOnce in ACTIVE BACKGROUND mode, the CPU is held in a suspended state waiting for serial BACKGROUND commands rather than executing instructions from the user’s application program. Background commands are of two types:• Non-intrusive commands, defined as commands that can be issued while the user program is running. Non-intrusive commands can be issued through the BKGD/PTA4 pin while the MCU is in RUN mode; non-intrusive commands can also be executed when the MCU is in the ACTIVE BACKGROUND mode. Non-intrusive commands include:— Memory access commands— Memory-access-with-status commands— BDC register access commands— The BACKGROUND command• ACTIVE BACKGROUND commands, which can only be executed while the MCU is in ACTIVE BACKGROUND mode. ACTIVE BACKGROUND commands include commands to:— Read or write CPU registers— Trace one user program instruction at a time— Leave ACTIVE BACKGROUND mode to return to the user’s application program (GO)The ACTIVE BACKGROUND mode is used to program a bootloader or user application program into the FLASH program memory before the MCU is operated in RUN mode for the first time. When the FXTH870x6 is shipped from the Freescale factory, the FLASH program memory is erased by default (unless specifically requested otherwise) so there is no program that could be executed in RUN mode until the FLASH memory is initially programmed.The ACTIVE BACKGROUND mode can also be used to erase and reprogram the FLASH memory after it has been previously programmed.
FXTH870x6Sensors14 Freescale Semiconductor, Inc.3.5 STOP ModesOne of two stop modes are entered upon execution of a STOP instruction when the STOPE bit in the system option register is set. In all STOP modes, all internal clocks are halted except for the low frequency 1 kHz oscillator (LFO) which runs continuously whenever power is applied to the VDD and VSS pins. If the STOPE bit is not set when the CPU executes a STOP instruction, the MCU will not enter any of the STOP modes and an illegal opcode reset is forced. The STOP modes are selected by setting the appropriate bits in SPMSC2. Table 1 summarizes the behavior of the MCU in each of the STOP1 and STOP4 modes. The STOP2 mode found in other Freescale S08 family members is not available; but the STOP3 mode is present like other members of the Freescale S08 family members.3.5.1 STOP1 ModeThe STOP1 mode provides the lowest possible standby power consumption by causing the internal circuitry of the MCU to be powered down.When the MCU is in STOP1 mode, all internal circuits that are powered from the voltage regulator are turned off. The voltage regulator is in a low-power standby state. STOP1 is exited by asserting either a reset or an interrupt function to the MCU.Entering STOP1 mode automatically asserts LVD. STOP1 cannot be exited until the VDD is greater than VLVDH or VLV/DL rising (VDD must rise above the LVI re-arm voltage).Upon wakeup from STOP1 mode, the MCU will start up as from a power-on reset (POR) by taking the reset vector.NOTEIf there are any pending interrupts that have yet to be serviced then the device will not go into the STOP1 mode. Be certain that all interrupt flags have been cleared before entry to STOP1 mode.3.5.2 STOP4 LVD Enabled in STOP ModeThe LVD system is capable of generating either an interrupt or a reset when the supply voltage drops below the LVD voltage. If the LVD is enabled by setting the LVDE and the LVDSE bits in SPMSC1 when the CPU executes a STOP instruction, then the voltage regulator remains active during STOP mode. If the user attempts to enter the STOP1 with the LVD enabled in STOP (LVDSE  = 1), the MCU will enter STOP4 instead.Table 1. STOP Mode BehaviorMode STOP1 STOP4LFO Oscillator, PWU Always On & ClockingReal-Time Interrupt (RTI)(1) Always On if using LFO as ClockMFO Oscillator(2)  Optionally On Optionally OnHFO Oscillator Off OffCPU Off StandbyRAM Off StandbyParameter Registers On OnFLASH Off StandbyTPM1 2-Chan Timer/PWM Off OffDigital I/O Disabled StandbySensor Measurement Interface (SMI) Off Optionally OnPressure P-cell Off Optionally OnOptional Acceleration g-cell Off Optionally OnTemperature Sensor (in ADC10) Off Optionally On(3)Normal Temperature Restart Optionally On Optionally OnVoltage Reference (in ADC10) Off Optionally On(3)LFR Detector(4) Periodically On Periodically OnLFR Decoder Optionally On Optionally OnRF Controller, Data Buffer, Encoder Optionally On Optionally OnRF Transmitter(5) Optionally On Optionally OnADC10 Off Optionally On(3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 15Specific to the tire pressure monitoring application the parameter registers and the LFO with wakeup timer are powered up at all times whenever voltage is applied to the supply pins. The LFR detector and MFO may be periodically powered up by the LFR decoder.3.5.3 Active BDM Enabled in STOP ModeEntry into the ACTIVE BACKGROUND DEBUG mode from RUN mode is enabled if the ENBDM bit in BDCSCR is set. The BDCSCR register is not memory mapped so it can only be accessed through the BDM interface by use of the BDM commands READ_STATUS and WRITE_CONTROL. If ENBDM is set when the CPU executes a STOP instruction, the system clocks to the BACKGROUND DEBUG logic remain active when the MCU enters STOP mode so BACKGROUND DEBUG communication is still possible. In addition, the voltage regulator does not enter its low-power standby state but maintains full internal regulation. If the user attempts to enter the STOP1 with ENDBM set, the MCU will instead enter this mode which is STOP4 with system clocks running.Most BACKGROUND commands are not available in STOP mode. The memory-access-with-status commands do not allow memory access, but they report an error indicating that the MCU is in STOP mode. The BACKGROUND command can be used to wake the MCU from stop and enter ACTIVE BACKGROUND mode if the ENDBM bit is set. Once in BACKGROUND DEBUG mode, all BACKGROUND commands are available.3.5.4 MCU On-Chip Peripheral Modules in STOP ModesWhen the MCU enters any STOP mode, system clocks to the internal peripheral modules except the wakeup timer and LFR detectors/decoder are stopped. Even in the exception case (ENDBM = 1), where clocks are kept alive to the BACKGROUND debug logic, clocks to the peripheral systems are halted to reduce power consumption.I/O Pins If the MCU is configured to go into STOP1 mode, the I/O pins are forced to their default reset state (Hi-Z) upon entry into stop. This means that the I/O input and output buffers are turned off and the pullup is disconnected.MemoryAll module interface registers will be reset upon wakeup from STOP1 and the contents of RAM are not preserved. The MCU must be initialized as upon reset. The contents of the FLASH memory are non-volatile and are preserved in any of the STOP modes.Parameter RegistersThe 64 bytes of parameter registers are kept active in all modes of operation as long as power is applied to the supply pins. The contents of the parameter registers behave like RAM and are unaffected by any reset.LFOThe LFO remains active regardless of any mode of operation.MFOThe medium frequency oscillator (MFO) will remain powered up when the MCU enters the STOP mode only when the SMI has been initiated to make a pressure or acceleration measurement; or when the RF transmitter’s state machine is processing data.HFOThe HFO is halted in all STOP modes.PWUThe PWU remains active regardless of any mode of operation.Regulator Off OnI/O Pins Hi-Z States HeldWakeup Methods Interrupts, resets Interrupts, resets1. RTI can be used in STOP1 or STOP4 if the clock selected is the LFO. To use the HFO as the clock the MCU must be in the RUN mode.2. MFO oscillator started if the LFR detectors are periodically sampled, the LFR detectors detect an input signal; a pressure or acceleration reading is in progress or the RF state machine is sending data.3. Requires internal ADC10 clock to be enabled.4. Period of sampling set by MCU.5. RF data buffer may be set up to run while the CPU is in the STOP modes.Table 1. STOP Mode Behavior (continued)Mode STOP1 STOP4
FXTH870x6Sensors16 Freescale Semiconductor, Inc.ADC10The internal asynchronous ADC10 clock is always used as the conversion clock. The ADC10 can continue operation during STOP4 mode. Conversions can be initiated while the MCU is the STOP4 mode. All ADC10 module registers contain their reset values following exit from STOP1 mode.LFRWhen the MCU enters STOP mode the detectors in the LFR will remain powered up depending on the states of the bits selecting the periodic sampling. Refer to Section 12 for more details.Bandgap ReferenceThe bandgap reference is enabled whenever the sensor measurement interface requires sensor or voltage measurements.TPM1When the MCU enters STOP mode, the clock to the TPM1 module stops and the module halts operation. If the MCU is configured to go into STOP1 mode, the TPM1 module will be reset upon wakeup from STOP and must be re-initialized.Voltage RegulatorThe voltage regulator enters a low-power standby state when the MCU enters any of the STOP modes except STOP4 (LVDSE = 1 or ENBDM = 1).Temperature SensorThe temperature sensor is powered up on command from the MCU.Temperature RestartWhen the MCU enters a STOP mode the temperature restart will remain powered up if the TRE bit is set. If the temperature restart level is reached the MCU will restart from the reset vector.3.5.5 RFM Module in STOP ModesThe RFM’s external crystal oscillator (XCO), bit rate generator, PLL, VCO, RF data buffer, data encoder, and RF output stage will remain powered up in STOP modes during a transmission, or if the SEND bit has been set and DIRECT mode has been enabled.RF OutputWhen the RFM finishes a transmission sequence the external crystal oscillator (XCO), bit rate generator, PLL, VCO, RF data buffer, data encoder, and RF output stage will remain powered up if the SEND bit is set.3.5.6 P-cell in STOP ModesThe P-cell is powered up only during a measurement if scheduled by the sensor measurement interface. Otherwise it is powered down.3.5.7 Optional g-Cell in STOP ModesThe g-cell is powered up only during a measurement if scheduled by the sensor measurement interface. Otherwise it is powered down.
FXTH870x6SensorsFreescale Semiconductor, Inc. 174MemoryThe overall memory map of the FXTH870x6 resides on the MCU.4.1 MCU Memory MapAs shown in Figure 8, MCU on-chip memory in the FXTH870x6 consists of parameter registers, RAM, FLASH program memory for nonvolatile data storage, and I/O and control/status registers. The registers are divided into four groups:• Direct-page registers ($0000 through $004F)• Parameter registers ($0050 through $008F)• RAM ($0090 through $028F)• High-page registers ($1800 through $182B)Figure 8.  FXTH870x6 MCU Memory MapThe total programmable FLASH memory map is 16K, but the upper 8K is used for firmware and test software. Upon power up the firmware will initialize the device and redirect all vectors to the user area from $DFC0 through $DFFF. Any calls to the firmware subroutines are accessed through a jump table starting at location $E000 (see Section 14).4.2 Reset and Interrupt VectorsTable 2 shows address assignments for jump table to the reset and interrupt vectors. The vector names shown in this table are the labels used in the equate file provided by Freescale in the CodeWarrior project file.Table 2. Vector SummaryUser Vector Addr Vector Name Module Source$DFE0:DFE1 Vkbi KBI$DFE2:DFE3 Reserved$DFE4:DFE5 Reserved$DFE6:DFE7 Vrti Sys Ctrl - RTI$DFE8:DFE9 Vlfrcvr LFR$DFEA:DFEB Vadc1 ADC10$DFEC:DFED Vrf RFM$0000$004F$0050$008F$1800$17FF$182B$182C$FFFF$0090$C000$BFFFDIRECT PAGE REGISTERSRAM 512 BYTESUNIMPLEMENTEDHIGH PAGE REGISTERS5488 BYTES 41964 BYTES$028F$0290PARAMETER REGISTERS$DFC0$DFBFUSER FLASH8128 BYTESUSER VECTORSFIRMWARE FLASH8128 BYTES$E000$DFFF$E040$E03FFIRMWARE JUMP TABLE
FXTH870x6Sensors18 Freescale Semiconductor, Inc.4.3 MCU Register Addresses and Bit AssignmentsThe registers in the FXTH870x6 are divided into these four groups:• Direct-page registers are located in the first 80 locations in the memory map; these are accessible with efficient direct addressing mode instructions.• The parameter registers begin at address $0050; these are also accessible with efficient direct addressing mode instructions.• High-page registers are used less often, so they are located above $1800 in the memory map. This leaves more room in the direct page for more frequently used registers and variables.• The nonvolatile register area consists of a block of 16 locations in FLASH memory at $FFB0:FFBF. Nonvolatile register locations include:— Three values that are loaded into working registers at reset— An 8-byte back door comparison key that optionally allows the user to gain controlled access to secure memory.Because the nonvolatile register locations are FLASH memory, they must be erased and programmed like other FLASH memory locations.Direct page registers are located within the first 256 locations in the memory map, so they are accessible with efficient direct addressing mode instructions, which requires only the lower byte of the address. Bit manipulation instructions can be used to access any bit in any direct-page register. Table 3 is a summary of all user-accessible direct-page registers and control bits. Those related to the TPMS application and modules are described in detail in this specification.The register names in column two of the following tables are shown in bold to set them apart from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit locations that could read as 1s or 0s.$DFEE:DFEF Vsm SMI$DFF0:DFF1 Vtpm1ovf TPM1$DFF2:DFF3 Vtpm1ch1 TPM1$DFF4:DFF5 Vtpm1ch0 TPM1$DFF6:DFF7 Vwuktmr PWU$DFF8:DFF9 Vlvd Sys Ctrl - LVD$DFFA:DFFB Reserved$DFFC:DFFD Vswi SWI opcode$DFFE:DFFF Vreset Sys Ctrl - POR, PRF, COP, LVDTemp Restart, Illegal opcode or addressTable 3. MCU Direct Page Register SummaryAddressRegister NameBit 7654321Bit 0$0000 PTAD PTAD[4:0]$0001 PTAPE PTAPE[3:0]$0002 Reserved$0003 PTADD PTADD[3:0]$0004 PTBD PTBD[1:0]$0005 PTBPE PTBPE[1:0]$0006 Reserved$0007 PTBDD PTBDD[1:0]$0008 Reserved$0009 Reserved$000A Reserved$000B Reserved$000C KBISC 0000 KBF KBACK KBIE KBIMODTable 2. Vector Summary (continued)User Vector Addr Vector Name Module Source
FXTH870x6SensorsFreescale Semiconductor, Inc. 19$000D KBIPE KBIPE[3:0]$000E KBIES KBEDG[3:0]$000F Reserved$0010 TPM1SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0$0011 TPM1CNTH Bit [15:8]$0012 TPM1CNTL Bit [7:0]$0013 TPM1MODH Bit [15:8]$0014 TPM1MODL Bit [7:0]$0015 TPM1C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A 0 0$0016 TPM1C0VH Bit [15:8]$0017 TPM1C0VL Bit [7:0]$0018 TPM1C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A 0 0$0019 TPM1C1VH Bit [15:8]$001A TPM1C1VL Bit [7:0]$001B Reserved$001C PWUDIV WDIV[5:0]$001D PWUCS0 WUF WUFAK WUT[5:0]$001E PWUCS1 PRF PRFAK PRST[5:0]$001F PWUS PSEL 0 CSTAT[5:0]$0020-27 LFR Registers LFR Registers, see Table 4 and Ta ble 5$0028 ADSC1 COCO AIEN ADCO ADCH[4:0]$0029 ADSC2 ADACT ADTRG ACFE ADCFGT 0 0 0 0$002A ADRH 0000 ADR[11:8]$002B ADRL ADR[7:0]$002C ADCVH 0000 ADCV[11:8]$002D ADCVL ADCV[7:0]$002E ADCFG ADLPC ADIV[1:0] ADLSMP MODE[1:0] ADICLK[1:0]$002F ADPCTL1 ADPC[7:0]$0030-4F RFM Registers RFM Registers, see Table 6 and Table 7$0050-8F Parameter Reg PARAM[63:0]Note: Shaded bits are recommended to only be controlled by firmware or factory test.Table 4. LFR Register Summary - LPAGE = 0AddressRegister NameBit 7654321Bit 0$0020 LFCTL1 LFEN SRES CARMOD LPAGE IDSEL[1:0] SENS[1:0]$0021 LFCTL2 LFSTM[3:0] LFONTM[3:0]$0022 LFCTL3 LFDO TOGMOD SYNC[1:0] LFCDTM[3:0]$0023 LFCTL4 LFDRIE LFERIE LFCDIE LFIDIE DECEN VALEN  TIMOUT[1:0]$0024 LFS LFDRF LFERF LFCDF LFIDF LFOVF LFEOMF LPSM LFIAK$0025 LFDATA RXDATA[7:0]$0026 LFIDL ID[7:0]$0027 LFIDH ID[15:8]Table 3. MCU Direct Page Register Summary (continued)AddressRegister NameBit 7654321Bit 0
FXTH870x6Sensors20 Freescale Semiconductor, Inc.Table 5. LFR Register Summary - LPAGE = 1AddressRegister NameBit 7654321Bit 0$0020 LFCTL1 LFEN SRES CARMOD LPAGE IDSEL[1:0] SENS[1:0]$0021 LFCTRLE TRIMEE AZSC[2:0]$0022 LFCTRLD AVFOF[1:0} DEQS AZDC[1:0] ONMODE CHK125[1:0]$0023 LFCTRLC AMPGAIN[1:0] FINSEL[1:0] AZEN LOWQ[1:0] DEQEN$0024 LFCTRLB HYST[1:0] LFFAF LFCAF LFPOL LFCPTAZ[2:0]$0025 LFCTRLA TESTSEL[3:0] LFCC[3:0]$0026 Reserved$0027 ReservedNote: Shaded bits are recommended to only be controlled by firmware or factory test.Table 6. RFM Register Summary - RPAGE = 0AddressRegister NameBit 7654321Bit 0$0030 RFCR0 BPS[7:0]$0031 RFCR1 FRM[7:0]$0032 RFCR2 SEND RPAGE EOM PWR[4:0]$0033 RFCR3 DATA IFPD ISPC IFID FNUM[3:0]$0034 RFCR4 RFBT[7:0]$0035 RFCR5 BOOST LFSR[6:0]$0036 RFCR6 VCO_GAIN[1:0] RFFT[5:0]$0037 RFCR7 RFIF RFEF RFVF RFIAK RFIEN RFLVDEN RCTS RFMRST$0038 PLLCR0 AFREQ[12:5]$0039 PLLCR1 AFREQ[4:0] POL CODE[1:0]$003A PLLCR2 BFREQ[12:5]$003B PLLCR3 BFREQ[4:0] CF MOD CKREF$003C RFD0 RFD[7:0]$003D RFD1 RFD[15:8]$003E RFD2 RFD[23:16]$003F RFD3 RFD[31:24]$0040 RFD4 RFD[39:32]$0041 RFD5 RFD[47:40]$0042 RFD6 RFD[55:48]$0043 RFD7 RFD[63:56]$0044 RFD8 RFD[71:64]]$0045 RFD9 RFD[79:72]$0046 RFD10 RFD[87:80]$0047 RFD11 RFD[95:88]$0048 RFD12 RFD[103:96] $0049 RFD13 RFD[111:104]$004A RFD14 RFD[119:112]$004B RFD15 RFD[127:120]$004C Reserved$004D Reserved$004E Reserved$004F ReservedNote: Shaded bits are recommended to only be controlled by firmware or factory test.
FXTH870x6SensorsFreescale Semiconductor, Inc. 21Table 7. RFM Register Summary - RPAGE = 1AddressRegister NameBit 7654321Bit 0$0030 RFCR0 BPS[7:0]$0031 RFCR1 FRM[7:0]$0032 RFCR2 SEND RPAGE EOM PWR[4:0]$0033 RFCR3 DATA IFPD ISPC IFID FNUM[3:0]$0034 RFCR4 RFBT[7:0]$0035 RFCR5 BOOST LFSR[6:0]$0036 RFCR6 VCO_GAIN[1:0] RFFT[5:0]$0037 RFCR7 RFIF RFEF RFVF RFIAK RFIEN RFLVDEN RCTS RFMRST$0038 EPR —/VCD3 PLL_LPF_[2:0]/VCD[2:0] PA_SLOPE VCD_EN$0039 Reserved$003A Reserved$003B Reserved$003C RFD0 RFD[135:128]$003D RFD1 RFD[143:136]$003E RFD2 RFD[151:144]$003F RFD3 RFD[159:152]$0040 RFD4 RFD[167:160]$0041 RFD5 RFD[175:168]$0042 RFD6 RFD[183:176]$0043 RFD7 RFD[191:184]$0044 RFD8 RFD[199:192]$0045 RFD9 RFD[207:200]$0046 RFD10 RFD[215:208]$0047 RFD11 RFD[223:216]$0048 RFD12 RFD[231:224]$0049 RFD13 RFD[239:232]$004A RFD14 RFD[247:240]$004B RFD15 RFD[255:248]$004C Reserved$004D Reserved$004E Reserved$004F ReservedNote: Shaded bits are recommended to only be controlled by firmware or factory test.
FXTH870x6Sensors22 Freescale Semiconductor, Inc.4.4 High Address RegistersHigh-page registers are used much less often, so they are located above $1800 in the memory map. This leaves more room in the direct page for more frequently used registers and variables. The registers control system level features as given in Table 8.4.5 MCU Parameter RegistersThe 64 bytes of parameter registers are located at addresses $0050 through $008F. These registers are powered up at all times and may be used to store temporary or history data during the times that the MCU is in any of the STOP modes. The parameter register at $008F is used by the firmware for interrupt flags.4.6 MCU RAMThe FXTH870x6 includes static RAM. The locations in RAM below $0100 can be accessed using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit-manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program variables in this area of RAM is preferred.The RAM retains data when the MCU is in low-power WAIT, STOP3 or STOP4 modes. At power-on or after wakeup from STOP1, the contents of RAM are not initialized. RAM data is unaffected by any reset provided that the supply voltage does not drop below the minimum value for RAM retention (VRAM).When security is enabled, the RAM is considered a secure memory resource and is not accessible through BDM or through code executing from non-secure memory. See Section 4.8 for a detailed description of the security feature.Table 8. MCU High Address Register SummaryAddressRegister NameBit 7654321Bit 0$1800 SRS POR PIN COP ILOP ILAD PWU LVD 0$1801 SBDFR 0000000BDFR$1802 SIMOPT1 COPE COPCLKS STOPE RFEN TRE TRH BKGDPE 1$1803 SIMOPT2 0 COPT[2:0] LFOSEL TCLKDIV BUSCLKS[1:0]$1804 Reserved$1805 Reserved$1806 SDIDH REV[3:0] ID[11:8]$1807 SDIDL ID[7:0]$1808 SRTISC RTIF RTIACK RTICLKS RTIE 0RTIS{2:0]$1809 SPMSC1 LVDF LVDACK LVDIE LVDRE LVDSE LVDE 0BGBE$180A SPMSC2 000PDF0 PPDACK PDC 0$180B Reserved$180C SPMSC3 LVWF LVWACK LVDV LVWV 0000$180D SIMSES KBF IRQF TRF PWUF LFF RFF$180E SOTRM SOTRM[7:0]$180F SIMTST TRH[2:0] TRO$1810-1F Reserved$1820 FCDIV DIVLD PRDIV8 DIV[5:0]$1821 FOPT KEYEN FNORED 0000 SEC0[1:0}$1822 Reserved$1823 FCNFG 00 KEYACC 00000$1824 FPROT FPS[7:1] FPDIS$1825 FSTAT FCBEF FCCF FPVIOL FACCERR 0 FBLANK 0 0$1826 FCMD FERASE FCMD[6:0]$1827-3F ReservedNote: Reserved bits shown as 0 must always be written to 0.Reserved bits shown as 1 must always be written to 1.Shaded bits are recommended to only be controlled by firmware or factory test.
FXTH870x6SensorsFreescale Semiconductor, Inc. 23None of the RAM locations are used directly by the firmware provided by Freescale. The firmware routines utilize RAM only through stack operations; and the user needs to be aware of stack depth required by each routine as described in the CodeWarrior project files supplied by Freescale.4.7 FLASHThe FLASH memory is intended primarily for program storage. The operating program can be loaded into the FLASH memory after final assembly of the application product using the single-wire BACKGROUND DEBUG interface. Because no special voltages are needed for FLASH erase and programming operations, in-application programming is also possible through other software-controlled communication paths. For a more detailed discussion of in-circuit and in-application programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale document order number HCS08RMV1/D.4.7.1 FeaturesFeatures of the FLASH memory include:• User Program FLASH Size — 8192 bytes (16 pages of 512 bytes each)• Single power supply program and erase• Command interface for fast program and erase operation• Up to 100,000 program/erase cycles at typical voltage and temperature• Flexible block protection• Security feature for FLASH and RAM• Auto power-down for low-frequency read accesses4.7.2 Program and Erase TimesBefore any program or erase command can be accepted, the FLASH clock divider register (FCDIV) must be written to set the internal clock for the FLASH module to a frequency (fFCLK) between 150 kHz and 200 kHz. This register can be written only once, so normally this write is performed during reset initialization. FCDIV cannot be written if the access error flag, FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the FCDIV register. One period of the resulting clock (1/fFCLK) is used by the command processor to time program and erase pulses. An integer number of these timing pulses are used by the command processor to complete a program or erase command.Table 9 shows program and erase times. The bus clock frequency and FCDIV determine the frequency of FCLK (fFCLK). The time for one cycle of FCLK is tFCLK =1/fFCLK. The times are shown as a number of cycles of FCLK and as an absolute time for the case where tFCLK =5s. Program and erase times shown include overhead for the command state machine and enabling and disabling of program and erase voltages.4.7.3 Program and Erase Command ExecutionThe steps for executing any of the commands are listed below. The FCDIV register must be initialized and any error flags cleared before beginning command execution. The command execution steps are:1. Write a data value to an address in the FLASH array. The address and data information from this write is latched into the FLASH interface. This write is a required first step in any command sequence. For erase and blank check commands, the value of the data is not important. For page erase commands, the address may be any address in the 512-byte page of FLASH to be erased. For mass erase and blank check commands, the address can be any address in the FLASH memory. Whole pages of 512 bytes are the smallest block of FLASH that may be erased. Do not program any byte in the FLASH more than once after a successful erase operation. Reprogramming bits to a byte which is already programmed is not allowed without first erasing the page in which the byte resides or mass erasing the entire FLASH memory. Programming without first erasing may disturb data stored in the FLASH.Table 9. Program and Erase TimesParameter Cycles of FCLK Time if FCLK = 200 kHzByte program  9 45 sByte program (burst)  4 20 s(1)1. Excluding start/end overheadPage erase  4000 20 msMass erase  20,000 100 ms
FXTH870x6Sensors24 Freescale Semiconductor, Inc.2. Write the command code for the desired command to FCMD. The five valid commands are blank check (0x05), byte program (0x20), burst program (0x25), page erase (0x40), and mass erase (0x41). The command code is latched into the command buffer.3. Write a 1 to the FCBEF bit in FSTAT to clear FCBEF and launch the command (including its address and data information).A partial command sequence can be aborted manually by writing a 0 to FCBEF any time after the write to the memory array and before writing the 1 that clears FCBEF and launches the complete command. Aborting a command in this way sets the FACCERR access error flag which must be cleared before starting a new command.A strictly monitored procedure must be obeyed or the command will not be accepted. This minimizes the possibility of any unintended changes to the FLASH memory contents. The command complete flag (FCCF) indicates when a command is complete. The command sequence must be completed by clearing FCBEF to launch the command. Figure 9 is a flowchart for executing all of the commands except for burst programming. The FCDIV register must be initialized before using any FLASH commands. This must be done only once following a reset.4.7.4 Burst Program ExecutionThe burst program command is used to program sequential bytes of data in less time than would be required using the standard program command. This is possible because the high voltage to the FLASH array does not need to be disabled between program operations. Ordinarily, when a program or erase command is issued, an internal charge pump associated with the FLASH memory must be enabled to supply high voltage to the array. Upon completion of the command, the charge pump is turned off. When a burst program command is issued, the charge pump is enabled and then remains enabled after completion of the burst program operation if these two conditions are met:• The next burst program command has been queued before the current program operation has completed. • The next sequential address selects a byte on the same physical row as the current byte being programmed. A row of FLASH memory consists of 64 bytes. A byte within a row is selected by addresses A5 through A0. A new row begins when addresses A5 through A0 are all zero.The first byte of a series of sequential bytes being programmed in burst mode will take the same amount of time to program as a byte programmed in standard mode. Subsequent bytes will program in the burst program time provided that the conditions above are met. In the case the next sequential address is the beginning of a new row, the program time for that byte will be the standard time instead of the burst time. This is because the high voltage to the array must be disabled and then enabled again. If a new burst command has not been queued before the current command completes, then the charge pump will be disabled and high voltage removed from the array.
FXTH870x6SensorsFreescale Semiconductor, Inc. 25Figure 9. FLASH Program and Erase FlowchartProgramming time for the FLASH through the BDM function is dependent on the specific external BDM interface tool and software being used. Consult tool vendor for programming times.STARTWRITE TO FLASHTO BUFFER ADDRESS AND DATAWRITE COMMAND TO FCMDNOYESFPVIOL OR WRITE 1 TO FCBEFTO LAUNCH COMMAND AND CLEAR FCBEF (2)10FCCF?ERROR EXITDONENote 2: Wait at least four bus cycles 0FACCERR?CLEAR ERRORFACCERR?WRITE TO FCDIV (1) Note 1: Required only once after reset.1before checking FCBEF or FCCF.FLASH PROGRAM ANDERASE FLOW
FXTH870x6Sensors26 Freescale Semiconductor, Inc.Figure 10. FLASH Burst Program Flowchart4.7.5 Access ErrorsAn access error occurs whenever the command execution protocol is violated. Any of the following specific actions will cause the access error flag (FACCERR) in FSTAT to be set. FACCERR must be cleared by writing a 1 to FACCERR in FSTAT   before any command can be processed.• Writing to a FLASH address before the internal FLASH clock frequency has been set by writing to the FCDIV register•  Writing to a FLASH address while FCBEF is not set (A new command cannot be started until the command buffer is empty.)• Writing a second time to a FLASH address before launching the previous command (There is only one write to FLASH for every command.)• Writing a second time to FCMD before launching the previous command (There is only one write to FCMD for every command.)• Writing to any FLASH control register other than FCMD after writing to a FLASH address• Writing any command code other than the five allowed codes (0x05, 0x20, 0x25, 0x40, or 0x41) to FCMD• Accessing (read or write) any FLASH control register other than the write to FSTAT (to clear FCBEF and launch the command) after writing the command to FCMD.• The MCU enters STOP mode while a program or erase command is in progress (The command is aborted.)10FCBEF?STARTWRITE TO FLASHTO BUFFER ADDRESS AND DATAWRITE COMMAND ($25) TO FCMDNOYESFPVIO OR WRITE 1 TO FCBEFTO LAUNCH COMMAND AND CLEAR FCBEF (2)NOYESNEW BURST COMMAND?10FCCF?ERROR EXITDONENote 2: Wait at least four bus cycles before 10FACCERR?CLEAR ERRORFACCERR?Note 1: Required only once after reset.WRITE TO FCDIV (1)checking FCBEF or FCCF.FLASH BURSTPROGRAM FLOW
FXTH870x6SensorsFreescale Semiconductor, Inc. 27• Writing the byte program, burst program, or page erase command code (0x20, 0x25, or 0x40) with a BACKGROUND DEBUG command while the MCU is secured (the BACKGROUND DEBUG controller can only do blank check and mass erase commands when the MCU is secure.)• Writing 0 to FCBEF to cancel a partial command.4.7.6 FLASH Block ProtectionThe block protection feature prevents the protected region of FLASH from program or erase changes. Block protection is controlled through the FLASH Protection Register (FPROT). When enabled, block protection begins at any 512-byte boundary below the last address of FLASH, 0xFFFF. (see Section 4.9.4).After exit from reset, FPROT is loaded with the contents of the NVPROT location which is in the nonvolatile register block of the FLASH memory. FPROT cannot be changed directly from application software so a runaway program cannot alter the block protection settings. Because NVPROT is within the last 512 bytes of FLASH, if any amount of memory is protected, NVPROT is itself protected and cannot be altered (intentionally or unintentionally) by the application software. FPROT can be written through BACKGROUND DEBUG commands which allows a way to erase and reprogram a protected FLASH memory.The block protection mechanism is illustrated below. The FPS bits are used as the upper bits of the last address of unprotected memory. This address is formed by concatenating FPS7:FPS1 with logic 1 bits as shown. For example, in order to protect the last 8192 bytes of memory (addresses 0xE000 through 0xFFFF), the FPS bits must be set to 1101 111 which results in the value 0xDFFF as the last address of unprotected memory. In addition to programming the FPS bits to the appropriate value, FPDIS (bit 0 of NVPROT) must be programmed to logic 0 to enable block protection. Therefore the value 0xDE must be programmed into NVPROT to protect addresses 0xE000 through 0xFFFF.Figure 11. Block Protection MechanismOne use for block protection is to block protect an area of FLASH memory for a bootloader program. This bootloader program then can be used to erase the rest of the FLASH memory and reprogram it. Because the bootloader is protected, it remains intact even if MCU power is lost in the middle of an erase and reprogram operation.4.7.7 Vector RedirectionNOTENot recommended for TPMS applications where Freescale firmware has been included in the final image.Whenever any block protection is enabled, the reset and interrupt vectors will be protected. Vector redirection allows users to modify interrupt vector information without unprotecting bootloader and reset vector space. Vector redirection is enabled by programming the FNORED bit in the NVOPT register located at address 0xFFBF to zero. For redirection to occur, at least some portion but not all of the FLASH memory must be block protected by programming the NVPROT register located at address 0xFFBD. All of the interrupt vectors (memory locations 0xFFC0–0xFFFD) are redirected, though the reset vector (0xFFFE:FFFF) is not.For example, if 512 bytes of FLASH are protected, the protected address region is from 0xFE00 through 0xFFFF. The interrupt vectors (0xFFC0–0xFFFD) are redirected to the locations 0xFDC0–0xFDFD. Now, if an SPI interrupt is taken for instance, the values in the locations 0xFDE0:FDE1 are used for the vector instead of the values in the locations 0xFFE0:FFE1. This allows the user to reprogram the unprotected portion of the FLASH with new program code including new interrupt vector values while leaving the protected area, which includes the default vector locations, unchanged.FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1A15 A14 A13 A12 A11 A10 A9 A81A7 A6 A5 A4 A3 A2 A1 A011111111
FXTH870x6Sensors28 Freescale Semiconductor, Inc.4.8 SecurityThe FXTH870x6 includes circuitry to prevent unauthorized access to the contents of FLASH and RAM memory. When security is engaged, FLASH and RAM are considered secure resources. Direct-page registers, high-page registers, and the BACKGROUND DEBUG controller are considered unsecured resources. Programs executing within secure memory have normal access to any MCU memory locations and resources. Attempts to access a secure memory location with a program executing from an unsecured memory space or through the BACKGROUND DEBUG interface are blocked (writes are ignored and reads return all 0s).Security is engaged or disengaged based on the state of two nonvolatile register bits (SEC0[1:0]) in the FOPT register. During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into the working FOPT register in high-page register space. A user engages security by programming the NVOPT location, which can be done at the same time the FLASH memory is programmed. The 1:0 state disengages security and the other three combinations engage security. Notice the erased state (1:1) makes the MCU secure. During development, whenever the FLASH is erased, it is good practice to immediately program the SEC00 bit to 0 in NVOPT so SEC[1:0] = 1:0. This would allow the MCU to remain unsecured after a subsequent reset.The on-chip debug module cannot be enabled while the MCU is secure. The separate BACKGROUND DEBUG controller can still be used for background memory access commands, but the MCU cannot enter ACTIVE BACKGROUND mode except by holding BKGD/MS low at the rising edge of reset.A user can choose to allow or disallow a security unlocking mechanism through an 8-byte backdoor security key. If the nonvolatile KEYEN bit in NVOPT/FOPT is 0, the backdoor key is disabled and there is no way to disengage security without completely erasing all FLASH locations. If KEYEN is 1, a secure user program can temporarily disengage security by:1. Writing 1 to KEYACC in the FCNFG register. This makes the FLASH module interpret writes to the backdoor comparison key locations (NVBACKKEY through NVBACKKEY+7) as values to be compared against the key rather than as the first step in a FLASH program or erase command.2. Writing the user-entered key values to the NVBACKKEY through NVBACKKEY+7 locations. These writes must be done in order starting with the value for NVBACKKEY and ending with NVBACKKEY+7. STHX must not be used for these writes because these writes cannot be done on adjacent bus cycles. User software normally would get the key codes from outside the MCU system through a communication interface such as a serial I/O.3. Writing 0 to KEYACC in the FCNFG register. If the 8-byte key that was just written matches the key stored in the FLASH locations, SEC[1:0] are automatically changed to 1:0 and security will be disengaged until the next reset.The security key can be written only from secure memory (either RAM or FLASH), so it cannot be entered through BACKGROUND commands without the cooperation of a secure user program.The backdoor comparison key (NVBACKKEY through NVBACKKEY+7) is located in FLASH memory locations in the nonvolatile register space so users can program these locations exactly as they would program any other FLASH memory location. The nonvolatile registers are in the same 512-byte block of FLASH as the reset and interrupt vectors, so block protecting that space also block protects the backdoor comparison key. Block protects cannot be changed from user application programs, so if the vector space is block protected, the backdoor security key mechanism cannot permanently change the block protect, security settings, or the backdoor key.Security can always be disengaged through the BACKGROUND DEBUG interface by taking these steps:1. Disable any block protections by writing FPROT. FPROT can be written only with BACKGROUND DEBUG commands, not from application software.2. Mass erase FLASH if necessary.3. Blank check FLASH. Provided FLASH is completely erased, security is disengaged until the next reset.To avoid returning to secure mode after the next reset, program NVOPT so SEC[1:0] = 1:0.NOTEEnabling the security feature disables Freescale ability to perform failure analysis without first completely erasing all flash memory contents. If the security feature is implemented, customer shall be responsible for providing to Freescale unsecured parts for any failure analysis to begin or supplying the entire contents of the device flash memory data as part of the return process, to allow Freescale to erase and subsequently restore the device to its original condition.
FXTH870x6SensorsFreescale Semiconductor, Inc. 294.9 FLASH Registers and Control BitsThe FLASH module has nine 8-bit registers in the high-page register space, three locations in the nonvolatile register space in FLASH memory which are copied into three corresponding high-page control registers at reset. There is also an 8-byte comparison key in FLASH memory. Refer to Table 8 and Table 9 for the absolute address assignments for all FLASH registers. This section refers to registers and control bits only by their names. A Freescale Semiconductor-provided equate or header file normally is used to translate these names into the appropriate absolute addresses.4.9.1 FLASH Clock Divider Register (FCDIV)Bit 7 of this register is a read-only status flag. Bits 6 through 0 can be read at any time but can be written only once. Before any erase or programming operations are possible, write to this register to set the frequency of the clock for the nonvolatile memory system within acceptable limits.$1820 7 6 5 4 3 2 1 0RDIVLD PRDIV8 DIV5 DIV4 DIV3 DIV2 DIV1 DIV0WReset: 0 0000000= ReservedFigure 12. FLASH Clock Divider Register (FCDIV)Table 10. FCDIV Register Field DescriptionsField Description7DIVLDDivisor Loaded Status Flag — When set, this read-only status flag indicates that the FCDIV register has been written since reset. Reset clears this bit and the first write to this register causes this bit to become set regardless of the data written.0 FCDIV has not been written since reset; erase and program operations disabled for FLASH1 FCDIV has been written since reset; erase and program operations enabled for FLASH6PRDIV8Prescale (Divide) FLASH Clock by 80 Clock input to the FLASH clock divider is the bus rate clock1 Clock input to the FLASH clock divider is the bus rate clock divided by 85:0DIV[5:0]Divisor for FLASH Clock Divider — The FLASH clock divider divides the bus rate clock (or the bus rate clock divided by 8 if PRDIV8 = 1) by the value in the 6-bit DIV5:DIV0 field plus one. The resulting frequency of the internal FLASH clock must fall within the range of 200 kHz to 150 kHz for proper FLASH operations. Program/Erase timing pulses are one cycle of this internal FLASH clock which corresponds to a range of 5 s to 6.7 s. The automated programming logic uses an integer number of these pulses to complete an erase or program operation.• if PRDIV8 = 0 — fFCLK = fBus  ([DIV5:DIV0] + 1)• if PRDIV8 = 1 — fFCLK = fBus  (8  ([DIV5:DIV0] + 1))Table 11 shows the appropriate values for PRDIV8 and DIV5:DIV0 for selected bus frequencies.Table 11. FLASH Clock Divider SettingsfBus PRDIV8(Binary) DIV5:DIV0(Decimal) fFCLK Program/Erase Timing Pulse(5 s Min, 6.7s Max)20 MHz 1 12 192.3 kHz 5.2 s10 MHz 0 49 200 kHz 5 s8 MHz 0 39 200 kHz 5 s4 MHz 0 19 200 kHz 5 s2 MHz 0 9 200 kHz 5 s1 MHz 0 4 200 kHz 5 s200 kHz 0 0 200 kHz 5 s150 kHz 0 0 150 kHz 6.7 s
FXTH870x6Sensors30 Freescale Semiconductor, Inc.4.9.2 FLASH Options Register (FOPT and NVOPT)During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into FOPT. Bits 5 through 2 are not used and always read 0. This register may be read at any time, but writes have no meaning or effect. To change the value in this register, erase and reprogram the NVOPT location in FLASH memory as usual and then issue a new MCU reset.4.9.3 FLASH Configuration Register (FCNFG)Bits 7 through 5 can be read or written at any time. Bits 4 through 0 always read 0 and cannot be written.$1821 7 6 5 4 3 2 1 0RKEYEN FNORED 0 0 0 0 SEC01 SEC00WReset: This register is loaded from nonvolatile location NVOPT during reset.= ReservedFigure 13. FLASH Options Register (FOPT)Table 12. FOPT Register Field DescriptionsField Description7KEYENBackdoor Key Mechanism Enable — When this bit is 0, the backdoor key mechanism cannot be used to disengage security. The backdoor key mechanism is accessible only from user (secured) firmware. BDM commands cannot be used to write key comparison values that would unlock the backdoor key. For more detailed information about the backdoor key mechanism, refer to Section 4.8.”0 No backdoor key access allowed1 If user firmware writes an 8-byte value that matches the nonvolatile backdoor key (NVBACKKEY through NVBACKKEY+7 in that order), security is temporarily disengaged until the next MCU reset6FNOREDVector Redirection Disable — When this bit is 1, then vector redirection is disabled.0 Vector redirection enabled1 Vector redirection disabled1:0SEC0[1:0]Security State Code — This 2-bit field determines the security state of the MCU as shown in Table 13. When the MCU is secure, the contents of RAM and FLASH memory cannot be accessed by instructions from any unsecured source including the BACKGROUND DEBUG interface. For more detailed information about security, refer to Section 4.8. SEC01:SEC00 changes to 1:0 after successful backdoor key entry or a successful blank check of FLASH.Table 13. Security StatesSEC01:SEC00 Description0:0 secure0:1 secure1:0 unsecured1:1 secure$1823 7 6 5 4 3 2 1 0R00KEYACC 00000WReset: 0 000 0 000= ReservedFigure 14. FLASH Configuration Register (FCNFG)
FXTH870x6SensorsFreescale Semiconductor, Inc. 314.9.4 FLASH Protection Register (FPROT and NVPROT)During reset, the contents of the nonvolatile location NVPROT is copied from FLASH into FPROT. Bits 0, 1, and 2 are not used and each always reads as 0. This register can be read at any time, but user program writes have no meaning or effect. BACKGROUND DEBUG commands can write to FPROT.Figure 15. FLASH Protection Register (FPROT)4.9.5 FLASH Status Register (FSTAT)Bits 3, 1, and 0 always read 0 and writes have no meaning or effect. The remaining five bits are status bits that can be read at any time. Writes to these bits have special meanings that are discussed in the bit descriptions.Table 14. FCNFG Register Field DescriptionsField Description5KEYACCEnable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed information about the backdoor key mechanism, refer to Section 4.8.0 Writes to 0xFFB0–0xFFB7 are interpreted as the start of a FLASH programming or erase command1 Writes to NVBACKKEY (0xFFB0–0xFFB7) are interpreted as comparison key writes$1824 7 6 5 4 3 2 1 0RFPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1 FPDISW(1)1. Background commands can be used to change the contents of these bits in FPROT.(1) (1) (1) (1) (1) (1) (1)Reset: This register is loaded from nonvolatile location NVPROT during reset.Table 15. FPROT Register Field DescriptionsField Description7:1FPS[7:1]FLASH Protect Select Bits — When FPDIS = 0, this 7-bit field determines the ending address of unprotected FLASH locations at the high address end of the FLASH. Protected FLASH locations cannot be erased or programmed.0FPDISFLASH Protection Disable0 FLASH block specified by FPS[7:1] is block protected (program and erase not allowed)1 No FLASH block is protected$1825 7 6 5 4 3 2 1 0RFCBEF FCCF FPVIOL FACCERR 0 FBLANK 0 0WReset: 1 1000000= ReservedFigure 16. FLASH Status Register (FSTAT)Table 16. FSTAT Register Field DescriptionsField Description7FCBEFFLASH Command Buffer Empty Flag — The FCBEF bit is used to launch commands. It also indicates that the command buffer is empty so that a new command sequence can be executed when performing burst programming. The FCBEF bit is cleared by writing a one to it or when a burst program command is transferred to the array for programming. Only burst program commands can be buffered.0 Command buffer is full (not ready for additional commands)1 A new burst program command can be written to the command buffer
FXTH870x6Sensors32 Freescale Semiconductor, Inc.4.9.6 FLASH Command Register (FCMD)Only five command codes are recognized in normal user modes as shown in Table 17. Refer to Section 4.7.3, for a detailed discussion of FLASH programming and erase operations.All other command codes are illegal and generate an access error.It is not necessary to perform a blank check command after a mass erase operation. Only blank check is required as part of the security unlocking mechanism.6FCCFFLASH Command Complete Flag — FCCF is set automatically when the command buffer is empty and no command is being processed. FCCF is cleared automatically when a new command is started (by writing 1 to FCBEF to register a command). Writing to FCCF has no meaning or effect.0 Command in progress1 All commands complete5FPVIOLProtection Violation Flag — FPVIOL is set automatically when FCBEF is cleared to register a command that attempts to erase or program a location in a protected block (the erroneous command is ignored). FPVIOL is cleared by writing a 1 to FPVIOL.0 No protection violation1 An attempt was made to erase or program a protected location4FACCERRAccess Error Flag — FACCERR is set automatically when the proper command sequence is not obeyed exactly (the erroneous command is ignored), if a program or erase operation is attempted before the FCDIV register has been initialized, or if the MCU enters STOP while a command was in progress. For a more detailed discussion of the exact actions that are considered access errors, see Section 4.7.5. FACCERR is cleared by writing a 1 to FACCERR. Writing a 0 to FACCERR has no meaning or effect.0 No access error1 An access error has occurred2FBLANKFLASH Verified as All Blank (erased) Flag — FBLANK is set automatically at the conclusion of a blank check command if the entire FLASH array was verified to be erased. FBLANK is cleared by clearing FCBEF to write a new valid command. Writing to FBLANK has no meaning or effect.0 After a blank check command is completed and FCCF = 1, FBLANK = 0 indicates the FLASH array is not completely erased1 After a blank check command is completed and FCCF = 1, FBLANK = 1 indicates the FLASH array is completely erased (all 0xFF)$1826 7 6 5 4 3 2 1 0R0 0000000WFCMD7 FCMD6 FCMD5 FCMD4 FCMD3 FCMD2 FCMD1 FCMD0Reset: 0 0000000Figure 17. FLASH Command Register (FCMD)Table 17. FLASH CommandsCommand FCMD Equate File LabelBlank check 0x05 mBlankByte program 0x20 mByteProgByte program — burst mode 0x25 mBurstProgPage erase (512 bytes/page) 0x40 mPageEraseMass erase (all FLASH) 0x41 mMassEraseTable 16. FSTAT Register Field Descriptions (continued)Field Description
FXTH870x6SensorsFreescale Semiconductor, Inc. 335 Reset, Interrupts and System ConfigurationThis section discusses basic reset and interrupt mechanisms and the various sources of reset and interrupts in the FXTH870x6. Some interrupt sources from peripheral modules are discussed in greater detail within other sections of this product specification. This section gathers basic information about all reset and interrupt sources in one place for easy reference. A few reset and interrupt sources, including the computer operating properly (COP) watchdog and real-time interrupt (RTI), are not part of on-chip peripheral systems, but are part of the system control logic.5.1 FeaturesReset and interrupt features include:• Multiple sources of reset for flexible system configuration and reliable operation• Reset status register (SRS) to indicate source of most recent reset• Separate interrupt vectors for each module (reduces polling overhead)5.2 MCU ResetResetting the MCU provides a way to start processing from a known set of initial conditions. During reset, most control and status registers are forced to initial values and the program counter is loaded from the reset vector ($DFFE:$DFFF). On-chip peripheral modules are disabled and any I/O pins are initially configured as general-purpose high-impedance inputs with any pullup devices disabled. The I bit in the condition code register (CCR) is set to block maskable interrupts so the user program has a chance to initialize the stack pointer (SP) and system control settings. The SP is forced to $00FF at reset. The FXTH870x6 has seven sources for reset:• Power-on reset (POR)• Low-voltage detect (LVD)• Computer operating properly (COP) timer• Periodic hardware reset (PRST)• Illegal opcode detect• Illegal address detect• BACKGROUND DEBUG forced resetEach of these sources has an associated bit in the system reset status register with the exception of the BACKGROUND DEBUG forced reset and the periodic hardware reset, PRST, that is indicated by the PRF bit in the PWUCS1 register.5.3 Computer Operating Properly (COP) WatchdogThe COP watchdog is intended to force a system reset when the application software fails to execute as expected. To prevent a system reset from the COP timer (when it is enabled), application software must reset the COP timer periodically. If the application program gets lost and fails to reset the COP before it times out, a system reset is generated to force the system back to a known starting point. The COP watchdog is enabled by the COPE bit in SIMOPT1 register. The COP timer is reset by writing any value to the address of SRS. This write does not affect the data in the read-only SRS. Instead, the act of writing to this address is decoded and sends a reset signal to the COP timer.The timeout period can be selected by the COPCLKS and the COPT[2:0] bits as shown in Table 18. The COPCLKS bit selects either the LFO or the CPU bus clock as the clocking source and the COPT[2:0] bits select the clock count required for a timeout. The tolerances of these timeout periods is dependent on the selected clock source (LFO or HFO). Table 18. COP Watchdog Timeout PeriodCOPCLKS COPT Clock SourceCOPOverflowCountCOP Overflow Time(ms, nominal)2100 000 LFO 25320 001 LFO 26640 010 LFO 271280 011 LFO 282560 100 LFO 295120 101 LFO 210 1024
FXTH870x6Sensors34 Freescale Semiconductor, Inc.After any reset, the COP timer is enabled. This provides a reliable way to detect code that is not executing as intended. If the COP watchdog is not used in an application, it can be disabled by clearing the COPE bit in the write-once SIMOPT1 register. Even if the application will use the reset default settings in COPE, COPCLKS and COPT[2:0], the user should still write to write-once SIMOPT1 during reset initialization to lock in the settings. That way, they cannot be changed accidentally if the application program gets lost.The write to SRS that services (clears) the COP timer should not be placed in an interrupt service routine (ISR) because the ISR could continue to be executed periodically even if the main application program fails. When the MCU is in ACTIVE BACKGROUND DEBUG mode, the COP timer is temporarily disabled.5.4 SIM Test Register (SIMTST)The output of the temperature monitor is available using the SIM Test register as shown in Figure 18.0 110 LFO 211 20480 111 LFO 211 2048BUSCLKS[1:0]1:1 (0.5 MHz) 1:0 (1 MHz) 0:1 (2 MHz) 0:0 (4MHz)1 000Bus Clock 213 16.384 8.192 4.096 2.0481 001Bus Clock 214 32.768 16.384 8.192 4.0961 010Bus Clock 215 65.536 32.768 16.384 8.1921 011Bus Clock 216 131.072 65.536 32.768 16.3841 100Bus Clock 217 262.144 131.072 65.536 32.7681 101Bus Clock 218 524.288 262.144 131.072 65.5361 110Bus Clock 219 1048.576 524.288 262.144 131.0721 111Bus Clock 219 1048.576 524.288 262.144 131.072$180F Bit 7 654321Bit 0RTRH TROWRESET: 00111001= ReservedFigure 18. SIM Test Register (SIMTST)Table 19. SIMTST Register Field DescriptionsField Description7reserved Reserved Bit — These bits are reserved for factory trim and should not be altered by the user.6:4TRHTemperature Restart High threshold — Binary coded from 0x00 to 0x07; recommend applications overwrite to 0x06 at each wakeup cycle.3:1reserved Reserved Bit — These bits are reserved for factory trim and should not be altered by the user.0TROTemperature Restart Outside 1 TR module is outside the TREARM temperature range and will restart the MCU if the TRE bit is set andtemperature falls back within the TRESET temperature range.0 TR module is within the TRESET temperature range and the MCU cannot be armed to restart whentemperature falls back to the TRESET range. The TRE bit cannot be set.Table 18. COP Watchdog Timeout Period (continued)COPCLKS COPT Clock SourceCOPOverflowCountCOP Overflow Time(ms, nominal)210
FXTH870x6SensorsFreescale Semiconductor, Inc. 355.5 InterruptsInterrupts provide a way to save the current CPU status and registers, execute an interrupt service routine (ISR), and then restore the CPU status so processing resumes where it left off before the interrupt. Other than the software interrupt (SWI), which is a program instruction, interrupts are caused by hardware events. The debug module can also generate an SWI under certain circumstances.If an event occurs in an enabled interrupt source, an associated read-only status flag will become set. The CPU will not respond until and unless the local interrupt enable is a logic 1 to enable the interrupt. The I bit in the CCR must be a logic 0 to allow interrupts. The global interrupt mask (I bit) in the CCR is initially set after reset which masks (prevents) all maskable interrupt sources. The user program initializes the stack pointer and performs other system setup before clearing the I bit to allow the CPU to respond to interrupts. When the CPU receives a qualified interrupt request, it completes the current instruction before responding to the interrupt. The interrupt sequence follows the same cycle-by-cycle sequence as the SWI instruction and consists of:• Saving the CPU registers on the stack• Setting the I bit in the CCR to mask further interrupts• Fetching the interrupt vector for the highest-priority interrupt that is currently pending• Filling the instruction queue with the first three bytes of program information starting from the address fetched from the interrupt vector locationsWhile the CPU is responding to the interrupt, the I bit is automatically set to avoid the possibility of another interrupt interrupting the ISR itself (this is called nesting of interrupts). Normally, the I bit is restored to 0 when the CCR is restored from the value stacked on entry to the ISR. In rare cases, the I bit may be cleared inside an ISR (after clearing the status flag that generated the interrupt) so that other interrupts can be serviced without waiting for the first service routine to finish. This practice is not recommended for anyone other than the most experienced programmers because it can lead to subtle program errors that are difficult to debug.The interrupt service routine ends with a return-from-interrupt (RTI) instruction which restores the CCR, A, X, and PC registers to their pre interrupt values by reading the previously saved information off the stack.When two or more interrupts are pending when the I bit is cleared, the highest priority source is serviced first.For compatibility with the M68HC08, the H register is not automatically saved and restored. It is good programming practice to push H onto the stack at the start of the interrupt service routine (ISR) and restore it just before the RTI that is used to return from the ISR.5.5.1 Interrupt Stack FrameFigure 18 shows the contents and organization of a stack frame. Before the interrupt, the stack pointer (SP) points at the next available byte location on the stack. The current values of CPU registers are stored on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After stacking, the SP points at the next available location on the stack which is the address that is one less than the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the main program that would have executed next if the interrupt had not occurred.When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part of the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information, starting from the PC address just recovered from the stack.The status flag causing the interrupt must be acknowledged (cleared) before returning from the ISR. Typically, the flag should be cleared at the beginning of the ISR so that if another interrupt is generated by this same source, it will be registered so it can be serviced after completion of the current ISR.
