1977_Optoelectronics_Designers_Catalog 1977 Optoelectronics Designers Catalog
User Manual: 1977_Optoelectronics_Designers_Catalog
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Hewlett- Packard 'Componen~s
A decade of intensive solid state research, the development of
advanced manufacturing techniques and continued expansion
has enabled Hewlett-Packard to become a high volume
supplier of quality, competitively priced LED displays, LED
lamps, isolators, and photodetectors.
In addition to our broad product line, Hewlett-Packard also
offers the following services: immediate delivery from any of
our authorized stocking distributors, applications support,
special QA testing, and a one year guarantee on all of our
optoelectronic products.
This package of products and services has enabled HewlettPackard to become a recognized leader in the optoelectronic
industry.
1IIIIr IIIICI~
Hewlett-Packard is one of the world's leading designers and manufacturers of electronic,
medical, analytical, and computing instruments and systems, diodes, transistors, and
optoelectronic products. Since its founding in Palo Alto, California, in 1939, HP has done
its best to offer only products that represent significant technological advancements.
To maintain its leadership in instrument and component technology, Hewlett-Packard
invests heavily in new product development. Research and development expenditures
traditionally average about 10 percent of sales revenue, and 1,500 engineers and scientists
are assigned the responsibilities of carrying out the company's various Rand 0 projects.
HP produces more than 3,500 products at 30 domestic divisions in California, Colorado,
Oregon, Idaho, Massachusetts, New Jersey and Pennsylvania and at overseas plants
located in the German Federal Republic, Scotland, France, Japan, Singapore, Malaysia
and Brazil.
However, for the customer, Hewlett-Packard is no farther away than the nearest
telephone. Hewlett-Packard currently has sales and service offices located around the
world.
These field offices are staffed by trained engineers, each of whom has
responsibility of providing technical assistance and data to customers.
communications network has been established to link each field office
and with corporate offices. No matter what the product or the request,
be accommodated by a single contact with the company.
the primary
A vast
with the factories
a customer can
Hewlett-Packard is guided by a set of written objectives. One of these is "to provide
products and services of the greatest possible value to our customers". Through
application of advanced technology, efficient manufacturing, and imaginative marketing,
it is the customer that the more than 30,000 Hewlett-Packard people strive to serve.
Every effort is made to anticipate the customer's needs, to provide the customer with
products that will enable more efficient operation, to offer the kind of service and
reliability that will merit the customer's highest confidence, and to provide all of this at a
reasonable price.
To better serve its many customers' broad spectrum of technological needs, HewlettPackard publishes several catalogs. Among these are:
• Electronic Instruments and Systems
for Measurement/Computation (General Catalog)
• DC Power Supply Catalog
• Medical Instrumentation Catalog
• Analytical Instruments for
Chemistry Catalog
• Coax. and WIG Measurement Accessories Catalog
• Diode and Transistor
Catalog
All catalogs are available at no
charge from your local HP
sales office.
\
This Optoelectronics Designer's Catalog contains detailed, up-to-date specifications on
our complete optoelectronic product line. It is divided into five major product sections:
Solid State Lamps, Solid State Displays, Optocouplers, Emitters, and PIN Photodiodes. It
also includes an Index on optoelectronic Application Notes which are available from any
of the Hewlett-Packard Sales and Service Offices listed on page 150, and from any of the
Distributors listed on page 198.
How To Use This Catalog
Three methods are incorporated for locating components:
• a Table of Contents that allows you to locate components by
their general description,
• a Numeric Index that lists all components by part
number, and
• a Selection Guide for each product group giving a
brief overview of the product line.
How To Order
All Hewlett-Packard components may be ordered through any of the Sales and Service
Offices listed on page 200. In addition, for immediate delivery of Hewlett-Packard
optoelectronic components, contact any of the world-wide stocking distributors listed on
page 198.
Hewlett-Packard assumes no responsibility for the use of any circuits described herein
and makes no representations or warranties, express or implied, that such circuits are
free from patent infringement.
iii
\
Numeric Index ............................................................. v
Solid State Lamps
Selection Guide . . .. . . . .. . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . .. . . . . . . . . . . . . .. . . . ..
Red Lamps ...................................................................
Red, High Efficiency Red, Yellow and Green Lamps .............................
Integrated Lamps ............................................................
Hermetically Sealed Lamps ...................................................
Panel Mounting Kit ...........................................................
2
-6
20
38
42
48
Solid State Displays
Selection Guide .................................................... '. . . . . . . ..
Red, High Efficiency Red, Yellow and Green
Seven Segment Displays . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Red Seven Segment Displays .................................................
Integrated Displays ..........................................................
Hermetically Sealed I ntegrated Displays ......................................
Alphanumeric Displays ......................................................
Chips ......................................................................
50
56
74
98
109
121
129
Optocouplers
Selection Guide ............................................................
High Speed Optocouplers ...................................................
Lowlnput Current/High Gain Optocouplers ...................................
High Reliability OptocQuplers ...............................................
138
140
166
178
Emitters
Selection Guide ................................................... 187
Emitters ........................................................... 188
PIN Photodiodes
Selection Guide .......................................... 187
PIN Photodiodes
. . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . .. . . . .. .. 192
Appendix
Application Note Index ................................. 196
Distributor Stocking Locations .......................... 198
Hewlett-Packard Sales and Service Offices ....... . . . . . . .. 200
Profile and Inquiry Card
iv
o
IIIIIIIIC IIIII~
EMITTERS
HEMT-3300
HEMT-6000
188
190
PHOTO DETECTORS
5082-4203
5082-4204
5082-4205
5082-4207
5082-4220
_ _ _ __
_ _ _ __
_ _ _ __
_ _ _ __
_ _ _ __
192
192
192
192
192
OPTICALL Y COUPLED
ISOLATORS
TX-4365[1] _
See6N134TXV
TXB-4365[1] _ See6N134 TXVB
5082-4350[1] _ _ _ See6N135
5082-4351[1] _ _ _ See6N136
5082-4352[2]_ See HCPL-2502
5082-4354[2]_ See HCPL-2530
5082-4355[2]_ See HCPL-2531
5082-4360[1]--- See6N137
5082-4361 [2]- See HCPL-2601
5082-4364[2]- See HCPL-2630
5082-4365[1]--- See6N134
5082-4370[1]--- See6N138
5082-4371[1]--- See6N139
HCPL-2502
HCPL-2530
HCPL-2531
HCPL-2601
HCPL-2602
HCPL-2630
HCPL-2730
HCPL-2731
HCPL-2770
4N45
4N46
6N134
6N134 TXV
6N134TXVB
6N135
6N136
6.N137
6N138
6N139
140
144
144
152
156
162
170
170
182
174
174
178
178
178
140
140
148
166
166
LAMPS
HLMP-6203
HLMP-6204
HLMP-6205
1 N5765 (5082-4420)
1 N6092 (5082-4620)
1 N6093 (5082-4520)
1 N6094 (5082-4920)
JAN 1 N5765
JANTX 1 N5765
5082-4100
5082-4101
14
14
14
42
42
. 42
42
42
42
16
16
5082-4150
5082-4160
5082-4190
5082-4403
5082-4415
5082-4420
5082-4440
5082-4444
5082-4468
5082-4480
5082-4483
5082-4484
5082-4486
5082-4487
5082-4488
5082-4494
5082-4520
5082-4550
5082-4555
5082-4557
5082-4558
5082-4570
5082-4584
5082-4587
5082-4590
5082-4592
5082-4595
5082-4597
5082-4620
5082-4650
5082-4655
5082-4657
5082-4658
5082-4670
5082-4684
5082-4687
5082-4690
5082-4691
5082-4693
5082-4694
5082-4695
5082-4707
5082-4732
5082-4787
5082-4790
5082-4791
5082-4850
5082-4855
5082-4860
5082-4880
5082-4881
5082-4882
5082-4883
5082-4884
5082-4885
5082-4886
5082-4887
5082-4888
_ _ _ 16
_ _ _ 16
_ _ _ 16
6
6
See 1 N5765
6
6
_ _ _ 40
8
8
_ _ _ 12
8
_ _ _ 10
_ _ _ 10
_ _ _ 12
See 1 N6093
_ _ _ 26
_ _ _ 26
_ _ _ 26
_ _ _ 26
_ _ _ 30
_ _ _ 34
_ _ _ 42
_ _ _ 20
_ _ _ 20
_ _ _ 20
_ _ _ 20
See 1 N6092
_ _ _ 26
_ _ _ 26
_ _ _ 26
_ _ _ 26
_ _ _ 30
_ _ _ 34
_ _ _ 42
_ _ _ 20
_ _ _ 20
_ _ _ 20
_ _ _ 20
_ _ _ 20
_ _ _ 48
_ _ _ 38
_ _ _ 42
_ _ _ 20
_ _ _ 20
_ _ _ 12
_ _ _ 12
_ _ _ 40
___ 6
___ 6
___ 6
___ 6
___ 6
___ 6
___ 6
___ 6
___ 6
v
5082-4920
5082-4950
5082-4955
5082-4957
5082-4958
5082-4970
5082-4984
5082-4987
5082-4990
5082-4992
5082-4995
5082-4997
See 1 N6094
_ _ _ 26
_ _ _ 26
_ _ _ 26
_ _ _ 26
_ _ _ 30
_ _ _ 34
_ _ _ 42
_ _ _ 20
_ _ _ 20
_ _ _ 20
_ _ _ 20
DISPLAYS
HDSP-2000 _ _
5082-7010 _ _
5082-7011 _ _
5082-7100 _ _
5082-7101 _ _
5082-7102 _ _
5082-7240 _ _ _
5082-7241 _ _ _
5082- 7265 _ _ _
5082-7275 _ _ _
5082-7285 _ _ _
5082-7295 _ _ _
5082- 7300 _ _ _
5082-7302 _ _ _
5082-7304 _ _ _
5082- 7340 _ _ _
5082-7356 _ _
5082-7357 _ _
5082-7358 _ _
5082-7359 _ _
5082-7391 _ _
5082-7392 _ _
5082- 7393 _ _
5082-7395 _ _
5082-7402 _ _ _
5082-7403 _ _ _
5082-7404 _ _ _
5082-7405 _ _ _
5082-7412 _ _ _
5082-7413 _ _ _
5082-7414 _ _ _
5082-7415 _ _ _
5082-7432 _ _ _
5082-7433 _ _ _
5082-7440 _ _ _
5082-7441 _ _ _
5082-7442 _ _ _
5082-7444 _ _ _
5082-7445 _ _ _
5082-7447 _ _ _
5082-7448 _ _ _
5082-7449 _ _ _
5082- 7500 _ _
121
109
109
125
125
125
90
90
94
94
94
94
98
98
98
98
102
102
102
102
115
115
115
115
74
74
74
74
74
74
74
74
78
78
82
82
82
82
82
82
82
82
107
5082-7610
5082-7611
5082-7613
5082-7616
5082-7620
5082-7621
5082-7623
5082-7626
5082-7630
5082-7631
5082-7633
5082-7636
5082-7650
5082-7651
5082-7653
5082-7656
5082-7660
5082-7661
5082-7663
5082-7666
5082-7670
5082-7671
5082-7673
5082-7676
5082-7730
5082-7731
5082-7732
5082-7740
5082-7750
5082-7751
5082-7752
5082-7760
5082-7811
5082-7821
5082-7832
5082-7833
5082-7837
5082-7838
5082-7842
5082-7843
5082-7847
5082-7848
5082-7851
5082-7852
5082-7853
5082-7856
5082-7861
5082-7862
5082-7863
5082-7866
5082-7871
5082-7872
5082-7881
5082-7882
5082-7890
5082-7892
5082-7893
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
___
_ _ _.
___
___
___
___
~
~
___
__
___
__
___
___
__
__
___
__
__
__
__
__
__
__
__
__
__
__
__
__
__
__
__
56
56
56
56
56
56
56
56
56
56
56
56
61
61
61
61
61
61
6,..
61
61
61
61
61
66
66
66
66
70
70
70
70
129
129
129
133
133
133
129
133
133
133
129
129
129
133
129
129
129
133
129
133
129
133
129
129
129
Notes: 1. EIA Registered. Part No. changed. 2. Part No. changed.
...
j
Solid State Lamps
Selection Guide
..................... 2
• Clear or Red Lamps
• Red, High Efficiency Red, Yellow
and Green Lamps
• I nteg rated Lam ps
• Hermetically Sealed Lamps
• Panel Mounting Kit
1
High Efficiency Red, Yellow, Green LED Lamps
Device
Part No.
Photo
5082·
4650
e
4655
Description
Color
Emitting
Material
High
GaAsp on GaP
Efficiency
Red
(635nm)[21
4657
Lens
Package
Red
Diffused
T·l %; Plastic; Long,
General Purpose
Leads[3]
Red Non·
Diffused
4694
4695
•
IV -::::::
"
-',
.-
.,
'IS==-=
3.0mcd@IOmA
80°
4670
Red
Diffused
Rectangular; Plastic;
Long, Gen. Purpose
Leads
Yellow
Diffused
T· l'%; Plastic; Long
General Purpose
Leads[3]
Yellow
GaAsPon GaP
(583nm)[21
4555
4597
- ...•
'
,
1.8mcd @10mA
26
90°
3.0mcd @10mA
Yellow
Diffused
T·l %(Low Profile)
3.5mcd@IOmA
Plastic; Long, General
Purpose Leads
6.0mcd @10mA
Yellow
Non·
Diffused
6.5mcd@10mA
2.2 Volts
@IOmA
r--20
50°
45°
11.0mcd@10mA
Yellow
Diffused
4570
Yellow
Diffused
Sub min.; Plastic;
Radial Leads
Rectangular; Plastic;
Long, Gen. Purpose
Leads
Green
Diffused
T·l'%;Plastic; Long
General Purpose
Leads[3]
4955
Green
Non·
Diffused
r--2.5mcd@10mA
60°
2.0mcd@10mA
90°
1.2mcd @15mA
100°
34
r--16
t--w
26
1.8mcd@20mA
90°
3.0mcd @20mA
2.4 Volts
@20mA
9.0mcd @20mA
30°
16.0mcd @20mA
Green
Diffused
T· 1%(Low Profile)
Plastic; Long General
Purpose Leads
4992
4997
100°
35°
4150
4995
30
1.0mcd @15mA
16.0mcd@IOmA
T· 1; Plastic; Long
Leads [4]
4990
16
r---
9.0mcd@IOmA
Yellow
Diffused
Green
GaP
(565nm)[21
34
-
Yellow
Non·
Diffused
4584
4958
"
45°
11.0mcd@IOmA
Sub min.; Plastic;
Radial Leads
4957
C
8.0mcd@10mA
r--20
50°
Red
Diffused
4950
.
,
(5t
Red
Non·
Diffused
4592
..
--,
T· 1% (Low Profile)
3.5mcd @10mA
Plastic; Long, General
Purpose Leads
7.0mcd @10mA
4160
4595
t
Red
Diffused
70°
4590
._-_._ _---
2.2 Volts
@10mA
2.5mcd@10mA
4558
-
4.Omcd @10mA
T·l; Plastic; Long
Leads[4]
4557
., . .,.,.
26
Red
Diffused
4550
Page
No.
90°
4684
'Y''''''-
Typical
Forward
Voltage
35°
4693
--~
[I]
24.0mcd@10mA
4690
"'
2eh
12.0mcd@10mA
4658
CI
Typical
Luminous
Intensity
2.0mcd@10mA
Green
Non·
Diffused
r--
4.5mcd @20mA
20
50°
7.5mcd@20mA
6.5mcd @20mA
40°
11.0mcd@20mA
NOTES: See Page 3.
For Applications Information, see pages 196 - 197.
2
c
Description
Device
Part No.
Photo
5082·
ESt:=-
Emitting
Material
Package
lens
Typical
luminous
Intensity
28'.4
[I]
Green
Diffused
T·l; Plastic; Long
leads[4]
2.0mcd@20mA
60°
4190
Green
Diffused
Submin.; Plastic;
Radial Leads
1.5mcd @20mA
70°
4970
Green
Diffused
Rectangular; Plastic;
Long, Gen. Purpose
Leads
1.2mcd @20mA
100°
4984
L:· •
Color
GaP
Green
(565nm)[2]
Typical
Forward
Voltage
Page
No.
2.4 Volts
@20mA
34
I---
E===-"=
16
r30
Red LED Lamps
Device
Photo
••
Description
Part No.
5082·
4850
Color
Emitting
Material
Red
GaAsP on GaAs
(655nm)[2J
Package
lens
Red
Diffused
T·l*; Plastic; long
Wire Wrap. leads[3]
Typical
luminous
Intensity
28'.4
[1J
Typical
Forward
Voltage
0.8mcd @20mA
Page
No.
12
95°
1.4mcd @20mA
4855
-:'=.
T·l; Plastic; long
Leads[4J
4484
4494
(i:
4790
4480
4483
4486
120°
1.4mcd @20mA
T·l* (Low Profile)
Plastic; Long, Gen.
Purpose Leads
Red
Diffused
4791
C:=......:
1.6 Volts
@20mA
0.8mcd @20mA
1.2mcd @20mA
20
60°
2.5mcd @20mA
1.6 Volts
@20mA
8
Red
Diffused
Clear
Diffused
Clear
Non·
Diffused
T·l; Plastic; Long
Leads [4]
Clear
Non·
Diffused
T·l (Low Profile);
PlastiCc, La ng
Leads 4]
0.8mcd @20mA
Red
Diffused
Submin.; Plastic;
Radial Leads
0.5mcd@10mA
Red
Diffused
Array; Plastic Radial
Leads
1.0mcd @lOrnA
120°
0.8mcd @20mA
1.6 Volts
@20mA
80°
f-
4487
:'~""'"
4488
•
4100
4101
HLMp·
6203
I
120°
1.6 Volts
@20mA
45°
1.6 Volts
@10mA
45°
1.6 Volts
@10mA
Guaranteed Min.
0.3mcd @20mA
1.0mcd @10mA
10
16
14
HLMP·
6204
I
'_"_'
Jill
HLMp·
6205
NOTES: 1.
2.
3.
4.
ey, is the off·axis angle at which the luminous intensity is half the axial luminous intensity.
Peak Waveleng~h.
Panel Mountable. For Panel Mounting Kit, see page 48.
PC Board Mountable.
3
For Applications Information,
see pages 196· 197.
Description
Device
Photo
Part No.
5082·
4403
ta
.,."
4403/4440
't
Emitting
Material
Color
Red
GaAsP on GaAs
(655nm}[2]
Package
Lens
Red
Diffused
T·1 %; Plastic; S)lOrt,
Leads[3]
T-1 %; Plastic; Short,
Bent LeadS[4]
T-1 %; Plastic; Short
Leads[3]
T-1 %; Plastic; Short,
Bent Leads[4]
4415
4440
'J:,
--
4444
4415/4444
Red
Diffused
Clear NonDiffused
Clear
Diffused
Red
Diffused
Clear Non·
Diffused
Clear
Diffused
Red
Diffused
Clear Non·
Diffused
Clear
Diffused
4880
4883
4886
4881
4884
4887
4882
4885
4888
T-1%;Plastic; Long
Wire Wrap_ Leads[3]
Typical
Luminous
Intensity
28'h
[1]
Typical
Forward
Voltage
Page
No.
6
1.2mcd@20mA
75°
1.6 Volts
@20mA
0.7mcd@20mA
6
58°
r0.8mcd @20mA
50°
r65°
58°
r-1.3mcd @20mA
50°
r65°
1.6 Volts
@20mA
58°
r1.8mcd @20mA
50°
r-65°
Integrated LED Lamps
Device
Photo
.,
•••
NOTES:
Description
Part No.
5082·
Color
Integration
4732
Red
Voltage Sensing
(655nm) IC integrated
[2]
with GaAsP
LED chip
4860
Resistor chip
integrated with
GaAsP LED
chip
4468
Package
Lens
Red
T·1; Plastic; Long
Diffused Leads[4]
Red
T·1 %; Plastic;
Diffused Long Leads[3]
Clear
T·1; Plastic;
Diffused Long Leads[4]
Typical
Luminous
Intensity
28'/,
0.7mcd
@2.75V
95°
[1]
Typical
Forward
Current
Page
No.
13mA@
2.75V
38
58°
0.8mcd
@5.0V
70°
40
16mA@
5.0V
1. 0% is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
For Applications Information,
2. Peak Wavelength.
3. Panel Mountable. For Panel Mounting Kit, see page
4. PC Board Mountable.
see pages 1 96-197.
48.
4
Hermetically Sealed LED Lamps
Device
Photo
G ef·····
-=d::.
W'o'
.... ,.
-==
et-····
-==
•
w~
Part No.
Color
IN5765
JAN IN5765[5)
JAN TX IN5765[5]
(5082· A 120)
5082·4787[6]
Red
(655nm)[21
I N6092 [6J
(5082-4620)
High Eff.
Red
(635nm)[21
...........
Emitting
Material
GaAsP on GaAs
Lens
Red
Diffused
2@h
(1)
70°
Typical
Forward
Voltage
1.6 Volts
@20mA
Page
No.
42
Panel Mount
GaAsP on GaP
Red
Diffused
5082-4687[61
I N6093 [6J
(5082·4520)
Minimum
Luminous
Intensity
HermetiefTO·46; O.5med@
Long Leads[4]
20mA
Package
HermetiefTO-46
Long Leads! 4]
1.0med @
20mA
2.0 Volts
@20mA
0.8med@
25mA
2.1 Volts
@25mA
Panel Mount
Yellow
(583nm)l2]
Yellow
Diffused
GaAsP on GaP
HermetiefTO-46
Long Leads!4]
. ..
'~h.
e'-"-
5082.4587 [61
1N6094 l6J
(5082-4920)
Panel Mount
Green
(565nm)l2]
GaP
Green
Diffused
HermetiefTO-46
Long Leads! 4]
,~.~-
511Ill'Q::nll[61
Panel Mount
~
c
NOTES: 1.
2.
3.
4.
5.
6.
9% is the off·axis angle at which 'the luminous intensity is half the axial luminous intensity.
Peak Wavelength.
Panel Mountable. For Panel Mounting Kit, see page 48.
PC Board Mou ntable.
Military Approved and qualified for High Reliability Applications.
Military Approved and qualified JAN and JAN TX versions of this part are now available.
6
For Applications Information,
see pages 196-197.
-
HEWLETT. PACKARD
5882-4403
5082-4415
5082-4440
5082-4444
5082-4880 SERIES
SOLID STATE LAMPS
COMPONENTS
TECHNICAL DATA APRIL 1977
Features
t I
5.08 (.200)
4.32 (.170)
CATHODE
IDENTIFICATION
RED
• EASILY PANEL MOUNTABLE
• HIGH BRIGHTNESS OVER A WIDE
VIEWING ANGLE
• RUGGED CONSTRUCTION FOR EASE
OF HANDLING
• STURDY LEADS ON 2S.4mm (0.10 in.)
CENTERS
• IC COMPATIBLE/LOW POWER
CONSUMPTION
~~
PLASTIC
---------------
9.14 (.360)
8.13 (.320)
"
0.89 (.035)
0.64 (.025)
2_54
(.10) ,
0.89 (.035)
Q.64
==~~~'TT-
L
(.025)
~I
f~
BASE
~
6
r.~~)
--'----'I ~
MIN.
1.02 (.040) ___
1.02 (.040(
~l
~ (.240)
5.59 (.220)
Description
i
The 5082-4403 and -4440 are LEDs with a red diffused
plastic lens, providing high visibility for circuit board or
panel mounting with a clip.
WHITe DOT
ORANGE DOT
WHITE DOT
ORANGE OaT
~~~~L
The 5082-4415 and -4444 have the added feature of a 90°
lead bend for edge mounting on circuit boards.
MIN.
ANODE
3.05 (.120)
2.03 ('080)----J
CATHODE COLOR DOT IDENTlF!CATION
5087,·4403
5082·4440
5082-4411)
{j082-4444
~.::)
('0501j
~:~! ::~:: TYP.
5082·4415
5082·4444
The 5082-4403, -4415, -4440, -4444 and the -4880 series
are plastic e'ncapsulated Gallium Arsenide Phosphide
Light Emitting Diodes. They radiate light in the 655
nanometer (red light) region.
1--,
'~
0.89 (.035)
~
0.64(.025)
TYP.
CATH;~
0.64 (.025)
5.33 (.210)
4.83 {190)
(.120)
2.03 (,080)
• LONG LIFE
RED
PLASTIC
/METAL
5082·4403
5082·4440
DIMENSIONS IN MILLIMETRES AND (INCHES)
-4880 SERIES
PLASTIC
The 5082-4880 series is available in three different lens
configurations. These are Red Diffused, Untinted
Diffused, and Clear.
f
6.10 (.240)
5.59 (.220)
r'40~
The Red Diffused lens provides an excellent off/on
contrast ratio. The Clear lens is designed for applications
where a pOint source is desired. It is particularly useful
where the light must be focused or diffused with external
optics. The Untinted Diffused lens is useful in masking the
red color in the off condition.
15.24
"Li
(.600)
LED SELECTION GUIDE
MINIMUM
LIGHT
OUTPUT
(moo)
5082-4880
5082-4881
5082-4882
0.3
0.8
0.3
0,8
5082-4440
-5082-4403
5082-4444
5082-4415
5082·4880, -4883, -4886
5082-4881, -4884. 4881
5082-4882, ·4885, ·4888
5082-4883
5082-4884
5082-4885
Maximum Ratings at TA=25°C
DC Power Dissipation ......................... 100mW
(Derate linearly from 50°C ~t 1.6mW/oC.)
DC Forward Current .. , ... " ... , .... "" .. , ... , 50 mA
Peak Transient Forward Current, ...... , ..... , ... 1 Amp
(1iJsec pulse width. 300 pps)
Isolation Voltage (between lead and base) " . , ..... 300 V
Operating and Storage
Temperature Range ' ........... ,." .. -55°Cto+100°C
Lead Soldering Temperature .. ,.""" .. 230°Cfor7sec
5082-4886
5082-4887
5082-4888
SHORT LEAD
1-----
0.76 (.030)
0.51 (.020)
3.05 (.120)
2.03 (.080)
lONG lEAD (UNBENT)
Red
Clear
Untinted
Diffused
Plastic
Diffused
Lens
lens
Lens
0.5
1.0
1.6
I
CATHODE
0.76 (.030)
UNBENT
BENT
6
Electrical Characteristics at TA =25°C
(
, i;b~82'4440
5082-4444
•....
'....._..
TYPICAL RELATIVE LUMINOUS INTENSITY VERSUS ANGULAR DISPLACEMENT
44XX
4880.4881.4882
FORWARD CURRENT VS. VOLTAGE
CHARACTER ISTICS
50
.
",..
E
I
40
~
a:
a:
=>
u
30
'
..
t:,
c
a:
"
20
I
10
;::
r- t---:
a:
~
[~
-"
~~
:tt ,
·j.l.
00
0.4
"
""'"
I;'"
1.2
0.8
2.0
1.6
FORWARD CURRENT - VOLTAGE CHARACTERISTICS
4883,4884,4885
4886,4887,4888
LUMINOUS INTENSITY VS. FORWARD
CURRENT (IF)
2.50
2.25
/'
2.00
/
1.75
/
1.50
/
1.25
1/
1.00
.75
/
.50
.26
/
/
IL
00
_Zl
10
20
30
40
IF - FORWARD CURRENT - rnA
7
50
HEWLETT ,PAOKARD
5082-4480
SOLID STATE LAMPS
SERIES
COMPONENTS
TECHNICAL DATA
Features
APRIL 1977
r-- wf.iOOl
( 1251
• HIGH INTENSITY: 0.8mcd TYPICAL
~.1.
~~~ -mtn5i
~"~
• WIDE VIEWING ANGLE
• SMALL SIZE T-1 DIAMETER 3.18mm (0.125")
I
343~ 1351
$.10(2401
NO~
5.0812001 ~~~ ..........J.
r l'·'~
'1 'T"
• IC COMPATIBLE
• RELIABLE AND RUGGED
~=-r
I
Description
NOM.
The 5082-4480 is a series of Gallium Arsenide Phosphide
Light Emitting Diodes designed for applications where
space is at a premium, such as in high density arrays.
The 5082-4480 series is available in three lens configurations.
5082-4480 - Red Diffused lens provides excellent on-off
contrast ratio, high axial luminous intensity, and wide viewing angle.
~..
1
~_ 3.0~~~:201
-..
-.
_ 2.541.1001
2.03.1.0801
03=9r
5082-4483 - Same as 5082-4480, but Untinted Diffused
to mask red color in the "off" condition.
!?M 1.025) - '
5082-4486 - Clear plastic lens provides a point source.
Useful when illuminating external lens, annunciators, or
photo-detectors.
CAYHOOE
,'-
',j
_.i.
t
O.64~
0.38 .015)
Maximum Ratings at TA = 25°C
DC Power Dissipation
(De~~t~ ii~e~riy' f~~~ 50
0 (; 'a~
1.6mW/OC)
.................
DC Forward Current
Peak Forward Cu rrent
DIMENSIONS IN MilLIMETERS AND HNCHESI.
100mW
50mA
PART NO.
1 Amp
....... (1 '!L;"'~ 'p~l~e' ';'idth, 300 pps)
Operating and Storage
Temperature Range . . . . . . . . . . . . -55°C to +100oC
Lead Soldering Temperature .......
LENS CONFIGURAnON
5082-4480
Red Diffused
5082-4483
Untinted Diffused
5082-4486
Clear Plastic
230°C for 7 sec.
Electrical Characteristics at TA = 25°C
Symbol
5082-4480
5082-4483
50824486
Parameters
Min.
1\1
APEAI<
...
,'""-,,,
Luminous Intensity
'
..
0.3
Wavelength
Typ.
Units
Max.
0.8
mcd
655
nm
rs
. I-
40
I
I-
iii
a:
a:
~
30
VI
"z
:E
"-'w
"
0
()
0
a:
'"
20
I
10
;:
a:
2.25
-;7
in 2.00
z
w
I- 1.75
:r
-~
0.4
0.8
1.2
"
1.6
2.0
/
1/
1.25
1.00
.75
~
.50
a:
7
1.50
>
>=
./
.25
/
/
./
/'
10
20
30
40
50
FORWARD CURRENT - VOLTAGE CHARACTERISTICS
IF - FORWARD CURRENT - rnA
Fig.ure 3. Forward Current vs. Voltage
Characteristic.
Figure 4. Luminous Intensity vs. Forward
Current (IF).
9
HEWLETT
PACKARD
COMPONENTS
LOW PROFILE
SOLID STATE LAMPS
5082-4487
5082-4488
TECHNICAL DATA
]
Features
• LOW COST: BROAD APPLICATION
PLASTIC'
• LOW PROFILE: 4.S7mm (0.18") LENS HEIGHT
TYPICAL
5.08 io.-£O)
APRIL 1977
g
.,1!U~
2.67 (.1051
.. 3.30 1.1301 MAX.
'r
3.30
10.1301 NOM.
-f~-L
""'"~T
• HIGH DENSITY PACKAGING
• LONG LIFE: SOLID STATE RELIABILITY
1
15A~I~:61)
J
J,'
• LOW POWER REQUIREMENTS:
20mA @ 1.6V
L
• HIGH LIGHT OUTPUT: 0.8mcd TYPICAL
,)!.--3.0510.,201
MAX.
I
--j
,
r
0.64 UB~~2~5
0.38
(.0151
CATHODE
,':---_/.
2.54 l!Q!l)
I-- 2.03 (.080)
==*
Q&~~
0.38 (.015)
ALL QIMENSIONS ARE IN MtlUMETE-RS {INCHES"
Description
The 5082-4487 and 5082-4488 are Gallium Arsenide Phosphide Light Emitting Diodes for High Volume/
Low Cost Applications such as indicators for calculators, cameras, appliances, automobile instrument
panels, and many other commercial uses.
The 5082-4487 is a clear lens, low profile T-1 LED lamp, and has a typical light output of 0.8 mcd at 20
mAo
The 5082-4488 is a clear lens, low profile T-1 LED lamp, and has a guaranteed minimum light output of
0.3 mcd at 20mA.
Absolute Maximum Ratings at TA =25°C
DC Power Dissipation [Derate linearly from 50°C at 1.6mW/OCJ ......................... 100mW
DC Forward Current ........................................................... 50mW
Peak Forward Current [1j.1sec pulse width, 300ppsJ ................................... 1 Amp
Operating and Storage Temperature Range ................................. -55°C to +1 OooC
Lead Soldering Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
230°C for 7 sec.
Electrical/Optical Characteristics at TA=25°C
Symbol
Parameters
Iv
Luminous Intensity
Min.
5082·4487
Typ.
Max.
O.S
Min.•
..
50824488
Typ.
Max.
0:8
0.3
Units
Test Conditions
moo
IF =20mA
,
'.
Wavelength
'. APEAK
Speed of Response
15
• 'f.
t·;,] Capacitance
VF
Forward Voltage
j:;~VR
r:'; Reverse BreakdOWn
656
656
om
10
10
ns
100
100
pF
VF =0,f=1MHz'
V
IF "'20mA
V
',f! ,. 100ilA
1.6
2.0
1.6
2.0
Measurement at
Peak
c.
3
10
3
10
Voltage
>cC
50
..:::i;;tH·
1
'
2,50
.'
2,25
TA ""2&"C
/'
2,00
«40
E
i:ia:
a:
=>
+ttt
20
a:
-
::r
~
:t:
/
1.25
/
1.00
,75
/
,50
10
I
o
/
1.50
30
u
"a:~
/
1,75
I-
,25
o
0,4
0,8
1,2
1,6
/
o ./'
o
'/
2,0
/
10
20
30
40
50
IF - FORWARD CURRENT - rnA
VF - FORWARD VOLTAGE - VOLTS
Figure 2. Typical Luminous Intensity Versus
Forward Current.
Figure 1. Typical Forward Current Versus
Voltage Characteristic.
Figure 3. Typical Relative Luminous Intensity
Versus Angular Displacement.
11
HEWLETT·
PAOKARD
COM PONENTS
5082-4850
5082-4855
5082-4484
5082·4494
COMMERCIAL
LIGHT EMITTING
DIODES
TECHNICAL DATA
APRIL 1977
OIMENSIONS INMILllMETERSANO lfNCHESl
PLA;:-'~ ! - - - t -
Features
• LOW COST: BROAD APPLICATION
• LONG LIFE: SOLID STATE RELIABILITY
• LOW POWER REQUIREMENTS: 20mA @ 1.SV
• HIGH LIGHT OUTPUT
0.8 mcd TYPICAL FOR 5082-4850/4484
1.4 mcd TYPICAL FOR 5082-4855/4494
• WIDE VIEWING ANGLE
• RED DIFFUSED LENS
Description
The 5082-4850/4855 and 5082-4484/4494 are Gallium Arsenide
Phosphide Light Emitting Diodes intended for High Volume/Low
Cost applications such as indicators for appliances, automobile
instrument panels and many other commercial uses.
5082-4850/4855
The 5082-4850/4855 are T-l% lamp size, have red diffused lenses
and can be panel mounted using mounting clip 5082-4707.
The 5082-4484/4494 are T-l lamp size, have red diffused lenses
and are ideal where space is at a premium, such as high density
arrays.
Absolute Maximum Ratings at TA=25°C
Power Dissipation .............................. 100mW
(Derate linearly from 50°C at 1.6mWrC)
II · 3.~
10.120)
MAX.
........
__ 2.54{.100)
2.031.080)
O'64~j,025)
,'- ~.
___,'. 1-
[3ij toiirJ ........
CATHODE
__ /
.
~
0.641 ••25)
[3ij toiir)
DC Forward Current. . . . . . . . . . . . . . . . . . . . . . . . . . ..
50mA
Peak Forward Current. . . . . . . . . . . . . . . . . . . . . . . . . .. 1Amp
(l.usec pulse width, 300pps)
Operating and Storage
Temperature Range ..................... -55°C to +100°C
Lead Soldering Temperature. . . . . . . . . . . . ..
5082-4484/4494
12
230°C for 7 sec.
I"
Electrical Characteristics at TA=25°C
"(l~ ""::'''''- ~~
Symbol
5082-4850
Pe,ameteI'S
Min.
Lumino..
lntatl$ity~
'V
\
~EAK
.
~:
aVR
.~ite~;
;''11
Reverse'
Breakdown
.Vpltege
655
3
~
-
10
1.4
Tim Conditions
mcd
IF~20mA
nm
at Peek
0.8
,
655
,655
10
Hi
n.
100
100
pf"
100
1.6
2.0
0.8
Units
1..4
fu
100
Voltage
-l.$.~
0.8
10
"?F~
:~
~
t
"
Respond'
C
<,'
0.8
Speed of
1'$
Typ. Max. Min. Typ. Mex. MiA. Tyft. Max; MIn. Typ. Max.
~~
;W..,gt/I
sOaz.:4494
5082-4484
5082-4856
3
<
.
1.6
2.0
3
10
If
•
2.0
~ 10
3
~:
1.6
2.0 V
10
V
Measurement,
VF -0,
fo 1MHz
IF
=20mA
IR-10QpA
·c
"-h.";"" ••. '
'1i
I
~
a:
a:
"ca:"
if2
I
V F - FORWARD VOLTAGE - VOLTS
r
L
Figure 1. Forward Current Versus Forward Voltage Characteristic For 5082-48501
4855/4484/4494.
Figure 2. Relative Luminous Intensitv Versus
Angular Displacement For
5082-4850/4855.
2,50
2,25
/"
~
zW
in 2,00
I-
:i5
"'"z
i
"-'w
0
>
;::
"irl
./
1.75
1,50
1,25
1,00
,75
L
a:
,50
,25
L
L
/
/
/
/
o
o
10
20
30
40
50
IF - FORWARD CURRENT - mA
Figure 3. Relative Luminous Intensity Versus
Angular Displacement For
5082·4484/4494.
Figure 4. Relative Luminous Intensity Versus
Forward Current For 5082·48501
4855/448414494.
13
II
HEWLETT
MATCHED ARRAYS OF 3- ELEMENT. HLMP - 6203
SUBMINIATURE RED 4- ElEMENT. HLMP - 6204
SOLID STATE LAMPS 5- ElEMENT • HLMP - 6205
PACKARD
. COMPONENTS
TECHNICAL DATA APRIL 1977
Features
• EXCELLENT UNIFORMITY BETWEEN
ELEMENTS AND BETWEEN ARRAYS
• EASY INSERTION AND ALIGNMENT
• VERSATILE LENGTHS -
3,4,5 ELEMENTS
• END STACKABLE FOR LONGER ARRAYS
• COMPACT SUBMINIATURE PACKAGE STYLE
• NO CROSSTALK BETWEEN ELEMENTS
Description
The HLMP-62XX Series arrays are comprised of several
Gallium Arsenide Phosphide Red Solid State Lamps
molded as a single bar. Arrays are tested to assure
uniformity between elements and matching between
arrays. Each element has separately accessible leads and
a red diffused lens which provides a wide viewing angle
and a high on/off contrast ratio. Center-to-center spacing
is 2.54mm (.100 in.) between elements and arrays are end
stackable on 2.54mm (.100 in.) centers.
Absolute Maximum
Ratings/Element at TA = 25°C
Power Dissipation (derate linearly from
50°C at 1.6 mW/OC) ...................... 100mW
Average Forward Current ..................... 50 mA
Peak Forward Current (see Figure 4) ......... 1000 mA
Operating and Storage
TemperatureRange ............... -55°Cto+100°C
Lead Soldering Temperature [1.6 mm
(0.063 in.) from body] ............... 230°C for 3sec.
package Dimensions
\}\
(!
.4H01Bl-l
I-
-l-A670-;;;tt1~l:f.Jlm ]6[~22)llD
Ilr'-~ t::: ::::
]6
"~,~~I
[0221
L I
80TH SIDES
I
"",
CATHODE
I
/
I
l-~~~~~~r~~'
.-
lUM'NOOS INTENSITy
CATEGORY DOT
I
L~106Ql
1.18 (.G701
I
S._
No_
1. Aftdimensiom:are
miUimetJ'el;
UttdesJ. 3.
_ _ _ in
SoeAppl
.......
~
3. User mey bend leads as thovrm.
4. Owrc.tllangth is the number of eleMentt tlrnl$
2'-1.1"".1.
~
o
1.0651 DIA1.91 (.0751
"'(,0
+tPGjI~~i
1+··_ . -"·N[2.54~1"IIMAX.-- ----...j
NOTE 4
14
Electrical Specifications/Element at TA =25°C
Symbol
,,""'.
Description
Typ.
Min.
Iv
Axial Luminous Intensity
20 1/2
Included Angle Between Half
LUminous Intensity POi.nts
45
APEAK
Peak Wavelength
655
~
Dominant Wavelength
640
Ts
Speed of Response
1.5
L.',>!
C
1.0
.5
100
citance
8JC
Thermal Resistance
125
VF
Forward Voltage
1.6
BVR
Reverse Breakdown Voltage
flv
Luminous Efficacy
3
10
55
Notes:
1. Arrays are categorized for luminous intensity with the intensity category designated by a color dot located on the cathode side of
the package.
2. 81/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Dominant wavelength, Ad, is derived from the CIE Chromaticity Diagram and is that single wavelength which defines the color of
the device.
4. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/'Y/v. where Iv is the luminous intensity in candelas
and 'Iv is the luminous efficacy in lumens/watt.
5.0
50
40
!----T, .125·C
1=---"
--: 1=-"
;,
L
/
}~; I;,~ If!
I"
;;0
~
/
...
~
::;
~
3.0
1
1.40
1.50
w'O!
~~
~~
a:~
L
,,'
20
30
40
50
IF - FORWARD CURRENT - rnA
Figure 1. Forward Current vs.
Forward Voltage.
Figure 2. Relative Luminous IntenSity
vs. DC Forward Current.
MS
/
I,·,'
,
1.00
~
10
1.70
1,60
V F - FORWARD VOLTAGE - VOLTS
1.10
>~
V
/1
1.0
tp - PULSE DURATION -
§!;i:
:t"
WW
V
0
1;..1..--+
·;.- "
:.
3,0'
5.0
10
'Iv
luminous EffiCa\lY
1-/
65
\".
1P'"'I0nlA.
. Fig$; 3,'8,13,18
Note 1. Figuree
EI. 11, 16, 21
,.672'
'nm
l!OO .
. 05'
:pF
.tOO
.~CIW
.. '::<1'
:.... ,
",0.\
:<'"
Note 2
· V.F\l;'f=1 MHz
Junction to
.' Cethode lead at
. ftomSocly
"
2~
'.3:0':.
'V
':Atl~;"~ .;
v'
570:
666
· J.='IomA,
J::igures 2. 7,
12, 17
:5.0'
6.0
· Measurement
at Peak
.: a.79nun (.031 In)
".
.;.'....:
147.
nnr
13" .
-,\
~
100.
.2.2' .3.0
3.0
'::
Voltege
':,
'90.
"
..
..
585.
~
.deg ..
,~
'.'
'.
6eiI
583•
" i .:.
Forward VOltage
ReVerse Breakdown
~
··meet .'
Tftteon..-
'.
628
90.
.
. '70'
..... :.
.~
655
~
BVR
,"
. All F ;'i!omA.
'~:,
"
I.!*
'.1' J"
o.s ...tJ;.
90
.80
.,',
[
:
.
's
VF
..
.2.0'
..
auaa:4180: '
.M/ft.. 1'yp, M& 1I/II.·I1'Jp·
:'
3.0
luminous . Intensity
Points
APIlAK
','
..
.'
II1IIW
III =100"A
NotEi3
NOTES:
1. f)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
3. Radiant intensity, I•• in wattslsteradian, may be found from the equation I.=I,/'Iv. where I, is the luminous intensity in candelas and 'Iv is the luminous
efficacy in lumens/watt.
1.0
.
~z
...w
w
2:
~
. '. .
>
!!
.lGtiEFFVlCeNCV
IRED .. ' . ..
0.5
J
YELLOW
.....
"
" , ' ,
......... .
...•...
",
<
,
'~RED"
\
5
w
II:
0
500
• 550
650
600
WAVELENGTH - nm
Figure 1. Relative Intensity Y8. Wavelength.
17
700
750
Red 5082- 4100/4101
50 .....--_-,-_ _ _,--.--_-,
40
30
20
M
/'
i!§
V
~o
w<
10~---4--~~----4
~~
~<
!1e
i~
~"
"<
w~
~!5
ao
!
t
20
~~ 1.0
VF- FORWARD
VOLTA~E
/
/'
. I I10
00
30
50
IF - FORWARD CURRENT - mA
- VOLTS
Figure 2. Forward Current vs.
Forward Voltage.
I"EAIC - PEAK CURRENT - rnA
Figure 3. Relative Luminous Intensity
VI. Forward Current.
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) VI. Peak Current.
tp - PULSE DURATION -j./S
Figure 5. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Figure 6. Relative Luminous Intensity vs. Angular Displacement.
High Efficiency Red 5082-4160
20
TA
~ .... c
,
I
\l
f~
°0
.5
0
I
i.;
J :/
1.0
1.5
2.0
0
2.5
1."
~T.'''!'C
I
3.0
V F - FORWARD VOLTAGE-V
Figure 7. Forward Current vs.
Forward Voltage.
0
1.'
I
I
V
../
U
/
>Q
13
tt~
1.2
~s
L
1.4
!i1
we
Ww
>N
1.1
1.0
~~ ."
w"
"0
g
.S
.7
"
15
20
IF - FORWARD CURRENT - mA
Figure 8. Relative Luminous Intensity
VS. Forward Current.
!peAK -PEAKCURRENT-mA
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
tp - PULSE DURATION - ~s
Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Figure 11. Relative Luminouslntensltyvs.AngularDlsplacement.
18
Yellow 5082- 4150
2.5
>
!:
!2<
1.6
1.5
2 .•
u
~~
~~
~ffi
~~
~<
w~
1..
~~
1.3
1.5
H:~
~ffi
1.•
i=~
.5
>N
1.1
i=~
~~
1.0
a::~
.9
:.,.
IF - FORWARD CURRENT - rnA
Figure 12. Forward Current vs.
Forward Voltage.
1000
It> - PULSE DURATION
L
f·
..
.•...
,,' ..!. ;>,,:~
••.......
.
"
,I:
:'
. / ..
..2-
.i
,
i····
I
I
Ii
'..::
10
20
3
40
.
I
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
90' f----+--+--+-~~
-~5
Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Figure 16. Relative Luminous Intensityvs.AngularDisplacement.
Creen 5082-4190
• r),.,c
I
I
5
•
5
I
•
.5
.r.l25'C
•
i/
5
iA
.•
II
Vi
5
)
1.0
1.5
2.0
2.5
3.0
V F - FORWARD VOLTAGE - V
•
---
V
10
15
20
25
30
IF - FORWARD CURRENT -rnA
Figure 17. Forward Current vs.
Forward Voltage.
Figure 18. Relative Luminous Intensity
vs. Forward Current.
IpEAK - PEAK CURRENT - rnA
Figure 19. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
10000
Ip - PULSE DURATION
-!J,S
Figure 20. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Figure 21. Relative Luminous Intensity vs. Angular Displacement.
19
•
IpEAK - PEAK CURRENT - rnA
Figure 13. Relative Luminous Intensity
vs. Forward Current.
10000
..•.'
j.~
.7 0
VF - FORWARD VOLTAGE - V
,
'.
1.2
.'~
';'" ..~:
u<
>~
~-
>0
}:::' t'
i
LOW PROFILE SOLID STATE LAMPS
~
HEWLETT
PACKARD
COMPONENTS
RED
HIGH EFFICIENCY RED
YEllOW
GREEN
•
•
•
•
5082-4190 SERIES
5082 -4690 SERIES
6082 -4590 SERIES
5082 -4990 SERIES
TECHNICAL DATA APRIL 1977
Features
•
•
•
•
•
HIGH INTENSITY
LOW PROFILE: S.8mm (0.23 in) NOMINAL
T-H. DIAMETER PACKAGE
LIGHT OUTPUT CATEGORIES
DIFFUSED AND NON-DIFFUSED TYPES
• GENERAL PURPOSE LEADS
• IC COMPATIBLE/LOW CURRENT
REQUIREMENTS
• RELIABLE AND RUGGED
• CHOICE OF 4 BRIGHT COLORS
Red
High Efficiency Red
Yellow
Green
Description
The 5082-4990 Series are Gallium Phosphide Green Light
Emitting Diodes packaged in a Low Profile T-1% outline.
The 5082-4790/4791 are Gallium Arsenide Phosphide Red
Light Emitting Diodes packaged in a Low Profile T-1%
outline with a red diffused lens.
The Low Profile T -1 % package provides space savings and
is excellent for backlighting applications.
The 5082-4690 Series are Gallium Arsenide Phosphide on
Gallium Phosphide High Efficiency Red Light Emitting
Diodes packaged in a Low Profile T-1% outline.
Part
Num~r
The 5082-4590 Series are Gallium Arsenide Phosphide on
Gallium Phosphide Yellow Light Emitting Diodes packaged in a Low Profile T-1% outline.
5032·
4690
4693
package Dimensions
4694
4695
PLASTIC
4590
4592
4595
4597
NOTESj
1. ALL OtMEN$lONS At=\E
IN MILLIMETRES {iNcttE:S.
2. LAMP lEAOS ARE PL.ATED
SILVER (SEE AP. NOTE 31
4990
4992
4995
4997
4790
I
4791
I
I-+~NOM.
20
Applicallon
Indicator General Purpose
Indicator High Brightness
General Purpose
Point Source
High Brightness
Annunciator
IndicatorGeneral Purpose
Indicator High Brightness
General Purpose
Point Source
High Brightness
Annunciator
IndicatorGeneral Purpose
Indicator High Brightness
General Purpose
Point Source
High Brightness
Annunlcator
Indicator General Purpose
Indicator High Brightness
Lens
Diffused
Wide Angle
Non-diffused
Narrow Angle
Color
High
Efficiency
Red
Diffused
Wide Angle
Yellow
Non-diffused
Narrow Angle
Diffused
Wide Angle
Green
Non-diffused
Narrow Angle
Diffused
Wide Angle
Red
Absolute Maximum Ratings at TA=25°C
[~
PowerDisslpatioo
l~itteUni!ArI9 f(Qm
5O"'Caft6mwrC)
Lead Solder T Eill1'pcrature .
(1.6mm £O.63in~hJ
frombody)
WAVELENGTH - nm
Figure 1. Relative Intensity versus Wavelength.
21
RED 5082-4790 SERIES
Electrical Specifications at TA = 25°C
',;
Device
Description
Symbol
Min. Typ. Max.
5082-
4790
O.B
1.2
4791
1.6
2.5
Units
Test Conditions
moo
IF "" 20mA (Fig. 3)
Iv
Axial Luminous Intensity
2ey,
Included Angle Between
Half luminous'lntensity
Points
60
deg.
Note 1 (Fig. 6)
ApEAK
Peak Wavelength
655
nm
Measurement
Ad
Dominant Wavelength
648
nm
Note 2
1'$
Speed of Response
15
ns
C
Capacitance
100
pF
8J C
Thermal Resistance
125
¢CNJ
c"
J
~;c; VF
'C','
Forward 'Ybltage
1.6
BVR
Reverse Breakdown Voltage
71v
Luminous Efficacy
3
20
@
Peak (Fig. 1)
VF=O;f=l MHz
Junction to Cathode lead 1.6 mm
(0.063 in.) from Body
= 20mA (Fig. 2)
V
IF
10
V
!R = 100f,LA
55
ImNJ
Note 3
Notes: 1.8% is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, Ad. is derived from the CIE
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity 'e. in watts/steradian may be found
from the equation Ie"" ly/l1y, where Iy is the h.lminou5 intensity in candelas and l1y is the luminous efficacy in lumens/watt.
r~~
" ::'C
E
I
2,5
TA"
0;
2-
~
a:
1.30
"'~5~C
/'
2,0
W"
f- E
f-
a:
TA
>
f-
~~
"''''
§~
10
""
"a:
-
1,5
-",
ZN
~::i
"""
";::
a:
1.0
...
WOO
>0
5'
-2
f--
I
~a:
-~
1
1.40
1.70
VF
~
,5
o
V
o
FORWARD VOL TAGE - V
Figure 2. Forward Current versus
Forward Voltage.
tp -
/
1/
10
20
"~
/
~
1.20
/
f-
Ii:N"
1.10
1/
::;
"~
I
0
~
30
40
50
IF - FORWARD CURRENT - rnA
Figure 3. Relative luminous Intensity
versus Forward Current.
1,00
o
o
~
20
40
60
IpEAK - PEAK CURRENT - rnA
Figure 4. Relative Efficiency
(luminous Intensity
per Unit Current)
versus Peak Current.
PULSE DURATION -IJ.S
Figure 5. Maximum Tolerable Peak Current versus Pulse
Duration. (ICC MAX as per MAX Ratings)
Figure 6. Relative luminous Intensity versus
Angular Displacement.
22
80
100
I"
HIGH EFFICIENCY RED 5082-4690 SERIES
Electrical specifications at TA =25°C
Notes: 1.l::J.Yoz is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, Ad. is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie, in watts/steradian may be found
from the equation Ie = Iv/flv. where Iv is the luminous intensity in candelas and flv is the luminous efficacy in lumens/watt.
1.5
'"E
OJ
>"
u'"
1.4
~8
u-
"
tE~
1.2
w"
1.1
0:
>N
I
I-
~
0:
0:
U
r'"
"
'"
WW
3~
;<
0:
~
1.3
wo:
It
0:0
I
~
-~
V F ~ FORWARD VOLTAGE - V
Figure 7. Forward Current versus
Forward Voltage.
tp
~
IF - FORWARD CURRENT - rnA
Figure 8. Relative Luminous Intensity
versus Forward Current.
IpEAK - PEAK CURRENT - rnA
Figure 9. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.
PULSE DURATION -IlS
Figure 11. Relative Luminous Intensity versus
Angular Displacement.
Figure 10. Maximum Tolerable Peak Current versus Pulse
Duration. (lDC MAX as per MAX Ratings)
23
YELLOW 5082-4590 SERIES
Electrical Specifications at TA =25°C
Device
Description
Symbol
4590
4592
4595
4597
Axial Luminous Intensity
III
Min. Typ. Max.
5082-
1.5
3.5
4.5
4.0
6.0
6.5
11.0
8.0
Units
Test Conditions
mcd
IF = 10mA (Fig. 131
deg.
Note 1 (Fig. 16)
50
50
4590
4592
4595
4597
2f.Jy,
Included Angle Between
Half Luminous Intensity'
Points
APEAK
Peak Wavelength
583
nm
Measurement @ Peak (Fig. 1)
Ad
Dominant Wavelength
585
nm
Note 2
T$
Speed of Response
90
ns
45
45
C
Capacitance
18
pF
8JC
Thermal Resistance
100
°cm
VF
Forward Voltage
2.2
BVR
Reverse Breakdown Voltage
T/v
Luminous Efficacy
Notes: 1. 8V2 is the
off~axis
3.0
V
5.0
V
ImIW
570
VF = 0; f
=1 MHz
Junction to Cathode Lead 1.6mm
(0.063 in.) from Body
IF = lOmA (Fig. 12)
IR '" lootLA
Note 3
angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, A.d. is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie. in watts/steradian may be found
from the equation 'e = IY/1lY, where Iy is the luminous intensity in candelas and 1ly is the luminous efficacy in lumens/watt.
20
TA
"
15
I
10
i
E
...I
iiia:
a:
::J
u
"a:
"s:a:
~
~ 25'C
1.5
I
2.0
;0 ...
::J"
00
2W
-N
::J-'
_/
1.5
-,"
w"
1.0
~~
.5
>'"
i=~
2.0
2.5
o
3.0
v
/
1.5
>-g
u"
~~
u-
o
/
~~
1. 1
~:E
1.0
wa:
a::: 0
6
.9
.8
10
15
20
Figure 13. Relative Luminous Intensity
versus Forward Current.
'"
1.3
1.2
i=~
",'"
1.4
:t!i
wo
IF - FORWARD CURRENT - rnA
Figure 12. Forward Current versus
Forward Voltage.
tp - PULSE DURATION -
/
1.6
:/
/i _
,,'"
V F - FORWARD VOLTAGE -
'2~'C
"'0
2_
)
1.0
TA
wE
I
i!
I
i
I
...>-
~<
I
-'!-
2.5
I
,/'
--
/
V
I
/
-10
20
30
40
Figure 16. Relative Luminous Intensity versus
Angular Displacement
24
60
Figure 14. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.
j.I.S
Figure 15. Maximum Tolerable Peak Current versus Pulse
Duration. (JDC MAX as per MAX Ratings).
50
IpEAK - PEAK CURRENT - rnA
GREEN 5082 -4990 SERI ES
Electrical specifications at TA=25°C
Description
Symbol
"!Or,
Included Angle Between
Half Luminous Intensity
Points
APEAK
Peak Wavelength
Ad
Dominant Wavelength
Ts
Speed of Response
C
Capacitance
•.. IJJc
4990
2.0 4.5
6.0 7.5
3.5 6.5.
8.0 11.0
Typ.
4990
4992
4995
4997.
.
. .
.
\Inits
:
mcd'
..
,
BVR
Reverse Breakdown Voltage
..IF.=~m~.
· . ··········:\f~:lsl~• ·•· .· · · · . .
jj&g,
.N9t~ 1 (fUg.21).
om"
Me&$Uremeot'(9le~#k(FI9,
40
570
.. ' nm
200
ns
12
pF
90
°C/W
2.4
3.0
';
".
......•.
"
"
..
~:'
.
.•...
H.e. .. . .
·/f····
ti; '. "
..
.' ...•.......
....
VF""O;f'"1 MHz.
Junction to Cathode Leadl.6mm
(0.063.ln.1 tram Body
.'.
IF'" 2OmA(Flg. 17) "..
fR '" 100).lA
V
Note 3
ImIW
665
;:
........
.Nota 2· •..• :.'. •..•..
V
5.0
Luminous Efficacy
.......
......
'. 'l':i
Forward Voltage
•........
'.<'
:> .}.,,.
