1986_Optoelectronics_Designers_Catalog 1986 Optoelectronics Designers Catalog

User Manual: 1986_Optoelectronics_Designers_Catalog

Open the PDF directly: View PDF PDF.
Page Count: 796

Download1986_Optoelectronics_Designers_Catalog 1986 Optoelectronics Designers Catalog
Open PDF In BrowserView PDF
To help you in choosing and designing with HP
optoelectronic components, detailed specifications for HP bar
code components, motion sensing and encoder products,
LED displays, lamps, light bars and bar graphs, fiber optics,
optocouplers and high reliability products are included in
this catalog.

How to Find the Right Information
To help you locate the product needed for your application,
there is a table of contents which indicates each section by
thumb-tab, an alphanumeric index following the table of
contents, and product selection guides in the opening of each
product line section. There are ten sections, one for
each of the product lines listed above plus a section
containing a complete listing of application bulletins and
notes. Section 10 is an appendix containing HP sales and
service as well as authorized distributor locations.
How to Order
To order complete applications information, use the business
reply card in the back of this book, or call your nearest HP
sales office. Ask for the Components office. There is a listing
of HP Component sales and service offices for the U.S. on
Pages 10-13 and 10-14. In Europe and the rest of the world,
look on pages 10-6 through 10-12 in the appendix for the
worldwide listing of HP sales and service offices.
Also in the appendix is a worldwide listing of HP authorized
distributors. These distributors offer off-the-shelf delivery
for most HP components.

•

•
•

•
••

•
•
•

•
•

•

1. Motion Sensing and Control
Selection Guide .......................... .'..........
Shaft Encoders ......................................
Digital Potentiometers ...............................
Motion Control IC's ..........................
i

•

•

•

••

1-3
1-5
1-21
1-23

2. Bar Code Components
Selection Guide .....................................
Digital Wands .................................. 2-6,
Component Readers ................................
Optical Sensors ....................................
Readers ............................................

2-3
2-26
2-12
2-52
2-58

3. Optocouplers
Selection Guide .....................................
High Speed Optocouplers .............................
Low Current Optocoupler ...........................
High Gain Optocouplers .............................
Application Specific Optocouplers .....................
Hermetic Optocouplers

3-3
3-9
3-19
3-57
3-69
8-66

4. Fiber Optics
Selection Guide ..................................... 4-3
Fiber Optic Links ................................... 4-6
Cable, Connectors and Accessories .................... 4-92
Multiplexer ...................................... 4-100
PIN Photodiode Detectors .......................... 4-106

5. Light Bars and Bar Graph Arrays
Selection Guide ..................................... 5-3
Light Bars ......................................... 5-7
Bar Graphs
5-26
ii

--------------------------

~~-

6. Solid State Lamps
Selection Guide ..................................... 6-3
Surface Mount Lamps .............................. 6-17
Flat Top Lamps .................................... 6-25
Tape and Reel ..................................... 6-43
Low Current Lamps ................................ 6-47
Ultrabright Lamps ................................. 6-51
Right Angle Indicators .............................. 6-55
Integrated Resistor Lamps ........................... 6-62
General Purpose Lamps ............................. 6-72
Emitters ......................................... 6-111
Hermetic Lamps ................................... 8-18

7. Solid State Displays
Selection Guide ....................................
Smart Alphanumeric Displays ........................
Alphanumeric Displays ..............................
5x7 Large Dot Matrix Alphanumeric Display. . . . . . . . . . ..
Seven Segment Displays .............................
Hexadecimal and Dot Matrix Displays ................
Hermetic Displays ..................................

7-3
7-15
7-31
7-83
7-85
7-136
8-30

8. High Reliability!Hermetic Components
Hermetic Lamp Selection Guide ....................... 8-4
Hermetic Dis plays Selection Guide ..................... 8-6
Visible Product Screening Programs .................... 8-9
Hermetic Optocoupler Selection Guide ................. 8-13
Optocoupler Screening Programs ...................... 8-14
Data Sheets ....................................... 8-18

9. Applications
Application Bulletins, Notes and Handbook Listing ....... 9-3
Abstracts .......................................... 9-5

10. Appendix
HP Components Authorized Distributor and
Representative Directory .......................... 10-2
HP International Sales and Service Offices .............. 10-6
HP Components U.S. Sales and Service Offices ......... 10-13
iii
------------

------~--

----------

~-----

AlphanUlDeric Index
HBCR-1000
HBCR-1022
HBCR-1024
HBCR-1025
HBCR-1043

.........................
............... ; .........
.........................
.........................
.........................

2-18
2-18
2-18
2-18
2-18

HCPL-2730
3-61
HCPL-2731
3-61
HCPL-3700 ......................... 3-69
HCPL-4100
3-75
HCPL-4200 ........................ . 3~83

HBCR-1045
HBCR-1900
HBCR-2000
HBCS-1100
HBCS-2200

..........................
..... ; ... ; ...............
.........................
.........................
........ , ................

2-18
2-18
2-12
2-52
2-26

HCPL-4502 .......................... 3-9
HCPL-5700
8-79
HCPL-5701
8-79
HCPL-5730
8-83
HCPL~5731
8-83

HBCS-2300
HBCS-2400
HBCS-2500
HBCS-2999
HBCS-4300

................... ; .....
.........................
.........................
............. ; ...........
.........................

2-26
2-26
2-26
2-63
2-32

1-23
HCTL-1000
1-43
HCTL-2000
HDSP-0760 ........................ 7-145
HDSP-0761 ........................ 7-145
HDSP-0762 ........................ 7-145

HBCS-4500
H BCS-4999
HBCS-SOOO
HBCS-S100
HBCS-S200

......................... 2-32
......................... 2-63
.......................... 2-6
.......................... 2-6
.......................... 2-6

HBCS-S300
HBCS-S400
HBCS-S500
HBCS-6100
HBCS-6300

..........................
..........................
..........................
..........................
..........................

2-6
2-6
2-6
2-6
2-6

HDSP-0781TXV .....................
HDSP-0781TXVB ....................
HDSP-0782 .........................
HDSP-078?TXV .....................
HDSP-0782TXVB ....................

8-38
8-38
8-38
8-38
8-38

HBCS-6S00
HBCS-7000
HBCS-7001
HBCS-7100
HBCS-7101

.......................... 2-6
......................... 2-68
......................... 2-68
................... ; ..... 2-68
2-68

HDSP-0783 .........................
HDSP-0783TXV .....................
HDSP-0783TXVB ....................
HDSP-0784 .........................
HDSP-0784TXV .....................

8-38
8-38
8-38
8-38
8-38

HCPL-2200
3-19
3-23
HCPL-2300
3-29
HCPL-2400
HCPL-2502 .......................... 3-9
3-15
HCPL-2530

HDSP-0784TXVB ....................
HDSP-0791 .........................
HDSP-0791TXV .....................
HDSP-0791TXVB ....................
HDSP-0792 .........................

8-38
8-38
8-38
8-38
8-38

HCPL-2531 ......................... 3-15
HCPL"2601 ......................... 3-39
3-43
HCPL-2602
3-49
HCPL-2630
3:'53
HCPL-2631

HDSP-0792TXV .....................
HDSP-0792TXVB ....................
HDSP-0793 ............... ; .........
HDSP-0793TXV .....................
HDSP-0793TXVB ....................

8-38
8-38
8-38
8-38
8-38

HQSP-0763
HDSP-0770
HDSP-0771
HDSP-0772
HDSP-0781

New Products in BOLD Type.

iv

........................ 7-145
........................ 7-145
........................ 7-145
........................ 7-145
......................... 8-38

~-~---~--~-

.~.-

---

..

-.--~--~

..

H DSP-0794 ......................... 8-38
HDSP-0794TXV ..................... 8-38
HDSP-0794TXVB .................... 8-38
HDSP-0860 ........................ 7-145
HDSP-0861 ........................ 7-145

HD5P-2383 ......................... 7-41
7-56
HDSP-2416
7-56
HDSP-2424
7-56
HDSP-2432
7-56
HDSP-2440

HDSP-0862 ........................ 7-145
HDSP-0863 ........................ 7-145
HDSP-0881 ......................... 8-38
HDSP-0881TXV ..................... 8-38
HDSP-0881TXVB .................... 8-38

HDSP-2450 .........................
HDSP-2450TXV .....................
HDSP-2450TXVB ....................
HDSP-2451 .........................
HDSP-2451TXV .....................

8-59
8-59
8-59
8-59
8-59

HDSP-0882 .........................
HDSP-0882TXV .....................
HDSP-0882TXVB ....................
HDSP-0883 .........................
HDSP-0883TXV .....................

HDSP-2451TXVB ....................
HDSP-2452 .........................
HDSP-2452TXV .....................
HDSP-2452TXVB .................. "
HDSP-2470

8-59
8-59
8-59
8-59
7-56

HDSP-0883TXVB .................... 8-38
HDSP-0884 ......................... 8-38
HDSP-0884TXV ..................... 8-38
HDSP-0884TXVB .................... 8-38
HDSP-0960 ........................ 7-145

HDSP-2471
HDSP-2472
HDSP-2490
HDSP-2491
HDSP-2492

7-56
7-56
7-52
7-52
7-52

HDSP-0961 ........................ 7-145
HDSP-0962 ........................ 7-145
HDSP-0963 ........................ 7-145
7-31
HDSP-2000
7-31
HDSP-2001

HDSP-2493
HD5P-3350
HD5P-3351
HD5P-3353
HD5P-3356

.........................
.........................
.........................
.........................

7-52
7-85
7-85
7-85
7-85

HDSP-2002
HDSP-2003
HDSP-2010 .........................
HDSP-2010TXV .....................
HDSP-2010TXVB ....................

7-31
7-31
8-46
8-46
8-46

HDSP-3400
HD5P-3400,
HDSP-3401
HDSP-3403
HD5P-3403,

........................
OPT 502 ...............
........................
........................
OPT 502 ...............

7-120
7-135
7-120
7-120
7-135

HDSP-2300
HDSP-2301
HDSP-2303
HDSP-2310

7-35
7-35
7-35
7-35
8-52

HDSP-3405
HDSP-3406
HD5P-3406,
HDSP-3530
HD5P-3530,

........................
........................
OPT 502 ...............
........................
OPT 502 ...............

7-120
7-120
7-135
7-127
7-135

HDSP-2310TXV .....................
HDSP-2310TXVB ....................
HDSP-2311 .........................
HDSP-2311TXV .....................
HDSP-2311TXVB ....................

8-52
8-52
8-52
8-52
8-52

HDSP-3531
HD5P-3531,
HDSP-3533
HD5P-3533,
HDSP-3536

........................
OPT 502 ...............
........................
OPT 502 ...............
........................

7-127
7-.135
7-127
7-135
7-127

HDSP-2312 .........................
HDSP-2312TXV .....................
HDSP-2312TXVB ....................
HD5P-2381 .........................
HD5P-2382 .........................

8-52
8-52
8-52
7-41
7-41

HD5P-3536,
HDSP-3600
HD5P-3600,
HDSP-3601
HDSP-3603

OPT 502 ...............
........................
OPT 502 ...............
........................
........................

7-135
7-103
7-135
7-103
7-103

HDSP~2302

8-38
8-38
8-38
8-38
8-38

New Products in BOLD Type.

v

HDSP-3603,
HDSP-3606
HDSP-3606,
HDSP-3730
HDSP-3730,

OPT S02 ...............
........................
OPT S02 .............. ,
.........................
OPT S02 ...............

7-135
7-103
7-135
7-127
7-135

HDSP-4840
HDSP-4850

..... ................... .

HDSP-3731
HDSP-3731,
HDSP-3733
HDSP-3733,
HDSP-3736

........................
OPT S02 ...............
........................
OPT S02 ...............
................ :; ......

7-127
7":135
7-127
7-135
7-127

HDSP-5303
HDSP-5303,
HDSP-5307
HDSP-5307,
HDSP-5308

........................
OPT S02 ...............
........................
OPT S02 ...............
........................

7-112
7-135
7-112
7-135
7-112

HDSP-3736,
HDSP-3900
HDSP-3900,
HDSP-3901
HDSP-3901,

OPT S02 ...............
........................
OPT S02 ...............
........................
OPT S02 ...............

7~135

7-127
7-135
7-127
7-135

HDSP-5308,
HDSP-5321
HDSP-5323
HDSP-5501
HDSP-5501,

OPT S02 ...............
........................
........................
........................
OPT S02 ...............

7-135
7-112
7-112
7-112
7-135

HDSP-3903
HDSP-3903,
HDSP-3905
HDSP-3906
HDSP-3906,

........................
OPT S02 ............ ...
........................
........................
OPT S02 ...............

7-127
7-135
7-127
7-127
7-135

HDSP-5503
HDSP-5503,
HDSP-5507
HDSP-5507,
HDSP-5508

........................
OPT S02 ...............
........................
OPT S02 ...............
........................

7-112
7-135
7-112
7-135
7-112

HDSP-4030
HDSP-4031
HDSP-4033
HDSP-4036
HDSP-4130

................... ; ....
........................
........................
, .......................
........................

7-127
7-127
7-127
7-127
7-127

HDSP-5508,
HDSP-5521
HDSP-5521,
HDSP-5523
HDSP-S523,

OPT S02 ...............
........................
OPT S02 ...............
........................
OPT S02 ...............

7-135
7-112
7-135
7-112
7-135

HDSP-4131
HDSP-4133
HDSP-4133,
HDSP-4136
HDSP-4136,

........................
........................
OPT S20 ...............
........................
OPT S20 ...............

7-127
7-127
7-135
7-127
7-135

HDSP-5531
HDSP-5531,
HDSP-5533
HDSP-5533,
HDSP-5537

........................
OPT S02 ...............
........................
OPT S02 ...............
........................

7-127
7-135
7-127
7-135
7-127

HDSP-4200
HDSP-4201
HDSP-4203
HDSP-4205
HDSP-4206

...... ; .................
........................
........................
........................
................ ; .......

7-127
7-127
7-127
7-127
7-127

HDSP-5537,
HDSP-5538
HDSP-5538,
HDSP-5551
HDSP-5553

OPT S02 ............... 7-135
..................... ; .. 7-127
OPT S02 ............... 7-135
......................... 7-85
......................... 7-85

HDSP-4501
HDSP-4503
HDSP-4600
HDSP-4601
HDSP-4603

......................... 7-83
......................... 7-83
........................ 7-103
.. ; ..................... 7-103
........................ 7-103

HDSP-5557
HDSP-5558
HDSP-5601
HDSP-5601,
HDSP-5603

......................... 7-85
......................... 7-85
........................ 7-112
OPT S02 ............... 7-135
........................ 7-112

HDSP-4606
HDSP-4820
HDSP-4830
HDSP-4832
HDSP-4836

........................ 7-103
......................... 5-26
...................... ; .. 5-26
......................... 5-26
.........•............... 5-26

HDSP-5607
HDSP-5607,
HDSP-5608
HDSP-5621
HDSP-5623

........................
OPT S02 ...............
........................
........................
........................

5-26
5'-26
HDSP~4890
5-26
HDSP-5301
7-112
HDSP-5301, OPT S02 ............... 7-135
'

New Products in BOLD Type.

vi
--------------~--

7~112

7-135
7-112
7-112
7-112

~------~

--~~~--~

----

HDSP-5701 ........................ 7-112
HDSP-5703 ........................ 7-112
HDSP-5707 ........................ 7-112
7-112
HDSP-5708
7-112
HDSP-5721

HDSP-7507
HD5P-7507,
HDSP-7508
HD5P-7508,
HD5P-7511

......................... 7-97
OPT S02 ............... 7-135
......................... 7-97
OPTS02 ............... 7-135
......................... 7-85

7-112
HDSP-5723
7-127
HDSP-5731
HDSP-5733 ........................ 7-127
HDSP-5737 ........................ 7-127
HDSP-5738 ........................ 7-127

HD5P-7513
HD5P-7517
HD5P-7518
HDSP-7801
HD5P-7801,

......................... 7-85
......................... 7-85
......................... 7-85
......................... 7-97
OPT S02 ............... 7-135

7-91
HDSP-5901
HDSP-5903 ......................... 7-91
HDSP-5907 ......................... 7-91
7-91
HD5P-5908
7-78
HDSP-6300

HDSP-7802
HDSP-7803
HD5P-7803,
HDSP-7804
HDSP-7807

......................... 7-97
......................... 7-97
OPT S02 ............... 7-135
......................... 7-97
......................... 7-97

7-72
HDSP-6504
7-72
HDSP-6505
7-72
HDSP-6508
7-72
HDSP-6509
HDSP-7301 .......................... 7-97

HDSP-7807,
HDSP-7808
HDSP-7808,
HD5P-7901
HD5P-7903

OPT S02 ............... 7-135
......................... 7-97
OPT S02 ............... 7-135
......................... 7-91
......................... 7-91

HD5P-7301,
HDSP-7302
HDSP-7303
HDSP-7303,
HDSP-7304

OPT 502 ............... 7-135
......................... 7-97
......................... 7-97
OPT 502 ............... 7-135
......................... 7-97

HD5P-7907
HD5P-7908
HDSP-8600
HDSP-8601
HDSP-8603

......................... 7-91
......................... 7-91
........................ 7-120
........................ 7-120
........................ 7-120

HDSP-7307
HD5P-7307,
HDSP-7308
HDSP-7308,
HDSP-7311

......................... 7-97
OPT S02 ............... 7-135
......................... 7-97
OPT 502 ............... 7-135
......................... 7-97

HDSP-8605 ........................ 7-120
HDSP-8606 ........................ 7-120
HDSP-8820
5-32
HD5P-8825
5-32
HD5P-8835
5-32

HDSP-7313
HDSP-7317
HDSP-7318
HDSP-7401
HDSP-7402

7-97
7-97
7-97
7-97
7-97

H EDS-0200
HEDS-1000
HEDS-3000
HEDS-3001
HEDS-3050

7-97
7-97
7-97
7-97
7-97

HEDS-3200
2-44
HEDS-3201
2c44
HEDS-3250
2-44
HEDS-3251
2-44
HEDS-5000 · ......................... 1-5

HDSP-7403
HDSP-7404
HDSP-7407
HDSP-7408
HDSP-7501

.........................
.........................
.........................
.........................

HD5P-7501,
HDSP-7502
HDSP-7503
HD5P-7503,
HDSP-7504

OPT 502 ............... 7-135
......................... 7-97
......................... 7-97
OPT 502 ............... 7-135
......................... 7-97

HEDS-5010
HEDS-5100
HEDS-5110
HEDS-5200
HEDS-5210

New Products in BOLD Type.

vii
---.-----------~--~---------

---

.........................
(See HBCS-1100) ........
.........................
.........................
.........................

· .........................
· .........................
· .........................
· .........................

2-63
2-52
2-38
2-43
2-38

1-5
1-5
1-5
1-5
1-5

HEDS-5300 .......................... 1-5
HEDS-5310 .......................... 1-S
HEDS-6000 ......................... 1-13
HEDS-6010
1-13
HEDS-6100
1-13

HFBR-2204 ......................... A-58
HFBR-2207
4~74
HFBR-2208
4-74
HFBR-2402
4-26
HFBR-2404
4-26

HEDS-6110

1-13
· ........................ ·1-13
HEDS-6210 ......................... 1-13
HEDS-6300 ......................... 1-13
HEDS-6310
1-13

HFBR-2500
4-6
HFBR-2501
4-6
HFBR-2502 .......................... 4-6
HFBR-2503 ......•................... 4-6
HFBR-3000 .........•........... ; ... ,4-92

1-21
HEDS-7000
HEDS-7500
1-21
HEDS-7S01 ......................... ·1-21
HEDS-"8923 · ......................... 1-S
HEDS-8924 · ......................... 1-5

HFBR-3000,
HFBR-3000,
HFBR-3001
HFBR-3021
HFBR-3099

OPT 001 ................
OPT 002 ................
.........................
..................... : ...
.........................

4-92
4-92
4-92
4-92
4-96

HEDS-8925
HEDS-8926
HEDS-8927
HEDS-8928
HEDS-8931

HFBR-3100
HFBR-3100,
HFBR-3100,
HFBR-3200
HFBR-3300

.........................
OPT 001 ................
OPT 002 •...............
.........................
.........................

4-92
4-92
4":92
4-94
4-94

••••••••

0

•••••••

;

••••••••

HEDS~6200

· .........................
..........................
..........................
..........................
..........................

1-5
1-5
1-S
1-S
1-5

HEMT-6000 •....................... 6-111
HFBR-0010 .......................... 4-2
HFBR-0100
4-98
HFBR-0101
4-98
HFBR-0102
4-98

HFBR-3500 .......................... 4-6
HFBR-3501
4-6
HFBR-3502
4-6
HFBR-3503 ........................... 4-6
HFBR-3504
4-6

HFBR-0200
HFBR-0422
HFBR-OSOO
HFBR-1001
HFBR-1002

.•........................ 4-46
......................... 4-26
........................... 4-6
..................... ; ... 4-80
..................... ,"... 4-84.

HFBR-3505 • • • • • • • • • • • • • • • • • • • • • • • 0·'. 4-6
HFBR-3506
4-6
HFBR-3507 ........................... 4-6
HFBR-3508 . ....................... '. 4-6
HFBR-3510 . ......................... 4-6

HFBR-1201 ............................ 4-46
HFBR-1202
4-46
4-54
HFBR-1203
HFBR-1204
4-54
HFBR-1402
4-26

HFBR-3511 ........................... 4-6
HFBR-3512
4-6
HFBR-3513 .......................... 4-6
HFBR-3514 .......................... 4-6
HFBR-3515 ......................... 4-6

4-26
HFBR-1404
HFBR-1500 .......................... 4-6
HFBR-1S01 ........................... 4-6
HFBR-1S02
4-6
HFBR-1510 ..... ,"..................... 4-6

HFBR-3516
HFBR-3517
HFBR-3518
HFBR-3519
HFBR-3530

HFBR-1512 .......................... 4-6
4-88
HFBR-2001
4-46
HFBR-2201
·HFBR-2202
4-46
4-58
HFBR-2203

HFBR-3579
HFBR-3580
HFBR-3581
HFBR-3582
HFBR-3589

••••••

••••

••••••••

0

0

•

••••••••••••••••

•••

•••••••••••

•

..........................
••••••••••••••••

0

•••••••••

.

••••••••••

0

•••••••••••••••

.

••••••••

0 ·• • • • • • • • • • • • • • • • •

••••••••••

•••

0

0.

•••••••

•••••

0

0

••••••••••

0.0

••••

• • • ·•• • • • • • • • •

•••••••.••

00

•••••

0

0·.

0· • • • • • • •

"0"

0

•••

0.

0

0

0

••

••••••

••••••

•.••••••••••

•••••••••••

••

••

•••••••••••••••

•••••••••••••••

0

0"00

00

0

0

0.0

••• · •••••

••••

• ·0

0.

0

0

••

0

•••••

••

0"

•••••••

0.00·.

0

••

•••••

0

0

••

4-6
4-6
4-6
4-6
4-6
4-6
4-6
4-6
4-6
4-6

New Products in BOLD Type.

viii
.~-------------.-

.....-------------

-----

-

--"-"-------"--

HFBR-3590
HFBR-3591
HFBR-3600,
HFBR-3602
HFBR-3603

..........................
..........................
OPT 001 .................
..........................
..........................

4-6
4-6
4-6
4-6
4-6

HLMP-0392
HLMP-0400
HLMP-0401
HLMP-0454
HLMP-0463

.........................
.........................
.........................
.........................
.........................

8-24
6-69
6-69
8-18
8-24

HFBR-3604
HFBR-3605
HFBR-3606
HFBR-3607
HFBR-3608

.......................... 4-6
4-6
.......................... 4-6
.......................... 4-6
.......................... 4-6

HLMP-0464
HLMP-0465
HLMP-0466
HLMP-0480
HLMP-0481

.........................
.........................
.........................
.........................
.........................

8-24
8-24
8-24
8-18
8-18

HFBR-3610 .......................... 4-6
HFBR-3612 .......................... 4-6
HFBR-3613 ......................... 4-6
4-6
HFBR-3614
HFBR-3615 .......................... 4-6

HLMP-0491
HLMP-0492
HLMP-0503
HLMP-0504
HLMP-0554

.........................
.........................
.........................
.........................
.........................

8-24
8-24
6-69
6-69
8-18

HFBR-3616 .......................... 4-6
4-6
HFBR-3617
HFBR-3618 ......................... 4-6
HFBR-3619 ......................... 4-6
4-6
HFBR-3679

HLMP-0563
HLMP-0564
HLMP-0565
HLMP-0566
HLMP-0580

.........................
.........................
.........................
.........................
.........................

8-24
8-24
8-24
8-24
8-18

HFBR-3680
HFBR-3681
HFBR-3689
HFBR-3690
HFBR-3691

..........................
..........................
..........................
.........................
..........................

4-6
4-6
4-6
4-6
4-6

HLMP-0581
HLMP-0591
HLMP-0592
HLMP-0904
HLMP-0930

.........................
.........................
.........................
.........................
.........................

8-18
8-24
8-24
8-18
8-18

HFBR-4000
HFBR-4201
HFBR-4202
HFBR-4501
HFBR-4505

4-96
......................... 4-46
......................... 4-46
.......................... 4-6
.......................... 4-6

HLMP-0931
HLMP-1000
HLMP-1002
HLMP-1002,
HLMP-1002,

.........................
.........................
.........................
OPT 010 ................
OPT 101 ................

8-18
6-84
6-84
6-57
6-57

HFBR-4511
HFBR-4515
HFBR-4595
HFBR-4596
HLMP-0103

.......................... 4-6
.......................... 4-6
.......................... 4-6
.......................... 4-6
........................ 6-109

HLMP-1071
HLMP-1080
HLMP-1100
HLMP-1100,
HLMP-1100,

.........................
.........................
.........................
OPT 010 ................
OPT 101 ................

6-84
6-84
6-62
6.57
6-57

HLMP-0300
HLMP-0301
HLMP-0354
HLMP-0363
HLMP-0364

.........................
.........................
.........................
.........................
.........................

6-69
6-69
8-18
8-24
8-24

HUv1P-1120
HLMP-1200
HLMP-1201
HLMP-1300
HLMP-1301

.........................
.........................
.........................
.........................
.........................

6-62
6-84
6-84
6-86
6-86

HLMP-0365
HLMP-0366
HLMP-0380
HLMP-0381
HLMP-0391

.........................
.........................
.........................
.........................
.........................

8-24
8-24
8-18
8-18
8-24

HLMP-1301,
HLMP-1301,
HLMP-1301,
HLMP-1302
HLMP-1320

OPT 010 ................ 6-57
OPT 101 ................ 6-57
OPT 104 ................ 6-61
......................... 6-86
........................ 6-105

New Products in BOLD Type.

ix
"--------~------

- - - - - - - -"-"-"-"--

HLMP-1321
HLMP-1340
HLMP-1350
HLMP-1385
HLMP-1400

........................ 6-105
......................... 6-51
......................... 6-90
......................... 6-86
......................... 6-86

HLMP-1740
HLMP-1760
HLMP-1790
HLMP-1800
HLMP-1801

.........................
.........................
.........................
.........................
.........................

HLMP-1401
HLMP-1401,
HLMP-1401,
HLMP-1401,
HLMP-1402

.........................
OPT 010 ................
OPT 101 ................
OPT 104 ................
.........................

6-86
6-57
6-57
6-61
6-86

HLMP-1819
HLMP-1820
HLMP-1840
HLMP-1841
HLMP-2000

....................... ;. 6-25
......................... 6-25
......................... 6-25
......................... 6-25
.......................... 5~7

HLMP-1420
HLMP-1421
HLMP-1440
HLMP-1450
HLMP-1485

........................ 6-105
........................ 6-105
......................... 6-51
......................... 6-90
......................... 6-86

HLMP-2050
HLMP-2100
HLMP-2120
HLMP-2135
HLMP-2155

..........................
..........................
..........................
..........................
..........................

HLMP-1503
HLMP-1503,
HLMP-1503,
HLMP-1503,
HLMP-1520

......................... 6-86
OPT 010 ................ 6-57
OPT 101 ................ 6-57
OPT 104 ................ 6-61
........................ 6-105

HLMP-2170
HLMP-2185
HLMP-2300
HLMP-2300,
HLMP-2300,

.......................... 5-7
.......................... 5-7
.......................... 5-7
OPT LOO ................ 5-23
OPT L01 ................ 5-23

HLMP-1521
HLMP-1523
HLMP-1540
HLMP-1550
HLMP-1585

........................ 6-105
......................... 6-86
......................... 6-51
......................... 6-90
......................... 6-86

HLMP-2300,
HLMP-2300,
HLMP-2300,
HLMP-2350
HLMP-2350,

OPT L03 ................ 5-23
OPT L04 ................ 5-23
OPT 502 ................ 5-25
.......................... 5-7
OPT 502 ................ 5-25

HLMP-1600
HLMP-1600,
HLMP-1600,
HLMP-1601
HLMP-1620

.........................
OPT 010 ................
OPT 101 ................
.........................
.........................

6-62
6-57
6-57
6-62
6-62

H LM P-2400
HLMP-2400,
HLMP-2400,
HLMP,2400,
HLMP-2400,

.......................... 5-7
OPT LOO ................ 5-23
OPT L01 ................ 5-23
OPT L03 ................ 5-23
OPT L04 ................ 5-23

HLMP-1620,
HLMP-1620,
HLMP-1621
HLMP-1640
HLMP-1640,

OPT 010 ................
OPT 101 ................
.........................
.........................
OPT 010 ................

6-57
6-57
6-62
6-62
6-57

HLMP-2400,
HLMP-2450
HLMP-2450,
HLMP-2500
HLMP-2500,

OPT 502 . . . . . . . . . . . . . . .. 5-25
.......................... 5-7
OPT 502 ................ 5-25
.......................... 5-7
OPT LOO ................ 5-23

HLMP-1640,
HLMP-1641
HLMP-1660
HLMP-1661
HLMP-1674

OPT 101 ................
.........................
.........................
.........................
.........................

6-57
6-62
6-25
6-25
6-25

HLMP-2500, OPT L01 ................ 5-23
HLMP-2500, OPT L03 ................ 5-23
HLMP-2500, OPT L04 ................ 5-23
HLMP-2500,G>PT 502 . . . . . . . . . . . . . . .. 5-25
HLMP-2550 .......................... 5-7

HLMP-1675
HLMP-1687
HLMP-1688
HLMP-1700
HLMP-1719

.........................
.........................
.........................
...................... ; ..
.........................

6-25
6-25
6-25
6-47
6-47

HLMP-2550,
HLMP-2598
HLMP-2599
HLMP-2600
HLMP-2600,

New Products in BOLD Type.

x

6-25
6-25
6-47
6-25
6-25

5-7
5-7
5-7
5-7
5~7

OPT 502 ................ 5-25
......................... 5-21
......................... 5-21
.......................... 5-7
OPT 502 . . . . . . . . . . . .. . .. 5-25

HLMP-2620
HLMP-2620,
HLMP-2635
HLMP-2635,
HLMP-2655

.......................... 5-7
OPT 502 . . . . . . . . . . . . . . .. 5-25
.......................... 5-7
OPT 502 . .. .. .. . .. . .. ... 5-25
.......................... 5-7

HLMP-2785,
HLMP-2800
HLMP-2800,
HLMP-2820
HLMP-2820,

OPT 502 ................ 5-25
.......................... 5-7
OPT 502 ................ 5-25
.......................... 5-7
OPT 502 ................ 5-25

HLMP-2655,
HLMP-2655,
HLMP-2655,
HLMP-2655,
HLMP-2655,

OPT
OPT
OPT
OPT
OPT

5-23
5-23
5-23
5-23
5-23

HLMP-2835
HLMP-2835,
HLMP-2855
HLMP-2855,
HLMP-2855,

.................•........ 5-7
OPT 502 . . . . . . . . . . . . . . .. 5-25
.......................... 5-7
OPT LOO .... .. . .. .. .. ... 5-23
OPT L01 ................ 5-23

HLMP-2655,
HLMP-2670
HLMP-2670,
HLMP-2685
HLMP-2685,

OPT 502 . . . . . . . . . . . . . . .. 5-25
.......................... 5-7
OPT 502 .. .. .. . .. .. . .... 5-25
.......................... 5-7
OPT LOO ................ 5-23

HLMP-2855,
HLMP-2855,
HLMP-2855,
HLMP-2855,
HLMP-2870

OPT L03 .. .. . .. . .. . .. ... 5-23
OPT L04 . .. .. .. . .. .. .... 5-23
OPT L06 ................ 5-23
OPT 502 .. . .. .. .. .. .. ... 5-25
.......................... 5-7

HLMP-2685,
HLMP-2685,
HLMP-2685,
HLMP-2685,
HLMP-2685,

OPT
OPT
OPT
OPT
OPT

5-23
5-23
5-23
5-23
5-23

HLMP-2870,
HLMP-2885
HLMP-2885,
HLMP-2885,
HLMP-2885,

OPT 502 .. . .. . .. .. . .. ... 5-25
.......................... 5-7
OPT LOO ................ 5-23
OPT L01 ................ 5-23
OPT L02 ................ 5-23

HLMP-2685,
HLMP-2685,
HLMP-2700
HLMP-2700,
HLMP-2720

OPT L06 ................ 5-23
OPT 502 .. .. . .. .. .. .. ... 5-25
.......................... 5-7
OPT 502 ................ 5-25
.......................... 5-7

HLMP-2885,
HLMP-2885,
HLMP-2885,
HLMP-2885,
HLMP-2885,

OPT
OPT
OPT
OPT
OPT

................
................
................
................
................

5-23
5-23
5-23
5-23
5-25

HLMP-2720,
HLMP-2735
HLMP-2735,
HLMP-2755
HLMP-2755,

OPT 502 ................ 5-25
.......................... 5-7
OPT 502 ................ 5-25
.......................... 5-7
OPT LOO .. .. . .. .. . .. . ... 5-23

HLMP-2898
HLMP-2899
HLMP-2950
HLMP-2965
HLMP-2980

.........................
.........................
.........................
.........................
.........................

5-21
5-21
5-14
5-14
5-14

HLMP-2755,
HLMP-2755,
HLMP-2755,
HLMP-2755,
HLMP-2755,

OPT
OPT
OPT
OPT
OPT

HLMP-3000' .........................
HLMP-3001 .........................
HLMP-3002 .........................
HLMP-3003 .........................
HLMP-3050 .........................

6-72
6-72
6-72
6-72
6-72

HLMP-2770
HLMP-2770,
HLMP-2785
HLMP-2785,
HLMP-2785,

.......................... 5-7
OPT 502 . . . . . . . . . . . . . . .. 5-25
.......................... 5-7
OPT LOO ... .. . . .. . .. .... 5-23
OPT L01 ................ 5-23

HLMP-3105
HLMP-3112
HLMP-3200
. HLMP-3201
HLMP-3300

HLMP-2785,
HLMP-2785,
HLMP-2785,
HLMP-2785,
HLMP-2785,

OPT
OPT
OPT
OPT
OPT

5-23
5-23
5-23
5-23
5-23

HLMP-3301
HLMP-3315
HLMP-3316
HLMP-3350
HLMP-3351

LOO
L01
L03
L04
L06

L01
L02
L03
L04
L05

L01
L03
L04
L06
502

L02
L03
L04
L05
LOS

................
................
................
......... ; ......
................

................
.... . . . . . . . . . . ..
. . . . . . . . . . . . . . ..
................
................

................
................
... . . . . . . . . . . . ..
.. .. .. . .. .. . ....
. . . . . . . . . . . . . . ..

................
................
................
................
... . .. .. .. .. . ...

5-23
5-23
5-23
5-23
5-25

New Products in BOLD Type.

xi

L03
L04
L05
L06
502

.........................
.........................
.........................
.........................
.........................

6-62
6-62
6-78
6-78
6-74

......................... 6-74
........................ 6-101
........................ 6-101
......................... 6-78
......................... 6-78

HLMP-3365
HLMP-3366
HLMP-3390
HLMP-3400
HLMP-3401

.........................
.........................
.........................
.........................
.........................

6-78
6-78
6-51
6-74
6-74

HLMP-5080
HLMP-6000
HLMP-6000,
HLMP-6000,
HLMP-6000,

.........................
.........................
OPT 010 ................
OPT 011 ................
OPT 013 ................

6-55
6-91
6-59
6-17
6-17

HLMP-3415
HLMP-3416
HLMP-3450
HLMP-3451
HLMP-3465

........................ 6-101
........................ 6-101
......................... 6-78
......................... 6-78
......................... 6-78

HLMP-6000,
HLMP-6000,
HLMP-6001
HLMP-6001,
HLMP-6001,

OPT 021 ................
OPT 022 ................
.........................
OPT 011 ................
OPT 013 ................

6-21
6-21
6-91

HLMP-3466
HLMP-3490
HLMP-3502
HLMP-3507
HLMP-3517

......................... 6-78
......................... 6-51
......................... 6-74
......................... 6-74
........................ 6-101

HLMP-6001,
HLMP-6001,
HLMP-6020
HLMP-6021
HLMP-6203

OPT 021 ................
OPT 022 ................
.........................
.........................

HLMP-3519
HLMP-3553
HLMP-3554
HLMP-3567
HLMP-3568

........................ 6-101
......................... 6-78
......................... 6-78
......................... 6-78
......................... 6-78

HLMP-6204
HLMP-6205
HLMP-6206
HLMP-6208
HLMP-6300

6-97
......................... 6~97
......................... 6-97
......................... 6-97
......................... 6-91

HLMP-3590
HLMP-3600
HLMP-3601
HLMP-3650
HLMP-3651

.........................
.........................
.........................
.........................
.........................

6-51
6-62
6-62
6-62
6-62

HLMP-6300,
HLMP-6300,
HLMP-6300,
HLMP-6300,
HLMP-6300,

OPT
OPT
OPT
OPT
OPT

HLMP-3680
HLMP-3681
HLMP-3750
HLMP-3762
HLMP-3850

.........................
.........................
.........................
.........................
.........................

6-62
6-62
6-51
6-74
6-51

HLMP-6320
HLMP-6400
HLMP-6400,
HLMP-6400,
HLMP-6400,

.........................
.........................
OPT 010 ................
OPT 011 ................
OPT 013 ................

6-91
6-91
6-59
6-17
6-17

HLMP-3862
HLMP-3950
HLMP-3962
HLMP-4700
HLMP-4719

.........................
.........................
.........................
.........................
.........................

6-74
6-51
6-74
6-47
6-47

HLMP-6400,
HLMP-6400,
HLMP-6420
HLMP-6500
HLMP-6500,

OPT 021 ................
OPT 022 ................
.................... : ....
.........................
OPT 010 ................

6-21
6-21
6-91
6-91
6,59

HLMP-4740
HLMP-5000
HLMP-5005
HLMP-5012
HLMP-5029

.........................
.........................
.........................
.........................
.........................

6-47
6-55
6-55
6-55
6-55

HLMP-6500,
HLMP-6500,
HLMP-6500,
HLMP-6500,
HLMP-6520

OPT 011 ................
OPT 013 ................
OPT 021 ................
OPT 022 ................
.........................

6-17
6-17
6-21
6-21
6-91

HLMP-5p30
HLMP-5b40
HLMP-5050
HLMP-5060
HLMP-5070

.........................
.........................
.........................
.........................
.........................

6-55
6-55
6-55
6-55
6-55

HLMP-6600
HLMP-6600,
HLMP-6600,
HLMP-6600,
HLMP-6600,

.........................
OPT 011 ................
OPT 013 ................
OPT 021 ................
OPT 022 ................

New Products in BOLD Type.

xii

010
011
013
021
022

................
................
................
................
................

6-17
6-17
6-21
6-21
6-91
6-91
6-97

6-59
6-17

6-17
6-21
6-21

6-66

6 e 17
6-17
6-21
6-21

HLMP-6620
HLMP-6620,
HLMP-6620,
HLMP-6620,
HLMP-6620,

.........................
OPT 011 ............... .
OPT 013 ............... .
OPT 021 ............... .
OPT 022 ............... .

6-66
6-17
6-17
6-21
6-21

HLMP-D401
HLMP-D600
HLMP-D601
HLMP-K100
HLMP-K400

6-74
6-74
6-74
6-39
6-86

HLMP-6653
HLMP-6654
HLMP-6655
HLMP-6656
HLMP-6658

.........................
.........................
.........................
.........................
.........................

6-97
6-97
6-97
6-97
6-97

HLMP-K401
HLMP-K402
HLMP-K600
HLMP-K601
HLMP-L250 .........................

6-86
6-86
6-86
6-86
6-31

HLMP-6700 .........................
HLMP-6700, OPT 011 ................
HLMP-6700, OPT 013 ................
HLMP-6700, OPT 021 ................
HLMP-6700, OPT 022 ................

6-66
6-17
6-17
6-21
6-21

HLMP-L251
HLMP-L350
HLMP-L351
HLMP-L550
HLMP-L551

6-31
6-31
6-31
6-31
6-31

HLMP-6720 .........................
HLMP-6720, OPT 011 ............... .
HLMP-6720, OPT 013 ............... .
HLMP-6720, OPT 021 ............... .
HLMP-6720, OPT 022 ............... .

6-66
6-17
6-17
6-21
6-21

HLMP-M200
HLMP-M201
HLMP-M250
HLMP-M251
HLMP-M300

6-35
6-35
6-35
6-35
6-35

HLMP-6753
HLMP-6754
HLMP-6755
HLMP-6756
HLMP-6758

.........................
.........................
.........................
.........................
.........................

6-97
6-97
6-97
6-97
6-97

HLMP-M301
HLMP-M350
HLMP-M351
HLMP-M500
HLMP-M501

6-35
6-35
6-35
6-35
6-35

HLMP-6800
HLMP-6800,
HLMP-6800,
HLMP-6800,
HLMP-6800,

.........................
OPT 011 ............... .
OPT 013 ............... .
OPT 021 ............... .
OPT 022 ............... .

6-66
6-17
6-17
6-21
6-21

HLMP-M550
HLMP-M551
HLMP-Q100
HLMP-Q400
HLMP-Q400, OPT 011

6-35
6-35
6-39
6-91
6-17

HLMP-6820
HLMP-6820,
HLMP-6820,
HLMP-6820,
HLMP-6820,

.........................
OPT 011 ................
OPT 013 ................
OPT 021 ................
OPT 022 ................

6-66
6-17
6-21
6-21

HLMP-Q400,
HLMP-Q400,
HLMP-Q400,
HLMP-Q420
HLMP-Q600

OPT 013 ...............
OPT 021 ...............
OPT 022 ...............
........................
........................

6-17
6-21
6-21
6-91
6-91

HLMP-6853
HLMP-6854
HLMP-6855
HLMP-6856
HLMP-6858

.........................
.........................
.........................
.........................
.........................

6-97
6-97
6-97
6-97
6-97

HLMP-Q600,
HLMP-Q600,
HLMP-Q600,
HLMP-Q600,
HLMP-Q620

OPT 011
OPT 013 ...............
OPT 021 ...............
OPT 022 ...............
........................

6-17
6-17
6-21
6-21
6-91

HLMP-7000
HLMP-7019
HLMP-7040
HLMP-D100
HLMP-D400

.........................
.........................
.........................
........................
........................

6-47
6-47
6-47
6-39
6-74

HPDL-1414
HPDL-2416
JAN1N5765
JAN1N6092
JAN1N6093

.........................
.........................
.........................
.........................
.........................

7-15
7-23
8-18
8-18
8-18

6-17

.........................
.........................
.........................
.........................
.........................

New Products in BOLD Type.

xiii
------_._---._..

__.._-_._- -_._ ....•._-_._-_._._ .. _ - _ . _ - - - - - - - - - . _ - -

JAN1 N6094 .........................
JANM19500/51901
JANM19500/52001 ..................
JANM19500/52101 ' ..................
JANTX1N5765 ......................

8-18
8-18
8-18
8-18
8-18

4N54 ...............................
4N54TXV ...........................
4N55 ....................'...........
4N55TXV ...........................
4N55TXV8 .. .. . .. . .. .. .. .. .. .. . .. ...

8-30
8-30
8-96
8-96
8-96

8-18
JANTX1 N6092
8-18
JANTX1 N6093
8-18
JANTX1 N6094
JTXM19500/51902 ................... 8-18
JTXM19500/52006 ................... 8:"'18

4N55/8838
5082-4200
5082-4203
5082-4204
5082-4205

JTXM19500/52102 ...................
M87157/00101ACX ..................
M87157IDOl 02ACX
M87157IDOl 03ACX
M87157 IDOl 04ACX

8-18
8-30
8-30
8-30
8-30

5082-4207 ........................• 4-106
5082-4220 ......................... 4-106
5082-7100
7-68
5082-7101 .......................... 7-68
5082-~102 .......................... 7-68

SL5505 .............................
03075-40006 ........................
16800A .............................
16800A, OPT 001 ....................
16800A, OPT 002 ....................

3-13
2-63
2-58
2-64
2-66

5082-7285
5082-7295
5082-7300
5082-7302
5082-7304

.........................
........................ ',
.........................
.........................
.........................

7-156
7-156
7-135
7-135
7-135

16800-61000 ....................... .
16800-90001
16800-90004
16800-90006
16801 A .............................

2-63
2-63
2-63
2-63
2-58

5082-7340
5082-7356
5082-7357
5082-.7358
5082-7359

.........................
.........................
.........................
.........................
.........................

7-135
7-135
7-135
7-135
7-135

16801A, OPT 001 ....................
16801A, OPT 002 ....................
16830A .............................
16832A . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
16840A .................... :........

2-64
2-66
2-63
2-63
2-63

5082-7404
5082-7405
5082-7414
5082-7415
5082-7432

.........................
.........................
.........................
.........................
.........................

7-150
7-150
7-150
7-150
7:'150

.............................
. .. .. .. .. .. .. .. .. . .... . .. ....
.............................
............................ ,
.............................

2-63
2-63
8-18
8-18
8-18

5082-7433
5082-7441
5082-7446
5082-7610
5082-7610,

.........................
.........................
..................... ; ...
.........................
OPT 502 .......... ; .....

7-150
7-156
7-156
7-103
7-135

1N6094 .............................. 8,.18
39301A ............................ 4-100
4N45 ............................... 3-65
4N46 ............................... 3-65
4N51 ............................... 8-30

5082-7611
5082-7611,
5082-7613
5082-7613,
5082-7616

.........................
OPT 502 ................
.........................
OPT 502 ............ : ...
.........................

7-103
7-135
7-103
7-135
7-103

4N51TXV ...........................
4N52 ...............................
4N52TXV ...........................
4N53 ...............................
4N53TXV ...........................

5082-7616, OPT 502 ................
5082-7620 ....................... ;.
5082-7621 .........................
5082-7623, .........................
5082-7626 ..................... , ...

7-135
7-103
7-103
7-103
7-103

16842A
17355A
1N5765
1N6092
1N6093

8-30
8-30
8-30
8-30
8-30

New Products in BOLD Type.

xiv

......................... 8-96
......................... 4-106
......................... 4-106
......................... 4-106
......................... 4-106

5082-7650
5082-7650,
5082-7651
5082-7651,
5082-7653

.........................
OPT 502 ................
.........................
OPT 502 ................
.........................

7-103
7-135
7-103
7-135
7-103

5082-7756 ......................... 7-103
5082-7756, OPT 502 ................ 7-135
5082-7760 ......................... 7-103
5082-7760, OPT 502 ................ 7-135
6N134 .............................. 8-66

5082-7653,
5082-7656
5082-7656,
5082-7660
5082-7661

OPT 502 ................
.........................
OPT 502 ................
.........................
.........................

7-135
7-103
7-135
7-103
7-103

6N134TXV .......................... 8-66
6N134TXV8 ........................ 8-66
6N135 ............................... 3-9
6N136 ............................... 3-9
6N137 .............................. 3-36

5082-7663
5082-7663,
5082-7666
5082-7666,
5082-7730

.........................
OPT 520 ................
.........................
OPT 520 ................
.........................

7-103
7-135
7-103
7-135
7-103

6N138 ..............................
6N139 ..............................
6N140A ............................
6N140A8838 ........................
6N140TXV ..........................

5082-7730,
5082-7731
5082-7731,
5082-7736
5082-7736,

OPT 502 ................
.........................
OPT 502 ................
.........................
0 PT 502 ................

7-135
7-103
7-135
7-103
7-1 35

6N140TXV8 ........................ 8-87
8102801EC ......................... 8-69
8302401 EC ......................... 8-91

5082-7740
5082-7740,
5082-7750
5082-7750,
5082-7751

.........................
OPT 502 ................
.........................
OPT 502 ................
.........................

7-103
7-135
7-103
7-135
7-103

New Products in BOLD Type.

xv

3-57
3-57
8-87
8-87
8-87

In 1964, Hewlett-Packard established a new
division having the charter of developing and
producing state-of-the-art electronic components
for internal use. By 1975, both microwave and
optoelectronic devices contributed to the growing
business of Hewlett-Packard and the Components
Group was formed. Today there are three
divisions: the Optoelectronics division, Optical
Communications division and Microwave
Semiconductor division. In addition to these three
divisions there is a specialized team of people to
develop, manufacture and market bar code
components.
The products of the Components Group are
vertically integrated, from the growing of LED
crystals to the development of the various on-

xvi

board integrated circuits to package design.
Vertical integration insures that HP quality is
maintained throughout product development and
manufacturing.
Over 5200 employees are dedicated to HP
Components, including manufacturing facilities in
Malasia and Singapore, factory and marketing
support in San Jose, California and a world-wide
sales force. Marketing operations for Europe are
located in Boeblingen, Germany.
Each field sales office is staffed with engineers
trained to provide technical assistance. An
extensive communications network links field
with factory to assure that each customer can
quickly attain the information and help needed.

Quality and reliability are two very important
concepts to Hewlett-Packard in maintaining the
commitment to product performance.
At Hewlett-Packard, quality is integral to product
development, manufacturing and final
introduction. "Parts per million" (PPM) as a
measure of quality is used in HP's definition of
product assurance. And HP's commitment to
quality means that there is a continuous process of
improvement and tightening of quality standards.
Manufacturing quality circles and quality testing
programs are important ingredients in HP
products.
Reliability testing is also required for the
introduction of new HP components. Lifespan
calculations in "mean-time-between-failure"
(MTBF) terms are published and available as
reliability data sheets. HP's stringent reliability
testing assures long component lifetimes and
consistent product performance.

replace components that prove to be defective in
material or workmanship under proper use during
the warranty period. This warranty extends only
to HP customers.
NO OTHER WARRANTIES ARE
EXPRESSED OR IMPLIED. HP
SPECIFICALLY DISCLAIMS THE
IMPLIED WARRANTIES OF
MERCHANTABILITY, AND FITNESS FOR
A PARTICULAR PURPOSE.
THE REMEDIES PROVIDED HEREIN ARE
BUYER'S SOLE AND EXCLUSIVE
REMEDIES. HP SHALL NOT BE LIABLE
FOR ANY DIRECT, INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL
DAMAGES, WHETHER BASED ON
CONTRACT, TORT OR ANY OTHER
LEGAL THEORY.
The foregoing limitation of liability shall not
apply in the event that any HP product sold
hereunder is determined by a court of compentent
jurisdiction to be defective and to have directly
caused bodily injury, death or property damage;
provided, that in no event shall HP's liability for
property damage exceed the greater of $50,000 or
the purchase price of the specific product that
caused such damage.

Warranty

HP's Components are warranted against defects
in material and workmanship for a period of one
year from the date of shipment (in the case of
designated Fiber Optics and Bar Code products
90 days from the date of shipment). If HP
receives notice of such defects during the
warranty period, HP will repair or, at its option,

xvii

•

•

•

•
•
•
•
•
•
•
•
••

1-1

-_ .. _._.. _---

.. -

_._ ..__

.. _....

_-_

...

_ - - - - - - - - _....-.- ..

-----.-~-----

..

---~~-.

Motion Sensing and Control
Motion Sensing
As an extension of our emitter!detector systems
capability, Hewlett-Packard has developed a family
of motion sensing products. These products
include optical shaft encoders for closed loop servo
applications and digital potentiometers for manual
input applications. HP's Optical products provide
a digital link converting mechanical shaft rotation
into TIL logic level signals.

be used as an input mechanism in a variety of
applications including: test and measurement
equipment, CAD-CAM systems, and positioning
tables.

Motion Control
To complement the motion sensing products, HP
has recently released two new motion control ICs.
The HCTL-lOOO general purpose motion control
Ie greatly simplifies the task of designing digital
motion control systems. The HCTL-lOOO compares the command position or velocity from a
host processor to the actual position or velocity
from an incremental encoder, and outputs an
appropriate motor command using one of four
programmable position and velocity control
modes. Some of its other features include a programmable digital filter, an electronic commutator,
and a quadrature decoder!counter.

Our HEDS-5000 and HEDS-6000 series encoders
may be used in a wide variety of closed loop servo
applications varying from computer peripherals
and professional audio-video systems to automated
production equipment. Encoders also fmd widespread use in industrial and instrument
applications in which digital information is needed
to monitor rotary motion.
With three easy to assemble components, the HP
encoder system takes advantage of a specialized
optical design and a· custom integrated circuit to
deliver superior performance in a compact package. The design also minimizes the mechanical
tolerances required of the shaft and mounting surface. The HEDS-5000 and HEDS-6000 encoders
are available with a range of options including
resolution and shaft sizes.

The HCTL-2000 Quadrature Decoder Counter
IC provides a one chip, easy to implement solution
to interfacing the quadrature· output of an encoder
or digital potentiometer to a microprocessor. It
includes a quadrature decoder, a 12 bit up!down
state counter, and an 8 bit bus interface. The use
of Schmitt triggered inputs and a digital noise ftlter allows reliable operation in noisy environments.

The HEDS-'7000 series digital potentiometer is a
28 mm diameter encoder completely assembled
with a shaft and bushing, making it suitable-for
panel mounting. The device converts manual
rotary inputs into digital outputs using the same
high performance emitter!detector technology
used in our encoders. A digital potentiometer can

Optical Shaft Encoder

For more information on these new product
developments, contact your local Hewlett-Packard
Components Field Engineer, or write Hew1ettPackard Optoelectronics Division, 640 Page Mill
Road, Palo Alto, California 94304.

Digital Potentiometer
1-2

Motion Control IC

---------------------- ._._--------------------------

Motion Sensing and Control
28 mm Diameter Encoders -

HEDS-5000 Series

Option Code
Package Outline Drawing

Part No.

Channels

HEDS-SOOO
OPTD m

A,B

HEDS-S010
OPTD m

A, B, I

Shaft Size

Resolution

CD

D

~~C;\!
.

a.

,

':(! ..j)

~

L~

56 mm Diameter Encoders -

I

Page No.

C 100 CPR
D 192 CPR
E 200 CPR
F 2S6 CPR
G 360 CPR
H 400 CPR
A SOO CPR
.. S12 CPR

01
02
03
04
OS
06
11
14

•

2mm
3mm
118 in.
S/32 in .
3/16 in.
1/4 in.
4mm
Smm

l-S

HEDS-6000 Series

Option Code
Package Outline Drawing

cr

=

rr @d
y

11111\\~

I'

\.d

Part No.

Channels

HEDS-6000
OPTD OJ

A, B

HEDS-6010
OPT D OJ

A, B, I

"-'\

I

\ I

O:~:)Ol :
I
I

I,
I,

'-'-

Shaft Size

Resolution
D
E 200 CPR
H 400 CPR
A SOD CPR
I S12 CPR
B 1000 CPR
J 1024 CPR

r

Page No.

m
OS
06
07
08
09
10
11
12
13

•

3/16 in.
114 in.
S/16 in.
3/8 in.
1/2 in.
S/8 in.
4mm
6mm
8mm

1-13

Digital Potentiometer - HEDS-7500 Series

Package Oulline Drawing

&

Part No.

Resolution

Termination

Page No.

HEDS-7S00

2S6 CPR

Color Coded Wire

1-21

HEDS-7S01

2S6 CPR

Ribbon Cable

. 1-3

- - - - - _ . _ .. _-- -_..._- _...._----_.. _-_._-----_._-_ ..- _._--------

_._-----_._._----------

Motion ControllCs - HCTL-XXXX Series

Package Outline

NC'[~JOE
ADO/OBO [

2

AOT/OBl [

3

38 ]-ALE

AD2/DB2 [

4

37

AD3/0B3 [

5

36 J-RESET

6

35 ] Vee

AD5/DB5 [

7

34 ]eXTCLK

OB6 [

B

33 ] 'INDEX

DB7 [

9

32 ] Vss

Vss [

10

J

General Purpose Motion Control IC

1-23

HCTL-2000

Quadrature Decoder/Counter IC

1-43

CHA

VCC[ 11

30 ]CHB

PROF[ 12

29 ] PHD

13

28 ] PHC

LIMIT[ 14

27 ] PHS

STOpe 15

HCTL-1000

J R/W

AD4/DB4 [

INIT [

Page
No.

cs

39 ]

31

Descrlplion

Part No.

26 ] PHA

PULSE [

16

25

SIGN [

17

24

MeO [

18

23

MeT [

19

22

Me2 [

20

21

P
P
P
P
P

Me7
Me6
MC5
MC4

Me3

* SHOULD BE LEFT FLOATING.

D8[~PVOO
elK [

2

SEL [

3

15

14

P

01

tJ 02

DE/[ 4

13J03

RST/[ 5

12p04

CHA[ 6

11 pOS

CHB [

7

10006

Vss [

8

9

J

D7

Convenience Assembly Tools for 28 mm Diameter Encoders -

Package Outline Drawing

Not Required

Description

Part No.
HEDS-S930

HEDS-5000 Series Tool Kit

•
•
•
•

HEDS-S92X

Centering Cones

• Aid in High Volume Assembly
• Order in Appropriate Shaft Size

1-4

Holding Screwdriver
Torque Limiting Screwdriver
HEDS-S920 Hub Puller
HEDS-S922 Gap Setter

Page
No.
1-5

rh~

~~

HEWLETT
PACKARD"

28 mm DIAMETER
TWO AND THREE! CHANNEL
INCREMEN:TAL OPTICAL
ENCODER KIT

HEDS-5000
S~RIES

TECHNICAL DATA JANUARY 1986

Features
•
•
•
•
•
•
•
•
•
•

SMALL SIZE - 28 mm DIAMETER
100-512 CYCLES/REVOLUTION AVAILABLE
MANY RESOLUTIONS STANDARD
LOW INERTIA
QUICK ASSEMBLY
0.25 mm (.010 INCHES) END PLAY
ALLOWANCE
TTL COMPATIBLE DIGITAL OUTPUT
SINGLE 5V SUPPLY
WIDE TEMPERATURE RANGE
INDEX PULSE AVAILABLE

Description
The HEDS-5000 series is a high resolution incremental optical encoder kit emphasizing reliability and ease of assembly.
The 28 mm diameter package consists of 3 parts: the
encoder body, a metal code wheel, and an emitter end plate.
An LED source and lens transmit collimated light from the
emitter module through a precision metal code wheel and
phase plate into a bifurcated detector lens.
The light is focused onto pairs of closely spaced integrated
detectors which output two square wave signals in quadrature and an optional index pulse. Collimated light and a
custom photodetector configuration increase long life reliability by reducing sensitivity to shaft end play, shaft
eccentricity and LED degradation. The outputs and the 5V
supply input of the HEDS-5000 are accessed through a 10
pin connector mounted on a .6 metre ribbon cable.

outline Drawing
r----I
I

I~

600(Z4J---------j

A standard selection of shaft sizes and resolutions between
100 and 512 cycles per revolution are available. Consult the
factory for custom resolutions. The part number for the
standard 2 channel kit is HEDS-5000, while that for the 3
channel device, with index pulse, is HEDS-5010. See Ordering I nformation for more details. For additional design
information, see Application Note 1011.

Applications
Printers, Plotters, Tape Drives, Positioning Tables, Automatic Handlers, Robots, and any other servo loop where a
small high performance encoder is required.

7:82

10.3081

(3EQUAlLYSPACEDI

rI

17•3

A~I

----jI

;-,---t-__
tOPCSITION
IDC CONNECTOA
CENTER POLARIZED

PHASE PLATE

CODE
WHEEl.,

EMITTER END PLATE

L:

Lt7.8

SECTION A-A

(.701

A...........

TYPICAL DIMENSIONS IN MILLIMETRES ANO IINCHES)

1-5

(~~1;J MAX. DIA.

-------lI

Block Diagram and output waveforms
r- -

-

-

-

-

-

-

AS VIEWED FROM EMITTER END PLATE)

I

RESISTOR

PHASE PLATE

(FOR COUNTER CLOCKWISE ROTATION OF CODE WHEEL

REsiSToR - - - - I

Iz
Vee

"\ 1.6V-F"'i-'J

-L-J

>-+----.-'-0

VOA

~}GROUNO

~

I
CHANNEL B Is

DOO:OT

\ --r-\

O.4V~1

-F CHANNEL A

~

~CHANNELB

CONNECT

VOB

I

I

I

+11

I
I

r----'AA''''

I10

CHANNEL I
>-+----1-0

Po;; A" B" T
VOl

¢1

Po

1 -<1>2)

2

.

<1>1 is the angle, in electrical degrees between the falling edge
of I and falling edge of B. <1>2 is the angle, in electrical

degrees, between the riSing edge of A and the rising edge
of I.
Index Phase Error:
The Index Phase Error (Ll.

'; ...

':.'

..

(X

.Notes
SeeNote 1
SeilN9te 1
Movementshould be
limite~.even under
. shock conditions •

...

.:

';:·:.s

Recommended operating Conditions
Paramelllr:,

SyJnbol ...

i "".'

"

Temperature
....
Supply Voltage
Cpqelf:Jn,e,e) Gap
Spaft Perperi;dicularity
PluS Axialp1ay
Shan Eccentricity Plus
Radial Play
Load C~ea6itance

Min.

:lIiIax.

-20
4.5

85
5.5
1.1 (45)
0.25 (10)

'T.
Vce

...... .,.,'

0.04 (1.5)

100

CI-

Units

~(ltes

. Nb·n-condenslngatmos.
°Celsius
Ripple < 100ff]yP;-.p;
'.
Volt
mff].(inchlloqol Nominal gap =
0.63 mm (.025 in.) when shaft
mm (inch/1000)
is at minimum gap position.
TIR
mm (in6tilfoOO) 10 mm (0.4 inch) from
mounting surface.
TlR
pF

Encoding Characteristics
The specifications below apply within the recommended operating conditions and reflect performance at 500 cycles per
revolution (N = 5001. Some encoding characteristics improve with decreasing cycles (Nl. Consult Application Note 1011 or
factory for additional details.
Parameter
Position Error Worst Error Full
Rotation

Symbol
","6

Cycle Error Worst Error Full
Rotation

e.C

Max. Count Frequency
Pulse Width Error Worst Error Full
Rotation
Phase Sensitivity to
Eccentricity

fMAx
e.P

Min.

130,000

Phase Sensitivity to
Axial Play

Typ,

Max.

Units

Notes (See Definitions)

10

40

Minutes of Arc

1 Cycle'" 43.2 Minutes
See Figure 5.

3

5.5

Electrical deg.

200,000

Hertz

16

Electrical deg.

520
(13)

Elec. deg./mm
(Elec. deg./mil)

20
(.5)

Elec. deg./mm
(Elec. deg./mill

f '" Velocity (RPM) x N/60

T "" 25° C, f = 8 KHz
See Note 2

mil = inch/1000
mil "" inch!1000

Logic State Width ErrorWorst Error Full
Rotation

","S

25

Electrical deg.

T z 25° C, f "" 8 KHz
See Note 2

Index Pulse Width

PI

360

Electrical deg.

T =25° C, f = 8 KHz
See Note 3

Index Phase Error

">4>1

Electrical deg.

See Notes 4, 5

Electrical deg.

See Note 5

Index Pulse Phase
Adjustment Range

0
±70

17

±130

1-7
.- ..-

.. _'---_

..

_--------_ .. _.

__

.....

Mechanical Characteristics
Parameter

Symbol

Dimension

Outline Dimensions

Tolerance

Units

+.000
-.015

mm

+.0002
-.0005

inches

+.0000
-.0007

inches

Notes

See Mech. Dwg.

Code Wheel Available to
Fit the Following Standard
Shaft Diameters

4
5

2
3

5/32
1/8

3/16

0.4 (6 x 10-6 )

J

Moment of Inertia

1/4

Required Shaft Length

Bolt Circle

gcm2 (oz-in-s2)

12.8 (.50)

±O.S (±D.02)

mm (inches)

See Figure 10.
Shaft in minimum
length position.

20.9 (.823)

±0.13 (±.005)

mm (inches)

See Figure 10.

1.S x 0.35 x 5 mm

Mounting Screw Size

mm

OIN84
or
0-80 x 3/16
Brnding Head

inches

Electrical Characteristics When operating within the recommended operating range.
Electrical Characteristics over Recommended Operating Range (Typical at 25°C).

Parameter

Min.

Symbol

Supply Current

ICG

High Level Output
Voltage

VOH

Low Level Output
Voltage

VOL

Typ.

Max.

Units

21

40

rnA

36

SO

2,4

0.4

Rise Time

t,-

0.5

Fall Time

tf

0.2

Ceo

12

Cable Capacitance

Notes
HEOS-50oo (2 Channel)
HEDS-5010 (3 Channel)

V

IOH = -40pA Max.

V

IOL=3.2 mA

P.s

CL '" 25 pF, RL = 11K Pull-up
See Note S

pF/metres

Output Lead to Ground

NOTES:
1. The structural parts of the HEDS-5000 have been tested to 20g and up to 500 Hz. For use outside this range, operation may be limited
at low frequencies (high displacement) by cable fatigue and at high frequencies by code wheel resonances. Resonant frequency
depends on code wheel material and number of counts per revolution. For temperatures below -20° C the ribbon cable becomes
brillie and sensitive to displacements. Maximum operating and storage temperature includes the surface area of the encoder mounting. Consult factory for further information. See Application Note 1011.
2. In a properly assembled lot 99% of the units, when run at 25° C and 8 KHz, should exhibit a pulse width error less than 35 electrical
degrees, and a state width error less than 45 electrical degrees. To calculate errors at other speeds and temperatures add the values
specified in Figures 1 or 2 to the typical values specified under encoding characteristics or to the maximum 99% values specified in this
note.
3. In a properly assembled lot, 99% of the units when run at 25° C and 8 KHz should exhibit an index pulse width greater than 260
electrical degrees and less than 460.electrical degrees. To calculate index pulse widths at other speeds and temperatures add the
values specified in Figures 3 or 4 to the typical 360° pulse width or to the maximum 99% values specified in this note.
4. After adjusting index phase at assembly, the index phase error specification (d1-

~~
ww

(!",
zz

""
""

:J::J:

60

~~

50
40
30
20
10
0
-10
-20
-30

WW

"'I-

50

wW

",I-

....~t;

"

40
30

~~
ww

20
10

,,,,
zz

""

::~.f

:J::J:

.-... -:::

-40

-60

-10
-20

""

-30
-40

-20

-40

-40

-60

TEMPERATURE IN DEGREES CENTIGRADE

Figure 1_ Typical Change In Pulse Widlh Error or in State
Width Error due to Speed and Temperature

20

-20

~

:;;

-50

W

-60

'z"
""

-10

~

-20

W

~

-30
-40

~ -50

:;;
W

'z"
""

-70

:J:

:J:

I0

-40

~

100

10

-30

W

80

20

10
-10

60

3Or--------------------------------------,

30

~

40

ELECTRICAL
DEGREES

DEGREES

I0

20

Figure 2. Maximum Change In Pulse Width Error or in
State Width Error Due to Speed and Temperature

ELECTRICAL

:J:

-20

TEMPERATURE IN DEGREES CENTIGRADE

-80

:J:

-90

-60
-70
-80
-90
-100

-lOa

-110

-110
-120

-60

-20

-40

20

40

60

80

-120

100

-60

TEMPERATURE IN DEGREES CENTIGRADE

TEMPERATURE IN OEGREES CENTIGRADE

Figure 3. Typical Change in Index Pulse Width Due to
Speed and Temperature

Figure 4. Maximum Change in Index Pulse Width Due to
Speed and Temperature

PIN

- - t -.......- - - - - - - Vee
50

~

45 f-JAX.IERRbA
OPERATING CON?IT1YNS
40
I"

35

./'

0::",

0"
O::u.

ffiO

zffl
01E~

"'~"

30

,/'

25
20

1/674LS14

1

V

00 PERCENTILE

...-

10

V

m

JJ

--,

I

T

~_ii

I

.08

.09 .1

GROUND

4 - - - } (GROUND OR DO

141 0/1000 INCH)

131

.03 .04 .05 .06 .07

Po

1I374LS11

1/674LS14

:-:=J-,.----------

\21

L_

8~--J

TYPICAL

k- .".

.01 .02

{p=
JJ -------r==D--1674LS14

Y

V'

0.01 pF

9~;J;A

v'

fi

/1/

15
10

7

/'

wdAsr l CAiE

5 ---

NOT CONNECTI

MI LlIMETRES

SHAFT ECCENTRICITYDASHED LINES REPRESENT AN OPTIONAL INOEX SUMMING CIRCUIT.
STANDARD 74 SERIES COULD ALSO BE USED TO IMPLEMENT THIS CIRCUIT.

Figure 5. Position Error

VS.

Shalt Eccentricity

Figure 6. Recommended Interlace Circuit

1-9

PINOUT

PIN #

FUNCTION
CHANNEL A
Vee
GROUND
N.C. OR GROUND
N.C. OR GROUND
GROUND
Vee
CHANNEL B
Vee
CHANNEL I

4

5

BOTTOM VIEW

10

/

ENCODER BODY

PHASE PLATE

NOTE: REVERSE INSERTION OF THE CONNECTOR
WilL PERMANENTLY DAMAGE THE DETECTOR IC.
MATING CONNECTOR
BERG 65·692'()01 OR EQUIVALENT

Figure 7. Connector Specifications

Figure 8. HEDS-5000 Series Encoder Kit

M 1.6 x .35 150 GH
OR
0·80 UNF·2B

-A---20.90 DIA.
1.823DIA.)

1.1

A

1.01·20/1.008) 1

25.15

1.990)

DIAMETER

5.38:! .31

UNITS mm (INCHES)

MILLIMETRE .X ±.5 .XX ± .10
(INCHES) (.XX ± .02 .XXX ± .005)

1.212' .012)

Figure 9. Code Wheel

Figure 10. Mounting Requirements

Ordering Information
HEDS-5
OPTION*y

PRODUCT TYPE

RESOLUTION [CYCLES PER REVOLUTIONI
C-l00CPR
G-360CPR
D - 192 CPR
H - 400 CPR
E - 200 CPR
A - 500 CPR
F - 256 CPR
1- 512 CPR
NOTE: OTHER RESOLUTIONS AVAILABLE
ON SPECIAL REQUEST.

0- 28 mm COMPLETE KIT
1 - 28 mm CODE WHEEL
2 - 28 mm ENCODER BODY
3 - 28 mm EMITTER END PLATE'

OUTPUTS
SHAFT PIA METER

o-

2 CHANNEL DIGITAL
1 - 3 CHANNEL DIGITAL

01 -2mm
02- 3mm

03-1/8 in.
04-5/32 in,
05- 3/16 in.
06- 1/4 In.

MECHANICAL CONfiGURATION
0- 0.6 m (24 in.) CABLE

11-4mm
14-5mm
00 - USE WHEN ORDERING
ENCODER BODIES

"NO OPTION IS SPECIFIED WHEN ORDERING
EMITTER END PLATES ONLY.

1-10

Shaft Encoder Kit Assembly

See Application Note 1011 for further discussion.

The following assembly procedure represents a simple and reliable method for prototype encoder assembly. High volume assembly may
suggest modifications to this procedure using custom designed tooling. In certain high volume applications encoder assembly can be
accomplished in less than 30 seconds. Consult factory for further details. Note: The code wheel to phase plate gap should be set between
0.D15 in. and 0.045 in.

IWARNING: THE ADHESIVES USED MA Y Bt;: HARMFUL. CONSUL T THE MANUFACTURER'S RECOMMENDA TlONS.'

READ THE INSTRUCTIONS TO THE END BEFORE STARTING ASSEMBLY.
3.0 ENCODER BODY ATTACHMENT

1.0 SUGGESTED MATERIALS
1.1

Encoder Parts
Encoder Body
Emitter End Plate
Code Wheel

1.2 Assembly Materials
RTV - General Electric 162
- Dow Corning 3145
Epoxy-Hysol1 C
Acetone
Mounting Screws (3)
RTV and Epoxy Applicators
1.3 Suggested Assembly Tools
a) Holding Screwdriver.
b) Torque Limiting Screwdriver, 0.36 cm kg (5.0 in. oz.).
c) Depth Micrometer or HEDS-S922 Gap Setter.
d) Oscilloscope or Phase Meter (Described in AN 1011). Either
may be used for two channel phase adjustment. An oscilloscope is required for index pulse phase adjustment.

3.1

Place the encoder body on the mounting surface and slowly
rotate the body to spread the adhesive. Align the mounting
screw holes with the holes in the body base.

3.2

Place the screws in the holding screwdriver and thread them
into the mounting hgJes. Tighten to approximately 0.36 cm kg
(5.0 in. oz.) using a tOrque limiting screwdriver if available (See
notes a and b below). Remove centering cone if used.

Notes:
a) At this torque value, the encoder body should slide on the
mounting surface only with considerable thumb pressure.
b) Thetorque limiting screwdriver should be periodically calibrated
for proper torque.

1,4 Suggested Circuits
a) Suggested circuit for index adjustment (HEDS-5010).

B

4,0 EPOXY APPLICATION

A

OUTPUT TO OSCILLOSCOPE
BUFFER

A

1/474LS32

For optimal index phase, adjust encoder position to equalize T1 and T2 pulse widths.
b) Rhase Meter Circuit
Recommended for volume assembly. Please see Application Note 1011 for details.

2.0 SURFACE PREPARATION

4..1

Collect a small dab of epoxy on an applicator.

4.2

Spread the epoxy inside the lower part of the hub bore.

4.3

Holding the code wheel by its hub, slide it down the shaft just
enough to sit it squarely. About 3 mm (1/S").

5.0 CODE WHEEL POSITIONING

-_ _ A'

THE ELAPSED TIME BETWEEN THIS STEP AND THE
COMPLETION OF STEP 8 SHOULD NOT EXCEED 1/2
HOUR.

2.1

5.1

Clean and degrease with acetone the mounting surface and
shaft making sure to keep the acetone away from the motor
bearings.

2.2

Load the syringe with RTV.

2.3

Apply RTV into screw threads on mounting surface. Apply
more RTV on the surface by forming a daisy ring pattern
connecting the screw holes as shown above. .

Take up any loose play by lightly pulling down on the shaft's
load end.

5.2 Using the gap setter or a depth micrometer, push the code
wheel hub down to a depth of 1.65 mm (.065 in.) below the
rim of the encoder body. The registration holes in the gap
setter will align with the snaps protruding from the encoder
body near the cable.
5.3 Check that the gap setter or micrometer is seated squarely
on the body rim and maintains contact with the code wheel
hub.
5.4 No epoxy should extrude through the shaft hole.

I CAUTION: KEEP RTV AWAY FROM THE SHAFT BEARING.'

DO NOT TOUCH THE CODE WHEEL AFTER ASSEMBL Y.

1-11
.-

- - - -_ _ _ _ _ _ _ 00 _ _ _ _ _ _ _

6.0 EMITTER END PLATE

8.0 INDEX PULSE ADJUSTMEI\IT (HEDS-5010)

8.1

6.1

Visually check that the wire pins in the encoder body are
straight and straighten if necessary.

6.2 Hold the end plate parallel to the encoder body rim.Align the
guiding pin on the end plate with the hole in the encoder
body and press the end plate straight down until it is locked
into place.

8.2 Connect the encoder cable.
8.3

Run the motor. Adjust for minimum phase error using an
oscilloscope or phase meter (see 7.3).

8.4

Using an oscilloscope and the circuit shown in 1.4, set the
trigger for the falling edge of the I output. Adjust the index
pulse so that T1 and T2 are equal in width. The physical
adjustment is a side to side motion as shown by the arrow.

8.5

Recheck the phase adjustment.

8.6

Repeat steps 8.3-8.5 until both phase and index pulse position are as desired.

8.7

No stress should be applied to the encoder package until the
RTV has cured. Cure time: 2 hours@70'Cor24hrs.at room
temperature.

6.3 Visually check to see if the end plate is properly seated.

7.0 PHASE ADJUSTMENT

Some applications require that the index pulse be aligned
with the main data channels. The index pulse position and
the phase must be adjusted simultaneously. This procedure
sets index phase to zero.

SPECIALITY TOOLS -

7.1

HEDS-8920 Hub Puller
This tool may be used to remove code wheels from shafts
after the epoxy has cured.

b)

HEDS-8922 Gap Setter
This tool may be used in place of a depth micrometer as
an aid in large volume assembly.

The following procedure should be followed when phase
adjusting channels A and B.

k

7.2 Connect the encoder cable.
7.3

7.4

Run the motor. Phase corresponds to motor direction. See
output waveforms and definitions. Using either an oscilloscope or a phase meter, adjust the encoder for minimum
phase error by sliding the encoder forward or backward on
the mounting surface as shown above. See Application Note
1011 for the phase meter circuit.

( 165'
065 + 03mm
001 In.)

J'~o
o

c)

No stress should be applied tothe encoder package until the
RTV cures. Cure time is 2 hours @ 70' C or .24 hrs. at room
temperature.

Note: After mounting, the encoder should be free from mechanical forces that could cause a shift in the encoder's position
relative to its mounting surface.

HEDS-892X Centering Cones
For easier volume assembly this tool in its appropriate
shaft size maybe used in step 3.0 to initially center the
encoder body with respect to the shaft and aid in locating
the mounting screw holes. Depending on the resolution
and accuracy required this centering may eliminate the
need for phase adjustment steps 7 and 8.
Pari Number
HEDS-8923
HEDS-8924
HEDS-8925
HEDS-8926
HEDS-8927
HEDS-8928
HEDS-8929
HEDS-8931

CODE WHEEL REMOVAL
In the event that the code wheel hasto be removed after the epoxy
has set, use the code wheel extractor as follows:
1 Remove the emitter end plate by prying a screwdriver in the
slots provided around the encoder body rim. Avoid bending
the wire leads.
2 Turn the screw on the extractor counter-clockwise until the
screw tip is no longer visible.
3 Slide the extractor'S horseshoe shaped lip all the way into the
groove on the code wheel's hub.
4 While holding the extractor body stationary, turn the thumb
screw clockwise until the screw tip pushes against the shaft.
5 Applying more turning pressure wiil pull the hub upwards
breaking the epoxy bond.
6 Clean the shaft before reassembly.

Available from Hewlett-Packard

a)

d)

Shall Size
2 mm
3mm
1/8 in.
5/32 in.
3/16 in.
1/4 in.
4 mm
5 mm

HEDS-8930 HEDS-5000 Tool Kit
1
Holding Screwdriver
1
Torque Limiting Screwdriver, 0.36 cm kg (5.0 in. oz.)
1
HEDS-8920 Hub Puller
~
1
HEDS-8922 Gap Setter
1
Carrying Case
~

~~
~

~~~
1-12

rh~

a!~

56 mm DIAMETER
TWO AND THREE
CHANNEL INCREMENTAL
OPTICAL ENCODER KIT

HEWLETT
PACKARD

HEDS-6000
SERIES

TECHNICAL DATA

JANUARY 1986

Features
•
•
•
•
•
•
•
•
•

192-1024 CYCLES/REVOLUTION AVAILABLE
MANY RESOLUTIONS STANDARD
QUICK ASSEMBLY
0.2S.mm (.010 INCHES) END PLAY ALLOWANCE
TTL COMPATIBLE DIGITAL OUTPUT
SINGLE SV SUPPLY
WIDE TEMPERATURE RANGE
SOLID STATE RELIABILITY
INDEX PULSE AVAILABLE

Description
The HEDS-6000 series is a high resolution incremental
optical encoder kit emphasizing ease of assembly and
reliability. The 56 mm diameter package consists of 3 parts:
the encoder body, a metal code wheel, and emitter end plate.
An LED source and lens transmit collimated light from the
emitter module through a precision metal code wheel and
phase plate into a bifurcated detector lens.
The light is focused onto pairs of closely spaced integrated
detectors which output two square wave signals in
quadrature and an optional index pulse. Collimated light and
a custom photodetector configuration increase long life
reliability by reducing sensitivity to shaft end play, shaft
eccentricity and LED degradation. The outputs and the 5V
supply input of the HEDS-6000 are accessed through a 10
pin connector mounted on a .6 metre ribbon cable.

A standard selection of shaft sizes and resolutions between
192 and 1024 cycles per revolution are available. Consult
the factory for custom resolutions. The part number for the
standard 2 channel bit is HEDS-6000, while that for the 3
channel device, with index pulse, is HEDS-6010. See
Ordering Information for more details. For additional design
information, see Application Note 1011.

Applications
Printers, Plotters, Tape Drives, POSitioning Tables, Automatic Handlers, Robots, and any other servo loop where a
small high performance encoder is required.

outline Drawing
I--I;'j~)

~ITION

....--I---i

IOC CONNECTOR
CENTER
POLARIZED

PHASE PLATE

CODE
WHE"L

26.9
(1.020)
61.2
(2.4101
3.~DIA.

10.1281

I
L19.6_1
!-t==:::i.1

ENCDDER eODY

.!..J

10.na)

S~CTIONA·A

1 - - - - 5 5 . 9 MAX. D I A . - - -... I
TYPICAlOlMENSIONS IN MIL~IMETRES AND (INCHES).

1-13

12.200}

Block Diagram and Output waveforms
r-

(FOR COUNTER CLOCKWISE ROTATION OF CODE WHEEL
AS VIEWED FROM EMITTER END PLATE)

-------R'EsiSTo"'A----1

I
b
vee
"\

1.6V--Fl"'\1

~

>-+----t"'-<>
L}GROUND
VOA

~ DOO~OT

I
CHANNEL B Is

~CHANNELB

CONNECT
VOS

I

\ I i r-,-"'''

I
I
CHANNEL I

I ~
-FCHANNELA
.L-J

O.4V~1

I10
¢1

Theory of Operation
The incremental shaft encoder operates by translating the
rotation of ashaft into interruptions of a light beam which are
then output as electrical pulses.
In the HEDS-6XXXthe light source is a Light Emitting Diode
collimated by a molded lens into a parallel beam of light. The
Emitter End Plate contains two orthree similar light sources,
one for each channel.
The standard Code Wheel is a metal disc which has N
equally spaced slits around its circumference. An aperture
with a matching pattern is positioned on the stationary
phase plate. The light beam is transmitted only when the slits
in the code wheel and the aperture line up; therefore, during
a complete shaft revolution, there will be N alternating
light and dark periods. A molded lens beneath the phase
plate aperture collects the modulated light into a silicon
detector.
The Encoder Body contains the phase plate and the detection elements for two or three channels. Each channel
consists of an integrated circuit with two photodiodes and
amplifiers, a comparator, and output circuitry.
The apertures forthe two photodiodes are positioned so that
a light period on one detector corresponds to a dark period
on the other. The photodiode signals are amplified and fed to
the comparator whose output changes state when the difference of the two photo currents changes sign ("PushPull"). The second channel has a similar configuration but
the location of its aperture pair provides an output which is in
quadrature to the first channel (phase difference of 90 0 I.
Direction of rotation is determined by observing which of the
channels is the leading waveform. The outputs are TTL logic
level signals.
The optional index channel is similar in optical and electrical
configuration to the A,B channels previously described. An
index pulse of typically 1 cycle width is generated for each
rotation of the code wheel. USing the recommended logic
interface, a unique logic state (Pol can be identified if such
accuracy is required.
The three part kit is assembled by attaching the Encoder
Body to the mounting surface using two screws. The Code
Wheel is set to the correct gap and secured to the shaft.
Snapping the cover (Emitter End Platel on the body completes the assembly. The only adjustment necessary is the
encoder centering relative to the shaft, to optimize quadrature and optional index pulse output.

Po

fjJ2

Index Pulse Considerations

The motion sensing application and encoder interface circuitry will determine the need for relating the index pulse to
the main data tracks. A unique shaft position is identified by
using the index pulse output only or by logically relating the
index pulse to the A and B data channels. The HEDS-6010
index pulse can be uniquely related with the A and B data
tracks in a variety of ways providing maximum flexibility.
Statewidth, pulse width or edge transitions can be used. The
index pulse position, with respect to the main data channels,
is easily adjusted during the assembly process and is illustrated in the assembly procedures.

Definitions
Electrical degrees:
1 shaft rotation = 360 angular degrees
= N electrical cycles
= 360 electrical degrees
1 cycle
Position Error:
The angular difference between the actual shaft position and
its position as calculated by counting the encoder's cycles.
Cycle Error:
An indication of cycle uniformity. The difference between an
observed shaft angle which gives rise to one electrical cycle,
and the nominal angular incrementof 1/N of a revolution.
Phase:
The angle between the center of Pulse A and the center of
Pulse B.
Index Phase:
For counter clockwise rotation as illustrated above, the
Index Phase is defined as:
1-21.

2
1 is the angle, in electrical degrees, between the falling edge
of I and falling edge of B. 2 is the angle, in electrical

degrees, between the rising edge of A and the rising edge
of!.
Index Phase Error:
The Index Phase Error (~T·ENTIG>METE'R

HEDS':7500

TECHNICAL DATA JANUARY 1986

Features
• DESIGNED FOR MANUAL OPERATION
• SMALL SIZE
• RELIABLE OPTICAL TECHNOLOGY
• 256 PULSES PER REVOLUTION STANDARD
Other Resolutions Available
• TTL COMPATIBLE DIGITAL OUTPUT
• SINGLE 5 V SUPPLY
• _20° TO +85°C OPERATING RANGE
• 0.1 OZ.-IN. NOMINAL SHAFT TORQUE

Description
The HEOS~7500 series is a family of digital potentiometers
designed for applications where a hand operated panel
mounted encoder is required, The unit outputs two digital
waveforms which are 90 degrees out of phase to provide
resolution and direction information, 256 pulses per revolution is available as a standard resolution, The digital
outputs and the 5 V supply input of the HEOS-7500 are
accessed through color coded wire or through a 10 pin
connector mounted on a 6 inch ribbon cable. Each digital
output is capable of driving two standard TTL loads.

code wheel rotates between the LED and detector to provide digital pulses without wipers or noise, The
HEOS-7500 is configured to provide standard potentiometer type panel mounting, Additional design information is
available in Application Note 1025,

Applications
The HEOS-7500 series digital potentiometer may be used
in applications where a manually operated knob is
required to convert angular position into digital
information.

The HEOS-7500 emphasizes reliability by using solid state
LEOs and photodiode detectors, A non-contacting slotted

outline Drawing

r-'531611----t--- 30
1

,9t1,221------

rl'3'281:~:~1

12"IQ'sOll

10 PoSITJON

IDC CONNECTOR
CENTER POLAR lIED

OR

4 C01.0R CODEO

~

. . ~_JkO
10,250'0.000,-0,00031

THREAD 3/8~32
NUT SUPPLIED

L

!~~1;i MAX, OIA.

TYPICAL DIME.NSIONS tN MRl.1METRES AND ilNCHES)

1-21
----~~----~.---~-,.

~

"

..,'

..

~~~-'-~'-

Absolute Maximum Ratings
Symbol

Min.

Max.

Units

Storage Temperature

Ts

-40

+85

Operating Temperature

TA

-40

Parameter

Notes

+85

DC
DC

Vibration

20

g

20 Hz - 2 kHz

Shock

30

g

11 msec

Supply Voltage

Vee

-0.5

7

V

Output VOltage

Va

-0.5

Vee

V

10

-1

5

Output Current per Channel
Shaft load -

mA

Radial
Axial

Ibs.
Ibs.

Recommended Operating Conditions
Parameter

Symbol

Min.

Max.

Units

T

-20

85

DC

Vee

4.5

5.5

V

300

RPM

Temperature
Supply Voltage
Rotation Speed

Noles
Non-condensing atmosphere
Ripple < 100 mV p _p

Electrical Characteristics

When operating within the recommended operating range.
Electrical Characteristics Over Recommended Operating Range Typical at 25° C.
Parameter

Symbol

Supply Current

Min.

Typ.

Max.

Units

21

40

mA

V

IOH = -40 )J.A Max.

004

V

IOL =3.2 rnA

lee

High level Output Voltage

VOH

low level Output Voltage

VOL

204

Notes

CAUTION: Device not intended for applications where coupling to a motor is required.

WAVEFORMS

RECOMMENDED INTERFACE CIRCUIT
CHANNEL A

I

A

I

--

vee

I
CHA

CH B

CHANNEL B

---~---CH B LEADS CH A FOR COUNTERCLOCKWISE ROTATION.
CH A LEADS CH B FOR CLOCKWISE ROTATION.

STANDARD 74 SERIES COULD ALSO BE USeD TO IMPLEMENT THIS CIRCUIT.

TERMINATION
Ribbon Cable Termination
PIN#

1

g~~]
~@J@J
@JrgJ

9

10
BOTTOM VIEW

Color Coded Wire Termination

Ordering Information

PINOUT

2

~@J[gJ

GROUND

GROUND

10

FUNCTION

COLOR

DESIGNATION

CHANNEL A

WHITE/BLACK/RED
WHITE/BLACK/BROWN
WHITE/RED
BLACK

CHANNEL A
CHANNEL B

Vee
GROUND
N.C. OR GROUND
N.C. OR GROUND
GROUND
Vee
CHANNEL'B
Vee
N.C.

Part Number

Vee
GROUND

NOTE: REVERSE INSERTION OF THE
CONNECTOR WILL PERMANENTLY
DAMAGE THE DETECTOR Ie.

MATING CONNECTOR
BERG 65-692-001 OR eQUIVALENT

1-22

Description
PPR

Termination

HEDS-7500

256

Wire

HEDS-7501

256

Cable

9§,~ERAL

PURPOSE
MOTION CONlROL Ie

HCTL-1000

TECHNICAL DATA

Features

JANUARY 1986

OE

• DC, DC BRUSHLESS AND STEPPER MOTOR
CONTROL
• POSITION CONTROL
• VELOCITY CONTROL

ADO/OBo

(OS

AOt/OS l

ALE

AOzlOB2

RM

A03-IDB 3

RESET

AD4!OB,iI

ADs/DBs

• PROGRAMMABLE VELOCITY PROFILING

Vee

7

eXTCLK

iJ'ifi1'X
V,s

• PROGRAMMABLE DIGITAL FILTER
Vss

• PROGRAMMABLE COMMUTATOR

Vee

• PROGRAMMABLE PHASE OVERLAP
• PROGRAMMABLE PHASE ADVANCE
• GENERAL 8 BIT PARALLEL 1/0 PORT
• 8 BIT PARALLEL MOTOR COMMAND PORT
• PWM MOTOR COMMAND PORT
• QUADRATURE DECODER FOR ENCODER
SIGNALS

11

CHB

PROF

PHD

INIT

PHC

IJMTf

PHB

S'fi'jji

PHA

PULSE

MC,

SIGN

MG.

Meo
Me,

Mes
MG,

Me,
'Should be left floating
PINOUT

• 24 BIT POSITION COUNTER

Figure 1. System Block
Diagram

• SINGLE 5V POWER SUPPLY
• TTL COMPATIBLE

of control systems with a minimum number of components.
All that is needed for a complete servo system is a host
processor to specify commands, an amplifier and motor
with an incremental encoder. No analog compensation or
velocity feedback is necessary (see Figure 1l.

• 1 OR 2 MHz CLOCK OPERATION

General Description
The HCTL-1000 is a high performance, general purpose
motion control IC fabricated in Hewlett-Packard NMOS
technology. It performs all the time-intensive tasks of digital
motion control, thereby freeing the host processor for other
tasks. The simple programmability of all control parameters
provides the user with maximum flexibility and quick design

package Dimensions
OAIENTATIONNOTCH:

t::::-:

mw-----J

LpINNO.110

NOTES~

·1. EACH f'INCENTERLINE rOBE LOCAtEo
I/IIITHIN{J.010"OF fTSTROt

LONGltUOINAl POSITION.
2. ll:-AD FINt$H: SOLDER COA.T.

0.600 t 0.010

croc

OF BENO R

Table of Contents

PAGES

GENERAL DESCRIPTION ..................... 1
THEORY OF OPERATION ..................... 2
ABSOLUTE MAXIMUM RATINGS .............. 3
DC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . .. 3
AC CHARACTERISTICS ........ . . . . . . . . . . . . . .. 4
TIMING DIAGRAMS .......................... 5
FUNCTIONAL PIN DESCRIPTION .............. 9
HOW TO OPERATE THE HCTL-1000 .......... 10
- USER ACCESSIBLE REGISTERS ........... 10
- OPERATING MODES ...................... 12
- COMMUTATOR ........................... 15
HOW TO INTERFACE TO THE HCTL-1000 ..... 17
- 1/0 INTERFACE ........................... 17
- ENCODER INTERFACE .................... 18
- AMPLIFIER INTERFACE ................... 18

ESO WARNING: Since this is an NMOS device. normal
precautions should be taken to avoid static damage.
40-PIN PLASTIC DUAL-IN-L1NE PACKAGE

1-23

•

PROF

INIT

r----------------------------------,
ADo/DBO

MC,

AD1/D81

MC,
MC,

AD2/DB2
AD3/DBJ

AD4/DB4

MOTOR
COMMAND

MC3

PORT

MC,

ADs/DBS

MCs
I!OPORT

DB,

MC,

DB7

MC7

ALE

CS
PWM

I-+-

PULSE

~ SIGN
I

OE

L-_P_OR_T_...
RiW

COMMUTATOR
EXTCLK

RESET~

r
r
I
r
r

PHA
PHB

r

PHC

r

PHD

I
I
:
IL _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ I
~

CHA CHB

Figure 2. Internal Block Diagram

Introduction

Theory of operation

The purpose of this section is to describe the organization
of this data sheet. The front page includes the key features
of the HCTL-1000, a general description of the part, the
mechanical drawing and pin-out, and a Table of Contents.
Following this section is the Theory of Operation, which
gives the user a brief overview of how the HCTL-1000 operates by describing the internal block diagram shown in
Figure 2. The following five sections give the specifications
of the HCTL-1000, including Absolute Maximum Ratings,
DC Characteristics, AC Characteristics, Timing Diagrams,
and Functional Pin Descriptions. The final two sections
include the detailed information on how to operate and
interface to the HCTL-1000. The How to Operate section
discusses the function and address of each software register, and describes how to use the four position and velocity
control modes and the electronic commutator. The How to
Interface section describes how to interface the HCTL-1000
to a microprocessor, an encoder, and an amplfier.

The HCTL-1000 is a general purpose motor controller
which provides position and velocity control for dc, dc
brushless and stepper motors. The internal block diagram
of the HCTL-1000 is shown in Figure 2. The HCTL-1000
receives its input commands from a host processor and
position feedback from an incremental encoder with quadrature output. An a-bit bidirectional multiplexed address/data
bus interfaces the HCTL-1000 tothe host processor. The
encoder feedback is decoded into quadrature counts and a
24-bit counter keeps track of position. The HCTL-1000
executes anyone of four control algorithms selected by the
user. The four control modes are:
•
•
•
•

1-24

Position Control
Proportional Velocity Control
Trapezoidal Profile Control for point to point moves
Integral Velocity Control with continuous velocity profiling
using linear acceleration

---------~~--------

The resident Position Profile Generator calculates the necessary profiles for Trapezoidal Profile Control and Integral
Velocity Contol. The HCTL-1000 compares the desired position (or velocity) to the actual position (or velocity) to
compute compensated motor commands using a programmable digital filter D(zl. The motor command is externally
available at the Motor Command Port as an 8-bit byte and
at the PWM Port as a Pulse Width Modulated (PWM) signal.

tions. In addition, phase overlap and phase advance can be
programmed to improve torque ripple and high speed performance. The HCTL-1000 contains a number of flags
including two externally available flags, Profile and Initialization, which allow the user to see or check the status of the
controller. It also has two emergency flags, Limit and Stop,
which allow operation of the HCTL-1000 to be interrupted
under emergency conditions.

The HCTL-1000 has the capability of providing electronic
commutation for dc brushless and stepper motors. Using
the encoder position information, the motor phases are
enabled in the correct sequence. The commutator is fully
programmable to encompass most motor encoder combina-

The HCTL-1000 controller is a digitally sampled data system.
While information from the host processor is accepted
asynchronously with respect to the control functions, the
motor command is computed on a discrete sample time
basis. The sample timer is programmable.

Absolute Maximum Ratings
Operating Temperature ... , .....•....... , O°C to 70°C
Storage Temperature ...•...... , , , ... -40"C to +125°C
Sup pi/Voltage .. , ...................... -0.3 V to 7 V
Input Voltage .............. , ......... , .. -0.3 V to 7 V
Maximum Power Dissipation ", .....•• , .... , •. 0.95 W
Maximum Clock Frequency ... , ... '" ..... " .. 2 MHz

D.C. Characteristics Ta = O°C to +70°C; Vcc = 5 V ± 5%; Vss = 0 V
Parameter
Power Supply

Symbol

Min.

TYP·

Max.

Units

Vcc

4.75

5.00

5.25

V

80

180

rnA

10

",A

Vin '" 5.25 V

±10

}LA

You! = -0.3 to 5.25 V

Test Conditions

Supply Current

Icc

Input Leakage Current

Iii

Tristate Output
Leakage Current

Iloh

Input Low Voltage

VIL

-0.3

0.8

V

VIH

2.0

Vcc

V

0.4

V

IOL =2.2mA
IOH =-200 ",A

Input High Voltage

VOL

-0.3

Output High VOltage

VOH

2.4

Power Dissipation

PD

I nput Capacitance

Cin

Output Capacitance Load

Cout

Output Low Voltage

400

100

Vee

V

950

mW

20

pF

Ta = 25°C, f= 1 MHz
unmeasured pins
returned to ground

pF

Same as above

1-25
.-------~~

----------

A.C. Electrical Specifications

Ta = 0 to 70°C; Vee

= 5.0 V ± 5%; Units = nsee
Clock Frequency

1 MHz

2 MHz
10#

Signal

1

Symbol

Min.

Max.

Clock Period

ICPER

500

1000

2

Pulse Width, Clock High

tCPWH

230

300

3

Pulse Width, Clock Low

tCPWL

200

4

Clock Rise and Fall Time

tCA

5

Input Pulse Width Reset

tlRST

6

Input Pulse Width Stop, Limit

7

Input Pulse Width Index, Index

8

Input Pulse Width CHA, CHB

9
10

11

Min.

200
50

50

2500

5000

tiP

600

1100

tlX

1600

3100

tlAB

1600

3100

Delay CHA to CHB Transition

tAB

600

Input Rise/Fall Time CHA, CHB. Index

tlABR

450

Input Rise/Fall Time Reset, ALE, CS, OE. Stop, Limit

tlR

50

12

Input Pulse Width ALE, CS

tlPW

1100
900
50

80

80
50

13

Delay Time, ALE Fall to CS Fall

tAC

50

14

Delay Time, ALE Rise to CS Rise

ICA

50

50

15

Address Set Up Time Before ALE Rise

tASAl

20

20

16

Address Set Up Time Before CS Fall

tASR

20

20

17

Write Data Set Up Time Before CS Rise

tOSA

20

20

18

Address/Data Hold Time

tH

20

20

19

Set Up Time, R/W Before CS Rise

twos

20

20

20

Hold Time, R/W After CS Rise

tWH

20

20

21

Delay Time, Write Cycle, CS Rise to ALE Fait

tCSAL

1700

3400

22

Delay Time, Read/Write, CS Rise to CS FafJ

tcSOS

1500

3000

23

Write Cycle, ALE Fall to ALE Fall

twc

1830

3530

24

Delay time, CS Rise to OE Fall

tCSOE

1700

3200

25

Delay Time. OE Fall to Data Bus Valid

tOEDB

100

100

26

Delay Time, CS Rise to Data Bus Valid

tCSDB

1800

3300

27

Input Pulse Width OE

t'PWOE

100

100

28

Hold Time, Data Held After DE Rise

tDoEH

20

20

29

Delay Time, Read Cycle, CS Rise to ALE Fall

tOSALR

1820

3320

30

Read Cycle, ALE Fall to ALE Fall

tRC

1950

3450

31

Output Pulse Width, PROF, INIT. Pulse, Sign,
PHA-PHD, MC Port

tOF

500

1000

32

Output Rise/Fail Time, PROF, INIT. Pulse, Sign,
PHA-PHD, MC Port

tOR

20

33

Delay Time, Clock Rise to Output Rise

IEP

20

34

Delay Time, CS Rising to MC Port Valid

ICSMC

1-26

Male.

150

20

300

20

1600

150
300
3200

----------- ------------------------------------------

Hell-1000 I/O Timing Diagrams

0-

INDEX _ _ _

CHA

~---

__

_~wr
INDEX

~

CHB

CLOCK

_~:::r_
RESET

r~,~F
SIGN

~

---""""" ~---------:li

~~~~~ _ _ _.....J

1-27
----------------------------

HCTL-1000 I/O Timing Diagrams
There are three different timing configurations which can
be used to give the user flexibility to interface the HCTL-

1000 to most microprocesors. See the I/O interface section
for more details.

I. ALE/CS NON OVERLAPPED
A. Write Cycle
~----------------------------{23~----------------------------~

I

RM

~~.I.~~~

ADIDB . . . . x x x v A L I D A D D R E S S = x > < X X C

B. Read Cycle

~----------------~--------------------{30~--------------------------~

~--------------------129~------------------~

RM

1+--------H27~----.j

AD/DB

1-28

HCTL-1000 I/O Timing Diagrams
II. ALE/CS OVERLAPPED

A. Write Cycle
i+---------------~23}__--------------~

i+-------{12}--------+i

}----r-------{21}----------I
i+--------{12}----------i

RiW

AD/DB

B. Read Cycle
i + - - - - - - - - - - - - - - - - - { 3 0 } - - - - - - - - - - - - - - - -__

}----+/+-----------{29}-----------i

R/W

/+---l---{27)-----!

AD/DB

1-29

HCTL-1000 I/O Timing Diagrams
III. ALE WITHIN CS

A. Write Cycle
1----------------------------423~------------------------~

1-------------{14}--------------f-----------{21}-----------J
1-------{22~-------.j

ADIDB

B. Read Cycle
~----------------------------~30}_------------------------------~

ADIDB

1-30

I

Functional Pin Description
INPUT/OUTPUT SIGNALS

Symbq!
ADO/DBOADS/DBS
portfused for da,ta olJly;

INPUT SIGNALS
D~scripllon

Mv
ill
nt 01J statuspf R/W line. For al\,l\lrite, th.e
addressed location. For Read, data"is read
output Igtch.

CS

OE

40

Output Enable .2 enables t~e data in the internal outputlatch"onto the exterlJa,1 databus to
complete a ·Reild op,'?r,':l~igr.

iJiTi1i

14

Limit Switch - an internal Ilag which when externally set, triggers an unconditional
braq.chto the Initialization/Idle mode belo~,? ~. ~.<'l next control saQ.1Ple is ex:cy!,?d. Motor
Command is,. ~et to zero. Status of the LirQit!iFlag is m.~:>nitore9 in the StalLi~hRegister.

Stop

15

Stop Flag - an i'l,ternai flag that is externallY set. When flag is
cohtrol mode, the Motor Command is deceler':lted to a stop.

f'i8Sef

36

Reset -

ExtClk

34

External Clock

a hard reset of internal circuitry and a branch to Reset mode.

Vcc

11,35

Voltage Supply -

Vss

10,32

Circuit Ground
Not

\NC

set during Integral Velocity

Conneq!~d

-

Both Vcc pins must be connected to a 5.0 volt supply.
this pin should be left ffoating.

OUTPUT SIGNALS
Symbol

MCO-MC?
Pulse

Sign
PHA-PHD

Pin Number

Description

18 - 2S

Motor Command Port - 8 bit output port which contains the digital motor command
adjusted for easy bipolar DAC interfacing. MC? is the most significant bit (MSB)'

16

Pulse - Pulse Width Modulated signal whose duty cycle is proportional to the Motor
Command magnitude. The frequency of the signal is External Clock/l00 and pulse width is
resolved into 100 external clocks.

1?

Sign -

26-29

gives the sign/direction of the pulse signal.

Phase A, S, C, D -

phase enable outputs of the commutator.

Prof

12

Profile Flag - status flag which indicates that the controller is executing a profiled position move in the Trapezoidal Profile Control Mode.

Init

13

Initialization/ldle Flag - status flag which indicates that the controller is in the Inltializationl
Idle mode.

1-31

How to operate the HCTL-1000
user Accessible Registers
The HCTL-1000 operation is controlled by a bank of 64 8-bit
registers, 32 of which are user accessible. These registers
contain command and configuration information necessary
to properly run the controller chip. The 32 user accessible
registers are listed in Table I. The register number is also the
address. A functional block diagram of the HCTL-1000
which shows the role of the user accessible registers is also
included in Figure 3. The other 32 registers are used by the
internal CPU as scratch registers and should not be"
accessed by the user.
There are several registers which the user must configure to
his application. These configuration registers are discussed
in more detail below.
PROGRAM COUNTER (ROSH)

The program counter, which is a write only register, executes
the preprogrammed functions of the controller. The program
counter is used along with the control flags FO, F3, and F5
in the Flag Register (ROOH) to change control modes. The
user can write any of the following four commands to the
program counter.
OOH 01 H 02H 03H

Software Reset
Initialization/Idle mode
Align mode
Control modes; flags" FO, F3, and F5 in the Flag
Register (ROOH) specify which control mode will be
executed.

F2 -

Unipolar flag - set/cleared by the user to specify
bipolar (clear) or unipolar (set) mode for the Motor
Command Port.

F3 -

Proportional Velocity Control Flag -" set by the user
to specify proportional velocity control.

F4 -

Hold Commutator Flag - seVcleared by the user or
automatically by the Align mode. When set, this flag
inhibits the internal commutator counters to allow
open loop stepping of a motor by using the commutator.

F5 -

Integral Velocity Control - set by the user to specify
integral velocity control.

STATUS REGISTER (R07H)

The Status Register indicates the status of the HCTL-1000.
Each bit decodes into one signal. All 8 bits are user readable
and are decoded as shown below. Only the lower 4 bits can
be written to by the user to configure the HCTL-1000. To set
or clear any of the lower 4 bits, the user writes an 8-bit word
to R07H. The upper 4 bits are ignored. Each of the lower 4
bits directly sets/clears the corresponding bit of the status
register as shown below. For example, writing XXXX0101 to
R07H sets the PWM Sign Reversal Inhibit, sets the Commutator Phase Configuration to "3 Phase", and sets the
Commutator Count Configuration to "full".

Status

Bit

The commands written to the program counter are discussed in more detail in the section called Operating Modes
and are shown in flowchart form in Figure 4.

Bit number
Function

FO -

F1 -

7-4

3

Don't
seVclear
care

2

1

0

AD2

AD1

ADO

Trapezoidal Profile Flag - set by the user to execute
trapezoidal profile control. The flag is reset by the
controller when the move is completed. The status of
FO can be monitored at the Profile pin (12) and in
status register R07H "bit 4.
Initialization/Idle Flag - seVcleared by the HCTL1000 to indicate execution of the Initialization/Idle
mode. The status of F1 can be monitored at the
Initializaiion/ldle pin (13) and in bit 5 of the Status
register (R07HI. The user should never attempt to set
or clear F1.

Note

PWM Sign Reversal
Inhibit
0 off 1 = on

Discussed in Amplifier
Interface section
under PWM Port.

1

Commutator Phase
Configuration
0=3 phase
1 = 4 phase

Discussed in
Commutator section

2

Commutator Count
Configuration
o = quadrature
1'" full

Discussed in
Commutator section

3

Should always be set to
0

4

Trapezoidal Profile
Flag FO
1 = in Profile Control

Discussed in Operating
Mode section under
Trapezoidal Profile
Control

5

Initialization/Idle
Flag F1 1 = in
Initialization/Idle Mode

Discussed in Operating
Mode section under
Initialization/Idle Mode

6

Stop Flag
0= set (Stop triggered)
1 cleared (no Stop)

Discussed in
Emergency Flags
Section

7

Limit Flag
0= set I Limit triggered)
1 = cleared (no Limit)

Discussed in
Emergency Flags
Section

FLAG REGISTER (ROOH)

The flag register contains flags FO thru F5. This register is
also a write only register. Each flag is set and cleared by
writing an 8-bit data word to ROOH. The upper four bits are
ignored by the HCTL-1000. The bottom three bits specify
the flag address and the fourth bit specifies whether to set
(bit=1) or clear (bit=Q) the addressed flag.

Function

0

1-32
----"----"-"

Register
(l:Iex)

ROOH
R05H
RotFt

R08H
R09H

2's co
2's c o e n t
comp!emeQt
'2'~.c. ?l1jplement
2'scomplement
scalar
2'si;;omplement
2'~s?rrplement
2'S'cOQlP.lement
scalarrS.! ,A
scalar
scalarlSI
scalar!S!
2's complement
scalarlSI
scalar

p

ROP!;1
RODH

Com man
silion
Comm.il
osition (LSB)
'$ilmple Timer
Actual Position (MSBl
ActuanPosition
Actual Po~ilion(LSB)
Co
Ring
Co
or VelocifyTimer
X
aseOverlap

RdEH
ROFH
R12H
R13H

R14H
R18H
R19H
R1AH

R1BH
B,lCH

t

R1FH
R20H

ximum Phase AdvaQpe
Filter Zero, A

R21H

B26H

Gain, K
Command Velocity (LSB)
CommaQd Velocity (MSB)
Acceleration (LSB)

R27H

Acceleration (MSB)

R28H
R29H
R2AH
R2BH
R34H
R35H

Maximum Velocity
Final Position (J':SB)
Final Position
Final Position (MSB)
Actual Velocity (LSB)
Actual Velocity (~SB)
Command Velgdity

R22Ft
R23H
R24H

R3CH

Position Control
Pos!l!?n Contr9'
Position Control
All
All
All
All
.AII
All
All except
Proportional Velocity
All except
Proportional Velocity
All
Proportional Velocity
prop?liional Velocity
IntJgral Velocity and
Trapezoidal Profile
Integral Velocity and
Trapezoidal Profile
Trapezoidal Profile
Trapezoidal Profile
Trapezoidal Profile
Trapezoidal Prolile
Proportional Velocity
Proportional Velocity
Ifl!egral Velocity

Notes:
1. Upper4 bits are read only.
2. Writing to ROEH (LSB) latches all 24 bits.
3. Reading R14H (LSBI latches data into R12H and R13H.

.... ....

w
r!31
rl3f!w!41
rlqi

w
r/w

r!v/'
r/w!61
r/wl6j
r/w

r/w

scalar

r/w

scalar
2's complement
2's complement
scalariSI

r/w
rlw

r!w

scalarl 5 !

r!w

scalarl S!
2's complement
2's complement
2'5 complement
2's complement
2'8 complement
2's complement

r/w
r/w
r/w
r/w

r
r/w

4. Writing to R13H clears Actual Position Counter to zero.
5. The scalar data is limited to positive numbers (DOH to 7FHI.
6. The commutator registers (B1aH, R1 CH, R1 FHI have further limits
which are discussed in the Commutator section of this data sheet.

DIGITAL FILTER

.... ....

MeO-Me7

D(ZJ=~
R20H A
R21H B
R22H K

PULSE

f-===="--1~SIGN

COMMUTATOR

R1BH RING
A1AHX

r------i

I
POSITION PROFILE GENERATION
INTEGRAL
VELOCITY
R27H ACCEL MSB
R26H ACCEL LSB
R3CH COMMAND

VELOCITY

A1BHY
R1CH OFFSET

PHA-PHD

RlfH MAX ADVANCE
R19H VELOCITY
TIMER

TRAPEZOIDAL
PROFILE
R27H ACCEL MSB
R26H ACCEL LSB

CONFIGURATION
REGISTERS

A28H MAXIMUM
VELOCITY
R2BH FINAL POS. MSB
R2AH FINAL POS.
R29H FINAL POS. LSB

CHA

CHB

RDOH FLAG REGISTER
R05H PROGRAM COUNTER
R07H STATUS REGISTER

Figure 3. Register Block Diagram

1-33
,.""

._-_._----------

----""_._---------------------

EMERGENCY FLAGS - STOP AND LIMIT
Stop and Limit Flags are hardware set flags that signify the
occurrence of an emergency condition and cause the controller to immediately take special action.

The Stop Flag affects the HCTL-1000 only in the Integral
Velocity Mode. When the Stop Flag is set, the system will
come to a decelerated stop and stay in this mode with a
command velocity of zero until the Stop Flag is cleared and
a new command velocity is specified.
The Limit Flag, when set in any control mode, causes the
HCTL-1000 to go into the Initialization/Idle Mode, clearing
the Motor Command and causing an immediate motor
shutdown.
Stop and Limit Flags are set by a low level input at their
respective pins (15, 14l. The flags can only be cleared when
the input to the corresponding pin goes high, signifying that
the emergency condition has been corrected, AND a write
to the Status Register (R07H) is executed. That is, after the
emergency pin has been set and cleared, the flag also must
be cleared by writing to R07H. Any word that is written to
R07H after the emergency pin is set and cleared will clear
the emergency flag, but the lower 4 bits of that word will
also reconfigure the Status Register.
DIGITAL FILTER (R22H, R20H, R21H)
All control modes use some part of the programmable digital filter D(z) to compensate for closed loop system stability.
The compensation D(z) has the form:

D(z) = K (z - Al256l
4 (z + B/256)
where z = the digital domain operator
K = gain (R22H)
A = zero (R20H)
B = pole (R21 H)
The compensation is a first order lead filter which in combination with the sample timer T (ROFH) affects the dynamic
step response and stability of the control system. The
sample timer, T, determines the rate at which the control
algorithm gets executed. All parameters, A, B, K, and T, are
8-bit scalars that can be changed by the user any time.
The digital filter uses previously sampled data to calculate
D(z). This old internally sampled data is cleared when the
Initialization/Idle Mode is executed.

SAMPLE TIMER REGISTER (ROFH)
The contents of this register set the sampling period of the
HCTL-1000. The sampling period is

t = 16 (ROFH 1+ 1) (1/frequency of the external clock)
The sample timer has a limit on the minimum allowable
sample time depending on the control mode being executed.
The limits are given below:
ROFH Contents
Minimum Limit

Position Control
Proportional Velocity Control
Trapezoidal Profile Control
Integ ral Velocity Control

7
7
15
15

The maximum value of ROFH is FFH (255 decimal). For
example, with a 2MHz clock, the sample time can vary from
64 f.lsec to 2048 f.lsec.

Operating Modes
The HCTL-1000 executes anyone of 3 set up routines or 4
control modes selected by the user. The 3 set up routines
include:
-

Reset
Initialization/Idle
Align.

The four control modes available to the user include:
-

Position Control
Proportional Velocity Control
Trapezoidal Profile Control
Integral Velocity Control

The HCTL-1000 switches from one mode to another as a
result of one of the following three mechanisms:
1. The user writes to the Program Counter.
2. The user sets/clears flags FO, F3, or F5 by writing to the
Flag Register (ROOHl.
3. The controller switches automatically when certain initial
conditions are provided by the user.
This section describes the function of each set up routine
and control mode and the initial conditions which must be
provided by the user to switch from one mode to another.
Figure 4 shows a flowchart of the set up routines and
control modes, and shows the commands required to switch
from one mode to another.

1-34

SET UP ROUTINES
1. Reset

The Reset mode is entered under all conditions by either
executing a hard reset (Reset Pin goes low) or a soft
reset (write OOH to the Program Counter, R05H).

RESET PIN
LOW

WRITE OOH
TO R05H

When a hard reset is executed, the following conditions
occur:
-

All output signal pins are held low except Sign (17),
Databus (2-9), and Motor Command (18-25>.

-

All flags (FO to F5) are cleared.

-

The PWM port (R09H) is preset to FFH.

-

The Motor Command Port (R08H) is preset to 80H.

-

The Commutator logic is cleared.

-

The I/O control logic is cleared.

-

A soft reset is automatically executed.

WRITE01H
TO R05H

WRITE 03H
TO R05H

SET/CLEAR FO. F3. OR F5"

When a soft reset is executed, the following conditions
occur:
-

FO

The digital filter parameters are preset to
A (R20H) = E5H
8 (R21 H) = K (R22H)

TRAPEZOIDAL
PROFILE
(CONTROLLER CLEARS
FOATTHE END
OF THE MOVE.)

= 40H

-

The sample timer (ROFH) is preset to 40H.

-

The status register (R07H) is cleared.

F3

- The Position counters (R12H, R13H and R14H) are
cleared to O.

PROPORTIONAL
VELOCITY
CONTROL

From Reset mode, the HCTL-1000 goes automatically
to Initialization/Idle mode.
F5

2. Initialization/Idle
INTEGRAL
VELOCITY
CONTROL

The Initialization/Idle mode is entered either automatically
from Reset or by writing 01 H to the Program Counter
(R05H) under any conditions.
In the Initialization/Idle mode, the following conditions
occur:
-

The Initialization/Idle Flag (F1) is set.

POSITION
CONTROL

- The PWM port (R09H) is set to OOH.
-

The Motor Command port (R08H) is set to 80H.

-

Previously sampled data stored in the digital filter is
cleared.

It is at this pOint that the user should pre-program ali the
necessary registers needed to execute the desired control
mode. The HCTL-1000 stays in this mode (idling) until a
new mode command is given.

·Only one flag can be set at a time.
Figure 4. Operating Mode Flowchart

1-35

3. Align
The Align mode can be entered only from the Initialization/Idle mode by writing 02H to the Program Counter
(R05H); This mode automatically aligns multi phase
motors to the Commutator. AHgn mode is executed only
when using the commutator feature of the HCTL-1000
and before any control modes are used.
The AHgn mode assumes that, during encoder/motor
assembly, the encoder index pulse has been physically
aligned to the last motor phase, the Commutator
parameters have been correctly preprogrammed (see the
section called The Commutator for details), and a hard
reset has been executed while the motor is stationary.
The Align mode first disables the commutator and with
open loop control enables the first phase (PHA> and then
the last phase (PHC or PHD) to orient the motor on the
last phase torque detent. Each phase is energized for
2048 system sampling periods. For proper operation, the
motor must come to a complete stop during the last
phase enable. Once the last phase torque detent is
found, the Commutator is enabled and commutation is
closed loop.
The HCTL-1000 then switches automatically from Align
to the Control Modes.
CONTROL MODES
Control flags FO, F3, and F5 in the Flag Register (ROOH)
determine which control mode is executed. Only one control
flag can be set at a time. After one of these control flags is
set, the control modes are entered either automatically from
Align or from the Initialization/Idle mode by writing 03H to
the Program Counter (R05HL
1. Position Control
FO, F3, F5 cleared
Position Control performs pOint to pOint position moves
with no velocity profiling. The user specifies a 24-bit
position command, which the controller compares to the
24-bit actual position. The position error is calculated,
the full digital lead compensation is applied and the
motor command is output.
The controller will remain position locked at a destination
until a new position command is given.
The actual and command position data is 24-bit two's
complement data stored in six 8-bit registers. Position is
measured in encoder quadrature counts.
The command position resides in ROCH (MSB), RODH,
ROEH (LSBL Writing to ROEH latches all 24-bits at once
for the control algorithm. Therefore, the command position is written in the sequence ROCH, RODH and ROEH.
The command registers can be read in any desired order.
The actual position resides in R12H (MSB), R13H, and
R14H (LSB). Reading R14H latches the upper two bytes
into an internal buffer. Therefore, actual position registers
are read in the order of R14H, R13H, and R12H for
correct instantaneous position data. The position registers
cannot be written to, but they can all be cleared to 0 by a
write to R13H.

2. Proportional Velocity Control
F3 set
Proportional Velocity Control performs control of motor
speed using only the gain factor, K, for compensation.
The dynamic pole and zero lead compensation are not
used.
The algorithm takes a user command velocity, calculates
the actual velocity, and computes the velocity error. The
velocity error is multiplied by Kl4 and output as motor
command.
The command and actual velocity are 16-bit two's complement words. The units of velocity are encoder quadrature counts/sample time. In addition, the command
veloCity is internally divided by 16 to produce fractional
resolution. The 16-bit command is interpreted as 12-bits
of integer and 4-bits of fraction.
R24H

11111111

R23H
IIII.FFFF

COMMAND VELOCITY FORMAT
The command velocity resides in unlatched R24H (MSB)
and R23H (LSB)' The registers can be read or written to
in any order.
The actual velocity is computed only in this algorithm
and stored in scratch registers R35H (MSB) and R34H
(LSB)' There is no fractional component in the actual
velocity registers and they can be read in any order.
The controller tracks the command velocity continuously
until new mode command is given. The system behavior
after a new velocity command is governed only by the
system dynamics, until a steady state velocity is reached.
3. Integral Velocity Control
F5 set
Integral Velocity Control performs continuous velocity
profiling which is specified by a command velocity and
command acceleration. Figure 5 shows the capability of
this control algorithm.
The user can change velocity and acceleration any time
to continuously profile velocity in time. Once the specified
velocity is reached, the HCTL-1000 will maintain that
velocity until.a new command is specified. Changes
between actual velocities occur at the presently specified
linear acceleration.
The command velocity is an 8-bit two's complement
word stored in R3CH. The units of velocity are quadrature
counts/sample time.
While the overall range of the velocity command is 8-bits,
two's complement, the difference between any two
sequential commands cannot be greater than 7-bits in
magnitude (I.e., 127 decimal). For example, when the
HCTL-1000 is executing a command velocity of 40H
(+640), the next velocity command must fall in the range
of 7FH (+127D), the maximum command range, to C1H
(--63D)'

_------x--

MAXIMUM VELOCITY

VELOCITY
VELOCITY
TRAPEZOIDAL

-+--- MAXIMUM VELOCITY
VELOCITY

o

CD

CVEL = COMMAND VELOCITY R3CH
A = ACCELERATION R26H, R27H

USER CHANGES ACCELERATION COMMAND
USER CHANGES VELOCITY COMMAND

Figure 6. Trapezoidal Profile Mode

Figure 5. Integral Velocity Mode

The command acceleration is a 16-bit scalar word stored
in R27H and R26H. The upper byte (R27H) is the integer
part and the lower byte (R26H) is the fractional part
provided for resolution. The integer part has a range of
OOH to 7FH. The contents of R26H are internally divided
by 256 to produce the fractional resolution.
R27H
01111111

format as discussed under Integral Velocity Control. The
maximum velocity is a 7-bit scalar (range is OOH to 7FH)
written to R28H with units of quadrature counts/sample.
The command data registers can be written/read in any
order.
Once desired data is entered, flag FO is set in the Flag
Register (ROOH) to commence motion (if already in Position Controll. When the Trapezoidal Profile move is
finished, the controller clears FO and Position Control
locks on the final position. The status of the Profile flag
can be monitored in the Status Register (R07H) and at
the external Profile pin. During Trapezoidal Profile move
no new command data should be sent to the controller.

R26H
FFFFFFFF/256

COMMAND ACCELERATION FORMAT
The units of acceleration are quadrature counts/sample
time squared.

The internal profile generator produces a position profile
using the present command position (ROCH-ROEH) as
the starting point and the final position (R29H-R2BH) as
the end pOint. The controller actually performs position
control while the profile generator loads profile data into
the Command Position registers. The full digital filter is
applied for compensation.

Internally, the controller performs velocity profiling
through position control. From the user specified command velocity and acceleration, the controller internally
generates position profiles. In control theory terms,
integral compensation has been added and therefore,
this system has zero steady state velocity error.
The advantage that this mode has over Proportional
Velocity modes is that the system has zero steady state
velocity error. However, the drawback which comes along
with this advantage is that loop stability compensation is
more difficult to achieve. In the Integral Velocity Mode,
the system is actually a pOSition control system and
therefore the complete dynamic compensation D(z) is
used in this control mode.

commutator
The commutator is a digital state machine that is configured
by the user to properly select the phase sequence for
electronic commutation of multi phase motors. The Commutator is designed to work with 2, 3, and 4 phase motors
of various winding configurations and with various encoder
counts.

If the external STOP flag F6 is set during this mode
signaling an emergency situation, the controller automatically decelerates to zero velocity at the presently specified
acceleration factor and stays in this condition until the
flag is cleared. The user then can specify new velocity
profiling data.

Besides the correct phase enable sequence, the Commutator
provides programmable phase overlap and phase advance.
Phase overlap is used for better torque ripple control. It can
also be used to generate unique state sequences which can
be further decoded externally to drive more complex amplifiers and motors.

4. Trapezoidal Profile Control
FOset
Trapezoidal Profile Control performs point to point position moves and profiles the velocity trajectory to a
trapezoid or triangle. The user specifies only the desired
final position, acceleration and maximum velocity. The
controller computes the necessary profile to conform to
the command data. If maximum velocity is reached before
the distance halfway pOint, the profile will be trapezoidal,
otherwise the profile will be triangular. Figure 6 shows
the possible trajectories with Trapezoidal Profile control.
The command data for this control mode is a 24-bit
two's complement final position written to R2BH (MSB),
. R2AH, and R29H (LSB). The acceleration resides in R27H
(MSB) and R26H (LSB). It is the same integer and fraction

Phase advance allows the user to compensate for the frequency characteristics of the motor/amplifier combination.
By advanCing the phase enable command (in pOSition), the
delay in reaction of the motor/amplifier combination can be
offset and higher performance can be achieved.
The ouput of the Commutator is on PHA (26) to PHD
(29)' The inputs to the Commutator are the three encoder
signals, Channel A, Channel B, and Index, and the configuration data stored in registers.
The Commutator uses both channels and the index pulse of
an incremental encoder. The index pulse of the encoder
must be physically aligned to a known torque curve location
because it is used as the reference point of the rotor
position with respect to the Commutator phase enables.

1-37

-------------------------------------------

,

i

I
I

The index pulse should be permanently aligned during
motor encoder assembly to the last motor phase. This is
done by energizing the last phase of the motor during
assembly and permanently attaching the encoder codewheel
to the motor shaft such that the index pulse is active. Fine
tuning of alignment for commutation purposes is done
electronically by the Offset Register (R1 CH) once the complete control system is set up.
1. Commutator Configuration Registers
The Commutator is programmed by the data in the
following registers. Figure 7 shows an example of the
relationship between all the. parameters.

3 PHASE
FULL COUNTS
RING,9
CASE
X
V

OFFSET
ADVANCE

ENCODER, 90 COUNTS/REVOLUTION
1
3
0
0
0

2
2

1
0
0

3
2
1
2
0

4

2
1
2
1

INDEX PULSE
OCCURS AT
THEDRIGIN

ENABLE
2526271282930012!3

a!910 11 COUNTS

PHAG)~~__________-+~~~________~____-L--'
PHB--------------+-~~-----L~----------~

Status Register (R07H)
Bit#1 -

Bit #2 -

0 = 3 phase configuration,PHA, PHB, and
PHC are active outputs.
1 = 4 phase configuration, PHA - PHD are
active outputs.
0 = rotor position measured in quadrature
counts.
1 = rotor position measured in full coun'ts.

PHAG)~2~_________L_+--~~------~~--~~-PHB--------------t-~~--~~-------------

PHC------~~--~+---~---L~--~+_-------

RING REGISTER (R18H)
The ring register is scalar and determines the length of the
electrical cycle measured in full or quadrature counts as set
by bit #1 in R07H. The magnitude of Ring is limited to 7FH.

o

PHA~------~~--~L-------~~--~L-----_

PHB--------------+-L--2~----------------_

X REGISTER (R1AH)
Scalar data which sets the interval during which a phase is
the only one active.
Y REGISTER (R1 BH)
Scalar data which sets the interval during which two
sequential phases are both active. Y is phase overlap.

PHC---L~--!_t:::+=~~==::~~--~-------

o

PHA~----~~--~+--------L~--~~------_

X and Y must be such that:
X + Y = Ring/(# of phases)

PHC------~~--~+-~~--~-L-------------

These three parameters define the basic electrical commutation cycle.
OFFSET REGISTER (R1 CH)
The offset is two's complement data which determines the
relative start of the electrical cycle with respect to the index
pulse. Since, the index pulse must be physically referenced
to the rotor, offset performs fine alignment between the
electrical and mechanical torque cycles.
PHASE ADVANCE REGISTERS (R19H, R1FH)
The phase advance feature performs the function of linearly
incrementing the phase advance according to measured
speed of rotation up to a set maximum.
VELOCITY TIMER REGISTER (R19H)
This register contains scalar data which determines the
amount of phase advance at a given velocity. The phase
advance is interpreted in the units set for the Ring counter
by bit #1 in R07H. The velocity is measured in revolutions!
second.
Advance = Nvllt

Figure 7. Commutator Configuration

MAXIMUM ADVANCE REGISTER (R1FH)
The scalar data sets the upper limit for phase advance
regardless of rotor speed.
Figure 8 shows the relationship between the phase advance
registers. Note: If the phase advance feature is not used, set
both R19H and R1 FH to O.
ADVANCE
(COUNTS)
MAX
ADVANCE

wherellt = 16 (R19H+1)
f external clk
N = encoder counts!revolution
v = velocity (revolutions/second)

IL..__________"--____________•

VELOCITY
(REVOLUTIONSI
SECOND)

Figure 8. Phase Advance vs. Motor Velocity.

1-38

------- - - - - - - - - -

COMMUTATOR CONSTRAINTS

There are several numerical constraints the user should be
aware of to use the Commutator.
The parameters of Ring, X, y. and Max Advance must be
positive numbers (OOH to 7FHl. Additionally, the following
equation must be satisfied:
80H :s;

~ Ring +

Offset

±

Max Advance :s; 7FH (1)

In order to utilize the greatest flexibility of the Commutator,
it must be realized that the Commutator works on a circular
ring counter principle, whose range is defined by the Ring
Register (R18Hl. This means that for a ring of 96 counts and
a needed offset of 100, numerically the Offset Register can
be programmed as OAH (100) or DOH (-800), the latter
satisfying Equation 1.
Example: Suppose you want to commutate a 3 phase 15
deg/step Variable Reluctance Motor attached to a 192 count
encoder.
1. Select 3 phase and quadrature mode for commutator by
writing 0 to R07H.
2. With a 3 phase 15 degree/step Variable Reluctance Motor
the torque cycle repeats every 45 degrees or 360 deg/45
deg/revolution.
3. Ring Register

4. By measuring the motor torque curve in both directions,
it is determined that an offset of 3 degrees, and a phase
overlap of 2 degrees is needed.
(4) (192)

~

'" 6 quadrature counts

To numerically satisiy the commutator write A6H
(-900) to Offset Register (R1CH).
y = overlap =

I/O INTERFACE

The HCTL-1000 looks to the user like a bank of 8-bit
registers which the user can read/write. The data in these
registers control the operation of the HCTL-1000. The user
communicates with these registers over an 8-bit address!
data multiplexed bidirectional bus. The four I/O control
lines, ALE, CS, OE and R/W, execute the data transfers.
There are three different timing configurations which can be
used to give the user greater flexibility to interface the
HCTL-1000 to most microprocessors (see Timing diagramsl.
They are differentiated from one another by the arrangement
of the ALE signal with respect to the CS signal. The three
timirig configurations are listed below.

es non-overlapped
es overlapped
ALE within es

1. ALE,

2. ALE,
3.

Any I/O .operation starts by asserting the ALE signal which
starts sampling the external bus into an internal address
latch. Rising ALE or falling es during ALE stops the
sampling into the address latch.

and starts the internal synchronous process.

= 96 quadrature counts

Offset = 3°

HCTL-1000

es low after rising ALE samples the external bus into the
data latch. Rising es stops the sampling into the data latch,

(4) (192) counts!revol ution
8/revolution

=

How to Interface to the

(2° )(4)(192) '" 4
360°

In the case of a write, the data in the data latch is written
into the addressed location. In the case of a read, the
addressed location is written into an internal output latch.
OE low enables the internal output latch onto the external
bus. The OE signal and the internal output latch allow the
I/O port to be flexible and avoid bus conflicts during read
operations.
The I/O Port is designed to work with most microprocessor
systems and is easily fitted in as part of addressable RAM.

x+ Y =96

3

-

Therefore, x = 28
y=4
For the purposes of this example, the Velocity Timer and
Maximum Advance are set to O.

I

I

6
EXTERNAL BUS

a/

RiW
STROBES

ADDRESS
LATCH

I

/

a
/

a/
/

I
I

DATA
LATCH

I
I

OUTPUT
LATCH

I
I

I
I

ill

cs
RiW

DE

I

I/O
CONTROL

I

Figure 9. 1/0 Pori Block Diagram

1-39

a/

INTERNAL BUS

;'

ail'
/

ENCODER INTERFACE
The HCTL-1000 accepts TTL compatible outputs from 2 or
3 channel incremental shaft encoders such as the HEDS5000 and 6000 series. Channels A and B are internally
decoded into quadrature counts which increment or decrement the 24-bit position counter. For example, a 500 count
encoder is decoded into 2000 quadrature counts per revolution. The position counter will be incremented when Channel B leads Channel A. The Index chanl)el is used only for
the Commutator and its function is to serve as a reference
point for the internal Ring Counter.

tionally adjusted for different output formats and ease of
interfacing to external hardware. The sections below discuss
the externally available amplifier interfaces and their formats.
Tables II and III summarize the amplifier interface outputs.

8-81t Parallel Motor Command Port
The 8-bit Motor Command Port consists of register R08H
whose data goes directly to external pins MCO-MC7. MC7 is
the most significant bit. R08H can be read and written to,
however, it should be written to only during Initialization/Idle
mode. During any of the four Control Modes, the controller
writes the motor command into R08H.

The inputs to the quadrature decoder from Channel A and
B, have a 3-bit state .delay filter to filter out unwanted noise
spikes on the encoder input lines. Any transition on the input
pins must be stable during 3 consecutive external clock
edges before it is qualified internally as a legitimate transition. This 3-bit state delay filter, together with the quadrature
decoder, impose a limit on the encoder frequency.

The Motor Command Port is the ideal interface to an 8-bit
DAC, configured for bipolar output. The data written to the
8-bit Motor Command Port by the control aigorithms is the
internally computed 2's complement motor command with
an 80H offset added. This allows direct interfacing to a DAC.
Figure 10 shows a typical DAC interface to the HCTL-1000.
An inexpensive DAC, such as MC1408 or equivalent, has its
digital inputs directly connected to the Motor Command
Port. The DAC produces an output current which is converted to a voltage by an operational amplifier. Ro and RG
control the analog offset and gain. The circuit is easily
adjusted for +5V to -5V operation by first writing 80H to
R08H and adjusting RO for OV output. Then FFH is written to
R08H and RG is adjusted until the output is 5V. Note that
OOH in R08H corresponds to -5V out.

The AC specifications give the delay requirements between
encoder signal edges. When calculating the encoder frequency limit, the user must take into consideration the
external clock frequency and the encoder state width error.
The index signal of an encoder is used in conjunction with
the Commutator. It resets the internal ring counter which
keeps track of the rotor position so that no cumulative
errors are generated.
The Index pin of the HCTL-1000 also has a 3-bit filter on its
input. The Index pin is active low and level transition sensitive. It detects a valid high to low transition and qualifies the
low input level through the 3-bit filter. At this point, the
Index signal is internally detected by the commutator logic.
This type of configuration allows an Index or Index signal to
be used to generate the reference mark for com mutator
operation as long as the AC specifications for the Index
signal are met.

The above interface is suitable to drive linear amplifiers and
DC motors because of the bipolar output. When using
commutated motors, the direction of rotation of the motor is
governed by the order of firing the motor phases which is
under commutator control. In this case, it is desirable to
have the Motor Command be unipolar to specify magnitude
only, not direction. The HCTL-1000 has the feature of digitally configuring the 8-bit Motor Command Port into unipolar
mode. Flag F2 in the Flag Register ROOH controls this
function.

AMPLIFIER INTERFACE

F2 clear F2 set -

The HCTL-1000 outputs a motor command in two forms: an
8-bit Motor Command which can be connected to a DAC to
drive a linear amplifier and PULSE and SIGN output to drive
a PWM amplifier.

This mode functions such that, with the same circuit in
Figure 10 (or any DAC configured for similar bipolar operation) setting F2 will cause the DAC to output from OV to 5V
only and to digital data on pins MCO to MC7 to be restricted
in the control modes from 80H to FFH. Internally the commutator keeps track of the sign of the motor command for
proper commutation of the motor.

All control algorithms internally compute an error between
the desired command and actual feedback which is
processed through the digital filter. The result is an internal
8-bit 2's complement motor command. Before the internal
motor command is made externally available, it is add i-

I

4.64K
15

Me,
Me,
Me2

HCTL-l000

Me,
Me,
Me,
Me,
Me,

~ef-

18

12

19

11 A7

20

10 A6

21

9

22

8 A,

23

7 .4.3

24

6 A2

25

5 A,
eOMP

1:

Bipolar mode
Unipolar mode

~

2
GND
Vee

Vref+

13

+5V

T

RO" :'-50~

1K

R':/.

14

'50 K

4.64 K

As
MC140B

1K

10

4

-=-

VEE

7

16~tj~
75 pf

~3

-12V

Figure 10. Linear Amplifier ·Interface

1-40
---- ---------- - - - - - -

+~

v ou•

-----------~-~

------------

Internally, the HCTL-l000 operates on data of 24, 16 and
8-bit lengths to produce the 8-bit motor command, available
externally. Many times the computed motor command will
be greater than 8-bits. At this pOint, the motor command is
saturated by the controller. The saturated value output by
the controller is not the full scale value OOH, or FFH. The
saturated value is adjusted to OFH (negative saturation) and
FOH (positive saturation!. Saturation levels for the Motor
Command Port are a) so included in Table II.

The 2's complement contents of R09H determine the duty
cycle and polarity of the PWM command. For example, 08H
(-400) gives a 40% duty cycle signal at the Pulse pin and
forces the Sign pin high. Oata outside the 64H (+10001 to
9CH HOOO) linear range gives 100% duty cycle. R09H can
be read and written to. However, the user should only write
to R09H when the controller is in the Initialization/Idle
mode. Table II gives the PWM output vs the internal motor
command.
When any Control Mode is being executed, the unadjusted
internal 2's complement 1110tor command is written to R09H.
Because of the hardware limit on the linear range (64H to
9CH; ±100Dl, the PWM port saturates sooner than the 8-bit
Motor Command Port (OOH to FFH; +1270 to -1280). When
the internal Motor Command saturates above 8 bits, the
PWM Port is saturated to the full ±100% duty cycle level.
Table III gives the actual values inside the PWM port. Note
that the unipolar Flag, F2, does not affect the PWM port.

PWM Port
The PWM port outputs the motor command as a pulse
width modulated signal with the correct sign of polarity. The
PWM Port consists of the Pulse and Sign pins (pins 16 and
17) and R09H.
The PWM signal at the Pulse pin has a frequency of
External Clock/l00 and the duty cycle is resolved into the
100 clocks.
The Sign pin gives the polarity of the command. Low output
on Sign pin is positive polarity.

TABLE II. MOTOR COMMAND PORT OUTPUTS
Motor Command plrt
ROSH, MtO-MC7
Functional Condition
During Control Modes

Bipolar
F2=O

Unipolar
F2=1

Blploar
F2=O

Unipolar
F2=1

SOH

OOH

FFH

-S.OV

S.OV

Minimum Motor Command
Negative Internal Motor
Command Saturation

DACOutput

Internal Motor Command
2'$ Complement

<80H

OFH

FOH

-4.4 V

4.4V

Zero Motor Command

OOH

80H

80H

OV

OV

Position Internal Motor
Command Saturation

>7FH

FOH

FOH

4.4 V

4.4 V

7FH

FFH

FFH

S.OV

5.0 V

Maximum Motor Command

TABLE III. PWM PORT OUTPUTS
Functional Condition
During Control Modes
Minimum Motor Command

PWM Port

Internal
Motor Command

R09H

Pulse Duty Cycle

Sign

80H

SOH

100%

High

Negative Internal Motor Command Saturation

7FH

70H

100%

Low

Maximum PWM Linear Range

64H

64H

100%

Low

Maximum Motor Command

7FH

7FH

100%

,Low

Zero Motor Command
Positive Internal Motor Command Saturation

1-41
.---~-~~-.~--.--------------------------------------

The PWM port has an option that can be used with H bridge
type amplifiers. The option is Sign Reversal Inhibit, which
inhibits the Pulse output for one PWM period after a sign
polarity reversal. This allows. one pair of transistors to turn
off before others are turned on and thereby avoids a short
across the power supply. Bit 0 in the Status Register (R07Hl
controls the sign reversal inhibit option. Figure 11 shows the
output of the PWM port when Bit 0 is set.

Figure 12 shows an example of how to interface the HCTL1000 to an H bridge amplifier (amplifier schematic is simplified). An H bridge amplifier works such that either 01 and 04
conduct or 02 and 03 conduct. This allows for bipolar'
motor operation with a unipolar power supply. The Sign
Reversal Inhibit feature prevents all transistors from being
on at the same time when the direction of motion is reversed.

v

SIGN 1-------'-------.. .

TIME

Figure 11. Sign Reversal Inhibit

+ycc

R

MOTOR

R

R

R

---1r----r'""'"
SIGN~~~-~~t---r----+-------------------1-----~

PULSE

Figure 12. H-Brldge Amplifier Interface

1-42
------------------------------

TECHNICAL DATA

JANUARY 1966

Features
• FULL FUNCTION IN A SPACE SAVING
PACKAGE
• SUBSTANTIALLY REDUCED SYSTEM
SOFTWARE
• FULL 4X DECODE
• HIGH NOISE IMMUNITY:
SCHMITT TRIGGER INPUTS
DIGITAL NOISE FILTER
• 8 BIT TRISTATE INTERFACE
• 12 BIT BINARY UP/DOWN COUNTER TO
BUFFER THE CONTROL PROCESSOR
• 12 BIT LATCH AND INHIBIT LOGIC PROVIDE A
STABLE,2 BYTE READ OPERATION
• 8 AND 12 BIT OPERATING MODES

W&:r-----==.,

DIGITAL MOTION CONTROL

Description
The HCTL-2000 is an HCMOS IC that performs the quadrature decoder, counter, and bus interface function. The
HCTL-2000 is designed to improve system performance in
digital closed loop motion control systems and digital data
input systems. It does this by shifting time intensive quadrature decoder functions to a cost effective hardware solution.
The HCTL-2000 consists of a 4x quadrature decoder, 12 bit
binary upldown state counter, and 8 bit bus interface. The
use of Schmitt triggered CMOS inputs and a 3 bit state
delay filter allows reliable operation in noisy environments.
The HCTL-2000 provides LSITL compatible tri-state output buffers. Operation is specified for a temperature range
from -40 to +85 0 C at clock frequencies up to 3.9 mHz.

package Dimensions

1:.~Sj::::::J
l--=-:\
PIN I

19.00± 0.25
10.748 ± O.OID}

7.62

6.40
(0.264 NOMI

1.64±O.127

!O'~08O±O'OOSI

0,61

(0.020 MIN}

(O"30±o.OID}~I::
:c

3.30_ o.25j

o.S84±O.127

1J

[O.023±G.0051
O.Z5
(0.100 TVP}

B

(0.300NOMI

--.1

B

JLo~~g±~:~OI

DIGITAL DATA ENTRY

Applications
• INTERFACE QUADRATURE INCREMENTAL
ENCODERS TO MICROPROCESSORS
• INTERFACE DIGITAL POTENTIOMETERS TO
DIGITAL DATA INPUT BUSSES

Table of Contents
•
•
•
•
•
•

l'
!..--MAX

8.13±0.5O
0.457 ± 0.05 10.320 ± O.02t!1
(0.018;t 0.0021
O.25± 0.05
(O.OIDi 0.0021

LEAD FINISH: SOLDER DIPPED

PINOUT

OPERATING CHARACTERISTICS ............. 2
FUNCTIONAL PIN DESCRIPTIONS ........... 3
SWITCHING CHARACTERISTICS ............. 4
OPERATION ................................... 6
FILTER OPTIMIZATION ....................... 9
INTERFACING ............................... .11
- GENERAL ................................. 11
- TO MOTOROLA 6801 ..................... 12
- TO INTEL 8748 ............................ 13

ESD WARNING: HCTL-2000 is implemented in a standard
HCMOS process with diode protection of all 1/0 pads.
Standard precautions for handling HCMOS devices
should be observed.

1-43

Operating Characteristics
Table 1. Absolute Maximum Ratings (all voltages below are 'referenced to Vss )

Parameter

Symbol

Limits,

Units

Vdd

-0.3 to +7

V

Vln

-0.3 to Vdd +0.3

V

Ts
Tall)

-40 to +125

·C

-40 to +85

·C

Symbol

Limits

Units

Veld
Tall I

+310+6

V

-40 to +85

·C

DC Supply Voltage
Input Voltage
Storage Temperature
Operating Temperature

Table 2. Recommended Operating Conditions

Parameter
DC Supply Voltage
Ambient Temperature

Tabie 3. DC Characteristics Vdd == 5V ± 5%; Ta = --40 to +85 0 C
Symbol

Parameter

VU I2!

Low-Level
Input Voltage

Vih,2j

High-Level
Input Voltage

VI+l2 1

Schmitt·Trigger
Po<ive-Going
Threshold

VtJ2J

Vh
lin

Min.

Condition

Typ.

Max.

Unit

1.5

V

3.5

V

3.0

4.0

V

itt-Trigger
live-Going
shold

1.0

1.5

V

hmitt-Trigger
ysterests •
nput Current

1,0

1.5

V

I

Vin= Vdd
Vin" Vss

-10
-10

•

1
1

+10
+10

p.A
p.A

Vahl2]

• High-Level
Output Voltage

loh""-1.6mA

Vo112 ]

Low-Level
Output Voltage

'01 = +1.6mA

loz

High-Z Output
Leakage Current

'dd

Quiescent Supply
Current

Vin,:"VssOrVdd
Vd=HIZ

60

p.A

Gin

Input
Capacitance

Any Inputl3 ]

5

pF

Gout

Output Capacitance

Any Outputl31

7

pF

.

2.4

Vo '" Vss or Vdd

-10

4.5

V

0.2

0.4

V

1

+10

p.A

NOTES:
1. Free Air.
2. In general. for any Vdd between the allowable limits (+3V to +6V). Vii = O.3Vdd and Vih = O.7Vdd; Vt+ imd VI" vary as Fig 1; Voh = VddO.SV and VOl = v" + O.2V @ (±) 1.6 ma respectively.
3. Excluding package capacitance.

1-44

---

---------~

3.5

3.0

'iii

I.J

(~ /

2.5

V

0

2:

:>

2.0

1.5

V

r

\:::'

1.0

3.0

f-""

V
3.5

I

/'

V

V

I

/

4.0

YV

4.5

5.0

,-

5,5

6.0

6.5

Vdd-Vcs (VOLTS)

Figure 1. Typical Schmitt Trigger Input Threshholds

Functional Pin Descriptions
Table 4. Functional Pin Descriptions
Symbol
Pin
Del>Cfiption
Power Supply

Vdd

16

Vss

8

Ground

CLK

2

The rising edge of this Schmitt trigger input controls the sampling of the CHA and CHB
inputs, and the clocking of the input of the nOise filters, decoder, counter and internal
data latch. The falling edge of the CLK input controls the sampling of the OE and SEL
inputs to control the inhibit logic.

CHA
CHB

6
7

CHA and CHB are Schmitt trigger inputs which accept the output from a quadrature
encoded source, such as an incremental optical shaft encoder. The 4x decoding into
states produces count and direction information where the number of states is 4 times the
number of pulses on CHA or CH8 (See Figure 8). Non-ideal state width affects the relationship between the clock frequency and the maximum encoder line frequency: See
"Digital Filter" and "Quadrature Decoder" section.

RST

5

This active low Schmitt trigger input clears the internal 12 bit up/down position counter
and the position latch. It also resets the inhibit logic. RST is asynchronous with respect to
any other input signals. RST does not clear the input filter state machine nor the decoder
state machine.

OE

4

This HCMOS active low input directly controls the tri-state output buffers. In addition,
the OE and SEL inputs are sampled by the internal inhibit logic on the falling edge of
the clock to control the loading of the internal position data latch. The above operation
constrains the timing of OE and SEL to be synchronous with the falling clock edge during
two byte read operations" See "Inhibit Logic".

SEL

3

This HCMOS input directly controls which data byte from the pOSition latch is enabled
into the 8 bit tri-state output buffer. As in OE above, SEL also controls the Internal inhibit
logic.

DO

1

01

15

02

14

03

13

04

12

05

11

06

10

07

9

SEL

BYTE SELECTED

0

high

1

low

These LSTTL compatible trl-state outputs form an 8 bit output port through which the
contents of the 12 bit position latch may be read in 2 sequential bytes. Inhibit logic disabies the pOSition data latch inputs at the start of the read operation to hold the data
stable throug~ the 2 byte read operation. Once commenced, this sequence must be
completed, or RST must be used to roset the inhibit logic. with resulting data loss. The
high byte, containing bits 8-11, is read first. The most significant 4 bits of this byte are set
to 0 internally. The lower byte, bits 0-7, is read second.

1-45

switching Characteristics
Table 5. Switching Characteristics Mi n/Max specifications at Vdd
representative of Vdd

= 5.0V. T case = 25

0

= 5.0 ± 5%,

Ta

= -40 to +85

Mln. ll1

Typ.121

1

Tclk

Rising edge to rising edge of clock period

255

136

2

Tchh

Minimum clock high hold time

125

3

Ted l3i

Delay from rising edge of clock to valid.
updated count information on 00-7

4

T ode 151

OE to valid data on 00-7

Todz

OE delay to Hi-Z state on 00-7

Tsdv 141

SEL valid to stable, selected data byte,
delay to High Byte=delay to Low Byte

Symbol Description

5
6
7

0

C; Typicals are

C
Max. 11J

Units
ns

70

-

-

126

230

ns

-

47

86

ns

30

55

ns

71

129

ns

-

ns

TClh
Tss l61

Minimum clock low hold time

35

20

8

SEL setup time prior to falling clock edge

36

20

9

ToslSI

OE setup time prior to falling clock edge

31

17

10

Tsh 161

Hold time of SEL after falling clock edge

0

-

11

TOh l61

Hold tlmfl of OE after falling clock edge

0

12

Trst

RST active low hold time

50

13

Tdcd

Output Delay Time: Last Position Count Stable
on 00-7 after Rising Clock Edge.

5

14

Tdsd

Output Delay Time: Last Dala Byte Stable after
next SEL state change.

4

15

Tdod

Output Delay Time: Data Byte Stable after OE
Rising Edge

3

-

ns

ns

ns

-

ns

-

ns

27

-

ns

36

-

ns

31

-

ns

25

-

ns

-

NOTES:

1. All times specified from valid logic level to valid logic level of relevant liD pins. Conformance to these limits is necesary to insure proper
operation over Ta = -'40 to +85 0 C.
2. Typical times are for reference only.
3. Ted specification and waveform assume valid stable SEL and DE from T =_00
4. Tsdv specification and waveform assume data stable and valid on internal multiplexer inputs prior to the SEL transition.
5. Tode specification and waveform assume data stable on buffer inputs.
6. Tss. Tos. Tsh. Toh only pertain to proper operation of the inhibit logic. In other cases. such as 8 bit read operations. these setup

and hold times do not need to be observed.

RST

Figure 2. Reset Waveform

1-46

CLK

00-7

Figure 3. Waveforms for PosiUve Clock Edge Related Delays

HIGH -Z

HIGH-Z

Figure 4. Tri-State Output Timing

CLK

SEL

INTERNAL
INHIBIT

DO-7 HIGH-Z

LOW DATA
BYTE STABLE

HIGH-Z
OR UNSTABLE DATA

Figure 5. Bus Control Timing

1-47
--------------

Operation
A detailed block diagram of the HCTL-2000 is shown in
Figure 6. The operation of each major function is described
in the following sections.

CLK~-.----CK
12BIT
LATCH

12BIT
BINAAVCTA

CHANNEL
A
4X
DECODE
LOGIC

CHA

CNT

CNT

CHANNEL
B

00-

Do-D7

12

011

UPIDN

UPIDN

00-0'1
CK

CK
CLA

CLA

SEL

INH

OE

CH B -t'i>-l--t

INHIBIT

R!IT~~---~----~----------------~---~

r---------------,
INHIBIT LOGIC

SEL----------~--f:~------------~--------f------------------------+------~
OE----------~--fl~-----------r~--------+------------------------+------~

I
I

I
I
I
I
I
I
I
I

~---------------Figure 6. Simplified logic Diagram

DIGITAL FILTER
The digital filter section is responsible for rejecting noise
on incoming quadrature signals. Schmitt-trigger conditioning addresses the problems of slow rise and fall times and
low level noise. The major task of the filter is to deal with
short-duration noise pulses that cause the input logic level
to momentarily change. Due to the nature of quadrature
decoding, noise pulses on one channel will not cause a
count error, but the coincidence of two overlapping noise
pulses, one on each input, can cause illegal state transitions. False counts of undetermined direction wiJl result
from the decoding of these illegal transitions (see Fig. 8).

sfraint- derives from the operation of the input filters. It
relates the maximum clock period to the minimum encoder
. pulse width. The second constraint derives from the decoder operation and is covered in the "Quadrature Decoder"
section. It relates the maximum clock period to the minimum encoder state width (Tas).
The explanation of constraint one above is as follows: It
takes a minimum of four positive clock transitions for a
new logic level on either CHA or CHB to propagate through
their respective filters, but the Signal only needs to be stable for three consecutive rising clock edges (See Figure 7).
. This means that the minimum encoder pulse width (Ta) on
each channel must be 2: 3T ClK, where T ClK is the period
of the clock.

A pair of filters rejects these noise pulses by sampling the
CHA and CHB logic levels and storing a time history in a
pair of shift registers. For each channel, if the input level
has had the same value on three consecutive rising clock
edges, that value becomes the new output of the filter; otherwise the output is unchanged. This means that the CHA
filter output cannot change from high to low until the CHA
input has been low for three consecutive rising clock
edges. CHB is treated the same as CHA.
The operation of this digital filter section places one of two
timing constraints on the minimum clo~k frequency in relationship to the encoder count frequency. The first con-

In the presence of noise, the filter will require that 3TClK
be less than Ta, since noise pulses will interrupt the required
three consecutive constant level samples necessary for the
filter to accept a new input level. In general, the iypes of
noise that this filter will deal with will derive from the rotating system, i.e., motor noise, capacitively coupled level
changes from other encoder channels, etc. As such, these
noise sources will be periodic in nature and proportional to
the encoder frequency. Design for noise of this type is discussed later in the "Filter Optimization" section.

1-48

ClK

I

CHA~

r---T'---;-:""I.---=-T.s---=:j~t.===T:=.-=-=-=-=1

CHB_~I
I.

r-

I

T.----.!I-.---T.,-------I·I

Figure 7. Minimum Encoder Pulse Width with Respect to TCLK

In addition to problems with noise, other common signal
problems enter into the determination of the maximum
TCLK for each application. The following quadrature signal
aberrations can all be accounted for by designing with
short enough TCLK to accommodate the reduction of the
effective encoder pulse width:
1) non-ideal encoder rise and fall times,
2) asymmetric pulses,
3) short « 180 electrical degrees) pulses.

The combination of the following two errors must be examined in light of the minimum state width constraint to
ensure proper operation of the decoder section:
1) Phase shift deviations from 90 electrical degrees
between the CHA and CHB signals;
2) Pulse width errors resulting in Te ·shorter than 180
electrical degrees in either or both CHA and CHB.
Design for these conditions is discussed in the "Filter
Optimization" section.

Designing for these non-ideal Signals is discussed later in
the "Filter Optimization" section.
COUNT Up

~
1

QUADRATURE DECODER
The Quadrature Decoder section samples the outputs from
the CHA and CHB filters. Sampling occurs on the rising
clock edge. The Decoder Section observes changes in
these outputs, and, on the rising clock edge, it outputs two
signals to the position counter. These signals specify when
to count and in which direction (up or down).

3

c~

Encoder state changes are detected by comparing the previous sampled state to the current sampled state. If the two
are different, the counter section is signaled to count on
the next rising clock edge. Count direction (up or down) is
also determined by observing the previous and current
states, as shown in the quadrature state transition diagram
(figure 8). An illegal state transition, caused by a faulty
encoder or noises severe enough to pass the filter, will produce a 'count but in an undefined direction.
The second constraint on the relationship between T CLK
and the input quadrature Signal, as previously mentioned in
the "Digital Filter" section, is the requirement by the 4x
decoder for at least one positive clock transition to occur
during each quadrature state to detect the state. This constraint is satisfied if: T es > T CLK, where Tes is the time
interval corresponding to the shortest state width at the
maximum system velocity.

STATE

CHA

CHB

1

0

1

1

1

2

0

1

3

0

0

4

Figure 8. Elements 01 4x Quadrature Decoding

1-49
._ ...

_._........ _ . _ - _ . _ - - - - - - - - - - - - - - - - - - - - - - - - -

POSITION COUNTER
This section consists of a 12-bit binary up/down counter
which counts on rising clock edges as specified by the
Quadrature Decode Section. All twelve bits of data are
passed to the position data latch. The system can use this
count data in three ways:

A. System total range is ::;12 bits, so the count represents
"absolute" position.
B. The system is cyclic with ::;12 bits of count per cycle,
RST is used to reset the counter every cycle, and the
system uses the. data to interpolate within the cycle.
C. System count is >12 bits, so the count data is used as a
relative or incremental position input for a system computation of absolute position.

of the position data latch output. Since the latch is only
twelve bits wide, the upper four bits of the high byte are
internally set to zero. The SEL.and DE signals determine
which byte is output and whether or not the output bus is
in the high-Z state, respectively.

INHIBIT LOGIC
The Inhibit Logic Section samples the DE and SEL signals
on the falling edge of the clock and, in response to certain
conditions (see Figure 9 below), inhibits the position data
latch. The RST signal asynchronously clears the inhibit
logic, enabling the latch.

In case C above, counter rollover occurs. In order to prevent loss of position information, the processor must read
the outputs of the HCTL-2000 at intervals shorter than 512
times the minimum encoder line period. This minimum line
period (Tel p ) corresponds to the maximum encoder velocity of the design. Two's complement arithmetic is normally
used to compute position from these periodic position
updates.

POSITION DATA LATCH
This section is a 12-bit latch which captures the position
counter output data on each rising clock edge, except when
its inputs are disabled by the inhibit logic section during
two-byte read operations. The output data is passed to the
bus interface section. The latch is cleared asynchronously
by the RST signal. When active, a signal from the inhibit
logic section prevents new data from being captured by the
latch, keeping the data stable while successive byte-reads
are made through the bus interface section.

ACTION

SET INHIBIT; REAO HIGH BYTE
READ lOW 8YTE: STARTS RESET
COMPLETES INHIBIT LOGIC RES
Figure 9. Two Byte Read Sequence

While the HCTL-2000 can be used with any microprocessor, the Bus Interface and Inhibit Logic sections have been
optimized for use with microprocessors similar to the
Motorola 6801. The 6801 has a double-byte fetch instruction (LDD) which produces two consecutive fetch cycles
on the bus. In the correct interface configuration, the first
cycle inhibits the position data latch and reads the high
data byte, and the second cycle reads the low byte and
resets the inhibit logic. A version of this configuration is
illustrated in Figure 14:

BUS INTERFACE
The bus interface section consists of a 16 to 8 line multiplexer and an 8 bit, three-state output buffer. The multiplexer allows independent access to the low and high bytes

rurr----------------------~--------------__,
SEL

-----------.r---,"""

ae-----------I-.....-oL..J

INTERNAL INHIBIT SIGNAL
TO POSITION DATA LATCH

CLKl.

----------+-+--------.....---f--I----------l

Figure 10. Simplified Inhibit Logic

1-50

- - - - - - - - - - ------------ - - - - - - - - - - - - -

Filter optimization

K1
Telpmin = (RPM) (N)

System design with the HCTL-2000 will require the user to
optimize its clock period for encoding errors and line noise
on the CHAand CHB inputs. In the absence of noise this
optimization is simplified. The critical encoding errors, minimum pulse width and minimum state width, occur at the
maximum designed system operating velocity. Input noise
can be caused by motor electromagnetic interference,
channel cross coupling, etc. The HCTL-2000 input filter
interacts with encoding errors and noise to form the major
system design constraints. This section will illustrate system design techniques and will present guidelines useful in
implementing the HCTL-2000.

Temin

In the absence of noise, the system design reduces to case
A in Table 6. In the presence of noise, cases B through E
describe the types of noise for which the above filters are
effective. Normal techniques for reducing noise on CHA
and CHB inputs may be required to reduce this noise to a
level that can be handled by the input filters.
Noise that can be filtered by the HCTL-2000 input filters is
noise where T nf > T esmin and T mn < 2T ClK. This noise can
be subdivided into four categories, each having different
design constraints. These categories are differentiated by
the pulse width of noise on the individual encoder channels.
Dependant channel noise, as below in case Band C in
Table 6, is noise where the superposition of noise from
both encoder channels does not display a period shorter
than the minimum state width:
T nf > Tesmin.
The graphic analysis of the effect of this type of noise
upon the filter operation is illustrated in Figure 11.
Tmn 4* (TCLK)

A; I

Design for quadrature signal errors proceeds as follows for
an ideal quadrature Signal, i.e. all errors = 0:

= 1/4Telp = 1/2 Te = 90

0

e, ideal

'

~~~::i!

ENCODING ERRORS

Tes

(6)

NOISE

T nf = The fundamental period characteristic of a periodic noise source
TClK = Period of HCTL-2000 clock input
signal
T mn = Maximum pulse duration of
encoder noise
Temin = Te(min) = Minimum encoder line
pulse width including encoder
errors
Tesmin = Tes(min) = Minimum encoder
statewidth including encoder
errors
T elpmin = Period of maximum designed
encoder line frequency
RPM = Maximum designed operating
speed of the encoder in revolutions
per minute
N = Encoder line count
= Number of encoder counts per
revolution
K1 = 60 sec.!min.

Te = 1/2Telp = 1800 e ideal pulse
width

(5)

Telpmin

90- ILl.SI)
Tesmin = ( ~ Telpmin

The discussion that follows will make use of the definitions
listed below:

Tel p = 360 0 e = defined as one electrical
cycle in electrical degrees

180-1 Ll.PI)

=( ~

(4)

(1)

~I

'!

1

i':

Ii
i

FILTERED'· I

(2)
SIGNALB,,";

(3)

In a real system there are quadrature signal errors, where
these errors are:

••.•.

'.•

I
---Ii

+1----;-:

!I j;
: :
~ ~~esmi~=4*{TC!.K)rj
: I

I.

--'--;......----~,

,...!

state width

~

j

A,I

I

1

:

!

i

'

;

i

~,
I,
Tesmin=TcLK

I

*Signal after Internal Input Filter

Figure 11, Noise is Encoder Channel Dependent

Ll.P = Maximum encoder pulse width
error in °e, as a deviation from the
ideal pulse width of 1800 e

Independant channel noise, as in case D and E in Table
6, is such that the noise on each channel is in dependant
of the noise on the other channel. The period of the
noise on each channel must satisfy the condition:

Ll.S = Maximum state width error in °e, as
a deviation from the ideal state
width of 90° e
The worst cases for pulse width and state width errors in
terms of time intervals will occur at the maximum designed
system operating velocity. These errors are typically available from encoder manufacturer's data sheets.

1-51

Tnf> Tesmin
independantly. The graphic analysiS of the effect of this
type of noise on the filter operation is illustrated in Figure 12.

Tmn  4* (TCl.K)

FILTER DESIGN EXAMPLES
------TCLK

Given the above rules, we can calculate the design parameters for a typical high performance motor loop as follows:

I

A

Where RPM =
N=
~P =
~S =

I
=1

'I

j:

~~~~3iR

:1

B,,.+:.....;.----+-~

::

Then the following calculation accounts for signal errors:

'I

:1

I

Telpmin = (_--::::-:K,:,1-:-:__ ) =
60
from eq. 4
(RPMJlNI
13600111000)

I

~~:~-~---+--~
I
I

= 16667 ns

FIL TEREO* , I
SIGNAL

3600 rev/min.
1000 counts/rev.
± 48°e
±600e
at 60° C, 1/Telpmin = 60kHz

:I
,I
B~ I

Temin =

=1

'I

I

I

I

'I

I

(

18o-l~PI

) Telpmin

360

II4---T-Tesmin=5*(TClK)~ ~T~min=TcLK

II

I

,

,

'

,

'

,

= (

*Signal after Internal Input Filter

Figure 12. Noise Is Encoder Channel Independent

180 - 48
360

) 116667 ns)

from eq. 5

= 6111 ns

The set of design rules that are presented in Table 6 can be
derived by examination of Figures 11 and 12, and the following constraints:

Tesmin =

a) The encoder output signals must stay at a logic level
for a minimum of three consecutive clock pulses belore
the HCTL-2000 recognizes the logic level change:
Temin > 3TClK.
b) Atter acceptance by the HCTL-2000 input filtering section, a state must exist for a minimum of TClK to be
recognized by the internal logic.

(

= (

90-I~SI

) Telpmin

360
90-60
360

) 116667 ns)

from eq. 6

= 1389 ns
If the noise is as in case B of Table 6, we can use the above
to evaluate the system.
For the condition of noise such that T mn < 260 ns:
TClK > 260 ns
255 ns::; T ClK < T esmin
4

c)The minimum encoded pulse width must be greater
than twice the minimum state width: Temin > 2Tesmin.
d)The minimum clock period must be greater than 255
ns, which is the minimum clock period for which the
HCTL-2000 is guaranteed to operate over the entire
specified operating temperature range.

Tesmin=

4

1389

=347ns

4

Thus,
255 ns ::; T ClK < 347 ns
Similar calculations can be performed to design the filter
for the specifics of each system.

Table 6. Summary of Filter Design Rules for the HCTL-2000
Case

No'se
Relationship

General
Conditions

PulseWldlh
Constraint

Clock Period
Design Criteria

A

No noise on
CHAorCHB

Temin > 2Tesm!n

Telk < Tesmin

25511s 5 TClk < (1/3)Tem ln

B

Superposition of noise
on CHAorCHB

Tesmln> Tnl
Temln > 2Tesm!n

Tclk>Tmn>O

255ns5 Tclk < (1/4)Tesmln

C

Superposition of noise
onCHAor CHB

Tesmln> Tnf
T emln > 2Tesmin

2Tclk> Tmn <::Tclk

255ns5 Tclk < (1/5}Tesm in

0

Noise on CHA or
on CHB Independent
of each other

Tesm!n > Tnt
Temln > 2Tesm!n

TClk> Tmn>'o

25511s 5 TClk < (1!5)Tesml n

E

Noise on CHA or
on CAB Independent
each other

Tesmi",> Tn!
Temin ;;. 2Tesmln

2Tclk> Tmn<:: Tclk

255n5 5 Tclk < (1!7)Tesmin

of

1-52

Interfacing the HCTL-2000:
General
The 12 bit latch and inhibit logic on the HCTL-2000 allows
access to 12 bits of count with an 8 bit bus. When only 8
bits of count are required, a simple 8 bit (1 byte) mode is
available by holding SEL high continously. This disables
the inhibit logic. OE provides control of the tri-state bus,
and read timing is per Figures 3 and 4.

The internal inhibit logic on HCTL-2000 inhibits the transfer
of data from the counter to the position data latch during
the time that the latch outputs are being read. The inhibit
logic allows the microprocessor to first read the high order
4 bits from the latch and then read the low order 8 bits
from the latch. Meanwhile, the counter can continue to
keep track of the quadrature states from the CHA and CHB
input signals.

For proper operation of the inhibit logic during a two-byte
read, OE and SEL must be synchronous with CLK due to
the falling edge sampling of OE and SEL.

Figure 10 shows a logic diagram of the inhibit logic circuit.
The operation of the circuitry is illustrated in the read timing shown in Figure 13.

ClK

~Jl.JlJl.J"lJ1J1JlJ"LJlJ1IU
I
I

I

11l
I

I

I

Ir--+I----....,l!/-I----t--:---:.-

I~

I·
I

~~~-~-~,1l1
,

DE

..l-_.,',

INHIBIT
SIGNAL _...,.._--;_ _

DATA
LINES

POSITION
LATCH

I
I NEW
I DATA
I

I
I NEW
I DATA
I

I
I
ACTIONS

I

II

I

I

I
I

I

" I

I

I

BYTE

I

I

!

I

DATA UNCHANGED

I

"I

RI STATE

I
I
I

I

I

I

I

I
I

,1

I

I

I

cb

I :

"

"

yNEW
I
DATA

I

L.oWBYTE

HIGH BYTE

I

NEW
DATA

I
I,'

I

I
I

r-r

I

I

II
II

l ....... loW

I
I

I

~
I
I~I+-----------~a~--~---I~------~I
I

I

I

~I

TRI STAT

1

I

cbcb

/

I

I

I

I II
I

I

I
I
I
I

I
I

I I
I I

I
I
I

I
I
I
I

NEW
DATA

o cbcb

I

I

cb

Figure 13. Internal Inhibit Logic Timing

ACTIONS
1. On the rising edge of the clock, counter data is transferred to the position data latch, provided the inhibit
signal is low.
2. When DE goes low, the outputs of the multiplexer are
enabled onto the data lines. If SEL is low, then the high
order data bytes are enabled onto the data lines. If SEL
is high, then the low order data bytes are enabled onto
the data lines.
3. When the HCTL-2000 detects a low on OE and SEL during a falling clock edge, the internal inhibit signal is
activated. This blocks new data from being transferred
from the counter to the position data latch.

4. When SEL goes high, the data outputs change from
high byte to low byte.
5. The first reset condition for the inhibit logic is met when
the HCTL-2000 detects a logic high on SEL and a logic
low on OE during a falling clock edge.
6. When OE goes high, the data lines change to a high
impedance state.
7. To complete the reset of the inhibit logic, after the first
reset condition has been met, the HCTL-2000 needs to
detect a logic high on OE during a falling clock edge.

1-53

Interfacing the HCTL-2000 to a Motorola 6801
This interface method provides the minimum part count
when the 6801 is operated in "MODE 5". A typical 6801 circuit is shown in Figure 14. In Figure 14, the 74LS138
A7 22 .
23

,As
.fas:

-

E

At

24
39

.

1

At,'1~~

4

!i

~-

fI'Io!-

Sa

16

40

4

12

A.
.... 0,
tI.

a.
I'ORT

Ei

: Az

At;

29

3

30

til
D.
D.
12
0.,
10

32

11

33

0$

HCT~_

,

13

03
0,
Dt
1
00

3.

1.

,.

Dl
0, 36

0.,

C~K

9

31

D.
34
03

'1'""

sa.

37

address decoder can be eliminated if the HCTL-2000 is the
only occupant of Port 4.
The processor clock output (EI is used to clock the HCTL2000 as well as the address decoder. One of the address
decoder outputs drives the DE input. Thisresults in HCTL2000 counter data being enabled onto the bus whenever an
external memory access is made to the HCTL-2000. This
example assumes the address assigned to the HCTL-2000
high byte is an even address. The least significant address
bit is connected to the SEL input. It determines which data
byte is output. When AO on the decoder equals 0 the chip
selects the high byte, and when AO equals 1, the chip
selects the low byte. This configuration allows the 6801 to
read both data bytes with a single double-byte fetch instruction (LDD E, 01XXI. The, LDD instruction is a five cycle
instruction which reads external memory location 01XX
and stores the high order byte in accumulator A and reads
external memory location 01 XX +1 and stores the low order
byte in accumulator B during the last two cycles. Figure 15
illustrates the sequence of events during all five cycles.

Figure 14. A Circuit to Interlace to the 6801

CYCLE 4

ICLOCK)

ADDRESS
BUS

I

OPCODE
ADDR.

i

I
I
DATA BUS

los

I

I

I

I

OPCbDE
ADDR. +1

OPCbDE
ADDR. +2

I

I
I
I

I

OPERAND
ADD~. LOW

D2TA
H,GH,BYTE

I
I

OPCbDE
,

OPE~AND
ADDR. HIGH

I
I

I
I

CYCLE.

)

I

)

OPE~AND

OPERAND
ADDR. +1

AD,DR.

I

DATA
LOW BYTE

I

I

:I

II

I

I

I

I

I

\\..--+--+-----..,..,/

i

i

1

I
I
I

I

:

I

I

I

:I--a-J

I~

I
I

I

I
I

!~-!··iI

I

II

I

:

i
!I
I

I

/

I

:

I
I
I

I

I
I
I
_ _~I-----+I----~I-----41

HCTL ·2000
DATA BUS

I
I

I

AoISEL)

INTERNAL
INHIBIT

1

I

:

I

I

I:

I

I

III.

HIGH Z

r---l'

I
I

iI
I

HIGH Z

---~---~-----4----_4_+-++.-~~-~--~-r_-~

I
I

I

cb

cb

I

I

I
I

I

o

cb
Figure 15. Interlace Timing for the 6801 LDD E

1-54

4. E is now low, so the address decoder output is disabled
and OE goes high. The 6801 increments the address, so
SEL goes high. The position data latch is still inhibited.

ACTIONS
1. E is the microprocessor clock output. On the rising edge
of E, if the internal inhibit is not active, then new data is
transferred from the internal counter to the position data
latch.

5. The address decoder is enabled after E goes high; so
OE goes low and the low data byte is enabled onto the
bus.

2. An even address output from the 6801 has caused SEL
to go low. E goes high which causes the address decoder output for the HCTL-2000 OE input to go low.
This causes the HCTL-2000 to output the high byte of
the position data latch.

6. The 6801 reads the data bus on the falling edge of E,
storing the low order data byte in accumulator B. The
chip detects that OE is low and SEL is high on the failing edge of E, so the first inhibit-reset condition is met.
7. E is now low, so the address decoder is disabled, causing OE to go high and the data lines to go to the high
impedence state. The 6801 continues its instruction execution, and the state of SEL is indeterminate.

3. The 6801 reads the data bus on the falling edge of E,
storing the high order data byte in accumulator A. The
chip detects that OE and SEL are low on the falling
edge of E and activates the internal inhibit signal. The
position data latch is inhibited and data cannot be transferred from the internal counter to the latch.

8. The HCTL-2000 detects OE is high on the next falling
edge of E. This satisfies the second inhibit reset condition so the inhibit signal is reset.

Interfacing the HCTL-2000 to

an Intel 8748
The circuit in Figure 15 shows the connections between an
HCTL-2000 and an 8748. Data lines DO-D7 are connected
to the 8748 bus port. Bits 0 and 1 of port 1 are used to
control the SEL and OE inputs of the HCTL-2000 respectively. TO is used to provide a clock signal to the HCTL-2000.
The frequency of TO is the crystal frequency divided by 3.
TO must be enabled by executing the ENTO CLK instruction after each system reset, but prior to the first encoder
position change. An 8748 program which interfaces to the
circuit in Figure 16 is given in Figure 17. The resulting interface timing is shown in Figure 18.

To

PH
P1Q

DB7

De,
-8748

De5
De4
Del

1

2

28

3

27

4

19

9

18

10

17

11

16

12

15

13

14

14

13

15

12

1

DBi
DOl

Deo

eLK

SEl

OE
0,
D.

05 HeTl-2000
0"
03
0,

D,
Do

Figure 16. An HCTL-2000 to Intel 8748 Interlace

LOC

OBJECT
CODE
9900
08
A8
8903
08
A9
8903
93

000
002
003
004
006
008
009
OOB

SOURCE STATEMENTS
ANL Pl, OOH
INS A, BUS
MOVE RO A
ORL Pl, 01H
INS A, BUS
MOV Rl, A
ORL Pl, 03H
RETR

ENABLE OUTPUT AND OUTPUT HIGHER ORDER BITS
LOAD HIGHER ORDER BITS INTO ACC
MOVE DATA TO REGISTER 0
CHANGE DATA FROM HIGH ORDER TO LOW ORDER BITS
LOAD ORDER BITS INTO AC
MOVE DATA TO REGISTER 1
DISABLE OUTPUTS
RETURN

Figure 17. A Typical Program for Reading HCTL-2000 with an 8748

1-55
•.......

-~~~

_

_

......_ - - - _.. ... .._ - - - -

...._ - - - - - - _ . _ - - -

11

elK

1

1

I I
I I
I I

I

I
I

I

PROGRAM
EXECUTION

ANL, Pl, 004

I

ORL P1, OIH

ORL P1. 03H

RETR

I

I:

~--------------------~I

I

I

I
I

I

I

INHIBIT

I
I

~'------ BUS
DATA BUS

~

---+1------.+

I

HIGH BYTE

I I

ACTIONS

I

READ

cb:

cb

a;

lOW BYTE

0

1)(1

d;

Figure 18. 8748 READ Cycle from Figure 14.

ACTIONS
1. ANl Pl, OOH has just been executed. The output of
bits 0 and 1 of Port 1 cause SEl and OE to be logic low.
The data lines output the higher order byte.
2. The HCTl-2000 detects that OE and SEl are low on the
next falling edge of the ClK and asserts the internal
inhibit signal. Data can be read without regard for the
phase of the ClK.
3. INS A, BUS has just been executed. Data is read into
the 8748.

5. INS A, BUS has just been executed. lower order data
bits are read into the 8748.
6. ORL Pl, 03H has just been executed. The HCTl-2000
detects OE high on the next falling edge of ClK. The
program sets OE and SEl high by writing the correct
values to port 1. This causes the data lines to be tristated. This satisfies the second inhibit-reset condition.
On the next rising ClK edge new data is transferred
from the counter to the position data latch.

4. ORl PORT 1,01 H has just been executed. The program
sets SEl high and leaves OE low by writing the .correct
values to port 1. The HCTl-2000 responds by outputting
the lower byte. The HCTl-2000 detects OE is low and
SEl is high on the next falling edge of the ClK, and
thus, the first inhibit-reset condition is met.

1-56

•

•
•
•......

•
••

2-1

•
•
•

•
•

•

.,

.

Bar Code Products
A totally new product for 1986 is HewlettPackard's Industrial Digital Slot Reader. This
rugged scanner is designed specifically for
reading bar codes printed on I.D. cards, badges,
heavy paper stock, or traveller forms. It features
a large slot width for handling even multiple
laminated cards, a wide scan speed range, and a
digital output that is compatible with wand
decoding software.

1986 brings with it a further expansion of
Hewlett-Packard's bar code line in three widely
diversified areas.
We have expanded our line of digital bar code
wands again this year with the introduction of
the HBCS-5XXX and HBCS-6XXX families of
wands. These Low Current Digital Bar Code
Wands are the latest technological advance from a
company that invented the Digital Wand.
Through sophisticated circuitry, these wands are
able to provide superior performance while
drawing less than 5 rnA of current at 5 volts.
Performance improvements include high ambient
light rejection, including direct sunlight; a wider
range of resolution choices; and a new sensor
design specifically for reading.thermally printed
bar codes.

Available in both an infrared (880 nm) version
and a visible red (660 nm) version, the unit is
housed in a black epoxy finished, metal case. The
unique rear mounting system and tamper-proof
design makes it ideal for use in security or
industrial applications.
Finally, adding to our successful line of decoder
IC's, is the new Multi-Purpose Decoder Ie. This
extraordinary device is designed specifically for
the OEM who would rather not tie up valuable
resources developing bar code decoding software.
Packaged in a standard 40 pin DIP, the MultiPurpose Decoder Ie accepts inputs from virtually
all hand-held scanning devices, including handheld lasers and other solid state non-contact
scanners. Now you have a way to simply and
inexpensively add quality bar code decoding to
your products and still retain the flexibility your
customers require.

Of course, these wands continue to offer the
other features you've come to expect from
Hewlett-Packard wands: sealed, sapphire tips,
wide scan angles, choice of case designs, and fully
compatible digital outputs.

Look to Hewlett-Packard for performance
products designed to meet the OEM's bar code
needs!
.

2-2

Bar Code Wands
Package Outline Drawing

~
~

Part No.

Description

HBCS-SOOO Low Current Digital
Bar Code Wand
(with Switch)
Resolution O.33mm
HBCS-S100 Low Current Digital
Bar Code Wand
(without Switch)
Resolution O.33mm

~
~

HBCS-S200 Low Current Digital
Bar Code Wand
(with Switch)
Resolution O.19mm

~
~

HBCS-S400 Low Current Digital
Bar Code Wand
(with Switch)
Resolution O.13mm

~

Page
No.

• Low Continuous Current Draw
(Less Than SmA)
• High Ambient Light Rejection
• 0 to 4So Scan Angle
• Push to Read Switch for Ultra Low
Power Consumption
• Rugged Polycarbonate Case
• Sealed Sapphire Tip
• Full Line of Options Available

2-6

• Low Continuous Current Draw
(Less Than SmA)
• High Ambient Light Rejection
• 0 to 4So Scan Angle
• Sealed Sapphire Tip
• Metal Case
• Full Line of Options Available

2-6

HBCS-S300 Low Current Digital
Bar Code Wand
(without Switch)
Resolution O.19mm

HBCS-SSOO Low Current Digital
Bar Code Wand
(without Switch)
Resolution O.13mm
HBCS-6100 Low Current Digital
Bar Code Wand
Resolution O.33mm

-"

Features

HBCS-6300 Low Current Digital
Bar Code Wand
Resolution O.19mm
HBCS-6S00 Low Current Digital
Bar Code Wand
Resolution O.13mm
HBCS-2200 Sapphire Tip
Digital Bar Code Wand
(with Switch)
Resolution O.19mm

~

Digital Output
0-45' scan angle
Replaceable Sapphire Tip
Internal Shielding
Push-to-read switch available for
HBCS-2300 Sapphire Tip
low power applications
Digital Bar Code Wand • Rugged Polycarbonate Case
(without Switch)
• Full line of options available
Resolution O.19mm

~

HBCS-2400 Sapphire Tip
Digital Bar Code Wand
(with Switch)
Resolution O.13mm

~

HBCS-2500 Sapphire Tip
Digital Bar Code Wand
(without Switch)
Resolution O.13mm

~

~
~
...., .....

-, ...

HBCS-4300 Industrial Digital Bar
Code wand
Resolution O.19mm
HBCS-4500 Industrial Digital Bar
Code Wand
Resolution O.13mm

Package outline drawings not drawn to scale.

2-3

•
•
•
•
•

•
•
•
•
•

Digital Output
0-4S' scan angle
Replaceable Sapphire Tip
Metal case
Futlline ot options availabte

2-26

2-32

Bar Code Wands
Package Dulline Drawing

Part No.

~
..

~
~
~
..,..

:.

Page
No.

Features

Description

HEDS-3DOD Digital Bar Code wand • Digital Output
(with Switch)
• 0-30 scan angle
Resolution O.3mm
• Replaceable Tip
• Internal Shielding available for
HEDS-3050 Digital Bar Code Wand
improved electrical noise rejection
(Shielded)
• Push-to-read switch available for
Resolution O.3mm
low power applications
• Full line of options available
HEDS-3200 Digital Bar Code Wand
(with Switch)
Resolution O.19mm

2-38

0

HEDS-3250

-

2-44

Digital Bar Code Wand
(Shielded)
Resolution O.19mm

Component Level Bar Code Readers
Package Oulline Drawing

~:

Part No.

...... "::::::::::]

............

~

........ - .............. II

!.. =~.!!'":.:t.1 I

<:11

~

HBCR-IDOO
HBCR-l022
HBCR-l024
HBCR-l025

Component Level
Bar Code Reader
with Sapphire Tip
Wand

HBCR-l043
HBCR-l045

Component Level
Bar Code Reader
with Industrial
Metal Wand

<:;111--·"...."'-I~



0,33 (0.013)

mm (in.)

0,19 (0.007S)

mm(in.)

0.13 (0.005)

Scan Velocity

VSCAN

Contrast

Rw-Ra

45

Vs

4.5

Temperature

TA

-20

Ambient Light

Ev

Supply Voltage

Max.

7.6 (3)

Notes

mm (in.)
127 (50)

cmisee (in/sec)

%

1

5.5

Volts

2

+65

"C

100,000

lux

Tilt Angle

(See Figure 2)

Orje!Jt~tion

(See Figure 3)

3

NOTES:
1. Contrast is defined as Rw-RB where Rw is the reflectance of the white spaces and RB is the reflectance of the black bars, measured at
the emitter wavelength (655 nm or 820 nm). Contrast is related to print contrast signal (PCS) by pes = (Rw-RB)/Rw or Rw-RB =

PCS'Rw2. Power supply ripple and noise should be less than 100 mV peak to peak.
3. Ambient light sources can be diffuse tungsten, sodium, mercury, fluorescent, sunlight, ora combination thereof.

Absolute Maximum Ratings
Parameter

Symbol

Min.

Max.

Units

Storage Temperature

TS

-40

+75

·C

·0

Operating Temperature

TA

-20

+65

Supply Voltage

Vs

-0.5

+6.00

V

Output Transistor Power

PT

150

mW

Output Collector Vol~age

Vo

+20

V

-0.5

2-7

- - - - _ . --

.-'--~-------.

Notes

Electrical Operation

The wands provide a case, cable and connector shield
which must be terminated to logic ground or, preferably, to
both logic ground and earth ground. The shield is connected
to the metal housing of the 5 pin DIN connector.

The HBCS-5XXX/6XXX family of digital bar code wands
consists of a precision optical sensor and an electronic
circuit that creates a digital output of the bar code pattern.
The open collector transistor requires only a pull-up resistor
to provide a TTL compatible output from a single 4.5V to
5.5V DC power supply.

All standard HP Low Current Digital Bar Code wands are
certified to meet FCC Class Band VDE Level B standards.
The shield must be properly terminated in order to maintain
these approvals and to keep the cable from acting as an
antenna, injecting electrical noise into the wand circuitry.
Grounding the shield will also provide a substantial improvement in EMIIESD immunity.

A non-reflecting black bar results in a logic high (1) level
output, while a reflecting white space will cause a logic low
(0) level output (see Figure 1). The initial state will be
indeterminate. However, if no bar code is scanned, after a
short period (typically less than 1 second), the wand will
assume a logic low state. This feature insures that the first
bar will not be missed in a normal scan.

The recommended logic interface for the wands is shown in
Figure 5. This interconnection provides the maximum ESD
protection for both the wand and the user's electronics.

Electrical Characteristics
Parameter

Symbol

Supply Current

Min.

I

IS

High Level Output Current

IOH

Low Level Output Voltage

VOL

"TYP·

Max.

Units

Conditions

Noles

3.5

5.0

mA

Vs=5.0V

4, 5

1.0

p.A

VOH

2.4 V

IOL = 16mA
10%..90%
Transition
Rt '" 1 K

0.4

V

Output Rise Time

tr

3.4

20

118

Output Fall Time

tf

1.2

20

P.s

Switch Bounce
HBCS-5000/5200/5400

tSb

0.5

5.0

ms

7

Electrostatic Discharge Immunity

ESD

25

kV

8

tw

50

ms

9

Wake-Up Time

200

6

6

NOTES:
4. Push-to-read switch (if applicable) is depressed.
5. Not including pull-up resistor current.
6. See Figure 1.
Z Switch bounce causes a series of sub-millisecond pulses to appear at the output (Va).
8. Shield must be properly terminated (see Figure 9). The human body is modeled by discharging a 300 pF capacitor through a 500 il
resistor. No damage to the wand will occur at the specified discharge level.
9. After this time, the wand is operational.

5V------------~

___.

ov--------~--~~------------------tr--~---------------------------------

~

1---3.4.S

Figure 1. Typical Output Waveform

2-8

Depth of Field

Testing

Hewlett-Packard Digital Bar Code Wands are designed for
contact scanning. However, it is possible to read through
some overlay or covering material depending on the thickness of the material and the angle at which the wand is
held. Figure 2 shows the relationship between tilt angle and
depth of field.

All Hewlett-Packard Digital Bar Code Wands are 100%
tested for performance and digitizing accuracy after manufacture. This insures you of the consistent quality product
you expect from HP. More information about our test
procedures, test set-up, and test limits are available upon
request.

~:I
-

2.0
(0.081

iii

~ (O.~6~
~

..... -

E
E
I

1.0

~ (0.041
OJ

..........

W

:I:

ALL OTHER WANOS

'" ~HBCS5400
.......... "",
~~gg

.", ...

o

2
0.5
~ (0.02)

0.0

T

~

TYPICAL
OPErlNG

o

10

'ON

20

30

f\

40

50

U - TILT ANGLE - OEGREES

Figure 2. Wand Height vs. Tilt Angle

Figure 3. Preferred Orientation

Selection and Application Guide

I

HBCS HBCS HBCS HBCS HBeS HBes
5200
SOOO
5100
5300
5500
Wavelength (om)
Nominal Narrow Element Width
(mm)
(inch)
Case Material
Polycarbonate
Metal

6500

655

655

655

655

0,33
0.013

0.33
0.013

0.19
0.0075

0.19
0.0075

0.13
0.005

0.13
0.005

X

X

X

X

X

X
X

X

X

Yes

No

Yes

No

No

No

No

Yes
Yes
YeS
Yes

Yes
Yes
Yes
Yes

No
No
Yes
No

No
No
Yes
No

Yes
YeS
Yes
Yes

YeS
Yes
Yes
Yes

No
No
Yes
No

X

X

X

X

Switch

Yes

Will Read Bar Codes Printed Using:
Regular Thermal Paper
Dye-Based Inks
Carbon Based Inks (Note 10)
Colors (Note 11)

Yes
Yes
Yes
Yes

Best Choice For:
Widest Range of Bar Code Printing
Highest Resolution Printing
Low Res?lution or Poor Quality Printing

m

HBCS

X

Yes
Yes
Yes
Yes

820

0.33
0.013

0.13
0.005

X

X

X
X

NOTES:
10. For "black-on-black" bar codes, use the infrared (820 nm) wands only.
11. For color bar codes the background (spaces) should reflect red light, and the bars should absorb reel light.

2-9

0.19
0.0075

820

Certification
FCC Certification (USA Only)
Model

FCC Identification

HBCS-6l00 through -61XX

FCC ID: CUPSZ9HBCS-6100
HEWLETT-PACKARD

HBCS-6300 through -63XX

FCC 10: CUP6Z9HBCS-6300
HEWLETT-PACKARD

HBCS-6500 through -65XX

FCC 10: CUP6Z9HBCS-6500
HEWLETT-PACKARD

HBCS-SOOO through -5XXX

FCC 10: CUP6Z9HBCS-5000
HEWLETT-PACKARD

HBCS-5l00 through -51XX

FCC 10: CUP6Z9HBCS-5l00
HEWLETT -PACKARD

FCC 10: CUP6Z9HBCS-S200
HBCS-5200 through -52XX
HEWLETt-PACKARD
HBCS·5300 through -S3XX

FCC 10: CUP6Z9HBCS·5300
HEWLETT-PACKARD

HBCS·5400 through -54XX

FCC ID: CUP6Z9HBCS-5400
HEWLETt-PACKARD

HBCS'5500 through -5SXX

FCC 10: CUP6Z9HBCS-5S00
HEWLETT-PACKARD

Interface

'---..
0 O~~"
~ =-.j

This equipment generates radio frequency energy and if
not installed and used properly, may cause interference to
radio and television reception. It has been type tested and
found to comply with the limits for a Class B computing
device in accordance with the specifications in Subpart J of
Part 15 of FCC Rules, which are designed to provide
reasonable protection against such interference, However,
there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause interference to radio or television reception, which can be
determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient the receiving antenna
• Relocate the wand with respect to the receiver
• Move the wand away from the receiver
If necessary, the user should consult the dealer or an
experienced radio/television technician for additional suggestions. The user may find the following booklet prepared
by the Federal Communications Commission helpful: "How
to Identify and Resolve Radio-TV Interference Problems".
This booklet is available from the U.S. Government Printing
Office, Washington, D.C. 20422, Stock No. 004-00345-4.

-----,r---------,
SHIELD

I

I

Vs (1)

59(2.3)

HBCS·5XXX

WAND

ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE

SYSTEM INTERFACE

®TRANSZORB IS A REGISTERED TRADEMARK OF GENERAL
SEMICONDUCTOR INDUSTRIES. TEMPE AZ.

Figure 5. Recommended Logic Interface (When earth ground is
not available, connect shield to logic ground, as shown
by dotted line).

HBCS-6XXX
NOTES:
1. DIMENSIONS IN MILLIMETRES AND (INCHES).
PIN

WIRE COLOR
RED

Vs SUPPLY VOLTAGE

WHITE

Va OUTPUT
GROUND

BLACK
N/A
N/A
CASE

N/C
N/C

The wands include a standard 5 pin, 240 0 DIN connector.
The detailed specifications and pin-outs are shown in Figure 4. Mating connectors are available from RYE Industries
and SWITCHCRAFT in both 5 pin and 6 pin configurations.
These connectors are listed below.
Connector

SHIELD (MUST BE
CONNECTED)

Figure 4. Connector Specifications.

5 Pin

SWITCHCRAFT 61GA5F*

5Pin

SWITCH CRAFT 61HASF

5 Pin

RYE MAS-6'

6Pin

SWITCHCRAFT 61HA6F

6Pin

'Suitable for non-locking connector only.

2-10

Configuration

RYE MAS-S'

--------------------

.

- -----------------

Maintenance Considerations
There are no user serviceable parts inside the wand. The tip
is designed to be easily replaceable, and if damaged it
should be replaced. Before unscrewing the tip, disconnect
the. wand from the system power source. The part number
for the wand tip is HBCS-2999 for the HBCS-5XXX family
and HBCS-4999 for the HBCS-6XXX family. The tips can be
ordered from any Hewlett-Packard authorized distributor.

Figure 5A. HBCS-2999 Sapphire Tip

II>

optional Features

Figure 5B. HBCS-4999 Sapphire Tip

For options such as special cords, connectors or labels,
contact your nearest Hewlett-Packard sales office or authorized representative.

Wand Dimensions
l
m:::'":''-:.:)¥J ~t::=1===::l>

231o.91



Scanner Input,Enable

Enables Data Acquisition from Scanner

Software

Enabled

la
<>

Single Read Mode

E,!"l~b!:s Requirement for a 'Next Read' Command

Software

Not Enabled

E
1:
0
Q
c:

'<

0

~
;i
c:

(/)

before/Processing the next Scanner Input Signal
Extended Code 39

Code Select

8
~
(ii

..

(/)

UPC/EANlJAN
Decoding Options

"D

Both

Code 39
Interleaved 2 of 5 Code
UPC/EAN/JAN Codes
Codabar
Code 128

Software

Code 39
Interleaved
2 of 5 Code
UPC/Et\-N/JAN
Codes
Codabar
Code 128

UPC/EANlJAN together; or UPC Only

Software

UPC/EANlJAN
together

Enable 2 or 5 Digit Supplements

Software

Supplements
Not Enabled

0

0

(/)

c:

~

Check Character
Verification Enable

Code 39 Check Character
Interleaved 2 of 5 Code Check Character

Software

No Check
Character
Verification

Coda bar Data
Transmission Option

Transmit or Suppress Start/Stop Characters

Software

Transmit

Interleaved 2 of 5
Label Length Check

User Defined from 4 to 32 Characters
or Variable Length

Software

Variable
Length

Baud Rate

1200,2400,4800,9600

Hardwire

1200

Parity

0'$, 1's, Odd, Even

Hardwire

O's

Stop Bits

1 or 2

Hardwire

1

CR, CR/LF, ETX, None

Hardwire

User Defined (10 Characters Max.)

Software

User Defined (10 Characters Max.)

Software

RTS/CTS

Harawire

,~
::s
E

Terminator Character

0

Header Character

E

0
S

.,

Both

CR
No Header
Character

c

Data Output Pacing

XON/XOFF

Software

...
~.
.s

Good Flead Beep Select

Enables Good Read Beep and sets 1 of 16 tones

Software

Beep Enabled;
Tone 12

Sound Tone

External Command to Initiate Beep Signal
in 1 of 16 tones

Software

N/A

LED Control

Defines LED Control to be Internal.
External, or both

Software

LED to Flash
Automatically
Upon Good Read

'li

.c

"D

11!


Q.

0

Eo Status Request
"''::'
1iic:
Hard Reset

q;{j

Gives Status of Decoder IC Configuration
Resets Decoder IC to Hardwire Configuration
and Default Software Settings

No Pacing

Software

NIA

' Software

N!A

NOTES:

9. Hardwire control is accomplished by tying the appropriate
input pins high or low. Software commands are sent by means
of escape sequences.

10. Default settings are those settings which result when the
relevant input pins have been tied to Ground and no software
commands have been senUo the decoder IC.

2-15

~:I
-

Pinout

BAUD{

VCc!+5V)

RATE

ADO

STOP BITS

AD1

CTS

AD2

AD3
LASER ENABLE OUTPUT

6

AD4

SCANNER TYPE INPUT

AD5

LASEA TRIGGER INPUT

AD6

RESET

AD7

ADDRESS
AND DATA
BUS

Rx.o

+5V

TxD

ADDRESS LATCH ENABLE

NC

SCANNER SIGNAL INPUT

CODE 39 CHECK CHARACTER

LASER SYNCHRONIZATION INPUT

EXTENDED CODE 39

LED OUTPUT
BEEPER OUTPUT

TO RAM

} TERMINATOR

CHIP{~
RD

} PARITY

XTAl2
XTAL 1

A9 } TO RAM CHIP
A8

VSS(GNDJ

Figure 1.

Block Diagrams
DECODER IC TO MEMORY
8185 MULTIPL.EXED 1K x 8 RAM

1K x 8 RAM WITH ADDRESS LATCH CHIP
,......----,
ADDRESS CONTROL

ADDRESS
CONTROL
DATA

MK4801
OR
SIMILAR

DECODER

IC
ADDRESS

CONTROL

74LS373

DATA

DECODER
IC

8185
OR
SIMILAR

ADDRf'SS
CONTROL

DATA

Figure 3.

Figure 2.

Scanner compatibility
The HBCR-2000 is compatible with the complete line of
Hewlett-Packard digital wands, Hewlett-Packard digital slot
readers, and hand-held laser scanners manufactured by
both Symbol Technologies, Inc. and Spectra Physics, Inc.

ink. smearing, spots and voids, or other minor print flaws,
the wands which specify a recommended nominal narrow
element width of 0.3 mm (0.012 in.) or 0.33 mm (0.013 in.)
are recommended.

The selection of Hewlett-Packard digital wands available for
use with the HBCR-2000 is presented in Table 2. For the two
families of sapphire-tip digital wands, the most widely used
wands are those which specify a recommended nominal
narrow element width of 0.19 mm (0.0075 in.). These wands
are capable of reading bar codes printed with a variety of
different printers and over a wide range of printed resolutions
(as specified by narrow element Widths) and are, therefore,
considered to be general-purpose wands. The higher resolution wands, with a recommended nominal narrow element
of 0.13 mm (0.005 in.), are recommended for applications in
which only high resolution bar codes are being read. For
applications which require a scanner to read medium or low
resolution bar codes, particularly those with edge roughness,

The Hewlett-Packard slot readers and slot reader modules
which are available for use with the HBCR-2000 are presented in Table 3. The standard slot readers have a slot
width of 3.2 mm (0.125 in.) and are, therefore, capable of
reading bar codes. on anything from paper to doublelaminated badges. For applications which require a different
slot width or which require a fixed-beam scanner in an
automated system, a module which contains the slot reader
optics and electronics assembly is also available.
The hand-held laser scanners compatible with the HBCR2000 include the Symbol Technologies' LS7000, Symbol
Technologies' LS7000 II, and Spectra Physics' SP2001. For
detailed information on these scanners, please contact these
companies directly.

2-16

TABLE 2. HEWLETT-PACKARD DIGITAL BAR CODE WANDS

Part Number

~
..J

~:c

Open

No

I

~n:DS-3200

820nm

I

35 ma

I

Yes

I
I
Sapphire
Ball

HEDS-3250
HBCS-2300
HBCS-4300
HBCS·2400

:e~

HBCS-5200

I

I

I

I

I

0.19mm
(0.0075 in.)

700nm

0-45°

42 ma

Polycarbonate

Yes

I
I

I
I

I
I

I
I

I

No

Metal

I

I
I

O.i3mm
(O.OOS in.)

820mm

I

I

Polycarbonate

Yes

I

I
I

I
I

I
I

I
I

I

No

Metal

I

I
I

O.33mm
(0.013 in.)

655nm

0-45'

3.5ma

Polycarbonate

Yes

I
I

I
I

I
I

I
I

I

No

Metal

I

I
I

0.19 mm
(0.0075 in.)

I

I

I

Polycarbonate

Yes

I

I
I

I
I

I
I

I

No

I

Metal

I

I

820mm

I

I

Polycarbonate

Yes

I

I

I
I

I
I

I

No

Metal

I

I
I

HBCS-5300

I

I

HBCS-5400

0.13mm
(0.OO5In.)

HBCS-5500
HBCS-6500

0

No

HBCS-6300

::J

~
..J

Yes

I

HBCS-6100

~

ABS Plastic

I

HBCS-5i00

0

42 ma

I

t:.

III

0-30

I

HBCS-5000

8:
' This pulse train will typically settle
to a final value within 5 ms.
The recommended logic interface for the wands is shown in
Figure 9. This interconnection provides the maximum ESD
protection for both the wand and the user's electronics.

The wands provide a case, cable, and connector shield
which must be terminated to logic ground or, preferably, to
both logic ground and earth ground. The shield is connected to the metal housing of the 5 pin DIN connector.

Electrical Characteristics
(Vs

= 4.5V to 5.5V, TA = 25° C,

RL

= 1Kfl to 10Kfl, unless otherwise noted)

Parameter
Supply Current

Symbol
Is

High Level Output Current

IOH

Low Level Output Voltage

VOL

Output Rise Time

Min.

Typ.

Max.

Units

42

50

mA

Vs =5.0V

400

}JoA

VOH =2.4V
IOL= 16 mA

Notes
4

0.4

V

tr

3.4

20

jlS

20

}JoS

5.0

ms

5

kV

6

tf

1.2

Switch Bounce
HBCS-2200/2400

tsb

0.5

Electrostatic Discharge Immunity

ESD

25

Output Fall Time

Conditions

10%-90%
Transition
RL= 1K

Notes:

4. Push-to-read switch (if applicable) is depressed.
5. Switch bounce causes a series of sub-millisecond pulses to appear at the output (Vo).
6. Shield must be properly terminated (see Figure 9). The human body is modeled by discharging a 300 pF capacitor through a 500
resistor. No damage to the wand will occur at the specified discharge level.

Block Diagram
HBCS-2300/2500
(without Switch)

HBCS-2200/2400
(with Switch)

2-28

n

Scanning Performance
(Vs

= 5.0 V, RL = 1.0 to 10 Kn, T A = 25° C, Scan Velocity = 50 cm/sec)
Symbol

Parameter
Decodability Index

01
Average Width Error
(Narrow Bars)
OSbn

Average Width Error
IWide Bars)
OSbw

Average Width Error
(Narrow Spaces)

Average Width Error
(Wide Spaces)

Deviation from Average
IInternall

Deviation from Average
(First Bar)

OSsn

HBCS-

Typ.

Max.

Units

2200/2300

9

22

%

2400/2500

12

22

%

2200/2300

0.005
10.0002)

mm
lin)

2400/2500

0.024
10.0009)

mm
lin,)

2200/2300

0.003
10.0001)

mm
lin.)

2400/2500

0.023
(0.009)

mm
(in,)

2200/2300

-0.011
1-0.0004)
-0.027
H).0106)

mm
lin.)
mm
lin.)

-0.002
(-0.0001)
-0.026
(-0.0010)

mm
lin.)
mm
(in.)

2400/2500
2200/2300

OSsw

2400/2500
2200/2300

0.018
10.0007)

0.048
(0.0019)

mm
lin.1

2400/2500

0.019
10.00071

0.052
(00020)

mm
lin.i

2200/2300

0.090
10.0035)

0.152
(0.0060)

mm
lin.)

2400/2500

0.060
10.0024)

0.100
(0.0039)

mm
lin.)

de

db,

Condition

Fig.

Note

1,2,3
4,7.9

7,8

1,2,9

7

1,2,5
6,9

7

Tilt Angle 0° to 40°
Preferred Orientation
Standard Test Tag

Notes:
7. The test tag for the HBCS-2200/2300 Wands IFigure 2a) consists of black bars and white spaces with a narrow element width of 0.19 mm
(0.0075 in.) and a wide element width of 0.42 mm (0.0165 in.l. This equates to a wide-to-narrow ratio of 2.2:1. A margin, or white reflecting
area, of at least 5 mm in width precedes the first bar.
The test tag for the HBCS-2400/2500 wands (Figure 2bl consists of black bars with a narrow element width of 0.13 mm (0.005 in.! and
wide element width of 0.43 mm (0.017 in.1 giving a ratio of 3.4:1. The white spaces have a narrow element width of 0.28 mm (0.011 in.1 and
wide element width of 0.64 mm 10.025 in.! yielding a ratio of 2.3:1. Both tags are photographically reproduced on diffuse reflecting paper
with a PCS greater than 90%.
8. Oecodability index is a measure of the errors produced by the wand when scanning a standard test symbol at a constant velocity. It is
expressed as a percentage of the narrow element width.
For a more detailed discussion of the terms used here, see Hewlett-Packard Application Note 1013 "Elements of a Bar Code System"
(publication number 5953-93871.

HBCS-22/2400

HBCS-23/2500

a. HBCS-22/2300 Test Tag

b. HCBS-24/2500 Test Tag

Figure 2. Standard Test Tag Formats
(Test Tags Enlarged to Show Detail)

Figure 1. Preferred Wand Orientation

2-29

Typical Performance Curves
(Vs

= 5 V.

RL = 1 K!l. TA = 25° C. Tilt = 15°. VSCAN

= 50 cm/sec unless otherwise specified)

25

*'I

25

0

*'I

15

;!;

UJ

o

;!;

>f-

-

....... r-_

:::;

~

20

~
a

X

HBCS-2400/2500

1---

........ r-_

10

8

UJ

o

-

HBCS-220012300

I

15

>f:::;
iii

f-

a

VSCAN -

Figure 5. Deviation from Average Width Error
vs. Supply Voltage.

*'I

db, _

>

0

a:

-_.

ffi

I
f-

db;

HBCS.2200/2300

---

I

HBCS-2400/2500

f-

~---

:r

----

I
HBCS-2200/230Q

iii

:r

'---l'-.e-'o-.e-9)-]-~

-_--..IUmm=

<1""",--11
-r-

L

:J t

J~

13.3 (0.52) PIA.

PIMENSIONS IN
MILLIMETRES AND (INCHES)

~c=fJJIh~

I~~O(8.oo)-----1r-1806!7~O)~~-----~
I
300 02.00)

230 '9.00)

2-32

\

790

(31.001

~

Applications
The digital bar code wand is a highly effective alternative to
keyboard data entry. Bar code scanning is faster and more
accurate than key entry and provides far greater throughput.
In addition, bar code scanning typically has a higher first
read rate and greater data accuracy than optical character
recognition. When compared to magnetic stripe encoding,
bar code offers significant advantages in flexibility of media,
symbol placement and immunity to electromagnetic fields.

Hewlett-Packard's industrial bar code wands are designed for
use in applications which require the added ruggedness and
durability that a metal wand can provide. In addition, the
sapphire ball provides superior wear resistance and improves
scanning ease. The rugged yet lightweight aluminum case
makes these wands ideal for use in heavy industrial and
LOG MARS applications such as: shop floor data collection,
work-in process tracking, material tracking, and repair/service work.

~:I
-

Recommended operating Conditions
Parameter

Symbol

Nominal Narrow Element Width
HBCS-4300
HBCS-4500

Min.

Max.

Units

0.19 (0.0075)

mm (in.)

0.13 (0.005)

mmOn.1

Scan Velocity

VSCAN

7.6 (31

Contrast

Rw-RB

45

Supply Voltage

Vs

4.5

Temperature

TA

-20

Notes

127 (50)

cm/sec On/secl
%

1

5.5

Volts

2

+65

°C

Tilt Angle

(See Figure 8)

Orientation

(See Figure 11

3

Notes:
1. Contrast is defined as Rw-Rs where Rw is the reflectance of the white spaces and Rs is the reflectance of the black bars, measured at the
emitter wavelength 1700 nm or 820 nml. Contrast is related to print contrast signallPCSI by PCS = IRw-RsI/Rw or Rw-Rs = PCS·Rw.
2. Power supply ripple and noise should be less than 100 mV peak to peak.
3. Performance in direct sunlight will vary depending on shading at the wand tip.

Absolute Maximum Ratings
Parameter

Symbol

Min.

Max.

Units

Storage Temperature

Ts

-40

+75

°C

Operating Temperature

°C

TA

-20

+65

Supply Voltage
HBCS-4300

Vs

-0.5

+6.00

V

HBCS-4500

Vs

-0.5

+5.75

V

200

mW

-0.5

+20

V

Output Transistor Power

PT

Output Collector Voltage

Vo

Notes

2-33
--------------------_._------

Electrical Operation
The wands provide a case, cable, and connector shield
which must be terminated to logic ground or, preferably, to
both logic ground and earth ground. The shield is connected to the metal housing of the 5 pin DIN connector.

The HBCS-4XXX family of digital bar code wands consists
of a precision optical sensor, an analog amplifier, a digitizing circuit, and an output transistor. These elements provide
a TTL compatible output from a single 4.5V to 5.5V power
supply. The open collector transistor requires a pull-up
resistor for proper operation.

The shield must be properly terminated otherwise it will act
as an antenna, injecting electrical noise into the wand cir~
cuitry. Grounding the shield will also provide a substantial
improvement in EMIIESD immunity.

A non-reflecting black bar results in a logic high (1) level
output, while a reflecting white space will cause a logic low
(0) level output. The initial or "wake-up" state will be indeterminate. However, after a short period (typically less than
1 second), the wand will assume a logic low state if no bar
code is scanned. This feature insures that the first bar will
not be missed in a normal scan.

The recommended logic interface for the wands is shown in
Figure 9. This interconnection provides the maximum ESD
protection for both the wand and the user's electronics.

Electrical Characteristics
(Vs = 4.5V to 5.5V, T A = 25° C, RL = 1Kn to 10Kn, unless otherwise noted)
Parameter
Supply Current
High Level Output Current
Low Level Output Voltage

Typ.

Max.

Units

42

50

mA

Vs

5.0V

IOH

400

itA

VOH

=2.4V

VOL

0.4

V

Symbol
Is

Min.

Output Rise Time

tr

3.4

20

)J.S

Output Fall Time

tf

1.2

20

itS

ESD

25

Electrostatic Discharge Immunity

kV

Conditions

IOL = 16 mA
10%-90%
Transition
RL= 1K

Notes

'4

Notes:

4. Shield must be properly terminated (see Figure 3). The human body is modeled by discharging a 300 pF capacitor through a 500 n
resistor. No damage to the wand will occur at the specified discharge level.

Block Diagram

2-34

-~---

...

-----~-- .. -~-------

scanning Performance
IVs

= 5.0 V, RL = 1.0 to 10 Kn,

Parameter
Decodability Index

Average Width Error
INarrow Bars)

Average Width Error
IWide Bars)

Average Width Error
(Narrow Spaces)

TA

= 25° C, Scan

Symbol

HBCS-

01

4300

aSbn

aSbw

aSsn

as sw

Deviation from Average
iFirst Bar)

de

db1

Max.

Units

Fig.

Note

%

1,2,3

5,6

%

4,5,8

9

4500

12

22

4500

0.005
10.0002)

mm
lin.)

4500

0.024
10.0009)

mm
lin.)

4300

0.003
10.0001)

mm
(in.l

4500

0.023
(0.0009)

mm
(in.l

4300

-0.011
1-0.0004)
-0.027
Hl.0106)

mm
lin.)
mm
(in.l

-0.002
1-0.0001 )
-0.026
1-0.0010)

mm
lin.)
mm
iin.l

4300
4500

Deviation from Average
!Internal)

Typ.

22

4500
Average Width Error
(Wide SpaceS)

= 50 em/sec),

Velocity

4300

0.Q18
iO.OOO71

0.048
10.0019)

mm
lin.)

4500

0.019
iO.OOO71

0.052
(0.00201

mm
lin.l

4300

0.090
(0.0035)

0.152
iO.00601

mm
lin.)

4500

0.060
10.0024)

0.100
10.0039)

mm
lin.l

Condition

Tilt Angle 0° to 40°
Preferred a rientation
Standard Test Tag

1,2,3

5

1,2,3
6,7

5

Notes:
5. The test tag for the HBCS-4300 Wands IFigure 2a) consists of black bars and white spaces with a narrow element width of 0.19 mm
10.0075 in.) and a wide element width of 0.42 mm 10.0165 in.). This equates to a wide-to-narrow ratio of 2.2:1. A margin, or white
reflecting area, of at least 5 mm in width precedes the first bar.
The test tag for the HBCS-4500 wands IFigure 2bl consists of black bars with a narrow element width of 0.13 mm 10.005 in.1 and wide
element width of 0.43 mm 10.017 in.! giving a ratio of 3.4:1. The white spaces have a narrow element width of 0.28 mm 10.011 in.! and wide
element width of 0.64 mm '10.025 in.! yielding a ratio of 2.3:1. Both tags are photographically reproduced on diffuse reflecting paper with
a PCS greater than 90%.
6. Decodability index is a measure of the errors produced by the wand when scanning a standard test symbol at a constant velocity. It is
expressed as a percentage of the narrow element width.
For a more detailed discussion of the terms used here, see Hewlett-Packard Application Note 1013, "Elements of a Bar Code System"
Ipublication number 5953-93871.

a. HBCS-4300 Test Tag

b. HBCS-4500 Test Tag

Figure 2. Standard Test Tag Formats
(Test Tags enlarged to show detail)

Figure 1. Preferred Wand Orientation

.. - . _...

2-35
_---_._-_._-- ...- - - - - ..

--.--.-.-.---.----.~-.--~------

Typical Performance Curves
(Vs = 5.0 V, RL = 1.0 to 10 Kn, TA = 25° C, Tilt = 15°C, VSCAN = 50 cm/sec, unless otherwise specified).
25

*I

25

20

*I

X

";:;

>
>:;

iii


--

15

>-

:;
iii
-

;;"

0.080

>
-

120

;;;

Vs - SUPPLY VOLTAGE - VOLTS

>

100

0.060

z
o
;:::

"

*I

80

g
~
o

ALL WANDS-::;;-;;;;-::

60

0.100

I-

db,

0

0

40

Figure 4. Decodability Index vs. Scan Velocity

0.140

a:
a: 0.100
w

20

VSCAN - SCAN VELOCITY - em/sec

Figure 3. Decodability Index vs. Supply Voltage

:;

I--

Ci

o

'"a:

---

~ ~ .....- .....

10

-----

E
I

----

HBCS·4500

!i:

"W
0.5
"~ (0.02)

----

HBCS·4300

1.0
(0.04)

J:

z

Ci

o
-40

-20

20

40

60

80

10

e-

TA - TEMPERATURE -"C

Figure 7. Decor' ability Index vs. Temperature

20

30

40

TILT ANGLE - DEGREES

Figure 8. Wand Height vs. Tilt Angle

2-36

50

--------------------------------------- -------------------------

------, r -

-

-

I
I

SHIELD

-

-

-

-

Mechanical Considerations

--,

Vs (1)

The wands include a standard 5 pin, 240 0 , metal, locking DIN
connector. The detailed specifications and pin-outs are
shown in Figure 10. Mating connectors are available from
SWITCH CRAFT in both 5 pin and 6 pin configurations.
These connectors are listed below.

Connector
WAND

ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE

SYSTEM INTERFACE

®TRANSZORB IS A REGISTERED TRADEMARK OF GENERAL
SEMICONDUCTOR INDUSTRIES, TEMPE AZ.

Figure 9. Recommended- Logic Interface (When earlh ground is
not available, connect shield to logic ground, as shown by dotted
line).

Configuration

SWITCH CRAFT 61 HA5F

5 Pin

SWITCHCRAFT 13EL5F

5 Pin

SWITCH CRAFT 61 HA6F

6 Pin

Maintenance Considerations
There are no user serviceable parts inside the wand. The tip
is deSigned to be easily replaceable, and if damaged it should
be replaced. Before unscrewing the tip, disconnect the wand
from the system power source. The part number for the wand
tip is HBCS-4999. The tip can be ordered from any HewlettPackard authorized distributor.

NOTES:
1. DIMENSIONS IN MILLIMETRES AND (INCHES).
PIN

WIRE COLOR

FUNCTION

REO

Vs SUPPLY VOLTAGE

2

WHITE

Vo OUTPUT

3

BLACK

GROUND

4
5

N/A
N/A

N/C

CASE

Figure 11. Sapphire Tip.

optional Features

N/C
SHIELD (MUST BE
CONNECTED)

For options such as special cords, connectors or labels, contact your nearest Hewlett-Packard sales office or authorized
Hewlett-Packard distributor.

Figure 10. Connector Specifications.