FXTH870x6Sensors36 Freescale Semiconductor, Inc.Figure 19. Interrupt Stack Frame5.5.2 Vector SummaryTable 20 provides a summary of all interrupt sources. Higher-priority sources are located toward the bottom of the table (at the higher vector addresses). All of these vectors are a 2-byte address that the firmware uses as the destination address. This allows the firmware to intercept all vectors and add additional processing as needed. The additional process latency for each interrupt will be described in Section 14.Therefore, the high-order byte of the address for the user’s interrupt service routine is located at the lower address in the vector address column, and the low-order byte of the address for the interrupt service routine is located at the higher address. When an interrupt condition occurs, an associated flag bit becomes set. If the associated local interrupt enable is set, an interrupt request is sent to the CPU. Within the CPU, if the global interrupt mask (I bit in the CCR) is 0, the CPU will finish the current instruction, stack the PCL, PCH, X, A, and CCR CPU registers, set the I bit, and then fetch the interrupt vector for the highest priority pending interrupt. Processing then continues in the interrupt service routine.The triggering of any of these vector fetches will wake the MCU from any of the STOP modes.CONDITION CODE REGISTERACCUMULATORINDEX REGISTER* (LOW BYTE X)PROGRAM COUNTER HIGHPROGRAM COUNTER LOWUNSTACKINGORDERSTACKINGORDERSP beforethe interruptSP afterinterrupt stackingTowards HIGHER AddressesTowards LOWER Addresses701234554321* High byte (H) of index register is not automatically stacked.
FXTH870x6SensorsFreescale Semiconductor, Inc. 37Table 20. Vector SummaryVector Priority VectorNo.Jump Table Vector Addr(High/Low)VectorName ModuleSource Flags Enables DescriptionLowerHigher15 $DFE0 - $DFE1 Vkbi KBI KBF KBIE Keyboard interrupt pins PTA[3:0]14 $DFE2 - $DFE3 Reserved13 $DFE4 - $DFE5 Reserved12 $DFE6 - $DFE7 Vrti Sys Ctrl RTIF RTIE Interrupt from the RTI when the periodic wakeup timer has timed out.11 $DFE8 - $DFE9 Vlfrcvr LFRLFIDF LFIDIE Interrupt from LFR in data mode when a valid wake ID has been received.LFCDF LFCDIE Interrupt from LFR in carrier mode when a carrier present for the required time.LFERF LFERIE Interrupt from LFR in the manchester decode mode when an error is detected.LFDRF LFDRIEInterrupt from LFR in the manchester decode mode when an 8-bit data byte has been successfully received.10 $DFEA - $DFEB Reserved9 $DFEC - $DFED Vrf RFMRFIFRFIENInterrupt from the RFM when the data buffer has been completely sent.RFEF Interrupt from the RFM when transmission error detected.8$DFEE - $DFEF Reserved7 $DFF0 - $DFF1 Vtpm1ovf TPM1 TOF TOIE Interrupt from the TPM1 when the timer overflows.6 $DFF2 - $DFF3 Vtpm1ch1 TPM1 CH1F CH1IE Interrupt from the TPM1 when the selected event for channel 1 occurs.5 $DFF4 - $DFF5 Vtpm1ch0 TPM1 CH0F CH0IE Interrupt from the TPM1 when the selected event for channel 0 occurs.4 $DFF6 - $DFF7 Vwuktmr PWU WUKI WUK[5:0] Interrupt from the PWU when the wakeup time interval has elapsed.3 $DFF8 - $DFF9 Vlvd Sys Ctrl LVDF LVDIE Interrupt from the LVD when the supply voltage has dropped below the LVD threshold.2$DFFA - $DFFB Reserved1 $DFFC - $DFFD Vswi SWI opcode — — Interrupt from the CPU when an SWI instruction has been executed.0 $DFFE -$DFFF VresetSys Ctrl - POR — — Reset from power on sequence.Sys Ctrl - PRF PRF PRST[5:0] Reset from PWU when the reset interval elapsed.Sys Ctrl - COP — COPE Reset when COP watchdog times out.Sys Ctrl - LVD — LVDRE Reset from the LVD when the supply voltage has dropped below the LVD threshold.Temp Restart — TRE Reset when the temperature falls below the temperature restart thresholdIllegal opcode — — Reset from the CPU when trying to execute an illegal opcode.Illegal address — — Reset from the CPU when trying to access an illegal address.
FXTH870x6Sensors38 Freescale Semiconductor, Inc.5.6 Low-Voltage Detect (LVD) SystemThe FXTH870x6 includes a system to detect low voltage conditions in order to protect memory contents and control MCU system states during supply voltage variations. The system is comprised of a power-on reset (POR) circuit and an LVD circuit with a user selectable trip voltage, either high (VLVDH) or low (VLVDL). The LVD circuit is enabled when LVDE in SPMSC1 is high and the trip voltage is selected by LVDV in SPMSC3. The LVD is disabled upon entering any of the STOP modes unless the LVDSE bit is set. If LVDSE and LVDE are both set, then the MCU cannot enter STOP1.5.6.1 Power-On Reset OperationWhen power is initially applied to the FXTH870x6, or when the supply voltage drops below the VPOR level, the POR circuit will cause a reset condition. As the supply voltage rises, the LVD circuit will hold the chip in reset until the supply has risen above the level determined by LVDV bit. Both the POR bit and the LVD bit in SRS are set following a POR.5.6.2 LVD Reset OperationThe LVD can be configured to generate a reset upon detection of a low voltage condition has occurred by setting LVDRE to 1 when the supply voltage has fallen below the level determined by LVDV bit. After an LVD reset has occurred, the LVD system will hold the FXTH870x6 in reset until the supply voltage has risen above the level determined by LVDV bit. The threshold for falling and rising differ by a small amount of hysteresis. The LVD bit in the SRS register is set following either an LVD reset or POR.5.6.3 LVD Interrupt OperationWhen a low voltage condition is detected and the LVD circuit is configured for interrupt operation (LVDE set, LVDIE set, and LVDRE clear), then LVDF will be set and an LVD interrupt will occur.5.6.4 Low-Voltage Warning (LVW)The LVD system has a low voltage warning flag, LVWF, to indicate to the user that the supply voltage is approaching, but is still above, the LVD reset voltage. The LVWF can be reset by writing a logical one to the LVWACK bit. The LVW does not have an interrupt associated with it. There are two user selectable trip voltages for the LVW as selected by LVWV in SPMSC3. The LVWF is set when the supply voltage falls below the selected level and cannot be reset until the supply voltage has risen above the selected level. The threshold for falling and rising differ by a small amount of hysteresis.5.7 System Clock ControlSeveral clock rate selections are possible with the FXTH870x6 using the BUSCLKS[1:0] control bits to select the clock frequency division of the HFO as given in Table 21. These bits are cleared by any MCU reset.5.8 Keyboard InterruptsThe keyboard interrupts can be used to wake the MCU. These are assigned to specific general I/O pins as given in Table 22. Table 21. HFO Frequency SelectionsBUSCLKS1 BUSCLKS0 HFO Frequency(MHz) CPU Bus Frequency (MHz)00 8 401 4 210 2 111 1 0.5Table 22. Keyboard Interrupt AssignmentsKBI Pin Pin Function0 PTA0 General I/O1 PTA1 General I/O2 PTA2 General I/O3 PTA3 General I/O
FXTH870x6SensorsFreescale Semiconductor, Inc. 395.9 Real Time InterruptThe RTI uses the internal low frequency oscillator (LFO) as its clock source. The RTI can be used as a periodic interrupt in MCU RUN mode, or can be used as a periodic wakeup from all low power modes. The LFO is always active and cannot be powered off by any software control. The control bits for the RTI are shown in Figure 20.$1808 Bit 7 6 5 4 3 2 1 Bit 0RRTIF 0 RTICLKS RTIE 0 RTIS[2:0]WRTIACKRESET: 00000000POR: 00000000= ReservedFigure 20. RTI Status/Control Register (SRTISC)Table 23. SRTISC Register Field DescriptionsField Description7RTIFRTI Interrupt Flag — The RTIF bit indicates when a wakeup interrupt has been generated by the RTI. This bit is cleared by writing a one to the RTIACK bit. Writing a zero to this bit has no effect. Reset clears this bit.0 Wakeup interrupt not generated or was previously acknowledged.1 Wakeup interrupt generated.6RTIACKAcknowledge RTIF Interrupt Flag — The RTIACK bit clears the RTIF bit if written with a one. Writing a zero to the RTIACK bit has no effect on the RTIF bit. Reading the RTIACK bit returns a zero. Reset has no effect on this bit.0 No effect.1 Clear RTIF bit.5RTICLKSRTI Interrupt Clock Select — This read-write bit selects the clock source for the real-time interrupt request0 Real-time interrupt request clock source is the LFO.1 Real-time interrupt request clock source is the HFO (MCU must be in the RUN mode).4RTIERTIF Interrupt Enable — The RTIE bit enables RTI interrupts if written with a one. Reset clears this bit.0 Disable RTI interrupts.1 Enable RTI interrupts.3Unused Unused2:0RTIS[2:0]RTI Interrupt Delay Selects — The RTIS[2:0] bits select the timing of the RTI interrupts as givenin Table 24. Reset clears these bits.
FXTH870x6Sensors40 Freescale Semiconductor, Inc. 5.10 Temperature Sensor and Restart SystemThe FXTH870x6 has two temperature sensing mechanisms. The first is an accurate sensor which is accessible through the ADC10 channel 1. The second is a less accurate, very low power sensor which generates a wakeup from STOP1 when the temperature crosses its threshold of detection. This is the temperature restart wakeup which is used as follows:1. The temperature restart wakeup is enabled by software following detection of an over temperature condition using the temperature sensor connected to the ADC10.2. User software enables the temperature restart detector and then instructs the MCU to enter STOP1 mode to halt execution during the out-of-range temperature condition.3. When the temperature crosses the temperature restart threshold back into the normal range of operation, a wakeup is generated to wake the MCU. Exit from STOP1 will reset the device.The temperature sensor is enabled whenever the ADC10 is enabled. The temperature restart wakeup is enabled by setting the TRE bit in SIMOPT1 register and whether the detector interrupts the MCU from a very low or a very high temperature is determined by the TRH bit in the SIMOPT1 register.5.11 Reset, Interrupt and System Control Registers And BitsOne 8-bit register in the direct page register space and eight 8-bit registers in the high-page register space are related to reset and interrupt systems.5.11.1 System Reset Status Register (SRS)The SRS register at $1800 includes seven read-only status flags to indicate the source of the most recent reset. When a debug host forces reset by writing 1 to BDFR in the SBDFR register, none of the status bits in SRS will be set. Writing any value to this register address clears the COP watchdog timer without affecting the contents of this register. The reset state of these bits depends on what caused the MCU to reset.Table 24. Real-Time Interrupt PeriodRTIS2 RTIS1 RTIS0 Delay Timing (ms)(Dependent on 1-kHz LFO)000 OFF001 2010 4011 8100 16101 32110 64111 128$1800 Bit 7 6 5 4 3 2 1 Bit 0RPOR PIN COP ILOP ILAD PWU LVD 0WPOR Reset: 10000010LVD Reset: 10000010Any OtherReset: 0(1)(1)(1)(1) 000= Reserved1. Any of these reset sources that are active at the time of reset will cause the corresponding bit(s) to be set; bits corresponding to sources that are not active at the time of reset will be cleared.Figure 21. System Reset Status Register (SRS)
FXTH870x6SensorsFreescale Semiconductor, Inc. 415.11.2 System Options Register 1 (SIMOPT1)The following clock source and frequency selections are available using the system option register 1 as shown in Figure 22.Table 25. SRS Register Field DescriptionsField Description7PORPower-On Reset — This bit indicates reset was caused by the power-on detection logic. Because the internal supply voltage was ramping up at the time, the low-voltage reset (LVR) status bit is also set to indicate that the reset occurred while the internal supply was below the LVR threshold.0 Reset not caused by POR1 POR caused reset6PINExternal Reset Pin — This bit indicates reset was caused by an active-low level on the external reset pin if the device was in either the STOP1 or RUN modes. This bit is not set if the external reset pin is pulled low when the device is in the STOP1 mode.0 Reset not caused by external reset pin1 Reset came from external reset pin5COPComputer Operating Properly (COP) Watchdog — This bit indicates that reset was caused by the COP watchdog timer timing out. This reset source may be blocked by COPE = 0.0 Reset not caused by COP timeout1 Reset caused by COP timeout4ILOPIllegal Opcode — This bit indicates reset was caused by an attempt to execute an unimplemented or illegal opcode. The STOP instruction is considered illegal if STOP is disabled by STOPE = 0 in the SOPT register. The BGND instruction is considered illegal if ACTIVE BACKGROUND mode is disabled by ENBDM = 0 in the BDCSC register.0 Reset not caused by an illegal opcode1 Reset caused by an illegal opcode3ILADIllegal Address — This bit indicates reset was caused by an attempt to access either data or an instruction at an unimplemented memory address.0 Reset not caused by an illegal address1 Reset caused by an illegal address2PWUProgrammable Wakeup — This bit indicates reset was caused by a PWU reset in run, WAIT, STOP4, and STOP3. After STOP1 exit, PRF in PWUCSI indicates PWU was the source of a wakeup.0 Reset not caused by PWU.1 Reset caused by PWU.1LVDLow Voltage Detect — If the LVDRE and LVDSE bits are set and the supply drops below the LVD trip voltage, an LVD reset will occur. This bit is also set by POR.0 Reset not caused by LVD trip or POR.1 Reset caused by LVD trip or POR.0Unused Unused Bit — This bit always reads as a logical zero. Writes$1802 Bit 7 6 5 4 3 2 1 Bit 0RCOPE COPCLKS STOPE RFEN TRE TRH BKGDPEWRESET: 100-0011= ReservedFigure 22. System Option Register 1 (SIMOPT1)Table 26. SIMOPT1 Register Field DescriptionsField Description7COPECOP Enable — This control bit enables the COP watchdog. This bit is a write-once bit so that only the first write after reset is honored. Reset sets the COPE bit.0 COP Watchdog disabled.1 COP Watchdog enabled.
FXTH870x6Sensors42 Freescale Semiconductor, Inc.5.11.3 System Operation Register 2 (SIMOPT2)The following clock source and frequency selections are available using the system option register 2 as shown in Figure 23.6COPCLKSCOP Clock Select — This control bit selects the clock source for the COP watchdog timer. This bit is a write-once bit so that only the first write after reset is honored. This bit is cleared by an MCU reset.0 Select the LFO oscillator output.1 Select the CPU bus clock.5STOPESTOP Mode Select — This control bit enables/disables the STOP instruction to enter a STOP mode defined by the SPMSCR2 register. This bit is a write-once bit so that only the first write after reset is honored. This bit is cleared by an MCU reset.0 Disable STOP modes.1 Enable STOP modes.4RFENRF Module Enable — This bit enables or disables the RF module. This bit is not affected by any reset or power on after STOP exit. It is only initialized at the first power up. This bit can be written anytime.1 RF module enabled.0 RF module disabled.3TRETemperature Restart Enable — This control bit enables the temperature restart circuit to interrupt the MCU after being shutdown at either a very high or very low temperature. This bit is cleared by an MCU reset.0 Temperature restart disabled.1 Temperature restart enabled.2TRHTemperature Restart Level — This control bit selects whether the temperature restart circuit will interrupt the MCU after being shutdown on returning from either a very high or very low temperature. This bit is cleared by an MCU reset.0 Temperature restart interrupts MCU on return from a very low temperature.1 Temperature restart interrupts MCU on return from a very high temperature.1BKGDPEBKGD Pin Enable — BKGDPE can be used to allow the BKGD/PTA4 pin to be shared in applications as an input-only general purpose I/O pin:0 BKGD function disabled, PTA4 enabled.1 BKGD function enabled, PTA4 disabled.0Reserved Reserved register bit, always reads 1.$1803 Bit 7 6 5 4 3 2 1 Bit 0R0 COPT[2:0] LFOSEL TCLKDIV BUSCLKS[1:0]WRESET: 01110000Figure 23. System Option Register 2 (SIMOPT2)Table 27. SIMOPT2 Register Field DescriptionsField Description7Unused Unused Bit — This bit is unused and reads as a logic zero.6:4COPT[2:0]COP Watchdog Time Out — These control bits select the timeout period for the COP watchdog timer as given in Table 18. These bits are set by an MCU reset to select the longest watchdog timeout period. These bits are write-once after power up.3LFOSELTPM1 Channel 0 Clock Source — This bit determines which signal is connected to the TPM1 Channel 0, see Section 9.0 Select clock input driven by PTA2.1 Select clock input driven by the LFO.2TCLKDIVTPM1 Channel 0 CLock Source Divider — The divider for the clock Source for TPM1 Channel 0, see Section 9.0 Select RFM Dx clock source divided by 1.1 Select RFM Dx clock source divided by 8.Table 26. SIMOPT1 Register Field Descriptions (continued)Field Description
FXTH870x6SensorsFreescale Semiconductor, Inc. 435.11.4 System Power Management Status and Control 1 Register (SPMSC1)Figure 24. System Power Management Status and Control 1 Register (SPMSC1)1:0BUSCLKS[1:0]Bus Clock Select — Bus clock frequency selection by changing HFO FLL ratio as shown in Figure 2. The bus clock frequency is always the HFO frequency divided by two. These bits are cleared by a reset and can be written at any time.00 Bus Frequency = 4 MHz (HFO = 8 MHz)01 Bus Frequency = 2 MHz (HFO = 4 MHz)10 Bus Frequency = 1 MHz (HFO = 2 MHz)11 Bus Frequency = 0.5 MHz (HFO = 1 MHz)$1809 7 654321(1)1. Bit 1 is a reserved bit that must always be written to 0.0RLVDF 0 LVDIE LVDRE(2)2. This bit can be written only one time after reset. Additional writes are ignored.LVDSE LVDE(2) 0BGBEWLVDACKReset: 0 0011100= ReservedTable 28. SPMSC1 Register Field DescriptionsField Description7LVDF Low-Voltage Detect Flag — Provided LVDE = 1, this read-only status bit indicates a low-voltage detect event. 6LVDACKLow-Voltage Detect Acknowledge — This write-only bit is used to acknowledge low voltage detection errors (write 1 to clear LVDF). Reads always return logic 0. 5LVDIELow-Voltage Detect Interrupt Enable — This read/write bit enables hardware interrupt requests for LVDF. 0 Hardware interrupt disabled (use polling)1 Request a hardware interrupt when LVDF = 14LVDRELow-Voltage Detect Reset Enable — This read/write bit enables LVDF events to generate a hardware reset (provided LVDE = 1). 0 LVDF does not generate hardware resets1 Force an MCU reset when LVDF = 13LVDSELow-Voltage Detect Stop Enable — Provided LVDE = 1, this read/write bit determines whether the low-voltage detect function operates when the MCU is in STOP mode.0 Low-voltage detect disabled during STOP mode1 Low-voltage detect enabled during STOP mode2LVDELow-Voltage Detect Enable — This read/write bit enables low-voltage detect logic and qualifies the operation of other bits in this register. 0 LVD logic disabled1 LVD logic enabled0ReservedReserved Bit — This bit is reserved should not be altered by the user. Any read returns a logical zero. Any write should be a logical zero.0BGBEBandgap Buffer Enable — The BGBE bit is used to enable an internal buffer for the bandgap voltage reference for use by the ADC module on one of its internal channels.0 Bandgap buffer disabled1 Bandgap buffer enabledTable 27. SIMOPT2 Register Field Descriptions (continued)Field Description
FXTH870x6Sensors44 Freescale Semiconductor, Inc.5.11.5 System Power Management Status and Control 2 Register (SPMSC2)This register is used to configure the STOP mode behavior of the MCU.Figure 25. System Power Management Status and Control 2 Register (SPMSC2)5.11.6 System Power Management Status and Control 3 Register (SPMSC3)Figure 26. System Power Management Status and Control 3 Register (SPMSC3)$180A 76543210R000PDF00PDC(1)1.  This bit can be written only one time after reset. Additional writes are ignored.0WPPDACKPower-on reset: 00000000Any other reset: 00UU0000= Reserved U = Unaffected by resetTable 29. SPMSC2 Register Field DescriptionsField Description7:5Reserved Reserved Bits — These bits are reserved should not be altered by the user. Any read returns a logical zero.4PDFPower Down Flag — This read-only status bit indicates the MCU has recovered from STOP1 mode.0 MCU has not recovered from STOP1 mode1 MCU recovered from STOP1 mode3Reserved Reserved Bit — This bit is reserved should not be altered by the user. Any read returns a logical zero.2PPDACK Partial Power Down Acknowledge — Writing a logic 1 to PPDACK clears the PDF bit.1PDCPower Down Control — The PDC bit controls entry into the power down (STOP1) mode0 Power down mode are disabled1 Power down mode are enabled0ReservedReserved Bit — This bit is reserved should not be altered by the user. Any read returns a logical zero. Any write should be a logical zero.$180C 7 6543210RLVWF 0 LVDV LVWV 0000WLVWACKPower-on reset: 0(1)1. LVWF will be set in the case when VSupply transitions below the trip point or after reset and VSupply is already below VLVW. 000 0 000LVD reset: 0(1) 0UU 0 000Any other reset: 0(1) 0UU 0 000= Reserved U = Unaffected by resetTable 30. SRTISC Register Field DescriptionsField Description7LVWFLow-Voltage Warning Flag — The LVWF bit indicates the low voltage warning status.0 Low voltage warning not present1 Low voltage warning is present or was present
FXTH870x6SensorsFreescale Semiconductor, Inc. 455.12 System STOP Exit Status Register (SIMSES)The SIMSES register at $180D can be used to determine the source of an MCU wakeup from the STOP modes. The flags are as shown in Figure 27. All of the flags are automatically cleared when the MCU goes into a STOP mode. Writes to any of these bits are ignored.6LVWACKLow-Voltage Warning Acknowledge — The LVWF bit indicates the low voltage warning status.Writing a logic 1 to LVWACK clears LVWF to a logic 0 if a low voltage warning is not present.5LVDVLow-Voltage Detect Voltage Select — The LVDV bit selects the LVD trip point voltage (VLVD).0 Low trip point selected (VLVD = VLVDL)1 High trip point selected (VLVD = VLVDH)4LVWVLow-Voltage Warning Voltage Select — The LVWV bit selects the LVW trip point voltage (VLVW).0 Low trip point selected (VLVW = VLVDL)1 High trip point selected (VLVW = VLVDH)3:0Reserved Reserved Bits — These bits are reserved should not be altered by the user. Any read returns a logical zero.$180D Bit 7 6 5 4 3 2 1 Bit 0RReserved KBF IRQF TRF PWUF LFF RFFWRESET: 00000000= ReservedFigure 27. SIM STOP Exit Status (SIMSES)Table 31. SIMSES Register Field DescriptionsField Description7:6ReservedReserved Bits — These bits are reserved for Freescale firmware control. Application software shall assure these two bits are never overwritten.5KBFKeyboard Flag — This bit indicates that any keyboard pin caused the last exit from STOP mode.0 Keyboard pin did not cause the last exit from STOP mode1 Keyboard pin caused the last exit from STOP mode4IRQFIRQ Flag — This bit indicates that IRQ pin caused the last exit from STOP mode.0 IRQ pin did not cause the last exit from STOP mode1 IRQ pin caused the last exit from STOP mode3TRFTemperature Restart Flag — This bit indicates that the temperature restart module caused the last exit from STOP mode.0 TR module did not cause the last exit from STOP mode1 TR module caused the last exit from STOP mode2PWUFPWU Flag — This bit indicates that the PWU module caused the last exit from STOP mode.0 PWU module did not cause the last exit from STOP mode1 PWU module caused the last exit from STOP mode1LFFLFR Flag — This bit indicates that the LFR module caused the last exit from STOP mode.0 LFR module did not cause the last exit from STOP mode1 LFR module caused the last exit from STOP mode0RFFRFM Flag — This bit indicates that the RFM module caused the last exit from STOP mode.0 RFM module did not cause the last exit from STOP mode1 RFM module caused the last exit from STOP modeTable 30. SRTISC Register Field Descriptions (continued)Field Description
FXTH870x6Sensors46 Freescale Semiconductor, Inc.6 General Purpose I/OThis section explains software controls related to general purpose input/output (I/O) and pin control. The FXTH870x6 has seven general-purpose I/O pins which are comprised of a general use 5-bit port A and a 2-bit port B.PTA[4:0] pins are shared with on-chip peripheral functions. PTB[1:0] pins are GPIO only and are mutually exclusive with the LF receiver, such that PTB[1:0] pins become high impedance when the LF is enabled (see Section 6.5 for additional details regarding mutually exclusive operations). The peripheral modules have priority over the general purpose I/O so that when a peripheral is enabled, the general purpose I/O functions associated with the shared pins are disabled. After reset, the shared peripheral functions are disabled so that the pins are controlled by the general purpose I/O. All of the general purpose I/O are configured as inputs (PTxDDn = 0) with pullup devices disabled (PTxPEn = 0).To avoid extra current drain from floating input pins, the user’s application software must configure these pins so that they do not float (see Section 6.1).Reading and writing of general purpose I/O is performed through the port data registers. The direction, either input or output, is controlled through the port data direction registers. The general purpose I/O port function for an individual pin is illustrated in the block diagram in Figure 28.Figure 28. General Purpose I/O Block DiagramQDQD10Port ReadPTxDDnPTxDnOutput EnableOutput DataInput DataSynchronizerDataBUSCLKS
FXTH870x6SensorsFreescale Semiconductor, Inc. 47Figure 29. General Purpose I/O LogicThe data direction control bit (PTxDDn) determines whether the output buffer for the associated pin is enabled, and also controls the source for port data register reads. The input buffer for the associated pin is always enabled unless the pin is enabled as an analog function.When a shared digital function is enabled for a pin, the output buffer is controlled by the shared function. However, the data direction register bit still controls the source for reads of the port data register.When a shared analog function is enabled for a pin, both the input and output buffers are disabled. A value of 0 is read for any port data bit where the bit is an input (PTxDDn = 0) and the input buffer is disabled. In general, whenever a pin is shared with both an alternate digital function and an analog function, the analog function has priority such that if both the digital and analog functions are enabled, the analog function controls the pin.It is a good programming practice to write to the port data register before changing the direction of a port pin to become an output. This ensures that the pin will not be driven momentarily with an old data value that happened to be in the port data register.Table 32. Truth Table for Pullup and Pulldown ResistorsPTAPE[3:0](pull enable) PTADD[3:0](data direction) KBIPE[3:0](KBI pin enable) KBEDG[3:0](KBI Edge Select) Pullup Pulldown0 0 x x disabled disabled1 0 0 x enabled disabledx 1 x x disabled disabled1 0 1 0 enabled disabled1 0 1 1 disabled enabledPTBPE[1:0](pull enable) PTBDD[1:0](data direction)0 0 x x disabled x1 0 x x enabled xx 1 x x disabled xPTxPEnKBEDEyKBIPGyVDDPTxDnRPURPDPTxDDnWritePTxDnReadPTxPEnKBEDGyKBIPEyKBI interruptKBACK  KBMODPort pinPTA[3:0]onlyPTA[3:0]only
FXTH870x6Sensors48 Freescale Semiconductor, Inc.An internal pullup device can be enabled for each port pin by setting the corresponding bit in one of the pullup enable registers (PTxPEn). The pullup device is disabled if the pin is configured as an output by the general purpose I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup enable register bit. The pullup device is also disabled if the pin is controlled by an analog function.6.1 Unused Pin ConfigurationAny general purpose I/O pins which are not used in the application must be properly configured to avoid a floating input that could cause excessive supply current, IDD. When the device comes out of the reset state the Freescale supplied firmware will not configure any of the general purpose I/O pins.Recommended configuration methods are:1. Configure the general purpose I/O pin as an input (PTxDDn = 0) with the pin connected to the VDD source; use a pullup resistor of 10-51 k to assure sufficient noise immunity.2. Configure the general purpose I/O pin as an input (PTxDDn = 0) with the internal pullup activated (PTxPEn = 1) and leave the pin disconnected.3. Configure the general purpose I/O pin as an output (PTxDDn = 1) and drive the pin low (PTxDn = 0) and leave the pin disconnected.In cases where GPIOs are directly connected to AVDD, VDD, AVSS, VSS or RVSS, user application should configure the GPIO as an input with the internal pull-up disabled, in order to prevent software code faults from causing excessive supply current states should these pins become outputs.6.2 Pin Behavior in STOP ModesPin behavior following execution of a STOP instruction depends on the STOP mode that is entered. An explanation of pin behavior for the various STOP modes follows:• In STOP1 mode, all internal registers including general purpose I/O control and data registers are powered off. Each of the pins assumes its default reset state (input buffer, output buffer and internal pullup disabled). Upon exit from STOP1, all pins must be reconfigured the same as if the MCU had been reset.• In STOP4 mode, all pin states are maintained because internal logic stays powered up. Upon recovery, all pin functions are the same as before entering STOP4.6.3 General Purpose I/O RegistersThis section provides information about the registers associated with the general purpose I/O ports and pin control functions. These general purpose I/O registers are located in page zero of the memory map and the pin control registers are located in the high page register section of memory.6.4 Port A RegistersPort A general purpose I/O function is controlled by the registers described in this section.$0000 Bit 7 654321Bit 0RPTAD[4:0]WReset: 00000000= ReservedFigure 30. Port A Data Register (PTAD)
FXTH870x6SensorsFreescale Semiconductor, Inc. 496.5 Port B RegistersPort B PTB[1:0] functions are multiplexed with the LF receiver block such that the port B GPIOs become high impedance when the LF block has been enabled. When the LF block is disabled, port B pins operate as described here.Table 33. Port A Data Register Field DescriptionsField Description4:0PTAD[4:0]Port A Data Register Bit — For port A pins that are inputs, reads return the logic level on the pin. For port A pins that are configured as outputs, reads return the last value written to this register.Writes are latched into all bits of this register. For port A pins that are configured as outputs, the logic level is driven out the corresponding MCU pin.Reset forces PTAD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures all port pins as high-impedance inputs with pullups disabled.$0001 Bit 7 654321Bit 0RPTAPE[3:0]WReset: 00000000= ReservedFigure 31. Internal Pullup Enable for Port A Register (PTAPE)Table 34. Port A Register Pullup Enable Field DescriptionsField Description3:0PTAPE[3:0]Internal Pullup Enable for Port A Bit n — Each of these control bits determines if the internal pullup device is enabled for the associated PTA pin. For port A pins that are configured as outputs, these bits have no effect and the internal pullup devices are disabled.0 Internal pullup device disabled for port A bit n.1 Internal pullup device enabled for port A bit n.$0003 Bit 7 654321Bit 0RPTADD[3:0]WReset: 00000000= ReservedFigure 32. Data Direction for Port A Register (PTADD)Table 35. Port A Data Direction Field DescriptionsField Description3:0PTADD[3:0]Data Direction for Port A Bit n — These read/write bits control the direction of port A pins and what is read for PTADD reads.0 Input (output driver disabled) and reads return the pin value.1 Output driver enabled for port A bit n and PTADD reads return the contents of PTADDn. PTA4 is input-only, therefore bit 4 will always be 0.$0004 Bit 7 654321Bit 0RPTBD[1:0]WReset: 00000000= ReservedFigure 33. Port B Data Register (PTBD)
FXTH870x6Sensors50 Freescale Semiconductor, Inc.Table 36. Port B Data Register Field DescriptionsField Description1:0PTBD[1:0]Port B Data Register Bit n — For port B pins that are inputs, reads return the logic level on the pin. For port B pins that are configured as outputs, reads return the last value written to this register.Writes are latched into all bits of this register. For port B pins that are configured as outputs, the logic level is driven out the corresponding MCU pin.Reset forces PTBD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures all port pins as high-impedance inputs with pullups disabled.$0005 Bit 7 654321Bit 0RPTBPE[1:0]WReset: 00000000= ReservedFigure 34. Internal Pullup Enable for Port B Register (PTBPE)Table 37. Port B Register Pullup Enable Field DescriptionsField Description1:0PTBPE[1:0]Internal Pullup Enable for Port B Bit n — Each of these control bits determines if the internal pullup device is enabled for the associated PTB pin. For port B pins that are configured as outputs, these bits have no effect and the internal pullup devices are disabled.0 Internal pullup device disabled for port B bit n.1 Internal pullup device enabled for port B bit n.$0007 Bit 7 654321Bit 0RPTBDD[1:0]WReset: 00000000= ReservedFigure 35. Data Direction for Port B Register (PTBDD)Table 38. Port B Data Direction Field DescriptionsField Description1:0PTBDD[1:0]Data Direction for Port B Bit n — These read/write bits control the direction of port B pins and what is read for PTBDD reads.0 Input (output driver disabled) and reads return the pin value.1 Output driver enabled for port B bit n and PTBDD reads return the contents of PTBDDn.
FXTH870x6SensorsFreescale Semiconductor, Inc. 517 Keyboard InterruptThe FXTH870x6 has a KBI module with general purpose I/O pins. 7.1 FeaturesThe KBI features include:• Up to four keyboard interrupt pins with individual pin enable bits.• Each keyboard interrupt pin is programmable as falling edge (or rising edge) only, or both falling edge and low level (or both rising edge and high level) interrupt sensitivity.• One software enabled keyboard interrupt.• Exit from low-power modes.7.2 Modes of OperationThis section defines the KBI operation in WAIT, STOP, and BACKGROUND DEBUG modes.7.2.1 KBI in STOP ModesThe KBI operates asynchronously in STOP4 mode if enabled before executing the STOP instruction. Therefore, an enabled KBI pin (KBPE[3:0]) can be used to bring the MCU out of STOP4 mode if the KBI interrupt is enabled (KBIE = 1).During STOP1 mode, the KBI is disabled. In some systems, the pins associated with the KBI may be sources of wakeup from STOP1, see the STOP modes section in the Section 3. Upon wakeup from STOP1 mode, the KBI module will be in the reset state.7.2.2 KBI in ACTIVE BACKGROUND modeWhen the microcontroller is in ACTIVE BACKGROUND mode, the KBI will continue to operate normally.7.3 Block DiagramThe block diagram for the keyboard interrupt module is shown Figure 36.Figure 36. KBI Block Diagram7.4 External Signal DescriptionThe KBI input pins can be used to detect either falling edges, or both falling edge and low level interrupt requests. The KBI input pins can also be used to detect either rising edges, or both rising edge and high level interrupt requests. PTA[3:0] map to KBIPE and KBEDG function bits [3:0].The signal properties of KBI are shown in Table 39.Table 39. Signal PropertiesSignal Function I/OKBIPn Keyboard interrupt pins IDQCKCLRVDDKBMODKBIEKEYBOARDINTERRUPT FFKBACKRESETSYNCHRONIZERKBFSTOP BYPASSSTOPBUSCLKKBIPEn01SKBEDGnKBIPE001SKBEDG0KBIP0KBIPnKBIINTERRUP
FXTH870x6Sensors52 Freescale Semiconductor, Inc.7.5 Register DefinitionsThe KBI includes three registers:• An 4-bit pin status and control register.• An 4-bit pin enable register.• An 4-bit edge select register.7.5.1 KBI Status and Control Register (KBISC)KBISC contains the status flag and control bits, which are used to configure the KBI.7.5.2 KBI Pin Enable Register (KBIPE)KBIPE contains the pin enable control bits.$000C 7 6 5 4 3 2 1 0R0000KBF0KBIE KBMODWKBACKReset: 00000000= ReservedFigure 37. KBI Status and Control RegisterTable 40. KBISC Register Field DescriptionsField Description7:4 Unused register bits, always read 0.3KBFKeyboard Interrupt Flag — KBF indicates when a keyboard interrupt is detected. Writes have no effect on KBF.0 No keyboard interrupt detected.1 Keyboard interrupt detected.2KBACK Keyboard Acknowledge — Writing a 1 to KBACK is part of the flag clearing mechanism. KBACK always reads as 0.1KBIEKeyboard Interrupt Enable — KBIE determines whether a keyboard interrupt is requested.0 Keyboard interrupt request not enabled.1 Keyboard interrupt request enabled.0KBMODKeyboard Detection Mode — KBMOD (along with the KBEDG bits) controls the detection mode of the keyboard interrupt pins.0 Keyboard detects edges only.1 Keyboard detects both edges and levels.$000D 7 6 5 4 3 2 1 0RKBIPE3 KBIPE2 KBIPE1 KBIPE0WReset: 00000000Figure 38. KBI Pin Enable RegisterTable 41. KBIPE Register Field DescriptionsField Description3:0KBIPEnKeyboard Pin Enables — Each of the KBIPEn bits enable the corresponding keyboard interrupt pin.0 Pin not enabled as keyboard interrupt.1 Pin enabled as keyboard interrupt.
FXTH870x6SensorsFreescale Semiconductor, Inc. 537.5.3 KBI Edge Select Register (KBIES)KBIES contains the edge select control bits.7.6 Functional DescriptionThis on-chip peripheral module is called a keyboard interrupt (KBI) module because originally it was designed to simplify the connection and use of row-column matrices of keyboard switches. However, these inputs are also useful as extra external interrupt inputs and as an external means of waking the MCU from STOP or WAIT low-power modes.The KBI module allows up to eight pins to act as additional interrupt sources. Writing to the KBIPE[3:0] bits in the keyboard interrupt pin enable register (KBIPE) independently enables or disables each KBI pin. Each KBI pin can be configured as edge sensitive or edge and level sensitive based on the KBMOD bit in the keyboard interrupt status and control register (KBISC). Edge sensitive can be software programmed to be either falling or rising; the level can be either low or high. The polarity of the edge or edge and level sensitivity is selected using the KBEDG[3:0] bits in the keyboard interrupt edge select register (KBIES).Synchronous logic is used to detect edges. Prior to detecting an edge, enabled keyboard inputs must be at the reset logic level. A falling edge is detected when an enabled keyboard input signal is seen as a logic 1 (the reset level) during one bus cycle and then a logic 0 (the asserted level) during the next cycle. A rising edge is detected when the input signal is seen as a logic 0 during one bus cycle and then a logic 1 during the next cycle.7.6.1 Edge Only SensitivityA valid edge on an enabled KBI pin will set KBF in KBISC. If KBIE in KBISC is set, an interrupt request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in KBISC.7.6.2 Edge and Level SensitivityA valid edge or level on an enabled KBI pin will set KBF in KBISC. If KBIE in KBISC is set, an interrupt request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in KBISC provided all enabled keyboard inputs are at their reset levels. KBF will remain set if any enabled KBI pin is asserted while attempting to clear by writing a 1 to KBACK.7.6.3 KBI Pullup/Pulldown ResistorsThe KBI pins can be configured to use an internal pullup/pulldown resistor using the associated I/O port pullup enable register. If an internal resistor is enabled, the KBIES register is used to select whether the resistor is a pullup (KBEDG[3:0] = 0) or a pulldown (KBEDG[3:0] = 1).7.6.4 KBI InitializationWhen a keyboard interrupt pin is first enabled it is possible to get a false keyboard interrupt flag. To prevent a false interrupt request during keyboard initialization, the user should do the following:1. Mask keyboard interrupts by clearing KBIE in KBISC.2. Enable the KBI polarity by setting the appropriate KBEDGn bits in KBIES.3. If using internal pullup/pulldown device, configure the associated pullup enable bits in PTAPE[3:0].4. Enable the KBI pins by setting the appropriate KBIPE[3:0] bits in KBIPE.5. Write to KBACK in KBISC to clear any false interrupts.6. Set KBIE in KBISC to enable interrupts.$000E 7 6 5 4 3 2 1 0RKBEDG3 KBEDG2 KBEDG1 KBEDG0WReset: 00000000Figure 39. KBI Edge Select RegisterTable 42. KBIES Register Field DescriptionsField Description3:0KBEDGnKeyboard Edge Selects — Each of the KBEDGn bits selects the falling edge/low level or rising edge/high level function of the corresponding pin).0 Falling edge/low level.1 Rising edge/high level.
