Datamars TIWIBLECA Radio Module User Manual V2 2x

Tru-Test Limited Radio Module V2 2x

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Users Manual Rev 042914

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1. Users Manual Rev 042914
2. Users Manual Rev 043014

Users Manual Rev 042914

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 2 of 29 MODULE FOOTPRINT AND PIN DEFINITIONS To apply the module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 3 and 4. Not all the pins on the module may be used, as some are reserved for future functionality. Figure 1 Pinout (Top View)

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 3 of 29 PIN DESCRIPTIONS Module Pin Name I/O Type BufferType Logic Level Description 1 VBAT PI - - Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)2 BT_FUNC5 DO 4 mA 1.8 VDC HOST_WU (*)3 WL_UART_DBG DIO 4 mA 1.8 VDC WL_UART_DBG4 WLAN_IRQ DO 4 mA 1.8 VDC WLAN Interrupt Request 5 BT_EN DI -1.8 VDC Bluetooth Enable6 FM_EN DI -1.8 VDC NOT SUPPORTED, CONNECT TO GND7 WL_RS232_RX DI -1.8 VDC WLAN TEST UART RX (*) 8 WL_RS232_TX DO 4 mA 1.8 VDC WLAN TEST UART TX (*) 9 FM_I2S_FSYNC DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT10 WL_EN DI -1.8 VDC WLAN Enable11 VIO PI - - POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN12 GND GND - - Ground13 SDIO_D3 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP14 SDIO_D2 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP15 SDIO_D1 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP16 SDIO_D0 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP17 SDIO_CMD DIO 8 mA 1.8 VDC HOST PULL UP18 SDIO_CLK DI -1.8 VDC HOST PULL UP19 SLOW_CLK DI -1.8 VDC SLEEP CLOCK (32 kHz) 20 FM_IRQ DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT21 FM_SDA DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT22 FM_SCL DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT23 FM_I2S_CLK DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT24 FM_I2S_DI DI 4 mA 1.8 VDC NOT SUPPORTED, CONNECT TO GND25 FM_I2S_DO DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT26 FM_AUD_RIN AI - - NOT SUPPORTED, CONNECT TO GND27 FM_AUD_LIN AI - - NOT SUPPORTED, CONNECT TO GND28 FMRFOUT AO - - NOT SUPPORTED, NO CONNECT29 FMRFIN AI - - NOT SUPPORTED, CONNECT TO GND30 GND GND - - Ground31 FM_AUD_ROUT AO - - NOT SUPPORTED, NO CONNECT

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 4 of 29 Module Pin Name I/O Type BufferType Logic Level Description 32 FM_AUD_LOUT AO - - NOT SUPPORTED, NO CONNECT33 AUD_FSYNC DIO 4 mA 1.8 VDC PCM I/F34 HCI_RX DI 8 mA 1.8 VDC Bluetooth HCI UART RX (*) 35 HCI_RTS DO 4 mA 1.8 VDC Bluetooth HCI UART RTS (*) 36 HCI_TX DIO 8 mA 1.8 VDC Bluetooth HCI UART TX 37 AUD_CLK DO 4 mA 1.8 VDC PCM I/F (*)38 AUD_OUT DO 4 mA 1.8 VDC PCM I/F (*)39 HCI_CTS DI 4 mA 1.8 VDC Bluetooth HCI UART CTS (*) 40 AUD_IN DI 4 mA 1.8 VDC PCM I/F (*)41 BT_FUNC2 DO 4 mA 1.8 VDC Bluetooth Wakeup / DC2DC Mode (*)42 BT_FUNC4 DO 4 mA 1.8 VDC BT_UARTD (DEBUG) (*) 43 VDD_LDO_CLASS_1P5 NC - - VBAT VOLTAGE PRESENT, NO CONNECT44 GND GND - - Ground45 GND GND - - Ground46 GND GND - - Ground47 GND GND - - Ground48 ANT RF - Antenna terminal for WLAN and Bluetooth (Note [1]) 49 GND GND - - Ground50 GND GND - - Ground51 GND GND - - Ground52 GND GND - - GroundPI=Power Input PO=Power Output DI=Digital Input (1.8 VDC Logic Level) DO=Digital Output (1.8 VDC Logic Level) AI=Analog Input AO=Analog Output AIO = Analog Input/Output RF= RF Port GND=Ground Note [1]: Antenna terminal presents d.c. short circuit to ground. (*) indicates that pin is capable of bidirectional operation, but is used as the type shown. Table 1 Module Pin Descriptions All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V logic, then level shifters MUST be used.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 5 of 29 ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on controlling and conditioning the tests using the control software application. Other control conditions may require these values to be re-characterized by the customer. Absolute Maximum Ratings Parameter Min Max Unit Power supply voltage (VBAT)(4)(5) -0.5 +5.5 V Digital supply voltage (VIO) -0.5 2.1 V Voltage on any GPIO -0.5 VIO + 0.5 V Voltage on any Analog Pins(3) -0.5 2.1 V RF input power, antenna port +10 dBm Operating temperature(6) -40 +85 ºC Storage temperature -55 +125 ºC 1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not covered by the warranty. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V, VDD_LDO_CLASS1P5=3.6V 3. Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM, FMRFINM, FMAUDLIN, FMAUDRIN, FMAUDLOUT, FMAUDROUT 4. The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is used). 5. Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative. 6. The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC. Table 2 Absolute Maximum Ratings Recommended Operating Conditions Parameter Min Typ Max Unit VBAT 3.0 3.6 4.8 V VIO 1.62 1.8 1.92 V VIH 0.65 x VIO - VIO V VIL 0 - 0.35 x VIO V VOH @ 4, 8 mA VIO-0.45 - VIO V VOL @ 4, 8 mA 0 - 0.45 V Ambient temperature range -40 25 85 ºC Table 3 Recommended Operating Conditions