2-37

._-------------..------- - - - - - - - - - - - - - - -

Flin-

a!a

DIGITAL
BAR CODe WAND

HEWLETT
PACKARD

HEDS-3000
HEDS~3050

TECHNICAL DATA

JANUARY 1986

Features
• 0.3 mm RESOLUTION
Enhances the Readability of dot matrix printed
bar codes
• DIGITAL OUTPUT
Open Collector Output Compatible
with TTL and CMOS
• PUSH-TO-READ SWITCH (HEDS-3000)
Minimizes Power in Battery
Operated Systems
• SINGLE 5V SUPPLY OPERATION
• ATTRACTIVE, HUMAN ENGINEERED CASE
• DURABLE LOW FRICTION TIP
• SOLID STATE RELIABILITY
Uses LED and IC Technology
• SHIELDED CASE AND CABLE (HEDS-3050)
Maximizes EMI/ESD Immunity in AC
Powered Systems

Description
The HEDS-3000 and HEDS-3050 Digital Bar Code Wands
are hand held scanners designed to read all common bar
code formats that have the narrowest bars printed with a
nominal width of 0.3 mm (0.012 in.). The wands contain an
optical sensor with a 700 nm visible light source, photo IC
detector, and precision aspheric optics. Internal signal
conditioning circuitry converts the optical information
into a logic level pulse width representation of the bars
and spaces.
The HEDS-3000 comes equipped with a push-to-read
switch which is used to activate the electronics in battery
powered applications requiring lowest power consumption. The HEDS-3050 does not have a switch, and features
internal metal shielding that maximizes immunity to

electromagnetic interference, electrostatic discharge,
and ground loops in AC powered systems. Both wands
feature a strain relieved 104 cm (41 in.) cord with a ninepin subminiature D-style connector.

Applications
The Digital Bar Code Wand is an effective alternative to
the keyboard when used to collect information in selfcontained blocks. Bar code scanning is faster than key
entry and also more accurate since most codes have
check-sums built-in to prevent incorrect reads from being
entered.
Applications include remote data collection, ticket
identification systems, security checkpoint verification,
file folder tracking, inventory control, identifying assemblies in service, repair, and manufacturing environments,
and programming appliances, intelligent instruments and
personal computers.

wand Dimensions
HEDS-30S0

HEDS-3000
PUSH-TO-READ

2310.9)..,

SWITCH~

•

r--+ 22 (0.9)
i

I

23tO.9).

1~~210.9)

C~I'I--~I.~~,,~~r.~=.~"lnl~~==
I

1---~13315.21----1-~1-1050 141.0)
0"""'-1
'!:::t::J=~
-.U::::=:=======U2~~::TO.8)
I

-----rl

=mOll
I ,

2-38

I

'i

--------------

Electrical Operation

electronic circuitry. When the switch is initially depressed,
its contact bounce may cause a series of random pulses to
appear at the output, Yo. This pulse train will typically
settle to a final value within 0.5 ms. This initial pulse train is
eliminated when a switchless HEDS-3050 is used.

The HEOS-3000 and HEOS-3050 consist of a precision
optical sensor, an analog amplifier, a digitizing circuit, and
an output transistor. These elements provide a TTL compatible output from a single voltage supply range of 3.6V
to 5.75V. A non-reflecting black bar results in a logic high
(1) level, while a reflecting white space will cause a logic
low (0) at the Vo connection (pin 2). The output of the
wands is an open collector transistor.

I~:-

Recommended Operating
Conditions

The HEOS-3050 provides a case and cable shield (pin 5)
which must be connected to logic ground and preferably
also to earth ground. This will provide a substantial
improvement in EMI/ESO immunity for the wand in AO
powered systems.
The recommended logic interface for the wands is shown
in Figure 3. This interconnection provides maximum ESO
protection for both the wand and the user's electronics.
The HEOS-3000 incorporates a push-to-read switch
which is used to energize the 700nm LED emitter and

':Parameter

Symbol

Min.

Bar Width

s.b

0:3

Selin Velocity

Vscqn

7:6

Oontrast

-

Max.

Units

76

cm/s

mm
%

PCS

70

Supply Voltage

Vs

3.6

5::75

V

Temperature

TA

0

55

"C

See Figure 1

Orientation

Absolute Maximum Ratings
Parameter

Symbol

Min.

Mal(.

Units

Ts

-20

55

"0

0

55

"0

Vs

-0.5

6.0

V

200

mW

20

V

Storage Temperature
Operating Temperature
Supply Voltage
Output Transistor Power
O!;ltput 9~Uector Voltage

Vo

Electrical Characteristics
Parameter

Symbol

Switch Bounce(HEDS'3000'

tsh

High Level Output Current

IOH

Low Level Output Voltage

VOL

Min.

Notes

2

(Vs = 3.6V to 5.75V at TA = 25"0, RL = 2.2kO,unless otherwise noted)

Typ.

Max. Units

0.5

5

ms

400

J.LA

V

0.4

Fig.

Conditions

3
VOH '" 2.4V, Bar Condition (Black)

3

IOL "" l6mA, Space Condition (White)

3

Output Rise Time

Ir

2

J.LS

10%-90% Transition

3

Output Fall Time

tf

100

.os

90%-10% Transition

3

Supply Current

Is

42

rnA

Vs = 5V, Bar Condition (Black)

50

Notes

2,4

Block Diagram

H

HEDS-3g00
(WITH SWITCH)

HEDS-3050
(SHIELDED)

'''IT''~

KJ

- r ~D; ;PT; ;IC:; A;=L~E::S====;::]N.r~
r~~~1-V'-=~;~~:r~lIL
~
~ ~
JIi
SENSOR

DIGITIZER

2-39

+

...r-::- V• IW

Vo (21

GNO(7J
SHlELD!S)

GUARANTEED WIDTH ERROR PERFORMANCE
(Vs = 5V, TA = OOG to 55°G, RL = 2.2kfl,unless otherwise noted)
Parameter

Symbol

1st

il.bl

Interior

t.b

Interior

As

Bar
Width
Error

Min.

-0.04 (-1.41
-0.05 (-2.01

0.04(1.41

Space
Width
Error

Tag Scan Velocity

O.OS 12.01

Vscan

Emitter Peak
Wavelength

Typ.

Max.

0.08 (3.2)

0.13/S.2)

0.10 (3.8)

0.15 (5.71

O.OS (1.8)

0.10 (3.9)

Bar
Width
Error

Space
Width
Error

Symbol
To

Margin

1st

Is

lb

2s

lb

mm

il.bl
t.b ,~,
Ab2-1

Conditions
TA=25°C
Margin 2: 5mm
TA =
0° to 55°e Height = 0.2Smm
Tilt = D·
Vscan = 50 cm/s
TA=2Soe

Fig. Noles
1
2,6
11

5
7,8
9,10
11

1.2
6,11

6.7
8,9
10,11

Standard Test Tag
(in.xl0·3 ) TA=
Preferred Orientation
o· to 55°e
b=s=0.3mm (0.012 in.)
1,2
TA=2SoC 2b=2s=0.6mm
-0.05 (-1.8) -0.10 (-3.91
mm
6,11
(0.024 in.)
3
(in.xl0· )
-0.05 (-2.0) -0.111-4.3)
TA=
0° to 5Soe
0.0512.0)

0.11 (4.3)

76

7.6

cm/s

nm

TYPICAL WIDTH ERROR PERFORMANCE

From

mm
(in.xl0-3)

700

A

Parameter

Units

Typical WE
Tilt = O'
Height = 0.2Smm

9

6,7
8,10
11
7

TA=2SoC

(Vs = 5V, TA = 25°G, RL = 2.2kfl,unless otherwise noted)

Typical WE
Tilt = 30°
Height = O.Omm

Units

0.08 (3.2)

0.11 (4.2)

mm
Un.xl0-3 )

1,2

5,7,8

0.03 (1.21

0.04 (1.6)

mm
Iin.xl0·3)

1,2

6.7,8

0.07 (2.9)

mm
(in.xl0·3)

1,2

6,7,8

1,2

6,7,8

1,2

6,7,8

1,2

6,7,8

0.0612.51

Conditions

Margin 2: Smm
1b=1 s=0.3mm
2b=2s=0.6mm
TA=25°e
Vs=5V
vscan=SOcm/s
Preferred Orientation
Standard Test Tag

Fig. Notes

Is

2b

Abl~2

0.02 (0.9)

0.02 (0.7)

mm
(in.xl0·3 )

2s

2b

Ab2~2

0.05 (1.9)

0.05 (2.11

mm
(in.x10·3)

1b

Is

il.Sl~l

-0.04 (-1.4)

-0.04 (-1.4)

mm
(in.xl0·3)

2b

1s

t.S2~1

-0.03 (-1.0)

-0.03 H.l)

mm
(in,xl0· 3 )

1,2

6,7,8

1b

2s

~Sl-2

-0.07 (-2.71

-0.08 (-3.3)

mm
(in.xl0·3 )

1,2

6,7,8

2b

2s

AS2~2

-0.06 (-2.4)

-0.06 (-2.4)

mm
(in.xl0-3 )

1,2

6,7,8

Notes:
1. Storage Temperature is dictated by Wand case.
2. Power supply ripple and noise should be less than 100 mV.
3. Switch bounce causes a series of sub-millisecond pulses to
appear at the output, Va. (HEDS-3000 only)
4. Push-to-Read switch is depressed, and the Wand is placed on
a non-reflecting (black) surface. (HEDS-3000 only)
S. The margin refers to the reflecting (white) space that preceeds
the first bar. of the bar code.
6. The interior bars and spaces are those which follow the first
bar of bar code tag.

7. The standard test tag consists of black bars, white spaces (0.3
mm, 0.012 in. min.) photographed on Kodagraph Transtar
TCS@ paper with a print contrast signal greater than 0.9.
8. The print contrast signal (peS) is defined as: PCS = (Rw - Rb)
IR w , where Rw is the reflectance at 700 nm from the white
spaces, and Rb is the reflectance at 700nm for the bars.
9. 1.0 in. = 2S.4 mm, 1 mm = 0.0394 in.
10. The Wand is in the preferred orientation when the surface of
the label is parallel to the height dimension of the bar code.

2-40

---_._-_._._-_...

OPERATION CONSIDERATIONS
The Wand resolution is specified in terms of a bar and
space Width Error, WE. The width error is defined as the
difference between the calculated bar (space) width, B,
(S), and the optically measured bar (space) widths, b (s).
When a constant scan velocity is used, the width error can
be calculated from the following.
B =
S =
.:lb=
.:ls =

tb'
ts'
BS-

Vscan
Vscan
b
s

orientation (Figure 1). tilted at an angle of 10' to 20', and
the Wand tip is in contact with the tag. The Wand height,
when held normal to the tag, is measured from the tip's
aperture, and when it is tilted it is measured from the tip's
surface closest to the tag. The Width Error is specified for
the preferred orientation, and using a Standard Test Tag
consisting of black bars and white spaces. Figure 2
illustrates the random two level bar code tag. The
Standard Test Tag is photographed on Kodagraph
Transtar TC5® paper with a nominal module width of
0.3 mm (0.012 in.) and a Print Contrast Signal (PCS) of
greater than 90% .

Where
.:lb, .:ls= bar, space Width Error (mm)
b, s = optical bar, space widtl) (mm)
B, S = calculated bar, space width (mm)
Vscan = scan velocity (mm/s)
tb, ts = wand pulse width output(s)
The magnitude of the width error is dependent upon the
width of the bar (space) preceeding the space (bar) being
measured. The Guaranteed Width Errors are specified as a
maximum for the margin to first bar transition, as well as,
maximums and minimums for the bar and space width
errors resulting from transitions internal to the body of the
bar code character. The Typical Width Error Performance
specifies all possible transitions in a two level code (e.g. 2
of 5). For example, the .:lb 2_ 1 Width Error specifies the
width error of a single bar module (0.3 mm) when
preceeded by a double space module (0.6 mm).

BAR WIDTH 0.3 mm (0.012 in.) BLACK & WHITE
RWHITE;;;t 75%,PCS> 0.9 KODAGRAPH TRANSTAR Te5 e PAPER

Figure ... Standard Test Tag Format.

The Bar Width Error .:lb, typically has a positive polarity
which causes the calculated bar, B, to appear wider than
its printed counterpart. The typical negative polarity of the
Space Width Error .:ls, causes the measured spaces to
appear narrower. The consistency of the polarity of the
bar and space Width Errors suggest decoding schemes
which average the measured bars and measured spaces
within a character. These techniques will produce a higher
percentage of good reads.

PUSH-TO-READ

Ir

-

-

-

-

-

I

Vs 19)

...L.

-

-

-

®TRANSZORB IS A REGISTERED
TRADEMARK OF GENERAL
- , SEMICONDUCTOR INDUSTRIES.
I TEMPE AZ.
I
+5V

- - - - 0 o-~~--<~~-~~~~~~~~~

+ I®TRANSZORB
I P6KE 7.5C

4.7pF

I 13

EAC~oI2)

GNDI7)

The Wand will respond to a bar code' with a nominal
module width of 0.3 mm when it is scanned at tilt angles
between D· and 30'. The optimum performance will be
obtained when the Wand is held in the preferred

-=

- - - - - - - ' L _________ ~
ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE

HEDS-30DD

SYSTEM INTERFACE

Figure 38. Recommended Logic Interface for

==;;;:::;=;, r-- - - - - - - -

H~OS·3000

®TRANSZORB IS A REGISTERED
TRADEMARK OF GENERAL

~ ~i~~CEO~~UCTOR INDUSTRIES.

SHIELD

I

+
4.7pF

Vs 19)

I

+5V

I®TRANSZORB
I P6KE 7.5C
I 13

EAC~~12)

I
I
(
L _SHIELD
J!il _______
oJI

i

ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE

SYSTEM INTERFACE

:

HEDS-3D5D

HEDS-3000

GNDI71

HEDS-3050
Figure 3b. Recommended Logic InterfeCe for HEDS·3050.
(When earth ground is not availeble. connect shield
to logic ground. as shown by dotted line)

Figure 1. Preferred Wand Orientation.

2-41

Typical performance Curves (RL = 2.2kO)
0.15

0.15

,

I

0.10

"-

1/ .....

1ST BAR

0.05 ab, INTERNAL BAR
WIDTH ERROR

a:

~

a:
w

~

I

0

PREFERRED
DRI ENTATION
HEIGHT == 0.1 mm

...

vscan '" 50 cmls

-

STANDARD TAG

0.05

(O.3mm)
Vs = 5V
TA '" 25°C

"

I

0.10 0;;;;:;

a:
a:
a:
w

o

~

INiERN~L ~;;CE'"'- ...

iE

iE

"',:
WIDTH ERROR

I -0.05

~

I -0.05

w

;J:

.........

-0.10

-0.10

_~ST~AR

V

5'

VS.

as, :NTEIRNAIL

-

-5'

,

r--....

10" IS' 20' 25' 3D' 35'

Figure 5. Width Error

f-,
1ST BAR

1ST BAR

\

\

0.10

-

a:

~

-. ~

ffi

iE'
-0.05

;J:

-0,05

PREFERRED ORIENTATION
= 0'
vscan'" 50 cmls
STANDARD TAG (0.3 mml
TA = 25'C
Vs =5V

I --

l - I-

I-- -

-0,15

o

I

-0.10

-0.15

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

I

- t- TILT = 0'
vscan'= 50 emls STANDARD TAG (0.3 mm)
f-- ---crVs =5V
TA '" 25°C

o

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

~IJ,

~

I

iE

1ST BAR

I

0.05

~'-r

;J:

I-I--

I

ffi

o

OIRlE~TAiION I

HEIGHT'" 0.25 rom
Vs '" 5V
-I

-0.15

I I

plREFkRRkD

I

T

II

I

I

TILT
I

I

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

= 0°

I

I

I I

iE

I -0.05

T

TA '" 25°C

vscan'" 50 cmls
I

-.:. ..lb. INTERNAL BAR
WIDTH ERROR

i"Cl

As, INTERNAL SPACE WIDTH ERROR

I -0.05

w

-

a:

oa:

I I
I I

.....L

~

I I
I I

0.10

INTERNAL BAR WIDTH ERROR

;1

a:
w

0.15

lJTB1R

---

0.05

a:

f-

Figur.7. Width Error vs. Height (Any Orientation).

I I
I I

...

l-

h - HEIGHT - mm

Figure 6. Width Error vs. Height (Preferred Orientation).

0.10

-

-. ....

PREFERRED ORIENTATION

-

h - HEIGHT - mm

0.15

....
-.

_ SPACE WIDTH ERROR

;J:

f - f - TILT

\

~~

-~At

iE
~

\

IY
H' I

I

~

-

/

0.05 _ .lb, INTERNAL BAR
WIDTH ERROR

a:
w

I
~~~:~~~~~ bRR~R

-,

I I

0.15

"b, INTERNAL BAR WIDTH ERROR

~

Tilt (Any Orientation).

VIS.

\

./

./

..... ~ ~

0.05

-0.10

SP~CE

WIDTH ERROR

0- TILT - DEGREES

Tilt (Preferred Orientation).

0.15

-0.10

(0.3 mm)

BAR
WIDTH ERROR

10' IS' 20' 25' 3D' 35'

Figure 4. Width Error

~

50 cmls

STANDARD TAG

- .lb,IINT~RNAL I-- -~! :~~'C
L --t-""'
-+-l .......

8 - TILT - DEGREES

:sa:

VSC81'1=

-0.15

-0.15

0.10

HEIGHT'" 0.1 mm

./

-

I--

-

I-

-

I--

r

As, INTERNAL SPACE
WIDTH ERROR

-

-

~

-

-0.10

I

-0.15

1.0

PREFERRED ORIENTATION
TILT = 0'
HEIGHT;; 0.25 mm
STANDARD TAG (0.3 mml
TA ;; 25°C
Vs =5V

o w w

~

~

w w ro

M

vSC8n - SCAN VELOCITY - em!s

b, S - BAR. SPACE WIDTH - mm

Figur.8. Width' Error vs. Bar Width.

Figure 9. Width Error vs. Scan Velocity.

2·42

-

,---

-

I--

0.15

0.15

-

0.10

E
E
I

ffi
:I:
....0

1

STANDARD TAG (0.3 mm)

0.10

1ST BAR

I 0.05

db. INTERNAL BAR WIDTH ERROR

0

....0
3:

3:

I -0.05
w

""INTEIRNAIL SP f'CE IWIDTH E1RROR_

;:

PREFERRED ORIENTATION
TILT=O'- I-vscan = 50 emls
STANDARD TEST TAG (0.3 mm)
lTA = 25"

r-- HEIGHT = 0.25 mm

-0.10

-0.15

3.5

Figure

10. Width

lJBAk-

I

"'. INTERNAL SPACE WIDTH ERROR

;:

l - t--

Vs =5V

I

0

:I:

-0.10 I--

;m/.

db. INTERNAL BAR WIDTH ERROR

a:
0
a:
a:

w

I -0.05
w

"scan ~ 50

E
E

0.05

a:
0
a:

PREFERRED DRIENTATIDN
TILT=O'

HEIGHT'" 0.25 mm

4.0
4.5
5.0
Vs - SUPPLY VOLTAGE - V

5.5

-0.15

6.0

5' 10' 15' 20' 25' 30' 35' 40' 45' 50' 55'
TA - TEMPERATURE - 'c

Error vs. Supply Voltage.

Figure

11.

Width Error vs. Temperature.

MECHANICAL CONSIDERATIONS
The HEDS-3000/-3050 include a standard nine pin D-style
connector with integral squeeze-to-release retention mechanism. Two types of receptacles with the retention mechanism are available from AMP Corp. (Printed circuit
header: 745001-2 Panel mount: 745018, body; 66570-3,
pins). Panel mount connectors that are compatible with
the Wand connector, but do not include the retention
mechanism, are the Molex A7224, and AMP 2074-56-2.

HEDS-3001

Figure

While there are no user serviceable parts inside the Wand,
the tip should be checked periodically for wear and dirt, or
obstructions in the aperture. The tip aperture is designed
to reject particles and dirt but a gradual degradation in
performance will occur as the tip wears down, or becomes
obstructed by foreign materials.

The glass window on the sensor should be inspected and
cleaned if dust, dirt, or fingerprints are visible. To clean the
sensor window dampen a lint free cloth with a liquid
cleaner,.then clean the window with the cloth taking care
not to disturb the orientation of the sensor. DO NOT
SPRAY CLEANER DIRECTLY ON THE SENSOR OR
WAND.

OPTIONAL FEATURES
The wand may also be ordered with the following special
features:
• Special colors
• Customer specified label
• No label
• Heavy duty retractable coiled cord
• No connector
• With/without switch button
For more information, call your local Hewlett-Packard
sales office or franchised distributor.

111
L~, . . ,
,...AI

OAO~DW ~

~

Wire
Pin

1
2
3
4
5

I
"eb~

26.S
(1.05)

01

6
7

,I

~D~

6

H1

NOTES:
1. ALL DIMENSIONS IN MILLIMETRES AND (INCHES).

Figure

13.

Wand Tip.

After cleaning the tip aperture and sensor window, the tip
should be gently and securely screwed back into the
Wand assembly. The tip should be replaced if there are
visible indications of wear such as a disfigured, or
distorted aperture. Th.e part number for the Wand tip is
HEDS-3001. It can be ordered from any franchised HewlettPackard distributor.

MAINTENANCE CONSIDERATIONS

Before unscrewing the tip, disconnect the Wand from the
system power source. The aperture can be cleaned with a
cotton swab or similar device and a liquid cleaner.

12.

t

15.8
(0.62)

l

54321

ill I

I

[llOOOOO
I]
0000
iTii
9876

Connector Specifications.

2-43

8
9

Color
NC
White
NC
NC

-

NC
Black
NC
Red

HEDS·3000
Function
NC

HEDS·3050

Vo Output

VoOutput

NC
NC
NC
NC

NC
NC
ShIeld
NC

Ground

Function

NC

Ground

NC

NC

Vs Supply Voltage

Vs Supply Voltage

Fli;-

HEWLETT

~a PACKARD

HIGH-RESOLUTION
DIGITAL BAR CODE
WAND

HEOS-3200
HEOS-3201
HEOS-3250
HEOS-3251

TECHNICAL DATA

JANUARY 1986

Features
• 0.13 mm (0.005 in.) SPOT SIZE
Enhances Readability of High-Resolution Bar
Codes
• DECODABILITY SPECIFIED FOR BAR CODES
WITH 0.19 mm (0.0075 in.) NARROW BAR
WIDTH
• PUSH-TO-READ SWITCH (HEDS-3200/3201)
Minimizes Power Consumption in Battery
Operated Systems
• SHIELDED CASE, CABLE, AND CONNECTOR
(HEDS-3250/3251 )
Maximizes EMI/ESD Immunity in AC Powered
Systems
• DIGITAL OUTPUT
Open Collector Output Compatible with TTL and
CMOS
• SINGLE 5V SUPPLY OPERATION
• ATTRACTIVE, HUMAN ENGINEERED CASE
• DURABLE, LOW FRICTION TIP

either a strain relieved 104 cm (41 in.) straight cord or a
strain relieved coiled cord. The coiled cord has a maximum extended length of 250 cm. (100 in.) and a
comfortably extended length of 190 cm. (75 in.). The
standard connector for all models is a 5 pin, 240 degree
DIN connector.

• SOLID STATE RELIABILITY
Uses LED and IC Technology

Applications

Description

The High-Resolution Digital Bar Code Wand is an effective
alternative to the keyboard when used to collect information in compact, self-contained blocks. Bar code scanning
is faster than key entry and is also more accurate since
most codes have built-in checksums which prevent incorrect data from being entered.

Hewlett-Packard's High-Resolution Digital Bar Code Wands
are hand-held scanners optimized to read all common bar
code formats that have the narrowest bars (spaces) printed
with a nominal width of 0.19 mm (0.0075 in.). The wands
contain an optical sensor with an 820 nm infrared LED,
photo IC detector, and precision aspheric optics. Internal
signal conditioning circuitry converts the optical information into a logic level pulse width representation of the
bars and spaces. The output signal is specified to be
decodable when scanning a 2-level bar code which has a
narrow bar (space) width of 0.19 mm (0.0075 in.) and a
minimum wide bar (space) to narrow bar (space) ratio of
2.2:1. The 3 of 9 Alphanumeric Code is an example of
such a bar code.
The HEDS-3200/01, with a push-to-read switch, are
recommended for use in battery powered applications
requiring low power consumption. The HEDS-3250/51 feature an internal shield which maximizes immunity to
electromagnetic interference (EMI), electrostatic discharge
(ESD), and ground loops. These wands are recommended
for use in AC powered systems.
Both standard wand configurations are available with

High-resolution bar codes are typically used in applications where the number of characters to be represented
and the physical space availablet6gether require a bar
code symbol with high information density. The primary
code characteristics which influence information density
are the code structure and the narrow bar (space) width.
Once the bar code type has been selected, a high-resolution symbol is used to achieve the highest information
density for that code structure.
Applications for high-resolution bar codes include:
material handling and inventory control; remote data collection; item identification for assemblies in service, repair,
manufacturing, or testing; ticket identification; security
checkpoint verification; file folder tracking; book, magazine, or general publication distribution; fixed asset
accounting; and the programming of microprocessorbased systems such as consumer products (appliances,
video recorders, games, etc.), intelligent instrumentation
and control equipment, personal computers, and calculators.
2-44

Selection Guide

NOTES:
1. Straight Cord Dimensions are 41 in. wand-to-connector.
2. Coiled Cord Dimensions are 29 in. wand-to-coil, 8 in. coil (collapsed), 10 in. coil-to-connector.

Absolute Maximum Ratings
~in,

Max.

Ts

-20

55

TA

-20

5511

ge

Vs

-0:5

6,0

V
mW

01

S"
emperature
Temperature
Voltage
Transistor Power

PI

200

0l!tput Collector Voltage

Vo

20

'-ijllits

taotes

°C

ru;

3
To

h

V~

NOTE:
3. Maximum Storage Temperature is dictated by the wand case.

Recommended Operating Conditions
Parameter
Bar/Space Width

I

b.

Ma

""llx.

0.150 (0.006)

S

Scan Velocity

VSCAN

5

Contrast

Rw-Rb

65

Temperature

TA

-20

Units

Notes

mm(in.)

100

em/sec

55

°C

%

4

Relative Humidity

RH

95

%

5

Ambient Light

Ev

2000

lux

6

Supply Voltage

Vs

4.5

5.5

V

7

(')

0

30

degrees

Tilt Angle
Height

See Figure 7

OrieDJatiQO

See Figure 1

8

NOTES:
4. Contrast is defined as Rw-Rb where Rw is the reflectance at 820 nm from the white spaces and Rb is the reflectance at 820 nm from the
black bars. Contrast is directly related to Print Contrast Signal (PCS = (Rw-Rb IRw) as it is equivalent to RwxPCS.
5. Non-Condensing.
.
6. Ambient Light sources can be diffuse tungsten, fluorescent, sunlight, or a combination thereof. Performance in ambient light levels
above 2000 lux will vary depending on the light source and shading at the wand.,tip.
7. Power Supply ripple and noise should be less than 100 mV.
8. The wand is in the preferred orientation when the surface of the wand label is parallel to the bars and spaces in the bar code symbol'
as shown in Figure 1.

2-45

Electrical Operation
provide a substantial improvement in EMI/ESD immunity in
AC powered systems. It is recommended that the shield be
properly terminated even when EMI and ESD are not of
concern because the shield will otherwise act as an
antenna, injecting electrical noise into the wand circuitry.

The High-Resolution Digital Bar Code Wands consist of a
precision optical sensor, an analog amplifier, a digitizing
circuit, and an output transistor. These elements provide a
TTL compatible output from a single 4.5V to 5.5V power
supply. The open collector transistor used at the output
requires an external pull-up resistor for proper operation.

The HEDS-3200/01 incorporate a push-to-read switch
which is used to energize the LED emitter and electronic
circuitry. When the switch is initially depressed, contact
boUnce may cause a series of random pulses to appear at
the output Va. This pulse train will typically settle to a final
value within 5 ms. The final value will be the initial or
"wake-up" state.

A non-reflecting black bar results in a logic high (1) level
while a reflecting white space will cause a logic low (0)
level. The initial or "wake-up" state will always be the correct (logic low) state when the wand is placed
on reflecting white surface. The initial state is indeterminate if the wand is placed on a black surface or is pointed
into free space.

The recommended logic interface for the wands is shown
in Figure 3. This interconnection provides maximum ESD
protection for both the wand and the user's electronics.

The HEDS-3250/51 provide a case, cable, and connector
shield which must be terminated to logic ground or, preferably, to both logic ground and earth ground. This will

Electrical Characteristics (Vs = 4.5V to 5.5V, TA = 25°C, RL = 1.0-10 kfl, unless otherwise noted)
Parameter

Symbol

Min.

Typ.

Max.

0.5

5

Switch Bounce
(HEDS-3200/3201 )

t$b

High Level Output
Current

IOH

400

Low Level Output
Voltage

VOL

0.4

Output Rise Time

tr

2

;t
V

100

Supp;y Current

Is

35

50

VOH =Q.4V
Bar condition
(Black)

3

IOL = 16 mA
Space Condition
(White)

3

ns

90%-10%
Transition

3

mA

Vs=5V.
Bar Condition
(Black)

NOTES:
9. Switch bounce causes a series of sub-millisecond pulses to appear at the output, Vo (HEDS-3200/3201 only).
10. Push-to-Read switch is depressed (if applicable) and the wand is scanning on a non-reflecting (black) surface.

Block Diagram

HEDS-320013201
(with !Switch)

B§R

DIGITIZE;

HEDS-3250/3251
(shielded)

2-46

Notes
9

3

,,'-,

tf

Fig.

10%.. 90%
Transition
'"RC''' 1.0kn

I.IS

Output Fall Time

Conditions

Units

ER= J

10

Scanning performance (Vs = 5V, RL = 1.0-10 kO, TA = 25·C, VSCAN = 50 em/sec)
Parameter

Symbol

Milt.

Typ.

Max.

UWits

Cond'lflons
Tilt

Decodability Index

01

14

Average Width Error
(Narl'ow Bars)

'OSb"

Average Width Error
(Wide Bars)

OSbw

Average W~~~~;Kfor
(NarrowSp

OSsn

Average WidtWError
(Wipe Spaces)

OSsw

DeViation from Average
(Internal Elements)

22

(in.)

0.021
(0.6008)

mm
(in.)

-0,015

mm
(in.)

·,·Iil,QP6 )
-0.044

Notes

1,2
4,5

11,13
14

Preferred
drlentation

6,7

Standard Test%,(W
Tag

1,2

8

12·

9

mm
(in.)

(-dreo17)
0.023
(0.0009)

de

%

mmibm

0.9,10
(0,11)0121

=0 to 30·

Fig.

0.038
(0.0015)

mm
{in.}

1,2
4,5

15

6,7
8
Deviation from Average
(First Bar)

db,

0.054
(O,Q,Q21)

0.110

mm

(D.OOdS)

(In.)

NOTES:
11. The standard test tag is designed to include all possible combinations of wide or narrow bars and spaces. The tag, shown in Figure 2,
consists of black bars and white spaces with a narrow element width of 0.19 mm (0.0075 in.) and a wide element width of 0.42 mm
(0.0165 in.). This equates to a wide-to-narrow ratio of 2.2:1. A margin, or white reflecting area, of at least 5 mm in width precedes the
first bar. The test tag is photographically reproduced on KODAGRAPH TRANSTAR TC5® paper with Rw = 0.9 and PCS greater than
0.9, yielding a contrast greater than 0.81.
12. The difference between the calculated bar (space) width derived from the digital output and the optically measured bar (space) width
defines width error (WE). The Average Width Error for the narrow or wide bars (spaces) specifies the systematic error in the output
signal. This systematic error is largely due to paper bleed and is thus very dependent on the symbol media.
13. DI = de +~OS/4 X 100, expressed as a percentage of the module width. "de" is the deviation from the average width error for the internal
bars (spaces), "80S" is the difference in average width error between the wide and narrow bars (spaces), and "m" is the optically
measured narrow bar (space) or "module" width. The·first bar is not included due to its unique characteristics.
14. DI is calculated independently for bars and spaces and the worst-case, largest DI is used. This .results in a DI specification which
applies only to the bars since the DI for the bars is characteristically larger than the DI for the spaces.
15. Deviation from the Average Width Error (de, db1) specifies the random errors in the output signal which are largely due to digitizing
noise. The first bar, which generally appears larger than the interior bars, has a deviation significantly larger than the deviation for the
interior bars (spaces).

BAR WIDTH 0.19 mm (0.0075 in.) alACK & WHITE

HEDS-3200/01

HEDS-32S0/S1

CONTRAST;> 66% KODAGRAPH TRANSTAR TCs'" PAPER

Figure 1. Preferred Wand Orientation

Figure 2. Standard Test Tag Format

2-47

- - _.._-----

TRANSZORB IS A REGISTEREO
TRADEMARK OF GENERAL
INDUSTRIES,
-----'r- _______ _, SEMICONDUCTOR
TEMPEAZ.
PUSH-TO-READ
,

~

- - - - - , r-- -

I
I

I
I

SHIELD

V,III

- - - - 0 o-~~-----<~~--~~~~=-~~~~
+ 1< TRANSZORB
I P6KE 7.5C
4.7pF
I 13 EACHI

-....:. -

-

-

TRANSZORB IS A REGISTERED
TRADEMARK OF GENERAL
SEMICONDUCTOR INDUSTRIES.
- , TEMPEAZ.

V,lll

,,=' TRANSZOR

+

I P6KE 7.5C
I 13EACHI

Vol21

Vol21

I

I
I
I

GNOl31

SHIELD __
( '____
L _ICASEI

l ________ _

HEDS·3200/01

ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE

HEDS-3250151

SYSTEM INTERFACE

Figure 3a. Recommended Logic Inlerface for HED8-3200/01

oJ

ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE

~
SYSTEM INTERFACE

Figure 3b. Recommended Logic Interface for HEDS-3250/51.
(When earth ground Is not available, connect shield
to logic ground, as shown by dotted line)

Typical performance Curves
(Vs = 5V. RL = 1.0 k!l. TA

= 25°C. Tilt = 15°. unless otherwise specified)

01

dm,db,

~

01

dm.dbl

o

-

20

V

~

i--""""

o~

:J:

b

~

w

~

:;
0.030 ~

d.

0

!1lo

--- -...

~

1

0

-20

-5

10

25

40

55

~

---

~

:J:
I-

0

iii
w

..I

:>
Q

0

.

0

>II.
I

frl
I

Q

5.0

5.5

6.0

Figure 5. Decodabllity Index and Deviation from Average
Width Error vs. Supply Voltage

~

:;

~
!1lo

::l
0

4.5

w

!!!
~

Q

4.0

~
i--"""...c;::---+--"-?f--"--!--IO.060 ffi

Q

 Printer (Dlbp)

+ Wand (Dlbw)
+ abpW)

(WB:NB - 1) > (OSbpN - OSbpW) + (3abpN
4
4m

+

(OSbwN - OSbwW)
4m

+ 4debw

Table 1. Definition of Terms

Space Error Sensitivity
Decodability Limit (Dls) > Printer (Dlsp)

+ Wand (Dlsw)

(WS:NS - 1) > (OSspN - OSspw) + (3&pN + &pw)
4
4m

+ (OSswN - OSswN) + 4desw
4m

The first term of the equation estimates the offset and random errors of the printer (Dip) while the second term
describes the offset and random errors of the wand (Dlw).
The random errors of the wand (debw, desw) are the combination of the wide (c5ww) and narrow (lIwN) random
components. The individual random components are
summed because, in the case of the wand, they are
approximately equal.
These two equations allow a system designer to predict,
given the wide to narrow ratio (W:N), module width (m),
and errors (OS, II), whether the decoder will correctly recognize the narrow time interval as a narrow bar (space)
and the wide time interval as a wide bar (space). The (W:N
- 1 )/4 factor in the equation is defined as the decodability
limit (Dl) of the symbology. To ensure decodability, this
number should be greater than the sum of the errors
introduced by the printer and wand. The wand may, however, render a decodable signal even if the combination of
printer and wand errors exceed the decodability limit (Dl).
This results from the introduction of other random variables such as the operator scan velocity, acceleration and
deceleration profiles, and the sampling times of the decoder time interval counter. These factors can bias the
printer and wand errors, thus permitting the decoder to
make the correct decision.
When using the prescribed decoding algorithm and the
concept of decodability presented above, the system
designer should independently evaluate the decodability
of the bars and the spaces. The decodability index for the
wand (Dlw) is typically larger for bars than for spaces
while the decodability index for the printer is typically
larger for the spaces. If an algorithm which does not
separate bars and spaces is used, the designer must evaluate the offset differences between the bars and spaces in
addition to the analysis presented above. This introduces
another variable into the system as the wand offset is
dependent on the characteristics of the paper media.
The best first read rate can be achieved when good quality
printed bar code symbols are used. Good quality highresolution bar codes can be pre-printed or printed
on-demand with "drummer" label printers using OCR ribbons and good quality label stock. Bar code symbols
which are printed on very translucent media, as are some
photolithographic symbols, can cause the wand offset to
be excessive due to paper bleed. This will degrade system
performance, particularly for algorithms which compare
bars and spaces.

IlJsrs
Dlb
Dlbp
Dlbw
WB:NB
OSbpN
OSbPW
OSbwN
OSbww
8bpN

obpW
debw
m

Spaces
Dls
Disp
Disw
WS:NS
OSspN
OSspw
OSswN
OSsww
IlspN
IlspW
desw
m

DennUlon
decodability limit
printer decodability Index
wand decodability Index
wide to narrow ratio
printer offset, narrow element
printer offset, wide element
wand offset, narrow element
wand offset. wide element
printer random error, narrow element
printer random error, wide eiement
wand random error
module width (narrow eiement width)

Mechanical Considerations
The HEDS-32XX wands include a standard 5 pin, 240
degree DIN connector. The detailed specifications and
pin-outs are shown in Figure 10. Mating connectors are
available from RYE Industries and Switch Craft in both 5
pin and 6 pin configurations. These connectors are listed
below:
Configuration

Connector

5 Pin
5 Pin
5Pin
6Pin
6 Pin

RYEMAB-5
SWitch Craft 61 GA5F
Switch Craft 61 HA5F
RYEMAB-6
Switch Craft 61GA6F

NOTES:
1. DIMENSIONS IN·MILLIMETRESAND (INCHES).

~

WIRE COLOR

HEDS-3200/01

HEDS-3250151

RED
WHITE

VsSUPPLYVOLTAGE

Vs SUPPLY VOLTAGE

Vo OUTPUT
GROUND

Vo OUTPUT
GROUND

BLACK
N/A
N/A
CASE

N/C
. N/C
N/C

Figure 10. Connector Specifications

The high resolution wand is not recommended for use
with bar codes printed on dot matrix printers because of
the print flaws (spots and voids) which are characteristic
of this printing process. These flaws may be large enough
to be recognized as bars (spaces) by a high resolution
wand, leading to a mis-read.

2-50

N/C
N/C
SHIELD

---_. - - - - - - - - -

Maintenance Considerations
While there are no user serviceable parts inside the Wand,
the tip should be checked periodically for wear and dirt, or
obstructions in the aperture. The tip aperture is designed
to reject particles and dirt but a gradual degradation in
performance will occur as the tip wears down, or becomes
obstructed by foreign materials.
Before unscrewing the tip, disconnect the Wand from the
system power source. The aperture can be cleaned with a
cotton swab or similar device and a liquid cleaner.
The glass window on the sensor should be inspected and
cleaned if dust, dirt, or fingerprints are visible. To clean the
sensor window dampen a lint free cloth with a liquid
cleaner, then clean the window with the cloth taking care
not to disturb the orientation of the sensor. DO NOT
SPRAY CLEANER DIRECTLY ON THE SENSOR OR
WAND.
After cleaning the tip aperture and sensor window, the tip
should be gently and securely screwed back into the
Wand assembly. The tip should be replaced if there are
visible indications of wear such as a disfigured, or distorted aperture. The part number for the Wand tip is
HEDS-3001. It can be ordered from any franchised
Hewlett-Packard distri butor.

HEDS-3001

Figure 11. Wand Tip

Optional Features
The wand may also be ordered with the following special
features:
•
•
•
•
•

Special colors
Customer specified label
No label
Special Retractable Coiled Cords
9 Pin subminiature D-style plastic connector (same as
HEDS-3000/3050)
• No connector (stripped and tinned leads)
For more information, call your -local Hewlett-Packard
sales office or franchised distributor.

Wand Dimensions
HE09-3200/01

HEOS'3250/51

2
C~II~__~IM~~~~~~~~IDI~~,==~
T
1....- - - - 133 ( 5 . 2 1 - - - - 1 - - . . - - - -.......

~O$~

23(0.91

C.....Lt:::IEI:====nIJ::SI~J)

=---c

rrIIIll)

1..LJ.!lI1!II!

""1.0-------J-----

ITJiDlill:I'1

1050 ( 4 1 ) - - - - - - - -

I~[I J~

1-=2601101

V

740 (29)

COl)ooo91JIb~'
.1.

2OO,8}

·1·

:

1'"'._ _ _ _ _ _ _ 1050(41} _ _ _ _ _ _~

'33 (5.21----1-t----,-----

ell

20 (:.8)

r

'----'33(S.2}----rt----,,----

It:::l
---c J)~

ell

ITJID-::::l9IIIb~O.81

1--=.260(10}

.,.

2OQ!:::J----/

NOTES;

1. ALL DIMENSIONS LN MILlIMETRESAND (INCHES).

2-51
- - _ . __._._-

d )

140 (291

---_._--_._---------

HIOH RESOLUTION
OPTICAL REFLECTIVE
SENSOR

Flin-

HEWLETT
~~ PACKARD

HBCS-1100

TECHNICAL DATA

JANUARY 1986

Features
• FOCUSED EMITTER AND DETECTOR
IN A SINGLE PACKAGE
• HIGH RESOLUTION -

.190mm SPOT SIZE

• 700nm VISIBLE EMITTER
• LENS FILTERED TO REJECT AMBIENT LIGHT
• TO-5 MINIATURE SEALED PACKAGE
• PHOTODIODE AND TRANSISTOR OUTPUT
• SOLID STATE RELIABILITY

Description
The HBCS-1100 is a fully integrated module designed for
optical reflective sensing. The module contains a .178mm
(.007 in.) diameter 700nm visible LED emitter and a
matched I.e. photodetector. A bifurcated aspheric lens is
used to image the active areas of the emitter and the
detector to a single spot 4.27mm (0.168 in.) in front of the
package. The reflected signal can be sensed directly from
the photodiode or through an internal transistor that can
be configured as a high gain amplifier.

Mechanical Considerations
The HBCS-1100 is packaged in a high profile 8 pin TO-5
metal can with a glass window. The emitter and
photodetector chips are mounted on the header at the
base of the package. Positioned above these active
elements is a bifurcated aspheric acrylic lens that focuses
them to the same point.

Applications

The sensor can be rigidly secured by commercially
available two piece TO-5 style heat sinks, such as
Thermalloy 2205, or Aavid Engineering 3215. These
fixtures provide a stable reference platform and . their
tapped mounting holes allow for ease of affixing this
assembly to the circuit board.

Applications include pattern recognition and verification,
object sizing, optical limit switching, tachometry, textile
thread counting and defect detection, dimensional
monitoring, line locating, mark, and bar code scanning,
and paper edge detection.

Package .Dimensions
«l:335.-

9.40 10.370)

!

5.0B

ro:2iiO.

MAXIMUM SIGNAL POINT~

~~-+
----r.=:r 4.\1

REFERENCE PLANE

I

r+-

R-

I

iO:162}

B.51

c;J

g:~~~L~
.!j
1.14 (0.045 •

0.73lOJi2§j

.---

5.08

([2Oii)

~±~

(0.16S) • (0.010)

NOTES:
1. ALL DIMENSIONS IN MILLIMETERS AND (INCHES).
2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.
3. THe REFERENCE PLANE IS THE TOP SURFACE OF THE PACKAGE.
4. NICKEL CAN AND GOLD PLATED LEADS.
5. s.P. SEATING PLANE.
6. THE LEAD DIAMETER IS 0.45mm (O.OISin.)TYP.

2-52

Electrical Operation
The detector section of the sensor can be connected as a
single photodiode, or as a photodiode transistor amplifier.
When photodiode operation is desired, it is recommended
that the substrate diodes be defeated by connecting the
collector of the transistor to the positive potential of the
power supply and shorting the base-emitter junction of
the transistor. Figure 15 shows photocurrent being
supplied from the anode of the photodiode to an inverting
input of the operational amplifier. The circuit is
recommended to improve the reflected photocurrent to
stray photocurrent ratio by keeping the substrate diodes
from acting as photodiodes.

The cathode of the 700nm emitter is physically and
electrically connected to the case-substrate of the device.
Applications that require modulation or switching of the
LED should be designed to have the cathode connected to
the electrical ground of the system. This insures minimum
capacitive coupling of the switching transients through
the substrate diodes to the detector amplifier section.
The HBCS-1100 detector also includes an NPN transistor
which can be used to increase the output current of the
sensor. A current feedback amplifier as shown in Figure 6
provides moderate current gain and bias point stability.

SCHEMATIC DIAGRAM

CONNECTION DIAGRAM
3

Vo

4

Vc

2
~,

REFLECTOR

\t

!:!..-I
r I

REFERENCE
PLANE:'"

~

t

\

ANODE~

VF~

CAT~

3

5

SUBSTRATE,CASE

1

~~

TOP VIEW

I

......

I----+--t-I:

____

~r ~ ...

1

~ --

8

6

--l
I

7

~sI

PIN

FUNCTION
TRANSISTOR COLLECTOR

1
2
3
4

I
----'

DS-SUBSTRATE DIODES

TRANSISTOR BASE, PHOTODIODE ANODE
PHOTODIOOE CATHODE
LED CATHODE, SUBSTRATE, CASE
NC
LED ANODE

5
6
7
8

NC
TRANSISTOR EMITTER

Absolute Maximum Ratings at TA=25°C
Parameter

Symbol

Min.

Max.

Units

Storage Temperature

TS

-40

+75

°C

Operating Temperature

TA

-20

+70

°C

260
for 10 sec.

°C

11
2

Lead Soldering Temperature
1.6mm from Seating Plane
Average LED Forward Current

IF

50

mA

Peak LED Forward Current

IFPK

75

mA

Reverse LED Input Voltage

VA

5

V

Package Power Dissipation

Pp

120

rnW

Collector Output Current

10

8

rnA

Supply and Output Voltage

VO,VC,VE

Transistor Base Current
Transistor Emitter Base Voltage

20

V

16

5

rnA

VEB

,5

V

-0.5

Fig.

Notes

3

10

CAUTION: The small junction sizes inherent to the design of this bipolar component increase the component's susceptibility to damage
from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be introduced by ESD.

2-53
__

• _ _ _• • •_ _ • _ _ _ _ _ _. . . . .

• .._

.. -

_ _ • _ _ 00 _ _ _ _-

system Electrical/Optical Characteristics at TA =25°C
Paramater

Symbol

Min.

Typ.

Max.

Units

575
Total Photocurrent (IPA+lpsl

Ip

150

250

375

nA

Transistor DC Static Current
Transfer Ratio

Fig.

Note

IF=35mA. Vo=Vc=5V

2.3

4

15

IPA

IPS

4

hFE

50
100

Slew Rate
Image Diameter

TA=25·C
TA=70·C

80
Reflected Photocurrent (lPAl to
Internal Stray Photocurrent (IPs)

CondlDons
TA=-20·C

8.5

IF=35mA. Vc=Vo=5V

TA~20·C
200

TA=>25.C

.08

VII's RL=100K
RF 10M

.17

d

Maximum Signal Point

£

50% Modulation Transfer
Function

MTF

2.5

Depth of Focus

All
FWHM

1.2

Effective Numerical Aperature

N.A.

.3

Image Location

D

Thermal Resistance

eJC

4.01

4.27

4.52

I
I Vce=5V. Ic=lOI'A
IpK=50mA
ION=100J's, Rate = 1kHz

mm

IF=35mA,~=4.27mm (0.168In.)

mm

Measured from Reference Plane

Inpr/mlT IF=35mA, £ =4.27mm

mm

50% of Ip atl1=4.27mm

.51

mm

Diameter Reference to Centerline
£=4.27mm

85

·CIW

3
4.5
6
8.10

8,9

9
10,11

5,7

9

5

6

Detector Electrical/Optical Characteristics at TA=25°C
Parameter

Symbol

Min.

Typ.

Max.

Units

5

200
10

pA
nA

Dark Current

Ipo

CapaCitance

Co

45

Flux Aesponsivity

Ref>

.22

pF

.L

Conditions
TA=25°cl
TA-70·CI

Fig.

Note

IF"'O, Vo=5V;
Reflectlon=O%

Vo=OV, Ip=O, f=lMHz
A=700nm, Vo=5V

12

W

Delecto r Area

mm2 Square, with Length"'.4mm/Side

.160

AD

Emitter Electrical/Optical Characteristics at TA=25°C
Parameter

Symbol

Forward Voltage

VF

Reverse Breakdown Voltage

BVR

Radiant Flux

Min.

Typ.

Max.

Units

1.6

1.8

V

IF=35mA

V

IA=100J'A

5

ef>e

5

9.0

680

700

Conditions

tF35mA. A=700nm

14

nm

1F=35mA

14

Peak Wavelength

Ap
6JC

150

°C/W

Temperature Coefficient of VF

AVF/AT

-1.2

mVloC IF35mA

2-54

13

J'W

Thermal Resistance

720

Fig.

Note

Transistor Electrical Characteristics at TA =25°C
Parameter

Symbol

Min.

Max.

Typ.

Units

Fig.

Conditions

Collector-Emitter Leakage

ICEO

1

nA

VCE=5V

Base-Emitter Voltage

VSE

.6

V

Ic=10pA. Is=70nA

Collector-Emitter Saturation
Voltage

VCE(SAT)

.4

V

le=1pA.le=10pA

Collector-Base Capacitance

Ces

.3

pF

f=1MHz. Vcs=5V

Base-Emitter Capacitance

CeE

.4

pF

f=1MHz. VSE=OV

Thermal Resistance

f)JC

200

°C/W

Note

NOTES:
1. 300ps pulse width. 1 kHz pulse rate.
2. Derate Maximum Average Current linearly from 65°C by 6mA/oC.
3. Without heat sinking from TA = 65°C. derate Maximum Average Power linearly by 12mW/oC.
4. Measured from a reflector coated with a 99% reflective white paint (Kodak 6080) positioned 4.27mm (0.168 in.) from the reference plane.
5. Peak-to-Peak response to black and white bar patterns.
6. Center of maximum signal point image lies within a circle of diameter D relative to the center line of the package. A second emitter
image (through the detector lens) is also visible. This image does not affect normal operation.
7. This measurement is made with the lens cusp parallel to the black-white transition.
8. Image size is defined as the distance for the 10%-90% response as the sensor moves over an abrupt black-white edge.
9. (+) indicates an increase in the distance from the reflector to the reference plane.
10. All voltages referenced to Pin 4.
11. CAUTION: The thermal constraints of the acrylic lens will not permit the use of conventional wave soldering procedures. The typical
preheat and post cleaning temperatures and dwell times can subject the lens to thermal stresses beyond the absolute maximum
ratings and can cause it to defocus.

\

\,

~

'\

\

~fr. --)~-s. ~-s.
'"
~
I

10

1\

r

~

'1

R~- ~

--'&

II

1

100

tp -

,

PULSE DURATION

(Ilsi

70

80

IF - DC FORWARD CURRENT (rnA)

Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration

I '\

REFLECTOR
REFERENCE
PLANE'r-

+5V

Figure 2. Relative Total Photocurrent vs. LED DC
Forward Current

!t

~

ANODE

60

10,000

1000

~

I

-----,

I

-VF

I

~
I

Os

I

CATHODE

-----...1

SUBSTRATE. CASE
Ip=lpR+lps
NOTE:
1. Ip MEASUREMENT CONDITIONS ARE; Q= 4.34mm,
KODAK 6080 PAINT REFLECTOR.
2. Ips MEASUREMENT CONDITIONS ARE; Q = 0 0
A CAVITY WHOSE DEPTH IS MUCH GREATER THAN
THE HBCS-1100 DEPTH OF FIELD.

Figure 3. Ip Test Circuit

2-55

NANOAMPERE METER
(KEITHLEY MODEL 480)

50

3.0

~

I. - BASE CURRENT (nAI
2irC

!- TEMP'

!

;;'

.=,

iii0:

,

t-;

l --

0:

OJ

f.~

~
0

'

'

-ZO'C-'

...

20

"...... f-'

10

"'"

g

II

.- 25"C
II

30

U
0:

10"C

f0fo-

40

I-

U

I

2

f-'

k- ~

~~

i.-

r-

-.-

~

--

;.-::
.,.... ...... I" ~
i"""'" \to<'p
r- \\lO"k
~
~

.- r--"'" eOO'~
..- r- 6Qn~.....,
40nA

2On~
I

!
100

1000

10

10,000

Is - BASE CURRENT (nA)

12

14

Figure 4. Normalized Transistor DC Forward Current Gain vs.
Base Current at Temperature

R,

tp'"

;I

DETECTOR IMAGE
THROUGH EMITTER
LENS

CTOR

,
\
==

PLANE'r

!

;

1

3

R,

t

I

1001-1$, RATE -1KHz

JA

MAXIMUM
SIGNAL POINT

I
I

L,

~
10,

2S

---+--,

10M

----...,

~

0,'

20

r

"OK
Vo

REFERENCE

18

Figure 5. Common Emitter Collector Characteristics

c"'5V

IFPI( -50mA

16

VeE - COLLECTOR·TO·EMITTER VOLTAGE (V)

-,

_ _ _ _ _ JI
\

.".

Figure 6. Slew Rate Measurement Circuit

l

EMITTER IMAGE
THROUGH DETECTOR
LENS

Figure 7. I mage Location

0.4
11 0
0.3

1\

\\

E

.E
w

N

;;;
W

SeE NOTES 7, 8, 9

0.2

~
I

100

iiia:

0

a:
OJ
u

I--

g

0
0

faI-

0

~

0

I

0

frl

o. 1

a:

'"

o
-0.4
A~

-0.2

0.2

0.4

0.6

I

lLll

0

il:

o

"'to-.

~

I-

~

\

~~'" rt--

0

1

~

0

I\,

0

0.8

- DISTANCE FROM MAXIMUM SIGNAL (mmJ

Q - REFLECTOR DISTANCE (mml

Figure 8. Image Size vs. Maximum Signal Point

Figure 9. Reflector Distance vs. % Reflected Photocurrent

2-56

~~~~~~~~~~~~~~~-"~-"--------------

110
t-

100

a:
a:
u

90

~

"

5
il:
~
>-

g
a:
I

"

110

--- I-- --

-

~

96%

~

80

z

90

i=

80

0

:J

"00

70
60

0

w
0

0

"

50

">-

40

70 1--1

\- I--

0

\

0

-

0

~-d-

~10%

r10.1

~d

0.2

I

'\

0

40

"\

~

!

10

-

I f'

-

t-

r--

0.3
SPATIAL FREQUENCY (LINE PAIR/mm)

Figure 11. Modulation Transfer Function

~\

f

0

~

~:I

r---

h.

0

a:

----

J~

0

~

-

1'\

- EDGE DISTANCE (mml

10 0

0

._- f---

I\,

20

"

Figure 10. Step Edge Response

'"oz

~

30

""

I-- I-- -

r- ......

I

i

0

0

w

100

~\.

"

~

0

~O'C

25'C'

20

J

0

I
600

700

800

900

1.7

1000

~ - WAVELENGTH (nml

V, - FORWARD VOLTAGE IV)

Figure 12. Detector Spectral Response

Figure 13. LED Forward Current vs. Forward Voltage
Characteristics

Vee
1. 2

I(10'C

O. 8

"a:
"
w

o. 6

i=

o.4

z
C

>

~
a:

II

'III

~
680

-,

ANODE

I

7-

REFLECTOR

VOUT '"

Vee
1 + R2/R,

-

IpRF

760

,-WAVELENGTH 10m)

Figure 14. Relative Radiant Flux vs. Wavelength

Figure 15. Photodiode Interconnection

2-57

FliP.

HEWLETT

~~ PACKARD

BAR CODE READERS

16800A
16801A

TECHNICAL DATA

JANUARY 1986

Features

Description

• THREE INDUSTRIAL BAR CODES
STANDARD:
- 3 of9 Code
- Interleaved 2 of5 Code
- Industrial 2 of 5 Code

The 16800A and 16801A are high performance bar code
readers. The 16800A includes a wide range of programmable features which allow the reader to be fully integrated into
sophisticated data entry systems. The 16801 A is nonprogrammable, providing a more cost-effective solution for
applications which do not require programmability.

• AUTOMATIC CODE RECOGNITION

The standard reader supports three popular industrial bar
codes: 3 of 9 code,l nterleaved 2 of 5 code, and Industrial 2 of
5 code. If more than one standard code is enabled, the
reader will automatically recognize which code is being
read. Options are available for reading UPC/EAN/JAN
codes, Codabar code, and other bar codes. Bidirectional
scanning is provided for all bar codes supported.

• OPTIONAL BAR CODES AVAILABLE
UPC/EAN/JAN
-

Coda bar

-

Others

• FLEXIBLE DUAL RS-232-C (V.24) DATA
COMMUNICATIONS
- Facilitates a Wide Variety of Configurations

The 16800A and 16801A may be configured with a wide
range of computer systems; including minicomputers, desktop computers, and personal computers. Dual RS-232-C
(V .24) ports facilitate operation in both stand-alone and
eavesdrop configurations. In an eavesdrop configuration,
the reader will generally be operated in conjunction with an
RS-232-C terminal.

• PROGRAMMABLE OPERATION (16800A only):
- Two LED Status Indicators
Beeper Control
Code Selection
Data Communication Configuration
Reader Operational Status

Interactive systems design is supported in the 16800A
through programmable operator feedback and reader control features. A mUlti-tone beeper and two LED indicators are
provided to allow simple, yet flexible audio and visual programmable feedback. Local operator feedback is provided
in the 16801A through a beeper which sounds to signify a
good read.

• HIGH PERFORMANCE DIGITAL WANDS:
- 45 Degree Scan Angle
- Sealed Sapphire Tip
- Polycarbonate or Metal Case
• INTEGRAL POWER SUPPLY

Reader performance can be optimized by selecting the wand
appropriate for the environment and the type of symbol
being read. The wands offer a 45 degree scan angle, a
rugged case, and a sealed sapphire tip. The sapphire tip may
be replaced by the user if it is damaged.

• TABLETOP OR WALL MOUNTABLE
• BUILT-IN SELF TEST
• WORLDWIDE HP SERVICE

2-58

Applications
Bar codes offer a method of entering data into computers
which is fast, accurate, reliable, and which requires little
operator training. Implementation of a bar code system can
lead to increased productivity, reduced inventory costs,
improved accountability, increased asset visibility, and
reduced paperwork. Customer satisfaction will also improve
as a result of improved quality control, reduced shipping
errors, and reduced order and ship times. On-line, real-time
interactive systems will allow the user to take full advantage
of the contributions offered by bar code systems. The
16800A and 16801 A provide a high performance solution for
applications which require on-line bar code data entry.
The most common type of data stored in bar code is item
identification information used in a wide range of applications such as:
-

I nventory Control
Work-in-Process Tracking
Distribution Tracking
Order Processing
Records Management
Point-of-Sale
Government Packaging and Shipping

Bar codes can also be used in applications where information about an item or a transaction must be accurately
entered into the host computer. Item location, employee
identification, work steps, equipment settings, equipment
status, and inspection results are some of the types of information which can be entered using bar codes.

Typical configuration
The dual RS-232-C (V.24) output provided by the 16800A
and 16801 A allows a single reader to be configured in a wide
range of on-line applications. Three typical system configurations are outlined below:
• Stand-Alone Reader - The 16800N16801A is in direct
communication with the host minicomputer, desktop
computer, or personal computer.

Computer

2-59
-----------~.---------~-.-.-----.----

-------------------_.. _----_._--------- --------_. ------------------_.

• Muiliplexed- A cluster of 16800N16801As communicates' with the host computer through a multiplexer.
Where the advantages of fiber optic data communications are desired. the Hewlett-Pac~ard 39301 A Fiber
Optic Multiplexer can be used.

MUX
Computer

• Eavesdrop - The 16800N16801A is in an eavesdrop
configuration between an RS-232-C terminal and the
host computer. The reader can be configured to transmit
to the computer. to the terminal. or to both
simultaneously.

Computer
Terminal

Wand Selection
The 16800A and 16801A bar code readers include a 16830A
digital bar code wand which is. capable of reading bar code
symbols which have nominal narrow bar/space widths of
0.19 mm (0.0075 in.) or greater. Thisincludesa wide range of
high. medium. and low resolution bar codes including
standard 3 of 9 code [0.19 mm (0.0075 in.)].
An optional 16832A digital bar code wand is available for
very high resolution codes with nominal narrow bar/space
widths of 0.13 mm (0.005 in.! to 0.20 mm (0.008 in.!. The 820
nm near-infrared emitter in the 16832A wand also enables it
to read the black-on-black bar codes used in some security
systems. This wand is not recommended for dot matrix
printed bar codes or colored bar codes.
The 16830A and 16832A wands feature a rugged polycarbonate case designed for light industrial and commercial

2-60

applications. Applications which require an industrial wand
are su pported by the optional 16840A and 16842A digital bar
code wands. These wands feature a solid metal case and
internal construction designed for abusive environments.
The 16840A and 16842A have the same bar code reading
characteristics as the 16830A and 16832A. respectively.
All wands are also available under accessory product
numbers.

Code Selection
The 16800A and 16801A offer user flexibility in the implementation of the three standard bar codes:
• Single Code Selection or Automatic Code Recognition
(any combination of the three standard codes)
• Checksum Verification Selectable
• Variable Message Length up to 32 characters

•
•

operator Feedback

Selectable Message Length Check (Interleaved 2 of 5
code and Industrial 2 of 5 code)
Any specified code resolution

The 16800A and 16801 A provide good read feedback to the
operator by sounding an integral beeper. Beeper volume
can be adjusted as appropriate for the application.

Optional bar codes will also provide a high degree of user
flexibility. The code reading configuration is switch selectable. Additional information on bar code symbologies is
available in the Operating and Installation Manual and in
Application Note 1013 - "Elements of a Bar Code System".

~:I

16800A Additional Capabilities
Interactive operator feedback is provided in the 16800A
through two programmable LED indicators and programmable beeper control. The user has programmable control
over operator feedback as follows:
• Local good read beep enable/disable
• Local good read beep tone (16 tones available)
• Computer commanded beep (16 tones available)
• Red LED Indicator on/off
• Green LED Indicator on/off

16800A Additional Capabilities
The 16800A offers the advantage of programmable control
over all aspects of the code reading configuration. This
capability enables the applications software to determine
what code can be read depending on the type of data to be
entered. For example, the 3 of 9 code could be enabled for
entering item identification information and then the 3 of 9
code disabled and Interleaved 2 of 5 code enabled for entering a different type of data such as employee identification
or job status. This allows different bar codes to be used in the
system while at the same time preventing the operator from
entering the wrong type of data into the data base.

-

Programmable operator feedback can be used to prompt the
operator, to signify that data has been validated by the computer, to differentiate between different workstations in
close proximity, to provide additional LED feedback in
extremely noisy environments, or for a variety of other
reasons.

Data Communications

Reader Control and status
(16800A only>

The 16800A and 16801A provide a flexible dual RS-232-C
(V.24) serial ASCII data communications capability which
can support a wide range of system configurations. The
reader offers the user the choice of full or half duplex transmission when in character mode and, if in an eavesdrop
configuration with a terminal, the reader can also be operated in block mode. The user can tailor the reader's data
communication configuration to the application by selecting the appropriate transmission mode (full/half duplex),
operating mode (character/block mode), data rate, parity,
terminator, stop bits, and inter-character delay on the readily
accessible 01 P switches. Request to Send/Clear to Send and
OC1/0C3 (XON/XOFF) traffic control is available.

The 16800A provides the user with added programmable
control overthe reader's operation and also enables the user
to obtain on-line status information regarding the reader's
configuration and functionality. The programmable control
and status features are described below:
Scanner Enable/Disable - When disabled, further bar code
scans are ignored.
Single Read Enable/Disable - When enabled, a single bar
code scan can be entered between "Next Read" commands.
Hard Reset - Commands the reader to return to the operating configuration prescribed by the DIP switch settings. An
automatic self-test is also executed.
Status Request - Commands the reader to send the status
of its operating configuration to the computer.

16800A Additional Capabilities
The 16800A offers expanded data communications capabilities with the added benefit of programmable control. In
addition toprogrammable control of the transmission mode
(full/half duplex) and the operating mode (character/block
mode), the 16800A provides the following programmable
features:
• User-definable header (up to 10 characters)
• User-definable terminator (up to 10 characters)
• OC1/0C3 (XON/XOFF) traffic control enable/disable

2-61
------~--

-

...

-~

...

--------~-

...

-.-~

.....

Specifications

Environmental Conditions

General

Temperature, Free Space Ambient:
Non-Operating:
-40 to 75° C (-40 to +167° F)
Operating:
0 to +55°C (+32 to 131° F)

Typical Wand Reading Characteristics:

Units

16830A
or 16840A

16832A
or 16842A

mm
in.

0.190
0.0075

0.127
0.005

Tilt Angle

degrees

0-45

0-45

Scan Speed

em/sec
in./sec

7.6-127
3-50

7.6-127
3-50

Wavelength

nm

700

820

Parameter
Minimum
Recommended
Nominal Narrow
Element Width

5 to 95% (non-condensing)

Humidity:
Altitude:
Non-Operating:
Operating:

Sea level to 15300 metres
(50,000 feet)
Sea level to 4600 metres
(15,000 feet)
0.38 mm (0.015 in.) p-p,
5 to 55 to 5 Hz, 3 axis

Vibration:

30g, 11 ms, 112 sine

Shock:

Physical Specifications
2.0 kg (4.4 pounds)

Weight, including wand:
Bar Codes Supported:
Standard: 3 of 9 Code (ANSI MH10.8M-1983;
MIL-STD-11891
Interleaved 2 of 5 Code (ANSI MH10.8M-19831
Industrial 2 of 5 Code
Optional:

UPC/EAN/JAN (Option 001)
Codabar (Option 002)
Others (contact factory)

Weight, polycarbonate
wand only:
(including coiled cordI

0.13 kg (0.3 pounds)

Weight, industrial
wand only:
(including coiled cordI

0.16 kg (0.4 pounds)

Reader Dimensions:

Data Communications

Polycarbonate Wand
Dimensions:

134 mmW x 23 mmD x 20 mmH
(5.3 in.w x 0.9 in.D x 0.8 in.H)
158 mmW x 24 mmD x 18 mmH
(6.2 in.w x 0.9 in.D x 0.7 in.HI

Data Rate:

110,300,600,1200,2400,4800,
9600 baud. Switch Selectable.

Industrial Wand
Dimensions:

Parity:

O's, 1's, Odd, Even. Switch
Selectable.

Wand Cord Length:

Terminator:

CR, CR/LF, Horizontal Tab
(HT), None. Switch Selectable.

Programmable Header/
Terminator (16800A
only):

User defined. Maximum of 10
characters each.

Stop Bits:

1 or 2. Switch Selectable.

Inter-Character Delay:

30 ms or None. Switch
Selectable.

Standard Asynchronous
Communications
Interface:
Transmission Modes:

Operating Modes:

Traffic Control:

94 cm (37 in.) - retracted
206 cm (81 in.) - extended

Power Requirements
Input Voltage:

100V (+5%,
(Opt. 210)
120V (+5%,
(Standard)
220V (+5%,
(Opt. 222)
240V (+5%,
(Opt. 224)

Power Consumption:

EIA Standard RS-232-C (CCITT
V.24)

-10%) at 48-66 Hz
-10%) at 48-66 Hz
-10%) at 48-66 Hz
-10%) at 48-66 Hz

20 VA maximum

Regulatory Agency Approvals

Full or half duplex, asynchronous. Switch selectable.
Programmable in 16800A.

RFI/EMI:
- VDE 0871 level B
- FCC Class B

Character or Block Mode.
Switch selectable. Programmable in 16800A.

Safely Approvals:
- UL478, UL 114 for EDP and office equipment
- CSA C22.2-154 for EDP eqUipment
- VDE 0730 part 2P for EDP and office equipment
- Complies with IEC standard #380 and #435 for EDP
and office equipment

Request to Send/Clear to Send.
DC1/DC3 (XON/XOFF). Switch
Selectable. Programmable in
16800A.

Output Buffer:

260 mmW x 189 mmD X 71 mmH
(10.25 in.w x 7.4 in.D x 2.8 in.H)

255 Characters

Installation
All product preparation and installation can be performed by
the owner/user. Refer to the Operating and Installation
Manual supplied with the unit for detailed instructions.

2-62

Supporting Literature

Siegler ADM-31 to a DEC PDP-II Computer", Publication
Number: 5953-9365 (Available through local sales office)

For further information refer to:

Application Bulletin 61, "HP 16800A/16801A Bar Code
Reader Configuration Guide for an IBM 3276/3278 Terminal", Publication Number: 5953-9361 (Available through
local sales office)

16800A/16801 A Option 001 Data Sheet, Publication Number
5954-2156 (Available through local sales office)
16800A/16801 A Option 002 Data Sheet, Publication Number
5954-2157 (Available through local sales office)

Application Bulletin 62, "HP 16800A/16801A Bar Code
Reader Configuration Guide for an IBM 4955F Series 1 Process Control CPUIProtocol Converter and an IBM 3101
Terminal", Publication Number: 5953-9362 (Available
through local sales office)

16800A/16801A Operating and Installation Manual, PIN:
16800-90001
16800A/16801 A Option 001 Operating and I nstallation Manual Addendum, PIN: 16800-90004

Application Bulletin 63, "HP 16800A/16801A Bar Code
Reader Configuration Guide for an IBM 5101 Personal
Computer", Publication Number: 5953-9363 (Available
through local sales office)

16800A/16801 A Option 002 Operating and Installation Manual Addendum, PIN: 16800-90006
Application Note 1013, "Elements of a Bar Code System",
Publication Number: 5953-7732 (Available through local
sales office)

Application Bulletin 68, "HP 16800A/16801A Bar Code
Reader Configuration Guide for a MICOM Micro 280 Message Concentrator", Publication Number: 5953-9382 (Available through local sales office)

Application Bulletin 59, "HP 16800A/16801A Bar Code
Reader Configuration Guide for a DEC VT-l00 or Lear

Ordering Information
PRODUCT NO.

DESCRIPTION

16800A

PROGRAMMABLE BAR CODE READER - Includes 16830A digital wand, internal power supply
for 120V line voltage, power cord, and Operating and Installation Manual. Reader supports 3 of 9
Code, Interleaved 2 of 5 Code, and Industrial 2 of 5 Code.

16801 A

BAR CODE READER - Includes 16830A digital wand, internal power supply for 120V line voltage,
power cord, and Operating and Installation Manual. Reader supports 3 of 9 Code, Interleaved 2 of 5
Code, and Industrial 2 of 5 Code.

-001
-002
-210
-222
-224

Add UPC/EAN/JAN code reading capability; Delete Industrial 2 of 5 code
Add Codabar code reading capability; Delete Industrial 2 of 5 code
100V power supply
220V power supply
240V power supply

-320

Delete 16830A digital wand; Add 16832A digital wand

-400

Delete 16830A digital wand; Add 16840A industrial digital wand

-420

Delete 16830A digital wand; Add 16842A industrial digital wand

-610

Add Wall Mounting Kit

-910

Additional Operating and Installation Manual

ACCESSORIES
16830A

General Purpose Digital Bar Code Wand

16832A

High Resolution Digital Bar Code Wand

16840A

Industrial (Metal) General Purpose Bar Code Wand

16842A
HBCS-2999

Industrial (Metal) High Resolution Bar Code Wand
16830A/16832A Replacement Sapphire Tip

HBCS-4999

16840A/16842A Replacement Sapphire Tip

16800-61000

Wall Mount Kit

HEDS-0200

20 foot Wand Extension Cord

03075-40006
17355A

External Wand Holder
2.7 metres (9 feet) Male-Male RS-232-C cable. Shielded.

LITERATURE
16800-90001
16800-90004
16800-90006

Operating and Installation Manual
Option 001 Operating and Installation Manual Addendum
Option 002 Operating and Installation Manual Addendum

2-63

FliOW

HEWLETT

a:~ PACKARD

UPC/EAN/JAN
BAR CODE READERS

16800A
OPTION 001

16801A
OPTION 001

TECHNICAL DATA

JANUARY 1986

Features

Description

• FLEXIBLE COMMERCIAL CODE READING
CAPABILITY
- UPC-A, UPC-E
- EAN-8, EAN-13
- JAN-8, JAN-13
- 2-Digit Supplemental Encodation
- 5-Digit Supplemental Encodation

Option 001 adds bar code reading capability for the Universal Product Code (UPC), European Article Numbering
Code (EAN),and Japanese Article Numbering Code (JAN)
to the HP 16800A Programmable Bar Code Reader and HP
16801A Non-Programmable Bar Code Reader.

• TWO STANDARD INDUSTRIAL BAR CODES
- 3 of9 Code
- Interleaved 2 of 5 Code
• AUTOMATIC CODE RECOGNITION
• COMPATIBLE WITH UPC SHIPPING
CONTAINER SYMBOL SPECIFICATION
• HIGH PERFORMANCE DIGITAL WANDS
- 45 Degree Scan Angle
- Replaceable, Sealed, Sapphire Tip
- Polycarbonate or Metal Case

All popular versions of the UPC, EAN and JAN bar codes
may be enabled, including UPC-A, UPC-E, EAN-8,
EAN-13, JAN-8 and JAN-13. All codes may be read simultaneously, or only UPC-A and UPC-E may be enabled.
UPC, EAN, and JAN codes with complementary 2-digit or
5-digit supplemental encodations, or "add-ons", may be
read in one of two ways. If UPC, EAN, and JAN codes are
enabled but neither 2-digit nor 5-digit supplemental encodations are enabled, then symbols printed with, or without,
supplements can be read and only the main symbol will be
output. If 2-digit (or 5-digitl supplemental encodations are
enabled, then only symbols with 2-digit (or 5-digitl supplements can be read and both the main symbol and the
supplement are output. 2-digit and 5-digit supplemental
encodations may be enabled simultaneously.
Two standard industrial codes, the 3 of 9 code and Inter~
leaved 2 of 5 code, may also be read with Option 001.
These two codes may be enabled individually, simultaneously, and/or in conjunction with the UPC, EAN, and JAN
codes. The implementation of the Interleaved 2 of 5 code
is compatible with the UPC Shipping Container Symbol
Specification.

2-64

cannot read colored bar codes and, therefore, is not
recommended for reading the UPC, EAN, and JAN bar
codes.

Industrial 2 of 5 code reading capability, available with the
standard HP 16800A and HP 16801A, is not provided with
Option 001.

Applications which require an industrial wand are supported by the optional 16840A and 16842A digital bar code
wands. These wands feature a solid metal case and internal construction designed for abusive environments. The
16840A and 16842A have the same bar code reading characteristics as the 16830A and 16832A. respectively.

Applications
Option 001 to the HP 16800A and HP 16801A Bar Code
Readers provides an excellent solution for both commercial and industrial applications by supporting the popular
UPC, EAN, and JAN codes as well as the industry standard 3 of 9 and Interleaved 2 of 5 codes.
Typical applications for UPC, EAN, and JAN codes
include:
-

Point-of-sale
Inventory control in retail stores
Order entry for retail products
Tracking periodical and/or book returns
Tracking coupon receipts
Production line tracking in consumer products manufacturing plants

The 3 of 9 code and Interleaved 2 of 5 code are commonly
used for work-in-process tracking and inventory control
applications. Some applications may require that the 3 of 9
code or Interleaved 2 of 5 code be read interchangeably
with the UPC, EAN, and/or JAN codes. For example, products which are marked with a UPC code may be shipped
in a container marked with the Interleaved 2 of 5 code.
The automatic code recognition capability of the HP
16800A and HP 16801A allows these codes to be read
interchangeably.

Supporting Literature
For further information, refer to:
16800Al16801A Option 001 Operating and Installation
Manual Addendum, PIN: 16800-90004
16800Al16801A Operating and Installation Manual, PIN:
16800-90001
16800Al16801A Data Sheet, Publication No.: 5954·2155

Ordering Information
Product
Number

PROGRAMMABLE BAR CODE
READER
Includes 16830A digital wand, internal power supply for 120 V line
voltage, power cord, and Operating
and Installation Manuals. Reader
supports UPC, EAN, JAN, 3 of 9, and
Interleaved 2 of 5 codes.

16801A
-001

NON-PROGRAMMABLE BAR CODE
READER
Includes 16830A digital wand, internal power supply for 120 V line
voltage, power cord, and Operating
and Installation Manuals. Reader
supports UPC, EAN, JAN, 3 of 9, and
Interleaved 2 of 5 codes.

Typical applications for 3 of 9 code and Interleaved 2 of 5
code include:
-

Inventory control
Work-in-process tracking
Distribution tracking
Records management
Government packaging and shipping
Labor reporting
Asset management

Description

16800A
-001

Wand Selection

-210

100 V power supply

The HP 16800A and HP 16801A Bar Code Readers include
an HP 16830A digital bar code wand which is capable of
reading bar code symbols which have nominal narrow
bar/space widths of 0.19 mm (0.0075 in.) or greater. A 700
nm visible red emitter enables the HP 16830A to read a
wide variety of colored bar codes. This wand is recommended for reading the UPC, EAN, and JAN bar codes.

-222

220 V power supply

-224

240 V power supply

-320

Delete 16830A digital wand; add 16832A
digital wand

-400

Delete 16830A digital wand; add 16840A
industrial digital wand

-420

Delete 16830A digital wand; add 16842A
industrial digital wand

An optional HP 16832A digital bar code wand is available
for very high resolution codes having nominal narrow
bar/space widths of 0.13 mm (0.005 in.) to 0.20 mm (0.008
in.). An 820 nm near-infrared emitter enables the HP
16832A to read black-and-white bar codes and the blackon-black bar codes used in some security systems. It

-610

Add Wall Mounting Kit

-910

Additional Operating and Installation
Manuals

2-65
---_._----_.

"liOW

HEWLETT

~~ PACKARD

CODABAR
BAR CODE READERS

16800A
OPTION 002

16801A

OPTION 002

TECHNICAL DATA

JANUARY 1986

Features

Applications

• CODABAR CODE READING CAPABILITY

Codabar code is commonly used for material tracking,
customer identification, and traceability in four specific
application areas:

• TWO STANDARD INDUSTRIAL BAR CODES
- 3 of9 Code
- Interleaved 2 of 5 Code
• AUTOMATIC CODE RECOGNITION
• HIGH PERFORMANCE DIGITAL WANDS
- 45 Degree Scan Angle
- Replaceable, Sealed, Sapphire Tip
- Polycarbonate or Metal Case

Description
Option 002 adds bar code reading capability for Codabar
to the HP16800A Programmable Bar Code Reader and
HP16801A Non-Programmable Bar Code Reader. Transmission of the start and stop characters which are part of
each Codabar symbol is user-selectable.

-

Libraries
Hospitals
Film Processing
Package Tracking

The 3 of 9 code is also popular in these applications,
especially where an alphanumeric code is preferred. In
some circumstances, both the 3 of 9 code and Codabar
code may need to.be read interchangeably. This capability
is provided by the automatic code recognition feature of
the HP16800A and HP16801A.
The 3 of 9 code and Interleaved 2 of 5 code are generally
preferred in industrial applications and in applications
which involve interfacility or intercompany movement of
goods. These applications include:

Two standard industrial codes, the 3 of 9 code and Interleaved 2 of 5 code, may also be read with Option 002.
These two codes may be enabled individually, simultaneously, and/or in conjunction with the Codabar code.

-

Industrial 2 of 5 code reading capability, available with the
standard HP16800A and HP16801A, is not provided with
Option 002.

2-66

Inventory control
Work-in-process tracking
Distribution tracking
Records management
Government packaging and shipping
Labor reporting
Asset management

wand Selection

Ordering Information

The HP16800A and HP16801A Bar Code Readers include
an HP16830A digital bar code wand which is capable of
reading bar code symbols which have nominal narrow
bar/space widths of 0.19 mm (0.0075 in.1 or greater. This
wand is recommended for reading all low resolution bar
codes, such as those produced with dot matrix printers,
and for reading high resolution 3 of 9 and Interleaved 2 of
5 bar codes. It may also be used to read most high resolution Codabar symbols.
An optional HP16832A digital bar code wand is available
for very high resolution codes having nominal narrow
bar/space widths of 0.13 mm (0.005 in.l to 0.20 mm (0.008
in.l. This wand may provide superior performance when
reading high resolution Codabar symbols since this code
has a nominal narrow bar width of 0.17 mm (0.0065 in.l. An
820 nm near-infrared emitter enables the HP 16832A to
read black-and-white bar codes and the black-on-black
bar codes used in some security systems.
Applications which require an industrial wand are supported by the optional 16840A and 16842A digital bar code
wands. These wands feature a solid metal case and internal construction designed for abusive environments. The
16840A and 16842A have the same bar code reading characteristics of the 16830A and 16832A, respectively.

Supporting Literature

Product
Number

16800A
-002

16801A
-002

-210
-222
-224
-320
-400
-420

For further information refer to:
16800Al16801A Option 002 Operating and Installation
Manual Addendum, PIN: 16800-90006
16800Al16801A Operating and Installation Manual,
PIN: 16800-90001

-610
-910

Description

Programmable Bar Code Reader
Includes 16830A digital wand, internal
power supply for 120V line voltage,
power cord, and Operating and Installation Manuals. Reader supports
Codabar, 3 of 9, and Interleaved
2 of 5 codes.
Non-Programmable Bar Code Reader
Includes 16830A digital wand, internal
power supply for 120V line voltage,
power cord, and Operating and Installation Manuals. Reader supports
Codabar, 3 of 9, and Interleaved
2 of 5 codes.
100V Power Supply
220V Power Supply
240V Power Supply
Delete 16830A Digital Wand; add
16832A Digital Wand
Delete 16830A Digital Wand; add
16840A Industrial Digital Wand
Delete 16830A Digital Wand; add
16842A Industrial Digital Wand
Add Wall Mounting Kit
Additional Operating and Installation
Manuals

16800Al16801 A Data Sheet, Publication No: 5954-2155

2-67
..._.

-----_._-----------

~:I
-

Fli;'

':1.:.

HEWLETT
PACKARD

INDUSTRIAL
DIGITAL BAR CODE
SLOT READERS

HBCS-7000
HBCS-7001
HBCS-7100
HBCS-7101

TECHNICAL DATA

JANUARY 1986

Features
• MINIMAL FIRST BAR DISTORTION
- Compatible with Most Decoding Software
• LARGE SLOT WIDTH
- Allows Reading Multiple Laminated Cards

,

• SEALED METAL CASE
- Can Be Installed Outdoors or in Wet
Environments
• TAMPER PROOF DESIGN
- Ideal for Security Applications
• AVAILABLE IN EITHER VISIBLE 660 nm OR
INFRARED 880 nm VERSIONS
• WIDE TEMPERATURE RANGE
- -40 to 70°C (HBCS-7100)
- -20 to 55°C (HBCS-7000)
• WIDE SCAN SPEED RANGE
• BLACK TEXTURED EPOXY FINISH
• SINGLE 5 VOLT SUPPLY

Description
Hewletf-Pa<;kard's Industrial Digital Slot Readers are designed to provide excellent scanning performance on a
wide variety of bar coded cards and badges. They contain a
unique optical/electrical system that integrates over a large
area of the bar/space pattern, providing a greatly improved
first read rate even on poorly printed bar codes.

The standard slot reader comes with the optical/electrical
assembly mounted on a base plate with an opposite rail. A
104 cm (41 in.) straight cord and a 5 pin, 240 degree,
locking DIN connector are also standard.

The HBCS-7000 has a visible red (660 nm) optical system
with a resolution of 0.19 mm (0.0075 in.). The HBCS-7100
model has an infrared (880 nm) optical system with a
resolution of 0.19 mm (0.0075 in.).
The extra large depth of field allows these slot readers to
have a slot width of 3.175 mm (.125 in.), thus making it
possible to read even multiple laminated cards and badges.
When used as a stand alone optics module, the maximum
depth of field is dependent on resolution.
The optics and electronics are housed in a rugged metal
case. The cases are fully gasketed and sealed, making them
suitable for use in outdoor or wet environments. The black
epoxy coating adds a durable, finished look to these Digital
Slot Readers. When installed using the rear screw holes, the
units become tamper-proof, making them excellent choices
for security access control.
The optical system is centered in the slot track, allowing the
user to easily scan from either direction. The wide slot width
makes it easy to insert and slide the cards. The optical
system is covered with a recessed window to prevent contamination and reduce the wear on the cards.

The optical/electrical system is also available as a separate
unit which can be integrated into other equipment or used
as a stand alone sensor assembly.

Applications
The digital bar code slot reader is a highly effective alternative to keyboard data entry. Bar code scanning is faster and
more accurate than key entry and provides far greater
throughput. In addition, bar code scanning typically has a
higher first read rate and greater data accuracy than optical
character recognition. When compared to magnetic stripe
encoding, bar code offers significant advantages in flexibility
of media, symbol placement and immunity to electromagnetic fields.
Hewlett-Packard's Industrial Digital Slot Readers are designed for applications where high first read rate and durability are important factors. The epoxy coated metal case,
with its tamper-proof mounting system, makes these slot
readers ideal choices for security access control, time and
attendance recording and other bar coded badge and card
reading applications.

2-68

specifications
Symbol

Parameter

Min.

Units

Max.

Notes

Nominal Narrow Element Width

HB.CS~7000/7001

0.19 (0.0075)

mm (in.)

HBtS-710017101

0.19 (0.0075)

mm(ln.)

Scan Velocity

VSCAN

Co'ntrast

cm/silc (in/sec)

%

1

5.5

Volts

2
3

RW-RB

45

Supply Voltage

Vs

4.5

Temperature
H BCS-700017001

TA

-20

+55

TA

":40

+70

°c
°c

100

mA

HBC8-710017101
Supply Current

c.

305 (120)

Is

3

Noles:
1. Contrast is defined as Rw-RB where Rw is the reflectance of the white spaces and RB is the reflectance of the black bars, measured at
the emitter wavelength (660 nm or 880 nm). Contrast is related to print contrast signal (PCS) by PCS = (Rw-RB)/Rw or Rw-RB =
PCS x Rw.
2. Power supply ripple and noise should be less than 100 mV peak to peak.
3. Non-condensing. If there is a frost or dew covering over the optics window, it should be removed for optimal scanning performance.

Selection Guide
Part Number

Description

HBCS-7000

Complete Slot Reader assembly with 660 nM visible red fight source and 0.19 mm
(0.0075 in.) nominal resolution.

HBCS-7100

Complete Slot Reader assembly wlth 880 nM infrared fight source and 0.19 mm (0.0075
in.) nominal resolution.

HBCS-7001

Optics/electronics module only with 660 nM visible red light source and 0.19 mm
(0.0075 in.) nominal resolution.

HBGS-7101

Opticsielectonics module only with'S80 nM infrared light source and 0.19 mm (0.0075
in.) nominal resolution.

HBGS-799S

Optional side rail assembly for use with HBCS·70011710t

Dimensions
138.1~~

COMPLETE SLOT READER

HBCS-7000/7100

t

(or-

17.526

"'.00
(5.00)

~

!

-

11'r:t -

MOUN~

OPTICS/ELECTRONICS MODULE

12.70
10.50)

r----,3.175
10.125)

t

V\I

t

HOLE

MOUNTING
HOLE

114,30
104.50)

CABLE

EX'T~
(4)

~~NCATING

.

()

+' \

~

2~rr~

11~
19.05
10.75)

1

~

52.07
-(2.05)

I ~~I
U

~

I

I

~

lP

°0
I.

10.50)

•

~

.1

127.00
(5.00)

J
i

1=

I

C@

f:::,
127.00
15.00)

38.10
11.50)

20.32
10.80)

I I

I·
2-69

J=t
19.05
10.75)

RAIL ONLY
H8CS-7998

20.32
(.80)

DIMENSIONS IN MILLIMETRES
AND (iNCHES).

20.32
10.80)

HBCS-700117101

t

.1-:J68
10.42)

t
t
5.334

10.210)

•

•
•
•
••

3-1

•
•
•

•
•

•

'i';:;j;~'}·'·'l

-------------------

Optocouplers
Hewlett-Packard's original approach toward
integrated output detectors provides performance
not found in conventional phototransistor output
devices. A family of optocouplers has been
established to provide reliable, economical, high
performance solutions to problems caused by
ground loops and induced common mode noise
for both analog and digital applications in
commercial, industrial and military products.

coupled line receiver that can be connected
directly to twisted pair wires without additional
circuitry, and optocouplers that provide complete
isolated transmit and receive functions for a 20
rnA current loop. Commercial burn-in and
screening programs are available for HewlettPackard's plastic optocouplers upon special
request. See the High Reliability section (page 8-1)
for additional details.

The capabilities of this family span a wide range.
Device selections include: programmable ACiDC
power sensing input with logic output; speeds up
to 40M bits/s; CTR gains as high as 2000% and
input currents as low as 0.5 rnA. HP's HCPL2200 features guaranteed propagation delay of 300
ns max. from 0 to 85 degrees C with a wide VCC
range from 4.5 V to 20 V and ICC of only 6 rnA.
Additionally, the high CMR of 1000 VIJ.tS and
built-in hysteresis help assure reliable circuit
design.

Many of these devices are available in dual
channel versions as well as in hermetic DIP
packages. For military users, Hewlett-Packard's
established, and DESC recognized hi-reI
capability facilitates economical, hi-reI purchases.

Hewlett-Packard also has available highly linear
optocouplers that are useful in analog
applications, a unique integrated-input optically

Hewlett-Packard plastic optocouplers are now
available for surface mount (see Option 100)
applications, and higher insulation voltage (see
Option 010) applications. Our newest optocoupler,
the HCPL-2400, features a guaranteed data rate
of 20 MBaud over temperature. Additionally the
HCPL-2400 simplifies high speed design with specifications for pulse width and channel distortion, and
power supply noise immunity.

3-2

-

----------------- ------ ._-----

High Speed Optocouplers
Device

o ~{~~vee
~ V.

ANODE ~I¥
CATHODE ~
@

6N135

Transistor Output

~ Vo

HCPL-4502
HCPL·2502

.

um~

HCPL-2530

CATHODE,2;

7 VOl

cmODE, 3,
ANODe, 4 '

6 V" HCPL-2531
5 GND

o

lID Vee

HCPL-2200

ANOOE~~+-'r:~vour
L:~v'

~GND

@
~

ClID Vee

HCPL·2300

~Rl

CATHODE~ "(~~VOUT

HCPL-2400
IT'I5rcc
ANODE~1f
~ vE

~ Vo

\!

'---

~GNO

8~

ANOOE 2

6N137

1 V,

CATHODE 3

. .'

Option OtO"

Page
No.

1 M bills

7% Min.

16mA

3000 V dc

2500 V ac

3-9

'"

Telephone circuits,
Approved by CNET

1 M bills

15% Min.
40% Max .

16mA

1500 V dc

Line Receiver, Analog
Circuits, TTLiCMOS,
TTLiLSTTL Ground
Isolation

1 M bills

7% Min.

16mA

3000 V dc

Low Input Current
Optically Coupled
Logic Gate
3 State Output
Vee ~ 20 V Max.

High Speed Logic
Ground Isolation,
LSTTL. TTL, CMOS
Logic Interface

5 M bills

Low Input Current,
High Speed OptoCoupler

High Speed, Long
Distance Line
Receiver, Computer
Peripheral Interfaces,
CMOS Logic Interface

aM bills

20 MBaud, High
Common Mode
Rejection, Optically
Coupled Logic Gate
3 State Output

High Speed Logic
Isolation, AID and
Parallel/Serial
Conversion, Communications, Networks,
Computers

40 M bit Is

Optically Coupled
Logic Gate

Line Receiver, High
Speed Logic Ground
Isolation

10 M bills

High Common Mode
Rejection, Optically
Coupled Logic Gate

Line Receiver, High
Speed Logic Ground
Isolation in High
Ground or Induced
Noise Environments

10 M bills

Optically Coupled
Line Receiver

Dual Channel
Optically Coupled
Gate

DUill Channel,
High Common Mode
Rejection, Optically
Coupled Logic Gate

Dual Channel
Transistor Output

6 Vour

~r--~Vee

HCPL-2601

ANOOE~~~=- BV,

{~mv,,!

CATHODE@:

I!

l...- IDGNO
~

fif
L

+IN 2

HCPL-2602

7 VE

6 VOUT

5 GNO

4

~

ANOOE'~;
IiIVcc HCPL·2630
CATHooE,[i]
V"
CATHODE, ~:;.t>-/ID V"
ANODEd~
lru GNo

"t>-jIl

~-

ANooE'O(}:

CATHoDE,~

lID vee HCPL·2631

1"1>- ~ V"

CATHOOE'~l3'tl>- ~ v"
ANODE, @

~ ~ GND

~

'"

15·22%

'"

19% Min.

4 TTL
Loads

1.6 mA

5 TTL
Loads

0.5 mA

5 TTL
Loads

5.0 mA

aTTL
Loads

5.0 mA

aTTL
Loads

5.0 mA

Replace Conventional 10 M bills
Line Receivers in High
Ground or Induced
Noise Environments

aTTL
Loads

5.0mA

Line Receiver, High
Speed Logic Ground
Isolation

10 M bills

aTTL
Loads

5.0 mA

Line Receiver, High
Speed Logic Ground
Isolation in High
Ground or Induced
Noise Environments

10 M bills

8 TTL
Loads

5.0mA

'Standard Parts meet the UL 1440 V ac test for 1 minute.
"Option 010 parts meet the UL 2500 V ac test for 1 minute.

3-3

3000 V dc

'"
3000 V de:

'"
3000 V de

'"
3000 V de

'"

5 GND

4

-IN

Standard'

Pin 7 Not Connected

@ ~~GNO
'---

CATHODE@

Specllled
Input
Current

19% Min.

SL5505

IT
ANODEIl~J

Line Receiver, Analog
Circuits, TTLiCMOS,
TTLiLSTTL Ground
Isolation

Current
Transfer
Ratio

~GND 6N136

~

CATHODE~

Apptlcatlonlll

Description

Withstand Test
Voltage

Typical
Data Rate
INRZ)

3000 V dc

'"
3000 V dc

'"
3000 V dc

'"
3000 V de

'"

3-13
2500 V ac

3-15

'"
2500 V ac

3-19

'"
2500 V ac

3-23

'"
2500 V ac

3-29

'"
2500 V ac

3-35

'"
2500 V ae

3·39

'"
2500 V ac

3-43

'"
2500 V ac

3·49

'"
2500 V ae

'"

3·53

High Gain Optocouplers
Device

Description
6Nt38

~~r

ANODE 2 ,
CATHODE

7 Vs

Vo

4

.'.'~~
3

";00

6 VOl

3

Option DID"

Page
No.

100k bills

300% Min.

t.6mA

3000 V dc

2500 V ac

3-57

'iU

400% Min.

Dual Channel, High
Gain, Vee ~ 7 V Max.
Dual Channel, High
Gain, Vee ~ 18 V Max.

Line Receiver, Polarity tOOk bit/s
Sensing, Low Current
Ground Isolation

Darlington Output
Vee ~ 7 V Max.
Darlington Output
Vee ~ 20 V Max.

AC IsolatIOn, RelayLogic Isolation

HCPL-273t

4N45

5 Vo
4 GND

Standard'

HCPL-2730

5 GND

ANDDErnVS

CATHODE 2 \ \

Specified
Input
Current

Low Saturation
Voltage, High Gain
Output, Vee ~ 18 V
Max.

7 VOl

ANODE, 4

Line Receiver, Low
Current Ground
Isolation, TTLiTTL,
LSTTLITTL.
CMOS/TTL
Line Receiver, Ultra
Low Current Ground
Isolation, CMOSI
LSTTL, CMOS/TTL.
CMOS/CMOS

Current
Transler
Ratio

6Nt39

5 GND

2

Low Saturation
Voltage, High Gain
Output, Vee ~ 7 V Max.

Applicallonlll

4N46

Withstand Test
Voltage

Typical
Data Rate
INRZ)

3k bills

'iU

0.5 mA

300% Min.

t.6 mA

400% Min.

0.5 mA

250% Min.

t.O mA

3000 V dc

'iU

'iU

3000 V dc

2500 V ac

'iU

'iU

350% Min.

0.5 mA

Inpul
Threshold
Current

Output
Current

Siandard'

2.5 mA TH+
1.3 mA TH-

4.2 mA

3000 V dc

Input
Characteristics

Oulput
Char·
acteristics

3-61

2500 V ac

3-65

AC/DC to Logic Interface Optocoupler
Oescripllon

Device

~

HCPL-3700

AC/DC to Logic
Threshold Sensing
Interface Optocoupler

Appllcationl 11
Limit Switch
Sensing, Low Voltage
Detector, Relay
Contact Monitor

Typical
Data Rales
4 KHz

Withstand Tesl
Voltage

'iU

Page
No.

Option 010"

3-69

'iU

20 mA Current Loop Optocouplers
Device

~

Description
HCPL-4tOO

Optically Coupled
20 mA Current Loop
Transmitter

Appllcallonl 11
Isolated 20 mA
Current Loop in:
• Computer
Peripherals
• Industrial
Control Equipment
• Data
Communication
Equipment

Typical
Dala Rates

20 kBd (at TTLiCMOS 27 V Max.
400 metres)
Compliance
Voltage

Wilhsland Tesl
Voltage
Standard'

Option 010"

Page
No.

3000 V dc

2500 V ac

3-75

'iU

'iU

HCPL-4200

~~

Optically Coupled
20 mA Current Loop
Receiver

6.5 mA
Typ.
Threshold
Current

'Standard Parts meet the UL 1440 V ae test for 1 minute.
"Option 010 parts meet the UL 2500 V ac test for 1 minute.

3-4

3 State
Output

3-83

Optocoupler Options

(Do not apply to Hermetic Optocouplers)

Option

Description

010

Special construction and testing to ensure the capability to withstand 2500 V ac input to output for one minute. Testing is
recognized by Underwriters Laboratories, Inc. (File No. E55361). This specification is required by U.L. in some applications
where working voltages can exceed 220 V ac.

100

Surface mountable optocoupler in a standard sized dual-in-line package with leads trimmed (butt joint). Provides an
optocoupler which is compatible with surface mounting processes.

Very High Voltage Isolation
Hewlett-Packard Low Cost Fiber Optic links provide cost
effective isolation of voltages from 10KV to hundreds of KV.
TTL compatibility with data rates up to 5 MBd can be
attained using the HFBR-1510/2501/3510. See page 6-5,
1986 Catalog for more details or contact your HewlettPackard Field Representative.

3-5

Hermetic Optocouplers
Device

~~@
" f!IDlicC

[i

~

g
~GNO
~'---~

~.

2

Vee

3

I

•

II':

5

I

6

.:

.
,

Line Receiver.
Ground Isolation for
High Reliability
Systems

8102801EC

DESC Approved
6N134

Military/High
Reliability

6N134TXV

TXV - Screened

6N134TXVB

TXVB - Screened
with Group B
Data

Use 8102801EC
in New Designs

HCPL-1930

Dual Channel
Hermetically sealed
High CMR Line
Receiver Optocoupler

Line receiver, High
Speed Logic Ground
Isolation in High
Ground or Induced
Noise Environments

HCPL-1931

MIL-S TD-883
Class B Part

MilitarylHigh
Reliability

HCPL-5700

Single Channel
Hermetically Sealed
High Gain Optocoupler

5GND

HCPL-5701

MIL-STD-883
Class B Part
Dual Channel
Hermetically Sealed
High Gain Optocoupler
MIL-STD-883
Class B Part

.~..

2

\:;:

-.J

SGND

o~~
[?
, ~lIcc
Dty't>-j!lJ
@ ot>-@
[If};t>-~

rn

.t>-II

[l~~

~GND

ii,---lID

o~~~

[1

g'
@

'8-69
-

8-66

500 V dc

8-79

Hermetically Sealed
Package Containing
4 Low Input Current.
High Gain Optocouplers
8302401EC
DESC Approved
6N140A
6N140A/883B MIL-STD-883
(6N140/883B) Class B Part
6N140TXV
TXV - Hi-Rei
Screened
TXVB - Hi-Rei
6N140TXVB
Screened with
Group B Data

Line Receiver. Low
Power Ground
Isolation for High
Reliability Systems
Military /High
Reliability
Use 8302401 EC
in New Designs

100k bills

4N55

Dual Channel
Hermetically Sealed
Analog Optical
Coupler

Line Receiver,
Analog Signal
Ground Isolation.
Switching Power
Supply Feedback
Element

700k bitls

4N55/883B

MIL-STD-883
Class B Part

Military!High
Reliability

4N55TXV

TXV - Hi-Rei
Screened

Use
4N55/883B in

4N55TXVB

TXVB - Hi-Rei
Screened with
Group B Data

New Designs

HCPL-5730

HCPL-5731

6N140A
(6N140)

~
~
11

~~~

8-66

0.5 mA

ffi~t~

@

1500 V dc

200% Min .

, 7 VOl

'f~'""'

10mA

60k bit/s

7 NC

6 VO

400% Typ.

Line Receiver, Low
Current Ground
Isolation, TTLiTTL.
LSTTLITTL, CMOS /TTl
Military/High
Reliability
Line Receiver, Polarity
Sensing, Low Current
Ground Isolation
MilitarylHigh
Reliability

l1VOUT

4

10M bitls

8-73

10

3

Page
No.

1500 Vdc

12V,

: ~

Withstand
Test
Voltage

10mA

1J Vou,

.

Specified
Input
Currenl

400% Typ.

,.v,

GNO

Current
Transfer
Ratio

10M bills

H,

.~"

4

Dual Channel
Hermetically Sealed
Optically Coupled
Logic Gate

~

[jf}~t>-~v",
1m

@

Application

6N134

\ t>-~v"

~

2

Description

Typical
Data Rate
[NRZJ

3-6

~

300% Min.

0.5 mA

1500Vdc

8-87

ta:91

t-a:87

9% Min.

16mA

1500 V dc

8-96

r~dI
. . ,: lji,EWL§TT

.e~ RACKAAD

OPTOCO

LER OPTION
P 25~:O VaC!
1 MINUTE REQU.IREMENT

OPTION 010

TECHNICAL DATA

Features

JANUARY 1986

DEVICE MARKING

• SPECIAL CONSTRUCTION AND TESTING
• UL RECOGNITION FOR 2500 V ac/1 MINUTE
REQUIREMENT (FILE NO. E55361)

r;,;;- xxx~;;;­

TYPE NUMBER
QATECODE

II!I!JIIIYYWW~

• AVAILABLE FOR ALL PLASTIC OPTOCOUPLERS

•

010,

PIN

• 480 V ac LINE VOLTAGE RATING

ON~

UL

RECOGNITION
OPTION CODE

Description
Option 010 consists of special construction on a wide range
of Hewlett-Packard plastic optocouplers. After assembly,
each unit is subjected to an equivalent electrical performance test to insure its capability to withstand 2500 Vac
input to output for 1 minute. This test is recognized by
Underwriters Laboratory as proof that these components
may be used in many high voltage applications.

specifications
All specifications for optocouplers remain unchanged when
this option is ordered. The 2500 Vac/1 Minute capability is
validated by a factory 3200 Vac/1 Second dielectric voltage
withstand test.

Applications

Ordering Information

The 2500 Vac/1 Minute dielectric withstand voltage is
required by Underwriters Laboratory when components are
used in certain types of electronic equipment. This requirement also depends on the specific application within the
equipment. Some applicable UL documents are listed
below.
UL Spec.
Number
1577
114
347
478
508
544
698
773
913
916
1012
1244
1410

To obtain this high voltage capability on plastic optocouplers order the standard part number and Option 010.
Examples:
6N135
Option 010

HCPL-3700
Option 010

This option is currently available on all standard catalog
plastic optocouplers except SL5505.

Specification Title
Standard for Optical Isolators
Applications
Appliance and Business Equipment
High Voltage Industrial Control
Equipment
Information Processing and Business
Equipment
Industrial Control Equipment
Medical and Dental Equipment
Industrial Control Equipment for Use in
Hazardous Locations
Plug-in, Locking Type Photocontrols
Intrinsically Safe Apparatus and
Associated Apparatus
Standard for Energy Management
Equipment
Power Supplies
Electrical and Electronic Measuring and
Testing Equipment
Television and Video Products

3-7

F/i;a HEWLETT

~~ PACKARD

SURFACE MOUNT OPTION
FOR OPTOCOUPLERS

OPTION 100

TECHNICAL DATA

JANUARY 1986

Features
• SURFACE MOUNTABLE
Leads Trimmed for a Butt Joint Connection
• COMPATIBLE WITH VAPOR PHASE REFLOW AND
WAVE SOLDERING PROCESSES
• MEETS ALL ELECTRICAL SPECIFICATIONS OF
CORRESPONDING STANDARD PART
NUMBERS
• LEAD COPLANAR lTV WITHIN 0.004 INCHES
• AVAILABLE FOR ALL OPTOCOUPLERS IN
PLASTIC PACKAGES
• AVAILABLE IN STANDARD SHIPPING TUBES

Description
Option 100 is an optocoupler in a standard sized dual-in-line
package, with trimmed leads (butt joint). The distance from
the printed circuit board (PCB), to the bottom of the optocoupler package, will be typically 0.035 inches. The height of
the optocoupler package is typically 0.150 inches, leaving a
distance of 0.185 inches from PCB to the top of the optocoupler package.

Ordering Information
Option 100 is available for all optocouplers in plastic
packages.
To obtain surface-mountable optocouplers, order the standard part number and Option 100.
Examples:
6N136
Option 100

Applications
Option 100 enables electronic component assemblers to
include HP optocouplers on a PCB that utilizes surfacemount assembly processes. Option 100 does not require
"through holes" in a PCB. This reduces board costs, while
potentially increasing assembly rates and increasing component density per board.

HCPL-2200
Option 100
OPTION 100 DRAWING

Ftrill

a!!P..

Specifications

XXXX
YYWWRJ
100

TYPE NUMBER

DATE CODE
IJl RECOGNITION
OPTIOIllCODE

a

All electrical specifications for optocouplers remain unchanged when this option is ordered. In addition, the
device will withstand typical vapor phase reflow soldering
conditions of 215°C for 30 seconds, and wave solder
immersion for 5 seconds, @260°C.
DIMENSIONS IN MI LLIMETFI'S IINCHES)

Nole: For complete dimensions, refer 10 outline drawing
of corresponding catalog part number.

3-8

---~-

~-------~--------~

Flio-

6N135
6N136

HIGH SPEED
OPTOC0UPLE!RS

HEWLETT

~a PACKARD

HCPL-2502
HCPL·4502

TECHNICAL DATA

OUTLINE DRAWING'

JANUARY 1986

SCHEMATIC

,..-------08 vee
2

ANODE

~

~>-=---'¥

~

CATHODE ....
F _____
..J

_-----ovo

3
5
~---_oGND

7

---t
I

I
I

O.16i.030~

I

I

t --

-

*4.70 1.18Ul MAX.

-t

~

170 tOSS) 1~1- ;.!~ !:~~~~

NC ,

** Note: For HCPL-4502, pin 7 is not connected,

ANODE 2

Applications

Q,51L020)
MIN.
CATHODE 3

• Line Receivers - High common mode transient immunity
1>1000V//ls) and low input-output capacitance 10.6pFI.

2,92 (.115) MIN,

r---0-.65{..0251MAX.

"
VB

NC 4

'----.. .

• High Speed Logic Ground Isolation - TTUTTL, TTL/LTTL,
TTL/CMOS, TTL/LSTTL.

O1MENSIONS IN MllUMETRES ANa (lNCHESI,

•

Features
• HIGH SPEED: 1 Mbit/s
• TTL COMPATIBLE
• HIGH COMMON MODE TRANSIENT IMMUNITY:
>1000V//-Ls TYPICAL

• Replace Pulse Transformers weight.

Save board space and

• Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.

• 2 MHz BANDWIDTH
• OPEN COLLECTOR OUTPUT
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).

Absolute Maximum Ratings
Storage Temperature' ,.,., ............. -55°C to +125°C
Operating Temperature' ,." ... ,......... -55°C to 100°C
Lead Solder Temperature' ................. 260°C for 10s
(1.6mm below seating plane)
Average Input Current - IF' ..................... 25mAlli
Peak Input Current - IF' .. . . . . . . . . . . . . . . . . . . . .. 50mAI21
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF' . . . . . . . . . . . . . . . . .. 1,OA
(::;1/ls pulse width, 300pps)
Reverse Input Voltage - VR' (Pin 3-2) ................. 5V
Input Power Dissipation' ........................ 45mWl 3 1
Average Output Current - 10' (Pin 6) ................ 8mA
Peak Output Current' ... . . . . . . . . . . . . . . . . . . . . . . . . . 16mA
Emitter-Base Reverse Voltage' (Pin 5-7, except -4502) ... 5V
Output Voltage' - Va (Pin 6-5) ............... -0.5V to 15V
Supply Voltage' - Va (Pin 6-5) ............... -0.5V to 15V
Output Voltage - Vo (Pin 6-5) ............... -D.5V to 20V
Supply Voltage - Vee (Pin 8-5) .............. -D.5V to 30V
Base Current - lB' (Pin 7, except HCPL-4502) . ....... 5mA
Output Power Dissipation' ..................... 100mWI 4 1

Description
These diode-transistor optocouplers use an insulating layer
between the light emitting diode and an integrated photon
detector to provide electrical insulation between input and output. Separate connection for the photodiode bias and output
transistor collector increases the speed up to a hundred times
that of a conventional photo-transistor coupler by reducing the
base-collector capacitance.
The 6N135 is for use in TTL/CMOS, TTL/LSTTL or wide
bandwidth analog applications, Current transfer ratio (CTR) for
the 6N135 is 7% minimum at IF = 16 mA.
The 6N136 is designed for high speed TTLITTL applications. A
standard 16 mA TTL sink current through the input LED will
provide enough output current for 1 TTL load and a 5.6 kfl pullup resistor, CTR of the 6N136 is 19% minimum at IF = 16 mAo

CAUTION: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to /
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which may
be induced by ESD,

The HCPL-2502 is suitable for use in applications where
matched or known CTR is desired. CTR is 15 to 22% at IF = 16 mA.
The HCPL-4502 provides the electrical and switching performance of the 6N136 and increased ESD protection.
*JEDEC Registered Data (The HCPL-2502 and HCPL-4502 are not
registered.!

Replace Slow Phototransistor Isolators - Pins 2-7 of the
6N135/6 series conform to pins 1-6 of 6 pin phototransistor
couplers. Pin 8 can be tied to any available bias voltage of
1.5V to 30V for high speed operation,

See notes, following page.

3-9

Electrical Specifications Over recommended temperature (TA = DoC to 70°C) unless otherwise specified.
Parameter

Sym.

CTR'
Current Transfer Ratio
CTR

logic Low
Output Vottage

Logic High
Output Current

VOL

Device

Min.

6N135

7

Typ"*
18

6N136
HCPl-4502

19

24

HCPL-2502

15

18

Logic High
Supply Current

19

%

%

IF = l6mA, Va = O.5V, Vee = 4,5V
IF 16 mA, 10
TA=2S"C

6N135

D,l

D.4

V

6N136
HCPL-2502
HOPL-4502

D.l

0.4

V

3

500

nA

om

itA
I'A

IF = OmA, Vo = Vee = l5V

mVl"O
V

5
60

pF

IF = l6mA, TA =25°C

3

IF= 16mA
IR = lDj1A, TA = 25"C

if = 1MHz. VF = 0

1012

!l

45% RH, t - 5s, VI_O - 3kV dc,
TA = 25°C
RH < 60%, I = 1 min.
V'-0 - 500Vdc

0,6

pF

f~lMHz

150

-

Vo=5V, to=3mA

j1A

1
2500

hFE

=16mA, Vo = Open, VCC =15\/

IF = OmA, Va '" Open, Vce = 15V

aVR'

C,-o

IF

j1A

I nput Reverse
Breakdown Voltage

vlSO
RI-o

j1A

V

VRMS

5

6

j1A

-1.6

5,12

=

1

~
.HA

Transistor DO
Current Gain

1
50

=

2
1.7

Temperature Coefficient
of Forward Voltage

1,2,4

IF = l6mA, 10 = 2.4mA, Vee'" 4.5V,
TA = 25°0

0.02

1.5

Note

=1.1mA, Vee = 4,5V,

IF = OmA, Vo = Open, Vce = l5V
TA = 25"C

W'

OPT. 010
Resistance (Input-Outpull
Capacitance
(Input-Output)

=

IF = OmA, Vo = Vee = 5.SV
TA=25"0
IF OmA, Va = Vee 15V
TA=2S"C

50

ICCH

Fig,

%

25

I nput Forward Voltage

CIN

%

22

5

ICCH'

Ii-a'

Test Conditions

IF - 16mA, Vo - OAV, Vee = 4.6V
TA = 25'C

15

ICCL

Input-Output
Insulation

%

6N136
HCPL-4502

10H'

Input Capacitance

Units

6N135

10H
Logic Low
Supply Current

Max.

6,11

13
6
6

'For JEDEC registered parts.

""All tYPlcals at TA = 25'C

Switching Specifications at TA = 25 0 C Vee = 5V, IF = 16mA, unless otherwise specified
Parameter

Propagation Delay
Time 10 Logic Low
at Output
Propagation Delay
Time to Logic High
at Output
Common Mode Transient Immunity at Logic
High level Output
Common Mode Translent Immunity at Logic
Low Level Output
Bandwidth
NOTES:

1.
2.
3.
4.
5.

Sym.

tPHL'

tPlH'

Typ!'

Max.

Units

6N135

0,2

1,5

j1S

RL =4.1kU

6N136
HCPL-2502
HCPL-4502

0.2

0.8

"'S

RL = 1,9k!!

Device

Test Condifions

6N135

1.3

1.5

P.s

RL = 4,lkil

6N136
HCPL-25D2
HCPL·4502

0.3

0.8

I's

RL

6N135

1000

V/j1s

IF= OmA, VCM = 10 Vp,p, RL =4.1kll

1000

VIj1S

IF =0 m, VCM = 10 Vp-p , RL = 1.9ki!

6N136
leMHI HCPL-2502
HCPL-4502
6N135
6N136
ICMLI HCPL-2502
HCPL-4502

BW

Min.

= 1.9kll

1000

VII's

VCM = 10Vo-P" RL = 4.1 kG

1000

VIj1S

VCM = tOV p_p, RL = 1.9kn

MHz

RL-l00n

2

Derate linearly above 70"C free-air temperature at a rate of O.8mAl"C.
Derate linearly above 70 a e free-air temperature at a rate of 1.6mA/"C.
Derate linearly above 70°C free·air temperature at a rate of O.9mWtC.
Derate linearly above 70° C free·air temperature at a rate of 2.0mWrC.
CURRENT TRANSFER RATIO is defined as the ratio of output collector
current, 10. to the forward LED input current, I F. times 100%.
6. Device considered a two-terminal device: Pins 1, 2. 3. and 4 shorted
together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in Logic High level is the maximum
tolerable (positive) dVCM/dt on the leading edge of the common mode

8.
9.
10.
11.
12.
13.

Fig.

Note

5,9

8,9

5,9

8,9

10

7,8,9

10

7,8,9

8

10

pulse VCM. to assure that the output will remain in a Logic High state (I.e .. Vo > 2.0V).
Common mode transient Immunity in Logic Low level is the maximum tolerable (negative)
dVCM/dt on the trailing edge of the common mode pulse signal, V CM ' to assure that the
output will remain in a Logic Low state (i.e .. Vo < O.BV).
The 1.9kr! load represents 1 TTL unit load of 1.6mA and the 5.6kn pull-up resistor.
The 4.1kn load represents 1 LSTTL unit load of O.36mA and 6.1 kn pull-up resistor.
The frequency at which the ac output voltage is 3dB below the low frequency asymptote.
This is a proof lest. This rating is equally validated by a 2500 Vac, 1 sec. test.
The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. HP guarantees a
minimum CTR of 19%.
See Option 010 data sheet for more information.

3-10

------

TA

0

ts"c

1.S , . . - - - - - - - . , . - - - - - - , . - - - - - . . . . ,

,"c'-':::'

.... 40-mA
----6N135

10 -~VCC -S,OV

....

I

I

~I

'"

E
I

.....

".-

----

--

_ .....

....

__ ..

---

t"----

I-

~

a:
a:

~I

"

IV

:::>

I-

~

I-

- 6 N 1 3 5 . HCPL.
'"
"fil

20 wA

:::>

o

N

~:;;

I

2

15 rnA

o,sl-------ti------f-------;

'oz"
10 mA

If "'"SmA

o

o

10

20

Vo -OUTPUT VOLTAGE-V

IF -INPUT CURRENT- rnA

Figure 1. DC and P'ulsed Transfer Characteristics.

Figure 2. Current Transfer Ratio vs. Input Current.

1,1

t- -......
-. ~

~
0

1.0

i=

''""

~

I

~

I

'"z

ffi

'a:"

a:
a:

'\

I'

0,9

l-

:::>

I-

Z

""'"

~-G~'36 I 1- - 6N136. HCPL-4502

--t--+--

L'"

w

1'\,
1'\,

il2

4'

O.4V

fA ·26'<:

I\. '.,

0,8

"fil

I

Vo

Vee "W

"\

a:
a:

:::>

NORMAllZEO
IF o lGmA

N

::;

'"

:;;

a:
0
z

0.7

1.50
VF - FORWARD VOLTAGE - VOLTS

0.6
-60

-40

-20

20

40

60

80

100

120

140

TA - TEMPERATURE _oC

Figure 3. Input Current vs. Forward Voltage.
IF,18mA.VCC· S,OV

- -GN1351Rl" 4,1kn)

Figure 4. Current Transfer Ratio vs. Temperature.

J J J

~ 10~4

1500 t----6NI36. HCt'L·25ll2.HCI'L-Ml02 (R. '1.9kn)

;w

"

~

~

100 0

I

500

I'

"

"g:

....

""

"'~

......

o

I
I-

~
a:
a:

1F·O

j

t- Vt) := Vee

10n

11<

5.OV

:::>

"

I-

~

5o

~1~

)lH

:c.V--60

...1-......

r---"""

1-.....

-- --

1--- ~--

10+ 1

:I:

'"
~

J~; 1.-.-::;

100

"

(;

9

10- 1

~

",,-

L

",...

L

V

L

V

L

I
%

.9 10-2
-40

-20

20

40

60

80

100

-50

-25

+25

+50

+75

+100

TA - TEMPERATURE _ °C

Figure 5. Propagation Delay vs. Temperature.

Figure 6. Logic High Output Current vs. Temperature.

3-11

!1l

TA "*"2S"C
~5

If''' l6mA

I

.,w

"
~a:

o

~
a:

.30

.,z~

"a:~

TA

'

25 C: 11L "loon,
e

.20

f:'i

a:
a:
u

:;,

-'
 1000Vl!Ls TYPICAL
• HIGH DENSITY PACKAGING
• 3 MHz BANDWIDTH
• OPEN COLLECTOR OUTPUTS
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).

•

Description
The HCPL-2530/31 dual couplers contain a pair of light
emitting diodes and integrated photon detectors with
electical insulation between input and output Separate
connection for the photodiode bias and output transistor
collectors increase the speed up to a hundred times that of
a conventional phototransistor coupler by reducing the
base-collector capacitance.
The HCPL-2530 is for use in TTUCMOS, TTULSTTL or
wide bandwidth analog applications. Current transfer ratio
(CTR) for the -2530 is 7% minimum at IF = 16 mA.
The HCPL-2531 is designed for high speed TTUTTL
applications. A standard 16 mA TTL sink current through
the input LED will provide enough output curent for 1 TTL
load and a 5.6 kfl. pull-up resistor. CTR of the -2531 is 19%
minimum at IF = 16 mA.

•
•
•
•
•

Line Receivers - High common mode transient immunity
(>1 OOOV /l.Is) and low input-output capacitance (O.6pF).
High Speed Logic Ground Isolation - TTL/TTL, TTL/
L TTL, TTL/CMOS, TTL/LSTTL.
Replace Pulse Transformers - Save board space and weight.
Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.
Polarity Sensing.
Isolated Analog Amplifier - Dual channel packaging enhances thermal tracking.

Absolute Maximum Ratings
Storage Temperature . . . . . . . . . . . . . . . _55°C to +125°C
Operating Temperature . . . . . . . . . . . . . . -55°C to +100°C
Lead Solder Temperature. . . . . . . . . . . . .. 260°C for lOs
(1.6mm below seating plane)
Average Input Current - IF (each channel) . . . . .. 25mA[ll
Peak Input Current - IF (each channel) . . . . . . . . . 50mA[2]
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current -IF (each channel) .... 1.0A
(~ll.1s pulse width, 300pps)
Reverse Input Voltage - VR (each channel) . . . . . . . . . . 5V
Input Power Dissipation (each channel) . . . . . . .. 45mW[3]
Average Output Current - 10 (each channel) ....... 8mA
Peak Output Current - 10 (each channel) . . . . . . . . . . 16mA
Supply Voltage - V cc (Pin 8-5) . . . . . . . . . . - 0.5V to 30V
Output Voltage - Va (Pin 7,6-5) . . . . . . . . . - 0.5V to 20V
Output Power Dissipation (each channel) . . . . ..
35mW[4]
See notes, following page.

3-15

Electrical Specifications
Over recommended temperature (TA = O°C to 70°C) unless otherwise specified.
Parameter

Current Transfer Ratio

Logic Low
Output Voltage

Logie High
Output Current
Logic Low
Supply Current

Sym.

CTR

VOL

Min.

Typ.*"

Max.

Units

7

18

%

24

%

2530

19
5

2531

15

2530
2531

%
%

Input Forward Voltage

VF

Temperature Coefficient
of Forward Voltage

AVF
ATA

Input Reverse
Breakdown Voltage

VR
CIN

Input-Output
Insulation

11_0

IF ~ 16mA, Vo = O.SV, VCC = 4.5V
TA = 25°C

IF = 16mA, 10
TA = 25"C

V

2531

0.1

0.5

V

3

500

nA

TA = 25°C,IFl = 11"2 = 0,
VOl = V02 = VCC = 5.5V

50

)LA

IFl = IF2=0,
VOl = V02 = VCC = 15V

p;A

11"1 = 11"2= 16mA
VOl = V02 = Open, VCC

IF1 = 11"2 =OmA
Val =V02= Open, Vee = 15V

0.05

4

p;A

1.5

1.7

V

.

TA =25"C

IF = 16mA, TA

B

= 15V

3

5

V

IF = 10p;A, TA = 25·C

5

pF

f = lMHz, VF = 0

5

45% RH,t =5s, Vl-O- 3kV dC,TA-25°C

7,13

RH :5 50%, t = 1 min.

14

=500Vdc

7

60

p;A
VRMS

1012

n

Capacitance
( Input-Output)

CI_O

0.6

pF

fe lMHz

Input-Input Insulation
Leakage Current

'I-I

0.005

p;A

45% Relative Humidity, t
V,_I; 500Vdc

Resistance (Input-Input)

R,_,

1011

II

VI_1

Capacitance
f Input-Input)

CI_I

0.25

pF

f=lMHz

VI-D

7
~

5s

8

=500Vdc

8

8
•• All typicals at 25" e.

'For JEDEC registered parts.

Switching Specifications 'at TA = 25°C
Sym.

Propagation Delay
Time To Logic Low
at Output

tPHL

Propagat ion Delay
Time to Logic High
at OutPut

tpLH

Common Mode Tran·
sient Immunity at Logic
High Level OUtput

leMHI

Common Mode Tran·
sient Immunity at Logic
Low Level Output

ICMLI

Device
HCPL·

Vce = 5V, IF = 16mA, unless otherwise specified

Typ.

Max.

Units

2530

0.2

1.5

Jl,S

2531

0.2

0.8

p;s

AL

2530

1.3

1.5

p;s

RL=4.1kf1.

2531

0.3

0.8

p;s

RL = 1.9kfl

2530

1000

V!us

IF =OmA,RL -4.1 kll.VeM=10Vp _p

2531

1000

V!p;s

I F=OmA, R L=1.9kn, V CM=l OVp_p

2530

1000

V/p.s

VCM=10Vp-p , RL

2531

1000

V/p.s

VCM

Min.

BW

NOTES:

1.
2.
3.
4.
5.
6.

5
5

=25°e

RI_O

Bandwidth

5

'F - l6mA, 10 - 2.4mA, Vec - 4.5V,

Resistance
( Input-Output}

Parameter

5,6

5

mVre

2500

V,SO

1.2

11"= 16mA

-1.6

1

Note

= 1.1mA, VCC =4.5V,

0.5

100

Fig.

IF = 16mA, Vo = 0.5V, VCC = 4.5V

0.1

5

Input Capacitance

Test Conditions

2530

ICCL
ICCH

OPT. 010

HCPL-

IOH

Logic High
Supply Current

I

Device

Derate linearly above 70°C free-air temperature at a rate of O.8mAt'C:
Derate linearly above 7rfC free-air temperature at a rate of 1.6mAf'C.
Derate linearly above 70°C free-air temperature at a rate of O.9mWf'C.
Derate linearly above 70°C free·air temperature at a rate of 1.0mWfC.
Each channel.
CURRENT TRANSFER RATIO is defined as the ratio of output collector
current, '0, to the forward LED input current, 'F. times 100%.
7. Device considered a two·terminal device: Pins 1. 2, 3, and 4 shorted
together and Pins 5, 6,7, and 8 shorted together.

MHz

3

Test Conditions

Note

5,9

10,11

5,9

10,11

RL =4.lkn

=1.9kn

10

9,10,11

10

9,10,11

8

12

=4.1kfl

=10Vp-p. RL = 1.9kU
RL =lOon

8. Measured between pins 1 and 2 shorted together, and pins 3 and 4
shorted together.
9. Common mode transient immunity in Logic High level is the maximum
tolerable (positive) dVCM/dt on the leading edge of the common mode
pulse VCM, to assure that the output will remain in a Logic High state
O.e., Va > 2.0V). Common mode transient immunity in Logic Low
level is the maximum tolerable (negative) dVCM/dt on the trailing
edge of the common mode pulse signal, VCM. to assure that the output
will rem3in in a Logic Low state (Le .• Vo < a.av).
10. The 1.9kn load represents 1 TTL unit load of 1.6mA and the 5.6kn
pull-up resistor.

3-16

Fig.

11. The 4.1 kflload represents 1 LSTTL uRit
load of O.36mA and 6.1 kn pull·up resistor.
12. The frequency at which the ac output
voltage is 3dB below the low
frequency asymptote.
13. This is a proof test. This rating is equally
validated by a 2500 Vac, 1 sec. test.
14. See Option 010 data sheet for more
information.

1.5.---.,.---,-------".,=--...",---,
- - _ _ _ HCPl·2530
- - - -____ HCPl·2531

o

~

0:

"

1.0 i------t---~~....,.....r ; - - - - - j

E
I

:i0:

NOl'MAlit2EO

~

IF

'" 16mA

Vo

~

*

....

~

tt-

0:
0:
::J

"....

a:
a:

~If_--------i;---- 20 rnA

~

!;
o

::J

"fil
N

I

0.5i------t1------t------j

::i
",.oa:

~----------__--1'~;·------15mA

.9

Q,4V

Vee'" 5V
TA =25"C

z

~--------+----

10 mA

~-----------------r_--------IF=5mA

0.1 0':-_-L......J-L..J...j...1..L':---...L..J....J....L.L~1o;---'--L...J.--'-u..:l~OO

20

10
Vo - OUTPUT VOLTAGE - V

IF - INPUT CURRENT - rnA

Figure 1. DC and Pulsed Transfer Characteristics.

Figure 2. Current Transfer Ratio vs. Input Current.

1.1
/"
1000

"1

100

ffi

10

E

0:

~

J-

E

f}

§

0:

::J

1.0

"o

0:

i~

~

:"

I

.2-

0.0

1~

"

/'

"a:

/

0.9

ffi
a:

'\

a:
::J

fil"
N

0.8

,."::ia:
1.40

I

NO~MAliZED

1,\
"\,

t-

V

1.30

I

"'\

U)

o
z

0.001 /
1.10
1.20

/

- - - HCPL·253,

z

/~

o. 1

I

~

/'

~

/'

1.0

~
0:

_~_lHcJ25301-

.........
~-

o
T, .25L -

I--

If

"16mA

Vo

~O.4V

Vee'" 6V
TA

'"

25~C

"
\

0.7

1.50

V F - FORWARD VOLTAGE - VOLTS

0.6
-60

-40

-20

20

40

60

80

100

120

140

TA - TEMPERATURE - °C

Figure 3. Input Current vs. Forward Voltage.
IF" 16 rnA, Vee'" 5.0V
·2530 IRl 4.1kll)
- '2531 IRl =1.9kll)

I- - -

,.

1500

r-

0

I-

~
o
z

.,,"

Q 1000

~

,/ "

g:

500

o

..- ....

"2

----

-60

IF -0

t-

a:
a:

::J

~

~

~ 10+

tPHL~

,

o

J:

-- --

'"

i

--- _1 \ ----:

"g

100

(;

10-

,

I
~

.9 10- 2
-40

-20

I

I-- Vo '" Vee" 5.0V

~

"....

i/""

:c.-1-

10+ 4

I

,',.

'"o~
I

,.

,. .... r--- ....

Figure 4. Current Transfer Ratio vs. Temperature.

20

40

60

80

---

-50

100

~

-25

/'

,/"

/'

/

./

,/

/"

I
+25

+50

+75

+100

T A - TEMPERATURE _ Co

TA - TEMPERATURE _oC

Figure 5. Propagation Delay vs. Temperature.

Figure 6. Logic High Output Current vs. Temperature.

3-17

TA "'25 C
9

"'I
~

-5

IF-:: 16mA

w

"'0z
~

TA •

2s"d. nL " 100n. ~CC" 5V

/

/

'/

-

-10

"'5l

-15

:J
-0

':0-1v~

: r",J

t..A>-0

H

DATA
INPUT

I

I
I

UP TO 16 LSTTL

~~~D:TL LOADS

r. . .

I

~

Li

L.....

>"-0

The 120 pF capacitor may be omitted in applications where 500 ns
propagation delay is sufficient.
Figure 1. Recommended LSTTL to LSTTL Circuit

Electrical Characteristics
For 0° C:5 TAll].:5 85° C, 4.5 V:5 Vee :5 20 V,l.S mA:5 IF(ON):5 5 mA, 2.0 V:5 VEH :5 20 V, 0.0 V:5 VEL :5 0.8 V,

o mA:5 IF(OFF) :5 0.1 mAo All Typicals at TA = 25° C, Vee = 5V, IF(ON) = 3 mA unless otherwise specified.
Pararnfler

Symbol

Logic low Output Voltage

Val

Logic High Output Voltage

VOH

Output Leakage Current
(VOlJT > Vee)

IoHH

Logic High Enable Voltage

VEH

Logic Low Enable Voltage

Vel

Lagle High Enable Current

leH

Logic Law Enable Current

IEl

Lagle Low Supply Current

Icel

Logic High Supply Currel'lt

leCH

MIn.

Typ.

Max.

Units

Test Coodit'fons

0,5

Volts

IOL = 6A mA 14 TTL Loads)

2.4

Volts
pA

lOH "'-2.SmA

Vo=5.5V

Figure
'VOH "VCC- 2.1V

Now

2

3

IF'''SmA
Vcc=4.5V

=S.5V

IOZL

High Impedance State
OUtput Current

10ZH

Logic Low Short Circuit
Output Current

IOSL

Logic High Short CIrcuit
Output Current

IOSH

40
-10

IF-SmA,
Vo"'GND

-25

.2

Input Current Hysteresis

IHYS

4

Input Forward Voltage

VF

S

Input Reverse Breakdown
Voltage

VA

Input Diode Temperature
Coefficient

AVF

InputooQutput
Insulation

11-0'

OPT. 010

5

ATA

VISO

Input-Output Resistance

Rr-O

Input-Output Capacllance

Ct-o

Input Capacitance

CIN

3,7:

2500

8
3
'" 1 MHz, VI~O

=0 voe

f'" 1 MHZ, VF" OV. Pins.2 and 3

'For JEDEC registered parts.

3-20

:3

switching Characteristics
0.0 mA::; IF(OFF)::; 0.1 mAo All Typicals at TA

= 2SoC,

For 0°C::;TAI 11::; S5°C, 4.5V::;Vee ::;20V, 1.6 mA::; IF(ON)::;S mA,
Vee = SV, IF(ON) = 3 mA unless otherwise specified.

Parameter,

,Symbol

Propagation Delay Time to
Logic Low Outpul Level

jPHL

Propagation Delay Time to
Logic High QutputLs>vel

tPLH

Output Enable Time to
Logfc:High

IpZH

210
160
170
115
25

Output Enable Time 10
Logic Low

tPZL

Output Disable Time
from Logic High

Min.

4,S

lOS

ns

8,10

Output Disable Time
from,Logic LOw

lPlZ

60

ns

8,9

Output Rise Time (10-90%)

t,

55

ns

6.11

QUIP"! Fall Time (90-10'/,)

tf

15

ns

~

6,11

Logip High CommoriMode ICMHI
T~I,lii,~ient Immunity

1000

10,000

V/MS

TA = 25°C. IF
VCM = 50 V

LdgJpL.oW Common Mode
Trailsient ImmUnity

1000

10,000

VIMS

TA - 25°C, IF VCM =50 V

ICMLI

,

'o-6,4",A-

~

O. 7

~

0.6

-3

~

0.5

-4

-J

0.4

1

1:;

o

-60

-40

-20

20

40

60

80

8

100

-60 -40

TA - TEMPERATURE _oC

6

Vee =4.5V
iA '" 2s'"C
I

o
>

fOH :o-2.-1jmA

eo

r--...

~
:>
I

g

r-....

IOL"' 6ArnA

-20

20

40

60

80

°OL----~.5~----7-----~,~.5----~

100

IF - INPUT CURRENT - rnA

TA - TEMPERATURE -"C

Figure 2. Typical Logic Low Output
Voltage vs. Temperature

12,13

o

"

7

O. 1

°

"~

\

6

O. 2

6

w

Vo" ~AV

O. 3

12,13

>

Va "'2,7V

-5

1.6mA

V~"4.~V
IF o:5mA"-

\\

2

~

.

6,7

tpHZ

O.8

~I

itor
or

With Peaking

4,5

8,9

~

-'

Wit

ns

300

Note

6,7

ns

w

o

W',"o", ""'''"a C.
",,""'
aeitor

\300

Figure

28

vL~4L
IF""OmA

~

I

ns

8.10

1

>

',.Te~rCondl\ions

Units

ns

0.9

~

Max.

Typ.

'0 .

Figure 3. Typical Logic High Output
Current vs. Temperature

Figure 4. Oulput Voltage vs. Forward
Input Current

PULSE
GENERATOR

vee

,.
I

02
D3
D,

~
C

"i=
"it"
0

0

it

.".

I

I>
RI
IFION)

2.1SKl1
1.6 rnA

1.1KR
3 rnA

681fl
5 rnA

5~6~O--_~40--_~20~~~2=O--4~'--~60~~8~O~'0'O

ALL DIODES ARE lN916 OR lN3064

VF - FORWARD VOLTAGE - VOLTS

INPUT IF

OUTPUT
Vo

Figure 5. Typical Input Diode Forward
Characteristic

~

- - - I F (ON)

-

_ -

_ - - -)50% IF(ON)

PLH

~
tpHL

TA - TEMPERATURE -"C

OmA

- - VOH

---------

1.3V VOL

Figure 6. Test Circuil for tpLH. tpHLo
and t,

3-21

t~

Figure 7. Typical Propagation Delays vs.
Temperature

...---....., Cl "'- 15 pF INCLUDING PROBE
AND JIG CAPACITANCE
+5V
PULSE
GENERATOR

X'

Vee

Zo = 50n
tr =tf=5ns

10 0

51

>CJ
Z
0

D2

~~

"~

D4

~

0

~

m

~

20V

I

0
60

40

20

JCL"15pF
cc • 5~

100
I
w

/

80

/

~
~

60

V

a:

40

~

m
~

40

I

60

,....

0

tpZH

I

!J80

o

100

60

40

20

20

40

TA - TEMPERATURE _

-

60

20V

4.$V

80

100

°c

Figure 10. Typical Logic High Enable
Propagation Delay vs. Temperalure

~
>2:

r

:>

8000

~

7000

i>-D

6000

~ 4000
-50V

~

VCM

I

OV

20

SWITCH AT A: IF '" 1.6 rnA

VOH~
OUTPUT

20

9000

~. 5000

t,
40

>

Vi,

20

60

,s,10000

;;;

V

"

o

~

Vee

120

I

4.5V

w

Figure 9. Typical Logic Low Enable
Propagalion Delay vs. Temperalure

Figure 8. Tesl Circuit for IpHZ, IpZH, IpLZ,
and IpZL

ill

V

lOV

100

:

TA - TEMPERATURE - °C

OUTPUT
Vo

:t

20

J::~

Vee

tPtlZ
I

ili

!J-

'"

"

0

ili

150

~

. / <.W

~~

l - t--

>-

z
o

tP2:t.

~

20 0

~

! , /~
.."I..."

0

~

D3

I

0

~

;::

Vec
20V
4.5V

CL"15pF

Vo

40

TA - TEMPERATURE _

60

80

SWITCH AT B: IF '" 0 rnA

VO~

100

°c

VOL

CJ
~ 3000

~

2000

8'"

1000

I

1'i

0

500

1000

1500

200

VCM - COMMON MODE TRANSIENT VOLTAGE - V
*SEE NOTE 6

Figure 11. Typical Rise, Fall Time vs.
Temperalure

Figure 12. Tesl Circuil for Common Mode
Transienl Immunlly and Typical
Waveforms

Figure 13. Typical Common Mode
Transienllmmunily vs. Common Mode
Transienl Amplitude
Vee
(+5V)

VCCl
(+SV)

DATA
INPUT

RL
1:1i(
2.37K
3.83K

01 (1N916) REQUIRED FOR
ACTIVE PULL·UP DRIVER

5.11K

Figure 14. LSTTLlo CMOS Inlerface Circuil

Figure 15. Recommended LED
Drive Circuil

Figure 16. Series LED Drive wilh
Open Colleclor Gale (6.04 Kfl
Resislor Shunls IOH from Ihe LED)

The 120 pF capacitor may be omitted in applications where 500 ns propagation delay is sufficient.
Notes:
1. Derate total package power dissipation, P, linearly above 70° C free air
temperature at a rate of 4.5 mW/oC.
2. Duration of output short circuit time should not exceed 10 ms.
3. Device considered a two terminal device: pins 1,2,3 and 4 shorted
together, and pins 5, 6, 7 and 8 shorted together.
4. The tPLH propagation delay is measured from the 50% point on the
leading edge of the input pulse to the 1.3V paint on the leading edge of
the output pulse. The tPHl propagation delay is measured from the 50%
point on the trailing edge of the input pulse to the 1.3V point on the

5.
6.

7.
8.

3-22

trailing edge of the output pulse.
When the peaking capacitor is omitted, propagation delay times may
increase by 100 ns.
CMl is the maximum rate of rise of the common mode voltage that can
be sustained with the output voltage in the logic low state (Va < 0.8V).
CMH is the maximum rate of fall of the common mode voltage that can
be sustained with the output voltage in the logic high state (Va> 2.0V).
This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec.
test.
See Option 010 data sheet for more information.

L:9W INPUT CURRENT
HIGH SPEED
9PT9C9UPLER

HCPL-2300

TECHNICAL DATA

OUTLINE DRAWING

_Icc

,---.-----0
1000n

J
'F-:-

VF

_

3

SHIELD

Vee

~··.rr.

8

I

:

o.-.•.·.

6.10
•. . .
6.6010.2601

Va

-?-I

JANUARY 1966

<"';;~~.".....-r.-r-'

UL RECOGNITION

/L----_----.......O GND

7.3610.2901 L '
7.88 1?3101.

,-_

.....

0.,8tm
..OO71'
0.3310.0131

57

YP•

f

DIMENSIONS IN MILLlMETRES AND (lNCHESI

A 0.01 TO 0.1 }JF BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
TRUTH TABLE
PINS 8 AND 5. (SEE NOTE 11.
(POSITIVE LOGIC)

Figure 1. Schematic

Features
•
•

GUARANTEED LOW THRESHOLDS: IF = 0.5 mA,
VF :S1.5V
HIGH SPEED: GUARANTEED 5 MBd OVER
TEMPERATURE

• VERSATILE: COMPATIBLE WITH TTL, LSTTL AND
CMOS

o MORE EFFICIENT 820 nm AIGaAs IRED
• INTERNAL SHIELD FOR GUARANTEED COMMON
MODE REJECTION
•

SCHOTTKY CLAMPED, OPEN COLLECTOR
OUTPUT WITH OPTIONAL INTEGRATED PULL-UP
RESISTOR

•

STATIC AND DYNAMIC PERFORMANCE
GUARANTEED FROM _40 0 C to 85 0 C

•

SPECIAL SELECTION FOR LOW FORWARD
CURRENT APPLICATIONS (IF 2: 150 p.A)

•

RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).

Applications
•

GROUND LOOP ELIMINATION

•

COMPUTER-PERIPHERAL INTERFACES

•

LEVEL SHIFTING

•

MICROPROCESSOR SYSTEM INTERFACES

•

DIGITAL ISOLATION FOR AID, DIA CONVERSION

•

RS-232-C INTERFACE

•

HIGH SPEED, LONG DISTANCE ISOLATED LINE
RECEIVER

Description
The HCPL-2300 optocoupler combines an 820 nm AIGaAs
photon emitting diode with an integrated high gain photon
detector. This combination of Hewlett-Packard designed
and manufactured semiconductor devices brings high
performance capabilities to designers of isloted logic and
data communication circuits.
The low current, high speed AIGaAs emitter manufactured
with a unique diffused junction, has the virtue of fast rise
and fall ties at low drive currents. The HCPL-2300 has a
typical propagation delay of 120 ns at 0.5 mA forward
current. With special selection, the device can achieve 80
ns propagation delay at 150 p.A. Figure 6 illustrates the
propagation delay vs. input current characteristic. These
unique characteristics enable this device to be used in an
RS-232-C interface with ground loop isolation and improved
common mode rejection. As a line receiver, the HCPL-2300
will operate over longer line lengths for a given data rate
because of lower IF and VF specifications.
The output of the shielded integrated detector circuit is an
open collector Schottky clamped transistor. The shield,
which shunts capacitively coupled common mode noise to
ground, provides a guaranteed transient immunity specification of 100 V/p.s. The output circuit includes an optional
integrated 1000 Ohm pull-up resistor for the open collector. This gives designers the flexibility to use the internal
resistor for pull-up to five volt logic or to use an external
resistor for 18 volt CMOS logic.
The Electrical and Switching Characteristics of the HCPL2300 are guaranteed over a temperature range of -40 0 C to
85 0 C. This data sheet will allow users of the HCPL-2300 to
confidently implement all necessary static and dynamic
performance requirements which may be subjected to a
broad range of operating environments.

3-23

Recommended operating
Conditions

10.0

"E

Input Voltage, Low Level

I

Units

-2.5

0.8

V

0.5

1.0

0.5

0.75

VFL

Input Current 0° C to 85° C
High Level
1-40°C to 85°C

IFH

"O~~

'"~

Supply Voltage, Output

Vee 4.75 5.25

0.1

Fan Out (TTL Load)

N

Operating Temperature

TA

";:

mA

I

V

~

5

-40

85

dC

v.:~,

"

...
3'i
'"=>'"
"i 1
I

Sym. Min. Max.

E

I

0.01

1.1

/
/

I
II

1.3

1.2

1.,

VF - FORWARD VOLTAGE - VOLTS

Absolute Maximum Ratings

Figure 2. Typical Input Diode Forward Characteristic.

(No derating required)
Symbol

Min.

Max.

Units

Storage Temperature

Ts

-55

125

"c

Operating Temperature

TA

-40

85

·C

Parameter

Lead Solder Temperature

Reference

260° C for lOs. 0.6 m m below seati ng plane)

Average Forward Input Current
Reverse Input Voltage

IF

5

mA

VR

4.5

V
V

Vee

0.0

7,0

Pull-up Resistor Voltage

VRL

-0,5

Vee

V

Output Collector Current

10

·25

25

mA

Supply Voltage

Input Power Dissipation

PI

10

mW

Output Collector Power Dissipation

Po

40

mW

Output Collector Voltage

Vo

18

V

-0.5

See Note 2

Electrical Characteristics
For -40° C :S TA:S 85° C. 4.75 V :S Vee:S 5.25 V. VFl :S 0.8 V. unless otherwise specified.
All typicals at TA = 25 0 C. Vee = 5 V. unless otherwise specified.
Parameter

Symbol

Min.

Typ.

Max.

Units

250

Test Conditions

Figure Note

VF=0.8 V. Vo= 18 V

High Level Output Current

IOH

0.05

10

JlA

VF=O.8 V. Vo = 18 V,
TA=25°C

4

Low Level Output Voltage

Val

0.4

0.5

V

iF=0.5 mA
IOl {Sinking) = 8 mA

3

High Level Supply Current

leOH

4.0

6.3

mA

IF =0 mAo Veo '" 5,25 V

Low Level Supply Current

loel

6.2

10.0

mA

IF = 1.0 mAo Veo '" 5.25 V

1.3

1.5

Input Forward Voltage

VF

Input Diode Temperature
Coefficient

IlVF
IlTA

Input Reverse Breakdown
Voltage

BVR

Input Capacitance

CIN

Input-Output Insulation

h-o'

L OPT010

VISO

1,0

V
my/dC

-1.6
4.5
18
1
2500

IF = 1.0 mAo TA = 25°C

V

IR = 10 p.A. TA = 25°C

pF

VF = 0 V. f = 1 MHz

p.A

45% RH, t '" 5s.
VJ-O =3 kV dc,TA = 25°C
RH :S 50% t '" 1 MIN

VRMS

2

IF= 1.0 mA

3,9
10

ReSistance (Jnput-Output)

RI-o

1012

n

VI-O = 500 V

3

Capacitance (lnput-Outputl

CI-O

0,6

pF

f= 1 MHz

3

Internal Pull-up Resistor

Rl

680

1000

"For JEDEC registered parts.

3-24

1700

Ohms

Switching Characteristics
For -40° C ~ TA ~ 85° C, 0.5 mA ~ IFH ~ 0.75 mA;
For 0° C ~ TA ~ 85° C, 0.5 mA ~ IFH~ 1.0 mA; With 4.75 V ~ Vee ~ 5.25 V, VFL ~ 0.8 V, unless otherwise specified.
All typicals at TA = 25° C, Vee = 5 V, IFH = 0.625 mA, unless otherwise specified.
Max.

Units

5,8

)/eM = 50 V (peak),

7,8

8

9,10

6

9,}0

7

Vo (min.> =

2 V,
RL =5,.60n, IF = 0 rnA

Common Mi5de,
Transient Imm~~ity
at Low Output L.!'vel

100

VCM '" 50,V (peak),
Vo (max.> = 0.8 V,
RL = ~60n, IF = 0.5 rnA

V/p.s

400

(See page 5-35 for Notes)

\
>
I
w

TA

Vee

~ 5V

1
I

RL"'560:n

e-

o
I

iiia:

~ .,d·c"

/TA"O'C

""c;
o

~ TA 025'c

r------

./' /;A "'B5"C

>

e~
e=>

>-

a:
=>
e~
e=>

~

"

"oz
i=
"";;:

0

:I:

"i

o

0

g:

"g

I

"

{?

o

o

100

200

I

""

I

t

"a
300

~6~0~.~40~.~2~0~~~2~OLU+"0~~60~~B~0~'00

500

'00

- --

IF - FORWARD INPUT CURRENT - pA

TA - TEMPERATURE _

Figure 3. Typical Output Voltage vs.
Forward Input Current vs.
Temperature.

TA - TEMPERATURE _ °C

°c

A {-a.5 rnA TO 1.0 rnA, Cp '" 20 pF

Figure 4. Typical Logic High Output
Current vs. Temperature.

tpHL. {

- -0.5 rnA TO 0.75 rnA, Cp = 20 pF

8

-0.5 rnA, Cp '" 0 pF

C

-1,OmA, Cp '" 0 pF

D {-a.5 rnA TO 1,0 rnA, Cp

400

75

,L

--

\

>- 300

\

"

z

0

i= 200

IF

"'.5 V

c"oPFk I

= __
~r~r~

o Trr';r,~'
o 0.1 0.2
IF -

-<

"" ""

w

'-'i="

50

-'

:--

::i

a:
I

25

=,,;
1111

0.3 0.4 0.5 0.6 0.7 0.8 0.9

RI."'560~l

-O.5mA,Cp=DpF

CL

F

-1.0 rnA, Cp =

-<0

15pf

1.0

----

t,

o

r-

-60

r--

-40

-20

-

20

40

'f

V

60

80

FORWARD INPUT CURRENT - rnA

Figure 6. Typical Propagation Delay vs.
Forward Current.

Figure 7. Typical Rise, Fall Time vs.
Temperature.

3-25

20 pF

a pF

Figure 5. Typical Propagation Delay vs.
Temperature and Forward
Current With and Without
Application of a Peaking
Capacitor.

.,...,.. V
".,..

=

- -0.5 rnA TO 0.75 rnA, Cp '" 20 pF

E

./""

~

I<

-tft~H ..

tpLH {

ep '" ;20pF

AL ~ 560 ~l
CL '" 15- pF
TA
25"'C
\

WLH·

""

~XTENDED

OPERATING RANGE

Vee

\

100

Vcc- 5V

(SPEClAL SELECrION)

~

"
"is"g:

RECOMMENDED .. fF
OP~RATING RANGE

100

PULSE
GENERATOR

3,48kll

~

1.0 mA

Hp----..-o +5
560

~
;;;

V

~

Cl *

800

rE

;;;

WIRING CAPACITANCE.

600

"

t-

w

'"
o'"
"
I

'"

U

OUTPUT Vo

"'-

z

cc

VOH

400

"

o

~

o mA

,200

CMH, CML

lI-,
o
o

200

400

600

800

1000

VCM _ COMMON MODE TRANSIENT AMPLITUDE _ V

Figure 9. Typical Common Mode Transienl Immunily vs.
Common Mode Transienl Amplilude.

Figure 8. Tesl Circuil for 'pHL' 'pLH' 'r and If.

;--"\- -

ov--.J
560

0v

z
cc

, _ - - -....- - - - - - - IFH

n

-

50 V

r--

'------J

~v SWITCH AT A: VF = 0 V

OUTPUT Vo

A

-=-

VOH"Z,OV-

VOL'" o.a V
RL'56011
TA • 25'C

t-

OUTPUT Vo
MONITOR
NODE

*CL IS APPROXIMATELY
15 pF, WHICH INCLUDES
PROBE AND STRAY

_

Vee' 5 V
tFH ~ 0.5 rnA

Vn

'~"

n

HF="+-O

1000

CM

H

Hf---+---<:> MONITORING
NODE

SWITCH AT B: IF == 0.5 rnA
Va (MAX-I'

f\- -

Va 0,5 V _ _ _ _oJ,

,

eML

*SEE NOTES 6, 7,

Figure 10. Tesl Circuil for Common Mode Transienllmmunily and Typical Waveforms.

Applications
The HCPL-2300 optocoupler has the unique combination
of low 0.5 mA LED operating drive current at a 5 MBd
speed performance, Low power supply current requirement of 10 mA maximum and the ability to provide
isolation between logic systems fulfills numerous applications ranging from logic level translations, line receiver
and party line receiver applications, microprocessor 1/0
port isolation, etc, The open collector output allows for
wired-OR arrangement Specific interface circuits are illustrated in Figures 11 through 18 with corresponding
component values, performance data and recommended
layout
For -40° C to 85° C operating temperature range, a mid
range LED forward current (IF) of 0.625 mA is recommended in order to prevent overdriving the integrated
circuit detector due to increased LED efficiency at
temperatures between 0° C and -40° C, For narrower
temperature range of O°C to 85°C, a suggested operating
LED current of 0.75 mA is recommended for the mid range
operating point and for minimal propagation delay skew: A
peaking capacitance of 20 pF in parallel with the current
limiting resistor for the LED shortens tpHL by approximately 33% and tPLH by 13%. Maintaining LED forward
voltage (VF) below 0,8 V will guarantee that the HCPL-2300
output is off.
The recommended shunt drive technique for TTULSTTU
CMOS of Figure 11 provides for optimal speed performance, no leakage current path through the LED, and
reduced common mode influences associated with series
switching of a "floating" LED, Alternate series drive tec-

3-26

niques with either an active CMOS inverter or an open
collector TTULSTTL inverter are illustrated in Figures 12
and 13 respectively, Open collector leakage current of 250
MA has been compensated by the 3,16K Ohms resistor
(Figure 13) at the expense of twice the operating forward
current
An application of the HCPL-2300 as an unbalanced line
receiver for use in long line twisted wire pair communication links is shown in Figure 14. Low LED IF and VF allow
longer line length, higher speed and multiple stations on
the line in comparison to higher IF, VF optocouplers,
Greater speed performance along with nearly infinite
common mode immunity are achieved via the balanced
split phase circuit of Figure 15, Basic balanced (differentiall line receiver can be accomplished with one
HCPL-2300 in Figure 15, but with a typical 400 V/MS common mode immunity. Data rate versus distance for both
the above unbalanced and balanced line receiver applica"
tions are compared in Figure 16, The RS-232-C interface
circuit of Figure 17 provides guaranteed minimum common mode immunity of 100 V/MS while maintaining the 2:1
dynamic range of IF,
A recommended layout for use with an internal 1000
Ohms resistor or an external pull-up resistor and required
Vee bypass capacitor is given in Figure 18, Vee1 is used
with an external pull-up resistor for output voltage levels
(VOl greater than or equal to 5 V. As illustrated in Figure
18, an optional Vee and GND trace can be located
between the input and the output leads of the HCPL-2300
to provide additional noise immunity at the compromise of
insulation capability (VI-OJ.

OUTPUT

INPUT

HCPL-2300
r----------,

,

r---~~~--~--5V

I

'20 pF :
VIN

I
Va

~--~----_+_¢~----~------+_--+-----GND2

1----~r---1I--~:::::;::~_r----T_--~--_r--~

GND

R,,'

VIN
Vae

kn,:

5

6.19

RL

VCCtf<

kil

VDe

1
II~TERNALI

10
,"'15

10

'14.7

2.3Z

10

'15

",2tS:

3,19

15

"SCHOTTKY DIODE (HP 5082-2800, OR EQUIVALENT) AND 20 pF CAPACITOR
ARE NOT REQUIRED FOR UNITS WITH OPEN COLLECTOR OUTPUT.

Figure 11. Recommended Shunt Drive Circuit for Interfacing Between TTLlLSTTLlCMOS Logic Systems.,

HCPL-2300

OUTPUT

r----------,

INPUT

5 V

Vee

,

I

VDD

I

OUTPUT

I
I
5 V

HCPL-2300

----

3 V -25 V

-3V--25V

I
w

I

8

I
I

I

~

5V

I

Vo

a:

;::

7.1SK

«

n

"

L - LINE LENGTH - METRES

Figure 16. Typical Point to Point Data Rate vs. Length of Line
for Unbalanced (Figure 14) and Balanced
(Figure 15) Line Receivers using HCPL-2300
Optocouplers.
/' GND BUS IBACKI
(OPTIONAL)

______ J_

~_____, /

N.C.

N.C.crr.=r.~~~

vo,

GND

Figure 17. RS-232-C Interface Circuli with HCPL-2300.
0° C = T A = 85° C.
NOTES:
1. Bypassing of the power supply line is required with a 0.01 I'F
ceramic disc capacitor adjacent to each optocoupler as illustrated in
Figure 18. The power supply bus for the optocouplerlsl should be
separate from the bus for any active loads, otherwise a larger value
of bypass capacitor (up to 0.1 J.tF) may be needed to suppress regenerative feedback via the power supply.
2. Peaking circuits may produce transient input currents up to 100 rnA,
500 ns maximum pulse width, provided average current does not
exceed 5 rnA.
3. Device considered a two terminal device: pins 1,2,3 and 4 shorted
together, and pins 5, 6, 7 and 8 shorted together.
4. The tPLH propagation delay is measured from the 50% point on the
trailing edge of the input pulse to the 1.5 V point on the trailing edge
of the output pulse.
5. The tPHL propagation delay is measured from the 50% paint on the
leading edge of the input pulse to the 1.5 V point on the leading edge
of the output pulse.
6. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e.,
VOUT > 2.0 VI.

7.
N.C.

_____. , / Vo
~---'l+"~

*SEE NOTE 1

CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e.,
VOUT < 0.8 VI.

8. Cp is the peaking capacitance. Refer to test circuit in Figure 8.
9. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec.
test.
10. See Option 010 data sheet for more information

Figure 18. Recommended Printed Circuit Board Layout.

3-28

------

------

-----------------.~------------

20 M BAWD HIGH OMR
Loolc GAJE
OPTOOOWPLeR

HCPL-2400

TECHNICAL DATA

SCHEMATIC

OUTLINE DRAWING
...- tcc

ANODE

2,J'

V, +

CATHODE

JANUARY 1986

8

r---~-----'"'-o

Vee

;

~
5

TRUTH TABLE

L----+-------- 2.0 VI. CML is the maximum slew rate of
common mode voltage that can be sustained with the output
voltage in the logic low state (VO(MAX) < 0.8 VI.
7. Power Supply Noise Immunity is the peak to peak amplitude
of the ac ripple voltage on the Vce line that the device will
withstand and still remain in the desired logic state. For
desired logic high state. VOH(MIN) > 2.0 V. and for desired
logic low state. VOL(MAX) < 0.8 volts.
8. This is a proof test. This rating is equally validated by a
2500 V ac. 1 second test per UL E55 361.
9. Peak Forward Input Current pulse width < 50 p's at 1 KHz
maximum repetition rate.
10. See Option 010 data sheet for more information.
.0

>

I
w

'!:;<"

>

~

>

>-

::>

g

i!:::>

0
:J:

.0

I

w

0

3.0
,~vs

>-

3.S

~

'"

i



~C

1"

35

/'

........

0

5

25

,

V

~

6
35

~---+----+--

~

g:
I

70

/'
30~--~--r---r----~~~

Figure 7. Typical Propagation Delay
vs. Input Forward Current

25

50

70

85

TA - TEMPERATURE _ °C

Figure 8. Typical Pulse Width
Distortion vs. Ambient Temperature

S.OV

T

HCPL-2400

to '.00

0

IF - INPUT FORWARD CURRENT - mA

Vee

PULSE

GENEaATOR

2

25LO---~-~~--~----7----7'0·

C

Figure 6. Typical Propagation Delay vs.
Ambient Temperature

," ."

/""

c

50

TA - TEMPERATURE -

~c

40~--+--1----r---+----4

tr=1f-EiIl$

51

" o--l----t!h

1.3K

0

n
0

02

o

. D3

D4

J~j_~=======~J

INPUTVE
...
MONITORING(
NODE

S2

OUTPUTVO

""1.5V
VOL
VOH
""1.5 V

OUTPUTVo

~

,,","

o """
0

3.0V
1.SV

INPUTVE

~

tpjtt.

--",

.--

"'I.Z

.--

SWITCH MATRIX
tPHz
tPZH
tpLZ
tPZL

5,

5,

CLOSED
OPEN
CLOSED
CLOSED

CLOSED
CLOSED
CLOSED
OPEN

0

-1.
25

50

70

85

TA - TEMPERATURE _ °C

Figure 10. Typical Enable Propagation
Delay vs. Ambient Temperature

ALL DIODES ARE EC6 519 OR EaUIVALENT
C1 '" 30 pF INCLUDING PROBE AND JIG CAPACITANCE.

Figure 9. Test Circuit for IpHZ, tpzH, IpLZ and tpZL.

3-32

HCPl-2400

Vee
:;10000,..".--,.-----,,-='"'
I

.
.
>

OUTPUT Va
1--+"""4,.--0 MONITOR I NG
NODE

A

~

8000 H - - - + - - - + -

~

6000 f - \ - - + - - - + - - - t - - - - - ;

::;
~

u;

~

~
o
::;
z

o

PULSE
GENERATOR

50V~------------~~~--~

VCM

/ \ -Va MAX."
---'

'\

SWITCH AT B: IF

8

v::. .

VOH

VOL

~ 2000f---+---+---t----;
::;

OV
SWITCH AT A: IF = 0 rnA

40001---+---+---t,-----;

~

°OL-~--5~O-O~-,-o~oO-~-'~50-0-L--"2000
VCM - COMMON MODE TRANSIENT VOLTAGE - V

4 rnA

-MUST BE LOCATED < 1 em FROM DEVICE UNDER TEST.
"SEE NOTE 6.
t CL IS APPROXIMATELY 15 pF. WHICH INCLUDES PROBE AND
STRAY WIRING CAPACITANCE.

Figure 12. Typical Common Mode Transient Immunity vs.
Common Mode Transient Voltage

Figure 11. Test Diagram lor Common Mode Transient Immunity
and Typical Waveforms

Applications
VCCl =+5V
VCC2 =5V
DATA
IN

A

A

DATA
OUT

GND 1

GND 2

Y

(e.g. 74S04)

Figure 13. Recommended 20 MBd HCPL-2400 Interlace Circuil

Figure 14. Alternative HCPL-2400 Interlace Circuit

20

2

,.
,.
'2

~~ '0

.C'e..::.
x

~

~

~

SEE f!"tGURE 1:1

'6

I

z
0
>=
0:-

NUMBER SYMBOLS PER BIT
/

~

I--

-

I--

SELF-CLOCKING?
/
DUTY FACTOR RANGE (%)

DATA

'NN'~ONRZ

;:

5'"
~

SIGNALING (SYMBOLS OR BAUD)
RATE
SECOND

INVERTIBLE?
/

_ DATA
- RATE

(~
SECOND

X NO. SYMBOLS)
BIT

I I I I' I I I' I' I I' I' I' I
0

0

0

0

0

0

~

I

I

I

I

I

I

I

I

I

2 Y Y 50 BIPHASE-MARK

I--

rn
74S04

2 Y Y 50

74lS04

7404

74HC04

BIPHASESPACE

2 NY 50 MANCHESTER

DRIVER TYPE

Figure 15. Typical Pulse Width Distortion vs. Input Driver Logic
Family

hhhJ---U-irLJ-1~

Figure 16. Modulation Code Selections

3-33

Data Rate, pulse-width
Distortion, and Channel
Distortion Definitions

Applications Circuits

In the world of data communications, a bit is defined as
the smallest unit of information a computer operates with.
A bit is either a Logic 1 or Logic 0, and is interpreted by a
number of coding schemes. For example, a bit can be
represented by one symbol through the use of NRZ code,
or can contain two symbols in codes such as Biphase or
Manchester (see Figure 16), The bit rate capability of a system is expressed in terms of bits/second (b/s) and the
symbol rate is expressed in terms of Baud (symbols/second). For NRZ code, the bit rate capability equals the
Baud capability because the code contains one symbol
per bit of information. For Biphase and Manchester codes,
the bit rate capability is equal to one half of the Baud capability, because there are two symbols per bit.
Propagation delay is a figure of merit which describes the
finite amount of time required for a system to translate
information from input to output when shifting logic levels.
Propagation delay from low to high (tpLH) specifies the
amount of time required for a system's output to change
from a Logic 0 to a Logic 1, when given a stimulus at the
input. Propagation delay from high to low (tpHL) specifies
the amount of time required for a system's output to
change from a Logic 1 to a Logic 0, when given a stimulus
at the input (see Figure 5).

A recommended application circuit for high speed operation is shown in Figure 13. Due to the fast current
switching capabilities of Schottky family TTL logic
(74STTU, data rates of 20 MBd are achievable from 0 to
70 0 C. The 74S04 totem-pole driver sources current to
series-drive the input of the HCPL-2400 optocoupler. The
34S!l resistor limits the LED forward current. The, 30 pF
speed-up capacitor assists in the turn-on and turn-off of
the LED, increasing the data rate capability of the circuit.
On the output side, the following logic can be directly
driven by the output of the HCPL-2400, since a pull-up
resistor is not required. If desired, a non-inverting buffer
may be SUbstituted on either the input or the output side
to change the circuit function from Y = A to Y = A. This
circuit satisfies all recommended operating conditions.
An alternative circuit is shown in Figure 14, which utilizes
a 74S05 open-collector inverter to shunt-drive the HCPL2400 optocoupler. This circuit also satisfies all
recommended operating conditions.
The HCPL-2400 optocoupler is compatible with other
logic families, such as TTL, LSTTL, and HCMOS. However, the output drive capabilities of Schottky family
devices greatly exceed those associated with TTL, LSTTL,
and HCMOS logic families, and are recommended in high
data rate (20 MBd) applications where fast drive current
transitions are required to operate the HCPL-2400 with
minimum pulse-width distortion.

When tPLH and tPHL differ in value, pulse width distortion
results. Pulse width distortion is defined as tpHL-tPLH
and determines the maximum data rate capability of a
distortion-limited system. Maximum pulse width distortion
on the order of 20-30% is typically used when specifying
the maximum data rate capabilities of systems. The exact
figure depends on the particular application mS-232,
PCM, T-1, etc.).

I

I
-_---'--~_--- Vee
1.5K n
(TYP.)

1'0 n
{T.Y~.J

r--.....

=:= := ~--+-----------r-L:SZ

Channel distortion, ('CltPHL, l>tPLH), describes the worst
case variation of propagation delay from device to device
at identical operating conditions. Propagation delays tend
to shift as operating conditions change, and channel distortion specifies the uniformity of that shift. Specifying a
maximum value for channel distortion is helpful in parallel
data transmission applications where the synchronization
of signals on the parallel lines is important.

f¢~~,~

The HCPL-2400 optocoupler offers the advantages of
specified propagation delay ItPLH, tpHLl, pulse-width distortion IjtPLH-tPHL p, and channel distortion (MPLH, l>tPHL)
over temperature, input forward current, and power supply
voltage ranges.

Vo

'I

V

ONO

Figure 17. Typical HCPL-2400 Output Schematic

3-34

----------------------

~~Tt~«(Tl~13J

COrnp~];IIB~E

OPTOCOtJP~ER
ourl'..IN'eDRAWIN'G*

TRUTH TABLE
(Positive Logic)
Input

Enable

Output
l

7
V,
NOTE:
A .01 to O.l>lF BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS 8 AND 5.

Features
•
•
•
•

Figure 1.

LSTTL/TTL COMPATIBLE: 5 V SUPPLY
HIGH SPEED: 10 MBd TYPICAL
LOW INPUT CURRENT REQUIRED: 5 rnA
HIGH COMMON MODE REJECTION: >1000 V/p.s TYPICAL

• GUARANTEED PERFORMANCE OVER TEMPERATURE
• RECOGNIZED UNDER THE COMPONENT PROGRAM
OF U.L. (FILE NO. E55361) FOR DIELECTRIC
WITHSTAND PROOF TEST VOLTAGES OF 1440 Vac,
1 MINUTE AND 2500 Vac, 1 MINUTE (OPTION 010).

0.76 (.030)

ill !-OSSI
DIMENS10NS IN MtLLlMETRES AND (iNCHES),

Recommended Operating
Conditions
Sym. Min. Max. I.Jnits

Description / Applications

Input Current, Low Level
Each Channel

IFI_

0

250

pA

The 6N137 consists of a GaAsP photon emitting diode
and a unique integrated detector. The photons are collected
in the detector by a photodiode and then amplified by a high
gain linear amplifier that drives a Schottky clamped open
collector output transistor. The circuit is temperature,
current and voltage compensated.

Input Current. High Level
Each Channel
High Level Enable Voltage
Low Level Enable Voltage
(Output High)
Supply Voltage. Output
Fan Out
(TIL load)
Operating Temperature

IFlI

6.3"

15

mA

VEH
VEL

2.0
0

Vee
0.8

V
V

Vee
N

4_5

5.5
8

V

T.,

0

70

°C

This unique isolator design provides maximum DC and AC
circuit isolation between input and output while achieving
LSTTL/TTL circuit compatibility. The isolator operational
parameters are guaranteed from 0° C to 70° C, such that a
minimum input current of SmA will sink an eight gate fan-out
(13mA) at the output with S volt Vee applied to the detector.
This isolation and coupling is achieved with a typical
propagation delay of SSns. The enable input provides gating
of the detector with input sinking and sourcing requirements
compatible with LSTTUTTL interfacing.
The 6N137 can be used in high speed digital interfacing
applications where common mode signals must be rejected,
such as for a line receiver and digital programming offloating
power supplies, motors, and other machine control systems.
The elimination of ground loops can be accomplished
in system interfaces such as between a computer and a
peripheral memory, printer, controller, etc.
The open collector output provides capability for bussing,
OR'ing and strobing.

• J EDEC Registered Data.

Absolute Maximum Ratings*
(No derating required up to 70°C)

Storage Temperature ........................... -SsoC to +125° C
Operating Temperature .............................. 0°Cto+70°C
LeadSolderTemperature ....................
260°C for 10$
(1.6mm below seating plane)
Peak Forward Input
Current ........................... 40mA (t::; 1 msee Duration)
Average Forward Input Current ............................. 20mA
Reverse Input Voltage .................................................. SV
Enable Input Voltage ................................................. S.SV
(Not to exceed Vee by more than SOOmV)
SupplyVoltage-Vee ................. 7V(1 Minute Maximum)
Output Current -10 .................................................. SOmA
Output Collector Power Dissipation ..................... 8SmW
Output Voltage - Vo ...................................................... 7V
**6.3mA condition permits at least 20% CTR degradation
guardband. Initial switching threshold is SmA or less•

3-35

Electrical Characteristics
OVER RECOMMENDED TEMPERATURE (TA
Parameter

Symbol

High Level Output Current

IOH

Low Level Output Voltage

VOL *

High Level Ena ble Current

IEH

Low Level Enable Current

Min.

..

UNLESS OTHERWISE NOTED

Typ,"*

Max.

Units

Test Conditions

Figure

2

250

fJA

Vce=5.5V, Vo"5.5V,
iF=250fJA, VE=2.0V

6

0.4

0.6

V

Vec=5.5V, IF=5mA,
VEH=2.0V
IOL (Sinking) =13mA

3,5

mA

Vec=5.5V, Ve=2.0V

-1.0

..
IEL

-1.4

-2.0

mA

Vec=5.5V, VE=0.5V

"

7

15

mA

.

Vcc"'5.5V, IF=O
VE=0.5V

14

18

mA

Vec=5.5V,IF=10mA
VE=0.5V

1

p.A

45% RH. t '" Sa.
VI-O= 3 kV dc,TA = 25° C
RH550%t=1 MIN

High Level Supply Current

leGH

Low Level Supply

'ecL

Input-Output Insulation

11-0*

I OPT010

= ooe TO 70°C)

Visa

2500

VRMS

Resistance (Input-Output)

RI_O

1012

Capacitance {Input-Output)

C,_O

0.6

Input Forward Voltage

VF*

1.5

Input Reverse Breakdown
Voltage

BVR'

n

VI_O=500V, TA=25°C

pF

f=lMHz, TA=25°C

1.75

5

V

IF=10mA, TA"25°C

V

IR"'10pA, TA=25°C

Input Capacita nee

CIN

60

pF

VF=O, f=lMHz

Current Transfer Ratio

CTR

700

%

IF=5.0mA, RL =loon

*For JEDEC registered parts.

Note

5,9
10
5
5

4

8

2

7

"All typical values are at Vee = 5V, T A

= 25° e

Switching Characteristics at TA = 25°C, VCC = 5V
Parameter

Symbol

.,

Min.

Typ.

Max.

Units

Test Cond itions

Figure

Note

55

75

ns

RL =350n, CL =15pF •
IF=7,5mA

7,9

1

75

ns

RL =350n, CL ~15pF,
IF'=7.5mA

7,9

2

ns

RL~350n,

Propagation Delay Time to
High Output Level

tpLH

Propagation Delay Time to
Low Output Level

tpHL *

55

Output Rise·Fali Time
(1 ()"90%)

tr, tf

50,20

Propagation Delay Time of
Enable from VEH to VEL

tELH

65

ns

RL=350n. CL=15pF,
tF=7.5mA, VEH=3,OV,
VEL =0.5V

8

3

Propagation Delay Time of
Enable from VEL to VEH

tEHL

20

ns

RL "'350n, CL =15pF,

8

4

Common Mode Transient
Immunity at Logic High
Output Level

ICMHI

100

vips

VCM=10V RL =350n,
Vo(min.)=2V, IF=OmA

11

6

Common Mode Transient
Immunity at Logic Low
Output Level

ICML\

.. -300

vIps

VeM=10V RL =350n.
Vo (max.)=0.8V,
IF=5mA

11

6

CL""15pF,

tF=7.5mA

tF"'7.5mA VEH=3.0V,
VEL ;0.5V

'JEDEC Registered Data.
3-36

operating Procedures and Definitions
Logic Convention. The 6N 137 is defined in terms of positive
logic.
Bypassing. A ceramic capacitor (.01 to 0.1IlF) should be con·
nected from pin 8 to pin 5 (Figure 12). Its purpose is to stab·
ilize the operation of the high gain linear amplifier. Failure to
provide the bypassing may impair the switching properties. The
total lead length between capacitor and coupler should not ex·
ceed 20mm.
Polarities. All voltages are referenced to network ground (pin
5). Current flowing toward a terminal is considered positive.
Enable Input. No external pull·up required for a logic (1), i.e.,
can be open circuit.

NOTES:
1. Th.l.LH propagation delay is m.asur.d from the 3.75mA point on the trailing
.dg. of th.lnput pulse to the 1.5V point on th.trailing edg.olth. output puis••
2. The bilL propagation delay is measured from the 3.7SmA point on the leading
edge of the input pulse to 1.SV pOint on the leading edge of the output pulse.
3. Th. tELH .nabl. propagation d.lay Is measur.d from the 1.5V pointolth. trailing
.dge of th.lnput puis. to th.l.5V point on the trailing .dge of th. output pulse.
4. Th. tEHL enabl. propagation delay is m.asured from the 1.5V point on the
I.adlng edge of the input puis. to the 1.5V point on the I.adlng edge of the
output pulse.
5. Device considered a two terminal device: pins 2 and 3 shorted together, and
pins 5, 6, 7, and 8 shorted togeth.r.
6. Common mode transient immunity In Logic High level is the maximum tolerable

7.
8.
9.
10.

(posltlvel dVCM/dt on the I.adlng .dge of the common mode pulse, VCM, to
assure that the output will remain In a Logic High state (i .... Vo>2.0VI. Common
mode transient Immunity in Logic Low level Is the maximum tolerable
(negative) dVCM/dt on the trailing edg.olthe common mode pulse signal, VCM,
to assure that the output will remain in a Logic Low state (i.e., Vo<0.8V).
DC Current Transfer Ratio is defined as the ratio of the output collector current
to the forward bias input current times 100%.
At 10mA VF decreases with increasing temperature at the rate of 1.6mVrC.
This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec. test.
See Option 010 data sheet for more information.

10
Vo - COLLECTOR VOLTAGE - V

Note: Dashed characteristics - denote pulsed operation only.

V F - FORWARD VOLTAGE - VOLTS
CURVE
TRACER
TERMINALS

Figure

>

.......~
0
...>:::>

Figure 2. Optocoupler Collector Characteristics.

IF

-

I

w

0.6

:=:::>

0.5

0
I

4. I nput Diode Forward Characteristic.

-

=~mA

__ !2...

-.......

-

.!~_

fa

=12.8mA

fa ·9.6mA
fa·6.4mA

~

VCC=5.0V
TA'" 25Q C

>
I

w

>° 0.4

50

25

to

TA - TEMPERATURE _

~

75

°c

Figure 5. Output Voltage, VOL V50 Temperature and Fan·Out.

0

...>:::>
...:::>

.

100
IF

0
I

..

>0
0

Vee

...z

w
a:
a:

IF - INPUT DIODE FORWARD CURRENT - rnA

:::>

...:::>
...:::>
rn"r.r"RECOGNmON
SHIELD

fi.!.'
101]
0:33 to-n, J~

"'I-~:::-::=="'~-'T

5

L..=

":.".:.1

1

/ ' - - - - - - ! - - - -.....--o GND
5

--t

TRUTH TABLE
(Positive Logicl
A 0.01 TO 0.1 pF BYPASS CAPACITOR
MUST BE CONNECTED BElWEEN
PINS 8 AND 5 (Sea Nota 1).

Figure 1. Schematic.

Input

E~.br

Output

H

H

L

H

L
H

H

L

_14.70f·tIMAX.

I!

H
H

Features
•
•
•
•
•
•
•
•

!

I
I

II-

t l"'\l.D201

~

rl O.781,030l

•-

mWi$&)

!_~~~~~

MIN.

'.•

2f.Il.IMIN.
0.65 (,02:51 MAX,

OIMENSIONS IN MllLlMET~ES AND (lNCHE5t.

Applications

INTERNAL SHIELD FOR HIGH COMMON
MODE REJECTION (CMR)
HIGH SPEED: 10 MBd TYPICAL
GUARANTEED MINIMUM COMMON MODE
TRANSIENT IMMUNITY: 1000V/~
LSTTL/TTL COMPATIBLE
LOW INPUT CURRENT REQUIRED: 5mA
GUARANTEED PERFORMANCE OVER TEMPERATURE: O°C to 70°C
STROBABLE OUTPUT
RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).

•
•
•
•
•
•
•
•
o

Isolated Line Receiver
Simplex/Multiplex Data Transmission
Computer-Peripheral I nterface
Microprocessor System Interface
Digital Isolation for A/D, D/A Conversion
Switching Power Supply
Instrument Input/Output Isolation
Ground Loop Elimination
Pulse Transformer Replacement

Recommended Operating
Conditions
Sym. Min. Max.
Input Current, Low Level

IFL

0

250

Input Current, High Level

IpH

6.3*

15

4.5

5.5

Supply Voltage, Out

Description

Unlls

/lA
mA

v
V

The HCPL-2601 optically coupled gate combines a GaAsP
light emitting diode and an integrated high gain photon
detector. An enable input allows the detector to be
strobed. The output of the detector I.C. is an open
collector Schottky clamped transistor. The internal shield
provides a guaranteed common mode transient immunity
specification of 1000 volts/I'sec·.
This unique design provides maximum D.C. and A.C.
circuit isolation while achieving TTL compatibility. The
isolator D.C. operational parameters are guaranteed from
O·C to 70·C allowing troublefree system performance.
This isolation is achieved with a typical propagation delay
of 40 nsec.
The HCPL-2601's are suitable for high speed logic
interfacing, input/output buffering, as line receivers in
environments that conventional line receivers cannot
tolerate and are recommended for use in extremely high
ground or induced noise environments.

Low Level Enable

o

0.8

V

8

Operating Temperature

o

70

Absolute Maximum Ratings
(No Derating Required up to 70°C)
Storage Temperature . . . . . . . . . . . . .. -55· C to +125· C
Operating Temperature ................ O· C to +70· C
LeadSolderTemperature ...........
260·Cfor10S
.
(1.6mm below seating plane)
Forward Input Current - IF (see Note 2) ....... 20 mA
ReverselnputVoltage ........................... 5V
Supply Voltage-Vee ......... 7V (1 Minute Maximum)
Enable Input Voltage - VE ....................... 5.5 V
(Not to exceed Vee by more than 500 mV)
OutputCollectorCurrent-lo ................. 25mA
Output Collector Power Dissipation . . . . . . . . . .. 40 mW
OutputColiectorVoltage-Vo .................... 7V

*6.3mA condition permits at least 20% CTR degradation guard band. Initial switching threshold is SmA or less.

3-39

._----------------------_._-------

Electrical Characteristics
(Over Recommended Temperature, TA = O°C to +70°C, Unless Otherwise Noted)
Typ.-

Max.

Units

Test Conditions

High Level Output Current

lOll

20

250

pA

Vee = 5.5V, Vo = 5.5V,
IF '" 250 pA, VE = 2.0 V

2

Low Level Output Voltage

VOl.

0.4

0.6

V

Vee"" 5.5V, IF = 5 mA
VE "" 2.0 V,
10L (Sinking) "" 13 rnA

3,S

High Level Supply Current

leell

10

15

mA

Vee = 5.SV, IF ... 0,
VE =O.S V

Low Level Supply Current

!eel

15

19

rnA

Vee = 5.5V, IF = 10 rnA,
VE =0.5 V

-2.0

Parameter

Min.

Symbol

Low Level Enable Current

IEL

-1.4

High Level Enable Current

hm

-1.0

High Level Enable Voltage

VEil

Low Level Enable- Voltage

VEL
Vp

~:=

Input Forward VOltage
Input Reverse Breakdown
Voltage

2.0
1.5

CIN

60

Input Diode Temperature
Coefficient

AVp
ATA

-1.6

Input-Output insulation

11-0"

I

OPT 010

(Input~Outputl

Capacitance

('nput~Output)

1.75

5

Input Capacitance

Resistance

2500

V

IF = 10 rnA, TA == 25°C

V

IR

pF

VI' "'" 0, f "" 1 MHz

pA

VRMS
101~

* For JEDEC registered parts.

45% RH, t = 5s,
VI_0""3kVdc, TA=2=t==
RH :::;50% t= 1 MIN

13
3
3

= 5V, TA =

25°C.

(TA = 25°C, Vee = 5V)
Typ.

Max.

Units

Propagation Delay Time to
High Output level

tl'LII

40

75

ns

Propagation Delay Time to
Low Output Level

tPHL

p-

75

ns

Output Rise Time (10-90%)

tT

20

ns

Output Fall Time ~
Propagation Delay Time
Enable from VElI to VEL

tr

ns

tElH

30
25

Propagation Delay Time of
Enable from VEL to VEil

tEHl

25

os

Symbol

3, 12

V

*.AII typical values are at Vee

Switching Characteristics
Parameter

4

= 10 pA, TA '" 25°C

~=1 MHz

0.6

CI-O

11

I

V

mVI"C IF'" 10mA

1

VISO
RI (}

Vee = 5.5 V, VE '" 0.5 V
Vee = 5.5 V, VE "" 2.0V

V
0.8

BVR

mA
mA

Figure Note

Min.

===f

Test Conditions

RL = 350 0

Figure

Note

6

4

6

5

CL"" 15 pF

os

IF'" 7.5 mA

I

Rl 'lilt 350 n, CL = 15 pF.
IF = 7.5 mA, Veil = 3 V,
VEL"" OV
RL = 350 0, Cl =; 15 pF,
IF = 7.5 mAo VEil "" 3 V,
VEL=OV

9

9

7

6

Common Mode
TranSient Immunity
at High Output !..evel

ICMul

r1000

10,000

Vips

VCM '" 50 V (peak),
Vo (min.) = 2 V,
RL = 350 n, IF "" 0 rnA

12

8,10

Common Mode
Transient Immunity
at Low Output Level

ICMLI

1000

10,000

VIpS

VeM = 50 V (peak).
Vo {max.) "" 0.8 V,
Rl = 350 n, IF = 7.5 mA

12

9,10

3~40

._---_._-------------

--------------------------~-----.-.---

NOTES:
1. Bypassing of lhe power supply line is required. wilh a 0.01 "F ceramic
disc capacitor adjacent to each isolator as illustrated in Figure 15. The
power supply bus for the isolator(s) should be separate from the bus for
any active loads, otherwise a larger value of bypass capacitor (up

6. The tELlI enable propagation delay is measured from the 1.5 V point on
the trailing edge of the enable input pulse to the 1.5 V point on the
trailing edge of the output pulse.

to 0.1

7. The tF-HI. enable propagation delay is measured from the 1.5 V point on

the leading edge of the enable input pulse to the 1.5 V point on the
leading edge of the output pulse.

"F) may be needed to suppress regenerative feedback via the power
supply.
2. Peaking circuits may produce transient input currents up to 50 rnA. 50

a. eMH is the maximum tolerable rate of rise of the common mode voltage
to assure that the output will remain in a high logic' state (I.e .• VOl''''
>2.0 V).
9. eMI. is the maximum tolerable rate of fall of the common mode voltage
to assure that the output will remain in a low logic state (i.e., VIWI' <0.8

ns maximum pulse width, provided average current does not exceed 20

rnA.
3. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted
together. and pins 5. 6. 7 and 8 shorted together.
4. The tpl.lI propagation delay is measured from the 3.75 rnA point on the
trailing edge of the input pulse to the 1.5 V point on the trailing edge of
the output pulse.
5. The tpHL propagation delay is measured from the 3.75 rnA pOint on the
leading edge of the input pulse to the 1.5V point on the leading edge of
the output pulse.

V).

10. For sinusoidal voltages, (ldVCM1)

--dt

= ".fn,vcM

(p-p)

max

11. No external pull up is required for a high logic state on the enable input.
12. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec.
test.
13. See Option 010 data sheet for more information.

Vee· S.5V

15

r--r--ir--I--+vo • 5.5V
v.
1--1--1---1-+ '"

TA -TEMPERATURE-OC

TA - TEMPERATURE - 'c

FIgure 2. High Level Output Current
vs. Temperature.
5.0

V F - FORWARD VOLTAGE - VOLTS

Figure 4. Input Diode Forward
Characteristic.

Figure 3. Low Level Output Voltage
vs. Temperature.

r--.",;""-.....-----,--,.---,----,

PUt..

so rVc~

GttNeRAToR

"",son
>

4.0

.
."

~
o

2.0

~

1.0

.00tputVo

Monitoring
Nod.

I

60

tPLH Rt • 4~'l

;::

50

- - r ' tPLH~

~

40

~'PH.
RL • 350~±-·
ftC Ik!'l _

30

:~PUT

--.1---- --~---

...-

IF - FORWARD INPUT CURRENT - rnA

Figure 5.

Output Voltage vs. Forward
Input Current.

IF • 3.'S rnA

r-~~TPUT~_1'5V
----l 'PHe

I--

---, fpL"

Figure 6. Test CIrcuit for tpHL and t pLH '

3-41

0

g:
I

- I F -7.5mA

.--

70

Z
0

~ -:-~~~~[!~==t
L

5.~V

= 7'srnA

I

C

3.0

#

....
w

>-

I

w

"....>!
g

rlF

~

tR'"Sn$

~

"

tput

:.-Rt. ... 3500

~

t ...

~RL .lu.!'l-

20
10

20

30

40

50

60

TA -TEMPERATURE-'C

Figure 7. Propagation Delay vs.
Temperature.

70

'IJlSE

G~NfAATOR

70

z,,-!»n

~

tR'"'5m

>
....
w
c

I

'"

2
C

i=

'~"

co

.

-Ct.

Figure 8. Propagation Delay vs. Pulse
Input Current.

20

2

I

0

r--~:PUT~_1'5V
~

j.-

10

,!i'

~PUT -.i------~---1.5V
IF - PULSE INPUT CURRENT - rnA

w
....
III

w
3.0V

tEHL

40

30

'"

is approximately 1SpF, which includes
probe and stray wiring capacitance.

---l

50

0

0:

OutputVo

!!J._~~!I-+----t ~:;!lOring

60

0

tELH

TA - TEMPERATURE - °C

Figure 10. Enable Propagation Delay
vs. Temperature.

Figure 9. Test Circuit for tEHL and tELH'

~'2000 F'F=F=F::::::j=F'F=F=F::::::j=!
~'UV

I

~'0000h+-+-t--+-+_t'FH"

350Sl
OutpUtVo
Monhoring

w
:;
j:

''C){!iJ-F=+---<>

A

....
....

50

..

40

~

ui

Nod.

"
~

7.5mA
tF~·O,"A
VOH " 2.0V

I-

VOL"

o.sv

~

At.

3500

~

fA = 25>C

0:

ii:

1-

I

C

W

or

~

.;.
V CM

OV
SV

~ 2000~4-~~r-4-~--+-~~--+-~
:;

SWITCH AT A: IF .. 0

CM

~o

SWITCH AT B: IF
TA -TEMPERATURE-'C

Figure 11. Rise, Fall Time vs.
Temperature.

Vo 0.5 V .

~~

is Z

Vee" 5.0
'.31--~-~--l---l-VOM~ MY

~ i 1.2
B~

ffi

1.1

H

,,- -

8
I

= 7.S mA

Vo (max.)

Figure 12. Tesi Circuit for Common Mode
Transient Immunity and
Typical Waveforms.

~

V eM - COMMON MODE
TRANSIENT AMPLITUDE - V

Figure 13. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.
GND BUS (BACKI

1.41"'"'-,--,--,--,-....,.---,---.

w
Q

~

lIP

VCC BUS

VOL # O.3V

tFH
7..5mA
Iff.. ... OmA
RL .. 350S!
j#

\===t=== ¢===

ENABLE
(IF USEDI

i=U,i

~~

1.0 I--I--P--.d---J--f--+--I

OUTPUT,

0:1-

I

.9

1ii~

is

~

ENABLE
(IF USEDI

.8

.7!---:"""--:"""~",""....J",""~","",""",.......~.
o
20304050
OUTPUT 2

TA - TEMPERATURE - "c

Figure 14. Relative Common Mode
Transient Immunity vs.
Temperature.

Figure 15. Recommended Printed Circuit
Board Layout.

3-42

HIGH CMR
LINE RECEIVER
OPTOCOUPLER

HEWLETT
PACKARD

HCPL·2602

TECHNICAL DATA

1

_~·46't.;lfuf
9.90 (,390)
8

7

-=-1 OUTI.1NEi)ll"AWiNG·
~

6

0.18

JANUARY 1986

coon

if.33f.0i3I

i-

~f~-------r,~==--l:

5

TVPE

!

N~MBER

ATE

CO~~6 C290~ ::~ ~
7.ao mol

•

TYP.
~~COGNITION L--=':::--~:::s:=::;;;:::
I
I
6~

'-rcT"TOT,.,..-;",r;;r1
PIN 1
2 ,;, 3
4
ONEil

.....

:J

Figure 1. Schematic.

~ 4.7Q {.18S) MAX.

(Positive Logicl
Input

H

r-+.-H

1---['

EI13bte
Ii
H
~ L
L

DIMENSIONS IN MILLIMETRES AND (INCHES).

--t

TRUTH TABLE
A 0.01 TO 0.1 JlF BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
PINS 8 AND 5 (See Note 1).

7

1-1.7SC070IMAX-

!~ 1.19 (.047) MAX.

Output
L

I
II
I

H
H
H

r-I

~

--l

--

MIN.

+IN-

"~II

."

-IN

2.92l.1151 MIN,

0,16 (,0301

I --

1.40 /'0551

l--~ ~:~~ i:~6~

......... 0.65

!
0.51 ;'0,01

C025) MAX.

Features

Applications

• LINE TERMINATION INCLUDED - NO EXTRA CIRCUITRY
REQUIRED

• Isolated Line Receiver
• Simplex/Multiplex Data Transmission

• ACCEPTS A BROAD RANGE OF DRIVE CONDITIONS
• GUARDBANDED FOR LED DEGRADATION

• Computer-Peripheral Interface

• LED PROTECTION MINIMIZES LED EFFICIENCY
DEGRADATION

• Microprocessor System Interface

• HIGH SPEED - 10MBd (LIMITED BY TRANSMISSION LINE
IN MANY APPLICATIONS)

• Digital Isolation for A/D, D/A Conversion
• Current Sensing

• INTERNAL SHIELD PROVIDES EXCELLENT COMMON
MODE REJECTION

• Instrument Input/Output Isolation

• EXTERNAL BASE LEAD ALLOWS "LED PEAKING" AND
LED CURRENT ADJUSTMENT

• Ground Loop Elimination

• RECOGNIZED UNDER THE COMPONENT PROGRAM OF
U.L. (FILE NO. E55361) FOR DIELECTRIC WITHSTAND
PROOF TEST VOLTAGES OF 1440 Vac, 1 MINUTE AND 2500
Vac, 1 MINUTE (OPTION 010).

• Pulse Transformer Replacement
DC specifications are defined similar to TTL logic and are
guaranteed from 0° C to 70° C allowing trouble free interfacing with digital logic circuits, An input current of 5 mA
will sink an eight gate fan-out (TTl) at the output with a
typical propagation delay from input to output of only 45
nsec.

Description

The HCPL-2602's are useful as line receivers in high noise
environments that conventional line receivers cannot tolerate. The higher LED threshold voltage provides
improved immunity to differential noise and the internally
shielded detector provides orders of magnitude improvement in common mode rejection with little or no sacrifice
in speed.

The HCPL-2602 optically coupled line receiver combines a
GaAsP light emitting diode, an input current regulator and
an integrated high gain photon detector. The input regulator serves as a line termination for line receiver
applications. It clamps the line voltage and regulates the
LED current so line reflections do not interfere with circuit
performance.
The regulator allows a typical LED current of 8.5 mA
before it starts to shunt excess current. The output of the
detector IC is an open collector Schottky clamped transistor. An enable input gates the detector. The internal
detector shield provides a guaranteed common mode
transient immunity specification of 1000 Vlllsec.

CAUTION: The small junction sizes inherent to the design
of this bipolar component increase the component's susceptibility to damange from electrostatic discharge (ESDj.
It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD,

3-43

Recommended Operating
Conditions
$ym. Min. Max. Units
Input Current, Low Level

11/,

0

250

jJ.A

Input Current, High Level

1m

60

mA

Supply Voltage, Output

Vc~'

6.3*
4,5

5.5

V

High Level Enable Voltage

Vrm

2.0

Vce

v

Low Level Enable Voltage

VEL

°

0,8

V

N

T,\

0

70

Fan Oul (TTL Load)
Operating Temperature

Absolute Maximum Ratings
Storage Temperature ,.," ... "'.'
-55°Cto+125°C
Operating Temperature
"".,,0°Cto+70°C
260°C for 10 s
Lead Solder Temperature . . , , ... , . , .
(1.6mm below seating plane)
Forward Input Current -II .............. """
60 mA
Reverse Input Current ........................ 60 mA
Supply Voltage - Vee . " " . " . 7V (1 Minute Maximum)
Enable Input Voltage - VE ',.,","', .... ,., .... , 5,5 V
(Not to exceed Vee by more than 500 mV)
Output Collector Current -10 ",." ... , ... "., 25 mA
Output Collector Power Dissipation ... ' ... , , .. 40 mW
Output Collector Voltage - Vo .. "., ... '.",'.""
7V
InputCurrent,Pin4 ......................... ±10mA

8
°C

6.3 rnA condition permits at least 20% degradation guardOand.
1nitial switching threshold is 5 rnA or less.
NOTES:
1. Bypassing of the power supply line is required, with a 0.01 JiF ceramic
disc capacitor adjacent to each isolator as illustrated in Figure 15. The
power supply bus for the isolator(s) should be separate from the bus for
any active loads, otherwise a larger value of bypass capacitor (up to 0.1
,uF) may be needed to suppress regenerative feedback via the power
supply.
2. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted
together, and pins 5, 6, 7 and 8 shorted together.
3. The tl'LlI propagation delay is measured from the 3.75 mA point on the
trailing edge of the input pulse to the 1.5 V point on the trailing edge of
the output pulse.
4. The tpHL propagation delay is measured from the 3.75 mA point on the
leading edge of the input pulse to the 1,5V point on the leading edge of
the output pulse.
5. The tLl.I! enable propagation delay is measured from the 1.5 V point on
the trailing edge of the enable input pulse to the 1.5 V point on the
trailing edge of the output pulse.

5.u

6. The tEll I. enable propagation delay is measured from the 1.5 V point on
the leading edge of the enable input pulse to the 1.5 V point on the
leading edge of the output pulse.
7. eMil is the maximum tolerable rate of rise of the common mode voltage
to assure that the output will remain in a high'logic state (Le., VOl"]

>2,0 V).
8. eM I. is the maximum tolerable rate of fall of the common mode voltage
to assure that the output will remain in a low logic state (i.e., V()I'], <0.8

11. This is a proof test. This rating is

w

.
:;"

3,0

0

g

>

I-

2,0
1.8

I-

to"

ir

2.0

",

;;;

1,6

=>

1.'

~

we

0

>

III

a:
a:
~

10

i'--..

~

w

,

0.8
0.7

:

0,6

I

iI

I

0.4

~

0.3

a

10

20

30

"

..9

'0

50

0

o

60

10

'0 -9'";oA __
'_

j

/

I =64r'nA/

1 "

10

III

20

40

40

50

60

70

c

80

dj

70

"" !).OmA

Output Va
Monitoring
Node
*CL is approximately 15 pF, which includes
probe and stray wiring capacitance.

~0

60

z
0
i=

50

.;;:

"
0

40

.

30

:::

--- -----V

tPLH RL ,. 4kn

>-

I
.

~

30

30

TA - TEMPERATURE -

,5V

$.5V
" 2.0V

20

-r--.,

Figure 4. High Level Output Current
vs. Temperature.

Figure 3. Input Characteristics.

..} 10"" 16:.(!mA

-to~'2.amA

0,2 ~

v~

j..~-.

_J.

u:

Vee

r- --..

"J:,

I

i

0.5

t

~

J:

IF - FORWARD INPUT CURRENT - mA

>

.......

~

II - INPUT CURRENT - rnA

Figure 2. Output Voltage vs. Forward
Input Current.

~

vE

r'\.

"o

'I

-

6.5V
;WV
" 250I,A-

Vo

I,

"u

I-

1.2
1,0

vccl~ 5.5&
15

I-

,

0

validated by a 2500 Vae, 1 sec.

1,
I-

II V

w

"~

equall~'

12. See Option 010 data sheet for more information.

25'C

2.2

(p-p)

test.

O"C

>,

= ITfcMV(,M

rna.\

10. No external pull up is required for a high logic state on the enable input.

2.6

4.0

J

dt

2,'

>,

(ldV'''I
---

V)'..

9. For SinUSOidal voltages,

~

V

,/

\

'-

.........

tPHL Rt,

~~.350f2, lkn. 4kGl

~

V\
,I
tPUi RL -"' 350$';\. lkn

20
50

60

o

70

Figure 5. Low Level Output Voltage
vs. Temperature.

10

20

30

40

50

60

TA - TEMPERATURE _ °c

TA - TEMPERATURE - °C

Figure 6. Test Circuit for tpHL and tpLH'

3-44

Figure 7. Propagation Delay vs.
Temperature.

70

Electrical Characteristics
(Over Recommended Temperature, TA = 0° C to +70°C, Unless Otherwise Noted)
Parameter

,

High, Level OutpUt Curr(jnt

Min.

Symbol
IOH

"

TVp· *' "Max;;

Units

J'l

'V6L

J.l.A

Vce " 5.5V, Vo =5.5V
11=250 /lA, VE=2.0V

0.4

0.6

V

Vec=5.5V, 11=5 mA
VE=2.0V,
10 L (Sinking)=13 fi1 A

V

11=5mA

,

"

;1

InpiJt Voltage I

VI
I,;,

Input Reverse Vo Itage

V~

"

2.0

2.4

2.3

2.7

0.75

0.95

V

-2.0

mA

Vcc=5:RV, VE=0.5V

mA

"Vtc=5:5V, VE=2.0V

Low Level Enable Current

IEL

-1.4

High Level Enable Current

IEH

-1.0 ;

High Level Enable Voltage

VEH
VEL

High Level Supply Current

ICCH

Low Level Supply Current
Input Capacitance
Input-Output Insulation

I

OPT 010

Resistance (Input-Output)
Gapaci!ance (Input-9utRut)

2.0

11"'60 mA

I.

Note

4
2,5

3

s

3

IR=5 mA

10

V
!~,j

E~a,~le Voltage

Low Level

Figure

,.Tert ConditionS,1

250

,I'"

Low Level Output"Yoltage

'j,

20

0.8

V

10

15

mA

Vce=5.5V, 11=0,
VE=0.5V

ICCL

16

19

mA

Vcc=5.5V, 11=60 mA
VE=0.5V

CtN

90

pF

VI=O, f=1 MHz,
(PIN 2·3)

,..A

45% RH, t = 5s,
VI_o=3 kV dC,TA'" 25°C

1

11-0*
2500

VIsa

VRMS

RI_o

1012

0

CI~O

0.6

pF

"For JEDEC registered parts.

2, 11

RH $50% t = 1 MIN

12

VI_O=500V

2

2

f-= 1 MHz
'*AII typical values are at Vee

= 5V, T A = 25~ C.

switching Characteristics
(TA = 25°C, Vee = 5V)
Parameter

Symbol

Typ.

Max.

Units

tPLH

45

75

ns

Propagation Delay Time to
Low Output Level

tPHL

45

75

ns

Output Rise Time (10·90%)

tr

25

Output Fall Time (90·10%)

tl

25

ns

Propagation Delay Time of
Enable from VEH to VEL

tELH

25

ns

Propagation Delay Time of
Enable from VEL to VEH

tEHL

15

ns

Propagation Delay Time to
High Output Level

Common Mode
Transient ImmunitY
at High Output Level
Common Mode
Transient ImmunitY
at Low Output Level

Min.

ns

Test Conditions

Figure

Note

6

3

RL = 350 0
CL = 15pF
II=7.5mA

6

4

RL=3500, CL =15 pF,
11"'7.5 mA, VEH"3 V,
VEL"'O V

10

S

10

6

ICMH I

1000

10,000

V!p.s

VCM=50 V (peak),
Vo (min.)=2 V,
RL =3500, 11=0 mA

12

7,9

I CMLI

1000

10,000

VlJ.l.s

VCM=50 V (peak),
Vo (max.j=0.8 V,
RL =3500, 1,=7.5 mA

12

8,9

3-45

aD
70

>

~

z

«
to
~

50

~

40

/'

I

\

-'

~
lJi

l>

Rt. "" 3S0!1

,

'T'ka r-

0

~,

'I
t,

Rl .14k"

aD

~60

Rl

-- -t- - --I
- - -RlJ,k"

I

40

.;

--'
20 I - -

;:

-----

200

0:

\'PLH
, RL • 350n

['Hl ]

30

I

"

~,

0

g:

w

j::

tPt.H ftL '" 1kf'1

!PLH

Vee" 5.0V
liN ~1+5mA

220

tLlf RL1,. 4kO

60

c

0
j::

240

I

I

Output va
Monitoring

Node

I'll' 350n

3.0V

~PUT J-----}---'5V

-j--

Rl '350". lk". 4kn

20
10

20

I

I

I

30

40

50

--.I

00

60

10

20

30

40

50

TA - TEMPERATURE -

II - PULSE INPUT CURRENT - rnA

Figure 8. Propagation Delay vs. Pulse
Input Current.

60

°c

Figure 9. Rise, Fall Time vs.
Temperature.

70

~ 12000

>

60

>
~ 10000

c

50

""

40

w

~
\;

Z

0

j::

" 1-"

r-'~_-

8000

. --

- 1-. -

1-

g:

r-\---SOV

«

ffi

ov---./

10

I

.l"

CM H

0
SWITCH AT B: II'" 7.5 mA

--JI\- -

Vo O.5V _ _ _

Figure 11. Enable Propagation Delay
vs. Temperature.

"
"
~"
""

_~~DCIMH

~ 2000

SWITCH AT A: I, - 0

TA - TEMPERATURE _ °c

4000

o

~

"-----'

5V

0

Rl • 350 II

0:

~

20

-'
CD

o 7.5mA
'" OmA

VOH " 2.0V
'VOL' 0.8 V

...

PULSE GEN.

w

Vc;<;"5.0V

T" • 25'C

~ 6000

30

0

t-

"H
"- f- l'l

in

~

tELH

,

I

«
to

~

j.-

Figure 10. Test Circuit for tEHL and tELH'

c
I

~

tEHL

~~T'UT~_1.5V

70

Vo (max.)

Figure 12. Test Circuit for Common Mode
Transient Immunity and
Typical Waveforms.

00

I
J J
200

400

600

aDo

Figure 13. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.

1.4

w

Vc;<;I, 5.01V

c

~-~

vo,,'

1.3

Z-

~~

1.2

o;!!

"~ ...~ 1. ,r---...
j::iiS

«z
..J c:(
wo:

2,OV -

VQl " 0.8 v

0 2

1.0

""

• 7.5mA-

RL

~

ENABLE
(IF USED)

lit'" OniA
350n. _

i"--

OUTPUT 1

a: ...

·"
:t"
I
" ~
• IQ

"'"

"'"

.9

.a
.7

o

10

20

30

"'-

40

""-

50

TA - TEMPERATURE - ~c

ENABLE
(IF USED)

"

60

70

OUTPUT 2

Figure 14. Relative Common Mode
Transient Immunity vs.
Temperature.

Figure 15. Recommended Printed Circuit
Board Layout.

3-46

1000

V eM - COMMON MODE
TRANSIENT AMPLITUDE - V

------ ------

using the HCPL-2602
Line Receiver optocoupler

direction. The effect of this is a longer tpHL' This effect can
be eliminated and data rate improved considerably by use
of a Schottky diode on the input of the HCPL-2602.

The primary objectives to fulfill when connecting an
optocoupler to a transmission line are to provide a
minimum, but not excessive, LED current and to properly
terminate the line. The internal regulator in the HCPL2602 simplifies this task. Excess current from variable
drive conditions such as line length variations, line driver
differences and power supply fluctuations are shunted by
the regulator. In fact, with the LED current regulated, the
line current can be increased to improve the immunity of
the system to differential-mode-noise and to enhance the
data rate capability. The designer must keep in mind the
60 mA input current maximum rating of the HCPL-2602,
in such cases, and may need to use series limiting or
shunting to prevent overstress.

For optimum noise rejection as well as balanced delays a
split-phase termination should be used along with a flipflop at the output (Figure c). The result of current reversal
in split-phase operation is seen in Figure (c) with switches
A and B both OPEN. The coupler' inputs are then connected in ANTI-SERIES; however, because of the higher
steady-state termination voltage, in comparison to the
single HCPL-2602 termination, the forward current in
the substrate diode is lower and consequently there
is less junction charge to deal with when switching.

Design of the termination circuit is also simplified; in most
cases the transmission line can simply be connected
directly to the input terminals of the HCPL-2602 without
the need for additional series or shunt resistors. If
reversing line drive is used it may be desirable to use two
HCPL-2602's, or an external Schottky diode to optimize
data rate.

Polarity Non- Reversing Drive
High data rates can be obtained with the HCPL-2602 with
polarity non-reversing drive. Figure (a) illustrates how a
74S140 line driver can be used with the HCPL-2602 and
shielded, twisted pair or coax cable without any additional
components. There are some reflections due to the "active
termination" but they do not interfere with circuit
performance because the regulator clamps the line
voltage. At longer line lengths tpLH increases faster than
tpHL since the switching threshold is not exactly halfway
between asymptotic line conditions. If optimum data rate
is desired, a series resistor and peaking capacitor can be
used to equalize tpLH and tpHL' In general, the peaking
capacitance should be as large as possible; however, if it is
too large it may keep the regulator from achieving turn-off
during the negative (or zero) excursions of the input
signal. A safe rule:
make C~16t
where C = peaking capacitance in picofarads
t = data bit interval in nanoseconds

Polarity Reversing Drive
A single HCPL-2602 can also be used with polarity
reversing drive (Figure b). Current reversal is obtained by
way of the substrate isolation diode (substrate to
collector). Some reduction of data rate occurs, however,
because the substrate diode stores charge, which must be
removed when the current changes to the forward

Closing switch B with A open is done mainly to e;lhance
common mode rejection, but also reduces propagation
delay slightly because line-to-line capacitance offers a
slight peaking effect. With switches A and B both
CLOSED, the shield acts as a current return path which
prevents either input substrate diode from becoming
reversed biased. Thus the data rate is optimized as shown
in Figure (c).

Improved Noise Rejection
Use of additional logic at the output of two HCPL-2602's
operated in the split phase termination, will greatly
improve system noise rejection in addition to balancing
propagation delays as discussed earlier.
A NAND flip-flop offers infinite common mode rejection
(CMR) for NEGATIVELY sloped common mode transients
but requires tpHL>tpLH for proper operation. A NOR flipflop has infinite CMR for POSITIVELY sloped transients
but requires tpHL < tpLH for proper operation. An
exclusive-OR flip-flop has infinite CMR for common mode
transients of EITHER polarity and operates with either
t pHL > tpLH or tpHL  t pLH , so NAND gates are preferred in the R-S
flip-flop. A higher drive amplitude or different circuit
configuration could make tpHL 
tpLH or tpHL  Vee

HCPl-2630

OUTLINE DRAWING

~

0.18 ('007)

9.40
9_901.3901

v~'J~

if.33

0l"iJ)--:l
I

NOTE:
A .01 TO O.lJ1F BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS BAND 5

'----->-"*---c

GNO

Features

ANOOE 1 1

t 4.10 1.186) MAX.

•
•
•
•
•

HIGH DENSITY PACKAGING
LSTTL/TTL COMPATIBLE: 5V SUPPLY
HIGH SPEED: 10 MBd TYPICAL
LOW INPUT CURRENT REQUIRED: 5 mA
GUARANTEED PERFORMANCE OVER
TEMPERATURE
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vae, 1 MINUTE AND
2500 Vae, 1 MINUTE (OPTION 010).

jl"

-

1
I

r-I 0.761.0301

1.40 (055)

t
--L

t

CATHODE,

t051 (.OZOI
MlN CATHODE z

11
292 (.1151 MIN.
,-I -0651.0251 MAX
ANODE,

I-f.- ;:~~ ::::

4

'--___...

DIMENSIONS IN MllLIMETRES AND {iNCHES).

Recommended Operating
Conditions

Description/ Applications
The HCPL·2630 consists of a pair of inverting optica "y coupled
gates each with a GaAsP photon emitting diode and a unique
integrated detector. The photons are collected in the detector
by a photodiode and then amplified by a high gain linear amp·
lifier that drives a Schottky clamped open collector output
transistor. Each circuit is temperature, current and voltage com·
pensated.
This unique dual coupler design provides maximum DC and AC
circuit isolation between each input and output while achieving
LSTTL/TTL circuit compabi lity. The coupler operational
parameters are guaranteed from DoC to 70°C, such that a minimum input current of 5 rnA in each channel will sink an eight
gate fan·out (13 rnA) at the output with 5 volt Vee applied to
the detector. This isolation and coupling is achieved with a
typical propagation delay of 55 nsec.
The HCPL·2630 can be used in high speed digital interface ap·
plications where common mode signals must be rejected such
as for a line receiver and digital programming of floating power
supplies, motors, and other machine control systems. The eli·
mination of ground loops can be accomplished between system
interfaces such as between a computer and a peripheral memo
ory, printer, controller, etc.
The open collector output provides capability for bussing,
strobing and "WIR ED·OR" connection. In all applications, the
dual channel configuration allows for high density packaging,
increased convenience and more usable board space.

Input Current, Low Level
Each Channel
Input Current, High Level
Each Channel
Supply Voltage. Olltput
Fan Out (TTL Loadl
Each Channel
Operating Temperature

Sym.

Min.

Max.

Units

IFL

0

260

}JA

IFH

6.3'
4.6

15
6.5

mA
V

0

70

Vce
N
TA

8

°e

Absolute Maximum Ratings
(No derating required up to 70 dC)
Storage Temperature ................. -55°C to +125°C
Operating Temperature .................. OdC to +70 dC
Lead Solder Temperature ................. 260°C for 10s
(1.6mm below seating plane)
Peak Forward Input
Current (each channel) ..... 30 rnA « 1 msec Duration)
Average Forward Input Current (each channell ..... 15 rnA
Reverse Input Voltage (each channel) . . . . . . . . . . . . . . .. 5V
Supply Voltage - Vee .......... 7V (1 Minute Maximum)
Output Current - 10 (each channel) .. . . . . . . . . . . .. 16 rnA
Output Voltage- Vo (each channel) ................ 7V
Output Collector Power Dissipation ............. 60 mW
*6.3mA condition permits at least 20% eTR degradation guard band.
Initial switching threshold is SmA or less.

3-49
---------------------------------------------------------------

Electrical Characteristics
OVER RECOMMENDED TEMPERATURE (TA
Parameter

Symbol

= O°C TO 70°C)

Min.

Typ.** Max.

UNLESS OTHERWISE NOTED
Units

IOH

2

250

pA

Vec'" 5.5V. Vo '" 5.5V,
IF ~ 250pA

Volt~ge

VOL

0.5

0.6

V

Vee = 5.5V, IF ,. 5mA
IOL (Sinking) '" 13mA

High Level Supply Current

ICCH

14

30

mA

Vec '" 5.5V. IF "0
(Both Channels)

Low Level Supply

ICCl

28

36

mA

Vee" 5.5V, IF = lOmA
(Both Channels)

Input-Output Insulation

11-0*

1

pA

45% RH, t = 5s,
VI-O = 3 kV do, TA = 25°C

High Level Output Current
low Level Output

I OPT010
Resistanoe (I nput-Outputl
Capacitance (I nput-Output)
Input Forward Voltage

I

3

4,9

AH :550%1""1 MIN

10

n

VI.O" SOOV, TA = 25°C

4

C,_O

0.6

pF

f

1.5

VF

1.75

BV R

Input Capacitance

CIN

60

11-1

0.005

nnput-Input)

3

VRMS

Input Reverse Breakdown
Voltage

5

= lMHz. T A '" 25°C

4
4

7,3

V

IF '" 10mA, T A '" 25°C

V

IR

pF

VF "'O,f= lMHz

3

J.l.A

Relative Humidity = 45%,
t=5$. V l_r"500V

8
8

= 10pA, T A" 25°C

AI_I

1011

n

VI-I'" SOOV

Capacitance (Input-Input)

Cr-I

0.25

pF

f= lMHz

Current Transfer Ratio

CTR

700

%

Resistance

3

10 12

=

Input-InpUt Insulation
Leakage Current

Note

RI-O

VI SO

2500

Figure

Test Conditions

IF '" 5.0mA, RL " lOOn

8
2

6

•• All typical values are at Vec = 5V. TA = 25 0 e

*For JEDEC ,registered parts.

Switching Characteristics at TA =25°C VCC = 5V
I

EACH CHANNEL
Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Figure

Note

Propagation Delay Time to
High Output Level

tpLH

55

75

ns

RL = 350 n, CL " 15pF,
IF'" 7,5mA

6,7

1

Propagation Delay Time to
low Output level

tPHL

55

75

ns

Rl '" 350 n, CL '" 15pF,
IF'" 7.5mA

6,7

2

Output Rise Time (10~90%)
Output Fall Time (90-10%)

tr
tf

ns

Common Mode Transient
Immunity at High Output level

ICMHI

50
20
100

RL "'350n,Cl = 15pF,
IF" 7.5mA
VCM'" 10Vp_p•
Rl '" 350n,
Vo (min.) ""2V, IF" OmA

9

5

Common Mode Transient
Immunity at Low Output Level

ICMLI

300

9

5

0$

VIp-s

V/p.s

VCM '" 10Vp_p,
Rl" 350n,
Vo (max.~ " O.8V
IF'" 7,5mA

NOTE: It is essential that a bypass capacitor (;01IlF to O.lIlF. ceramic) be connected from pin 8 to pin 5~ Total lead length between both
ends of the capacitor and the isolator pins should not exceed 20mm. Failure to provide-the bypass may impair the switching properties (Figure 5),

3-50

----- -------

NOTES:
>

1. The tPLH propagation delay is measured from the 3.75 rnA point
on the trailing edge of the input pulse to the 1.5V point on the trailing edge of the output pulse.

I

S

~

4

w

2. The tpHL propagation delay is measured from the 3.75 rnA point

,..~
ir
,..::>

on the leading edge of the input pulse to the 1.5V point on the
leading edge of the output pulse.

3

o

3. Each channel.

I

4. Measured between pins 1, 2, 3, and 4 shorted together, and pins 5, 6,
7. and 8 shorted together.
5. Common mode transient immunity in Logic High level is the maximum tolerable (positive) dVeM/dt on the leading edge of the common mode pulse, VeM. to assure that the output will remain in a
Logic High state O.e., VO>2.DV). Common mode transient immunity
in Logic Low level is the maximum tolerable (negative) dVCM/dt on
the trailing edge of the common mode pulse signal, VCM, to assure
that the output will remain in a Logic Low state (i.e., VO
I

I

J;

::>
0:

It

30

~

<.>

,
,,

10

3",A

V
I
V ~smA

-

Vo - COLLECTOR VOL TAGE - V
1.50

NOTE: Dashed characteristics indicate pulsed operation.

VF - FORWARD VOLTAGE - VOLTS

Figure 4. Input Diode Forward Characteristic

CURVE
TRACER
TERMINALS

______ .£ GND BUS IBACK)

Figure 2. OptocQupler Transfer Characteristics.

Figure 5. Recommended Printed Circuit Board Layout.

3-51

+SV
PULSE
GEf>I£RATOR

'F

Zo'50r,

100

J:R"'Sn,

RL

,

>

~

!::--t--
-

- ····-R

tlo,.•• ....

"

MONITORING
NODE

47 "

I--

~

5

10

15

IFH - PULSE INPUT CURRENT - rnA

VOH
1.5V

- - - - - VOL

Figure 7. Propagation Delay, tpH Land tPLH
vs. Pulse Input Current, I FH.

Figure 6. Test Circuit for tpHL and tpLH'

r--i;~----------------~-L~~-oChanA

+5V
INPUT ~-, ~~--r

[:>0---0

Chan

Chan B

r-~---t--.--O~V

7404

A~L_ _ _ _....I
470.1'2

Chan B

---+-"1
!-

tOL = 50 ns (delay in response to
, -_ _ _ logic low level input)

.OlJ.lF
BYPASS

tDH '" 30 ns (delay in response to
logic high level input)
TA=2S"C

Figure 8 .. Response Delay Between TTL Gates.

tr= 160n$
55n$

VCM

r-.....---T-Q ~V

tf=

.OlpF
BYPASS
350n

Vo
Vo ------~~~--------------SV
SWITCH AT A: IF'" OmA

VCM

Vo

------------~VOL

+n.}----4

SWITCH AT B: IF = 7.5mA

PULSE GEN.