FXTH870x6Sensors54 Freescale Semiconductor, Inc.8 Central Processing Unit8.1 IntroductionThis section provides summary information about the registers, addressing modes, and instruction set of the CPU of the HCS08 Family. For a more detailed discussion, refer to the HCS08 Family Reference Manual, volume 1, Freescale Semiconductor document order number HCS08RMV1/D.The HCS08 CPU is fully source- and object-code-compatible with the M68HC08 CPU. Several instructions and enhanced addressing modes were added to improve C compiler efficiency and to support a new BACKGROUND DEBUG system which replaces the monitor mode of earlier M68HC08 microcontrollers (MCU).8.2 FeaturesFeatures of the HCS08 CPU include:• Object code fully upward-compatible with M68HC05 and M68HC08 Families• All registers and memory are mapped to a single 64-Kbyte address space• 16-bit stack pointer (any size stack anywhere in 64-Kbyte address space)• 16-bit index register (H:X) with powerful indexed addressing modes• 8-bit accumulator (A)• Many instructions treat X as a second general-purpose 8-bit register• Seven addressing modes:— Inherent — Operands in internal registers— Relative — 8-bit signed offset to branch destination— Immediate — Operand in next object code byte(s)— Direct — Operand in memory at 0x0000–0x00FF— Extended — Operand anywhere in 64-Kbyte address space— Indexed relative to H:X — Five submodes including auto-increment— Indexed relative to SP — Improves C efficiency dramatically• Memory-to-memory data move instructions with four address mode combinations• Overflow, half-carry, negative, zero, and carry condition codes support conditional branching on the results of signed, unsigned, and binary-coded decimal (BCD) operations• Efficient bit manipulation instructions• Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions• STOP and WAIT instructions to invoke low-power operating modes
FXTH870x6SensorsFreescale Semiconductor, Inc. 558.3 Programmer’s Model and CPU RegistersFigure 40 shows the five CPU registers. CPU registers are not part of the memory map.Figure 40. CPU Registers8.3.1 Accumulator (A)The A accumulator is a general-purpose 8-bit register. One operand input to the arithmetic logic unit (ALU) is connected to the accumulator and the ALU results are often stored into the A accumulator after arithmetic and logical operations. The accumulator can be loaded from memory using various addressing modes to specify the address where the loaded data comes from, or the contents of A can be stored to memory using various addressing modes to specify the address where data from A will be stored.Reset has no effect on the contents of the A accumulator.8.3.2 Index Register (H:X)This 16-bit register is actually two separate 8-bit registers (H and X), which often work together as a 16-bit address pointer where H holds the upper byte of an address and X holds the lower byte of the address. All indexed addressing mode instructions use the full 16-bit value in H:X as an index reference pointer; however, for compatibility with the earlier M68HC05 Family, some instructions operate only on the low-order 8-bit half (X). Many instructions treat X as a second general-purpose 8-bit register that can be used to hold 8-bit data values. X can be cleared, incremented, decremented, complemented, negated, shifted, or rotated. Transfer instructions allow data to be transferred from A or transferred to A where arithmetic and logical operations can then be performed. For compatibility with the earlier M68HC05 Family, H is forced to 0x00 during reset. Reset has no effect on the contents of X.8.3.3 Stack Pointer (SP)This 16-bit address pointer register points at the next available location on the automatic last-in-first-out (LIFO) stack. The stack may be located anywhere in the 64-Kbyte address space that has RAM and can be any size up to the amount of available RAM. The stack is used to automatically save the return address for subroutine calls, the return address and CPU registers during interrupts, and for local variables. The AIS (add immediate to stack pointer) instruction adds an 8-bit signed immediate value to SP. This is most often used to allocate or deallocate space for local variables on the stack. SP is forced to 0x00FF at reset for compatibility with the earlier M68HC05 Family. HCS08 programs normally change the value in SP to the address of the last location (highest address) in on-chip RAM during reset initialization to free up direct page RAM (from the end of the on-chip registers to 0x00FF).The RSP (reset stack pointer) instruction was included for compatibility with the M68HC05 Family and is seldom used in new HCS08 programs because it only affects the low-order half of the stack pointer.SPPCCONDITION CODE REGISTERCARRYZERO NEGATIVE INTERRUPT MASKHALF-CARRY (FROM BIT 3)TWO’S COMPLEMENT OVERFLOWH X0007151570ACCUMULATOR  AINDEX REGISTER (LOW)INDEX REGISTER (HIGH)STACK POINTER87PROGRAM COUNTER16-BIT INDEX REGISTER H:XCCRCV11HINZ
FXTH870x6Sensors56 Freescale Semiconductor, Inc.8.3.4 Program Counter (PC)The program counter is a 16-bit register that contains the address of the next instruction or operand to be fetched.During normal program execution, the program counter automatically increments to the next sequential memory location every time an instruction or operand is fetched. Jump, branch, interrupt, and return operations load the program counter with an address other than that of the next sequential location. This is called a change-of-flow.During reset, the program counter is loaded with the reset vector that is located at 0xFFFE and 0xFFFF. The vector stored there is the address of the first instruction that will be executed after exiting the reset state. 8.3.5 Condition Code Register (CCR)The 8-bit condition code register contains the interrupt mask (I) and five flags that indicate the results of the instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the functions of the condition code bits in general terms. For a more detailed explanation of how each instruction sets the CCR bits, refer to the HCS08 Family Reference Manual, volume 1, Freescale Semiconductor document order number HCS08RMv1.Figure 41. Condition Code RegisterTable 43. CCR Register Field DescriptionsField Description7VTwo’s Complement Overflow Flag — The CPU sets the overflow flag when a two’s complement overflow occurs. The signed branch instructions BGT, BGE, BLE, and BLT use the overflow flag.0 No overflow1Overflow4HHalf-Carry Flag — The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during an add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for binary-coded decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and C condition code bits to automatically add a correction value to the result from a previous ADD or ADC on BCD operands to correct the result to a valid BCD value.0 No carry between bits 3 and 41 Carry between bits 3 and 43IInterrupt Mask Bit — When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts are enabled when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set automatically after the CPU registers are saved on the stack, but before the first instruction of the interrupt service routine is executed.Interrupts are not recognized at the instruction boundary after any instruction that clears I (CLI or TAP). This ensures that the next instruction after a CLI or TAP will always be executed without the possibility of an intervening interrupt, provided I was set. 0 Interrupts enabled1 Interrupts disabled2NNegative Flag — The CPU sets the negative flag when an arithmetic operation, logic operation, or data manipulation produces a negative result, setting bit 7 of the result. Simply loading or storing an 8-bit or 16-bit value causes N to be set if the most significant bit of the loaded or stored value was 1.0 Non-negative result1 Negative result1ZZero Flag — The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation produces a result of 0x00 or 0x0000. Simply loading or storing an 8-bit or 16-bit value causes Z to be set if the loaded or stored value was all 0s.0 Non-zero result1 Zero resultCONDITION CODE REGISTERCARRYZERO NEGATIVE INTERRUPT MASKHALF-CARRY (FROM BIT 3)TWO’S COMPLEMENT OVERFLOW70CCRCV11HINZ
FXTH870x6SensorsFreescale Semiconductor, Inc. 578.4 Addressing ModesAddressing modes define the way the CPU accesses operands and data. In the HCS08, all memory, status and control registers, and input/output (I/O) ports share a single 64-Kbyte linear address space so a 16-bit binary address can uniquely identify any memory location. This arrangement means that the same instructions that access variables in RAM can also be used to access I/O and control registers or nonvolatile program space.Some instructions use more than one addressing mode. For instance, move instructions use one addressing mode to specify the source operand and a second addressing mode to specify the destination address. Instructions such as BRCLR, BRSET, CBEQ, and DBNZ use one addressing mode to specify the location of an operand for a test and then use relative addressing mode to specify the branch destination address when the tested condition is true. For BRCLR, BRSET, CBEQ, and DBNZ, the addressing mode listed in the instruction set tables is the addressing mode needed to access the operand to be tested, and relative addressing mode is implied for the branch destination.8.4.1 Inherent Addressing Mode (INH)In this addressing mode, operands needed to complete the instruction (if any) are located within CPU registers so the CPU does not need to access memory to get any operands.8.4.2 Relative Addressing Mode (REL)Relative addressing mode is used to specify the destination location for branch instructions. A signed 8-bit offset value is located in the memory location immediately following the opcode. During execution, if the branch condition is true, the signed offset is sign-extended to a 16-bit value and is added to the current contents of the program counter, which causes program execution to continue at the branch destination address.8.4.3 Immediate Addressing Mode (IMM)In immediate addressing mode, the operand needed to complete the instruction is included in the object code immediately following the instruction opcode in memory. In the case of a 16-bit immediate operand, the high-order byte is located in the next memory location after the opcode, and the low-order byte is located in the next memory location after that.8.4.4 Direct Addressing Mode (DIR)In direct addressing mode, the instruction includes the low-order eight bits of an address in the direct page (0x0000–0x00FF). During execution a 16-bit address is formed by concatenating an implied 0x00 for the high-order half of the address and the direct address from the instruction to get the 16-bit address where the desired operand is located. This is faster and more memory efficient than specifying a complete 16-bit address for the operand.8.4.5 Extended Addressing Mode (EXT)In extended addressing mode, the full 16-bit address of the operand is located in the next two bytes of program memory after the opcode (high byte first).8.4.6 Indexed Addressing ModeIndexed addressing mode has seven variations including five that use the 16-bit H:X index register pair and two that use the stack pointer as the base reference.8.4.6.1 Indexed, No Offset (IX)This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of the operand needed to complete the instruction.8.4.6.2 Indexed, No Offset with Post Increment (IX+)This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of the operand needed to complete the instruction. The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is only used for MOV and CBEQ instructions.0CCarry/Borrow Flag — The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit 7 of the accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test and branch, shift, and rotate — also clear or set the carry/borrow flag.0 No carry out of bit 71 Carry out of bit 7Table 43. CCR Register Field Descriptions (continued)Field Description
FXTH870x6Sensors58 Freescale Semiconductor, Inc.8.4.6.3 Indexed, 8-Bit Offset (IX1)This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned 8-bit offset included in the instruction as the address of the operand needed to complete the instruction.8.4.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+)This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned 8-bit offset included in the instruction as the address of the operand needed to complete the instruction. The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is used only for the CBEQ instruction.8.4.6.5 Indexed, 16-Bit Offset (IX2)This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus a 16-bit offset included in the instruction as the address of the operand needed to complete the instruction.8.4.6.6 SP-Relative, 8-Bit Offset (SP1)This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus an unsigned 8-bit offset included in the instruction as the address of the operand needed to complete the instruction.8.4.6.7 SP-Relative, 16-Bit Offset (SP2)This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus a 16-bit offset included in the instruction as the address of the operand needed to complete the instruction.8.5 Special OperationsThe CPU performs a few special operations that are similar to instructions but do not have opcodes like other CPU instructions. In addition, a few instructions such as STOP and WAIT directly affect other MCU circuitry. This section provides additional information about these operations.8.5.1 Reset SequenceReset can be caused by a power-on-reset (POR) event, internal conditions such as the COP (computer operating properly) watchdog, or by assertion of an external active-low reset pin. When a reset event occurs, the CPU immediately stops whatever it is doing (the MCU does not wait for an instruction boundary before responding to a reset event). For a more detailed discussion about how the MCU recognizes resets and determines the source, refer to Section 5, “Reset, Interrupts and System Configuration”.The reset event is considered concluded when the sequence to determine whether the reset came from an internal source is done and when the reset pin is no longer asserted. At the conclusion of a reset event, the CPU performs a 6-cycle sequence to fetch the reset vector from 0xFFFE and 0xFFFF and to fill the instruction queue in preparation for execution of the first program instruction.8.5.2 Interrupt SequenceWhen an interrupt is requested, the CPU completes the current instruction before responding to the interrupt. At this point, the program counter is pointing at the start of the next instruction, which is where the CPU should return after servicing the interrupt. The CPU responds to an interrupt by performing the same sequence of operations as for a software interrupt (SWI) instruction, except the address used for the vector fetch is determined by the highest priority interrupt that is pending when the interrupt sequence started.The CPU sequence for an interrupt is: 1. Store the contents of PCL, PCH, X, A, and CCR on the stack, in that order.2. Set the I bit in the CCR.3. Fetch the high-order half of the interrupt vector.4. Fetch the low-order half of the interrupt vector.5. Delay for one free bus cycle.6. Fetch three bytes of program information starting at the address indicated by the interrupt vector to fill the instruction queue in preparation for execution of the first instruction in the interrupt service routine. After the CCR contents are pushed onto the stack, the I bit in the CCR is set to prevent other interrupts while in the interrupt service routine. Although it is possible to clear the I bit with an instruction in the interrupt service routine, this would allow nesting of interrupts (which is not recommended because it leads to programs that are difficult to debug and maintain).For compatibility with the earlier M68HC05 MCUs, the high-order half of the H:X index register pair (H) is not saved on the stack as part of the interrupt sequence. The user must use a PSHH instruction at the beginning of the service routine to save H and then use a PULH instruction just before the RTI that ends the interrupt service routine. It is not necessary to save H if you are
FXTH870x6SensorsFreescale Semiconductor, Inc. 59certain that the interrupt service routine does not use any instructions or auto-increment addressing modes that might change the value of H.The software interrupt (SWI) instruction is like a hardware interrupt except that it is not masked by the global I bit in the CCR and it is associated with an instruction opcode within the program so it is not asynchronous to program execution.8.5.3 WAIT Mode OperationThe WAIT instruction enables interrupts by clearing the I bit in the CCR. It then halts the clocks to the CPU to reduce overall power consumption while the CPU is waiting for the interrupt or reset event that will wake the CPU from WAIT mode. When an interrupt or reset event occurs, the CPU clocks will resume and the interrupt or reset event will be processed normally.If a serial BACKGROUND command is issued to the MCU through the BACKGROUND DEBUG interface while the CPU is in WAIT mode, CPU clocks will resume and the CPU will enter ACTIVE BACKGROUND mode where other serial BACKGROUND commands can be processed. This ensures that a host development system can still gain access to a target MCU even if it is in WAIT mode.8.5.4 STOP Mode OperationUsually, all system clocks, including the crystal oscillator (when used), are halted during STOP mode to minimize power consumption. In such systems, external circuitry is needed to control the time spent in STOP mode and to issue a signal to wakeup the target MCU when it is time to resume processing. Unlike the earlier M68HC05 and M68HC08 MCUs, the HCS08 can be configured to keep a minimum set of clocks running in STOP mode. This optionally allows an internal periodic signal to wake the target MCU from STOP mode.When a host debug system is connected to the BACKGROUND DEBUG pin (BKGD) and the ENBDM control bit has been set by a serial command through the BACKGROUND interface (or because the MCU was reset into ACTIVE BACKGROUND mode), the oscillator is forced to remain active when the MCU enters STOP mode. In this case, if a serial BACKGROUND command is issued to the MCU through the BACKGROUND DEBUG interface while the CPU is in STOP mode, CPU clocks will resume and the CPU will enter ACTIVE BACKGROUND mode where other serial BACKGROUND commands can be processed. This ensures that a host development system can still gain access to a target MCU even if it is in STOP mode.Recovery from STOP mode depends on the particular HCS08 and whether the oscillator was stopped in STOP mode. Refer to the Section 3 for more details.8.5.5 BGND InstructionThe BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in normal user programs because it forces the CPU to stop processing user instructions and enter the ACTIVE BACKGROUND mode. The only way to resume execution of the user program is through reset or by a host debug system issuing a GO, TRACE1, or TAGGO serial command through the BACKGROUND DEBUG interface. Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the BGND opcode. When the program reaches this breakpoint address, the CPU is forced to ACTIVE BACKGROUND mode rather than continuing the user program. 8.6 HCS08 Instruction Set SummaryInstruction Set Summary NomenclatureThe nomenclature listed here is used in the instruction descriptions in Table 44.Operators( ) = Contents of register or memory location shown inside parentheses= Is loaded with (read: “gets”)& = Boolean AND| = Boolean OR= Boolean exclusive-OR= Multiply= Divide: = Concatenate+=Add– = Negate (two’s complement)CPU registersA = AccumulatorCCR = Condition code registerH = Index register, higher order (most significant) 8 bits
FXTH870x6Sensors60 Freescale Semiconductor, Inc.X = Index register, lower order (least significant) 8 bitsPC = Program counterPCH = Program counter, higher order (most significant) 8 bitsPCL = Program counter, lower order (least significant) 8 bitsSP = Stack pointerMemory and addressingM = A memory location or absolute data, depending on addressing modeM:M + 0x0001 = A 16-bit value in two consecutive memory locations. The higher-order (most significant) 8 bits are located at the address of M, and the lower-order (least significant) 8 bits are located at the next higher sequential address.Condition code register (CCR) bitsV = Two’s complement overflow indicator, bit 7H = Half carry, bit 4 I = Interrupt mask, bit 3N = Negative indicator, bit 2Z = Zero indicator, bit 1C = Carry/borrow, bit 0 (carry out of bit 7)CCR activity notation– = Bit not affected0 = Bit forced to 01 = Bit forced to 1Þ= Bit set or cleared according to results of operationU = Undefined after the operationMachine coding notationdd = Low-order 8 bits of a direct address 0x0000–0x00FF (high byte assumed to be 0x00)ee = Upper 8 bits of 16-bit offsetff = Lower 8 bits of 16-bit offset or 8-bit offsetii = One byte of immediate datajj = High-order byte of a 16-bit immediate data valuekk = Low-order byte of a 16-bit immediate data valuehh = High-order byte of 16-bit extended addressll = Low-order byte of 16-bit extended addressrr = Relative offsetSource formEverything in the source forms columns, except expressions in italic characters, is literal information that must appear in the assembly source file exactly as shown. The initial 3- to 5-letter mnemonic is always a literal expression. All commas, pound signs (#), parentheses, and plus signs (+) are literal characters.n— Any label or expression that evaluates to a single integer in the range 0–7opr8i — Any label or expression that evaluates to an 8-bit immediate valueopr16i — Any label or expression that evaluates to a 16-bit immediate valueopr8a — Any label or expression that evaluates to an 8-bit value. The instruction treats this 8-bit value as the low order 8 bits of an address in the direct page of the 64-Kbyte address space (0x00xx).opr16a — Any label or expression that evaluates to a 16-bit value. The instruction treats this value as an address in the 64-Kbyte address space.oprx8 — Any label or expression that evaluates to an unsigned 8-bit value, used for indexed addressingoprx16 — Any label or expression that evaluates to a 16-bit value. Because the HCS08 has a 16-bit address bus, this can be either a signed or an unsigned value.rel — Any label or expression that refers to an address that is within –128 to +127 locations from the next address after the last byte of object code for the current instruction. The assembler will calculate the 8-bit signed offset and include it in the object code for this instruction.
FXTH870x6SensorsFreescale Semiconductor, Inc. 61Address modesINH = Inherent (no operands)IMM = 8-bit or 16-bit immediateDIR = 8-bit directEXT = 16-bit extendedIX = 16-bit indexed no offsetIX+ = 16-bit indexed no offset, post increment (CBEQ and MOV only)IX1 = 16-bit indexed with 8-bit offset from H:XIX1+ = 16-bit indexed with 8-bit offset, post increment (CBEQ only)IX2 = 16-bit indexed with 16-bit offset from H:XREL = 8-bit relative offsetSP1 = Stack pointer with 8-bit offsetSP2 = Stack pointer with 16-bit offsetTable 44. HCS08 Instruction Set Summary (Sheet 1 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZCADC  #opr8iADC  opr8aADC  opr16aADC  oprx16,XADC  oprx8,XADC   ,XADC  oprx16,SPADC  oprx8,SPAdd with Carry  A  (A) + (M) + (C) ÞÞ–ÞÞÞIMMDIREXTIX2IX1IXSP2SP1A9B9C9D9E9F99ED99EE9iiddhh llee ffffee ffff23443354ADD  #opr8iADD  opr8aADD  opr16aADD  oprx16,XADD  oprx8,XADD   ,XADD  oprx16,SPADD  oprx8,SPAdd without Carry A  (A) + (M) ÞÞ–ÞÞÞIMMDIREXTIX2IX1IXSP2SP1ABBBCBDBEBFB9EDB9EEBiiddhh llee ffffee ffff23443354AIS  #opr8i Add Immediate Value (Signed) to Stack PointerSP  (SP) + (M)M is sign extended to a 16-bit value ––––––IMM A7ii 2AIX  #opr8i Add Immediate Value (Signed) to Index Register (H:X)H:X  (H:X) + (M)M is sign extended to a 16-bit value ––––––IMM AFii 2AND  #opr8iAND  opr8aAND  opr16aAND  oprx16,XAND  oprx8,XAND   ,XAND  oprx16,SPAND  oprx8,SPLogical AND  A  (A) & (M) 0 – – ÞÞ–IMMDIREXTIX2IX1IXSP2SP1A4B4C4D4E4F49ED49EE4iiddhh llee ffffee ffff23443354ASL  opr8aASLAASLXASL  oprx8,XASL  ,XASL  oprx8,SPArithmetic Shift Left(Same as LSL) Þ––ÞÞÞDIRINHINHIX1IXSP138485868789E68ddffff511546Cb0b70
FXTH870x6Sensors62 Freescale Semiconductor, Inc.ASR  opr8aASRAASRXASR  oprx8,XASR  ,XASR  oprx8,SPArithmetic Shift Right Þ––ÞÞÞDIRINHINHIX1IXSP137475767779E67ddffff511546BCC  rel Branch if Carry Bit Clear Branch if (C) = 0 – – – – – – REL 24 rr 3BCLR  n,opr8a Clear Bit n in Memory Mn  0 ––––––DIR (b0)DIR (b1)DIR (b2)DIR (b3)DIR (b4)DIR (b5)DIR (b6)DIR (b7)11131517191B1D1Fdd dd dd dd dd dd dd dd 55555555BCS  rel Branch if Carry Bit Set (Same as BLO) Branch if (C) = 1 – – – – – – REL 25 rr 3BEQ  rel Branch if Equal Branch if (Z) = 1 – – – – – – REL 27 rr 3BGE  rel Branch if Greater Than or Equal To (Signed Operands)Branch if (N V ––––––REL 90rr 3BGND Enter ACTIVE BACK-GROUND if ENBDM = 1Waits For and Processes BDM Commands Until GO, TRACE1, or TAGGO––––––INH 82 5+BGT  rel Branch if Greater Than (Signed Operands) Branch if (Z)| (N V ––––––REL 92rr 3BHCC  rel Branch if Half Carry Bit Clear Branch if (H) = 0 – – – – – – REL 28 rr 3BHCS  rel Branch if Half Carry Bit Set Branch if (H) = 1 – – – – – – REL 29 rr 3BHI  rel Branch if Higher Branch if (C) | (Z) = 0 – – – – – – REL 22 rr 3BHS  rel Branch if Higher or Same (Same as BCC) Branch if (C) = 0 – – – – – – REL 24 rr 3BIH rel Branch if IRQ Pin High Branch if IRQ pin = 1 – – – – – – REL 2F rr 3BIL  rel Branch if IRQ Pin Low Branch if IRQ pin = 0 – – – – – – REL 2E rr 3BIT  #opr8iBIT  opr8aBIT  opr16aBIT  oprx16,XBIT  oprx8,XBIT   ,XBIT  oprx16,SPBIT  oprx8,SPBit Test (A) & (M)(CCR Updated but OperandsNot Changed)0––ÞÞ–IMMDIREXTIX2IX1IXSP2SP1A5B5C5D5E5F59ED59EE5iiddhh llee ffffee ffff23443354BLE  rel Branch if Less Than or Equal To (Signed Operands) Branch if (Z)| (N V 1 ––––––REL 93 rr 3BLO  rel Branch if Lower(Same as BCS) Branch if (C) = 1 ––––––REL 25 rr 3BLS  rel Branch if Lower or Same Branch if (C) | (Z) = 1 ––––––REL 23 rr 3BLT rel Branch if Less Than (Signed Operands) Branch if (N V 1––––––REL 91 rr 3BMC  rel Branch if Interrupt Mask Clear Branch if (I) = 0 ––––––REL 2C rr 3Table 44. HCS08 Instruction Set Summary (Sheet 2 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZCb0b7C
FXTH870x6SensorsFreescale Semiconductor, Inc. 63BMI  rel Branch if Minus Branch if (N) = 1 ––––––REL 2B rr 3BMS  rel Branch if Interrupt Mask Set Branch if (I) = 1 ––––––REL 2D rr 3BNE  rel Branch if Not Equal Branch if (Z) = 0 ––––––REL 26 rr 3BPL  rel Branch if Plus Branch if (N) = 0 ––––––REL 2A rr 3BRA  rel Branch Always No Test ––––––REL 20 rr 3BRCLR  n,opr8a,rel Branch if Bit n in Memory Clear Branch if (Mn) = 0 – – – – – ÞDIR (b0)DIR (b1)DIR (b2)DIR (b3)DIR (b4)DIR (b5)DIR (b6)DIR (b7)01030507090B0D0Fdd rrdd rrdd rrdd rrdd rrdd rrdd rrdd rr55555555BRN  rel Branch Never Uses 3 Bus Cycles – – – – – – REL 21 rr 3BRSET  n,opr8a,rel Branch if Bit n in Memory Set Branch if (Mn) = 1 – – – – – ÞDIR (b0)DIR (b1)DIR (b2)DIR (b3)DIR (b4)DIR (b5)DIR (b6)DIR (b7)00020406080A0C0Edd rrdd rrdd rrdd rrdd rrdd rrdd rrdd rr55555555BSET  n,opr8a Set Bit n in Memory Mn  1 ––––––DIR (b0)DIR (b1)DIR (b2)DIR (b3)DIR (b4)DIR (b5)DIR (b6)DIR (b7)10121416181A1C1Edddddddddddddddd55555555BSR  relBranch to SubroutinePC (PC) + 0x0002push (PCL); SP  (SP) – 0x0001push (PCH); SP  (SP) – 0x0001PC  (PC) + rel––––––REL ADrr 5CBEQ  opr8a,relCBEQA  #opr8i,relCBEQX  #opr8i,relCBEQ  oprx8,X+,relCBEQ  ,X+,relCBEQ oprx8,SP,relCompare and Branch if EqualBranch if (A) = (M)Branch if (A) = (M)Branch if (X) = (M)Branch if (A) = (M)Branch if (A) = (M)Branch if (A) = (M)––––––DIRIMMIMMIX1+IX+SP131415161719E61dd rrii rrii rrff rrrr ffrr544556CLC Clear Carry Bit C  0 –––––0INH 98 1CLI Clear Interrupt Mask Bit I  0 ––0–––INH 9A 1CLR  opr8aCLRACLRXCLRHCLR  oprx8,XCLR  ,XCLR  oprx8,SPClear M  0x00A  0x00X  0x00H  0x00M  0x00M  0x00M  0x000––01–DIRINHINHINHIX1IXSP13F4F5F8C6F7F9E6Fddff ff5111546Table 44. HCS08 Instruction Set Summary (Sheet 3 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZC
FXTH870x6Sensors64 Freescale Semiconductor, Inc.CMP  #opr8iCMP  opr8aCMP  opr16aCMP  oprx16,XCMP  oprx8,XCMP   ,XCMP  oprx16,SPCMP  oprx8,SPCompare Accumulator with Memory(A) – (M)(CCR Updated But Operands Not Changed)Þ––ÞÞÞIMMDIREXTIX2IX1IXSP2SP1A1B1C1D1E1F19ED19EE1iiddhh llee ffffee ffff23443354COM  opr8aCOMACOMXCOM  oprx8,XCOM  ,XCOM  oprx8,SPComplement(One’s Complement)M  (M)= 0xFF – (M)A  (A) = 0xFF – (A)X  (X) = 0xFF – (X)M  (M) = 0xFF – (M)M  (M) = 0xFF – (M)M  (M) = 0xFF – (M)0––ÞÞ1DIRINHINHIX1IXSP133435363739E63ddffff511546CPHX opr16aCPHX #opr16iCPHX opr8aCPHX oprx8,SPCompare Index Register (H:X) with Memory(H:X) – (M:M + 0x0001)(CCR Updated But Operands Not Changed)Þ––ÞÞÞEXTIMMDIRSP13E65759EF3hh lljj kkddff6356CPX  #opr8iCPX  opr8aCPX  opr16aCPX  oprx16,XCPX  oprx8,XCPX   ,XCPX  oprx16,SPCPX  oprx8,SPCompare X (Index Register Low) with Memory (X) – (M)(CCR Updated But Operands Not Changed)Þ––ÞÞÞIMMDIREXTIX2IX1IXSP2SP1A3B3C3D3E3F39ED39EE3iiddhh llee ffffee ffff23443354DAADecimal Adjust Accumulator After ADD or ADC of BCD Values(A)10 U––ÞÞÞINH 72 1DBNZ  opr8a,relDBNZA  relDBNZX  relDBNZ  oprx8,X,relDBNZ  ,X,relDBNZ  oprx8,SP,relDecrement and Branch if Not ZeroDecrement A, X, or MBranch if (result) 0DBNZX Affects X Not H––––––DIRINHINHIX1IXSP13B4B5B6B7B9E6Bdd rrrrrrff rrrrff rr744768DEC  opr8aDECADECXDEC  oprx8,XDEC  ,XDEC  oprx8,SPDecrementM  (M) – 0x01A  (A) – 0x01X  (X) – 0x01M  (M) – 0x01M  (M) – 0x01M  (M) – 0x01Þ––ÞÞ–DIRINHINHIX1IXSP13A4A5A6A7A9E6Addffff511546DIV  Divide A  (H:A)(X)H  Remainder ––––ÞÞINH 52 6EOR  #opr8iEOR  opr8aEOR  opr16aEOR  oprx16,XEOR  oprx8,XEOR   ,XEOR  oprx16,SPEOR  oprx8,SPExclusive OR Memory with AccumulatorA  (A  M) 0––ÞÞ–IMMDIREXTIX2IX1IXSP2SP1A8B8C8D8E8F89ED89EE8iiddhh llee ffffee ffff23443354INC  opr8aINCAINCXINC  oprx8,XINC  ,XINC  oprx8,SPIncrementM  (M) + 0x01A  (A) + 0x01X  (X) + 0x01M  (M) + 0x01M  (M) + 0x01M  (M) + 0x01Þ––ÞÞ–DIRINHINHIX1IXSP13C4C5C6C7C9E6Cddffff511546Table 44. HCS08 Instruction Set Summary (Sheet 4 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZC
FXTH870x6SensorsFreescale Semiconductor, Inc. 65JMP  opr8aJMP  opr16aJMP  oprx16,XJMP  oprx8,XJMP  ,X Jump PC  Jump Address – – – – – –DIREXTIX2IX1IXBCCCDCECFCddhh llee ffff34433JSR  opr8aJSR  opr16aJSR  oprx16,XJSR  oprx8,XJSR  ,XJump to SubroutinePC  (PC) + n  (n = 1, 2, or 3)Push (PCL); SP  (SP) – 0x0001Push (PCH); SP  (SP) – 0x0001PC  Unconditional Address––––––DIREXTIX2IX1IXBDCDDDEDFDddhh llee ffff56655LDA  #opr8iLDA  opr8aLDA  opr16aLDA  oprx16,XLDA  oprx8,XLDA   ,XLDA  oprx16,SPLDA  oprx8,SPLoad Accumulator from Memory A  (M) 0––ÞÞ–IMMDIREXTIX2IX1IXSP2SP1A6B6C6D6E6F69ED69EE6iiddhh llee ffffee ffff23443354LDHX  #opr16iLDHX  opr8aLDHX  opr16aLDHX  ,X LDHX  oprx16,XLDHX  oprx8,XLDHX  oprx8,SPLoad Index Register (H:X) from Memory  H:X M:M+ 0x00010––ÞÞ–IMMDIREXTIXIX2IX1SP14555329EAE9EBE9ECE9EFEjj kkddhh llee ffffff3455655LDX  #opr8iLDX  opr8aLDX  opr16aLDX  oprx16,XLDX  oprx8,XLDX   ,XLDX  oprx16,SPLDX  oprx8,SPLoad X (Index Register Low) from Memory X  (M) 0––ÞÞ–IMMDIREXTIX2IX1IXSP2SP1AEBECEDEEEFE9EDE9EEEiiddhh llee ffffee ffff23443354LSL  opr8aLSLALSLXLSL  oprx8,XLSL  ,XLSL  oprx8,SPLogical Shift Left(Same as ASL) Þ––ÞÞÞDIRINHINHIX1IXSP138485868789E68ddffff511546LSR  opr8aLSRALSRXLSR  oprx8,XLSR  ,XLSR  oprx8,SPLogical Shift Right Þ––0ÞÞDIRINHINHIX1IXSP134445464749E64ddffff511546MOV opr8a,opr8aMOV  opr8a,X+MOV  #opr8i,opr8aMOV  ,X+,opr8aMove (M)destination (M)sourceH:X  (H:X) + 0x0001 in IX+/DIR and DIR/IX+ Modes0––ÞÞ–DIR/DIRDIR/IX+IMM/DIRIX+/DIR4E5E6E7Edd ddddii dddd5545MUL Unsigned multiply X:A  (X)  (A) –0–––0INH 42 5NEG  opr8aNEGANEGXNEG  oprx8,XNEG  ,XNEG  oprx8,SPNegate(Two’s Complement)M  – (M) = 0x00 – (M)A  – (A) = 0x00 – (A)X  – (X) = 0x00 – (X)M  – (M) = 0x00 – (M)M  – (M) = 0x00 – (M)M  – (M) = 0x00 – (M)Þ––ÞÞÞDIRINHINHIX1IXSP130405060709E60ddffff511546NOP No Operation Uses 1 Bus Cycle – – – – – – INH 9D 1Table 44. HCS08 Instruction Set Summary (Sheet 5 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZCCb0b70b0b7C0
FXTH870x6Sensors66 Freescale Semiconductor, Inc.NSA Nibble Swap Accumulator A  (A[3:0]:A[7:4]) – – – – – – INH 62 1ORA  #opr8iORA  opr8aORA  opr16aORA  oprx16,XORA  oprx8,XORA   ,XORA  oprx16,SPORA  oprx8,SPInclusive OR Accumulator and Memory A  (A) | (M) 0 – – ÞÞ–IMMDIREXTIX2IX1IXSP2SP1AABACADAEAFA9EDA9EEAiiddhh llee ffffee ffff23443354PSHA  Push Accumulator onto Stack Push (A); SP (SP) – 0x0001  – – – – – – INH 87 2PSHH Push H (Index Register High) onto Stack Push (H); SP (SP) – 0x0001 – – – – – – INH 8B 2PSHX Push X (Index Register Low) onto Stack Push (X); SP (SP) – 0x0001 – – – – – – INH 89 2PULA Pull Accumulator from Stack SP (SP + 0x0001); PullA––––––INH 86 3PULH Pull H (Index Register High) from Stack SP (SP + 0x0001); PullH––––––INH 8A 3PULX Pull X (Index Register Low) from Stack SP (SP + 0x0001); PullX––––––INH 88 3ROL  opr8aROLAROLXROL  oprx8,XROL  ,XROL  oprx8,SPRotate Left through Carry  Þ––ÞÞÞDIRINHINHIX1IXSP139495969799E69ddffff511546ROR  opr8aRORARORXROR  oprx8,XROR  ,XROR  oprx8,SPRotate Right through Carry  Þ––ÞÞÞDIRINHINHIX1IXSP136465666769E66ddffff511546RSP Reset Stack Pointer SP  0xFF(High Byte Not Affected) ––––––INH 9C 1RTI Return from InterruptSP  (SP) + 0x0001; Pull (CCR)SP  (SP) + 0x0001; Pull (A)SP  (SP) + 0x0001; Pull (X)SP  (SP) + 0x0001; Pull (PCH)SP  (SP) + 0x0001; Pull (PCL)ÞÞÞÞÞÞINH 80 9RTS Return from Subroutine SP  SP + 0x0001PullPCH)SP  SP + 0x0001; Pull (PCL) ––––––INH 81 6SBC  #opr8iSBC  opr8aSBC  opr16aSBC  oprx16,XSBC  oprx8,XSBC   ,XSBC  oprx16,SPSBC  oprx8,SPSubtract with Carry  A  (A) – (M) – (C) Þ––ÞÞÞIMMDIREXTIX2IX1IXSP2SP1A2B2C2D2E2F29ED29EE2iiddhh llee ffffee ffff23443354SEC Set Carry Bit C  1 –––––1INH 99 1SEI Set Interrupt Mask Bit I  1 ––1–––INH 9B 1Table 44. HCS08 Instruction Set Summary (Sheet 6 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZCCb0b7b0b7C
FXTH870x6SensorsFreescale Semiconductor, Inc. 67STA  opr8aSTA  opr16aSTA  oprx16,XSTA  oprx8,XSTA   ,XSTA  oprx16,SPSTA  oprx8,SPStore Accumulator in Memory M (A) 0––ÞÞ–DIREXTIX2IX1IXSP2SP1B7C7D7E7F79ED79EE7ddhh llee ffffee ffff3443254STHX opr8aSTHX opr16aSTHX oprx8,SPStore H:X (Index Reg.) (M:M + 0x0001)  (H:X) 0 – – ÞÞ–DIREXTSP135969EFFddhh llff455STOPEnable Interrupts: Stop Processing Refer to MCU Documen-tationI bit  0; Stop Processing – – 0 – – – INH 8E 2+STX  opr8aSTX  opr16aSTX  oprx16,XSTX  oprx8,XSTX   ,XSTX  oprx16,SPSTX  oprx8,SPStore X (Low 8 Bits of Index Register)in MemoryM (X) 0––ÞÞ–DIREXTIX2IX1IXSP2SP1BFCFDFEFFF9EDF9EEFddhh llee ffffee ffff3443254SUB  #opr8iSUB  opr8aSUB  opr16aSUB  oprx16,XSUB  oprx8,XSUB   ,XSUB  oprx16,SPSUB  oprx8,SPSubtract A  (A) – (M) Þ––ÞÞÞIMMDIREXTIX2IX1IXSP2SP1A0B0C0D0E0F09ED09EE0iiddhh llee ffffee ffff23443354SWI Software InterruptPC  (PC) + 0x0001Push (PCL); SP  (SP) – 0x0001Push (PCH); SP  (SP) – 0x0001Push (X); SP  (SP) – 0x0001Push (A); SP  (SP) – 0x0001Push (CCR); SP  (SP) – 0x0001I  1;PCH  Interrupt Vector High BytePCL  Interrupt Vector Low Byte––1–––INH 83 11TAPTransfer Accumulator to CCR CCR  (A) ÞÞÞÞÞÞINH 84 1TAX Transfer Accumulator to X (Index Register Low) X  (A) ––––––INH 97 1TPA Transfer CCR to Accu-mulator A  (CCR) ––––––INH 85 1TST  opr8aTSTATSTXTST  oprx8,XTST  ,XTST  oprx8,SPTest for Negative or Zero(M) – 0x00(A) – 0x00(X) – 0x00(M) – 0x00(M) – 0x00(M) – 0x000––ÞÞ–DIRINHINHIX1IXSP13D4D5D6D7D9E6Dddffff411435TSX Transfer SP to Index Reg. H:X  (SP) + 0x0001 – – – – – – INH 95 2TXA Transfer X (Index Reg. Low) to Accumulator A  (X) ––––––INH 9F 1TXS Transfer Index Reg. to SP SP  (H:X) – 0x0001 – – – – – – INH 94 2Table 44. HCS08 Instruction Set Summary (Sheet 7 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZC
FXTH870x6Sensors68 Freescale Semiconductor, Inc.WAIT Enable Interrupts; Wait for Interrupt I bit  0; Halt CPU – – 0 – – – INH 8F 2+1. Bus clock frequency is one-half of the CPU clock frequency.Table 45. Opcode Map (Sheet 1 of 2)Bit-Manipulation Branch Read-Modify-Write Control Register/Memory00 5BRSET03DIR10 5BSET02DIR20 3BRA2REL30 5NEG2DIR40 1NEGA1INH50 1NEGX1INH60 5NEG2IX170 4NEG1IX80 9RTI1INH90 3BGE2RELA0 2SUB2IMMB0 3SUB2DIRC0 4SUB3 EXTD0 4SUB3IX2E0 3SUB2IX1F0 3SUB1IX01 5BRCLR03DIR11 5BCLR02DIR21 3BRN2REL31 5CBEQ3DIR41 4CBEQA3IMM51 4CBEQX3IMM61 5CBEQ3IX1+71 5CBEQ2IX+81 6RTS1INH91 3BLT2RELA1 2CMP2IMMB1 3CMP2DIRC1 4CMP3 EXTD1 4CMP3IX2E1 3CMP2IX1F1 3CMP1IX02 5BRSET13DIR12 5BSET12DIR22 3BHI2REL32 5LDHX3EXT42 5MUL1INH52 6DIV1INH62 1NSA1INH72 1DAA1INH82 5+BGND1INH92 3BGT2RELA2 2SBC2IMMB2 3SBC2DIRC2 4SBC3 EXTD2 4SBC3IX2E2 3SBC2IX1F2 3SBC1IX03 5BRCLR13DIR13 5BCLR12DIR23 3BLS2REL33 5COM2DIR43 1COMA1INH53 1COMX1INH63 5COM2IX173 4COM1IX83 11SWI1INH93 3BLE2RELA3 2CPX2IMMB3 3CPX2DIRC3 4CPX3 EXTD3 4CPX3IX2E3 3CPX2IX1F3 3CPX1IX04 5BRSET23DIR14 5BSET22DIR24 3BCC2REL34 5LSR2DIR44 1LSRA1INH54 1LSRX1INH64 5LSR2IX174 4LSR1IX84 1TAP1INH94 2TXS1INHA4 2AND2IMMB4 3AND2DIRC4 4AND3 EXTD4 4AND3IX2E4 3AND2IX1F4 3AND1IX05 5BRCLR23DIR15 5BCLR22DIR25 3BCS2REL35 4STHX2DIR45 3LDHX3IMM55 4LDHX2DIR65 3CPHX3IMM75 5CPHX2DIR85 1TPA1INH95 2TSX1INHA5 2BIT2IMMB5 3BIT2DIRC5 4BIT3 EXTD5 4BIT3IX2E5 3BIT2IX1F5 3BIT1IX06 5BRSET33DIR16 5BSET32DIR26 3BNE2REL36 5ROR2DIR46 1RORA1INH56 1RORX1INH66 5ROR2IX176 4ROR1IX86 3PULA1INH96 5STHX3EXTA6 2LDA2IMMB6 3LDA2DIRC6 4LDA3 EXTD6 4LDA3IX2E6 3LDA2IX1F6 3LDA1IX07 5BRCLR33DIR17 5BCLR32DIR27 3BEQ2REL37 5ASR2DIR47 1ASRA1INH57 1ASRX1INH67 5ASR2IX177 4ASR1IX87 2PSHA1INH97 1TAX1INHA7 2AIS2IMMB7 3STA2DIRC7 4STA3 EXTD7 4STA3IX2E7 3STA2IX1F7 2STA1IX08 5BRSET43DIR18 5BSET42DIR28 3BHCC2REL38 5LSL2DIR48 1LSLA1INH58 1LSLX1INH68 5LSL2IX178 4LSL1IX88 3PULX1INH98 1CLC1INHA8 2EOR2IMMB8 3EOR2DIRC8 4EOR3 EXTD8 4EOR3IX2E8 3EOR2IX1F8 3EOR1IX09 5BRCLR43DIR19 5BCLR42DIR29 3BHCS2REL39 5ROL2DIR49 1ROLA1INH59 1ROLX1INH69 5ROL2IX179 4ROL1IX89 2PSHX1INH99 1SEC1INHA9 2ADC2IMMB9 3ADC2DIRC9 4ADC3 EXTD9 4ADC3IX2E9 3ADC2IX1F9 3ADC1IX0A 5BRSET53DIR1A 5BSET52DIR2A 3BPL2REL3A 5DEC2DIR4A 1DECA1INH5A 1DECX1INH6A 5DEC2IX17A 4DEC1IX8A 3PULH1INH9A 1CLI1INHAA 2ORA2IMMBA 3ORA2DIRCA 4ORA3 EXTDA 4ORA3IX2EA 3ORA2IX1FA 3ORA1IX0B 5BRCLR53DIR1B 5BCLR52DIR2B 3BMI2REL3B 7DBNZ3DIR4B 4DBNZA2INH5B 4DBNZX2INH6B 7DBNZ3IX17B 6DBNZ2IX8B 2PSHH1INH9B 1SEI1INHAB 2ADD2IMMBB 3ADD2DIRCB 4ADD3 EXTDB 4ADD3IX2EB 3ADD2IX1FB 3ADD1IX0C 5BRSET63DIR1C 5BSET62DIR2C 3BMC2REL3C 5INC2DIR4C 1INCA1INH5C 1INCX1INH6C 5INC2IX17C 4INC1IX8C 1CLRH1INH9C 1RSP1INHBC 3JMP2DIRCC 4JMP3 EXTDC 4JMP3IX2EC 3JMP2IX1FC 3JMP1IX0D 5BRCLR63DIR1D 5BCLR62DIR2D 3BMS2REL3D 4TST2DIR4D 1TSTA1INH5D 1TSTX1INH6D 4TST2IX17D 3TST1IX9D 1NOP1INHAD 5BSR2RELBD 5JSR2DIRCD 6JSR3 EXTDD 6JSR3IX2ED 5JSR2IX1FD 5JSR1IX0E 5BRSET73DIR1E 5BSET72DIR2E 3BIL2REL3E 6CPHX3EXT4E 5MOV3DD5E 5MOV2DIX+6E 4MOV3IMD7E 5MOV2IX+D8E 2+STOP1INH9EPage 2 AE 2LDX2IMMBE 3LDX2DIRCE 4LDX3 EXTDE 4LDX3IX2EE 3LDX2IX1FE 3LDX1IX0F 5BRCLR73DIR1F 5BCLR72DIR2F 3BIH2REL3F 5CLR2DIR4F 1CLRA1INH5F 1CLRX1INH6F 5CLR2IX17F 4CLR1IX8F 2+WAIT1INH9F 1TXA1INHAF 2AIX2IMMBF 3STX2DIRCF 4STX3 EXTDF 4STX3IX2EF 3STX2IX1FF 2STX1IXINH Inherent REL Relative SP1 Stack Pointer, 8-Bit OffsetIMM Immediate IX Indexed, No Offset SP2 Stack Pointer, 16-Bit OffsetDIR Direct IX1 Indexed, 8-Bit Offset IX+ Indexed, No Offset with EXT Extended IX2 Indexed, 16-Bit Offset Post IncrementDD DIR to DIR IMD IMM to DIR IX1+ Indexed, 1-Byte Offset with IX+D IX+ to DIR  DIX+ DIR to IX+ Post IncrementOpcode in HexadecimalNumber of BytesF0 3SUB1IXHCS08 CyclesInstruction MnemonicAddressing ModeTable 44. HCS08 Instruction Set Summary (Sheet 8 of 8)SourceForm Operation DescriptionEffecton CCRAddressModeOpcodeOperandBus Cycles(1)VH I NZC
FXTH870x6SensorsFreescale Semiconductor, Inc. 69Bit-Manipulation Branch Read-Modify-Write Control Register/Memory9E60 6NEG3SP19ED0 5SUB4SP29EE0 4SUB3SP19E61 6CBEQ4SP19ED1 5CMP4SP29EE1 4CMP3SP19ED2 5SBC4SP29EE2 4SBC3SP19E63 6COM3SP19ED3 5CPX4SP29EE3 4CPX3SP19EF3 6CPHX3SP19E64 6LSR3SP19ED4 5AND4SP29EE4 4AND3SP19ED5 5BIT4SP29EE5 4BIT3SP19E66 6ROR3SP19ED6 5LDA4SP29EE6 4LDA3SP19E67 6ASR3SP19ED7 5STA4SP29EE7 4STA3SP19E68 6LSL3SP19ED8 5EOR4SP29EE8 4EOR3SP19E69 6ROL3SP19ED9 5ADC4SP29EE9 4ADC3SP19E6A 6DEC3SP19EDA 5ORA4SP29EEA 4ORA3SP19E6B 8DBNZ4SP19EDB 5ADD4SP29EEB 4ADD3SP19E6C 6INC3SP19E6D 5TST3SP19EAE 5LDHX2IX9EBE 6LDHX4IX29ECE 5LDHX3IX19EDE 5LDX4SP29EEE 4LDX3SP19EFE 5LDHX3SP19E6F 6CLR3SP19EDF 5STX4SP29EEF 4STX3SP19EFF 5STHX3SP1INH Inherent REL Relative SP1 Stack Pointer, 8-Bit OffsetIMM Immediate IX Indexed, No Offset SP2 Stack Pointer, 16-Bit OffsetDIR Direct IX1 Indexed, 8-Bit Offset IX+ Indexed, No Offset with EXT Extended IX2 Indexed, 16-Bit Offset Post IncrementDD DIR to DIR IMD IMM to DIR IX1+ Indexed, 1-Byte Offset with IX+D IX+ to DIR DIX+ DIR to IX+ Post IncrementNote: All Sheet 2 Opcodes are Preceded by the Page 2 Prebyte (9E)Prebyte (9E) andOpcode inHexadecimalNumber of Bytes9E60 6NEG3SP1HCS08 CyclesInstruction MnemonicAddressing ModeTable 45. Opcode Map (Sheet 2 of 2)
FXTH870x6Sensors70 Freescale Semiconductor, Inc.9 Timer Pulse-Width ModuleThe timer pulse-width module (TPM1) is a two channel timer system that supports traditional input capture, output compare, or edge-aligned PWM on each channel. All the features and functions of the TPM1 are as described in the MC9S08RC16 product specification. The user has the option to connect the two timer channels to the PTA[3:2] pins, if those pins are not needed for an LFR channel or other general purpose I/O function. The following clock source and frequency selections are available using the system option register 2 as shown in Figure 23 and Table 27.In addition one channel of the TPM1 can be connected to a 500 kHz clock (DX) derived from the crystal oscillator on the RFM. This selection is made by setting the TPM1 to use an external clock. This clock source allows time calibration of the LFO as described in the Section 14.9.1 FeaturesThe TPM1 has the following features:• May be configured for buffered, center-aligned pulse-width modulation (CPWM) on all channels• Clock sources independently selectable• Selectable clock sources (device dependent): bus clock, fixed system clock• Clock prescaler taps for divide by 1, 2, 4, 8, 16, 32, 64, or 128• 16-bit free-running or up/down (CPWM) count operation• 16-bit modulus register to control counter range• Timer system enable• One interrupt per channel plus a terminal count interrupt• Channel features:— Each channel may be input capture, output compare, or buffered edge-aligned PWM— Rising-edge, falling-edge, or any-edge input capture trigger— Set, clear, or toggle output compare action— Selectable polarity on PWM outputs9.2 TPM1 Configuration InformationThe device provides one two-channel timer/pulse-width modulator (TPM1).An easy way to measure the low frequency oscillator (LFO) is to connect the LFO directly to TPM1 channel 0. The LFOSEL bit in the SOPTZ determines whether TPM1CH0 is connected to PTAZ or the LFO.TPM1 clock source selection for the TPM1 is shown in the table below.Table 46. TPM1 Clock Source SelectionCLKSB CLKSA  Clock Source0 0 No source; TPM1 disabled01 BUSCLK1 0 unused1 1 Internal DX pin
FXTH870x6SensorsFreescale Semiconductor, Inc. 719.2.1 Block DiagramFigure 42 shows the structure of a TPM1.Figure 42. TPM1 Block DiagramThe central component of the TPM1 is the 16-bit counter that can operate as a free-running counter, a modulo counter, or an up-/down-counter when the TPM1 is configured for center-aligned PWM. The TPM1 counter (when operating in normal up-counting mode) provides the timing reference for the input capture, output compare, and edge-aligned PWM functions. The timer counter modulo registers, TPMMODH:TPMMODL, control the modulo value of the counter. (The values 0x0000 or 0xFFFF effectively make the counter free running.) Software can read the counter value at any time without affecting the counting sequence. Any write to either byte of the TPMCNT counter resets the counter regardless of the data value written.All TPM1 channels are programmable independently as input capture, output compare, or buffered edge-aligned PWM channels.9.3 External Signal DescriptionWhen any pin associated with the timer is configured as a timer input, a passive pullup can be enabled. After reset, the TPM1 modules are disabled and all pins default to general-purpose inputs with the passive pullups disabled.Each TPM1 channel is associated with an I/O pin on the MCU. The function of this pin depends on the configuration of the channel. In some cases, no pin function is needed so the pin reverts to being controlled by general-purpose I/O controls. When a timer has control of a port pin, the port data and data direction registers do not affect the related pin(s). See the Section 2 for additional information about shared pin functions.PRESCALE AND SELECT16-BIT COMPARATORMAIN 16-BIT COUNTER16-BIT COMPARATOR16-BIT LATCHPORT16-BIT COMPARATOR16-BIT LATCHCHANNEL 0CHANNEL 1INTERNAL BUSLOGICINTERRUPTPORTLOGICCOUNTER RESETDIVIDE BYCLOCK SOURCEOFF, BUS, XCLK, EXT BUSCLKSELECTSYNCINTERRUPTINTERRUPT1, 2, 4, 8, 16, 32, 64, or 128 LOGICLOGICLOGICCLKSACLKSB PS2 PS1 PS0CPWMSTOIETOFELS0ACH0FELS0BELS1B ELS1ACH1FCH0IECH1IEMS1BMS0B MS0AMS1ATPMMODH:TPMMOTPMC0VH:TPMC0VLTPMC1VH:TPMC1VLTPMCH1TPMCH0DX
FXTH870x6Sensors72 Freescale Semiconductor, Inc.9.4 Register DefinitionThe TPM1 includes:• An 8-bit status and control register (TPMSC)• A 16-bit counter (TPMCNTH:TPMCNTL)• A 16-bit modulo register (TPMMODH:TPMMODL)Each timer channel has:• An 8-bit status and control register (TPMCnSC)• A 16-bit channel value register (TPMCnVH:TPMCnVL)9.4.1 Timer Status and Control Register (TPM1SC)TPM1SC contains the overflow status flag and control bits that are used to configure the interrupt enable, TPM1 configuration, clock source, and prescale divisor. These controls relate to all channels within this timer module.$0010 76543210RTOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0WReset 00000000= ReservedFigure 43. Timer Status and Control Register (TPM1SC)Table 47. TPM1SC Register Field DescriptionsField Description7TOFTimer Overflow Flag — This flag is set when the TPM1 counter changes to 0x0000 after reaching the modulo value programmed in the TPM1 counter modulo registers. When the TPM1 is configured for CPWM, TOF is set after the counter has reached the value in the modulo register, at the transition to the next lower count value. Clear TOF by reading the TPM1 status and control register when TOF is set and then writing a 0 to TOF. If another TPM1 overflow occurs before the clearing sequence is complete, the sequence is reset so TOF would remain set after the clear sequence was completed for the earlier TOF. Reset clears TOF. Writing a 1 to TOF has no effect.0 TPM1 counter has not reached modulo value or overflow1 TPM1 counter has overflowed6TOIETimer Overflow Interrupt Enable — This read/write bit enables TPM1 overflow interrupts. If TOIE is set, an interrupt is generated when TOF equals 1. Reset clears TOIE.0 TOF interrupts inhibited (use software polling)1 TOF interrupts enabled5CPWMSCenter-Aligned PWM Select — This read/write bit selects CPWM operating mode. Reset clears this bit so the TPM1 operates in up-counting mode for input capture, output compare, and edge-aligned PWM functions. Setting CPWMS reconfigures the TPM1 to operate in up-/down-counting mode for CPWM functions. Reset clears CPWMS.0 All TPM channels operate as input capture, output compare, or edge-aligned PWM mode as selected by the MSnB:MSnA control bits in each channel’s status and control register1 All TPM channels operate in center-aligned PWM mode4:3CLKS[B:A]Clock Source Select — As shown in Table 46, this 2-bit field is used to disable the TPM1 system or select one of three clock sources to drive the counter prescaler. The internal DX source is synchronized to the bus clock by an on-chip synchronization circuit.2:0PS[2:0]Prescale Divisor Select — This 3-bit field selects one of eight divisors for the TPM1 clock input as shown in Table 48. This prescaler is located after any clock source synchronization or clock source selection, so it affects whatever clock source is selected to drive the TPM1 system.
