1988_Burr Brown_Integrated_Circuits_Data_Book_Supplement 1988 Burr Brown Integrated Circuits Data Book Supplement
User Manual: 1988_Burr-Brown_Integrated_Circuits_Data_Book_Supplement
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... ::l BURR-BROWN Integrated Circuits Data Book Supplement ~~ (1) (Q ...Dl (1) C- o n_. ... c tn ...mmC OJ o o ~ en c "'C "'C - (1) 3 (1) ... ::l AID Converters D/A Converters Sample/Hold Converters Multiplexers Power Supplies Operational Amplifiers Instrumentation Amplifiers Isolation Amplifiers Analog Circuit Functions Military Products RR-BROWN ® II I {)1 MODEL INDEX Model Page AD515 ................. 1-153 ADC10HT ............... 5-3 ADC71 ................. 5-13 ADC72 ................. 5-21 ADC73 ................. 5-29 ADC76JG/KG ........ 5-40 ADC76AM/BM/JM/KM .. 5-48 ADC80 ................. 5-56 ADC80H ............... 5-64 ADC80MAH12 ........... 87 ADC84 .................... 95 ADC85 ................. 5-72 ADC85H .................. 95 ADC87/883B .......... 12-8 ADC87H .................. 95 ADC574 ............... 5-80 ADC600 ................ 103 ADC674 ............... 5-93 ADC731 ............... 5-29 ADC800 .............. ~102 ADC804 .............. 5-114 DAC10HT ............... 6-5 DAC63 ................. 6-12 DAC70 ................. 6-20 DAC71 ................. 6-28 DAC71-CCD .......... 6-35 DAC72 ................. 6-20 DAC73 ................. 6-41 DAC74 ................. 6-49 DAC80-CBI ........... 6-64 DAC80-CCD .......... 6-72 DAC80P ................ 123 DAC82 ................. 6-78 DAC85 ................. 6-85 DAC87/883B ......... 12-24 DAC87-CBI-I ........ 12-36 DAC90 ................. 6-93 DAC700 ............... 6-98 DAC701 ............... 6-98 DAC702 ............... 6-98 DAC702/BS9000 ..... 13-9 DAC703 ............... 6-98 DAC703/BS9000 .... 13-10 DAC703/883B ......... 191 DAC705 .............. 6-106 DAC706 .............. 6-106 DAC707 .............. 6-106 DAC707JP ............. 131 DAC708 .............. 6-106 DAC709 .............. 6-106 DAC710 .............. 6-116 DAC711 .............. 6-116 DAC729 ................ 141 DAC736 ............... 6-41 DAC800 .............. 6-123 DAC811 .............. 6-130 DAC811 DIE .......... 11-3 DAC811JUlKU ........ 151 DAC812 .............. 6-138 DAC850 .............. 6-144 DAC851 .............. 6-144 DAC870/883B ....... 12-48 DAC1200 ............. 6-151 DAC1201 ............. 6-155 DAC1600 ............. 6-160 DAC7541 ............... 159 DACjl545 ............... 167 DAC7700 DIE ......... 11-8 DAC7701 DIE ........ 11-13 DAC8012 ............... 174 Data Communication Devices ............. 16-5 Model Page DIV100 ................... 4-7 DSP/ay'· . ............... 260 INA101 .................. 2-7 INA101/BS9000 ...... 13-11 INA101 DIE ........... 11-18 INA101/883B ........... 200 INA102 ................ 2-18 INA102 DIE .......... 11-20 INA102KP ................ 42 INA104 ................ 2-26 INA105 ................ 2-36 INA106 .................... 45 INA110 ................ 2-46 INA110KP ................ 53 INA117 .................... 57 INA258/883B ........ 12-61 IS0100 .................. 3-6 IS0102 .................... 68 IS0106 .................... 68 LOG100 ............... 4-15 MCS Series ........... 16-5 MP32 ..................... 8-3 MPC4D .................. 9-3 MPC8D ................ 9-10 MPC8S .................. 9-3 MPC16S ............... 9-10 MPC800 ............... 9-17 MPC801 ............... 9-24 MPY100 ............... 4-23 MPY100/BS9000 ..... 13-12 MPY534 ............... 4-31 MPY634 ............... 4-38 Microcomputer I/O Systems ........ 16-2 Microterminals ....... 16-1 OPA11HT ............... 1-9 OPA21 ................. 1-13 OPA27 ................. 1-17 OPA27/BS9000 ...... 13-13 OPA27 DIE ........... 11-22 OPA27HT ............. 1-29 OPA37 ................. 1-17 OPA37/BS9000 ...... 13-14 OPA37 DIE ........... 11-24 OPA37HT ............. 1-29 OPA101 ............... 1-33 OPA102 ............... 1-33 OPA103 ............... 1-45 OPA104 ............... 1-49 OPA105/883B ....... 12-74 OPA106/883B ....... 12-84 OPA111 ................ 1-53 OPA1111BS9000 .... 13-15 OPA111 DIE ......... 11-26 OPA111HT ............ 1-63 OPA111/883B .......... 210 OPA121 ............... 1-67 OPA121/BS9000 .... 13-16 OPA128 ............... 1-73 OPA156 ............... 1-81 OPA356 ............... 1-81 OPA201 ............... 1-87 OPA404 ............... 1-95 OPA404KP ................ 1 OPA445 ................... 5 OPA501 .............. 1-103 OPA501/883B ......... 222 OPA511 .............. 1-111 OPA512 .............. 1-116 OPA541 ................... 9 OPA600 .................. 15 OPA600/883B ....... 12-94 Model Page OPA602 .................. 23 OPA605 .............. 1-129 OPA606 .............. 1-135 OPA606 DIE .. : ...... 11-28 OPA633 .................. 29 OPA2111 ............. 1-143 OPA2111 DIE ......... 11-30 OPA2111KP .............. 38 OPA8780/883B .... 12-110 OPA8785/883B .... 12-120 PCI-3000 .............. 16-4 PCI-20000 ............. 16-4 PCM52 ................ 6-164 PCM53JG ............ 6-164 PCM53JP ............ 6-168 PCM54 ................ 6-180 PCM55 ................ 6-180 PCM56 .................. 182 PCM75 ................ 5-123 PGA100 ............... 2-58 PGA102 ............... 2-66 PGA200 ............... 2-76 PGA201 ............... 2-76 PSB100 ................ 14-7 PWR1XX ............... 14-9 PWR2XX .............. 14-11 PWR3XX .............. 14-13 PWR4XX .............. 14-15 PWR5XX .............. 14-17 PWR6XX .............. 14-19 PWR7XX ................ 237 PWR8XX .............. 14-25 PWR70 ................ 14-27 PWR71 ................ 14-29 PWR72 ................ 14-31 PWR74 ................ 14-33 PWR1017 ............... 241 PWR5038 ............... 245 PWR5104 ............... 247 PWR5105 ............... 247 PWS725 .................. 82 PWS726 .................. 82 REF10 ................. 4-46 REF101 ................ 4-52 SCADAR .............. 16-5 SDM854 ................. 8-7 SDM856 ............... 8-12 SDM857 ............... 8-12 SDM862 ................ 251 SDM863 ................ 251 SHC76 ................... 7-3 SHC85 ................. 7-11 SHC298AM ........... 7-15 SHC600 ............... 7-21 SHC803 ............... 7-24 SHC804 ............... 7-24 SHC5320 .............. 7-30 TM2500 ................. 258 TM2700 ................. 258 UAF11 ................. 4-60 UAF21 ................. 4-60 UAF41 ................. 4-68 VFC32 ................. 10-3 VFC32/BS9000 ...... 13-17 VFC32 DIE ........... 11-32 VFC32/883B ....... 12-135 VFC42 ................ 10-11 VFC52 ................ 10-11 VFC62 ................ 10-17 VFC62/BS9000 ...... 13-18 VFC100 ............... 10-25 VFC320 ............... 10-40 Model Page VFC320/BS9000 ..... 13-19 XTR100 ................ 2-82 XTR101 ................ 2-94 XTR101KP ............... 65 XTR110 ............... 2-104 XTR110 DIE .......... 11-34 100MS ................. 3-17 546 ..................... 14-3 550 ..................... 14-3 551 ..................... 14-3 552 ..................... 14-3 553 ..................... 14-3 554 ..................... 14-3 556 ..................... 14-3 558 ..................... 14-3 560 ..................... 14-3 561 ..................... 14-3 562 ..................... 14-3 700 .................... 14-35 710 .................... 14-37 722 .................... 14-41 724 .................... 14-45 3329/03 ...... ......... 1-157 3450 .................... 3-19 3451 .................... 3-19 3452 .................... 3-19 3455 .................... 3-19 3500 ...............•... 1-159 3500/883B . ......... 12-147 3507J ................. 1-161 3508J ................. 1-163 3510 ................... 1-165 3510VM/883B ...... 12-158 3521 ................... 1-167 3522 ................... 1-167 3523 ................... 1-170 3527 ................... 1-172 3528 ................... 1-174 3550 ................... 1-176 3551 ................... 1-180 3553 ................... 1-184 3554 ................... 1-188 3571 ................... 1-196 3572 ................... 1-196 3573 ................... 1-202 3580 ................... 1-206 3581 ................... 1-206 3582 ................... 1-206 3583 ................... 1-210 3584 ................... 1-214 3606 ................... 2-114 3627 ................... 2-122 3650 .................... 3-21 3652 .................... 3-21 3656 .................... 3-29 4023/25 ................ 4-80 4085 .........•.......... 4-82 4115/04 ..... ........... 4-88 4127 .................... 4-90 4203 .................... 4-97 4204 .................... 4-99 4206 .................... 4-99 4213 ................... 4-105 4213/BS9000 . ........ 13-20 4213/883B .. ........ 12-166 4214 ................... 4-109 4302 ................... 4-111 4340 ................... 4-117 4341 ................... 4-119 4423 ................... 4-123 DSPlay·· Burr-Brown Corp. "*-A complete price list for these products is located inside the back cover. SUPPLEMENT TO INTEGRATED CIRCUiTS DATA BOOK Burr-Brown Corporation • International Airport Industrial Park • P.O. Box 11400 • Tucson, Arizona 85734 USA Telephone: 602-746-1111 • Telefax: 602-746-7357 • TWX 910-952-1111 • Telex: 66-6491 BURRBROWN ATU • Cable: BBRCORP The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support deliices and/or systems. © 1987 Burr-Brown Corporation LI-340 Printed in U.S.~July, 1987 INTRODUCTION This supplement to the Burr-Brown Integrated Circuits Data Book contains product data sheets on new products that have been developed and introduced since the Data Book was published. Product lines such as Operational, Instrumentation, and Isolation Amplifiers, Analog-to-Digital and Digital-to-Analog Converters, Military Products, Moduiar Power Supplies, Data Entry and Display Terminals, Microcomputer 1/0 Systems, and Data Acquisition Components are represented. The Model Index list on the inside of the front cover refers to models and page numbers in both the Data Book and this supplement. Products in this supplement are set in bold type. A Selection Guide beginning on page iii contains a summary of performance characteristics of all products in both the Data Book and this supplement. A complete list of all Burr-Brown offices and sales representatives can be found on the inside of the back cover. If you have questions on any of our products please contact the nearest Burr-Brown office or sales representative. iii SELECTION GUIDE HIGH PERFORMANCE OPERATIONAL AMPLIFIERS GENERAL PURPOSE options when a special function op amp is not required. You can be confident that Burr-Brown's quality and reliability are inherent in their design. These moderately priced FET and bipolar op amps offer good performance over a wide range of parameters. These are good GENERAL PURPOSE Offset Voltage, max Bias Current AI Temp (25· C), 2S·C, Drift, max (±mV) (±pVl'C) (nA) Frequency Response Open Loop Gain, min (dB) (MHz) Unity Slew Gain Rate Rated Output, min Temp Range l1l Package Page Low Power OPA21GZ OPA21EZ 0.5 0.1 5 1 50 25 114 120 0.3 0.3 0.2 0.2 13.6 13.7 1.3 1.4 Ind Ind DIP DIP 1-13 1-13 Switchable Input OPA201AG OPA201BG OPA201CG OPA201SG 0.5 0.2 0.1 0.2 5 2 1 2 50 40 25 40 114 114 120 114 0.5 0.5 0.5 0.5 0.1 0.1 0.1 0.1 13.5 13.5 13.5 13.5 5 5 5 5 Com Com Com MIL DIP DIP DIP DIP 1-B7 1-B7 1-B7 1-B7 Low Cost FET OPAI21KP* OPA121KM 3 2 10 10 ±o.010 ±o.OO5 106 110 2 2 2 2 10 10 5 5 Com Com DIP TO-99 1-67 1·67 Wide Temp Range OPAllHT 5 5'21 ±25 94 12.0 7.0 10 15 -55·Cto +175·C TO-99 1-9 OP.A.2?HT 1),05 n.~fil2' 1."A 120 6 1.9 12 16121 -S5·Cto +200·C TO-99 1-29 OPA37HT 0.05 0.25121 lpA 120 36 11.9 12 16121 -55·Cto +200·C TO-99 1-29 OPA111HT 0.5 8121 0.002 114 2 2 10 5 -5S·Cto +200·C TO-99 1-63 Description NOTES: Model (Vlpsec) (±V) (±mA) (1) Com = 0 to HO·C; Ind = -2S·C to +B5·C; MIL = -5S·C to +125·C. (2) Typical. LOW DRIFT Low offset voltage drift vs temperature performance in both FET and bipolar input types is obtained by our sophisticated drift compensation techniques. First, the drift is measured and then special laser trim techniques are used to minimize the drift and the initial offset voltage at 25°C. Finally, "max drift" performance is retested for conformance with specifications. LOW DRIFT (:5SpVl·C) Offset Voltage, max Description Bias Current Temp (25· C), At 2S·C Drift max (±mV) (±pVrC) (nA) Open Loop Gain, Frequency Response (dB) Unity Gain (MHz) min Rated Slew Output, min Rate (Vlpsec) (±V) (±mA) Temp Range l11 Package Page FET OPAlllAM* OPAlllBM OPA111SM 0.5 0.25 0.5 5 1 5 ±0.002 ±0.001 ±o.o02 114 120 114 2 2 2 2 2 2 11 11 11 5 5 5 Ind Ind MIL TO-99 TO-99 TO-99 1-53 1-53 1-53 Wideband OPA156AM OPA356AM 2 2 5 5 0.05 0.05 94 94 6 6 14 14 10 10 5 5 MIL Com TO-99 TO-99 1-Bl 1-81 Model OPA606LM 0.5 5 ±0.01 100 13 35 12 5 Com TO-99 1-135 Dual FET OPA2111BM* 0.5 2.8 ±0.004 114 2 2 11 5 Ind TO-99 1-143 Bipolar OPA27A* OPA37A* OPA27B OPA37B OPA27C OPA37C OPA27E OPA37E OPA27F OPA37F OPA27G OPA37G OPA27GP OPA37GP 0.025 0.025 0.060 0.060 0.100 0.100 0.025 0.025 0.060 0.060 0.100 0.100 0.100 0:100 0.6 0.6 1.3 1.3 1.8 1.8 0.6 0.6 1.3 1.3 I.B I.B I.B I.B ±40 ±40 ±55 ±55 ±80 ±BO ±40 ±40 ±SS ±55 ±BO ±80 ±BO ±80 120 120 120 120 117 117 120 120 120 120 117 117 117 117 8 63121 8 63121 8 8 63 121 8 63 121 1.9 11.9 1.9 11.9 1.9 11.9 1.9 11.9 1.9 11.9 1.9 11.9 1.9 11.9 12 12 12 12 12 12 12 12 12 12 12 12 12 12 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 MIL MIL MIL MIL MIL MIL Ind Ind Ind Ind Ind Ind Com Com TO-99,.DIP T0-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP. TO-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP DIP DIP 1-17 1-17 1-17 1-17 1-17 1-17 1-17 .1-17 1-17 1-17 1-17 1-17 1-17 1-17 OPA21EZ OPA21GZ 0.1 0.5 1 5 25 50 120 114 0.3 0.3 0.2 0.2 13 13 5 5 Ind Ind DIP DIP 1-13 1-13 Low Power 63121 8 63121 8 63121 NOTES: (1) Com = 0 to +70·C, Ind =; -25·C to +BS·C, MIL = -SS·C to +125·C. (2) Gain-bandwidth product for OPA37. Av= 5 minimum. "'Available in 20·pin ceramic leadless chip carriers. v LOW BIAS CURRENT currents as low as 75fA (75 X 10-15 amps) and low voltage drift as low as Ip.V/oC. With offset voltage laser-trimmed to as low as 250p.V, the need for expensive trim pot adjustments is eliminated. Our many years of experience in designing, manufacturing and testing FET amplifiers gives us unique abilities in providing low and ultra l~w bias Current op amps. These amplifiers offer bias LOW BIAS CURRENT (:550pA) Offset Voltage, max Description Model 1u Bias Current At Temp (25' C), 25'C, Drift, max (±mV) (±pV/'C) (pA) Open Loop Gain, Frequency Response (dB) Unity Gain (MHz) min Rated Slew Output, min Rate (Vlpsac) (±V) (±mA) Temp Range'" Package Page To-99 TO-99 TO-99 1-53 1-53 1-53 OPAlllAM* OPAll1BM OPAlllSM 0.5 0.25 0.5 5 1 5 ±2 ±1 '±2 114 120 114 2 2 2 2 2 2 11 11 11 5 Ind Ind MIL OPA101AM OPA101BM OPA102AM OPA102BM 0.50 0.25 0.50 0.25 10 -15 -10 -15 -10 94 94 94 94 10 10 40 40 6.5 6.5 14 14 12 12 12 12 12 12 12 12 Ind Ind Ind Ind TO-99 TO-99 TO-99 TO-99 1-33 1-33 1-33 1-33 OPAI26JM* OPA128KM OPA128LM OPA128SM 1 0.5 0.5 0.5 20 10 10 ±0.300 ±0.150 ±0.075 ±a.150 94 110 110 110 1 1 1 1· 3 3 3 3 10 10 10 10 5 5 5 5 Com Com Com MIL TO-99 TO-99 TO-99 TO-99 1-73 1-73 1-73 1-73 OPA2111AM* OPA2111BM OPA2111SM OPA2111KM OPA2111KP 0.75 0.5 0.75 2 2 6 2.8 6 15 15 ±8 ±4 ±8 ±15 ±15 110 114 110 106 106 2 2 2 2 2 .2 2 2 2 2 11 11 11 11 11 5 Ind Ind MIL Com Com TO-99 TO-99 T0-99 T0-99 DIP 1-143 1-143 1-143 38 39 OPA404AG* OPA404BG OPA404SG OPA404KP 1 0.75 1 2.5 3'41 3141 3141 ±8 ±4 ±8 ±12 88 92 35 35 35 35 11.5 12 11.5 11.5 5 5 98 98 6.4 6.4 6.4 6.4 5 Ind Ind MIL Com DIP Dip DIP DIP 1-95 1-95 1-95 1 Low Cost OPAI21KM* OPA121KP 2 3 10 10 ±5 ±10 110 106 2 2 2 2 11 11 5 5 Com Com TO-99 DIP 1-67 1-67 Wideband OPA602AM OPA602BM OPA602CM OPA602SM 1 0.5 0.25 0.5 15 5 2 5 10 2 1 2 75 88 92 6.5 6.5 6.5 6.5 20 24 . 28 24 10 10 10 10 15 15 15 15 rnd Ind Ind MIL TO-99 TO-99 TO-99 TO-99 23 23 23 23 OPA606KM OPA606LM OPA606SM OPA606KP 1.5 0.5 1.5 3 5141 5 5141 10141 ±15 ±10 ±15 ±25 ' 95 100 95 90 12.5 13 12.5 12 33 35 33 30 11 12 11 11 5 5 5 5 Com Com MIL Com TO-99 TO-99 To-99 DIP 1-135 1-135 1-135 1-135 3 1 1 50 15 25 0.300 0.150 0.075 86 92 88 0.35 0.35 0.35 1 1 1 10 10 10 5 5 5 Com Com Com TO-99 TO-99 TO-99 1-153 1-153 ·1-153 Premium Performance Low Noise Ultra-Low Bias Current Dual FET Ouad FET Low Cost, Ultra-Low Bias Current AD515JH AD515KH AD515LH 5 10 5 5 5(41 98 5 5 5 5 5 5 5 NOTES: (1) "(0)" indicates product also available with screening for increased reliability. (2) Com = 0 to +70'C, Ind =-25'C to +85'C, MIL =-SS'C to +125'C. (3) Gain-bandwidth product. (4) Typical. LOW NOISE rely on "typical" specs for his demanding low noise designs. These fully characterized parts allow a truly complete error budget calculation. Now both FET and bipolar input op amps are. offered with gnaranteed low noise specifications. Until now the designer had to LOW NOISE (Guaranteed en) Description Bipolar Model OPA27A* OPA37A* OPA27B OPA37B OPA27C OPA37COPA27E OPA37E OPA27F OPA37F Noise Voltage at 10kHz, max (nV/y'Hz) 3.8 3.8 3.8 3.8 4.5 ' 4.5 3.8 3.8 3.8 3.8 Bias Current (25'C), max (pA) .Offset Voltage, max Temp At Drift 25'C (±mV) (±pV/'C) ±40nA .0.025 ±40nA 0.025 ±55nA 0.060 ±S5nA 0.060 ±80nA 0.100 ±80nA 0.100 ±40nA 0.025 ±40nA 0.025 ±55nA 0.060 ±55nA 0.060 0.6 0.6 1.3 1.3 1.8 1.8 0.6 0.6 1.3 1.3 Open Loop Gain, min (dB) 120 120 120 '120 117 117 120 120 120 120 *Available in 20-pin ceramic lead less chip carriers. Frequency Response Gain Bandwidth (MHz) 8 63 8 63 8 63 8 63 8 63 Slew Rate, min (V/poec) (±V) (±mA) '1) Package Page 1.7 11 1.7 11 1.7 11 11 11 1.7 11 12 12 12 12 12 12 12 12 12 12 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 MIL MIL MIL MIL MIL MIL Ind Ind Ind Ind TO-99,DIP TO-99, DIP TO-99, DIP TO-99, DIP TO-99,DIP TO-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP TO-99, DIP 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 Rated Output, min Temp Range This table continued on next page. Models in boldface type are found in this supplement; others are in the Burr-Brown Integrated Circuits Data Book. vi LOW NOISE (Guaranleed e.) (CO NT) Frequency Noise (25'C), max (pA) AI Temp 25'C Drift (±mV) (±pVl'C) 4.5 4.5 ±80nA ±80nA 0.100 0.100 1.8 1.8 OPA101AM OPA101BM 8 8 -15 -10 0.5 0.25 OPA102AM OPA102BM 8 8 -15 -10 OPA111AM' OPAll1BM OPA111SM 8 8 8 ±2 ±1 ±2 Model OPA27G OPA37G Wide Bandwidlh FET Low CoSI Dual FET NOTES: Response Open Loop Bias Current Description Bipolar Offsel Vollage, max Vollage al 10kHz, max (nVl.jHz) Slew Rale, Gain Raled (dB) Bandwidlh (MHz) (Vlpsec) (±V) (±rnA) '" 117 117 8 63 1.7 11 12 12 16.6 16.6 Ind 10 5 94 94 20 20 5 5 12 12 12 12 lr1d 0.5 0.25 10 5 94 94 40 40 10 10 12 12 12 12 ImJ 0.5 0.25 0.5 5 1 5 114 120 114 2 2 2 1 1 1 11 -11' 11 Gain, min min Output, min Temp Range Package Page TO-99, DIP TO-99, DIP 1-17 1-17 TO-99 TO-99 1-33 1-33 Ind TO-99 TO-99 1-33 1-33 5 5 5 Ind Ind MIL TO-99 TO-99 TO-99 1-53 1-53 1-53 Ind Ind OPA606LM 13 ±10 0.5 5 100 13 25 12 5 Com TO-99 1-135 OPA27GP OPA37GP 4.5 4.5 ±80nA ±80nA 0.100 0.100 1.8 1.8 117 117 8 63 1.9121 11.9[21 10 10 16.6 16.6 Com Com DIP DIP 1-17 1-17 8 8 8 ±8 ±4 ±4 ±15 ±15 0.75 0.5 0.75 2 2 6 110 114 110 108 108 2 2 2 2 2 1 1 1 1 1 11 11 11 11 11 5 5 5 5 5 Ind 2.8 6 15 15 MIL Com Com TO-99 TO-99 TO-99 TO-99 DIP 1-143 1-143 1-143 38 38 OPA2111AM' OPA2111BM OPA2111SM OPA2111KM OPA2111KP' 612~ 61~' (1) Ind = -25'C 10 +85'C, MIL = -55'C 10 +125'C, Com =O'C 10 +70'C. Ind (2) Typical. UNITY-GAIN BUFFER (Power Booster) circuit; may be used inside the feedback loop of another op amp to These versatile amplifiers: boost Ihe output current capability of another amplifier; buffer an impedance that might load a critical form a current-boosted, composite amplifier. Currents as high as ±IOOmA are available with speeds of 2000V/ JLsec. UNITY-GAIN BUFFER Raled Oulpul, min Model (±V) Frequency Response Inpul (±mA) -3dS (MHz) Full Power BW(MHz) Slew Rale (Vlpsec) Gain (VN) Impedance (0) Temp Rangu lll Package Page High Performance 3553AM 10 200 300 32 2000 =1 1011 Inct TO-3 1-184 Low Cost OPA833AH OPA633SH OPA633KP 10 10 10 80 80 80 275 275 275 65 65 65 1000 1000 1000 =1 =1 =1 10' 10' 10' Ind MIL Com TO-8 TO-8 DIP 29 29 29 Description NOTES: (1) Ind = -25'C 10 +85'C, MIL = -55'C 10 +125'C, Com = O'C to +70'C. WIDE BANDWIDTH Design expertise in wide band circuits combines with our fully' developed technology to create cost effective wide band op amps, Burr-Brown high speed amplifiers also offer outstanding DC performance specifications, WIDE BANDWIDTH (2:5MHz) Offset Voltage, max Frequency Response Description FET Bipolar Model '11 Gain Bandwidth (MHz) Slew Rate, min (Vlpsec) 3554AM, (a) 3554BM, (a) 3554SM, (a) 1700, A = 1000 1700, A = 1000 1700, A = 1000 1000 1000 1000 120 120 120 ext. ext. ext. 10 10 10 100 100 100 2 1 1 3551J 35515, (a) 50, A=10, 50, A=10 250 250 400 400 ext. ext. 10 10 10 10 3550J 3550K 35505, (a) 10,A=10 20,A=1 10,A=1 65 100 65 400 400 400 into Int. int. 10 10 10 3508J 3507J, (a) 100, A=l00 20, A=10 0 80 - ext. ext. 10 10 Corn- ts ±0.1% (nsec) penss- 200 tion Rated Output, min AI Temp 25'C Drift (±V) (±mA) (±mV) (±pVl'C) Open Loop Gain, min TOlllp Rnll(]o (dB) w Package Page 50 15 25 100 100 100 In .. TO-3 TO-3 TO-3 1-188 1-188 1-188 1 1 5013.1 88 88 Com TO-99 TO-99 1-180 1-180 10 10 10 1 1 1 50131 88 88 88 Com 50~1 MIL TO-99 TO-99 TO-99 1-176 1-176 1-176 10 10 5 10 30131 30<31 98 83 Corn COllI TO-99 TO-99 1-163 .1-161 50~1 50~1 Ifld MIL MIL CUIlI *Available in 20-pin ceramic leadless chip carriers. Th!:1 table continued on next page. Models in boldface type are found In this supplement; others are in the Burr-Brown Integrated Circuil" Data Book. vii WIDE BANDWIDTH (25M Hz) (CONT) Frequency Response Description FET Advance { Information Gain Bandwidth (MHz) OPA156AM OPA356AM 6,A=1 6,A=1 OPA802AM OPA802BM OPA802CM OPA802SM 6.5 6.5 6.5 6.5 Modell'! OPA605H OPA605A OPA605K OPA605C Ouad FET Low Noise Bipolar Low Noise FET Fast Settling ?OO. 200, ?OO, ?OO. Slew Rate, Offset Voltage, max Com- ponsa- (Vlpsec) ±0.1% (nsec) 10 10 1.5psec 1.5psec int. int. 10 10 5 5 20 26 800 800 800 Int. Int. Int. Int. 10 10 10 10 15 15 15 15 10 10 10 10 30 30 30 30 11 12 11 11 5 5 min 24 A=IOOO A=1000 A=1000 A=looo 24 800 300131 300 300131 300 oxt. oxt 300131 300.31 300 300 ext. ext. inl. int. 12.5 13 12.5 12 22 25 22 20 lpsec lpsec lpsec lps9C OPA404AG OPA404BG OPA404SG OPA404K" 6.4 6.4 6.4 6.4 24 28 24 600 800 600 600 Int. OPA27A* OPA37A* OPA27B OPA37B OPA27C OPA37C OPA27E OPA37E OPA27F OPA37F OPA27G OPA37G B,A=1 63,A=5 B,A= 1 63, A=5 B,A=1 63, A = 5 8,A=1 63, A=5 8,A=1 63, A=5 8,A=1 63, A = 5 1.7 11 1.7 11 1.7 11 1.7 11 1.7 11 1.7 11 - int. I '" int. I .' - OPAIOIAM OPA101BM ~O, ~O, A=I00 A=I00 5 5 OPAI02AM OPAI02BM ~O, A=IOO 1.000, A=looo 1;000, A=looo 5000, A = 1000 11.5 11.5 11.5 11.5 5 (dB) I~ . Package Page 2 2 5 5 94 94 MIL Com TO-99 TO-gg 1-81 1-81 1 0.5 0.5 15 5 2 5 75 88' 92 88 Ind. Ind. Ind. MIL TO-gg TO-99 TO-99 TO-99 23 23 23 23 1 1 0.5 0.5 25 25 5 5 96131 Com Ind Com Ind DIP DIP DIP DIP 1-129 1-129 1-129 1-129 1.5 0.5 1.5 3 5131 95 100 TO-99 To-99 TO-99 To-gg 1-135 1-135 1-135 1-135 DIP DIP DIP DIP 1-85 1-95 1-95 1 0~2S 95 10.31 90 Com Com MIL Com 3QJ 88 92 88 Ind Ind MIL 5' 88 Com Int.