Figure 9. TeSt Circuit for Transient Immunity and Typical Waveforms.

3-52

DUAL CHANNEL
HIGH C"MR HIGH SPeED
OPTOCOUPLER

:: '" *

TECHNICAL DATA

~'" ,-_..,.._-1r-_-..'-'_cc_ _-:--o :::

-

2

HCPL-2631

_____ 1
9.901.390)
1 _~1.3701
: 8

I
I

7

6

0.18 (.0071
D.33 [(ff31

:i
,.---==---rr===1

5

j

;rYPE NUMBER;
DATE CODE

I

I

JANUARY 1986

iUQ 1.2401

7.36 ~I 6.60 (2601
71fij 1.3101
~,....,.-,:-r.....-::,...,..."..-J

I

UL

RECOGNITl'oN L ___ _

5' TYP.

J.

1
--,.-+----<>---_-O GND

NOTE;
L . -_ _L -_ _
A .01 TO O.1,uF BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS 8 AND 5. SEE NOTE 1.

ANODE, 1

II

Figure 1. Schematic

"

Features

,.1

• INTERNAL SHIELD FOR HIGH COMMON
MODE REJECTION (CMR)

0.76 (.0301

iAO (.0551

•
•
•
•

HIGH DENSITY PACKAGING
HIGH SPEED: 10 MBd TYPICAL
LSTTL AND TTL COMPATIBLE
GUARANTEED MINIMUM COMMON MODE
TRANSIENT IMMUNITY: 1000 V/!,s
• GUARANTEED PERFORMANCE OVER
TEMPERATURE 0' C to 70' C

j

CATHODE, 2

-lo511.0201

I

M1N. CATHooe

2

3

2,921.1151 MIN.
,~ -0.65(.026) MAX.
ANODE, 4

I_I--- ~
(,0901
2.80 (.1101

and floating power supplies. The internal shield makes the
HCPL-2631 ideal for use in extremely high ground or
induced noise environments.

ReCOmmended operating
Conditions
Input Current, low Level
Each Channel
Input Current, High Level
Each Channel
Supply Voltaqe, Output
Fan Out (TIL Load)
Each Channel
Operating Temperature

Applications
ISOLATION OF HIGH SPEED LOGIC SYSTEMS
MICROPROCESSOR SYSTEM INTERFACES
ISOLATED LINE RECEIVER
COMPUTER-PERIPHERAL INTERFACES
GROUND LOOP ELIMINATION

Description
The HCPL-2631 is a dual channel optically coupled logic
gate that combines GaAsP light emitting diodes and
integrated high gain photodetectors. Internal Shields
provide a guaranteed common mode transient immunity
specification of 1000 V/j.Ls. The unique design provides
maximum DC and AC circuit isolation while achieving
LSTTL and TTL logic compatibility. The logic isolation is
achieved with a typical propagation delay of 40 nsec. The
dual channel design saves space and results in increased
convenience.
The HCPL-2631 is recommended for high speed logic
interfacing, input/output buffering and for use as line
receivers in environments that conventional line receivers
cannot tolerate. The HCPL-2631 can be used for the
digital programming of machine control systems, motors,

I l
II

OI!"ENS10NS IN MILLIMETRESANO IINCHES).

• RECOGNIZED UNDER THE COMPONENT PROGRAM OF
U.L. (FILE NO. E55361) FOR DIELECTRIC WITHSTAND
PROOF TEST VOLTAGES OF 1440 Vac, 1 MINUTE AND 2500
Vac, 1 MINUTE (OPTION 010).

•
•
•
•
•

~

I

.4.701.1861 MAX,

Sym.

Min.

Max.

Units

IFL

0

250

j.LA

IFH
Vee

6.3"
4.5

15
5.5

rnA
V

N
TA

0

8
70

°C

'6.3 mA conditIOn permits at least 20% CTR degradation
guardband. Initial switching threshold is 5 mA 'or less.

Absolute Maximum Ratings
(No derating required up to 70° C)
Storage Temperature ................ -55'C to +125°C
Operating Temperature ................. O°C to +70°C
Lead Solder Temperature ............... 260° C for 105
(1.6 mm below seating plane)
Average Forward
Input Current (each channel) ...... 15 mA (See Note 2)
Reverse Input Voltage (each channel) .............. 5 V
Supply Voltage - Vee ........ 7 V (1 Minute Maximum)
Output Current - 10 (each channel) ....... . . . .. 16 mA
Output Voltage - Vo (each channel) ............... 7 V
Output Collector Power Dissipation
(each channel) .............................. 40 mW

3-53

Electrical Characteristics
(Over Recommended Temperature, TA = O°C to +70°C, Unless Otherwise Noted)

Parameter

Symbol

Low Lellel Output Voltage
High Level Output Current
High Lellel Supply Current
Low Level Supply Current
Input Forward Voltage
Input Reverse Breakdown
Voltage

Min.

Test Conditions

Vee = 5.5V. iF = 5 mA

Note

2,3

3

0.6

V

IOH

20

250

I1A

Vee'" 5.SV. Vo = 5.5 V,
IF "" 250 pA

lecH

20

30

mA

Vee = 5.5V, 'F = 0,
(Both Channels)

38

rnA

Vee=5.5V,IF= 10 mA,
(Both Channels)

1.75

V

IF=10mA, TA=25·C

V

IR = 10 MA, TA "" 25°C

3

pF

VF = 0, f"" 1 MHz

3

-;

IceL

1.5

VF
BVR

em

60.

!1VF
ATA

-1.6

Input·Output Insulation

1'-0'
Visa

I

mVl·

IOl (Sinking)'" 13 rnA

2500

pA

1011

.0

VI-I =500V

CI-I

0.25

pF

f'" 1 MHz

Resistance (Input*Output)

AI-o

1012

capacitance (Jnput~Output)

C,-O

0.6

,

'For JEDEC registered parts.

=f~

3

4,5
.

:

Relative Humidity == 45%
t=58, VI-! =500V

0.005

Resistance UnpuHnputl

5

45% RH, t = 5s.
VI-Q .. 3 kV dc. T A= 25°C
RHs500/0p=1 MIN

1

-;-

4 -

=10mA

II-I

Capacitance (Input-Input)

Figure

0.4

Input Capacitance

I OPT 010

Units

VOL

Input Diode Temperature
Coefficient

InpuHnput Leakage
Current

Max.

Typ.*"

6
6

Vl-o=500 V

4

f=1 MHz
•• All typical

value~

13

are at Vee = 5 V, TA = 25° C.

Switching Characteristics (TA = 25°C, Vee = 5vi
Paramehr
Propagation Delay Time to
High Output Lellel

Symbol.

Min.

tpLH

Typ.

Max.

40

75

Note

est Conditions

3.7

Propagation Deray Time to
Low Output Level

6

Output Rise Time (10-90

3,8
3

Output Fall Time (9MO%)

3

Common Mode
Transient Immunity
at High Output Level

ICMHI

1000

10,000

Common Mode
Transient Immunity
at Low Output Level

ICMLI

1000

10.000

3-54

Vlt.£S

VCM = 50 V (peak),
Vo {minJ "" 2 V,
Rl = 350 n.1F=0 mA

10

3,9,11

Vips

VCM = 50 V (peak),
Vo (max.) '" 0.8 V,
AL = 350 n, IF=7.5mA

10

3.10,11

7. The tpLH propagation delay is measured from the 3.75 mA
point on the trailing edge of the input pulse to the 1.5 V
point on the trailing edge of the output pulse.
8. The tpHL propagation delay is measured from the 3.75 mA
point on the leading edge of the input pulse to the 1.5 V
point on the leading edge of the output pulse.
9. CMH is the maximum tolerable rate of rise of the common
mode voltage to assure that the output will remain in a high
logic state (I.e., VOUT > 2.0 VI.
10.CML is the maximum tolerable rate of fall of the common
mode voltage to assure that the output will remain in a low
logic state (I.e., VOUT > 0.8 VI.

NOTES:
1. Bypassing of the power supply line is required, with a 0.01
I'F ceramic disc capacitor adjacent to each isolator as illustrated in Figure 14. Total lead length between both ends of
the capacitor and the isolator pins should not exceed 20
mm. The power supply bus for the isolator(sl should be
separate from the bus for any active loads, otherwise a
larger value of bypass capacitor (up to 0.1 I'F) may be
needed to suppress regenerative feedback via the power
supply. Failure to provide the bypass may impair the switching properties.
2. Peaking circuits may produce transient input currents up to
50 mA, 50 ns maximum pulse width, provided average current does not exceed 15 mA.
3. Each channel.
4. Measured between pins I, 2, 3, and 4 shorted together, and
pins 5, 6, 7, and 8 shorted together.
5. This is a proof test. This rating is equally validated by a 2500
Vac, 1 sec. test.
6. Measured between pins 1 and 2 shorted together, and pins 3
and 4 shorted together.

>,
w

~g
~
5o
irl

iii-'

~,

0.8

5.0

V~" 6.~V

0.7

IFI '"

5',mA

>,

0.6

,

ffi
a:

a:

""

ii!
I-

o. 3 - ' 0 ~ 12.amA

2-,'o"6.4mA
',/ ~
t~ ~ 9.6~A/

10

20

30

"0,

/

40

I

50

TA - TEMPERATURE _

60

70

"c

"cw

2.0

o

o

250pA

";:,

2.0

-

'-.,

.........

-'

10

~

~

.S>
10

1.0

'F

l:

0 1<0,.
o

S.5V

20

>
w

Rc "lkn
T.,0-70"C

\

1.0

-'

I

5,5~

~

'\~

I-

TA"'O-70~C

Veel •

Vo

[\.

~

RL • 350.\1

0

>

30

1\

I-

>

~'"

40

I-

4.0

l-

0.4

1

'[

"IVfC 05.0V
J

3.0

= 1TfCMVCM (p-pl

12.As illustrated in Figure 14, the VCC and GND traces can be
located between the input and the output leads of the
HCPL-2631 to provide additional noise immunity at the
compromise of insulation capability.
13. See Option 010 data sheet for more information.

~

0

'0-"1 16.0mA

Id~~MI )
max

w

""':;

0.5

o.

11. For sinusoidal voltages, (

3.0

4.0

5.0

20

30

40

50

60

70

6.0
TA -TEMPERATURE _ °C

IF - FORWARD INPUT CURRENT - mA

Figure 2.

Low Level Output Voltage vs.
Temperature

Figure 3.

Output Voltage vs. Forward
Input Current

Figure 4.

High Level Output Current
vs. Temperature

PULSE
GENERATOR

Zo"50fl
80

,
~c

,

IZ

w
a:
a:

'" 1.-5 mA+--+-

z

o

""c
a:

~

~o

"~
~

,

*CL is approximately 15pF, which includes

probe and stray wiring capacita,lce.

:~pu~J -

V F - FORWARD VOLTAGE - VOLTS

Input Diode Forward
Characteristic

- - -

-'}---=:: ::::::A

Figure 6.

'PHL

1-

~

_

... .. --.-

20~~~~-~---+--+---+--4

10

'PLH

Test Circuit for tpHL and
tpLH' Note 3

3-55
--

,

if

r-e~TPUT~'.5V
~

Figure 5.

Vee -= S.OV

IF

c

~

------~--~---------------

20

30

40

50

TA =TEMPERATURE-oC

Figure 7.

Propagation Delay vs.
Temperature

60

70

210

vee'" S.OV

ao

~

200

• 2S"C
T"

I

>

70

c

60

~

w

:;

Z

Output Vo
Monitoring

i=
::j

l!.I::::";:~5fr----,~--0

;;:

'i="



~~

6000

~~

4000

Vee ~
IFH ""
1Ft ....
VOH "
VOL'

H

~I

Figure 9.

S.OV
7,5 mA
OmA
2.0V a.8V

Vo 0.5 V _ _ _ _..Jf\-

Rise, Fall Time vs.
Temperature

Vee1 _5'_V_r----....,

-

Vo (mox.)

Figure 10. Test Circuit for Common
Mode Transient Immunity
and Typical Waveforms. Note 3

1/2 2631
r----------,
la

I

5V
VCC2

I

.1L.1

RL .3S0il
TA "2S'C _

11

8~
u~

f-

a:
~

~ANOCMH

I

1

2000

I

!

200

400

I

GND 1

Figure 12. Recommended TTL/LSTTL to TTLILSTTL Interface Circuit

1.4

w

Veel • 5,01v

~~

1.3

~~

VOH " 2.0 V VOL" O.B\I

1.2

'F" • 7,!>mA-

i5~
ul-

in

~

1.1

i'..

t=Ui

-'

I

II

:
u

:;

ilL • 350il -

,,~

~

.8
.7

o

______ LGND BUS (BACKI

In '" OmA

10

20

30

40

~~==~~==~~==~>OUTPUTl

.........

===>

'-

50

I'-.
60

70

NDTES 1. 12

TA - TEMPERATURE _oC

Figure 13. Relative Common Mode Transient
Immunity vs. Temperature

Figure 14.

Recommended Printed Circuit Board Layout

3-56

OUTPUT 2

rli~ HEWLETT

a!e.

PACKARD

LOW INPUT CURRENT,
HIGH GAIN
OPTOCOUPLERS

6N138
6N139

TECHNICAL DATA

_~ (.3701 ~I OUTLINE DRAWING'

\

9.90 L390}

:8

7

rt:. XXXX

a!.~ VVWWRJ

Vee

t-

65

TYPE NUMBER
DATE CODE

I

B

+

lice

6.10 (240)

7,31} (.290) 6,60 (.2$O!

I

ml.,,0)

h-rr""-'T?T-r.'" ~~COGNITION\

JANUARY 1986

SCHEMATIC

A N D DI,E 3 '

+

l

v,

~

CATHODE 3

~

I,
I

-

,.1 -

0,76 (.030)

f40 iFs5,

! --

II

4,7Q t.185! MAX. NO 1

I
jt 0.51 1.020)

~

MIN,

ANODE'

CATHODE 3

Applications

2.", (.115) MIN.
--0.65 "025) MAX.
NC, 4

'I-f--. ~:;~ ~:~::

DIMENSIONS IN MIU'-"-iET-R-ES-A-ND-JtNCHES,

•

Features
• HIGH CURRENT TRANSFER RATIO-2000% TYPICAL
• LOW INPUT CURRENT REQUIREMENT - 0.5 mA
• TTL COMPATIBLE OUTPUT - 0.1 V VOL TYPICAL
• HIGH COMMON MODE REJECTION - 500 V/p.s
• PERFORMANCE GUARANTEED OVER TEMPERATURE 0° C to 70° C
• BASE ACCESS ALLOWS GAIN BANDWIDTH
ADJUSTMENT
• HIGH OUTPUT CURRENT - 60 mA
• RECOGNIZED UNDER THE COMPONENT PROGRAM
OF U.L. (FILE NO. E55361) FOR DIELECTRIC
WITHSTAND PROOF TEST VOLTAGES OF 1440 Vac,
1 MINUTE AND 2500 Vac, 1 MINUTE (OPTION 010).

Ground Isolate Most Logic Families - TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL

•

Low I nput Current Line Receiver - Long Line or Party line

•

EIA RS-232C Line Receiver

•

Telephone Ring Detector

•

117 V ac Line Voltage Status Indicator - Low Input Power
Dissipation

•

Low Power Systems - Ground Isolation

Absolute Maximum Ratings *
Storage Temperature . . . . . . . . . . . . . _55°C to +125°C
Operating Temperature. . . . . . . . . . . . . . .. O°C to +70°C
Lead Solder Temperature . . . . . . . . . . ..
260°C for lOs
(1.6mm below seating plane)
Average Input Current-IF . . . . . . . . . . . . . . . . 20mA [1]
Peak Input Current - IF . . . . . . . . . . . . . . . . . . . . 40mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF. . . . . . . . . . . . .. 1.0A
(";;; 11ls pulse width, 300 pps)
Reverse Input Voltage - V R . . . . . . . . • . . . . . . . . . . 5V
Input Power Dissipation. . . . . . . . . . . . . . . .. 35mW [2]
Output Current - 10 (Pin 6) . . . . . . . . . . . . . . 60mA [3]
Emitter-Base Reverse Voltage (Pin 5-7)
. . . . . . . . . . . 0.5V
Supply and Output Voltage - Vcc (Pin 8-5), Vo (Pin 6-5)
6N138 . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7V
6N139 .. , . . . . . . . . . . . . . . . . . . . . . . . -0.5to18V
Output Power Dissipation . . . . . . . . . . . . . . . . 100mW [4]

Description
These high gain series couplers use a Light Emitting
Diode and an integrated high gain photon detector to provide extremely high current transfer ratio between input
and output. Separate pins for the photodiode and output
stage result in TTL compatible saturation voltages and
high speed operation. Where desired the Vee and Vo terminals may be tied together to achieve conventional
photodarlington operation. A base access terminal allows
a gain bandwidth adjustment to be made.
The 6N139 is for use in CMOS, LSTTL or other low power
applications. A 400% minimum current transfer ratio is
guaranteed over a 0-70° C operating range for only 0.5 mA
of LED current.

See notes, following page.

CAUTION: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which may
be induced by ESD.

The 6N138 is designed for use mainly in TTL applications.
Current Transfer Ratio is 300% minimum over 0-70° C for an
LED current of 1.6 mA [1 TTL Unit load (U.L.)]. A 300%
minimum CTR enables operation with 1 UL. out with a 2.2
kp. pull-up resistor.

'JEDEC Registered Data.

3-57

Electrical specifications

OVER RECOMMENDED TEMPERATURE (TA = O°C to 70°C), UNLESS OTHERWISE SPECIFIED
Sym.

Parameter

Current Transfer Ratio

eTR'

Device
6N139
6N138

Logic Low
OutPUt Voltage

VOL

Logic High
Output Current

10H*

Logic Low
Supply Current

leCL

Logic High
Supply Current

Min.

Typ."

400
500
300

2000
1600
1600

%

0.4
004

.'-.

Test Ct>nditions

Fig.

Note

IF - 0.5mA, Vo m OAV. VCC - 4.5V
fF~ 1.6mA, Vo ~OAV. Vee~4.5V
IF - 1.6mA, Vo - 0.4V, VCC 4,5V

3

5,6

'F = 1.6mA. 10 ~ 6AmA, VCC"4.5V
IF ~ 5mA. 10 = 15mA, Vce = 4.5V
IF = 12mA, 10 = 24mA, VCC = 4.5V
IF = 1.6mA, '0 - 4.8mA, Vee ~ 4.5V

1.2

6

6N138

004

V

6N139
6N138

0.05
0.1

100
250

!J;A
ilA

IF - OmA, Vo = Vce - l8V
IF - OmA, Vo - Vee- 7V

mA

IF = 1,6mA. Vo

nA

IF ~ OmA. Vo " Open. Vee

V

IF

=1.6mA, TA = 25"C

fR

= 10!J;A, TA=25"C

10

VF'

1.4

Input Relferse
Breakdown Voltage

aVR'

Temperature Coefficient
of Forward Voltage

£WF
ATA

-1.8

Input CapaCitance

CIN

60

Input-Output
Insulation

IJ·o·

5

V

OA

0.4

ICCH

Visa

Units

0.1
0.1
0.2
0,1

6N139

Input Forward Voltage

I OPT. 010

Mal<.

1.7
V

mvfC

1

2500

6

= Open. Vec = 5V

= 5V

6
4

IF= 1.6mA

pF

1=1 MHz, VF = 0

)'A

45% RH, t ~ 55, V,.a = 3kV dc,
TA=25°C

VRMS

6

7,11

RH $50%, t= 1 min.

12

Resistance
{J nput·Output}

R,·O

10''1

ft

VI.O = 500Vdc

7

CapaCitance
(lnput-Outpud

CI.O

0.6

pF

1= 1 MHz

7

"All typicals at TA ~ 25°C and VCC = 5V, unless otherwise noted.

'For JEDEC registered parts.

Switching Specifications
AT TA = 25°C, Vec

=

Parame-ter

5V
Sym.

Propagation DeJay Time
To logic low at Output tPHL*

Devl.e
6N139
6N138

Propagation Delay Time
To Logic High at Output

tPLH'

6N139
6N138

Min.

Typ.

Max.

5
0.2
1.6

25
1
10

18
2
10

60
7
35

Units
IlS
!J;'
)'S

!J;S

fig.

Note

'F 0.5mA, RL 4.1k!1
IF ~ 12mA, Rl = 270ft
IF =1.6mA, RL - 2.2kft

9

6,8

IF = 0.5mA, RL =4.1kft
IF = 12mA, RL = 270ft
'F = 1.6mA, RL - 2.2k,l1

9

6.8

Test Conditions

Common Mode Transient
Immunity at Logic High ICMHI
Level Output

500

V//J,s

IF ~ OmA, RL = 2.2kft, RCC = 0
Ivcm l= 10Vp i>

10

9,10

Common Mode Transient
Immunity at Logic Low ICMLI
Level Output

500

V/!J;s

IF ~ 1.6t'nA, R L = 2.2k,l1, RCC = 0
IVcml= 10Vp.p

10

9,10

NOTES:
1. Derate Iinearly above 500 C free-air temperature at a rate of 0.4 mA/" C.
2. Derate linearly above 500 C free-air temperature at a rate of 0.7 mW 10 C.
3. Oerate linearly above 25°C free-air temperature at a rate of 0.7mA/"C.
4. Derate linearly above 250 C free-air temperature at a rate of 2.0mW/" C.
5. OC CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10, to the forward LED input current, IF, times 100%.
6, Pin 7 Open.
7. Device considered a two·terminal device: Pins 1.2.3, and 4 shorted together and Pins 5, 6. 7, and 8 shorted together.
8. Use of a resistor between pin 5 and 7 will decrease gain and delay time. See Application Note 951·1 for more details.
9. Common mode transient immunity in Logic High level is the maximum tolerable (positive) dVcm/dt on the leading edge of the common mode
pulse. Vcm • to assure that the output will remain in a Logic High state {i.e., Vo > 2.0VI. Common mode transient immunity in Logic L 2.0VI. Common mode transient immunity in Logic Low
level is the maximum tolerable (negative) dVCM dt on the trailing edge
of the common mode pulse signal, VCM, to assure that the output will
remain in a Logic Low state O.e., Va < 0.8Vl.
11. In applications where dV/dt may exceed 50,000 V/J.Js {such asa static
dischargel a series resistor, RCC, should be included to protect the
detector IC from destructively high surge currents. The recommended
value is RCC

iO::

0.3

I~ ~mAJ k-n~

12. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec. test.
13. See Option 010 data sheet for more information.

3-62

Absolute Maximum Ratings
Storage Temperature .......... -55°C to +125°C
Operating Temperature ......... -40°Cto +85°C
Lead Solder Temperature ....... 2S0°C for 10sec
(1.Smm below seating plane)
Average Input Current - IF
(each channel) ..................... 20 mA [1)
Peak Input Current - IF
(each channel) . . . . . . . . . . . . . . . . . . . . . .. 40 mA
(50% duty cycle, 1 ms pulse width)
Reverse Input Voltage - VR
(each channel) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V

Input Power Dissipation
(each channel) . . . . . . . . . . . . . . . . . . .. 35 mW [2)
Output Current - 10
(each channel) . . . . . . . . . . . . . . . . . . .. SO mA [3)
Supply and Output Voltage -Vee (Pin 8-5) , Vo (Pin
7,S-5} [4]
HCPL-2730 ........................ -0.5 to 7V
HCPL-2731 ....................... -0.5to 18V
Output Power Dissipation
(each channel) ................... 100 mW[5]

HCPL - mOIHCPL .. 2500

o
;:

"
E

'f

ffi

a:
a:

/"
'//

~ 1500

*
i

a
5
5o

....
....

aI

°

~

iiia:
a:

a
5

§

V

"-

I

E

"'"

o·~':-.,-----'!-----;,o!:-_.J

'0

0.'

Figure 1. DC Transfer Characteristics
(HCPL-2730/HCPL-2731 )

E
I

"

500

"
....

""",,"TA 'S5'C

o
Vo - OUTPUT VOLTAGE - V

Vo"'O.4V

V~ ~TA.-40'C
~

1000

I

I
Veo' S'"'

r~ TA = :!S"C
"I ~TA -70'e

~ 2000

I

2'li

TA'" Ire

I

'F -INPUT DIODE FORWARD CURRENT - mA

IF - FORWARD CURRENT - rnA

Figure 3. Output Current vs Input Diode
Forward Current

Figure 2. Current Transfer Ratio vs
Forward Current

~
I

ffi
a:
a:

ao

i
~
I

'00
VF - FORWARD VOLTAGE - VOLTS

Figure 4. Input Diode Forward Current
vs. Forward Voltage.

IF - INPUT DIODE FORWARD CURRENT - mA

Figure 5. Su'pply Current Per Channel
vs. Input Diode Forward
Current.

3-S3

.~o_':,--'-.L..U.IIlll:.l-'-.LLLllI!',.-:,o..LJL.JJJJ.IJ,":o--'-J.J
T - INPUT PULSE PERIOD - ms

Figure 6. Propagation Delay To Logic
Low vs. Pulse Period.

0

,

ore

IiCPl.-2130
HCP.... U31

Vee =5V

_HQtl.. 273'1lUF '" Q,5 mA Rt. '" 4.1ktl)
"'''''-"(;.,1. mo (If! .. 1.6 rnA.. Rt. "" Uknl

33

'!l.

~

~
c

c

,

z
c

~

0

z
c

40

tpKf,. ..

,

,

t,

Rt. =' 2.2kn: OR 4,7kn

i...

i..

I- T.

60

30

...'H

1\' 4.1kll

'P;H

1\ •

20

10

\
II",

dnll

o

o

°c

TA - TEMPERATURE -

Figure 7. Propagation Delay vs.
Temperature ..

"

W

IF -INPUT DIODE FORWARD CURRENT - rnA

Figure 8. Propagation Delay vs. Input
Diode Forward Current.

___ --.J..-----

HCPL·2730

VI .
Vo---Th-

PULSE

GEl>!.
Zo=,50n
t, >#5r}s

HCPL·2731

...-t---.,----I

1.5V
-

-

-VOL

tpHL

~------,¥.

IF MONITOR

5V - - ---Vo

1.5V
---

VOL

t pLH -

Figure 9. Switching Test Clrcuil.

'f
vo---~

SWITCH AT A:

___

~~--------5V

IF" OmA

VO-----------~VOL
SWITCH AT B:

IF '" 1.6mA

'See Note 11.

Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.

3-64

'f-,.--- 2.5VI. Common mod. transient immunity in
Logic low level is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode pulse signal, Vcm , to assure
that the output will remain in a logic Low state (i .•. , Vo < 2.!iV).
10. This is a proof lest This raling is equally vaiidaled by a 2500 Vac, 1 sec. lest

a

11. See Option 010 data sheet for more information.

3-66

pt).,o#~i="1
~.
..........-c:: "":r~
I--~

'00)1

-rA~25"C

~

~

E

80

.'

I
l-

15

~

~

:>

V

~

40

~

I

I

E

20

,.
0

0

0

;::

II-

~

',6

10,000

Vo'=,1,tiV·

~

'.0

"

0.4

'·02"'"
2,0

~
~
I

'0

"

_.

5,0
IF - FORWARD CURRENT - rnA

Figure 3. Output Current vs. Input
Current.

_t~lH

---tiHI..
I

>

~\

\<

P

~

"o"

5

10

20

50 100

.....
E '\..... r---__

,~

1.0

Figure 4. Current Transfer Ratio vs.
Input Current.

~
~

"'....

T4

---

~

I

21te

-""-,,,",,"--

'5

20

'00
TA - TEMPERATURE _ ac

IF - FORWARD CURRENT - mA

Figure 6. Propagation Delay vs.
Temperature.

Figure 5. Propagation Delay vs. Forward
Current.
1"_ _ __

I,

't?lH

....

'0

IF - FORWARD CURRENT - mA

~

Rl ""220n

I

10,000 ~'"C;

4,0

VRL1,0,,,

0

"'t;

3,0

1000

""o
'00
~

0.8

~

,
I

'.2

1l
~

~

f'- -

Figure 2. Typical DC Transfer

NORMALIZED TO:

0.6

'~""

O,SJAC"

-.... ..-

Characteristics.

',4 r--~~-+-~ eTA@IF "'- 1.0 rnA
TJ\~ 25'C

~::;

,I

Vo -OUTPUT VOLTAGE - V

Forward Voltage.

""
~
"
;i

zmA

!

-

',0

V F - FORWARD VOLTAGE - VOLTS

Figure 1.. Input Diode Forward Current vs.

....3~r' ..

:,.;.. .,:.-r-

50

.!!-

-:.:.

~~

I-

il'

.

...

I

60

1l

"c
""

.' ',,"

l~~,.~i--'~~
., "~i "...
'1"''1....;:': - .-

E

I
l-

0----1

__

I

I

>

~

VO---J'I , ---VOL
2.'5V

""o
~
'":l:

"HJ~

',-----,
o
!-,----

~

POl.Sf
GEN.
~Qtr

""son

""5M

Vo
IF MONITOR

I

I

I
I
I

'.~L.,_"-'-~,.O---c,~O--.L,L.O-:-O

I
I

--='' ' 00'0

I
I

RL - LOAD RESISTOR - kn

Figure 7. Propagation Delay vs Load
Resistor.

Figure S. Switching Test Circuit

t r• tf =

VCM

16ns

Vo
Vo

----~~~---------5V

SWITCH AT A:

IF'" OmA

Vo ------------~VOL
SWITCH AT B: IF = 1.0 rnA

Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.

3-67

0
j:

2.0

~

1.8

0

1.S

'~'_~H'

a:

in

Vo

¢.1.0V
NORMAl.IZEO TO:

~,~~C "'t~ eTA:@if '" 1.0 mA, Ax ." -'""

I

>

v;

z

~

'"
a:
....
....

0

"....Q

~

"'"
;t

::>

u

Vo

~

~

'"

I>

:::;

I

~

0
Z
I

a:

t;

Figure 10. External Base
Resistor, RX

IF - FORWARD CURRENT - rnA

Rx - EXTERNAL RESISTOR - kn

Figure 11. Effect of R X On
Current Transfer Ratio

Figure 12. Effect of R X On
Propagation Delay

Applications

100 Kn

0,02/-1F

R(-)

4N46

Vee

-48 V DC

Ax Ikn}

tl"til tf}sj

20

5
5
5
6

10

6

~

100

47

tF'I.H tMS}

320

T(+)

100Kn

200

lN914

140

Vo

60
45

NOTE: AN INTEGRATOR MAY BE REQUIRED AT THE OUTPUT TO
ELIMINATE DIALING PULSES AND LINE TRANSIENTS.
"SCHMIDT TRIGGER RECOMMENDED
BECAUSE OF LONG t r , tf.

TTL Interface

Telephone Ring Detector

V
4N46

Vee

Vee

(~~ ~~~~~ -

4N46)

RS

v tVdt Or VIm!)
ADD FOR
AC INPUT

I

Vo

RS

2'

47kQ

48
115

10010:,0

;130

nokQ
470k!]

V-IF h'nWl

11
22
62
113

Line Voltage Monitor

CMOS Interface

+Vcc,o-----.......----.

CHARACTER ISTICS
RIN '" 30MD, ROUT'" 50n
VINIMAXJOO VCC 1 -1V'ILINEARITY BETTER THAN 5%
I--H>-{)VOUT

DESIGN COMMENTS
Rl _ NOT CRITICAL

«<

VIN (MAX.! - (- VCC 1) - VBE)hFE 03
IF (MAK)

R2 - NOT CRITICAL (OMIT IF 0.2 TO O.3V OFFSET IS TOLERABLE)
V,N

R, >

VIN (MAX.) + VBE

1 mA
V,N IMAKI

Rs>

2.5mA

R,
6.8k

22k

NOTE: ADJUST R3

R,

-Vee1
Q" 02 - 2N3904
OJ - 2N3906

Analog Signal Isolation

3-68

so VOUT ;

VIN AT VIN ; VIN IMAX.)
2

- - - - - - - --._----

F/;'II

a!!~

A~¢'9C'vmfD

htEWLE;i~~

LOOIC

IN l'ERFACE

PACKARD

HCPL·3700

OPTOCOUPLER
TECHNICAL DATA

JANUARY 1986

SCHEMATIC

DC+ INPUT

Vee

DC-INPUT

GND

DIMENSIONS IN MllUMETRES AND (INCHES).

Features

Applications

•
•
•
•

• LIMIT SWITCH SENSING
• LOW VOLTAGE DETECTOR
• AC/DC VOLTAGE SENSING

AC OR DC INPUT
PROGRAMMABLE SENSE VOLTAGE
HYSTERESIS
LOGIC COMPATIBLE OUTPUT
o SMALL SIZE: STANDARD 8 PIN DIP
• THRESHOLDS GUARANTEED OVER
TEMPERATURE

• THRESHOLDS INDEPENDENT OF
LED DEGRADATION
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).

•
•
•
•
•

RELAY CONTACT MONITOR
RELAY COIL VOLTAGE MONITOR
CURRENT SENSING
MICROPROCESSOR INTERFACING
TELEPHONE RING DETECTION
HCPL-3700

LOGIC

Description
The HCPL-3700 is a voltage/current threshold detection
optocoupler. This optocoupler uses an internal Light
Emitting Diode (LED), a threshold sensing input buffer IC,
and a high gain photon detector to provide an optocoupler
which permits adjustable external threshold levels. The
input buffer circuit has a nominal turn on threshold of
2.5 mA (ITH+) and 3.8 volts (VTH+). The addition of one or
more external attenuation resistors permits the use of this
device over a wide range of input voltages and currents.
Threshold sensing prior to the LED and detector elements
minimizes effects of different optical gain and LED
variations over operating life (CTR degradation). Hysteresis is also provided in the buffer for extra noise immunity
and switching stability.

The buffer circuit is designed with internal clamping
diodes to protect the circuitry and LED from a wide range
of over-voltage and over-current transients while the
diode bridge enables easy use with ac voltage input.
The high gain output stage features an open collector
output providing both TTL compatible saturation voltages
and CMOS compatible breakdown voltages.
The HCPL-3700, by combining several unique functions
in a single package, provides the user with an ideal
component for industrial control computer input boards
and other applications where a predetermined input
threshold optocoupler level is desirable.

3-69

Absolute Maximum Ratings

(No derating required up to WC)

Symbol

Min.

Max.

Units

Storage Temperature

T$

-55

125

·C

Operating Temperature

TA

-40

Parameter

Lead
Soldering
Cycle

85

°C

Temperature

260

°C

Time

10

sec

1
50

Average
Input
Current

Note

Surge

140

liN

2
mA

2.3

500

Transient

V

Input Voltage (Pins 2-3)

VIN

Input Power Dissipation

PIN

230

mW

4

Total Package Power Dissipation

P

305

mW

5

Output Power Dissipation

Po

210

mW

6

Output
Current

10

30

mA

7

Average

-0,5

Supply Voltage (Pins 8-5)

Vee

-0.5

20

V

Output Voltage (Pins 6-5)

Vo

-0.5

20

V

Symbol

Min.

Max.

Units

Vec

4.5

18

V

TA

0

70

°C

f

0

4

KHz

Recommended operating Conditions
Parameter
Supply Voltage
Operating Temperature
Operating Frequency

Switching Characteristics
Parameter

Symbol

Note

8

at TA = 25 0 C, Vee = 5.0V

Min.

Typ.9 Max. Units

Propagation Delay Time to
Logic Low Output Level

\PHL

Propagation Delay Time to
Logic High Output Level

tPlH

10.0

Common Mode Transient
Immunity at Logic Low
Output Level

ICMLI

600

Common Mode Transient
Immunity at Logic High
Output Level

ICMHI

4.0

15

#8

Conditions

fig. Note
10

RL = 4.7 kfl, CL "" 30 pF
6,9

40

p's
V!#s

4000

V/#s

liN = 3.11 mA, RI. = 4.7 kH
Vo max. 0.8V. VeML = 140V

=

8.10 12.13

liN = 0 mA, RL = 4.7 kfl
Vo min, "" 2.0V, VCMH = 1400V

Output Rise Time (10-90%1

tr

20

P.s

RL = 4.7 kil. CL, = 30 pF

Output FaU Time (90-10%)

It

0,3

1'8

RL = 4.7 kfl. CL = 30 pF

3-70

11

RL = 4.7 kO, CL = 30 pF

7

---~

---

--

---------

---~

~--------

Electrical Characteristics
Over Recommended Temperature (DOC S TA S 70°C) Unless Otherwise Specified
Parameter

Symbol

Min.

TYp·9 Max. Units.

ITH+

1.96

2.5

3.11

mA

hH-

1.00

1.3

1,62

mA

V,N = VTH~ : Vcc "" 4.5V;
Vo = 2AV; 108 S 100 I1A

VTH+

3.35

3.8

4.05

V

VTH-

2.01

2,6

2.86

V

V'N= V2 - V3;Pi"ns 1 & 4 Open
Vcc = 4.5V: Vo = 2AV:
10:5 100 I1A

VTH+

4.23

5.1

5.50

V

VIN=lvl ~V4kPins2&30pen
Vcc'" 4.5V: Vo = OAV:
102. 4,2 mA

Input Threshold Current

DC
iPin,s.2,31

,

Input Threshold
Voltage
AC
I Pins 1,4)

Input Clamp Voltage

Input Current

2.87

3.8

4.24

V

2,3

14,15

Vcc = 4.5V; Vo = 2AV;
10:5 100}.LA

= ITH+ -

IHYS

1,2

mA

1.2:'

V

= VTH+ - VTHVtHCl = V2 - V3; Va = GND;
liN'" 10 mA; Pin 1 & 4
Connected to Pin 3

IHYS

ITH-

VHYS

V,HCl

504

5.9

6,6

V

V'HC2

6.1

6,6

7.3

V

VIHC3

12.0

1304

V

V,HC3 = V2 - Va: V3 = GND;
liN 15 mA; Pinsl & 4 Open

VILC

-0.76

V

V'LC = V2 - V3; V3 = GND;
liN = -10 mA

lIN

3.0

3.7
0.59

V03,4

0,74

Logic Low Output Voltage

VOL

0.1

Logic High Output Current

10H

Logic Low Supply Current

ICCl

Logic High Supply Current

ICCH

Input-Output Insulation

11-0'

IOPT010
Input-Output Resistance

VISO
RI-o

Input-Output Capacitance
Input Capacitance

404

mA

VIHC2"" IV, - V4!; IIINI =
10 mA; Pins 2 & 3 Open

VIN = V2 - V3 5.0V;
Pins 1 & 4 Open
liN

=3

= 4.2 mA

004

V
}.LA

VOH = Vcc

1.2

4

mA

V2 - V3 "" 5,OV; Vo = Open
Vcc = 5.0V

0.002

4

I1A
pA

2500

VRMS

Vcc "" 4,5V; 10L

Vce

2

1

5

mA (see schematic I

100

1

Note."

14

VIN = V2 - Va; Pins 1 &4 Open
Vcc 4,5V; Vo "" OAV;
102. 4.2 mA

VHYS

V01,2

Bridge Diode Forward Voltage

Fig.

VIN=IV1~V41: Pins2 &30pen
VTH-

Hysteresis

Conditions
V'N"'VTH+; Ve'c = 4.5V;
Vo = O:'4V; 102. 4.2 mA

5

l8V

= l8V; Vo

Open

45% RH, t '" 55,
V,-O = 3 kV dc, TA = 25Q C
RH<50%t=1 MIN

1012

!1

Vt-O = 500 Vdc

Ct-O

0.6

pF

CIN

50

pF

f = 1 MHz, VI-O = 0 Vdc
f=l MHz; VIN"'OV, Pins 2 & 3,
Pins 1 & 4 Open

4

14

14
16,17
18
16

'For JEDEC registered parts.
Notes:
1. Measured at a point 1.6 mm below seating plane.

5. Derate linearly above 70° C free-air temperatureat a rate of 5.4 mW/ o C.
6. Derate linearly above 70° C free-air temperature at a rate of 3.9 mW/ o C.
Maximum output power dissipation of 210 mW allows an output Ie
junction temperature of 125°C at an ambient temperature of TA =70° C
with a typical thermal resistance from junction to ambient of ()JAo =

2. Current int%ut of any single lead.

3. Surge input current duration is 3 ms at 120 Hz pulse repetition rate.
Transient input current duration is 10 P.s at 120 Hz pulse repetition rate.
Note that maximum input power, PIN, must be observed.
4. Derate linearly above 70° C free-air temperature at a rate of 4.1 mW/o C.
Maximum input power dissipation of 230 mW allows an input IC
junction temperature of 125°C at an ambient temperature of TA= 70° C
with a typical thermal resistance from junction to ambient of OJAj =
240°C/W. Excessive PIN and TJ may result in IC chip degradation.

265'C/W.
7. Derate linearly above 70 c C free-air temperature at a rate otO.6 mAIo C.
8. Maximum operating frequency is defined when output waveform (Pin
61 obtains only 90% of Vee with RL = 4.7 kn, CL = 30 pF using a 5V
square wave input signal.

3-71

9. All typical values are at TA = 25 0 C, Vce = 5.0V unless otherwise stated.
10. The tPHL propagation delay is measured from the 2.5V level of the
leading edge of a5~OV input pulse (1 pS rise time) to the 1.5V level on the
leading edge of the output pulse (see Figure 91.
11. The tPLH propagation delay is measured from the 2.5V level of the
trailing edge of a 5.0V input pulse (1 ps fall time) to the 1.5V level on the
trailing edge of the output pulse (see Figure 9).
12. Common mode transient immunity in Logic High level isthe maximum
tolerable (positive) dVCM/dl on the leading edge of the common mode
pulse,VcM, to insure that the output will remain in a Logic High state
(Le., Vo > 2.0V). Common mode transient immunity in Logic Low level
is the maximum tolerable (negative I dVCM/dl on the trailing edge of the
common mode pulse signal, VCM, to insure that the output will remain
in a Logic Low state (i.e., Vo < O.BV). See Figure 10.

13. In applications where dVeM/dl may exceed 50,000 VIps (such as static

14.

15.
16.
17.
18.

dischargel, a series resistor, Ree, should be included to protect the
detector IC from destructively high surge CUrrents. The recommended
value for Ree is 240n per volt of allowable drop in Vee (between Pin 8
and Veei with a minimum value of 240ft
Logic low output level at Pin 6 occurs under the conditions of Y,N ::::
VTH+ as well as the range of Y,N > VTH- once VIN has exceeded VTH+.
Logic high output level at Pin 6 occurs under the conditions of VIN :0:;
VTH- as well as the range pf VIN < VTH+ once VIN has decreased below
VTH-.
AC voltage is instantaneous voltage.
Device considered a two terminal device: pins 1, 2, 3, 4 connected
together, and Pins 5, 6, 7, 8 connected together.
This is a proof test. This rating is equally validated by a 2500 Vac,
1 sec. test.
See Option 010 data sheet for more information.

60
55

~----+,

I-- Vee

TA"'25. . . C~

I-- VO•

"

45

:Ja:

35

E

I
t-

I

w

30

t-

25

"

~

;:;

20

z

15

r~;'P

DC

Ii

~

t-

CONNeCTeD
TOGETHER;
PINS3,4
CONNECTED
TOGETHER

~
=>

t-

10

P1NS2.3
2.6V
VTH fDCI
3,8V
PINS 1,4
5.1V
VTH fACI
{AC VOLTAGE IS fNST ANTAN EOus VAL ve.).

IT" {AClDe} 2.S mA

I

I

~

TH.

1,3 rnA

VOH

o

1

I

,
I

TH+
3]V

I-I--

'~"

i

.;;O,4Y

VOH '" lAV
f..--10H';; 100 IJ.A

>

40

a:
=>

I

• 4,5Y

IOl '" 4,.2mA

PINS Z, 3
OR
PINS 1,4

i

\

I
I- YOt

-

-

TH~

VIN'- INPUT VOLTAGE - V

Figure 2. Typical Transfer Characteristics.

Figure 1. Typical Input Characteristics,llN vs. VIN'
(AC voltage is instantaneous value.)

4,2

>
I

90
a:

3,2

t-

3,0

w

!:;
"'"
0

I

2A

~

>

YTH' i

,

~

I

!

2.8
2.6

j

I I

I

tTH ..

!

2,0

!

I I I
~40

~20

I

:

i#.±:
!

~

~=>

1.8

~

- 1--' .6

~

40

TA - TEMPERATURE _

r-' A

'"-'w
~

=>
"I

:r

r'"
I

~

1,0

I

60

"

~
a:

1,2

i I
I

I

9

2.0

!

T

, I I
20

I

t-

:Ja:
a:
=>

2.2

I •

I ! I ! , ! .
~I

I

1
0

2.4

iii
;

'1

3,0

i I

, I i

!

22

1,8

3,2

,

i

I JTH.;....--r

2,8
2,6

>

j

3-6

3A

r

I

3-8

r

:fl

: :

I

4,0

(AC voltage is instantaneous value.)

80

il

0,8

-25

Ce

, 100
TA - TEMPERATURE _

°c

Figure 4. Typical High level Supply Current, ICCH vs. Temperature.

Figure 3. Typical DC Threshold Levels vs. Temperature.

3-72

24

4.2 ,-r--r-r-r-,-r--r-r-r-,-r--r-r-,24O
4.0

220

!

3.8
~

I

200~

IIl'4H

180

3.6

§

3.4

~~~:;i:~Y

3.2

Vee

1l

3.0

~

2.8

~

2.6

z

~

I.

1

f...... -

10

~
c

S.OV

120

~

c

t=rt-

+-t-t--

..... r-

I---

Vo\.

100

ul

140 ~

1.8

lOt '" 4.2 rnA

,--:,:---,-=!:-I'-LI--:I,-l--:,::-,-:,:---,-=!:--,-I-:!::--,
-40

-20

20

I

I>

40

TA - TEMPERATURE _

60

I--

>~

I

,/

I

' ..... i-""

L

V

.....-

-20

-40

°c

I
tpHL

"= ::-

I

20

40

.,.-

i

60

80

TA - TEMPERATURE -'C

Figure 6. Typical Propagation Delay vs. Temperature.

5000

300

"~....

=~ijoC

eM,

Vee =s.ov

liN 'OmA

VOH '" ~+OV

8

"

"z
8"

I

CMH

~

a:
~ 2000

~

1

j

I

3000

z

u.

,

VOL'" O.8V
Re .4.1 k!/

TA

;;;

200 I

20

lIN ;.!3.11 mA

ffi

w

30

ls.J

te
4000

"....~

40

'"

'.,."

tn If' I., (1D-9()%)

I

80

w
w

"I

l.L -

tpt.H

.

..... , /

~
~

"

1m. PULSE WIDTH

l=looHz

:

I
I

I

I

'L

~.

10

~

i=

I

I

I \

I

Figure 5. Typical Input Current. liN. and Low Level Output
Voltage. VOL. vs. Temperature.

'1

Ii

Vt'

12

~

0;:
....

-

14

~

~ t--80 ;

t--- 60
2.2 - f -t-,--l--lI--l--l--l--lI---jI.--1I- -lIi ----H 40
I -+~j-!'-1--120
2.0 H--l--!I--t--tl--t-+-+-+-+
2.4

16

Z

1.'0
IE

:Vf{:::

18

>-

I

1 CL =3QpF

20

"I

~

~

160

R~ • ~.7~n I

22

~

7

~

~

~-

t-- ~RL
TA

.1114.1kn
=2S"C

~ 1000

10

~

TA - TEMPERATURE _

"

°c

Figure 7. Typical Rise. Fall Times vs. Temperature.

500

00

400

I

I

'l

800

1200

1600

2000

VCM - COMMON MODE TRANSIENT AMPLITUDE - V

Figure 8. Common Mode Transient Immunity vs. Common

Mode Transient Amplitude.

HCPL-3700

Rce·

+5V

HCPL-3700

1-----

250

g

200

a

~

,

",~~.(
I-I

Vo

I

Figure 12. External Threshold Voltage Level Selection.

Either AC (Pins 1,4) or DC (Pins 2, 3) input can be used to
determine external threshold levels.
For one specifically selected external threshold voltage
level V+ or V- , Rx can be determined without use of Rp via
V+ -

Rx =

H

VTH+

ITH+
H

(-)

(1 )

For two specifically selected external threshold voltage
levels, V+ and V-, the use of Rx and Rp will permit this
selection via equations (2), (3) provided the following
conditions are met. If the denominator of equation (2) is
positive, then
and

Conversely, if the denominator of equation (2) is negative,
then
and

ITH+
ITH_

> --

(2)

See Application Note 1004 for more information.
150

:I:
f-

....

'~"
2

f-

15

(

Rp = ITH+ (V_ - VTH_ ) + ITH_ (VTH+ --: V+)

'"'~"

a:

I-)

vee

VTH_ (V+) - VTH+ (V_ )

300

I
w

a
>

".

HCPl-3700

ITH+
I-I

Rx

50

I

:>
RX - EXTERNAL SERIES RESISTOR -Idl

Figure 11. Typical External Threshold Characteristic, V± vs. RX'

3-74

(3)

OPrtCAilY COUPliD
2D nfA Ct!fRRENT'lOE)P
i
TRANSMITTER

HCPL-4100

TECHNICAL DATA

SCHEMATIC

OUTLINE DRAWING'

1

~
Vee

8

~

:

JANUARY 1986

_~1.3101_1

0.18 {.OO7}

9.90 1:39Ol

o.a:r t':lii3l::l

1

~~~:
~-

GND

0---=---+-----4_--'

SHIELD

4

10

1-

TRUTH TABLE
(POSITIVE LOGIC)"

V,

Vee

10

H
L
H
L

ON
ON
OFF
OFF

H
L
H
H

·CURRENT. LOOP CONVENTION - H· MARK:
10 ;:or. 12 rnA, L = SPACE: 10 ... 2 mAo

-t

t 4.70 1.186) MAX_

I! ! 'II
I

u MIN.
":,,,

rl ~.9H 1151 MIN.
0.76 (.030) • ---f -0.65 M)~5) MAX.
1.40 i:Oii6)

I- rI - ~
!:.!!.W
2.80 1_1101

Features

Description

• GUARANTEED 20 rnA LOOP PARAMETERS
o DATA INPUT COMPATIBLE WITH LSTTL, TTL
AND CMOS LOGIC
• GUARANTEED PERFORMANCE OVER
TEMPERATURE (0° C to 70° C)
• INTERNAL SHIELD FOR HIGH COMMON MODE
REJECTION
• 20 KBaud DATA RATE AT 400 METRES LINE
LENGTH
• GUARANTEED ON AND OFF OUTPUT
CURRENT LEVELS
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
• OPTICALLY COUPLED 20 rnA CURRENT LOOP
RECEIVER, HCPL-4200, ALSO AVAILABLE

The HCPL-4100 optocoupler is designed to operate as a
transmitter in equipment using the 20 mA current loop. 20
mA current loop systems conventionally signal a logic
high state by transmitting 20 mA of loop current (MARK),
and signal a logiC low state by allowing no more than a
few milliamperes of loop current (SPACE). Optical

Applications

coupling of the signal from the logic input to the 20 mA
current loop breaks ground loops and provides very high
immunity to common mode interference.
The HCPL-4100 data input is compatible with LSTTL, TTL,
and CMOS logic gates. The input integrated circuit drives
a GaAsP LED. The light emitted by the LED is sensed by a
second integrated circuit that allows 20 mA to pass with a
voltage drop of less1han 2.7 volts when no light is emitted
and allows less than 2 mA to pass when light is emitted.
The transmitter output is capable of withstanding 27 volts.
The input integrated circuit provides a controlled amount
of LED drive current and takes into account LED light
output degradation. The internal shield allows a guaranteed
1000 V/IJ.S common mode transient immunity.

• IMPLEMENT AN ISOLATED 20 rnA CURRENT
LOOP TRANSMITTER IN:
Computer Peripherals
Industrial Control Equipment
Data Communications Equipment

3-75

- - - - - - - - - - - - - _ . __._---

-

Recommended Operating
Conditions

Absolute Maximum Ratings
(No Derating Required up to 55°C)

Symbol

Min.

Power Supply
Voltage

Vee

4.5

20

Volts

Input Voltage Low

VIL

0.8

Volts

Input Voltage High

VIH

0
2.0

20

Volts

Parameter

Max.

Units

Operating
Temperature

TA

0

70

°C

Output Voltage

Vo

0

27

Volts

Output Current

10

0

24

rnA

Storage Temperature................. -55°C to 125°C
Operating Temperature ................ -40° C to 85° C
Lead Solder Temperature ............ 260° C for 10 sec.
(1.6 mm below seating plane)
Supply Voltage - Vee ........................ 0 to 20 V
Average Output Current - 10 ........ -30 mA to 30 mA
Peak Output Current - 10 ........... internally limited
Output Voltage - Vo ................... -0.4 V to 27 V
Input Voltage - VI ..................... -0.5 V to 20 V
Input Power Dissipation - PI .............. 265 mW[lj
Output Power Dissipation - Po ............ 125 mW[2j
Total Power Dissipation - P ............... 360 mW[31

Electrical Characteristics
for 0° C:;; TA:;; 70° C, 4.5 V:;; Vee:;; 20 V, all typicals at T A = 25° C and Vee = 5 V unless otherwise noted
Parameter

Symbol

Ma rk State Output
Voltage

Min.

VMO

Typ.

Max.

Units

Test Conditions

1.8
2.2
2.35

2.25

Volts
Volts
Volts

[0=2 mA
10= 12 mA
10=20 mA

2.7

Mark State Short Ci rcuit
Output CUrrent

Ise

30

85

Space State Output
Current

Iso

0.5

1.1

2.0

-0.12

Low Level Input Current

ilL

Low Level Input Voltage

VIL

High Level Input Voltage

VIH

High Level Input Current

Icc

Input-Output Insulation

1'-0*

I OPT 010

VISO

VI= 2.0 V

mA

VI = 2 V, Vo = 5 V to 27 V

mA

VI '" 0.8 V, Vo=27 V

-0.32

mA

Vee=20V, VI=0.4V

0.8

Volts

2.0

Note

1,2

4
3

Volts

0.005

20
100
250

7.0
7.8

11.5
13

p.A
IJA
"A
mA
mA

1

"A

hH

Supply Current

. Fig.

2500

VI = 2.7 V
VI=S.S V
VI= 20 V

45% RH, t = 55,
VI-O =3 kV dc, TA =2S"C

Vcc=5.5V
Vee'" 20V

o V:5. VI:;; 20 V
5,6

VRMS

RH:5.50%t=1 MIN

13

VI-O = SOO V dc

5

f = 1 MHz, VI-O = 0 V dc

5

Resistance
{input-output)

RI-O

1012

Ohms

Capacitance
(input-output)

CI-O

1

pF

'For J EDEC registered parts.
Notes:
1. Derate linearly above 55°C free air temperature at a rate of 3.8 mW/oC. Proper application of the derating factors will prevent IC
junction temperatures from exceeding 125°C for ambient temperatures up to 85°C.
2. Derate linearly above a free-air temperature of 70°C at a rate of 2.3 mW/oC. A significant amount of power may be dissipated in
the HCPL-4100 output circuit during the transition from the SPACE state to the MARK state when driving a data line or capacitive
load (COUTI. The average power dissipation during the transition can be estimated from the following equation which assumes a
linear discharge of a capacitive load: P = Isc (Vso + VMo1/2, where Vso is the output voltage in the SPACE state. The duration of
this transition can be estimated as t = COUT (VSO - VMol/lsc. For typical applications driving twisted pair data lines with NRZ data
as shown in Figure 11, the transition time will be less than 10% of one bit time.
3. Derate linearly above 55° C free-air temperature at a rate of 5.1 mW/o C.
4. The maximum current that will flow into the output in the mark state IIsci is internally limited to protect the device. The duration of
the output short circuit shall not exceed 10 ms.
5. The device is considered a two terminal device, pins 1, 2, 3, and 4 are connected together, and pins 5, 6, 7, and 8 are connected
together.
6. This is a proof test. This rating is equally validated by a 2500 Vac. 1 sec. test.

3-76

Switching Characteristics
for 0 :::: TA:::: 70° C, 4.5 V :::: Vee:::: 20 V, all typicals at TA = 25° C and Vee

= 5 V unless otherwise noted

Typ:

MaJ(,

Units

tPLH

0.3

1.6

ps

Co'" 1000 pF, CL = 15 pF, 10

tPHL

0.2

1.0

Propagation Delay
Time'Skew

tpLwtPHL

Outp'ut Rise Time
(10-S0%)
Output Fall Time
(SO-10%)

Parameter

Min;

Symbol

Propagation Delay Time
to Logic High Output
Level
Propagation Delay Time
to Logic Low Output
Level

Testing Conditlon~

Fig.

Note

= 20 mA

4,5,6

7

p;s

Co = 1000 pF, CL ~ 15 pF, 10 = 20 mA

4,5,6

8

0.1

ILS

10=20 mA

tr

16

ns

10

=20 mA,Co = 1000 pF, CL = 15 pF.

5,7

9

tf

23

ns

10 = 20 rnA, Co

=1000 pF, CL = 15 pF.

5, 7

10

11

'

c>

Common Mode
Transient Immunity at
Logic High Output Level

ICMHI

1,000 10,000

Vips

VI=2V, TA=25"C
VCM = 56 V (peak), VCC = 5 V
10 (min.! = 12 rnA

8,9,10

Common Mode
Transient Immunity at
Logic Low OutputLevel

ICMLI

1,000 10,000

VII'S

VI = 0.8 V, TA = 25°C
VeM = 50 V (peak), Vee = 5 V
10 (ma~:) -= 3 rnA

8,S,10 12

Notes:
7. The tpLH propagation delay is measured from the 1.3 volt level on the leading edge of the input pulse to the
leading edge of the output pulse.
8. The tpHL propagation delay is measured from the 1.3 volt level on the trailing edge of the input pulse to the
trailing edge of the output pulse.
9. The rise time, tr, is measured from the 10% to the 90% level on the rising edge of the output current pulse.
10. The fall time, tf, is measured from the 90% to the 10% level on the falling edge of the output current pulse.
11. The common mode transient immunity in the logic high level is the maximum (positive) dVCM/dt on the leading
mode pulse, VCM, that can be sustained with the output in a Mark ("H") state (i.e., 10> 12 mAl.
12.The common mode transient immunity in the logic low level is the maximum (negative) dVCM/dt on the leading
mode pulse, VCM, that can be sustained with the output in a Space ("L") state (i.e., 10> 3 mAl.
13. See Option 010 data sheet for more information.

3.0

2.6

w

"

~
a

>

2.4

~

'0

f-~
12'1~A

2.0

o

,

-

f-l";:;;; t---...

r---... r-...
1--.
......

1--

I-

::J

1.8

r--....

1'-

I

~

edge of the common
edge of the common

1.6
VI .. 2V

--

--

20

40

2.5

g

2.0

I-

~
o

1.5

::J

I

t-

.g

60

r

l--- ~

r--

1.0

VI =2V

0

80

~

II

TA' ZS'C

o.5

1. 2

-20

w

"~

1.4
-40

3.0

>

1--r-...

2.2

I-

10 mA level on the

3.5

2.8

~

10 mA level on the

10

15

20

25

30

10 - OUTPUT CURRENT - rnA

Figure 1.

Typical Mark State Output Voltage vs.
Temperature

Figure 2.

Typical Output Voltage vs. Output Current in
Mark State

3-77
-------~.-----------------

1.3

"E,

1.1

a:
::>

1.0

~

Vo

()

w
()

~

'",
.2'

Vee

(27 VI

....

iEa:

,-_-.--_-<> VLINE

1.2

0.9 I--

./.

~ P"

0.8 I-- ZOV
0.7

-;::::- ;;r

~

3 V, 10 KHz

r-

SQUARE WAVE

PULSE

n-"-+-_--t0~E~~TgR
S.6K

tr""tf "" 50S

'to.ay
CL=15pF

INCLUDING PROBE AND JIG CAPACITANCES.

0.6
-40

-20

20

40

TA - TEMPERATURE -

Figure 3.

80

60

°c

Typical Space Slale Outpul Currenl vs.
Temperature

Figure 4.

Test Circuillor IpLH. IpHL. t r • and tl

0.6

,

0.5

:t

>-

~

v,

0.4

Q

t~ ~

Z

o

~

0.3

~.

0.2

~V

'"~

'0

f~

Co" 1000pf
CL ~15 pf

,
o. 1

E-

-40

-20

20

40

60

80

TA - TEMPERATURE - °C

Figure 5.

Figure 6.

Wavelorms lor IpLH. IpHL. I r • and II

Typical Propagation Delay vs. Temperature

70
60

'"

"
;::
....
....
~

CoUT 1000 pF
C, = 15pF
0

50
40

Q

Z

"'"
w

a:,

30
20

::.:

10

"

"-

-40

-

-20

If

~ r-- t-

20

40

60

80

TA - TEMPERATURE _ °C

Figure 7.

Typical Rise, Fall Times vs. Temperalure

3-78

50V~

VUNE

VCM

(24 V}

OV

\!MaN

[V

O.B V OR MORE

~

SWITCHATA
CMH

OV - - - - - - - - - - - -

VMON

SWITCH AT B

CML

Figure O.

Test Circuit for Common Mode Transient
Immunity

Figure 9.

lOv----------------------~ V -----------0.4 V OR LESS

0.6VMAX.~

Typical Waveforms for Common Mode
Transient Immunity

12000
TAI.2,tC

10000
w
0

.'

"'>I"

0>

.

.....
8000

"!::
ZZ
o=>

""
""

6000

0-

ul-

Iffi

"'in
"z

4000

u",

'"

I-

2000

a

o

100 200 300 400 500 600 700 BOO 900 1000

VCM - COMMON MODE TRANSI ENT AMPLITUDE - V

Figure 10. Common Mode Transient Immunity vs.
Common Mode Transient Amplitude

Applications
Data transfer between equipment which employs current
loop circuits can be accomplished via one of three configurations: simplex, half duplex or full duplex communication. With these configurations, pOint to pOint and
multidrop arrangements are possible. The appropriate
configuration to use depends upon data rate, number of
stations, number and length of lines, direction of data flow,
protocol, current source location and voltage compliance
value, etc.

ISOLATED

STATION

,-----,

I

I

I

I
DATA

I

I
IL

I 20mA
I-

XMTR
HCPL-4100

I

SIMPLEX
The simplex configuration, whether point to point or multidrop, gives unidirectional data flow from transmitter(s) to
receiver. This is the simplest configuration for use in long
line length (two wire), moderate data rate, and low current
source compliance level applications. A block diagram of
simplex point to point arrangement is given in Figure 11
for the HCPL-4100 transmitter optocoupler.

I
I

NON-ISOLATED
STATION

,----"1
I
I

I
I

_____ -'I

I

I
I
IL. _ _ _ _ --lI

Figure 11. Simplex Point to Point Current Loop System
Configuration

3-79

I
I
I
I

DATA

Major factors which limit maximum data rate performance
for a simplex loop are the location and compliance voltage
of the loop current source as well as the total line capacitance. Application of the HCPL-4100 transmitter in a
simplex loop necessitates that a non-isolated active receiver (containing current source) be used at the opposite
end of the current loop. With long line length, large line
capacitance will need to be charged to the compliance voltage level of the current source before the receiver loop
current decreases to zero. This effect limits upper data
rate performance. Slower data rates will occur with larger
compliance voltage levels. The maximum compliance level
is determined by the transmitter breakdown characteristic.
In addition, adequate compliance of the current source
must be available for voltage drops across station(s) during
the MARK state in multidrop applications for long line
lengths.

distance and number of stations on the loop are fixed. A
minimum transmitter output load capacitance of 1000 pF
is required between pins 3 and 4 to ensure absolute'
stability.
Ler.1gth of the current loop (one direction) versus minimum
required DC supply voltage, Vcc, of the circuit in Figure
12 is graphically illustrated in Figure 13. Multidrop configurations will require larger Vcc than Figure 13 predicts in
order to account for additional station terminal voltage
drops.

40
36

A recommended non-isolated active receiver circuit which
can be used with the HCPL-4100 in point to pOint or in
multidrop 20 mA current loop applications is given in Figure 12. This non-isolated active receiver current threshold
must be chosen properly in order to provide adequate
noise immunity as well as not to detect SPACE state current (bias current) of the HCPL-4100 transmitter. The
receiver input threshold current is Vth/Rth = 10 mA. A simple transistor current source provides a nominal 20 mA
loop current over a Vcc compliance range of 6 V dc to
27 V dc. A resistor can be used in place of the constant
current source for Simple applications where the wire loop

Vee' O.00212~(Ll" 5.7 v

32 _

In a simplex multidrop application with multiple HCPL4100 transmitters and one non-isolated active receiver,
priority of transmitters must be established.

----':l(ABtE • 0.05296

28

~0

>

'LOOp:c: 20mA

rum

-

VMAAK • 2.7 VdoIHCPL-4100)
24
-VSAT ·'.5 Vd. (CURRENT SOURCE) ~
20

I

~

16

L

12

/

.,../

o

o

1000

100

1111
10000

L = LOOP LENGTH (ONE DIRECTION) METRES

Figure 13. Minimum Required Supply Voltage, V CC; vs.
Loop Length for Current Loop Circuit of
Figure 12

TRUTH TABLE
(POSITIVE LOGIC)

(6 V de - 27 V de)

r -

I

OPTIONAL
TERMINATION

r~RT

Vee

I
I
I
I

ALTERNATIVE
HCPL-4100

-r--~-O

~~~=~~T
I 2N3740
~I
.

RS~

5V de

I

I

.[1

Vth

Figure 12. Recommended Non-Isolated Active Receiver with HCPL-4100 Isolated Transmitter for Simplex Point to Point
20 mA Current Loop

3-80

lK S2

FULL DUPLEX
Full duplex point to point communication of Figure 15
uses a four wire system to provide simultaneous, bidirectional data communication between local and remote
equipment. Basic application uses two simplex point to
pOint loops which have two separate, active, non-isolated
units at one common end of the loops. The other end of
each loop is isolated ..
As Figure 15 illustrates, the combination of HewlettPackard current loop optocouplers, HCPL-4100
transmitter and HCPL-4200 receiver, can be used at the
isolated end of current loops. Cross talk and common
mode coupling are greatly reduced when optical isolation
is implemented at the same end of both loops, as shown.
Full duplex data rate is limited by the non-isolated active
receiver current loop. Comments mentioned under simplex configuration apply to the full duplex case. Consult
the HCPL-4200 receiver optocoupler data sheet for specified device performance.

10,000

L - LOOP LENGTH (ONE DIRECTION)- METRES

Figure 14. Typical Data Rate vs. Distance and Supply
Voltage

Typical data rate performance versus distance is illustrated in Figure 14 for the combination of a non-isolated
active receiver and HCPL-4100 optically coupled current
loop transmitter shown in Figure 12. Curves are shown for
25% distortion data rate at different Vee values. 25% distortion data rate is defined as that rate at which 25%
distortion occurs to output bit interval with respect to the
input bit interval. Maximum data rate (dotted line) is restricted by device characteristics. An input
Non-Return-to-Zero (NRZ) test waveform of 16 bits
(0000001011111101) was used for data rate distortion measurements. Enhanced speed performance of the lOOP
system can be obtained with lower Vee supply levels, as
illustrated in Figure 14. In addition, when loop current is
supplied through a resistor instead of by a current source,
an additional series termination resistance. equal to the
characteristic line impedance can be used at the HCPL4100 transmitter end to enhance speed of response. by
approximately 20%.
The Gable used contained five pairs of unshielded, twisted,
22 AWG wire (Dearborn #862205), Loop current is 20 mA
nominal. Input and output logic supply voltages are 5 V
dc.

NON-ISOLATED STATION

,-----,
I

DATA

DATA

DATA

DATA

HALF DUPLEX
The half duplex configuration, whether point to pOint or
multidrop, gives non-simultaneous bidirectional data flow
from transmitters to receivers shown in Figures 16a and
16b. This configuration allows the use of two wires to
carry data back and forth between local and remote units.
However, protocol must be used to determine which specific transmitter can operate at any given time. Maximum
data rate for a half duplex system is limited by the loop
current charging time. These considerations were explained in the Simplex configuration section.
Figures 16a and 16b illustrate half duplex application for
the combination of HCPL-41001-4200 optocouplers. The
unique and complementary designs of the HCPL-4100
transmitter and HCPL-4200 receiver optocouplers provide
many designed-in benefits. For example, total optical isolation at one end of the current loop is easily
accomplished, which results in substantial removal of
common mode influences, elimination of ground potential
differences and reduction of power supply requirements.
With this combination of HCPL-41001-4200 optocouplers,
specific current loop noise immunity is provided, i.e., minimum SPACE state current noise immunity is 1 mA, MARK
state noise immunity is 8 mA.
Voltage compliance of the current source must be of an
adequate level for operating all units in the loop while not
exceeding 27 V dc, the maximum breakdown voltage for
the HCPL-4100. Note that the HCPL-4100 transmitter will
allow output loop current to conduct when input Vee
power is off. Consult the HCPL-4200 receiver optocoupler
data sheet for specified device performance.
For more informaton about the HCPL-41001-4200 optocouplers, consult Application Note 1018.

l- _ _ _ _ -l

Figure 15. Full Duplex Point to Point Current Loop
System Configuration

3-81
._------

_._---

NON-ISOLATED
STATION

DATA

DATA

DATA

(a) POINT TO POINT

DATA

DATA

---,

I
"

1----,
I

ISOLATED
STATION

,,

NON-ISOLATED
STATION

_ _ -.I

DATA

DATA

ISOLATED'
STATION,

XMTR
HCPL-4100

RCVR
HCPL-4~OO

I

L_
DATA

DATA

(b) MULTIDROP

Figure 16. Hall Duplex Current Loop System Configurations for (a) Point to Point, (b) Multidrop

3-82

OPTICALLY CO PLED
20 rnA CURRE
OOP
RECEIVER

HCPl-4200

TECHNICAL DATA

OUTLINE DRAWING"

SCHEMATIC

I+]HI
~'D
-

1
--Icc

9,90 ('3901

7

6

8

______ I

0,.18 t0071

o;:i3'{:o131 \

5TX.pg"I'!UMBER't--.::'!-='s:;-,~;;p====\
16:1O~

'tltmCODE

I

/'1,36L290) 6,60 \'Z!101

.
rss 1-:3101
~T""T-=-r-"'--:::T""T-:r.I
~~COGNITlON '--_
I _~_ _
PIN 1
2
3
4

I

ONE

' - - - -......-

4--~ 1.3701

8

,....--.......--ovcc

'-...11
:-""':1

L

JANUARY 1986

II

-

-I 1.-- us t0701 MAX,
1.191.047) MAX,

5' TYP,
~~=::::==:;::;::

t

DIMENSIONS IN MILLIMETJ.ES AND lINCHESI

____>_--oGND

t

5

14.70 1,1851 MAK

TRUTH TABLE
(POSITIVE LOGIC)*
I,
V,
Vo

H

L
H

L

H
H

Z
Z

L
L

H

L

I! !

I

I

--t"',,:.,
MIN.

rl ~ II
2c92t1151MIN.
0.16(.0301 , - -0.65 t0261 MAX,

*CURRENT LOOP CONVENTION - H = MARK:
II;" 12mA. L=SPACE: 11';:;; 3mA,Z=OFF
(HIGH IMPEDANCE) STATE.

iAo i:0551

1..--1r-- 2,801.1101
~

t0901

Features

Description

• DATA OUTPUT COMPATIBLE WITH LSTTL,
TTL, AND CMOS
• 20K BAUD DATA RATE AT 1400 METRES LINE
LENGTH
• GUARANTEED PERFORMANCE OVER
TEMPERATURE (0° C TO 70° C)
• GUARANTEED ON AND OFF THRESHOLDS
• LED IS PROTECTED FROM EXCESS CURRENT
• INPUT THRESHOLD HYSTERESIS
• THREE-STATE OUTPUT COMPATIBLE WITH
DATA BUSES
• INTERNAL SHIELD FOR HIGH COMMON MODE
REJECTION
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
• OPTICALLY COUPLED 20 mA CURRENT LOOP
TRANSMITTER, HCPL-4100, ALSO AVAILABLE

The HCPL-4200 optocoupler is designed to operate as a
receiver in equipment using the 20 mA Current Loop, 20
mA current loop systems conventionally signal a logic
high state by transmitting 20 mA of loop current (MARK),
and signal a logic low state by allowing no more than a
few milliamperes of loop current (SPACE), Optical coupling of the signal from the 20 mA current loop to the
logic output breaks ground loops and provides for a very
high common mode rejection, The HCPL-4200 aids in the
design process by providing guaranteed thresholds for
logic high state and logic low state for the cu rrent loop,
providing an LSTTL, TTL, or CMOS compatible logic
interface, and providing guaranteed common mode rejection, The buffer circuit on the current loop side of the
HCPL-4200 provides typically 0,8 mA of hysteresis which
increases the immunity to common mode and differential
mode noise, The. buffer also provides a controlled amount
of LED drive current which takes into account LED light
output degradation. The internal shield allows a guaranteed
1000 Wl'eS common mode transient immunity.

Applications
• IMPLEMENT AN ISOLATED 20 mA CURRENT
LOOP RECEIVER IN:
Computer Peripherals
Industrial Control Equipment
Data Communications Equipment

3-83

Recommended operating
Conditions
Parameter
Power Supply
Voltage
Forward Input
Current (SPACE)
Forward Input
Current (MARK)
Operating
Temperature
Fan Out
Logic Low
Enable Voltage

Absolute Maximum Ratings
(No Derating Required up to 70°C)

Symbol

Min.

Max.

Units

Vee

4.5

20

Volts

lSI

a

2.0

mA

IMI

14

24

mA

TA
N

a
0

70
4

°C
TTL Loads

VEL

0

0.8

Volts

VEH

2.0

20

Volts

Logic High
Enable Voltage

Storage Temperature ................ -55° C to 125° C
Operating Temperature ............... -40 0 C to 85° C
Lead Solder Temperature ............ 260°C for 10 sec.
(1.6 mm below the seating plane)
Supply Voltage - Vee ..................... a V to 20 V
Average Input Current - II .......... -30 mA to 30 mA
Peak Transient InputCurrent - II ....•........ 0.5 A11]
Enable Input Voltage - VE ............. -0.5 V to 20 V
Output Voltage - Vo .................. -0.5 V to 20 V
Average Output Current - 10 ............•..•.. 25 mA
Input Power Dissipation - PI .. . . . . . . . . . . . .. 90 mW[2)
Output Power Dissipation - Po ............ 210 mW[3)
Total Power Dissipation - P ............... 255 mW14)

Electrical Characteristics
For 0° C::; TA::; 70° C, 4.5 V::; Vee::; 20 V, VE = 0.8 V, all typicals at TA = 250 C and Vee = 5 V unless otherwise noted
Symbol

Min.

Mark State Input Current

IMI

12

Mark State Input Voltage

VMI

Parameter

Space State Input Current

VSI

Input Hysteresis Current

IHYS

2.52

logic Low Output Voltage

VOL

LogiC High Output Voltage

VOH

Output Leakage Current
NOUT > Vccl

10HH

Logic High Enable Voltage

VEH

Logic Low Enable Voltage

VEL

1.6
O.S

Volts

3

mA

2.2

Volts
Volts

100
2.0

ICCH

10SH

Input-Output Insulation

1'-0

Ve = Don't Care

I, - 0.5 to 2.0mA VE - Don't Care

1
5
6

10H = -2.6 mA,

li= 12mA

Vo "" 5.5 V

11=20 mA

itA

Vo=20V

Vce=4.5 V

0.8

Volts

20

p.A

100

itA

VE = 5.5 V

250

itA

VE"'20V
Ve=0.4V

Ve = 2.7 V

..Q.32

rnA

6.0

mA

VCC'" 5.5 V

h=OmA

5.25

7.5

mA

Vcc=20V

Vo. '" Don't Care

2.7

4.S

mA

3.1

6.0

mA

Vcc"'S.5V
Vcc=20 V

Ve ~ Don't Care

·20

p.A

Vo =0,4 V

Ve '" 2.0 V, 1/=20 mA

20

p.A

Vo=2.4V

100

itA

Vo= 5.5 V

500

p.A

Vo=20V

11=20 mA

VE=2V,
h=OmA

25

mA

Vo""Vcc=5.5VI

40

rnA

Vo=Vcc~20V

·10

mA

Vcc=5.5V

,,=20 mA

-25

mA

Vcc-20V

Vo=GNO

p.A

45% RH, t = 5s,

1

I h=OmA

VRMS

AH os: 50%, t = 1 min.

1012

ohms

V,-o '" 500 V de

Input-Output Capaoitance

CI-O

1.0

pF

f"" 1 MHz, VI'O = 0 V de

Input Capacitance

CIN

120

pF

f=

'For JEDEC registered parts.

3-84

f

5
6,?

Ri"O

2500

5

= 25°C

Input-Output ReSistance

VIsa

1,3

[Ot. = 6.4 mA (4 TTL loads) It = 3 mA

V,.O = SkV dc. TA

I OPT.OW

S,4
1,2,3

4.5

IOZH

logic High Short
Circuit Output Current

h=20 mA

Volts

IOZL

10SL

Note

1,2,3

p.A

Volts

2.4

leL

LOgic High Supply
Current

Fig.

Test Conditions

mA
0.5

IEH

lecl

Logic Low Short
Circuit Output Current

2.15

500

Logic Low Supply
Current

High Impedance Stete
Output Current

Unils

0.8

.004
Logic Low Enable Current

Max.

mA

151

Space State Input Voltage

Logic High Enable
Current

Typ.

MHz. V, = 0 V dc, Pins 1 and 2

14

6
6

-

- - - - - - - - - ---- - - -

----~.

switching Characteristics
For 0° C:S TA:S 70° C, 4.5 V:S Vee:S 20 V, VE

Parinneter

symb~1

= 0.8 V, ali typicals at TA = 25° C and Vee = 5 V unless otherwise noted
Typ.

Max.

Units

tPLH
.,

0.23

1.6

p.S

VE =

a v, CL = 15 pF

tPHL

0.17

1.0

}ls

VE '"

a V, CL'= 15 pF

tPLH-tPHL

60

ns

It = 20 rnA, CL

Output Enable Time
to Logic Low Level

jpZL

25

ns

IJ = 0 mA, CL '" 15 pF

11, 12,
14

Output Enable Time
to Logic High Level

tPZH

28

ns

IJ = 20 mA, CL = 15 pF

11,12.
13

Output Disable Time
from Logic Low Level

tpLZ

60

ns

II =0 mA, Cv" 15 pF

11, 12,
14

Output Disable Time
from Logic High Level

tPHZ

105

ns

II

= 20 rnA, Cl "" 15 pF

11,12,
13

Output Rise Time
(10-90%)

tr

55

os

Vee = 5 V, CL = 15 pF

7,8,10

10

Output Fall Time
(90-10%)

If

15

ns

Vee c=.5 V, CL '" 15 pF

7,8,10

11

15. 16

12

15, 16

13

Propagation Delay Time
to Logic High Output
Level
Propagation. Delay Time
to Logic Low Output
Level
Propagation Delay
Time Skew

Min.

T;st Conditions

Fig.

Note

7,8,9

8

7,8,9

9

.

= 15 pF

Common Mode
Transient Immunity at
Logic High Output Level

ICMHI

1,000

10,000

V//J.s

VOM 50 V (peak)
II = 12 rnA, TA = 25°C

Common Mode
Transient Immunity at
logic Low Output Level

ICMLI

1,000

10,000

V//J.s

VCM '" 50 V (peak)
II = :3 mA, T A = 25° C

7,8,9

NOTES:
1. :£ 1 I's pulse width, 300 pps.
2. Derate linearly above 70' C free air temperature at a rate of 1.6 mW/' C. Proper application of the derating factors will prevent IC
junction temperatures from exceeding 125' C for ambient temperatures up to 85° C.
3. Derate linearly above 70° C free air temperature at a rate of 3.8 mW/o C.
4. Derate linearly above 70° C free air temperature at a rate of 4.6 mW/oC.
5. Duration of output short circuit time shall not exceed 10 ms.
6. The device is considered a two terminal device, pins 1, 2, 3, and 4 are connected together and pins 5, 6, 7, and 8 are connected
together.
7. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec. test.
8. The tpLH propagation delay is measured from the 10 mA level on the leading edge of the input pulse to the 1.3 V level on the
leading edge of the output pulse.
9. The tPHL propagation delay is measured from the 10 mA level on the trailing edge of the input pulse to the 1.3 V level on the
trailing edge of the output pulse.
10. The rise time, tr, is measured from the 10% to the 90% level on the rising edge of the output logic pulse.
11. The fall time, tf, is measured from the 90% to the 10% level on the falling edge of the output logic pulse.
12. Common mode transient immunity in the logic high level is the maximum (negative) dVCM/dt on the trailing edge of the common
mode pulse, VCM, which can be sustained with the output voltage in the logic high state (i.e., Va 2: 2 V).
13. Common mode transient immunity in the logic low level is the maximum (positive) dVCM/dt on the leading edge of the common
mode pulse, VCM, which can be sustained with the output voltage in the logic low state (i.e., Vo:£ 0.8 V).
14. See Option 010 data sheet for more information.

3-85

''''~A''\'I

~
o

10

t.

I

.I

IMIIMI~~
12mA

;aJ)mA

EJ~r----- -+-_.. ---

>
I

w

"~

-_. ,
- r-

~

>-

~

IQH

1-01-

.g

..

t

2.6mA

1

I. "

"o
I

b

::::::

I-MA~K

~

10

15

o

20

Typical Output Voltage
vs. Loop Current

-50

Figure 2.

~

0

g

-

~

2.4

11 ""12mA

25

25

50

~

25

50

Figure 4.

II - LOOP CURRENT - rnA

Typical Current Switching
Threshold vs. Temperature

0.8

10 'I':6A-rnA-

~
~I

75

1

0.7

Vo ~VV

\
'-...

Va "2AV

OA

5

0.3
6

0,2
7

O. 1

-20

-40

8
20

40

TA - TEMPERATURE -

Figure 5.

1\

-4

0.5

-60

vL "4.hv

II "'1ZmA"-

\

-3

0.6

o

100

Typical Input Loop Voltage
vs. Input Current

0

2

-"c

Typical Input Voltage
ys. Temperature

Figure 3.

w
C!J

.g
-25

100

v~c
o.LIl"3mA

~

I

TA - AMBIENT TEMPERATURE

75

0.9

o

»
2.2
-50

1.5\-1'-+----+--

~ 1.0 r--+--- ,-+---

~

~
g
5
:=::::l

I, .... lOmA

~

TA~25C

o

t/1:YS

1

2.6

0

L

/,,--.--r--+.--

I

TA - AMBIENT TEMPERATURE -"C

~
0

>

2.0

0.51--+--+----1--

2.8

"!:;"

2.5t.---'t.-~-"""'--1"""'''''''=~

»

I, _ INPUT CURRENT - rnA

I
w

w

STATE'"

I

o
o

>

:::::

V

TA "-ZS"C
Vc C"'4,$V

6AmA

Figure 1.

-;:; ~

~
~
g

60

80

-60

100

'c

"
-40

I'--.

-20

20

40

60

80

TA - TEMPERATURE _ °C

Typical Logic Low Output
Voltage vs. Temperature

1M! = 20 rnA - - -

Figure 6.

Typical Logic High Output
Current vs. Temperature

-'-,...--------"

PULSE
GENERATOR

Zo '50n
tf -"'tf "'5 ns

lSI =OmA
11

02
VOH--

03

90% - - -

04
Vo

10%--VOl _____

~

VIN = 5 VOLT, 100 KHz 10% DUTY CYCLE
D1 - 04 ARE 1N916 OR lN3064

Figure 7.

~

CL '" 15 pF INCLUDING PROBE
AND JIG CAPACITANCE

Figure 8.

Test Circuit for tpHL. tpLH. t r • and tf

3-86

Waveforms for tpHL. tpLH. t r• and tf

100

----------

-~~~~----

,

1--t-+-t---t2-+--cr--t-c'-i

100

1

~

~

;::

"o
~
"
;t

::f

c

80

~
~

:::

60

0:
I

C

40

-

~
1

~60

-40

20

-20

40

60

80
TA - TEMPERATURE _ °C

TA - TEMPERATURE -'C

Figure 9.

Typical Propagation Delay vs. Temperature

Figure 10. Typical Rise, Fall Time vs. Temperature

.....- - - . . , CL • 1S pF INCLUDING PROBE
PULSE
GENERATOR
20 • SOP.
tr'" tf '" 5 os

AND JIG CAPACITANCE

r----

INPUT

3 .OV

VE

02
03

04

INPUT Ve
MONITORING
NODE

OUTPUT
Vo

Dl-4 ARE lN916 OR lN3064

Figure 11. Test Circuit for tpZH, tpZL, tpHZ, and tpLZ

20 0

t->

~

c
c

-pt:-

Figure 12. Waveforms for tpZH, tpZL, tpHZ, and tpLZ

10a

Vee

15 0

"'

~

0

~w

0

..

40

20

"'

IE"

~v

tPZH

60

~

20V

r-

50

I

o

c
c

":1:

~

"

0

"

4.5V

10 0

~w
IE

>

~

t'~z

~

C1..

c
I

~v

"
~

::: 1.5 V

S10PEN
S2 CLOSED

40

TA - TEMPERATURE

60

80

..

Vee
20V

.,./

tPLZ

f--

t?

fo.-

~5V

~

lOV

~5V
..P- ~
tPZL

O

I

0

20

~ 161lF

-60

100

40

-"c

-20

20

40

60

80

100

TA - TEMPERATURE _ °C

Figure 13. Typical Logic High Enable Propagation Delay
vs. Temperature

Figure 14. Typical Logic Low Enable Propagation Delay
vs. Temperature

~ 10000

>

~

SOV

VeM

ov

r-

VOH~
VO (MIN.)_V
• 2.0 V

8000

;;

::>
::2:

7000

~

6000

~

5000

...a:

4000

o

3000

~

2000

o

_VO(MAX.)

~
'" 0.8 V
VOL

9000

w

I, =12mA

Vo

I

i:z

c

""8

11=3.0mA

I

t5
Figure 15. Test Circuit for Common Mode Transient
Immunity

TA)ZS'C-

1000

"

500

1000

1500

2000

VCM - COMMON MODE TRANSIENT VOLTAGE -

v

Figure 16. Typical Common Mode Transient Immunity
vs. Common Mode Transient Amplitude

3-87

Applications
Data transfer between equipment which employs current
loop circuits can be accomplished via one of three configurations: simplex, half duplex or full duplex communication. With these configurations, point-to-point and
multidrop arrangements are possible. The appropriate
configuration to use. depends upon data rate, number of
stations, number and length of lines, direction of data flow,
protocol, current source location and voltage compliance
value, etc.

SIMPLEX
The simplex configuration, whether point to point or multidrop, gives unidirectional data flow from transmitter to
receiver(s). This is the simplest configuration for use in
long line length (two wire), for high data rate, and low current source compliance level applications. Block diagrams
of simplex point-to-point and multidrop arrangements are
given in Figures 17a and 17b respectively for the HCPL4200 receiver optocoupler.
For the highest data rate performance in a current loop,
the configuration of a non-isolated active transmitter (containing current source) transmitting data to a remote
isolated receiver(s) should be used. When the current

source is located at the transmitter end, the loop is
charged approximately to VMI (2.5 Vl. Alternatively, when
the current source is located at the receiver end, the loop
is charged to the full compliance voltage level. The lower
the charged voltage level the faster the data rate will be. In
the configurations of Figures 17a and 17b, data rate is
independent of the current source voltage compliance
level. An adequate compliance level of current source
must be available for voltage drops across station(s) during
the MARK state in multidrop applications or for long line
length. The maximum compliance level is determined by
the transmitter breakdown characteristic.
A recommended non-isolated active transmitter circuit
which can be used with the HCPL-4200 in point-to-point
or in multidrop 20 mA current loop applications is given in
Figure 18. The current source is controlled via a standard
TTL 7407 buffer to provide high output impedance of current source in both the ON and OFF states. This
non-isolated active transmitter provides a nOminal 20 mA
loop current for the listed values of Vee, R2 and R3 in
Figure 18.

NON-ISOLATED
STATION
r-----,

-

ISOLATED

20 rnA

r -. STATION
---'

DATA

DATA

L _ _ _ _ _ _ ...J

(a) POINT-TO-POINT

DATA

DATA

ISOLATED' STATION

I .--'----.

I
I
NON-ISOLATED
STATION

r------,

ISOLATED
STATION

r-----,
DATA

DATA

ISOLATED I
STATION

--,

I r-'---'--, I
I
I
I
I
DATA

r

--,

r-'---......

I
DATA

(b) MULTIDROP
Figure 17. Simplex Current Loop System Configurations for (a) Point-la-Point, (b) Multidrop

3-88

ISOLATED

I STATION
I

- - - - - - - - - - - - - - - - - - - - ---------- ----

'LOOP ~ 20 rnA
R2
R3
H
!!

TRUTH TABLE
(POSITIVE LOGIC)

Vee
Vdc

Vee'" 5 V de - 27 V de

5

1K 82.5

10

2.15K 237

15

3.16K 383

24
27

5.62K 681
6.19K 750
HCPL·4200

Figure 18. Recommended Non-Isolated Active Transmitter with HCPL-4200 Isolated Receiver for Simplex Point-to-Point 20 mA
Current Loop

Length of current loop (one direction) versus minimum
required DC supply voltage, Vee, of the circuit in Figure
18 is graphically illustrated in Figure 19. Multidrop configurations will require larger Vee than Figure 19 predicts in
order to account for additional station terminal voltage
drops.
Typical data rate performance versus distance is illustrated in Figure 20 for the combination of a non-isolated
active transmitter and HCPL-4200 optically coupled current loop receiver shown in Figure 18. Curves are shown
for 10% and 25% distortion data rate. 10% (25%) distortion
data rate is defined as that rate at which 10% (25%) distortion occurs to output bit interval with respect to input bit
interval. An input Non-Return-to-Zero (NRZ) test waveform
of 16 bits (0000001011111101) was used for data rate distortion measurements. Data rate is independent of current
source supply voltage, Vee.
The cable used contained five pairs of unshielded, twisted,
22 AWG wire (Dearborn #862205). Loop current is 20 mA
nominal. Input and output logic supply voltages are 5 V
dc.

FULL DUPLEX
The full duplex point-to-point communication of Figure 21
uses a four wire system to provide simultaneous, bidirectional data communication between local and remote

~

Vee

r-

28
24

As Figure 21 illustrates, the combination of HewlettPackard current loop optocouplers, HCPL-4100
transmitter and HCPL-4200 receiver, can be used at the
isolated end of current loops. Cross talk and common
mode coupling are greatly reduced when optical isolation
is implemented at the same end of both loops, as shown.
The full duplex data rate is limited by the non-isolated
active receiver current loop. Comments mentioned under
simplex configuration apply to the full duplex case. Consult the HCPL-4100 transmitter optocoupler data sheet for
specified device performance.

HALF DUPLEX
The half duplex configuration, whether pOint-to-point or
multidrop, gives non-simultaneous bidirectional data flow
from transmitters to receivers shown in Figures 22a and
22b. This configuration allows the use of two wires to
carry data back and forth between local and remote units.
However, protocol must be used to determine which specific transmitter can operate at any given time. Maximum
data rate for a half duplex system is limited by the loop
current charging time. These considerations were explained in the Simplex configuration section.

"O.002t2-;;'{ll-!-4'25V~~~3

RC-A.6L£ '" 0.0$296 Him
I---llOOP >= 2() triA

~

equipment. The basic application uses two simplex pointto-point loops which have two separate, active, nonisolated units at one common end of the loops. The other
end of each loop is isolated.

r---- VMMK "" 2]5 Vdc (HCPL4200l.

~

~ VSAT "" Uj, Vdc {CURRENT SOURcel~

~20_
;'j

_L

16
12

L

°10

100

1000

10000
100,000

L'" LOOP LENGTH (ONE DIRECTION) - METRES

LOOP LENGTH (ONE DIRECTION) - METRES

Figure 19. Minimum Required Supply Voltage, vee, vs.
Loop Length for Current Loop Circuit of Figure 18

Figure 20. Typical Data Rate vs. Distance

3-89

lation at one end of the current loop is easily accomplished, which results in substantial removal of common
mode influences,elimination of ground potential differences and reduction of power supply requirements. With this
combination of HCPL-4100/-4200 optocouplers, spedfic
current loop noise immunity is provided, i.e., minimum
SPACE state current noise immunity is 1 mA, MARK state
noise immunity is 8 mA.

NON-ISOLATED STATION

r------,
I

DATA

DATA

DATA

DATA

Voltage compliance of the current source must be of an
adequate level for operating all units in the loop while not
exceeding 27 V dc, the maximum breakdown voltage for
the HCPL-4100. Note that the HCPL-4100 transmitter will
allow loop current to conduct when input Vee power is
off. Consult the HCPL-4100 transmitter optocoupler data
sheet for specified device performance.

1- _ _ _ _ -1

Figure 21. Full Duplex Point-to-Point Current Loop
System Configuration

Figures 22a and 22b illustrate half duplex application for
the combination of HCPL-4100/-4200 optocouplers. The
unique and complementary designs of the HCPL-4100
transmitter and HCPL-4200 receiver optocouplers provide
many designed-in benefits. For example, total optical iso-

For more information about the HCPL-4100/-4200 optocouplers, consult Application Note 1018.

NON-ISOLATEO
STATION

DATA

DATA

DATA

(a) POINT-TO-POINT
DATA

DATA

-...,
I

NON-ISOLATED
STATION

XMTII
HCPL-4100

ilSOLATED

ISOLATED
STATION

I STATION

.-----1

I

I

_ _ -.1

I

DATA

I
I

~~x=x=~~~~~C>~~~~~
DATA

ISOLATED
STATION

I
I
I

XMTR

RCVR

HC~L-41QO

HCPL-4200

_...J

L_
DATA

I
I

DATA

(b) MULTIDROP
Figure 22. Half Duplex Current Loop System Configurations for (a) Point-to-Point, (b) Multidrop

3-90

I

I
I

I
I

DATA

•

•

•
•

•
•
•

4-1

,~

•

h~~o";"~

..
•

~\;}!J~it

t~I£1

Fiber Optics
Three major families of fiber optic components
offer a wide range of application solutions. The
design and specification of each of these three
families allow easy design-in and provide
guaranteed end-to-end performance.

miniature line (HFBR-0400 series) features a
Dual-in-line package which requires no mounting hardware or receptacle for use with
SMA-style connectors. It is also specified for use
with five fiber sizes: 100/140 Mm, 85/125 Mm,
62.5/125 Mm, 50/125 Mm, and 200 Mm Plastic
Coated Silica (PCS) cable. The standard miniature line (HFBR-0200 series) features a precision
metal package for rugged applications. Both HPstyle and SMA-style connectors are available for
this line. An evaluation kit is available for
sampling purposes. The HFBR-0200 kit contains
transmitter, receiver, 10 metres of cable and
technical literature.

Hewlett-Packard's method of specification assures
guaranteed link performance and easy design-in.
The transmitter optical output power and receiver
sensitivity are specified at the end of a length of
test cable. These specifications take into account
variations over temperature and connector
tolerances. All families of components incorporate
the fiber optic connector receptacle in· the
transmitter and receiver packages. Factory
alignment of the emitter inside the connector
. receptacle minimizes the variation of optical
output power, resulting in smaller dynamic range
requirements for the receiver. The guaranteed
distance and data rates for various
transmitter/receiver pairs are shown in the
following selection guide.

High Performance Modules
Transparent TTL-TTL link capability and
independence from data format restrictions make
this family of modules easy to use in a variety of
applications. A link monitor on the receiver
provides a digital indication of link continuity,
independent of the presence of data. The modules
are compatible with HP-style connectors and
small-diameter glass fiber cable. A transmitter,
receiver, 10 metres of connectored cable and
technical literature are contained in the
HFBR-OOIO evaluation kit.

Hewlett-Packard offers a choice of fiber optic
cable, either glass fiber or plastic, simplex or
duplex, factory-connectored or bulk. Connector
attachment in each case has been designed for
your production-line economy.

Plastic Snap-In Link Components

RS-232/V.24 to Fiber Optic Multiplexer

Low-cost and ease of use make this family of link
components well-suited for applications
connecting computers to terminals, printers,
plotters and industrial-control equipment. These
links are rugged, 1 millimetre diameter plastic
fiber cable. Assembling the plastic snap-in
connectors onto the cable is extremely easy. The
HFBR-0500 evaluation kit contains a complete
working link including transmitter, receiver, 5
metres of connectored cable, extra connectors,
polishing kit and technical literature.

The 3930lA 16-channel RS-232C1V.24 to fiber
optic multiplexer allows the extension of up to 16
independent 19.2 Kbps full duplex channels to
.
distance up to 1250m.

Miniature Link Components
This family offers a wide range of price/performance choices for computer, industrial-control
and military applications. The unique design of
the lensed optical coupling system makes this
family of components very reliable. The low cost
4-2

--_._--_.__ ._-

-------

Fiber Optic Selection Guide
Snap-In Link Family: Features - Plastic fiber (1 mm diaJ, Plastic Snap-in connectors, TTL compatible output.
Page
No.

Description

Producls/Part Nos.
Evaluation Kit
HFBR·0500

4-6
HFBR·1510 Transmitter. HFBR·2501 Receiver. 5 metre connectored cable. connectors. bulkhead feedthrough polishing kit; literature

Transmitter/Receiver Pairs
5 MBd Link
HFBR-1510/-2501
1 MBd Link
HFBR-1502/-2502
Extended Distance Link HFBR-1512/-2503
Low Current Link
HFBR-1512/-2503
Photo Interrupter Link HFBR-1512/-2503
HFBR-1502/-2502
Cables
Simplex
HFBR-3511
HFBR-3512
HFBR-3513
HFBR-3514
HFBR-3515
HFBR-3516
HFBR-3517
HFBR-3518
HFBR-3519

HFBR-3612
HFBR-3613
HFBR-3614
HFBR-3615
HFBR-3616
HFBR-3617
HFBR-3618
HFBR-3619

Cable Length
0.1 metre
0.5 metre
1.0 metre
5.0 metre
10.0 metre
20.0 metre
30.0 metre
45.0 metre
60.0 metre

HFBR-3579
HFBR-3580
HFBR-3581

HFBR-3679
HFBR-3680
HFBR-3681

25.0 metre
100.0 metre
500.0 metre

Duplex

-

Guaranteed Data-Rate·
5MBd
1 MBd
40 kBd
40 kBd
20 kHz
500 kHz

Guaranteed Distance·
17 metre
36 metre
65 metre
14 metre
N/A
N/A

4-8
4-10
4-12
4-12
4-14
4-14
4-20

connectored

unconnectored

Connectors
HFBR·4501
HFBR-4511

Gray Connector /Crimp Ring
Blue Connector/Crimp Ring

4-22

Polishing Kit
HFBR-4595
HFBR-4596

Plastic polishing fixture. abrasive paper
Metal polishing fixture

4-22

Bulkhead Feedthrough/in-line Splice
HFBR-4505
HFBR-4515

Gray Bulkhead Feedthrough
Blue Bulkhead Feedthrough

4-22

Low Cost Miniature Link Family: Features - Dual-in-line package interfaces directly with SMA-style connectors specified for
use with 501125 I'm, 62.5/125 I'm 851125 I'm, 1001140 I'm, and 200 I'm Plastic Coated Silica (PCS) cable. No mounting
hardware required.

Transmitter/Receiver Pairs
HFBR-140212402

HFBR-140412402
HFBR-140212404
(HFBR-0422 Tranceiver Board)
HFBR-1402 Standard Transmitter

Page
No.

Description

Products/Part Nos.

Guaranteed Optical Power Budget·
14 dB (200 pm PCS)
9 dB (HFBR-3000 1001140 pm cable)
6 dB (851125 pm cable)
9 dB (62.51125 pm cable)
4 dB (501125 pm cable)
12 dB (HFBR-3000 1001140 I'm cable)

Guaranteed Data-Rate·
5MBd
5 MBd
5MBd
5MBd
5 MBd
50 MBd

4-31
4-31
4-31
4-31
4-31
4-41

Optimized for large size fiber such as 851125 pm, 1001140 pm,
or 200 pm PCS cable

4-27

HFBR-1404 High-Performance Transmitter

Optimized for small size fiber such as 501125 pm or 62.51125 pm cable

4-27

HFBR-2402 5 MB Receiver

TIL/CMOS Compatible receiver with -25.4 dBm sensitivity

4-31

HFBR-2404 25 MHz Receiver

PIN-preamp receiver for data rates up to 50 MBd

4-33

4-3

Miniature Link Family: Features -

Glass fiber 1100/400 I'm!. Precision metal connectors.

Page
Description

Products/Part Nos.
Evaluation Kit
HFBR-0200

HFBR-1201 Transmitter, HFBR-2201 Receiver, 10 metre connectored cable
Mounting Hardware

Transmitter IReceiver Pairs
HP Style Connectors
SMA Style Connectors
HFBR-1201/-2201
HFBR-1202/-2202
HFBR-1201/-2203
HFBR-1202/-2204
HFBR-1203/-2201
HFBR-1204/-2202
HFBR-1203/-2203
HFBR-1204/-2204
HFBR-1203/-2207
HFBR-1204/-2208

Guaranteed Distance'
800 metre
1200 metre
1800 metre
2100 metre
500 metre (typical)

Guaranteed Data Rate'
5 MBd
40 MBd
5 MBd
40 MBd
125 MBd (typical)

Transceivers. 20 MBd (to 40 MBd)
HP Style Connectors SMA Style Connectors
HFBR-0221
HFBR-0222

Guaranteed Distance
1100 metre

Data Format
33 to 67% duty factor (for
use with code schemes
such as Manchester)
STD 95% duty factor (for
use with code schemes
such as NRZI

HFBR-0223

HFBR-0224

625 metre

No.
4-46
4-46
4-54
4-58
4-74

4-66

Cables
Simplex
HFBR-3000
(OPT001)
HFBR-3000
(OPT002)
HFBR-3200
HFBR-3001
HFBR-3021
Connectors
HFBR-4000
HFBR-3099
Connector Assembly Tools
HFBR-0100
HFBR-0101
HFBR-Ol02
Mounting Hardware
HFBR-4201
HFBR-4202

Ouplex
HFBR-3100
(OPT001)
HFBR-3100
(OPT002)
HFBR-3300

Customer specified length. connectored (HFBR-4000 connector)

4-92

Customer specified length, connectored (SMA style connector)
Customer specified length. unconnectored
10 metres connectored (HFBR-4000 connector)
10 metres connectored (SMA style connector)

4-94

Metal body, metal ferrule
Connector-connector junction. bulkhead feedthrough for HFBR-4000 connector

4-96

Field installation kit for HFBR-4000 connectors (includes case, tools,
consumables)
Replacement consumables for HFBR-0100 Kit
Custom tool set only

4-98

PCB mounting bracket, EMI shield, misc. hardware for
HFBR-1201/-1203/-2201/-2203
PCB mounting bracket, EMI shield, misc. hardware for
HFBR-1202/-1204/-2202/-2204

4-46

'Link performance at 25° C.

4-4

High Performance Module Family: Glass fiber 1100/140 I'm), Precision metal connectors, TTL compatible output,
Link monitor, Transparent 3-level code

Products/Part Nos.

Page
No.

Description

Evaluation Kit
HFBR·0010

HFBR-l001 Transmitter, HFBR-2001 Receiver. 10 metre connectored cable.
literature

Transmitter/Receiver Pairs
HFBR-l00l/-2001
HFBR-l002/-2001

Guaranteed Distance'
180 metre
1500 metre

Guaranteed Data Rate'
10 MBd
10 MBd

Connector Style
HFBR-4000
HFBR-4000

4-80
4-84

Cables
Simplex
HFBR-3000
(OPT001)
HFBR-3200
HFBR-3001
HFBR-3021

Duplex
HFBR-3100
(OPT001)
HFBR-3300

Connectors
HFBR-4000
HFBR-3099
Connector Assembly Tools
HFBR-Ol00
HFBR-Ol0l
HFBR-Ol02

Customer specified length. connectored (HFBR-4000 connector)

4-92

Customer specified length. unconnectored
10 metres connectored (HFBR-4000 connector)
10 metres cOilnectored (SMA style connector)

4-94

Metal body, metal ferrule
Connector-connector junction. bulkhead feedthrough for HFBR-4000 connector

4-96

Field installation kit for HFBR-4000 connectors (includes case. tools,
consumables)
Replacement consumables for HFBR-Ol00 Kit
Custom tool set only

4-98

Data Communications Equipment

Products/Part Nos.

Description

Page
No.

RS-232-CIV.24 to Fiber Optic Multiplexer
39301A Multiplexer

1250 metres length, 19.2 kbps/channel data rate. 16 channels RS-232-C
Input/Output

4-100

PIN Photodiodes: Variety of packages, high speed, low capacitance, low noise.

Products/Part Nos.

Description

5082-4200 Series

High Speed PIN Photodiodes for use in Fiber Optic Applications

'Link performance at 25°C.

4-5
..

_

...... _----

~~~~-

.---~--------

Page
No.
4-106

Flin-

HEWLETT

SNAP-IN FIBER OPTIC LINKS
TRANSMITTERS, RECEIVERS,
CABLE AND CONNECTORS

I.!~ PACKARD

HFBR-0500
SERIES

TECHNICAL DATA

JANUARY 1986

Features
• GUARANTEED LINK PERFORMANCE OVER
TEMPERATURE
High Speed Links: dc to 5 MBd
Extended Distance Links up to 82 m
Low Current Links: 6 mA Peak Supply Current for
an8 m Link
Photo Interrupters
• LOW COST PLASTIC DUAL-IN-LINE PACKAGE
• EASY FIELD CONNECTORING
• EASY TO USE RECEIVERS:
Logic Compatible Output Level
Single +5 V Receiver Power Supply
High Noise Immunity
• LOW LOSS PLASTIC CABLE:
Selected Super Low Loss Simplex Cable
Simplex and Zip Cord Style Duplex Cable

Description

Applications
• HIGH VOLTAGE ISOLATION
• SECURE DATA COMMUNICATIONS
• REMOTE PHOTO INTERRUPTER
•
•
•
•

LOW CURRENT LINKS
INTER/INTRA-SYSTEM LINKS
STATIC PROTECTION
EMC REGULATED SYSTEMS (FCC, VDE)

The HFBR-0500 series is a complete family of fiber optic
link components for configuring low-cost control, data
transmission, and photo interrupter links. These components
are designed to mate with plastic snap-in connectors and
low-cost plastic cable: Link design is simplified by the
logic compatible receivers and the ease of connectoring
the plastic fiber cable. The key parameters of links configured
with the HFBR-0500 family are fully guaranteed. The
HFBR-0500 Evaluation Kit contains all the components and
literature necessary to evaluate a working link.
* Cable is available in standard low loss and selected super low
lost varieties.

Link Selection Guide
GUARANTEED LINKS

Data
Rate

Typical Link Lengths
Guaranteed Link Length
O·70·C
HFBR-351X HFBR·3530 HFBR-351X HFBR-3530
Cable
1361X Series
Cable
J361X Series
Cable
Transmitter
Cable

Receiver

Page

5 MBd Link

5MBd

12

17

35 m

48m

HFBR-1510

HFBR-2501

4-8

1 MBd Link

1 MBd

24

34

55m

76m

HFBR-1502

HFBR-2502

4-10

Low Current Link 40 kBd

8

11

50m

69 m

HFBR-1512

HFBR-2503

4-12

HFBR-1512 HFBR-2503

4-12

HFBR-1512
HFBR-1502

4-14
4-14

extended
Distance Link
Photo Interrupter
Link

40 kBd

60

82

110 m

152.5 m

20 kHz
500 kHz

N/A
N/A

N/A
N/A

N/A
N/A

N/A

Evaluation Kit, HFBR'()500

N/A

HFBR-2503
HFBR-2502

HFBR-1510 Transmitter, HFBR-2501 Receiver, 5 metre Connectored Cable, Bulkhead Feedthrough, Connectors, Polishing Kit, Literature

4-6

component Selection Guide
TRANSMITTERS

Unconnectored Plastic Fiber Optic Cable

Minimum Output
Optical Power
o to 70°C

Peak Emission
Wavelength

Page

HFBR-1510

-16.5 dBm

665 nm

11

HFBR-1502

-13.6 dBm

665 nm

11

HFBR-1512

-13.6 dBm

665 nm

11

Data Rate

Page

HFBR-2501

-21.6 dBm

5 MBd

12

HFBR-2502

-24 dBm

1 MBd

12

HFBR-2503

-39 dBm

40 kBd

14

Dual
Channel

HFBR-3579

HFBR-3679

25

HFBR-3580

HFBR-3680

100

HFBR-3581

HFBR-3681

500

HFBR-3582
Selected
(Low Loss)

500

HFBR-3610

Quantity 63

OPT 001

Quantity 3

CONNECTORS
CABLES
Connectored Plastic Fiber Optic Cable
Dual
Channel

Length'
(metres)

HFBR-3510"
HFBR-3530"

HFBR-3610"

Customer
Specified

HFBR-3512

HFBR-3612

0.5

HFBR-3513

HFBR-3613

1

HFBR-3514

HFBR-3614

5

HFBR-3517

HFBR-3617

30

HFBR-3518

HFBR-3618

45

HFBR-3519

HFBR-3619

60

HFBR-3511

Page 17

HFBR-4501 Gray Connector/Crimp Ring
HFBR-4511 Blue Connector/Crimp Ring
HFBR-4595 Polishing Kit
Polishing Fixture - Abrasive Paper
HFBR-4596 Polishing Fixture
Bulkhead Feedthrough/ln-Line Splice
HFBR-4505 Gray
HFBR-4515 Blue

Page 15

Single
Channel

Length'
(metres)

* All cable lengths are +10%, -{)% tolerance.
**HFBR-3510, HFBR-3530, HFBR-3610 Ordering Information.
These cable assemblies of customer specified length have
factory installed connectors. The length must be specified in
1 metre increments. The mandatory OPT 001 specifies the
number of assemblies of equal length ordered.
EXAMPLE: To order 3 duplex cable assemblies, 21 metres
each, specify:

RECEIVERS
Sensitivity
o t070°C

Single
Channel

0.1

Mechanical Dimensions

4-7

Page 19

5 MBd link
HFBR-1510 AND HFBR-2501
The de to 5 MBd link is guaranteed over temperature to
operate up to 17 m with a transmitter drive current of 60
mAo This link uses the 665 nm HFBR-1510 Transmitter, the

HFBR-2501 Receiver, and HFBR-3530 Cable. The receiver
compatible with LSTTLITTL/CMOS logic levels offers a
choice of an internal pull-up or open collector output.

RECOMMENDED OPERATING CONDITIONS
Parameter

Symbol

Min.

Max.

Units

TA

0
10

70

"C

750

mA

60

mA

5.25

V

Ambient Temperature
Transmitter Peak Forward Current

IF PK

Avg. Forward Current

IfAV

Receiver Supply Voltage

Vee

Fan-Out {TTL}

4.75

Ref.
Note 1
Note 2

5

N

SYSTEM PERFORMANCE Using HFBR-3510/3610 series cable under recommended operating conditions unless otherwise specified.
Parameter

Symbol

Transmission Distance
HFBR-351X1361X
series cable

Q

Pulse Width Distortion

Typ.£5j

Max.

Units

Conditions

5

M8d

8ER 5. 10-9

18

24

Ref.

m

IFPK = 60 mAo 0-70 0 C

35

m

IFPK '" 60 mAo 25" C

m

IFPK = 60 mA, 0-70" C

48

m

IFPK = 60 mA, 25" C
RL 'eo 560

12

17

Transmission Distance
HFBR-3530 cable
Propagation Delay

Min.
dc

Data Rate

n, CL = 30 pF

tpLH

80

140

ns

tPHL

50

140

ns

PA = -21.6:5PR:5-9.5dBm

Note 3

tD

30

ns

PA =-15dBm
RL = 560 n, CL = 30 pF

Fig.4.6
Note 4

8000

Vim

EMI Immunity

Fig. 4. 5

8ER 5.10-9

Noles: 1. For IFPK > 80 mAo the duty factor must be such as to keep IFAV S; 80 mA. In addition. for IFPK > 80 mAo the following rules for
IFPK> 160 mAo Pulse width S; 1 I's
pulse width apply: IFPK S; 160 mA: Pulse width S; 1 ms
2. It is essential that a bypass capacitor (0.01 I'F to 0.1 I'F ceramic) be connected from pin 3 to pin 4 of the receiver. Total lead
length between both ends of the capacitor and the pins should not exceed 20 mm.
3. The propagation delay of 1 m of cable (5 ns) is included.
4. T D = tpLH - tpHL'

5. Typical data is at 25°C, Vee

= 5 V.

Link Design Considerations
The HFBR-1510/2501 Transmitter/Receiver pair is guaranteed for operation at data rates up to 5 MBd over link
distances from 0 to 12 metres with HFBR-351 X/361 X series
cable and from 0 to 17 metres with H FBR-3530 cable. The
value of transmitter drive current. IF. depends on the link
distance as shown in Figures 2 and 3. Note that there is an
upper as well as a lower limit on the value of IF for any

given distance. The dotted lines in Figures 2 and 3 represent pulsed operation. When operating in the pulsed mode.
the conditions in Note 1 must be met. After selecting a
value of the transmitter drive current IF. the value of R1 in
Figure 1 can be calculated as follows:
R1 = Vce-VF
IF

Vee

HFBR-2S01

Figure 1. Typical Circuit Operation (S MBd

4-8

S;

12 m)

300

'"E

'E"

....I
:50:

....I

:5

0:
0:

0:

::J

::J

"0

"0

cr

0:

"'f2"

f2

"'"

.!:

1,

cr

cr

~

~

- CABLE LENGTH- METRES OF
HFBR- 351X/- 361X CABLE

Figure 2. Guaranteed System Performance with HFBR-1510 and
HFBR-2501

HP 80078
PULSE
GENERATOR

1

- CABLE LENGTH- METRES OF
HFSR-3530 CABLE

Figure 3. Guaranteed System Performance with HFBR-1510,
HFBR-2501 and HFBR-3530 cable.

•

INPUT
MONITORING
NODE
VI

0------..
5Hl

HFBR-1510

HFBR-2501

V,

OT

Vo

Figure 4. A.C. Test Circuit

200

100

z
0
i=

~

~

75

0

in

z

0

:J:

....

~

100

'":0:

ii:

"'~

~I

25

50

~

I

9

oL-__-L-L____
-25

~

______

~

____

-20

~

0
-25

-5

PR - INPUT OPTICAL POWER - dBm

"" -tl'llH

o

50

0

~

150

~
o

cr

"'-

............

-20

-15

-10

-

tPHl

-5

PR - INPUT OPTICAL POWER - dBm

Figure 5. HFBR-1510/2501 Link Pulse Width Distortion vs.
Optical Power

Figure 6. HFBR-1510/2501 Link Propagation Delay vs. Optical
Power

4-9

1 MBd Link

HFBR-1S02 AND HFBR-2S02

The dc to 1 MBd link is guaranteed over temperature to
operate from 0 to 34 m with a transmitter drive current of
60 mAo This link uses the 665 nm HFBR-1502 Transmitter,

the HFBR-2502 Receiver, andHFBR-3530 Cable. The
receiver is compatible with LSTTLlTTLICMOS logic levels
and offers a choice of an internal pull-up or open collector
output.

RECOMMENDED OPERATING CONDITIONS
Parameter

Symbol

Min.

Max.

Units

TA

0

70

°C

IFPK

10

750

mA

60

mA

5.25

V

Ambient Temperature
Transmitter Peak Forward Current
Avg. Forward Current

IFAV

Receiver Supply Voltage

Vee

Fan-Out (TTL)

4.75

Ref.
Note 1
Note 2

5

N

SYSTEM PERFORMANCE Using HFBR-3510/3610 series cable under recommended operating conditions unless otherwise specified.
Parameter

Symbol

Data Rate

R

Transmission Distance
HFBR-3530 Cable

R

Transmission Distance
50% Duty Cycle - 351 X/361 X
Series Cable

Q

Transmission Distance
50% Duty Cycle - 3530 Cable

Q

Pulse Width Distortion

Typ.[5]

dc

Transmission Distance
HFBR-351X/361X
series cable

Propagation Delay

Min.

Max.

Units

Conditions

1

MBd

BER::; 10-9

m

IFPK = 60 mA. 0-70 c C

55

m

IFPK = 60 rnA, 25°C

rn

IFPK = 60 mA, 0-70 c C

76

m

IFPK = 60 mA, 25 C C

24
30
34
41

IFPK = 120 rnA, O-iO°C

30
36

65

IFPK = 120 mA, 25 c C

41
50

Ref.

iFPK'" 120 mA, 0-70° C
iFPK = 120 mA, 25° C

90

tPLH

180

250

ns

RL = 560

tpf1L

100

140

ns

PR=-24dBm

Note 3

tD

80

os

PR=-24dBm
RL = 560 n, CL = 30 pF

Fig. 4, {)
Note 4

8000

VIm

EMllmmunity

n, CL'" 30 pF

Fig. 4,5

I BER::; 10.9

Notes: 1. For IFPK > 80 mA, the duty factor must be such as to keep IFAV oS 80 mA. In addition, for IFPK > 80 mA, the following rules for
IFPK'> 160 mA: Pulse width oS 1 P.s
pulse width apply: IFPK oS 160 mA: Pulse width oS 1 ms
2.lt is essential that a bypass capacitor (0.01 p.F to 0.1 p.F ceramic) be connected from pin 3 to pin 4 of the receiver. Total lead
length between both ends of the capacitor and the pins should not exceed 20 mm.
3. The propagation delay of 1 m of cable (5 ns) is included.
4. T D = tpLH - tpHL'
5. Typical data is at 25°C, Vee = 5 V.

Link Design Considerations
The HFBR-1502/2502 Transmitter/Receiver pair is guaranteed for operation at data rates up to 1 MBd over link
distances from 0 to 24 metres with HFBR-351X/361X series
cable and from 0 to 34 metres with HFBR-3530 cable. The
value of transmitter drive current, IF, depends on the link
distance as shown in Figures 2 and 3. Note that there is a
lower limit on the value of IF for any given distance. The
dotted lines in Figures 2 and 3 represent pulsed operation.

When Operating in the pulsed mode, the conditions in Note
1 must be met. After selecting a value of the transmitter
drive current IF, the value of R1 in Figure 1 can be calculated as follOWS:
R1 = Vee - VF - VOL (75451)
IF

For the HFBR-1502/2502 pair, the value of the capacitor,
e1 (Figure 1) must be chosen such that R1 C1 ::; 75 ns.

vee

HFBR-1S02

Figure 1. Typical Circuit Operation (1 MBd oS 24 m)

4-10

600~
750~~~

"E

"E

I

~a:

....

15a:

a:
u

a:

::>

::>
u

o

oa:

a:

~

"~

a:

~

~

I

.b

~

2 _ CABLE LENGTH- METRES OF

2 - CABLE LENGTH- METRES OF

HFBR- 3530 CABLE

HFBR-351X/-361X CABLE

Figure 2. Guaranteed System Performance with HFBR-1502 and
HFBR-2502

Figure 3. Guaranteed System Performance with HFBR-1502,
HFBR-2502 and HFBR-3530 cable.

Va

HFBR-2502

NODE

HP

ao07ll
PULSE
GENERATOR

V,

¢T

Vo

Figure 4. A.C. Test Circuit

500
c
I
Z

V

1/

400

o
;=

Vlp'H

>-

a:

"

~Q

~
c

....:c

;=

30 0

z
0

c

"'"

100

0

-25

PR - INPUT OPTICAL POWER - dBm

.... I-""

/'

V

V

V --

I"- -. t'-20

-15

r-

tpHI.

-10

-5

PR - INPUT OPTICAL POWER - dBm

Figure 5. HFBR-1502/2502 Link Pulse Width Distortion vs.
Optical Power

Figure 6. HFBR-1502/2502 Link Propagation Delay vs. Optical
Power

4-11

Low Current/Extended Distance Link
HFBR-1512 AND HFBR-2503
The black plastic housing of the HFBR-1512 Transmitter is
designed to prevent the penetration of ambient light into the
cable through the transmitter. This prevents the sensitive
receiver from being triggered by ambient light pulses.

The low current link requires only 6 mA peak supply current
for the transmitter and receiver combined to achieve an 11
m link. Extended distances up to 82 m can be achieved at a
maximum transmitter drive current of 60 mA peak. This link
can be driven with TTULSTTL and most CMOS logic gates.

RECOMMENDED OPERATING CONDITIONS
Parameter

Symbol

Min.

Max.

Units

70

'C

120

mA

60

mA

5.5

V
V

TA

0

Transmitter
Peak Forward Current

IFPK

2

Avg. Forward Current

IFAV

Ambient Temperature

Receiver
Supply Voltage
Output Voltage

Vee
Vo

Fan-Out (TTL)

N

SYSTEM PERFORMANCE
Parameter

Transmission Distance
HFBR-3530 cable
Propagatlon Delay
. Pulse Width Distortion
Bit Error Rate

Vee

Note 1

Note 2

1

Using HFBR-351 0/361 0 series cable under recommended operating conditions unless otherwise otherwise specified.

Symbol

Data Rate
Transmission Distance
HFBR-351X/361 X
series cable

4.5

Ref.

K;'

TypJ5]

Max.

Unils

Conditions

40

k8d

to::; 7.0.us

Ref.

8

50

m

IFPK "" 2 mA, 0-70 0 C

60

110

m

IFPK = 60 mA, 0-70" C

11

69

m

IFPK

82

,152

m

IFPK"" 60 mA, 0-70· C

tpl.H

4

1"$

RL = 3.$K .0, CL = 30 pF

IPHL

2.5

1"$

PR=-25dBm

.uS

-39::; PR ::;-14 d8m
Fig.4,6
RL -= 3.$ K.o, CL "" 30 pF Note 4

Q

Q

7.0

to
10-9

BER

5000

EMllmmunity

= 2 mA, 0-70·C
Fig. 4, 5
Note 3

PR "" -30 dBm
Vim

I

PR=O mW

Notes:
1. For IFPK > 80 mA, the duty factor must be such as to keep IFAV ,;; 80 rnA. In addition, if IFAV > 80 mA, then the pulse width must be
equal to or less than 1 ms.
2. It is recommended that a bypass capacitor 10.01 J.LF to 0.1 J.LF ceramic) be connected from pin 3 to pin 4 of the receiver.
3. The propagation delay of 1 m of cable 15 ns) is included.
4. to = tPLH - tPHL.
5. Typical data is at 25° C, Vee = 5 V.

Link Design Considerations
The HFBR-1512/2503 Transmitter/Receiver pair is guaranteed for operation at data rates up to 40 kBd for transmitter
drives as low as 2 mAo The value of transmitter drive current, IF, depends on the link distance as shown in Figures 2
and 3. Note that there is an upper as well as a lower limit on

the value of IF for any given distance. After selecting a value
of the transmitter drive current IF, the value of R1 in Figure 1
can be calculated as follows:
R1 -= VCC-VF
IF
N,C.

vee

HFBR-1512
Figure 1. Typical Circuit Operation (40 kBd)

4-12

'"

E

~

W

II:
II:

:::>

"o
~
II:

5!

A,

2 -CABLE LENGTH-METRES
OF HFBR- 351X/-361X CABLE

• - CABLE LENGTH- METRES OF
HFBR-3530 CABLE

Figure 2. Typical Circuit Operation (40 kBd)

HP8007B
PULSE
GENERATOR

INPUT
MONITORING

NODE

Figure 3. Guaranteed System Performance with HFBR-1512 and
HFBR-2503

IF

0----+

VI

SUI

HFBR-1512

HFBR-2503

V,

-

-

-

-

-

-

-

-

-

-

-

-

-

Va

NODE

-50%

o.

Va

Figure 4. A.C. Test Circuit

6
5

/

4

/

3

11/

2

_i"""

I

/
-40

,/

,/
-34

-28

-22

-16

-10

PR -INPUT OPTICAL POWER, dBm

PR - INPUT OPTICAL POWER - dBm

Figure 5. HFBR-151212503 Link Pulse Width Distortion vs.
Optical Power

Figure 6. HFBR-151212503 Link Propagation Delay vs. Optical
Power

4-13

Photo Interrupter Links
HFBR-1S02/2502
HFBR-1S12/2503
The HFBR-151212503 link (20 .kHz) has an optical power
budget of 24 dB, and the HFBR-1502/2502 link (500 kHz)
budget is 10 dB. Total system losses (cable attenuation, airgap loss, etc) must not exceed the .Iink optical power
budget.

These links may be used in optical switches, shaft position
sensors, and velocity sensors. They are particularly useful
where high voltage, electrical noise, or explosive environments prohibit the use of electromechanical or
optoelectronic sensors.

RECOMMENDED OPERATING CONDITIONS
Symbol

Min.

Max.

Units

TA

0

70

"c

Transmitter
Peak Forward Current

IFPK

10

750

mA

Avg. Forward Current

IFAV

60

mA

Parameter
Ambient Temperature

Receiver
Supply Voltage

HFBR-2503

Output Voltage

IIiF6R-2503

Vec

HFBR-2502

4.50

5.50

4.75

5.25

V

Vee

Vo

HFBR-2502
FanoutlTTU

I

1

HFBR-2502

5

Note 1

Note 2

V

18

HFBR-2503

Ref.

SYSTEM PERFORMANCE
See HFBR-1502/2502 link data sheet (page 4-10) and HFBR-1512/2503 link data sheet (page 4-12) for more design
information. These specifications apply when using HFBR-3510/3610 series cable and. unless otherwise specified. under
recommended operating conditions.
Parameter

Symbol

Min.

TypJ5J

Max.

Units

20

kHz

Condltloll$

Ref.

HFBR-15121HFBR-2503
Max. Count Frequency

de

Optical Power Budget

25.4
27.8

34

dB

IFPK '" 60 rnA. 0-70· C

dB

IFPK=60 mA.25·C

NoteS.4

HFBR-1502, HFBR·2502
Max. Count Frequency
Optical Power Budget

de·

500

10.4
12.8

15.6

kHz
dB

IFPK = 60 mA, 0-70· C

dB

IFPK = 60 mA, 25° C

NoteS

Notes:
1. For IFPK > 60 mA, the duty factor must be such as to keep IFAv:5 60 mAo In addition, for IFPK > 60 mA, the following rules for pulse
width apply:
IFPK:5 160 mA: Pulse width:51 ms
IFPK >160 mA: Pulse width:51 p's
2. A bypass capacitor (0.01 p.F to 0.1 p.F ceramic) connected from pin 3 to pin 4 of the receiver is recommended for the HFBR-2503
and essential for the HFBR-2502. For the HFBR-2502, the total lead length between both ends of the capacitor and the pins should
not exceed. 20 mm.
3. Optical Power Budget = Pr Min. - PR(L) Min. Refer to HFBR-1502l1512 data sheet; page 4-16; HFBR-2502 data sheet, page 4-17; and
HFBR-2503 data sheet, page 4-19 for additional design information.
-4. In addition to a minimum power budget, care should be taken to avoid overdriving the HFBR-2503 receiver with too much optical
power. For this reason power levels into the receiver should be kept less than -13.7 dBm to eliminate any overdrive with the
recommended operating conditions.
5. Typical data is at 25°C, Vee = 5 V.

4-14

~.----.--

..- ..- - - . - - - - - - - - - - - - - - - - - -

Link Design Considerations
The HFBR-1512/2503 and HFBR-1502/2502 Transmitterl
Receiver pairs are intended for applications where the photo
interrupter must be physically separate from the optoelectronic emitter and detector. This separation would be useful
where high voltage, electrical noise or explosive environments prohibit the use of electronic devices. To ensure
reliable long term operation, links designed for this application should operate with an ample optical power margin
a::M 2: 3 dB, since the exposed fiber ends are subject to
environmental contamination that will increase the optical
attenuation of the slot with time. A graph of air gap separation versus attenuation for clean fiber ends with minimum
radial error::; 0.005 inches (0.127 mm) and angular error
(::; 3.0') is provided in Figure 2. The following equations can

now be used to determine the transmitter output power, PT,
for both the overdrive and minimum drive cases. Overdrive
is defined as a condition where excessive optical power is
delivered to the receiver. The first equation enables the maximum Pi that will not result in receiver overdrive to be
calculated for a predetermined link lengih and slot attenuation. The second equation defines the minimum Pi allowed
for link operation.

Pi (MAX) -

PA (MAX) ::; 010 MIN!!

+ aSLOT

Eq. 1

Pi (MIN) - PAL (MIN) 2: 010 MAX!! + aSLOT + aM
Eq. 2
Once Pi (MIN) has been determined in the second equation
for a specific link length (1'.), slot attenuation (as LOT) and
margin (aM), Figure 3 can then be used to find IF.

Figure 1. Typical Slot Interrupter Conligurallon. ReIer to 1 MBd
or Low Current Links lor Schematic Diagrams

HFBR-35XX CABLE
HFBR-4501/4511 CONNECTORS

HFBR-15XX

20

HFBR-25XX

~~
AXIAL~ ~

SEPARATION

15

18
I

z
o

~
15

10

S

910111213

3
AXIAL SEPARATION (mm)

Figure 2. Typical Attenuation vs. Axial Separation

~

."

I

ffi;:

!2

....
~

to

~o
I

.t

IF - TRANSMITTER DRIVE CURRENT - rnA.

Figure 3. Typical HFBR-1502l1512 Optieal Output Power vs.
Transmitter IF (0-70· C)

4-15
-------------~--

.. --.. -- .... - - - - - -

665 nm Transmitters
HFBR-1510/151211502 Transmitter

HFBR-1502lHFBR-1510 and HFBR-1512

N.C.

The HFBR-151011'502l1512 Transmitter modules ir:corporate a 665 nm LED emitting at a low attenuation wavelength
for the HFBR-3510/3610 plastic fiber optiC cable. The
transmitters can be easily interfaced to standard TTL logic.
The optical power output of the HFBR-1510/1512/1502 is
specified at the end of 0.5 m of cable. The HFBR-1512 output optical power is tested and guaranteed at low drive
currents.

CATHODE 2

3
CATHODE-'+-_---'

N.C.

Absolute Maximum Ratings
Min.
-40

Max.

Units

+75

·C

0

+70

·C

I Temp,

260

·C

I Time

10

sec.

Parameter

Symbol

Storage Temperature

TS

Operating Temperature

TA.

Lead Solderlng'Cycle

I

Peak Forward Input Current

IFPK

1000

mA

Average Forward Input Current

IFA.V

80

mA

VR

5

V

Reverse Input current

Ref.

Note 1
Note 2

Electrical/optical Characteristics o· e to +7o·e Unless Otherwise Specified
Paran;efer

Transmitter Output

HFBR-1510

Symbol

Min.

Pr

-16.5

-I'f","
-7

dBm

-14.1

-8.4

dBm

=60 rnA, o-70o e
IF =80 mA, 25" C

-13.6

-4.5

dBm

IF = 60 rnA, o-70~C

Fig. 2

-11.2

-5.4

dBm

IF=60 rnA,25°C

Note 4

dBm

IF=2 mA,o-70·C

Note 3

Optical Power
HFBR-1502
and
HFBR-1512

Pr

HFBA-1512

PT

Output Optical Power
Temperature Coefficient

-hoPr
AT

Peak EmiSSion Wavelength

hPK

Forward Voltage

VF

Forward Voltage
Temperature Coefficieot

AVF

I Effective Diameter

TypJ51

-85.5

665
1.67

Ref.

~C

-

l-

:::l

ii:

c

C

til

ffi

N

"'"

-5

::;

II-

~

/

2

//

100

"
'"I
:;

II:

10

0

II:
l-

I

d:'

~

I, - TRANSMITTER DRIVE CURRENT - mA

VF - FORWARD VOLTAGE - V

Figure 1. Typical Forward Voltage vs. Drive Current for
HFBR-1510/1502/1512

Figure 2. Normalized HFBR-1510/1502l1512 Typical Output
Optical Power vs. Drive Current

Receivers
HFBR-2501/2502 Receiver

HFBR-2S01 (5 MBd) and HFBR-2S02 (1 MBd)
The HFBR-2501/2502 Receiver modules feature a shielded
integrated photodetector and wide bandwidth DC amplifier for high EMI immunity. A Schottky clamped
open-collector output transistor allows interfacing to
common logic families and enables "wired-OR" circuit
designs. The open collector output is specified up to 18V.
An integrated 1000 ohm resistor internally connected to
Vee may be externally jumpered to provide a pull-up for
ease-ol-use with +5V logiC. The 'combination of high optical power levels and fast transitions falling edge could
result in distortion of the output signal (HFBR-2502 only),
that could lead to multiple triggering of following circuitry.

Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Cycle

Symbol

Min.

Max.

Units

Ts

-40

+75

°C

TA

0

+70

°C

I Temp
I Time

Supply Voltage
Output Collector Current

Vee

-0.5

10

260

°C

10

sec

7

V

25

mA

Output Collector Power Dissipation

POD

40

mW

Output Voltage

Vo

-0.5

18

V

Pull up Voltage

VAL

-0.5

Vee

V

4-17

Ref.

Note 1
Note 6

Electrical/optical Characteristics O°C to +70°C, 4.75:5 Vcc :55.25 Unless Otherwise Specified
Parameter
Receiver Input Optical
Power Level for
Logic "0"

HFBR-2501

HFBR-2S02

Input Optical Power Level for Logic "1"

Typ.l51

Symbol

Min.

Max.

Units

Conditions

PR (L)

-21.6

-9.5

dBrn

0-70· C, VOL = 0.5 V
iOL=8 rnA

-21.6

-8.7

dBrn

25"C, VOL = 0.5 V
IOL=8 rnA

-24

dBrn

0-70° C, VOL"" 0.5 V
IOL"" 8 mA

-24

darn

2S"C, VOL 0.5 V
IOL=8 rnA

-43

dBm

VOH= S.25 V,
IOH :5 250 p.A

Note 2

PR IL)

PR(H)

Ref.

Note 2,
3

=

IOH

S

250

p.A

Va'" 18 V, PR = 0

Note 4

Low Level Output Voltage

VOL

0.4

0.5

V

IOL"'8rnA,
PR '" PRL MIN

Note 4

High Level Supply Current

leCH

3.5

6,3

mA

Vce = 5.25 V,

Note 4

High Level Output Current

PR = 0 p.W
Low Level Supply Current

ICCL

6,2

Effective Diameter

DR

1

Numerical Aperture

N.A.R

0.5

RL

1000

Internal Pull-Up Resistor

10

mA

Vee = 5.25 V,
PR = -12.5 dBm

Note 4

mm
Ohms

Notes:
1. 1.6 mm below seating plane.
2. Optical flux, P (dBm) = 10 Log P {I'Wl/l000 I'W.
3. Measured at the end of HFBR-3510 Fiber Optic Cable with large area detector.
4. RL is open.
5. Typical data is at 25° C, Vcc = 5 V.
6. It is essential that a bypass capacitor 0.Q1 I'F to 0.1 I'F be connected from pin 3 to pin 4 of the receiver. Total lead length between
both ends of the capacitor and the pins should not exceed 20 mm.

4-18

High sensitivity Receiver
HFBR-2S03 Receiver

HFBR-2S03
The blue plastic HFBR-2503 Receiver module has a sensitivity of -39 dBm. It features an integrated photodetector
and DC amplifier for high EMI immunity. The output is an
open collector with a150 pA internal current source pullup and is compatible with TTULSTTL and most CMOS
logic families. For minimum rise time add an external pullup resistor of at least 3.3K ohms. Vee must be greater than
or equal to the supply voltage for the pull-up resistor.

Absolute Maximum Ratings
Parameter

Symbol

Min,

Max.

Units

Ts

-40

+75

°C

o

+70

°C

Storage Temperature
Operating Temperature

I Temp

Lead Soldering Cycle

2S0

°C

10

sec

Vee

-0.5

7

V

Output Collector Current (AVerage)

10

-1

5

mA

Output Collector Power Dissipation

POD

25

mW

-0,5

Vee

V

Supply Voltage

Output Voltage

Vo

Ref.

Note 1

Electrical/optical Characteristics O°C to +70°C, 4.5 5. Vee 5. 5.5 Unless Otherwise Specified
Parameter
Receiver Input Optical
Power Level for
Logic "0"

Symbol
HFBR-2503

PR(L)

Input Optical Power Level
for Logic "1"

PR(H)

High Level Output Voltage

VOH

Low Level Output Voltage

VOL

High Level Supply Current

leCH

Low Level Supply Current

leOl_

Max.

Units

Conditions

-39

-13.7

dBm

0-70° C, Vo = VOL
101.=3.2 mA

-39

-13.3

d8m

25Q C, Vo == VOL
101. =3.2 mA

-53

dBm

VOH =5.5V,
IOH 5. 40 pA

Min.

Typ. (5)

V

IOH == -40 pA,
PR "" 0 pW

0.4

V

101.=3.2 mA,
PR "" PRL MIN

1.2

1,9

mA

Vee=5.5V, Pfl =OpW

2.9

3.7

mA

Vee=5.5V,
PR 2;; PRL (MIN)

2.4

Effective Diameter

DR

1

Numerical Aperture

NAR

0.5

Ref.
Note
2,3,4

Note 2

NoteS

NoteS

mm

Noles:
1. 1.6 mm below seating plane.
2. Optical flux, P IdBm) = 10 Log P i1'W)/1000 I'W.
3. Measured at the end of the HFBR-3510 Fiber Optic Cable with large area detector.
4. Because of the very high sensitivity of the HFBR-2503, the digital output may switch in response to ambient light levels when a cable
is not occupying the receiver optical port. The designer should take care to filter out signals from this source if they pose a hazard to
the system.
Typical
data is at 25° C, Vee = 5 V.
5.
6. Including current in 3.3K pull-up resistor.
7. It is recommended that a bypass capacitorO.01l'F to O.1I'F ceramic be connected from pin 3 to pin 4 of the receiver.

4-19

Plastic Fiber Optic Cable
HFBR-3510/HFBR·3530
High performance plastic fiber optic cable is available in
two varieties: standard low loss cable (HFBR-351 X and
HFBR-361X) and selected super low loss simplex cable
(HFBR-3530). The HFBR-3510/3530 Simplex Fiber Optic
Cable is constructed of a single step index plastic fiber
sheathed in a PVC jacket. The HFBR-3610 Duplex Fiber
Optic Cable has two plastic fibers, each in a cable of
construction similar to the Simplex Cable, joined with a
web. The individual channels are identified by a marking
on one channel of the cable.
These cables are UL recognized components and pass UL
VW-1 flame retardancy specification. The cable's safety in
flammable environments, and non-conductive electrical
properties may make the use of conduit unnecessary.
lengths of metre increments. HFBR-3530Connectored Fiber
Optic cable may be ordered in customer specified lengths
of one metre.increments.

The HFBR-3510/3610 Connectored Fiber Optic Cables are
available in fixed lengths ranging from 0.1 m to 60 m. Connectored cables may also be ordered. in customer specified

Absolute Maximum Ratings
Symbol

Parameter
Storage Temperature

Ts

Installation Temperature

TI

Short Term

I (Single Channell
I (Dual Channel}

Min.

Max:.

Units

... -40
-20

+75
+70

°C
QC

Fr

50

N

Fr

100

.

Ref.

N

Note 1

Short Term Bend Radius

r

10

mm

Note 2

Long Term Bend Radius

r

35

mm

Long Term Tensile Load

Fr

Tensile Force

1

N

1000

Cycles

Note 3

m

0.5

Kg

Note 4

h

150

mm

Flexing
Impact

Electrical/Optical Characteristics 0° C to +70° C Unless Otherwise Specified
Parameter
CaQle AttenUation
H FBR-351 XlH FBR-361 X
HFBR-3530
Numerical Aperture

Symbol

Min.

Typ.[5J

Max.

Units

Conditions

(\'0

0.19

0.31

0.43

dB/m

Source is HFBR-1502l15101
1512 (665 nm). £= 20 m

ao

0.19

0.25

0.31

dB/m

N.A.

Ref.

[6J

Q>2m

0.5

Diameter, Core

Dc

1.0

Diameter, Jacket

OJ

2.2

mm
mm

Travel Time Constant

W

5.0

nsec/m

Mass per Unit Length!
Channel

mlQ

4.6

g/m

Without Connectors

Cable Leakage Current

IL

12

nA

50 kV.

Simplex Cable

R= 0.3m

Notes:
1. Less than 30 minutes.
2. Less than 1 hour, non-operating.
3. 90° bend on 10 mm radius mandrel.
4. Tested at 1 impact according to MIL-STD-1678, Method 2030, Procedure 1.
5. Typical data is at 25° C.
6. In addition to standard Hewlett-Packard 100% product testing, HP provides additional margin to ensure link performance. Under
certain conditions, cable installation and improper connectoring may reduce performance. Contact Hewlett-Packard for
recommendations.

4-20

- - - - - - - - - - - - - - - - - - - - - - - ------------

---------

----------

Ordering Guide
HFBR-3510/3610 FIBER CABLE
Connectored Plastic Fiber Optic Cable

Unconnectored Plastic Fiber Optic Cable

Single
Channel

Dual
Channel

Length"
(metres)

HFBR-3510"
HFBR-3530"

HFBR-3610"

Customer
Specified

HFBR-3511
HFBR-3512

HFBR-3612

Single
Channel

Dual
Channel

HFBR-3579

HFBR-3679

25

HFBR-3580

HFBR-3680

100

0.1

HFBR-3581

HFBR-3681

0.5

HFBR-3582
Selected
(Low Loss)

HFBR-3513

HFBR-3613

1

HFBR-3514

HFBR-3614

5

HFBR-3515

HFBR-3615

10

HFBR-3516

HFBR-3616

20

HFBR-3517

HFBR-3617

30

HFBR-3518

HFBR-3618

45

HFBR-3519

HFBR-3619

60

---

Length"
(metres)

500
500

'All Cable Lengths are +10%, -{)% tolerance.
"HFBR-3510, HFBR-3530 and HFBR-3610 ordering information.
These cable assemblies of customer specified length have installed
connectors. The length must be specified in 1 metre increments.
The mandatory OPT 001 specifies the number of assemblies of
equal length ordered.
EXAMPLE: To order 2 duplex cable assemblies, 21 metres each,
specify:
HFBR-3610 Quantity 63
OPT 001
Quantity 3

HFBR-3500/3600 FIBER CABLE (Not recommended for new designs.)

Electrical/Optical Characteristics O°C to +70°C Unless Otherwise Specified
Parameter

Symbol

Min.

TypJS]

ao

0.3

0.45

Cable Attenuation
Numerical Aperture
Diameter, Core

N.A.

0.5

Dc

1.0

Units

Max.

O'63!dB/rn

Conditions

£:> 2m
mm

Diameter, Jacket

DJ

2.3

mm

Travel Time Constant

IIV

5.0

nsec/m

Mass per Unit Length/Cable

m/Q

4.6

gJm

Without Connectors

IL

1

nA

50 kV, Q"' 0.3m

Cable Leak<'!ge Current

Ref.

at 665 nm Source NA "'" 0.5

Simplex Cable

Ordering Guide
HFBR-3500/3600
The cables listed below are still available from HewlettPackard. However, the newer HFBR-351 0/361 0 series shown
above offers higher performance.

Connectored Plastic Fiber Optic Cable

Unconnectored Plastic Fiber Optic Cable

Single
Channel

Dual
Channel

Length
(metres)

Single
Channel

Dual
Channel

Length
(metres)

HFBR-3500

HFBR-3600

HFBR-3501
HFBR-3502
HFBR-3503
HFBR-3504
HFBR-3505
HFBR-3506
HFBR-3507
HFBR-3508

HFBR-3589
HFBR-3590
HFBR-3591

HFBR-3689
HFBR-3690
HFBR-3691

25
100
500

HFBR-3602
HFBR-3603
HFBR-3604
HFBR-3605
HFBR-3606
HFBR-3607
HFBR-3608

Customer
Specified
0.1
0.5
1
5
10
15
20
25

4-21
------------------

snap-in Fiber Optic
connector, Bulkhead
Feedthrough/splice and
Polishing Tools

HFBR-4501 (GRAY)/4511 (BLUE) CONNECTOR.

o ¢un

•

HFBR-4505 (GRAY)/4515 (BLUE) BULKHEAD FEEDTHROUGH

HFBR-4501/4511 CONNECTORS
HFBR-4505/4515 BULKHEAD FEEDTHROUGHS
The HFBR-4501 and HFBR-4511 snap-in connectors terminate low cost plastic fiber cable and mate with the
Hewlett-Packard HFBR-Q500 family of fiber optiC transmitters and receivers. They are quick and easy to install. The
metal crimp ring provides strong and stable cable retention
and the polishing technique ensures a smooth optical finish
which results inconsistently high optical coupling
efficiency.
The HFBR-4505 and HFBR-4515 bulkhead feedthroughs
mate two snap-in connectors and can be used either as an
in-line splice or as a panel feedthrough for plastic fiber
cable. The connector to connector loss is low and
repeatable.

HFBR-4595 POLISHING KIT

HFBR-4596 HARDENED STEEL POLISHING FIXTURE

Applications
• CONNECTOR

C1~
D
~I

-./t'"---1··l

t::::=~'DIP.jj.IooooII_ I

TERMINATION FOR HEWLETT-PACKARD HFBR-35XXl36XX
FIBER OPTIC CABLE

BULKHEAD FEEDTHROUGH OR PANEL MOUNTING OF HFBR-45XX CONNECTORS

IN-LINE SPLICE FOR HFBR-35XXl36XX FIBER OPTIC CABLE

Absolute Maximum Ratings
Storage
Temperature

Symbol

Notes

Ts

Operating
Temperature

TA

Nut Torque

TN

0

HFBR-4505/4515

D;!

INTERFACE TO HEWLETT -PACKARD HFBR-15XX/25XX
SNAP-IN FIBER OPTIC LINK COMPONENTS

• BULKHEAD FEEDTHROUGH

Parameter

I

-·"'j.r-~fj

+70

.. c

0.7

N-m

100 OzF-JN

Notes:
0 57 N-m
1, Recommended nut torque is
OZF-IN

Iio

4-22

------.~--

. .- - . -

Mechanical/Optical Characteristics

0° to 70°C Unless Otherwise Specified.

Typical Data at 25° C.

Para meier
Retention Force Connector/Module
HFBR-4501/4511 to
HFBR-15XXl25;:z

w

40

>

'"

~w

U

C

0:

'"

;:

30

0:

~I~

Ii!
I
J!-

0.8

r-

0.6

I

0:

0.4

+/ r

.s: 02

"

~

101·L.4:-Ll-f::---of::--:~--:2~.2:--2:'.4

a:
0:

V

./

-I

-3
-4
-5

-6

-7
-9

w

~..I

w

a:

;;

.

E

~

.
I

.f

I

10

i

>

-2

~

or $

20

~

,.#
1.0

20

30

40

50

60

70

IF - FORWARD CURRENT - rnA

VF - FORWARD VOLTAGE-V

Figure 2: Forward Voltage and Current Characteristics

Figure 3. Normalized Transmitter Output vs. Forward Currerit

..I

r------~~~-----------1r-~+5V=VcC

3.3K

3.3K

O.I~

Ry

'>-0:
"w
0:

U

!;i5
co.
w>-

~ii!

-'>-

"''''

:Eo
0:

~
TTL

-4-+_~I...):¢......!!l_"iT-'t::.\.-i-~R~X2":"1HFBR-I402/1404

......

IN~

c

r:.-{-- -;-1
I
I
I
L
_____- _.~~_J

A -WAVELENGTH - NANOMETRES

Figure 4. Recommended Drive Circuit

Figure 5. Transmitter Spectrum Normalized to the Peak

at 25°C

Figure 6. Test Circuit lor Measuring I r • tl

4-30

5~Bd
LOW COST
FIBER OPTIC
RECEIVER

Vee
DATA

HFBR-2402

COMMON

The HFBR-2402 Fiber Optic Receiver incorporates a
monolithic photo-IC which contains a photodetector and a
dc amplifier. An open collector Schottky transistor on the
IC provides compatibility with TTL and CMOS logic. This
receiver is designed to operate with the Hewlett-Packard
HFBR-1402/1404 Fiber Optic Transmitter and 100/140 Ilm,
50/125 Ilm, 62.5/125 Ilm, 85/125 Ilm and 200 Ilm PCS fiber
optic cable terminated with SMA connectors.

The HFBR-2402 receiver is housed in a low cost dual-inline package that is made of high strength, heat resistant,
chemically resistant, and UL V-O flame retardant plastic.
The optical port is color coded to distinguish transmitters
and receivers. EMI immunity is equivalent to the HFBR2202 metal packaged receiver.
The package is designed for auto-insertion and wave
soldering so it is ideal for high volume production applications.

Consistent coupling into the receiver is assured by the
lensed optical system (Figure 1). Response does not vary
with fiber size.

HFBR-2402 RECEIVER

Absolute Maximum Ratings
Units Reference

Symbol

Min.

Max.

Sromge Temperature

Ts

-55

+85

'C

Operating Temperatl.,Jre

TA

-40

+85

'C

Parameter

Lead
Soldering
Cycle

I Temp
I Time

Supply VOlJage

Vee

Output Current

10

OUlpul VolJage
Output Collector
Power Ols51pah-on

Vo
Po AV

-05
,

-05

HOUSING

+260

'C

10

sec

7.0

V

25

mA

Now 1

18.0

V

40

mW
HEADER

EPOXY BACKFilL

Figure 1.

Mechanical Dimensions
(o~oi~1

DARK GRAY PORT IRx)
'14·36 UNS THREAD

OIA.

PIN NO. !INOICATOR

34
10.135)

I

_~

+

48

t

~5

10.315)

L,~

...---. ,IU

-Jt:::

127

i

I 2.5
10.0501
to.lao)
NOTE, AL~ DIMENSIONS IN MILLIM£TR€S ANO IINCHES).

4-31

BOTTOM
PIN I FUNCTION
N.C.
!
2
Vee (5 VI
COMMON
3'
4
N.C.
N.C.
5
6
DATA
7'
COMMON

8

N.C.

VIEW

• PINS 3 AND 7 !!UTT·
WELDED TO HEADER

Electrical/optical Characteristics -40°C to +85°C unless otherwise specified
Fiber sizes with core diameter $ 200
Parameter

/.Lm

and NA $ 0.4,4.75 $ Vee $ 5.25 V

Symbol

Typ,£21

Min.

Max.

Units

High Level Output
Current

IOH

5

250

/.LA

Vo ~ lBV
PI'!" -40 dBm

Low Level Output
Voltage

VOL

0.4

0.5

V

10' SmA
PR >-24 dBm

High Level Supply
Current

tecH

3.5

6.3

mA

Vee ~ 5.25 V
PR < ·40dBm

Low Level Supply
Current

leCl.

62

10

mA

Vee'" 5.25 V
PR" -24 dBm

Equivalent NA

NA

Optical Port Diameter

DR

tI

.50
400

Dynamic Characteristics
Parameter

Symbol

Peak input Power
Level Logic HIGH

PRH

Peak Input Power
Level Logic LOW

PRt..

/,m

Reference

Conditions

_.

Note 3

-40°C to +85°C untess otherwise specified; 4.75 $ Vee $ 5.25 V

Min,

Typ.£21

Max.
• -40

Units

Conditions

Notes

dBm

AP= 820 nm

Note 4

TA"" +25"C, VOL = 05 V

Note 4

0.1

/,W

-25.4

-11.2

d8m

2.9

76

/"W

-24.0

-h¥t

dBm

4.0
Propagation Delay
lOW to HIGH

tPlHR

65

Propagation Delay
HIGH to lOW

tPHI..R

49

/,W
nsec
nSec

IOL=8 rnA
-40 < TA '" 85°C, VOL
IOL=8 mA

= 0.5 V

= -21 d8m
Data Rate'" 5 MBd
BER = 10-9

TA = 25"C, PI'!

NoteS

Notes:
1. 2.0 mm from where leads enter case.
2. Typical data at T A = 25° C, Vee = 5.0V dc.
3. DR is the effective diameter of the detector image on the plane
of the fiber face. The numerical value is the product of the
actual detector diameter and the lens magnification.
4. Measured at the end of HFBR-3000 Fiber Optic Cable with
large area detector.

5. Propagation delay through the system is the result of several
sequentially-occurring phemonena. Consequently it is a combination of data-rate-limiting effects and of transmission-time
effects. Because of this, the data-rate limit of the system must
be described in terms of time differentials between delays
imposed on falling and rising edges.
As the cable length is increased. the propagation delays increase
at 5 ns per metre of length. Data rate. as limited by pulse width
distortion, is not affected by increasing cable length if the optical power level at the Receiver is maintained.

Electrical Description

Handling and Design
Information

The HFBR-2402 Receiver incorporates an integrated photo
IC containing a photodetector and dc amplifier driving an
open-collector Schottky output transistor. The HFBR-2402
is designed for direct interfacing to popular logic families.
The absence of an internal pull-up resistor allows the opencollector output to be used with logic families such as
CMOS requiring voltage excursions much higher than Vcc.
60th the open-collector "Data" output (Pin 6) and Vcc (Pin
2) are referenced to "Com" (Pin 3, 7). The "Data" output
allows busing. strobing and wired "OR" circuit configurations. The transmitter is designed to operate from a single
+5V supply. It is essential that a bypass capacitor (0.01 /.LF to
0.1 /.LF ceramic) be connected from Pin 2 (Vcc) to Pin 3
(circuit common) of the receiver.

4-32

When soldering, it is advisable to leave the protective cap
of the unit to keep the optics clean.
Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressed air often is sufficient to remove particles of
dirt; methanol or Freon on a cotton swab also works well.

-------- - - - - - - - - - -

25 MHz

,lOW COST

HFBR-2404

FIBER OPTIC
RECEIV6R

The HFBR-2404 Fiber Optic Receiver contains a discrete
PIN photodiode and a preamplifier IC. It is designed to
operate with the Hewlett-Packard HFBR-1402/1404 Fiber
Optic Transmitters and 100/140 jtm, 50/125 jtm, 62.5/125
jtm, 85/125 jtm and 200 jtm PCS fiber optic cable terminated with SMA connectors. Consistent coupling into the
receiver is assured by the lensed optical system (Figure 1).
Response does not vary with fiber size.
The receiver output is an analog signal that can be optimized for a variety of distance/data rate requirements.
Low-cost external components can be used to convert the
analog output to logic compatible signal levels for various

data formats and data rates up to 50 MBaud. This distance/data rate tradeoff results in increased optical power
budget at lower data rates which can be used for additional distance or splices.
The HFBR-2404 receiver is housed in a low cost dual-inline package that is made of high strength, heat resistant,
chemically resistant, and UL V..(J flame retardant plastic.
The optical port is color coded to distinguish transmitters
and receivers. EMI immunity is equivalent to the
HFBR-2204 metal packaged receiver.
The package is designed for auto-insertion and wave
soldering so it is ideal for high volume production
applications.

HFBR-2404 RECEIVER
HOUSING

HFBR-2404 RECEIVER

Absolute Maximum Ratings
Storage Temperature

Ts

Min.
-55

Operating Temperature

TA

-40

Parameter

Lead
$oldenng
Oycle

Symbol

I Temp.

I

Supply Voltage

I VSIGNAl
Vee

Reference

'C
"C

+260

'0

10

sec

"().5

1

V

..(),S

7.0

V

Time

Signal Pm Voltage

Un/l

M•••
+85
+65

Note 1

HEADER

EPOXY BACKFILL

Figure

1.

Mechanical Dimensions
I~O~1

OIA.

PIN NO, 1 INDICATOR

BOTTOM
3.4
(0.1351

+

_

!

f
So.S

4.8

(&.375)

--.i

L,~

f2.S '
'~1.27
1
....It
lQ.OWI

.

(0.1001

NOTe;

A~L

DIMENSIONS H'lM.LLIMeTRES AND (INCHES).

4-33

PIN
1
2
3"
4
5
S
7"

8

FUNCTION
N.C.
Vee (5 VI

VIEW

COMMON
N.C.
N.C.

DATA

COMMON
N.C.

• PINS 3 AIIID 1 BUTT.
WELDEO TO HEADER

Electrical/optical Characteristics

-40 0 C to +85 0 C;
Fiber sizes with core dia. S; 200 microns, and N.A. S; 0.4 unless otherwise specified.

4.75 S; Vee S; 5.25;

Symbol

Min.

Typ[S]

Max,

Unit

Conditions

Responsivitity

Rp

5,1

7

10.9

mV/p.W

TA = 25°C
at 820 nm

12.3

mV/p.W

RMS OutRut
Noise Vo lage

VNO

.36

mV

Parameter

4.6
.30

RLOAD = 511!l
Reference

-40 ST AS; +85 0 C
TA

25°C •

PR =OjJ.W

.43

mV

-40 S; T A :;85° C,

-12.6

dBm

TA = 25°C

55
-14

IlW
dBm

-40 S; T A S; 85° C

40

Il W

PR=OjJ.W

Input Power
PR

Output Impedance

Zo

20

DC Output Voltage

VOdC

,7

Power Supply Current

Icc

3.4

Equivalent NA

NA

.35

Equivalent Diameter

DR

,

Input Power

PN

Test Frequency
20 MHz

V

PR=OjJ.W

6.0

mA

-43.7_

-40,3

dBm

.042

.094

}lW

RLOAD

=
Note 3

'"
Note 4

}lm

250

Equivalent Optical Noise

l!

Note 2

Dynamic Characteristics
-40 0 C to +85 0 C;

4.75 S; Vee S; 5.25;

RLOAD

Symbol

Parameter
Rise/Fall Time,
10% to 90%

tr, tf

= 511 n,

Min,

CLOAD

= 13 pF

unless otherwise specified

Typ.[S]

Max,

Units

14

19.5

ns

TA
PR

26

ns

-40 S; T A S; 85° C

2

Conditions
25°C
10}lW Peak

Reference
Note 6

ns

PR" 40}lW Peak

Overshoot

4

%

TA =25°C

Note 7

Bandwidth

25

MHz

50

dB

at 2 MHz

NoteS

Pulse Width Distortion

Power Supply
Rejection
Ratio {Referred to
Output I

Iphl-t~lh

PSRR

Notes:
1. 2.0 mm from where leads enter case.
2. If PR > 40Jl.W, then pulse width distortion may increase. At Pin::: aOjlW
and TA = 85°C, some units have exhibited as much as 100 ns pulse width
distortion.
3. VOUT = VODC - IRp x PRi.
4. DR is the effective diameter of the detector image on the plane of the
fiber face. The numerical value is the product of the actual detector
diameter and the lens magnification,
5. Typicalspecifications are for operation at TA = 25°C and Vee = S,OV.
6. Input optical Signal is assumed to have 10% ~ 90% rise and fall times of
less than 6 ns.
7. Percent overshoot is defined as:
VPK - V100% x 100%
Vl00%
.'

8. Output referred P.S.R.R. IS defined as 20 log.

(VPOWER'SUPPLY RIPPLE)
VOUT RIPPLE

the signal amplitude from the HFBR-2404 Receiver is much
larger than from a simple PIN Photodiode, it is less susceptible to EMI, especially at high Signal rates.
The frequency response is typically dc to 25 MHz. Although
the HFBR-2404 is an analog receiver, it is easily made
compatible with digital systems (see 50 MBaud Logic Link
Design for more information).
It is essential that a bypass capacitor (0.01 IlF to 0.1 IlF
ceramic) be connected from Pin 6 (Vee) to Pin 3, 7 (circuit
common) of the receiver. Total lead length between both
ends of the capacitor and the pins should be less than 20 mm.

Handling and Design Information

Electrical Description
The HFBR-2404 Fiber Optic Receiver contains a PIN photodiode and low noisetransimpedance pre-amplifier hybrid
circuit with an inverting output (see note 3). The HFBR2404 receives an optical Signal and converts it to an analog
voltage. The output is a buffered emitter-follower. Because

When soldering, it is advisable to leave the protective cap
on the unit to keep the optics clean.
Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressd air often is sufficient to remove particles of dirt;
methanol or Freon on a cotton swab also works well.

4-34

---------------------

5 MBaud Logic Link Design

CABLE SELECTION

The H FBR-1402/1404 Transmitter and the H FBR-2402 Receiver
can be used to design fiber optic data link for distances to
2.5 Kilometers at rates up to 5 MBaud. The components are
compatible with standard SMA style connector and can
operate with 100/140 "m fiber cable (such as HFBR-3000/3100
series). or other fiber sizes such as 50/125 "m. 62.5/125 "m.
or 200 "m PCS. The HFBR-1402/1404 Transmitter contains
a high speed GaAIAs emitter operating at a wavelength of
820 nm. It is easily identified by the light grey color optical
port. The HFBR-2402 Receiver incorporates a photo IC
containing a photodetector and dc amplifier. An open co)lector Schottky transistor on the IC provides TTL/CMOS
compatible output. The receiver is also easily identified by
the dark grey color optical port.

System Design Considerations
The HFBR-1402/2402 Logic Link is guaranteed to work with
HFBR-3000 100/140"m fiber optic cable over the entire
range of 0 to 625 metres ai a data rate of dc to 5MBd. with
arbitrary data format and typically less than 25% pulse
width distortion. if the Transmitter is driven with IF = 30 mAo
R1 = 89n. If it is desired to economize on power or achieve
lower pulse distortion. then a lower drive current (IF) may
be used. The following example will illustrate the technique
for optimizing IF.
EXAMPLE: Maximum distance required = 400 metres. From
Figure 2 the worst case drive current = 20 mA. From the
Transmitter data VF = 2.33V (max.).
R1 =

Vee -VF
IF

5 -2.33V
20 mA

= 134n

The attenuation (dB/km) of the selected fiber. in conjunction with the amount of optical power coupled into it will
determine the achievable link length. The parameters that
will significantly affect the optical power coupled into the
fiber are as follows:
a. Fiber Core Diameter. As the core diameter is increased
the optical power coupled increases. leveling off at abou;
250 "m diameter.
b. Numerical Aperture (NA). as the NA is increased. the
optical power coupled increases. leveling off at an NA of
about 0.34.
c.lndex Profile (a). The index profile parameter of fibers
varies from 2 (fully graded index) to infinite (step index).
Some gains in coupled optical power can be achieved at
the expense of bandwidth. when 0' is increased.
In addition to the optical parameters. the environmental
performance of the selected fiber/cable must be evaluated.
Finally. the ease of installing connectors on the selected
fiber/cable must be considered.

SMA STYLE CONNECTORS

.The optical power margin between the typical and worst
case curves (Figure 2) at 400 metres is 6.6 dB. To calculate
the worst case pulse width distortion at 400 metres. see
Figure 5. The power into the Receiver is PRL + 6.6 dB =
-17.4 dBm. Therefore. the typical distortion is 40 ns or 20%
at 5 MBd.

Typical Circuit configuration

The link performance specifications on the above example
are based on using the HFBR-3000/HFBR-3100 cable/ connector assemblies. These cables contain glass-clad silica
fibers with a 100 "m core diameter and 140 "m cladding
diameter. This fiber type is now a user accepted standard
for local data communications links (RS-458. Class I. Type
B). The HFBR-1402/4 Transmitter and HFBR-2402 Receiver
can be used with HP's 100/140 "m fiber. or other fiber sizes
such as 50/125 "m. 62.5/125 "m. 85/125 "m. or 200 "m
PCS. Before selecting an alternate fiber type. several parameters need to be carefully evaluated.

The HFBR-1402/4 Transmitter with HFBR-2402 Receiver are
compatible with either the Type A or Type B SMA style fiber
optic connector (see Figure 7). The basic difference
between the two connectors is the plastic half-sleeve on the
stepped ferrule tip of the Type B connector. This step
provides the capability to use a full length plastic sleeve to
ensure good alignment of two connectors for an inline
splice. The HFBR-300/HFBR-3100. OPT 002 series
connectored cable utilizes the Type A connector system.

NOTE;
IT IS ESSENTIAL THAT A BYPASS CAPACITOR (O.Ol"F TO 0.1 "F
C.RAMICI BE CONNECTED FROM PIN 2 TO PIN 70F THE RECIEVEA.
TOTAL leAD LENGTH BETWEEN BOTH ENDS OF THE CAPACITOR
AND THE PINS SHOUL.D NOT EXCEED 20 mm.

'5V
I,

HFBR-1402l1404
TRANSMITTER
Vee

TRANSMISSION
DISTANCE - ~

.. HFBR-1000SERIESCABlE/CONNECTOR ASSEMBLY
OR OTHER FIBER SIZE CABLE/CONNECTOR ASSEMBLY - - - - - -

4-35

.

Recommended Operating Conditions
Parameter

Symbol

Min,

Max,

TA

-40

+8S

·C

60

mA

60

mA

+8S

·C
V

Units

Reference

TRANSMITTER
Ambient Temperature
Peak Forward Input Current

IF, PK==±

DC Forward Input Current

IFDC

RECEIVER

TA

Ambient Temperature

-40

Supply Voltage

Vee

5,25

Fan Oul I TTL,

N

5

C~BLE

Note 1, Fig.1

(see HFBR-3000/HFBR-3100 data sheet)

system Performance -40°C to +85°C unless otherwise specified
Parameter

Symbol

Min.

Typ.l2J

Optical Power Budget
w/50J12SI-'m Fiber

OPBSO

3

8,5

dB

• HFBR -1404 Transmitter
w/S0/125pm, NA" 0.20

Optical Power Budget
w/62.5/1251-'m Fiber

OPB62.$

8

13.8

dB

HFBR -1404 Transmitter
w/62.5/12Spm, NA = 0.28

Optical Power Budget
w/85!1251'm FIber

OPBss

4.5

11

dB

HFBR - 1402 Transmitter
w/85/125j,1m, NA'" 0.26

Optical Power Budget
wl1001140j,lm Fiber

OPB10Q

8

14.5

dB

HFBR ~ 1402 Transmitter
w/HFBR-3000 Cable

Optical Power Bu
w/200l'm PCS

OPB200

13

19

dB

HFBR -1402 Transmitter
w!200J,lm pes, NA'" 0.40

Data Rate
Synchronous
Asynchronous

Max,

Units

dc

5

MBaud

dc

2.5

MBaud

Propagation Delay
LOW to HIGH

tpLH

72

nsec

propagation Delay
HIGH to LOW

tpHL

46

osec

tpLH - tPHL

25

nsec

r--'
r--'

System Pulse Width
Distortion
Bit Error Rate

BER

Asynchronous data rate limit is based on these assumptions:
(a) NRZ data; (b) arbitrary timing - no duty factor restriction;
C) TTL threshold.
The EYE pattern describes the timing range within which
there is no uncertainty of the logic state. relative to a specific
threshold, due to either noise or intersymbol (prop. delay)
effects.

Reference

Note 3
Note 3, Fig. 5
TA =25 D C,
PR =-21 dBm

Fig. 4,5,6

j"" 1.5 metre

Data Rate :5 5 MBaud
PR > -24 dSm (4I'W)

10--9

Notes:
1.8 mA load (5 x 1.6 mAl, RL = 560f1.
2. Typical data at T = 25° C. Vee = 5.0V dc.
3. Synchronous data rate limit is based on these assumptions:
(a) 50% duty factor modulation. e.q. Manchester I or BiPhase
(Manchester II); (b) continous data; (C) PLL (Phase Lock
Loop) demodulation; (d) TTL threshold.

Condilfons

15a:

-2

~
I15a:

:l

a:
u

-3

:l

0

-4

;j'

!

-1

I-

a:



"'"a:

-4

«
~

-5

~

-6

a:

a:
a:

:::>

u

,!

~

:::;

«

"a:z
0

~

-7

~

-8

I-

-9

Z
«
a:

-"

~
I:;

~
"9

-10 ....

-----------~------

5

'i1

70

>

5

~

c
z
c
;:

«

"0:

~
"
a:

"

50

'i1
z

0

;:

a:
0
I;;

0,
5

\f>lH tTYPI@25
0

§

5

0

c

N

" fr~

20

E

......

30
25

-20 -19 -18 -17 -16 -15 -14 -13 -12

PA - RECEIVER POWER - dBm

PR - RECEIVER POWER - dB m

Figure 3. HFBR-1404/HFBR-2402 Link
Design Limits with 50/125 I'm
Cable

35

Z

-22 -21 -20 -19 -18 -17 -16 -15 -14 -13 -12

LINK LENGTH (kml

40

a:

I

5
0

45

0

5

0

--------.~----~

55
WHL 'TYP)'@,~5 C

Q

60

-_._-----

Figure 4. Propagation Delay through
System with One Metre of
Cable

Figure 5. Worst-Case Distortion of NRZ
EYE-pattern with Pseudo
Random Data at 5 Mb/s.
(see note 10).

PULSE REPETITION~'00ns--....j
FREa. '" 1 MHz

I

INPUT

------------ ----

Va

Figure 6. System Propagation Delay Test Circuit and Wave form Timing Definitions

SMA STYLE CONNECTORS
TYPE B
(Not Available from Hewlett-Packard)

TYPE A
(Used in HFBR-3000/3100. Option 002 Cable Assemblies).

3.14(.1235)
3.16 (.1245)

3.1S (.1253)

PLAs!Ji
SLEEVE

9.8 (.386)

Figure 7.

4-37

30/50 MBaud logic link Design
The HFBR-1402!1404 Transmitter and the HFBR-2404 Receiver
can be used to design fiber optic data link for distances to
2 kilometers at rates up to 50 MBaud. The components are
compatible with standard SMA style connector and can
operate with 100/140 I'm fiber cable (such as HP's HFBR3000/3100 series), or other fiber sizes such as 50/125 I'm,
62.5/125 I'm, 85/125 I'm, or 200 I'm PCS.
The HFBR-1402/1404 Transmitter contains a high speed
GaAIAs emitter operating at a wavelength of 820 nm. It is
easily identified by the light grey color optical port. The
HFBR-2404 Receiver contains a discrete PIN photodiode
and a preamplifier IC. It is also easily identified by the dark
grey color optical port.
Logic compatible signal levels are achieved by addition of
low-cost external components. For speed below 30 MBaud,
a simple circuit as shown in Figure 1 can be used (for detail
of that design, please see the product data sheet for the
HFBR-0221/2/3/4 Fiber Optic Transceivers).
For speed beyond 30 MBaud, recommended driver and
amplifier circuits are presented in Figure 2. Details of the
design are described in the 50 MBaud Transciever Board
section. These circuits provide TTL input and complementary TTL ouputs and are available as printed circuit board
assembly (the HFBR-0422 Transceiver Board) for evaluation purpose. Figure 4 gives the performance of the
HFBR-0422 at 50MBd characterized over O°C to 70°C.

BO = unfiltered 3dB bandwidth of the HFBR-2404 (25
MHz)
Rp = optical-to-electrical responsivity (mVlI'W) of
the HFBR-2404.
Note that noise adds in an rms fashion, and that the square
of the rms noise voltage of the HFBR-2404 is reduced by
the bandwidth ratio, B/Bo.
From the receiver data (Electrical/Optical Characteristics)
taking worst-case values, and applying NO bandwidth filtering (B/Bo = 1):
PNO

=

1(0.43)2+(0.03)21°·5 mV

=

0.0941'W or -40.3 dBm

4.6 mV/I'W
To ensure a bit error rate less than 10-9 requires the signal
power to be 12 times larger (+11 dB) than the rms noise as
referred to the Receiver input. The minimum Receiver input
power is then:
PRMIN = PNO + 11 dB = -29.3 dBm
With the application of a 5 MHz low-pass filter, the band
width ratio becomes:
B/BO = 5MHz/25MHz = 0.2
Note that 25 MHz should be used for the total noise bandwidth of the HFBR-2404. Inserting this value of the bandwidth ratio in the expressions for PNO and PRMIN above
yields the results:
PNO = 0.042 I'W or -43.8 dBm and PRMIN

= -32.8 dBm

Given the HFBR-1402 Transmitter optical power PT = -16
dBm at IF = 60 mA, and allowing a 3 dB margin, a minimum optical power budget of 13.8 dB is obtained:

System Design Considerations
OPTICAL POWER BUDGETING
The HFBR-2404 Fiber Optic Receivers when used with the
HFBR-1402/1404 Fiber Optic Transmitters can be operated
at a signalling rate of more than 50 MBd over a distance
greater than 2000 metres (assuming 6 dB/km cable attenuation). For shorter transmission distances, power consumption can be reduced by decreasing Transmitter drive
current. At a lower data rate, the transmission distance may
be increased by applying bandwidth-filtering at the output
of the HFBR-2404 Receiver; since noise is reduced as the
square root of the bandwidth, the sensitivity of the circuit is
proportionately improved provided these two conditions
are met:
a. input-referred noise of the follow-on circuit is well belOW
the filtered noise of the Receiver
b. logic comparator threshold is reduced in the same proportion as the noise reduction
As an example, consider a link with a maximum data rate
of 10 MBd (e.g., 5 Mb/s Manchester); this requires a 3 dB
bandwidth of only 5 MHz. Forthis example (See Figure 1) the
input-referred rms noise voltage of the follow-on circuit is
0.03 mY. The equivalent optical noise power of the complete
receiver (PNO) is given by:
PNO = l(VNO)2 (B/Bo) + (VNI)2jO.5 IRp
VNO = rms output noise voltage of the HFBR-2404
with no bandwidth filtering
VNI = input-referred rms noise voltage of the followcircuit
B = filtered 3 dB bandwidth
V = filtered 3 dB bandwidth

l-16 dBm -3dB-(-32.8 dBm)j

=

13.8 dB

USing 8 dB/km optical fiber, this translates into a minimum
link length of 1725 metres (typical link power budget for
this configuration is approximately 17.2 dB or 3130 metres
with 5.5 dB/km fiber).

BANDWIDTH
The bandwidth of the HFBR-2404 is typically 25 MHz. Over
the entire temperature range of -40° C to +85° C, the rise
and fall times vary in an approximately linear fashion with
temperature. Under worst case conditions, tr and tf may
reach a maximum of 26 ns, which translates to a 3 dB
bandwidth of:
f3dB '"

350
tr

=

350
26 ns

= 13.5 MHz

The receiver response is essentially that of a single-pole
system, rolling off at 6 dB/octave. In order for the receiver
to operate up to 50 MBd even though its worst case 3 dB
bandwidth is 13.5 MHz, the received optical power must be
increased by 3 dB to compensate for the restricted receiver
transmission bandwidth.

PRINTED CIRCUIT BOARD LAYOUT
When operating at data rates above 10 MBd, standard PC
board precautions should be taken. Lead lengths greater
than 20 mm should be avoided whenever possible and a
ground plane should be used. Although transmission line
techniques are not required, wire wrap and plug boards are
not recommended.

4-38

30 MBaud Transceiver Circuit

Th receiver circuit uses the HFBR-2404 fiber optic receiver.
followed by an LM-733 video amplifier and an LM-360 highspeed comparator. The resistors RB. R9. R10. R11 provide
200mV of hysteresis. The gain of the post amplifier LM-733
is adjusted by resistor R7 to provide a minimum of 400mV
output. which corresponds to the minimum receiver optical
power input.

Figure 1 shows the circuit diagram for a 30 MBaud link
designed for 50% duty cycle operation. The transmitter circuit uses 1/275451 positive AND driver operating operating
in conjunction with an HFBR-1402 fiber optic transmitter.
The transmitter drive current is determined by R2 and R3.
CR1. R3 and C3 are used to speed up the edges of the
optical waveform.

For additional application information. see the product data
sheet for the HFBR-0221/2/3/4 Fiber Optic Transceivers
product.

+5V~J_~2--~~--~-------I
43"
2,6,7

DATAIN~J_71--+-------------------------------~--~+L__'
lk"

GND)J~_3~~------------------~----------~~-----------t-----+--~

-5.2 v )J'--4+~------------.......----.,....--~---J")2.")7·"~H".'---'
CG

C7

O.1,u~.7,uF

57"

c,. 1"Fr-~_..,
R13 ell

DATAOUT~J_~5~--------~

on
DATA OUT )J,--6+-----------1
R,
402n

Rl1
14.7kQ

Rs
lkn
1 kn

R6

c"

O.l,uF
Rg
lkn

Rs
1 kn

Figure 1. 30 MBaud Transceiver Circuit

4-39

O.l/lF 1&3
Rx

SOMBd
TransCeiver
Evaluation
Board

HFBR-0422

Recommended Operating
Conditions

Absolute Maximum Ratings
Parameter

Symbol.

Storage
Temperature)1)

Min.

Max,

Units

-0.5

5.25

V

Parameter

Applied Voltage
Data. i5iitii
+Vee. Data In
Ts

85

-55

Symbol

Min.

Max.

Units

+Vec

4.75

5.25

V

OperatinglSJ
Temperature

TA

0

70

°C

Duty factor

Df

33

67

0.05

50

Supply Voltage

"C

Data Rate Range

I

%
MBd

Electrical/Optical Characteristics

DoC to 70°C unless otherwise specified
(Recommended operating conditions for transceiver for 50 MBd apply. unless otherwise specified)
Parameter

Symbol

Optical Power Budget
OPB
Pulse Distort.ion
Data Output Response Time(2)

Conditions

Min.

Typ.

When used with HFBR·3000
Fiber Cable/Connectors.
Data Rate'" 50 MBd
BER = 10-9

12.0

18

Supply Current
Transmitter Outp-tlt
Optical Power{'9
into HFBR-SOOO Fiber Cablel
Connector Assembly

Units

dB

tPLH - tPHL

7

tr

3
2

ns

tPLH.
tPHl

40

os

Icc

210

mA

dBm

tf
Transceiver
Propagation Delay[3]

Ma)(.

PTAV

50% Data

-18.8

-16

PRAY

50% Data
Data Rate"" 50 MBd

-30.8

-34

Receiver Optical Input Power

TTL Gate Fanout

12.5

-14

os

dBm

4

WARNING: OBSERVING THE TRANSMITTER OUTPUT
POWER UNDER MAGNIFICATION MAY CAUSE INJURY
TO THE EYE. When viewed with the unaided eye. the
infrared output is radiologically safe: however. when viewed
under magnification. precaution should be taken to avoid
exceeding the limits recommended in ANSI Z136.1-1981.
Notes:
1. Operating temperature of HFBR-3000 Fiber Cable/Connector is
-20°C to +lO°C.
2. Data Output Response Time is the 10% to 90% electrical rise
and fall time on PIN 6 (DATA) and PIN 5 (DATA).

3. Transceiver propagation delay is measured by looping the trans-

mitter back on the receiver with one metre of fiber cable.
Transceiver propagation delay is the time interval between a
signal applied to the DATA IN pad and the signal received at the
DATA OUT pad.
4. Measured at the end of one metre of HFBR-3000 Fiber Optic
Connector/Cable Assembly with a large area detector and cladding modes stripped INA = 0.28) This represents a standard test
fiber.
5. Typical specifications are at 25°C and Vee = 5 V.
6. Operating temperature limited by support circuil.

4-40

~~~~~~~~

---~-~-~-

-13

-30

-30

/

E

!iJI

-14

~I

E

!g

ffi

~

-15

I-

-1.

"

-17

:="
0
I

f

..... r-"

~

-3 2

I

...-

r::

;;
i=

;;;

-34

~

f-

--

i,...-- ~

V

.....

i=

iii -34

~

I--

ffi

> -36
W

illa:

6

I

}

-1.

-19
-20-10

0

10

20

30

40

T- TEMP-

50 60

70

•o

-3

BO 90

10

20

30

"c

Figure 4. HFBR-0422 Transceiver Power
vs. Temperature at 50MB

-32

r::
;;

40

50

60

70

80

90

-38

-40

~
20

+y
~~

L

/'

30

T- TEMP- C

L

",

40

50

60

70 -,

DATA RATE - M BAUD

Figure 5. HFBR-0422 Receiver Sensitivity

Figure 6. HFBR-0422 Receiver
Sensitivity vs. Bit Rate
at 10-9) BER)

Test set-up
Equipment Needed

Procedure

1. Dual power supply (HP 623613)

1. Connect fiber cable and edge card connector to the
transceiver board.

2. 100 MHz oscilloscope (HP 1725A)
3. Active oscilloscope probe and probe tip (HP 1120AI
1122A)
4. 10:1 divider for oscilloscope probe (HP 10241A)

2. Adjust the power supply to +5V. Then connect to the
transceiver board as shown below. Take care not to
exceed the recommended operating voltage.
3. Adjust the pulse generator for TTL level square wave
(+3 V) with 5 nsec, edge transition time and then connect to the transceiver board.

5. 50 MHz pulse generator (HP 8082A)
6. Miscellaneous cables and connectors

4. Use the oscilloscope with the active probe and 10:1
divider to observe the input and output waveforms.

PU!.SE GENERATOR
OUTPUT

0'U'i'P'UT
EDGE CARD

CONNoCTOR
OATAIN

.,;V
OND

+Svt----POWER SUPPLY

GND~--------~

NC
BmOUT
DATA OUT

OSCiLLOSCOPo

~

RECEIVER

HFBR-0922
TRANSCEIVER

Figure 7.
Notes:
1. The data out observed through the active probe exhibits overshoot at the rising edge. This overshoot will disappear if the output is
loaded to drive a TTL input.
2. Oscilloscope inputs should be terminated into 50 ohms.
3. The active probe should be set on DC for observation of lower data rates. The offset on the active probe should be off.
4. The active probe is used to avoid reflection in the observed signal through impedance matching.
5. If necessary clean the optical port of the fiber connectors with Acetone before connecting them to the transceivers.

4-41

Vee

Vee

Vee

Vee

Vee

V••

J;:0.1"F

I

100{l

180{l

1620

270{l

261n

TTL

-=

1K{l

IN

r

820{l

-=

-=

220U
O.1"F

-=

100{l

V••

V••
1.22V
LM113-1

2.7"H
+5V

Vee

4.7 "F

l I

0.1 "F

J

-=

-=

4.7 "F

v••
Transmitter Circuit

Vee

Vee

0.1
"FI

510{l

::

ECL

ea:
5100

-=
V••

-=

V••

':'

1k!l
ECL -"VIIV--t"-"'"

+5V

':'

>'----- DATA

1k!l

, - - -.......- - 0 Vee

I

O.1• F

>2=--_-_ _ DATA

Receiver Circuit
Figure 2. 50 MBaud Transceiver Circuit

4-42

--------_._-----

50 MBaud Transceiver Circuit
Figure 3 shows the circuit diagram for a SO MBaud link (the
HFBR-0422 Transceiver Board). The transmitter side utilizes
a 10116 ECl line receiver as an amplifier with hysteresis
driving a differential transistor pair. 01 and 02. The HFBR1042 lED is switched on and off by the pair with current
source 03 controlling the lED forward current. The shunt
switch arrangement demands equal amount of supply
currents while switching the HFBR-1402 lED. thus minimizing supply noise generated. 'The input resistor network
(1800/2700/8100) can be deleted for ECl applications and
-S.2V substituted for +SV operation.
The receiver circuit cascades two 10116 stages to form a
post amplifier. The output of the HFBR-2404 is amplified
and fed to the 10116 third stage amplifier with hysteresis.
The 820 and 220 resistors provide about 7SmV of hysteresis.The setting of the hysteresis affects the overall sensitivity
of the receiver. Excessively high hysteresis translates to
"wasted" input optical power. low hystereSiS threshold
allows noise in the circuit to randomly switch the output
logic state when there is no light input. The hysteresis in

the circuit is set on the low side to maximize receiver sensitivity. I ncreasing the 220 resistances will raise the hysteresis.
The 10H3S0 is an ECl to TTL converter. It can be eliminated for ECl applications and --5.2V substitued for +SV
operation. Throughout the receiver circuit. proper power
supply filtering is critical in order to achieve ultimate performance. The 10116 ECl line receiver used in the +SV and
ground configuration is especially susceptable to noise on
the +SV line.
Figure 3 gives the link configuration and the performance
of the HFBR-0422 Transceiver Board and is specified on
the next page. Figure 4 shows the transmitter output
power versus temperature, Figure S shows the receiver
sensitivity versus temperature. and Figure 6 gives the
receiver sensitivity for different data rates. The test set-up
for the transceiver board is shown in Figure 7. and Figure 8
gives the mechanical dimensions of the board. Component
list and the circuit board layout for the SO MBd Transceiver
Board are shown in Figure 9 and Figure 10 respectively.

LINK CONFIGURATION

HF8fl:-1402

HFBR-2404

"'OATAOUT

DATA I N "

"'OATAIN

DATA OUT'"

<5V

.I

I.
Figure 3. 50 MBaud TTL Duplex Link

4-43

+5V

Mechanical Dimensions

r-:::::.::--=l
:l1~4.76(02)

~______-:-!+r-_
79413.13)

IT ~-

L38.1I15,J

-

DIMENSIONS ARE IN MILLIMETRES (INCHES!

I

736(29)

MOUNTING HOLE

70.012.75)

.,n,

r-6.35 (025)

AMPHENOL 225- 20621-~

~=u~~~~~29(012)
6 CONTACTS 4.0 10.16) SPACING

PERPENDICULAR

AMPHENOL 225-20621-103
NOT INCLUDED WITH HFBR-0422

Figure 8.

components List
Resistors
R1
R2

Part Description
Resistor 51.1 Ohm; 1%; lIBW
Resistor 0 Ohm; Jumper Wire
R3,4,7,B,17,1B,22,23 Resistor 1K Ohm; 1%; lIBW
R5,6,9,10,15,16,24,25 Resistor 510 Ohm; 5%; 1/BW
R11, 12, 2B, 29
Resistor 220 Ohm; 5%; 1/BW
R13,14,21
Resistor B20 Ohm; 5%; 1/BW
R19
Resistor 1BO Ohm; 5%; 1/BW
R20
Resistor 270 Ohm; 5%; 1/BW
R26,27
Resistor 100 Ohm; 5%; 1/BW
R30,35
Resistor 162 Ohm; 1%; lIBW
R31,26
Resistor 261 Ohm; 1%; lIBW
R32
Resistor 560 Ohm; 5%; 1/BW
Resistor 2B.7 Ohm; 1%; 1/BW
R33
Resistor 10.5 Ohm; 1%; 1/BW
R34
Capacitor
C1, 3, 5, 7 9,10,14,
16-19
C24-2B,31,32,34,36
C4
C6, B, 20
C11, 12,29,33
C2, 13, 15, 35, 37
C30

Inductor

L1,2
L3

Part Description
Inductor 2.7/lH
Inductor 4.7 /lH

Diode
CR1-6
CR7

Part Description
Diode 1N5711
Diode LM113-1

Transistor
Q1-3

Part Description
Transistor 2N5943

Integrated Circuit
U1
U2,4
U3
U5

Part Description
IC HFBR-2404
IC 10116
IC 10H350
IC HFBR-1402

Part Description

Capacitor 0.1/lf; 20%; 50V; ceramic
Capacitor 0.1I'f; 20%; 50V; ceramic
Capacitor 25pf; 5%; 200V; ceramic
Capacitor .01/lf; 20%; 100V ceramic
Capacitor 1Bpf; 5%; 200V; ceramic
Capacitor 4.7/lf; 20%; 35V; tantalum
Capacitor 47/lf; 20%; BV; tantalum
Figure 9.

4-44

PRINTED CIRCUIT BOARD LAYOUT
COMPONENT SIDE

CIRCUIT sloe

C37

DATA IN
+5V

DATA OUT
DATA OUT
NC

GND - - - .
t board layout,
th printed circul
.
ore information
on
e
nt sales representative.
For
m
HP
com
pone
please contact your

Figure 10.

4-45

Flid8

MINIATURE
FIBER OPTIC
LOGIC LINK

HEWLETT

a:~ PACKARD

HFBR-0200
HFBR-120112
HFBR-2201/2
HFBR-420112

TECHNICAL DATA

JANUARY 1986

Features
• DC TO 5 MBAUD DATA RATE
• MAXIMUM LINK LENGTH
625 Metres (Guaranteed)
1600 Metres (Typical)
• TTL/CMOS COMPATIBLE OUTPUT
• MINIATURE, RUGGED METAL PACKAGE
• SINGLE +5V RECEIVER POWER SUPPLY
• INTERNALLY SHIELDED RECEIVER FOR
EMI/RFI IMMUNITY
• PCB AND PANEL MOUNTABLE
• LOW POWER CONSUMPTION

Applications
• EMC REGULATED SYSTEMS (FCC, VDE)
• EXPLOSION PROOF SYSTEMS IN OIL
INDUSTRY/CHEMICAL PROCESS
CONTROL INDUSTRY
• SECURE DATA COMMUNICATIONS
• WEIGHT SENSITIVE SYSTEMS
(e.g. Avionics, Mobile Stations)
• HIGH VOLTAGE ISOLATION IN POWER
GENERATION

efficiency is assured by factory alignment of the LED with
the optical axis of the package. Power coupled into the fiber
varies less than 4 dB from part to part at agiven temperature and drive current The benefit of this is reduced dynamic
range requirements on the receiver.
The HFBR-2201/2 Receiver incorporates a photo IC containing a photodetector and dc amplifier. An open collector
Schottky transistor on the IC provides logic compatibility.
The combination of an internal EMI shield, the metal package and an isolated case ground provides excellent
immunity to EMI/RFI. For unusually severe EMI/ESD environments, a snap-on metal shield is available. The receiver is
easily identified by the black epoxy backfill.

Description
The HFBR-1201/2 Transmitter and HFBR-2201/2 Receiver
are HFBR-4000/SMA style connector compatible fiber
optic link components. Distances to 1600 metres at data
rates up to 5 MBaud are achievable with these components and the HFBR-3000/3100 series fiber optic cable
assemblies.
A complete evaluation kit is available (HFBR-020Q) containing an HFBR-1201 transmitter, HFBR-2201 receiver,
HFBR-4201 mounting hardware, 10m of HFBR-3000 option
001 cable/connector assembly and technical literature.

The HFBR-1201 Transmitter and the HFBR-2201 Receiver
are compatible with the HFBR-4000 Connector and HFBR3000 series, Option 001 connectored cable. The HFBR-1202
Transmitter and HFBR-2202 Receiver are compatible with
SMA style connectors, types A and B (see Figure 12), and
HFBR-3000 series, Option 002 connectored cable. HFBR3000 series cable can be ordered with or without connectors.
The HFBR-0100 connector assembly kit is available if field
installation of HFBR-4000 connectors is desired.

The HFBR-1201/2 Transmitter contains a high efficiency
GaAIAs emitter operating at 820 nm. Consistent coupling

Mechanical Dimensions
HFBR.1202 TRANSMITTER

HFBR-1201 TRA\lISMITTER
PIN
1

PIN
1

FUNCTION
ANODE
CATHODE

FUNCTION
ANODE
CATHODE
CASE

CASE

6.,"
PIN
1

QU

FUNCTION
CASE

Vee
DATA

OIMfiNSIONS IN MILLIMETRES (INCHES)
UNLESS OTIiERWISE SPEGWIEO, THE TOLERANCES ARE,
X ± ,51 rnrn LXX

1;;

.02 INl

,XX ~ .13 mm LXxX

"I;

.005 IN}

4-46

FUNCTION
CASE
Vee
DATA
COMMON

L-"li~ti

COMMON

HFBR-2201 RECEIVER

PIN
1

HFBR·2202 RECEIVER

---------------------

system Design Considerations
The Miniature Fiber Optic Logic Link is guaranteed to work
over the entire range of 0 to 625 metres at a data rate of dc
-5 MBd, with arbitrary data format and typically less than
25% pulse width distortion, if the Transmitter is driven with IF
= 40 mA, Rl = 820. If it is desired to economize on power or
achieve lower pulse distortion, then a lower drive current (IF)
may be used. The following example will illustrate the technique for optimizing IF.
EXAMPLE: Maximum distance required = 250 metres.
From Figure 2 the worst case drive current = 20 mAo From
the Transmitter data - VF = 1.8V (max.).
Rl = Vee - VF
IF
The optical power margin between the typical and worst
case curves (Figure 2) at 250 metres is 4 dB. To calculate the
worst case pulse width distortion at 250 metres, see Figure 8.
The power into the Receiver is PRL + 4 dB = -20 dBm.
Therefore, the typical distortion is 40 ns or 20% at 5 MBd.

will significantly affect the optical power coupled into the
fiber are as follows:
a. Fiber Core Diameter. As the core diameter is increased,
the optical power coupled increases, leveling off at about
250 I'm diameter.
b. Numerical Aperture (NA). As the NA is increased, the
optical power coupled increases, leveling off at an NA of
about 0.34.
C. Index Profile (0'). The Index profile parameter of fibers
varies from 2 (fully graded index) to infinite (step index).
Some gains in coupled optical power can be achieved at
the expense of bandwidth, when 0' is increased.
In addition to the optical parameters, the environmental
performance of the selected fiber/cable must be evaluated.
Finally, the ease of installing connectors on the selected
fiber/cable must be considered. Given the large number of
parameters that must be evaluated when using a nonstandard fiber, it is recommended that the 100/140 ILm fiber
be used unless unusual circumstances warrant the use of an
alternate fiber/cable type.

CABLE SELECTION
The link performance specifications on the following page
are based on using the HFBR-3000/HFBR-3100 cable/connector assemblies. These cables contain glass-clad silica
fibers with a 100 ILm core diameter and 140 ILm cladding
diameter. This fiber type is now a user accepted standard for
local data communications links (RS-458, Class I, Type B).
The HFBR-1201/2 Transmitter and HFBR-2201/2 Receiver
are optimized for use with the 100/140 ILm fiber. There is,
however, no fundamental restriction against using other
fiber types. Before selecting an alternate fiber type, several
parameters need to be carefully evaluated.
The attenuation (dB/kml of the selected fiber, in conjunction with the amount of optical power coupled into it will
determine the achievable link length. The parameters that

SMA STYLE CONNECTORS
The HFBR-1202/2202 is compatible with either the Type Aor
Type B SMA style fiber optic conector (see Figure 121. The
basic difference between the two connectors is the plastic
half-sleeve on the stepped ferrule tip of the Type B connector. This step provides the capability to use a full length
plastic sleeve to ensure good alignment of two connectors
for an inline splice. TheHFBR-3000/HFBR-3100, OPT 002
series connectored cable utilizes the Type A connector system because of the inherent environmental advantages of
metal-to-metal interfaces.
The HFBR-1201/2201 is compatible with HFBR-4000 connectors and HFBR-3000/HFBR-3000 Option 001 series
connectored cable

Typical Circuit Configuration
NOTE,
IT IS ESSENTIAL THAT A BYPASS CAPACITOR (0.01 Mf.o 0.1 pF
CERAMIC) aE CONNECTEO FROM PIN Z TO PIN 4 OF THE RECEIVER.
TOTAL lEAD LENGTH BETWEEN BOTH ENOS OF THE CAPACfTOR
AND TltE PINS SltOULO NOT EXCEED ZO

"'n>.

SElECT R, TO SIfT If

HFBR-1201/2

+5V
IF

TRANSMITTER

TRANSMISSION
DISTANCE

1---- BfBR-3000 SERIES CABLE/CONNECTOR ASSEMBLY - - - - I
Figure 1.

4-47
~---------

~-------

-

----

Recommended operating Conditions
Parameter

Symbol

Min.

Max.

TA

-40

Onlls

Reference

TRANSMITTER
+85

·C

Peak Forward Input Current

(F.PK

40

mA

Note 7

Average Forward Input Current

(FAV

40

mA

Note 7

Ambient Temperature

RECEIVER
TA

-40

+85

°C

Supply Voltage

Vee

. 4.75

5,25

V

Fan Out {TTL I

N

Ambient Temperature

Note 3, Fig. 1

5

CABLE (see HFBR-3oo0/HFBR-31oo data sheet)

system Performance -wc to +85°C unless otherwise specified
Parameter

Symbol

Min.t1J

Typ.

Q

625

1600

Transmission Distance
Data Rate
Synchronous
Asynchronous

Max.

Units

Reference

Conditions

Fig. 2, Note 9

Metres

dc

5

M8aud

Note 10

de

2.5

M8aud

Note 10, Fig. 8

Propagation Delay
LOW to HIGH

tPLH

82

nsee

Propagation Delay
HIGH to LOW

tPHL·

55

nseC

TA "" 25°C,
PR '" ·21 d8m
IF, pk'" 15 mA

to

27

nsec

£ -= 1 metre

System Pulse Width
Distortion
8it Error Rate

10-9

BER

Fig, 7,8,9

Data Rate $5 MBaud
PR > ·2~ d8m (4/tWI

NOMOGRAPH
dBm - JlW CONVERSION
-10

-12

~
I

40
35

r-

12

TYPICY

WORST CAS,"!
-40'C,+ll5'C

30

25'C

I

/

/

/

!

10
400

/

/

/
V

-,

-16

20

-2

-18

/

-3

-4

-5

800

-14

100
90
80
70
60
50
45
40
35
30
25

dBm -20
-22

15
10
9

JlW

8
7

-24

-26
1200

1600

- LINK (CABLE) LENGTH - m

-28

1.5

-30

Figure 2. System Performance: HFBR·1201/2/HFBR-2201/2 with HFBR-3000/3100 Cable Assembly

4-48

-

HFBR-1201/1202 TRANSMITTER

HFBR-1201/1202 TRANSMITTER

Absolute Maximum Ratings
Symbol

Min.

Max.

Unit

Storage Temperature

Ts

-55

+85

°C

Operating Temperature

TA

-40

Parameter

Lead
Soldering
Cycle
Forward
Input
Current

Temp.

+85

°C

+260

°C

10

sec

40

mA

Time
Peak
Average

Reverse Input Voltage

IF. PK
IF. AV

40

mA

VA

2.5

V

Forward Voltage
Forward Voltage
Temperature Coefficient

1~"tXxX.r\

*::::

:
:

CASE 2.
2
I
CATHODE
~)

Note 13
Note 2

rL

r;T~l

I:
;::tY:!/)

I~

Note 7

Lf'

Electrical/Optical Characteristics
Parameter

ANODE

Reference

.A

.A

-40° C to +85° C unless otherwise specified

Typ,£11

Max.

Units

Conditions

VF

1.5

1.8

V

IF = 40 mA

Figure 5

j,VF/;.'..T

-0.91

mV/oC

IF = 40 mA

Figure 5

4.0

V

IA -100 IJ.A

Symbol

Min.

2.5

Reference

Reverse Breakdown
Voltage

VBA

Numerical Aperture

NA

.34

Optical Port Diameter

DT

250

IJ.m

Note 11

Peak Emission
Wavelength

i\p

820

nm

Figure 6

Output Optical Power
Coupled into HFBR-3000
Fiber Cable/Connector
Assembly, 100/140 IJ.m

PT

-17

-16

-13

dBm

IF=40 mA

Figure 3

20

25

50

IJ.W

TA = 25°C

Notes 4, 15

-12.3

dBm

IF=40 rnA

IJ.W

-40°C < TA < 85°C

-18
15.8

Output Optical Power
Coupled into 50/125 IJ.m
Fiber
Output Optical Power
Coupled into Siecor
100/140 IJ.m Fiber Cable or
Equivalent
Optical Power
Temperature CoeffiCient

PI

PT

;.'..PT/,H

59
-24

dBm

IF=40mA

Figure 3

4

IJ.W

TA= 25°C

Notes 14,15

-18

dBm

IF=40 rnA

Figure 3

TA = 25°C

Notes 15, 16

dS/oC

-.017

Figure 4

Dynamic Characteristics -40°C to +85°C unless otherwise specified
Parameter
Propagation Delay
LOW to HIGH

Symbol
tPLH

Min.

Typ.l11

Max.

17

Units

Conditions

Reference

nsec

IFPK=10mA

NoteS
Figure 7

nsec

Propagation Delay
6
tPHL
HIGH to LOW
Notes:
1. Typical data at TA ~ 25°C, Vee ~ 5.0V dc.
2. 2.0 mm from where leads enter case.
3. 8 rnA load 15 x 1.6 mAl. AL ~ 560n.
4. Measured atthe end of 1.0 metre HFBA-3000 Fiber Optic Cable with large

5.

Measured at the end of HFBR-3000 Fiber Optic Cable with large area

detector.

6.

When changing microwatts to dBm, the optical flux is referenced to one

milliwatt {1000 ~WI.
PI~WI
Optical Flux. P {dBm) ~ 10 log 1000 ~w
7. IFPK should not be less than 10 rnA in the "ON" state. This is to avoid

area detector and cladding modes stripped, terminated with the appropriate type of connector. This assembly approximates a Standard Test
Fiber. The fiber NA is 0.28, measured at the end of greater than 300 metres
le.ngth of fil;>er, the NA being defined as the sine of the half angle determined by the 10% intensity points:

the long turn-on time that occurs at low input current. IFAV may be
arbitrarily low, as there is no duty factor restriction.

viewed under magnification, precaution should betaken to
avoid exceeding the limits recommended in
ANSI ZI36.1-1981.

WARNING: OBSERVING THE TRANSMITTER OUTPUT
POWER UNDER MAGNIFICATION MAY CAUSE INJURY
TO THE EYE. When viewed with the unaided eye, the
infrared output is radiologically safe; however, when

4-49

HFBR-2201/2202 RECEIVER

HFBR-2201/2;!02 RECEIVER

Absolute Maximum Ratings
Symbol

Min.

Max.

Storage Temperature

Parameter

Ts

-55

+85

°C

Operating Temperature

TA

-40

+85

°C

+260

°C

Lead
Soldering
Cycle

Temp.
Time

Supply Voltage

Vee

Output Current

10

Output Voltage

Vo

Output Collector
Power Dissipation

Units Reference

10

sec

-0.5

+7.0

V

25

rnA

-0.5

+18.0

V

40

mW

PO.AV

DATA
CASE
L-----+~COMMON

Note 2

Electrical/Optical Characteristics
Parameter

Symbol

Min.

Typ.l11

r-----+-=-Vcc

-40° C to +85° C and 4.75 :s Vec :s 5.25 V
unless otherwise specified
Conditions

Max.

Units

High Level Output
Current

10H

5

250

pA

Vo= 18V
PR < -40 dBm

Low Level Output
Voltage

VOL

0.4

0.5

V

10"'8 mA
PR >-24dBm

High Level Supply
Current

lecH

3.5

6.3

rnA

Vec = 5.25 V
PR < -40 dBm

Low level Supply
Current

feCl

6.2

10

mA

Vee 5.25 V
PR> -24 dBm

Optical Port Diameter

DR

700

Numerical Aperture

NA

.32

Reference

Note 12

",m

Dynamic Characteristics -40°C to +85°C and 4.75:S Vec:S 5.25 V unless otherwise specified.
Parameter

Symbol

Input Power Level
Logic HIGH

PRH

Input Power Level
Logic LOW

PRL

Propagation Delay
LOW to HIGH
Propagation Delay
HIGH to LOW

Min.

Typ.ll! Max.

Units

Conditions

-40

dBm

;\p

0.1

",W

-25.4

-11.2

dSm

2.9

76

pW

-24

-12.0

dBm

4.0

63

pW

tPLHR

65

nsee

tPHLR

49

nsee

Notes:
8. Propagation delay through the system is the result of several
sequentially~occurring phenomena. Consequently it is a combination of
data-rate-limiting effects and of transmission-time effects. Because of
this, the data-rate limit of the system must be described in terms of time
differentials b.etween delays imposed on falling and riSing edges.
As the cable leng·th is increased, the propagation delays increase at 5 ns
per nietre of length increase. Data rate, ·as limited by pulse width distortion, is not affected by increasing cable length;f the optical power level
at the Receiver is maintained.
9. Worst case system performance is based on worst case performance of
individual components: transmitter at +85 0 C, receiver at _40 0 C and cable
at- 20°C.
10. Synchronous data rate limit is based on these assumptions: (a) 50%
duty factor modulation, e.g. Manchester I or BiPhase I Manchester III;
(b) continuous data; (CI PLL (Phase Lock Loopi demodulation; Id) TTL
threshold.
Asynchronous data rate limit is based on these assumptions: la) NRZ
data; (b I arbitrary liming - no duty factor restriction; ICI TTL threshold.
The EYE pattern describes the timing range within which there is no
uncertainty of the logic state, relative to a specific threshold, due to
either noise or intersymbol (prop. delay) effects.

Reference

= 820 nm

Note 5

TA= +25°C

Fig. 4.
Note 5

-40 < TA < 85°C
TA '" 25°C, PR

=-21 dBm

Note 8,
Fig. 7

11. Dr IS measured at the plane of the fIber face and defines a diameter where
the optical power density is within 10 dB of its maximum.
12. DR is the effective diameter of the detector image on the plane of the fiber
face. The numerical value is the product of the actual detector diameter
and the lens magnification.
13. HFBR-3000 series. Fiber Cable is specified at a narrower temperature
range, -20° C to 85° C.
14. Measured at the end of 1.0 metre 50/125 j.trn fiber with large area delector
and cladding modes stripped, approximating a Standard Test Fiber. The
fiber NA is 0.21, measured at the end of a 2.0 metre length. the NA being
defined as the sine of the half angle determined by the 5% of peak intensity
points. Measured by the method of Note 4, the corresponding NA is 0.185.
15. Output Optical Power into connectored fiber cable other than HFBR-3000
Fiber Optic Cable/Connector Assemblies may be different than specified
because of mechanical tolerances of the connector, quality of the fiber
surface, and other variables.
16. Measured at the end of 1.0 metre Siecor 100/140 Mm fiber cable or
equivalent, with large area detector and cladding modes stripped, terminated with the appropriate type of connector. This assembly approximates a Standard Test Fiber. The fiber NA is 0.275, measured at the
end of a 2.0 metre length. the NA being defined as the sine of the half angle
determined bythe5% of peak intensity pOints. Measured by the method of
Note 4, the corresponding NA value is 0.232.

4-50

---------~~-------.--.-----.

'"

~

I

o

~

a:

ffi

~w

>

1
-2

-3
-4

~

-6

I

-7

;;

-8

a:

-5

E
o

-9

Q.

-10

~

/

/

V

/

/

/

V

25

?iI

~

I
0

~

a:
a:

12.5 ~


;::

w

~
a:

>

40

-.8

I:!S-C)

"
E
I

>~
a:
a:
0

a:

'CTI2T I
j

I

-20

I

+20

f\
I.
+60

"~

10

~

1-

J

.L
+40

20

a

~

r--.....
-TRANSMITTER QUTPUT ./' f\.

-40

IF - FORWARD CURRENT - rnA

Figure 3. Normalized Transmitter Output
vs. Forward Current

40

I

RECEIVER rHR~$HOLD
PR (TIIP.

-.4

-1.2

i

I

""'" ~ ~

1i
~

I

+.4

~

>-

-'

5

'"

~

a:

7.9 ~

20

~~

w

3.1

10

I

+.8

a:

+80 +100
VF - FORWARD VOLTAGE -VOLTS

T A - AMBIENT TEMPERATURE -'C

Figure 4. Normalized Thermal Effects In
Transmitter Output, Receiver Threshold,
and Link Performance (Relative
Threshold)

Figure 5. Forward Voltage and Current
Characteristics for the Transmitter LED.

I ! .85:C\
I

80
c
I

>

MAX.'
TO

{tPiH

~

60

"
2

"
""
;t

~
0
in

I

i;!

.."

0

40

.:;::.;- ;;.-""....
~ ....

Q
2
I

f}

t

...

-30":~
..... :;,..-'

0

~

'25-C,

tpHl MIN.)

2

;::

a:

---~

~

-

1\

~V

...... '

I_\-

-

20

20

"
-24
),-'WAVELENGTH - NANOMETRES

Figure 6. Transmitter Spectrum Normalized to the Peak at 25° C

-22

Figure 7. Propagation Delay through System with One Metre of Cable

INPUT

-20

-18

-16

-14

Figure 8. Worst-Case Distortion of NRZ
EYE-pattern with Pseudo Random Data
at 10 Mb/s. (see note 10).

PULSEREPETITION~oons~
FREQ, '" 1 MHz

------------ ----

Figure 9. System Propagation Delay Test Circuit and Wave'-orm Timing Definitions

4-51
~~~------------

-12

PR - RECEIVER POWER - dBm

PR - RECEIVER POWER - dBm

---------

I

Electrical Description

Mechanical Description

The HFBR-1201/2 Transmitter contains a GaAIAs infrared
emitter. Both the anode and cathode of the emitter are insulated from the case. This configuration permits the use of a
variety of drive circuitry such as series switching, shuntswitching and high frequency peaking. There is no internal
drive circuit or current limiter.

The HFBR-1201/2 fiber optic transmitter and HFBR-2201/2
receiver are housed in rugged metal packages intended for
use with the HFBR-3000/HFBR-3100 cable assemblies. The
low profile package is designed for, direct mounting on
printed circuit boards or through panels without additional
heat sinking. A flat on the mounting threads of the device is
provided to prevent rotation in all mounting configurations
and to provide an orientation reference for the pin-out.
Hardware is available for horizontal mounting applications
on printed circuit boards. The hardware consists of a stainless steel mounting bracket fastened directly to the printed
circuit board with two stainless steel self-tapping screws and
a nut and washer for fastening the device in the bracket. A
metal shield which snaps directly on the mounting bracket is
also available for unusually severe EMI/ESD environments.
When mounted in the horizontal configuration, the overall
height of the component conforms with guidelines allowing
printed circuit board spacing on 12.7 mm <'500) centers. A
thorough environmental characterization has been performed on these products. The test data as well as
information regarding operation beyond the specified limits
is available from any Hewlett-Packard sales office.

The HFBR-2201/2 Receiver incorporates an integrated
photo IC containing a photodetector and dc amplifier driving an open-collector Schottky output transistor. The
HFBR-2201/2 is designed for direct interfacing to popular
logic families. The absence of an internal pull-up resistor
allows the openCcoliector output to be used with logic families such as CMOS requiring voltage excursions much
higher thanVee. Both the open-collector "Data" output (Pin
3) and Vee (Pin 2) are referenced to "Com" (Pin 4>. The "Data"
output allows busing, strobing and wired "OR" circuit configurations. Both the transmitter and receiver are designed
to operate from a single +5V supply. Note that the "Com" and
"Case" pins are not connected internally.
The HFBR-1201/2 and HFBR-2201l2 optical receptacles
contain a lens to optimize the coupling between the fiber and
the active optical device.

Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path.Clean
compressed air often is sufficient to remove particles of dirt;
methanol or Freon'· on a cotton swab also works well.

Horizontal PCB Mounting
Mounting at the edge of a printed circuit board with the
lock nut overhanging the edge is recommended.

EMIiESD SHIELD
MOUNTING HARDWARE: HFBR-4202 (HFBR-1202/e202)
1 EMI/ESD SHIELD
1 1/4-36 NUT
1 1/4 x .005 INCH WASHER

When bending the leads, avoid sharp bends right where the
lead enters the backfill. Use needle nose pliers to support
the leads at the base of the package and bend the leads as
desired.

2 2-56 SELF TAPPING SCREWS

1 MOUNTING BRACKET

'~~

When soldering, it is advisable to leave the protective cap
on the unit to keep the optics clean.

,". -,,,."-,,'Q

lED OR DETECTOR IC

CONNECTOR

FERRULE

DIMENSIONS FOR BULKHEAD
MOUNTING HOLE

5.88J35)~

~~6.25('250)
OIA.
(STANDARD 1/4INCH

"D" HOLE - RU PUNCH)

Jt

MOUNTING HARDW,AR,E: HFBR-4201 (HFBR-1201/2201) •,
1 EMI/ESD SHIELD
1 1/4-32 NUT
.

1 1/4 x .005 INCH WASHER
2 2-56 SELF TAPPING SCREWS
1 MOUNTING BRACKET

SMA STYLE CONNECTORS

2-56 SELF TAPPING SCREWS

Figure 11.

Figure 10. Cross Sectional View

(METRIC EOUIV. M2.2x 0.45)

TYPE B (NOT AVAILABLE FROM HEWLETT-PACKARD)

TYPE A*

1/4 -36 UNS-2B

3.18 {.12531

P
LAS!cji
SLEEVE
9.8 (.386)
·USEO IN HFBR-3000/3100 OPT 002 CABLE ASSEMBLIES:

'Jt.

Figure 12.

4-52

------"-----

HFBR-1201 TRANSMITTER

HFBR-2201 RECEIVER

1.95 (.0781 DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW

1,95 (.078) OIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW

PIN 1

7.8

HFBR-2202 RECEIVER

HFBR-1202 TRANSMITTER
1.95 1.0781 DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW

1.95 (.0781 DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW

PIN 1

~'T
8.75 (.3551

7.8

7.8

TRANSMITTER PCB LAYOUT DIMENSIONS

RECEIVER PCB LAYOUT DIMENSIONS

f

2.25 (,090) CIA.
CLEARANCE HOLES FOR

MOUNTING BRACKET SCREWS
PCB EDGE

PCB EDGE

Figure 13. Mounting Dimensions
DIMENSIONS IN MILLIMETRES (INCHES).

Ordering Guide
Transmitter:
Receiver:
Mounting
Hardware:

HFBR-1201 (HP Connector Compatible)
HFBR-1202 (SMA Connector Compatible)
HFBR-2201 (HP Connector Compatible)
HFBR-2202 (SMA Connector Compatible)
HFBR-4201 (HP ConnectorCompatible)
HFBR-4202 (SMA Connector Compatible)

HFBR-0200 Kit:

HFBR-1201 Transmitter
HFBR-2201 Receiver
HFBR-4201 Mounting Hardware (2 sets)
HFBR-3000 10 Metre Cable/Connector Assembly
Technical Literature

Fiber Optic Cable - see data sheets

HFBR-3000

Single Channel Connectored - Custom
Lengths
HFBR-3100
Dual Channel Connectored - Custom
Lengths
Note: Option 001 specifies HFBR-4000 connector and
Option 002 specifies SMA connectors.
HFBR-3001
Single Channel Connectored - 10 metres
(HFBR-4000 connectors)
HFBR-3021
Single Channel Connectored - 10 metres
(SMA connectors)
HFBR-3200
Unconnectored Single Channel - Custom
Lengths
HFBR-3300
Unconnectored Dual Channel - Custom
Lengths

4-53

HIGH EFFICIENCY
FIBER OPTIC
TRANSMITTER

Fh;W HEWLETT
~~ PACKARD

HFBR-1203
HFBR-1204

TECHNICAL DATA

JANUARY 1986

Features
• OPTICAL POWER COUPLED INTO 100/140 ~m
FIBER CABLE
-9.8 dBm Guaranteed at 25 0 C
-7.4 dBm Typical
• FACTORY ALIGNED OPTICS
• RUGGED MINIATURE PACKAGE
• COMPATIBLE WITH HP OR SMA STYLE
CONNECTORS

Description
The HFBR-1203/-1204 Fiber Optic Transmitter contains an
etched-well 820 nm GaAIAs emitter capable of coupling
greater than -10 dBm of optical power into 100/140 Jlm
HFBR-3000 Fiber Cable/Connector Assemblies. This high
power level is useful for fiber lengths greater than 1 km, or
systems where star couplers, taps, or in-line connectors
create large fixed losses.
Consistent coupling efficiency is assured by factory
alignment of the LED with the mechanical axis of the
package connector port. Power coupled into the fiber varies less than 5 dB from part to part at a given drive current
and temperature. The benefit of this is reduced dynamic
range requirements on the receiver.

HFBR-1203 is compatible with HFBR-4000 connectors,
and HFBR-1204 is compatible with SMA style connectors.
The low profile package is designed for direct mounting
on printed circuit boards or through panels without additional heat sinking. A complete mounting hardware package (HFBR-4201/-4202) is available for horizontal mounting
on PCBs, including a snap-on metal shield for harsh
EMJlESD environments.
;:'=:'---LE'~SCLIP

High coupling efficiency allows the emitters to be driven at
low current levels resulting in low power consumption and
increased reliability of the transmitter. Another advantage
of the high coupling efficiency is that a significant amount
of power can still be launched into smaller fiber such as
50/125 Jlm (-19.1 dBm typJ.

CONNECTOR
FERRULE

The HFBR-1203/-1204 transmitter is housed in a rugged
miniature package. The lens is suspended to avoid
mechanical contact with the active devices. This assures
improved reliability by eliminating mechanical stress on
the die due to the lens. For increased ESD protection and
design flexibility, both the anode and cathode are insulated from the case. .
Figure 1. Cross Sectional View

Mechanical Dimensions
HFBR-1203
1/4-32 UNEf-2A
10-32 ONF~2A

2.64 (.100)

OIA.~\

PIN CIRCLE

DIA..

HFBR·1204
1/4-36 I,.JNs..ZA

FLAt
.;\

~1

PIN

THREAD FLAT
2341.1()(»)

FUNCTION

1-c"c+""AN",O",D~Ec:-1

FLAT

PIN CIRCLE

_

"&0-'1

~c+-"CA~T-,!HD",D~E-I

REO BACKFILL,-,-,-.=:CA.;;:S.::.E_...J

PIN

~,-+-"CA~T"HO",D~E-l
L....:'....Lc:;CA~S:!:.E_ - l

AEOBACKFILL

MIN
DIMENSluNS IN MILLIMETRES (INCHES)

4-54

FUNCTION

l----!,...+~A~NO!!!D~E~

HFBR-1203/-1204 TRANSMITTER

HFBR-1203/1204 TRANSMITTER

Absolute Maximum Ratings
'symbol

Min.

Max,

Unit

Storage Temperature

Ts

·55

+85

°C

Operating Temperature

TA

-40

+85

°c

Parameter

A::::~ .~

Note 4

CATHODE

Lead
Sofl:lering
Cycle

Temp.