FXTH870x6SensorsFreescale Semiconductor, Inc. 739.4.2 Timer Counter Registers (TPM1CNTH:TPM1CNTL)The two read-only TPM1 counter registers contain the high and low bytes of the value in the TPM1 counter. Reading either byte (TPM1CNTH or TPM1CNTL) latches the contents of both bytes into a buffer where they remain latched until the other byte is read. This allows coherent 16-bit reads in either order. The coherency mechanism is automatically restarted by an MCU reset, a write of any value to TPM1CNTH or TPM1CNTL, or any write to the timer status/control register (TPM1SC).Reset clears the TPM1 counter registers. When BACKGROUND mode is active, the timer counter and the coherency mechanism are frozen such that the buffer latches remain in the state they were in when the BACKGROUND mode became active even if one or both bytes of the counter are read while BACKGROUND mode is active.9.4.3 Timer Counter Modulo Registers (TPM1MODH:TPM1MODL)The read/write TPM1 modulo registers contain the modulo value for the TPM1 counter. After the TPM1 counter reaches the modulo value, the TPM1 counter resumes counting from 0x0000 at the next clock (CPWMS = 0) or starts counting down (CPWMS = 1), and the overflow flag (TOF) becomes set. Writing to TPM1MODH or TPM1MODL inhibits TOF and overflow interrupts until the other byte is written. Reset sets the TPM1 counter modulo registers to 0x0000, which results in a free-running timer counter (modulo disabled).Table 48. Prescale Divisor SelectionPS2:PS1:PS0 TPM1 Clock Source Divided-By0:0:0 10:0:1 20:1:0 40:1:1 81:0:0 161:0:1 321:1:0 641:1:1 128$0011 76543210RBit 15 14 13 12 11 10 9 Bit 8WAny write to TPMCNTH clears the 16-bit counter.Reset 00000000Figure 44. Timer Counter Register High (TPM1CNTH)$0012 76543210RBit 7654321Bit 0WAny write to TPMCNTL clears the 16-bit counter.Reset 00000000Figure 45. Timer Counter Register Low (TPM1CNTL)$0013 7 6 5 43210RBit 15 14 13 12 11 10 9 Bit 8WReset 00000000Figure 46. Timer Counter Modulo Register High (TPM1MODH)
FXTH870x6Sensors74 Freescale Semiconductor, Inc.It is good practice to wait for an overflow interrupt so both bytes of the modulo register can be written well before a new overflow. An alternative approach is to reset the TPM1 counter before writing to the TPM1 modulo registers to avoid confusion about when the first counter overflow will occur.9.4.4 Timer Channel 0 Status and Control Register (TPM1C0SC)TPM1C0SC contains the channel interrupt status flag and control bits that are used to configure the interrupt enable, channel configuration, and pin function.$001476543210RBit 7654321Bit 0WReset 00000000Figure 47. Timer Counter Modulo Register Low (TPM1MODL)$0015 76543210RCH0F CH0IE MS0B MS0A ELS0B ELS0A 00WReset 00000000= ReservedFigure 48. Timer Channel 0 Status and Control Register (TPM1C0SC)Table 49. TPM1C0SC Register Field DescriptionsField Description7CH0FChannel 0 Flag — When channel n is configured for input capture, this flag bit is set when an active edge occurs on the channel n pin. When channel 0 is an output compare or edge-aligned PWM channel, CH0F is set when the value in the TPM1 counter registers matches the value in the TPM1 channel 0 value registers. This flag is seldom used with center-aligned PWMs because it is set every time the counter matches the channel value register, which correspond to both edges of the active duty cycle period.A corresponding interrupt is requested when CH0F is set and interrupts are enabled (CH0IE = 1). Clear CH0F by reading TPM1C0SC while CH0F is set and then writing a 0 to CH0F. If another interrupt request occurs before the clearing sequence is complete, the sequence is reset so CH0F would remain set after the clear sequence was completed for the earlier CH0F. This is done so a CH0F interrupt request cannot be lost by clearing a previous CH0F. Reset clears CH0F. Writing a 1 to CH0F has no effect.0 No input capture or output compare event occurred on channel 01 Input capture or output compare event occurred on channel 06CH0IEChannel 0 Interrupt Enable — This read/write bit enables interrupts from channel 0. Reset clears CH0IE.0 Channel 0 interrupt requests disabled (use software polling)1 Channel 0 interrupt requests enabled5MS0BMode Select B for TPM1 Channel 0 — When CPWMS = 0, MS0B = 1 configures TPM1 channel 0 for edge-aligned PWM mode. For a summary of channel mode and setup controls, refer to Table 50.4MS0AMode Select A for TPM1 Channel 0 — When CPWMS = 0 and MS0B = 0, MS0A configures TPM1 channel 0 for input capture mode or output compare mode. Refer to Table 50 for a summary of channel mode and setup controls.3:2ELS0[B:A]Edge/Level Select Bits — Depending on the operating mode for the timer channel as set by CPWMS:MS0B:MSnA and shown in Table 50, these bits select the polarity of the input edge that triggers an input capture event, select the level that will be driven in response to an output compare match, or select the polarity of the PWM output.Setting ELS0B:ELS0A to 0:0 configures the related timer pin as a general-purpose I/O pin unrelated to any timer channel functions. This function is typically used to temporarily disable an input capture channel or to make the timer pin available as a general-purpose I/O pin when the associated timer channel is set up as a software timer that does not require the use of a pin.
FXTH870x6SensorsFreescale Semiconductor, Inc. 75If the associated port pin is not stable for at least two bus clock cycles before changing to input capture mode, it is possible to get an unexpected indication of an edge trigger. Typically, a program would clear status flags after changing channel configuration bits and before enabling channel interrupts or using the status flags to avoid any unexpected behavior.9.4.5 Timer Channel Value Registers (TPM1C0VH:TPM1C0VL)These read/write registers contain the captured TPM1 counter value of the input capture function or the output compare value for the output compare or PWM functions. The channel value registers are cleared by reset.In input capture mode, reading either byte (TPM1C0VH or TPM1C0VL) latches the contents of both bytes into a buffer where they remain latched until the other byte is read. This latching mechanism also resets (becomes unlatched) when the TPM1C0SC register is written.In output compare or PWM modes, writing to either byte (TPM1C0VH or TPM1C0VL) latches the value into a buffer. When both bytes have been written, they are transferred as a coherent 16-bit value into the timer channel value registers. This latching mechanism may be manually reset by writing to the TPM1C0SC register.This latching mechanism allows coherent 16-bit writes in either order, which is friendly to various compiler implementations.Table 50. Mode, Edge, and Level SelectionCPWMS MS0B:MS0A ELS0B:ELS0A Mode ConfigurationXXX 00Pin not used for TPM1 channel; use as an external clock for the TPM1 or revert to general-purpose I/O00001Input captureCapture on rising edge only10 Capture on falling edge only11 Capture on rising or falling edge0100Output compareSoftware compare only01 Toggle output on compare10 Clear output on compare11 Set output on compare1X 10 Edge-aligned PWMHigh-true pulses (clear output on compare)X1 Low-true pulses (set output on compare)1XX 10 Center-aligned PWMHigh-true pulses (clear output on compare-up)X1 Low-true pulses (set output on compare-up)$001676543210RBit 15 14 13 12 11 10 9 Bit 8WReset 00000000Figure 49. Timer Channel 0 Value Register High (TPM1C0VH)$001776543210RBit 7654321Bit 0WReset 00000000Figure 50. Timer Channel 0 Value Register Low (TPM1C0VL)
FXTH870x6Sensors76 Freescale Semiconductor, Inc.9.4.6 Timer Channel 1 Status and Control Register (TPM1C1SC)TPM1C1SC contains the channel interrupt status flag and control bits that are used to configure the interrupt enable, channel configuration, and pin function.$0018 76543210RCH1F CH1IE MS1B MS1A ELS1B ELS1A 00WReset 00000000= ReservedFigure 51. Timer Channel 1 Status and Control Register (TPM1C1SC)Table 51. TPM1C1SC Register Field DescriptionsField Description7CH1FChannel 1 Flag — When channel n is configured for input capture, this flag bit is set when an active edge occurs on the channel n pin. When channel 1 is an output compare or edge-aligned PWM channel, CH1F is set when the value in the TPM1 counter registers matches the value in the TPM1 channel 1 value registers. This flag is seldom used with center-aligned PWMs because it is set every time the counter matches the channel value register, which correspond to both edges of the active duty cycle period.A corresponding interrupt is requested when CH1F is set and interrupts are enabled (CH1IE = 1). Clear CH1F by reading TPM1C1SC while CH1F is set and then writing a 0 to CH1F. If another interrupt request occurs before the clearing sequence is complete, the sequence is reset so CH1F would remain set after the clear sequence was completed for the earlier CH1F. This is done so a CH1F interrupt request cannot be lost by clearing a previous CH1F. Reset clears CH1F. Writing a 1 to CH1F has no effect.0 No input capture or output compare event occurred on channel 11 Input capture or output compare event occurred on channel 16CH1IEChannel 1 Interrupt Enable — This read/write bit enables interrupts from channel 1. Reset clears CH1IE.0 Channel 1 interrupt requests disabled (use software polling)1 Channel 1 interrupt requests enabled5MS1BMode Select B for TPM1 Channel 1 — When CPWMS = 0, MS1B = 1 configures TPM1 channel 1 for edge-aligned PWM mode. For a summary of channel mode and setup controls, refer to Table 50.4MS1AMode Select A for TPM1 Channel 1 — When CPWMS = 0 and MS1B = 0, MS1A configures TPM1 channel 1 for input capture mode or output compare mode. Refer to Table 50 for a summary of channel mode and setup controls.3:2ELS1[B:A]Edge/Level Select Bits — Depending on the operating mode for the timer channel as set by CPWMS:MS1B:MS1A and shown in Table 50, these bits select the polarity of the input edge that triggers an input capture event, select the level that will be driven in response to an output compare match, or select the polarity of the PWM output.Setting ELS1B:ELS1A to 0:0 configures the related timer pin as a general-purpose I/O pin unrelated to any timer channel functions. This function is typically used to temporarily disable an input capture channel or to make the timer pin available as a general-purpose I/O pin when the associated timer channel is set up as a software timer that does not require the use of a pin.Table 52. Mode, Edge, and Level SelectionCPWMS MS1B:MS1A ELS1B:ELS1A Mode ConfigurationXXX 00Pin not used for TPM1 channel; use as an external clock for the TPM1 or revert to general-purpose I/O00001Input captureCapture on rising edge only10 Capture on falling edge only11 Capture on rising or falling edge0100Output compareSoftware compare only01 Toggle output on compare10 Clear output on compare11 Set output on compare1X 10 Edge-aligned PWMHigh-true pulses (clear output on compare)X1 Low-true pulses (set output on compare)
FXTH870x6SensorsFreescale Semiconductor, Inc. 77If the associated port pin is not stable for at least two bus clock cycles before changing to input capture mode, it is possible to get an unexpected indication of an edge trigger. Typically, a program would clear status flags after changing channel configuration bits and before enabling channel interrupts or using the status flags to avoid any unexpected behavior.9.4.7 Timer Channel Value Registers (TPM1C1VH:TPM1C1VL)These read/write registers contain the captured TPM1 counter value of the input capture function or the output compare value for the output compare or PWM functions. The channel value registers are cleared by reset.In input capture mode, reading either byte (TPM1C1VH or TPM1C1VL) latches the contents of both bytes into a buffer where they remain latched until the other byte is read. This latching mechanism also resets (becomes unlatched) when the TPM1C1SC register is written.In output compare or PWM modes, writing to either byte (TPM1C1VH or TPM1C1VL) latches the value into a buffer. When both bytes have been written, they are transferred as a coherent 16-bit value into the timer channel value registers. This latching mechanism may be manually reset by writing to the TPM1C1SC register.This latching mechanism allows coherent 16-bit writes in either order, which is friendly to various compiler implementations.9.5 Functional DescriptionAll TPM1 functions are associated with a main 16-bit counter that allows flexible selection of the clock source and prescale divisor. A 16-bit modulo register also is associated with the main 16-bit counter in the TPM1. Each TPM1 channel is optionally associated with an MCU pin and a maskable interrupt function.The TPM1 has center-aligned PWM capabilities controlled by the CPWMS control bit in TPM1SC. When CPWMS is set to 1, timer counter TPM1CNT changes to an up-/down-counter and all channels in the associated TPM1 act as center-aligned PWM channels. When CPWMS = 0, each channel can independently be configured to operate in input capture, output compare, or buffered edge-aligned PWM mode.The following sections describe the main 16-bit counter and each of the timer operating modes (input capture, output compare, edge-aligned PWM, and center-aligned PWM). Because details of pin operation and interrupt activity depend on the operating mode, these topics are covered in the associated mode sections.9.5.1 CounterAll timer functions are based on the main 16-bit counter (TPM1CNTH:TPM1CNTL). This section discusses selection of the clock source, up-counting vs. up-/down-counting, end-of-count overflow, and manual counter reset.After any MCU reset, CLKSB:CLKSA = 0:0 so no clock source is selected and the TPM1 is inactive. Normally, CLKSB:CLKSA would be set to 0:1 so the bus clock drives the timer counter. The clock source for the TPM1 can be selected to be off, the bus 1XX 10 Center-aligned PWMHigh-true pulses (clear output on compare-up)X1 Low-true pulses (set output on compare-up)$001976543210RBit 15 14 13 12 11 10 9 Bit 8WReset 00000000Figure 52. Timer Channel 1 Value Register High (TPM1C1VH)$001A76543210RBit 7654321Bit 0WReset 00000000Figure 53. Timer Channel 1 Value Register Low (TPM1C1VL)Table 52. Mode, Edge, and Level Selection (continued)CPWMS MS1B:MS1A ELS1B:ELS1A Mode Configuration
FXTH870x6Sensors78 Freescale Semiconductor, Inc.clock (BUSCLK), the fixed system clock (XCLK), or an external input. The maximum frequency allowed for the external clock option is one-fourth the bus rate. Refer to Section 9.4.1 and Table 49 for more information about clock source selection.When the microcontroller is in ACTIVE BACKGROUND mode, the TPM1 temporarily suspends all counting until the microcontroller returns to normal user operating mode. During STOP mode, all TPM1 clocks are stopped; therefore, the TPM1 is effectively disabled until clocks resume. During WAIT mode, the TPM1 continues to operate normally.The main 16-bit counter has two counting modes. When center-aligned PWM is selected (CPWMS = 1), the counter operates in up-/down-counting mode. Otherwise, the counter operates as a simple up-counter. As an up-counter, the main 16-bit counter counts from 0x0000 through its terminal count and then continues with 0x0000. The terminal count is 0xFFFF or a modulus value in TPM1MODH:TPM1MODL.When center-aligned PWM operation is specified, the counter counts upward from 0x0000 through its terminal count and then counts downward to 0x0000 where it returns to up-counting. Both 0x0000 and the terminal count value (value in TPM1MODH:TPM1MODL) are normal length counts (one timer clock period long).An interrupt flag and enable are associated with the main 16-bit counter. The timer overflow flag (TOF) is a software-accessible indication that the timer counter has overflowed. The enable signal selects between software polling (TOIE = 0) where no hardware interrupt is generated, or interrupt-driven operation (TOIE = 1) where a static hardware interrupt is automatically generated whenever the TOF flag is 1.The conditions that cause TOF to become set depend on the counting mode (up or up/down). In up-counting mode, the main 16-bit counter counts from 0x0000 through 0xFFFF and overflows to 0x0000 on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When the main 16-bit counter is operating in up-/down-counting mode, the TOF flag gets set as the counter changes direction at the transition from the value set in the modulus register and the next lower count value. This corresponds to the end of a PWM period. (The 0x0000 count value corresponds to the center of a period.)Because the HCS08 MCU is an 8-bit architecture, a coherency mechanism is built into the timer counter for read operations. Whenever either byte of the counter is read (TPM1CNTH or TPM1CNTL), both bytes are captured into a buffer so when the other byte is read, the value will represent the other byte of the count at the time the first byte was read. The counter continues to count normally, but no new value can be read from either byte until both bytes of the old count have been read.The main timer counter can be reset manually at any time by writing any value to either byte of the timer count TPM1CNTH or TPM1CNTL. Resetting the counter in this manner also resets the coherency mechanism in case only one byte of the counter was read before resetting the count.9.5.2 Channel Mode SelectionProvided CPWMS = 0 (center-aligned PWM operation is not specified), the MSnB and MSnA control bits in the channel n status and control registers determine the basic mode of operation for the corresponding channel. Choices include input capture, output compare, and buffered edge-aligned PWM.Input Capture ModeWith the input capture function, the TPM1 can capture the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the TPM1 latches the contents of the TPM1 counter into the channel value registers (TPM1CnVH:TPM1CnVL). Rising edges, falling edges, or any edge may be chosen as the active edge that triggers an input capture.When either byte of the 16-bit capture register is read, both bytes are latched into a buffer to support coherent 16-bit accesses regardless of order. The coherency sequence can be manually reset by writing to the channel status/control register (TPM1CnSC).An input capture event sets a flag bit (CHnF) that can optionally generate a CPU interrupt request.Output Compare ModeWith the output compare function, the TPM1 can generate timed pulses with programmable position, polarity, duration, and frequency. When the counter reaches the value in the channel value registers of an output compare channel, the TPM1 can set, clear, or toggle the channel pin.In output compare mode, values are transferred to the corresponding timer channel value registers only after both 8-bit bytes of a 16-bit register have been written. This coherency sequence can be manually reset by writing to the channel status/control register (TPM1CnSC).An output compare event sets a flag bit (CHnF) that can optionally generate a CPU interrupt request.
FXTH870x6SensorsFreescale Semiconductor, Inc. 79Edge-Aligned PWM ModeThis type of PWM output uses the normal up-counting mode of the timer counter (CPWMS = 0) and can be used when other channels in the same TPM1 are configured for input capture or output compare functions. The period of this PWM signal is determined by the setting in the modulus register (TPM1MODH:TPM1MODL). The duty cycle is determined by the setting in the timer channel value register (TPM1CnVH:TPM1CnVL). The polarity of this PWM signal is determined by the setting in the ELSnA control bit. Duty cycle cases of 0 percent and 100 percent are possible.As Figure 54 shows, the output compare value in the TPM1 channel registers determines the pulse width (duty cycle) of the PWM signal. The time between the modulus overflow and the output compare is the pulse width. If ELSnA = 0, the counter overflow forces the PWM signal high and the output compare forces the PWM signal low. If ELSnA = 1, the counter overflow forces the PWM signal low and the output compare forces the PWM signal high.Figure 54. PWM Period and Pulse Width (ELSnA = 0)When the channel value register is set to 0x0000, the duty cycle is 0 percent. By setting the timer channel value register (TPMCnVH:TPMCnVL) to a value greater than the modulus setting, 100% duty cycle can be achieved. This implies that the modulus setting must be less than 0xFFFF to get 100% duty cycle.Because the HCS08 is a family of 8-bit MCUs, the settings in the timer channel registers are buffered to ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to either register, TPM1CnVH or TPM1CnVL, write to buffer registers. In edge-PWM mode, values are transferred to the corresponding timer channel registers only after both 8-bit bytes of a 16-bit register have been written and the value in the 1TPMCNTH:TPM1CNTL counter is 0x0000. (The new duty cycle does not take effect until the next full period.)9.5.3 Center-Aligned PWM ModeThis type of PWM output uses the up-/down-counting mode of the timer counter (CPWMS = 1). The output compare value in TPM1CnVH:TPM1CnVL determines the pulse width (duty cycle) of the PWM signal and the period is determined by the value in TPM1MODH:TPM1MODL. TPM1MODH:TPM1MODL should be kept in the range of 0x0001 to 0x7FFF because values outside this range can produce ambiguous results. ELS0A will determine the polarity of the CPWM output.pulse width =2 x (TPM1CnVH:TPM1CnVL)period = 2 x (TPM1MODH:TPM1MODL); for TPM1MODH:TPM1MODL = 0x0001–0x7FFFIf the channel value register TPM1CnVH:TPM1CnVL is zero or negative (bit 15 set), the duty cycle will be 0%. If TPM1CnVH:TPM1CnVL is a positive value (bit 15 clear) and is greater than the (nonzero) modulus setting, the duty cycle will be 100% because the duty cycle compare will never occur. This implies the usable range of periods set by the modulus register is 0x0001 through 0x7FFE (0x7FFF if generation of 100% duty cycle is not necessary). This is not a significant limitation because the resulting period is much longer than required for normal applications.TPM1MODH:TPM1MODL = 0x0000 is a special case that should not be used with center-aligned PWM mode. When CPWMS = 0, this case corresponds to the counter running free from 0x0000 through 0xFFFF, but when CPWMS = 1 the counter needs a valid match to the modulus register somewhere other than at 0x0000 in order to change directions from up-counting to down-counting.Figure 55 shows the output compare value in the TPM1 channel registers (multiplied by 2), which determines the pulse width (duty cycle) of the CPWM signal. If ELSnA = 0, the compare match while counting up forces the CPWM output signal low and a compare match while counting down forces the output high. The counter counts up until it reaches the modulo setting in TPM1MODH:TPM1MODL, then counts down until it reaches zero. This sets the period equal to two times TPM1MODH:TPM1MODL.PERIODPULSEWIDTHOVERFLOW OVERFLOW OVERFLOWOUTPUTCOMPARE OUTPUTCOMPAREOUTPUTCOMPARETPMCH
FXTH870x6Sensors80 Freescale Semiconductor, Inc.Figure 55. CPWM Period and Pulse Width (ELSnA = 0)Center-aligned PWM outputs typically produce less noise than edge-aligned PWMs because fewer I/O pin transitions are lined up at the same system clock edge. This type of PWM is also required for some types of motor drives.Because the HCS08 is a family of 8-bit MCUs, the settings in the timer channel registers are buffered to ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers, TPM1MODH, TPM1MODL, TPM1CnVH, and TPM1CnVL, actually write to buffer registers. Values are transferred to the corresponding timer channel registers only after both 8-bit bytes of a 16-bit register have been written and the timer counter overflows (reverses direction from up-counting to down-counting at the end of the terminal count in the modulus register). This TPM1CNT overflow requirement only applies to PWM channels, not output compares.Optionally, when TPM1CNTH:TPM1CNTL = TPM1MODH:TPM1MODL, the TPM1 can generate a TOF interrupt at the end of this count. The user can choose to reload any number of the PWM buffers, and they will all update simultaneously at the start of a new period.Writing to TPM1SC cancels any values written to TPM1MODH and/or TPM1MODL and resets the coherency mechanism for the modulo registers. Writing to TPM1C0SC cancels any values written to the channel value registers and resets the coherency mechanism for TPM1C0VH:TPM1C0VL.9.6 TPM1 InterruptsThe TPM1 generates an optional interrupt for the main counter overflow and an interrupt for each channel. The meaning of channel interrupts depends on the mode of operation for each channel. If the channel is configured for input capture, the interrupt flag is set each time the selected input capture edge is recognized. If the channel is configured for output compare or PWM modes, the interrupt flag is set each time the main timer counter matches the value in the 16-bit channel value register. See Section 5 for absolute interrupt vector addresses, priority, and local interrupt mask control bits.For each interrupt source in the TPM1, a flag bit is set on recognition of the interrupt condition such as timer overflow, channel input capture, or output compare events. This flag may be read (polled) by software to verify that the action has occurred, or an associated enable bit (TOIE or CHnIE) can be set to enable hardware interrupt generation. While the interrupt enable bit is set, a static interrupt will be generated whenever the associated interrupt flag equals 1. It is the responsibility of user software to perform a sequence of steps to clear the interrupt flag before returning from the interrupt service routine.9.6.1 Clearing Timer Interrupt FlagsTPM1 interrupt flags are cleared by a two-step process that includes a read of the flag bit while it is set (1) followed by a write of 0 to the bit. If a new event is detected between these two steps, the sequence is reset and the interrupt flag remains set after the second step to avoid the possibility of missing the new event.9.6.2 Timer Overflow Interrupt DescriptionThe conditions that cause TOF to become set depend on the counting mode (up or up/down). In up-counting mode, the 16-bit timer counter counts from 0x0000 through 0xFFFF and overflows to 0x0000 on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When the counter is operating in up-/down-counting mode, the TOF flag gets set as the counter changes direction at the transition from the value set in the modulus register and the next lower count value. This corresponds to the end of a PWM period. (The 0x0000 count value corresponds to the center of a period.)PERIOD 2xPULSE WIDTHCOUNT =COUNT = 0 OUTPUTCOMPARE(COUNT UP)OUTPUTCOMPARE(COUNT DOWN)COUNT =TPMMODH:TPMMODLTPMMODH:TPMMODL TPMMODH:TPMMODLTPM1CHn2x
FXTH870x6SensorsFreescale Semiconductor, Inc. 819.6.3 Channel Event Interrupt DescriptionThe meaning of channel interrupts depends on the current mode of the channel (input capture, output compare, edge-aligned PWM, or center-aligned PWM).When a channel is configured as an input capture channel, the ELSnB:ELSnA control bits select rising edges, falling edges, any edge, or no edge (off) as the edge that triggers an input capture event. When the selected edge is detected, the interrupt flag is set. The flag is cleared by the two-step sequence described in Section 9.6.1.When a channel is configured as an output compare channel, the interrupt flag is set each time the main timer counter matches the 16-bit value in the channel value register. The flag is cleared by the two-step sequence described in Section 9.6.1.9.6.4 PWM End-of-Duty-Cycle EventsFor channels that are configured for PWM operation, there are two possibilities: • When the channel is configured for edge-aligned PWM, the channel flag is set when the timer counter matches the channel value register that marks the end of the active duty cycle period. • When the channel is configured for center-aligned PWM, the timer count matches the channel value register twice during each PWM cycle. In this CPWM case, the channel flag is set at the start and at the end of the active duty cycle, which are the times when the timer counter matches the channel value register. The flag is cleared by the two-step sequence described in Section 9.6.1.
FXTH870x6Sensors82 Freescale Semiconductor, Inc.10 .Other MCU ResourcesIt is not intended that physical parameter measurements be made during the time that LFR may be actively receiving/decoding LF signals; or during the time that the RFM may be actively powered up and/or transmitting RF data. The resulting interactions will degrade the accuracy of the measurements.The FXTH870x6 measures six physical parameters for use in the tire pressure monitoring application: pressure, temperature, battery voltage, two external voltages and an optional X- and/or Z-axis acceleration. Each parameter is accessed in a different manner and all use firmware subroutine calls as described in Section 14. These subroutines initialize some control bits within the sensor measurement interface, SMI, and then place the MCU into the STOP4 mode until the measurement is completed with an interrupt back to the MCU.The accuracy, power consumption and timing specified for any measurement given in the electrical specifications in Section 17 are only guaranteed if the user obtains a reading using the specified firmware subroutine call in Section 14.The FXTH870x6 uses a 6-channel, 10-bit analog-to-digital converter (ADC10) module. The ADC10 module is an analog-to-digital converter using a successive approximation register (SAR) architecture with sample and hold. Capture of pressure and acceleration sensor readings is controlled by the sensor measurement interface (SMI) and capture of temperature and voltage readings are controlled by the MCU.When making measurements of the various analog voltages the individual blocks will first be powered up long enough to stabilize their outputs before a conversion is started. The ADC channels are connected in hardware. Conversions are started and ended synchronously with the sampling of the voltages.The accuracy, power consumption and timing specifications given in the electrical specifications in Section 17 are based on using the assigned firmware subroutines in Section 14 to make these measurements and convert them into an 8-bit, 9-bit or 10-bit transfer function. These measurement accuracy specifications cannot be guaranteed if the user creates custom software routines to convert these measurements. 10.1 Pressure MeasurementThe pressure measurement consists of an interface to a pressure sensing element. Control bits on the MCU operate the SMI to power up the P-Cell and capture a voltage which is converted by the ADC10. The resulting pressure transfer equation for the 100-450 kPa range:Eqn. 1The transfer equation of the 100-900 kPa range is:Eqn. 2Due to calibration routines and parameters stored in the FXTH870x6, the pressure range is selected at production and cannot be changed in the field.NOTELack of change of the pressure measurement over time may indicate the package pressure port to be blocked or the internal section of the sensor to be contaminated. User application should maintain either locally or at the system data receiver a record of pressure measurements along with temperature and/or accelerometer measurements, and possibly identify the pressure port as blocked or contaminated if no changes are recorded over time.Table 53. ADC10 Channel AssignmentsADC10 Channel Input Select Firmware Call(s) CharacteristicAD0Pressure Sensor TPMS_READ_COMP_PRESSURE PCODEOptional X-axis Acceleration Sensor TPMS_READ_COMP_ACCEL_X AXCODEOptional Z-axis Acceleration Sensor TPMS_READ_COMP_ACCEL_Z AZCODEAD1 Temperature Sensor TPMS_READ_COMP_TEMP_8 TCODEAD2 Bandgap Reference TPMS_READ_COMP_VOLTAGE VCODEAD3 GPIO PTA0 TPMS_READ_V0 G0CODEAD4 GPIO PTA1 TPMS_READ_V1 G1CODEAD5 VREG Monitor TPMS_WIRE_CHECKPP450 PCODE100 P450–+=PP900 PCODE100 P900–+=
FXTH870x6SensorsFreescale Semiconductor, Inc. 8310.2 Temperature MeasurementsThe temperature is measured from a VB sensor built into channel 1 of the ADC10 in the same manner as is done in the FXTH870x6 devices with the resulting transfer equation:Eqn. 310.3 Voltage MeasurementsVoltage measurements can be made on the internal bandgap to estimate the supply voltage on VDD. 10.3.1 Internal BandgapAn internal bandgap voltage reference is provided to take measurements of the supply voltage. The resulting transfer equation:Eqn. 410.3.2 External VoltagesMeasurements of an external voltage on either the PTA0 or PTA1 pins can be made and referenced to the internal bandgap voltage. The resulting transfer equation: Eqn. 5where x = 0, 1 refers to PTA0 or PTA1.10.4 Optional Acceleration MeasurementsThe acceleration measurement consists of an interface to an optional acceleration sensing element. Control bits on the MCU operate the SMI to power up the g-Cell and capture a voltage which is converted by the ADC10. The data from the ADC10 is then pre-processed by a dynamic range firmware routine that will return the two values necessary to calculate the acceleration, Ay, (y = X-axis or Z-axis, depending on selection) in conjunction with values taken from the table in Section 17.10.1.The first value from the firmware routine is the offset step identifier, STEP, with integer values 0 to 15 (i.e. the 16 offset steps). The other value is the ADC10 data, AyCODE, with integer values 0 to 511. AyCODE values 1 through 510 are usable; values 0 and 511 indicate fault conditions. The X-axis acceleration is scaled for ~20g range within each of the 16 offset steps, ~10g per step. The Z-axis acceleration is scaled for ~80g range within each of the 16 offset steps, ~80g or ~60g. The steps are at ~40g or ~30g increments, allowing for adequate overlaps. Section 17.10.1 provides a table of acceleration values resulting from characterizations.Acceleration sensitivity, Ay-STEP, varies between each offset step, and should be calculated by dividing the range of g’s for each offset step by the usable AyCODE range (i.e. 510): Eqn. 6Once the sensitivity Ay-STEP has been calculated, the acceleration Ay can be calculated by the re-using the Ay-STEP @ AyCODE 1 value of the offset step and the returned AyCODE value with the following transfer function: Eqn. 7The pressure, and optional X or Z-axis accelerometer also share the same signal path in the Transducer interface and all the sensors share the same ADC. Therefore only one of the sensors can be accessed at a given moment.NOTEThe included accelerometers are designed with a self-test feature. Consult sales/application support for information regarding the recommended use of the accelerometer self-test features.10.5 Optional Battery Condition CheckThe condition of the battery can be periodically checked to determine the battery’s internal impedance, RBATT, which is a function of both temperature and the remaining battery capacity. This can be performed by user supplied software routine and an external load resistor, RLOAD, connected from the PTA0 pin to VSS as shown in Figure 56 (any of the PTA[3:0] can be used for this purpose).TTTCODE 55–=VINT VINT VCODE 1.22+=VPTAx VEXT GxCODE=Ay-STEP Ay-STEP @ AyCODE510 Ay-STEP @ AyCODE1–510=AyAy-STEP AyCODE Ay-STEP @ AyCODE1Ay-STEP–+=
FXTH870x6Sensors84 Freescale Semiconductor, Inc.Figure 56. Battery Check CircuitThe battery voltage can first be checked using the method given in Section 10.3 with the selected PTA0 pin set as an output and driven low and then high to determine VDD where only IDD flows or when IDD plus ILOAD flows. The resulting battery impedance can then be calculated as:Eqn. 8If it is assumed that IDD0 and IDD1 are not appreciably different at the small change in VDD, then the resulting battery impedance can be approximated as:Eqn. 9where:VDD0 is the voltage determined with the external load resistor connected to VSSVDD1 is the voltage determined with the external load resistor connected to VDDRLOAD is the resistance of the external load resistance in ohmsRBATT is the implied battery impedance in ohmsIt is recommended that this calculation be performed with a reasonable current load on the battery of approximately 3 mA (RLOAD approximately 1000 ohms).PTA0VSSVDDFXTH870xxxRLOAD +VBATTIDDPort Pin Driven Low Port Pin Driven HighRBATT PTA0VSSVDDFXTH870xxxRLOAD +VBATTIDD + ILOAD RBATTILOADVDD0 VBATT IDD0 RBATT–= VDD1 VBATT IDD1 ILOAD+RBATT–=VDD1 VBATT IDD1VDD1RLOAD---------------------+RBATT–=RBATTVDD1 VDD0–IDD0 IDD1–VDD1RLOAD---------------------+---------------------------------------------------------------=RBATTVDD1 VDD0–VDD1RLOAD------------------------------------------------------------ RLOAD VDD1 VDD0–VDD1-------------------------------------------------------------------------==
FXTH870x6SensorsFreescale Semiconductor, Inc. 8510.6 Measurement FirmwareThe firmware for making measurements is comprised of two function calls as described in Section 14. Each measurement is a combination of a “read” that returns the raw ADC output data and a “comp” routine which compensates that raw reading based on information contained in the Universal Uncompensated Measurement Array (UUMA) assigned in RAM memory.The read routines fill specific locations in the UUMA with raw data; but the compensation routines depend what is already present in the UUMA as shown in the data flow in Figure 57.The user therefore has the option to decide how often each measurement (and its component terms) are made. The resulting power consumption is then the sum of using these components are defined in the electrical specifications in Section 17.A typical flow for a compensated pressure measurement would be:1. Call the TPMS_READ_PRESSURE routine which yields a raw pressure value and fills the UUMA with this data.2. Call the TPMS_READ_TEMPERATURE routine which yields a raw temperature value and fills the UUMA with this data.3. Call the TPMS_READ_VOLTAGE routine which yields a raw voltage value and fills the UUMA with this data.4. Call the TPMS_COMP_PRESSURE routine which then takes the raw pressure, temperature and voltage values from the UUMA and compensates to provide a true pressure reading to the accuracy as specified in Section 17.