· 4 ' int.'''' 0.025 0.025 0.060 0.060 0.100 0.100 0.025 0.025 0.060 0.060 0.100 0.100 0.6 0.6 1.3 1.3 1.8 1.8 0.6 0.6 1.3 1.3 1.8 1.8 120 120 120 120 117 117 120 120 120 120 117 117 MIL MIL MIL MIL MIL MIL Ind Ind Ind Ind Ind Ind 2.5psec 2.5p.ec int. int. 12 12 12 12 0.5 0.25 10 5 94 94 Ind Ind TO-99 TO-99 1-33 1-33 10 10 1.5psec 1.5psec int. int. 12 12 12 12 0.5 0.25 10 5 94 94 Ind Ind TO-99 TO-99 1-33 1-33 500 500 500 500 500 oxt. oxt. oxt. 9 9 9 9 9 9 180 180 180 180 180 180 5 4 ±5 ±4 ±5 ±4 100 20 ±80 ±40 ±100 ±80 86 86 86 86 500 60 80 80 60 60 80 86 MIL MIL Ind Ind MIL MIL DIP DIP DIP DIP DIP DIP 12-94 12-84 1-121 1-121 1-121 1-121 - 10 200 50 300.31 NA Ind TO-3 1-184 int. 12 12 16.6 16.6 0.100 0.100 1.8 1.8 117 117 Com Com DIP DIP 1-17 1-17 0.25131 0.25 13) 120 120 -55'C to +200'C To-99 TO-gg 1-29 1-29 5 98 -55'C to +2OO'C To-99 1-9 - - 3553AM, (0) 32 20Q0 - Low Cost OPA27GP OPA37GP B,A=I 63, A=5 1.9131 11.9~J - OPA27HT OPA37HT 6,A=1 36, A=5 1.9 11.9 - OPAIIHT 12,A=1 4 1.5psec - - int. int. I'" int. I'" int. I.. ' int.'''' int.'''' int. I .. ' int. I '" int. I '" ext. ext. ext. int.'·' int. int.I"1 12 12 ext. 10 5 16.6131 0.050 16.6131 0.050 15 5131 NOTES: (1) "(0)" indicates product also available with screening for increesed reliability. MIL = -55'C to +125'C. (3) TYPIcal. (4) G = 5 min for OPA37. leadln~s 5131 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 16.6 Unity-Gain Buffer *Available in 2o-pin ceramic 96131 96IS1 96131 12 12 12 12 12 12 12 12 12 12 12 12 int. 5 Temp Range 3131 5131 5000, A = 1000 51100, A = 1000 1000 into 5 Open Loop Gain, min 5 5 24 ~O,A=IOO into into At Temp 25'C Drift (±V) (±mA) (±mV) (±pVrC) 1 0.75 1 2.5 OPA800UM OPA600VM OPA600BM OPA600CM OPA600SM OPA600TM Wide Temp Range tion OPA606KM OPA606LM OPA606SM OPA606KP snoo, A = Rated Output, min Is 3 131 86 TO-99, TO-gg, TO-99, TO-99, TO-99, TO-gg, TO-99, To-99, TO-99, TO-99, TO-gg, TO-99, (2) Com = 0 to +70·C, Ind chip carriers. Models in bold lace type are found in this supplement; others aro in the Burr-Brown Integrated CIrcuits Data BOOk. Vlll DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 1-17 . 1-17 -25' C to +85· C, HIGH VOLTAGE-HIGH CURRENT Offset Voltage, max Rated Output, (±V) (±mA) At 25'C, (±mV) 20 26 20 26 lOA lOA lOA lOA 10 5 10 5 65 40 65 40 min Description High Power Modell1! OPA501AM OPA501BM OPA501RM OPA501SM Frequency Response Bias Current Temp Drift, (±pVl'C) (25'C), max (pA) Unity (MHz) Slew Rate (Vlpsec) 40nA 20nA 40nA 20nA 1 1 1 1 1.35 1.35 1.35 1.35 Gain Open Loop Temp Gain Range (dB) .., Package Page 94 98 94 98 Ind Ind MIL MIL TO-3 TO-3 TO-3 TO-3 1-103 1-103 1-103 1-103 OPA511AM 22 5A 10 65 40 1 1 91 Ind TO-3 1-111 OPA512BM OPA512SM 35 35 lOA 15A 6 3 65 40 30 20 4 4 2.5 2.5 110 110 Ind MIL TO-3 TO-3 1-116 1-116 OPA541AM OPA541BM OPA541SM 30 35 35 5A SA SA 10 1 1 40 30 30 50 50 50 1.6 1.6 1.6 8 8 8 90 90 90 fnd. Ind. MIL TO-3 TO-3 TO-3 9 9 9 3573AM 3572AM 3571AM, (0) 20 30 30 2A1Sl lA14: 10 2 2 65 40 40 40nA -100 -100 1 0.5 0.5 2.6 3 3 94 94 94 Ind Ind Ind TO-3 TO-3 TO-3 1-202 1-196 1-196 Wideband 3554AM, (0) 35548M, (0) 3554SM, (0) 10 10 10 100 100 100 2 1 1 50 15 25 -50 -50 -50 170013 ) 170013) 170013) 1200 1200 1200 100 100 100 Ind Ind MIL TO-3 TO-3 TO-3 1-188 1-188 1-188 High Voltage 3584JM, (0) 3583AM 3583JM 15 75 75 15 30 60 3 3 3 3 3 10 25 25 25 25 25 30 -20 -20 -20 -20 -20 -50 20 131 150 30 30 20 126 118 118 118 TO-3 TO-3 TO-3 TO-3 1-214 1-210 1-210 1-206 3581J 3580J 145 140 140 145 70 30 TG-3 1-2:3 TO-3 1-206 Advance { Information OPA445BM OPA445SM 35 35 15 15 3 1 10 10 50 50 2 2 Booster 3553AM, (0) 10 200 50 300/6 ) -200 OPA633AH OPA633SH OPA633KP 10 10 10 80 80 80 15 15 15 33(6) 35pA 35pA 35pA 3582.1 2AI51 33 161 33 161 20 11:::: 15 106 Com Ind Com Com Corn Com 10 10 100 100 Ind MIL TO-99 TO-99 5 5 300 2000 NA Ind TO-3 1-184 275161 1000 1000 1000 NA NA NA Ind MIL TO-8 TO-8 DIP 29 29 29 5 5 5 5 5 275(61 275(61 NOTES: (1) "(0)" Ind. cates product also ava.lable w.th screening for increased reliability. to +t25'C. (3) Gain-bandwidth product. (4) 2A peak. (5) SA peak. (6) Typical. (2) Com Com = 0 to HO'C, Ind =-25'C to +85'C, MIL = -55'C INSTRUiViENTAll0N AMPLIFIERS AND PROGRAMMABllE GAIN AMPLIFIERS INSTRUMENTATION AMPLIFIERS Range INA104HP INA104JP INA104KP INA104AM INA104BM INA104CM INA104SM 1_1000121 1_1000121 1-1000121 1-1000 121 1-1000 121 1-1000121 1-1000121 0.15 0.15 0.15 0.15 0.15 0.15 O. t5 INA101AM' INA101CM iNA101SM INA101AG INA101CG INA101SG INA101HP INA101KU 1_1000 121 1-1000121 1-1000121 1-1000121 1-1000121 1-1000121 1-1000121 1-1000 121 0.03 0.03 0.03 0.03 0.03 0.03 0.3 0,3 22141 INA102AG' INA102CG } 1,10,100, 1000 0.25 0.15 20 15 Gain Description Very-High Accuracy Low Quiescent Power Input Parameters Gain Accuracy, G=100, 25'C, max (0/0) Model NonGain Drift, ,Linearity, G =100 G=100, (ppm/'C) max(%) 22 22 22 22131 22131 22131 22131 22141 221~1 22 131 22 131 22 (3) 2213) 22[31 Offset Voltage Dynamic Response, CMR, DC to 60Hz, G =10, lkCl Unbal., vs Temp, G =100, ±3dB BW (kHz) Range Temp min (dB) max (p.V/"'C) '" Package Page ±0.007 ±0.003 ±0.003 ±O.OO7 ±0.003 ±O.OOJ ±O.OOJ 96 ±(2±20/G) ±(0.25 ± 10/G) ±(0.75 ± to/G) ±(2±20/G) ±(0.75 ± 10/G) ±(0.25 ± 10/G) ±(0.75 ± 10/G) 25 25 25 25 25 25 25 Com Com Com Ind Ind Ind MIL DIP DIP DIP DIP DIP DIP DIP 2-26 2-26 2-26 2-26 2·26 2-26 2-26 ±0.007 ±0.004 ±0.004 ±0.OO7 ±0.003 ±0.003 ±0.OO7 ±0.O07 96 96 96 96 96 96 25 25 25 25 25 25 25 25 Ind Ind MIL Ind Ind MIL Com Com TO-laO TO-l00 TO-l00 DIP DIP DIP DIP SOIC 2-7 2-7 2-7 2-7 2-7 2-7 2-7 90 ±(2+20/G) ±(0.25 + 10/G) ±(0.25 + la/G) ±(2 +20/G) ±(0.25 + 10/G) ±(0.25 + la/G) ±(2 + 20/G) typ ±(2 + 20/G) typ xxiii ±0.05 ±0.02 80 90 ±(5+10/G) ±(2+ 5/G) 3 3 Ind Ind DIP DIP 2-18 2-18 96 96 96 96 96 96 90 *Available in 20-pin ceramic leadless chip carriers. I nls table continued on next page. Models in boldface type are found in this supplement; others are in the Burr-Brown Integrated Circuits Data Book. ix INSTRUMENTATION AMPLIFIERS (CO NT) Gain G=100, 25'C, max (%) Drift. G =100 (ppm/'C) } 1,10,100, 200,500 } 1,10,100 200, 500 0.2 0.1 0.1 0.2 0.2 3627AM 3627BM lVIV, fixed 1V1V, fixed 0.01 om INA105AM' INA105BM INA105KP INA105KU 1V1V, fixed Description Gain Range Model Fast Settling INAll0AG' INA110BG INA110SG INA110KP INAll0KU FET Inpul Buffer, Unity-Gain Oifferential Input Parameters Gain Accuracy. 0.01 G=100, max(%) CMR, DC to 60Hz, G = 10, lkO Unbal" min (dB) 40 20 20 Styp Styp ±0.02 ±0.01 0.01· 0.02 0.02 87 96 9S 87 87 5 5 ±O.O01 13! ±O.OO1 13J ±O.OOlI3l ±O.OOl 131 ±O.OOlI31 ±O.OO1 131 86 161 72161 721111 NonLinearity. Dynamic Response, Offset Vortage G=100, ±3dB BW (kHz) Temp Range Package Page ±(2+50/G) ±(2 + 20/G) typ ±(2 + 2OJG) typ 470 470 470 470 470 Ind Ind MIL Com Com DIP DIP DIP DtP SOIC 2-46 2-46 53 53 53 90 100 30 20 800131 600131 Ind Ind TO-99 TO-99 2-122 2-122 SOISI 20 10 51yp 5 1000 131 1000(3) 1000 131 1000131 Ind Ind Com Com TO-99 TO-99 DIP SOIC 2-36 2-36 2-36 5001~' 500151 500151 Ind Ind Com DIP DIP DIP 45 45 45 vs Temp, max (pV!'C) ±(5 +100/G) ±(2 +50/G) • (11 1VIV. fixed om lVIV, fixed 1VIV. fixed 0.025 0.025 5 ,5 5 5 INA108AM INA106BM INA106KP 10VIV IIxed 10VIV IIxed 10VlV IIxed 0.01 0.01 0,025 10 10 4typ 0.001 0.001 0.001 tOO l61 86(11) 5 2 0.2typ INA117AG INA117BG INA117P lVlVllxed lVIV IIxed lV/V fixed O.05C3~ 0.02131 0.05 431 10'31 10/31 10 131 0.001 131 0.001'31 0.001 431 74 13•61 8613.6 ) 7413.61 40 20 40 200131 20043) 200131 Ind Ind Com TO-99 TO-99 DIP 57 57 57 PGA100AG PGA100BG Gain set with4·bit word 1, 2, 4,8 ... 128 PGA102AG PGA102BG PGA102SG PGA102KP Gain set with 2·bit word 1, 10 100 Instrumentalion Amplifier Input PGA200AG PGA200BG Gain set with 2·bit word 1, 10, 100,1000 Differential Input 3606AG 3606AM 3606BG 3606BM Gain set with3·blt word 1, 2, 4 8 ... 1024 Gain of 10 Differential High Common Mode Voltage Differential (200VDCCMV 94161 xxIII PROGRAMMABLE GAIN AMPLIFIERS Noninverting Multiplexed Input 0.05 0.02 10 10 ±O,O) ±0.005 NA NA 61yp 61yp 5MHz 5MHz Ind Ind DIP DIP 2-58 2-58 0.02 0,01 0.02 20 20 20 50 0.01 0.01 0,01 0.01 - 3,G=I00 3,G=100 3,G=I00 3,G=I00 250 250 250 250 Ind Ind Ind Com DIP DIP DIP DIP 2-66 2-66 2-1;6 2-66 0.05 0.02 20 10 ±0.007 ±0.003 96 96 2, G = 100 0.4, G =100 30 30 Ind Ind DIP DIP 2-76 2-76 0.05 0.05 0.02 0.02 10 10 10 10 0.004 0.004 0.004 0.004 90, G=1' 90, G =1 9O,G=1 90,G =1 ±(3+ 50/G) ±(3 +50JG) ±(1 +20/G) ±(1 +20/G) 40 40 40 40 Ind Ind Ind Ind DIP DIP DIP DIP 2-114 2-114 2-114 2-114 om NOTI;S: (1) Com ~ O'C to +70'C, Ind ~ -25'C to +85'C, MIL external reSistor. (5) Gain = 10. (6) No source imbalance. ~ -5S'C to +125'C. (2) Set with external resistor. (3) Unity-gain. (4) With zero TC PRECISION TRANSMITIERS Span Description Two·Wire Three· Wire and Current Source Input Parameters Output Parameters Model Untrimmed Error, max(%) CMR, DC, min (dB) Current Range (rnA) 'XTR100AM XTR100AP XTR100BM XTR100BP -3 -3 -3 -3 XTR101AG* XTR101BG -5 -5 om ±100 ±100 ±60 ±30 ±1.5 ±0.75 90 90 4-20 4-20 ±10 ±6 XTR101AP XTR101AU -5 -5 0.01 0.01 ±100 ±100 ±100 ±100 ±1,5 ±1.5 90 90 4-20 4-20 XTR110AG' XTR110BG XTR110KP XTR110KU 0.6 0.2 0.025 0.005 0.025 0.025 50 30 50 50 - -- - } 4-20, 0-20, 5-25 Non· Linearity, max(%) Temp Oriftl1i (ppmI'C) Offsel Voltage, max (PV) Offset Voltagevs Temp, max (pVl'C), 0.01 ±100 ±100 ±100 ±100 ±50 ±50 ±25 ±25 ±1 ±1 ±D.5 ±D.5 90 90 90 90 4-20 4-20 4-20 4-20 O.S 0,6 NOTES: (1) With zero TC span resistor. ranges with appropriate,circuit. om 0.01 0.01 0.01 - - (2) Com ~ 0 to +70' C, Ind ~ '" Olfsel Current Error, max (PA) FS Output Current Error, max (PA) Temp Range ±20 ±20 ±20 ±20 Pack· age Page Ind Ind Ind Ind DIP DIP DIP DIP 2-82 2-82 2-82 2-82 ±40 ±30 Ind Ind DIP DIP 2-94 2-94 ±19 ±19 ±SO ±60 rnd l31 Indl31 DIP SOIC 65 xxIII ±64 ±16 ±64 ±64 ±96 ±32 ±96 ±S6 Ind Ind Com Com DIP DIP DIP SO.IC 2-104 2-104 2-104 xxIII ±4 ±4 ±4 . ±4 -25' C to +85' C, MIL ~ -55' C to +125'C. '" (3) -40'C to +85'C. *Available in 20-pin ceramic leadless chip carriers. Models in boldface type are found in this supplement; .others are in the Burr-Brown Integrated Circuits Data Book. x (4) Many more ISOLATION PRODUCTS TRANSFORMER COUPLED AMPLIFIERS Isolation Voltage (V) Isolation Mode Rejeetion, typo DC (dB) 60Hz (dB) Leakage Current at Test Voltage (pA) Gain peak peak (0) (pF) (%) (%) Voltage Drift. (±pVl'C) max max ±3dB Freq. (kHz) Required C1I Package Page Low Drift l2J 3450 ±500 ±2000 t60 120 ,t 10'2 16 ±0.005 ±0.0015· 100 50nA 1.5 No Com Module 3-19 Low Bias 3451 3452 3455 ±500 ±2000 ±2000 ±5000 10'2 10'2 10'2 16 16 16 ±0.025 ±0.025 ±0.025 ±0.005 ±0.O05 ±0.005 100 100 100 25pA 10pA 20pA 2.5 2.5 2.5 No NO'41 '" 120 120 120 1 t '" 160 160 160 No'''' Com Com Com Module Module Module 3-19 3-19 3-19 3656AG ±3500 ±BOOO 160 125 0.5 10'2 6 ±0.1 ±0.03 25+ (500/G,) 5+ (tOOO/G,) 200 + (1000/G,) 50+ (750/G,) 10+ (350/G,) 100nA 30 No Ind DIP 3-29 Description FET Highest Isolation Voltage Model Contin- Pulsel UQUS, Test, '" Isolation Impedance Nonlinearity max typo 3656BG ±3500 ±BOOO 160 125 0.5 10'2 6 ±0.05 ±0.03 3656HG ±3500 ±BOOO 160 125 0.5 10'2 6 ±0.15 ±0.03 3656JG ±3500 ±BOOO 160 125 0.5 10'2 6 ±0.1 ±0.03 10'2 6 ±0.1 ±0.03 3656KG ±3500 ±BOOO 160 125 0.5 Balanced Current Input 3650HG 3650JG 3650KG 3650MG ±2000 ±2000 ±2000 ±2000 ±5000 ±5000 ±5000 ±5000 140 140 140 140 120 120 120 120 0.25151 Balanced 3652HG 3652JG 3652MG ±2000 ±2000 ±2000 ±5000 :t:tiOOU ±5000 140 14U 140 120 750 750 750 2500 2500 2500 , Bias Cur- rent. External Isolation Power Temp. Range lOOnA 30 No Ind DIP 3-29 100nA 30 No Com DIP 3-29 100nA 30 No Com DIP 3-29 100nA 30 No Com DIP 3-29 10nA 15 15 15 15 Yes lSI Yes'S! Yes lS! Yes l6! Ind Ind Ind Ind DIP DIP DIP DIP 3-21 3-21 3-21 3-21 Yes OPTICALLY COUPLED AMPLIFIERS FET Input 0.25 151 10'2 10'2 10'2 10'2 I.B 1.B I.B 1.B ±0.2 ±0.1 ±0.05 ±0.2 0.25 151 0.25 151 ±0.05 ±0.03 ±0.02 ±0.05 25 10 5 100 lOnA lOnA lOnA 0.25151 1012 U.~O~:;l ±0.05 50 50nA lU ' .:! ::tu.u5 :!5 50nA ±0.05 100 50nA Yes Ind Inu Ind DIP DIP DIP 3-21 ±0.2 15 10 15 "TtlS 0.25 151 10'2 ::tU.l 120 I.B 1." 1.8 ±0.2 1lU 0.3 0.3 0.3 10'2 10'2 10'2 2.5 2.5 2.5 0.4 0.1 0.07 0.1 O.ot 0.02 10(61 4C61 4161 10nA 10nA 10nA 60 60 60 Yes Yes Yes Ind Ind Ind DIP DIP DIP 3-6 3-6 3-6 146161 10a l61 146161 10al61 146161 lOal6J 3-21 3-21 Low Drift Wide Bandwidth IS0100AP IS0100BP IS0100CP 1500VAC 150102 1501028 ±2121 ±2121 ±4000 ±4000 160 160 120 120 1.0 1.0 10'· 10'4 6 6 0.075 0.025 0.04 0.02 ±500 ±250 100pA 100pA 70 70 Yes Yes Ind Ind DIP DIP 68 68 150106 1501068 ±4950 ±4950 ±8000 ±8000 160 160 130 130 1.0 1.0 10'4 10'4 6 6 0.075 0.025 0.04 0.02 ±500 ±250 100pA 100pA 70 70 Yes Yes Ind Ind DIP DIP 68 68 CAPACITOR COUPLED, HERMETICALLY SEALED AMPLIFIERS Isolation 3500VAC Isolation = = NOTES: (1) Com O'C 10 HO'C, Ind -25'C 10 +85'C. (2) Bipolar. (3) Isolation vollage tesled at 2500V, rms, 60Hz; leakage currenl tesled for 2pA max a1240V, rms, 60Hz. (4) ±15V at ±15mA isolated power available 10 power exlernal circuitry. (5) At 240v/60Hz. (6) R'N 10k, Gain 100. = = .. ISOLATION POWER SUPPLIES'" Isolation Voltage (V) Continuous Input Voltage (V DC) Description Model Peak Pulsel Test Peak Single ±15V Output 700 700U 725 726 1500 2000 2121 4950 4200 5000 4000 8000 10 10 7 7 lB 18 18 18 Dual ±15V Output 722 4950 8000 5 16 Quad ±15V Oulpul 710 1000 3100 10 Quad ±8V Output 724 1000 3000 5 NOTE: Leakage Current, 240VAC, 60Hz (pA) Isolation Rated Max Current, Current,"1 Balanced Sensitivity To (0) (pF) Balanced Loads On All Outputs (mA) '" Package Page 1.2 10'0 10'0 10'2 10'2 5 3 9 9 ±3-30 ±3-30 ±15 ±15 ±60 ±60 ±40 ±40 1.08 1.0B 1.15 1.15 Ind Ind Ind Ind Module Module DIP DIP 14-35 14-35 82 82 1 10 '0 6 ±3-40 ±50 1.13 Ind Module 14-41 18 1 10 '0 B ±9.5 ±60 1.08 Ind Module 14-37 16 1 10'0 6 ±3-16 ±60 0.63 Ind Module 14-45 Min Max 1 1 1.2 Impedance Loads On All Outputs (mA) To Inpul Voltage Change (V/v) Temp Range (1) See complete data sheel for full specifications, especially regarding output current capabilities. (2) Ind = -25'C to +85'C. Models in boldface type are found in this supplement; others are in the Burr-Brown Integrated Circuits Data Book. xi ANALOG CIRCUIT FUNCTIONS MULTIPLIERS/DIVIDERS You can select accuracy from 0.25% to 2% max from tbis complete lhie of integrated circuit multipliers. Most provide full fourquadrant multiplication. All are laser-trimmed for accuracy-no trim pots are needed to meet specified performance. Tbese compact models bring tbe cost of bigb performance down to acceptable levels. MULTIPLIERS/DIVIDERS Temperature Coefficient (%/'C) Feedthrough (mV) Offset Voltage ("1V) 1% Bandwidth (kHz) Temp Range Transfer Function Error at +25'C, max(%) '" Package Page [(X, - X,)(y, - Y,)/l0] + Z, ! ! ! ±2 ±1 ±0.5 ±0.5 0.017 0.008 0.008 0.025 100 30 30 30 50 10 7 7 70 70 70 70 Ind Ind Ind MIL TO-l00 TO-l00 TO-lOO TO-l00 4-23 4-23 4-23 4-23 ! ! ! ! 0.022 0.022 0.015 0.015 0.008 0.008 0.02 0.02 0.01 0.01 0.3% 0.3% 0.15 0.15% 0.05% 0.05% 0.3% 0.3% 0.15% 0.15% 5 5 2 2 2 2 5 5 2 2 3MHz 3MHz 3MHz 3M Hz 3MHz 3MHz 3M Hz 3MHz 3MHz 3M Hz Com Com Com Com Com Com MIL MIL MIL MIL TO-lOO D!P TO-l00 DIP TO-lOO DIP TO-l00 DIP TO-l0o DIP 4-31 4-31 4-31 4-31 4-31 4-31 4-31 4-31 4-31 4-31 10MH~ Model MPY100A' MPY100B MPY100C MPY100S MPY534JH' MPY534JD MPY534KH MPY534KD MPY534LH MPY534LD MPY534SH MPY534SD MPY534TH MPY534TD • ! ! ! ! ! ±1.0 ±1.0 :1;0.5 ±0.5 ±0.25 ±0.25 ±1.0 ±1.0 ±0.5 ±0.5 MPV634AM' MPY634BM MPY634SM MPV634KP MPY634KU ! ! ! ! ! ±1.0 ±0.5 ±1.0 ±2.0 ±2.0 0.022 0.015 0.02 0.03 0.03 0.3% 0.15% 0.3% 0.3% 0.3% 5 2 5 25 25 10MHz 10MHz 10MHz 10MHz Ind Ind MIL Ind Com TO-lOO TO-lOO TO-lOO DIP SOIC 4-38 4-38 4-38 4-38 xxIII AD632A , AD632B AD632S AD632T • • 1 0.5 1 0.5 0.02 0.01 0.02 0.01 0.3 0.15 0.3 0.15 30 15 30 15 50 50 50 50 Ind Ind MIL MIL TO-lOO, DIP Advance Information ! ! .Same as model above. NOTE: (1) Com = O'C to +70'C, Ind = -25'C to +85'C, MIL = -55'C to +125'C. *Available in 2o-pin ceramic leadless chip carriers. SPECIAL FUNCTIONS Tbis group of models offers many different functions tbat are tbe ,quick, easy way to solve a wide variety of analog computational problems. Most are in integrated circuit packages and are lasertrimmed for excellent accuracy. SPECIAL FUNCTIONS Temp Function Model Comments Description Rangelll Package Page Ind DIP 4-111 4302 V (ZlX)m This function may be used to multiply, divide, raise to powers. take roots and form sine and cosine functions. Plastic package. LOG100JP K Log (1,/1,) Optimized for log ratio of current inputs. Specified over six decades of input (1 nA to 1rnA), 55mV total error, 0.25% log conformity. Com DIP 4-15 Logarithmic Amplifier .4127JG 4127KP K Log (1,/lR") A more versatile part which contains an internal reference and 8: current inverter. 1% and 0.5% accuracy. Com Com DIP DIP 4-90 4-90 .JtIc 4341 True rms~to~DC conversion based on a log~antilog occupational approach. Some external trimming required. Lower cost in plastic package. Pin compatible with 4340. Ind DIP 4-119 4085BM 4085KG 4085SM These are analog memory circuits which hold and provide read-out of a DC voltage equal to peak value of a complex input waveform. Digital mode control provides reset capability and allows selection of peaks within a desired time interval. May be used to make peak-to-peak detector. Com Ind MIL DIP DIP DIP 4-82 4-82 4-82 Multifunction Converter T E,.' (t) dt Peak Detector NOTE: (1) Com = O'C to +70'C, Ind = -25'C to +85'C, MIL = -55'C to +125'C. Models in boldface type are found in this supplement; others are in the Burr-Brown Integrated Circuits Data Book. xii DIVIDERS The use of a special log/ antilog commited divider design overcomes the major problem encountered when trying to use a multiplier in a divider circuit. Outstanding accuracy is maintained even at very low denominator voltages. DIVIDERS Accuracy, max Transfer Input Model Function Range 0= 250mV (%) DIVtOOHP DIV100JP DIV100KP NID to NID 10 NID 10 250mV to 10V 1.0 0.5 0.25 NOTE: Temperature Coefficient Rated Temp (%J'C) 0.5% Bandwidth (kHz) Output, min Range l1 ) Package. Page 0.2 0.2 0.2 15 15 15 ±10V, ±5mA ±10V, ±5mA ±10V, ±5mA Ind Ind Ind DIP DIP DIP 4-7 4-7 4-7 (1) Ind = -25'C to +85'C. FREQUENCY PRODUCTS This group of products consists of precision oscillators and active filters for both signal generation and attenuation. Both fixed frequency and user-selected frequency units are available. FREQUENCY PRODUCTS Function Oscillator Universal Active Filter NOTE: Model 4423 UAF41 UAF21 Description Comments Temp Range 'll Package Page Com DIP 4-123 Ind Ind DIP DIP 4-68 4-60 Frequency range: 0.002Hz 10 20kHz. Frequency stability: O.Ol%/'C. Very-low cost in plastic package. Provides resistor programmable quadrature outputs (sine and cosine wave outputs simultaneously available). Quadrature phase error: ±O.1%. These filters provide a complex pole pair. Based on state variable approach, low-pass, high-pass and bandpass outputs are available. Add only resistors to determine pole location (frequency and Q). Easily cascaded for complex filter responses. (1) Com: 0 to +70'C, Ind = -25'C to +85'C. VOLTAGE REFERENCE These products are precision voltage references which provide a + lOY output. The output can be adjusted with minimal effect on drift or stability. VOLTAGE REFERENCE Power Supply Temp Minimum Maximum Output (V) Output (mA) Drift (ppm/'C) (V) (mA) Range t1l Package Page REF10KM' REF10JM REF10SM REF10RM +10.00 ±0.005 +10.00 ±O.OOS +10.00 ±O.OOS +10.00 ±O.OOS 10 10 10 10 1 2 3 6 +13.5/35 +13.5/35 +13.5/35 +13.5/35 4.5 4.5 4.5 4.5 Com Com MIL MIL TO-99 TO-99 TO-99 TO-99 4-46 4-46 4-46 4-46 REF101KM' REF101JM REF101SM REF101RM +10.00 ±O.OOS +10.00 ±O.OOS +10.00 ±O.OOS +10.00 ±O.OOS 10 10 10 10 1 2 3 6 +13.5/35 +13.5/35 +13.5/35 +13.5/35 4.5 4.S 4.S 4.S Com Com MIL MIL TO-1m TO-99 TO-99 4-52 4-52 4-52 4-52 Model "'Available in 20-pin ceramic lead less chip carriers. (1) Com = 0 to +70'C, MIL = -S5 to +125'C. NOTE: Xlll TO-99 DATA CONVERSION AND DATA ACQUISITION ANALOG-TO-DIGITAL CONVERTERS Description Model Linearity ConverError sion (%FSR). Time·(PS) Screen Resolution (Bits) a 12 ±0.012 1.5 30 QI1I Gain TampeD Temp Input (ppm/'C) Rangel2l Range'~ (V) Package Page MIL,lad 10,20, utB Hermetic Metal DIP 5-102 Very High Speed ADC803 Ultra High Speed ADC600 12 ±O,OlS 0,1 30 Com 1.25 B Module 103 Serial Out ADC804 a 12 ±0.012 17 30 -} MIL Com,lnd 5,10,20 utB Hermelic Ceramic DIP 5-114 Low Cost, MicroADC574 processor Interface ADC674 a a a 12 12 ±0.012 ±0.012 25 15 25 25 } MIL, Com,lnd 10,2OutB 10,20utB Hermetic Ceramic DIP Hermetic Ceramic DIP 5-80 5-93 12 12 ±0.012 ±0.012 25 25 30 30 Ind Ind 5,10,20 U/B 5,10,20U/B Hermetic Ceramic DIP Hermetic Ceramic DIP 5-56 12 ±0.012 50 35 -55'Cto +200'C 10,20, U/B Hermetic Ceramic DIP 5-3 Low Cost ADC80AG ADCBOMAH aM 111· High Temp ADC10HT High Speed, Low Cost ADC84 a 12 ±O.012 10 30 Cem 5,10,20 U/B Hermellc Ceramic DIP 95 High Speed, Wide Temp ADC85H ADC87H a a 12 12 ±O.012 ±0.012 10 10 30 30 Ind MIL 5,10, 20 U/B 5,10,20U/B Hermetic Ceramic DIP Hermetic Ceramic DIP 95 High Resolution ADC71 ADC72 ADC76 a a a 16 16 16 ±0.003 ±0.003 ±0.003 50 50 17 15 15 15 Ind,Com Ind,Com Ind,Cpm 5,10,20 utB 5,10,20 utB 5,10,20utB Ceramic DIP Hermetic Metal DIP Ceramic DIP 5-13 5-21 5-40 Audio PCM75 16 0.006% THO 17 20 Com 5,10,20 U/B Ceramic DIP 5-122 .. (1) "a" or "OM" ondlcates product available with screening for enhanced reliability. t'OTES: -55'C to +125'C. 95 (2) Com = O'C to +70'C, Ind = -25'C to +85'C, MIL = (3) U = Unipolar, B = Bipolar. DIGITAL-TO-ANALOG CONVERTERS Gain Linearity Error (%FSR) Settling Time (PS) Tempco (ppm/'C) Temp Range t2i Output Range l31 Package Page 5 15 Com 10V,20V U/B Hermetic Ceramic DIP 141 1 1 8 10 10 10 10 MIL, MIL, MIL, MIL, Ind Ind Ind Ind -lmA 10V, 20V U/B ±lmA 10V, 20V U/B Hermetic Ceramic DIP, Plastic DIP, LCC, Die } . 