~::~d

:::", ::: :::::

+260

l.M,vV\l'···.······...···../\

Reference

°C

J

Note 1
Time

Reverse Input Voltage
Voltage, Case-to-Junctlon

10

VVRc

j

2T

I

vv ...··•· ..

··.,·.,J

sec

~n;

V

1.0
25

Lr\l\/\v'/\Y

.AyAVIXYXY)

V

Electrical/Optical Characteristics -40°C to +85'C unless otherwise specified
Parameter
Forward Voltage
Forward Voltage
Temperature Coefficient

Symbol
VF

Min.

Typ.l21

Max.

Units

Conaitlons

1.44

1.72

1.94

V

IF = 100

60

a:

50

a:

40

I

30

/ ~ .....25·0
/ / II

20

/ I

0
C

~

f2
.!!-

"

~

I

~

~a:
I

-0.5

cIQ
_I"
a..

1.6

.......

>

1.7

-1.:

~

1.8

_1

~

~

1.5

"-

0.5

w

/,/.
1.4

........

1

ffi

85'0/ I ~O"c
'1/ I

10
1.3

1.5

I

o

'I I

"e
a:

!g

/,

90

...I

board with the HFBR-4201 mounting hardware.
10. Measured with almA pre-bias current and terminated into
a 50 ohm load.
11. Measured at the end of 1.0 metre Siecor 100/140 ,.,m fiber
cable or equivalent, with large area detector and cladding
modes stripped, terminated with the appropriate type of
connector. This assembly approximates a Standard Test
Fiber. The fiber NA is 0.275, measured at the end of a 2.0
metre length, the NA being defined as the sine of the half
angle determined by the 5% of peak intensity pOints. Measured by the method of Note 6, the corresponding NA value
is 0.232.

60 -40

-20

20

Figure 2. Forward Voltage and Current Characteristics

"\-40'0

1.2

....
;iffi

...... .......
~~

w ..
N ...

V)

:I:

0.8

t!I

0.7

...

,.

t:~
Z...r

o

ffi

~5

:Ow

a:

z

I

0,5
0.4

o

0.3

-~
.... e.

0.2
0.1

'"
0. 0E

I~

200

40 50 60 80 100

VB.

I

I

,

\
I
I /1 85'0
II I 1/ \
1\ \\
I / \. \ ,

I

\,1'\

/ /
'/

/

""- -.....:::

1,.oIII~
760

780

800

820

840

""

860

~

880

900

/1- WAVELENGTH - NANOMETRES

IF - DC FORWARD CURRENT - rnA

Figure 4. Normalized Transmitter Output
Current

100

:\26'C

0.6

~
no ~

G

/
30

'.

80

I

1.0
0.9

"'
C:o

V

I ,

1. 1

....~~...

/

20

60

~,

Figure 3. Normalized Thermal Effects In Transmitter Output

1.3

r

40

"

TJ - JUNCTION TEMPERATURE - 'C

VF - FORWARD VOLTAGE - VOLTS

/

'" " '"

Figure 5. Transmitter Spectrum Normalized to the Peak at

DC Forward

25°C

Ordering Guide
Transmitter:

HFBR-1203 (HP Connector Compatible)
HFBR-1204 (SMA Connector Compatible)

HFBR-3100

Receiver:

HFBR-2201 (5 MBaud, HP Connector)
HFBR-2202 (5 MBaud, SMA Connector)
HFBR-2203 (40 MBaud, HP Connector
Compatible)
HFBR-2204 (40 Mbaud, SMA Connector
Compatible)

Note:

Option 001 specifies HFBR-4000 HP connector and
Option 002 specifies SMA connectors.

HFBR-3001
HFBR-3021
HFBR-3200

Mounting

HFBR-4201 (HP Connector Compatible)
HFBR-4202 (SMA Connector Compatible)
Fiber Optic Cable - see data sheets

Hardware:

HFBR-3000

HFBR-3300

Single Channel Connectored - Custom
Lengths

4-56

Dual Channel Connectored - Custom
Lengths

Single Channel Connectored (HFBR-4000 connectors)
Single Channel Connectored (SMA connectors)
Unconnectored Single Channel
Lengths
Unconnectored Dual Channel Lengths

10 metres
10 metres
- Custom
Custom

- - - - - - - ---- -,-------

(2) PT = Pa + 10 log

High Speed operation
Rise and fall times can be improved by using a pre-bias
current and "speed-up" capacitor. A 1 mA pre-bias current
will significantly reduce the junction capacitance and will
couple less than -34 dBm of optical power into the fiber
cable. The TTL compatible circuit in Figure 7 using a
speed-up capacitor will provide typical rise and fall times
of 10 ns.

IPEAK = 100 mA = Vee - VF
34.90
IAVG

=

78 mA

=

Vee - VF
34.9 + 10n

(1/10)

where
Pa = transmitter power specification (dBm) at la
la = specified transmitter current (100 mAl
I = selected transmitter current (mA)
To allow for the dynamic range limits of proper receiver
performance. it is necessary that a link with maximum
transmitter power and minimum attenuation does not
OVERDRIVE the receiver and that minimum transmitter
power with maximum attenuation does not UNDERDRIVE
it. These limits can be expressed in a combination of the
two equations above:
(3) Pa MAX

+ 10 log (lMAX/l a) -

(4) Pa MIN + 10 log (IMIN/la) -

Q. <>aMIN < PR MAX
Q. <>aMAX > PR MIN

where
Pa MAX. Pa MIN = max .• min. specified power from
transmitter (dBm) at I = la
max., min. selected transmitter
IMAX.IMIN
operating current (mA)
PR MAX, PR MIN = max., min. specified power at
receiver (dBm)
max., min. attenuation (dB/km)
<>aMAX, <>aMIN
A more useful form of these equations comes from solving
them for the current ratio, expressed in dB:
(S) 10 log (lMAX/l a) < PR MAX - Pa MAX + Q • <>aMIN
(6) 10 log (lMIN/la) > PR MIN - Pa MIN

+ Q. <>oMAX

These are plotted in Figure 8 as the OVERDRIVE LINE,
and UNDERDRIVE LINE, respectively for the following
components:

Figure 6. Tesl Circuil for Measuring I r • If

34.9nllWI

HFBR-1203/4 Transmitter-11.2< PT<-4 dBm
HFBR-2203/4 Receiver (25 MHz) -28.5 < PR < -12.6 dBm
HFBR-2203/4 Receiver (2.S MHz) -3S.S < PR < -12.6 dBm
HFBR-3000 Series Fiber Cable 4 < O:a < 8 dB/km

+5Vo-----.-......----,p----...~W\-......---___,

10 n

rg

680
pF

I

a


">w

Link Design

c

(1)

ffi

"'::>
"'
"I

a:

0

-10

I

With transmitter performance specified as power in dBm
into a fiber of particular properties (core size, NA, and
index profile), and receiver performance given in terms of
the power in dBm radiated from the same kind of fiber,
then the link design equation is simply:

"'

I-

§

t:>

g
~

I! - CABLE LENGTH -

km

Figure 8. Link Design Limils.

PT - Q • <>a = PR
where
PT = transmitter power into fiber (dBm)
Q= fiber (cable) length (km)
<>a = fiber attenuation (dB/km)
PR = receiver power, from fiber, (dBm)

For transmitter input current in the range from 10 to 100
mA, the power varies approximately linearly:

4-57

These design equations take account only of the power
loss due to attenuation. The specifications for the receiver
and transmitter include loss effects in end connectors. If
the system has other fixed losses, such as from directional
couplers or additional in-line connectors, the effect is to
shift both OVERDRIVE and UNDER DRIVE lines upward
by the amount of the additional loss ratio.

F/iDW

40 MBd MINIATURE
FIBER OPTIC
RECEIVERS

HEWLETT

~~ PACKARD

HFBR-2203
HFBR-2204

TECHNICAl,. DATA. JANUARY 1986

Features
• DATA RATES UP TO 40 MBd
• HIGH OPTICAL COUPLING EFFICIENCY
• RUGGED, MINIATURE METAL PACKAGE
• COMPATIBLE WITH HP OR SMA STYLE
CONNECTORS
• VERSATILE ANALOG RECEIVER OUTPUT
• 25 MHz ANALOG BANDWIDTH

Applications
• DATA ACQUISITION AND PROCESS CONTROL

The signal from this simple analog receiver can be optimized
for a variety of transmission requirements. For example the
HFBR-0221/02/03/04 transceivers add low-cost external
components to achieve logiC compatible signal levels optimized for various data formats and data rates:

• SECURE DATA COMMUNICATION
• EMC REGULATED SYSTEMS (FCCIVDE)
• EXPLOSION PROOF SYSTEMS

Each of these fiber optic components uses the same rugged,
lensed, miniature package. This package assures a consistent, efficient optical coupling between the active devices
and the optical fiber.

• WEIGHT SENSITIVE SYSTEMS (e.g., AVIONICS,
MOBILE STATIONS)
• VIDEO TRANSMISSION

The HFBR-2203 Receiver is compatible with the HFBR-4000
Connector and HFBR-3000 series, Option 001 connectored
cable. The HFBR-2204 Receiver is compatible with SMA
style connectors, types A and B (see Figure 11), and HFBR3000 series, Option 002 connectored cable. HFBR-3000
series cable can be ordered with or without connectors. The
HFBR-0100 connector assembly kit is available if field installation of HFBR-4000 connectors is desired.

Description
The HFBR-2203/04 Receiver is capable of data rates up to
40 MBd at distances greater than 1 km when used with
HFBR-3000 series cable and HFBR-1201/2/3/4 Transmitters. The HFBR-2203/04 Receivers contain a discrete PIN
photodiode and preamplifier IC.

Mechanical Dimensions
HFBR-2203 RECEIVER

HFBR·2204 RECEIVER

6.35
PIN
1

Oil

FUNCTION
CASE
SIGNAL
COMMON
Vee

.... ..1

t23D}

DIMENSIONS TN MllLlMETRES (lNCHESI
VNt.US OTHERWISE SPEClfleo, THE TOl.ERANCES- ARE,

.X :± .51 rom (.XX

,xx -:t

:!:

.02 1M

.1;J mrn {.XXX

i

.005 tNt

4-58
-~--~-------------~

PIN

FUNCTION

CASE
SIGNAL
COMMON

Vee

Electrical Description
The HFBR-2203/04 Fiber Optic Receiver contains a PIN
photodiode and low noise transimpedance pre-amplifier
hybrid circuit with an inverting output (see note 10), The
HFBR-2203/04 receives an optical signal and converts it to
an analog voltage. The output is a buffered emitter-follower.
Because the signal amplitude from the HFBR-2203/04
Receiver is much larger than from a simple PIN photodiode,
it is less susceptible to EMI, especially at high signal rates.

3. The versatile miniature package is easy to mount. This
low profile package is designed for direct mounting on
printed circuit boards or through panels without additional heat sinking.
A complete mounting hardware package is available for
horizontal PCB applications, including a snap-on metal
shield for harsh EMI/ESD environments.
Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressed air often is sufficient to remove particles of
dirt; Methanol or Freon on a cotton swab also works well.
Note:
When installing connectored cable on the optical port, do
not use excessive force to tighten the nut. Fingertightening is sufficient to ensure connectoring integrity, while
use of a wrench may cause damage to the connector or
the optics.

The frequency response is typically dc to 25 MHz. Although
the H FBR-2203/04 is an analog receiver, it is easily made
compatible with digital systems (see HFBR-0221/2/3/4
Transceiver data sheet), Separate case and signal ground
leads are provided for maximum design flexibility.
It is essential that a bypass capacitor (0.01 I'F to 0.1 I'F
ceramic) be connected from Pin 4 (Vee) to Pin 3 (circuit
common) of the receiver. Total lead length between both
ends of the capacitor and the pins should be less than 20
mm.

System Design Considerations

Mechanical Description
The HFBR-2203/04 Fiber Optic Receiver is housed in a
miniature package intended for use with HFBR-3000 Fiber
Optic Cable/Connector Assemblies. This package has
important performance advantages:

For additional information, see the product data sheet forthe
HFBR-0221/2/3/4 Fiber Optic Transceivers.

OPTICAL POWER BUDGETING
The HFBR-2203/04 Fiber Optic Receivers when used with
the HFBR-1201/02 Fiber Optic Transmitters can be operated
at a signalling rate of more than 40 MBd over a distance
greater than 1000 metres (assuming 8 dB/km cable attenuation). For shorter transmission distances, power
consumption can be reduced by decreasing Transmitter
drive current. At a lower data rate, the transmission distance
may be increased by applying bandwidth-filtering at the

1. Precision mechanical design and assembly procedures
assure the user of consistent high efficiency optical
coupling.
2. The lens is suspended to avoid contact with the active
devices, thereby assuring improved reliability.

r - - - - - LENS CLIP

CONNECTOR
FERRULE

Figure 1. Cross Sectional View

4-59
~-~

.....

~-~-~-~

-------

..

output of the HFBR-2203/04 Receiver; since noise is
reduced as the square root of the bandwidth, the sensitivity
olthe circuit is proportionately improved provided these two
conditions are met:
a. input-referred noised the follow on circuit is well below
the filtered noise of the Receiver
b. logic comparator threshold is reduced in the same proportion as the noise reduction
As an example, consider a link with a maximum data rate of
10 MBd le.g., 5 Mb/s Manchester); this requires a 3 dB bandwidth of only 5 MHz. For this example, the input-referred rms
noise voltage of the follow-on circuit is 0.03 mV. Theequivalent optical noise power of the complete receiver IPNO) is
given by:

VNO = rms output noise voltage of the HFBR-2203/04
with no bandwidth filtering
VNI = input-referred rms noise voltage of the fOllow-on
circuit
B = filtered.3 dB bandwidth
Bo = Unfiltered 3dB bandwidth of the HFBR-2203/04
125 MHz)
Rp = optical-to~electrical responsivity ImV/ }J.w) of the
HFBR-2203/04
Note that noise adds in an rms fashion, and that the square of
the rms noise voltage of the HFBR-2203/04 is reduced by the
bandwidth ratio, B/Bo.
From the receiver data IElectrical/Optical Characteristics)
taking worst-case values, and applying NO bandwidth filtering IB/Bo = 1):
PNO = [10.43)2+10.03)2JO.5 mV = 0.0941'Wor -40.3 dBm

minimum optical power budget.of 11.8 dB is obtained:
[-18 dBm.-3 dB

-(~32.8dBm)J

= 11.8 dB

Using 8 dB/km optical fiber, this translates into a minimum
link length of 1475 metres Itypical link power budget forthis
configuration is approximately 17.2 dB or 3130 metres with
5.5 dB/km fiber).

BANDWIDTH
The bandwidth of the HFBR-2203/04 is typically 25 MHz.
Over the entire temperature range of -40 0 C to +85 0 C, the
rise and fall times vary in an approximately linear fashion
with temperature. Under worst case conaitions, tr and ti may
reach a maximum of 26 ns, which translates to a 3 dB bandwidth of:
f3dB '"

350 =. 350 = 13.5 MHz
tr
.26 ns

The receiver response is essentially that of a single-pole
system, rolling off at 6 dB/octave. In order for the receiver to
operate up to 40 MBd even though its worst case 3 dB
bandwidth is 13.5 MHz, the received optical power must be
increased by 3 dB to compensate for the restricted receiver
transmission bandwidth.

PRINTED CIRCUIT BOARD LAYOUT
When operating at data rates above 10 MBd, standard PC
board precautions should be taken. Lead lengths greater
than 20 mm should be avoided whenever possible and a
ground plane should be used. Although transmission line
techniques are not required, wire wrap and plug boards are
not recommended.

4.6 mV/I'W
To ensure a bit error rate less than 10-9 requires the signal
power to be 12 times larger 1+11 dB) than the rms noise as
referred to the Receiver input. The minimum Receiver input
power is then:
PRMIN = PNO + 11 dB = -29.3 dBm
With the application of a 5 MHz low-pass filter, the bandwidth ratio becomes:

OPERATION WITH HEWLETT-PACKARD
TRANSMITTERS
Hewlett-Packard offers two transmitters compatible with
the HFBR-2203/4. Link performance with each transmitter
is shown below for 25 0 C operation with HFBR-3000 series
glass fiber cable. See product data sheets for further
information.

~Bo=5MH~~MHz=02

HFBR-1201/2
HFBR-1203/4
.9.8 dBm
-17 dBm
Coupled Optical Coupled Optical
Power
Power

Note that 25 MHz should be used for the tolal noise bandwidth of the HFBR-2203/04. Inserting this value of the
bandwidth ratio in the expressions for PNO and PRMIN above
yields the results:
PNO = 0.042 I'W or -43.8 dBm and PRMIN = -32.8dBm
Given the HFBR-1201/2 Transmitter optical power Pr =
-18 dBm at IF = 40 mA, and allowing a 3 dB margin, a

4-60

HFBR-2203/4
-27 dBm Sensitivity

1200 m
40MBd

2100 m
40MBd

HFBR-2203/4
-32 dBm Sensitivity

1800 M
10 MBd

2800 M
10 MBd

HFBR-2203/2204 RECEIVER

HFBR-2203/2204 RECEIVER

Absolute Maximum Ratings
Symbol

Min.

Max.

Unit

Storage Temperature

Ts

-55

85

°C

Operating Temperature

TA

-40

Parameter

Lead
Soldering
Cycle

85

°C

Temp.

260

°C

Time

10

sec

25

V

Case Voltage
Signal Pin Voltage

VeAsE
VSIGNAL

-0.5

Vee

-0.5

Supply Voltage

1

V

7.0

V

.----+"--vcc

Reference

r--+-=--SIGNAL
CASE
'-----t-"--COMMON

Note 9
Note 1

Electrical/optical Characteristics
-40° C to +85° C;

4.75

~

Vec

~

5.25;

RLOAD = 5110

unless otherwise specified

Symbol

Min.

Typ[41

Max.

Unit

Conditions

Reference

Responsivitity

Rp

5.1

7

10.9

mV/JlW

TA= 25°C
at 820 nm

Note 10
Figure 3

12.3

mVlJlW

RMS ouwut
Noise Vo tage

VNO

.36

mV

TA=25°C,
PIN = OJlW

.43

mV

-40 ~ TA ~85°C,
PIN= 0 JlW

-12.6

dBm

TA= 25°C

55
-14

JlW
dBm

-40

40

JlW

Parameter

4.6
.30

Input Power
PR

Output Impedance

20

DC Output Voltage

Vodc

.7

Power Supply Current

lee

3.4

Equivalent N.A.

NA

.35

Equivalent Diameter

DR

250

Equivalent Optical Noise
Input Power

n

20

PN

-40 ~ T A~ +85° C

~

Figures 4, 7

Note 2

T A ~ 85° C

Test Frequency =
20 MHz

V

PIN = 0 JlW

6.0

mA

RLOAD = '"

-43.7

-40.3

Jlm
dBm

.042

.094

JlW

Note 3

Dynamic Characteristics
-40°C to +85°C;

4.75

~

Vee

Parameter

Rise/Fall Time.
10% to 90%
Pulse Width Distortion

~

5.25;

RLOAD = 5110, CLOAD = 13 pF unless otherwise specified

Symbol

tr. tf

Min.

TypJ71

Max.

Units

14

19.5

ns

TA "'25°C
PIN = 10 JlW Peak

26

ns

-40 ~

2

ns

PIN = 40 JlW Peak

Figure 9

TA = 25°C

Note 6
Figures 8, 9

at2 MHz

Note 7
Figures 5, 6

tphl - tplh

Overshoot

4

%

Bandwidth

25

MHz

50

dB

Power Supply
Rejection
Ratio (Referred to
Output)

PSRR

Noles:
1. 2.0 mm from where leads enter case.
2. If Pin < 40 jJ.W, then pulse width distortion may increase. At Pin
much as 100 ns pulse width distortion.

= 80 jJ.W and TA = 80° C,

Conditions

TA~

Reference

85°C

Note 5
Figures 8,9

some units have exhibited as

4-61
._----------

Noles (eont.):
3.

4.
5.
6.

DR is the effective diameter of the detector image on the plane of the
fiber face. The numerical value is the product of the actual detector
diameter and the lens magnification.
Typical specifications are for operation at TA = 25° C and Vee = S.OV.
Input optical signal is assumed to have 10% - 90% rise and fall times
of less than 6 ns.
Percent overshoot is defined 85:
VPK -

VlOO%

x 100%

V100%
7.

B.

It is essential that a bypass capacitor (0.01 J.tF to 0.1 I'F ceramic) be
connected from pin 4 (Vee) to pin 3 (circuit common) of the receiver.
Total lead length between both ends of the capacitor and the pins
should be less than 20 mrn.
9. HFBR-3000 series Fiber Cable is specified at a narrower temperature
range, -20 0 C to 85 0 C.
10. Vour = VODe - (Rp x P'Ni.

See Figure 16.

Output referred P.S.R.R. is defined as
20 log

(-

VPOWER SUPPLY RIPPLE)

Vour

RIPPL~

1.25

~

1.00

/

.75

.50

.25

V

~

'\
-

/

V
480

560

640

720

800

~

ffi

30

"w

880

0

E

/'\

E

~

1\

w

"'z"
5
5
"

960 1040

). - WAVELENGTH - nm

\

\)11

~

-60

O~

5

-8

~

-10 0

,

"",

-J

1.0

-140
III

10

100

-160
0.1

02

f - FREQUENCY - MHz

Figure 3. Receiver Spectral Response
Normalized to 820 nm

-

I -12 0

t

0.1

-40

'"~

e

oE

-2 0

'"

1\

15
10

0

§

1

../

25

0

\

L

~ 20 E

o
400

40
35

0;

\

45

0.40.6

4

f - FREQUENCY - MHz

Figure 4. Receiver Noise Spectral
Density

Figure 5. Receiver Power Supply
Rej. vs. Freq.

TO SPECTRUM ANALYZER

HP 112M
5OOMH.
ACTIVE

13 pF

!'ROSE

HP8li6SA
SPECTRUM
ANALYZER

Figure 6. Power Supply Rejection Test Circuit

Vee

HP l1:roA

5OOMH,
ACTIVE
PROSE

CL

511n

13pF

ICLIS THE SUM OF A LOAO CAPACITOR ANO
INPUT CAPACITANCE OF THE ACTIVE PROBE)

Figure 7. RMS Output Noise Voltage Test Circuit

4-62

HP34«lA
TRUERMS
VOlTMETER
2 Hz-loo MHz

6

10

Vee
HFBR-1201!02
HP 1120A
500::MHz

AG'tivE
PROBE

HP 1726A
QSCI'LLO·

':'scOPe
son

ICL IS THE SUM OF

HFBR-2203!04

A LOAD CAPACITOR AND
INPUT CAPACITANCE OF
THE ACTIVE PROBE.)

PULSE
GENERATOR

Figure 8. Rise and Fall Time Test Circuit

RISE AND FALL TIMES

PULSE WIDTH DISTORTION

10

40 ----,

250 ns ----11---- 250 ns

.1L~=====-

I

50% ; - - - 250 "' - - * , r - - - 250 " ' _

_____===

I

.1-

OVERSHOOT

w
~

VPEAK

1~~

~

____

- ,-

t __

W

--r __ _

t-

«
~

>-

>-

~

"::l

in

in

~

;;

50

---------

-.

~

o
!O

0

!O
>~

10

§

§
PULSE WIDTH DISTORTION'" 1tpHL - tPLH I

Figure 9. Waveform Timing Definitions

4-63
---.--~-------------------

HFBR-2203 RECEIVER

HFBR-2204 RECEIVER
1.95 (.078) DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW

1.95 (.078) DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW
PIN 1

I

PIN 1

7.8
- 13.75 (.550)

RECEIVER PCB LAYOUT DIMENSIONS

1.62S (.065)

f

2.25 (.090) PIA.

CLEARANce HOLES FOR
MOUNTING 8RACKET SCREWS

PCB EDGE
DIMENSIONS IN MILLIMETRES (INCHES).

Figure 10. Mounting Dimensions

HEWLETT-PACKARD STYLE CONNECTOR (Used in HFBR-3000/31 00, Option 001 Cable Assemblies).
HFBR-4000 CONNECTOR

~.
NOTES:
1. DIMENSIONS ARE IN mm (INCHES).

6.35
(.250)
REF. PLANE
FOR CABLE
LENGTH

2. UNLESS OTHERWISE SPECIFIED; THE TOLERANCES ARE:

,x 1; .51 mm. (.XX

j;

,02 in,)

.XX ± .13 mm (.XXX.t .005 in.)
3. FIBER END IS LOCKED FLUSH WITH FERRULE FACE.

SMA STYLE CONNECTORS
TYPE B
(Not Available from Hewlett-Packard)

TYPE A
(Used in HFBR-3000/31 00, Option 002 Cable Assemblies).

1/4-36 UNS-2B

JUWil---".~

3.14 (.1235)
3.16(.1245)

3.18(.1253)

PLAS!JI

SLEEVE

9.8 (.386)

Figure 11. Fiber Optic Connector Styles

4-64

Horizontal PCB Mounting
Mounting at the edge of a printed circuit board with the
lock nut overhanging the edge is recommended.

the leads at the base of the package and bend the leads as
desired.

When bending the leads, avoid sharp bends right where the
lead enters the backfill. Use needle nose pliers to support

When soldering, it is advisable to leave the protective cap
on the unit to keep the optics clean.

EMI/ESD SHIELD

HFBR-2203: 114-32 NUT

~(()

-~·~~o Ifff,~~

___

1/4 x .005 INCH WASHER

DIMENSIDNS FOR BULKHEAD
MDUNTING HOLE

W

235I
5.88E·

6.251.2501
DIA.

ISTANDARD 1/4INCH "D" HOLE- RU PUNCHI

2-56 SELF TAPPING SCREWS
IMETRIC EQUIV. M2.2 x 0.45)

MOUNTING HARDWARE: HFBR-4201 IHFBR-2203)
1
1
1
2
1

~

~

MDUNTING HARDWARE: HFBR-4202 IHFBR-2204)"

EMI/ESO SHIELD
1/4-32NUT
1/4 x .005 INCH WASHER
2-56 SELF TAPPING SCREWS
MOUNTING BRACKET

, "EMIIESD SHIELD
, 1/4-36NUT
I 1/4 x .005 INCH WASHER
2 2-56 SELF TAPPING SCREWS
, MOUNTING BRACKET

Ordering Guide
Transmitter:

Receiver:
Mounting
Hardware:

HFBR-1201
HFBR-1202
HFBR-1203
HFBR-1204

(HP Connector Compatible)
(SMA Connector Compatible)
(HP Connector Compatible)
(SMA Connector Compatible)

HFBR-2203 (HP Connector Compatible)
HFBR-2204 (SMA Connector Compatible)
HFBR-4201 (HP Connector Compatible)
HFBR-4202 (SMA Connector Compatible)

Fiber Optic Cable - see data sheets
HFBR-3000

Single Channel Connectored - Custom
Lengths
HFBR-3100
Dual Channel Connectored - Custom
Lengths
Note: Option 001 specifies HFBR-4000 connector and
Option 002 specifies SMA connectors.
HFBR-3001
Single Channel Connectored - 10 metres
(HFBR-4000 connectors)
Single Channel Connectored - 10 metres
HFBR-3021
(SMA connectors)
HFBR-3200
Unconnectored Single Channel - Custom
Lengths
HFBR-3300
Unconnectored Dual Channel - Custom
Lengths

4-65

Fli;'

HIGH SPEED
FIBER OPTIC
TRANSCEIVERS

HEWLETT

a:~ PACKARD

HFBR-0221
HFBR-0222
HFBR-0223
HFBR-0224

TECHNICAL DATA

J;:'i\JUI\AY1986

Features
• GUARANTEED LINK PERFORMANCE
• DISTANCE/DATA RATE TRADEOFF ALLOWS
INCREASED OPTICAL POWER BUDGET AT
LOWER DATA RATES
• TTL 1/0
• 20 MBAUD DATA RATE (CAN BE MODIFIED
FOR 40 MBd OPERATION)
• COMPATIBLE WITH MOST DATA FORMATS
• AVAILABLE WITH HP OR SMA STYLE
CONNECTORS
• LINK LENGTHS TYPICALLY GREATER THAN
1 km AT 20 MBd

Applications
• DESIGN AID FOR HIGH SPEED FIBER OPTIC
COMPONENTS
• DATA ACQUISITION AND PROCESS CONTROL
• SECURE DATA COMMUNICATION
• EMC REGULATED SYSTEMS (FCCNDE)
• EXPLOSION PROOF SYSTEMS
• WEIGHT SENSITIVE SYSTEMS (e.g. AVIONICS,
MOBILE STATIONS)

Description
The HFBR-02211213/4 High Speed Fiber Optic Transceivers are printed circuit board assemblies containing HFBR-12D1/
-1202 Transmitters, HFBR-2203/-2204 Receivers and support circuitry to provide TTL input and complementary
TTL outputs. The performance of these transceivers at
20 MBd has been characterized over O· C to 70· C and total
lihk performance with HFBR-3000 Fiber Cable/Connector
Assembly is guaranteed.

These transceivers are optimized for 20 MBd operation.
However, the, support circuitry.on the printed circuit board
can be optimized for other data rates. Recommendations
for component values and anticipated performance for
operation at 1 MBd, 5 MBd and 40 MBd are included in the
"Application Information" section.
There are two transceiver designs (available with HP or
SMA~style connector ports) which accommodate various
data formats. The HFBR-0221/0222 transceivers are optim~
ized for data formats which have 50 percent duty factors
such as Manchester and biphase. The HFBR-D223/-0224
transceivers are designed for arbitrary data formats including most NRZ schemes (see "Circuit Description" for
details).
The transceivers can be mounted via an edge card connector,' either parallel or perpendicular to a reference
printed circuit board. A right angle edge card connector is
included with each transceiver for parallel mounting.

Mechanical Dimensions
DIMENSIONS ARE IN MILLIMETRES (INCHES)

80.0

2.910.12)

6 CONTACTS 4.0

4-,66

Recommended Operating
Conditions

Absolute Maximum Ratings
Parameter

Symbol

-Vee
Storage
Temperature[11

Min.

Max.

Units

-0.5

5.25

V

-6.5

+0.5

V

-55

85

°C

Parameter

Applied Voltage
Data, Data
+Vee, Data In

Ts

Supply Voltage

Symbol

Min.

Max.

+Vee

4.75

5.25

-Vee

-4.5

-6.5

TA

0

70

Operating
Temperature
Duty Factor
HFBR-0221/22

OF

HFBR-0223/24
Data Rate Range

33

67

5

95

0.Q1

20

Units
V
°C

%
MBd

Electrical/Optical Characteristics
(Recommended operating conditions for transceiver optimized for 20 MBd apply, unless otherwise specified)
Parameter

Symbol

Optical Power Budget
HFBR-Q221/2
HFBR-Q223/4
Pulse Distortion
HFBR-Q221f2
HFBR-Q223f4
Data Output Response Time l21
Transceiver
Propagation Delayl31

OPB

Conditions
When used with HFBR-3000
Fiber Cable/Connectors,
Data Rate = 20 MBd
BER = 10-9

Min.

Typ.

9

15.5

5

11

7

12.5

2

12.5

tr

7

If

5

tPlH,
tPHl

70

ns

ns

ns

750

-Vee

mW

125

PT
Data In is high, TA = 25° C

-18

-16.5

dBm

15.8

22.4

J.l.W

-19
OuT
DATA IN
+5 v 1------'

DUAL
POWER SUP?LV

GNOI------~

OSCILLOSCOPE

~

HFBR-022X
TRANSCEIVER

CHANNEl. A CHANNEL II
(INVERTED)

Notes:
1. The data out observed through the active probe exhibits overshoot at the rising edge. This overshoot will disappear if the output is
loaded to drive a TTL input.
2. Oscilloscope inputs should be terminated into 50 ohms.
3. The active probe should be set on DC for observation of lower data rates. The offset on the active probe should be off.
4. The active probe is used to avoid reflection in the observed signal through impedance matching.
5. If necessary clean the optical port of the fiber connectors with Acetone before connecting them to the transceivers.

Ordering Information
Connector
Style

HFBR-0221

HP

HFBR-0222

SMA

....
HFBR-0223

HP

HFBR-0224

SMA

Fiber OptiC Cable (See Data Sheets)
HFBR-3000

Data Format
33 to 67% Duty Factor
(For use with code schemes
such as Manchester
and B/phase)

HFBR-3100

5 to 95% Duty Factor
(For use with code schemeS
such as NRZ and NRZIl

HFBR-3001

Single Channel Connectored Custom Lengths
Dual Channel ConnectoredCustom Lengths

NOTE: Option 001 specifies HFBR-4000 (HP) connector and
Option 002 specifies SMA style connectors.

HFBR-3021
HFBR-3200
HFBR-3300

4-68

Single Channel Connectored - 10 metres
(HFBR-4000 connectors)
Single Channel Connectored -'- 10 metres
(SMA connectors)
'Unconnectored Single Channel Custom Lengths
Unconnectored Dual Channel Custom Lengths

~~~~~~~~~-~~-~

Application Information

...

~----

would require inappropriately large changes in optical
input power in order to make U2 change state properly.

TRANSCEIVER CIRCUIT DESCRIPTION

Within the limits of its dynamic range, U1 operates linearly, so the threshold at U2 can be referred to the input of
U1 as an equivalent threshold voltage (i.e., divided by the
gain of un Similarly, the HFBR-2203/-2204 Receiver
makes a linear conversion of optical input to voltage output' (typically 7 mV per /JoW), so the U2 threshold can be
referred to the optical input as an equivalent optical power
level. Consequently, changes of either the gain of U1 or
the threshold at U2 affect the threshold-equivalent input
power.

There are separate transmitting and receiving circuits that
function independently so data may be simultaneously
sent and received without mutual interference.
Transmitting CirculI

On the transmitter side, the DATA IN terminal operates
from TTL-level signals; the HFBR-1201/2 Transmitter is off
(PT = Q) with DATA IN low, and is on with DATA IN high.
R12 holds the input low in the absence of anything
connected. In this condition, the output transistor of U3 is
on, and the current from R2 is taken to ground through
CR1, making the voltage at the anode of the HFBR-1201/2
transmitter low enough to hold the LED off, yet allow it to
be slightly forward biased (by the forward voltage on CR1)
so it can be turned on with little delay. With insignificant
forward current in the LED, C3 is discharged. When DATA
IN is raised, the output transistor of U3 is turned off,
allowing the current from R2 to enter the LED; there is an
initial rush of current as C3charges, thus peaking the LED
turn-on. In steady state "on", LED current is limited by the
sum of R2 and R3, but during turn-on current is limited by
R2 only, so the peak-to-dc current ratio is approximately
(R2 + R3)/R2. During turn-off, until C3 is partly discharged,
the voltage on C3 will apply a small reverse voltage to the
LED, thus peaking its turn-off as long as the voltage on C3
remains higher than the voltage at the anode of CR1.

Likewise, the rms noise voltage at the input of U1 can be
referred to the optical input as noise-equivalent input
power.
Sensitivity is defined relative to noise and threshold, as the
optical input power excursion needed to obtain reliable
operation. It can be improved by applying bandwidth filtering to reduce the noise amplitude. Since the HFBR-2203/
-2204 Receiver is well shielded, its output noise is due only
to shot and thermal noise, for which the amplitude varies
as the square root of the bandwidth. Consequently, applying bandwidth filtering at the output of the Receiver
reduces the noise in the rest of the circuit. How this is
done and with what benefit is discussed in the section on
"Sensitivity Improvement with Data Rate Reduction".
Bandwidth filtering is useless unless interference (EMf) is
less than the filter-reduced noise. For this reason the
impedances to ground at the inputs of U1 must be balanced, even though the input signal from the HFBR-2203/
-2204 Receiver is single-ended. This is done by making R5
the same value as Re, and Cn the same as C12. This
makes the impedances balanced because the internal
impedance of the Receiver's output is very low, and only
low values of R13 are used for bandwidth filtering. Further
neutralization of EMI is achieved by making the traces
connecting to the inputs of U1 of approximately the same
length and located as close together as possible.

Receiving Circuil

On the receiving side there is a similar relationship
between the optical power and the TTL-level signals; that
is, a rising input optical power excursion will normally
cause a logic high DATA OUT.
Under steady-state conditions of optical input, both the
positive and negative inputs of U1 are at ground potential,
so the output of U1 is near zero and therefore capable of
excursions either up or down in response to changes at its
input. U2 is a comparator; when connected as shown it
has positive feedback from DATA OUT when DATA OUT
is high, and from DATA OUT when DATA OUT is low.
This positive feedback makes it operate as a Schmitt circuit, the hysteresis thresholds being established by the
voltage division ratios in R11, R9 when DATA OUT is high
and in R1Q, Rs when DATA OUT is low.

DESIGN DIFFERENCES
(HFBR-0221/-0222 and HFBR-0223/-Q224)
The two versions of the Transceiver are designed with different data-handling objectives. The HFBR-Q221/-0222 is
intended for use with signals having a nearly 50% duty factor (such as Biphase or Manchester coded signals)' The
HFBR-0223/-0224 is intended for use as an edge detector
(differentiator); with a very short time constant at C13 and
C14, the voltage levels are restored so rapidly that
response time is virtually unaffected by the time differences between transitions in optical power, and for this
reason it is capable of dealing with an arbitrary data format, such as NRZ and NRZI coded signals.

Under dynamic conditions, a rise in optical input power
causes the voltage at pin 2 of the H FBR-2203/-2204 to fall.
This fall is ac-coupled by Cn to the input, pin 1, of U1,
where it is amplified and converted to a balanced output
signal, rising at pin 8 and falling at pin 7. The falling signal
coupled by C13 to U2 will, if the amplitude exceeds the
hysteresis threshold, cause U2 to latch a logic high at
DATA OUT. Similarly, a drop in optical input power will
cause U2 to latch a logic high at DATA OUT (low at DATA

oun

The difference in response modes is shown in Figure 1. It
is clear that for the HFBR-0223/-Q224 version, the edge
timing is restricted only at the low end (minimum edge
spacing or maximum signalling rate), where encroachment
of one pulse might affect the next. For the HFBR-0221/
-0222 version, a duty factor much more or much less than
50% would reduce the signal-to-noise ratio and also add
propagation delay distortion.

After a change in optical input power, the U1 amplifier circuit may return to steady-state conditions, but U2 holds
the logic state until an opposite excursion occurs unless
there is a noise-voltage excursion that causes logic reversa/. Consequently, the threshold set at U2 must be high
enough that neither electromagnetic interference coupled
from elsewhere on the circuit board, nor Receiver noise
amplified through U1 can cause a false change. On the
other hand, if the threshold is set too high, the Receiver

Circuit adjustments to realize these differences in performance are mainly in the receiving side. Obviously, for the

4-69
--------

~

~---.-------------

DUTY FACTOR I- 50%

DUTY FACTOR'" 50%
DATA IN

+T----~----~----_4~--------~~----

DIFFERENTIAL
INPUT TO U2
(COMPARATOR)
-T--------~~--------~----_r_1----_r

MARGIN

DATA OUT

DISTORTED OUTPUT

a. HFBR·022112 - REQUIRES NEARLY 50% DUTY FACTOR

DATA IN

u

~

______~rl~__________
INCOMPLETE
TRANSIENT

+T-------+~--~--------~._------------._----------_r~~~--------------------

DIFFERENTIAL
INPUT TO U2
(COMPARATOR)

-T------------------~~--------t,~----------------_bL-----~-------------• _____--'L MARGIN

•---------------------------~r
DATA OUT

u

~

REDUCTION

______~rl~___________

b. HFBR-0223/4 ARBITRARY EDGE TIMING UN DISTORTED BUT MAY HAVE REDUCED MARGIN FROM ENCROACHMENT OF NEXT TRANSITION.

Figure 1. Transceiver Response Waveforms

HFBR-0221/-0222 version it is necessary only to make the
time constants of C13 and C14 long enough to couple a
rectangular waveform to the inputs of U2, then set U1 for
high gain and make the thresholds at U2 the value which
provides a threshold-to-noise ratio greater than six. For
the HFBR-0223/-0224 version the time constant of C13, C14
must be less than a third of the shortest time desired
between successive edges. The peak amplitude of pulses
reaching U2 will .be limited by the short time constant, a
situation which can be remedied somewhat by lowering
the gain of U1 (thus raising its bandwidth). This, in turn will
require reduction of the threshold at U2.
There is a limitto how far the U2 threshold can be reduced
without making it too vulnerable to EMI from the transmitting side. Because of these design constraints, the accommodation of arbitrary data format is obtained at the
expense of sensitivity; that is, the HFBR-0223/-Q224 version requires excursions of optical input power slightly
higher than the excursions required by the HFBR-0221/0222 version.
There is also a limit to how much gain adjustment is possible at U1. The maximum possible gain is 400 with R7 = 0,
so the gain increase that is available is approximately 6 dB
(j.e. x4 because of the linear relationship to input power).
Raising the gain by a factor of four permits sensitivity
improvement by the same ratio if the noise bandwidth
is reduced by sixteen times.

4-70

On the transmitting side the difference is very small. Both
versions are operated at the same steady-state input current to the HFBR-1201/-1202 Transmitter LED, but they
have different peak-to-dc current ratios. The purpose of
the peaking is mainly to charge the LED and stray capacitances, so the 2:1 peak-to-dc current ratio in the HFBR-Q221/
-0222 version does not overstress the LED even though
the 80 mA peak exceeds the 40 mA data sheet specification for that part. In the HFBR-0223/-0224 version, the
peaking is slightly reduced to make sure the trailing edge
of the peak will not be sensed by the receiving circuit as a
negative data transition.

CIRCUIT LAYOUT CONSIDERATIONS
In so far as possible, given the limited space, the sensitive
portions of the receiving circuit are spaced away from the
parts of the transmitting circuit that have large excursions
of current and voltage. Components that have no signal
function (power supply decoupling elements) are placed in
the space between the receiving and transmitting circuits
to further enhance the shielding. Traces connecting to
balanced inputs are made as nearly as possible the same
length and closely spaced. Of course, a ground-plane
style of PC board layout is used, and the EMI/ESD Shields
in the HFBR-4201/-4202 Mounting Hardware are installed.
The transmitting side requires only a single +5 V power
supply. Because of the large excursion currents in the

LED, shunt drive is used to minimize reaction on the
power supply, which is shared by the receiving circuit.
There is also decoupling by L1,01,02 in addition to the
+5 V supply input bypass, 01S,016.

With noise reduced by the factor NINo, the threshold may
be reduced by the same factor, and this allows the input
excursion power to be reduced by NINo, while still obtaining Pe < 10-g. If the noise is reduced by filtering, but no
threshold adjustment is made, there is still some sensitivity
improvement, but the improvement factor may be considerably less:

On the receiving side, the -5 V supply has only the input
bypass 06,07 and single decoupling for Ul by L2,Oa.
Since the +5 V supply is shared with the transmitting circuit, considerable decoupling is needed to reduce
interference. For U2 there is the first stage, L4, 04, Os; for
Ul a second stage, L3,09; and for the HFBR-2203/-2204
Receiver a third stage, R4,01O.

PIP o = NINo for threshold adjustment: TIT 0 = NINo
PIP o = 11 + N/N o )/2 for no threshold adjustment
Bandwidth reduction is accomplished by lengthening the
time constant at the output of the HFBR-2203/-2204
Receiver. The bandwidth, B, obtained by doing this is:

SENSITIVITY IMPROVEMENT WITH
DATA RATE REDUCTION

B = 1/[(2 <71"» (Req) (017)]
where
Req = equivalent resistance of Rs and R13 in parallel =
1I111Rs + l/R13)
017 = capacitance added in parallel with Rs

In a well-shielded receiver circuit, sensitivity is not limited
by electromagnetic interference IEMD, but rather by random IGaussian) noise for which the amplitude varies as
the square root of the bandwidth. Sensitivity is defined as
the amplitude of Signal power needed to obtain sufficiently
low Bit-Error Rate  6N to prevent false transition of output
b)
P > IT + 6N) to assure desired transition,
where
N = noise-equivalent input power I!-'W)
T = threshold-equivalent input power I!-'W)
P = excursion amplitude of input power I!-'W)

Bandwidth reduction will, or course, reduce the speed of
response, and therefore the signalling rate will be reduced.
A good rule for relating signalling rate to bandwidth is the
ratio: two baud per hertz; that is, a 2 MHz bandwidth
allows 4 MBd signalling.

Noise reduction by filtering allows sensitivity improvement
by reducing the noise amplitude. The filtered noise has
amplitude, N in a bandWidth, B and the filteredlunfiltered
noise ratio is:
NINo = [B/Bolo.s as described above,
where

A set of recommended component values and the antici-

pated result of such selection is listed in Table 1.

No = reference noise in a bandwidth, Bo
Bo = 25 MHz, the unfiltered 3-dB bandwidth of the
HFBR-2203/4 Receiver

Table 1. Recommended Component Values and Typical Transceiver Performance (0° C to 70° C)
For HFBR-0221/-0222: (0.33 < Duty Factor < 0.67)

1 MBd

5MBd

20MBd

aOM8d

100

100

zero

zero

017 (pF)

3300

680

100

100

R7(ohmsl

zero

20

110

402

R1310hms)

Rs and R9 (ohms)
R1l) and Rn (ohms)

1.0 k

1.0 k

1.0 k

1,0 k

26.1 k

14.7 k

14.7 k

14,7k

17.5

14.0

9,0

6.0

3100

2500

1600

1000

Minimum Power Budget (dB)

I

For Cabling Loss

Cable Length (metres)

I @5.5d8/km

4-71

Table 1. Recommended Component Values and Typical Transceiver Performance (0° C to 70° C) (cont.)
For HFBR-0223/-0224: (0.05 < Duty Factor < 0.95)
1 MBd

5MBd

20MBd

100

100

zero

C17(pFI

3qOO

680

100

R7.Rp
x 100%=
-Rp

5. For (A, f, Ilf) = (820 nm, 100 Hz, 6 Hz) where f is the frequency for a spot noise measurement and l>.f is the noise
bandwidth, NEP is the optical flux required for unity signal/noise ratio normalized for bandwidth.

RAC (PR) - RAC (-25 dBm)
RAC (-25 dBm)

x 100%

where:
RAC = Small signal AC (20 MHz, -30 dBm) response
PR = DC optical power incident on port.

4-75
-------,

..

__._,--_..._-_.. _.----_._---

VR = 5 V; PR
~

1,0

~

0.9

s:-

a:

fil

~

0.6

~

0,5

-20 dBmat 820 nm;,TA = 25°C unless otherwise specified,

"

0,8
0,7

='

1/

",
1\

'"

I

0.3

~

0.2
0,

500

600

900

800

1,0

~

0.996

L

1000

0,390

0,385
I

> 0.380

l-

s:

ijJ
a:
~ 0,370
a:

I

I

~O.972

-40

A -WAVELENGTH -nm

-20

20

40

60

80

I

:il-~
U

~

~
I

V

1,5

I

1.0

"\~ -~"

TA -AMBIENT TEMPERATURE -"C

!Il

...
~

1.5

''a:""

1.25

I

1,0

1\'\

0.5

-55

150

/

25

100

50

30

5

/
15

10

Figure 6. 3 dB Bandwidth vs. Reverse
Voltage

10

a:

-'

'\

~

~

-35

-15

v -......

~

t\..

a:

";!;

"

25

~

~
45

~

65

,

-5

a:

-.......

I

IE~

85


~
>
~

-5

25

. - - - - ...- - - - _ .

TRANSMITTER
HFBR·1203
SMUI

,. -

~~------------~

-

-

..,

I
-'t-'
-'t-'

HP4145
SEMICONDUCTOR
PARAMETER
ANALYZER

I

I

I

1.; __ ....
HFBR·JOOO/1
SMU2
SMU3
SMU4

VS,

OUT
HFBR·2207/·220B

Figure 9. Test Set-up

HP 9836
COMPUTER

HP8505A
NETWORK
ANALYZER
RFR A B

RF R A B
PORT 2
BIAS IN

HFBR·3000/·3001
(I METRE LENGTH)

HP850JA
S-PARAMETER
TEST SET

'...----...,
,"'-----'

./

PORT I

Figure 10. Bandwidth Measurement Set-up

Mechanical Description
metal shield which snaps directly on the mounting bracket
is also available for unusually severe EMIIESD environments. When mounted in the horizontal configuration, the
overall height of the component conforms with guidelines
allowing printed circuit board spacing on 12.7 mm (0.500)
centers. A thorough environmental characterization has
been performed on these products. The test data as well
as information regarding operation beyond the specified
limits is available from any Hewlett-Packard sales office.

The HFBR-2207 and 2208 fiber optic receivers are housed
in rugged metal packages intended for use with the HP or
SMA style connectored fiber cables. The low profile package is designed for direct mounting on printed circuit
boards or through panels without additional heat sinking.
A flat on the mounting threads of the device is provided to
prevent rotation in all mounting configurations and to provide an orientation reference for the pin-out. Hardware is
available for horizontal mounting applications on printed
circuit boards. The hardware consists of a stainless steel
mounting bracket fastened directly to the printed circuit
board with two stainless steel self-tapping screws and a
nut and washer for fastening the device in the bracket. A

Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressed air often is sufficient to remove particles of
dirt; methanol or Freon'· on a cotton swab also works well.

4-77

__._ ..

EMI/ESD SHIELD

DIMENSIONS FOR BULKHEAD
MOUNTING HOLE

'~2b,m
~~6.251.2501
DIA.

(STANDARD 1/4 INCH "0" HOLE - RU PUNCH)
MOUNTING HARDWARE: HFBR·4201 (HFBR·2207)
1 EMI/ESO SHIELD
1 1/4-32 NUT
1 1/4 x .005 INCH WASHER
2 2-56 SELF TAPPING SCREWS
1 MOUNTING BRACKET

2-56 SELF TAPPING SCREWS
(METRIC EQUIV. M2.2 x 0.45)

MOUNTING HARDWARE: HFBR·4202IHFBR·2208)
1 EMI/ESD SHIELD
1 1/4-36 NUT
1 1/4x .005 INCH WASHER
2 2-56 SELF TAPPING SCREWS
1 MOUNTING BRACKET

~

~

Rs

Horizontal PCB Mounting
Mounting at the edge of a printed circuit board with the
lock nut overhanging the edge is recommended.
When bending the leads, avoid sharp bends right where
the lead enters the backfill. Use needle nose pliers to support the leads at the base of the package and bend the
leads as desired.
When soldering, it is advisable to leave the protective cap
on the unit to keep the optics clean.

Application Information
NOISE FREE PROPERTIES

The noise current of the HFBR-2207/8 is negligible. This is
a direct result of the exceptionally low leakage current, in
accordance with the shot noise formula IN = (2qlotlf)1/2.
Since the leakage current does not exceed 300 picoamps
at a reverse bias of 20 volts, shot noise current is less than
9.8 x 10-15 amp Hz-1/2 at this voltage.

Figure 11. Photodiode Equivalent Circuit

Is = Signal current ~ 0.38 ,.,A/,.,W x PR
IN = Shot noise current
< 9.8 x 10-15 amps/Hzl/2
10 = Dark current
< 300 x 10-12 amps at 20 V dc bias

Rp = 1011 fl
Rs = 10 fl
LINEAR OPERATION

Operation of the photodiode is most linear when operated
with a current amplifier as shown in Figure 12.

Excess noise is also very low, appearing only at frequencies below 10 Hz, and varying approximately as l/f. When
the output of the diode is observed in a load, thermal noise
of the load resistance (RL) is 1.28 x 10-10 (RL)-1/2 X (tlf)1/2 at
25° C, and far exceeds the diode shot noise for load resistance less than 100 megohms. Thus in high frequency
operation where low values of load resistance are required
for high cut-off frequency, the HFBR-2207/8 contributes
virtually no noise to the system.

R, "" R2
VOUT = R,

up + 10)

--OJ

...--'vv_._Go"'>-----peak )
xcur$lon
2

bp

22

k

0.8

N.A.

JiW

-

0.5

-

=OAV

Data Input Low
Vce=4.76V
Mode Select Data Input High or Low
Vcc= 5.2SV
Low

Mode Select Low

Data Input High
Data Input Law
Data Input
Square Wave
at 600kHz

1,
2

1,
2.
3
1

Mode Select Low

5

-

9

7

3

DC

200

lJm

aA

from numerical aperture
mismatch

dB

aNA

6.0
4.0
700

nm

:\p

5.25V, VI

Mode Select High

32
1.2

Note

Mode Select Data Input Hijlh
High
Vcc=5.25V

from area mismatch

Peak Emission Wavelength

~

Mode Select High

35

Fig,

2

125

95

PL
PM

Optical Port (fiber optic core) Diam.
Coupling
Loss

1-1•6
-0.6

mA

PH

Exit Numerical Aperture

VCC; 6.25V, VI = 2.4V

40

High Level
Low Level
Mid Level (average)

Amplitude Symmetry,Flux Excursion Ratio

lJA

170

Internally-Coded
Made

Conditions

100
20

1

ICC

Optical
Power

Min Typ(6) Max Units

with HFBR·3000 Cable/Connector
Assembly

4

Dynamic Characteristics aoe to 7aoe Unless Otherwise Specified
Parameter

Propagation
Delay

Symbol Min TyJ6 Max Units

High-ta-Low Data Input
Voltage Step

tPHL

31

ns

Low·ta-High Data Input
Voltage Step

tPLH

35

ns

Refresh Pulse
Internally-Coded Mode

I

I

Duration
Repetition Rate

tp

60

os

fR

400

kHz

Conditions

Fig. Note

Vce = 4.75 V

1

8

Vce = 5.00 V, Mode Select Low

1

8

4-81
-

-~-------.----

-

~-----~~

..

----------

flFSR·1001
OPTICAL
TRAlliSMITTEI\

DATA INPUT

OPTICAL OUTPUT
WITH

MODE SELECT LOW

OPTICAL OUTPUT
WITH
MODE SELECT HIGH

~----------------------------~'~j---------------,
15%--1----

~==~----------------~I~!----~~~~~============~.t
Figure 1. Optical Power Coding and Timing Diagram.

Vee

DATA
INPUT

LED

FIBER STUB

MODE
SELECT

OPTICAL
PORT

Figure 2. Schematic Diagram.

640

e-

660

680

700

720

740

760

i\ - WAVELENGTH - nm

OFF-AXIS ANGLE - DEGREES

Figure 4. Emission Spectrum.

Figure 3. Radiation Pattern:

"The optical fiber is recessed within the barrel at a distance of approximately 7mm. Solid line represents radiation pattern from fiber
stub without obscuration by connector barrel. Dashed line represents radiation pattern as seen from outside of connector.

Notes (cont'd):
3. Measured at a point 2mm (.079 in.) from where lead enters
package.
4. A supply decoupling network of 2.2/tH with 60/tF is
recommended.
5. Average currents for steady-state conditions at Data Input.
6. For typical values, Vcc = 5.00V and TA = 25°C.
7. Optical power excursion ratio, k, is the ratio of optical power
excursion above mid level to optical power excursion below mid
level.
k = PH - PM
PM-PL

8. The refresh pulse is interrupted (abbreviated) if Data Input
changes state dudng the refresh pulse. MAX propagation delay
is for Data Input changing state during the maximum excursion
of the refresh pulse.
9. Optical power excursion
dP = 0.5 (PH - PL), or dP = 0.5 (PM - PL) • (Hk).
Notice that under the conditions specified for dP, the average
flux is (dP -+ PL).

4-82

~-------~--.--------------------~

Electrical Description
The HFBR-1001 has two modes of operation: Internally-Coded
mode and Externally-Coded mode. These are selected by
making the Mode Select input "low" for Internally-Coded mode
and "high" for Ex1ernally-Coded mode. With Mode Select
"low," the optical signal generator in the HFBR-1001 produces
a "mid-level" optical power which has positive or negative
excursions, depending on whether Data Input is "high" or
"low." In this Internally-Coded mode, a train of positive
excursions is initiated when Data I nput goes "high;" when
Data Input goes "low," a train of negative excursions is
initiated. These excursions are pulses of approximately 60ns
duration with a 400 kHz repetition rate. Each initiation of a
pulse train starts with a full-duration pulse, but when Data
Input changes state, the train is terminated - even at midpulse - as a new train of opposite-polarity pulses is initiated.
With this coding scheme and the low duty factor, the average
optical power is always near the mid-level, regardless of the
data rate or duration in either state. This coding scheme is
designed to operate the HFBR 2001 Fiber OptiC Receiver
most effectively; the mid-level flux operates the Receiver's
dc-restorer and the "refresh" pulses of either polarity keep the
Receiver's ALC voltage at the proper level, allowing low
propagation delay for any change of state at Data Input. The
Internally-Coded mode permits transmission of analog
information, e.g., by means of Pulse Width Modulation.
Another advantage of the 3-level Internally-Coded mode is
that supply current is nearly the same for either logic state,
this reducing transients on the power supply line.

Mechanical and
Thermal Considerations
Typical power consumption is less than 500mW so the transmitter can be mounted without consideration for ex1ernal heat
sinking. The optical port is an optical fiber stub centered in a
metallic ferrule. This ferrule supports a split-wall cylindrical
spring sleeve which aligns the ferrule in the Transmitter with
the ferrule in the HFBR-3000 Fiber OptiC Cable/Connector.
The connection procedure is to FIRST start the Connector
ferrule into the sleeve; THEN screw the coupling ring on the
barrel. The barrel performs no alignment function; its
purpose is to hold the ferrule faces together when the
coupling ring is tightened as specified in the HFBR-3000
Fiber Optic Cable/Connector data sheet.
The HFBR-1001 should be mounted so that the lock nut at the
optical port is not disturbed. Moving the lock nut can cause
misalignment of the optical fiber stub inside the module resulting in a reduction of power output. Mounting at the edge of a
printed circuit board with the lock nut overhanging the edge is
recommended.
Good system performance requires clean ferrule faces to
avoid obstructing the optical path. Clean compressed air often
is sufficientto remove particles of dirt; methanol or Freon'· on
a colton swab also works well. If it is absolutely necessary to
remove the threaded barrel and lock nut to clean the
transmitter ferrule face, refer to the section "Installation
Measurement and Maintenance" in Hewlelt-Packard Application Note 1000.

With Mode Select "high," the optical signal is at full maximum
(-2 X mid level) when Data Input is "high," and nearly zero
when Data Input is "low." This mode provides for these three
applications:
1. Steady state turn-on of the photo-emitter at maximum flux
level (e.g., for system diagnosis).
2. Stand-by mode (e.g., when the system is not in use).
3. Transmission of 2-level optical signals from ex1ernally
generated code (e.g., Manchester) for receivers not configured for the 3-level code. With Mode Select "high," the
output is either PH, or PL. Direct analog operation is not
possible due to hysteresis in the response of the optical
signal to the Data Input signal.

4-83

._----

---------------~--~-~.---

FliD'l

HEWLETT

a:~ PACKARD

FIBER OPTIC 1250m
HIGH PERFORMANCE HFBR-1002
TRANSMITTER MODULE
TECHNICAL DATA

JANUARY 1986

Features
• PIN COMPATIBLE WITH HFBR-1001
TRANSMITTER
• TRANSMISSION LENGTH: 1250 METRES*
• DATA RATE: DC TO 10 Mbaud*
• NO DATA ENCODING REQUIRED*
• TTL INPUT LEVELS
• FUNCTIONAL LINK MONITORING*
• SINGLE +5V SUPPLY
• PCB MOUNTABLE, LOW PROFILE
• INTEGRAL, HIGH QUALITY OPTICAL
CONNECTOR
• LOW POWER CONSUMPTION
'When used with HFBR-2001 Receiver and any Hewlett Packard
HFBR-3000/-3100 Series Cable/ConnectorAssembly.

Description
The HFBR-1002 fiber optiC transmitter is an integrated electrical to optical transducer designed for digital data
transmission over single optical fiber channels. A bipolar integrated circuit and a high efficiency GaAIAs LED convert
TTL level inputs to optical pulses at data rates from dc to 10 Mbaud (see note 5). An integral optical connector on the
module allows easy interfacing without problems of fiber alignment. The low profile rugged industrial package is
designed for direct circuit board mounting without additional heat sinking on printed circuit boards with 12.7 mm (0:5")
card rack spacing.
The HFBR-1002 is intended for use with Hewlett-Packard fiber optic cable/connector assemblies, and t~e HFBR-2001
fiber optic receiver for transmission distances to 1250 metres. It is a direct replacement for extending links currently using
the HFBR-1001 (100 metre) transmitter to give 1250 metre capability. The HFBR-1002 generates optical signals in either of
two externally selectable modes. True dc response (data high or low for arbitrary time interval) is available when using the
Internally-Coded mode.
WARNING: OBSERVING THE TRANSMITTER OUTPUT FLUX UNDER MAGNIFICATION MAY CAUSE INJURY TO
THE EYE. When viewed with the unaided eye, the near IR output flux is radiologically safe; however:whenviewed under
magnification, precaution should be taken to avoid exceeding the limits recommended· in ANSI Z136.1-1981.

package Dimensions
BARRE~

~LOCKNUT

r±

THD'1r];

.96MAX

{.0381

7.92

(.3121

CAUTION:
1. LOCK NUT AND BARREL SHOULD
NOT BE OISTURBED.
2. SCREWS ENTERING TilE 2.56
THREADED MOUNTING HOLES
MUST NOT TOUCH BOTTOM.
3. THE CONNECTOR SHOULD NOT BE
TIGHTENED BeYOND THE LIMITS
SPECIFIED IN THE HEWLETTPACKARD CABLE! CONNECTOR
DATA SHEET (FINGER TIGHT).

,

PIN

•.67, .25
(.I05f .010)

10.18 '.25

~400'.OIO)

~84

2
3
4
5

FUNCTION
MODE SELECT
N.C.
GROUND
Vee

DATA INPUT

NOTES:
1. DIMENSIONS 111/ mm (INCHES)
•. UNLESS OTHERWiSE sPECIFIED
THE TOLERANCE ON ALL
DIMENSIONS IS ,.38mm )•.0'5")

Recommended
operating Conditions

Absolute
Maximum Ratings
Operating Temperature

I

Lead Soldering

I

"e

"e

Ambient Temperature

TA

TA

0 +70

"e

Supply Voltage

Vee

4.75 5.25

V

260

"e

VIH

2.0

Vee

V

10

S

High Level Input Vollage,
Mode Select or Data Input

6

V

VIL

0

0.8

V

Time

Vee

-0.5

3

Low Level Input Voltage,
Mode Select or Data Input

Mode Select or
Data Input Voltage

+70

0

TS

-55 +85

Temperature

Supply Voltage

Symbol Min Max Units Not.

Parameter

Symbol Min Max Units Note

Parameter

Storage Temperature

VI

-0.5

5.5

V

Data Input Voltage Pulse
Duration (high or low)

tH, tL

100

Q

Transmission Distance

1250

4

ns

5

m

6

Electrical/Optical Characteristics DOC to+7DoC Unless Otherwise Specified
Parameter
Optical
Power

Transmitter
Output

Symbol

peak-to-peak

Po

2

Min.
13

50
High Level

TypJ7J
-11

Max.

Units
dBm

80

Low Level

PL

5

Mid Level

PM

85

Fig. Nole

Data Input
Square Wave
at 500 kHz

Mode Select
High

Data Input High

Mode Select
Low

Data Input Square
Wave at 500 kHz

p.W

165

PH

Conditions
Mode Select
High

p.W

1,2.
3,5

8

Data Input Low

Fixed Coupling Loss

(iF

1.5

>300m

12

Output Optical Power Coupled into
HFBR-3000 Fiber Cable/Connector
Assembly. 100/140 I'm

Pr

-12.5

dBm

Mode Select
High

Data Input
Square Wave
at 500 kHz

13

Output Optical Power Coupled into
501125 p'm Fiber

Pr

-21

dBm

Mode Select
High

Data Input
Square Wave
at 500 kHz

14

Output Optical Power Coupled mto
Siecor 100/140 I'm Fiber Cable
or equivalent

Pr

-14.5

dBm

Mode Select
High

Data Input
Square Wave
at 500 kHz

15

-

Mode Select Low

Amplitude Symmetry. Flux Excursion Ratio

k
NA

0.8

Optical Port (fiber optic core) Diam.

Dc

c

Peak Emission Wavelength

'\PK

Exit Numerical Aperture

High Level
Input Current

Data Input

Low Level
Input Current

Data Input

Supply
Current

Mode Select

dB

1.2
0.3

-

100

I'm

820

with HFBR-3000/3100

f.lA

= 5.25 V. VI = 2.4 V

IlL

r---{l.6

-1.6

mA Vee - 5.25 V. VI - 0.4 V

lee

170

mA

68

Dynamic Characteristics
Propagation
Delay

Low-to-High Data Input
Voltage Stap

RefreSh Pulse
Internallv-eoded Mode

I
I

2

20

Internally-Coded Mode

Parameter

9

4
Vee

Mode Select
High

40

High-la-Low Data Input
Voltage Step

1

3

nm
100

IiH

Mode Select

Externally-Coded Mode

5.4

Data Input High
Vee 525 V

1.2

10

Data Input Low
Vee 4.75 V

=

95

125

Mode Select
Low

Data Input High or
Low. Vee = 5.25 V

DOC to 7DoC Unless Otherwise Specified

Symbol Min

TyJ71 Max Units

tPHL

34

ns

tPLH

32

ns

Fig. Note

Conditions

Vee=4.75V

Duration

tp

40

ns

Repetition Rate

fR

400

kHz

1

11

1

11

Data Input Square Wave at 500 kHz

Vee = 5.00 V, Mode Select Low

4-85
~~------

...--- .. -

----.--~~-

...----.--- ..

~~~~-.

-~~~~~~~~~~~-

HFeR·1002
OPTICAL
TRANSMITTER

DATA INPUT

OPTICAL OUTPUT
WITH
MODE SELECT LOW

OPTICAL OUTPUT
WITH
MODE SELECT HIGH

~----------------------------~II~--------------,
75%--1----

~====~

________________________~!I~______~2:5o/.~.~~=======================:.

t

Figure 1. Flux Coding and Timing Diagram.
Vee
4

DATA
INPUT

/.

~T

MODE
SELECT

OPTICAL
PORT

GROUND

Figure 2. Schemalic Diagram.

~;:;-?--T:r;r'-'..-;=r-,r'-'T'--' 0.25 ~ I~

1.2

,

I

O'c

1.0

If l..:wC
\1
J

0.8

I
II 1/

0.6

~I~
<:'

d .•

IV V

o~

"

\

1\\ 1\
\1\.
I'\.:'

YI/

02

760

I

f1,'I70'c
1\\ 1\

Vv
780

800

820

840

j':~

860

880

A - WAVELENGTH - nm

Figure 3.

Figure 4. Emission Spectrum.

'The optical fiber is recessed within the barrel at a distance of approximately 7mm. Solid line represents radiation pattern from fiberstub
without obscuration by connector barrel. Dashed line represents radiation pattern as seen from outside of connector.
Notes (cont'd):
3. Measured at a point 2mm (.079 in.) from where lead enters
package.
4. A supply decoupling network of 2.21'H with 60l'F is
recommended.
5. With NRZ data, 10 Mbaud corresponds to a data rate of 10
Mbits/second. With other codes, the data rate is the baud rate
divided by the number of code intervals per bit interval. Selfclocking codele.g., Manchester! usually has two code
intervals per bit interval giving 5 Mbits/second at 10 Mbaud.
6. With Hewlett-Packard HFBR-2001 and HFBR-3000 Series
Cable/Connector Assembly.
7. For typical values, Vee = 5.00V and TA = 25°C.
B. Thetransmitter output, PT, equals the optical power excursion,
..lP = I PH - PL 1/2. Notice that under the conditions specified
for ..lP, the average optical power is I PH + PLI/2.
9. Optical power excursion ratio, .k, is the ratio of optical power

10.
11.

12

13.

excursion above mid level to optical power excursion below
mid level.
PH-PM
k = PM -'.PL
Average currents for steady-state conditions at Data Input.
The refresh pulse is interrupted labbreviated) if Data Input
changes state during the refresh pulse. MAX propagation
delay is for Data Input changing state during the maximum
excursion of the refresh pulse.
When used with the HFBR-3000/3100 cable assemblies, the
total insertion loss ("TI is calculated as follows:
"T = 8.4 dB; Q :s 300m
"T = "F + "0' Q /1000; Q > 300m
Where "0 = Cable attenuation at 820 nm; Q = cable length
(metresl .
Measured at the end of 1.0 metre HFBR-3000 Fiber Optic
Cable with large area detector and cladding modes stripped,

Electrical Description

1. Steady state turn-on of the photo-emitter at maximum
flux level (e.g., for system diagnosis).
2. Stand-by mode (e.g., when the system is not in use).
3. Transmission of 2-level optical signals from externally
generated code (e.g., Manchester) for receivers not
configured for the 3-level code. With Mode Select
"high," the output is either PH, or PL. Direct analog
operation is not possible due to hysteresis in the
response of the optical signal to the Data Input signal.

The HFBR-1002 has two modes of operation: InternallyCoded mode and Externally-Coded mode. These are
selected by making the Mode Select input "low" for
Internally-Coded mode and "high" for Externally-Coded
mode. With Mode Select "low," the optical signal
generator in the HFBR-1002 produces a "mid-level" optical
power which has positive or negative excursions, depending
on whether Data Input is "high" or "low". In this InternallyCoded mode, a train of positive excursions is initiated when
Data Input goes "high," when Data Input goes "low", a train
of negative excursions is initiated. These excursions are
pulses of approximately 40ns duration with a 400kHz repetition rate. Each initiation of a pulse train starts with a fullduration pulse, but when Data Input changes state, the train
is terminated - even at mid-pulse - as a new train of
opposite-polarity pulses is initiated. With this coding
scheme and the low duty factor, the average optical power is
always near the mid-level, regardless of the data rate .or
duration in either state. This coding scheme, which is transparent to the user, is designed to operate the HFBR-2001
Fiber Optic Receiver most effectively; the mid-level flux
operates the Receiver's dc-restorer and the "refresh" pulses
of either polarity keep the Receiver's ALC voltage at the
proper level, providing data format independence (no data
encoding required) over the data rate range of dc to
10M baud. The I nternally-Coded mode permits transmission
of analog information, e.g., by means of Pulse Width Modulation. Another advantage of the 3-level Internally-Coded
mode is that supply current is nearly the same for either logic
state, thus reducing transients on the power supply line.

Mechanical and
Thermal Considerations
Typical power consumption is less than 500mW so the
transmitter can be mounted without consideration for
external heat sinking. The optical port is an optical fiber
stub centered in a metallic ferrule. This ferrule supports a
split-wall cylindrical spring sleeve which aligns the ferrule
in. the Transmitter with the ferrule in the Hewlett-Packard
Fiber Optic Cable/Connector Assembly. The threaded
barrel performs no alignment function; its purpose is to
hold the ferrule faces together when the coupling ring is
tightened finger-tight as specified in the Hewlett-Packard
Fiber Optic Cable/Connector data sheet.
The HFBR-1002 should be mounted so that the lock nutat
the optical port is not disturbed. Moving the lock nut can
cause misalignment of the optical fiber stub inside the
module resulting in a reduction of power output.
Mounting at the edge of a printed circuit board with the
lock nut overhanging the edge is recommended.

With Mode Select "high," the optical signal is at full maximum (-2 X mid-level) when Data Input is "high," and
nearly zero when Data Input is "low." Used in this mode
with the HFBR-2001 Receiver, the user must provide
proper data formatting (e.g., Manchester or Bi-Phase
coding, explained in HFBR-2001 data sheet) to ensure
proper receiver operation. This mode provides for these
three applications:

Good system performance requires clean ferrule faces to
avoid obstructing the optical path. Clean compressed air
often is sufficient to remove particles of dirt; methanol or
Freon'· on a cotton swab also works well. If it is absolutely
necessary to remove the threaded barrel and lock nut to
clean the transmitter ferrule face, refer to the section
"Installation Measurement and Maintenance" in HewlettPackard Application Note 1000.

x

"it
"~

I-

o

a:

~

~

1.2

I-

1.0

"::;

0.8

«
a:

-

t-

r--

W

N

«

:;

0.6

a:

o
z
I

_I"
'Go.t

1::.

t--

'[n

£:!

0.4
0.2
-10

10'

20'

30'

40'

50'

TA - AMBIENT TEMPERATURE -

60'

70'

"c

Figure 5. Normalized Transmitter Output Flux vs. Temperature.

4-87
---------------.------

rh:'

HEWLETT

a:~'PACKARD

FlBER OPTIC
HIGH PERFORMANCE
RECEIVER MODULE

, HFBR-2001

TECHNICAL DATA JANUARY 1986

Features
•
•
•
•
•
41

•
•
•

DATA RATE: DCTO 10 Mbaud*
LOW NOISE: 1(t'1 BER WITH 0.81L,W INPUT*
NO DATA ENCODING REQUIRED*
TTL OUTPUT LEVELS
FUNCTIONAL LINK MONITORING*
OPTICAL POWER INPUT INDICATION
SINGLE +5V SUPPLY
PCB MOUNTABLE, LOW PROFILE
INTEGRAL, HIGH QUALITY OPTICAL
CONNECTOR.

·When used with HFBR~1001/-1002Transmitters and any Hewlett
Packard HFBR-3000/-3100 Series Cable/Connector Assembly.

Description
HFBR-2001 fiber optic receiver is an integrated optical to electrical transducer designed for reception of digital data over single
fiber channels. A silicon PIN photodetector and a bipolar integrated circuit convert optical pulses to TTL level ()utputs with an
optical sensitivity of .81L W, and data rates to 10 Mb/s NRZ. An Integral optical connector on the module allows easy Interfacing
without problems of fiber/detector alignment. The low profile package Is designed for direct printed'circuit board mounting
without additional heat sinking.
The HFBR-2001 is intended for use with HFBR-3000.fiber optic cable/connector assemblies and the HFBR-1001/1002 fiber
optic transmitters. In order to provide wide dynamic range, dc response, and high sensitivity, the receiver must periodically
extract information from the optical waveform. When operating with a transmitter in the internally-coded mode, this information
is automatically provided by the transmitter. When operating in' the externally-coded mode, or with another transmission
source, the user must provide proper data formatting to insure proper receiver operation.

An additional TTL output called Link Monitor (LM), provides a digital indication of link continuity independent of the presence of
data. Link continuity is indicated by a logical high output state.

package Dimensions
CAUTION:
1. ~OCK NUT AND BARRe~ SHOU~D
NOT BE OISTURlleo.
2, SCREWS ENTERING THE 2.e6
THREAOED MouNTING HOUS
MUSTNQT 'lWCH SOTTQM.
3. THE CQNNECTQR SHOUW NOTBE
TIGHTENED BEYOND THe LIMITS
SPECIFIED 'NTtlE liEWLETT,
PACKARD CABLe! CQNNECTOR
DATA SHeET {fliNGER fiGHT!.

PIN
1
2
3
4

5

FUNCTION
TEST POINT
LINK MONITOR
GROUND
Vee

DATA OUTPUT

IIIOTIlS:
1. OIMENSIONSIN mM (INCHES!
2. uNlESS QTHERW'SE speCIFIED
THE TQLERANCE ON A~L
DIMENSIONS IS t 0,38""" (. 0.015")

4-88

-----._.. - - - - - - -

~~~~~~-

Absolute Maximum Ratings
Symbol

Parameter
Storage Tumperature
Operating

Temper~ture

I

Lead Soldering

I

Cvcle

Min

Mal<

Units

TS

-55

85

'C

TA

0

70
260

'c
'c

10

s

Tem~rature

Time

Supply V91tage

Vec

Output Voltage (H,jgh S~tel

VQH

"-0.5 •••.

Note

3

6.0

V

6.0

V

Units

Recommended Operating Conditions
Parameter
Ambient Temperature
Supply Vollage
SupplV Ripple (Peak-la-Peak)
High Level
Link Monitor

I

Output CUrrent I Data OutpUt
Low Level Output Current
AVI1,age Input Optical Power
Peak-la-Peak Input Optical Power
Optical Input
2-Level I High Level
Lew Level
Pulse Duration Code
Flux Excursion Ratio
and Timing
High Level
3-Level

SymbQI

Niin

Max

TA

0
4.75

70
5.25

'C

250
-100

mV

VCC
AVCC

8

rnA

0.8

70

1,6

140

i"W
i"W

100

5000

ns

0.75

1.25

tH
k

tH

Refresh Repetition Rate
Refresh Duty Factor

ns
6,7

0.05
150

tM
IR
fRlH,fRIL

6

7

50

tL

4

MA

-400

tOL
PM
PH-PL

Low Level
Mid Level

Code

V

IOH

tL

Note

a

I'S

kHz
0.04

Electrical/Optical Characteristics aoe to 7aoe Unless Otherwise Specified
Symbol Min T yp5 Max

Parameter
High
Output
Voltage

Unit$

Conditions

Fig. Note

II

P ~ (PM +0;8 MWI. 10 ~ -400 MA Vee

Data OutPut
VOH

2.4

2.85

V

m

State
Link Monllor
AP ~ O.S pW. 10 ~ -100 MA
4.75 V
r-----~-------------;----~r__+--~r_--r_--+_--------~,_--------~----_;
Low

Data Output

3

VOL
r-____~~S_t_at_e~__L_in_k_M_o_n_it_o_r____+_----~
Test Point VOltage

0.35

P ~ (PM -0.8 MWll 10 ~ 8 mA

0.5

1,2 7,9

__v~c~e~e_4_._75__V______;_--;_--_1

V -+_A_P_=_0______~I
__00_·2-r_O_.4-r__

VT

PM =1OQj.tW
V

1.3

PM

10

=0

r--+__7_7;-1_0_04 mA ~V-e~e~=-5-.2-5-V------------------__4
60
77
Vce = 4.75 V

Supply Current
Optical Port (fiber optic core) Diameter
Numeric.1 Aperture

200
N.A.

0.5

770

Peak ResponsivitY Wavelength

4

nm

Dynamic Characteristics aoe to 7aoe Unless Otherwise Specified
Symbol Min TypS Mall Units

Parameter

Propagation
Delay

Link Monitor
Respen." Time

High

3· Level Code

to Low

2-Level Cod"

Low to

a-Levltl Code

High

2-Le\lel Cod"

I

I

.

tpHL

Lew-to-High
High-to-Low

Bit Error Rate at 10M baud

SER

11
VCC~

I

4.75 V, k = 1, Link Monitor High

1

I-12

os

-
20

HL

Fig. Note

tiS

37
37

tPLH

Conditions

29

ms

1000

10-9

4-89

VCC = 4.75 V

Ap~0.8MW

IOL"'SmA

Peak-to-Peak

. k m 1, AI''' 0.(; j.tW

I

~:
15

DATA INPUT TO TRANSMITTER (HFBR·1001, INTERNALLY CODED) OMITTING TRANSMISSION DELAY

(I
J-LEVEL CODED FLUX AT RECEIVER INPUT

"SV~ ____ ~PLH-

r

tPHl

1 , . - - - -__
- ,\ __ - - -

------ b,- ~- --, lIfR '" REFRESH INTERVAL <5,us

~ - C~

DATA INPUT TO TRANSMITTER, E.G. MANCHESTER (HFBR·1001 EXTERNALLY CODED) OMITTING TRANSMISSION DELAY

2·LEVEL CODED FLUX AT RECEIVER INPUT

Figure 1. Optical Input Timing Requirements.

Notes (cont'd):
3. Measured at a point 2mm (.079") from where the lead enters
the package.
4. If ripple exceeds the specified limit, the regulator shown in
Figure 5 should be used. The lC !mer shown in Figure 5 is'
recommended whether the regulator is used or not.
5. For typical values, VCC = 5.00V and TA = 25°C.
6. Optical power is average over an interval of at least 50 J.ls.
Optical power values specified are for the equivalent of a
monochromatic source between 700nm and 820nm.
7. For either 2-level or 3-level code, k = (PH - PMi/(PM - PLIo
8. For the HFBR-2001, a 3·Level Code is defined as having a
mid-level, with equal-amplitude and pulse width excursions to
high·level or to low-level.
9. link Monitor provides a check of link continuity. A low Link
Monitor 'output indicates that the optical signal path has been
interrupted. For example, it might indicate a broken cable or
a loose, dirty, or damaged connector. The link may still be
operational with link Monitor low, but it should be checked
to determine the cause of the low indication. When the
source of optical power is an Internally-Coded HFBR1001/1002 Fiber Optic Transmitter, Link Monitor high will be a
valid indication of link continuity whether or not data is being
transmitted. An optical input with excursions ("Pi greater
than or equal to 0.8J.1W is sufficient to hold Link Monitor high.
'10. When observing VT, use a voltmeter with at least 10Mn input
resistance. With zero input optical power, VT is at its maximum value, VT,MAX. Then when flux is being received,
whether modulated or not:
(VT,MAX - VTi = (25k!1)(lpi = (25kn)(RpPMi
where Ip = average photodiode photocurrent
Rp ~ OAAIW = photodiode responsivity
PM = average flux being received
11, Measured from the time at which optical input crosses the 25%
level until DATA OUTPUT = 1.5V in Hl transition.
12. Measured from the time at which optical input crosses the 75%
level until DATA OUTPUT = 1.5V in lH transition.

r - - - -.-_____t-_~-.J..::.:4Vee
I

I
I

.L

OPTICAL __
PORT
--...

I

t-_+_..!.I",s DATA
I

OUTPUT

I
.-I--J.":" TEST
I
L-""'tv-+~----+-'
I P~INT
I
I
I
3
L ____L..._....._-_--_--+-~......-J,..:GROUND

Figure 2. Schematic Diagram.

13, Measured from the time at which optical input fluctuation begins
until LINK MONITOR rises to 1.5V.
14. Measured from the time at which optical input fluctuation ceases
until LINK MONITOR falls to 1.5Y.
15. W~h NRZ data, 10Mbaud corresponds to a data rale of
10Mb/s. With other codes, the data rate is the baud rate divided
by the number of code intervals per bit interval-self-clocking
code (e.g., Manchester) usually has two code intervals per
M interval giving 5Mb/s at 10Mbaud.

4-90

Electrical Description
Flux enters the HFBR-2001 via an optical fiber stub where a
PIN photodiode converts it to a photocurrent. This photocurrent goes to an I-V (current-to-voltage) amplifier which utilizes
both dc feedback and ALC (automatic level control).
The function of dc feedback is to keep the average value of
the signal centered in the linear range of the amplifier. The dc
feedback amplifier has a high impedance output to establish
a long time constant on a capacitor at its output. (The voltage
on the capacitor is observable at the test point). As seen in
the schematic diagram, the voltage on this capacitor extracts
the average component of photocurrent from the input of the
I-V amplifier so its average output is at a fixed level. Optical
flux excursions above and below the average cause voltage
excursion above and below the fixed level at the output of the
I-V amplifier.
The voltage excursions operate a flip-flop whose output drives
the Data Output amplifier; an excursion above the average
level sets the data output high, where it remains until an
excursion below the average level resets the flip-flop.
To prevent overdrive, an ALC circuit, responding to excursions
either above or below the average level, controls the gain of
the I-V amplifier. Gain is then determined by whichever polarity of excursion is the greater. If these excursions are too far
from being balanced, the gain limitation imposed by the larger
excursion may cause the smaller (opposite polarity) excursion
to be too small to operate the flip-flop.

The Link Monitor output is driven by an amplifier which responds to the ALC voltage. The Link Monitor is high when the
flux excursions are greater than or equal to 0.8IJW.

Mechanical and Thermal
Considerations
Typical power consumption is less than 500mW so the Receiver
can be mounted without consideration for additional heat
sinking. The optical port is an optical fiber stub centered in a
metallic ferrule. This ferrule supports a split-wall cylindrical
spring sleeve which aligns the ferrule in the Receiver with the
ferrule in the HFBR-3000 Fiber Optic Cable/Connector, The
connection procedure is to FIRST start the Connector ferrule
into the sleeve, THEN screw the coupling ring on the barrel.
The barrel performs no alignment function; its purpose is to
hold the ferrule faces together when the coupling ring is
tightened as specified in the HFBR-3000 Fiber Optic
Cable/Connector data sheet.
Good system performance requires clean ferrule faces to
avoid obstructing the optical path. Clean compressed air often
is sufficient to remove particles of dirt; methanol or Freon no on
a cotton swab also works well. If it is absolutely necessary to
remove the threaded barrel and lock nut to clean the Receiver
ferrule face, refer to the section "I nstallation Measurement and
Maintenance" in Hewlett-Packard Application Note 1000.

'The optical fiber is recessed within the barrel at a distance of
approximately 7mm. Solid line represents reception pattern at fiber
stub without obscuration by connector barrel. Dashed line
represents reception pattern as seen from outside of connector.

80'

90"f---+--+--f--1--3

40'

50'

8 - OFF·AXIS ANGLE - DEGREES

Figure 3. Reception Pattern."

_~

,.

I

I I

' I I

0

VI

~

/'

~

a:
I

,;

6·
4

2

,

I

I
~ • 'Tj r- _. -t-.

a:
w
>

:--.

f·

I- ... --- . 1-

REGULATOR
1805C OR
EOUIVALENT"

I

T"

,'1+_._-,
500

600

700

2.2JJH

«WI

I

,

J4

+
+5V

_.

+8V
TO
+12V
SUPPLY

I '

400

r-r-,...rrvv'

I

60p.F
HFBR·

+

~OpF

200'

;:r

0.33pF

800

900

y

1000

'CRITICAL PARAMETER IS SPEED OF RESPONSE

A - WAVelENGTH - nm

Figure 4. Spectral Response.

Figure 5. Power Supply Transient Filler Recommendation.

4-91

FIBER OPTIC
CABLE/CONNECTOR
ASSEMBLIES

Flio-

HEWLETT
~e. PACKARD

HFBR~3000

HFBR·3100
HFBR-3001
HFBR-3021

TECHNICAL DATA

JANUARY 1986

Features
• HFBR·4000 OR SMA STYLE CONNECTORS
• CONNECTORS FACTORY INSTALLED AND TESTED
 100

+10/-0 %
+1/-0 Metre
+1/-0 %

NOTES,
1. DIMENSIONS ARE IN mm (INCHES).
2. FIBER END IS LOCKED FLUSH WITH
FERRULE FACE.
CAUTION,
1. COUPLING NUT SHOULD NOT BE OVERTIGHTENED,
TORQUE 0.05 TO 0.1 UNITS N· mOVER
TIGHTENING MAY CAUfE EXCESSIVE FIBER
MISALIGNMENT OR PERMANENT DAMAGE.
2. GOOD SYSTEM PERFORMANCE REQUIRES
CLEAN FERRULE FACES TO AVOID OBSTRUCTING
THE OPTICAL PATH. CLEAN COMPRESSED AIR
OFTEN IS SUFFICIENT TO REMOVE PARTICLES.
A COTTON SWAB SOAKED IN METHANOL OR FREON"
MAY ALSO BE USED.

Absolute Maximum Ratings
Parameler

Umtllw Noig;

Symbol "'In: Max.

Relative Humidity
atTA=70·C

95

13

%

Ts

-40

+85

OJaerati!]g Temp.
Bll11d Rildlus,
No Load

TA

-20

+85

r

Flexing

20

h
~~

mm

Ameter

Symb

Exit Numerical Aperture

N.A.

Attenuation

ao

Bandwidth @ 1 km

BW

40

Travel Time Constant

IN

S

Optical Fiber Core Diameter

Dc

100

Cladding Outside Diameter

140

index Grading Coefficient

DCl
g

Cable Structural Strength

Fc

I Single Channel
I Dual Channel

m/j/
II

' ' " fiW

N

Fr

-20·C to +85·C Unless Otherwise Specified.

Max.

5.S

8

-Il.
-

Conditions
¥
,,=820nm,

dB/Km

),,=820 nm

I MHz
I nslm

Fig.

NoteW

1

7,12

R :2:300m

4

A = 820 nm (LED)

5
11

,,=820 nm

pm

-

2
1800

N

6

8

kg/km

12
30

Notes:
1.180· bending at minimum bend radius, with 10N tensile
load.
2. Force applied on 2.5 mm diameter mandrel laid across the
cable on a flat surface, for 100 hours, followed by flexure
test.
3. Tested at 1 impact according to DOD-STD-1678, Method
2030, Procedure 1.
4. Exit N.A. is defined as the sine of the angle at which the offaxis radiant intensity is 10% of the axial radiant intensity.
5. Bandwidth is measured with a pulsed LED source (A = 820
nm), and varies as 1I ·0.85, where 1I is the length of the fiber
(km). Pulse dispersion and bandwidth are approximately
inversely related.
6. Typical values are at TA. = 25· C.

9,8

100

1

in. Imyl'lW
0.3
3.5

on Cable

Tensile
Force

9, 10

Cycles

5<1

Cabie Leakaj;Je Current

Fe

Impact

·C

Mechanical/Optical Characteristics

Unit Length

Symbol

Crush Load

m

Storage Temp.

Mass per

Parameter

SOKV, j/ = 0.3m

nA

7. Fixed losses (length independent) are included in Transmitter/Receiver optical specifications.
8. One Newton equals approximately 0.225 pounds force.
9. Short term, :5 1 hr.
10. The probability of a fiber weak point occurring at a point of
maximum bend is small, consequently the risk of fiber
breakage from exceeding the maximum curvature is
extremely low.
11. Travel time constant is the reciprocal of the group velocity
for propagation of optical power. Group velocity, V = Aln
where A = velocity of light in space = 3 x 1OBm/s and n =
effective core index of refraction.
12. For lower attenuation cable consult local sales office.
13. This applies to cable only.

Cable Assembly-Ordering Guide
HFBR-3000/HFBR-3100 defines fiber optic cables with factory installed con nectors of user specified length. The cable
length must be specified in metres and can be any length in
one metre increments from 1 to 1500 metres (longer cables
available upon request). Option 001 specifies that the cable
is terminated with HFBR-4000 connectors and Option 002
specifies that the cable is terminated with SMA style connectors. Either OPT 001 or OPT 002 must be specified.
Examples:
A. To order one Duplex Cable assembly 125 metres long,
with SMA style connectors, specify:
HFBR-3100
Quantity 125
OPT 002
Quantity 1
B. To order four Simplex Cable assemblies, 150 metres
each, with HFBR-4000 connectors, specify:
HFBR-3000
Quantity 600
OPT 001
Quantity 4

20
17.5
15

.. i\..

E


2
w

12.5

'~

10
7.5

~

"''-

i"-. t......

2.5

o
600

650

700

750

800

850

900

WAVELENGTH (nm)

Figure 1. Attenuation vs. Wavelength

4-93

-----------------------------------------------------

Flin-

HEWLETT

~~ PACKARD

FIBER OPTIC CABLE

HFBR-3200
HFBR-3300

TECHNICAL DATA JANUARY 1986

Features
• SIMPLEX OR DUPLEX CABLE
• USER SPECIFIED CABLE LENGTliS
• UL RECOGNIZED COMPONENT, PASSES UL
VW-1 FLAME RETARDANCY SPECIFICATION·
• STANDARD 100/140 JLm GLASS FIBER'
• RUGGED TIGHT JACKET CONSTRUCTION
• PARAMETERS OPTIMIZED FOR LOCAL DATA
COMMUNICATION
• BANDWIDTH: 40 MHz AT 1 km

Description
The HFBR-3200 Simplex Fiber Optic Cables and HFBR3300 Duplex Fiber Optic Cables are intended for use with
HP's High Performance Modules (HFBR-1001/2, HFBR2001) and the Miniature Link series of transmitters and
receivers (HFBR-12XX, HFBR-22XX).
The HFBR-3200 Simplex Fiber Optic Cable is constructed
of a single graded index glass fiber surrounded by a silicone
buffer, secondary jacket, and aramid strength members.
The combination is covered with .a'scuff resistant polyurethane outer jacket.
The HFBR-3300 Duplex Fiber Optic cable has two glass
fibers, each in a cable of construction similar to the Simplex
cable, joined with a web. The individual channels are identified by a marking on one channel of the cable.
The optical waveguide is a fused silica glass, graded index
fiber, which gives low attenuation and wide bandwidth. The
silicone buffer and secondary jacket protect the fiber from
being scratched and provide a base for the helically
wrapped aramid strength members.
The HFBR-3200 and HFBR-3300 cables can be terminated
with HFBR-4000 connectors using the HFBR-01 00 Connector Assembly Tooling Kit. Information on cables with
factory installed connectors is available in the HFBR3000/HFBR-3100 data sheet.
The cable's resistance to mechanical abuse, safety in flammable environments, and immunity trom electromagnetic
interference effects may make the use of conduit unnecessary. However, the light weight and high strength of the
cables allows them to be drawn through most electrical
conduits.
'UL File Number E84364

4-94
. - - - - - - - - - - _ .._ - - - - - - - -

Fiber Optic Cable Construction
2.65

mm NOMINAL DIA.

6.3 mm NDMINALWIDTH

POLYURETHANE OUTER JACKET ,
ARAMID STRENGTH MEMBERS
SECONDARY JACKET

SILlCor~E'BUFFER
GLASS OPTICAL
FIBER

SIMPLEX

DUPLEX

CABLE LENGTH TOLERANCE

Cable Length (Metres)
1-10
11-100
> 100

Tolerance
+10/-0 %
+11-0 Metre
+1/-0 %

Installation
Hewlett-Packard Fiber Optic cable is designed so that when
pulled through conduit, accepted wire pulling methods and
tools, such as a cable grip, can be used. However, a few
precautions for optical cable are necessary: the cable must
not be benttighter than its minimum bend radius; the tensile
strength of the cable should not be exceeded (a cable lubricant can be used to minimize the drawing force); tenSile load
shou.ld be applied only to the cable and. not the connector.

- - - - - - _ ...---_... - . - - ..

Absolute Maximum Ratings
Symbol

Parameter

Min. Max. Units

Relative Humidity
at TA=70°C

95

%

Fe

200

N

m

1.5

kg

h

0.15

m

FT

300

N

Impact

Storage Temp.

Ts

-40

+85

TA

-20

+85

r

20

mm

8,9

5DK

Cycles

1

Flexing

Symbol Min. Max. Units

Crush Load

Operating Temp.
Bend Radius,
No Load

Parameter

Note

Note
2, 7
3

°C
Tensile Force
Per Cable Channel

7,8

Mechanical/Optical Characteristics -20°C to +85°C Unless Otherwise Specified.
Parameter

Symbol

Exit Numerical Aperture

,

Attenuation

Min. TypJ6J

NA
0<0

Max.

Units

5.5

3.5

Conditions

-

0.3
8

Fig.

Note

1

11

11.= 820 nm, Q 2: 300m

dB/km

4

A = 820 nm

Bandwidth @ 1 km

BW

40

MHz

11.= 820 nm (LED)

5

Travel Time Constant

IIV

5

nslm

11.= 820 nm

10

Optical Fiber Core Diameter

De

100

Cladding Outside Diameter

Del

140

I'm

-

Index Grading Coefficient

g

2

Cable Structural Strength

Fe

1800

Mass per
,Unit Length

I Single Channel

I Dual Channel

Cable Leakage Current

mill.

IL

N

6

7

kg/km

12
30

50 kV, Q = 0.3m

nA

Notes:
1.180° bending at minimum bend radius, with 10N tensile
load.
2. Force applied on 2.5 mm diameter mandrel laid across the
cable on a flat surface, for 100 hours, followed by flexure
test.
3. Tested at 1 impact according to DOD-STD-1678, Method
2030, Procedure 1.
4. Exit N.A. is defined as the sine of the angle at which the offaxis radiant intensity is 10% of the axial radiant intensity.
5. Bandwidth is measured with a pulsed LED source (A = 820
nm); and varies as !I. .0.s5,where !I.. is the length of the fiber
(km). Pulse dispersion and bandwidth are approximately
inversely related.

6. Typical values are at TA = 25° C.
7. One Newton equals approximately 0.225 pounds force.
8. Short term, oS 1 hr.
9. The probability of a fiber weak pOint occurring at a point of
maximum bend is small, consequently the risk of fiber
breakage from exceeding the maximum curvature is
extremely low.
10. Travel time constant is the reciprocal of the group velocity
for propagation of optical power. Group velocity, V = Aln
where A = velocity of light in space = 3 x 108 mis, n = effective core index of refraction.
11. For lower attenuation cable consult your local sales office.
20

Cable Ordering Guide

17.5
15

HFBR-3200/HFBR-3300 defines fiber optic cables of user
specified length. The cable length must be specified in
metres and can be any length in one metre increments from
1 to 1000 metres (longer cables available upon request),
Option 001 specifies the number of equal length cables
ordered.

E


Figure 1. Typical Link Configuration

4-100

shielding because no sparks can be generated by this
totally dielectric medium.
Each 39301A Multiplexer has eight RS-232-CIV.24 connectors. Each connector has both the Primary and Secondary
Data channels available. This provides for a variety of possible configurations. These configurations include: sixteen
independent asynchronous channels, eight independent
asynchronous channels with handshake control lines, or
eight independent synchronous channels with Data Terminal Equipment (DTE) supplied clock signals. The cables
required to accomplish any combination of these connections are described in the Typical Configurations Section of
this Data Sheet.

5 pecifications

Pulse Width Distortion: +1- 6 p'S maximum at data rates to
19.2 kbps
(Operated with RS-232-C load of 3K ohms and 2500 pFI.

SYSTEM PERFORMANCE
A system consists of two or more 39301 A's interconnected
by fiber optic cable assemblies.
Transmission Distance: The usable distance between
39301 A's is determined by the optical fiber and connectors
used.
Typical Fiber
Connector
Distance
Specifications
Mfr.!Model
Typ.
Max.
Size. "'0. N.A.
Local Communication Fiber
100/140,um.

Each of the Primary and Secondary Data channels may
operate any asynchronous protocol up to 19200 bps. Each
channel may be used independently with different protocols and data rates without adjustments to the Multiplexer.
This is possible because the 39301 A operates as a time
.division multiplexer, sampling each of the 16 data channels
at a 200 kHz rate. This sampled data is serialized and
transmitted in real time at a rate of 7 Mbaud over the interconnecting HFBR-3000 Series Fiber Optic Cable to the
companion 39301 A. This serial data is then reconverted to
16 parallel channels and distributed to the respective Primary or Secondary Data channels.

HP/HF8R-4000
Amphenoll
906-120-5000

1.25 km
Note 1. 2

2.5km

Amphenol/
906-120-5001

Note 2

1.5 km

Electrical Connector: Female 25 pin subminiature "D"

PIN ASSIGNMENTS
Pin
No.
1
2

3

5.5 d8/km. 0.28
Telecommunication
Fiber 50/125 ,um.
4 dBlkm, 0.21

6
7

NOTES:
1. Guaranteed with HFBR-3000 Series cable assemblies.
2. Contact HP Sales Office for expected performance of specific fiber and connectors used.
System Bit Error Rate: One error in 109 bits typical.

ENVIRONMENTAL
Storage Temperature: -40 0 C to +75 0 C
Operating Temperature: 00 C to +55 0 C
Relative Humidity: 95%

14

16

EIA RS-232-C
Protective
Ground
Transmitted
Data
(PrimarYI
Received
Data
(PrimarYI
DataSet
Ready
Signal
Ground
Seconcary
Transmitted
Data
Secondary
Received
Data

CCITTV.24
Earth
Common
Transmitted
Data

101

Noles
1

103

;3

Received
Data

104

4

CC Data Set

107

2

102

1

118

3

119

4

AA
8A
88

Ready
AB Signal
Ground
S8A Transmitted
Backward
Channel
Data
S88 Received
Backward
Channel
Data

Noles.
1. Pins 1 and 7 are internally connected.
2. Pin 6 is internally hardwired "on" to
+12V through a 316 ohm resistor.

PHYSICAL CHARACTERISTICS
Size: 42.5 x 8.9 x 7.2 cm
(16.75 x 3.5 x 2.85 inches)
Weight: 2.2 kg (4.75 Ibs)
Shipping Weight: 3.4 kg (7.5 Ibs)
Power Requirements: 18 VA Maximum
Power Cord Length: 2.3 m (7.5 ft.)

3. Data to 39301A.
4. Data Irem 39301A.

OPTICAL CHANNEL INTERFACE
Transmitter Optical Output Flux: -13 dBm
(50 p.WI minimum at 820 nm
Receiver Optical Input Flux: -31 dBm
(0.8 IlW) minimum at 820 nm
Fiber Optic Port Connector: HFBR-4000 compatible.
(HFBR-4000 installed on HFBR-3000 Series Fiber Optic
Cables. Optional SMA style connector adapters are available from HP sales offices')

REGULATION COMPLIANCE
RFI/EMI:
- VDE 0871 level A
- FCC Class A

INDICATORS AND SWITCHES

Safely Approvals:
- UL478, UL1'14 for EDP and office equipment
- CSA C22.2-154 for EDP equipment
- VDE 0730 part 2P for EDP and office equipment
- Complies with IEC standard #380 and #435 for EDP
and office equipment

ELECTRICAL CHANNEL INTERFACE
Electrical: Conforms to EIA standard RS-232-C Section 2
(CCITT V.241 for the assigned pins.

4-101

AC Line Indicator: When ON indicates that AC power is on.
Carrier Received Indicator: When ON, indicates that the
39301A is receiving a modulated signal from the remote
transmitter.
Loopback Switch: In the TEST position, enables an electrical loopback at the interface between the multiplexer
electronics and the fiber optic transceiver circuitry. The
"Carrier Received Indicator" is disabled when this switch is
in the TEST position.

DTE Interface Configurations

ASYNCHRONOUS DATA ONLY DTE

Each RS-232-CIV.24 connector on the 39301A Multiplexer
can be interfaced to a variety of Data Terminal Equipment
(DTE) by use of properly configured interconnecting RS232-CIV.24 data cables .. Each connector provides two
independent full duplex asynchronous channels on the
Primary and Secondary Data lines. Therefore, 16 total channels are available on any 39301 A link. The following figures
will describe the .cable configurations for four typical DTE
connections. Only one end of the full 39301A link is shown
in each figure. The opposite end will be a mirror image in all
cases, therefore, two of the illustrated RS-232-CIV.24 data
cables will be required to complete each link. Shielded RS232-CIV.24 cables are recommended in all cases to
minimize radio frequency emissions. Any of the DTE configurations described may be intermixed and connected to
a 39301 A link simultaneously with the only limitation being
that no more than 16 full duplex channels are available.

Itis possible to connect one or two "Data Only" DTEs to
each connector on the 39301A. Figure 2 shows the configuration for a single DTE connection utilizing the Primary
Transmitted/Received Data pins on the 39301 A connector.
Figure 3 shows the configuration of HP's 8120-3569 Dual
Channel RS-232-CIV.24 Adapter Cable. This 8120-3569
Cable can be used to separately access both the Pri mary
and Secondary Data channels on each 39301A connector.
Then two of the cables shown in Figure 2 can be used to
extend these channels out to two separate "data only"
DTEs. This 8120-3569 Cable will enable up to 16 "data only"
DTEs to be connected to each 39301 A link.

(Female)

(Male)

HFBR-3000 Series Fiber
Optic Cable
(Two Channels)

DeE 39301 A Multiplexer
(Each Connector)

"Data Only" RS-232-C/V.24
Data Cable

OTE
"Data Only"

(Male) (Female)
11-

Protective Ground

1

1

Transmitted Data

2

2

2 2

Received Data

3

3

3 3

.

+ljV
Data Set Ready

6

6

Signal Ground

7

7

6 6
77-

-=

.

'- To Remote
39301 A
3160
Ground

.

14
16 ...
Figure 2. Asynchronous Data Only Configuration

CHANNEL A

25 PIN "0"
(FEMALE)

PROTECTIVE GROUND

r-;-

TRANSMITTED DATA
RECEIVED DATA

3

DATA SET READY

6

SIGNAL GROUND

CHANNEL B

TO 39301A

2
25 PI N "'D··
1M ALE)

L-r;'----

...l..

25 PIN "0"
(FEMA LEI

PROTECTIVE GROUND

TRANSMITTED DATA (PRIMARY)

3

RECEIVED DATA (PRIMARY)

6

DATA SET READY

7

r;-

TRANSMITTED DATA

2

l'

RECEIVED DATA

3

~

DATA SET READY

6

SIGNAL GROUND

-

PROTECTIVE GROUND

2

SIGNAL GROUND

SECONDARY TRANSMITTED DATA
SECONDARY, RECEIVED DATA

7
NOTE: THE SEPARATION BETWEEN MALE AND FEMALE
CONNECTORS IS O.6m (2 tt).

Figure 3. 8120-3569: Dual Channel RS-232-C/V.24 Adapter Cable

4-102

----------------

ASYNCHRONOUS DATA PLUS HANDSHAKE DTE

SYNCHRONOUS DATA WITH DTE
SUPPLIED CLOCK

If a DTE requires that normal modem handshake lines be
active for control purposes, the Secondary Data channel on
each 39301 A connector can be used to establish this connection between the host CPU and the remote terminal.
Figure 4 shows one possible cable configuration using the
Secondary Data channel to interconnect the DTE's Request
to Send/Clear to Send handshake lines. Up to eight DTEs
with handshake lines may be connected to a 39301A link in
this way.

Although the 39301A does not provide a clock for synchronous data transmission, synchronous DTE may be interconnected by the 39301A link if the DTE can supply the
necessary clock signal. Figure 5 illustrates the use of a
39301A connector's Secondary Data channel to accomplish this type of DTE connection. Up to eight synchronous
data DTEs with their own clock lines may be connected to a
39301A link.

Note that pin 6, Data Set Ready, on each 39301 A connector
is hardwired "on" to +12V through a 316 ohm resistor. If the
connected DTE does not require this signal, it may be eliminated from the RS-232-CIV.24 data cable.

"Data + Handshake"
RS-232-CIV,24
Data Cable

DTE
"Data + Handshake"
(Female)

(Male)

HFBR-3000 serfe~Fiber
Optic Cable
(Two Channels)

DCE 39301A Multiplexer
(Each Connector)

(Male) (Female)

Protective Ground

1

1

1 1-

Transmitted Data

2

2

2 2

Received Data

3

3

3 3

Request to Send

4

4

Clear to Send

5

5--

Data Set Ready

6

6

6 6

Signal Ground

7

7

7 7-

...

+12V

I
""'"

...

J- To Remote
39301 A

3i6n
Ground

•

14
16 ..

Figure 4. Asynchronous Data Plus Handshake Configuration

"Data + DTE Clock"
RS-232-CIV.24
Data Cable

DTE
"Data + DTE Clock"
(female)

(Male)

HFBR-3000 Series Fiber
Optic Cable
(Two Channels)

DCE 39301 A Multiplexer
(Each Connector)
1-

(Male) (female)

Protective Ground

1

1

1 1-

Transmitted Data

2

2

2 2

Received Data

3

3

3 3

...

+12V

~

Data Set Ready

6

6

6 6

Signal Ground

7

7

7 7-

'- To Remote
39301 A

316n

.".

Ground
Receiver Clock

17

External
Transmitter Clock

17~

14 14

24

24

16 16 ....

...
,-

Figure 5. Synchronous Data with DTE Supplied Clock Configuration.

4-103

"

system Configurations
Point-to-Point: See Figure 1
The 39301 A's can be configured in a normal pOint-to-point
fashion utilizing a two channel fiber optic cable assembly
to interconnect them.
Multiple Node Loop:
Several 39301 A's can be interconnected in a simple closed
loop configuration using single channel fiber optic cable
assemblies to interconnect the transmitter of each 39301A
to the receiver of the subsequent 39301 A. This configuration allows one multiplexer at the computer center to
address several different groups of terminals at different
locations in a local facility. A maximum of 16 asynchronous "Data Only" DTE connections can be made around
the loop. The unused channels at each multiplexer must
be externally looped back on the 25 pin connectors, (Le.,
tie pins 2 to 3 and 14 to 16). The maximum data rate of any
channel in the loop is determined by the number of multiplexers in the loop and the amount of distortion that the
interconnected DTE's can tolerate.
Number of 39301 A's

Maximum Channel Data Rate

Up to 3

19.2 Kbps

Up t06

9.6 Kbps

Upto 15

4.8 Kbps

This data rate limit is due to the accumulated distortion
thru the loop. The accumulated distortion will be within
the 25% limits of EIA Standard RS-404, Standard for StartStop Signal Quality Between Data Terminal Equipment
and Non-Synchronous Data Communications Equipment.

Installation
The 39301A Multiplexer and the interconnecting HFBR3000 Series Fiber Optic Cable is designed for easy
installation. Complete details are provided in the Installation, Operating, and Service Manual supplied with each
39301A.
It is recommended that the 39301A Multiplexer be securely
mounted to protect the attached data cables. The 39301 A is
designed for surface or EIA standard 19 inch width rack
mounting. Standard Rack/Surface Mounting Hardware
supplied with each 39301 A allows installation in a standard
open rack or flush mounting on any convenient flat surface.
Optional Recessed Rack Mounting Hardware (Option 001)
allows mounting inside standard racks with closed doors
without damage to the attached cables.
The HFBR-3000 Series Fiber Optic Cable required to interconnect the 39301 A Multiplexers is available in several
configurations. These configurations are detailed in the
Support Products Section of this Data Sheet. Two channels
of this cable are required to operate the link. This cable is
suitable for installation in cable trays, conduits and ducts.
The cable will operate in environments from -20°C to
+70°C and 95% Relative Humidity. Standard cable installation techniques and equipment may be used with the minor
precautions stated in the 39301 A Installation, Operating,
and Service Manual. The precautions include maintaining
the minimum bend radius of 25mm (1 in.) and maximum

tensile load of 300N (67 Ib) per channel during installation.
If junction box or bulkhead splices are required in a cable
run, or a link is reconfigured to a longer distance requiring
additional fiber optic cable to be added to the original
installation, HFBR-3099 Cable Coupling Hardware may be
used to splice these cables together. The HFBR-3099 is
supplied with each factory connectored HFBR-3000 Series
Cable or may be ordered separately. Each in-line
HFBR-3099 Coupler produces a 2 dB optical power loss in
the cable run. This loss will affect the maximum separation
between 39301A's by the distance equal to 2 dB"'" cable
attenuation in dB/km. For example, if standard HFBR-3000
series cable is used the maximum link length will be
reduced by 2 dB "'" 8 dB/km = 250 m for each intermediate
HFBR-3099 used.
The RS-232-CIV.24 data cables required for connection to
various Data Terminal Equipment are detailed in the Typical Configurations Section of this Data Sheet. It is
recommended that shielded cables are used for these connections for maximum suppression of radio frequency
emissions. These cables should be no 10nQer than 15m (50
ft.l for compliance with the EIA and CCITT Standards,
unless low capacitance cable is used.

Service
The 39301 A is designed with easy-to-use link fault isolation
facilities. Loopback techniques utilizing the built-in loopback switch and fiber optic loopback cable supplied with
each 39301 A Multiplexer are used to quickly isolate link
failures to either 39301 A Multiplexer, the HFBR-3000 Series
Fiber Optic Cable, or the interconnected Data Terminal
Equipment. These procedures are described in the Installation, Operating, and Service Manual supplied with each
39301A. 39301A Multiplexers or HFBR-3000 Series Fiber
OptiC Cables may be self-serviced by the customer or
returned to the nearest Hewlett-Packard Sales Office for
service.
Customer self-service may be accomplished for the Multiplexer by following the procedures outlined in the Installation, Operating and Service Manual to identify the failed
subassembly. Replacement subassemblies are available
through HP Sales Offices. HFBR-3000 Series Fiber Optic
Cables may be repaired by using the HP HFBR-0100
Connector Assembly Tool kit to splice or reconnector a
damaged cable.
Hewlett-Packard service is available for the 39301 A by
returning the Multiplexer to the nearest HP Sales Office.
This service is available either on Monthly Contract basis or
for a Time and Materials charge. The HFBR-3000 Series
Cable will be repaired on a Time and Materials basis upon
return to the nearest HP Sales Office.

4-104

support Products
for the 39301 A

HFBR-0100* CONNECTOR ASSEMBLY TOOLING
KIT

39301A MOUNTING HARDWARE
Rack/Surface Mounting Hardware:
Supplied standard with each 39301 A. Available separately
as part 1600-1090.
Recessed Rack Mounting Hardware:
Suppl ied as Option 001 to the 39301 A. Available separately
as part 1600-1092.

39301A FIBER OPTIC LOOPBACK CABLE
Supplied standard with each 39301A. Available separately
as part 5061-2694.

39301A INSTALLATION, OPERATING,
AND SERVICE MANUAL

This kit allows the installation of HFBR-4000 Fiber Optic
Connectors onto HFBR-3000 Series Fiber Optic Cables in
the field. It is used for system installation purposes if HFBR3200/3300 unconnectored cables are used. It may also be
used for field repair of HFBR-3000 Series Fiber Optic
Cables.

HFBR-4000* FIBER OPTIC CONNECTORS
These connectors are compatible with the HFBR-3000
Series Fiber Optic Cable and the fiber optic ports on the
39301A.

HFBR-3099* FIBER OPTIC CABLE
COUPLING HARDWARE

Supplied standard with each 39301 A. Extra copies available
as part 39301-90001.

This hardware enables two cables with HFBR-4000 connectors to be coupled together for link extension or repair
splices. See Installation Section of this Data Sheet for
limitations on use of the HFBR-3099.

8120-3569 DUAL CHANNEL RS-232-CIV.24
ADAPTER CA~LE

Ordering Information

Enables two Data Terminal Equipment devices to be
connected to each 39301 A RS-232-CIV.24 connector port.
A wiring diagram is shown in Figure 3 of this Data Sheet.
The length is 0.6m (2 ft.)

HFBR-3000* SERIES FIBER OPTIC CABLE

With Factory installed
HFBR-4000 Fiber Optic
Connectors
Without Factory
Installed Connectors

Single'
Dual
Channel OR Channel
(Two Req.)
(O~
HFI3R~3000'
HFBR-3100'
or
or
39200A'
39200B'
HFBR-3200'

HF8A-3300'

..,

Two channels of HFBR-3000 Series Fiber Optic Cable are
required to interconnect the HP 39301 A Multiplexers. This
cable is available in several forms as shown in the table
above. It may be ordered in any length in one metre
increments up to 1000 metres (3280 ft.)
'Detailed specifications for these products are available from HP
sales offices.

HP 39301A: RS-232-CIV.24 TO FIBER
OPTIC MULTIPLEXER
Two are required per link. Each 39301A is supplied with
standard Rack/Surface Mounting Hardware, a Fiber Optic
Loopback Cable and an Installation, Operating, and Service
Manual.
Option 001: Recessed Rack Mounting Hardware

Required Power Supply Option: One required per

39301A
Option
Option
Option
Option

210:
212:
222:
224:

100V 50/60Hz
120V 50/60Hz
220V 50/60Hz
240V 50/60Hz

Operation
Operation
Operation
Operation

8120-3569: DUAL CHANNEL RS-232-CIV.24
ADAPTER CABLE
This cable may be used to separately access both Primary
and Secondary Data channels on each 39301A connector.
Eight of these cables will enable up to 16 "data only" DTE to
be connected to each 39301A.

HFBR-3000 SERIES FIBER OPTIC
INTERCONNECTING CABLE
Two channels are required per link.
See Support Products Section of this Data Sheet for
product choices.

4-105

rh~

HEWLETT

~~

5082-4200

PIN PHOTODIODES

PACKARD

SERIES

TECHNICAL DATA

Features

JANUARY 1986

rr-

Active area: I mm D,iam

5D82.420
Tall
5082.4203
0.5mm Diam { 5082.4204 (TO· I 8)
5082·4220 - Short (TO·46)
0.25mm Magnified 2,5x 5082·4205 - Subminiature

• HIGH SENSITIVITY (NEP<-108 dBm)
• WIDE DYNAMIC RANGE (1% LINEARITY
OVER 100 dB)
• BROAD SPECTRAL RESPONSE
• HIGH SPEED (Tr, T" EQUALS 1.5 ns TYP.)
• STABILITY SUITABLE FOR PHOTOMETRY/
RADIOMETRY
• HIGH RELIABILITY
• FLOATING, SHIELDED CONSTRUCTION
• LOW CAPACITANCE
• LOW NOISE
• HERMETIC PACKAGE

Description
The HP silicon planar PIN photodiodes are ultra-fast light
detectors for visible and near infrared radiation. Their
response to blue and violet is unusually good for low dark
current silicon photodiodes.
These devices are suitable for applications such as high
speed tachometry, optical distance measurement, star
tracking, densitometry, radiometry, and fiber-optic
termination.
The low dark current of these planar diodes enables
detection of very low light levels. The quantum detection
efficiency is constant over ten decades of light intensity,
providing a wide dynamiC range.

versatiiity of circuit connection, they are electrically
insulated from the header. The light sensitive area of the
5082-4203 and -4204 is 0.508mm (0.020 inch) in diameter
and is located 1.905mm (0.075 inch) behind the window.
The light sensitive area of the 5082-4207 is 1.016mm (0.040
inch) in diameter and is also located 1.905mm (0.075 inch)
behind the window.
The 5082-4205 is in a low capaCitance Kovar and ceramic
package of very small dimensions, with a hemispherical
glass lens.
The 5082-4220 is packaged on a TO-46 header with the
0.508mm(0.020 inch) diameter sensitive area located
2.540mm (0.100 inch) behind a flat glass window.

The 5082-4203, -4204, and -4207 are packaged on a
standard TO-18 header with a flat glass window cap. For

Package Dimensions

rr

4.65
(.183)
3.94

1(·155)

WINDOW
.99
(.039)

I

5.00
(.197)

9

!

!

38.10

(1.50~ MIN. ~• '.

I

±

.05

(.018 ± .002) DIA.

~'"

1.02
(.040)

{

~
(1~~)
(.o~~)
'-_....,..... ----.l

II--- (,060)-1
1.51 ~
'

5.33 ± .25
(.210 ± .010)

TO-18
HEADER-

C
~

1.02
'>--. (.040)
~

I-~

Cf=~::::j::J-

2.54
(.100)-

T--ANODE
45~"

ANODE

:-Ll..'130 +,130
-.050

.46

a
-

\

NOTES: 1. DIMENSIONS ARE IN mm (INCHES).
2. UNLESS OTHERWISE SPECIFIED.THE TOLERANCES ARE:
.XX ± .13 mm (.XXX ± ,005 IN.)

GLASS

-CATHODE

CONNECTED
TO CASE

·4203, ·4204, ·4207

(005

~·ggi)

.

CATHODE

0---'1'
1
.51

I

"2.24_1
1---(.088)

·4205

4-106

~ANODEaCATHODE
\

AND CASE

45~

/

Y/~.02

1.02 ,.(
(.040)

(.040)

·4220

TQ-4fi HEADER

Absolute Maximum Ratings
····.)(4203

Operating and Storage Temperature -55°to 125°C

·4204

·4205

·4207

·422U

Units

100

100

100

100

50

20

50
50

mW
volts

20

Electrical/Optical Characteristics at TA=25°C
}······..··4203
.i··· ·4205
I? Oescr~Ption
) .... "Min;
Symbol
MaxI
Typ.
1'Ti/p,

Axlallncidal\ce

RS. O'
R¢'A

Res~qJ,se tit

A

71orlml31
Active Area 131

RI'>

Flux AesP,an·

~
~
O·

~

0.8S

Juncttol1}[;~p;~#~

Cp

Package

~

!;1:~;'3

}}

Max.

Max,

Min.

2x

Min.

0.43

·4207
Typ.

5Q

., '.i
Max:

-4220

3.4

.37

3x

8x

~~

10•. 3

i't,)):

Mi>f.

Typ.

Min.

1,1

10·3'
.74

10:3

0:43

cm[2}

.37

0.43

Uhlt'
!iA
mWlcml21

i!!i

j1W

Vi' If:~~,""

3.2x
10-14
1.4 x
1012
2.0

x.

1.5 x
1011
1.5

tan" 16i (Fig;' 5l

.15

0.6

2.0

"

OeteUl\lltyl11

Cj

f •.'·····

d

5.0

2.5

I.S.
10-14
3.4 x
10 12
0.7

9.a.

6.6 "

~

10-14
4.8 x
1011
2.0

10-14
1.3,
10 12

5.5

nA

~
W

pf

pF

Capacitance [91
Zero Bia:;'Spe~~
(Aj",. Fall Tim,}
1101
R,~,V.MBi3S Speed
(R'ise, Fall Time)
Illi
Series Resi~an!;e

tr,tf

tr,tf

RS

Breakdown
Voltage

VBR

300

300

300

300

300

os

1,5

1.5

1.5

1.5

1,5

"'

50

50
50

50

50

50

50
50

50

50

n
V

·see Note 4.

1000A
<500 A
; and in addition:
Ec

Ip - photocurrent (A)

f - pulse repetion rate (MHz)

Ec - supply voltage (V) Pef> - power input via photon flux
t - pulse duration (j1s)
PMAX - max dissipation (W)
Power dissipation limits apply to the sum of both the optical power input to the device and the electrical power input from flow
of photocurrent when reverse voltage is applied.
2. Exceeding the Steady Reverse Voltage may impair the low-noise properties of the photo diodes, an effect which is noticeable only
if operation is diode-noise limited (see Figure 8).
3. The 5082-4205 has a lens with approximately 2.5x magnification; the actual junction area is 0.5 x 10.3 cm 2 , corresponding to a
diameter of 0.25mm (.010"). Specification includes lens effect.
4. At any particular wavelength and for the flux in a small spot falling entirely within the active area, responsivity is the ratio of incremental
photodiode current to the incremental flux producing it. It is related to quantum efficiency, llq in electrons per photon by:
R,,,=nq (.2:....)
'I'
1240
where A is the wavelength in nanometers. Thus, at 820nm, a responsivity of 0.43 A!W corresponds to a quantum efficiency of 0.65 (or 65%)
electrons per photon.
5. At -10V for the 5082-4204, -4205, and -4207; at -25V for the 5082-4203 and -4220.
6. For (;I., f, ll.f)'= 820nm, 100Hz, 6Hz) where f is the frequency for a spot noise measurement and ~f is the noise bandwidth, NEP is the
optical flux required for unity signal/noise ratio normalized for bandwidth. Thus:
NEP=

IN/.../M
-Ref>

where IN/-/Af is the bandwidth - normalized noise current computed from the shot noise formula:

Fo

IN/v'Af=.J2qIj) = 17.9 x 10- 15
(A/..;i=W where ID is in nA.
7. Detectivity, O*is the active-area-normalized signal to noise ratio. It is computed:
for (;I., f, At) = (820nm, 100Hz, 6Hz).
8. At -1 OV for 5082·4204, -4205, -4207, -4220; at -25V for 5082·4203.
9. Between diode cathode lead and case - does not apply to 5082·4205, ·4220.
10. With 50n load.
11. With 50n load and -20V bias.

4-107

D*

=.fA

NEP

(em

v'Hz)

W

for A in cm 2 ,

'.0
0.8
0.6

,

,.,--.-80

I~

'/~

PHol°;· ~~. ............ ;....
....

E,~CTRONS

,.

r/

0.4

0.2

v

/ "AMY

O.

'1----r---

.08

~-

.

-

.06

-'''

.._-

.04

.0

._-

·"~T

,

400

600

800

RADIANT POWER AT 900nm

70

~ 2O,*W

so

150jl'#

I

50

T
i1
\

1000

j

'10

lOO..uW

~:

'JOPW

}1O

+.75 +.50 +.25

0

5

10

15

20 25

30 35

40

45

50

BIAS VOLTAGE (ANODE TO CATHODE VOLTAGE)

1200

A - WAVelENGTH - nm

Figure 1. Spectral Response.

w

3

Figure 3. Typical Output Characteristics
at A = 900nm.

Figure 2. Relative Directional Sensitivity
of the PIN Photodiodes.

1000r---r---,----r---r---r--~--_,

">
U

)(l
S002 - 4207 MAX. SHOT

w
~

!'2'!,5-'?~_t:!'£(}~_~~:'~~~~?~1.

7

"

________ _

508i:42ii4-MAx~SHOT--------·----------

H·+·······T~

NOiSE OF DIODE Uo

(3

g:

~

400 pAl

«
t)
z

75

65

85

95

o~

4

10

t)

TEMPERATURE _

"c

z

16

'-,-co,;---,0'""---'1O-=-'--'.':0"--,':cO.;-----,O'-;'--~'O'
RL -

~

Figure 4. Dark Current at -10V Bias
vs. Temperature.

LOAD RESISTANCE -

OHMS

Figure 6. Noise vs. load Resistance.

-10

-15

VR

REVERSE VOLTAGE -

-

V

Figure 5. Typical Capacitance Variation
With Applied Voltage.
10 8

I

"

10'

.......

,

NEPDUETO
...---THERMAL NOISE

NEP

,,;,-'.~:LOAD

G 10 6

iii

"

~

NEP DUE TO
,.' BOTH SOURCES
OF NOISE

10'

~

10'
0

r

13

10 3
10'
RL - LOAD RESISTANCE"

10 2

OHMS

RL - LOAD RESISTANCE - OHMS

Figure 8. Noise Equivalent Power vs. Load Resistance.

Figure 7. Photodiode Cut·Off Frequency
vs. Load Resistance (C = 2pF).

Ip = Si'gnal current'" 0.43I'A/I'W x flux input at 820 nm
IN = Shot noise current
<1.2 x 10-14 amps/Hzl/2(5082'4204)
<4 x 10-14 amps/Hzl/2(5082.4207)
10= Dark current

<600 x 10-12 amps at -10 V de (5082-4204)
<2500 x 10-12 amps at -10 V de (5082·4207)
Rp = 1011n
RS= <50n

Figure 9. Photodiode Equivalent Circuit.

4-108

Application Information
NOISE FREE PROPERTIES

5082-4205 MOUNTING RECOMMENDATIONS

The noise current of the PIN diodes is negligible. This is a
direct result of the exceptionally low leakage current, in
accordance with the shot noise formula IN = (2qIRAf) 1/2
Since the leakage current does not exceed 600 picoamps
for the 5082-4204 at a reverse bias of 10 volts, shot noise
current is less than 1.4 x 10- 14 amp HZ- 1/ 2 at this voltage.

a. The 5082-4205 is intended to be soldered to a printed
circuit board having a thickness of from 0.51 to 1.52mm
(0.02 to 0.06 inch).
b. Soldering temperature should be controlled so that at
no time does the case temperature approach 280°C.
The lowest solder melting pOint in the device is 280°C
(gold-tin eutectic). If this temperature is approached,
the solder will soften, and the lens may fall off. Lead-tin
solder is recommended for mounting the package, and
should be applied with a small soldering iron, for the
shortest possible time, to avoid the temperature
approaching 280°C.
c. Contact to the lens end should be made by soldering
to one or both of the tabs provided. Care should be
exercised to prevent solder from coming in contact
with the lens.
d. If printed circuit board mounting is not convenient,
wire leads may be soldering or welded to the devices
using the precautions noted above.

Excess noise is also very low, appearing only at
frequencies below 10 Hz, and varying approximately as
1/f. When the output of the diode is observed in a load,
thermal noise of the load resistance (RLl is 1.28 x 10- 10
(RLl- 1/ 2 x (Af) 1/2 at 25° C, and far exceeds the diode shot
noise for load resistance less than 100 megohms (see
Figure 6). Thus in high frequency operation where low
values of load resistance are required for high cut-off
frequency, all PIN photodiodes contribute virtually no
noise to the system (see Figures 6 and 7).
HIGH SPEED PROPERTIES
Ultra-fast operation is possible because the HP PIN
photodiodes are capable of a response time of 1.5 nanoseconds. A significant advantage of this device is that the
speed of response is exhibited at relatively low reverse
bias (-10 to -20 voltsl.

LINEAR OPERATION
Having an equivalent circuit as shown in Figure 9,
operation of the photodiode is most linear when operated
with a current amplifier as shown in Figure 10.

OFF-AXIS INCIDANCE RESPONSE
Response of the photodiodes to a uniform field of radiant
incidanceEe, parallel to the polar axis is given by I = (RA) x
Ee for 820nm. The response from a field not parallel to the
axis can be found by multiplying (RA) by a normalizing
factor obtained from the radiation pattern at the angle of
operation. For example, the multiplying factor for the
5082-4207 with incidance Ee at an angle of 40° from the
polar axis is 0.8. If Ee = 1 mW/cm 2 , then Ip = k x (RA) x Ee;
Ip = 0.8 x 4.0 x 1 = 3.2 !Lamps.
SPECTRAL RESPONSE
To obtain the response at a wavelength other than 820nm,
the relative spectral response must· be considered.
Referring to the spectral response curve, Figure 1, obtain
response, X, at the wavelength desired. Then the ratio of
the response at the desired wavelength to response at
820nm is given by:
RATIO

II

R, '" R2
VOUT '" R,

'--_ _---+_ _ _ _ _

lip + 10)

--,.~+ }vauT

Figure 10. Linear Operation.

Lowest noise is obtained with Ec = 0, but higher speed and
wider dynamic range are obtained if 5 < Ec < 20 volts. The
amplifier should have as high an input resistance as
possible to permit high loop gain. If the photodiode is
reversed, bias should also be reversed.
LOGARITHMIC OPERATION
If the photodiode is operated at zero bias with a very high
impedance amplifier, the output voltage will be:

X
= .43

Multiplying this ratio by the incidance response at 820nm
gives the incidance response at the desired wavelength.

R2

VOUT = (1 +~) •

kT

q

.
qV
-I
where Is = IF (e kT -1)

ULTRAVIOLET RESPONSE
Under reverse bias, a region around the outside edge of
the nominal active area becomes responsive. the width of
this annular
,j is approximately 25!Lm (0.001 inch) at
-20V, and expands with higher reverse voltage. Responsivity in this edge region is higher than in the interior,
particularly at shorter wavelengths; at 400nm the interior,
responsivity is 0.1 AIW while edge responsivity is 0.35
AM. At wavelengths shorter than 400nm, attenuation by
the glass window affects response adversely. Speed of
response for edge incidance is tr, tf = 300ns.

n

·.l/.n

Ip
(1+!;)

at 0 < IF

< 0.1mA

using a circuit as shown in Figure 11.

Figure 11. Logarithmic Operation.

Output voltage, VOUT, is positive as the photocurrent, Ip,
flows back through the photodiode making the anode
positive.

4-109

•

•

•

•
• •

•
••

5-1

•

0

0

•

•.

•

.

,

- - - - - - - - - - - - - - - - - - - - - - _ . _ - - _ . _ - _ . - _. __ .. -- ._--_._--------

Light Bars and
Bar Graph Arrays
LED Light Bars are Hewlett-Packard's innovative
solution to fixed message annunciation. The large,
uniformly illuminated light emitting surface may
be used for backlighting legends or simple
indicators. Four distinct colors are offered, high
efficiency red, yellow, high performance green and
emerald green, with three bicolor combinations
(see page 5-14.) Each of the eight X-V stackable
package styles offers one, two, or four light
emitting surfaces, Panel and Legend Mounts are
also available for all devices.

matching and alignment problems commonly
associated with arrays of discrete LED indicators.
Each device offers easy to handle packages that are
compatible with standard SIP and DIP sockets.
The lO-element Bar Graph Array is available in
standard red, high efficiency red, yellow, high
performance green and emerald green. The new
multicolor lO-element arrays have high efficiency
red, yellow and green LEDs in one package. The
package is X-V stackable, with a unique interlock
allowing easy end-to-end alignment. The 101element Bar Graph Array is offered in standard
red, high efficiency red and high_performance
green with 1% resolution.

In addition to light bars, HP offers effective
analog message annunciation with the new
lO-element and WI-element LED Bar Graph
Arrays. These bar graph arrays eliminate the

5-2

LED Light Bars

Package Outline Orawing

Lens
Diffused

Typical
Luminous
Intensity
@20mA
20 mcd

Typical
Forward
Voltage
@20mA
2.0 V

Description

Device

Package
4 Pin In-Line; .100"
Centers; .400"L x
.195"W x .240"H

Part No.
HLMP-2300

Color
High
Efficiericy
Red

HLMP-2400

Yellow

Diffused

20 mcd

2.1 V

HLMP-2500

Green

Green
Diffused

25 mcd

2.2 V

HLMP-2000

Emerald

Diffused

9 mcd

2.2 V

HLMP-2350

High
Efficiency
Red

Diffused

35 mcd

2.0 V

HLMP-2450

Yellow

Diffused

35 mcd

2.1 V

HLMP-2550

Green

Green
Diffused

50 mcd

2.2 V

HLMP-2050

Emerald

Diffused

18 mcd

2.2 V

HLMP-2600

High
Efficiency
Red

Diffused

20 mcd

2.0 V

HLMP-2700

Yellow

Diffused

18 mcd

2.1 V

HLMP-2800

Green

Green
Diffused

25 mcd

2.2 V

HLMP-2100

Emerald

Diffused

9 mcd

2.2 V
..

100001

HLMP-2620

High
Efficiency
Red

Diffused

20 mcd

2.0 V

~

HLMP-2720

Yellow

Diffused

18 mcd

2.1 V

HLMP-2820

Green

Green
Diffused

25 mcd

2.2 V

HLMP-2120

Emerald

Diffused

9 mcd

2.2 V

ICJI

[[fflJ
I

I

DO
~

8 Pin In-Line; .100"
Centers; .800"L x
.195"W x .240"H

8 Pin DIP; .100"
Centers; .400"L x
AOO"W x .240"H;
Dual Arrangement

16 Pin DIP; .100"
Centers; .800"L x
AOO"W x .240"H;
Quad Arrangement

5-3

Page
No.
5-7

LED Light Bars (Continued)

Package Outline Drawing

[I 8I
~

D
~

[][JI
~

D

-

lens
Diffused

Typical
luminous
Intensity
@2DmA
35 mcd

Typical
Forward
Voltage
@2DmA
2.0 V

Description

Device

Package
16 Pin DIP; .100"
Centers; .800"l x
AOO"W x .240"H
Dual Bar
Arrangement

Part No.
HlMP-2635

Color
High
Efficiency
Red

HlMP-2735

Yellow

Diffused

35 mcd

2.1 V

HlMP-2835

Green

Green
Diffused

50 mcd

2.2 V

HlMP-2135

Emerald

Diffused

18 mcd

2.2 V

HlMP-2655

High
Efficiency
Red

Diffused

35 mcd

2.0 V

HLMP-2755

Yellow

Diffused

35 mcd

2.1 V

HlMP-2855

Green

Green
Diffused

50 mcd

2.2 V

HLMP-2155

Emerald

Diffused

18 mcd

2.2 V

HLMP-2670

High
Efficiency
Red

Diffused

35 mcd

2.0 V

HlMP-2770

Yellow

Diffused

35 mcd

2.1 V

HlMP-2870

Green

Green
Diffused

50 mcd

2.2 V

HlMP-2170

Emerald

Diffused

18 mcd

2.2 V

HLMP-2685

High
Efficiency
Red

Diffused

70 mcd

2.0 V

HlMP-2785

Yellow

Diffused

70 mcd

2.1 V

HlMP-2885

Green

Green
Diffused

100 mcd

2.2 V

HlMP-2185

Emerald

Diffused

36 mcd

2.2 V

8 Pin DIP; .100"
Centers; AOO"L x
AOO"W x .240"H
Square
Arrangement

16 Pin DIP; .100"
Centers; .800"l x
AOO"W x .240"H
Dual Square
Arrangement

16 Pin DIP; .100"
Centers; .800"l x
AOO"W x .240"H
Single Bar
Arrangement

5-4

Page
No.
5-7

LED Bicolor Light Bars
Description

Device

Package Outline Drawing

Lens
Diffused

Typical
Forward
Voltage
@2DmA
HER: 2.0 V
Yellow: 2.1 V

Part No.
HLMP-2950

Color
High
Efficiency
Redl
Yellow

HLMP-2965

High
Efficiency
Redl
Green

Diffused

HER: 20 mcd
Green: 20 mcd

HER: 2.0 V
Green: 2.2 V

HLMP-2980

High
Efficiency
Redl
Emerald

Diffused

HER: 20 mcd
Emerald: 9 mcd

HER: 2.0 V
Emerald: 2.2 V

D
@

Package
8 Pin DIP; .100"
Centers; .400"L x
.400"W x .240"H
Square
Arrangment

Typical
Luminous
Intensity
@2DmA
HER: 20 mcd
Yellow: 12 mcd

Page
No.
5-14

Panel and Legend Mounts for LED Light Bars
Device
Package Outline Drawing

I

Part No.
HLMP-2598

Corresponding Light Bar
Module Part Number HLMP2050, 2350, 2450, 2550, 2050

HLMP-2599

2000, 2300, 2400, 2500, 2000

HLMP-2898

2100,2600,2700,2800,2100
2155,2655,2755,2855,2155
2950, 2965, 2980

HLMP-2899

2120,2620, 2720, 2820, 2120
2135,2635, 2735, 2835, 2135
2170,2670,2770,2870,2170
2185,2685, 2785, 2885, 2185

Page
No.
5-21

I

CJ

D
c=J
Special Options
Description

Option
Code

Page
No.

Applicable Part Number HLMP-

Legends

LOOL06

2300, 2400, 2500, 2000
2655, 2755, 2855, 2155
2685, 2785, 2885, 2185

Intensity Selected

S02

2300,
2350,
2600,
2620,

2400,
2450,
2700,
2720,

2500
2550
2800
2820

2635,
2655,
2670,
2685,

5-23

2735,
2795,
2770,
2785,

5-25

2835
2855
2870
2885

5-5
..

_._.._ - - - - - - - -

LED Bar Graph Arrays
Description

Device
Package Outline Drawing

0000000000

~'~m~m~

II

'I

Package
20 Pin DIP;
.100" Centers;
1.0"L x .400"W
x .240"H

Lens
Diffused

Typical
Luminous
Intensity
1250 !lcd
@20mA DC

Typical
Forward
Voltage
1.6V@
20 mA DC

Part No.
HDSP-4820

Color
Standard
Red

HDSP-4830

High
Efficiency
Red

Diffused

2280 !lcd
@10mADC

2.1 V@
20 mA DC

HDSP-4840

Yellow

Diffused

1900 !lcd
@10mADC

2.2V@
20 mA DC

HDSP-4850

High
Performance
Green

Green
Diffused

1900 !lcd
@10mADC

2.1 V@
10 mA DC

HDSP-4890

Emerald

Diffused

1600 }led
@10rnADC

2.2V@
10 rnA DC

HDSP-4832

Multicolor

Diffused

1900 }lcd
@10mADC

HDSP-4836

Multicolor

Diffused

1900 }led
@10mADC

HDSP-8820

Standard
Red

Red,
Non-Diffused

20 }lcd
@ 100 mA Pk:
1 of 110 D.F.

1.7 V@

L 11II111111111111111111 J

22 Pin SIP;
.100" Centers;
4.16"L x .390"W
x .236"H

100 mA Pk:
1 of 110
D.F.

HDSP-8825

High
Efficiency
Red

Clear

175 }lcd
@100mAPk:
1 of 110 D.F.

2.3 V
@100mAPk:
1 of 110 D.F.

HDSP-8835

High
Performance
Green

Clear

175 }lcd
@ 100 mA Pk:
1 of 110 D.F.

2.3 V
@100mAPk:
1 of 110 D.F.

5-6

Page
No.
5-26

5-32

FliOW

HEWLETT

HIGH EFFICIENCY RED HrMP'L23067!2600 SERIES
YEL~OW H~!YIP-24QO/-2700 SpRIES
HIGH PERFORMANCE G~~p,,~ HClVlP-2'
SERIES
ElVIER~LD GREE",c!-ILMR;7
SF,RI.~S

~~ PACKARD
ii

TECHNICAL DATA

JANUARY 1986

Features
• LARGE, BRIGHT, UNIFORM LIGHT EMITTING
AREAS
Approximately Lambertian Radiation Pattern
• CHOICE OF THREE COLORS
• CATEGORIZED FOR LIGHT OUTPUT
• YELLOW, GREEN, AND EMERALD GREEN
CATEGORIZED FOR DOMINANT WAVELENGTH
• EXCELLENT ON-OFF CONTRAST
• EASILY MOUNTED ON P.C. BOARDS OR
INDUSTRY STANDARD SIP/DIP SOCKETS
• MECHANICALLY RUGGED
• X-Y STACKABLE
• FLUSH MOUNTABLE

Applications

• CAN BE USED WITH PANEL AND LEGEND
MOUNTS

• BUSINESS MACHINE MESSAGE
ANNUNCIATORS

• LIGHT EMITTING SURFACE SUITABLE FOR
LEGEND ATTACHMENT PER APPLICATION
NOTE 1012

• TELECOMMUNICATIONS INDICATORS
• FRONT PANEL PROCESS STATUS INDICATORS

• SUITABLE FOR MULTIPLEX OPERATION

• PC BOARD IDENTIFIERS

• I.C. COMPATIBLE

• BAR GRAPHS

Description
The H LM P-2000/-21 00/-2300/-2400/-2500/-2600/-27001
-2800 series light bars are rectangular light sources designed
for a variety of applications where a large, bright source of
light is required. These light bars are configured in a
single-in-line and dual-in-line packages that contain either

single or segmented light emitting areas. The -23001-24001
-2600/-2700 series devices utilizes LED chips which are
made from GaAsP on a transparent GaP substrate. The 2000/-21001-2500/-2800 series devices utilize chips made
from GaP on a transparent GaP substrate.

Selection Guide
Size of Light Emitting Areas

Number
of
Light
Emitting
Areas

Light Bar Part Number
HLMPHigh
Efficiency
Red

Yellow

Green

Emerald
Green

Package
Outline

Corresponding
Panel and
Legend Mount
Part No. HLMP-

2300

2400

2500

2000

8.89 mm x 3.81 mm 1.350 in x .150 in.1

1

A

2350

2450

2550

2050

19.05 mm x 3.81 mm 1.750 in x .150 in.1

1

B

2600

2700

2800

2100

8.89 mm x 3.81 mm (.350 in x .150 in. I

2

D

2620

2720

2820

2120

8.89 mm x 3.81 mm (.350 in x .150 in.)

4

F

2635

2735

2835

2135

8.89 mm x 19.05 mm (.150 in x .750 in.!

2

G

am
a

2655

2755

2855

2155

8.89 mm x 8.89 mm (.350 in x .350 in.)

1

C

0

2898

2670

2770

2870

2170

8.89 mm x 8.89 mm 1.350 in x .350 in.)

2

E

2899

2685

2785

2885

2185

8.89 mm x 19.05 mm {'350 in x .750 in.)

1

H

CD
CJ

5-7

0

2599

c:::J

2598

rn

2698
2899
2899

2899

Absolute Maximum Ratings
Parameter

HLMP-23001
' ·2600 Series

HLMP·24001
·2700 Series

HLMP·25001
-2800 Series

HLMP-20001
·2100 Series

135mW

8SmW

135mW

135mW

SOmA

60mA

90mA

SOmA

25mA
TA -=25·C

20mA
TA=50·C

2SmA
TA"'25"C

25mA
TA = 25°C

30mA

25mA

30 rnA

SOmA

Average Power Dissipation per LED Chipl11
Peak Forward Current per LED Chip, T A = 50· C
(Maximum purse Width = 2 msl 12 1
Time Average Forward Current per LED Chip,
Pulsed Conditions l21
DC Forward Current per LED Chip, TA = 50° 0 131
Reverse Vortage per LED Chip

6V
-40'C to +85"C

Operating Temperature Range

-20· C to +850 C
-40· C to +850 C

Storage Temperature Range
Lead Soldering Temperature 1,6 mm (1/16 inch I
Below Seating Plane

260° C for 3 seconds

mwrc

NOTES: 1, For HLMP-20001-21001-23001-25001-26001-2800 senes. derate above TA ~ 25'C at 1.8
per LED Chip. For HLMP-24001-2700 ,senes. derate
above T A = 50 0 Cat 1.8 mwrc per LED chip. See Figure 2.
2. See Figure 1 to establish pulsed operating conditions.
3, For HLMP-20001-21001-23001-25001-26001-2800 series. derate above TA ~ 50 'c at 0.50 mA/'C per LED chip, For HLMP-24001-2700 series. derate
above TA ~ 60'C at 0,50 mA/'C per LED chip, See Figure 3,

Package Dimensions
{),,08' 0.076

11

4'0&3MIN'

-

4953'

(0: 195)
MAX

(0,1601

rl
8.690

{(I.35D)

+-1 r

4.953
(0,195)

3.810

·=1=7 +, t-D~
I

I

(0,1501

I

I.

3.810

(0,160)

LJ

TOP A

PIN 1

19.050
(0.7501

11=1

TOPS

CAT"OOE END

END VIEW A, B
COLOR
SIN

DATe
CODE

(SEE NOTE S)

lUMINOUS

6.223 MAX.

INTENSITY
CATEGORY
(SEE NOTE 4)

1

I L -IIh

2 3 4

5

6 7 8

.
2.54 TYP........j
(0.1001

1.016

(0,2461

(0.0401

'TVI'.

0.584,Q.016
{o,u23,Q.0031

SIDE A

SIDE B

1~

0.2S4' 0,05-11--

7.•~Q
lO.3OQ}

'j,

{O,01o)

I~:~:I~U
MIN.

---.L.-

U

END VIEW 0, 0, E. F, G, H

--l

2.540
(0.100)
TVP.

_I

-1

c::J t

LUMINOUS
INTENSITY

c=J
c=J It
c=J

(SEENOTE4)

(o,oSm

NUMBER

t

10.020)
TV~,

COWfI BIN
(SEE NOTE 5)

SIDE VIEW E, F, G, H

3.B!Q
(0,150)

_ _ 4PLCS

CATEGORY

PART

0.508.t ()+OS

8,890

. j 10.350)

I

~

10.1&0

IMoo)
MAX.

E

\-

-

\

10.160
10,4(0)
MAX,

F

f--

irI
nnIJ2o;D
~U=;:", :;U=",: : (: -O',r~_' ~t . rr

~I i3~~
Mft.l(.
G

I· . .

-\

11l\if~
MAX.
H

NOTe, DIMENSIONS IN MIl.lIMETR£S (INCHES]. TOLERANCES ,0.26 "'"' {

1

60
40
20
0

0
TA - AMBIENT TEMPERATURE - QC

Figure 1. Maximum Allowed Peak Current

VS.

Pulse Duration.

Figure 2. Maximum Allowable Power Dissipation per LED VS.
Ambient Temperature.Deratings Based on Maximum
Allowable Thermal Resistance Values, LED Junction to
Ambient on a per LED Basis, Tj MAX = 100°C.

5-12

35
30

"

25

YELLOW

r5

0:
0:

:J

u
u
0

,::

""

20
ROJA
I

0

322'CIWILE~'~
I
I
I

RUJA '" 430~C/VV!LED

15~

•

I

1

I·..

1)-1'

ROJA '" 53B~C/w/lED

10

\
\

'\.

>

\
\

~ ~\

~

u

r5

1.1

u

~w

1.0

;:

~

0:

~

"

5

a

10

20

30

50

40

/1

0.7

60

70

80

0.5

90

0

80
70-

r50:

60

"u

50

~

40

0:

30

~

""

30

40

50

60

70

80

90

IpEAK - PEAK CURRENT PER LED - rnA

Figure 4. Relative Efficiency (Luminous tntensity per Unit
Current) vs. Peak LED Current.

-

~.

,~

!Ii
~'~RELE~!ERJD/

2.2

YELLOW

1.6

~~

1.4

,,-,

.'1

4.0

,/
,/

1.2

.

~~

0.6

-

/'

I-

V

..<

0.4
0.2
0 .....
0

5.0

/

1.0
0.8

0:

3.0

1.8

>0:

-0

1£,
2.0

ZO
_N

-'"
w"

Vi

0
1.0

2.0

00
ZW
i~

'''/!

10

...>

~~
... E

Jj V
I/t:

RED.

20

V

..... i"'"
5

10

REO, YELLOW.

9RE~N, ~ME~ALIO
15

20

25

30

loc-DC CURRENT PER LED-rnA

VF - FORWARD VOLTAGE - V

Figure 5. Forward Current vs. Forward Voltage Characteristics.

I

20

10

2.4

90

";:

-

~REEN.JMERALD

0.6

0.4

Figure 3. Maximum Allowable DC Current per LED vs. Ambient
Temperature, Deratings Based on Maximum Allowable
Thermal Resistance Values, LED Junction-to-Ambient
on a per LED Basis, Tj MAX = 100° C.

0:

,(lED
"L

rJ

0.8

TA - AMBIENT TEMPERATURE _ °c

t-

.

0<

<.>

"E

~

/

0.9

>

c

0

.'
..." .--

1.2

1\

Vll..l.Jw

E

t-

1.3

REDI.GREkN.E~ERLD

Figure 6. Relative Luminous Intensity vs. DC Forward Current.

For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.

5-13

Flin-

LED BICOLOR LIGHT BARS
DIP - Single Light Emitting Area

HEWLETT

~~ PACKARD

HIGH EFFICIENCY RED/YELLOW HLMP-2950
HIGH EFFICIENCY RED/HIGH PERFORMANCE GREEN HLMP-2965
HIGH EFFICIENCY RED/EMERALD GREEN HLMP-2980
TECHNICAL DATA

JANUARY 1986

Features
• LARGE, BRIGHT, UNIFORM LIGHT EMITTING
AREA
8.89mm x 8.89mm (0.35 x 0.35 inch)
Approximately Lamberiian Radiation Pattern
• CHOICE OF THREE BICOLOR COMBINATIONS
• CATEGORIZED FOR LIGHT OUTPUT
• YELLOW, GREEN, AND EMERALD
CATEGORIZED FOR DOMINANT WAVELENGTH
• EXCELLENT ON-OFF CONTRAST
• EASILY MOUNTED ON P.C. BOARDS OR
INDUSTRY STANDARD DIP SOCKETS
• MECHANICALLY RUGGED
• X-V STACKABLE

Applications

• FLUSH MOUNTABLE
• CAN BE USED WITH HLMP-2898 PANEL AND
LEGEND MOUNT

• TRISTATE LEGEND ILLUMINATION
• SPACE-CONSCIOUS FRONT PANEL STATUS
INDICATORS

• LIGHT EMITTING SURFACE SUITABLE FOR
LEGEND ATTACHMENT PER APPLICATION
NOTE 1012

• BUSINESS MACHINE MESSAGE
ANNUNCIATORS

• I.C. COMPATIBLE

• TELECOMMUNICATIONS INDICATORS
• TWO FUNCTION LIGHTED SWITCHES

Description
The HLMP-29501-2965/-2980 light bars are bicolor light
sources designed for a variety of applications where dual
state or tristate illumination is required for the same annunciator function. In addition, both devices are capable
of emitting a range of colors by pulse width modulation.

These light bars are configured in dual-in-line packages
which contain a single light emitting area. The high efficiency red (HER) and yellow LED chips utilize GaAsP on
a transparent Gap substrate. The green and emerald LED
chips utilize GaP on a transparent substrate.

Package Dimensions
DATE

D.50B,0.05
(M~OJ

2.S4Q

t
)1):
r

CODe

PART
Nt,lMSER

10.,00

~D-t
ST
-t- JI e.~90 Ie
1

lUMINOUS --=~
INTENSITY

10.160 2
10.400)
MAX.

3

D

a-7

8 B90

11)3501
6'

0.254 . 0
10.010)

(O~160_1
4064
MIN

I

os

H

7,620

--1\1_

10.300)

bj
-1
'

,

4

""11110.3501
_____

SIDE VIEW

10.l60
10,400)
MAX.

TOP VIEW

5-14

\

END VIEW

~

NOTES, DIMENSIONS IN MILLIMETRE'S (INCHES).
TOLERANCES '0.25 mm ~+O,010 in) UNLESS
OTHeRWISE INDICATED.

-~----~~~-

~-~-----

Absolute Maximum Ratings
Parameter

HLMP,2965

HLMP·2950

HLMP·2980

135mW

85mW

135mW

Average Power ~\sslpation per LED ChipPI
Peak Forward Current per LED Chip. T A ~ 50' C
(Maximum Pulse Width = 2 ms)i1· 2 }
Time Average Forward Current per LED Chip.
Pulsed Conditions[21

90mA

BOmA

25 mAo

20mA.
TA ~ 50'C

TA~25'C

DC Forwqri:(durrenfperLED Chip. T A ~ 50~C[3]
Operating Temperature Range

90mA
25mA
TA ~ 50'C

\'.

30mA

2\\rrlA,

30mA

-20°C to +85'C

-40'C to+85°C

-20" C to +85' C

Storage Temperature Range

-40' C to +8,5". C
29.9~ dlor 3 SflC.O,!dS

.,"e~%d. SolderingTer;npe!allfre. 1.6 mm (1/16 inch) BelowS\1ating Plane

NOTES:
1. For HLMP-2965. derate above T A; 25' Cat 1.S mW/' C per LED
chip. For HLMP-2950 and -29S0 derate above T A; 50' Cat 1.S
mWI' C per LED chip. See Figure 2.
2. See Figure 1 to establish pulsed operating conditions~

3. For HLMP-2965. derate above TA = 50' C at 0.50 mAl' C per
LED chip. For HLMP-2950 and -29S0 derate above TA = 60' C
at 0.50 mAl' C per LED chip. See Figure 3.

Internal Circuit Diagram
PIN FUNcTlQN

YELLOW/
1

2

3

4

*'

.* e* *" *"
ht ,* t·
*"'*

HIGH EFFICIENCY RED LED

8

7

6

5

GRe.ENI

PIN

HER

EMERALD

1
2
3

CATHODE a

ANODEe

ANODE a

CATHODEe

ANODEb

CATHODEf

4

CATHODE b

ANODEf

5
6

CATHODEc
ANODEc

7
8

ANODEd

Ct\';1'H9DEg
CATHODEh

CATHODE d

ANODEh

ANODEg

YELLOW OR GREEN LED

Electrical/Optical Characteristics at TA = 25°C
HIGH EFFICIENCY RED/YELLOW

HLMP-2950

Parameter

Symbol

HER

Min.

Typ.

9

43

8

Iv

HER
Peak Wavelength

Yellow

5

Yellow

49

mcd

35

mcd

43

mCd

20 mA DC
60 rnA Pk: 1 of 3
Duty Factor

20 rnA DC
60 rnA Pk: 1 of 3
Duty Factor

nm

583
626

Ad

nm

585

HER

2.1

2.6

2.2

2.6

VF

Forward Voltage
Yellow
Thermal Resistance LED
Junction-lo-Pin

mcd

Test Conditions

635
APEAK

HER
Dominant Wavelength

Units

Iv

Luminous Intensity·4
Yellow

Max.

150

OJC

5-15

V

·C/W/LED

IF

= 20 rnA

Electrical/optical Characteristics at TA = 25°C
HIGH EFFICIENCY RED/GREEN

HLMP-2965

Parameter

Symbol

HER
Luminous Intensity

Min.

Typ.

9

43

Iv

Max.

mcd

49

4

HER
Green

mcd

20mA DC

mcd

60 mA Pk: 1 of 3
Duty Factor

nm

565
626

Ad

Grwn

Vp

Green

Thermal Resistance LED
Junction-to-Pin

nm

572

HER
Forward Voltage

20mA DC
€OmAPk:10f3
Duty Factor

635

APEAK

HER
Dominant Wavelength lSI

I

Iv

56

Peak Wavelength

Te$t Conditions

mcd

7.5

Green

Units

2,1

2.6

2.2

2.6

IF =20 mA

".C/W/LED

150

ROJ-PIN

V

HIGH EFFICIENCY RED/EMERALD GREEN HLMP-2980
Parameter

Symbol

Min.

HER

Iv

9

Emerald

Iv

7.5

Peak Wavelength

HER
Emerald

'\PEAK

Dominant Wavelength

HER
Emerald

Ad

Forward Voltage

HER
Emerald

VF

Luminous
Intensity

Thermal Resistance LED
Junction-to-Pln

R6J-PIN

1\'p.

Max.

43

49
18

22

635
556
626

Test Conditions

moo

20mADC
6OmAPk: 1 ot3 Duty Factor

mcd

20mADC
60 mA Pk: 1 of3 Duty Factor

om
nm

558

2.0

2.6

2.2

2.6

150

Units

V

IF=20mA

·C/W/LED

NOTES:
4. These devices are categorized for luminous intensity with the intensity categorization designated by a two letter combination code located
on the side of the package (Z ; HER, W; Yellow, Green or Emerald).
5. The dominant wavelength, Ad, is derived from the C.I.E. chromaticity diagram and is that single wavelength which defines the color
of the device,

5-16

-----_._------.-----

Electrical
The HLMP-29501-2965/-2980 bicolor light bar devices are
composed of eight light emitting diodes: four High Efficiency Red and four that either Yellow, Green, or Emerald.
The light from each LED is optically scattered to form an
evenly illuminated light emitting surface. The LED's are die
attached and wire bonded in bicolor pairs, with the anodel
cathode of each LED pair brought out by separate pins.
The typical forward voltage values, scaled from Figure 5,
should be used for calculating the current limiting resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design and maximum power dissipation may be approximated using the
following VF models:
VF = 1.8V + IPEAK (40!1)
For IPEAK 2 20 mA
VF = 1.6V + IDC (50!1)
For 5 mA S IDC S 20 mA
The maximum power dissipation can be calculated for any
pulsed or DC drive condition. For DC operation, the
maximum power dissipation is the product of the maximum
forward voltage and the maximum forward current. For

pulsed operation, the maximum power dissipation is the
product of the maximum forward voltage at the peak
forward current times the maximum average forward
current. Maximum allowable power dissipation for any
given ambient temperature and thermal resistance I ROJ-A I
can be determined by using Figure 2. The solid line
in Fig ure 2 (ROJ-A of 538 0 C/W I represents a typical thermal
resistance of a device socketed in a printed circuit board.
The dashed lines represent achievable thermal resistance
that can be obtained through improved thermal design.
Once the maximum allowable power dissipation is determined, the maximum pulsed or DC forward current can be
calculated.

Optical
The radiation pattern for these light bar devices is approximately Lambertian. The luminous sterance may be calculated using one of the two following formulas:

Lv (cd/m2) =

Lv (footlamberts) =

1Tlv(cd)
A (ft2)

where the area (AI of the light emitting surface is 67.74 x
10-6 m 2 (729.16 x 10-6 ft.2l.

For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, see Application Note 1005.

Figure 1. Maximum Allowed Peak Current

VS.

Pulse Duration.

5-17
-----

..

__..._ - -

;:

35

180

E

z

REb.

160

30

0

;::

it

140

~

120

~

100

2

80

"

60

Q

,

t5
CC

"
«
"J'
X

20

0

15

,::

::>

"«

cc

::>
u
u

«

RaJA ..

r- A(lJ~

u

0

00

0

10

u

t5

1.1

U

~w

1.0

0.8

,

0.7

~

0.6

30

40

50

/

l# P'"'"

E

70

I

t5cc

60

/

«

.:.

GREEN:lM:H

cc
::>
u

'I

I

cc

40

cc

30

~

50

60

70

80

if)

o

2.4

+t-

2.2

3~

00

Zw
~~

~t·H~
i
.
J

1.8

:bi=

l

J T~

1.4

1.2
1.0

~

__

-i--

1.6

0.8
0.6

a:

- 1--' - ' '.

2.0

3
;::

\

\

A(I~ .s~e·ckILEI,/

TA - AMBIENT TEMPERATURE - C

>-

•

\

10

"c

40

1'\

"Ldw

25

I-

S

X

G~EEI'J.1EME~ALDj

«E

I

- rV

0.4
0.2

00

~

.,.""

i..<'

vrt,-i

l-r-

RED, YELLOW•. I

GREEN. EMERALD-

10

15

20

25

f._.

/-

_.
30

IOC-DC CURRENT PER LED-rnA

Figure 6. Relative Luminous Intensity vs. DC Forward Current.

5-18

---------~---~~~-

Reversing Polarity LED Drivers
Bicolor LED light bar modules require a polarity reversing
scheme to turn on the desired LED. Reversing line drivers,
timers and memory drivers can be used to drive bicolor
LED light bars.

output control or provide other means for turning both
LED's off. An example of this circuit technique is shown in
Figure 11.
The NE556 dual timer, or two NE555 timers can also be
used to drive bicolor light bars, as shown in Figure 12. The
outputs at the NE555 timer are able to source or sink up to
200 mAo Connected as shown, each timer acts as an inverting buffer. This circuit has the advantage over the previous
line driver circuits of being able to operate at a wide variety
of power supply voltages ranging from 4.5 to 16 volts.

The reversing line driver, which was originally designed to
drive a data transmission line, can also be used as a polarity
reversing driver for bicolor LED modules. The reversing line
driver has a totem pole output structure that differs from
most TTL circuits in that the output is designed to source
as much current as it is capable of sinking.
Line drivers designed to operate from a single 5V supply
are typically specified to source or sink 40 mAo Figure 7
shows the typical output characteristics of three different
line drivers connected so that one output sources current
across a load and the current is sunk by another output.
This circuit is shown in Figure 8. At 40 mA output current,
the output voltage typically varies from 2.4V 1741281 to 2.9V
10M 8830, 96141 for Vee = 5.0V. A basic bicolor LED circuit
is shown in Figure 9. Since a line driver can supply 40 mA, it
is capable of driving two LED pairs.

Memory drivers can also be used to drive bicolor light bars.
Figure 13 shows a 75325 core memory driver being used to
drive several pairs of bicolor LEOs. The 75325 is guaranteed to supply up to 600 mA of current with an output
voltage considerably higher than 5V line drivers. The 75325
requires an additional 7.5V power supply at about 40 mA to
properly bias the sourcing drivers. The 75325 allows tristate (red, green, yellow, or emerald, off) operation.
By employing pulse width modulation techniques to any of
these circuits a range of colors can be obtained. This technique is illustrated in Figure 14.

Some line drivers like the 9614 are constructed such that
the sourcing output is brought out separately from the sinking output. With this type of line driver, the LED currents for
each pair can be controlled separately. This technique is
shown in Figure 10. Other line drivers provide a tri-state

~=

BO

"~
I-

~-~

a:

"

I--'S

,

40

l-

v'

96\4
I

-

1412B -

1\

I:l

S

V

R~

i;:

l'

----~------------------~---vcc

VDMB830

"'\

"\

60

iiia:

:l

1-- i--.

Hewlett-Packard cannot assume responsibility for use of
any circuitry described other than the circuitry entirely
embodied in an HP product.

, \1\

20

I
o

o

r\\

"

Va-OUTPUT VOLTAGE - V

Figure 7. Typical Output Characteristics of Reversing Line Drivers.

~
GREEN,
YELLOW

Figure S. Line Driver Equivalent Circuit.

1/29614

RED,
GREEN,
YELLOW
EMERALD

1/2 DM8830

5

36<1

3

4

15<1

36<1

15<1

7.5n

REO

GREEN,
YELLOW,
EMERALD

RED

GREEN,
YELLOW,
EMERALD

YIELDS APPROXIMATELY 20mA/RED LED

YIELDS APPROXIMATELY 25mA/ YELLOW,
GREEN, OR EMERALD LED

Figure 9. Typical Line Driver Circuit; Approximately 20mA/LED Pair.

5-19

Figure 10. Techniques for Varying the Current of Each LED.

15~!

15!!

GREEN,
YELLOW,
EMERALD

RED

ENABLE----~-------------------+~~

Figure 11. Tristate (Red, GreenlYeliow/Emerald, Off) Bicolor LED Driver.
+6V

RED, GREEN, YELLm,,!,
EMERALD

lon

10S2

RED

YIELDS APPROXIMATELY 25mA/LED PAIR

Figure 12. Use of Dual Timer to Drive Bicolor Light Bars
+V)" 7.5

1/67404
RED, GREEN, YELLOW,

W

A

EMERALD
1/279325

ENAB LE

X

15

---t------------t- 0.25

10,300' 0.015)

.-~~-----~~~~~~~~~~~~~~~~--~~~

Absolute Maximum Ratings[91
HDSP:..t820

Parameter
Average Power Dissipation per LED
(T=25°C)11]

HDsNMD

HDSP·4830

HOSP-4850 'HOSP.4890'

125mW

125mW

125mW

125mW

125 mW

Peak Forward Current per LED

150 mA12)

9OmA131

60mA[31

90mAt3]

90 mAl31

DC Forward Current per LED

30 mA14}

30 mAIG]

30 mA17}

30mA!71

Operating Temperature Range

30mA15}
-40 C to +85 C
0

-20'Cto+SS"'C

0

":40"C to +85' C

Storage Temperature Range

3.0 V

Reverse Voltage per LED
Lead Soldering Temperature
(1.5~ mm (1/16 inch) below seating planelS]

2600 C for 3 sec

NOTES:
1. Derate maximum average power above TA = 25' C at 1.67 mW/' C. This derating assumes worst case R8J-A = 600' C/W/LED.
2. See Figure 1 to establish pulsed operating conditions.
3. See Figure 6 to establish pulsed operating conditions.
4. Derate maximum DC current above TA=63' CatO.81 mAl' C per LED. This derating assumes worst case R8J-A= 600' C/W/LED. With
an improved thermal design, operation at higher temperatures without derating"is possible. See Figure 2.
5. Derate maximum DC current above T A= 50' C at 0.6 mAl' C per LED. This derating assumes worst case R8J-A = 600' C/W/LED. With an
improved thermal design, operation at higher temperatures without derating is possible. See Figure 7.
6. Derate maximum DC current above TA=70' C atO.67 mAl' C per LED. This derating assumes worst case R8J-A= 600' C/W/LED. With
an improved thermal design, operation at higher temperatures without derating is possible. See Figure 8.
7. Derate maximum DC current above TA=37' C at0.48 mAl' C per LED. This derating assumes worst case R8J-A=600' C/W/LED. With
an improved thermal design, operation at higher temperatures without derating is possible. See Figure 9.
8. Clean only in water, Isopropanol, Ethanol, Freon TF or TE (or equivalent) and Genesolve 01-15 (or equivalent!.
9. Absolute maximum ratings for the HER, Yellow, and Green elements of the multicolor arrays are identical to the HDSP-4830/-48401
-4850 maximum ratings.

Multicolor Array
Segment Colors

Internal Circuit Diagram
~a

~Ib

K.c

~
~
~
~

.
d

f
9

K
h

!"j;

20

Segment
19
18

17
16

PIN
1

2
3

4
5

15

14
13

6
7

8
9

10

FUNCTION
ANODE-a
ANODE-b
ANODE-c
ANODE-d
ANODE-e
ANODE-f
ANODE-g
ANODE-b
ANODE-i
ANODE-j

PIN

FUNCTION
CATHODE-j
CATHODE-i
CATHODE-h
CATHODE-g
CATHODE-f
CATHODE-8
CATHODE-d
CATHODE-c
CATHODE-b
CATHODE-a

11
12
13
14
15
16

17
18
19
20

12

j

10

'I

11

HOSP·4832
Segment Color

HDSP-4836
Segment Color
HER

a

HER

b

HER

HER

c

HER

Yellow

d

Yellow

YellOW

e

Yellow

Green

f

Yellow

Green

9

Yellow

Yellow

h

Green

Yellow

i

Green

HER

j

Green

HER

Electrical/optical Characteristics at TA = 25° C4l
RED

HDSP-4820

Parameter
Luminous Intensity per LED
(Unit Average)111

Symbol

IF

Test Conditions

Min.

Typ.

IF ""20 mA

610

Max.

Units

1250

"cd

APEAK

655

nm

Dominant Wavelength J21

Ad

645

Forward Voltage per LED

VF

If "" 20 mA

Reverse Voltage per LED

VR

IR= 100"A

Peak Wavelength

1.6

3

nm
2.0

V

12[51

V

Temperature Coefficient VF per LED

AVF!·C

-2.0

mV/oC

Thermal Resistance LED Junction-to-Pin

R0J-PIN

300

'C/WI
LED

5-27

HIGH-EFFICIENCY RED

HDSP-4830

Parameter

Symbol

Luminous Intensity per LED
(Unit Average)f11

Iv

Peak Wavelength
ngth l21
Forward Voltage per LED

Test Conditions

Typ.

IF=10 rnA

Max.

units

3500

pcd

APEAK

635

nm

Ad

626

nm

VF

IF=20mA

21

VR

IR =< 100 I'A

3015J

V

Temperature Coefficient VF per LED

AVFrC

-2,0

mVioC

Thermal Resistance LED Junction-lo-Pin

ReJ-PIN

300

"C/WI

Reverse Voltage per LED

3

LED
YELLOW

HDSP-4840

Parameter

Symbol

Luminous Intensity per LED
(Unit Averagei ll1

Iv

Peak Wavelength

Test Conditions

Min.

Typ.

IF=10mA

600

1900

ApEAK

Max.

Units
/Lcd

583

Dominant Wavelength l2,31

581

Ad

Forward Voltage per LED

VF

IF=20mA

Reverse Voltage per LED

VR

IR= 100 J.lA

Temperature Coefficient VF per LED

ilVF/"C

Thermal Resistance LED Junction-to-Pln

RaJ-PIN

3

565

nm

592

nm

~~t-~

mV/OC

300

"c/WI
LED

GREEN

HDSP-4850
Symbol

Parameter
Luminous Intensity per LED
(Unit Averagei PI

Iv

Peak Wavelength

Test Conditions

Min.

Typ,

fF=10mA

600

1900

Max.

;tcd

APEAK

566

Dominant Wavelength l2,31

Ad

571

577

Forward Voltage per LED

VF

IF=< 10 rnA

2,1

2.5

Reverse Voltage per LED

VR

IR= 100 J.lA

Temperature Coefficient VF per LED
Thermal Resistance LED Junction-to-Pin

Units

nm
nm
V

50[5(

V

iWF/·C

-2,0

mV/"C

ReJ-PIN

300

·C/WI

3

LED
EMERALD GREEN HDSP-4890
Parameter
Luminous Intensity Per LED
(Unit Average)(l)
Peak Wavelength

Symbol

Iv

Test Conditions
IF

~

10mA

Min.

Typ.

2S0

• 1600

t-PEAK

556

Dominant Wavehmgth[2,3]

Ad

558

Forward Voltage Per LED

VF

iF=10mA

2.2

Reverse Voltage Per LED

VR

IR = 100JLA

solS}

TemperatureCoefficient VF Per LED

/),VFrC

Thermal Resistance LED
Junction-to-Pin

R6J-PIN

t=

Max.

Units
fL cd

nm
nm
2.5

V

-2.0

.mVrC

300

"C/W/LED

NOTES:
1, The bar graph arrays are categorized for luminous intensity. The category is designated bya letter located on the side of the package,
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the
device,
3, The HDSP-4832/-4836/-4840/-4850/-4890 bar graph arrays are categorized by dominant wavelength with the category designated by
a number adjacent to the intensity category letter. Only the yellow elements of the HDSP-4832/-4836 are categorized for color.
4. Electrical/optical characteristics of the High-Efficiency Red elements of the HDSP-4832/-4836 are identical to the HDSP-4830
characteristics, Characteristics of Yellow elements of the HDSP-4832/-4836 are identical to the HDSP-4840. Characteristics of Green
elements of the HDSP-4832/-4836 are identical to the HDSP-4850.
5. Reverse voltage per LED should be limited to 3,0 V Max,

5-28

-_

----~

....

-----------------

-----------------

HDSP-4820

I'; ,

!
I
Ii
OPERATION IN
,09 ~
t::-=~r--=Sl[ilE=~~E=em==ls.:J=l=E~~=Eta:am
THIS
REQUIRES
REGION
8
TEMPERATURE
! : Ii! 'i

20 ....

I!

'5 .--- -;-1~'"

'2.5

,.

i

_

'i '

-!--"-+H',j-c-----j! I
\.

i

!

! i '

.. _-; __ J- •

J ' Ii i

I,

7

DERATING OF

\.

\.

IDe MAX

\.

tp - PULSE DURATION - IlSEC

Figure 1. Maximum Tolerable Peak Current vs. Pulse Durallon

"E
...I

:lia:

,.
ai"

35

RfJJ.A"

20

::>

:;

X

'5

:;

,0

"

1.0

-

485'CIWISEG/

w

\\

>
i=

0,9

~
a:

R(L. ~oo)IW/slG~ ""\\\

f---

/

~

\\

.---f-- ....

25

-.... r-

("

U

30

a:

::>

""c
:;

-

,. ,

45
40

I

1

0.8

C

u
0

0.7
10

20

30

40

50

60

70

80

90

a

20

40

60

80

100

120

140 I 160
,50

TA - AMBIENT TEMPERATURE - QC

Ipeak - PEAK SEGMENT CURRENT - rnA

Figure 2. Maximum Allowable D.C. Current per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance, LED Junction-to-Ambient
on a per LED basis. TJMAX = 100' C

Figure 3. Relallve Efficiency (Luminous Intensity per Unit
Current) vs. Peak Segment Current

.
E

160

1.4

140

~
'"w

120

1.0

::>~

:;

80

00

a

60

C
:E
::>w
... N

/

.8
.6

/

w'"

~

><1:
-:;

"'a:

40

.4

fr

20

-'"

./
o

.4

,8

1.2

1.6

2,0

2.4

2.8

.2

o

/

o

3.2

V F - FORWARD VOL T AGE - V

/

,/

"0

ulz
",-

a

/

z ...

go

~

WN

Z"
C;;~

~

.

1.2

......
100

./

>-

~1
zo

~

z
~

10

15

20

25

I, .. SEGMENT DC CURRENT .. mA

Figure 5. Relative Luminous Intensity vs. D.C. Forward 'Current

Figure 4. Forward Current vs. Forward Voltage

For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.

5-29

HDSP-4830/-4840/-4850/-4890
20
15

V

12
10
9

UJ1JJl~, HotU
t
1

Jllilf

HDSPiTI30

B

\.

--- -Xix
~,.

< u
~E

1.5

--.

C-

\

1\

11 ~
\'b

'{~,

)

1

i\. I
\1"'1>",

\.
\.

\

««

OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
IDe MAX.

HDSP-~14O

10

!>t'1>'i,'S-ll

~f\i

~&1,<

-,

1000

100

~

10,000

DCOPERATION

tp - PULSE DURATION - .uSEe

Figure 6. HDSP-4B30/-4B40/-4BSO/-4B90 Maximum Tolerable Peak Current VS. Pulse Duration
45

",
E

40

...
ffi0:

35

0:

30

"g
:0
::>
:0

20

"E,
...

"

w

RElJ-A • 600'ClWfSEG \
14

""
:0

12

25
20

:0

",
:0

15

"

X

10

X

::>
Q

::>

X

~

\

16

0:
0:

::>

~

18

10

X
:0
I

"E
:0

II

2

o

o

TA - AMBIENT TEMPERATURE _ °C

10

20

30

40

Figure 7. HDSP-4830 Maximum Allowable D.C. Current per LED
vs. Ambient Temperature. Deratln!js Based on Maximum Allowable Thermal Resistance Values, LED Junction-to-Ambient on a
per LED basis. T J MAX = 1000 C.

E
I

40r--r--+--1---r--+--r-+---r--;

ffi

35r--r--+--1---r--+--r--+--r--;

...

1,5

~

1.4

ffit3

1.3

::>

~

1.2

Q

w

0:
0:

""
~

~w

~

-

:0

/"

,.

70

80

90 100

I

0.9

"~

0.8

"

0.7

~

:0

II

0.6

..I
...... HO~~OS~R!E~
1l00J>-483ilSERIES

-::::

HDSP-48!;O SERIES
IlDSP-4890 SERIES

I

0:

I

/

luV

1
1.
1.0

:0

TA - AMBIENT TEMPERATURE _

60

Figure B. HDSP-4B40 Maximum Allowable D.C. Current per LED
vs. Ambient Temperature. Deratlngs Based on Maximum Allowable Thermal Resistance Values, LED Junction-to-Ambient on a
per LED basis. TJ MAX = 1000 C.
1,6

"

50

TA - AMBIENT TEMPERATURE _ °C

-4o

10

20

30

40

50

60

70

80

90 100

IpEAK - PEAK SEGMENT CURRENT - rnA

°c

Figure 9. HDSP-4BSO/-4B90 Maximum Allowable D.C. Current per
LED VS. Ambient Temperature. Deratings Based on Maximum
Allowable Thermal Resistance Values, LED Junction-to-Ambient
on a per LED basis. TJ MAX = 100' C.

Figure 10. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Segment Current

For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.

5-30

HDSP-4830/-4840/-4850/-4890
4.0

>

L

3.5

V

I-

in

fil

3.0

I

l-

;;;

"'"0z

2.5

:E

2.0

r--

w

1.5

I--

'"

1.0

:3

>
;::
-'
w

0.5

2.0

3.0

4.0

oV
0

5.0

== V

,/

0:

1.0

L

V

5

10

15

20

25

30

35

40

IDe - DC CURRENT PER LED - mA

VF - FORWARD VOLTAGE - V

Figure 11. Forward Current YS. Forward Voltage

Figure 12. HDSP-4830/-4840/-4850/-4890 Relative Luminous
Intensity vs. D.C. Forward Current

Electrical
These versatile bar graph arrays are composed of ten light
emitting diodes. The light from each LED is optically
stretched to form individual elements. The diodes in the
HDSP-4820 bar graph utilize a Gallium Arsenide Phosphide
(GaAsP) epitaxial layer on a Gallium Arsenide (GaAs) Substrate. The HDSP-4830/-4840 bar graphs utilize a GaAsP
epitaxial layer on a GaP substrate to produce the brighter
high-efficiency red and yellow displays. The HDSP-4850/
-4890 bar graph arrays utilize a GaP epitaxial layer on a
GaP substrate. The HDSP-4832/-4836 multicolor arrays
have high effiCiency red, yellow, and green LEDs in one
package.

Refresh rates of 1 KHz or faster provide the most efficient
operation resulting in the maximum possible time averaged
luminous intensity.
The time averaged luminous intensity may be calculated
using the relative efficiency characteristic shown in Figures
3 and 10. The time averaged.luminous intensity at TA =
25° C is calculated as follows:

r

l

IF AVG
Iv TIME AVG = ~F SPEC AV~('1IPEAK) (Iv SPEC).

These display devices are designed to allow strobed operation. The typical forward voltage values, scaled from Figure4
or 11, should be used for calculating the current limiting
resistor value and typical power dissipation. Expected maximum VF values, for the purpose of driver circuit design and
maximum power dissipation, may be calculated using the
following VF MAX models.

Example: For HDSP-4830 operating at IPEAK = 50 mA, 1 of 4
Duty Factor

'1IPEAK = 1.35 (at IPEAK = 50 mAl

HDSP-4820 (Red)
VF MAX = 1.75 V + IPEAK (12.5fll
For: IPEAK 2: 5 mA

r12.5 mAl
Iv TIME AVG = l1 0 mA (1.35) 2280 !lcd = 3847 !lcd

j

HDSP-4830/-4840 (High Efficiency Red/Yellow)
VF MAX = 1.75V + IPEAK (38!})
For IPEAK 2: 20 mA
VF MAX = 1.6V + loc (450)
For: 5 mA:5 loc :5 20 mA
HDSP-4850/-4890 (Green/Emerald)
VF MAX = 2.0V + IPEAK (500)
For: IPEAK > 5 mA

For Further Information Concerning Bar Graph Arrays and Suggested Drive Circuits,
Consult HP Application Note 1007 Entitled "Bar Graph Array Applications".

5-31

Flin-

HE.WLETT

a!~ PACKARD

101 ELEMENT
BAR GRAPH ARRAY
RED HDSP~8820
HIGH EFFICIENCY RED HDSP-8825
HIGH PERFORMANCE GREEN HDSp·8835
TECHNICAL DATA

JANUARY 1986

Features
• HIGH RESOLUTION (1%)
• EXCELLENT ELEMENT APPEARANCE
Wide, Recognizable Elements
Matched LEOs for Uniformity
Excellent Element Alignment
• SINGLE-IN-L1NE PACKAGE DESIGN
Sturdy Leads on Industry Standard 2.54 mm
(0.100") Centers
Environmentally Rugged Package
Common .Cathode Configuration
• LOW POWER REQUIREMENTS
1.0 rnA Average per Element at 1% Duty Cycle
• SUPPORT ELECTRONICS
Easy Interface with Microprocessors

Description
The HDSP-88XX series is a family of 101-element LED linear arrays designed to display information in easily
recognizable bar graph or position indicator form. The
HDSP-8820, utilizing red GaAsP LED chips assembled on
a PC board and enclosed in a red polycarbonate cover
with an epoxy backfill seal, has 1.52 mm (0.060 inch) wide
segments. The HDSP-8825 and HDSP-8835 are high efficiency red and high performance green respectively, each
with a 1.02 mm (0.040 inch) segment width. The HDSP8825 and HDSP-8835 have a clear polycarbonate lens.
Mechanical considerations and pin-out are identical

among all 3 devices. The common cathode chips are
addressed via 22 single-in-line pins extending from the
back side of the package.

Applications
• INDUSTRIAL PROCESS CONTROL SYSTEMS
• EDGEWISE PANEL METERS
• INSTRUMENTATION
• POSITION INDICATORS
• FLUID LEVEL INDICATORS

Package Dimensions (1, 2)
MAGNIFIED ELEMENT DESCRIPTION

5-32

Internal Circuit Diagram (5,61
C'
~

0------4
"'''

tp - PULSE DURATION - ,usee

Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration HDSP-8820

!

OPERATION IN
THIS REGION
--REQUIRES
tTEMPERATURE

+H---I---f>-H-I+H+---l'.+-H-H+I!--I-H..J-++I-H

I g:~~T~:X.

1p - PULSE DURATION - psec

Figure 2. Maximum Tolerable Peak Current

VS.

Pulse Duration HDSP-8825 and HDSP-8835

5-35

'0

'0

"E

...I

ffi

0:
0:

:>

""
0

::;

ReJA

:>

::;
X
::;
I
~

"

H

"E

...I

='OOO"ClWILEO

ffi

a:
a:

"

:>

""0
::;

""-

:>

"::;X
"

I I

RIISA • 2000"ClWtLED

I

w

~

5

10

20

30

40

50

60

70 808590 100

10

TA - AMBIENT TEMPERATURE - QC

20

30

40

50

60

70 808590 100

TA ,- AMBIENT TEMPERATURE -

Figure 3. Maximum Allowable D.C. Current per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance, LED Junction-toAmbient on a per LED basis. TJMAX ~ 115 0 C
HDSP-8820

'c

Figure 4. Maximum Allowable D.C. Current per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance, LED Junction-toAmbient on a per LED basis. T JMAX ~ 1150 C
HDSP-8825/HDSP-8835

1.2 r-..,---,---,-...---r--r-r--r---,---,

200

,., l-+-+---1-+--+--t~I--+-+---1

"
E
I

...

-

'80
'60

HOSP-8820

II

iiia: '40
a:

::>
<.>

c
a:

"'a:"
f2

0.51--+-1-+-1-+--+-+--+-1-'"
0.41--+-1-+-1-+--+0.31--+-1-+-1-+--+-

~

'20

I
I

'00
80

I

60

'"~
I

40

~

20

HDSP-lJ82.

/"-

HOSP_

/}
o

0.5 1.0 1.5 2.0

2.5 3.0 3.5 4.0 4.5 5.0

VF -PEAK FORWARD VOLTAGE - V

IpEAK - PEAK CURRENT PER SEGMENT - rnA

Figure 5. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Segment Current

Figure 6. Forward Current

VS.

Forward Voltage

For A Detailed Explanation on the Use of Data Sheet Information, See Application Note 1005.

5-36

Operational Considerations
ELECTRICAL
The HDSP-88XX is a 101 element bar graph array. The
linear array is arranged as ten groups of ten LED elements
plus one additional element. The ten elements of each
group have common cathodes. Like elements in the ten
groups have common anodes. The device is addressed via
22 single-in-line pins extending from the back side of the
display.
This display is designed specifically for strobed (multiplexed) operation. Minimum peak forward current at which
all elements will be illuminated is 15 mA. Display aesthetics are specified at 100 mA, 1/110 DF, peak forward
current. The typical forward voltage values, scaled from
Figure 6 should be used for calculating the current limiting
resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following. VF model:
HDSP-8820

VFMAX = 2.02 V + IPEAK (0.8
For IPEAK > 40 mA

m

HDSP-8825

VFMAX= 1.7 V + IPEAK (14
For IPEAK > 40 mA

m

HDSP-8835

VFMAX = 1.7 V + IPEAK (14 0)
For IPEAK> 40 mA
The time averaged luminous intensity at TA = 25°C may
be calculated using:
Iv Time Avg. = [ I

IF-AVG
]
• 'II PEAK . IV-SPEC
F-SPEC-AVG

where 'I, relative efficiency, may be determined from Figure 5.

The circuit in Figure 7 displays an analog input voltage in
bar graph form with 101 bit resolution. The 74390 dual
decade counter has been configured to count from 0 to
99. The 1Q outputs correspond to "ones" and the 2Q outputs correspond to "tens". The "one" outputs from the
counter drives the display element anodes through a 7442
1 of 10 BCD decoder. Sprague UDN 2585 drivers source
the anodes with 80 mA peak/segment. The "ten" outputs
from the counter drive the group .cathodes through a
74145 BCD decoder. The circuit multiplexes segments 100
to 91 first. then segments 90 to 81, and so on with segments 10 to 1 last. During the time that the output from the
T.1. TL507C A/D converter is low the corresponding display elements will be illuminated.
The TL507C is an economical AID converter with 7 bit
resolution. The single output is pulse-width-modulated to
correspond to the analog input voltage magnitude. With
Vcc = 5 V the analog input voltage range is 1.3 V to 3.9 V.
The TL507C output is reset each time the 74390 resets.
Duration of the high output pulse is shorter for larger
analog input voltages. A high output from the TL507C disables the display by forcing the 7442 inputs to an invalid
state. Hence, as the analog input voltage increases more
elements of the bar graph display are illuminated. Display
element zero is DC driven.
The circuit in Figure 8 uses the HDSP-88XX as a 100 bit
position indicator. Two BCD input words define the posic
tion of the illuminated element. Display duty factor, 1/100,
is controlled by the ENABLE signal.

MECHANICAL
Suitable conditions for wave soldering depend on the specific kind of equipment and procedure used. A cool down
period after flow solder and before flux rinse is recommended. For more information, consult the local
Hewlett-Packard Sales Office or Hewlett-Packard Optoelectronics, Palo Alto, California.

5-37

. _ - - - - - - - - - - - - - _.... _ - - - - _ . _ - - - -

Vee

1

Vee

18

Va:

4"

lKIl

390n

NE555

l

Ion

74300
4 18
lIlA 3

~2A
12

0

'-------; 2B

6 TH
2

DI1T3

lOe

lOn 7,

F ¢ C ' V 'GND
.05"F

l'

,OI"F

20,..
2 CLII,

'0:1-

f e l l l2

20e
:2Gc

~
15 A

:~

1
2

14 B
1_'

3

~C

lA

Til

'

109 5
6

I
4 74LS32
'6

3
'4

~o

10
9

~

27

2

2

17

3
4

3

16

31
7

4

15

5

5

14

~:

6

6

7

7
8

13
12

34 A4
' 2 Ao

11

23

9

~

lQ

13

8

74Ls32

15

14

A

13
12

vye

B

AN ALOG
I NPUT

P

a
7

IN

1
5
9

13
17
21

Tl507C
GNO

~

Figure 7. 101 Element Bar Graph

5-38

Co
C'0
C20

C""
C40

eo.

25
29 Coo
33
37

0,.

c,.
C""

820n 11 A'

~

OUT 4

C

11

10
9

7
6
6
5
5
4
4
3
3
2
2
1
1
0

Vee

5

1

C

-

5KIl

VCC'I
6
lEN

6 A,

9
A

"

~R
2

19 Aa

~

'-----"'. C

l

18

117

-=-

9_

10J

RIC

*2OpF 14

1

A4
A.

10 UON 2585

10Kn

~

A7

9

2

IS
CUI

lie
lie

-=-

'
1

~

A..

10

'---

200

HOSP-88XX

UDN 2685

18

8~
spl)

Vee

r-----!

S
6
7

9

1

1

C'

Ion
Vee
7442
I)

15

BCD

{

14

B

DATA

1

:

Jk

2_

4_

-

5J

i-r
7

2
3

B

4

5
C

8

7

12

Ys 0

1

l-LIB

2

2

17

19

3

3

16

23

4

4

UDN;!585 15

2

5

5

14

34

6

13

35

7

7

12

15

9

B

11

7

B~

gp!.!-

Ion

.001 jJF

I

Ai

27 A10

110

~

HDSP-88XX

-=l=-

74145

It

C·'liNO

;~~J
-=-

Ai
A.

l

1'8

~

A3

A.I
/16

31 A.

dUDN ;!585 17

NESSI;
0U1'

A,

-=l=lB

1

0

6 1'H
2

A,

110

=

R Vee

6

6

VCC~9

300 Kn
3 Kn

A

74LS32

e

~

3

1

15

'A

14

B

BCD
DATA

13

C

12

0

L...

A

8
7

8
Ij

5
4

C

0

3
2

1

D

Figure 8. 100 Element Position. Indicator

5-39

11

37

10

33

9

29

7

25

6

21

5

17

4

13 C30

3

9

2

5

1

1

Coo

Ceo

eN
Coo

Cso
C4Q

t:l»
Cl0

00

•

•

-

•
elS1
-8
(';''''-'/
Z;;':",~,;;

•
••

6-1

•

• •
•

-

f:~l~;~·ill~i

Solid State Lamps
New products are the keystone of the HewlettPackard LED lamp products. This year the
broad line of lamp products is growing by five
new major product families.

Orange (60Bnm) and Emerald Green
(556nm) are additions to the broad range of
colors available for Hewlett-Packard lamps.
Last year HP introduced a family of T-l 3/4
right angle. status indicators, which provide·a
lamp with pre-formed leads inserted into a
high contrast, flat seating molded plastic
package. This year the right angle family is
complete with the addition of T -1 and
Subminiature package sizes.

Hewlett-Packard has two surface mount lamp
families, one for front panel or status indication
applications and the other for backlighting
applications. Both families are compatible
with automatic placement equipment and
reflow solder processes.
For the front panel designer the new 2mm
and 4mm flat top lamps provide wide viewing
angles and uniform light output to provide
excellent flush mounting ability.

In addition to new products, Hewlett-Packard
offers a broad selection of T -1, T -1 3/4, and
Subminiature lamps.

Aluminum Gallium Arsenide (AlGaAs) is an
improved red LED technology which
provides higher brightness and better
efficiency in an LED lamp.

6-2

Surface Mount Lamps (Gull Wing Lead)
Device
Package Oulline Drawing

0

n

Description
Colorl 2]
Part No.
HLMP-6000 Red
Option 011 (640 nm)
HLMP-6300 High
Option 011 Efficiency
Red
(626 nm)
HLMP-6400 Yellow
Option 011 (585 nm)
HLMP-6500 Green
Option 011 (569 nm)
HLMP-7000 Low Current
Option 011 High
Efficiency
Red
(626 nm)
HLMP-7019 Low Current
Option 011 Yellow
(585 nm)
HLMP-7040 Low Current
Option 011 Green
(569 nm)
HLMP-6600 integrated
Option 011 Resistor
HLMP-6620 High
Option 011 Efficiency
Red
(626 nm)

Package
Subminiature
Gull Wing
Lead
Configuration

Lens
Tinted
Diffused

Typical
Luminous
Intensity
1.2 mcd
@10mA
3.0 mcd
@10mA

0.8 mcd
@2mA

29112111
90°

70°

0.6 mcd
@2mA

2.4 mcd
@5V
0.6 mcd
@5V

Typical
Forward
Voltage
1.6 V
@10mA
2.2 V
@10mA

Page
No.
6-17

2.2 V
@10mA
2.3 V
@10mA
1.8 V
@2mA

1.9 V
@2mA

80°

9.6 mA
@5V
3.5 mA
@5V

Surface Mount Lamps (Yoke Lead)
Device
Package Outline Drawing

,_/
~
I

}

~

Description
Part No.
HLMP-6000
Option 021
HLMP-6300
Option 021

HLMP-6400
Option 021
HLMP-6500
Option 021
HLMP-7000
Option 021

HLMP-7019
Option 021
HLMP-7040
Option 021
HLMP-6600
Option 021
HLMP-6620
Option 021

Coior[2]
Red
(640 nm)
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)
Low Current
High
Efficiency
Red
(626 nm)
Low Current
Yellow
(585 nm)
Low Current
Green
(569 nm)
integrated
Resistor
High
Efficiency
Red
(626 nm)

Package
Subminiature
Yoke Lead
Configuration

Lens
Tinted
Diffused

Typical
Luminous
Intensity
1.2 mcd
@10mA
3.0 mcd
@10mA

0.8 mcd
@2mA

291/211]
90°

70°

0.6 mcd
@2mA

2.4 mcd
@5V
0.6 mcd
@5V

6-3

Typical
Forward
Voltage
1.6 V
@10mA
2.2 V
@10mA

2.2 V
@10mA
2.3 V
@10mA
1.8 V
@2mA

1.9 V
@2mA

80°

9.6 mA
@5V
3.5mA
@5V

Page
No.
6-21

2mm Flat Top Lamps
Device
Package Outline Drawing

H
~

~

~

rA~
;n
0

©}

Description
Part No.
Colorl21
HLMP-1800 High
Efficiency
HLMP-1801 Red
(626 nm)
I:lLMP-1819

Package
2mm Flat
Top, Round
Emitting
Surface

Lens
Tinted
Diffused

Yellow
(585 nm)

HLMP-1820
HLMP-1840 Green
(569 nm)
HLMP-1841
HLMP-L250 High
Efficiency
HLMP-L251 Red
(626 nm)

2mm Flat
Top, Square
Emitting
Surface

Tinted
Diffused

HLMP-L350 Yellow
(585 nm)
HLMP-L351
HLMP-L550 Green
(569 nm)
HLMP-L551

Typical
Luminous
Intensity
1.8 mcd
@10mA
2.9 mcd
@10mA
1.5 mcd
@10mA
2.5 mcd
@10mA
2.0 mcd
@10mA
3.0 mcd
@10mA
1.8 mcd
@10mA
2.9 mcd.
@10mA
1.5 mcd
@10mA
2.5 mcd
@10mA
2.0 mcd
@10mA
3.0 mcd
@10mA

281/2111
1400

Typical
Forward
Voltage
2.2 V
@10mA

Page
No.
6-25

2.2 V
@10mA

2.3 V
@10mA

1400

2.2 V
@10mA

2.2V
@10mA

2.3 V
@10mA

4mm Flat Top Lamps
Device
Package Outline Drawing

[

Description
Part No.
Colorl21
HLMP-M200 High
Efficiency
HLMP-M201 Red
(626 nm)
HLMP-M250

Package
4mm Flat
Top

Lens
Tinted
Diffused

Tinted
Non-Diffused

HLMP-M251

8

HLMP-M300 Yellow
(585 nm)
HLMP-M301

Tinted
Diffused

HLMP-M350

Tinted
Non-Diffused

HLMP-M351
HLMP-M500 Green
(569 nm)
HLMP-M501

Tinted
Diffused

HLMP-M550

Tinted
Non-Diffused

HLMP-M551

6-4

Typical
Luminous
Intensity
5.0 mcd
@20mA
7.0 mcd
@20mA
5.0 mcd
@10mA
7.0 mcd
@10mA·
5.0 mcd
@20mA
7.0 mcd
@20mA
5.0 mcd
@10mA
7.0 mcd
@10mA
7.0 mcd
@20mA
10.0 mcd
@20mA
10.0 mcd
@10mA
16.0 mcd
@10mA

281/2111
1500

Typical
Forward
Voltage
2.2 V
@10mA

2.2 V
@10mA

2.3 V
@10mA

Page
No.
6-35

----~.-.-------.-.

AIGaAs Lamps
Description

Device
Package Outline Drawing

Colorl 2)
Part No.
HLMP-D100 AIGaAs
Red
(646 nm)

T·13/4

HLMp·K100

HLMp·Q100

Package

Lens
Tinted
Diffused

Typical
Luminous
Intensity

28112[t)

Maximum
Forward
Voltage
3.0 V
@20mA

30 mcd
@20mA

65°

T·1

20 mcd
@20mA

60°

3.0 V
@20mA

Subminiature

5.5 mcd
@20mA

70°

3.0 V
@20mA

Description

Typical
Luminous
Intensity
3.5 mcd
@10mA

Page
No.
6·39

-

0

~

,..-" \
0

\

01

~

~

-<

I

Q
J1

e
'--"

=cOP
=&~

Tape and Reel: Solid State Lamps
Device
Package Outline Drawing

~

a
~

a

,

Part No.
HLMp·3300
Option 001

Colorl21
High
Efficiency
Red
(626 nm)

Package

Lens
Tinted
Diffused

T·13/4

28112111
65°

HLMp·3300
Option 002

HLMp·1301
Option 001

T·1

2.5 mcd
@10mA

HLMp·1301
Option 002

6-5

60°

Typical
Forward
Voltage
2.2 V
@10mA

Page
No.
6-43

Low Current Lamps
Description

Device
Package Outline Drawing

W
~
~

",-" \
0

\

Part No.
HLMp·4700

Colorl 2)
High
Efficiency
Red
(626 nm)

HLMp·4719

Yellow
(585 nm)

1.8 mcd
@2mA

1.9 V
@2mA

HLMp·4740 Green
(569 nm)

1.8 mcd
@2mA

1.8 V
@2mA

Package

Lens
Tinted
Diffused

T·13/4

I.

HLMp·1700 High
Efficiency
Red
(626 nm)

~
8

281121 1)
50°

Typical
Forward
Voltage
1.8 V
@2mA

01

'--'"

~

Typical
Luminous
Intensity
2.0 mcd
@2mA

HLMp·1719

~

'

T·l

Tinted
Diffused

1.8 mcd
@2mA

50°

1.8 V
@2mA

Yellow
(585 nm)

1.6 mcd
@2mA

1.9 V
@2mA

HLMp·1790 Green
(569 nm)

1.6 mcd
@2mA

1.8 V
@2mA

.

'--"

==0=6
=&~

fi
~

~

HLMp·7000 High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
HLMp·7040 Green
(569 nm)
HLMp·1740 High
Efficiency
Red
(626 nm)

Subminiature

Tinted
Diffused

0.8 mcd
@2mA

Tinted
Diffused

0.6 mcd
@2mA
0.6 mcd
@2mA
0.5 mcd
@2mA

HLMp·7019

HLMp·1760

2 mm Flat
Top. Round
Emitting
Surface

0.4 mcd
@2mA

Yellow
(585 nm)

@}

6-6

70°

140°

1.8 V
@2mA

1.9 V
@2mA
1.8 V
@2mA
1.8 V
@2mA

1.9 V
@2mA

Page
No.
6-47

Ultrabright Lamps
Description

Device
Package Duiline Drawing

/'\

Typical
Luminous
Intensity
125 mcd
@20mA

Typical
Forward
Voltage
2.2 V
@20mA

Part No.
HLMP-3750

Colorl21
High
Elficiency
Red
(626 nm)

HLMP-3850

Yellow
(585 nm)

140 mcd
@20mA

2.2 V
@20mA

HLMP-3950

Green
(569 nm)

120 mcd
@20mA

2.3 V
@20mA

HLMP-3390

High
Elficiency
Red
(626 nm)

HLMP-3490

Yellow
(585 nm)

2.2 V
@20mA

HLMP-3590

Green
(569 nm)

2.3 V
@20mA

HLMP-1340

High
Efficiency
Red
(626 nm)

HLMP-1440

Yellow
(585 nm)

2.2 V
@20mA

HLMP-1540

Green
(569 nm)

2.3 V
@2OmA

Package
T-13/4

Lens
Untinted
Non-Dilfused

281/2111
24°

,...--..-

~

~

8

[!J] [!J]i

"

_/

I

~~

e

T-13/4
Low Profile

Untinted
Non-Dilfused

55 mcd
@20mA

32°

2.2 V
@20mA

~_/.

,--...,

r-n~

e

T-1
Low Profile

'-_/

6-7

Untinted
Non-Diffused

35 mcd
@20mA

45°

2.2 V
@2OmA

Page
No.
6-51

Right Angle Indicators without current limiting resistor
Description

Device
Package Outline Drawing

fGJ ~

Part No.
HLMP-5000
HLMP-5030

HLMP-5040
HLMP-5050

W~
~

0

(

~ ~

11~~I~I~lq
-~n~~~~~

HLMP-l002
Option 010
HLMP-1301
Option 010

HLMP-1401
Option 010
HLMP-1503
Option 010
HLMP-6000
Option 010
HLMP-6300
Option 010

HLMP-6400
Option 010
HLMP-6500
Option 010
HLMP-1301
Option 104

HLMP-1401
Option 104
HLMP-1503
Option 104

Color!2]
Red
(640 nm)
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)
Red
(640 nm)
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)
Red
(640 nm)
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)

Package
T-13/4
Right
Angle
Indicator

T-l
Right
Angle
Indicator

Subminiature
Right
Angle
Indicator

T-l
Right Angle
Indicator
4-Element
Array

6-8

Lens
Red
Diffused

Yellow
Diffused
Green
Diffused
Red
Diffused

Yellow
Diffused
Green
Diffused
Red
Diffused

Yellow
Diffused
Green
Diffused
Tinted
Diffused

Typical
Luminous
Intensity
4.0 mcd
@20mA
6.0 mcd
@10mA

6.0 mcd
@10mA
2.4 mcd
@10mA
2.5 mcd
@20mA
2.5 mcd
@10mA

3.0 mcd
@10mA
2.0 mcd
@10mA
1.2 mcd
@10mA
3.0 mcd
@10mA

2.5 mcd
@10mA

3.0 mcd
@10mA
2.0 mcd
@10mA

2911211]
75 0
65 0

75 0
75 0
125 0
600

900

60 0

Typical
Forward
Voltage
1.6 V
@20mA
2.2 V
@10mA

2.2 V
@10mA
2.3 V
@10mA
1.6 V
@20mA
2.2 V
@10mA

2.2 V
@10mA
2.3 V
@10mA
1.6 V
@10mA
2.2 V
@10mA

2.2 V
@10mA
2.3 V
@10mA
2.2 V
@10mA

2.2 V
@10mA
2.2 V
@10mA

Page
No.
6-55

6-57

6-59

6-61

-~--~--

~------------

- - - - - - - - - - - - - - - - - ---

-----

-~-----

----------------

Right Angle Indicators with current limiting resistor
Descrlptlon

Device
Package Outline Drawing

~ ~

Part No.
HLMP-5012

HLMP-5070
HLMP-5080

Y

Red
(640 nm)

HLMP-5005
HLMP-5060

~

Colorl21

HLMP-1100
Option 010
HLMP-1600
Option 010

HLMP-1620
Option 010
HLMP-1640
Option 010

High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)
Red
(640 nm)
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)

Package
T-13/4
Right Angle
Indicator

T-1
Right Angle
Indicator

Lens
Red
Diffused

Yellow
Diffused
Green
Diffused
Red
Diffused

Typical
Luminous
Intensity
2 mcd
@12V
2 mcd
@5V
4 mcd
@5V

28112111
75°

65°

75°

1.5 mcd
@5V
4 mcd
@5V

60°

Yellow
Diffused
Green
Diffused

Typical
Forward
Current
13mA
@12V
13mA
@5V
10mA
@5V

10mA
@5V
12mA
@5V
13mA
@5V
10mA
@5V

Page
No.
6-55

6-62

10mA
@5V
12mA
@5V

I ntegrated Resistor Lamps
Description

Device
Package Outline Drawing

/'\

Part No.
HLMP-3105

Colorl2]
Red
(640 nm)

Package
T-13/4

Lens
Tinted
Diffused

HLMP-3112

I---

HLMP-3600
HLMP-3601

~

~

~~

!

\

HLMP-3650

Yellow
(585 nm)

HLMP-3651
HLMP-3680

[[] lI]i
/

HLMP-3681

Q
n

HLMP-1100

"- _ /

High
Efficiency
Red
(626 nm)

Green
(569 nm)

Red
(640 nm)

T-1

Tinted
Diffused
Untinted
Diffused
Tinted
Diffused

HLMP-1120
HLMP-1600
HLMP-1601
HLMP-1620

High
Efficiency
Red
(626 nm)
Yellow
(585 nm)

HLMP-1621

8
......

HLMP-1640

_/

Green
(569 nm)

HLMP-1641

6-9
--------------

Typical
Luminous
Intensity
2 mcd
@5V
2 mcd
@12V
4 mcd
@5V
4 mcd
@12V
4 mcd
@5V
4 mcd
@12V
4 mcd
@5V
4 mcd
@12V
1.5 mcd
@5V

2811211]
75°

65°

75°

60°

Typical
Forward
Current
13mA
@5V
13mA
@12V
10mA
@5V
13mA
@12V
10mA
@5V
13mA
@12V
12mA
@5V
13mA
@12V
13mA
@5V

50°
4 mcd
@5V
4 mcd
@12V
4 mcd
@5V
4 mcd
@12V
4 mcd
@5V
4 mcd
@12V

60°

10mA
@5V
13mA
@12V
10mA
@5V
13mA
@12V
12mA
@5V
13mA
@12V

Page
No.
6-62

Integrated Resistor Lamps (cant.)
Description

Device
Package Outline Drawing

=cfOP
~

~

Color[2[
Part No.
HLMP-6600 High
Efficiency
HLMP-6620 Red
(626 nm)
HLMP-6700

Package
Subminiature

Lens
Tinted
Diffused

2mm Flat
Top. Round
Emitting
Surface

Tinted
Diffused

Yellow
(585 nm)

HLMP-6720
HLMP-6800

Green
(569 nm)

HLMP-6820

H
~

~

HLMP-1660
HLMP-1661
HLMP-1674

Yellow
(585 nm)

HLMP-1675
HLMP-1687

@

High
Efficiency
Red
(626 nm)

Green
(569 nm)

HLMP-1688

Typical
Luminous
Intensity
5.0 mcd
@5V
2.0 mcd
@5V
5.0 mcd
@5V
2.0 mcd
@5V
5.0 mcd
@5V
2.0 mcd
@5V
1.0 mcd
@5V
1.0 mcd
@12V
1.0 mcd
@5V
1.0 mcd
@12V
1.0 mcd
@5V
1.0 mcd
@12V

281/211J
90 0

1400

Typical
Forward
Current
lOrnA
@5V
3.5 rnA
@5V
10 rnA
@5V
2.5 mcd
@5V
10 rnA
@5V
3.5 rnA
@5V
lOrnA
@5V
13mA
@5V
lOrnA
@5V
13mA
@12V
lOrnA
@5V
13mA
@12V

Page
No.
6-66

Rectangular Lamps
Description

Device
Package Outline Drawing

c:=:J

Part No.
HLMP-0300
HLMP-0301

W
~ ~

HLMP-0400

Color[2J
High
Efficiency
Red
(626 nm)

Package
Rectangular

Yellow
(585 nm)

HLMP-0401
HLMP-0503

Green
(569 nm)

HLMP-0504

6-10

Lens
Tinted
Diffused

Typical
Luminous
Intensity
2.5 mcd
@20mA
5.0 mcd
@20mA
2.5 mcd
@20mA
5.0 mcd
@20mA
2.5 mcd
@20mA
5.0 mcd
@20mA

28112[lJ
1000

Typical
Forward
Voltage
2.2 V
@20mA

2.2 V
@20mA

2.3 V
@20mA

Page
No.
6-69

------

--.--~-----.---------

Diffused (Direct View) Lamps
Description

Device
Package Outline Drawing

e

rg~

C]::'

Part No.
HLMP-3000

Color(2)
Red
(640 nm)

Package
T-13/4

Lens
Tinted
Diffused

HLMP-3001
Thin
Leadframe

HLMP-3002
HLMP-3003
HLMP-3300
HLMP-3301

High
Efficiency
Red
(626 nm)

T-13/4

HLMP-3762

r;:::-

HLMP-D400 Orange
(608 nm)
HLMP-D401
HLMP-3400

Yellow
(585 nm)

HLMP-3401
HLMP-3862

\

",-

"\

0

01

~_/

/

HLMP-3502

Green
(569 nm)

HLMP-3507
HLMP-3962
HLMP-D600 Emerald
Green
HLMP-D601 (555 nm)
HLMP-3200

Red
(640 nm)

T-13/4
Low Profile

HLMP-3201

-

HLMP-3350
HLMP-3351

~~

8

.,0 0)
"'-_/.

HLMP-3450

High
Efficiency
Red
(626 nm)
Yellow
(585 nm)

HLMP-3451
HLMP-3553

Green
(569 nm)

HLMP-3554

6-11

Tinted
Diffused

Typical
Luminous
Intensity
2.0 mcd
@20mA
4.0 mcd
@20mA
2.0 mcd
@20mA
4.0 mcd
@20mA
3.5 mcd
@10mA
7.0 mcd
@10mA
15.0 mcd
@10mA
3.5 mcd
@10mA
7.0 mcd
@10mA
4.0 mcd
@10mA
8.0 mcd
@10mA
12.0 mcd
@10mA
2.4 mcd
@10mA
5.2 mcd
@10mA
11.0 mcd
@10mA
3.0 mcd
@10mA
6.0 mcd
@10mA
2.0 mcd
@20mA
4.0 mcd
@20mA
3.5 mcd
@10mA
9.0 mcd
@10mA
4.0 mcd
@10mA
10.0 mcd
@10mA
3.2 mcd
@10mA
10,0 mcd
@10mA

281/2(1)

75°

65°

Typical
Forward
Voltage
1.6 V
@20mA

Page
No.
6-72

2.2 V
@10mA

6-74

2.2 V
@10mA

75°

2.2 V
@10mA

75°

2.3 V
@10mA

60°

1.6 V
@20mA

50°

2.2 V
@10mA

2.2 V
@10mA

2.3 V
@10mA

6-78

Diffused (Direct View) Lamps (cant.)
Description

Device
Package. Outline Drawing

Q
r;:rq

Part No.
HLMP-1000

Colorl2]
Red
(840 nrn)

Package
T-1

Lens
Tinted
Diffused

HLMP-1002
HLMP-1080
HLMP-1300
HLMP-1301

Untinted
Diffused
Tinted
Diffused

High
Efficiency
Red
(626 nrn)

HLMP-1302
HLMP-1385

8
' ....

_/

HLMP"K400 Orange
(608 nrn)
HLMP-K401
HLMP-K402
HLMP-1400

Yellow
(585 nm)

HLMP-1401
HLMP-1402
HLMP-1485
HLMP-1503 Green
(569 nrn)
HLMP-1523
HLMP-1585
HLMP-K600 Emerald
Green
HLMP-K601 (555 nm)
HLMP-1200

)l

Red
(640 nrn)

T-1
Low Profile

HLMP-1201
HLMP-1350

e
'-'

Untinted
Non-Diffused

High
Efficiency
Red
(626 nrn)
HLMP-1450 Yellow
(585 nrn)
HLMP-1550 Green
(569 nm)

Tinted
Diffused

Typical
Luminous
Intensity
1.0 rncd
@20rnA
2.5 rncd
@20rnA
1.5 rncd
@20rnA
2.0 rncd
@10rnA
2.5 mcd
@10rnA
4.0rncd
@10rnA
10.0 rncd
@10rnA
2.0 rncd
@1OrnA
2.5 mcd
@10rnA
4.0 rncd
@10rnA
2.0 rncd
@10rnA
3.0 rncd
@10rnA
4.0 rncd
@10rnA
10.0 rncd
@10mA
2.0 rncd
@10mA
4.0 rncd
@10rnA
6.0 rncd
@10rnA
2.0 rncd
@10rnA
2.5 rncd
@10rnA
1.0 rncd
@20mA
2.5 rncd
@20mA
2.0 rncd
@10rnA

28112[1]

1250

600

Typical
Forward
Voltage
1.6 V
@20rnA

6-84

2.2 V
@10rnA

2.2 V
@10rnA

2.2 V
@10rnA

2.3 V
@10rnA

1200

1.6 V
@20rnA

540

2.2 V
@10rnA

2.2 V
@10rnA
2.3 V
@10rnA

6-12

Page
No.

6-90

.----~--

-.-----.~--

..- . - - - - - -

Diffused (Direct View) Lamps (cant.)
Description

Device
Package Outline Drawing

Part No.
HLMP-6000

=~

Colorl 21
Red
(640 nm)

Package
Subminiature

Lens
Tinted
Diffused

HLMP-6001

=d= &1

rn g
o

0

o

D

~D

HLMP-6300

High
Efficiency
Red
(626 nm)
HLMP-Q400 Orange
(608 nm)
HLMP-6400 Yellow
(585 nm)
HLMP-6500 Green
(569 nm)
HLMP-Q600 Emerald
Green
(555 nm)
HLMP-6203
HLMP-6204
HLMP-6205
HLMP-6206
HLMP-6208
HLMP-6653
HLMP-6654
HLMP-6655
HLMP-6656
HLMP-6658
HLMP-6753
HLMP-6754
HLMP-6755
HLMP-6756
HLMP-6758
HLMP-6853
HLMP-6854
HLMP-6855
HLMP-6856
HLMP-6858

Typical
Luminous
Intensity
1.2 mcd
@10mA
3.2 mcd
@10mA
3.0 mcd
@10mA

281/2111
90 0

Typical
Forward
Voltage

1.6 V
@10mA

Page
No.
6-91

2.2 V
@10mA

2.2 V
@10mA
2.3 V
@10mA

-

.

Red
(640 nm)

3

High
Efficiency
Red
(626 nm)

3

4
5
6
8
4
5
6
8

1.2 mcd
@10mA

1.6 V
@10mA

3.0 mcd
@10mA

2.2 V
@10mA

'3

Yellow
(585 nm)

2.2 V
@10mA

4
5
6
8

3

Green
(569 nm)

2.3 V
@10mA

4
5
6
8

• Array Length

High Intensity Lamps
Description

Device
Package Outline Drawing

~

Part No.
HLMP-3050
HLMP-3315

-

HLMP-3316
HLMP-3415

Colorl 2]

Package

Red
(640 nm)
High
Efficiency
Red
(626 nm)

T-13/4

Yellow
(585 nm)

HLMP-3416
HLMP-3517

8)
o

0\1

Green
(569 nm)

HLMP-3519

'>---./

6-13

Lens
Tinted
Non-Diffused

Typical
Luminous
Intensity
2.5 mcd
@20mA
18.0 mcd
@10mA
30.0 mcd
@10mA
18.0 mcd
@10mA
30.0 mcd
@10mA
10.0 mcd
@10mA
25.0 mcd
@10mA

Typical
Forward
Voltage

Page
No.

24°

1.6 V

6-72

350

@20mA
2.2 V
@10mA

281/211]

2.2 V
@10mA

24°

2.3 V
@10mA

High Intensity Lamps (cont.)
Description

Device
Package Outline Drawing

~

Part No.
HLMP·3365
HLMP·3366
HLMp·3465

~~

Colorl21
High
Efficiency
Red
(626 nm)

Package

T·13/4
Low Profile

Lens
Tinted
Non·Diffused

Yellow
(585 nm)

HLMP·3466
HLMP·3567

8\0 0)

Green
(569 nm)

HLMp·3568

~~-...<

~

HLMP·l071

~4

HLMp·1320

?1;

HLMp·1321

Red
(640 nm)
High
Efficiency
Red
(626 nm)

T·l

Untinted
Non·Diffused

Tinted
Non·Diffused
Untinted
Non·Diffused
Tinted
Non·Diffused
Untinted
Non·Diffused
Tinted
Diffused

HLMp·1420 Yellow
(585 nm)
HLMp·1421
HLMp·1520 Green
(569 nm)
HLMp·1521

e
' ... _"

Typical
Luminous
Intensity
10.0 mcd
@10mA
18.0 mcd
@10mA
12.0 mcd
@10mA
18.0 mcd
@10mA
7.0 mcd
@10mA
15.0 mcd
@10mA
2.0 mcd
@20mA
12.0 mcd
@10mA

2S1/2111
45°

Typical
Forward
Voltage

Page
No.

2.2 V

6·78

@10mA

2.2 V
@10mA

40°

2.3 V
@10mA

80°

1.6 V

6·84

@20mA
45°

2.2 V
@10mA

12.0 mcd
@10mA

@10mA

12.0 mcd
@10mA

@10mA

2.2 V

2.3 V

Mounting Hardware
Device
Package Outline Drawing

Description
Part No.
HLMP·Ol03 Mounting Clip and Ring for T·l 3/4 Lamps

Page
No.
6·109

HLMp·5029 Right Angle Housing for T· 1314 Lamps

6·110

~ rr=J
[]

~

Emitter Components
Device
Package Outline Drawing

=&~
Noles:

Features
• Visible (Near IR) emmision facilitates alignment.
• Compatible with most silicon phototransistors
and photodiodes.

Description
Part No.
HEMT·6000 700 nm High Intensity
Subminiature Emitter

1) 291/2 is Ihe off·axis angle at which Ihe luminous intensily is half the axiallummous intensity.
2) Dominant wavelenglh

6-14

Page
No.
6·111

Hermetically Sealed and High Reliability LED Lamps
Description

Device
Package Outline Drawing

Part No.
lN5765
JAN1N5765[4J

Color[2[
Red
(640 nm)

Package
Hermeticl
TO-46[3J

Lens
Red
Diffused

Typlc31
Luminous
Intensity
1.0 mcd
@20mA

201/2[1[

70'

Typical
Forward
Voltage
1.6 V
@20mA

JANTX1N5765[4j

T

lN6092
JAN1N6092[4J

/--

.....

f
\

,

o () )
\

,

5.0 mcd
@20mA

2.0 V
@20mA

JANTX1N6092[4J
lN6093

/

High
Efficiency
Red
(626 nm)

Yellow
(585 nm)

Yellow
Diffused

Green
(572 nm)

Green
Diffused

3.0 mcd
@25mA

2.1 V
@25mA

Red
Diffused

1.0 mcd
@20mA

1.6 V
@20mA

5.0 mcd
@20mA

2.0 V
@20mA

3.0 mcd
@25mA

2.1 V
@25mA

JAN1N6093[4J
JANTX1N6093[4J

/
-~

lN6094
JAN1N6094[4J
JANTX1N6094[4J
HLMP-0904

Red
(640 nm)

Panel Mount
Version

HLMP-0930
HLMP-0931
HLMP-0354

High
Efficiency
JANM19500151901 Red
(626 nm)
JTXM19500151902
HLMP-0454

Yellow
(585 nm)

Yellow
Diffused

Green
(572 nm)

Green
Diffused

JANM19500152001

0

JTXM19500152002
HLMP-0554
JANM19500152101
JTXM19500152102

NOTES:
1. 01/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. Dominant Wavelength.
3. PC Board Mountable.
4. Military Approved and qualified for High Reliability Applications.

6-15
- - - - - - - _ . _ - - _.. _---- - - - - - -

Page
No.
8-18

Hermetically Sealed and High Reliability LED Lamps (cont.)
Device
Package Outline Drawing

Description
Part No.

Color lZI

HLMP·0363

High
Efficiency
Red
(626 nm)

HLMP-0391

T
~

..

/
()

\

,
\

I
\

,

();

HLMP-0392
HLMP-0463
HLMP-0491

Package
Hermetic
TO-18[3]

Lens

Typical
Luminous
Intensity

Clear
Class

50mcd
@20mA

2(·) 112111
18"

Typical
Forward
Voltage
2.0 V
@20mA

Yellow
(585 nm)

50 mcd
@20mA

2.0 V
@20mA

Green
(572 nm)

50 mcd
@25mA

2.1 V
@25mA

50 mcd
@20mA

2.0 V
@20mA

Yellow
(585 nm)

50 mcd
@25mA

2.0 V
@20mA

Green
(572 nm)

50 mcd
@25mA

2.1 V
@25mA

HLMP-0492
HLMP-0563
HLMP-0591

I
_/

HLMP-0592
HLMP-0364

11

HLMP-0365
HLMP-0366
HLMP-0464
HLMP-0465

High
Efficiency
Red
(626 nm)

Panel
Mount
Version

Clear
Glass

HLMP-0466

0

HLMP-0564
HLMP-0565
HLMP-0566

NOTES:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. Dominant Wavelength.
3. PC Board Mountable.

6-16

Page
No.
8-24

~---------

.....

~-----.------------------.----

SURFACE MOUNT OPTION FOR
SUB'MINIATURE LAMPS - GULL
WING LEAD C9NFIGYRATION

INDIVIDUAL SUBMINIATURE LAMP SUPPLIED IN 12mmT/I;PE - OPTION 011
SUBMINIATURE ARRAY SUPPLIED IN A SHippiNG TUBE - OPTION 013
TECHNICAL DATA

JANUARY 1986

Features
• GULL WING LEAD CONFIGURATION,
INDIVIDUAL SUBMINIATURE LAMPS AND
ARRAYS
• COMPATIBLE WITH AUTOMATIC PLACEMENT
EQUIPMENT
• COMPATIBLE WITH VAPOR PHASE REFLOW
SOLDER PROCESSES
• LOW PACKAGE PROFILE
• WIDE VIEWING ANGLE
• LONG LIFE - SOLID STATE RELIABILITY
• INDIVIDUAL SUBMINIATURE LAMPS ARE
SUPPLIED IN 12mm TAPE
• SUBMINIATURE ARRAYS ARE SUPPLIED IN
TUBES

Description

Device Selection Guide

These subminiature solid state lamps are encapsulated in an
axial lead package of molded epoxy. They utilize a tinted,
diffused lens providing high on-off contrast and wide angle
viewing.

Option

Description

Option 011

Individual subminiature lamps in gull wing
configuration. Supplied in 12mm tape on
seven inch reels; 1500 pieces per reel.
Minimum order quantity and order increment are 1500 pieces.

The leads of this device are bent in a gull wing configuration
for surface mounting. The device can be mounted using
automatic placement equipment.
The individual gull wing subminiature lamp is supplied in
12mm tape on seven inch reels per ANSI/EIA standard RS481 specifications. Gull wing subminiature arrays are
supplied in shipping tubes. The lamp can be mounted with
either batch or in line vapor phase reflow solder processes.
Subminiature lamps for surface mount applications are
available in standard red, high efficiency red, yellow, green,
integrated resistor, and low current versions.

Option 013 Subminiature array in gull wing
coniiguration. Supplied in shipping tubes.
Examples:
HLMP-6300
Option 011
High Efficiency Red
Supplied on Tape

HLMP-6658
Option 013
High Efficiency Red, 8 Element Array
Supplied in Tubes

Ordering Information
To obtain gull wing surface mount subminiature lamps,
order the basic catalog device with the appropriate option
code. Note: Option 011 is available for individual subminiature lamps only. Option 013 is available for subminiature
arrays only.

6-17
--~---

----- -_._--------

~-----

vapor Phase Reflow Solder Rating
Absolute Maximum Rating
Absolute Maximum Ratings
Vapor Phase Soldering
215°C for3 minutes
and Electrical/Optical
Temperature
Material FC-5311
Characteristics
Note: Lead soldering maximum rating is 260 0 C for 3 seconds.

The absolute maximum ratings and electrical/optical
specifications are identical to the basic catalog device,
except forthe vapor phase soldering rating as specified at
left.

package Dimensions
INDIVIDUAL SUBMINIATURE
1.6$ 10.065) OIA

i:9i(O]75l ~
ANODE

0.4810.018)

~J0:56 ili.Oni

J

3.81{(}.IGO} MAX,

NOTES,
1. ALL DIMENSIONS ARE IN MILLIMETRES
IINCHES),
f1)cATHooe LEAD IS IDENTI FlED BY THE
SILVER STRIPE,

L
1.27 (0.050)

rtUolo.055)

SUBMINIATURE ARRAY

NOTES,

--"iI Ir--~~
0.56 (O,{)22)

$=
G ~ U5~otA

1. ALL DIMENSIONS ARE IN MILLIMETRES
(INCHES).

2. OVERALL LENGTH IS THE NUMBER OF

CATHOO" STRIPE

L-..,:t,--iTr--'

1.91 10.075)

ELEMENTS TlM"S2.54mm 10.100 in,).

•

6-18

12 mm TAPE AND REEL

t1!
TOP TAPE

>

L-_ _ _ _ FEED DIRECTION _ _ _ _

TOLERANCES (UNLESS OTHERWISE SPECIFIED):

.X' .1; .XX' .05 (.xXX, .004t

~
I

NOTES:
1.

EMPTY COMPONENT POCKETS SEALED WITH TOP

2.

7 INCH REEL - 1,500 PIECES PER REEL.

3.

MINIMUM LEADER LENGTH AT EITHER END OF

COVER TAPE.

4.
S.

USER DIRECTION OF FEED

1 - -_ _ _ _

DIMENSIQNSPER
ANSI/EIA STANDARD RS-481*
ALL DIMENSIONS ARE IN
MILLIMETRES (INCHES).

>

A

178.0± 2.0(7.0± 0.08) OIA.

13.0 (0.512) DIA. TYP.

TAPE

END

THE TAPE IS 500mm.
THE MAXIMUM NUMBER OF CONSECUTIVE MISSING
LAMPS IS TWO.
IN ACCORDANCE WITH ANSI/EIA RS-4Bl
SPECIFICATIONS, THE CATHODE IS ORIENTED
TOWARDS THE TAPE SPROCKET HOLE.

o

1 5 +0.1 (0 059 +0.004) DIA
. -0.0 .
-0.000
.

D,

1.0 (0.039) DIA. MIN.
20.2 (0.795) DIA. MIN.
1.75.± 0.1 (0.069)
5.50 (0.127!. 0.002)

D,
E
Ko
N
Po
P,

NO
COMPONENTS

t

T

~

3.05 (0.120) TYP.
50.0 (1.970) MIN.
4.0 (0.157) TYP.
4.0 (0.157) TYP.
2.010.079'± 0.002) TYP.
0.310.012) TYP.
18.4 (0.72) MAX.
12.0± 0.3 (0.472.± 0.012)

THICKNESS OFTOP COVER TAPE

500 mm (19.7 in.) MIN.
BOTH ENDS

0.10 (0.004) MAX.

LEADER LENGTH

500 (19.7) MIN.

"EXCEPTION: THE EJECTOR-PIN HOLE (01) IS 1.0 (0.039) OIA. MIN.

6-19

REEL

REEL

!

I

-

-

-t--

C

rN

rlliI'J

HEWLETT

.:~ PACKARD

OPERATOR ____________
HP PART NUMBER ________
DATECODE ____________
TAPING DATE __________
ELEC. VALUE __________
TOLERANCE ___________
QUANTITy ___________

A

CUSTOMER PART NUMBER_

ARRAY SHIPPING TUBE

<____________

SUGGESTED TUBE FEED ____________

TUBE LABEL IDENTIFIES
CATHODE SIDE OF ARRAYS,

f~\ f---\ f~\ f~\ f--:i/
t-(~\
__ .LLf~\
__ .ll -- .ll __ l l __ .ll __ .l..1 _

L..Q,

~

11 h

(h~~!~tZ':~6

~_~ ~..gjJ

/
HLMP-

6XX3
6XX4
6XX5
6XX6
6XXB

6-20

NO. OF LAMP
ELEMENTS
PER ARRAY

3
4

5
6
B

QUANTITY
OF ARRAVS
PER TUBe

53
40
32
26
20

r/;~

HEWLETT

~~ PACKARD

SLJRFACE MOUNT OPTION
FOR SLJBMINIATLJRE LAMPS u~OKE" LEAP CONfIGLJRAT!~N
INIATURE LAMP SUPP!"9PIN 12mm TAPE -0
L SUBMINIATURE LAMPSUPP\,IED IN BULK -0
;,,::'--,';j

TECHNICAL DATA

JANUARY 1986

Features
• "YOKE" LEAD CONFIGURATION FOR
THROUGH HOLE MOUNTING ON PC BOARD
• COMPATIBLE WITH AUTOMATIC PLACEMENT
EQUIPMENT
• COMPATIBLE WITH VAPOR PHASE REFLOW
SOLDER PROCESSES
• LOW PACKAGE PROFILE
• WIDE VIEWING ANGLE
• LONG LIFE-SOLID STATE RELIABILITY
• SUPPLIED IN 12 mm TAPE OR BULK

Description

Ordering Information

These subminiature solid state lamps are encapsulated in
an axial lead package of molded epoxy. The lens is diffused
for even light dispersion.

To obtain surface mount subminiature lamps with the
"yoke" lead configuration, order the basic catalog device
with the appropriate option code.

The lamps are designed to be inserted through holes in the
PC board to backlight switches, membrane panels, or
appliques. Other backlighting applications are equally
suitable. As shown in Figure 1, the leads are specially
formed to give two features: mechanical strain relief and
adequate solder pads.

Device Selection Guide
Option

Automatic placement equipment may be used to mount
the LEOs on the PC board if the designer selects the 021
option. These lamps are supplied in 12mm tape on seven
inch reels per ANSI/EIA standard RS-481 specifications.
Bulk lamps are available under the 022 option code. The
lamps can be mounted using either batch or in linevapor
phase reflow solder processes.
Subminiature lamps for surface mount applications are
available in standard red, high efficiency red, yellow, green,
integrated resistor, and low current versions.

Description

Option 021

Individual subminiature lamps in "yoke"
lead configuration. Supplied in 12 mm
tape on seven Inch reels; 1500 pieces per
reet. Minimum order quantity and order
increment is 1500 pieces.

Option 022

Individual subminiature lamps in "yoke"
lead configuration. Supplied in bulk.

Examples:
HLMP-6300
Option 021
High Efficiency Red
Supplied on Tape

Figure 1.

6-21

HLMP-6400
Option 022
Yellow
Supplied in Bulk

vapor Phase Reflow Solder Rating
Absolute Maximum Rating
vapor Phase
Soldering Temperature

. 215°C for 3 minutes
Material FC-SS11

NOTE: Lead soldering maximum rating is 260°C for 3 seconds.

Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings and electrical/optical specifications are identical to the basic catalog device, except for
the vapor phase soldering rating as specified at left.

package Dimensions
INDIVIDUAL SUBMINIATURE LAMP

NOTES,
1. ALL DIMENSIONS ARE IN MILLIMSTRES
(INCHES).
2, tATHO!>E LEA!> IS IDENTIFIED BY THE
SILVERSTRI~E.

r-----tI
I <,os

l!!,lllg}
2.34 (0.0921

! .~+

2,92 (0.115) MAX.

NOTE2

~ j~)

0.89 (0.035)

6-22

a

!lM 10.0371
124

(00491
,

-~-------

-----

12mm TAPE AND REEL
CATHODE LEAD

11'
rfil

I II I
I II I

rJJlLl

I

r

I

L

L_

TOP TAPE

1 I

I I

I I
I I

1r1...l

1,11
I "

I

L!lJ

TOLERANCES IUNLESS OTHERWISE SPECIFIED):
.X:!:. 0.1: .XX ± 0.05 (.XXX'±' 0.004)

r-------~F~E~E~D~D~IR~EO'C~T""O~N.-------~:>

NOTES:
1.
EMPTY COMPONENT POCKETS SEALED WITH TOP
COVER TAPE.
2. 7 INCH REEL - 1,500 PIECES PER REEL.

3,

MINIMUM LEADER LENGTH AT EITHER END OF
THE TAPE IS SOOmm.

4.

THE MAXIMUM NUMBER OF CONSECUTIVE MISSING

LAMPS IS TWO.
5,

IN ACCORDANCE WITH ANSI/EIA RS-481

SPECIFICATIONS, THE CATHODE IS ORIENTED
TOWARDS THE TAPE SPROCKET HOLE.

L-__

:>

~U~S~E~R~D~IR~E~C~T~IO~N~O~F~FE~E~D~__

DIMENSIONS PER
ANSI/EIA STANDARD RS-481
ALL DIMENSIONS ARE IN
MILLIMETRES (INCHES).

A

178.0± 2.0 P.D! 0.08) DIA.

C

13.0 (0.512) DIA. TYP.
1.55 (0.061 ±O.a02) DIA.

D

20.2 (0.7951 DIA. MIN.
1.75 ± 0.1 (0.069)
5.50 (0.127 ! 0.002)
Ko 3.05 ± 0.1(0.120) TVP.
50.0 (1.970) MIN.
N
4.0(0.1571 TYP.
Po 4.0 (0.157) TVP.
P, 2.0 (0.079.! 0.002) TVP.
0,
E

~

t

T

500 mm (19.7 in.) MIN.
BOTH ENDS

0.3 (0.0121 TYP.
18.4 (0.72) MAX.
12.0± 0.3 (0.472 ± 0.012)

THICKNESS OF TOP COVER TAPE
0.10(0.004) MAX.

LEADER LENGTH
500 (19.71 MIN.

6-23

REEL

C

HEWLETT
(hPJ PACKARD
OPERATO:UMBER
HP PART
DATE CODE
TAPING DATE
ELECo VALUE
TOLERANCE
aUANTITY --T-N-uooMooB"ER
CUSTOMER PAR

6-24

_

~~-

Fh=W
~~

-~~-~---~----------~------~~~--~-~-----~

-----

2mm FLATTOP LED LAMPS
HEWLETT

High Efficiency Red, Yellow, Green lamps
low current lamps
Integrated ReSistor lamps

PACKARD

TECHNICAL DATA

JANUARY 1986

Features
• WIDE VIEWING ANGLE
• UNIFORM LIGHT OUTPUT
• MOUNTS FLUSH WITH PANEL
• CHOICE OF THREE BRIGHT COLORS
- High Efficiency Red
- Yellow
- High Performance Green
• LOW CURRENT VERSION AVAILABLE
- High Efficiency Red and Yellow
• INTEGRATED RESISTOR VERSION AVAILABLE
- Requires no External Current Limiter with
5 V -12 V Supply

Description
These rugged solid state lamps are designed for applications requiring a bright, compact source of light. Uniform
light output, wide viewing angle and flat top make the lamp
ideal for flush mounting on a front panel.

The red and yellow devices use Gallium Arsenide Phosphide on Gallium Phosphide light emitting diodes, the green
devices use a Gallium Phosphide light emitting diode.

Axial Luminous Intensity and viewing Angle
Iv (mc:d)
Test

Part Number

Min.

Typ.

Condition

201/2(1}

Tinted, Diffused

O.S

1.8

10mA

140

Tinted, Diffused, High Brightness

2.1

2.9

lOrnA

-1740

Tinted, Diffused, Low Current

0.2

0.5

2mA

-1660

Tinted, Diffused, S V Integrated ReSistor

O.S

SV

-1661

Tinted, Diffused, 12 V Integrated Resistor

O.S

12 V

-1819

Tinted, Diffused

0.9

1.S

lamA

-1820

Tinted, Diffused, High Brightness

1.4

2.5

10mA

0.4

2mA

Color

HLMP·

High
Efficiency
Red

-1800
-1801

Yellow

Green

Description

-1760

Tinted, Diffused, Low Current

0.2

-1674

Tinted, Diffused, S V Integrated Resistor

0.5

SV

-167S

Tinted, Diffused, 12 V Integrated Resistor

O.S

12V

-1840

Tinted, Diffused

1.0

2.0

lOrnA

-1841

Tinted, Diffused, High Brightness

1.6

3.0

10mA

-1687

Tinted, Diffused,S V Integrated Resistor

0.5

SV

-1q88

Tinted, Diffused, 12 V Integrated Resistor

0.5

12 V

NOTE:
1. 01/2 is the off-axis angle at which the luminous intensity is half the axial intensity.

6-25

140

140

Package Dimensions

il

O'9 (MaslIlEF.

l'~~X~1~
~24.13{O.95) --l~.27fo.o501NOM'

ll.4Q (.OI~) OJA

O.251.010J

+

f.

~ll!:.!!![l
3.81 (0.150)

~-t-::126}

I--+ffi~~J

Ii

I
MIN'---1
...L-~c:::::::::::I
t

III I

2.21 (0.0871

t

W. I~)

!

I_

1.80 10]7i)

---l __

30'

REF.
4.9010.1931

0.20 (OOOBI x

:.~~:~:i!~--

1

1.50 10.:59)

NOTES,

254 (0.100)
NOM.

1. All OIMENSIONS ARE IN MILLtMETRES IINCHESI.

.

2. AN EPOXY MINISCVS MAY EXTENO ABOUT I mm

It

(0.040"1 DOWN THE LEAOS.

~!: :~:~~:: SQ.

4.09(0.161)

Absolute Maximum Ratings

atTA=25°C

HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
Parameter
Peak Forward Current
Average Forward Currenl1 1 1
DC Currentl 2 )
Power Dissipationl3f
Reverse Voltage OR = 100 MAl
Transient Forward Currentl 4 1(10 Msec Pulse)
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
(1.6 mm 10.063 in. 1from bOdy)

High Efficiency
Red
HLMP·1800/-1801
90
25
30
135
5
500

Yellow
Green
HLMP-1819/·1820 HLMP·1840/·1841
60
90
20
25
20
30
85
135
5
5
500
500
-20 to +100
-55 to +100
-S5 to +100

I
I

Units
mA
mA
mA
mW
V
mA

DC

260" C for 5 seconds

NOTES:
1. See Figure3 to establish pulsed operating conditions.
2. For Red and Green Series derate linearly from 50° C at 0.5
mArC. For Yellow Series derate linearly from 50°C at 0.2
mArC.
3. For Red and Green Series derate power linearly from 25° C
at 1.8 mWr C. For Yellow Series derate power linearly from
50' Cat 1.6 mW/' C.

4. The transient peak current is the maximum non-recurring
peak current that can be applied to the device without
damaging the LED die and wirebond. It is not recommended
that the device' be operated at peak currents beyond the
peak forward current listed in the Absolute Maximum
Ratings.

LOW CURRENT LAMPS
Parameter
DC and Peak Forward Currentl 1!
Transient Forward Current (10 msec Pulse)
Power Dissipation
Reverse Voltage (lR - SO MAl
Operating and Storage Temperature Range
Lead Soldering Temperature (1.6 mm lO.063 in.J
from body)

High Efficiency Red
HLMP-1740

Yellow
HLMP·1760

7

7

SOO

SOO

27

24
5.0
-S5 to +100

Units
mA
mA
mW
V
°C

260° C for 5 seconds

NOTES:
1. Derate linearly from 92' Cat 1.0 mAl' C.

INTEGRATED RESISTOR LAMPS

Parameter
Reverse Voltage etR '" 100 MAl
DC Forward Voltage (TA = 2S'CJ
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature

5VLamps
HERlYellow
HLMp·1660
HLMP·1674
5V
7.SV111
-40· C to 85' C
-5S0Cto 100°C

12 V Lamps
5 V Lamps
HER/Yellow
Green
HLMP-1661
HLMP·1687
HLMP-1675
5V
5V
15 V!21
7.5 WI
-40° C to 8S·C
-20' C to 85° C
-55·Cto 100·C
-55" C to 100· C
260· C for 5 seconds

NOTES:
1. Derate from TA = 50° Cat 0.071 VI' C. see Figure 3.
2. Derate from TA = 50° C at 0.086 VI' C, see Figure 4.

6-26

12V Lamps
Green
HLMP-1688
SV
15 V!2J
-20° C to 85· C
-55·Cto 100°C

---------

~--~~----~~~

Electrical/optical Characteristics atTA=25°C
COMMON CHARACTERISTICS

~Red
Symbol

Yellow

~ Max.

Parameter

Min. Typ. Max.

Min. Typ.

~~_:_EA_K -r~,~~:_:_k_i:~:~~~ew_le_:v_~_:_n~g_th~~' +-_-4f~:_:~:_'~~~I~L__~:8~8~~__
__

__

Units Test Conditions

15651~__~_~_:-+_N_O¥W+-l______~

-1____

Luminous Efficacy

'IV

Max.

'145

500

lumen Note 2

Iwalt
VBR

5.0

Reverse Breakdown
. ','" Voltage

5.0

5.0

NOTES:
1. The dominant wavelength, Ad, is derived from the elE chromaticity diagram and represents the single wavelength which defines
the color of the device.
2. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/ryv' Where Iv is the luminous intensity in candelas
and ryv is the luminous efficacy in lumens/watt.

HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
High
Green
Efficiency Red
Yellow
HLMP-1800/-1801 HLMP-1819/-1820 HLMP-1840/-1841
Symbol

Parameter

Min. Typ. Max.
2.2

3.0

1.5

2.2

3.0

Min. Typ.
1.6

VF

Speed of Response

90

90

C

Capacitance

20

15

18

95

95

95

Thermal Resistance

Max.

2~3

Ts
liJC

1.5

Min. Typ. Max.

Forward Voltage

3.0

500

Units Test Conditions
V

IF=10mA

ns
pF

VF

~

O. f = 1 MHz

"C/W Junction to
Cathode Lead at
0]9 mm 10.031 in')
from b()dy

LOW CURRENT LAMPS
High Efficiency Red
HLMP-1740
Symbol

Parameter

Typ.

Max.

VF

Forward Voltage

1.8

2.2

Ts

Speed of Response

100

C

Capacitance

OJC

Thermal Resistance

Min.

Yellow
HLMP-1760
Min.

Typ.

Max.

Units

1.9

2.7

V

200

Test Conditions
2mA

ns

VF=O, f=l MHz

4

4

pF

190

190

°C/W

Junction to
Cathode Lead at
0.79 mm from body

Units

Test Conditions

INTEGRATED RESISTOR LAMPS
12V
HLMp·1661 I

5V
HLMP·16601

-1674/-1687
Symbol

Parameter

Min.

Typ.

IF

Forward Current

10

liJC

Thermal Resistance

90

16751-1688
Max.

15

Min.

Typ.

Max.

13

20

90

6-27

mA

°C/W

At rated voltage
Junction to Lead at
0.79 mm from body

gO·f--+--.L--l--=:::t::~iiI----,L,0:-··J,20~'-,130"-'-,l40~'-,J50"-'-6Lo -c7Lo -sl.o-gJ,o-·1JOO
Figure 1. Relative Luminous Intensity vs. Angular Displacement

1 . 0 , - - - - - - - - , - - - . ,.....- - . ,....- , - - - - - - ,....- , . - - - - - - - . . . . . . . . , , . - - - - - - - - - ,

f;IGH EFFICIENCY

/'

RED

WAVELENGTH - nm

Figure 2. Relative Inlensity vs. Wavelenglh

HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
HER HLMP-1800,-1801
Yellow HLMP-1819,-1820
Green HLMP-1840,-1841
90
80

'"E
e-

~

a:

:0

70
60
50

U

0

a:

40

"

30

'a:"

Ii:

20

'"

10

1.0
tp - PULSE DURATION

5.0
VF - FORWARD VOL TAGE - V

-}1S

Figure 3. Maximum Tolerable Peak Current vs. Pulse Duration.
(IDC MAX as per MAX Ratings.)

Figure 4. Forward Currenl vs. Forward Voltage

6-28

5.0

>f;;-

4.0

2"

-

3.5

-

"
00

2",

~~
::>~

~"

"'''
>0:
-0
f-2

~-

-

2.5

/

1.0

/

0:

0.5

o ./
o

5

1--

+l-~
j-,'-

I--

Y~ELLOW

15

20

25

30

35

I

0.9

~

0.8

'"

0.7

0.6

40

45

50

'OREEN

'Y

I

n

~

I

10

~

1.0

t::;: r-:::

I/h V

1. 1

0:

I

I

1.2

>
'"

II

/

1.3

~

-

EFFICIENCY
RED

,,-V

1.4

ffi
u

---

-

j

1.5

>u

HIO'H

YELLOW

1.5

ff-

1-

Ij

2.0

I

"'l'G)EFFic'EJCY
RED AND GREEN

I

'" E

~:=

1.6

I'

4.5

I

o

10

20

30

40

50

tiD

70

80

90

100

IPEAK - PEAK LED CURRENT - rnA

IDe - DC CURRENT PER LED rnA

Figure 5. Relative Luminous Intensity vs. Forward Current

Figure 6. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak LED Current

LOW CURRENT LAMPS
HER HLMP-1740
Yellow HLMP-1760
10

10.0,----,---,---,-----,---,

I

"E

TA " 25"6

I

f-

ffi
0:

MIGH

0:

EFF'C'
RED~

::>
u

o

0:

i12
I

N
III

>-

E5 _ 8.0 I----t--+--t----j~'--~

2"

~ E

I
II

2'"

~ ~ 6.0 f---t--+--t-=~-7'I'-----1
0 0

~~

3~ 4.of---t--+~'rt-----j----1
Wo:

>0

;::2

:3w

2.01----+-~+--t_---;--_I

0:

,ElLOW

.5

1.0

1.5

2.0

2.5
IDe - DC CURRENT PER LED - rnA

VF -FORWARDVOlTAGE-V

Figure 7. Forward Current vs. Forward Voltage

Figure 8. Relative Luminous Intensity vs. Forward Current

INTEGRATED RESISTOR LAMPS
5 Volt HLMP-1660, -1674, 1687
12 Volt HLMP-1661, -1675, -1688
24

"E

I

20

f-

16

::>
0
0:

12

ffi

0:

u

0
0:

o

o

II

//

12

""12
0:

/

~

V

16

0:
0:

::>

V

""12

20

1

f-

I

0:

u

"E

V

1

ffi0:

24

V

~

I

18

7.5

10

12

14

I

o

16

15

o

/

/

/
18

7.5

10

12

14

I

15

16

Vee - APPLIED FORWARD VOLTAGE - V

Vee - APPLI ED FORWARD VOLTAGE - V

Figure 9. Forward Current vs. Applied Forward Voltage. 5 Volt
Devices

Figure 10. Forward Current vs. Applied Forward Voltage. 12
Volt Devices

6-29

2.5

l'5~r----cVr-r-r---l

2.0

2

w

/

1.5

>
;:

~

0:

0.5

0

2

/

~GIi

>

;:

~

0:

0.5

EFFICIENCY _

RED, YElLOW,
GREEj

4

I

w

/

1.0

0

1.0

2

6

I
8

10

5 VOLT DEVICE

12VOLTDEVICES

Figure 11. Relative Luminous Intensity vs. Applied Forward
Voltage. 5 Volt Devices

Figure 12. Relative Luminous Intensity vs. Applied Forward
Voltage. 12 Volt Devices

6-30

Fli;-

2mm SQUARE FLAT TOP LED LAMPS
HEWLETT

High Efficiency Red HlMP-l250, -l251

a!~ PACKARD

Yellow HlMP-l350, -L351
Green HLMP-L550, -L551
TECHNICAL DATA

JANUARY 1986

Features
• WIDE VIEWING ANGLE
• UNIFORM LIGHT OUTPUT
• SQUARE LIGHT EMITTING AREA
• MOUNTS FLUSH WITH PANEL
• CHOICE OF THREE BRIGHT COLORS
- High Efficiency Red
- Yellow
- High Performance Green

Description
These rugged solid state lamps are designed for applications requiring a bright. compact source of light. Uniform
light output. wide viewing angle and flat top make the lamp
ideal for flush mounting on a front panel.

The red and yellow devices use Gallium Arsenide Phosphide on Gallium Phosphide light emitting diodes. the green
devices use a Gallium Phosphide light emitting diode.

Axial Luminous Intensity and viewing Angle
Color

Part Number
HLMP-

High
Efficiency
Red
Yellow
Green

Iv (mcd)
Typ.
Min.

Description

Test
Condition

21:-)1/2[1}

140

-L250

Tinted. Diffused

0.8

1.8

10 mA

-L251

Tinted. Diffused. High Brightness

2.1

2.9

10 mA

-L350

Tinted. Diffused

0.9

1.5

10mA

-L351

Tinted, Diffused, High Brightness

1.4

2.5

10mA

-l550

Tinted, Diffused

1.0

2.0

10 mA

·L551

Tinted, Diffused. High Brightness

1.6

3.0

10mA

NOTE:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial intensity.

6-31
-~--

~-.~--

... - ...

~-.--------.-~~-

140

140

package Dimensions
M9
(0,035)
o:li4 (0.025)

~

rr

--

Z,21(~

['~
1 1 '· :[~-'
O.51(~SQUAR£
Yr..k::::i
=
1.85(0.073)

1.39 {o.QSS}

' 41 ii:0ii51

1.80(0.071)

••1916.1851
3.7810,149)

D

~

](

2.2110,081)
1:;rofO~071j

3,20(0.1261
mlo.I!O)

OAl(0.0161

cL

~

~~8

~O'059IR~

3.07 (O.121)

L

NOTES:
1. ALL t>IMENSIONS ARE IN M1LLlMETRES (lNCHESI,
2, AN EPOXY MENISCUS MAY EXTENt> ABOliT 1 "'..
10.040'1 DOWN THE LEADS.

1.27

(O.OSO)
NOM,

24.13 (O,gs) MIN.

Electrical/Optical Characteristics at TA = 25°C
COMMON CHARACTERISTICS
High

Efficiency Red

Yellow

Green

l250/L251

L350/l351

L550/l551

Min. Typ. Max. Min. Typ, Max. Min. Typ. Max.

Symbol

Parameter

Units Test Conditions

APEAK

Peak Wavelength

635

583

565

nm

Ad

Dominant Wavelength

626

585

569

nm

1)v

Luminous Efficacy

145

500

595

VR

Reverse Breakdown
Voltage

5,0

VF

Forward Voltage

1,5

TS

Speed of Response

90

90

C

CapaCitance

20

15

18

OJC

Thermal Resistance

120

120

120

Note 1

lumen Note 2

Iwatt
5.0
2.2

3.0

1.5

5.0

22

3.0

1.6

2.3
500

3.0

V

IR~

V

IF = 10 mA

100pA

ns
pF

Vp = 0,

t"" 1 MHz

·C/W Junction to
Cathode Lead

NOTES:
1, The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavlength which defines the
color of the device,
2, Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = IV/T/v' Where Iv is the luminous intensity in candelas
and T/v is the luminous efficacy in lumens/watt,
'

6-32

Absolute Maximum Ratings atTA=25°C
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS

HigH\EljiplenCy
Parameter
HLM
/-L251
~P~ea-k-F~6~rw-a-rd~c-ur-re-n-t--------------~~~90

Average Forward Currentl 1 1
DC Currentl 21

Yellow
Green
HLMP-L350/·L351 HLMP·L550/·L551

25
30
135
5

500

®

90

20
20
85
5
500

25

-55 to +100
Lead Soldering emperature
(l.!?mrn 10.963 in·1 from body)

Units
rnA
rnA

rnA

30
135
5

mW

500

rnA

-20 to +100
~5to +100

°C

v

260' C for 5 seconds

NOTES:
1. See Figure 3 to establish pulsed operating conditions.
2. For Red and Green Series derate linearly from 50' C at 0.5
mAIo C. For Yellow Series derate linearly from 50' C at 0.2
mA/'C.
3. For Red and Green Series derate power linearly from 25' C
at 1.B mWI' C. For Yellow Series derate power linearly from
50' Cat 1.6 mW/' C.

4. The transient peak current is the maximum non-recurring
peak current that can be applied to the device without
damaging the LED die and wirebond. It is not recommended
that the device be operated at peak currents beyond the
peak forward current listed in the Absolute Maximum
Ratings.

Figure 1. Relative Luminous Intensity vs. Angular Displacement

1.0r--------------r---,~--_.~--r_------_,~--,,------------_;r_----------__.

GREEN
HIGH EFFICIENCY

REO

~O~O------~--~~55~Or-------~--~~--------~--~65~O-------------='~----------~750
WAVELENGTH - nm

Figure 2. Relative Intensity vs. Wavelength

6-33
.

-------- . _ - - - - - - - - - - - - - - - - - - - - - - -

HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
HER HLMP-L250, -L251
Yellow HLMP-L350, -L351
Green HLMP-L550, -L551

«

E
I

f-

ia:E
a:

=>

"~
«

40t--t--j--

;:
a:

30

I

20

~

1.0
tp -

VF - FORWARD VOLTAGE - V

Figure 3. Maximum Tolerable Peak Current vs. Pulse Duration.
(IDC MAX.as per MAX Ratings.)

5.0

,.

~_

"«
~~
!:5 ~
~ fa
~~

3~

w"
~~

~~

Figure 4. Forward Current vs. Forward Voltage

1. 6

1/

4.5

4.0

I

,.
"iE

",-l"lfjIEFF!CIEJCY
RED AND GREEN

u

3.5

3.0

2.0

*~
>

)
1.5

a:
I

II

1. 0

YELLOW

~

0.5

""

1/

o
o

5

10

15

20

25

30

35

40

45

L& V

1. 1

REO

r.::::: :s
1'''"
0

1.5

~-

1.0

'"

0.5

-'"
wOE

I-

z

I

I..

!h

VI

2.0

-P'

3.0

4.0

5.0

Figure 4. Forward Current vs. Forward Voltage

::.:::-Jt~HIEFF!CtEJCY
RED AND GREEN

/

2.5

"'-'

r--

lL

4.5

>
I-

r-- r-----

VF - FORWARD VOLTAGE-V

Figure 3. Maximum Tolerable Peak Current vs.
Pulse Duration. (Ioc MAX as per MAX Ratings.)

5.0

I

IfA

20

"'"

GRJEN

pYElLOW~

II

)
I

YELLOW

L
/'
IDe - DC CURRENT PER LED rnA

IPEAK - PEAK LED CURRENT - rnA

Figure 5. Relative Luminous Intensity vs. Forward
Current. Nondlffused Devices.

Figure 6. Relative Efficiency (Luminous Intensity per Unit Current)
vs. Peak LED Current. Nondiffused Devices.

1. 3
1. 2

YELLOW

2.0

f'.'

1. t

/

1. 5

1. 0

5

o
o

/

V

1. 0

o. 9

/

o.
o.
~

~

V

./
-"

10

'"
15

20

25

30

Figure 7. Relative Luminous Intensity vs. Forward
Current. Diffused Devices.

REO

-


0

1.05

1ii

i3 1.00

~w

1/

0.95

/

>

~

/
/

a:

0.90

0.85

3.0

4.0

5.0

I

......... .,..-:.

V

,L

0.80
0.75

2.0

..... ........

o

20

40

60

80

PEAK CURRENT rnA

VF -FORWAROVOLTAGE-V

Figure 2. Forward Current vs. Forward Voltage.

Figure 3. Relative Luminous Intensity vs. Forward Current

Figure 4. Relative Luminous Intensity vs. Angular Displacement
for T-1 3/4 Lamp

Figure 5. Relative Luminous Intensity vs. Angular Displacement
forT-1 Lamp

6-41
-----------_._------------

80

0

OO°r---+---+---4---~

Figure 6. Relative Luminous Intensity vs. Angular Displacement
for Subminiature Lamp

Figure 7. Maximum Tolerable Peak Current vs. Pulse
Duration. (I DC MAX as per MAX Ratings)

6-42

Flin-

HEWLETT

TAPE AND REEL SOLID STATE LAMPS

~~ PACKARD

Leads:

5mm (0.197 inch) Formed Leads - OPTION 001
2.54mm (0.100 inch) Straight Leads - OPTION 002

TECHNICAL DATA

JANUARY 1986

Features
• COMPATIBLE WITH RADIAL LEAD
AUTOMATIC INSERTION EQUIPMENT
• MEETS DIMENSIONAL SPECIFICATIONS OF
IEC PUBLICATION 286 AND ANSI/EIA
STANDARD RS-468 FOR TAPE AND REEL
• REEL PACKAGING SIMPLIFIES HANDLING
AND TESTING
• T-1 AND T-1 3/4 LED LAMPS AVAILABLE
PACKAGED ON TAPE AND REEL
o

5 mm (0.197 INCH) FORMED LEAD AND
2.54 mm (0.100 INCH) STRAIGHT LEAD
SPACING AVAILABLE

Device Selection Guide

Description

Option

T-1 and T-1 3/4 LED lamps are available on tape and reel
as specified by the IEC Publication 286 and ANSI/EIA
Standard RS-468. The Option 001 lamp devices have
formed leads with 5 mm (0.197 inch) spacing for automatic
insertion into PC boards by radial lead insertion equipment. The Option 002 lamp devices have straight leads
with 2.54 mm (0.100 inch) spacing, packaged on tape and
reel for ease of handling. T -1 lamps are packaged
1800/reel. T-1 3/4 lamps are packaged 1300/reel.

Ordering Information
To order LED lamps packaged on tape and reel, include
the appropriate option code along with the device catalog
part number. Example: to order the HLMP-3300 on tape
and reel with formed leads (5 mm lead spacing) order as
follows: HLMP-3300 Option 001. Minimum order quantities
vary by part number. Orders must be placed in reel increments. Please contact your local Hewlett-Packard sales
office or franchised Hewlett-Packard distributor for a
complete list of lamps available on tape and reel.
LED lamps with 0.46 mm (0.018 inch) square leads with 5
mm (0.197 inch) lead spacing are recommended for use
with automatic insertion equipment. It is suggested that
insertion machine compatibility be confirmed.

Description

001

Tape and reel, 5 mm (0.197 inch) formed leads.

002

Tape and reel, 2.54 mm (0.100 inch) straight
leads.
Order Increments

Package

Quantity/Reel

T-1

1800

1800

T-1 3/4

1300

1300

Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings, mechanical dimension
tolerances and electrical/optical characteristics for lamps
packaged on tape and reel are identical to the basic
catalog device. Refer to the basic data sheet for the specified val ues.
Notes:
1. Minimum leader length at either end of tape i~ 3 blank part
spaces.
2. Silver saver paper is used as the interlayer for silver plated
lead devices.
3. The maximum number of consecutive missing lamps is 3.
4. In accordance with EIA and IEC specs, the anode lead
leaves the reel first.
5. Drawings apply to devices with 0.46 mm (0.018 inch) square
leads only. Contact Hewlett-Packard Sales Office for dimensions of 0.635 mm (0.025 inch) square lead devices.

6-43

Tape and Reel LED Configurations

A,
CATHODE ~~-t-1h

t

f

"""---"<::""~--T---r-;d
r

w

1

~

DO

1

DO

Figure 1. T -1 High Profile Lamps, Option 001

Figure 2. T -1 High Profile Lamps, Option 002

CATHODE ~~-+--+,

t

f

w

1

~

DO

Figure 3. T-1 Low Profile Lamps, Option 001

'ii

Figure 4. T-1 Low Profile Lamps, Option 002

rrt

----::-;;-c:---,----------.--t

~f~{=IF'II=i==I1=:Il==Il=II=

H3

111
0

1
DO

Figure 5. T -1 3/4 High Profile Lamps, Option 001

Figure 6. T -1 3/4 High Profile Lamps, Option 002

11
Figure 7. T-1 3/4 Low Profile Lamps, Option 001

Figure 8. T -1 3/4 Low Profile Lamps, Option 002

6-44

Dimensional specifications for Tape and Reel
Item
T1 High Profile
Body Height
Body Diameter

Option

Component Height
T1 Low Profile
Body Height
Body Diameter
Component Height

001

n~

n~

Component Height

Body Height
Body Diameter
Component Height
Lead wire thickness

Symbol

Al

TI-3/4 High Profile
Body Height
Body Diameter

T1-3/4 Low Profile

002

~ ~

nr

Pitch of component

01
HI

A2
02
H2

A3
03
H3

Specification
4.70 (0.185)
4.19 (0.165)
3.18 (0.125)
2.67 (0.105)
25.7 (1.012)
Max.
3.73 (0.147)
3.23 (0.127)
3.05 (0.120)
2.79 (0.110)
24.7 (0.974)
Max.
9.19 (0.362)
8.43 (0.332)
5.08 (0.200)
4.32 (0.170)
30.2 (1.189)

H4

Max.
6.35 (0.250)
5.33 (0.210)
5.08 (0.200)
4.32 (0.170)
27.4 (1.079)

d

Max.
0.45 (0.018)

A4
04

P

Feed hole pitch

Po

Feed hole center to lead center

PI

Hole center to component center

P2

13.7 (0.539)
11.7 (0.461)
12.9 (0.508)
12.5 (0.4921
4.55 (0.179)
3.15 (0.124)

Lead clinch height

Ho

7.35 (0.289)
5.3510.211)
5.40 (0.2131
4.90 (0.193)
± 1.0 (0.039)
18.5 (0.728)
17.510.689)
15.3 (0.602)
14.7 (0.579)
9.75 10.384)
8.50 (0.335)
0.5 (0.0201
Max.
21.0 (0.827)
20.0 (0.787)
16.5 (0.650)

Feed hole diameter

Do

15.5 (0.6101
4.20 (0.165)

Total tape thickness

t

3.80 (0.1501
0.90 (0.035)

Lead to lead distance
Component alignment, front-rear
Tape width

F
6h
W

Hold down tape width

Wo

Hole position

WI

Hold down tape position

W2

Height of component from hole center

H

a

0.50 (0.0201
Length of snipped lead

L

11.0 (0.433)

Lead length under hold down tape

11

Max.
14.5 (0.571)
Min.

Nole:
1. Dimensions in millimetres (inches), maximum/minimum.

6-45

Noles

Sq uare Lead's

Cumulative error:
1.0 mm/20 pitches.
Measure at crimp
bottom. 5.78/3.68
(0.227/0.1448) for straight
leads

2.54 (0.100) nominal for
straight leads.
Figure 9

Paper thickness:
0.55 10.022) Figure 9
0.45 (0.018)

to
20.0
(0.787)

L.
F"" 100g MIN. APPLIED

Figure 9. Front to Rear Alignment
and Tape Thickness, Typical,
All Device Types

FOR 3± 1 SEC.

F "" 500g MIN. APPLIED
FOR 3 ± 1 SEC.

Figure 10. Device Retention Tests and Specifications

TAPE LEADER

OPERATOR _ _ _ _ _ __
HP PART NUMBER _ _ _ __

DATECODE _ _ _ _ _

F = 70g MIN. APPLIED
FOR 3± 1 SEC.

~

__

TAPING DATE _ _ _ _ __

ELEC. VAlUE _ _ _ _ __
TOLERANCE _ _ _ _ _ __

QUANTITy _ _ _ _ _ __
CUSTOMER PT. NO.

Figure 11. Reel Configuration and Labeling

6-46

F = 500g MAX, EXTRACTION FORCE TO
UNWIND REEL.

rJ.~

CURRE~T

LOW

HEWLETT

!';I!!P.. PACKARD

LEQ LAI\IIP SERIES

T-1 3J4 (5mm) HLMP-4700, -4719, -4740
T-1 (3mml IjLIYIP-1700, -1719, -1790
SUBMINIATURE HtMP-7000, -7019, -7040
TECHNICAL DATA

JANUARY 1986

Features
• LOW POWER
• HIGH EFFICIENCY
• CMOS/MOS COMPATIBLE
• TTL COMPATIBLE
• WIDE VIEWING ANGLE
• CHOICE OF PACKAGE STYLES
• CHOICE OF COLORS

Applications
• LOW POWER DC CIRCUITS
• TELECOMMUNICATIONS INDICATORS
• PORTABLE EQUIPMENT
LOW CURRENT LAMP SELECTION GUIDE

• KEYBOARD INDICATORS

Description

Size

These tinted diffused LED lamps were designed and optimized specifically for low DC current operation, Luminous
intensity and forward voltage are tested at 2 mA to assure
consistent brightness at TTL output current levels,

Color
Yellow

Red
HLMP-

HLMP-

Green
HLMP-

T-13/4

4700

4719

4740

T-1

1700

1719

1790

Subminiature

7000

7019

7040

package Dimensions

QASL018}
$aUARE

NOMINAl

I

L

,,,,,.sort L
/'

~

1541""'00,

""~I"Al

CATHODE:

HLMP-7000. -7019, -7040
HLMP-4700, -4719. -4740

HLMP-1700. -1719, -1790

6-47

NOTES:
I. ALL DIMENSIONS ARE IN MILLIMETRES HNCHES).
2. AN EPOXY MINISCUS MAV eXTEND ASOUT
1 mm (O.040") DOWN THE LEADS.

AXIAL LUMINOUS INTENSITY AND VIEWING ANGLE @ 25°C
Part
Number
HLMP·

Package
Description

Color

Iv {mcdJ
@2mADC
Min.
Typ.

2(~ 1/2[1]

Package
Outline

-4700
-4719
-4740

Red
Yellow
Green

1.2
1.2
1.2

2.0
1.8
1.8

50"

A

Tinted Diffused

·1700
-1719
-1790

T-1
Tinted
Diffused

Red
Yellow
Green

1.0
1,0
1.0

1.8
1.6
1.6

50·

B

-7000
-7019
·7040

Subminiature
Tinted Diffused

Red
Yellow
Green

0.4
0.4
0.4

0.8
0,6
0.6

70"

C

T·13/4

Notes:
1. (-)1/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.

Electrical/Optical Characteristics at TA = 25 0 C
Symbol

Description

T·13/4

T·1

Subminiature

Min.

Max.

Unil$

1.8
1.9
1.8

2.2
2.7
2.2

V

2mA

30
40
30

V

IR

VF

Forward Voltage

4700
4719
4740

1700
1719
1790

7000
7019
7040

VR

Reverse Breakdown
Voltage

4700
4719
4740

1700
1719
1790

7000
7019
7040

AD

Dominant Wavelength

4700
4719
4740

1700
1719
1790

7000
7019
7040

629
585
569

nm

SpecttaJ Line Halfwidth 4700
4719
4740

1700
1719
1790

7000
7019
7040

40
35
28

nm

4700
4719

1700
1719
1790

7000
7019
7040

100
200
500

ns

.1A 1/2

5.0
5.0
5.0

Test
Condition

Typ.

50 pA

Note 1

1'8

Speed of Response

C

Capacitance

700
4719
4740

1700
1719
1790

7000
7019
7040

4
4
18

pF

Thermal Resistance

4700
4719
4740

1700
1719
1790

7000
7019
7040

135
120
120

"G/W

Junction to
Cathode lead

4700
4719
4740

1700
1719
1790

7000
7019
7040

635
583
565

nm

Measurement
at peak

4700
4719
4740

1700
1719
1790

7000
7019
7040

145
500

~740

HJC

Ap

tfv

IPeak Wavelength
Luminous Efficacy

LUmens

-watt

VF=O
f= 1 MHz

Note 2

595

Notes:
1. The dominant wavelength, AD. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
2. Radiant intensity. Ie, in watts/steradian. maybe found from the equation le~ Ivl'1v. where h is the luminous intensity in candelas and '1v
is the luminous efficacy in lumens/watt.

6-48

Absolute Maximum Ratings
Maximum R~ting

Parameter
Red
Yellow
Green

Power Dissipation
(Derate linearly from 92 0 C at 1.0 mAIo C)

Units

24
36
24

mW

7

DC and Peak Forward Current

·ri"

Transient Forward' Current410'l.1SecplJlse)1 1 1

...

500

mA

'.'

.... mA

5.0

Reverse Voltage (IR'" 50 J.l.A/

V

-55·C to 100·C

Operating and Storage Temperatpre Range

260 0 C for 5 Seconds (T -1, T -1 3/4)
260 0 C for 3 Se9.:mds (Submi[liatHrel

Lead Soldering Temperature (1.6 mm 16:063 inl from body)

Notes:
1. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.

1.or---------------r---~----~~-.--------~~--_r--------------_r------------~

~0~0------~~~~~--------~----~~------~~--L-------------~~-------------7~50
WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength

0

"E
~

~
0:

z"
~ E

TA • 2S'C

REO-..
4

I-----+----+----l--I'-I~'--_,I

~ ~ 6.01-----+---+---Y-'¥-->"4'-----l

-if

~~
"::i

I

;::z

~
I

8.0

ZN

6

""o
0:

~_

8

I

0:
0:

10.0 r----r----.,-----~--~r---~

I

J

2

0

00

3 ~ 4.0 1-----4----+~~~----.f__--_J

t

'"0:

>0

:3w

JYEll~1

.5

1.0

1.5

0:

2.01-----4---,,.:...j------I-----f__-_J

r~"N

2.0

2.5
IDe - DC CURRENT PER LED - rnA

VF -FORWARDVOLTAGE-V

Figure 3. Relative Luminous Intensity vs. Forward Current

Figure 2. Forward Current vs. Forward Voltage

6-49
------_.._ - - -

Figure 4. Relative Luminous Intensity vs. Angular Displacement
for T -1 3/4 Lamp

Figure 5. Relative Luminous Intensity vs. Angular Displacement
for T-1 Lamp

Figure 6. Relative Luminous Intensity vs. Angular Displacement for Subminiature Lamp

6-50

_._----------------

ULTRA-BRIClhIl LED LAMP SERtES
T-~

3/4 HLMP-3750,-3850,-'3950
3/4 LOW PROFILE HLMP-3390,-3490,-3590
T-1 HLMP-1340,-1440,-1540
TECHNICAL DATA

Features
• IMPROVED BRIGHTNESS
• IMPROVED COLOR PERFORMANCE
• AVAILABLE IN POPULAR T-1 and T-1 3/4
PACKAGES
• NEW STURDY LEADS
• IC COMPATIBLE/LOW CURRENT CAPABILITY
• RELIABLE AND RUGGED
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
High Brightness Yellow
High Performance Green

-

Description

Applications

These clear, non-diffused lamps out perform conventional
LED lamps. By utilizing new higher intensity material, we
.achieve superior product performance.

• LIGHTED SWITCHES

The HLMP-3750/-3390/-1340 Series Lamps are Gallium
Arsenide Phosphide on Gallium Phosphide red light
emitting diodes. The HLMP-3850/-3490/-1440 Series are
Gallium Arsenide Phosphide on Gallium Phosphide yellow
light emitting diodes. The HLMP-3950/-3590/-1540 Series
lamps are Gallium Phosphide green light emitting diodes.

• LIGHT PIPE SOURCES

• BACKLIGHTING FRONT PANELS
• KEYBOARD INDICATORS

Axial Luminous Intensity and viewing Angle @ 25°C
Part Number
HLMP-

Iv (mcd)
@20mADC

Package
Description

Color
HER

T-1 3/4

Yellow

3750
3850

Typ.

2H 1/2
Note 1.

Package
Outline

80

125

24·

A

80

140

24"

A

Min.

3950

Green

80

120

24°

A

3390

HER

35

55

32"

B

Yellow

35

55

32·

Green

35

55

32·

B
B

HER

24

35

45·

Yellow

24

35

45·

Green

24

35

45°

3490

T-1 3/4 Low Profile

3590
1340
1440
1540

•

T-'

I

-

NOTE:
1. 01/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.

6-51

:

C
C
C

JANUARY 1986

package Dimensions
-rl-rl~08(~)

~

1
9.19 (.3621
.S9 (.035)SA3 (.3321

"·r
12.44 (.490)

3~ I

'.'~

23.0 (.90)

nn

NLLu u

1.27 (.050)Mr -

4.19 (.1651

!

[

+

1.55 (.065)
1.40 (.055)
1.32 (.0521
-1.02 (.0401
0.64 (.025)

23.0 (.901

MIN.

1.27 (.0501 /--_

6.35 (.2501
5.33 (.2101

10.90 (.4291

SQUARE
NOMINAL

-I "

NLL

u

.5l

1.27 (.050)
NOM.

~

--.--1-,
_i ---jI I+I

~

"'"
~

CATHODE

~

"t"I

-.-.

CATHODE

~
--

2.54 (.100) NOM.

PACKAGE OUTLINE "B"
HLMP-3390, 3490, 3590

PACKAGE OUTLINE "A"
HLMP-3750, 3850, 3950

NOM.

o

6.1 (.2401
5.6 (.2201

I_~

2.54 (.100)

PACKAGE OUTLINE "C"
HLMP-1340, 1440, 1540

NOTES:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 1 mm (0.40"1 down the leads.

Absolute Maximum Ratings at TA
Parameter

Red

Yellow

Green

Units

Peak Forward Cu(rent

90

60

mA

Al/el"age Forward Currentl 1J

25

DC Currentl 2!
Power DissipationlSl

30
135

20
20

90
25

Transient Forward Currentl 41
Reverse Voltage (JR = 100 /tA~

(10 (lseC purse)

Operatrng Temperature Range
Storage Temperature Range

mA

85

30
135

mW

500

SOO

500

rnA

5

5

5

V

-55 to +100

--55 to +100

Lead Soldering Temperature

-20 to +100
-55 to+1oo

mA

·C

260" C for 5 seconds

11.6 mm (O.063 in.) from body}

NOTES:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linear)y from SOD eat 0.5 mAIO e. For Yellow series derate linearly from 500 e at 0.2 mAIO e.
_
3. For Red and _Green series derate-power linearly from 25°e a(1.8 mW/oe. For Yellow series derate power linearly from 50 0e at
1.6 mW/oe.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
-

6-52
---------

-----

~~-~-----

Electrical/Optical Characteristics at TA -- 25°C
T-13/4
T-13f4

Low
Dome

T-1

Units

Test Conditions

il.p

Peak Wavelength

3750
3850
3.950

3390
3490
3590

1340
1440
1540

635
583
565

nm

Measurement at
peak

Ad

Dominant Wavelength

3750
38.50
3950

3390
3490
3590

1340
1440
1540

626
585
571

nm

Note 1

.lil.m

Spectral Line Halfwidth

3750
3850
3950

3390
3490
3590

1340
1440
1540

40
36
28

nm

TS

Speed of Response

3750
3850

1340
1440
1540

90
90
500

ns

3~50

3390
3490
3590

C

Capacitance

3750
3850
3950

3390
3490
3590

1340
1440
1540

16
18
18

pF

Thermal Resistance

3750
3850
3950

3390
3490
3590

°C/W

1340
1440
1540

95
95
95
120
120
120

Description

Symbol

0JC

Min.

Typ.

..

VF

Forward Voltage

3750
3850
3950

3390
3490
3590

1340
1440
1540

1.6
1.6
1.6

VR

Reverse Breakdown
Voltage

3750
3850
3950

3390
3490
3590

1340
1440
1540

5.0

"Iv

Luminous Efficacy

3750
3850
3950

3390
3490
3590

1340
1440
1540

2.2
2.2
2.3

Max.

3.0
3.0
3.0

VF = 0; f

Junction to
Cathode Lead

V

IF=20 mA
(Figure 3)

V

IF'" 100 /,A

~

145
500
595

= 1 MHz

Note 2

watt

NOTES:
1. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which
defines the color of the device.
2. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/~v, where Iv is the luminous intensity in
candelas and ~v is the luminous efficacy in lumens/watt.

Red, Yellow and Green

V\ ~-/\

'.0

GREEN

0.5

0
500

~

1J'y~

550

600

T. = 25'C
HIGtt EFFICIENCY
\

REO

~.

650

WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength.

6-53

700

750

w

90

-'

~ '"~

II IIIII!

a:

~15~~
~ a:
Ol a:

0 w
t-

a:

100 KH>

~~::E~
:;;;\,,0

~Q.~
t=

~

30

KH~ !J~

:I KH,

~

1\

I-

II

\

50

"0a:

40

's:a:"

1\

:;~

~

.!!-

,,:;

70

z
w
a:
a:
Ol

1\

\

~I'
1]

t-

I / 100 Hz

I'

~

'"E,

(.~~ I,J,

1 KHz

!L
il GRE~N

80

JJI\~'~'.!.. HWI! 3~

4H-+t1iffit