FXTH870x6Sensors86 Freescale Semiconductor, Inc.Figure 57. Data Flow For Measurements
FXTH870x6SensorsFreescale Semiconductor, Inc. 8710.7 Thermal ShutdownWhen the package temperature becomes too low or too high the MCU can be placed into a STOP mode to suspend operation and prevent transmission of RF signals which may be corrupted at the temperature extremes. Return to normal operation after the temperature falls back within the recovery temperature range. The presence of either the low or high temperature shutdown will disable the PWU from causing either a periodic wakeup or a periodic reset. The MCU, temperature sensor and ADC10 are all functional over the full temperature range from TL to TH.10.7.1 Low Temperature ShutdownLow temperature shutdown is achieved using temperature readings taken by the ADC10 as described in Section 10.2 and enabling the thermal restart circuit by setting the TRE bit and selecting the low temperature threshold by clearing the TRH bit. When the software programmed low temperature is reached the MCU will turn off all operating functions and enter the STOP1 mode.10.7.2 High Temperature ShutdownThe high temperature shutdown level is determined from a measurement of the temperature sensor by the ADC10 as described in Section 10.2 and enabling the thermal restart circuit by setting the TRE bit and selecting the high temperature threshold by setting the TRH bit. When the software programmed high temperature is reached the MCU will turn off all operating functions and enter the STOP1 mode.10.7.3 Temperature Shutdown RecoveryThe MCU can be restarted by the Temperature Restart (TR) module when the temperature returns within the normal temperature range, TRESET. When this occurs the MCU will be reset and begin execution from the reset vector located at $DFFE/$DFFF. The TR module can be enabled using the TRE bit in the SIMOPT1 register. The TR module can be powered on and off by setting or clearing the TRE bit located at bit 3 in the SIMOPT1 register at address $1802. The TRE bit is cleared by an MCU reset.When the TRE bit is set the TR module can then be set to detect a recovery from either a high temperature or a low temperature using the TRH in the SIMOPT1 register. The TRH bit is cleared by an MCU reset.The TR module does not activate an MCU restart and reset unless it has first moved outside the re-arming temperature range, TREARM, as shown in Figure 58. The status of the TR can be checked by reading the TRO bit located at bit 0 in the SIMTST register at address $180F. The TRO bit is set high by an MCU reset. The state of the TRO bit is as follows:1 = TR module is outside the TREARM temperature range and will restart the MCU if the TRE bit is set and temperature falls back within the TRESET temperature range.0 = TR module is within the TRESET temperature range and the MCU cannot be armed to restart when temperature falls back to the TRESET range. The TRE bit cannot be set.Figure 58. Temperature Restart ResponseTRO = 1TRO = 0TRESETTREARMTROTEMPERATURESHUTDOWNSHUTDOWN ACTIVETREARML TREARMHTRESETL TRESETHTRH = 1TRH = 0
FXTH870x6Sensors88 Freescale Semiconductor, Inc.This sequence is further explained by the user software flowchart in Figure 59.Figure 59. Flowchart for Using TR Module
FXTH870x6SensorsFreescale Semiconductor, Inc. 8911 Periodic Wakeup TimerThe periodic wakeup timer (PWU) generates a periodic interrupt to wakeup the MCU from any of the STOP modes. It also has an optional periodic reset to restart the MCU. It is driven by the LFO oscillator in the RTI module which generates a clock at a nominal one millisecond interval. The LFO and the wakeup timer are always active and cannot be powered off by any software control. The control bits are set so that there is either a periodic wakeup, a periodic reset, or both a wakeup interrupt and a periodic reset. No combination of control bits will disable both the wakeup interrupt and the periodic reset. In addition, there is no hardware control that can mask a wakeup interrupt once it is generated by the PWU.11.1 Block DiagramThe block diagram of the wakeup timer is shown in Figure 60. This consists of a programmable prescaler with 64 steps that can be used to adjust for variations in the value of the LFO period. Finally there are two cascaded programmable 6-bit dividers to set wakeup and/or reset time intervals.Figure 60. Wakeup Timer Block DiagramThe wakeup divider (PWUDIV) register selects a division of the incoming 1 ms clock to generate a wakeup clock, WCLK. The WCLK frequency can be calibrated against the more precise external oscillator using the TPMS_LFOCOL firmware subroutine as described in Section 14. This subroutine turns on the RFM crystal oscillator and feeds a 500 kHz clock to the TPM1 for one cycle of the LFO. The measured time is used to calculate the correct value for the WDIV[5:0] bits for a WCLK period of 1 second. The TPMS_LFOCOL subroutine cannot be used while the RFM is transmitting or the TPM1 is being used for another task.The wakeup time register (PWUSC0) selects the number of WCLK pulses that are needed to generate a wakeup interrupt to the MCU. The periodic reset register (PWUSC1) selects the number of wakeup pulses that are needed to generate a periodic reset of the MCU. Both the wakeup time counter and the periodic reset timer are incrementing counters that generate their interrupt or reset when the desired count is reached and are then reset to zero. Reading the status of either of these counters will return a zero content if done immediately after the interrupt or reset is generated.If both the reset and the interrupt occur on the same clock cycle the reset will have precedence and the interrupt will not be generated.In order to prevent wakeup or reset from an extreme temperature event both the wakeup interrupt or periodic reset are disabled if the thermal restart is activated and the TRO bit indicates that the device is still outside of the TRESET range. The wakeup and periodic reset counters will still run. The state of these counters can be read using the PSEL bit in the PWUS register.The wakeup interrupt (WUKI) cannot be masked by clearing the I-bit.CONTROLLOGICLFO 6-BITWAKEUPWUFPROGRAMMBLEPRESCALERWDIV[5:0] WUT[5:0]WUKIPRST[5:0]DIVIDER6-BITPERIODICRESETWCLK RCLKDIVIDERPRFPRSTWUFAKTROPRFAKTRE
FXTH870x6Sensors90 Freescale Semiconductor, Inc.11.2 Wakeup Divider Register - PWUDIVThe PWUDIV register contains six bits to select the division of the incoming 1 ms clock period as described in Figure 61.11.3 PWU Control/Status Register 0 - PWUCS0The PWUCS0 register contains six bits to select the division of the incoming WCLK clock period and provide interrupt flag and acknowledge bits as described in Figure 62. The period of the resulting interrupt also generates the clock, RCLK, for the periodic reset timing.$0038 Bit 7 654321Bit 0R0 0 WDIV[5:0]WRESET: ————————POR: 00011111= ReservedFigure 61. PWU Divider Register (PWUDIV)Table 54. PWUDIV Register Field DescriptionsField Description7:6UnusedUnused5:0WDIV[5:0]Wakeup Divider Value — The WDIV[5:0] bits select an incoming prescaler for the incoming 1 ms clock period from 504 to 1512. This results in a clocking of the 6-bit wakeup divider at rates from a nominal 0.504 to 1.512 sec per wakeup clock, WCLK. The user can use this prescaler to fine tune the wakeup time based on the variation in the LFO frequency. The conversion from the decimal value of the WDIV bits to the nominal WCLK period is given as:A power on reset presets these bits to a value of $1F (decimal 31) which yields a nominal 1 second output period for WCLK. Other resets have no effect on these bits.$0039 Bit 7 6 5 4 3 2 1 Bit 0RWUF 0WUT[5:0]WWUFAKRESET: 0—111111Figure 62. PWU Control/Status Register 0 (PWUCS0)Table 55. PWUSC0 Register Field DescriptionsField Description7WUFWakeup Interrupt Flag — The WUF bit indicates when a wakeup interrupt has been generated by the PWU. This bit is cleared by writing a one to the WUFAK bit. Writing a zero to this bit has no effect. Reset clears this bit.0 Wakeup interrupt not generated or was previously acknowledged.1 Wakeup interrupt generated.6WUFAKAcknowledge WUF Interrupt Flag — The WUFAK bit clears the WUF bit if written with a one. Writing a zero to the WUFAK bit has no effect on the WUF bit. Reading the WUFAK bit returns a zero. Reset has no effect on this bit.0 No effect.1 Clear WUF bit.tWCLK 504 16 WDIV+fLFO-------------------------------------------------=
FXTH870x6SensorsFreescale Semiconductor, Inc. 91 11.4 PWU Control/Status Register 1 - PWUCS1The PWUSC1 register contains six bits to select the division of the incoming RCLK clock period and provide interrupt flag and acknowledge bits as described in Figure 63.5:0WUT[5:0]WUF Time Interval — These control bits select the number of WCLK clocks that are needed before the next wakeup interrupt is generated. The count gives a range of wakeup times from 1 to 63 WCLK clocks.Depending on the value of the bits for the WDIV[5:0] this time interval can nominally be from 1 to 63 seconds in 1 second steps. Whenever the WUT[5:0] bits are changed the timeout period is restarted. Writing the same data to the WUT[5:0] bits has no effect.Writing zeros to all of the WUT[5:0] bits forces the wakeup divider to a value of $3F and disables the wakeup interrupt. However, writing all zeros to the WUT[5:0] bits is inhibited if all of the PRST[5:0] bits are already cleared to zero. This prevents disabling both the periodic wakeup and the periodic reset at the same time. See Table 56.The WUT[5:0] bits are preset to a value of $3F (decimal 63) by any resets.Table 56. Limitations on Clearing WUT/PRSTControl Bits State of Control Bits Control Bits to be Cleared Resulting Action Resulting Wakeup Interrupt Resulting Periodic ResetWUT[5:0] non-zero PRST[5:0] Allowed Enabled(1)1. Using previous values.Disabledall zero Inhibited Disabled(2)2. Wakeup divider preset to $3F.Enabled(1)PRST[5:0] non-zero WUT[5:0] Allowed Disabled Enabled(1)all zero Inhibited Enabled(1) Disabled$003A Bit 7 6 5 4 3 2 1 Bit 0RPRF 0PRST[5:0]WPRFAKRESET: 00111111= ReservedFigure 63. PWU Control/Status Register 1 (PWUCS1)Table 57. PWUSC1 Register Field DescriptionsField Description7PRFPeriodic Reset Flag — The PRF bit indicates when a periodic reset has been generated by the PWU. MCU writes to this bit have no effect. This bit is cleared by writing a one to the PRFAK bit. This bit is cleared by a power on reset, but is unaffected by other resets.0 Periodic reset not generated or previously acknowledged.1 Periodic reset generated.6PRFAKAcknowledge PRF Interrupt Flag — The PRFAK bit clears the PRF bit if written with a one. Writing a zero to the PRFAK bit has no effect on the PRF bit. Reading the PRFAK bit returns a zero. Reset has no effect on this bit.0 No effect.1 Clear PRF bit.5:0PRST[5:0]Periodic Reset Time Interval — These control bits select the number of wakeup interrupts that are needed before the next periodic reset is generated. The decimal count gives a range of periodic reset times from 1 to 63 wakeup interrupts. Depending on the value of the bits for the WDIV[5:0] and WUT[5:0] this time interval can nominally be from 1 second to 66 minutes with steps from 1 to 63 seconds. Whenever the PRST[5:0] bits are changed the timeout period is restarted. Writing the same data to the PRST[5:0] bits has no effect.Writing zeros to all of the PRST[5:0] bits forces the periodic reset to be disabled if at least one of the WUT[5:0] bits is set to a one. This assures that there will be at least a wakeup interrupt. However, writing all zeros to the PRST[5:0] bits is inhibited if all of the WUT[5:0] bits are already cleared to zero. This prevents disabling both the periodic wakeup and the periodic reset at the same time. See Table 56. The PRST[5:0] bits are preset to a value of 63 by any resets.Table 55. PWUSC0 Register Field Descriptions (continued)Field Description
FXTH870x6Sensors92 Freescale Semiconductor, Inc.11.5 PWU Wakeup Status Register - PWUSThe PWUS register shows the current status of the two PWU counters as described in Figure 63. The counter contents are captured when the register is read.11.6 Functional ModesPWU module will work in each of the MCU operating modes as follows:11.6.1 RUN ModeIf the module generates a wakeup interrupt the PC (Program Counter) will be redirected to the wakeup timer interrupt vector. The WUF flag will be set to indicate wakeup timer interrupt; write 1 to WUFACK to clear this flag.If the module generates a reset the PC will be redirected to the reset vector. The PRF flag will be set to indicate periodic reset; write 1 to PRFACK to clear this flag.All registers will continue to hold their programmed values after interrupt or reset is taken.11.6.2 STOP4 ModeIf the module generates a wakeup interrupt the bus and core clocks will be restarted and the PC will be redirected to the wakeup timer interrupt vector. The WUF flag will be set to indicate wakeup timer interrupt, write 1 to WUFACK to clear this flag.If the module generates a periodic reset the bus and core clocks will be restarted and the PC will be redirected to the reset vector. The PRF flag will be set to indicate periodic reset; write 1 to PRFACK to clear this flag.All registers will continue to hold their programmed values after interrupt or reset is taken.11.6.3 STOP1 ModeIf the module generates a wakeup interrupt the module will cause the MCU to exit the power saving mode as a POR. MCU will have the wakeup interrupt pending and once CLI opcode is executed PC will be redirected to wakeup interrupt vector address. The WUF flag will be set to indicate wakeup timer interrupt, write 1 to WUFACK to clear this flag.If the module generates a periodic reset the module will cause the MCU to exit the power saving mode as a POR. The PRF flag will be set to indicate periodic reset; write 1 to PRFACK to clear this flag. The SRS register will have just the POR bit set. In this STOP mode exit all registers will continue to hold their programmed values.11.6.4 Active BDM/Foreground CommandsThe PWU is frozen in ACTIVE BACKGROUND mode or executing foreground commands, so PWU counters will also be stopped. Normal PWU operation will resume as MCU exits BDM or foreground command is finished.$001F Bit 7 6 5 4 3 2 1 Bit 0RPSEL 0CSTATWRESET: 0 ———————= ReservedFigure 64. PWU Wakeup Status Register (PWUS)Table 58. PWUS Register Field DescriptionsField Description7PSELPage Selection — The PSEL read/write bit selects whether the other bits are read from the WUT or PRST counters. This bit is cleared by a power on reset that is not created by an exit from the STOP mode, but is unaffected by other resets.0 CSTAT = WUT counter status1 CSTAT = PRST counter status6unused Unused — An unused bit that always reads as a logical zero.5:0CSTATCounter Status — These read-only bits show the status of the counter selected by the PSEL bit. The effects of any reset on these bits depends on how the reset affects the selected counter. Reading these counters immediately after a WUF or PRF generated flag will return zero contents.
FXTH870x6SensorsFreescale Semiconductor, Inc. 9312 LF ReceiverThe low-frequency receiver (LFR) is a very low-power, low-frequency, receiver system for short-range communication in TPMS. The module allows an external coil to be connected to two dedicated differential input pins. In TPMS systems a single coil may be oriented for optimal coupling between the receiver in the tire or wheel and a transmitter coil on the vehicle body or chassis.This LFR system minimizes power consumption by allowing flexibility in choosing the ratio of on to off times and by turning off power to blocks of circuitry until they are needed during signal reception and protocol recognition. In addition, this LFR system can autonomously listen for valid LF signals, check for protocol and ID information so the main MCU can remain in a very low power standby mode until valid message data has been received.The LFR can be configured for various message protocols and telegrams to allow it to be used in a broad range of applications. The message preamble must be a series of Manchester coded bits at the nominal 3.906-kbps data rate. A synchronization pattern is used to mark the boundary between the preamble and the beginning of Manchester encoded information in the message body. The synchronization pattern is a non-Manchester specific TPMS pattern. Messages can optionally include none, an 8-bit or a 16-bit ID value. Messages may contain any number of data bytes with the end-of-message indicated by detecting an illegal Manchester bit at a data byte boundary.It is not intended that LFR may be actively receiving/decoding LF signals while physical parameter measurements are being made; or during the time that the RFM may be actively powered up and/or transmitting RF data. The resulting interactions will degrade the accuracy of the LF detection.Figure 65. Block DiagramFor definitions of the acronyms and detailed descriptions of the bits and/or byte registers, please refer to Section 12.17.Rectifier3DataSlicer1kHz_clockCarrierDetectorMFO32kHzClampRVRVRVLFALFB1 kHz_clock Typ129 kHzTy pClamp Rectifier0 Rectifier1 Rectifier2Amp1SensitivityBuff1 Amp3Amp2 Buff3Buff2Vref_sensitivityCarrierDetectorLogic Block 1:- On/Off cycling- Carrier DetectionLogic Block 2: - Data decodingDataSlicerAverageFilterSummator
FXTH870x6Sensors94 Freescale Semiconductor, Inc.12.1 FeaturesMajor features of the LFR module include:• Differential input LF detector (two dedicated pins):— Selectable sensitivity (two levels: Low Sens (LS) and High Sens (HS)).— Thresholds trimmed at the factory with trim setting saved in nonvolatile memory.— LFR has a reference oscillator (LFRO) trimmed at the factory with trim setting saved in nonvolatile memory.— Selectable signal sampling time interval and on-time.— Sample interval and on times controlled by LFR state machine or directly by the MCU.• Configurable receive mode:— Simple LF carrier detection/Telegram decode. (CARMOD)• Configurable message protocol (telegram structure):— Various SYNC decoding (SYNC[1:0])6-bit time SYNC requirements7.5-bit time SYNC requirements9-bit time SYNC requirements— Optional ID (ID[1:0])8-bit or 16-bit ID On or off— 0-n bytes of message data. End-of-data marked by loss of Manchester at a byte boundary.• Optional continuous monitoring and decode of the LF detector.• Selectable MCU interrupt when a received data byte is ready in an LFR buffer, when a Manchester error is detected in the frame, when an ID is received or when a valid carrier has been detected.12.2 Modes of OperationThe LFR is a peripheral module on an MCU. After being configured by application software, the LFR can operate autonomously to detect and verify incoming LF messages. When a valid message or carrier pulse is received and verified the LFR can wake the MCU from standby modes to read received data or act upon a carrier detection.The primary modes of operation for the LFR are:• Disabled. Everything off and drawing minimal leakage current. LFR register contents will be retained.• Carrier detect/listen. Minimum circuitry enabled to detect any incoming LF signal, check it for the appropriate signal level, frequency and duration.• TPMS protocol verification.• Data reception.12.3 Power ManagementIn addition to using low power circuit design techniques, the LFR module provides system-level features to minimize system energy requirements. In an MCU that includes the LFR module, all MCU circuitry except a very low current 1-kHz oscillator (LFO) and minimum regulator circuitry can be disabled. After a reset, the MCU would initialize the LFR module and then enter a very low power standby mode (depending upon the MCU, this could be lower than 1 uA for the MCU portion). The LFR module includes everything it needs to periodically listen for LF messages, perform Manchester decoding, verify the message telegram, and assemble incoming data into 8-bit bytes. The LFR does not wake the MCU unless a valid message is being received and a data byte is ready to be read.The LFR cycles between an off state, where everything is disabled, and an on state, where it listens for a carrier signal. The on time is controlled by LFONTM[3:0] control bits in the LFCTL2 register. The time between the start of each sample on time is controlled by LFSTM[3:0] control bits in the LFCTL2 register. Even lower duty cycles can be achieved by using the MCU to wake once per second and maintain a software counter to delay for an arbitrarily long time before enabling the LFR to perform a series of carrier detect cycles.Within the LFR, circuits remain disabled until they are needed. When the LFR is listening for a carrier signal, only a 1-kHz clock source, a portion of the input amplifier and a periodic auto-zero are running. After a carrier signal is detected, with high enough amplitude, frequency and duration the LFRO oscillator is enabled so the LFR can begin to decode the incoming information.The LFR module has a power up settling time of 2-LFO period before any active operations. In the ON/OFF cycle, those 2 ms are hidden in the sampling time during the off time.
FXTH870x6SensorsFreescale Semiconductor, Inc. 9512.4 Input AmplifierThe LFR module receives LF modulated signals through a dedicated differential pair of inputs which is connected to an external coil. The enable control (LFEN) allows the user to enable the LF input depending on the application requirements. The SENS[1:0] bits in the LFCTL1 register allows the user to select one of two input sensitivity thresholds which determines the signal level required before the input carrier will be detected. The sensitivity setting is used during carrier detection but does not affect reception after the carrier has been detected. When the CARMOD bit is cleared, after a carrier with sufficient amplitude, frequency and duration has been detected the output stage of the amplifier is turned on to allow data reception.12.5 LFR Data Mode StatesThe modes of operation the LFR state machine will sequence as shown in Figure 66.12.6 Carrier DetectCarrier detection includes a check for a certain number of edges on a signal that is greater than the input sensitivity threshold. During the check for carrier edges, only the 1kHz low frequency oscillator (LFO) clock source is running so power consumption remains very low. During carrier detection the incoming signal is amplified and passed through a sensitivity threshold comparator. The SENS[1:0] bits in the LFCTL1 register selects two levels of sensitivity and determines the signal amplitude that is needed to allow edges to be seen at the output of the sensitivity threshold comparator. When a carrier is above this threshold, a block is powered on and validates the carrier. This frequency and duration check function can be disabled by clearing the VALEN bit. If VALEN is set, the block checks for the carrier duration and the carrier frequency. The time needed to validate a carrier is programmed by the LFCDTM register. The carrier frequency should be 125 kHz. If the signal above the threshold is not within the frequency range or not present during enough time, then the carrier will not be validated and the validation block will turn off.If no carrier signal is validated within the on time of the LFR, the state machine returns to the off state and the alternating cycle of on time and off time continues. Carrier edge counts start at zero when a new on time begins. In the data mode (CARMOD = 0), if the required number of carrier edges are detected before the end of the ON time, the LFR will remain ON to complete the reception of a message telegram.In the carrier detect mode (CARMOD = 1) there is no need to enable other LFR circuitry to evaluate any other message components after the required number of carrier edges are detected. One or several consecutive carriers can be validated by this process before the LFCDF flag is set. The LFCC control bits are used to program the number of consecutive ON times where a complete carrier validation is needed before interrupting the MCU. In this case, the LFCDF flag is set and, provided the LFCDIE interrupt enable is also set, an interrupt is issued to wake the MCU. In carrier detect mode, the LFCDIE control bit should always be set because the intended purpose of the carrier detect mode is to wake the MCU when a carrier is detected. When LFCDF is set, the LFR waits until it is cleared before it continues the alternating cycle of on time and off time, starting with an off time.In data mode, when a carrier is detected the averaging filter is powered on and the LFR continues to the next state to look for the rest of a message telegram; and the LFR module will search for valid SYNC word (with length programmed through the SYNC bits in the LFCTL3 register depending on preamble type). If the external LF field is not a TPMS frame, a timeout will turn off the LFR module. This timeout can be program through TIMOUT bit the LFCTL4 register.
FXTH870x6Sensors96 Freescale Semiconductor, Inc.Figure 66. FXTH870x6 LFR State Machine Diagram/)(1 2565(6DWDQ\VWDWH 'LVDEOHG121212(UURU<(672*02'/)(1 12/)&')<(6$QDORJSRZHUXS6LJQDODERYHWKUHVKROG$1'9$/(1 6LJQDODERYHWKUHVKROG$1'9$/(1 6QLIIIRUFDUULHU)UHTXHQF\DQGGXUDWLRQFKHFN:DLW2))WLPH 7VDPSOLQJ7RQ2))WLPHFRPSOHWHG,QYHUW&$502')UHTXHQF\DQG/)&'70GXUDWLRQ2.21WLPHFRPSOHWHG6WDUW7LPHRXW6WDUWDQDORJGHPRGFKDLQ&$502' $1''(&(1 5LVHFDUULHUGHWHFWIODJ6WDUWDQDORJGHPRGHFKDLQ&$502' ,QFUHPHQW&DUULHU&RXQWHU&DUULHUFRXQWHU /)&&&DUULHUFRXQWHU"/)6&&&RQWLQXRXVO\215LVHFDUULHUGHWHFWIODJ12<(612<(6,QYHUW&$502''DWD5HDG\IODJ7LPHRXW6<1&'HWHFWHG'HFRGH,':URQJ,'&RUUHFW,'5LVH,'IODJ5LVHHUURUDQG(20IODJV'HFRGH'DWDELWUHFHLYHG5LVH'DWD5HDG\IODJ5LVH29)IODJV(UURULQILUVWELW(UURULQILUVWELW5LVHHUURUIODJ(UURU<(62102'(<(67'(&&RQWLQXRXVO\2121WLPHFRPSOHWHG12/)2F\FOHV12:DLW7VDPSOLQJ<(67VDPSOLQJFRPSOHWHG&$502' $1''(&(1 &DUULHUYDOLGDWHG72*02'738 /)2F\FOHV6ZLWFKRII21WLPHFRPSOHWHG6HDUFKIRU6<1&1R6<1&'HWHFWHG,'QRWFRPSOHWH<(6/)&'70QRWUHDFKHG1RVLJQDODERYHVHQVLWLYLW\WKUHVKROG)UHTXHQF\HUURU
FXTH870x6SensorsFreescale Semiconductor, Inc. 9712.7 Auto-Zero SequenceAn auto-zero sequence is performed periodically on the input amplifier to cancel offset errors. During reception of the SYNC pattern and body of the message, auto-zero operations are synchronized to data edges of the incoming signal to avoid interfering with normal reception. During the auto-zero sequence, the input amplifier is temporarily disconnected from the external coil and connected to ground. The auto-zero sequence takes roughly 64 sec. It is performed at each LFO period in carrier mode and on one over four decoded data edges in data mode.When the DECEN bit is cleared, the auto-zero sequence is performed at each LFO period. During the 64 sec of the auto-zero sequence, the receiver is holding the state “0” or “1”' previously decoded. Since the LFR receiver is not active during this time, the possible data-rate that the analog can detect is at least limited by this duration.12.8 Data RecoveryRectified signals from the amplifier output are connected to the input of an averaging filter and data slicer. The slicer thus compares the rectified signal with its own average value to decode the data. When a carrier is present, the slicer output voltage rises and when the carrier stops the slicer output voltage falls. The output of this comparator provides a binary digital signal that indicates whether the carrier is present or not. This digital signal is connected to the data clock recovery circuit, the SYNC detect circuit, and the Manchester decoder circuit.The Manchester decoder uses the digital output of the data slicer to detect the logic level of each incoming data bit and to synchronize the decoder state machine. The LFPOL polarity bit in the LFCTRLA register selects the expected encoding of the Manchester data bit.If a strong signal (above roughly 100 mV p-p differential) is entered into the LFR, the input impedance will switch instantaneously to a lower programmed value (the LOWQ[1:0] bits in the LFCTRLC) and be maintained during the current data packet if the DEQEN bit is set. At the next ON time, the default high input impedance will be set again. The strong signal detection and the automatic impedance change can be disabled by clearing the DEQEN bit.12.9 Data Clock Recovery and SynchronizationData clock recovery and synchronization takes place during the SYNC portion of an incoming message. The preamble must be modulated Manchester data. The type of required SYNC pattern determines the allowed preamble type depending on the SYNC[1:0] control bits.The design data rate is 3.906 kbps which gives a bit time equivalent to about 32 cycles of the LF carrier frequency. In a Manchester encoded bit time, the carrier should be present for either the first half or the second half of the bit time depending on whether the bit is a logic zero or a logic one.The LFRO clock source is 32 times the target data rate. The LFRO is used for decoding data and also sequencing auto-zero operations.12.10 Manchester DecodeWhen the LFPOL bit is clear, a logic one bit is defined as no LF carrier present for the first half of the bit time; and a logic zero bit is defined as LF carrier present for the first half of the bit time as shown in Figure 67. Another way to say this from the point of view of the data slicer output is that a logic zero bit has a falling edge at the middle of the bit time and a logic one bit has a rising edge at the middle of the bit time. The data slicer threshold is dynamically adjusted to the midpoint between the carrier-present and no-carrier levels at the summing node for the rectified output of the LF input amplifier.
FXTH870x6Sensors98 Freescale Semiconductor, Inc.Figure 67. Manchester Encoded Datagram for LFPOL = 0When the LFPOL bit is set, a logic one bit is defined as LF carrier present for the first half of the bit time; and a logic zero bit is defined as no LF carrier present for the first half of the bit time as shown in Figure 68.Figure 68. Manchester Encoded Datagram for LFPOL = 112.11 Duty-Cycle For Data ModeThe definition of the duty-cycle for the Manchester encoded data depends on the relative rise and fall times of the incoming LF carrier as shown in Figure 69.Figure 69. Definition of Duty-Cycle of 40%Regarding the SYNC pattern which is non-Manchester coded, the duty cycle is applied on all falling edges with the same proportion as a 1T Manchester symbol, as shown in Figure 70.T0.5TT0.5TLF InputLogic “1” Logic “0”Data BitData Slicer Threshold(shaded areais LFcarrier)(data sliceroutput)T = 1 Bit Time at the data rate (ex. 256 us at data rate of 3.906 kbps)T0.5TT0.5TLF InputLogic “0” Logic “1”Data BitData Slicer Threshold(shaded areais LFcarrier)(data sliceroutput)T = 1 Bit Time at the data rate (ex. 256 s at data rate of 3.906 kbps)4060601040
FXTH870x6SensorsFreescale Semiconductor, Inc. 99Figure 70. Impact of Duty-Cycle on SYNC Pattern12.12 Input Signal EnvelopeThe combination of the external LF antenna and any external components as shown in Figure 71 should not significantly filter the envelope of the LF carrier as shown in Figure 72. Excessive filtering will cause the received message error rate (MER) to increase.Figure 71. Antenna Q-factor Equivalent Model for the LF EnvelopeFigure 72. LF Envelope FilteringLFALFBSUZUKAAntenna modelCR• Antenna Q-factor acts as a 1st order low pass filter on the LF envelop• Filter time constant : t= R.CRecommended< 15.3 secRecommended< 15.3 sec
FXTH870x6Sensors100 Freescale Semiconductor, Inc.12.13 Telegram VerificationThe LFR has control bits to allow flexibility in the telegram format and protocol to allow the LFR to adapt to a variety of systems. The LFR can operate in a normal data receive mode where it receives complete telegrams, or in a carrier detect mode where it only checks for a carrier. In the carrier detect mode, as soon as a carrier is detected, the LFCDF flag is set. If LFCDIE is also set, an interrupt request is sent to wake the MCUThe format of the complete Manchester encoded datagram is comprised of a Manchester data preamble (series of Manchester 1’s or 0’s), a synchronization period, an optional ID, and zero to n data bytes. The synchronization period can be used for synchronizing the beginning of the data packet. The SYNC pattern that follows the preamble can be either a 6-, 7.5- or 9 bit-time non-Manchester pattern as shown in Figure 73.Figure 73. SYNC PatternsThese patterns would normally not appear anywhere in the Manchester encoded portion of a message so there is no possibility that the LFR could accidentally synchronize to a message that was already in progress when the LFR started listening for a message. These patterns are also complex enough so that it is very unlikely that noise or interference could be mistaken for these SYNC patterns. In the data mode and after the detection of a valid carrier, the LFR will decode the data stream waiting for the SYNC word. Should this carrier not be an accepted TPMS type, no SYNC will be received and the LFR module will stay in data receive mode forever. A timeout counter is thus started after a carrier detection and will stop the receiver if reaching the programmed value selected by the TIMOUT[1:0] bits in the LFCTL4 register. This timeout counter is clocked by the internal LFRO clock.The LFR can be configured to have an optional 0, 8-bit or 16-bit ID after the SYNC pattern. If the ID value matches the received ID, the message is accepted. The ID value can be used to identify a specific receiver, a message type, or some other identifier as defined by application software.Any number of data bytes can be included after the ID. The LFR begins to assemble data bytes from the incoming signal as soon as the ID check is complete. If the first bit-time after the last bit of the ID does not conform to Manchester coding requirements, the LFR considers the message complete and terminates the LFR operation without setting the data ready flag (LFDRF). If data follows the ID, it is serially received and when 8 bits have been received the LFR copies this byte into the LFDATA register and sets the LFDRF flag. If the LFDRIE interrupt enable is also set (and it should be), an interrupt request is sent to wake the MCU so it can read the data and process it according to the instructions in the application program. Additional bytes are received until a bit time that is not Manchester encoded is found. If a non-Manchester bit time is found, the LFERF bit will be set and indicates a Manchester coding error. If this happens on the first bit of the next byte of the message the LFEOMF bit will also be set. The preamble is a period of Manchester bits before the SYNC pattern as shown in Figure 74. The SYNC pattern will only be matched for the bit times specified by the SYNC[1:0] control bits. Depending on the expected SYNC pattern the allowed preambles is as described for the SYNC[1:0] bits in the LFCTL3 register.TTTT2T 2T1.5TTTTT2T 2T1.5T3T TTTT2T 2T6-bit(6T)Pattern7.5-bit(7.5T)Pattern9-bit(9T)PatternSYNC[1:0] = 01SYNC[1:0] = 10SYNC[1:0] = 11
FXTH870x6SensorsFreescale Semiconductor, Inc. 101Figure 74. Telegram Format (Carrier Preamble)12.14 Error Detection and HandlingWhen the DECEN bit is set, LFR messages are monitored for data rate or SYNC errors, incorrect message ID, and Manchester coding errors. When an error is detected the LFR goes back to sniff mode until the end of ON time completion, if ONMODE is set; or turns off until the start of the next scheduled sampling interval, if ONMODE is cleared. Because the MCU uses more power than the LFR module, it is desirable to keep the MCU in low power standby modes as much as possible. Therefore the handling of these errors will be performed by the LFR and not require additional software processing by the MCU.When the DECEN bit is clear, there is no monitoring on data. The MCU needs to poll the state of the LFDO bit and create its own decoding scheme within software on the detected signal. To be able to start the polling only when data are received, the carrier detection flag is enabled in data mode when DECEN = 0. During data reception, the auto-zero sequence is performed at each LFO period. The MCU needs also to determine the end of the telegram and turn off the LFR (LFEN = 0) during two LFO cycles before any other operations.12.15 Continuous ON ModeIn the Continuously ON mode, the LFR module will remain on continuously while the LFEN bit is set. The Continuously ON mode is controlled by setting the LFSTM[3:0] bits.In the Continuously ON mode, if a signal is successfully processed by the digital, the LFR module will stop and restart automatically. The gap is 2-3 LFO periods. Also if TOGMOD bit is set, the LFR module will stop after the ON time cycle and re-start automatically, after having changed the CARMOD bit.12.16 Initialization InformationWhen power is applied to the MCU, the LFR must be initialized and configured before it can begin to receive LF messages. Several systems in the LFR require factory trimming to ensure operation within specified limits. After these trim values are written, they remain constant until the next MCU reset.The application program must set up control bits and registers to configure the LFR to determine the structure of the message telegram, the input sensitivity, and other LFR options. It is good practice to clear the flags in the LFS register before enabling interrupt sources in order to avoid any immediate interrupt requests.PREAMBLE SYNC HIGH ID DATA DATA6, 7.5 or 9T 0, 8T or 16T 8TtLFPRE IDSEL[1:0] Repeat for 0-n bytesLOW ID
FXTH870x6Sensors102 Freescale Semiconductor, Inc.12.17 LFR Register DefinitionThe LFR module uses eight addresses in the MCU memory map for data, control, and status registers.This section consists of register descriptions. Each control register (LFCTLx) should be modify when the LF is off (LFEN = 0). Modification of the control registers “on-the-fly” might lead to unknown state. Each turn off of the LFR (LFEN = 0) should be followed by at least two LFO cycles before trying to restart the LFR (LFEN = 1).12.17.1 LF Control Register 1 (LFCTL1)LFCTL1 contains the main LF enable control, detection protocol format controls, and input sensitivity controls. The LFCTL1 register also contains a register select bit, LPAGE. $0020 Bit 7 6 5 4 3 2 1 Bit 0RLFEN 0CARMOD LPAGE IDSEL[1:0] SENS[1:0]WSRESReset: 00000000Figure 75. LFR Control Register 1 (LFCTL1)Table 59. LFCTL1 Register Field DescriptionsField Description7LFENLF Enable — This read-write control bit is used to enable or disable the LF receiver. Once this bit is set the LFR will go through a power-up sequence that starts on the next rising edge of the LFO clock. The first complete cycle of the LFO is used to power up the LFR circuits. Following this startup time the auto-zero sequence is performed for 64sec and then the LFR is ready to receive signals.0 LF receiver in standby.1 LF receiver active.Note: Enabling the LF receiver function disables the GPIO Port B functions - see Section 6.5.6SRESSoft Reset — This read/write bit controls the soft reset of the LFR. The bit is self reset and always reads as a logical zero.0 Reset completed1 Start a soft reset.5CARMODCarrier Mode — This read/write control bit selects the basic operating mode for the LFR.0 Data receive mode.1 Carrier detect mode - wake the MCU when a carrier signal is detected if LFCDIE is set.4LPAGELFR Page Select — This read/write bit is used is used to select the register page access. The LPAGE bit has no effect on the LFCTL1 and LFCTL2 registers. This bit is cleared by LFR reset.0 Access page 0.1 Access page 1.3:2IDSEL[1:0]Wakeup ID Selection — Selects the existence and length of the wakeup ID. Reset clears these bits.00 No ID expected01 8-bit ID based on the contents of the LFIDL register10 16-bit ID based on the contents of the LFIDH and LFIDL registers11 8-bit ID matches the contents of either the LFIDH or LFIDL registers1:0SENS[1:0]Sensitivity Control — These two read/write control bits select the sensitivity thresholds for the LFR input. These thresholds apply to the detection portion of a message. If the input level is below the SNODET_x level, no signal will be detected. If the level is above SDET_x, the signal will be detected. Sensitivity settings are only used in the carrier detect path and do not affect reception of the message body.00 Performance not specified.01 Low sensitivity (SDET_L; SNODET_L)10 High sensitivity (SDET_H; SNODET_H)11 Performance not specified.
FXTH870x6SensorsFreescale Semiconductor, Inc. 10312.17.2 LF Control Register 2 (LFCTL2)LFCTL2 contains the selection bits for the length of the LF sampling ON time and the time interval between samples as shown in Figure 76.$0021 Bit 7 6 5 4 3 2 1 Bit 0RLFSTM[3:0] LFONTM[3:0]WReset: 01100000Figure 76. LFR Control Register 2 (LFCTL2)Table 60. LFCTL2 Register Field DescriptionsField Description7:4LFSTM[3:0]LF Sampling Time Interval Select— These read/write control bits select the length of time between when the LFR input detector is turned on as set by the LFONTM bits in LFCTL2 register. The initial sampling interval starts with the LFO clock following a write to these bits. A reset of the LFR results in the value being set to binary 0110.0000 Continuous ON mode (see Section 12.15)0001 Sampled decoding mode every 16 LFO clock periods (16 milliseconds nominal)0010 Sampled decoding mode every 32 LFO clock periods (32 milliseconds nominal)0011 Sampled decoding mode every 64 LFO clock periods (64 milliseconds nominal)0100 Sampled decoding mode every 128 LFO clock periods (128 milliseconds nominal)0101 Sampled decoding mode every 256 LFO clock periods (256 millisecond nominal)0110 Sampled decoding mode every 512 LFO clock periods (512 milliseconds nominal)0111 Sampled decoding mode every 1024 LFO clock periods (1024 milliseconds nominal)1000 Sampled decoding mode every 2048 LFO clock periods (2048 milliseconds nominal)1001 Sampled decoding mode every 4096 LFO clock periods (4096 milliseconds nominal)1010-1xxxContinuous ON mode (see Section 12.15)3:0LFONTM[3:0]LF Sampling ON Time Select — These read/write control bits select the length of time that the LFR inputdetector is turned on at the beginning of each sampling interval set by the LFSTM bits. This ON time is the net sampling time with any initialization time (maximum of 2 ms) included in the OFF time prior to the sample ON time (see Figure 77). If a signal is successfully detected, the length of time the detector remains ON depends on the operating mode. In carrier detect mode (CARMOD = 1) the detector will be turned off early if the evaluation of the carrier signal is completed before the end of the scheduled ON time. In data receive mode (CARMOD = 0) the detector will remain ON until the end of the message, an error is detected or timeout occurrence. Reset forces the LFONTM bits to 0:0:0.0000 1 LFO clock cycle (1 millisecond nominal)0001 2 LFO clock cycle (2 milliseconds nominal)0010 4 LFO clock cycle (4 milliseconds nominal)0011 8 LFO clock cycle (8 milliseconds nominal)0100 16 LFO clock cycle (16 milliseconds nominal)0101 32 LFO clock cycle (32 milliseconds nominal)0110 64 LFO clock cycle (64 milliseconds nominal)0111 128 LFO clock cycle (128 milliseconds nominal)1000 256 LFO clock cycle (256 milliseconds nominal)1001 512 LFO clock cycle (512 milliseconds nominal)1010 1024 LFO clock cycles (1024 milliseconds nominal)1011 1024 LFO clock cycles (1024 milliseconds nominal)11xx 1024 LFO clock cycles (1024 milliseconds nominal)Note: The LFONTM selected time must be less than the LFSTM selected time, otherwise the Continuously ON mode is present.
FXTH870x6Sensors104 Freescale Semiconductor, Inc.Figure 77. LF Detector Sampling Timing12.17.3 LF Control Register 3 (LFCTL3)LFCTL3 contains the control bits for the LF sampling interval and the minimum required carrier detection time when using the carrier detect mode.$0022 Bit 7 6 5 4 3 2 1 Bit 0RLFDO TOGMOD SYNC[1:0] LFCDTM[3:0]WReset: —0010000= ReservedFigure 78. LFR Control Register 3 (LFCTL3)Table 61. LFCTL3 Register Field DescriptionsField Description7LFDOLF Detector Output — This read-only bit follows the bit slicer output signal that goes high during the presence of a carrier. It may change at any time. This bit is read only and unaffected by any reset.0 LF detector output low (no signal above threshold)1 LF detector output high (received signal above threshold)6TOGMODLFR Mode Toggle — This read/write bit enables the toggling of the CARMOD bit at each new LFON sequence. Reset clears this bit.0 CARMOD bit does not change and determines detector mode.1 CARMOD bit will be toggled every LFON detection sequence, starting by CARMOD selection.Therefore the reception chain will alternately look for a carrier frame or for a data frame.5:4SYNC[1:0]LF SYNC Selection — Selects the type of SYNC pattern as described in Figure 73. Reset presets these bits to the 01 (6T SYNC) option. Compatible with preamble consisting of minimum 2 ms Manchester data to allow for proper averaging filter operation.00 For factory test purposes, not intended for use in any application.01 6T SYNC pattern10 7.5T SYNC pattern11 9T SYNC patternLFR Detector ActiveLFONTMLFSTMPower UpSettling Time Power UpSettling TimeLFONTMtime segments not to scaletDECLF searching forSYNC pattern
FXTH870x6SensorsFreescale Semiconductor, Inc. 105NOTEThe auto-zero sequence needs to be performed every 1 ms. Therefore LFR detection times of 1024, 2048, 4096 and 8192 sec the auto-zero sequence will be done at each 1 ms interval. This auto-zero sequence lasts for 64 sec. If the carrier is detected again at the end of the auto-zero sequence it is assumed that the carrier was there for the complete 64 sec period of the auto-zero.3:0LFCDTM[3:0]LF Carrier Detect Time — These read/write control bits select the length of time which the LFR input detector must detect a carrier before validating it. In carrier mode (CARMOD = 1), if the carrier is active for at least the time selected by the LFCDTM[3:0] bits and the LFCC counter value is reached, the LFCDF flag in the LFS register will be set; and if the LFCDIE control bit is also set, the MCU will be interrupted (wakeup). In the data receive mode (CARMOD = 0) the LFCDTM[3:0] bits select the length of time which the LFR input detector must detect a carrier before the effective receive chain is powered on. Once the carrier has been validated the LFCDTM[3:0] bits ignored during the decode of the rest of the data.Reset of the LFR results in LFCDTM[3:0] being reset to 0:0:0:0. The resulting carrier detect times are defined by the following number of carrier periods needed to validate the carrier, with the corresponding time for a carrier at 125 kHz in parenthesis:0000 Carrier detect = 8 (64 sec)Data mode detect = 8 (64 sec)0001 Carrier detect = 16 (128 sec)Data mode detect = 8 (64 sec)0010 Carrier detect = 32 (256 sec)Data mode detect = 8 (64 sec)0011 Carrier detect = 64 (512 sec)Data mode detect = 8 (64 sec)0100 Carrier detect = 128 (1024 sec)Data mode detect = 8 (64 sec)0101 Carrier detect = 256 (2048 sec)Data mode detect = 8 (64 sec)0110 Carrier detect = 512 (4096 sec)Data mode detect = 8 (64 sec)0111 Carrier detect = 1024 (8192 sec)Data mode detect = 8 (64 sec)1000 Carrier detect = 8 (64 sec)Data mode detect = 8 (64 sec)1001 Carrier detect = 16 (128 sec)Data mode detect = 16 (128 sec)1010 Carrier detect = 32 (256 sec)Data mode detect = 32 (256 sec)1011 Carrier detect = 64 (512 sec)Data mode detect = 64 (512 sec)1100 Carrier detect = 128 (1024 sec)Data mode detect = 128 (1024 sec) (see note)1101 Carrier detect = 256 (2048 sec)Data mode detect = 256 (2048 sec) (see note)1110 Carrier detect = 512 (4096 sec)Data mode detect = 512 (4096 sec) (see note)1111 Carrier detect = 1024 (8192 sec)Data mode detect = 1024 (8192 sec) (see note)Table 61. LFCTL3 Register Field Descriptions (continued)Field Description
FXTH870x6Sensors106 Freescale Semiconductor, Inc.12.17.4 LFR Control Register 4 (LFCTL4)LFCTL4 contains local interrupt enable control bits. The provided I-interrupts are not globally masked by the I bit in the CPU’s CCR, setting one or more of these interrupt enable control bits will cause a CPU interrupt to be requested whenever the flag bit associated with the corresponding LFR interrupt source becomes set. It is good practice to clear any flag bits in the LFS register before setting interrupt enable bits in this register in order to avoid an immediate interrupt request.$0023 Bit 7 654321Bit 0RLFDRIE LFERIE LFCDIE LFIDIE DECEN VALEN TIMOUT[1:0]WReset: 00001100Figure 79. LFR Control Register 4 (LFCTL4)Table 62. LFCTL4 Register Field DescriptionsField Description7LFDRIELFR Data Register Full Interrupt Enable — This read/write bit enables interrupts to be requested when the LFR data register is full. Reset clears LFDRIE.0 LFDRF interrupts disabled. Use software polling.1 LFR Data Register Full interrupts are enabled. If LFDRIE is set, then an interrupt is requested when LFDRF = 1.6LFERIELFR Error Interrupt Enable — This read/write bit enables interrupts to be requested when the LFR detects an error in reception of a non-Manchester encoded bit time following the SYNC time. Reset clears LFERIE.0 LFERF interrupts disabled. Use software polling.1 LFERF interrupts are enabled. If LFERIE is set, then an interrupt is requested when LFERF = 1.5LFCDIELFR Carrier Detect Interrupt Enable — This read/write bit enables the LFCDF interrupt when the LFR detects the number of samples with an LF signal defined by the LFCDTM bits in the LFCTL3 register. The LFCDIE is ignored when the LFR is operating in the data mode (CARMOD = 0), except when DECEN is cleared. Reset clears LFCDIE.0 LFCDF interrupts disabled.1 LFR LFCDF interrupts are enabled. If LFCDIE is set, then an interrupt is requested when LFCDF = 1.4LFIDIELFR ID Detect Interrupt Enable — This read/write bit enables interrupts to be requested when the LFR detects a match to the ID code selected in the LFIDH:L registers. Reset clears LFIDIE.0 LFIDF interrupts disabled.1 LFIDF interrupts are enabled. If LFIDIE is set, then an interrupt is requested when LFIDF = 1.3DECENLF Digital Decode Enable — This read/write bit enables the data processing by the digital decoder. Whendisabled, the frame format (Manchester, data-rate, SYNC, data) is not checked. There is no more error flag assertion (data, error, ID). The MCU should then poll the LFDO bit to extract from the analog detector the bit stream. Reset sets the DECEN bit.0 Digital decoder is disabled.1 Digital decoder is enabled.2VALENLF Validation Enable — This read/write bit enables the carrier validation process. Reset sets this bit.0  Carrier Validation disabled.1  Carrier Validation enabled.1:0TIMOUT[1:0]SYNC Time Out Select — These two read/write bits select the period of time that the LFR will search for a SYNC pattern in the data mode. If the SYNC pattern is not detected the LFR will be turned off after this delay time. These time intervals are clocked by the internal LFRO clock. Reset clears TIMOUT bit.00 SYNC word is continuously searched — no timeout.01 SYNC search time set to nominal 8 milliseconds.10 SYNC search time set to nominal 24 milliseconds.11 SYNC search time set to nominal 48 milliseconds.