565
.;
VF
~'st·Condltlon.;/·• ·\.}
.....
40
Thermal Resistance
"." l1v
Max.
50
50
"
;•...
,'Y
Mm.
4992
4995
4997
. Axial Luminous Intensity
Iv
Del/ice
5082-.
Notes: 1.0% is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, Ad, is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie. in watts/steradian may be found
from the equation Ie = Iv/nv. where Iv is the luminous intensity in candelas and nv is the luminous efficacy in lumens/watt.
20
f~ r····}
~
T. 25°C
"
I
TA
>I-
E
I-
'"'"
""
Cl
['
/
10
'"
ZN
it'"
I
..!:'
1.0
zw
,,-N
,,~
-,"
w"
>'"
,,;j
1.0
I-Z
2.0
2.5
"
"~
"@
/
""'"
;;
......V
3.0
0
V"
10
1.1
20
25
30
..
.7
'.
1/ I
1.0
.8
15
;,
./'
:;.
1.2
N
:::;
./
,5
/~
1.3
I-
V
_0
'"
1.5
V(
OCl
)
,5
1.5
~~
I
";:
U
z"
wE
1-0
I
iii
1.4
2.0
in_
15
1.5
225,C
/
o
I
10
I.
20
30
40
50
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
IpEAK - PEAK CURRENT - mA
Figure 17. Forward Current versus
Forward Voltage.
Figure 18. Relative Luminous Intensity
versus Forward Current.
Figure 19. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.
3
30KHz
I
100 KHz
II
3KHz
I 10 KHz
\ 1\
1
1,0
10
100
I
300Hz
III
111Hz
100Hz
\
1000
10,000
tp - PULSE DURATION - J15
Figure 21. Relative Luminous I ntensity versus
Angular Displacement.
Figure 20. Maximum Tolerable Peak Current versus Pulse
Duration. (IDC MAX as per MAX ratings).
25
60
HEWLETT
Ii
SOLID STATE LAMPS
HIGH EFFICIENCY RED· 5082-4660 Series
YELLOW· 5082-4550 Series
GREEN· 6082-4950 Series
PACKARD
COMPONENTS
TECHNICAL DATA APRIL 1977
Features
• HIGH INTENSITY
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
Green
• POPULAR T-1% DIAMETER PACKAGE
• LIGHT OUTPUT CATEGORIES
• WIDE VIEWING ANGLE AND NARROW
VIEWING ANGLE TYPES
• GENERAL PURPOSE LEADS
• IC COMPATIBLE/LOW CURRENT
REQUIREMENTS
• RELIABLE AND RUGGED
Description
The 5082-4650 and the 5082-4550 Series lamps are
Gallium Arsenide Phosphide on Gallium Phosphide
diodes emitting red and yellow light respectively. The
5082-4950 Series lamps are green light emitting Gallium
Phosphide diodes.
Part
Number
5082-
General purpose and selected brightness versions of both
the diffused and non-diffused lens type are available in
each family.
4650
Package Dimensions
•
I
4655
5.081.200)
4.32 ti70l
4657
r
PLASTIC
4658
9.47 {.373)
7.96 {.aI3)
D
J(!.O5)
(1,00}
~l
4550
4555
0.89 {.0l5)
0.64(.025}
4557
~1!'.6ID
0.36(.-0141
4558
4950
4955
4957
2.54!.10}
NOM.
4958
NOTES:
1. ALL DJMENSIONS ARE IN MILUMETRES UNCHeS).
2. SILVER·:PLATED LEADS. SEE APPLICATION BULlETIt'IJ 3,
26
Application
Indicator General Purpose
Indicator High Ambient
Illuminator/Point
Source
Illuminator/High
Brightness
Indicator
General Purpose
Indicator High Ambient
lIIuminater/Point
Source
Illuminator/High
Brightness
Indicator General Purpose
Indicator High Ambient
Lens
Color
Diffused
Wide Angle
High
Efficiency
Non Diffused
Red
Narrow Angie
Diffused
Wide Angle
Non-Diffused
Yellow
Narrow Angle
Diffused
Wide Angle
Illuminator/Point Non-Diffused
Source
Illuminator/High Narrow Angle
Brightness
Green
•
Electrical Characteristics at TA=25°C
Symbol
Iv
Description
Luminous Intensity
Device
5082-
4650
4655.
4667
4658
4550
4556
4657
4558
Min.
1.0
3.0
.9.0
11).0
1.0
2.2
6.0
12.0
Umts
,.
mect. .
2.0
4.0
. 12.0
24.0'
1.8
3.0
·9.0·
4550
4655
4657
4658
(Fig. 8).
1;8
3.0
9.0
16.0
90
mcd.
90
35
De9.
IF .. 1amA
See Note 1 (Fig. 6)
Oeg.
IF -lamA
See Note 1 (Fig. 11)"
30
30
Ollg.
'F" 20niA
See Note 1 (Fig.
635
583
565
626
nm
Measurement at Peak
90
90
200
ns
pF
46505
16
18
18
135
45505
135
49505'
145
4650s
2.2
2.2
4
45505
4950$
4650s
45505
49505
. ~~45505'
4950s
Rell4irse Br~n Volt. All
4650s
4550$
2.4
See Note 2 (Fig.1)
nm
VF .. O,f '" 1 MHz
Junction to Cathode
Lead at Seating Plane
3.0
3.0
3'.0
v
V
5.0
147
16)
(Fig. 1)
565
572
1'lv
IF:" 20mA
(Fig. 13)
35
90
90
35
35
90
90
>.pEAK
c
·1F"',QmA
·mcd.
16.0
lumens/watt
IF ,. 10mA (fig. 2,
IF '" lOmA Fig.7,
IF .. 20mA Fig. 12)
IR = l00J,IA
See Note 3
570
665
495
NOTES:
1. 9% is the off·axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ;\d. is derived from the CI E chromaticity diagram and represents the single wavelength which defines the color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation le='v/Tlv. where Iv is the luminous intensity in candelas and Tlvis the luminous
efficacy in lumens/watt.
27
. _ - - - - - - _..
__. _ - - - - - - - - -
Absolute Maximum Ratings
Yellow
4850 Series
4550 Sefies
O....n
4960 SerIes
Unfte
120
120
120
mW
20
20
60
60
30
60
mA
mA
High Efficiency Red
P.-ameter
POWEIf Disaipation (derate linearly
from 5(l°C at 1.6mW/"C).
Average Forward Current
Peak Operating Forward Current.
(fig. 5)
(Fig. 10)
(Fig. 15)
~55°C to +100"C
Operating and Storage Temperature Range
Lead Solder Temperature (1.6mm(0.063
inch) below package base)
2SOO C for 5 seconds
1.0
'.5
~~
14
~
~~
~
'.3
~!i
[3
~:1
~<
~
w~
I
..
~
.7 0
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - rnA
Figure 7. Forward Current vs.
Forward Voltage.
..
.....
...... '
I':..
1,'-
""':"
..
'"'
.... '
. .....
I...
..
., I
~~
_.
.'.~.
'.0
>~
Ii!
.
,2 I ...···'··
,1.. •.
f
IT:
!i!iil
~
<
"'
I
..
20
1
30
40
50
60
IpEAK - PEAK CURRENT - mA
Figure 8. Relative Luminous Intensity
vs. Forward Current.
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
tp - PULSE DURATION - ps
Figure 10. Maximum Tolerable Peak Cur·
rent vs. Pulse Duration. (lDC MAX
as per MAX Ratings)
Figure 11. Relative Luminous Intensity vs. Angular Displacement.
Green 5082-4950 Series
0
~
I
~
r·
[3
L
~
~
<
~
_.
I
I
I
TA ["'0
5
0
1.0
1.5
..
/'
1.0
/
.5
2.0
2.5
3.0
V F - FORWARD VOLT AGE - V
Figure 12. Forward Current vs.
Forward Voltage.
10
'/
0
,
".
8
15
, ./
2
1
. . . . /,.v
00
;'
3
1/
20
25
30
IF - FORWARD CURRENT - mA
Figure 13. Relative Luminous Intensity
vs. Forward Current.
7
V
t1
/
IpEAK - PEAK CURRENT - rnA
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
tp - PULSE DURATION - /.IS
Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (lDC MAX
as per MAX Ratings)
Figure 16. Relative Luminous Intensity vs. Angular Displacement.
29
,
.....
4
'.5
)
.5
5
225,·C
2.0
I
5
0
TA
""""""
HEWLETT' PACKARD
RECTANGULAR SOLIC STATE LAMPS
HIGH EFFICIENCY RED 5082-4670
YELLOW 5082-4510
GREEN· 5082-4970
COMPONENTS
.'.
TECHNICAL DATA
APRIL 1977
Features
• RECTANGULAR PACKAGE
• FLAT HIGH INTENSITY EMITTING SURFACE
• STACKABLE ON 2.54 MM (0.100 INCH)
CENTERS
• IDEAL AS FLUSH MOUNTED PANEL
INDICATORS
• IDEAL FOR BACKLIGHTING LEGENDS
• LONG LIFE: SOLID STATE RELIABILITY
• CHOICE OF 3 BRIGHT COLORS
HIGH EFFICIENCY RED
YELLOW
GREEN
• IC COMPATIBLE/LOW CURRENT
REQUIREMENTS
Description
The 5082-4670, 4570 and 4970 are solid state lamps encapsulated in an axial lead rectangular epoxy package. They utilize a
tinted, diffused epoxy to provide high. on-off contrast and a flat high intensity emitting surface.
The -4670 has a high-efficiency red GaAsP on GaP LED chip in a light red epoxy package. This lamp's efficiency is
comparable to that of the GaP red but extends to higher current levels.
The -4570 provides a yellow GaAsP on GaP LED chip in a yellow epoxy package.
The -4970 provides a green GaP LED chip in a green epoxy package.
Package Dimensions
::::;::==:1=0+--.*t
t 2.64 (.100) NOMINAL
.64 (.025)
:36fOi4i
NOTES,
1. ALL DIMENSIONSARE IN MILLIMETERS (INCHES).
2. SILVER·PLATEO lEAOS. SEE APPUCATION BULLETIN 3.
30
+---'-
Absolute Maximum Ratings at TA=25°C
Parameter':~;::"i/;:';:
..
.
Po~er Oi~I~6~::';~S;>'
'.
(der!lte ilnea'rf1from·:5~tat·
1.6niW~C)':~~~~+;Stt~'~~';:·~,~ ~
A~agitii~~;;~t~;~:~;·
··P~~FJ~;~r~~~{?;\O;. ·
. Leaci.sdi~.rih~':t~mj;$rature ...
. {1:61'1UT\.(0:!)63, iJj,) JrolTl'b9dyl·
Electrical/Optical Characteristics at TA =25°C
Symbol
Iv
Axlal'l..uminous .
lot~~lty
.
I"eluded Angle. .
Between Half. .
Lumino\I$.lntehsltY
Points. Both Axes
APEAK
~~k Wliveie~~h ..
::
~,
Ad
.TS
r"
C
(;)jC
Thermal Resistance···
130
l ..
136·· .
JuoctiontoCathode
Lead at 1.6 mm
(0.063 in.) frpm
,Body
2.33.(r
VP.
eVa
Reverse BreakdOW~ ,. .' M
1/v
Luminous Efflca~y'·.
Voltage
.
.2.3
..
147
NOTES:
1. Luminous sterance. Lv, in foot lamberts, may be found from the equation Lv = 16.7 lv, where Iv is the luminous intensity in
millicandelas.
2. ('>I12 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
4. Radiant intensity, I" in watts/steradian, may be found from the equation 1.=lv/'Iv, where Iv is the luminous intensity in candelas and
'IV is the luminous efficacy in lumens/watt.
31
1.0
....>-
0;
....~
i!O
w
~-- .
0.5
>
;::
..u1
a:
0
500
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength.
HIGH EFFICIENCY RED 5082-4670
20
2.0
T)26'C
<:
;;z<:
E
I
....
~~
15
!
::>
"~
10
<:
~
it
I
-"
.5
1.0
TA .. 25~C
>....
1.5
/
l
2.0
--
:--
1.5
<:
f---
~@
"N
::>::;
1.0
~<:
w"
>"'
0
~~
.5
a:
2.5
3.0
V F - FORWARD VOLTAGE - V
IF
FORWARD CURRENT - rnA
Figure 2. Forward Current vs. Forward
Figure 3. Relative Luminous Intensity vs.
Voltage.
Forward Current.
IpEAK - PEAK CURRENT - rnA
Figure 4. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak Current.
tp - PULSE DURATION-/lS
Figure 5. Maximum Tolerable Peak Current vs.
Pulse Duration. (I DC MAX as per MAX Ratings.)
Figure 6. Relative Luminous Intensity Vs. Angular Displacement.
32
,
YELLOW 5082-4570
20
T.i.e
0
~~
00
zw
i~
w"
~~
>"'
~-
)
.5
1.0
1.5
1.0
,,-'
-,'"
1/
"
.,. .......
1."
~~
I
0
1.5.--.--,---r--"'-r""A-·"T
>t:
U>Z'"
wE
"
2S=·C""
2.0
.5
"'
2.0
2.5
3.0
VF - FOR,.ARD VOLTAGE - V
IpEAK - PEAK CURRENT - rnA
IF - FORWARD CURRENT - mA
Figure 7. Forward Current VI. Forward
Voltage.
Figure 8. Relative Luminous Intensity vs.
Forward Current.
Figure 9. Relative Efficiency (Luminous
I ntensity per Unit Current) vs. Peak Current.
tp - PULSE DURATION - /JS
Figure 11. Relative Luminous Intensity vs. Angular Displacement.
Figure 10. Maximum Tolerable Peak Current vs.
Pulse Duration. (I DC MAX as per MAX Ratings.)
GREEN 5082-4970
20
1
I
~
!5'u"
r
0
TA
~
l:wc
WE
ZN
2.0
U
/'
1-0
~!;t
I
10
I
-,'"
w"
.5
1.0
1.5
1.0
>"'
_0
~~
)
00
./V
ZW
II
-~
1.5
00
~~
.5
2.0
2.5
3.0
VF - FORWARD VOLTAGE-V
Figure 12. Forward Current
Voltage.
Vs.
Forward
~d
UN
1.2
wo
Ww
1.1
~~
1.0
"'0
.9
u'"
w",
-'"
~
15
."
20
25
30
IF - FORWARD CURRENT - rnA
Figure 13. Relative Luminous Intensity vs.
Forward Current.
."
,....
I'
I
{.~.
.S
..J / '
10
1.3
!26'C
>~
±
00
>-0
~~
V
1
"'
'.,<
1.4 r- TA
~;;(
15
ill"'
"'~
~.
1.5
I
T):WC .
ifb6
/
/
,~
10
20
30
40
50
Figure 14. Relative Efficiency (Luminous
Intensity per Unit Current) Vs. Peak Current.
Ip - PULSE DURATION - ill
Figure 15. Maximum Tolerable Peak Current vs.
Pulse Duration. (lDC MAXas per MAX Ratings.)
Figure 16. Relative Luminous Intensity vs. Angular Displacement.
33
--.----::~~-
60
IpEAK - PEAK CURRENT - rnA
SOLID STATE LAMPS
HEWLETT
PACKARD
HIGH EFFICIENCY RED • 5082·4684
YEllOW • 5082-4584
GREEN • 5082 -4984
COMPONENTS
TECHNICAL DATA
APRIL 1977
Features
• HIGH INTENSITY
• WIDE VIEWING ANGLE
• SMALL SIZE T-1 DIAMETER
3.18mm (0.125 inch)
• IC COMPATIBLE
• RELIABLE AND RUGGED
• CHOICE OF 3 BRIGHT COLORS
HIGH EFFICIENCY RED
YELLOW
GREEN
package Dimensions
PLA
-
~I
t
Description
The 5082-4684 is a Gallium Arsenide Phosphide on
Gallium Phosphide High Efficiency Red Light Emitting
Diode packaged in a T·1 outline with a red diffused lens,
which provides excellent on-off contrast ratio, high axial
luminous intensity and a wide viewing angle.
318 (125)
r-- 2:67': lOS)
I-~~
2.921.1151
~
3.43j.'351
6.1 01.2401
5.08 (']001
,,"-c
•
1
J
~M
+
The 5082-4584 is a Gallium Arsenide Phosphide on
Gallium Phosphide Yellow Light Emitting Diode packaged in a T-1 outline with a yellow diffused lens, which
provides good on-off contrast ratio, high axial luminous
intensity and a wide viewing angle.
1 ,.
f
02 (.0401
NOM.
I
14.22(0.56)
MIN.
The 5082-4984 is a Gallium Phosphide Green Light
Emitting Diode packaged in a T·1 outline with a green
diffused lens, which provides good on-off contrast ratio,
high axial luminous intensity, and a wide viewing angle.
15.4910.61)
MIN.
I
I
The 5082-4684, -4584, and -4984 are designed for
applications where space is at a premium, such as in high
density arrays.
I
__tI
~'-
-l
II.
......... 3.0610.12
MAX.
..
-~
1_
0'64;j"0251_~
0.38(.0151
I~CATHODE
'_./
0)
2.541.100)
2.03 (.0801
_.t
--t
~~
0.38 (.Oi5)
NOTI'S;
1. ALL DIMEN5101\1$ ARE IN MILLIMETERS (INCHES!.
2. SILVER.PLATED LEADS. sEE APPLICATION RUlLETlN 3.
34
,,-",
Absolute Maximum Ratings at TA=25°C
YellOw;'-'" ,-
High Effic;iency Red
4684
Green ;,
4584
Units
4984
Power DisSlpetiOn'
(derate rlriearlffrom sooe at
, '1.6mWI':Ci' ", "
.
120 '
'. P~k Forward Current
60
60
Operating and Storage,
Tein!)eratur~ RaDge,
mW
30
mA
mA
60
~Fig.10
See Fig. 5
120
See Fig.15
"
. Lead Soldering Tillllpel:ature
'[1.6mm
(0:-06310.) from body]
Electrical/Optical Characteristics at TA=25°C
--fr~""
5082-4684
Symbol
Description
Min. Typ. Max. Min.
Iv
Axial Luminous
InteRalty
1.0
2ey"
Included Angle
Between Half
Luminous Intensity
Points
-.
2.5
1.0
Typ.
In.
2.5
. '-"'med
=,
,
. -.... 'MlF
60
70
.Units
:-k!-
Peek Wavelength
~
Dominanl Wavelength
7$
Speed of Response
90
C
Capacitance
ElJC
583
565
~
572
200
20
Iio
1'5
Thermal R es1stance
95
95
95
VF
Forward Voltage
2.2
eVR
Reverse Breakdown
Voltage
2.2
'.
":';t,
IF = 10mA.
Figs. 3, B, 13
deg.
Note 1. Figure. 6, 11, 16
feY
.':
?..~
nrrr.
Measurement at Peak
'ran
Note 2
-
8
~t
3.0
"
60
.: ~~"'>.:,j~
"
'J
ApEAK
:)
Tilst,~nclltlon.
2.4~
3.0
l,~::::;;.~
3.0
,.
ns
+
0;
f
..
pF
VF
"elW
J\mction to Cathode. Lead
at O.79mm {.03l Inl from
Body
V
IF = 10rnA,
Figures 2, 7, 12
>=
1 MHz
at IF =2OmA
5.0
'.
<.,<
Luminous Efficacy .c:' r~;;t~~ ~:m.
17"
5.0
5.0
"
~v
.
,y<~;"
\~>;fi,;';
:,
570
'
ImlW
' IR" 100llA
~~?:
:.:0.',<
Note'3
'.;~.':'
NOTES:
1. 9% is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2 The dominant wavelength, Att. is derived from the CI E chromaticity diagram and represents the single wavelength which defines the color of the device.
3. Radiant intensity, Ie, in watts/steradian. may be found from the equation le=lv/nv. where Iv is the luminous intensity in candelas and nvis the luminous
efficacy in lumens/watt.
1.0
...;;;>
z
...w!
w
0.5
>
~
W
0:
0
500
750
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength.
35
High Efficiency Red 5082-4684
20
1
I
~
~U
C
~
,.
f.
~ ,.·C
6
I
>
3.0
5~~A·,,1_1-_' --""~--
f-TA .J·C
I
~
~;t
~~
g@
~~
,. I--
~<
I--
;
/
2.0
~~
~<
w~
~
>~
;:::~
.,.
~~
;1
°0
.6
1.0
1.6
2.0
'.0
2.5
3.0
00
VF - FORWARD VOLT AGe - v
/
/'
2
,
V
",-
r
3
OJ
9
I
---.
15
Figure 3. Relative Luminous Intensity
vs. Forward Current.
_.
. 1--
6
20
--
~--.
20
30
40
-'--'
--
r--
. - 1--
7
10
,--I · -- ,.--i-- -- . -
/
I
8
IF - FORWARD CURRENT - rnA
Figure 2. Forward Current vs.
Forward Voltage.
tp -
4
50
60
hAK - PEAK CURRENT - rnA
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
PULSE DURATION -/1$
Figure 5. Maximum Tolerable Peak Cur·
rent vs. Pulse Duration. (lDCMAX
as per MAX Ratings).
Figure 6. Relative Luminous Intensity vs. Angular Displacement.
Yellow 5082-4584
2.5,---,_ _-,_ _-,_-.
20
<
E
I
!
~
,.
fA
~ 2S'C
I
I
2.0
2.0
I--
'0
I iI
~
'.5
0
'.01-----1---)''--+---4
0
I
~
I
_.
I
°0
.5
1.0
1.5
A
2.0
... ......
fA ;25'C
,,J
...
/
I
I
2.5
0
3.0
VF - FORWARD VOLTAGE - V
Figure 7. Forward Current vs.
Forward Voltage.
IF - FORWARD CURRENT - mA
Figure 8. Relative Luminous Intensity
vs. Forward Current.
10
20
30
40
Figure 11. Relative Luminous Intensity vs. Angular Displacement.
36
60
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current •
PULSE DURATION -11$
Figure 10. Maximum Tolerable Peak Current
vs. Pulse Duration. (lDC MAX
as per MAX Ratings.)
50
IpEAK - PEAK CURRENT - mA
.90'1--+--+--1
tp -
",-
,.Ii
Green 5082-4984
VF - FORWARD VOLT AGe -
v
Figure 12. Forward Current vs.
Forward Voltage.
IF - FORWARD CURRENT - mA
Figure 13. Relative Luminous Intensity
vs. Forward Current.
!PEAK - PEAK CURRENT - mA
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
tp - PULSE DURATION -IJS
Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration. (lDC MAX
as per MAX Ratings.)
Figure 16. Relative Luminious Intensity vs. Angular Displacement.
37
/
~
HEWLETT. PACKARD
.VOLTAGE SENSING LED
5082-4132
COMPONENtS
TECHNICAL DATA APRIL 1977
SLOCK DIAGRAM
TEMPERATURE
~COMPARATOR
COMPENSATED
LED
REFERENCE
DRIVER
VOLTAGE
'---.--.....
r
0.6;)41.0251
[3jj f,Di5) GNO.~
VIN
,-- _1
t
... - /
GNO.o-·-_ _ _ _ _ _ _ _ _
0.$4 f,(12S)
~~----l
o:3e (.015)
ALL DIMENSIONS ARE iN MILLIMETRES {INCHES},
Features
Description
• HIGH SENSITIVITY: 10mV ON TO OFF
The HP voltage sensing LEDs use an integrated circuit and a
red GaAsP LED to provide a complete voltage sensing function
in a standard red diffused T-1 LED package. When the input
voltage (V IN) exceeds the threshold voltage (V TH) the LED
turns "on". The high gain of the comparator provides unambiguous indication by the LED of the input voltage with
respect to the threshold voltage. The V-I characteristics are
resistive above and below the threshold voltage. This allows
battery testing under simulated load conditions. Use of a
resistor, diode or zener in series allows the threshold voltage
to be increased to any desired voltage. A resistor in parallel
allows the sensing LED to be used as a current threshold
indicator.
• BUILT IN LED CURRENT LIMITING
• TEMPERATURE COMPENSATED THRESHOLD
VOLTAGE
• COMPACT: PACKAGE INCLUDES
INTEGRATED CIRCUIT AND LED
• GUARANTEED MINIMUM LUMINOUS
INTENSITY
• THRESHOLD VOLTAGE CAN BE INCREASED
WITH EXTERNAL COMPONENT
The 5082-4732 has a nominal threshold voltage of 2.7V.
Applications
Absolute Maximum Ratings
• Push-to-test battery voltage tester (pagers,
cameras, appliances, radios, test equipment ... )
• Logic level indicator
• Power supply voltage monitor
• V-U meter
• Analog level sense
• Voltage indicating arrays - use several with
different thresholds
• Current monitor
Storage Temperature. . . . . . . . . . . . . .. -55°C to +100°C
Operating Temperature. . . . . . . . . . . . . .. -55°C to +85°C
Lead Solder Temperature ............. 230°C for 7 Sec
Input Voltage - VIN [11 • . . . . . . • • • • • • . . • . • . . +5V dc
Reverse Input Voltage - VR .. . . . . . . . . . . . . . .. -O.5V
NOTES:
1. Derate linearly above 50° C free-air temperature at a rate of 37mVfC.
38
Electro-optical Characteristics at TA=25°C
'. ./ ". c.:": ... , :1Oft,4'3%': .
Syni.
...
".
:. Mill•.. ,
,Max.:
.: Typ.' .'
'T8It~
.... ~
Fig.
',1,2
Temlierat,...... Co8fflci.·.:
'mvfr; ...
. of ThreshQIc:C,
.. :
.13
'.33 ..:
'/v
Wavelength
.• '.
E
zw
"
2.5
...
I
YIN-2.1S"
.1'
:2
.~reI\'lfIIitllt pee,l<;'
Note 1
TA =26'0
1.5
19Q,V
''OF'''' 10 "ON" .
1.0
40
:>
30
CJ
..!5
..
"VItO: ~ l00n-
'AI
.1tO
a:
a:
20
~
·7
.5
zw
I-
V
/
50
0
z
:E
:>
JlICd
60
I-
~
ViN·2.n1'i1
VIN·~6.0V
2
I,11A·
IVII .
. IVII
TA·>25~~
I
>
I-
iii
'. .'
". 665.'
.639
.~.
3.0
'B
inA
..
.0.3.
".
. ApliAK .'
Dominant Wavelength .
..•.•.~
I
!
10
r
IN...
t;T,;; "~~."
lA
I
-'
o
o
4
6
VIN -INPUT VOLTAGE - V
Figure 1. Luminous Intensity vs.
Input Voltage.
-
\
/
3
VIN -INPUT VOLTAGE - V
Figure 2. Input Current vs. Input Voltage.
Figure 3. Relative Luminous Intensity vs.
Angular Displacement.
Techniques For Increasing The Threshold Voltage
VTM
E~.nal~t
V~H
Elft1IRNAL
COI!IPON~NT
Vre
:
: ...
1
I
1
L. __
,-.
r-- -------,
r~~l";::"IVO\.T~
I
lUD
~
':'
Notes:
___ .., __ ..1I
"
'V~
TH
TH
.;;.
'V~TH
V~H
V'TH
AV'TH
TC---lmVfC)
ATA
Schottky D10de .
VTH+O.46V
-2
"Tt-l + .o.15V
-2.5
"TH+ 1.6V
-2.9
(HP 5082·~~)
P-N DiOde
(IN9141
LEO
(HP 5082-44841 .
zener Diode
VTH+VZ
-1 +ZenerTC
Vi
1. The dominant wavelength, Act, is derived from the CIE chromaticity diagram and represents the single wavelength which
defines the color of the device.
2. ITH is the maximum current just below the threshold, VTH. Since both ITH and VTH are variable, a precise value of
v'TH' is obtainable only by selecting R to fit the measured characteristics of the individual devices (e.g., with curve tracer).
3. The temperature coefficient (TC) will be a function of the resistor TC and the value of the resistor.
39
",,:
."
'".,
PACKARD
.50.82 ~4860
REStSJOR,LEOS .
5082~4468.
,
':~
TECHNICAL DATA
APRIL 1977
I't.ASTIC.
0.89!,11;l!;1
6:i4~
. ..L-
. l'AO,~'-r-r-r-r'-'-::=t+
fflf.ij3ijl
t_,
15.24·
16.1i"
1.861·
'.!
ML'N.
I
~.1.~.
M1'N..' ..
I
ii:5H02Ol
....
---
" mrm
ta
f
l/"~)' 6.10t.240!
.
/.
_ _ ...: .
ii5i(:02Ol
..
.
O.16~/-
.
CATIiOOE.
,
'.
. Olfl\ENSIoNS
,.,: . .
.'
'.'
IN MIL~METEllSANo (tNCliES! .
Features
• TTL COMPATIBLE: 16mA @ 5 VOLTS TYPICAL
• INTEGRAL CURRENT LIMITING RESISTOR
• T-1 DIAMETER PACKAGE, 3.18mm (.125 In.}
T-H'4 DIAMETER PACKAGE, 5.08mm (.200 in.)
• RUGGED AND RELIABLE
Description
The HP Resistor-LED series provides an integral current limiting resistor in series with the LED. Applications include panel mounted indicators, cartridge indicators, and lighted switches.
The 5082-4860 is a standard red diffused 5.08mm (.200") diameter (T-1% size) LED, with long wire wrappable leads.
The 5082-4468 is a clear diffused 3.18mm (.125") diameter (T-1 size) LE D.
Absolute Maximum Ratings at TA = 25°C
DC Forward Voltage [Derate linearly to 5V @ 100°C] .•••........•......•.•. _•...•... "
7.5V
Reverse Voltage ..•..•..•.••...•.••••.....•.•..•.......••..•.....•......•.......• 7V
Isolation Voltage [between lead and base of the 5082-4860] •..•...•.......•...•.........•. 300V
Operating and Storage Temperature Range ...••..•.••••....•.•.•..•.......•. -55°C to +100o e
Lead Soldering Temperature ...• _. . • . • • . . . . . • • . . . . • • . . • . • . . • . . • . . . . . . • . .• 230°C for 7 sec.
40
Electrical Characteristics at TA = 25°C
Parameters.· .
Symbol
. Luminous IntensitY : .
Iv
0.3.
0.$
""'EAK
Speed of Response
,ns .
• . 15
16
Forward Current
Rewrse BreakdoWn Voltage
.20·
3
rnA
V
TYPICAL RELATIVE LUMINOUS INTENSITY VERSUS ANGULAR DISPLACEMENT
4860
4468
40"
50'
60'
70"
80'
2-t--c-t--c-H 90'
C\
30
/
25
~
I 20
~
/
0:
0:
"
c" 15
V
0:
~
I(
v
10
I
o
j
/
I
o
1000
800
2.50
600
2.25
~
400
I
~
~200
w
Figure 1. Typical DC Forward Current Voltage Characteristic
~
5 100
80
3'
w
1.76
~
In
i
2.00
.
~
,
1.00
'\.
40
20
1
-25
0
25
50
75
I
/
V
10
100
Tc - CASE TEMPERATURE - °C
Figure 2. Relative Luminosity vs. Case
Temperature
41
/
. I
.50
.26
-50
I
.75
\
w
0:
/
1/
1.25
"-
60
5
I
1.60
>
-75
VF - FORWARD VOLTAGE - V
"\
I
v, -
FORWARD VOLTAGE - V
Figure 3. Relative Luminous Intensity
¥s. Voltage
/
HEWLETT
ifill
jj
PACKARD
COMPONENTS
HERMETIC
SOLID
STATE
LAMPS
TO-46
1M6092* (5082-4620)
1N6093* (5082-4520)
1N6094* (5082-4920)
1N5765 (5082-4420)
JAN lN5765
JAN TX 1N5765
PANEL MOUNT
5082·4687
5082·4587
5082·4987
5082·4787
TECHNICAL DATA APRIL 1977
Features
• CHOICE OF 4 COLORS
Red
High Efficiency Red
Yellow
Green
• DESIGNED FOR HIGH-RELIABILITY
APPLICATIONS
• HERMETICALLY SEALED
• WIDE VIEWING ANGLE
• LOW POWER OPERATION
• IC COMPATIBLE
• LONG LIFE
• PANEL MOUNT OPTION HAS WIRE
WRAPPABLE LEADS AND AN
ELECTRICALLY ISOLATED CASE
TO-46
Description
The 1N5765, 1N6092, 1N6093, and 1N6094 are hermetically sealed solid state lamps encapsulated in a TO-46
package with a tinted diffused plastic lens over a glass
window. These hermetic lamps provide good on-off
contrast, high axial luminous intenSity and a wide viewing
angle.
COLOR CODE IDENTIFICATION
1N5765, 5082-4787
HIGH EFFICIENCY RED
1N6092, 5082-4687
YELLOW
1N6093, 5082-4587
GREEN
1N6094, 5082-4987
RED
The 5082-4787, 4687, 4587 and 4987 are hermetically
sealed solid state lamps encapsulated in a panel
mountable fixture. The semiconductor chips are packaged in a hermetically sealed TO-46 package with a tinted
diffused plastic lens over glass window. This TO-46
package is then encapsulated in a panel mountable fixture
designed for high reliability applications. The encapsulated LED lamp assembly provides a high on-off contrast,
a high axial luminous intenSity and a wide viewing angle.
The 1N5765 and 5082-4787 utilize a GaAsP LED chip with
a red diffused plastic lens over glass window.
The 1N6092 and 5082-4687 have a high efficiency red
GaAsP on GaP LED chip with a red diffused plastic lens
over glass window. This lamp's efficiency is comparable to
that of a GaP red but extends to higher current levels.
The 1N6093 and 5082-4587 provide a yellow GaAsP on
GaP LED chip with a yellow diffused plastiC lens over glass
window.
HERMETIC PANEL MOUNT
The 1N6094 and 5082-4987 provide a green GaP LED chip
with a green diffused plastiC lens over glass window.
'These parts are now JAN and JAN TX qualified; they are also
available in the panel mount option.
42
JAN 1N5765:
Samples of each lot are subjected to Group A inspection for parameters listed in Table I, and to Group
B and Group C tests listed below. All tests are to the conditions and limits specified by MI L-S-19500/467. A summary of
the data gathered in Groups A, B, and C lot acceptance testing is supplied with each shipment.
JAN TX 1N5765:
Devices undergo 100% screening tests as listed below to the conditions and limits specified by MILS-19500/467. The JAN TX lot is then subjected to Group A, Group B and Group C tests as for the JAN 1 N5765 above.
A summary of the data gathered in Groups A, Band C acceptance testing can be provided upon request. Serialized data can
be gathered, but lead times will be increased accordingly.
~oct
Group B Sample Acceptance Tests
. MIL-STD·7S0
.~
Physical Dimensions
Thermal Shock
,. f-"'}'':~'~':f'~"
Temperature C~g;:;~;~ ..
"
~1.;~
Fine Leak Test
Gross Leak Test
Ci;
1061A
~
1061A
Peak: Forward Pulse Current
~.~.
.'.,.
4021
.
,
'.'
k
"
1071C
Moisture Resistance
1021
Mechanical Shock
2016
Vibration
2056
Constant Acceleration
2006
Terminal Strength
203SE
Salt Atmosphere
1041
Temp. Storage (l000C, 340 hours)
1032
Operating Life (50mAdc. 340 hours)
1027
1026
·,f",,,,\
/~.
TX Screening (100%)
~.t
1031
:i::'"
1071H
;r:'
..
Resistance to Solvents
Temp; StOrage (l()QOC, 1K hours)
Operating Life (50mAdc,1KhGurs)
1066A
~
MIL-$TI)·750
· CoW Temp_Operation !-55°C}
Breakdown Vott;aQe
Temperature Cycling
2026
Solderability
Method "i
GroUp C Sample Acceptance Tes:b
,. .
"~~f,
..
*:~~
Temp. Storage I1000C, 72 hours)
Temperature Cycling
1051A
Constant Acceleration
2006
· Fine L8ak Test
10nH
Gross Leak Test
1071C
· Bum-in (50mAdc, 168 hours!
>.-~
Evaluation of Drift
(lVI' "r' , I R )
;.~
'<\:~
1.75
~<
~~
!N
~~
1.26
~S
1.00
t
[
>
1.50
~i~
~~
i~
W Q
W w
~~
~~
w~
1.0
1.5
2.0
2.5
VF - FORWARD VOLTAGE - V
Figure 17. Forward Current VS.
Forward Voltage.
N
~
~
~
t=~ 0.50
.5
>
~
0.75
>~
g-
H
:::i
~
~~
0.25
10.00
15.00 20.00
25.00
30.00 35.00
IF - FORWARD CURRENT - mA
Figure 18. Relative Luminous Intensity
vs. Forward Current.
IpEAK - PEAK CURRENT - mA
Figure 19. Relative Efficiency
(Luminous Intensity per Unit
Current! vs. Peak Current.
tp - PULSE DURATION -!l5
Figure 20. Maximum Tolerable Peak Cur·
rent vs. Pulse Duration. UDC MAX
as per MAX Ratings)
Figure 21. Relative Luminous Intensity vs. Angular Displacement.
47
COMPONENTS
TECHNICAL DATA
Description
The 5082-4707 is a black plastic mounting clip
and retaining ring. It is designed to panel mount
Hewlett Packard Solid State T-1% size lamps. This
clip and ring combination is intended for installation in instrument panels up to 3.18mm (.125")
thick. For panels greater than 3.18mm (.125"),
counterboring is required to the 3.18mm (.125")
thickness.
I!I.
6,35
(,250)
DIA.
IIJ
I---- 6,86(,270) OIA, ---I I
9.53 (.375 ) DIA. ____
RETAINING
RING
CLIP
Mounting Instructions
J
1. Drill a 6.35mm (.250") dia. hole in the
panel. Deburr but do not chamfer the
edges of the hole.
2. Press the panel clip into the hole from
the front of the panel.
3. Press the LED into the clip from the
back. Use blunt long nose pliers to push
on the LED. Do not use force on the
LED leads. A tool such as a nut driver
may be used to press on the clip.
p
\
PLIERS
4. Slip a plastic retaining ring onto the back
of the clip and press tight using tools such
as two nut drivers.
48
Solid State Displays
Selection Guide .................... 50
• Red, High Efficiency Red, Yellow
and Green Seven Segment Displays
•
•
•
•
Red Seven Segment Displays
I ntegrated Displays
Hermetically Sealed Integrated Displays
Alphanumeric Displays
• Chips
,
~
_-.l!IIIII"~-
49
__
.
""-'~&~ _ _ _ _ "'_"f""""'~""""""""""~':-"''''''~'''''''''''''-=-''''''-''''''-'.'"'-',·-"·""',·.r-.........,.."'_"..,....,... ..... _
......._~·.•·..v=-..,""'" . ...-.-~~ .. .....,'''.,'.>,............ ''''''''~_ .......,....,, .. ..-. .._.) •• _.,,-
"~"'''''_'''''''''_
Red, High Efficiency Red, Yellow and Green Seven Segment LED Displays
Device
~
Description
7.62mm (.3") High
Efficiency Red, Common
Anode, LHOP
7.62mm (.3") High
5082-7611 Efficiency Red, Common
Anode, RHOP
7.62mm (.3") High
5082-7613 Efficiency Red, Common
Cathode, RHOP
7.62mm (.3") High
5082-7616 Efficiency Red, Universal
Polarity Overflow Indicator
RHOP
7.62mm (.3") Yellow,
5082-7620
Common Anode LHOP
7.62mm (.3") Yellow,
5082-7621 Common Anode RHOP
7.62mm (.3") Yellow,
5082-7623
Common Cathode, RHOP
7.62mm (.3") Yellow,
5082-7626 Universal Polarity & Overflow
Indicator RHO P
7.62mm (.3") Green,
5082-7630
Common Anode LHOP
7.62mm (,3") Green,
5082-7631
Common Anode RHOP
7.62mm (.3") Green,
5082-7633
Common Cathode RHOP
7.62mm (.3") Green,
5082-7636 Universal Polarity & Overflow
Indicator RHOP
10_92mm(.43") High
5082-7650 Efficiency Red, Common
Anode, LHOP
10.92mm (.43") High
5082-7651 Efficiency Red, Common
Anode, RHOP
10.92mm (.43") High
5082-7653 Efficiency Red, Common
Cathode RHOP
10.92mm (.43") High
Efficiency Red Universal
5082-7656 Polarity & Overflow Indicator
RHOP
10.92mm(.43") Yellow
5082-7660
Common Anode LHOP
10.92mm(.43") Yellow
5082-7661
Common Anode RHOP
10.92mm(.43") Yellow
5082-7663
Common Cathode RHOP
10.92mm(.43")Yellow
5082-7666 Universal Polarity & Overflow
Indicator RHOP
10.92mm(.43") Green
5082-7670
Common Anode LHOP
10.92mm(.43") Green
5082-7671
Common Anode RHOP
5082·7610
50
Package
Application
14 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .4"W x .18"0
General Purpose Market
• Test Equipment
• 0 igital Clocks
• Clock Radios
• TV Channel Indicators
• Business Machines
• Digital Instruments
• Automobiles
For further information ask for
Application Note 941 and 964;
Application Bulletins 1 through
4. (See page 196)
10 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .4"W x .18"0
14 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .4"W x .18"0
Pagl
No.
56
(Same as 5082-7613)
14 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .4"W x .18"0
(Same as 5082-7613)
14 Pin Epoxy,
7.62mm (.3")0IP
.75"H x _4"Wx .18"0
14 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .5"W x .25"0
------s1
--
---_.__.-
[
--
il
~
Package
Application
10.92mm(.43") Green
Common Cathode RHDP
10.92mm(.43") Green
Universal Polarity & Overflow
Indicator RHDP
14 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .5"W x .25"0
5082·7730
7.62mm{.3") Red, Common
Anode, lHDP
14 Pin Epoxy,
7.62mm(.3") DIP
.75"H x .4"W x.18"D
5082·7731
7.62mm{.3") Red, Common
Anode, RHDP
General Purpose Market
• Test Equipment
• 0 igital Clocks
• Clock Radios
• TV Channel Indicators
• Business Machines
• Digital Instruments
• Automobiles
For further information ask for
Application Note 941 and 964;
Application Bulletins 1 through
4. (See page 196)
5082·7673
5082·7676
Page
No.
61
rss
7.62mm(.3") Red, Common
5082·7736 Anode, Polarity & Overflow
Indicator
5082·7740
5082·7750
I~
~--
Description
Device
-'.-...-.
...
5082·7751
5D82·7756
5D82·7760
7.62mm(.3") Red, Common
Cathode, RHOP
10 Pin Epoxy,
7.62mm (.3") DIP
.75"H x .4"Wx .18"0
10.92mm(.43") Red, Common
Anode, lHDP
10.92mm(.43") Red, Common
Anode, RHDP
10.92mm(.43") Red, Universal
Polarity & Overflow Indicator,
RHDP
10.92mm(.43") Red, Common
Cathode, RHOP
14 Pin Epoxy,
7.62mm (.3") 0 IP
.75"H x .5"W x .25"0
r--70
Red Seven Segment LED Displays
Description
Device
12 Pin Epoxy,
7.62mm (.3") DIP
5082·7415
2.79mm(.II") Red, 3 0 igits
Right.!l] Centered D.P.
2.79mm(.11") Red, 3 Digits
left,[I] Centered D.P.
2.79mm(.II") Red, 4 Digits
Centered D.P.
2.79mm{.II") Red, 5 Digits,
Centered D.P.
2.79mm (.11") Red, 3 Digits
Right.!l] RHOP
2.79mm (.11") Red, 3 Digits
left,H] RHDP
2.79mm(.II") Red, 4 0 igit,
RHDP
2.79mm{.11") Red, 5 Digit,
RHDP
5082·7432
2.79mm{.II") Red, 2 Digits
Right.!21 RHOP
12 Pin Epoxy,
7.62mm (.3") DIP
5082·7433
2.79mm{.II") Red, 3 Digits,
RHDP
5082·7402
'd .'; t:i B'B
""'tiT .'""~*
""""
Package
5082·7403
5082·7404
5082·7405
5082·7412
5082·7413
5082·7414
51
14 Pin Epoxy,
7.62mm (.3") DIP
12 Pin Epoxy,
7.62mm (.3") DIP
14 Pin Epoxy,
7.62mm (.3") DIP
Application
Small 0 isplay Market
• Portable/Battery
Power Instru ments
• Portable Calculators
• Digital Counters
• Digital Thermometers
• Digital Micrometers
• Stopwatches
• Cameras
• Copiers
• Digital Telephone
Peripherals
• Data Entry Terminals
• Taxi Meters
Page
No.
74
For further information ask for
Application Note 937.
(See page 196)
78
--
-----Device
Package
Description
2.67mmU05") Red, 8 Digits,
Mounted on P.C. Board
2.67mm(.105") Red, 8 Digits,
Mounted on P.C. Board
2.67mmU05") Red, 9 Digits,
Mounted on P.C. Board
2.67mm(.105") Red, 9 Digits,
Mounted on P.C. Board
60.3mm(2.375") PC Bd.,
17 Term. Edge Con.
50.8mm(2") PC Bd.,
17 Term. Edge Con.
60.3mm(2.375") PC Bd.,
17 Term. Edge Con.
5082·7442
2.54mm(.100") Red,12 Digits,
Mounted on P.C. Board
60.3mm(2.375") PC Bd.,
20 Term. Edge Con.
5082·7445
2.54mm(.100") Red, 12 Digits,
Mounted on P.C. Board
59.6mm(2.345")PC Bd.,
20 Term. Edge Con.
5082-7444
2.54mm(.100") Red, 14 Digits,
Mounted on P.C. Board
60.3mm(2.375") PC Bd.,
22 Term. Edge Con.
5082-7446
2.92mm(.115") Red, 16 Digits,
Mounted on P.C. Board
69.85mm(2.750")PC Bd.,
24 Term. Edge Con_
5082-7447
2.85mm(.112") Red, 14Digits,
Mounted on P.C. Board
60.3mm(2.375") PC Bd.,
22 Term. Edge Con.
5082-7240
2.59mm(.102") Red, 8 Digits,
Mounted on P.C. Board
50.8mm (2") PC Bd.,
17 Term. Edge Con.
5082·7440
5082·7448
5082·7441
5082·7449
5082-7241
5082-7265
5082-7285
5082-7275
5082-7295
50.8mm(2") P.C. Bd.,
17 Term. Edge Con.
- Application
Small 0 isplay Market
• Portable/Battery
Power Instruments
• Portable Calculators
• Digital Counters
• Digital Thermometers
• Digital Micrometers
• Stopwatches
• Cameras
• Copiers
• 0 igital Telephone
Peripherals
• Data Entry Terminals
• Taxi Meters
For further information ask for
Application Note 937.
(See page 196)
Page
No.
82
86
90
2.59mm(.102") Red,9 Digits,
Mounted on P.C. Board.
4.45mm(.175") Red, 5 Digits, 50.8mm(2") PC Bd.,
Mounted on P.C. Board.
15 Term. Edge Con_
Centered D.P.
4.45mm(.175") Red, 5 Digits
Mounted on P.C. Board. RHDP
4.45mm(.175") Red, 15 Digits, 91.2mm(3.59") PC Bd.,
Mounted on P.C. Board.
23 Term. Edge Con.
Centered D.P.
4.45mm(.175") Red, 15 Digits,
Mounted on P.C. Board. RHDP
Integrated LED Displays
Device
Description
5082-7300
5082-7302
5082-7340
5082-7304
Package
7.4mm (.29") 4x7 Single Digit
NumeriC, RHOP, Built-In
oecover/D river/Memory
7.4mm (.29") 4x7 Single Digit
Numeric, LHDP, Built-In
Decover/D river/Memory
7.4mm (.29") 4x7 Single Digit
Hexadecimal, Bu ilt-I n
Decoder/Driver/Memory
7.4mm (.29") Overrange
Character Plus/Minus Sign
52
8 Pin Epoxy,
15.2mm (.6") DIP
Application
General Purpose Market
• Test Equipment
• Business Machines
• Computer Peripherals
• Avionics
For further information ask
for Application Note 934 on
LED 0 isplay Installation
Techniques
Page
No.
98
Device
r,
C'"_.
.-'
Description
Package
7.4mm (.29") 4x7 Single Digit
Numeric, RHDP, Built·ln
Decoder/Driver/Memory
7.4mm(.29") 4x7 Single Digit
5082·7357 Numeric, LHDP, Built·ln
Decoder/Driver/M emory
7.4mm (.29") 4x7 Single Digit
5082·7359 Hexadecimal, Built·1 n
Decoder/Driver/Memory
7.4mm(.29") Overrange
5082·7358
Character Plus/Minus Sign
5082-7356
5082·7500
38.1mm (1.5") 5x7 Single
Digit LHDP, Built·ln
Decoder/Driver
"
Page
No.
Application
8 Pin Glass Ceramic
15.2mm (.6") DIP
• Medical Equipment
• Industrial and Process Control
Equipment
• Computers
• Where Cera mic Package IC's
are required.
102
P.C. Board 10 Pin Edge
Card Connector
.396mm (.156")
Centers
General Purpose Market
• Test Equipment
• Medical Equipment
• Industrial Controls
107
Hermetically Sealed Integrated LED Displays
Device
.
x
Package
Description
6.8mm (.27") 5x7 Single Digit
Numeric, lHDP, Built·ln
Decoder/Driver
6.8mm (.27") Plus/Minus
5082·7011
Sign
7.4mm (.29") 4x7 Single Digit
5082·7391 Numeric, RHDP, Built·ln
Decoder/Driver/Memory
7.4mm(.29") 4x7 Single Digit
5082·7392 Numeric, LHDP, Built-In
Decoder/D river/Me mory
7.4mm(.29") 4x7 Single Digit
5082-7395 Hexadecimal, Built·1 n
Decoder/Driver/Memory
7.4mm(.29") Overrange
5082·7393 Character Plus/Minus Sign
5082·7010
·W
i.
. :1':
Application
8 Pin Hermetic
2.54mm (.100") Pin
Centers
• Ground, Airborne,
Shipboard Equipment
• Fire Control Systems
• Space Flight Systems
8 Pin Hermetic
15.2mm (.6") DIP
with Gold Plated Leads
• Ground, Airborne,
Shipboard Equipment
• Fire Control Systems
• Space Flight Systems
• Other High Reliability
Applications
(TX Programs available,
see page 115)
Page
No.
109
115
Alphanumeric LED Displays
Device
44
'i~\4
Description
Application
Package
3.8mm (.15") 5x7 Four Char·
HDSP·2000 acter Alphanumeric Built·ln
Shift Register, Drivers
12 Pin Ceramic 7.62mm
(.3") DIP. Redglass
Contrast Filter
•
•
•
•
•
7.4mm (.29") 5x7 Three Digit
5082·7100 Alphanumeric
7.4mm (.29") 5x7 Four Digit
5082·7101 Alphanumeric
7.4mm (.29") 5x7 Five Digit
5082·7102 Alphanumeric
22,Pin Hermetic
15.2mm (.6") DIP
28 Pin Hermetic
15.2mm (.6") DIP
36 Pin Hermetic
15.2mm (.6") DIP
General Purpose Market
• Business Machines
• Calculators
• Solid State CRT
• High Reliability Applications
For further information ask for
Application Note 931 on
Alphanumeric Displays
'lill
1
Programmable Calculators
Computer Terminals
Business Machines
Medical Instruments
Portable, Hand·held or
mobile data entry, read·
out or communications
For further information ask for
Application Note 966 and
Application Bulletin 51
Page
No.
121
125
53
----
.. --~
---
.0. _ _ _ _ _- " _.. - . - - _ ..
------
',r
'---=-"-""""""---""'''--'-'
5082- 9 Seg_ 80 mil Character Height Monolithic
7833 LED Chip in Scribed Wafer Form
Wafer Mounted
on Vinyl Film
5082- 9 Seg. 80 mil Character Height Monolithic
7843 LED Chip
Waffle Pack
5082- 7 Seg. 88 mil Character Height Monolithic
7837 LED Chip in Scribed Wafer Form
5082- 7 Seg. 88 mil Character Height Monolithic
7847 LED Chip
Wafer Mounted
on Vinyl Film
Waffle Pack
5082- 2 Seg. "0 NE" 88 mil Character Height
7838 Monolithic LED Chip in Scribed Wafer
Form
5082- 2 Seg. "0 NE" 88 mil Character Height
7848 Monolithic LED Chip
Wafer Mounted
on Vinyl Film
7 Seg. 100 mil Character Height Monolithic
LED Chip in Scribed Wafer Form
mil Character Height Monolithic
mil Character Height Monolithic
in Scribed Wafer Form
5082- 2 Seg. 100 mil Character Height Monolithic
7863 LED Chip
54
133
2.24 x 1.62mm
(88 x 64mm)
5°
2.5 x 1.6mm
(98 x 63mill
2.36 x 0.64mm
(93 x 25mill
Waffle Pack
129
Wafer Mounted
On Vinyl Film
Waffle Pack
5°
2.27x1.91mm
/107x75mill
Wafer Mounted
On Vinyl Film
Waffle Pack
5°
2.72x1.91mm
(107x75mil)
5°
2.72xO.89mm
(107x35mil)
Device
o
Shipping
Carrier
Tilt
Angle
Chip
Size
5082- 7 Seg. 120 mil Character Height Monolithic
7871 LED Chip in Scribed Wafer Form
Wafer Mounted
On Vinyl Film
5°
5082- 7 Seg. 120 mil Character Height Monolithic
7881 LED Chip
Waffle Pack
3.25x2.34mm
1128x92mil)
5082- 9 Seg. 120 mil Character Height Monolithic
7872 LED Chip in Scribed Wafer Form
Wafer Mounted
on Vinyl Film
5°
5082- 9 Seg. 120 mil Character Height Monolithic
7882 LED Chip
Waffle Pack
3.25 x 2_34mm
(128 x 92mill
5082- Dash Colon Monolithic LED Chip in
7856 Scribed Wafer Form
5082- Dash Colon Monolithic LED Chip
7866
Wafer Mounted
on Vinyl Film
Waffle Pack
0.18xO.18mm
(7 x 7mil)
5082- 11 mil Discrete LED
7892
Waffle Pack
5082- 11 milD iscrete LED
7893
Glass Vial
Description
~
L/
55
Page
No.
129
133
129
0.38xO.38mm
(t5xl5mil)
.3 INCH SEVEN SEGMENT DISPLAYS
HIGH EFFICIENCY RED · 5082·:1610 SERIES
"c·YEtLOW· 5082n620
GREEN ·
SERIES
5082-7630 SERIES
TECHNICAL DATA APRIL 1977
Features
• COMPACT SIZE
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
Green
• LOW CURRENT OPERATION
As Low as 3mA per Segment
Designed for Multiplex Operation
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Body Color Improves "Off" Segment
Contrast
• EASY MOUNTING ON PC BOARD OR
SOCKETS
Industry Standard 7.62mm (.3 in.) DIP
Leads on 2.S4mm (.1 In.) Centers
• CATEGORIZED FOR LUMINOUS
INTENSITY
Use of Like Categories Yields a Uniform
Display
• IC COMPATIBLE
Description
The 5082-7610, -7620, and -7630 series are 7.62mm (.3 in.) High
Efficiency Red, Yellow, and Green seven segment displays.
These displays are designed for use in instruments, point of sale
terminals, clocks, and appliances.
The -7610, and -7620 series devices utilize high efficiency LED
chips which are made from GaAsP on a transparent GaP
substrate.
• MECHANICALLY RUGGED
The -7630 series devices utilize chips made from GaP on a
transparent GaP substrate.
Devices
Part No. 5082- .
.. Description
Color
Package
Drawing
~7610
High Efficiency Red
Common Anode Left Hand Decimal
A
-7611
High Efficiency Red
~7613
High Efficiency Red
Common Anode Right Hand Decimal
Common Cathode Right Hand Decima!
C
~7616
High Efficiency Red
Yellow'·'
·-7620
.'
.
Universal Overflow ±1' Right Hand Decimal
Common Anode Left Hand Decimal
-7621
Yellow:
-7623
'Yellow)
·7626
Yellow'
Universal Overflow ±1 Right Hand Decimal
Green
Green········
Common Anode Left Hand Decimal
.."
"7630
I.··········
~7633
t<;;~·
~7~6
..... ·-7631
c'.
..
,
Green ..• ·
,;,.",'
Greeft :,~i-::
Common Anode Right Hand Decimal
Common'Cathode Right Hand Decimal
.
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
;
.'
Universal OverflOW ±1 Right Hand Decimal
NOTE: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagram D.
56
B
0
A
B
C
D
A
8
C
0
.",.;.....---~
package Dimensions
FUNCTION
___[5.18
(.2041
A
10'
PIN
10"
L.H.D.P.
Note 7
1 ""
14
~ :ft11~a.b
4;n
.n,,'+
~~
_____.5,.U,
II
11
10
I!+
1
2
3
4
19.05 ± 0.25
(.750, .0101
7.62
(,3001
5
6
d' ---~k=---R-.HL.D.P.
5.72 (.2251
7
3
Note 7
9
10
3.94 (.1551 ++~+~I- 3.94 (.1551
5.08
(.2001
C is determined by the formula:
IVTA
= IV250C elK (TA' 25°C)].
Device
-7610 series
-7620 series
-7630 series
58
K
--
-.0131I"C
-.0112I"C
-.0104/°C
operational Considerations
These displays may be operated in the strobed mode at
currents up to 60mA peak. When operating at peak
currents above SmA for red and yellow or 1OmA for green,
there will be an improvement in the relative efficiency of
the display (see Figure 3). Light output at higher currents
can be calculated using the following relationship:
ELECTRICAL
The S082-7600 series of display products are arrays of
eight light emitting diodes which are optically magnified
to form seven individual segments plus a decimal point.
The diodes in these displays utilize a Gallium Arsenide
Phosphide junction on a Gallium Phosphide substrate to
produce high efficiency red and yellow emission spectra
and a Gallium Phosphide jUf\ction for the green. In the
case of the red displays, efficiency is improved by at least
a factor of 4 over the standard Gallium Arsenide
Phosphide based technology. The use of Gallium
Phosphide as the substrate does result in an internal
dynamic resistance in the range of 12-480. It is this
resistance which causes the substantially higher forward
voltage specifications in the new devices.