~~~~

11111111 II

,/

60

'111
111

30
20

.~

IA

o

L.O:-'--Ll.l.J..L1'~O,...-'-IJ-I.ll,~O::O,-l-.aJ.J'"l~O':OO::-'-..LL,-!,~O.OOO

Vi:

REO

10

"

2.0

1.0

tp - PULSE DURATION - Jl.S

3.0

3.0

1.3
1.2

~e
:;N

1

a:

-

1.0

/'

.5

o .-"
o

V

/""

lED

It

-

'\~REEN_

J

1.5

Ol:;

~~
w

.-

I;i ~...

2.0

-'",

w:;
>a:

.....

2.5

Z"

~ E
~~
"'tOl",

5.0

v

Figure 3. Forward Current vs. Forward Voltage.

YELLOW
o;_

4.0

VF - FORWARD VOLTAGE -

Figure 2. Maximum Tolerable Peak Current vs. Pulse Duration.
(lDC MAX as per MAX Ratings.)

>t-

YELLOW

Ii V

rt

V

8
7

6

V

II

J

o.5
10

15

20

25

w m

30

IDe - DC CURRENT PER LED - rnA

30

~

~

~

M

~

00

IpEAK - PEAK CURRENT PER LED - rnA

Figure 4. Relative Luminous Intensity vs. Forward Current.

Figure 5. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak Current.

Figure 6. Relative Luminous Intensity vs. Angular Displacement.
T -1 3/4 Lamp.

Figure 7. Relative Luminous Intensity vs. Angular Displacement.
T -1 3/4 Low Profile Lamp.

Figure 8. Relative Luminous Intensity vs. Angular Displacement.
T-1 Lamp.

6-54

LED RIGHT ANGLE
INDICATORS T-1 3/4 (smm)
RED
HLMP-SOOO
RED S V HLMP-SOOS
RED 12 V HLMP-S012

I

HER
HlMP-S030
YELLOW H~r~p-S040
GREEN HeMP-SOSO

I

HER S V
HLMP-S060
YELLOW S V HLMP-S070
GREEN 5 V HLMP-S080

TECHNICAL DATA

JANUARY 1986

Features
• IDEAL FOR CARD EDGE STATUS INDICATION
• PACKAGE DESIGN ALLOWS FLUSH SEATING
ONAPC BOARD
• MAY BE SIDE STACKED ON 6.35 mm (0.25")
CENTERS
• LEDs AVAILABLE IN FOUR COLORS, WITH OR
WITHOUT INTEGRATED CURRENT LIMITING
RESISTOR IN T-1 3/4 TINTED DIFFUSED
PACKAGES
• ADDITIONAL CATALOG LAMPS AVAILABLE AS
OPTIONS

Description
The HLMP-5000 series of Right Angle Indicators are
industry standard status indicators that incorporate a
tinted diffused T-, 3/4 LED lamp in a black plastic housing. The indicators are available in standard Red. High

Efficiency Red. Yellow, or High Performance Green with
or without an integrated current limiting. resistor. These
products are designed to be used as back panel diagnostic indicators and card edge logic status indicators.

package Dimensions
DIMENSIONS IN MILUMETRES AND ONCKESI.
Note 1~ Q,45 (O,Qtt!) SQUARE: NOMltJAL fOR HLMfl'-500G/~5040/-5050.
0.64 fO.~5/ SQUARE NOMINAL FOR A.u OTHER' PROOUCTS,

4.'10-: 0-,38
(MaS j- O.OlS)

Q€SIGNAlES CATHOO~

NOrt 1

~2,54t10IH

1- . l----NOMtNAL

"PATENT P-ENOING

6-55
•

00_00 _ _ _ _ _

-_·

• _ _ _ _ _ __

Electrical/Optical Characteristics at TA = 25°C
RIGHT ANGLE INDICATORS WITHOUT INTEGRATED CURRENT UMITING RESISTOR
Luminous
Intensily
(Iv) mcd

PartNumbef

Color

Min.

Typ.

HLMP-5009

Red

2.0

4.0

HLMP-S03O

High
Efficiency

3.0

•

Forward
Voltage
(V,)

Test CondiOon
for Iv and V,

Minimum Reverse
Sreakdown Voltage
at (VeR)
IR=100pA

T l l iax•
1.6
2.0

iF =20 mA

3.0

iF=10mA

S.O

6.0

2.2

3.0

Red
HLMP-5040

Yellow

3.0

6.0

2.2

3.0

IF=10mA

5.0

HLMP-5050

Green

3.0

6.0

2.3

3.0

iF=10 mA

5.0

Test Condition
for Iv and IF

Minimum Reverse
Breakdown Voltage
at (VBft}
IR=100pA

RIGHT ANGLE INDICATORS WITH CURRENT UMITING RESISTOR
Forward
Current
(IF) rnA

LUminous
Intenslly
(Iv) mcd

ParlNumber

Color

Min.

Typ.

Typ.

Max.

HLMP-5012

Red

1.0

2.0

13

20

VF =12V

3.0

HLMP-5005

Red

1.0

2.0

13

20

VF= 5V

3.0

HLMP-506Q

High
Efficiency
Red

1.5

4.0

10

15

Vp" 5 V

5.0

HLMP-5070

Yellow

1.5

4.0

10

15

VF= 5V

5.0

HLMP-5080

Green

1.5

4.0

12

15

VF= 5V

5.0

Ordering Information
To order T-1 3/4 high dome lamps in addition to the parts
indicated above. select the base part number and add the
option code 010. For example: HLMP-3750-010.
All Hewlett-Packard T-1 3/4 high-dome lamps, except ferrules, are available in right angle housing. Contact your
local Hewlett-Packard Sales Office or authorized components distributor for additional ordering information.

Absolute Maximum Ratings
and Other Electrical/Optical
Characteristics
The absolute maximum ratings and typical device characteristics are identical to those of the T-1 3/4 LED lamps
listed here. For information about these characteristics,
see the data sheets of the equivalent T-1 3/4 LED lamp.

RightAngle
Indicator

Equivalent T-13/4
LED Lamp

(Part Number)

(Part Number)

HLMP-5000

HLMP-3001

HLMP-S005

HLMP-3105

HLMP-5012

HLMP-3112

HLMP-5030

HLMP-3300

HLMP-5040

HLMP-3400

HLMP-5050

HLMP-3S02

HLMP-5060

HLMP-3600

HLMP-5070

HLMP-3650

HLMP·5080

HLMP-3680

6-56
------ ..

-~-----~--~-

T-1 (3mm) RIGHT ANGLE
LED INDICATORS

rh~ He~WLeTT

~PACKARD

I

RED HLMP.10!U.010\
HER HLMp·1301·01P
~ER sV H,!.MP-16Qg;p10
RED 5V HLMP-11~'010 YEI,L~HLMP'14P1'010 YElLOW?V HLMP·16~~10
GRSmHLMP'1S'o3'010 GREEN SV HLMp·1640·010 m
0

i

WI

$

TECHNICAL DATA

JANUARY 1986

Features
• IDEAL FOR CARD EDGE STATUS INDICATION
• PACKAGE DESIGN ALLOWS FLUSH SEATING
ONAPC BOARD
• MAY BE SIDE STACKED ON 4.57 mm (0.18 in)
CENTERS
• UP TO 8 UNITS MAY BE COUPLED FOR A
HORIZONTAL ARRAY CONFIGURATION WITH
A COMMON COUPLING "BAR (SEE T-1 RIGHT
ANGLE ARRAY DATA SHEET)
• LEDs AVAILABLE IN ALL LED COLORS, WITH
OR WITHOUT INTEGRATED CURRENT
LIMITING RESISTOR IN T-1 PACKAGES
• EASY FLUX REMOVAL DESIGN

Ordering Information

• HOUSING MATERIAL MEETS UL 94V-0 RATING
• ADDITIONAL CATALOG LAMPS AVAILABLE AS
OPTIONS

To order other T-1 High Dome Lamps in Right Angle
Housings in addition to the parts indicated above, select the
base part number and add the option code 010 or 101,
depending on the lead length desired (see drawing below).
For example, by ordering HLMP-1302-010, you would
receive the long lead option. By ordering HLMP-1302-101,
you would receive the short lead option.

Description
Hewlett-Packard T-1 Right Angle Indicators are industry
standard status indicators that incorporate a tinted diffused
T-1 LED lamp in a black plastic housing. The indicators are
available in Standard Red, High Efficiency Red, Orange,
Yellow, High Performance Green, and Emerald Green, with
or without an integrated current limiting resistor. These
products are designed to be used as back panel diagnostic
indicators and card edge logic status indicators.

Arrays made by connecting two to eight single Right Angle
Indicators with a Common Coupling Bar are available.
Ordering information for arrays may be found on the T-1
Right Angle Array data sheet.
The above data sheet information is for the most commonly
ordered part numbers. Refer to other T-1 base part number
specifications in this catalog for other lamp types that may
be ordered with the right angle option.

package Dimensions

MIN. LEAD LENGTH
DIMENSIONS IN MILUM~TRES (lNCHESI.

CP,THOOE

4.70REF.y ~
(0.1851

0A6

(o.018lSDUAllE NOMINAL

6-57

_

....... ..

__

_

.... .......

_.........- - - - - - - - - - - -

Electrical/Optical Characteristics at TA = 25° C
RIGHT ANGLE INDICATORS WITHOUT INTEGRATED CURRENT LIMITING RESISTOR
Luminous
Intensity
(Iv) mod

Test
Condition
for
IvandVF

Minimum
Reverse
Breakdown V
at (VaR)
IR=100pA

Ip=20mA

3.0

551-(}405

3.0

ip=10mA

5.0

N/A

Forward
Voltage
(VF)

~

Replaces
Dlalight

Part

Min.

Typ.

Red

1.5

2.5

High
Efficiency
Red

2.0

2.5

2.2

HLMP-1401-(}10

Yellow

2.0

3.0

2.2

3.0

IF"'10mA

5.0

551·0305

HLMP·1503-010

Green

1.0

2.0

2.3

3.0

'F'" 10 mA

5.0

551-(}205

Test
Condition
for
Ivand IF

Minimum
Reverse
Breakdown V
at (VeR)
IR=100pA

Replaces
Dlalight
Part
Number

Part Number

Color

HLMfl..1002-(}10
HLMP·130H)10

Number

RIGHT ANGLE INDICATORS WITH CURRENT LIMITING RESISTOR
Luminous
Intenslty
(Iv) mod

Forward
Current
(IF)
Typ. Max.

Part Number

Color

Min.

Typ.

HLMP·1100-(}10

Red

0.8

1.5

13.0

20.0

Vp=5V

3.0

555-(}50S

HLMP-1600-(}10

High
Efficiency
Red

1.5

4.0

10.0

15.0

VF=5V

5.0

N/A

HLMP·1620-010

Yellow

1.S

4.0

10.0

15.0

VF""5V

5.0

N/A

HLMP·1640-010

Green

1.5

4.0

12.0

VF=5V

5.0

N/A

Absolute Maximum Ratings
and Other Electrical/Optical
Characteristics
The absolute maximum ratings and typical device characteristics are identical to those of the T·l LED lamps listed here.
For information about these characteristics, see the data
sheets of the equivalent T-1 LED lamp.

6-58

15.0/

S

Fh;tl

RI6HT

HEWLETT

.:¥!JI PACKAlIRD

AMGL~IN
HLMP-600()-()10
HIGH EFFICIENCY R 0 H~P·6~·010
YELLOW HfMp-6400-010
TECHNICAL DATA

JANUARY 1986

Features
• IDEAL FOR PC BOARD STATUS INDICATION
• SIDE STACKABLE ON 2.54 mm (0.100 in)
CENTERS
• AVAILABLE IN FOUR COLORS
• HOUSING MEETS UL 94V-O FLAMMABILITY
SPECIFICATIONS
• ADDITIONAL CATALOG LAMPS AVAILABLE AS
OPTIONS

Description
The Hewlett-Packard series of Subminiature Right Angle
Indicators are industry standard status' indicators that
incorporate tinted diffused LED lamps in black plastic
housings. The 2.S4mm (0.100 in) wide packages may be
side stacked for maximum board space savings. The silver
plated leads are in line on 2.S4mm (0.100 in) centers, a
standard spacing that makes the PC board layout straightforward. These products are designed to be used 'as back
panel diagnostic indicators and logic status indicators on
PC boards.

Ordering Information
To order Subminiature Right Angle indicators, order the
base part number and add the option code 010. For price
and delivery on Resistor Subminiature Right Angle Indicators
and other subminiature LEDs not indicated above, please
contact your nearest H.P. Components representative. A
cross reference to Dialight part numbers appears on the
next page.

Package Dimensions

n

r 1.22 10.0481

~~'.~

DIMENSIONS IN MI~UMETRES AND {lNCHESI

6.08

H-2.1i4!0·~1
2.39 o.

I

~
I.~

18.20°1

ri

I

I

IO'O. gm DIA.

1m

.Y! 10

3.18 {O.1jr

l

471H16S1

:~t·~ -j~:~;

I

NOM

2:4,1310,9'51

MT

(J,4PC01S)
SQUARE NOMINAl..

!
I

L

WL''"'rtl
_I 1CATHOOE"

L.54 \O.lQOI No.M1NAL

~
~

NOTES,
1. ALL DIMENSIONS ARE IN MllLlMETRES IINCHES).
2. AN EPOXY MENISCUS MAY EXTEND ABOUT lmm
(.040"1 OOWN THE LEADS:

Figure B. T-1 J/4 Package

Figure A. T-1 Package

6-63

24

'E"

20

~
a::

16

/

:::>

12

a::

.!!-

o

/

20

:::>

"0

'a:"
s:

;:

I

V

I

.!!-

18
7.5

10

12

14

I

o

16

15

./

./

/
I8
7.5

..1
10

12

14

I

15

16

Figure 2. Forward Current vs. Applied Forward Voltage. 12 Volt

Devices

Devices

>
7.5

"

c5

>

0

>

-

"-

a:

'a:"
s:

;:

I
w

''~""
0

>

"

16
15

.....

12

........

........

0

a:

'a:"

;:

s:

~
:::;

~

i2

it

~

'"

I
u

I

u

~

~

o

o

20

40

60

TA - AMBIENT TE/IJIPERATURE _

20

8085

°c

Figure 3. Maximum Allowed Applied Forward Voltage vs.
Ambient Temperature ROJA ~ 175° C/W. 5 Volt
Devices

90'

o

V

Vee - APPLI ED FORWARD VOLTAGE - V

Figure 1. Forward Current vs. Applied Forward Voltage. 5 Volt

...'"'"

L

12

a:

Vee - APPLI ED FORWARD VOLTAGE - V

I
w

,/

16

a:

/

s:

o

~

/

a:

"a:0
;:
'"
a:

'E"
...I

'I

I

...

24

r-+---+-+--+===

Figure 5. Relative Luminous Intensity vs. Angular Displacement
lor T -1 Package

40

60

TA - AMBIENT TEMPERATURE _

8085

°c

Figure 4. Maximum Allowed Applied Forward Voltage vs.
Ambient Temperature ROJA ~ 175° C/W. 12 Volt
Devices

"'1---+--+--1--£
Figure 6. Relative Luminous Intensity vs. Angular Displacement
lor T-1 3/4 Package

6-64

::

::

>

>

a:

a:

w

w

~
w

~

5 VOLT DEVICE

12 VOLT DEVICES

Figure 8. Relative Luminous Intensity vs. Applied Forward
Voltage. 12 Volt Devices

Figure 7. Relative Luminous Intensity vs. Applied Forward
Voltage. 5 Volt Devices

6-65

Flin-

SUBMINIATURE RESISTOR LAMPS
5 VOLT 4 rnA AND 5 VOLT
10 rnA SERIES

HEWLETT

a:~ PACKARD

TECHNICAL DATA

JANUARY 1986

Features
• INTEGRAL CURRENT LIMITING RESISTOR
• TTL AND LSTTL COMPATIBLE
• REQUIRES NO EXTERNAL RESISTOR WITH
5 VOLT SUPPLY
• SPACE SAVING SUBMINIATURE PACKAGE
• WIDE VIEWING ANGLE
• CHOICE OF CURRENT LEVEL, 4 rnA or 10 rnA
• AVAILABLE IN HIGH EFFICIENCY RED,
YELLOW, AND GREEN
• IDEALLY SUITED FOR PORTABLE OR SPACE
CONSTRAINED APPLICATIONS

Description
ing special configurations are available on request:

The subminiature resistor lamps contain an integral current
limiting resistor in series with the LED. This allows the lamp
to be driven from a 5 volt source without an external current
limiter. The high efficiency red and yellow devices use
GaAsP on a GaP substrate. The green devices use GaP on
a GaP substrate. The tinted, diffused epoxy lens provides
high on-off contrast and a wide viewing angle. The follow-

1. Surface Mount Gull Wing Bend Mount Gull Wing Data Sheet.

Refer to the Surface

2. Tape and Reel Packaging
3. Special Lead Bending on 2.54 mm (0.100 in.! and 5.08
mm (0.200> in Centers

Device Selection Guide
High Efficiency Red

Yellow

Green

5Volt,10mA

HLMP-6600

HLMP-6700

HLMP-6800

5Volt,4mA

HLMP-6620

HLMP-6720

HLMP-6820

6-66
~~---------------

------------

----~-------------

Package Dimensions
~(!l..~)
O,S6

(o.!

r 0
r::=JSZ
IA IMSI Mlt:I:J
BOTH SIDES -I

T

ANODE /

~ (0.0651 OIA _/
1.91 (0,075)

0.4 610,018)1

wt¥221

h

0,89 rp:035)

~

1..--.. ---'
.~

.

(~I

'===
J::
::1:'

t

I

2,92101151

J

=

Ii:

.~

M AX
,

I

07610030)MAX.:: '

I

f..2.081~1...j'

1!'.l (0.075)

TOP VIEW
NOTES

l

094(00371

~~::~'~~:Rffi'12410~orl

1.~0055)

MAX.

t_=
T

1,52
1.78(0,070)

1.27 I.t':..~)

1.91 10.075)

~:~~ :~~:

~ ~ATHODE

7\i-r

1

1.1410451

~

2.34 (0.092)

2.16 (0 0851

2.54 IO.1001J SEE NOTE 2

..

NOM

1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES)
2, OPTIONAL LEAD FORM AVAILABLE.

SIDE VIEW

END VIEW

Absolute Maximum Ratings at TA = 25°C
HLMP:6600/6620

6700/6720

HLMP-6800/6820
Green

High Efficiency Red/Yellow
DC Forward Voltage

6 Volts

6 Volts

Reverse Voltage OR = 100j.lA)

5 Volts

5 Volts

-40 0 C to 85" C

Operating Temperature Range
Storage Temperature Range

-20·C to 85°C
-55°C to 100°C

Lead Soldering Temperature
1.6 mm (OP63 in') From Body

260"C for 3 Seconds

Electrical/optical Characteristics at TA = 25°C
High ElJiGiency Red
Yellow
Green
HlMP·6600
HLMp·6620
HlMP·6620
HlMP·6700
HlMp·6720
HlMP·6600
Min. Typ, Max, Min, Typ. Max. Min, Typ, Max, Min. Typ. Max. Min. Typ. Max. Min, TVp, Max. Units

Symbol Parameter
Axial lummous
1.3
Intensity
2<1112 Included Angle Between
Half Luminous
Intensity Points
IV

Ap

Ao

50

08

20

14

0.9

50

20

1.6

5.0

08 2.0

mcd

90"

90'

90'

90'

90'

Peak Wavelength

635

583
586

nm

572

nm

40

36

565
572
28

565

624

635
624
40

583

Dominant Wavelength

28

nm

120

120

120

120

120

'>1'1/2 Spectral Une

VF ~ 5 Volls
ISee Figure 2}
Note 1
(See Figure 3

90"

586
36

Tesl Conditions

Note 2

Halfwidth

"'JC

Thermal Resistance

120

IF

Forward Current

9.6

VR

Reverse Breakdown
Voltage
Luminous Efficacy

'IV

3.5

13

50

5.0
145

9,6

5

5.0
145

3,5

13

5

50

9.6

595

5

lOA

V

5.0

50

500

500

3,5

13

'CIW Junction to
Cathode Lead

595

VF ~ 5 Volts
(See Figure 1}
IR

~

100 ~A

Imlw !-Iole 3

Notes:
1. 2(-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color
of the device.
3, Radiant intensity in watts/sterad ion. may be found from the equation Ie = Iv/w. where Iv is the luminous intensity in candelas and W is
the luminous efficacy in lumens/watt.

6-67
--~.-~-"-

.. -..

-.~-~~-----.-

-----

1.6

16
14
E
I

1--

12

C;;~
Z ....

1.2

10

-'"
"'I-

1.0

~g

I-

Z

W

a:
a:

I

1.4

>


Transient Forward Currentl 4 : (10 pS Pulse)
Operating Temperature Range
Storage Temperature Range

rnA

mW

Lead Soldering Temperature
[1.6 mm (0.063 inJ from body]

260°C for 5 seconds

NOTES:
,. See Figure 5 to establish pulsed operating conditions.
2. For Red and Green Series derate linearly from 50 0 C at
0.5 mAIO C. For Yellow Series .derate linearly from 50' C
at 0.2 mAIO C.
3. For Red and Green series derate power linearly from 25 0 Cat
1.8 mWl o C. For Yellow series derate power linearly from
50 0 C at 1.6 mWlo C.

4. The transient peak current is the maximum non-recurring
peak current that can be applied to the device without
damaging the LED die and wirebond. It is not recommedned
that the device be operated at peak current beyond the peak
forward current listed in the Absolute.Maximum Ratings.

Electrical/Optical Characteristics at TA = 25 °C
HLMP-oaOO/-oa01

HLMP-04dol-o401

HLMP-05031-o5~

Symbol

Desoriptlon

2(')112

I neluded Angle
Between Half
Luminous I nlensity
Points

100

100

100

De9. Note 1. Figure 6.

AI"

Peak Wavelength

635

583

565

nm

Measurement at
Peak

A(j

Dominant Wavelength

626

565

569

nm

Note 2

AA1/~

Spectral Line Halfwidth

40

36

28

nm

90

90

500

ns

16

18

18

pF

120

120

120

1".

C

Min.

~onse
aeltanee

(-)JC

Thermal Resistance

VF

Forward Voltage

1.6

Typ.

2.2

Max.

3.0

Min.

1.6

Typ.

2.2

Max.

3.0

Min.

La

Typ.

2.3

M

its Te$\ Conditions

VF=O;f=l MHz

'C/W Junction to
Cathode Lead
S.O

V

IF~20mA

Ffgure2.

VR

Reverse Breakdown
Voltage

'IV

Luminous Efficacy

5.0

5.0

145

5.0
500

V
595

IF! = 100 p,A

ImlW NoteS

NOTES:
1. 0'/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
3. Radiant intensity, I" in watts/steradian, may be found from the equation 1,=lv/~v, where Iv is the luminous intensity in candelas and
~v is the luminous efficacy in lumens/watt.

6-70

1.0

>

I0;

HIGH EFFICIENCY
RED

tiiI~
w

0.5

>

;:

~

a:

0
500

700

750

WAVELENGTH - nm

Figure 1. Relative Intensity

V50

Wavelength.

High Efficiency Red, Yellow and Green Rectangular Lamps
90

1.3

80

if

7

70

I

~
a:
a:

60

/

«

I-

:>

u

i1«
s:a:
~

-"

GREIEN±- I-YELLOW

j/ ;Y

50

«
~

«
~

IN

20

1.0

!O

R

w

0.9

~

08

>
1.0

0.7
<

.5

~

0.6

.\
rr"
I#'

..

,>

REO

-

\1REEN_

1/

I

~

0.5

I

2..0

0
3.0

5.0

4.0

Figure 2. Forward Current vs. Forward
Voltage.

~

j

1.5

0

VF - FORWARD VOLTAGE - V

,,~
~ :::

1. 1
1.0

.'1

10

~I'.9

"~
~

yr

40
30

20

I-

Ii:

RED

o

YELLOW
1.2

30

0

IDe - DC CURRENT PER LED - rnA
IpEAK - PEAK CURRENT PER LED - rnA

Figure 3. Relative Luminous Intensity vs.
Forward Current.

Figure 4. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak Current.

1.0 '_J'-..W.lllljL-.L.AJ..WlIl.,-..L.lcllLUL.-:...LI.WlJ!
1
10
100
1000
10,000
Ip - PULSE DURATION

-}lS

Figure 5. Maximum Tolerable Peak Current vs.
Pulse Duration. (IDe MAX as per MAX Ratings.)

Figure 6. Relative Luminous Intensity vs. Angular Displacement.

6-71

T-1 3/4 (Smm)
RED SOLID STATE LAMPS

FliP'l HEWLETT
a:a. PACKARD

HLMP-3000
HLMP-3001
HLMP-3002
HLMP-3003
HLMP-30!50
TECHNICAL DATA JANUARY 1986

Features
•
•
•
•

LOW COST, BROAD APPLICATIONS
LONG LIFE, SOLID STATE RELIABILITY
LOW POWER REQUIREMENTS: 20 mA @ 1.6V
HIGH LIGHT OUTPUT:
2.0 mcd Typical for HLMP-3000
4.0 mcd Typical for HLMP-3001
• WIDE AND NARROW VIEWING ANGLE TYPES
• RED DIFFUSED AND NON-DIFFUSED
VERSIONS

Description
The HLMP-3000 series lamps are Gallium Arsenide
Phosphide light emitting diodes intended for High Volume/
Low Cost applications such as indicators for appliances.
smoke detectors. automobile instrument panels and many
other commercial uses.
The HLMP-3000/-3001 /-3002/-3003 have red diffused
lenses where as the HLMP-30S0 has a red non-diffused
lens. These lamps can be panel mounted using mounting
clip HLMP-0103. The HLMP-3000/-3001 lamps have .02S"
leads and the HLMP-3002/-3003/-30S0 have .018" leads.
NOTES:
1. The transient peak current is the maximum non-recurring peak current that
can be applied to the device without damaging the LED die and wirebond. It
is not recommended that the device be operated at peak currents beyond the
peak forward current listed in the Absolute Maximum Ratings.

Absolute Maximum Ratings
at TA = 25°C
Parameter
Power Dissipation
DC Forward Current lDerate
linearly from 50°C at 0.2 rnN°CI
Average Forward Current
Peak OperatinQ Forward Current
Reverse Voltage (IR - 100 I'AI
Transient Forward Currentl'l
(10 !,sec Pulse)
Operating and Storage Temperature Range
Lead Solder Temperature (1.6 mm
[0.063 inch[ below package base)

3000 Series
100
50

Units
rnW
rnA

50
1000
3
2000

rnA
rnA
V
rnA

-{;5° C to +100° C
260° C for 5 seconds

Package Dimensions

htI

HLMP-3002l-3003/-3050
PlASTIC

MS

(~

HLMP-3000/-3001

T

4.78 L1Sa)

.... ,. 4j,]8t.1B8)
~
--T

.0.t1l!Ql

I
9.19 (.362}

Jl9 U135)

~;r21

T

25.40

(1.00)
M1N.

121

~~
8.43 (.332)

~~5J
~,

Q.69 (.0351

1.32I.ooll
1.02;·Il4OI

0.64 f.UE}

O.Il4(,02S)
-SOUARE
NOMINAL

0.45 (.0(6) SQUARE
NOMINAl.

I

{.060l~

NOTES;
,. All DIMENSIONS ARE IN MILllMETAES ttNCHES),
2. AN EPOXY MENISCVS MAY EXlI:NQ ABOUT 1mm
i,04{)"l DOWN THE LEAO$,

~~-;-·1

$\
~
CATHOb~
~

6.1 (.2-40)

"

. I S •• (.2101

-

-'1*'

CATHOOE;

6-72

"

2.54 (.1000) NOM.

I

Electrical Characteristics at TA =25°C
Description
Luminous Intensity

Symbol
Iv

I neluded Angle Between
'Half Luminous
Intensity Points
Peak Wavelength

2(-)1/2

AP

Ad

Dominant Wavelength

l!.A1!2

Spectral Lire Halfwidth

Ts

Speed of Response

C

Capacitance

,-leG

Thermal Resistance

VF

Forward Voltage

VR

Reverse Breakdown
Voltage

Device HLMP3000/3002
3001/:;003
3050
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050
3000/3001
3002/3003
3050
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050

Typ.
2.0
4.0
2.5
75
75
24
655
655
655
648

Min.
1.0
2.0
1.0

"E

100

pF

°C/W

1.4

95
120
120
1.6

3.0

10

Junction to Cathode Lead

V

IF - 20 mA (Fig. 21

V

IR - 100 /lA

2.50
TA '"

25'~C

/

>

l-

v;

2.00

i:j

20

I-

~

'"0OJ

10

I--

1.75

/

1.50

2

":3

c

a:

I

2.0

VF-O,f-1MHz

2.25

OJ

Ii'

nm

ns

u

""

Measurement at Peak

10

i:j

a:

Test Conditions
IF 20 mA
IF = 20 mA
IF=20mA
IF-20mA

nm

nm

I-

a:
a:

Units
mcd
mcd
mcd
Deg.

24

50
40
30

Max.

w

1.25

>

1.00

~

.75

3 -

/

i---'

i=

4 -

/

a:

-"

.50

o

.-

10

V F - FORWARD VOLTAGE - VOLTS

Figure 1. Forward Current Versus Forward Voltage

.f--.-r---.._ .

/

o

1.70

/

/

.25
1
1.40

/

/

20

30

40

so

IF - FORWARD CURRENT - rnA

Figure 2. Relative Luminous Intensity Versus Forward Current

>
l-

v;

i:j
I-

~
w

>

0.5

i=

~

a:

500

550

600
WAVELENGTH - nm

Figure 3. Relative Luminous Intensity Versus Angular
Displacement.

Figure 4. Relative Luminous Intensity Versus Wavelength.

6-73

750

Fli'P8

T-1 3/4 (Smm)
DIFFUSED SOLID STATE LAMPS

HEWLETT

HIGH EFFICIENCY RED.
ORANGE •
YELLOW.
HIGH PERFORMANCE GREEN •
E.MeEA~O GRe,EN •

~~ PACKARD

HlMP-3300 SERIES
HLMP-0400 SERIES
HlMP-3400 SERIES
HlMP-3500 SERIES
HLMP-0600 SERIES

TECHNICAL DATA

JANUARY 1986

Features
• HIGH INTENSITY
• CHOICE OF 5 BRIGHT COLORS
High Efficiency Red
Orange
Yellow
High Performance Green
Emerald Green
• POPULAR T-1% DIAMETER PACKAGE
• SELECTED MINIMUM INTENSITIES
• WIDE VIEWING ANGLE

• GENERAL PURPOSE LEADS
• RELIABLE AND RUGGED
• AVAILABLE ON TAPE AND REEL

Description
This family of T-1% lamps is widely used in general purpose
indicator applications. Diffusants, tints, and optical design
are balanced to yield superior light output and wide viewing
angles. Several intensity choices are available in each color
for increased design flexibility.

package Dimensions

T

is ..

{l.'om
MIN,

H1

0.89 (,0351

OM. 1.0251
O,4~

Part
Number

HLMP·
3300

General Purpose

2.1

3301

High Ambient

4.0

3762

Premium Lamp

8.0

0400

General Purpose

2.1

0401

High Ambient

4.0

3400

General Purpose

2.2

3401

High Ambient

4.0

3862

Premium Lamp

8.0

3502

General Purpose

1.6

3507

High Ambient

4.2

3962

Premium Lamp

8.0

D600

General Purpose

1.6

D601

High Ambient

4.2

( Olel S-oUAA:E

NOMINAL

I

Application

Minimum
Intensity
(mcd) at 10mA

COSOlli

NOTE$-,
1, ALL OIM-ENSIONSAFlE ~N MILLIMETRES (INCHES)<
2:, AN- ~PoXy MENISCUS MA¥ EXTEND ABOUT 1mm
UMO"} DOWN THE LEADS,

6-74

Color
(Material)
High
Efficiency
Red
(GaAsP
on GaP)
Orange
(GaAsP
on GaP)
Yellow
(GaAsP
on GaP)
Green
(GaP)
565 nm
Emerald
Green
(GaP)
555 nm

Electrical Characteristics at TA
Device
Symbol

Description

HLMP-

Iv

Luminous Intensity

High Efficiency Red
3300
3301
3762

Min,

Typ,

2,1
4.0
8.0

3,5

Max.

Units

Test Conditions

IO
15.0

Orange
2.1
4.0

3.5

bllol

Yellow
3400
3401
3862

2.2
4.0
8.0

4.0
8.0
12.0

Green
3502
3507
3962

1.6
4.2
8.0

2.4
5.2
11.0

Emerald Green
0600
0601

16
4.2

3.0
6.0

Qf\OO

2('-)1/2

Including Angle
Between Half
Luminous Intensity
Points

IO

= 10 mA

mcd

IF

75

Deg.

IF= 10,mA
See Note 1

High Efficiency Red
Orange
Yellow
Green
Emerald Green

635
612
583
565
555

nm

Measurement at Peak

High Efficiency Red
Orange
YellOW
Green
Emerald Green

626
608
585
569
556

nm

See Note 2

High Efficiency Red
Orange
Yellow
Green
Emerald Green

90
280
90
500
4000

ns

High Efficiency Red
Orange
Yellow
Green
Emerald Green

16
4
18
18
35

pF

140

cCIW

High Efficiency Red

65

Orange
Yellow
Green
Emerald Green

ApEAK

"d

TS

C

Peak Wavelength

Dominant Wavelength

Speed of Response

Capacitance

°JC

Thermal Resistance

All

VF

Forward Voltage

HER/Orange
Yellow
Grn/Emerald Gm

1.5
1.5
1.6
5.0

VR

Reverse Breakdown Volt.

All

TJv

Luminous Efficacy

High Efficiency Red
Orange
Yellow
Green
Emerald Green

2.2
22
2.3
145
262
500
595
656

3.0
3.0
3.0

VF = 0; f = 1 MHz

Junction to Cathode
Lead at Seating Plane

V

IF

V

IR

lumens
Watt

= 10 mA
100llA

See Note 3

NOTES:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the

color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/w, where Iv is the luminous intensity in candelas and ryv
is the luminous efficacy in lumens/watt.

6-75

Absolute Maximum Ratings at TA
HER/Orange

Yellow

Gm/Emerald Gm

Peak Forward Current

90

60

90

mA

Average Forward Current l11

25

20

25

mA

Parameter

Units

DC Current/ 21

SO

20

30

mA

Power DiSSlpation gl /

135

85

13$

mW

5

5

5

V

500

500

500

mA

-5510+100

-5510+100

Reverse Voltage! IA = 100 pA)
Transient Forward Current l41 (10 I'sec Pulse)
Operating Temperature Range

-2010+100

·0

-55 to +100

Storage Temperature Range

260' C for 5 seoonds

Lead Soldering Temperature 11.6 mm )0.063 in.) from bodyl
NOTES:
1. See Figure 5 (Red/Orange). 10 (Yellow) or 15 (Green/Emerald Green) 10
establish pulsed operating conditions.
2. For Red, Orange, Emerald Green. and Green series derate linearly from
50°C at 0.5 mN°C. For Yellow series derate linearly from 50°C at 0.2
mArC.
3. For Red, Orange, Emerald Green. and Green series derate power linearly
from 25° C at 1.8 mW;o C. For Yellow series derate power linearly from
50' C all.6 mW/' C.

4. The transient peak current is the maximum non-recurring peak current
that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak
currents beyond the peak forward current listed in the Absolute Maximum
Ratings.

10

HIGH £F"F-ICH,NC'f

".0

O.5f-------,,.......H'--\--A----I1+---:I---'o.,......-+-'<---·~--+------_1

Figure 1. Relative Inlensity vs. Wave.length

T-1 3J4 High Efficiency Red, orange Diffused Lamps
0
0

0

/

0

0

I

I

3.5

~

~;t

~~

-

I
II

0

0

>

/

0

-- r-- -

5
"g

~~

00

- --

i

V

--

1-

.~

3~

--H

,

~~

2:g5

~~
05

IpeAK - PEAK CURRENT PER LED _ rnA

IDe ~ DC CURRENT PER LEO - rnA

VF - FORWARD VOLTAGE - V

Figure 2. Forward Current vs. Forward
Voltage Characteristics.

>

2.0

Figure 3. Relative Luminous Intensity
vs. DC Forward Current.

Figure 4. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
LED Peak Current.

ILJ-.-l-~l--I-+-+-++-+-l-10.8

02

"'1----1--+---+--1.;0;
tp - PULSE DURATION - jJS

Figure 5. Maximum Tolerable Peak Current vs. Pulse
Duration. (IDC MAX as per MAX Ratings

Figure 6. Relative Luminous Intensity vs. Angular
Displacement.

6-76

T-1 3/4

Yellow Diffused Lamps
6

2.5
/cf

>
r

~<

TA "'2J"C

2 .•

wE

!Z:=

;;r
~~

/

15

w~

I .•

/

>~

;:::~

g-

/""'

4

V

3

,

V
/

I

•
/

8

I.

15

7

2.

20

IF - FORWARD CURRENT -rnA

Figure 7. Forward Current vs. Forward
Voltage Characteristics.

Figure 8. Relative Luminous Intensity
vs. Forward Current.

"

"

I

9

/'
••

VF - FORWARD VOLTAGE - V

5

V

~~

~~
~~

V

/

30

40

50

60

IPEAK - PEAK CURRENT - rnA

Figure 9. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
Peak Current.

L\.---+--!--\-,f-+-+-+-++-+-+--!··8

tp - PULSE DURATION - i'~

Figure 10. Maximum Tolerable Peak Current vs. Pulse
Duration. (lDC MAX as per MAX Ratings)

T-1 3/4

Figure 11. Relative Luminous Intensity vs. Angular
Displacement.

Green, Emerald Green Diffused Lamps

·.-

i--

~.

r-

•

if

0

i-"

5

or- - '

0

1/

5

0

/

0

0
I .•

.

I

/

0

I
2 .•

1.5

0

5

•

1/

/

5

3.

4.

5.0

0

10

15

20

25

o 70

30

Figure 13. Relative Luminous Intensity
vs. DC Forward Current.

10

'+

20

~ ~

._-~ 00 70

80

Figure 14. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
Peak LED Current.

Wf--+--+---+-Figure 15. Maximum Tolerable Peak Current vs. Pulse
Duration. (IDC MAX as per MAX Ratings)

Figure 16. Relative Luminous Intensity vs. Angular
Displacement.

6-77

00 100

IpEAK -PEAK CURRENT PER LED - rnA

IpEAK - PEAK CURRENT PER LED - rnA

VF - FORWARD VOLTAGE - V

Figure 12. Forward Currentvs. Forward
Voltage Characteristics.

'.1 r-

./

Flio-

HEWLETT

~~ PACKARD

T-1 3/4 (Smm) LOW PROFILE
SOUD STATE LAMPS
RED •
HIGH EFFICIENCY RED.
YEllOW •
HIGH PERFORMANCE GREEN.

HlMP-3200
HlMP-3350
HlMP-3450
HlMP-3550

TECHNICAL DATA

SERIES
SERIES
SERIES
SERIES

JANUARY 1986

Features
• HIGH INTENSITY
• LOW PROFILE: S.8mm (0.23 in) NOMINAL

• T-1"I. DIAMETER PACKAGE
• DIFFUSED AND NON-DIFFUSED TYPES
• GENERAL PURPOSE LEADS
• IC COMPATIBLE/LOW CURRENT
REQUIREMENTS
• RELIABLE AND RUGGED

Description
The HLMP-3200 Series are Gallium Arsenide Phosphide
Red Light Emitting Diodes with a red diffused lens.

The HLMP-3550 Series are Gallium Phosphide Green Light
Emitting Diodes.

The HLMP-3350 Series are Gallium Arsenide Phosphide on
Gallium Phosphide High Efficiency Red Light Emitting
Diodes.

The Low Profile T -1 % package provides space savings and
is excellent for backlighting applications.

The HLMP-3450 Series are Gallium Arsenide Phosphide on
Gallium Phosphide Yellow Light Emitting Diodes.

Pari
Number
HLMP-

package Dimensions

3200
3201

5.08 {4QQ}

I( '\

r

3350

6351,

...2Q)
5.33(.2 10)

~

3351

I~

3365

~t:.illJ

3366

lAO (.0551

'm_~~ ~
f

4.7B (.188;

_I

NOTES:
1. ALL DIME NSIONS ARE
IN MILLiMElREs UNCHES)

3450

2.

3451

AN EPOXV MENISCUS MAY
EXTEND ABOUT lmm (,040",
DOWN THE LEADS.

3465
3466

~ 0,45 (.0-1$) SQUARE NOMINAL

3553
3554
3567
CATHODE

3568

6-78

Application
Indicator General Purpose
Indicator High Brightness
Indicator General Purpose
Indicator High Brightness
General Purpose
Point Source
High Brightness
Annunciator
Indicator General Purpose
Indicator High Brightness
General Purpose
Poi nt Sou rce
High Brightness
Annunciator
Indicator General Purpose
Indicator High Brightness
General Purpose
Poi nt Source
High Brightness
Annunciator

Lens
Tinted
Diffused
Wide Angle
Tinted
Diffused
Wide Angle
Tinted
Non-diffused
Narrow Angle

Color

Red

High
Efficiency
Red

Tinted
D'iffused
Wide Angle
Yellow
Tinted
Non-diffused
Narrow Angle
Tinted
Diffused
Wide Angle
Green
Tinted
Non-diffused
Narrow Angle

Absolute Maximum Ratings at TA=25°C
Para,!,ete~

c c320oS!lries

3350Sertes

3450 Series

3550 Series

Units

1000

90

60

90~

mA

Averag~fForward Currentl 1 1

50

25

20 c

25

mA

DC Currentl 21

pOck

30

20'

30

mA

100

135

85

135

mW

3

5

5

"2000

500

500

500

,[-55 to +100

-20 to +100
--55 to +100

ccc

Peak Forward Current

Power Disslpationl 3 1
Reverse Voltage OR = 100 p.A), '
TransienbFo~ard Clirrentl 4 J

,

,,5

,V
mA

(10 p'sec Pulse)

,

Operating Temperature Range:
Storage T \lmperature Ra~ge cc

,,;55 to+100

--55 to +100

Lead Soldering Temperilture
[1.6 mm 10.063 in,) from bf;ldY]

c'

°C

260° C for 5 seconds

NOTES:
1. See Figure 5 (Red), 10 (High Efficiency Red), 15 (Yellow) or 20 (Green) to establish pulsed operating conditions.
2. For High Efficiency Red and Green Series derate linearly from 50° Cat 0.5 mAr C. For Red and Yellow Series derate linearly from
50° C at 0.2 mAIo C.
3. For High Efficiency Red and Green Series derate power linearly from 25°C at 1.8 mW/oC. For Red and Yellow Series derate power
linearly from 50' Cat 1.6 mW/' C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED
die and wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the
Absolute Maximum Ratings.

0.51------1\-----t--\

750

500
WAVELENGTH - om

Figure 1. Relative Intensity versus Wavelength.

6-79

RED HLMP- 3200 SERIES
Electrical Specifications at TA = 25°C
Symbol

Description

Iv

Axial Luminous
intensity

Device
HLMP·

Min.

Typ.

3200

1.0

2.0

3201

2.0

4.0

Max.

Units

Test Conditions

mcd

IF = 20 mA (Figure 3)

60

deg.

Note 1 (Figure 6)

201/2

Included Angle Between
Half Luminous Intensity
Points

.lip

Peak Wavelength

655

nm

Measurement at Peak (Fig. 1)

Ad

Dominant WaVelength

648

nm

Note 2

~A1i2

Spectral Line Halfwidth

24

nm

TS

Speed of Response

10

ns

C

Capacitance

100

pF

OJC

Thermal ReSistance

120

°C/W

VF
VR

Forward Voltage
Reverse Breakdown
Voltage

1.4

1.6

V

IF = 20 mA (Fig. 2)

3

10

V

IR= 100 /loA

65

Im/W

Luminous Efficacy

1/v

2.0

VF=O;f= 1 MHz
Junction to Cathode Lead

Note 3

Notes: 1. @Y2 is the off·axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength. A.d. is derived from the CI E

chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie, in watts/steradian may be found
from the equation Ie "" Iv/nv. where Iv is the luminous intensity in candelas and 1/v is the luminous efficacy in lumens/watt.

«

E
I

50
40
30

in

20

2w«
I- E

10

!g'"

l-

ffi

a:
a:

1.3 0

2.5

,.

TA

~

r-- r- .. - r-- r-

2S""C

l-

2.0

,.;;

U E

~~

~:::

U

~:J

,,«
~"
wa:
>0
-2

12

~S

wto!
>~

~~

~

II

wO

"'''

1--

-~

1.1 0

-"

1.0

oo-

r--

/

!2~

1.5

2@
2N

"aa:
">:
a:

-

1.20

.5

a:

1.00

o

t--r--r--II-'---I--r--~ r-'1

1

1.70

1.40

20

VF - FORWARD VOLTAGE - V

Figure 2. Forward Current versus
Forward Voltage.

IF - FORWARD CURRENT - rnA

Figure 3. Relative Luminous Intensity
versus Forward Current.

40

60

Figure 4. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.

tp - PULSE DURATION - Jl.5

Figure 5. Maximum Tolerable Peak Current versus Pulse
Duration. (IDe MAX as per MAX Ratings)

Figure 6. Relative Luminous I ntensity versus
Angular Displacement.

6-80

80

IpEAK - PEAK CURRENT - rnA

100

HIGH EFFICIENCY RED HLMP-3350 SERIES
Electrical Specifications at TA =25°C
C!~~ice
Symbol

Description

Iv

AXial LLifDinous Intensity

!i!e~MP-

Min.

Typ.

3350
3351
3365
3366

2.0
5.0
7.0
12.0

3.5
7.0
10.0
18.0

,

Max.

!Jp!ts

Test ~9.npi!Jions

mcd

IF = 10 mAIFig. 8)

li

ei

Note 1 (Fig. 11)

50
50
45
45

Oeg.

Pea~ Wavelength

635

nm

l\i1easurElment at Peak (Fig. 1)

Ad

Oomjpant Wavelength

626

nm

Note 2

.:l.A1/2

Spectral Line Halfwidth

40

nm

T$

Speed of Response

90

ns

C

Capacitance

16

pF

OJC

Thermal Resistance

120

281/2

Included Angle Between
Halt Luminous Intensity
Pdints

AP

3350
3351
3365
3366

Vp

Forward Voltage

1.5

VR

Reverse Breakdown
Voltage

5.0

1)v

Luminous Efficacy

Vp = 0; f'" 1 MHz

°C/W Junction to Cathode Lead
3.0

2.2

V

IF= 10 mA (Fig. 7)

V

IR = 100 JlA

Im/W Note 3

145

Notes: 1.8% is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength. Ad. is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie. in watts/steradian may be found
from the equation Ie = Iv/l1v. where Iv is the luminous intensity in candelas and flv is the luminous efficacy in lumens/watt.
4.0

90

"
E
I

80

I

70

'"
"u'"
";:'"
'"
~
0

>
>-

~~
wE

1/

>-

15

J

60
50

I

40

>-0
~~
",>-

I

""
Zw
00

I

30

/

20

o

1.0

/

2.0

>-Z

1.0

'"

0.5

~-

-~

10

,,-,
-,"
w"

>'"
-0

3.0

4.0

5.0

V F - FORWARD VOLT AGE - V

Figure 7. Forward Current versus
Forward Voltage.

o

*

/

UJ

>

~
'"I

/

1.5

o

1fi
u

1/

2.5
2.0

i~

1.5

>
3.0

7
o

/

/

~
~

10

15

20

25

--=ttt

1.6

/

3.5

30

IF - FORWARD CURRENT - rnA

Figure 8. Relative Luminous Intensity
versus Forward Current.

1.4

/
1.3
1.2

I

I

1. 1
1.0
0,9

I

0.8
0.7

I
o

W

W

30

40

W

•

90'f--1--l--4-...:::r=3
Figure 11. Relative Luminous Intensity versus
Angular Displacement.

6-81

W

Figure 9. Relative Efficiency
(luminous Intensity
per Unit Current)
versus Peak Current.

tp - PULSE DURATION - P$

Figure 10. Maximum Tolerable Peak Current versus Pulse
Duration. (lDC MAX as per MAX Ratings)

ro

IpEAK - PEAK CURRENT PER LED - rnA

00

YELLOW HLMP- 3450 SERIES
Electrical Specifications at TA =25°C
Device
HLMP-

Min.

Typ.

Axial Luminous Intensity

3450
3451
3465
3466

2.5
6.0
6.0
12.0

4.0
10.0
12.0
18.0

mcd

IF'"' 10 mA (Fig. 13)

2111/2

Included Angle Between
Half Luminous Intensity
Points

3450
3451
3465
3466

50
50
45
45

Deg.

Note 1 (Fig. 16)

AP

Peak Wavelength

583

nm

Measurement at Peak (Fig. 1)

Ad

Dominant Wavelength

585

nm

Note 2

nm

Symbol

Description

Iv

Units Test Conditions

Max.

.:loA 112

Spectral Line Halfwidth

36

TS

Speed of Response

90

ns

C

Capacitance

18

pF

(}JC

Thermal Resistance

120

VF

Forward Voltage

1.5

VR

Reverse Breakdown
Voltage

5.0

'IV

Luminous Efficacy

2.2

500

VF = 0; f = 1 MHz

°CIW Junction to Cathode Lead
3.0

V

IF = 10 rnA Wig. 121

V

IR

100 p.A

ImIW Note 3

Notes: 1. 8% is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, Ad. is derived from the elE
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity 'e. in watts/steradian may be found
from the equation Ie "= 'v/l1v, where Iv is the luminous intensity in candelas and TJv is the luminous efficacy in lumens/watt.

0

"E

40

50

=>

o

0

0:

~
0:

~

_~

0

/

10

0

~~

;:m~c

1.5

2.0

t:i

"'0
;;; ...
=>"

,,=>-'
-,"
W"

1.5

20

-0
"'2

3.0

3.5

1.2

~~

1. 1

:3~

1.0

V

L

~

9

B

I

Figure 12. Forward Current versus
Forward Voltage.

Figure 13. Relative Luminous Intensity
versus Forward Current.

v...-

I

I

]

-- t - -

L
10

IF - FORWARD CURRENT - rnA

V

V

wo:

4.0

V F - FORWARD VOLTAGE - V

tp - PULSE DURATION -

~~

0:0

.5

0:

2.5

1.3

i=~

./
1.0

§8
wo

1.0

>0:

~-

1.4

u-

1.5

00
2W
-N

J

>-0

u"

wE
2_

V

0:
U

...

1.6
TA ::.

>-

/

I

~
0:

2.5

V

20

30

40

Figure 16. Relative Luminous Intensity versus
Angular Displacement

6-82

60

Figure 14. Relative Efficiency
(Luminous Intensity
per Unit Current I
versus Peak Current.

~s

Figure 15. Maximum Tolerable Peak Current versus Pulse
Duration. (lDC MAX as per MAX Ratingsl.

50

IpEAK - PEAK CURRENT - rnA

GREEN HLMP- 3550 SERIES
Electrical Specifications at TA =25°C
Symbol

q~scription

Iv

AxiE11 Luminous Intensity

Min.

]!yp~,

3553
3554
3567
3!;i68

1.6
6.7 \
4.2
10.6

3.2
10.0
7.g
15.0

med

50
50
40
40

Deg.

3~53

included Angle Between
Half Luminous Intensity
Points

26112

·',/,::;'/i/)\i

Device
HLMP·

3554
3567
3568

Max.

Units Test Conditions
IF = 10 mA (Fig. 18)'

,

'/\
Note 1 (Figure 21)

AP

PeakiWavelength

565

nm

M~l!.surementat Peak (Fig. 1)

Ad

OomlnanfWavelength

569

nm

N6t&i2

28

nm

;.\A1/2

Spectral Line Hillfwidth

TS

Speed of Response

C

Capacitance

tlJC

Thermal Resistance

VF

Forward Voltage

1.6

VR

Reverse Breakdown
Voltage

5.0

'lv

Luminous Efficacy

500

ns

18

pF
~C/W

120
2.3

3.0

,

t
VF = 0; f = 1 MHz

...

. ,i/\

Aj1T,'
;:'

Junction to Cathod~ Lead

V

IF = 10 mA (Fig. 17)

V

Iw= 100pA

Im/W Note 3

595

Notes: 1. O}S is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, Ad. is derived from the CIE
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie. in watts/steradian may be found
from the equation Ie = Iy/fly. where Iy is the luminous intensity in candelas and flv is the luminous efficacy in lumens/watt.

0

"E

0

§

0

I

a:
a:

:::>

"@
~

1.3

I

0

....>
u;_

I

I

WE
ZN

~~

,,:::>~

~"
>a:
_0

o

1.0

~w

1.5

>

~

1.0

w"

lr

.... Z

0

(j

00
ZW
-N

I

30

~-

/

0

"

.... 0

I

0

>
fjj

z"

1

40

1. 2
2.0

a:

3.0

VF - FORWARD VOLTAGE -

v

Figure 17. Forward Current versus
Forward Voltage.

~

/

0.8
0.7

I

I

o. 5
o. 4

5.0

4.0

V

0.9

.5

a:

,/
2.0

1. 1
1.0

IF - FORWARD CURRENT - rnA

IpEAK - PEAK CURRENT PER LED - rnA

Figure 18. Relative Luminous Intensity
versus Forward Current.

Figure 19. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.

" ':.o,-LLLlJ~ctp -

PULSE DURATION -IlS

Figure 21. Relative Luminous Intensity versus
Angular Displacement.

Figure 20. Maximum Tolerable Peak Current versus Pulse
Duration. (lDC MAX as per MAX ratings).

6-83

T-1 (3mm)

FliO'l

RED SOLID STATE LAMPS

HEWLETT

~~ PACKARD

HLMP-1000 Series
HLMP-1200 Series
TECHNICAL DATA

_

-

Features

--

• WIDE VIEWING ANGLE

6.35 ~
5.58(220)

• Ie COMPATIBLE

t-I

• RELIABLE AND RUGGED

Description

-~:~
j

-~~ - - - L

Jl

__

configura~
• .27(.

HLMP-1000 - Red Diffused lens provides excellent on-off
contrast ratio, high axial luminous intensity, and wide viewing angle.

0501

•.~o

(.laS)

4.ia GGs'J
t

1.02\.040)

~OM.

Z4'~L'if"5).~

The HLMP-1000 is a series of Gallium Arsenide Phosphide
Light Emitting Diodes designed for applications where
space is at a premium, such as in high density arrays.
The HLMP-1000 series is available in three lens
tions.

2.671...105)

.t.

• SMALL SIZE T-1 DIAMETER 3.18mm (0.125")

t.!! (.125)

0.4HOla)

....-SQUARE
NOMINAL

1L

2.54 (0,100) NOMtNAL

HLMP-1080 - Same as HLMP-1 000, but untinted diffused to
mask red color in the "off" condition.
HLMP-1071/-1201 - Untinted non-diffused plastic lens provides a point source. Useful when illuminating external lens,
annunciators, or photo-detectors.

Part
Number
HLMP-

Iv (mcd)
@20mA
Min .

Typ.

Typ.
Viewing
Angle
201/2

-1000

A-Tinted
Diffused

.5

1.0

125"

-1002

A-Tinted
Diffused

1.5

2.5

1250

-1080

A-Untinted
Diffused

.5

1.5

125"

·1071

A-Untinted
Non-Diffused

1.0

2.0

800

-1200

B-Untinted
Non-Diffused

.5

1.0

120·

-1201

B-Untinted
Non-Diffused

1.5

2.5

1200

Package &
Lens Type

Figure A.

MS(.Il1e)
SQUARE

NOMINAL

CATHOD'~
Figure 8.
NOTES~

1. AlL DIMENSIONS ARE IN M)lLIM~TRES fiNCHeS).

a

AN EPOXY MENISCUS MAY EXTENt) ABOUT lmm
(.040"1 DOWN THE LEADS.

6-84

JANUARY 1986

Absolute Maximum Ratings at TA = 25° C
Parameter

:;

1000 Series

Units

Power Dissipation

loe

mW

DC Forward Current [1)

50

mA

AveregeF~~~~c~~~rr~~~Qt____________________________________+-______
~
mA
.504-________+-____________
Peak Ope~tWard'Current

, ., . . . . . ,

,

";

10P9"::?'

""

3

Reverse Voltage OR 0= 100 p.A)

mA

V,.'

T.

'y

mA

2000
-55" C to +100°C
21:l9W for 5 seconds
Note:
1. Derate linerarly from 50" C at 0.2 mAIo C.

Electrical Characteristics at TA = 25°C
Symbol

Parii\ll#ters

AP

Peak Wavelength

655

nm

Ad

Dominant Wavelength

648

nm

.:lA1!2

Spectral Line Halfwidth

24

nm

TO

Speed of Response

10

ns

C

Capacitance

100

pF

IiJC

Thermal Resistance

120

"C/W

VF

Forward Voltage

VR

Reverse Breakdown Voltage

Min.

50

T~p.

1.4

1.6

3

10

Units Test Conditions

Max.

2.0

Measurement at Peak

VF = 0, f = 1 MHz
Junction to Cathode Lead

V

fF=20 mA

V

IR = 100 p.A

HLMP-1200/-1201

2.50
2.25

0

2.00
1.75

0

1.50

0

1.00

0

.'0

1.2S

.15

."
0

0.4

0.6

1.2

1.6

2.0

FORWARD CURRENT - VOLTAGE CHARACTERISTICS

Figure 1. Forward Current vs.
Voltage Characteristic.

00

10

20

30

40

50

IF - FORWARD CURRENT - rnA

Figure 2. Luminous Intensity vs.
Forward Current (IF).

Figure 3. Typical Relative Luminous
Intensity vs. Angular Displacement.

HLMP-1000/-1002/-1080

HLMP-1071

Figure 4. Relative Luminous Intensity vs. Angular Displacement.

Figure 5. Relative Luminous Intensity vs. Angular Displacement.

6-85
~'~--~-'-'-'-"~~---'---'-------

T~1

Fliffl

(3mm)

DIFFUSED SOLID STATE LAMPS

HEWLETT

HIGH EFFICIENCY RED
ORANGE
YEllOW
HIGH PERFORMANCE GREEN
EMERALD GREEN

~a PACKARD

•
•
•
•
•

HLMP-1300 SERIES
HLMP-K400 SERIES
HlMP-1400 SERIES
HLMP-1500 SERIES
HLMP-K600 SERIES

TECHNICAL DATA

JANUARY 1986

Features
• HIGH INTENSITY
• CHOICE OF 5 BRIGHT COLORS

High Efficiency Red
Orange
Yellow
High Performance Green
Emerald Green
• POPULAR T-1 DIAMETER PACKAGE
• SELECTED MINIMUM INTENSITIES
• WIDE VIEWING ANGLE
• GENERAL PURPOSE LEADS
• RELIABLE AND RUGGED

Description

• AVAILABLE ON TAPE AND REEL

This family of T-1 lamps is widely used in general purpose
indicator applications. Diffusants, tints, and optical design
are balanced to yield superior light output and wide viewing
angles. Several intensity choices are available in each color
for increased design flexibility.

package Dimensions

J;.VW

Part
Number

HLMP-

CATHODE

1.27(O.""O)~ l2'7S~O'110j

-.l

O.'S(M1"

2.29 (M90)

NOMINA~I~

~f

0.45 (0.0181

NOMtNA~

NOTES;
1, ALL DIMENSIONS ARE IN MII.LlMETRES UNCHESL

Application

Minimum
Intensity
(mcd) at 10mA

1300

General Purpose

1.0

1301

General Purpose

2.0

1302

High Ambient

3.0

1385

Premium Lamp

6.0

K400

General Purpose

1.0

K401

High Ambient

2.0

K402

Premium Lamp

3.0

1400

General Purpose

1.0

1401

General Purpose

2.0

1402

High Ambient

3.0
6.0

1485

Premium Lamp

1503

General Purpose

1.0

1523

High Ambient

2.6

1585

Premium Lamp

4.0

K600

General Purpose

to

K601

High Ambient

2.0

2. AN E"POXY MENlSCU$MAY EXtEND ABOUT lmm
(0,040") DOWN THE LEADS.

6-86

Color
(Malerial)
High
Efficiency
Red
(GaAsP
on GaP)
Orange
(GaAsP
on GaP)
Yellow
(GaAsP
on GaP)
Green
(GaP)
565nm
Emerald
Green
(GaP)
555 nm

Electrical Characteristics at TA
SymbOl

Des~iiption

Iv

Luminous Intensity

..,

Niin!

,yp:

1.0
2.0
3.0

,'S.O

2.0
2.5
4.0
10.0

1.0
2.0
'3.0

2.0
2.5
4.0

1400
1401
1402
1485

1.0
2.0
3.0
6.0

2.0
3.0
4.0
10.0

Green
1503
15.23
.1585

1.0
2.5
4.0

2.0
4.0
6.0

Emerald Green
"
'K600
K601

1.0
2.0

2.0
2.5

Delllc~.

/

High
1300

::

Efficlenc:,,~~:~

ii/i~ ..•
1301

jfi {\,)"

~,;~:~~r )7:
{
.):i.i

"'-.

20112

APEAK

Ad

TS

C

Including Angle
Between Half
Luminous Intensity
Points

~

••••

2

.• ,

>

-----l-hl---~-I'r---+t\_-+--~...-4__"<:-----__t------_I

~
WAVELENGTH - nm

Figure 1. Relative Intensity VS. Wavelength

T-1 High Efficiency Red, Orange Diffused Lamps
90

0

0
0
1.0

v

v

5

2.0

3.0

4.0

5.0

o

2

I

,

J

OM -

/

~

0

: If
7

o

20

30

IDe - DC CURRENT PER LED - mA

VF - FORWARD VOLTAGE - V

Figure 2. Forward Current vs. Forward
Voltage Characteristics.

/

/

3

/

II

0

.-r-

4

V

I
II

0

5

v

I

0

6

/

Figure 3. Relative Luminous IntenSity
vs. DC Forward Current.

9~r-+--+-+--+S

10

~

~

~

50

W

70

80~~

100'

Figure 6. Relative Luminous Intensity vs. Angular Displacement.

6-88

~

Figure 4. Relative Efficiency (Luminous
Intensity per Unit Currenl)
vs. Peak LED Current.

tp - PULSE DURATION -iJS

Figure 5. Maximum Tolerable Peak Current vs. Pulse
Duration. (Ioc MAX as per MAX Ratings).

M

IpEAK - PEAK CURRENT PER LED - mA

T-1 Yellow Diffused Lamps
60

<

;

z"

20

.

/

10

1.0

g

1.3
1.2

iil

1

~

1,0

~

2.0

2.S

3.0

3.5

VF • FORWARD VOLTAGE·

/

/
." L\

9/0>
..
,70

4.0

10

IF - fORWARD CURRENT - rnA

v

Figure 7. Forward Current vs. Forward
Voltage Characteristics.

tp -

'/

~

:0

/

.

/

1.'

=t:

/
1.5

1:';1"

1.5

/
II

50

""
0
'"
"<
~

u

~

1.6

I

40

I

1;\·'"
20

3Q

so

40

60

IpEAK - PEAK CURRENT - rnA

Figure 8. Relative Luminous Intensity
vs. Forward Current.

Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

PULSE DURATION -1'$

Figure 11. Relative Luminous Intensity vs. Angular Displacement.

Figure 10. Maximum Tolerable Peak Current
vs. Pulse Duration. (Ioc MAX
as per MAX Ratings.)

T-1 Green, Emerald Green Diffused Lamps
1,

i

··
·

I

I

Itt

'-.

o

I

1.7

16

II

60

o~

4.0

I

I

5

II

0

.,

0

2.0

'.0

~w

1

/

==

I

'L
10

VF - FORWARD VOLTAGE - V

1.

1.3
1.2

0

01/

50

Figure 12. Forward Current vs. Forward
Voltage Characteristics.

ffi

V

5
3.0

.

1.5

>

v

5

I
0

/

15

20

25

30

35

40

IpEAK - PEAK CURRENT PER LED - rnA

Figure 13. Relative Luminous Intensity
vs. Forward Current.

7
~o

10

2030

40

~ W

70

-i-

8000100

[PEAK - PEAK CURRENT PER LED - rnA

Figure 14. Relative Efficiency (Luminous
Intensity per Unit Current)
vs. Peak LED Current.

80°

100'

tp _ PULSE DURATlON -~s

Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration. (Ioc MAX
as per MAX Ratings.)

Figure 16. Relative Luminous Intensity vs. Angular Displacement.

6-89

-i--

Flifl'l

LOW PROFILE T-1 (3mm) LED LAMPS
HEWLETT

a:r.. PACKARD

High Efficiency Red HlMp·1350
Yellow HLMp·1450
High Performance Green HlMP-1550
TECHNICAL DATA

JANUARY 1986

package Dimensions

Features
• LOW PROFILE HEIGHT

~H~~;

• SMALL T-1 SIZE DIAMETER
3.18 mm (.125 inch)

3.3I)(.1~JMAX.

3.73 C147J

ffiiTzll

• HIGH INTENSITY
• IC COMPATIBLE
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
High Performance Green

O.45C\HS)
--SQUA.RE

NOMINAL

Description

NOtes:
1. ALL DIMeNSIONS ARE jN

This family of solid state lamps is especially suited for
applications where small package size is required without
sacrificing luminous intensity. The HLMP-1350 is a red
tinted. diffused lamp providing a wide viewing angle. The
HLMP-1450 and HLMP-1550 are similar products in yellow
and green respectively.

MILt.IMETBES (INCHES).
2. AN EPOXY MENISCUS MAy
EXtl::ND ASOUT Imm

t040"j OOwN THE LEAOS

CATHQDE~

Axial Luminous Intensity and Viewing Angle @ 25°C
Pari
Number
HLMP-

Iv (mod)
Min.

Typ.

Test
Condition
mA

Description

201/2
(Typ.)

[1J

il.d
(nm-Typ.)
[2]

1350

Tinted, Wide Angle

1.0

2.0

10

55"

626

1450
1550

Tinted, Wide Angle
Tinted, Wide Angle

1.0

2.0
2,0

10
10

55"

1,0

585
569

55"

Color
High Efficiency
Red
Yellow
Green

NOTES:
1. (')1/2 is the off-axis angle at which the luminous intensity is half the axial intenSity.
2. The dominant wavelength, il.d. is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.

For Maximum Ratings and Electrical/Optical Characteristics (including figures) see HLMP-1300/-1400/-1500 data
sheet. publication number 5953-7735. except for Figure A
shown here.

Figure A. Relative Luminous Intensity vs. Angular Displacement.

6-90

ATal,E SOLID Stl\T:E LAMPS

SUB,M

R~D • HLMP-6000/6001
HIGH EFFICIENCY REl:h~H~MP
ORANGE "., AtMP
.
Y LQW. HLMP-6~QO
EEN • HtMP-6500
HIGH PERFORM~N
EMER~
RFEN!,HLMP,9fjOQ

Fh;'ll HEWLETT
~~ PACKAge

Features
• SUBMINIATURE PACKAGE STYLE
• END STACKABLE
• LOW PACKAGE PROFILE
• AXIAL LEADS
• WIDE VIEWING ANGLE
• LONG LIFE - SOLID STATE RELIABILITY
• AVAILABLE IN BULK OR ON TAPE AND REEL

Description

Tape
Part
and Reel
Minimum
Intensity
Number Part Number
(mcd) at 10mA
HLMP·
HLMP-

Lamps in this series of solid state indicators are
encapsulated in an axial lead subminiature package of
molded epoxy. They utilize a tinted, diffused lens providing
high on-off contrast and wide angle viewing. Small size
makes these lamps suitable for PC board mounting in space
sensitive applications.
Special lead bending, packaging and assembly methods can
be used with these devices. For example, lead bending on
2.54mm (0.100 in) and 5.0Bmm (0.200 in) centers is available.
Two special surface mount lead configurations are also
available. See the data sheets for "gull wing" and "yoke lead"
options for more detailed information.
Tape and reel packaging for the standard product is
described in this data sheet. Similar packaging for the
surface mountable "gull wing" and "yoke lead" versions is
described in the respective surface mount data sheets.

6-91

Color
(Material)

6000

6020

0.5

Standard Red
(GaAsP)

6001

6021

1.3

Standard Red
(GaAsP)

6300

6320

1.0

High Efficiency
Red
(GaP on GaAsP)

0400

0420

1.0

Orange
(GaP on GaAsP)

6400

6420

1.0

Yellow
(GaP on GaAsP)

6500

6520

1.0

Green
(GaP)

0600

0620

1.0

Emerald Green
(GaP)
555nm

package Dimensions
OUTLINE A (SINGLE LED)

~::: ~~:g~~:

i

r--

,.410.45) MIN;...]
BOTH SIDES

-I

1

..Lc=:f

T

0.46 (0.018)
0.5610.022)

i--:::::::::--,

"

1.27~

~.89{O.0351

1.40 (0.055)

~.14{O.045)

t'---'l-L

ANODE

~::;!~~l DIA.
TOP VIEW
END VIEW

SIDE VIEW

OUTLINE B (TAPE AND REEL)

CATHODE

I

r-

14.61 (0.575)
12.07 (0.475)
NOTE 1.

1\

-

rLUETAPEj

'10 0 MAX,

6.35/0.250)

I

TYP,

""

L_ - -

I~

~

~44'4511'750)
_
I

I

-------

I~

r.
, ,

,

r-- -

-I 1-l
f.-

MAX.

27.94 (1.100)

~OO)

,

-

3.0510.'20)
2.03 (0.080)

NOTES:

1. LED'S MUST FALL WITHIN ± 0.031" OF A COMMON CENTER.
2. OPTIONAL LEAD FORM IS AVAILABLE.

12.39

---i-""'f=='tr----- t

77.8013.06-3-)-O-'A-.

(0.094)

6985:12.75)

---

QJ/;~~"',

76.20 (3.00)
DIA

j

ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
All DIMENSIONS ARE TYPICAL VALUES.

6-92

I

87.33 (3.438)

Dr

1

304.80 (12.00)

r

~--------

Electrical Characteristics at TA = 25°C
Device
Symbol

P9r9meter

HLMP-

Iv

Luminous Intensity

Standard,Red
6000
6001

201/2

APEAK

Ad

TS

C

Including Angle
Between Half
Luminous Intensity
Points
Peak Wavelength

Dominant Wavelength

Speed of Response

Capacitance

High EffibiElncy f'lrd
6300
OraQge
Q400
Yellow
6400
Green
6500
Emerald Green
0600
All

Min.

TYp.

0.5
1.3

1.2
3.2

to

3.0

1.0

3.0

1.0

3.0

to

3.0

1.0

2.5
90

Deg.

See'Note 1
(Figures 6, 11, 16,21)

Measurement at Peak

Standard Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green

640
626
608
585
569
556

nm

See Note 2

Standard Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green

15
90
260
90
500
4000

ns

Standard Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green

100
11
4
15
18
35

pF

120

°CIW

VF

Forward Voltage

Standard Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green

1.4
1.5
1.5
1.5
1.5
1.5

All

5.0

Luminous Efficacy

IF = lOrnA
(Figures 3,8, 13, 18)

nm

All

'l'/v

mcd

Test Conditions

655
635
612
583
565
555

Thermal Resistance

Reverse Breakdown
Voltage

Units

Standard Red
High Efficiency Red
Orange
Yellow
Green
Emerald Green

BJC

VR

Max.

Standard Red
High Efficiency Red
Orange
YelloW
Green
Emerald Green

Notes on following page.

6-93

1.6
2.2
2.2
2.2
2.3
2.2

65
145
262
500
595
656

2.0
3.0
3.0
3.0
3.0
3.0

VF=O; f = 1 MHz

Junction to Cathode
Lead

V

iF=10 rnA
(Figures 2,7.12.17)

V

IR = 100 JJA

lumens
Watt

See Note 3

------

NOTES:
1. 01/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/ryv. Where Iv is the luminous intensity in candelas and ryv
is the luminous efficacy in lumens/watt.

Absolute Maximum Ratings at TA
Venow

Red
HLMP·600011

High EII,fled
HLMP·6300

Orange
HLMp·Q400

HLMP-6400

Gfeen
HLMP·6500

Emerald Green
HLMP-Q600

Power DIssipation

100

135

135

as

135

mW

DC Forward Current

50111

30121

30121

20 111

135
30[21

Peak Forward Current

1000

90

90

60

90

mA

See Fig. 5

See Fig. 10

See Fig. 10

See Fig. 15

90
See Fig. 20

Parameter

Unlb

mA

See Fig. 20

Reverse Voltage (fR = 100 pA)

3

5

5

5

5

5

V

Transient Forward Currenl 131
(10 psec Pulse)

2000

500

500

500

500

500

mA

-5510+100

-55 to +100

-5510+100

-55 to +100

Operating Temperature
Range
Storage Temperature Range
Lead Soldering
Temperature [1.6 mm ,0.063
in.1 from bodyl

-2010+100

-20 to +100

-5510+100

-55 to t100

260· C for 3 seconds

NOTES:
1. Derate from 50 0 C at 0.2 mAIo C.
2. Derate from 50 0 C at 0.5 mAIo C.
3. The transient peak current is the maximum non-recurring peak
current that can be applied to the device without damaging the
LED die and wirebond. It is not recommended that the device be
operated at peak current beyond the peak forward current listed
in the Absolute Maximum Ratings.

1.0r---------------~~~--~~----r_~._--

__~r__.~------------_.--------------.

WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength

6-94

·C

standard Red HlMP-6000/6001
.,

1.30

/'

~w<

V

4.0

---

~~

~~

~<

~s

~:1
.<

1.1 0
2.0

~~
',L.4~0----~~----~I.~'O~--~1.70

II

V

~~

/

1.0

00

1.00

IL
/1

0

30

Figure 2. Forward Current vs.
Forward Voltage.

so

20

IF - FORWARD CURRENT _ rnA

Vf - FORWARD VOLTAGE - VOLTS

100

IpEAK - PEAK CURRENT - rnA

Figure 3. RelativeLuminouslntensity
vs. Forward Current.

Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

80'

90'1---+--+-+-''±~
tp - PULSE DURATION

-).IS

Figure 6. Relative Luminous Intensity vs. Angular Displacement.

Figure 5. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)

High Efficiency Red HlMP-6300, orange HlMP-Q400
<
E

50
0

0

/

0

0

0

/

/

/

/

,

I.'

/

1.5

/

'/

/

Vf - FORWARD VOLTAGE - V

~ffi
>~

V

/

1. 1

~~

1.0

~~

.9

-

V

/

7
30

IOC - DC CURRENT PER LED - rnA

Figure 7. Forward Current vs. Forward
Voltage Characteristics

,/-

1.2

a:~

00

25

~~

1.3

tE~

v

/

1.4

u«

/

0

U
>0

Figure 8. RelativeLuminouslntenslty
vs. Forward Current.

'0
!PEAK - PEAK CURRENT - rnA

Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

I
10000
tp - PULSE DURATION -/-IS

Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)

Figure 11. Relative Luminous Intensityvs.AngularDisplacement.

6-95
------------------------

Yellow HLMP-6400
2.5

II

2.0

I
II
0

/

0

0

/

1.5

1.0

II

/

.5

./
1.5

T. '2JC

2,0

3.0

00

3.5

/

VF - FORWARD VOLTAGE - V

1.5

V

1.4
1.3
1.2

/

/'

/

1.0

..

/

I

.6
15

20

30

40

50

60

IpEAK - PEAK CURRENT - rnA

- FORWARD CURRENT - rnA

Figure 13. Relative Luminous Intensity
vs. Forward Current.

10

.7 0

20

V

v

I

10
~

Figure 12. Forward Current vs. Forward
Voltage Characteristics

I.

/

Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

II III!II LI I111111 1111111

M~~;J- W~'360~:~W

1KH~1 100Hl

10KHz

\

\

\

100

1000

I

,'jim 10

10000

tp - PULSE DURATION -jJS

Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX
as per MAX Ratings)

Figure 16. Relative Luminous Intensityvs.AngularDisplacement.

Green HLMP-6500, Emerald Green HLMP-Q600
60

1/

I

6

/

0

,
0

/

5

./

,/

20

VF-FORWARD VOLTAGE_V

Figure 17. Forward Current vs.
Forward Voltage.

~I'~~.

V

5
1

U

1. 3

4

L

1.2
I

,

/
10

~

~

V

5

/
1.5

/

5

/

,
,

,

:1

15

20

25

30

3540

IpEAK - PEAK CURRENT PER LEO -rnA

Figure 18. Relative Luminous Intensity
vs. DC Forward Current

., o

10

20

30

40

50

60

70

.0'

.0·1----+--+-+-'4~~~lS0·-:2~0·;C3:!;;0:;-·4'::0:;-';!;SO:;-'-;!60"·-:;'' ' 0·-:.;';o':;-.;!;0:;-·;;100

w u

tp -

PULSE DURATION

0

-/.IS

Figure 20. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)

Figure 21. Relative Luminous Intensity vs. Angular Displacement.

6-96

90 100

Figure 19. Relatiave Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current

:EX

.!-E

80

IpEAK - PEAK CURRENT PER LEO - rnA

'!R:E~

HLM~-62dofsijRIE~:

HIGH EFFICIENCY REO
YEti~(:)W
GREEN

HLMP~6750SS,RI.SS

HLMP:',~,~50 SS~IS!~

HLMP-6850 .S.ERIES

TECHNICAL DATA

JANUARY 1986

Features
.. IMPROVED BRIGHTNESS
.. AVAILABLE IN 4 BRIGHT COLORS
Red
High Efficiency Red
Yellow
High Performance Green
.. EXCELLENT UNIFORMITY BETWEEN
ELEMENTS
o

END STACKABLE FOR LONGER ARRAYS

o SELECTION OF VARIOUS LENGTHS

.. COMPACT SUBMINIATURE PACKAGE STYLE
.. NO CROSSTALK BETWEEN ELEMENTS

Description
The HLMP-6XXX Series Arrays are comprised of several
subminiature lamps molded as a single bar. Arrays are
tested to assure 2.1 to 1 matching between elements and
intensity binned for matching between arrays.
The HLMP-620X Series Arrays are Gallium Arsenide
Phosphide red light emitting diodes. The HLMP-665X,
HLMP-675X series arrays are Gallium Arsenide Phosphide
on Gallium Phosphide red and yellow light emitting diodes.
The HLMP-685X series arrays are Gallium Phosphide green
light emitting diodes.

Array
Length
3-Elemenl HLMP4-Element HLMP5-Element HLMP6-Element HLMP8-Element HLMP-

Red

6203
6204
6205
6206
6208

Yellow
6753
6754

High
Performance
Green
6853
6854

6655
6656

6755
6756

6855
6856

6658

6758

6858

o

INDUSTRIAL CONTROLS

o POSITION INDICATORS

" OFFICE EQUIPMENT

Each element has separately accessible leads and a
diffused lens which provides a wide viewing angle and a
high on/off contrast ratio. The center-to-center spacing is
2.54 mm (.100 in.) between elements. Special lead bending
is available on 2.54 mm (.100 in.) and 5.08 mm
(.200 in.) centers.

High
Efficiency
Red
6653
66.54

Applications

o

INSTRUMENTATION LOGIC INDICATORS

o

CONSUMER PRODUCTS

Axial luminous Intensity and
viewing Angle at 25°C
IV per Element
(mcd)
@10mADC
Number of
Part Number Elements

Color

Min.

Typ.

2Hl12
Note 1.

HLMP-620X

X = 3,4,
5,6,8

Red

.5

1.2

90'

HLMP-665X

X = 3,4
5,6,8

High
Efficiency
Red

1.0

3.0

90"

HLMP-675X

X = 3,4
5,6,8

Yellow

1.0

3.0

90"

HLMP-685X

X = 3,4
5,6,8

Green

1.0

3.0

90"

NOTE:
1. H1/2 is the off-axis angle at which the Luminous
Intensity is half the axial luminous intensity.

6-97
-~------

Absolute Maximum Ratings at TA = 25°C
Parameter
Peak Forward Current
DC Current
Power DIssipation
Reverse Voltage OR - 100"AI
Transient forward Voltage 110 "sec Pulse)
cQperaling Temperature Range
Storage Temperature Range
Lead Soldering Temperature
1.6 mm 1(0.063 in.) from bodyl

High
Efficiency
Red
90
30121
135

Red
1000
50111
100
3
2000 13 1

500131

Yellow
60
20111
85
5
5001 31

-55 to +100

-55 to+l00

5

-55 to +100

Green

Units
mA
mA
mW
V
mA

90
30121
135
5
500131
-20 to +100
-55 to +100

·C

260' C tor 3 seconds

NOTES: I 1. Derate from 50' C at 0.2 mAr C . • 2. Derate from 50' C at 0.5 mAl' C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED
die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
1.0

....>-

GREEN,

\"'0/

(

I

in

ill....

;;
w

>
;:

0.5

TA ·25"C

RED

YELLOW

GaAsP RED

1\

~J ~DL~~

~

a:

0
500

550

600

700

650

750

WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength.

Electrical/Optical Characteristics at TA =25°C
Symbol
AP

o.d
':'0.112
TO

C
NJC

HLMP~2XX
HU,nP-685X
HLMP-66SX
HLMP-61SX
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
655
583
565
635

Description
Peak Wavelength
Dominant Wavelength
Spectral Line
Halfwidth
Speed of Response
Capacitance
Thermal Resistance

648
24

626
40

585

569

36

28

10
100
120

90
16
120

90
18
120

500
18
120

VF

Forward Voltage

1.4

1,6

VR

Reverse Breakdown
Voltage
Luminous Efficacy

3.0

10

1jV

2.0

1.5

2.2

3.0

3,0

22

5.0

5.0

65

1.5

1.5

ns
pF

VF - 0; f

= 1 MHz

'C/W Junclionto
3.0

5.0

Cathode Lead
IF = 10 mA,
Figures 2,7,12,17
IA= 1OO I'A

V
V

595

500

145

2,3

Units Test Condillons
nm Measurement
at Peak
nm Note 1
nm

Im/W Nota.2

NOTES:
1. The dominant wavelength, Ad. is derived from the elE chromaticity diagram and represents the single wavelength which defines the color of the device.
2. Radiant intensity. Ie. in watts/steradian, may be found from the equation le=lv/l]v. where Iv is the luminous intensity in candelas and 1}v is the luminous
efficacy in lumens/watt.

Package Dimensions

Notes:
1. All dimensions are in millimetres (inches).
2. Optiol'l8llead form available.
3, Overall length is the number of elements times
2.54mm {.10a in.J.

ffi

~('030)R

r~

1.91 (.075)
MAX.

\

~

r=-.l
-n:

MAX.

1."""

II
T,lBlJ!!ll)1II

:23 (.009)

.76 (.030)

::1- Hij :.~~::

)J.

.

C

II
II

!l.

1--2'~ci~~OI--1

f

~,.!ML
. " = =+ =
I

r--- ----

N

(2.5~~~OEO~ MAX. ------j

SEE NOTE 2

6-98

IF
,.'
,
w"'
'
I
r~:~~·"·'~ ~ ,:,:7
.46 1.018) ~

~

11;!,~~5)

L

t

BOTH S I D E S !

j

- -

rl

T

.. f ..

fo-

'-

~/

1

I

/

I

f-(I)YE
1 .,

P

-I

f

I '

{~::~:
__ l
'c

W

U

!J

o

0

D"ANDDE

,,~L0651DIAc
1.91 (.075)

Red HlMP-62XX Series
:~

,-----r----r-.,.---,

30
20

10i-----j---.f+-----j

o i.
o~

tp -

PULSE DURATION

Y

vr'-1=

YI

1.30

I-- -I-- _.
1.20

I
I

IV

H- -r-

IF - FORWARD CURRENT _ rnA

,

I--

1.10

I

1/!
0/1 i

VF - FORWARD VOLTAGE - VOLTS

Figure 2. Forward Current vs.
Forward Voltage.

1

o--~+
, V

0
1~,.4~0~--7.~--~~-~1.70

I

I
,i

0-++_ 1

00

/

I
20

60

80

100

IpEAK - PEAK CURRENT - mil.

Figure 3. RelativeLumlnouslntenslty
vs. Forward Current.

Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

-1'5

Figure 5. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX
as per MAX Ratings)

Figure 6. Relative Luminous Intensity vs. Angular Displacement.

High Efficiency Red HlMP-665X Series
0
50

0
0

/

0

0

/

0

'0

/

/

/

I

VF - FORWARD VOLT AGE - V

Figure 7. Forward Current vs.
Forward Voltage.

L

,

/
/

0

,
0

'/

/

/

0

15
IOC - DC CURRENT PER LED - rnA

Figure 8. Relative Luminous Intensity
v5. DC Forward Current.

lPEAK - PEAK CURRENT - rnA

Figure 9. Relative Efficiency
(Luminous IntenSity per Unit
Current) vs. Peak Current.

Ip - PULSE DURATION - itS

Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)

Figure 11. Relative Luminous Intensltyvs.AngularDlsplacement.

6-99
------

-

-----

Yellow HlMP-675X Series
0

1/

0

L

0

5

I

0

0

I

0

0

5

I

0

5

/

o
3.0

'0

3.5

.7 0

10

20

30

40

50

60

IpEAI( - PEAK CURRENT - rnA

IDe - DC CURRENT PER LED _ rnA

Figure 12. Forward Current vs.
Forward Voltage.

PULSE DURATION _.

V

4.0

VF - FORWARD VOLTAGE - V

Ip

y-

/v

/'

Figure 13. Relative Luminous Intensity
vs. DC Forward Current.

Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

/.'$

Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)

Figure 16. Relative Luminous Intensity vs.AngularDlsplacement.

Green HlMP-685X Series
0

0

/

0

/

0

0

II

1/

5

0

0

J

0

05

'.5

/

2.0

0

25

3.0

Vf-FQRWARD VOLTAGE-V

Figure 17. Forward Current vs.
Forward Voltage.

I~

PULSE DURATION

V

.5

II

0

0

/

5

:v

/

/

V
JO

IDC - DC CURRENT PER LED - rnA

Figure 18. Relative Luminous Intensity
vs. DC Forward Current.

o

10

20

30

Figure 21. Relative Luminous Intensltyvs. AngularDlsplacement.

6-100

50

60

Figure 19. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

"s

Figure 20. Maximum Tolerable Peak Current VI. Pulse Duration. (IDC MAX
as per MAX Ratings)

40

'PEAI( - PEAK CURRENT - rnA

rh~

~~

HEWLETT
PACKARD

T-1 3/4 (5 mm)
HIGH INTENSITY SOLID STATE LAMPS
HIGH EFFICIENCY RED. HLMP-331X SI;RII;S
YELLOW • HLMP' 341 X SERIES
HIGH PERFORMANCE GREEN. HLMP'351 X SERIES
TECHNICAL DATA

JANUARY 1986

Features
• HIGH INTENSITY
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
High Performance Green
• POPULAR T·1 3/4 DIAMETER PACKAGE
• SELECTED MINIMUM INTENSITIES
• NARROW VIEWING ANGLE
• GENERAL PURPOSE LEADS
• RELIABLE AND RUGGED
• AVAILABLE ON TAPE AND REEL

package Dimensions

Description
This family of T·1 3/4 lamps is specially designed for
applications requiring higher on-axis intensity than is
achievable with a standard lamp. The light generated is
focused to a narrow beam to achieve this effect.

Part
Number
HLMp·
3315
3316

Description
lIIuminalor/Point
Source
Illuminator/High
Brightness

Minimum
Intensity
(mcd)
all0 mA

12

20

1.21(.0501

3415
3416
3517
3519

NOTES:

1, ALL DfM€NSIONSAA€ IN MllUMfTReS (INCHES!.
2. AN EPOXY Ml;Nj$CuS MAY E)(TeND ABOUT 1rt1m

Ul40"j: OOWN THE -t.E:AOS.

6-101

Illuminator/Point
Source
Illuminator/High
Brightness
lIIuminalor/Point
Source
Illuminator/High
Brightness

10

20
6.7

10.6

Color
(Material)
High
Efficiency
Red
(GaAsP
on GaP)
Yellow
(GaAsP
on GaP)
Green
(GaP)

Electrical Characteristics at TA = 25°C
Descriplion

Symbol

Luminous Intensity

Iv

201/2

Including Angle
Between Half
Luminous Intensity
Points

APEAK

Peak Wavelength

Ad

Dominant Wavelength

rs

Speed of Response

Device
HLMp·

Min.

Typ.

3315
3316

12.0
20.0

18.0
30.0

med

IF"" 10 mA (Figure 3)

3415
3416

10.0
20.0

18.0
30.0

mcd

IF'" 10 mA (FigureS)

3517
3519

6.7
10.6

25.

I

IF'" 10 mA (Figure 3)
1F''''10mA
See Nole 1 (Figure 6)

3415
3416

35
35

Deg.

IF=10mA
See Note 1 (Figure 11)

3517
3519

24
24

Deg.

IF'" 10 mA
See Note 1 (Figure 16)

331X
341X

635
583
565

nm

Measurement at Peak
(Figure 1)

626
585
569

nm

See Note 2 (Figure 1)

90
90
500

ns

pF

351X

16
18
18

331 X

120

°C/W

331X
341X
331 X
351X

Thermal Resistance

mcd
Oeg.

341X

(]Jc

lOll-

Test Conditions

35
35

351X

Capacitance

Units

3315
3316

351X

C

Max.

331X
341X

VF = O;f= 1 MHz

Junction to Cathode Lead

341X
351X
Forward Voltage

VF

331X
351X

1.5
1.5
1.6

All

5.0

341X
VBR

Reverse Breakdown Volt

t)V

Luminous Efficacy

331X

145
500
595

341X
351X
NOTES:

V

3.0
3.0
3.0

2.2
2.2
2.3

IF = 10 mA (Figure 2)
IF = 10 mA {Figure 7}
IF = 10 mA (Figure 12)

V

IR= 100 MA

lumenS
Watt

See Note 3

1. (->1/2 IS the off-aXIS angle at which the lummous rntenslty IS half the aXial luminous mtenslty.
2. The dominant wavelength, Ad, is derived from the GIE chromaticity diagram and represents the single wavelength which defines the color
of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie::::: Ivi17v, where Iv is the luminous intenSity in candelas and 7Jv is
the luminous efficacy in lumens/watt.

Absolute Maximum Ratings at TA = 25°C
Parameter

331XSeries

341X Series

351X Series

Units

Peak Forward Current

90

60

90

mA

Average Forward Currentl 1 i

25

20

25

mA

DC CurrentlZI

30

20

30

mA

Power Dissipationl3J

135

85

135

mW

5

5

5

V

500

500

500

mA

-5510+100

-2010+100
-55 to +100

°C

Reverse Voltage IIR = 100 MAl
Transient Forward Currentl 4 1(10
MseePulsel
Operating Temp~
Storage Tempera

-55to+100

Lead Soldering Temperature
11.6 mm (0.063 in.) from body)

260* C for 5 seconds

6-102

NOTES:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mN°C. For Yellow series derate linearly from 50°C at 0.2 mN°C.
3. For Red and Green series derate power linearly from 25° Cat 1.8 mWrC. For Yellow series derate power linearly from 50° C at 1.6 mW/o C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.

1.0

~

HIGH EFFICIENCY

~>-

RED

;;,

0.5

w

>
>=

~

'"
0
500

700

750

WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength

High Efficiency Red HlMP-331 X Series
0

0
0

<
:

>z

""o
o

/

5

II

o

~

/

0

5

II

~
I

0

/

0

/

5

I

70

0
0

o

1.0

/

1/

0

~

:/

f---

30

30

IDe - DC CURRENT PER LED - rnA

Vf - FORWARD VOLTAGE - V

Figure 2. Forward Current vs. Forward
Voltage Characteristics

/

Figure 3. Relative Luminous Intensity
vs. DC Forward Current

tpEAK - PEAK CURRENT PER LED - rnA

Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current

tp - PULSE DURATION -/.IS

Figure 5. Maximum Tolerable Peak
Current vs. Pulse Duration
(I DC MAX as per MAX Ratings)

Figure 6. Relative Luminous Intensity vs. Angular Displacement

6-103

Yellow HLMP-341 X Series
2.5

II

t:

/

1.5

>~

g~

/

0

2.5
VF

~

3.0

.5
00

35

fORWARD VOLTAGE. V

Figure 7. Forward Current vs.
Forward Voltage
Characteristics

/~ ..

/

w~

/

0

~!i
~ffi

2~·"

/

~~
1.0
~<

j

.

0

~l

2.0

i!'-

II

.
0

T••

>

/

10

/

_._--

1.2 f--+-..,,f-.1.1 f--t+-+-+-+--\--j

20

15

IF - FORWARD CURRENT - mA

Figure 8. Relative Luminous Intensity
vs. Forward Current

60
IpEAK - PEAK CURRENT - rnA

Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current

90· f--+--+--+---tc:3
tp - PULSE DURATiON - liS

Figure 1D. Maximum Tolerable Peak Current
vs. Pulse Duration (I DC MAX
as per MAX Ratings)

Figure 11. Relative Luminous Intensity vs. Angular Displacement

Green HLMP-351 X Series
0

5

0

/

5

0

VF - fORWARD VOLTAGE - V

Figure 12. Forward Current vs.
Forward Voltage
Characteristics

/

V

/

/V
IF- DC FORWARD CURRENT-rnA

Figure 13. Relative Luminous Intensity
vs. DC Forward Current

IpEAK - PEAK CURRENT PER LED - rnA

Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current

90'f--+--+-+--+,=
Ip - PULSE DURA nON - 1'$

Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration (IDC MAX
as per MAX Ratings)

Figure 16. Relative Luminous Intensity vs. Angular Displacement.
T-1 3/4 Lamp

6-104

------~--~-~~

Flin-

HEW Le:TT,.

~a PACKARD

----~~~--

-

T-1 (3 mm)
HIGH INTENSITY S8UD STATE lAMPS
HIGH EFFICIENCY RED. HlIVUj :132X SERIES
YE1.:LOYV • HLMP-142X ~ERIES
HIGH PERFORMANCE GREEN. HLMP-152X SERIES

."

TECHNICAL DATA

JANUARY 1986

Features
o

HIGH INTENSITY

• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
High Performance Green
o POPULAR T-1 DIAMETER PACKAGE
o

SELECTED MINIMUM INTENSITIES

o

NARROW VIEWING ANGLE

o

GENERAL PURPOSE LEADS

o

RELIABLE AND RUGGED

o

AVAILABLE ON TAPE AND REEL

package Dimensions

Description
This family of T-1 lamps is specially designed for applications requiring higher on-axis intensity than is achievable
with a standard lamp. The light generated is focused to a
narrow beam to achieve this effect.

Part
Number
HLMP1320
1321

1420
1421
1520

CATHOO~

1521

n
~

NOTES,
1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES),
AN EPOXY MENISCUS MAY EXTEND ABOUT 101m
L040"} DOWN THE LEADS.

<,

6-105

Description

Minimum
Intensity
(mcp)
at 10 inA

Untinted
Non-Diffused
Tinted
Non-Diffused

6

Untinted
Non-Diffused
Tinted
Non-Diffused

6

Untinted
Non-Diffused
Tinted
Non-Diffused

4.2

Color
(Material)
High
Efficiency
Red
(GaAsP
on GaP)
Yellow
IGaAsP
on GaP)
Green
(GaP)

~---

Electrical Characteristics at TA = 25°C
Description

Symbol
Iv

Luminous Intensity

Device
HLMP-

Min.

Typ.

1320
1321

6.0
6.0

12.0
12.0

mcd

IF = 10 mA (Figure 3)

1420
1421

6.0
6.0

12.0
12.0

mcd

IF = 10 mA (Figure 8)

1520
1521

4.2
4.2

5.0
5.0

mcd

IF =10 rnA (Figure 3)

All

45

Deg.

IF=10mA
See Note 1 (Figure 6.11. 16)

Max,

Test Conditions

Units

2H1/2

Including Angle
Between Half
Luminous Intensity
Points

APEAK

Peak Wavelength

132X
142X
152X

635
583
565

nm

Measurement at Peak
(Figure 1)

Ad

Dominant Wavelength

132X
142X
152X

626
585
569

nm

See Note 2 (Figure 1)

TS

Speed of Response

132X
142X
152X

90
90
500

ns

C

Capacitance

132X
142X
152X

16
18
18

pF

OJc

Thermal Resistance

All

120

°C/W

VF

Forward Voltage

VBR

Reverse Breakdown Volt.

1JV

Luminous Efficacy

131X
142X
152X

1.5
1.5
1.6

All

5.0

132X
142X
152X

V

3.0
3.0
3.0

2.2
2.2
2.3

145
500
595

VF '" 0; f = 1 MHz

Junction to Cathode Lead
IF= 10 mA

V

IR= 100 "A

lumens
Watt

See Note 3

NOTES:
1. 01/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength. Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color
of the device.
3. Radiant intensity. Ie. in watts/steradian. may be found from the equation Ie = Iv/W. where Iv is the luminous intensity in candelas and W is
the luminous efficacy in lumens/watt.

Absolute Maximum Ratings at TA
Parameter

Red

Yellow

Green

Units

Peak Forward Current

90

60

90

mA

Average Forward Currentl 1 1

25

20

25

mA

DC Currentl 2j

30

20

30

mA

Power Dissipationl~J

135

85

135

mW

5

5

5

V

500

500

500

mA

--55 to +100

-20 to +100
--55 to +100

°C

Reverse Voltage (lR = 100 j.t.Al
Transient Forward Currentl 4 1 (10
"sec Pulse)
Operating Temperature Range
Storage Temperature Range

-55 to +100

Lead Soldering Temperature
[ 1.6 mm (0.063 inJ from body 1

260· C for 5 seconds

6-106

------------

-----~----

NOTES:
1. See Figure 5 (Red I, 10 (Yellowl, or 15 (Greenl to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mN°C. For Yellow series derate linearly from 50°C at 0.2 mN°C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/oC. For Yellow series derate power linearly from 50°C at 1.6 mW/oC.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.

'.0

>
~

HIGH EFFICIENCY

in

RED

~
~
w

0.5

>

g
0
500

750

700
WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength

T-1 High Efficiency Red Non-Diffused
0

0

0

5

I

0

I

1/

5

I

0

\1

, I
.0

/

2

/

1

0

:/ /

0

o

,.--

3

/

5

0

5
4

0

0

6

/

40

3.0

5.0

tp -

..

,I

8

o.7

25

~.

I

9

o

10

W

~

~

~

m

ro

00

00

IpEAK - PEAK CURRENT PER LED - rnA

IDe - DC CURRENT PER LED - rnA

VF - FORWARD VOLTAGE - V

Figure 2. Forward Current vs. Forward
Voltage Characteristics

V

0

Figure 3. Relative Luminous Intensity
vs. DC Forward Current

Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current

PULSE DURATION -IJS

Figure 5. Maximum Tolerable Peak
Current vs. Pulse Duration.
(locMAX as per MAX Ratings)

Figure 6. Relative Luminous Intensity vs. Angular Displacement

6-107
----

~--.~

---~----------------

T-1 Yellow Non-Diffused
60

50

/

0

1,0

0

/

0

2.0

Vf

~

2.5

3.0

3.5

0

4.0

FORWARD VOLTAGE - V

Figure 7. Forward Current vs.
Forward Voltage
Characteristics

1.6

/
,/
/

5

/
1.5

T. >,~c

/

/

0

0

2. 5

I

40

/"

1.5

1.'

/

1.3

1/

1.2

I
/"
/

1. 1

V

1.0

.9
.8

15

10

20

If - FORWARD CURRENT - rnA

.7 0

1=

-

I

I
10

20

30

40

.

60

IpEAK - PEAK CURRENT - rnA

Figure 8. Relative Luminous Intensity
vs. Forward Current

Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current

9'1-_+-_+-_+_-+0=

100·

tp - PULSE DURATION -~,

Figure 11. Relative Luminous Intensity vs. Angular Displacement

Figure 10. Maximum Tolerable Peak Current
vs. Pulse Duration. (locMAX
as per MAX Ratings)

T-1 Green Non-Diffused
0
0
0

0

I
I
I
I I

I I

.>

"z<

Til. '?5C
20

WE

~~

~~

I

zw
i~

~~

10

V

>~

0
0

~~

I

/

..... /

0

"

/

I

15

00

00

Figure 12. Forward Current vs.
Forward Voltage
Characteristics

10

15

20

25

30

IF - FORWARD CURRENT - rnA

VF - FORWARD VOLTAGE - V

Figure 13. Relative Luminous Intensity
vs. Forward Current

IpEAI( - PEAK CURRENT PEA LED - rnA

Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current

80"
tp -

100'

PULSE DURATION -,."

Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration. (locMAX
as per MAX Ratings)

Figure 16. Relative Luminous Intensity vs. Angular Displacement

6-108

--------------- ----------------

CLlP~ND

REI AINING
RING FeR PANEL
MeuN~EE1't,1 3/4 LEDs
OPTION 009 (HL!VIP-0103)
TECHNICAL DATA JANUARY 1986

Description

1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCES ± .25 (.010).

The Option 009 (HLMP-0103) is a black plastic
mounting clip and retaining ring. It is designed to
panel mount Hewlett-Packard Solid State high profile T-1 3/4 size lamps. This clip and ring combination is intended for installation in instrument
panels from 1.52mm (.060") to 3.18mm (.125")
thick. For panels greater than 3.18mm (.125")
counterboring is required to the 3.18mm (.125")
thickness.

Ii

I. I--

!IJ

--I

RETAINING

CLIP

RING

Mounting Instructions

],II

1. Drill an ASA C size 6.15mm (.242") dia.
hole in the panel. Deburr but do not
chamfer the edges of the hole.

:,'"",',.,",','",',:,"",,

~"

2. Press the panel clip into the hole from
the front of the panel.

1I
",%,',',',,','"

3. Press the LED into the clip from the
t;Jack. Use blunt long nose pliers to push
on the LED. Do not use force on the
LED lea.ds. A tool such as a nut driver
may be used to press on the clip.

Note: Clip and retaining ring are also available for T-1
package, from a non-HP source. Please contact
Interconsal Association, 991 Commercial St., Palo
Alto, CA 94303 for additional information.

\

PLIERS

4. Slip a plastic retaining ring onto the back
of the clip and press tight using tools such
as two nut drivers.

Ordering Information
T-1 3/4 High Dome LED Lamps can be purchased
to include clip and ring by adding Option Code 009
to the device catalog part number.
Example:
To order the HLMP-3300 including clip and
ring, order as follows: HLMP-3300 Option 009.

6-109

I

6.73 (.2651 DIA.
9.53 (.375 ) D I A . _

3
NUT DRIVER

FliU-

T-1 3/4 LED LAMP
RIGHT ANGLE HOUSING

HEWLETT

~~ PACKARD

HLMP-5029

TECHNICAL DATA

Features
• FITS ANY HP HIGH DOME T-1 3/4 LED LAMP
• SNAP-IN FIT MAKES MOUNTING SIMPLE
• HIGH CONTRAST BLACK PLASTIC

Description
The HLMP-5029 is a black plastic right angle housing
which mates with any Hewlett-Packard High Dome T-1 3/4
lamp. The lamp snaps into place. The material is fully
compatible with environmental specifications of all
Hewlett-Packard T-1 3/4 lamps.

Physical Dimensions

-

-

I

I

+

+

I
I

I
I

I ....- - - - - '
I
I
I

I
I
I
I

EI3

---- (0~;5;or--....~

622 +0.05

--j!
If--(o .~45 ~:~~2)
-0.005

I

622~05
.

I

-008

~ 0021

L

10.245

-0005

I

---

I

--

3.73
..0-(0.14711

-----a~

r----(;2'o"21

r---

0,84
(0.0331

----r-2.54
10.100)

.J

~---I~

*

ALL TOLERANCES ±O.254 (±O.010) UNLESS OTHERWISE
SPECIFIED.
DIMENSIONS IN MILLIMETRES AND IINCHES).

PATENT PENDING

6-110

JANUARY 1986-

7Q~nm

Flidl

\HIGH INtENSITY
SUBMINIATURE
EMITTER

HJ~WLET=r
a.!~ P~CKARO

HEMT -6000

TECHNICAL DATA

JANUARY 1986

Features
• HIGH RADIANT INTENSITY

---1

"'N1

~I~I ""'""~~~.,~,~~
1-".41.4. ". . I. . .

• NARROW BEAM ANGLE
• NONSATURATING OUTPUT
• BANDWIDTH: DC TO 5 MHz
• IC COMPATIBLE/LOW CURRENT
REQUIREMENT

!:..§ 1,(65) DIA
1,91 e07S)

I t-!

,

r.....

ci& •l!@
.••.. 01S

12 LQQQ)

1.781.070)

MECHANICA.l

AXIS

• VISIBLE FLUX AIDS ALIGNMENT

\
(CLEAR} EPOXV
UNOlFfUSEO.
UNTINTEQ'..,

~ tOO?)

Description

J.

1.9-1 1.075) MAX.

23\,(09)

The HEMT -6000 uses a GaAsP chip designed for optimum
tradeoff between speed and quantum efficiency. This
optimization allows a flat modulation bandwidth of 5 MHz
without peaking, yet provides a radiant flux level
comparable to that of 900nm IREDs. The subminiature
package allows operation of multiple closely-spaced
channels, while the narrow beam angle minimizes
crosstalk. The nominal 700nm wavelength can offer
spectral performance advantages over 900nm IREDs, and
is sufficiently visible to aid optical alignment. Applications
include paper-tape readers, punch-card readers, barcode
scanners, optical encoders or transducers, interrupt
modules, safety interlocks, tape loop stabilizers and fiber
optic drivers.

..

(,050)

ill \.0551

-1.

2.92 i.115J

~

=

Z SH.VEFH-'lATED LEAOS. SEE APPLICATION BULLETlN-3.

WITH: FOOTNOTE l.

1.0

Lead Soldering
Temperature ...................... 260° C for 3 sec.
[1.6 mm (0.063 in.) from body]

C03l)

NOteS!
1. ALL DIMENSIONS ARE IN MIJ,.LIMETRES nNCHES1<

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . .. 50 mW
(derate linearly from 70°C @ 1.0mWfOC)

Operating and Storage
Temperature Range ................. -55° to +100°C

I

\l
J

3, USER MAY BEND LEADSA$SHOWN,
4. EPOXY ENCAPSOlANT HAS A AEFRACTt\tE INDEX OF 1.53,
5, CfiIP CENTERING WITHIN TIofE PACKAGE ISCONSlsrENT

1.2

Peak Forward Current ................... See Figure 5

(1I

l-rnal49}
~ffi"
,,~~"
~~.21

~!
- 1 = ,.11
I I "II

Maximum Ratings at TA = 25°C
Average Forward Current ..................... 20 mA
(derate linearly from 70°C @ O.4mAfOC)

\

I

,.

I-

in

T,,' 25'·C

1ij
l-

~
w

I

rf \II \

O.B
0.6

~

0.4

I

a:

0.2
0
640

-- -

-

\

>
>=

-,

~TA

/

/

-..-:::: ...660

6BO

700

\'

• 100°C

\\
\

720

" ::::::,
740

A- WAVELENGTH - nm

Figure 1. Relative Intensity, versus Wavelength.

6-111
---------------

Electrical/Optical Characteristics at TA = 25°C
Symbol

Description

I"

Radiant Intensity along Mechanical
Axis

Ka

Temperature Coefficient of Intensity

Min.

Typ.

100

250

f.1W/sr

-0.005

°C·,

Note 1
Note 2

Max.

Units
IF

~

10 mA

3,4

'l/v

Luminous Efficacy

2.5

Im/W

20%

Optical Axis Half Intensity Total Angle

16

deg.

Note 3, IF '" 10 mA

APEAK

Peak Wavelength (Range)

690·715

nm

Measured

@

.193

nmfC

Measured

@ Peak,

tSAp~~T
AK
tr

Output Rise Time (10%-90%)

70

ns

tf

Output fall Time (90%-10%)

40

ns

IpEAK = 10 mA

Co

Capacitance

65

pF

VF '" 0; f = 1 MHz

BVR

Reverse Breakdown Voltage

12

V

IR=100MA

VF

forward Voltage

1.8

V

IF = 10 mA

-2.1

mV/oC

'F= lOO IlA

0 JC

140

°C!W

Thermal Resistance

1
Note 4

IpEAK'" 10 mA

6VF!6T Temperature Coefficient of VF

1.5

6

Peak

Spectral Shift Temperature Coefficient

5

fig.

Test Conditions

2

Junction to cathode lead

NOTES: 1. lem ~ Ie (25"C) exp IKe (T - 25"C)).
2. Iv ~ 'Iv Ie where Iv is in candela. Ie in watts/steradian. and 'Iv in lumen/watt.
3. el:\ is the off-axis angle at which the radiant intensity is half the intensity along the optical axis_ The deviation between the
mechanical and the optical axis is typically within a conical half-angle of three degrees.
4. A (T) ~ A (25" C) + (Ll.A ILl.T) (T - 25"C)
PEAK

PEAK

PEAK

100~~

1.5

TI mil
fA'" 2S"'C

~

>-<"

I

'-' E

I-

20
w_

15

~~

'":::>

''-'"
"'"

~"
Ww

wN

1/

1.0

>:;

~~

~

/

-''''
wo

'"

~

"'6

I

0.5
1.6

1.7

VF - FORWARD VOLTAGE - V

Figure 2. Forward Current versus

Forward Voltage.

IpEAK - PEAK CURRENT - rnA

IF - FORWARD CURRENT - rnA

Figure 3_ Relative Radiant Intensity
versus Forward Current.

100

10

0.1

1.8

Figure 4. Relative Efficiency (Radiant Intensity
per Unit Current) versus Peak Current.

..
0

0.30 i=

"'w

>--'

0.25 1-'"

~~

ww

0.20

1-2
60

~~
-''''

0.15 x>
:::>~

0.10

..

@~
Nr
:J!:::

p:

0.05

90
tp - PULSE DURATION - ps

L_L_.L_.L_.I:::::::f.::§j~-LJ..J::±::::±~::=±:::J_

o

0.00
10 20 30 40 50 60 70 80 90

8- OFF-AXIS ANGLE - DEGREES

NORMALIZED INTENSITY

(CONE HALF-ANGLE)

Figure 6. Far-Field Radiation Pattern.

Figure 5. Maximum Tolerable Peak Current versus Pulse
Duration. (IDe MAX as per MAX Ratings)

6-112

'"02

•

•
•
•

•
•

•
•
•

•
• ••••
•
••
•

7-1

Solid State Displays
Hewlett:-Packard's line of Solid State Displays
answers all the needs of the designer. From smart
alphanumeric displays to low cost numeric displays
in sizes from 3 mm (.15 in.) to 20 mm (.8 in) and
colors of red, high efficiency red, yellow, and high
performance green, the selection is complete.
Hewlett-Packard's 5 x 7 dot matrix alphanumeric
display line comes in 3 character sizes: 3.8 mm
(.15 in), 5 mm (.2 in), and 6.9 mm (.27 in). In
addition, there are now 4 colors available for each
size: standard red, yellow, high efficiency red, and
green. This wide selection of package sizes and
colors makes these products ideal for a variety of
applications in avionics, industrial control, and
instrumentation.
The newest additions to HP's alphanumeric
display line are two fully-supported monolithic
sixteen segment displays. Both displays have an
on-board CMOS IC containing memory, ASCII
decoder, multiplexing circuitry, and drivers. Two
character heights are available to fit your needs 4.1 mm (.16 in) and 2.9 mm (.112 in). These
displays incorporate many improvements over
competitive products and are ideal for industrial,
business and telecommunication applications.

Hewlett-Packard's line of numeric seven segment
displays is one of the broadest. From low cost,
standard red displays to high light ambient
displays producing 7.5 mcd/segment, HP's 0.3 in.,
0.43 in., 0.56 in., and 0.8 in. characters can
provide a solution to every display need. HP's
latest product offering include 0.56 in. dual digit
displays and a new line of small package, bright
0.3 in. displays - the 0.3 in. Microbright. These
are ideal for displaying numeric information in
electronic instrumentation, point-of-sale
equipment, appliances and automotive
instrumentation.
Integrated numeric and hexadecimal displays (with
on-board IC's) solve the designer's
decoding/driving problems. They are available in
plastic packages for general purpose usage,
ceramic/glass packages for industrial applications,
and hermetic packages for high reliability
applications. This family of displays has been
designed for ease of use in a wide range of
environments.

7-2

Alphanumeric LED Displays
Page
Description

Device

~

~
~-;-~

L ___ .J

, , ,

~

, . ,

B
~l

___ ~~

n' ___ .J'r.
uL.
u

"O

8:-----:8
~~

I

~

___ J~

~[~=~

r;

Color

Application

2.85 mm (.112")
"POL-1414
Four Character
Monolithic Smart
Alphanumeric Display
Operating Temperature
Range: -40°C to +85°C

Red

• Portable Data Entry Devices
• Industrial Instrumentation
• Computer Perpherals
• Telecommunication
Equipment

HPDL-2416 2.1 mm (.16") Four
Character Monolithic
Smart Alphanumeric
Display
Operating Temperature
Range: -40°C to +85°C
HDSP-2000 3.7 mm (.15") 5 x 7 Four
Character Alphanumeric
HDSP-2001 12 Pin Ceramic 7.62 mm
(.3") DIP with untinted
HDSP-2002 glass lens.
Operating Temperature
HDSP-2003 Range: -20°C to +85°C

Red

•
•
•
•
•

Red

• Computer Terminals
• Business Machines
• Portable, Hand-held or
mobile data entry, readout or communications

HDSP-2300 4.87 mm (.19") 5 x 7 Four
Character Alphanumeric
HDSP-2301 12 Pin Ceramic 6.35 mm
(.25") DIP with untinted
HDSP-2302 glass lens
Operating temperature
HDSP-2303 Range: -20°C to +85°C

Yellow
High Efficiency Red
High Performance
Green
Red
Yellow
High Efficiency Red
High Performance Green

Portable Data Entry Devices
Medical Equipment
Industrial Instrumentation
Computer Peripherals
Telecommunication
Equipment

No.
7-15

7-23

7-31

For further information see
Application Note 1016.
• Avionics
• Grounds Support. Cockpit.
Shipboard Systems
• Medical Equipment
• Industrial and Process
control
• Computer Peripherals
and Terminals

7-35

For further information see
Application Note 1016.

~
"O

~~=~~:~

"L. ___

_

~"

[;,----::::
:::~

___ J:::

~[~~~?

HDSP-2381 4.87 mm (.19") 5 x 7 Four
Character Alphanumeric
HDSP-2382 Sunlight Viewable
Display
HDSP-2393
HDSP-2490 6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
HDSP-2491 28 Pin Ceramic 15.24 mm
(.6") DIP with untinted
HDSP-2492 glass lens
HDSP-2493 Operating Temperature
Range: -200C to +85°C
5082-7100

5082-7101

5082-7102

6.9 mm (.27") 5 x 7 Three
Character Alphanumeric
22 Pin Ceramic 15.2 mm
(.6") DIP
6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
28 Pin Ceramic 15.2 mm
(.6") DIP
6.9 mm (.27") 5 x 7 Five
Character Alphnumeric
36 Pin Ceramic
15.2 mm (.6") DIP

Yellow
High Efficiency Red
High Performance
Green
Red
Yellow
High Efficiency Red
High Performance Green

Red Untinted Glass Lens

7-3
------_._---- - - -

•
•
•
•

Avionics
Cockpit
Ground Support Systems
Industrial

• High Brightness Ambient
Systems
• Industrial and Process Control
• Computer Peripherals
• Ground Support Systems

7-41

7-52

For further information see
Application Note 1016.

General Purpose Market
• Business Machines
• Calculators
• Solid State CRT
• Industrial Equipment

7-68

Alphanumeric LED Displays (cant.)
Device

m
-

I

"""
""
g

"""
"

I

g
g

g

Description
HDSP-6504 3.8 mm (.15") Sixteen
Segment Four Character
Alphanumeric 22 Pin
15.2 mm (.6") DIP
HDSP-6508 3.8 mm (.15") Sixteen
Segment Eight Character
Alphanumeric 26 Pin
15.2 mm (.6") DIP
HDSP-6300 3.56 mm (.14") Sixteen
Segment Eight Character
Alphanumeric 26 Pin
15.2 mm (.6") DIP

Color
Red

•
•
•
•

Computer Terminals
Hand Held Instruments
In-Plant Control Equipment
Diagnostic Equipment

• Computer Peripherals and
Terminals
• Computer Base Emergency
Mobile Units
• Automotive Instrument
Panels
• Desk Top Calculators
• Hand-Held Instruments

0
0

0

Application

-

F9

Page
No.
7-72

7-78

For further information ask for
Application Note 931.

Alphanumeric Display Systems
Device

~
:s

HDSP-2416
0"

'0

o~j ~
r'l Dj':

U!!l
0,

o0 0
1')

o

HDSP-2432

,

:°

o

HDSP-2424

HDSP-2440
00

Fh6lnJs

HDSP-2470

HDSP-2471

HDSP-2472

Description
Single-Line 16 Character
Display Panel Utilizing
the HDSP-2000
Single-Line 24 Character
Display Panel Utilizing
the HDSP-2000
Single-Line 32 Character
Display Panel Utilizing
the HDSP-2000
Single-Line 40 Character
Display Panel Utilizing
the HDSP-2000 Display
HDSP-2000 Display Interface Incorporating a 64
Character ASCII Decoder
HDSP-2000 Display Interface Incorporating a 128
Character ASCII Decoder
HDSP-2000 Display Interface without ASCII Decoder. Instead, a 24 Pin
Socket is Provided to
Accept a Custom 128
Character Set from a
User Programmed lK x
8 PROM

Package
162.56 mm (6.4") Lx
58.42 mm (2.3") H x
7.11 mm (28") D

Application
• Data Entry Terminals
• Instrumentation

Page
No.
7-56

177.80 mm (7.0") Lx
58.42 mm (2,3") H x
7.11 mm (.28") D
171.22 mm (6.74") Lx
58.42 mm (2.3") H x
16.51 mm (.65") D

Alphanumeric Displays
Device
00000
00000
00000
00000
00000
00000
00000

Package
26.5 mm (1.05")
Dual-in-Line
1.09" H x .77" W
x .24" D

Description
HDSP-4501 High Efficiency Red,
Common Anode Row

HDSP-4503 High Efficiency Red,
Common Cathode Row

7-4

Typical Iv@20 rnA DC

Page
No.
7-83

~

--~----~~~~~~~~~-

High Efficiency Red Low Current Seven Segment LED Displays
Package

.

r - -,

~

'0{>

0'

.:=0 .:
-

Device
HDSP-7511
HDSP-7513
HDSP-7517
HDSP-7518

High
High
High
High

Efficiency
Efficiency
Efficiency
Efficiency

Red,
Red,
Red,
Red,

Description
Common Anode, RHDP
Common Cathode, RHDP
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode

Typical Iv @ 2 rnA DC
270l'cd I seg.

Page
No.
7-85

0

7.62 mm (.3")
Microbright
Dual-in-Line
.5" H x .3" W x .24" D

.

,

~

. =ff.
: 0= : :COO:
:0=0:?
•

~

HDSP-3350
HDSP-3351
HDSP-3353
HDSP-3356

High Efficiency Red, Common Anode, LHDP
High Efficiency Red, Common Anode, RHDP
High Efficiency Red, Common Cathode, RHDP
High Efficiency Red, Universal Polarity and
Overflow Indicator, RHDP

300l'cd/seg.

·7-85

HDSP-5551
HDSP-5553
HDSP-5557
HDSP-5558

High
High
High
High

37Ol'cd/seg.

7-85

Typical IV @ 20 rnA DC
1475l'cd/seg.

Page
No.
7-91

155Ol'cd/seg.

7-91

a

0

10.92 mm (.43")
Dual-in-line
.75" H x .5" W x .25" D

[8J
=0
bQ9 ~

Efficiency Red,
Efficiency Red,
Efficiency Red,
Efficiency Red,

Common Anode, RHDP
Common Cathode, RHDP
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode

++.9

14.2 mm (.56")
Dual-in-Line (Single Digit)
.67" H x .49" W x .31" 0

Emerald Green Seven Segment LED Displays
Package

~a:1 §J
.:=0:
+

,

0

Device
HDSP-7901
HDSP-7903
HDSP-7907
HDSP-7908

Emerald
Emerald
Emerald
Emerald

Description
Green, Common Anode, RHDP
Green, Common Cathode, RHDP
Green, Overflow, ±1, Common Anode
Green, Overflow, ±1, Common Cathode

HDSP-5OO1
HDSP-5OO3
HDSP-5OO7
HDSP-5OO8

Emerald
Emerald
Emerald
Emerald

Green,
Green,
Green,
Green,

,

7.62 mm (.3")
Microbright
Dual-in-Line
.5" H x .3" W x .24" 0

+ ~C:::'j+

[l;JJ

~

bQ9 =0+9

Common Anode, RHDP
Common Cathode, RHDP
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode

+ ......

14.2 mm (.56")
Dual-in-Line (Single Digit)
.67" H x .49" W x .31" D

7-5

Red, High Efficiency Red, Yellow, and High Performance Green Seven
Segment LED Displays
Page
Device

Package

r---

:d:
TJD~+

+

-

•

-~c{? 0:

:C3'OJ

~

:a:

r-+

+

+

0'

+

•

'-----

7.62 mm (.3")
Microbright
Dual-in-Line.
.5;' H x .3" W x .24" D

-

r-+

,

,

,

+

a U1-

:=tf
0:
+
, ~,
0

-

'-----

7.62 mm (.3")
Dual-in-line
.75" H x .4" W x .1B" D

Description

HDSP-7301
HDSP-7302
HDSP-7303
HDSP-7304
HDSP-7307
HDSP-730B
HDSP-7311
HDSP-7313
HDSP-7317
HDSP-731B

Red, Common Anode, RHDP
Red, Common Anode, RHDP, Colon
Red, Common Cathode, RHDP
Red, Common Cathode, RHDP, Colon
Red, Overflow, ±1, Common Anode, RHDP
Red, Overflow, ±1, Common Cathode, RHDP
Bright Red, Common Anode, RHDP
Bright Red, Common Cathode, RHDP
Bright Red, Overflow, ±1, Common Anode
Bright Red, Overflow, ±1, Common Cathode

HDSP-7401
HDSP-7402
HDSP-7403
HDSP-7404
HDSP-7407
HDSP-740B

Yellow,
Yellow,
Yellow,
Yellow,
Yellow,
Yellow,

HDSP-7501
HDSP-7502
HDSP-7503
HDSP-7504
HDSP-7507
HDSP-750B

High
High
High
High
High
High

Efficiency Red,
Efficiency Red,
Efficiency Red,
Efficiency Red,
Efficiency Red,
Efficiency Red,

HDSP-7BOl
HDSP-7B02
HDSP-7B03
HDSP-7B04
HDSP-7B07
HDSP-7BOB

High
High
High
High
High
High

Performance Green,
Performance Green,
Performance Green,
Performance Green,
Performance Green,
Performance Green,

50B2-7730
50B2-7731
50B2-7736
50B2-7740

Red,
Red,
Red,
Red,

Common Anode, LHDP
Common Anode, RHDP
Common Anode, Polarity and Overflow Indicator, RHDP
Common Cathode, RHDP

50B2-7610
50B2-7611
50B2-7613
50B2-7616

Common Anode, RHDP
Common Anode, RHDP, Colon
Common Cathode, RHDP
Common Cathode, RHDP, Colon
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode

. High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
RHDP

Common Anode, RHDP
Common Anode, RHDP, Colon
Common Cathode, RHDP
Common Cathode, RHDP, Colon
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode

Typical Iv @ 20 rnA DC

No.
7-97

1355 "cd/seg

2750 "cd I seg

5400 "cd I seg

Common Anode, RHDP
Common Anode, RHDP, Colon
Common Cathode, RHDP
Common Cathode, RHDP, Colon
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode

Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity Overflow Indicator,

50B2-7620
50B2-7621
50B2-7623
50B2-7626

Yellow,
Yellow,
Yellow,
Yellow,

Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity and Overflow Indicator, RHDP

HDSP-3600
HDSP-3601
HDSP-3603
HDSP-3606

High Performance Green, Common Anode, LHDP
High Performance Green, Common Anode, RHDP
High Performance Green, Common Cathode, RHDP
High Performance Green, Universal Overflow Indicator, RHDP

7-6
- - - - - - - - - - - - - - - - - ------_._---_.- - - - - - - - - - - - - - ----

7-103

---------------------------------------------------

Red, High Efficiency Red, Yellow, and High Performance Green Seven
Segment LED Displays (continued)
Package

+

.

·: D

.

: U=d. '=0'IF
:0=0:
· .
~

~

• D

•

•

0

0

10.92 mm (.43")
Dual-in-line
.7S" H x .S" W x .2S" 0

[S
~"'I"++'"

90
=0

........ 0

14.2 mm (.S6")
Dual-in-Line (Single Digit)
.67" H x .49" W x .31" 0

Device
S082·n50
S082-n51
S082-77S6
S082-7760
S082-76S0
S082-76S1
S082-76S3
S082-76S6

High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
Indicator, RHDP

S082-7660
S082-7661
S082-7663
S082-7666

Yellow,
Yellow,
Yellow,
Yellow,

HDSP-4600
HDSP-4601
HDSP-4603
HDSP-4606
HDSP-5301
HDSP-5303
HDSP-S307
HDSP-S308
HDSP-S321
HDSP-S323

High Performance Green, Common Anode, LHDP
High Performance Green, Common Anode, RHDP
High Performance Green, Common Cathode, RHDP
High Performance Green, Universal Overflow Indicator, RHDP
Red, Common Anode, RHDP
Red, Common Cathode, RHDP
Red ±1, Common Anode, RHDP
Red ±1, Common Cathode, RHDP
Red, Common Anode, Dual Digit, RHDP
Red, Common Cathode, Dual Digit, RHDP

HDSP-SS01
HDSP-SS03
HDSP-SS07
HDSP-5S08
HDSP-SS21
HDSP-S523

High
High
High
High
High
High

HDSP-S601
HDSP-S603
HDSP-S607

High Performance Green, Common Anode, RHDP
High Performance Green, Common Cathode, RHDP
High Performance Green, Common Anode Overflow
Indicator, RHDP
High Performance Green, Common Cathode Overflow
Indicator, RHDP
High Performance Green, Common Anode, Dual Digit, RHDP
High Performance Green, Common Cathode, Dual Digit,
RHDP
Yellow, Common Anode, RHDP
Yellow, Common Cathode, RHDP
Yellow ±1, Common Anode, RHDP
Yellow ±1, Common Cathode, RHDP
Yellow, Common Anode, Dual Digit, RHDP
Yellow, 'Common Cathode, Dual Digit, RHDP

HDSP-S608

Bll

14.2 mm (.S6")
Dual-in-Line (Dual Digit)
.67" H x 1.0" W x .31" 0

Red,
Red,
Red,
Red,

Descrlpllon
Common Anode. LHDP
Common Anode, RHDP
Universal Polarity and Overflow Indicator, RHDP
Common Cathode, RHDP

HDSP-S621
HDSP-5623
HDSP-S701
HDSP-S703
HDSP-S707
HDSP-S708
HDSP-5721
HDSP-S723

Common Anode, LHDP
Common Anode,RHDP
Common Cathode, RHDP
Universal Polarity and Overflow

Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity and Overflow Indicator, RHDP

Efficiency Red, Common Anode, RHDP
Efficiency Red, Common Cathode, RHDP
Efficiency Red ±1, Common Anode, RHDP
Efficiency Red ±1, Common Cathode, RHDP
Efficiency Red, Common Anode, Dual Digit, RHDP
Efficiency Red, Common Cathode, Dual Digit, RHDP

7-7
--------------- ------ - - - - - - - - - - - - -

Typical Iv @ 20 rnA DC
1100 !Lcd/seg

Page
No.
7-103

6100 !Lcd/seg

4600 !Lcd /seg

38S0 !Lcd / seg

1300 !Lcd/seg

6300 !Lcd / seg

5600 !Lcd/seg

4200 !Lcd/seg

7-112

Red, High Efficiency Red, Yellow, and High Performance Green Seven
Segment LED Displays (continued)
Package

Ie
bJ

of'

Device
HDSP-3400
HDSP-3401
HDSP-3403
HDSP-3405
HDSP-3406
HDSP-3900
HDSP-3901
HDSP-3903
HDSP-3905
HDSP-3906

Description
Red, Common Anode, LHDP
Red, Common Anode, RHDP
Red, Common Cathode, RHDP
Red, Common Cathode, LHDP
Red, Universal Polarity Overflow Indicator, RHDP
High Efficiency Red, Common Anode, LHDP
High Efficiency Red, Common Anode, RHDP
High Efficiency Red, Common Cathode, RHDP
High Efficiency Red, Common Cathode, LHDP
High Efficiency Red, Universal Polarity Overflow
Indicator, RHDP

HDSP-4200
HDSP-4201
HDSP-4203
HDSP-4205
HDSP-4206

Yellow,
Yellow,
Yellow,
Yellow,
Yellow,

HDSP-B600
HDSP-B601
HDSP-B603
HDSP-B605
HDSP-B606

High
High
High
High
High

of'

.~ aa ai~
!

+

O~

20mm (.B")
Dual-in-Line
1.09" H x .7B" W x .33" D

Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Common Cathode, LHDP
Universal Polarity Overflow Indicator, RHDP

Performance Green,
Performance Green,
Performance Green,
Performance Green,
Performance Green,

Common Anode,' LHDP
Common Anode, RHDP
Common Cathode, RHDP
Common Cathode, LHDP
Universal Overflow Indicator,IRHDP·

Typical Iv @ 20 mA DC
1200 !,cd/seg

Page
No.
7-120

4BOO !,cd/seg

3400 !,cd/seg

3600 !,cd/seg

Solid State Display Options
Option

Description

Page
No.

Option S02
Option S20

Intensity and Color Selected Displays

7-135

High Ambient Light, High Efficiency Red, Yellow, and High Performance
Green Seven Segment Displays
Package

Device

. .
1"

0

U1-

:=a0!i?
0:
t

f

HDSP-3530

High Efficiency Red, Common Anode, LHDP

HDSP-3531

High Efficiency Red, Common Anode, RHDP

HDSP-3533

High Efficiency Red, Common Cathode, RHDP

HDSP-3536

High Efficiency Red, Universal Polarity Overflow Indicator,
RHDP

HDSP-4030

Yellow, Common Anode, LHDP

HDSP-4031

Yellow, Common Anode, RHDP

HDSP-4033

Yellow, Common Cathode, RHDP

HDSP-4036

Yellow, Universal Polarity Overflow Indicator, RHDP

HDSP-3600

High Performance Green, Common Anode, LHDP

HDSP-3601

High Performance Green, Common Anode, RHDP

HDSP-3603

High Performance Green, Common Cathode, RHDP

HDSP-3606

High Performance Green, Universal Overflow Indicator, RHDP

•

7.62 mm (.3")
Dual-in-Line
.75" H x .4" W x .18" D

Description

7-8

Typical Iv @ 100 mA Peak
1/5 Duty Factor

Page
No.

7100 !'cd/seg

7-127

7000 !,cd / seg
(90 mA Peak
1/3 Duty Factor)

High Ambient Light, High Efficiency Red, Yellow, and High Performance
Green Seven Segment Displays (continued)
Package
+

t

=ff.
: D~:
:0=0:
t

~

~

+

t

: a
+c:::J

0IF

+

tat
tOO

+

+

10.92 mm (.43")
Oual-in-Line
.75" H x .5" W x .25" 0

•

... -to +

~C:::::l.

+ +

~O

[)dJ

bg9 =0

........ 0

14.2 mm (.56")
Dual-in-Line
.67" H x .49" W x .31" 0

lBiD"
+

t

t
+

+

+

+

"0=0+

!

0

m

loa:
+

+

Description

Device

+

0+

20 mm (.8")
Dual-in-Line
1.09" H x .78" W x .33" 0

Efficiency Red,
Efficiency Red,
Efficiency Red,
Efficiency Red,

Common Anode, LHOP
Common Anode, RHOP
Common Cathode, RHOP
Universal Polarity Overflow Indicator, RHOP

Typical Iv @ 100 rnA Peak
115 Duty Factor

Page
No.

10900 ).tcd/seg

7-127

HOSP-3730
HOSP-3731
HOSP-3733
HOSP-3736

High
High
High
High

HOSP-4130
HOSP-4131
HOSP-4133
HOSP-4136

Yellow,
Yellow,
Yellow,
Yellow,

HOSP-4600
HOSP-4601
HOSP-4603
HDSP-4606

High Performance
High Performance
High Performance
High Performance

HDSP-5531
HDSP-5533
HDSP-5537
HDSP-5538

High Efficiency Red, Common Anode, RHOP
High Efficiency Red, Common Cathode, RHOP
High Efficiency Red ±1, Common Anode
High Efficiency Red ±1, Common Cathode

6000 ).tcd/seg

HDSP-5731
HDSP-5733
HDSP-5737
HDSP-5738

Yellow, Common Anode, RHOP
Yellow, Common Cathode, RHOP
Yellow, ±1, Common Anode
Yellow, ±1, Common Cathode

5500 ).tcd/seg

HDSP-5601
HDSP-5603
HDSP-5607
HOSP-5608

High
High
High
High

HDSP-3900
HOSP-3901
HDSP-3903
HDSP-3905
HOSP-3906

High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,

HDSP-4200
HDSP-4201
HOSP-4203
HDSP-4205
HOSP-4206

Yellow,
Yellow,
Yellow,
Yellow,
Yellow,

Common Anode, LHOP
Common Anode, RHOP
Common Cathode, RHOP
Common Cathode, LHOP
Universal Polarity Overflow Indicator, RHOP

7000 ).tcd / seg

HOSP-8600
HDSP-8601
HOSP-8603
HDSP-8605
HDSP-8606

High Performance Green, Common Anode, LHDP
High Performance Green, Common Anode, RHOP
High Performance Green, Common Cathode, RHDP
High Performance Green, Common Cathode, LHDP
High Performance Green, Universal Overflow Indicator, RHOP

5800 ).tcd/seg
(90 mA Peak
1/3 Outy Factor)

Common Anode, LHOP
Common Anode, RHOP
Common Cathode, RHOP
Universal Polarity Overflow Indicator, RHOP

Performance
Performance
Performance
Performance

Green, Common Anode, LHOP
Green, Common Anode, RHOP
Green, Common Cathode, RHOP
Green, Universal Overflow Indicator, RHOP

Green, Common
Green, Common
Green, Common
Green, Common

Anode, RHOP
Cathode, RHOP
Anode Overflow Indicator
Cathode Overflow Indicator

Common Anode, LHOP
Common Anode, RHOP
Common Cathode, RHOP
Common Cathode, LHOP
Universal Overflow Indicator, RHOP

7-9

5000 ).tcd/seg

6800).tcd/seg
(90 mA ~eak
1/3 Outy Factor)
7-112

9400 ).tcd/seg
(90 mA Peak
1/3 Duty Factor)
7000 ).tcd/seg

7-120

Hexadecimal and Dot Matrix Displays
Description

Device
nnnn

·...
··...···
·...· .

JLI'"U"'1.S"1

LJLJLJLJ

LJLJLJLJ

(A)

(B)
nnnn

~

·...
··...··
·...·

·...
···...···
.·...·

..:·.. ··

· ·· .

LJLJLJLJ

LJL..J'::-'LJ

(C)

nn

7.4 mm (.29")
4 x 7 Single
Digit
=-r:::t..rt.=

...
···...
·
··...·· .

LJLJLJLJ

(0)

J---v-l...rl..rl

·...
...·
··...
·
. ·

5082-7300
(A)

Numeric RHDP
Built-in Decoder IDriver I Memory

5082-7302
(B)

Numeric LHDP
Built-in Decoder IDriver IMemory

5082-7340
(C)

Hexadeci mal
Built-in Decoder/Driver/Memory

5082-7304
(D)

Over Range ±1

5082-7356
(A)

Numeric RHDP
Built-in Decoder IDriver IMemory

5082-7357
(B)

Numeric LHDP
Built-in Decoder IDriver IMemory

5082-7359
(C)

Hexadecimal
Built-in Decoder IDriver I Memory

5082-7358
(D)

Over Range ±1

HDSP-0760
(A)

Numeric RHDP
Built in Decoder IDriver IMemory

HDSP-0761
(B)

Numeric LHDP
Built in Decoder IDriver IMemory

HDSP-0762
(C)

Hexadecimal
Built in Decoder IDriver IMemory

(A)

1B)

nnr..,,,

·...
··...··
·...

nnnn

HDSP-0763
(D)

Over Range ± 1

·.

HDSP-0770
(A)

Numeric RHDP
Built in Decoder IDriver IMemory

LJLJLJLJ

LJLJLJLJ

(C)

(D)

HDSP-0771
(B)

Numeric LHDP
Built in Decoder IDriver IMemory

HDSp-Om
(C)

Hexadecimal
Built in Decoder IDriver IMemory

HDSP-0763
(D)

Over Range ± 1

HDSP-0860
(A)

Numeric RHDP
Built in Decoder IDriver IMemory

HDSP-0861
(B)

Numeric LHDP
Built in Decoder IDriver IMemory

HDSP-0862
(C)

Hexadecimal
Built in Decoder IDriver IMemory

HDSP-0863
(D)

Over Range ± 1

LJ

LJ

..:... ····
··

nn

7.4 mm (.29")
4 x 7 Single Digit
Package:
8 Pin Glass Ceramic
15.2 mm (.6") DIP

Package
8 Pin Epoxy
15.2 mm (.6") DIP

8 Pin Glass Ceramic
15.2 mm (.6") DIP

General Purpose Market
Test Equipment
Business Machines
Computer Peripherals
Avionics

··
·•

··
•
•
•

·•
High Efficiency Red
Low Power

High Efficiency Red
High Brightness

Yellow

7-10

Application

•
•

Page
No.
7-136

Medical Equipment
Industrial and Process
Control Equipment
Computers
Where Ceramic Package
IC's are required
High Reliability
Applications

7-140

Military Equipment
Ground Support
Equipment
Avionics
High Reliability
Applications

7-145

·
·
·

High Brightness
Ambient Systems
Cockpit. Shipboard
Equipment
High Reliability
Applications

··
··

Business Machines
Fire Control Systems
Military Equipment
High Reliability
Applications

Hexadecimal and Dot Matrix Displays (continued)
Device and Package
(See previous page)

Description

Application

Color

HDSP-0960
(A)

Numeric RHDP
Built in Decoder /Driver /Memory

HDSP-0961
(B)

Numeric LHDP
Built in Decoder/Driver/Memory

HDSP-0962
(C)

Hexadecimal
Built in Decoder /Driver /Memory

HDSP-0963
(D)

Over Range ± 1

High Performance
Green

·•
··

Business Machines
Fire Control Systems
Military Equipment
High Reliability
Applications

Page
No.
7-145

Monolithic Numeric Displays

attO
fiMVf

A

o:w
II

CXXDXnX)
~1XXXXXXXI0~Q

II ij

I.~I.
~'~'1iJ1 ~

Package

Description

Device
5082-7404

2.79 mm (.11") Red, 4 Digits
Centered D.P.

12 Pin Epoxy,
7.62 mm (.3") DIP

5082-7405

2.79 mm (.11") Red, 5 Digits,
Centered D.P.

14 Pin Epoxy,
7.62 mm (.3") DIP

5082-7414

2.79 mm (.11") Red, 4 Digits,
RHDP

12 Pin Epoxy,
7.62 mm (.3") DIP

5082-7415

2.79 mm (.11") Red, 5 Digits,
RHDP

14 Pi n Epoxy,
7.62 mm (.3") DIP

5082-7432

2.79 mm (.11") Red, 2 Digits,
Right, RHDP

12 Pin Epoxy,
7.62 mm (.3") DIP

5082-7433

2.79 mm (.11") Red, 3 Digits,
RHDP

Small Display Market
Portable/Battery
Power Instruments
Portable Calculators
• Digital Counters
• Digital Thermometers
• Digital Micrometers
Stopwatches
Cameras
Copiers

·•

··
·
·•
·

Page
No.
7-151

Digital Telephone
Peripherals
Data Entry Terminals
Taxi Meters

For further information ask for
Application Note 937.
I--

5082-7441

2.67 mm (.105") Red, 9 Digits,
Mounted on P.C. Board

50.8 mm (2") PC Bd.,
17 Term. Edge Con.

5082-7446

2.92 mm (.115") Red, 16 Digits,
Mounted on P.C. Board

69.85 mm (2.750")
PC Bd., 24 Term.
Edge Con.

5082-7285

4.45 mm (.175") Red, 5 Digits,
Mounted on P.C. Board. RHDP

50.8 mm (2") PC Bd.,
15 Term. Edge Con.

5082-7295

4.45 mm (.175") Red, 15 Digits,
Mounted on P.C. Board. RHDP

91.2 mm (3.59") PC Bd.,
23 Term. Edge Con.

2:fU!9:HH~~

I~I ~

Application

7-11

7-156

Hermetic Hexadecimal and Numeric Dot Matrix Displays
Device

LJ
Ll
LJ
· .
(AI

· .
(BI

·

.

Ie)

.....
·· ..

·.

E!J
nrr
(01

7.4 mm (.29"1
4 x 7 Single Digit

Description

Package

4N51
Numeric RHDP
4N51TXV
Decoder /Driver/Memory
M87157/00101ACX(1) TXV - Hi Rei Screened
(4N51TXVB)
(A)

8Pin Hermetic Built-in
15.2 mm (.6") DIP
with gold plated
leads

Application
0

0

0

4N52
Numeric LHDP Built-in
4N52TXV
Decoder /Driver /Memory
M87157/00102ACX(1] TXV - Hi Rei Screened
(4N52TXVB)
(B)

Military High Reliability
Applications
Avionics/Space Flight
Systems
Fire Control Systems

0

Ground Support,
Shipboard Equipment

0

Ground. Airborne. Shipboard
Equipment
Fire Control Systems
Space Flight Systems
Other High Reliability
Uses

Page
No.
8-30 .

4N54
Hexadecimal Built-in
4N54TXV
Decoder /Driver /Memory
M87157/00103ACX(1] TXV - Hi Rei Screened
(4N54TXVB)
(C)
4N53
4N53TXV
104ACX(1]
(4N53TXVB)

Character Plus/Minus Sign

TXV - Hi Rei Screened

(D)

HDSP-0781
(A)
HDSp·0781
TXV
HDSP-0781
TXVB
HDSP·0782
(BI
HDSp·0782
TXV
HDSp·0782
TXVB
HDSp·0783
(D)
HDSp·0783
TXV

Package:
8 Pin Glass Ceramic
15.2mm (6"1 DIP

HDSP-0783
TXVB

Truly Hermetic

HDSP-0784
(CI
HDSp·0784
TXV
HDSP·0784
TXVB
HDSP-0791
(AI
HDSP-0791
TXV
HDSP-0791
TXVB
HDSP-0792
(81
HDSP·0792
TXV

Numeric RHDP, Built·in
Decoder /Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157

High Efficiency Red.
Low Power

0
0
0

Numeric LHDP. Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D·87157

Overrange ± 1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157

Hexadecimal. Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157

Numeric RHDP, Built-in
Decoder /Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL·D-87157

High Efficiency Red.
High Brightness

0

..
0

Numeric LHDP. Built·in
Decoder /Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL·D-87157

HDSp·0792
TXVB
..
..
·.
[1] Military Approved and Qualified for High Reliability ApplicatIOns .

7-12

Ground. Airborne. Shipboard
Equipment
Fi re Control Systems
Space Flight Systems
Other High Reliability
Uses

8-38

Hermetic Hexadecimal and Numeric Dot Matrix Displays (cont.)
Oevice
HDSP-0783
(D)
(See previous page)

Gotor

Oescription

HDSP-0783
TXV

Overrange ±1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157

High Efficiency Red.
High
Brightness

Application
0

0
0
0

HDSP-0783
TXVB
HDSp·0794
(C)
HDSP-0794
TXV
HDSP-0794
TXVB
HDSP-0881
(A)
HDSP-0881
TXV
HDSP-0881
TXVB
HDSP-0882
(B)
HDSP-0882
TXV
HDSP-OBB2
TXVB
HDSP-0883
(D)
HDSP-0883
TXV

Hexadecimal. Buill-in
Decoder /Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157

Numeric RHDP. Buill-in
Decoder /Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157

Yellow

Numeric LHDP. Buill-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-B7157

Overrange ±1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Levet A MIL-D-87157

HDSP·0883
TXVB
HDSP-0884
(C)
HDSP-0884
TXV
HDSP·0884
TXVB

Hexadecimal, Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Levet A MIL-D-87157

7·13

Ground. Airborne. Shipboard
Equipment
Fire Control Systems
Space Flight Systems
Other High Reliability
Uses

Page
No.
8-38

Hermetic Alphanumeric Displays
Device

~~

HDSP-2010

L ___ .J

~~

HDSP-2010
TXV
HDSP-2010
TXVB
HDSP-2310
HDSP-2310
TXV

L___ J

L___ J

r----:

L__ .l

Description
3.7 mm(.15") 5 x 7 Four
Character Alphanumeric
Operating Temperature
Range: -40°C to +85°C
TXV Hi Rei Screened
TXVB Hi Rei Screened to
Level A MIL-D-87157
5.0 mm (.20") 5 x 7 Four
Character Alphanumeric

HDSP-2310
TXVB

12 Pin Ceramic 6.35 mm
(.25") DIP with untinted
glass lens

HDSP-2311

Operating Temperature
Range: -55°C to +85°C

[~]

Color
Red, Red Glass
Contrast Filter

..
•
•

Page
Application
Extended temperature
applications requiring
high reliability.
lID Terminals
Avionics

No.
8-46

For further information see
Application Note 1016.
Standard Red

•

··

Military Equipment
Avionics
High Rei Industrial
Equipment

8-52

Yellow

True Hermetic Seal

HDSP-2311
TXV

TXV - Hi Rei Screened

HDSP-2311
TXVB

TXVB - Hi Rei Screened
to Level A MIL-D-87157

HDSP-2312

High Eff. Red

HDSP-2312
TXV
HDSP-2312
TXVB
HDSP-2450

?
'- ___ .J

... _ _ _ .J

... ___ ...J

~

?
?
?
?
?=

HDSP-2450
TXV
HDSP-2450
TXVB

Operating Temperature
Range: -55°C to +85°C
6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
28 Pin Ceramic 15.24 mm
(.6") DIP

Red

··

True Hermetic Seal
HDSP-2451
HDSP-2451
TXV

TXV - Hi Rei Screened

Yellow

TXVB - Hi Rei Screened
to Level A MIL-D-87157

HDSP-2451
TXVB
HDSP-2452

High Efficiency Red

HDSP-2452
TXV
HDSP-2452
TXVB

7-14

•
•

Military Equipment
High Reliability
Applications
Avionics
Ground Support, Cockpit, Shipboard Systems

8-59

Flin-

FOUR CHARACTER
2.8Smm (0.112 inJ

HEWLETT

a.:~ PACKARD

SMART
ALPHANUMERIC DISPLAY

HPDL-1414

TECHNICAL DATA

JANUARY 1986

Features
• SMART ALPHANUMERIC DISPLAY
Built-in RAM, ASCII Decoder and
LED Drive Circuitry
• WIDE OPERATING TEMPERATURE RANGE
-40°C to +85°C
• FAST ACCESS TIME
160 ns
• EXCELLENT ESD PROTECTION
Built-in Input Protection Diodes
• CMOS IC FOR LOW POWER CONSUMPTION
• FULL TTL COMPATIBILITY OVER OPERATING
TEMPERATURE RANGE

VIL =0.8 V
VIH =2.0 V
• WAVE SOLDERABLE
• RUGGED PACKAGE CONSTRUCTION
• END-STACKABLE
• WIDE VIEWING ANGLE

Typical Applications
• PORTABLE DATA ENTRY DEVICES
• MEDICAL EQUIPMENT
• PROCESS CONTROL EQUIPMENT
• TEST EQUIPMENT
• INDUSTRIAL INSTRUMENTATION

Description

• COMPUTER PERIPHERALS

The HPDL-1414 is a smart 2.85 mm (0.112") four character,
sixteen-segment, red GaAsP display. The on-board CMOS
IC contains memory, ASCII decoder, multiplexing circuitry
and drivers. The monolithic LED characters are magnified by
an immersion lens which increases both character size and
luminous intensity. The encapsulated dual-in-line package
provides a rugged, environmentally sealed unit.

• TELECOMMUNICATION INSTRUMENTATION

The HPDL-1414 incorporates many improvements over
competitive products. It has a wide operating temperature
range, very fast IC access time and improved ESD
protection. The display is also fully TTL compatible, wave
solderable and highly reliable. This display is ideally suited
for industrial and commercial applications where a goodlooking, easy-te-use alphanumeric display is required.

Absolute Maximum Ratings
Supply Voltage, Vee to Ground ........... -0.5 V to 7.0 V
Input Voltage, Any Pin to Ground .... -0.5 V to Vee+0.5 V
Free Air Operating
Temperature Range, TA .............. -40°C to +85°C
Relative Humidity (non-condenSing) at 65° C ......... 90%
Storage Temperature, Ts .............. -40°C to +85°C
Maximum Solder Temperature, 1.59 mm (0.063 in,)
below Seating Plane, t<5 sec. . ................. 260°C

7-15

package Dimensions

> - - - - P I N 1 IDENTIFIER
PART NUII/SER
; - - DArE cooe (YEAR, WEEK)
/
,LUII/INOUS INTENSITY CATEGORY
."..~...".."...,.~".,.

PIN
NO.
1
2

FUNCTION
Os DATA INPUT
04 DATA INPUT

WRWRITE

3
4

4.10
(0.160)

AT ADDRESS INPUTS
Ao ADDRESS INPUTS

5
6

Vee

PIN
NO.

FUNCTION

7

GND

B

Do DATA INPUT

9
10

01 DATA INPUT
02 DATA INPUT

11

03 DATA INPUT

12

06 OAT A INPUT

NOTES'
1. UNLESS OTHERWise SPECIFIED THE ToLERANCE

ON All DIMENSioNS IS 0.25

mm (0.010 in.J.

2. DIMENSIONS IN mm {inchest.

Recommended Operating Conditions
Symbol

Min.

Nom.

Max.

Vee

4.5

5.0

5.5

Input Voltage High

VIH

2.0

Input Voltage Low

VIL

Parameter
Supply Voltage

I

Units
V
V

0.8

V

DC Electrical Characteristics Over Operating Temperature Range
TYPICAL VALUES
Parameter

Symbol

Units

-40°C

-20"C

25·C

85°C

Icc

rnA

90

85

70

60

Vcc=5.0V

rnA

1.8

1.5

1.2

1.1

Vcc=S.OV
BL=0.8V

p.A

23

20

17

12

Vee =5.0 V
VIN=0.8V

Icc 4 digits on (10 seg/dlgit)i1,21
Icc Blank

lec(SD

Input Current. Max.

hL

I

Test Condition

GUARANTEED MAXIMUM VALUES

25"C
Vee ""5.0 V

Maximum Over
Operating Temperature
Range
Vee =5.5 V

rnA

90

130

Icc(BU

rnA

2.3

4.0

Input Current, Max.

IlL

p.A

30

50

Power Dissipationl31

Po

mW

450

715

Parameter
Icc 4 digits on 110 seg/digitjI1,21

Icc Blank

Symbol

Units

Icc

Notes:
1. "'/0" illuminated in all four characters.
2. Measured at five seconds.
3. Power dissipation = Vee' lee 110 segJ.

7-16

--------------~--------

- - - --

--------.~------

AC Timing Characteristics Over Operating Temperature
Range at Vcc = 4.5 V
':'20"C

2SOC

70·C

Symbol

tMIN

tMIN

tMIN

Units

Address Setup Time

tAs

90

115

150

ns

Write Delay Time

two

10

15

20

ns

Write Time

tw

80

100

130

os

Data Setup Time

tos

40

60

80

ns

Data Hold Time

tOH

40

45

50

ns

Address Hold Time

tAH

40

45

50

·os

Parameter

Access Time

130

160

200

ns

Refresh liate

420-790

310-630

270-550

Hz

Optical Characteristics
Min.

Typ.

Units

0.4

1.0

mcd

Apeak

655

nm

Ad

640

nm

Off Axis Viewing Angle

±40

degrees

Digit Size

2.85

mm

Paraill/ller

Symbol

Test Condition

Peak Luminolls Intensity per digit,
8 segments on (character average)

Iv Peak

Vee "'S.OV
H.i;" illuminated in
all 4 digits.

Peak Wavelength
Dominant Wavelength

Timing Diagram

~K2.0V

~:
i-'---

0.8 V

'AS

_tAH--+

2,0 V

-/

_-twO---....I·

.

'w

~:

00-06

!---'DS-

7-17

0.8 V

I

[(20V
-, 0.8 V
-tOH-

Magnified Character Font
Description

Relative luminous Intensity
vs. Temperature
3.0

I-(O~O~~)-:I

'\

~

\

0;

fl\11/

15I~

2.0

\
"\.

"'"0z
:E
::
UJ

'L·Vl~1

>

~

"- r-....
'\

'.0

""'" ["'-.. -

a:

a

-40

-20

20

40

60

80

,00

TA - AMBIENT TEMPERATURE -lOCI

Electrical Description
Figure 1 shows the internal block diagram of the HPDL-1414.
It consists of two parts: the display LEOs and the CMOS IC.
The CMOS IC consists of a four-word ASCII memory, a 64word character generator, 17 segment drivers, four digit
drivers, and the scanning circuitry necessary to multiplex the
four monolithic LED characters. In normal operation, the
divide-by-four counter sequentially accesses each of the four
RAM locations and simultaneously enables the appropriate
display digit driver. The output of the RAM is decoded by the
character generator which, in turn, enables the appropriate
display segment drivers. Seven-bit ASCII data is stored in
RAM. Since the display uses a 64-character decoder, half of
the possible 128 input combinations are invalid. For each
display location where 05=06 in the ASCII RAM, the display
character is blanked.
Data is loaded into the display through the DATA inputs
(Os-Do), ADDRE~S inputs (A,-Ao), and WRITE (WRl. After a
character has been written to memory, the IC decodes the
ASCII data, drives the display and refreshes it without any
external hardware or software.
D ATA INPUTS (06-00)

DATA INPUTS
Seven bit ASCII data is entered into
(Do-Os, pins 1. 2. 8-12) memory via the DATA inputs.
ADDRESS INPUTS
(A,-Ao. pins 4 and 5)

Each location in memory has a
distinct address. ADDRESS inputs
enable the designer to select a
specific location in memory to store
data. Address 00 accesses the far
right display location. Address 11
accesses the far left location.

WRITE (WR, pin 3)

Data is written into the display when
the WR input is low.

Vee and GND
(pins 6 and 7)

These pins supply power to the
display.

~

6

0,,-0.
ADDR ESS INPUTS (A,-Ao)

The HPDL-1414 uses 12 pins to control the CMOS IC.
Figure 1 shows the effect these inputs have on the display.

05

2

WRITE

O.

-+.....

1;4.17
CHARACTER
OECODER

SEGMENT
ORIVEIIS

~

I

,,-

,-

II
WRITE

(iNA)

3f--3

,OF4
O~COOER

+4
INTERNAL
OSC.

r--

--ttr-

BLANK

COUII/TER

21----1

-

2
~
DIGIT
, OR IVERS ,

0-0

Figure 1. HPDL-1414 Internal Block Diagram

7-18

3

0

mmmm

WR

Al

L
L
L
L

L
L
H
H

H

X

Ao Oe
L
a

05

04

03

02

01

a

a

a

a

b
d

b
c
d

b
c
d

a
b
c
d

X

X

X

X

H
L
H

c
d

b
c
d

X

X

X

b

c

0& 0lG3DIG20lG10lGO
NC NC NG A
NG NC :a NG
NC r:: NC NC
n NC NC NC

a
b

c
d

X

Previously Written
Data

"a" = ASCII CODE CORRESPONDING TO SYMBOL" R"
NC = NO CHANGE

L = LOGIC LOW INPUT
H = LOGIC HIGH INPUT
X = DON'T CARE
Figure 2. Write Truth Table

using the HPDL -1414 with
Microprocessors
ADDRESS inputs (Al and Ao) are connected to microprocessor addresses Al and Ao. A 74LS138 may be used to
generate individual display WRITE signals. Higher order
microprocessor address lines are connected to the 74LS138.
The microprocessor write line must be wired to one of the
active low enable inputs of the 74LS138. Both figures are
formatted with address a being the far right display character.

Figures 3 and 4 show how to connect the HPDL-1414 to a
Motorola 6800 or an Intel 8085. The major differences
between the two circuits are:
1. The 6800 requires two latches to store the ADDRESS
and ASCII DATA information to increase the address
and data input hold times.
2. The 6800 requires a flip-flop to delay the display
WRITE signal to increase the address input setup time.

Os
Os

..E

MICRO PROCESSOR
DATA BUS

VMA

141..$373

O.

~o,

~O4
~ 0,
7
-0,
~ 0,

'"

,

4

6

5

74LS20

~2

'5
'2
9

D,

D,
D,

~~".

.{

'6

6
5
2

a,

~ £

OE

*
3

'-;4LS04

r

'!
+5
8 9 10 11

·l

.{

~
~

'3 a.

A3

8 0,

A

,

7 0,

6
1
02 - - - ' Ail

,

4

A

,

3

at
a.

at

~E

OE

1

'"

WFi

1414

3

74LS138

-a.s~A2
03~Al

A

WR A1 Ao
3 4 5

.,

~ Ez
o,.!.'L.2. e,

0,

8

9 10 11

---.?il' 0,
3

XXXf

17 D6 74LS313O$-

,.

",

8 9 '0
2 '2
...-0& 0, o~ 03 04 o~ D!--

,

8

2 '2

9 10 11

1

2 12

~
888B ~o
8BBB
8
B
8
B
BBBB
3~
~

74L$74 _ 6
CP
a

'+!

1 2 12

3P:
:1
i

13

ij

15

14

5
2

USED FOR HIGHER ORDER ADDRESS DECODING

Figure 3: Memory Mapped Interface for the 6800

7-19
- - - - - - -------------_._-----------------

A1 Ao

4

5

1414

Dz 03' !J,. Os D~

2

WR

3

1

AI .11.0
4 5

~4

WR .11.1 Ao
3 • 5

XXXD

D6
D5
D,
DATA LINES

D3

FROM
MICRO PROCESSOR

D2
D,
Do

8 9 10 11

1

2 12

8

9 10 11

1 2 12

8

9 10 11

1

2 12

BGGB BGGEl BGElEl

8

9 10 11

1 2 12

~~

GBBB

N:P,.I,~.L ~
~
~
WR A, Ao
XXXf
WR A1 A(l
WA At Ao
W'RA1 Ao
XXXO
3

-.-!..:

•

5

3

•

5

74"S13$

E,

~£2

.{----L

E3

3

12

----L

A,

i

13

----L- A,
---L Ao

ii

1

"

15

A,
Ao

*USE FOR HIGHER ORDER ADDRESS DECODING.

Figure 4. Memory Mapped Interface for the 8085

7-20

3

•

5

3

•

5

BITS

0 6 Os 04

o ,

03
O2
0,
DO

0
0
0
0

HEX

0

0

2

o

1. 1

3

,

0

0

4

,

0

,

5

0
0
0

, , ,, ,, , , ,, ,,
,
,
,
,

2

3

4

5

,

,
,
I

0
0

0

0

,,

0
0

II

0
0

:±J

0

0

0

0

6

gj

7

%& /
0 I 2 j Y 5 5 1
OJ R B [ ]] E F G
P Q R 5 T U V hi

(space)

,, ,, ,,, ,,,
,
,

0

0
0
0

0
0

B

9

0

0

0

< )
B g

B

A

*- +

/

0
0

0

C

°

0

-

E

F

/
~ ?

L -H I J I-< L M N 0
X YZ [ \ J A -

/

Figure 5. HPDL-1414 ASCII Character Set

Mechanical and Electrical
Considerations

soldering and Post Solder
Cleaning Instructions for the
HPDL-1414

The HPDL-1414 is a 12 pin dual-in-line package which can
be stacked horizontally and vertically to create arrays of any
size. The HPDL-1414 is designed to operate continuously
from -40° C to +85° C for all possible input conditions.
The HPDL-1414 is assembled by die attaching and wire
bonding the four GaAsP/GaAs monolithic LED chips and
the CMOS IC to a high temperature printed circuit board. An
immersion lens is formed by placing the PC board assembly
into a nylon lens filled with epoxy. A plastic cap creates an
air gap to protect the CMOS IC. Backfill epoxy environmentally seals the display package. This package construction
gives the display a high tolerance to temperature cycling.