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 6 of 29 General Characteristics Parameter Min Typ Max Unit WLAN RF frequency range 2412 2472 MHz WLAN RF data rate 1 802.11 b/g/n rates supported 65 MbpsBT RF frequency Range 2402 2480 MHz Table 4 General Characteristics Power Consumption - WLAN Parameter Test Conditions Min Typ Max Unit CCK (802.11b) TX Current 2437 MHz, VBAT =3.6V, Tamb=+25°C Po=20dBm, 11 Mbps CCK L=1200 bytes, tdelay (idle)=4 S - 280 - mA OFDM (802.11g) TX Current 2437 MHz, VBAT =3.6V, Tamb=+25°C Po=14.5 dBm, 54 Mbps OFDM L=1200 bytes, tdelay (idle)=4S - 185 - mA OFDM (802.11n) TX Current 2437 MHz, VBAT =3.6V, Tamb=+25°C Po=12.5dBm, 65 Mbps OFDM L=1200 bytes, tdelay (idle)=4S - 165 - mA CCK (802.11b) RX Current - 100 - mA OFDM (802.11g) RX Current - 100 - mA OFDM (802.11n) RX Current - 100 - mA Dynamic Mode [1] - <1.2 - mA [1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in Listen Mode. Table 5 WLAN Power Consumption

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 7 of 29 Power Consumption - Bluetooth Parameter Test Conditions Min Typ Max Unit GFSK TX Current Constant Transmit, DH5, PRBS9 - 45 - mA EDR TX Current Constant Transmit, 2DH5,3DH5, PRBS9 - 43 - mA GFSK RX Current Constant Receive, DH1 - 35 - mA EDR RX Current Constant Receive, 2DH5, 3DH5 - 41 - mA Deep Sleep Current Deep Sleep Mode - 70 - µA Table 6Bluetooth Power Consumption DC Characteristics – General Purpose I/O Parameter Test Conditions Min Typ Max Unit VIO Current - 16 mA Logic input low, VIL 0 - 0.35 x VIO V Logic input high, VIH 0.65 x VIO - VIO V Logic output low, VOL (Full Drive) Iout = 8 mA 0 - 0.45 V Iout = 4 mA 0 - 0.45 V Logic output low, VOL (Reduced Drive) Iout = 1 mA 0 - 0.112 V Iout = 0.09 mA 0 - 0.01 V Logic output high, VOH (Full Drive) Iout = -8 mA VIO-0.45 - VIO V Iout = -4 mA VIO-0.45 - VIO V Logic output high, VOH (Reduced Drive) Iout = -1 mA VIO-0.112 - VIO V Iout = -0.3 mA VIO-0.033 - VIO V Table 7 DC Characteristics General Purpose I/O

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 8 of 29 WLAN RF Characteristics WLAN Transmitter Characteristics (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Unit 11 Mbps CCK (802.11b) TX Output Power 11 Mbps CCK , 802.11(b) Mask Compliance, 35% EVM RMS power over TX packet - 20 - dBm 9 Mbps OFDM (802.11g) TX Output Power 9 Mbps OFDM , 802.11(g) Mask Compliance, -8 dB EVM RMS power over TX packet - 19 - dBm 54 Mbps OFDM (802.11g) TX Output Power 54 Mbps OFDM, 802.11(g) Mask Compliance, -25 dB EVM RMS power over TX packet - 14.5 - dBm 6.5 Mbps OFDM (802.11n) TX Output Power 6.5 Mbps OFDM, 802.11(n) Mask Compliance, -5 dB EVM RMS power over TX packet - 19 - dBm 65 Mbps OFDM (802.11n) TX Output Power 65 Mbps OFDM, 802.11(n) Mask Compliance, -28 dB EVM RMS power over TX packet - 12.5 - dBm Table 8 WLAN Transmitter RF Characteristics