~ IAVG
IVTIME AVG = - - -] ['7IPEAK
I AVG SPEC '71 PEAK SPEC
+ Rs
Relative efficiency at operating peak current.
'7IPEAK
Relative efficiency at data sheet peak
current where luminous intensity Iv SPEC
is specified.
= Data sheet luminous intensity, specified at
I AVG SPEC and IPEAK SPEC-
'7IPEAK SPEC
Iv SPEC
(Ip - SmA)
Example: Ip = 40mA and IAVG = 10mA:
VSmA
Rs
-7610 Series
1.6SV
210
-7620 Series
1.7SV
2S0
-7630 Series
]
Operating point average current
where VSmA and Rs are found in the following table:
Device
Iv SPEC
Average current for data sheet luminous intensity value, Iv SPEC
The user should be careful to scale the appropriate
forward voltage from the VFversus IF curve, Figure 4, when
designing for a particular forward current. Another way to
obtain Vp would be to use the following formula:
Vp = VSmA
J[
1.8SV
Iv TIME AVG = ( 10mA)
SmA (1.S8)
-1- (300!,d) = 948!,cd/seg.
CONTRAST ENHANCEMENT
The S082-7600 series devices have been optimized for use
in actual display systems. In orderto maximum "ON-OFF"
contrast, the bodies of the displays have been painted to
match the appearance of an unilluminated segment. The
emission wavelength of the red displays has been shifted
from the standard GaAsP - 6SSnm to 63Snm in order to
provide an easier to read device.
190
Figure 1 relates refresh rate, f, and pulse duration, tp, to a
ratio which defines the maximum desirable operating
peak current as a function of derated dc current,
Ip MAX/loc MAX. To most effectively utilize Figure 1, perform the following steps:
All of the colored display products should be used in
conjunction with contrast enhancing filters. Some
suggested contrast filters: for red displays, Panelgraphic
Scarlet Red 65 or Homalite 1670; for yellow displays,
Panelgraphic Yellow 27 or Homalite (100-1720,100-1726);
for green, Panelgraphic Green 48 or Homalite (100-1440,
100-1425). Another excellent contrast enhancement
material for all colors is the 3M light control film.
1. Determine desired duty factor.
Example: Four digit display, duty factor = 1/4
2. Determine desired refresh rate, f. Use duty factor to
calculate pulse duration, tp.
Note: ftp = Duty Factor
Example: f=1 kHz; tp=2S0 !,sec
3. Enter Figure 1 atthe calculated tp. Move vertically to the
refresh rate line and then record the corresponding
value of Ip MAX/loc MAX.
Example: At tp=2S0 !,sec and f=1 kHz,
Ip MAX/loc MAX=2.S
4. From Figure 2, determine the vaiue for loc MAX.
Note: loc MAX is derated above T A=SO"C
Example: At TA=70oG, loc MAX=12mA
S. Calculate Ip MAX from Ip MAX/loc MAX ratio and
calculate IAVG from Ip and duty factor.
Example: Ip = (2.S) (12mA) = 30m A peak
IAVG=(1/4) (30m A) = 7.SmA average.
MECHANICAL
The S082-7600 series devices are constructed utilizing a
lead frame in a standard DIP package. The individual
packages may be close-packed on 10.16mm (.4 in.)
centers on a PC board. Also, the larger character height
allows other character spacing options when desired. The
leadframe has an integral seating plane which will hold the
package approximately 1.S2mm (.060 in.) above the PC
board during standard soldering and flux removal
operation. To optimize device performance, new materials
are used that are limited to certain solvent materials for
flux removal. It is recommended that only mixtures of
Freon and alcohol be used for post solder vapor cleaning
processes, with an immersion time in the vapors up to two
minutes maximum. Suggested products are Freon TF,
Freon TE, Genesolv DI-1S and Genesolv DE-1S. Isoproponal, Ethanol or water may also be used for cleaning
operations.
The above calculations determine the maximum
tolerable strobing conditions. Operation at a reduced
peak current or duty factor is suggested to help insure
even more reliable operation.
Refresh rates of 1kHz or faster provide the most efficient
operation resulting in the maximum possible time average
luminous intensity.
59
20
I
,
!
15
1
"
t>
•~~a=m~mmm=Es:tm1l---:·~·
~
!
Ie,
10
~:c'
I
!
8
OPERATION IN
"-
7
\.
\.
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
I\.
'DC MAX
tp - PULSE DURATION - ,uSEe
Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration.
I,.
20
! ,,'
"
",
E
18
f-
16
iiia:
,<~
"
":;
<.>
<.>
~. ,'Y;,
!\,'>
'\
I
f>
b
i' ~"G'.. ~~o"';' :'"
12
"
10
"x:;
f\
'.'11'
14
a:
;1.;
x
<
~
u
.P
"';~ [i', ,',
00
~
:--
s:E
37
~
26
'\
~~
V
r\
1,,""
1,8
43
31
~..>.,.
~~
,::j) ((\ r'
:,: if;;: I,;'"
,etc I»
",
:;
50
20
1
11
1]
,
1,6
~
>
1,5
iii
1.4
:;
:;
~w
<.>
""
"X
(;
>
;::
"",
x
:3w
a:
<
~
u
"
r' ,
cc
60&,7610 SERIES
V L
1,2
I
1, 1
,.
1,0
I/L
,. fI'
°0
TA - AMBIENT TEMPERATURE _
-. ~
,I"
"
1.3
-~
Ie-
I
1
,7
!
I
V"
:I.~
"-
~Q
"
n-::J::±~082;762tl
s~ ",'-05082-7630 SERIES I
_I
' / f"qL
-
I
5
10 15 20 25 30 35 40 45 50 55 60 65
IpEAK - PEAK SEGMENT CURRENT - rnA
Figure 3. Relative Luminous Efficiency (luminous
Intensity per Unit Current) vs. Peak Segment
Current.
Fig."re 2. Maximum Allowable DC Current and DC
Power Dissipation Per Segment as a Function
of Ambient Temperature.
",
E
~
a:
a:
""
a:
"
~
~
,
OS
1.0
lA 1.61.82.02.22.42.62.83.03.2
VF - FORWARD VOLTAGE - V
Figur.4. Forward Current vs. Forward Voltage
Characteristic.
Figure 5. Normalized Angular Distribution of luminous
Intensity.
60
.43.INCHsevE:NSEGMENT)DISPLAYS
HIOHeFFlCIENCY Re[)·5082~1650 SERIES
HEWLETT
. '. ·veLLOW·~~a2.'660 SemES
'OREEN~;()5082,;1610SERfES
COMPONENTS
TECHNICAL DATA
APRIL 1977
Features
• LARGE DIGIT
Viewing up to 6 meters (19.7 feet)
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
Green
• LOW CURRENT OPERATION
As Low as 3mA per Segment
Designed for Multiplex Operation
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Body Color Improves "Off" Segment
Contrast
• EASY MOUNTING ON PC BOARD OR
SOCKETS
Industry Standard 7.62mm (.3") DIP
Leads on 2.S4mm (.1") Centers
Description
• CATEGORIZED FOR LUMINOUS
INTENSITY
Assures Uniformity of Light Output from
Unit to Unit within a Single Category
• IC COMPATIBLE
The 5082-7650, -7660, and -7670 series are large 10.92mm (.43
in.) Red, Yellow. and Green seven segment displays. These
displays are designed for use in instruments, point of sale
terminals, clocks, and appliances.
The -7650 and -7660 series devices utilize high efficiency LED
chips which are made from GaAsP on a transparent GaP
substrate.
The -7670 series devices utilize chips made from GaP on a
transparent GaP substrate.
• MECHANICALLY RUGGED
Devices
Part No. 5082-
COlor·
-7650
High Efficiency Red
.7651
High Efficiency
-7653
.....
Description
Rei:!
.
Common Anode Left Hand Decimal
.•. • ,Common Anode Right Hand,Decimal
Package Drawing
A
B
High Efficiency Red
Common Cathode Right Hand' Decimal
-7656
High Efficiency Red
Universal Overflow ±1 Right Hand, Decimal
0
-7660
Yellow
Common Anode Left Hand Decimal
A
-7661
Yellow
Comon AnOde Right Hand Decimal
B
-7663
Yellow
Common Cathode Right Hand Decimal
C
C
Univer.saJ Overflow ±1 Right Hand Decimal
0
Common .Anode Left Hand Decimal
A
.' Common Anode Right Hand Decimal
B
·7666
Yellow
-7670
Green
-7671
Green
-7673
Green
Common Cathode Right Hand Decimal
C
-7676
Green
Universal OverflOW,1:1 Right Hand Decimal
0
"
'.
Note: Universal pinout brings the anode and cathode of each segment's LED out to separate pins, see internal diagram D.
61
,
Package Dimensions
'0'
-I:
'0'
c=b&
'='-~ ~JtD'~::
+
7
~
d1
6.35 (.250)
....,._+... 8
-t;t-::'-3.-'.-'I-.125)
1-_ _
;--T-
No," 4J
NOTE [4]
R.H.D.P.
------------ _____
A
R.H.D.P.
\
5.21 (.205)
o
B,C
FRONT VIEW
FUNCTION
LUMINOUS
1_12~A~OO'
_I
_1_~:'+2501
4.06 (.160)
MIN.
~I
6~~~~~~~\
PIN
,
-1
2
r
15.24
l.75°r'o,/
---111- 0.25 (.0'01
7.62 (.3001-i---
IT
19.05 ± 0.25
-I
/
2.54 (.100)
DATA CODE
3
4
5
6
7
8
•
10
11
END VIEW
'2
SIDE VIEW
13
NOTES:
1. Dimensions in millimeters and (inches).
14
A
$
C
-1650/·76601
.76511·76611
·76fi3/·76631
·7870
·76n
CATHODe·a
CATHODE-s
CATHODE·!
ANODe!'l
NO PIN
NO PIN
CATHDDE·dp
CATHODE·e
CATHODE""
NOCONN.fSI
CAT-HOOE·(:
CATHODE"
NO PIN
CATHODE·b
ANODE I')
CATHOOE·!
ANOOEr,l
NO PIN
NO PIN
NOCONN.(5)
CATHODE...
CATHODE-d
CATHOOE-dp
CATHODE·o
CATHOOE·g
NO PIN
CATHODE·b
ANODe I"
·787.
ANODE-:a-ANODE-f
CATHOOEt6J
NO PIN
NO PIN
0
.7656/-16561
·7676
CATIiiTh"E-d
ANODE ..
ANODE-d
ANODE"
NO PIN
CATHODE ..
CATHOOE-e
ANODE·e
ANODe..
ANOOE-dp
ANOOE-dp
CATHOOE-dp-
ANOOE-c
ANODE·g
NO PIN
ANOOE-b
CATHODEI.\
CATHODE-·b
CATHOOE-a
NO PIN
NOCONNJ51
ANOOE'i
ANODE-b
2. All untoleranced dimensions are for
reference only,
3. Redundant anodes.
4. Unused dp position.
5. See Internal Circuit Diagram.
6. Redundant cathode.
Internal Circuit Diagram
A
B
C
Absolute Maximum Ratings
DC Power Dissipation Per Segment or D.P.(l) (T A=2S0C)
... SOmW
Operating Temperature Range ................................. -20°C to +8SoC
Storage Temperature Range ................................... -20°C to +8SoC
Peak Forward Current Per Segment or D.P(3)(T A=2So C) .................... 60mA
DC Forward Current Per Segment or D.P.(),2) (TA=2S0C) ...................... 20mA
Reverse Voltage Per Segment or D.P ........................................ 6.0V
Lead Soldering Temperature ................................... 230°C for 3 Sec
[1.S9mm (1/16 inch) below seating plane(4)]
62
o
Notes: 1. See power derating
curve (Fig.2). 2. Derate average
current from 50" C at O.4mA/o C per
segment. 3. See Maximum Tolerable Segment Peak Current vs.
Pulse Duration curve, (Fig. 1). 4.
Clean only in water, isopropanol,
ethanol, Freon TF or TE (or
equivalent) and Genesolv DI·150r
DE·15 (or equivalent).
----
~"--
-
.....
Electrical/optical Characteristics at TA=25°C
HIGH EFFICIENCY RED 5082-76501-7651/-7653/-7656
Parameter :-:f'
Symbol' T- CondItion
'I,
(Digit Average)
Peak Wavelength
Dominant Wavelength(6)
,APl'!Ak
N
VI'
~:,Forward Voltage/Segment or D,P:'
':
~:~3I~~
~~'
-,.' .,,1.,
~NU
.
,"
,
"
IR '
i?lL :r~perature Coefficient~ VF/S~nt
or D.P.
' Max.
,
.
#ted
"970
#Cd
635
nm
nm
626
,1.7
2.0
'.,"'smA
,'tj,""'2OmA, '
Ip"'6OmA
VR=6V
UnIts
#Cd
-,
.,u',
,,~
'"
Typ.
135i§
1/::,"', "
,
Reverse Current/Segment or D,P.
Response Time!7}
Min.
'SmA D.C.,
2OmAD.C.
'6OmA Pk~ 10f 6
DutY FactOr, '
Luminous Intensity/SegmentlS,S)
2.5
V
2.8
tr.t
10
90
tNprC
-2.0
#A
ns
mVrC
YELLOW 5082-76601-7661/-7663/-7666
H
f}r'f JH
Parameter
Luminous Intensity/Segment{S,8)
"
Symbol
I,
(Digit Average)
Peak Wavelength
Dominant Wavelength (6)
Forward Voltage/Segment or D.P.
T_ Condition
Min.
5mAD.C.
20mAD.C.
60mA Pk: 10f 6
Duty Factor
100
Typ.
250
1500
Max.
Un~;;
pcd
pcd
925
/Lcd
APl'!A1(
583
A.
VF
585
nm
nm
IR
Reverse Current/Segment or D.P.
Response Time(7)
t" t,
Temperature Coefficient of VF/Segment or D.P.,
VFI"C
1.8
IF =5mA
IF - 20mA
2.2
h ';60mA'
3.1
2.5
VR=6V
V
/LA
ns
mVrC
90
-2.0
r' \
GREEN 5082-7670/-7671/-7673/-7676
,.",
",',\'
Parameter
f'J
Symbol
Luminous Intensity/Segment (5.8)
I,
Reverse Current/Segment or Q.P.
Response Time (1)
Temperature Coefficient of VFfSegment or D.P.
10mA D.C.
20mAD.C.
60mA Pk: 1 of 6
Duty Factor
Mirt.
125
Typ.
250
" Max.
Units
ped
640
/.led
450
J.(cd
APEAK
565
Ad
572
1.9
' 2.2
2.9
nm
om
(Digit Average)
Peak Wavelength
Dominant Wavelength(6)
Forward Voltage/Segment or D.P.
T_CondiUon
V.
h'
t" tf
::'VFI"C
IF = 10mA
IF =20mA
IF-6OmA,
VR=6V
10
90
'-2.0
2.5
V
/LA
os
mVrC
NOTES:
5. The digits are categorized for luminous intensity with the intensity category deSignated by a letter located on the right hand side ofthe package.
6. The dominant wavelength, Ad, is derived from the C.I.E. Chromaticity Diagram and is that single wavelength which deli
1.5
ffi
1.4
~
1. 3
w
1.2
S
1. 1
§
15
"''X""
"'"I
>
;::w
II:
""
~
..
~
,
I
1.0
.8
..0
".
10
20
30
40
50
60
70
80
B59~
00
TA - AMBIENT TEMPERATURE _ °C
"
5OS2-7ll5O SERIES ....-
I
15II:
""
_.~SeRIES'
5OS2-7~kRlES'/
40 -
.
II:
c
30
;=
II:
f2
20
10
o
J.
1
.'
II
I
f
5 10 15 20 25 30 35 40 45 50 56 60 65
Figure 3. Relative Luminous Efficiency (Luminous
Intensity per Unit Current) vs. Peak Segment
Current.
~rt~
~~
/1
I
-~
I
'"
/~
II:
"
1iok'.$£RIES
j~
50
E
I-
I--- ".
~
I PEAK - PEAK SEGMENT CURRENT - rnA
Figure 2. Maximum Allowable DC Current and DC
Power Dissipation Per Segment as a Function
of Ambient Temperature.
60
~'"':""
L
7
0
.
..... ~ :.A'"'l
o
0.5
1.0
~~'
1.41.61.82.02.22.42.62.83.03.2
VF -FORWARDVOLTAGE-V
Figure 4. Forward Current vs. Forward Voltage
Characteristic.
Figure 5. Norrnelized Angular Distribution of Luminous
Intensity.
64
';a
Operational Considerations
These displays may be operated in the strobed mode at
currents up to 60mA peak. When operating at peak
currents above 5mA for red and yellow or 10mA for green,
there will be an improvement in the relative efficiency of
the display (see Figure 3). Light output at higher currents
can be calculated using the following relationship:
ELECTRICAL
The 5082-7600 series of display products are arrays of
eight light emitting diodes which are optically magnified
to form seven individual segments plus a decimal point.
The diodes in these displays utilize a Gallium Arsenide
Phosphide junction on a Gallium Phosphide substrate to
produce high efficiency red and yellow emission spectra
and a Gallium Phosphide junction for the green. In the
case of the red displays, efficiency is improved by at least
a factor of 4 over the standard Gallium Arsenide
Phosphide based technology. The use of Gallium
Phosphide as the substrate does result in an internal
dynamic resistance in the range of 12-480. It is this
resistance which causes the substantially higher forward
voltage specifications in the new devices.
~ IAVG
Iv TIME AVG = - - -][7JIPEAK
IAVG SPEC 7JI PEAK SPEC
IAVG
+ Rs
Relative efficiency at operating peak current.
Relative efficiency at data sheet peak
current where luminous intensity Iv SPEC
is specified.
= Data sheet luminous intensity, specified at
I AVG SPEC and I PEAK SPEC·
7JIPEAK SPEC
Iv SPEC
(Ip - 5mA)
Example: Ip = 40mA and IAVG = 10mA:
Device
-7650 Series
V SmA
1.65V
Rs
210
-7660 Series
1.75V
250
1.85V
Iv TIME AVG = ( 10mA)
5mA (1.58)
\-1- (300JLd) = 948JLcd/seg.
CONTRAST ENHANCEMENT
The 5082-7600 series devices have been optimized for use
in actual display systems. In orderto maximum "ON-OFF"
contrast, the bodies of the displays have been painted to
match the appearance of an unilluminated segment. The
emission wavelength of the red displays has been shifted
from the standard GaAsP - 655nm to 635nm in order to
provide an easier to read device.
190
Figure 1 relates refresh rate, f, and pulse duration, tp, to a
ratio which defines the maximum desirable operating
peak current as a function of derated dc current,
Ip MAX/loc MAX. To most effectively utilize Figure 1, perform the following steps:
All of the colored display products should be used in
conjunction with contrast enhancing filters. Some
suggested contrast filters: for red displays, Panelgraphic
Scarlet Red 65 or Homalite 1670; for yellow displays,
Panelgraphic Amber 23 or Homalite (100-1720, 100-1726);
for green, Panelgraphic Green 48 or Homalite (100-1440,
100-1425). Another excellent contrast enhancement
material for all colors is the 3M light control film.
1. Determine desired duty factor.
Example: Four digit display, duty factor = 1/4
L/
]
Operating point average current
7JIPEAK
where VSmA and Rs are found in the following table:
-7670 Series
Iv SPEC
IAVG SPEC= Average current for data sheet luminous intensity value, Iv SPEC
The user should be careful to scale the appropriate
forward voltage from the VFversus IF curve, Figure 4, when
designing for a particular forward current. Another way to
obtain Vp would be \0 use the following formula:
Vp = VSmA
J'[
2. Determine desired refresh rate, f. Use duty factor to
calculate pulse duration, tp.
Note: ftp = Duty Factor
Example: f=1 kHz; tp=250 JLsec
3. Enter Figure 1 at the calculated tp. Move vertically to the
refresh rate line and then record the corresponding
value of Ip MAX/loc MAX·
Example: At tp=250 JLsec and f=1 kHz,
Ip MAX/loc MAX=2.5
4. From Figure 2, determine the value for loc MAX.
Note: loc MAX is derated above T A=50°C
Example: At T A=70° C, loc MAX=12mA
5. Calculate Ip MAX from Ip MAX/loc MAX ratio and
calculate IAVG from Ip and duty factor.
Example: Ip = (2.5) (12mA) = 30mA peak
IAVG=(1/4) (30mA)'= 7.5mA average.
MECHANICAL
The 5082-7600 series devices are constructed utilizing a
lead frame in a standard DIP package. The individual
packages may be close-packed on 12. 7mm (.5 in.) centers
on a PC board. Also, the larger character height allows
other character spacing options when desired. The
leadframe has an integral seating plane which will hold the
package approximately 1.52mm (.060 in.) above the PC
board during standard soldering and flux removal
operation. To optimize device performance, new materials
are used that are limited to certain solvent materials for
flux removal. It is recommended that only mixtures of
Freon and alcohol be used for post solder vapor cleaning
processes, with an immersion time'in the vapors up to two
minutes maximum. Suggested products are Freon TF,
Freon TE, Genesolv DI-15 and Genesolv DE-15. Isoproponal, Ethanol or water may also be used for cleaning
operations.
The above calculations determine the maximum
tolerable strobing conditions. Operation at a reduced
peak current or duty factor is suggested to help insure
even more reliable operation.
Refresh rates of 1kHz or faster provide the most efficient
operation resulting in the maximum possible time average
luminous intensity.
65
HEWLETT
ii
0.3 INCH RED
SERIES
SEVEN SEGMENT 5082-1130
5082-1140
PACKARD
DISPLAY
COMPONENTS
TECHNICAL DATA APRIL 1977
Features
• 5082-7730
Common Anode
Left Hand D.P.
• 5082-7731
Common Anode
Right Hand D.P.
• 5082-7736
Polarity and Overflow Indicator
Universal Pinout
Right Hand D.P.
• 5082-7740
Common Cathode
Right Hand D.P.
Description
The H P 5082-7730/7740 series devices are common anode
LED displays. The series includes a left hand and a right
hand decimal point numeric display as well as a polarity
and overflow indicator. The large 7.62 mm (0.3 in.) high
character size generates a bright, continuously uniform
seven segment display. Designed for viewing distances of
up to 3 meters (9.9 feet), these single digit displays provide
a high contrast ratio and a wide viewing angle.
• EXCELLENT CHARACTER APPEARANCE
Continuous Unif.orm Segments
Wide Viewing Angle
High Contrast
• IC COMPATIBLE
1.6V dc per Segment
• STANDARD 0.3" DIP LEAD CONFIGURATION
PC Board or Standard Socket Mountable
The 5082-7730 series devices utilize a standard 7.62 mm
(0.3 in.) dual-in-line package configuration that permits
mounting on PC boards or in standard IC sockets.
Requiring a low forward voltage, these displays are
inherently IC compatible, allowing for easy integration
into electronic instrumentation, point of sale terminals,
TVs, radios, and digital clocks.
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from
Unit to Unit withing a Single Category
Devices
Part No.
5082-
Description
Package Drawing
7730
Common Anode Left Hand Decimal
A
7731
Common Anode Right Hand Oecimal
B
7736
Universal Overflow ±1 Right Hand Decimal
C
7740
Common Cathode Right Hand Decimal
D
Note: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagram C.
66
Package Dimensions
PIN
1
2,
3,
4
S
e
7
e
9
10
11
I~
1~
14
A,B,O
A
·7130
CATHODE.. :
: CATHOI>E.f
A_E!~
NoP!N
NOP!N
CATHOJ)E-dp
.CATHOOE..
CATHOOE-d
NOCONWi.
CATHODE""
CATHOOe-t
NO PIN
CATHoDe.,
ANODE!'l
FUNCTION
B
C
,7131
.7~40
·7136
CAT_E[G!
ANOOe·f
ANOOElI
ANODE••
At/ooE-d
CATHODEr.t,
ANl)PE-dp
ANODE,.
ANODH
ANOOE..
CATHOOE..
ANOOE-d
',NOPIN
CATHOOE4
ANooE!3J
CATHOOE-d
NO PIN
CATHOOE·.
NO PIN
CATH\;lDE...
NOCONN.IliJ
il.NooE,.
CATHOpe...
ANOm ..
ANooE-dp
CATHODE-
~
~
~
10
."' .. L
~
<.>
0
I
ffi
w.
1~ r-~r-~r--1~~~~~-+--~--~
S
r--r-"-If:-'--1",",,4+4---+-+-~
~
120
III
~ 100r-~r-~r-~~~t--t~~---r-~
.
~
0:
0:
~r---r-"-Ir--1~~~-t~-+~+~~
a
ror---r-~r--1--~r--t---+--+~~
I
20
" , '"
~ ~!d
I
~
;
0
0
.. ..
-."
)
1.2
1.•
2.0
2.'
2 .•
3.2
VF - FORWARD VOLTAGE - V
Figure 4. Forward Current vs. Forward
Voltage.
Figure 5. Normalized Angular Distrubution of
Luminous Intensity.
69
HEWLETT
.43 INCH RED
-n50 SERIES
.SEVEN SEGMENT 5082
5082-nSO
DISPLAY
PACKARD
COMPONENTS
TECHNICAL DATA
,/
APRIL 1977
Features
• 5082-7750
Common Anode
Left Hand D.P.
• 5082-7751
Common Anode
Right Hand D.P.
• 5082-7756
Polarity and Overflow Indicator
Universal Pinout
Right Hand D.P.
• 5082-7760
Common Cathode
Right Hand D.P•.
• LARGE DIGIT
Viewing Up to 6 Meters (19.7 Feet)
Description
• EXCELLENT CHARACTER APPEARANCE
Continuous Uniform Segments
Wide Viewing Angle
High Contrast
The 5082-7750/7760 series are large 10.92mm (.43 in.)
GaAsP LED seven segment displays. Designed for
viewing distances up to 6 meters (19.7 feet), these single
digit displays provide a high contrast ratio and a wide
viewing angle.
• IC COMPATIBLE
• STANDARD 7.62mm (.3 in.) DIP
LEAD CONFIGURATION
PC Board or Standard Socket Mountable
These devices utilize a standard 7.62mm (.3 in.) dual-inline package configuration that permits mounting on PC
boards or in standard IC sockets. ~equiring a low forward
voltage, these displays are inherently IC compatible,
allowing for easy integration into electronic instrumentation, point of sale terminals, TVs, radios, and digital
clocks.
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from
Unit to Unit within a Single Category
Devices
Part No. 5082-
Deacriptlon
Package Drawing
-7750
Common Anode LeftHand Decimaj
A
-7751
Common Anode Right Hand Decimal .
B
-7756
Universal OVerflow ±1 Right Hand Decimal
C
-7760
Common Cathode Right Hand Decimal
D
Note: Universal pinout brings the anode and cathode of each segment·s LED out to saparate pins. See internal diagram C.
70
/
package Dimensions
-I !--10'
+
............
\
'---
8 '-.. R.H.D.P_
NOTE [41
c
B,O
A
FRONT VIEW
LUMINOUS
INTENSITY \
CATEGORY
_12.70 (.500)
MAX.
1
1
_1_~6'3{('250)
4.06 (.160)
1.52 ...l
,(.060)
I
--;-
-1
1
f
IT
15_24
19.05 ± 0.25
(.750 r010)
MIN.
~
1
-t
--111-0.25(.010)
7.62 (.300)--j.-----I
END VIEW
FI,lNCTfON
PIN
2.54 (.100)
DATA CODE
SIDE VIEW
2
3
A
·7750
CATHODE..
.(lATHODE·!
ANODE!.I
5
NOPIN
NQPIN
6
CATHODE·dp
7
8
CATHODE~
4
9
10
11
12
13
14
CATHODE·d
NOCONN.!51
CATHOOE-c
CATHOOEiI-
NO PIN
CATHODH
ANODEl3"1
B
·7751
CATHoDe ..
CATHOOE·I
ANO(>etal
NO PIN
NONN
NO CONN. lsi
CATHODE..
CATHOOE-d
CATHODE-dp
C
.7756
(>
·1760
CATHODE-d
ANODE-s
ANODE·d
ANOOE·!
CATHODE: {IS) h
NO PIN
NO PIN
NOCONN.!5i
NOPIN
CATHOOE-e
CATHODE·,
ANODE..
ANODE..
ANODE-dp
CATHODE·dp
CATHOOE'(l
CATHODE·b
CATHODE'9
NO PIN
CATHODE·b
ANODE!3I
CATHODE-a
NO PIN
ANOOE-.tI'
ANODE-d
ANOOE-dp
ANODE«;:
ANODE ..
NO PIN
ANOO£·a
ANOOE~b
ANODE·b
CATHODE 1.1
NOTES:
1. Dimensions in millimeters and (inches).
2. All untoleranced dimensions are for
reference only.
3. Redundant anodes.
4. Unused dp position.
5. See Internal Circuit Diagram.
6. Redundant cathodes.
Internal Circuit Diagram
A
c
B
Absolute Maximum Ratings
DC Power Dissipation Per Segment or D.PY) (T A=25° C)
42mW
Operating Temperature Range ................................. -20°C to +85°C
Storage Temperature Range ................................... -20"C to +85°C
Peak Forward Current Per Segment or D.pIJ)(T A=25°C) .................... 150mA
DC Forward Current Per Segmentor D.P.(J,2) (TA=25°C). . .
. ... 25mA
Reverse Voltage Per Segment or D.P. . ...................................... 6.0V
Lead Soldering Temperature
. . . ..... . . .... . . . . ... . . . . ... 230°C for 3 Sec
[1.59mm (1/16 inch) below seating plane I4 ']
71
o
Notes: 1. See power derating curve
(Fig.2). 2. Derate average current
from 50° C at O.43mA/o C per
segment. 3. See Maximum Tolerable Seg ment Peak Current vs.
Pulse Duration curve, (Fig. 1). 4.
Clean only in water, isopropanol,
ethanol, Freon TF or TE (or
equivalent) and Genesolv DI-150r
DE-15 (or equivalent).
Electrical/Optical Characteristics at TA =25°C
Description
Test CondHion
Symbol
Luminous,lntensity/Segment (2,4)
IpEAK= 100mA
12.5% Duty Cycle
Iv
(Digit Average)
IF = 20mA
Peak Wavelength
Min.
(2)
Max,
350
150
APEAK
Dominant Wavelength
Typ,
!tcd
400
655
Ad
Units
nm
645
nm
Forward Voltage, any Segment or D.P.
VF
IF= 20mA
1.6
Reverse Current, any Segment or D.P.
fR
VR = 6V
10
p.A
Rise and Fall Time
t"tf
10
ns
-2.0
mV/·C
(3]
Temperature Coefficient of Forward Voltage
t:NFloC
V
2.0
Notes:
1. The digits are categorized for luminous intensity with the intensity category designated by a letter located on the right hand side of the package.
2. The dominant wavelength. Ad. is derived from the CIE Chromaticity Diagram and is that single wavelength which defines the color of the device.
3. Time for a 10% - 90% change of light intensity for step change in current.
4. Temperature coefficient of luminous intensity Ivrc is determined by the formula: IVTA = I v25 • c e [1-.0188/ 0 C) IT, - 25°Cij
Operational Considerations
Refresh rates of 1kHz or faster provide the most efficient
operation reulting in the maximum possible time average
luminous intensity.
ELECTRICAL
The 5082-775017760 series display is composed of eight
light emitting diodes optically magnified to form seven
individual segments and decimal point.
This display may be
(see Figure 3). Light
may be calculated
following formula:
Iv = (Iv 20rnA) '7IPEAK
The diodes are made ,of GaAsP (Gallium Arsenide
Phosphide) junction on a GaAs substrate. Diode turn-on
voltage is approximately 1.55 volts and typical forward
diode resistance is 5 ohms. For strobing at peak currents a
user should take this forward resistance into account.
operated at various peak currents
output for a selected peak current
from the 20mA value using the
(
)
IF AVG
20m A
Where: Iv = Luminous Intensity at desired IAVG
Iv 20rnA = Luminous Intensity at IF = 20mA
I AVG = Average Forward Current per segment = (lpEAK x Duty Factor)
Typical forward voltage may be scaled from Figure 4 or
calculated from the following formula:
VF = 1.55V + (30 x fPEAK)
'7'IPEAK = Relative Efficiency Factor at Peak
Operating Forward Current from Figure 3.
Figure 1 relates refresh rate, f, and pulse duration, tp, to a
ratio which defines the maximum desirable operating
peak current as a function of derated dc current,
Ip MAX/I DC MAX. To most effectively utilize Figure 1, perform the following steps:
CONTRAST ENHANCEMENT
The 5082-7750/7760 series display may be effectively
filtered using one ofthe following filter products: Homalite
H 100-1605 or H 100-1804 Purple; Panelgraphic Ruby Red
60, Dark Red 63 or Purple 90; Plexiglas 2423; 3M Brand
Light Control Film for daylight viewing.
1. Determine desired duty factor.
Example: Four digit display, duty factor = 1/4.
2. Determine desired refresh rate, f. Use duty factor to
calculate pulse duration, tp. Note: ftp = Duty Factor
Example: f = 1kHz; tp = 250 !tsec.
3. Enter Figure 1 atthecalculatedtp. Move vertically to the
refresh rate line and then record the corresponding
value of Ip MAX/loc MAX.
Example: At tp = 250 p'sec anf f=1kHz,
Ip MAX/loc MAX = 2.7.
4. From Figure 2, determine the value for loc MAX.
Note: I DC MAX is derated above T A=50· C
Example: At TA=70·C, loc MAX = 16.4mA.
5. Calculate Ip MAX from Ip MAX/I DC MAX ratio and
calculate IAVG from Ip and duty factor.
Example: Ip=(2.7) (16.4mA) = 44.3mA peak
IAVG=(1/4) (44.3mA) = 11.1mA average.
MECHANICAL
The 5082-7750/7760 series devices are constructed
utilizing a lead frame in a standard DIP package. The
individual packages may be close-packed on 12.7mm (.5
in.) centers on a PC board. Also, the larger character
height allows other character spacing options when
desired. The lead frame has an integral seating plane
which will hold the package approximately 1.52mm (.060
in.) above the PC board during standard soldering and
flux removal operation. To optimize device performance,
new materials are used that are limited to certain solvent
materials for flux removal. It is recommended that only
mixtures of Freon and alcohol be used for post solder
vapor cleaning processes, with an immersion time in the
vapors up to two minutes maximum. Suggested products
are Freon TF, Freon TE, Genesolv DI-15 and Genesolv DE15. Isoproponal, Ethanol or water may also be used for
cleaning operations.
The above calculations determine the maximum
tolerable strobing conditions. Operation at a reduced
peak current or duty factor is suggested to help insure
even more reliable operation.
72
,,0
"w
~!(
,,0:
OPERATION IN
THIS REGION
REQUIRES
~~
... w
iW'
.'~,"
101.\;
y
"0:
0:"
TEMPERATURE
DERATING OF
~I-I-
~ffi~
'oCMAX.
" .. 0:
~~a
... :;
oz"
"00
:; ... 0
~
OW:;
i=~~
~?:E
l
1.5
2~ 2"
~ u
J.-"
1
1
tp -
PULSE DURATION - j.tSEC
Figure 1. Maximum Tolerable Peak Current vo. Pulse Duration.
"
E
...I
150:
0:
"
0
0
0
:;
:;
"X
:;
"
25
2'
42
40
'\
22
20
\.
18
I\Of>O
16
;:
33
I
0:
30
...-
~<:p'fI.'I/.~ I\~G\OI'
,. r- :::::-O:~I\""I\~
37
.
26
\.
23
\
12
\
10
19
16
13
I
x
"u2
o
o
20
30
40
50
"X
""x
I
""u
..
10
~
0
Cl
:;
:;
o?
•...
-"
E
60
70
TA - AMBIENT TEMPERATURE -
•• 8085900
"c
IpEAK - PEAK SEGMENT CURRENT - mA
Figure 2. Maximum Allowable DC Current and DC
Figure 3. Relative Efficiency ILuminous Intensity per Unit
Current) versus Peak Current por Segment.
Power Dissipation per Segment as a Function
of Ambient Temperature.
160
"E
...
:;
"~
--
'40
120
.... '00
0:
W
~
80
u
60
"
"
"
~
0:
40
~
...
.20
o
./
o
.4
.s
1.2
1.6
2.0
2.4
2.8
3.2
V F - FORWARD VOLTAGE - V
Figure 4.
Forward Current versus Forward
Figure 5. Normalized Angular Distrubution of
Luminous Intensity.
Voltage.
73
HEWLETT·
SOLID STATE
NUMERIC INDICATOR
(7 Segment Monolithic)
PACKARD
COMPONENTS
5082-1400
SERIES
TECHNICAL DATA
APRIL 1977
Features
• ULTRA LOW POWER
Excellent Readability at Only 500 tJA
Average per Segment
• CONSTRUCTED FOR STROBED OPERATION
Minimizes Lead Connections
• STANDARD DIP PACKAGE
End Stackable
Integral Red Contrast Filter
Rugged Construction
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from
Unit to Unit within a Single Category
• IC COMPATIBLE
Description
The HP 5082-7400 series are 2.79mm (.11"). seven
segment GaAsP numeric indicators packaged in 3,
4, and 5 digit end-stackable clusters. An integral
magnification technique increases the luminous intensity, thereby making ultra-low power consumption possible. Options include either the standard
lower right hand decimal point or a centered decimal point for increased legibility in multi-cluster
applications.
Applications include hand-held calculators, portable instruments, digital thermometers, or any other
product requiring low power, low cost, minimum
space, and long lifetime indicators.
Device Selection Guide
Configuration
Digits per
Cluster
3 (right)
3 (left)
4
5
Part Number
Center Decimal Point
Right Decimal Point
Device
I IBI81BI
IBIBI81 I
181BIBIBI
5082-7402
5082·7412
5082·7403
5082-7413
5082-7404
5082·7414
IBI81BI81BI
5082·7405
5082·7415
74
Absolute Maximum Ratings
Paral'l'Hlter
Symbol
Peak Forward Current per s.,gment (Duration' '('·1 msec)
IpEAK
IAVG
Po
Average eur~nt ~r.Sej!lllent ". .
PowerOissipation p.erDiglt 11l
Operating Temperature, Ambient
"':'~.
.
.
•
.
....
......
. ......
...
•••••
,.
..
.
Reverse Voltage
At 25°C; derate 1 mWfC above 25°C ambient.
.
. Max.·
Units
,no .
mA
mA
6.
' ......••..•. <"
..
...
80··,
mW"
-40
75
°e
;.,.40
....
100
be
5
V
...•..
.
'
TA
Ts
VR ....
Storage Temperature
NOTES: 1.
Min.
....
2. See Mechanical Section for recommended flux removal solvents.
Electrical/Optical Characteristics at TA =25°C
Parameter
Luminous IntenSity/Segment or dpl3Al
(Time Averaged)
Peak Wavelength
Symbol
Test Condition
Min.
Typ.
IV
IAVG'" lm A
(lPK =10mA
duty cycle =< 10%1
5
20.
Max.
Units
/-!Cd
nm
655.
APEAK
Forward Voltage/Segment or dp
VF
IF'" 10mA
Reverse Current/Segment ordp
Rise and Fall Time (51
IR
VR=5V
1..6
t" tf
2.0
V
100
JlA
ns
10
.'
NOTES: 3. The digits are categorized for luminous intensity. Intensity categories are designated by a letter located on the back side of
the package. 4. Operation at Peak Currents less than 5mA is not recommended. 5. Time for a 10%-90% change of light intensity for step change in current.
>-
80
"E
I
>in
~"'C .15
~ffi .10
60
Z
i~
".
3
0:
0:
:>
u 40
l/
I I
";:
"
0:
<{
.06
,,!:
~§
,04
///
OUT'\' CYCLE'.
20
1//
~~ .02
>-0:
I
.!:-
[/;7
~~
~w
,,~
U
00
.8
1.2
1.6
2.0
2.4
2.8
~
3.2
VF - FORWARD VOLTAGE - V
~
~~
>u
I
I
I
I
I
"-
1.6
ffi
1.4
~
w
1.2
:>
'"
1.0
"z
"::
.8
w
.6
~
.4
U
I
>
;::
""-
.........
0:
V
.
I
/
---
_ _ r-
.-
V~-
.2
).,
.4
-60
0.4
0.6 0.8 1.0
2.0
4.0
6.0
lavg. - AVERAGE CURRENT PER SEGMENT - rnA
1.8
__1
STORAGE AND
OPERATING
I--RANGE
~
1
Figure 2. Typical Time Averaged Luminous Intensity per Segment
(Digit Average) vs. Average Current per Segment.
Figure 1. Forward Current vs.
Forward Voltage.
50
.0
~ ~.
vW
~~
":;;
0:
~
/// 20%
~;i ,08
>W
r'
5%/
lOY; rf
~ E.
-40
-20
0
20
40
Tc - CASE TEMPERATURE -
60
20
80
°c
40
60
80
100
IpEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 4. Relative Luminous Efficiency vs.
Peak Current per Segment.
Figure 3. Relative Luminous Intensity vs. Case
Temperature at Fixed Current Level.
75
package Description
NOTES: 1. Dimensions in millimeters and (inches).
2. Tolerances on all dimensions are ±0.038mm (±.015 in.) unless otherwise noted.
I
6.35 ± 0.25
(.250 ± .010)
L ED .
---..i--.~~~~~
7.62 ± 0.025
(.300 ± .010)
•
I
S/~rHi
.' i
2.54
(.100)
REF.
II
,I
5"
0.25
(.010)--4 -
REF.-.I~
Figure 5. 5082-7402/·7403/-7404/
·7412/-7413/-7414
All Devices
Figure 6. 5082·7405n415
Magnified Character Font Description
:.1514 (.062!....
DIMENSIONS IN MILLIMETERS ANO fiNCHES).
-
f}.Ef'
OEVlces
l----:
5082-7402
50SZ-74Q3 .
5082-7404
5082-7405
.
...!.57~~~62I..
DIMENSIONS IN MILLIMnERS Ai.o lINCHES).
-
~.
DEVICES
) -_ _- :
5082·7412
5082·7413
5082·7414
5082·7415
2.1941.111
REF.
~.-tl
~imal POint Configu~lon.
2.794(.111
. ~~
. "~dP.
d
Figure 7. Center
S
Figure 8. Right Decimal Point
ConfigUration
.787 1.0311.
REF.
.5331.021)
REf.
Device Pin Description
PIN NO.
1
2
6082·7402n412
5082-1403/1413.
5082·7404/1414
Fl,J.NCTION
FUNCTION
FUNCTION
FUNCTION
SEE NOTE 1.
CATHODE 1
CATHODE 1
CATHODE 1
5082·7406n415
ANODEe
ANODEe
ANODEe
3
ANODE c
ANODE c
ANOD.Ec
4
CATHODE 3
CATHODE 3
CATHODE 3
CATHQDE3
5
.. ··ANODEdp
ANODE dp
ANODEdp
ANODEdp
SEE NOTE 1.
CATHODE 4
ANODEd
ANODEg
ANODEg
ANODEg
CATHODE 5
ANODE d
ANODEd
ANODEd
ANODEg
ANODEf
ANODE f
ANODEf
CATHODE 4
i
CATHODE 4 .
6
7
8
..
9
A/'IIODEe
,
ANODEc
C.O---
10
CATHODE 2
CATHODE; 2
CATHODE 2
ANODEf
11
. ANODE b
ANODE b
ANODEb
(See Note1l
12
ANODE a,
.. ' ANODEa
ANODE a
13
1'4
.
-
-
-
-
NOT E 1. Leave Pin unconnected
76
ANODEb
CATHODE 2
ANODE a
Electrical
( ~,
,
character with its own unique time frame.
A detailed discussion of display circuits and drive
techniques appears in Application Note 937.
Character encoding can be performed by commercially available BCD-7 segment decoder/driver
circuits. Through the use of a strobing technique,
only one decoder/driver is required for each display. In addition, the number of interconnection
lines between the display and the drive circuitry
is minimized to 8 + N, where N is the number of
characters in the display.
Each of the segments on the display is "addressable" on two sets of lines - the "character enable"
lines and the "segment enable" lines. Displays are
wired so that all of the cathodes of all segments
comprising one character are wired together to a
single character enable line. Similarly, the anodes
of each of like segments (e.g., all of the decimal
points, all of the center line anodes, etc.) are wired
to a single line. Therefore, a single digit in the cluster can be illuminated by connecting the appropriate
character enable line, with the appropriate segment
enable lines for the character being displayed. When
each character in the display is illuminated in
sequence, at a minimum of 100 times a second,
flicker free characters are formed.
The decimal point in the 7412, 7413, 7414, and
7415 displays is located at the lower right of the
digit for conventional driving schemes.
The 7402, 7403, 7404 and 7405 displays contain
a centrally located decimal point which is activated
in place of a digit. In long registers, this technique
of setting off the decimal point significantly improves the display's readability. With respect to
timing, the decimal point is treated as a separate
Mechanical
The 5082-7400 series package is a standard 12 or 14
Pin DIP consisting of a plastic encapsulated lead
frame with integral molded lenses. It is designed
for plugging into DIP sockets or soldering into PC
boards. The lead frame construction allows use of
standard 01 P insertion tools and techniques. Alignment problems are simplified due to the clustering
of digits in a single package. The shoulders of the
lead frame pins are intentionally raised above the
bottom of the package to allow tilt mounting of up
to 20° from the PC board.
To improve display contrast, the plastic incorporates
a red dye that absorbs strongly at all visible wavelengths except the 655 nm emitted by the LED. In
addition, the lead frames are selectively darkened
to reduce reflectance. An additional filter, such as
Plexiglass 2423, Panelgraphic60 or 63, and Homalite
100-1600, will further lower the ambient reflectance
and improve display contrast.
The devices can be soldered for up to 5 seconds at a
maximum solder temperature of 230 C( 1/16" below
the seating plane). The plastic encapsulant used in
these displays may be damaged by some solvents
commonly used for flux removal. It is recommended
that only Freon TE, Freon TE-35, Freon TF, Isopropanol, or soap and water be used for cleaning operations.
0
'R
MOS
"CALCULATOR
ON A CHIP"
- 4 1 B,6 9D53
Figure 9. Block Diagram for Calculator Display Using Lower Right Hand Decimal Point.
CHARACTER
SERIAL
DATA
SOURCE
Figure 10. Block Diagram for Display Using Center Decimal Point.
77
HEWLETT
II
SOLID STATE
NUMERIC INDICATOR
(7 segment Monolithic)
PACKARD
COMPONENTS
5082-1430
SERIES
TECHNICAL DATA APRIL 1977
Features
• MOS COMPATIBLE
Can be Driven Directly from many
MOS Circuits
• LOW POWER
Excellent Readability at Only 250 J1.A Average
per Segment
• CONSTRUCTED FOR STROBED OPERATION
Minimizes Lead Connections
• STANDARD DIP PACKAGE
End Stackable
Integral Red Contrast Filter
Rugged Construction
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from
Unit to Unit within a Single Category
Description
The HP 5082-7430 series displays are 2_79mm (.11
inch, seven segment GaAsP numeric indicators packaged in 2 or 3 digit end-stackable clusters on 200
mil centers_ An integral magnification technique increases the luminous intensity, thereby making ultra-low power consumption possible_ These clusters
have the standard lower right hand decimal points_
Applications include hand-held calculators, portable
instruments, digital thermometers, or any other
product requiring low power, low cost, minimum
space, and long lifetime indicators_
Device Selection Guide
Digits per
Cluster
Configuration
Part Number
Device
Package
2(right}
I lal81
(Figure 5)
5082·7432
3
lalal81
(Figure 5)
5082-7433
78
Absolute Maximum Ratings
Paramiitlw
Peak Forward Current per Segment or dp (Duration < 600,ts)
MaJ(,
50
Units
Ipl;AI<
IAVG
5
Po
80
rnA
mW
SymbOl
Average Current per Segment or dp .•
Power Disslll8tlon per Oigit [1]
Operating TernJ)erature, Ambient
MIn.
--:-40
TA
Ts"
~rage Temperature
:-40
VR
Solder Temperature 1/16" below seating- plane (t <3 sec.) [2}
NOTES: 1. Derate linearly @ 1 rrlJVfC above 25°C ambient.
mA
75.
100
5_
°c ,"c
230
°c
V
2. See Mechanical section for recommended flux removal solvents.
Electrical/Optical Characteristics at TA = 25°C
.
"ltaramater :~'Et
Luminous Int~ty/Segment or dp[3AJ
Symbol
Min.
Typ.
10
40
IAVG=~
(lPK"" SmA
IV
-, ;r,
0:::
Peak Wavelength
Test ConditIOn
Max•
Units
~
duty cycle" 10%)
~i },'F;.~
>-t>l;AK
Forward Voltage/Segment or dp
VF
IF"'5mA
Reverse Current/Segment or dp
Rise and Fall Time!5J
~
VR~5V
655
,
"
V
100
pA
10
t r• tf
nm
2.0
1.55
ns
NOTES: 3. The digits are r.ategorized for luminous intensity. Intensity categories are designated by a letter located on the back side of
the package. 4. Operation at Peak Currents less than 3.5mA is not recommended. 5. Time for a 10%-90% change of light intensity for step change in current.
,
DIITY CYCU! .5%
10'l0~
20$~
~1
[~
l/
I
/. ij /
h~
10
0.1
IfF - PEAK FORWARD VOLTAGE - V
Figure 1. Peak Forward Current vs.
Peak Forward Voltage
I
0.2 0.3
V
0.5
1.0
2
3
10
IAVG - AVERAGE CURRENT PER SEGMENT - mA
Figure 2. Typical Time Avaragad Luminous Intensity
par Segment vs. A_age Current per Segment
1.4
>
zw
~
"
;;;
..
iii...
1.2
U
u:
;!;
w
'":::>o
'":::>
0
z
z
:E
:E
3
3
w
1.0
.8
.6
/
v
I
-/
w
>
>
;::
....
w
~
"
W
0:
0:
.4
.2
10
TA - AMBIENT TEMPERATURE _
°c
20
30
40
50
!PEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 3. Relative Luminous Intensity vs. Ambient
Temperature at Fixed C.. rent Level
Figure 4.
Rel~ive Luminous Efficiency vs. Peak
Current per Segment
79
~~~~---
__
-~-----_-._~~
•• __
.-~~
--~~_~-c
____
____ __=__ __
~_=~
~
~--"----.
package Description
5.08 (.200) -+-----I
TYP.
,--
1
'
'3.18(.125)
_+_
~+~
l'
,'2'
NOTES, I, OIMENSIONS IN MILLIMETERS AND (INCHES).
2. TOLERANCES ON ALL DIMENSIONS ARE 0.038>(.015)
UNLESS OTHERWISE SPECIFIED.
,,'t,
6.35±0.25 •
(,250 • .010) ,
L-
1
"_:..L.
' 1
"
15.37
-,--t-:..-.
3'
(.605):::j
MAX.
2.03
1.080)
~;:;:-::;'l=~:;:;:::;:1-1
IT
1.78
(.070)
Figura 5.
Magnified Character Font Description
DEVICES
, , 5082-7432 '
6082-7433 '
,>,'
','
"
'
"
,
,D1~~NSI\>NS IN MI(~ET£RF.~ I~ESl;' ,,'
,,'
'~'
/
Figure 6.
Device Pin Description
PIN
NUMBER
6082~7433
: S082.7432
FUNCTION'
, FUNCT.I()N ' '
'"
CATHODE t"
"SEENOTEL
2"
3
; JllNODEe',:'
,ANODEe
'
,ANODEd'
AIilQPEd
4'
CATHODE 2
5
,ANOPEc.
6
, ANODEdp,
" CAT:HOOE2
ANODEc'
"
,
,CATHODE ,3 '
8,
9, "
'10 "
,1.1 '
12 "
"
ANODEb
, ANODEg
ANOD~a"
ANODE a ,
ANODEf
ANODEf, "
" SEe NOTE 1. '
SEE NOTE 1. " ,
NOT E 1. Leave Pin unconnected.
80
Electrical/Optical
only one decoder/driver is required for very long
multidigit displays.
The 5082-7430 series devices utilize a monolithic
GaAsP chip of 8 common cathode devices for each
display digit. The segment anodes of each digit
are interconnected, forming an 8 by N line array,
where N is the number of characters in the display.
Each chip is positioned under an integrally molded
lens giving a magnified character height of 2.79mm
(0.11) inches. Satisfactory viewing will be realized
within an angle of approximately ±20° from the center-line of the digit.
A discussion of display circuits and drive techniques
appears in Application Note 946.
Mechanical
The 5082-7430 series package is a standard 12 Pin
DIP consisting of a plastic encapsulated lead frame
with integrally molded lenses. It is designed for
plugging into DIP sockets or soldering into PC
boards. Alignment problems are simplified due to
the clustering of digits in a single package.
To improve display contrast, the plastic encapsulant
contains a red dye to reduce the reflected ambient
light. An additional filter, such as Plexiglass 2423,
Panelgraphic 60 or 63, and Homalite 100-1600, will
further lower the ambient reflectance and improve
display contrast.
The devices can be soldered for up to 5 seconds at
a maximum solder temperature of 230°C (1/16"
below the seating plane). The plastic encapsulant
used in these displays may be damaged by some
solvents commonly used for flux removal. It is
recommended that only Freon TE, Freon TE-35,
Freon TF, Isopropanol, or soap and water be used
for cleaning operations.
Character encoding on the 5082-7430 series devices
is performed by standard 7 segment decoder/driver
circuits. Through the use of strobing techniques
MOS
"CALCULATOR
ON A CHIP"
~.
/
Figure 7. Block Diagram for Calculator Display
81
Ii
HEWLETT
.
SPECIAL PARTS
FOR CALCULATORS
PACKARD
.
COMPONENTS·
.
.5082·7440
.SERIES
TECHNICAL DATA
APRIL 1977
Features
• MOS COMPATIBLE
Can be driven directly from MOS circuits.
• LOW POWER
Excellent readability at only 250JlA
average per segment.
• UNIFORM ALIGNMENT
Excellent alignment Is assured by design.
• MATCHED BRIGHTNESS
Uniformity of light output from digit to
digit on a single PC Board.
• AVAILABLE IN 50.8mm (2.0 Inch) AND
60.325mm (2.375 Inch) BOARD LENGTHS
Description
,/
The HP 5082-7440 series displays are 2.67mm (.105")
high, seven segment GaAsP Numeric Indicators mounted
in an eight or nine digit configuration on a p.e. Board.
These special parts, designed specifically for calculators,
have right hand decimal points and are mounted on
5.08mm (200 mil) centers. The plastic lens magnifies the
digits and includes an integral protective bezel.
Applications are primarily portable, hand-held calculators
and other products requiring low power,low cost and long
lifetime indicators which occupy a minimum of space.
Device Selection Guide
Digits
Per
PC Board
8
9
Configuration
Part No.
Package
Device
B. B. B. B. B. B. B. B.
(Figure 5)
B.B.B.B.B.B.B.B.B.
(Figure 5)
82
5082·7440
5082-7448
5082·7441
5082-7449
III
Absolute Maximum Ratings
. Max,
Mir;,'
Parar;neter . .
Pe8k. Forward. CUrr~nt per segment or dp (Q.uiatlon < 5Q9p$)\ .
~20
3
rnA
50
'mW
+85
°c
+SS
°c
Reverse Voltage .
NOTES: 1. Derate linearly
@
O.1mAf'C above 60°C ambient.
Units
mA
• .50
~
V
230
"c
2. See Mechanical section for recommended soldering techniques
and flux removal solvents.
Electrical/Optical Characteristics at TA=25°C
Symboi
Parameter
Luminous Intensity/5egment or dp13.41 .
T~
Condition ..
Min~
Typ.
9
40
~
Forward VoltagelSegment or dp
VF
~.
655
NOTES: 3. See Figure 7 for test circuit.
4. Operation at Peak Currents of less than 3.5mA is not recommended.
50
'"
1000
1l
..."I
E
...
40
OZ
35
"lE
",,,
iii0:
.
~
WW
.
0:
:;,
'"
;:
'"
30
it
20
"~
15
0:
r'.
I
L,...
:;,
Z
20
... 0
>.,
10
I
1
i
Ij
00
.2
.4
.6
.8
"3
1.1) 1.2 1.4 1.6 1.8 2.0
1.\0 - PEAK FORWARD VOLTAGE - V
Figure 1. Peak Forward Current vs.
Peak Forward Voltage
~
i
"3
w
>
~
a:
~
'IJ /
V
~.
/ 'l /
h~
10
0.1
't'
0.2 0.3
0.5
1.0
2
10
3
IAVG - AVERAGE CURRENT PER SEGMENT - rnA
Figure 2. Typical Time Averaged Luminous Intensity
per Segment vs. Averege Current per Segment
1.6
10
-.
"""I11i
~
!!l
100
50
40
30
01-
a::!
r
:~
.
>0:
"'~
w>
;!!II-iii
-,Z
",w
25
~
iii
z
W
r- DUTY CYCLE' 5'11'!1:;::
ffi~ 200
0
0:
500
400
300
........
I
,
>
u
W
U
1.2
.,:;,
1.0
it
W
"'- ......
0.5
0.4
~
...
0
Z
.8
-'
.6
i:;,
W
>
~
~
0.3
0.2
0:
-40
-20
1.4
~
Z
20
40
60
,.....
I
I
I
.I
.4
.2
00
80
°c
Figure 3. Relative Luminous Intensity vs. Ambient
Temperature at Fixed Currant .Level
TA - AMBIENT TEMPERATURE _
5
10
15
20
25
30
35
40
45
50
IpEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 4. R~lative Lu;"inous Efficiency vs. Peak
Current per Sag ment
83
Jlcd
nm
V
1.55
IF=!$rnA
45
Units
.~
Opt{ '" SmA
duty cycle =10%}
Peak Wavelength
Max.
IAVG'''' 500/.1A
Iv
package Description
1,S71h .308
1.202 , ,012)
Figure 5.
Magnified Character Font Description
DEVICES,
, 5082-7440 '
5082·7441,
5082·7448 '
5082·7449
Dim.B
Dim.C
5082-7440 50.800(2.000)
0.760(.030)
5.08(.200)
, Part No.