6-98 6-98 6-98 6-98 Model Screen Resotutian (Bits) Very High Resolution DAC729 a 18 ±O.00075 High Resolution DAC700 DAC701 DAC702 DAC703 OM OM OM OM 16 16 16 16 ±0.0015 ±0.0015 ±0.00f5 ±0.0015 DAC7D5 DAC706 OM OM 16 16 ±0.OO3 ±0.OO3 8 1 15 15 MIL, Com, Ind MIL, Com, Ind 10V, 20V U/B ±lmA Hermetic Ceramic DIP Hermetic Ceramic DIP 6-106 6-106 DAC707 OM 16 ±0.OO3 8 15 MIL, Com, Ind 10V, 20V ut8 Hermetic Ceramic DIP, Plastic DIP 6-106 DAC708 DAC709 OM OM 16 16 ±0.OO3 ±0.003 1 8 15 15 MIL, Com, Ind MIL, Com, Ind 2mA,±lmA 10V, 20V utB Hermetic Ceramic DIP Hermetic Ceramic DIP 6-106 6-106 High Resolution DAC70BH DAC71 DAC72BH OM OM OM 16 16 16 ±0.OO3 ±0.003 ±0.003 1,10 1,10 1,10 20 20 20 Ind Com Ind Low Cost, High Resolution DAC710 DAC711 16· 16 ±0.003 ±0.003 1 8 50 50 Com Com ±lmA 10V, 20V utB } Hermetic Ceramic DIP, Plastic. DIP 6-116 6-116 Low Cost, Bus Intertace DAC811 OM 12 ±Q.006 4 20 MIL, Com, Ind 10V, 20V utB Hermetic Ceramic DIP, Plastic ·DIP, SOIC, Die 6-130 CMOS DAC7541 aM 12 ±O.012 2 5 MIL, Com, Ind Multiplying Hermetic Ceramic DIP, Plastic DIP, SOIC, Ole 1St CMOS, Bus Intertace DAC7545 DAC8012 aM aM 12 12 ±O.012 ±O.012 2 1 5 5 MIL, Com, Ind MIL, Com, Ind Multiplying Multiplying }Hermellc Csramlc DIP, Pla.tlc DIP, SOIC, Ole 167 174 Low Cost, Industry Standard DAC80 12 ±0.012 0.3,3 typ 30 Com 6-64 6-85 6-85 0 111 Description Bus Intertace, High Resolution 8 Com, Com, Com, Com, 10V, 2OV, 2mA U/B Hermetic Ceramic DIP 10V, 20V, 2mA utB Hermetic Ceramic DIP 10V, 20V. 2mA utB Hermetic Ceramic DIP DAC85H OM 12 ±0.012 0.3,3typ 20 Ind 10V, 20V, 2mA utB Hermetic Ceramic DIP, Plastic DIP, Die 10V, 20V, 2mA U/B Hermetic Ceramic DIP Ml1Jtary Temp, DAC87H Industry Standard OM 12 ±0.012 0.3,3 typ 20 MIL 10V, 2OV, 2mA U/B Hermetic Ceramic DIP 6-20 6-28 6-20 This table continued on next page. Models in boldface type are found In this supplement; others are In the Burr-Brown Integrated Circuits Dats Book. xiv DIGITAL·TO-ANALOG CONVERTERS (CO NT) Linearity Error (%FSR) Settling Gain Time Screen Resolution (Bits) (ps) Tempco (ppmI"C) Temp Range'21 Oulput Range l31 0 111 Package Page Ultra High Speed ECL DAC63 0 12 ±0.012 0.05 30 MIL,lnd 10mA, utB Ceramic DIP, Metal Can 6·12 Uitra High Speed TTL DAC812 0 12 ±0.012 0.065 20 Ind 10mA, utB Ceramic DIP, Metal Can 6·138 Model Description' " NOTES: (1) "0" or "OM" indicates product available With screening for enhanced reliability. -25'C to +85'C. (3) U ; Unipolar, B; Bipolar. (2) MIL; -55'C to +125'C, Com - O'C to +70'C, Ind- VOLTAGE·TO·FREOUENCY CONVERTERS Frequency Range Description Model'" Low Cost, Monolithic VFC32KP' VFC32BM, (0) VFC32SM, (0) Low Cost Complete VFC42BP VFC42SM VFC52BP VFC52SM Precision Monolithic VFC62BG' VFC62BM VFC62SM VFC62CG VFC62CM (kHz) } } Oto 10 Oto 10 Oto 100 Oto 100 1 } User· selected, I VFC320BG' VFC320BM VFC320SM VFC320CG VFC320CM Synchronized Monolithic User· selected, 500kHz, max VFC100AG' VFC100BG VFC100SG 1MHz max V,N Range (V) Linearity, max (% of FSR) TempeD, max (ppm of FSR/'C) Temp Rangel21 Package Page User· selected ±0.01 at 10kHz ±0.05 at 100kHz ±0.2 at 500kHz 75 typ ±100 ±150 Com Ind MIL OIP TO·l00 TO·l00 10·3 10·3 10·3 Oto+l0 Oto+l0 Oto+l0 Oto+l0 ±0.01 ±0.01 ±0.05 ±0.05 ±100 ±100 ±150 ±150 Ind MIL Ind MIL DIP DIP DIP DIP 10·11 10·11 10·11 10·11 User· selected ±0.005 at 10kHz ±0.005 at 10kHz ±0.005 at 10kHz ±0.002 at 10kHz ±0.002 at 10kHz ±50 ±50 ±50 ±20 ±20 Ind Ind MIL Ind Ind DIP TO·l00 TO·l00 DIP TO·l00 10·17 10·17 1()"17 10·17 10·17 User· selected ±0.005 at 10kHz ±0.005 at 10kHz ±0.005 at 10kHz ±0.002 at 10kHz ±0.002 at 10kHz ±50 ±50 ±50 ±20 ±20 Ind Ind MIL Ind Ind DIP TO·l00 TO·l00 DIP TO·l00 1()"40 10·40 10·40 10·40 10·40 Oto+l0 Oto+l0 Oto+l0 0.025 at 100kHz 0.1 atlMHz 0.025 at 100kHz ±100 ±50 ±100 Ind Ind MIL DIP DIP DIP 10·25 10·25 10·25 I } } User· selected, 1MHz max } Clock Programmed, 2MHz max NOTES: (1) "(0)" indicates product also available with screening for increased reliability. to+125'C . • Available in 20-pin ceramiC leadless chip carriers. (2) Com; 0 to +70'C, Ind; -25'C to +85'C, MIL; -55'C SAMPLE/HOLD AMPLIFIERS Description Model Gain Offset Charge QI1I Error Error Offset Screen (%FSR) (mV) (mV) Amplifier Band· width, -3dB (MHz) Hold Acqui· Transient sition SetWng Time(ps) (ps to (0.01% lmV) FSR) Aper· ture Time (ns) Aper· ture Input Jitter Range (ns) (Vp·p) Package Page SHC600 0 0.1 5 lOmax 70 0.D15 0.05 8 0.009 2.5 Ceramic DIP 7·21 High Speed SHC803 With Buffer 0 0.1 3 5 max 16 0.15 0.35 25 0.025 20 Hermetic Metal DIP 7·24 High Speed SHC804 0 0:1 Low Cost SHC5320 0 SHC85 SHC298 0 Ultra High Speed NOTE: 0.01 0.01 3 5 max 16 0.15 0.35 25 0.025 20 Hermetic Metal DIP 7·24 0.5 1 typ 1.5 0.25 1.5 25 0.3 20 Hermetic Ceramic DIP 7·30 2 7 2 max 25 max 0.5 1.5 4.5 10 30 200 1.5 15 20 20 Hermetic Metal DIP TO·99 7·11 7·15 (1) "Q" indicates product available with screening for enhanced reliability. xv MULTIPLEXERS Description Protected Inputs High Speed On Resistance, Channels Input Range (V) max(Q) Crosstalk (% of Off Channel) Settling Time (to 0.01%) 8 Single 4 Differential 16 Single 8 Differential ±15 ±15 ±15 ±15 1.8k 1.8k 1.8k 1.8k 0.005 0.005 0.005 0.005 5/ls 4/ls 16 Single or 8 Differential 16 Single or 8 Differential 8 Single or 4 Differential :8 Single or 4 Differential ±15 ±15 ±15 ±15 750 750 750 750 0.004 0.004 0.004 0.004 800ns BOOns 800ns 800ns Input Range (V) Operating Temperature Range Model MPC8S MPC4D MPC16S MPC8D MPC800KG MPC800SG MPC801KG MPC801SG Package <;po 4ps Page 9-3 DIP DIP DIP, DIP 9-3 9-10 9-10 DIP DIP DIP DIP 9-17 9-17 9-24 9-24 MILITARY PRODUCTS ANALOG-TO-DIGITAL CONVERTERS Conversion Resolution Model ADC87/883B ADC87 ADC87U1883B ADC87U ADC87V1883B ADC87V (Bits) Linearity, max (±LSB) Time,max (ps) Gain Drift, max (±ppm/' C) 12 12 12 12 12 12 1/2 1/2 112 112 1/2 1/2 10 10 10 10 10 10 15 15 15 15 15 15 j~"" Package MIL MIL MIL MIL MIL MIL Oto+5, ,0 to +10 32-pin 32-pin 32-pin 32-pin 32-pin 32-pin DIP DIP DIP DIP DIP DIP Page 12-8 12-8 12-8 12-8 12,8 12-8 DIGITAL-TO-ANALOG CONVERTERS Monotonicity ('C) Gain Drift, max (±ppm/'C) Settling Time. max Output Ranges (V) ±2.5, ±S, ±10,+5, +10 (Bits) Linearity, max (±LSB) DAC87-CBI-VlB DAC87-CBI-V DAC87U-CBI-VlB DAC87U-CBI-V DAC87-CBI-I/B DAC87-CBI-1 DAC87U-CBI-I/B DAC87U-CBI-1 12 12 12 12 12 12 12 12 1/2 1/2 112 1/2 1/2 112 1/2 1/2 -55 to +125 -55 to +125 -25 to +85 -25 to +85 -55 to +125 -55 to +125 -25 to +85 -25 to +85 20 20 20 20 20 20 20 20 7/lsec 7pSec 7pSec 7pSec 400nsec 400nsec 400nsec 400nsec DAC870Vl883B DAC870V DAC870U/883B DAC870U DAC870VU883B DAC870VL DAC870UU883B DAC870UL 12 12 12 12 12 12 12 12 1/2 1/2 1/2 112 1/2 1/2 1/2 112 -55 to +125 -55 to +125 -25 to +85 -25 to +85 -55 to +125 -55 to +125 -25 to +85 -25 to +85 25 25 20 20 25 25 20 20 7/lsec 7/lsec 7/lsec 7/lsec 7pSec 7pSec 7pSec 7pSec DAC703VG/883B DAC703VG DAC703VU883B DAC703VL 16 16 16 16 ±.OO3%FSR ±.OO3%FSR ±.003% FSR ±.003%FSR 20 20 20 20 8/lsec 8/lsec 8pSec 8paec Resolution Model NOTE: -55 -55 -55 -55 to +125'" to +125'" to +125 111 to +125111 Operating Temperature Range MIL MIL MIL MIL MIL MIL MIL MIL Ot02mA, ±1mA }~ ±5,±10, Oto+5, Oto+10 , MIL MIL MIL MIL MIL MIL MIL MIL MIL MIL MIL MIL ±10 ±10 ±10 ±10 Package 24-pin 24-pin 24-pin 24-pin 24-pln 24-pin 24-pin 24-pin DIP DIP DIP DIP DIP DIP DIP DIP Page 12-24 12-24 12-24 12-24 12-24 12-24 12-24 12-24 carrier 12-48 12-48 12-48 12-48 12,48 12-48 12-48 12-48 24-pln DIP 24-pln DIP } 28-term. LCC 191 191 191 191 24-pln DIP ceramic 28-term. leadless chip (1) Monotonicity to 14-bit accuracy. VOLTAGE-TO-FREQUENCY CONVERTERS Model VFC32WM/883B VFC32WM VFC32VM/883B VFC32VM VFC32UM/883B VFC32UM at 10kHz (% FSR) Full Scale Drift, max (ppm FSR/' C) Operating Temp- V,N Range (V) FoUT Range, max (kHz) erature Range Package Page ±10 ±10 ±10 ±10 ±10 ±10 200 200 200 200 200 200 ±0.006 ±0.006 ±0.01 ±0.01 ±O.Ol ±0.01 ±100 at 10kHz ±100 at 10kHz -400, +150 at 200kHz -400, +150 at 200kHz ±150 at 10kHz ±150 at 10kHz MIL MIL MIL MIL MIL MIL TO-IOO TO-IOO TO-IOO TO-IOO TO-IOO TO-l00 12-135 12-135 12-135 12-135 12-135 12-135 Linearity. max Models in boldface type are found in this supplement; others are in the Burr-Brown Integrated Circuits Data Book. XVl MULTIPLIERS Model Accuracy Accuracy at 25'C, max (±%) at 125'C, max (±%) 4213WM/883B 4213WM 4213VM/883B 4213VM 4213UM/883B 4213UM NOTES: 112 112 1 1 1 1 Output Offset, max (±mV) Output, Feedthrough, max (±mV) 50 50 100 100 100 100 25 25 30 50 50 50 4 4 4 4 2111 2111 (V,mA) Operating Temperature Range Package Paga ±10,±5 ±10,±5 ±10,±5 ±10, ±5 ±10, ±5 ±10, ±5 MIL MIL MIL' MIL MIL MIL TO-IOO TO-IOO TO-IOO TO-l00 TO-l00 TO-l00 12-166 12-166 12-166 12-166 12-166 12-166 min (1) At +85'C. OPERATIONAL AMPLIFIERS Description Wideband General Purpose Opera- Slew Olfsot Vollago 8andwidlh Rate. Drift,max (±pVl'C) Current, Unity Gain, min max (nA) min (MHz) (Vips) Is ±0.01% (ns) OPA600VM/B638 OPA600VM OPA600UM/BB38 OPA600UM 2 2 5 5 20 20 BO BO lOOpA -IOOpA -100pA -100pA 400 400 400 400 125 125 150 150 3500R/B638 3500U/BB38 5 5 20 ±30 ±30 1 I 0.6 0.6 - internal 20121 2 ±25 0.25 0.5 0.9 0.9 0.9 0.9 0.9 0.9 Modol } 5000, '" A =1000 Bipolar Precision Bipolar 3510VM/BB38 0.12 Low Drift. Low Bias OPA105WM/BB38 OPA105WM OPA11J5VM/ee38 OPA105VM OPA105UM/BB38 OPAI05UM 0.250 0.250 2 2 -lpA -lpA 0.250 5 -l~.A. 0.250 0.250 0.250 5 15121 15121 -lpA -lpA -lpA I 1 1 1 1 1 OPA106WM/B638 OPA106WM OPAI06VM/8838 OPA106VM OPAI06UM/8838 OPAI06UM 0.250 0.250 0.250 0.250 0.250 0.250 5 5 10 10 20121 20121 lOOlA -100lA -I501A -I501A -300lA -3001A 1 1 1 1 1 1 1.2 1.2 1.2 1.2 1.2 1.2 OPAllWM/8838 OPA111UM 0.500 0.500 10 10 ±2pA ±2pA 2 2 1 1 OPA50WM/8838 OPA50WM OPAS01UM/8638 OPA501UM 5 5 10 10 40 40 65 65 ±20 ±20 ±40 ±40 1 1 1 1 1.35 1.35 1,35 1.35 OPA8780VM/8838 OPA8780VM OPA8780UM/8838 OPA8780UM 10 10 10 10 30 30 50 50 -0.05 -0.05 -0.05 -0.05 5 5 5 5 15 15 15 15 Ultra Low 81as Current Low Drift, Low Bias, Low Noise Power Output, Bias AI 25'C, max (±mV) NOTES: (1) Gain-bandwidth product. (V,mA) ling Temp. Range ±IO, ±200 ±10, ±200 ±10, ±200 ±10, ±200 MIL MIL MIL MIL } 16-pin DIP 12-94 12-94 12-94 12-94 internal ±10,±10 ±10,±10 MIL MIL TO-99 TO-99 12-147 12-147 - internal ±10,±10 MIL TO-99 12-15B - internal internal ±10,±10 ±10,±10 ±10,±10 ±10,±10 ±10,±10 ±10,±10 MIL MIL MIL MIL MIL TO-99 TO-99 TO-99 TO-99 TO-99 TO-99 12-74 12-74 12-74 12-74 12-74 12-74 ±10,±5 ±10,±5 ±10,±5 ±10,±5 ±10,±5 ±10,±5 MIL MIL MIL MIL MIL MIL TO-99 TO-99 TO-99 TO-99 TO-99 TO-99 12-84 12-84 12-84 12-84 12-84 12-84 Internal ±10,±5 ±10,±5 MIL MIL TO-99 TO-99 210 210 Internal Internal Intemal Internal ±26,±10A ±26,±10A ±20,±10A ±20,±10A MIL MIL MIL MIL TO-3 TO-3 TO-3 TO-3 222 222 internal internal internal internal ±30, ±60 ±30, ±60 ±30, ±60 ±30, ±60 MIL MIL MIL MIL TO-3 TO-3 TO-3 TO-3 12-1110 12-1110 12-1110 12-1110 Campensatian external external external external ;nto:-rnal internal internal intarlJa! internal internal internal internal internal internal Internal - - - min MIL Package Page 222 222 (2) -25'C to +85'C. INSTRUMENTATION AMPLIFIERS Input Parameters Description Vory High Accuracy NOTES: Nonlinearity G=I00 max CMR, DC 10 60Hz, G =10, min, lkQ UnbaJ. (d8) Offsol Voltage vs Temp, G =1000, max (PV/'C) Dynamic Response, G=I00, ±3d88W (kHz) Temp Range Package Page 22 22 22 22 0.007 0.007 0,007 0,007 96 96 96 96 1,75 1,75 1.75 1.75 25 25 25 25 MIL MIL MIL MIL DIP DIP TO-l00 TO-l00 ·200 200 200 200 22 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 96 96 96 96 96 96 96 96 96 96 96 96 0.5 0.5 1.0 1.0 3.0 3.0 0.5 0.5 1.0 1.0 3.0 3.0 25 25 25 25 25 25 25 25 25 25 25 25 MIL MIL MIL MIL MIL MIL MIL MIL MIL MIL MIL MIL DIP DIP DIP DIP DIP DIP 12-61 12-61 12-61 12-61 12-61 12-61 12-61 12-61 12-61 12-61 12-61 12-61 Gain Range"l Gain Accuracy, G=100, AI 25'C, max (%FS) Gain Drift, G=100, Iyp (ppm/'C) INA101VG/8838 INA101VG INA101VM/8838 INA101VM HOOD HOOD 1-1000 1-1000 0.10 0.10 0,10 0,10 iNA258WG/8638 INA258WG INA258VG/8838 INA258VG INA258UG/8638 INA258UG INA258WLl8838 INA258WL INA258VLl8838 INA258VL INA258ULl8638 INA258UL 1-1000 HOOO HOOO 1-1000 HOOO HOOD HooO HOOO HOOD HOOD HOOD HOOO 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Model 22 22 22 22 22 22 22 22 22 22 22 20terminal eadless chip carrier (1) Set WIth external resistor. Models in boldla.e type are found in this supplement; others are in the Burr-Brown Integrated Circuit~ Data Book, XVll MODULAR POWER SUPPLIES DC/DC CONVERTERS Description Model Input (VDC) Output Isolation (VDC) Leakage Current, max (PA) Package Page Unregulated Unregulated Unregulated Unregulated Unregulated Regulated Regulated Unregulated PWRlxx PWR2xx PWR3xx PWR4xx PWR5xx PWR6xx PWR7xx PWR8xx 5t048 5to 48 5 to 48 5 to 48 5 to 48 5 to 48 ·51048 5to 48 450mW 1.5W 2W, dual channel 3W 4W 2W 5W 5W, triple output 1000 1000 1000 1000 750 1000 1000 1000 5 5 5 5 15 20 25 5 Module Module Module Module Module Module Module Module 14-9 14-11 14-13 14-15 14-17 14-19 237 14-25 Unregulated Unregulated Unregulated Unregulated PWR70 PWR71 PWR72 PWR74 10 to18 IOta 18 5t022 IOta 20 ±15VDC, ±15mA ±15VDC, ±25mA ±15VDC, ±100mA ±15VDC, ±25mA 2000 1000 1000 1500 2 3 3 2 Module Module Module Module 14-27 14-29 14-31 14-33 Unregulated PWR1017 101018 3 Module 241 PWR5038 PWR5104 PWR5105 4.75105.25 4.75105.25 4.75105.25 ±15VDC, ±25mA, 4 channels 2,75W,lrlple outpul ±12VDC, ±370mA ±15VDC, ±300mA 1000 Regulated Regulated Regulated 500 750 750 5 15 15 Module Module Module 245 247 247 NOTES: (1) Models 700 and 700M have separate internal input and output shields. Models 700U and 700UM have no internal shields. Models 700M and 700UM are similar to models 700 and 700U, but in addition, they are 100% screened to patient-connected circuit requirements for the leakage current (par. 27.5) and withstand voltage (par. 31.11) of UL544. Additional per·unit charge for 700M or 700UM. (2) Model 710 provides four channels (sets) of isolated outputs. RELIABILITY All Burr-Brown PWR Series DC; DC converters are manufactured using stringent in-process controls and quality inspections. The customer may also choose one of two additional levels of screening Standard Manufacturing Process to meet specific requirements. The advanced reliability program is designed to reduce infant mortality, system rework, field failures, and equipment downtime. IG-Levell Screening I Incoming Material Inspection Standard Manufacturing Process Per MIL-S-19500 I I IT -Level II Screeni ng I I . Standard Manufacturing Process I Burn-in, MIL-STD-883, method 1015, 160 hours, T. = +125°C Stabilization Bake, MIL-STD-883, method 1008, 24 hours, T. = +125°C I I I OA Lot Acceptance Testing, AQL = 0.5 Temperature Cycling, MIL-STD-883, method 1010, Condition B (-55°C to +125°C) Component Attachment 100% Visual Inspection I I 100% Electrical Test Final Electrical Test I I Burn-in, MIL-STD-883, method 1015, 160 hours, T. = +125°C Seal T I 100% Final Electrical Test Final Electrical Test I I OA Lot Acceptance Testing, AOL = 0.25 External Visual l QA Lot Acceptance Testing, AQL = 1.0 xviii BURR-BROWN-A WORLDWIDE LEADER IN MICROCIRCUITS AND MICROPROCESSOR-BASED SYSTEMS AND SUBSYSTEMS Burr-Brown first introduced VMEbus products in 1983 and now manufactures a comprehensive line of specialized products for the industrial instrumentation, control, and automation markets. Utilizing Burr-Brown's high performance data conversion products (e.g. ADC803), Burr-Brown is able to offer products which set new performance standards in the VMEbus market. When these are operated with the digital signal processing boards, a wide range of applications can be addressed. With over ten years experience in the design and manufacture of board-level products, you can rely on the market leaders for VMEbus data acquisition boards. • • • • o THE SYSTEMS APPROACH TOP-QUALITY VMEbus PRODUCTS FROM BURR-BROWN In addition to the full Q.C. inspection of incoming components, the boards are subjected to a comprehensive temperature-cycled burn-in (8 cycles between -20°C and +50°C). Short addressing available if required (64 bytes) 150ns response to CPU interrogation 7-level interrupt priority selection Full interrupt vector selection-8 lines (256 options) Double Eurocard format, 160mm X 233mm SUPPORT DOCUMENTATION Each VMEbus board is fully supported with a comprehensive operating manual. In addition to detailed set-up and operating instructions, the manual includes schematics and assembly language software written for the 68000 processor. A systems approach has been taken in the design of the bus interface. This ensures software compatibility between the boards as well as giving the system designer a wide range of VMEbus features . • Configuration A24, D16, DTB slave • Address block selectable within 16M bytes memory space Exhaustive tests before and after burn-in ensure that any problems are identified before the product leaves the factory. VMEbus ANALOG 110 BOARDS Output Input Product MPV901 MPV901A MPV901P MPV904 MPV905 MPV906 ACX906 MPV907 MPV911 MPV950S MPV950D MPV952 MPV954 MPV940 ACX945A ACX945B ACX945C ACX946 Resolution (Bits) Number of Channels Sampling Rate (kHz) 12 12 12 32SEl16DIF 32SEl16DIF 32SEl16DIF 11 11 11 - - - 12 84SEl32DIF 33 - - - 12 16 12 12 12 32SEl16DIF 8SE 16SE 8SE +8DIF 8SE 33 45 330 330 330 - - - - Resolution (Bits) Number of Channels Sampling Rate (kHz) -12 -2 200 2 16 8 200 285Hz 285Hz - - - - - - 12 12 12 - - : - - - 12 - 8 858 - - - - - - 12 16 4 4 500 83 12 12 12 16SEl8DIF 16SEl8DIF 16SEl8DIF 33 33 33 - - - - - xix - Description General purpose, .analog Input. As MPV901. with analog output. As MPV901A. with software-programmable gain. Low-cost analog output (voltage output). Current output. High-density analog input. optically isolated. optional digital 110. Digital 110 module for MPV9061907. 