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 9 of 29 WLAN Receiver Characteristics (TA=25°C, VBAT=3.6 V) [1] Parameter Test Conditions Min Typ Max Unit 1 Mbps CCK (802.11b) RX Sensitivity 8% PER - -97 - dBm 11 Mbps CCK (802.11b) RX Sensitivity 8% PER - -89 - dBm 9 Mbps OFDM (802.11g) RX Sensitivity 10% PER - -90 - dBm 54 Mbps OFDM (802.11g) RX Sensitivity 10% PER - -76 - dBm 6.5 Mbps OFDM (802.11n) RX Sensitivity 10% PER - -91 - dBm 65 Mbps OFDM (802.11n) RX Sensitivity 10% PER - -73 -- dBm 11 Mbps CCK (802.11b) RX Overload Level 8% PER - - -10 dBm 6 Mbps OFDM(802.11g) RX Overload Level 10% PER - - -20 dBm 54 Mbps OFDM(802.11g) RX Overload Level. 10% PER - - -20 dBm 65 Mbps OFDM(802.11n) RX Overload Level 10% PER - - -20 dBm [1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes. Table 9 WLAN Receiver RF Characteristics

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 10 of 29 Bluetooth RF Characteristics Bluetooth Transmitter GFSK Characteristics, Class 1.5 (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Bluetooth Spec Unit GFSK RF Output Power - 9.5 - - dBm EDR RF Output Power - 7 - dBm Power Control Step Size 2 4 8 2-8 dB EDR Relative Power -2 1 -4/+1 dB Table 10 Bluetooth Transmitter RF Characteristics Bluetooth Receiver Characteristics (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max Bluetooth Spec Unit GFSK Sensitivity BER=0.1% - -92 - -70 dBm EDR 2 Mbps Sensitivity BER=0.01% - -91 - -70 dBm EDR 3 Mbps Sensitivity BER=0.01% - -82 - -70 dBm GFSK Maximum Input Level BER=0.1% - -5 - -20 dBm EDR 2 Maximum Input Level BER=0.1% - -10 - - dBm EDR 3 Maximum Input Level BER=0.1% - -10 - - - Table 11 Bluetooth Receiver RF Characteristics

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 11 of 29 BluetoothLow Energy RF Characteristics Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5 (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max BT Spec Unit GMSK RF Output Power - 10 - - dBm Power Control Step Size 2 4 8 2-8 dB (1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS command. Table 12 Bluetooth Low Energy Transmitter RF Characteristics Bluetooth BLE Receiver Characteristics (TA=25°C, VBAT=3.6 V) Parameter Test Conditions Min Typ Max BT Spec Unit GMSK Sensitivity PER = 30.8% - -92 - -70 dBm GMSK Maximum Input Level PER = 30.8% - -5 - -20 dBm Table 13 Bluetooth Low Energy Receiver RF Characteristics

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 12 of 29 WLAN POWER-UP SEQUENCE The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the Bluetooth and FM cores are disabled. Figure 2 Power-up Sequence Requirements 1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC". 2. VBAT, VIO, and SLOWCLK must be available before WL_EN. 3. T wakeup = T1 + T2 The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC. T1=~55ms The duration of T2 depends on: Operating system – Host enumeration for the SDIO/WSPI – PLL configuration – Firmware download – Releasing the core from reset – Firmware initialization

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 13 of 29 WLAN POWER-DOWN SEQUENCE Notes: 1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 3 Module Power-down Sequence Requirements 1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will stay high. 2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and using the FREF (e.g BT) it will stay high. 3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec before it is re-asserted.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 14 of 29 BLUETOOTH POWER-UP SEQUENCE The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled; the WLAN core is disabled. Notes: 1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown 2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only Figure 4 Bluetooth Power-up Sequence Power up requirements: 1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC. 2. VDDS and SLOWCLK must be stable before releasing BT_EN. 3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 15 of 29 BLUETOOTH POWER-DOWN SEQUENCE Notes: 1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 5 Bluetooth Power-down Sequence The module indicates completion of Bluetooth power up sequence by asserting HCI_RTS low. This occurs up to 100 ms after BT_EN goes high.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 16 of 29 ENABLE SCHEME The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands. 1. Each core is operated independently by asserting each EN signal to Logic '1'. In this mode it is possible to control each core asynchronously and independently. 2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of Bluetooth. IRQ OPERATION 1. The default state of the WLAN_IRQ prior to firmware initialization is 0. 2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes its state to 1. 3. A WLAN firmware interrupt is handled as follows: a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the WLAN_IRQ line (host must be configured as active-low or falling-edge detect). b. After the host is available, depending on the interrupt priority and other host tasks, it masks the firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line). c. The host reads the internal register status to determine the interrupt sources - the register is cleared after the read. d. The host processes in sequence all the interrupts read from this register e. The host unmasks the firmware interrupts. 4. The host is ready to receive another interrupt from the WLAN device.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 17 of 29 SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 14. The external slow clock must be stable before the system exits from shut down mode. Parameter [1] Condition Symbol Min Typ Max Unit Input slow clock frequency 32768 Hz Input slow clock accuracy WLAN, BT +/-250 ppm Input transition time Tr/Tf – 10% to 90% Tr/Tf 100 ns Frequency input duty cycle 30 50 70 % Input voltage limits Square wave, DC coupled VIH 0.65 x VDDS VDDS Vpeak VIL 0 0.35 x VDDS Input impedance 1 MW Input capacitance 5 pF Rise and fall time 100 ns Phase noise 1 kHz -125 dBc/Hz [1]Slow clock is a fail safe input Table 14 Slow Clock Source Requirements