Dim. A
50.800(2.000)
0.760(.030)
5.08(.200}
5082-7448 60.325(2.375)
5.512(.217)
9.830(.387)
5082-7449 60.325(2.375)
5_512(.217)
9.830(.387}
5082-7441
Note:
Tolerances: ±.381 (.015)
Table 1.
Figure 6.
Device Pin Description
Pin
No.
6082,7441r'" ,.~,,,;
5082·7449 . :
Function: ,', '."','
5082·7441
5082-7449
Function
Pin
5082·7440
5082·7441
No.
5082-7448
5082·7449
Function
Function
~~ cAnJ;c~(?;' ~c'o '~:: ~ ~::de
10
2
3
4
Dig. ,2 Cat~;,:;
d.p~ Anode "\:':--
12
13
14
5
6
7
8
9
:<,'t' " --'
11
O1g.2 Cathode
'fLp: An~
~:: :~~;,:?f:,;\,,=::~:::e
15
16
Dig..4Cat~~,·< ::'"Dig.4 Cathode
Sag, e AriOd~:i'?:.·seg .. e:Anode
Dig. 5 Cath~
Cathode
17
') ,".'Dig..5
84
Seg. dAnode
Dig. 6 Cathode
Seg. gAnode
Dig. 7 Cathode
Seg. bAnode
Dig. 8 Cathode
Seg. f Anode
Dig. 9 Cathode
Seg. d Anode
Dig. 6 Cathode
Seg. 9Anode
Dig. 7 Cathode
Seg. b Anode
Dig. 8 Cathode
Sag. f Anode
Dig. 9 Cathode
Electrical/Optical
The HP 5082·7440 series devices utilize a monolithic
GaAsP chip containing 7 segments and a decimal point for
each display digit. The segments of each digit are inter·
connected, forming an 8 by N line array, where N is the
number of characters in the display. Each chip is positioned
under a separate element of a plastic magn ifying lens, pro·
ducing a magnified character height of 0.105" (2,67mm).
Satisfactory viewing will be realized within an angle of approximately ±20o from the centerline of the digit. The se·
condary lens magnifier that will increase character height
from 2.67mm (0.105") to 3.33mm (0.131") and reduce
viewing angle in the vertical plane only from ±20° to approx·
imately ± 18° is available as a special product. A filter, such
as Plexiglass 2423, Panelgraphic60 or 63, and Homalite 100·
1600, will lower ambient reflectance and improve display
contrast. Character encoding of the -7440 series devices is
performed by standard 7 segment decoder driver circuits.
through holes at the connector edge of the board or by inser·
tion into a standard PC board connector.
The devices may be soldered for up to 3 seconds per tab at
a maximum solderihg temperature of 230°C. Heat should
be applied only to the edge connector tab areas of the PC
board. Heating other areas of the board to temperatures in
excess of 85°C can result in permanent damage to the display. It is recommended that a rosin core wire solder or a
low temperature deactivating flux and solid core wire
solder be used in soldering operations.
Special Cleaning Instructions
For bulk cleaning after a flow solder operation, the follow·
ing process is recommended: Wash display in clean liquid
Freon Tp·35 or Freon TE-35 solvent for a time period up
to 2 minutes maximum. Air dry for a sufficient length of
time to allow solvent to evaporate from beneath display
lens. Maintcrin solvent temperature below 30°C (86°F).
Methanol, isopropanol, or ethanol may be used for hand
cleaning at room temperature. Water may be used for hand
cleaning if it is not permitted to collect under display lens.
The 5082-7440 series devices are tested for digit to digit
luminous intensity matching using the circuit depicted in
Figure 7. Component values are chosen to give an IF of
5mA per segment at a segment V F of 1.55 volts. This test
method is preferred in order to provide the best possible
simulation of the end product drive circuit, thereby insuring excellent digit to digit matching. If the device is to
be driven from Vee potentials of less than 3.5 volts, it is
recommended that the factory be contacted.
Solvent vapor cleaning at elevated temperatures is not recommended as such processes will damage display lens. Ketones, esters, aromatic and chlorinated hydrocarbon solvents
will also damage display lens. Alcohol base active rosin flux
mixtures should be prevented from coming in contact with
display lens.
These devices are constructed on a silver plated printed circuit board. To prevent the formation of a tarnish (AQ2S)
which could impair solderability, the boards should be stored
in the unopened shipping packages until they are used. Fur·
ther information on the storage, handling and cleaning of silver-plated components is contained in Hewlett-Packard Ap·
plication Bulletin No.3.
Mechanical
The 5082-7440 series devices are constructed on a standard
printed circuit board substrate. A separately molded plastic
lens containing 9 individual magnifying elements is attached
to the PC board over the digits. The device may be mounted
either by use of pins which may be soldered into the plate
Figure 7. Circuit Diagram used for Testing the Luminous Intensity of the HP 5082·7440
85
pACKARD·
COMPONENTS.
SPECIAL PARTS FOR
SCIENTIFIC AND
BUSINESS CALCULATORS
5082-1442
5082-1444
5082-1445
5082-1446
5082-1441
TECHNICAL DATA
APRIL 1977
Features
• 12, 14, AND 16 DIGIT CONFIGURATIONS
• MOS COMPATIBLE
Can be driven directly from most
MOS circuits.
• LOW POWER
Excellent readability at only 250.,A
average per segment.
• UNIFORM ALIGNMENT
Excellent Alignment Is assured by
design.
• MATCHED BRIGHTNESS
Uniformity of light output from digit
to digit on a single PC board.
Description
The HP 5082-7442, 7444, 7446, and 7447 are seven segment GaAsP Numeric indicators mounted in 12, 14, or 16 digit
configurations on a P.C. board. These special parts, designed specifically for scientific and business calculators, have
right hand decimal points and are mounted on 175 mil (4.45mm) centers in the 12 digit configurations and 150 mil
(3.81mm) centers in the 14 and 16 digit configurations. The plastic lens magnifies the digits and includes an integral
protective bezel.
Applications are primarily portable, hand held calculators, digital telephone peripherals, data entry terminals and other
products requiring low power, low cost, and long lifetime indicators which occupy a minimum of space.
Device selection Guide
DIgits
Digit
Per PC
HeIght.
mm (Inche$)
Board
12
2.54
(.100)
14
.2.54
(.100)
14
2.84
(.112)
16
2.92
(.115l
Configuration
Part
Package
DEVICE
B.8.B.8.8.B.8.8.B.B.B.B.
B.8. B. 8.8. B. 8.,9. B. B. B. B. B. B.
B. EI.I::!. 8. 8. B. 8. B.8. EI. B. 8. B. B..
8. 8.B.8. 8.8. 8. 8.8. 8. 8. 8.B;B.8.8.
"5082-7447 is a 5082-7444 with a slide-in cylindrical lens to provide added magnification.
86
No.
5082-
Figure 4
7442
and
7445
Figure 5
.7444
Figure 5
7447
Figure 6
7446
.
Maximum Ratings
Symbol
Parameter
Max.
Min.
Units
Peak Forward Current per Segment or dp(Duration "
J'cd
7
35
. J'cd
655
nm
1.55
V
IF = 5mA
'Max.
)o""l_tc
..
10
1.4
45
>
f-
40
in
35
1E
f;:;
30
""'"
25
2
20
:3
'"~
15
>
iE
w
..
10
~
a:
~
o
o
lJ
.2
.4
Vf -
.6
.8
1.0 1.2 1.4 1.6 1.8 2.0
PEAK FORWARD VOLTAGE - V
Figure 1. Peak Forward Current vs.
Peak Forward Voltage
1.2
L""-
-'""'" ~
~
o
z
Cl
'"
35
3. Operation at Peak Currents of less than 3.5mA is not recommended.
50
"E
Typ.
7
5mA Peak
1/16 Duty Cycle
7446
NOTE:
Unlts ,;
Min.
1
0.5
"
~
.......
,
.8
.6
il:lh....
0.4
~
~
f-
0.2
-60
~
.4
0.3
0.1
I
I
r
1.0
.2
-40
-20
20
40
60
T A - AMBIENT TEMPERATURE _ °C
Figure 2. Relallve Luminous Intensity vs.
Ambient Temperature at Fixed
80
10
20
30
40
50
IpEAK - PEAK CURRENT PER SEGMENT - mA
Figure 3. Relative Luminous Efficiency vs.
Peak Current per Segment.
Current Level.
Electrical/Optical
Homalite 100-1600, will lower the ambient reflectance and
improve display contrast. Digit encoding of these devices
is performed by standard 7 segment decoder driver
circuits.
These devices are tested for digit-to-digit luminous
intenSity matching. This test is performed with a power
supply of SV and component values selected to supply
5mA IPEAK at VF = 1.S5V. If the device is to be driven from
Vee potentials of less than 3.Svolts, it is recommended that
the factory be contacted.
The HP S082-7442, 7444, 744S, 7446 and 7447 devices
utilize a monolithic GaAsP chip containing 7 segments
and a decimal point for each display digit. The segments
of each digit are interconnected, forming an 8 by N line
array, where N is the number of digits in the display. Each
chip is positioned under a separate element of a plastic
magnifying lens, producing a magnified character.
Satisfactory viewing will be realized within an angle of
approximately ±20o from the centerline of the digit. A
filter, such as plexiglass 2423, Panelgraphic 60 or 63, and
87
Mechanical specifications
Special Cleaning Instructions
The 5082-7442, 7444, 7445, 7446, and 7447 devices are
constructed on a silver plated printed circuit board
substrate. A molded plastic lens array is attached to the PC
'board over the digits to provide magnification.
For bulk cleaning after a flow solder operation, the
following process is recommended. Wash display in clean
liquid Freon TP - 35 or Freon TE - 35 solvent for a time
period up to 2 minutes maximum. Air dry fora sufficient
length of time to allow, solvent to evaporate from beneath
display lens. Maintain solvent temperature below 30"C
(86" F). Methanol, isopropanol, or ethanol may be used for
cleaning at room temperature. Soap and water solutions
may be utilized for removing water-soluble fluxes from the
contact area but must not be allowed to collect under the
display lens.
These devices may be mounted using anyone of several
different techniques. The most straightforward is the use
of standard PC board edge connectors. A less expensive
approach can be implemented through the use of stamped
or etched metal mounting clips such as those available
from Burndy (Series LED-B) or JAV Manufacturing
(Series 1255). Some of these devices will also serve as an
integral display support. A third approach would be the
use of a row of wire stakes which would first be soldered to
the PC mother-board and the display board then inserted
oiler the wire stakes and soldered in place.
Solvent vapor cleaning at elevated temperatures is not
recommended as such processes will damage display
lens. Ketones, esters, aromatic and chlorinated hydrocarbon solvents will also damage display lens. Alcohol
base active rosin flux mixtures should be prevented from
coming in contact with display lens.
The devices may be soldered for up to 3 seconds per tab at
a maximum soldering temperature of 230"C. Heat should
be applied only to the edge connector tab areas of the PC
board. Heating other areas of the board to temperatures in
excess of 85°C can result in permanent damage to the
lens. It is recommended that a rosin core wire solder or a
low temperature deactivating flux and solid core wire
solder be used in soldering operations. A solder
containing approximately 2% silver (Sn 62) will enhance
solderability by preventing leaching of the plated silver off
the PC board into the solder solution.
These devices are constructed on a silver plated printed
circuit board. To prevent the formation of a tarnish (Ag 2S)
which could impair solderability, the boards should be
stored in the unopened shipping packages until they are
used. Further information on the storage, handling and
cleaning of silver-plated components is contained in
Hewlett-Packard Application Bulletin No.3.
Device Pin Description
Pin',
"
No.'
2
4
5
6
,7
a
8
9
10 "
11
""",12 ,
13
14
15
"
,16
17,
1,8
19,'
24
5082-7446
Function '
'" ,Qathode-:Qi!;lit1
" , :An~d$-Segment a
AnOd8-segment ,f "
' Cathode-Digit 2
AnodEi:-$egment b "
Cathode-Digit 3,
Anode-segment c
AhOtfe-SElgmem c •
Catli6d&'Digit 4 "
Anode-Segment. d
, ,
AnOde-DP
Anode-Segment DP
' , , Cathode-Digit 5' "
Anode-Segment e
AnOde-Segmentg
Anode-Segment
• Cathode-Digit 6 '
"Cathod&'rngif3 '
',' Anode-:Segment e '
q!lthod~Digit 2 ' " '
' , " Cathode-Olgi!", '
pathode-Plgit 7
Anode-Segment,d,
.cathOde-Digit 1
,'Cathode-Digits
' Cath()de-:D1glt 8 ,
, CathOde-Digit 12
Anod~egment g
' CathOde-Digit 9 ",'
' CathOde-Diglt.f$
" ", ,Cathode-Digit 11
Anode-Segmentb'
,Cathode-Digit 10 "
Cathode-Digit 1 ,
, ' A~ode-Segment L , ,CathOde-Digit 10 '
• ,., Cathojje-Digi, 11 ,,'
'CaWOde-Oi~it9 ""
,Cathode-Digit 12
CathOde.-:Digit 8
3
22
,',23,,'"
5082-7445
" FUnction '.' ,
1
20
,21
5082-7442
5082-7444, '
'5082-7447 ,
,
'
"¢ath~e-Digit 13
,
•
',' Cathode-OI,glt14
''.
,;
"
88
Ful\Ctlon
Cathode-Digit 1
,Cathode-Digit 2
Cathode-Digit 3
Cathode-Digit 4
Cathode-Di!;!it,5
, Anode-Segment e
Cathode-Digit 6
, Anode~Segment d
Catho~e-Digjt 7
AnOde-Segment a
Cathode-Digit 8,
Anode-Segment DP
Cathode-Digit 9
Anode-Segment c,
Cathode-Digit 10
Anode-Segment 9
Cathode-Digit 11
Anode-Segment b
Cathode-Digit 12
Anode-Segment f
CathOde-Dig~ 13
Cathode-Digit 14
Cathode-Digit 15
Cathode-Digit 16,
(
"'-. ,
-~--.--
package Dimensions
X~·I
1-----------56.812.235----------+1'I
4.51.1751111 PLCSEQLSP.
NON·ACCUM. TOLERANCESI
"58±'254~
1.082•. 0101
1.1> .13
1.180' .0051
I~~~~~
' -_ _ _..L.C==....::="'-'...::.:=....J
'UGL·t.:. :• .~,:.;2=:3: 4~'·~5: 6=;7;8:@):9=.10: 1:,:,:2:,~3=,4=,5;:,6=,:7:,:8;',:9=20~.:
J.:.
..
1.9 1.0751
j
I
~IAMETER
I-- 119
2.51.1001
PLCS NON·ACCUM.
PROTECTIVE
BEZEL
THROUGH
20 PLACES
•. 131.0051
TOLERANCESI
/
Figura 4.
51--------------1'1
1 - - - - - - - - - - - 80.312 .37
1 - - - - - - - - - - - 5 6 . B 12.2351-----
----~.!
3.81.1501 113 PLCS EQL SPC.
-I
18.3 1.7201
!rt~~=F~~~~==NO=N=.A:C=C=U~M=.T=O=L=E=RA:N~C=E=SI~~~~~~~~-~-~;===t::i
..
r
" .
Ilf~t'~·U:,~~~~~" """" .. " "
1.9 .075,
20 21 22
1.02± .13
1.040 ••0051
TOLERANCESI
4.72 ± .13
1.188' .0051
50827444
3.61.1401
50827447
Figura 5.
1+-----------1~7:: ~~:I---------------I·I
I+----------I~~~ ~O~I----
.-----.~!
1.021.0401 DIA
PLATEDTHRU
24 HOLES
4.061.1801
4.72± 0.38
1.186' .0151
Figure 6.
DEVICE
X
soe.744a
2.64
-~.
1i062-7<145
.,446
1i062.7447
'1<1001
2.54
~100l
.Y
·1A2
-L066L
lAO
tOss!
2.54
'1.42 .
2.92
(.11!>l
I'1.40
t.056l
'(~~I
!.t1651
ttQO>
89
lAO.
NOTES: 1. ALL DIMENSIONS IN MILLIMETRES AND
!lNCHESI.
2. TOLERANCES ON ALL DIMENSIONS ARE
'0.38 1.0151 UNLESS OTHERWISE
SPECIFIED.
r
SPECIAL PARTS
FOR CALCULATORS
PACKARD
HEWLETT
COMPONENTS
5082~1240
SER1ES
TECHNICAL DATA
APRIL 1977
Features
• MOS COMPATIBLE
Can be driven directly from MOS circuits.
• LOW POWER
Excellent readability at only 250llA
average per segment.
• UNIFORM ALIGNMENT
Excellent alignment is assured by design .
• MATCHED BRIGHTNESS
Uniformity of light output from digit to
digit on a single PC Board.
• STATE OF THE ART LENS DESIGN
Assures the best possible character
height, viewing angle, off-axis
distortion tradeoff.
Description
The HP 5082-7240 series displays are 2.59mm (.102")
high, seven segment GaAsP Numeric Indicators mounted
in an eight or nine digit configuration on a P. C. Board.
These special parts, designed specifically for calculators,
have right hand decimal points and are mounted on
5.08mm (200 mil) centers. The plastic lens over the digits
has a magnifier and a protective bezel built-in. A
secondary magnifying lens, available on special request,
can be added to the primary lens for additional character
enlargement.
Applications are primarily portable, hand-held calculators
and other products requiring low power,low cost and long
lifetime indicators which occupy a minimum of space.
Device Selection Guide
Digits
" Configuration
Per
PC Board
8
9
Part No.
Package
Device
B. B. B.B~ B. B. B.B.
B. B. B. B. B. B. B. B. B.
90
(Figure 5)
5082·7240
(Figure 5)
5082·7241
Absolute Maximum Ratings
[;
2. See Mechanical section for recommended soldering techniques
and flux removal solvents.
NOTES: 1. Derate linearly @O.lmAfCabove60°Cambient.
Electrical/Optical Characteristics at TA=25°C
IAVd·~·
HPK;'; SmA " , >
12:5 .' .
>50: ' '
"
duty Cycle" 1006)
'~.
nm
Fo!WardVoltage/Segmen~ or dp
v
1.6,
NOTES: 3. See Figure 7 for test circuit.
4. Operation at Peak Currents of less than 3.0mA is not recommended.
50
e
",
45
I-
z
40
a:
a:
35
"a:
"ita:
25
,
LU
:::>
Q
C
30
~
20
"'"
15
.,
LU
"
-~
"
10
o
o
.J
.2
.4
.6
.8
1.0 1.2 1.4 1.6 1.8 2.0
VF - PEAK FORWARD VOLTAGE-V
Figure 1. Peak Forward Current
Peak Forward Voltage
10
>
u;
I-
5
4
15
.. ....
...,....,...,.,......-r--r..,...,-,"".,,......,,..,...,."'1""'-,
1.6 ...-......
~
LU
i1
u.
~
..
I-
~
:::>
0
z
iii:
~~
:3
~
0.5
0.4
0.3
a:
0.2
LU
>
~
'AVG - AVERAGE CURRENT PER SEGMENT - mA
Figure 2. Typical Time A veragad Luminous Intensity
par Segment VI. A_ege Current par Segment
VI.
°:!s0
'.
U.
LU
!!l
.......
~
~
~ Ii...
LU
>
5
LU
a:
-40
-20
20
40
T A - AMBIENT TEMPERATURE -
60
80
°c
'PEAK - PEAK CURRENT PER SEGMENT - mA
Figure 3. Relative Luminous Intensity VI. Ambient
Temperature at Fixed Current Level
Figure 4. Relative Luminous Efficiency
Current par Segment
91
VI.
Peak
package Description
7.112:t .381
,~280' .0'16)
'2.7oo • .lI81
f
'2.540i:.3IU
(.100' .0'5)
',:'
.
'
............ 1
r-:-.
.381
1= • .D15)
l
3' 4
f-- is4
5 6 7 e a tQ.n 12 13 14 15
C. HIO) NON-CUMULATIVe
t.
(3)
~ ~
17
{·g:.·Tv~)
l:or:::~--
,,5QS-t
-J
ffi'::.oa:
NOTes: 1. ~mentlon, in miUimeten anJ tit'fthes).
,
2. f..ogo-and part numbtr .,.on back of .724Q.& 7241,
3. Iieoood' }.f;~,yitibC)1 t.!il'Condltion
ij!~uminous Intensity,!?".
;,:,+0
. (Time AverSQedltl)djllltdi~play ...
",' : :, 0'
5082-7275, 5982-7~,~4~'6,!, <,_"y,u y':",
-;;:"':',-.'
-c
~:,
;e'f:l.
Iv
__
':.Luminous IntensitylSeg~nt or 'l:!p
(Time Averaged) 5 digit display
5082-7265,5082-7285 14,61
>,
Forward Voltage per Segment or dp
5082-7275, 5082-729~:15 digit display
Forward Voltage per:~ment or dp'
5082-7265, 5082-7285 5 (flgil display
Iv
;~
,..
:;
,;,,...,
Peak Wavelength
Dominant Wavelength{5 1
r'
L,
lavg. 2mA
·.(30 mA Peak
1/15 duty cycle)
30
lavg. = 2 mA
(10mA Peak
1/5 duty cycle)
30
~'Tfp,
90
,"
..
;"Max, {~a I(;;;~
"i '.""
:<;;.,!\; •••,<:
~,.;
~:,.,:'
70
j1;[,.
xlild
:~;1
VF
IF = 30 mA
1.60
2.3
V
VF
IF = 10 mA
1.55
2.0
V
APEAK
655
om
Ad
640
nm
Reverse Current per Segment or dp
IR
Temperature Coefficient of Forward
Voltage
i";;.•; ; : r ; ;
l:iVF/"C
Va -=5V
100
-2.0
/lA
,>c
mV/·C
NOTES: 4. The luminous intensity at a specific ambient temperature, Iv(T A). may be calculated from this relationship:
Iv(T A) = IVI'" C) (.985) IT A - 25' C)
5. The dominant wavelength Ad, is derived from the C.LE. Chromaticity Diagram and represents the single wavelength which
defines the color of the device.
6. Operation at peak currents of less than 6.0 mA is not recommended.
lI
1000
800
600
>z
Ow
w:;;
w
:;;>-
~~
~~
40
>'"
>-5
z
20
~-
":l
oL-~~~~-L~~~~~L-~
.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
400
2.6
IAVG - AVERAGE CURRENT PER SEGMENT - rnA
VF - PEAK FORWARD VOLTAGE - V
Figure 2. Typical Time Averaged Luminous Intensity
per Segment vs. Average Current per Segment.
Figure 1. Peak Forward Current vs.
Peak Forward Voltage.
95
2.0 r-,.--...,-...,----,.--,r'"'""--""-""---""""
1.9\-'-+-+-+-+---'1-+--+-+-+-1
1.81-+--+-+-+--'-f---'-r+-+-+-.•~-I.
r:::+=++=t~::;;;*=$:;t:~
1.611.51-+---t-:"""~'--j-~:-·+-+--t-::-lr-::-r-"1
1.7
1.4I-h~L-+-+---t_
. ··-+-c++.::c-t-·.....,
1.3
"'~t-..
0.51=+==t:=1=::j::+=+~
~:: f--:t--+--f--:t--+---1--I
0.2 f--+--+--f--+_-+--1r--l
f--tT/-+-+-+--l-r+-+-+-:-I
1.2
t-'-t'-'-+__;__--t-~-t-..:.__;__i.--t-.--t-"i
1.1
H't-++-+--l---t-1-r+--l
I
I
1.0
.9
.8
.7
O~6L,-0-'--4.J,0-'-_..l20::-'--0':---'-2-::0--'-~40:-'--:'6':-0.J..-.;!80·
fl-+--+:-+--+--j-t-'++-+--l
f-+--+:-+--+--1-:-t-'+-+:-+--l
.6 a
TA - AMBIENT TEMPERATURE _ °C
20
40
60
80 100 120 140 160 180 200
IpEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 3. Relative Luminous Intensity vs. Ambient
Temperature at Fixed Current Level.
Figure 4. Relative Luminous Efficiency vs. Peak
Current per Segment.
Electrical
Mechanical
The HP 5082-7265,7275,7285, and 7295 devices utilize a
seven segment monolithic GaAsP chip. The 5082-7285
and 7295 devices use a separate decimal point chip
located to the right of each digit. The 5082-7265 and 7275
devices use a centered decimal point on the monolithic
seven segment chip. The centered decimal pOint version
improves the displays readability by dedicating an entire
digit position to distinguishing the decimal point. In the
driving scheme for the centered decimal pOint version the
decimal point is treated as a separate character with its
own time frame.
These devices are constructed on a standard printed
circuit board substrate. A separately molded plastic lens is
attached to the PC board over the digits. The lens is an
acrylic styrene material that gives good optical lens
performance, but is subject to scratching so care should
be exercised in handling.
The device may be mounted either by use of pins which
may be soldered into the plated through holes at the
connector edge of the PC board or by insertion into a
standard PC board connector. The devices may be
soldered for up to 3 seconds per tab at a maximum
soldering temperature of 230°C. Heat should be applied
only to the edge connector tab areas of the PC board.
Heating other areas of the board to temperatures in excess
of 85°C can result in permanent damage to the display. It
is recommended that a rosin core wire solder or a low
temperature deactivating flux and solid wire solder be
used in soldering operations.
The segments and decimal pOints of each digit are
interconnected, forming an 8 by N line array, where N is
the number of characters in the display. Character
encoding is performed by standard 7 segment decoder
driver circuits. A detailed discussion of display circuits
and drive techniques appears in Applications Note 937.
These devices are tested for digit to digit luminous
intensity using the circuit depicted in Figure 8.
Component values are chosen to give a Peak IF of 10 mA
per segment for the 5 digit displays and 30 mA per
segment for the 15 digit displays. This test method is
preferred in order to provide the best possible simulation
of the end product drive circuit, thereby ensuring
excellent digit to digit matching. If the device is to be
driven at peak currents of less than 6.0 mA, it is
recommended that the HP field salesman or factory be
contacted.
The PC board is silver plated. To preventthe formation of a
tarnish (Ag2S) which could impair solderability the
displays should be stored in the unopened shipping
packages until they are used. Further information on the
storage, handling, and cleaning of silver plated components is contained in Hewlett-Packard Application Bulletin NO.3.
J
+5 VOLTS
O-----'-fr
For special product applications, the number of digits per
display can be altered. It is also possible to provide a colon
instead of the centered decimal point. Contact the HP field
salesman or factory to discuss such special modifications.
SEG-M-E-NT-------t,
,r--.----,
SWITCH
•
ITYP. 1 OF 7)
RS;;'
Deacrlpllon
Symbol
Storagetemper8~ut~;.ambient
. Operating temperature,' ca8e 11 •2)
l '! .:
Supply
'.
Ts
....
.
volte:ge
.
Voltageapplted winput.logic. dp and enable pins
Voltag~ applied tQblanking input (1}
-40
+100
Tc
-20
Vee
-0.5
+85
+7.0
VI,VOP,VE
.':'iI.5
;;/::'+7.0'·
VB
-0.5
Maximum .aolder temp$ratureat 1.59mm (,062 inch )
. ~low seating planei.t II<; 5 seconds
Unl
·C
°c
V
V
V
Vee
230
.·::i::
~ '''~
:
·C
Recommended Operating Conditions
Symbol
Daacrlptlon'
tHoLD
ns~
~••.
nsec
;:
nsec
200
nsec
Max.
112
170
U,,"
mA
560
935
mW
Vcc=5.0V, Tc=25°C
Logic low-level input voltage
VIL
VEL
Enable high-Voltage; data not
being entered
VEH
Min.
32
70
0.8
0.8
Vcc""4.'5tr::
IBL
Blanking high-level input current (1)
laR
0.8
Logic low-level input current
Logic high-level Input current
I. L
1m
Enable low-level input current
IEL
I Ell
V
V
3.5
Vcc""S.SV,
Vcc=5.5V,
Vec=5.5V,
Vcc-5.5V,
Vcc=S.5V,
V
V
2.0
Vs>!
V
V
VBl
Blanking low-level input current!?)
",cd
2.0
VIH
Enable low-voltage; data being
entered
Enable high-level input current
·C
Typ,<4)
Test Conditions
I,
Peak wavelength
Dominant Wavelength (8)
V
+85
ICC~C"'5.5V (Numeral
Symbol
and dp lighted)
Blanking low-voltage; display
not blanked i1l
Blanking high-voltage; display
blanked I?)
Unit
5.5
(Tc = -20°C to +85°C, unless otherwise specified).
PT
input voltage
·:Max.
12e::' :.
hLII
Luminous intensity per LED
(Digit average)!;,M
high~level
5.0
:
Electrical/Optical Characteristics
Logic
Nom.
-20
tSETtJP
Enable pulse rise time
Description
4.5
tw
Enable Pulse Width
Time data must be held before positive transition
of enable line
Time data must be held after positive transition
of enable fine
Supply Current
Power dissipation
Min.:.'
Vee
Tc
Supply Voltage
Operating temperature, case
VSL=0.8V
20
",A
VBH=4.5V
VIL=0.4V
2.0
mA
-1.6
mA
VIH-2.4V
+250
VEL =D.4V
-1.6
",A
m)\.
+250
Vcc=5.5V, VEH"'2.4V
1
APEAK
Tc=25°C
655·,
Ad
Tc=25°C
640
",A
nm \
nm \.
0.8
gm
Weight
Notes: 1. Nominal thermal resistance of a display mounted in a socket which is soldered into a printed circuit board: fi'lJA;5r:t'CIW;
fi'lJc;15° CIW; 2. fi'lCA of a mounted display should not exceed 35° CIW for operation up to Tc ; +85° C. 3. Voltage values are with respectto
device ground, pin 6. 4. All typical values at Vcc;5.0 Volts, Tc;25° C. 5. These.displays are categorized for luminous intensity with the intensity category designated by a letter located on the back of the display contiguous with the Hewlett-Packard logo marking. 6. The
luminous intensity at a specific case temperature, Iv(T c) may be calculated from this relationship: Iv(Tc);lv (25°C) e[-·0188I"C ITc-2S'C I]
7. Applies only to 7340. 8. The dominant wavelength. Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
99
.5
Pin.
;ETUP
Vee
ENABLE
\tOLD
DATA INPUT
(LOW LEVEL DATA)
INPUT
8-~
~••V
INPUT
UV
""eI
.30
i'a:!i
.2'
""co
z
.20
........
.
.1'
:
;;;
z
5
I
~
.10
1
-1.8
-1.0
G -1.0
e -..
5
80
60
'
L
4
3
!.!
I
\
\.
-.4
00
90
~
I
v~ ..
s..ov
,
c'
-1.2
Figure 4. Typical Blanking Control
Input Current VI.
Temperature 5082-7340.
-.8
..
-
-.'
-.2
\
1.0
2.0
3.0
'.0
VE - LATCH ENABLE VOLTAGE - V
le -CASE TEMPERATURE _ °c
Figure 5. Typical Latch Enable Input
Current VI. Voltage for the
5082-7300 Series Devices.
TRUTH TABLE.
•.0
00
"
\
vE,-
\jv.-y y
0.5
1.0
2.0
4.0
3••
VIN - LOGIC VOLTAGE -
x.
, llII82-73OO17302
~
X,
L
L,
l
I.
I.
I.
L
H'
Figure 6. Typical Logic and Decimal
Point Input Current vs_
Voltage for the 5082-7300
Series Devices. Decimal
Point Applies to 5082-7300
and -7302 Only_
I.
l
H
I.
l
.t
H
H·
L
H
L
t
i-i
c::
--'
I)
~~
:::~
.', ,
C
.::-, .
L
H
L
H
H
H
L
I.
H
II
Ii
'"1
H
t
L
I.
: •• t
I'
'
I-I
'
•
!:~
.".
<:~
f':
L.
II
H
L
' Ii'
L
H
L
H
H
Ii
L
H.
H
L
H
....
H
H
H
L
(BLI>NKI
H
II
(8W1NK)
H.
(IN
Ol'F
LOADOATA
LATCHOATA
DiSPI.AY-QN
DISPLAY·OFF
SLANKlNGI31
<:!
"." ~
::1
L
ENASt.1I1
~;
!:~
....
"1
.', '
6
H
oeclMALPT.12I
1
I
L
H
llII82-7340
n
,~7f,
H
;.'j
t.~
.lBLI>NK)
I.
!1IWUiKI
1...
~:~
:....
...
D
E..
.r
,
lIoP'L
VOP"H
v~
=1,
ve
v.
v.
-Ii
-L
-II
Notes:
1 . H = Logic High; L = Logic Low. With the enable input at logic high
changes in BCD inp\l\ logic levels have no effect upon display
memory or displayed character.
2 The decimal point input, DP, pertains only to the 5082-7300 and
5082-7302 d isp Iays_
3. The blanking control input, B, pertains only to the 5082-7340
hexadecimal display. Blanking input has no effect upon display
memory.
100
••0
v
IICI)D..TAm '
X.
5
,I,' I
to • U'C . -.:...
-1.6
§
........
-.2
40
2
"
II:
~
20
1
-1 .•
-1.2
IIs-O.tv
•
I
~'2S'CI_
i~
%
.OS
.'
~ :i
Figure 3. Typical Blanking Control
Current VI. Voltage for
5082-7340.
1I -1.4
iii"" -.8~
r-- t--
v",
VB - ~LANKING VOLTAGE - V
-1.4
~
J!'
-20
00
~
"u
r-
"
""'I '
:/
'
,VCC"'&.ov
V
V
/
V
;II
.; ,1
-1.6
II:
II:
1Is-3.5V
.~
,
I
1I
I
•
B
1-1,
,.
C";::!f
.2
~
Figure 2. Block Diagram of 5082-7300
Series Logic.
~C:~OV.:...
-ov
I
I
.MATRIXDR""",,
'LEO .
IllATlUX:,
,
~ r-....
a:
L~
BLANKING(31
CONTROL
4_
GROUND
....... ~-4.~V
.
:
'"
., C.
~
'
:
.3
"u
'''---'
'
V,
I-
'DICOO£A,
.'
01"
Figure 1. Timing Diagram of 5082-7300
Series Logic.
'-..
f---
j
~.. ~
.35
~"
~
,J~-
ENABLE
MEMOfIV
II:
II:
, MAT.RtX
~:.:,
..
~
'.
~:::.
3 _ p;:v,~
DP!21 4 _
DATA INPUT
(HIGH LEVEL DATAl
1I
5--.
LOGIC
/,;;-
1.5V
";~
Solid State Over Range Character
For display applications requiring a ±, 1, or decimal point designation, the 5082·7304 over range character is available. This
display module comes in the same package as the 5082·7300 series numeric indicator and is completely compatible with it.
package Dimensions
REAR VIEW
FRONT VIEW
5
6
7
SIDE VIEW
8
IT
15.2
END VIEW
PIN ·.FUNCT.ION
...1-0.'0.
~SEATING
PLANE
(.600)
4
3
2
5
~
2.•
1.11)
1
Plu$
Numerat.O".
Numera.IOne
OP
Open
Open
Ii
7
(.012±.CHl3)
PIN1KEY
1
2
3
4
~ 4.3~~~
r
1.17)
NOTES:
1. Dimensions in inches and (millimeters).
2.
Unless otherwise specified, the tolerance
on all dimensions Is :':..015 inches. (± .38mm)
5082-7304
TRUTH TABLE FOR 5082·7304
,.~A,tT~R
1"':>""
",
'
.+:
,
"1
.'.
i:"
~
. Decimal Pomt .
,.BlIlnk
NOTES:
PIN
..... 2,3
TYPJCAL DRIVING CIRCUIT FOR 5082·7304•
.4
8
H
H
X
X
L
x-
X
L
X
X
H
X
X
'x
X
1i
I..
L
i.-
I
I
I
I
I
I
Absolute Maximum Ratings
OESCR1Pli0N
' SMoL MIN MAX
"
r-,~------,---
L: Line switching transistor in Fig. 7 cutoff.
H: Line switching transistor in Fig. 7 saturated.
X: ·don't care'
NUMERAL-ONE
V-ce
'
,
------~'---,
M~S
~
I
I
I
I
I
J
UNIT
r
RECOMMENDED OPERATING CONDITIONS
SYMBOL MIN NOM MAX UNIT
. I.E 0 $upply voltage.:
. Forward current•. ·each
\
L!f~
.J" •
:"'"" <
4.5
5.0
.5.0
5.5"
,10
V.
inA
NOTE:
Figure 7.
LED current must be externally limited. Refer to figure 7
for recommended resistor values.
Electrical/Optical Characteristics (TC
101
=
-20 0 C TO +85 0 C, UNLESS OTHERWISE SPECIFIED)
NUMERIC AND 5082-1356
HEWLETT
HEXADECIMAL DISPLAYS 5082-1351
FOR INDUSTRIAL 5082-1358
APPLICATIONS 5082·1359
PACKARD
COMPONENTS
TECHNICAL DATA APRIL 1977
Features
• CERAMIC/GLASS PACKAGE
• ADDED RELIABILITY
• NUMERIC 5082-7356/-7357
0-9, Test State, Minus Sign, Blank States
Decimal Point
7356 Right Hand D.P.
7357 Left Hand D.P.
• HEXADECIMAL 5082-7359
0-9, A-F, Base 16 Operation
Blanking Control, Conserves Power
No Decimal Point
• TTL COMPATIBLE
• INCLUDeS DECODER/DRIVER WITH 5 BIT
MEMORY
8421 Positive Logic Input and Decimal Point
• 4 x 7 DOT MATRIX ARRAY
Shaped Character, Excellent Readability
• STANDARD DUAL-IN-LiNE PACKAGE
15.2mm x 10.2mm (.6 Inch x .4 inch)
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from Unit to
Unit within a Single Category
pattern, and four blanks in the invalid BCD states. Theunit
employs a right-hand decimal point. Typical applications
include control systems, instrumentation, communication systems and transportation equipment.
The 5082-7357 is the same as the 5082-7356 except that
the decimal point is located on the left-hand side of the
digit.
The HP 5082-7350 series solid state numeric and
hexadecimal indicators with on-board decoder/driver and
memory provide 7.4mm (0.29 inch) displays for use in
adverse industrial environments.
The 5082-7359 hexadecimal indicator decodes positive
8421 logic inputs into 16states, 0-9and A-F. In place of the
decimal point an input is provided for blanking thedisplay
(all LED's off), without lOSing the contents olthe memory.
Applications include terminals and computer systems
using the base-16 character set.
The 5082-7356 numeric indicator decodes positive 8421
BCD logic inputs into characters 0-9, a " -" sign, a test
The 5082-7358 is a "±1." overrange display, including a
right hand decimal point.
Description
package Dimensions
t
I
7356
'0.2MAX_1
1.400)
I
,li:j
13.5
t
(.400)
I~
IrtrHir-r-lrl
5
"
13.5
T
Lr-l-rrlr+rl
I
3.0
6
7
•
I
I
5:r
PIN
1
2
3
END VIEW
FUNCTION
5082·7356
5082·7359
AND 7357
HEXA·
NUME.~ r--!'ECIf!1~L........
Input 2
Input 2
l-nput4
Input 4
InputS
Input 8
Decimal
point
Blanking
cOhtrol
5
Latch
enabte
enable
6
7
Ground
Ground
Vee
Input 1
Vee
Input 1
4
4.8
r-----r (.19)
REAR VIEW
8
Latch
NOTES:
1. Dimensions in millimetresand !inches).
2. Unless otherwise specified, the tolerance
on all dimensions is ±.38mm (t.01S")
3. Digit center line is ±.25mm (±.01")
from package center line.
LUMINOUS
INTENSITY
CATEGORY
DATE CODE
PIN 1 KEY
7359
1
13.5
(.12)
5
I
(.400)
11
5"
1,-I.,-.!r-1+rI
I-- 10.2 MAX . .J
7357
'0.2MAX'j
13TYP __
(050)
102
1
Absolute Maximum Ratings
G·C
v
v
.iMaximum solder temperature at ,1.59mm(.062 Inch).
below seatlni;~\!.1~;,t,~ 5 ~~~0~9~.,
°0
.;:,.,.
Recommended Operating Conditions
Electrical/Optical Characteristics
(TA = O"C to +70°C, unless otherwise specified).
Supply Current
f'
Enable low-vpltage,; data being
entered':!;:'.;',
"
Enable high-voltage; data' not
being entered,
Blanking low"'Voltage;
not blanked til·",
Blanking low-level input current {1f
Blanking high-level input curre:hi('/f'fi
Logic low-level input current.
Logic high-level input current
Enable low-level input current
Enable high-level input current
Peak wavelength
Dominant Wavelength I~l
Vcc=5.5V, VBH=4.5V
Vcc=5.5V, V1L=OAV
Vcc=5.5V, Vm=2.4V
Vcc=5.5V, VEL=OAV
Weight
Notes: 1. Nominal thermal resistance of a display mounted in a socket which is soldered into a printed circuit board: 0 JA =5ff'C/W;
0 JC =15°CIW; 2. 0CA of a mounted display should not exceed 35°CIW for operation upto T A=+10ff'C. 3. Voltage values are with respectto
device ground, pin 6. 4. All typical values at Vcc=5.0 Volts, TA=25°C. 5. These displays are categorized for luminous intensity with the intensity category designated by a letter located on the back of the display contiguous with the Hewlett-Packard logo marking. 6. The
luminous intensity at a specific ambient temperature, Iv(TA), may be calculated from this relationship: Iv(T A)=l v12 q (.985) [TA -25°C]
7. Applies only to 7359. 8. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
,o
103
DATA INPUT
(LOW LEVEL DATA)
1.SV
DATA INPUT
(HIGH LEVEL DATA)
1.SV
Figure 1. Timing Diagram of 5082-7350
Series Logic.
I; H
V I';:H
"flo'
....• ·.IBLANK).
Pin.
Vee
~~
ENABLE
LOGIC
INPUT
DP[2]
BLANKING[3J
CONTROL
4_
GROUND
Figure 2. Block Diagram of 5082-7350
Series Logic.
Notes:
1. H = Logic High; L = Logie Low. With the enable input at logic high
changes in BCD input logic levels have no effect upon display
memory or displayed character.
2. The decimal point input, DP, pertains only to the 5082-7356 and
5082-7357 displays.
3. The blanking control input, B, pertains only to the 5082-7359
hexadecimal display. Blanking input has no effect upon display
memory.
-1.
...
~
a:
-1. 4
!5
-1. 2
w
~
-1. 0
u
ffir
~
Figure 3. Typical Blanking Control
Current vs. Voltage for 50827359.
°c
Figure 4. Typical Blanking Control
Input Current vs. Ambient
Temperature for 5082-7359.
104
.
i~
....
..
l -,--
"cc· 5•OV
....
.
"
•
".
:.
.. :.
.....
.
.
'
.
.
'
6
4 • .......
.
2
0
TA - AMBIENT TEMPERATURE _
t·u'c.
I·····
.........
..,.,.
I
_w
VB-BLANKINGVOlTAGE-V.
I
•
1I -1.6
1'\.'.
\
,
\
'.'
1.0
."
>
\.
".
2.0
3.0
4.0
5.0
Ve - LATCH ENABLE VOLTAGE - V
Figure 5. Typical Latch Enable Input
Current VB. Voltage.
,"
~
!
~
.....
~
1.0
""
-1.8
ITo_wei_
-1.6
Ycc* 5,OV
-1.4
... "
E ..
Z
I
~ I- .8
a: Z
::> w
(,,) a: .7
... a:
a
~ 5
-1.2
~
.6
§~
.5
~~
.4
ffi g
""
.3
a:
a
-1.0
"~
-.8
I
•. 6
-" -.'
.... 1\
v,-
V
-r-
--
i"""--
-.....
Vee - $.OV
vu. -D.$V
1-'
_iil ~::!
2
J'-j\
°0
0.5
1.0
2.0
3.0
4.0
5.0
.2
1
o
·55·40
V1N - LOGIC VOLTAGE - V
Figure 6. Typical Logic and Decimal
Point Input Current vs.
Voltage.
I
f
-20
20
40
60
80
100
TA - AMBIENT TEMPERATURE _ °C
Figure 7. Typical Logic and Enable
Low Input Current vs.
Ambient Temperature.
TA - AMBIENT TEMPERATURE - °C
Figure 8. Typical Logic and Enable
High tnput Current vs.
Ambient Temperature.
Operational Considerations
ELECTRICAL
MECHANICAL
The S082-73S0 series devices use a modified 4 x 7 dot
matrix of light emitting diodes (LED's) to display
decimal/hexadecimal numeric information. The LED's are
driven by constant current drivers. BCD information is
accepted by the display memory when the enable line is at
logic low and the data is latched when the enable is at
logic high. To avoid the latching of erroneous information,
the enable pulse rise time should not exceed 200
nanoseconds. Using the enable pulse width and data
setup and hold times listed in the Recommended
Operating Conditions allows data to be clocked into an
array of displays at a 6.7MHz rate.
These hermetic displays are designed for use in adverse
industrial environments.
These displays may be mounted by soldering directly to a
printed circuit board or inserted into a socket. The lead-'
to-lead pin spacing is 2.S4mm (0.100 inch) and the lead
row spacing is"1S.24mm (0.600 inch). These displays may
be end stacked with 2.S4mm (0.100inch) spacing between
outside pins of adjacent displays. Sockets such as Augat
324-AG2D (3 digits) or Augat S08-AG8D (one digit, right
angle mounting) may be used.
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +100°C, it is important to
maintain a case-to-ambient thermal resistance of less
than 3SoC/watt as measured on top of display pin 3.
The blanking control input on the S082-739S display
blanks (turns off) the displayed hexadecimal information
without disturbing the contents of display memory. The
display is blanked at a minimum threshold·level of 3.S
volts. This may be easily 'achieved by using an open
collector TTL gate and a pull-up resistor. For example,
(1/6) 7416 hexinverter buffer/driver and a 120 ohm pull-up
resistor will provide sufficient drive to blank eight
displays. The size of the blanking pull-up resistor may be
calculated from the following formula, where N is the
number of digits:
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-1S, Genesolv DE-1S.
CONTRAST ENHANCEMENT
Rbl,"k = (Vee - 3.SV)/[N (1.0mA)]
The S082-73S0 displays have been designed to provide the
maximum posible ON/OFF contrast when placed behind
an appropriate contrast enhancement filter. Some
suggested filters are Panelgraphic Ruby Red 60 and Dark
Red 63, SGL Homalite H100-160S, 3M Light Control Film
and Polaroid HRCP Red Circular Polarizing Filter: For
further information see Hewlett-Packard Application Note
964.
The decimal point input is active low true and this data is
latched into the display memory in the same fashion as is
the BCD data. The decimal point LED is driven by the onboard IC.
105
Solid State Over Range Character
For display applications requiring a ±, 1, or decimal point designation, the 5082-7358 over range character is available. This
display module comes in the same package as the 5082-7350 series numeric indicator and is completely compatible with it.
package Dimensions
:> ('"'-..: ______ -.:.'_.:.7 ve.._~.-,~.,;-:~~,+;..:....'".,'
: :.
_O"'ON'''~''''
<~'{:
i . ' 1
I
I
I
I..
,;;
.....
- --.2 --- -;;.
I ....
5$)0
I
.r
I
..
-
,....
--:'f
~'_..J
.. ';,'
~
SIDE'
Figure 9. Typical Driving Circuit.
TRUTH TABLE
..-
PIN
FUNCTION
Num.... IOn•
..
.
2,3
4'
8
.X
H
,H
)(
X
.X
H
Decimal Point
X
X
H
X
X
Blank
L
L
L.
L
-1
Numeral On.
D'
4
S
6
7
1
'H
L
+
Plus
1
Open
Open
..
PIN
····.CHARACTER
.REAR
)(
X
NOTES: L: Line switching transistor in Figure 9 cutoff .
H: Line switching transistor in Figure 9 saturated.
X: 'Don't cere'
Vee
MlnuS/rlus
Electrical/Optical Characteristics
5082-7358
~fUPTION
TEST .cONDITI()NS
SYMBOL
.'
. Forward Voltage per LEO ,: .
"
,~
: aU diodes lit
Iv
. Peak wavelength
Dominant Wavelength
40,
,IF-SmA
. TC··25°C
Vee
V
280
320
inW
as
.~
655
" Ad'
" TC"25CC
640
nm
' nm.
1.0
.. gm'
Absolute Maximum Ratings
SYl\4BOL MIN NOM MAX UNIT
5.5
10,
UNIT.
2,0,
Tc =25OC
Recommended Operating
Conditions
6.0
·5.0
MAX
1.6
>.peak
Weight..
4.6
TVP
'F- 1O m A
"
Luminous Intensity par LED .!diglt .-age)
I.E D SupplY volt• .
Forward current,'each ....~D
MI'"
IF ,,'lOmA
=>F
': PT
Power. dissipation
..
',,- .
(fA = fte to 700 e, Unless Otherwise Specified)
DESCfUPl"ION
SYMBOL
Storage tetnperature, ambient
Ts
Operating temPerature, ambient
TA
Forward current,
LED.
IF,
.Aeverse voltage, each LED'
VA
V'
mA
IF
NOTE:
LED current must be externally limited. Refer to Figure 9
for recommended resistor values.
each·
106
MIN. MAX.
-65 '+126
-65 +100·
10
4
UNIT
' ·c
·C.
mA
.v
TECHNICAL DATA
APRIL 1977
Features
• 1.5 INCH HIGH CHARACTER
Readable From 60 Feet
• ON-BOARD DECODER/DRIVER
8421 Positive Logic Input
DTL-TTL Compatible
• 5 x 7 DOT MATRIX
Shaped Character For
Excellent Readability
38.1
(1.50)
• SINGLE PLANE
CONSTRUCTION
Wide Viewing Angle
G..
58.4 (2.30)
MAX.
• EDGE MOUNTING IN STANDARDPCBOARD
CONNECTORS (.156" Centers)
hJ
• RELIABLE, RUGGED, LONG
OPERATING LIFE
" 58
1.062)
Dimensions in millimeten and (inches).
14.7 (.58)
MAX.
Unless otherwise specified, the
tolerance on all dimensions is
±O.38mm (±.015 in.).
Description
The HP 5082-7500 is a 38.1 mm (1.5 in.) numeric indicator utilizing discrete red light emi~ing diodes arranged in a 5 x 7
pot matrix. Inclusion of the decoder/driver permits direct addressing by the standard BCD code.
The large size and high efficiency light emitters permit viewing distances up to 60 feet. The single plane of light emitters
permits wide viewing angles and low mounting space requirements. Applications include equipment for scales, process control and medical measurement, and other data systems requiring ease of readability at a distance.
Absolute Maximum Ratings
.', ;" ';D,escription
...... <>
Storage Temperattlre'Ambient .
Operating Tlm'lperat!lre. Ambient
L09ic Supply VoltageJl}' ; .
LED $up!).IV VpltageIt,21
Voltage Applied to BCD U.~l
.c· .. ,.
.>;.
".
,
".
'.
;
Symbol
Min •• ;
Ts
-40
"--20
-0.5
-0.5
TA
.
.'
.'
Vee
V LED
V,
.;,'"
and Decimal POlri.t Inputs
[1] Voltage values are with respect to ground pin.
[2]
V I or V LED not to exceed
vee
~0.5
Max.
Unit
85
70
°c
°c
.7
V
5.25
5.25
V
V
by more than O.5V at any time.
Recommended Operating Conditions
Symbol
Min.
Nom.
Max.
Logic Supply Voltage . .
Vee
LED sUpply Voltage, DisPlay ON [:I J .
LeO Supply Voltage, Display OfF {2J
\teo
4.5
4.5
-0.5
-20
5.0
5.0
0
25
5.5
5.25
1.0
70
DeS(:ription
. Operatill9 Temperature, Ambient
[1] All selected LEOs remain uniformly lit.
VLEO
.'.
TA
.
[2] All LEOs remain off.
107
Unit
V
V
V
°c
-
.
Electri~al
/ Optical Characteristics (TA = -20"C to 70°C, Unless Noted)
Description
Symbol
Test Conditions
Min.
Typ.
Max.
Units
L" State
V 1L
Vee=4.5V
0
0.8
V
Logic Voltage, "H" State
V IH
Vee'" 5.5V
2.0
5.25
V
Logic Supply Current
fcc
Vee" 5.5V
37 11]
65
mA
LeO Supply Current
ILED
Vee'" 5.5V, V LEO .. 5.25V
250[11
460
mA
1A[1 }
2.8
Logic Voltage,
U
Power Dissipation
Po
Vee" 5.5V, VLEO '" 5.25V
Luminous Intensity per
LED (digit average)
I
Vee = 5.0V, V u : O = 5.0V
TA = 25 0 C
Logic Current, "L" State
IlL
Vee" 5.5V, "In
Logic Current, "H" State
IIH
Vee
Decimal Point Current
Idp
[31
0.8
W
1.25
mcd
= 0.4V
-1.6
=5.5V, Vin = 2AV
+100
p.A
-25[2) -35
mA
Vee =5.5V, V LEO '" 5.25V
VdP = OAV
mA
Peak Wavelength
ApEAK
655
nm
Spectral Halfwidth
6A;j,
30
nm
25
901
Weight
[21 VCC'5.0V, v LED'5.OV, T A'25OC.
[3] Pin 2 is connected to the decimal point LED thru a 120nseries current limiting resistor. This pin should be connected to .ground thru a NPN switching transistor.
[1]
V CC =5.0V, V LEO =5.0V with statistical average number of LEOs lit, T A=25°C.
Truth Table
Character X8 X4
X2
X1
0
L
L
L
L
1
L
L
L
H
.....I
c:
..::
2
L
L
H
L
3
L
L
H
H
4
L
H
L
L
4I
L
H
C"
5
L
H
6
L
H
H
L
7
L
H
H
H
L
L
L
8
9
BLANK
BLANK
H
H
H
H
L
L
L
L
H
H
H
L
H
1:~-
n
'_I
<
g
E:
...,
BLANK
BLANK
H
H
H
H
H
H
L
L
H
L
I
~.25
0
-10
I
0
1
3
2
H
H
H
H
D.P. ON
D.P. (iN) = L
D.P. OFF
D.P. (lNl = H
0
55.25
4
0
:'"
1
1"-.
"-
~
3
2
55.25
4
V dp (V)
V1(V)
Figura 1. Typical BeD logic input current
vs, input voltage.
Figure 2. Typical d·ecimal point input
current as a function of dp input Yoltage.
i
,-:
I::
JI
300
q
'il
.
1.4
Vc¢' '.OV'
TA" 25"C
I
§'
"w
1.2
.S
~
!
4,/
/'
Y
V :
z
;;
3.5
RANGE
4.0
I
I
I
I
:,
I
I
,,
I
4.'
I
V1
,
~
0
3
RECOMME~Oi~
OPERATING
I
~
'G<;"
-..I
I
I
5.0
5.25
5.'
V LEO (V)
Figure 4, Typical luminous intensity per LED
(digit averagela. a function of VLED.
TECHNICAL DATA
APRIL 1977
Features
• RUGGED, SHOCK RESISTANT, HERMETIC
• DESIGNED TO MEET MIL STANDARDS
• INCLUDES DECODER/DRIVER
BCD Inputs
• TTL/DTL COMPATIBLE
• CONTROLLABLE LIGHT OUTPUT
• 5 x 7 LED MATRIX CHARACTER
Description
r~'\
l./
The HP 5082-7010 solid state numeric indicator with
built-in decoder/driver provides a hermetically tested
6.8mm (0.27 in.) display for use in military or adverse
industrial environments. Typical applications include
ground, airborne and shipboard equipment, fire control systems, medical instruments, and space flight
systems.
displayed for invalid codes. A left-hand decimal point
is included which must be externally current limited.
The 5082-7010 is a modified 5x7 matrix display that
indicates the numerals 0-9 when presented with a
BCD code. The BCD code is negative logic with blanks
Both displays allow luminous intensity to be varied
by changing the DC drive voltage or by pulse duration
modulation of the LED voltage.
The 5082-7011 is a companion plus/minus sign in the
same hermetically tested package. Plus/minus indications require only that voltage be applied to two input pins.
package Dimensions
.
,"
PIN
FUNCTION
PIN
FUNCTION "
1
2
Input 1
Input 4
VOP
3
V LED
4
Input 8
5
6
7
8
Ground
Vee
Input 2
I
109
Absolute Maximum Ratings
Symbol
Min.
Max.
Unit
Ts
-65
+100
Operating Temperature, Case
Tc
-55
+95
°c
"c
logic Supply Voltage to Ground
Vce
-0.5
+7.0
V
logic Input Voltage
Vi
-0.5
+5.5
V
LED Supply Voltage to Ground
VLEO[l]
-0.5
+5.5
V
Decimal Point Current
lop
-10
mA
Description
Storage Temperature, Ambient
Note: 1. Above T C - 65°C derate V LEO per derating curve in Figure 10.
Recommended Operating Conditions
Description
Logic Supply Voltage
Symbol
Min,
Nom.
Max,
Unit
Vec
4.5
5.0
5.5
V
V
LED Supply Voltage, Display Off
VLEO
-0.5
0
+1.0
LED Supply Voltage, Display On
VLEO
3.0
4.2
5.5
V
Decimal Point Current
lop(2)
0
-5.0
-10.0
mA
Logic Input Voltage, "H" State
VIH
2.0
5.5
V
Logic Input Voltage, "Lo State
V1L
0
0.8
V
Note: 2. Decimal point current must be externally -current limited. See application information.
Electrical/Optical Characteristics
Truth Table
Case Temperature, Tc = O°C to 70°C, unless otherwise specified
Description
Logic Supply Current
LED Supply Current
Symbol
Test
Conditions
350
235
mA
100
pA
-1.6
mA
Vee
5.5V
5.5V
5.5V
255
170
125
VLED
5.5V
4.2V
3.5V
Decimal Point
Voltage Drop
VLED
-Vop
lop=-10mA
PT
Vec
5.5V
5.5V
5.5V
VLED
5.5V
4.2V
3.5V
VLEO
5.5V
4.2V
3.5V
Te
25Q C
25Q C
25°C
[3J
[5]
Iv
Vc e=5.5V
VIH"" 2.4V
Vec "'5.5V
VIL=0.4V
lOgic
Character X8 X4 X2 Xl
-'--fX2lx:J
2.0
V
1.7
2.3
1.4
W
H
H
HIH
i...:
1
H
H
H L
2
H
H L
H
I
::.:
i..._
3
H
H
L
L
4
H
L
H H
5
HIL
6
Apeak
AA>1
3. With numeral B displayed.
4. All typical values at T C - 25°C.
5. TC - O°C to 65°C for VLED - 5.5V.
115
80
50
,tied
655
nm
30
nm
4.9
gram
.......