32 110 lines. Low~cost analog input, optional digital 110. High resolution analog input. with on-board data buffer. High speed analog input. As MPV950S. with 8 user-configurable input amplifiers. High speed analog input. with on-board data buffer. High speed analog output. with on-board data buffer. Intelligent I/O controller-6800 CPU. optically isolated I/O expansion Interface. Analog Input module for MPV940. As ACX945A. with 12-bit analog output. As ACX945A. with 16-bit analog output. Digital 110 module for MPV940, 32 programmable 110 lines. VMEbus DIGITAL 110 Description Product Number of Channels Type MPV902 MPV910 MPV910NS MPV910LV MPV930 32 32 32 32 48 Relay contact output Optical isolated input Optical isolated input Optical Isolated input TTL level I/O 28VDC at O.5A, lOW max output rating. As MPV910 without power supply. As MPV910NS for low voltage Inputs. Lines programmable as input or output in groups of eight. VMEbus DIGITAL SIGNAL PROCESSING BOARDS Description Product SPV100 FFT100'" FILlOO'" COR100'" ASM310V MON100V APS100V'" SPV120 ACX120A ACX120B ASM320V MON120V APSI20V'" MPV960 ACX960 MPV990 NOTE: A VMEbus board for general purpose DSP, based on the Texas Instruments TMS32010. Swinging buffer data memory for pipelining of data inpuVoutputand processing. Program ROM and RAM for user programming. Fast Fourier Transform firmware for the SPV100. FFT-l 64 points, -3 256 points, -4 512 point, -51024 pOint transform. Digital filter firmware for the SPV100. From 5 to 89 taps. Correlation firmware for the SPV100. Auto-and cross-correlation. TMS32010 cross-assembler. Runs under VERSAdos. Monitor/debugger software for SPV100. Runs under VERSAdos. DSP applications software library for SPV100. Includes vector operations, correlation, trigonom~tric functions, interpolation and decimation, filtering, windowing and FFTs. Routines are called from FORTRAN running under VERSAdos. Second generation DSP board based on TMS32020. Two RS-232 ports, auxiliary input and output ports, DMA controller for faster I/O concurrent with processing. Program RAM, bipolar ROM and EPROM. Supplied with EPROM-based debug monitor. Add-on program RAM module for SPV120-16k X 16 bits. Add-on program RAM module for SPV120-80k X 16 bits. TMS32020 cross-assembler for SPVI20. Runs under VERSAdos. Monitor/debugger software for SPVI20. Runs under VERSAdos. DSP applications software library for SPV120. Includes vector operations. correlation, trigonometric functions, interpolation and decimation, filtering, windowing and FFTs. All routines are callable from FORTRAN running under VERSAdos. Analog input and DSP. Four channels of simultaneously sampled analog input (at 100kHz sampling rate) plus TMS32010 processor. Applications in digital filtering, signal averaging, etc. Add-on program RAM/ROM module for MPV960. Includes debug monitor and basic data acquisition routines. Anti-aliasing filter board. Four independent programmable filters, with user-configurable front ends. Ideal for use with MPV960. (1) This software is also available as source code. To order, add S suffix to product code; e.g., APS100VS. SOFTWARE DRIVERS FOR. VMEbus BOARDS Product Description PSOA PSOA-P P,SOB PSOB-P VDR100 VDR120 pSOS drivers for MPV901, MPV904, MPV905, MPV950, MPV952. Distributed In UNIX,format 5-114" floppy disks. As PSOA, but distributed in MS-DOS format disks. pSOS drivers for MPV960, SPV100. Distributed in UNIX format 5-114" floppy disks. As PSOB, but distributed in MS-DOS format disks. VERSAdos driver for SPV100. VERSAdos driver·for SPVI20. xx SURFACE MOUNT MICROCIRCUITS Burr-Brown is the first manufacturer to offer high performance microcircuits in a wide variety of surface mount packages. These packages permit denser layouts on one or both sides of a PC board, often saving 50% or more of the space normally required for these analog circuits. Many of these miniature devices also fit inside transducer cavities and may be used on modules or even hybrid circuits. Packages currently available are: • SOle-Plastic small-outline package, gull-wing leads on 1.27mm centers. Example: SOIC-8 has 8 leads. • Lee-Ceramic lead less chip carrier, terminals on 1.27mm centers. Example: LCC-20 has 20 terminals. SURFACE MOUNT DEVICES Device Type Analog Multipliers/Dividers Description Low Cost Precision Current Transmitters/Converters Two-Wire, 4-20mA Voltage-ta-Current Converters Model Package Dimensions (mm) Product Data Sheet MPY100L 4213L LCC-20 LCC-20 9.0 X 9.0 9.0 X 9.0 LCC Short Form LCC Short Form XTR101L XTR101U XTRll0L XTRll0U LCC-20 SOIC-16 LCC-20 SOIC-16 9.0 X 9.0 10.4 X 7.5 9.0 X9.0 10.4 X 7.5 LCC Short Form PDS-734 LCC Short Form PDS-731 Digital-ta-Analog Converters 16-Bit. Monolithic 16-Bit, Monolithic, Military 12-Bit. /JP-Compatible 12-Bit. Monolithic 12-Bit. MIL Temp 12-Bit. Military 12-Bit, CMOS 16-Bit. Digital Audio DAC700-703BL DAC703L DAC811U DAC850L DAC851L DAC870L DAC7541AU PCM55 LCC-28 LCC-28 LCC-28 LCC-28 LCC-28 LCC-28 SOIC-18 SOIC-24 11.4X 11.4 11.4 X 11.4 11.4 X 11.4 11.4 X 11.4 11.4 X 11.4 11.4 X 11.4 11.6X7.5 15.8 X9.0 Instrumentation Amplifiers t"recision, jyionoliihic li.JAi01L INA101U INA102L INA105L INA105U INAll0L INAll0U INA258L LCC-:iG SOIC-16 LCC-20 LCC-20 SOIC-8 LCC-20 SOIC-16 LCC-20 S,U/\ ;.0 Lee Si",v,", ::0...-.-, 10.4 X 7.5 9.0 X 9.0 9.0X9.0 4.9 X3.9 9.0X 9.0 10.4X 7.5 8.9 X 8.9 PDS-730 LCC Short Form LCC Short Form PDS-693 LCC Short Form PDS-733 PDS-501 Electrometer Grade High Speed, Quad Precision, Dual AD515L OPA27137L OPA27137U OPA111L OPA121L OPA121U OPA128L OPA404L OPA2111L LCC-20 LCC-20 SOIC-8 LCC-20 LCC-20 SOIC-8 LCC-20 LCC-20 LCC-20 9.0 X 9.0 9.0 X9.0 4.9 X3.9 9.0X9.0 9.0 X 9.0 4.9X 4.9. 9.0 X 9.0 9.0 X 9.0 9.0 X 9.0 LCC Short LCC Short PDS-691 LCC Short LCC Short PDS-692 LCC Short LCC Short LCC Short Precision Analog Multipliers Low Cost, Monolithic Wide Bandwidth MPY534L MPY634L LCC-20 LCC-20 9.0X 9.0 9.0X 9.0 LCC Short Form LCC Short Form Precision Voltage References Ultra-Stable Low Drift REF10L REF101L LCC-20 LCC-20 9.0 X 9.0 9.0 X 9.0 LCC Short Form LCC Short Form Voltage-to-Frequencyand Low Cost. Monolithic Frequency-to-Voltage Conv,erters Precision, Monolithic Synchronized Precision, Monolithic VFC32L VFC62L VFC100L VFC320L LCC-20 LCC-20 LCC-20 LCC-20 9.0X 9.0X 9.0 X 9.0 X LCC LCC LCC LCC Data Acquisition System 12-Bit, 16-Channel SDM862/863L LCC-68 24.3 X 24.3 Low Power Unity Gain, Differential Fast, FET Input Precision, Military Operational Amplifiers Electrometer Ultra-Low NOise Precision, Dire'® Low Cost, Dire' Oi/e'® Burr-Brown Corp. xxi 9.0 9.0 9.0 9.0 PDS-494 PDS-751 PDS-503 PDS-453 .PDS-453 PDS-511 PDS-639 PDS-619 Short Short Short Short PDS-686 Form Form Form Form Form Form Form Form Form Form Form HIGH PERFORMANCE CHIPS HIGH PERFORMANCE DICE BACKED BY BURR-BROWN'S TRADITION OF QUALITY Many of Burr-Brown's high-performance monolithic products are available in die form, including D/ A converters, precision operational and instrumentation amplifiers, current transmitters, voltage/frequency converters, and many more. those used in our All Burr-Brown dice products are the same high quality, high performance monolithic and hybrid devices and are proven in demanding applications throughout the world. The dice are manufactured and tested at our Tucson Microtechnology facility using the most advanced equipment and methods available, assuring total control of quality and reliability for every product. as The state-of-the-art performance achieved by these precIsIOn monolithic products reflects Burr-Brown's unmatched technical capabilities in low noise processing, high stability nichrome thinfilm resistors, active laser trimming, dielectric isolation, and patented circuit design. At Burr-Brown concern for quality is a fundamental part of wafer processing. Dice are 100% visually inspected according to MILSTD-883, Method 2010, Condition B. All wafers are 100% probe tested to specified electrical test limits. Our newest products are described below. See also our current Integrated Circuits Data Book for additional product information. HIGH PERFORMANCE CHIPS Product Data Sheet Model Die Size (mils) INA105AD INA110AD 83X63 139X 89 Precision Analog Multiplier MPV534AD 100X92 VO----~---{11 -Vee OPA404 S:implified Circuit (Each Amplifier) Oi/'e'@ Burr-Brown Corp .. BIFET® National Semiconductor Corp. Inlernalional Airporllnduslrial Park - P.O. Box 11400 - Tucson. Arizona B5734 - Tel. 1602) 746-1111 - Twx: 910-952-1111 'C.able: BBRCORP - Telex: 66·6491 PDS-677 A (Abbreviated) SPECIFICATIONS ELECTRICAL At Vee = ±15VDC and TA = +2S·C unless otherwise noted. OPA404AG, KP PARAMETER CONDITIONS MIN TYP OPA404BG MAX MIN TYP OPA404SG MAX MIN TYP MAX UNITS INPUT 'NOISE'1J Voltage: 10' = 10 10 10 ~ = = I. I. Current: I. 10 10Hz 100Hz 1kHz 10kHz 10Hz to 10kHz O.IHz to 10Hz O.IHz to 10Hz O.IHz to 20kHz 32 19 15 12 1.4 0.95 12 0.6 = = = = OFFSET VOLTAGE Input" Oflset Voltage KP Average Drift KP 'Supply Reiection KP VCM= OVDC ±lmV ±2.5mV 100Hz, RL = 2kQ ±260 ±750 ±3 ±5 100 100 10 10 125 BIAS CURRENT Input Bias Current KP VCM =OVDC ±1 ~1 ±8 ±12 OFFSET CURRENT Input Offset Current KP' VCM= OVDC 0.5 0.5 8 12 KP Channel Separation T,.,= TMIN to TMAX ±Vcc = 12V to 18V 80 76 IMPEDANCE Differential Common-Mode VOLTAGE RANGE Common-Mode Input Range Common-Mode R~jection KP 86 100 200 Open-Loop Voltage Gain ±10.5 88 84 +13,-11 100 100 92 RL;:o,2kQ 88 100 92 Gain = 100 20V p-p, RL = 2kQ Vo = ±10V, RL = 2kQ Gain = -I, RL = 2kQ CL = loopF, 10V slep 4 6.4 570 35 0.6 1.5 5 24 28 RATED OUTPUT Voltage Output Current Output Output Resislance Load Capacitance Stability Short Circuit Current RL = 2kn Vo=±10VDC 1MHz, open loop Gain=+1 ±11.5 ±5 ±10 I +13.2, -13.8 ±10 80 1000 ±18 ±20 POWER SUPPLY Rated Voitage Voltage Range, Derated Performance Current, Quiescent ±15 ±5 10=OmADC 9 ±18 10 TEMPERATURE RANGE Specification KP Operating KP Storage 8 Junction-Ambient KP · ·· · ·· ·· · ·· ·· ·· · · · · · · · · · V'N=±10VDC FREQUENCY RESPONSE Gain Bandwidth Full Power Response Slew Rate Settling Time: 0.1% 0.01% · · ·· 10"111 10" 113 OPEN-LOOP GAIN, DC Ambient temp. Ambient temp. Ambient temp. ~25 +85 +70 +125 +85 ;r150 0 -55 -25 -65 100 120 ·Specification same as PPA404AG. NOTES:. (1) Noise testing available-inquire. 2 ·· ·· ··· · · · · · · ±750 50 ±4 4 ·· ··· ··· · · · · · · · · · · .. · ·· ·· ·· · · · ·· · · ·· · · · · -55 nVlJHz nVlJHz nVlJHz nVlJHz pV,rms "V, p-p lA, p-p fAlJHz "V pV "V/·C "VI·C dB dB "VN "VN dB pA pA pA pA Q II pF Q II pF V dB dB · ·· ··· ·· ·· · · · · ·· +125 · · · · · dB MHz kHz VIpS pS pS V mA n pF mA VDC VDC mA ·C ·C .q ·C ·C ·CIW ·CIW ELECTRICAL (FULL T.EMPERATURE RANGE SPECIFICATIONS) At Vee = ±15VDC and TA;: T"'IH 10 TMAX unless otherwise noted. OPA404AG, KP PARAMETER CONDITIONS MIN Ambient temp. -25 TYP OPA404BG MAX TEMPERATURE RANGE Specification Range KP +85 +70 a MIN TYP , OPA404SG MAX MIN , -55 TYP MAX UNITS +125 'C 'C INPUT OFFSET VOLTAGE Input Offset Voltage KP Average Drift KP Supply Rejection BIAS CURRENT Input Bias Current OFFSET CURRENT Input Offset Current VOLTAGE RANGE Common-Mode Input Range Common-Mode Rejection KP VeM"·OVDC 75 VeM = OVDC , ±450 ±1 ±3 ±5 96 t6 2mV ±3.5 178 , 100 93 22 316 pVN ±32 ±200 , ±100 ±500 ±5nA pA 100 , 50 260 2.5nA pA VeM = OVDC 17 ±1.5rnV ±550 , 80 , ±2.5mV , , 70 IN mV pVl'C pv/oC dB ±10.2 82 80 +12.7.-10.6 99 99 86 , , ±10 80 1+12.6,-10.5 V," = ±10VDC 88 V dB dB R,''''2kCl 82 94 86 , BO 88 dB R,=2kCl Vo = ±10VDC Vo=OVDC ±11.5 ±5 ±5 +12.9.-13.8 ±9 ±12 ±11 ±30 +12.7. -t3.8 ±8 ±10 , V mA mA 9.3 10.5 9.4 11 rnA Ut't:N-LUUt' \iAIN, Uf.,; Open-Loop Voltage Gain RATED OUTPUT Voltage Output Current Output Short Circuit Current .,, .., , , ±8 POWER SUPPLY Current, Quiescent 10= OmADC , , 'Specification same as OPA404AG. ABSOLUTE MAXIMUM RATINGS ORDERING INFORMATION Supply •....••......•.•..••...•••..•••••••••••••••.•.••••..•. ±18VDC Internal Power Dissipation''' ••••••••••••••..••••••.•..•.••.... l000rnW Differentiallnput'Voltage'" .......... : ....................... ±36VDC Input Voltage Range'" .•.••••••••••••••....•.•••...••••...••• ±18VDC Storage Temperature Range ..••••...• P = -40/+85'C. G = -65/+150'C Operating Temperature Range .••••... P = -25/+85'C. G = -55/+125'C Lead Temperature (soldering, 10 seconds) .••....•••••••••••••• +300'C Output Short Circuit Duration'" .••••.•..•.••...•...••..••• Continuous Junction Temperature ........................................ +175'C OPA464 X X Basic model number------=r---' Performance grade - - - ' - - - - - - - - - - ' K = O°C to +70·C A, B = -2S·C to +8SoC = -SS·C to +12SoC S Packagecode---------------' G = 14-pin ceramic DIP P = 14-pin'plastic DIP T NOTES: (1) Packages must be derated based on BJc= 30°CIW orBJA = 120°CIW. (2) For supply voltages less than ±18VDC the absolute maximum input voltage Is equal to: 18V > V," > -Vee - 8V. See Figure 2. (3) Short circuit may be to power supply common only. Rating applies to +25'C ambient. Observe dissipation limit and TJ • NOTE: Refer to complete data sheet PDS-677 for complete typical curves and applications information. CONNECTION DIAGRAM Top View 3 MECHANICAL "P" Package "G" Package ~[~]~ LA~ (.25mm) R at MMC at seating plane. ~+J ~-4.jG~fa~~~nq .012 .008 .120 .240 .300 BASIC K Pin material and plating composition .070 .025 J L M N conform to Method 2003 (solderability) of MIL-STD-883 (except paragraph 3.2). .710 .170 .021 .045 .060 .100 BASIC G H I-L'::I·Y MAX .Q15 P MILLIMETERS MIN MAX 17.02 18.03 1.65 4.32 0.38 0.53 1.14 1.52 2.54 BASIC 1.78 0.64 0.20 0.30 6.10 3.05 INCHES MIN .670 .065 e .060 (25mm) R at MMC at seatln9 plane INCHES MIN MAX DIM B, B A A, B 8, -::4..J. .700 .685 .230 .200 MILLIMETERS MIN MAX 17.78 20.32 17.40 19.94 5.85 7.38 5.09 6.36 .800 .785 .290 .250 r- ~ 1-;'~2-t-';.~;O~0;-5-t--,;.~",~;--t--;;-~.,",~~;-r--;;-~.~~:;-I 1 .__ ~__-1 L JI1MAnn~ L~-IG~I-o i - i I N I JlM . J_ H;;-t-,;.·~;;;1~;;-:-'iBA",S",:I~~::nt--;,~~~;-BTA-"S,,;:C~::.-I t-';J'-+-.';;;00~8-t--';;.0~'5;-1--';;0:;;.20;;-r-0;;':.3;;;-18 r.~'-I~.0",73;;;00-;:0OBA;;;·~;;;~~H-1.";~~'<;63~B"A;;;~;;~~:-j Seating Plane Pin material and plating composition M 0° 15° 0° 15° conform to Method 2003 (solderability). N .010 .030 0.25 0.76 of MIL-STD-883 (except paragraph 3.2). r .P;-t-':.0"'2;-5-t--';.0;;50;;-t--;;-0.~64;-t-o".';;'27;-j 10' 1.52 0.23 - P 7.62 BASIC .100 .009 NOTE: Leads in true position within .010" At Pin numbers shown for reference only. Numbers may not be marked on package. DIM A C D F 14-pin plastic DIP ~ NOTE: Leads in true position within .010" TYPICAL PERFORMANCE CURVES ... 25° C. Vee:;:= ±15VDC unless otherwise noted T... INPUT CURRENT NOISE SPECTRAL DENSiTY 100 If'> ~ INPUT VOLTAGE NOISE SPECTRAL DENSITY If'> 10 :> .s ~ i 100 ~ 0 Z V 1: ~ " .!!! en '; 10 I 1 I 01 100 10 1M lOOk . V ~ 100 95 ..V V CMR V- ~ 100 8~ g:+ u! t-- If> ,...... 105 a: I g -........ ··50 Rs ~ OPA404 a + 25 -25 • 50 ·75 ·100 ...it. ReSistor ,1 : n~ls~ only 1ill lUi ' ~ I 10k 1M 100k Source ReSistance (0) lk 100 ·125 I..!' J.I;o' o > 10nA 10 illilill S 100 ~ '; 10 ~ .... 25 ·25 01 Offset Current 1, : 0.1 50 '" Iii f- ~ j '; () l ....... 1: ~ l 11' Bias Current i ~ '" 100M 10 I 1nA ~ Iii 10M BIAS AND OFFSET CURRENT vs INPUT COMMON MODE VOLTAGE BIAS AND OFFSET CURRENT vs TEMPERATURE 10nA ~ 1M Resistor Temperature iOC) () 100k io'" _on ~ 10 1 -75 1: 10k (Hz) ' z 90 \ 1k 1k :;; () 100 I TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY AT 1kHz vs SOURCE RESISTANCE PSR D- I Freque~cy 110 ..,c I 10 POWER SUPPLY REJECTION AND COMMON-MODE REJECTION vs TEMPERATURE 1ii E a: en , I I lk 10k Frequency (Hz) 1: ,.. ~ I i 0 > () I , 0 z , I i I , ·5D Ambient Temperature . 75 ·100 0.1 ·12; 00 1 I I ·15 -10 --5 +5 Common-Mode Voltage (V) (0 ,C) 4 0.01 BURR-BROWN® OPA445 IElElI ADVANCE INFORMATION Subject to Change High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES ~ tA!!!!~ !'!!'.M~!! S!!!,!,!..Y APPLICATIONS !!~~~~: ±1OI]!~ ±5!!1] III • HIGH SLEW RATE: 10VlpS • LOW INPUT BIAS CURRENT: 50pA max IJ STANDARD-PINOUT TO-99 PACKAGE • • • • mlT ~QIJ!PMF.tH HIGH VOLTAGE REGULATORS POWER AMPLIFIERS DATA ACQUISITION SIGNAL CONDITIONING DESCRIPTION The OPA445 is a monolithic operational amplifier capable of operation from power supplies up to ±50V and output currents of l5mA. It is useful in a wide variety of applications requiring high output voltage or large common-mode voltage swings. The OPA445's high slew rate provides wide powerbandwidth response, which is often required for high voltage applications. FET input circuitry allows the use of high impedance feedback networks, thus minimizing their output loading effects. Laser trimming of the input circuitry yields low input offset voltage and drift. The OPA445 is unity-gain stable and requires no external compensation components. It is available in both industrial (-25°C to +85°C) and military (-55°C to +125°C) temperature ranges. Inlernational Alrporllnduslrial Park· P.O. Box 11400 . Tucson. Arizona B5734 • Tel. (6021 746·1111 . Twx: 910·952·1111 . Cable: BBRCORP • Telex: 66·6491 PDS·754 5 SPECIFICATIONS ELECTRICAL PARAMETER OFFSET VOLTAGE Input Ollset Voltage Average Drift Supply Rejection VOM=OV = TMIN to TMAX Vs = ±10V to ±50V 0.5 1.0 TA BIAS CURRENT Input Bia. Current Over Temperature VOM =OV OFFSET CURRENT Input Ollset Current Over Temperature VOM =OV 80 1.0 10 110 20 100 4 50 10 5 IMPEDANCE 10"111 10" 113 Differential CommonwMode VOLTAGE RANGE V,. =±30V, Over temp. . ±35 BO . Vo =±35V, RL=5kQ Vo= ±200mV Av=+l ZL = 5kQ II 50pF 5 95 10 80 30 RL=5kQ Vo= ±2BV DC, open loop ±35 ±15 Over temp. lo=OmA ±10 220 ±26 ±40 3.B 'Specification .ame as OPA445BM. ABSOLUTE MAXIMUM RATINGS ORDERING INFORMATION T OPA445 ( ) Basic model number "'-_ _ _ _ _ _ _ _..:==r-= Power Supply, , .. , , ... , , ....•....... , . . . . . . • . . . . . • . . . . • . . .. ±55V Internal Power Dissipation ................................ 680mW Differential Input Voltage.. .. .. .. . . .. . .. .. .. . . .. . .. . .. .. .. .. ±BOV Input Voltage Range ••.•..••.•.. , ..•.••..••...•••.•.•• I±Vsl - 3V Storage Temperature Range: M ....•...••...•.... -65'C to +150'C P ................... -40'C to +B5'C Operating Temperature Range: M ...•••...•....•. -55'C to +125'C P ................. -40'C to +B5'C Lead Temperature (soldering, 10 seconds) .•......••.....•. +300'C Output Short-Circuit to Ground (TA = +25·C) .......... Continuous Junction Temperature. .. .. . .. . .. . . .. .. . .. • .. .. . . .. . .. . ... +175'C ( ) Performance grade (blank indicates A grade) - - - - - - ' A: -25'C to +B5'C B: -25'C to +B5'C S: -55'C to +125'C Package code _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _... ~ M: B-pin TO-99 P: B-pin plastic DIP. 6 CONNECTION DIAGRAM Top View MECHANICAL TO-99 Package TO-99 NC f:3 NOTE: Leads in true position within .010" (.25mm) Rat MMC at seating plane. 2Jr1 G- -;J DIM A B C D E F G H J K L M N IIIII~ Seating Plane ---Il.-D -Vs Ni L Case is connected to -Vs , ~ .~ T M N G' ' + • "8 ',,5, (~J INCHES MIN MAX .335 .370 .305 .335 ,165 .185 .021 .016 .010 .040 .040 .010 .200 BASIC .028 .034 .045 .029 .500 .110 .160 45° BASIC .095 .105 MILLIMETERS MIN MAX 8.51 9.40 8.51 7.75 4.19 4.70 0.53 0.41 0.25 1.02 0.25 1.02 5.08 BASIC 0.71 0.86 0.74 1.14 12.7 2.79 4.06 45° BASIC 2.41 2.67 TYPICAL PERFORMANCE CURVES ' T. : +25°C, Vs: ±15VDC unless otherwise noted. GAIN BANDWIDTH AND SLEW RATE VS TEMPERATURE GAIN BANDWIDTH AND SLEW RATE VS SUPPLY VOLTAGE 2.6 14 2.4 ........ N I ~ 2.2 r-..... '6 'i 2.0 . "0 c: GBW 1.8 c: 'OJ Cl ~ -- " .<: CD .... 1.6 1.4 -75 -50 -25 o '" -- --- SR t--.. " +50 --.. "1\ ~ .......... +75 +100 1.6 10 +125 20 30 1 - S/R--- 5 +25 _ _ GBW 40 50 Supply Voltage (±Vee) Ambient Temperature (OC) INPUT 'BIAS CURRENT VS TEMPERATURE POWER SUPPLY REJECTION VS FREQUENCY 120 110 10nA iil 100 :!:!. 90 c: .2 80 .......... ~ 100pA .;;; g 70 0 a: 60 ...... "-..... +VCC ""- ..... i'- 50 Vee lnA E " r: jjj ·ago 10pA lpA (f) .1pA .01pA -60 -45 -30 -15 10 Temperature ""..... "- ...... "....... 30 20 10 o 0 +15 +30 +45 +60 +75 +90 +105+120 -""'- ...... 40 1'0.. 100 lk 10k lOOk Frequency (Hz) 7 1M ......... ..... 10M ,100M OPEN-LOOP FREQUENCY RESPONSE OPEN-LOOP GAIN AND SUPPLY CURRENT VS SUPPLY VOLTAGE 120 140 ;30 120 110 100 ~ 90 80 70 60 50 40 f30 20 10 iil ~ <= '0; el " g '" l!! o 10 45 j I!! ~ 90 e :l"1li 100 1k 10k - ;( 3.5 <= '0; 1:rs~ .... Gain - e-"'" el = l!!'"" . ~ :c 100 (f) -. ~ iil 110 ~ 4.0 ~ " U '" '"" 0 > '" Q. 90 . 10 '180 10M 1M 20 30 2.5 50 40 Supply Voltage (±Vcc) Frequency (Hz) SUPPLY CURRENT VS TEMPERATURE OPEN-LOOP GAIN VS TEMPERATURE 120 ;( §. E 4 • i-oo- r-- r--. ~ " U '" C. g. a;: r-.. ~ 3 ~ <= r-...... ~ el " '" ~ 100 0 > (f) -75 110 '0; r-.. -50 -25 o 90 +25 +50 +75 +100 -75 +125 -50 -25 o i'- to...... +25 +50 "'" +75 Ambient Temperature ('C) Ambient Temperature (OC) " +100 +125' MAXIMUM OUTPUT VOLTAGE SWING VS FREQUENCY INPUT VOLTAGE NOISE SPECTRAL DENSITY 100 90 80 ~:> c: r- ~ 6. ;::. .s "'" l!! 5: 10 '0 z g "'" l!! :; > 0 60 40 ~ ll- 0 " 1 10 100 1k 10k -" 20 o 100k 1k Frequency (Hz) 10k Frequency (Hz) 8 E ~ 3.0 C. .<= 100k §. 100k ~ 1M OPA541 BURR-BROWN® IElElI ADVANCE INFORMATION Subject 10 Change High Power Monolithic OPERATIONAL AMPLIFIER FEATURES APPLICATIONS POWER SUPPLIES TO ±40V o OUTPUT CURRENT TO lOA PEAK II \\I o riWGiii\iviiviAiii.t [;uiiiitNT i.iiviiT o INDUSTRY-STANDARD PINOUT f.) MOTOR ORIVER o SERVO AMPLIFIER ~ " " ... nll"n ,."nITATln ... i) 11'",nnU I:A'" uu Iun o AUDIO AMPLIFIER FET INPUT 1/1 PROGRAMMABLE POWER SUPPLY DESCRIPTION The OPAS41 is a monolithic power amplifier capable of operation from power supplies up to ±40V and continuous output currents up to SA. Internal current limit circuitry can be user-programmed with a single external resistor, protecting the amplifier and load from fault conditions. The OPAS41 is fabricated using a proprietary bipolar / FET process. Pinout is compatible with popular hybrid power amplifiers such as the OPASll, OPASl2 arid the 3S73. The OPAS41 uses a single current-limit resisto~ to set both the positive and negative current limits. Applications currently using hybrid power amplifiers requiring two current-limit resistors need not be modified. The OPAS41 is available in an industry-standard 8pin TO-3 hermetic package. The case is isolated from all circuitry, thus allowing it to be mounted directly to a heat sink without special insulators which degrade thermal performance. +Ys -In t---<>---,.-o VOUT, • Rcc (ext.) -Ys International Airport Industrial Park· P.O. Box 11400 • Tucson. Arizona B5734 • Tei. (6021 746·1111 • Twx: 910·952·1111 • Cable: BBRCORP • Telex: 66·6491 PDS-737 9 SPECIFICATIONS ELECTRICAL At Tc = +2S·C and Vs = ±3SVDC uniess otherwise. noted. PARAMETER I L CONDITIONS OPA541AM I TYP MAXJ ±2 ±20 ±2.5 ±20 ±10 ±40 ±10 ±60 4 ±10 50 ±1 ±30 5 MIN OPA541BM/SM MIN TYP MAX ±0.1 ±15 ±1 ±30 UNITS INPUT OFFSET VOLTAGE Vos vs Temperature vs Supply Voltage Specified temperature range Vs = ±10V to ±VMA' vs Power INPUT BIAS CURRENT I. ; vs Supply Voltage INPUT OFFSET CURRENT los Specified temperature range INPUT CHARACTERISTICS Common-Mode Voltage Range CommonwMode Rejection Input Capacitance Input Impedance, DC Specified temperature range VCM = (1,±Vsl-6V) ±(IVsl-6) 95 ±(lVsl-3) 113 5 1 RL =6rl 90 97 1.6 ±(IVsl-5.5) ±(IVsl-4) ±(I Vsl-4) 9 ±(IVsl-4.5) ±(IVsl-3.6) ±(IVsl-3.2) 10 S 45 10 55 2 ·· GAIN CHARACTERISTICS Open Loop Gain at 10Hz Gain-Bandwidth Product · ·· ·· ·· OUTPUT Voltage Swing 10 = SA, Continuous 10=2A 10= 0.5A Current, Peak AC PERFORMANCE Slew Rate Power Bandwidth Settling Time to 0,1% Capacitive Load Phase Margin RL = Srl, Vo = 20Vrms 2V Step Specifieq temperature range. G =1 3,3 Specified temperature range, G > 10 Specified temperature range, RL = 80: SOA 40 POWER SUPPLY Power Supply Voltage, ±Vs Specified temperature range ±10 Current, Quiescent ±30 20 ±35 25 1,25 1.4 30 1.5 1.9 · THERMAL RESISTANCE BJc, (junction to case) BJC BJA, (junction to ambient) AC output f > 60Hz DC output No heat sink TEMPERATURE RANGE TeASE -25 AM,8M SM +S5 · -55 'Specification same as OPA541AM 10 ·· ·· · ··· · ·· ·· ·· ·· · · ·· ·· ·· pA pAN pA nA V dB' pF Trl dB MHz V V V A VIps ·· · · ·· ·· · ±35 mV pVl·C pVN pVIW ±40 · +125 kHz IlS nF Degrees V mA ·C/W ·CIW ·CIW ·C ·C MECHANICAL Seating Plane UTt~ E ~ DIM A B C D E F G H J K NOTE: Leads in true position within 0.010" (0.2Smm) A at MMC at seating plane. o----L- Pin numbers shown for reference only. Numbers may not be marked on package. Q Supply Voltage, +Vs to -Vs ......................... 