FXTH870x6SensorsFreescale Semiconductor, Inc. 10712.17.5 LFR Status Register (LFS, LPAGE = 0)LFS contains the data ready status flags. It is only accessible when the LPAGE bit is clear.$0024 Bit 7 654321Bit 0RLFDRF LFERF LFCDF LFIDF LFOVF LFEOMF LPSM 0WLFIAKReset: 00000010= ReservedFigure 80. LFR Status Register (LFS, LPAGE = 0)Table 63. LFS Register Field DescriptionsField Description7LFDRFLF Data Ready Flag — This read-only status flag is set when a complete byte of data has been received by the LFR. An interrupt is sent to the MCU if the LFDRIE bit is set. Clear LFDRF by writing a one to the LFIAK bit or reading the LFDATA register. LFDRF is also cleared by reset.0 No new data in LFDATA register.1 A new byte of data has been received and can be read from the LFDATA register.6LFERFLF Receive Error Flag — In data receive mode, this read-only status flag is set when a non-standard bit time is detected in the Manchester data mode. Any received data bits before the error occurs are placed in the data buffer. In carrier detect mode, this read-only status flag is not used and remains clear. An interrupt is sent to the MCU if the LFERIE bit is set. Clear LFERF by writing a one to the LFIAK bit. LFERF is also cleared by reset.0 Normal operation.1 Error detected in the Manchester data mode.5LFCDFLF Carrier Pulse Detect Flag — In carrier detect mode, this read-only status flag is set when the number of consecutive carrier validations set by the LFCC bits in is reached. Note that the LFCC function is not working if TOGMOD = 1. Clear LFCDF by writing a one to the LFIAK bit. LFCDF is also cleared by reset.0 Normal operation.1 Carrier detection has occurred.4LFIDFLF ID Detect Flag — In data receive mode, this read-only status flag is set when the received ID matches the stored value. This interrupt can be generated even if no data bits follow the ID. An interrupt is sent to the MCU if the LFIDIE bit is set. Clear LFIDF by writing a one to the LFIAK bit. LFIDF is also cleared by reset.0 Normal operation.1 wakeup ID has been detected.3LFOVFLF Receive Data Overflow Flag — In data receive mode, this read-only status flag is set when a complete byte of data has been received and written into the LFDATA register, but the previously received byte was not read from LFDATA register yet. This indicates that the MCU has lost the previously received data byte. In carrier detect mode, this read-only status flag is not used and remains cleared. No separate interrupt is generated by this specific flag bit because the LFDRF flag would serve that purpose. Clear LFOVF by writing a one to the LFIAK bit. LFOVF is also cleared by reset.0 Normal operation.1 Previous data over-written before MCU read it.2LFEOMFLF Receive Data EOM Flag — In data receive mode, this read-only status flag is set when a complete byte of data has been received and written into the LFDATA register and an end-of-message Manchester encoding error occurs. In carrier detect mode, this read-only status flag is not used and remains clear. No interrupt is generated by this flag bit because the LFERF flag would serve that purpose. Clear LFEOMF by writing a one to the LFIAK bit. LFEOMF is also cleared by reset.0 No EOM detected.1 EOM detected.1LPSMLow Power Sniff Mode — This bit used to activate the low power consumption during SNIFF mode. It saves approximately 1 A with a trade-off of an additional 200 s in transition from carrier to data mode. LPSM is set by reset.0 Low time transition from carrier to data mode1 Low consumption during sniff mode0LFIAKLF Interrupt Acknowledge — Writing a one to the LFIAK bit clears the LFDRF, LFERF, LFCDF, LFIDF, LFOVF and LFEOMF flag bits. When a one is written to the LFIAK, it is automatically cleared at the next positive edge of the MCU bus clock. Then, reading the LFIAK bit is allowed but will always return zero. Writing a zero the LFIAK bit has no effect. Reset has no effect on this bit.0 No effect.1 Clears the LFDRF, LFERF, LFCDF, LFIDF, LFOVF and LFEOMF flag bits.
FXTH870x6Sensors108 Freescale Semiconductor, Inc.12.17.6 LFR Data Register (LFDATA, LPAGE = 0)The LFDATA is a read-only register that contains the most recent received data value. It is only accessible when the LPAGE bit is clear. As data is serially received by the LFR, it is assembled into 8-bit values. When a new complete 8-bit value is received, it is moved into the LFDATA register, over-writing any previous value, and the LFDRF data ready flag is set to indicate a value is available for the MCU to read. If a previous value was ready but was not read out of the LFDATA register before a new data byte is ready, the LFOVF overflow flag is also set to indicate this overflow condition. Writes to LFDATA have no meaning or effect.12.17.7 LFR ID Registers (LFIDH:LFIDL, LPAGE = 0)These two 8-bit read/write registers hold one of two ID values for LF messages. They are only accessible when the LPAGE bit is clear. The type of ID checking can be selected or disabled by using the IDSEL[1:0] bits in the LFCTL1 register. When ID checking is enabled, the ID value received through the LFR must match the contents of the LFIDH and/or LFIDL registers depending on the IDSEL bits or the message will be ignored and the MCU will remain in standby mode to minimize power consumption. All these bits are cleared by a reset.$0025 Bit 7 654321Bit 0RRXDATA[7:0]WReset: 00000000= ReservedFigure 81. LFR Data Register (LFDATA) when LPAGE = 0Table 64. LFDATA Register Field DescriptionsField Description7:0RXDATA[7:0]Receive Data [7:0] — This is the received data from the LFR when in the data mode. All bits are read-only and any writes to these bits will be ignored. Reading this register will clear the LFDRF.$0026 Bit 7 6 5 4 3 2 1 Bit 0RID[0:7]WReset: 00000000Figure 82. LFR ID Low Byte (LFIDL)$0027 Bit 7 6 5 4 3 2 1 Bit 0RID[15:8]WReset: 00000000Figure 83. LFR ID High Byte (LFIDH)Table 65. LFR ID Register Field DescriptionField DescriptionID[15:0] ID bits 15 through 0 — These read/write bits contain bits 15 through 0 of the 16-bit ID value.
FXTH870x6SensorsFreescale Semiconductor, Inc. 10912.17.7.1  LF Control E - LFCTRLE12.17.8 LFR Control Register D (LFCTRLD, LPAGE = 1)The LFCTRLD register contains two control bits for the LF detector and decoder. It is only accessible when the LPAGE bit is set.$0021 Bit 7 6 5 4 3 2 1 Bit 0RAZSC2 AZSC1 AZSC0WReset: 00000000= ReservedFigure 84. LF Control E (LFCTRLE)Table 66. LFCTRLE Register Field DescriptionField Description7-3Reserved Reserved bits — Not for user access.2-0AZSCLOGAMP AZ Sequencer Control — Control bits for AZ and trim within the LOGAMP.X00 Nominal AZ sequence - recommended settingX01 Short amp output release, max delay with RectsX10 Short amp output release, max delay with Amp input X11 All short, max delay with end of AZ 0XX Nominal sensitivity trim - recommended setting 1XX Sensitivities shifted by - 4 trim steps $0022 Bit 7 6 5 4 3 2 1 Bit 0RAVFOF[1:0] DEQS AZDC[1:0] ONMODE CHK125[1:0]WReset: 00000000Figure 85. LFR Control Register D (LFCTRLD, LPAGE = 1)Table 67. LFCTRLD Register Field DescriptionsField Description7-6AVFOF[1:0]SUM AZ release delay — Control the delay between falling edge of SUM d_az_en input and falling edge of internal AZ control line.00 No delay01 No delay10 One-half of 125 kHz clock period delay - recommended setting11 One and one-half of 125 kHz clock periods delay5DEQSDeQing status register — This read-only status bit allows the reading of the effective activation of the DeQing System.0 DeQing system not activated 1 DeQing system activated 4-3AZDC[1:0]AZ Digital Control of AZ triggering — In data receive mode, this bits control the triggering of AZ sequence with respect to both LFCPTAZ value (ref. LFCTRLB register) and the state of the demodulation input data state. 00 AZ starts after LFCPTAZ numbers of input data edges. 01 Z starts randomly adding -1, 0 or 1 to LFCPTAZ value between each AZ.10 AZ starts after LFCPTAZ numbers of input data edges and when the input data (d_data) state is 0. 11 AZ starts after LFCPTAZ numbers of input data edges and when the input data (d_data) state is 1 - recommended setting. 2ONMODEON Behavior Mode — This read/write bit selects how an error will affect the ON time. This bit is cleared by reset.0 Any error will stop the ON time.1 If remaining ON time, the LFR will go back to sniff mode at any error - recommended setting.
FXTH870x6Sensors110 Freescale Semiconductor, Inc.NOTESetting CHK125[1:0] to either 0x01 or 0x10 increases the immunity to noise and therefore carries the side effect of narrowing the 125 kHz carrier bandwidth tolerance.12.17.9 LFR Control Register C (LFCTRLC, LPAGE = 1)The LFCTRLC register contains control bits for the LF detector and decoder. It is only accessible when the LPAGE bit is set.1-0CHK125[1:0]Accurate 125 kHz Check — The bit controls the CARVAL frequency check method.00 CARVAL validates on n (2*32 s packets), n depending on LFCDTM value - recommended setting for LowSensitivity mode.01 CARVAL validates on n (1*32 s packet + 4*8 s packets), n depending on LFCDTM value - optional recommendedsetting for High Sensitivity mode.10 CARVAL validates on n (8*8 s packet), n depending on LFCDTM value - optional recommendedsetting for High Sensitivity mode.11 Same as 00.$0023 Bit 7 6 5 4 3 2 1 Bit 0RAMPGAIN[1:0] FINSEL[1:0] AZEN LOWQ[1:0] DEQENWReset: 1100100 1Figure 86. LFR Control Register C (LFCTRLC, LPAGE = 1)Table 68. LFCTRLC Register Field DescriptionsField Description7-6AMPGAIN[1:0]3rd Amplifier gain — These bits controls the 3rd amplifier gain.00 Gain of 2 - recommended setting01 Gain of 310 Gain of 411 Gain of 65-4FINSEL[1:0]Final stage select — These bits select the final stage of the LOGAMP.00 Continuous time biasing - Fixed Gain 601 Continuous time biasing - Programmable Gain - recommended setting10 4th rectifier disabled11 4th rectifier disabled3AZENData AZ enable — This bit allows the AZ sequence during data frame.0 AZ during data disabled1 AZ during data enabled - recommended setting 2-1LOWQ[1:0]DeQing Resistor — These bits select the resistor added in parallel to the input network.00 4 k01 2 k10 1 k11 500 0DEQENDeQing System enable — The bit controls the DeQing system.0 DeQing disabled. 1 DeQing enabled.Table 67. LFCTRLD Register Field Descriptions (continued)Field Description
FXTH870x6SensorsFreescale Semiconductor, Inc. 11112.17.10 LFR Control Register B (LFCTRLB, LPAGE = 1)The LFCTRLB register contains control bits for the LF detector and decoder. It is only accessible when the LPAGE bit is set.$0024 Bit 7 6 5 4 3 2 1 Bit 0RHYST[1:0] LFFAF LFCAF LFPOL LCPTAZ[2:0]WReset: 11000100Figure 87. LFR Control Register B (LFCTRLB, LPAGE = 1)Table 69. LFCTRLB Register Field DescriptionsField Description7-6HYST[1:0]Control slicer hysteresis 00 20 mV hysteresis01 40 mV hysteresis10 50 mV hysteresis11 30 mV hysteresis - recommended setting5-4LFFAF;LFCAFAverage filter bi-phase filtering control — Activates bi-phase filtering and control offset value00 Standard low pass filtering activated - recommended setting01 Standard low pass filtering activated10 Bi-phase filtering activated - Low offset from input signal low level11 Bi-phase filtering activated - High offset from input signal low level3LFPOLLF Manchester Polarity Select — This read/write bit selects the polarity of the transition in the middle of the bit time. The LFPOL is not used in Carrier mode. Reset clears LFPOL bit.0  Zero is falling edge in middle of a bit time, one is a rising edge in the middle of bit time.1 Zero is rising edge in middle of a bit time, one is a falling edge in the middle of bit time.2-0 LFCPTAZ[2:0] LF auto-zero counter — Applications to set these bits to 0x06 for proper LF operation. These bits tune the minimum number of data edges between two auto-zero requests during a data frame.
FXTH870x6Sensors112 Freescale Semiconductor, Inc.12.17.11 LFR Control Register A (LFCTRLA, LPAGE = 1)The LFCTRLA register contains control bits for the LF detector and factory test selects. It is only accessible when the LPAGE bit is set.$0025 Bit 7 6 5 4 3 2 1 Bit 0RLFCC[3:0]WReset: 00000000= ReservedFigure 88. LFR Control Register A (LFCTRLA, LPAGE = 1)Table 70. LFCTRLA Register Field DescriptionsField Description7-4Reserved Reserved bits — Not for user access.3-0LFCC[3:0]LF Successive Carrier Validations Counter — The value of the LFCC[3:0] bits define how many times the carrier detect sample ON time detected an LF carrier signal before the LFCDF flag bit set. The flag will be risen when the number of ON samples with a detected carrier greater than the LFCDTM[3:0] reaches the value of the LFCC[3:0] bits plus one. The internal count of detected carrier pulses will increment the count as long as they are consecutive samples. When a sample is encountered without any detected carrier the count will be reset.The LFCC register is considered reset in data mode. The first carrier validation will lead to start up of the receiver chain.This feature allows the user to define a number of consecutive carrier detections are required before the flag is risen; and is useful in detecting long duration carrier pulses. This counter is disabled if TOGMOD = 1.
FXTH870x6SensorsFreescale Semiconductor, Inc. 11313 RF ModuleIt is not intended that the RFM may be actively powered up and/or transmitting RF data while physical parameter measurements are being made; or during the time that the LFR may be actively receiving/decoding LF signals. The resulting interactions will degrade the performance of the RF output spectrum.The FXTH870x6 consists of an RF module (RFM) with external crystal-driven oscillator, VCO, fractal-n PLL and RF output amplifier (PA) for an antenna. It also contains a small state machine controller, random time generator and hardware data buffer for automated output or direct control from the MCU. The overall block diagram is shown in Figure 89.Figure 89. RF Transmitter Block Diagram13.1 RF Data ModesThere are two modes of operation in using the RF output in either the data buffer mode or MCU direct mode.13.1.1 RF Data Buffer ModeIn the RF data buffer mode the transmissions are sent by dedicated logic hardware while the MCU can be put into a low power mode until the transmission is completed. This RF state machine is clocked by the MFO which is enabled when the SEND bit is set and when any of the LFR, SMI or MCU are operating.The RF data buffer consists of a dedicated RFM state machine and a 256-bit data buffer. The RF data buffer is loaded with whatever data pattern the user software creates. The number of data bits to be sent is selected by the FRM[7:0] control bits. The control logic is triggered by the SEND control bit when it is time to transmit the data which is sent to the RF stage after being encoded as either Manchester, Bi-Phase or NRZ data according to the method selected by the CODE[1:0] bits as described in Section 13.17.Before the data can be transmitted the RFM control logic enables the external crystal oscillator and phase-locked-loop to initialize before the RF output stage can begin transmission.CRYSTALCONTROLREGISTERSRFAMPVCOXIXOPHASEDETECTORRFLOW-PASSFILTERFRACTIONAL-NDIVIDEROSCILLATORAND LOGIC256-BITDATA BUFFERMODULATIONCONTROLRFSTATEMACHINEMCUAVDDAVSSVREGRINT LFSRRANDOMGENMFODX500 kHzVOLTREGRFAVDDRFLVD
FXTH870x6Sensors114 Freescale Semiconductor, Inc.The external crystal connected to the X0 and XI pins provides the carrier frequency as well as the data rate clock needed for the data rates associated with the OOK or FSK modulation. Therefore the tolerance on the data rate will depend on the characteristics of the external crystal.Once the data buffer is emptied the data transfer stops; the RF output stage is turned off; and the SEND control bit is cleared and an interrupt of the MCU may be generated to wake it from the STOP1 mode. The user can test that the transmission has completed by reading back the state of the SEND control bit or the RFIF status bit. There is also the option to send the same data frame from 1 to 16 times with interlaced time intervals when the RF transmitter PA output stage is off. If multiple frames of data are to be transmitted within a datagram the spacing before the first frame and between subsequent frames can be controlled by the RFM state machine in several ways:1. Use of a programmable timer (random, base time, time adder).2. No time delays.In addition, the RFM crystal oscillator, VCO and PLL can be turned off during any interframe timing by use of the IFPD bit.When using the data buffer mode the user’s software should not change any bits in the RFM registers after the SEND has been set and the transmission is still in progress. Changing RFM register contents during a transmission can lead to data faults or errors.13.1.2 MCU Direct ModeWhen the CODE[1:0] bits are both set the encoding is controlled directly by the MCU where the data to the RF output depends on the state of the DATA bit and the selected modulation scheme. In this mode the user software must control the RF output stage to power up (using the SEND control bit), WAIT for the RF output stage to stabilize (monitor the RCTS status bit) and clock the DATA to the RF output stage. In this mode the data rate and its stability will depend on the internal HFO oscillator.Any transfers of data from the MCU will use the DATA bit which will be reflected as modulated data on the RF pin once the RF output stage is set up to transmit. The maximum data rate in this mode will depend on the complexity of the user software and the MCU clock rate. The POL bit in this case simply inverts the state of the DATA bit before it drives the RF output stage.The accuracy of the data rate in the MCU direct mode is directly dependant on the HFO accuracy.13.2 RF Output Buffer Data FrameWhen using the RF data buffer mode each frame of data is sent as 2 to 256 bits per frame with a possible two trailing bits for an end-of-message, EOM, as shown in Figure 90. The actual data being transmitted in a given data frame and any combinations of data frames into a single datagram is dependent on the user software.The number of frames sent in a given datagram can be from 1 to 16 based on the FNUM[3:0] bits in the RFCR3. The 256-bit buffer is divided into two pages of 128 bits as selected by the RPAGE bit in the RFCR2.The data buffer is unloaded to the RF output starting with the least significant bit (RFD0) in the least significant byte (RFB0) up through the most significant bit (RFD127) in the most significant byte (RFB15). This is often referred to as “little-endian” data ordering.
FXTH870x6SensorsFreescale Semiconductor, Inc. 115Figure 90. Data Frame Formats13.2.1 Data Buffer LengthThe number of bits sent in a given transmission frame is selected by the FRM[7:0] control bits encoded as a direct binary number plus one. This gives a range of 2 through 256 bits. Data written to data buffer bits above the highest bit number will be ignored. Transmission always begins with the data written in the RFB0 location. When the requested number of bits have been transmitted an interrupt to the MCU can be generated if the RFIE bit is set.13.2.2 End of Message (EOM)If the EOM control bit is set, then at the end of the data frame there will be carrier for a period of two bit times at level high for the OOK modulation modes or fDATA1 for the FSK modulation modes. Following the EOM period there will be no carrier for either the OOK or FSK modes. If the EOM control bit is clear, no EOM period will be added to the transmission.2EOM2562Maximum258-Bit Format80-Bit Format53-Bit Format2-Bit Format Data in each byte defined by user softwareOptional EOMRFB0 RFB1 RFB2 RFB3 RFB4 RFB5 RFBA RFBB RFBC RFBD RFBE RFBF80RFB0 RFB1 RFB2 RFB3 RFB4 RFB5 RFB6 RFB7 RFB8 RFB953RFB0 RFB1 RFB2 RFB3 RFB4 RFB5RFB62EOMBits [2:0]with all byte lengthsMinimumRFB0Bits [1:0]
FXTH870x6Sensors116 Freescale Semiconductor, Inc.13.3 Transmission RandomizationWhen there are two or more different transmitters, the clock rates of each may drift into synchronism with each other; and there is the possibility of RF data collisions and the loss of data from both transmitters. In order to reduce possible RF data collisions each transmission will contain from 1 to 16 frames of data. Each frame may be spaced at after the initially timed transmission start time and between any two data frames as shown in Figure 91.Figure 91. Datagram OverviewThe generation of the initial and interframe time intervals can be done with a combination of a programmable counter, a pseudo-random interval generator and a frame counter as shown in Figure 92. The initial time interval can be done by adjusting the start time using the MCU or using this interval timing generator.Figure 92. Initial and Interframe TimingSPACESPACEt0Time Not To ScaleSPACEInterframe Intervals1 to 16 Data FramesWith Identical DataStart of TimeInterval forDatagramDATA FRAME DATA FRAME DATA FRAMESpace Intervals have No Carrier Frequency Output, equivalent to Data = 0tDATAInitial Intervaland may have the RFM crystal oscillator, VCO and PLL turned off by the IFPD bit.t0Time Not To ScaleInterframe Interval 1Start of TimeInterval forDatagramtBASEInitial Interval40 x tRAND tBASE tRAND tFN tBASE tRAND tFNInterframe Interval 2tBASE, tRAND and tFN may be all zero in the initial interval.tBASE, tRAND and tFN may be all zero in an interframe interval.All interframe intervals may have different tBASE, tRAND and tFN times.Note: If tBASE and tFN are both set to non-zero, and tRAND is set to 0, the system will decrement both tBASE and tFN simultaneously rather than serially, such that the effective Interframe Interval will be equal to the larger of tBASE or tFN settings.
FXTH870x6SensorsFreescale Semiconductor, Inc. 11713.3.1 Initial Time IntervalWhen generating an initial time interval the MCU loads the RFM interval generator variables and then goes into the STOP1 mode. When the initial time interval ends the data in the RFM data buffer is automatically sent and the MCU will wake at the end of the transmission. The initial time interval is made up of two components:Eqn. 10where:tINIT = Total time interval before first frame is transmitted in mstBASE = Base time in ms; 5 ms not recommendedtRAND = Pseudo-random time in ms based on a Galois 7-bit LFSRThe components of this time are described in the following sections.13.3.2 Interframe Time IntervalsWhen generating an interframe time interval the MCU loads the RFM interval generator variables and then goes to the STOP1 mode. When the interframe time interval ends the data in the RFM data buffer is automatically sent and the MCU will wake at the end of the transmission. The interframe time interval is made up of three components:Eqn. 11where:tIFRM = Total time interval between each transmitted frame in mstBASE = Base time in ms; 5 ms not recommendedtFN = Time adder in ms for frame numbertRAND = Pseudo-random time in ms based on a Galois 7-bit LFSRThe components of this time are described in the following sections.13.3.3 Base Time IntervalThe base time interval, tBASE, is used in the initial time interval and in datagram transmissions with two or more frames. The programmable frame space interval is based on a simple 8-bit, count-down timer as described by the RFBT[7:0] control bits in the RFCR4 register. This time interval is forced to zero when the RFBT[7:0] are all clear.The range of the base time must be set to 0 or between 5 and 255 ms using a clock generated from the MFO divided by 125.13.3.4 Pseudo-Random Time IntervalThe pseudo-random time interval, tRAND, is used both in the initial and the interframe time intervals if the LFSR[6;0] bits are set to something other than all zeros. When the ISPC bit is set the pseudo-random initial time interval before the first data frame will be 40 times the value of tRAND.When the LFSR[6:0] bits are used the tRAND time will vary based on a pseudo-random generated binary number using a Galois linear feedback shift register (LFSR) implemented using the primitive polynomial for a 7-stage register as shown in Figure 93.This LFSR creates a sequence of 127 binary numbers including $01 through $3F which are each repeated only once in each sequence of 127 clocks of the shift register. The LFSR is initialized to $40 during power up of the device. When a random interval is to be determined the contents of the LFSR are sampled as the “random number” for calculating the required interval time. Following the use of the random interval the LFSR is clocked once to advance it to the next pseudo-random number.The range of the pseudo-random time is 1 to 127 ms using a clock generated from the MFO divided by 125. The current value of the LFSR can be changed and/or read by the LFSR[6:0] bits in the RFCR5 register.tINIT tBASE 40 tRAND+=tIFRM tBASE tRAND tFN++=
FXTH870x6Sensors118 Freescale Semiconductor, Inc.Figure 93. LFSR ImplementationA value of all zeros in the LFSR will remain unchanged with every clock input and cannot be used as a starting “seed.”The resulting range of times for the initial and interframe pseudo-random time will be as given in Table 71 for both the design center and the variation resulting from the tolerance of the MFO clock.13.3.5 Frame Number TimeThe frame number time, tFN, is only used between frames and is based on a selectable time from 0 to 63 ms and the number of the frame that was just transmitted as given in Table 72. If the frame number time is not used, the value of the selected time should be set to zero. The maximum number of frames is defined by the FNUM[3:0] control bits.The range of the frame number time is a multiple of 0 to 63 ms using a clock generated from the MFO divided by 125. The value of this time multiple can be changed by the RFFT[5:0] bits in the RFCR6 register.Table 71. Randomization Interval TimesTimeInterval RandomizationNumber Ideal Time Interval (ms) Time Interval Including MFO Tolerance (ms)Minimum MaximumInitial 1 40 37.2 42.8127 5080 4347.2 5434.6Interframe 1 1 0.93 1.07127 127 118.1 135.9Table 72. Frame Number Interval TimesValue ofFNUM[3:0] Number ofFrames Frame Interval Where Time AddedNominal Frame Number Time Interval Added (ms)Minimum Maximum0 1 None n/a n/a121 - 21 632 3 2 - 3 2 1263 4 3 - 4 3 1894 5 4 - 5 4 2525 6 5 - 6 5 3156 7 6 - 7 6 3787 8 7 - 8 7 4418 9 8 - 9 8 504DQRDQRDQRDQRDQRDQRDQSS0S1S2S3S4S5S6CLKRFMRST7-BIT Random NumberGalois Primitive Polynomial = X7 + X3 + 1
FXTH870x6SensorsFreescale Semiconductor, Inc. 11913.4 RFM in STOP1 ModeThe entire RF transmitter digital section can remain powered up, if enabled by the RFEN bit (see Section 5.3), when the MCU goes into the STOP1 mode.13.5 Data EncodingThe CODE[1:0] control bits select either Manchester, Bi-Phase, NRZ or MCU direct data encoding of each data bit being transferred from the RF data buffer to the RF output stage. Further, the polarity of the selected encoding method can be inverted using the POL control bit.13.5.1 Manchester EncodingWhen the CODE[1:0] bits are both clear the data is Manchester encoded format, with data transmitted as a transition in voltage occurring in the middle of the bit time. The polarity of this transition is selected by the POL bit. When the POL bit is cleared, then a logical LOW is defined as an increase in signal in the middle of a bit time and a logical HIGH is defined as a decrease in signal in the middle of a bit time as shown in Figure 94. When the POL bit is set, then a logical LOW is defined as an decrease in signal in the middle of a bit time and a logical HIGH is defined as a increase in signal in the middle of a bit time as shown in Figure 95. Since there is always a transition in the middle of the bit time there must also be a transition at the start of a bit time if consecutive “1” or “0” data are present.13.5.2 Bi-Phase EncodingWhen the CODE[1:0] bits are 0:1 then the data is Bi-Phase encoded format, with data transmitted as the presence or absence of a transition in signal in the middle of the bit time. The polarity of this transition is selected by the POL bit. Unlike Manchester coding there is always a signal transition at the boundaries of each bit time. When the POL bit is cleared, then a logical HIGH is defined as no change in signal in the middle of a bit time and a logical LOW is defined as a change in the signal in the middle of a bit time as shown in Figure 96. When the POL bit is set, then a logical HIGH is defined as a change in signal in the middle of a bit time and a logical LOW is defined as no change in the signal in the middle of a bit time as shown in Figure 97. Since there is always a transition at the ends of the bit time consecutive bits of the same state may have two signal states (high or low) during the middle of the bit time.13.5.3 NRZ EncodingWhen the CODE[1:0] bits are 1:0 then the data is NRZ encoded format, with data transmitted as either a high or low for the complete bit time. The polarity of this state is selected by the POL bit. The Manchester and Bi-Phase encoding can actually be created using NRZ encoding running at twice the desired data rate.9 10 9 - 10 9 56710 11 10 - 11 10 63011 12 11 - 12 11 69312 13 12 - 13 12 75613 14 13 - 14 13 81914 15 14 - 15 14 88215 16 15 - 16 15 945Table 72. Frame Number Interval Times (continued)Value ofFNUM[3:0] Number ofFrames Frame Interval Where Time AddedNominal Frame Number Time Interval Added (ms)Minimum Maximum
FXTH870x6Sensors120 Freescale Semiconductor, Inc.Figure 94. Manchester Data Bit Encoding (POL = 0)Figure 95. Manchester Data Bit Encoding (POL = 1)LOWBIT HIGHBITFSK = fRF+ fFSK = fRF - fBit TimeConsecutive “0”Data BitsConsecutive “1”Data Bits“001101”Data BitsOOK = fRF OOK = OFF Bit TimeLOWBIT HIGHBITFSK = fRF+ fFSK = fRF - fBit TimeConsecutive “0”Data BitsConsecutive “1”Data Bits“001101”Data BitsOOK = fRF OOK = OFF Bit Time
FXTH870x6SensorsFreescale Semiconductor, Inc. 121Figure 96. Bi-Phase Data Bit Encoding (POL = 0)Figure 97. Bi-Phase Data Bit Encoding (POL = 1)13.6 RF Output StageThe RF output stage consists of a PLL, control logic and an output RF amplifier. Data is sent to the RF output stage from either the RF data buffer or the DATA bit in the RFCR3 depending on the selected mode of operation as described in Section 13.1.The RF output stage is enabled by the state of the SEND control bit. The PLL in the RF output stage will signal back via the RCTS status bit when the PLL is locked and ready to transmit. 13.6.1 Modulation MethodThe modulation control bit, MOD, described in Section 13.18, sets the modulation of the RF signal will be either amplitude shift keying (OOK) or frequency shift keying (FSK) with several options for the frequency shift.When operating in the FSK mode the internal, fractional-n PLL divider will be used to create the two carrier frequencies for data zero and data one. This method is more effective and robust than “pulling” the external crystal in order to shift the carrier frequency.LOWBITHIGHBITBit TimeConsecutive “0”Data BitsConsecutive “1”Data BitsLOWBIT“001101”Data BitsHIGHBITFSK = fRF+ fFSK = fRF - fOOK = fRF OOK = OFF Bit Time Bit Time Bit TimeOOK = fRF LOWBITHIGHBITBit TimeConsecutive “0”Data BitsConsecutive “1”Data BitsLOWBIT“001101”Data BitsHIGHBITFSK = fRF+ fFSK = fRF - fOOK = OFF Bit Time Bit Time Bit Time
FXTH870x6Sensors122 Freescale Semiconductor, Inc.13.6.2 Carrier FrequencyThe carrier frequency is established mainly by the external crystal used, but a centering of the fractional-n PLL provides more precise control. If the CF control bit is clear the PLL will be configured for a carrier center frequency of the 315 MHz. If the CF control bit is set the PLL will be configured for a carrier center frequency of the 434 MHz.13.6.3 RF Power OutputThe maximum power output from the RF pin can be adjusted to one of 21 levels using the PWR[4:0] bits.13.6.4 Transmission ErrorAny transmission will be aborted if one of the following occurs:1. The RCTS signal does not become active within the tLOCK time.2. The PLL falls out of lock after once being set and the SEND bit is still active.3. The XCO monitor output falls.If either of these cases occurs the RF output will be turned off; the SEND control bit will be cleared; and the transmission error status flag, RFEF, will be set. The RFEF bit triggers an interrupt of the MCU if the RFIEN is set. The RFEF bit is cleared by writing a logical one to the RFIAK bit.13.6.5 Supply Voltage Check During RF TransmissionA separate low voltage detector can be enabled during the RF transmission and a status bit checked for low voltage drops due to a weak battery during the higher transmission currents. This RF LVD can be enabled by setting the RFLVDEN bit and the resulting status is reported on the RFVF bit. The RFVF bit can be cleared by writing a logical one to the RFIAK bit if the supply voltage has risen above the detect threshold. Further, if the voltage falls far enough for the VCO and PLL to fall out-of-lock, then the RF output will be turned off and the transmission will be terminated.13.6.6 RF Reset (RFMRST)The RF state machine, crystal oscillator, PLL and VCO can be reset to the initial off state by the RFMRST signal generated by one of the following methods:1. Internal RFM power-on reset (RFPOR).2. Writing a one to the RFMRST bit in the RFCR7. Any of these reset methods will not alter any data stored in the data buffer.13.7 RF InterruptThe RFM will interrupt the MCU when the SEND bit is cleared at the end of a data buffer transmission. This interrupt occurs at the end of a programmed set of frames. If the number of frame count FNUM[3:0] is set to zero, then only one frame is sent and the interrupt occurs at the end of that first frame transmitted. If the number of the frame count is greater than zero, then the interrupt will be generated depending on the state of the IFID bit.The interrupt will also create a flag bit, RFIF, which can be cleared by writing a logical one to the RFIAK bit. The interrupt can be enabled/disabled by the RFIEN bit.13.8 Datagram Transmission TimesIn order to comply with FCC requirements in the US market the periodically transmitted datagram must be less than 1 second in length and be separated by an off time that is at least 10 seconds or at least 30 times longer than the transmission time, whichever is longer. The user software must adhere to this ruling for products intended for the US market.
FXTH870x6SensorsFreescale Semiconductor, Inc. 12313.9 RFM RegistersThe RFM contains twelve registers to control its functions and 32 registers to provide access to the output data buffer.13.9.1 RFM Control Register 0 - RFCR0The RFCR0 register contains eight control bits for setting the output data rate of the RFM as described in Figure 98.The BPS[7:0] bits are set to $34 by an RFMRST signal which results in a default data rate of approximately 9600 bps.13.10 RFM Control Register 1 - RFCR1The RFCR1 register contains eight control bits for the RFM as described in Figure 99.$0030 Bit 7 654321Bit 0RBPS[7:0]WRFMRST: 00110100Figure 98. RFM Control Register 0 (RFCR0)Table 73. RFCR0 Field DescriptionsField Description7–0BPS[7:0]Data Rate - The BPS[7:0] control bits select the data rate for the transmitted datagrams as described by the following equation:where:fDATA= Data rate in bits/secondfXTAL= External crystal frequency in Hz = 26 MHzBPS= Value of data rate code (BPS[7:0])Examples of the value for common data rates are given in Table 74. The BPS[7:0] control bits are set to $34 by the RFMRST signal which results in a default data rate of 9600 bits/sec.Table 74. Data Rate Option ExamplesData Rate BPS[7:0]Decimal Value Data Rate BPS[7:0]Decimal ValueTarget Nominal fXTAL = 26 MHz Target Nominal fXTAL = 26 MHz2000 bps 2000.0 249 4800 bps 4807.7 1032400 bps 2403.8 207 5000 bps 5000.0 994000 bps 4000.0 124 9600 bps 9615.4 514500 bps 4504.5 110 19200 bps 19230.8 25$0031 Bit 7 6 5 4 3 2 1 Bit 0RFRM[7:0]WRFMRST: 00000000Figure 99. RFM Control Register 1 (RFCR1)fDATAfXTAL52 BPS 1+------------------------------------- 5x105BPS 1+-------------------------==
FXTH870x6Sensors124 Freescale Semiconductor, Inc.13.11 RFM Control Register 2 - RFCR2The RFCR2 register contains eight control bits for the RFM as described in Figure 100.Table 75. RFCR1 Field DescriptionsField Description7-0FRM[7:0]Frame Bit Length - The FRM[7:0] control bits select the number of bits in each datagram. The number of bits is determined by the binary value of the FRM[7:0] bits plus one. This makes the range of bits from 2 to 256. A value of $00 for the FRM[7:0] control bits will result in no frames being sent. The FRM[7:0] control bits are cleared by RFMRST signal.$0032 Bit 7 654321Bit 0RSEND RPAGE EOM PWR[4:0]WRFMRST: 00000000Figure 100. RFM Control Register 2 (RFCR2)Table 76. RFCR2 Field DescriptionsField Description7SENDTransmission Start Control- The SEND control bit starts the transmission of data held in the RFM data buffer according to the bit length specified by the FRM[7:0] bits. The SEND control bit is automatically cleared when the data buffer transmission has ended or by the RFMRST signal. A transmission can be prematurely interrupted by writing a logical zero to the SEND bit.0 Data transmission ended or transmission not in progress.1 Start data transmission or transmission in progress.6RPAGEBuffer Page Select — The RPAGE bit will select the lower or upper 16 bytes of the RFM data buffer when writing/reading to the RFD0-RD15 registers. This bit also selects between the lower and upper banks of RFM registers at addresses $0038 through $003B. This bit is cleared by a reset of the MCU.0 Select the lower 16 bytes of the RFM data buffer.1 Select the upper 16 bytes of the RFM data buffer.5EOMEnd Of Message - The EOM control bit selects whether there will be two data bit times of data 1 carrier state at the end of each datagram. The EOM control bit is cleared by a RFMRST.0 EOM bit times not added.1 EOM bit times added.
FXTH870x6SensorsFreescale Semiconductor, Inc. 1254:0PWR[4:0]RF Amplifier Power Level - The PWR[4:0] control bits select the optimum power output of the RF power amplifier. These power output levels assume optimal matching network to the RF pin. The PWR[4:0] control bits are cleared a RFM reset. The PWR control bits are initially set to 0x00. This setting targets -10 dBm typical power output. The PWR control bits scale the typical output power level from -1.5 to 8 dBm in steps of 0.5 dB and fixes the low power level mode to -10 dBm, The power control range is defined as follows:00000  set output power level to -10 dBm (Default Value)00001  set output power level to -1.5 dBm00010  set output power level to -1.0 dBm00011  set output power level to -0.5 dBm00100  set output power level to 0.0 dBm00101 set output power level to 0.5 dBm00110  set output power level to 1.0 dBm00111 set output power level to 1.5 dBm01000  set output power level to 2.0 dBm01001  set output power level to 2.5 dBm01010  set output power level to 3.0 dBm01011  set output power level to 3.5 dBm01100  set output power level to 4.0 dBm01101  set output power level to 4.5 dBm01110  set output power level to 5.0 dBm01111 set output power level to 5.5 dBm10000  set output power level to 6.0 dBm10001  set output power level to 6.5 dBm10010  set output power level to 7.0 dBm10011  set output power level to 7.5 dBm10100  set output power level to 8.0 dBmCodes greater than 10100 are reserved for test purposes and should not be used.Table 76. RFCR2 Field Descriptions (continued)Field Description
FXTH870x6Sensors126 Freescale Semiconductor, Inc.13.11.1 Power Working DomainsThe working areas of the RF transmitter are divided into several domains as defined in Figure 101.PTYPTA = 25 °C to 60 °C and VDD = 2.5 V to 3.6 VPTYP is where the power step is adjusted to guarantee 5 dBm. The power consumption in this domain is specified at 5 dBm output power step at nominal conditions of TA = 25 °C and VDD = 3 VDC.PMINPMIN is where the power step is adjusted to guarantee a minimum of 3 dBm as shown in Figure 101. The power consumption in this domain is given as the maximum consumption at whatever temperature of supply voltage condition. The PMIN domain is subdivided into two areas according to the lowest supply voltage encountered (1.8 or 2.5 VDC).PMIN_COLDTA = -40 °C to 0 °C and VDD = 1.8V to 3.6VPMIN_HOTTA = 0 °C to 25 °C and VDD = 2.5 V to 3.6 VTA = 60 °C to 125 °C and VDD = 2.5 V to 3.6 VFigure 101. RF Power DomainsPMIN_COLD PMIN_HOT PMIN_HOTPTYPVDD = 2.5 VVDD = 3.6 VVDD = 3.0 VVDD = 1.8 VTA = -40 °C TA = 0 °C TA = 25 °C TA = 60 °C TA = 125°CTypical Consumption
FXTH870x6SensorsFreescale Semiconductor, Inc. 12713.12 RFM Control Register 3 - RFCR3The RFCR3 register contains five control bits for the RFM as described in Figure 102 which sets the number of frames in each RF datagram.$0033 Bit 7 654321Bit 0RDATA IFPD ISPC IFID FNUM[3:0WRFMRST 00000000Figure 102. RFM Control Register 3 (RFCR3)Table 77. RFCR3 Field DescriptionsField Description7DATAData State - The DATA bit determines the output state of the RF power amplifier when the RFM is in the MCU direct control mode (CODE[1:0] = 11)0 RF output state low.1 RF output state high.6IFPDInterframe Power Down — The IFPD control bit selects whether the XCO and associated analog blocks are powered down during interframe timing caused by the RFM. The IFPD control bit is cleared by the RFMRST signal.0 The XCO remains powered up as long as the SEND bit is set.1 The XCO is powered down during RFM controlled interframe timing events. The restart of these functions will start 1 ms before the end of the timing interval if anotherframe is to be transmitted.5ISPCInitial Random Space— When the ISPC bit is set the initial time delay before the first frame will be enabled. This bit is cleared by an RFM reset.0 No initial time interval.1 Initial time interval enabled.4IFIDInterframe Interrupt Delay — The IFID control bit selects whether the RFIF bit is set and the MCU is interrupted at the end of each frame sent or at the end of the last frame in a multiple frame message. The IFID control bit is cleared by the RFMRST signal.0 The RFIF bit is set and the MCU interrupted if the RFIEN bit is set, after the last frame transmitted.1 The RFIF bit is set and the MCU interrupted if the RFIEN bit is set, only after the last frameplus an additional interframe message is transmitted.3-0FNUM[3:0]FNUM[3:0] — The FNUM[3:0] bits set the number of frames transmitted in each RF datagram. The frames will be randomly spaced apart as described it Section 13.3.These bits are cleared by an RFM reset. The number of frame transmitted is the binary number plus one.
FXTH870x6Sensors128 Freescale Semiconductor, Inc.13.13 RFM Control Register 4 - RFCR4The RFCR4 register contains eight control bits to set the initial and interframe timing base timing variable as described in Figure 103. A RFMRST signal clears the RFBT[7:0] bits.13.14 RFM Control Register 5 - RFCR5The RFCR5 register contains eight control bits to set the initial and interframe random timing variable as described in Figure 104. A RFMRST signal clears the LFSR[6:0] bits causing the random time variable to be ignored.NOTEIf RFBT[7:0] and RFFT[5:0] are both set to non-zero, and LFSR[6:0] is set to 0x00, the system will decrement both RFBT and RFFT simultaneously rather than serially, such that the effective Interframe Interval will be equal to the larger of RFBT or RFFT settings.$0034 Bit 7 654321Bit 0RRFBT[7:0]WRFMRST: 10000000Figure 103. RFCR4 Register - Base Time VariableTable 78. RFCR4 Field DescriptionsField Description7:0RFBT[7:0]Base Timer - The RFBT[7:0] control bits select the interframe timing between multiple frames of transmission. The base time value is equal to a nominal one millisecond for each count of the RFBT[7:0] bits. The RFBT[7:0] control bits are cleared by the RFMRST signal and must be set to either 0 or between 5 and 255.$0035 Bit 7 654321Bit 0RBOOST LFSR[6:0]WRFMRST: 00000000Figure 104. RFCR5 Register - Pseudo-Random Time VariableTable 79. RFCR5 Field DescriptionsField Description7BOOSTBOOST - This bit controls the VCO power consumption in order to decrease the phase noise required by the Japanese regulation. The BOOST control bit is cleared by the RFMRST signal.0 The VCO runs at its lower power consumption level (higher phase noise).1 The VCO runs at its higher power consumption level (lower phase noise).6:0LFSR[6:0]Pseudo-Random Timer- The LFSR[6:0] bits select the current seed value of the LFSR when enabling pseudo-random timing intervals when any of the LFSR[6:0] bits are set. The value written to this register is loaded into the actual LFSR when the SEND bit is set. The time value is equal to a nominal one millisecond for each count of the resulting LFSR[6:0] bits.A value of $00 placed in the LFSR causes the LFSR to stay at the $00 state on each clocking of the LFSR. To cause the LFSR to cycle through its pseudo-random number sequence requires that any value other than $00 be written to the LFSR[6:0] bits.
FXTH870x6SensorsFreescale Semiconductor, Inc. 12913.15 RFM Control Register 6 - RFCR6The RFCR6 register contains eight control bits to set the initial and interframe frame number timing variable as described in Figure 105. A RFMRST signal clears the RFFT[5:0] bits.13.16 RFM Control Register 7 - RFCR7The RFCR7 register contains four control bits and four status bits for the RFM as described in Figure 106.$0036 Bit 7 654321Bit 0RVCO_GAIN[1:0] RFFT[5:0}WRFMRST: 10000000Figure 105. RFCR6 Register - Frame Number Time - RFTS[1:0] = 1:0Table 80. RFCR6 Field DescriptionsField Description7:6VCO_GAIN[1:0]VCO Gain Selection - These bits control the VCO gain. The VCO_GAIN[1] bit is set and the VCO_GAIN[0] bit is cleared by the RFMRST signal. Not normally need to be adjusted by the end user.5:0RFFT[5:0]Frame Number Timer - The RFFT[5:0] control bits select the interframe timing between multiple frames of transmission. The time value is equal to a nominal one millisecond for each count of the RFFT[5:0] bits multiplied by the frame number of the last transmitted frame. The RFFT[5:0] control bits are cleared by the RFMRST signal.$0037 Bit 7 6 5 4 3 2 1 Bit 0RRFIF RFEF RFVF 0RFIEN RFLVDEN RCTS 0WRFIAK RFMRSTRFMRST: 00000000= ReservedFigure 106. RFM Transmit Control Registers (RFCR7)Table 81. RFCR7 Field DescriptionsField Description7RFIFRF Interrupt Flag— The read-only RFIF status bit indicates if the RF transmission has ended properly when using the data buffer mode and the SEND bit has been cleared. Writes to this bit will be ignored. The RFIF status bit is cleared by writing a logical one to the RFIAK bit or the RFMRST bit. RFMRST signal clears this bit.0 RF transmission in progress or not in the data buffer mode.1 RF transmission completed in the data buffer mode.6RFEFRF Transmission Error Flag— The read-only RFEF status bit indicates if there was an error in the current or prior RF transmission as described in Section 13.6.4. Writes to this bit will be ignored. The RFEF status bit is cleared by writing a logical one to the RFIAK bit or the RFMRST bit. RFMRST signal clears this bit.0 No RF transmission error occurred.1 RF transmission error occurred.5RFVFRF LVD Trigger Flag— When the RF LVD is enabled and the supply voltage falls below the threshold, the read-only RFVF flag will be set if the RFLVDEN bit is set. Writes to this bit will be ignored. The RFVF status bit is cleared by writing a logical one to the RFIAK bit or the RFMRST bit. RFMRST signal clears this bit0 Voltage is and has been above RF LVD rising threshold or the RF LVD is disabled.1 Voltage has dropped below the RF LVD falling threshold since last reset of this bit.4RFIAKAcknowledge RF Interrupt Flags— Writing a one to the RFIAK bit clears the RFIF, RFEF and RFVF flag bits. Writing a zero to the RFIAK bit has no effect on the RFIF, RFEF and RFVF flag bits. The RFMRST signal has no effect on this bit.0 No effect.1 Clear the RFIF, RFEF, and RFVF bits.