The HPDL-1414 may be hand soldered or wave soldered
with SN63 solder. Hand soldering may be safely performed
only with an electronically temperature-controlled and
securely grounded soldering iron. For best results, the iron
tip temperature should be set at 315°C 1600° F). For wave
soldering, a rosin-based RMA flux or a water soluble organiC
acid lOA) flux can be used. The solder wave temperature
should be 245° C ±5° C 1473° F ±9° FI, and the dwell in the
wave should be set at 1 1/2 to 3 seconds for optimum soldering. Preheat temperature should not exceed 93°C 1200° F) as
measured on the solder side of the PC board.

The inputs to the CMOS IC are protected against static discharge and input current latchup. However, for best results,
standard CMOS handling precautions should be used. Prior
to use, the HPDL-1414 should be stored in anti-static tubes
or conductive material. A grounded conductive assembly
area should be used, and assembly personnel should wear
conductive wrist straps. Lab coats made of synthetic materials should be avoided since they may collect a static charge.
Input current latchup is caused when the CMOS inputs are
subjected either to a voltage below ground IVIN < ground) or
to a voltage higher than Vce IVIN > Vee), and when a high
current is forced into the input.

Post solder cleaning may be performed with a solvent or
aqueous process. For solvent cleaning, Allied Chemical
Genesolv DES, Baron Blakeslee Blaco-Tron TES or DuPont
Freon TE can only be used. These solvents are azeotropes of
trichlorotrifluoroethane FC-113 with low concentrations of
ethanol 15%1. The maximum exposure time in the solvent
vapors at boiling temperature should not exceed 2 minutes.
Solvents containing high concentrations of alcohols, pure
alcohols, isopropanol or acetone should not be used as they
will chemically attack the nylon lens. Solvents containing
trichloroethane FC-l11 or FC-112 and trichloroethylene
ITCE) are not recommended.
An aqueous cleaning process is highly recommended. A
saponifier, such as Kester Bio-kleen Formula 5799 or equivalent, may be added to the wash cycle of an aqueous
process to remove rosin flux residues. Organic acid flux
residues must be thoroughly removed by an aqueous cleaning process to prevent corrosion of the leads and solder
connections. The optimum water temperature is 60° C
1140°FI. The maximum cumulative exposure of the HPDL1414 to wash and rinse cycles should not exceed 15 minutes.

7-21
. _ - - - - - - - - - - _....

__ _ - .....

Optical Considerations/
Contrast Enhancement.
The HPDL-1414 display uses a precision aspheric immersion
lens to provide excellent readability and low off-axis distortion. The aspheric lens produces a magnified character
height of .2.85 mm (0.112 in,) and a viewing angle of ±40
degrees. These features provide excellent readability at distances of up to 1.5 meters (4 feet).
Each HPDL-1414 display is tested for luminous intensity and
marked with an intensity category on the side of the display
package. To ensure intensity matching for multiple package

applications, mixing intensity categories for a given panel is
not recommended.
The HPDL-1414 display is designed to provide maximum
contrast when placed behind an appropriate contrast
enhancement filter. Some suggested filters are Panelgraphic
Ruby Red 60, Panelgraphic Dark Red 63, SGL Homalite
H100-1650, Rohm and Haas 2423, Chequers Engraving 118,
and· 3M R6510. For further information on contrast
enhancement, see Hewletl-Packard Application Note 1015.

7-22

Flin-

HEWLETT

.:~ PACKARD

FOUR CHARACTER
4.1 mm (0.16 in.>
SMART
ALPHANUMERIC DISPLAY

HPDL-2416

TECHNICAL DATA

JANUARY 1986

Features
• SMART ALPHANUMERIC DISPLAY
Built-in RAM, ASCII Decoder, and LED Drive
Circuitry
• WIDE OPERATING TEMPERATURE RANGE
-400 C to +850 C
• VERY FAST ACCESS TIME
160 ns
• EXCELLENT ESD PROTECTION
Built-in Input Protection Diodes
• CMOS IC FOR LOW POWER CONSUMPTION
• FULL TTL COMPATIBILITY OVER OPERATING
TEMPERATURE RANGE
VIL =0.8 V
VIH =2.0V
• WAVE SOLDERABLE
• RUGGED PACKAGE CONSTRUCTION
• END-STACKABLE
• WIDE VIEWING ANGLE

Typical Applications
• PORTABLE DATA ENTRY DEVICES
• MEDICAL EQUIPMENT
• PROCESS CONTROL EQUIPMENT

Description
The HPDL-2416 has been designed to incorporate several
improvements over competitive products. It has a wide
operating temperature range, fast IC access time and
improved ESD protection. The HPDL-2416 is fully TTL
compatible, wave solderable, and highly reliable. This display
is ideally suited for industrial and commercial applications
where a good looking, easy-to-use alphanumeric display is
required.
The HPDL-2416 is a smart 4.1 mm (0.16 in) four character,
sixteen-segment red GaAsP display. The on-board CMOS
IC contains memory, ASCII decoder, multiplexing circuitry,
and drivers. The monolithic LED characters are magnified
by an immersion lens which increases both character size
and luminous intensity. The encapsulated dual-in-line
package construction provides a rugged, environmentally
sealed unit.

• TEST EQUIPMENT
• INDUSTRIAL INSTRUMENTATION
• COMPUTER PERIPHERALS
• TELECOMMUNICATION EQUIPMENT

Absolute Maximum Ratings
Supply Voltage, Vcc to Ground .......... -0.5 V to 7.0 V
Input Voltage, Any Pin to Ground ... -0.5 V to Vcc+0.5 V
Free Air Operating
Temperature Range, T A .............. -40° C to +85° C
Relative Humidity (non-condensing) at 65° C •....... 90%
Storage Temperature, Ts .............. -40°Cto+85°C
Maximum Solder Temperature, 1.59 mm (0.063 in.)
below Seating Plane, t < 5 sec. ................. 260° C

7-23

package Dimensions

Iri =1
~1i.~{09901

6.36 (0.250) TVP.

r~~
(~~~~) ~
L3210

1

=fo-i

15.03
10.6001

=-~

4.to REf.

(0.1001

i\

3

PART NUMBER
AND

-':---v ',,' ,"

e,.
(Or

l

L~PDl 2416

CODE

:~~

4.10 REF
(0.1.0)
•

YYWW Z

-~UUj[-T

PI~

• IDENTIfiER

PIN
NO.
1
2
3
4
5

LUMINOUS INTENSITY CATEGORY

"':J

0.51 ± .013 TVP
IM20±o.oOSI
.

O.2S;!;(l.13 TVP
10.010! o.OOS)
.

3

2,5410.1001 TYP.

6
7
8
9

FUNCTION
GE1 CHIP ENABLE

cr .. CHIP ENABLE
CLR CLEAR

CUE CURSOR ENABLE
CURSOR SELECT
Vim WRITE
ADDRESS INPUT
ADDRESS INPUT

co

Vee

NOTES:
1. UNLESS OTHERWISE SPECIFIED. THE
2. D)MeNSIONS IN mrn IINCHES).

TO~ERANCE

PIN
NO.
10
11
12
13
14
15
16

FUNCTION

GNO
00
0,
02
03
Os
Ds
04
B[

17

I.

DATA INPUT
DATA INPUT
DATA INPUT
DATA INPUT
DATA INPUT
DATA INPUT
DATA INPUT
DISPlA Y BLANK

ON ALL DIMENSIONS IS 0.254 mm 10.010 IN.)

ReCOmmended operating Conditions
Symbol

Min.

Nom.

Max.

Supply Voltage

Vee

4.5

5.0

5.5

Input Voltage High

VIH

2.0

Input Voltage Low

VIL

Parameter

Units

V
V

OB

V

DC Electrical Characteristics Over Operating Temperature Range
TYPICAL VALUES
Parameter
Icc 4 digits on (10 seg/digit,11.21
ICC CusorI2.3.41
ICC Blank
Input Current, Max.

Symbol

Units

-40°C

-20°C

2S0C

70"C

85"C

Test Condition

ICC

mA

100

95

85

75

72

Vec =5.0V

ICC ICUI

mA

147

140

125

110

105

Vcc=5.0V

.

Icc(Bl)

mA

1.85

1.5

IlL

pA

20

17

1.15

VCC=5.0V
BL = O.8V

14

VCC=5.0V
VIN ~O.8 V

GUARANTEED VALUES

Parameter
Icc 4 digits on (10 seg/digitll 1•21

Symbol

Units

25°C
Vee = 5.0 V

Maximum Over
Operating Temperature
Range
Vee ""5.5 V

Icc

mA

115

170

Icc Cursorl 2.3.41

ICC (CUJ

mA

165

232

Icc Blank

8.0

Icc (BU

mA

3.5

Input Current, Max.

IlL

pA

30

40

Power Dissipationl 51

PD

mW

575

910

Notes:
1. "'Io" illuminated in all four characters.

2. Measured at five seconds.
3. Cursor character is sixteen segments and DP on.

4. Cursor operates continuously over operating temperature range.
5. Power dissipation = Vee' Icc (10 segJ.

7-24

AC Timing Characteristics Over Operating Temperature
Range at Vcc = 4.5 V
Parameter

Symbol

-20°C
tMIN

25°C

70°C

~IN

~IN

Units

115

150

ns

15

20

ns

Address Setup Time

lAs

Write Delay Time

twD

90
10

Write Time

tw

80

100

130

ns

Data Setup Time

tDS

40

60

80

ns

Data Hold Time

tDH

45

50

ns

Address Hold Time

tAH

40
40

45

ns

Chip Enable Hold Time

tCEH

40

45

50
50

Chip Enable Setup Time

tCES

90

115

150

ns

Clear Time

tCLR

2.4

3.5

4.0

ms

130
420-790

160
310-630

200

ns

270-550

Hz

Access Time
Refresh Rate

ns

Optical Characteristics
Parameter

Symbol

Test Condition

Min.

Typ.

Units

Peak Luminous Intensity per digit,
8 segments on (character average)

Iv Peak

VCC= 5.0 V
";I''' illuminated in
all 4 digits.

0.5

1.25

mcd

Peak Wavelength

Apeak

655

nm

Ad

640

nm

Off Axis Viewing Angle

±50

degrees

Digit Size

4.1

mm

Dominant Wavelength

Timing Diagram

'n
r

I

teEs

I

2 0V
O.BV
.

~ov

I

O.B V

I

!--'C'HAo

A,

co

~:

-'~2.0V
...,

'AS

!--'AH-

,It
I

'----two

O.BV

r2.0V
O.8V

tw

I

~r

DO-D6

~20V
r ' O.BV

-'OS~

!---tOH-

7-25
~~~-

. . _ ..

_

..

_ ....

........... -.- ..

~-~-.-

.... -.

----------

Magnified Character
Font Description

Relativeluminous Intensity
vs. Temperature
3,0

I~(~:~g~)~I
a1

~

a2

Vi

f1\1/1

'LVl~1

:E

~

2.0

f\

'"::>o

z
;E

1'\

...
::>

~

1, 0

~

w
a:

......-5° REF.

0

d,

Electrical Description
Display Internal Block Diagram
Figure 1 shows the internal block diagram for the
HPDL-2416 display, The CMOS IC consists of a four-word
ASCII memory, a four-word cursor memory, a 64-word
character generator, 17 segment drivers, four digit drivers,
and the scanning circuitry necessary to multiplex the four
monolithic LED characters. In normal operation, the divideby-four counter sequentially accesses each of the four RAM
locations and simultaneously enables the appropriate display digit driver. The output of the RAM is decoded by the
character generator which, in turn, enables the appropriate
display segment drivers, For each display location, the cursor enable (CUEl selects whether the data from the ASCII
RAM (CUE = Q) or the stored cursor (CUE = 1) is to be
displayed. The cursor character is denoted by all sixteen
segments and the DP ON. Seven-bit ASCII data is stored in
RAM. Since the display utilizes a 64-character decoder, half
of the possible 128 input combinations are invalid. For each
display location where 05 = Os in the ASCII RAM, the display character is blanked, The entire display is blanked
when BL=O.
Data is loaded into the display through the data inputs (06Do). address inputs (A1, Ao)~hip enables (CE1, CE2).
cursor select (CU), and write (WR), The cursor select (CU)
determines whether data is stored in the ASCII RAM (CU =
1) or cursor memory (CU = 0), When CE1 = CE2 = WR = 0
and CU = 1, the information on the data inputs is stored in
the ASCII RAM at the location specified by the address
inputs (A1' AO)' When CE1 = CE2 = WR = 0 and CU = 0,
information on the data input, Do, is stored in the cursor at
the location specified by the address inputs (A1' Ao), If Do
= 1, a cursor character is stored in the cursor memory, If
Do = 0, a previously stored cursor character will be removed
from the cursor memory.

-40

-20

~

"'"i'-

20

40

~

60

80

TA - AMBIENT TEMPERATURE _ (CO)

Data Entry
Figure 2 shows a truth table for the HPDL-2416 display. Setting the chip enables (CE" CE2) to their low state and the
cursor select (CU) to its high state will enable data loading.
The desired data inputs (06-00) and address inputs (A1'
Ao) as well as the chip enables (CE1, CE2) and cursor
select (CU) must be held stable during the write cycle to
ensure that the correct data is stored into the display, Valid
ASCII data codes are shown in Figure 3. The display
accepts standard seven-bit ASCII data, Note that 06 = 05
for the codes shown in Figure 2. If 06 = 05 during the write
cycle, then a blank will be stored in the display, Data can
be loaded into the display in any order, Note that when A,
= Ao = 0, data is stored in the furthest right-hand display
location,

Cursor Entry
As shown in Figure 2, setting the chip enables (CE" CEz) to
their low state and the cursor select (CU) to its low state will
enable cursor loading. The cursor character is indicated by
the display symbol having all16 segments and the DP ON.
The least significant data input (Do). the address inputs
(A1, Ao), the chip enables (CE1, CE2),and the cursor select
(CU) must be held stable during the write cycle to ensure
that the correct data is stored in the display, If Do is in a
low state during the write cycle, then a cursor character
will be removed at the indicated location. If Do is in a high
state euring the write cycle, then a cursor character will be
stored at the indicated location, The presence or absence
of a cursor character does not affect the ASCII data stored
at that location. Again, when A, = Ao = 0, the cursor
character is stored in the furthest right-hand display
location.
All stored cursor characters are displayed if the cursor enable (CUE) is high. Similarly, the stored ASCII data words are
displayed, regardless of the cursor characters, if the cursor
enable (CUE) is low. The cursor enable (CUE) has no effect
on the storage or removal of the cursor characters within
the display. A flashing cursor is displayed by pulsing the
cursor enable (CUE)' For applications not requiring a cursor, the cursor enable (CU E) can be connected to ground
and the cursor select (CU) can be connected to Vee. This
inhibits the cursor function and allows only ASCII data to
be loaded into the display,

If the clear input (CLR) equals zero for one internal display
cycle (4 ms minimum), the data in the ASCII RAM will be
rewritten with zeroes and the display will be blanked. Note
that the blanking input (BU must be equal to logical one
during this time,

7-26

DATA INPUTS (06-0,)

6

4,7

DATA INPUT (Dol

ADDRESS INPUTS (A,-Ao I

ASCII
MEMORY

2

DO

-¥-r-

0,

,l
4x1

CURSOR MEMORY
\VRIT"

READ

BLANK

;=D-

p

2

.... ""1

CHIP ENABLES

(CE,

T

CE21

WRITE IWRI
CURSOR SELECT (W)
CURSOR ENABLE (CUE)

CLEAR IClRI

0

BLANK IBLI

8

3
" 4

COUNTER

r*~

SEGMENT
DRIVER

05

~r:>
r-¥- r----

2f.

CURSOR

WRlTE CLEAR RE,AO

2

64 ,17
CHARACTER
GEN"RATOR

10F4

DECODER

Lit--

DIGIT

2

DRIVER 1
0

BtAllR

r
Figure 1. HPDL-2416 Inlernal Block Diagram

7-27

~

m~mm

Display Clear

CE2) or write (WR) inputs. The ASCII data stored in the display and the cursor memory are not affected by the
blanking input. ASCII data and cursor data can be stored
even while the blanking input (BU is low. Note that while the
blanking input (BU is low, the clear (ClR) function is inhibited. A flashing display can be obtained by applying a low
frequency square wave to the blanking input (BU. Because
the blanking input IBU also resets the internal display multiplex counter, the frequency applied to the blanking input
(BU should be much slower than the display multiplex rate.
Finally, dimming of the display through the blanking input
(BU is not recommended.

As shown in Figure 2, the ASCII data stored in the display
will be cleared if the clear (ClR) is held low and the blanking input (8[) is held high for 4 ms minimum. The cursor
memory is not affected by the clear (CLR) input. Cursor
characters can be stored or removed even while the clear
(OLR) is low. Note that the display will be cleared regardless
of the state of the chip enables (OE" OE2). However, to
ensure that all four display characters are cleared, CLR
should be held low for 4 ms following the last write cycle.

Display Blank
As shown in Figure 2, the display will be blanked if the
blanking input (BU is held low. Note that the display will be
blanked regardless of the state of the chip enables IOE"

Function BL CLR
Write
Data
Memory
Disable
Data
Memory
Write
Write
Cursor

Clear
Cursor

Disable
Cursor
Memory

For fUl'lher application information please consult Application
Note 1026.

CUE

CU

CEI

CE2

WR

A1

Os

04

03

02

01

X

X

H
-OR-

L

L

L

H

X

H

L

L

L

a
b
c
d

a
b
c
d

a
b
c
d

a
b
c
d

a
b
c
d

a
b

X

L
L
H
H

~
L
H
L
H

06

L

X

X

X

X

X

X

L

X

X
X
X

X
X
X
X

X
X
X
X

X

H

X
X

X
X

X
X

X

X

X

X

X

X

X

X

X
X

X
X

H
H
H

X

X

X

L

X

X
X
X

X

X

X

X

X
X

X
X

L

L
L
l

X

H

X

H

H
X

L

L

L

X
X

l

X
X
H

L

X
H
X

Do 0lGlOIG20lG1DIGo
a
b

NC NC NC A
NC NC B NC
NO C NC NC
D NO NO NC

C

G

d

d

X

X

X

Previously Written
Data

X
X
X
X

X
X

H
H

NC NC NC
NC NO f!YJj NC
NO
NO NO
f!YJj NO NC NO

X

L

H
X
X

L
L
H
H

L
H

l
L
H

l
H
L

X

H

H

X

X

X

X

X

X

X

X

X
X

X

X
X

X

H

X

H

X
X

X

X
X
X
X

X
X

L
L
L
l

X

X

X

X

m

m

..

c-,

NC NC NC
r-, I" I
I I NC
NC NC
r-,
NC
,..-, 1 I NO NC
NO NC
~ J
Previously Written
Oursor
~-.1

NC

"a" = ASCII CODE CORRESPONDING TO SYMBOL" R"
NC = NO CHANGE
{j = CURSOR CHARACTER (ALL SEGMENTS ON)

L = LOGIC LOW INPUT
H = LOGIC HIGH INPUT
X = DON'T CARE

Figure 2a. Cursor/Data Memory Write Truth Table

Function Bt CtR

CUE

CU

OUE

H
H

H
H

L
H

X
X

X
X

X
X

X
X

Display previously written data
Display previously written cursor

Clear

H

L

X

x

X

x

X'

Clear data memory, cursor memory
unChanged

WR

0lG3

DIGO

'NOTE: CLR should be held low for 4 ms
following the last WRITE cycle to ensure
all data is cleared.
Blanking

l

x

x

X

X

X

X

~-,

r-~

L_J

L_J

Figure 2b. Displayed Data Truth Table

7-28

r-,

L_J

r-~

L_J

Blank display, data and cursor
memories unchanged.

If~:b5

o.
0
0

00

1

1
0

HEX

a

1

{,pace}

I

°2
0,

04

"j

a
0

1

a

1• 1

If 0

0

0
0
0

°3
BITS

2

3

1

0

0

4

1

a

1

5

oy
1

0';
1
0

1

0

<,. 2

,,\3/

4"

II

!r

gj

0

0

0

0

1

1
1

0
1

<~',:,

,sf]

1

1
0

1

1

a

a

1

,

1

1
0

0

a

1

1

0
1

1
0

1

0

8

... ~.,

A

0
1

a

~

1

1

a

9 *

< >

-

1

a

a

c

'+

/

1

°
-

-

1
1

1
0

1

E

F

1

/
~ ?

0 I 2 j y 5 5 l 8
- / L 1,[£]',;IN B [ I1 E F G PI I J K L M N D
P Q. Ri..r;?, T U V W X y Z [ \ J A ---i<

Figure 3. HPDL-2416 ASCII Character Set

Mechanical and Electrical
Considerations
The HDPL-2416 is an 18 pin dual-in-line package that can
be stacked horizontally and vertically to create arrays of
any size. The HPDL-2416 is designed to operate continuously from -40° C to +85° C all possible input conditions
including the illuminated cursor in all four character locations.
The HPDL-2416 is assembled by die attaching and wire
bonding the four GaAsP/GaAs monolithic LED chips and
the CMOS IC to a high temperature printed circuit board.
An immersion lens is formed by placing the PC board
assembly into a nylon lens filled with epoxy. A plastic cap
creates an air gap to protect the CMOS IC. Backfill epoxy
environmentally seals the display package. This package
construction provides the display with a high tolerance to
temperature cycling.
The inputs to the CMOS IC are protected against static
discharge and input current latchup. However, for best
results standard CMOS handling precautions should be
used. Prior to use, the HPDL-2416 should be stored in antistatic tubes or conductive material. During assembly a
grounded conductive work area should be used, and
assembly personnel should wear conductive wrist straps.
Lab coats made of synthetic material should be avoided
since they are prone to static charge build-up. Input current latchup is caused when the CMOS inputs are subjected
either to a voltage below ground (VIN < ground) or to a
voltage higher than Vee (VIN > Vee) and when a high current is forced into the input. To prevent input current
latchup and ESD damage, unused inputs should be connected either to ground or to Vee. Voltages should not be
applied to the inputs until Vee has been applied to the display. Transient input voltages should be eliminated.

soldering and Post Solder
Cleaning Instructions for the
HPDl-2416
The HPDL-2416 may be hand soldered or wave soldered
with SN63 solder. Hand soldering may be safely performed
only with an electronically temperature-controlled and
securely grounded soldering iron. For best results, the iron
tip temperature should be set at 315°C (600°F). For wave
soldering, a rosin-based RMA flux can be used. The solder
wave temperature should be 245°C ±5°C (473°F ±9°F),
and the dwell in the wave should be set at 1'/2 to 3 seconds
for optimum soldering. Preheat temperature should not
exceed 93°C (200° F) as measured on the solder side of the
PC board.
Post solder cleaning may be performed with a solvent or
aqueous process. For solvent cleaning, Allied Chemical
Genesolv DES, Baron Blakeslee Blaco-Tron TES or DuPont
Freon TE can only be used. These solvents are azeotropes
of trichlorotrifluoroethane FC-113 with low concentrations
of ethanol (5%). The maximum exposure time in the solvent
vapors at boiling temperature should not exceed 2 minutes.
Solvents containing high concentrations of alcohols, pure
alcohols, isopropanol or acetone should not be used as
they will chemically attack the nylons lens. Solvents containing trichloroethane FC-111 or FC-112 and trichloroethylene (TCE) are not recommended.
An aqueous cleaning process is highly recommended. A
saponifier, such as Kester-Bio-kleen Formula 5799 or equivalent, may be added to the wash cycle of an aqueous
process to remove rosin flux residues. Organic acid flux
residues must be thoroughly removed by an aqueous cleaning process to prevent corrosion of the leads and solder
connections. The optimum water temperature is 60°C
(140°F). The maximum cumulative exposure of the HPDL2416 to wash and rinse cycles should not exceed 15 minutes.

7-29

optical Considerations/
Contrast Enhancement
The HPDL-2416 display uses a precision aspheric immersion lens to provide excellent readability and low off-axis
distortion. The aspheric lens produces a magnified. character height of 4.1 mm (0.160 in,) and a viewing angle of ±50°.
These features provide excellent readability at distances up
to 2 metres (6 feet).
Each HPDL-2416 display is tested for luminous intensity
and marked with an intensity category on the side of the
display package. To ensure intensity matching for multiple

package applications, mixing intensity categories for a
given panel is not recommended.
The HPDL-2416 display is designed to provide maximum
contrast when placed behind an appropriate contrast
enhancement filter. Some suggested filters are Panelgraphic
Ruby Red 60, Panelgraphic Dark Red 63, SGL Homalite
H100-1650, Rohm and Haas 2423, Chequers Engraving 118,
and 3M R6510. For further information on contrast
enhancement, see Hewlett-Packard Application Note 1015.

7-30

- - - - - - - - - - - - - - - - --------,---------------

---~------

FOUR CHA:RAC~eR 3.8 mm (O.1s INCH)
5x7 ALPHANUMERIC DISPLAYS

r/i~ HEWLETT
~~ PACKARD

STANDARD RED
YEllOW
HIGH EFFICIENCY RED
HlqH,PI;RF,ORMANCE GRI;EN

HDSP-2000
HDSP-2001
HDSP-2002
HDSP'2003

TECHNICAL DATA

JANUARY 1986

Features
• FOUR COLORS
Standard Red
Yellow
High Efficiency Red
High Performance Green
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
• COMPACT CERAMIC PACKAGE
• WIDE VIEWING ANGLE
• END STACKABLE FOUR CHARACTER
PACKAGE
•
•
•
•

TTL COMPATIBLE
5 x 7 LED MATRIX DISPLAYS FULL ASCII SET
CATEGORIZED FOR LUMINOUS INTENSITY
HDSP-2001/2003 CATEGORIZED FOR COLOR

Typical Applications
•
•
•
•
•
•

Description
The HDSP-2000/-2001/-2002/-2003 series of displays are 3.8
mm (0.15 inch) 5 x 7 LED arrays for display of alphanumeric
information. These devices are available in standard red,
yellow, high efficiency red, and high performance green.

Package Dimensions
11.75MAK
(,f)9S}

,-

INDUSTRIAL PROCESS CONTROL EQUIPMENT
BUSINESS MACHINES
PROGRAMMABLE LEGEND SWITCHES
MEDICAL INSTRUMENTS
MILITARY GROUND SUPPORT EQUIPMENT
COMPUTER PERIPHERALS

Each four character cluster is contained in a 12 pin dual-inline package. An on-board SIPO (Serial-In-Parallel-Out)
7-bit shift register associated with each digit controls constant current LED row drivers, Full character display is
achieved by external column strobing,

l

......... SEE NQTE4

fP~:1 ~,~~~~i-, ~-,jPI,~,:, ~E,~~~l,4

"5

_ 6

COLUMN 4
COLUMN 5

-

-

-'0
11-

t

I'N~. CO.NN·ECT~ ~ '_-'2

CLOCK
GROUNDOATA IN

"00 NO'" CONNECT OR USE

t~~~~~ ~--l

NOTES;
1. OtMENS10tl/S1Nmm {tnChe$},

S.08
(,200}

2, UNLESS OTtlERWISE speC~ffEO THE
TOI.~RANCE ON At.l OlMENSlON$
1$ ,,3tl mm '''.01ij"'i
3, tEAD MAtERIAL IS
tOp-pef\: AlI,.O'V.

I

6;.86
1.2701

__,_J.
J

r

4, CHARACtEl'IS ARE CENtERED

WITH- RESP~CT TO 'lEAOS WntHN
'_13mtn [',{lOS").

2.54 ·,13 TVP,

(.100 ',005}
NON ACCUM,

7-31

Absolute Maximum Ratings (HDSP-2000/-2001/·2002/-2003)
Supply Voltage Vcc to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB . . . . . . . . . . . . . . . .. -0.5V to Vcc
Column Input Voltage, VCOL ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TA[I,2J ........ .-20° C to +85° C

Storage Temperature Range, Ts ..... -55°C to +100°C
Maximum Allowable Power Dissipation
at T A = 25° C[1 ,2,3J ....................... 1.24 Watts
Maximum Solder Temperature 1.59 mm (0.063 in I
Below Seating Plane t < 5 sec .. , ............. 260°C

Recommended Operating Conditions
(HDSP-2000/-2001/-2002/-2003)
Paramet"r
Supply Voltage
Data Oul Current. Low State
Data Out Current, High State
Column Input Voltage, Column On HDSP·2000
Column Input Voltage. Colum

Symbol

Min.

Nom.

Vee

4,75

5,0

=

IOL
IOIi
Veol
VeOl

~Tjme
Time
Width of Clock
Clock, Frequency
Clock Transition Time
Free Air Operating Temperature Range!1.21

2,4
2.75

70

thOld
tWlelock)

$0
15
0

1.6

mA
mA
V

3.5

4
4

V
ns
os

45
0

3
200
85

-20

Ffg:

V

$,5

tTHL

TA

Units

-05

t••top

f~jO<;k

Max.
5,25

1
1

1

ns
MHz
ns

1

"C

2

1

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified I

Symbol
Icc

Description
Supply Current

Column Current at any Column Inpul

leOL

Column Current at any Column Inpul
Va. Clock or Oata Input Threshold High
Va, Cloek or Data Input ThreshOld Low
Input Current logical 1

ICOL

Input Current Logical 0

I

va.Cloe:
10aiain

Oala Out Voltage
Power Dissipation Per Package"
Thermal Resistance Ie
JunctiOn·to-Caal)

Viii
VIL
IIIi

htl
hl
hI.
VOH
VOL

Po

Typ.'

Max.

Units

VB =OAV

45

60

rnA

=2.4V

73

95

mA

Test colic/llions

Vee=5.25V
VClOCK = VOATA

Min.

=2.4V

All SR Slages ;
Logical j
VCC =5.25 V
VCOL=3.5V
AU SR Stages Logical 1

=

Vs

VB= OAV

VB

~

2AV

Vce = VeOl = 4.75V
Vee

= 5.25V. Viii = 204V

Vee = S.25V. Vic

=OAV

Vee'"' 4.75V. 10H = ·0.5 rnA. ICOL "" 0 rnA
Vee'" 4.75V. 101.. '" 1.6 m,A, leoL = 0 mA
Vee"" 5.0V, VeOL = 3.5V, 17.5% OF
15 LEOs on per character, Va '" 2.4V

$35

• All typical values specified at Vee = S.OV and TA = 2So C unless
otherwise noted.

f'A

410

rnA

0.8

V
/iA
f'A
f'A
/iA
V

~:

-800

-250

2.4

4

V

2,0

-400

3.4
02

0.72
25

R8J-C

500

Fig.

004

V
W

"ClWf
Device

2
2

··Power dissipation per package with four characters illuminated.

Notes:
1. Operation above 8So C ambient is possible provided the
following conditions are met. The junction should not
exceed 12SoC TJ and the case temperature las measured
at pin 1 or the back of the display) should not exceed
100°C Te.

2. The device should be derated linearly above SO°C at lB.7
mW/oC. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at
3So C/W per device. See Figure 2 for power deratings based on
a lower thermal resistance.
3. Maximum allowable dissipation is derived from Vee = S.2SV.
VB = 2.4V. VeOL = 3.SV 20 LEOs on per character. 20% OF.

7-32

-----~~~

optical Characteristics
STANDARD RED HDSP-2000

Symbol
Iv Peak

Test Conditions
Vee'" 5.0V, VeOl = 3.5V
Ti = 25"cI 6), VB = 2.4V

Min.

TYP'*

Units

Fig.

200

/.lcd

3

7655
639

nm
nm

105

APEAK

I\d

Max:

YELLOW HDSP-2001
Descrlptij)n
Peak LtdRingy;>:,1ntensity per LE014.61
(Character Average)
P

Symbol
IvPeak

Test Conditions
Vee = 5.0V, VeOl = 3.5V
TI = 25°C(6), VB = 2.4V

Min.

Tyji-

400

Test Conditions
Vee = 5.pV, VeOL'" 3.SV
Ti = 25° C(6) , VB'" 2.4V

Max,

Units

Fig.

750

/Lcd

3

IVllri: Typ.* 'Max.

Units

1430

/.lcd

635
626

nm
nm

APEAK
Ad

HIGH EFFICIENCY RED HDSP-2002
Symbol
IvPeak
(7J

400

APEAK
Ad

3

HIGH PERFORMANCE GREEN HDSP-2003
DellcHptlon
Peak Luminous Intensity per LED14.81
(Character Average)
Peak Wavelength
Dornip?nt W1!y,elength[5.7)

Symbol
IvPeak

TesfeonClitions
Vee - 5.0V. VeOl - 3.5V
Ti 25° CIB), VB = 2.4V

=

Min.

Typ.*

850

Units

Fig.

1550

/Lcd

3

568
574

nm
nm

APEAK
Ad

'All typical values specified at Vce '" S.OV and TA = 25°C unless
otherwise noted.

"Power dissipation per package with four characters illuminated.

Notes:
4. The characters are categorized for luminous intensity with the
intensity category designated by a letter code on the bottom of
the package.
5. The HDSP-2001/-2003 are categorized for color with the color
category deSignated by a number code on the bottom of the
package.
6. Ti refers to the initial case temperature of the device immediately prior to the light measurement.

Dominant wavelength Ad, is derived from the CIE chromaticity
diagram, and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv (cd/m21 '" Iv (Candelal/A (Metrel 2
Lv (Footlambertsl = 1l'Iv (Candelal/A (Footl2
A = 5.3 X 10-8 M2 = 5.8 x 10-7 IFootl2
7.

Electrical Description

column 1 input is now enabled for an appropriate period of
time, T. A similar process is repeated for columns 2, 3, 4
and 5. If the time necessary to decode and load data into
the shift register is t, then with 5 columns, each column of
the display is operating at a duty factor of:

The HDSP-200X series of four character alphanumeric displays have been designed to allow the user maximum
flexibility in interface electronics design. Each four character display module features DATA IN and DATA OUT
terminals arrayed for easy PC board interconnection.
DATA OUT represents the output of the 7th bit of digit
number 4 shift register. Shift register clocking occurs on
the high to low transition of the clock input. The like
columns of each character in a display cluster are tied to a
single pin. Figure 5 is the block diagram for the displays.
High true data in the shift register enables the output
current mirror driver stage associated with each row of
LEOs in the 5 x 7 diode array.
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power consumption.
In the normal mode of operation, input data for digit 4
column 1 is loaded into the 7 on-board shift register locations 1 through 7. Column 1 data for digits 3, 2 and 1 is
similarly shifted into the display shift register locations. The

Max.

.

T

D.F. = 5 (t + T)
The time frame, t + T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on 1 at a
minimum rate of 100 times per second.
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:
1/[5 x (1001J

= 2 msec

If the device is operated at 3.0 M Hz clock rate maximum, it is
possible to maintain t «T. For short display strings, the duty
factor will then approach 20%.
For further applications information. refer to HP Application
Note 1016.

7-33

CLOCK
2.4V
SERIAL
DECODED
DATA
INPUT

CLOCK
0.4V

SERIAL
DECODED
DATA
OUTPUT

2.4V
DATA IN
O.4V
BLANKING
CONTROL
DATA OUT

Param.Utr

CoMlliQn Min. Typ. Max. Unit,

ftl-/;l-¢k

CLOCK Aate

3

MH.

125

os

ht~t, hHI

PrOpagation
delay CLOCK

C! '" 15pF
Rl"",2AKU

to DATA OUT

Figure 1. Switching Characteristics HDSP-2000/-2001/-2002/-2003
(TA ~ -20' C to +85' C)

5
COLUMN DRIVE INPUTS

Mechanical and
Thermal Considerations

Figure 5. Block Diagram of HDSP-2000/-2001/-2002/-2003

The HDSP-2000/-2001/-2002/-2003 are available in standard
ceramic dual-in-line packages. They are designed for
plugging into sockets or soldering into PC boards. The
packages may be horizontally or vertically stacked for
character arrays of any desired size. Full power operation
(Vee = 5.25V, VB = 2.4V, Veal = 3.5V) with worst case
thermal resistance from IC junction to ambient of 60° C/wattldevice is possible up to ambient temperature of 50° C. For
operation above 50°C, the maximum device dissipation
should be derated linearly at 16.7 mW/o C (see Figure 2).
With an improved thermal design, operation at higher
ambient temperatures without derating is possible.

Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning
processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning
processing for up to 2 minutes in vapors at boiling is
permissible. Suggested solvents include Freon TF,Freon
TE, Genesolv DI-15, Genesolv DE-15, and water.

Power derating for this family of displays can be achieved
in several ways. The power supply voltage can be lowered
to a minimum of 4.75V. Column Input Voltage, VCOl, can
be decreased to the recommended minimum values of 2.4V
for the HDSP-2000 and 2.75V for the HDSP-2001/-2002/2003. Also, the average drive current can be decreased
through pulse width modulation of VB. Please refer to HP
Application Note 1016 for further information.
The HDSP-2000/-2001/-2002/-2003 displays have glass
windows. A front panel contrast enhancement filter is
desirable in most actual display applications. Some
suggested filter materials are provided in Figure 6.
Additional information on filtering and constrast
enhancement can be found in HP Application Note 1015.
2.0
1 .•

~~

~~1

0

1.2
1.0

:!i1j
x_

0 .•

>;'"

0.6

cf~

h:;;Y;;;:'?o;);'T,;;;;;;i;;;:;;;:;;;;;;---j

illf-

-

r-

A'/J'" "'6(">CM/

105

HOSp·2003
(HPGreen,

Panelgraph,e
Green 48
Chequers Green

r--

I

I

I

MPC·Ol0l·S·12

101

Figure 6. Contrast Enhancement Fillers
500

~
I

0
Z

'./

W

>

00

>=

~

I

0.2
10

20

JO

40

50

a'"
z
"8:3

HDSP-i()Q'

2.0

:3

r- 1~"'ri"C~

0.4

~

" 0:

I

1.0

400

f-

3.0

!g

V

1/

~UJA' WCIW

, , ,

-~

PolarQid
HNCP10·Glass
Marks Polarized

Note: 1. Optically coated ci rcular polarized filters, such as
Polaroid HNCP10.

;;

I.?\ k"

Panelgraphlc
Gray 10
Chequer$ Grey

112

0;

,,0

IW

~I(m

>
f-

1.6

~~

~o

3M Light ContrOl

'.0

- I - -1--- . .

r-

1.'

~z

,,-

r;:;;:;;;;;:;;;;;;-t;;:;;;;7;;;;;-;;;;;;:---j PolarOId HNCP37

HOsPH2000

r:::::: ~

HDSP-2001
H'osP--2003

~'"
I

300

/)
HOSP..2OQO

I

--

1 1
1

IJHOSP-2001/·200Y-2003

200

100

'"
60

70

80

90 100

TA -AMBIENTTEMPERATURE-"C

Figure 2. Maximum Allowable Power
Dissipation vs. Temperature

·20

20

40

60

80

100

120

140

TJ - JUNCTION TEMPERATURE -"C

Figure 3. Relative Luminous Intensity
vs. Temperature

7-34

0

I&i
1.0

2.0

3.0

'.0

.. Veol -COLUMN VOLTAGE - VOLTS

Figure 4. Peak Column Current vs.
Column Voltage

5.0

FOUR CHARACTER 5.0 mm (0.20 INCH)
5x7 ALPHANUMERIC OISPLAYS

r/i~ HEWLETT
~~ PACKARD

HDSP-2300
HDSP-2301
HDSP-2302
HDSP-2303

STANDARD RED
YELLQW
HIGH EFFICIENCY RED
HIGH PERFORMANCE GREEN
':0t-'

,

TECHNICAL DATA

JANUARY 1986

Features
• FOUR COLORS
Standard Red
Yellow
High Efficiency Red
High Performance Green
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
• COMPACT CERAMIC PACKAGE
• WIDE VIEWING ANGLE
• END STACKABLE FOUR CHARACTER
PACKAGE
• TTL COMPATIBLE
• 5 x 7 LED MATRIX DISPLAYS FULL ASCII SET
• CATEGORIZED FOR LUMINOUS INTENSITY

Typical Applications
•
•
•
•
•

• HDSP-2301/2303 CATEGORIZED FOR COLOR

Description
The HDSP-2300/-2301 /-2302/-2303 series of displays are 5.0
mm (0.20 inch) 5 x 7 LED arraysfordisplay of alphanumeric
information. These devices are available in standard red,
yellow, high efficiency red, and high performance green.

AVIONICS
BUSINESS MACHINES
MEDICAL INSTRUMENTS
INDUSTRIAL PROCESS CONTROL EQUIPMENT
COMPUTER PERPHERALS

Each four character cluster is contained in a 12 pin dual-inline package. An on-board SIPO (Serial-In-Parallel-Out)
7-bit shift register associated with each digit controls
constant current LED row drivers. Full character display is
achieved by external column strobing.

package Dimensions
_ _ _ _ 20,01 MAX. - - - - - I

:a:S4 REF.
1.112)

~

PIN
1

I

----.-1

!T
8.43

SEE NOTE 3

. t

4
PIN 1 MAElK'D BY DOT ON
BACK OF PACKAGE
--->00

f

s.oa
.200}

t

~

2.54

J

(,1001

t

--11~~! .Q~)

I)
W

I
1.IOh.OO5) ~

2.54' .1'lTVP.

~ l~

I

6.6H270)

!

NON ACCUM.

7-35

FUNCTION

PIN

COLUMN 1

7

DATA OUT

COLUMN 2

B
9

~
Vee
CLOCK
GROUND
DATA IN

2
3

COLUMN 3

4
5

COLUMN 4
COLUMN 5

6

INT. CONNECT*

10
11
12

FUNCTION

'00 NOT CONNECT OR USE

NOTES,
1. DIMENSIONS IN rom {indl..}•
2. UNLESS OTHERWISE SPECIFIED THE
TOLERANCE ON ALL DIMENSIONS
IS t.38 """ (t.OII',")
:t CHARACTERS ARE CENTERED
WITH RESPeCT TO LEADS WITHIN
•. I3m.. 11.005"),

Absolute Maximum Ratings (HDSP-2300/-2301/-2302/-2303)
Maximum Allowable Power Dissipation
at TA = 25°Cll.2,31
HDSP-2300 .............................. 1.24 Watts
HDSP-2301/-2302/-2303 ................. 1.46 Watts
Maximum Solder Temperature is 1.59 mm (0,063 in)
Below Seating Plane t < 5 sec. . . . . . . . . . . . . . . .. 260° C

Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB .............. ... -0.5V to Vee
Column Input Voltage, VeOl ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TA[I.2] ........ -20°C to +85°C .
Storage Temperature Range, Ts ..... -55°C to +100°C

Recommended Operating Conditions
(HDSP-2300/-2301/-2302/-2303)
Parimeler
Supply Voltage
Data Out Current. low State
Dala Out Current, High State
Column Input Voltage, Column On HDSp-2300
Column Input Voltage, Column On HDSp-2301/-2302!-2303
Setup Time
Hold Time
Widih of Clock
Clock Frequency
Clock Transition Time
Free AIr Operating Temperature Rangel' ,2}

Symbol
Vee
10l
lOH
Veol
VCOl

Min.
4.75

tse1up

70
30

Ihold
'VIlClo",1
fcloCk

tTHl
TA

N'Om.

Units
V
mA
mA
V
V

Max.
S.25
1.6

50

-05
3,5

Fig.

45

ns

0

ns

4
7
1
1

ns

1

MHz
ns
"C

1

2.4
2,15

3,5

75
0

3

-20

200
S5

1

3,5

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified)

STANDARD RED

HDSP-2300

'OellCription
Supply Current

Symbol
icc

Column Current at any Column Input

leol

Column Current at any Column Input
Va, Clock or Dala Input ThresholdHigh
Ve, Clock or Data Input Threshold Low
Input Current Logical 1
Va, Clock
Data In
Input Current Logical 0
VB, Clock
Data In

teol

Data Out Voltage
Power DIssipation Per Package"
Thermal ReSistance IC
Junction·lo·Case

VIH
Vil

liH
hH

III
lil
VOH
VOL
PD

Vcc~5,2SV

VCLOCK = VOATA = 2.4V
Aft SR Stages ~
Logical 1
Vee =5,25 V
Veal =3.5V
All SR Stages ~ Logical 1

MaK.

~O,4V

45

60

mA

Va= 2.4V

13

95

mA

Va

Va=OAV

335

VB=2,4V

Vee = Vcm = 4.75V
~

5,25V, VrH

10
-500
-250

Vee = 5,25V, V,l = O,4V

=

RtlJ-C

/JA

410

mA
V
V

0,8

• 20

=2.4V

Vee = 4.75V, IOH -O,S mA, leoL = 0 rnA
VCC = 4.75V, IOl = 1,6 mA, teol - 0 rnA
Vee = 5,QV, VeOl = 3.5V, 17.S% Of
15 LEOs on per character, VB = 2.4V

500
2,0
..

Vee

Units Fi,

Typ,"

Min.

Test Conditions

2.4

3A
0.2

4

ti±-400
0,4

itA
V
V

0.72

W

2

25

·OIWI
Device

2

"Power dissipation per package with four characters illuminated.

'All typical values specified at Vee = 5.0V and TA = 25°C unless
otherwise noted.

Notes:
1, Operation above S5° C ambient is possible provided the
following conditions are met. The junction temperature should
not exceed 125°C TJ and the case temperature (as measureed
at pin 1 or the back of the display) should not exceed
100°CTc.

2, The HDSP-2300 should be derated linearly above 50° Cat 16,7
mW;o C. The HDSP-2301/-2302/-2303 should be derated linearly above 37°C at 16,7 mW/oC. This derating is based on a
device mounted in a socket having a thermal resistance from
case to ambient at 35°" C/W per device, See Figure 2 for
power deratings based on a lower thermal resistance,
3, Maximum allowable dissipation is derived from Vee = 5,25V,
Va = 2AV, Veol = 3.5V 20 LEDs on per character, 20% DF,

7-36

-------------------

YELLOW HDSP-2301/HIGH EFFICIENCY RED HDSP-2302/HIGH PERFORMANCE GREEN HDSP-2303

, DescHplfon

T p.'

MilK.

UnilS

VB -OAV

45

60

mA

VB~2AV

73

95

mA

500

p.A

80
40
·800
-400

p.A
p.A
Il A
p.A
V
V

Min.

Supply Current

VB~OAV

,iVe

='2,,4\1
20
10

Input Current Logical 0

Ill'
liL
VOH
VOL

Data Out Voltage
Power Dissipation Per Package"

Vee = 5.25V. VIL

·500,

OAV

·250',
2.4

Vee = 4ii)5V. 10H = ·0.PJnA.1COL."Q.,mA
Vee = 427SV, 10L = 1.11itnA. leOL =i:j'mA
Vee ~ S,OV, VC;PL = 3.5V. 17.5% OF
15 LEOs on pEir character. Va = 2AV

Po

Thermal Resistance IC
Junctlon·to·Case

~

Fig:

3A
0.2

ROJ-e

0,4

0.78

W

5

25

"C/WI
Device

5

Optical Characteristics
STANDARD RED HDSP-2300
Description
Peak Luminous Intensity per LED14,81
(Character Average)
Peak Wavelength
Q.pp1inant Wavelength[7]

Symbol
IvPeak

Test Conditions
Vee = 5.0V, VeOl - 3.5V
Ti = 25° C[6J, VB = 2.4V

Min:

TYp·'

Units

Fig;

130

300

,",cd

3

655

nm
nm

APEAK
Ad

Max.

639

YELLOW HDSP-2301
Symbol
Peak Luminous Intensity per LED14,81
(Character Average)
Peak Wavelength
Dqmin~nt Wavel

x
<

0.4

J:

0.2

•

'"

"'"z

0.6

,

ill

z

,.:3

~Hj

,

r

3.0

U

0

:;;£1

~~

~

>
r

1.0

°°

3
~",

~

'"
100
TJ - JUNCTION TEMPERATURE _·c

TA -. AMBIENT TEMPERATURE _·c

Figure 2. Maximum Allowable Power
Dissipation vs. Temperature

VCOl - COLUMN VOLTAGE - VOLTS

Figure 3. Relative Luminous Intensity
vs. Temperature

Figure 4. Peak Column Current vs.
Column Voltage

HDSp·2301/·2302/·2303
2.0

4.0

r--r-,.-,.-.---,.--.---;---,

1.8

~E
~~
-',

~~
:E-

;S
~~

~

1.6
3.0 1---+-+~I---+-+--l-+--1

1.4

1.2
1.0

2.0 ~:rl'=T""4''--+---+-+--l'---l

0.8

:Eo

''''
XW

j~

.,

400

'""u'"

300

ill
z

:E

:3
8

"~

0.6
0.4

I

200

100

~

0.2
0

500

0
TA -AMBIENT TEMPERATURE _·c

Figure 5. Maximum Allowable Power·
Dissipation vs. Temperature

TJ -JUNCTION TEMPERATURE _·C

Figure 6. Relative Luminous Intensity
vs. Temperature

7-38

VeOl -COLUMN VOLTAGE - VOLTS

Figure 7. Peak Column Current vs.
Column Vollage

Electrical Description

CLOCK

The HDSP-230X series of four character alphanumeric displays have been designed to allow the user maximum
flexibility in interface electonics design. Each four character display module features DATA IN and DATA OUT
terminals arrayed for easy PC board interconnection. DATA
OUT represents the output of the 7th bit of digit number 4
shift register. Shift register clocking occurs on the high to
low transition of the Clock input. The like columns of each
character in a display cluster are tied to a single pin. Figure
5 is the block diagram for the displays. High true data in
the shift register enables the output current mirror driver
stage associated with each row of LEDs in the 5 x 7 diode
array.
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power
consumption.
I n the normal mode of operation, input data for digit 4
column 1 is loaded into the 7 on-board shift register locations 1 through 7. Column data for digits 3, 2, and 1 is
similiarly shifted into the display shift register locations.
The column 1 input is now enabled for an appropriate
period of time, T. A similar process is repeated for columns
2,3,4 and 5. If the time necessary to decode the load data
into the shift register is t, then with 5 columns, each
column of the display is operating at a duty factor of:

SERIAL
DECODED
DATA
OUTPUT

SERIAL

DECODED
DATA
INPUT

BLANKING

CONTROL

COLUMN DRIVE INPUTS

Figure 8. Block Diagram of HDSP-2300/-2301/-2302/-2303

T

Pan-etgraphJc

D.F. = 5 (1+ T)
The time frame, t+ T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the mi nimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:

Dark Red 63
Ruby Red 60
Chequers Red 118

PleXlgla,,2423
Panetgfaprnc
(Vellow)

107

PolafO!d
3M Light ContrQI

f:llm

Pane!gtaphlC
Gray 10

HDSP·2002
(HER)

Panelgraphlc
Ruby Red 60
Chequers Red 112

CheqUefs Grey

105

Note 1
Potafoid

HNCP10·Glass

Matks- Potariled
MPC..QW'·2·22

HDSP-2003
(HP Green \

1/[5 x (100)1 = 2 msec

VeHow 21
Chequ€rS Amber

Pano'graph,c
Green 48
Chequer8- Green
07

P-olaroid

HNCP10·GI •••
Mark$ Polarized

MPC-OlO'·5·12

Nole: 1. Optically coated circular polarized filters, such as
Polaroid HNCP10.

If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t« T. For short display strings, the duty
factor will then approach 20%.

Figure 9. Conlrasl Enhancemenl Fillers

Forfurther applications information, refer to HP Application
Note 1016.

Mechanical and Thermal Considerations
linearly at 16.7 mW/oC (see Figure 5). With an improved
thermal design, operation at higher ambient temperatures
without derating is possible. Please refer to HP Application Note 1016 for further information.
The HDSP-2300 uses a lower power IC, yet achieves excellent readabilty in indoor ambient lighting. Full power
operation up to TA = 50° C (Vee = 5.25V, VB = 2.4V, VeOl =
3.5V) is possible by providing a total thermal resistance from
IC junction to ambient of 60°C/watt/device maximum. For
operation above 50° C, the maximum device dissipation
should be derated at 16.7 mW/oC/device (see Figure 2).

The HDSP-23001-2301/-2302/-2303are available in standard
ceramic dual-in-line packages. They are designed for plugging into sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character arrays
of any desired size. The HDSP-2301/-2302/-2303 utilize a
high output current IC to provide excellent readability in
bright ambient lighting. Full power operation (Vec = 5.25V,
VB = 2.4V, VeOl = 3.5V) with worst case thermal resistance
from IC junction to ambient of 60° C/watt/device is possible
up to ambient temperature of 37° C. For operation above
37°C, the maximum device dissipation should be derated

7-39

Power derating for this family of displays can be achieved in
several ways. The power supply voltage can be lowered to a
minimum of 4.75V.Column Input Voltage, VeOl, can be
decreased to the recommended minimum values of 2.6V for
the HOSP-2300 and 2.75V for the HOSP-2301/-2302/-2303.
Also, the average drive current can be decreased through
pulse width modulation of VB.

filter materials are provided in Figure 9. Additional information on filtering and constrast enhancement can be found in
HP Application Note 1015.
Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is
permissible. Suggested solvents include Freon TF, Freon
TE, Genesolv 01-15, Genesolv OE-15, and water.

The HDSP-2300/-2301/-2302/-2303 displays have glass
windows. A front panel contrast enhancement filter is desirable in most actual display applications. Some suggested

NOTE:
The HDSP-2301/-2302/-2303 are available in high intensity categories suitable for some applications where direct sunlight
viewing is required. For information on displays and filters for
sunlight viewable applications, contact your field salesman.

7-40

FOUR CHARACTER 5.0 mm (0.20 INCH)
5X7 ALPHANUMERIC DISPLAY FOR
SUNLIGHT VIEWABLE APPLICATIONS
YEI.\..OW HOSP-2381
HIGH EFF.!~.IENCY R.EO HOSP-2382
HIGH PE,gFORM~I}l~E"GREE,N HQ~P.~.~.~.B3
TECHNICAL DATA

JANUARY 1986

Features
• SUNLIGHT VIEWABLE UP TO 10,000
FOOTCANDLES
• THREE COLORS
Yellow
High Efficiency Red
High Performance Green
• COMPACT CERAMIC PACKAGE
• WIDE VIEWING ANGLE
• END AND ROW STACKABLE
• 5X7 LED MATRIX DISPLAYS FULL ASCII SET
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS

Typical Applications

• TTL COMPATIBLE

• COMMERCIAL AVIONICS - Cockpit displays,
fuel management and airborne navigational radio
systems

• CATEGORIZED FOR LUMINOUS INTENSITY
• HDSP-2381/-2383 CATEGORIZED FOR COLOR

• TEST AND GROUND SUPPORT FIELD
EQUIPMENT

Description

• INDUSTRIAL VEHICLES AND EQUIPMENT

The HDSP-2381/-2382/-2383 displays are designed for use in
applications requiring readability in bright sunlight. With a
proper contrast enhancement filter and heat sinking, these
displays are readable in sunlight ambients up to 10,000 footcandles. The character font is a 5.0 mm (0.20 inch) 5X7 LED
arrayfordisplaying alphanumeric information. These devices
are available in yellow, high efficiency red, and high performance green. Each four character cluster is packaged in a

• OTHER APPLICATIONS REQUIRING
READABILITY IN DIRECT SUNLIGHT
12-pin dual-in-line package. An on-board serial-in-parallelout 7-bit shift register associated with each digit controls
constant current LED row drivers. Full character display is
achieved by external column strobing.

package Dimensions
COLOR BIN
OATE CODE

2.84 REF.
1.112)

SEE NOTE 3

4.87 REF.
t.1921

f

8.43
1.332J

t

PIN 1 MARKED BY DOT
ON BACK OF PACKA(JE

'L

5.08

t

2.54
(.IOO)

,

2.54, .13 TYP.--I
<,100

1:

.005)

NON ACCUM.

LUMINOUS
INTENSITY
CATEGORY

5.00> .13
1.197' .005)

(.2001

I

{O.110:t 0.005)

;

b
jt

~JJU

r---

-:::I2701

l

,.27TYP.
(.0501
.54, .08
i.020± .0031

n
:

_1:1. .25'.00

3
4
5
6

'DO

FUNCTION
COLUMN 1
COLUMN 2
COLUMN 3
COLUMN 4
CLOUMN 5
INT. CONNECT·
NOT CONNECT OR

NOTeS; 1. DIMENSiONS IN mm
TYP.

~1.OlO± .0021
6.35:t .25
1.250' .0101

7-41

PIN 1
PIN
1
2

PIN
7
B
9
10
11
12

FUNCTION

DATA OUT
VB
Vee

CLOCK

GROUND
DATA IN

USE

(inches}.

2. UNlESS OTHERWISE SPECI FlED THE
TOLERANCE ON ALL DIM~NSIONS IS
1: .3a mm (± .015").
3. CHARACTERS ARE CENTEAEO WITH
RESPECT TO LEADS WITHIN
't

.13 mm (i ,005").

Absolute Maximum Ratings (HDSP-2381/-2382/-2383)
Supply Voltage Vee to Ground ••.....• -0.5 V to +6.0 V
Inputs, Data Out and VB ................ -0.5 V to Vee
Column Input Voltage, VeOl .......... ~0.5 V to +6.0 V
Free Air Operating Temperature
Range, TAll,2J •••..••••....•••.••... -20°C to +85°C
Storage Temperature Range, Ts ••••.. -55°C to +100°C

Maximum Allowable Package Dissipation
at TA = 25°Cll,2,3J
HDSP-2381/-2382/-2383 ••.•.•.....••.•.. 1.74 Watts
Maximum Solder Temperature 1.59 mm (0.063 in)
Below Seating Plane t<5 sec ..•••••••..••.••. 260° C

Recommended operating Conditions Over operating
Temperature Range (-20°C to +85°C) (HDSP-2381/-2382/-2383)
Symbol
Vee
IOL
IOH
VeOl

Parameter

Supply Voltage
Data Out Current. low State
Data Out Current, High State
Column Input Voltage, Column On HDSP-2381/-2382/-2383
Setup Time
Hold Time
Width of Clock
Clock Frequency
Clock TranSition Time
Free Air Operating Temperature Rangel1.2!

Min.

Max.

Nom.
50

4.75

525
16
-05
3.5

2,75

ISETUP

70

45

tHolD
tW(CLOCK)
fCLOCK
tTHl
TA

30

0

75
0

200

Fig;

OS

1
1
1
3

4
1
1

MHz

3

-20

Units
V
mA
mA
V
os
ns

.

os
·C

8S

Electrical Characteristics Over Operating Temperature Range
(-20°C to +85°C)
YELLOW HDSP-2381/HIGH EFFICIENCY RED HDSP-2382/HIGH PERFORMANCE GREEN HDSP-2383
Description
Supply Current

Symbol

Icc

Column Input Current (any Column Pin)

ICOl

Column Input Current (any Column Pin)
Ve. Clock Or Data Input Threshold High
Ve, Clock Or Data Input Threshold Low
Input Current Logical 1
Ve, Clock
Data In
Input Current Logical a
Ve. Clock
Data In

ICOl
VIH
Vil

Data Out Voltage
Power Dissipation Per Package"
Thermal Resistance IC
Junction-to-Pin

"Ii

hH
Irl
ItL
VOH
VOL
Po

Test Conditions
Vcc ~5.25V
VClOCK = VOATA. ~ 2.4V
All SR Stages =
Logical 1
Vee -5.25 V
VeOL ~3.SV
AJI SR Stages =logical 1

Ve~

Vee

~

S.2SV, VIH = 2,4V

Vee

~

5.2SV, VIL ; 0.4V

Typ.'

Units

0.4V

50

60

mA

90

100

mA

SOO

/lA

550

653

20

0.8
80
40

..aoO

mA
V
V
flA
pA
/lA

·400

~A

0.4

V
V

Vs=04V
Vs

~

2.4V

Vee - 4.75V. 101i; -0.5 mA, leal - 0 mA
Vee = 4.75V, IOl ~ 1.6 mA, leol = 0 mA
Vee - S.OV, VeoL - 3.SV, 17.5'10 OF
15 LEOs on per character. Vg '" 2,4V

2.0

2.4

10
·500
-250
3.4
0.2

1.05
10

= 25' C unless

Max,

VB = 24V

Vee ~ VeOl ~ 4.7SV

R8J-PIN

• All typical values specified at Vee = 5.0V and TA
otherwise noted.

Min.

W

'CIW!
Device

Fig.

4

2
2

"Power dissipation per package with four characters illuminated .

Noles:
1. The HDSP-2381/-2382/-2383 should be derated linearly above
50' Cat 24.3 mW/' C, based on a device mounted such that the
thermal resistance from IC junction to ambient is 45'C/W
110' C/W ROJ-PIN and 35' C/WPIN-AI. See Figure 2 for power
deratings based on lower thermal resistance mounting.

2. Operation above 50' C ambient is possible provided the following conditions are met. The junction temperature should not
exceed 125'C ITJ) and the temperature at the pins should not
exceed 100' CITe).
3. Maximum allowable dissipation is derived from Vee = 5.25 V,
Vs = 2,4 V, VeoL = 3.5 V, 20 LEOs on per character, 20% OF.

7-42

Optical Characteristics
YELLOW HDSP-2381
Sym601

Description
Peak Luminous Intensity per LED14.81
(Character Average j
Dominant Wav£1ie"ligth(5,7)
Peak Wavelength

IvPEAK

Test Contlillo9s
Vee - 5.0V. VeOl = 3,5V
Ti=25°C[6J, VB = 2AV

Min.
.2400

Ad
APE;AK

Typ.. Max.

Units

Fig.

3400

fLcd

3

~

nm
nm

HIGH EFFICIENCY RED HDSP-2382
Symbol

Description
Peak Luminous Intensity per LED14,81
(Character Average)
Dominant Wavelength(71
Peak Wavelength

l"PEAK

Test Conditions

Min.

Typ ..

Uhlts

Fig.

Vee - 5.0V, VeOl - 3.SV
Ti "" 25" Cle) , VB = 2.4V

1920

2850

!tCd

3

626
635

nm
nm

Ad
APEAK

Max.

HIGH PERFORMANCE GREEN HDSP-2383
Description

Symbol

Peak Luminous Intensity per LED14.81
(Character AVerage)
Dominant Wavelength[S.7j
Peak Wavelength
'AII typical values specified at Vee
otherwise noted.

IvPEAK

Uhlt&

Fig.

3000

!,cd

3

574

nm
nm

Test Conditions

Min.

TYp.'

Vee'" 5.0V, VeOl - 3.5V
Ti=25Q CI61, Vs= 2.4V

2400

Ad

588

APEAK

= 5.0V and TA = 25°C unless

Max.

"Power dissipation per package With four characters illuminated.

Noles:
4. These LED displays are categorized for luminous intensity with
the intensity category designated by a letter code on the bottom
of the package.
.
5. The HDSP-2381!-2383 are categorized for color with the color
category designated by a number code on the bottom of the
package.
6. TI refers to the initial case temperature of the device immediately prior to the light measurement.

7-43

7. Dominant wavelength Ad, is derived from the CIE chromaticity
diagram, and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv (cd!m 21 = Iv (Candelal! A (Metrel 2
Lv (Footlambertsl = 11'Iv (Candelal! A (Footl 2
A = 5.3 x 10-8 M2 = 5.8 x 10-7 (Footl 2

2.4V

CLOCK
0.4V

Parameter

2.4V

fCLOCK

Condition Min. Typ. Max. Units

CLOCK Rate

DATA IN
0.4V

3

MHz

125

ns

tPLH. tPHL

Propagation
delay CLOCK
to DATA OUT

2.4V

DATA OUT
0.4V

C L = 15pF
RL=2.4KO

Figure 1. Switching Characteristics HDSP-2381/-2381/-2383 (TA = _20 0 C to +850 C).

2.0

2.0

w

-'

",I-

~~
-,;;
-'2

"'0

1.8
1.74
1.6

'RilJi" 45"C"":"""

1.4

RfIJA"

44"CMl./

1.2
1.0

,.

"1

in

:;;

•

i>\

'\

~o

;;;

I
I

U>

1.0

;;;

I

3

0.6

>

a.'

~a:

w

j:

0.2

a

1.25

=>

0
2

I

O.S

a

1.50

I-

~;,:

f~

1.75

I-

'0,

ROJA" 23'C!W"'/

:;oj:

=>'"
~~
xu>
~c
a:
xw

I''V w

0.75
0.50
0.25

a
10

20

TA -

30

40

50

60

70

80

·40

90 100

Figure 2. Maximum Allowable Power Dissipation vs.
Ambient Temperature as a Function 01 Thermal
Resistance Ie Junction to Ambient Air. RBJA.

600

'"

I

/

500

{

I-

:;;
a:
a:

400

=>

"2

:;0

3
8

'"
~
I

300

1

200

'00

-'

.?

f-

a

a

L/

1.0

Veol. -

20

40

60

80

100

120

DEVICE PIN TEMPERATURE - °C

Figure 3. Relative Luminous Intensity vs. Device Substrate
(PIN) Temperature.

E
I

·20
TpJN -

AMBIENT TEMPERATURE - °C

2.0

3.0

4.0

5.0

6.0

COLUMN VOLTAGE - VOLTS

Figure 4. Peak Column Current vs. Column Voltage.

7-44

------------------------- - - - - - - - - - - - - - - - - - - - - - -

Electrical Description
The electrical configuration of the HOSP-238X series alphanumeric displays allows for an effective interface to a
microprocessor data source. Each display device contains
four 5x7 LED dot matrix characters and two integrated circuits, as diagrammed in Figure 5. Thetwo integrated circuits,
with TTL compatible inputs, form a 28 bit serial-in-parallelout column data shift register. The data input is connected to
shift register bit position 1 and the data output is connected to
bit position 28. The shift register parallel outputs are connected to constant current sinking LED row drivers that sink a
nominal 19.6 mAo A logic 1 stored in the shift register enables
the corresponding LED row driver and a logic 0 stored in the
shift register disables the corresponding LED row driver.

The light output of the display may be dimmed by pulse width
modulating (PWM) the blanking input VB, with the brightness being in direct proportion to the LED on-time. When the
blanking input is at logic high the display is illuminated and
when the blanking input is at logic low the display is blanked.
These displays may be dimmed by PWM on the order of a
2000:1 change in brightness while maintaining light output
and color uniformity between characters.

Column data is loaded into an on-board shift register with
high to low transitions of the Clock input. To load character
information into the display, column data for the character 4
is loaded first and the column data for character 1 is loaded
last in the following manner: The 7 data bits for column 1,
character 4 are loaded into the on-board shift register. Next,
the 7 data bits for column 1, character 3 are loaded into the
on-board shift register, shifting the character 4 data over one
character position. This process is repeated until all 28 bits of
column data are loaded into the on-board shift register. Then,
the column 1 input is energized to illuminate column 1's in all
four characters. The procedure is repeated for columns 2, 3, 4
and 5.

T
OF= 5(t+T+TB)

The LED on-time duty factor, OF, may be determined when
the time to load the on-board shift register, t, the column
on-time without blanking, T, and the time display is blanked,
TB, are known:

Where: 5(t + T+ TB) is 1/column refresh rate
The column driver inputs should be strobed at a refresh rate
of 100 Hz or faster to achieve a flicker free display. The value
of OF approaches 20% when TB = 0 and t is very small
compared to T.
For information on interfacing these displays to microprocessor data sources and techniques for intensity control,
see Application Note 1016.

COLUMN DRIVE INPUTS

1

COLUMN
2 3 4 5

I

U

I I I

Li

I I

~'>

I I I

~'>

~

~

~

I~

lI:

'lI:"
'"

I

1

~

I~

:A

~

LEO
MATRIX
2

r-;

LED
MATRIX
3

~

rv

lEO
MATRIX
4

~:~~

BLANKING

CONTROL, VB

SERIAL
DATA

INPUT

-

1 2

3 4 5
ROWS

a

I

7

ROWS 1-7

I

J
ROWS 17

ROWS 1-7

J

CONSTANT CURRENT SINKING lEO DRIVERS

1 2 3 4 5

I

6 1

~s
ROWS 8-'4

2S 2S
ROWS1s..2!

2a-BIT 51PO SHifT REGIST5R

r-.

r

CLOCK

Figure 5. Block Diagram of an HDSP-238X Series LED Alphanumeric Display.

7-45

ROWS 22-28

SERIAL

r---- DATA

OUTPUT

Power Dissipation and Low Thermal Resistance Design
Considerations
The light output of the HDSP-238X devices is a function of
temperature, decreasing 1.5% for each 10 C increase in junction temperature. Therefore, it is desirable to maintain as low
device junction temperature as possible to insure sufficient
light output for sunlight readability. This is preferably
achieved by designing for a low junction to ambient thermal
resistance, or alternatively by controlling total display power
dissipation by derating, see data sheet Figure 2.

Power Dissipation Calculation:
Power disSipation may be calculated using the equations of
Figure 6a. For typical applications, the average pixel count
per character is 15. The maximum power dissipation is calculated with a pixel count of 20 per character. As demonstrated
in Figure6c, the maximum power dissipation is 1.741 W with
DF=20%, Vee=5.25 Vand Veol =3.5 V. The average power
dissipation is 1.161 W per device with DF = 20%, Vee = 5.0 V
and Veol = 3.5 V.
As shown in Figure 4 on the data sheet, the column current,
leol, is constant when the column input voltage, Veol, is at
2.75 V or greater. Setting Veol substantially greater than 2.75
V does not increase light output, but does add to device total
power dissipation. For optimum performance, it is recommended that Veol be set between 2.75 V and 3.5 V.

Junction Temperature and Device Thermal Resistance:
It is necessary to control the IC junction temperature, TJ(lC),
to insure proper operation of the display:
T J(lC)MAX = 125° C
The equations to calculate TJ(lC) are given in Figure 6b.
TJ(lC) will be higher than the device substrate temperature
where as the individual LED pixel junction temperatures,
T J(LED), will be nearly the same as the substrate temperature.
A sample calculation is presented in Figure 6c.

2. Install a metal plate, or bar, between the display packages
and the PC board, with the bar mechanically fastened to
the chassis, as illustrated in Figure 9a.
For multiple display lines, a metal plate may be placed
between the display packages and the PC board to conduct
the heat to the chassis housing assembly. The metal plate
may be electrically insulated from the PC board by a thermally conductive insulator. Heat sink bars are formed in the
metal plate by milling out lead clearance slots. The ceramic
package of a display rests on one of the heat sink bars with
the device leads passing through the slots to make electrical
contact with the PC board. The heat is transferred from the
display ceramic package into the metal plate. The chassis
housing acts as the thermal radiator to diSSipate the heat into
the surrounding environment. The metal plate must be
mechanically fastened to the housing assembly, otherwise it
will act only as a thermal capacitor and will not dissipate the
heat.
3. Install a heat pipe between the display packages and the
PC board, with the heat pipe mechanically fastened to the
chassis housing, as shown in Figure 9b.
The heat pipe is a low mass alternative to the metal plate
described above. A heat pipe is a small tube, filled with a
chemical, that transfers heat from the source to a heat sink
with minimal thermal impedance. It is not a heat sink. The heat
pipe transfers the heat directly from the display ceramic package to the chassis housing which diSSipates the heat into the
surrounding air.
4. Utilize a heat pipe to transfer the heat from a maximum
metalized PC board to a finned heat sink mounted on the
back of the assembly housing, as shown in Figure 10.
The heat pipe is placed against the back side of a maximum
metalized PC board, electrically isolated by a thermally conductive insulator. When the heat pipe is connected to a finned
heat sink on the back of the chassis housing, PC board to
external ambient thermal resistance values in the range of 10
to 15° C/W per device can be achieved. The heat generated by
the displays is directly dissipated into the external ambient
surrounding the chassis housing by the finned heat sink.

An easy design rule is to obtain a IC junction to ambient
thermal resistance, ROJ- A, that establishes the device pin
temperature less than 100°C. The value of ROJ- A = 23°C/W
will permit device operation in an ambient temperature of
85° C, without derating. Figure 7 gives the maximum values for
ROJ_A for reliable device operation in ambient temperatures
from 25° C to 85° C.
To achieve a low value of RO PIN - A' the following deSigns may
be incorporated into the display system:

Contact the following manufacturers for information on:
Heat Pipe Technology:

1. Mountthe displays on a double sided maximum metalized
PC board, as illustrated in Figure 8.

Noren Products
3545 Haven Avenue
Menlo Park, CA 94025
(415) 365-0632

For Single line display assemblies, a double sided maximum
metalized PC board is a cost effective way to achieve a low
thermal resistance to ambient. "Lands" are used instead of
"traces" as the current carrying elements. Each "land" is
made as wide as possible, consistent with circuit layout restrictions, to achieve metalized· surface area to radiate
thermal energy. Isolation strips, 0,64 mm (0.025 inch) wide,
are etched from the board to electrically isolate the lands. PC
board thermal resistance values in the range of 35°C/W per
device are achievable for single line display assemblies. Air
flow across the display PC board assembly diSSipates the
heat.

Thermally Conductive Insulators; "Sil-Pad":
Bergquist Company
5300 Edina Indl Blvd.
Minneapolis, MN 55435
(612) 835-2322

7-46

PO = P(lcd + P(IREF) + P(lcoL!; Total power dissipation
per device.
Where: P(lcd = ICcCVB= 0.4 V)· Vcc; Power
dissipated by the two ICs when the
display is blanked.
Device Maximum Power Dissipation:

P(IREF) = 5· [Icc (VB = 2.4 V) - Icc (VB =
0.4 V)] • V cc • (n/35) • OF; Additional
power dissipated by the two ICs with
characters illuminated.

IC Maximum Power Dissipation:
P(lcd = (0.060A) (5.25 V) = 0.315 W
P(I REF) = 5(0.100A - 0.060A)
(5.25 V) (20/35) (1/5) = 0.120W

P(lcoL! = 5· ICOl' Vcodn/35)' OF; Power dissipated by the LED pixels when the
characters are illuminated.

ICOl Power Dissipation:
PClcoLl = 5(0.653A) (3.5 V) (20/35) (1/5) =
1.306 W

n = 15 pixels per character for
average power.

Device Maximum Power Dissipation:

n = 20 pixels per character for
maximum power.

PD(MAX) = 0.315 W + 0.120 W + 1.306 W =
1.741 W
IC Junction Temperature, T A = 85° C:

Figure 6a. Equations for Calculating Device Power Dissipation.

IC Junction Temperature Rise Above Substrate
Pin:
Della T J(IC) = (10° C/W) (1.741 W) = 17.4°C Rise
Della T J (IC) = ROJ-PIN . PO; IC junction temperature
rise above device pin temperature.

Device Pin Temperature Rise Above Ambient:
Della T(PIN) = (13°C/W) (1.741 W) = 22.6°C Rise

Where: RO J_PIN = 10°C/W; The thermal resistance IC
junction to device pin 1.

IC Junction Temperature:
T J(IC) = 85° C + (17.4° C + 22.6° C) = 125.0° C

Delta T PIN = RO PIN _A ' PO; Device pin temperature
rise above the ambient temperature, T A'
Where: ROPIN_A = The thermal resistance, device pin to
ambient through the PC board, on a
per device basis.
T J (IC) = T A + [Delta T J (IC) + Della T PIN]; IC
junction temperature, the sum of the
ambient temperature and the
temperature rise above ambient.

Note:
Icc and ICOL values taken from the data sheet Electrical
Characteristics. ROJ-PIN = 10° C/W and ROPIN-A = 13° C/W.

,Figure 6b. Equations for Calculating Ie Junction

Figure 6c. Sample Calculation of Device Maximum Power
Dissipation and IC Junction Temperature for an
HDSP-238X Series Device Operating in an
Ambient of T A = 85° C.

60
5755
50

l'

"

45

~
~

x

"
J
a:
:;

40

~

35

I.......
I'

30

l"-

25
2320
15
10

0

25

35

45

55
TA

65

75

85

_oc

Figure 7. Maximum Thermal Resistance Ie Junction to Ambient, ROJ_A. vs. Ambient Temperature.
Based on: PD MAX. = 1.741 W, T J (IC) MAX. = 125° C.

7-47

"LAND", CURRENT CARRYING
ELEMENT

f

o.5 OUNCE COPPER
METALIZATION

n,.,j"T"'l"---

0

0

Figure 8. Maximum Metalized PC Board, Double Sided, for Mounting HDSP-238X Series Displays.

CHASSIS HOUSING
HDSP-238X SERIES DISPLAYS

METAL PLATE
CHASSIS MOUNTING BRACKET

Figure 9b. Heat Pipes Mounted Between Display Devices
and PC Board, Mechanically Fastened to
Chassis Housing.

Figure 9a. Metal Plate Mounted Between Display Devices
and PC Board, Mechanically Fastened to
Chassis Housing.

DISPLAY PC BOARD WITH MAXIMUM BACK
SURFACE METALLIZATION

"SIL-PAD"
THERMAL CONDUCTIVE,
ELECTRICAL INSULATING

FINNED
HEAT SINK MOUNTED
ON BACK OF CHASSIS HOUS,ING

MOUNTING FLANGE, HEAT PIPE
TO DISPLAY PC BOARD

Figure 10. Using a Heat Pipe to Transfer Display Generaled Heat 10 an Externally MounledFinned Heal Sink.

7-48

Contrast Enhancement
The high light output of the HDSP-238X series displays in
combination with improved contrast enhancement techniques, such as a new filter for the green HDSP-2383 display,
make it possible to achieve readability in sunlight. Readability
of the HDSP-238X series displays in sunlight is achieved by
placing an antireflection coated, AR, circular polarized, CP,
optically tinted glass filter in front of the display. The AR/CP
optically tinted glass filter provides luminous contrast
between the on-LED pixels and the display background,
establishes a recognizable color difference between the onLED pixels and the display background and reduces the level
of ambient light reflected off the front surface of the filter. This
technology and the concept of Discrimination Index, as a
measure of readability, are discussed in Application Note
1015.

Figure 11. Diffuse and specular reflectance values are given
in Figure 12. Two AR/CP glass filters that approach the
theoretical characteristic are the 12% GREEN passband
manufactured by Marks Polarized Corporation and the
HOYA HLF-608-1 G. Figures 13a, band c present the
Luminous Index, Chrominance Index and Discrimination
Index calculations for the HDSP-2383/Marks 12% GREEN
filter combination. The Luminous contrast ratio of 5.22
gives a Luminance Index of 4.79, combined with a
Chrominance Index of t07 produces a Discrimination Index
of 4.91.
The HDSP-2383 combined with a 14% neutral density AR/CP
glass filter can achieve a luminous contrast of4.66, providing
a Discrimination Index of 4.60 which is an 16% improvement
over the value of 3.97 calculated for the standard green
HDSP-2303 display in Application Note 1015.

An AR/CP optically tinted glass filter should have a single
pass relative transmission between 11 % and 17% at the peak
wavelength of the LED radiated spectrum, provided by the
optical tinting. The double pass relative transmission should
be less than 1%, provided by the circular polarizer. The filter
can be either neutral density or bandpass, depending upon
the properties of the optical tinting. The appropriate bandpass filter, with a peak relative transmission positioned at the
peak wavelength of the LED radiated spectrum, will typically
have a higher luminous contrast ratio than a neutral density
filter, as it absorbs ambient light in the blue and blue-green
regions. The AR coating reduces reflections off the front
surface of the glass filter to a nominal 0.25%.

Table 1 lists calculated values for luminous contrast,
Luminous Index, Chrominance Index and Discrimination
Index forthe three HDSP-238X series devices in combination
with a 14% transmission neutral density AR/CP glass filter in
sunlight.
At present, the following two filter manufacturers provide
AR/CP optically tinted glass filters for use with the HDSP238X series displays in sunlight:

Luminous contrast values greater than 4.0 can be achieved in
107,0001m/m 2 (10,000fc) sunlight, excluding the condition of
a reflected image of the sun off the front surface of the filter.
The luminous contrast, which includes both diffuse and
specular reflectance components off the front surface of the
glass filter, is the predominant factor in the determination of
the Discrimination Index. The luminous contrast combined
with the color difference between illuminated LED pixels and
the display background, as viewed through the AR/CP filter,
produce Discrimination Index values in the neighborhood of
5.0. Values of Discrimination Index greater than 4.0 have
been demonstrated to correlate with acceptable readability in
sunlight.

Marks Polarized
Corporation
25B Jefryn Blvd. West
Deer Park. NY 11729
(516) 242-1300

Polaroid Corporation
Polarizer Division
1 Upland Road
Norwood. MA 02062
(617) 769-6800

Hoya OptiCS, Inc.
3400 Edison Way
Fremont. CA 94538
(415) 490-1880

AR/CP Glass Filter:
12% Green Bandpass
Display: HDSP-2383
10% Neutral Density
Displays: HDSP-23811
-2382

AR/CP Glass Filter:
HNCP10
10% Neutral Density
Displays: HDSP-23811

AR/CP Glass Filter:
HLF-608-1G
Display:HDSP-2383
HLF-608-34
Display: HDSP-2381
HLF-608-5-12
Displays: HDSP-2382

-2382/-2383

Hewlett-Packard has contacted various filter manufacturers,
requesting development of bandpass AR/CP glass filters for
all three HDSP-238X series displays. As these filters become
available, Hewlett-Packard will publish application information on their luminous/color contrasts and Discrimination
Index performances.

A theoretical relative transmission characteristic for an
optimal bandpass filter for the HDSP-2383 is presented in

--

Table 1. Discrimination Index Values for the HDSP-238X Series Displays
Display
Device

Time Average
Luminous
Intensity

Luminous
Contrast

Luminance
Index

Chrominance
Index

Discrimination
Index
4.86

HDSP-2381

680 }Lcd

4.66

4.46

1.94

HOSP-2382

570 "cd

4.09

4.08

6.86

7.98

680 "cd

4.66

4.46

1.14

4.60

HDSP-2383

Ambient: 107,000 Im/m2 (10,000 fc) Sunlight
Filter Type: 14% Transmission, AR/CP, Neutral Density

I-

Filter Surface Reflectance: 0.25% Specular and 0.02% Diffuse
Luminous Intensity: Data Sheet Typical x 20% Duty
Factor

7-49

10
2

0

~

0.9
0.8

~2

0.7

"....a:

0.6

w

0.5

~a:

0.4

>
;:

RADIATED SPEClRt)M OF
GREEN LED

T ('l " 0

BELOW
530 nm

T t570 om) • 0.11 TO 0.17

SINGLE PASS TRANSMISSION
CHARACrgA:IS'ftC

0.3

I

-....

0.2
0.1
0
400

480

500

520

540

560 570 580
A -

600

620

640

660

680

WAVELENGTH - nm

Figure 11. Relative Transmission Characteristics for a Yellow-Green Bandpass Antireflection Coated, Circular Polarized Glass Filter for
use with the HDSP-2383 Green LED Alphanumeric Display.

i

RFS :: 0.0025 SPECULAR
RFO = 0.0002 DIFFUSE
AR/CP
GLASS FILTER----.,,,,

¥

\.-t
$:

AR COATING

RS '" 0.25 SPECULAR
RD :: 0.25 DIFFUSE

._
£~POLARIZER
CIRCULAR

RGS :: 0.04 SPECULAR
AGO"" 0.0063 DIFFUSE

DISPLAY

GLASS

WINDOW~"F==t.;::=;~====:!~'={

LED CHIP AND
DIE ATTACH PAD
tLED PIXEL)

DISPLAY
CERAMIC
SUBSTRATE

Figure 12. Reflectances off Surfaces of an HDSP-238X Series Display and an AR/CP Glass Filler.

7-50

10 = V'IDL2 + IDC2
10 = V'(4.79)2

+ (1.07)2

C","'-,'

IDL= 4.79

.',','. ___._.,

12% TRANSMISSION VELLOW-GREEN
FILTER WINDOW I
P • 0.266 r' 0.374

IDC=1.07

0.4~~=+=n

10 =4.91

0.3

0.2

Figure 13a. Discriminalion Index lor the HDSP-2383 Green
LED Alphanumeric Display Combined with a
12% Transmission Yellow-Green Bandpass
AR/CP Glass Filter In Indirect 107000 Im/m2
(10,000 Ic) sunlight.

I---'r-+---+----'--F=-.....--r-+---+----l

0.1 1----I-~-t---t--7~t---+---+---~

0.1

0.2

0.3

0.4

0.5

HDSP-2383 GREEN
ALPHANUMERIC DISPLAY

IDC = Vj,/.l.2 + j,/.l.2
0.027

0.029
= --=1.07
0.027

Figure 13c. Color Difference and Chromlnance Index
lvB '" 45.3 cd/m 2
LVS '" 1348 cd/m 2

12% TRANSMISSlON
YELLOW GREEN BANDPASS
AR/CP GLASS FILTER

CR =,lv S + LvB + Lv F
LvB + Lv F

1348 + 45.3 + 274
CR =

CR

=

45.3 + 274

5.22

IOL '" LOGlO CR
0.15
LOGlO !5.221
IOL '" --0.-'5-IOL = 4.79

Figure 13b. Contrast Ratio and Luminance Index.

7-51

0.6

0.7

FliD'l

FOUR CHARACTER 6.9 mm (0.27 INCH)
5X7 ALPHANUMERIC DISPLAYS

HEWLETT

STANDARD RED HDSP'2490
YEllOW HDSP-2491
HIGH EFFICIENCY RED HDSP-2492
HIGH PERFORMANCE GREEN HDSP-2493

~~ PACKARD

TECHNICAL DATA

JANUARY 1986

Features
• FOUR COLORS
Standard Red
Yellow
High Efficiency Red
High Performance Green
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
• COMPACT CERAMIC PACKAGE
• WIDE VIEWING ANGLE
• END STACKABLE FOUR CHARACTER
PACKAGE
•
•
•
•

Typical Applications

TTL COMPATIBLE
5 x 7 LED MATRIX DISPLAYS FULL ASCII SET
CATEGORIZED FOR LUMINOUS INTENSITY
HDSP-2491/2493 ALSO CATEGORIZED FOR
COLOR

•
•
•
•
•
•

Description
The HDSP-2490/-2491 /-2492/-2493 series of displays are 6.9
mm (0.27 inch) 5 x 7 LED arrays for display of alphanumeric
information. These devices are available in standard red,
yellow, high efficiency red, and high performance green.

INSTRUMENTS
BUSINESS MACHINES
INDUSTRIAL PROCESS CONTROL EQUIPMENT
MEDICAL INSTRUMENTS
COMPUTER PERIPHERALS
MILITARY GROUND SUPPORT EQUIPMENT

Each four character cluster is contained in a 28 pin dual-inline package. An on-board SIPO (Serial-ln-Parallel-Outl
7-bit shift register associated with each digit controls constant current LED row drivers. Full character display is
achieved by external column strobing.

package Dimensions

r.-------- .. - - - -- - -

35.560.400IMAX.--------i.!

r--;---!-4.$ (.1$)

~-t-~

I

1

PIN1
MARKE0
aVOOT
ON SACK

OF

I

I
I

I

L_ _J

I

r-

-1

I
I
I
L_

I

I

_J

nt,

I

I

L_

I
_J

r- -r
I
I
I
L_

I

4

--r-I
_J_

](
1

- -

I

. . 1~:1- . 13.5---J
22.'

(.8t1l

z,s.

I

2--+---t-3 I

fACKA

(,sS)

r- -1

31.2

(U

$,30 (.1

(~~--------------------------------------1

7-52

FUNCTlONl 11

PIN

FUNCTION

1

NO CONNECT

2

COLUMN 1

DATA OUT

3

COLUMN 1

15
16
17

4

COLUMN 2

5

COLUMN 2

19

COLUMN 3

V,
V,
Vco
Vco

PIN

•
.2701

1B

NOCONNECl
DATA OUT

7

COLUMN 3

20
21

a

COL.UMN 4

22

CLOCK

9
10

COLUMN 4

CL.OCK

"

COLUMN 5

23
24
25

12

INT. CONNECTI 21 26

13

INT. CONNECTI2j

27

14

NO CONNECT

28

COLUMN 5

GROUND
GROUND

DATA IN
DATA IN
NOcONNECT

NonSI
1. All USEA$l.e Fl)NCTION

rINSA1tfi,R£OUNOAIlfT.

~i~C:~~6;~~NEcrION
filTH EFt PIN OR 60TH.
2, 00 NOT CONNECT OR USE,
3. OlMENSIONS IN
mm fiNCHES;.
4, UNLESS OTHERWISE
SPEC.FIED. THt!
TOLERANCE ON ALL

£)IMENSfQNS IS 't .3$ rom
1:':..615INCHt;S).

---------_._-._--------

Absolute Maximum Ratings (HDSP-2490/-2491/-2492/-2493)
Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB ................. -0.5V to Vee
Column Input Voltage, VeOl ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TA [1 ,21 ........ ·_20° C to +85° C

Storage Temperature Range, Ts ..... -55°C to +100°C
Maximum Allowable Power Dissipation
atTA=25°C,·2.3 ......................... 1.46 Watts
Maximum Solder Temperature 1.59 mm (0.063 in.!
Below Seating Plane t < 5 sec ................ 260° C

Recommended Operating Conditions
(HDSP-2490/-2491/-2492/-2493)
Parameter
Suppllti Voltage

-"~

Data 0
State
Column Input
'Column On HDSP-2490
Column Input
Column On HOSP-24911-2492/-2493
Setup Time
Hold Time
Width of Clock
Clock frequency
Clock Transition Time
Free Air Operating Temperature Range 11.21

Svmbol
Vee
10l
10K

Min.
4.75

Veol

2.4
2.75
70
30
75
0

VeDl
tsetup

thold
tw(G!eCk!

fcloCk

Nom.
5.0

Units

1.6

mA
mA
V
V

35
3.5
45

4
4

n"
ns
ns
MHz
ns
°C

0
3

200
-20

Fig,

v

-0.5

tTHL

TA

Max.
5.25

85

1
1
1

1
1
2

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified I
Descrlpllon
Supply Current

Symbol
fcc

Column Current at any Column Input

leaL

Column Current at any Column Input
VB. Clock or Data Input Threshold High

leol
VIK
VIL

,., C"""' ~ """ 1","m~R
Input Current Logical 1

k

Input Current Logical 0

YB, Clock
Dataln

I
Data Qut Voltage

Power Dissipation Per Package"
Thermal Resistance IC
Junction-Io-Case

hH
ilK
ilL
ItL
YaH
Val
PD

Teslel)rtditions
Vee =5.25V
Vel-OeK.= VOATA '" 2.4V
All SR Stages =
Logical 1
Vee -5.25 V
VeDl ~3.5V
All SR Stages Logical 1

=
Vee = YeOl = 4.7SV

Vee

Typ."

Max.

Units

VB= O.4V

45

60

mA

VB =2.4V

73

95

mA

Min.

Va = O.4V

YB"'2AV
2.0

Vee ~ 5.25V, V" ; 9.4V
Vee = 4.76V, 10K = -0.5 mA, leal = 0 mA
Vee "'4.75V, IOl "" 1.6 mA, leal·' 0 mA
Vee 5.0V, Veal = 3.5V, 17 ..5% OF
15 LEOs on per character, VB = 2.4V

=

~
o.a

5.25V, VIH '" 2.4V

2.4

20
10
-500
-250
3.4
0.2
0.78
20

RIiJ-c

Fig.

80
40
-BOO
-400

0.4

V
/JA
/JA
p.A
p.A
V
V
W

2-

·CiWf

2

Device

"Power c;lissipation per package with four characters illuminated.

'All typical values specified at Vee = 5.0V and TA = 25°C unless
otherwise noted.

Notes:
1. Operation above 85° C ambient is possible provided the
following conditions are met. The junction should not
exceed 125°C TJ and the case temperature (as measured
at pin 1 or the back of the displaYI should not exceed
100°C Te.

2. The device should be derated linearly above 60° C at
22.2 mWfo C. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at
25° CfW per device. See Figure 2for powerderatings based on
a lower thermal resistance.
3. Maximum allowable dissipation is derived from Vee = 5.25V, VB
= 2.4V, VeOL = 3.5V 20 LEOs on per character, 20% OF.

7-53

optical Characteristics
STANDARD RED HDSP-2490
Description
Peak Luminous Intensity per LED14,81
{Character Average)
Peak Wavelength
Dominant Wavelengthl7]

Symbol
IvPeak

Test Condltlons
Vee - 5.0V, Veol - 3.5V
TI = 25°C(6J, VB'" 2.4V

Min.

Typ.'

Units

Fig.

220

370

/lcd

3

655
639

nm
nm

APEAK
Ad

Max.

YELLOW HDSP-2491
Description
Peak Luminous Intensity per LED14,81
(Character Average)
Peak Wavelength
Dominant Wavelength[5, 71

Symbol
IvPeak

Test Conditions
Vee"" 5,OV, Veol = 3.5V
TI "" 25" e[6), VB = 2.4V

Min.

Typ!

850

1400

}Lcd _

583
585

nm
nm

APEAK
Ad

Max.

Units

Fig.

-~

HIGH EFFICIENCY RED HDSP-2492
Description
Peak Luminous Intensity per LED I 4.8)
(Character Average)
Peak Wavelength
Dominant Wavelength[7J

Symbol
IvPeak
APEAK
Ad

Test Conditions
Vee = 5.0V, VeOl"'" 3,SV
TI "" 25~C[61, Va"" 2.4V

Min.

Typ.-

Units

Fig.

850

1530

/lcd

3

635
626

nm
nm

I

Max.

HIGH PERFORMANCE GREEN HDSP-2493
Description
Peak Luminous Intensity per LED14.81
(Character Average)
Peak Wavelength
Dominant WavelengthlS,71

Symbol
IvPe~k

Test Conditions
Vee = 5.0V, Veo!.. = 3.5V
TI = 25° C{6J, VB 2AV

=

Min.

Typ,'

Units

Fig.

1280

2410

pcd

3

568
574

nm
nm

APEAK
Ad

Max.

"Power dissipation per package with four characters illuminated .

• All typical values specified at Vee =.5.0V and T A = 25° C unless
otherwise noted.

Noles:
4. The characters are categorized/or luminous intensity with the
intensity category designated by a letter code on the bottom of
the package.
5. The HDSP-2491/-2493 are categorized for color with the color
category designated by a number code on the bottom of the
package.
6. Ti refers to the initial case temperature of the device immediately prior to the light measurement.

Electrical Description
The HDSP-249X series of four character alphanumeric
displays have been designed to allow the user maximum
flexibility in interface electronics design. Each four character display module features DATA IN and DATA OUT
terminals arrayed for easy PC board interconnection. DATA
OUT represents the output of the 7th bit of digit number 4
shift register. Shift register clocking occurs on the high to
low transition of the clock input. The like columns of each
character in a display cluster are tied to a single pin.
Figure 5 is the block diagram for the displays. High true
data in the shift register enables the output current mirror
driver stage associated with each row of LEDs in the 5 x 7
diode array.

7. Dominant wavelength Ad, is derived from the CI E chromaticity
diagram, and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv (cd/m2) = Iv (Candela)/A (Metre)2
Lv IFootlamberts) = rrlv ICandela)/A IFoot)2
A = 5.3 x 10~ M2 = 5.8 x 10-7 (Footl2

column 1 input is now enabled for an appropriate period of
time, T. A similar process is repeated for columns 2, 3, 4
and 5. If the time necessary to decode and load data into
the shift register is t, then with 5 columns, each column of
.the display is operating at a duty factor of:
T
D.F. = 5 (t + T)
The time frame, t + T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:

The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power consumption.

1/[5x (100)J

= 2 msec

If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t« T. For short display strings, the duty
factor will then approach 20%.

In the normal mode of operation, input data for digit 4
column 1 is loaded into the 7 on-board shift register locations 1 through 7. Column 1 data for digits 3, 2 and 1 is
similarly shifted into the display shift register locations. The

Forfurther applications information, referto HP Application
Note 1016.

7-54

CLOCK

SERIAL
DECODED
DATA
INPUT

CLOCK

SERIAL
DECODED
DATA
OUTPUT

DATA IN

BLANKING
CONTROL
DATA OUT

Condition 1111.. Typ. M... UJi"~i

Ct , "" 15PF

1~5

A,~2.4"tl

ns

Figure 1. Switching Characteristics HDSP-2490/-2491/-2492/-2493
(TA = -20'C to +85° C)

&
COLUMN DRIVE INPUTS

Mechanical and
Thermal Considerations

Figure 5. Block Diagram of HDSP-2490/-2491/-24921-2493

filter materials are provided in Figure 6. Additional information on filtering and contrast enhancement can be found in
HP Application Note 1015.

The HOSP-2490/-2491/-2492/-2493 areavailable in standard
ceramic dual-in-line packages. They are designed for plugging into sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character arrays
of any desired size. The HOSP-2490/-2491/-2492/-2493 utilize a high output current IC to provide excellent readability
in bright ambient lighting. Full power operation (Vee =
5.25V, VB = 2.4V, VeOL = 3.5V) with worst case thermal
resistance from IC junction to ambient of 45' C/wattldevice
is possible up to ambient temperature of 60° C. For operation
above 60°C, the maximum device dissipation should be
derated linearly at 22.2 mW/oC (see Figure 2). With.an
improved thermal design, operation at higher ambient
temperatures without derating is possible. Please refer to
Application Note 1016 for further information.

Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is
permissible. Suggested solvents include Freon TF, Freon
TE. Genesolv 01-15, Genesolv OE-15, and water.

HDSP·200Q

Ple;(tgla~s

~"

01

~z

~Q

"'!<

2423-

HOSP·20Q,
tYeHow/

Polaroid HNCP37 PolafQJd
3M LIght ContrOl

HDSP·2002

Panelgraphic

CheQlJers Gr€y

[HER)

Ruby Red 60
Chequers Red 112

'05

HDSP-2003

P an elgrapnic

Polaroid

(HPGreen)

Green 48
Cl1equers Green

HNCP10~Glass

,

~
,

0:
0:

::>

"'0:

w

~~
'.0

~

'W

~~

"

0-

"8OJ

i"lDSP'2~

0:

300

HDSP,249'1
/HDSP·2493

TA -AMBIENT TEMPERATURE - °C

Figure 2. Maximum Allowable Power
Dissipation vs. Temperature

-20

20

40

60

80

100

120

I

200

~

I

'00

0

'00

. / HDSP~2491'·2492t·2493

'"

-

~;:-;..

J

HOSP·2490

z

HD$P·249-2:

2.0

>

L 17'"

a;

;;

::

~o

40 0

I-

3.0

"l0

::>~

Marks P(;laril:e-d

500

~

:!:iij

Note 1
PolaroId
HNCP10·G!ass
Marks Po!.ariled

Figure 6. Contrast Enhancement Filters

I-

z

MPC·0301·S-iO

I
Gray 10

MPC-.D1Q1-$-12

~

a;

Film

Note: 1. Optically coated circular polarized filters, such as
Polaroid HNCP10.

4.0

in

HNC?11)431a5s
Murks PolarllM

Yellow 27
Che-quers Amber
107

MPC-0201~2*22

The HOSP-2490/-2491/-2492/-2493 displays have glass
windows. A front panel contrast enhancement filter is desirable in most actual display applications. Some suggested

~5

Dark Red 63
Ruby Rod 60

Chequers: .Red 118.

Power derating for this family of displays can be achieved in
several ways. The power supply voltage can be lowered to a
minimum of 4.75V. Column Input Voltage, VeoL, can be
decreased to the recommended minimum values of 2.4V for
the HOSP-2490 and 2.75V for the HOSP-2491/-2492/-2493.
Also, the average drive current can be decreased through
pulse width modulation of VB.

2.0

PanelgwphiC

$Id. Red

140

TJ -JUNCTION TEMPERATURE -"C

Figure 3. Relative Luminous Intensity
vs. Temperature

;.....
1.0

2.0

3.0

4.0

5.0

VCOL - COLUMN VOLTAGE - VOLTS

Figure 4. Peak Column Current vs.
Column Voltage

7-55
- - - - _ . _ - - _.... _----_._ .. _ - - - - - - - - - - - - - - - -

F!JptI

a!:a

HEWLETT

5 x 7 DOT MATRIX

PACKARD

ALPHANUMERIC
DISPLAY SYSTEM

HOSP-24t6
HDSP-2424
HDSP-2432
HO'SP-2440
HDSP-2410
HOSP-2411
HDSP-2472

TECHNICAL DATA

JANUARY 1986

Features
• COMPLETE ALPHANUMERIC DISPLAY SYSTEM
UTILIZING THE HDSP-2000 DISPLAY
• CHOICE OF 64,128, OR USER DEFINED ASCII
CHARACTER SET
• CHOICE OF 16, 24, 32, or 40 ELEMENT
DISPLAY PANEL
• MULTIPLE DATA ENTRY FORMATSLeft, Right, RAM, or Block Entry
• EDITING FEATURES THAT INCLUDE CURSOR,
BACKSPACE, FORWARDSPACE, INSERT,
DELETE, AND CLEAR
• DATA OUTPUT CAPABILITY
• SINGLE 5.0 VOLT POWER SUPPLY

Typical Applications

• TTL COMPATIBLE

•
•
•
•

• EASILY INTERFACED TO A KEYBOARD OR
A MICROPROCESSOR

Description
The HDSP-24XX series of alphanumeric display systems
provides the user with a completely supported 5 x 7 dot
matrix display panel. These products free the user's
system from display maintenance and minimize the
interaction normally required for alphanumeric displays.
Each alphanumeric display system is composed of two
component parts:

DATA ENTRY TERMINALS
INSTRUMENTATION
BUSINESS EQUIPMENT
COMPUTER PERIPHERALS

PART NUMBER

1. An alphanumeric display controller which consists of a
preprogrammed microprocessor plus associated logic,
which provides decode, memory, and drive signals
necessary to properly interface a user's system to an
HDSP-2000 display. In addition to these basic display
support operations, the controller accepts data in any
of four data entry formats and incorporates several
powerful editing routines.
2. A display panel which consists of HDSP-2000 displays
matched for luminous intenSity and mounted on a P.C.
board designed to have low thermal resistance.
These alphanumeric display systems are also available. in
high efficiency red, yellow, and green. In addition, they are
available using the HDSP-2300 or HDSP-2490 series displays to form display systems with larger characters (5.0
mm and 6.9 mm, respectively). Contact your local HP sales
office for more information.

7-56

DESCRIPTION

Display Boards
HDSP-2416

Single-line 16 character display pane!
utilizing the HDSP-2000 display

HDSP-2424

Single-line 24 character display panel
utilizing the HDSP-2000 display

HDSP-2432

Single-line 32 character display panel
utilizing the HDSP-2000 display

HDSP-2440

Single-line 40 character display panel
utilizing the HDSP-2000 display

Controller Boards
HDSP-2470

HDSP-2000 display interface Incorporating
a 64 character ASCII decoder

HDSP-2471

HDSP-2000display interface incorporating
a 128 character ASCII decoder

HDSP-2472

HDSP-2000 display interface without
ASCII decoder. Instead, a 24 pin socket
is provided to accept a custom 128 character set from a user programmed 1K x 8
PROM.

When ordering, specify one each of the Controlier Board and the
Display Board for each complete system.

.~------------

HDSP-2470/-2471/-2472

Recommended
Operating Conditions

Absolute Maximum Ratings
Vee ............................•...... -0.5V to 6.0V

Parameter

Operating Temperature Range,
Ambient (TA) ...............••.•..•. O°C to 70°C

Supply Voltage

Storage Temperature Range (Ts) .... -55°C to 100°C

Data Out

Voltage Applied to any Input or Output .. -0.5V to 6.0V
IsouReE Continuous for any Column
Driver .......... 5.0 Amps (60 sec. max. duration)

Symbol

Min.

Max.

Vee

4.75

5.25

V

IOL

0.4

mA

IOH

-20

p.A

IOL

1.6

mA

IOH

-40

Ready, Data Valid,
Column On, Display
Data

I

p.A

IOL

10.0

mA

IOH

-1.0

mA

IsouReE

-5.0

A

Clock
Columnl-5

Units

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified)
Parameter

Symbol

Supply Current l11

Min.

Typ.

Input Threshold High (except Reset)
Input Threshold High -

Reset l21

Input Threshold Low -

All Inputs

Data Out Voltage

2.0

V

Vee ~ 5.0V

3.0

V

Vee

V

Vee = 5.0V

V

IOH =-20p.A

V

IOL = O.4mA

V

IOH

0.8

VIL
VOHData

2.4

VOHClk

0.5
2.4
0.5

VOLClk
VOH
VOL

0.5

Input Current,l31 All Inputs Except
Reset, Chip Select, D7

IIH

-0.3

IlL

Reset Input Current

hH
IlL

Column Output Voltage

Conditions

mA Vee = 5.25V Column On and All
Outputs Open

VIH

Ready, Display Data, Data Valid,
Column on Output Voltage

Chip Select, D7 Input Current

Units

VIH

VOLData
Clock Output Voltage

Max.

400

Icc

2.4

h

-10

VOLCOL

2.6

3.2

± .25V

= 5.0V ± .25V
± .25V

= -1000p.A

Vee = 4.75V
Vee

= 4.75V

Vee = 4.75V

= 4.75V

V

IOL= 10.0mA

Vee

V

IOH = -40!,A

Vee = 4.75V

V

IOL = 1.6mA

Vee = 4.7SV

mA VIH = 2.4V

Vee = S.2SV

-0.6

mA VIL = 0.5V

Vee = S.2SV

-0.3

mA VIH = 3.0V

Vee

-0.6

rnA

VIL = 0.5V

Vee = 5.2SV

+10

p.A

0< VI < Vee

V

lOUT = -S.OA

= 5.2SV

Vee =5.00V

NOTES:
1. See Figure 11 for total system supply current.
2. External reset may be initiated by grounding Reset with either a switch or open collector TTL gate for a minimum time of
50ms. For Power On Reset to function properly, Vee power supply should turn on at a rate> 100V/s.
3. Momentary peak surge currents may exist on these lines. However, these momentary currents will not interfere with
proper operation of the HDSP-2470/1/2.

7-57

HDSP-2416/-2424/-2432/-2440

Recommended
Operating Conditions

Absolute Maximum Ratings
Supply Voltage Vee to Ground ......... -0.5V to 6.0V

Parameter

Inputs, Data Out and VB

Supply Voltage

............... -0.5V to Vee

Column Input Voltage, VeOl

.........

-0.5V to +6.0V

Free Air Operating Temperature
Range, TAlll ....................... O°C to +55°C
Storage Temperature Range, Ts .... -55°C to +100°C

Symbol

Min. Norm. Max. Units

Vec

4.75

Column Input
Voltage, Column On

VCOl

2.6

Setup Time

tSETUP

70

45

ns

tHOlD

30

0

ns

Hold TIme

5.0

5.25

V

tW(CLOCK) 75

Width of Clock
Clock Frequency

fCLOCK

Clock Transition
Time

tTHl

Free Air Operatingl1]
Temperature Range

TA

V

ns

0

0

3

MHz

200

ns

55

°C

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified)
Parameter

Symbol

Min.

Supply Current

Typ.·

Max.

45n

60n[2)

73n

95n

Icc

1.5n

ICOl
Column Current at any Column Input
335n

leOl
Peak Luminous Intensity per LED
(Character Average)

410n

Units

mA VCC = VCOl = 5.25V Va = O.4V
All SR Stages ""
Logical 1
mA
Va = 2.4V
Vce = 5.0V, VeOL = 3.5V
Ilcd Tj = 25· C131, VB = 2.4V

200

Iv PEAK

105

Va, Clock or Data Input Threshold High

VIH

2.0

Va, Clock or Data Input Threshold Low

Vil

Input Current Logical 1

VB, Clock

IIH

80

IlA

Data In

IIH

40

IlA

Input Current Logical 0

V
0.8

V

Va, Clock

lil

-500

-800

J1.A

Data In

IlL

-250

-400

IlA

PD

0.66n

Power DiSSipation Per Board l41

Conditions

mA Vcc == 5.25V
VB = 0.4V
VCLOCK=VDATA=2.4V
mA All SR Stages ==
VB == 2.4V
Logical 1

W

Vec = VCOl

= 4.75V

Vee = 5.25V, VIH = 2.4V
VCC = 5.25V, Vil = 0.4V
Vce = 5.0V, VeOl = 2.6V

15 LED's on per Character,
VB = 2.4V
-All typical values specified at Vee = 5.0V and TA = 25°C unless otherwise noted.
NOTES:
1. Operation above 55° C (70° C MAX) may be achieved by the use of forced air (150 fpm normal to component side of
HDSP-247X controller board at sea level). Operation down to -20· C is possible in applications that do not requirethe
use of HDSP-2470/c2471/-2472 controller boards.
2. n = number of HDSP-2000 packages
HDSP-2416 n = 4
HDSP-2424 n = 6
HDSP-2432 n = 8
HDSP-2440 n = 10
3. Tj refers to initial case temperature immediately prior to the light measurement.
4. Power dissipation with all characters illuminated.

7-58

------

~~---.

-----

~----~

System Overview
The HDSP-2470/-2471/-2472 Alphanumeric Display
Controllers provide the interface between any ASCII
based Alphanumeric System and the HDSP-2000
Alphanumeric Display. ASCII data is loaded into the
system by means of anyone of four data entry modes Left, Right, RAM or Block Entry. This ASCII data is stored
in the internal RAM memory of the system. The'system
refreshes HDSP-2000 displays from 4 to 48 characters
with the decoded data.
The user interfaces to any of the systems through eight
DATA IN inputs, five ADDRESS inputs (RAM mode), a
CHIP SELECT input, RESET input, seven DATA OUT

outputs, a READY output, DATA VALID output, and a
COLUMN ON output. A low level on the RESET input
clears the display and initializes the system. A low level on
the CHIP SELECT input causes the system to load data
from the DATA IN and ADDRESS inputs into the system.
The controller outputs a status word, cursor address and
32 ASCII data characters through the DATA OUT outputs
and DATA VALID output during the time the system is
waiting to refresh the next column of the display. The
COLUMN ON output can be used to synchronize the
DATA OUT function. A block diagram for the HDSP2470/-2471/-2472 systems is shown in Figure 1.

DATA OUT
DATA VALID
COLUMN ON
VB, DISPLAY
BLANKING

-

-

--c

3
RAM ADDRESS

----?

DATA IN

~

CHIP SELECT

-<

READY

DISPLAY
CONTROLLER

r~t
I
I
I

-

7

1/10
DECODER

~

~ COLUMN 1-5

DRIVE
TRANS

-,
I
I
I

L __ _.J

7

-

PISO

DISPLAY DATA

CLOCK

-CHARACTER GENERATOR FOR 'HDSP~2471,
SOCKET FOR 1 K X 8 PROM FOR HDSP·2472.

Figure 1. Block Diagram for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

The system interfaces to the HDSP-2000 display through
five COLUMN outputs, a CLOCK output, DISPLAY DATA
output, and the COLUMN ON output. The user should
connect DISPLAY DATA to DATA IN of the leftmost
HDSP-2000 cluster and cascade DATA OUT to DATA IN
of all HDSP-2000 clusters. COLUMN outputs from the
system are connected to the COLUMN inputs of all HDSP2000 clusters. The HDSP-24XX Series display boards are
designed to interconnect directly with the HDSP-247X
Series display controllers. The COLUMN outputs can
source enough current to drive up to 48 characters of the
HDSP-2000 display. Pulse width modulation of display
luminous intensity can be provided by connecting
COLUMN ON to the input of a monostable multivibrator
and the output of the monostable multivibrator to the VB
inputs of the HDSP-2000 displays. The system is designed
to refresh the display at a fixed refresh rate of 100 Hz.
COLUMN ON time is optimized for each display length in
order to maximize light output as shown in Figure 2.

20

~

18
w

::;;

;::
z
0
z

::;;

I'" t-...

16

i', f'o"HDSP.2471/.2472

N'-

14

0

00-

HDSP·24io' ....,~

::J
..J

..."

~

12

r"-. .....,

10

"

o

~

o

4

8

12 16 20 24 28 32 36 40 44 48
DISPLAY LENGTH

Figure 2. Column on Time vs. Display Length lor the
HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

7-59
~-~-~-

..

--~---.----

......

---------------

Control Mode/Data Entry
User interface to the HDSP-247X Series controller.is via an
8 bit word which provides to the controller either a control
word or standard ASCII data input. In addition to this user
provided 8 bit word, two additional control lines, CHIP
SELECT and READV, allow easily generated "handshake"
signals for interface purposes.

CONTROL
WORD: D7D6DSD4D3D2D1DO

111x xl-Iv v v vi

A logic low applied to the CHIP SELECT input (minimum
six microseconds) causes the controller to read the 8
DATA IN lines and determine whether a control word or
ASCII data word is present, as determined by the logiC
state of the most significant bit (D7). If the controller
detects a logic high at D7, the state of D6-Do will define the
data entry mode and the number of alphanumeric
characters to be displayed.

CLEAR. OFFSCREEN CURSOR

DISPLAY LENGTH:
4 DIGITS
8
12
16
20
24

0 0
000 1
o0 1 0
o0 1 1
o10 0
o10 1
o110
o1 11
000
001
010
o11

The 8 bit control data word format is outlined in Figure 3.
For the control word (D7 high), bits D6 and Ds define the
selected data entry mode (Left entry, Right entry, etc.) and
bits D3 to Do define display length. Bit D4 is ignored.
Control word inputs are first checked to verify that the
control word is valid. The system ignores display lengths
greater than 1011 for left block or right, orOl11 for RAM. If
the word is valid, the present state-next state table shown
in Figure 4 is utilized to determine whether or not to clear
the display. For display lengths of up to 32 characters,
RAM entry can be used as a powerful editing tool, or can
be used to preload the cursor. With other transitions, the
internal data memory is cleared.

YYYY

o0

28
32'
36
40
44
48

"

'maximum for RAM data entry mode

xX

DATA ENTRY MODES

o0
o1

RAM DATA ENTRY
LEFT DATA ENTRY
RIGHT DATA ENTRY
BLOCK DATA ENTRY

1 0
1 1

Figure 3. Control Word Format for the HDSP-2470/-2471 /-2472
Alphanumeric Display Controller.

=30,.
(1)

RAM ENTRY MODE IS VALID FOR DISPLAYS OF

32 CHARACTERS OR LESS IN LENGTH.
(2)

FOLLOWING A TRANSITIDN FROM RAM TO
BLOCK, WHEN THE CURSOR ADDRESS IS 48
(30,6) DURING THE TRANSITION, THE FIRST
VALID ASCII CHARACTER WILL BE IGNORED
AND THE SECOND VALID ASCII CHARACTER
WILL BE LOADED IN THE LEFT· MOST DISPLAY
LOCATION.

WHERE BEGIN IS DEFINED AS FOLLOWS:
DISPLAY
LENGTH

4

8
12
16
20
24
28
32
36
40

CLEAR,
BLINKING
CURSOR = BEGIN

44
48

CLEAR. INVISIBLE
CURSOR = BEGIN

CURSOR ADDRESS
OF BEGIN

2C,., «'0
28,.,40,0
24,.,36,0
2° 16 .3210

1C,6,28,o
18'6,24,0
14'6,20,0
10,6,16,0
OC, •. 12,o
08,., 8'0
04,., 4,0
00 16

Figure 4. Present State-Next State Diagram for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

7-60

(space) to 5F16 L)l and ignores all ASCII characters
outside this subset with the exception of those characters
defined as display commands. These display commands
are shown in Figure 5. Displayed character sets for the
HDSP-2470/-2471 systems are shown in Figure 6.

If 07 is a logic low when the DATA IN lines are read, the
controller will interpret 06-00 as standard ASCII data to be
stored, decoded and displayed. The system accepts seven
bit ASCII for all three versions. However, the HDSP-2470
system displays only the 64 character subset [2016

DATA WORD:
ASCii ASSIGNMENT

LF

BS
HT
US
DEL

07

10

0 6 Os

I

A

A

0
0
0
0
1

0
0
Q

0
1

04

03

O2

0 1 DO

A

A

A

A

0
0
0
1
1

AI

0
0

DISPLAY COMMAND

I

Valid in
Right Entry
CLEAR
Mode
BACKSPACE CURSOR
FORWARDSPACE CURSOR
INSERT CHARACTER
DELETE CHARACTER

1"'''"

Left Entry
Mode

Figure 5. Display Commands for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

128 CHARACTER ASCii SET
IHDSP-24711
64 CHARACTER ASCII SUBSET
(HDSP·24701

·OISPLAY COMMANDS WHEN USED IN LEFT ENTRY

+DISPLA Y COMMANDS WHEN USED IN RIGHT ENTRY

Figure 6. Display Font for the HDSP-2470 (64 Character ASCII Subset), and HDSP-2471 (128 Character ASCII Set) Alphanumeric
Display Controller.

7-61

Regardless of whether a control word or ASCII data word
is presented by the user, a READY signal is generated by
the controller after the input word is processed. This
READY signal goes low for 251's and upon a positive
transition, a new CHIP SELECT may be accepted by the
controlier. Data Entry Timing is shown in Figure 7.

DATA ENTRY TIMING

·1

I.o------ADDRESS
..
HOLD TIME

RAM ADDRESS

f . - l 0 " ' MAX.

=""'l

CHIP SELECT

lL-!I_________________________......

-I.

1-6"'MIN.
DATA ENTRY TIME

----------1.11--2.5",.

READY

1
I

1*I

1-25",-1

°

IFCHIP SELECT =
AFTER THIS TIME,
CONTROLLER WILL
ENTER NEXT CHARACTER.

MAXIMUM DATA ENTRY TIMES OVER OPERATING TEMPERATURE RANGE
DATA ENTRY MODE
HDSP·

FUNCTION
DATA HOLD TIME*

DATA
ENTRY

BACK
SPACE

CLEAR

FORWARD
SPACE

DELETE

INSERT

2051's
2251's

7251's
7451's

7251's
7351's

LEFT (2471/2)
LEFT (2470)

1351's
1501's

2351's
2451's

1951's
2151's

5051's
53Ol's

RIGHT (2471/2)
RIGHT (2470)

851's
1051's

480l's
490l's

470l's
49Ol's

4651's
4851's

RAM (2471/2)
RAM (2470)

551's
551's

BLOCK 12471/2)
BLOCK (2470)

551's
551's

1201's
1301's

LOAD CONTROL (2471/2)
LOAD CONTROL (2470)

50l's
50l's

5051's
5051's

1201's"
1301's* *

1901's
2001's
(1551's FOR RIGHTMOST CHARACTER)
(1651's FOR RIGHTMOST CHARACTER)

*Minimum time that data inputs must remain valid after Chip Select goes low.
"Minimum time that RAM address inputs must remain valid after Chip Select goes low.

Figure 7. Data Entry Timing and Data Entry Times for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

7-62

Left Entry Mode
With Left entry, characters are entered in typewriter
fashion, i.e., to the right of all previous characters. Left
entry uses a blinking cursor to indicate the location where
the next character is to be entered. CLEAR loads the
display with spaces and resets the cursor to the leftmost
display location. BACKSPACE and FORWARDSPACE
move the cursor without changing the character string.
Thus, the user can backspace to the character to be
edited, enter a character and then forward space the
cursor. The DELETE function deletes the displayed
character at the cursor location and then shifts the
character string following the cursor one location to the
left to fill the void of the deleted character. The INSERT
CHARACTER sets a flag inside the system that causes
subsequent ASCII characters to be inserted to the left of
the character at the cursor location. As new characters are
entered, the cursor, the character at the cursor, and all
characters to the right of the cursor are shifted one
location to the right. The INSERT function is terminated
by a second INSERT CHARACTER, or by BACKSPACE,
FORWARDSPACE, CLEAR or DELETE. In Left entry
mode, after the display is filled, the system ignores a)1
characters except BACKSPACE and CLEAR. The system
allows the cursor to be positioned only in the region
between the leftmost display character and immediately
to the right (offscreen) of the rightmost display character.
Right Entry Mode
In Right entry mode, characters are entered at the right
hand side of the display and shifted to the left as new
characters are entered. In this mode, the system stores 48
ASCII characters, although only the last characters
entered are displayed. CLEAR loads the display with
spaces. BACKSPACE shifts the display one location to the
right, deleting the last character entered and displaying
the next character in the 48 character buffer. Right entry
mode is a simple means to implement the walking or
"Times-Square" display. FORWARDSPACE, INSERT,
and DELETE have character assignments in this mode
since they are not treated as editing characters. In this
mode, the cursor is located immediately to the right
(offscreen) of the rightmost displayed character.
Block Entry Mode
Block entry allows the fastest data entry rate of all four
modes. In this mode, characters are loaded from left to
right as with Left entry. However, with Block entry, after
the display is completely loaded, the next ASCII character
is loaded in the leftmost display location, replacing the
previous displayed character. While Block entry has a
nonvisible cursor, the cursor is always loaded with the
address of the next character to be entered. In this entry
mode, the system can display the complete 128 character
ASCII set. The display can be cleared and the cursor reset
to the leftmost display location by loading in a new
BLOCK control word.
RAM Entry Mode

In RAM entry, ASCII characters are loaded at the address
specified by the five bit RAM address. Due to the limitation
of only five address lines, RAM data entry is allowed only

7-63

for displays less than or equal to 32 characters.
Regardless of display length, address 00 is the leftmost
display character. Out of range RAM addresses are
ignored. While RAM entry has a non-visible cursor, the
cursor is always preloaded with the address to the right of
the last character entered. This allows the cursor to be
preloaded with an address prior to going into any other
entry mode. In RAM entry, the system can display the
complete 128 character ASCII set because it does not
interpret any of the characters as control functions. The
display can be cleared by loading in a new RAM control
word.
Data Out
For display lengths of 32 characters or less, the data
stored in the internal RAM is available to the user during
the time between display refresh cycles. The system
outputs a STATUS WORD, CURSOR ADDRESS, and 32
ASCII data characters. The STATUS WORD specifies the
data entry mode and the display length of the system. The
STATUS WORD output differs slightly from the CONTROL WORD input. This difference is depicted in Figure 8.
Regardless of display length, the CURSOR ADDRESS of
the rightmost character location is address 47 (2F16) and
the offscreen address of the cursor is address 48 (3016).
The CURSOR ADDRESS of the leftmost location is
defined as address 48 minus the display length. A general
formula for CURSOR ADDRESS is:
CURSOR ADDRESS =
(47 - Display Length)

+ Number of Characters from

Left.

For example, suppose the alphanumeric display is 16
characters long and the cursor was blinking at the third
digit from the left. Thenthe CURSOR ADDRESS would be
47 -16 + 3 or 34 (2216) and the 18th ASCII data word would
correspond to the ASCII character at the location of the
display cursor. In Left and Block entry, the CURSOR
ADDRESS specifies the location where the next ASCII
data character is to be entered. In RAM entry, the
CURSOR ADDRESS specifies the location to the right of
the last character entered. In Right entry, the CURSOR
ADDRESS is always 48 (3016). The negative edge of the
DATA VALID output can be used to load the 34 DATA
OUT words into the user's system. The DATA OUT timing
for the HDSP-247X systems are summarized in Figure 8.
For displays longer than 32 characters, the system only
outputs the STATUS WORD between refresh cycles.
Master/Power On Reset
When power is first applied to the system, the system
clears the display and tests the state of the DATA INPUT,
D7. If D7 > 2.0V, the systems loads the control word on the
DATA INPUTS into the system. If D7::; .8V or the system
sees an invalid control word, the system initializes as Left
entry for a 32 character display with a flashing cursor in
the. leftmost location. For POWER ON RESET to function
prpperly, the power supply must turn on at a rate> 100 Vis.
In' addition, the system can be reset by pulling the RESET
input low for a minimum of 50 milliseconds. POWER
ON/MASTER RESET timing is shown in Figure 9.

I·

2000",

--------------------------------------------.~I

~"'~'.

HDSP·

2470

~
..

DATA VALID

ASCII DATA

HDSP-

2470

X, COLUMN OFF TIME
HDSP·

2470

+ 20,,",s X Display Length

(HDSP-2470)

= 30.5ps

(HDSP·2471/·2472)

= 17.5J1s + 17.5tls X Display Length

Y, DATA VALID TO COLUMN OFF TIME
(Display Length .;;;32 Characters)
(HDSp·24701
• 813.5"s - 20"s X Display Length
(HDSP·2471/·24721 • 826.2"s - 17.5"s X Display Length
STATUS WORD FORMAT (WORD AI
DB D5 D4 D3 ~ D, DO

HDSP-

2471/·2472

---j

1--,.2",

~_---' ~_~n

HDSP-

2471/2472

n~

35", --4-- 35", --l

ASCII

DATA

SOOn, MIN

!

__

0

0

0

1

0

1

0

1

0

0

RAM ENTRY
Y

Y

Y

Y

BLOCK ENTRY
LEFT ENTRY
RIGHT ENTRY

YYYY' DISPLAY LENGTH
CURSOR ADDRESS FORMAT (WORD BI
CURSOR ADDRESS' ( 47 - Display Lengthl + No. of
Characters from Left

I

TAT1s CURSOR +-DATA
DATA
WORD
ADDRESS
WORD--!-WORDS
(BI
(01
(1 - 311
1---500n, MIN

I '(AI
I---

0
0

I

DATA WORD FORMAT (WORDS 0-311
STANDARD ASCII DATA Where Word (31) is Rightmost
Displayed ASCI I Character

Figure 8. Data Out Timing and Format for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

~~.'------------------50m'MIN------------------~·1

t

2.5 t-tS *
T • 0
*1 F C"H"I'"p"s;rE"L"E"CT
AFTER THIS TIME,
CONTROLLER WI LL
~._ _.;;E;.;N.;TER A CHARACTER.

READY

READS IN CONTROL WORD

DATA INPUT. D7

INITIALIZES AS LEFT ENTRY
MODE, 32 CHARACTER DISPLAY
LENGTH

Figure 9. Power-On/Master Reset Timing for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.

7-64

Custom Character Sets
The HDSP-2472 system has been specifically designed to
permit the user to insert a custom 128 ASCII character set.
This system features a 24 pin socket that is designed to
accept a custom programmed 1 K X 8 PROM, EPROM, or
ROM. The read only memory should have an access time::;
500ns, IlL::; I-AmAI and IIH ::;40!,A. A listof pin compatible
read only memories is shown in Figure 10. Jumper
locations are provided on the HDSP-2472 P.C. board
which allow the use of ROM's requiring chip enables tied
either to 0 or 5V. For further information on ROM
programming, please contact the factory.

~
'-- PEAK

/

L
/

..,.L

Power Supply Requirements
The HDSP-247X Alphanumeric Display System is
designed to operate from a single 5 volt supply. Total Icc
requirements for the HDSP-247X Alphanumeric Display
Controller and HDSP-24XX Display Panel are shown in
Figure 11. Peak Icc is the instantaneous current required
for the system. Maximum Peak Icc occurs for Vee =5.25V
with 7 dots ON in the same Column in all display
characters. This current must be supplied by a
combination of the power supply and supply filter
capacitor. Maximum Average Icc occurs for Vee = 5.25V
with 21 dots ON per character in all display characters.
The inclusion of a 375 X microfarad capacitor (where X is
the number of characters in the display) adjacent to the
HDSP-247X Alphanumeric Display System will permit the
use of a power supply capable of supplying the maximum
average Icc.

.50

4

L

8

L

Icc. ALL SVSTE'f7 IL

4

/

V

,

~

".

IL

AVG.lcc .

ispr~ ~
..-,:~
AVG. Icc. HDSP·2470

12 16 20 24 28 32 36 40 44 48
DISPLAV LENGTH

Figure 11. Maximum Peak and Average Icc for the HDSP2470171/72 Alphanumeric Display Controller and HDSP-2000

Display.
CONNECTORS
FUNCTION

TYPE OF
CONNECTOR

CONTROL/DATA
ENTRY

26 Pin
Ribbon Cable

3M PIN 3399· XOOO Series

3 Pin
With Locldng

Mol .. PIN 09-50-3031 with
08·50-0106 Terminals

POWER(l!

SUGGESTED
MANUFACTURER

Ramp
DISPLAY

DRIVE(i.31

17 Pin

Board to Board
Pin/Socket

Pin: BERG pin 75409-041
Sockel: BERG
pin 65780-017

NOTES:
(1) Power leads should be 18-20 gauge stranded wire.
(2) The maximum lead length from the controller board to the
display should not exceed 1 .!!!!ill!.

EXTERNAL CONNECTION'
PART NUMBER

MANUFACTURER

TYPE

CONSTRUCTION

~

~

Y

GND

GND

+5

NC

NC

NC

+5

+5

GND

NC

NC
GND

2758

Intel

EPROM

NMOS

7608

Harris

PROM

8IPOLAR-NiCr

3628-4

Intel

PROM

8IPOLAR-S;

82S2708

Signetics

PROM

BIPOLAR-NiCr

NC

6381

Monolithic Mem.

PROM

BIPOLAR-NiCr

+5

+5

6385

Monolithic Mem.

PROM

BIPOLAR-NiCr

NC

NC

NC

87S228

National

PROM

BIPOLAR-TiW

+5

+5

GND

93451

Fairchild

PROM

BIPOLAR-NiCr

+5

+5

GND

68308

Motorola

ROM

NMOS

NC

NC

2607

Signetics

ROM

NMOS

NC

NC

30000

Mostek

ROM

NMOS

+5

NC

"Board jumpers correspond
to pins 18, 19 & 21 of ROM.
"" As defined by customer

Figure 10. Pin Compatible 1K x 8 Read Only Memories for the HDSP-2472 Alphanumeric Display Controller.

Display Boards/Hardware
The mechanical layout of the HDSP-247X Series allows
direct mating of the controlier P.C. board to a compatible
series of display boards available from Hewlett-Packard.
These display boards consist of matched and tested
HDSP-2000 clusters soldered to a P.C. board.

.Included with the controller board are four lockingcircuit board support nylon standoffs (Richco LCBS-4l.
This hardware allows the controller board to interconnect with any of the standard display boards. Figure
12 depicts correct assembly technique.

7-65
- - - - - - - -'._._----- -_ .._-------------

Assembly Steps
1.

Insert the standoffs into .151 diameter holes (noted as
"S" on Figure 12. The long end of the standoffs should
protrude through the controller board side.

2.

Position the controller board and display board with
the components and displays facing out. The HP logo
should be in the upper left corner when viewed facing
the boards. Insert the standoffs through the mating
holes on the display board and press the boards together so that the standoffs.lock in place.

3.

Insert the pins from the display board into the socket
on the controller board.

3M Connector
(3M pIn 3429-1002)

BERG Socket
(BERG pin 65780-017)

MOLEX Connector
(MOLEX pIn 09-65-1031)

-------...
HDSP-2416/24/32140
Display Board

S

Figure 12. Assembly Drawing.

7-66

package Dimensions
3.160DIATHRU
f,i5fl4HOLES

HOSP 241DI 2411/-2472
DESCRIPTION

PIN

I

,
•
,••
••
Z

ID
II
IZ

."

""
"
""
"
"
II

ZI
ZZ

.

24

UNLESS OTHERWISE SPECIFIED.,DIMENSIDNSARE IN IIlIn AND (INCHES)

cmnnm

DATA VALID

RAM ADDRESS, Ao
DATAIN,D,
RAM ADDRESS, AI

Iimf

ABC OE fG HI JIllMNDPO

RAM ADDRESS, AJ

DATADUT,DD.
RAM ADDRESS, A]
DATA our, DOS
DATAIH,Da
DATA OUT' DO.
DATA IH,D,
DATA DUT,DD,
DATAIN,DZ
DATA DUT,DDz
DATA IH,D]
DATA DUT,DDI
DATAIN,D4
DATA DUT,DD.
DATAIN,OS
READY
DAM IN, D,
COLUMN ON
RAM ADDRESS, A4
DISPLAY BLANK. V•

~~EjEH~vee

GND~
I

YX

r---~

2aPIN·RH
CONNECTOR-lM

..

I------------::.~::I'REF---------

Figure 13. HDSP~2470/-2471/-2472

2.921t.5D8
(."Slt.OlD

HOSP·Z416/·2424/·Z43V·2oW!
PIN

•

',C
D,'

F.'
H,I

J,K
L
M
N,D
P,-

HoSP-Z410/2411/Z4J2
DESCRIPTION
DISPLAY BLANK, v•
COLUMN!
COLUMN!
COLUMN)
COLUMN..
CDlUMNIj
CLOCK
DISPLAY DATA

Vee

GND

l

64.694
(2.5411

L-.....--.

1-

i (::~:ITYPmr"U"" 11riZ.54 I1PLCS
~

(.100)

TVP

r-~
..,7!iDD4'HAOTL~~U

\ ,.ID',

TVP

r

1 •.~•~~~f';'5~4======~~::::::::::::~~Q'~'~'.~L~'~"~H~GF~'~'~C'~A::::::::::~~L---.

5IAZII:!:.501 "'.,,".,"-".D,,"'---_ _--f(il_

tmOJ,.DZD

t t

I-__
f~!:::~EE:E::::~==E=J:::-=f-~~H

1
J r.mr
l

(1.I2.5It.D,O
2I.51S t.Z54

.~--+I+-i--r-r.DIg.IAV

10.312

L - - __ ,

.

-~_-_--'~
---

t-----

1&.I04±,!iDll

__ __ ________+-__~____+-__-+__~~·ft~
(1)

~~~~:'.D="~~~::~~ ~~ ~

I

1
A

HDSP-Z4'&

B

HDSP-2424

:,"~:I ~IAHJ'~ERSU

12.Z94:!:.Z54

tm,DlD-

r-

I----_-/+--.-.-c--+-------I--+l-,....-+I
Ii. DISPLAYS

----'___ ,.Bllt.154

l'~OO'.DlD

I','I'I~_'.D5'~D~-

4,..

I

~-----+l.

1(:~4~~~:::::---------------1
Figure 14. HDSP-2416/-2424/-2432

4.150 DIA THRU

(.18714 HOLES
2.692DIATHRU

T.iDif4HDLES

I~~--------------~---+:-----------------rt---~I
83.120
t DISPLAYS
/+----------~--------~I

~1~,31 :~~~

I--------------~:::~:------I

I-----------W'O;:::::--------------I
Figure 15. HDSP-2440

7-67

r

7•112
1JiDj

7.6211
(.3001

Flin-

HEWLETT

~~ PACKARD

LED SOLID STATE
ALPHANUMERIC
INDICATOR

5082-1100
5082-7101
5082·1102

TECHNICAL DATA

JANUARY 1986

Features
5 x 7 LED MATRIX CHARACTER
LARGE 6.9 mm {.27 INCH) CHARACTER HEIGHT
EXTREMELY WIDE TEMP. RANGE
COMPACT 15.2 mm (.600 INCH)
GLASS/CERAMIC DIP
• WIDE VIEWING ANGLE
• RUGGED, SHOCK RESISTANT
•
•
•
•

Typical Applications
•
•
•
•

COMPUTER PERIPHERALS
MILITARY EQUIPMENT
INDUSTRIAL EQUIPMENT
AVIONICS

Description
The Hewlett-Packard 5082-7100 Series is an X-V addressable, 5 x 7 LED Matrix capable of displaying the
full alphanumeric character set. This alphanumeric indicator series is available in 3,4, or 5 character endstackable clusters. The clusters permit compact presentation of information, ease of character alignment,
minimum number of interconnections, and compatibility with multiplexing driving schemes.
The 5082-7100 is a three character cluster.
The 5082-7101 is a four character cluster.
The 5082-7102 is a five character cluster.

Absolute Maximum Ratings
Max.

Units

IpEAK

100

rnA

Average Current Per LED

I AVO

10

rnA

Power Dissipation Per
Character (All diodes Iitjl11

Po

700

mW

Operating Temperature, Case

Tc

-55

95

.oC

Storage Temperature

Ts

-55

100

DC

Reverse Voltage Per LED

VR

4

.V

Parameter

Symbol

Peak Forward Current Per LED
(Duration <:; 1 rns)

Note 1: At 25 DC Case Temperature; derate 8.5mWfDC above 25 DC.

7-68

Min.

Electrical I Optical Characteristics at Tc= 25°C
Symbol

Min.

Typ.

Peak Luminous Intensity Per LED
(Character Average) @ Pulse
Current of 100mA/LED

Iv (PEAK)

1.0

2.2

moo

Reverse Current Per LED @ VR =4V

IR

10

p.A

Peak Forward Voltage @ Pulse
Current of 50mA/LED

VF

1.7

Peak Wavelength

ApEAK

655

nm

Spectral Line Halfwidth

!l.}..,/2

30

nm

Rise and Fall Times [1)

t r• tf

10

ns

Parameter

Max.

Units

2.0

V

Note 1. Time for a 10% - 90% change of light intensity for step change in current.
50

«

..

40

>

.

E

~

I

zw

II:
II:

~
!!l
Q

30

:>

u

Z

Q

:§

II:

~
II:

:3

20

w

>

~

5

I

.l!-

w

II:

10

r·
0.8

0.4

v. -

Figure 1.

lI

200

iii..J

150

100
80

l!!

!

I

60

I

1/50

40

l/j~

~
w

~

II:

w

20

~
w

:>E

;::

10

.4

Figure 2.

.,-;1
DUTY

FACTOR

!!l.
~

TC - CASE TEMPERATURE

Forward Current-Voltage Characteristic.

~

~

2.0

1.6

FORWARD VOLTAGE - V

II:

lI1

/
1.2

/.~ 7~
.6

11}}//.

//
V

=- 1n

I-

Relative Luminous Intensity ¥s. Case
Temperature at Fixed Current Level.

1.0

.8

.-~

!

/

V

~
/'

~

---

.6

~

.8 1.0

20

8 10

40

60

80

100

PEAK CURRENT PER LED - mA

AVERAGE CURRENT PER LED - rnA

Figure 3.

_·c

Figure 4.

Typical Time Average Luminous
Intensity per LED vs. Average
Current per LED.

7-69

Typical Relative Luminous Efficiency vs.
Peak Current per LED.

Package Dimensions and Pin Configurations
5082·11001710117102

5082-110t
OR1EIIITAT(()N MARK METAL TAl!

("lr'~:~~~51~TE;:'~+-~~~~_
22.aG

:

1.1(0)

4

31i. I L.. --&~+-----"'-"-';==--=--11.2301 !
I
I -15

(.$0)

1

10

_1_____

---~-::bi-+--==r-=---

3&

35

34

33

U,,_
II

at

(~\:z~::cjt=
. :

MAX.

31

30
29

:-;;EI+-----=::.:.:..=:;==--=---

7.
10

20
19
18

11
16

'5

29
r7411.~--

t1

26

'2

U

13~+---"'~i='-"-14
16

23

24

22
21
20

No_

1.o_ _ 1. "'iIIi........nd u._).
a Character SiZe 6.9 x4.9mm f.21 x .19 ;n+t.

_

19

:t. u..... otberW"" spodfind, tho t_nco 00 an di",".,io•• Is ~O.38m.. 1••01S in.l.

Device Pin Description
5082-7101

5082·7100

Pin

Function

Pin

1

N/G

15

AnodeC

2

3

10
18

4c
4a

3

4
5

16
17
18

2b

Anode iii
$a

4
5

3b

6

24

4c

$a
2e
2e

7

2e

25

8

Anode E

N/C
AnodeG
3d

Function

Pin

Function

Pin

1
2
3
4
5

AnodeG

AnodeB
3d
3b
Anode A

6

2b

7

2d
AnodeC
$a

12
13
14
15
16
17
18
19
20

8
9

1e
1d
Anode F
Anode E

10

3c

11

$a

21
22

2e
20
2a
Anode 0

1e
1b

ta

5082-7102

Function

Pin

6
1

S
9
10
11
12
13
14

Anode G

19
20
21
22

2d
Anode 0
Anode E
3c
3d
AnodeF

23

Pin

Function

1

N/C

2

10
1e
Anode F
2b
2d

19
20
21
22

lie
60
5e
Anode 0
4e

I)

3c
$a

Anode A
1d
lb.

10
11
12
13

AnodeG

29

4e

18

14

5b

30
31
32
33
34

Anode A
ld

5d
N/C

35
36

1b
la

2s

4d

4&

28

15
16

17
18
18 1b 1c' 1d 1e 28 2b 2c 2d 2e
A

o

5082·7100/7101/7102
Schematic Wiring Diagram

23
26
21
28

24
25
26
27

4b

Function

4b-

4d
N/C

3a 3b 3c 3d 3e 4a 4b 4c 4d 4e Sa 5b 5c 5d 5e

.:jI. .'J1i.:jl. Jf-'1/'
.:jI..'J1 1/"Jf- 'ci.:jI.Jf- .:jI.Jf- 'Jf".'.'1/' r.:jl. rJii '1/'
Jf-'~ i..* i~ ';tl'
.:jI.';tl' 1..* 1/"1/'
1l"". I., r., '1l'

G i-CHARACl"ER l-i-CHARACl"ER 2+i-CHARACTER 3+CHARACl"ER 4+CHARACTER 5-.\

7-70
----~-------

-----~------

3b
$a
AnodeB
2e

2e

operating Considerations
ELECTRICAL
The 5 x 7 matrix of LED's, which make up each character, are X-V addressable. This allows for a
simple addressing, decoding and driving scheme between the display module and customer furnished
logic.
There are three main advantages to the use of this type of X-V addressable array:
1. It is an elementary addressing scheme and provides the least number of interconnection pins for the
number of diodes addressed. Thus, it offers maximum flexibility toward integrating the display into
particular applications.
2. This method of addressing offers the advantage of sharing the Read-Only-Memory character generator
among several display elements. One character generating ROM can be shared over 25 or more 5 x 7
dot matrix characters with substantial cost savings.
3. In many cases equipment will already have a portion of the required decoder/driver (timing and clock
circuitry plus buffer storage) logic circuitry available for the display.
To form alphanumeric characters a method called "scanning" or "strobing" is used. Information is
addressed to the display by selecting one row of diodes at a time, energizing the appropriate diodes in
that row and then proceeding to the next row. After all rows have been excited one at a time, the
process is repeated. By scanning through all rows at least 100 times a second, a flicker free character
can be produced. When information moves sequentially from row to row of the display (top to bottom)
this is row scanning, as illustrated in Figure 5. Information can also be moved from column to column
(left to right across the display) in a column scanning mode. For most applications (5 or more charac·
ters to share the same ROM) it is more economical to use row scanning.
MECHANICAL/THERMAL MOUNTING
The solrd state display typically operates with 200mW power dissipation per character. However, if the
operating conditions are such that the power dissipation exceeds the derated maximum allowable value,
the device should be heat sunk. The usual mounting technique combines mechanical support and thermal
heat sinking in a common structure. A metal strap or bar can be mounted behind the display using
silicone grease to insure good thermal control. A well·designed heat sink can limit the case temperature
to within 1DoC of ambient.

READ ONLY
MEMORY

ROW
DRIVERS

Figure 5.

Row Scanning Block Diagram.
7-71

~~~~~.-.-----.-

- .....

-.~~~~-

-~~~~--~~~~~~~~~~~~~-

r~3

HEWLETT

. .:~ .PACKARD

16SEOMENT
SOLID STATE
, ALPHANUMERIC
DISPLAY

HDSP-6504
HOSP-6608

TECHNICAL DATA

JANUARY 1986

Features
• ALPHANUMERIC
Displays 64 Character ASCII Set and
Special Characters
• 16 SEGMENT FONT PLUS CENTERED D.P.
AND COLON
• 3.81mm (0.150") CHARACTER HEIGHT
• APPLICATION FLEXIBILITY WITH
PACKAGE DESIGN
4 and 8 Character Dual-In-Llne Packages
End Stackable-On Both Ends for 8 Character and
On One End for 4 Character
Sturdy Gold-Plated Leads on 2.54mm (0.100")
Centers'
Environmentally Rugged Package
Common Cathode Configuration
• LOW POWER
As Low as 1.0-1.5mA Average
Per Segment Depending on Peak
Current Levels
• EXCELLENT CHARACTER APPEARANCE
Continuous Segment Font
High On/Off Contrast
6.35mm (0.250") Character Spacing
Excellent Character Alignment
Excellent Readability at 2 Metres
• SECONDARY BARREL MAGNIFIER AVAILABLE
Increases Character Height to 4.45 mm (0.175")
• SUPPORT ELECTRONICS
Can Be Driven With ROM Decoders and Drivers
Easy hiterfaclng With Microprocessors and
LSI Circuitry
• CATEGORIZED FOR LUMINOUS INTENSITY

Description
The HDSP-6504 and HDSP-650B are 3.B1mm (0:150")
sixteen segment GaAsP red alphanumeric displays
mounted in 4 character and B character dual-in-line
package configurations that permit mounting on PC
boards or In standard IC sockets. The monolithic light
emitting diode character Is magnified by the Integral lens
which increases both character size and luminous
intensity, thereby making low power consumption
possible. The rugged package construction, enhanced by
the backfill design, offers extended environmental capabilities compared to the standard PC board/lens type of display
package. Its good temperature cycling capability is the
result of the air gap which exists between the semiconductor chip/wire bond assembly and the lens. In addition to
the sixteen segments, a centered D.P. and colon are included. Character spacing yields 4 characters per inch.

Applications
These alphanumeric displays are attractive for applications such as computer peripherals and terminals,
computer base emergency mobile units, automotive
instrument panels, desk top calculators, in-plant control
equipment, hand-held instruments and other products
requiring low power, display compactness and alphanumeric display capability.

7-72

Device Selection Guide
Configuration

Characters
Per
Display

Device

Part No.
HDSP-

Padll8ge

4

(Figure 6)

6504

8

(Figure 7)

650B

Absolute Maximum Ratings
Mall.

Units

200

mA

7

mA

13B

mW
°C

Reverse Voltage

85
100
5

Solder Temperature at 1.59mm
(1/16 inch) below seating plane.
t::;; 3 SSfondS

260

°C

Symbol

Parameter

Min.

J~AK

Peak if"orwaM' Current Per Segment
or DP (Duration::;; 3f2ps)

IAVG

Average Current Per Segment or
DP(1]

PD

~~SSjPation Per

TA

o

Ts

Storage Temperature

VR

rature, Ambient

-40
-40

"c
V

NOTES:
1. Maximum allowed drive conditions for strobed operation are derived from Figures 1 and 2. See electrical section of operational
considerations.
2. Derate Ii~early above TA = 50°C at 2.17mW/oC. Po Max. ITA = 85°C) = 62mW.

Electrical/Optical Characteristics at TA=25°C
Symbol

Parameter

Test CondlAon

Min.

Typ.

0.40

1.65

Mall.

Units

IPEAK =30mA
1/16 Duty Factor

Iv

Luminous Intensity, Time
Average. Character Total with
16 Segments Illuminated [3,41

VF

Forward Voltage Per
Segment or DP

APEAK
Ad

Peak Wavelength

IR

Reverse Current Per
Segment or DP

AVF/AoC

Temperature Coefficient of
Forward Voltage

-2

ROJ-PIN

Thermal Resistance LED Junction-to-Pin

232

IF= 30mA
(One Segment On)

1.6

I

Dominant Wavelength [5}
VR=5V

mcd

1.9

V

655
640

nm

10

JlA

nm

mVl"C

°OIW!

seg

NOTES:
3. The luminous intensity ratio between segments 'within a digit is designed so that each segment will have the same luminous
sterance. Thus each segment will appear with equal· brightness to the eye.
4. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower peak
currents may cause intensity mismatch within the display. Operation at peak currents less than 7 rnA will cause objectionable
display segment matching.
5. The dominant wavelength, Ad, is derived from the C.I.E. chromaticity diagram and represents that single wavelength which defines
the color of the device, standard red.

7-73
---------------_._----

1I

II:

!ow

~

'"

'";::

~

II:
II:

..ffi

Z

U

"~

Q

I

I

.g-

j"

TA - AMBIENT TEMPERATURE _ DC

tp - PULSE DURATION - I-IS

Figure 1. Maximum Allowed Peak Current vs. Pulse Duration. Derate derived
operating conditions above T A = 50° C using Figure 2.

,.u

zw

ij

~w
~

I-

:5w
II:

I

"~

"

1.5
1.4
1.3
1.2
1.1

Figure 2. Temperature Derating Factor
For Peak Current per Segment vs.
Ambient Temperature. T JMAX = 110°C

..

E
I

I-

160

II:
II:

140

zw

1.0
O.g
0.8
0.7

'"uc
II:

0.5
0.4
0.3
0.2

120

~

100

~

80

II:

0.6

200
180

"~
I

"
~
VF - PEAK FORWARD VOLTAGE - V

IpEAK -" PEAK SEGMENT CURRENT - mA

Figure 3. Relative Luminous Efficiency
(Luminous Intensitv Per Unit Currentl
vs. Peak Segment Current.

Figure 4. Peak Forward Segment
Current vs. Peak Forward Voltage.

For a Detailed Explanation on the Lise of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.
A3 Az Al Ao

1

A4

0

0

A5

0

0

2

0

3

5

4

6

7

B

9

C

B

A

D

E

F

fE R 11 C lJE F G H I J f-< L M N 0

PQR5TUVWXYZ[
:E ,9] % jj
< ) *+
[} 3 Y 5 5 1 B 9
0
/I

/

Figure 5.

Typical 64 Character ASCII Set.

fZ]

o
Additionai Character Font

7-74
~---~~------------

\

J~

/

/

L

~

~

?

package Dimensions

I~~~I TYP.

PIN 1
INOTE 31

=

NOTE4

E[02OJ

It

1*

II
.

254
I I
1.;001 TYP.--I )4-

---r

3.Bl' .25
(.150 ± .010)

3.81 ± .25
1.150' .0101

NOTES,
1. ALL DIMENSIONS IN MILLIMETRES AND (lNCHESI.
2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.
3. PIN 1 IDENTIFIED BY INK DOT ADJACENT TO LEAD.

Figure 6. HDSP·6504

Figure 7. HDSP·650S

Magnified Character
Font Description

Device Piln Description
Function
Pin
No.

DEVICES
HDSP·6504
HDSP·6508

r.

1
2

Anode
Anode
3 Cathode
4 Anode
5 Anode
6 Cathode
7 Anode
8 Anode
9 Anode
10 Cathode
11 Anode
12 Anode
13 Anode
14 Anode
15 Anode
16 Anode
17 Cathode
18 Anode
19 Anode
20 Anode
21 Anode
22 Anode

2.77REF.~
(0.109)

,n~,'~~jl

u~u(

HDSP-6504

"U
I

"'""

'~~~~:J'

23
24
25
26

Figure S.

Segment g1
Segment DP
Digit 1
Segment d2
Segment I
DigitS
Segment e
Segment m
Segment k
Digit 4
Segment dl
Segmentj
Segment Co
Segment g2
Segment 82
Segment i
Digit 2
Segment b
Segment OIl
Segment c
Segment h
Segment f

HDSP·6508
Anode
Anode
Cathode
Anode
Anode
Cathode
Anode
Anode
Anode
Cathode
Anode
Cathode
Cathode
Cathode
Cathode
Anode
Anode
Anode
Anode
Anode
Cathode
Anode
Anode
Anode
Anode
Anode

Segment gl
Segment DP
Digit 1
Segment d2
Segment I
Digit 3
Segment e
Segment m
Segment k
Digit 4
Segment dl
Digit 6
Digit 8
Digit 7
Digit 5
SegmentJ
Segment Co
Segment g2:
Segment <12
Segmenti
Digit 2
Segment b
Segment OIl
Segment c
Segment h
Segment f

7-75
._------.-._ .................. ---- ........._----_._--

..

__ ---------_._-------------------..

Operational Considerations
ELECTRICAL
The HDSP-6504 and -6508 devices utilize large monolithic
16 segment GaAsP LED chips with centered decimal point
and colon. Like segments of each digit are electrically
interconnected to form an 18 by N array, where N is the
quantity of characters in the display. In the driving scheme
the decimal point or colon is treated as a separate
character with its own time frame.
These displays are designed specifically for strobed (multiplexed) operation. Under normal operating situations the
maximum number of illuminated segments needed to
represent a given character is 10. Therefore, except
where noted, the information presented in this data sheet
is for a maximum of 10 segments illuminated per
character:
The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design may be
calculated using the following VF model:
VF = 1.85V + IPEAK (1.80)
For: 30mA :5 IPEAK :5 200mA
VF = 1.58V + IPEAK (10.70)
For: 10mA :5 IPEAK :5 30m A

OPTICAL AND CONTRAST
ENHANCEMENT
Each large monolithic chip is positioned under a separate
element of a plastic aspheric magnifying lens, producing a
magnified character height of 3.81 mm (.150 inch). The
aspheric lens provides wide included viewing angles of typically 75 degrees horizontal and 75 degrees vertical with
low off-axis distortion. These two features, coupled with'
the very high segment luminous sterance, provide to the

user a display with excellent readability in bright ambient
light for viewing distances in the range of 2 meters. Effective contrast enhancement can be obtained by employing
any of the following optical filter products: Panelgraphic:
Ruby Red 60, Dark Red 63 or Purple gO; SGL Homalite:
H100-1605 Red or H100-1804 Purple, Plexiglas 2423. For
very bright ambients, such as indirect sunlight, the 3M
Light Control Film is recommended: Red 655, Violet, Purple
or Neutral Density.
For those applications requiring only 4 or 8 characters, a
secondary barrel magnifier, HP part number HDSP-6505
(four character) and -6509 (eight character), may be
inserted into support grooves on the primary magnifier.
This secondary magnifier increases the character height
to 4.45mm (, 175 inch) without loss of horizontal viewing
angle.

MECHANICAL
These devices are constructed by LED die attaching and
wire bonding to a high temperature PC board substrate. A
preCision molded plastic lens is attached to the PC board
and the resulting assembly is backfilled with a sealing
epoxy to form an environmentally sealed unit.
The four character and eight character devices can be end
stacked to form a character string which is a multiple of a
basic four character grouping. As an example, one -6504
and two -6508 devices will form a 20 character string.
These devices may be soldered onto a printed circuit
board or inserted into 24 and 28 pin DIP LSI sockets. The
socket spacing must allow for device end stacking.
Suitable conditions for wave soldering depend upon the
specific kind of equipment and procedure used. For more
information, consult the local HP Sales Office or HewlettPackage Components, Palo Alto, California.

"More than 10 segments may be illuminated in a given c'haracter,
provided the maximum allowed character power dissipation,
temperature derated, is not exceeded.

7-76

OPTIONAL

OPTIONAL
8 DIGIT MAGNIFIER
HDSP-6509

4 DIGIT MAGNIFIER
HDSP-6505

END VIEW
(BOTH)

J

14t
1.574)

ln~1

t;,f /I'

!I

15.BB

J

LL...-___I/_'l;--d

~)

2.34
1.-1.092)

C

C

II---

L

31.BBMAX'J
11.255)

2B.BMAx.J
11.1351

MOUNTED ON HDSP·65D4

53.67MAX'-j

~''''

=1

~
50.67 MAX.
11.995)

- II

MOUNTED ON HDSp·6508

Figure 9. Design Data for Optional Barrel Magnifier in Single Display Applications.

7-77
----_._----_.__.. _---_._----

kl

9.25MAX·11

,-,

,.[t
NOTES:
1. ALL DIMENSIONS IN
MILLIMETRES AND (INCHES).
2. THIS SECONDARY MAGNIFIER
INCREASES THE CHARACTER
HEIGHT TO 4.45mm (.175 in.)

Flidl

HEWLETT·

a:~ PACKARD

·16SEOMENT
SOLID STATE
ALPHANUMERIC
DISPLAY.

HDSP-6300

TECHNICAL DATA

JANUARY 1986

Features
• ALPHANUMERIC
Displays 64 Character ASCII Set and
Special Characters
• 16 SEGMENT FONT PLUS CENTERED D.P.
AND COLON
• 3.S6mm (0.140") CHARACTER HEIGHT
• APPLICATION FLEXIBILITY WITH
PACKAGE DESIGN
B Character Dual-In-Llne Package
End Stackable
Sturdy Leads on 2.S4mm (0.100") Centers
Common Cathode Configuration
• LOW POWER
As Low as 1.0-1.SmA Average
Per Segment Depending on Peak
Current Levels
• EXCELLENT CHARACTER APPEARANCE
Continuous Segment Font
High OnlOff CO!ltrast
S.OBmm (0.200") Character Spacing
Excellent Character Alignment
Excellent Readability at 1.S Metres
• SUPPORT ELECTRONICS
Can Be Driven With ROM Decoders and Drivers
Easy Interfacing With Microprocessors and
LSI Circuitry
• CATEGORIZED FOR LUMINOUS INTENSITY

Description
The HDSP-6300 is a sixteen segment GaAsP red
alphanumeric display mounted in an 8 character dual-inline package configuration that permits mounting on PC
boards or in standard IC sockets. The monolithic light
emitting diode character is magnified by the integral lens
which increases both character size and luminous
intensity, thereby making low power consumption
possible. The sixteen elements consist of sixteen segments for alphanumeric and special characters plus
centered decimal point and colon for good visual
aesthetics. Character spacing yields 5 characters per
inch.

Applications
These alphanumeric displays are attractive for applications such as computer peripherals and mobile terminals,
desk top calculators, in-plant control equipment, handheld instruments and other products requiring low power,
display compactness and alphanumeric display capability.

7-78

Absolute Maximum Ratings
IPEAK

Symbol

Parameter
Peak/Forward Current Per Segment
or DP (Duration:S; 417ps)

IAVG

Average Current Per Segment or
DP(1]

Po

.'(

Min.

Units

150

mA

6.25

mA
."',

;;:~33

AVf,!(age Powllr Dissipation Per
Characterl1.2]

TA

Operating Temperature, Ambient

Ts

Storage Temperature
Reverse Voltage

VR

Max.

-40
-40

Solder Temperature at 1.59mm
(1/16 inch) below seating plane,
t? 5 S~conds

mW

85
100

°C

5

V

260

°C

°C

NOTES:
1. Maximum allowed drive .conditions for strobed operation are derived from Figures 1 and 2. See electrical section of operational
considerations.
2. Derate linearly above TA = 50°C at 2.47 mW;oC. PD Max. (TA = 85°C) = 47 mW.

Electrical/Optical Characteristics at TA =25°C
Symbol

Iv

VF
APEAK

Ad

Test Condition
IPEAK ",,24mA
1/16 Duty Factor

Parameter
Luminous Intensity. Time
Average, Character Total with
16 Segments Illuminated (3,4J
Forward Voltage Per
Segment or DP
Peak Wavelength
Dominant Wavelength [5J

ROJ-PIN

Typ.

400

1200

IF"" 24mA
(One Segment On)

Max.

Units

pcd

1.6

1.9

V
nm
nm

655
640

Reverse Current Per
Segment or DP

IR

Min.

10

VR"" 5V

Thermal Resistance LED
Junction-to-Pin per Character

/lA

°C/WI

250

Char,

NOTES:
3. The luminous intensity ratio between segments within' a digit is designed so that each segment will have the same luminous
sterance. Thus each segment will appear with equal brightness to the eye.
4. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower peak
currents may cause intenSity mismatch within the display. Operation at peak currents less than 7 mA will cause objectionable
display segment matching.
5. The dominant wavelength, Ad, is derived from the C.I.E. chromaticity diagram and represents that single wavelength which defines
the color of the device, standard red.

1.0

",...E
I

~
cr:
cr:

200
150

"\

100

"\

u

1'~",

50

"

I

~

~

20

7

'"
"
" '"~ ~ ~ ~
OS;.

10

!I

1

10

II

100

c:

0.8

~

0.7

~

0.6

~

0.5

§

:>

"~

."\

0.9

~~

,m

r-

......
ROJ.!'tN - 390"CIWICftAR. ""

"

0.4
I 0.35
0.3

~~F'
I

......

affi

~'2

1000

I"'\.

0.2
O. 1

III

10000

tp ';'"" PULSE DURATION -/1$

DC

50

60

70

80

TA - AMBIENT TEMPERATURE _

Figure 1. Maximum Allowed Peak Current vs. Pulse Duration. Derate derived
operating conditions above T A = 50° C using Figure 2.

7-79

"

~

85

°c

Figure 2. Temperature Derating Factor
For Peak Current per Segment vs.
Ambient Temperature. T JMAX =1110°C

I·
--

200

~

180

I

~

160

a:
a:

140

:::>
OJ

120

"a:~

100

f2

0

'"~

0

a:

I

~

=~j

40
0

o

I
I

v

r-.

1.0

1.4

1.2

1.6

2.0

1.8

IpEAK - PEAK SEGMENT CURRENT - rnA

VF - PEAK FORWARD VOLTAGE - V

Figure 3. Relative Luminous Efficiency

Figure 4. Pea'k Forward Segment
Current vs. Peak Forward Voltage.

(Luminous Intensity Per Unit Current)

vs. Peak Segment Current.

For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.

o

o

2

3

4

5

7

6

8

9

A

C

B

D

E

F

C9RIlCJJEFGHIJf- *+/

:Eg]%Jj

I 2 3Y 5 fj 1B 9
Figure 5.

/

J)1 ~

/

~?

L

Typica I 64 Character ASCII Set.

o
Additional Character Font

f

18.30' .33
1.120 , .D1S}

1

12.70<.51
{.sOD' .02m

t

/

J-V
I

I'll'll

5n

1.2061

4.06;, .25

I-- (.180. ,010}

15,.24 ± .25
1.600 ± .010)

NOTES;
1. ALL DIMENSIONS IN MllliMETRES AND {INCHES].
2. ALL UNTOlERANCED 0IM.N510N$ ARE FOR REFERENCE ONLY.
3. PIN 1 IDENTIfiED BY DOT AOJACENT TO LEAD.

Figure 6.

7-80

----

Magnified Character
Font Description

.... _ - - - - - -

Device Pin Description
Pin
Function

No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24

Figure 7.

25
26

Anode
Anode
Anode
Cathode
Cathode
Cathode
Cathode
Anode
Anode
Anode
Anode
Anode
Anode
Anode
Anode
Anode
Cathode
Cathode
Cathode
Cathode
Anode
Anode
Anode
Anode
Anode
Anqde

Segment
Segment
Segment
Digit 1
Digit 2
Digit 3
Digit 4
Segment
Segment
Segment
Segment
Segment
Segment
Segment
Segment
Segment
Digit 8
Digit 7
Digit 6
Digit 5
Segment
Segment
Segment
Segment
Segment
Segment

K

0,
C

L
G2
E

M
02
DP
A2
f

J

Co
G,

B
F
H
A1

Operational Considerations
ELECTRICAL
The HDSP-6300 device utilizes large monolithic 16 segment plus centered decimal pOint and colon GaAsP LED
chips. Like segments of each digit are electrically interconnected to form an 18 by N array, where N is the
quantity of characters in the display. In the driving scheme
the decimal point or colon is treated as a separate character with its own time frame.
This display is designed specifically for strobed (multiplexed) operation. Under normal operating situations the
maximum number of illuminated segments needed to
represent a given character is 10. Therefore, except where
noted, the information presented in this data sheet is for a
maximum of 10 segments illuminated per character:

7-81
- - - - - ._------_.

The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design may be
calculated using the following VF model:
VF = 1.85V + IPEAK (1.8n>
For 30mA:S IPEAK:S 150mA
VF = 1.58V + IpEAK (10.70>
For 10mA:S IPEAK :S 30m A
'More than 10 segments may be illuminated in a given character,
provided the maximum allowed character power dissipation.
temperature derated, is not exceeded.

OPTICAL AND CONTRAST
ENHANCEMENT
Each large monolithic chip is positioned under a separate
element of a plastic aspheric magnifying lens producing a
magnified character height of 3.56mm (0.140 inch). The
aspheric lens provides wide included viewing angles of 60
degrees horizontal and 55 degrees vertical with low off
axis distortion. These two features, coupled with the very
high segment luminous sterance, provide to the user a
display with excellent readability in bright ambient light
for viewing distances in the range of 1.5 metres. Effective
contrast enhancement can be obtained by employing an
optical filter product such as Panelgraphic Ruby Red 60,
Dark Red 630r Purple 90; SGL Homalite H100-1605 Red or
H100-1804 Purple; or Plexiglas 2423, For very bright
ambients, such as indirect sunlight, the 3M Red 655 or
Neutral Density Light Control Film is recommended.

MECHANICAL
This device is constructed by LED die attaching and wire
bonding to a high temperature PC board substrate. A
precision molded plastic lens is attached to the PC board.
The HDSP-6300 can be end stacked to form a character
string which is a multiple of a basic eight character
grouping. These devices may be soldered onto a printed
circuit board or inserted into 28 pin DIP LSI sockets. The
socket spacing must allow for device end stacking.
Suitable conditions for wave soldering depend upon the
specific kind of equipment and procedure used. It is recommended that a non-activated rosin core wire solder or a low
temperature deactivating flux and solid wire solder be used
in soldering operations. For more information, consult the
local HP Sales Office or Hewlett-Packard Components, Palo
Alto, California.

7-82

Flin-

26.6::7mm (1.05 inch)
5x::7 ~E)T l\Q6\TR IX
AlPIrIANld.MeRIC DI'5PlAY

HEWLETT

~~ PACKARD

HIGH EFFICIENCY RED

HDSP-4501/4503

TECHNICAL DATA

JANUARY 1986

Features
•
•
•
•
•
•
•

LARGE 1 INCH CHARACTER HEIGHT
5 x 7 DOT MATRIX FONT
VIEWABLE UP TO 18 METERS (60 FEET)
END AND SIDE STACKABLE
IDEAL FOR GRAPHICS PANELS
EXCELLENT CHARACTER APPEARANCE
AVAILABLE IN COMMON ANODE ROW AND
COMMON CATHODE ROW CONFIGURATIONS
• CATEGORIZED FOR INTENSITY
• MECHANICALLY RUGGED

Description
The HDSP-4501/4503 are high efficiency red alphanumeric
displays. These displays have a one inch tall 5 x 7 dot
matrix character font which provides readability up to 18
meters. Each LED element is mounted at the base of a
diffusing cavity which provides uniform dot size, spacing
and appearance.

Devices

These devices utilize a standard 10.16 mm (0.4 in) dual-inlead configuration that permits mounting on PC boards or
in IC sockets.
Applications include electronic instrumentation, computer
peripherals, point of sale terminals, weighing scales, and
industrial electronics.

Part Number

Color

Description

HDSP-4501
HDSP-4503

High
Efficiency
Red

Common Anode Row
Common Cathode Row

package Dimensions
3.25
(0,ll8)

DATE CODE

*

r-

25.61

2.54
{O.1(l1
ANODE-e

ANODE."
ANODE·dp
ANODE·,
ANOOE.g:
NOPtN

ANODE..,
CATHODE""

H
CATHODE·.
ANOOE·d
NO pIli!
CAT:HODE-c
CATHODE·e
ANODE,¢

ANODE·c
ANOOEcdp
CATHODE-dp
CATHQOEb
CATHODE-a

NOPJN
ANODE-a
AIIIODE·b

Package Dimensions (HDSP-5550 Series)
FRONT VIEW I, J
7.B0
1.3071

TOP END VIEW I, J, K, L

1 -1

LUMINOUS
INTENSITY
CATEGORY

~

1'09

B 76

FUNCTION
K

PIN
CATKODEe

ANODE.

CATHODE -1<3---+-'1

10

10

10

E

1 2 3 4

H

G

F

5

1 2 3 4 5

K

J

7-87

1

9 B 7

6

2 3 4

5

L

Absolute Maximum Ratings (All Products)
Average Power per Segment
or DP (TA = 25°C) ............................

52 mW

Peak Forward Current per Segment
or DP (TA = 25°C)1 11 ........................... 45 mA

Notes:
1. Do not exceed maximum
average current per
segment.
2. Derate maximum average
current above T A = 65° e at
0.4 mAIO e per segment. see
Figure 1. Derate maximum
DC current above TA = 78 D e
at 0.6 mAfD e per segment.

Average or DC Forward Current per Segment l21
or DP (TA == 25°C) ............................ 15 mA
Operating Temperature Range ......... -40°C to +85°C
Storage Temperature Range .......... -55° C to +100° C
Reverse Voltage per Segment or DP .............. 3.0 V
Lead Solder Temperature
(1.59 mm [1/16 inch[ below
seating plane) ........................ 260 0 C for 3 sec.

Electrical/Optical Characteristics at TA = 25° C
HIGH EFFICIENCY RED HDSP-7510 SERIES
Description
Luminous Intensity/Segment l31
(Digit Average)

Symbol
Iv

Test Conditions

Min.

Typ,

2mADC

160

270

SmADC

1050

40 mA Pk: 1 of 4
Duty Factor

3500

Max.

Units
/lcd

APEAK

635

nm

Dominant Wavelengthl4l

Ad

626

nm

Forward Voltage/Segment or DP

VF

Peak Wavelength

IF=2mA

1.6

IF=S mA

1.7

IF=20 mA Pk

2.1

V
2.5

30.0

V

Temperature Coefficient of VF/Segment or DP

::"VF/"C

-2.0

mV/"C

Thermal Resistance LED Junction-to-Pin

ROJ-PIN

200

·C/W/
Seg

Reverse Voltage/Segment or DPI51

VR

IR

100/lA

3.0

HIGH EFFICIENCY RED HDSP-3350 SERIES
Description
Luminous Intensity/Segmentl 3 1
(Digit Average)

Peak Wavelength

Symbol
Iv

Test Conditions

Min.

Typ.

2mADC

200

300

5 mADC

1200

40 mA Pk: 1 of 4
Duty Factor

3900

Max,

Units
licd

APEAK

635

nm

Dominant Wavelengthl41

Ad

626

nm

Forward Voltage/Segment or DP

VF

IF= 2 mA

1.6

V

IF =5 mA

1.7

IF"'20 mA Pk
Reverse Voltage/Segment or DPI 5 1

VR

IA'Im 100 JiA

2.1
3.0

2.S

30.0

V

Temperature Coefficient of VF/Segment or DP

j,VF/oC

-2.0

mV/oC

T~ermal

ROJ-PIN

282

"C/Wf
Seg

Resistance LED Junctlon-to-Pln

7-88

HIGH EFFICIENCY RED HDSP-5550 SERIES
S'ymbol

Description
Luminous Intensity/Segmentl 31
(Digit Average)

Iv

Peak Wavelength

Test'Condltions

Min.

Typ.

2mADC

270

370

Max.

Units
/tcd

10 mA DC

3400

40 mA Pk: 1 of 4
Duty Factor

4800

I

AFEAK

635

nm

Dominant Wa\M~j€mgthI41

)..d

626

nm

Forward Voltage/Segment or DP

VF

IF=2 mA

1,6

V

IF =5 rnA

1,7

iF=20mAPk
Reverse Voltage/Segment or DPI51

VR

2.1
3.0

IR = 100 /tA

2.5

30,0

V

Temperature Coefficient of VF/Segment or DP

::'VF/"C

-2.0

mVI"C

Thermal Resistance LED Junction-to-Pin

RBJ.PIN

345

°C/W/
Seg

3. The digits are categorized for luminous intensity with the intensity category designated by a letter on the right hand side of the package.
The luminous intensity minimum and categories are' determined by computing the numerical average of the individual segment
intensities, decimal point not included. Operation at less than 2 mA DC or peak current per segment may cause objectionable display
segment matching and is not recommended.
4. The dominant wavelength is derived from the C.I.E. Chromaticity diagram and is that single wavelength which defines the color of the
device.
5. Typical specification for reference only. Do not exceed absolute maximum ratings.

HDSP-751 0/-3350/-5550 SERIES

"E
...I

i:ia:

20

18

a:

16

w

"

I.

ffi

~

12

~

10

..

::l

I-

RUJA - nO'ClW/SEGMENT .....

R'IJA -675'cIW/SEGMENT-

t

:;;

::l

:;;

\

j\i

V

,

r

V

I

X

":;;
I

X

":;;

w

>
~

~

0

0

w m

H

~

~

~

M.

o

o

00100

TA - AMBIENT TEMPERATURE _ °C

Figure 1. Maximum Allowable Average Current per Segment as a
Function of Ambient Temperature

"E
...

i:ia:

30

j

a:

::l

"0

a:

20

";:

a:
I

10

~

o

o

0.5

1.0

/

1.5

"...in "E
~N
......
2"

/

~C!

12

40

45

/

10

/

00
2 ...
..oN
w~

V

>"
-:E

~~

/

..IV
/'
10

3.0

12

14

16

IF - SEGMENT DC CURRENT - rnA

Figure 3. Forward Current vs. Forward Voltage

Figure 4. Relative Luminous Intensity vs. DC Forward Current

7-89

---

35

/

:Eo
::lW

VF - FORWARD VOL rAGE - v

--------------

30

/

::l-

2.5

25

16

g~
2.0

20

I.

I

~

15

Figure 2. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak Current per Segment

v

'0

10

IpEAK - PEAK SEGMENT CURRENT - mA

Electrical

Mechanical

THe HDSP-7510/-3350/-5550 series of display devices are
composed of light emitting diodes, with the light from each
LED optically stretched to form individual segments and
decimal points. These displays have their p-n junctions
diffused into GaAsP epitaxial layer on a GaP substrate.

To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve DI-15 or
DE-15, Arklone A or K. A 60°C (140° F) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.

These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 3, should be used for calculating the current limiting resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following VF MAX model:
= 1.75 V + IPEAK (38m
For: IpEAK 220 mA
VF MAX = 1.6 V + loc (45f1)
For: 2 mA S loc S 20 mA

VF MAX

These displays are compatible with monolithic LED display
drivers. See Application Note 1006 for more information.

Contrast Enhancement

Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc.) and from the chlorinated
hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.) are not recommended for
cleaning LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the
packages of plastic LED devices.

The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a gray package and matching encapsulating epoxy in
the segments.
Contrast enhancement may be achieved by using one of
the following suggested filters:
Panelgraphic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or -1266
GRAY
3M Louvered Filter R6310 RED or N0210
GRAY

7-90

EMERALD GREEN
SEVEN SEGME:NT DISPLAYS
7.6 mm (O,,~O in) HDSP-7900 SERIES
14.2 mm (0.56 in) HDSP-5900 SERIES
TECHNICAL DATA

JANUARY 1986

Features
• TRUE GREEN COLOR
• TYPICAL DOMINANT WAVELENGTH OF 557 nm
• AVAILABLE IN TWO SIZES
• INDUSTRY STANDARD PINOUTS
• CATEGORIZED FOR LUMINOUS INTENSITY
AND COLOR
o EXCELLENT CHARACTER APPEARANCE

Mitered Segments
Wide Viewing Angle
Grey Body for Optimum Contrast
• COMMON ANODE OR COMMON CATHODE
Right Hand Decimal Point
Overflow ± Character

Description
The HDSP-7900 and HDSP-5900 series are 7.6 mm (0.30 in)
and 14.2 mm (0.56 in) emerald green displays. Emerald
green displays feature a shorter wavelength, true green
color. The HDSP-7900 series are designed for viewing
distances up to 3 meters and the HDSP-5900 series are
designed for viewing distances up to 7 meters. Typical
applications include instruments, scales, pOint of sale
terminals, and meters.

Devices
Part Number
HDSP-7901
HDSP-7903
HD$P-7907
HDSP-7908

Color
Emerald
Green

Description
7.6 mm Common Anode Right Hand DeCimal
7.6 mm Common Cathode Right Hand Decimal
7.6 mm Overflow ±1 Common Anode
7.6 mm Overflow ±1 Common Cathode

HDSP-5901
HDSP-5903
HDSP-5907
HDSP-5908

Emerald
Green

14.2
14.2
14.2
14.2

mm
mm
mm
mm

Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode

7-91
~~~~----""-'---------

Package
Drawing
A
B
C
D

E
F
G
H

package Dimensions (HDSP-7900 Series)

lr lJ~1

COLOR

BIN
LUMINOUS
INTENSITY
CATEGORY

MITERED CORNER FOR
PIN 1 REFERENCE

1.27

~1.0501

~"E-___

f

11.0201

~

DATE CODE

----.t

10"
.~8

TYP.

f
MINUS

c,o

A,B

,~,-8L'
J ;t
.
5.08
1.2001

Noles:
1. All dimensions in millimetres linches).
2. Maximum.
3. All untoleranced dimensions are for reference only.
4. Redundant anodes.
5. Redundant cathodes.

1.27
1.0501

FUNCTION
PIN

a

A

ANODE!4)
2 CATHOOE f
3 CATHODE 9
4 CATHODE .e5 CATHODE d
6 ANODEI')
7 CATHODE DP
8 CATHODE c
9 CATHODE b
10 CATIiOOE a
1

c

CATHODE 15/
ANODE I
ANODE,
ANOOE e
ANODE d

CATHODE "I
ANOOE DP
ANOOE c
ANODE b
ANODE"

0

ANODE 1.1
CATHODE PLUS

CATHODE
NC
NC
ANODEl')
CATHODE
CATHODE
CAiHODE
NC

M!NUS

OP
c
b

CATtlODE"1
ANODE PLUS
ANOOE MINUS

NC
Nt
CATHODE!'I
ANODE DP
ANODE t
ANODE h
NC

Internal Circuit Diagram

10

10

10

10

DP

A

c

B

7-92

DP

o

package Dimensions (HDSP-5900 Series)
TOP END VIEW E, F, G, H

FllNCTION
PIN

--.j
I

8.00
1.3151

I---

.25'

I _r~~~1

[r-r:L

E

F

G
CATHODEc

H
ANODEc

1

CATHO.DEe

2

3

CAT'HOOe d
ANOOEI41

qAtHPOEI51

CATHOO!,b

4

CATIiOOEc

ANODt,.c

ANODE •• b. OP

.CATHODE •• b. OP
ANOOE.OP

ANODEe
ANODEd

ANOOEc, d

.- CATHODE c. d
ANODEb

5

CATHODEDP

At'40DEDP

CATHOOeOp

6

CATHODEb

Af'lQOEb

CATHODE a

ANOO".•

7

ANODE.

ANQOe ••. b, DP

CATHODE •• b, DP

8

CATHODE.
ANOOEI 41

CATHOOEISI

ANODEc. d

CATHODEc. d

9

CATHODE!

ANODE I

CATHDDEd

MiODEd

10

CATHODE 9

ANODEg

NOPIN

NOPIN

1

• . J0

J L

Noles:
1. All dimensions in millimetres linchesl.
2. Maximum.
3. All untoleranced dimensions are for reference only.
4. Redundant anodes.
5. Redundant cathodes.

6.86

1.2701

FRONT VIEW G, H

SIDE VIEW E, F, G, H

Internal Circuit Diagram
10

10

E

G

F

7-93

H

Absolute Maximum Ratings (All Products)
Average Power per Segment
or DP (TA = 25°C) ............................ 105 mW
Peak Forward Current per Segment
or DP (TA = 25°C)1 11 ............................ 90 mA

NOTES:
1. Do not exceed maximum
average current per
segment.
2. Derate maximum average
current above TA = 25° Cat
0.38 mAIo C per segment,
see Figure 1.

Average or DC Forward Current per Segment l21
or DP (TA == 25°C) ............................ 30 mA
Operating Temperature Range ......... -20° C to +85° C
Storage Temperature Range .......... -55° C to +100° C
Reverse Voltage per Segment or DP .............. 3.0 V
Lead Solder Temperature
(1.59. mm [1/16 inch j below
seating plane) ........................ 260°C for 3 sec.

Electrical/Optical Characteristics at TA = 25° C
EMERALD GREEN HDSP-7900 SERIES
Description

,

Luminous Intensity/Segmentl3j
(Digit Average)

Symbol
Iv

Test Conditions

Min.

Typ.

10 mADC

220

590

Max.

Units
/tcd

1475

20 mADC
60 mA Pk: 1 of 6

750
APEAK

555

Ad

557

565

Forward Voltage/Segment or DP

VF

IF"" 10 mA

2.1

2.5

Reverse Voltage/Segment or DpI 5 1

VR

IF'" 100,..A

Peak Wavelength
Dominant Wavelengthl4 j

3.0

nm
nm
V

30.0

V

Temperature Coefficient of VF/Segment or DP

!NF/OC

-2.0

mVioC

Thermal Resistance LED Junction-to-Pin

RliJ-PIN

200

·C/WI
Seg

EMERALD GREEN HDSP -5900 SERIES
Description
Luminous Intensity/SegmentIS /
(Digit Average)

Symbol

Iv

Test Conditions

Min.

Typ.

10 mA DC

270

620

20 mA DC

Max.

Units
!Lcd

1550

60 mA Pk: 1 of 6
800
Peak Wavelength
Dominant Wavelength l4 J
Forward Voltage/Segment or DP
Reverse Voltage/Segment or DpI 5 1

ApEAK

555

Ad

557

565

nm

2.1

2.5

V

VF
VR

Ip= 10 mA

IF= 100,..A

3.0

nm

30.0

V

Temperature Coefficient of VF/Segment or DP

JVFI"C

-2.0

mVrC

Thermal Resistance LED Junction-la-Pin

RliJ·PIN

345

"C/W/
Seg

3. The digits are categorized for luminous intensity with the intensity category designated by a letter on the right hand side of the
package. The luminous intensity minimum and categories are determined by computing the numerical average of the individual
segment intensities, decimal point not included.
4. The dominant wavelength is derived from the C.I.E. Chromaticity diagram and is that single wavelength which defines the color of the
device. These displays are categorized as to dominant wavelength with the category designated by a number adjacent to the intensity
category letter.
5. Typical specification for reference only. Do not exceed absolute maximum ratings.

7-94

HDSP-7900/-5900 SERIES

50

....

ffia:

1.5

45

,.u

40

a:

"uu
"
"'X'""

'""I
X

"'"
u

2_

1.3

~~

1.2

w"

35

AI·)J .• "525'CNI/SEG

30

"

25
20

~ ....

w"
w._

" )..' ~,/

~

AClJ.A • 620"CNI/SEG""-

15

~~

.... w
""
a::::;

,"

I"

~'"
~a:

10

20

30

40

50

60

~~

R
I

R"'J.A "no'elW/SEQ'

- -o
o

70

./~

1.1

I

1.0

HOSP 7900SERIES
HOSP·5900SEAIES

80

0.9

0.7
0.6

90 100

,

I

O.B

o w m m

TA - AMBIENT TEMPERATURE _oC

~

~

~

ro

00

Figure 2. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak Current per Segment

4.0

100

/

E
I

/

....

ffi

'~"

80

~
....

60

~
u

40

~
a:

"a:

"
~

20

I

~

.!!-

0
1.0

2.0

/

~~

V

HIlSP.79ori SERIES
HIlSP·5900 SERIES

3.5

....~Ji

3.0

-"
'" .-

2.5

HDSP-7900 SERIES
HDsp·5900 SERIES

~

2 ....

/

""
;!;"
0 ....

/

2.0

"'W

"N
.... :::;

w"
>'"

~~
.... 2

1.5

1.0

W-

a:

3.0

00

IpEAK - PEAK SEGMENT CURRENT - rnA

Figure 1. Maximum Allowable Average Current per Segment as a
Function of Ambient Temperature

0:::(

/

WN

~\

10

E

1.4

0.5

o/
o

4.0

VF - FORWARD VOLTAGE-V

/

V
10

/V

/

/

15

20

25

30

IDe - DC CURRENT PER LED - mA

Figure 3. Forward Current vs. Forward Voltage

Figure 4. Relative Luminous Intensity vs. DC Forward Current

7-95
--.-- .. _----_._-------------_.

Electrical

Mechanical

The HDSP-7900/5900 series of display devices are composed
of light emitting diodes, with the light from each LED
optically stretched to form individual segments and
decimal points. The -7900 and -5900 series have their p-n
junctions diffused into a GaP epitaxial layer on a GaP
substrate.

To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve DI-15 or
DE-15, Arklone A or K. A 60°C 1140°F) water cleaning
process may also be used, which includes a neutralizer
rinse (3%. ammonia solution or equivalent), a surfactant
rinse 11% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.

These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 3, should be used for calculating the current limiting resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following VF MAX model:
VF MAX = 2.0 V + IPEAK (50n)
For: IPEAK 2> 5mA

Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a gray package and matching encapsulating epoxy in
the segments.

Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc') and from the chlorinated
hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc') are not recommended for
cleaning LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the
packages of plastic LED devices.
See Applicaton Note 1027 for additional information on
soldering and cleaning LED displays.

Contrast enhancement may be achieved by using one of
the following suggested filters:
Panelgraphic GREEN 48
SGL Hamalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY

7-96

~----------~-----------~-----~------

~-----

7.6 mm <'3 inch)
MICRO BRIGHT 7 SE6Mf;NT DISPLAYS
HDSP-7300
HDSP-7500
Y~L!'OW HDSP-7400
ItlGId PERFORMA~,~g_9R~~N HDSP·7800
TECHNICAL DATA JANUARY i986
RED
HIGH EFFICIENCY RED

Features
•

HIGH BRIGHTNESS
Package Optimized for High Ambient Conditions

•

COMPACT PACKAGE
0.300 x 0.500 inches
CHOICE OF FOUR COLORS:
Red, High Efficiency Red, Yellow,
High Performance Green
EXCELLENT CHARACTER APPEARANCE:
Evenly Lighted Segments
Mitered Segments
Wide Viewing Angle
Grey Package Provides Optimum On-Oil Contrast
EASY MOUNTING ON PC BOARDS OR SOCKETS
5.08 mm (0,2 inch) DIP Leads on 2.54 mm
(0.1 inch) Centers
AVAILABLE WITH COLON FOR CLOCK DISPLAY
COMMON ANODE OR COMMON CATHODE
Right Hand Decimal Point
Overflow ± Character.
CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN ALSO CATEGORIZED FOR
COLOR
Use of Like Category Yields a Uniform Display

•

•

•

•
o

•

Description
The HDSP-7300/-7500/-7400/-7800 Series are 7.6 mm
(0.3 inch) character LED seven segment displays in a
compact package. Designed lor viewing distances up to
3 metres (10 feet), these displays are ideal lor high
ambient applications where space is at a premium. Typical
applications include instruments, aircraft and marine equipment, point-ol-sale terminals, clocks, and appliances.

Devices
Part Number
HDSP-730l
HDSP-73li
HDSP-7302
HDSP-7303
HDSP-7313
HDSP-7304
HDSP-Y307
HDSP-73i7
HDSP-730B
HDSP/7318
HDSP-7501
HDSP-7502
HDSP-7503
HDSP-7504
HDSP-750?
HDSP-7508

Color
Red
aright Red
Red
Red
Bright Red
Red
Red
Bright Red
Red
Bright Red
HER

HDSP-7401
HDSP-7402
HDSP-7403
HDSP-7404
HDSP-7407
HDSP-740B

Yellow

HDSP-780l
HDSP-7802
HDSP-7803
HDSP-7804
HDSp·Ye07
HDSP-780B

Green

Description
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal, Colon
Common Cathode Right Hand Decimal
Common Cathode Right Hand Decimal
Common Cathode Right Hand Decimal, Colon
Overflow ±1 Common Anode
Overflow ±1 Common Anode
Overflow ±l Common Cathode
Overflow ±1 Common Cathode
Common Anode Right Hand Decimal
Common Anode Righi Hand Decimal, Colon
Common Cathode Right Hand Decimal
Common Cathode Right Hand Decimal. Colon
Overflow ±l Common Anode
Overflow ±1 Common Cathode

Package
DraWlhg
A
A
a
C
C
D
E

E
F

F
A
B
C
D

E
F

Common Anode Right Hand Decimal
Common Anode Right Hand DeCimal, Colon
Common Cathode Right Hand Decimal
Common Cathode Right Hand DeCimal, Colon
Overflow ±1 Common Anode
Overflow ±l Common Cathode

A
B
C
D

Common Anode Right Hand Decimal
Common Anode Right Hand Decimal, Colon
Common Cathode Right Hand Decimal
Common Cathode Right Hand Decimal, Colon
Overflow ±1 Common Anode
Overflow ±1 Common Cathode

A
B
C
D

7-97

E

F

E
F

package Dimensions

11 .

COLOR BIN
(NOTE 6)

254
(.010)

1.27

~1.050)

LUMINOUS
INTENSITY
CATEGORY

- ---.
.508
T . ,1.020)

--1.

DATE CODE

-----.t

TYP,

t

MITERED CORNER FOR
PIN 1 REFERENCE

10"

B,O

A,C

.254

nl
J

(,010)--"
.

---.j b-5'~~.1---

1.27

E,F

(,050)

i.2001

Notes:
,---,-1. All dimensions in millimetres (inches).
PIN
A
2. Maximum.
1 ANODE [4)
3. All untoleranced dimensions are for
2 CATHOOE f
reference only.
3 CATHODE 9
4 CATHODE e
4. Redundant anodes.
5 CATHODE d
5. Redundant cathodes.
6 ANODE)')
1 CATHODE DP
6. For HDSP-74001-7800 series product only.
CATHODE c
8
9 cATHODE fJ
10 CATHQDE a

fUNCTION
CATHODE COLON

C
CATtiODErSJ

CATHODE j
CATHODE 9
CATHODE.
CATHODE d
ANODE
CATHODE Dr
CATHODE c
CATHODE b
CATHODE.

ANODE f
ANooe.
ANODE.
ANODE d
CATHODE is)
ANODE DP
ANODE.
ANODE b
ANOOE.

B

0

~

ANODE COLON
ANODE f
ANODE 9
ANODE e
ANODE d
CATHODE
ANODE DP
ANODE c
ANODE b
ANODE.

ANODE)')
CATHODE
CATHODE
NC
NC
ANODE [41
CATHODE
CATHODE
CATHODE
NC

F

PLUS
M)NUS

DP

c
b

CATHODE[S)
ANODE PLUS
ANODE MINUS
NC
NC
CATHODE(5)
ANODE DP
ANODE c
ANODE b
NC

Internal Circuit Diagram
10

10 1

1

dp

A

B

10

1

10

1

9

2

8

3

9

2

8

3

7

4

7

4

6

5

6

5

8

3

dp

dp

C

E

0

10

dp

F

Absolute Maximum Ratings
HDSP·73001
-7310 Series
Average Power Dissipation per Segment or D.P,
Operating Temperature Range 171
Storage Temperature Range
Peak Forward Current per Segment or D.p.ISI
DC Forward Current per Segment or D.P. [9)
Reverse Voltage per Segment or D.P.
Lead Soldering Temperature
1.59 mm (1/16 inch) below seating plane

HDSP·7500
Series

HDSP·7400
Series

73mW

105 mW
81 mW
-40°C to +85°C
-55°C to +100·C

150mA
25mA
3V

90mA
30 mA
3V

60mA
20mA
3V

HDSP-7800
Series
105mW
-20°C to +85°C
90mA
30mA
3V

260· C for 3 sec.

7. For operation of HDSP-7800 series to -40' C consult Optoelectronics division.
8. See Figures 1, 6, 7, and 8 to establish pulsed operating conditions. (Figure 1, HDSP-7300 Series; Figure 6, HDSP-7500 Series;
Figure 7, HDSP-7400 Series; Figure 8, HDSP-7800 Series)
9. See Figures 2, 9, 10, and 11 to derate maximum DC current. IFigure 2, HDSP-7300 Series; Figure 9, HDSP-7500 Series; Figure 10,
HDSP-7400 Series; Figure 11, HDSP-7800 Series)

7-98

Electrical/optical Characteristics at TA = 25°C
STANDARD RED HDSP-7300 SERIES
Description

Device
HDSP·

Symbol

7300

Iv

Luminous Intensity/Segment{ IOI
(Digit Average)

7310
.

Peak Wavelength

Min.

Typ.

10 rnA DC
20 mPi'DC

600

500"
1100

10mADC
20mADC

770

610
1355

Test Conditions

APEAK

655

Dominant yvavelength}11]

Ad

640

Forward Voitage. any Segment or D.P.

VF

IF=20 rnA

Reverse Voltage, any Segment or D.P.l 13 )

VR

IR"" 100 /.lA

1.6
3.0

Max.

Units

/.lcd

nm
nm
2.0

V

12.0

V

TemperatlireC6effideQ~.ofyorward Voltage

::,vF/o C

-2.0

mV/oC

Thermal Resistance LED Junction-!o-Pin

R8J-PIN

200

°C/WI
Seg

HIGH EFFICIENCY RED HDSP-7500 SERIES
Description
Luminous Intensity/Segment {IO]
(Digit Average)

Peak Wavelength

Symbol
Iv

Test Conditions

Min.

Typ.

5mAD.C.

360

980

20 rnA D.C.

5390

6'0 mA Pk: 1 of 6
Duty Factor

3430

Max.

Units
/.lcd

APEAK

635

nm

Dominant Wavelength [II]

Ad

626

nm

Forward Voltage/Segment or D.P.

VF

Reverse Voltage/Segment or D.p.IISl

IF"'5 mA

1.7

IF=20mA

2.0

IF ""60 rnA

2.8

2.5

V

30.0

V

Temperature Coefficient of VF/Segment or D.P.

tNF/OC

-2.0

mV/oC

Thermal Resistance LED Junction-to-Pin

R8J _PIN

200

°C/W/

VR

IR "'100 /.lA

3.0

Seg

YELLOW HDSP-7400 SERIES
Description
Luminous lntensity/Segment{10j
migit Average)

Peak Wavelength

S'ymbo'
Iv

Test Conditions

Min.

Typ.

SmA D.C.

225

480

20 rnA D.C.

2740

60 rnA Pk: 1 of 6
Duty Factor

1700

Ad

Forward Voltage/Segment or D.P.

Vp

581.5

586

Unill~

/.lcd

583

APEAK

Dominant Wavelengthl11.121

Max.

nm
592.5

nm

2.5

V

1.8

iF=5 mA
iF=20mA

2.2

IF =60 mA

3.1
50.0

V

Temperature Coefficient of VF/Segment or D.P.

AWrC

-2.0

mVioC

Thermal Resistance LED Junction-ta-Pin

RIIJ- PIN

200

°C/W!
Seg

Reverse Voltage/Segment or D.p.[13j

VR

IA=100/.lA

3.0

10. The digits are categorized for luminous intensity with the intensity category deSignated by a letter on the right hand side of the
package. The luminous intensity minimum and categories are determined by computing the numerical average of the individual
segment intensities. decimal point not included.
11. The dominant wavelength is derived from the C.I.E. Chromaticity diagram and IS mat single wavelength which defines the color of
the device.
12. The HDSP-7400/-7800 series are categorized as to dominant wavelength with the category designated by a number adjacent to the
intensity category letter.
13. Typical specification for reference only. Do not exceed absolute maximum ratings.

7-99

HIGH PERFORMANCE GREEN HDSP-7800 SERIES
Description

Symbol

Luminous Intensity/Segmentl 9 1
(Digit Average)

Iv

570

]ted

1935

Duty Factor

566tm

nm
nm

571

Ad

Forward Voltage/Segment or D.P.

VF

IF= 10 mA

Reverse Voltage/Segment or D.P.l121

VR

IR = 100 itA

Thermal Resistance LED Junction-to-Pin

Units

1480

60 mA Pk: 1 of 6
APEAK

Dominant Wavelength[10. l1J (Digit Average)

Max.

545

10 mA D.C.

Peak Wavelength

Typ.

Min.

Tesl Conditions
SmAD.C.

2.~

3.0

V

2.5

V
·CIWI

50.

200

RIlJ_P1N

Seg

HDSP-7300 SERIES
OPERATION IN THIS REGION REOUIRES
TEMPERATURE DERATING OF Ioe MAX. ]

20
28

~

15

I

!Z
w
ex:
ex:

25 24

'"'\

\\

20

ReJA
T\~
• 595"CIWISEGMENT

::>

u

g

16

.1,.1

ROSA

~ 12,5 ,

:;;

• 770'CIWISE(lMENT.....

12

I

~

:;;
I

::l:;;
u

E

o

o

.1.

1

20

I

.. 1

40

60

L

j

80

100

TA - AMBIENT TEMPERATURE _

1

120 140

°c

tp - PULSE DURATION - ,uSEe

Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration

>-

1.1

ffi

u

itw

1.0

r--·

w

>
;::

~
ex:

"

.9

..,...-

160

~

140

:;;

V

-(

~

120

'"~
...

100

ffi
ex:

80

::>

60

ex:

u

w

N

~:;;

"T
...

u

"ex:
~

.8

ex:

0

Z

.7

o

10

20

30

I

40

~
I

50

IpEAK - PEAK SEGMENT CURRENT - rnA

Figure 3. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
Peak Current per Segment

"'

Figure 2. Maximum Allowable DC Current
Dissipation per Segment as a
Function of Ambient Temperature

I.'
>--

1.2

......
;,,,

1.0

::>w
... N
w::;

.6
.4

~~

'0r- -

..

00

;,'"
:;;0

>"
-:;;

-

40

o

... "

0; E

I-- I-- .

wZ

ex:3.2
IF - SEGMENT DC CURRENT - mA

Figure 5. Relative Luminous Intensity vs.
DC Forward Current

---------------

50
OPER ATION IN
THIS REGION
REQUIRES
TEMP ERATURE
DER ATINGOF
IDe M AX.

10
8
6
5
4

40

a:
a:

35

~

::J

""
"

"
X
"
"x",
""

,'\.
~

1t
~~ ~~'1

10

1;.

100

~

1000

30

"'- \. ~.~,
r....

25

RUJA '" 520~C/VlljSEG-

20

r>-.: "

ROJA '" 635~CfWISEG

15
10

.9

o

DC OPE RATION

a

10

20

30

40

~~

"1

RilJA\'" 770"CMISEG

u

~

10000

45

.:.

::J

>o~

1

"E

50

60

J

70

80

90 100

TA- AMBIENT TEMPERATURE _ °c

tp - PULSE DURATION - j.LSEC

Figure 6. Maximum Tolerable Peak Current vs. Pulse Duration HDSP-7500 Series

Figure 9. Maximum Allowable DC Current and DC
Power Dissipation per Segment as a
Function 01 Ambient Temperature HDSP-7500 Series

20

",
E

18

t-

16

a:
a:

14

~

\

"X
"
"x",
::J

IA

ROJA '" 600"CIWISEG

::J

"""

\
t('~
\

I

ROJA '" 770°C/W/SEG

12
. 10

""
c
u

00

10

tp - PULSE DURATION - /lSEC.

20

30

40

50

60

70

80

90 100

TA - AMBIENT TEMPERATURE _ °C

Figure 7. Maximum Tolerable Peak Current vs. Pulse DurationHDSP-7400 Series

Figure 10. Maximum Allowable DC Current and DC
Power Dissipation per Segment as Ii
Function 01 Ambient Temperature HDSP-7400 Series
50
t-

45

~

40

::J

35

a:
a:

""
"

"X
::J

"
""x
""
I

u

I--- RBJ.A

30

'-..

25
20

---

15

525"CiW/SEG

" '" /
" '<,
,,

t"-..

R0J.A .620"CiW/SEdA...

10

RHJ.A '"'

.9

oa

=

10

20

30

-

770~CNJISEG

40

50

60

I'~'
70

80

TA - AMBIENT TEMPERATURE -

90 100

~c

Figure 11. Maximum Allowable DC Current per
Segmenl'vs. Ambient Temperature HDSP-7800 Series

Figure 8. Allowed Peak Current vs. Pulse Duration HDSP-7800 Series

7-101
._--------------------

'1
I

I

1.S

>

f- HDSP-7400)y

u

~

1.6

*"

1.4

I /'

>
;:

uJ

1.2

a:
I

~

~

1.0

'"
D.S

"
E
I

I

80

/

....
~

"""-Hose-7aOD

-/1

a:
a:

-

60

:0

u

"~

a:

HDSj7500,-

fr

I
.!!-

20

40

60

80

0

100

IpEAK - PEAK SEGMENT CURRENT - rnA

Figure 12. Relative Luminous Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Segment
Current

I

,!t~H~SP'7800

0
20

J

'HDSP.7400

40

a:

r/,
0

100

/HDSP.7500

f/

OJ
w

/

1.0

2.0

3.0

4.0

2~~V
5.0

VF - FORWARD VOLTAGE - V

Figure 13. Forward Current vs. Forward
Voltage Characteristics

O~~~~-L~J-~~=-~

o

5

10

15

20

25

30

IF - SEGMENT DC CURRENT - mA

Figure 14. Relative Luminous Intensity vs.
DC Forward Current

Electrical
The HDSP-73001-74001-75001-7800 series of display devices are composed of light emitting diodes, with the light
from each LED optically stretched to form individual segments and decimal points. The -7300 series uses a p-n
junction diffused into a GaAsP epitaxial layer on a GaAs
substrate. The -7400 and-7500 series have their p-n junctions diffused into a GaAsP epitaxial layer on a GaP
substrate. The -7800 series use a GaP epitaxial layer on
GaP.
These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 4 or 13, should be used for calculating the current
limiting resistor value and typical power dissipation.
Expected maximum Vp values, for the purpose of driver
circuit design and maximum power dissipation, may be
calculated using the following Vp MAX models:
HDSP-7300 Series:
VF MAX = 1.85 V + IPEAK (7,(1)
For: IPEAK :::: 5 mA
HDSP-74001-7500 Series:
VF MAX = 1.75 V + IPEAK (38OJ
For: IPEAK :::: 20 mA
VF MAX = 1.6 V + IDe (450)
For: 5 mA ::; IDe::; 20 mA
HDSP-7800 Series:
VF MAX = 2.0 V + IPEAK (50 OJ
For: IpEAK:::: 5 mA

contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a gray package and matching encapsulating epoxy in
the segments.
Contrast enhancement may be aChieved by using one of
the following suggested filters:

HDSP-7300: Panelgraphic RUBY RED 60
SGL Homalite H10D-1605 RED
3M Louvered Filter R6610 RED or N021 0
GRAY
HDSP-7400: Panelgraphic YELLOW 27 or GRAY 10
SGL Homalite H10D-1720 AMBER or -1266
GRAY
3M Louvered Filter A5910 AMBER or N0210
GRAY
HDSP-7500: Panelgraphic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or-1266
GRAY
3M Louvered Filter R6310 RED or N0210
GRAY
HDSP-7800: Panelgraphic GREEN 48
SGL Homalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY

Mechanical
To optimize device optical perform"nce, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes. with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve DI-15 or
DE-15, Arklone A or K. A 60 0 C (140 0 F) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1 % detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.
Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the packages of plastic LED devices.

7-102

7.6/10.9 mm (0.3/0.43 INCH)
SEVEN SEGMENT DISPLAYS
RED.
HIGH EFFICIENCY RED.
YELLOW.
HIGtlke~~E9B~~t:lI.~.§.g~~EN •

5082.-7730/-7750 SERIES
5082-76101-7650 SERIES
5~~2-7620/-7660 SERIES
HQ§e:~§QO/-4§99 SERIES

TECHNICAL DATA

JANUARY 1986

Features
• COMPACT SIZE
• CHOICE OF 4 BRIGHT COLORS
Red
High Efficiency Red
Yellow
High Performance Green
• LOW CURRENT OPERATION
As Low as 3mA per Segment
Designed for Multiplex Operation
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Body Color Improves "Off" Segment
Contrast
• EASY MOUNTING ON PC BOARD OR
SOCKETS
Industry Standard 7.S2mm (0.3 in.) DIP
Leads on 2.S4mm (0.1 in.) Centers

Description

• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN CATEGORIZED FOR
COLOR
Use of Like Categories Yields a
Uniform Display

The -7730/-7610/-7620/-3600 and -7750/-7650/-7660/-4600 series
are 7.62/10.92 mm (0.3/.43 in.) red, high efficiency red, yellow,
and green displays. The -7730/-7610/-7620/-3600 series displays
are designed for viewing distances of up to three metres and the
-7750/-7650/-7660/-4600 series displays are designed for viewing
distances of up to six metres. These displays are designed for
use in instruments, point of sale terminals, clocks and appliances.

• MECHANICALLY RUGGED

Devices
Package
Drawing

Pan Number

Color

Description

5082-7730
5082-7731
5082-7736
5082·7740

Red

7.6 mm
7.6 mm
7.6 mm
7.6 mm

Common Anode Left Hand Decimal
Common Anode RighI Hand Decimal
Common Cathode RighI Hand Decimal
Universal OverflOW ±1 Right Hand Decimal

7.6
7.6
7.6
7.6

Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Decimal

5082·7610
5082-7611
5082·7613
5082-7616
5082-7620
5082-7621
5082·7623
5082-7626
HDSP-3600
HDSp-3601
HDSP-3603
HDSp·3606

High Efficiency Red

Yellow

High Performance Green

mm
mm
mm
mm

A

B
C
D
A

e

C
D

7.6 mm Common Anode Left Hand Decimal
7.6 mm Common Anode Right Hand Decimal
7.6 mm Common Cathode RighI Hand Decimal
7.6 mm Universal Overflow±l Right Hand Decimal

C
D

7.6
7.6
7.6
7.6

A
B
C
D

mm Common
mm Common
mm Common
mm Universal

Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand DeCimal
Overflow ±1 Right Hand Decimal

NOTE: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagram'O.

7-103

A

B

Devices
Par/Numb"r
5082-7750
5082-7751
5082-7756
5082-7760
5082-7650
5082·7651
5082-7653
5082-7656
5082-7660
5082-7661
5082-7663
5082-7666
HD$P-4600
HDSP-4601
HD8P-4603
HDSP-4606

Color

Description

Red

10.9 mm
10.9 mm
10.9 mm
10.9 mm

Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Decimal

High Elliciency Red

10.9 mm
10.9 mm
10.9 mm
10.9 mm

Common
Common
Common
Universal

Yellow

10.9 mm
10.9 mm
10.9 mm
10.9 mm

Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Decimal

High Performance Green

10.9 mm
10.9 mm
10.9 mm
10.9 mm

Common
Common
Common
Universal

Package
Drawing
E
F
G
H

Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Overflow ±1 Right Hand Decimal

E
F
G
H
E
F
G
H

Anode Left Hand DecImal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Overflow ±1 Right Hand Decimal

E

F
G
H

NOTE: Universal pinout brings the anode and the cathode'of each segment's LED out to separate pins, see internal diagram H.

Internal Circuit Diagram

A

E

F

c

o

G

H

Absolute Maximum Ratings
-7730/-7750

-7610/-7650

Series

Series

-7620/-7660
. Series

-3600/-4600
Series

81 mWl31
105 mWI 2 1
65 mW111
105 mWI 4 1
Average Power Dissipation per Segment or DP
Operating Temperature Range
-40° C to +85° C -40° C to +85° C -40° C to +85" C -20°C to +85°CI 51
Storage Temperature
-55°C to +100°C -55° C to +100° C -55"Cto+100°C -55°C to +100°C
60 mAISI
150 mAI S1
90 mAl?!
90 mAI91
Peak Forward Current per Segment or DP
30 mAI21
25 mAPI
20 mAI 3 1
30 mAl 4 1
DC Forward Current per Segment of DP
3.0V
3.0 V
Reverse Voltage per Segment or DP
3.0 V
3.0 V
Lead Soldering Temperature
260"C for 3 sec. 260° C for 3 sec. 260° C for 3 sec. 260° C for 3 sec.
1.59 mm (1/16 in.) below seating plane
Noles: 1.
2.
3.
4.
5.

See power derating curve (Figure 5).
See power derating curve (Figure 6).
See power derating curve (Figure 7).
See power derating curve (Figure 8).
For operation to -400 C consult optoelectronics division.

6.
7.
8.
9.

7-104

See
See
See
See

Figure 1 to establish
Figure 2 to establish
Figure 3 to establish
Figure 4 to establish

pulsed
pulsed
pulsed
pulsed

operating
operating
operating
operating

conditions.
conditions.
conditions.
conditions.

Package Dimensions
_

(5082-7730/-7610/-7620/-3600)

5.18

FUNCTION

10"

1.204)

r

19.05 • 0.25

L.H.D.P
Note 16
5.721.225)

3.94 (.1651

3.941.1651
5.0B
1.2001

'''fr:L+_-!+--'~

B

'IN

A

1

CATHODE -a

2

CATHODE-j

3
4

{\IOPIN

5

NOPIN

ANOOEt121

6

CATHODE -dp

7

CATHODE -~
9ATHODE-d

a

CATHODE -a
CATHODE - j
ANODEHtl
NOPIN
NqPIN
NO'CONN.l141
CATHODE ':'01
CATHOO"E-d

9
N.I!,CONN.l 14)
10 CATHODE -<
11
12
13
14

5.72

1.2251

'i.

C

D

NOPIN
CATHODEt151
ANODE -j

ANOOE-d
NOPIN
CATHODE .. d

ANQO~-g

CATHODE -¢

ANODE .. &

CATHOOE .. e

ANODE

-6:

NOPIN

ANOOe

~c

NOPIN
CATHODEt1S1
ANODE -dp
ANOOE-c
ANODE -b

ANODE -dp
NOPIN
CATHODE-dp
CATHODE -b

ANODE -d

CATHODE -dp
CATHODE-(;
CATHOOE-,
NOPIN
CATHODE -b
AN-ODE -a
ANOQE11 21
;NOPIN

CATHODE -,
NQPIN
CATHODE -b
ANoi)"el1:J

CATHODE -a
ANODE "a
ANQDe~b

o

A,B,C

LUMINOUS
INTENSITY
CATEGORY

--j'0.16

f-

MAX·I~

IRI.4001

..L

I

4.061.1601
MIN.

T-- ~

1.1BOI

--I'll-- 0.251.0101

7.621.300)+----

A,B,O
SIDE

A,B,C,O
END

C
SIDE

(5082-7750/-7650/-7660/-4600)

10·

10.31
1.4061

I.
N~te 13
E

H

F,G
FRONT VIEW
1.52

!--'2.70 1.50011

I

MAX.

LUMINOUS
INTENSITY
CATEGORY

!

COLOR
BIN
Note 17

U~-1-5iL~~-1-16"';.2'-~~1

t-,I

4.061.1601
MIN.

II
I

7.62

I

I

NOTES:
10.!Dimensions. in millimetres and (inches).

11. AU untoleranced dimensions are
for reference only.

15.24
1.6001

=j=-J

0.25
----111--1.0101

END VIEW

FUNCTION

10:++T
1

Iii

1.300)~

1.17 MAX.

~6tOj)
1.0461 0 .51

2.54
1.1001

DATECQDE

PIN

E

F

CATHODE ~ a

ANODE-tl

CATHODE ·d

CAiHODE-f

CATHOOE.",f

3

ANODEI12~

NOP1N
NO PIN

ANODEl111
NO PIN
NOPIN
NOCONNJ14i
CAlliOPE-a
CATHoDE-u

ANODE-d
NOptN
CATHOD!! -I<-

5

ANODE-f
CA'fHODE{151
NOPIN
NDPIN
NO CONNJ141

•
•
7
B
9

10
11
12
13
14

CATHODE

~dp

CATHODE

~tf

CATHODE -d

NO CONN.114J
CATHOD!: .(:
CATHOO"E-g

ANOOE

+~

ANODE-d
ANOOE-dp

CATHOO!:-I>
ANODE-e
ANODE -c
ANODE-dp
CATHODE -dp
CATHOOe"b

NOPIN

CAtHODE -dp
CATHOOE",c.
CATHODE .. go
NO PIN

CATIlDDe -b

¢ATHOOE .. b

NO \'lIN
ANODE-b

ANODE-a

ANODEI1il

ANODE{t2!

CATHOOEllM

ANOOE-b

15. Redundant cathode.
16. See part number table for l.H.D.P. and R.H.D.P. designation.
17. For yellow and green devices only.

7-105

H

CATHODE ... "

SIDE VIEW
12. Redundant anodes.
13. Unused dp position.
14.See Internal Circuit Diagram.

G

1

i

ANOOE -c
ANOOE",9.

CATHODE
NO PIN

"<0
"W

wI,-"
,,0:
Zw

r~BII~~!ml~Eall~~11

_0
I-w
a::::J
~~...:

"0:

-H-H-HtIt--t+H-tttlJ 6i~~~7~ci~~E

~ffir5

-H-H+tttt--f"+HttHIIDC MAX.

:::J,-a:

~~~

"0"
"'1-0
"-I-'"
oz:::J
ow",

~~~
~B:E

THIS REGIONIN
OPERATION
REQUIRES

10
8
6
5
4

mma1l11~

I

~Ix
~'"

",,,
•

u

1.9

1 L-...J.....J...J..J.J.Wl._.l..-L..LLLLJ,...,......J.........L..WCllI'-:-...L..........ll1a.,......_ DC OPE RA TI ON
1
10
tp - PULSE DURATION - pSEC

Figure 2. Maximum Tolerable Peak Current VS. Pulse Duration - 5082-7610/-7650 Series

~~HII~§II~!II~

OPERATION IN

+Httlttt---I-t+ttHt ~~~U~~~~ON

-IH-Htltlt--t--t-I"itHt

___

TEMPERA TUR E
DERATING OF
loc MAX.

II~

tp - PULSE DURATION - ,uSEe.

Figure 3. Maximum Tolerable Peak Current

VS.

Pulse Duration - 5082-7620/-7660 Series

7-108

tp - PULSE DURATION - pSEC

Figure 4. Allowed Peak Current vs. Pulse Duration -

-

26

25
"E
I

~
0:
0:
::J

"g

~ 12.5

"x
""
""

24
22

1\

50

\

\

1

20
18
16

R.JI'

14

12
10

1\
'\
t'r"S,GM,NT

"E

45

t-

40

ffi0:

35

0:
::J

""c

~

V \
IJI'
I II T V
R'J~ "i6O,JIWlsJEGMkNT V

RI

HDSP-3600/-4600 Series

30

"X
"

"iwiIW/S1EGMkNT

::J

"~
""

I
X

"'- K.
'" >,A. ~.

25

RVJA "520'CIWISEG
20

10

o

10

20

30

40

50

60

70

80

o
o

90 100

Figure 5. Maximum Allowable DC Current
Dissipation per Segment as a Function
of Ambient Temperature- 5082-7730/-7750 Series

0

0:

::J
U
U

\

8

I

6

RVJA "" GOO C/W/SEG'

4

10

::J

u

E

V',

t2

'"
"uc

A\

0:
0:
::J

!

"
"X
::J

0

""x

8

I

6

""w
E

2
20

30

40

50

60

70

40

50

60

70

80

90 100

Figure 6. Maximum Allowable DC Current and DC Power
Dissipation per Segment as a Function of
Ambient Temperature - 5082-7610/-7650 Series

\

2

10

30

80

-

40

--RHJ,A "525'C/wISEG

30

"-

25

f----

20

'" '

/

I--

-F't-no'

10

20

30

40

,,

1-

~~

I

10

--f,--

I'--,. ;... ~,

R('H "620'C/wISEci)\.,

15

~

-

,-

35

a

-,",

CiWlSEG
50

60

1tc-I

70

80

90 100

TA - AMBIENT TEMPERATURE -"C

TA -AMBIENTTEMPERATURE_OC

Figure 7. Maximum Allowable DC Current and DC Power
Dissipation per Segment as a Function of
Ambient Temperature - 5082-7620/-7660 Series

-,-

45

o

90 100

I·
--

50

RI}JA ;:,77QuCIW1SEG

00

20

TA - AMBIENT TEMPERATURE _ °C

C

"
"X
""
x
""

t~

1

E

TA - AMBIENT TEMPERATURE - "C

ffi0:

'" I

ROJA "770'CIW/SEG

u

o

"...E

:>..: "

RaJA'635'CIW/SEG'
15

X

Figure 8. Maximum Allowable DC Current per Segment
vs. Ambient Temperature - HDSP-3600/-4600 Series

7-109
'-----------------------

--

1

0-

/

V
I

8

.7 0

20

10

0

30

50

100

[peak - PEAK SEGMENT CURRENT - rnA

IpEAK - PEAK SEGMENT CURRENT - rnA

Figure 9. Relative Efficiency (Luminous Intensity per Unit Current)
versus Peak Current per Segment- 5082-7730/-7750 Series

Figure 10. Relative Luminous Efficiency (Luminous
Intensity per Unit Current) vs.
Peak Segment Current

160

100

~

E

140

«

~

z

""
~

i

E

120

1

i:'i

100

"":;,
"
"«,.
"ir

80

~

40

I

20

:r

60

0

60

~
~

80

,..

-"

o

40

..J
o

.4

.8

1.2

1.6

2.0

2.4

2.8

32

V F - FORWARD VOLTAGE - V

VF - FORWARD VOLTAGE - V

Figure 11. Forward Current vs. Forward Voltage5082-7730/-7750 Series.

Figure 12. Forward Current vs. Forward Voltage
Characteristics

1. 4

12

/

1. 2
1. 0

/

8

6
4

2
0

V

,..>-

V

10

in

,..i:'i
~

'"0

:;,

,.

/

2

:J
w

>
i=

V V

~

"
10

15

20

25

IF - SEGMENT DC CURRENT - rnA

Figure 13. Relative Luminous Intensity vs.
DC Forward Current- 5082-7730/-7750 Series

IF - SEGMENT DC CURRENT - rnA

Figure 14. Relative Luminous Intensity vs.
DC Forward Current

7-110

Electrical

Mechanical

These display devices are composed of light emitting
diodes, with the light from each LED optically stretched to
form individual segments and decimal points.

To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon IF113) and alcohol be used for vapor
cleaning processes. with an immersion time in the vapors
of less than two 12) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve DI-15 or
DE-15, Arklone A or K. A 60 0 C 1140 0 F) water cleaning
process may also be used, which includes.a neutralizer
rinse 13% ammonia solution or equivalent), a surfactant
rinse 11 % detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.

These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 8, should be used for calculating the current limiting resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following VF MAX models:
5082-7730/-7750 Series:
VF = 1.55V + IpEAK (70)
For 5 mA;:; IpEAK;:; 150 mA

Such cleaning agents from the ketone family lacetone,
methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family Imethylene chloride, trichloroethylene,
carbon tetrachloride, etc.! are not recommended for cleani ng LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the packages of plastic LED devices.