H
L
L
H
1-••
.....
L
L
HlL
7
H
L
8
L
H H H
9
L
H
Blank
L
H iL
Blank
L!H
Blank
L!LH
Siank
L
L 'H
L
Blank
L
L
H
Blank
L
L
L
H
L
..
i
L
:=:
~!
HiI
i
~--
-'I
L
L
I
I
Hi
L
VIL - 0.0 to O.SV
VIH - 2.0 to 5.5V
110
I
..:i
•..1.
J:::
......
0.7
60
40
,.',
0
~
1.6
1.0
Weight
Notes:
mA
ILEO
[3]
[5]
IlL
Spectral Halfwidth
75
45
Log ie Input Cu rrent,
"LH State (ea. input)
Peak Wavelength
Unit
Vec.=5.5V
IIH
Luminous Intensity
per LED (digit avg.)
Typ.(4] Max.
ICC
Logic Input Current,
"Ho State (ea. input)
Power Dissipation
Min.
...
VUI> ,
LOGICilll'llT
GROUI\ID
Figure 1. Equivalent input circuit of the 5082·7010 decoder.
Note: Display matal case is isolatad from ground pin #6.
Figure 2. Equivalent circuit of the 5082·7010 as saen from
LED and decimal pOint drive lines.
-1.0
".~,~
-0.9
..ill'"
...
E
I
-0.8
~
-0.7
"-
a:
a: -0.6
::>
,
1\
""",. 5.511
-0.5
~ -0.4
2
9'"
-0.3
I
.: -0.2
-0.1
o
o
1.0
3.0
2.0
4.0
5.0
VI - LOGIC INPUT VOLTAGE - V
Figura 3. Equivalent circuit of 5082·7011 plus/minus
sign. All resistors 345!l typical. Note: Display
metal case is isolated from ground pin #6.
Figura 4. Input current as a function of input voltage,
each input.
100
I
-1.10
90
.'"
"-
80
I
z
70
.
60
w
a:
a:
::>
-
""",I.s.sv
I
Vcc· S•5V
c(
VIH""2.4V
e
!zw -0.90
~
C
-20
20
40
60
80
96
TC - CASE TEMPERATURE -'C
Figura 5. Logic "H" input currant as a function of case
Figura 6. Logic "L" input current as a function of case
temperature, each input.
temperatura, each input.
111
1I
~
II:
II:
o~ l00~~~~---t~~~~~~~~~7-~
>.' ,-:.
~ 120b:-'~~~--~~~~~~~~~~~4
...filI
~
6
VLED - LED SUPPLY VOLTAGE - V
6.5
6
VlED - LED SUPPL Y VOLTAGE - V
Figure 7. LED supply current.s a function of
LED supply voltage.
Figure 8. Luminous intensity per LED (digit average)
as. function of LED supply voltage.
3.0,----r--_._.....---,r----r---...
.
V~-~5V
... t.lUM1:!!At.a.~.DP D1SP,",Y"ED
>
I
w
~
g
c
~
I
>~
Tc - CASE TEMPERATURE _ "C
TC - CASE TEMPERATURE -
"e
Figure 10. LED voltage derating as a function of
case temperature.
Figure 9. Maximum power derating .s a function of
case temperature.
4.0
.........
>
;;. "
!::
.
In
Z
W
;e
....
>
I
~
!l0
z
iii
:J
...w
g
1.0
"~
I
>
}
~
"...w
II:
0.4
0.3L-.-l.;;..--'-_....I.._..L~.!.-_1...;._..l.;;..-_'
-60
-40
TA - AMBIENT TEMPERATURE - DC
TC - CASE TEMPERATURE -'C
Figura 11. Relative luminous intensity as a function of case
temperature at fixed current level.
Figure 12. LED voltage derating as 8 function of ambient temperature,display soldered into P.C. board without heat sink.
112
Solid State PIus/Minus Sign 5082·7011
I.. --
Truth Table
For display applications requiring ± designation, the 50827011 solid state plus/minus sign is available. This display
module comes in the same package as the 5082-7010 numeric indicator and is completely compatible with it. Plus
or minus information can be indicated by supplying voltage
to one (minus sign) or two (plus sign) input leads. A third
lead is provided for the ground connection. Luminous intensity is controlled by changing the LED drive voltage.
Each LED has its own built-in 345n (nominal) current
limiting resistor. Therefore, no external current limiting
is required for voltages at 5.5V or lower. Like the numeric
indicator, the -7011 plus/minus sign is TTL/DTL compatible.
CHARACTER ,3
,-
' PIN
7
'+
H,
-
L
Blank
L
H
H
,i
'~4;t~'
VL = -0.5 to 1.0V
V H = 3.0 to 5.5V
Electrical/Optical Characteristics
Case Temperature, Tc = O°C to 70°C, unless otherwise specified
~
TVp}1
Max.
unI\\-'r,~1
VLEO =5.5V
lOS
150
1£-,'1\1'('
VLEO "'4.2V
70
100
VLEO =5.5V
0.6
0.9
VLEO =4.2V
0.3
0.6
Test Conditions
Iv [21
Vl.ED =5.5V
60
115 ,
VLEO "'4.2V
40
80
''fuA'
"'~
W
j.lcd
50
VLEO =3.5V
Peak Wavelength
655
nm
Spectral Halfwidth
30
nm
Weight
4.9
gram
Notes:
F"'--,
Min.
iili,C,;
1. All typical values at TC = 25°C
2. AtTC=25°C
L/
Absolute Maximum Ratings
l>esCfiption
~
Symbol
Min.
Max.
TS
-65
+100
"c
Tc
-55
+95
"c
-0.5
5.5
V
Max.
Unit
1.0
V
5.5
V
Storage Temperature, Ambient
Operating Temperature, Case
Plus, Plus/Minus Input
Potential to Ground
VLEO
Unit
Recommended Operating Conditions
Symbol
Min.
Nom.
LED Supply Voltage,
Display Off
VLEO
-0.5
0
LED Supply Voltage,
Display On
VLEO
3.0
Description
I
4.2
113
Applications
ing the display on an appropriate heat sink or metal core·
printed circuit board. Thermal conducting compound such
as Wakefield 120 or Dow Corning 340 can be used between
display and heat sink. See figure 10 for VLED derating vs.
display case temperature.
Decimal Point Limiting Resistor
The decimal point of the 5082-7010 display requires an external current limiting resistor, between pin 2 and ground.
Recommended resistor value is 220n, 1/4 watt.
Mounting
Operation Without Heat Sink
The 5082-7010 and 5082-7011 displays are packaged with
two rows of 4 contact pins each in a DIP configuration
with a row center line spacing of 0.890 inches.
Normal mounting is directly onto a printed circuit board.
If desired, these displays may be socket mounted using
contact strip connectors such as Augat's 325-AGI or AMP
583773-1 or 583774-1.
Heat Sink Operation
Optimum display case operating temperature for the 50827010 and 7011 displays is Tc=OoC to 70°C as measured
on back surface. Maintaining the display case operating
temperature within this range may be achieved by mount-
These displays may also be operated without the use of a
heat sink. The thermal resistance from case to ambient
for these displays when soldered into a printed circuit
board is nominaliy (JCA =30oC/W. See figure 12 for V LED
derating vs. ambient temperature.
Cleaning
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning pro·
cessing (up to 2 minutes in vapors at boilingl or Freon/
alcohol mixtures formulated for room temperature cleaning.
Suggested solvents: Freon TF, Freon TE, Genesolv DI-15,
Genesolv DE-15.
114
TECHNICAL DATA APRIL 1977
Features
• PERFORMANCE GUARANTEED OVER
TEMPERATURE
• HERMETICITY GUARANTEED
• TXV SCREENING AVAILABLE
• GOLD PLATED LEADS
• HIGH TEMPERATURE STABILIZED
• NUMERIC
5082-7391 Right Hand D.P.
5082-7392 Left Hand D.P.
• HEXADECIMAL
5082-7395
• TTL COMPATIBLE
• DECODER/DRIVER WITH 5 BIT MEMORY
• 4 x 7 DOT MATRIX ARRAY
Shaped Character, Excellent Readability
• STANDARD DUAL-IN-LINE PACKAGE
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from
Unit to Unit within a Single Category
pattern, and four blanks in the invalid BCD states. The unit
employs a right-hand decimal point. Typical applications
include control systems, instrumentation, communication systems and transportation equipment.
The 5082-7392 is the same as the 5082-7391 except that
the decimal point is located on the left-hand side of the
digit.
Description
The HP 5082-7390 series solid state numeric and
hexadecimal indicators with on-board decoder/driver and
memory are hermetically tested 7.4mm (0.29 inch)
displays for use in military and aerospace applications.
The 5082-7395 hexadecimal indicator decodes positive
8421 logiC inputs into 16states, D-9and A-F. In place of the
decimal point an input is provided for blanking the display
(all LED's off), without lOSing the contents of the memory.
Applications include terminals and computer systems
using the base-16 character set.
The 5082-7391 numeric indicator decodes positive 8421
BCD logic inputs into characters 0-9, a " -" sign, a test
The 5082-7393 is a "±1." overrange display, including a
right hand decimal point.
package Dimensions
1--10.2MAX.j
j.-
(.400)
7395
PIN
1
..L.I-<.....,......
1
13.5
2
3
4
Lr-+"ro+r-rl
I
1
5:'1"
S
~('19)
SIDIT~IEW
1~~10'
LUMINOUS
INTENSITY
CATEGORY
DATE CODe
PIN 1 KEY
END VIEW
LL.
SEATING
PLANE
O.3±:O.08TVP.
(2;~1~ .fl ---l
(.17)
+
(.0121:.003)
I-
t
lat,*,
enable
6
GrQund
Ground
7
v~~
Vee
II
Inpull
Input 1
NOTES,
~~'8
SEATING
152
(.000)'
Laton
enablO
4.8
1
FUNCTION
5082·7395
5082·7391
HEXA·
AN07392
NUMERIC
OECIMAl
Input 2
"'put 2
Input 4
Input 4
fnputS
InpuIS
Blanking
Decimal
control
PQiilt
PLANE
~
(.15)
~
13TYP]~' Q~,
(.050)
(.Os)
15
. -1~f
11_
I
--j
I
3.4
0.5 '0.08
(.10 ±.OO5)
115
TVP.
(.020 ±.003)
2.5 ±O.13 TYP,
1. Dimensions in mitlimetres and !inches!'
2. Unless otherwise specified, the tolerance
on all dimensions is ±.38mm (±.015")
3. Digit center line is ±.25mm (±.01")
from package center line.
4. Lead material is gold plated copper
alloy.
Absolute Maximum Ratings
Description
Symbol
Min.
Max.
Unit
Ts
-65
+125
·C
TA
-55
-0.5
+100
·C
+7.0
+7.0
V
Storage temperature, ambient
Operating temperature, ambient
I!'~l
Supply voltage 131
Voltage applied to input logic, dp and enable pins
Voltage applied to blanking input PI
Vee
VI,VDP,V E
-0.5
VB
-0.5
Maximum solder temperature at 1.59mr,1 (.062 inch)
below seating plane; t .;;; 5 seconds
V
Vee
V
260
·C
Recommended Operating Conditions
Description
Symbol
Supply Voltage
Operating temperature. ambient (1,2)
Enable Pulse Width
Time data must be held before positive transition
of enable line
Min.
Enable pulse rise time
hUl
(TA = -55·C to +100·C. unless otherwise specified)
Max.
Unit
112
170
mA
5 and dp lighted)
560
935
mW
I,
Vce=5.0V. T A=25· C
VIL
Vm
Enable low-voltage; data being
entered
Enable high-voltage; data not
being entered
VEil
Blanking lOW-VOltage; display
not blanked (7)
VBL
Blanking high-voltage; display
blanked (71
VBH
VEL
Test Conditions
Enable low-level input current
In
Vcc=5.5V, VEL=O.4V
V
V
I·
3.5
ItL
1m
(SI .
0.8
0.8
Logic high-level input current
V
V
2.0
Vcc=5.5V. VBII=4.5V
IEH
JLcd
85
Vcc=4.5V
Vcc=S.SV, VBL=0.8V
Enable high-level input current
40
2.0
IBH
Peak wavelength
Dominant Wavelength
Min.
0.8
IBt
Logic low-level input current
nsee
Typ. (4)
Logic high-level input voltage
(1)
200
Vcc=5.5V (Numeral
Logic low-level input voltage
(7)
nsee
.--
Icc
PT
Symbol
Blanking high-level input current
·C
nsec
50
Blanking low-level input current
V
+100
nsec
tHOLD
Power dissipation
Luminous intensity per LeO
(Digit average) (5,6)
Unit
100
50
Description
5.5
tw
tSETLP
Supply Current
Max.
5.0
TA
Time data must be held after positive transition
of enable line
Electrical/Optical Characteristics
Nom.
4.5
-55
Vee
V
V
SO
1.0
JLA
mA
Vcc=5.5V. VII;O.4V
-1.6
mA
Vcc=5.5V, V1H=2.4V
+100
-1.6
JLA
mA
+130
JLA
nm
Vcc=5.5V. VEII =2.4V
APEAK
TA=25"C
Ad
TA=25·C
). 655
640
nm
gm
1.0
Weight
5x10-7
Leak Rate
cc/sec
Notes: 1. Nominal thermal resistance of a display mounted in a socket which is soldered into a printed circuit board: EiJA=5(1'CIW;
0 J c=15° CIW. 2. 0eA of a mounted display shou Id not exceed 35° CIW for operation up to T A=+10(1' C. 3. Voltage values are with respectto
device ground, pin 6. 4. All typical values at Vcc=5.0 Volts, T A=25° C. 5. These displays are categorized for luminous intensity with the intensity category designated by a letter located ()n the back of the display contiguous with the Hewlett-Packard logo marking. 6. The
luminous intensity at a specific ambient temperature, Iv(TA), may be calculated from this relationship: Iv(TA)=lv(,,oq(.985) [TA-25°C]
7. Applies only to 7395. 8. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
116
t sETUP'-f4--__fo---I-lttOLD
DATA INPUT
(LOW LEVEL DATA)
DATAtNPUT
(HIGH LEVEL DATA)
Figure 1. Timing Diagram of 5082-7390
Series logic.
Pin.
Vee
";~
ENABLE
LOGIC
INPUT
DpI21
',MATRIX '
'~
-,,'
BLANKING I31
CONTROL
4_
GROUND
Figure 2. Block Diagram of 5082-7390
Series Logic.
Notes:
1. H =Logic High; L =Logic Low. With the enable input at logic high
changes in BCD input logic levels have no effect upon display
memory or displayed character.
2. The decimal point input, DP, pertains only to the 5082-7391 and
5082-7392 displays.
3. The blanking control input. B, pertains only to the 5082-7395
hexadecimal display. Blanking input has no effect upon display
memory.
1I
.
Z
W
II:
II:
...::>w
'"z
...
';;;z"
w
:c
~
.~
I
w
I
.!P
VB - BLANKING WLTAGE - V
Figure 3. Typical Blanking Control
Current VB. Voltage for 50827395.
TA -AMBIENTTEMPERATURE-OC
Figure 4. Typical Blanking Control
Input Current VB. Ambient
Temperature for 5082-7395.
117
Ve - LATCH ENABLE VOLTAGE - V
Figure 5. Typical Latch Enable Input
Current VB. Voltage.
1.0
-1.8
L
I
TC ·26"C._
-1.8
1I -1.4
!2
~
II:
is'
--
Vcc=5.oV
-'.2
!I
I
~
_. 6
4··
I
-. ...........
r- r- -
-....
"~ vo-
00
I
I
V
1.0
I
/
uET \.
0.5
I
I
P
2
I
Vcc "5.OV
VIH ""2.4V
Vcc '5Jl\I
Vu. ""O.8V
-1.0
9 -,at\-....
I
~
../
2.0
3.0
4.0
6.0
o
-56 -40
VIN - LOGIC VOLTAGE - V
FIgure 6. Typical Logic and Decimal
Point Input Current v••
Voltage.
-20
0
20
40
60
80
100
TA -AMBIENT TEMPERATURE _DC
FIgure 7. Typical logic and Enable
Low Input Current ys.
Ambient Tempereture.
o
~
-56 -40
-20
0
20
40
60
80
TA -AMBIENT TEMPERATURE _DC
100
Figure 8. Typical Logic and Enable
High Input Current ys.
Ambient Temperature.
operational Considerations
These displays may be mounted by soldering directly to a
printed circuit board or inserted into a socket. The leadto-lead pin spacing is 2.54mm (0.100 inch) and the lead
row spacing is 15.24mm (0.600 inch). These displays may
be end stacked with 2.54mm (0.100 inch) spacing between
outside pins of adjacent displays. Sockets such as Augat
324-AG20 (3 digits) or Augat 508-AG80 (one digit, right
angle mounting) may be used.
ELECTRICAL
The 5082-7390 series devices use a modified 4 x 7 dot
matrix of light emitting diodes (LED's) to display
decimal/hexadecimal numeric information. The LED's are
driven by constant current drivers. BCD information is
accepted by the display memory when the enable line is at
logic low and the data is latched when the enable is at
logic high. To avoid the latching of erroneous information,
the enable puls!'l rise time should not exceed 200
nanoseconds. Using the enable pulse width and data
setup and hold times listed in the Recommended
Operating Conditions allows data to be clocked into an
array of displays at a 6.7MHz rate.
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +100"C, it is important to
maintain a case-to-ambient thermal resistance of less
than 35° C/watt as measured on top of display pin 3.
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv 01-15, Genesolv OE-15.
The blanking control input on the 5082-7395 display
blanks (turns off) the displayed hexadecimal information
without disturbing the contents of display memory. The
display is blanked at a minimum threshold level of 3.5
volts. This may be easily achieved by using an open
collector TTL gate and a pull-up resistor. For example,
(1/6) 7416 hexinverter buffer/driver and a 120 ohm pull-up
resistor will provide sufficient drive to blank eight
displays. The size of the blanking pull-up resistor may be
calculated from the following formula, where N is the
number of digits:
Rbl~k
PRECONDITIONING
5082-7390 series displays are 100% preconditioned by 24
hour storage at 125°C.
CONTRAST ENHANCEMENT
= (Vee - 3.5V)/[N (1.0mA)]
The 5082-7390 displays have been designed to provide the
maximum posible ON/OFF contrast when placed behind
an appropriate contrast enhancement filter. Some
suggested filters are Panelgraphic Ruby Red 60 and Dark
Red 63, SGL Homalite H10D-1605, 3M Light Control Film
and Polaroid HRCP Red Circular Polarizing Filter. For
further information see Hewlett-Packard Application Note
964.
The decimal point input is active low true and this data is
latched into the display memory in the same fashion as isthe BCD data. The decimal point LED is driven by the onboard IC.
MECHANICAL
5082-7390 series displays are hermetically tested for use
in environments which require a high reliability device.
These displays are designed and tested to meet a helium
leak rate of 5 x 10-7 cc/sec and a standard dye penetrant
gross leak test.
118
High Reliability Test Program
Hewlett-Packard provides standard high reliability test programs, patterned
after MIL-M-38510 in order to facilitate the use of HP products in military
programs.
HP offers two levels of high reliability testing:
The TXV prefix identifies a part which has been preconditioned and
screened per Table 1.
The TXVB prefix identifies a part which has been preconditioned and
screened per Table 1, and comes from a lot which has been subjectedtothe
Group B tests described in Table 2.
PART NUMBER SYSTEM
WRhTXV
Standard
Product
$c_lng
_eenlng
Plut. Gt-oup 8
SOa2-n91
TXV-7!391
TXVI!"7391
S081H392
TXV.1392;
TXVa-7392
5082-7395
TXV-7395·
TXVB-7395
WJtti TXV
Table 1. TXV Preconditioning and Screening -100%.
MIL-STO·883
Methods
Examination or Test. ... ..
1. Internal Visual Inspection
2.
3.
4.
5.
6.
7.
8.
9.
Condition.
HP Prooedure
72-0352
Electrical Test: lv, Icc, laL. laH. IEL, IEH, I,L, IrH.
High Temperature Storage
Temperature Cycling
Acceleration
Helium Leak Test
Gross Leak Test
..
Electrical Test: Same as Step 2
Burn-in
10. Electrical Test as in Step 2
11. Sample Electrical Test Over Temperature:
1""IBl" 10H' In, iBH, he, liB
12. External Visual
Per Electrical/Optical Characterstics.
125"C, 168 hours.
--65°C to +125°C, 10 cycles.
2,000 G, V, orientation.
Condition A, limit pressure to 25psi for 1 hour.
Condition D. 40psi for 1 hour.
1008
1010
2001
1014
1014
23.,
TA=100"C, t=168 hours, at Vcc=S.OV and cycling through
logic at 1 character per sec.
1015
Per Electrical CharacteristiCS, T,,-55°C. +100"C, LTPD=7
2009
.
Table 2. Group B.
Examination or Test
Subgroup 1
Physical Dimensions
Subgroup 2
SolderabiHty
Temperature Cycling
Thermal$hock
Hermetic Seal
MOisture Res.istance
End Points: Electrical Test
Subgroup 3
ShOck - Non-operating
Vibration Variable Frequency
Constant Acceleration
End Points: Electrical Test
Subgroup 4
Terminal Strength
End Points: Hermetic Seal
Subgroup 5
Salt Atmosphere
Subgroup 6
High Temperature Life
End Points: Electrical Test
Subgroup 7
Steady State Operating Life
End Points: Electrical Test
MI1.·STD·883
Condition
Method
l.TPD
20
2008
Package Dimensions per Product Outline Drawing.
2003
1010
1011
1014
Immersion within 0.062" of seating plane 260" C, t=5 sec., omit aging.
10 cycles --65°C to +125°C
Test Condition A
Condition A, limit pressure to 25psi for 1 hour, and Condition 0,
40psi for 1 hour.
Omit Inillal conditioning.
Same as Step 2, Table 1.
15
1004
Xl, Y], Yz.
2002
2007
2001
1500 G, t=O.5ms, 5 blows in each orientation
Non-operating.
2,000 G, Y I orientation.
Same as Step 2, Table 1.
2004
1014
Test Condition B2.
Condition A, limit pressure to 25psi for 1 hour, and Condition 0,
40psi for 1 hour.
1009
Test Condition A
'1008
TA:125°C, non-operating, 1=1000 hours.
Same as Step 2, Table 1.
1005
TA =lOQ"C, 1=1000 hours, at Vcc=S.OV and cycling through logic at
1 character per second,
Same as Step 2, Table 1,
15
15
15
),,;"7
1>..=5
119
SOlid state Over Range Character
For display applications requiring a ±, 1, or decimal point designation, the 5082-7393 over range character is avaiiable.This
display module comes in the same package as the 5082-7390 series numeric indicator and is completely compatible with it.
Package Dimensions
Figure 9. TVPical Driving Circuit.
TRUTH TABLE
,', - :~MCTeR
'"
;
;,
"
M)T~
Plus
;-,
",,',
\
" ""
','
"
,,·t..~tNMf~A.NI)tlNCMES).
_
"
3
',". , a=~~~7~7;»:
8
",~ ,
./ .:
"
Hum•• IOn.
Nu~1 On.
...
-"
Jot
",;,
::''1',''" '
Deeiql Point'
~:::
JltN
'1, '.'
''.''''
, ',8Ienk ,
'L
X
-,X';'
",L,
"
2.3
X
X
4
X:
X
H
X
L
X
H
L
It
H
H
X
X
L
NOTES: L: Line switching transistor in Figure 9 cutoff.
H: Line switching transistor in Figure 9 saturated.
X: 'Don't care'
Vee
MinuS/t"lus
Electrical/Optical Characteristics
5082-7393 (TA = -55°e to +100o e, Unless Otherwise Specified)
,':DiSCIUPTION','S~ ,:TESTCONOIi1ONS
,MIN
"TVPMAX
UNIT
v
nrn
nm
Recommended Operating
COnditions
:'.',:"',":,:",<'
a
:V i'4.5s.0
CU!'11II1t.eecII, LEO ' ,1,,:
:,5.6
S.O "0
...
':, ~ :: 'DESCRIPTION'
, Storage tempel'etUre, ambient
'svM8OL MIN NOM MAX UNIT
L£c._iv'~ol""'-:
f~rd
Absolute Maximum Ratings
'SYMBOL MIN. MAX. UNIT
+125
°c
TS
-55 +100
TA
Operating ~'"' ainbient
10 ' mA
FOrWerd CUrI'flnt, .ch LED , '
IF
::V'
rnA,
NOTE:
LED current must be externallv limited. Refer to Figure 9
for recommended resistor values.
',"Mr" IlOttase;'eactl J.ED
120
VR
·c
.
V
FOUR CHARACTER.·
HEWLETT
. ..,SOLID-STATE' .
'PACKAB.D.·
ALPHANUMERIC'
EAK
Min;
Test Conditions
Vee = 5.25V
VnocR = VDMA = 2.4V
All SR Stages =
Logical 1
Vee = VB '" VeOL - 5.25V
All SR Stages = Logical 1
Vee - VB = 5.0V, Veo! - 3.5V
T, = 250C 141
Vee'" VB '" VeOL
'm
1m
Vee = 5.25V.VIH= 2.4V,
hl
VOH
VOl.
= 4.7SV
.
Unit.
44
55
rnA
":0.3
1.0
10.
350
lDS
90
-1.0 .
30
40
435
200.
,.
2.4
20
10
-0.5
-0.25
3.4
0.2
mA
rnA
mA
p.A
mA
p.cd
2.0
Vee';' S.2SV, VII. =OAV
Vee 'C 4.7SV. 10M"" -O.smA. VWl = OV
Vee = 4.7SV, 10l '" 1.6mA, Vwc.'" OV
Vee'" VB - S.25V, Veol. = 3.0V
15 LEOs on per character
Max.
70
VB'" 5,25V
Vee - VeO!+ = 5.25V, VB. =o..4V
All SR Stages = Logical .1
VlH
VIL
III
VII =OV
Typ.'
0.8
80
40
-1.90
-0.95
.0.6
V
V
p.A
p.A
mA
rnA
V
V
0.73
W
ApEAK
655
nm
Ad
639
nm
PD
= 5.0V and TA = 25°C
unless otherwise noted.
1. Maximum absolute dissipation is with the device in a socket having a thermal resistance from pins to ambient of 35°C/watt.
2. The device should be derated linearly above 25°C at 16mWf'C (see Electrical Description on page 3).
3. The characters are categorized for Luminous IntenSity with the intenSity category designated by a letter code on the bottom of the
package.
4. Ti refers to the initial case temperature of the device immediately prior to the light measurement.
5. Domi'1ant wavelength Ad, is derived from the CIE chromaticity diagram, and represents the single wavelength which defines the color
of the device.
6. Maximum allowable dissipation is derived from Vee = VB = VeOL = 5.25 Volts, 20 LEOs on per character.
122
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-15, Genesolv DE-15.
Electrical Description
The HDSP-2000 four character alphanumeric display has
been designed to allow the user maximum flexibility in
interface electronics design. Each four character display
module features Data In and Data Out terminals arrayed
for easy PC board interconnection such that display
strings of up to 80 digits may be driven from a single
character generator. Data Out represents the output of the
7th bit of digit number 4 shift register. Shift register
clocking occurs on the high to low transition of the Clock
input. The like columns of each character in a display
cluster are tied to a single pin. Figure 5 is the block
diagram for the HDSP-2000. High true data in the shift
register enables the output current mirror driver stage
associated with each row of LEDs in the 5x7 diode array.
Figure 1. Switching Characteristics. (Vee = 5V,
TA = -20°C to +70° C)
Mechanical and
Thermal Considerations
The reference current for the current mirror is generated
from the output voltage of the VB input buffer applied
across the resistor R. The TTL compatible VB input may
either be tied to Vee for maximum display intensity or pulse
width modulated to achieve intensity control and
reduction in power consumption.
The HDSP-2000 is available in a standard 121ead ceramicglass dual in-line package. It is designed for plugging into
DIP sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character
arrays of any desired size.
The normal mode of operation is depicted in the block
diagram of Figure 6. In this circuit, binary input data for
digit 4, column 1 is decoded by the 71ine output ROM and
then loaded into the 7 on board shift register locations 1
through 7 through a parallel-in-serial-out shift register.
Column 1 data fordigits3, 2and 1 is similarly decoded and
shifted into the display shift register locations. The
column 1 input is now enabled for an appropriate period of
time, T. A similar process is repeated for columns 2, 3, 4
and 5. If the time necessary to decode and load data into
the shift register is t, then with 5 columns, each column of
the display is operating at a duty factor of:
The -2000 can be operated over a wide range of
temperature and supply voltages. Full power operation at
. TA = 25°C (Vee = VB = VeoL = 5.25V) is possible by
providing a total thermal resistance from the seating plane
of the pins to ambient of 35°C/W/cluster maximum. For
operation above TA = 25°C, the maximum device
dissipation should be derated above 25°C at 16mWfOC
(see Figure 2). Power derating can be achieved by either
decreasing VeoL or decreasing the average drive current
through pulse width modulation of VB.
The -2000 display has an integral contrast enhancement
filter in the glass lens. Additional front panel contrast
filters may by desirable in most actual display applications. Some suggested filters are Panelgraphic Ruby Red
60, SGL Homalite H100-1605 and Plexiglass 2423.
Hewlett-Packard Application Note 964 treats this subject
in greater detail.
T
D.F. = 5(t+T)
The time frame, t + T, allotted to each column of the
display is generally chosen to provide the maximum duty
factor consistent with the minimum refresh rate necessary
.,
2.0
2.0
i
OJ'"
~
::j
"-
1.5
I
ffi
~ 1.5
f' 1\
'3
~
~
"'"
I
1.0
w
"
>
.,'
>=
~ 0.5
0.5
a:
~
'.>
~Q
,
f'
,
",
-20
+20
+40
+60
+80
+100
TA - AMBIENT TEMPERATURE - °C
Figure 2. Maximum Allowable Power
Dlsllipatlon vs. Temperature.
-20
+20
+40
+60
.
+80
+100
TA - AMBIENT TEMPERATURE - °C
Figure 3. Relative Luminous Intensity
vs. Temperature.
123
veOl - COLUMN VOL lAGE - V
Figure 4. Peak Column Current
VS. Column Voltage.
to achieve a flicker free display. For most strobed display
systems, each column of the display should be refreshed
(turned on) at a minimum rate of 100 times per second.
If the device is operated at 1.5 MHz clock rate maximum, it
is possible to maintain t.,,; T. For short display strings, the
duty factor will then approach 20%. For longer display
strings operation at column duty factors of less than 10%
will still provide adequate display intensity in most
applications. For further applications information, refer to
HP Application Note 966.
With 5 columns to be addressed, this refresh rate then
gives a value for the time t + T of:
1/[5
x
(100)] = 2 msec.
-
_ _DATA
'N
v,
GNO
_CLOCK
-
-
-.
COL 1
C OL2
-
-
C OLl
DATA
OUT _
C OL4
-
e OlS
Figure 5. Block Diagram of the HDSP·2000.
INTERNAL
CONNECTION
(DO NOT CONNECT)
I
1lf1
IN
R(SET IN
CLOCK iN
"'.;
1/NCOUNTER
CLOCK N '" No. OF DIGITS
OfSPLAY
IN
OUT
m
J.
r
CLOCK IN
START DISPLAy l"iME 1Tl
our
stRING
COUNTER
OV+
COL.UMN SElECT
CLK~
IIII
0---
;;::=
o-fir-L-
ASCII
DATA
IN
I
ftEFRESH
MEMORy
0---
,
~
.
~
r+
"
I
,ClOCK IN
"HUT
COUNTER
+5
OUTPUTS
IN
J III II
ASCII DATA IN
~~~tCOUjMN
J
,ARALlEL IN
SEFtIAlOUT
SHtfT
REGISTER
DATA
OUT
COLUMN
. 7·LIN£:
SELECT
{COLUMN)
DATA IN
CHARACTER GENERATOR
Q
I
oATA
CLOCK IN
I
CDLVMNTOENABLE
TRANSISTORS
I
DATA
OUT
liN
COLUMN SELECT INPUTS
I
I
I
I
I
Figure 6. Block Diagram of a Basic Display System.
124
INPUTS
E~
1!5- DECODER ENABLE
HEWLETT
LED SOLID STATE
. PACKARD
5082-1100
ALPHANUMERIC·
.
COMPONENTS
5OB2-71Dl
608Zal02
.>INDICATOR
TECHNICAL DATA
APRIL 1977
Features
• 5
x 7 LED MATRIX CHARACTER
Human Factors Engineered
• BRIGHTNESS CONTROLLABLE
• IC COMPATIBLE
• SMALL SIZE
Standard 1S.24mm (.600 inch) Dual In-Line
Package; 6.9mm (.27 inch) Character Height
• WIDE VIEWING ANGLE
• RUGGED, SHOCK RESISTANT
Hermetically Sealed
Designed to Meet MIL Standards
• LONG OPERATING LIFE
Description
The Hewlett-Packard 5082-7100 Series is an x-v addressable, 5 x 7 LED Matrix capable of displaying the
full alphanumeric character set. This alphanumeric indicator series is available in 3, 4, or 5 character endstackable clusters. The clusters permit compact presentation of information, ease of character alignment,
minimum number of interconnections, and compatibility with multiplexing driving schemes.
Alphanumeric applications include computer terminals, calculators, military equipment and space flight
readouts.
The 5082-7100 is a three character cluster.
The 5082-7101 is a four character cluster.
The 5082-7102 is a five character cluster.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Peak Forward Current Per LED
(Duration <: 1 ms)
IpEAK
100
mA
Average Current Per LED
IAVG
10
mA
Power Dissipation Per
Character 'All diodes lit) (1]
Po
700
mW
Operating Temperature. Case
Tc
-55
95
°c
Storage Temperature
Ts
-55
100
°c
Reverse Voltage Per LED
VR
4
V
Note 1: At 25°C Case Temperature; derate B.5mW/oC above 25°C.
125
Electrical/Optical Characteristics at Tc=2SoC
Unit,
.P~(4Iriinous.lntensityper U~D'
(Charal:teI" Average) @ Pulse
~of 100mA/LED"
":~ak Forward Voltage@.Pulse
Current of5OrnAiLED
.
.fleal< Wavelength'
Rise and Fall Time$J1
Note 1. Time for a 10% - 90% change of light intensity for step change in current.
VF - FORWARD VOLTAGE - V
Figure 1.
TC - CASE TEMPERATURE _
Figure 2.
Forward Current-Voltage Characteristic.
°c
Relative Luminous Intensity vs. Case
Temperature at Fixed Current Level.
200
150
100 ~-___t--+-+----:---+---c80~_~~+-'+---~'-r~~~~--+-~-;
60
40 ~-"---r-+-+--
AVERAGE CURRENT PER LED - rnA
Figure 3.
PEAK CURRENT PER LED - rnA
Figure 4.
Typical Time Average Luminous
Intensity per LED vs. Average
Current per LED.
126
Typical Relative Luminous Efficiency vs.
Peak Current per LED.
i
Package Dimensions and Pin Configurations
....
Device Pin Description
A
.:II' '.:II' r.:ll' 'JI 'JI
C
JiI.:II' .:II'JI 'JI
o
5082·7100n101n102
Schematic Wiring Diagram
-* ~'~ '11
JI '-*' r.:ll' rJl '.Jf
.Jf '-*' r-* r~ '~
.:II' ':JII r..,.c '.Jf':It'
:It' ' :JII r:It' r:It' '~
.tf.
G i-CHARACTER 1+CHARACTER 2+CHARACTER 3+CHARACTER 4+CHARACTER 5.j
127
operating Considerations
ELECTRICAL
The 5 x 7 matrix of LED's, which make up each character, are X-V addressable. This allows for a
simple addressing, decoding and driving scheme between the display module and customer furnished
logic.
There are three main advantages to the use of this type of X-V addressable array:
1. It is an elementary addressing scheme and provides the least number of interconnection pins for the
number of diodes addressed. Thus, it offers maximum flexibility toward integrating the display into
particular applications.
2. This method of addressing offers the advantage of sharing the Read-Only-Memory character generator
among several display elements. One character generating ROM can be shared over 25 or more 5 x 7
dot matrix characters with substantial cost savings.
3. In many cases equipments will already have a portion of the required decoder/driver (timing and clock
circuitry plus buffer storage) logic circuitry available for the display.
To form alphanumeric characters a method called "scanning" or "strobing" is used. Information is
addressed to the display by selecting one row of diodes at a time, energizing the appropriate diodes in
that row and then proceeding to the next row. After all rows have been excited one at a time, the
process is repeated. By scanning through all rows at least 100 times a second, a flicker free character
can be produced. When information moves sequentially from row to row of the display (top to bottom)
this is row scanning, as illustrated in Figure 5. Information can also be moved from column to column
(left to right across the display) in a column scanning mode. For most applications (5 or more characters to share the same ROM) it is more economical to use row scanning.
A much more detailed description of general scanning techniques along with specific circuit recommendations is contained in HP Application Note 931.
MECHANICAL/THERMAL MOUNTING
The solid state display typically operates with 200mW power dissipation per character. However, if the
operating conditions are such that the power dissipation exceeds the derated maximum allowable value,
the device should be heat sunk. The usual mounting technique combines mechanical support and thermal
heat sinking in a common structure. A metal strap or bar can be mounted behind the display using
silicone grease to insure good thermal control. A well-designed heat sink can limit the case temperature
to within 1DoC of ambient.
MASTER
CLOCK
TIMING
CIRCUITRY
I
I
REAO ONLY
MEMORY
.1.
5
~=
l ...,..,........
1
J
......
[~~RO~W~~~~~~~~~~~LE~D~III
DRIVERS
DISPLAY
Figure 5.
I 2
I
L.,-,,.,.,.......
.
DISPLAY
LED
l
====
_
__
-_
-
~
3
I J'
.
DISPLAY
LED
II
I
~~~~~--~
Row Scanning Block Diagram.
128
1
I
-.. r-L-L..I..I..I'-t
4
DISPLAY
LED
J .. 1
II
I
~--~
5
I
LED
DISPLAY
~--~
HEW~~SPACK!RD . ·IVIONdLITf"UC LED' CHIPS
.
.
~
..
.COMPONENTS .. ,."
.
.5082·18Qt;;o
SERtES
,':',,:,
"
..... ,-TECHNICAL DATA
APRIL 1977
Features
• FOUR CHARACTER SIZES, COMMON
CATHODE
53 mil, 80 mil, 100 mil, 120 mil.
• DISCRETE AND MONOLITHIC COLON
CHIPS
• AVERAGE LUMINOUS INTENSITY AND
DISTRIBUTION SPECIFIED FOR EACH
WAFER
• 100% ELECTRICALLY TESTED AND
VISUALLY INSPECTED
• LOW POWER
MOS Compatible
;·M, :.
W
• CONTINUOUS SEGMENTS
Excellent Aesthetic Appearance
Description
packaging
The HP 5082-7800 series are common cathode monolithic
chips, specifically designed for hybrid applications. Chips
are available in seven segment, nine segment and one digit
fonts. Colons are available in discrete or monolithic form.
All chips are made of GaAsP material and are suitable for
die attach and wire bonding to appropriate substrates.
Chips are 100% visually inspected to HP standard criteria.
Hewlett Packard offers chips packaged on vinyl film or in
waffle packages.
Device Selection Guide
,;,
Character Hetgbt
Font
1.35 mm (53 mil)
7 aegrilent..
2.03 mm (80 mil)
• 7segment
TIlt
Antle
Stroke
WIdth
Minimum BondIng
..
c··
~,
FIlm
Chlpsize .
Deg....
111m (mil)
Pad SIze
PIN 5082-
Waffle Pack
PIN 5082-
1.50 x 1.35 mm
(5h:53mlll"
6
0.064 (3.3)
0.15 x 0.18 mm
(ax 7 mil)
7811
7821
(Typical)
. 0.15 x 0.18 mm
(6x 7 mil)
7$32
7842
'0.18 x 0.23 mm '
(7x9mll)
7651
7861
2.24 x lA2mm
5
(88 x 56 mil)
(Typical)
0.127 (5)
VInyl
2.54 mm (100 mil)
7 segment ,
2.72x 1.91
(107 x 75mllj
mm
5
' 0.114 (4.5)
2.54.mm (100 mil)
9
segment
2.72 x 1.91 mm
(107 x 75 mil)
5
0.114 (4.5)
0.18 x 0.23 mm
(7x 9 mil)
7652
7862
2.54 mm (100 mil)
1 or colon
2.72 x Q.89 mm
. (107 x 35 mil)
5'
0.114 (4.5) ,
0.18 x 0.23 mm
7853
7863
5
0.20 x 0.30 mm
(8 x 12 mil)
7871
7881
0.12 mm (4.8 mil)
diameter
7890'
7892"
3,05 mm (120 mil)
7 segment
'3.25 x 2.34 mm .
(12& x 92 mil)
0.28 mm{01.1mll)
deCimal point
.or colon,
O.38'x 0.38 mm
(15 x 15 njll)
square
(7)( 9 mil)
0.1.02 (4)
-
-
'Standard packaging Is a vial (PIN 5082-7893).
129
Device Dimensions
-
.L __ ( 2 9 )~
-
r,,,!~'!,~
'~ '1
r--(60)-~r5'
1.52
6' (TYPICAL)
1----0.73
rr
----.-. - -
I
I
:
i
-~
. I:
n-qun i "'"
l:~-:
"m
I----:~----I
!----- (75)--------1
5082-7832142
5082-7811/21
5082-7851/61, 5082-7852162
I•
I
rr-----------;
i
L
".f"·
I
I
(15)
I
(11)
!~,
_
_J
EMITTING
AREA
5082-7890/93
5082-7871/81
5082-7853/63
•
I
0.38
l
0.38
(15)
All dimensions are in millimeters and (mils).
Detailed drawings of each chip are available upon request.
Absolute Maximum Ratings
Storage Temperature Range
Reverse Voltage
(1) "
. • • • • • • • • • • • • • • • • • • • • . • • • . • • • • • . . • . • • • • • _ •••••.
-40°C to +125°C
5V
(1) • • • • • • • • • • • . • . • • • • • • • • . • • • • • • • • • • • • • • . • • • • • . • • • • . • • • • • . • . • • • . • • • . • • • • • • • • •.
Assembly Temperature (Duration :;;;5 min.) ..... _.......................................... 4200C
Operating Junction Temperature
.............. _.... '" ... , ............................... 125°C
Description
Peak Forward Current/Segment
(pulse duration :;;;500 psec.)
Average Forward Current/SejJment
Wire Bonder Force
3.05
1.35mm
(53 mil)
2.03mm
(80 mil)
2.54mm
. (100 mil)
50
100
25
. 25
5
5
6
6
125
125
125
125
(120 mil)'
O.28mM "'.
10
95
Electrical/Optical Characteristics at TA =25°C
Common Specifications for All Devices
IR, Reverse Current/Segment ................................................................................... 100 p.A max. atVR =5V
Peak Wavelength ..................................................................................................... 655 nm (typical)
Ad, Dominant Wavelength (I)
................................... : ............................................................
640 nm (typical)
0Jc, Chip Thermal Resistance (Junction to back contact)
11 mil and 53 mil ...................................................................................................... 85°C/W
80 mil, 100 mil and 120 mil ................................................................................._.... 45°C/W
130
. rnA
.
..
Note 1. Rating applies to chip only.
APEAK,
Units.
(11 mil)
·100
..
< .
rnA
: grn
Electrical/optical Characteristics at TA=25°C
5082-7811/21
1.35 mm (53 mil) Character Height
i....
". .....
.:segment Jl'lt~n!Sity.Ratio
'~i'!Y:;(Wttt'lih'<
Typ.
8S
Min.
60
...
• J;'
w>·
Min.
60
Description
Luminouslntensity/Segment (Digit
' Average)'"
.
$ym.bol ,
Fi9ure
2
•...
IF"" 10mA DC
;,'t
5082-7871/81
'>. tv..
Telli ' Conditions
IF = 10mA DC
2.54 mm (100 mil) Character Height
De$cripti
TA "z5'i,_
~
'"
Z
00
10
15
20
25
30
.8
.6
35
V F - PEAK FORWARD VOLTAGE - V
IF - PEAK FORWARD CURRENT - rnA
Figure 1. Peak Forward Current vs.
Peak Forward Voltage.
Figure 2. Relative Luminous Efficiency
(Luminous Intensity per Unit
Current) VS. Peak Current
per Segment.
.4
1--~'7S71/81
~
."
~
/I
ill
I-""
....-
.--
' 5O!I2·7B90/92/93
r--
!i'082·7861161.
·'TB631113
.j
r
TA
"
00
25'C ........,.
~r-
.2
56
10
15
20
25
30
35
Ip - PEAK FORWARD CURRENT - rnA
Figure 3. Relative Luminous Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current
per Segment.
strobing Considerations
Visual Inspection
The time average luminous intensity at TA = 25°C may be
calculated for any specific drive condition from the
following formula:
All chips are 100% visually inspected to HP specification.
A copy of the visual inspection specification is available
on request. Also available is a visual training manual.
JG,
Iv time avg = [-II",
DC spec
Where:
PEAK] Qv,peo]
Recommended Incoming
Inspection procedures
I", = average operating current
IDe ,peo = data sheet current at which Iv ,peo is measured
Iv 'PO< = data sheet luminous intensity at IDe 'pO<
711
Hewlett-Packard guarantees all visual parameters. Customers should perform incoming inspection to the same
levels. It is important that these chips be handled
carefully. Excessive or rough handling of chips can cause
scratched or broken units. All shipments must be
accepted or rejected on a lot basis. Samples should be
selected and tested for the visual specifications to the
recommended AQL level. Before a lot will be authorized
for return, the inspected units should be returned to
Hewlett-Packard for our verification. Returns cannot be
accepted after the entire lot has been removed from its
shipping container. Returns must be made in the original
shipping container.
PEAK = relative luminous efficiency at peak
operating current (See Figures 2 and 3).
The luminous intensity at any chip operating temperature
may be calculated using the following formula:
Iv (T A) = Iv (25°C) exp [(-0.0188rC)(T A-25°C)]
Assembly Information
The cathoae metallization (chip back contact) is a
gold/germanium alloy and the anode bonding pads are
aluminum. Conductive silver epoxy for die attach is
preferred. If eutectic die attach is used, gold/germanium
preforms are recommended. Gold wire of .025 mm (1 mil)
or .038 mm (1.5 mil) diameter should be used for lead
bonding. The .025 mm diameter wire is recommended for
the .28 mm (11 mil) decimal point die. The substrate
temperature should be in the range of 275-330°C and the
bonder capillary temperature should be set between
100°C and 350°C. Ultrasonic wire bonding may be used
also.
For more detailed assembly information, refer to HewlettPackard Application Bulletin No.8.
132
MONOLITHIC
lED CHIPS
L-
5082-7833/43
5082·7831/41
5082-7838/48
5082~7856/66
5082·1&72/82
TECHNICAL DATA
APRIL 1977
Features
• THREE CHARACTER SIZES, COMMON
CATHODE
80 mil, 88 mil, 120 mil
• MONOLITHIC DASH AND COLON CHIP
• AVERAGE LUMINOUS INTENSITY AND
DISTRIBUTION SPECIFIED FOR EACH
WAFER
• 100% ELECTRICALLY TESTED AND
VISUALLY INSPECTED
• LOW POWER
MOS Compatible
• CONTINUOUS SEGMENTS
Excellent Aesthetic Appearance
Description
packaging
The HP 5082-7800 series are common cathode monolithic
chips, specifically designed for hybrid applications. Chips
are available in seven segment, nine segment, "one" digit
and dash colon fonts.
Hewlett-Packard offers chips packaged on vinyl film or in
waffle packages.
All chips are made of GaAsP material and are suitable for
die attach and wire bonding to appropriate substrates.
Chips are 100% visually inspected to HP standard criteria.
Device Selection Guide
Stroke
Width
Minimum Bonding Vinyl.Film Waffle Pack
mm(mil)
Pad Size
PlN 5082- P/M 5082-
~.05 mm(1;'!O mil)
9 segment
3.25.x 2.34 mm
(128 x 92 mil)
5
133
0.18x.0.18mm
(7x7 mil)
7856
7866
0.15 x 0.18 mm
(6x7 mil)
7833
7843
O.or6 (3)
0.18 x 0.18 mm
(7 x 7 mil)
7837
7847
O.or6 (3)
0.18 x 0.18 mm
(7 x 7 mil)
7838
7848
0.102 (4)
0.20 x 0.30 mm
(8x12mil)
7872.
7882
Device Dimensions
~1.39_
1551
r-i
ri~1
.102
--141
F\F1
li'- -
2.24
~~~~
~~ !~.'.•, ! ~~f
1\
I·
I
__ II!:__ .
I-I~~I-I
-1----.
.
--T t?
L' rn'
...-'.27
1501
50
,t
.
II
I
1.7
1671
!
I~I
"
I
I
~r ....
!
I
I
> ",'
" .. "
•
"~,,,,.'
,0
;'
'
~-------
II
I
I
I
1
1.55
1611
I
11
3.3
11281
I
I
I- 1 5 7 1 - - - 1I
1.45
5082-7856/66
I-'---I~~---·I,
All dimensions are in millimeters and (mils).
5082-7872/82
Detailed drawings of each chip are available upon request.
Absolute Maximum Ratings
Storage Temperature Range lll ................................................. -400 C to +1250 C
Reverse Voltage ............................................................................ 5V
Assembly Temperature (Duration ~ 5 min.) ................................................ 4200 C
Operating Junction Temperature ......................................................... 1250 C
Note 1. Rating applies to chip only.
Electrical/Optical Characteristics at TA=25°C
Common Specifications for All Devices
IR, Reverse Current/Segment ............................................. 100 I'A max. atVR =5 V
Peak Wavelength ........................................................ 655 nm (typical)
Ad, Dominant Wavelength I I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . 640 nm (typical)
0JC, Chip Thermal Resistance (Junction to back contact) .................................. 450 C/W
iWEA,K,
134
I
I
....:_"'_--n-~
I .635_1
11251
5082-7838/48
5082-7837/47
5082-7833/43
I
I
Electrical/Optical Characteristics at TA =25°C
5082-7856/66
Dash - Colon Chip
5082-7833/43
.tv
5082-7837/47, -7838/48
•.... (1
Iii.. .tuminoti$Tnt9nSitY)\ior~IIIlia::' "",
0
c
a:
8
~
5082'7b~
~
I
/I
2
1
1.3
1.5
1.4
1.6
1.7
1.8
vF -PEAK FORWARD VOLTAGE -
.8
...w
.6
>
~
!~
r
1/
-~
1.2
1.0
~~
liE ::>$
:=~
+-2SOJ .
/J
1.4
~Q
508i711331q""""":""
5082·7837/47 :....-
I
I
4
15
U
itw
'l
6
a:
~
>
u
II
a:
.4
.2
00
1.9
V
56
10
15
20
25
30
35
Ip - PEAK FORWARD CURRENT - mA
Figure 1. Peak Forward Current vo. Peek Forward Voltage.
Figure 2. Relative Luminous Efficiency (Luminous Intensity per
Unit Current) vo. Peek Current per Segment.
strobing Considerations
Visual Inspection
The time average luminous intensity at T A = 25°C may be
calculated for any specific drive condition from the
following formula:
All chips are 100% visually inspected to HP specification.
A copy of the visual inspection specification is available
on request.
Iv time avg
=
[~J
IDe
[111 PEAK] [IV
spec]
Recommended Incoming
Inspection Procedures
spec
Where: lavg = average operating current
IDe
Iv
spec =
spec
data sheet current at which Iv
spec
is measured
= data sheet luminous intensity at IDe
Helwett-Packard guarantees all visual parameters. Customers should perform incoming inspection to the same
levels. It is importantthatthese chips be handled carefully.
Excessive or rough handling of chips can cause scratched
or broken units. All shipments must be accepted or
rejected on a lot basis. Samples should be selected and
tested for the visual specifications to the recommended
AQL level. Before a lot will be authorized for return, the
inspected units should be returned to Hewlett-Packard for
our verification. Returns cannot be accepted after the
entire lot has been removed from its shipping container.
spec
111 PEAK = relative luminous efficiency at peak
operating current (See Figures 1 and 2).
The luminous intensity at any chip operating temperature
may be calculated using the following formula:
Iv
= (Iv at 25°C)
exp [-0.D18f'C (TA - 25°C)]
Assembly Information
The cathode metallization (chip back content) is a
gold/germanium alloy and the anode bonding pads are
aluminum. Conductive silver epoxy for die attach is
preferred. If eutectic die attach is used, gold/germanium
preforms are recommended. Thermocompression or
ultrasonic bonding with gold wire as well as aluminum
ultrasonic bonding may be used with typical IC bonding
parameter setti ngs.
For more detailed assembly information, refer to HewlettPackard Applcation Bulletin NO.8.
136
,. .
...
Optocouplers
Selection Guide
..................
• High Speed Optocouplers
• Low Input Current/High Gain
Optocouplers
• High Reliability Optocouplers
137 .
138
High Speed Optocouplers
Current Specified
Input
Transfer
Ratio
Current
7% Min.
Input To
Output
Insulation
6N136
(5082·4351)
19% Min.
16mA
3000Vdc!3]
HCPL·2502
(5082·4352)
HCPL·2530
(5082·4354)
15·22%[2]
Description
Device
6N135
(5082·4350)
Transistor Output
~~~'.
~v.
ANOoE~¥
~
CATHODE
~
~VO
-
IIDGNo
-m"
CATHDDE1 2
7 V01
CATHODE2 3
#
6 V02
#
ANODE z 4
II
ANODE ~
CATHODE II
~
vee]]
3 ..lD; II v
.'
II
Vee
.~
II
-INi!
-E
~
1JVE
~~,~
[!
+INo{!
E
]] VOUT
GNo ]]
CATHODE[!
HCPL·2531
(5082·4355)
Page
No.
140
line Receiver, Analog
Circuits, TTL/CMOS,
TTl/LSTTl Ground
Isolation
1Mbit/s
16mA
3000Vdd3] 144
7% Min.
19%Min.
6N137
(5082·4360)
Optically Coupled
Logic Gate
line Receiver, High
Speed Logic Ground
Isolation
10M Bit/s 700% Typ. 5.0mA
3000Vdc[3] 148
HCPL·2601
(5082·4361 )
High Common Mode
Rejection, Optically
Coupled Logic Gate
line Receiver, High
Speed Logic Ground
Isolation In High
Ground or Induced
Noise Environments
10M bit/s 700% Typ
5.0mA
3000Vdd3] 152
HCPL·2602
Optically Coupled
Line Receiver
Replace Conventional
Line Receivers In High
Ground or Induced
Noise Environments
10M bit/s 700% Typ. 5.0mA
3000Vdc[3] 156
HCPL·2630
(5082·4364)
Dual Channel
Optically Coupled
Gate
line Receiver, High
Speed Logic Ground
Isolation
10M bit/s 700% Typ. 5.0mA
3000Vdd3] 162
Typical
Current Specified
Input
Data
Transfer
Rates
Ratio
Current
300k bit/s 300% Min. 1.6mA
Input To
Page
Output
No.
Insulation
3000Vdd 3] 166
!JVOUT
II
f!J
Vee
~VE
~VOUT
~iVl
I~ m
/3,'I>- Il
ANOOE,[j
Vee
CATHOoE,[J
IJV01
CATHOO" I]
~,I>- ]JV02
ANoo" [!
line Receiver, Analog
Circuits, TTL/CMOS,
TTL/LSTTL Ground
Isolation
Typical
Data
Rates
1Mbitls
5 GNO
Ii
ANODE[!
Dual Channel
Transistor Output
Application [1]
GNo
II
Low Input Current/High Gain Optocouplers
Description
Application[1]
6N138
(5082·4370)
Low Saturation
Voltage, High Gain
Output, Vcc=7VMax.
6N139
(5082·4371 )
Low Saturation
Voltage, High Gain
Output, Vcc=18V
Max.
Line Receiver, Low
Current Ground
Isolation, TTL/TTL,
LSTTL/TTL, CMOS/
TTL
line Receiver, Ultra
Low Current Gro und
Isolation, CMOS/LSTTl
CMOS/TTL, CMOS/
CMOS
HCPL·2730
Dual Channel, High
Gain, VcC=7V Max.
Dual Channel, High
Gain, Vcc=18V Max.
line Receiver, Polarity 300k bit/s 300% Min. 1.6mA
Sensing, Low Current
Ground Isolation
400%Min. 0.5mA
3000Vdd3]
170
4N45
Darlington 0 utput
Vcc=7V Max.
AC Isolation, Relay·
Logic Isolation
3000Vdcl3]
174
4N46
Darlington Output
Vcc=20V Max.
Device
~~ rt'"ur;~vcc
~
ANODE
CATHODE ~
v.
~ VO
H
~
~GNO
-""~~
2
7 V01
3
-""..
6V02
ANODE2 4
HCPL·2731
5 GND
-"~.
CATHODE 2
3
\\
400% Min.
3k bit/s
O.5mA
250% Min. 1.0mA
5 VO
4 GND
350% Min. 0.5mA
138
High Reliability Optocouplers
Device
...
"' "~"
ANODE,2
3
•
CATHODE2I1i
ANODEI:6
1
Vee
......
~-;.
OMJ
8
15
14 VOl
13
12 VOl:
11
10
,
Description
Dual Channel
6N134
Hermetically Sealed
(5082·4365) Optically Coupled
Logic Gate.
6N134 TXV TXV - Screened
TXVB - Screened
(TX·4365)
with Group B
Data
Application!1]
Typical
Date
Rates
Current
Transfer
Ratio
Specified
Input
Current
InpotTo
Dutput Page
No.