90V Output Current ................................ see SOA Power Dissipation, Internal'" .................... .i25W Input Voltage: Differential .......................... ±Vs Common-mode ..................... ±Vs Temperature: Pin solder, 10s ................... +300·C Junction lll ........................ +1S0·C Temperature Range: Storage ............................. -6SoC to +1S0·C Operating (case) .................. -SS·C to +12S·C .161 .980 1,020 NC +In ~CL -In NC ORDERING INFORMATION ----r-- .151 R 40° BASIC 12.7 BASIC 30,12 BASIC 15.06 BASIC 10.16 12.70 3.84 4.09 24.89 25.91 /' Top View NOTE: (1) Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power,dissipation to achieve high MTTF. OPA541 a MILLIMETERS MIN MAX 38.35 39.37 19.56 18.92 6.10 7.37 0.97 1.07 2.03 2.67 CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS Basic Model Number INCHES MIN MAX 1.510 1.550 .745 .770 .240 .290 .038 .042 .080 .105 40° BASIC .500 BASIC 1.1S6BASIC .593 BASIC .400 .500 T () M Performance Grade Code A: -25°C to +85°C B: .-25°C to +85°C S: -55°C to +125°C Package Code - - - - - - - - - - - ' M = TO-3 11 TYPICAL PERFORMANCE CURVES TA = +25°C. Vs = ±35VDC unless otherwise noted. INPUT BIAS CURRENT VS TEMPERATURE OPEN-LOOP GAIN AND PHASE VS FREQUENCY 100 .110 « .s -' 10 -' -' ~ 0 . .., 0.1 :; 70 60 (!) 50 40 " C> J!! 0 -' -' 0.Q1 iil <= ·iii :!1. -' 0 E I""- 90 80 <= iIi 1111 100 ~ > -25 ~ I"iIIIIJ Z, = ~ +75 +50 +100 1 +125 1.2 5 1.1 .10 100 1k 10k 100k 1M ~ I 10M ;: ±i. ~ ~~I-IVol 3 6 10 +V. +.I-V.I (V) lou, (A) VOLTAGE NOISE DENSITY VS FREQUENCY TOTAL HARMONIC DISTORTION VS FREQUENCY 1k ,." ~ ~ I"""'" I E 0 z (+V;;':~ ~ ,, .--,..,,-. ,.~ ~ 1.0 0; 10 , '/ I... 1.0 ~ ~ Z' .~ " Z,=2kD OUTPUT VOLTAGE SWING VS OUTPUT CURRENT .2 0 III IJI Frequency (Hz) 6 ~ -135 -180 ~~1=3.~~ 0 -10 +25 -90 3.3~:~~ I""- 30 20 1.3 ~ Z, = 2kD IIIIL. Gain NORMALIZED QUIESCENT CURRENT VS TOTAL POWER SUPPLY VOLTAGE .~ 45 .1 Temperature (0C) "0 o 1111 Phase 'iIII 10 -' -' 0.001 1111 100 z -Po 5W 0 ioo" r z f- " Po 50W ~ 0.01 C> ~ ". III 0.1 + ~ ·0 ,,- Po-100mW ~ ·0 J!! 0 > 10 0.001 1 10 100 1k 10k 100k 10 100 1k Frequency (Hz) Frequency 12 10k 100k CURRENT LIMIT VS RESISTANCE LIMIT COMMON-MODE REJECTION VS FREQUENCV 110 ~ a: a: ::;: ...... r"-o~ 100 iii , 10 120 ~ 90 SO +IOUT "'~ () 70 lOUT ~~ 1,0 ::fti 1\ I" 60 t\ 50 10 100 1k 10k 100k 0,1 0,1 0,01 1M 1,0 ~ 10 Frequency (Hz) CURRENT LIMIT VS RESISTANCE LIMIT VS TEMPERATURE nVNAMIC RESPONSE 10 f - - fo- ,1,1', ~ l, r-- t~ Tc 0,1 0,01 lOUT -.; ~~, T10UT +S5°C : ~ --25~C 0,1 1111 10 G ~ 1, C, ~ 4,7nF Rce (0) emitter turn-on voltage. The value of the current limit resistor is approximately: INSTALLATION INSTRUCTIONS RCL 0.809 = -II - I - 0.OS7 LIM POWER SUPPLIES The current limit value decreases with increasing temperature due to the temperature coefficient of a baseemitter junction voltage. Similarly, the current limit value increases at low temperatures. Current limit versus resistor value and temperature effects are shown in the Typical Performance Curves. The OPAS4l is specified for operation from power supplies up to ±40V. It can also be operated from unbalanced or single power supply as long as the total power supply voltage does not exceed 80V. The power supplies should be bypassed with low series impedance capacitors such as ceramic or tantalum. These should be located as near as practical to the amplifier's power supply pins. Good power amplifier circuit layout is, in general, like good high frequency layout. Consider the path of large power supply and output currents. Avoid routing these connections near low-level input circuitry to avoid waveform distortion and oscillations. The adjustable current limit can be set to provide protection from short circuits. The safe short-circuit current depends on power supply voltage. See the discussion on, Safe Operating Area to determine the proper current limit value, Since the full load current flows through Rd. it must be selected for sufficient power dissipation. For a SA current limit, the dissipation of RCL will be 3.2SW for SA continuous currents. Sinusoidal output will create dissipation according to the rms load current. Thus for the same SA current limit, AC peaks would be limited to SA, but the rms current would be 3.SA and a resistor with a lower power rating could be used. Some applications CURRENT LIMIT Internal current limit circuitry is controlled by a single external resistor, RCL. Output load current Hows through this external resistor. The current limit is activated when the voltage across this resistor is approximately a base- 13 (such as voice amplification) are assured of signals with much lower duty cycles, allowing a current resistor with a lower power rating. Wire-wound resistors may be used for RcL • Some wire-wound resistors, however, have excessive inductance and may cause loop-stability problems. Be sure to evaluate circuit performance with resistor' type planned for production to assure proper circuit operation. ' '"" HEAT SINKING Power amplifiers are rated by case temperature, not ambient temperature. as with signal op amps. The maximum allowable power dissipation is a function of the case temperature as shown on the power derating curve. All points on the power derating slope .produce a maximum internal junction temperature of +150°C. Sufficient heat sinking must be provided to keep the case temperature within safe bounds for the maximum ambient temperature and power dissipation. The thermal resistance of the heat sink required may be calculated by: OHS = TCASE - elimination significantly improves thermal performance. See Burr-Brown Application Note AN-83 for further details on heat sinking. SAFE OPERATING AREA The safe operating area (SOA) plot provides comprehensive information on the power handling abilities of the OPA541. It shows the allowable output current as a , function of the voltage across the conducting output transistor (see Figure I). This voltage is equal to the power supply voltage minus the output voltage. For example, as the amplifier output swings near the positive power supply voltage, the voltage across the output transistor decreases and the device can safely provide large output currents demanded by the load. Short circuit protection requires evaluation of SOA. When the amplifier output is shorted to ground, the full power supply voltage is impressed across the conducting output transistor.' The current limit must be set to a value which is safe for the power supply voltage used. For instance, with Vs ±3~V, a short to gro\lnd would force 35V across the conducting power transistor. A current limit of 1.8A would be safe. TAMBIENT P,,(max) Commercially available heat sinks often specify their thermal resistance. These ratings are often suspect, however, since they depend greatly on the mounting environment and air flow conditions. Actual thermal performance should be verified by measurement of case temperature under the required load and environmental conditions. Reactive, or EMF-generating, loads such as DC motors can present difficult SOA requirements. With a purely reactive load, output voltage and load current are 90° out of phase. Thus, peak output current occurs when the output voltage is zero and the voltage across the conducting transistor is equal to the full ,power supply voltage. See Burr-Brown Application Note AN-123 for further information on evaluating SOA. No insulating hardware is required when using the TO-3 package. Since mica and other similar insulators typically add approximately 0.7°CjW thermal resistance, their SAFE OPERATING AREA 10 .......... _ I"'l1o. { I"!I 'C~ "<>s.C' ~ ""c9s' ~ b~ .,,,l,;l~ {iii!.. "'" "-, ~ ~ 1\ 1.0 \ o.1 10 IV. - VoUTI (V) FIGURE I. Safe Operating Area. 14 100 BURR-BROWN® OPA600 T' ......··~n IElElI l'~~-":; . J I i 11/1 j Fast-Settling Wideband OPERATIONAL AMPLIFIER FEATURES APPLICATIONS • GAIN BANDWIDTH PRODUCT: 5GHz • FAST SETTLING: SOns to ±D.J% IDDns 10 ±D.01% • -25°C 10 +S5°C AND -55°C 10 +125°C TEMPERATURE RANGES • ±10V OUTPUT: 200mA • • • • • • DESCRIPTION the user to optimize the settling time for various gains and load conditions. The OPA600 is useful in a broad range of video, high speed test circuits and ECM applications. It is particularly well suited to operate as a voltage controlled oscillator (VCO) driver. It makes an excellent digital-to-analog converter output amplifier. It is a workhorse in test equipment where fast pulses, large signals, and 50n drive are important. It is a good choice for sample/ holds, integrators, fast waveform generators, and multiplexers. The OPA600 is specified over the industrial temperature range (OPA600BM, CM) and military temperature range (OPA600SM, TM). The OPA600 is housed in a welded, hermetic metal package. The OPA600 is a wide band operational amplifier specifically designed for fast settling to ±O.OI% accuracy. It is stable, easy to use; has good phase margin with minimum overshoot, and it has excellent DC performance. It utilizes an FET input stage to give low input bias current. Its DC stability over temperature is outstanding. The slew rate exceeds 400V/ J.ls. All of this combines to form an outstanding amplifier for large and small signals. High accuracy with fast settling time is achieved by using a high open-loop gain which provides the accuracy at high frequencies. The thermally balanced design maintains this accuracy without droop or thermal tail. External frequency compensation allows Offset Offset Frequency Compensation FAST VCO HIGH·SPEED D/A CONVERTER OUTPUT AMPLIFIER VIDEO AMPLIFIER HIGH·SPEED ADC DRIVER lOW·DlSTORTION AMPLIFIER TRANSMISSION LINE BUFFER . Frequency qompensation +Vcc Frequency Common Compensation leaSe)p 14 11 500 3r-----------~----------~ -Input International Airport Industrial Park· P.O. Box 11400· Tucson. Arizona 85734 • Tel. (6021746·1111 • Twx: 911).952·1111 • Cable: BBRCORP • Telax: 66·6491 PDS-672 15 SPECIFICATIONS ELECTRICAL ~t Vee;;:: ±15VDC and TA;;:: +25°C·unless otherwise specified. OPA600CM, TM'" PARAMETER CONDITIONS MIN TYP MAX OUTPUT Voltage RL; 2kO RL = 500 121 Current Current Pulse Resistance Short-Circuit Current RL ;;:: 500 121 RL:::;50n C31 ±10 ±9 ±180 ±180 Open loop DC To COMMON only, tMAX;;:: 1st• 1 ±200 ±200 75 250 300 100 80 70 125 105 95 DYNAMIC RESPONSE Settling Time"': to ±0.01% (±1mV) to ±0.1% (±10mV) to ±1%(±100mV) .0. VOUT = 10V AVouT ;10V AVouT = 10V Gain-Bandwidth Product (open-loop) Ce - OpF. G ; Ce = OpF. G ; Ce = OpF. G ; Co; OpF. G ; Ce; OpF. G = Bandwidth (-3dB small signal)'61 G=+1VN G=-1VN G=-10VN G ;-100VN G = -1000VN Full Power Bandwidth VOUT; ±5V. G; -1VN. Ce; 3.3pF. RL; 1000 Slew Rate VOUT = ±5V. G ; -1000VN. Ce ; OpF; RL = 1000 VOUT ; ±5V. G = -1VN'4I Phase Margin 1VN 10VN 100VN 1000VN 10.000VlV 150 500 1.5 5 10 125 90 95 20 6 16 400 G; -1VN. Ce = 3.3pF 500 440 40 GAIN Open-Loop Voltage Gain I ; DC. RL = 2kO. T. ; +25'C 86 T.; +25'C T. = -25'C to +85'C T. ; -55'C to +125'C ±1 Offset Voltage Drift T. = -25'C to +85'C T. ; -55'C to +125'C Bias Current T.= +25'C T. ; -25'C to +125'C , -20 Offset Current T.= +25'C T. = -55'C to +125'C 20 20 Power Supply Rejection Ratio Common-Made Voltage Range Common-Mode Rejection Ratio Impedance Voltage Noise Voc = ±15V. ±1V ±4 ±5 ±6 ±20 ±20 -20 200 -10 60 VeM = -5V to +5V Differential and Common-Mode 10kHz Bandwidth -100 -100 500 +7 80 10"112 20 POWER SUPPLY - Rated (Voc) Operating Range Quiescent Current ±15 ±9 ±30 ±16 ±38 TEMPERATURE RANGE (Ambient)'" Operating: BM. CM SM.TM -25 -55 -65 Storage 8,e. (junction to case) 8CA • (case to ambient +85 +125 +150 30 35 TYP ·· • ·· · ·· · ·· ··· ·· ···· ·· · ··· MAX ±2 ·· ··· ·· · ·· · ·· ··· ·· UNITS V V mA mA · ·· · 0 mA ns ns ns MHz MHz GHz GHz GHz MHz MHz MHz MHz MHz MHz VI,.,s VI,.,s Degrees · · 94 INPUT Offset Voltage'" · OPA600BM, SM MIN dB ±5 ±10 ±15 mV mV mV ±80 ±100 ,.,VI'C ,.,VI'C ·· ·· ·· ·· · pA nA pA nA ,.,VN V dB OllpF nV/VHz VDC VDC mA 'C 'C 'C 'CIW 'CIW -Specilication same as OPA600CM. TM. NOTES: (1) BM. CM grades: -25'C to +85'C. SM. TM grades: -55'C to +125'C. (2) Pin 9 connected to +Vci:. pin 7 connecte'd to -Vee. Observe power disSipation ratings. (3) Pin 9 and pin 7 open. Single pulse t = 100ns. Observe power dissipation ratings. (4) Pin 9 and pin 7 open. See section on Current Boost. (5) G = -1VN. Optimum settling time and slew rate achieved byiridividually compensating each device. Reterta saction on Compensation. (6) Frequency compensation as discussed in section on Compensation. (7) Adjustable to zero. (8) Heat Sink (optional): IERC LBOCI-72CB with 2 each DCV-1B Clamps. 16 CONNECTION DIAGRAM MECHANICAL r-Ai TO DHf t f-~ 0 • Offset Null (optional) JO':'ooo 8 I -Input '6 o ('I o· J 0 I) 0 3 9 0 DenotesPin 1 Y-r +K H 1~~Hul . -L-l j u U U D D D -G- [ "l ID I--L--l Output Sealing Plane -lo DIM A· !U 8 8 C 0 G H K L R INCHES MIN MAX .963 .980 .760 .805 .175 .190 .014 .022 .100 BASIC .135 .155 .230 .270 .600 BASIC ,115 .095 MILLIMETERS MIN . MAX 24.89 19.30 20.45 4.45 4.83 0.56 0.36 2.54 BASIC 3.43 3.94 5.94 6.86 15.24 BASIC 2.41 2.92 +Input 24.46 NOTES: (1) Refer to Figure 4 for recommended frequency compensation . (2) Connect pin 9 to pin 12 and connect pin 710 pin 6 for maximum output current. See Application Information for further information. (3) Bypass each power supply lead as close as possible to the amplifier pins. A lpF C813 tantalum capacitor is recommended. (4) There is no internal connection. An external connection may be made. (5) It is recommended that the amplifier be mounted with the case in contact with a ground plane for good thermal transfer and optimum AC performance. ~~OT~:::;: 1. Leads in true position within 0.010" (0.25mm) R at MMC at seating plane. 2. Pin numbers shown for reference only. ORDERING INFORMATION OPA600 B T Performance Grade _ _ _ _ _ _ _ _ _ _,..-_...J B. C = -25·C 10 +85·C S. T = -55·C 10 +125°C Package _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _...l 1 ABSOLUTE MAXIMUM RATINGS"I Q Supply Voltage. +Vccto -vee ................................ ±17V Power Dissipation, At TCASE +125 oC(21 ••••••••••••••••••••••• -1.6W Input Voltage: Differential ••....••....•••..•..••.••......•••. ±Vee Common-Mode .••••.......•......... : ........ ±Vee Output Short Circuit Duration to Common. . . . . • • • • . • • • . . . .. <5sec Temperature: Pin (soldering. 20sec) ...•....•..........•... +3OO·C Junction l1l, TJ ••••••••••••••••••••••••••••••• +175°C Temperature Range: Storage .................... -65·C to +150·C Operating (case). . • . . . . . • • .. -55·C 10 +125·C M=Metal DIP Hi'Reliabilily Q-Screening _ _ _ _ _ _ _ _ _ _ _ _--l (oplional) NOTES: (1) Stresses above those listed under "Absolute Max.mum Ratings" may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. (2) Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTTF. TYPICAL PERFORMANCE CURVES ITypical at TA = +25°C and ±Vcc = 15VDC, unless otherwise specified). BODE PLOT COMPENSATION AND SLEW RATE VS GAIN 700 10 600 g 1\ 1\ , 10-'10- SLEW RATE 500~ * )( 400 a: ~ '" i'", 300 COMPENSATION ~ 10 Closed-loop Gain IVNI = 1 + RF/RIN Frequency 1Hz I, 17 200 100 SETTLING TIME VS OUTPUT VOLTAGE CHANGE SETTLING TIME VS GAIN 300r---.;;.;;.;..;-F-..;......;,. __ .;,.;. ____... 200·r---~T-~~~~~~~~ :J.V=20V 1. 2 S(;TTLING TIME ANn SLEW RATE VS TEMPERATURE G=1VN 25o1t----+----+--::II~_I _1~1~--4---~--~--~ 1. 1 ~ 2001----+---2IfE::....-~1:....I ~ = .,c ~ 150t----+~IO-_:Jr#f"-,~O::; ~ ts,IO.OIJ, ~ 0 '" '" ~ l°OE=;;;;.~"r~.",-"'--t----;~ ~ ..... £ c 0 .. 1 - - -... 10.....--~·1~00~--..1.... 000 Closed-loop Gain VN, = 1 + RF/RIN 30 OUTPUT VOLTAGE VS OUTPUT CURRENT 501~--~~~+---+--~ o. 9 0 ....--~5!---:o!10~-...,1i\.5--~20 Output Voltage Change ,V, 875 -50 -25 0._ 1.2 OPEN·LOOP GAIN AND QUIESCENT CURRENT VS TEMPERATURE - ts~ ~ I""'IIiiiS~ """" o +25 +50 +75 +100+125 Temperature 1°C, GAIN-BANDWIDTH 1.4 G=·10VN 25 f ~ 15 Co "5 010 5 o 1.2 1. 1 > Cii 20 10 10 - Vee Vee 50 -- 15 ±12 100 15~ 200 250 Output Current rnA 0.9 300 0·~75 .. ' -50 ~ ~ 11 ~ .~1.0 AoL~ f-- j ~ -25 0 +25 +~ +75 +100 +125 Temperature 1°C, INSTALLATION AND OPERATION WIRING PRECAUTIONS The OPAliOO is a wideband, high frequency operational amplifier with a gain-bandwidth product exceeding 5GHz. This capability can be realized by observing a few wiring precautions and using high frequency layout techniques. In general, all printed circuit board conductors should be wide to provide low resistance, low impedance signal paths and should be as short as ·possible. The entire physical circuit should be as small as is practical. Stray capacitances should be minimized, especially at high impedance nodes, such as the input terminals of the amplifier and compensation pins. Stray signal coupling from the output to the input should be minimized. All circuit element leads should be as short as possible and low values of resistance should be used. This will give the best circuit performance as it will minimize the time constants formed with the circuit capacitances and will eliminate stray, unwanted tuned circuits. Grounding is the most important application consideration for the OPA600, as it is with all high frequency circuits. Ultra-high frequency transistors are used in the design of the OPA600 and oscillations at frequencies of 500MHz and above can be stimulated if good grounding ...... ~ """"" 0.8 0·~75 -50 -25 '" ~ I' 0 +25 +~ +75 +100 +125 Temperature ,OCt ' techniques are not used. A ground plane is highly recommended. It should connect all areas of the pattern side of the printed circuit that are not otherwise used. The ground plane provides a low resistance, low inductance common return path for all signal and power returns. The ground plane also reduces stray signal pickup. Point-to-point wiring is not recommended. However, if point-to-point wiring is used, a single-point ground should be used. The input signal return, the load signal return and the power supply common should all be connected at the same physical point. This eliminates common current paths or ground loops which can cause unwanted feedback. Each power supply lead should be bypassed to ground as near as possible to the amplifier pins. A II'F CSI3 timtalum capacitor is recommended. A parallel O.OII'F ceramic may be added if desired. This is especially important when driving high current loads. Properly bypassed and modulation-free power supply lines allow full amplifier output and optimum settling time performance. OPA600 circuit common "is connected to pins I and 13; these pins should be connected to the ground plane. The input signal return, load return, and power supply commmon should also be connected to the ground plane. 18 The primary compensation capacitors are C, and C2(see Figure I). They are connected between pins 4 and Sand between pins II and 14. Both C, and C2 should be the same value. As Figure I and the performance curves show, larger closed-loop configurations require less capacitance and improved gain-bandwidth product can be· realized. Note that no compensation capacitor is required for closed-loop gains equal to or above 100V/V. If upon initial application the user's circuit is unstable, and remains so after checking for proper bypassing, grounding, etc., it may be necessary to increase the compensation slightly to eliminate oscillations. Do not over compensate. It should not be necesary to increase C, and C2 beyond 10pF to ISpF. It may also be necessary to individually optimize C, and C2 for improved performance. The case of the OPA600 is internally connected to circuit common, and as indicated above, pins I and 13 should be connected to the ground plane. Ideally, the case should be mechanically connected to the ground plane for good thermal transfer, but because this is difficult in practice, the OPA600 should be fully inserted into the printed circuit board with the case very close to the ground plane to make the best possible thermal connection. If the case and ground plane are physically connected or are in close thermal proximity, the ground plane will provide heat sinking which will reduce the case temperature rise. The minimum OPA600 pin length will minimize lead inductance, thereby maximizing performam;e. COMPENSATION The OPA600 uses external frequency compensation so that the user may optimize the bandwidth or settling time for his particular application. Several performance curves aid in the selection of the correct compensations capacitance value. The Bode plot shows amplitude and phase versus frequency for several values of compensation. A related curve shows the recommended compensation capacitance versus closed-loop gain. The flat high frequency response of the OPA600 is preserved and high frequency peaking is minimized by connecting a small capacitor in parallel with the feedback resistor (see Figure I). This capacitor compensates for the closed-loop, high frequency, transfer function zero that results from the time constant formed by the input capaci!arfce of the amplifier, typi~aHy 2pF. !