FXTH870x6Sensors130 Freescale Semiconductor, Inc.13.17 PLL Control Registers A- PLLCR[1:0], RPAGE = 0The PLLCR[1:0] registers contain 16 control bits for the RFM as described in Figure 107. These bits are only accessible when the RPAGE bit is cleared.3RFIENRF Interrupt Enable— The RFIEN bit enables the RFIF, the RFEF and the RFVF bits to generate an interrupt to the MCU. The RFMRST signal clears this bit. 0 RF interrupts disabled.1 RF interrupts enabled.2RFLVDENRF LVD Enable — When the RFLVDEN bit is set, the RF LVD circuit will be enabled, and the RF LVD events are routed to the RF LVD Trigger Flag. This bit is cleared by the RFMRST signal.0 RF LVD disabled.1 RF LVD enabled.1RCTSRF Clear To Send Status— When the RCTS bit is set the RF XCO, VCO and PLL have started and locked and the RFM is ready to send data. This bit is cleared by the RFMRST signal.0 RFM not ready to send.1 RFM ready to send.0RFMRSTRFM Reset — Writing a one to the RFMRST bit will completely reset the RFM and its registers. This bit is not affected by a reset of the MCU. This bit will always read as a zero.0 No effect.1 Reset RFM.$0038 Bit 7 654321Bit 0RAFREQ[12:5]WRFMRST: 00000000$0039RAFREQ[4:0] POL CODEWRFMRST: 00000000Figure 107. PLL Control Registers A (PLLCR[1:0], RPAGE = 0)Table 82. PLLCR[1:0] Field DescriptionsField DescriptionPLLCR07:0AFREQ12:5PLLCR17:3AFREQ4:0PLL Divider Ratio A- The AFREQ[12:0] control bits select the PLL divider ratio for a data zero in the FSK mode of modulation as described by the following equation:where:fDATA0 = RF Carrier frequency for a data zero in MHzfXTAL = External crystal frequency in MHz, 26 MHzCF = State of the CF carrier select bitAFREQ = Decimal value of the AFREQ[12:0] binary weighted bitsThe AFREQ[12:0] control bits are cleared by the RFMRST signal. 1 LSB of AFREQ[12:0] = 3.17 kHz.2POLData Polarity - The POL control bit selects the polarity of the data encoding selected by the CODE[1:0] bits. The POL control bit is cleared by the RFMRST signal.0 NRZ and MCU direct DATA bit data non-inverted and Manchester encoding polarityas in Figure 95 and Bi-Phase encoding polarity as in Figure 97.1 NRZ and MCU direct DATA bit data inverted and Manchester encoding polarityas in Figure 94 and Bi-Phase encoding polarity as in Figure 96.Table 81. RFCR7 Field Descriptions (continued)Field DescriptionfDATA0 fXTAL 12 4 CF+AFREQ8192---------------------+=
FXTH870x6SensorsFreescale Semiconductor, Inc. 13113.18 PLL Control Registers B- PLLCR[3:2], RPAGE = 0The PLLCR[3:2] registers contain 16 control bits for the RFM as described in Figure 108. These bits are only accessible when the RPAGE bit is cleared.1:0CODE[1:0]Data Encoding and Source- The CODE[1:0] control bits select the type of data encoding and source of data for the RF output. The CODE[1:0] control bits are cleared by the RFMRST signal.00 Manchester encoded data from the RFM data buffer.01 Bi-Phase encoded data from the RFM data buffer.10 NRZ direct data from the RFM data buffer (can be mixed NRZ and Manchester at 2X the data rate).11 MCU direct mode with RF output driven by the state of the DATA bit.$003A Bit 7 654321Bit 0RBFREQ[12:5]WRFMRST: 00000000$003BRBFREQ[4:0] CF MOD CKREFWRFMRST: 00000000Figure 108. PLL Control Registers B (PLLCR[3:2], RPAGE = 0)Table 83. PLLCR[3:2] Field DescriptionsField DescriptionPLLCR27:0BFREQ12:5PLLCR37:3BFREQ4:0PLL Divider Ratio B- The BFREQ[12:0] control bits select the PLL divider ratio for a data one in either the OOK or FSK modes of modulation as described by the following equation:where:fCARRIER = RF Carrier frequency in MHzfXTAL = External crystal frequency in MHzCF = State of the CF carrier select bitBFREQ = Decimal value of the BFREQ[12:0] binary weighted bitsThe BFREQ[12:0] control bits are cleared by the RFMRST signal. 1 LSB of BFREQ[12:0] = 3.17 kHz.2CFCarrier Frequency - The CF control bit selects the optimal VCO setup and correct divider for the 500 kHz reference clock to the MCU on DX based on the external crystals required for the desired carrier frequency. The CF control bit is cleared by the RFMRST signal.0  Configured for 315 MHz, 12.1154 PLL divider using a 26.000 MHz external crystal.1  Configured for 434 MHz, 16.6923 PLL divider using a 26.000 MHz external crystal.1MODRF Modulation Method - The MOD control bit selects the method of modulating the RF. The MOD control bit is cleared by the RFMRST signal.0 Configured for OOK.1 Configured for FSK.0CKREFGenerated Clock Reference - Generates the DX signal to the TPM1 module for determining the otherclock frequencies:0DX signal not generated.1DX 500 kHz signal connected to the TPM1 module.Table 82. PLLCR[1:0] Field Descriptions (continued)Field DescriptionfDATA1 fXTAL 12 4 CF+BFREQ8192--------------------+=
FXTH870x6Sensors132 Freescale Semiconductor, Inc.13.19 EPR Register - EPR (RPAGE = 1)The EPR register contains eight control bits for the RFM as described in Figure 109. The function of the upper 4 bits depends on the state of the VCD_EN bit.$0038 Bit 7 654321Bit 0RPLL_LPF_[2:0] PA_SLOPE VCD_ENWRFMRST: 00110010= ReservedFigure 109. RFM EPR Registers (EPR, RPAGE = 1, VCD_EN = 0)$0038 Bit 7 654321Bit 0RVCD[3:0] PA_SLOPE VCD_ENWRFMRST: ———— 0010= ReservedFigure 110. RFM EPR Registers (EPR, RPAGE = 1, VCD_EN = 1)Table 84. EPR Field DescriptionsField Description7Reserved Reserved bit — Not for user access if the VCD_EN bit is clear.6-4PLL_LPF_[2:0]Low Pass Filter Selection - These read/write bits select the PLL low pass filter. A reset sets these bits to $03. These bits are only accessible if the VCD_EN bit is clear.7-4VCD[3:0]VCO Calibration Count Difference - These read-only bits show the count difference from “ideal” when the VCO calibration machine is finished (see Section 13.21). These bits are only accessible when the VCD_EN bit is set. Writing to these bits when the VCD_EN bit is set has no effect. The reset state is undefined.3-2Reserved Reserved bits — Not for user access.1PA_SLOPEPA Output Slope Selection — This read/write bit controls the output slope of the RFM PA output. This bit is set by the RFMRST signal.0VCD_ENVCD Enable bit — This bit allows access to the VCD[3:0] bits. This bit is cleared by the RFMRST signal.0 PLL_LPF_[2:0] bits accessed.1 VCD[3:0] bits accessed.
FXTH870x6SensorsFreescale Semiconductor, Inc. 13313.20 RF DATA Registers - RFD[31:0]The RFD registers contain 256 read/write bits for the RFM to use when outputting data as described in Section 13.2. The 256-bit buffer is divided into two pages of 128 bits as selected by the RPAGE bit in the RFCR2. These as described in Figure 111. These bits are unaffected by any reset.The data buffer is unloaded to the RF output starting with the least significant bit (RFD0) in the least significant byte (RFB0) up through the most significant bit (RFD255) in the most significant byte (RFB31). This is often referred to as “little-endian” data ordering. The output of this data by the RFM in all 256 bits locations is not dependent on the state of the RPAGE bit.Bit 7654321Bit 0$003C RFD[7:0] for RPAGE = 0, RFD[135:128] for RPAGE = 1$003D RFD[15:8] for RPAGE = 0, RFD[143:136] for RPAGE = 1$003E RFD[23:16] for RPAGE = 0, RFD[151:144] for RPAGE = 1$003F RFD[31:24] for RPAGE = 0, RFD[159:152] for RPAGE = 1$0040 RFD[39:32] for RPAGE = 0, RFD[167:160] for RPAGE = 1$0041 RFD[47:40] for RPAGE = 0, RFD[175:168] for RPAGE = 1$0042 RFD[55:48] for RPAGE = 0, RFD[183:176] for RPAGE = 1$0043 RFD[63:56] for RPAGE = 0, RFD[191:184] for RPAGE = 1$0044 RFD[71:64] for RPAGE = 0, RFD[199:192] for RPAGE = 1$0045 RFD[79:72] for RPAGE = 0, RFD[207:200] for RPAGE = 1$0046 RFD[87:80] for RPAGE = 0, RFD[215:208] for RPAGE = 1$0047 RFD[95:88] for RPAGE = 0, RFD[223:216] for RPAGE = 1$0048 RFD[103:96] for RPAGE = 0, RFD[231:224] for RPAGE = 1$0049 RFD[111:104] for RPAGE = 0, RFD[239:232] for RPAGE = 1$004A RFD[119:112] for RPAGE = 0, RFD[247:240] for RPAGE = 1$004B RFD[127:120] for RPAGE = 0, RFD[255:248] for RPAGE = 1Figure 111. RF Data Registers (RFD[31:0])Table 85. RFD[31:0] Field DescriptionsField DescriptionRFD15:0RPAGE = 0RFD[127:0]RF Data Registers Lower 128 bits - These are read/write bits that hold the lower 128 bits of possible data to be sent by the RFM. Access to the lower 128 bits occurs when the RPAGE bit is clear. These bits are unaffected by any reset.RFD31:16RPAGE = 1RFD[255:128]RF Data Registers Upper 128 bits - These are read/write bits that hold the upper 128 bits of possible data to be sent by the RFM. Access to the lower 128 bits occurs when the RPAGE bit is clear. These bits are unaffected by any reset.
FXTH870x6Sensors134 Freescale Semiconductor, Inc.13.21 VCO Calibration MachineThe RFM incorporates a VCO calibration machine which works in conjunction with the VCO. The calibration machine selects the optimal VCO sub-band with respect to a predefined reference voltage applied to the VCO. • Calibration supports maxband VCO sub-bands. maxband corresponds to the band where the VCO frequency is maximum.• A successive approximation algorithm is used to calculate the optimum sub-band.•Fc, the Center Frequency (AFREQ+BFREQ)/2 is used as the reference frequency for the VCO calibration in FSK mode (MOD = 1).• BFREQ is used as the reference frequency for the VCO calibration in OOK mode (MOD = 0).• Calibration occurs every time the VCO is enabled.• The calibration takes approximately 5s.The state machine of the calibration is shown in Figure 112.Figure 112. VCO Calibration State MachineCount the number of cycles of the VCOCompareVCOcount<TargetedcountVCOband=maxband/2VCOcount and TargetedcountBestband=maxband/2VCOband=VCOband-DifferenceDifference=maxband/4Difference=Difference/2VCOband=VCOband+DifferenceVCOband=VCOband-DifferenceBestband=VCObandDifference=1?NOYESBestband is first best band found or the closest band found- maxband is the number of sub-band of the VCO- Bestband is the band which is going to be chosen- Difference is an internal variable.VCOcount=TargetedcountVCOcount>Targetedcount
FXTH870x6SensorsFreescale Semiconductor, Inc. 13514 FirmwareThis section describes the software subroutines contained in the firmware section of the FLASH memory that the user can call for various tasks and to reduce the software development time for the main internal operations.14.1 Software Jump TableAll subroutines are accessed through a jump table located at the bottom of the firmware FLASH memory as described in Table 86. This allows upgrades in firmware without changing the software code of the user. All subroutines should be accessed with the JSR instruction.14.2 Function DocumentationThe following subsections describe the details of the firmware routines. Further details can be found in the latest version of the FXTH870x6 Embedded Firmware User Guide.14.2.1 General Rules1. No output parameter can use the extreme codes (all zero’s or all one’s).2. The all zero’s output code will always indicate a fault and the status byte will indicate the source of the error.3. While firmware is processing, CPU resources are unavailable for application.4. Each measured parameter will return a limit code ($00, $FF or $1FF) if an error occurs in its acquisition, except for the external ADC voltage measurements on the PTA[1:0] pins.5. External ADC voltage measurements on the PTA[1:0] pins will return a full range code that is ratiometric to the supply voltage.14.2.1.1 FXTH870x02 Single Z-axis Firmware RoutinesThe details on the use and execution of each firmware routine is documented in the CodeWarrior project file that is supplied by Freescale. Any future updates to these firmware routines will be contained in that file. A summary of the firmware routines available is given in Table 86.The firmware table is comprised of 3-byte entries where the first byte is the operational code for the JMP instruction, and the following two bytes are the absolute address pointing to the location of the firmware function.Table 86. FXTH870x02 Single Z-axis Firmware Summary and Jump TableAddress Routine DescriptionE000 TPMS_RESET Master reset of complete deviceE003 TPMS_READ_VOLTAGE 10-bit uncompensated bandgap voltage readingE006 TPMS_COMP_VOLTAGE 8-bit compensation of 10-bit voltage readingE009 TPMS_READ_TEMPERATURE 10-bit uncompensated temperature readingE00C TPMS_COMP_TEMPERATURE 8-bit compensation of 10-bit temperature readingE00F TPMS_READ_PRESSURE 10-bit uncompensated pressure readingE012 TPMS_COMP_PRESSURE 9-bit compensation of 10-bit pressure readingE015 TPMS_READ_ACCELERATION 10-bit uncompensated acceleration readingE018 TPMS_COMP_ACCELERATION  9-bit compensation of 10-bit acceleration readingE01B TPMS_READ_V0  10-bit uncompensated voltage reading on PTA0 pinE01E TPMS_READ_V1  10-bit uncompensated voltage reading on PTA1 pinE021 TPMS_LFOCAL LFO clock calibrationE024 TPMS_MFOCAL  MFO clock calibrationE027 TPMS_WAVG  Weighted average (2, 4, 8, 16 or 32)E02A TPMS_RF_RESET  Master reset of RFME02D TPMS_RF_READ_DATA  Read RFM data bufferE030 TPMS_RF_READ_DATA_REVERSE Read RFM data buffer in reverse bit orderE033 TPMS_RF_WRITE_DATA  Write RFM data bufferE036 TPMS_RF_WRITE_DATA_REVERSE Write RFM data buffer in reverse bit orderE039 TPMS_RF_CONFIG_DATA Configure RFM
FXTH870x6Sensors136 Freescale Semiconductor, Inc.14.2.1.2 FXTH870x11 Dual XZ-axis Firmware RoutinesThe details on the use and execution of each firmware routine is documented in the CodeWarrior project file that is supplied by Freescale. Any future updates to these firmware routines will be contained in that file. A summary of the firmware routines available is given in Table 87.The firmware table is comprised of 3-byte entries where the first byte is the operational code for the JMP instruction, and the following two bytes are the absolute address pointing to the location of the firmware function.E03C Reserved ReservedE03F TPMS_RF_SET_TX  Initiate RF transmissionE042 TPMS_RF_DYNAMIC_POWER  Adjusts PA for uniform power outputE045 TPMS_MSG_INIT  Initialization of the emulated serial communicationE048 TPMS_MSG_READ  Reading data from emulated serial interfaceE04B TPMS_MSG_WRITE Writing data on emulated serial interfaceE04E TPMS_CHECKSUM_XOR Calculates a checksum for given buffer in XORE051 TPMS_CRC8  Calculates CRC8 on portion of memoryE054 TPMS_CRC16  Calculates CRC16 on portion of memoryE057 TPMS_SQUARE_ROOT  Calculates square rootE05A TPMS_READ_ID  Reads device ID stored in FLASHE05D TPMS_LF_ENABLE  Enable/Disable LF for Carrier or DataE060 TPMS_LF_READ_DATA  Reading LF dataE063 TPMS_WIRE_AND_ADC_CHECK Performs checks of internal bond wiresE066 TPMS_FLASH_WRITE  Write to FLASHE069 TPMS_FLASH_CHECK  Performs checksum on Freescale firmware FLASHE06C TPMS_FLASH_ERASE Erases one page (512 bytes) of FLASH at a timeE06F TPMS_READ_DYNAMIC_ACCEL Offsets Z-axis acceleration with one of 15 stepsE072 TPMS_RF_ENABLE Enable RFME075 TPMS_FLASH_PROTECTION Lock out FLASHE078 Reserved ReservedE07B TPMS_MULT_SIGN_INT16  Multiple two signed 16-bit numbers togetherE07E TPMS_VREG_CHECK Verify that external capacitor connected to VREG pinE081 TPMS_PRECHARGE_VREG Precharge external capacitor on VREG pinE084 Reserved ReservedE087 TPMS_READ_ACCEL_CONT_START Enable the TPMS_READ_ACCEL_CONT function.E08A TPMS_READ_ACCEL_CONT Take continuous acceleration readings and store to assigned location.E08D TPMS_READ_ACCEL_CONT_STOP Disable the TPMS_READ_ACCEL_CONT function.Table 87. FXTH870x11 Dual XZ-axis Firmware Summary and Jump TableAddress Routine DescriptionE000 TPMS_RESET Master reset of complete deviceE003 TPMS_READ_VOLTAGE 10-bit uncompensated bandgap voltage readingE006 TPMS_COMP_VOLTAGE 8-bit compensation of 10-bit voltage readingE009 TPMS_READ_TEMPERATURE 10-bit uncompensated temperature readingE00C TPMS_COMP_TEMPERATURE 8-bit compensation of 10-bit temperature readingE00F TPMS_READ_PRESSURE 10-bit uncompensated pressure readingE012 TPMS_COMP_PRESSURE 9-bit compensation of 10-bit pressure readingE015 TPMS_READ_ACCELERATION_X 10-bit uncompensated X-axis accel readingTable 86. FXTH870x02 Single Z-axis Firmware Summary and Jump Table (continued)Address Routine Description
FXTH870x6SensorsFreescale Semiconductor, Inc. 137E018 TPMS_READ_DYNAMIC_ACCEL_X 10-bit uncompensated X-axis accel readingwith dynamic offset adjustment.E01B TPMS_COMP_ACCELERATION_X 9-bit compensation of 10-bit X-axis accel readingE01E TPMS_READ_ACCELERATION_Z 10-bit uncompensated Z-axis accel readingE021 TPMS_READ_DYNAMIC_ACCEL_Z 10-bit uncompensated Z-axis accel reading with dynamic offset adjustment.E024 TPMS_COMP_ACCELERATION_Z 9-bit compensation of 10-bit Z-axis accel readingE027 TPMS_READ_ACCELERATION_XZ 10-bit uncompensated X-axis and Z-axis accel readingsE02A TPMS_READ_DYNAMIC_ACCEL_XZ 10-bit uncompensated X-axis and Z-axis accel readings with dynamic offset adjustment.E02D TPMS_COMP_ACCELERATION_XZ 9-bit compensation of 10-bit X-axis and Z-axis accel readingsE030 TPMS_READ_V0 10-bit uncompensated voltage reading on PTA0 pinE033 TPMS_READ_V1 10-bit uncompensated voltage reading on PTA1 pinE036 TPMS_LFOCAL LFO clock calibrationE039 TPMS_MFOCAL MFO clock calibrationE03C TPMS_RF_ENABLE Enable and set up RFME03F TPMS_RF_RESET Master reset of RFME042 TPMS_RF_READ_DATA Read RFM data bufferE045 TPMS_RF_READ_DATA_REVERSE Read RFM data buffer in reverse bit orderE048 TPMS_RF_WRITE_DATA Write RFM data bufferE04B TPMS_RF_WRITE_DATA_REVERSE Write RFM data buffer in reverse bit orderE04E TPMS_RF_CONFIG_DATA Configure RFME051 Reserved ReservedE054 TPMS_RF_SET_TX Initiate RF transmissionE057 TPMS_RF_DYNAMIC_POWER Adjusts PA for uniform power outputE05A TPMS_MSG_INIT Initialization of the emulated serial communicationE05D TPMS_MSG_READ Reading data from emulated serial interfaceE060 TPMS_MSG_WRITE Writing data on emulated serial interfaceE063 TPMS_CHECKSUM_XOR Calculates a checksum for given buffer in XORE066 TPMS_CRC8 Calculates CRC8 on portion of memoryE069 TPMS_CRC16 Calculates CRC16 on portion of memoryE06C TPMS_SQUARE_ROOT Calculates square rootE06F TPMS_READ_ID Reads device ID stored in FLASHE072 TPMS_LF_ENABLE Enable/Disable LF for Carrier or DataE075 TPMS_LF_READ_DATA Reading LF dataE078 TPMS_WIRE_AND_ADC_CHECK Performs checks of internal bond wiresE07B TPMS_FLASH_WRITE Write to FLASHE07E TPMS_FLASH_CHECK Performs checksum on Freescale firmware FLASHE081 TPMS_FLASH_ERASE Erases one page (512 bytes) of FLASH at a timeE084 TPMS_FLASH_PROTECTION Lock out FLASHE087 Reserved ReservedE08A TPMS_MULT_SIGN_INT16 Multiple two signed 16-bit numbers togetherE08D TPMS_WAVG Weighted averageE090 Reserved ReservedTable 87. FXTH870x11 Dual XZ-axis Firmware Summary and Jump Table (continued)Address Routine Description
FXTH870x6Sensors138 Freescale Semiconductor, Inc.14.2.2 Device IdentificationThe bytes assigned to identify the device and its options are described below. This data can be read by use of the TPMS_READ_ID routine.ID12:0 — Device ID within each lot, maximum 8,192 per lotID13:26 — Assembly lot ID, 100 through 16383ID27 — Always 0 for FXTH87 familyID28:31 — Always 0x08 to identify Freescale as supplierTable 88. Device ID Coding SummaryIDAddress RegisterName InitalAddress UpdatedAddressBit 7654321Bit 000 CODE0 $E0A0 $E0A0 Reserved - Firmware Revision/Software Information01 CODE1 $FF10 $FDF2 ES2 ES1 ES0 PRESS ACC1 ACC0 SPCLA SPCLP02 CODE2 $FF11 $FDF3 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID003 CODE3 $FF12 $FDF4 ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID804 CODE4 $FF13 $FDF5 ID23 ID22 ID21 ID20 ID19 ID18 ID17 ID1605 CODE5 $FF14 $FDF6 ID31 ID30 ID29 ID28 ID27 ID26 ID25 ID24Table 89. Device ID Coding DescriptionsField DescriptionCODE07:0ReservedReserved for Freescale firmware description. Note: FXTH870922 = Rel1x, all other part numbers = Rel2xCODE17:5ESRevision number for the multiple-chip-module silicon.000 - MCU version 0111 - MCU version 7CODE14PRESS-HCalibrated range for pressure. The range is a combination of this bit and the PRESS-L bit, below.bit 0 = 0, bit 4 = 0 indicates a 100-450 kPa rangebit 0 = 0, bit 4 = 1 indicates a 100-900 kPa rangeCODE13:2ACCType of accelerometer.00 - None01 - One accelerometer with X-axis orientation10 - One accelerometer with Z-axis orientation11 - Two accelerometers with X- and Z-axis orientationsCODE11Special calibration for accelerometer.0 = standard -240 to +270 g Z-axis1 = extended -270 to +400 g Z-axisCODE10 PRESS-LCalibrated range for pressure. The range is a combination of this bit and the PRESS-H bit, above.bit 0 = 0, bit 4 = 0 indicates a 100-450 kPa rangebit 0 = 0, bit 4 = 1 indicates a 100-900 kPa rangeCODE2:47:0CODE53:0ID27:028-bit serial number for each device. All numbers to be unique with numbering sequence being a sequential counter for each product type.CODE57:4ID31:284-bit number assigned to vendor type.If these bits are unspecified as part of the complete FLASH programming by the customer, then these 4 bits are programmed to binary 1 0 0 0.
FXTH870x6SensorsFreescale Semiconductor, Inc. 13914.2.3 Definition of Signal RangesEach measured parameter (pressure, voltage, temperature, acceleration) results from an ADC10 conversion of an analog signal. This ADC10 result may then be passed by the firmware to the application software as either the raw ADC10 result or further compensated and scaled for an output between one and the maximum digital value minus one. The minimum digital value of zero and the maximum digital value are reserved as error codes.The signal ranges and their significant data points are shown in Figure 113. In this definition the signal source would normally output a signal between SINLO and SINHI. Due to process, temperature and voltage variations this signal may increase its range to SINMIN to SINMAX. In all cases the signal will be between the supply rails, so that the ADC10 will convert it to a range of digital numbers between 0 and 1023. These digital numbers will have corresponding DINMIN, DINLO, DINHI, DINMAX values. The ADC10 digital value is taken by the firmware and compensated and scaled to give the required output code range.Figure 113. Measurement Signal Range DefinitionsDigital input values below DINMIN and above DINMAX are immediately flagged as being out of range and generate error bits and the output is forced to the 0 value. Digital values below DINLO (but above DINMIN) or above DINHI (but not DINMAX) will most likely cause an output that would be less than 1 or greater than 510, respectively. These cases are considered underflow or overflow, respectively. Underflow results will be forced to a value of 1. Overflow results will be forced to a value of 510.SENSORANALOGADC10 RAWDIGITAL CALCULATEDDIGITAL(9-BIT EXAMPLE)(10-BIT CONVERSION)VOLTAGESIGNALSOURCEADC10 FIRMWAREROUTINE5115100125601023512VDD/2VDDVDDSINMAXSINHISINMINSINLODINMAXDINHIDINLODINMINNORMAL CASEUNDERFLOWLOWER ERROR CASEFORCEOUTPUTTO ZEROCASEOVERFLOWCASEFORCEOUTPUTTO 511UPPER ERROR CASE
FXTH870x6Sensors140 Freescale Semiconductor, Inc.Digital values between DINLO and DINHI will normally produce an output between 1 to 510 (for a 9-bit result). In some isolated cases due to compensation calculations and rounding the result may be less than 1 or greater than 510, in which case the underflow and overflow rule mentioned above is used.14.3 Memory Resource UsageThe firmware uses the top 8192 bytes of the FLASH memory map.The firmware uses no specific bytes of the RAM but will cause additional stacking of temporary values.The firmware uses two bytes ($008E and $008F) of the Parameter Registers for global flags for all routines.Software StackThe RESET firmware function sets the SP register to the last address in the RAM. The user can change the default stack location to meet its own application needs.
FXTH870x6SensorsFreescale Semiconductor, Inc. 14115 Development Support15.1 IntroductionThis chapter describes the single-wire BACKGROUND DEBUG mode (BDM), which uses the on-chip BACKGROUND DEBUG controller (BDC) module. 15.1.1 FeaturesFeatures of the BDC module include:• Single pin for mode selection and background communications• BDC registers are not located in the memory map• SYNC command to determine target communications rate• Non-intrusive commands for memory access• ACTIVE BACKGROUND mode commands for CPU register access• GO and TRACE1 commands• BACKGROUND command can wake CPU from STOP or WAIT modes• One hardware address breakpoint built into BDC• Oscillator runs in STOP mode, if BDC enabled• COP watchdog disabled while in ACTIVE BACKGROUND mode15.2 Background Debug Controller (BDC)All MCUs in the HCS08 Family contain a single-wire BACKGROUND DEBUG interface that supports in-circuit programming of on-chip nonvolatile memory and sophisticated non-intrusive debug capabilities. Unlike debug interfaces on earlier 8-bit MCUs, this system does not interfere with normal application resources. It does not use any user memory or locations in the memory map and does not share any on-chip peripherals.BDC commands are divided into two groups:• ACTIVE BACKGROUND mode commands require that the target MCU is in ACTIVE BACKGROUND mode (the user program is not running). ACTIVE BACKGROUND mode commands allow the CPU registers to be read or written, and allow the user to trace one user instruction at a time, or GO to the user program from ACTIVE BACKGROUND mode.• Non-intrusive commands can be executed at any time even while the user’s program is running. Non-intrusive commands allow a user to read or write MCU memory locations or access status and control registers within the BACKGROUND DEBUG controller.Typically, a relatively simple interface pod is used to translate commands from a host computer into commands for the custom serial interface to the single-wire BACKGROUND DEBUG system. Depending on the development tool vendor, this interface pod may use a standard RS-232 serial port, a parallel printer port, or some other type of communications such as a universal serial bus (USB) to communicate between the host PC and the pod. The pod typically connects to the target system with ground, the BKGD/PTA4 pin, RESET, and sometimes VDD. An open-drain connection to reset allows the host to force a target system reset, which is useful to regain control of a lost target system or to control startup of a target system before the on-chip nonvolatile memory has been programmed. Sometimes VDD can be used to allow the pod to use power from the target system to avoid the need for a separate power supply. However, if the pod is powered separately, it can be connected to a running target system without forcing a target system reset or otherwise disturbing the running application program.Figure 114. BDM Tool Connector246NO CONNECT   5 NO CONNECT   31RESETBKGD GNDVDD
FXTH870x6Sensors142 Freescale Semiconductor, Inc.15.2.1 BKGD/PTA4 Pin DescriptionBKGD/PTA4 is the single-wire BACKGROUND DEBUG interface pin. The primary function of this pin is for bidirectional serial communication of ACTIVE BACKGROUND mode commands and data. During reset, this pin is used to select between starting in ACTIVE BACKGROUND mode or starting the user’s application program. This pin is also used to request a timed sync response pulse to allow a host development tool to determine the correct clock frequency for BACKGROUND DEBUG serial communications.BDC serial communications use a custom serial protocol first introduced on the M68HC12 Family of microcontrollers. This protocol assumes the host knows the communication clock rate that is determined by the target BDC clock rate. All communication is initiated and controlled by the host that drives a high-to-low edge to signal the beginning of each bit time. Commands and data are sent most significant bit first (MSB first). For a detailed description of the communications protocol, refer to Section 15.2.2.If a host is attempting to communicate with a target MCU that has an unknown BDC clock rate, a SYNC command may be sent to the target MCU to request a timed sync response signal from which the host can determine the correct communication speed.BKGD/PTA4 is a pseudo-open-drain pin and there is an on-chip pullup so no external pullup resistor is required. Unlike typical open-drain pins, the external RC time constant on this pin, which is influenced by external capacitance, plays almost no role in signal rise time. The custom protocol provides for brief, actively driven speedup pulses to force rapid rise times on this pin without risking harmful drive level conflicts. Refer to Section 15.2.2, for more detail.When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD/PTA4 chooses normal operating mode. When a debug pod is connected to BKGD/PTA4 it is possible to force the MCU into ACTIVE BACKGROUND mode after reset. The specific conditions for forcing ACTIVE BACKGROUND depend upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not necessary to reset the target MCU to communicate with it through the BACKGROUND DEBUG interface.15.2.2 Communication DetailsThe BDC serial interface requires the external controller to generate a falling edge on the BKGD/PTA4 pin to indicate the start of each bit time. The external controller provides this falling edge whether data is transmitted or received.BKGD/PTA4 is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if 512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU system.The custom serial protocol requires the debug pod to know the target BDC communication clock speed. The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source. The BKGD/PTA4 pin can receive a high or low level or transmit a high or low level. The following diagrams show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but asynchronous to the external host. The internal BDC clock signal is shown for reference in counting cycles.Figure 115 shows an external host transmitting a logic 1 or 0 to the BKGD/PTA4 pin of a target HCS08 MCU. The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target senses the bit level on the BKGD/PTA4 pin. Typically, the host actively drives the pseudo-open-drain BKGD/PTA4 pin during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD/PTA4 pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal during this period.
FXTH870x6SensorsFreescale Semiconductor, Inc. 143Figure 115. BDC Host-to-Target Serial Bit TimingFigure 116 shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on BKGD/PTA4 to the perceived start of the bit time in the target MCU. The host holds the BKGD/PTA4 pin low long enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the bit time. The host should sample the bit level about 10 cycles after it started the bit time.Figure 116. BDC Target-to-Host Serial Bit Timing (Logic 1)Figure 117 shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on BKGD/PTA4 to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD/PTA4 pin low for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 cycles after starting the bit time.EARLIEST STARTTARGET SENSES BIT LEVEL10 CYCLESSYNCHRONIZATIONUNCERTAINTYBDC CLOCK(TARGET MCU)HOSTTRANSMIT 1HOSTTRANSMIT 0PERCEIVED STARTOF BIT TIMEOF NEXT BITHOST SAMPLES BKGD/PTA4 PIN10 CYCLESBDC CLOCK(TARGET MCU)HOST DRIVETO BKGD/PTA4 PINTARGET MCUSPEEDUP PULSEPERCEIVED STARTOF BIT TIMEHIGH-IMPEDANCEHIGH-IMPEDANCE HIGH-IMPEDANCEBKGD/PTA4 PINR-C RISE10 CYCLESEARLIEST STARTOF NEXT BIT
FXTH870x6Sensors144 Freescale Semiconductor, Inc.Figure 117. BDM Target-to-Host Serial Bit Timing (Logic 0)15.2.3 BDC CommandsBDC commands are sent serially from a host computer to the BKGD/PTA4 pin of the target HCS08 MCU. All commands and data are sent MSB-first using a custom BDC communications protocol. ACTIVE BACKGROUND mode commands require that the target MCU is currently in the ACTIVE BACKGROUND mode while non-intrusive commands may be issued at any time whether the target MCU is in ACTIVE BACKGROUND mode or running a user application program. Table 90 shows all HCS08 BDC commands, a shorthand description of their coding structure, and the meaning of each command.Coding Structure NomenclatureThis nomenclature is used in Table 90 to describe the coding structure of the BDC commands. Commands begin with an 8-bit hexadecimal command code in the host-to-target direction (most significant bit first)/ = separates parts of the commandd = delay 16 target BDC clock cyclesAAAA = a 16-bit address in the host-to-target directionRD = 8 bits of read data in the target-to-host directionWD = 8 bits of write data in the host-to-target directionRD16 = 16 bits of read data in the target-to-host directionWD16 = 16 bits of write data in the host-to-target directionSS = the contents of BDCSCR in the target-to-host direction (STATUS)CC = 8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)RBKP = 16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint register)WBKP = 16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register)10 CYCLESBDC CLOCK(TARGET MCU)HOST DRIVETO BKGD/PTA4 PINTARGET MCUDRIVE ANDPERCEIVED STARTOF BIT TIMEHIGH-IMPEDANCEBKGD/PTA4 PIN10 CYCLESSPEED-UP PULSESPEEDUPPULSEEARLIEST STARTOF NEXT BITHOST SAMPLES BKGD/PTA4 PIN
FXTH870x6SensorsFreescale Semiconductor, Inc. 145The SYNC command is unlike other BDC commands because the host does not necessarily know the correct communications speed to use for BDC communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host:• Drives the BKGD/PTA4 pin low for at least 128 cycles of the slowest possible BDC clock (The slowest clock is normally the reference oscillator/64 or the self-clocked rate/64.)Table 90. BDC Command SummaryCommandMnemonic Active BDM/Non-intrusive CodingStructure DescriptionSYNC Non-intrusive n/a(1)1. The SYNC command is a special operation that does not have a command code.Request a timed reference pulse to determine target BDC communication speedACK_ENABLE Non-intrusive D5/d Enable acknowledge protocol. Refer to Freescale document order no. HCS08RMv1/D.ACK_DISABLE Non-intrusive D6/d Disable acknowledge protocol. Refer to Freescale document order no. HCS08RMv1/D.BACKGROUND Non-intrusive 90/d Enter ACTIVE BACKGROUND mode if enabled (ignore if ENBDM bit equals 0)READ_STATUS Non-intrusive E4/SS Read BDC status from BDCSCR WRITE_CONTROL Non-intrusive C4/CC Write BDC controls in BDCSCR READ_BYTE Non-intrusive E0/AAAA/d/RD Read a byte from target memoryREAD_BYTE_WS Non-intrusive E1/AAAA/d/SS/RD Read a byte and report statusREAD_LAST Non-intrusive E8/SS/RD Re-read byte from address just read and report statusWRITE_BYTE Non-intrusive C0/AAAA/WD/d Write a byte to target memoryWRITE_BYTE_WS Non-intrusive C1/AAAA/WD/d/SS Write a byte and report statusREAD_BKPT Non-intrusive E2/RBKP Read BDCBKPT breakpoint registerWRITE_BKPT Non-intrusive C2/WBKP Write BDCBKPT breakpoint registerGO Active BDM 08/d Go to execute the user application program starting at the address currently in the PCTRACE1 Active BDM 10/d Trace 1 user instruction at the address in the PC, then return to ACTIVE BACKGROUND modeTAGGO Active BDM 18/d Same as GO but enable external tagging (HCS08 devices have no external tagging pin)READ_A Active BDM 68/d/RD Read accumulator (A)READ_CCR Active BDM 69/d/RD Read condition code register (CCR)READ_PC Active BDM 6B/d/RD16 Read program counter (PC)READ_HX Active BDM 6C/d/RD16 Read H and X register pair (H:X) READ_SP Active BDM 6F/d/RD16 Read stack pointer (SP)READ_NEXT Active BDM 70/d/RD Increment H:X by one then read memory byte located at H:XREAD_NEXT_WS Active BDM 71/d/SS/RD Increment H:X by one then read memory byte located at H:X. Report status and data.WRITE_A Active BDM 48/WD/d Write accumulator (A)WRITE_CCR Active BDM 49/WD/d Write condition code register (CCR)WRITE_PC Active BDM 4B/WD16/d Write program counter (PC)WRITE_HX Active BDM 4C/WD16/d Write H and X register pair (H:X)WRITE_SP Active BDM 4F/WD16/d Write stack pointer (SP)WRITE_NEXT Active BDM 50/WD/d Increment H:X by one, then write memory byte located at H:XWRITE_NEXT_WS Active BDM 51/WD/d/SS Increment H:X by one, then write memory byte located at H:X. Also report status.
FXTH870x6Sensors146 Freescale Semiconductor, Inc.• Drives BKGD/PTA4 high for a brief speedup pulse to get a fast rise time (This speedup pulse is typically one cycle of the fastest clock in the system.)• Removes all drive to the BKGD/PTA4 pin so it reverts to high impedance• Monitors the BKGD/PTA4 pin for the sync response pulseThe target, upon detecting the SYNC request from the host (which is a much longer low time than would ever occur during normal BDC communications):• Waits for BKGD/PTA4 to return to a logic high• Delays 16 cycles to allow the host to STOP driving the high speedup pulse• Drives BKGD/PTA4 low for 128 BDC clock cycles• Drives a 1-cycle high speedup pulse to force a fast rise time on BKGD/PTA4• Removes all drive to the BKGD/PTA4 pin so it reverts to high impedanceThe host measures the low time of this 128-cycle sync response pulse and determines the correct speed for subsequent BDC communications. Typically, the host can determine the correct communication speed within a few percent of the actual target speed and the communication protocol can easily tolerate speed errors of several percent.15.2.4 BDC Hardware BreakpointThe BDC includes one relatively simple hardware breakpoint that compares the CPU address bus to a 16-bit match value in the BDCBKPT register. This breakpoint can generate a forced breakpoint or a tagged breakpoint. A forced breakpoint causes the CPU to enter ACTIVE BACKGROUND mode at the first instruction boundary following any access to the breakpoint address. The tagged breakpoint causes the instruction opcode at the breakpoint address to be tagged so that the CPU will enter ACTIVE BACKGROUND mode rather than executing that instruction if and when it reaches the end of the instruction queue. This implies that tagged breakpoints can only be placed at the address of an instruction opcode while forced breakpoints can be set at any address.The breakpoint enable (BKPTEN) control bit in the BDC status and control register (BDCSCR) is used to enable the breakpoint logic (BKPTEN = 1). When BKPTEN = 0, its default value after reset, the breakpoint logic is disabled and no BDC breakpoints are requested regardless of the values in other BDC breakpoint registers and control bits. The force/tag select (FTS) control bit in BDCSCR is used to select forced (FTS = 1) or tagged (FTS = 0) type breakpoints.15.3 Register DefinitionThis section contains the descriptions of the BDC registers and control bits.This section refers to registers and control bits only by their names. A Freescale-provided equate or header file is used to translate these names into the appropriate absolute addresses.15.3.1 BDC Registers and Control BitsThe BDC has two registers:• The BDC status and control register (BDCSCR) is an 8-bit register containing control and status bits for the BACKGROUND DEBUG controller. • The BDC breakpoint match register (BDCBKPT) holds a 16-bit breakpoint match address. These registers are accessed with dedicated serial BDC commands and are not located in the memory space of the target MCU (so they do not have addresses and cannot be accessed by user programs).Some of the bits in the BDCSCR have write limitations; otherwise, these registers may be read or written at any time. For example, the ENBDM control bit may not be written while the MCU is in ACTIVE BACKGROUND mode. (This prevents the ambiguous condition of the control bit forbidding ACTIVE BACKGROUND mode while the MCU is already in ACTIVE BACKGROUND mode.) Also, the four status bits (BDMACT, WS, WSF, and DVF) are read-only status indicators and can never be written by the WRITE_CONTROL serial BDC command. The clock switch (CLKSW) control bit may be read or written at any time.
FXTH870x6SensorsFreescale Semiconductor, Inc. 14715.3.2 BDC Status and Control Register (BDCSCR)This register can be read or written by serial BDC commands (READ_STATUS and WRITE_CONTROL) but is not accessible to user programs because it is not located in the normal memory map of the MCU. 76543210RENBDM BDMACT BKPTEN FTS CLKSW WS WSF DVFWNormal Reset 00000000Reset inActive BDM: 11001000= ReservedFigure 118. BDC Status and Control Register (BDCSCR)Table 91. BDCSCR Register Field DescriptionsField Description7ENBDMEnable BDM (Permit ACTIVE BACKGROUND Mode) — Typically, this bit is written to 1 by the debug host shortly after the beginning of a debug session or whenever the debug host resets the target and remains 1 until a normal reset clears it.0 BDM cannot be made active (non-intrusive commands still allowed)1 BDM can be made active to allow ACTIVE BACKGROUND mode commands6BDMACTBACKGROUND Mode Active Status — This is a read-only status bit.0 BDM not active (user application program running)1 BDM active and waiting for serial commands5BKPTENBDC Breakpoint Enable — If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select) control bit and BDCBKPT match register are ignored.0 BDC breakpoint disabled1 BDC breakpoint enabled4FTSForce/Tag Select — When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the BDCBKPT match register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register causes the fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue, the CPU enters ACTIVE BACKGROUND mode rather than executing the tagged opcode.0 Tag opcode at breakpoint address and enter ACTIVE BACKGROUND mode if CPU attempts to execute that instruction1 Breakpoint match forces ACTIVE BACKGROUND mode at next instruction boundary (address need not be an opcode)3CLKSWSelect Source for BDC Communications Clock — CLKSW defaults to 0, which selects the alternate BDC clock source.0 Alternate BDC clock source1 MCU bus clock2WSWAIT or STOP Status — When the target CPU is in WAIT or STOP mode, most BDC commands cannot function. However, the BACKGROUND command can be used to force the target CPU out of WAIT or STOP and into ACTIVE BACKGROUND mode where all BDC commands work. Whenever the host forces the target MCU into ACTIVE BACKGROUND mode, the host should issue a READ_STATUS command to check that BDMACT = 1 before attempting other BDC commands.0 Target CPU is running user application code or in ACTIVE BACKGROUND mode (was not in WAIT or STOP mode when BACKGROUND became active)1 Target CPU is in WAIT or STOP mode, or a BACKGROUND command was used to change from WAIT or STOP to ACTIVE BACKGROUND mode1WSFWAIT or STOP Failure Status — This status bit is set if a memory access command failed due to the target CPU executing a WAIT or STOP instruction at or about the same time. The usual recovery strategy is to issue a BACKGROUND command to get out of WAIT or STOP mode into ACTIVE BACKGROUND mode, repeat the command that failed, then return to the user program. (Typically, the host would restore CPU registers and stack values and re-execute the WAIT or STOP instruction.)0 Memory access did not conflict with a WAIT or STOP instruction1 Memory access command failed because the CPU entered WAIT or STOP mode0DVFData Valid Failure Status — This status bit is not used in the MC9S08RA16 because it does not have any slow access memory.0 Memory access did not conflict with a slow memory access1 Memory access command failed because CPU was not finished with a slow memory access
FXTH870x6Sensors148 Freescale Semiconductor, Inc.15.3.3 BDC Breakpoint Match Register (BDCBKPT)This 16-bit register holds the address for the hardware breakpoint in the BDC. The BKPTEN and FTS control bits in BDCSCR are used to enable and configure the breakpoint logic. Dedicated serial BDC commands (READ_BKPT and WRITE_BKPT) are used to read and write the BDCBKPT register but is not accessible to user programs because it is not located in the normal memory map of the MCU. Breakpoints are normally set while the target MCU is in ACTIVE BACKGROUND mode before running the user application program. For additional information about setup and use of the hardware breakpoint logic in the BDC, refer to Section 15.2.4.15.3.4 System Background Debug Force Reset Register (SBDFR) This register contains a single write-only control bit. A serial BACKGROUND mode command such as WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are ignored. Reads always return 0x00.Figure 119. System Background Debug Force Reset Register (SBDFR)76543210R00000000WBDFR(1)1. BDFR is writable only through serial BACKGROUND mode debug commands, not from user programs.Reset 00000000= ReservedTable 92. SBDFR Register Field DescriptionField Description0BDFRBackground Debug Force Reset — A serial ACTIVE BACKGROUND mode command such as WRITE_BYTE allows an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot be written from a user program.