Insulation
Line Receiver,
Ground Isolation for
High Reliability
Systems
10M bitls 400% Typ.
10mA
1500Vdc
178
Line Receiver, Low
Power Ground
Isolation for High
Reliability Systems
300k bitls 300% Min.
0.5mA
1500Vdc
182
6N134 TXVB
(TXB·4365)
HCPL·2770
'~"
:~~~::
'r"Dto
~
s~~
4
6
;:...-0'
13
12
11
8_'
TXHCPL·
2770
Hermetically Sealed
Package Containing
4 Low Input Current,
High Gain Isolators
TXBHCPL·
2770
Notes: 1. For further information ask for Application Notes AN939, AN947, AN948, AN951·1 and AN951·2 (See pages 196-197).
2. The HCPL·2502 Current Transfer Ratio Specification is guaranteed to be 15% minimum and 22% maximum.
3. Recognized under the Component Recognition Program of Underwriters Laboratories Inc. (File No. E55361).
139
HEWLETT~PACKARD
COMPONENTS
HIGH SPEED
OPTICALLY
COUPLED
ISOLATORS
6Nti5 (5082 - 4350)
6N136 (5082 - 4351)
HCPL -2502 (5082- 4352)
TECHNICAL DATA APRIL 1977
SCHEMATIC
1
~
8
Vee
6"TYP.
1>_
t
2
ANODE
t
CATHODE
IN MllLIMETlI!!$ AND 'INCHes}
~
~""""'=---'¥
~i---
____
...J
10
6
Vo
3
5
GND
Features
Applications
• HIGH SPEED: 1 Mbit/s
• TTL COMPATIBLE
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF UNDERWRITERS
LABORATORIES, INC. (FILE NO. E55361)
• HIGH COMMON MODE TRANSIENT IMMUNITY:
1UOOV/IIs
• 3000Vdc INSULATION VOLTAGE
• 2 MHz BANDWIDTH
• OPEN COLLECTOR OUTPUT
•
Description
These diode-transistor optocouplers use a light emitting
diode and an integrated photon detector to provide3000V dc
electrical insulation between input and output. Separate
connection for the photodiode bias and output transistor
collector improve the speed up to a hundred times that of a
conventional photo-transistor isolator by reducing the basecollector capacitance.
The 6N135 is suitable for use in TTL/CMOS, TTL/L TTL or
wide bandwidth analog applications. Current transfer ratio
(CTR) for the 6N135 is 7% minimum at IF = 16 mAo
The 6N136 is suitable for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input
LED will provide enough output current for 1 TTL load and a
5.6 kO pull-up resistor. CTR of the 6N136 is 19% minimum at
IF = 16 mAo
The HCPL-2502 is suitable for use in applications where
matched or known CTR is desired. CTR is 15 to 22% at
IF = 16 mAo
•
•
•
•
Line Receivers - High common mode transient immunity
(>1 OOOV /Ils) and low input-output capacitance (0.6pF).
High Speed Logic Ground Isolation - TTLmL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL.
Replace Slow Phototransistor Isolators - Pins 2-7 of the
-4350 series conform to pins 1-6 of 6 pin phototransistor
isolators. Pin 8 can be tied to any available bias voltage of
1.5V to 15V for high speed operation.
Replace Pulse Transformers - Silve board space and weight.
Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.
Absolute Maximum Ratings'
Storage Temperature ............... _55°C to +125°C
Operating Temperature ............... -55°C to 100°C
Lead Solder Temperature .. . . . . . . . . . .
260·C for lOs
(1.6mm below seating plane)
Average Input Current - IF ..........". . . . .• 25mA[1]
Peak Input Current - IF ................... 50mA[2]
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF .............. 1.0A
(~llls pulse width, 300pps)
Reverse Input Voltage - VR (Pin 3-2) . :. . . . . . . . . .. 5V
Input Power Dissipation . . . . . . . . . . . . . . . . .. 45mW[3]
Average Output Current - 10 (Pin 6) ............ 8mA
Peak Output Current ............ "........... 16mA
Emitter-Base Reverse Voltage (Pin 5-7). . . . . . . . . . . .. 5V
Supply and Output Voltage - Vee (Pin 8-5), Vo (Pir, 6-5)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. -0.5V to 15V
Base Current - IB (Pin 7) . . . . . . . . . . . . . . . . . . .. 5mA
Output Power Dissipation .•............... 100mW[4]
*JEDEC Registered Data. (The HCPL-2502 is not registered.) 140
See nDtes, following page.
Electrical specifications
r-'"',""
Parameter
Sym.
Current Transfer Rado
:CTR*
-I
Iu... ...op
Logic Low
OutPut V0ltal!e
VOL
logic High.'
Output Currant
IoH*
logic High
Output Curmrt
IoH*
Logic. Low
Supply Curr~t.
'tOOL
Logic High'
Supply Currant
fCCH~
(TA = 25°C)
Dem. ..!\Ale.
6N135 ..
1
. 6N136
.19
HCPL-2502 . 15
,,~,
,:.:; .'
.~().1·.
6N136
6Nt36
HCPI..-2502
.'
.3
.100.'
.16 .'
. 'o.O:f .
Input Forward Voltage
VI'"
t.5
Temperature Coefficient
of Forward Voltage
AVF
ATA
~1.8
mVl'c
60
PI'
Input R_se Breakdown
BVR*
Voltage
5'
~
Input Capacitance
CIN
Input- Output Insulation
Leakege Current
'1-0*
Resistance
(lnput-Output)
RI-O
Capacitance
(Jnput-Output)
C'·O
Transistor DC
Current Gain
3
:,
'.lMH.,VF·..·O
~atiVe Humidity,t=5 SeC, .
#A
..-~Vdc
1012
lr
'.V;:o "sOoV de
0.6
pi'
Uk..
6
.
.
6
6'
f-'iMHz
'.
150
hFS
switching Specifications
'"'
"\/O"'5V,IO=~A .
(T A = 25°C)
VCC = 5V,IF = 16mA UNLESS OTHERWISE SPECIFIED
Parameter
Propagation Delay
Time To Logic Low
at OutPut
'Gym.
Device
Propagation Daley
Time To Logie High
at Output .
6N136
tpHL* 6N1S6
HCPL-2602
6Nl36 .
tPLH* 6N136
HCPl.-2502
Common Mode Transient ImmunitY at Logic
High level OutpUt
6N135
CMH 6Nl36
HCPL·2602
Common Mode Tran·
siant ImmunitY at logic
Low level Output
CML 6Nl36
Bandwidth
BW
6N135
HCPL-2SC2
Min.
Typ.
TeSt Conditions
MIlK.
Units
0.6
1.. 5
WI
Rl" 4.1kn
0.2
0.8
WI
RL-1.9kCl
0.4
1.5
WI
RL "'4.1kCl
.0.3
0.8
. /. RL=4.1kO
·1000
.. 'II/WI
VCM"'OVp..p,RI.,~.Ulkn
10
1,8.9:
~L=1000
S
10
2
M.H;r;·
NOTES: 1. Derate linearly above 7rfC free-air temperature at 8 rata of a.8rnAfe .
.2. Derate linearly above 70°C free--air temperature at a rate of 1.6mAI"'C.
3, Derate linearly above 7rfe free-alr,temperature at a rate of O.9mWfC.
4. Derate linearly above 700C free-air temperature at a rate of 2.0mW;C.
5, CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10. to the forward LEO input current, IF. times 100%.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common mode pulse, VCM, to assure
that the output will remain in a Logie High state Ii.e., Va> 2.0V). Common' mode transient immunity in Logic Low level is the maximum tolerable (negative) dVCM/dt
on the trailing edge of the common mode pulse signal. VCM. to assure that the output will remain in a Logic Low state Ii.e., Va < 0.8V).
8. The 1.9kn load represents 1 TTL unit load of 1.6mA and a 5.6kn pull-up resistor.
9. The 4.1kO load represents 1 LSTTL unit load of 0.36mA and a 6.1kn pull·up resistor.
10. The frequency at which the ae output voltage is 3 dB below the low frequency asymptote.
*JEDSC Registered Data.
.-.~ "'-_ ..
_._-, .,- ... - - ..,.--..
141
~~---
20
--_
-_
--'
--
TA=25'C
-'
10 - VcC ·5.D)l
.... 40 rnA
...,."'"
..,..""",,"-,
'/ .,..---- .... -.. --r·,,-",,-
'F."i
I-
~I
_25mA
5
If
20 rnA
i!::::>
o
16
~
a:
a:
:::>
e.>
>ft
I
0
.......... 30 rnA
-
15a:
Vo • O.4V
18
_ 35 rnA
....
....
(/....
Vee'*" 5.0V
~
en
14
z
'"
a:
lI-
15a:
12
a:
:::>
e.>
I
I
E
15 rnA
a:
10
l-
e.>
10 mA
I.-SmA
o
o
10
IF - INPUT CURRENT - rnA
Figure 1. DC and Pulsed Transfer Characteristics.
Figure 2. Current Transfer Ratio vs. Input Current.
100
LJ
I
1/ -
'"
E
I
I-
15a:
:::>
e.>
t
I
I
10
a:
20
Vo -OUTPUTVOLTAGE-V
'"
E
I
IZ
W
I.
1.0
~
/
;!;
1
a:
a:
§~
:::>
e.>
f----
I-
~
I-
:::>
o
I
_0
II
j'
.0 1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
\If - FORWARD VOLTAGE - V
IF - INPUT CURRENT - rnA
Figure 4. Output Current vs. I nput Current.
Figure 3. Input Current vs. Forward Voltage.
800r---~--~--~r----r---'r---'----.----'
' •• 16mA, v"" • S.W
~ 10+ 4
-81'1135 (RL • 4.1klll
700
>
~
o
z
o
~
~
!=
vc
I
-81'1136. HCPL·2S!n fRL • 1.9k!lJ
I-
I
15a:
600 1---+----+----+---+-",...."'1-----.;.----+-=--,..::"-1
6.0V
a:
:::>
e.>
5
~
o
500r----+----+-~'~~-i----~~~-----rr-79
10+ 1
:I:
400 1----"""---+-:=>'--'F'--c-d;.""",""--+---:;;;;01"''--
~
10°
e.>
I
§
....-'
10-1
.,;..--
/""
V
V
./
/'
V
/
I
40
60
80
15
100
10- 2
·50
-25
+25
+50
+75
+100
TA - TEMPERATURE -Co
TA - TEMPERATURE - Co
Figure 6. Logic High Output Current vs. Temperature.
Figure 5. Propagation Delay vs. Temperature.
142
[
0
;:
«
a:
a:
:f
z
«
a:
II)
......z
w
a:
a:
u
::>
...
f - FREQUENCY - MHz
«
z
......'"
iii
g.-.....-O+15V
«
~
I
:aOI:aU-
IF - QUIESCENT INPUT CURRENT - rnA
Figure 7. Small-Signal Current Transfer Ratio VS. Quiescent
Input Current.
Figure 8. Frequency Response.
'F
r----------------,
o~
I
I
Vo
5V
I
1.5V
Figure 9. Switching Test Circuit.
.jj'I--1----o +5V
\/eM
--<1----0 Vo
A
Vo --------~~
__--------------5V
SWITCH AT A: IF= OmA
Vo
---------------------~~ VOL
SWITCH AT B: IF = 16mA
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
"JEDEC Registered Data.
143
-
HEWLETTll PACKARD
COMPONENTS
HCPL-2530
(5082 -4354)
DUAL HIGH SPEED
OPTICALLY COUPLED
ISOLATORS
HCPL-2531
(5082 - 4355)
TECHNICAL DATA APRIL 1977
OUTLINE DRAWING
SCHEMATIC
~
'8
.---._-----0 Vee
5" ryp.
T
_-4_-05
GND
Features
Applications
• HIGH SPEED: 1 Mbitls
• TTL COMPATIBLE
• HIGH COMMON MODE TRANSIENT IMMUNITY:
>1000V/J.ls
• HIGH DENSITY PACKAGING
• 3000Vdc INSULATION VOLTAGE
• 3 MHz BANDWIDTH
• OPEN COLLECTOR OUTPUTS
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF UNDERWRITERS
LABORATORIES, INC. (FILE NO. E55361)
• Line Receivers - High common mode transient immunity
(>1 OOOV IllS) and low input-output capacitance (0.6pF).
• High Speed Logic Ground Isolation - TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL.
• Replace Pulse Transformers - Save board space and weight.
• Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.
• Polarity Sensing.
• Isolated Analog Amplifier - Dual channel packaging enhances thermal tracking.
Absolute Maximum Ratings
Description
The HCPL-2530/31 dual isolators contain a pair of light emitting
diodes and integrated photon detectors with 3000V dc electrical insulation between input and output. Separate connection
for the photodiode bias and output transistor collectors improve
the speed up to a hundred times that of a conventional phototransistor isolator by reducing the base-collector capacitance.
The HCPL-2530 is suitable for use in TTL/CMOS, TTL/LSTTL
or wide bandwidth analog applications. Current transfer ratio
(CTR) for the -2530 is 7% minimum at IF ; 16 mA.
The HCPL-2531 is suitable for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input
LED will provide enough output current for 1 TTL load and a
5.6kQ pull-up resistor. CTR of the -2531 is 19% minimum at
IF ; 16 mA.
144
Storage Temperature . . . . . . . . . . . . . . . _55°C to +125°C
Operating Temperature . . . . . . . . . . . . . . _55°C to +100o C
Lead Solder Temperature. . . . . . . . . . . . .. 260°C for lOs
(1.6mm below seating plane)
Average Input Current - IF (each channel) . . . . .. 25mA[1l
Peak Input Current - IF (each channel) . . . . . . . . . 50mA[2]
(50"10 duty cycle, 1 ms pulse width)
Peak Transient Input Current - I F (each channel) . . .. 1.0 A
(-,,'
5,9
10,U
0.8 ,', I ','
"V/~s~;~F,~~~'~~:-4.1 "'t,Vc~!'10yp:J);
",
1//#$
""
I>, ,.".
',.:,tlf"¥~,fl}t.~fJlk,O~;YCM",'nStp.p .• 1·,1~'
, V(/Ss.:·
,
"
VI~
3
Derate linearly above 70°C free-air temperature at a rate of O.BmAf C.
Derate linearly above 70°C free-air temperature at a rate of 1.6mAfC.
Derate linearly above 70°C free-air temperature at a rate of O.9mWfC.
Derate linearly above 7ci'C free-air temperature at a rate of 1.0mWfC.
Each channel.
CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10, to the forward LED input curr~nt, IF, times 100%.
Device considered a two-terminal device: Pins 1, 2. 3, and 4 shorted together and Pins 5, 6, 7, and a shorted together.
Measured between pins 1 and 2 shorted together. and pins 3 and 4 shorted together.
Common mode transient immunity in Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common mode pulse VCM. to
assure that the output will remain in a Logic High state (i.e .• Vo > 2.0V). Common mode transient immunity in Logic Low level is the maximum tolerable
(negative) dVCM/dt on the trailing edge of the common mode pulse signal. VCM, to assure that the output will remain in a Logic Low state (i.e., Va
-V31 (ilL' l.l1k0)
...'w"
I ,.k .....
400 - iI
....;..0'.... "'u!
~
I
,
--t-,
1""' -~~
"
"
,;"
... .-r'"
20
:::l
U
I-
10+2
I:::l
10+1
~
"iu '0·
...I
!i!
'"
0
60
80
'00
YS.
10-1
--"""
........--.
10-2
-50
TA - TEMPERATURE - C"
Figure 5. Propagation Delay
',c
:I:
5
40
" CC,
10+3
0
~H
~
".~,'I,//
, '\(.1'5.011 ',:
I-
~
a:
a:
~- K...." V
--
10+4
I
-25
-':-'
/'"
+25
",:"
"/'
+50
+75
"C,'
+100
TA - TEMPERATURE -Co
Temperature.
Figure 6. Logic High Output Current vs. Temperature.
146
!ll
I
-5
w
'"z
~
a:
-10
-15
fa
N
:::;
-20
'a:"
-25
«
0
z
-3?Ol
f - FREQUENCY - MHz
+5V o---r '
50
250
j.!A
V eC=5.5V, Vo=5.5V,
IF"250IlA, VE=2.0V
6
0.5
0.6
V
Vcc"'5.5V, IF=5mA,
VEH=2,OV'ig ,'"
10L (Sinking) =13mA
5
mA
Vcc=5.5V'~I;:·2.0y
g
High Level Enable Current
IEH
,Low level Enable Curtent
IEL
..
, High level Supply Gl,Jfrent
..
ICCH
" Low I.evel Supply
ICCL
Input-Output Insulation
Leakage Current
-1.0
.
.
11-0
-2.0
mA
VCc=5.5V, VE=0.5V:,
1,5
mA
Vcc=5.5V,IF=0
VE=0.5V
13
18
mA
Vcc=5.5V, IF=10mA
Ve=0.5V
1.0
j.!A
Relative Humidity=45%
TA=25°C, t=5s
V,.o=3000Vdc
'};"~~ I'
~,
"";S'
Resistance (Input-Outputl
RI_O
1012
£4
VI_o=500V, TA=25°e
c.-o
0.6
pF
f=lMHz. TA''",25°C
.!Oput Forward Voltage
VF"
1.5
.
eVR
~,
'~';;,';"
;';\,\;;j
7
Capacitllnce (Input-Output)
Input Reverse Breakdown
Voltage
Note
-1.6
'"
',;;
Figure
1.75
5
V
IF=10mA, TA=25°C
V
IR=10ttA, TA =25°C
5,
~
,;;;:',1):,$,
4";\;1'" a,' ;
Input Capacitance
CIN
60
pF
VF=O, f=lMHz
Current Transfer Ratio
eTR
700
%
IF=5.0m~ R L=100£4
2
7
"AII typical values are at Vee
= 5V, T A = 25
0
e
switching Characteristics at TA =25°C, VCC =5V
[
Parameter
Symbol
Typ.
Max.
Units
Test Conditions
Figure
Note
Propagation Delay Time to
Higl'l Output Level
tPLH "
45
75
ns
RL =350£4, CL =15pF,
IF=7.5mA
7,9
1
Propagation Delay Time to
low Output Level
tPHL "
45
75
ns
RL "'350£4. CL = 15pF,
IF=7.5mA
7,9
2
Output Rise-Fall Time
(1()'90%)
tr, tf
25
ns
RL=350£4,
ft:=7.5mA
Propagation Delay Time of
Enable from VEH to VEL
teLH
25
ns
RL=350£4, CL"15pF,
IF=7.5mA, VEH=3.0V,
VEL "'0.5V
8
3
Propagation Delay Time of
Enable from VEL to VEH
tEHL
15
ns
RL =350£4, CL =15pF,
IF=7.5mA VEH=3.0V,
VEL=O.5V
8
4
Common Mode Transient
immunity at logic High
Output level
CMH
50
v/ttS .
VCM=10V RL =350£4,
Vo(min.)=2V, IF=OmA
11
6
Common Mode Transient
Immunity at logic low
Output level
CML
-150
v//Js
VCM=10V RL ;350£4,
Va {max.)=0.8V,
IF=5mA
11
6
Min.
•JEDEC Registered Data.
149
,
CL= 15pF,
Operating Procedures and Definitions
Logic Convention. The 5082·4360 is defined in terms of positive
logic.
Bypassing. A ceramic capacitor (.01 to 0.1tJF) should be con·
nected from pin 8 to pin 5. Its purpose is to stabilize the opera·
tion of the high gain linear amplifier. Failure to provide the bypassing may impair the switching properties. The total lead
length between capacitor and isolator should not exceed 20mm.
Polarities. All voltages are referenced to network ground (pin
5). Current flowing toward a terminal is considered positive.
Enable Input. No external pull-up required for a logic (1), i.e.,
can be open circuit.
NOTES:
1. The tpLH propagation delay is measured from the 3.75mA point on the trailing
edge of the input pulse to the 1.5V point on thetrallingedgeofthe output pulse.
2. The tPHL propagation delay is measured from the 3.75mA point on the leading
edge of the input pulse to 1.5V point on the leading edge of the output pulse.
3. ThetELH enable propagation delay Is measured from the 1.5V pOintofthetrailing
edge of the Input pulse to the 1.5V point on the trailing edge of the output pulse.
4. The tEHL enable propagation delay is measured from the 1.5V point on the
leading edge of the input pulse to the L5V point on the leading edge of the
output pulse.
5. Device considered a two terminal device: pins 2 and 3 shorted together, and
pins 5, 6, 7, and 8 shorted together.
6. Common mode transient immunity in Logic High level is the maximum tolerable
(positive) dVcM/dt on the leading edge of the common mode pulse, VCM, to
assure that the output will remain in a Logic High state (i.e., VO>2.0V). Common
mode transient immunity in Logic Low level is the maximum tolerable
(negative) dVcM/dt on the trailing edgeofthe common mode pulse signal, VCM,
to assure that the output will remain in a Logic Low state (i.e., Vo
"oa:
~
~
I
Vo - COLLECTOR VOLTAGE - V
.J!o
Note: Dashed characteristics - denote pulsed operation only.
V F - INPUT DIODE FORWARD VOLTAGE - VOLTS
Figure 4. I nput Diode Forward Characteristic.
CURVE
TRACER
TERMINALS
>
I
w
'""!:;
0.6
g
.
I-
::>
Figure 2. Isolator Collector Characteristics.
I-
0.5
::>
0
I
~
>
I
0.4
TA - TEMPERATURE _
w
~
°c
Figure 5. Output Voltage, VOL vs. Temperature and Fan-Out.
g
!
I
~
IF - INPUT DIODE FORWARD CURRENT - rnA
}I)oI1lt}-t---<>---()
Vo
TA - TEMPERATURE -
°c
Figure 6. Output Current,lOH VI. Temperature (IF=250,,A).
Figure 3. Input-Output Characteristics.
150
INPUT VE
I""'~_~" MONITORING NODE
+5V
'1'\11.8&
{" .. Figure Nl:ite
Vee'" 5.5V, Vo = 5.5V,
IF '" 250 p.A, VE = 2.0 V
p.A
;15 '
~eeL F'
~ Enable Current
250
~O
iceH
~;;#/.
7
;~~.,.
",::f!:i1.'
"':2.0
-1.0'
Vee'" 5.5V, Ip '" 10 rnA,
VE =0.5 V
mA
Vee"" 5.5 V, VE "" 0.5 V
mA
Vee = 5.5 V, VB = 2.0V
V
11
.~~ Level En~Wevbt~r~.
. ~1'IP'llt·Fd~~'WJ
'~
li:1put Reverse:~k:fl~.nr
.:.;'V9!t~.{Je';.r ;.'>(;'<:,~; ·r.····
Input CapacitanC!\l.,;
:.•. r'·
mVrC Ip= 10 mA
Input Diode Temperature
Coefficient
"-0
Input-Output Insulation
Leakage Current
I:
Resistance (Input-Output)
l·l;AI-o
,..1
CI _0
) CapaCitance (Input-Output)
• All typical values are at Vee
~
5V. T A
1
~
250
0.6
P.~·1;
Relative Humidity = 45%
T A = 25° C, t = 5 $,
VI-O "" 3000 Vdc
3
0
V,-o "" 500 V
3
pF
f = 1 MHz
3
e.
switching Characteristics (TA = 25°C, Vee ~ 5V)
Typ:' Max.
.ri' ;W' parameterl~<,i
Symbo':,; Mil:
Propagation Delay Time to
High Output level
tPLH
Propagation Delay Time to
Low Output Level
tPHL
35
,
;
75
i';'
Units
ns
.r,:'
35' ;;";~i"
Test Conditions
ns
" AL == 350
Figure
Note
6
4
6
5
CL = 15 pF
IF'" 7.5 rnA
Output Rise Time (10-90%)
tT
25
ns
Output Fall Time (90-10%)
tf
15
ns
Propagation Delay Time of
Enable from VEil to VEL
tELH
25
ns
AI- = 350 0, CL '" 15 pF,
IF 7.5 rnA, VEIl'" 3 V,
VEL = 0 V
9
6
Propagation Delay Time of
Enable from VEL to VEil
tEHL
15
ns
RL =350 0, CL = 15 pF,
IF = 7.5 mAo VEH '" 3 V,
VEL = 0 V
9
7
Common Mode
Transient Immunity
at High Output Level
CMH
10,000
Vlp.s
VCM '" 50 V (peak),
Vo (min.) '" 2 V,
AL = 350 n, Ip '" a mA
12
8,10
Common Mode
TranSient Immunity
at Low Output Level
CML
V/p.s
VCM = 50 V (peak),
Vo (max.) = 0.8 V,
Rl = 350 n, IF "" 7.5 rnA
12
9,10
1000
-1000 -10,000
.,
153
=
NOTES:
1. Bypassing of the power supply line is required, with a 0.01 .uF ceramic
disc capacitor adjacent to each isolator as illustrated in Figure 15. The
power supply bus for the i50Iator(s) should be separate from the bus for
any active loads, otherwise a larger value of bypass capacitor (up to 0.1
,t.tF) may be needed to suppress regenerative feedback via the power
supply.
2. Peaking circuits may produce transient input currents up to 50 rnA, 50
ns maximum pulse width, provided average current does not exceed 20
the
6. The tELH enable propagation delay is measured from
1.5 V pOint on
the trailing edge of the enable input pulse to the 1.5 V point on the
trailing edge of the output pulse.
7. The tEHL enable propagation delay is measured from the 1.5 V point on
the leading edge of the enable input pulse to the 1.5 V paint on the
leading edge of the output pulse.
8. CMH is the maximum tolerable rate of rise of the common mode voltage
to assure that the output will remain in a high logic state (Le .. VOUT
>2.0 V).
9. CML is the maximum tolerable rate of fall of the common mode voltage
to assure that the output will remain in a low logic state (I.e., VouT
i'..
"-'
.......
"-'
5
r-- r-..,
-- ........
J:
'"
i
I
~
0
0
10
20
40
30
50
60
70
9.0
I
w
"'':":;
">
0-
. °1
!
6.0
4.0
0.3
"9
0.2
I
~lo-12.a:"A7f/
"
3.0
0-
>0 2.0
-
I....
J
.-
1.0
00
A •
L 'lk!l
,'t" T" ••
0-70"C
2.0
3.0
i!l
"
""ir
./
4.0
.'
0.1
a:
0.1
I
0
20
10
30
0.01
T.. -25"C--:"
~
40
50
60
I
0.001
1.0
70
Figure 3.
Low Level Output Voltage
vs. Temperature.
Figure 5. Output Voltage vs. Forward
Input Current.
2.0
80 ~V"". 5.nv
2
ZO"'soo
til'"
5n~
I
'5V
~VCC8
IF
..::...J
4
>
1 F
R,
OutputVo
GND ll-~
Monitoring
-=-
:~PUT ~------~---I:"375mA
IF - FORWARD INPUT CURRENT - mA
1.8
Figure 4. Input Diode Forward
Characteristic.
PULSE
GENERATOR
!tel is appro,.;imately 15 pF, which includes
probe and stray wiring capacitance.
6.0
1.6
1.4
~
- - - - I =7.5mA
5.0
1.2
VF - FORWARD INPUT VOLTAGE - V
Nod.
I
."'!oo.
1.0
~
to =6,4mA
Node 47n
T ?-10"f
1.0r-----
0-
-'a' .16.OmA
c--1~=96~A~
·
R L • 350n
I
Fc·
a:
"u
~ g~k5
~;~Y~ASS
Input
!'"6t'
Mo";'O~ I t;:: e,'
5.0
~
0
I
=
Vee =s.nv
7.0
100:::-0 ·.o:=;o
ffia:
1
TA - TEMPERATURE - °C
Figure 2. High Level Output Current
vs. Temperature.
>
,:.
5,QmA
~
TA - TEMPERATURE _ °C
8.0
"
E
a:
>0
~
~
'F I
T
0.4
w
Vee' 5.6V
VE =l.OV
I
I
0
w
100
I
0.5
0-
(p-p)
'.
0.6
0
= lTfcMVcM
max
11. No external pull up is required for a high logic state on the enable input.
I
I
0.7
'"':":;
~
0
.P
I
w
(ldVCMI~
--dt
0-
0-
~
0.8
>
10. For sinusoidal voltages,
--..j
tpHl
1---
~ tplH
r--
"ul
"z
">=
'";It"
0
if
I
:-----rIF
154
-
~
.,---.
-
-
60
'PC" AL =4k~
50
--or- 'PLHR<~
40
:t--
~
tpH-l Rl }" 350£4
T~tpHl Rt
IPL" R ".lk
= 1tc.fl. ."...,.-
30.,-
~
-I,,,,RL
.~n
20
0
10
~~TPUT~_1.5V
Figure 6. Test Circuit for tpHL and t pLH '
.. 7.5mA
7 0 - ; - - I~
20
30
40
50
60
TA '" TEMPERATURE - °C
Figure 7.
Propagation Delay vs.
Temperature.
70
HP$(t01$
PUt.-sE
GENE;RATQR
c
I
f'·V' _.
>-
70
"0z
80
"...w
c
I
Zo-son'
80
~
"oz
~
~
i=
'"0";;:
o
IE
.,...w
IE
I
ffi
"C L is approximately 15 pF. which ineludes
probe and stray wiring eapacitance.
~~
I
20
10
12
14
16
18
20
TA - TEMPERATURE _ °C
IF - PULSE INPUT CURRENT - rnA
Figure 8. Propagation Delay vs. Pulse
Input Current.
Figure 10. Enable Propagation Delay
vs. Temperature.
Figure 9. Test Circuit for tEHL and tELH'
~
Hp1900A
> 12000
PULSE
I
GENERATOR
>-
Zo • GIlI1
; 10000
::>
:E
350H
Output va
TFI,iI-F==+-oMonltoring
Node
~
8000
~
6000
~
j - I--
Vee' 5.0V ~
Iftt .. 7.5mA
In .. OmA
VOK - 2.QV "
VOL·O.SV ,.
<
III ·350.:
TA • 25"C
">- 4000
§ i--"~ A~D t:IMH
a:
W
r\.---50V
ov--/
r-
'------/
5V SWITCH AT A: IF
'=
0
CM
H
~ 2000
:E
:E
00
8
I
SWITCH AT B: IF" 7.5mA
Va 0,5 V
Figure 11. Rise, Fall Time vs.
Temperature.
1,4
"
~ 1=
~
i
u>-
VOH =
1.2
VOL"" O.SV
IFH '" 7,5mA-
~ ~ 1.
,
1'--.,
"z 1.0
-
...J
I
t'IO~~
:E
U
,9
1~
f'...
;>
,8
,7
10
20
400
-
30
TRANSIENT AMPLITUDE -
N,C.
50
CIf.;;,:::tt1tt:===~==~
ENABLE
(IF USED)
OUTPUT 1
ENABLE
"'"
60
°c
Figure 14. Relative Common Mode
Transient Immunity vs.
Temperature.
(IF USED)
70
N,C,
OUTPUT 2
~--:t+.''--
Figure 15. Recommended Printed Circuit
Board Layout.
155
1000
V
N,C,~i====~
"- ~
40
800
MODE
Figure 13. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.
N.C.
TA - TEMPERATURE -
600
COMMON
20V -
~\&:
o
V CM
In "" OmA
fll • 3500 -;
.........
i=Ci5
u
I I
200
GND BUS (BACK)
1.3
~z
0;::
Figure 12. Test Circuit for Common Mode
Transient Immunity and
Typical Waveforms.
iVc~}6,olv
(I
W
:E
Vo (max.)
,,- -
I !
HIGH CMR,HIOH SPEED
OPTICALLY COUPLED
LINE RECEIVER
HEWLETT' PACKARD
COMPONENTS
HCPL-2602
TECHNICAL DATA APRIL 1917
OUTLINE DRAWING·
i
TV..
NUMBER
'.36 1.2901
OATE
~
3
4
t_
1.240)
.1"01 •.00 tjl
~
CODE
2
,
6.,.
R~~ITION
Lt ....
PM)(.
=,
....
0.18
t.
(
6~
TVP•
•
T
~.
........t J..c- 0.89 (.035) MIN. OtMeNSION$ IN MILUMETRES AND (INCHES)
=HbU:t..
TRUTH TABLE
A 0.01 TO O. I "F BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
PINS 8 ANO 6 (See Note 1).
(Positive Logic)
Input
H
l
Figure 1. Schematic.
H
L
!nabla
H
H
L
Output
l
H
H
I.
H
o.&6.t.t)lS)
MAX.
I-l-~:::::
Applications
Features
• LINE TERMINATION INCLUDED REQUIRED
t-$2(.115)MtN.
• Isolated Line Receiver
NO EXTRA CIRCUITRY
• ACCEPTS A BROAD RANGE OF DRIVE CONDITIONS
• Simplex/Multiplex Data Transmission
• GUARDBANDED FOR LED DEGRADATION
• Computer-Peripheral Interface
• LED PROTECTION MINIMIZES LED EFFICIENCY
DEGRADATION
• Microprocessor System Interface
• HIGH SPEED - 10Mbs (LIMITED BY TRANSMISSION LINE
IN MANY APPLICATIONS)
• Digital Isolation for A/D, D/A Conversion
• INTERNAL SHIELD PROVIDES EXCELLENT COMMON
MODE REJECTION
• Current Sensing
• EXTERNAL BASE LEAD ALLOWS "LED PEAKING" AND
LED CURRENT ADJUSTMENT
• Instrument Input/Output Isolation
• 3000 Vdc INSULATION VOLTAGE
• Ground Loop Elimination
• RECOGNIZED UNDER THE COMPONENT PROGRAM OF
UNDERWRITERS LABORATORIES, INC. (FILE NO. E55361)
• Pulse Transformer Replacement
Description
The HCPL-2602 optically coupled line receiver combines a GaAsP light emitting diode, an input current regulator and an
integrated high gain photon detector. The input regulator serves as a line termination for line receiver applications. It
clamps the line voltage and regulates the LED current so line reflections do not interfere with circuit performance.
The regulator allows a typical LED current of 8.5 mA before it starts to shunt excess current. The output ofthe detector IC
is an open collector Schottky clamped transistor. An enable input gates the detector. The internal detector shield
provides a guaranteed common mode transient immunity specification of 1000Vlllsec, equivalent to rejecting a 300V P-P
sinusoid at 1 MHz.
DC specifications are defined similar to TTL logic and are guaranteed from O°C to 70°C allowing trouble free interfacing
with digital logic circuits. An input current of 5 mA will sink an eight gate fan-out (TTL) at the output with a typical
propagation delay from input to output of only 45 nsec.
The HCPL-2602's are useful as line receivers in high noise environments that conventional line receivers cannottolerate.
The higher LED threshold voltage provides improved immunity to differential noise and the internally shielded detector
provides orders of magnitude improvement in common mode rejection with little or no sacrifice in speed.
156
Electrical Characteristics
(Over Recommended Temperature, TA = 0° C to +70° C, Unless Otherwise Noted)
·;'P«r~~et·
Syrtml)l"" "Min,
Il""".
10H
Typ.,
Max.
Units
7
260
tJA
OA.
0.6
.:rest Con!litioo$
Vee =!);5~,Vo=5.5V
Note
Ji=260tJA,Vek;2.0V .
10."..
'.\tce",$.5V, i,",$~:
Ve"'2.0V; ...............
• todSin~ingl:"13 m,t\
2.0
2.4
2.3
2.7
0.75
0.95
V
-1.6
-2.0
mA
rnA,
-1.0
11
V
x10
0.8
V
15
mA
VCC=5.5V, 11"'0,
Ve=0.5V
19
mA
Vec""5.5V., 1,,;'aOniA
VE"'0.5V
pF
VI='O, f=l MHz,
(PIN 2·3)
tJA.
Relative Humidity=45%
T A=2S"C, t=5 $,
V 1-0 =3000 Vde
3
1012
n
VI_0=500V
3
0.6
pF
f'" 1 MHz
3
"All typical values are at Vee ~ 5V. TA ~ 25°e.
f'"'
switching Characteristics
(TA = 25°C, Vee = 5V)
.
!;;;~ i:n·' ""'::~""
':
.• iSymbdr;' ' Min.
Typt
Max.
Units
1+ Propagation DetaY,:ilme~~,i.t .;' tpLH
High'putput Level
';
45
75
os
'l;·:t~:~r~etay,,:i,nlN~;
.
LoI1\f
ut Leve";:;"" .;.;
45
75
os
.' .
tPHLl
... J; ....
~. Rise Time (10·90%)
tFali T~me (90'10%)"
•
Prop*tion Detay Time of
;nable from VEH
VEL.;
Commoti MOde.~~;,;iili;
Imr.,T.
.L'•. "
at
~igh Out~~~\!"~:'~lr:;j":f:1
4
RL =360 n
CL=15pF
fl=7.5mA
6
5
RL = 360D, .~ =15 pF,
'1'=7.5 mA, VeH"'3 V,
VEL ='0 V
10
6
10
7
25
tl
15
os
os
tELH
25
ns
tEHL
15
ns
10,000
V//J.s
VeM=50 V (peak),
Va (min.)=2 V,
RL=350n,II=OmA
12
8
-1000 -10,000
V/p.s
VCM=60 V (peak),
Vo (max.)=0.8 V,
RL=360fi,II=7.5mA
12
9
CMH
1000
'''m'''.~
0;,;:'C;'
;;.;eomdlon Mode
,';iJ.:rransientlfumurlity
Note
6
tr
;';"
1{F
"Ilr~atjon Delay Time of
Enable from Vet to VEH
Figure
Test Conditions
"J<
CML
;:IH.l~'~w Oti~~u~};evel
157
Using the HCPL-2602 Optically
coupled Line Receiver
direction. The effect ofthis is a 10ngertpHL' This effect can
be eliminated and data rate improved considerably by use
of a Schottky diode on the input of the HCPL-2602.
The primary objectives to fulfill when connecting an
optoisolator to a transmission line are to provide a
minimum, but not excessive, LED current and to properly
terminate the line. The internal regulator in the HCPL2602 simplifies this task. Excess current from variable
drive conditions such as line length variations, line driver
differences and power supply fluctuations are shunted by
the regulator; In fact, with the LED current regulated, the
line current can be increased to improve the immunity of
the system to differential-mode-noise and to enhance the
data rate capability. The designer must keep in mind the
60 mA input current maximum rating of the HCPL-2602,
in such cases, and may need to use series limiting or
shunting to prevent overstress.
For optimum noise rejection as well as balanced delays a
split-phase termination should be used along with a flipflop at the output (Figure c). The result of current reversal
in split-phase operation is seen in Figure (c) with switches
A and B both OPEN. The isolator inputs are then connected in ANTI-SERIES; however, because of the higher
steady-state termination voltage, in comparison to the
single HCPL-2602 termination, the forward current in
the substrate diode is lower and consequently there
is less junction charge to deal with when switching.
Design of the termination circuit is also simplified; in most
cases the transmission line can simply be connected
directly to the input terminals of the HCPL-2602 without
the need for additional series or shunt resistors. If
reversing line drive is used it may be desirable to use two
HCPL-2602's, or an external Schottky diode to optimize
data rate.
Closing switch B with A open is done mainly to enhance
common mode rejection, but also reduces propagation
delay slightly because line-to-line capacitance offers a
slight peaking effect. With switches A and B both
CLOSED, the shield acts as a current return path which
prevents either input substrate diode from becoming
reversed biased. Thus the data rate is optimized as shown
in Figure (c).
Improved Noise Rejection
Use of additional logic at the output of two HCPL-2602's
operated in the split phase termination, will greatly
improve system noise rejection in addition to balancing
propagation delays as discussed earlier.
pOlarity Non-Reversing Drive
High data rates can be obtained with the HCPL-2602 with
polarity non-reversing drive. Figure (a) illustrates how a
74S140 line driver can be used with the HCPL-2602 and
shielded, twisted pair or coax cable without any additional
components. There are some reflections due to the "active
termination" but they do not interfere with circuit
performance because the regulator clamps the line
voltage. At longer line lengths tpLH increases faster than
tpHL since the switching threshold is not exactly halfway
between asymptotic line conditions. If optimum data rate
is desired, a series resistor and peaking capacitor can be
used to equalize tpLH and tpHL. In general, the peaking
capacitance should be as large as possible; however, if it is
too large it may keep the regulator from achieving turn-off
during the negative (or zero) excursions of the input
signal. A safe rule:
make C~16t
where C = peaking capacitance in picofarads
t = data bit interval in nanoseconds
POlarity Reversing Drive
A NAND flip-flop offers infinite common mode rejection
(CMR) for NEGATIVEL Y sloped common mode transients
but requires tpHL>tpLH for proper operation. A NOR flipflop has infinite CMR for POSITIVELY sloped transients
but requires tpHL < tpLH for proper operation. An
exclusive-OR flip-flop has infinite CMR for common mode
transients of EITHER polarity and operates with either
tpHL > tpLH or tpHL tpLH, so NAND gates are preferred in the R-S
flip-flop. A higher drive amplitude or different circuit
configuration could make tpHL
tpLH or tpHL,
1.0
>,
'"~""'
6.0
"'
'~"
0
isf-
:::>
I!:
:::>
0
,
oj'
to assure that the output will remain in a low logic state (i.e., Vm··J <0.8
V).
10. For sinusoidal voitages, (ldveM1)
---
5.0
-
3.0
2.0
I....
2.4
O'C
~
1.0
2.2
25'C
2.0
I
f-
-
!J r
~
:::>
u
70'C
f-
'1/
~
R L "3501"1
TA IIIO-70~C
~,
1.6
w
I
">
1.4
::t:
f-
00
1.0
2.0
3.0
~
4.0
5.0
1.0
6.0
=
'"r
,i
:ii
" I'---
I
~
0
10
20
30
40
50
60
.P
0
0
10
20
IJ - FORWARD INPUT CURRENT - mA
30
40
50
60
TA - TEMPERATURE _.
Figure 3. Input Characteristics.
-
2.0V
250pA-
.......... ........
5
II - INPUT CURRENT - rnA
Figure 2. Output Voltage vs. Forward
Input Current.
"" 5-.5V
V.
"
-
'---
....
5.5~
Vo
=
10~
:::>
0
1.2
.......
Vee I "
15
a:
a:
1.8
~ TA -0-70"C
(p-p)
'i
>
R e '1k'a
rrfU\.1VCM
rna'
11. No external pull up is required for a high logic state on the enable input.
f-
4.0
:=
dt
2.6
9.0 r--8.0
>2.0 V).
9. CM!. is the maximum tolerable rate of fall of the common mode voltage
70
c
Figure 4. High Level Output Current
vs. Temperature.
I( HP~7. "I
PULSE
>,
"'
"'":;
0
>
0.8
GENERATOft
0.7
0.6
~
f-
....
"'
~
s:
g
,
oj'
I
"1
-{--,
f-
:J
0
:
Vee" 5.SV
v• • 2.0V
I
0.5 -
Zo "'50S}
.. 5.QmA
I
I
"
Input
Monitoring
i Q ,*,'1-6,OmA
Node 47U
0.4
0.3 - 1 0
~ 12,.~~A47! .-/
0.1
toI
0
10
vee
[j"
I*~f~~
UI
I!
B. BY~:SS
"1'A
CL'
30
'NPUT
IJ
40
Output Va
Monitoring
Nod.
fl
60
50
TA - TEMPERATURE -
°c
Figure 5. low level Output Voltage
vs. Temperature.
70
",---I,.7.5mA
----1
tpHL
1--
~
~~TPUT~I
tPLH
__ _
r---
1' __ --1.5V
Figure 6. Test Circuit lor tpHL and tpLH'
160
70
~
60
;::
50f-
"0z
go
f';
30
20
~k!l
f-
'\
i-"'"
t--
40
,
'PCH I AL •
;;:'""
0
1------j---IJ=3.75mA
"'&.4rnA
20
AL
6
GNO
<
,.I
·CL is approximately 15 pF, which includes
probe and stray wiring capacitance.
_ *0' 9.(l;nA --1
0.2
80
'5V
tA "'0010
/'
/
/'
,.......F-~.
tPHL RL, '" 350n, lkG, 4kQ
VtPLH\Rl ""I 3502,,I 1kn.
0
10
20
30
40
50
TA - TEMPERATURE _
60
°c
Figure 7. Propagation Delay vs.
Temperature,
70
>
RL
"oz
Output Vo
~
Monitoring
~
Node
~
o
g:
3.0V
~PUT
I
r--~~TPUT~_1'5V
~
°0~WW~'UO~-'2~0~~3~0~~~-L5~0~~6~0~~70
TA - TEMPERATURE -
II - PULSE INPUT CURRENT - rnA
Figure 8. Propagation Delay vs. Pulse
Input Current.
°c
Figure 9. Rise, Fall Time vs.
Temperature.
J-----};---15V
tEHL
1-
-----.,
tELH
Figure 10. Test Circuit for tEHL and t ELH .
~ 12000 ~.,
I
~
"oz
III: = OmA
VOH : 2.0 V:::..
--
~ 8000
l-
-- f-- I----
i::
~
~
«
"g:
6000
I-
~
-'
'"
«
4000
I-~L A~D C1MH
~
i::
~ 2000
SWITCH AT A: II =0
I
5V
CM H
SWITCHATB: I. =7.5mA
TA - TEMPERATURE -
°c
Figure 11. Enable Propagation Delay
vs. Temperature.
Vo 0.5 V _ _ _- ' "-
o.e V
VOL -
RL = 350 I)
• ~C
TA
a:
HP 80078
PULSE GEN
w
-
:;
:;
~
00
200
:;
o
Vo (max.)
400
600
BOO
TRANSI ENT AMPLITUDE -
Figure 12. Test Circuit for Common Mode
Transient Immunity and
Typical Waveforms.
V
Figure 13. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.
______ LGNDBUS (BACK)
~z
~
i
o~
01~ flj
~ii5
N.C.
n-I-:-"=1H9i"r-----":'--/.:\
1.21*"-1--I--+--t-
\==m==¢=
ENABLE
(IF USED)
1.1I*"-"'ook;:--I--+--t-
~ ~ 1.0 I*"-f--I""""cl--t--+i¥-i¥---I
OUTPUT 1
N.C.
a:1I
"'i~
ENABLE
(IF USED)
2S ~
ii
OUTPUT 2
Figure 14. Relative Common Mode
Transient Immunity vs.
Temperature.
Figure 15. Recommended Printed Circuit
Board Layout.
161
1000
VCM - COMMON MODE
w
"~ ~ 1.31*"~1*"-I.....,,-+--t-
_
IJH '" 7.5mA_
::>
:;
~
[
Vee'" 5.0 V
>
i 10000
HEWLETT' PACKARD
COMPONENTS
DUAL DTL/TTL
COMPATIBLE OPTICALLY
COUPLED GATE
HCPL-2630
(5082 -4364)
TECHNICAL DATA
+:3
V~' 2
•
APRIL 1977
OUTLINE DRAWING
Vee
Vo ,
;:::::::
TYPE
NUMBER
:..:'"-+-
NOTE:
A.D1 TO O.l~F BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS BAND 5
DATE
COOE
Iill~
ijIl:m/
6.60 f
7. .3101
+
r
TYP~.i
5
GND
Features
•
•
•
•
•
•
HIGH DENSITY PACKAGING
DTLITTL COMPATIBLE: 5V SUPPLY
ULTRA HIGH SPEED
LOW INPUT CURRENT REQUIRED
HIGH COMMON MODE REJECTION
GUARANTEED PERFORMANCE OVER
TEMPERATURE
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF UNDERWRITERS
LABORATORIES, INC. (FILE NO. E55361)
• 3000Vdc INSULATION VOLTAGE
Recommended Operating
Conditions
Description/ Applications
The HCPL-2630 consists of a pair of inverting optica lIy coupled
gates each with a GaAsP photon emitting diode and a unique
integrated detector. The photons are collected in the detector
by a photodiode and then amplified by a high gain linear amplifier that drives a Schottky clamped open collector output
transistor. Each circuit is temperature, current and voltage compensated.
This unique dual isolator design provides maximum DC and AC
circuit isolation between each input and output wh ile achieving
DTL/TTL circuit compatibility. The isolator operational parameters are guaranteed from O°C to 70°C, such that a minimum
input current of 5 mA in each channel will sink an eight gate
fan-out (13 mAl at the output with 5 volt VCC appl ied to the
detector. This isolation and coupling is achieved with a typical
propagation delay of 50 nsec.
The HCPL-2630 can be used in high speed digital interface applications where common mode signals must be rejected such
as for a line receiver and digital programming of floating power
supplies, motors, and other machine control systems. The elimination of ground loops can be accomplished between system
interfaces such as between a computer and a peripheral memory, printer, controller, etc.
The open collector output provides capability for bussing,
strobing and "WIRED-OR" connection. In all applications, the
dual channel configuration allows for high density packaging,
increased convenience and more usable board space.
Input Current, Low Level
Each Channel
Input Current, High Level
Each Channel
Supply Voltage, Output
Fan Out (TTL Load}
Each Channel
Operating Temperature
Sym.
Min.
Max.
Units
IFL
0
250
pA
IFH
6.34.5
10
5.5
mA
0
8
70
V.cc
N
TA
V
°c
Absolute Maximum Ratings
(No derating required up to 70°C)
Storage Temperature ................. -55°C to +125°C
Operating Temperature .................. O°C to +70°C
Lead Solder Temperature ................. 260°C for 10s
11.6mm below seating plane)
Peak Forward Input
Current (each channell '..... 20 mA (.;;; 1 msec Duration)
Average Forward Input Current (each channel) ..... 10 mA
Reverse Input Voltage (each channell. . . . . . . . . . . . . . .. 5V
Supply Voltage - Vee .......... 7V (1 Minute Maximum)
Output Current - 10 (each channell .. . . . . . . . . . . .. 16 mA
Output Voltage - Vo (each channell ................ 7V
Output Collector Power Dissipation ............. 60 mW
162
*6.3mA condition permits at least 20% eTR degradation guardband.
Initial switching threshold is 5mA or less.
..
--
Electrical Characteristics
OVER RECOMMENDED TEMPERATURE (TA = O°C TO 70°C) UNLESS OTHERWISE NOTED
~;
J!IMI""-'_
Symbol
Parameter
High Level Output Current
~!
leeH
~~~~""~'
leeL
'~-OutpUt
11-0
1').~~
I
Units
250
,PA
-.
Test ~itlons,
;.
.
..
~
~SulationLeakage Current
~acitance (Input-Output)
.
·Itager;r~
•.
v'cc
14
30
'mA
26
36
mA
Vee" 5.5Y,JF =10mA
(Both. <::ham,els)
.
Uf'
JJ.A
•Relative Humidity" 4&% .
TA .. 2sQ C, t l" .55, ' .
.
VI-o ., 3000Vdc
;"s.5y,i F =0
(Both Ch&nnels)
In_.aev~ Break~
Input Ca~itance
Input-Input Insulation
lea~.currentf+
_",':-.
"
VI.O' .. 500V. TA" 25°C
CI.O
pF
f = 1MHz, T A .. 25"C
::BVR
.,
,:./,;;;:.
1.5
1.75
'5
CIN
60
11.-1
0,005
V
'.I
~",put-"",," .
Current Transfer Ratio
'.,
IF '" lOmA. T A" 25°C
0
4
4
.,~.
;~
~
.",:'/
..,..
;,l~~~E'
.,
V
IR = 10pA. TA '" 25°C
pF
VF .. O,f= .1MHz
3
Relative Humidity .. 45%.
t=55,V 1-1",500V
8
8
JJ.A
-;!:
'Resistance (Input-Input)
"t:-
n
0.6
ft2
.'!o{iVoltage i,
.;; ,:;; 5.i'.
10 12
(~.·,n.:t
3
t3mA .
RI_Q
VF
3
"
Vee =5.5Y. IF'" .SinA
V
.~ Th~~ ~ , ~~~tG'7!~~i}~'~~y
~istance fl nput-Output}
Note
,Figure
Vee =,~.5V"VO ,;,S:5'i1,
IF = 250pA
IoL (Sinking) '"
High Level SupplV Current
i
',>,,:"
Max.
0.5 .. 0.6
VOL
.
, TYp."
50
IOH
low'i.evel Output Voltage
~
Min;
RI·!
lOll
n
VI.'" 500V
CI-t
0.25
pF
f= lMHz
CTR
700
%
IF ':' 5.OmA, RL .. 100n
8
2
6
• All typical values are at Vee = 5V, T A = 25°e
r
Switching Characteristics at TA=25°C, Vcc=5V
l/
EACH CHANNEL
7l"*
Paramllter
SymbOl
Min.
Typ.
Max.
Units
Test Conditions
Figure
Now
Propagation Delay Time to
:,>:;:·High Output level
tpLH
55
75
os
RL =3500. Cl ~ 15pF,
IF =7,5mA
5,6
1
Propagation Delay Time to
low Output level
tpHL
40
75
ns
RL ~ 350 0. Cl .. 15pF,
IF.=1.5mA
5,6
2
Output Rise·Fall Time ( 10-90%)
tr. tf
25
ns
Common Mode Transient
CMH
50
V/JJ.S
Rl = 350U,C": = 15pF.
IF= 7.5mA
VCM'" 10Vp_p ,
Rl = 350n,
(min,} .. 2V.IF" OmA
8
5
8
5
~Immunity at High Output level
"0
7.<:
Common Mode Transient
Immunity at low Output ,Level
CML
-150
Vljl.s
VCM '" 10Vp _ p •
RL =
Vo (max,! ., O.8V
350n
IF" 7,5mA
NOTE:
It is essential that a bypass capacitor !.01I'F to O.lI'F, ceramic) be connected from pin 8 to pin 5, Total lead length between both
ends of the capacitor and the isolator pins should not exceed 20mm. Failure to provide the bypass may impair the switching prop·
erties.
163
NOTES:
Vcc<= 6.0V
1. The tpLH propagation delay is measured from the 3.75 rnA point
TA""25°C-
\' ~
on the trailing edge of the input pulse to the 1.5V point on the trailing edge of the output pulse.
\\
\
2. The tPHL propagation delay is measured from the 3.75 rnA point
on the leading edge of the input pulse to the 1.5V point on the
Rl
35iin
4kil
\t /;kH
leading edge of the output pulse.
X\
3. Each channel.
4. Measured between pins 1, 2, 3, and 4 shorted together, and pins 5, 6,
7, and 8 shorted together.
\:
o
o
5. Common mode transient immunity in Logic High level is the maxi-
mum tolerable (positive) dVCM/dt on the leading edge of the common mode pulse, VCM, to assure that the output will remain in a
"
IF - INPUT DIODE FORWARD CURRENT -- rnA
Logic High state (Le., VO>2.0V). Common mode transient immunity
in Logic Low level is the maximum tolerable (negative) dVCM/dt on
the trailing edge of the common mode pulse signal, VCM, to assure
that the output will remain in a Logic Low state (i.e., VO<0.8V).
6. DC Current Transfer Ratio is defined as the ratio of the output collector current to the forward bias input current times 100%.
7. At 10mA VF decreases with increasing temperature at the rate of
~~~-1"--o +5V
Vo
1.9mVtC. '
8. Measured between pins 1 and 2 shorted together, and pins 3 and 4
shorted together.
Figure 3. Input-Output Characteristics.
40
"
E
I
30
....
iiia:
a:
u
a:
:": / ,;rmA
J .- .,'"
~/
:>
20
I
.,•
0
....
I
~
,
0
u
I
.P
10
"."'"
4,!;imA
....
, ," ri . . . . - , r
k'
I
~.
mA
.;..
~
I
,/
,,~~
......
~
1""",
TA '" 2S'C
,
3 rnA
V
."
....
....
-
---
.....- -- --
[,smA
.........
10
--LOW LEVEL
INPUT CURRENT
RANGE
Va - COLLECTOR VOLTAGE - V
NOTE: Dashed characteristics indicate pulsed operation.
10-'
L-~~L-J-~L--L~
1.0
1.1 1.2
1.3
1.4
1.5
__~~__~~
1.6
1.7
1.8
1.9
2.0
VF' INPUT FORWARD VOLTAGE -V
Figure 4. Input Diode Forward Characteristic
CURVE
TRACER
TERMINALS
Figure 2. Isolator Transfer Characteristics.
164
+SV
GE:~~~Q~'~~~
HPSOO1
}-----'F~~
c
ZO "" 60n
RL
tR .. 50s
INPUT
MONITORING
NODE
47
*
CL
n.
OUTPUT
MONITORING
NODE
Cl is approximately 15 pF, which includes
probe and stray wiring capacitance.
-
INPUT
'F
-
- 350mV (IF '" 7.5mAI
J-----\---17SmVIIF=3.7SmAI
-I
tPHL
I---
-I
r---
tplH
I_____
~
~~TPUT
'
\ _______
IFH - PULSE INPUT CURRENT· rnA
VaH
1.5V
- - - - - VOL
Figure 6. Propagation Delay, tpHL and tPLH
.... Pulse Input Currant, I FH.
Figure 5. Test Circuit for tpHL and tpLH.
r---I~~-----------------------------------I.~r--oChanA
+SV
'NPUT
Chan A
IL-___
Ch,n B
--+'---,
0----1;>0---1
Chan B
I-~----j---,----o +5V
7404
--l
I
1_____ 1
I
tDL '" 50 ns (delay in response to
logic low level input)
~---"
·1 1 -
tOH '" 30 ns (delay in response to
logic high level input)
TA"'2SoC
l
Figura 7.
Response Delay Between TTL Gates.
t r '" 160n$
+5V
tf = 5505
.00/-1F
BYPASS
350n
Va
Va
'--""
SV
SWITCH AT A: IF= OmA
VCM
SWITCH AT B:
n
~VOL
Va
HP 8007
PULSE GEN.
IF'" 5mA
Figure 8. Test Circuit for Transient Immunity and Typical Waveforms.
165
-=
HEWLETT
j
LOW INPUT CURRENT,
HIGH GAIN OPTICALLY
PACKARD
COUPLED ISOLATORS
COMPONENTS
6N138 (5082 -4310)
6Nl39 (5082-4311)
TECHNICAL DATA APRIL 1977
OUTLINE DRAWING"
SCHEMATIC
Vee
B
!