\nd thp. inpHt and feedback resistors. The selected compensation capacitor may be a trimmer, a fixed capacitor or a planned PC board capacitance. The capacitance value is strongly dependent on circuit layout and closed-loop gain. It will typically be 2pF for a clean layout using low resistances (Ikn) and up to IOpF for circuits using larger resitances. Using small resistor values will preserve the phase margin and avoid peaking by keeping the break frequency of this zero sufficiently high. When high closed-loop gains are required, a three-resistor attenuator is recommended to avoid using a large value resistor with its long time constant. Figure I shows a recommended circuit schematic. Component values and comp~nsation for amplifiers with several different closed-loop gains are shown. This circuit will yield the specified settling time. Because each device is unique and slightly different, as is each user's circuit, optimum settling time will be achieved by individually compensating each device in its own circuit, if desired. A 10% to 20% improvement in settling time has been experienced from the values indicated in the Electrical Specifications table. Closed Loop Gain R, RZ, R3 R. c,.cz C3 c. +' open 100 short open 6,8 0 0 " -1 620 620 short open 3.3 4.7 0 56 2.2 CAPACITIVE LOADS The OPA600 will drive large capacitive ioads (up to 100pF) when properly compensated and settling times of under ISOns are achievable. The effect of a capacitive load is to decrease the phase margin of the amplifier, which may cause high frequency peaking or oscillations. A solution is to increase the compensation capacitance, somewhat slowing the amplifier's ability to respond. The recommended compensation capacitance value as a function of load capacitance is shown in Figure 2. (Use two capcitors, each with the value indicated.) Alternately, without increasing the OPA600's compensation capacitance, the capacitive load may be buffered by connecting a small resistance, usually So. to son, in series with the Output, pin 8. For very-large capacitive loads, greater than 100pF, it will be necessary to use doublet compensation. Refer to Figure 3 and discussion on slew rate. This places the dominant pole at the input stage. Settling time will be approximately SO% slower; slew rate should increase. Load capacitance should be minimized for optimum high frequency performance. Because of its large output capability, the OPA600 is particularly well suited for driving loads via coaxial R5 -10 '00 open , '00 3,3k 32k 0 , 0 100 'k 3,3k short -100 0 100 -1000 '00 3.3k 3.3k 116 0 0 4,7 100 FIGURE I. Recommended Amplifier Circuits and Frequency Compensation. 19 250 125 -3pF' 6000 200 Ii: e"c: C) S 'u .. ..,. U 5lc: 150 ;; 75 E i= C- U 6000 e'N O> .,. '" 50 100 ,§ 25 50 0 ...J 8 0 10 0 Compensation Capacitance (pF i '3pF typo should match stray capacitance between pin 3 and common. FIGURE 2. Capacitive Load Compensation and Response. cables. Note that the capacitance of coaxial cable (29pF /foot ofiength for RG-58) will not load the amplifier when the coaxial cable or transmission line is terminated in its characteristic impedance. =3pF 6000 SETTLING TIME Settling time is defined as the total time required, from the input signal step, for the output to settle to within the specified error band around the final value. This error band is expressed as a percentage of the magnitude of the output transition, a lOY step. Settling time is a complete dynamic measure of the OPA600's total performance. It includes the slew ra,te time, a large signal dynamic parameter, and the time to accurately reach the final vaiue, a small signal parameter that is a function of bandwidth and open-loop gain. Performance curves show the OPA600 settling time to ±I%, ±O.l%, and ±0.01%. The best settling time is achieved in low closed-loop gain circuits. Settling time is dependent upon compensation. Undercompensation will result in small phase margin, overshoot or instability. Over-compensation will result in poor settling time. Figure I shows the recommended compensation to yield the specified settling time. Improved or optimum settling time may be achieved by individually compensating each device in the user's circuit since individual devices vary slightly from one to another, as do user's circuits. For alternate doublet compensation refer to Figure 3. For a closed-loop gain equal to -I, delete Cl and C2 and add a series RC circuit (R = 220, C = O.OIp.F) between pins 14 and 4. Make no connections to pins 11 and 5. Absolutely minimze the capacitance to these pins. If a connector is used for the OPA600, it is recommended that sockets for pins 11 and 5 be removed. For a PC board mount, it is recommended that the PC board holes be overdrilled for pins II and 5 and adjacent ground plane copper be removed. Effectively this compensation places the dominant pole at the input stage, allowing the output stage to have no compensation and to slew as fast as possible. Bandwidth and settling time are impaired only slightly. For closed-loop gains other than -I, diffe'rent values of Rand C may be required. SLEW'RATE OFFSET ADJUSTMENT Slew rate is primarly an output, large signal parameter. It has virtually no dependence upon the closed-loop gain or small signal bandwidth. Slew rate is dependent upon compensation and decreasing the compensation capacitor value will increase the available slew rate as shown in the performance curve. The OPA600 slew rate may be increased by using an alternate compensation. as shown in Figure 3.. The slew rate will increase between 700 and 800Y/ p.s typical, with 0.01% settling time increasing to between 175 and 190ns typical, and 0.1% settling time increasing to between 110 .and 120ns typical. The offset voltage of the OPA600 may be adjusted to zero by connecting a 5kO resistor in series with a IOkO linear potentiometer in series with another 5kO resistor between pins 2 and 15, as shown in Figure 4. It is important that one end of each of the two resistors be located very close to pins 2 and IS" to isolate and avoid loading these sensitive terminals. The potentiometer should be a small noninductive type with the wiper connected to the positive supply. The leads connecting these components should be short, no longer than O.S-inch, to avoid stray capacitance and stray signal pick-Up. If the potentiometer must be located away from the immediate vicin- ·3pF typo should match stray capacitance between pin 3 and common. FIGURE. 3. Amplifier Circuit for Increased Slew Rate. 20 t the 0 PA600 can deliver these current pulses is limited by the RC time constant. The internal voltage drops, output voltage available, power dissipation, and maximum output current can be determined for the user's application by knowing the load resistance and computing: VOUT = 14 [RLOAD ';- (SO + RLOAD)] This applies for ReoAD less than lOon and the current boost not activated. When RLOAD is large, the peak output voltage is typically ±IlV, which is determined by other factors within the OPA600. +VCC 10kCl 5kCl 5kCl SHORT-CIRCUIT PROTECTION The OPA600 is short-circuit-protected for momentary short to common «Ss), typical of those enountered when probing a circuit during experimental breadboarding or troubleshooting. This is true only if pins 7 and 9 are open (current boost not activated). An internal son resistor is in series with the collector of each of the output transistors, which under fault conditions will cause the output transistors to saturate and limit the power dissipation in the output stage. Extended application of an output short can damage the amplifier due to excessive power dissipation. The OPA600 is not short-circuit-protected when the current boost is activated. The large output current capability of the OPA600 will cause excessive power dissipation and permanent damage will result even for momentary shorts to ground. Output shorts to either supply will destroy the OPA600 whether the current boost- is activated or not. FIGURE 4. Offset Null Circuit. ity of the OPA600, extreme care must be observed with the sensitive leads. Locate the two Skn resistors very close to pins 2 and IS. Never connect +Vcc directly to pin 2 or IS. Do not attempt to eliminate the Skn resistors because at extreme r('t~tion> the potentiometer will directly connect +Vr,. to pin 2 or IS and permanent damage will result. Offset voltage adjustment is optional. The potentiometer and two resistors are omitted when the offset voltage is considered sufficiently low for the particular application. For each microvolt of offset voltage adjusted, the offset voltage temperature sensitivity will change by ±0.004j.1V/oC. CURRENT BOOST External ability to bypass the internal current limiting . resistors has been provided in the QPA600. This is referred to as current boost. Current boost enables the OPA600 to deliver large currents into heavy loads (±200mA at ±IOV). To bypass the resistors and activate the current boost, connect pin 7 to - Vee at pin 6 with a short lead to minimize lead inductance and connect pin 9 to +Vcc at pin 12 with a short lead. HEAT SINKING AND POWER DISSIPATION The OPA600 is intended as a printed circuit board mounted device, and as s\lch does not require a heat sink. It is specified for ambient temperature operation from -SSOC to + l2SoC. However, the power dissipation must be kept within safe limits. At extreme temperature and under full load conditions, some form of heat sinking will be necessary. The use of a heat sink, or other heat dissipating means such as proximity to the ground plane, will result in cooler operating temperatures, better temperature performance, and improved reliability. It may be necessary to physically connect the OPA600 to the printed circuit board ground plane, attach fins, tabs, etc., to dissipate the generated heat. Because of the wide variety of possibilities, this task is left to the user. For all applications it is recommended that the OPA600 be fully inserted into the printed circuit board and that the pin length be short. Heat will be dissipated through the ground plane and the AC performance will be its best. With a maximum case temperature of'+12SoC and not exceeding the maximum junction of + I7SoC, a maximum power dissipation of 600mW is allowed in either output transistor. CAUTION-Activating current boost by bypassing the internal current limiting resistors can permanently damage the OPA600 under fault conditions. See section on short circuit protection. Not activating current boost is especially useful for initial breadboarding. The son (±S%) current limiting resistor in the collector circuit of each of the output transistors causes the output transistors to saturate; this limits the power dissipation in the output stage in case of a fault. Operating with the current boost not activated may also be desirable with small-signal outputs (i.e., ±IV) or when the load current is small. Each resistor is internally capacitively-bypassed (O.Olj.lF, ±20%) to allow the amplifier' to deliver large pulses of current, such as to charge diode junctions or circuit capacitance and still respond quickly. The length of time that 21 TESTING For static and low frequency dynamic measurements, the OPA600 may be tested in conventional operational amplifier test circuits, provided proper ground techniques are observed, excessive lead lengths are avoided, and care is maintained to avoid parasitic oscillations. The circuit in Figure 3is recommended for low fre~ quency functional testing, incoming inspection, etc. This circuit is less susceptible to stray capacitance, excessive lead length, parasitic tuned circuits, changing capacitive loads, etc. It does not yield optimum settling time. We recommend placing a resistor (approximately 3000) in series with each piece of test equipment, such as a DVM, to isolate loading effects on the,OPA600. . To realize the full performance capabilities ofthe OPA600, high frequency techniques must be employed and the test fixture must not limit the amplifier. Settling time is the most critical dynamic test and Figure 5 shows a recommended OPA600 settling time test circuit schematic. Good grounding, truly square drive signals, minimum stray coupling, and small physical size are important. The input pulse generator must have a flat topped, fast settling pulse to measure the true settling time of the amplifier. A circuit that generates a ±5V flat topped pulse is shown in Figure 6. (21 HP2835 +~ .... Pulse In Error Out Input = ±5V Output = ±5V Error Output ±O,5mV (±0,01%) ':" (1) 0,020 Matched -15VDC (2) With Co C. 3,3pF typical, C, optimized for circuit layout, and RL (3) Use 5100 with generator of Figure 6, = = 1pF =500, t. < 100ns, 15VDC ~ FIGURE 5. Settling Time and Slew Rate Test Circuit. +15VDC +15VDC +--""'........+----f:'O) Pulse Out Trigger In Input.::: TTL Output - "!:SV. 1.8kO 'ALT 2N3906 2N2907 . .... 15VDC 100pF -15VDC~ *" +, r 10IIF 100pF 150 ':" -15VDC FIGURE 6. Flat Top Pulse Generator. 22 BURR-BROWN® IElElI OPA602 (~~ l~) ·\l.~ )j ~ , , , ADVANCE INFORMATION Subject to Change High-Speed Precision O//e'® OPERATIONAL AMPLIFIER APPLICATIONS FEATURES _ nnr:I',(llnl' • • • • • HIGH SLEW RATE: 35V/ps LOW OFFSET: ±250pV max LOW BIAS CURRENT: ±lpA max FAST SETTLING: Ips 10 0.01% UNITY·GAIN STABLE IllQlTDllUl:lITIlTlnll ... I IIL.Un,IUI' • • • • • OPTOELECTRONICS SONAR. ULTRASOUND PROFESSIONAL AUDIO EQUIPMENT MEDICAL EQUIPMENT DATA CONVERSION .. ,"'. IIUI1I ...... " . I""n DESCRIPTION The OPA602 is a precision, wide bandwidth FET operational amplifier. Monolithic Dire' (dielectrically isolated FET) construction provides an unusual combination of high speed and accuracy. Its wide bandwidth design minimizes dynamic errors. High slew rate and fast-settling behavior allow accurate signal processing in pulse and data conversion applications. Wide bandwidth and low distortion characteristics provide high performance in frequency-domain circuitry. All dynamic and DC specifications are rated with a IkO resistor in parallel with 500pF load impedance. The OPA602 is unity-gain stable and easily drives capacitive loads up to l500pF. Laser-trimmed input circuitry provides offset voltage and drift performance normally associated with precision bipolar op amps. Dire' construction achieves extremely low input bias currents (I pA max) without compromisin& input voltage noise. The OPA602's unique input cascode c.ircuitry maintains low input bias current and precise input char.~cteristics over its full input common~mode voltage range. Oire'® Burr-Brown Corp. Inlernalional Alrporllnduslrial Park· P.O. Box 11400· Tucson. Arizona 85734 • Tel. (6021 746·1111 • Twx: 911).952-1111 . Cable: BBRCORP . Telex: 66·8491 PDS-753 23 SPECIFICATIONS ELECTRICAL At Vs = ±15VDC and TA = +25°C unless otherwise 'noted. OPA602AM PARAMETER CONDITIONS INPUT NOISE Voltage: fo = 10Hz fo = 100Hz fo = 1kHz fo = 10kHz fa = 10Hz to 10kHz fa = O.IHz to 10Hz Current: f8 MIN - OFFSET VOLTAGE Average Drift VCM = OVDC T" = TMIN to TMAX ±Vs = 12V to 18V 70 TYP MAX OPA602CM MIN ·· ±1000 ±15 80 TYP MAX UNITS ··· ··· · 23 19 ·13 12 1.4 0.95 12 0.6 ±300 ±550 BIAS CURRENT Input Bias Current Over Specified Temp. MIN ·· ·· · fo = O.IHz to 20kHz Supply Rejection OPA602BM/SM MAX ·· · = O.lHz to 10Hz Inpul Offsel Voltage Over Specified Temp. TYP nV/v'Hz nV/v'Hz nV/v'Hz nV/v'Hz /iVrms INp-p fAp-p fAlv'Hz · ±150 ±250 ±3 100 ·±500 ±1000 ±5 ±100 ±200 ±1 86 · ±2.50 ±500 ±2 IN pV pV/'C dB VCM =OVDC ±2 ±20 ±10 ±500 ±1 ±20 ±200 ±2 ±200 ±2000 ±0.5 ±10 ±1 ±100 pA pA pA VCM =OVDC 1 20 10 500 0.5 20 200 2 200 1000 0.5 10 1 100 pA pA pA SM Grade OFFSET CURRENT Input Offset Current Over Specified Temp. SM Grade INPUT IMPEDANCE Differential Common-Mode INPUT VOLTAGE RANGE +13, -'-II 100 92 dB R,?lkn 75 88 100 92 dB Gain = 100 20Vp-p, R, = lkn Vo = ±10V, R, = lkn 3.5 4 MHz kHz 24 6.5 570 35 0.7 1.0 5 20 28 V/fiS FREQUENCY RESPONSE Gain Bandwidlh Full Power Response Settling Time: 0.1% 0.01% Gain = -1, RL = 1kO C, = 500pF, 10V step RATED OUTPUT Voltage Output Current Output Output Re'sistance Load Capacitance Stability R,=lkn Vo ",±10VDC lMHz, open loop Gain = +1 Raled Voltage Voltage Range, 10=OmADC TEMPERATURE RANGE Specification Ambient temp. SM Grade Operating Storage Ambient temp. Ambient temp. 8 Junction-Ambient *Speciflcation same as OPA602BM ±11 ±25' Short Circuit Current POWER SUPPLY Derated Performance Current, Quiescent Over Specified Temp. nllpF nllpF 88 OPEN LOOP GAIN, DC ±10.2 ·· · · · · ·· ·· · · · · ·· · ·· · · · ·· · · · · ·· ·· · 75 V1N Open-Loop Voltage Gain Slew Rate 10"111 10"113 = ±10VDC Common-Mode Input Range Common-Mode Rejection ·· · · · · ·· ·· · · · ·· ·· · · · ·· · · · · ·· ·· · ±11.5 ±15 ±30 +12.9, -13,8 ±20 80 1500 ±50 ±15 ±5 3 3.5 -25 -55 -55 -65 ±18 4 4.5 +85 ±125 +125, +150 200 V fiS ps V rnA n pF mA VDC VDC mA mA 'C 'C ·C 'C 'CIW ORDERING INFORMATION OPA602 Basic model number--..,.-----------y----J Performance grade code ( ) .( T. T A, B, C: -25'C to +85'C S: -55'C to +125'C Package Code----------------~ M: TO-99 Metal Package 24 ) MECHANICAL CONNECTION DIAGRAM TO-99 Package Top View NC NOTE: Leads in true position within .010" (.2Smm) Rat MMC at seating plane. seati~g IIIII~ Plane ---1\....-0 DIM A B C 0 E ABSOLUTE MAXIMUM RATINGS Supply ................•.....•..................•..•••.• ±18VDC Internal Power Dissipation (T, :5 +175'C) ................ +1000mW Differential Input Voltage .......•••....................... Total Vs Input Voltage Range ...•...........•........•.......•......•. ±Vs F INCHES MIN MAX .335 .370 .305 .335 .165 .185 .016 .021 .010 .040 .010 .040 G .200 BASIC H .028 .034 .029 .045 .500 .110 .IGU 45' BASIC .095 .105 Storage Temperature Range .... ',_ ............... -65°C to +150°C O..,cle.i.ill!;j TCllltJt;ll'ia;'UI~ nall\tCs ................... -G:;"C lc.. -1-12:;"C J K L Lead Temperature (soldering 10 seconds) .................. +300°C Output Short-Circuit to ground (+25'C) ...•• Continuous to ground M N MILLIMETERS MIN MAX 8.51 9.40 7.75 8.51 4.19 4.70 0.41 0.53 0.25 1.02 1.02 0.25 5.08 BASIC 0.71 0.8B 0.74 1.14 12.7 ".Gu £.,:::1 45' BASIC 2.41 2.67 Junction Temperature ...............................•.... +175°C TYPICAL PERFORMANCE CURVES T. = +25'C, Vs = ±ISVDC unless otherwise noted. INPUT CURRENT NOISE SPECTRAL DENSITY 100 l~ > ~ INPUT VOLTAGE NOISE SPECTRAL DENSITY lk l~ , > ;: 10 100 Eo lil 0 z ....... lil 0 z l C ~ ~ 10 ~ '5 I; "0 (J > I 01 100 10 lk 10k Frequency (Hz) 1M lOOk 10 POWER SUPPLY REJECTION AND COMMON-MODE REJECTION vs TEMPERATURE 0.. CMR .. a:" 100 (J 95 ttt- " 105 a: "0 PSR ::;: --- ~ 100 .", ul ........... 3i o z t::: r-:- ~ ~ 1M -50 -25 o +25 +50 Temperature (DC) OPA602 + Resistor ... .Uo"'" ~ 10 !!! "0 Resistor noise only 1 +75 , :. itt > 90 -75 lOOk TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY AT 1kHz vs SOURCE RESISTANCE L~ :!!. '" 10k Frequency (Hz) lk lk 110 iii" 100 +100 ~ 100 +125 25 IIII I IIII lk 10k lOOk 1M Source Resistance (0) 10M 100M TYPICAL PERFORMANCE CURVES (CONT) TA = +25'C, 10nA v. = ±15VDC unless otherwise noted. BIAS AND OFFSET CURRENT YS TEMPERATURE YS ~~~tt~~~~~~~~~t!~~~~~'0nA BIAS AND OFFSET CURRENT INPUT COMMON MODE VOLTAGE InA < ~ E i!! ~ u .'" 100 10 Iii tt:tjjtt:t:t:t:t11:1::t:t::tti:i:1:1:jj 0.1 0.1 -50 -25 0 +25 +50 +75 +100 om LJ...I..L.J..L.J...Ll..J,..l...Ll..u...Ll...Ll...l...L...l...L..L.J...Ll..u..L.J..J...JU-JUJ 0.01 -15 -10 -5 o +5 +10 +15 +125 Common-Mode Voltage (V) Ambient Temperature (Oe) POWER SUPPLY. REJECT ION YS FREOUENCY 140 COMMON-MODE REJECTION YS FREOUENCY 140 rr01rrr-"rT11rr01rrr-"'-rT11rT01m-,.-n-r....,....,m is. 60 Q. + .. ~ rJl Iii 40 a. 20 .. ~ 0 0 H-:+Hf-+++lf-H+HH+I*+++lf-Hf-I+H+l+I 1 100 10 lk 10k I .. 1M lOOk 10M Frequency (Hz) Frequency (Hz) YS COMMON-MODE REJECTION INPUT COMMON MODE VOLTAGE 120 90 l!! e0 E E 0 ~ ~ 100 40 -10 -5 0 o +5 +10 +15 8 ~ 1 100 10 .......... 6 "CDc: c: 35 R........ , L~ ~:- . Slew Rate 4 \ CJ 2 -75 -50 -25 0 +25 +50 +75 lk 10k lOOk 1M "" -180 10M Frequency (Hz) 37 r; ij 1 GAIN-BANDWIDTH AND SLEW RATE YS SUPPLY VOLTAGE 10 . ~ - 135 Ao< Oommon-Mode Voltage (VI i ;:: , GAIN-BANDWIDTH AND SLEW· RATE YS TEMPERATURE <; -90 ~: 20 70 -15 ... - 60 80 u :I: i til 80 '5 > -45 -+ c.,:,'00pF iii 100 a: :; III RL -lkCl 120 110 c: .2 tl OPEN-LOOP FREOUENCY RESPONSE 140 8 en I:Jl .. 33 Ii ~ ! 31 36 L~~11 of ~ r; -h i ".c: CD c: ~ 6 ij i-" 5 o ILl- SlrjR'jte 10 15 26 i :Jl 34 Supply Voltage (±Vcc) Ambient Temperature ("'C) 36 ioI"i-""" CJ 29 +100 +125 .... ~ GBW <; 32 20 ~ ~ !. TYPICAL PERfORMANCE CURVES (CONT) T" :::;: +25°C, Vs = ±15VDC unless otherwise noted. OPEN-LOOP GAIN vs TEMPERATURE 120 - ---... 110 iii ~ . c 100 l!l Q) N' 0 > -50 -25 o , c: 6. ~ 20 Q) ........ ~ 90 80 -75 MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY 30 +25 +50 '" 1!! o r-..... +75 .> 5.. -:; " "'" +100 10 1'- o " -R,=lkQ o +125 10k ...... 1M lOOk 10M Ambient Temperature (DC) Frequency (Hz) LARGE SIGNAL TRANSIENT RESPONSE SMALL SIGNAL TRANSIENT RESPONSE (Time (ps) Time (PO) ~ +10 a. 1!! 0 > 0 0 -10 -:; Co -:; SETTLING TIME vs CLOSED-LOOP GAIN 4 i CD E ;( 3.25 3 c I I 1/ 1/ 2 ~ ~ ~ 5 3.0 () '" / 0. Co I' ~ 2.75 R,=lkQ C,= 100pF 0 -10 -100 Closed-Loop Gain (VIV) -1 2.5 -75 -lk -50 -25 +25 0 ...E N' ;g 0.1 i!: ;~ - --c- z + o 96 . +. _l.. rms lkQ -:- Av= +10WIV 0.01 _JTest Av=+WN-., 92 .J;I o 5 10 15 Supply Voltage (±Vcc) +125 .L Av-+,10WN - ~ i-" CD +100 TOTAL HARMONIC DISTORTION VS FREQUENCY 100 l!l +75 1.0 40.2kQ ...c +50 --- Ambient Temperature (DC) OPEN-LOOP GAIN vs SUPPLY VOLTAGE 104 - - -r--r- g J i= .='" irn SUPPLY CURRENT vs TEMPERATURE 3.5 I I J It II 0.001 0.1 20 - 10 100 Frequency (Hz) 27 lk I 10k Limit lOOk APPLICATIONS INFORMATION (2) HP 5082-2835 +15V 2kO 2kO 500 1pF +~ 5100 2kO +15V 1pF High Quality +~ 1pF Tantalum Pulse Generator +~ Pulse In ±5V 1I22N5564 2kO >-----------+--{e 510 Output Error Out ±0.5mV (0.01%) t----{e -15V 5100 1P~ -15V FIGURE 1. Settling Time and Slew Rate Test Circuit. 