FXTH870x6SensorsFreescale Semiconductor, Inc. 14916 Battery Charge Consumption ModelingThe supply current consumed by the FXTH870x6 can be estimated using the following basic model.16.1 Standby CurrentThe overall charge consumed by the standby features is:Eqn. 12where:QSTDBY = Standby charge over lifetime, tTOT, in mA-hrtTOT = Total lifetime in hoursISTDBY = General standby current in AILF = LFR detector (if used) current in A16.2 Measurement EventsThe overall charge consumed by the measurements is:Eqn. 13where:QMEAS = Total measurement charge over lifetime in mA-secQPRESS = Measurement charge per pressure measurement in A-secQTEMP = Measurement charge per temperature measurement in A-secQVOLT = Measurement charge per voltage measurement in A-secnPRESS = Total number of pressure measurements over lifetimenTEMP = Total number of temperature measurements over lifetimenVOLT = Total number of voltage measurements over lifetime16.3 Transmission EventsThe overall charge consumed by the transmissions is:Eqn. 14where:QXMT = Transmit charge over lifetime, tTOT, in mA-hrQFRM = Transmit charge per frame of data in A-secnXMT = Number of transmissions over lifetimeF = Frames transmitted during each datagram16.4 Total ConsumptionThe overall charge consumed is:Eqn. 15where:QTOT = Total charge over lifetime, tTOT, in mA-hrQSTDBY = Standby charge over lifetime in mA-hrQMEAS = Measurement charge over lifetime in mA-hrQXMT = Transmit charge over lifetime in mA-hrY = Lifetime in yearsSD = Battery self-discharge rate in%/yearAdditional margin in battery capacity can be added to the calculated value of QTOT.QSTDBY tTOTISTDBY ILF+1000--------------------------------------------=QMEAS 11000------------nPRESS QPRESS nTEMP QTEMP nVOLT QVOLT++=QXMTQFRM1000----------------- FnXMT=QTOTQSTDBY QMEAS QXMT++1 Y SD 100–------------------------------------------------------------------------------------=
FXTH870x6Sensors150 Freescale Semiconductor, Inc.17 Electrical Specifications17.1 Maximum RatingsMaximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. The device contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIN and VOUT within the range VSS  (VIN or VOUT)  VDD. Note: Refer to page 169 for description of notes.17.2 Operating RangeThe limits normally expected in the application which define range of operation.Note: Refer to page 169 for description of notes.# Rating Symbol Value Unit100 Supply Voltage (VDD, AVDD)VDD -0.3 to +3.8 V (3)101102103104Input VoltageX1PTA0, PTA1, PTA2, PTA3, PTB0, PTB1BKGD/PTA4, RESETLFA, LFBVINVINVINVIN-0.3 to VDD+0.3-0.3 to VDD+0.3-0.3 to VDD+0.3-0.3 to VDD+0.3VVVV(3)(3)(3)(3)105106107108Input Current X1PTA0, PTA1, PTA2, PTA3, PTB0, PTB1BKGD/PTA4, RESETLFA, LFBIINIINIINIIN±10±10±10±10mAmAmAmA(3)(3)(3)(3)109110Substrate Current InjectionCurrent from any pin to VSS - 0.3 VDCXI, PTA0, PTA1, PTA2, PTA3, PTB0, PTB1, BKGD/PTA4, RESETLFA, LFBISUBISUB6002µAmA(3)(3)111Latchup CurrentCurrent to/from any pin to supply rails + 0.3 VDC ILATCH ±100 mA (3)112113114Electrostatic DischargeHuman Body Model (HBM), all pins other than RFHuman Body Model (HBM), RF pinCharged Device Model (CDM)VESDVESDVESD±2000±3000±500VVV(3)(3)(3)115 Maximum Storage Temperature Range Tstg -50 to +150 °C (3)# Characteristic Symbol Min Typ Max Units200201202203204205206207Operating Supply Voltage (VDD = AVDD)MeasurementsPressure, Temperature, AccelerationVoltageLFR Operation (-20 < TA< +85 °C)RF TransmissionsMCU operation (CPU, ADC10, RAM, TPM1)FLASH write (-40 to +125 °C)FLASH write (-20 to +85 °C)FLASH readParameter registers data retentionVDDVDDVDDVDDVDDVDDVDDVDDVL2.31.82.31.82.32.11.81.23.03.03.03.03.03.03.0—VH3.63.63.63.63.63.63.6—VVVVVVVV(2)(2)(2)(2)(2)(2)(2)(2)208209Operating Temperature RangeContinuous Temperature RangeSTOP1 mode (note 5)TATATL-40-40——TH+125+150°C°C(3)(3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 15117.3 Electrical Characteristics1.8  VDD  3.6, TL  TA  TH, unless otherwise specified.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units300Output High Voltage (ILoad = 5 mA)PTA0, PTA1, PTA2, PTA3, PTB0, PTB1 VOH VDD-0.35 — — V (2)301Output Low Voltage (ILoad = -5 mA)PTA0, PTA1, PTA2, PTA3, PTB0, PTB1 VOL ——0.35V(2)302303Input High Voltage (2.3  VDD  VH)PTA0, PTA1, PTA2, PTA3, PTB0, PTB1, BKGD/PTA4Input High Voltage (VL  VDD  2.3)PTA0, PTA1, PTA2, PTA3, PTB0, PTB1, BKGD/PTA4VIHVIH0.7 x VDD0.85 x VDD————VV(2)(3)304305Input Low Voltage (2.3  VDD  VH)PTA0, PTA1, PTA2, PTA3, PTB0, PTB1, BKGD/PTA4Input Low Voltage (VL  VDD  2.3)PTA0, PTA1, PTA2, PTA3, PTB0, PTB1, BKGD/PTA4VILVILVSSVSS——0.35 x VDD0.28 x VDDVV(2)(3)306307308Input High Current (at min VIH)BKGD/PTA4PTA0, PTA1, PTA2, PTA3 (pulldown off)PTA0, PTA1, PTA2, PTA3 (pulldown active)IIHIIHIIH-1-10———+1+1+120µAµAµA(1)(2)(2)309310311Input Low Current (at max VIL)BKGD/PTA4PTA0, PTA1, PTA2, PTA3, PTB0, PTB1 (pullup off)PTA0, PTA1, PTA2, PTA3 (pullup active)IILIILIIL-120-1-120———0+10µAµAµA(1)(2)(2)312Pin Capacitance (3 V)BKGD/PTA4, PTA0, PTA1, PTA2, PTA3, PTB0, PTB1 C 0 — 15 pF (3)
FXTH870x6Sensors152 Freescale Semiconductor, Inc.17.4 Power Consumption (MCU)1.8  VDD  3.6, TA 0 to 125 °C unless otherwise specified.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units400401402403404405406Standby Supply CurrentSTOP1 mode, LFR, LVD and TR all offTA = -40 °C, VDD = 3.0 VTA = 0 °C, VDD = 3.0 VTA = 25 °C, VDD = 1.8 VTA = 25 °C, VDD = 3.0 VTA = 25 °C, VDD = 3.6 VTA = 70 °C, VDD = 3.0 VTA = 125 °C, 3.0 V VDD 3.6 VISTDBY1ISTDBY1ISTDBY1ISTDBY1ISTDBY1ISTDBY1ISTDBY1——————————0.5———0.90.90.80.70.91.513µAµAµAµAµAµAµA(3)(3)(3)(2)(3)(3)(3)407408409410411412Standby Supply CurrentSTOP4 mode, LFR and TR off, LVD or RFLVD onTA = -40 °C, VDD = 3.0 VTA = 0 °C, VDD = 3.0 VTA = 25 °C, VDD = 1.8 VTA = 25 °C, VDD  3.0 VTA = 70 °C, VDD = 3.0 VTA = 125 °C, 3.0 V VDD 3.6 VISTDBY4ISTDBY4ISTDBY4ISTDBY4ISTDBY4ISTDBY4—————————73——1001009595100140µAµAµAµAµAµA(3)(3)(3)(2)(3)(3)413414415416MCU Operate Current (1.8  VDD  3.0 V, -40 °C   TA  125 °C)Instruction Speed = 0.333 MIP/fBUS0.5 MHz fBUS, BUSCLKS[1:0] = 111 MHz fBUS, BUSCLKS[1:0] = 102 MHz fBUS, BUSCLKS[1:0] = 014 MHz fBUS, BUSCLKS[1:0] = 00IDDIDDIDDIDD————0.720.941.462.501.01.11.72.9mAmAmAmA(3)(3)(3)(1)417418Standby Current Adder for Temperature RestartVDD = 1.8 V, TA = 125 °CVDD = 3.0 V, TA = 125 °CIDDIDD——10101515µAµA(3)(3)419MCU Wakeup Consumption (+25 °C, 3 V)From STOP1 to first instruction, fBUS = 4 MHz QWAKE 0 0.05 0.1 µA-sec (3)420421External Battery ModelSeries impedance at end-of-lifeOpen circuit voltage at end-of-lifeZEOLVEOL—2.7——60—V(4)(4)
FXTH870x6SensorsFreescale Semiconductor, Inc. 15317.5 Control Timing1.8  VDD  3.6, TL  TA  TH, unless otherwise specified.Note: Refer to page 169 for description of notes.Figure 120. MCU Startup DelaysFigure 121. Control Timing Test Load for Digital Pins# Characteristic Symbol Min Typ Max Units500501502503504Internal Clock FrequencyInitial startup frequencyFinal frequencyLimited temperature range, -20 °C to +85 °CFull temperature range, -40 °C to +125 °CComplete stabilization time (see Figure 120)fOSCINITfOSCfOSCtOSCSU67.26.8—8——300108.18.11000MHzMHzMHzsec(3)(2)(3)(3)505 MCU Bus Frequency fBUS — 0.5 fOSC —MHz(2)506507Medium frequency clock (MFO)Limited temperature range, -20 °C to +85 °CFull temperature range, -40 °C to +125 °CfMFOfMFO115106125—128128kHzkHz(2)(3)508509Low frequency clock (LFO)Limited temperature range, 0 °C to +70 °CFull temperature range, -40 °C to +125 °CfLFOfLFO833770——12501429HzHz(2)(3)510 LFR clock (derived from LFRO) fLFRO 122 129 135 kHz (1)511512Power-On Reset ResponseSupply voltage rise timeRecovery time below VDD = 0.5 VtVDDRtVDDOFF—0——170secsec(3)(3)513514MCU Wakeup Time (see Figure 120)From STOP1 to first instruction, fBUS = 4 MHzFrom STOP4 to first instruction, fBUS = 4 MHztMCUWAKEtMCUWAKE——5010070155secsec(3)(3)515 FLASH Data Retention Time tDR 10 — — year (4)HFO ClockSTOP1 Wakeupexecute instructionstOSCSUtMCUWAKEHFO = fOSCINIT  HFO = fOSC10.91 kTEST POINTVDD50 pF6.32 k
FXTH870x6Sensors154 Freescale Semiconductor, Inc.17.6 Voltage Measurement Characteristics1.8  VDD  3.6, TL  TA  TH, unless otherwise specified.Note: Refer to page 169 for description of notes# Characteristic Symbol Min Typ Max Units600601602Lower LVD detect threshold (note 15)VDD fallingVDD risingVoltage drop detection time (note 16)VLVDLVLVDLtLVDL1.791.87—1.88——1.962.0310VVsec(2)(3)(3)603604605Higher LVD detect threshold (note 15)VDD fallingVDD risingVoltage drop detection time (note 16)VLVDHVLVDHtLVDH2.052.12————2.32.310VVsec(1)(3)(3)606607608Lower LVW detect threshold (LVWV = 0, note 15)VDD fallingVDD risingVoltage drop detection time (note 16)VLVWLVLVWLtLVWL2.052.12————2.32.310VVsec(1)(3)(3)609610611Higher LVW detect threshold (LVWV = 1, note 15)VDD fallingVDD risingVoltage drop detection time (note 16)VLVWHVLVWHtLVWH2.282.34————2.542.6110VVsec(1)(3)(3)612 RF LVD detect threshold, VDD falling (note 15)VLVDRF 1.60 1.79 1.95 V (2)613 Voltage drop detection time (note 16)tLVDRF ——10sec (3)614615Power-On Reset Voltage (note 15)Rising Voltage to RecoverFalling Voltage to ResetVPORRVPORF—0.8——2.1—VV(3)(3)616617618619620621622623624625Internal Voltage (VDD, monotonic response).VCODE = 0 = 58 = 88 = 108 = 128= 158= 208= 238 = 255Voltage sensitivityVINTVINTVINTVINTVINTVINTVINTVINTVINTVINT—1.62.02.22.42.73.23.5——FAULT1.82.12.32.52.83.33.6FAULT10—2.02.22.42.62.93.43.7——VVVVVVVVVmV/count(3)(3)(3)(3)(3)(1)(3)(3)(3)(3)626627628629External Voltage (PTA[1:0], monotonic response, conversion is ratiometric to VDD)GxCODE, where x = 0, 1 refers to PTA0 or PTA1Voltage sensitivityADC INLADC DNLnVEXTINLDNL——-1-11023 (VIN/VDD)VDD/1023————+1+1countV/countLSBLSB(4)(4)(3)(3)630631632633634635Voltage Measurement(internal voltage or external pin)Sensor measurement time (note 7)Peak current (note 8)Power consumption (note 22)Raw measurement, 10-bitCompensation, 8-bitBasic compensated reading, 8-bitFull compensated reading, 8-bittVMIVQVQVQVQV——————0.453.20.130.400.530.530.533.90.30.640.90.9msmAµA-secµA-secµA-secµA-sec(3)(3)(3)(3)(3)(3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 15517.7 Temperature Measurement Characteristics2.3  VDD  3.6, TL  TA  TH, unless otherwise specified.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units700701702703704705706707708709Temperature measurement (monotonic response) (note 11)TCODE = 0= 15= 35= 55= 84= 125= 140= 180= 255Temperature sensitivityTTTTTTTTTT—-45-23-3266781120——FAULT-40-200297085125FAULT1.0—-35-173327389130——°C°C°C°C°C°C°C°C°C°C/count(3)(3)(1)(3)(3)(3)(1)(3)(3)(3)710 Temperature measurement stability range (note 10)TSTAB — — 2 count (3)711712713714Thermal Shutdown Recovery (TRE = 1)High Re-Arming Temperature (TRH = 1, note 13)High Reset Temperature (TRH = 1)Low Re-Arming Temperature (TRH = 0, note 13)Low Reset Temperature (TRH = 0)TREARMHTRESETHTREARMLTRESETL—95-90—————125——4°C°C°C°C(4)(4)(4)(4)715716717718719720Temperature MeasurementSensor measurement time (note 7)Peak current (note 8)Power consumption (note 22)Raw measurement, 12-bitCompensation, 8-bitBasic compensated reading, 8-bitFull compensated reading, 8-bittTMITQTQTQTQT——————0.63.00.190.430.620.620.73.90.30.60.820.82msmAµA-secµA-secµA-secµA-sec(3)(3)(3)(3)(3)(3)
FXTH870x6Sensors156 Freescale Semiconductor, Inc.17.8 Pressure Measurement Characteristic (100 to 450 kPa ranges)2.3  VDD  3.6, TL  TA  TH, unless otherwise specified.Pressure accuracy specified for pressure drops slower than 1 kPa/sec. * FSL D-FMEA class 163.**FSL D-FMEA class 164.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units800801802803804805806807808809810811812813814815816817818819820Pressure Measurement (note 6)0 °C TA +70 °CPCODE = 0= 1= 10= 255= 499= 510= 511-20 °C TA 0 °C, 70 °C TA 85 °CPCODE  = 0= 1= 10= 255= 499= 510= 511-40 °C TA -20 °C, 85 °C TA 125 °CPCODE  = 0= 1= 10= 255= 499= 510= 511PPPPPPPPPPPPPPPPPPPPP—93100268436443——89.596.5264.5432.5439.5——83.290.2258.2426.2433.2—FAULT100107275443450FAULTFAULT100107275443450FAULTFAULT100107275443450FAULT—107114282450457——110.5117.5285.5453.5460.5——116.8123.8291.8459.8466.8—kPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPa(3)(4)(3)(3)(3)(4)(3)(3)(4)(3)(1)(3)(4)(3)(3)(4)(3)(3)(3)(4)(3)821* Pressure Sensitivity  PRANGE — 0.688 — kPa/count (3)822** Pressure Measurement Stability Range PSTAB — — 6 count (3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 15717.9 Pressure Measurement Characteristic (100 to 900 kPa Ranges)2.3  VDD  3.6, TL  TA  TH, unless otherwise specified.Pressure accuracy specified for pressure drops slower than 1 kPa/sec.* FSL D-FMEA class 194.**FSL D-FMEA class 195.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units900901902903904905906907908909910911912913914915916917918919920Pressure Measurement (note 6)0 °C TA +70 °CPCODE = 0= 1= 10= 255= 499= 510= 511-20 °C TA 0 °C, 70 °C TA 85 °CPCODE = 0= 1= 10= 255= 499= 510= 511-40 °C TA -20 °C, 85 °C TA 125 °CPCODE = 0= 1= 10= 255= 499= 510= 511PPPPPPPPPPPPPPPPPPPPP—90106491874890——85101486869885——7692477860876—FAULT100116501884900FAULTFAULT100116501884900FAULTFAULT100116501884900FAULT—110126511894910——115131516899915——124140525908924—kPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPakPa(3)(4)(3)(3)(3)(4)(3)(3)(4)(3)(1)(3)(4)(3)(3)(4)(3)(3)(3)(4)(3)921* Pressure Range PRANGE — 1.572 — kPa/count (3)922** Pressure Measurement Stability Range PSTAB — — 4 count (3)923924Pressure Sensitivity to Z-Axis Acceleration(note 12)0-500g>500gPACCPACC0-6.5—-4.50-2Pa/gPa/g(3)(3)925926927928929930Pressure MeasurementSensor measurement time (note 7)Peak current (note 8)Power consumption (note 22Raw measurement, 10-bitCompensation, 9-bitBasic compensated reading, 9-bitFull compensated readingtPMIPQPQPQPQP——————4.03.02.11.83.94.34.43.43.252.35.35.85msmAµA-secµA-secµA-secµA-sec(3)(3)(3)(3)(3)(3)
FXTH870x6Sensors158 Freescale Semiconductor, Inc.17.10 Optional Acceleration Sensor Characteristics17.10.1 Example Z-Axis Acceleration Sensor Calculations (similar for X-Axis)As an example, consider that the dynamic firmware routine has returned STEP = 6 indicating offset step 6, and AZCODE = 256. First, refer to lines 1001 and 1009 to retrieve the step number 6 values for AZCODE = 510 and for AZCODE = 1. Then apply the following to calculate the sensitivity for offset step 6:Eqn. 16Once the sensitivity AZ-6 has been calculated, the acceleration AZ can be calculated with the following transfer function:Eqn. 17Another example where STEP has been returned as 15 and AZCODE has been returned as 256:Eqn. 18Then:Eqn. 19AZ-6 AZ-6 @ AZCODE510 AZ-6 @ AZCODE1–510=42.1 42.9––510=0.167g per AZCODE integer=AZAZ-6 AZCODE AZ-6 @ AZCODE1AZ-6–+ =0.167 256 42.9–0.167–+==0.3g–AZ-15 AZ-15 @ AZCODE510 AZ-15– @ AZCODE1+510=402 315–510=0.171g per AZCODE integer=AZAZ-15 AZCODE AZ-15 @ AZCODE1AZ-15–+=0.171 256 315 0.171–+== 359g
FXTH870x6SensorsFreescale Semiconductor, Inc. 15917.10.2 Acceleration Measurement Characteristics (Z and X ranges) 2.3  VDD  3.6, TL  TA  TH, unless otherwise specified.Acceleration accuracy specified for pressure drops slower than 1 kPa/sec. # Characteristic Symbol FXTH870x02family (Z-axis) FXTH870x11family (Z-axis) FXTH870x11family (X-axis) UnitsMin Typ Max Min Typ Max Min Typ Max1000Acceleration Measurement (note 9)ACODE = 0 A6— FAULT — — FAULT — — FAULT — g (3)100110021003100410051006100710081009= 1= 16= 196= 250= 256= 262= 316= 496= 510A6A6A6A6A6A6A6A6A6-51.9-49.2-14.7-4.2-3-2.15.431.233.0-42.9-40.4-10.3-1019.739.842.1-33.2-31.1-5.72.134.214.449.351.8SeeOffset STEP = 7SeeOffset STEP = 7ggggggggg(3)(3)(3)(3)(1)(3)(3)(3)(3)1010 = 511 A6— FAULT — — FAULT — — FAULT — (3)1011 Average Accel Sensitivity (1 to 510 counts) Aaverage — 0.167 — — 0.118 — — 0.039 — g/count (3)1012 Average Offset step at acceleration output = 256. VDD = 3 VAINCR 37 39.5 42 — 30 — — 10 — g/OffsetStep(3)1013 Acceleration measurement stability range (note 10)ASTAB — — 4 — — 5 — — 4 count (3)1014101510161017Minimum range of accelerationmeasurement for each offset code.Average Offset STEP= 0ACODE = 1= 256= 510A0-304—-215-271-231-191238—-167———-210-180-150——————-80-70-60———g(3)1018101910201021Offset STEP = 1ACODE = 1= 256= 510A1-264—-173-234-193-153-204—-133———-180-150-120——————-70-60-50———g(3)1022102310241025Offset STEP = 2ACODE = 1= 256= 510A2-223—-132-197-156-114170—97———-150-120-90——————-60-50-40———g(3)1026102710281029Offset STEP = 3ACODE = 1= 256= 510A3-181—-88-158-117-75-136—-62———-120-90-60——————-50-40-30———g(3)1030103110321033Offset STEP = 4ACODE = 1= 256= 510A4-140—-48-120-78-36-100—-24———-90-60-30——————-40-30-20———g(3)1034103510361037Offset STEP = 5ACODE = 1= 256= 510A5-88-45-2-81-394-74-339———-60-300——————-30-20-10———g(3)1038103910401041Offset STEP = 6 ACODE = 1= 256= 510A6See lines 1001-1009 ———-30030——————-20-100———g(3)
FXTH870x6Sensors160 Freescale Semiconductor, Inc.Note: Refer to page 169 for description of notes.1042104310441045Offset STEP = 7ACODE = 1= 256= 510A7-103274-5388014487-3224603060+33874-14-36-10010-6+314g(3)1046104710481049Offset STEP = 8ACODE = 1= 256= 510A823—100357812147—142———306090——————01020———g(3)1050105110521053Offset STEP = 9ACODE = 1= 256= 510A961—1387511816088—183———6090120——————102030———g(3)1054105510561057Offset STEP = 10ACODE = 1= 256= 510A10 97—173115158201133—229———90120150——————203040———g(3)1058105910601061Offset STEP = 11ACODE = 1= 256= 510A11 134—210155198241176—273———120150180——————304050———g(3)1062106310641065Offset STEP = 12ACODE = 1= 256= 510A12 170—246195238281221—317———150180210——————405060———g(3)1066106710681069Offset STEP = 13ACODE = 1= 256= 51A13 204—280235279322267—364———180210240——————506070———g(3)1070107110721073Offset STEP = 14ACODE = 1= 256= 510A14 240—317275319362310—408———210240270——————607080———g(3)1074107510761077Offset STEP = 15ACODE = 1= 256= 510A15 274—350315359402356—455———240270300——————708090———g(3)2.3  VDD  3.6, -20 °C  TA  85 °C, unless otherwise specified.# Characteristic Symbol All families UnitsMin Typ Max1078 Acceleration cross-axis sensitivity  ACROSS -5 — 5 % (4)1079 Acceleration sensitivity variation AZ-15 0 15 % (4)108010811082108310841085Z-axis Acceleration MeasurementSensor measurement time (note 7)Peak current (note 8)Power consumptionRaw measurement, 10-bitCompensation, 9-bitBasic compensated reading, 9-bitFull compensated reading, 9-bittAMIAQCQCQCQC——————4.03.02.11.94.04.44.83.43.62.36.06.0msmAA-secA-secA-secA-sec(3)(3)(3)(3)(3)(3)# Characteristic Symbol FXTH870x02family (Z-axis) FXTH870x11family (Z-axis) FXTH870x11family (X-axis) UnitsMin Typ Max Min Typ Max Min Typ Max
FXTH870x6SensorsFreescale Semiconductor, Inc. 16117.11 LFR Sensitivity2.3  VDD  3.6, -20 °C  TA  85 °C, unless otherwise specified. Detection and no detection criteria defined by notes 19 and 20.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units11001101110211031104110511061107LFR Input Sensitivity in carrier mode, 125 kHz carrier, LFCDTM = 256 s UOSVery Low Sensitivity, SENS(1:0) = 00Detect level, LFA:B No detect level, LFA:BLow Sensitivity, SENS(1:0) = 00Detect level, LFA:BNo detect level, LFA:BHigh Sensitivity, SENS[1:0] = 10, CHK125 = 01Detect level, LFA:BNo detect level, LFA:BSensitivity Shift in High Sensitivity, SENS[1:0] = 10, CHK125 = 00Detect level, LFA:B, (typical difference observedbetween CHK125 = 00 and 01No detect level, LFA:B, No detect level, LFA:B (typical difference observed between CHK125 = 00 and 01)SDET_VLSNODET_VLSDET_LSNODET_LSDET_HSNODET_HSDET_HSNODET_H—24—2—0.5————————-0.12-0.1260—14—3.5———mV p-pmV p-pmV p-pmV p-pmV p-pmV p-pmV p-pmV p-p(4)(4)(4)(4)(2)(2)(3)(3)11081109LFR Input Sensitivity in data mode125 kHz carrier, LFCDTM = 64 secValid reception of 10 consecutive frames of 16-bit Manchester bit preamble + 9T SYNC +16-bit ID + 4 bytes of data. Continuously ONHigh Sensitivity, SENS[1:0] = 10, CHK125 = 01Data detect levelData no detect levelSPER_HSNOPER_H—0.25——3.5—mV p-pmV p-p(2)(2)11101111LFR Input Sensitivity in data mode125 kHz carrier, LFCDTM = 64 secValid reception of 10 consecutive frames of 16-bit Manchester bit preamble + 9T SYNC +16-bit ID + 4 bytes of data. Continuously ONLow Sensitivity, SENS[1:0] = 01, CHK125 = 00Data detect levelData no detect levelSPER_LSNOPER_L—2——14—mV p-pmV p-p(3)(3)
FXTH870x6Sensors162 Freescale Semiconductor, Inc.17.12 LFR Characteristics2.3  VDD  3.6, -20 °C  TA  85 °C, unless otherwise specified.Note: Refer to page 169 for description of notes.17.13 LFR Power Consumption2.3  VDD  3.6, -20 °C  TA  85 °C, unless otherwise specified. All parameters based upon DEQEN = 0 setting.Note: Refer to page 169 for description of notes.# Characteristic Symbol Min Typ Max Units1200LF Input Signal CharacteristicsRelative to High Sensitivity Data Mode Always Detect, SPER_HDynamic Range, DEQEN = 0 VIN 56 — — dB (3)120112021203LFR Input Signal Characteristics(Manchester Data Mode)Modulation Depth (Data 1 - Data 0)/Data 1Data bit timeBit Duty CycleMRtDATAMDC7024845—256—10026455%sec%(3)(3)(3)12041205LFR Differential Input (LFA to LFB, Figure 122)Differential Resistance Differential Capacitance (C3)RLFDFCLFDF12—3.846MpF(3)(3)1206120712081209LFR Carrier Frequency Range VALEN = 1, LFCDTM = 256 secAlways accepted carrierAlways rejected carrier, rejected frequencies upper limitAlways rejected carrier, rejected frequencies lower limitVALEN = 0, LFCDTM = 256 msHigh Cutoff Freq, 5 mV p-p input, SENS[1:0] = 00fLFCfLFCHfLFCLfLFCO121.25—210———— 350128.7580——kHzkHzkHzkHz(3)(3)(3)(4)1210 LFR Detector Power Up Settling Time (2 LFO cycles) tPU 1.4 2.0 2.6 ms  (4)12111212LFR Preamble Decoder Settling TimeData Mode Only, LFCDTM plus tDECLPSM = 0LPSM = 1tDECtDEC————200400sec sec (4)(4)# Characteristic Symbol Min Typ Max Units130013011302130313041305LFR Supply Current, Carrier Detect ModeMonitor for carrier with VALEN = 0, LPSM = 1TA = 25 °C, 3.0 V VDDTA = -40 °C to 125 °C, 2.3 to 3.6 V VDDFrequency validation withVALEN = 1, LPSM = 1 and CHK125 = 00TA = 25 °C, 3.0 V VDDTA = -40 °C to 125 °C, 2.3 to 3.6 V VDDFrequency validation withVALEN = 1, LPSM = 1 and CHK125 = 01TA = 25 °C, 3.0 V VDDTA = -40 °C to 125 °C, 2.3 to 3.6 V VDDILFRILFRILFR——————3.9—5.6—5.8——5.5—7.5—8.0µAµAµA(3)(3)(1)13061307LFR Supply Current, Manchester Data ModeDecoding of data stream after carrier detectedTA = 25 °C, 3.0 V VDDTA = -40 °C to 125 °C, 2.3 to 3.6 V VDD ILFR——11.8——13.5 µA (3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 163Figure 122. LFR Detector Input Equivalent Circuit+–VASLSVLFINZSPad leakagedue toinput protectionSIMPLIFIED INPUT PIN EQUIVALENTCIRCUITRADINInputSIMPLIFIED CHANNEL SELECTCIRCUITPad leakagedue toinput protection RADINSIMPLIFIED CHANNEL SELECTCIRCUITAmplifierCSR1R2RS, CSRSLCRRecommended RC < 15.3 secLFALFBRLFDFCLFDF
FXTH870x6Sensors164 Freescale Semiconductor, Inc.17.14 RF Output Stage1.8  VDD  3.6, TL  TA  TH, unless otherwise specified.Power output based on using Dynamic RF Power Correction firmware routine.Output load of 50  resistance as shown in Figure 125 unless otherwise specified.MCU in STOP1 mode during all RF tests.RF output will shutdown when the total RF IDD causes VDD to fall below 1.8 V (VDD = VBATT - IBATT x RBATT). See Figure 126.# Characteristic Symbol Min Typ Max Units14001401Nominal Output Power with 50  matching network (note 21)315 MHz, TA = 25 °C, VDD = 3 V, PWR[4:0] = 01110434 MHz, TA = 25 °C, VDD = 3 V, PWR[4:0] = 01111PRFPRF4.03.55.24.96.06.0dBmdBm(1)(1)1402*Nominal Output Power with 50  matching networkat maximum power step, PWR[4:0] = 10100.Temperature and voltage range definedby Figure 123 and Figure 124.PRF 3——dBm(3)140314041405Programmable Power AdjustmentPWR[4:0] = 00000 through 11111Low Power Mode (PWR[4:0] = 00000)Range (nominal, (PWR[4:0] > 00000)Adjustment step (-1.5 to +8 dBm)PLPMPRFPADJ—-1.5—-10—0.5—8.0—dBmdBmdBm(3)(3)(3)1406Programmable Frequency StepsCarrier & FSK Deviation(AFREQ[12:0] and BFREQ[12:0]) fSTEP — 3.174 — kHz (3)1407 External Crystal Frequency (note 14)fXTAL — 26.000 — MHz (3)1408 Fixed portion of RF start process, tS-RCTS — — 300 sec (3)1409 Variable portion of RF start process Bits — 3 — bit times (4)1410 Total RF transmit start time from write of SEND bit to start of RF @ 2,000 bps tRF = tS-RCTS + (Bits * bps-1)tRF2 ——1.8ms(3)1411 Total RF transmit start time from write of SEND bit to start of RF @ 9,600 bps tRF = tS-RCTS + (Bits * bps-1)tRF9.6 — — 613 sec (3)1412 Total RF transmit start time from write of SEND bit to start of RF @ 20,000 bps tRF = tS-RCTS + (Bits * bps-1)tRF20 — — 450 sec (3)1413 OOK Modulation Depth MOOK 50 — — dBc (3)1414Manchester Encoding Data RateBit Rate Dependent on accuracy of MFO (note 18). DR — — ±5 % (3)1415 Modulation Duty-Cycle (OOK and FSK) DC 45 50 55 % (3)1416 XTAL Oscillator Margin (over 26 MHz) (note 17)ML600——(4)14171418Harmonic 2 Level (315 and 434 MHz bands, with matching reference network)VDD = 3 V, TA = 25 °C, PWR[4:0] = 011101.8  VDD  3.6, TL  TA  TH, power step adjusted toreach the targeted power in each domainH2H2——-35-25-22-20dBcdBc(3)(3)14191420Harmonic 4 Level and above (315 and 434 MHz bands, with matching reference network)VDD = 3 V, TA = 25 °C, PWR[4:0] = 011101.8  VDD  3.6, TL  TA  TH, power step adjusted toreach the targeted power in each domainH4H4————-30-30dBcdBc(3)(3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 165* FSL D-FMEA class 306.Note: Refer to page 169 for description of notes.14211422Harmonic 3 Level (315 and 434 MHz bands, with matching reference network)VDD = 3 V, TA = 25 °C, PWR[4:0] = 011101.8  VDD  3.6, TL  TA  TH, power step adjusted toreach the targeted power in each domainH3H3——-31-27-28-25dBcdBc(3)(3)14231424142514261427142814291430Noise for BOOST = 0Phase Noise (315 MHz)fRF  10 kHzfRF  100 kHzfRF  1 MHzPhase Noise (434 MHz)fRF  10 kHzfRF  100 kHzfRF  1 MHzSpurious Noise (315 and 434 MHz bands)fRF fREFOccupied Bandwidth (Korea, MIC 2007-63)For FSK up to 45 kHz and 9600 bit/sec andfor OOK up to 9600 bit/secAnalyzed setup: RBW = VBW up to 10 kHz,Span up to 1.25 MHz, and MaxHoldNPHNPHNPHNPHNPHNPHNSPUROBWK————————-86-92-84-84-89-82-45—-78-86-82-76-83-80-40180dBc/HzdBc/HzdBc/HzdBc/HzdBc/HzdBc/HzdBckHz(3)(3)(3)(3)(3)(3)(3)(3)143114321433143414351436Noise for BOOST = 1Phase Noise (315 MHz)fRF  10 kHzfRF  100 kHzfRF  1 MHzSpurious Noise (315 MHz bands)fRF fREFOccupied Bandwidth (Japan, ARIB STD-T93)For FSK up to 45 kHz and 9600 bit/sec For OOK up to 9600 bit/secAnalyzed setup: RBW = VBW up to 30 kHz,Span up to 3.5 MHz, and MaxHoldNPHNPHNPHNSPUROBWJOBWJ——————-75-80-95-45——-67-76-93-40400600dBc/HzdBc/HzdBc/HzdBckHzkHz(3)(3)(3)(3)(3)(3)1437 RF Oscillator Frequency Accuracy, XCO (note 21) excluding external crystal and component variations fXCO -30 — +30 ppm (3)# Characteristic Symbol Min Typ Max Units
FXTH870x6Sensors166 Freescale Semiconductor, Inc.17.15 Power Consumption RF Transmissions1.8  VDD  3.6, TA 25 °C unless otherwise specified.Note: Refer to page 169 for description of notes.Using the TPMS_RF_DYNAMIC_POWER firmware routine (see Section 14) allows adjusting power step in order to compensate variations of output power versus temperature and voltage. This routine will be associated to a part to part trimming that initially adjusts the power step to compensate for process variations.Both these trim and look-up table allow to guarantee by characterization the typical values of power consumption as presented below (average values among 100 parts plus improvements prediction from design).Figure 123. Dynamic Power Adjustment - 315 MHz# Characteristic Symbol Min Typ Max Units15001501150215031504150515061507RF Supply Transmission CurrentVDD = 3.0 V, PWR[4:0] set for nominal 5 dBm315 MHZ Power delta for BOOST = 1315 MHZ Carrier Frequency, BOOST = 0Data 1, FSK or OOK434 MHZ Carrier Frequency, BOOST = 0Data 1, FSK or OOKInterframe period, IFPD = 0. Interframe period, IFPD = 0, 1.8 VDD 3.6,TL TA THInterframe period, IFPD = 1, DRLPEN = 1,1.8 VDD 3.6, TL TA THInterframe period, IFPD = 1, DRLPEN = 0Interframe period, IFPD = 1, DRLPEN = 0, 1.8 VDD 3.6, TL TA THIDDIDDIDDIDDIDDIDDIDDIDD—————————6.06.6617—2077—0.55 7.07.66967892996125mAmAmAAAAAA(2)(1)(1)(3)(3)(3)(3)(3) 3dBm5dBm-40°C 125°C25°C 60°C0°C1.8V2.5V3.6V3dBm3dBm.3V5.3mA 5.5mA5.3mA 5.5mA 6mA 6.2mA6.6mA6.3mA5.8mA5.7mA6mA3dBm5dBm-40°C 125°C25°C 60°C0°C1.8V2.5V3.6V3dBm3dBm.3V5.3mA 5.5mA5.3mA 5.5mA 6mA 6.2mA6.6mA6.3mA5.8mA5.7mA6mA3dBm5.0mA 5.3mA 6.2mA 6.4mA5dBm5.2mA 5.4mA6.2mA6.4mA 6.5mA 5.8mA5.8mA
FXTH870x6SensorsFreescale Semiconductor, Inc. 167Figure 124. Dynamic Power Adjustment - 434 MHzFigure 125. RF Output Power Measurement ConfigurationFigure 126. Battery Performance Test Configuration3dBm5dBm1.8V2.5V3.6V3dBm3dBm.3V6.3mA 6.5mA5.5mA 5.7mA 6.7mA 6.8mA7.8mA7.1mA6.4mA6.8mA6.6mA-40°C 125°C25°C 60°C0°C3dBm5dBm1.8V2.5V3.6V3dBm3dBm.3V6.3mA 6.5mA5.5mA 5.7mA 6.7mA 6.8mA7.8mA7.1mA6.4mA6.8mA6.6mA-40°C 125°C25°C 60°C0°C3dBm5.6mA 5.8mA 6.9mA 7.1mA5dBm5.8mA 6.2mA6.9mA7.0mA 7.5mA 7.0mA6.6mAFXTH870xxxVDDRFL1RVSSL2100 pF 100 nF1 nF50 AVDDAVSSFXTH870xxxIBATT1 F2.7VRBATT VBATT
FXTH870x6Sensors168 Freescale Semiconductor, Inc.18 Mechanical Specifications18.1 Maximum RatingsMaximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. The device contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIN and VOUT within the range VSS  (VIN or VOUT)  VDD. Note: Refer to page 169 for description of notes.18.2 Media CompatibilityMedia compatibility is based on media and test method described in Freescale specification 12MWS10081G, Media Test for TPMS MCM Automotive Pressure Sensors. Consult your sales representative for more details and specific requirements.18.3 Mounting RecommendationsThe package should be mounted with the pressure port pointing away from the axis of tire rotation so that centrifugal force will propel any contaminants out of the pressure port. In cases where the application must orient the pressure port pointing inward, care must be taken to assure contaminants do not reach inside the pressure port.A plugged port will exhibit no change in pressure and can be cross checked in the user’s software using the method described in Section 10.1.Please refer to application note AN1902 for proper printed circuit board attributes and recommendations.# Rating Symbol Value Unit18001801Maximum Pressure (absolute)ContinuousPulsed, 5 seconds, 25 °Cpmaxpmax15002000kPakPa(3)(3)1802Centrifugal Force Effects (Z-axis)Sustained acceleration (Z-axis) gCENT 2600 g (3)1803 Powered Shock (peak, 0.1 ms, half-sine, 6-axis) gshock 6000 g (3)1804 Drop Test (onto concrete, unpowered) hDROP 1.2 m (3)18051806Pressure Sensor ResonanceResonant frequencyDamping RatiofP0QP5.51MHz (4)(4)180718081809Optional X-axis Accelerometer Sensor ResonanceResonant frequency (no-peak, over-damped)Damping RatioMaximum acceleration before limit stops are reachedfX0QXgMAX12.50.1180kHzg(4)(4)(4)181018111812Optional Z-axis Accelerometer Sensor ResonanceResonant frequency (no-peak, over-damped)Damping RatioMaximum acceleration before limit stops are reachedfZ0QZgMAX95800kHzg(4)(4)(4)1813 Package Weight w 0.30 gm (3)
FXTH870x6SensorsFreescale Semiconductor, Inc. 169Notes:1. Parameters tested 100% at final test.2. Parameters tested 100% at unit probe.3. Verified by characterization, not tested in production.4. For information only, may be determined by simulation.5. Total of three hours over the life of the device.6. Fully compensated pressure reading using TPMS_READ_PRESSURE followed by TPMS_COMP_PRESSUREroutine with single reading and 500 Hz low-pass filter ON. 7. Measurement times for one complete compensated reading; and times dependent on clock tolerances.8. Peak currents measured as the current over 10 MCU bus cycles immediately after the ADC wakes up the MCUusing the external network shown in Figure 126 with RBATT equal to zero-ohm resistance.9. Fully compensated acceleration reading using TPMS_READ_ACCELERATION followed byTPMS_COMP_ACCELERATION routine with single reading and 500 Hz low-pass filter ON. 10. Total range of variation over 30 consecutive measurements, using compensated output format.11. Temperature error for MCU or RFM powered up at less the 10% duty-cycle12. Package mounted with pressure port facing radially outward from axis of rotation.13. Temperature shutdown points trimmed at final test. Limits when TRH ($180F bits 6:4) overwritten by customerapplication to 0x06.14. Suggested crystal is NDK NX3225SA, 26.000 MHz.15. Low voltage detection and warning thresholds defined for voltage change rates less than 20 mV/s. Hysteresisthresholds may decrease above 85 °C.16. Response time to VDD of more than 100 mV below the minimum VDD falling threshold.17. Crystal oscillator margin is the value of the total series resistance including the XTAL ESR, that can be appliedbefore the XCO does not start up. This definition does not define any specific start up time.18. Accuracy of the RF data rate when using the data buffer is dependent on the overall oscillator function (i.e.including external crystal and internal circuit tolerances).19. LFR detection is tested to assure > 90% message success rate. LFR no detection is tested to assure < 10%message success rate. In carrier detect mode the applied input pulse is at least 2x the LFCDTM selected. In allcases the envelop of the input waveform must have a RC time constant less than 15.3 sec. LF sensitivity limitsare measured while the device is in the STOP1 mode, which is characterized as a worst-case condition; sensi-tivity in the other modes are improved versus the STOP1 modes.20. Using firmware release $28 or higher for FXTH870x02, FXTH870x11 and FXTH870x12; using firmware release$11 for FXTH870x22. 21. Actual final test value degraded by losses in the tester. Correlation study done as characterization to infer actualvalue.22. Power consumption values refer to the firmware data flow in Figure 57. The BASIC Compensated value includesjust the raw measurement and compensation routine for that parameter. Other raw readings needed for full com-pensation will be pulled from the UUMA. The FULL Compensated value includes taking all required raw read-ings and using the compensation routine for that parameter.
FXTH870x6Sensors170 Freescale Semiconductor, Inc.19 Package OutlineFigure 127. QFN Case Outline
FXTH870x6SensorsFreescale Semiconductor, Inc. 171Figure 128. QFN Case Outline
FXTH870x6Sensors172 Freescale Semiconductor, Inc.Figure 129. QFN Case Outline
FXTH870x6SensorsFreescale Semiconductor, Inc. 173
FXTH870x6Sensors174 Freescale Semiconductor, Inc.20 Revision HistoryRev. 0, 05/2014• Initial data sheet.Rev. 1, 07/2014• Corrected Ordering Information table.• Figure 5: Updated paragraph in figure to include PCB traces for the LFA/LFB and note regarding L1. • Section 5.4: Updated register figure to include TRO bit on Bit 0. Added Description to Table 19 and update reserved bit fields.• Section 6.1: Updated last paragraph in section.• Section 10.1: Added NOTE.• Section 10.4: Added NOTE.• Section 14.2.2: Added definitions for ID codes.• Section 17.10.2: Changed column content reference from See lines 1042-1045 to See Offset STEP = 7. Corrected Min, Typ and Max values for lines 1042-1045 for FXTH870x11 family (X-Axis).• Section 17.12: Updated Characteristic and Min Value for line 1200. Updated Characteristic and note reference for line 1210.Rev. 1.1, 07/2014• Section 17.4: Updated Symbols for lines 400 through 412 and lines 417 and 418.• Section 17.6: Updated Max value for line 612 and updated note reference and Symbol for line 613. • Section 17.7: Updated note references for lines 711-714.• Section 17.9: Updated Typ and Max values for line 924. Updated Typ values for lines 927 through 930. • Section 17.10.2: Deleted line 1078 and updated Typ values for lines 1083 through 1086.• Section 17.11: Updated Typ value for line 1106. Deleted lines 1108-1113, duplicated information.• Section 17.12: Updated Symbols for lines 1208 through 1210 and updated Characteristics for lines 1208 and 1209.• Section 17.13: Update Max value for line 1301.• Section 18.1: Updated Max value for line 1800.Rev. 1.2, 08/2014• First page: Updated bullet “Six multipurpose GPIO pins” to “Seven multipurpose GPIO pins” and sub-bullets• Section 2.3.8: Updated paragraph with additional content.• Section 2.3.9: Updated title and paragraphs with corrected pin numbers and added text to paragraph.• Section 2.3.12: Updated content in paragraph.• Section 3.5.4: Updated header title for I/O Pins, deleted (Optional PTA[3:0]).• Section 4.3: Table 3, updated Bit contents for Address columns $0000, $0001 and $0003.• Section 6: Updated content in first two paragraphs. Updated Figure 29, added boxes and note for emphasis on PTA[3:0] usage. Updated title and column heads in Table 32 and added rows for PTAPE, PTBPE, PTADD and PTBDD. Updated first paragraph in Section 6.5.• Section 7: Section 7.1: Updated 1st bullet. Section 7.2.1: Updated content in first paragraph. Section 7.5: Updated bulleted text. Sections 7.5.2 and 7.5.3: Updated tables and figures to show bits reserved for firmware or factory test. Section 7.6: Updated content in second paragraph. Section 7.6.3: Updated content in paragraph. Section 7.6.4: Updated list number 3 and 4.• Section 12.17.1: Updated LF Enable description in Table 59. Section 12.17.8: Added Note after Table 67 regarding setting the CHK125 bits and updated Description for Field 1-0, CHK125[1:0].• Section 17.3: Updated Characteristic for line 311.• Section 17.12: Updated Min and Max values for line 1206 and updated Characteristic.• Section 17.14: Redefined lines 1408 through 1411 and added line 1412, • Section 18.1: Updated Value for line 1802. • Notes page: Updated Notes 18,19, 20 and added note 25.
FXTH870x6SensorsFreescale Semiconductor, Inc. 175Rev. 1.3, 09/2014• Section 4.3: Table 3, updated Addresses $0001 and $0003 Bit 4 column to reserved and text corrected to [3:0].• Section 5.11.2: Table 26, updated Description for BKGDPE Field• Section 6: Updated 2nd paragraph. Updated column heads for Table 32. Figure 31 and Table 34, updated Bit 4 to Reserved and updated Field name. Figure 32 and Table 35, updated Bit 4 to Reserved and updated Field name.• Section 7.6.3: Updated paragraph contents.• Section 12.17.4: Table 62, removed “Use Software polling” from LFCDIE and LFIDIE Descriptions.• Section 12.17.8: Table 67, updated Description for CHK125.• Section 14.2.1.1: Table 86, changed Routine and Description columns for E084 to Reserved. Table 87, changed Routine and Description columns for E090 to Reserved.• Section 17.1: Added Value to line 108.• Section 17.4: Updated Characteristic for line 412.• Section 17.6 Updated Value for line 631.• Section 17.8: Added asterisk notes to lines 821 and 822.• Section 17.9: Added asterisk notes to lines 921 and 922.• Section 17.13: Updated introduction paragraph.• Section 17.14: Added asterisk note to line 1402.• Section 17.15: Updated Characteristic for line 1500. Updated Typ value for line 1505. • Notes page: Updated note 2.Rev. 1.4, 01/2015• Section 17.3: Updated Characteristic column for lines 303, 305, 307, 308, 310, and 311. Changed note reference for lines 306 and 309. Updated Min and Max values for lines 308 and 311.• Section 17.6: Changed note reference for lines 603, 606, and 609.• Section 17.6: Updated Max value for line 711. Updated Min Value for line 712.• Section 17.15: Changed note reference for lines 1502 and 1504. Replaced Figures 123 and 124.• Notes page: Updated note 13.• Replaced case outline with current version.Rev. 1.5, 02/2015• Section 14.2.2: Table 88, added two columns, “Initial Address” and “Updated Address”.
Document Number: FXTH870x6Rev. 1.502/2015Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document.Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. How to Reach Us:Home Page: freescale.com Web Support: freescale.com/support Freescale, the Freescale logo and CodeWarrior are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2015 Freescale Semiconductor, Inc.

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