Icc
5" TYP,
ANODE]2
'e.....
+
Ul
2
3
4
RECOGNITION
-..I2....l-~~
IL
u
1.60 tJJ631 MAX. OIMENSIONStN MILllMETRES AND \INCHES)
0.89 (035) MIN.
;~t
o"~~
!
II
,
0.65 !'02a} I
_iii
MAX.
-,--"\ Ir---
-t
t
VF
~
CATHODE -
3
4,70 (.185) MAX.
D.51 1.:201 MIN.
ANOIJE
2
CAn-WOE
3
5
~GND
2.92 (.115) MIN.
7
"13
~~~tm5
Features
Applications
•
•
•
•
•
•
•
•
•
•
•
HIGH CURRENT TRANSFER RATIO - 800% TYPICAL
LOW INPUT CURRENT REQUIREMENT - 0.5mA
TTL COMPATIBLE OUTPUT - O.W VOL
3000 Vdc INSULATION VOLTAGE
HIGH COMMON MODE REJECTION - SOOV/IlS
PERFORMANCE GUARANTEED OVER TEMPERATURE
O°C to 70°C
BASE ACCESS ALLOWS GAIN BANDWIDTH
ADJUSTMENT
HIGH OUTPUT CURRENT - 60mA
DC TO 1M bitls OPERATION
RECOGNIZED UNDER THE COMPONENT PROGRAM
OF UNDERWRITERS LABORATORIES, INC.
(FILE NO. ES5361)
Ground Isolate Most Logic Families - TTL/TTL, CMOS/
TTL, CMOS/CMOS, L TTL/TTL, CMOS/L TTL
•
Low Input Current Line Receiver - Long Line or Partyline
•
EIA RS-232C Line Receiver
•
Telephone Ring Detector
•
117 Vac Line Voltage Status Indicator - Low Input Power
Dissipation
•
Low Power Systems - Ground Isolation
Description
These high gain series isolators use a Light Emitting Diode and
an integrated high gain photon detector to provide 3000V dc
electrical insulation, 500V /,us common mode transient immunity and extremely high current transfer ratio between input
and output. Separate pins for the photodiode and output
stage result in TTL compatible saturation voltages and high
speed operation. Where desired the Vcc and Vo terminals
may be tied together to achieve conventional photodarlington
operation. A base access terminal allows a gain bandwidth
adjustment to be made.
The 6N139 is suitable for use in CMOS, LTT L or other
low power applications. A 400% minimum current transfer
ratio is guaranteed over a 0·70°C operating range for only
0.5mA of LED current.
The 6N138 is suitable for use mainly in TTL applications.
Current Transfer Ratio is 300% minimum over 0·70°C for an
LED current of 1.6mA [1 TTL unit load (U.L.)]. A 300%
minimum CTR enables operation with 1 U.L. in, 1 U.L. out
with a 2.2 kn pull-up resistor.
• JEDEC Registered Data.
Absolute Maximum Ratings *
Storage Temperature . . . . . . . . . . . . . _55°C to +125°C
Operating Temperature. . . . . . . . . . . . . . .. O°C to +70°C
Lead Solder Temperature . . . . . . . . . . . .
260°C for lOs
(1.6mm below se3ting plane)
Average Input Current - IF . . . . . . . . . . . . . . . . 20mA [1]
Peak Input Current - IF . . . . . . . . . . . . . . . . . . . . 40mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF' . . . . . . . . . . . .. 1.0A
(.;;; l,us pulse width, 300 pps)
Reverse Input Voltage - VR . . . . . . . . . . • • . • . • . . . 5V
Input Power Dissipation . . . . . . . . . . . . . . . .. 35mW [2J
Output Current - 10 (Pin 6) . . . . . . . . . . . . . . 60mA [3]
Emitter·Base Reverse Voltage (Pin 5·7) . . . . . . . . . . . 0.5V
Supply and Output Voltage - VCC (Pin 8·5), Vo (Pin 6·5)
5082·4370 . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7V
5082-4371 . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 18V
Output Power Dissipation . . . . . . . . . . . . . . . . 100mW [4]
See notes, following page.
166
Electrical Specifications
OVER RECOMMENDED TEMPERATURE (TA = O°C to 70°C), UNLESS OTHERWISE SPECIFIED
Parameter
Sym.
Current Transfer Ratio
CTR·
Logic Low
Output Voltage
VOL
Logic High
Output Current
Device
400
800
%
IF=0.5mA,Vo=O.4V,Vcc~4.5V [,·c.'
6N139
500
900
'. IF= 1.6mA, Va = 0.4V, VCC~4.5V I'n,
~6~N~I~3~S~~30A.O~+-'6~0~0--t-~--t--.~~---+'lt~~=~lr,6~m~A~,"v~0~=~0~.A4V~,vuC~C~=74~.5"V.1
6N138
0.1
O. t
0.2
0.1
0.4
O . 4 c •...
....
.0.4
0.4
V
IF = 1.6mA, 10 = 6.4mA, VCC = 4.5V
IF =5 rnA,,"! 0 =15mA, Vec = 4.5V
IF =12rriA, 10.= 24mA. Vee "04.5V
IF = 1.6mA, 10 = 4.8mA. VCC = 4.5V
6N139
6N138
0.05,
0.1
100
250
IF" OmA. Va - Vec = 18V
IF = OmA, Va,.. Vce= 7V
6N139
Logic Low
Supply Current
feCL
Logic High
Supply Current
tCCH
10
Input Forward Voltage
VF'
1.4
mA
Input Reverse
:c'i:
Breakdown Voltage •...~;." BVR'
IF
= OmA, Vo =Open, VCC = 5V
6
1.7
V
Temperature Coefficient
of Forward Voltage"
3:'fA
-1.8
Input CapaCitance
CIN
60
Input - OutPut
Insulation Leakage
Current
1,.0·
AVF
1.0
Resistance
10"
(I nput·Output)
Capacitance
(Input-Output)
nA
IF ='L6mA, Va =open', Vce = 5V
VI.O
7
pF
0.6
CI·O
= 500Vdc
7
• 'AII typicals at TA = 25"C and VCC = 5V, unless otherwise noted.
Switching Specifications
AT TA= 25°C
Parameter
gym.
---Propagation Delay Time
To Logic Low at Output tPHL*
Device
6N139
6N138
Propagation Delay Time
tPLH*
To Logie High at Output
6N139
6N138
Min.
Typ.
Max.
5
25
0.2
1
1
5
1
4
" 10
60
Units
ps
1'5
7
" I'S
35
/is
Test Conditions
Fig.
Note l>i
IF ~ 0.5mA, RL 4.7kU
IF ~ 12mA, RL ~ 270n
IF - 1.6mA, RL - 2.2kn
9
6,8
IF - 0.5mA, RL = 4.7kU.~: .•
Ip ~ 12mA, RL = 270n, . .-:
IF = 1.6mA, RL - 2.2kU
9
6,8
Common Mode Transient
Immunity at Logic High CMH
Level Output
500
VII'S
IF = OmA, RL = 2.2kU, Ree = 0
IVcml= lOVp•p
10
9,10
Common Mode Transient
Immunity at Logic Low eML
Level Output
-500
VII'S
IF = 1.6mA, RL = 2.2kn, RCC = 0
IVcml= 10Vp p
10
9.10
o
iC:
NOTES:
1. Derate linearly above 50°C free-air temperature at a rate of O.4mA/oC.
2.
3.
4.
5.
6.
7.
8.
9.
1 a.
Derate linearly above 50·C free-air temperature at a rate of 0.7mwtC.
Derate linearly above 25°C free-air temperature at a rate of 0.7mAtC.
Derate linearly above 25°C free-air temperature at a rate of 2.0mwtC.
DC CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10, to the forward LED input current, IF, times 100%.
Pin 7 Open.
Device considered a two·terminal device: Pins 1.2,3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
Use of a resistor between pin 5 and 7 will decrease gain and delay time. See Application Note 951·1 for more details.
Common mode transient immunity in Logic High level is the maximum tolerable (positive) dVcm/dt on the leading edge of the common mode
pUlse, Vern, to assure that the output will remain in a Logic High state (I.e., Va> 2.0VL Common mode transient immunity in Logic Low level
is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode pulse signal, Vern, to assure that the output will remain
in a Logic Low state (i.e., Va < a.8V).
In applications where dV Idt may exceed 50,OaOV II'S (such as static discharge) a series resistor, Rce, should be included to protect
the detector IC from destructively high surge currents. The recommended value is RCC ~
1V
kn.
0.15 IF (rnA)
• JEDEC Registered Data.
167
50
Vcc"*6V
TA ~2$'C
--
r-
"
"E r
l-
I-
E
I
tF1=s.omA
I
iiia:
~
iiia:
a:
a:
::>
::>
"::>
"::>
l-
25
~
::>
0
::>
0
I
.9
3.oroA.
Z.5I'\1A
2.0mA
V
y
I
.9
1.SroA
V
~r
1.0roA
a.SmA
Va
Vo - OUTPUT VOLTAGE - V
Figure 1. 6N139 DC Transfer Characteristics.
-
3.smA
~
I-
~
4.5-mA
4.omA
-OUTPUTVOLTAGE-V
Figure 2. SNl38 DC Transfer Characteristics.
100
L2j
~
J
I
I
1000
I
o
~
~
10
I
a:
~
ffi
a:
a:
~
a:
C,.)
ffi
a:
a:
1.0
/
it
::>
"a:I
1
t;
IF - FORWARD CURRENT - rnA
.0 1
1.1
Figure 3. Current Transfer Ratio vs. Forward Current.
/ {J.IF
::>
o
~
~
I-
/
1.2
1.3
1.4
1.5
1.6
-
'.7
1.8
VF - FORWARD VOLTAGE - V
Figure 4. Input Diode Forward Current vs.
Forward Voltage.
100. .-.,.....---_,-.-_ _- - _ , _ - - - - - . - - - - ,
~
100.,----_:_-,-----..,.------_:_--,
~
10.1-'''-'--'--'--'--'"r--
I
10.r------r------f-:;""'----r----j
I
I-
ffi
~
a:
a:
VCC"- SV
::>
Vo=O.4V
"
~
1.0 1-'-----j----...-.rF-j-------j-----I
a:
::>
"::>
I-
~
0.10 f------~c.,..~,,----\------t----l
5
o
.2 0.010
.9 0.010 f----......,f-A'f----·-"----t-------I---I
I
I
1.0
10.
10.
IF - INPUT DIODE FoRwARD CURRENT - rnA
Figure 5.
IF - INPUT DIODE FORWARD CURRENT - rnA
Figure S. SN1380utput Current vs. Input Diode
Forward Current.
SN139 Output Current vs. Input Diode
Forward Current.
168
-
R)2,2Idl
IF- t.SmA
"'- 1/1 = 50..
r""
(SEE FIG. 10 FOR TEST CIRCUIT)
.'~
...........V
~
..... ......,.
3
...,.....V
\V
0
10
20
I
"'
;::
:;;
,
,\,/;"
"""
IH~;':'l
1
'1
V
30
40
50
60
70
80
RL - LOAD RESISTANCE - kn
Figure 8. Non Saturated Rise and Fall Times vs. Load
Resistance.
Figure 7. Propagation Delay vs. Temperature.
I:~
HP$OO7
PULSE
I
GEN.
I
5V
I
lo~601l
t,-5ns
'---~------~+5V
1/f< 1OOP5
1---.....
1,5V
----.-'0 Vo
If MONITOR
5V
10%
"
Figure 9. Switching Test Circuit. *
Rec*'"
t r• tf = 16n5
RL
I-------<~--O
Vo
A
Vo ----"'ii~--------- 5V
SWITCH AT A: IF= OmA
VCM
Vo ------------~VOL
SWITCH AT B: IF= 5mA
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
"See Note 10
'JEDEC Registered Data,
169
DUAL
.'LOW INPUT CURRENT,
HEWLETT~PACKARD
HIGH GAIN OPTICALLY
COMPONENTS
COUPLEDISOtATORS
HCPl-2730
HCPl-2731
TECHNICAL DATA APRIL 1977
OUTLINE DRAWING
TY1'£
NUMBER
DAT~
CDOE
SCHEMATIC
r--:::::;=;:::re:;:={
1
0.1' (,Olm
7.36 C_I 6.1.
7.88 (.3101 UO
I
!._
.... (.0,.\
t.26OJ
1
DIMENSIONS 11'1 MILLIMETflES Al'ID !INCHES!
Features
Applications
•
•
•
•
•
•
• Digital Logic Ground Isolation
•
•
•
•
HIGH CURRENT TRANSFER RATIO - 1000% TYPICAL
LOW INPUT CURRENT REQUIREMENT - 0.5 mA
LOW OUTPUT SATURATION VOLTAGE -1.0V TYPICAL
HIGH DENSITY PACKAGING
3000V DC INSULATION VOLTAGE
PERFORMANCE GUARANTEED OVER O°C TO 70·C
TEMPERATURE RANGE
HIGH COMMON MODE REJECTION
DATA RATES UP TO 200K BIT/s
HIGH FANOUT
RECOGNIZED UNDER THE COMPONENT PROGRAM OF
UNDERWRITERS LABORATORIES, INC. (FILE NO. E55361).
• Telephone Ring Detector
• EIA RS-232C LIne Receiver
• Low Input Current Line Receiver - Long LIne or Partyllne
• Microprocessor Bus Isolation
• Current Loop Receiver
• Polarity Sensing
• Level Shifting
• Line Voltage Status Indicator - Low Input Power Dissipation
Description
The HCPL-2730/31 dual channel isolators contain a separated pair of GaAsP light emitting diodes optically coupled to a
pair of integrated high gain photon detectors. They provide extremely high current transfer ratio, 3000V dc electrical
insulation and excellent input-output common mode transient immunity, A separate pin forthe photodiodes and first gain
stages (Vee) permits lower output saturation voltage and higher speed operation than possible with conventional
photodarlington type isolators. The separate Vee pin can be strobed low as an output disable. In addition Vee may be as
low as 1.6V without adversely affecting the parametric performance.
Guaranteed operation at low input currents and the high current transfer ratio (CTR) reduce the magnitude and effects of
CTR degradation.
The outstanding high temperature performance of this split Darlington type output amplifier results from the inclusion of
an integrated emitter-base bypass resistor which shunts photodiode and first stage leakage currents to ground.
The HCPL-2731 has a 400% minimum CTR at an input current of only 0,5 mA making it ideal for use in low input current
applications such as MOS, CMOS and low power logic interfacing or RS232C data transmission systems. In addition, the
high CTR and high output current capability make this device extremely useful in applications where a high fanout is
required. Compatibility with high voltage CMOS logic systems is guaranteed by the 18VVee and Vo specifications and by
testing output high leakage (loH) at 18V.
The HCPL-2730 is specified at an input current of 1.6 mA and has a 7V Vee and Vo rating, The 300% minimum CTR allows
TTL to TTL -interfacing with an input current of only 1.6 mAo
Important specifications such as CTR, leakage current and output saturation voltage are guaranteed overthe O°C to 70 D C
temperature range to allow trouble-free system operation.
170
Electrical Specifications
(Over Recommended Temperature TA = DOC to 7DoC, Unless Otherwise Specified)
Switching Specifications at TA =25°C
}.'.
NOTES: 1.
2.
3.
4.
5.
Derate linearly above 5ct'C free-air temperature at a rate of O.5mArC.
Derate linearly above 5o"C free-air temperature at a rate of O.9mWtC.
Derate linearly above 35° C free-air temperature at a rate of O.6mArC.
Pin 5 should be the most negative voltage at the detector side.
Derate linearly above 3~C free-air temperature at a rate of 1.7mWrC.
Output power is collector output power plus supply power.
6. Each channel.
7. CURRENT TRANSFER RATIO is defined as the ratio of output
collector current, 10. to the forward LED input current, IF, times 100%.
8. Device considered a two-terminal device: Pins 1,2,3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted together.
9. Measured between pins 1 and 2 shorted together, and pins 3 and 4
shorted together.
171
10. Common mode transient immunity in Logic High level is the maximum
tolerable (positive) dVCM/dt on the leading edge of the common mode
pulse VCM, to assure that the output will remain in Logic High state
O.e., Va > 2.0VI. Common mode transient immunity in Logic Low
level is the maximum tolerable (negative) dVCM dt on the trailing edge
of the common mode pulse signal, VCM. to assure that the output will
remain in a Logic Low state (I.e., Va < 0.8V).
11. In applications where dV/dt may exceed 50,000 V/~s (such asa static
discharge) a series resistor, Rce, should be'included to protect the
detector Ie from destructively high surge currents. The recommended
... _ _1_V_ _ kn.
value is R
ee
0.3 IF (mAl
Absolute Maximum Ratings
Storage Temperature .......... -55°C to +125°C
Operating Temperature ......... -40°Cto+85°C
LeadSolderTemperature ....... 260°Cfor10sec
(1.6mm below seating plane)
Average Input Current - IF
(each channel) ..................... 20 rnA [1]
Peak Input Current - IF
(each channel) . . . . . . . . . . . . . . . . . . . . . .. 40 rnA
(50% duty cycle, 1 ms pulse width)
Reverse Input Voltage - VR
(each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Input Power Dissipation
(each channel) . . . . . . . . . . . . . . . . . . .. 35 mW (2)
Output Current - 10
(each channel) . . . . . . . . . . . . . . . . . . .. 60 rnA (3)
Supply and Output Voltage- Vee (Pin 8-5), Vo {Pin
7,6-5)[4]
HCPL-2730 ........................ -0.5 to 7V
HCPL-2731 ....................... -0.5to 18V
Output Power Dissipation
{each channel) ................... 100mW[5]
1600 HCPW'/30
'#.
6 1400
i=
~ ~ 6V ----+.."...."":;;.~
~
Vo-OAV
1~~--~~~~~~.
:
;
tfCPL.273t
1000
~
I
I----.y.,~_t::~"rl''---!----I
6OO1----~~~~~~k---!----I
~ &OO1---~~~-+-----+~~+---4
a
~
'"'"::>
"
~
o
I
.»
I
~
1.0
3.0
'0
30
IF - FORWARD CURRENT - mA
Vo - OUTPUT VOLTAGE - V
Figure 1. DC Transfer Characteristics.
100
IF -INPUT DIODE FORWARD CURRENT -rnA
Figure 2. Current Transfer Ratio vs.
Forward Current.
Figure 3. Output Current vs. Input
Diode Forward Current.
100
TA!"'C
."ill
E
I
'"'"::>
"e
"'"~
I
10
1.0
/
~
I
0.1
I.'
/
12
1.3
I
HCPL~2790
I
V
HCPL-2731
W-
1.4
1.5
I,
1.6
1.7
1.8
VF - FORWARD VOLTAGE - V
Figure 4. Input Diode Forward Current
vs. Forward Voltage.
'00
IF - INPUT DIODE FORWARD CURRENT - rnA
Figure 5. Supply Current Per Channel
vs. Input Diode Forward Current.
172
•~O'-'-I...1..1.I.WIL--L..u.JWIJI,.-0..J...J..Lll11l,'-0--1-U
T - INPUT PULSE PERIOD - ms
Figure 6. Propagation Delay To Logic
Low VS. Pulse Period.
L
TA - TEMPERATURE _ °C
IF -INPUT DIODE FORWARD CURRENT - rnA
Figure 7. Propagation Delay vs.
Temperature.
Figure 8. Propagation Delay vs. Input
Diode Forward Curren!.
HP8OO1
Pljt..SE
HCPl·2730
HCPl-2731
GE,",
lO. ... ,
TVp.· ..
Units
tpHL
80
P$
IF" 1.OrnA, AL " 101<;£1
;~PHL*
5
ps
IF" 10mA, RL '" 220£1
Min.
tPLH
'~
"
50
1500
500-
,';";'<:ommon McIdotTransient
,"" Immunity at Logic
, LeveIO ... _tM:;
IF " 1.OrnA, AL .. 10kO
ps
IF" lOrnA, AL" 220£1
V/p$
IF" OrnA, AL" 10krA
Vlp$
Imm\lplty at Logic L~';~~;ii
L&ve~~tput'!
ps
~l
Common Mode Transient;;t}lt
Teat Condl1ions
IVernl" lOVp-p
IF" 1.0mA, RL" 10kn
IVeml- 10Vp _p
Fig.
Note
8
6,8
8
6,8
9
9
9
9
-< :'i;'"
'JEDEC Registered Data.
"AII typicals at TA = 25°C, unless otherwise noted.
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Derate linearly above 50° C free-air temperature at a rate of 0.4mAt C.
Derate linearly above 50°C free-air temperature at a rate of 0.7mWtC.
Derate linearly above 25°C free-air temperature at a rate of 0.8mAtC.
Derate linearly above 25°C free-air temperature at a rate of 1.5mWtC.
DC CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10, to the forward LED input current, IF, times
100%.
Pin 6 Open.
Device considered a two-terminal device: Pins 1, 2, 3 shorted together and Pins 4, 5, and 6 shorted together.
Use of a resistor between pin 4 and 6 will decrease gain and delay time. (See Figures 10 and 12).
Common mode transient immunity in Logic High level is the maximum tolerable (positive) dV cmldt on the leading edge of the common
mode pulse, Vcm , to assure that the output will remain in a Logic High state {i.e., Va > 2.5VI. Common mode transient immunity in
Logic Low level is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode pulse signal, Vcm , to assure
that the output will remain in a Logic Low state (i.e., Va < 2.5V).
175
10
100
°e
/
0(
•
I
~
a:
a:
°E
::>
"0a:
ii?
I
'"
1.
o§
::
/
'§
.0 1
1.1
1.2
1.3
80
H~-.l.c I- -+.,to~_
~;1''''
f
f/~'
::>
"~
.'!..
I
5
0
I
.I;
1.6
o
o
1.7
1.0
Va
Figure 1. Input Diode Forward Current
Forward Voltage.
~
~
z
1.8
I.' r--·~±---u.
.
~
0.8
~
~
::>
-
3~,..._
2tnA _ _
\m'"
0.5"~ :
-
l - I-
10,000
Vo'" 1.DV
~'L
NORMAUZEO TO:
O.01.':-I-1.-'--1..I.Lll,lL.0~'-'...u~10;';.0:-'.....J...!..I.J"'::,~00.0
5.0
IF - FORWARD CURRENT - rnA
Figure 3. Output Current vs. Input
Current.
E_ ......
---'i
CTROI", '""1.0mA
~
I
>
L
1000
V_RLll0'"
~
1.0 _,
'.0
3.0
2.0
-OUTPUT VOLTAGE-V
Figure 2. Typical DC Transfer
Charactaristics ..
VS.
TA"25"C
1.2
tJ
.
.
~~'t-: i- =
. .... - -
I-"
20
~-=::
O.2MA
TJ2WC
1.5
10-""
..... 1-
4C
VF - FORWARD VOLTAGE - V
a:
a:
"
I
~~
- o1.4
a:
a:
..ill
II
j
1
eo
"
>RL=22 n
"0~ ~\<
....
IE 10
.......
:.
~ '-,
1'--_... ............
0
z
0
~
5l"N
::l
0(
100
I
"za:
0
I
a:
t;
5
10
20
50 100
---
1.0
10
IF - FORWARD CURRENT - rnA
TA-2WC
-"':..........
15
20
TA - TEMPERATURE -
IF - FORWARD CURRENT - rnA
Figure 4. Current Transfer Ratio vs. ~
Input Current.
Figure 5. Propagation Delay
Current.
YS.
~c
Figure 6. Propagation Delay vs.
Temperature.
Forward
"0----/r----
vO---~J'i .=_~, ___~
t~.J f=.,-----,
!-,----
o
""8001
PULSE
GEN.
Zo =6O!1
t,"'fiot
Vo
IF MONITOR
I
!
1.0 '-L..lll1i!l.-~..illlllL-LL....illlJ.-1...L.Ll.LLJI
~1
1~
10
100
1000
_ __
~
:
5V ___ vo
2.5V
VOL
tPLH~
RL - LOAD RESISTOR - kn
Figure 7. Propagation Delay vs Load
Resistor.
Figure 8. Switching Test Circuit
+5V
Vo
' - - " " " " " _ - - - - - - - - 5V
SWITCH AT A: IF= OmA
Vo
------------~VOL
SWITCH AT B: IF
HP8007
PULSE GEN.
= 1.0 mA
Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.
176
Q
!;;
a:
a:
;[!!
..
2.0
1.8
1.6
1.4
a:
lIZ
W
a:
a:
::>
"Ii!
t - + -.....-oVo
..,.
N
:::;
a:
!i!
I
a:
t;
Figure 10. External Ba ..
Resistor, RX
IF - FORWARD CURRENT - mA
AX - EXTERNAL RESISTOR - kn
Figure 11. Effect of RX On
Current Transfer Ratio
Figure 12. Effect of R X On
Propagation Delay
Applications
75kil
TELEPHONE{
LINE
1N914
~I--~-t
~F
0.1
NOTE: AN INTEGRATOR MAY BE REQUIRED AT THE DUTPUTTO
ELIMINATE DIALING PULSES AND LINE TRANSIENTS.
·SCHMIDT TRIGGER RECOMMENDED
BECAUSE OF LONG tr. tf.
TTL Interface
Telephone Ring Detector
v
4N46
Vee
RS
ADD FOR
I
Vo
AC INPUT
Line Voltage Monitor
CMOS Interface
+VcCz
+vcc,o----.........--,
CHARACTER ISTIeS
RIN"" 3OMn., ROUT"'" 50n
VIN(MAX.I IS Vcc, -1V, LINEARITY BETTER THAN 5%
t--/-
VIN !MAx.1
R5>~
R.
22k
6.BI<
NOTE: ADJUST R3 SO VOUT = VIN AT VIN'" VIN (MAX.I
2
R,
-Vee,
0" 02 - 2N3904
Q3 - 2N3906
Analog Signal Isolation
177
DUAL CHANNEL
HERMETICALLY
SEALED OPTICALLY
COUPlED ISOLATOR
~1<' ...~
6Nl34
(5082-4365)
6Nl34 TXV (TX - 4366)
6N134 TXV B(TXB - 4366)
TECHNICAL DATA APRIL 1977
~
OUTLINE DRAWING"
15 Vee
~14
VOl
~12
.---+-=----o V02
~
NOTE:
A .01 TOO.1IJ.F BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS 15 AND 10.
\'.'
..
10
L-----+--+---O
4.32 (.110)
MAX.
GND
t
o.s1(.o201
-12"'N
Features
• HERMETICALLY SEALED
• HIGH SPEED
• PERFORMANCE GUARANTEED OVER _55° C TO
+125°C AMBIENT TEMPERATURE RANGE
• STANDARD HIGH RELIABILITY SCREENED
PARTS AVAILABLE
• TTL COMPATIBLE INPUT AND OUTPUT
• HIGH COMMON MODE REJECTION
• DUAL-IN-LINE PACKAGE
• 1500Vdc INSULATION VOLTAGE
• EIA REGISTRATION
11
GND
Recommended Operating
Conditions
TABLE I
~
. Input Current, Low Level
~~~ Each Channel
<:~": Input Current, High Level
:;\.'ii: Each Channel
,,,>' Supply Voltage
Fan Out (TTL Load)
Each Channel
Operating Temperature
Applications
•
•
•
•
•
Logic Ground Isolation
Line Receiver
Computer - Peripheral Interface
High Density Packaging
High Reliability Systems
"
Sym.
Min.
Max.
Unita
IFL
0
250
JJA
IFH
Vee
12.5"
4.6
20
5.5
mA
V
-55
125
N
TA
6
°e
Absolute Maximum Ratings*
Description
The 6N 134 consists of a pair of inverting optically coupled
gates, each with a light emitting diode and a unique high gain
integrated photon detector in a hermetically sealed ceramic
package. The output of the detector is an open collector
Schottky clamped transistor.
This unique dual isolator design provides maximum DC and
AC circuit isolation between each input and output while
achieving TTL circuit compatibility. The isolator operational
parameters are guaranteed from -55°C to +125°C, such that a
minimum input current of 10 mA in each channel will sink a
six gate fanout (10 mAl at the output with 4.5 to 5.5 V Vee
applied to the detector. This isolation and coupling is achieved
with a typical propagation delay of 55 nsec.
·JEDEC Registered Data,
10
178
(No derating required up to 125°C)
Storage Temperature ................. -65°C to +150°C
Operating Temperature ............... -55°C to +125°C
Lead Solder Temperature. . . . . . . . . . . . . . .. 260°C for 10s
(1.6mm below seating plane)
Peak Forward Input
Current (each channel) ....... 40 mA (,;;; 1 ms Duration)
Average Input Forward Current' (each channel) ..... 20 mA
Input Power Dissipation (each channel) ........... 35 mW
Reverse Input Voltage (each channel) . . . . . . . . . . . . . . .. 5V
Supply Voltage - Vcc ........................... 7V
Output Current - 10 (each channel) ... . . . . . . . . . .. 25 rnA
Output Power Dissipation (each channel) . . . . . . . . .. 40 mW
Output Voltage - Vo (each channel) . . . . . . ... . . . . . . . .. 7V
Total Power Dissipation (both channels) ......... 350 mW
**12.5mA condition permits at least 20% CTA degradation guardband.
Initial switching threshold is lOrnA or less.
,
/'
TABLE II
Electrical Characteristics
OVER RECOMMENDED TEMPERATURE (TA = -55°C TO +125°C) UNLESS OTHERWISE NOTED
,,
~,
t\l~"'!H~¥L:1 ji:.",1~
lot. (Sinkl~sf"'H'mA
':'Iif~c ~ 5.5V,)t'f:.~,a'
(&th Cha~ilels:) .
~i5V•. 1F=' ZatnA
'*AII typical values are at VCC= 5V, TA = 25"C
TABLE III
switching Characteristics
EACH CHANNEL
High Output'Level
Propagation Delay Time to
Low Output Level
rPutput.Rise-Fall Time
i,t: (10-90%l
Common Mode
'\';0 (min.) = 2V,
Transient Immunity 0.'
at High Output Level'
). Common Mode
'.,
RL : 5l0U, IF
=
,VCM '" 10V (peak),eo
'~:'~~ ~;;~~ ·~~~~i~Si;;.
'"
Transient Immunity ,\
at Lq~.•putPut J,.;~el
NOTES:
1.
2.
Each channel.
Measured between pins 1 through 8 shorted together and pins 9
through 16 shorted together.
3.
Measured between pins 1 and 2 or 5 and 6 shorted together, and
pins 9 through 16 shorted together.
4.
Measured between pins 1 and 2 shorted together, and pins 5 and 6
shorted together.
5. :hhee t~~:n~gP~~~:9~ii~~e ~~I;~t i~u~:a:~rteh~ fr05~
edge of the output pulse.
'JEDEC Registered Data"
~~~n~'~~~~~;:~i~;
6. The tpHL propagation delay is measured from the 6.5mA point on
the leading edge of the input pulse to the 1.5V point on the leading
edge of the output pu Ise.
7. CMH is the max. tolerable common mode transient to assure that
the output will remain in a high logic state (Le., Va > 2.0V).
8. CML is the max. tolerable common mode transient to assure that
the output will remain in a low logic state (j.e., Va < O.8V).
9. It is essential that a bypass capacitor 1.01 to O.lIlF, ceramic) "be connected from pin 10 to pin 15. Total lead length between both ends of
the capacitor and the isolator pins should not e,:,ceed 20mm.
179
100
..
I
10
E
t-
~
INPUT
I
a:
a:
1,0
""0
MON'TOR'NG
NODE
-- --,
.
2
16
~ Vee
'-.:' ......
.....
3
i
6
a:
I
0,1
8
t-
~
:!O
e-
I
-I(.
I
~ 0.01
1,4
1,6
2,0
1.8
eL*
10
-=-
J------\---
',;PUT
1,2
Vo
P
BYPASS
l"?l
F
9
,
1.0
1
Cl is approximately 15 pF, which includes
probe and stray wiring capacitance.
I
0.001
RL
11
UNO
7
;:
:r
5V
I
15
1.
:~~Ir::
1
47H
,,~-
a:
':0;:
~
PULSE
GENERATORh
HPS007B
20"501';
tR"'tlm
TA ""'25"C
VF' INPUT FORWARD VOLTAGE· V
~~TPUT
....
-
IF"13mA
',e6.5mA
-----I tPHl 1-I tPLH r-~VOH
1 ______
1_____
1.5V
- - - - - VOL
Figure 1. Input Diode Forward Characteristic
100
----
~-
~
>
60
0
j:
..
"~
-
["-
z
40
~
V
12
14
16
18
-=Vcc"'I3·0V
I
5
"~
4
>
3
~
2
~
10
~
9
8
TA"'2S?C_
\' \'\
\\
\\:
0
8
I
~
1
0
RI
~
5imi
",1kn
,,/ .4k!1
J<\
0
20
IF' PULSE INPUT CURRENT rnA
\.
0
2
Figure 3. Propagation Delay, tpHL and tpLH
vs. Pulse Input Current, IFH
4
8
10
6
IF - INPUT DIODE FORWARD CURRENT -mA
/.
'Z ::::...
2
~
~
/
80
/
Z
0
j:
..
"~
IE
~
'F)
Lt"
,/
tPHl
V
16
Vee
..........
±~.
15
14
4
13
6
11
7
ONO 10
5~'l~'2
/
k"
60
40
3
/
100
>
0
~
Vcc'*'5V
tF= 13tnA
flL = 510n
12
Figure 4. Input·Output Characteristics
T
120
Vo
.01 j.lF
BYPASS
6
>
20
6
RL
1I
11
GND
7
r--
+5V
15
14
6
tpHL
a
..........
16
:~'llr::
... ~-
IE
IZ: :--... Vee
3
--K ........ -- 8:"
k ........ -- -,- -- -
80
~
1
'F_
2
TA" 2S"'C
RL=51on.LAL=4iIF
BYPASS
Vo
9
VCM
IT
-=-
HP 8007B
PULSE GEN
10V - - - - -
20
VCM
a
OV
-40 -20
0
20
40
60
T A - TEMPERATURE·
BO
100
Vo
°c
Vo
Figure 5. Propagation Delay vs. Temperature
• JEDEC Registered Data,
IF'" 0
5V
120
Vo(min.)
Vo(m8x.)
.5V
1\
IF'" lOrnA
Figure 6. Typical Common Mode Rejection Characteristics/Circuit
180
High Reliability Test Program
,r'--
Hewlett Packard provides standard high reliability test programs, patterned after MIL-M-38510 in order to facilitate the
use of HP products in military programs.
Part Number System
HP offers two levels of high reliability testing:
• The TXV prefix identifies a part which has been preconditioned and screened per Table IV .
• The TXVB prefix identifies a part which has been preconditioned and screened per Table IV, and comes from a lot
which has been subjected to the Group B tests detailed in
Table V.
TABLE IV
6N134 H~\t
6N134 TXVB
{TX-43ilsf:i;:ir:i.(TXB~4365}
TXV Preconditioning and Screening - 100%
Examination or Test
1.
Pre~Cap Visual Inspection
2.
Electrical Test: 'OH, VOL,
3.
High Temperilture Storage
4.
Temperatur\i;,pycling ,.
5.
Acceleration
..
6.
Helium Leak Test
7.
Gross lea k Test
8.
Electrical Test:
9.
Burn-In
10.
11.
12.
13.
14.
Electrical Test: SamBasStep 2
Evaluate Ddft
Sample Electri<;i;lkTj!$1:: 10H, VOL, 'CCI-!, ICCl
4:V ·'C
Sample Electrical Test: tPlH. tpHL
External Visual
Max. AVOL = ,,20%
Per Table II, LTPD.,Z-; .
TA;' _55°C, +125°C 'to
Per Table II, TA=25"C, LTPD=7
TABLE V, GROUP B
roo.
Examination or Test
Subgroup 1
Physical Dimensions
Subgroup 2
Solderabllity
':i&;:
Condition
LTPD
15
See Product Outline Drawing
2008c'.
ib
:~&~;,:immersion within 2.5mm of body, 16
:::
Subgroup 3
Temperature Cycling
Thermal Shock
Hermetic Seal, Fine leak
Hermetic Seal, Gross Leak
End Points: 10H, VOL, ICCH, 'CCl, VF,
BVR, '1.0
Subgroup 4
Shock, non-operating
Constant Acceleration
End Points: Same as Subgroup 3
Subgroup 5
Terminal Strength, tension
Subgroup 6
High Temperature Life
End Points: Same as Subgroup 3
Subgroup 7
Steady State Operating Life
End Points; Same as Subgroup 3
MIL..sTD-883
"
Method
, .\&:i~
.:,
",
20
termlOatlons
15
1010'1
1011."..
1014
1014
Test Condition B
Test Condition A, 5 cycles
Test Condition A
Test Condition C, Step 1
Per Table II, TA ~ 25"C
2002
2001
1500 G, t =0,5 ms, 5 blows in each orientation
Xl, Y1. Y2
20KG, Y1
2004
Test ConditiOn A, 4,5N (lib,), 15s
1008
TA = 150°C
1005
VCC
15
15
181
= 5.5V, IF =13mA, '0 = 25mA, TA = 25·C
A= 7
i
HEWLETT
PACKARD
COMPONENTS
HERMETICALLY SEALED,
HCPL 2770
FOUR CHANNEL,
LOW INPUT CURRENT TXVHCPL - 2710
OPTOCOUPLER TXVBHCPL - 2770
TECHNICAL DATA
::~ -*--I"
-----
'"
3D
----5
OATEcooe
15
-'!
8.13(.3201
14
.__-+---=----oV01
1+----1...;;=;;;2:;;77;;0=;;;;;"L---I
PIN 1 IDENTIFIER
7.371.2901
7:87f]1O)
_t~
T
W!{,QQ!)
0.33 (.0131
~
13
•.....---I-t--'==---<>V02
I
I
7YW11ff1
'3
·0
5 --.,
70
.V;
----
L
T
r-r~~""i'"'r--'t
r-.---~----oVCC
~
iYPE hV, VBj
FEBRUARY 1977
~
12
•.....---I-t--'==--'OV03
~I' ;r W~
2.7$ r.ml
~
"'''=, ,
.....,..LMIN
0.51(.020)_1'
r
MAX.
DIMENSIONS 1111 MILLIMETERS
AND (INCHES).
11
.__--1--='----0 V"
4.321.1701
Mr·
2
T:
II
10
'--+-----+---oGNO
,.
1
20.06 hll!Q)
20.83(.8201-
•
-;:;
6
~
1
/
GNO
11
10
3.811.1501
MIN.
Outline Drawing
Schematic
Features
Description.
• HERMETICALLY SEALED
• HIGH DENSITY PACKAGING
• HIGH CURRENT TRANSFER RATIO: 500%
TYPICAL
• PERFORMANCE GUARANTEED OVER -55°C
TO 100°C AMBIENT TEMPERATURE RANGE
• STANDARD HIGH RELIABILITY SCREENED
PARTS AVAILABLE
• 1500 VDC INSULATION VOLTAGE
• LOW INPUT CURRENT REQUIREMENT: 0.5 mA
• LOW OUTPUT SATURATION VOLTAGE: 0.1V
TYPICAL
• LOW POWER CONSUMPTION
The HCPL-2770 contains four GaAsP light emitting
diodes, each of which is optically coupled to a
corresponding integrated high gain photon detector. A
common pin for the photodiodes and first stage of each
detector I C (Vcc) permits lower output satu ration voltage
and higher speed operation than possible with conventional photodarlington type optocouplers. Also, the
separate Vcc pin can be strobed low as an output disable
or operated with supply voltages as low as 1.6V without
adversely affecting the parametric performance.
The outstanding high temperature performance of this
split Darlington type output amplifier results from the
inclusion of an integrated emitter-base bypass resistor
which shunts photodiode and first stage leakage currents
to ground.
The high current transfer ratio at very low input currents
permits circuit designs in which adequate margin can be
allowed for the effects of CTR degradation over time.
Applications
•
•
•
•
•
•
•
•
•
The HCPL-2770 has a 300% minimum CTR at an input
current of only 0.5mA making it ideal for use in low input
current applications such as MaS, CMOS and low power
logic interfacing or RS-232C data transmission systems.
Compatibility with high voltage CMOS logic systems is
assured by the 18V VCC and by the guaranteed maximum
output leakage (IOH) at 18V.
Isolated Input Line Receiver
System Test Equipment Isolation
Digital Logic Ground Isolation
Vehicle Command/Control Isolation
EIA RS-232C Line Receiver
Microprocessor System Interface
Current Loop Receiver
Level Shifting
Process Control Input/Output Isolation
Important specifications such as CTR, leakage current,
supply current and output saturation voltage are
guaranteed over the -55°C to 100°C temperature range to
allow trouble free system operation.
182
Absolute Maximum Ratings
TABLE I
Recommended Operating
Conditions
Symbol
Input Current, Low Level
(Each Channel)
IFL
Input Current, High Level
(Each Channel)
IFH
Supply Voltag\!
Vec
Max,
Min.
Storage Temperature ............... -6S0Cto+1S0°C
Operating Temperature ............. -SsoC to +100°C
Lead Solder Temperature ..•.....•....• 260°C for 10s.
(1.6mm below seating plane)
Peak Input Current (each channel,
:;;; 1 ms duration) ••••........................ 20 mA
Average Input Current, IF (each channel) .....•. 10 mA
Reverse Input Voltage, VR (each channel)
SV
Output Current, 10 (each channel) ..••.•....... 40 mA
Output Voltage, Va (each channel)
-O.S to 20 VII]
Supply Voltage, Vee ........•.......... -O.Sto 20 VII]
Output Power Dissipation (each channel)
SO mW12]
Units
2
I/.A
0.5
5
rnA
1.6
18
V
TABLE II
Electrical Characteristics T A ~ -55°C to 100°C, Unless Otherwise Specified
Parameter
Current Transfer Ratio
Max.
Symbol
Min.
Typ.
CTR
300
300
200
1000
750
400
.005
260
I/.A
2
4
mA
.010
40
I/.A
1.4
1.7
V
V
Logic High Output Current
lOW.
Logic Low Supply Current
ICCl.ij
Logic High Supply Current
I ce!:fS",
Input Forward Voltage
Input Reverse Breakdown
Voltage
Temperature Coefficient of
of Forward Voltage
VF
BVR
%
%
%
~'i
It
5
-1.8
INF
Test Conditions
Units
Fig.lre
IF=0.5mA, VO~0.4V, Vec=4.5V
IF=1.6mA, VO=O.4V, VCc=4.5V
IF=6mA, VO=O.4V, VCC=4.5V
IF= Zl/.A
VO=VCc=18V,.,
IF1=IF2=IF3""lf4 I.SmA
VCC=18V B;,:
IF1=IF2=IF3- IF4=0
VCC=18V
IF=1.6mA, T A =25 C
'R=10I/.A, TA=25°C
3,4 <,<,il
3
' ,«'
'3;5,<
l!f
,.
IIIote " ""
2.0V).
10. CML is the maximum tolerable common mode transient to assure
that the output will remain in a low logic state (i.e. Vo < 0.8V).
11. In applications where dV Idt may exceed 50,000 V II'S (such as
a static discharge) a series resistor, RCC, should be included to
protect the detector IC's from destructively high surge currents.
The recommended value is RCC ~
1V
kn.
0.6 IF (mA)
183
'E"
I
~
a
LH-
Figure 7. Propagation Delay vs. Input Diode
Forward Current.
Figure 8. Switching Test Circuit.
+-,W"..-<>+5V
2.4- VF
R2~-'FVcc-VF-IFR2
Rl";~
Va - - -___" - - " ' " , , - - - - - - - - - 5V
r------,
SWITCH AT A: IF= OmA
,,
I
Va - - - - - - - - - - -...~VOL
SWITCH AT 8: IF'" 1.6mA
*See Note 11.
HP8007
PULSE GEN.
Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.
184
:5~I~yo~~~~~~g~t
--lL
IS NOT USED.
,,,
:
_____ ..J
Figure 10. Recommended drive circuitry
using TTL logic.
High Reliability Test Program
Hewlett Packard provides standard high reliability test
programs, patterned after MIL-M-38510 in order to
facilitate the use of HP products in military programs,
HP offers two levels of high reliability testing:
• The TXV prefix identifies a part which has been
preconditioned and screened per Table IV.
• The TXVB prefix identifies a part which has been
preconditioned and screened per Table IV, and comes
from a lot which has been subjected to the Group B
tests detailed in Table V.
Part Number System
Product
WithTXV
Screening
WithTXV
SCfeeni l1ll
Plus Group B
HCP\..-;1170
TXVHCPl-2770
TXVBHCPl-2770
COmmercial
TABLE IV TXV Preconditioning and Screening -100%
,
,
'
Mll·STD-883
Examination or Test
,I.
3.
4.
5.
S.
7.
Pre·Cap Visual'nspection
High Temperature Storage
Temperature Cycling
Acceleration
Helium Leak Test
Gross Leak Test
Electrical Test CTR, 10H, ICCL,
a
leCH, VF, BVR:
Burn.ln
1015
Electrical Test: Sameas step 7 and '1.0
Evaluate Drift
External Visual
2009
2.
9.
10.
11.
Conditions
Methods
OED Procedure
1008
1010
2001
1014
1014
72-4063,724064
72 hrs. @ IS0"C
-650 C to +1500 C
2OKG, Y1
Cood.A
Cood.C
T A = 26" e, per Table II
Vec = l8V,IF = 5mA, '0 = lOmA
t = 168 hr•. @TA = 100°C
T A = 25°C, per Table 1/
Max. bCTR = ±25% @ IF = I.SmA
TABLE V, Group B
Examination or T,st
c
MIL·STD·SS3
CondItion
Milthod
lTPO
Subgroup 1
Physical Dimensions
20,16
See Product Outline Drawing
15
Subgroup 2
Solderability
2003
Immersion within 2.5mm of bOdy, 8 terminations
20
1010
1011
1014
1014
Test ConditionS
Test Condition A, 5 cycles
Test Condition A
Test Condition C
15
Subgroup 3
Temperature Cycling
Thermal Shock
Hermetic Saal, Fine leek
Hermetic Saal, Gross Leak
End Points;
,CTR,IOH, fCCL 'CCH,VF,BVR
Subgroup 4
Shock, non-operating
Constant Acceleration
End POints:
Sa me a. Subgroup 3
Subgroup 5
Terminal Strength, tension
Subgroup 6
High Temperature life
End POints:
Same as Subgroup 3
Subgroup 7
Steady State, Operating Life
End Points:
Same as Subgroup 3
",
Per Table 11, T A = 25°C
15
2001
15000; t ~ 0,5 (llS, 5 blows in each orientation
Xl,Y', V2,
20KG, V,
2004
test Condition A, 4.5N (lib.), ISs.
15
1008 "
TA
1005
VCC = laV, IF
2002
185
=150" C, non-operating
=SmA, 10'" lOrnA, TA '" 100°C
Am 1
1\= 7
Emitters
• Features
• Advantages
• Benefits
Near IR emission
Visible
Facilitates alignment
Functions with most
silicon phototransistors
and photodiodes
Easy to use
Cost effective implementation
Plastic Package
Low cost
Cost effective implementation
HEMT 3300 uses isotrophic Provides floodlight type
beam
LED chip
Well suited for applications
that require a large area to
be irradiated
HEMT 6000 uses surface
emitter LED chip
Provides bright spot
of light
Facilitates focusing light on
active area of photodetector
HEMT 6000 has offset
wirebond
Active area of the chip
is not masked or
shadowed
Facilitates use with fiber
optics
HEMT 6000 has reCiprocal
optical port
Can function as an
emitter or narrow band
detector
Single device performs two
functions
PIN Photodiodes
• Features
• Advantages
• Benefits
Offset wirebond
Can be used with fiber
optics
Fiber can be placed directly
over active area
All HP PIN photodiodes
have anti-reflective coating
Converts more incident
radiation (light) into
photocurrent
High Responsivity
Wide spectral response
(ultraviolet through IR)
A single device can cover
the light spectrum plus
UV and IR
Works with a variety of
sources
Low junction capacitance
Wide bandwidth
Can detect high speed pulses
ULTRA Linear
Permits operation over
10 decades
Eliminates the need for
equalization
187
---~--.-- -.---~-~-------~-,.,--~--.,-.-.----.---.--~-~-------
670nm
I
HEWLETT
HIGH RADIANT
INTENSITY
PACKARD
COMPONENTS
HEMT-3300
-EMITTER
TECHNICAL DATA APRIL 1977
Features
package Dimensions
• HIGH EFFICIENCY
UNDIFFUSED,UNTINTED
(CLEAR) PLASTIC
I
5.08 (.200)
4.32 (.1701
T
\1' ,
• NONSATURATING OUTPUT
9.47 (.373)
7.95(.313)
• NARROW BEAM ANGLE
-~l
-1
1 -
• VISIBLE FLUX AIDS ALIGNMENT
• BANDWIDTH: DC TO 3 MHz
-0:\_0351
• IC COMPATIBLE/LOW CURRENT
REQUIREMENT
0.64 (.025)
2"'7
~~
_
ill
(1.05)
MIN.
Description
The HEMT-3300 is a visible, near-IR, source using a
GaAsP on GaP LED chip optimized for maximum
quantum efficiency at 670 nm. The emitter's beam is
sufficiently narrow to minimize stray flux problems, yet
broad enough to simplify optical alignment. This product
is suitable for use in consumer and industrial applications
such as optical transducers and encoders, smoke
detectors, assembly line monitors, small parts counters,
paper tape readers and fiber optic drivers.
(~~~.l
'-----_0-64~
~ r--- 0.36 (.014)
NOTES:
1. ALL DIMENSIONS ARE IN
MILLIMETRES (INCHES).
2. SILVER·PLATED LEADS
SEE APPLICATION
BULLETIN 33. CHIP CENTER ING WITHIN
THE PACKAGE IS
CONSISTENT WITH
FOOTNOTE
3-
OutlineT -1%
2.54
CATHODE
(.101
NOM.
Electrical/Optical Characteristics at TA=25°C
Symbol
Description
Ie
Axial Radiant Intensity
Ke
Temperature Coefficient
of Intensity
Max.
Min.
Typ.
Units
Test Conditions
200
600
J.lW/sr
If: =10 rnA
-0.009
"e- 1
IF '" 10 mA, Note 1
1/v
Luminous Efficacy
22
ImIW
Note 2
28%
Half Intensity Tota~ Angle
22
deg.
Note 3, IF
670
nm
Measured at Peak
nmfC
Measured at Peak,
Note 4
120
ns
IpEAK" 10mA
50
ns
IpEAK '" 10 mA Pulse
15
pF
\If" "" 0; f "" 1 MHz
APEAK
Peak Wavelength
AApEAK/~T
Spectral Shift Temperature
Coefficient
1r
It
Co
0.089
Output Rise Time
(10%-90%)
Output Fait Time
(90%-10%1
Capacitance
B~
Reverse Breakdown Voltage
\If"
Forward Voltage
1.9
~\If"/~T
Temperature Coefficient
of \If"
8JC
Thermal Resistance
=10 rnA
V
IR '" 100pA
V
IF =.10rnA
-2.2
mVfC
IF = 100pA
160
°CIW
Junction to cathode
lead at seating plane.
5.0
0
2.5
Figure
3.4
6
1
2
Notes: 1. Ie (T) = Ie (25 C)exp [Ke(T - 25°C)] 2. I v = Tlvle where I v is in candela, Ie in watts/steradian and Tlv in lumen/watt.
3. 9% is the off-axis angle at which the radiant intensity is half the axial intensity. The deviation between the mechanical and optical axis is
typically within a conical half-angle of five degrees. 4.~PEAK (T) = ~PEAK (25°C) + (8~PEAK/8T) (T - 25°C).
188
Maximum Ratings at TA=25°C
Power Dissipation ...........••.....•....... 120mW
(derate linearly from 50·C at 1.6 mWfOC)
Average Forward Current ...........•......... 30mA
(derate linearly from 50·C at 0.4 mA/·C)
Peak Forward Current ................... See Figure 5
Operating and Storage
Temperature Range ............... -55·C to +100·C
Lead Soldering Temperature .......... 260· C for 5 sec.
(1.6 mm [0.063 inch) from body)
IF - FORWARD CURRENT - mA
Figure 3. Relative Radiant Intensity versus Forward Current.
1.2
1.'
1.'
1.0
U
~
in
0.8
l!!
~
;::
~
1.1
!!!"
u~
1.0
Z E
iii...
1.2
>0
uo(
0.6
tt~
D."
!::fa
>N
j::i
0.8
0.0
:s"
~!
0.7
~
0.6
0:
0.5
.2 .3 .5
), - WAVELENGTH - nm
~AK -
Figure 1. Relative Intensity versus Wavelength.
VF - FORWARD VOLTAGE -
2 345
10
20 30 50 100
PEAK CURRENT - mA
Figure 4. Relative Efficiency (Radiant Intensity par Unit
Current) versus Peak Current.
v
tp - PULSE DURATION
Figure 2. Forward Current versus Forward Voltage.
-ps
Figure 5. Maximum Tolerabla Peak Current versus Pulse
Duration. (lDC MAX a. par MAX Ratings)
Figure 6. Far-Field Radiation Pattern.
189
700nm
HIGH .INTENSITY
SUBMINIATURE
EMITTER
HEMT-6000
TECHNICAL DATA APRIL 1977
Features
• HIGH RADIANT INTENSITY
• NARROW BEAM ANGLE
• NONSATURATING OUTPUT
• BANDWIDTH: DC TO 5 MHz
• IC COMPATIBLE/LOW CURRENT
REQUIREMENT
• VISIBLE FLUX AIDS ALIGNMENT
MECIWIICAL
AXIS
\
Description
The HEMT-6000 uses a GaAsPchip designed for optimum
tradeoff between speed and quantum efficiency. This
optimization allows a flat modulation bandwidth of 5 MHz
without peaking, yet provides a radiant flux level
comparable to that of 900nm IREDs. The subminiature
package allows opera~ion of multiple closely-spaced
channels, while the narrow beam angle minimizes
crosstalk. The nominal 700nm wavelength can offer
spectral performance advantages over 900nm IREDs, and
is sufficiently visible to aid optical alignment. Applications
include paper-tape readers, punch-card readers, bar code
scanners, optical encoders or transducers, interrupt
modules, safety interlocks, tape loop stabilizers and fiber
optic drivers.
NOT'"
1. ALLOIMetfSt0ft8 Aft£. IN MfLLlMETRf!$ (INCHES).
2. SlLVEft..P1.ATEt) LEAOS. $2:£ APftLt(;ATION 8Ul.U:TfN Sa USER MAY UNO t.EAbSA$stiO'NN'.
.. f;PO)(V ENCAPSULANT tfA$A REFRACTM INO£J(OF 1.53.
~ CHIP CENTERING W,THINTHE 'PA~QE 1$ CONStSTiNT
WITH FOOTNOll!. 3.
Maximum Ratings at TA = 25°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . .. 50 mW
(derate linearly from 70·C @ 1.0mW/·C)
Average Forward Current ...•................. 20 mA
(derate linearly from 70·C @ O.4mA/·C)
Peak Forward Current ......•............ See Figure 5
Operating and Storage
Temperature Range ................. -55· to +100· C
Lead Soldering
Temperature ...................... 260·Cfor5sec.
[1.6 mm (0.063 in.) from body)
~
- WAVELENGTH - nm
Figure 1. Relative Intensity versus Wavelength.
190
Electrical/Optical Characteristics at TA = 25°C
Ie
Radiant l ll1tensity along Mechanical
Ke
. Temperature Coefficient of Intensity
Min.
Tvp.
100
250
Max;
Units
p,W/sr
Axis
deg.
Note. 3, IF "'lOtnA
690·715
nm
Measured. @ Pea1< ." " . 1
.193
nmfe
Output R!se Time (1 0%-90%)
70
ns
Output Fall Time (90%-10%l
40
ns
65
pF
Capacitance
Reverse Breakdown Voltage
•..
Im/W
"~pectral Shift Temperature Coefficient
"'i
Note 1
-0.005
2.5
16
6
12
.forward Voltage
1.5
Note 2 ....
'.
.'.
6
V
1.8
V
mvfc
-2.1
Junction to cathode lead
at 0.79 mm (.031 in)
from body
NOTES: 1. I.(T) ~ Ie (25°C) exp [K. (T - 25°C)).
2. Iv ~f/vle where Iv is in candela. I. in watts/steradian. and £Iv in lumen/watt.
3. ell, is the off-axis angle at which the radiant intensity is half the intensity along the optical axis. The deviation between the
mechanical and the optical axis is typically within a conical half-angle of three degrees.
4. A (T)~ A (25°C) + (Ll.A /Ll.T) (T - 25°C)
PEAK
PEAK
~ f= TA =25'C
~
I
'~""
PEAK
m
100
I...
I
10
>;t:
E
"20
E
;!
a:
a:
w_
U'""
'""
fil"
N
:::>
""a:
;t:
,
II
"a:
;0
U:"
~" 1.0
ww
wN
::;
>::;
"a:
~~
:iE
e
0
wo
10
I
!
0.1
1.2
/
1.3
'11
I}
1.4
1.5
.)\. (.
1.6
VF - FORWARD VOLTAGE -
a: 10
,.•..
1.7
1.8
v
Figure 2. Forward Current versus
Forward Voltage.
IF - FORWARD CURRENT - rnA
Figure 3. Relative Radiant Intensity
versus Forward Current.
IpEAK - PEAK CURRENT - rnA
Figure 4. Relative Efficiency (Radiant Intensity
per Unit Current) versus Peak Current.
0
0.30
0.25
0.20
i=
a: w
">-'
'Ww
""'"
~:i
'""2
~8
~~
x>
0.15 :::>-
-''''
~"
0.10
0.05
@:5:
N:I:
::it::
P
"'0
2
tp - PULSE DURATION -p.s
NORMALIZED INTENSITY
Figure 5. Maximum Tolerable Peak Current versus Pulse
Duration. (IDe MAX as per MAX Ratings)
8- OFF-AXIS ANGLE - DEGREES
(CONE HAlF.ANGlE)
Figure 6. Far-Field Radiation Pattern.