6 ±10mV Typical Trim Range ·10kO to 1MO Trim Potentiometer (100kO Recommended) FIGURE 2. Offset Voltage Trim. 28 ..... BURR-BROWN® OPA633 IElEI·1 High Speed BUFFER AMPLIFIER FEATURES APPLICATIONS 275M!!z HIGH SLEW RATE: 2500V/pS HIGH OUTPUT CURRENT:.100mA LOW OFFSET VOLTAGE: 1.5mV REPLACES HA·5033 IMPROVED PERFORMANCE/PRICE: LH0033, LTC10l0, HOS200 '!' '.A!!!!~ !!A~!!'.A!!!!T!!: • • .• • • Q OP AMP r.IIRRENT BRRSTER o VIDEO BUFFER • LINE DRIVER o A/D CONVERTER INPUT BUFFER +Vs DESCRIPTION The OPA633 is a monolithic unity·gain buffer amplifier featuring very wide bandwidth and high slew rate. A dielectric isolation process incorporating both NPN and PNP high frequency transistors achieves performance unattainable with conventional integrated circuit technology. Laser trimming provides low input offset voltage. High output current capability allows the OPA633 to drive son and 7Sn lines, making it ideal for RF, IF and video applications. Low phase shift allows the OPA633 to be used inside amplifier feedback loops thus bringing high current output and ability to drive capacitive loads to many circuit applications. The OPA633 is available in the 12-pin TO·8 hermetic metal package with -2Soe to +8Soe and -ssoe to +12Soe temperature ranges and a low cost plastic DIP package specified for operation from ooe to +7S°c.. j V'N " l"- ?r; v t-. VOUT LK S-- v "- -Vs f'o Inlernational Airport Industrial Park. P.O. Box 11400 • Tucson. Arizona B5734 • Tel.: 1602) 746·1111 • Twx: 910·952·1111 • Cable: BBftCORP • Telex: 66·6491 PDS·699 29 SPECIFICATIONS ELECTRICAL At +25'C, Vs = ±12V, Rs = 500, R, = 1000, C, = tOpF unless otherwise noted, OPA633AH PARAMETER CONDITIONS MIN TYP OPA633SH MAX FREQUENCY RESPONSE Small Signal Bandwidth = 1Vrms, Rl = lkO Full Power Bandwidth Vo Slew Rate Rise Time. 10% to 90% Vo = 10V, Vs = ±15V, R, = lkO Vo = 500mV 1000 Propagation Delay Overshoot Settling Time, 0.1% Differential Phase Errorl1) Differential Gain Error '11 Total Harmonic Distortion Vo = tvrms, R, = lkO, I = 100kHz Vo = tvrms, R, = 1000, I = 100kHz Voltage TAo = TMIN to TMAX R, = lkO, Vs = ±15V ±S.O ±11 ±SO ±10 '±13 ±100 5 0.93 0.95 0.99 0.95 Resistance ··· · · TRANSFER CHARACTERISTICS Gain R,=lkO TA = TMIN to TMAX 0.92 tNPUT Oflset Voltage T,= +25'C TAo::: TMIN to TMAX vs Temperature vs Supply Bias Current Noise Voltage Resistance Capacitance TA ::: TMIN to TMAX T.= +25'C TA == TMIN to TMAX 10Hz to lMHz 54 ±1.5 ±5 ±33 72 ±15 ±20 20 1.5 1.6 ±15 ±25 ±35 ±50 POWER SUPPLY Rated Supply Voltage Operating Supply Voltage Current, Quiescent Specified performance Derated performance 10=0 10 = 0, TAo::;:: TMIN to TMAX ±12 ±5 21 21 ±16 25 30 TEMPERATURE RANGE -25 -55 Specification, Ambient Operating. Ambient 8 Junction, Ambient C21 8 Junction, Casel21 TYP OPA633KP MAX ·· · ·· ··· ·· · 275 65 2500 2.5 1 10 50 0.1 0.1 0.005 0.02 OUTPUT CHARACTERISTICS Current MIN +S5 +125 MIN • Specification same as OPA633AH. MAX 260 40 ··· · ·· · ·· ·· ·· ·· · ·.. · ·· · ·· · · · ··'. ·· ±5 ±6 VIps ns ns % ns Degrees % % % V V mA 0 VN VlV VN ·· ·· · ·· · · ··· ·· · ·· ·· ·· · ·· ·· · ·· ·· · · · · · · · -55 +125 0 -25 UNITS MHz MHz .' · 99 31 TYP +75 +S5' 90 27 mV mV pVl'C dB pA pA pVp-p MO pF V V rnA rnA 'c 'c 'C/W 'C/W NOTES: (1) Differential phase error in video transmission systems is the change in phase of a colorsubcarrier resulting from a change in picture signal from blanked to white. Differential gain error is the change in amplitude at the color subcarrier frequency resulting from a change in picture Signal from blanked to white. (2) Recommended heat sinks lor the TO-S package are: Thermalloy 2204A with = 27'C/W and IERC Up TO-S-4SCB, = 10'C/W. e•• CONNECTION DIAGRAMS ABSOLUTE MAXIMUM RATINGS Power Supply, ±V, , ............•.... , .........• ±20V Input Voltage V,N • , , .............. , +V. + 2 to -V. - 2 Output Current (peak) ...•............. , •.... ±200mA Internal Power Dissipation (25'C): 1'o-s (H) .... 1.75W DIP (P) ...... 1.95W Junction Temperature ......................... 200°C Storage Temperature Range: TO-S .. , -65'C to +150'C , DIP ..... -40'C to +S5'C Lead Temperature (soldering, 60s) ............. 300'C Case +V, Out NC NC NC In Substrate (Ground) e•• IN -Vs Case 30 MECHANICAL TO·8 ~:=i1 '~ m=tl 12 " -01-0 / 8~Pin 8 I o 0-0 I Plastic M I ...IN Eb~ . m I.-j L H ""'-Pin 1 ! !J s;,~~:g MAX MIN .593 .603 .553 .150 .019 040 15.06 15.32 13.89 14.05 3.30 3.Bl 0.41 0.48 1.02 .547 ,130 .016 ,ala 0.25 066 0.66 M N .100 BASIC DIM A A, MIN MAX MIN MAX .355 .400 .385 .290 .250 .200 .023 .070 9.03 8.65 5.85 5.09 3.05 0.38 0.76 10.16 .100 BASIC 1.78 2.54 BASIC .025 .008 0.64 0.20 1.27 0.38 8 e, C D F l~--.J\\ .J L M MAX .026 .036 .026 .036 500 .562 45° BASIC J ~ tNf D G MILLIMETERS MIN G H J K L ..\\.-J .340 .230 .200 .120 .015 .030 14.27 45° BASIC 2.54 BASIC MILLIMETERS .050 .015 .150 .070 0.91 0.91 12.70 INCHES ----.C ! E H L/ ----1 ' , D K NOTE: Leads in true position within 0.01" 10.25mm) R at MMC at seating plane. . C NOTE: Leads in true position within 0.010" (D.25mm) R a1 MMC at seating plane. -0 ~ P -.J 0 3_ I ..H-D "P" Package. DIM A --:-1-~n ------I -,-I--i ~~ ~ ~ ~ ~ INCHES J /Hd. .300 BASIC 9.80 7.38 6.36 5.09 0.59 3.82 1.78 7.63 BASIC n' '" 1" TYPICAL PERFORMANCE CURVES SMALL SIGNAL BANDWIDTH VS TEMPERATURE GAIN/PHASE VS FREQUENCY +6 +2 -2 -4 Cl -6 -8 1/ \ ....... iii' ...'c" , ~ +4 --- Rs = 300n -Rs=50n 300 ~ 0.5 I z ;; 0.4 0.3 Vs - ±5V 0.2 0.1 0 100 200 300 400 500 600 700 800 900 lk 10 20 30 40 r---T---:==~;::---'" :> oS SO ;; I 0 > ~ 0> J!l 0.85 g Vo RL r- z ·iii t!l o -50 +.1-~10b~ ~ +0.8 +0.6 - r--- o -25 V l.......:: ~ h ~ I""'"" ....... ~ +0.2 ....... ~~AL-\~O AL ~ ~~ ~ I-- -1.0 -10 -8 10kn r- "'~ ' l Lr- +40 +20 0 -20 ~ "3 .s 2 4 :> oS +2 ~ > 0 -2 -80 0 +100 +125 +4 f I if, -60 -2 +75 +80 +60 -40 ~ -4 +50 +S V 10 Input Voltage (V) L ~~ V -25 o +25 +50 Temperature (oG) 33 ~ ./ -4 -50 -100 -6 +25 OFFSET VOLTAGE VS TEMPERATURE +100 A,-500, +0.4 -0.8 ±10V lkO Temperature (OC) OUTPUT EAAOA VS INPUT VOLTAGE +1.0 -0.6 100 40 Load Aesistance (0) -0.4 90 20 0.80. &..I~---.l....----"""----....I lk 10k 100 10 5 80 80 0.90 JI -0.20 70 100 0.95 t----~'Io"''-----,...----_; ~c 60 GAIN ERROR VS TEMPERATURE VOLTAGE GAIN VS LOAD AESISTANCE 1.00 50 Output Current (mA) Load Aesistance (0) +75 +100 +125 INSTALLATION AND OPERATION CIRCUIT LAYOUT As with any high frequency circuitry, good circuit layout technique must be used to achieve optimum performance. A circuit-board layout is provided which demonstrates the principles of good layout. Most of the applications circuits shown can be evaluated using this circuit board. Pinout of the TO-8 package version haS'been designed for maximum compatibility with other buffer amplifiers. Pins I and 12 are internally connected to +Vs. Pins 9 and 10 are internally connected to -Vs. This allows the OPA633 to be used in applications presently using the LH0033 buffer amplifier. Only one of the power supply connections for +Vs and -Vs must be connected for proper operation. Power supply connections must be bypassed with high frequency capacitors. Many applications benefit from the use of two capacitors on each power supply-a ceralJlic capacitor for good high frequency deco'upling' and a tantalum type for lower frequencies. They should be located as close as possible, to the buffer's power supply pins. A large ground plane is used to minimize high frequency ground drops and stray coupling. Since significant heat transfer takes place through the package leads, wide printed circuit traces to all leads will improve heat sinking. Sockets can reduce heat sinking significantly and thus are not recommended. Junction temperature rise is proportional to internal power dissipation. This can be reduced by using the minimum supply voltage necessary to produce the required' output voltage swing. For instance" I V video signals can be easily handled with ±5V power supplies thus minimizing the internal power dissipation. Output overloads or short circuits can result in permanent damage by causing excessive output current. The 50.0 or 75.0 series ~lUtput resistor used to match line impedance will, in most cases, provide adequate protection. When this resistor is not used, the device can be protected by limiting the power supply current. See "Protection Circuits." Excessive input levels at high frequency can cause increased internal dissipation and permanent damage. See the safe input voltage versus frequency curves. When used to buffer an op amp's output, the input to the OPA633 is limited, in most cases, by the op amp. When high frequency inputs can exceed sitfe levels, the device must be protected by limiting the power supply current. The case of the TO-8 package is connected to pin 2; which should be grounded. Pin 6 of the DIP package connects to the substrate of the integrated circuit and should be connected to ground. In principle it could also be connected to +Vs or -Vs, but ground is preferable. The additional lead length and capacitance associated with sockets may present problems in applications requiring the highest fidelity of high speed pulses. Depending on the nature ofthe input source impedance, a series input resistor may be required for best stability. This behavior is influenced somewhat by the load impedance (including any reactive effects). A value of 50n to 200.0 is typical. This resistor should be located close to the OPA633's input pin to avoid stray capacitance at the input which could reduce bandwidth (see Gain and Phase Versus Frequency curve). PROTECTION CIRCUITS The OPA633 can be protected from damage, due to excessive currents, by the simple addition of resistors in series with the power supply pins (Figure 5a). While this limits output current, it also limits voltage swing with low impedance loads. This reduction in voltage swing is minimal for AC or high crest factor signals since only the average current from the power supply causes a voltage drop across the series resistor. Short'duration loadcurrent peaks are supplied by the bypass capacitors. The circuit of Figure 5b overcomes the limitations of the previous circuit with DC loads. It allows nearly full output voltage swing up to its current limit of approximately 140mA. Both circuits require good high frequency capacitors (e.g., tantalum) to bypass the buffer's power supply connections. OVERLOAD CONDITIONS The input and output circuitry of the OPA633 are not protected from overload. When the input signal and load characteristics are within the device's capabilities, no protection circuitry is required. Exceeding device limits can result in permanent damage. The OPA633's small package and high output current capability can lead to overheating. The internal junction temperature should not be allowed to exceed 150°C. Although failure is unlikely to occur until junction temperature exceeds 200°C, reliability of the part will be degraded significantly at such high temperatures. External heat sinks can be used to reduce the temperature rise. CAP~CITIVE LOADS . The OPA633 is designed to safely drive capacitive loads up to O.OlJ.lF. It must be understood, however, that rapidly changing voltages demand large output load currents: ILOAD = (CLOAD) dV/dt Thus a signal slew rate of 1000V/ J.lS and load capacitance of O.OIJ.lF demands a load current of lOA. Clearly maximum slew rates cannot be combined with large capacitive loads. Load current should be kept less than 100mA continuous (200mA peak) by limiting the rate of change of the input signal or reducing the load capacitance. 34 USE INSIDE A FEEDBACK LOOP by the buffer are divided by the loop gain of the op amp. The OPA633 may be used inside the feedback path of an op amp such as the OPA606. Higher output current is achieved without degradation in accu·racy. This approach may actually improve performance in precision applications by removing load-dependent dissipation from a precision op amp. All vestiges of load-dependent offset voltage and temperature drift can be eliminated with this technique. Since the buffer is placed within the feedback loop of the op amp, its DC errors will have a negligible effect on overall accuracy. Any DC errors contributed APPLICATIONS The low phase shift of the OPA633 allows its use inside the feedback loop of a wide variety of op amps. To assure stability, the buffer must not add significant phase shift to the loop at the gain crossing frequency of the circuit-the frequency at which the open loop gain of the op amp is equal to the closed loop gain of the application. The OPA633 has a typical phase shift ofless than 10° up to 70MHz, thus making it useful-even with wide band op amps. CIRCU~TS +15V !I '"'~ 0."-,,, I VO UT OU,O'l Termination " . ~15V LARGE SIGNAL RESPONSE 10V STEP - R, = 1000 10V STEP - R,= 1kO 10ns/div 10ns/dill SMALL SIGNAL RESPONSE 0.5V STEP - R, = 1000 0.5V V'N 0.5V VOUT o FIGURE I. Dynamic Response Test Circuit. 35 POSITIVE PULSE RESPONSE 100mV VON +12V 50mV VOUT R, 500 o RG-58 Coaxial Cable o VON -100mV o VOUT -50mV FIGURE 2. Coaxial Cable Driver Circuit. R, R, R, 1kO G=-10 FIGURE 4. Buffered Inverting Amplifier. FIGURE 3. Precision High Current Buffer. +Vs +Vs (a) (b) 1000 Inpui 1000 -Vs -Vs FIGURE 5. Output Protection Circuits. 36 NOTE: The prototype circuit board layout shown may be used to test many common applications circuits. Component designations in the applications circuit diagrms refer to the component positions on this prototype board layout. FIGURE 6. Prototype Circuit Board Layout. 37 BURR-BROWN® OPA2111 IElElI NEW PACKAGE NOW AVAILABLE Dual Low Noise Precision Di/e'® OPERATIONAL AMPLIFIER FEATURES APPLICATIONS • • • • • • • • • • • • LOW LOW LOW LOW HIGH HIGH NOISE: 1011% tested: BnV/v'Hz max at 10kHz BIAS CURRENT: 4pA max OFFSET: 5110pV max DRIFT: 2.8tlV/oC OPEN LOOP GAIN: 114dB min COMMON·MODE REJECTION: 96dB min PRECISION INSTRUMENTATION DATA ACQUISITION TEST EQUIPMENT PROFESSIONAL AUDIO EQUIPMENT MEDICAL EQUIPMENT DETECTOR ARRAYS DESCRIPTION The OPA2111 is a high precision monolithic Dire' (dielectrically isolated FET) operational amplifier. Outstanding performance characteristics allow its use in the most "critical instrumentation applications. Noise, bias current, voltage offset, drift, open-loop gain, common-mode rejection, and power supply rejection are superior to BIFET® amplifiers. Very-low bias current is obtained by dielectric isolation with on-chip guarding. Laser trimming of thin-film resistors gives very-low offset and drift. Extremely-low noise is achieved with new circuit design techniques (patent pending). A new'cascode design allowshigh precision input specifications and reduced susceptibility to flicker noise. Standard dual op-amp pin configuration allows upgrading of existing designs to higher performance levels. ·PATENT PENDING -Vee OPA2111 SIMPLIFIED CIRCUIT (EACH AMPLIFIER) BIFET@ National Semiconductor Corp., Dife,e Burr-Brown Corp. International AIrport IndustrIal Park· P.O. Box 11400· Tucson. Arizona 85734· Tel. (602) 7411-1111· Twx: 910.952·1111 . Cable: BBRCORp· Telex: 66·6491 PDS-S40B (abbreviated) 38 SPECIFICATIONS ELECTRICAL At Vee =:: ±15VDC and T" = +25°C unless otherwise noted. OPA2111AM PARAMETER CONDITIONS MIN OPA2111BM TYP MAX 40 15 '8 6 0.7 1.6 15 0.8 I MIN OPA2111SM TYP MAX 80 40 15 8 1.2 3,3 24 1,3 30 11 7 6 0,6 1,2 12· 0.6 ±0.1 ±2 ±1 110 ±3 136 ±0,75 ±6 VCM = OVDC ±2 ±1 VCM = OVDC ±1,2 MIN OPA2111KM/KP TYP MAX 60 30 12 8 1.0 2,5 19 1.0 40 15 8 6 0,7 1.6 15 0,8 80 40 15 8 1.2 3.3 24 1,0 40 15 8 6 0.7 1.6 t5 0,8 ±O,05 ±0,5 ±O,5 1'10 ±3 136 ±O,5 ±2.8 ±0.1 ±2 2 110 ±3 136 ±O,75 ±6 ±O,3 ±8 2 110 ±3 136 ±2 ±15 ±8 ±1.2 ±O,5 ±4 ±2 ±1 ±8 ±3 2 ±15 pA pA ±6 ±O,6 ±3 ±1,2 ±6 ±3 ±12 pA MIN TYP MAX UNITS INPUT NOISE Vollage. 10 = 10Hz Max: 100% tested Max: 100% tested Max: 100% tested = fa 100Hz fa = 1kHz fa :: 10kHz I, = 10Hz to 10kHz' fu = a.1Hz to 10Hz Current, f8 10 ~·O.1Hz = 0.1Hz '" '" '" '" to 10Hz '" to 20kHz OFFSET VOLTAGE'" Input Ollset Voltage Average Drift Match Supply Rejection Channel Separation BIAS CURRENT'" Initial Bias Current Match OFFSET CURRENT'" Input Offset Current VCM TA = OVDC ::: TMIN to TMA)( 90 100Hz. R, = 2kCl IMPEDANCE Differential 96 ±31 10"111 10"113 Common-Mode 90 :t16 10"111 10"113 86 ±31 10"111 10"113 nVIJHz nVIJHz nVIJHz nVIJHz pV, rms I'V. p-p IA. p-p fA/JHz mV I'VI·C I'v/·C dB ±50 I'V/v dB 10"111 10"113 Cl II pF Cl II pF ±10 82 ±11 110 dB 106 125 3 dB dB 2 32 2 6 10 2 32 2 6 10 VIpS 5 5 I'S ±12 ±10 100 1000 40 mA 0 pF mA VOLTAGE RANGE Common-Mode Input Range Common-Mode Rejection V'N = ±10VDC ±10 90 ±11 110 110 125 3 ±10 ±11 96 ±10 110 ±11 90 110 V OPEN-LOOP GAIN. DC Open-Loop Voltage Gain Match R,~ 2kCl 114 125 2 110 125 3 FREQUENCY RESPONSE Unity Gain. Small Signal Full Power Response Slew Rate Settling Time, 0.1% 0.01% Overload Recovery, 50% Overdrive l3J 20V P-P. R, = 2kCl Vo = ±10V. R, = 2kCl Gain = -1, RL = 2kO 10V step 16 1 Gain =-1 2 32 2 6 10 16 1 5 2 32 2 6 10 16 1 5 MHz kHz I's I'S RAT,ED OUTPUT Voltage Output Current Output Output Resistance Load Capacitance Stability Short Circuit Current R,= 2kCl Vo= ±lOVDC DC, open loop Gain = +1 ±11 ±5 10 ±12 ±10 100 1000 40 ±11 ±5 10 ±12 ±10 100 1000 40 ±11 ±5 10 ±12 ±10 100 1000 40 ±11 ±5 10 V POWER SUPPLY Rated Voltage ±15 ±15 vec ±15 ±15 Voltage Range. Derated Performance Current, Quiescent ±5 10 = OmADC 5 ±18 7 ±5 +85 +125 +150 -25 -40 -65 5 ±18 7 ±5 +85 +85 +150 -55 -55 -65 5 ±18 7 ±5 +125 +125 +150 0 -40 -40 ±18 5 9 VDC mA +70 +85 +85 ·C ·C ·C TEMPERATURE RANGE Specification Operating Storage (J Junction-Ambient Ambient temp. Ambient temp. Ambient temp. -25 -55 -65 200 200 200 20044' ·C/W NOTES: (1) Sample tested-maximum parameters are guaranteed. (2) Offset voltage, offset current, and bias current are measured with the units fully warmed up. (3) Overload recovery is defined as the time required for the output to return from saturation to linear operation following the removal of a 50% input overdrive, (4) Typical9J -A = 150'C/W lor plastiC DIP, 39 ELECTRI.CAL (FULL TEMPERATURE RANGE SPECIFICATIONS) At Vee = ±15VDC and 1,,= TMIN to TUAX unless otherwise noted. OPA2111AM PARAMETER CONDITIONS MIN Ambient temp. -25 TYP OPA2111BM MAX MIN +85 -25 TYP OPA2111KM/KP OPA2111SM MAX MIN +85 -55 TYP MAX MIN +125 0 TYP MAX UNITS +70 'C ±0.9 ±8 2 100 ±10 ±5 ±15 mV 1lV/'C 1lV/'C ±80 IlV/V TEMPERATURE RANGE Specification Range INPUT I OFFSET VOLTAGE'" Input Offset Voltage Average Drift Match Supply Rejection BIAS CURRENT'" Initial Bias Current Match OFFSET CURRENT'" Input Offset Current VOLTAGE RANGE Common-Mode Input Range Common-Mode Rejection VCM = OVDC ±0.22 ±2 1 100 ±10 ±1.2 ±6 VCM = OVDC ±125 60 VCM = OVDC ±75 .86 ±0.08 ±0.5 0.5 100 ±10 ±0.75 ±2.8 ±lnA ±75 30 ±500 ±2.0nA ±16.3nA InA ±125 ±500 pA pA ±750 ±38 ±375 ±1.3nA ±12nA ±75 ±375 pA 90 ±50 ±0.3 ±2 2 100 ±10 86 ±32 ±1.5 ±6 82 ±50 dB V'N = ±10VDC ±10 86 ±11 100 ±10 90 ±11 100 ±10 86 ±11 100 ±10 80 ±11 100 dB V RL 2: 2kO 106 120 5 110 120 3 106 120 5 "00 120 5 dB dB RL = 2kO Vo =±10VDC Vo= OVDC ±10.5 ±5 10 ±11 ±10 40 ±10.5 ±5 10 ±11 ±10 40 ±10.5 ±5 10 ±11 ±10 40 ±10.5 ±5 16 ±11 ±10 40 V rnA rnA OPEN-LOOP GAIN, DC Open-Loop Vollage Gain Match RATED OUTPUT Voltage Output . Current Output Short Circuit Current POWER SUPPLY Current. Quiescent NOTES: lo=OmADC 5 8 5 8 5 8 (1) Offset voltage, offset current, and bias current are measured with the units fully warmed up. CONNECTION DIAGRAMS 'M' Package-Top View ORDERING INFORMATION -InA T OPA2111 () () = Basic model number-_ _ _ _ _.....:=r-=· Performance grade - - - -_ _ _ _ _ _-'_ A, B = -25'C to +85'C S = -55'C to +125'C K = O'C to +70'C Package Code _ _ _ _ _ _ _ _ _ _ _ _ _.J M = TO-99 metal can P = Plastic DIP 'p' Package-Top View ABSOLUTE MAXIMUM RATINGS Supply ................................................. ±18VDC Internal Power Dissipation (TJ::; +175°C) ............... t.. 500mW Differential Input Voltage ................................ Total Vee Input Voltage Range ........................................ ±Vee Storage Temperature Range ......•........•....• -65'C to +150'C' Operating Temperature Range ................... -55'C to +125'C Lead Temperature (soldering, 10 seconds) ................. +300'C Output Short Circuit to ground (+25'C) ..•....•....•.. Continuous Junction Temperature ................................. : .. +F5°C 40 +VCC And Case 5 10 rnA MECHANICAL 'P' Package-Plastic DIP 'M' Package- TO-99 (Hermetic) •¥' ,.' T 1 M.;. ., + ~ ,.;; "~~] ~ , ~!l\ -.~ N J ~ F::j Ii ~ D E F G H J K L M N IIIII --1 ! 1 --B.- D MAX MIN MAX .335 .370 .305 .335 .185 .165 .C2i .CHi .040 .010 .010 .040 .200 BASIC .034 .028 .045 .029 .500 .160 .110 45° BASIC .105 .095 8.51 7.75 4.19 9.40 8.51 4.70 O.~1 O.~3 - 12.7 2.79 4.06 45° BASIC DIM A . A, B B, C 0 MAX MIN MAX 9.02 8.65 10.16 ~ L M. N p Sea long Plane MILLIMETERS .355 .400 .340 .385 .230 .290 .200 .250 .120 .200 .015 .... ... .030 .070 .100 BASIC .025 .050 .015 .008 .150 .070 .300 BASIC IS' .0° .010 .030 .025 .050 MIN F G H J K 2.67 2.41 D G INCHES ..\\..J C !J!,. [ ! jl H NOTE: Leads in true position within 0.01" (0.25mm) R al MMC al seating plane. Pin numbers shc'.'m for referenco::- onl~l . Numbers may not be marked on package. Pin material and plating composition conform to Melhod 2003 (solderabilily) of MIL-STD-883 (excepl paragraph 3.2) . 0.25 1.02 1.02 0.25 5.08 BASIC 0.86 0.71 1.14 0.74 j -J I.M 1fm~ MILLIMETERS INCHES MIN DIM A B C 1"----1 Pin 1 1.1[~ Sealing Plane ~ 5.85 9.80 7.38 5.09 6.36 3.05 5.09 O.