5082-7610/-7620/-7650/-7660 Series:
VF MAX = 1.75 V + IPEAK 138m
For: IPEAK 2 20 mA
VFMAX = 1.6 V + IDC 145m
For: 5 mA;:; IDC;:; 20 mA
HDSP-3600/-4600 Series:
VF MAX = 2.0 V + IPEAK 150m
For: IPEAK 2 5 mA

Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a package color which matches the encapsulating
epoxy in the segments.
Contrast enhancement may be achieved by using one of
the followi ng suggested filters:
5082-7730/
-7750

Panelgraphic RUBY RED 60 or GRAY 10
SGL Homalite H100-1605 RED or-1266
GRAY
3M Louvered Filter R6510 RED or
N0210 GRAY

5082-7610/
-7650

Panelgraphic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or -1266
GRAY
3M Louvered Filter R6310 RED or N0210
GRAY

5082-7620/
-7660

Panelgraphic YELLOW 27 or GRAY 10
SGL Homalite H100-1720 AMBER or -1266
GRAY
3M Louvered Filter A5910 AMBER or N0210
GRAY

HDSP-3600/ Panelgraphic GREEN 48
-4600
SGL Homalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY

7-111

FliHW

HEWLETT

~e.. PACKARD

14.2mm <'56 INCH)
SEVEN SEGMENT DISPLAYS

RED
HIGH EFFICIENCY RED
HIOH PERFORMANCE GREEN
YEllOW

HDSP-S300 SERIES
HDSP-SSOO SERIES
HDSP-S600 SERIES
HDSP-5700 SERIES
TECHNICAL DATA

JANUARY 1986

Features
• INDUSTRY STANDARD SIZE
• INDUSTRY STANDARD PINOUT
1S.24mm (.6 inch) DIP Leads on
2.S4mm (.1 inch) Centers
• CHOICE OF FOUR COLORS
Red
Yellow
High-Efficiency Red
High Performance Green
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Mitered Corners on Segments
Gray Package Gives Optimum Contrast
• COMMON ANODE OR COMMON CATHODE
Right Hand Decimal Point
Overflow ±1 Character
• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN CATEGORIZED
FOR COLOR
Use of Like Categories Yields a Uniform Display

Devices
Part No.
HOSP5301
5303
5307
5308
5321
5323
5501
5503
5507
5508
5521
5523
5601
5603
5607
5608
5621
5623
5701
5703
5707
5708
5721
5723

Description
The HDSP-5300/-5500/-5600/-5700 Series are large 14.22
mm (.56 inch) LED seven segment displays. Designed for
viewing distances up to 7 metres (23 feet). these displays
provide excellent readability in bright ambients.
These devices utilize an industry standard size package and
pin function configuration. Both the numeric and ±1 overflow devices feature a right hand decimal point and are
available as either common anode or common cathode.

Color

Red

High Efficiency
Red

High Performance
Green

YellOW

Description

Package
Drawing

Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ± Common Anode
Overflow ± Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal

A
B
C
D
E

Common AnOde Right Hand Decimal
Common cathode Right Hand Decimal
Overflow ± Common Anode
Overflow ± Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal

A
B
C
D

Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ± Common Anode
Overflow ± Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal

A

Common Anode Right Hand DeCimal
Common Cathode Right Hand Decimal
Overflow ± Common Anode
Overflow ± Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal

7-112

F

E
F
B
C
D
E

F
A
B
C

D
E

F

package Dimensions
FRONT VIEW A. B

TOP END VIEW A, B, C, D

TOP END VIEW E, F
COLOR
BIN
(NOTE 5)

2.54
(.100)
TYP
.51
(,0201
TYP

LUMINOUS

INTENSITY
CATEGORY

*

----l

17.I::-~9
70
,8

±L 9.

1.673)

+

t~

8.00
1. 315 )

I-I ~I~~~I
254

[r--r:L
1

'i.

1.6001

-~

,

4J5
I

1~:1) j

-

6.86
1.2701

L

12.573

1.495)

MAX

SIDE VIEW A, B, C, D

FRONT VIEW C, 0

FRONT VIEW E, F

FUNCTION
PIN

A

B

C

0

E

F

1

CATHODEe

ANODEe

CATHODEc

2

CATHODE d
ANODE[3)

ANODEd
CATHODE[4)

ANODEc, d

3

CATHODEb

4

CATHODEc

ANODEc

ANODE a, b, DP

CATHODE a, b, DP

5

CATHODEDP

ANODE DP

CATHODEDP

6

CATHODEb

ANODEb

CATHODE a

7

ANODE a

ANODE a, b, DP

8

CATHODE a
ANODE[3)

CATHODEl4)

ANODEc, d

CATHODEc, d

C CATHODE NO.2

CANODENO,2

9

CATHODEf

ANODEf

CATHODEd

ANODEd

DP CATHODE NO.2

DP ANODE NO.2

10

CATHODEg

ANODEg

NOPIN

NOPIN

ANODEc

E CATHODE NO.1

EANODENO. 1

CATHODEc, d

D CATHODE NO.1

D ANODE NO. 1

ANODEb

C CATHODE NO.1

C ANODE NO.1

DP CATHODE NO.1

DP ANODE NO.1

ANODEDP

E CATHODE NO.2

E ANODE NO. 2

ANODE a

D CATHODE NO.2

DANODENO.2

CATHODE a, b, DP

G CATHODE NO.2

GANODENO.2

B CATHODE NO.2

BANODENO.2

A CATHODE NO.2

AANODENO.2

12

F CATHODE NO.2

F ANODE NO.2

13

DIGIT NO.2 ANODE

DIGIT NO.2 CATHODE

14

DIGIT NO.1 ANODE

DIGIT NO.1 CATHODE

11

15

B CATHODE NO.1

BANODE NO.1

16

A CATHODE NO.1

AANODENO.1

17

G CATHODE NO.1

GANODENO.1

18

F CATHODE NO.1

FANODENO.1

Notes:
1. All dimensions in millimetres (inches).
2. All untoleranced dimensions are for reference only.
3. Redundant anodes.
4. Redundant cathodes.
5. For HDSP-5600/-5700 series product only.

7-113
- - - - - - - .._..... ----_._--------.

Internal Circuit Diagram
10

10

A

c

B
18

17

16

15

3

4

14

13

12

11

o
18

10

17

16

15

3

4

14

13

12

11

10

F

E

Absolute Maximum Ratings
-5300 Series
Average Power per Segment or DP
Peak Forward Current per Segment or DP

60mW
150 mAI 6 1
(Pulse Width'; .2 msl
DC Forward Current per Segmentl 9 1or DP
25mA

Operating Temperature Range 1' 01
Storage Temperature Range
Reverse Voltage per Segment or DP
Lead Solder Temperature

-5600 Series

-5700 Series

105 mW
90 mAI 7 1
(Pulse Width'; 1 msl
·30mA

10SmW
90 mAI71
(Pulse Width,; 1 msl
30 mA

80mW
60 mAI 8 1
(Pulse Width'; 1 msl
20mA

_40° C to +85° C
-20° C to +8So C
-5SoC to +100°C
-SsoC to +100°C
3.0V
3.0V
260° for 3 sec.
260° C for 3 sec.
(1.S9 mm 11/16 in.1 below seating plane)

-40° C to +85° C
c55°C to +100°C
3.0V
·260° C for 3 sec.

Noles:
6.

-5500 Series

g,

See Figure 1 to establish pulsed operating conditions.

Derate Maximum DC current:

See Figure 8 to establish pulsed operating conditions.

See Figure 2 for -5300 Series~

See Figure 9 for -5500 Series.
See Figure 10 for -5600 Series.
See Figure 11 for -5700 Series.

7. See Figure 6 to establish pulsed operating conditions. HDSP-5500. See
Figure 7 to establish pulsed operating conditions. HDSP-5600.
8.

-40°C to +8SoC
-Sso C to +100° C
3.0V
260° for 3 sec.

10. For Operation of HDSP-5600 Series to -40°C consult
optoelectronics division.

Electrical/Optical Characteristics at TA = 25° C
RED HDSP-5300 Series
Parameter
Luminous Intenslty/Segment[11 J
(Digit Average)
Peak Wavelength
Dominant Wavelength[12]
Forward Voltage/Segment or Dp[13]
Reverse Voltage/Segment or DP[13,18J
Thermal Resistance LED Junction-to-Pin

Symbol
Iv

Tesl Condition
IF-20 mA
100 mAPeak:
1 of 5 Duty Factor

Min.
600

APEAK
Ad
VF

fF=20 mA

VR

IR = 100 !LA

ROJ-PIN

3

Typ.
1300
1400
655
640
1.6
12
345

Max.

2.0

Units
!LCd

nm
nm
V
V
°C/WI
Seg.

Noles.
11. The digits are categorized for luminous intensity with category designated bya letter located on the right hand side of the package. The
luminous intensity minimum and categories are determined by computing the numerical average of the individual segment intensities,
decimal point not included.
12. The dominant wavelength, Ad. is derived from the C.I.E. Chromaticity Diagram and is that single wavelength which defines the color of the
device.
13.Quality level for Electrical Characteristics is 1000 parts per million.

7-114

HDSP-5300 SERIES

tp - PULSE DURATION -

~sec

Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration.

f\

26

...

24

15

22

II:
II:

20

"uu

1B

0

"''X""

''""

.

I

I

\

ROJ.A '" 770"C/W/SE:G

I
ROJ.A -

1.1

,~\

>
u

I

15

/:

1.0

U

510~CIW/SEG

14

fuw

12

>=

16

>

/

0.9

~

10

II:

I

x

I

~

C

t

a

o

O.B

0.7
10

20

30

40

50

60

70

80

90

100

o

TA -AMBIENTTEMPERATUAE _oC

20

40

60

80

100

120

140 I 160

150
Ipeak - PEAK SEGMENT CURRENT - rnA

Figure 3. Relative Efficiency (Luminous Intensity per
Unit C;urrent) vs. Peak Segment Current.

Figure 2. Maximum Allowable Average Forward Current
Per Segment vs. Ambient Temperature. Deratings Based
on Maximum Allowed Thermal Resistance Values, LED
Junction to Ambient on a per Segment Basis. T J MAX =
105 0 C.
_

...
zc
......
z'"
;;;C!

120

~

100

15

BO

"o

60

~

40

:z

a

...
a:

1. 0

~...

,8

/

00

z ...
3~

.6

/

w:::;

>'"
i=~

~~
0:-

a:
I

o

WN

;;;0

II:
II:

U

/'

1.2

",

u;E

.4

.8

1.2

1.6

2.0

2.4

2.8

.2

0/

..J
o

.4

3.2

V

/

V
10

15

20

25

IF - SEGMENT DC CURRENT - rnA

VF - FORWARD VOLTAGE - V

Figure 5. Relative Luminous Intensity vs. D.C. Forward
Current.

Figure 4. Forward Current vs. Forward Voltage.

For a Detailed Explanation of the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.

7-115

HIGH EFFICIENCY RED HDSP-5500 SERIES
Parameter
Luminous Intensity/Segment[14j
(Digit Average)
Peak Wavelength
Dominant Wavelengthl15J
Forward Voltage/Segment or DP(17j
Reverse Voltage/Segment or DP[18)
Thermal Resistance LED Junction-to-Pin

Symbol
Iv

APEAK
Ad
VF
VR
ROJ-PIN

Test Condition

Min.

Typ.

10 mA DC
60 mA Peak:
1 of 6 Duty Factor

1900

2800

IF=20mA
If! = 100 iJ.A

Max.

Units
IIcd

3700

3

635
626
2.1
30
345

nm
2.5

nm
V
V

°C/WI
Seg.

HIGH PERFORMANCE GREEN HDSP-5600 SERIES
Parameter
Luminous Intensity/Segment[ 14 1
(Digit Average)
Peak Wavelength
Dominant Wavelength [15.16J
Forward Voltage/Segment or DPt17J
Reverse Voltage/Segment or DP[17,18J
Thermal Resistance LED Junction-la-Pin

Symbol
Iv

Test Condition

Min.

Typ.

10mADC
60 mA Peak:
1 of 6 Duty Factor

900

2500

VR
ROJ-PIN

IF = 10 mA
IR'" 100 iJ.A

Units
Mcd

3100

APEAK
Ad

VF

Max.

3

566
571
2.1
50
345

577
2.5

nm
nm
V
V
°C/W/
S~g.

YELLOW HDSP-5700 SERIES
Parameter
Luminous Intensity/Segment[14]
(Digit Average}
Peak Wavelength
Dominant WavelengthP5.16)
Forward Voltage/Segment or DP [171
Reverse Voltage/Segment or DPI[17.18)
Thermal Resistance LED Junction-la-Pin

Symbol
Iv

APEAK
Ad
VF
VR
ROJ-PIN

Test Coh'ditlon

Min.

Typ.

10 mA DC
60 mA Peak:
1 of 6 Duty Factor

600

1800

Units
iJ.cd

2700
581.5

1,,-20 mA
IR-l00MA

Max.

3

583
586
2.2
40
345

592.5
2.5

nm
nm
V
V

°C/W/
Seg.

Noles:
14. The digits are categorized for luminous intensity with category designated by a letter located on top of the package. The luminous
intensity minimum and categories are determined by computing the numerical average of the individual segment intensities. decimal
point not included.
15. The dominant wavelength, Ad. is derived from the C.I.E. Chromaticity Diagram and is that single wavelength which defines the color of
the device.
16. The HDSP-5600 and HDSP-5700 series displays are categorized as to dominant wavelength with the category designated by a number
adjacent to the intensity category letter.
17.Quality level for Electrical Characteristics is 1000 parts per million.
18. Typical specification for reference only. Do not exceed absolute maximum ratings.

7-116

HDSP-5500/-5600/-5700 SERIES

~~~a~I~~~~I~$~mil~tt~1

THIS REGIONIN
OPERATION

REQUIRES

r--t-t+f~~~t-~++~~-p~~tHH-~~-rrH+HTEMPERATURE

f--+-++tf+1H+-~.r-H'!.I-t+H-'\f--p.flokfttJ--IH+ttl-ffl DERATING OF

~-+-+~+r~__~~+f~__~~~*H~_j~~~+HIDCMAX

t

tp - PULSE DURATION - jlsec

Figure 6. Maximum Tolerable Peak Current vs. Pulse Duration - HDSP-5500 Series.

tp - PULSE DURATION - t.!sec

Figure 7. Maximum Tolerable Peak Current vs. Pulse Duration - HDSP-5600 Series.

g
::::=

OPERATION IN
THIS REGION

•

REQUIRES
TEMPERATUR
DERATING OF
IDe MAX.

i

"

~,~ ~

f

~a'S;. lao.
.y.,.

10

100

1000

"""",,-oc OPE RATION

10000

tp - PULSE DURATION - jlsec

Figure 8. Maximum Tolerable Peak Current vs. Pulse Duration - HDSP-5700 Series.

7-117

HDSP-5500/-5600/-5700 SERIES

I-

15a:

50

50

45

45

I-

40

15a:

40

:::l

35

:::l

35

"

30

"

30

..,
..

:;

25

..

25

u

10

a:

u
u

:;
:::l

a:

"

X

:;

20

X

15

R6J-A

E

')

00

10

20

30

40

:;
:::l
:;

X

)I'~.

'" ""'

= 710'CIWISEG

ROJ.A -S10"CIWISEG /

:;

u
u

,

50

60

70

:;
I

..
X

.~

:;

1

80

I

E

RElJ.A • 525"CIW/SEG

"'-

15

\

u
u

16

"

:;
:::l
:;

..~
..

X

14

..J
/'

1.4

:/

f,l

ROJ_A -510'CIW/SEG

1.2

I
I

12

/

1.3

:

'\

R6J.A • 77O"CIWISEG

I

40 W M M M M_

Figure 10. Maximum Allowable Average Current per
Segment vs. Ambient Temperature. Derating Based on
Maximum Allowed Thermal Resistance Values, LED
Junction to Ambient on a per Segment Basis. TJ LED
MAX = 105° C. - HDSP·5600 Series.

1.5

:::l

~

TA - AMBIENT TEMPERATURE _ °C

1.6

18

'i

.

22

a:

,

RElJ.A = 710'CIWISEG

24

20

"'- "

10

om w

Figure 9. Maximum Allowable Average Current per
Segment vs. Ambient Temperature. Derating Based on
Maximum Allowed Thermal Resistance Values. LED
Junction to Ambient on a per Segment Basis. T J LED
MAX = 105° C - HDSP-5500 Series.

15a:

/
)~

TA - AMBIENT TEMPERATURE _ °C

I-

~

20

o

90 100

,

l

1.0

"E

~ -...:

~

I
HDSP-6600
SERIES

r--

-

A
I

.8

u

HDSP-570DSERIES

/HDSP-5500 SERIES

I

.9

X

"

r

1. 1

10

""

.7

o
o

.6
10

20

30

40

50

60

70

80

TA - AMBIENT TEMPERATURE _

90 100

..,

E

I-

15a:

60

a:

50

.."
a:

40

'a:~"

30

:::l
U

.!!-

1.0

>
;;;

HDSP-6600 SERIES

;;
"

"

2.0

w

1.5

~

1.0

>
w

rt

2.0

a:

5

3.0

60

70

4.0

80

90 100

/

V

3.0
2.5

3

II
I~

50

3.5

~

gJ

~oo

if

20
10

J~
rtf!-

40

I-

~
I-

HDSP-5500
SERIES "-

30

4.0

!I

70

20

Figure 12. Relative Efficiency (Luminous Intensity per
Unit Current) vs. Peak Segment Current.

/)

80

10

IpEAK - PEAK SEGMENT CURRENT - rnA

Figure 11. Maximum Allowable Average Current per
Segment vs. Ambient Temperature. Derating Based on
Maximum Allowed Thermal Resistance Values, LED
Junction to Ambient on a per Segment Basis. T J LED
MAX = 105° C - HDSP-5700 Series.

90

o

ac

0

5.0

/
/

VV

V
10

15

20

25

30

35

40

IDe - DC CURRENT PER LED - rnA

Vf - FORWARD VOLTAGE - V

Figure 14. Relative Luminous Intensity vs. DC Forward Current.
HDSP-5500/-5600/-5700

Figure 13. Forward Current vs. Forward Voltage
Characteristics.

7-118

~~~~~~~~~------

----------~~~~~~-

Electrical
The HDSP-5300/-5500/-5600/-5700 series of display devices
are composed of light emitting diodes, with the light from
each LED optically stretched to form individual segments
and decimal points. The -5300 series uses a p-n junction
diffused into a GaAsP epitaxial layer on a GaAs substrate.
The -5500 and -5700 series have their p-n junctions diffused
into a GaAsP epitaxial layer on a GaP substrate. The -5600
series use a GaP epitaxial layer on GaP.

HDSP-5500: Panelgrahpic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or-1266 GRAY
3M Louvered Filter R6310 RED or N0210
GRAY

These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4 or
13, should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum
VF values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the
following VF MAX models:

HDSP-5700: Panelgraphic YELLOW 27 or GRAY 10
SGL Homalite H100-1720 AMBER or -1266
GRAY
3M Louvered Filter A5910 AMBER or N0210
GRAY

HDSP-5300 Series:
VF MAX= 1.55V+ IPEAK (70)
For: IPEAK 2: 5 mA
HDSP-5500/-5700 Series:
VF MAX = 1.75V + IPEAK (380)
For: IPEAK 2: 20 mA
VF MAX = 1.5V + IDe (450)
For: 5 mA:S IDe :S 20 mA
HDSP-5600 Series:
VF MAX = 2.0V + IPEAK (500)
For: IPEAK 2: 5 mA

Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept
is to employ both luminance and chrominance contrast
techniques to enhance readibility by having the OFFsegments blend into the display background and the
ON-segments stand out vividly against this same
background. Therefore, these display devices are
assembled with a gray package and matching encapsulating
epo~y in the segments.

HDSP-5600: Panelgraphic GREEN 48
SGL Homalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY

Mechanical
To optimize device optical performance, specially developed plastics are used which restrict the solvents that may
be used for cleaning. It is recommended that only mixtures
of Freon (F113) and alcohol be used for vapor cleaning
processes, with an immersion time in the vapors of less than
two (2) minutes maximum. Some suggested vapor cleaning
solvents are Freon TE, Genesolve DI-15 or DE-15. Arklone A
or K. A 60°C (140°F) water cleaning process may also be
used, which includes a neutralizer rinse (3% ammonia solution orequivalent), a surfactant rinse (1 % detergent solution
or equivalent), a hot water rinse and a thorough air dry.
Room temperature cleaning may be accomplished with
Freon T -E35 or T -P35, Ethanol, Isopropanol or water with a
mild detergent.
Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.) are not recommended for cleani ng LED parts. All of these various solvents attack or dissolve
the encapsulating epoxies used to form the packages of
plastic LED devices.

Contrast enhancement may be achieved by using one of the
following suggested filters:

1-.

--

HDSP-5300: Panelgraphic RUBY RED 60
SGL Homalite H100-1605 RED
3M Louvered Filter R6610 RED or N0210
GRAY

7-119

FliD'l

LARGE 20 mm (0.8")
SEVEN SEGMENT DISPLAYS

HEWLETT

~a PACKARD

RED HDSP-3400 Series
HIGH EFFICIENCY RED HDSP-3900 Series
YELLOW HDSP-4200 Series
HIGH PERFORMANCE GREEN HDSP-8600 Series
TECHNICAL DATA

JANUARY 1986

Features
• 20 mm (0.8") DIGIT HEIGHT
Viewable Up to 10 Metres (33 Feet)
• CHOICE OF FOUR COLORS
Yellow
Red
High Efficiency Red
Green
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Mitered Corners on Segments
Grey Package Provides Optimum Contrast
• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN CATEGORIZED
FOR COLOR
Use of Like Categories Yields a Uniform Display
• IC COMPATIBLE
• MECHANICALLY RUGGED

Description
The HDSP-3400/-3900/-4200/-8600 Series are very large
20 mm (0.8 in.) LED seven segment displays. Designed for
viewing distances up to 10 metres (33 feet), these single
digit displays provide excellent readability.
These devices utilize a standard 15.24 mm (0.6 in.) dual in
line package configuration that permits mounting on PC

boards or in standard IC sockets. Requiring a low forward
voltage, these displays are inherently IC compatible,
allowing for easy integration into electronic instrumentation, point-of-sale terminals, TVs, weighing scales,
and digital clocks.

Devices
Part Number

CQIQr

HDSP-3400
HDSP-3401
HDSP-3403
HDSP-340S
HDSP-34oo
HDSP-3900
HDSP-3901
HDSP-3903
HDSP-3905
HDSP-39oo

Red

High Efficiency Red

HDSP-4200
HDSP-4201
HDSP-4203
HDSP-4205
HDSP-4206

Yellow

HDSP·8600
HDSP·8S01
HDSP-8S03
HDSP-860S
HOSP..ss06

High Performance Green

DescrlpllQn
Common Anode Left Hand Decimal
Common Anode Ri9ht Hand Decimal
Common Cathode Right Hand Decimal
Common Cathode Left Hand Decimal
Universal Overflow ±1 Right Hand Decimal
Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Common Cathode Left Hand Decimal
Universal Overflow ±1 Right Hand Decimal
Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Common Cathode Left Hand Decimal
Universal Overflow ±1 Right Hand DeCimal
Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
-Common Cathode Right Hand Decimal
Common Cathode Left Hand Decimal
Universal Overflow ±1

7-120

Package
Drawing
A

8
C
D
E
A

8
C
D
E
A

6
C
D

E
A
6
C
D
E

~~~~

......

----~-

...

------

...._ - - _ . .

. . . .- .

__ __.
.

package Dimensions (3900/4200 Series)
I

1.78

't

10.0701

+

1

+
+

2

+
+

6

+
+
~

9

NOTE4
RHOP

't
FRONT VIEW A, 0

1

'9.96 MAX"

--=f

LUMINOUS
INTENSITY
CATEGORY

10.786 MAX.I
COLOR
~BINI7I

S~

~

-r-

\

10.0401

I.

FRONT VIEW E
0.51

F~MUon

10.0201

A 3400/39001

,

I

1

3

NO PIN
CATHOOEa
CATHODE f
ANODEPI
CATHODEe

NCPIN
CATHODE a
CATHODE f
ANODe P!

CATHODElbl

CAiHODE e

ANODE a

5

PIN 2AND 17

6

ANODEm

7
8

CATHOOEdp
NO PIN

9

NOP1N
NO PIN
CATHODE.
ANOOElJ!
CATHOOEc

10

.1 15~:: ~:;51

11
12
13
14
15

,.

10.600' 0.0101

DATE CODE

17
18

SIDE VIEW

C 341)3/391)3/

42(1-1/8601

(0.2001

J!L

END VIEW

4

B 34Q1/3.9011

4~O/a600

Pin

~=t508

8.38 ± 0.25
....l10.330' 0.0101

6.1 MIN.
10.240 MIN.I

PACKAGE...J

CAtHODE 9
CATHODE b
NO PIN
ANOOEI1I
NO PIN

4Z03/86~

o

3405/3905/
42051860$

NO PIN
ANOOE a

NO PIN
ANOOE.

A.NODEI

ANODE I

CATHODEICJ
ANODEe
CATHOOE(5!
CATHODEl;;j
ANOOEl>1
NO. CONNEC. NO. CONNEC, ANODE dp
NO PIN
NO PIN
NOPIN
NOP1N
NOPIN
NOPIN
NO PIN
CATHODE; op ANODE t;lp
ANOOE d
ANODE.
CATHODE d
ANODE(J-l
CATHODEf~1
CATHOOe lll.l

CArHOOE

G

CATHODEg
CATHODe b

NO PIN
ANODE!i!
NO PIN

ANOOE"
ANODE 9
ANODE b
NO pm
CATHODEl5 t
NO PIN

E 34.4.6(39001
42061860$

NO PIN
CATHODE a
ANOOE.
CATHOQEd

CATHODE c
CATHODEe
ANODE e
CArHOOE dp
NO PIN
ANODEdpCATHODEdp
CATHODEtI
ANODEb
ANOOEc

ANOOEC
ANOOEg
ANODE b
NOP1N
CATHooe fff1
NO PIN

ANODE

a

NO PIN
CATHODE a
NOPIN

NOTES:
1. Dimensions in millimeters and linches!.
4. Unused dp position.
7. For HDSP-4200/-8600 Series product only.
2. All untoleranced dimensions are for reference only. 5. See Internal Circuit Diagram. 8. See part number table for LHDP and
3. Redundant anodes.
6. Redundant Cathodes.
RHDP designation.

Internal Circuit Diagram
18

18

A

B

E

0

C

Absolute Maximum Ratings
Average Power per Segment or DP (TA = 25 0 C)1 9 1
Operating Temperature Range 110j
Storage Temperature Range
Peak Forward Current per Segment or DP (TA = 25°0,
Pulse Width = 1.2 ms)I"1
DC Forward Current per Segment or DP (TA = 25°C)1 9 1
Reverse Voltage per Segment or DP
Lead Soldering Temperature (1.6 mm [1/6 in.) Below
Seating Plane)

18

-3900/-4200

-3400 Serie$
120mW
-40°0 to +85°0
-55·0 to +100· C

Series

-8600 Series

105 mW
10SmW
-40· C to +85 0 C -20· C to +85° 0
-55° C to +100· C -55·0 to +100·C

200mA
SOmA
3.0V

135mA
40mA
3.0 V

90mA
30mA
3.0V

260 0 C for 3 sec.

260· C for 3 sec.

260· C for 3 sec.

Notes:
9. See Power Derating Curves Isee Figure 2 for -3400 Series, Figure 7 for -3900/-4200 Series, and Figure 12 for -8600 Seriesl.
10. For operation of -8600 series to -40°C consult Optoelectronics division.
11. See appropriate curves to establish pulsed operating conditions (see Figure 1 for -3400 Series, Figure 6 for -3900/-4200 Series,
Figure 11 for -8600 Series!.

7-121

Electrical/Optical Characteristics at T A = 25° C
RED

HDSP-3400 SERIES
Description

Luminous Intensity/Segment
(DIgit Average){12,13]

Symbol
Iv

Test Condltion

Min.

Typ.

Ip=20 mA

500

1200

/tcd
nm

Peak Wavelength

APEAK

655

Dominant Wavelength [14J

Ad

640

Forward Voltage, any Segment or DP[16j

VF

Reverse Voltage, any Segment or DP{15,16]

VFl

IR=100/tA

Temperature Coefficient of
Forward Voltage

AVFI"C

IF=20 mA

Thermal Resistance LED Junctlon-Io-Pin

ROJ-PIN

1.6

. 1f'=20 mA
3.0

Max.

Units

nm
2.0

V

20.0

V

-1.5

mV/oC

375

°C/WI
Seg

HIGH EFFICIENCY RED

HDSP-3900 SERIES

Description
Luminous Intensity/Segment
migit Average)(12.13]

Symbol
Iv

Test Condition

Min.

Typ.

100 mA Pk; 1 of 5
Duty Factor

3350

7000

20 mA DC

Max.

Units
/tcd

4800

Peak Wavelength

APEAK

635

Dominant Wavelenglh[ 141(Digit Average)

Ad

626

Forward Voltage, any Segment or DP[16]

VF

IF'" 100 mA

Reverse Voltage, any Segment or Dp[16, 17 1

VR

IR= 100 pA

Temperature Coefficient of
Forward Voltage

AVFfoC

Thermal Resistance LED Junction-to-Pin

ROJ-PIN

2.6
3.0

IF= 100 mA

nm
nm
3.5

V

25.0

V

-1.1

mVioC

375

°C/WI
Seg

YELLOW

HDSP-4200 SERIES
Description

Luminous Intensity/Segment
(Digit Average) [12, 131

Symbol
Iv

Test Condition

Min.

Typ.

100 mA Pk; 1 of 5
Duty Factor

2200

7000

20 mA DC
Peak Wavelength

APEAK

Dominant Wavelength 114.151 (Digit Average)

Ad

Max.

pcd

3400
583

Forward Voltage, any Segment or Dp[161

VF

lp= 100 mA

Reverse Voltage, any Segment or DPJ1e,17J

VR

IR=100pA

Temperature Coefficient of
Forward Voltage

AVF/oC

IF

Thermal Resistance LED Junction-to-Pin

ROJ-PIN

100 mA

Units

nm

581.5

586

592.5

nm

2.6

3.5

V

3.0

25.0

V

-1.1

mV/oC

375

°C/WI
Sag

7-122

HIGH PERFORMANCE GREEN

HDSP-8600 SERIES

;Sy,nbdi

Description

luminous Intensity/Segment
(Digit Average)112,13)

·'MI';.

Test C6\"1diti6n

"cd

10 mA DC
Peak

Wav~length

Units

1960

Duty Factor

Iv

Max.

Typ.

60 mA Pk; 1 of 5
700

1500
566

APEAK

Dominant Wavelength [14,15) (Digit Average)

Ad

Forward Voltageiar'!Y, Segment orpP!1 6 1

VF

IF=10 mA

Reverse Voltage, anysegmentorDP[16, 171

VR

IR = 100 p.A

Thermal Resistance lED"Junctio,n-to-Pin

R8J-PIN

I'"

3,0

nm

571

577

2.1

2.5

nm
V

50,0

V

375

cC/W/
$eg

Notes:
12, Case temperature of the device immediately prior to the intensity measurement is 25' C,
13. The digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the package.
14. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and is that single wavelength which defines the
color of the device.
15, The yellow and green displays are categorized as to dominant wavelength with the category designated by a number adjacent
to the intensity category letter.
16, Quality level for electrical characteristics is 1000 parts per million.
17. Typical specification for reference only. Do not exceed absolute maximum ratings.

HDSP-3400 SERIES
,,0

.,W

20

~~

to'"
ZW
_0

60

13.3

>-w

"",
"'=>

~"'I-

\

\

10

~ffi~
=>~'"

I

\

~>-"
oz=>

IN THIS
REGION
REQUIRES
TEMPERATURE

~§~

"',,"
1.5

l

~ ~

j]

10

"1-;....-

~

1\

II~

100

~

I

1000

a'"'"

45

0

t

~~

~~
'\- N'I

50

"=>
.,"X
"
""'

OF IDe MAX

'"\(."
'i

:;;

"

DERATING

"1>",

1\
"%;

I

1>",

\

\

OW"

>-

OPERATION

"

""",
x~a

U
·to
,,>-0

:

I

X

c

.,E

1. 2

~

" E
;;:0

w"'
2::~

1. 1

-'-'
w <{

1.0

,..-

V

~N

wI-

I

~~

I

~o

140

"
'"
""''iZ"
"~

120

~

"

180
160

I

0.9

200

>-

:;;

~

\

35

204000

M

100 1m 140 100 100 mo

\

1\

30

\

25

I

fllJJA "-S25"Ch'V/SEGMENT

20
15
10

DC
_OPERATION

o

10,000

o

102030405060 708090100110120

Figure 2. Maximum Allowable DC
Current per Segment vs. Ambient
Temperature

2.0

;;

1/

1.6

>-

1.4

"'~
.,:J

"'"

/

1.2

/

0.•

V

0.4

$
1.2

1.4

V

/

1.0
0.8

V

0.2

1-,

/

/

0

;;:

,f

I-

1.8

E

i'l

J
I

l40

1.0

Z2

/

rr100
r80
r60
20

2.4

I
I

r-

0

o

.~

TA - AMBIENT TEMPERATURE -"C

§
0

"'''
I'"

~~

\

tp - PULSE DURATION - ps

1.3

~~

1

40

Figure 1. Maximum Allowable Peak Current vs. Pulse Duration

t

RO!' ).20 ciW~sEJME~r

55

o
1.6

1.8

2.0

o

10

20

30

40

50

60

IpEAK - PEAK SEGMENT CURRENT - rnA

VF - FORWARD VOLTAGE - V

IF - SEGMENT DC CURRENT - rnA

Figure 3. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak
Segment Current

Figure 4. Peak Forward Segment
Current vs. Peak Forward Voltage

Figure 5. Relative Luminous Intensity
vs. DC Forward Current

7-123

HDSP-3900/-4200 SERIES

-r
« «

XIX
'~E
" '"
"

u

lp -PULSE DURATION

-j.lS

Figure 6. Maximum Allowed Peak Current vs. Pulse Duration

60

1.2

aia:
a:

:::>

50

40

'X"
'"

35

:::>

1.0

«

25

I

'X
"

20

'.E!"

«

15

u

10

IL
0.6

\

1/

°c

cr:

i2

"~
I

"
~

,.

120

HOSP-39O(l SERIES

Ci5G
20
w«

100

120

40
20

~

o
1.5

>'"
-cr:

1-0
«2

~

ujcr:

2.5

.

1.2

..

1.0

/

0.8
0.6
0.4
0.2

=FJ;fI [

o .....
o

\. !iDSP··4200 SEAlES

2.0

1.4

w«

;/1

1.8

:::>10«
~o

3.0

tit

2.0

1.6

3~.

11/

60

140

1/

2.2

~c§


u
0
cr:
«

40

IpEAK - PEAK SEGMENT CURRENT - rnA

Figure 7. Maximum Allowable DC Current
per Segment vs. Ambient Temperature

cr:

.

0.2

20

aicr:

.

I

0.4

TA - AMBIENT TEMPERATURE _

I

HOSP-4200 SERIES

/

o

«
E

...... \

I.--"

0.8

30

1..-'=

....... p-

45


u
u

c

"=>
"X
""x
""

60

1.4

55

1.3

50

ROJA " 425°eJWISEGMENT

35

."

30
25
20

u

10

15

00

Rf'A

.8

"
i 52rcrlSi~ENl

I/'\.:

.7

~

.6

I
I

.5

10 20 3040 50 60 70 80 90100 110 120

10

°c

70
60

cr:

"
;0

cr:

I

40

~

30

o!!-

20

50

60

>-

3.5

I-

in

15

3.0

I

I-

~

50

c

I
If

80

cr:
cr:

=>

40

70

80

90 100

4.0

90

u

30

Figure 13. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak
Segment CUrrent

100

15

20

IPEAK - PEAK CURRENT PER LED - rnA

Figure 12. Maximum Allowable DC Current
per Segment vs. Ambient Temperature

.:.

I
I

.9

0(

tt

if

1.0

V

TA - AMBIENT TEMPERATURE _

"E

/

1.1

40

I

0

,/

1.2

45

'"=>0

I

2.5

z

2.0

:3

1.5

~

w

V

>
i=

I

~cr:

II

10

2.0

3.0

4.0

0.5

o~

J
1.0

1.0

o

5.0

/

V

J

V
10

15

20

25

30

35

40

IDe - DC CURRENT PER LED - rnA

VF - FORWARD VOLTAGE - V

Figure 14. Peak Forward Segment Current vs.
Peak Forward Voltage

Figure 15. Relative Luminous Intensity vs.
DC Forward Current

7-125

Electrical

Mechanical

These display devices are composed of eight light emitting
diodes, with light from each LED optically stretched to form
individual segments and a decimal point.

These devices are constructed utilizing a lead frame in a
standard DIP package. The LED dice are attached directly
to the lead frame. Therefore, the cathode leads are the
direct thermal and mechanical stress paths to the LED dice.
The absolute maximum allowed junction temperature,
T J MAX, is 105° C. The maximum power ratings have been
established so that the worst case VF device does not
exceed this limit.

These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4, 9,
or 14 should be used for calculating the current limiting resistor value and typical power dissipation. Expected maximum VF values, for the purpose of driver circuit design
and maximum power dissipation, may be calculated using
the following VF MAX models:
HDSP-3400 Series

VF MAX = 1.55 V + IPEAK (70)
For: IpEAK 2': 5 mA

HDSP-3900/-4200 Series

VF MAX = 2.15 V + IpEAK (13:5,fl)
For: IF 2': 30 mA

Worst case thermal resistance pin-to-ambient is 400°CI
W/Seg when these devices are soldered into minimum
trace width PC boards. When installed in a PC board that
provides ROPIN-A less than 400°C/W/Seg these displays
may be operated at higher average currents as shown in
Figure 2.

VF MAX = 1.9 V + loc (21.80)
For: 10 mA:::: IF:::: 30 mA
HDSP-8600 Series

optical

VF MAX = 2.0 V + IPEAK (500)
For: IPEAK 2': 5 mA

Temperature derated strobed operating conditions are
obtained from Figures 1,6, or 11 and 2, 7, or 12. Figures 1,
6, and 11 relate pulse duration (tp), refresh rate (f), and the
ratio of maximum peak current to maximum dc current
((PEAK MAX/loc MAX). Figures 2, 7, and 12 present the
maximum allowed dc current vs. ambient temperature.
Figures 1, 6, and 11 are based on the principle that the
peak j unction temperature for pulsed operation at a specified peak current, pulse duration and refresh rate should
be the same as the junction temperature at maximum DC
operation. Refresh rates of 1 kHz or faster minimize the
pulsed junction heating effect of the device resulting in the
maximum possible time average luminous intensity.
The time average luminous intensity can be calculated
knowing the average forward current and relative efficiency characteristic, '1IPEAK, of Figures 3, 8, or 13. Time
average luminous intensity for a device case temperature
of 25° C, Iv (25° C), is calculated as follows:

Example: For HDSP-4200 series
'1IPEAK = 1.00 at IPEAK = 100 mAo For DF = 1/5:

C! .OOJ

[7.0 mCdJ = 7.0 mcdl
segment

The time average luminous intensity may be adjusted for
operating junction temperature by the follo,wing exponential equation:
Iv (TJ) = Iv (25°C) e[k(TJ + 25°C)[
where

TJ = TA + Po' ROJ-A

Device

K

-3400

-0.0188/"C

-3900

-0.0131/oC

-4200

·0.0112/°C

-8600

-O.0044/°C

IvlCd I
LVI cd/m 2 1 = - Alm21
ITlvl cd I
Lvifootlamberts I = AI ft21

Area/Seg.
mm2

Area/Seg.

14.9

0.0231

io.2

Contrast Enhancement
The objective of contrast enhancement is to optimize display readability. Adequate contrast enhancement can be
achieved in indoor applications through luminous contrast
techniques. Luminous contrast is the observed brightness
of the illuminated segment compared to the brightness of
the surround. Appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected
from the area around the display while transmitting most of
the light emitted by the segment. These filters are described
further in Application Note 1015.

IAVG ] ['1
] [Iv DATA SHEET]
Iv (25° C) = [ IAVG Test
IPEAK
Condition

°
_ r?O mA]
Iv (25 C) - L20 mA

The radiation pattern for these devices is approximately
Lamberlian. The luminous sterance may be calculated
using one of the two following formulas.

7-126

Chrominance contrast can further improve display readability. Chrominance contrast refers to the color difference
between the illuminated segment and the surrounding area.
These displays are assembled with a gray package and
untinted encapsulating epoxy in the segments to improve
chrominance contrast of the ON segments. Additional contrast enhancement in bright ambients may be achieved by
using a neutral density gray filter such as Panelgraphic
Chromafilter Gray 10, or 3M Light Control Film (louvered
filml.

rh~

~~

HEWLETT

SEVEN SEGMENT DISPLAYS FOR
HIGH LIGHT AMBIENT CONDITIONS

PACKARD

HIGH EFFICIENCY RED HDSP-3530/-3730/-5530/-3900 SERIES
YEllOW HDSP-4030/-4130/-5730/-4200 SERIES
TECHNICAL DATA

JANUARY 1986

Features
• HIGH LIGHT OUTPUT
Typical Intensities of up to 7.0 mcd/seg at
100 rnA pk 1 of 5 duty factor.
• CAPABLE OF HIGH CURRENT DRIVE
Excellent for Long Digit String Multiplexing
• FOUR CHARACTER SIZES
7.6 mm, 10.9 mm, 14.2 mm, and 20.3 mm
• CHOICE OF TWO COLORS
High Efficiency Red
Yellow
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Grey Body for Optimum Contrast

Description
The H DSP-3530/-3730/-55301-3900 and HDSP-40301-41301
-5730/-4200 are 7.6 mm, 10.9 mm/14.2 mm/20.3 mm high
efficiency red and yellow displays designed for use in high
light ambient condition. The four sizes of displays allow for
viewing distances at 3, 6, 7, and 10 meters. These seven
segment displays utilize large junction high efficiency LED
chips made from GaAsP on a transparent GaP substrate.
Due to the large junction area, these displays can be driven
at high peak current levels needed for high ambient
conditions or many character multiplexed operation.

• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW CATEGORIZED FOR COLOR
Use of Like Categories Yields a Uniform Display
• IC COMPATIBLE
• MECHANICALLY RUGGED

These displays have industry standard packages, and pin
configurations and ±1 overflow display are available in all
four sizes. These numeric displays are ideal for applications
such as Automotive and Avionic Instrumentation, Point of
Sale Terminals, and Gas Pump.

Devices
3530
. 3531
3533
3536
4030
4031
4033
4036

Description

Color

Part No. HDSP·

Package
Drawing

High Efficiency Red

7.6
7.6
7,6
7.6

mm
mm
mm
mm

Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Decimal

A
B
C
D

7.6
7.6
7.6
7.6

mm
mm
mm
mm

Common
Common
Common
Universal

A

Yellow

Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Overflow ±1 Right Hand Decimal

8
C
D

Note: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagrams 0 and H.

7-127

Devices
Part No.

Color

HDSP
3730
3731
3733
3736
4130
4131
4133
4136
5531
5533
5537
5538
5731
5733
5737
5738
3900
3901
3903
3905
3906
4200
4201
4203
4205
4206

Package
Drawing

Description
10.9 mm
10.9 mm
10.9 mm
10.9 mm

Common
Common
Common
Universal

10.9 mm
10.9 mm
10.9 mm
10.9 mm
14.2 mm
14.2 mm
14.2 mm
14.2 mm

Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Dec.
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode

Yellow

14.2
14.2
14.2
14.2

Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode

High Efficiency Red

20.3 mm Common
20.3 mm Common
20.3 mm Common
20.3 mm Common
20.3 mm Universal

Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Cathode Left Hand Decimal
Overflow ±1 Right Hand Decimal

20.3
20.3
20.3
20.3
20.3

Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Cathode Left Hand Decimal
Overflow ±1 Right Hand Decimal

High Efficiency Red

Yellow

High Efficiency
Red

Yellow

mm
mm
mm
mm

mm
mm
mm
mm
mf!!

Common
Common
Common
Common
Universal

Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Overflow ±1 Right Hand Dec,

E
F
G
H
E
F
G
H
I

J
K
L
I

J
K
L

M
N
0

P
Q

M
N

0
P
Q

Note: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagram Q.

Absolute Maximum Ratings (All Products)
Average Power per Segment
or DP (TA = 25°CI
Peak Forward Current per Segment
or DP (TA = 25°0)1 1 1
DC Forward Current per Segmentl 21
or DP (TA = 25°0)

105mW
135 mA
(Pulse Width = 0.16 ms)
40mA

Operating Temperature Range

-40° 0 to +85° C

Storage Temperature Range

-55°0 to +100°0

Reverse Voltage per Segment or DP
Lead Solder Temperature
(1.59 mm [1/16 inch [ below seating plane)

3.0V
260°0 for 3 sec.

7-128

Notes:
1. See Figure 1 to establish
pulsed operating conditions.
2. Derate maximum DC current above TA = 25 0 C at
.50 mAIo C per segment, see
Figure 2.

.~~-~-~-~----~----~---

-----~-.---~-~-

package Dimensions (HDSP-3530/4030 Series)
.£~~NCTION

A
·3530/.4030

PIN

B

---- -_.1
2
3
4
5
6
7

19.05 • 0.25

NoteS

'~r ciL+_"

-I+--'I-'

5.72
1.2251

4.191.1651
5.08

1.2001

R.H.D.P.

I

!

G.

1.0101

o

A,B,C

ANO~

CATHODE-a

NDPIN

CATHODE·f

CATHODE [6J

NOPIN

ANODE-'
ANODE-g

CATHQDE·d

NO PIN

CATHODE·'
ANODEI'I
NO PIN

NOPIN

NO PIN

ANOOE~e

CATHODE-e

I

CATHQDE·c

CATHODE-dp
NO CONN.151 ANODE-d
CATHODE·e
CATHODE-e
NOPIN
CATHODE-d
NOPIN
CATHODE·d
NO CONN.ISI , CATHODE-dp CATHOO8(6!
CATHODE-c
CATHODE-c
ANODE-dp
CATHODE-g
CATHODE-g
ANODE-c
NQPIN
NO PIN
ANODE-b
CATHODE-b
ANODE-a
CATHODE·b
ANODE(31
ANODEI3]
NOPIN

ANODE'e

ANOOE·c

I

I

9
10
11
12
13
14

Note 4

I

D

-3536/-4036

CATHODE-a
ANODE!3]

B

_ _ 0.25

C
·3533/-4033

-3531/·4031

L

CATEGORY

CATHODE·,
ANODE-a
ANODE·b

l-....

!

~

f

1.1BOI

, . ---i1'J.- 0.251.0101

7.621.3001~
DATE CODE

A,B,D
SIDE

A,B,C,D
END

C
SIDE

package Dimensions (HDSP-3730/4130 Series)
7.01 (.276)

~lrl0°

1 ~:

13-1
~: __ ~l
14

12

1905' 0.25: :

11 10.92 (.430)

l.H.D.P .

...L

75
{

°TO

6.35 (.250)

cb 'D::~--:Is
£1<0,;, ~0~81

;:

\'r"'-I a '

3.18 (.125)

N",'4~'

v ~~

J

L-_ _- "

~I

R.H.D.P.

\

A.H.D.P.

Note 4

- - - - - - . - 5.21 (.205)

E

H

F,G
FRONT VIEW

Ir

12 .70 1.50
MAX.

0)1 !

LUMINOUS
INTENSITY

CATEGORY

lJ.~-1-52L;~-,-,6~}L.5~1
4.0611601

-

MIN.

Ii
7.62

I

f~

~!~loO~~1
1

(.3001~

END VIEW

I

I
L

19.05 ± 0.25
1.750' .0101

1.17 MAX.
(.046)

U

1.52

COLOR

1.06~

~~TE 7 1

I

FUNCTION

PIN

100!~1

=f=-J
2.54
1.1001

DATE CODE

SIDE VIEW

7-129

F

G

373014130

3731/4131

3733/4133

ANODEl:.'lj

I

CATHOoE;;
(CATHODEf

!

NO PIN

NO PIN
NO PIN

CATHODE c
ANODE·e
ANODE-c

NOCONNJS)

CATHOOE·e

ANQDE·e

CATHOOE-d
NOCONN,{5\

CATHODE·d
CATHODE·dp

CATHODE-,

CATHODE·c
CATHODE'g
NO PIN
CATHODE·b
ANODE[31

NO PIN

CATHODE·b
ANOOE{31

I

CATHODEd
ANODEd

CATHOOE!61

CATHODE-e

CATHODE-g

1'1
12
' 13
14

ANODE.
ANODEf

CATHOOE·dp

NOPIN

10

~

H

3736/4136

ANODEl31

NO PIN
NOPIN
NO CONN.!51

NOPIN

15.24
1.6001

-I

E

CATHODE.
CATHODEf

~ :TrT
1

--[-~~-I:~-

I ANODE-d
ANODE·dp

. ANODE·,
i ANODE-g
\ NOPIN
, ANODE·b

I

I ",'OOl:;'J
CATHODE·b

MAX.I -

4.06 (.160)
MIN.

NOPIN

' 1--.1
R

10 .16
--11,.4001
LUMINOUS
INTENSITY

ANODE·dp

CATHODE-e

ANODE·dp
CATHODE·dp
CATHODE·b
CATHODE·a

I ~~~~~.

package Dimensions (5530/5730 Series)

',;:~~ '.' ,.

TOP END VIEW I,J, K, L

17.J:::-- l a
9 8O
7 6

±L . ,
MAX
I

4.81

1.1911

-1
-I

Ii.

t

±L 9.
•

3

ANODE'

CATHODE c ANODE/;
CATHODE

ANODEc,d

6

CATHODE'"' CATHODE b
ANODE c
ANODE a, b
DP
CATHODE
ANODE DP CATHODE
DP
DP
CATHODEb ANODE b
CATHODE a

1

CATHODE

CATHODE~

4

----.j

I--

8.00

I (.3151 I

.254

~I~~~I

[r

Ii.

1.1911

j

6.86
1.2701

a

ANODE a,

ANOD!:a

I),

ANODE b
CATHODE
a, b, DP
ANODE DP
ANODE a
CATHODE

a. b, DP

DP

1 -l
. _-.-l

I

4.81

234

CAllIODE e ANODEe
CATHOOEd ANODEd

LS538

K $537

J 5533-

1
2

5

tJ
---J

• 5531

',d
DATE

CODE

17'0r.~9
i 70
1.6731

PIN

1.5601

1 .!7:
I--.:2
1.4951

1

FUNCTION

14.22

1.6731

8

ANODEI"

CATHODE16) ANODE c, d

9

CATHODE.
CATHODE 9

ANODE f

CATHOOEd

ANOO!; 9

NOPINI"

CATHODE

o.d

15 .24
1.6001

10

ANODEd
NOPINI5'

L

12.573
1.4951
MAX

FRONT VI EW K, L

I

SIDE VIEW I,J, K, L

package Dimensions (3900/4200 Series)
----j

(6~~~1

\

r--

(

11.07

'i.

I0036y.
1.78

10.0701

+

1

+

+

2

+

+

+
o +
3

6
7

+
+

B +
9

LHDP

8.2~
10,3251
'

NOTE 4

L

'"

NOTE4

AHDP

1.27

,110.0501
ILcHARACTER

,
S

'i.

PACKAGE~

LpACKAGE

FRONT VIEW M, P

FRONT VI EW N, 0

FRONTVIEWQ

COLOR BIN(7J

19.96MAX'l

jlO.786MAKI

.

LUMINOUS
INTENSITY

.

6.1 MIN,
10.240 MIN,I

.

--r I.

•

~
10,0401

-=f,0.0201

CATEGORY

8.38:t 0.25

..L.

0.51

J..10.. 330' 0.0101

\

I

10,2001

PIN 2AND 17

.l..

~i~~:: ~,:;51

2
3
4
5
6
7

6
9
10

11
12

NOTES:
1. Dimensions in millimeters and (inches),
2, All untoleranced dimensions are for reference only,
3. Redundant anodes.

N

0

3901/4201

3903/42{)3

NO PIN
CATHOOe. a
CATHODE f
ANODEPI

CATBODE e
ANODEnJ
CATHODE dp

NO PIN
NOPIN
NO PIN

CATHODE d
!ANODE!))
CATHODE

15

,CATHOOEg
jCATHOOEb

16

DATE CODE

SIDE VLEW M, N, 0, P, Q

M

3000/420D

13

,.

10.600' 0.0101

END VIEW M, N, 0, P, Q

P'.
1

~\f=t.08

17

INOPIN
ANOOE(31

18

NO PIN

4, Unused dp position.
5. See Internal Circuit Diagram.
6. Redundant-Cathodes.

7-130

Function

--:-.

c

NO PIN

CATHODE~~}

NO PIN

NO PIN

NOPIN

ANODE a

ANODEI~)

CATHODEf6 )

ANODEf

ANOO,.

CATHODE!~1

NO, CONNEC,
NO PiN
NOPIN
NO PIN
CATHODE dp ANOOE dp
CATHODEd
ANODE d
ANODEl"))
CATHODE!"!
ANODEc
CATHODE c
CATHODEg
ANODa 9
CATHODE b
ANODE b
NOPIN
NO PIN

ANOtle PJ
NO PIN

0
3906/4206

CATHODEitl~

CATHOQEa
CATHODE f
CATHODE e
ANOOEPI
NO, CONNEC,
NO PIN

P
3005/42:05

NO PIN
CATHODE a
ANODE d
CA'rHODEo
CATHOOEc
CATHODE eo
ANODE e
CATHODE dp
NO PIN
ANODE: dp
CATHODE dp
CATHOD~ b
ANODE I:lANOOEc
ANODE a
NO PrN
CATHODE a

NO PiN

NO PiN
ANODE a
ANODE f

I

CA1'HODE[~1

ANODE •

CAiHODEY'ij
ANODE dp
NO PiN
NOP-IN
NOPIN
ANODE d
CATHOOEJ~!

ANOOE c
ANODE ~
ANODE b
NO PIN

7. For HDSP-40301-41301-57301-4200 Series product only.
8. See part number table for LHDP and RHDP designation.

Internal Circuit Diagram (HDSP-3530/4030 Series)

c

B

A

o

Internal Circuit Diagram (HDSP-3730/4130 Series)

E

F

H

G

Internal Circuit Diagram (HDSP-5530/5730 Series)
10

9

8

7

6

jO

9

8

7

6

1

2

3

4

5

1

.2

3

4

5

1

9

8

7

6

2

3

4

5

K

J

1

9

8

7

6

2

3

4

5

L

7-131
..... __._._-_._.. _ - - - - - - - - - - - - - - - - - - - - _ . --

Internal Circuit Diagram (HDSP-3900/4200 Series)
1B

1B

o

N

M

1B

p

Q

Electrical/optical Characteristics at TA
Parameter
Luminous Intensity!
Segmentl 9.1O j
(Digit Average)

Symbol
Iv

Device
HDSP-

Test Condition

3530
3730
5530
3900

100 mA Pk; 1 of 5
Duty Factor

3530
3730
5530
3900

100 mA Pk; 1 of 5
Duty Factor

4030
4130
5730
4200

Dominant Wavelengthl11, 12)
(Digit Average)

"PEAK

lid

Typ
7100
10860
6000
7000

Max

1500
1500
2200
2200

/tcd

4500
5000
5500
7000

,!tcd

2200
2500
2800
3400

20 mA DC

Units
/ted

4970
7600
5000
4800

20 mA DC

4030
4130
5730
4200

Peak Wavelength

Min
2200
3350

pcd

3530/37301
5530/3900

635

nm

4030/41301
5730/4200

583

nm

3530/37301
5530/3900

626

4030/41301

581.5

586

592.5

2.6

3.5

3.0

25.0

nm

5730/4200
Forward Voltage/Segment or D.PJ1~J

VF

All Devices

Reverse Voltage/Segment or D.p.m'

VR

Devices

IF = 100 mA
IR = 100pA

V
V

Temp. Coeff, of VF/Seg or D.P.

/:"VF/oC

All Devices

-1.1

mV/oC

Thermal Resistance
LED JUnction-lo-pin

R8J-PIN

3530/40301
3730/4130

282

°CIWISeg

5530/5730

345

°C/W/Seg

3900/4200

375

°CIW/Seg

I

IF"" 100 mA

Notes:
9. Case temperature of the device immediately prior to the intensity measurement is 25° C.
10. The digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the package.
11. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color
of the device.
12. The yellow displays are categorized as to dominant wavelength with the category deSignated by a number adjacent to the
intensity category letter.
13. Quality level for electrical characteristics is 1000 parts per million.
14. Typical specification for reference only. Do not exceed absolute maximum ratings.

7-132

",0

"'w

~~

,,0:

20

.... w

13.5

~~

"'0:
0::>

~!;t~

10

~ffi~
:>~o:
",,0:

X~a

~~~g~I~'\.~~~l'\gl~r\.~~"~~ml~~Ejl

TEMPERATURE

DERATING OF
r---r-+-t+1t~~~,,+--r~~H+~,,~r-~~++~---+--~~HH~IDCMAX

"'0"
" .... 0
"- 2
....
0
"

"

4
3,4
3

OW"

~~~

~=a~~~~~~~ta~~~~~"~

0:""

f----t-++H+H1----1XIX
'" '"

""
"

THIS REGION
REOUIRES IN
OPERATION

~ rf~ ~~~

1 L---L-~~~~__~__~~WU~___L~~~~1__ _~~~WW~~-DCOPERATIDN
10

u

1 09

100

1000

10,000

1:p -PULSE DURATION -ps

Figure 1. Maximum Allowed Peak Current vs. Pulse Duration

1,2,-,......,...-,.-,--,.-,......,...-,.-,--,......,....-,

50

....

45

iii0:

40

""
0"

30

""

"X
"'"x,

••
u

>

,, \

0:

35

"~"

Ciiu
20

1.5

2.0

1.'
1.2
1.0
0.8

""0

0.6

0:

0.'

V
V

0.2

-57:30/-4200 SERIES
2.5

1.8

,,~

~~

~

/
/

1.6

;:'0

-0:

, '\HOSP-40301-41301

2.0

o IL

o

3.0

10

/

V

1t+
#

I- ' l -I-

I I
I

20

30

40

VF - PEAK FORWARD VOLTAGE - V

IF - SEGMENT DC CURRENT - rnA

Figure 4. Peak Forward Segment Current vs.
Peak Forward Voltage

Figure 5. Relative Luminous Intensity vs.
DC Forward Current

7-133

Electrical

Mechanical

These display devices are composed of eight light emitting
diodes, with light from each LED optically stretched to form
individual segments and a decimal point.

These devices are constructed utilizing a lead frame in a
standard DIP package. The LED dice are attached directly
to the lead frame. Therefore, the cathode leads are the
direct thermal and mechanical stress paths to the LED dice.
The absolute maximum allowed junction temperature,
T J MAX, is 105° C. The maximum power ratings have been
established so that the worst case VF device does not
exceed this limit.

The devices utilize LED chips which are made from GaAsP
on a transparent GaP substrate.
These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4
should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum VF
values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the
following VF MAX models:
VF MAX = 2.15V + IpEAK (13.5fl)
For: IF 2 30 mA

Worst case thermal resistance pin-to-ambient is 400° C/
W/Seg when these devices are soldered into minimum
trace width PC boards. When installed in a PC board that
provides RlipIN-A less than 400°C/W/Seg these displays
may be operated at higher average currents as shown in
Figure 2.

optical

VF MAX = 1.9V + IDC (21.8fl)
For: 10 mA S; IF S; 30 mA

Temperature derated strobed operating conditions are
obtained from Figures 1 and 2. Figure 1 relates pulse
duration (tp). refresh rate (f), and the ratio of maximum peak
current to maximum dc current (lPEAK MAX/IDC MAX).
Figure 2 presents the maximum allowed dc current vs.
ambient temperature. Figure 1 is based on the principle
that the peak junction temperature for pulsed operation at
a specified peak current, pulse duration and refresh rate
should be the same as the junction temperature at
maximum DC operation. Refresh rates of 1 kHz or faster
minimize the pulsed junction heating effect of the device
resulting in the maximum possible time average luminous
intensity.

The radiation pattern for these devices is approximately
Lambertian. The luminous sterance may be calculated
using one of the two following formulas.
Iv(cd)
Lv(cd/m2) =A-2

(m)

rrlv(cd)
Lv(footlamberts) = A(ft2)

The time average luminous intensity can be calculated
knowing the average forward current and relative efficiency characteristic, '1IPEAK., of Figure 3. Time average
luminous intensity for a device case temperature of 25° C, Iv
(25° C). is calculated as follows:
Iv (25°C) =

[~~A:GI>:]

Example: For HDSP-4030 series
'1IPEAK = 1.00 at IPEAK = 100 mAo For OF = 1/5:
°
_
mAl ~ .00J [4.5 mCdJ = 4.5 mcd/
Iv (25 C) - L20 mAJ
segment

r?O

The time average luminous intensity may be adjusted for
operating junction temperature by the following exponential equation:

where

TJ = TA

+ PD'

+ 25° C)l

RIIJ-A

DEVICE

K

-3530/-37301-5530/-3900

-o.0131/oC

-4030/-4130/-5730/-4200

-0.0112fOC

AREA/SEG.
mm 2

-3530/-4030

2.5

.0039

-37301-4130

4.4

.0068

-5530/-5730

8.8

.0137

-3900/-4200

14.9

.0231

Contrast Enhancement

['1IPEAK] Ov DATA SHEET]

Iv (TJ) = Iv (25 0 C) e[k(TJ

AREA/SEG.
IN.2

DEVICE

The objective of contrast enhancement is to optimize display readability. Adequate contrast enhancement can be
achieved in indoor applications through luminous contrast
techniques. Luminous contrast is the observed brightness
of the illuminated segment compared to the brightness of
the surround. Appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected
from the area around the display while transmitting most of
the light emitted by the segment. These filters are described
further in Application Note 1015.
Chrominance contrast can further improve display readability. Chrominance contrast refers to the color difference
between the illuminated segment and the surrounding area.
These displays are assembled with a gray package and
untinted encapsulating epoxy in the segments to improve
chrominance contrast of the ON segments. Additional contrast enhancement in bright ambients may be achieved by
using a neutral density gray filter such as Panelgraphic
Chromafilter Gray 1D, or 3M Light Control Film (louvered
film).

7-134

rh~

INfer49~TY AND COLQR
9EI:E&TID DI6P~

HEWLETT

a:~ PAm,K~

TECHNICAL DATA

Features

JANUARY 19B6

Luminous intensity selection is available for red, high
efficiency red, and high performance green. Color selection
is available for yellow.

• INTENSITY SELECTION IMPROVES
UNIFORMITY OF LIGHT OUTPUT FROM
UNIT TO UNIT. AVAILABLE IN RED,
HIGH EFFICIENCY RED, AND HIGH
PERFORMANCE GREEN.
• COLOR SELECTION IMPROVES UNIFORMITY
OF COLOR FROM UNIT TO UNIT. AVAILABLE
IN YELLOW.
• TWO CATEGORY SELECTION SIMPLIFIES
INVENTORY CONTROL AND ASSEMBLY.

To ensure our customers a steady supply of product, HP
must offer selected units from the center of our distribution.
If our production distribution shifts, we will need to change
the intensity or color range of the selected units our
customers receive. Typically, an intenSity may have to be
changed once every 1 to 3 years.
Current intensity and color selection information is available
through a category reference chart which is available
through your local field sales engineer or local franchised
distributor.

Description
Seven segment displays are now available from HewlettPackard which are selected from two categories. These
select displays are basic catalog devices which are presorted for luminous intensity and color then selected from
two predetermined adjacent categories and assigned one
convenient part number.
Example: Two luminous intensity categories are selected
from the basic catalog 5082-7750 production distribution
and assigned to the part number 5082-7750 option S02.

Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings, mechanical dimensions,
and electrical/optical characteristics are identical to the
basic catalog device.

Device Selection Guide
The following table summarizes which basic catalog devices are available with category selection.
COLOR
High Ambient
High Efficiency
Red

High Efficiency
Red

Character Height

Red

7.62 mm (0.3"1
Microbright

HDSP-7301 Option S02
HDSP-7303 Option S02
HDSP-7307 Option S02
HDSP-730B Option S02

HDSP-7501 Option
HDSP-7503 Option
HOSP-7507 Option
HOSP-750B Option

7.62 mm (0.3"1

5082-7730 Option S02
5082-7731 Option S02
5082-7736 Option S02
5082-7740 Option S02

5082-7610 Option
.5082-7611 Option
5082-7613 Option
5082-7616 Option

10.92 mm (0.43"1

5082-7750 Option S02
5082-7751 Option S02
5082-7756 Option S02
5082-7760 Option S02

5082-7650 Option
5082-7651 Option
5082-7653 Option
5082-7656 Option

14.2 mm (0.56"1
Single Digit

HDSP-5301 Option S02
HDSP-5303 Option S02
HDSP-5307 Option S02
HDSP-5308 Option S02

14.2 mm (0.56"1
Dual Digit
20 mm (0.8"1

Yellow

High Ambient
High Elliciency
Yellow

High Performance
Green

Basic Family
Not Applicable

Selected Version
Not Available

Basic Family
Not Applicable

HDSP-7801 Option S02
HDSP-7803 Option S~2
HOSP-7807 Option S02
HOSP-7B08 Option S02

S02
S02
S02
S02

HDSP-3530 Option S02
HDSP·3531 Option S02
HDSP-3533 Option S02
HDSP-3536 Option S02

Selected Version
Not Available

Selected Version
Not Available

HOSP-3600 Option S02

S02
S02
S02
S02

HDSP-3730 Option S02
HDSP-373t Option S02
HOSP-3733 Option S02
HOSP-3736 Option S02

5082-7663 Option S20
5082-7666 Option S20

HDSP-4133 Option S20
HDSP-4136 Option S20

Selected Version
Not Available

HDSP-5501 Option S02
HDSP-5503 Option S02
HDSP-5507 Option S02
HDSP-5508 Option S02

HOSP-5531 Option S02
HDSP-5533 Option S02
HOSP-5537 Option S02
HDSP-5538 Option S02

Selected Version
Not Available

Selected Version
Not Available

HDSP-5601 Option S02
HOSP-5607 Option S02

Selected Version
Not Available

HDSP-5521 Option S02
HOSP-5523 Option S02

Basic Family
Not Appticable

Selected Version
Not Available

Basic Family
Not Applicable

Selected Version
Not Available

HOSP-3400 Option S02
HDSP-3403 Option S02
HOSP-3406 Option S02

Basic Family
Not Applicable

HOSP-390D Option S02
HDSP-3901 Option S02
HDSP-3903 Option S02
HOSP-3906 Option S02

Basic Family
Not Applicable

Selected Version
Not Available

Selected Version
Not Available

Notes:
1. Option S02 designates a two intensity category selection.
2. Option S20 designates a two color category selection.

S02
S02
S02
S02

HDSP-3603 Option S02
HOSP-3606 Option S02

3. Option S02s of different part numbers may not have the same apparent
brightness. Contact your HP Field Sales Office for design assistance.

7-135

5082·7300
5082·7302
5082·7304
5082·7340

HEXADECIMAL
AND NUMERIC
INDICATORS

Flin-HEWLETT

a!~ PACKARD

TECHNICAL DATA JANUARY 1986

Features
• NUMERIC 5082·7300/-7302 • HEXADECIIIIJAL 5082-7340
0-9, A-F, Base 16
0-9, Test State, Minus
Sign, Blank States
Operation
Blanking Control,
Decimal Point
7300 Right Hand D.P.
Conserves Power
7302 Left Hand D.P.
No Decimal Point
• DTLlTTL COMPATIBLE
• INCLUDES DECODER/DRIVER WITH 5-BIT
MEMORY
8421 Positive Logic Input
• 4 x 7 DOT MATRIX ARRAY
Shaped Character, Excellent Readibility
• STANDARD DUAL-IN-LiNE PACKAGE
INCLUDING CONTRAST FILTER
15.2mm x 10.2 mm (0.6 inch x 0.4 inch)
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Uniformity of Light Output from
Unit to Unit within a Single Category

The 5082-7302 is the same as the 5082-7300,except that the
decimal point is located on the left-hand side of the digit.
The 5082-7340 hexadecimal indicator decodes positive 8421
logic inputs into 16 states, 0-9 and A-F. In place of the
decimal point an input is provided for blanking the display
(all LED's off), without losing the contents of the memory.
Applications include terminals and computer systems using
the base-16 character set.

Descri ption
The HP 5082-7300 series solid state numeric and hexadecimal indicators with on-board decoder/driver and memory
provide 7.4 mm (0.29 inch) displays for reliable, low-cost
methods of displaying digital information.

The 5082-7304 is a (±1) overrange display including a righthand decimal pOint.

Applications

The 5082-7300 numeric indicator decodes positive 8421
BCD logic inputs into characters 0-9, a "-" sign, a test pattern, and four blanks in the invalid BCD states. The unit
employs a right-hand decimal point.

Typical applications include point-of-sale terminals, instrumentation, and computer system.

package Dimensions
7302

7300

7340
Function

1-10.2 MAX.-l

1

r-

1.4001

--.1
Pin

1

1

14.0

'ri'T"lrlr-h--.....

2

~T'

3
4

5
6
7

LUMINOUS
INTENSITY
CATEGORY

PIN 1 KEY
4

3

2

a

§:
'-TI'

. SEATING
PLANE

~'

.8
1.151

"3.TVP]~' D~
(.0501

1.5.
(.061
I 3.4

TYP.

0.08
~11_0.5,
10.020 ± 0.0031
2.S±0.13TYP.
(0.10 ± O.OOSI

1

7-136

,

5082·7300
and 7302
Numeric
Inpul2
Input4
InputS
Decimal

5082·7340
Hexadecimal
Input 2
Input 4
Input a
Blanking

Point

Control

Latch
Enable
Ground

Latch
Enable
Ground

Vee

vee

Input 1

Input 1

Notes:
1. Dimensions in mil[imetres and
(inchesl.
2. Unless ·otherwise specified, the
tolerance on all dimensions is
±O.3S mm (± 0.015 inch),
3. Digit center line is ±O.25 mm
(±O.Ol inch) from package center
line.

Absolute Maximum Ratings
Description
Storage temperature, ambient
Operating temperature, case(l,21
Supply voltage(')
Voltage applied to input logic, dp and enable pins
Voltage applied to blanking input (71

Symbol

Min.

Max.

Unit

Ts

-40

+100

°C

Tc

-20

Vee

-0.5

+85
+7.0

°C
V

V"VDP,VE
VB

-0.5

+7.0

V

-0.5

Vee

V

230

·C

Maximum solder temperature at 1.59mm (.062 inch)
below seating plane; t .:;; 5 seconds

Recommended Operating Conditions
Symbol

Description
Supply Voltage
Operating temperature, case
Enable Pulse Width
Time data must be held before positive transition
of enable line
Time data must be held after positive transition
of enable line
Enable pulse rise time

Min.

Nom.

Max.

Vee

4.5

5.0

5.5

V

Te

+85

tw

-20
120

°C
nsec

tSETUP

50

nsec

tHoLD

50

nsec
200

hLH

Unit

nsec

Electrical/optical Characteristics (Te = -20·C to +85°C, unless otherwise specified).
Typ.(')

Max.

Unit

Supply Current

Icc

Vee=5.5V (Numeral

112

170

rnA

Power dissipation

PT

5 and dp lighted)

560

935

mW

Luminous intensity per LED
(Digit average) (S,6)

I,

Vce=5.0V, Te=25°C

Description

Logic lOW-level input voltage
Logic high-level input voltage

Symbol

Test Conditions

VEL

Enable high-voltage; data not
being entered

VEH

Blanking low-voltage; display
not blanked(7J

VOL

Blanking high-voltage; display
blanked (7)

VOH

32

70

/-lcd
0.8

V'L
VIH

Enable low-voltage; data being
entered

Min.

2.0

V
V

Vce=4.5V

0.8
2.0

V
V

0.8
3.5

V
V

Blanking low-level input current (11

IOL

Vce=5.5V. VOL=0.8V

20

/-lA

Blanking high-level input current (71

IOH

Vee=5.5V. VOH=4.5V

rnA

Logic low-level input current

I,L
IIH

Vce=5.5V. V'L=O.4V
Vee=5.5V. Vlli=2.4V
Vcc=5.5V. VEL=OAV

2.0
-1.6

rnA

+250
-1.6

/-lA
rnA

Logic high-level input current
Enable low-level input current
Enable high-level input current
Peak wavelength
Dominant Wavelength (81

IEL
IEH

Vec=5.5V. VEH=2.4V

+250

/-lA

APEAK

Te=25°C

655

Ad

Tc=25°C

640

nm

0.8

gm

Weight

nm

Notes: 1. Nominal thermal resistance of a display mounted in a socket which is soldered into a printed circuit board: ElJA=5O"CIW;
9Je=15° CIW; 2. EleA of a mounted display should not exceed 35°CIW foroperation up to Te = +85° C. 3. Voltage values are with respect to
device ground. pin 6. 4. All typical values at Vee=5.0 Volts. Tc=25°C. 5. Thesadisplays are categorized for luminous intensity with the intensity category designated by a letter located on the back of the display contiguous with the Hewlett-Packard logo marking. 6. The
luminous intensity at a specific case temperature. Iv(Tc) may be calculated from this relationship: Iv(Tc)=lv (25° C) e[-.Q1881"0 ITc-25"C I[
7. Applies only to 7340. 8. The dominant wavelength. Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

7-137

.S

Pin.

6-----.
~=: ~

INPUT
DP[21

~~j r-

ENABLE
INPUT

i!i0:

.25

:>

.20

BLANKING (3 )

!IO%

CONTROL

"~

.15

""zz

GROUND

Vcc="OV_
VE =ov
V, -OV

"•
l-

I

.05

--

20

0

40

-.8

~

x"

.....

00

90

I

\

\

-.2

\

1.0

5OB2-7300n302

5082-1340

()

L

L

(}

L

L

H

L

L

H

L

...1,

L

L

H

H

l

H

L

L

l

H

L

H

L

H

H

L

L

H

H

H

L

H
H

H

2.0

3.0

C.

.:>

:::;

:::;

I::.
•...
'''j

."
tl

H

L

L

f;

f;

l

L

H

(:i

L

H

L

E~

L

H

H

(BLANK)

q..
fl
:",
t::...

\t61~
OS

1.0

2.0

4.0

3.0

VIN - LOGIC VOLTAGE

Figure 6. Typical Logic and Decimal
Point Input Current vs.
Voltage for the 5082·7300
Series Devices. Decimal
Point Applies to 5082·7300
and ·7302 Only.

I...

H

L

L

(BLANK)

L

H

.•.

[)

H

H

H

L

(BLANKI

E:

H

H

(BLANK)
H
ON
OFF
LOAD DATA
LATcII DATA
D(SPLAY·ON
OISPLAY.()FF

F'
Vop =L
Vop= H

v.

-L

Y. -H
Y. -L

v.

-H

Notes:
.1. H = Logic High; L = Logic Low. With the enable input at logic high'
changes in BCD input logic levels or D.P. input have no effect upon
display memory, displayed character, or D.P.
2. The decimal point input, DP, pertains only to the 50B2·7300 and
5082· 7302 displays.
3. The blanking control input, B, pertains only to the 5082·7340
hexadecimal display. Blanking input has no effect upon display
memory.

7-138

5.0

-v

"'!

H

BLANKING('I

00

V

1..J

H

ENAlIlEI1}

5.0

VE '

"'J

i..:
::::

DECIMAL PT.!2)

4.0

If

f

..

;.0.
''':

H

H

.....

·.6
-.4

Figure 5. Typical Latch Enable Input
Current vo. Voltage for the
5082·7300 Series Devices.

x,

L

-1.2

.1'

VE - LATCH ENABLE VOLTAGE - V

L

Vee -S.QV

-1.0

.....

-.4

Cc

L

I

-1.6

ou
§ -.8

TRUTHTABL£
BCDDATAlll
x2
X.

5

v

'To '25'C'_

1I -1.4
~

-.6

I

Figure 4. Typical Blanking Control
I"put Current VS.
Temperature 5082·7340.

4

rr:

_w

Te -CASE TEMPERATURE _

i
3

-1.8

z

%

00

2

l-

ill

60

I

Vee· S,OV

:l

r---

V Vi

1

Figure 3. Typical Blanking Control
Current vo. Vo Itage for
5082·7340.

~C'25'C'_

-.2

-20

-""

1/

VB - BLANKING VOLTAGE -

I

Va "O.8V
0

LEO
MATRIX

.1

.~

-1.6

:> -1.2
u
w
~
-1.0

r--

3.~V

~

1--0

-1.4

i

I'-r-...

.10

DRIVER

-1,8
I

VB -

1/

I
~

Figure 2. Block Diagram of 5082·7300
Series Logic.

~4'iv

r-

ID

MATfUX

1/

.2

"zj

Leo

)7

u

"

4_

TC -25·C

.3

00

I

"
.......

Vee "S.OV

~

:>

OP

tTLH

1.6V

~

0:

~

MATRIX
DECODER

OP

Figure 1. Timing Diagram of 5082·7300
Series Logic.

.30

I-

•

~'N~

I
I-

LATCH
MEMORY

~

i

1.&V

"•

4~

.4

I

~

DATA INPUT
(HIGH LEVEL DATA)

.35

"e

B_Xl
l_X2

LOGIC

~

1.5V

";~

Vee
ENABLE

\tOLD

t IfTU'
DATA INPUT
(LOW LEVEL DATA)

~~~-

--

~.--

Solid State Over Range Character
For display applications requiring a ±, 1, or decimal point designation, the 5082·7304 over range character is available. This
display module comes in the same package as the 5082·7300 series numeric indicator and is completely compatible with it.

package Dimensions
REAR VIEW

FRONT VIEW

5

6

7

SIDE VIEW

END VIEW

I~)< -7-°.,°' SEATING~~~i~} (~ )

8

I

'-.....

('."O~lill

11",)

DATE CODE

4

3

2

0.3 !O.OB TYP.

("

PIN 1 KEY

(.012,.003)

~

, --

2.8

1

(.11)

~

S~tZ~~G

PLANE

,:::,:,,_',.: ':,'

I

3.4

J!11

t

"3TYP'~~~
I 1_.5 '0.08 TYP.
(.050)
~
(.020 ±.003)

~~ -r"

1

2.5 '0.13 TYP.

r

4.3

.:-,.,/"

~- '~"}"~If
(.10 ±.ODS)

1.17)

NOTES:

1. Dimensions in inche~ and (millimeters).
2. Unless otherwise specified, the tolerance

5082-7304

on all dimensions is ±-.015 inches. (± .38mm)

TRUTH TABLE FOR 5082·7304
CHARACTE'R

'"

""

'+

.?;3 .•.'.','.,.,,,,I1"",y:l

H
L
X
X

-

1
Decimal Point
NOTES:

,!II'II

PIN

1 ,

X
X
H
X

",<,'

W')~

8

i"'' '

"'' '

H"
H

""'X
X
H

TYPICALDRI

"";,'/'
""

X
X

§I~nk
L
L
-r L
""""",ct'"
L: Line switching transistor in Fig. 7 cutoff.
H: Line switching transistor in Fig. 7 saturated.
X: 'don't care'

--,
I
I
I
I
I

Absolute Maximum Ratings
DESCRIPTION

SYMBOL MIN ""MAX

Storage temperature, ambient
Qperating temperature, case
Forward current, each LED
Reverse voltage, each LED

Ts

-40

Tc

-20

IF

VR

+100
+85

d

UNIT '

°c

10

°c
mA

4

V

__ J

I

'-->3
56W1

RECOMMENDED OPERATING CONDITIONS
LEO s)JPply voltage

5.0

5.5

V

Forward current, each LEO

5.0

10

mA

NOTE:
LED current must be externally limited. Refer to figure 7
for recommended resistor values.

Figure 7.

Electrical/optical Characteristics (TC = -20°C TO +85
DESCRIPTIClN

'SYMBOL

0 C,

TEST (!ONDITIONS

UNLESS OTHERWISE SPECIFIED)
MIN

TYP

MAX

UNIT

1.6

2.0

V

250

320

mW

Forward Voltage per LED

VF

IF = 10mA

Power dissipation

PT

IF -10 mA

Luminous I ntensity per LED (digit average)

Iv

IF - 6 mA

Peak wavelength

Apeak

Tc = 25°C

655

nm

Dominant Wavelength

Ad

TC=2SoC

640

nm

0.8

119 m

all diodes lit
32

70

!-Lcd

TC = 2SoC

Weight

7-139

-~----

F/iOW

HEWLETT

~1.!.tI PACKARD

HEXADECIMAL AND
NUMERIC DISPLAYS
FOR INDUSTRIAL
APPLICATIONS

5082·7356
5082·7357
5082-7358
5082·7359

TECHNICAL DATA

JANUARY 1986

Features
• CERAMIC/GLASS PACKAGE
• ADDED RELIABILITY
• NUMERIC 5082-7356/-7357
0-9, Test State, Minus Sign, Blank States
Decimal Point
7356 Right Hand D.P.
7357 Left Hand D.P.
• HEXADECIMAL 5082-7359
0-9, A-F, Base 16 Operation
Blanking Control, Conserves Power
No Decimal Point
• TTL COMPATIBLE
• INCLUDES DECODER/DRIVER WITH 5 BIT
MEMORY
8421 Positive Logic Input and Decimal Point
• 4 x 7 DOT MATRIX ARRAY
Shaped Character, Excellent Readability
• STANDARD DUAL-IN-LINE PACKAGE
15.2mm x 10.2mm (.6 inch x .4 inch)
• CATEGORIZED FOR LUMINOUS INTENSITY

pattern, and four blanks in the invalid BCD states. The unit
employs a right-hand decimal point.
The 5082-7357 is the same as the 5082-7356 except that
the decimal point is located on the left-hand side of the
digit.

Description
The HP 5082-7350 series solid state numeric and
hexadecimal indicators with on-board decoder/driver and
memory provide 7.4mm (0.29 inch) displays for use in
adverse industrial environments.
The 5082-7356 numeric indicator decodes positive 8421
BCD logic inputs into characters 0-9, a " -" sign, a test

The 5082-7359 hexadecimal indicator decodes positive
8421 logic inputs into 16states, 0-9 and A-F. In place of the
decimal point an input is provided for blanking the display
(all LED's off), without losing the contents of the memory.
Applications include terminals and computer systems
using the base-16 character set.
The 5082-7358 is a (±1) over range display including a right
hand decimal point.

Applications

package Dimensions
_I
I

h- 10.2 MAX.
Ir- (.400)

7356

!-- 10.2 MAX
(AOO)

I

Typical applications include control systems, instrumentation, communication systems, and transportation
equipment.

_I

1

(I

~+---IH'I-t-r 13.5

i~;'

L,-I.,-,!,-+rl.....

7359

13.5

"

L,-I.,-,!,-+r.....

I

3 .•

I

I

,:1"

4.8

~(.19)

(.12)

END VIEW
LUMINOUS
INTENSITY
CATEGORY

.-1---1-_...,

PIN 1 KEY

3

2

FUNCTiON
AND 7357

5082·7359
tlEXA·

NUM~RIC

DECIMAL

5082·7356
PIN

1
2

loput 2
Input 4
~-~ t-'lnputB
~--

4

Oecima1
potnt

5

Latch

(I

enobfe
Gr-Qund

7

Vee

8

Input 1

Input 2
Input 4
Input 8
Bl

"
I-

200

";;z

150

~

100

~
z

"

b
~

:::
<:j
..

;",

~

(:

',,'

"

..

,,,~

q

J::f

..

L

H

H

(BLANK)

H

H

L

L

(SLANK)

H

H

L

H

....

H

H

H

L

(SLANK)

H

H

H

H

(BLANK)

: :

_m

4

;...
n..

: '

F
,

~

.."

Vor

OFF

VO?'" H

LOADOATA

V. -L
VE -H

LATCH DATA

DISPLAY·ON

L

Va -L
VB -H

DISPLAY·DFF

"

"

......

50

VI =QV

5

VB - BLANKING VOLTAGE - V

Figure 3. Typical Blanking Control
Current VB. Voltage for 50827359.

~C'25'cl_

"E -1.6
J

Vee c5.0V

I-

-- .......

..........

Va =4.5V

r-

VB ... 3.5V

~

Va -O.8-V
0
-55 -40

I

-1.8

V."OV-

I
3

U
...

ON

V~ •••Jv

J

/1
2

l-

V
V
/

Vee "6.0V

::>

z

J

---

J

""z

,.. ,
"'1

Notes:
,. H = Logic High; L = Logie Low. With the enable input at logic high
changes in BCD input logic levels or D.P. input have no effect upon
display memory, displayed character, or D.P.
2. The decimal point input, DP. pertains only to the 5082-7356 and
5082-7357 displays.
3. The blanking control input, B, pertains only to the 5082-7359
hexadecimal display. Blanking input has no effect upon display
memory.

6~

1.300 r\.

.3

..
,

".

"...

MATRIX

.5

iii

Lj

...,
..":

H

LEO

f-o-

Figure 2. Block Diagram of SOB2-735X
Series Logic.

a:
a:

;::'~

..
Lt
...
:'"

L

BLANKINGi31

I-

"

L

ENABLEltl

MATRIX
DRIVER

1

~

1
" ,
: ...
.. ,,

H

DECIMAL PT,I21

~-

LEO

BLANKING(3)
CONTROL
4_

"E

('i
~

H

OP

GROUND

()

8_X1

LOGIC

5082..7359

508H35617357

X,

X2

X.

L

1.SV

ENABLE
INPUT

x"

~

1.5V

-20

0

20

40

::> -1.2
w
-1.0

.."....

":riii

-.a

~

-.6

J

-.4

:l

!-... ..........

\

\

~

-.2

\.

I
60

aD

100

TA -AMBIENT TEMPERATURE -'C

Figure 4. Typical Blanking Control
Input Current VS. Ambient
Temperature for 5082-7359.

7-142

~
a:

-1.4

00

1.0

2.0

3.0

4.0

VE - LATCH ENABLE VOLTAGE -

5.0

v

Figure 5. Typical Latch Enable Input
Current VB. Voltage.

I

-1.8

~

1.0

I

" .. :--

>- E

IT'25ocl
c
-

-1.6

Vee"

ffi ,

a:

5,OV

I -1.4

>z
~

"a -1.0
~

-.8

I

-.6

z

.8

a" z~

.7

~z

-1.2

u

I-

-

~

•
2

00

a
>-

-

:>

~~

\
1.0

"U
~ ~

VE ",ov

lrr\.
0.5

iii ...
_ul

-

i--

.6

~ ~ .5

......

2.

Vee"

S.OV
V1l '" a.BV

..........

-

.4

3.0

4.0

VIN - LOGIC VOlTAGE-V

Figure 6. Typical Logic and Decimal
Point Input Current vs.
Voltage.

o

-55 -40

5.0

.

,"

)

20

~

16

r-- B~ 18 r-- >-!5
(J

z>-

i ~
:r :I:
~~

"'.,
"'_=

I.....2

_w

-- .1

2.0

~~

~ ~
~ 9

.3

20
40
60
80
-20
TA - AMBIENT TEMPERATURE _ °c

100

Figure 7. Typical Logic and Enable
Low Input Current vs.
Ambient Temperature.

I

>- ", 2.
z I 22

L

1-

Vee'" s,ov
V1H '" 2.4V

/

14
12

10

/

8

6

/

L

/

4

L

!--7"'"

o

-55 -40

-20

0

20

40

60

80

100

TA - AMBIENT TEMPERATURE _ °C

Figure 8. Typical Logic and Enable
High Input Current vs.
Ambient Temperature.

Operational Considerations
ELECTRICAL

MECHANICAL

The SOB2-73SX series devices use a modified 4 x 7 dot
matrix of light emitting diodes (LED's) to display
decimal/hexadecimal numeric information. The LED's are
driven by constant current drivers. BCD information is
accepted by the display memory when the enable line is at
logic low and the data is latched when the enable is at
logic high. To avoid the latching of erroneous information,
the enable pulse rise time should not exceed 200
nanoseconds. Using the enable pulse width and data
setup and hold times listed in the Recommended
Operating Conditions allows data to be clocked into an
array of displays at a 6.7MHz rate.

These displays are designed for use in adverse industrial
environments.

The blanking control input on the SOB2-739S display
blanks (turns off) the displayed hexadecimal information
without disturbing the contents of display memory. The
display is blanked at a minimum threshold level of 3.S
volts. This may be easily achieved by using an open
collector TTL gate and a pull-up resistor. For example,
(1/6) 7416 hexinverter buffer/driver and a 120 ohm pull-up
resistor will provide sufficient drive to blank eight
displays. The size of the blanking pull-up resistor may be
calculated from the following formula, where N is the
number of digits:
RbI,nk = (Vee - 3.SV)/[N (1.OmA)]
The decimal point input is active low true and this data is
latched into the display memory in the same fashion as is
the. BCD data. The decimal point LED is driven by the onboard IC.

These displays may be mounted by soldering directly to a
printed circuit board or inserted into a socket. The leadto-lead pin spacing is 2.S4mm (0.100 inch) and the lead
row spacing is 1S.24mm (0.600 inch). These displays may
be end stacked with 2.S4mm (0.100 inch) spacing between
outside pins of adjacent displays. Sockets such as Augat
324-AG2D (3 digits) or Augat SOB-AGBD (one digit, right
angle mounting) may be used.
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +100° C, it is important to
maintain a case-to-ambient thermal resistance of less
than 3SoC/watt as measured on top of display pin 3.
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-1S, Genesolv DE-1S.
CONTRAST ENHANCEMENT
The SOB2-73SX displays have been designed to provide the
maximum posible ON/OFF contrast when placed behind
an appropriate contrast enhancement' filter. Some
suggested filters are Panelgraphic Ruby Red 60 and Dark
Red 63, SGL Homalite H100-160S, 3M Light Control Film
and Polaroid HRCP Red Circular Polarizing Filter. For
further information see Hewlett-Packard Application Note
964.
.

7-143

Solid State Over Range Character
For display applications requiring a ±, 1, or decimal point designation, the 5082-7358 over range character is available. This
display module comes in the same package as the 5082-735X series numeric indicator and is completely compatible with it.

package Dimensions
~1

~---------NUMERAl. ONE

v~

~---------,
~

MINUS PLUS

I
I

I

............ SEATING

I

PLANE

I
_ _ .JI

0.3 ±O.08TVP.
j,012±.003)

---",

I~~'~ .fl-+
I--

FRONT

lOOH

ISO<,

150rl

-ll.171

SlOE

Figure 9. Typical Driving Circuit.

TRUTH TABLE
REAR

PIN FUNCTION
Plus
1
2
Numeral One

NOTES;
1. OtMENSJONS IN MILLIMETRESAND {INCHES}.

2. UNLESS OiHERWISE SPECifIED, THE TOLERANCE
ON ALL DIMENSIONS IS :1:.38 MM It .015 INCHES).

3
4

Numeral One

5
6
7

Open

8

PIN

CHARACTER

END

+

-,

1

2,3

4

8

H
L

X

X
X
L

H

X
X
X
H
L

H
H
X
X
L

Decimal Point
Blank

DP
Open

NOTES:

Vee
Minus Plus

X
X
L

L: Line switching transistor in Figure 9 cutoff.
. H: Line switching transistor in Figure 9 saturated.
X: 'Don't care'

Electrical/Optical Characteristics
5082-7358

(TA = -20 0 G to 70°C, Unless Otherwise Specified)
SYMBOL

OESCRIPTION

TEST CONDITIONS

MIN

TYP

V

280

320

mW

IF = lOrnA
IF ~ lOrnA
all diodes lit

Luminous Intensity per LED (digit average}

Iv

IF

Peak wavelength

Apeak

Tc ~ 25°C

655

Dominant Wavelength
Weight

Ad

TC=250C

640
1.0

6 mA

40

85
/led

TC = 25°C

Recommended Operating
Conditions
Vce

Forward current, each LEO

IF

4.5

5.0
5.0

5.5

V

'0

mA

NOTE:
LED current must be externally limited. Refer to Figure 9
for recommended resistor values.

om
nm
gm

Absolute Maximum Ratings

SYMBOL MIN NOM MAX UNIT
LED supply voltage

UNIT

2.0

VF
PT

~

MAX

1.6

Forward Voltage per LED
Power dissipation

DESCRIPTION

SYMBOL MIN •. MAX.

Forward current, each LED

IF

+125
+100
10

Reverse voltage, each LED

VR

4

Storage temperature, ambient

TS

-65

Operating temperature, ambient

TA

-55

7-144

UNIT

°C
°C
rnA
V

HEX~OECIMAL AND NUMERIC
DISPLAYS_ FOR INDUSTRIAL APPLICATIONS

FliOW

HIGH EFFICIENCY RED
LOw Power HDSP-0760/0761/0762/0763

HEWLETT

II!~ PACKARD

High Brightness

HDSP-0770/0771/0772/0763

YElloW HOSP-086010861/0862/0863

G~~EN HDSP-O~60/0961/0962/0Q63
TECHNICAL DATA

JANUARY 1986

Features
• THREE COLORS
High-Efficiency Red
Yellow
High Performance Green
• THREE CHARACTER OPTIONS
Numeric
Hexadecimal
Over Range
• TWO HIGH-EFFICIENCY RED OPTIONS
Low Power
High Brightness
• PERFORMANCE GUARANTEED OVER
TEMPERATURE
• MEMORY LATCH/DECODER/DRIVER
TTL Compatible
• 4x7 DOT MATRIX CHARACTER
• CATEGORIZED FOR LUMINOUS INTENSITY
• YELLOW AND GREEN CATEGORIZED
FOR COLOR

Typical Applications

The numeric devices decode positive BCD logic into
characters "0-9", a "-" sign, decimal point, and a test
pattern. The hexadecimal devices decode positive BCD
logic into 16 characters, "0-9, A-F". An input is provided on
the hexadecimal devices to blank the display (all LED's
off) without losing the contents of the memory.

• INDUSTRIAL EQUIPMENT
• COMPUTER PERIPHERALS
• INSTRUMENTATION
• TELECOMMUNICATION EQUIPMENT

Devices
Pari Number
HDSP0760
0761
0762
0763
0770
0771
0772
0763

Description
These solid state display devices are designed and tested
for use in adverse industrial environments, The character
height is 7.4mm (0.29 inch). The numeric and hexadecimal
devices incorporate an on-board IC that contains the data
memory, decoder and display driver functions.

The over range device displays "±1" and right hand
decimal point and is typically driven via external switching
transistors.

Color

Description
Numeric, Right Hand OP
Numeric, Left Hand OP
Hexadecimal
Over Range ±1

High-Efficiency Red
Low Power
High-Efficiency Red
High Brightness

Front
View
A
B
C
0

Numeric, Right Hand OP
Numeric, Left Hand OP
Hexadecimal
Over Range ±1

A
B
C

A
B
C
0
B
C
0

0860
0861
0862
0863

Yellow

Numeric, Right Hand OP
Numeric, Left Hand OP
Hexadecimal
Over Range ±1

0960
0961
0962
0963

Green

Numeric, Right Hand OP
Numeric, Left Hand DP
Hexadecimal
Over Range ±1

0

A

7-145
-- -.-._---_ .._- ._---- _._-_._-_._---_. - - - - - - _._-_._---------

Package Dimensions
I-- 10.2 MAX. --I c
I ~ 1.4001 ~ I

FUNCTION

1

...-::--+--•• ••

••

I

PIN

HEXA-

NUMERIC

DECIMAL
Input 2:

......'..~t2
2:
;
'nput 4
r-~:i- ... Input 8

13.5

I

r"4- -o,cim.!
'r+-r-,+,rl.,.-,..

I

I

I

PO~l1t

5:r

latch
5
enable
1---- ..

4.8

~1.191

REAR VIEW
5

6

7

SIDE VIEW

8

LUMINOUS
INTENSITY

DATE CODE

~0.1O'

"'-- SEATING
PLANE

4

3

2

1.111

ffi-It

SEATING
PLANE

·8
1.151

Gtound

GrourKI

Vee

8

Inpot 1

Vee
Input 1

1.3 TYP.
1.0501

J~
~'

I

2. Vertical digit center line is ± .51mm (± .02")

from vertical package center line.
3. HDSP·0860 and HDSP·0960 Series.

3.4

-..1..1.1351

~'--+j11.5
TYP.
- 1.0201
2.5 TVP.
1.101

T

4.3

6
7

NOTES:
1. Dimensions in millimetresand (inches).

15
(.061

f

~'

0.3 TYP.

(.0121

PIN 1 KEY

Latch

enable

END VIEW

---r

IT
1
28~-~~~
15.2
(.6001

CATEGORY

I

Inpul4
lnput 8
6iank;~
control

.

(.171

tSETUP-+--~-+--~+tHOLD
DATA INPUT

L

(LOW LEVEL DATAl

TRUTH TABLE

BCD OA1Atil

~tr

DATA INPUT

(HIGH lEVEL DATAl

L

X,

NUMERIC

HEXA·
DECIMAL

'+t

.. i
H

H

...,
..

H

"'

.. ,

......

...

..

90%

....,.,

,

I'"~

H

Figure 1. Timing Diagram

7~

INPUT

=:
=:

-

H

H

~

..

~

~"

~"

t

(BLANK,

H

(BLANK}

~+ •

H

XS

MATRIX
O"CODER

LATCH

MEMORY

DP

.--

;

,

,..

H

~

><2
X4

H

H

H

H

DECIMAL PT pI

ENABLE"I

•

DP

GROUND

t

.

::J

...

)(1

~
BLANKINGI31
CONTROL

....,

'

-'i

1-H

1..

....
..
,..

H

+
lOGIC

H

H

ENABLE

L.

I::

H

Vee

~

:··f

BLANKING[3l

LEO
MATRIX

ORIVER

1-"

L

(BLANK}
H

(BLANKI

ON

Me

Vop-- L

LOAD DATA

VDP " H
VE • L

LATCH DATA

VE

DISPLAY,ON

VB " l

DISPLAY-OFF

VB

·H

Notes:
1. H'" logic High; l '" Logic low. With the enable input at logic high
changes in BCD input logic levels have no effect upon display
memory, displayed character, or DP.
2. The decimal point input, DP, pertains only to the numeric displays.
3. The blanking control input, 8, pertains only to the hexadecimal
displays. Blanking input has no effect upon display memory.

LED

MATRIX

6~
Figure 2. Logic Block Diagram

7-146

·~---------

._-----_.

----

. . . ---~--

..-

Absolute Maximum Ratings
Description

Ts

Min.
-65:

T"
Vee
Vj,vDP,V L

-55

+70

Unit
°C
°C

-0.5
::"0.5

+7.0

V

-0.5

Vee

SymbQJ

Storage temperature, !lombient
OperatingtemperC\lure, ambient 111
Supply volta~e 121 ,
Voltage applied to input logic, dp and enable p!nS
Voltageapplieq to bianking inputl21

I

VB

..

'Max.
+100;;:

Vc~

V
..

V

",t

Maximum solder temperature at 1.59mm (.062 inch)
below seating plane; t .;; 5 'seconds

°C

260.

Recommended Operating Conditions
Description
Supply Voltage 1.21

Symbol

,.

Vee

Operating temperature, ambient \11

T.,

Enable Pulse Width

Min.
4:5
-55

Nom.
5.0

Max.

5.5'
·+70_

.

Unit

Vi
°C··
nsec

tw

',·100

Time data must be held before pOsitive transition
of enable line

tSETl'.

50

nsec

Time data must be held after positive transition
of enable line

tHOLD

50

nsec

Enable pulse rise time

t n.H

HDSP-0760
Series

HDSP-0770
Series

HDSP-0860
Series

HDSP-0950
Series

1.0

msec

Max.

Unit

s.ov

Optical Characteristics at TA
Device

.'.

Description

Symbol

Luminous Intensity per LED
(Digit Average)13.41

Iv

Peak Wavelength
Dominant WavelengthlSJ

APEAK
Ad

Luminous Intensity per LED
(Digit Average)I3.41

Iv

Min.

Typ.

55

140

!-Lcd

635

nm

626

nm

620

!-Lcd

260

Peak Wavelength

APEAK

635

nm

Dominant Wavelength lSi

Ad

626

nm

Luminous Intensity per LED
(Digit Average)13.41

Iv

490

!-Lcd

Peak Wavelength

APEAK

583

nm

Dominant Wavelength I5,6]

Ad

585

nm

Luminous Intensity per LED
(Digit Average)f3.41

Iv

1100

""cd

Peak Wavelength

APEAK

568

nm

Ad

574

nm

Dominant Wayelen~thI5,61

215

298

Notes:
1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is RBJA =50°C/W/device.
The device package thermal resistance is RBJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC
board should not exceed 35° C/W/device for operation at TA = +70° C.
2. Voltage values are with respect to device ground, pin 6.
3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back of the
display package. Case temperature of the device immediately prior to the light measurement is equal to 25° C.

7-147
-------_._-_._------

Electrical Characteristics; TA = O°C to +70°C
Deseriptlon

Supply
Current

Power
Dissipation

Test Conditions

Symbol

HDSP-0760
HDSP-0770
HDSP-0860
HDSP-0960

Series
Series
Series
Series

Icc

HDSP-0760
HDSP-0770
HDSP-0860
HDSP-0960

Series
Series
Series
Series

Pr

Min.

Vee = 5.SV
(Numeral 5 and
DP Illuminated)

VIL

Logic, Enable and Blanking
High-level Input Voltage

VIH

Logic and Enable
Low-Level Input Current

III

Vee'" 5.5V

Blanking Low-Level Input Current

ISL

VJL

Logic, Enable and Blanking
High-Level Input Current

IIH

Vee = 5.5V
VIH = 2AV

Max.

78

lOS

120

175

390

573

690

963

mW

0,8
Vee'" 4.5V

Unit

mA

Vee =S,SV
(Numeral 5 and
DP Illuminated)

Logic, Enable and Blanking
Low-Level Input Voltage

Typ.l71

2.0

V

= OAV

Weight

V

-1.6

mA

-10

pA

+40

pA

1.0

Leak Rate

gm
5xl0-s

cc/sec

Notes:
4. The luminous intensity at a specific operating ambient temperature, Iv (TA) may be approximated from the following expotential equation:
Iv (TA = Iv (25° C) elk ITA - 25°CII.

Device
HDSP-0760
HDSP-0770
HDSP-0860
HDSP-0960

K

Series
Series
Series
Series

-0.0131/° C
-O.0112fOC
-M104/°C

5. The dominant wavelength, Ad, is derived from the CIE Chromaticity Diagram and is that single wavelength which defines the color of
the device.
6. The HDSP-0860 and HDSP-0960 series devices are categorized as to dominant wavelength with the category designated by a number
on the back side of the display package.
7. All typical values at Vcc = 5.0V and TA = 25°C.

operational Considerations
ELECTRICAL

MECHANICAL

These devices use a modified 4 x 7 dot matrix of light
emitting diode to display decimal/hexadecimal numeric
information. The high efficiency red and yellow LED's are
GaAsP epitaxial layer on a GaP transparent substrate. The
green LED's are GaP epitaxial layer on a GaP transparent
substrate. The LED's are driven by constant current
drivers, BCD information is accepted by the display
memory when the enable line is at logic low and the data is
latched when the enable is at logic high. Using the enable
pulse width and data setup and hold times listed in the
Recommended Operating Conditions allows data to be
clocked into an array of displays at a 6.7 MHz rate.

The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +70° C, it is important to
maintain a case-to-ambient thermal resistance of less
than 35° C watt/device as measured on top of display
pin 3.

The decimal point input is active low true and this data is
latched into the display memory in the same fashion as
the BCD data. The decimal point LED is driven by the onboard IC.
The blanking control input on the hexadecimal displays
blanks (turns off) the displayed information without
disturbing the contents of display memory. The display is
blanked at a minimum threshold level of 2.0 volts. When
blanked, the display standby power is nominally 250 mW
at TA = 25°C.

Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixutres formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv 01-15, Genesolv DE-15.

CONTRAST ENHANCEMENT
These display devices are designed to provide an
optimum ON/OFF contrast when placed behind an
appropriate contrast enhancement filter. The following
filters are suggested:
HIGH EFFICIENCY RED
Panelgraphic Ruby Red 60
Chequers Red 112
3M Light Control Film

7-148

-------------

Absolute Maximum Ratings

YELLOW
Panelgraphic Yellow 27
Chequers Amber 107
3M Light Control Film

Symbol
OiiliCHpI(Qn
Storage Temperature,
Ts
Ambient
Operating Temperature
TA
Ambient
Forward Current,
IF
Each LeO

GREEN
Panelgraphic Green 48
Chequers Green 107
3M Light Control Film

R~verseNoltage,

VR

Each LEO
For many applications a neutral density gray filter in either
plastic, circular polarizer or optically coated glass will provide the needed contrast enhancement. Suggested plastic
neutral density g ray filters are Panelgraphic Gray la,
Chequers Gray 105, or Polaroid HNCP37. The optically
coated glass/circular polarized HNCP10 filter by Polaroid
provides superior contrast enhancement for very bright
ambients.

1'7

°C

-55

+70

°C

10

mA

2[5

..:..

V

-----------,
PLUS
MINUS PLUS
,--'---,

,--'---,

d.p.

'7

'7

~

'7

~7

~~

'7

'7
'7

~

~7

~

-r#3

r----,-<
---1/4
#2
R,

R,

The over range devices display u±l" and decimal point.
The character height and package configuration are the
same as the numeric and hexadecimal devices. Character
selection is obtained via external switching transistors
and current limiting resistors.

(jillt

+100

Vee'" 5.0V

NUMERAL ONE

L_

Over Range Character

Max.

-65

l±:.:2.

r---------I
I
I
I
I
I

MI".

R1

~

-r-

--#8 ;r- -

-

R3

-=-

-=-

---'

"i"'

R3

-=-

Figure 3. Typical Driving Circuit

package Dimensions
I_I~~~)MAX'_I
IA"z,I,.2,,.'i,1
- (-l-----h
1.5
1..- ._.
(.OG)
7.4

4.8

(.29)

(.19)

I

•

•

t

••

D

Pin

~
+

2
3
4
5
6
7
8

13.5

Tr-'-I~+-r 4.8 1.53)
-1--'- 1.19)
19S't-I-.

.o75r:j
-

t

L

FunCtiOn
Plus
Numeral One
Numeral One
OP.
Open
O'plm

1

1

3.B
1.15)

'1' 'il't 'i

ReCOmmended
Operating Conditions
Device
Low Power
HOSP-0763 High
Brightness

Vee
Mi!1P::;?.f'lus

Character
1

-

a

1
Decimal Point
Blank

X
X
0

2.3
X
X

1
X
0

Resistor Value

Rt

R2

1300

200

8

360

47

68

8
8

360
360

36
30

56
43

R3
300

Luminous Intensity Per LED

Pin

1
+

= 5.0V

Forward
Current Per
LED,mA
2.3

~3
HO
'63

FRONT VIEW
Note:
1. Dimensions in millimetres and (inches).

Vee

4
X
X
X

(Digit Average)[3.41 at TA

8
1

Device

1

1

X
X

a

a

HDSP·0763
HDSP-G863
HDSP-0963

Notes:
0: Line switching transistor in Figure 7 cutoff.
1: Line switching transistor in Figure 7 saturated.
X: 'don't care'

7-149

= 25°C

Test Con'Oliions
IF - 2.3 mA
IF - 8 mA
IF- 8 rnA
IF ~ 8 mA

Min.
65

215
298

Typ.
140
820
490
1100

I
I
I
I
I
I

Units
!ked

Med
Med
!kcd

Electrical Characteristics; TA= O°C to +70°C
Device

Descripllon

HDSP'()763

Power Dissip,ation
(all LED's Illuminated)

Pr

Forward Voltage
per LED

VF

Power DIssipation
(all LED's Illuminated)

PT

Forward Voltage
per LED

VF

Power Dissipation
lall LED's Illuminated!

Pr

Forw
0

~UTY

cYCLE"" 5%·

w>

~ vy

100

.... 2

"W
01-

ii:!:

>~

1-::>
0

2

50
40
30
20

0.1

0.2 0.3

j

!Ew

1.0

>
;::

.8

::iw

.6

'",
~

'"

/

0.5

1.2

1.0

2

3

V
I

I

1

.4
.2

00

10

IAVG - AVERAGE CURRENT PER SEGMENT - rnA

_r-

V

w

/ lj /

"3 h ~
10

/

1.4

15
(j

'.
tQ%~"" ~ I
20%~

200

>'"
,,~
'!!I1-0;

1.6

1000

5

10

15

20

25

30

35

40

45

50

IpEAK - PEAK CURRENT PER SEGMENT - rnA

Figure 1. Typical Time Averaged Luminous Intensity per
Segment (Digit Average) vs. Current
per Segment.

Figure 2. Relative Luminous Efficiency vs. Peak Current
per Segment.

7-152

- - - - - - - - _ . - . _ - - - - - _... _ - _

5082-7404/7405/7414/7415

"

/; //

DUTY CYCLE"

-

1.0

~

.B

I

.6

a:

I
II

I

I,,,,,

..

"~

V;
~V:v

,/"

1.2

w

>
;::

yc"W

I--

1.4

~

//L

.04

.01

>
z
w
c:;

//1 20%

.06

.02

1.6

Y- ~

.OB

..

-

5%/
10%

.10

_--

5082-7404/7405/741417415
1.B

.15

..

c;

",.

.2

1

I

0.4
0.6 0.8 1.0
2.0
4.0
6.0
lavg. - AVERAGE CURRENT PER SEGMENT - mA

40

20

60

BO

100

IpEAK - PEAK CURRENT PER SEGMENT - rnA

Figure 4. Relative Luminous Efficiency vs. Peak Current per
Segment.

Figure 3. Typical Time Averaged Luminous Intensity per
Segment (Digit Average) vs. Average Current per
Segment.

5082-7400/7430 SERIES
BO

"E
I

5. 0

o;;

~

60

e-

e-

'z"

~

w

a:
a:

::>

"a:

::>
0

40

;;;

Q

~

";:a:
~

,......

~~

>
e-

sr.6RAGE AND
OPERATING I - -

I
I

~

~ 1. 0

I
I

~

~

20

I
I

~

;::

I
.2-

"

a:
O~-L--~~~~~--~--~~

.4

,8

1.2

1.6

2.0

2.4

V F - FORWARD VOLTAGE -

2.8

......,

RANGE

4

3.2

-60

v

-40

-20

20

40

60

TC - CASE TEMPERATURE - °C

'"

"'"

80

Figure 6. Relative Luminous Intensity vs. Case
Temperature at Fixed Current Level.

Figure 5. Forward Current vs. Forward Voltage.

Electrical/Optical
The 5082-740017430 series devices utilize a monolithic
GaAsP chip of 8 common cathode segments for each
display digit. The segment anodes of each digit are
interconnected, forming an 8 by N line array, where N is
the number of characters in the display. Each chip is
positioned under an integrally molded lens giving a
magnified character height of 2.79mm (0.11) inches.
Satisfactory viewing will be realized within an angle of
±30° for the 7404/7405/741417415 and ±20° for the
7432/7433, measured from the center line of the digit.
The decimal point in the 7432, 7433, 7414, and 7415
displays is-located at the lower right of the digit for
conventional driving schemes.
The 5082-7404 and 7405 displays contain a centrally
located decimal point which is activated in place of adigit.
In long registers, this technique of setting off the decimal
point significantly improves the display's readability. With
respect to timing, the decimal pOint is treated as a separate
character with its own unique time frame.
To improve display contrast, the plastic incorporates a red
dye that absorbs strongly at all visible wavelengths except
the 655 nm emitted by the LED. An additional filter, such
as Plexiglass 2423, Panelgraphic 60 or 63, and SGL
Homalite 100-1605, will further lower the ambient reflectance and improve display contrast.

Mechanical
The 5082-7400/7430 series package is a standard 12 or 14
Pin DIP consisting of a plastic encapsulated lead frame with
integral molded lenses. It is designed for plugging into
DIP sockets or soldering into PC boards. The lead frame
construction allows use of standard DIP insertion tools
and techniques. Alignment problems are simplified due to
the clustering of digits in a single package. The shoulders
of the lead frame pins are intentionally raised above the
bottom of the package to allow tilt mounting of up to 20°
from the PC board.
To optimize device optical performance, specially
developed plastics are used which restrict the solvents
that may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolv 01-15 or
DE-15, Arklone A or K. A 60°C (140°C) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 orT-P35, Ethanol,
Isopropanol or water with a mild detergent.

7-153

._ . .-._ ..

_-

package Description 5082-7404, -7405, -7414, -7415
Notes: 6. Dimensions in millimeters and (inches).
7. Tolerances on all dimension are ±.38 mm (±.015 in.) unless otherwise noted.

6.35 ± 0.25
(.250 ± .010)

~ ~m;m;,;;n;;";;;;i-I
7.62± 0.25

1.(·30D± .010)

LED

.1

S/~rHii
2.54
(.'001
REF.

5"
Il
REF.-I

Figure 7. 5082-740417414

Figure 8. 5082-740517415.

0.25 II
(.0101-1 \+-

Figure 9. 5082-7404174051
741417415

Magnified Character Font Description

r:\!"'j---T

OO"''''~ '" .,,"""'..... ""'"'"
DEVICES

5082-7404

5082-7<"

I

DEVICES

J~. J "T.
f

9

J

5082-7414

2.79 (."1

5082-7415

d

Figure 10. Center Decimal Point Configuration

Figure 11. Right Decimal Point
Configuration

Device Pin Description
5082-7404/7414

5082-740517415

PIN NO.

FUNCTION

FUNCTION

1
.2

CATHODE 1

CATHODE 1

ANODE e

ANODEe

3

ANODE c

ANODEc

4

CATHODE 3

CATHODE 3

5

ANODE dp

ANODEdp

6
7
8

CATHODE 4

ANODEd

ANODEg

CATHODES

ANODEd

ANODEg

9

ANODE f

CATHODE 4

10

CATHODE 2

ANODEf

11

ANODE b

SEE NOTE8

12

ANODE a

ANODE b

13

-

CATHODE 2

14

~' 5~kr21- ~

DIMENSIONS IN MILLIMETERS AND (INCHES).

-

ANODE a

Note 8: Leave Pin Unconnected.

7-154

-uti
I

f

279 (."1

9

d

.79 (.03'1
REF.

~P.

.53 (.02'1
REF.

------------~---------~~~---~--

package Description 5082-7432, -7433
NOTES, 9. DIMENSI9NSJN MilLIMETERS AND HNC~ESI.
10. TOlERANCES ON All DIMENSIONS ARE 0.03' ,1.015)
UNLESS OTHERWISE SPECIFIED.

IT
~::;:::;~~~::;:::;h+ (.0701
1.78
SEATING~

Figure 11.

Magnified Character Font Description
DEVICES

5082·7432
5082·7433

DIMENSIONS IN MILLIMETERS AND (INCHES).

Figure 12.

Device Pin Description
PIN

5082·7432

5082·7433

NUMBER

FUNCTION

FUNCTION

1

SEE NOTE 11.

CATHODE 1

2

ANODEe

ANODEe

3

ANODEd

ANODEd

4

CATHODE 2

CATHODE 2

5

ANODEc

ANODEc

6

ANODE dp

ANODEdp

7

CATHODE 3

CATHODE 3

8

ANODE b

ANODEb

9

ANODEg

ANODEg

10

ANODE a

ANODE a

11

ANO"oE f

ANODEf

12

SEE NOTE 11.

SEE NOTE 11.

NOTE 11. Leave Pin unconnected.

7-155
--.---~~----

FliOW

HEWLETT

~e.. PACKARD

PRINTED CIRCUIT BOARD MOUNTED
SEVEN SEGMENT
NUMERIC INDICATORS
5082-720017440 SERIES
TECHNICAL DATA

JANUARY 1986

Features
• MOS COMPATIBLE
• AVAILABLE IN 9 TO 16 DIGIT
CONFIGURATIONS
• CHARACTER HEIGHTS OF .105", .115"
AND .175"
• LOW POWER
• CATEGORIZED FOR LUMINOUS INTENSITY

Description
The HP-5082-720017440 series of displays are seven
segment GaAsP Numeric Indicators mounted on printed
circuit boards. A plastic lens magnifies the digits and
includes an integral protective bezel. Character heights of
.105" (2.67 mm), .115" (2.92 mm) and .175" (4.45 mm) are
available. For large quantity applications, digit string
lengths of 8, 12 and 14 digits are available by special order.
Applications are hand held calculators and portable
equipment requiring compact, low power, long lite time,
active displays.

Device Selection Guide
Part
Number

Digits Per
PC Board

Decimal Point

Package

Character
Height
(mm) in.

Inter-Digit
Spacing
(mm) in.

5082-7441

9

Right Hand

Fig. 9

(2.67) .105"

(5.08) .200"

5082-7446

16

Right Hand

Fig. 11

(2.92) .115"

(3.81) .150"

5082-7285

5

Right Hand

Fig. 14

(4.45) .175"

(5.84) .230"

5082-7295

15

RighI Hand

Fig. 13

(4.45) .175"

(5.84) .230"

7-156

------

------------~~-~~----

-~-~~

--~--~---------

Maximum Ratings 5082-7441/7446
Symbol

Parameter
Peak Forward Current per Segment or dp (Duration

< 500fls)

Min.

IpEAK

Average Current per Segment or dp[1]

IAVG

Power Dissipation per Digit [2]

PD

Max.

Units

50

mA

3

mA

50

mW

Operating Temperature, Ambient

TA

-20

+85

°c

Storage T emperatu re

Ts

-20

+85

°c

Reverse Voltage

VR

Solder Temperature at connector edge (t";;3 sec.)[3J
NOTES:

3

V

230

°c

1. Derate linearly at O.lmAtC above 60°C ambient.
2. Derate linearly at 1.7mWtC above 60°C ambient.
3. See Mechanical section for recommended soldering techniques and flux removal solvents.

Maximum Ratings 5082-7285/7295
Symbol

Parameter

Min.

Max.

Units

200

rnA

Peak Forward Current per Segment or DP
(Duration <351'5)

IpEAK

Average Current per Segment or DP i4,

IAVG

7

rnA

PD

125

mW

Power Dissipation per Digit

'5,

Operating Temperature. Ambient

TA

-20

+70

°C

Storage Temperature

Ts

-20

+80

°C

Reverse Voltage

VR

Solder Temperature at connector edge
(1:;;:;3sec.),6,

3

V

230

°C

NOTES: 4. Derate linearly 'at 0.12mA/oC above 25°C ambient.
5. Derate linearly at 2.3mWI"C above 25°C ambient.
6. See Mechanical section for recommended soldering techniques and flux removal solvents.

Electrical/Optical Characteristics at T A
Parameter

Symbol

Luminous Intensity/Segment or dp!7]
5082·7441

Iv
5082-7446
Peak Wavelength

Apeak

Forward Voltage/Segment or dp

VF

25°C 5082-7441/7446

Test Condition

Min.

Typ.

IAVG = 500flA
(lPK = 5mA
duty cycle = 10%)

9

40

flcd

5mA Peak
1/16 Duty Cycle

7

35

fled

655

nm

1.55

V

IF

= 5mA

Max.

Units

NOTES:
7. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower
peak currents may cause intensity mismatch within the display. Operation at peak currents less than 3.5 mA may cause objectionable display segment matching.

7-157

50

",
E

1000

"[

45

I
I2
0WW

40

to"
"to
a;w
w'"

I-

1fia; 35
a;
:>

30

0
a;

25

";;:

20

u

a;

~

'"

ulo:::~

e:~

10

0
2

;;:

:3

1/

o

o

.2

.6

.4

.8

......

<;;

ffi
~

0.5

1.0

2

10

3

1-6

L4

>

I-

.........; ~

'"o

:>

>
u

~

2

;;:

c::

0.2 0.3

'r

Figure 2. Typical Time Averaged Luminous Intensity per
Segment vs. Average Current per Segment.

10

~

v. ij /
lLj ~ /
10

'fJ'

1/

IAVG - AVERAGE CURRENT PEA SEGMENT - rnA

Figure 1. Peak Forward Current vs. Peak Forward Voltage.

w

~

50
40
30
20

0.1

1:0 1.2 1.4 1.6 1.8 2.0

VF - tJEAK FORWARD VOLTAGE - V

>

100

1-<;;
.... 2
"W

~

~~~~~

,,~

w>
;§I-

.!:

::

r DUTY CVCLE· 5%",

200

>a;

15

~

500
400
300

1fi
u

!'..

§
~

0.5
0.4

W

>

~ :--...
......

~,
~"

0.2

;;

1

°:..so

-40

-20

20

40

60

,8
,6

l-

I

1,0

a;

0.3

V

12

j
I

A

,2

80
5

10

15

20

25

30

35

40

45

50

TA - AMBIENT TEMPERATURE - °C
IPEAK - PEAK CURRENT PER SEGMENT - rnA

Figure 4. Relative Luminous Efficiency vs. Peak Current per
Segment.

Figure 3. Relative Luminous Intensity vs. Ambient
Temperature at Fixed Current Level.

Electrical/Optical Characteristics at TA=25°C 5082-7285/7295
SymbDI

Test Condition

Min.

Typ.

Luminous Intensity/Segment or dp
(Time Averaged) 15 digit display
5082-72951 8 .101

Parameter

I,

I"g, = 2 mA
(30 mA Peak
1/15 duty cycle)

30

90

,"cd

Luminous Intensity/Segment or dp
(Time Averaged) 5 digit display
5082-728518.101

Iv

Ioyg, = 2 mA
(10 mA Peak
1/5 duty cycle)

30

70

,"cd

Forward Voltage per Segment or dp
5082-7295 15 digit display

VF

IF=30mA

1,60

2.3

V

Forward Voltage per Segment or dp
5082-72855 digit display

Vr

Ip=10mA

1.55

2.0

V

Peak Wavelength

Max.

Units

APEAK

655

nm

Dominant Wavelength l91

Ad

640

nm

Reverse Current per Segment or dp

IR

Temperature Coefficient of Forward
Voltage

b.VFJoC

VR=5V

10

,"A

-2.0

mVt'C

NOTES:
8, The luminous intensity at a specific ambient temperature, Iv (TAl, may be calculated from this relationship:
Iv(TAI = IV(250CI C9S51 (TA - 25°Cl.
9, The dominant wavelength, Ad, is derived from the C.I.E. Chromaticity Diagram and represents the single wavelength which
defines the color of the device.
10.Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower
peak currents may cause intensity mismatch within the display. Operation at peak currents less than 6.0 mA may cause objectionable display segment matching.

7-158

200

~,

~
0:

180
160
140

0:
::J

120

~

100

u

~

0:

80

1,,"\

i2
"

~

60
0
0

.J

0
.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

2.6

IAVG - AVERAGE CURRENT PER SEGMENT - rnA

VF - PEAK FORWARD VOLTAGE - V

Figure 5. Peak Forward Current vs. Peak Forward Voltage.

Figure 6. Typical Time Averaged Luminous Intensity per
Segment vs. Average Current per Segment.

2.0

10

I .•

,.>-

in

1Jj
>;;


~

~~

w

1.2

,

0:

'"

;5
~

-40

-20

20

40

60

.6 0

80

20

40

60

80 100 120 140 160 180 200

IpEAK - PEAK CURRENT PER SEGMENT - rnA

TA - AMBIENT TEMPERATURE - cC

Figure 7. Relative Luminous Intensity vs. Ambient Temperature
at Fixed Current Level.

Mechanical
These devices are constructed on a standard printed
circuit board substrate. A separately molded plastic lens is
attached to the PC board over the digits. The lens is an
acrylic styrene material that gives good optical lens
performance, but is subject to sc~atching so care should
be exercised in handling.
The device may be mounted either by use of pins which
may be hand soldered into the plated through holes at the
connector edge of the PC board or by insertion into a
standard PC board connector. The devices may be
hand soldered for up to 3 seconds per tab at a maximum
soldering temperature of 230°C. Heat should be applied
only to the edge connector tab areas of the PC board.
Heating other areas of the board to temperatures in excess
of 85°C can result in permanent damage to the display. It
is recommended that a non-activated rosin core wire solder
or a low temperature deactivating flux and solid wire solder
be used in soldering operations.
The PC board is silver plated. To prevent the formation of a
tarnish (Ag2S) which could impair solderability the

7-159

Figure 8. Relative Luminous Efliciency vs. Peak Current per
Segment.

displays should be stored in the unopened shipping
packages until they are used. Further information on the
storage, handling, and cleaning of silver plated components is contained in Hewlett-Packard Application Bulletin No.3.

Electrical/Optical
The HP 5082-7441, -7446, -7285 and 7295 devices utilize a
monolithic GaAsP chip containing 7 segments and a
decimal pOint for eaClYdlsplay digit. The segments of each
digit are interconnected, forming an 8 by N line array, where
N is the number of digits in tbe display. Each chip is
positioned under a separate element of aplastic magnifying
lens. producing a magnified character. Satisfactory viewing
will be realized within an angle of approximately ±20° from
the centerline of the digit. A filter, such as plexiglass 2423,
Panelgraphic 60 or 63, and Homalite 100-1600, will lower
the ambient reflectance and improve display contrast. Digit
encoding of these devices is performed by standard 7
segment decoder driver circuits.

package Dimensions

r

, i , F - - - - - - - - - - 5 0 . 8 0 12.000)--------

'~ I

1.021.38

'~n±2
I
--(1.940±.010)-'---~

---- (.030)

1.040± .015) -,

_

~

,_

L..-.. 5.08(.200)

-1--,
~~==~,=:~=:=:=:=:=:=:===:==~==~I-====T~V=P'=========t---1 --)-

7.11±.38

121~~~15)___

_ __

DIGIT =1

18.9± .38
1.720± .015)

T---L

1

5.08

~I

2

3

1----

4

5

6

7

8

9 10 11 12 13 14 15 16 17 \

4.70± .13
1.185± .005)

1.02± .13
1.040 ± .005)
DIA. TYP.

2.54 (.100) NON-CUMULATIVE

(.200)-

I

1 ~

-L-4---~~~~~~~~}~~

1.91±.38
(,075 ± .015)

r

I ?~~00f.g185)

NOTES: 1. Dimensions in millimeters and (inches).
~:.-,=o~ and part nl!f!J~er are on back ofpa:cka{!~.
3. Secondary 1.25X magnifier that slides into
primary lens and increases character height
to 3,33 (.131) available as special product.
4. Tolerances: ±.88 (.015)

Figure 9. 5082-7441

Magnified Character Font Description

5082-7441

Note:

All dimensions in millimeters
and (inches),

Figure 10.

Device Pin Description
Pin

5082·7441

No.

Function

1

Pin
No.

5082·7441
Function

10

5
6

Dig. 1 Cathode
Seg.c Anode
Dig. 2 Cathode
d.p. Anode
Dig. 3 Cathode
Seg. a Anode

7

Dig. 4 Cathode

16

Dig. 8 Cathode
Seg. f Anode

8

Seq. e Anode

17

Dig. 9 Cathode

9

Dig. 5 Cathode

2

3
4

11

12
13
14
15

7-160

Seg. d Anode
Dig. 6 Cathode
Seg. gAnode
Dig. 7 Cathode
Seg. b Anode

---

~-~----------

package Dimensions
1 - - - - - - - - - - - 12.750
69.85
'---_ _ _ _ _ _ _ _ _ _ 68.07

_015)---------0.38
0.25 _ _ _ _ _ _ _ _ _ _ __

c-

.010)

12.680

lII

~:::::::j:~:::::=~

-r
18,29 ± 0.38
(.720, .015)

t

11.18

1.4401

1

tl---j@v"
Q ~
~ 3' ,,1>-\!lJv01

@

ffi

~
~G"
ffi~1ID

I'

6N134

Dual Channel
Hermetically Sealed
Optically Coupled
Logic Gate

Line Receiver.
Ground Isolation for
High Reliability
Systems

8102801EC

DESC Approved
6N134

Military/High
Reliability

6N134TXV

TXV - Screened

6N134TXVB

TXVB - Screened
with Group B
Data

Use 8102801EC
in New Designs

HCPL-1930

Dual Channel
Hermetically sealed
High CMR Line
Receiver Optocoupler

Line receiver. High
Speed Logic Ground
Isolation in High
Ground or Induced
Noise Environments

HCPL-1931

Withstand
Test
Voltage

Page
No.

10M bills

400% Typ.

10 mA

1500 V dc

8-66

r--8-69

t--8-66

10mA

1500 Vdc

8-73

MIL-STD-883
Class B Part

Military/High
Reliability

EJ;J"

HCPL-5700

Single Channel
Hermetically Sealed
High Gain Optocoupler

200% Min.

0.5 mA

500 V dc

8-79

HCPL-5701

~
..
f"

HCPL-5730

MIL-STD-883
Class B Part
Dual Channel
Hermetically Sealed
High Gain Optocoupler
MIL-STD-883
Class B Part

Line Receiver. Low
60k bills
Current Ground
Isolation. TTL/TTL.
LSTTLITTL. CMOSITTL
Military/High
Reliability
Line Receiver. Polarity
Sensing. Low Current
Ground Isolation
Military /High
Reliability

Hermetically Sealed
Package Containing
4 Low Input Current.
High Gain Optocouplers
DESC Approved
8302401EC
6N140A
6N140A/883B MIL-STD-883
(6NI40/883B) Class B Part
TXV - Hi-Rei
6N140TXV
Screened
TXVB - Hi-Rei
6N140TXVB
Screened with
Group B Data

Line Receiver. Low
Power Ground
Isolation for High
Reliability Systems
Military IHig h
Reliability
Use 8302401 EC
in New Designs

lOOk bit/s

300% Min.

4N55

Dual Channel
Hermetically Sealed
Analog Optical
Coupler

Line Receiver.
Analog Signal
Ground Isolation.
Switching Power
Supply Feedback
Element

700k bills

4N55/883B

MIL -STD-883
Class B Part

Military IHigh
Reliability

4N55TXV

TXV - Hi-Rei
Screened

Use
4N55/883B in

4N55TXVB

TXVB - Hi-Rei
Screened with
Group B Data

New Designs

I

4

\,

:

6

~~

.
,

15

14V.

"

5

13 VOUI

12V.
11 Vou•

GOlD

~

.
10

7 NC

6 Vo

4

Specified
Input
Current

400% Typ.

Vee

J

J

Current
Transfer
Ratio

10M bills

~

2

Application

Typical
Data Rate
(NRZJ

2
3

5GNO

,

7 Vo,

6

4

v"'

5 GND

[j~~

II ,,'

~vcc

~~~:::;

rn~i3'''I>-~
1>-11
~~'l ~GND
ffi_~

~o~~~
~,

1lJ

~

~

HCPL-5731

6N140A
(6NI40)

~iitlll~

ffi

~~;

'---

~

8-13

t--8-83

0.5 mA

1500 V dc

8-87

-

8-91

s:B7

9% Min.

16mA

1500 V dc

8-96

Hermetic Optocoupler Product Qualification
MIL-STD-883 Class B Test Program
testing is required. The 4N55/883B, 5701/883B, 5731/883B,
8102801 EC and 8302401 EC (DESC Selected Item Drawings
for the 6N134 and 6N140A respectively) have standardized
test programs suitable for product use in military, high reliability applications and are the preferred devices by military
contractors.

The following 100% Screening and Quality Conformance
I nspection programs show in detail the capabilities of our
4N55, 6N134, 6N140A, HCPL-5701, and 5731 optocouplers.
This program will help customers understand the tests
included in Methods 5004 and 5005 of MIL-STD-883 and to
help in the design of special product drawings where this

100% Screening
MIL-STD-883, METHOD 5004 (CLASS B DEVICES)
Test Screen

Method

Conditions

1. Precap Internal Visual

2010

Condition B, DESC Parts

2. High Temperature Storage

1008

Condition C, TA = 150°C, Time

3. Temperature Cycling

1010

Condition C, '-135° C to +150° C, 10 cycles

4. Constant Acceleration

2001

Condition A, 5K Gs, Yl axis only, 16 pin DIP,
Condition E, 30K Gs, Yl axis only, 8 pin DIP

5. Fine Leak

1014

Condition A

6. Gross Leak

1014

Condition C

-

7. Interim Electrical Test
8. Burn-In

1015

-

9. Final Electrical Test
Electrical Test
Electrical Test
Electrical Test
10. External Visual

= 24 Hours minimum

Group A, Subgroup 1, except 11/0 (optional)
Condition B, Time = 160 Hours minimum, TA = 125°C
Burn-in conditions are product dependent and are
given in the individual data sheets.
Group
Group
Group
Group

A,
A,
A,
A,

Subgroup 1,5% PDA applies
Subgroup 2
Subgroup 3
Subgroup 9

2009

Quality Conformance Inspection
Group A electrical tests are product dependent and are
given in the individual device data sheets. Group A and B
testing is performed on each inspection lot.

GROUP A TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
LTPD
Subgroup 1
Static tests at T A = 25° C
Subgroup 2

2

Static tests at TA = +125°C

3

Subgroup 3
Static tests at T A = -55° C

5

Subgroups 4, 5, 6, 7 and 8
These subgroups are non-applicable to this device type
Subgroup 9
Switching tests at TA

= 25°C

2

= +125°C

3

= -55° C

5

Subgroup 10
SWitching tests at TA
Subgroup 11
SWitching tests at TA

8-14

.-----

-_.

-------~

_..... _-_._._.-

GROUP B TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test

Method

Subgroup 1
Physical Dimensions
(Not required if Group D is
to be performed)
Subgroup 2
Resistance to Solvents
Subgroup 3
Solderability
(L TPD applies to number of leads
inspected ~ no fewer than 3
devices shall be used.)
Subgroup 4
I nternal Visual and Mechanical
Subgroup 5
Bond Strength
(1) Thermocompression
(performed at precap, prior to seal.
LTPD applies to number of bond pulls
from a minimum of 4 devices).
Subgroup 6
Internal water vapor content
(Not applicable ~ per footnote
of MIL-STD)

LTPD

Conditions

2016

2 Devices/
o Failures

2015

4 Devices/
o Failures
Soldering Temperature of 245 ± 5°C
for 10 seconds

2003

1 Device/

2014

o Failures

2011

(1) Test Condition D

15
(4 Devices)

~

Subgroup 7
Fine Leak
Gross Leak

1014

Subgroup S'
Electrical Test
Electrostatic Discharge
Sensitivity
Electrical Test

3015

15
(3 Devices)

~

Test Condition A
Test Condition C
Group A, Subgroup 1, except

5

11-0

15

Group A, Subgroup 1

'(To be performed at initial qualification only)
Group C testing is performed on a periodic basis from current manufacturing every 3 months.

GROUP C TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test
Subgroup 1
Steady State Life Test

Method

Conditions
Condition B, Time = 1000 Hours Total
TA = +125°C
Burn-in conditions are product
dependent and are given in tile
individual device data sheeets.

1005

Endpoint Electricals
at 168 hours and 504 hours

Group A, Subgroup 1, except iI-o

Endpoint Electricals
at 1000 hours

Group A, Subgroup 1

Subgroup 2
Temperature Cycling
Constant Acceleration
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals

1010
2001
1014
1014
1010

8-15

Condition C, -65 0 C to +150° C,
10 cycles
Condition A, 5KG's, y, axis only
Condition A
Condition C
Per visual criteria of Method 1010
Group A, Subgroup 1

LTPD
5

1-5

Group D testing is performed on a periodic basis from currentmanufacturing every 6 months.

GROUP D TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test

Method

Conditions

LTPD

Subgroup 1
Physical Dimensions

2016

Subgroup 2
Lead Integrity

2004

Test Condition B2 (lead fatigue)

15

Subgroup 3
Thermal Shock

1011

Condition B, (-55°C to +125°C)
15 cycles min.
Condition C, (-55°C to +150°C)
100 cycles min.

15

Temperature Cycling

1010

Moisture Resistance
Fine Leak
Gross Leak
Visual Examination

1004
1014
1014

Endpoint Electricals
Subgroup 4
Mechanical Shock

2002

15

Condition A
Condition C
Per visual criteria of Method 1004
and 1010
Group A, Subgroup 1
Condition B, 1500G, t = 0.5 ms,
5 blows in each orientation
Condition A min.
Condition A, 5KGs, Yl axis only,
16 pin DIP,
Condition E, 30 KGs, Y1 axis only,
8 pin DIP

15

Vibration Variable Frequency
Constant Acceleration

2007
2001

Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals

1014
1014
1010

Condition A
Condition C
Per visual criteria of Method 1010
Group A, Subgroup 1

Subgroup 5
Salt Atmosphere
Fine Leak
Gross Leak
Visual Examination

1009
1014
1014
1009

Condition A min.
Condition A
Condition C
Per visual criteria of Method 1009

Suogroup 6
I nternal Water Vapor Content

1018

5,000 ppm maximum water content at
100°C

Subgroup 7
Adhesion of lead finish

2025

15

2024

5 Devices
(0 failures)

Subgroup 8
Lid Torque
(Applicable to 8 pin DIP only)

8-16

15

3 Devices
(0 failures)
5 Devices
(1 failure)

Plastic Optocouplers
Hewlett-Packard supplies plastic optocouplers with high
reliability testing for commercial/industrial applications
requiring prolonged operational life. Two of the most
frequently requested 100% preconditioning and screening
programs are given. The first program has burn-in and
electrical test only, the second program adds temperature
storage and temperature cycling. Either program is available for HP's plastic optocouplers. Electrical testing is to
catalog conditions and limits and will include 100% DC
parameters, sample testing of input-output insulation
leakage current and appropriate AC parameters. Contact
your local field representative for pricing and availability of
these programs.

PLASTIC OPTOCOUPLERS
PRECONDITIONING AND SCREENING 100%
COMMERCIAL BURN-IN-Examinations or Tests

MIL-STD-883
Methods

1. Commercial Burn-in

1015

2. Electrical Test

Conditions

TA

= 70°C,

160 hours per designated circuit.

Per specified conditions and min.lmax.
limits at TA = 25°C

SCREENING PROGRAM-Examinations or Tests

1. High Temperature Storage

MIL-STD-883
Methods

1008

Conditions

24 hours at 125° C

2. Temperature Cycling

1010

10 cycles, -55°C to +125°C

3. Burn-in

1015

TA = 70°C, 160 hours per designated circuit

4. Electrical Test
5. External Visual

Per specified conditions and min.lmax.
limits at TA = 25° C
2009

"Contact your field salesman for details.

8-17

Fli'PW

JAN QUALIFIED
HERMETIC
SOLID STATE
LAMPS*

HEWLETT

a!~ PACKARD

1N6093
1N5765
JAN1N5765
JAN1N609~
JANTX1N5765 JANTX1N6093
1N6094
1N6092
JAN1N6092
JAN1N6094
JANTX1N6092 JANTX1 N6094
TECHNICAL DATA

JANUARY 1986

Features
• MILITARY QUALIFICATION
• CHOICE OF 4 COLORS
Red
High Efficiency Red
Yellow
Green
• DESIGNED FOR HIGH-RELIABILITY
APPLICATIONS

HERMETIC T0-46 LAMP

• HERMETICALLY SEALED
• WIDE VIEWING ANGLE
• LOW POWER OPERATION
• IC COMPATIBLE
• LONG LIFE
• PANEL MOUNT OPTION HAS WIRE
WRAPPABLE LEAOS AND AN
ELECTRICALLY ISOLATED CASE

Description
The 1N5765, 1N6092, 1N6093, and 1N6094 are hermetically sealed solid state lamps encapsulated in a TO-46
package with a tinted diffused plastic lens over a glass
window. These hermetic lamps provide good on-off
contrast, high axial luminous intensity and a wide viewing
angle.
All of these devices are available in a panel mountable
fixture, The semiconductor chips are packaged in a
hermetically sealed TO-46 package with a tinted diffused
plastic lens over glass window. This TO-46 package is
then encapsulated in a panel mountable fixture designed
for high reliability applications. The encapsulated LED
lamp assembly provides a high on-off contrast, a high
axial luminous intensity and a wide viewing angle.
The 1N5765 utilizes a GaAsP LED chip with a red diffused
COLOR - PART NUMBER
OescripUon

I

Standard Red
High Efficiency Red

YeJiow
Green

1

Sland.rd
Product

I

LAMP ASSEMBLY AS PANEL MOUNT

plastic lens over glass window.
The 1 N6092 has a high efficiency red GaAsP on GaP LED
chip with a red diffused plastic lens over glass window.
This lamp's efficiency is comparable to that of a GaP red
but extends to higher current levels.
The 1N6093 provides a yellow GaAsP on GaP LED chip
with a yellow diffused plastic lens over glass window.
The 1N6094 provides a green GaP LED chip with a green
diffused plastic lens over glass window.
Part marking includes: part number from matrix below.
GAQI designating code and YYWWX lot identification code
including year, week and assembly plant if required. A maximum of 18 spaces
can be accommodated.
..

I

LAMP AND PANEL MOUNT MATRIX
JAN Plus TX Tesllng(2)

With JAN Qualillcatlon!1]

TABLE I HERMETIC T0-46 PART NUMBER SYSTEM
JANTXl N5765
lN5765
JAN 1N576S
JANTX1N&092
lN6092
JAN 1NS092
JANTXl N6093
lN6093
JAN1N6093
JANTXl N6094
lN6094
JAN1N6094
TABLE II PANEL MOUNTABLE PART NUMBER SYSTEM(3j

I

I

:1

I

I

1;\

Controlling Mll-S·19S00
Document[4]

1467
1519
f520
/521

NONE
Siandar,21

nm

Mlla$uremenl

nm

121

al Peak

3.0

pF

Reverse CUrrentlSI

aV.

Revers& Breakdown

1.0

4

5

5.0

1.0

1,Q

1.0

131

·elW

131

V

IF =20mA
Figures 2, 7,
12,17

~A

V

5,Q

5.0

V,-O; '~1 MHz

'OIW

At Ip=25mA
fA

=

IF 20 mA
8 = 30"

ns

100

425
550

3.0

mcd

mCd

70

70

Te.1 Condlll"".
IF -20mA
Fig •. 3,8,13.18

= 25mA

0.4

0.5

70

J

Unll.

VR=3V
fa ~ ,00j.lA

Voltage
~\

Luminous Efficacy

51)

140

455

600

ImlW

141

NOTES:
1. alp is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, .\:i, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
3. Junction to Cathode Lead with 3.18mm (0.125 inch) of leads exposed between base of flange and heat sink.
4. Radiant intensity. Ic. in watts/steradian, may be found from the equation Ie = 1~/J7v, where I~ is the luminous intensity in candelas and Tfv is the luminous
efficacy in lumens/watt.
5. Limits do not apply to non JAN parts.
·Panel mount.
"TO-46
1.0r--------------.~~~--?_~----~------~~--_r.~------------_r--------------,

WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength.

8-20

Package Dimensions

lN5765,lN6092,lN6093,lN6094

HLMP-0904, 0354, 0454,0554

TINTED PLASTIC

/

OVER GLASS LENS

6.$j
4.571.100)

24.61.970)

2'6.2ff03oi

I

0.89 (&3s)
1.14 [Qij5j

t
l

i

5.08 J,gQQJ
5.59 (.220)
1. ALl. EXTERNAL METAL SUFI FACES OF THE PACKA~

I

V

0
1.0

~A ~ 25"b

1.4

gS
~~
~~

0

1. 6

2.00

~

vs. Forward Current.

Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

PULSE DURATION - JlS

Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (lDC MAX
as per MAX Ratings)

Figure 11. Relative Luminous Intensity vs. Angular Displacement.

Family of Yellow 1N6093/HLMP-0454
16

2.25

~

50~-4~-+-+~~-r-r~-r~

~
~

~

2.00

~~

1.75

~~

~

u

~~

c

---+-- Vy
7fC'
'-

r--'

~ @ 1.25

~

~

30

~
~

20~-+-+--+-J-~~-r-~"+-4-~

I

~~
~~
~~

0.75

...

0.25

1.00

0.50

0.00
VF - PEAK FORWARD VOLTAGE - V

Figure 12. Forward Cur'rent vs.

Forward Voltage.

tp - PULSE DURATION -

V

I

/

V
5

I
I

f--'/

1.50

10

I

15

!

i
20

25

30

Figure 13. Relative Luminous Intensity
vs. Forward Current.

10

,/'

V

20

30

50

60

Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

Figure 16.. Relative Luminous Intensity vs. Angular Displacement.

8-22

40

IpEAK - PEAK CURRENT - rnA

J,l.S

Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (lDC MAX
as per MAX Ratings)

....

//

:rrl
)(
6

35

IF - FORWARD CURRENT - rnA

HA~ '25·b

Family of Green 1N6094/HLMP-0554
2.00

0

~

0

"z
a"
a
<

"

~<

4

0

I

30

0

<
I

~11.50
~:G

",I-

~~

I
I

~<

w'
>"

~~

I

...

2.5

3.4

VF - PEAK FORWARD VOLTAGE - V

Figure 17. Forward Current vs.

Forward Voltage.

,

0.75
0.50
0.2 5

0.00
1.5

./

1.25

~<

OC

zw 1.00

V

,

0

I--i-

V

I

0

II
,II

1.75

I

V

VY
5

10

V

f./
...

."

1

;,
15

20

25

30

35

IF - FORWARD CURRENT - rnA

Figure 18. Relative Luminous Intensity

vs. Forward Current.

.G o
L _.....l
/, 0-.....l20,--,l30,--4Q.,L-':5J.
0 -.,!GO.
IpEAK - PEAK CURRENT - rnA

Figure 19. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.

1.5
1.4
1.3

l
,

1.2
X

~~

~.9

1.1
1.0

1
tp - PULSE DURATION -IlS

Figure 20. Maximum Tolerable Peak Cur·
rent vs. Pulse Duration. (loc MAX
as per MAX Ratings)

Figure 21. Relative Luminous Intensity vs. Angular Displacement.

8-23

ULTRA-BRIGHT HERMETIC
SOLID STATE LAMPS*

r/£~ HEWLETT

~~

PACKARD

HLMp·0363
HlMP-0391
HLMP-0392

HlMP-0463
HlMP-0491
HLMP-0492
TECHNICAL DATA

HLMP-OS63
HLMP-0591
HLMp·0592
JANUARY 1986

Features
• SUNLIGHT VIEWABLE WITH PROPER
CONTRAST ENHANCEMENT FILTER
• HERMETICALLY SEALED
• CHOICE OF 3 COLORS
High Efficiency Red
Yellow
High Performance Green
• LOW POWER OPERATION
• IC COMPATIBLE
• LONG LIFE/RELIABLE/RUGGED
• PANEL MOUNT OPTION with
Wire Wrappable leads
Electrically isolated case

Description
;rhe HLMP-0363, HLMP-0463, and HLMP-0563 are hermetically sealed solid state lamps in a TO-1S package with a
clear glass lens. These hermetic lamps provide improved
brightness over conventional hermetic LED lamps, good
on-off contrast, and high axial luminous intensity. These
LED indicators are designed for use in applications
requiring readability in bright sunlight. With a proper
contrast enhancement filter, these LED indicators are
readable in sunlight ambients. All of these devices are
available in a panel mountable fixture.

The HLMP-0363 utilizes a high efficiency red GaAsP on
GaP LED chip. The HLMP-0463 uses a yellow GaAsP on
a GaP LED chip. The HLMP-0563 uses a green GaP LED
chip.
These devices are offered with JAN equivalent quality
conformance inspection (OCI) and JANTX equivalent
screenings similar to MIL-S-19500/5l9/520/52l.

'Panel Mount version of all of the above are available per the
selection matrix on this page.

COLOR Description

PART NUMBER -

LAMP AND PANEL MOUNT MATRIX
JAN QCI

Standard Product

JANTX Equivalent

TABLE I HERMETIC TO-18 PART NUMBER SYSTEM
High Efficiency Red
Yellow
Green

HLMP-0363
HLMP-0463
HLMP-0563

HLMP-0391
HLMP-049l
HLMP-0591

HLMP-0392
HLMP-0492
HLMP-0592

TABLE II PANEL MOUNTABLE PART NUMBER SYSTEM(1]
High Efficiency Red
Yellow
Green

HLMP-0364
HLMP-0464
HLMP-0564

HLMP-0365
HLMP-0465
HLMP-0565

HLMP-0366
HLMP-0466
HLMP-0566

..

NOTE:
1. Panel mountable packaging incorporates additional assembly of the equivalent Table I TO-18 part into the panel mount enclosure. The
resulting part is then marked per Table II.

8-24

JAN QCI : Samples of each lot are subjected to Group A, B
and C tests listed below. All tests are to the conditions and
limits specified by the appropriate MIL-S-19500 slash sheet
for the device under test. A summary of the data gathered
in Groups A, Band C lot acceptance testing is supplied
with each shipment.

Examination ·or Test

MIL-STD-750
Method

JANTX Equivalent: Devices undergo 100% screening tests
as listed below to the conditions and limits specified by
MIL-S-19500 slash sheet. The JANTX lot has also been
subjected to Group A, Band C tests as for the JAN QCI
PART above. A summary of the data gathered in Groups
A, Band C acceptance testing is supplied with each
shipment.

Examination or Test

MIL-STD-750
Method

GROUP A INSPECTION

GROUP C INSPECTION

Subgroup 1
Visual and mechanical examination

2071

Subgroup 2
Luminous intensity (0
Reverse current
Forward voltage

Subgroup 1
Thermal shock (temperature cycling)
End points: (same as subgroup 2 of group B 1

4016
4011

= 0°)

Subgroup 3
Capacitance

-

Subgroup 2
Resistance to solvents

4001

GROUP B INSPECTION
Subgroup 1
Physical dimensions

-

Subgroup 3
High-temperature life (nonoperating)
End points: Luminous intensity (0 = 0°)

1031

Subgroup 4
Steady-state operation life
End points: (same as subgroup 3)

1026

Subgroup 5
Peak forward pulse current (transient)

2066

1051

-

-

End points: (same as subgroup 6 of group B)

Subgroup 2
Solderability
Thermal shock (temperature cycling)
Thermal shock (glass strain)
Hermetic seal
Moisture resistance
End points: Luminous intensity (0 = 0°)

2026
1051
1056
1071
1021

Subgroup 3
Shock
Vibration, variable frequency
Constant acceleration
End points: (same as subgroup 2)

2016
2056
2006

Subgroup 6
Peak forward pulse current (operating)
End points: (same as subgroup 6 of group BI

-

Subgroup 4
Terminal strength
End poi nts: Hermetic seal

2036
1071

Subgroup 5
Salt atmosphere (corrosion)

1041

Subgroup 6
High-temperature life (nonoperating)
End points: Luminous intensity (0 = 0°)

1032

Subgroup 7
Steady-state operation life
End points: (same as subgroup 6)

1027

-

PROCESS AND POWER CONDITION
("TX" types only)
High temperature storage (nonoperating)
Thermal shock (temperature cycling)
Constant acceleration
Hermetic seal
Luminous intensity (0 = 0°)
Forward voltage
Reverse current
Burn-in (Forward bias)
End points (within 72 hours of burn-in):
A Luminous intensity (0 = 0°)
A Forward voltage

-

8-25

1051
2006
1071

4011
4016

4011

Absolute Maximum Ratings at TA=25° C
Parameter
Power Dissipation
(derate linearly from 50· Cat
1.6mW/oC)

High Eff. Red
HLMP-0363

Yellow
HLMP-0463

Green
HLMp·0563

Units

120

120

120

mW

35 111
60
See Fig.S

35 111
60
See Fig. 10

35111

rnA

60
See Fig. 15

mA

DC Forward Current
Peak Forward Current
Operating and Storage
Temperature Range

-S5°C to 100·C

Lead Soldering Temperature

260· C for 7 seconds.

!1.6mm (O,OSS in.) from body)
NOTES: 1. Derate from 50° Cat 0.5mA/O C

Electrical/Optical Characteristics at TA=25° C

IV1

Axial LumInous
Intensity

201/2

Included Angle
Between Half
LumInous Intensity
Points

APEAK

Peak Wavelength

Min.

Typ.

20

50

Mal(,

Min.

Typ.

20

50

18

590

635

HLMP-oS63

HLMP-0463

HLMP·03S3

Symbol Description

Max.

Unll$

Test Condillons

J I

50
AtiF=25mA

mcd

IF"'20mA
FIgs. 3.8.13

18

deg.

[1) Figures
6,11,16

nm

Measurement
at Peak

570

nm

12J

200

ns

Min.
20

Typ.

18

895

550

583

Max.

00

660
,

.

o~O·

Ad

Dominant Wavelength

628

585

T$

200

200

C

Speed of Response
Capaoitancel 5j

pF

V,=O; f~l MHz

0JG

Thermal Resistance*

425

425

425

·C/W

13j

HJG

Thermal Resistanoe"

550

550

550

°CJW

[31

Vp

forward Voltage

2.0

V

IF~20mA

Reverse Current
fR
BVR ] ; s e Sreakdown
age

w

Luminous Efficaoy

35

35

100

3.0

I

100

3.0

2.1
3.0
At IF;25mA

1.0

1.0
5.0

5.0
140

35

100

2.0

1.0
5.0

.

455

600

Figures 2,7,12
pA

VR=3V

V

IR; 100!,A

Im/W

[4)

NOTES:
1. tly, is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
3. Junction to Cathode Lead with 3.18mm (0.125 inch) of leads exposed between base of flange and heat sink.
4. Radiant intensity, Ie. in watts/steradian, may be found from the equation Ie; 1/1)v, where Iv is the luminous intensity in candelas
and 1)v is the luminous efficacy in lumens/watt.
5. Limits do not apply to non screened parts.
'Panel mount.
**TO-1B.
1.0 r - - - - - - - . , . -........-.......,,.....--~---_..,....,.-.,.......------.__------......,

0.s1-------++---+----\----i'<--4-----+--\------+-------.........j

WAVELENGTH - nm

Figure 1. Relative Intensity vs. Wavelength.

8-26

package Dimensions
HLMP-0364, 0464, 0564

/

CATHODE

..J

NOTES:
OIMENSIONS IN MtLLlMETERS AND l1NCHEsL

1. BLACK PANEL MOUNT SLEEVE

2.. MOUNTING HARDWARE WHICH INCLl,JOESONE lOCK
WASHER AN£) ONE HEX·NUT IS INCLUDED WITH EACH
PANElL MOUNTAaLE HERMETIC SOUD StATE LAMP.
3, USE OF METRiC ORll!. SIZE -8.20 MILLIMETRES-OR
ENGLlSH DRill.. $IZE P (0.323 INCH) IS A.ECOMMENOEP

FOR PROOOCtNG

HOL~

OUTLINE TO-iS
NOTES,
1. ALL DIMENSIONS ARE IN MILllMETRES (INCHES).
2. GOLD·PlATED LEADS.
3, PACKAGE WEIGHT Of lAMp A!.ON"E
IS ,25. AO<;:ftAMS,

IN THE PANIH. FOR P"ANEl.

MOUNTING.
4. ALL OIMENSIONS ARE IN MltLlMc-TRES UNCHESt
5. PACKAGE WEIGHliNCLUOING LAMP AND
PANeL MOUNT IS 1:2' -l.S GRAMS. NUT AND WASHER IS AN EXTRA.6 ~ 1.0 GRAM.

Family of High Efficiency Red HLMP-0363/HLMP-0364

.

1.6

2.00

"

i ,..
~

o

t.o

t.5

V.

2.0

2.5

3.0

I

1.00

w~

0.75

...

0.25
0.00

3.4

VF - PEAK FORWARD VOLTAGE - V

Figure 2. Forward Current vs.
Forward Voltage.

tp -

~~

A

I

Y

I /
i/
,
71

~15
~:; 0.50

I

j

1.S0

~~

~

20

~~

) <",,l,1

4N54

PIN

4N52

1

NUMERIC
Inpul2

HEXA·
DECIMAL
Inpu'l

Input 4

~nput

InputS

4

InputS
Decimal

5

poiot
latch

2
3

enable

4.•

~(.19)

(.12)

5

I

FUNCTION

4N54

4

Blankil11l

control
Latch

enabre

6

Ground

Ground

7

Vee

v~~

8

loput 1

Input 1

NOTES:
LUMINOUS
INTENSITY
CATEGORY

..
"
~~

SEATING
PLANE
\

U5}

f

(.Os)

I

I 3.4
-.-i.. (.135)

-'--I rI .- TI

DATE CODE

TVP'~' ~~'_11_ 0.5(.020
'O.OB TVP.
±.003)

1.3
(.050)

PIN 1 KEY

2.5±O.13TYP.
(.10 ±.005)

'JEDEC Registered Data.

8-30

1. Dimensions in millimetresand (inches).
2. Unless otherwise specified, the tolerance
on all dimensions is ±.38mm (±.015")
3. Digit center line is ±.25mrn (:±.01")

from package center line.
4. Lead material is gold plated copper
alloy.

~---

~-.~------~~-----------------------

Absolute Maximum Ratings *

Recommended operating Conditions*

Electrical/Optical Characteristics 'ITA = -55°C to +100°C, unless otherwise specified)

Vcc=4.5V

v
0.8

v

Notes: 1. Nominal thermal resistahce of a display mounted in a socket which is soldered into a printed circuit board: 9JA=5rY'CIW;
9Jc=15° CIW. 2. 9CA ofa mounted display shou Id not exceed 35° CIW for operation up to T A=+1 00" C. 3. Voltage values are with respectto
device ground, pin 6. 4. All typical values at Vcc=5.0 Volts, T":=25° C. 5~ These displays are categorized for luminous intensity with the intensity category designated by a letter located on the back of the display contiguous with the Hewlett-Packard logo marking. 6. The
luminous intensity at a specific ambient temperature, Iv(TA), may be calculated from this relationship: Iv(TA)=lv(2'o C) (.985) [TA-25'CI
7. Applies only to 4N54. 8. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength wh ich defines the color of the device.
'JEDEC Registered Data.

"Non Registered Data.

8-31
----- ---------

TRIJTHTA8LE

·SETUP'-i---_l---l-'HOLD

8CDIlATA{lI

DATA INPUT

x..

x.

(LOW LEVEL DATAl

4N51 ANIl4N52

X.

4N54

ri
t••l

DATA INPUT
(HIGH LEVEL" DATA)

Ii

H
H

L

L

I<

L

H

H

Ii

H

H

Figure 1. Timing Diagram of 4N51·4N54
Series Logic.

H

H

Ii

t.

Ii

Ii

Ii

Vee

LOGIC

_Xl

INPUT

~$

-

Dprzi 4

-

LATCH
M£M<)RV

If

GROUND

Ii

H

L

(BLANK)

H

H

H

(BLANKI

MAtRIX

DECIMAL prJ'1

DECODER

-

LED
MATlUX

DRtVt!ll

6~

B

B...

(BLANKI

;

1"1

:..:

H

ENABU"l
DP

'
:";

'

(BLANKI

DP

j
BLANKING r3 )
CONTROL
4

f--

f'j

~::i

r-;- ~
Ii

_)C2

f]

;3

Ii

-----.

..

:::;
L~
,..
:.t..
I:;:
.. ]
f:....
···i
..

(:,

f-.....-

ENABLE

J
,.
I'-I

"'f

Ii

H
L

::*
r...

E:~

L

M

;:~~

8LANKINGt31

.....

~

:

F

0\1

Vop '" L

OFF

VoploOH

LOAD DATA·

VI; -L

LATCH DATA

Vr -Ii

DISPLAY·ON

Va

OISPLAY'()fF

V. -H

-.

Notes:
1. H = Logic High; L = Logic Low. With the enable Input at logic high
changes in BCD input logiC levels or D.P. Input have no effect upon
display memory, displayed character; or D.P.
2. The decimal pOint input, DP, periains only to the 4NSI and 4NS2
displays.
3. The blanking control input, B, pertains only to the 4NS4 hexadecimal
display. Blanking input has no effect upon display memory.

Figure 2. Block Diagram of 4N51·4N54
Series Logic.

T
~.'2S"cl_

I

-1.8

~

-1.6

~

-1. 4

~

'"

-1. 2

!!I

-1.0

I

I
~
I

Vcc"'S.DV

8 ......
6

-A

......

,

.!'
2

-20
Va - BLANKING VOLTAGE - V

Flgu!'4' 3. Typical Blanking Control
Current VB. Voltage for 4N54.

20

40

60

80

100

TA - AMBIENT TEMPERATURE _ °C

Flgure.4. Typical Blanking Control
Input Current VB. Ambient
Temperature lor 4N54.

"JEDEC Registered Data.

8-32

0

1
1.0

2.0

3.0

4.0

6.0

V E - LATCH ENABLE VOLTAGE":" V

Figure 5. Typical Latch Enable Input
Curnint VB. Voltage.

._._--_. - - - - - - -

"

.

1.0

1

I"'"

-1. B

~

-1.6

, I, -

-26'C

Vee" fi.-QV

E
, -1. 4
I-

:~"

~ -1. 2

g

8

I

6

-"

,.,.

......
Vt;'" V

o

rr"

0.5

1.0

-

I-....,

26
I- ", 24
Z I 22

.........

.6

~~

r-

a~

20

it

..

i,,;;;~

16

Vee "'5.0V
.5

V" =

0if"

2.0

3.0

4.0

5.0

o

-55 -40

Y,N - LOGIC VOLTAGE - V

Figure 6. Typical Logic and Decimal
Point Input Current vs.
Voltage.

:c

(.J

..

I --

18 I -

-

x 12
10

~!2

8

.....

20
40
60
TA - AMBIENT TEMPERATURE

80

100

_·c

Figure 7. Typical Logic and Enable
Low Input Current vs.
Ambient Temperature.

/
L

l5.0~

vlI,{ "'2.4V

/
11

1['

...

4

o

10/·,·

.""

.........

6

2

-20

Vo;

14

i

~.,9
_w _=

,

'oJ·2

-- .1

I-~

~

".'.,

I~

_~

2

.7

-

··n.

~ ~ ,4
f5 g .3
""

.\,

I

4

0

a a:~
~ a
~~

9~

-1. 0

;;
"

I

~ ... ,8

a:Z
I-

Z

aa:

IZ

"E .. -...

k:-

./

,

.'•.......•.

L
[.",.

F
20
40
60
80
-55 -40
-20
TA - AMBIENT TEMPERATURE _·c

100

Figure 8. Typical Logic and Enable
High Input Current vs.
Ambient Temperature.

operational Considerations
ELECTRICAL

The 4N51-4N54 series devices use a modified 4 x 7 dot
matrix of light emitting diodes (LED's) to display
decimal/hexadecimal numeric information. The LED's are
driven by constant current drivers. BCD information is
accepted by the display memory when the enable line is at
logic low and the data is latched when the enable is at
logic high. To avoid the latching of erroneous information,
the enable pulse rise time should not exceed 200
nanoseconds. Using the enable pulse width and data
setup and hold times listed in the Recommended
Operating Conditions allows data to be clocked into an
array of displays at a 6.7MHz rate.
The blanking control input on the 4N54 display blanks
(turns off) the displayed hexadecimal information without
disturbing the contents of display memory. The display
is blanked at a minimum threshold level of 3.5 volts. This
may be easily achieved by using an open collector TTL gate
and a pull-up resistor. For example, (1/6) 7416 hexinverter
buffer/driver and a 120 ohm pull-up resistor will provide
sufficient drive to blank eight displays. The size of the
blanking pull-up resistor may be calculated from the
following formula, where N is the number of digits:
Rbl,"k = (Vee - 3.5V)/[N (1.0mA)]

These displays may be mounted by soldering directly to a
printed circuit board or inserted into a socket. The leadto-lead pin spacing is 2.54mm (0.100 inch) and the lead
row spacing is 15.24mm (0.600 inch). These displays may
be end stacked with 2.54mm (0.100 inch) spacing between
outside pins of adjacent displays. Sockets such as Augat
324-AG20 (3 digits) or Augat 508-AG8D (one digit, right
angle mounting) may be used.
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +100°C, it is important to
maintain a case-to-ambient thermal resistance of less
than 35° G/watt as measured on top of display pin 3.
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-15, Genesolv DE-15.
PRECONDITIONING

4N51-4N54 series displays are 100% preconditioned by 24
hour storage at 125° C.
CONTRAST ENHANCEMENT

The decimal point input is active low true and this data is
latched into the display memory in the same fashion as
the BCD data. The decimal point LED is driven by the onboard IC.
MECHANICAL

4N51-4N54 series displays are hermetically tested for use
in environments which require a high reliability device.
These displays are designed and tested to meet a helium
leak rate of 5 x 10-8 CC/SEC and a standard dye penetrant
g ross leak test.

• JEDEC Registered Data.

8-33

The 4N51-4N54 displays have been designed to providethe
maximum posible ONfoFF contrast when placed behind
an appropriate contrast enhancement filter. Some
suggested filters are Panelgraphic Ruby Red 60 and Dark
Red 63, SGL Homalite H100-1605, 3M Light Control Film
and Polaroid HRCP Red Circular Polarizing Filter. For
further information see Hewlett-Packard Application Note
964.

Solid State Over Range Character
For display applications requiring a +,1, ordecimal point designation, the4N53 over range character is available. This display
module comes in the same package as the 4N51-4N54 series numeric indicator and is completely compatible with it.

package Dimensions *
.7

r---~-----NUMEAAlON(

v~

----------,I
M~S

~

I

I

"!l£ATING
f'\.ANE

I

0,$ :1:0.08 TYP,
(.012",003)

IZ,~I--I .fl r--

FRONT

-41.111

+

..

---"2 ------;4

---.1

I
I
-_oJ

'50<,

560il

SIDE

Figure 9. Typical Driving Circuit.
DATECOOE
PIN 1 KEY

TRUTH TABLE

REAR

CHARACTER

END
PIN

,

FUNCTION

Nons;

2

NumeralOne

1. DIMENSION$ IN MltllMETAES ANt) HNCHES).
;2. UNLESS OTHERWISE SPtClf1EO. TIlE TOLERANCE
ON ALL OIMENstON$IS t.3S MM (t ,015 INCHES).

•

3

NumeralOne
DP
Open
Open

5
6
7

8

+

-

Plus

1

Decimal Point
Blank

PIN

1

2,3

4

8

Ii
L
X
X
L

X
X

X
X
X
Ii
L

Ii
Ii
X

H

X
L

X

L

NOTES: L: Line switching transistor in Figure 9 cutoff.
H: Line switching transistor in Figure 9 saturated.
X: 'Don't care'

Vee
Minus Plus

Electrical/Optical Characteristics *
4N53

(TA = -55°C to +1 OO°C, Unless Otherwise Specified)
DESCRIPTION

SYMBOL

TEST CONDITIONS

Forward Voltage per LEO

VF

Power dissipatiQo

PT

Luminous Int~nsity per LED (digit averagel

Iv

IF=6mA
Tr = 25·C

Peak wavelength

"'peak

Dominant Wavelength
Weight' •

Ad

Tc = 25"C
TC = 25°C

Recommended Operating
Conditions*
Vce
IF

4.5

I 5.0
I

5.0

5.5
10

NOTE:
LED current must be externally limited. Refer to Figure 9
for recommended resistor values .
• JEDEC Registered Data. "Non Registered Data.

IF = 10mA
IF = 10 mA
all diodes iiI

40

TYP

MAX

UNIT

1.6

2.0

V

280
85

320

mW
lied

655

640
1.0

om
nm
gm

Absolute Maximum Ratings *

SYMBoL MIN1IN(iiJiNiAX UNIT
LED supply voltage
Forward ",,"'mI. each LED

MIN

V
mA

DESCRIPTION
SYMBOL IlII'N,
Storage temperature, ambiant
-65
TS
Operating temperature, ambient
-55
TA
Forward current, each LEO
IF
Raver$!) voltage, each LED
VR

8-34

MAX.

UNIT

+125
+100
10
4

·e
·c
rnA
V

High Reliability Testing

PART MARKING SYSTEM

Two standard reliability testing programs are available. The
TXVB program is in conformance with Quality Level A of
MIL-D-87157 for hermetically sealed displays with 100%
screening tests. A TXVB product is tested to Tables I, II, Ilia,
and IVa. A second program is an HP modification to the full
conformance program and offers the 100% screening portion of Level A, Table I, and Group A, Table II.

Standard Product

With Tables f,
II, II/a and IVa

With Table I
and II

PREFERRED PART NUMBER SYSTEM

~

4N51TXV
4N52TXV
4N54TXV
4N§iJX\{"

4N51
4N52
4N54
4N53

M87157/00101ACX
M87157/oo102ACX
M87157/00103ACX
M8W/0Q,104ACX

100% Screening
TABLE I.
QUALITY LEVEL A OF MIL-D-87157
MIL-STD-750
Method

Test Screen

Conditions

-

HP Procedure 5956-7572-52

2, High Temperature Storage

1032

TA "" 125"C, Time'" 24 hours

3. Temperature Cycling

1051

Condition B, 10 Cycles, 15 Min. Dwell

4. Constant Acceleration

2006

10,000 G's at Y1 orientation

5. Fine Leak

1071

Condition H

6. Gross Leak

1071

Condition C

1. Precap Visual

-

7, Interim Electrical/Optical Tests[2)

8. Burn-lnl1.31

Iv. Icc. lal.. ISH, lel, leH. Ill.. and hH
TA 25°C

=

Condition B at Vee = 5V and cycle
through logic at 1 character per second.
TA = 100"C. t= 160 hours

1015

-

9. Final Electrical Test( 2)
10. Delta Determinations
11. External Vlsuallll

Same as Step 7
Alv = -20%, Alec'" ± 10 rnA, AIlH '" ±lOs.isture Resistance t3j
Fine Leak
Gross Leak
Electrical/Optical Endpolntsl4]
Subgroup 4
Operating Life Test (340 hrs.)151

2026

T A ;: 2450 C for 5 seconds

LTPD=15

1051
1021
1071
1071

Condition 81,15 Min. Dwell

LTPD=15

Condition H
Condition C
lv, Icc, IBL, IBH, IEL. IEH. ilL. hH and
visual function. T A ~ 25° C

1027

TA'" +100·C at Vee = 5.0V and
cycling through logic at 1 character
per second.
Same as Subgroup 3.

LTPD= 10

1032

TA=+125°C

LTPD=10

ElectrlcaVOptical Endpointsl4 j

SubgroupS
Non-operating (Storage) Life
Test (340 hrs.)
Electrical/Optical Endpointsl 4 j

-

Same as Subgroup 3

1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads
required.
3. Initial conditioning should be a 15° bent inward one cycle.
4. Limits and conditions are per the electrical/optical characteristics.
5. Burn-in for the over range shall use Condition B at a nominal IF = 8 rnA With '+1' illuminated for t = 160 hours.

8-36

TABLE IVa
GROUP C, CLASS A AND B OF MIL-D-87157

Test
Subgroup 1
Physical Dimensions

MIL-STO-750
Method

Conditions

2066

Sample
Size
2 Devices/
Failures

o

Subgroup 2[2,7)

LTPD= 15

Lead Integrity

2004

Condition B2.

Fine Leak

1071

Condition H

Gross Leak

1071

Condition C

Shock

2016

1500G, Time = 0.5 ms, 5 blows in
each orientation Xl, y 1, Z 1

Vibration, Variable Frequency

2056

Subgroup 3

Constant Acceleration
External VisuaH4]
Electrical/Optical Endpointsl 8]

Subgroup 4[1,3)
Salt Atmosphere
External Visual1 4 J

10,000G at Y1 orientation

2006
1010 or 1011

-

lv, Icc, IBL, IBH, IEL, IEH, ilL, IIH and visual Function, TA = 25Q C

1041

LTPD = 15

1010 or 1011

Subgroup 5
Bond Strengthl 5 ]

2037

Condition A

Subgroup 6
Operating Life Testl 6 1

1026

TA=+100·C

Electrical/Optical Endpointsl 81

LTPD = 15

LTPD=20
(C=O)
A = 10

-

Same as Subgroup 3

1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C Life Test requirements. In such cases, either the340 hour endpoint
measurements shall be made a basis for Group B lot acceptance orthe 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics.

8-37

rh~

~~

HEWLETT
PACKARD

HERMETIC, HEXADECIMAL AND NUMERIC
DISPLAYS FOR MILITARY APPLICATIONS
. HIGH EFFICIENCY RED
LOW power HDSp·078X/078XTXV /078XTXVB
High Brightness HDSP-079X/079XTXV/079XTXVB
YELLOW HDSP-088X/088XTXV/088XTXVB
TECHNICAL DATA

JANUARY 1986

Features
•
•
•
•

CONFORM TO MIL-D-87157, QUALITY LEVEL A
HERMETICALLY SEALED
TXV AND TXVB VERSIONS AVAILABLE
THREE CHARACTER OPTIONS
Numeric
Hexadecimal
Over Range
4 x 7 DOT MATRIX CHARACTER
HIGH EFFICIENCY RED AND YELLOW
TWO HIGH EFFICIENCY RED OPTIONS
Low Power
High Brightness
PERFORMANCE GUARANTEED OVER
TEMPERATURE
HIGH TEMPERATURE STABILIZED
GOLD PLATED LEADS
MEMORY LATCH/DECODER/DRIVER
TTL Compatible
CATEGORIZED FOR LUMINOUS INTENSITY

•
•
•

•
•
•
•
•

Description
These displays are hermetic, solid state numeric and hexadecimal indicators with on-board decoder/drivers and
memory. They are designed and tested for use in military
and aero-space applications. The character height is 7.4
mm (0.29 inch). The TXVB versions of these products con c
form to Quality Level A of MIL-D-87157, the general
specification for light emitting diode displays.

The numeric devices decode positive BCD logic into
characters "0-9", a "-" sign, decimal pOint, and a test
pattern. The hexadecimal devices decode positive BCD
logic into 16 characters, "0-9, A-F". An input is provided on
the hexadecimal devices to blank the display (all LEDs off)
without losing the contents of the memory.
The over range device displays "±1" and right hand
decimal point and is typically driven via external switching
transistors.

Devices
Part Number
HDSP"

"

.

Color

Numeric, Right Hand DP
Numeric, Left Hand DP
Over Range ±1
Hexadecimal

A
8
C

High-Efficiency Red
High Brightness

Numeric, Right Hand DP
Numeric, Left Hand DP
Over Range ±1
Hexadecimal

A
8
C

Yellow

Numeric, Right Hand DP
Numeric, Left Hand DP
Over Range ±1
Hexadecimal

A
8

0791/0191 TXv/0791 TXV8
0792/0192TXV/0792TXVB
0783/0183TXV/0183TXV8
0794/0794TXv/0794TXVB
0881/0881 TXv/0881 TXV8
088210882TXV/0882TXV8
0883/0883TXv/0863TXVB
0884!0884TXV10864TXVB

Front
View

High-Efficiency Red
Low' Power

0781/0781TXV/0781 TXVB

078210182TXV/0782TXVB
0183/0183TXv/0783TXV8
0184/0184TXv/0784TXV8

Description

8-38

0

0

C
0

package Dimensions
FRONTVIEWA

FRONT VIEWB

1.5
1.061

FRONT VIEW 0

••

I

I

I

4.8

~1.191

REAR VIEW
S

6

7

END VIEW

Notes:
1. Dimensions in millimetres and (inches).
2. Unless otherwise specified, the tolerance
on all dimensions is :t.38 mm (:t.01S") .
3. Digit center line is ~.25 mm (:t.Ol")
from package center line.
4. Lead material is gold plated copper
alloy.
5. Color code for HDSP·088X series.

8
.8

LUMINOUS
INTENSITY
CATEGORY

"-... SEATING
PLANE

VV"NW'/,~=I- DATE CODE

0.3 TYP.

P L A N E : l ""
SEATING• ,,',' """1"','"5,,,,,,1,,," """"."""""""""'","."""".

\

,1:-:"":"",,

-*-I

3,4

(,061 1.1351

-TI

~J rI

1.3 TYP.
1.0501

PIN 1 KEY

15

~' ~~'--j11.5
-

TYP.
1.0201

2.5 TYP.
3

2

1.101

tSETUP1--~+--~+tHOLD

DATA INPUT
ILOW LEVEL DATAl

TA(nl'tTA6LE
BCD DATA 11

DATA INPUT
(HIGH LEVEL DATA)

x,

x,

1.SV

li'N
l. . t '

1.SV

L

L

L

H

L

H

L

I,;,: L

L

H

H

L

H

L

L

H

L

H

H

r-;:i
J"L
L

Figure 1. Timing Diagram

Vee

7~

ENABLE

LOGIC

d

L

L

90%

x,

X2

:::
NUMERIC

--

...,

.. ,

,

:

-

:'

:
:.f

.•..,'
~c~_,

L

H

H

H

;',k

L

L

Be;)

i'f

L

H

H

L

,

i

!

,('.! ':.;

H

"""f"

H

L

H

",~

H

L

H

L

H

H

H

L

(BlANK)

H

H

H

(BLANKl

1-- ,...
I

..

:

H

(8lANK~

L

IBLANK!

:.'

.><.

INPUT

H
H

DECIMAL PT, {21

..

ON

BlANKINGI31

LED
MATRIX
DRIVER

,

Vop '"' l

OFF
LOAD DATA

ENABL.It}

BLANKING(3f
CONTROL

HEXA
OEC1MAL

,;---"---

H

I

8,7

'\/'11'"

I

(f~(i

,

Vop" H
f-

;§~

~i1i
:!: c

R&JA "'-60~C!W

1.0 08 _

1

R{JJ~"' 5~~ctW/

O.

;::

'"::>0

!.c'

z

V

;;

I

I

I

IL'

c

~

0.4

0

2.0

"'-

o

10

W

~

~

~

~

ro

80

00 100

TA -AMBIENTTEMPERATURE-QC

Figure 2. Maximum Allowable Power
Dissipation vs. Temperature.

i3

300

1.0

"3
0

""-

a:

o.2

400

z

w

>
i=

f-

~

\

3

6- IRBi i'Ci
I

\

f-

- -

~

:::1

3.0

o

-40

!

I

E

>eo;

::;

TA~25C

"

1.8

~w

I

The display is column strobed on a 1 of 5 basis by loading
7 bits of row data per character for a selected column. The
data is shifted through the SIPO shift register, one bit
location for each high-to-Iowtransition of the clock. When
the HDSP-2010 display is operated with pin 1 in the lower
left hand corner, the first bit that is loaded into the SIPO
shift register will be the information for row 7 of the right
most character. The 28th bit loaded into the SIPO shift
register will be the information for row 1 of the left most
character. When the 28 bits of row data for column 1 have
been loaded into the SIPO shift register, the firs: column is
energized for a time period, T, illuminating column 1 in all
four characters. Column 1 is turned off and the process is
repeated for columns 2 through 5.

4.0

2.0

ffi

Associated with each shift register location is a constant
current sinking LED driver, capable of sinking a nominal
13.5 mA. A logical 1 loaded into a shift register location
enables the current source at that location. A voltage
applied to the appropriate column input turns on the
desired LED.

-20

+20

u

......

I

200

"
~
I

~

+40

+60

100

0

u

+80

TA - AMBIENT TEMPERATURE _ °C

Figure 3. Relative Luminous Intensity
vs. Temperature.

8-48

-

o

o

)
1.0

I

2.0

RECOMMENDED
OPERATING _

I RET
2.6 3.0

4.0

VeOL - COLUMN VOLTAGE - V

Figure 4. Peak Column Current
vs. Column Voltage.

5.0

-----------

~

----.--~

longer display strings, operation of the display with OF
approximately 10% will provide adequate light output for
indoor applications.

CLOCK

I
SERIAL
DECODED

28BITS1POSHIFT
REGISTER

DATA

SERIAL
DECODED

The 28th stage of the SIPO shift register is connected to
the Data Output, which is designed to interface directly to
the Data Input of the next HDSP-2010 in the display string.

DATA
OUTPUT

INPUT

The VB input may be used to control the apparent
brightness of the display. A logic high applied to the VB
input enables the display to be turned ON, and a logic low
blanks the display by disabling the constant current LED
drivers. Therefore, the time average luminous intensity of
the display can be varied by pulse width modulation of VB.
For application and drive circuit information refer to HP
Application Note 1016.

BRIGHTNESS
CONTROL
-

High Reliability Testing
Two standard reliability testing programs are available. The
TXVB program is in conformance with Quality Level A of
MIL-D-87157 for hermetically sealed displays with 100%
screening tests. A TXVB product is tested to Tables I, II, Ilia,
and IVa. A second program is an HP modification to the full
conformance program and offers the 100% screening portion of Level A, Table I, and Group A, Table II.

COLUMN DRIVE INPUTS

Figure 5. Block Diagram of the HDSP-2010 Display

The time frame allotted per column is (t + T) and the
minimum recommended refresh rate for a flicker free
display is 100 Hz, so that (t + T) S; 2 ms. If the display is
operated atthe 3 MHz maximum clock rate, it is possible to
maintain t« T. Fordisplay strings of 24 characters or less,
the LED on time OF will be approximately 19.4%. For

PART MARKING SYSTEM
With Tables
Standard Product
With Table I
I, II, Ilia, and
and II
IVa
HDSP-2010
HDSP-2010
HDSP-2010
TXV
TXVB

100% Screening
TABLE I. QUALITY LEVEL A OF MIL-D-87157
Test Screen
1. Precap Visual

MIL-STO-750
Method

Conditions

-

HP Procedure 5956-7512-52

= 24 hours

2. High Temperature Storage

1032

TA = 100°C, Time

3. Temperature Cycling

1051

TA = -55°C to +100°C,10 cycles,15 min.dwell

4. Constant Acceleration

2006

10,000 G's at Y, orientation

5. Fine Leak

1071

Condition H, Leak Rate

6. Gross Leak

1071

Condition C, except fluid temperature
shall be +100°C

7. Interim Electrical/Optical Testsl 2 J

8. Burn-lnl'J

9. Final Electrical Testl 2 J
10. Delta Determinations

11. External Visual

S;

5 x 10-7 ccls

Icc (at VB O.4V and 2.4V), Icol (at VB =
O.4V and 2.4V)
ilH (VB, Clock and Data Ini. ill (VB, Clock
and Data Inl, IOH, IOL
and Iv Peak. VIH and VIL inputs are
guaranteed by the electronic shift register test. TA = 25°C

-

Condition B at Vee = VB = 5.25V, VeOL
3.5V, TA = +85°C
LED ON-Time Duty Factor = 5%,
,
t = 160 hours

1015

=

-

Same as Step 7

-

Alee = ±6 mA, J.ltH (clock) = ±1 0 I'A
J.ilH (Data In) = ±10 I'A
J.IOH = ±10% of initial value and J.lv = -20%

2009

Noles:

1. MIL-STD-883 Test Method applies.
2. Limits and conditions are per the electrical/optical characteristics. The
electrical characteristics.

8-49

10H

and

10L tests

are the inverse of VOH and VOL specified in the

TABLE II
GROUP A ELECTRICAL TESTS MIL-D-87157
Test

Parameters

LTPD

Subgroup 1

DC Electrical Tests at 25°Clll,

Icc (at VB = OAV and 2AV), leoL
(at Va = OAV and 2AV)
IIH (VB, Clock and Data Inl, IlL (VB, Clock and Data
In). IOH, IOL Visual Function and Iv peak. VIH and Vil
inputs are guaranteed by the electronic shift
register test.

5

Same as Subgroup 1, except delete Iv and visual
function. T A = +85° C

7

Same as Subgroup 1, except delete Iv and visual
function. T A = -40° C

7

Satisfied by Subgroup 1

5

Subgroup 2

DC Electrical Tests at High
Temperaturel 1]
Subgroup 3

DC Electrical Tests at Low
Temperaturel 11
Subgroup 4, 5, and 6 not tested
Subgroup 7

Optical and Functional Tests at 25°C
Subgroup a

External Visual

7

1. Limits and conditions are per the electrical/optical characteristics. The 10H and 10l tests are the inverse of VOH and VOL specified in the
electrical characteristics.

TABLE ilia
GROUP B, CLASS A AND B OF MIL-D-87157
Test

MIL-STD-750
Method

Conditions

Sample Size

,

Subgroup 1

Resistance to Solvents

1022

Internal Visual and Mechanical

2075

4 Devices!
o Failures
1 Device!
o Failures

Subgroup 2[1,2J

Solderability

2026

Subgroup 3

Thermal Shock (Temp. Cycle)
Moisture Resistancel 31
Fine Leak
Gross Leak

1051
1021
1071
1071

Electrical/Optical Endpointsl41

-

T A = 245° C for 5 seconds

LTPD = 15

TA = -55°C to +100°C
15 min. dwell

LTPD=15

Condition H
Condition C, except fluid temperature
shall be +100° C
Icc (at VB = OAV and 2.4V),
leOL (at VB = OAV and 2.4V),
IIH (VB. Clock and Data In). III (VB,
Clock and Data In). IOH, IOl Visual
Function and Iv peak. VIH and VIL
inputs are guaranteed by the electronic
shift register test. T A 25°C

Subgroup 4

Operating Life Test (340 hrs.)

Electrical!Optical Endpointsl 41

1027

-

T A = +85° C at Vee = VB = 5.25V,
Veol = 3.5V, LED ON-Time Duty Factor= 5%
Same as Subgroup 3

LTPD= 10

TA=+100°C

LTPD

SubgroupS

Non-operating (Storage) Life
Test (340 hrs.)
Electrical/Optical Endpoints l4 ]

1032

-

10

Same as Subgroup 3

1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads
required.
3. Initial conditioning should be a 15° bent inward one cycle.
4. Limits and conditions are per the electrical/optical characteristics. The IOH and IOl tests are the inverse of VOH and VOL specified in the
electrical characteristics.

8-50

- - - - - - - - - - - - - - - - - - - - - - - - ..---------~ - - - ..

TABLE IVa
GROUP C, CLASS A AND B OF MIL-D-87157
Test
Subgroup 1[1]
Physical Dimensions

MIL-STO-750
Method

Sample
Size

Conditions

2 Devices/
o Failures

2066

Subgroup 2[2,7]

LTPD=15

Lead Integrity

2004

Condition B2

Fine Leak

1071

Condition H

Gross Leak

1071

Condition C, except fluid temperature
shall be +100°C

2016

1500G, Time 0.5 ms, 5 blows in
each orientation X" Y" Z,

Subgroup 3
Shock
Vibration, Variable Frequency
Constant Acceleration
External Visual1 4 1
Electrical/Optical EndpointslSI

=

= 15

2056
10,000G at Y1 orientation

2006
1010or1011

-

lee (at VB = OAV and 2AVi
leOL (at VB = OAV and 2AV)
IIH (VB, Clock and Data In)
ilL (VB, Clock and Data In)
IOH, loL. Visual Function and Iv peak.
VIH and VIL inputs are guaranteed by
the electronic shift register
test. TA = 25°C.

Subgroup 4[1,3]
Salt Atmosphere
External Visuail 4J

1010 or 1011

Subgroup 5
Bond Strengthl 5 1

2037

Condition A

Subgroup 6
Operating Life Testl 6 J

1026

TA = +85 0 C at Vee = VB = 5.25V,
VeOl = 3.5V

Electrical/Optical Endpointsl 8}

LTPD

LTPD = 15

1041

-

LTPD = 20
(C=O)

A = 10

Same as Subgroup 3

1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.'
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in orderio satisfy the Group C life test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance orthe 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics. The IOH and IOL tests are the inverse of VOH and VOL specified in the
electrical characteristics.

8-51

HERMETIC, EXTENDED TEMPERATURE RANGE
5.0mm (,20") 5X7 ALPHANUMERIC DISPLAYS

Flidt

HEWLETT

STANDARD RED HDSP·2310/2310TXV/2310TXVB
YELLOW HDSP-2311 12311 TXV12311TXVB
HIGH EFFICIENCY RED HDSP-2312/2312TXV/2312TXVB

~~ PACKARD

TECHNICAL DATA

JANUARY 1986

Features
• WIDE OPERATING TEMPERATURE RANGE
_55 0 C TO +85 0 C
• TRUE HERMETIC PACKAGE
• TXVB VERSION CONFORMS TO QUALITY
LEVEL A OF MIL-D-87157
• THREE COLORS
Standard Red
High Efficiency Red
Yellow
• CATEGORIZED FOR LUMINOUS INTENSITY
• YELLOW DISPLAYS CATEGORIZED FOR
COLOR
• INTEGRATED SHIFT REGISTERS WITH CONSTANT CURRENT DRIVERS
• 5x7 LED MATRIX DISPLAYS FULL ASCII
CHARACTER SET
• WIDE VIEWING ANGLE
• END STACKABLE
• TTL COMPATIBLE

Typical Applications
• MILITARY EQUIPMENT
• AVIONICS
• HIGH RELIABILITY INDUSTRIAL EQUIPMENT

Description

hermetic 12 pin dual-in-line, solder glass sealed ceramic
package. An on-board SIPO (Serial-In-Parallel-Out) 7-bit
shift register associated with each digit controls constant
current LED row drivers. Full character display is achieved
by external column strobing.

The HDSP-2310 series displays are 5.0mm (0.20 in,) 5x7
LED arrays for display of alphanumeric information. These
devices are available in standard red, yellow and high efficiency red. Each four character cluster is contained in a

package Dimensions

r-l

2.84 REF.
(. 1121

12

4.8']tREF.
( .192)

2

1

L __

t

8

I

7

3

1'1L __ JI IIL __ JI

4

CJ

C3

CJ

31

~

II

f

C3

CJ

4

5

6

Ii.

----1
2.54
(.100)

CJ

f

-1.050:.0051

-I

(O~~.O~3)

8-52

12

CLOCK
GROUND
DATA IN

TOLERANCI" ON ALL DIMI"NSIONS
IS ±.38 mm (::t.01S")
3. CHARACTERS ARE CENTERED
WITH RESPECT TO LEADS WITHIN
:!:,13mm (t.DOS"I.
4. LEAO MATERIAL IS GOLD PLATED
COPPER ALLOY.

13

1.27 TYP.
1.050)

11

FUNCTION
DATA OUT
VB
Vee

2. UNLESS OTHERWISE SPECIFIED THE

1

6.85 (,2701

PIN
7
8
9
10

NOTES:
1. DIMENSIONS IN mm (inches).

SH+TI" 3

!I ~ Ij I '!
~ \"II t--

FUNCTION
COLUMN 1
COLUMN 2
COLUMN 3
COLUMN 4
COLUMNS
INT. CONNECT*

-DO NOT CONNECT OR USE

5.00' .13
{.197 .0051

127

2.54t.13TYP.
! !f..------ ~
(.100 LaOS) ~
NON ACCUM.

5
6

8.431.3321

4

IL __ JI

~

PIN 1 MARK ED BY DOTON'/ 1
BACKOFPA CKAGE

t

9 I

- p.- -+--+- -+-t+- -+-+
2

5.08
.2001

I

PIN
1
2
3

SE I"NOTE3

c~ C~
c~IC~rC~
r--l
r--l
r-., CJ
r--l
I
I
I
I I
I I
I
I

*

10

11

r

n
i

~i~25 'OS

1-0- 6.35 ± .2b;+j
{.250 '.0101

TVP
(.010,.002)

.... _ - - - - - - - - -

Absolute Maximum Ratings (HDSP-231 0/-2311/-2312)
Storage Temperature Range, Ts ..... -65°C to +125°C
Maximum Allowable Power Dissipation
at TA = 25°CI1.2.31 ......................... 1.46 Watts

Supply Voltage Vee to Ground ....•..... -0.5V to 6.0V
Inputs, Data Out and VB . .. ... ... . .....•. -0.5V to Vee
Column Input Voltage, VeOl ..........•. -0.5V tei +6.0V
Free Air Operating
Temperature Range, TAI1.21....... . .. -55° C to +85°C

Maximum Solder Temperature 1.59 mm (.063")
Below Seating Plane t < 5 secs ................ 260°C

Recommended Operating Conditions (HDSP-231 0/-2311/-2312)
Parameter
Supply Voltage
Data Out Current. Low State
Data Out Current. High State
Column Input Voltage, Column On HDSP-2310
Column Input Voltage, Column On HDSP-2311/-2312/-2313
Setup Time
Hold Time
Width of Clock
Clock Frequency
Clock Transition Time
Free AI( Operating Temperature Range .1.21

Symbol
Vee
10l
IOH
Veol
VeOl

Min.
4.75

fcloch.

24
2.75
70
30
75
0

tTHL
TA

-55

tsetup
thok1
tw(CIOCk)

Nom.
5.0

Max.
5.25
16
-0.5
3.5
35

Unils
V
rnA
mA
V
V
ns
ns
ns
MHz
ns
'C

45
0
3
200

85

Fig.

4
4
1
1
1
1
1

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified)
Description
Supply Current

Symbol
Icc

Column Current at any Column Input

leal

Column Current at any Column Input
VB. Clock or Data Input Threshold High
VB. Data Input Threshold Low
Clock Input Threshold Low
Input Current Logical 1
VB, Clock
Data In
Input Current Logical 0
VB, Clock
Data In

ICOL
V,H
Vil
Vil
IIH
IIH
III
III
VOH
VOL

Data Out Voltage
Power Dissipation Per Package"
Thermal Resistance IC
Junction-to-Case

Po

Test Conditions
Vee = 5.25V
VCloeK = VOATA = 2AV
All SR Stages =
Logical 1
Vec = 5.25 V
Veol = 3.5V
All SR Stages = Logical 1

Vs

~

204V

Typ.·

Max.

Units

45

60

rnA

73

95

rnA

500

I"A

380

520

mA
V
V

VB = OAV
VB

= 2.4V
2.0

Vee =4.75V

Vee = 5.25V. V,H = 204V
Vee = S.25V. Vil = Oo4V
Vcc = 4.75V. IOH = -0.5 rnA, ICOl = 0 rnA
Vec - 4.75V, 10l - 1.6 rnA. leOl - 0 rnA
Vec - 50V. VCOl - 3.5V, 17.5% OF
15 LEOs on per character. VB = 2AV

R8J-C

Leak Rate
• All typical values specified at Vcc
otherwise noted.

Min.
VB = OAV

204

20
10
-500
-250
3A
0.2

0.8
0.6
80
40
-800
-400
004

4

V
pA
I"A
pA
pA
V
V

0.78

W

2

25

'CfWI
Device

2

5x10- 8

= 5.0V and TA = 25° C unless

Fig.

cc/sec

"Power dissipation per package with four characters illuminated.

Notes:
1. Operation above 85°C ambient is possible provided the IC
junction temperature, TJ, does not exceed 125°C.
2. The device should be derated linearly above ;;7° C at
16.7 mW/o C. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at

8-53

35° C/W per device. See Figure 2 for powerderatings based on
a lower thermal resistance.
3. Maximum allowable dissipation is derived from Vcc = 5.25V,
VB = 2AV, VCOL = 3.5V 20 LEOs on per character, 20% OF.

Optical Characteristics
STANDARD RED

HDSP-2310

Description
Peak Luminous Intensity per LED14.81
(Character Average)
Peak Wavelength
Dpminant Wavelength!7]

YELLOW

Symbol
'vPeak

Test Conditions
Vee = 5.0V, VeOl - 3.5V
Tj '" 25·CI 61, VB = 2AV

Min •.

Typ.'

Units

Fig.

220

370

!lcd

3

655
639

nm
nm

APEAK
Ad

Max.

HDSP-2311

De!~flption
Peak Luminous Intensity per lEDI4.8[
(Character Average)
Peak Wavelength
Dominant Wavelength(5.7)

HIGH EFFICIENCY RED

Symbol
I,Peak

TEist Conditions
Vee'" 5.0V. VeOL '" 3.5V
TJ "" 25°C[6J, Vs 2AV

=

ufilts

Fig,

1140

!lcd

3

583
585

nm
nm

Min.

Typ.*

650

APEAK
Ad

Max.

HDSP-2312

Description
Peak Luminous Intensity per LEDJ4,81
(Character Average)
Peak Wavelength
Dominant Wavelength!?]
• All typical values specified at Vee
otherwise noted .

= 5.0V

and TA

SymbOl
IvPeak

T~st Conditions

Min.

Typ"

Vee = 5.0V, VeoL"" 3.5V
Tj'" 25°C[61, Vs = 2.4V

650

APEAK
Ad

Max.

Umts

Fig.

1430

!Jcd

3

635
626

nm
nm

= 25" C unless

.. Power diSSipation per package with four characters illuminated.
Notes:
4. The characters are categorized for luminous intensity with tile
intensity category designated by a letter code on the bottom of
the package.
5. The HDSP-2311 is categorized for color with the color
category designated by a number code on the bottom of the
package.
6. The luminous intensity is measured at TA = Tj = 25° C. No
time is allowed for the device to warm-up prior to
measurement.

7

Dominant wavelength Ad. is derived from the CIE chromaticity
diagram. and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv (cd/m2) = Iv (Candela)/ A (Metre)2
Lv (Footlamberts) = 1Tlv = (Candela)/A (Foot)2
A = 5.3 x 10-8 M2 = 5.8 X 10-7 (Foot)2

Electrical Description
The HDSP-2310 series of four charater alphanumeric
displays have been designed to allow the user maximum
flexibility in interface electronics deSign. Each four character module is arranged as a 28 bit serial in parallel out shift
register as is shown in Figure 5. The display module features Data In and Data Out terminals arrayed for easy PC
board interconnection. Data Out represents the output of
the 7th bit of digit number 4 shift register. Shift register
clocking occurs on the high to low transition of the Clock
input. The like columns of each character in a display
cluster are tied to a single pin. Figure 5 is the block diagram for the displays. High true data in the shift register
enables the output current mirror driver stage associated
with each row of LEDs in the 5x7 diode array.
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power
consumption.
In the normal mode of operation, input data for digit 4,
column 1 is loaded into the 7 on-board shift register
locations 1 through 7. Column 1 data for digits 3, 2, and 1 is
similarly shifted into the display shift register locations. The
column 1 input is now enabled for an appropriate period of
time, T. A similar process is repeated for columns 2, 3, 4 and

5. If the time necessary to decode and load data into the shift
register is t, then with 5 columns, each column·of the display
is operating at a duty factor of:
D.F.= _ _
T_
5 (t+T)
The time frame, t + T,alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
With five columns to be addressed, this refresh rate then
gives a value for the time t + T of:
1/[5 x (100)1 = 2 msec
If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t«T. Forshort display strings, the duty
factor will then approach 20%.
Forfurther applications information, refer to HP Application
Note 1016.

8-54

CLOCK

CLOCK

SERIAL

SERIAL

DECODED
DATA

DECODED
DATA

INPUT

OUTPUT

DATA IN

BLANKING
CONTROL
DATA OUT

Figure 1. Switching Characleristics HDSP-2310/2311/-2312
(TA = _55 0 C to +85 0 C)

5
COLUMN DRIVE INPUTS

Mechanical and
Thermal Considerations

Figure 5. Block Diagram of HDSP-2310/-2311/-2312

gestedfilter materials are provided in Figure 6. Additional
information on filtering and contrast enhancement can be
found in HP Application Note 1015.

The HOSP-2310 series displays are available in standard
ceramic dual-in-line packages. They are designed for
plugging into sockets or soldering into PC boards. The
packages may be horizontally or vertically stacked for
character arrays of any desired size. HOSP-2310 series
displays utilize a high output current IC to provide excellent readability in bright ambient lighting. Full power
operation (Vee = 5.25V, VB = 2.4V, VeOl = 3.5VJ with
worst case thermal resistance from IC junction to ambient
of 60 0 C/waU/device is possible up to ambient temperature
of 37" C. For operation above 37" C, the maxi mum device
dissipation should be derated linearly at 16.7 mW/ o C (see
Figure 2). With an improved thermal design, operation at
higher ambient temperatures without derating is possible.

Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning
processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is permissible.
Suggested solvents include Freon TF, Freon TE, Genesolv
01-15, Genesolv OE-15, and water.
PI~play
'Color

Power derating for this family of displays can be achieved
in several ways. The power supply voltage can be lowered
to a minimum of 4.75V. Column Input Voltage, VeOl, can
be decreased to the recommended minimum values of
2.4V for the HOSP-2310 and 2.75V for the HOSP-2311/
-2312. Also, the average drive current can be decreased
through pulse width modulation of VB.

Dim

,HOSP-2310
Std. Red

Pane!(!raphic
Polaroid HNCP37
OarkHed 63
3M Light Control
RUby Red 60
Film
Chgquers Red 118 Panelgraphic
P"~xiglass 2423
G,'ay 10

HDSP-2311
(Yellow)

PagllJgraphic

'!ifOSP-2312

Panelgraphlc
Ruby Red 60
Chequers Red 112

Yellow 27
Chequers Amber
107

(HER)

The HOSP-2310 series displays have integral glass windows. A front panel contrast enhancement filter is
desirable in most actual display applications. Some sug-

~~

~~
jl

1.6
1.'

~z

1.2

",,;;';....

1.0

~~

O.B

10:

0.6

o..~2

0.4

,,2

"0

"w
.;:

-t-.--

">

RlJjA '" 6O~CM/

>

. ,,

\-

~;:;

.,',

!'iOJA "50"CNr/ . /

U)

"oz

I

RfiJA "'40"'CNf~

°0

E

4.0

3.0

"3

2.0

~

1.0

>

\

HDSP-2312

v'

\

HO$P-231O

~
R:' -....;:

~

20

30

40

50

60

70

80

90 100

O
-60 -40 -20

0

20

Figure 2. Maximum Allowable Power
Dissipation vs. Temperalure

I-... :;:".

0

200

I

100

40

/ ' '7

60

80

J

HOSP-2310

/HDS?-2311/-2312

II

a
lOa 120 140

Figure 3. Relative luminous Intensity
vs. Temperature

8-55

""

3:)0

""
~

TJ (OC)

TA - AMBIENT TEMPERATURE _ °C

~

::"

r010

400

z

HDSP-23-11

."\, V

I

a
a

I·
I
--

~

w

0.2

Polaroid

HNCP10

500

1.B

w

Chequers Grey
105

Figure 6. Contrast Enhancement Filters

5.0

2.0

"' ....

Arribj'lN 2

19

V,
V,

2. DO NOT CONNECT OR uSE.
3. DIMENSIONS IN

4. UNLESS OTHERWISE

,

COLUMN 3

20

COLUMN 3

21

V"
V"

8
9

COLUMN 4

22

CLOCK

COLUMN 4

23

CLOCK

10

COLUMN 5

24

GROUND

11

COLUMN 5

25

GROUND

12

INT. CONNECTI 21 26
INT. CONNECTI 21 27

DATA IN
DATA IN

NO CONNECT

NO CONNECT

14

fo-I-~~-I--I--t~i~

L

NO CONNECT
COLUMN 1

"

,

FUNCTION, 11

I
2

1.27 MAX
\.05)

GLASS

26

EITHER piN OR 80TH

I1'm

5. LEAD MATERIAL IS
GOLD PLATED IRON

ALLOY,

48 I 57) ~
1 - -'4 'MAX
...............
-I

....J.......I

[INCHES!.

SPECIFIED, THE
TOLERANCE ON ALL
DIMENSIONS IS, 3!1 mm
j-.015INCHESJ

1.65(.065)
REF

I

i.....L

r- - - - - - - - - ~

t

I

6.25
(.251

.L.....-

0-1O'J

I

IMAGE PLANE

Absolute Maximum Ratings (HDSP-2450/-2451/-2452)
Storage Temperature Range, Ts ..... -65°C to +125°C
Maximum Allowable Package Dissipation
atTA=25°Cl'.2.31 ......................... 1.46 Watts
Maximum Solder Temperature 1.59 mm (0.063")
Below Seating Plane t < 5 sees ................ 260°C

Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB .............. . .. -0.5V to Vee
Column Input Voltage, VeOl ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TAll.21 .......... -55°C to +85°C

Recommended Operating Conditions (HDSP-2450/-2451/-2452)
Parameter
Supply Voltage
Data Out CUrrent, low State
Data Out Current. High State
Column Input Voltage. Column On HDSP-2450
Column Input Voltage. Column On HDSP-2451/2452/2453
Setup Time
Hold Time
Width 01 Clock
Clock Frequency
Clock Transition Time
Free Air Operating TemperatureHange 11.21

Symbol
Vee

Min.
..... 4.75

Nom.
5.0

Max.
5.25

Units
V
mA
mA
V
V
ns

1.6

10L

IOH
Veal
VeOl

fclock

2A
2.75
70
30
75
0

tTHL
TA

-55

t~etup

tnold
tw(CloCk)

-0.5
3.5

35
45
0

OS

4
4
1
1

1
1
1

115

MHz
ns
'C

3
200
85

Fig.

Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified)

fifistrlptiOn

Symbol
ICC

Supply Current

Column Current at any Column Input

ICOL

Column Current at any Column Input
VB, Clock or Data Input Threshold High
Va, Data InputThreshold Low
Clock Input Threshold Low
Input Current Logical 1
VB, Clock

leoL
VIH
VIL
Vil
IIH

Datal~

Input Current Logical 0

VB. Clock
Data In

Data Out Voltage
Power Dissipation Per Package"
Thermal Resistance IC
Junction-Io-Case

L
III

VOH
VOL

PD

Test Conditions
Vee = 5.25V
VClOCK = VOATA = 2.4V
All SR Stages =
Logical 1
Vee - 5.25 V
Veol = 3.5V
All SR Stages = logical 1

Min,

Typ!

MaK.

lif

Vs=OAV
Vs=2,4V

95

VB =OAV
Ve= 2.4V

= 5.25V. VIH = 2AV

Vee = 5.25V, VIL = OAV
Vee =4.75V. IOH = -0.5 mAo ICOL = 0 mA
Vce = 4.75V IOl = 1.6 mA, leol = 0 mA
Vee = 5.0V, VeoL = 3,5V, 17.5% DF
15 LEOs on per character, Va = 2.4V

ROJ-e

Leak Rate

2,4

I'A

520

20
10
-500
-250

08
0.6
80
40
-800
-400

mA
V
V
V
I'A
p.A
p.A

3A
0.2

0.4

4

I'A
V
V

0.78

W

2

20

°CIWI
Device

2

5xl0-a

'All typical values specified atVcc = 5.0V and TA = 25°C unless
otherwise noted.

mA

500

2.0

Fig.

mA

380

Vce=4.75V

Vee

Units

cc/sec

"Power dissipation per package with four chalacters illuminated.

Notes:
1. Operation above 85°C ambient is possible provided the IC
junction temperature, TJ, does not exceed 125°C.
2. The device should be derated linearly above 60° C at
22.2 mW/o C. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at

8-60

25° C/W per device. See Figure 2 for powerderatings based on
a lower thermal resistance.
3. Maximum allowable dissipation is derived from Vee =5.25V. VB
= 2.4V, Veol = 3.5V 20 LEOs on per character. 20% OF.

---------------------- -------

Optical Characteristics (continued)
STANDARD RED HDSP-2450

.. -.
Description
Pei\k Luminous Intensity pe,r l,.EDI4.81
(ctiaiacte(Average)" .'
,
PeakWaveli:mgth .'.
Dominant Wavelength!?1
.. '
YELLOW

'Symbol
IvPeak

'Min •. Typ;'

.i i '
Test Conditions.
Vee ~ 5.()V, VeoC"'" 3.5V.
Tj '" 25°CI 6 1, VB"" 2AV.

APEAK
Ad

'-

....

220

:.

:

.-....

Max.

370
:655
639 I:

.

units

Fig.

).lcd

3

om
nm

HDSP-2451

.-)'
' ' ' , .'
Description '.
Peak Luminouslhtensity perLED1 4 ,8i
! Character Average I
Peak Wavelength
Dominant Wavelengthls,7]

HIGH EFFICIENCY RED

Symbol
!vPeak
APEAK

Test conditions... -'
Vee,:," 5.0V, VeOL -:3.§V .
Tj "" 25~ C!6J, Va = zAV .
.' : : '

Ad

;Min. ,.Typ.'
850 . .1490

Max.

L

."~

'.-

Fig.
3

nm
nm

583
585

I

Units.
i).lCd

HDSP-2452

Description.' .,
!
, .. -Peak Luminous Intensity per LED14.81
_, (Character Average)
Peak Wavelength ..· ......
DominantWavelength{7j

,

Symbol:
: IvPeak '

Test Conditions
Vee:'; 5.0V, VCQL= 3.5V
T:i = 25"cI 6 1, Va.'" 2.4V

APEAK

"'.

-\d

,.

_:',•

,.

.:
'

.

Min.

Typl

850

. 1530

}.Lcd

.635.
626

11m
.nm

Max;

..

U:.. .

Units. Fig;

..

3

• All typical values specified at Vcc = 5_0V and TA = 25' C unless
otherwise noted_
"Power dissipation per package with four characters illuminated_
Notes:
4. The characters are categorized for luminous intensity with the
intensity category deSignated by a letter code on the bottom of
the package.
5. The HDSP-2451 is categorized for color with the color category designated by a number code on the bottom of the
package.
6. The luminous intensity is measured at TA = Tj = 25' C. No time
is allowed for the device to warm-up prior to measurement.

7. Dominant wavelength Ad. is derived from the CIE chromaticity
diagram, and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv 'cd/m2, = Iv ,Candela,/A ,Metre,2
Lv IFootiamberts) = 1flv ICandela)/A IFoot)2
A = 5.3 x 10-8 M2 = 5.8 x 10- 7 Foot 2

Electrical Description
The HDSP-2450 series of four character alphanumeric
displays have been designed to allow the user maximum
flexibility in interface electronics design. Each four
character display module features Data In and Data Out
terminals arrayed for easy PC board interconnection. Data
Out represents the output of the 7th bit of digit number 4
shift register. Shift register clocking occurs on the high to
low transition of the Clock input. The like columns of each
character in a display cluster are tied to a single pin.
Figure 5 is the block diagram for the displays. High true
data in the shift register enables the output current mirror
driver stage associated with each row of LEOs in the 5x7
diode array.
The TTL compatible VB input may either be tied to Vcc for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power
consumption.
The normal mode of operation input data for digit 4, column
1 is loaded into the 7 on-board shift register locations 1
through 7. Column 1 data for digits 3, 2, and 1 is similarly
shifted into the display shift register locations. The column 1
input is now enabled for an appropriate period of time, T. A
similar process is repeated for columns 2, 3, 4 and 5. If the

8-61

time necessary to decode and load data into the shift register
is t, then with 5 columns, each column of the display is
operating at a duty factor of:
D.F.= _ _
T_
5 (t+T)
Thetime frame, t + T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to aChieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:
1/[5 x (100)] =.2 msec
If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t«T. Forshort display strings, the duty
factor will then approach 20%.
For further applications information, refer to HP Application Note 1016.

CLOCK

-I f.

2.4V

-'THl

SERIAL
DECODED
DATA
INPUT

CLOCK

O.4V

SERIAL
DECODED
DATA
OUTPUT

2.4V
DATA IN

O.4V

2.4V

BLANKING.
CONTROL

DATA OUT

O.4V

Parameter
fc,oo:.k

Condillon Min. Typ. Max. Unhs

CLOCK Rate

3

MH<

125

ns

tf'!u. tJ'lfl

Propagation

C, "" 1SJlF

delay CLOCK
to DATA OUT

R~""2

4KO

Figure 1. Switching Characteristirs HDSP-2450/-2451/-2452
(TA ~ -55 0 C to +85 0 C)

5
COLUMN DRIVE INPUTS

Figure 5. Block Diagram of HDSP-2450/-2451/-2452

Mechanical and
Thermal Considerations

provided in Figure 6. Additional information on filtering and
contrast enhancement can be found in HP Application Note
1015.

The HDSP-2450 series displays are available in standard
ceramic dual-in-line packages. They are designed for plugging into sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character arrays
of any desired size. HDSP-2450 series displays utilize a high
output current IC to provide excellent readability in bright
ambient lighting. Full power operation (Vee = 5.25V, VB =
2.4V, VeOl = 3.5V) with worst case thermal resistance from
IC junction to ambient of 45° C/wattldevice is possible up to
ambient temperature of 60°C. For operation above 60° C, the
maximum device dissipation should be derated linearly at
22.2 mW/oC (see Figure 2). With an improved thermal
design, operation at higher ambient temperatures without
derating is possible.

Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning
processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is permissible.
Suggested solvents include Freon TF, Freon TE, Genesolv
DI-15, Genesolv DE-15, and water.
Display
Color

Dim

Panelgraphic
Polaroid HNCP37
Dark Red 63
3M Light Control
Ruby Red 60
Film
Cheque,s Red 118 Panelgraphic
Plexiglass 2423
Gray 10

HDSP-2451
(Yellow)

Panelgraphic
YeiJow 27
Chequers Amber
107

HDSp·2452
(HER)

Panelgraphic
Ruby Red 60
Chequers Red 112

The HDSP-2450 series displays have glass windows. A front
panel contrast enhancement filter is desirable in most actual
display applications. Some suggested filter materials are

~~1

0

1.4

-'z

1.2

~:

1.0

,,0
"'"

O.B

~Q

1'iiij
x_
IW

ce~

4.0

3.0

2.0

0.6
1.0

0.4

~

1\

\

ill

V

1\
"- ......

R

~n'24i
~~

~

'"'""
"z

"83

1

"~

-.

I

20

30

40

50

60

70

80

90 100

TA - AMBIENT TEMPERATURE -"C

Figure 2. Maximum Allowable Power
Dissipation vs. Temperature

0
-60 -40 -20

0

20

40

60

80 100 120 130

TJ lOCI

Figure 3. Relative Luminous Intensity
vs. Temperature

8-62

I

HO$P 2450
T

:II

0

7 HDSP....14&lJ-Z452
J

200

100

I"""
10

,. ?

1400

>-

I/HOSP-2:452

0.2

00

Polaroid
HNCP10

500

1.B
1.6

Chequers Grey
105

Figure 6. Contrast Enhancement Fillers

5.0

2.0

Bright

HDSP-2450
Std. Red

Power derating forthis family of displays can be achieved in
several ways. The power supply voltage can be lowered to a
minimum of 4.75V. Column Input Voltage, VeOl, can be
decreased to the recommended minimum values of 2.4V for
the HDSP-2450 and 2.75V for the HDSP-2451/-2452. Also,
the average drive current can be decreased through pulse
width modulation of VB.

~~

Ambient liahllng
Moderate

0

I

r

I

~

1.0

2.0

3.0

4.0

VeOl -COLUMN VOLTAGE - VOLTS

Figure 4. Peak Column Current vs.
Column Voltage

5.0

Part Marking System

High Reliability Testing
Two standard reliability testing programs are available. The
TXVB program is in conformance with Quality Level A of
MIL-D-87157 for hermetically sealed LED displays with
100% screening tests. A TXVB product is tested to Tables I,
II, lila, and IVa. The TXV program is an HP modification to
the fu II conformance prog ram and offers the 100% screeni ng
of Quality Level A, Table I, and Group A, Table II.

Standard Product

With Table I and II

With Tables
1,II,IIIa,IVa

HDSP-2450
HDSP-2451
HDSP-2452

HDSP-2450 TXV
HDSP-2451 TXV
HDSP-2452 TXV

HDSP-2450 TXVB
HDSP-2451 TXVB
HDSP-2452 TXVB

100% Screening
Table I. Quality Level A of MIL-D-87157

Test Screen
1. Precap Visual

Method

-

Conditions
HP Procedure 5956-7512-52, based on
MIL-STD-883B

2. High Temperature Storage

MIL-STD-750
Method 1032

TA = 125° C, Time = 24 hours

3. Temperature Cycling

MIL-STD-750
Method 1051

Condition B, 10 cycles

4. Constant Acceleration

MIL-STD-750
Method 2006

10,000 G's at V, orientation

5. Fine Leak

MIL-STD-750
Method 1071

Condition H

6. Gross Leak

MIL-STD-750
Method 1071

Condition C

7. Interim Electrical/Optical Testsl 2j

8. Burn-In

9. Final Electrical Testl 2 1
10. Delta Determinations

11. External Visual

-

Icc (at VB = OAV and 2AV), leOl (at VB =
OAV and 2AV)
IIH (VB, Clock and Data In), ilL (VB, Clock
and Data In), IOH, IOL
and Iv Peak. VIH and Vil inputs are
guaranteed by the electronic shift
register test. T A = 25° C

MIL-STD-883
Method 1015

Condition B at Vee = VB = 5.25V, VeOl =
3.5V, TA = +85°C,
LED ON-Time Duty Factor = 5%,35 dots
On; t = 160 hours

-

Same as Step 7
.:lIce = ±6 mA, ~IIH (clock) = ±8 p.A,
.:lIlH (Data In) =±5 p.A
.:lIOH = ±50 p.A, and .:llv = -20%,
TA = 25°C

MIL-STD-883
Method 2009

Notes:
1. MIL-STD-883 Test Method Applies .
.
2. Limits and conditions are per the electrical optical characteristics. The 10H and 10L tests are the inverse of VOH and VOL specified in the
electrical characteristics.

8-63

--------_._---_ ... _ - - _ . _ - - - - - - - _ .

Table II. Groul? A Electrical Tests - MIL-D-87157
Subgroup/Test

Parameters

Subgroup 1
DC Electrical Tests at 25°CI1I

LTPD

Icc (at Vs = O.4V and 2.4V,I, ICOl
(at Vs = O.4V and 2.4VI

5

IIH (VB, Clock and Data In), III (Vs, Clock and Data
In), IOH, IOl Visual Function and Iv peak. VIH and Vil
inputs are guaranteed by the electronic shift
register test.
Subgroup 2
DC Electrical Tests at High
Temperaturel 1 1

Same as Subgroup 1, except delete Iv and visual
function, TA = +85°C

7

Subgroup 3
DC Electrical Tests ilt Low
Temperaturel 1 1

Same as Subgroup 1, except delete Iv and visual
function, T A = -55° C

7

Satisfied by Subgroup 1

5

Subgroup 4, 5, and 6 not tested
Subgroup 7
Optical and Functional Tests at 25° C
Subgroup 8
External Visual

7

Note:
1. Limits and conditions are per the electrical/optical characteristics. The IOH and IOL tests are the inverse of VOH and VOL specified in the electrical characteristics.