191
~~
HEWLETT ~ PACKARD
5082-4200
PINPHOTODIODES
SERIES
COMPONENTS
TECHNICAL DATA
APRIL 1977
ll-
Features
Active area: 1mm Diam 5082-420
TALL SIZE
5082-4203
{
0.5mm Diam 5082-4204 (TO-18)
5082-4220 - Short (TO-46)
0.25mm Magnified 2.5x 5082-4205 - Subminiature
• HIGH SENSITIVITY (NEP<-108 dBm)
• WIDE DYNAMIC RANGE (1% LINEARITY
OVER 100 dB)
• BROAD SPECTRAL RESPONSE
• HIGH SPEED (Tr, Tf,<1ns)
• STABILITY SUITABLE FOR PHOTOMETRY/
RADIOMETRY
• HIGH RELIABILITY
• FLOATING, SHIELDED CONSTRUCTION
• LOW CAPACITANCE
• LOW NOISE
Description
The HP silicon planar PIN photodiodes are ultra-fast light
detectors for visible and near infrared radiation. Their
response to blue and violet is unusually good for low dark
current silicon photodiodes.
The 5082-4203, -4204, and -4207 are packaged on a
standard TO-18 header with a flat glass window cap. For
versatility of circuit connection, they are electrically
insulated from the header. The light sensitve area of the
5082-4203 and -4204 is 0.508mm (0.020 inch) in diameter
and is located 1.905mm (0.075 inch) behind the window.
The light sensitive area of the 5082-4207 is 1.016mm (0.040
inch) in diameter and is also located 1.905mm (0.075 inch)
behind the window.
These devices are suitable for applications such as high
speed tachometry, optical distance measurement, star
tracking, densitometry, radiometry, and fiber-optic
termination.
The speed of response of these detectors is less than one
nanosecond. Laser pulses shorter than 0.1 nanosecond
may be observed. The frequency response extends from
dc to 1 GHz.
The 5082-4205 is in a low capacitance Kovar and ceramic
package of very small dimensions, with a hemispherical
glass lens.
The 5082-4220 is packaged on a TO-46 header with the
0.508mm(0.020 inch) diameter sensitive area located
2.540mm (0.100 inch) behind a flat glass window.
The low dark current of these planar diodes enables
detection of very low light levels. The quantum detection
efficiency is constant over ten decades of light intensity,
providing a wide dynamic range.
DIMENSIONS IN MILLIMETERS (INCHES).
(.15 IJl
T:1RI1
It3.937
r-
.40S
CATHODE
a~
ANODE
~
-CATHODE
CONNECTED
TO CASE
-4203, -4204, -4207
1 18
. "
3.683
(.016)
TO·18
HEADER-
4.648
o'2.235_1
I
f~~g:~.
1 I
ANODE
I
DI
~.;:~)--1
f'o-l>Il/
~(.088)
·4205
192
CATHODE
AND CASE
-TO 46 HEADER
-4220
Absolute Maximum Ratings
·4283
100
PMAl( Power Dissipation 1
Peak Revme Voltage 2
Steady Reverse Voltage3
200
50
, 100''''
200
20
:,; volts
Electrical/Optical Characteristics at TA =25°C
;, ·4283
1IIin.
\Typ.
Cp
RS
*see Note 4.
NOTES:
1. Peak Pulse Power
When exposing the diode to high level incidance the
following photocurrent limits must be observed:
Ip(PEAK) \
whichever of the above three conditions is least.
Ip (avg MAX.) < PMAX-Pt/>; and in addition:
Ec
2.
3.
4.
5.
1000 A
Ip (avg MAX.)
(I'sec) or <500mA or <
fxt
Ip' photocurrent (A) f . pulse repetion rate (MHz)
Ec' supply voltage (V) Pt/>. power input via photon flux
t - pulse duration (I's) PMAX' max dissipation (W)
Power dissipation limits apply to the sum of both the optical power input to the device and the electrical power input from flow
of photocurrent when reverse voltage is applied.
Exceeding the Peak Reverse Voltage will cause permanent damage to the diode. Forward current is harmless to the diode, within
the power dissipation limit. For optimum performance, the diode should be reversed biased with Ec between 5 and 20 volts.
Exceeding the Steady Reverse Voltage may impair the low-noise properties of the photodiodes, an effect which is noticeable only
if operation is diode·noise limited (see Figure 8).
The 5082·4205 has a lens with approximately 25x magnification; the actual junction area is 0.5 x 10.3 cm 2 , corresponding to a
diameter of 0.25mm (,010"). Specification includes lens effect.
At any particular wavelength and for the flux in a small spot falling entirely within the active area, responsivity is the ratio of incremental
photodiode current to the incremental flux producing it. It is related to quantum efficiency, Tlq in electrons per photon by:
Rt/>=Tlq (-"'-)
1240
where'" is the wavelength in nanometers .. Thus, at 770nm, a responsivity of 0.5 A/W corresponds to a quantum efficiency of 0.81 (or 81 %)
electrons per photon.
S. At -10V for the 5082·4204, -4205, and -4207; at -25V for the 5082·4203 and -4220.
7. For ("', f, df) = (770nm, 100Hz, SHz) where f is the frequency for a spot noise measurement and df is the noise bandwidth, NEP is the
optical flux required for unity signal/noise ratio normalized for bandwidth. Thus:
NEP=
IN/.jM
-Rt/>
where IN/.jM is the bandwidth - normalized noise current computed from the sfiot'noise formula:
IN/,jM = V2CiiD = 17.9 x 1O. 15 v'ii) (AlvHzi where 10 is in nA.
8. Detectivity, DOis the active-area-normalized signal to noise ratio. It is computed:
for ("', f, df) = (770nm, 100Hz, SHz).
9. At -10V for 5082·4204, -4205, -4207, -4220; at -25V for 5082·4203.
10. Betwaen diode cathode lead and case - does not apply to 5082·4205, ·4220.
11. With 50n load.
12. With 50n load and -20V bias.
193
---------,---,
~~~=
for A in cm 2 ,
0
ELECTAONS
0.8
O.
6~:r'"""""'"
o. 4
t
2
o.
...
~
'.
~
.....
';/
]
'1--~-
}lA/PW'
-,~-
6r--'
L~._.
~--.
.-
.04
.0 1
400
15O;.1W
{O
tOOp\"J
'0
50pW
J
~fo
T
1000
!/~
rZ
rt-
--
800
600
RADIANT POWER AT 9QOnm '" ZOOJ.1W
70
60
1\\
C'--
.08
.0
,.......-.-80
.--
+75-150 +25
0
-5 -10 -15 -20 -25 -30 -35 -40 -45 -50
BIAS VOLTAGE (ANODE TO CATHODE VOLTAGE)
1200
A - WAVELENGTH
Figure 3. Typical Output Characteristics
at ~ = OOOnm.
Figure 2. Relative Directional Sensitivity
of the PI N Photodiodes.
Figure 1. Spectral Response.
31000..--.--,---,.---,--.---,---,
""
>
u
~
~
100
45
55
65
TEMPERATURE _
75
85
10-'6'--"c-_...L_.-J.~_L.._...L,_-1.,,---1
95
10 2
°c
10 8
Figure 6. Noise vs. load Resistance.
Figure 4. Dark Current at -10V Bias
VS.
10 3
10"
10 5
106
10 7
RL - LOAD RESISTANCE - OHMS
Temperature.
VR
~
REVERSE VOLTAGE -
V
Figure 5. Typical Capacitance Variation
With Applied Voltage.
"
I
"
>- 10 6
~
~
NEPOUE TO
' .... ...,..-,THEAMAL NOISE::
.... ,,,OF LOAD
I
NEPDUETO
lO'}
•
'"
RL
,..- BOrK SOl lRCES
OFNOISE
LOAD RESISTANCE - OHMS
Figure 8. Noise Equivalent Power vs. Load Resistance.
Figure 7. Photodiode Cut-Off Frequency
vs. Load Resistance (e = 2pF).
Ip=Signal current ~ 0.5/1-AhtW x flux input at 770 nm
IN = Shot noise current
<1.2 x 10-14 amps/Hz1/2(5082-4204)
<4 x 10-14 amps/Hz1/2(5082-4207)
I D= Dark current
<600 x 10-12 ampsat -10 V de (5082-4204)
<2500 x 10-12 amps at -10 V dc (5082-4207)
Rp = 1011n
RS=<50n
Figure 9. Photodiode Equivalent Circuit.
194
Application Information
NOISE FREE PROPERTIES
5082-4205 MOUNTING RECOMMENDATIONS
The noise current of the PIN diodes is negligible. This is a
direct result of the exceptionally low leakage current, in
accordance with the shot noise formula IN = (2qIRilf) 1/2
Since the leakage current does not exceed 600 picoamps
for the 5082-4204 at a reverse bias of 10 volts, shot noise
current is less than 1.4 x 10- 14 amp Hi- 1/2 at this voltage.
a. The 5082-4205 is intended to be soldered to a printed
circuit board having a thickness of from 0.51 to 1.52mm
(0.02 to 0.06 inch).
b. Soldering temperature should be controlled so that at
no time does the case temperature approach 280°C.
The lowest solder melting pOint in the device is 280°C
(gold-tin eutectiC). If this temperature is approached,
the solder will soften, and the lens may fall off. Lead-tin
solder is recommended for mounting the package, and
should be applied with a small soldering iron, for the
shortest possible time, to avoid the temperature
approaching 280°C.
c. Contact to the lens end should be made by soldering
to one or both of the tabs provided. Care should be
exercised to prevent solder from coming in contact
with the lens.
d. If printed circuit board mounting is not convenient,
wire leads may be soldering or welded to the devices
using the precautions noted above.
Excess noise is also very low, appearing only at
frequencies below 10 Hz, and varying approximately as
1If. When the output of the diode is observed in a load,
thermal noise of the load resistance (Rd is 1.28 x 10- 10
(Rd- 1/2 x (ilf) 1/2 at 25° C, and far exceeds the diode shot
noise for load resistance less than 100 megohms (see
Figure 6). Thus in high frequency operation where low
values of load resistance are required for high cut-off
frequency, all PIN photodiodes contribute virtually no
noise to the system (see Figures 6 and 7).
HIGH SPEED PROPERTIES
Ultra-fast operation is possible because the HP PIN
photodiodes are capable of a response time less than one
nanosecond. A significant advantage of this device is that
the speed of response is exhibited at relatively low reverse
bias (-10 to -20 volts).
LINEAR OPERATION
Having an equivalent circuit as shown in Figure 9,
operation of the photodiode is most linear when operated
with a current amplifier as shown in Figure 10.
OFF-AXIS INCIDENCE RESPONSE
II
Response of the photodiodes to a uniform field of radiant
incidence Ee, parallel to the polar axis is given by I = (RA) x
Ee for 770nm. The response from a field not parallel to the
axis can be found by multiplying (RA) by a normalizing
factor obtained from the radiation pattern at the angle of
operation. For example, the multiplying factor for the
5082-4207 with incidence Ee at an angle of 40° from the
polar axis is 0.8. If Ee = 1mW/cm 2, then Ip = k x (RA) x Ee;
Ip = 0.8 x 4.0 x 1 = 3.2 j.lamps.
R1 '" R2
VOUT '" R, (lp
+ 10)
Figure 10. Linear Operation.
Lowest noise is obtained with Ec = 0, but higher speed and
wider dynamic range are obtained if 5 < Ec < 20 volts. The
amplifier should have as high an input resistance as
possible to permit high loop gain. If the photodiode is
reversed, bias should also be reversed.
SPECTRAL RESPONSE
To obtain the response at a wavelength other than 770nm,
the relative spectral response must be considered.
Referring to the spectral response curve, Figure 1, obtain
response, X, at the wavelength desired. Then the ratio of
the response at the desired wavelength to response at
770nm is given by:
LOGARITHMIC OPERATION
If the photodiode is operated at zero bias with a very high
impedance amplifier, the output voltage will be:
RATIO = L
0.5
Multiplying this ratio by the incidence response at 770nm
gives the incidence response at the desired wavelength.
VOUT = (1
R2 kT 1\
+-).
- . Jl.n
RI
q
9.Y -1) -I
wherels=IF (e kT
ULTRAVIOLET RESPONSE
Under reverse bias, a region around the outside edge of
the nominal active area becomes responsive. The width of
this annular ring is approximately 25j.1m (0.001 inch) at
-20V, and expands with higher reverse voltage. Responsivity in this edge region is higher than in the interior,
particularly at shorter wavelen}jths; at 400nm the interior,
responsivity is 0.1 AIW while edge responsivity is 0.35
AIW At wavelengths shorter than 400nm, attenuation by
the glass window affects response adversely; hence UV
detection is improved by removal of the glass or
substitution of a sapphire window (available on special
order). Speed of response for edge incidence is t f , tf =
300ns.
Ip
Is
(1+-)
atO < IF<0.1mA
using a circuit as shown in Figure 11.
Ipl~
:::t:
Figure 11. Logarithmic Operation.
Output voltage, VOUT, is positive as the photocurrent, Ip,
flows back through the photodiode making the anode
positive.
195
APPLICATION NOTES
APPLICATION NOTE 915
Threshold Detection of Visible and Infrared Radiation with
PIN Photodlodes
Traditionally, the detection and demodulation of extremely
low level optical signals has been performed with multiplier
phototubes. Because ofthistradition, solid-state photodetectors are often overlooked even though they have a number of
clear functional advantages and in some applications provide
superior performance as well. Some of these advantages are
summarized in this note and become even more apparent in
the discussion following.
APPLICATION NOTE 931
Solid State Alphanumeric Dlsplay ... Decoder/Drlver Circuitry
Hewlett-Packard offers a series of solid state displays capable
of producing multiple alphanumeric characters utilizing S x 7
dot arrays of GaAsP light emitting diodes (LED's). TheseSx 7
dot arrays exhibit clear, easily read characters. In addition,
each array is x-v addressable to allow for a simple
addressing, decoding, and driving scheme between the
display module and external logic.
Methods of addressing, decoding and driving information to
such an X-V addressable matrix are covered in detail in this
application note. The note starts with a general definition of
the scanning or strobing technique used for this simplified
addressing and then proceeds to describe horizontal and
vertical strobing. Finally, a detailed circuit description is given
for a practical vertical strobing application.
APPLICATION NOTE 934
5082-7300 Series Solid State Display Installation Techniques
The 5082-7300 series Numeric/Hexadecimal Indicators are
an excellent solution to most standard display problems in
commercial, industrial and military applications. The unit
integrates the display character and associated drive
electronics in a single package. This advantage allows for
space, pin and labor cost reductions, at the same time
improving overall reliability.
The information presented in this note describes general
methods of incorporating the -7300 into varied applications.
APPLICATION NOTE 937
Monolothlc Seven Segment LED Display Installation
Techniques
The Hewlett-Packard series of small endstackable monolithic
GaAsP displays are designed for strobing, a drive method that
allows time sharing of the character generator among the
digits in a display.
This Application Note begins with an explanation of the
strobing technique, followed by a discussion of the uses and
advantages of the right hand and center decimal point
products.
Several circuits are given for typical applications. Finally, a
discussion of interfacing to various data forms is presented
along with comments on mounting the displays.
APPLICATION NOTE 939
High Speed Optically Coupled Isolators
Often designers are faced with the problem of providing
circuit isolation in order to prevent ground loops and
common mode signals. Typical devices for doing this have
been relays, transformers and line receivers. However, both
relays and transformers are low speed devices, incompatible
with modern logic circuits. Line receiver circuits are fast
enough, but are limited to a common mode voltage of 3 volts.
In addition, they do not protect very well against ground loop
signals. Now Optically Coupled Isolators are available which
solve most isolation problems.
This Application Note contains a description of Hewlett- '"
Packard's high speed isolators, and discusses their
applications in digital and analog systems.
APPLICATION NOTE 941
5082-7700 Series Seven Segment LED Display Applications
The HP 5082-7700 series of LED displays are available in both
common anode and common cathode configurations. These
single digit displays have been engineered to provide a high
contrast ratio and a wide viewing angle.
This Application Note begins with DC drive techniques and
circuits. Next is an explanation of the strobe drive technique
and the resultant increase in device efficiency. This is
followed by general strobing circuits and some typical
applications such as clocks, calculators and counters.
Finally, information is presented on general operating
conditions, including intensity uniformity, light output
control as a function of ambient light, contrast enhancement
and device mounting.
APPLICATION NOTE 945
Photometry of Red LEDs
Nearly all LEOs are used either as discrete indicator lamps or
as elements of a segmented or dot-matrix display. As such,
they are viewed directly by human viewers, so the primary
criteria for determining their performance is the judgement of
a viewer. Equipment for measuring LED light output should,
therefore, simulate human vision.
This Application Note will provide answers to these
questions:
1. What to measure (definitions of terms)
2. How to measure it (apparatus arrangement)
3. Whose equipment to use (criteria for selection)
APPLICATION NOTE 946
5082-7430 Series Monolithic Seven Segment Displays
The HP S082-7430 series solid state displays are common
cathode, 2 and 3 digit clusters capable of displaying numeric
and selected alphabetic data. These GaAsP displays employ
an integral magnification technique to increase both the
character size and the luminous intensity of each monolithic
digit. The resultant 2.79mm (0.11") high character is viewable
at distances of up to 5 feet when operated at as little as O.SmW
per segment.
These displays are designed for strobed operation. In
strobing, the decoder is timeshared among the digits in the
display, which are illuminated one at a time.
Typical applications, such as an Electronic Stopwatch, a
battery operated Event Counter and a Four Function
Calculator are discussed in this note.
APPLICATION NOTE 947
Digital Data Transmission Using Optically Coupled Isolators
Optically coupled isolators make ideal line receivers for
digital data transmission applications. They are especially
useful for elimination of common mode interference between
two isolated data transmission systems. This application note
describes design considerations and circuit techniques with
special emphasis on selection of line drivers, transmission
lines, and line receiver termination for optimum data rate and
common mode rejection. Both resistive and active terminations are described in detail. Specific techniques are
described for multiplexing applications, and for common
mode rejection and data rate enhancement.
196
\.,
Some suggestions on how to handle and solder silver plated
lead frame devices are presented.
APPLICATION NOTE 948
Performance of the 5082-4350/51/60 Series of Isolators In
Short to Moderate Length Digital Data Transmission Systems
Optically coupled isolators (opto-isolators) can function as
excellent alternatives to integrated circuit line receivers in
digital data transmission applications. Their major advantages consist of superior common-mode noise rejection and
... true ground isolation between the two subsystems.
This application note describes the basic design elements of a
data transmission link and presents examples of systems that
will be useful at distances that range from 1 ft. to 300 ft. and
have a moderate overall cost.
APPLICATION BULLETIN 4
Detection and Indication of Segment Failures in Seven
Segment LED Displays
The occurrence of a segment failure in certain applications of
7 segment displays can have serious consequences if a
resultant erroneous message is read by the viewer. This
application bulilltin discusses three techniques for detecting
open segment lines and presenting this information to the
viewer.
APPLICATION BULLETIN 8
Assembly and Handling Techniques for Monolithic Display
Chips
Die attach, lead bonding and intensity matching of LED
display chips present special problems for the manufacturers
of hybrid modules. This application bulletin discusses some
of the basic considerations for handling of gallium arsenide
phosphide materials.
APPLICATION NOTE 951-1
Applications for Low Input Current, High Gain Optically
Coupled Isolators
Optically coupled isolators are useful in applications where
large common mode signals are encountered. Examples are:
line receivers, logic isolation, power lines, medical equipment
and telephone lines. This application note has at least one
example in each of these areas for the 5082-4370 series high
CTR isolators.
APPLICATION BULLETIN 50
Hewlett Packard Watch Chip Drawings
As an aid to designers of hybrid devices using LED display
chips and discrete LEDs, this bulletin provides oetailed
dimensional information on all Hewlett-Packard 5082-7800
series display chip products.
APPLICATION NOTE 951-2
Linear Applications of Optically Coupled Isolators
Optically coupled isolators can be used to transfer an analog
signal between two isolated systems. In many instances,
isolators can replace expensive transformers, instrumentation amplifiers, and A/D conversion schemes. This application note discusses several circuit techniques by which 50824350 series optically coupled isolators can be used to transmit
analog information. The operation of each circuit is explained
in detail and typical circuit performance is given.
APPLICATION BULLETIN 51
Interfacing the HDSP-2000 Display to a Microprocessor
Interface of the HDSP-2000 alphanumeric display to a
microprocessor involves the design of a relatively simple
interface element. This bulletin briefly discusses the tradeoffs involved in the design of such an interface and provides a
specific example of an interface to the 8080 microprocessor
along with appropriate software.
APPLICATION NOTE 964
Contrast Enhancement Techniques
This Application Note presents various criteria and techniques that a display engineer should consider to obtain
optimum contrast enhancement for red, yellow and green
LED displays. A representative list of filter manufacturers and
available filters is given at the end of this discussion.
APPLICATION BULLETIN 52
Large Monolithic LED Displays
The trend to incorporate more complex functions into smaller
package configurations that are portable and battery
powered is reaching a point where the limiting items are the
space and power constraints imposed upon the display atthe
operator-to-machine interface. The large monolithic LED
display has been designed to meet many of these constraints.
This application bulletin describes the beneficial features of a
large monolithic LED display and presents circuits which
interface the display to CMOS logic and to a microprocessor.
APPLICATION NOTE 966
The HDSP-2000 provides a unique yet simple and low cost
method for addressing display data to a 5 x 7 alphanumeric
display. This application note is intended to serve as a design
and application guide for users of the HDSP-2000. The
information presented will cover the theory of the device
design and operation, considerations for specific circuit
design, thermal management, power derating and heat
sinking, and intensity modulation techniques.
BOOKS
APPLICATION BULLETINS
APPLICATION BULLETIN 1
Construction and Performance of High Efficiency Red,
Yellow and Green LED Materials
The high luminous efficiency of Hewlett-Packard's High
Efficiency Red, Yellow and Green lamps and displays is made
possible by a new kind of light emitting material utilizing a
GaP transparent substrate. This application bulletin discusses the construction and performance of this material as
compared to standard red GaAsP and red GaP materials.
APPLICATION BULLETIN 3
Soldering Hewlett-Packard Silver Plated Lead Frame LED
Devices
M,any of Hewlett-Packard's commercial LED devices use a
silver plated lead frame. Soldering to a silver lead frame
provides a reliable electrical and mechanical connection and
is no more complicated than soldering to a gold lead frame.
OPTOELECTRONICS APPLICATIONS MANUAL
The commercial availability of the Light Emitting Diode has
provided electronic system designers with a revolutionary
component for application in the areas of information display
and photocouplers.
Many electronic engineers have encountered the need for a
resource of information about the application of and designing with LED products. This book is intended to serve as an
engineering guide to the use of a wide range of solid state
optoelectronic products.
The book is divided into chapters covering each of the
generalized LED product types. Additional chapters treat
such peripheral information as contrast enhancement
techniques, photometry and radiometry, LED reliability,
mechanical considerations of LED devices, photodiodes and
LED theory.
This book is available from Hewlett-Packard or from the
McGraw Hill Publishing Company.
197
IIIIIIIIIQIIIQGIIIG I.QGAIIQII
UNITED STATES
ALABAMA
GEORGIA
MISSOURI
OREGON
Hall-Mark Electronics
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Hall-Mark Electronics
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Earth City 63045
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Hall-Mark Electronics
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9999 SW. Wilshire Street
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(206) 455-5846
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198
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~
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-./
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199
"""--,-,--,~",,,,--
.'''''~"'--
/
IAIlII All IIIIICI grrlCl1
UNITED STATES
ALABAMA
COLORADO
8290 Whitesburg Dr . S.E.
P.O. Box 4207
Huntsville 35802
IOWA
5600 South Ulster Parkway
Englewood 80110
Tel: (303) 771-3455
CONNECTICUT
Tel (205) 881-4591
Medical Only
228 W. Valley Ave"
Room 220
Birmingham 35209
12 lunar Drive
New Haven 06525
ARIZONA
~~3~e~i~~g33~a St
2424 East Aragon Rd
Tucson 85706
*Jacksonville
Medical Service only
Medical Service Only
6177 lake Ellenor Dr
Orlando 32809
Tel )501) 664-B773
CALIFORNIA
Tel (714) B70-1000
KENTUCKY
148 Weldon Parkway
Maryland Heights 63043
OHIO
~~ri~~r~yn~Oad
205 Billy Mitchell Road
San Antonio 78226
LOUISIANA
P.O. Box 840
Suite 110
Omaha 68106
3239 Williams Boulevard
Kenner 70062
Tel (402) 392-0948
Tel (504) 721-6201
MARYLAND
W, 120 Century Rd
Paramus 07652
Tel: (301) 944-5400
TWX 710-862-9157
NEW MEXICO
Tel: (904) 434-3081
GEORGIA
PO. Box 105005
Tel (301) 94B-6370
TWX 710-828-9684
~~~~~~II~h~~15~oad
MASSACHUSEITS
+~pm-~9~:m~
+~x\6m_~~t~ro~
Tel: (404) 736-0592
~~~ (~13'~::i5010145
MICHIGAN
HAWAII
23855 Research Drive
Farmington Hills 48024
Tel: (313) 476-6400
TWX: 810-242-2900
MINNESOTA
Tel (80B) 955-4455
ILLINOIS
3003 Scott Boulevard
Santa Clara 95050
2400 N. Prior Ave
Roseville 55113
5201 Tollview Or.
ROiling Meadows 60008
Tel (408) 249-7000
TWX, 910-33B-0518
Tel: (612) 636-0700
TWX 910-563-3734
+~pm-m:~~gg
~~I~d(~r4)4:~_6165
~~ri(3Yn:J~~{86go
Tel (916) 929-7222
TWX, 810-260-1797
9606 Aero Drive
P.O. Box 11634
Station E
11300 lomas Blvd., N.E
Albuquerque 87123
Tel: (505) 292-1330
TWX: 910-989-11B5
Tel: (512) 434-B241
+~x(5m_m:~m
UTAH
1041 Kingsmili Parkway
Columbus 43229
2160 South 3270 West Street
Tel (614) 436-1041
~:It(~~1~·4~7~~A~119
OKLAHOMA
P.O. Box 3200B
VIRGINIA
Tel (405) 721-0200
NO.7 Koger Exec. Center
Suite 212
~,~,ic3~x01~778
Oklahoma City 73132
OREGON
17890 SW Lower Boones
Ferry Road
Tualatin 97062
Norfolk 23502
Tel:(B04) 497-1026/7
POBox 9B54
Tel (503) 620-3350
2914 Hungary Springs Road
Richmond 23228
156 Wyatt Drive
Las Cruces 88001
PENNSYLVANIA
Tel: (505) 526-2485
TWX 910-983-0550
NEW YORK
111 Zeta Drive
Pittsburgh 15238
Tel (804) 285-3431
WASHINGTON
Tel (412) 782-0400
TWX 710-795-3124
6 Automation Lane
Computer Park
Bellevue 98004
1021 8th Avenue
King of Prussia Industrial Park
Kin~ of Prussia 19406
Tel: (206) 454-3971
TWX: 910-443-2446
·WEST VIRGINIA
~~~i~r8)1~~~51550
201 South Avenue
Poughkeepsie 12601
+~x(9Ji6_~~::m~
39 Saginaw Drive
Rochester 14623
Bellefield Office Pk.
1203-114th Ave. S.E.
tWx2m-~~~~~n
SOUTH CAROLINA
6941-0 N, Trenholm Road
Columbia 29260
Medical/Analytical Only
Char'eeton
Tel: (304) 345-1640
WISCONSIN
Tel: (B03) 782-6493
9004 West lincoln Ave.
West Allis 53227
Tel (716) 473-9500
TWX: 510-253-5981
TENNESSEE
Tel: (414) 541-0550
'Jackson
~e~~i(~~1~e~i~~93~~
5858 East Molloy Road
Syracuse 13211
"Knoxville
Medical Services only
FOR U.S_ AREAS NOT LISTED:
Tel (615) 523-5022
MISSISSIPPI
INDIANA
7301 North Shadeland Ave.
646 W. North Market Blvd
Sacramento 95834
NEW JERSEY
Tel: (305) B59-2900
PO. Box 12B26
2875 So. King Street
Honolulu 96814
Houston 77027
Tel: (502) 456-1573
6305 Amona Place
'Los Angeles
Suite 100
Tel: (713) 7B1-6oo0
Medical Service Only
'Augusta 30903
TWX: 910-328-6147
P.O. Box 27409
6300 Westpark Drive
16500 Sprague Road
Cleveland 44130
330 Progress Rd.
Dayton 45449
32 Hartwell Ave
Lexington 02173
Tel (213) 776-7500
201 E. Arapaho Rd.
Richardson 75080
lei: (214) 231-6101
Tel: (216) 243-7300
TWX: 810-423-9431
tWpm-ij~~:~~~~
Atlanta 30348
TEXAS
P.O. Box 1270
NEBRASKA
Tel (404) 955-1500
TWXB10-766-4890
3939 Lankershim Boulevard
North HOllrwOOd 91604
+~x(3Ji6_m:~m
6707 Whitestone Road
Baltimore 21207
Pensacola 32575
1430 East Orangethorpe Ave.
Fullerton 92631
~;~~9~~~\l78W1
Tel: (305) 731-2020
Tel: (904) 725-6333
PO Bo'13910
Brady Station
Little Rock 72205
1923 North Main Street
Louisville 40218
Tel: (602) 294-3148
·ARKANSAS
P.O. Box 5646
NORTH CAROLINA
P.O. Box 518B
Tel (816) 763-8000
TWX 910-771-2087
FLORIDA
P.O Box 24210
2806 W. Oakland Park Blvd
ft. Lauderdale 33307
Tel: (602) 244-1361
11131 Colorado Ave
Kansas City 64137
Medical Only
Atkinson Square
3901 Atkinson Dr..
Suite 2Q7
Tel: (203) 389-6551
TWX 710-465-2029
Tel (205) 942-20B1
MISSOURI
1902 Broadway
Iowa City 52240
Tel: (319) 338-9466
Night: (319) 338-9467
Tel: (315) 454-2486
P.O. Box 23333
Tel: (714) 279-3200
Tel: (615) 244-544B
ONTARIO
QUEBEC
+~x(6m_~~~:~§~g
Tel (514) 697-4232
TWX 610-422-3022
TLX 05-821521 HPCL
1 Crossways Park West
r.riro~i). 2~~1~172
TWX 710-990-4951
Nashville
Medical Service only
f.f(~r~12116j60
San Diego 92123
Contact the regional office
nearest you: Atlanta, Georgia.
North Hollywood, California.
Rockville, Maryland ..
Rolling Meadows,
Illinois. Their complete
addresses are listed above.
*Servlce Only
1473 Madison Avenue
CANADA
ALBERTA
Hewlett-Packard (Canada) ltd
11620A - 168 Sireet
Edmonton T5M 3T9
Tel: (403) 452-3670
TWX: 610-831-2431 EOTH
MANITOBA
BRITISH COLUMBIA
Hewlett-Packard (Canada) ltd
837 E. Cordova Street
Vancouver V6A 3R2
Tel: (604) 254-0531
TWX: 610-922-5059 VCR
Hewlett-Packard (Canada) ltd.
800 Windmill Road
f.:ni'd~:7~l~5~\8
Dartmouth B2Y 3Z6
TWX: 610-671-3531
Hewlett-Packard (Canada) ltd.
NOVA SCOTIA
Hewlett-Packard (Canada) ltd
513 Century SI.
St. James
P.O. Box 9331
Tel (902) 469-7820
TWX: 610-271-44B2 HFX
915-42 Ave S.E. Suite 102
r=~~(j~) TiJl,_~Z6~2
Hewlett-Packard (Canada) Ltd.
1785 Woodward Or.
Ottawa K2C OP9
Hewlett-Packard (Canada) ltd
6877 Goreway Drive
~il~!~~i~~:J:~o 1M8
TWX 610-492-4246
Twx; 610-B21-6141
Hewlett-Packard (Canada) ltd
275 Hymus Blvd.
Pointe Claire H9R 1G7
FOR CANADIAN AREAS
NOT LISTED:
Contact Hewlett-Packard (Canada)
ltd. in Mississauga
CENTRAL AND SOUTH AMERICA
ARGENTINA
Hewlett-Packard do Brasil
I.E.C. Ltda.
Hewlett-Packard Argentina
SA
Av. Leandro N. Alem 822
1001 Buenos Air••
Rua Padre Chagas, 32
12"
Tel: 31-6063.4.5.6 and 7
Telex: Public Booth tf 9
Cable: HEWPACK ARG
BOLIVIA
Stambuk & Mark (Bolivia) lIda
Av. Mariscal, Santa Cruz 1342
La Paz
Tel: 40626. 53163. 52421
Telex: 3560014
Cable: BUKMAR
BRAZIL
Hewlett-Packard do BraSil
I.E.C. Ltda.
Avenida Rio Negro, 980
~4h~Oi~:rueria Sao Paulo
Tel: 429-2148/9;429-211B/9
~~~~r~2~~:8."2~~5621
Gable: HEWPACk po110 Alegre
Hewlett-Packard do Brasil
I.E.C. L1da.
Rua SiQueira Campos. 53, 4
0
~ag~o?~r:~~aS:neirO-GB
Tel: 257-BO-94-000 (021)
Telex: 391-212-1905 HEWP-BR
Cable: HEWPACK
Rio de Janeiro
CHILE
Calcagni y Metcalfe lIda
Alameda 5S0-0f. 807
Casilla 2118
Santiago, 1
Tel: 398613
Telex: 3520001 CALMET
Cable: CALMET Santiago
Medical Only
General Machinery Co , Ltda.
Paraguay 494
Casilla 13910
Santiago
Tel: 31123. 31124
Cable: GEMCQ Santiago
COLOMBIA
Instrumentacidn
Henrik A, Langebaek & Kier S.A
Carrera 7 No. 48-75
Apartado Aereo 6287
Bogol~.
I O. E
Tel: 69-88-77
Cable: AARIS BogOIa
Telex: 044-400
COSTA RICA
Cientifica Costarricense S,A.
Calle Central, Avenidas 1 y 3
Apartado 10159
San Jose
Tel: 21-86-13
Cable: GALGUR San Jos~
ECUADOR
Medical Only
A.F, Viscalno Campania ltda
Av. Rio Amazonas No. 239
P.O. Box 2925
Quito
Tel: 242-150.247-033/034
Cable: Astor Quito
Calculators Only
Computadoras y Equipos
Electrdnicos
PO Box 2695
990 Toledo (y Cordero)
Quito
Tel 525-9B2
GUATEMALA
IPESA
NICARAGUA
Avenlda La Reforma 3-48,
Zom 9
Guatemala City
Roberto Teran G
Apartado Postal 689
Edificio Teran
Managua
Tel 63627. 64786
Tel: 25114. 23412.23454
Telex: 4192 Teletro Gu
Cable: ROTERAN Managua
MEXICO
Hewlett-Packard Mexicana.
SA de C.V
Calle Samuel Lewis
Cuidad de Panama
Tel (905) 543-42-32
Telex: 3431103 Curunda,
Canal Zone
Cable: ELECTRON Panama
0
Telex: 017-74-507
~~rl~~-~~~kard Mexicana.
EL SALVADOR
Instrumentacion y Procesamiento
Electromco de el Salvador
Bulevar de los Heroes 11-48
San Salvador
Ave. Constitucidn No. 2184
Monterrey, N.L
Tel' 48-71-32 48-71-84
Telex: 038·843
200
P.O. Box 4929
Torres Adalid No. 21. 11 Piso
Col. del Valle
Mexico 12, O.F
Telex: 02-2113 Sag ita Ed
Cable: Sagita-Quito
Tel 252787
PANAMA
Electr6nico Balboa, SA
Tel: 64-2700
[~,
~
L~/
CENTRAL AND SOUTH AMERICA (cont.)
PARAGUAY
Z.J. Melamed S.R.L
Divisu:!n: Aparatos y EqUipos
Medicos
Division' Aparatos y EqUipos
Ciantlficos y de Investigacldn
PO. Box 676
ChI1e-482, Edificlo Victoria
Asuncion
Tel: 4-5069. 4-6272
Cable: RAMEL
PERU
Campania Electro Mffi:liGa S A
los Flamencos 145
San Isidro Casilla 1030
Lima 1
Tel' 41-4325
Cable ElMED Lima
PUERTO RICO
Hewlett-Packard Inter-Americas
Puerto Rico Branch Office
Calle 272. Urb. Country Club
Carolina 00639
Tel: (809) 762-7355/7455/7655
Telex: HPIC-PR 3450514
URUGUAY
Pablo Ferrando S A.
Camereial e Industrial
Avemda Italia 2877
Casitla de Correo 370
Montevideo
Tel: 40-3102
Cable: RADIUM Montevideo
VENEZUELA
Hewlett-Packard de Venezuela
C.A.
Apartado 50933. Caracas 105
EdlficlO Segre
Tercera Transversal
Los RUices Norte
Caracas 107
Tel. 35-01-07, 35-00·84,
35-00-65, 35-00-31
Telex: 25146 HEWPACK
Cable: HEWPACK Caracas
FOR AREAS NOT LISTED,
CONTACT,
Hewlett-Packard
Inter-Americas
3200 Hillview Ave.
Palo Alto, Caltforma 94304
Tel (415) 493-1501
TWX. 910-373·1260
Cable: HEWPACK Palo Alto
Telex: 034·8300, 034-8493
EUROPE, NORTH AFRICA AND MIDDLE EAST
AUSTRIA
HewleH-Packard Ges.m.b.H.
Handelskai 52
P.O. box 7
A-1205 Vienna
i:~IJ~~1~~lKlti~~n~o 27
Telex: 75923 hewpak a
BELGIUM
Hewlett-Packard Benelux
S.A.!N.V.
Avenue de Col-Vert, 1,
hGrOenkraaglaan)
-1170 Brussels
Tel: (02) 672 22 40
Cable: PALOBEN Brussels
Telex: 23 494 paloben bru
Hewlett-Packard France
Agence RElgionale
PElricentre de It Capt!)re
Chemin de la CElpi!)re, 20
F-31300 Toulou. .La Mlran
Tel:(61) 40 11 12
Cable: HEWPACK 51957
Telex: 510957
Hewlett-Packard France
~~~g~~rtR:~i~~~~ de
Marseille-Marignane
F-13721Marlgnane
Tel: (91) 89 1236
Cable: HEWPACK MARGN
Telex: 410770
Hewlett-Packard France
Agence RElgionale
CYPRUS
63, Avenue de Rochester
& Xenopoulos Rd. Bdlte Postale
F-35014 Renn.. CEldex
P.O. Box 1152
Tel: (99) 36 33 21
CY-Nlcosia
Cable: HEWPACK 74912
Tel: 45628/29
Telex: 740912
Cable: KVPRONICS PANOEHIS
Hewlett-Packard France
Telex: 3018
Agence Rtklionale
CZECHOSLOVAKIA
74, AII6e de la Robertsau
Vyvojova a Provozni Zakladna
Vyzkumnych Ustavu v
Bechovicich
Telex: 890141
CSSR-25097
Cable: HEWPACK STRBG
Bechovk:e u Prahy
Hewlett-Packard France
"I: 899341
~~~rr~e v~~~i~~ale
Telex: 121333
201,
rue Colbert
DDR
EntrEle A2
Entwicklungslabor der TU
F-590oo Lille
Dresden
Tel: (20) 51 44 14
Forschungsinstitut Melnsberg
Telex: 820744
00R-7305
Watdhelm/Melnsberg
GERMAN FEDERAL
Tel: 37 667
REPUBLIC
Telex: 518741
Hewlett-Packard GmbH
Firma Forgber
Vertriebszentrale Frankfurt
Schlegefstrasse 15
Bernerstrasse 117
1040 Berlin
Posttach 560 140
T~: 28 27 411
0-6000 Frankfurt 56
Telex: 112889
T~: (0611) 5004·1
DENMARK
Cable: HEWPACKSA Frankfurt
Telex: 04 13249 hpffmd
Hewlett-packard AlS
Hewlett-Packard GmbH
Technisches Buero Boblingen
Herrenbergerstrasse 110
0-7030 Bdbllngen,
Telex: 166 40 hpas
WOmemberg
Hewlett-Packard NS
Tel: (07031) 667·1
Navervej 1
Cable: HEPAK BOblingen
DK-8600 Sitkeborg
Telex: 07265739 bbn
Tel: (06) 82 71 66
Hewlett-Packard GmbH
Telex: 166 40 hpas
Technisches Buero Dusseldorf
Cable: HEWPACK AS
EmanueHeutze-Str.1 (Seestern)
0-4000 DIl••eldorf
FINLAND
Tel: (0211) 5971-1
Hewlett-Packard OY
Telex: 085/86 533 hpdd d
Nahkahousuntie 5
P.O. Box 6
Hewlett-Packard GmbH
SF-00211 Helsinki 21
Technisches Buero Hamburg
Wendenstrasse 23
T~: 6923031
Cable: HEWPACKOV Helsinki
1
~;~0(~~a27~3r~3
Telex: 12-1563
Cable:
Hamburg
FRANCE
Telex: 21 63 032 hphh d
Hewlett-Packard France
Hewlett-Packard GmbH
Quartier de Courtaboeuf
Technisches Buero Hannover
BOite Postale No. 6
Am Grossmarkt 6
F-91401 Orsay CEldex
0-3000 Hannover 91
Tel: (1) 907 78 25
Tel: (0511) 46 60 01
Cable: HEWPACK Orsay
Telex: 092 3259
T~ex: 600048
Hewlett-Packard GmbH
Hewlett-Packard France
Technisches Buero Nuremberg
"Le Saquin"
Chemin des Mouilles
Boite Postale No. 12
Tel: (0911) 56 30 a'/85
F-69130 Ecully
Telex: 0623 860
Tel: (78) 3381 25,
Cable HEWPACK Ecu/y
Telex 310617
~~:r8~;~~rios
~~n:) ~~~;t'2~~;f
g~~~V:~~lrkerlKf
t:~ll~~E';.)P~~:OAS
H~WPACKSA
~~N~1r~u~~~a
~::I;~-~~~tard
Hewlett-Packard GmbH
Technisches Buero MOnchen
Unterhachlnger Strasse 28
ISAR Center
0-8012 OtIobrunn
~~llO~J~~l{~s~l~anchen
Telex: 0524985
Hewlett-Packard GmbH
Technisches Buero Berlin
Keith Strasse 2-4
0-1000 Berlin 30
Tel: (030) 24 90 86
Telex: 18 3405 hpbln d
GREECE
~g~~~mKoa~al~~~s
GR-Athens 126
Tel: 3237731
Cable: RAKAR Athens
Telex: 21 59 62 rkar or
~~!fE~~I..onIY
G Papathanassiou & Co.
Marni 17
GR - Athens 103
Tel: 522 1915
Cable: INTEKNIKA Athens
Telex: 21 5329 INTE GR
Medical Only
Technomed Hellas ltd.
52,Skoufa Street
GR • Athens 135
Tel' 362 6972, 363 3830
Cable:etalak athens
Telex: 21-4693 ETAL GR
HUNGARY
MTA
MtIszerugyi Els Ml!nlstechmkai
Szolgalata
Lenin Krt. 67
1391 Budapest VI
Tel: 420338
Telex: 22 51 14
ICELAND
Medical Only
Elding Trading Company Inc.
HafnarhvOIi - Tryggvatotu
IS-Reykjavik
Tel: 1 5820
Cable: ELDING ReykjaVik
PORTUGAL
Telectra-Empresa TElcnica de
Equlpamentos EIElctncos S.a.r.l.
~~~. RB~~i~~3~a Fonseca 103
P-L/lbon 1
~:r~1~~1~~0"?8:7
Telex: 12598
Medical only
Mundinter
Intercambio Mundial de ComElrcio
S.a.r.l.
Av.A.A.de Aguiar 138
P.O. Box 2761
P - Lisbon
Tel: (19) 53 21 31/7
Cable: INTERCAMBIO Lisbon
~;5~~~c8'!t:~~a 43 GIC
Tel:(095) 37 05 04
Hewlett-Packard Italiana S.p.A
Via Amerigo Vespucci, 9
1-80142 Napoli
T~: (081) 33 7711
Hewlett-Packard ltaliana S.p.A.
Via E. Masi, 9/B
KUWAIT
AI-Khaldiya Trading &
Contracting Co.
P.O. Box 830
Kuwait
Tel: 424910
Cable: VISCOUNT
LUXEMBURG
Hewlett-Packard Benelux
S.A.!N.V.
Avenue du Col-Vert, 1,
hGrOenkraaglaan)
-1170 Brussels
Tel: (02) 672 22 40
Cable: PALOBEN Brussels
Telex: 23 494
MOROCCO
Gerep
190, Blvd. Brahim Roudani
Casablanca
Tel,25-16-76/25-90-99
Cable: Gerep-Casa
Telex: 23739
IRAN
Hewlett-Packard Iran Ltd.
No. 13, Fourteenth St.
Miremad Avenue
P.O. Box 41/2419
IR-Tahran
Tel: 851082-7
Telex: 213405 HEWP IR
NETHERLANDS
Hewlett-Packard Benelux N.V.
Van Heuven Goedhartlaan 121
P.O. Box 667
NL- Amstelveen 1134
Tel: (020) 47 20 21
Cable: PALOBEN Amsterdam
Telex: 13 216 hepa nl
IRELAND
Hewlett-Packard Ltd.
King Street Lane
GB-Wlnnersh,Wokingham
Berks, RGll 5AR
t:i;1~llmB 47 74
ITALY
Hewlett-Packard Italiana S.p.A.
Casella postale 3645
1-20100 Milano
t:~ll~)H~W~A(J~I~n~lano
Telex: 32046
Hewlett-Packard Italiana S.p.A.
Via Pietro Maroncelli 40
(ang. Via Visentin)
1-35100 Paclova
Tel: (49) 66 48 88
Telex: 41612 Hewpacki
UNIPAN
Zaklad Doswiadczalny
Budowy Aparatury Naukowe]
U1. Krajowej Rady
NarodoweJ 51/55
00-800 Warsaw
Tel: 20 62 21
Telex: 81 46 48
Zaklady Naprawcze Sprzetu
Medycznego
Plac Komuny Paryskie/ 6
90-007 Lad.
Tel: 334-41, 337-83
Itallana S.p.A.
Via d'Aghiardi, 7
1-56100 PI ..
Tel: (050) 2 32 04
Telex: 32046 via Milano
Hewlett-Packard Italiana S.p.A.
Via G. Armellini 10
1-00143 Roma
Tel: (06) 54 69 61
Telex: 61514
Cable: HEWPACKIT Roma
Hewlett-Packard Italiana S.p.A.
Via San Quintino, 46
1-10121 Torino
Tel. (0111 52 82 64/54 84 68
Telex: 32046 via Milano
Medical/Calculators Only
Hewlett-Packard Italiana S.p.A
NORWAY
Hewlett-Packard Norge NS
Nesveien 13
Box 149
N-1344 Hallum
Tel: (02) 53 83 60
Telex: 16621 hpnas n
POLAND
Biuro Informacji Technicznej
Hewlett-Packard
Ul Stawki 2 6P
0O-95OWarsaw
Tel: 39 67 43
Telex: 81 24 53 hepa pi
~lblll%~cB?Rr2Lisbon
RUMANIA
Hewlett-Packard Reprezentanta
BD.N. Balcescu 16
Bucharest
Tel: 158023/138885
Telex: 10440
I.I.R.U.C.
Intreprinderea Pentru
Intretinerea
Si Repararea Utilajelor de Calcul
B-dul prof. Dimitrie Pompei 6
Bucharest-Sectorul 2
Tel: 1264 30
Telex: 01183716
SAUDI ARABIA
Modern ElectroniC Establishment
King Abdul Aziz str.(Head office)
P.O. Box 1228
Jecldah
Tel' 31173-332201
Cable' ELECTRA
P.O. Box 2728 (Service center)
~~r~~~96-66232
Cable: RAOUFCO
SPAIN
Hewlett-Packard Espanola, S.A.
Jerez No.3
E-Madrld 16
Tel:(l) 458 26 00 (10 lin.s)
Telex: 23515 hpe
Hewlett-Packard Espanola, S.A.
Milanesado 21~23
E-Barcelona 17
Tel: (3) 203 6200 (5 lines)
Telex: 52603 hpbe e
Hewlett-Packard Espanola, SA
Av Ramdn y Gajal. 1-9'"
~EdifiCiO Sevilla I)
-Seville 5
Tet 6444 54/58
Hewlett-Packard Espanola S.A.
Edificio Albia II]'> B
E-Bilbao-1
Tel: 2363 06/23 82 06
calculators Only
Hewlett-Packard Espanola S.A.
Gran Via Fernando EI Gatdlico, 67
E-Valencla-8
T~: 326 67 28/326 85 55
SWEDEN
Hewlett-Packard Sverlge AB
~~~~hetsV~gen 3
S-161 20 Bromm. 20
Tel: (08) 730 05 50
Cable: MEASUREMENTS
Stockholm
Telex: 10721
Hewlett-Packard Sverige AB
~~~~IS~:t~~!~a
Frolunda
Tel: (031) 49 09 50
Telex: 10721 Via Bromma Office
SWITZERLAND
~:~::'~;:sa;d2&SChWeiZ) AG
P.O. Box 307
CH-8952 Schneren--Zurlch
Tel: (01) 730 52 40
Cable: HPAG CH
Telex; 53933 hpag ch
Hewlett-Packard (Schweiz) AG
Chateau Bloc 19
~~: m~ L;; LJ!l2~n-Gen..a
Cable: HMpACKAG Geneva
Telex: 27 333 hpag ch
SYRIA
Medical/Calculator only
Sawah & Co.
Place Azml!
B.P. 2308
SYR-Damascus
Tel: 16367, 19697, 14268
Cable: SAWAH, Damascus
TURKEY
~~J.k~~x E~~~neering Bureau
'~~2~nbU'
Tel: 494040
Cable: TELEMATION Istanbul
Telex: 23609
Medical only
E.M.A.
Muhendislik Kolleklif Sirketi
Adakale Sokak 41/6
TR-Ankara
Tel: 175622
Analytical only
Yllmaz Ozyurek
Milli Mudafaa Cad No. 16/6
Kizilay
TR-Ankara
Tel: 25 03 09
Telex: 42576 Ozek tr
UNITED KINGDOM
Hewlett-Packard Ltd.
King Street Lane
GB-Wlnnersh, Wokingham
Berks. RGll SAR
Tel: (0734) 78 47 74
¥::i~rrfJ~9London
Hewlett-Packard Ltd.
"The Graftons"
Stamford New Road
Ga-Altrincham
Cheshire WA14 IDa
T~: (061) 9289021
V:I~:i
Manchester
:roW3
Hewlett-Packard Ltd.
Lygon Court
Dudley Road
GB-Haleaowen, Worcs
Tel: (021) 550 9911
T~ex: 339105
201
- - - - " ..._--
--- _. -
~
EUROPE, NORTH AFRICA AND MIDDLE EAST (cont.)
Hewlett-Packanl Ltd.
Wedge House
799. London Road
GB-Thornton HNth
~~n~I~~~~IL03
Telex: 946825
Hewlett-Paclcard Ltd.
c/o Makro
South Service Wholesale Centre
Wear Industrial Estate
Washington
r~~h1~:'~~ Dumam
ext. 57156
Hewlett-Packard LId
10. WesleySt.
GB-CHlloIoni
W..t Yorkshire Wfl0 lAE
Tel: (09775) 50402
Telex: 557355
Hewlett-Packard Ltd
1. Wallace Way
GB-Hftchln
Herts
Tel: (0462) 52624156704
Telex: 825991
YUGOSLAVIA
Iskra-standard/Hewlett-Packard
Miklosiceva 38N1I
USSR
Hewlett-Packard
SOCIALIST COUNTRIES
NOT SHOWN PLEASE
CONTACT:
HewleH-Padtard Ges.m.b.H
P.O. Box 7
A-1205 Vienna, Austria
T.I: (0222) 35 16 21 to 27
Cable: HEWPAK Vienna
Telex: 75923 hewpak a
~~~~::~~I~~~
101000 ~I~~~KV 12
_cow
Tel:294'2024
Telex: 7825 hewpak .u
~~~1 LJ8~~~OI6 74
T~ex:
31300
MEDITERRANEAN AND
MIDDLE EAST COUNTRIES
NOT SHOWN PLEASE
CoNTAct:
Hewlett-Packard S.A.
Mediterranean and Middle
East Operations
35, Kofokotroni Street
Platia Kefallariou
GR-Kifissla-Athens, Greece
Tel: 808033713591429
8081741174217431744
Telex: 21-6588
Gable: HEWPACKSA Athen.
FOR OlliER AREAS
NOT LISTED CONTACT
Hewlett·Packard S.A.
7, rue du BOls-du-Lan
P.O. Box
CH-1217 Meynn 2 - Geneva
Switzerland
Tel: (022) 41 5400
Analytical/Medical Only
Medical Supplies N.Z Ltd.
P.O. Box 309
239 Stanmore Road
Christchurch
Tel: 892-019
Cable: DENTAL, Christchurch
Analytical/Medical Only
Medical Supplies N.Z. Ltd.
303 Great King Street
P.O. Box 233
Dunedin
Tel: 88-817
Gable: DENTAL. Dunedin
Tel: 802-104016
Telex: SA43-4782JH
Cable: HEWPACK JOHANNESBURG
Hewlett-Packard South Africa
.~
AFRICA, ASIA, AUSTRALIA
AMERICAN SAMOA
Calculators Only
~~n~~xs~~~ms Inc.
PagO Pago Bayfront Road
~:J1r396799
Gable: OCEANIC-Pago Pago
ANGOLA
Telectra
Eml~~r~~i!e~~: de
EI/ctrtco•• S.A.R.L.
R. Barbosa Rodrigues, 42-I"DT.o
Caixa Postal. 6487
Luanda
Tel: 3551516
Cable: TELECTRA Luanda
AUSTRALIA
Hewtett-Packard Australia
31~'J~~Ph Street
Blackburn, Victoria 3130
P.O. Box 36
DonCMter East, Victoria 3109
Tel: 89-6351
Telex: 31-024
Cable: HEWPARD Melbourne
Hewlett-Packard Australia
Ply. Ltd.
31 Bridge Street
Pymblo
New South Wales. 2073
Tel: 449-6566
Telex: 21561
Cable: HEWPARD Sydney
Hewlett-Packard Australia
153're~~hill
Road
Porkoldo. 5063. S.A.
Tel: 272-5911
Telex: 82536 ADEL
Gable: HEWPARD ADELAIDE
Hewlett-Packard Australia
14I1iir\~g
High,way
_tandl. W.A. 6009
. Tel' 86-5455
Telex: 93859 PERTH
Cable: HEWPARD PERTH
Hewlett-Packard Australia
Ltd.
121 ollongOO~ Street
Fyohwick. A. .T. 2609
Tel: 95-3733
Telex: 62650 Canberra
Cable: HEWPARD CANBERRA
Hewlett Packard Australia
Ply. Ltd.
51h Floor
Teachers Union Building
495-499 Boundary Street
~~I: 1~!. 4000 Queen.land
it
Telex: 42133 BRISBANE
GUAM
MedicaVPocket Calculators Only
Guam MedlceJ sup~. Inc.
J~ Ease Building. oom 210
P.. Box 8947
f:!"~~lrs911
Cable: EAAMED Guam
Blue Star Ltd.
HONG KONG
Schmidt & Co. (Hong Kong) Ltd. Nathraj Mansions
2nd Floor Bistupur
P.O. Box 297
Connalight Centre
Jamllhedpur 831 001
Tel 7383
39th Floor
Cable. BLUESTAR
Connaught Road, Central
Telex: 240
~;W-:S~~&'t.5
Telex: 74766 SCHMC HX
Cable: SCHMIDTCO Hong Kong
INDIA
Blue Star Ltd.
~~~~e:j~i~~~g~d.
~~~~020
Telex: 2156
Cable: BLUEFROST
Blue Star Ltd.
Sahas
414/2 Vir Savarkar Marg
Prabhadevi
~er:~~D?025
Telex: 4093
Cable: FROSTBLUE
Blue Star Ltd.
Band Box House
Prabhadevi
Bom~ 400 025
Tel: 45 ~ 01
Telex: 37 1
Cable: BLUESTAR
Blue Star Ltd.
14/40 Civil Unes
~:~rs~ ~8 001
Telex: 292
Gable: BLUESTAR
Blue Star Ltd.
7 Hare Street
P.O. Box 506
Calcutta 700 00 1
Tel: 23-0131
Telex:.7655
Cable: BLUESTAR
Blue Star Ltd.
7th & 8th Flocr
Bhandari House
91 Nehru Place
_
Dothi 110024
T.I: 634770 & 635166
T. .: 2463
Gable: BLUESTAR
Blue Star Lid.
Blue Star House
l1111A Magarath Road
~:nr=~ 560 025
Telex: 430
Cable: BLUESTAR
Blue Star Ltd.
Meeakshi Mandiran
xxX/1678 Maha1ma Gandhi Rd.
Cochln 682 016 Kerala
Tel: 32069. 32161. 32282
Telex: 046-514
Cable: BLUESTAR
Blue Star Ltd.
1+117/1
Sarojini Devi Road
secundorabod 500 003
Tel: 70126. 70127
Cable: BLUEFROST
Telex: 459
Blue Star Ltd.
2/34 Kodambakkan High Road
Madras 600034
Tel: 82056
Telex: 041-379
Cable: BLUESTAR
INDONESIA
BEReA Indonesia P.T.
P.O. Box 496
1st Floor JL, Cikini Raya 61
Jakarta
Tel: 56038. 40369. 49886
T~ex: 42895
Gable: BERCACON
BEReA Indonesia P. T.
63 JL. Raya Gubeng
~~~m:
ISRAEL
Electronics & Engineering Div.
of Motorola Israel Ltd.
16, Kremenetski Street
P.O. Box 25016
Tot-Aviv
Tel: 03-389 73
Telex: 33569
Cable: BASTEl Tel-Aviv
JAPAN
Yokogawa-Hewlett-Packard Ltd.
Ohashi Building
1-59-1 Yoyogi
Shibuya-ku. ToI
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