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 18 of 29 BLUETOOTHHCI UART Figure 6 Bluetooth UART Timing Table 15 Bluetooth UART Timing

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 19 of 29 Figure 7 Bluetooth UART Data Frame Table 16 Bluetooth UART Data Frame

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 20 of 29 SDIO INTERFACE TIMING Table 17 SDIO Interface Read (see Figure 8) Figure 8 SDIO Single Block Read Table 18 SDIO Interface Write (see Figure 9) Figure 9 SDIO Single Block Write

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 21 of 29 SDIO CLOCK TIMING Table 19 SDIO Clock Timing Figure 10 SDIO Clock Timing

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 23 of 29 CLEANING In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.  Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.  Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.  Ultrasonic cleaning could damage the module permanently. OPTICAL INSPECTION After soldering the Module to the host board, consider optical inspection to check the following:  Proper alignment and centering of the module over the pads.  Proper solder joints on all pads.  Excessive solder or contacts to neighboring pads, or vias. REWORK The module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. SHIPPING, HANDLING, AND STORAGE Handling The modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. ESD protection may destroy or damage the module permanently. Moisture Sensitivity Level (MSL) Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use. After opening packaging, devices that will be subjected to reflow must be mounted within 72 hours of factory conditions (<30°C and 60% RH) or stored at <10% RH. Bake devices for 48 hours at 125°C. Storage Please use this product within 6 months after receipt. Any product used after 6 months of receipt needs to have solderability confirmed before use. The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperatures above this range.) Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. Do not store in direct sunlight. The product should not be subject to excessive mechanical shock.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 24 of 29 Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 25 of 29 AGENCY CERTIFICATIONS FCC ID: XOQTIWIBLECA, 15.247. IC ID: 8521A-TIWIBLECA, RSS 210 Model: AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 26 of 29 Industry Canada Statements This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 1.3dBi (Johanson Chip). Antennas not included in this list or having a gain greater than 1.3 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. List of all Antennas Acceptable for use with the Transmitter 1) Johanson 2450AT43B100 chip antenna. L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une communication réussie. Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 1,3 dBi (Johanson Chip). Antennes pas inclus danscette liste ou d'avoir un gain supérieur à 1.3dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms. Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur 1) Antenne Johanson puce 2450AT43B100.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 27 of 29 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The Module has been certified for integration into products only by OEM integrators under the following conditions: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. Le module de a été certifié pour l'intégration dans des produits uniquement par des intégrateurs OEM dans les conditions suivantes: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité avec la FCC et de l'Industrie Canada, multi-émetteur procédures produit. Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 28 of 29 OEM LABELING REQUIREMENTS FOR END-PRODUCT The module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: XOQTIWIBLECA” “Contains Transmitter Module IC: 8521A-TIWIBLECA” Or “Contains FCC ID: XOQTIWIBLECA” “Contains IC: 8521A-TIWIBLECA” The OEM of the Module must only use the approved antenna(s) listed above, which have been certified with this module. Le module de est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, comme par exemple le terminaldans lequel le module est installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant: “Contient Module émetteur FCC ID: XOQTIWIBLECA" “Contient Module émetteur IC: 8521A-TIWIBLECA" ou “Contient FCC ID: XOQTIWIBLECA" “Contient IC: 8521A-TIWIBLECA" L’OEM du module ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module.

TRANSCEIVER MODULE DATASHEET The information in this document is subject to change without notice. Page 29 of 29 OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must include the following information in a prominent location: This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. Other user manual statements may apply. L'intégrateur OEM ne devrait pas fournir des informations à l'utilisateur final en ce qui concerne la façon d'installer ou de retirer ce module RF ou modifier les paramètres RF connexes dans le manuel utilisateur du produit final. Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en vue: Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC et Industrie Canada, multi-émetteur procédures produit. Autres déclarations manuel de l'utilisateur peuvent s'appliquer.

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