Table ilia. Group B, Class A and B of MIL-D-87157
Subgroup/Test
Subgroup 1
Resistailce to Solvents

Internal Visual and Mechanical

MIL-STD-750
Method

Conditions

4 Devices!
o Failures
1 Device/
o Failures

1022
2075

Subgroup 2[1,2)
Solderability

2026

TA

Subgroup 3
Thermal Shock (Temp. Cycle)
Moisture Resistancel 31
Fine Leak

1051
1021
1071

Condition 81, 15 Min. Dwell

Gross Leak
Electrical/Optical Endpointsl 41

Subgroup 4
Operati ng Life Test (340 h rs, )

Electrical/Optical Endpointsl 41
Subgroup 5
Non-operating i Storage) Life
Test (340 hrs.)

Electrical/Optical Endpointsl 4 1

Sample Size

245 0 C for 5 seconds

LTPD = 15
LTPD

= 15

Condition H
Condition C

1071

-

Icc (at VB =OAV and 2.4VI,
ICOL (at VB =O.4V and 2.4VI,
IIH (Vs, Clock and Data Inl, III (Vs,
Clock and Data In), IOH, IOL Visual
Function and Iv peak. VIH and VIL
inputs are guaranteed by the electronic
shift register test. TA = 25°C

1027

TA = +85°C at Vee = VB = 5.25V.
VeOl 3.5V, LED ON-Time Duty Factor =5%. 35 Oats On

-

LTPD = 10

Same as Subgroup 3

1032

TA=+125°C

-

LTPD = 10

Same as Subgroup 3

Notes:
1.
2.
3.
4.

Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
The L TPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads required.
Initial conditioning should be a 15° bent inward one cycle.
Limits arld conditions are per the electrical/optical characteristics. The IOH and IOl tests are the inverse of VOH and VOL specified in the electrical characteristics.

8-64

Table IVa. Group C, Class A and B of MIL-D-87157

Subgroup/Tesl
Subgroup 1
Physical Dimensions

MIL-STD-750
Melhod

Conditions

Sample Size
2 Devices/
Failures

2066

o

Subgroup 2[2,7]
Lead Integrity

2004

Condition B2

Fine Leak

1071

Condition H

Gross Leak

1071

Condition C

2016

1500G, Time = 0.5 ms, 5 blows in
each orientation Xl, Yl, Z1

Subgroup 3
Shock
Vibration, Variable Frequency
Constant Acceleration
External Visual1 41
Electrical/Optical Endpointsl 81

LTPD=15

2056
2006

10,000G at Y1 orientation

1010 or 1011

-

Icc (at VB = OAV and 2AV)
leol (at VB = OAV and 2AVi
IIH (VB, Clock and Data In)
ilL (VB, Clock and Data In!
IOH, IOL, Visual Function and Iv peak.
VIH and Vll inputs are guaranteed by
the electronic shift register
test. TA = 25°C.

Subgroup 4[1,3]
Salt Atmosphere
External Visual1 4:

10100r1011

Subgroup 5
Bond Strength lSI

2037

Condition A

Subgroup 6
Operating Life Testl 6 1

1026

TA = +85°C at Vee = VB = 5.25V,
VeOl = 3.5V, 35 Dots On

Electrical/Optical Endpointsl 81

LTPD = 15

1041

-

LTPD=15

LTPD = 20
(C=GI

A = 10

Same as Subgroup 3

Noles:
1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C life test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both
Group B ar.d Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics. The 10H and 10L tests are the inverse of VOH and VOL specified in the
electrical characteristics.

8-65

Flidl

DUAL CHANNEL
HERMETICALLY
SEALED
OPTOCOUPLER

HEWLETT

~~ PACKARD

6N134

TECHNICAL DATA

DATEC(lPE

JANUARY 1986

OUTLINE DRAWING*
TYPE 1-. v. vel

hpVYWWXX

IT

6.13 '.320)

1.,br-r-.,-.!;:::;:::;:6::rN;;'3;::4:r:;:~=-=LI·
PIN

1IOENrIFI~R

NOTE:
A .01 TO O.1,uF BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS 15 AND 10.

10
GND

Features
• PERFORMANCE GUARANTEED OVER _55 0 C TO
+1250 C AMBIENT TEMPERATURE RANGE
•
•
•
•
•
•

HERMETICALLY SEALED
HIGH SPEED
TTL COMPATIBLE INPUT AND OUTPUT
HIGH COMMON MODE REJECTION
DUAL-IN-LINE PACKAGE
1500 VDC WITHSTAND TEST VOLTAGE

OIMENStQN$ IN MfLUMETERS AND lINCHES).

Recommended Operating
Conditions

• EIA REGISTRATION
• HIGH RADIATION IMMUNITY

Applications
•
•
•
•
•
•

TABLE I

Logie Ground Isolation
Line Receiver
Computer - Peripherallnteriace
Vehicle Command/Controllsolation
Harsh Industrial Environments
System Test Equipment Isolation

Sym.

Min.

Max.

Units

IFL

0

250

p.A

IFH

12.St

20

mA

Vec

4.5

5.5

V

-55

125

Input Current. Low Level
Each Channel
Input Current, High Level
Each Channel
Supply Voltage

Description

Fan Ovt (TTL Load)
Each Channel

The 6N134 consists of a pairof inverting optically coupled
gates, each with a light emitting diode and a unique high
gain integrated photon detector in a hermetically sealed
ceramic package. The output of the detector is an open
collector Schottky clamped transistor.
This unique dual coupler design provides maximum DC and
AC circuit isolation between each input and output while
achieving TTL circuit compatibility. The isolator operational
parameters are guaranteed from -55°C to +125°C, such that a
minimum input current of 10 mA in each channel will sink a six
gate fanout (10 mAl at the output with 4.5 to 5.5 V Vee applied
to the detector. This isolation and coupling is achieved with a
typical propagation delay of 55 nsec.

Operating Temperature

N

TA

6
DC

Absolute Maximum Ratings*

Hewlett-Packard's high reliability part type 8102801 EC meets
Class B testing requirements of MIL-STD-883. This part is the
recommended and preferred device from the 6N134 product
family for use in high reliability applications. Details of the
8102801 EC test program may be seen in the data sheet for this
part.
See the selection guide at the front of this section for other
devices in this family.

(No derating required up to 125°C)
Storage Temperature ................. -65°C to +150°C
Operating Temperature ............... _55°C to +125°C
Lead Solder Temperature. . . . . . . . . . . . . . .. 260°C for lOs
(1.6mm below seating plane)
Peak Forward Input
Current (each channel) ....... 40 mA (,,;;;; 1 ms Duration)
Average Input Forward Current (each channel) ..... 20 mA
Input Power Dissipation (each channel) ........... 35 mW
Reverse Input Voltage (each channel) . . . . . . . . . . . . . . .. 5V
Supply Voltage - Vcc ........... 7V (1 minute maximum)
Output Current - 10 (each channel) ... . . . . . . . . . .. 25 mA
Output Power Dissipation (each channel) . . . . . . . . .. 40 mW
Output Voltage - Vo (each channel) . . . . . . . . . . . . . . . .. 7V
Total Power Dissipation (both channels) ......... 350 mW

*JEDEC Registered Data

8-66

t12.5 rnA condition permits at least 20% eTR degradation
guardband. Initial switching threshold is 10mA or less.

----------------------------------- -------

TABLE II

Electrical Characteristics
= -55°C TO +125°C)

OVER RECOMMENDED TEMPERATURE (T A

P~ramet~r

SYmbol

Min. 11f ITyp.**ltl'l\1Iill<.

Units

High Level Supply Curr~ht

UNLESS OTHERWISE NOTED
Test C~nditions

Figure

Note

Vee ='ii.~~§V, IF = 0
. . . (Both Channels)

Input-Output Insulation
Leakage"Current

1.0

pA

VI_a= 1500Vdc,
Relative Humidity = 45%
TA = '25°C, t= 5s

2,10

tpLH *
Propagation Del ay Time to
High Output Level
t-::'-tP-"L.'"'H--l

60

90

ns

CL.=15pF RL. =510Q
CL-50pF IF=13mA, TA=25°C

2,3

1,5

Propagation Delay Tim'e to l--ctpC-'H-,-,L.""*-j
Low Output Level
tpHL.

55

100
90
100

ns

CL. =15pF RL. =510Q
CL.=50pF !p"13mA, TA=25°C

2,3

1,6

""All typical values are at Vee

TABLE III

Typical Characteristics
Parameter
Input Capacitance

Symbol

AT TA
Min.

= 25°C, Vee = 5V
Typ.

Max.

EACH CHANNEL

Units

CIN

60

pF

Input Diode Temperature
Coefficient

AVF
-ATA

-1.5

mV;oC

Resistance (Input-Output)

RI-O

1012

Capacitance (Input-Output)

CI-O

1.7

11-1

0.5

nA

Input-Input
Leakage Cu rrent

=5V, TA = 25°e

Test Conditions

Figure

Note

VF = 0, f= lMHz

1

IF" 20mA

1

Q

VI-O = 500V

3

pF

f= lMHz

3

Relative Humidity" 45%
VI_I = 9,00V, t" 55

4

-

Resistance (lnput-!nput)

RI_I

10 12

Q

VI-! '" 500V

4

Capacitance (I nput-I nput)

CI_I

0.55

pF

f= lMHz

4

Output Rise Time (10-90%)
Output Fall Time (90-10%)

tr

tf

35
35

ns
ns

RL = 51 an, CL = 15pF
IF" 13mA

1

Common Mode
Transient Immunity
at High Output Level

CMH

100

Vips

VCM = 10V (peak),
Vo (min.) = 2V,
RL '" 5lan, IF" OmA

6

1,7

Gommon Mode
Transient Immunity
at Low Output Lel/el

CML.

-400

Vips

VCM = 10V (peak),
Vo (max.) '" 0.8V
RL = 51an, IF" 10mA

6

1,8

NOTES:
1. Each channel.
2. Measured between pins 1 through 8 shorted together and pins 9 through 16 shorted
together.
3. Measured between pins 1 and 2 or5 and 6 shorted together,'and pins 10, 12, 14 and
15 shorted together.
4. Measured between pins 1 and 2 shorted together, and pins 5 and 6 shorted together.
5. The tPLH propagation delay is·measured from the 6.5 rnA point on the trailing edge of
the input pulse to the 1.5V point on the trailing edge of the output pulse.
6. The tPHL propagation delay is measured from the 6.5 rnA point on the leading edge
of the input pulse to the 1.5V point on the leading edge of the output pulse.

*JEDEC Registered Data

7. CMH is the max. tolerable common mode transient to assure that the output will
remain in a high logic state (i.e., Va> 2.0VI.
B. CML is the max. tolerable common mode transient to assure that the output will
remain in a low logic state (i.e., Va <: 0.8V).
9. It is essential that a byass capacitor C01 to 0.1 }JF. ceramic) be connected from pin 10
to pin 15. Total lead length between both ends of the capacitor and the isolator pins
should not exceed 20mm.
10. This is a momentary withstand test, not an operating condition.

8-67

16

~~~------~--~5V
Rl

L--ji--o Vo

"

INPUT

E
I

MONITORING
NODE

47H

1E

cr:
cr:

::>

o

c

cr:

~cr:
~

·CL INCLUDES PROBE AND STRAY WIRING CAPACITANCE.

I

I,~PUT
1.50

J-----\---

---

-1

V F - FORWARD VOLTAGE - VOLTS

~~TPUT

tPH L

IF"13mA

IF"6.5mA

--..j tPLH r"--

f.-

I

I_____
~
I _______

VOH
.
1 SV

- - - - - VOL

Figure 1. Input Diode Forward Characteristic

Figure 2. Test Circuit for tpHL and tpLH*

16
+.,.............,r-----~---o+5V

100

TA-2S"C

RL' 510U.LflL "'4kfi - - - -

Rl

Vcc"5V
BO

~

0

" ----x::: --........
r-........ ....

60

2

0

;::

"";t

-- W

.-- f-- f-- ...-V

>

40

~

L...---

"~

20

Hl

~

6

10

12

14

1B

16

5

'i-----i-----ft--\:,.-\'p.-="-t-----t-----j

I

OO~====~====~~~~~~~~~,~O~~~12

o

20

§

IF" PULSE INPUT CURRENT· rnA

5.0V

.2S"C

I------I----II--T-\-j;,- 5iOii -+----+-----1

~

o

D

1-----I---.:;:~k_----t_----t_-rA '"

I

tpHt

IF - INPUT DIODE FORWARD CURRENT - rnA

Figure 4. Input-Output Characteristics

Figure 3. Propagation Delay, tpHL and tPLH
vs. Pulse Input Current, IFH

16

120

t;~"4r----r-o+5V

"'' M]

vcc"SV

AL -5100

100

>

~

0
2

BO

---

/

/

0

;::

"";t0
g:

60

....-r"

40

V
k'

/
11

,/'

GNO+,~O~-~-------O

1:PI"H.

'/

fplH
PULSE GEN.

20

VCM
-40

-20

20

40

60

80

100

120

-=

OV
5V

Vo
TA - TEMPERATURE .. °C

Vo

Figure 5. Propagation Delay vs. Temperature
*JEDEC Registered Data

Vo
VOL

__________-JI\~________~IF~"_'~O~m~A~________

(max,)

Figure 6. Typical Common Mode Rejection Characteristics/Circuit

8-68

g~02801~

TECHNICAL DATA

NOTE:
A.O' TO O.1J.,F BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS 15 AND 10.

JANUARY 1986

10

'-----'--+---0

GND

Features
• RECOGNIZED BY DESC·
• HERMETICALLY SEALED
• MIL-STD-883 CLASS B TESTING

11
GNO

10

DIME.NSIONS IN MILLIMETERS AND (INCHES).

• HIG.H SPEED
• PERFORMANCE GUARANTEED OVER -55° C TO
+125°C AMBIENT TEMPERATURE RANGE
• TTL COMPATIBLE INPUT AND OUTPUT
• DUAL-IN-LiNE PACKAGE
• 1500 VDC WITHSTAND TEST VOLTAGE
o HIGH RADIATION IMMUNITY

six gate fanout (10 mAl at the output with 4.5 to 5.5 V Vee
applied to the detector. This isolation and· coupling is
achieved with a typical propagation delay of 55 nsec.
The photo ICs used in this device are less susceptible to
radiation damage than PIN photo diodes or photo transistors due to their relatively thinner photo region.

Applications

The test program performed on the 8102801 EC is in compliance with DESC drawing 81028 and the provisions of
Method 5008, Class B of MIL-STD-883.

• MILITARY/HIGH RELIABILITY SYSTEMS
• LOGIC GROUND ISOLATION
o LINE RECEIVER

ReCOmmended Operating
Conditions
Supply Voltage

o COMPUTER -

PERIPHERAL INTERFACE
• VEHICLE COMMAND/CONTROL ISOLATION
• SYSTEM TEST EQUIPMENT ISOLATION

Description
The 8102801 EC isthe DESC selected item drawing assigned
by DOD for the 6N134 optocoupler which is in accordance
with MIL-STD-883 class B testing. Operating characteristic
curves for this part can be seen in the 6N134 data sheet.
The 8102801 EC consists of a pair of inverting optically
coupled gates, each with a light emitting diode and a unique
high gain integrated photon detector in a hermetically
sealed ceramic package. The output of the detector is an
open collector Schottky clamped transistor.
This unique dual coupler design provides maximum DCand
AC circuit isolation between each input and output while
achieving TTL circuit compatibility. The isolator operational
parameters are guaranteed from -55° C to +125° C, such that
a minimum input current of 10 mA in each channel will sink a

••••.•...•..•••••• 4.5 V dc minimum to
5.5 V dc maximum
High Level Input Currentl1l •••.•.. 12.5 mA dc minimum
(each channel)
Low Level Input Current .......... 250 p.A dc maximum
(each channel)
Normalized Fanout (TTL Load) ....•......• 6 maximum
(each channel)
Operating Temperature Range ....•.. -55° C to +125° C
1.. This condition permits at least 20 percent hF (CTR) degradation.
The initial switching threshold is 10 rnA dc or less.

Absolute Maximum Ratings
Supply Voltage Range •.•..•... 7 V <1 minute maximum)
Input Current (each channel) ................ 20 mA dc
Storage Temperature Range ......... -65°C to +150°C
Maximum Power Dissipation (both channels) .•. 350 mW
Lead Temperature
(soldering 10 seconds) ...•...... 300°C for 10 seconds
<1.6 mm below seating plane)
Junction Temperature (TJ) ........•............ 175°C

'Defense Electronic Supply Center !DESC) is an agency of the Department of Defense !DODI.

8-69

100% Screening
MIL-STD-883, METHOD 5004 (CLASS B DEVICES)
Test Screen
1. Precap Internal Visual
2. High Temperature Storage

Method
2017
1008

3. Temperature Cycling
4. Constant Acceleration
5. Fine Leak
6. Gross Leak
7. Interim Electrical Test
8. Burn-In

1010
2001
1014
1014

-

1015

Condition C, TA= 150·C,
Time .. 24 hours minimum
Condition C, -65°C to +150·C, 10 cycles
Condition A, 5KG's, Yl axis only
Condition A
Condition C
Optional
Condition B, Time = 160 hours minimum
TA =+125°C, Vce = 5.5V, IF = 20 mA,
10 25 mA (Figure 1)
Group A, Subgroup 1,5% PDA applies
Group A, Subgroup 2
Group A, Subgroup 3

=

-

9. Final Electrical Test
Electrical Test
Electrical Test
10. External Visual

Conditions

2009

Quality Conformance Inspection
GROUP A ELECTRICAL PERFORMANCE CHARACTERISTICS
Limits

Group A
Subgroups[6]

Min.

Max.

Unit

Vee = 5.5 V; IF =: 10 mAil I;
IOL=10mA

1,2,3

-

0.6

V

hF(CTR)

Vo = 0.6 V; IF= 10 mA;1 1 1
Vee=5.5V

1,2.3

100

-

Ok

10H

Vee =: 5.5 V; Vo"" 5.5 V1 1 1;
IF=250 pA

1,2.3

-

250

pAde

High Level Supply Current

leCH

Vee" 5.5 V; IFl

1,2,3

28

mAde

Low Level Supply Current

leol

Vee

1,2.3

36

mAde

Input Forward Voltage

VF

IF =20 mAil 1

Test

Symbol

Conditions

Low Level Output Voltage

VOL

Current Transfer Ratio
High Level Output Current

Input Reverse Breakdown
Voltage
Input to Output
Insulation Leakage
Current
Capacitance Between
Input/Output

= IF2 "" 0 mA
= 5.5 V; IFl = IF2 "'" 20 mA

1,2

-

1.75

3

-

1.85

Vdc

VeR

IR= 10 /LA111

1,2,3

5.0

-

Vdc

It-o

VIO = 1500 V det21;
Relative Humidity =: 45 percent
t= 5 seconds

1

-

1.0

pAde

4.0

pF

CI-O

f=1 MHz;Te "'25"CI 3 1

4

Propagation Delay Time,
Low to High Output Level

tPLH

Rl = 5100; CL = 50 pFll, 41;
IF= l3mA

9
10,11

Propagation Delay Time,
High to Low Output Level

tPHl

RL =5100; CL=50 pFI1,51;
IF= 13mA

10,11

9

RL=510 0111;
CL=50 pF;
IF = 13 mA

9,10,11

CMH

VOM =; 10 V (peak);111
Vo = 2 V (minimum);
RL =510 n;
IF=OmA

CML

VOM"'" 10 V (peak);111
Vo = 0.8 V (maximum);
Rl=510 0;
IF= 10 mA

Output Rise Time

tLH

Output Fall Time

tHL

Common Mode Transient
Immunity at High
Output Level
Common Mode TranSient
I mmunity at Low
Output Level
See notes on followong page.

8-70

-

-

-

100
140
100

ns

ns

120
90

-

40

ns

g, 10, 11

40

-

VIpS

g. 10, 11

-60

-

VIps

Notes: 1. Each channel.
2. Measured between pins 1 through 8 shorted together and pins 9 through 16 shorted together.
3. Measured between input pins 1 and 2, or 5 and 6 shorted together and output pins 10,12,14 and 15 shorted together.
4. ThetpLH propagation delay is measured from the6.5 rnA pointon the trailing edge olthe input pulseto the 1.5 V point on the trailing
edge of the output pulse.
5. ThetpHL propagation delay is measured from the6.5 rnA point on the leading edge of the input pulse tothe 1.5 V point on the leading
edge olthe output pulse.
6. Conditions of Group A subgroups may be seen in the High Reliability section of this catalog.
7. This is a momentary withstand test, not an operating condition.

GROUP B TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test

Conditions

Method

Subgroup 1
Physical Dimensions (Not required if
Group D is to be performed)
Subgroup 2
Resistance to Solvents
Subgroup 3
Solderability
(L TPD applies to number of leads
inspected - no fewer than 3 devices
shall be used).
Subgroup 4
Internal Visual and Mechanical
Subgroup 5
Bond Strength
Thermocompression:
(Performed at precap, prior to seal
L TPD applies to number of bond
pulls from a minimum of 4 devices).
Subgroup 6
Internal Water Vapor Content
(Not applicable - does not contain
desiccant)
Subgroup 7
. Fine Leak
Gross Leak

2016

2 Devices
(0 failures)
4 Devices
(0 fai Iu res)

2015
2003

Soldering Temperature of 245
for 10 seconds

± 5° C

15
(3 Devices)

1 Device
(0 failures)

2014

2011

Test Condition D

-

15
(4 Devices)

-

1014

Subgroup 8*
Electrical Test

Electrostatic Discharge Sensitivity

LTPD

Condition A
Condition C

5

Group A, Subgroup 1, except Ii-o

15

3015

Electrical Test
'(To be performed al initial qualification only)

Group A, Subgroup 1

GROUP C TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test
Subgroup 1
Steady State Life Test

Method

Conditions

Condition B, Time = 1000 hours total
TA = +125°C, Vee = 5.5 V,
IF = 20 mA, 10 = 25 mA (Figure 1)

1005

5

Group A, Subgroup 1, 2, 3

Endpoint Electricals at 1000 hours
Subgroup 2
Temperature Cycling

LTPD

1010

Condition C, -65°C to +150°C,
10 cycles

Constant Acceleration

2001

Condition A, 5KGs, Y1 axis only

Fine Leak

1014

Condition A

Gross Leak

1014

Condition C

Visual Examination

1010

Per Visual Criteria of Method 1010

Endpoint Electricals

Group A, Subgroup 1,2,3

8-71

15

GROUP D TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test

LTPD

Conditions

Method

Subgroup 1
Physical Dimensions

2016

Subgroup 2
Lead Integrity

2004

Test Condition 82 (lead fatigue)

15

Subgroup 3
Thermal Shock

1011

Condition B, (-55°C to +125°C)
15 cycles min.
Condition C, (-65°C to +150"C)
100 cycles min.

15

Temperature Cycling

1010

Moisture Resistance
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals

1004
1014
1014

Subgroup 4
Mechanical Shock

15

Condition A
Condition C
Per Visual Criteria of Method 1004
Group A, Subgroup 1,2,3
Condition B, 1500G, t = 0,5 ms,
5 blows in each orientation
Condition A
Condition A, 5KGs, Y1 axis only
Condition A
Condition C
Per Visual Criteria of Method 1010
Group A, Subgroup 1, 2, 3

15

1009
1014
1014
1009

Condition A min.
Condition A
Condition C
Per Visual Criteria of Method 1009

15

1018

5000 ppm maximum
water content at 100° C.

2002

Vibration Variable Frequency
Constant Acceleration
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals

2007
2001
1014
1014
1010

SubgroupS
Salt Atmosphere
Fine Leak
Gross Leak
Visual Examination
Subgroup 6
I nternal Water Vapor
Conlent

Subgroup 7
Adhesion of Lead Finish
Subgroup 8
Lid Torque
(not applicable - solder seaD

2025

15

2024

5 Devices
(0 fail u res)

Voe

Vee

+5.5 V

+5.5 V
200n

200n

1
-2
-3
-4
5
>---- 6

16 t15r-14

-7

lOr--

13

t-

200 n
200n

12

111-

-8
V,N
5.3 V

3 Devices
(0 failures)
5 Devices
(1 failure)

.Ol.uF

91-

TA == +125°C

+I-

J.

-=

Figure 1. Operating Circuit for Burn-in and Steady State Life Tests.

8-72

-------------------------------

DUAL GHAl\lNEl
LINE R,E6EIVE,R
HERMETIC
OPTOGOUPlE'R

r/i~ HEWLETT

~~ RACKARD

HCPL~1930

HCPL-1931
(8838)

TECHNICAL DATA

OUTLINE DRAWING

SCHEMATIC

:~~J
I"

JANUARY 1986

OATECODEj

I

15

Vee

14

VEl

[[
..

4
BASE 1

5!f1

--1
7.29 C287)

7.87 1.310)

~l

-

16

Va,

1-'---_--+-_ _ _----'

6_
+I,

GND

I"

TRUTH TABLE
8
BASE 2
A 0.01 TO 0.1 /IF BYPASS
CAPACITOR MUST BE
CONNECTED BETWEEN
PINS 10 AND 15 (See Note 11.

(Positive Logic)
lnput

Enahlc

H
L

H

H

H

1.090)
\_ M
2.791.110}

Output
L

-:f r

11____

--I

3.811.1501
MIN.

H
H
H

0.51 1.02QI
MAX.

DIMENSIONS IN MILLIMETERS AND (INCHES).

Features

Applications

• HERMETICALLY SEALED

• MILITARY/HIGH RELIABILITY SYSTEMS

• MIL-STD-883 CLASS B TESTING

• ISOLATED LINE RECEIVER
• SIMPLEX/MULTIPLEX DATA TRANSMISSION

• HIGH SPEED - 10Mb/s
• PERFORMANCE GUARANTEED OVER _55 0 C
TO +125 0 C AMBIENT TEMPERATURE RANGE

• MICROPROCESSOR SYSTEM INTERFACE

• ACCEPTS A BROAD RANGE OF DRIVE
CONDITIONS

• DIGITAL ISOLATION FOR A/D, D/A
CONVERSION

• LINE TERMINATION INCLUDED

• CURRENT SENSING
o INSTRUMENT INPUT/OUTPUT ISOLATION

• COMPUTER-PERIPHERAL INTERFACE

• INTERNAL SHIELD PROVIDES EXCELLENT
COMMON MODE REJECTION

o GROUND LOOP ELIMINATION

• EXTERNAL BASE LEAD ALLOWS "LED
PEAKING" AND LED CURRENT ADJUSTMENT

• PULSE TRANSFORMER REPLACEMENT

• 1500 Vdc WITHSTAND TEST VOLTAGE
• HIGH RADIATION IMMUNITY

Description
The HCPL-1930 and HCPL-1931 units are dual channel,
hermetically sealed, high CMR, line receiver optocouplers.
The products are capable of operation and storage over the
full military temperature range and can be purchased as
either a standard product (HCPL-1930) or with full MILSTD-883 Class Level B testing (HCPL-1931). Both products
are in sixteen pi n hermetic dual in-Ii ne packages.

8-73

Each unit contains two independent channels, consisting of
a GaAsP light emitting diode, an input current regulator, and
an integrated high gain photon detector. The input regulator
serves as a line termination for line receiver applications. It
clamps the line voltage and regulates the LED current so
line reflections do not interfere with circuit performance.
(Continued on next page)

The regulator allows a typical LED current of 12.5 mA
before it starts to shunt excess current. The output of the
detector IC is an open collector Schottky clamped transistor.
An enable input gates the detector. The internal detector
shield provides a guaranteed common mode transient
immunity specification of ±1000 Vlp.sec.
DC specifications are compatible with TTL logic and are
guaranteed from "55°C to +125°C allowing trouble free
interfacing with digital logic circuits. An input current of

10 mA will sink a six gate fan-out (TTL) at the output with a
typical propagation delay from input to output of only
45nsec.
CAUTION: The small junction sizes inherent to the design
of this bipolar component increases the component's
susceptibility to damage from electrostatic discharge (ESD).
It is advised that normal static precputions. be taken in
handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.

Recommended Operating
Conditions (EACH CHANNEL)

Absolute Maximum Ratings

Sym,

Min.

Max.

I,L

0

250

p.A

12.5

60
5.5

mA

Supply Voltage, Output

I'H
Vce

High Level Enable Voltage

VSH

3.0

Low Level Enable Voltage

VEL
N

0

Input Current, Low Level
Inpul Current, High Level'

Fan Out (TTL Load)

4.5

Vee
0.8

Storage Temperature •••.•.....••••••.. -65° C to +150° C
Operating Temperature ....•.........•. -55° C to +125° C
Lead Solder Temperature •••....•••••..•. 260° C for 10 s
(1.6mm below seating plane)
Forward Input Current-II (Each Channel) ••.... 60 mAI2l
Reverse Input Current ....•••..•.••••••.....•.•. 60 mA
Supply Voltage - VCC .•.•...••. 7V (1 Minute Maximum)
Enable Input Voltage - VE (Each Channel) .....••.. 5.5 V
(Not to exceed VCC by more than 500 mV)
Output Collector Current - 10 (Each Channel) .... 25 mA
Output Collector Power Dissipation (Each Channel). 40 mW
Output Collector Voltage - Vo (Each Channel) .••.•• 7 V
Total Package Power Dissipation •••••.....•.... 564 mW
Total Input Power Dissipation (Each Channel) ... 168 mW

Units

V
V
V

6

Operating Temperature

125
·C
-55
TA
'12.5 rnA condition permits at least 20% eTR degradation guard band.
Initial switching threshold is lOrnA or less.

Electrical Characteristics TA = -55°C to +125°C, unless otherwise specified
Parameter

Symbol

Min.

Test Conditions

Figure

Note

IOH

20

Max.
250

Units

High Level Output Current

pA

Vce '" 5.5V, Vo : 5.5V
II'" 250pA, Vr:. '" 3.0V

3

3

Low Level Output Voltage

VOL

0.3

0.6

V

Vcc = 5.5V, II = 10mA
Ve;= 3.0V,
IOL (Sinking) '" 10 mA

1

3

VI

2.2
2.35

2.S
2.75

V

I =10mA
1,-SOmA

2

3

2

0.8

1.10

V

3
3

-1.45

-2.0

rnA

Input Voltage
Input Reverse Voltage

VR

Low Level Enable Current

teL

High Level Enable Voltage

VEH

Typ'

2.0

I

tR"'10mA

3, 12

Low level Enable Voltage

VeL

0.8

v

High Level Supply Current

lecH

21

28

mA

~~C = 5.5V. I, = 0,
- 0.5V both channels

Low Level Supply Current

ICCl

27

36

mA

Vee - 5.5V, II = 60 rnA
VI'. = O.5V both channels

p.A

Relative Humidity;;45%
TA=2S'C,t=5s,
VI.O = 1500 Vdc

Input-Output'lnsulation
Leakage Current

11.0

Propagation Delay Time to
High Output Level

tpLH

Propagation Delay Time to
Low Output Level

tPHL

3

Vee'" 5.5V, Ve '" 0.5V

V

1

I

ns

45
55

3

~=15pF

CL =50pF

os

55
60

~"'15pF

RL =5100,
1,"'13mA
TA=25"C

4

5

3,S

5

3.6

Cl =50pF

100

Common Mode
Tran$lent Immunity
at High Output Level

{CMHl

1000

10,000

VIp.'$.

VCM = 50 V (peak),
Vo (min.):2 V,
TA:25· C, RL = 510!1.
1,=OmA

7

3,9

Common Mode
Transient Immunity
at Low Output Level

!CMLI

1000

10,000

VIpS

VCM=50V(peak)
Voimax.)=0.8V,
TA=25"C, RL = 510{),
11= 10 mA

7

3,10

• All typical values are at VCC = 5V, TA = 25° C.

8-74

~------------------~

..-.-----..

Typical Characteristics TA = 25°C, Vee = 5 V
,

Parameter

. Symbol

Typ.

Units

"
Resistance
(Input-Qutput}

RI-O

1012

n

Capacitance (Input-Outpu~)

CI_O

1.7

pF

..

Test Conditions

Fig.

Note
3,13

,VI-O = 500 Vdc
f= 1 MHz

3,13

11

.'45% Relative HumidIty, VI_I=500 Vdc
,f";;.5s.

Input-Input .Insulation
Leakage GiJrrent

li;1

0.5

Resistance (InpuHnputJ

RI_I····

1012

n

VI_I = 500 Vdc

11

Capacitance ( Input-Input)

CI-I

.55

pF

1=1 MHz

11

\ELH

35

ns

RL = 510n, CL = 15pF,
II = 13 rnA, VEH = 3 V, VEL = 0 V

Propagation Delay Time of
Enable from VEL to VEH

tEHL

35

ns

propagatio'n Delay Time of

I

nA

Enable from VEH to VEL

6

3, 7

6

3,8

Output Rise'Time (10-90%)

tr

30

ns

tf

24

ns

RL = 510.0, CL = 15pF,
II = 13 rnA

3

Output Fall Time 19J~10%)
Input Capacitance

CI

60

pF

1=1 MHz, VI=O, PINS 1 102 or 5 to 6

3

NOTES:
1. Bypassing of the power supply line is required, with a 0.01 JlF ceramic disc
capacitor adjacent to each isolator. The power supply bus for the isolatOr(s} should be separate from the bus for any active loads, otherwise a
larger value of bypass capacitor (up to 0.1 J,LF) may be needed to suppress
regenerative feedback via the power supply.
2. Derate linearly at 1.2 mA/oC above TA = 100°C.
3. Each channel.
4. Device considered a two terminal device: pins 1 through 8 are shorted
together, and pins 9 through 16 are shorted together.
5. The tpLH propagation delay is measured from the 6.5 rnA point on
the trailing edge of the input pulse to the 1.5 V point on the trailing
edge of the output pulse.
6. The tpLH propagation delay is measured from the 6.5 mA point on
the leading edge of the input pulse to the 1.5V paint on the leading
edge of the output pulse.
7. The tELH enable propagation delay is measured from the 1.5 V point
on the trailing edge of the enable input pulse to the 1.5 V point on the
trailing edge of the output pulse.

3

8. The tEHL enable propagation delay is measured from the 1.5 V point
on the leading edge of the enable input pulse to the 1.5 V point on
the leading edge of the output pulse.
9. CM H is the maximum tolerable rate of rise of the common mode
voltage to assure that the output will remain in a high logic state (i.e.
VouT>2.0 VI.
10. CM L is the maximum tolerable rate of fall of the common mode
voltage to assure that the output will remain in a low logic state (i.e.
VOUT

J,
4

~o

>

3

~

V

~

::>

2

o

~-1

b

>

1

o

Vee" S.5V
TA'" 25°C

RL
tloS

1k.l!

4kn

f.---

2. 4

>
~

-r25 c C

I

+12S"C

----

I

->

\.\

1.4
1.2
1.0

1

IF- INPUT DIODE FORWARD CURRENT-rnA

o

10

30

40

50

II-INPUT CURRENT- rnA

Figure 1, Input-Output Characteristics

Figure 2. Input Characteristics.

8-75

60

120

140

1
I

>-

ill

100

120

v~cJsv

I

~

>-

a>-

~C>

":=
"-'

z
0
;::

0

"'~

"I

;:

I--- :-'I"'13mA.
RL""510n:

80

":t"

60

b

40

~

:I:

100

f--

t:::=V

~~

.,

\tftlH

§
20

-55

-25

TA- TEMPERATURE-·C

95

65

35

125

TA- TEMPERATURE-·C

Figure 3. High Level Output Current
vs. Temperature.

Figure 4. Propagation Delay vs.
Temperature.

+5V

RL

~~-r----~~~g~~6~~G
NODE

47il

-=-

*CL INCLUDES PROBE AND STRAY WIRING CAPACITANCE

Figure 5. Test Circuit for tpHL and tpLH.

1---------------------......--0 ~6~~6~ING NODE
~t:;::;::;:;;::;--l 16

+5V

RL

OUTPUT Vo
)ol~--::::I::----1>-O MaN ITOR ING
NODE

~N:UT ~

\-=-~=;.::

________

-J

t'HL

-..l

tELH

I-I

OUTPUT

Vo

*CL INCLUDES PROBE AND STRAY WIRING CAPACITANCE

-=-

Figure 6. Test Circuit for tEHL and tELH.

8-76

I

~--

+5V

510n

»i.!=-.-+--~ ~~~~6~~G
O.OlpF
BYPASS

NOOE

----50V
VeM

OV
SWITCH AT A: I, = 0

5V---""

CMH

Vo
-----Vo(min,1
SWITCH AT B: II = lOrnA

f\ -

Va

0.5V

PULSE GEN.

.

-Volmax.)

....- - - - - - - - - - - C M L

Figure 7. Test Circuit for Common Mode Transient Immunity and Typical Waveforms.

MIL-STD-BB3 CLASS B TEST PROGRAM

PART NUMBERING SYSTEM

Hewlett Packard's 883B Optocouplers are in compliance
with MIL-STD-883, Revision C. Deviations listed below are
specifically allowed in DESC drawing 81028 for an H.P.
Optocoupler from the same generic family using the same
manufacturing process, design rules and elements of the
same microcircuit group.

CQmmercial PrQduct
HCPL-1930

Vee
+5.5V

VOUT

+2.6 V

Testing consists of 100% screening to Method 5004 and
quality conformance inspection to Method 5005 of MILSTD-883. See the pages of this section entitled Hermetic
Optocoupler MIL-STD-883 Class B Test Program for details
of this test program.

lOon
16

.a

15

4

13

5

12

14
200n

HCPL-1931 Clarifications:

loon

I. 100% screening per MIL-STD-883, Method 5004 constant
acceleration - Condition A not E.

200n
11

O.Ol"F

1

10

8

9
TA =+125C C

CONDITIONS: 11= 30 rnA
lo=10mA

Vcc=5.5V

II. Quality Conformance Inspection per MIL-STD-883,
Method 5005, Group A, B, C, and D.
Group A - See table on next page for specific electrical
tests.
Group B - No change.
Group C - Constant Acceleration - Condition A not E.
Group D - Constant Acceleration - Condition A not E.

Figure 8. Burn In Circuit

8-77

. _ - - - - - - - - - _ . " . _ . _."._"

-""

. "".".-_.,,-

GROUP A
Subgroup 1
'Static tests at TA = 25°C - 10H. VOL. V.. ICCH. ICCl. IEL. VEti. VEL. VR. 11-0

LTPD

2

Subgroup 2
'Static tests at T A = +125" C - IOH. VOL. V" leCH. ICCL. IEl. VEH. VEL. VR

3

Subgroup 3
'Static tests at TA = -55" C - 10H. VOL. VI, ICCH, ICCl, IEl' VEH. VEL. VR

5

Subgroup 4. 5, 6, 7 & 8 - These subgroups are non-appllcable to this device type.
Subgroup 9
'Switchlng tests at T A = 25° C - tpLH. tPHL. CMH and CML

2

Subgroup 10
Switching tests at "FA = +125'0

3

Symbol
tpLH

Max,

Unils

Test Conditions

140

ns

II"" 13mAdc, RI..

120
ns
tPI"IL
Subgroup 11
Switching tests at T A =-55·C

=510H. Cl = 50pF

II'" 13mAdc, RL = 5100. CI..

= 50pF
5

SY~~
tpLH

Max.

Units

140

ns

II"" 13mAdc, RI..

tpHL

120

os

It'" 13mAdc. RI.. = 510!l. CL = 50pF

Test Conditions

'Limits and conditions per Electrical Characteristics Table.

8-78

c

5100, CL = 50pF

Fli;-

HEWLETT

~~ PACKARD

LOW INPUT CURRENT,
HIGH GAIN, HERMETICALLV
SEALED OPTOCOUPLER

HCPL-5700
HCPL-5701
(8838)

TECHNICAL DATA

~ 10,370)-:;:1
(0.390)
r;:- 9.90

Schematic

B

7

Vee
B

Outline Drawing

HP yYWW_f--DATE COD"

USA

.::::;.

PIN

..

ONE

1

2

3

4

~

U'....",:!u::0.=33=(=0.::oOl~31
.~

:~ici,~~~~~~)

A-

2
ANO
+ DI,E : 3

7.a8iil:i'iOi]

8.13 (0.320)
MAX

TNYUPM"BER

1

7. I I (0.280)

rnI

5

xxxxxxx' x'x,,'- V

~ Icc

v,

6

JANUARY 1986

9,1B
-

-'-

t

0.51 (0.020)

~3.Bl(0.'501

61~E~1
::X'~8
~ ~ ~ ~-+-

CATHODE -

3

tl

0.51

(~~2~'

-I1-~'I

.

• Bl
(0.150)

!

Vee

ANODE 2

/

7 NC

CATHODE 3

/

6 Vo

MIN.

NC 4

5 GND

2.28 (0.90)

reo

10.1101

DIMENSIONS IN MI WMETERS AND ItNCHES)

Features

Applications

•

•

MILITARY/HIGH RELIABILITY SYSTEMS

•

TELEPHONE RING DETECTION

•

MICROPROCESSOR SYSTEM INTERFACE

•
•

HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
PERFORMANCE GUARANTEED OVER _55 0 C TO
+125°C AMBIENT TEMPERATURE RANGE
MIL-STD-883 CLASS B TESTING

•

EIA RS-232-C LINE RECEIVER

o

LEVEL SHIFTING

•

6N138, 6N139 AND 6N140A OPERATING
COMPATIBILITY

•

DIGITAL LOGIC GROUND ISOLATION

•

LOW INPUT CURRENT REQUIREMENT - 0.5 mA

•

CURRENT LOOP RECEIVER

•

HIGH CURRENT TRANSFER RATIO 1500% TYPICAL

•

ISOLATED INPUT LINE RECEIVER

•

SYSTEM TEST EQUIPMENT ISOLATION

•

LOW OUTPUT SATURATION VOLTAGE0.11 V TYPICAL

•

PROCESS CONTROL INPUT/OUTPUT ISOLATION

•

500 Vdc WITHSTAND TEST VOLTAGE

•

HIGH COMMON MODE REJECTION

higher signaling speed than possible with conventional
photo-darlington optocouplers.

•

LOW POWER CONSUMPTION

•

HIGH RADIATION IMMUNITY

The supply voltage can be operated as low as 2.0 V without adversely affecting the parametric performance.

The HCPL-5700 and 5701 units are hermetically sealed,
low input current, high gain optocouplers. The products
are capable of operation and storage over the full military
temperature range and can be purchased as either a
standard product (HCPL-570Q) or with full MIL-STO-883
Class Level B testing (HCPL-5701l. Both products are in
eight pin hermetic dual in-line packages.

The HCPL-5700 and HCPL-5701 have a 200% minimum
CTR at an input current of only 0.5 mA making them ideal
for use in low input current applications such as MOS,
CMOS, low power logic interfaces or line receivers. Compatibility with high voltage CMOS logiC systems is assured
by the 18 V Vee, VOH current and the guaranteed maximum output leakage current at 18 V. The shallow depth
and small junctions offered by the IC process provides
better radiation immunity than conventional phototransistor
optocouplers.

Each unit contains an AIGaAs light emitting diode which is
optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector
output providing both lower output saturation voltage and

Upon special request, the following device selections can
be made: CTR minimum of 300% to 600% at 0.5 mA, lower
drive currents to 0.1 mA, and lower output leakage current
levels to 100 ,.,A.

Description

8-79
... _._ ...

_._--_._._

...

_---------------_._--------

Recommended operating
Conditions
Parameter
Input Voltage, Low
Level
Average Input Current
High Level
Supply Voltage

Symbol Min. Max.
VFL

0.7

Units
V

IFH

0.5

5

mA

Vee

2.0

18

V

Electrical Characteristics
Parameter
Current Transfer Ratio

Absolute Maximum Ratings
Storage Temperature ..................... -65'C to +150'C
Operating Temperature ................... -55'C to +125'C
Lead Solder Temperature ................... 260'C for 10 sec.
11.6 mm below the seating plane)
Output Current 10 ................................... 40 rnA
Output Voltage Va .......................... -0.5 V to 20 Vl 1 1
Supply Voltage Vee ...................•...•... -0.5 to 20 WI
Output Power Dissipation ......................... 50 mWl 2 1
Peak Input Current ..........................•........ 8 rnA
Reverse Input Voltage. VR .............•...•............. 5 V

TA = -55°C to 125°C, unless otherwise specified

Symbol

Min.

Typ.'

CTR

200
200
200

1500
1000
500

Max.

Units

Test Conditions
IF ~ 0.5 rnA, Vo ~ 0.4 V, Vee ~ 4.5 V
IF 1.6 rnA. Vo = 0.4 V, Vee 4.5 V
IF=5 rnA, Vo 0.4 V. Vee = 4.5 V

3

V
V
V

IF - 0.5 rnA, 10 = 1.0 rnA, Vee -4.5 V
IF 1.6 rnA. 10 ~ 3.2 rnA, Vee 4.5 V
IF = 5.0 rnA, 10 = 10 rnA, Vee = 4.5 V

2

=

Val

0.11
0.13
0.16

0.4
0.4
0.4

Logic High Output Current

10H

0.001

250

p.A

Logic Low Supply Current

leel

1.0

2.0

rnA

IF

Logic High Supply Current

leeH

0.001

7.5

{.IA

1Ft =0, Veo =leV

1.3

1.6

V

IF -1.6 rnA, TA -25'C

V

IR

Logic Low Output Voltage

VF

1.0

Input Reverse Breakdown
Voltage

BVR

5

Input-Output Insulation
Leakage Current

11-0

Input Forward Voltage

Propagation Delay
Time to Logic High
AtOulput
Propagation Delay
Time to Logic Low
AtOutpul

1.0

IPLH

tPHL

Fig.

%
%
%

17

185

/1s

115

{.IS

8

60

/1S

10

185

p's

5

SO

/1S

2

12

{.IS

3

=

=

VF ~0.7 V, Vo=Vec =18 V

= 1.6 rnA, Vee = 18 V

4
1

= 10 /1A
4,5

45% Relative Humidity, TA =25'C
t = 5 sec. VI-O 500 Vdc

p.A

14

Note

=

=0.5 rnA. Rl = 4.7 kfl, Vee =5 V
= 2.2 kil, Vee =5 V
IF =5.0 rnA, RL 680 11. Vee =5 V
IF =0.5 rnA, RL = 4.7 kil, Vee = 5 V
IF =1.6 mA, Rl =2.2 kll, Vee = 5 V
IF ~ 5.0 rnA, RL =680 n, Vee =5 V
IF =0, RL ~ 2.2 kil
IVCMI = 50 Vp _p , Vee = 5.0 V. TA = 25°C

9.10

6,8

IF = 1.6 rnA, RL = 2.2 kfl
iVCMI 50 Vp_p, Vee =5.0 V, TA = 25'C

9,10

7,8

7,8

IF

7,8

IF = 1.6 rnA, Rl

Common Mode Transient
Immunity At Logic High
Level Output

ICMHI

500

22000

VI/1s

Common Mode Transient
Immunity At Logic Low
Level Output

ICMLI

500

21000

Vlp.s

7,8
7,8

7,8
7,8

=

'All typical values are at Vee

= 5 V,

TA

= 25' C.

Typical Characteristics TA = 25°C, Vee = 5 V
Parameter

Symbol

Typ.

Units

Resistance (Input-Output)

RI-O

10'2

n

VI-O

Capacitance (input-Output)

CI-O

2.0

pF

1=1 MHz

Temperature Coefficient
of Forward Voltage

uVf
tl.TA

-1.5

Input Capacitance

CIN

15

mV!

Test Conditions

=500 Vdc

Fig.

Nole
9

9

'C

IF=1.6mA

pF

f = 1 MHz, VF

=0

NOTES:
7. CM L is the maximum tolerable common mode transient such that the output will
remain in a low logic state (i.e. Vo < 0.8 Vl.
8. In applications where dVldt may exceed 50,000 VIlAS (such as a stalic discharge) a
series resistor, RC C ' is recommended to protect the detector IC from destructively high surge currents. The recommended maximum value is

1. GND Pin should be the most negative voltage at the detector side. Keeping Vee
as low as possible, but greater than 2.0 V. will provide lowest total 10K over
temperature.
2. Output power is collector output power plus one half of total supply power.
3. CURRENT TRANSFER RATIO is defined as the ratio of output collector current,
10 , to the forward LED input current, IF' times 100%.
4. Device considered a two-terminal device. Pins 1 through 4 are shorted together
and pins 5 through 8 are shorted together.
5. This is a momentary withstand test, not an operating condition.
6. CM H is the maximum tolerable common mode transient such that the output will
remain ill a high logic state (i.e. Vo > 2.0 Vl.

RCC =

0.15

~:{mAl

kO.

9. Measured between the LED anode and cathode shorted together and pins 5
through 8 shorted together.

8-80

10.0

I ,,J

~
5.0

4:

1.0

.s
>-

~

~)

r

a o.,
I

0.0

0.00

,
1.050

/

/

TA '" 25"C

/1

>-

li'

"= ,

/V

/V
1.100

1.150

1.200

1.250

1.300

1.350

VF - FORWARD VOLTAGE (V)

Vo - OUTPUT VOLTAGE (V)

Figure 1. Input Current vs. Forward
Voltage.

IF - INPUT FORWARD CURRENT (rnA)

Figure 2. Normalized DC Transfer
Characteristics.

Figure 3. Normalized Current Transfer
Ralio vs. Input Forward
Current.
60

-

":3

>-

iii

54

,.

a

1l

:3

ll:

,.~

:>;

;;:

""~

NORMALIZED TO'

lecAl IF '" 16mA

0
2

TA '" 2S"C

.
I

0.01
0.1

1.0

10

100

0.1
0.1

.!!:'.!:!.L
RL=eson
RI,.

20

0:.

2.2 kD

Vee"" 5.0 V
TA '" 25~C
PULSE WIDTH'" 50 /.IS

F1L "'4.1./-

"
I

0.0 1

§
0.00 1
1.050

/
/
1.'00

kO.

/

~

lQO'C

2.0

If""~

~
>-

V

~

~

125'C~
10

V

::;

«

1.200

1.250

1.300

~

n

,

VJ

t;

1.350

Vf - FORWARD VOLT AGE (V)

Figure 2. Normalized DC Transfer
Characterislics.

u

48

g

~

~

>

Ol

~

Z

NORMALIZED iO:
Icc AT IF .. 1,6 rnA

O.Q1

10

10

100

"

36

6

"

0.1
0.1

- - i f ~ O.5mA. Rt. ""4,7kiJ
- - I F ' " l.B rnA. Rt.. -+> 2.2 kH
----If'" 5.0 rnA, Rt.. ~ 680 It

10.0

1.0

100

I--

,ck

10.0

-;-

/

lJ)i

V 1/

I-

...,.- / '

~o~o -m

) . , / '"
d\'i

/ ' ...) /

L

..-

;;..::--- -~ I 0

20

~

.

M

.". '--'

:.±

80100'20140

TA - TEMPERATURE lOCI

T - INPUT PULSE PERIOO (ms)

IF - INPUT FORWARD CURRENT (rnA)

Figure 4. Normalized Supply Current ys.
Input Forward Currenl.

42

12

~,

.J:l

~

I--

18

;t'"

1/10 '" 26"C

1.0

24

!;(

Vee "18V

,

""

"Ii

01

30

"Q

N

::;

z

)1---1,

60

<;

@

~~

/

Figure 3. Normalized Current Transfer Ratio
ys. Input Forward Currenl.

"

[l

~

/1--- 550

IF - INPUT FORWARD CURRENT (mAl

"g

>-

:;;
g;

0

0.0
0.01

Va -QUTPUTVOLTAGE (V)

Figure 1. Input Current ys. Forward Voltage.

«
~

'l~\(25C

O'C

~[l

TA " 25'C

c:
1.150

'NO,flMALlZEO TO;
"CTfI AT IF '" 0.5 rnA
TA',t 25'C
Vee'" 4.5 V
Vo '-'OAV

2.5

w

o
z

0.1

1:~mA)

or

/

~

-'=

~

/

r ~)

5.0

Rce "" 0.3

12. This is a momentary withstand test, not an operating condition.

o

1,1

I

B. Measured between adjacent input pairs shorted together, i.e. between pins 1 and
2 shorted together and pins 3 and 4 shorted together.
9. CM H is the maximum tolerable common mode transient such that the output will
remain in a high logic state (i.e. Va > 2.0 V).
10.CM L is the maximum tolerable common mode transient such that the output will
remain in a low logic state (i.e. Va < O.B VI.
l'.ln applications where dV/dt may exceed 50,000 V/jJ.s (such as a static discharge) a
series resistor, Ree , is recommended to protect the detector IC's from destructively high surge currents. The recommended maximum value is

Figure 5. Propagation Delay to Logic Low
vs. Input Pulse Period.

Figure 6. Propagation Delay
Temperature.

YS.

25
"Hl
Rt. ",,&aDn

.3

Rt,. =-Z,2:kn.
At.. ,;-4.7 kQ,

20

>

~

"

1

0

~

'~"

'PlH

1
10

\

0

,

~

if

f!,

IRe' 4.7

PULSE

GEN,

to"" 50n
11 '" I:) fli>

t r,

J"

f'" 100 Hz
tPULSi:: '" 50 /J$

Ftl"'2.2~n~

15

Z

Vee: '" S.OV
TA "" 25~C
PULSE WIDtH'" 50 JH

,""-"
\.

Rl",eoou

1"'---"-- I'-.

1-1..---0'5V

1,-- ---,

o ¥!---5V ==Vo
1.5V

o

o

-If -INPUT FORWARD CURRENT (rnA)

VOL

t pLH - -

Figure 8. Switching Test Circuil.

Figure 7. Propagation Delay ys. Input
Forward Currenl.

8-85
~

_.

-----~-

-----

10K

E

lK

t
t r• tf=

BOns
100

E

~r 1\

I--CMH

SWITCH AT A:

IF" OmA

10 ~

"-

j

VO~5V

Vcc"'5V
IFH""1,6mA
F'tL:c: 2.2kl1

TA "'2S?C

VO-------~VOl
SWITCH AT B:

1

IF = 1.6mA

I

I

200

400

600

800

1000

1200

VCM -COMMON MODE TRANSIENT AMPLITUDE (V)

Figure 10. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.

Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.

MIL-STD-883 CLASS B TEST PROGRAM
Vae +1,4 V

Hewletl-Packard's HCPL-5731 optocoupler is in compliance with MIL-STD-883, Revision C. Testing consists of
100% screening to Method 5004 and quality conformance
inspection to Method 5005. Details of these test programs
may be found in the hermetic optocoupler product qualification section of Hewletl-Packard's Optoelectronics
Designer's Catalog 1985.

100

n: TYP,
sl--I---A,/I/\r-'
100 n TVP.

-=-

CONDITIONS: IF '" 5 rnA

10

=

lOrnA

Figure 11. Operating Circuit for Burn-In and
Steady State Life Tests.

See table below for specific electrical tests.

PART NUMBERING SYSTEM
Commercial Product

Class B Product

HCPL-5730

HCPL-5731

GROUP A - ELECTRICAL TESTS
LTPO
Subgroup 1
'Static tests at TA = 25° C -IOH, 10HX, VOL' 'CCl. 'ecH. CTR, VF. BVR and 11• 0

2

Subgroup 2
'Static tests at TA = +125.o C - IOf;. IOHX, VOL. leCL.lcCH. BVR and CTR

3

Symbol
VF

I
I

I

Max.

I

Units

J

1.8

I

V

Min.

Subgroup 3
"Statlc tests at TA '" -55°G Symbol

VF

I

J

Min.

I

J

Test Conditions
'p=1.6mA

IOH. IOHX. VOL. fCCl, ICCH, BVR and GTR

I

Max.

I

Units

I

Test Conditions

I

1.8

I

V

I

'F"" 1.6 mA

5

Subgroup 4, 5, 6, 7 and 8
These subgroups are not applicable to this device type.
Subgroup 9
'Switching tests at TA "" 25·C -tpLH1> tpHL1, tpLH;(. tpHL2. tpLH3. tPHL3' CMH and GML

2

Subgroup 10
'Swltching tests at TA = +125" C - tpLH1> tpHL1. tpLH2' tPHL2' tpLH3' tPHL3

3

Subgroup 11
'Switching tests at TA '" -55° G - tpLH1' tpHL 1. tplH2, tpHL2. tplH3, tpHL3

5

'Limits and conditions per Table I I.

8-86

F/iO'l

HERMETICALLY SEALED
FOUR CHANNEL
LOW INPUT CURRENT
OPTOCOUPLER

HEWLETT

~~ PACKARD

6N140A
6N140A/883B

TECHNICAL DATA

20
30
4V;
---60
:F:'
---70 :::::::

15

I"

lVF~

~

~

I"

~

IfJ

~

Vee

JANUARY 1986

~

hpYYWW

" V"

13
12

V"

VOl

1F4

8V~

~

11

11

,.

V"

10
OlMENS10NS IN MILLIMETERS AND (lNCHESl.

GND

Outline Dr'1Wlng*

Features
•

PERFORMANCE GUARANTEED OVER -55° C TO
+125°C AMBIENT TEMPERATURE RANGE

•

MIL-STD-883 CLASS B TESTING

•

HIGH DENSITY PACKAGING

•

HERMETICALLY SEALED

•

LOW INPUT CURRENT REQUIREMENT: 0.5 rnA

•

HIGH CURRENT TRANSFER RATIO: 1500% TYPICAL

•

LOW OUTPUT SATURATION VOLTAGE: 0.1 V
TYPICAL

•

LOW POWER CONSUMPTION

•

1500 Vdc WITHSTAND TEST VOLTAGE

•

HIGH RADIATION IMMUNITY

Applications
•

MILITARY/HIGH RELIABILITY SYSTEMS

•

ISOLATED INPUT LINE RECEIVER

•

SYSTEM TEST EQUIPMENT ISOLATION

•

DIGITAL LOGIC GROUND ISOLATION

•

EIA RS-232C LINE RECEIVER

•

MICROPROCESSOR SYSTEM INTERFACE

•

CURRENT LOOP RECEIVER

•

LEVEL SHIFTING

•

PROCESS CONTROL INPUT/OUTPUT ISOLATION

Description

identical to the 6N140 part. It is an advanced replacement
unit for the 6N140. Performance of the 6N140A overthe full
military temperature range results from an improved
integrated bypass resistor which shunts photodiode and
first stage leakage currents.
The 6N140A contains four GaAsP light emitting diodes,
each of which is optically coupled to a corresponding
integrated high gain photon detector. The high gain output
stage features an open collector output providing both lower
output saturation voltage and higher speed operation than
possible with conventional photo-darlington type optocouplers. Also, the separate Vee pin can be strobed low as an
output disable or operated with supply voltages as low as
2.0V without adversely affecting the parametric performance.
The high current transfer ratio at very low input currents
permits circuit designs in which adequate margin can be
allowed for the effects of eTR degradation over time.
The 6N140A has a 300% minimum eTR at an input current of
only 0.5mA making it ideal for use in low input current
applications such as MOS, CMOS and low power logic
interfacing or RS-232C data transmission systems.
Compatibility with high voltage CMOS logic systems is
assured by the 18V Vee and by the guaranteed maximum
output leakage UOH ) at 18V. The shallow depth of the IC
photodiode provides better radiation immunity than
conventional phototransistor couplers.
See the selection guide at the front of this section for other
devices in this family.

The 6N140A is an EIA registered hybrid microcircuit which is
capable of operation overthe full military temperature range
from -55°e to +125°e and is electrically and functionally
*JEDEC Registered Data

8-87

Absolute Maximum Ratings*

TABLE I

Recommended operating
Conditions
Symbol
Input Current. Low Level
{Each Channel}

IFL

Input Current, High Level
(Each Channeil

IFH
Vee

Supply Voltage

Max.

Units

2

pA

0.5

5

mA

2.0

18

V

Min.

Storage Temperature ............... -65°C to +150°C
Operating Temperature ............. -55°Cto+125°C
Lead Solder Temperature .............. 260°C for 105.
(1.6mm below seating plane)
Output Current. 10 (each channel) ............. 40 mA
Output Voltage, Vo (each channel)
-0.5to 20V 111
Supply Voltage, VCC ................... -0.5t020VI 11
Output Power Dissipation(each channel)
50 mW'21
Peak Input Current (each channel,
~1 ms duration, 500 pps) ..................... 20mA
Average Input Current, 'F (each channel) ..... 10 mAI 3 1
Reverse Input Voltage, VR (each channel)
5V

TABLE II

Electrical Characteristics
Parameter

Symbol

Current Transfer Ratio

CTA'

Logic Low Outpul Voltage

VOL

TA = -55°C to 125°C. Unless Otherwise Specified

Min. Typ: Max,
300 1500
300 1000
200 500

Unils
%
%
%

IF=O.5mA, Vo-O.4V, VCC=4.5V
IF1.6mA, Vo=OAV, Vcc=4.SV
IF"'5rnA, Vo=OAV, VCC=4:~V

.1
.2

.4
.4

V
V

If=C.SmA. 'Ol=1.5mA, Vcc=4.5V
1e=5mA. IOl=10mA, Vcc=4.5V
IF-2pA (channel under testl
Vo=Vcc=18V
IF,=IF2-IFS=IF4=1.6mA
Vcc=16V
Ip,=IF2=IFS=IF4=0
Vcc=18V
If=1.6mA. TA=25°C

Logic High Output Currenl

10HX
10H'

.001

250

!J,A

logic Low Supply Current

ICCL'

1.7

4

mA

logic High Supply Current

ICCH'

,001

40

pA

Input Forward Voltage

W'

1.44

1.7

V

Input Reverse Breakdown
Voltage
Input-Output Insulation
Leakage Current
Propagalion Delay Time
To Logic High At Output
Propagation Delay Time
To logic Low At Output
Common Mode Transient
Immunity At Logic High
Level Output
Common Mode Transient
Immunity At Logic Low
Level Output

BVR'

5

Test Conditions

V

tPHL'

Resislance I Input-Outpull
Capacitance ,Input-Outputl
Input-Input Insulation
lea kage Curren!
Resistance I Input-Input '
Capacitance I fnput-lnput'
Temperature Coefficient
of Forward Voltage
Input Capacitance

4

1

4

IR=10!J,A, TA=25°C

8

4

8
8

4

7.13

j1s

4
30

20

j.lS

100

!'s

IF=5mA. RL=680n, Vcc=5,OV. TA=25°C
If=0.5mA, RL=4.7kn, Vcc=5,OV. TA=25'C

2

5

!J,s

h'=5mA. RL=680n, Vcc=5.0V, TA=25°C

8

4

1=50Vp _p• Vcc=5.0V. T 1\=2So C

9

4
10,12

IF-1,6mA, RL-l.5kn
IVCM I=50Vp_p , Vcc=5.0V, TA=25'C

9

4
11.12

Vips

CML

-500 -1000

V/!J,s

CI-O

~
4

pA

1000

RI-o

4

60

500

SymbOl

2

45% Relative Humidity, TI\~25°C,
t=5$ .. VI-0=1500 Vdc
Ir=0.5mA. RL =4.71\11. Vcc=5.0V, TA=25' G

I:V:~IRL=1.5k!l

4

'JEDEe Registered Data
'"All typical values are at Vee = 5V, TA = 25°e.

TABLE III

Parameter

4,5

1.0

CMH

Typical Characteristics

3

6

Ii-o'
t"'LH'

Fig. Nole

TA
Min.

= 25°C,

= 5V

Vee

Typ. Max. Units
H

=~~2

pF

II-I

0,$

nA

RH
C,-I
j,VF
j,TA

10'2
1

!l

-1.8

mV/
·C

CIN

60

pF

pF

Each Channel
Test Conditions
VI-o=500 Vdc, TI\=25'C

Fig.

Note
4,8

f=lMHz, TA=25o C
45% Relative Humidity. V,-1=500 Vdc,
T 1\=25< C. \=55.

4.8

9

VI-I=500Vdc, TA=25°C
f=lMHz. TA~25° C

9
9

IF1.6mA

4

f-1MHz. VF-O. TA=25"C

4

8. Measured between the LED anode and cathode shorted together and pins
10 through 15 shorted together.
9. Measured between adjacent input pairs shorted together, i.e. between
pins 1 and 2 shorted together and pins 3 and 4 shorted together, etc.
10. CM H is the maximum tolerable common mode transient to assure that the
output will remain in a high logic state  2.0VI.
11. CM L is the maximum tolerable common mode transient to assure that the
output will remain in a low logic state (i.e. Va < O.BV!.
12. In applications where dV/dt may exceed 50,000 V/p.s (such as a static
discharge) a series resistor, Ace, should be included to protect the
detector IC's from destructively high surge currents. The recommended

NOTES: 1, Pin 10 should be the most negative voltage at the detector Side. Keeping
V CCas low as possible, but greater than 2.0 volts, will provide lowest total
IOH over temperature.
2. Output power is collector output power plus one fourth of lotal supply
power. Derate aI1.66mW/oC above 110° C.
3. Derate I F atO.33mA/oCabove 110 o e.
4. Each channel
5. CURRENT TRANSFER RATIO IS defined as the ratio of output collecior
current, 10 , to the forward LED input current, IF' times 100%,
6. IOHX is the leakage current resulting from channel to channel optical
crosstalk. I F= 2p.A for channel under test For all other channels, I F= 10mA.
7. Device considered a two-terminal device: Pins 1 through 8 are shorted
together and pins 9 through 16 are shorted together.

value is Ree =

0.61:~mA)

kil.

13. This is a momentary withstand test, not an operating condition.

8-88

~-,,--~-

0

10000

I,

1000

'i"

lOa

I-

10

g;

::>

'0


0

[l

~

~

~

::;

z

~
0
z

,

,

2

'"

I-

1.40

"

1.50

2, 100 c--vc-c-.-,-V-,----.----.

60

~

50

~C~S~5~~DTH '" Saps

'0/
~

~

I

'"z

~
~

1

/'

~­

- r - - I F ",05rt1A,Rl =4,7kn
-IF "-1.6mA,Rl ~ 15kU

a

it,
:t:

20

--

'"0z
>'
~

15

0

,0

";t

..u". . II,,,",J"":O-,-,-..w."-=.II",00

it,

..

I

'I I

tpHL

."

r--. r--.

r--.

tpUL

./
'0

i- r-. ~
1!!'!t'!'5 I!r!.:: :-;~:::,;,-60 -40 -20 0

.- -

tpLH

Wtti

tpt.H
..... tpl:it.

~

80

20 40 60

.... ~ tptlL

100

120

Figure 6. Propagation Delay vs.
Temperature

tr '" 50S
f'" ll)OHl
lp '" SO/-,$

IF

"-=-1=-

<5V

IF MONITO~

---

---VO

lPUi Rt. "" 680 n

I
,0

~,

20

~

'\

~----'¥5V --

Al "'4.7Hl

tplH Hl - 1.5 kU

o

~~

30

If "-1:6mA,RL" LSkU
iF "50mA,RL"'6aOH

PULSE

---VOL

{.IS

I

40

ZoG;~n

1.5V

r-PERIOD. m,

-: .,......
o

5V I
VO---YF-

TA "" 25'c

tPl..tI

'"az

JLULJ,J"

TA - TEMPERATURE ("C)

"---~

ill

lLr-~cLv I

\j

68.0 £~

Figure 5. Propagation Delay to Logic Low
vs. Input Pulse Period.

30

RIN""2DO!!
P,Jt.SEWlQiH'" P:O

=

~

T -INPUT PULSE PERIOD (m5)

Figure 4. Normalized Supply Current vs.
Input Diode Forward Current.

~

. - I,., '" 5,0 mAo RL

0.1 0':-.,:-'-'--LU.ll,'"'.O,............

IF -INPUT DIODE FORWARD CURRENT (mA)

20

----------

f=-",,~:::~=-~-~-'-1'-~'-'---'---------+------1

?,'

\::- -,-

,-.

e;

g

'0

Figure 3. Normalized Current Transfer
Ratio vs. Input Diode Forward
Current.

Figure 2. Normalized DC Transfer
Characteristics

g

",",I Be . elo nT)U

0.5

IF - INPUT DIODE FORWARD CURRENT (mA)

Vo -OUTPUT VOLTAGE-V

'00 , . . . - - - - . , - - - -.......- - - - - ,

"

0.5

~

0

1.30

1.20

l

'.0

'"'"

~

::;

Figure 1. Input Diode Forward Current vs.
Forward Voltage.

25

Vo "'-0.4 V

~

Il-

VF - FORWARD VOLTAGE (VI

..,.

Vee "'5V

z

~

/'

NORMALIZED to:
eTR AT If Q,6mA
TA '" 25'C

TA ",-o-C

'"

,~/
0.00
1.10

"10

l-

/"

~,

~

[l

/'

1.5

>'

'2

~

1.5V

'2

-

IF - INPUT DIODE FORWARD CURRENT {mAl

-t pLH -

VOL
---

Figure 8. Switching Test Circuit.'
(f, tp not JEDEC registered)

Figure 7. Propagation Delay vs. Input Diode
Forward Current.

VCM

Vo

~
.._ - - - - - - - -

SWITCH AT A: IF == OmA

2.4-V F
R,,-,-,
-

5V

VCC-VF-IFR2

R1"'~

r------,
I
1

I
I

,

Va -----------~~VOL
SWITCH AT B: IF"" 1.6mA

PULSE GEN.

**See Note 12.

Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.
*JEDEC Registered Data

8-89

:&~I~~O~~~~~~~~t
---:
IS NOT USED.
L

I
:

-

- ___ J

Figure 10. Recommended Drive Circuitry
Using TTL Logic.

Group B - No change
Group C - Constant Acceleration - Condition A not E.
Group D - Constant Acceleration - Condition A not E.

MIL-STD-883 CLASS B TEST PROGRAM
Hewlett Packard's 883B Optocouplers are in compliance
with MIL-STD-883, Revision C. Deviations listed below are
specifically allowed in DESC drawing 83024 for an H.P.
Optocoupler from the same generic family using the same
manufacturing process, design rules and elements of the
same microcircuit group.
Testing consists of 100% screening to Method 5004 and
quality conformance inspection to Method 5005 of MILSTD-883. See the Pages of this section entitled Hermetic
Optocoupler MIL-STD-883 Class B Test Program for details
of this test program.

PART NUMBERING SYSTEM

I

Commercial Product

r

6N140A
200 f2

TYP.

V,N
2.3 V

6N140A/883B Clarifications:
I. 100% screening per MIL-STD-883, Method 5004 constant
acceleration - condition A not E.

GROUP A -

6N140N883B

1 16 t:J'8

-2
>-- 3

15
14

4

13

s

12

CONDITIONS:

II. Quality Conformance Inspection per MIL-STD-883,
Method 5005, Group A,B,C and D.
Group A - See table below for specific electrical tests.

C"ij

Class B Product

1

>-- 6
>-- 7
8

+r

-=

I

Ion

Vae + 2.4 V

V

200n
TYP.

11

of-

TA

==

+125°C

IF ::.5mA
10 == 10 rnA

Vcc=lBV

Figure 11. Operating Circuit for Burn-In
and Steady State Life Tests.

ELECTRICAL TESTS
LTPD

Subgroup 1
'Static tests at TA "" 25°C

2

10H' 10HX, ICCl' ICCH' CTA, VF, BVA and 11-0

Subgroup 2
'Static tests at TA "" +125°C -IOH' 10Hx, ICCl' ICCH' CTR
Symbol

Min.

VF

Subgroup 3
'Static tests at TA
Symbol

Units

1.8

V

IF= 1.6 mA

V

IA = 10 IlA

5

BVA

= -55

0

Test Conditions

5

C -loH• 10HX, ICCl' ICCH' CTR

Min.

VF
BV A

3

Max.

Test Conditions

Max.

Units

1.8

V

IF =1.6mA

V

IA = 10 IlA

5

Subgroup 4, 5, 6, 7 and 8
These subgroups are not applicable to this device type.
Subgroup 9
'Switching tests at TA = 25° C - tpLH1' tpHL l' tpLHa, tpHL2, CMH and CM!.

2

Subgroup 10
Switching tests at TA "" +125° C

3

Symbol

Max.

Units

Test Conditions

tPLHl

300

J,lS

IF = 0.5 rnA, RL = 4.7 kl!

tpLH2

80

J,lS

IF = 5 rnA, RL '" 680

tPHLl

200

11 3

IF = 0.5 rnA, Rl = 4.7 kD

Vc c =5.0 V

tpHL2

10

J,lS

IF = 5 rnA, RL "" 680 !l

Vee =5.0 V

Subgroup 11
Switching tests at TA
Symbol

= -55

0

n

Vee =5.0 V
Vee =5.0 V

5

C

Max.

Units

Test Conditions

tpLHl

300

1'5

IF = 0.5 mA, RL

tpLH2

80

1'5

IF = 5 rnA, RL = 680

tpHl1

200

11 5

IF = 0.5 rnA, RL

= 4.7 kH

Vec"" 5.0 V

tpHL2

10

Ils

IF =5 mA, Rl

680 U

Vee ""5.0 V

'Limits and conditions per Table II.

8-90

= 4.7 k!!
n

Vee =5.0 V
Vee =5.0 V

-----.-~---~ .. ~-~--~--~~~------~

--------

FGUR CHANNEL
HERMETICALLY SEALED
GPTGCGlJPLER

8302401EC

DESC APPROVED
TECHNICAL DATA

20
:,:

15

SCHEMATIC

::::::::::

~

OUTLINE DRAWING

30
5 ----60
:,~
--------

~

,.

11

hPYvwviJ

VOl

13

8.13 (.3201

_I

70 -----

~

t

0.33 (.0131
4,32 L nOlo

I

V03

I"

BV;

~l31o)

Q1Q~)

V"
_____________

12

7.29 (287)

MAX,

PIN 1 tDENilF1ER

I"

~

u=--r
.

DATE COOE

Vee

U.S.A.
8302401EC

I"

JANUARY 1986

1 vo.
10

j

,,20.06 t22Q!
_
"2o.s31.B20) - -

MAX.

0.51 1.020)

i1trmm[4
MIN.

~ ~'"'- ~,,=,~cr
2.79 t.110)

MAX.

1

3,81 (.150)
Mlr,t

1

16 '.;

I

r

H'

~

:;;

1

13
"

'2
11

10

DIMENSIONS IN M1LL1MET£RS AND (INCHES).

GND

Features

Description

•
•
•
•
•

The 8302401 EC is the DESC selected item drawing assigned
by DOD for the 6N140A optocoupler which is in accordance
with MIL-STD-883 class B testing. Operating characteristic
curves for this part can be seen in the 6N140A data sheet.
This hybrid microcircuit is capable of operation over the full
military temperature range from ~55° C to +125 0 C.

RECOGNIZED BY DESC·
HERMETICALLY SEALED
MIL-STD-883 CLASS B TESTING
HIGH DENSITY PACKAGING
PERFORMANCE GUARANTEED OVER -55° C
TO +125°C AMBIENT TEMPERATURE RANGE

The 8302401 EC contains four GaAsP light emitting diodes,
each of which is optically coupled to a corresponding
integrated high gain photon detector. The high gain output
stage features an open collector output providing both lower
output saturation voltage and higher speed operation than
possible with conventional photo-darlington type optocouplers. Also, the separate Vee pin can be strobed low as an
output disable or operated with supply voltages as low as
2.0V without adversely affecting the parametric performance.

• 1500 V de WITHSTAND TEST VOLTAGE
• LOW INPUT CURRENT REQUIREMENT: 0.5 rnA
• HIGH CURRENT TRANSFER RATIO: 1500%
TYPICAL
• LOW OUTPUT SATURATION VOLTAGE: 0.1 V
TYPICAL
• LOW POWER CONSUMPTION
• HIGH RADIATION IMMUNITY

The high current transfer ratio at very low input currents
permits circuit designs in which adequate margin can be
allowed for the effects of CTR degradation over time.

Applications
•
•
•
•
•
•
•
•
•

The 8302401 EC has a 300% minimum CTR at an input
current of only 0.5mA making it ideal for use in low input
current applications such as MOS, CMOS and low power
logic interfacing or RS-232C data transmission systems.
Compatibility with high voltage CMOS logic systems is
assured by the 18V Vee and by the guaranteed maximum
output leakage (IOHi at 18V. The shallow depth of the IC
photodiode provides better radiation immunity than
conventional phototransistor couplers.

MILITARY/HIGH RELIABILITY SYSTEMS
ISOLATED INPUT LINE RECEIVER
SYSTEM TEST EQUIPMENT ISOLATION
DIGITAL LOGIC GROUND ISOLATION
EIA RS-232C LINE RECEIVER
MICROPROCESSOR SYSTEM INTERFACE
CURRENT LOOP RECEIVER
LEVEL SHIFTING
PROCESS CONTROL INPUT/OUTPUT
ISOLATION

The test program performed on the 8302401 EC IS In
compliance with DESC drawing 83024 and the provisions of
method 5008, Class B of MIL-STD-883.

'Defense Electronic Supply Center IDESC) is an agency of the Department of Defense lOaD).

.

8-91

Recommended operating
Conditions
Max.

Units

2

jJ.A

0.5

5

mA

2.0

18

V

Symbol Min.
Input Current, Low Level
(Each Channen

IpL

Input Current, High Level
(Each Channell

IFH

Supply Voltage

Vee

Absolute Maximum Ratings
Storage Temperature Range .......... -65° C to +150° C
Operating Temperature .............. -55°C to +125°C
Lead Solder Temperature .............. 260° C for 10 s.
(1.6mm below seating plane)
Output Current, 10 (each channell ............... 40 mA
Output Voltage, Va (each channell ....... -0.5 to 20 VI11
Supply Voltage, Vee .................... -0.5 to 20 VI11
Output Power Dissipation (each channell ...... 50 mWl21
Peak Input Current (each channel,
S 1 ms duration) .............................. 20 mA
Average Input Current, IF (each channell ....... 10 mAI 3 1
Reverse Input Voltage, VR (each channell ............ 5V

100% SCreening
MIL-STD-883, METHOD 5004 (CLASS B DEVICES)
Test Screen

Method

Conditions

1. Precap Internal Visual

2017

2. High Temperature Storage

100a

Condition C. TA 150 o e,
Time'" 24 hours minimum

3. Temperature Cycling

1010

Condition C, -65°C to +150°C, 10 cycles

4. Constant Acceleration

2001

Condition A, 5KG's, Yl axis only

5. Fine Leak

1014

Condition A

6. Gross Leak

1014

Condition C

7. Interim Electrical Test

8. Burn-In

9. Final Electrical Test
Electrical Test
Electrical Test

10. External Visual

1015

2009

8-92

Optional
Condition B, Time = 160 hours minimum
TA = +125°C, Vee= 1aV, IF"" 5 mA,
10 10 mA iFigure 1)
Group A, Subgroup 1,5% PDA applies
Group A, Subgroup 2
Group A, Subgroup 3

Quality Conformance Inspection
GROUP A ELECTRICAL PERFORMANCE CHARACTERISTICS
Parameter

Current Transfer Ratio

Symbol

hF (CTRI

Test Conditions

~!O;~V, VCc=4.5V
.
,o-0.4V, ~5V
iF=5ml},)(0:=0.4V, Vi!:

.5V

Limits

Group A
Subgroups

Min.

1,2,3

300

1,2,3
1,2'1'.3

Max.

Note

%

4,5

%

4,5

...,.:ii.%'

4/5

1"300 , 'il;
200

!.tnll

I F;;;0.5mAloL~1.5mAVcc-4.5V

1,2,3

0.4

V

4

IF=SmA, IOl"'10rhA, Vcc=4.5V

1,2,.3

0.4

V

4

10H

I F=2pA

1,2;:3

250

pA

4

10HX

Vo=Vcc=lBV

1,2,3

250

pA

4,6

Logic Low Supply Current

ICCL

IF1=I Fr I F3=IF4=1.6mA
Vcc=1BV

1,2,3

4

mA

Logic High Supply Current

ICCH

IF1=1 FrIF3=IF4=OmA
Vcc=1BV

1,2,3

40

pA

Input Forward Voltage

IF=1.6mA

1,2

1.7

VF

V

4

3

1.8

V

4

Input Reverse Breakdown
Voltage

BVR

I R=1 OJ.lA

V

4

I nput~Outpul Insulation
Leakage Current

11·0

45% Relative Humidity, T=25" C,
1=55., V,.0=1S00 Vdc

1

1.0

pA

7, 12

Capacitance Between
Input-Output

C I• O

1=1 MHz, Tc=25° C

4

4

pF

4,B

9,10,11

60

j.ls

9

20

pS
pS

Logic Low Output Voltage
Logic High Output Current

VOL

1,2,3

IF"'O.SmA,RL=4.7kfl, Vcc"'S.OV
Propagation Delay Time
To Logic High At Output

tpLH

JF"'5mA, RL=680fl, Vcc=5.0V
I F=0.5mA,Rl=4.7kO, Vcc"'5,OV

Propagation Delay Time
To Logic Low AI Output

tpHL

IF=5mA, RL=680n, Vcc"'S.OV

5

10,11

30

9,10, 11

100

p$

9

5

ps

10,11

10

j.lS

Common Mode Transient
Immunity At Logic High
Level Output

CM H

I F"'O, R L=1.Skfl
IVCM f=25V p •p, Vcc=5,OV, TA=25 Q C

9,10,11

SOO

V/f.lS

9,11

Common Mode Transient
Immunity At Logic Low
Level Output

CML

Ir1.6mA, RL=1.5k!l
jVc MI=25Vp.p, VCc"'5.0V,

9, 10, 11

-500

V/j.ls

10,11

NOTES: 1. Pin 10 should be the most negative voltage at the
detector side. Keeping Vee as low as possible, but
greater than 2.0 volts, will provide lowest totalloH over
temperature.
2. Output power is collector output power plus one
fourth of total supply power. Derate at 1.66mW;o C
above 110'C.
3. Derate IF at 0.33mA/' C above 110' C.
4. Each channel
5. CURRENT TRANSFER RATIO is defined as the ratio
of output collector current, 10 , to the forward LED
input current, I F. times 100%.
6. 10Hx is the leakage current resulting from channel to
channel optical crosstalk. IF= 2J.LA for channel under
test. For all other channels, IF = 10mA.
7. Device considered a two-terminal device: Pins 1
through 8 are shorted together and pins 9 through 16
are shorted together.

8-93

TA=25~C

8. Measured between the LED anode and cathode shorted
together and pins 10 through 15 shorted together.
9. CM H is the maximum tolerable common mode transient
to assure that the output will remain in a high logic state
O.e. Vo > 2.0V).
10. CM L is the maximum tolerable common mode transient
to assure that the output will remain in a low logiC state
(I.e. Va < O.8V).
11. In applications where dV/dt may exceed 50,000 V/J.Ls
(such as a static discharge) a series resistor, Ree , should
be i ncl uded to protect the detector I C's from destructively
high surge currents. The recommended value is
lV
Ree ~ 0.6 IF (mA) kfl.
12. This is a momentary withstand test, not an operating
condition.

GROUP B TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Method

Test

Conditions

LTPD

Subgroup 1

Physical Dimensions (Not required if
Group 0 is to be performed)
Subgroup 2
Resistance to Solvents
Subgroup 3
Solderability
(LTPD applies to number of leads
inspected - no fewer than 3 devices
shall be used),
Subgroup 4
Internal Visual and Mechanical

2016

2 Devices
(no failures)

2015

4 Devices
(no failures)
Soldering Temperature of 245
for 10 seconds

2003

± 5°C

2014

15
13 Devices)

1 Device
(nO failuresl

Subgroup 5

Bond Strength
Thermocompression:
(Performed at precap, prior to seal
LTPD applies to number of bond
pulls from a minimum of 4 devices).
Subgroup 6
Internal Water Vapor Content
(Not applicable - does not contain
desiccantl

2011

Test Condition D

-

15
(4 Devices)

-

Subgroup 7

1014

Fine Leak
Gross Leak

Condition A
Condition C

5

Group A, Subgroup 1, except 11-0

15

Subgroup 8'

Electrical Test
Electrostatic Discharge Sensitivity

3015
Group A, Subgroup 1

Electrical Test
'(To be peEf2!n1ed at initial qualification onlyl

GROUP C TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test

Method

Conditions

LTPD

Subgroup 1

Steady State Life Test

1005

Condition B, Time = 1000 hours total
TA = +125°C, Vee"" 18 V,
lp= 5 mA, 10 = 10 rnA iFigure 1}

Endpoint Electricals at 1000 hours

5

Group A, Subgroup 1, 2,3

Subgroup 2

Temperature Cycling

1010

Constant Acceleration

2001

Condition A, 5KGs, Y I axis only

Fine Leak

1014

Condition A

Gross Leak

1014

Condition C

Visual Examination

1010

Per Visual Criteria of MethOd 1010

Condition C, -65°C to +150°C,
10 cyCles

Endpoi nt Electricals

Group A, Subgroup 1,2,3

8-94

15

GROUP D TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Method

Test

LliPO

Conditions

Subgroup 1
Physical DimenSions

2016

Subgroup 2
Lead Integrity

2004

Test Condition 82 !lead fatigue)

15

Subgroup 3
Thermal Shock

1011

Condition 8, (-55°C to +125°Cl
15 cycles min.
Condition C, (-65°C to +150°Cl
100 cycles min.

15

Temperature Cycling

1010

Moisture Resistance
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals

1004
1014
1014

Subgroup 4
Mechanical Shock

15

Condition A
Condition C
Per Visual Criteria of Method 1004
Group A, Subgroup 1, 2,3
Condition e, 1500G, t'" 0.5 ms,
5 blows in each orientation
Condition A
Condition A, 5KGs, Y, axis only
Condition A
Condition C
Per Visual Criteria of Method 1010
Group A, Subgroup 1, 2,3

15

1009
1014
1014
1009

Condition A min.
Condition A
Condition C
Per Visual Criteria of Method 1009

15

1018

5,000 ppm Maximum
Water content at 1000 C

2002

Vibration Variable Frequency
Constant Acceleration
Fine Leak
Gross L.eak
Visual Examination
Endpoint Electricals

2007
2001
1014
1014
1010

Subgroup 5
Salt Atmosphere
Fine Leak
Gross Leal<
Visual Examination
Subgroup 6
Internal Water Vapor
Content

Subgroup 7
Adhesion of Lead Finish
SubgroupS
Lid Torque
Inot applicable-solder seaD

2025

15

2024

5 Devices
(0 failures)

200n
1
-2

16 r15
14
13
12
11

~3

V,N
2.3V

-=

Voc +2.4V

~'8V

TYP,

+f

3 Devices
(0 failures)
5 Devices
(1 failure)

4
5

lOn

~6
~7

8

9r-

200n
TYP,

TA =+125°C

Figure 1. Operating Circuit for Elurn-In and Steady State Life Tests.

8-95

Flin-

DUAL CHANNEL
HERMETICALLY
SEALED
OPTOCOUPLER

HEWLETT

a!~ PACKARD

4N55
4N55/883B

TECHNICAL DATA

t;;
t;;
ICC

I

3

,

ANODE:
4 VF

'¥

CATHODE _

~
'
Is

-

ICC

7
ANODE:

a

I,

~

f

CATHODE _

/'

.'

_

10.

Is

-

JANUARY 1986

Outline Drawlng*
ry.~

i:>ATE-COOE

~C

h

v. VBI

r=-=7='==9~~1T
S.13(.3201

14

~

13
GND
16
VB

~~~......,.lT
pIN 1 tDENTJffER

~~C
9

~
10
GND

12

VB

DIMENSIONS rN MllUM£TERS AND IINCHES),

Features

Applications

• PERFORMANCE GUARANTEED OVER -55°C TO +125°C
AMBIENT TEMPERATURE RANGE
• MIL-STD-883 CLASS B TESTING
• HERMETICALLY SEALED
• HIGH SPEED: TYPICALLY 400k BIT/S
• 2 MHz BANDWIDTH
• OPEN COLLECTOR OUTPUTS

• HIGH RELIABILITY SYSTEMS

•
•
•
•

• LINE RECEIVERS
• DIGITAL LOGIC GROUND ISOLATION
• ANALOG SIGNAL GROUND ISOLATION
• SWITCHING POWER SUPPLY FEEDBACK
ELEMENT
• VEHICLE COMMAND/CONTROL

18 VOLT Vec
DUAL-IN-LiNE PACKAGE
1500 Vdc WITHSTAND TEST VOLTAGE
HIGH RADIATION IMMUNITY

• SYSTEM TEST EQUIPMENT
• LEVEL SHIFTING

Descriotion
The 4N55 consists of two completely independent optocouplers in a hermetically sealed ceramic package. Each
channel has a light emitting diode and an integrated
photon detector. Separate connections for the photodiodes
and output transistor collectors improve the speed up to a
hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance.
.

shallow depth of the IC photodiode provides better
radiation immunity than conventional phototransistor
couplers.
Hewlett-Packard's new high reliability part type 4N55/883B
meets Class B testing requirements for MIL-STO-883. This
part is the recommended and preferred device from the
4N55 product family for use in high reliability applications.

The 4N55 is suitable for wide bandwidth analog
applications, as well as for interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF
= 16mA over the full military operating temperature range,
-55 0 C to +125 0 C. The 18V Vee capability will enable the
designer to interface any TTL family to CMOS. The
availability of the base lead allows optimized gain/
bandwidth adjustment in analog applications. The

See the selection guide at the front of this section for other
devices in this family.
CAUTION: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD J. It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which may
be induced by ESD .

• J EDEC Registered Data

8-96

Absolute Maximum Ratings*

Emitter Base Reverse Voltage, VE60 ............ 3.0V
Base Current, 16 (each channel) ................ 5mA
Output Power Dissipation (each channel) ..... 50mW
Derate linearly above 100° C free air
temperature at a rate of l.4mW/o C.

Storage Temperature .............. -65° C to +150° C
Operating Temperature ............ -55° C to +125° C
Lead Solder Temperature ............ 260° C for 10 s
(1.6mm below seating plane)
Average Input Current, IF (each channel) ...... 20mA
Peak Input Current, IF (each
channel, :'0 lms duration) ..........•....... 40mA
Reverse Input Voltage, VR (each channel) ......... 5V
Input Power Dissipation (each channel) ...... 36mW
Average Output Current, 10 (each channel) ..... SmA
Peak Output Current, 10 (each channel) ....... 16mA
Supply Voltage, Vcc (each channel) ..... -0.5V to 20V
Output Voltage, Vo (each channel) ...... -0.5V to 20V

TABLE I.

Recommended operating
Conditions (EACH CHANNEL)
Symbol
Input Current. Low Level

IFL

Supply VOltage

Vee

Min. Max.
2

Units'

250

p.A

18

V

TABLE II.

Electrical Characteristics
Parameter
Current Transfer Ratio
Logic High Output Current
Output Leakage Current
Logic Low Supply Current
Logic High Supply Current

/Symbol
CTR'

-ssoc to +125°C, unless otherwise specified

S

Max_ 0611s

20

Test Conditions

Fig. Notei

%

1p=16mA. Vo=O.4V. Vcc"4.5V

Z;3

1,2

4

1

10H

20

100

I'A

IF=O, IF (Other channell"20mA
Vo=Vcc=16V

IOH1'

70

250

p.A

fF=250p.A, IF lother channell=20mA
Vo=Vcc=16V

4

1

ICCL'

35

200

p.A

IF1=IFF20mA, Vcc=16V

5

1

tf=OmA. IF lother channell=20mA
Vcc=18V

ICCH'

Input Forward Voltage

VF'

Input Reverse Breakdown
Voltage

8VR'

Input-Output Insulation
Leakage Current

Ii-o'

Propagation Delay Time
to Logic High at Output

tPLH'

Propagation Delay Time
to Logic Low at Output

TA =

Min. Typ."

0.2

10

I'A

1.5

1.6

V

IF=20mA

V

IR=lOp.A

3

2.0

tPHL'

1

1

1

1.0

p.A

45% Relative Humidity,
TA=25'C, 1=5s, V,-o=1500Vdc

6.0

1'5

RL=8.2KIi, CL=50pF
IF=16mA. Vcc=5V

6,9

1

p's

RL =8.2Kfi. CL=50pF
IF=16mA, Vcc=5V

6,9

1

2.0

0.4

1

3.9

• JEDEC Registered Data .

.. All typical values are at Vee" 5V. TA" 25° C.

TABLE III.

Typical Characteristics at TA =25°C
Parameter
Temperature Coefficient
of Forward Vottage

Symbol

Typ.

Units

2.VF
2.TA

-1.5

mV/oC
pF

Test Conditions

Fig. Note

IF = 20 mA

1

1=1 MHz, VF=O

1

Ii

VI-o=500 Vdc

pF

1=1 MHz

1
1,4

Input Capacitance

Cin

Resistance \Input-Output I

R,-o

120
1012

Capacitance (Input-Outputl

C,-O

1.0

Input-Input Insulation
Leakage Current

Ii-I

1

pA

45% Relative Humidity,
V,-1=500Vdc, 1=55

5

Capacitance (Input-Inputl

CH

pF

1=1 MHz

5

Transistor DC Current Gain

"FE
2.10
2.lf

.55
150

-

Vo=5V, lo=3mA

1

21

%

Vcc=5V, Vo=2V

7

1

10

1.6

Small Signal Current
Transfer Ratio
Common Mode Transient
I mm unity at Logic High
Level Output

CMH

1000

V/p.s

If=O. fk=8.2kli
VCM=10V p - p
Vo {min) = 2.0 V

Common Mode Transient
Immunity at Logic Low
Level Output

CML

-1000

V/p.s

1p=16mA, RL=8.2Kfi
VCM=10V p - p
Vo (max,) = 0.8 V

10

1.7

Bandwidth

BW

2

MHz

RL"'100fi

8

8

8-97
- - - - - . _ - - - - - - _ .. -

Notes:
1. Each channel.
2. Current Transfer Ratio is defined as the ratio of output collector current, 10, to the forward LED input current, IF, times 100%. CTR is
known to degrade slightly over the unit's lifetime as a function of input current, temperature, signal duty cycle and system on time.
Refer to Application Note 1002 for more detail. In short it is recommended that designers allow at least 20-25% guard band
for CTR degradation.
3. Measured between pins 1 through 8 shorted together and pins 9 through 16 shorted together.
4. Measured between each input pair shorted together and the output pins for that channel shorted together.
5. Measured between pins 3 and 4 shorted together and pins 7 and 8 shorted together.
6. CMH is the steepest slope (dVldt) on the leading edge of the common mode pulse, VCM, for which the output will remain in the
logic high state (i.e. Vo > 2.0 VI.
7. CML is the steepest slope (dV/dl) on the trailing edge of the common mode pulse, VCM, for which the output will remain in the
logic low state {i.e. Vo < 0.8 VI.
8. Bandwidth is the frequency at which the ac output voltage is 3dB below the low frequency asymptote.
9. This is a momentary withstand test, not an operating condition.
1000

'E",

100

15cr:

10

....

~

cr:

=>
o

1.0

cr:

"
:z

o.

~

0.0 1

cr:

~

J-

~

0,00

~

'"
'§

/'

'",

E

/~

/V

'~

.25L ~

T,

.1.

20

I .1

18 r- ~~c" "2~YC -+--+-+-+-f..-+-I
'6f..--~-I-+--+-+--+-+-+~f--~

....

15cr:

/

cr:

=>
o

....

ii'....
=>

V

",
2

,§/
1.10

1.20

'.40

1.30

8

1.50

V F - FORWARD VOLTAGE - VOLTS

;::

'cr:"

'.5

100

~,

Vee" 5V

~

....

Vo "'DAV

2

'........cr:"

TA •

1.0

15
cr:

2,'C

-

'F' 250 pA,"

=--

cr:

=>
0
=>

@
N
:;

"
;:
0
c;

"'cr:"

g
,

0
2

,

o.

".f"A'I'F

0.0

'",

x

J'

,/

100

~O~

....

40

cr:

=>
0

35

~

30

g

20

iil
s:
0

c;

g
,

4.0
3.6

1/1
L

25

15

lA '" +25"C

~

o

,/

o

~

/

";;:o
g:

~ '/

10

~

/
0

V

~

~V

40

~

15

20

V
JM

M

j

T

mO'~MO

°c

-!,.t,l

./'

Vee'" 5V

t PLH/

2.8

,/

2.4

./

2.0
1.6

1.2

... V

V

-

O. 8
0.4

10

,/

3.2 -RL -~.2kn

2

L

/

/

,

::t

'/ ~L215'C

/

~

II

crrl":~

TA - TEMPERATURE _

TA --55'C

/

20

Figure 4. Logic High Output Current vs. Temperature.

50

15II:

18

Vee -Vo -1aV

~

IF - INPUT DIODE FORWARD CURRENT - mA

45

;"

0,00 1

Figure 3. Normalized Current Transfer Ratio vs. Input Diode
Forward Current.
~,

'rr

'",

2
10

16

'~TH~R C~AN~ELlI20 'i'A

0

J:

0
0.1

14

',,, " -'F IOTHER CHANNELl" / '

=>

~

cr:

=>
0

....0

10

....

15
cr:

II:

12

Figure 2. DC and Pu Ised Transfer Characteristic

Figure 1. Input Diode Forward Characteristic.
0

10

Vo - OUTPUT VOLTAGE - V

o

25

-60 ·40 -20

0

20

40

~

60

80 100 120 140

IF -INPUT DIODE FORWARD CURRENT - rnA

Figure 6. Propagation Delay vs. Temperature.

Figure 5. Logic Low Supply Current vs. Input Diode
Forward Current.

8-98

o
~

2.0

a:
~

1.8 -ITA.12S'C

l-

.

1.4

:::>

1.0

.,
~

VO=2V
1.6~VCC·5V

i;;

.!!!
I

.,
z

1.2

a:
a:

t,)

~

O,B

~=
t

I

i

0.6

~

D.2

o
z

o

5lNO.4
a:

o

I

~a:

......
IIF-116m

I

15

20

10

5l
N
~
:;;

rI-

a:
o
z

-300::1-

25

IF - QUIESCENT INPUT CURRENT - mA

LJ...J..JUJJ:!'.::-1--l--'-.w..w;1";.O:-.L..Jw.../.J..C~10

O

f - FREQUENCY - MHz

Figure 7. Normalized Small Signal Current Transfer Ratio vs.

Figure 8a. Frequency Response

Quiescent Input Current.

,-r---o+15V
+5V

0---..,.----,
~t----~---oVo

Figure 8b. Frequency Response

'tr.

VCM

tf

= Bns

r----------------~

o~

IF

I

I

Vo

5V

I

Vo

~
.._------------- 5V

SWITCH AT A: IF'" OmA

Vo -------------------...~ VOL
SWITCH AT B: IF=16mA

r----..,

r-------,16
PULSE

GEN.

~

zo""son

r-t---r~-1C---o+5V

.---l---f.!.::.----t-----o +5V

tr"'5ns

' -.......--oVo

................-oVo
IF MONITOR

16

50% DUTY CYCLE

1/1 = 100.,

10% DUTY CYCLE
l/fo;;; lOOps

Figure 9. Switching Test Circuit*.

* J EDEC Registered Data

-----_ .. _ - - -

Figure 10. Test Circuit for Transient Immunity and
Typical Waveforms.

8-99

Vee
lOGIC FAMIl.Y
DEVICtNO.
Vee
RL5%
TOLERANCE

lSTTL
54l$14
5V

CMOS
CD4010llBM
SV 15V

"ISkfl

s.2kflI22kfl

*THE EQUIVALENT OUTPUT LOAD RESISTANCE IS AFFECTED
BY THE LSTTL INPUT CURRENT AND IS APPROXIMATEL v B.2kn.

This is a worst case design which takes into account 25%
degradation of CTA. See App. Note 1002 to assess actual
degradation and lifetime.

Figure 11. Recommended Logic Interface.

LOGIC GATE

MIL-STO-883 CLASS B TEST PROGRAM

PART NUMBERING SYSTEM

Hewlett-Packard's 883B optocouplers are in compliance
with MIL-STD-883, Revision C. Deviations listed below are
specifically allowed in DESC drawing 81028 for an H.P.
Optocoupler from the same generic family using the same
manufacturing process, design rules and elements of the
same microcircuit group.

Commercial Product

Class B Product

4N55

4N55/883B

Testing consists of 100% screening to Method 5004 and
quality conformance inspection to Method 5005 of MILSTD-883. See the pages of this section entitled Hermetic
Optocoupler Product Qualification for details of this test
program.

Vac
+3.5V

4

•

200n

270n

14

200n

4N55/883B Clarifications:
I. 100% screening per MIL-STD-883, Method 5004 constant acceleration - condition A not E.

13

12
11

10

270n

~

-=

II. Quality Conformance Inspection per MIL-STD-883,
Method 5005, Group A, B, C and D.
Group A Group B Group C Group D -

Vee
+5,5V

16
15

CONDITIONS: IF '" 20 rnA

TA = +125°C

Figure 12. Operating Circuit for Burnein and Steady State Life
Tests

See table below for specific electrical tests.
No change
Constant Acceleration - Condition A not E.
Constant Acceleration - Condition A not E.

GROUP A - ELECTRICAL TESTS
LTPD
Subgroup 1

* StatIc tests at TA = 25"C, IOH, BVA, ICCL, ICCH, CTR, VF, 10Hl and Ii-o.
Subgroup 2

2

* Static tests at TA = +125° C, 10H, 8VR ICCL ICCH, CTR, VF and 10Hl

3

Subgroup 3

* Static tests at TA = _55 C, IOH, BVR ICCl, ICCH, crR, VF and IOHI
0

5

Subgroups 4, 5, 6, 7 and 8
These subgroups are non-applicable to this device type
Subgroup 9

* Switching tests at T A = 25° C, tPLH and tPHL

2

Subgroup 10

* Switching tests at TA = +125° C, tPLH and tPHL

3

Subgroup 11

* Switching tests at TA = -55·C, IpLH and tPHL

5

* Limits and Conditions per Table II.

8-100

•

•
•

•
•

•
•
•
• • ••
•
••

9-1

Applications
Because technology is growing and changing so
rapidly, HP's commitment to customers includes
an extensive applications department. In an effort
to anticipate design needs and answer design
questions, this team of engineers has published a
complete library of applications literature available
through HP sales and service offices, authorized
distributors and direct from the factory. A listing
of all application bulletins and application notes is
on the facing page.

These handbooks sell for $12 each, U.S. price.
Look in the back of this catalog for a business
reply card to order yours. For individual
application notes either use the business reply
card or call your nearest HP sales and service
office. Ask for the Components department. A
listing of these offices can be found in the
appendix, section 10.
In 1981, the second edition of the
Optoelectronics/Fiber Optics Applications
Manual was published by McGraw-Hill. This
hard-bound manual was prepared by HP's
applications engineering staff and contains design
information on LED's, displays, optocouplers and
fiber optics. It can be purchased from an
authorized distributor or directly from McGrawHill for $25.

This year application handbooks which contain
complete application notes bound together with
additional product information are available. Now
you can keep the design information
you need from year-to-year.

9-2

Applications Listing
MOTION SENSING AND CONTROL
Model
Pub. No. (Date)

Description

AN-1011
5953-9393 (12/83)

Design and Operational Considerations
for the HEDS-5000 Incremental Shaft
Encoder

AN-1025
5954-0920 (9/85)

Applications and Circuit Design for the
HEDS-7500 series Digital Potentiometer

AB-59
5953-9365 (7/83)

AB-61
5953-9361 (8/83)

Description
HP 16800A/16801 A Bar Code Reader
Configuration Guide for a DEC VT-100 or
Lear Siegler ADM-31 to a DEC PDP-11
Computer

HP 16800A/16801 A Bar Code Reader
Configuration Guide for an IBM 4955F
Series 1 Process Control CPU/Protocol
Converter and an IBM 3101 Terminal

AB-63
5953-9363 (8/83)

HP 16800A/16801 A Bar Code Reader
Configuration Guide for an IBM 5101
Personal Computer

AB-68
5953-9382 (11/83)

H P 16800A/16801 A Bar Code Reader
Configuration Guide for a MICOM
Micro280 Message Concentrator

AB-1008
5953-0460 (1/81)

Optical Sensing with the HEDS-1000

AN-1013
5953-9387 (11/83)

Elements of a Bar Code System

Consideration of CTR Variations in
Optically Coupled Isolator Circuit
Designs

5953-0406 (11179)

Threshold Sensing for Industrial Control
Systems with the HCPL-3700 Interface
Optocoupler

AN-1018
5953-9359 (8/83)

Designing with HCPL-4100 and
HCPL-4200 20 mA Optocouplers

AN-1023
5954-1003 (3/85)

Radiation Immunity of HP Optocouplers

AN-1024
5954-1006 (3/85)

Ring Detection with the
HCPL-3700 Optocoupler

Model
Pub. No. (Date)

Description

AB-65
5953-9370 (9/83)

Using 50/125 I'm Optical Fiber with
Hewlett-Packard Components

AB-71
5954-1021 (12/85)

Using 200 I'm PCS Optical
Fiber with HP Components

AN-915
5953-0431 (4/80)

Threshold Detection of Visible and
Infrared Radiation with PIN Photodiodes

AN-1000
5953-0463 (1182)

Digital Data Transmission with the HP
Fiber Optic System

AN-1022
5954-0979 (1185)

High Speed Fiber Optic Link Design with
Discrete Components

LIGHT BARS AND BAR GRAPH ARRAYS
Model
Pub. No. (Date)

OPTOCOUPLERS
Model
Pub. No. (Date)

AN-1002
5953-7799 (10/82)

FIBER OPTICS

HP 16800A/16801 A Bar Code Reader
Configuration Guide for an IBM
3276/3278 Terminal

AB-62
5953-9362 (8/83)

Linear Applications of Optocouplers

AN-1004

BAR CODE COMPONENTS
Model
Pub. No. (Date)

AN-951-2
5963-7730 (4/82)

Description

AN-1007
5953-0452 (1/81)

Bar Graph Array Applications

AN-1012
5953-0478 (2/81)

Methods of Legend Fabrication

Description

TB-101
5954-1004 (4/85)

Fiber Optic SMA Connector Technology

TB-102
5954-1011 (5/85)

Fiber/Cable Selection for LED Based
Local Communications Systems

TB-103
5954-1017 (7/85)

High Speed Optocouplers vs. Pulse
Transformer

AB-60
5953-9347 (4/83)

Applications Circuits for
HCPL-3700 and HCPL-2601

AB-69
5953-9384 (10/83)

CMOS Circuit Design using HewlettPackard Optocouplers

AN-939
5953-9368 (10/73)

High Speed Optocouplers

AN-947
5953-7759 (6/82)

Digital Data Transmission USing Optically
Coupled Isolators

AN-948
5953-7716 (12/81)

Performance of the 6N135, 6N136 and
6N137 Optocouplers in Short to Moderate
Length Digital Data Transmission
Systems

AN-951-1
5953-7794 (10/82)

Applications for Low Input Current,
High Gain Optocouplers

SOLID STATE LAMPS
Mbdel
Pub. No. (Date)

9-3

Description

AB-1
5952-8378 (1/75)

Construction and Performance of High
Efficiency Red, Yellow and Green
LED Materials

AN-945
5952-0420 (10/73)

Photometry of Red LEOs

AN-1005
5953-0419 (3/80)

Operational Considerations for LED
Lamps and Display Devices

AN-1017
5953-7784 (10/82)

LED Solid State Reliability

AN-1019
5954-0921 (1/86)

Using the HLMP-4700/-1700/-7000 Series
Low Current Lamp

AN-1021
5953-0861 (5/84)

Utilizing LED Lamps Packaged on Tape
and Reel

AN-1027
5954-0893 (7/85)

Soldering LED Components

AN-1028
5954-0902 (9/85)

Surface Mount Subminiature LED Lamps

SOLID STATE DISPLAYS

APPLICATIONS HANDBOOKS

Model
Pub. No. (Date)

Description

Model
Pub. No. (Date)

AB-4
5952-8381 (4/75)

Detection and Indication of Segment
Failures in 7-Segment LED Displays

HPBK-4000
(1986)

AB-64
5953-9366 (9/83)

Mechanical and Optical Considerations
for the 0.3" Microbright
Seven-Segment Display

LED Indicators and Displays Applications
Handbook
$10

HPBK-5000
(1986)

AB-70
5954-0868 (11/84)

Green LED Displays and GEN III ANVIS
Night Vision Goggle Compatibility

Optocouplers and Fiber Optics
Applications Handbook
$10

AN-934
5952-0337 (11/72)

5082-7300 Series Solid State Display
Installation Techniques

AN-1006
5953-0439 (7/80)

Seven Segment LED Display Applications

AN-1015
5953-7788 (11/82)

Contrast Enhancement Techniques for
LED Displays

AN-1016
5953-7787 (3/84)

Using the HDSP-2000 Alphanumeric
Display Family

AN-1026
5954-0886 (6/85)

Designing with HP's Smart Display - the
HPDL-2416

Description

APPLICATIONS MANUAL
Model
Pub. No. (Date)
HPBK-2000
McGraw-Hili
(no. 93203815)
(1981)

9-4

Description
Optoelectronics/Fiber-Optics
Applications Manual
$25

-~----------

Abstracts
APPLICATION BULLETIN 1
Construction and Performance of High Efficiency Red,
Yellow and Green LED Materials

and an IBM Series 1 Process Control CPU/Protocol
Converter. In this configuration the IBM Series 1 is
connected to an IBM mainframe computer.

The high luminous efficiency of Hewlett-Packard's High
Efficiency Red, Yellow and Green lamps and displays is
made possible by a new kind of light emitting material
utilizing a GaP transparent substrate. This application
bulletin discusses the construction and performance of
this material as compared to standard red GaAsP and
red GaP materials.

This application bulletin provides information to aid in
configuring the HP 16800A/16801 A bar code reader with
an IBM 5101 Personal Computer.

APPLICATION BULLETIN 4
Detection and Indication of Segment Failures in Seven
Segment LED Displays

APPLICATION BULLETIN 64
Mechanical and Optical Considerations for the 0.3"
Microbright Seven-Segment Display

The occurrence of a segment failure in certain
applications of seven segment displays can have
serious consequences if a resultant erroneous message
is read by the viewer. This application bulletin discusses
three techniques for detecting open segment lines and
presenting this information to the viewer.

The need to conserve space in electronic instruments
has increased drastically in the drive to design more
compact, more portable equipment. Hewlett-Packard has
facilitated the saving of space in the design of front
panels with the introduction of the Microbright, HewlettPackard's new HDSP-73001-7400/-7500/-7800 series
compact 0.3"seven segment displays. Smaller than the
conventional 0.3" device, the Microbright requires less
space without sacrificing display height and is also
Hewlett-Packard's most sunlight viewable seven segment
display.

APPLICATION BULLETIN 63
HP 16800A/16801A Bar Code Reader Configuration
Guide for an IBM 5101 Personal Computer

APPLICATION BULLETIN 59
HP16800A/16801A Bar Code Reader Configuration
Guide for a DEC VT-100 or Lear Siegler ADM-31 to a
DEC PDP-11 Computer

This application bulletin provides information to aid in
configuring the HP 16800A/16801 A bar code reader with
a DEC-PDP-11 computer, and either a DEC-VT-100
terminal or a LEAR SIEGLER ADM-31 terminal.

This application bulletin deals with several issues in the
use of the Microbright. Optical filtering is covered, with
recommendations on filters to use over the devices.
Adjusting the package height and recommended sockets
are also presented, followed by a discussion on the
brightness of the display.

APPLICATION BULLETIN 60
Applications Circuits for HCPL-3700 and HCPL-2601

APPLICATION BULLETIN 65
Using 50/125 Itm Optical Fiber with Hewlett-Packard
Components

Simple circuit illustrations are given for use of the
HCPL-3700 threshold detection optocoupler for ac or
dc sensing requirements. Programmable threshold
levels are given for the HCPL-3700.
Also, a basic LSTTL to LSTTL isolation interface circuit
for 10 MBd operation is given which uses the high
common mode transient immunity HCPL-2601
optocoupler.

Applications Bulletin 65 explains factors that influence
the power coupled into various fiber diameters and
numerical apertures. Test results showing coupled
power from HP LED sources into 100/140 It metre and
50/125 It metre fiber are included.

APPLICATION BULLETIN 61
HP 16800A/16801A Bar Code Reader Configuration
Guide for an IBM 3276/3278 Terminal

APPLICATION BULLETIN 68
HP 16800A/16801A Bar Code Reader Configuration
Guide for a MICOM Micr0280 message concentrator

This application bulletin provides information to aid in
configuring the HP 16800A/16801A bar code reader with
an IBM 3276/3278 terminal to an IBM 327213274 Remote
Communications Controller. In this configuration the
IBM 3272/3274 is connected to an IBM mainframe
computer.

In some applications, multiple bar code readers may be
required to input data to a logging terminal or a central
processing unit. However, connecting each unit to a
CPU may utilize more input/output ports than desired.
A port concentrator will allow several devices to be
connected using only one port to the CPU. This
application bulletin provides information to aid in
configuring the HP 16800A/16801A bar code reader with
a MICOM Micr0280 Message Concentrator.

APPLICATION BULLETIN 62
HP 16800A/16801A Bar Code Reader Configuration
Guide for an IBM 4955F Series 1 Process Control CPU!
Protocol Converter and an IBM 3101 Terminal

This application bulletin provides information to aid in
configuring the HP 16800A/16801 A bar code reader in
an eavesdrop configuration with an IBM 3101 terminal

9-5

Abstracts (cont.)
APPLICATION BULLETIN 69
CMOS Circuit Design Using Hewlett-Packard
Optocouplers

commercial, industrial and military applications. The
unit integrates the display character and associated
drive electronics in a single package. This advantage
allows for space, pin and labor cost reductions, at the
same time improving overall reliability.

Within this .application bulletin are CMOS isolation
interface circuits for use with the various, low input
current, Hewlett-Packard optocouplers, specifically, the
HCPL-2200/2300/2731 and 6N139 devices. Advantages
of and recommendations for different input and output
circuit configurations are given in tabular form for low
power operation at various signalling rates.

The information presented in this note describes
general methods of incorporating this series into varied
applications.
APPLICATION NOTE 945
Photometry of Red LEDs

APPLICATION BULLETIN 70
Green LED Displays and GEN III ANVIS Night Vision
Goggle Compatibility

Nearly all LEDs are used either as discrete indicator
lamps or as elements of a segmented or dot-matrix
display. As such, they are viewed directly by human
viewers, so the primary criteria for determining their
performance is the judgment of a viewer. Equipment for
measuring LED light output should, therefore, simulate
human vision.

The military is incorporating GEN III Aviator's Night
Vision Imaging System (ANVIS) night vision goggles
(NVG) to provide vision capability during night
operations. Aircraft instrument lighting and other
equipment must be compatible with the GEN III ANVIS
goggles so as not to interfere with their operation.

This application note will provide answers to these
questions:

NVG compatibility can be achieved with HewlettPackard green LED displays when combined with the
proper NVG filters. The topics discussed in this
application bulletin include a description of the GEN
III ANVIS night vision goggles, NVG compatibility
problems, the military ANVIS Radiance requirement for
NVG compatibility and technical data on NVG filters for
use with green LED displays.

1. What to measure (definitions of terms)
2. How to measure it (apparatus arrangement)
3. Whose equipment to use (criteria for selection)
APPLICATION NOTE 947
Digital Data Transmission Using Optically Coupled
Isolators
Optocouplers make ideal line receivers for digital data
transmission applications. They are especially useful for
elimination of common mode interference between two
isolated data transmission systems. This application
note describes design considerations and circuit
techniques with special emphasis on selection of line
drivers, transmission lines, and line receiver termination
for optimum data rate and common mode rejection.
Both resistive and active terminations are described in
detail. Specific techniques are described for
multiplexing applications, and for common mode
rejection and data rate enhancement.

APPLICATION BULLETIN 71
200-llm PCS Fiber with Hewlett-Packard Fiber Optic
Transmitters and Receivers
A description of the properties of 200-llm PCS fiber is
given and the performance when used with HewleltPackard fiber optic components is described in the form
of graphs and tables.
APPLICATION NOTE 915
Threshold Detection of Visible and Infrared Radiation
with PIN Photodiodes

APPLICATION NOTE 948
Performance of the 6N135/617 Series of Optocouplers in
Short to Moderate Length Digital Data Transmission
Systems

PIN photodiodes are compared with multiplier
phototubes in an 11-point summary of their relative
merits. This is folloWed by a description of PIN
photodiode device structure, mode of operation, and
analysis of the diode's equivalent circuit.

Describes use of HP 6N135/6/7 optocouplers as line
receivers in a TTL-TTL compatible NRZ (nonreturn-tozero) data transmission link. It describes several useful
total systems including line driver, cable, terminations,
and TTL compatible connections.

Four pre-amplifier circuits are presented. Two of these
describe use of operational amplifiers - one for linear
response, the other for logarithmic response. The other
two circuits are designed for substantially higher
speeds of response, using discrete components to
obtain wide bandwidth as well as high sensitivity.

APPLICATION NOTE 951-1
Applications for Low Input Current, High Gain
Optocouplers

APPLICATION NOTE 934
5082-7300 Series Solid State Display Installation
Techniques

Optocouplers are useful in line receivers, logic isolation,
power lines, medical equipment, and telephone lines.
This note discusses use of the 6N138/9 series high CTR
optocouplers in each of these areas.

The 4N5X, HDSP-07XX/08XX/09XX, and 5082-73XX
series Numeric/Hexadecimal indicators are an excellent
solution to most standard display problems in

9-6

Abstracts (cont.)
power loss; in power back up systems which need an
early warning of power loss in order to save special
microprocessor memory information or switch to
battery operation, etc. Applications of the HCPL-3700
interface optocoupler are addressed in this note. The
isolation and threshold detection capability of the
HCPL-3700 allows it to provide unique features which
no other optocoupler can provide. Addressed in this
note are the advantages of using this optocoupler for
isolating systems as well as the device characteristics,
dc/ac operational performance with and without
filtering, simple calculations for setting desired
thresholds, and four typical application examples for
the HCPL-3700. Additional coverage is given to
protection considerations for the optocoupler from the
standpoint of power transients, thermal conditions, and
electrical safety requirements of the industrial control
environment.

APPLICATION NOTE 951-2
Linear Applications of Optocouplers

Although optocouplers are not inherently linear, the
separate photodiodes used in Hewlett-Packard
optocouplers provide better linearity as well as higher
speed of response than phototransistor detectors.
Linearity enhancement by use of paired optocouplers is
described with specific circuit examples offering DC-to25 KHz response. These examples illustrate the relative
merits of differential and servo techniques.
A circuit with linear AC response to 10 MHz is also
described for analog optocouplers having the
photodiode terminals externally accessible.
Digital techniques of voltage-to-frequency conversion
and pulse width modulation are discussed. Their
linearity is quite independent of optocoupler linearity
but require use of high speed optocouplers for low
distortion.

APPLICATION NOTE 1005
Operational Considerations for LED Lamps and Display
Devices

APPLICATION NOTE 1000
Digital Data Transmission with the HP Fiber Optic
System

In the design of a display system, which incorporates
LED lamps and display devices, the objective is to
achieve an optimum between light output, power
dissipation, reliability, and operating life. The
performance characteristics and capabilities of each
LED device must be known and understood so that an
optimum design can be achieved. The primary source
for this information is the LED device data sheet. The
data sheet typically contains Electrical/Optical
Characteristics that Iist the performance of the device
and Absolute Maximum Ratings in conjunction with
characteristic curves and other data which describe the
capabilities of the device. A thorough understanding of
this information and its intended use provides the basis
for achieving an optimum design. This application note
presents an in-depth discussion of the theory and use
of the electrical and optical information contained
within a data sheet. Two designs using this information
in the form of numerical examples are presented, one
for dc operation and one for pulsed (strobed) operation.

Fiber optics can provide solutions to many data
transmission system design problems. The purpose of
this application note is to aid designers in obtaining
optimal benefits from this relatively new technology.
Following a brief review of the merits, as well as the
limitations, of fiber optics relative to other media, there
is a description of the optical, mechanical, and electrical
fundamentals of fiber optic data transmission system
design. How these fundamentals apply is seen in the
detailed description of the Hewlett-Packard system. The
remainder of the note deals with techniques
recommended for operation and maintenance of the
Hewlett-Packard system, with particular attention given
to deriving maximum benefit from the unique features it
provides.
APPLICATION NOTE 1002
Consideration of CTR Variations in Optocoupler Circuit
Designs

A persistent, and sometimes crucial, concern of
designers using optocouplers is that of the current
transfer ratio, CTR, changing with time. The change, or
CTR degradation, must be accounted for if long,
functional lifetime of a system is to be guaranteed. This
application note will discuss a number of different
sources for this degradation.

APPLICATION NOTE 1006
Seven Segment LED Display Applications

This application note begins with a detailed explanation
of the two basic product lines that Hewlett-Packard
offers in the seven segment display market. This
discussion includes mechanical construction
techniques, character heights, and typical areas of
application. The two major display drive techniques, dc
and strobed, are covered. The resultant tradeoffs of
cost, power, and ease of use are discussed. This is
followed by several typical instrument applications
including counters, digital voltmeters, and
microprocessor interface applications. Several different
microprocessor based drive techniques are presented
incorporating both the monolithic and the large seven
segment LED displays.

APPLICATION NOTE 1004
Threshold Sensing for Industrial Control Systems with
the HCPL-3700 Interface Optocoupler

Interfacing from industrial control systems to logic
systems is a necessary operation in order to monitor
system progress. This interfacing is found in process
control systems, programmable controllers,
microprocessor subsystems which monitor limit and
proximity switches, environmental sensors and ac line
status; in switching power supplies for detection of ac

9-7

Abstracts (cont.)
The application note contains a discussion of intensity
and color considerations made necessary if the devices
are to be end stacked. Hewlett-Packard has made
several advances inthe area of sunlight viewability of
LED displays. The basic theory is discussed and
recommendations made for achieving viewability in
direct sunlight. Information concerning display
mounting, soldering, and cleaning is presented. Finally,
an extensive set of tables has been compiled to aid the
designer in choosing the correct hardware to match a
particular application. These tables include seven
segment decoder/drivers, digit drivers, LSI chips
designed for use with LEDs, printed circuit board edge
connectors, and filtering materials.

considerations for assembly, test, trouble shooting and
repair are presented. Finally some circuits and software
concepts are introduced which will be useful in
interfacing the shaft encoder to a digital or
microprocessor based system. Appendix A summarizes
the uses and advantages of various encoder
technologies while Appendix B provides guidance for
selecting DC motors suitable for use with the HEDS5000 and HEDS-6000.
APPLICATION NOTE 1012
Methods of Legend Fabrication

Hewlett-Packard LED Light Bar Modules inscribed with
fixed messages or symbols can be used as economical
annunciators. Annunciators are often used in front
panels to convey the status of a system, to indicate a
selected mode of operation "Or to indicate the next step
in a sequence. This application note discusses
alternative ways the message or symbols (legends) can
be designed. A selection matrix is provided to assist in
the selection of the most appropriate method of legend
fabrication. Each fabrication method is explained in
detail along with mounting and attachment techniques.
Finally, prevention of cross-talk is discussed for legend
areas of amulti-segmented light bar.

APPLICATION NOTE 1007
Bar Graph Array Applications

This application note begins with a description of the
manufacturing process used to construct the 10
element array. Next is a discussion of the package
design and basic electrical configuration and how they
affect designing with the bar graph array. Mechanical
information including pin spacing and waVe soldering
recommendations are made.
Display interface techniques of two basic types are
thoroughly discussed. The first of these two drive
schemes is applicable in systems requiring display of
analog signals in a bar graph format. The second major
drive technique interfaces bar graph arrays in systems
where the data is of a digital nature. Examples of
microprocessor controlled bar graph arrays are
presented.
.

APPLICATION NOTE 1013
Elements of a Bar Code System

This application note describes in detail the elements
that make up most bar code systems. Included is a
discussion of the fundamental system design, detailed
discussion of 7 popular code symbologies, a section on
symbol generation, and methods of data entry. A
glossary of terms and a reference section are also
included. This is an excellent publication for people
who are just learning about bar code, or for those who
need a more comprehensive understanding of the
subject.

Summarized for the design engineer are tables of
available integrated circuits for use with bar graph
arrays. Finally, a list of recommended filters is included.
APPLICATION NOTE 1008
Optical Sensing with the HBCS-1100

This application note gives the basic optical flux
coupling. design for discrete emitters and detectors.
Presents the concepts of modulation transfer function,
depth of field, and reflective sensor design. It also
discusses the optical and electrical operation of the
HBCS-1100 High Resolution optical sensor. Finally, it
presents electrical design techniques which allow the
HBCS-1100 to interface with popular logic families.

APPLICATION NOTE 1015
Contrast Enhancement Techniques for LED Displays

APPLICATION NOTE 1011
Design and Operational Considerations for the HEDS5000 Incremental Shaft Encoder

This application note discusses contrast enhancement
technology for both indoor and outdoor ambients, the
theory of Discrimination Index and provides a list of
tested contrast enhancement filters and filter
manufacturers.

Contrast enhancement is essential to assure readability
of LED displays in a variety of indoor and outdoor
ambients. Plastic filters are typically used for contrast
enhancement with indoor lighting and glass circular
polarized filters are typically used to achieve readability
in sunlight ambients.

This application note is directed toward the system
designer using the HEDS-5000 and HEDS-6000
modular incremental shaft encoders. First the note
briefly analyzes the theory of design and operation of
the HEDS-5000 and HEDS-6000. A practical approach
to design considerations and an error analysis provide
an indepth treatment of the relationship between motor
mechanical parameters and encoding error
accumulation. Several design examples demonstrate
the analysis techniques presented. Operation

APPLICATION NOTE 1016
Using the HDSP-2000 Alphanumeric Display Family

The HDSP-2000 family of alphanumeric display
products provides the designer with a variety of easy-touse display modules with on board integrated circuit
drivers. The HDSP-2000 family has been expanded to
provide three display sizes with character heights

9-8

--------_.

- - - - - - - - - - - - - _..

__ . _ . _ - _ . _ - - - - - _ . _ - - - -

Abstracts (cont.)
ranging from 3.8 mm (0.15") to 6.9 mm (0.27"), four
display colors, and both commercial and military
versions. These displays can be arranged to create both
single line and multiple line alphanumeric panels.

Costs of implementing lamp drive circuits are
discussed, as in power conservation in TTL and circuits
involving higher Voltages. Finally, telecommunications
and battery information are presented.

This note is intended to serve as a design and
application guide for users of the HDSP-2000 family of
alphanumeric display devices. It covers the theory of
the device design and operation, considerations for
specific circuit designs, thermal management, power
derating and heat sinking, and intensity modulation
techniques.

APPLICATION NOTE 1021
Utilizing LED Lamps Packaged on Tape and Reel
Hewlett-Packard offers many of its LED lamps
packaged on tape and reel for radial insertion by
automatic equipment during high volume production of
PC board assemblies.
This application note is a guide to the use of tape and
reel LED lamps in the automatic insertion process.
Discussed are the LED lamp tape and reel
configuration, the radial lead insertion process, PC
board design considerations, a method to maintain LED
lamp alignment during soldering and lamp stand-off
height information.

APPLICATION NOTE 1017
LED Solid State Reliability
Light emitting diode display technology offers many
attractive features including multiple display colors,
sunlight readability, and a continuously variable intensity
adjustment. One of the most common reasons that LED
displays are designed into an application, however, is
the high level of reliability of the LED display. HewlettPackard has taken a leadership role in setting reliability
standards for LED displays and documenting reliability
performance.

APPLICATION NOTE 1022
High Speed Fiber Optic Link Design with Discrete
Components
As the technology of fiber optic communication
matures, design considerations for large volume
applications focus as much on cost and reliability, as
bandwidth and bit-error-rate. This application note
describes a 100 MBd fiber optic communication link
which was implemented with low-cost, non-exotic
technology, including LED transmitter, PIN photodiode
detector, off-the-shelf ICs and discrete components, laid
out on epoxy-glass circuit boards.

This note explains how to use the reliability data sheets
published for HP LED indicators and displays. It
describes the LED indicator and display packages,
defines device failures, and discusses parameters
affecting useful life, failure rates and mechanical test
performance.
APPLICATION NOTE 1018
Designing with the HCPL-4100 and HCPL-4200 Current
Loop Optocoupler

APPLICATION NOTE 1023
Radiation Immunity of Hewlett-Packard Optocouplers

Digital current loops provide unique advantages of large
noise immunity and long distance communication at
low cost. Applications are wide and varied for current
loops, but one of the critical concerns of a loop system
is to provide a predictable, reliable and isolated
interface with the loop. The HCPL-4100 (transmitter)
and HCPL-4200 (receiver) optocouplers provide for
easy interfacing to and from a current loop with minimal
design effort. Within this application note a complete
description of the HCPL-4100/4200 devices is given
along with applications for digital, 20 mA, simplex, half
duplex and full duplex loops. These loops can be either
point-to-point or multidrop configurations. Factors
which affect data performance are discussed. Circuit
arrangements with specific data performance are given
in graphical and tabular form.

Opening with a quotation from MIL-HDBK-279
describing optocouplers containing photodiodes as
superior to optocouplers containing phototransistors,
the text describes the properties of ionizing radiation
(particles and photons) and how it affects the
performance of optocouplers. Graphs show
degradation of CTR (Current Transfer Ratio) in the
6N140 as a function of gamma total dose (up to 1000
rad lSi] and as a function of total neutron fluence (up to
6 x 10 12 n/cm 2). A table gives radiation hardness
requirements for various military requirements.
APPLICATION NOTE 1024
Ring Detection with the HCPL-3700 Optocoupler
With the increased use of modems, automatic phone
answering equipment, private automatic branch
exchange (PABX) systems, etc., low-cost, reliable,
isolated ring detection becomes important to many
electronic equipment manufacturers. This application
note addresses the definition of ringing requirements
(U.S.A. and Europe), applications of the HCPL-3700
optocoupler as a simple, but effective, ring detector. A
design example is shown with calculations to illustrate
proper use of the HCPL-3700. Features which are
integrated into the HCPL-3700 provide for predictable
detection, protection and isolation when compared to
other optocoupler techniques.

APPLICATION NOTE 1019
Using the HLMP-4700/-1700/-7000 Series Low Current
Lamps
Hewlett-Packard manufactures a series of LED lamps
that are designed for operation at 2 mA DC. These
lamps are available in high efficiency red, yellow, and
high performance green in a variety of package styles.
These lamps allow the designer to reduce system power
dissipation, and drive circuit costs.
This application note contrasts electrical characteristics
of the low-current lamp with HP's conventional lamp.

9-9

- - - - -_._._---_._ ... _.

Abstracts (cont.)
APPLICATION NOTE 1025
Applications and Circuit Design for the HEDS-7500
series Digital Potentiometer

APPLICATION NOTE 1028
Surface Mount Subminiature LED Lamps

Modern printed circuit boards are being assembled with
surface mounted components, replacing through hole
mounted components in many traditional applications.
Hewlett-Packard has surface mount options for its
HLMP-6000/7000 series of subminiature LED lamps,
Options 011 and 013 for "gull wing" leads and Option
021 for "yoke" leads for inverted mounting.

This application note demonstrates some of the uses for
the Hewlett-Packard HEDS-7500 series digital
potentiometer, explains how a digital potentiometer
works, and explains some of the advantages of a digital
potentiometer over a standard resistive potentiometer.
In addition, this application hote provides some
examples of circuitry which will interface the digital
potentiometer to a microprocessor, and provides
mechanical design considerations and available options
for the HEDS-7500 series digital potentiometer.

This application note provides information on how to
surface mount and vapor phase reflow solder these
surface mount subminiature LED lamps.

APPLICATION NOTE 1026
Designing with HewleU-Packard's Smart Display - The
HPDL-2416

The trend in LED Alphanumeric displays is to simplifiy a
designer's job as much as possible by incorporating on
board character storage, ASCII character generation,
and multiplexing within the display. The HPDL-2416 is a
four character alphanumeric display which incorporates
a 64 character ASCII decoder and an on board CMOS
IC to perform these functions. This application note is
intended to serve as a design and application guide for
users of the HPDL-2416. The information presented will
cover: electrical description, electrical design
considerations, interfacing to micro-processors, preprogrammed message systems, mechanical and
electrical handling, and contrast enhancement.
APPLICATION NOTE 1027
Soldering LED Components

The modern printed circuit board is assembled with a
wide variety of semiconductor components. These
components may include LED lamps and displays in
combination with other components. The quantity of
solder connections will be many times the component
count. Therefore, the solder connections must be good
on the first pass through the soldering process. The
effectiveness of the soldering process is a function of
the care and attention paid to the details of the process.
It is important for display system designers and PC
board assembly engineers to understand the aspects of
the soldering process and how they relate to LED
components to assure high yields.
This application note provides an in depth discussion
on the aspects of the soldering process and how they
relate to LED lamps and display components, with the
objective of being to serve as a guide towards achieving
high yields for solder connections.

TECHNICAL BRIEF 101
Fiber Optic SMA Connector Technology

Technical Brief 101 discusses tradeoffs between various
SMA connector techniques and provides a contact
matrix of manufacturers versus SMA connector type.
TECHNICAL BRIEF 102
Fiber/Cable Selection for LED Based
Local Communications Systems

Technical Brief 102 is intended to assist the first time
user of fiber optics with the selection of a fiber cable
that best meets desired system requirements. Issues
discussed in Technical Brief 102 include: Tradeoffs
between various fiber types, the effect of LED emitters
on fiber performance, coupled power versus numerical
aperture and factors that influence cable selection. A
contact matrix that lists fiber cable manufacturers
versus cable type is also included.
TECHNICAL BRIEF 103
High Speed Optocouplers

VS.

Pulse Transformers

For high speed signaling with ground loop isolation,
pulse transformers are often used. Here are summarized
briefly the difficulties encountered in the use of pulse
transformers, such as rise-time, sag, and interwinding
capacitance. A table summarizes the parameters of
Hewlett-Packard optocouplers designed for high speed
signaling. A second table summarizes the advantages of
using these optocouplers instead of pulse transformers.

9-10

•

•

•

•
•
• •
• • ••
••
""';.::;C'"

;:.">,

10-1

HP Cotnponents
Authorized Distributor
and Representative Directory
United States
Alabama

California (cont.)

Hall-Hark Electronics
!l900 Bradfo'rd Drive
Huntsv ille 35807
(205) 837-8700

Hamil ton Electro Sales
9650 De Soto Avenue
Chatsworth 91311
(818) 700-6500

Hamil tonI Avnet

Hamil ton Electro Sales
3170 Pullman Street
Costa Mesa 92626
(714) 641-4166

!l9!10 Research Drive N.W.

Huntsville 35805
(205) 837-7210
Schweber Electronics
2227 Drake Avenue

Suite 14
Huntsville 35805
(205) 882-2200

Arizona
Hamil tonI Avnet
505 South Madison
Tempe 85281
(602) 231-5100

Schweber Electronics
11049 N. 23rd. Drive
Suite 100
Phoenix 85029
(602) 997-4874

California
Hall-Mark Electronics
8130 Remmet Avenue

Canoga Park 91304
(818) 716-7300
Hall-Hark Electronics
2221 E. Rosecrans Blvd.
Sui te 104
El Segundo 90245
(213) 643-9101
Hall-Mark Electronics
1110 Ringwood Court
San Jose 95131
(408) 946-0900
Hall-Hark Electronics
111831 Franklin Avenue

Tustin 92680
(714) 669-4700
Hamil tonI Avnet
3002 East G Street

Ontario 91764
(714) 989-4602
Hamil tonI Avnet
4103 Northgate Blvd.
Sacramento 95834
(916) 925-2216
Hamil toni Avnet

, Connecticut i conti
Hamil toni Avnet
Commerce Drive
Commerce Industrial Park
Danbury 06810
(203) 797-1100
Schweber Electronics
Finance Drive
Commerce Industrial Park
Danbury 06810
(203) 748-7080

HAmil ton Electro Sales
10950 W. Washington Blvd.
Culver City 90230
(213) 558-2121

Florida

Schweber Electronics
21139 Victory Blvd.
Canoga Park 91303
(818) 999-4702

Hall-Hark Electronics
15301 Roosevelt Blvd.
Sui te 303
Clearwater 33520
(813) 530-4543

Schweber Electronics
1225 W. 190th Street
Sui te 360
Gardena. CA 90248
(213) 327-8409

Hall-Mark Electronics
7648 Southland Blvd.
Suite 100
Orlando 32809
(305) 855-4020

Schweber Electronics
17822 Gillette Avenue
Irvine 92714
(714) 863-0200
Schweber Ele~tronics
1771 Tribute Road
Sui te B
Sacramento 95815
(916)' 929-9732

Colorado

Connecticut

Hamil toni Avnet
1175 Bordeaux Dr i ve
Sunnyvale 94086
(408) 743-3355

Hall-Hark Electronics
Barnes Industrial Park
33 Village Lane
P.O. Box 5024
Wallingford 06492
(203) 269-0100

Hamil toni Avnet
9219 Qui vira Road
Overland Park 66215
(913) 888-8900
Schweber Electronics
10300 W. 103rd. Street
Suite 200
Overland Park 6621 ~
(913) 492-2922

Georgia

Maryland
Hall-Mark Electronics
10240 Old Columbia Road
Columbia 21046
(301) 988-9800

Schweber Electronics
303 Research Drive
Suite 210
Norcross 30092
(404) 449-9170

10-2

Kansas
Hall-Mark Electronics
10815 Lakeview Drive
Lenexa 66215
(913) 888-4747

Hall-Mark Electronics
6~10 Atlantic Boulevard
Suite 115
Norcross 30071
(404) 447-8000
Hamil toni Avnet
5825 D. Peachtree Corners
East
Norcross 30092
(404) 447-7507

11545 Viewridge Avenue

San Diego 92123
(619) 571-7510

Iowa

Schweber Electronics
5270 North Park Place N.E.
Cedar Rapids 52402
(319) 373-1417

Schweber Electronics
2830 N. 28th Terrace
Hollywood 33020
(305) 927-0511

Schweber Electronics
8955 E. Nichols Avenue
Highland Tech Business Plaza
Englewood 80112
(303) 799-0258

Indiana
Hamil toni Avnet
485 Gradle Drive
Carmel 46032
(317) 844-9333

Hamil toni Avnet
6801 N.W. 15th Way
Ft. Lauderdale 33309
(305) 971-2900

Schweber Electronics
215 N. Lake Blvd.
Altamonte Springs 32701
(305) 331-7555

Hamil toni Avnet
8765 East Orchard
'Suite 708
Englewood 80111
(303) 740-1000

Schweber Eiectronics
904 Cambridge Drive
Elk Grove Village 60007
(312) 364- 3750

Hamil toni Avnet
915 33rd Avenue S.W.
Cedar Rapids 52404
(319) 362-4757

Hamil toni Avnet
6947 University Blvd.
Winter Park 32792
(305) 628- 3888

Schweber Electronics
90 East Tasman Drive
San Jose 95134
(408) 946-7171

Hamil toni Avnet
1130 Thorndale Avenue
Bensenville 60106
(312) 860-7700

Hall-Mark Electronics
3161 S.W. 15th Street
Pompano Beach 33069-4800
(305) 971-9280

Hamil toni Avnet
3197 Tech Drive North
St. Petersburg 33702
(813) 576-3930

Schweber Electronics
6750 Nancy Ridge Drive
Bldg. 7. Suites 0 & E
San Diego 92121
(619) 450-0454

Illinois
Hall-Mark Electronics
1177 Industrial Drive
Bensenville 60106
(312) 860- 3800

Hamil toni Avnet
6822 Oak Hall Lane
Columbia 21045
(301) 995-3500
Schweber Electronics
9330 Gaither Road
Gai thersburg 20877
(301) 840-5900

------~

~~--~-~~~--~-~~~~-

-~-~------

-~----~-~~----

Massachusetts

New Jersey

Ohio

Texas

Hall-Hark Electronics
6 Cook Street
Pinehurst Park
BUlerica 01521
(617) 935-9777

Hall-Hark Electronics
107 Fairfield Road
Suite lB
Fairfield 07006
(201) 575-4415

Hall-Mark Electronics
4460 Lake Forest Drive
Suite 202
Cincinnati 45242
(513) 563-5980

Hall-Hark Electronics (Corp.)
11333 Pagemill Drive
Dallas 75234
(214) 343-5000

Hamil tonI Avnet

50 Tower Office Park
Woburn 01801
(6,17) 273-7500

Hall-Hark Electronics
1000 Midlantic Drive
Mt. Laurel 08054
(609) 235-1900

Hall-Hark Electronics
5821 Harper Road
Solon 44139
(216) 349-4632

Schweber Electronics
25 Wiggins Avenue
Bedford 01730
(617) 275-5100

Hamil tonI Avnet
1 Keystone Avenue
Cherry Hill 08003
(609) 424-0100

Hall-Mark Electronics
6130 Sun burry Road
Sui te B
Westerville 43081
(614) 891-4555

Michigan

Hamil tonI Avnet
10 Industrial Road
Fairfield 07006
(200 575-3390

Hamil tonI Avnet
2215 29th Street S.E.
Grand Rapids 49508
(616) 243-8805
Hamil tonI Avnet

32-487 Schoolcraft Road
Livonia 48150
(313) 522-4700

Schweber Electronics
18 Madison Road
Fairfield 07006
(201) 227-7880

New Mexico

(313) 525-8100

Hamil tonI Avnet
2524 Baylor S.E.
Albuquerque 87106
(505) 765-1500

Minnesota

New York

Hall-Hark Electronics
7838 12th Avenue, So.
Bloomington 55420
(612) 854-3223

Hall-Mark Electronics
1 Comac Loop
Ronkonkoma 11779
(516) 737-0600

Schweber Electronics
12060 Hubbard Drive
Livonia -48150

Hamil tonI Avnet

933 Motor Park Way
Hauppauge 11788
(516) 231-9800

Schweber Electronics
7424 W. 78th Street
Edina 55435
(612) 941-5280

Hamil tonI Avnet
333 Hetro Park Drive
Rochester 14623
(716) 475-9130

Missouri

Hamil tonI Avnet
103 Twin Oaks Drive
Syracuse 13206
(315) 437-2641

Hall-Hark Electronics
13750 Shoreline Drive
Earth Ci ty 63045
(314) 291-5350
Hamil toni Avnet

131-43 Shoreline Court
Earth City 63045
(314) 344-1200
Schweber Electron 105
502 Earth City Expwy.
Suite 203
Earth City 63045
(314) 739-0526

New Hampshire
Hamil toni Avnet

-4-4-4 East Industrial Park Dr.
Manchester 03103
(603) 624-9400
Schweber Electronics
Bed ford Farms, Bldg. 2
Kilton & South Rlv,er Road
Manchester 03102

(603) 625-2250

Hamil tonI Avnet
945 Senate Drive
Dayton 45459
(513) 433-0610
Hamil tonI Avnet
777 Brooksedge Blvd.
Westerv ille 43081
(614) 882-7389
Schweber Elec tron 1c s
23880 Commerce Park Road
Beachwood 44122
(216) 464-2970
Schweber Electronics
7865 p'aragon Road
Suite 210
Dayton 45459
(513) 439-1800

Hamil tonI Avnet

Minneapolis 55343
(612) 932-0600

10300 Bren Road E.

Hamil tonI Avnet
4588 Emery Industrial Parkway
Cleveland 44128
(216) 831-3500

Schweber Electronics
3 Town Line Circle
Rochester 14623
(716) 424-2222
Schweber Electronics
Jericho Turnpike
Westbury 11590
(516) 334-7474

Oklahoma
Hall-Hark Electronics
5460 S. 103rd East Avenue
Tulsa 74145
(918) 665-3200
Schweber Electronics
4815 S. Sheridan
Suite 109
Tulsa 74145
(918) 622-8000

Oregon
Hamil tonI Avnet
6024 S. W. Jean Road
Bldg. C, Suite 10
Lake Oswego 97034
(503) 635-8831

Hall-Hark Electronics
12211 Technology Blvd.
Austin 78727
(512) 258-8848
Hall-Hark Electronics
10375 Brockwood Road
Dallas 75238
(214) 553-4300
Hall-Hark Electronics
8000 Westglen
Houston 77063
(713) 781-6100
Hamil tonI Avnet
2401 Rutland
Austin 78758
(512) 837-8911
Hamil tonI Avnet
8750 West Park
Houston 77063
(713) 780-1771
Hamil tonI Avnet
2111 W. Walnut Hill Lane
Irving 75062
(214) 659-4111
Schweber Electronics
6300 La Calma Drive
Sui te 240
Austin 78752
(512) 458-8253
Schweber Electronics
4202 Beltway Drive
Dallas 75234'
(214) 661-5010
Schweber Electronics
10625 Richmond Avenue
Sui te 100
Houston 77042
(713) 784-3600

Utah
Hamil tonI Avnet
1585 West 21st S.
Salt Lake Ci ty 84119
(801) 972-2800

Washington
Hamil tonI Avnet
14212 H.E. 21st Street
Bellevue 98006
(206) 453-5844

Pennsylvania
North Carolina
Hall-Mark Electronics
5237 North Boulevard
Raleigh 27604
(919) 872-0712
Hamil tonI Avnet
3510 Spring Forest Road
Raleigh 27604
(919) 878-0810
Schweber Electronics
1 North Commerce Center
5285 North Boulevard
Raleigh 27604
(919) 876-0000

Hamil tonI Av net
2800 Liberty Avenue
Pi ttsburgh 15222
(412) 281-4150
Schweber Electronics
231 Gibral ter Road
Horsham 19044
(215) 441-0600
Schweber Electronics
1000 R.I.D.C. Plaza
Sui te 203
Pittsburgh 15238
(412) 782-1600

Wisconsin
Hall-Mark Electronics
16255 West Lincoln Ave.
New Berlin 53151
(414) 797-7844
Hamil tonI Avnet
2975 Moorland Road
New Berlin 53151
(414) 784-4510
Schweber Electronics
150 S. Sunnyslope Road
Brookfield 53005
(414) 784-9020

10-3
~~~-~-~

.

~---~~-~-~~-~-~-----~---~

International
Australia

Canada (conI.)

Germany

Japan

VSI Electronics Pty. Ltd.
Office 8
116 Melbourne Street
North Adelaide
South Australia 5006
(61) 8 267 4848

Hi-Tech Sales Limited (REP)
102-902 St. James Street
Winnipeg, Manitoba R3G 3J7
(204) 786-3343

Distron GmbH
Behaimstrasse
D-l000 Berlin 10
(49) 30 3421041

Zentronics, Ltd.
8 Tilbury Court
Brampton, Ontari"o L6T 314
(416) 451-9600

Ryoyo Electric Corporation
Meishin Building
1-20-19 Nishiki
Naka-Ku, Nagoya, 460
(81) 52 2030277

EBV Elektronik
Oberweg 6
D-8025 Unterhaehing
(49) 89 611051

Zentronics, Ltd.
Bay n1
3300 14th Avenue, N. E.
Calgary, Alberta T2A 6J4
(403) 272-1021

Ingenieurbuero Dreyer
Flensburger Strasse 3
D-2380 Schleswig
(49) 462H14055

VSI Electronics Pty. Ltd.
Suite 3, Bell Court
CNR. Water & Brunswick Streets
Fortitude Valley
Brisbane, Queensland 4006
(61) 7 525 022
VSI Electronics Pty. Ltd.
Suite 3
'18 Church Street
Hawthorn I Vi'ctor i a 3122
(61) 3 819 5044
VSI Electronics Pty. Ltd.

Jermyn GmbH
Postfach 1180
D-6277 Camberg
(49) 6434 230

Zentronic5, Ltd.
155 Colonnade Road
Units 17 & 18
Nepean, Ontar,io K2E 7K1
(613) 226-8840

SASCO GmbH
Hermann-Oberth Strasse 16
0-8011 Putzbrunn
HUn ich
(49) 894611-211

Unit 1

25 Brisbane Street
East 'Perth,' W.A. 6000

(61) 9 328 8499
VSI Electronics Pty. Ltd.
16 Dickson Avenue
Artarmon IN. S. W. 2064

(61) 2 439 8622

Austria
Transistor V.m.h.H
Auhofstr.

41a

A-1130 Wien
(43) 222 829451

Belgium
Diode Belgium
Luchtschlpstraat 2

Zentronic5, Ltd.
505 Locke Street
St. Laurent
Montreal, Quebec H4T lX7
(514) 735-5361

Hong Kong

Zentronics, Ltd.
Unit 108
11400 Bridgeport Road
Richmond, B.C. V6X lT2
(604) 273-5575

CET Ltd. (REP)
10/F Hua Hs ia Bldg.
64-66 Gloucester Road
(852) 5 200922

Zentronics, Ltd.
546 Weber St. N.
Unit 10
Waterloo, Ontario N2L 5C6
(519) 884-5700
Zentronies, Ltd.
590 Berry, Street
Winnipeg, Manitoba R3H OS1
(204) 775-8661

8-1140 Brussels
(32) 2 216 2100

Brazil

Denmark
Interelko APA
Silovej 18
DK-2690 Karlslunde
(45) 3 140700

Pacaembu, 746-Cl1

Sao Paulo
(55) 11 8260111

Canada
Hamilton/Avnet
Electronics Ltd.
6845 Rexwood Drive
Un i ts 3 I 4 & 5
Mississauga, Ontario L4V 1R2

(416) 677-7432
Hamil tonI Avnet
Electronics Ltd.
2795 Halpern Street
St. Laurent
Montreal, Quebec H4S lP8
(514) 335-1000
Hamilton/Avnet
Electronics Ltd.
190 Colonnade Road
Nepean, Ontario K7E 7J5
(613) 226-1700
Hi- Tech Sales Limited (REP)
Box 115
339 10th Avenue S.E.
Calgary, Alberta T2G OW2
(403) 251-4745

Finland
Field-OY
Veneentekijantie 18
SF-00210 Helsinki 21
(358) 0 6922577

Israel

France
Almex
Zone Industrielle d I Antony
48, rue de I' Aubepine
92160 Antony
(33) 1 6662112
Feutrier
8, Benoit Malon
92150 Surensnes
(33) 1 7724646
Feutrier
Rue de Trois Glorieuses
42270 St. Priest En Jarez
(33) 7 77 46733

S.C.A.I.B.
80 rue d I Areuel1
Zone Silie 137
94523 Rungis Cedex
(33) 1 6872313

Blue Star Ltd. (REP)
Sabri Complex II Floor
24 Residency Road
Bangalore 560 025
Tel: 55660

Blue Star Ltd. (REP)
Bhandari House I
7th/8th Floors
9' Nehru PI ace
New Delhi 110 024
Tel: 682547

Datatronix Electronica LTOA
Av.

Ryoyo Electric Corporation
Konwa Build ing
12-22 Tsukiji, 1-Chome
Chuo-Ku, Tokyo
(8" 3 543771
Tokyo Electron Company I Ltd.
Sinjuku-Nomura Building
Tokyo 160
(81) 3 3~34411

Korea
Supertek Korea Inc. (REP)
Han Hyo Bui Id ing
34-2 Yoido-Dong
Youngdungpo-Ku I Seoul
(82) 2 782-9076/8

Netherlands
India

Blue Star Ltd. (REP)
Sahas
414/2 Vir Savarkar Marg
Prabhadevi
Bombay 400 025
Tel: 422-6155

Rue De L I Aeronef 2

Ryoyo Electric Corporation
Taiyo Shoji Building
4-6 Nakanoshima
Ki ta-Ku, Osaka, 530
(81) 6 4481631

Computation & Measurement
Systems. Ltd. (REP)
11, Masad Street
P. O. Box 25089
Tel Aviv
(972) 3 388388

Koning en Hartman
Elektrotechniek BV
Koperwerf 30
2504 AE Den Haag
(31) 70 210101

New Zealand
VSI Electronics pty. Ltd.
123 Manukau Road, Epsom
Auckland .
(6~) 97686042
VSI Electronics Pty. Ltd.
Box 21-239
Christchurch
(64) 60928
VSI Electronics Pty. Ltd.
P.O. Box 11145
Well ington
(64) 4848922

Norway
HEFRO Teknisk A/S
P.O. Box 6596, Rodeloekka
N-0501 Oslo 5
(47) 2 380286

Italy
Celdis Italiana S.p.A.
Via Fratelli Gracchi, 36
1-20092 Cinisello Balsamo
Hilano
(39) 2 6120041

Eledra 3S S.p.A.
Viale Elvezia, 18
1-20154 Milano
(39) 2 349751

Singapore
Dynamar International Ltd. (REP)
Suite 05-11
12, Lorong Bakar Batu
Kolam Ayer Industrial Estate
Singapore 1334
(65) 747-6188

So. Africa
Advanced SemicondUctor Devices
(Pty) Ltd.
P.O. Box 2944
Johannesburg 2000 IS. A.
(27) 11 802-5820

Hi-Tech Sales Limited (REP)
7510B Kingsway
Burnaby, B.C. V3N 3C2
(604) 524-2131

10-4

Spain

Switzerland

United Kingdom

Yugoslavia

Diod e Espana

Baer!ocher AG
Foerrlibuckstrasse 110

Celd1s Ltd.
31-39 Loverock Road
Reading, Berkshire
RG3 lED
(44) 734 585171

Elektrotehna
Do Junel O. Sol. O.
Tozd Elzas O.Sol.O.
Titova 81
61001 Ljubljana
(38) 61 347749
(38) 61 347841

Avda. Brasil 5, 1st Planta
Madrid 20

(34) 14553686

Sweden
TRACO AB
Box 103
123 22 Farsta
(46) 8930000

CH-8037 Zurich
(41) 1 4.29900
Fabrimex Ag
Kirchenweg 5
CH-8032 Zurich

Farnell Electronic

(41) 1 251 2929

Canal Road

Components Ltd.

Leeds LS12 2TU
(44) 532-636311

Taiwan
Morrihan International Inc.
9F, No. 176
Fu, Hsing N. Road
Taipei

Jermyn Distribution
Vestry Estate
Qtford Road
Sevenoaks, Kent

TN14 5EU
(44) 732 450144

(86) 2 7151083

Macro Marketing Ltd.
Burnham Lane

Slough, Berkshire
SL 1 6LN
(44) 628 64422

10-5

International Sales Offices
and Representatives
Product Line Sales/Support Key

BAHRAIN

eM

Manama
BAHRAIN
Tel' 255503·255950
Telex: 84419

Components

C Computer Systems Sales Only

eH Computer Systems Hardware Sales and Services

CS
E
M
P

+

Hewlatt·Packard (C.nadal Ltd.
11120·178th SIr"t
EDMONTON, Alberta
T5S lP2
Tel: (4031 486·6666
A,CH,CM,CS,E,M,P

Gleen Salon
P.O. Box 557

Key Product line
A Analytical

Computer Systems Software Sales and Services
Electronic Instruments &: Measurement Systems
Medical Products
Personal Computation Products

P

British Columbia

Wael Pharmacy
P.O. Box 648

IMPORTANT: These symbols designata geoefal product line capability. They do
not insure sales or support availability for all products within a line. at all
locations. Contact your local sales office for information regarding locations
where HP support is available for specific products.

£,M

Hewlett·Packard (Canadal ltd.
10691 Shellbridge Way
RICHMOND,
British Columbia
V6X 2W7
Tel: (6041 270·2277
A,CH,CM,CS,E,M,P

BAHRAIN
Tel' 256123
Telex: 8550 WAll BN

BELGIUM
Hewlett·Packard Belgium S.A.lN.V.
Blvd de la Woluwe, 100
Woluwedal
B· 1200 BRUSSELS
Tel: (021 762·32·00
Telex: 23·494 paloben bru
A,CH,CM,CS,E,M,P

Indicates main office
HP distributors are printed in #alics.

Arranged Alphabetically by country

Hewlett·Packard (Canada! Ltd.
121 ·3350 Douglas Street
VICTORIA, British Columbia
V82·311
Tel: (6041 381 ·661 6
CH,CS

BERMUDA
ANGOLA
Telectra
Empresa Teenica de Equipamentos
R. BBfbosa Rodrigues, 41·10T.
C.ix, Post,1 6487

Canberra. Australia
Capital Territory
Office

LUANDA
Tel' 35515.35516

ARGENTINA
Hewlett·Packard Argentina S.A.
Montana..s 2140150
1428 BUENOS AIRES
Tel: 783·48B6/4836/4730
4705/4729
Cabla: HEWPACKARG
A,E,CH,CS,P
Biotron
S.A.C.I.M. e.l
Av Paso Colon 221, Piso 9

1399 BUENOS AIRES
Tel: 541·333·490
541·322·587
Telex: 17595 BIONAR

Hewlett·Packard Australia ltd.
261 Stirling Highway
CLAREMONT, W.A. 6010
Tel: 383·2188
Telex: 93859
Cable: HEWPARO Perth
A,CH,CM,CS,E,M,P

W~~:y. New South

AUSTRALIA
Adelaide. South Australia
Office

Office
Hewlett·Packard Australia ltd.
17-23 Talavera Road
P.O. Box 308
NORTH RYDE, N.S.W. 211 3
Tel: 888·4444
Telex: 21561
Cable: HEWPARD Sydney
A,CH,CM,CS,E,M,P

Hewlett·Packard Australia Ltd.
153 Greenhill Road
PARKSIOE, S.A. 5063
Tel: 272-5911
Telex: 82536
Cable: HEWPARO Adelaide
A,CH,CS,CM"E,M,P

AUSTRIA
Hewlett·Packard Ges.m.b.h.
Grottenhofstrasse 94
A·8052 GRAZ
Tel: 103161 291 5 66
Telex: 32375
CH,E

Brisbane, Queensland
Office
Hawlett·Packard Australia ltd.
10 Payne Road
THE GAP, Oueensland 4061
Tel: 30·4133
Telex: 42133
Cable: HEWPARD Brisbana
A,CH,CS,CM,E,M,P

+

Hewlett·Packard (Canadal ltd.
37 Shediac Road
MONCTON, New Brunswick
E1A 2R6
Tel: 15061 855·2841
CH,CS

BRAZIL
+

Hewlett·Packard Australia ltd.
31·41 Joseph Street
BLACKBURN, Victoria 3130
Tel: 895·2895
Telex: 31 ·024
Cable: HEWPARO Melbourna
A,CH,CM,CS,E,M,P

A

New Brunswick

Casilla 1383
LA PAZ
Tel: 368541
A

Perth, Westarn Australia
Office

lSANCO S.R.I.
AIASCO 2328
1416 BUENOS AIRES
Tel: 581981, 592767
Telex: c/o 9400 HPARGlNTINA

Hewl.tt·Packard (Canadal ltd.
1825 Inkster Blvd.
WINNIPEG. Manitoba
R2X lR3
Tel: (2041 694-2777
A,CH,CM,E,M,P

AmRano ltda
Av. 20 tie Octukre #2125

Melbourne, Victoria
Office
+

Manitoba

Atlantic House Building
Par-la-Ville Road
HAMILTON 5
Tel: 295·1816
Telex: 380 3589/ACT BA
P

BOLIVIA

Hewlett·Packard Australia Ltd.
121 Wollongong Street
FYSHWICK, A.C.T. 2609
Tel: 80 4244
Telex: 62650
Cable: HEWPARD Canberra
C,CH,CM,CS,E,P

£,P

Applied Computer Tecbnologies

Hewlett·Packard do Brasil I.B.C.
Ltda.
Alameda Rio Negro, 150
ALPHAVILLE
06400 Barueri SP
Tel.: (011/ 421.1311
Telex: (011) 33872 HPBR·BR
Cable: HEWPACK Sao Paulo
A,CH,CM,CS,E,M,P

Ontario
Hewlett·Packard (Canadal ltd.
3325 N. Service Rd .. Unit #3
BURLINGTON, Ontari,
l7N 3G2
Tel: (4161 335·8644
CH,M
H.wl.tt·Packard (Canadal ltd.
496 Days Road
KINGSTON, Ontario
K7M 5R4
Tel: (6131 384·2088
CH,CS

Convex/Van Den
Rua Jose Bonifacio
458 Todos as Santos
ClP 20771

RIO DE JANEIRO, RJ
Tel' 1021/ 5910197
Telex: 33487 lGlB BR
A
ANAMlO I.C.E.l ltd•.
Ru. Bage, 103
04012 SAO PAULO, SP
Tet 1011} 572.6537
Telex: 24740
M

CANADA
Hawlatt·Packard (Canadal Ltd.
3030 3rd Avenue N.E.
CALGARY, Alberta
T2A 617
Tel: (4031 235·3100
A,CH,CM,E,M,P

10-6

Hewlatt·Packarri (Canadal ltd.
900 Windmill Road
DARTMOUTH, Nova Scotia
B3B 112
Tel: (9021 469·7820
CH,CM,CS,E,M,P

Hewlett Packard do Bras" I.a C.Uda.
Praia de Botelogo 228·
6° andar·conj 614
Edificio Argentina· Ala A
22250 - RIO OE JANEIRO
RJ
Tel: (0211 552.6422
Telex: (021( 21905 HPBR·BR
Cable: HEWPACK Rio de Janeiro
A,CH,CM,E,M,P

Alberta

Hewlett·Packard Ges.m.b.h.
lieblgasse 1
P.O. Box 72
A·1222 VIENNA
Tel: (02221 23 65 11·0
Telex: 134425 HEPA A
A,CH,CM,CS,E,M,P

Nova Scotia

Hewlett·Packard (Canadalltd.
552 Newbold Street
LONOON, Ontari,
N6E 2S5
Tel: (5191 686·9181
A,CH,CM,E,M,P
+

Hewlett·Packard ICanadalltd.
6877. Goreway Drive
MISSISSAUGA, Ontario
l4V lM8
Tel: (4161 678·9430
Telex: 069·8644
A,CH,CM,CS,E,M,P

- - - _.. _ - - - - - - - - - - - - - -

CANADA (Cont'd)

CHINA (Cont'd)

Hewlett·Packard (Canada) ltd.

China Hewlett·Packard Rep. Office

P.O. Box 41B
IA lane 2, lYenang St.

2670 Oueensview Dr.
OTTAWA. Ontario
K2B BKI
Tel: 16131 820·6483
A.CH.CM.CS.E.M.P

Beiwei Rd., XuanWll District
BEIJING
Tel: 33·5950
Telex: 22601 CTSHP CN
Cable: 1920
A.CH.CM,CS.E.M.P

Hewlett·Packard (Canadal ltd.
The Oaks Place. Unit 9
2140 Regent Street
SUDBURY. Ontario
P3E 5S8
Tel: 17051 5n0202
CH

17500 Trans-Canada Highway

China·Hewlett·Packard Co. ltd.
China Resources Building. 471F
26 Harbour Road. Wanchai
HONG KONG
Tel: 5·8330633
Telex: 76793 HEWPA HX
A.C.CH.CS.E.M.P

E
Sakrco Enterprises
P.O. Box 1133
7, £1 Boustani £1 Saidy Str.

CYPRUS
Te/erexa ltd.

Talaat Harh Square
CAIRO
Tel: 762612.7651B9. 756071
Telex: 93156

14C Stassinos Avenue
NICOSIA
Tel' 62698
Telex: 2894 LEVIOO CY
E.M,P

Av. Italia 634 Santiago
Casilla 16475

Hai Dian District
BEIJING
Tel: 26·0567
Telex: 22601 CTSHP CN
Cable: 1920 Beijing
A.CH.CM.CS.E.P.M

Telex: 93830 lEA UN
Cable: INTEGASSO

P.O. Box 4809

Isicalltda.

Shuang Yu Shu, Bei San Huan Road

International Engineering Associates
24 Hussein Hegali Street
Kasr-el-Aini
CAIRO.
Tel: 23829. 21641

Apartado 10159
SAN JOSE
Tel: 24·38·20. 24·08·19
Telex: 2367 GALGUR CR
CM.E.M

Telex: 340192 ASC CK
P.C

CHINA, People's
Republic of

P.O. Box 2558
Ookki CAIRO.
Tel- 712230
Telex: 93337 EGPOR UN
Cable: EGYPOR
P.A

COSTA RICA

ASC ltda.

China Hewlett·Packard ltd.
P.Q. Box 9610. Beijing
4th Floor. 2nd Watch Factory Main Bldg.

P

Carvajal S.A.
Calle 29 Norte No. 6A·40
Apoftado Acreo 46 CALI

Cienti/ica Cost8rricense S.A.
Avenida 2, Calle 5
San Pedro de Montes de Dca

Austria 2041
SANTIAGO
Tel: 223·5946. 223-6148

Cable: Dlympiachl1e Sanliagochlle

Egyptian International
Office for Foreign Trade

Tel: 3681111
Telex: 55650

CHILE

Casilla 256·V
SANTIAGO
Tel' 225·5044
Telex: 340892 OL YMP

EGYPT
Sakrco Enterprises
P.O. Box 259
ALEXANDRIA
Tel: 602906.806020. 805302
Telex: 54333

42 EI-Zahraa Street

Hewlett-Packard (Canada) ltd.
117· t 30 Robin Crescent
SASKATOON. Saskatchewan
S71 6M7
Tel: 13061 242·3702
CH.CS

Olympia (Chilel lIda.
Av. Rodrigo de Araya

A

Compumundo
Avenida 15 # 107·80
BOGOTA D.E.
Tel- 214-4458
Telex: 45466 MARCO

HewletHackard (Canada) ltd.
1150, rue Claire Fontaine
QUEBEC CITY. Ouebec
GIR 5G4
Tel: 14181 648·0726
CH. CS

SANTIAGO
Tel' 395752. 398296
Telex: 340866 METlAB CK
A

Vallodolid 524 Madrid
P.O. box 9111
QUITO
Tel: 2·236·951
Telex: 2296 ECUAME EO

A

South Service Road
KIRKLAND. Quebec
H9J 2X8
Tel: 15141 697·4232
Telex: 058·21521
A.CH.CM.CS.E.M.P

Metro/ab S.A.

M

Nefromeilicas lfda.
Cable 123 No. 9B·31
Apartado Aereo 100·95B
BOGOTA O.E.• 10
Tel' 213·5267. 213·1615
Telex: 43415 HEGAS CO

Quebec
Hewlett·Packard (Canada) ltd,

S.s.C. Medical

40 Gelerat EI Arab Street
Mohandessin
CAIRO.

DENMARK
+

Hewlett·Packard France
13. Place Napoleon III
F·29000 BREST
Tel: 196) D3·38·35

Med/~ronics

BOGOTA 1. O.E.
Tel' 212·1466
Telex: 444001NST CO

WILLOWDALE. Ontario

Manjilas 454 of. 206

Hospitalar S.A.

Instrumentaeion
H.A. langebaek & Kier SA.
Carrerra 4a, A No. 52 A 26
Aparlado Acreo 6287

M2H 3H7
Tel: 14161 49H550
CH.E

Hewlett·Packard France
Boite Pasta Ie 503
F·25026 BESANCON.
28 rue de la Republique
F·Z5000 BESANCON
Tel: 1811 63·16·22
Telex: 361157
CH.M

Robles 625
Casilla 3590
QUITO
Tel: 545-250. 545·122
Telex: 2485 HOSPTl EO
Cable: HOSPITALAR·Ouito

COLOMBIA

Hewlett·Packard (Canadal Ltd.
3790 Victoria Park Avenue

SANTIAGO 9
Tel' 222·0222
Telex: 440283 JCYCL CI
CM.E.M

Ecuador Overseas Agencies C.A.
Calle 9 de OcWbre #B18
P.O. Box 1296
GUAYAQUIL
Tel: 306022
Telex: 3361 PBCGYE EO
M

Tel' 803844. 80599B. 810263
Telex: 20503 SSC UN
M

Hewlett·Packard A/S

Datavej 52

DK·3460 BIRKEROD
Tel: 1021 81·66·40
Telex: 37409 hpas dk
A.CH.CM.CS.E.M.P

EL SALVADOR
IPESA de EI Salvador S.A.

29 Avenida Norte 1223
SAN SALVADOR

HewletHackard Iceland
Hoeldabakka 9
11 D Reykjavik
Tel: 111 671000
A.CH.CM.CS.E.M.P

Tel' 26-685B. 26·6868
Telex: 205391PESA SAL
A.CH.CM,CS.E.P

FINLAND

Hewlett·Packard A/S
Rolighedsvej 32
DK·824D RISSKOV. Aarhus
Tel: 1061 17·60·00
Telex: 37409 hpas dk
CH.E

+

Hewlett·Packard Oy
Piispankalliontie 17
02200 ESPOO
Tel: 00356·0·86721
Telex: 121563 HEWPA SF
CH.CM.CS.P

DOMINICAN REPUBLIC

Microprog S.A.
Juan Tomas Mejia y Cotes No. 60
Arroyo Hondo
SANTO DOMINGO

FRANCE
Hewlett·Packard France
Z.1. Mercure B
Rue Berthelot
F·13763 les Milles Cedex
AIX-EN-PROVENCE
Tel: 142) 59·41·02
Telex: 410770F
A.CH.E.M.P
Hewlett·Packard France
64, rue Marchand Saillant
F·61000 ALENCON
Tel: 133) 29 04 42

Tel' 565-6268
Telex: 4510 ARENTA OR IRCA) P

ECUADOR

crEOE Cia. ltda

Avenida £loy Alfaro 1749
y Belgica
Casilla 6423 eCI
QUITO
Tel' 450·915. 243·052
Telex: 22548 CYEDE EO
P.E

10-7

+

Hewlett·Packard France
Chemin des Mouilles
Boite Postale 162
F·69130 ECULLY Cedex Ilyon)
Tel: 1761 633·61·25
Telex: 310617F
A.CH.CS.E.M.
Hewlett·Packard France
Pare d'Activite du Bois Briard
Ave. du lac
F·91040 EVRY Cedex
Tel: 6 077-6383
Telex: 692315F
E
Hewlett·Packard France
5, avenue Raymond Chanas
F·38320 EYBENS IGrenoblel
Tel: 76 62·67·96
Telex: 980124 HP GRENDB EY6E
CH
Hewlett·Packard France
Centre d'Affaire Paris·Nord
Batiment Ampere 5 etage
Rue de la Commune de Paris
Boite Postale 300
F·93153 LE BLANC MESNIL
Tel: 111 865·44·52
Telex: 211032F
CH.CS.E.M
Hewlett·Packard France
Pare d'Activites Cadera
Quartier Jean Mermoz
Avenue du President JF Kennedy
F·33700 MERIGNAC IBordeauxl
Tel: 1561 34·00·84
Telex: 550t05F
CH.E.M
Hewlett·Packard France
Immueble "les 3 B"
Nouveau Chemin de la Garde
ZAG de Bois Briand
F·44065 NANTES Cedex
Tel: 140) 50·32-22
Telex: 711085F
Hewlett·Packard France
125, rue du Faubourg Bannier
F·45000 ORLEANS
Tel: 1381 68 01 63
Hewlett·Packard France
Zone Industrielle de Gourtaboeuf
Avenue des Tropiques
F·91947 les Ulis Cedex ORSAY
Tel: 161 907·76·25
Telex: 600048F
A.CH.CM.CS.E.M.P
Hewlett·Packard France
Paris Porte·Maillot
15, Avenue de l'Amiral Bruix
F·75762 PARIS CEDEX 16
Tel: 111 502·12·20
Telex: 6t3663F
CH.M.P
Hewlett·Packard France
124, Boulevard Tourasse
F·64000 PAU
Tel: 159) 60 36 02
Hewlett·Packard France
2 Allee de la Bourgonnette
F·35100 RENNES
Tel: 1991 51-42·44
Telex: 740912F
CH.CM.E.M.P

FRANCE (Cont'd)
F·76100 ROUEN
Tel: 135) 63·57·66
Telex: 770035F
CS

Hewlett·Packard France

Boite Postala 56
F·67033 STRASBOURG Cedex
Tel: )88) 26·36·46
Telex: 890141F
CH,E,M,P
Hewlett·Packard France
Le Peripole
20 Chemin du Pigeonnier de la C
epiere
F·31083 TOULOUSE Cedex
Tel: )61)40·11·12
Telex: 531639F
A,CH,CS,E,P

Tel: (51200922
Telex: 85148 CET HX
CM

23 Harbour Road. Wanchai
HONG KONG
Tel: 5·8330222
Telex: 74766 SCHMC HX
A,M

Immeuble Pericentre
F·59658 VILLENEUVE D'ASCQ
Cedex
Tel: 120)91·41·25
Telex: 160124F
CH,E,M,P

Sabri Complex 2nd Floor, 24 Residency
BANGALORE 560 025
Tel: 556611. 578881
Telex: 0845·430
Cable: BLUESTAR
A,CM.E

..

Hewlett·Packard GmbH
Zentralbereich Marketing
Herrenberger Strass! 130
7030 BOBLINGEN
Tel: 17031)14·0
Telex: 7265739 hep
A,CH,CM,CS,E,M,P

GREAT BRITAIN
(See United Kingdom)
GREECE

A,CH,CM.CS,(M.P

Berner Slrasse 117
6000 FRANKFURT am M.in 60
Tel: 1069) 5004·1
Telex: 413249 hpffm
A,CH,CM,CS,E,M,P
Hewlett·Packard GmbH
Hewlett·Packard Strasse
Postfach 1641
6380 BAD HOMBURG v.d.H.
Tel: 106172) 400·0
Telex: 410844 hpbhg
Hewlett·Packard GmbH
Vertriebslentrum Nord
K.pst.dtring 5
2000 HAMBURG 60
Tel: 1040) 63804·0
Telex: 2163032 hphh
A,cH,CS,E,M,P

GUATEMALA

16. Ohalia. SI.

JERUSALEM 94467
Tel" 533 221, 553 242
Telex: 25231 ABIPAKRO Il
A,M

Blue Slar ltd.

7 Hare StltH!t
CALCUTTA 700001

Computation and Measurement
Syslems (CMS)ltd.
11 Masad Slreel
67060 TEL-AVIV
Tel: 388 388
Telex: 33569 Molilll
CM.CH,CS,(P

Tel' 230131, 230132
Telex: 021·7655
Cable: BLUESTAR
A,M
Blue Slar ltd.
133 Kod.mb8kkam High Road
MADRAS 600 034
Tel: 472056. 470238
Telex: 041·379
Cable: BLUESTAR
A,M

ITALY
Hewlett·Packard Italiana S.p.A.
Traversa 9ge
Via Giulio Petroni, 19
1·70124 BARI
Tel: 1080) 41·07·44
CH,M,

Hewlett·Packard Italian. S.p.A.
Via Martin Luther King, 38/111
1·40132 BOLOGNA
Tel: 1051) 402394
Telex: 511630
CH,CS,E,M
Hewlett·Packard It.li.n. S.p.A.
Via Principe Nicola 43G/C
1·95126 CATANIA
Tel: 1095) 37·10·87
Telex: 970291
CH

Blue Slar ltd.
15/16 C Wellesley Rd.
PUNE 411 011
Tel' 22775
Cable: BLUE STAR
A

A,CH,CM.CS,(M,P

HONG KONG
Hewlett·Packard Hong Kong, Ltd.
G.P.O. 80x 795
5th Aoor, Sun Hung Kai Centre
30 Harbour Road, HONG KONG
Tel: 5·8323211
Telex: 66678 HEWPA HX
Cable: HEWPACK HONG KONG
E,CH,CS,P

Blue Star ltd.
2·2·47/1108 Bo/arum Rd.
SECUNDERABAD 500003
Tel: 72057
Telex: 0155·645
Cable: BLUESTAR
A,E
Blue Star ltd
T.C. 7/603 Poomima, Marulhankulhi

TRIVANDRUM 695013
Tel: 65799
Telex: 0884·259
Cable: BLUESTAR

E

10-8
--------~--------

JERUSALEM 9/000

13, Communl¥y Center

Avenida Reforma 3·48, Zona 9
GUATEMALA CfTY
Tel: 316827, 314786
Telex: 4192 TELTRO 6U

+

P.O. Box 1270

Blue Slar ltd.

IPESA

Vertriebszentrale Deutschland

ISRAEL

Eldan Electronic Instrument ltd.

Blue Slar ltd.
Kalyan, 19 Vishwas Colony
Alkapuri, BARODA, 390 005
Tel' 65235
Cable: BLUE STAR
A

New Friends Colony
NEW DELHI 110065
Tel: 633773
Telex: 631·61120
Cable: 8LUEFROST
A.CM.(M

Tel: 3~51·911
Telex: 216286
P

Reparaturszentrum Frankfurt

Tel' (Ol! 351B20
Telex: 30439
M

Telex: 011·71193 BSSS IN
Cable: FROSTBLUE
A,CM,(M

Kostas Karaynnis S.A.
R Omirou Street
ATHENS 133
Tel: 32 30 303, 32 37 371
Telex: 215962 RKAR 6R

11854 ATHENS

Cardiac Services ltd.
Kilmore Road
Arlane
DUBLIN 5

Blue Star ltd
Sahas, 414/2 ~i Savarkar Marg
Prabhadevi
BOMBAY 400025
Tel: 422·6155, 422·6556

Hewlett·Packerd Hellas
178, Kifissias Avenue
6th Aoar
Halandri·ATHENS
Greece
Tel: 6471673, 6471543, 6472971
A.CM,E,M,P

Hewlett·Packerd GmbH

IRELAND
Hewlett·Packard Ireland Ltd.
82183 lower leeson Street
DUBLIN 2
Tel: 0001 608800
Telex: 30439
CH,CS,E,P

Blue Star ltd.
Band Box House, Prabhadevi
BOMBAY 400 025
Tel' 4933101 4933222
Telex: 011·71051
Cable: BLUESTAR
A,M

Hewlett·Packard HmbH
Geschaftsstelle Karlsruhe
Ermlisallee
7517 WALDBRONN 2
Postfach 1251
Tel: 107243) 602·0
Telex: 782838 hepk

PIAISIO S.A.
Eliopoulos Brolhers lId.

Hewlett·Packard Trading S.A.
Service Operation
AI Mansoor City 981317
BAGHDAD
Tel: 551·49·73
Telex: 212·455 HEPAIRAO IK
CH,CS

Rd.

Hewlett·Packard GmbH
Geschaftsstelle Berlin
Keithstrasse 2·4
1000 BERLIN 30
Tel: 1030) 219904·0
Telex: 183405 hpbln
A,CH,E,M,P

Hewlett·Packerd GmbH
Geschaftsstelle Dortmund
Schleef.tr.28
4600 DORTMUND 41
Tel: 10231) 45001·0
Telex: 822858 hepdod

IRAQ

INDIA
81ue Slar ltd.

GERMAN FEDERAL
REPUBLIC

+

BERCA Indonesia P. r.
Jl KUlai no. 24. SURABAYA
Tel' (031! 67118
Telex: 31146 BERSAl SB
Cable: BERSAl·SURABAYA
A,(M.P

P.O. Box 895
IS· REYKJAVIK
Tel: 1·58·20, 1·63·03
M

Hewlett·Packard GmbH
Vertriebszentrum Munchen
Eschenstrasse 5
8028 TAUFKfRCHEN
Tel: 10891 61207·0
Telex: 524985 hpmch
A,CH,CM,E,M,P

Hewlett·Packerd GmbH
Vertriebszentrum Boblingen
Schickardstrasse 2
7030 BOBLINGEN
Postfach 1427
Tel: 17031) 645·0
Telex: 7265743 hep

Tel' 340417, 341445
Telex: 46749 BERSAl IA
A,CS,(M

ICELAND

Hewlett·Packard GmbH
Vertriebszentrum Ratingen
Berliner Strasse 111
4030 RATINGEN 4
Postfach 31 12
Tel: 102102) 494·0
Telex: 589070 hprad

Hewlett·Packard France

JAKARTA-PUSAT

Elding Trading Company Inc.
Hafnarnvoll:Tryggvagotu

Hewlett·Packard GmbH
Geschaftsstelle Nurnberg
Emmericher Strasse 13
8500 NURNBERG 10
Tel: 10911) 5205·0
Telex: 623860 hpnbg
CH,CM,E,M,P

Hewlett·Packard France
Carolor
ZAC de Bois Briand
F·57640 VIGY IMetz) ,
Tel: 18) 771 20 22
CH

BERCA Indonesia P. r.
P.O. Box 24971Jkl.
Anlara Bldg.. 121h FIDor
Jl Medan Merdeka Selalan 17

Schmidl & Co. (Hong Kongilld.
181h FIDor, 6real Eagle Cenlre

Hewlett·Packard GmbH
Gesch.ftsstelle Neu Ulm
Messerschmittstrasse 7
7910 NEU ULM
Tel: 10731) 7073·0
Telex: 712816 hpulm
A,C,E

Hewlett·Packard France
9. rue Baudin
F·26000 VALENCE
Tel: 175) 42 76 16

BERCA Indonesia P. T.
P.O. Box 4961Jkl.
Jl Abdul Muis 62, JAKARTA
Tel: 21·373009
Telex: 46748 BERSAl IA
Cable: BERSAl JAKARTA
P

64·66 Gloucester Road
HONG KONG

Hewlett·Packard GmbH
Geschaftsstelle Mannheim
Rossl.uer Weg 2·4
6800 MANNHEfM 31
Tel: 10621) 7005·0
Telex: 462105 hpmhm
A,C,E

4 Rue Thomas Mann

INDONESIA

CET ltd.
10lh FIDor. Hu. Hsia, Bldg.

Hewlett·Packard GmbH
Geschaftsstelle Hannover
Heidering 37·39
3000 HANNOVER 61
Tel: 10511) 5706·0
Telex: 923259 hphan
A.CH,CM,E,M,P

Hewlett·Packard France
98 Avenue de Bretagne

+

Hewlett·Packard Italiana S.p.A.
Via G. Di Vittorio 9
1·20063 CERNUSCO SUL
NAVIGLID
IMilano)
,
Tel: 102) 923691
Telex: 334632
A,CH,CM,CS,E,M,P

-~

----------- - - - - - - -

ITALY (Cont'd)

Hewlett-Packard Italiana S,p.A.
Viale G. Modugno 33
1·16156 GENOVA PEGLI
Tel: 10101 68·37·07
Telex: 215238
E,C
Hewlett-Packard Italiana S.p.A.
Via Pelillo 15
1·35128 PADOVA
Tel: 10491 664888
Telex: 430315
A,CH,CS,E,M,

Hewlett-Packard Italiana S.p.A.
Corso Svizzera. 185

1·10144 TORINO
Tel: 10111 74 4044
Telex: 221079
A,CS,CH,E

JAPAN
Yokogawa·Hewlett·Packard Ltd.
152-1, Onna

ATSUGI, Kanagawa, 243
Tel: 104621 25·0031
CM,C,E
Yokogawa-Hewlett·Packard Ltd.
Meiji·Seimei Bldg. 6F
3·1 Hon Chiba·Cho
CHIBA, 280
Tel: 104721 25 7701
E,CH,CS
Yokogawa-Hewlett·Packard Ltd.
Yasuda-Seimei Hiroshima Bldg.

6-11, Han-dori, Naka-ku
HIROSHIMA, 730
Tel: 10821241·0611
Yokogawa-Hewlett·Packard ltd.
Tawa Building

2·3, Kaigan-dori, 2 Chorne Chuo·ku
KOBE, B50
Tel: 1078) 392·4791
C,E
Yokogawa·HewletHackard Ltd.
Kurnagaya Asahi 82 Bldg.
3·4 Tsukuba
KUMAGAYA, Saitama 360
Tel: 104851 24·6563
CH,CM,E
Yokogawa·Hewlett·Packard Ltd.
Asahi Shinbun Oaiichi Seimei Bldg.
4·7, Hanabata·cho
KUMAMOTO, 860
Tel: 10963) 54·7311
CH,E
Yokogawa·Hewlett·Packard ltd.
Shin·Kyoto Center Bldg.
614, Higashi·Shiokoji·cho
Karasuma·Nfshiiru
Shiokoji·dori, Shimogyo·ku
KYOTO, 600
Tel: 075·343·0921
CH,E
Yokogawa·Hewlett·Packard Ltd.
Mito Mitsui Bldg.
4·73, Sanno·maru, 1 Chorne
MITO, Ibaraki 310
Tel: (0292) 25·7470
CH,CM,E

P.O. Box 830

Tei.' 21·66·91

Tel.' 424910, 411726
Telex: 224Bl AREEG KT
Cable: VISCOUNT
E,M,A

Telex: 0684 186 ECOME
A
Infograficas y Sistemas del
Noreste, S.A.
Rio Orinoco 11171 Oriente
Despacho 2001
Colonia Del Valle
MONTERREY
Tel.' 782499, 781259

Photo & Cine Equipment
SAFAT
Tel: 2445111
Telex: 22247 MA TIN KT
Cable: MATIN KUWAIT

Yokogawa·Hewlett·Packard Ltd.
Chua 8ldg.
4·20 Nishinakajirna, 5 Chorne
Yodogawa·ku
OSAKA,532
Tel: 1061 304·6021
Telex: YHPOSA 523·3624
A.CH,CM,CS,E,M,P

P,O, Box 5B97

Yokogawa·HewletHackard Ltd.
27·15, Yabe, 1 Chome
SAGAMIHARA Kanagawa, 229
Tel: 042759·1311

LEBANON

A,E

P

Hewlett·Packard de Mexico (Polancol
Avenida Ejercito Nacional 11579
2do y 3er Pis a
COLONIA GRANADA 11520
Mexico, OJ.
Tel: 211·3683

w.J. Towell Computer Services
SAFAT
Tel.' 2462640/1
Telex: 30336 TOWEll KT
C

MOROCCO

Dolbeau
81 rue Karatchi
CASABLANCA

Computer Information Systems
P.O, Box 1/-6274

Tel.' 3041-82, 3068·38
Telex: 23051, 22822

BEIRUT
Tel.' 89 40 73

E

Telex: 42309
C,E,M,P

Gerep
2 rue d'Agadir
Baile Postale 156

LUXEMBOURG
Hewlett·Packard 8elgium S,A./N,V,
81vd, de la Woluwe, 100
Woluwedal
8·1200 BRUSSELS
Tel: 1021 762·32·00
Telex: 23-494 paloben bru
A,CH,CM,CS,E,M,P

Yokogawa Hewlett·Packard ltd.
9·1, Takakura·cho
Hachioji·shi, TOKYO, 192
Tel: 0426·42·1261
CH,E
+

SAFAT

P.O. Box 270

Yokogawa·Hewlett·Packard Ltd.
Oaiichi Seirnei Bldg.
7·1, Nishi Shinjuku, 2 Chorne
Shinjuku·ku, TOKYO 160
Tel: 03·348·4611
CH,E,M

Hewlett·Packard Italiana S.p.A.
Viale C. Pavese 340
1·00144 ROMA EUR
Tel: [061 54831
Telex: 610514
A,CH,CS,E,M,P

Equipos Cientificos de Occidente,
S.A.
Av. lazaro Cardenas 3540
GUADALAJARA

AI Khaldiya Trading
& Contracting

Yokogawa·Hewlett·Packard Ltd.
Nagoya Kokusai Center Bldg.
47·1 Nagono 1 Chorne
Nakamura·ku
NAGOYA,450
Tel: 10521571·5171
CH,CM,CS,E,M

Hewlett·Packard Italiana S.p.A.
Via Nuova San Rocco a
Capodimonte, 62/A
1·80131 NAPOLI
Tel: 10811 7413544
Telex: 710698
CH,CS,E,M

Hewlett·Packard Italiana S.p.A.
Via di Casellina 57/C
1·50018 SCANDICCI-FIRENZE
Tel: 10551 753863
CH,E,M,

KUWAIT

Yokogawa·HewleU·Packard ltd.
Meiji·Seirnei Kokubun Bldg. 7·8
Kokubun, 1 Chorne. Sendai
MIYAGI,980
Tel: 10222)25·1011
C,E

Hewlett·Packard Italiana S.p.A.
Via C. Colombo 49
1·20090 TREZZANO SUL
NAVIGLIO
IMilanol
Tel: 1021 4459041
Telex: 322116
CH,CS

Yokogawa·Hewlett·Packard Ltd.
29·21 Takaido·Higashi, 3 Chorne
Suginami·ku TOKYO 168
Tel: 1031331·6111
Telex: 232·2024 YHPTOK
A,CH,CM,CS,E,P

CASABLANCA
Tel: 212093, 212095

Telex: 23 739
P

Sema.Marac

Rue lapebie
CASABLANCA

MALAYSIA

Tei.' 26.09.80

Hewlett·Packard Sales (Malaysia) Sdn.Bhd.
9th Floor, Chung Khiaw 8ank Building
46 Jln Raja Laut

CH,CS,P
+

Yokogawa·Hewlett·Packard ltd.
Meiji·Seimei Utsunomiya Oodori Bldg.
'·5 Oodori, 2 Chorne
UTSUNOMIYA, Tochigi 320
Tel: 102861 34·1175
CH,CS,E

~.1878;xR 6~~stelveen

Telex: HPSM MA 31011
A,CH,E,M,P

Nl.11 80 AR AMSTELVEEN
Tel: 1201 547 6911
Telex: 13216 hepa nl
A.CH,CM,CS,E,P
Hewlett.Packard Nederland B.V.
80ngerd 2
Nl 2906VK CAPELLE AID IJSSEL

Protei Engineering
P.O. Box 1917
lot 6624, Section 64

Yokogawa·HewletHackard Ltd.
Yasuda Seirnei Nishiguchi Bldg.
30-4 Tsuruya·cho, 3 Chorne
YOKOHAMA 221
Tel: 10451 312·1252
CH,CM,E

23/4 Pending Road

~~f:hfK'2:9ARAWAK

Telex: MA 70904 PROMAl

~·t2~~O:~ CAPELLE AID IJSSEL
Tel: 1101 51.64.44
Telex: 21261 HE PAC Nl
A.CH,CS,E

Cable: PROTElENG
A,E,M

MALTA

JORDAN

Scientific and Medical Supplies Co.

Philip Toledo ltd.
P,O. Box II

P.O. Box 13Bl

AMMAN

Hewlett·Packard Nederland B.V.
Pastoor Petersstraat 134·136
Nl 5612 lV EINDHOVEN
P.O, 80x 2342
Nl 5600 CH EINDHOVEN
Tel: 10401 326911
Telex: 51484 hepae nl
A,E,M

Notahile Rd.
MRIEHEL
Tel: 447 47, 45566, 491525

Tel: 24907, 39901
Telex: 21456 SABCO JO
CH,E,M,P

Telex: Media MW 649
E,P,M

KENYA

MEXICO

AOCOM ltd., Inc.. Kenya
P,O. Box 30010

+

NAIROBI
Tel- 331955
Telex: 22639
E,M

KOREA

Samsung Hewlett·Packard Co. ltd.
Dongband Yeoeuido Bldg.
12·16th Floors

36·' Yeoeuido·Dong

Youngdeungpo·ku
SEOUL
Tel: 184-4566, 184·2666
Telex: 25166 SAMSAN K
A,CH,CM,CS,E,M,P

Donghang Healthcare Products Co. ltd.
Suite 301 Medical Supply Center
Bldg. 1·31 Oongsungdong
Jong RO'gu, SEOU L
Tel: 164·1111
Telex: K25106 TKBKO
Cable: TKBEEPKO

M
Young·in Scientific Co. ltd.
Younguha Bldg.
547 Shinsa·Dong
Kangnam·Ku, SEOUL

Hewlett·Packard de Mexico. S.A.
de C.V.
Av. Periferico Sur No. 6501
Tepepan, Xochimilco
16020 MEXICO D,F.
Tel: 6·76·46·00
Telex: 17·74·507 HEW PACK MEX
A,CH,CS,E,M,P
Hewlett·Packard de Mexico, S.A.
de C,V,
Czda.del Valle
409 Ote. - 41h Piso
Colonia del Valle
Municipio de Garza Garcia Nuevo I eon
66220 MONTERREY
Tel: 78 42 41
Telex: 038 410
CH
Hewlett·Packard de Mexico, SA
Francisco J. Allen 1130
Colonia Nueva
los Angeles 27140
COAHUILA, Torreon
Tel: 37220
Microcomputadoras Hewlett·Packard S.A.
Monte 115 Pelvoux de C.V.
Mexico, OJ. LOS LOMAS
Tel: 520·9127

Tei.' 546-1111
Telex: K23457 GINSCO
A

10-9

NETHERLANDS
Hewlett.Packard Nederland B.V.
Startbaan 16

~e~~~t5~5UMPUR

NEW ZEALAND

Hewlett·Packard IN.Z.I ltd.
5 Owens Road
P.O. Box 26·189
Epsom, AUCKLAND
Tel: 687·159
Cable: HEWPAK Auckland
CH,CS,CM,E,P
+

Hewlett·Packard IN.Z.I ltd,
4· t 2 Cruickshank Street
Kilbirnie, WELLINGTON 3
P,O. 80x 9443
Courtenay Place, WELLINGTON 3
Tel: 877·199
Cable: HEWPACK Wellington
CH,CS,CM,E,P

Northrop Instruments &' Systems
ltd.
369 Khyber Pass Road
P.O, Box 8602

AUCKLAND
Tel.' 794·091
Tetex: 60605
A,M

NEW ZEALAND (Cont'd)

PERU

Northrop Instruments & Systems

Cia Electro Medica S.A.
los Flamencos 145, San Isidro

ltd.
110 Mandeville St.
P.O. Box 8388

CHRISTCHURCH

Redec Plala, 6th floor
JEDDAH
Tel.' 644 9628
Telex: 4027 12 FARNAS SJ

LIMA I
Tel.' 41·4325, 41-37015
Telex: Pub. Booth 25306 PEC PISIOR
CM,E,M,P

Northrop Instruments & Systems

Avenida Republica de Panama 3534
SAN ISIDRO. lima

Cable: EIECTA JEOOAH
A,CH,CS,CM,E,M.P

SAMS S.A.
+

P.O. Box 22015

WELLINGTON

PHILIPPINES

Tel: 850·091
Telex: Nl33BO
A,M

The Online Advanced Systems
Corporation
21F Electra House
Esteban Street
Legaspi Village
Makati
Metro MANILA
Tel.' 815·38·11 (up to 16}
Telex: 63274 Online PN

Telex: 202049 MEERYO SJ
CH,CS,E,M

P.O. Box 2406

NORWAY
HewletHackard Norge AIS
Folke Bernadottes vei 50
P.O. Box 3558
N·5033 FYLlINGSDALEN IBergenl
Tel: 0047/5116 5540
Telex: 76621 hpnas n
CH,CS,E,M
Hewlett·Packard Norge A/S
Osterndalen 16·18
P.O. Box 34
N·1345 OSTERAS
Tel: 004712117 11 80
Telex: 76621 hpnas n

A,CH,CM,CS,E,M,P

Suhai! & Saud Bahwan

MUSCAT
Tel.' 734201·3
Telex: 5274 BAHWAN MB

E

Imtae

lle

P.O. Box 8676

Av. Antonio Augusto de Aguiar 138
P·LlSBON
Tel.' (19} 5311·31, 5311·37
Telex: 16691 munter p

Rarcentro Ltda
R. Costa Cabral 575
4200 PORTO
Tel.' 499114/495113
Telex: 26054
CH,CS

Telex: 5741 rowaos On
A,C,M

'PAKISTAN
Mushko & Company ltd.

House No. 16, Street No. 16
Sector F6!3
ISLAMABAD
Tel.' 824545
Telex: 54001 MUSKI PK
Cable: FEMUS Islamabad

A,E,P

Hewlett·Packard So Africa (Pty.)
Ltd.
P.O. BOK 37099
Overport Drive 92
DURBAN 4067
Tel: 28·4178
Telex: 6·22954
CH,CM

DOHA
Tel.' 428555
Telex: 4806 CHPAfl8
P

Nasser Trading & Contracting

Abdullah Haroon Road
KARACHI 0302
Tel.' 524131, 524132
Telex: 2894 MUSKO PK

DOHA

Hewlett·Packard So Africa (Pty.)
Ltd.
.
6 Linton Arcade
511 Cape Road
linton Grange
PORT ELIZABETH 6001
Tel: 041·301201
CH

Tel.' 422110
Telex: 4439 NASSER OH
M

Cable: COOPERA TOR Karachi
A,E,P

SAUDI ARABIA

PANAMA

Modern Electronic Establishment
Hewlett·Packard Division

Electronico Balboa, S.A.
Calle Samuc/lewis, Ed. Alta

P.O. 80x 281
Thuobah

Apar/ado 4929

AL-KHOBAR

SWEDEN

SOUTH AFRICA

Hewlett·Packard Sverige AB
Ostra Tullgatan 3
S·2112B MALMO
Tel: 10401 70270
Telex: 18541 17886 Ivia Spanga ollicel

Hewlett·Packard So Africa (Pty.)
Ltd.
P.O. Box 120
Howard Place CAPE PROVINCE
7430
Pine Park Center, Forest Drive,
Pinelands
CAPE PROVINCE 7405
Tel: 53·7954
Telex: 57·20006
A,CH,CM.E,M,P

QATAR

P.O. Box 1563

Tel.' 642700
Telex: 3483 ElECTRON P6
A,CM.E,M.P

Tel.' 747-6188
Telex: flS 26283
CM

P.O. Box 2750

Mushko & Company ltd.

Hewlett·Packard Espanola S.A.
C/lsabel La Catolica, 8
E·46004 VALENCIA
Tel: 0034/6/351 5944
CH,P

Unit 05·11 Block 6

Computer Arabia

Oosman Chambers

PANAMA 5

Dynamar International Ltd.

P.O. Box 2531
P·LlSBDN I
Tel.' (19} 68·6012
Telex: 12598
CM,E

Tel.' 601695

Hewlett·Packard Espanola S.A.
Crta. de la Coruna, Km. 16, 400
Las Rozas
E·MADRID
Tel: 111 637.00.11
Telex: 23515 HPE
CH,CS,M
Hewlett·Packard Espanola S.A.
Avda. S. Francisco Javier, Sino
Planta 10. Edificio Sevilla 2,
E·SEV1LLA 5
Tel: 66.44.54
Telex: 72933
A,CS,M,P

Kolam Ayer Industrial Estate
SINGAPORE 1334

Telectra·Empresa Tecnica de
Equipmentos Electricos S.A.RL
Rua Rodrigo da Fonseca 103

MUTRAH

+

Hewlett·Packard Singapore (Sales)
Pte. Ltd.
#08-00 Inchcape House
450-2 Alexandra Road
P.O. Box 58 Alexandra Rd. Post
Office
SINGAPORE, 9115
Tel: 4731788
Telex: HPSGSO RS 34209
Cable: HEWPACK, Singapore
A,CH,CS,E,M,P

S.A.R.l.
P.O. 80x 2761

Av. do liberdade, 220·2
1298 LISBON Codex
Tel.' 5621 81/2/3
Telex: 13316 SA8ASA
P

P.O. Box 169

Tel.·40411/7
Telex: 200 932 El AJOU
P

SINGAPORE

Soquimica

P

RIYADH

PORTUGAL

P.O. Box 19

Hewlett·Packard Espanola S.A.
Calle San Vicente SINo
Edificio Albia II . 7B
E·BILBAO 1
Tel: 423.83.06
A,CH,E,M

P.O. Box 78

MuM/flter
Intercambio Mundial de Comercio

M

MUSCAT
Tel.' 722225, 745601
Telex: 5289 BROKER MB MUSCAT

Abdul Ghani EI Ajou

SCOTLAND
See United Kingdom

OMAN

Hewlett·Packard Espanola S.A.
Calle Entenza, 321
E·BARCELONA 29
Tel: 322.24.51. 321.73.54
Telex: 52603 hpbee
A,CH,CS,E,M,P

RIYADH
Tel.' 491·97 15, 491-6387

A,CH,CS,E,M.P

Khimjil Ramdas

Hewlett·Packard So Africa (Pty.)
Ltd.
Private Bag Wendywood
SANDTON 2144
Tel: 802·5111. 802·5125
Telex: 4·20877
Cable: HEWPACK Johannesburg
A,CH,CM,CS,E,M,P

SPAIN

Modern Electronic Establishment
Hewlett-Packard Division

Tel.' 419928/411108
Telex: 20450 PE lIBERTAO

85·87 Ghulnee Street

+

P.O. Box 1228

Casillo 1030

Tel: 488-873
Telex: 4203
A,M
ltd.
SltJrdee House

+

Modern Electronic Establishment
Hewlett·Packard Division

Hewlett·Packard So Africa (Pty.)
Ltd.
Fountain Center
Kalkden Str.
Monument Park
Ext 2
PRETORIA 0105
Tel: 45·5723
Telex: 32163
CH,E

Tel.' 895·1160, 895./164
Telex: 61/ 106 HPMEEK SJ
Cable: EIECTA AI·KHOBAR
CH,CS,E,M

10-10

Hewlett·Packard Sverige AB
Vastra Vintergatan 9
S·70344 OREBRO
Tel: 1191 10·48·80
Telex: 18541 17886 Ivia Spanga ollicel
CH
+

Hewlett·Packard Sverige AB
Skalholtsgatan 9, Kista
Box 19
S·16393 SPANGA
Tel: 1081 750·2000
Telex: 18541 17886
Telefax: lOBI 7527781
A,CH,CM,CS,E,M,P
Hewlett·Packard Sverige AB
Frota!lsgatan 30
SA2132 VASTRA FROLUNDA
(near Gothenburgl
Tel: 1311 49 09 50
Telex: 18541 17886 Ivia Spang. olli"l
A,CH,CM,CS,E,M,P

-----------------------------------------

SWEDEN (Cont'd)

Eastern Main Road, laventHle

Tel: 1031) 49-09-50
Telex: 1854117886 Ivia Spanga officel
CH,CS,P,E
Hewlett-Packard ISchweizl AG

Clarastrasse 12

P.O. Box 51
PORT·Of·SPAIN
Tel: 623·4412
Telex: 3000 POSTLX WG, ACCT £OOGO
AGENCY 1264
P,A

Hewlett-Packard ISuissel SA
7. rue du Bois·du·Lan
Case Postale 365
CH·1217 MEYRIN 2
Tel: 10041122·83·11·11
Telex: 23984 HPAG CH
CH,CM,CS

Tunisie Eleetronique
31 Avenue de la liherte
TUNIS
Tel' 280·144
CH,CS,E.P

TUNIS
Tel' 253·821
Telex: 12319 CABAM TN
M

SYRIA

E.M.A.
Mediha Eidem Sokak No. 41/6

Yenisehir
ANKARA
Tel: 319/15
Telex: 42321 KTX TR
Cable: EMA TRADE ANKARA

E
Middle East Electronics
P.O. Box 2308
DAMASCUS
Tel.- 33·45·92
Telex: 411 304

Kurl & Kurl A.S.

Mithatpasa Caddesi No. 15
Kal 4 Kililay

M

TAIWAN

ANKARA
Tel- 318815/6/1/0
Telex: 42490 MESR TR

Hewlett·Packard Taiwan
Kaohsiung Office
l11F 456, Chung Hsiao 1st Road

A
Saniva Bilgisayar Sistem/eri A.S.

Hewlett·Packard Taiwan
8th Floor Hewlett·Packard Building
337 Fu Hsing North Road
Tel: 1021 712·0404
Telex: 24439 HEWPACK
Cable: HEWPACK Taipei
A,CH,CM,CS,E,M,P

A

THAILAND
Unimesa Co. ltd.

30 Patpong Ave., Suriwong
BANGKOK 5
Tel: 235·5121
Telex: 84439 Simonco TH
Cable: UNIMESA Bangkok
A,CH,CS,E.M

TOGO
Societe Afncaine De

Promotion
B.P. 12211
LOME
Tel: 21·62·88
Telex: 5304

P

ANKARA
Tel- 215800
Telex: 42155 TKNM TR
E.CM

MONTEVIDEO
Tel: 80·2586
Telex: Public Boolh 901
A,CM.E.M

MlJquines de Oticina

VENEZUELA
+

Emitae ltd.

P.O. Box 1641
SHARJAH,
Tel: 591181
Telex: 68136 EMITAC EM
Cable: EMITAC SHARJAH
E.C,M,P,A

Hewlett·Packard Ltd.
West End House
41 High Street, West End
SOUTHAMPTON

Emilac ltd.
P.O. Box 2111
ABU DHABI.
Tel' 820419-20
Ceble: EMITACH ABUOHABI

Hampshire S03 300
Tel: 107031 476767
Telex: 477138
CH,CS
Hewlett·Packard Ltd.
King Street lane
Winnersh, WOKINGHAM
Berkshire RGll 5AR
Tel: 0734 784774
Telex: 847178
CH,CS,E,

Emitae ltd.
P.O. Box 8391
DUBAI,
Tel: 311591

Emitae ltd.
P.O. Box 413
RAS AL KHAIMAH,
Tel: 2B133, 21210

Hewlett·Packard de Venezuela C.A.
3A Transversal los Ruices Norte
Edificio Segre 2 & 3
CARACAS 1071
Tel: 239·4133
Telex: 251046 HEWPACK
A,CH,CS,E,M,P
Hewlett·Packard de Venezuela, C.A.
Centro Ciudad Comercial Tamanaco
Nivel C·2 (Nueva Elapa)
Local 53H05
CHUAO, Caracas

Tel: 928291
P

Hewlett·Packard Ltd.
Avon House
435 Stratford Road
Shirley, SOLI HULL, West Midlands
B90 4BL
Tel: 021 745 8800
Telex: 339105
CH,CS

UNITED ARAB
EMIRATES

+

URUGUAY
Pablo Ferrando S.A.C. e l
Avenida Italia 2811
Casilia de CorteD 310

Avda. delliber/ador 1997
Casilla de Correos 6644
MONTEVIDEO
Tel' 91·1809, 98.·3801
Telex: 6342 OROU UY
P

Hewlett·Packard Ltd.
The Quadrangle
106·118 Station Road
RED HILL, Surrey RHI IPS
Tel: 0737 68655
Telex: 947234
CH,CS,E,

Teknim Company ltd.
Iran Caddesi No. 1
Kavaklidere

TAIPEI

West Lothian, EH30 9TG
Tel: 031 331 1188
Telex: 72682/3
A,CH,CM,CS,E,M,P

Olympia de Uruguay S.A.

Hewlett·Packard Ltd.
Pontefract Road
NORMANTON. West Yorkshire
WF61RN
Tel: 0924 895566
Telex: 557355
CH,CS

Buyukdere Caddesi 103/6
Gayrellepe
ISTANBUL
Tel' 1813180
Telex: 26345 SANI TR
C,P

KAOHSIUNG

Tel: 107) 2412318
CH,CS,E

Hewlett·Packard Ltd.
SOUTH QUEENS fERRY

Hewlett·Packard Ltd.
Harman House
1 GeorgI! Street
Uxbridge,
MIDDLESEX, UB8 lYH
Tel: 0895 72020
Telex: 893134/5
E,CH,CM,M

M

Abu Rumnaneh

ABERDEEN

ABI lUR
Tel: 0224 638042
E,CH

Hewlett·Packard Ltd.
Bridewell House
Bridewell Place
LONDON EC4V 68S
Tel: 01 583 6565
Telex: 298163
CH,CS,P

TURKEY

P.O. Box 5781
DAMASCUS
Tel.- 33·24-81
Telex: 411 215
Cable: ElECTR080R OAMASCUS

Hewlett·Packard Ltd.
Miller Hause
The Ring, BRACKNELL
Berks RG12 lXN
Tel: 103441 424898
Telex: 848733
C,M,P

Hewlett·Packard Ltd.
Oakfield Hause. Oakfield Grove
Clilton BRISTOL, Avon BS8 2BN
Tel: 0272 736806
Telex: 444302
CH,CS,E

Corema
Iter. Av. de Carthage

General Electronic Inc.
Nur; Basha Ahnal Fbn Kays Street

SCOTLAND
Hewlett·Packard Ltd ..
15 Carden Place.

Hewlett·Packard Ltd.
Elstree Hause. Elstree Way
BOREHAMWOOD. Herts W06 ISG
Tel: 01 207 5000
Telex: 8952716
E,CH,CS

TUNISIA

Hewlett·Packard ISchweizl AG
Allmend 2
CH·8967 WIDEN
Tel: 100411 57 31 21 11
Telex: 53933 hpag ch
Cable: HPAG CH
A,CH,CM,CS,E,M,P

Ing lih Trading Co.
3rt! Floor. 1 Jen-Ai Road. Sec. 2
TAIPEI 100
TeI.-I02} 3948191
Cable: INGliH TAIPEI

+

66 Independence Square

A

+

ALTRINCHAM

Cheshire WA14 lNU
Tel: 061 928 6422
Telex: 668068
A,CH,CS,E,M,P

Computer and Controls ltd.

CH-4057 BASEL
Tel: 1611 33-59-20

Hewlett·Packard Ltd ..
Customer Support Centre
Eskdale Road,
Winnersh, WOKINGHAM
Berkshire, RG11502
Tel: 107341 696622
Telex: 848884
A

Hewlett·Packard Ltd.
Trafalgar Hause
Navigation Road

P.O. Box 132
PORT-Of·SPAIN
Tel.- 624-4213
Telex: 22561 Cerlel WG
Cable: CARTEL, PORT OF SPAIN
CM.E.M.P,A

SWITZERLAND

+

UNITED KINGDOM
GREAT BRITAIN

TRINIDAD & TOBAGO

Caribbean Telecoms ltd.
Corner McAllister Street &

Hewlett·Packard Sverige AD
Frotallisgatan 30
S-42132 VASTRA-fROLUNDA

Hewlett·Packard.de Venezuela C.A.
Residencias Tia Betty local 1
Avenida 3 V con Calle 75
MARACAIBO, Estado Zulia
Apartado 2646
Tel: 1061) 75801·75805·75806·
80304
Telex: 62464 HPMAR
C,E
Hewlett·Packard de Venezuela C.A.
Urb. Lomas del EstB
Torre Trebol - Piso 11
VALENCIA, Estado Carabobo
Apartado 3347
Tel: 1041) 222992/223024
CH,CS,P
Albis Vencrolana S.R.£.

Av. las Marias, Ola. Alix,
EI Pedregal
Apar/ado 8/025
CARACAS 1000A
Tel' 141984, 142146
Telex: 24009 AIBIS VC

A

Teena/ogica Medica del Carihe,
C.A.

Multicentro EmpresBrial del Este
Ave. liiJertador
Edif. liber/ador
Nucleo "c" - Olicina 51-52
CARACAS
Tel' 339881/333780

M

10-11
._------------------

YUGOSLAVIA

REGIONAL HEADQUARTERS OFFICES

Hermes

If there is no sales office listed for your area, contact one of these headquarters offices.

Generalldano'la 4
Telex: YU·/I000 BEOGRAD
A,CH,E,P
Hermes

ritova 50
Telex: YU·31583 WUBWANA
CH,CS,E,M,P
ElektlOtehna

TlTOVA 50
Telex: YU·61000 LJUBWANA
CM

ZAMBIA
R.J. Ti/bury (Zambia/ltd.
P.O. Box 32192

LUSAKA
Tel: 215590
Telex: 4012B
E

ZIMBABWE
Field Technical Sales
45 Kelvin Road. North
P.B.345B

SALISBURY
Tel.' 105 231
Telex: 4·122 RH
E,P

AFRICA AND
MIDDLE EAST
Hewlett·Packard S.A.
Mediterranean and Middle East
Operations

Atrina Centre
32 Kifissias Ave.
Paradissos·Amarousion, ATHENS
Greece

Tel: 6B2 BB 11
Telex: 21·65B8 HPAT GR
Cable: HEWPACKSA Athens
NORTH CENTRAL
AFRICA
Hewlett·Packard S.A.
7, Rue du Bois·du·lan
CH·1217 MEYRIN 2, Switzerland
Tel: 10221 B3 12 12
Telex: 27B35 hpse
Cable: HEWPACKSA Geneve
ASIA
Hewlett·Packard Asia Ltd.
47/F, China Resources Bldg.
26 Harbour Rd .. HONG KONG
G.P.D. Box B63,
Tel: 5·B330B33
Telex: 76793 HPA HX
Cable: HPASIALTO TO

EASTERN EUROPE
Hewlett·Packard Ges.m.b.h.
Lieblgasse 1
P.O. Box 72
A·1222 VIENNA, Austria
Tel: 12221 2365110
Telex: 1 3 4425 HEPA A
NORTHERN EUROPE
Hewlett·Packard S.A.
Uilenstede 475
P.O, Box 999
NL·" BO AZ AMSTELVEEN
The Netherlands
Tel: 20 437771
SOUTH EAST EUROPE
World Trade Center
110 Avenue louis Casal

1215 Cointrin, GENEVA
Switzerland
Tel: 10221 9B 96 51
Telex: 27225 hpser
OTHER INTERNATIONAL
AREAS
Hewlett·Packard Co.
Intercontinental Headquarters
3495 Oaer Creek Road
PALO ALTO, CA 94304
Tel: 14151 B57·1501
Telex: 034·B300
Cable: HEWPACK

ABOUT HEWLETT-PACKARD

David Packard and William Hewlett founded the company as a partnership in Palo Alto, California in 1939, Worldwide sales in fiscal year 1984 totalled U,S, $6,04 billion, International sales
accounted for almost 43% of this figure,
PEOPLE

Worldwide employment is over 83,000 with 26,000 employees outside the United States,
PRODUCTS

The company designs, manufactures, and markets measurement and computation products and
systems used in business, industry, science, engineering, education, and medicine.
FACILITIES

Hewlett-Packard has manufacturing facilities the United States, Canada, Latin America, Europe,
and Asia, The company has established joint ventures in Japan, the People's Republic of China,
Mexico, and South Korea, Hewlett-Packard has 330 sales and support activities in 76 countries, Intercontinental Operations headquarters and HP's corporate offices are located in Palo
Alto, California. European Operations are headquartered in Geneva, Switzerland.

10-12

HP Cotnponents
Sales and Service
Alabama
P.O. Box 7700
420 Wynn Dr., N.W.
Huntsville 35805
Tel: (205) 830-2000

Florida
P.O. Box 13910
6177 Lake Ellenor Dr.
Orlando 32809
Tel: (305) 859-2900

Arizona
8080 Pointe Parkway West
Phoenix 85044
Tel: (602) 273-8000

Georgia
P.O. Box 105005
2000 South Park Place
Atlanta 30348
Tel: (404) 955-1500

California
1421 So. Manhattan Ave.
Fullerton 92631
Tel: (714) 999-6700
9606 Aero Dr.
P.O. Box 23333
San Diego 92123
Tel: (714) 279-3200
3003 Scott Blvd.
Santa Clara 95050
Tel: (408) 988-7000
2150 West Hillcrest Dr.
Thousand Oaks 91320
Tel: (805) 373-7000
Colorado
24 Inverness Place East
Eng lewood 80110
Tel: (303) 649-5000
Connecticut
27 Barnes Industrial Ret So.
P.O. Box 5007
Wallingford 06492
Tel: (2031 265-7801

Missouri
1001 East 101 Terr.
Suite 120
P.O. Box 24796
Kansas City 64131
Tel: (816) 941-0411

Ohio
16500 Sprague Rd.
Cleveland 44130
Tel: (216) 243-7300

New Jersey
60 New England Ave. West
Piscataway 08854
Tel: (201) 981-1199
W. 120 Century Rd.
Paramus 07652
Tel: (201) 265-5000

Illinois
5201 Tollview Dr.
Rolling Meadows 60008
Tel: (312) 255-9800
Indiana
11911 No. Meridian Street
Carmel 46032
Tel: (317) 844-4100
Maryland
3701 Koppers St.
Baltimore 21227
Tel: (301) 644-5800

New Mexico
7801 Jefferson St., NE
Albuquerque 87109
Tel: (505) 823-6100

Texas
11002-B Metric Blvd.
Austin 78758
Tel: (512) 835-6771

New York
7641 Henry Clay Blvd.
Liverpool 13088
Tel: (315) 451-1820

10535 Harwin
Houston 77036
Tel: (713) 776-6400
930 E. Campbell Rd.
P.O. Box 831270
Richardson 75083-1270
Tel: (214) 231-6101

250 Westchester Ave.
White Plains 10604
Tel: (914) 684-6100

Massachusetts
1775 Minuteman Rd.
Andover 01810
Tel: (6171682-1500

3 Crossways Park West
Woodbury 11797
Tel: (5161 921-0300

Michigan
39550 Orchard Hill Place Dr.
Novi 48050
Tel: (3131 349-9200

North Carolina
305 Gregson Dr.
Cary 27511
Tel: (9191 467-6600

Oregon
P.O. Box 328
Wilsonville 97070
Tel: (503) 682-8000
Pennsylvania
2750 Monroe Blvd.
P.O. Box 713
Valley Forge 19482
Tel: (215) 666-9000

200 Cross Keys Office
Fairport 14450
Tel: (7161 223-9950

P.O. Box 1648
4 Choke Cherry Rd.
Rockville 20850
Tel: (3011 948-6370

675 Brooksedge Blvd.
Westerville 43081
Tel: (614) 891-3344

Washington
Bellefield Office Pk.
15815 S.E. 37th St.
Bellevue 98006
Tel: (2061 643-4000

Minnesota
2025 W. Larpenteur Ave.
St. Paul 55113
Tel: (612) 644-1100

10-13

_ .. _.._.._ _ - - _ . _ - - - - - - ..
Source Exif Data: 
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.3
Linearized                      : No
XMP Toolkit                     : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:56:37
Create Date                     : 2013:08:05 15:28:10-08:00
Modify Date                     : 2013:08:06 06:19:38-07:00
Metadata Date                   : 2013:08:06 06:19:38-07:00
Producer                        : Adobe Acrobat 9.55 Paper Capture Plug-in
Format                          : application/pdf
Document ID                     : uuid:e6dc9bb9-92f8-5a45-9d72-f6352bb52308
Instance ID                     : uuid:79b93918-3dbc-8c47-a6d7-5b52391dea2a
Page Layout                     : SinglePage
Page Mode                       : UseNone
Page Count                      : 796
EXIF Metadata provided by EXIF.tools

Navigation menu