~S 0.59 0.76 1.78 2.54 BASIC 0.64 1.27 0.201 0.38 1.713 3.82 7.63 BASIC 0° W 0.25 0.76 0.64 1.27 NOTE: Leads in true position within 0,01" (O.25mm) R al MMC al seating plane. Pin numbers shown for reference only. Numbers may not be marked on package. Pin material and plating composition conform to Melhod 2003 (solderabilily) of MIL-STD-883 (excepl paragraph 3.2). TYPICAL PERFORMANCE CURVES TA = +25°C, Vee = ±15VOC unless otherwise noted. ~ ~ VOLTAGE AND CU.RRENT NOISE SPECTRAL DENSITY vs TEMPERATURE 12 r---~--~--~--~--~--~--~~100 INPUT CURRENT NOISE SPECTRAL DENSITY 100 ~:> 10 10 Eo ill z ·0 'I E ~ ~ ·0 2 V ~ S ::I 0 0 > If ,~, 0.1 10 4 100 lk 10k lOOk 1M TOTAL' INPUT VOLTAGE NOISE SPECTRAL DENSITY vs SOURCE RESISTANCE lk Rs ~:;; .. , l1li R. .!!! I 0 Z "'" tJ 100 .:. S '0 10Mcj I 10 > -Includes contribution from source resistance 0.1 10 I lookn III I I i.JliU I' R. lOOn BM : Ilil I I 1111 i I 100 lk 10k -50 -25 -25 -50 Temperature (OC) - 75 -100 -125 NOTE: Refer to complete data sheet PDS-540 for complete typical curves and applications information . 'JIJ I 1 , Rs ' lMn -t , 0.Q1 -75 Frequency (Hz) lOOk Frequency (Hz) 41 BURR-BROWN@ INA102 11:31:31 Low Power High Accuracy INSTRUMENTATION AMPLIFIER FEATURES APPLICATIONS • LOW QUIESCENT CURRENT: 750pA. max • AMPLIFICATION OF SIGNALS FROM SOURCES SUCH AS: Strain Gauges Thermocouples RTOs • INTERNAL GAINS: X 1. 10. 100. 1000 • LOW GAIN DRIFT: 5ppm/oC. max • HIGH CMR: 90dB. min • REMOTE TRANSDUCER AMPLIFIER • LOW OFFSET VOLTAGE DRIFT: 2pV/oC. mal • LOW LEVEL SIGNAL AMPLIFIER • LOW OFFSET VOLTAGE: 100pV. max • MEDICAL INSTRUMENTATION • LOW NONLlN.EARITY: 0.01%. max • MULTICHANNEL- SYSTEMS • HIGH INPUT IMPEDANCE: 101°0 • BATTERY POWERED EQUIPMENT • LOW COST DESCRIPTION The INAI02 is a high-accuracy monolithic instrumentation amplifier designed for signal conditioning applications where low quiescent power is desired. On-chip thin-film resistors provide excellent temperature and stability performance. State-of-the-art laser trimming technology insures high gain accuracy and common-mode rejection while avoiding expensive external components. These features make the INAI02 ideally suited for b'attery powered and high volume applications. The INAI02 is also convenient to use. A gain of I. 10, 100, or 1000 may be selected by simply strapping the appropriate pins together. 5ppm/oC gain drift in low gains can then be achieved without external adjustment. When higher than specified CMR is required, CMR can be trimmed using the pins provided. In addition. balanced filtering can be accomplished in the output stage. OFFSET ADJUST ALTER -INI1l"~--...p.. +IN@15J--,--iY' +Vcc -Vee CMR TRIM International Airport Industrial Park· P,O. Box 11400 - Tucson. Arizona 85734 - T81.(602) 746-11 11 - Twx: 910-952-11 11 • Cable: BBRCORP - Telex: 66-6491 PDS-523A 42 SPECIFICATIONS ELECTRICAL At T.; +25"C with ±15VDC power supply and in circuit of Figure 2 unless otherwise noted. MODEL INA102AG CONDITIONS MIN GAIN Range of Gain Gain Equation Error. DC: G TYP MIN TYP INA102KP MAX MIN TYP 1000 MAX UNITS 1000 VN VN 0.15 0.35 0.4 0.9 % % % % % % % % G=1+ =1 (40k/RG)11I = +25"'C = +25"'C 0.05 0.05 0.15 0.5 T,,=TMINtoTMAX 0.1 0.1 0.25 0.75 0.16 0.19 0.37 0.93 T... = +25°C T... = +25"'C T... =+25"'C T... = +25°C 10 15 20 30 0.03 0.03 0.05 0.1 5 10 15 20 T... T... T... = T... = G=10 G=100 G = 1000 +25"'C +25"'C T ... = TMIN to TM.u: T... =TMINtoTMAX G=1 G;10 G=100 G = 1000 T... = T.,m~ to TM,u, Gain Temp. Coefficient G=1 G=10 G=100 G = 1000 Nonlinearity, DC: G=1 G=10 G=100 G =1000 = to TM4X G=1 T... G=10 G=100 G = 1000 T" = TM,N to TMAX - -- - .....--- ............... ...... .. .......... INA1Q2CG MAX Voltage Current Short-Circuit Current Output Impedance: G = 1000 TMIN T,,=TMINtoTMAX = 10kCl 0.21 0.44 0.11 0.21 0.62 0.52 1.08 ppm/DC ppm/DC ppm/Ole ppm/DC %ofFS 0/0 of FS %ofFS %ofFS %ofFS %ofFS OfoofFS %ofFS 0.01 0.Q1 0.02 0.05 0.015 0.015 0.03 0.1 0.045 0.045 0.075 0.15 TA,=TM1NtoTMAX R.. o.oa ±(lV",I-2.5) ±(lV",I-3.5) ±1 V mA mA 2 0.1 n INPUT OFFSET VOLTAGE InitialOffsetl21 vs Temperature vs Supply vsTlme T,,=+25"C ±(20 + 30/G) ±300±300/G ±5.±10/G ±40±50/G ±100±200/G 50 30 ±400 ±700/G ±2±5IG ±10±20/G "V pVl"C pVIV pVlmo BIAS CURRENT Initial Bias Current (each input) vs Temperature vs Supply Initial Offset Current vs Temperature T" = TMIN to TMAX nN"C ±0.1 nNV nA ±15 ±2.5 ±0.1 T" = TMIN to TMAX nA ±O.1 ±2.5 ±10 nN"C IMPEDANCE nil nil 10'0112 10'0112 Differential Common·mode pF pF VOLTAGE RANGE Range, Linear Response CMR with 1kCl Source Imbalance G=1 G=10 G = 1010 1000 T,,=TMINtoTMAX ±(lV•• 1-3.51 DC 10 60Hz DC 10 60Hz DC to 60Hz 80 80 80 V ±(lV""I-2.5) 94 100 100 90 90 90 94 60 84 100 dB dB dB NOISE Input Voltage Noise fa = O.01Hz to 10Hz Density. G = 1000 = 10Hz fo = 100Hz fo = 1kHz Input Current Noise fa = O.01Hz to 10Hz Density: fo = 10Hz fo = 100Hz fo = 1kHz pV, p.p 0.1 '0 . 30 25 25 nVl.,fH'i nVl..JHZ nVl.,fH'i pA. p-p 25 0.3 0.2 0.15 pN.,fH'i pN.,fH'i pN.,fH'i 300 30 3 0.3 kHz kHz kHz kHz 30 3 0.3 0.03 2.5 0.15 kHz kHz kHz kHz kHz Vlpsec 50 360 3300 80 500 4500 psec psec psec psec psec psec DYNAMIC RESPONSE Small Signal, ±3dB Flatness VOUT - 0.1Vrms G=1 G=10 G=100 G =1000 Small Signal, ±1% Flatness G=1 G=10 G=I00 G;I000 Full Power, G =:= 1 to 100 Slew Rate, G = 1 to 100 Settling Time, 0.1%: G=1 G = 100 G; 1000 Settling Time, 0.01%: G = 1 G = 100 G = 1000 VOUT = 0.1Vrms = = = = = = VQ4JT 10Y. AL 10kO YOUT 10Y. RL 10kn RL 10kO. Ct. 100pF 10V step 10V slep 1.7 0.1 43 ELECTRICAL (CO NT) MODEL UNITS POWER SUPPLY v Rated Voltage Voltage Range Quiescent Current f31 V ~A TEMPERATURE RANGE ·c Specification Operation Storage ·C ·C 'Specifications same a~ for INA102AG. NOTES: (1) The internal gain set resistors have an a~solute tolerance of ±20%; however, their tracking is 50ppmrC. RG will add to the gain error if gains other than 1, 10.100 or 1000 are set externally. (2) Adjustable to zero at anyone time. MECHANICAL Hermetic ~,~[ ~ ~]~:I I--.-F-t AAAAAA t-- I N=.l---.i rntmtd H ~ G l- .""Y""vvv," , Pin 1 -iF(~ DIM A C at seating plane. D F Pin numbers shown, for reference only. Numbers are not marked on G package. J~ &.-L--IM Seating Plane NOTE: Leads in true position within .010" (.2Smm) R ~ 11===n j'j p;r -n.~. A.----t --I L Plastic ~-:,=-----~ H J K L M N [lUB" - MILLIMETERS MIN MAX 20.07 20.57 4.32 2.67 0.53 0.38 1.52 1.22 2.54 BASIC 0.76 '.78 0.20 0.30 3.05 6.'0 7.62 BASIC 10' 1.52 0.64 INCHES MAX MIN .790 .8'0 .105 .170 .02' .0'5 .048 .060 .'00 BASIC .030 .070 .008 .0'2 .240 .120 .300 BASIC '0' .025 .060 DIM A A, B 10- H Seating Plan] B, C D NqTE: Leads in true position F within .010" (.2Smm) R at MMC at G seating plane. PINS: Pin material and plating . composition conform to method 20D3 (solderability) of MIL-STD~ 883 (except paragraph 3.2). CASE: Plastic H J K L M N P M INCHES MIN MAX .740 .800 .725 .785 .230 .290 .200 .250 .200 .'20 .023 .0'5 .070 .030 .'00 BASIC 0.05 0.02 .015 .008 .070 .'50 .3ODBASIC O· '5' .030 .0'0 .025 .050 jlJ MILLIMETERS MIN MAX 20.32 '8.80 18.42 '9.94 5.85 7.38 5.09 6.36 3.05 5.09 0.38 0.59 0.76 '.78 2.54 BASIC 0.5' '27 0.20 0.38 1.78 3.82 7.63 BASIC 0' '5' 0.25 0.76 1.27 0.64 PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS OFFSET ADJUST ~ XIO GAINI 2 Supply .................................................... ±IBV Input Voltage Range ........................................ ±Vee Operating' Temperature Range ••.••••••••.•••••••• -2S·C to +B5°C XIOOGAIN~ Storage Temperature Range: Ceramic ........... '. -65°C to +150°C Plastic ......... : ... -SS'C to +12S·C Lead Temperature (soldering 10 seconds) •.•••••••••.•••.•• +300·C XI 000 GAIN I 4 XIOOO GAIN SENSE >!C GAIN SENSE ~ GAIN SET 7 >t Output Short-Circuit Duration .............. Continuous to ground ORDERING INFORMATION INA102 Basic Model Number _ _ _ _ _ _ _ _ _ _ _ -=r--J CMR TRIM (': T X G Performarice Grade Code - -_ _ _ _ _ _ _ _ _--'_ A. C: -2S·C to +BS·C K: O·C to +70·C Package Code - - - - - - - - - - - - - - - - - - ' G: 16-pin Hermetic DIP P: 16-pin Plastic DIP INA102AG. !NA102CG, INA102KP 44 ~ OFFSET ADJUST ~+IN 14 -IN ~FILTER 12 +Vco ~OUTPUT >i: COMMON >;c -Vee BURR-BROWN® IElElI INA106 ~ ~ ~ j':, I~I 1 I, , I Precision Fixed-Gain DIFFERENTIAL AMPLIFIER APPLICATIONS FEATURES .• • • • • • • • • • DIFFERENTIAL AMPLIFIER. A = 10 • BASIC INSTRUMENTATION AMPLIFIER BUILDING BLOCK • INVERTING AMPLIFIER. A = -10 • NONINVERTING AMPLIFIER. A = 10 • SUMMING AMPLIFIER. WEIGHTED • ±100V CM'RANGE DIFFERENTIAL AMPLIFIER F!X~!! BAl"'. A = 10 CMR 100dB min over temp NONLINEARITY 0.001% max NO EXTERNAL ADJUSTMENTS REQUIRED EASY TO USE COMPLETE SOLUTION HIGHLY VERSATILE LOW COST TO·99 HERMETIC METAL AND LOW COST PLASTIC PACKAGES DES'CRIPTION The IN A106 is a precision fixed-gain differential amplifier. As a monolithic circuit, it offc:rs high reliability at low cost. It consists of a premium grade operational amplifier and an on-chip precision resistor network. The INA106 is completely self-contained and offers the user a highly versatile function. No adjustments to gain, offset, and CMR are necessary. This pro· vides three important advantages: (I) lower initial design engineering time, (2) lower manufacturing assembly time and cost, and (3) easy cost-effective field repair of a precision circuit. ,r;-., - ln 10kO 100kO Ir.\ 0J-.N.r --r~sense R, -L-~_~R2 _ ............. ,.-----I~ +Vcc ">----I'~ Output r~ ~-." +In f'3IJ--'lR ,."............._ _..J\IIR.IV-_ _-r1f'0. Reference o \.::J 10kO 100kO f-..!J Inlernallonal Alrpon Industrial Park • P.O. Box 11400 • Tucson. Arizona B5734 • Tel.: (602) 741HII1 • Twx: 910·952·1111 • Cable: BBRCORP • Telex: 66-6491 PDS·729A· 45 SPECIFICATIONS ELECTRICAL At +25°C, Vee = ±15V unless otherwise noted. INA106AM CONDITIONS PARAMETER MIN GAIN Initial lll Error vs Temperature Nonlinearityl21 OUTPUT Rated Voltage Rated Cu rrent Impedance Current Limit Capacitive Load 10 = +20mA, -5mA 10 +20, -5 Eo=10V Differential Common-mode Differential Common-mode Voltage Range OFFSET VOLTAGE Initial vs Temperature vs Supply vs Time 12 100 30 2 V9 = 10V step Vo = 10V step VCM == 10V step. V01FF == OV 100 5 10 5 50 3 5 10 5 TEMPERATURE RANGE Specification Operation Storage ±5 ±18 ±2 ±1.5 -25 -55 -65 +85 +125 +150 .. Speclflcallon same as for INA106AM. TYP MAX 106 0.025 · UNITS VN % ppmloC % V rnA Q rnA pF kQ kQ V V dB 86 200 · 2 . ±15 Derated performance VOUT=OV .MIN ·· · · ·· ·· ·· ·· · ·· ·· ·· ·· · ·· ·· ·· ·· · ·· · · · ·· · ·· ·· ·· ·· ··· ·· ··· ·· ·· · · · ·· ·· · ·· ··· ··· 100 1 30 -3dB Vo=20V p-p INA106KP MAX 0.01 RTI 'S) OUTPUT NOISE VOLTAGE F, = O.OIHz to 10Hz Fo = 10kHz POWER SUPPLY Rated Voltage Range Quiescent Current 0.01 ±10 0.001 50 0.2 1 10 ±Vcc = 6V to 18V DYNAMIC RESPONSE Gain Bandwidth Full Power BW Slew Rate Settling Time: 0.1 % 0.01% 0.01% 10 0.005 -4 0.0002 . TYP MIN 10 110 ±1 ±11 94 T... == TMIN to TMAX RTI141 Common .. mode Rejection l31 MAX 0.01 +401-10 1000 To common Stable operation INPUT Impedance INA106BM TYP pV "V/oC pVN "Vlmo "Vp-p nVIy'Hz MHz .kHz Yips ps ps ps 0 -25 -40 ·· rnA +70 +85 +85 °C °C °C V V· NOTES: (1) Connected as difference amplifier (see Figure 4). (2) Nonlinearity is the maximum peak deviation from the best-fit straight line as a percent oflull-scale peak-to-peak output. (3) With zero source impedance (see Maintaining CMR section). (4) Includes effects of amplifier's input bias and offset currents. (5) Includes effects of amplifier's input current noise anp thermal noise contribution of resistor network. MECHANICAL TO-99 Package "P" Package-Plastic DIP NOTE: Leads in true position within 0.01" (0.25 mm) R at MMC at seating plane. !t=~::fl L.JL J ~I!!!! I C FJ ! I Seatingm Plane 0 DIM A B C 0 E ~ ~~l1=~-' ~ ··i G :'~ g Pin numbers shown for reference only. Numbers are not marked on package. F G H J K L M N INCHES MIN MAX MILLIMETERS MIN MAX .335 .370 .305 .335 .165 .185 .016 .021 .010 .040 .010 .040 .200 BASIC .028 .034 .029 .045 .500 .110 .160 45' BASIC .095 .105 8.51 9:40 7.75 8.51 4.19 4.70 0.41 0.53 0.25 1.02 0.25 1.02 5.08 BASIC 0.71 0.86 0.74 1.14 12.7 2.78 4.06 45 0 BASIC 2.41 2.67 ==:U P F Pln1--i DIM Cd "~1 ~F.L Seating Pls.ne 46 NOTE: Leads in true position within 0.01" (0.25mm) Rat MMC at sea~ing plane. Pin material and plating composition conform to Method 2003 (solderability) of MILSTD-B83 (except paragraph 3.2). B, C G INCHES MIN MAX MILLIMETERS MIN MAX .355 .400 .340 .385 .230 .290 .200 .250 .120 .200 .015 .023 .030 .070 .100 BASIC .025 .050 .008 .015 .070 .160 .300 BASIC 9.02 10.16 8.64 9.78 5.84 7.37 5.08 6.35 3.05 5.08 0.38 0.58 0.76 1.78 2.54 BASIC 0.64 1.27 0.20 0.38 1.78 3.81 .010 .030 .025 .050 0.25 0.64 7.63 BASIC M 0.76 1.27 PIN DESIGNATIONS PIN DESIGNATIONS TOPYIEW TOPYIEW PLASTIC DIP INA106KP Reference 1 -In 2 +In ~8 ..... j~ "I ~7 +Vee ~6 Output 5 Sense -Vee 4 INA106AM INA106BM -Yee Case connected to -VCI:. internally. Make no connection. ORDERING INFORMATION Basic Model Number Perlt)rman~e NA _ _ _ _ _ _'=-r-_ ...J106 ~ ABSOLUTE MAXIMUM RATINGS Supply .................................................... ±18V Input Voltage Range •..••.......•..............•......... ±Vcc Operating Temperature Range: M .......•. -SS'C to +12S'C P ........... -40'C to +8S'C Storage Temperature Range .•.....••...... -6S'C to +12S'C . Lead Temperature (soldering 10 seconds) .........•. +300'C Output Short Circuit to Common ••.•.•...•.•..•. Continuous TI I IX X GrE!de A, B: -2S'C to +8S'C K: O'C to +70'C No Internal Connection Package Code _ _ _ _ _ _ _ _ _ _ _ _ _-1. M: TO-99 metal can P: 8-pin mini plastic DIP TYPICAL PERFORMANCE CURVES T. =25·C. ±Vee =15V unless otherwise noted. SMALL SIGNAL RESPONSE (No Load) STEP RESPONSE o 4 8 o 16 Time (PO) ~ A = 20dB. 3Vrms, 10ka load ill z -116 -126 t---+-O~-+---1--+---i -106 "-106 I----''d---+-''~--+--+--_l E -100 .,-96 E II: II: + ~ -86 I..I~ c J: 0.01 I- 10 Frequency (kHz) 8M ....... P.M. ~ -86 -76 30kHz low p ass filtered 1 CMR VS FREQUENCY II: 1-:---I--..3o,.......--+~ Inverting 0.001 10 POWER SUPPLY REJECTION tt '0 5 Time (PO) -146 .-_--.---..,;V;,::S:.,;F...R.:.;E;,::Q;,::U;,::E:;.N.:.;C:.,;Y_-r-_--, I Noninverting"" 0.1 a 10 Time (PO) TOTAL HARMONIC DISTORTION AND NOISE VS FREQUENCY = 5 SMALL SIGNAL RESPONSE (RLOAD = 000, CLOAD = l000pF) ~6 100 10 Frequency (Hz) 47 I(P ~ \ \ lk lOa 10k Frequency (Hz) \ lOOk TYPICAL PERFORMANCE CURVES (CO NT) T. = +25°C, Vee = ±15VDC unless otherWise noted. MAXIMUM VOUT VS MAXIMUM You, VS lou, (Negative Swing) lOUT (positive Swing) 17.5 IVa 15 12.5 = "'= ~ 10 I - - B > 7.5 =~18VI t-115V -17.5 - Va - ±18V -15 -12.5 I - - -VSI ±lr -L=Lv ~ -10 - J - Vs ±12V -7.5 -5 5 Va = ±5V 2.5 o S 12 18 -2.5 24 30 36 - I- Vi-±r -2 4 10 S 12 -lOUT (rnA) lOUT (rnA) DISCUSSION OF PERFORMANCE BASIC POWER SUPPLY AND SIGNAL CONNECTIONS OFFSET ADJUSTMENT Figure I shows the proper connections for power supply and signal. Supplies should be decoupled with I/LF tantalum capacitors as c.lose to the amplifier as possible. To avoid gain and CMR errors introduced by the external circuit, connect grounds as indicated, being sure to minimize ground resistance. Figure 2 shows the offset adjustment circuit for the INAI06. This circuit will allow ±3mV of adjustment and will not affect the gain accuracy or CMR. r-----------l I INA10S I Is R, R. I I I I I I 100 R, 6VIN R, I I I t I I I is Eo 1 I I I 3: E. • I 21 I R, 1 R, : +15V L_ ---1.-_-_-_'i.,9;..,.k~;;------J_!100kCl VOUT l Eo = E. - E1 Offset Adjustment Range = ±3mV Ve 1000 -15V FIGURE 2. Offset Adjustment. FIGURE I. Basic Power Supply and Signal Connections. MAINTAINING COMMON-MODE REJECTION Two factors are important iJ;l maintaining high CMR: (I) resistor matching and tracking (the internal INAI06 circuitry does this for the user) and (2) source impedance including it~ imbalance. 48 Referring to Figure I, the CMR depends upon the match of the internal R4/R3 ratio to the RI/R2 ratio. A CMR of 106dB requires resistor matching of 0.005%. To maintain 100dB, minimum CMR to +8S oC, the resistor TCR tracking must be better than 2ppm/ DC. These accuracies are difficult and expensive to reliably achieve with discrete components. Any source impedance adds directly to the input resistors, RI and R3, and will degrade DC and AC CMR. Likewise any wiring resistance adds directly to any of the precision difference resistors. A resistance of 0.50 (0.005% of 10kO) will degrade the I06dB CMR of the INAI06; SO will degrade the CMR to 86dB. When input filters are used preceding an instrumentation amplifier, care should also be taken to match RCs on the two input lines. For example, mismatched input filters for high frequencies will reduce the CMR at lower frequencies, e.g, 60Hz. Differential filters will not degrade ACCMR. Adding as the root of the sums squared, END = 193nV VHZ RTI, with A = 10, ENI = 19.3nV/VHZ For example, END within a 600kHz BW = O.lsmVRMs = 0.9mVp-p with a crest factor of 6 (statistically includes 99.7% of all noise peak occurrences) This is the noise due to the resist~rs alone. It is included in the noise specification of the INAI06. APPUCATIONS CIRCUITS The INAI06 is ideally suited for a wide range of circuit functions. The following figures show many applications circuits. I RESISTOR NOISE IN THE INA106 Figure 3 shows the model for calculating resist.or TlOisp, i.n the INAI06. Resistors ~ave Johnson noise resulting from thermal agitation. The expression for this noise is: Where: K = T = R = B= r----------• R, INA106 R~· ., I -I -In E, ERMs = v'4KTRB Boltzman's constant (J/oK) Absolute temperature (OK) Resistance (0) Bandwidth (Hz) R, I I I I I I I R, 100kO I I I 31 +In E, I" I~ 10kO I 16 I I R, Out Eo 11 10kO 100kO IL _ ______ _ _ _JI Eo = 10 (E. - E, ) Gain Error = 0.005% CMR= 106dB Nonlinearity = 0.0002% FIGURE 4A. Precision Difference Amplifier. >--_--oENO R,II R. E, EN, o--'lM'-=7-_""'-----'W.--~~M--i Gain 100 10kO Adjust Eo FIGURE 3. Resistor Noise ModeL At room temperature, this noise becomes: EN = 1.3- 10 The three noise sources in Figure 2 are: v'R 100 (V/VHZ) To eliminate adjustment interactions, first adjust gain with E. grounded. ENI = 1.3- 10 (R2/RI) y'R; EN2 = 1.3- 10 y'R; EN3 = FIGURE 4B. Difference Amplifier With Gain And CMR Adjust. 1.3- 10 (1 + R2/R 1) v'R311R4 49 -, r-----------, 2', :5 ,, , ,, I R. , R. INA106 15 I 1 I 16 > .........1.........---0 ~ 31 I I 3' 1 R. I 10kCl IL ______ l~kn --1 Eo = 10 (1 + 2R./R,) (Et - E,) Eo=10E, Gain Error,:, 0.01% max For the ultimate performance high gain instrumentaUon amplifler,the INA106 can be combined with state-of-the-art op amps. For low source Impedance applications, an input stage using OPA37s will give the best low noise, offset, and temperature drift. Alsourca Impedances' above about10kCl, the bias current noise of the OPA37 reacUng with the input impedance begins to dominate the noise. For theM appllcalions, using an OPA111 or a dual OPA2111 FET Input op amp will provide 1000r noise. For an electrometer grade lA, use the OPA128. (See tabla below.) FIGURE 7. Precision Noninverting Amplifier with Gain of 10. Using the INA108 for the difference amplifier also exlands the input common-mode renge of the instrumentation amplifier to ±1OV. A, conventional IA with a unlty-galn differenca amplifier has an input common-mode range limited to ±5V for an output swing of ±10V. This is because a unlty-galn diffentnce amp needs ±5Y at the Input for 10Y at the output, allowing only 5Y additional for common mode. OPA37A OPA111B OPA128LM >-~-O~ NoM at 111Hz R, R. (kCl) Gain (VIV) CMRR (Cl) (dB) Ib (pA) (nY/v'Hzj 50.5 202 202 2.5 10 10 1000 1000 1000 128 110 118 40000 ,1 0.075 4 10 ~=11e, 38 Gain Error = 0.01% maximum Gain Drift = -4ppmrC FIGURE S. Precision Instrumentation Amplifier. FIGURE 8. Precision Noninverting Amplifier with Gain of n. r-------- -- ---, 2 , INA106 ,5 Elo-~~~~--.-----~~----~-, 1 I , 1 1 1 I , , ~~~O~ 1 1 I ,I ,6 I , 1 I I I L__ , >+16~-o~ I R. :.... _______.J 10kCl 1 I L __________ .JI E·o-~I~~--- ~=~10E, Gain Error = 0.01% maximum Nonlinearity = 0.001% maximum Gain Drift = -4ppm/'C Eo=E,+10Et FIGURE 6. Precision Inverting Amplifier with Gain of FIGURE 9, Precision Summing Amplifier with Weighted Inputs. -10. 50 r"R;- INAi"06- R, - INA106 51 100kn I I I I I I ;-.......;-;1:-<':--00 Eo E; 16 I I 10kn L _______ J o--+-;y..Iv--9-1 loon ~+'~~~~-~Eo 16 I I 10 I I R, -, 10kO! 2 I .¢. 0.22pF 3 Eo= E, Gain =1/10 Also: Gain = -1/10 by grounding R, and driving R, Gain = 1110 differential driving both R, and R,. This circuit follows an 1111 divider with a gain of 11 for an overall gain of unity. With an 11/1 divider, the input signal can exceed 100V without exceeding the oJ? amp common-mode range. The 1000, lOn, 0.22pF network on the output assures stability by inserting a 70kHz zero and 700kHz pole to decrease the loop gain by 10 at 700kHz. With the output taken at the junction of the loon and Ion resistors, gain accuracy is maintained, and noise gain at the output remains at unity. For a 10V output swing, the load should be limited to 10kO since the loon resistor acts as a voltage divider with the load. AlSO me large signal oanawiatn will De limited DY tile ability oj tile FIGURE lO. Voltage Follower with Input Protection. amplifier to slew into the O.22#F capacitor. Assuming 10mA output r- - -INAios - --, 2110kn R, current and a 20Vp-p output Signal, the full power bandwidth will be 1.0kHz. Since the circuit is a 1011 attenuator, this would assume a 200Vp-p Input signal. With a 20Vp-p Input signal, the bandwidth would be 10kHz. C, i5 100pF I I I 16 I ltr.. Eo FIGURE 12. Precision Attenuator. Gain = 20dB I I I I I 176n I R, I 100kn _______ .JI 1,;", :>-L~----~_()eo FIGURE II. Differential-Input, Low-Impedance, Microphone Preamplifier (20dB gain). 80=02-91 Common-Mode Range = ±100V 500n CMR Adjust (ISSn Nominal) , The addition of two external resistors and a pot turns the INA1061nto a unity-gain difference amplifier with input common-mode range exceeding ±100V. The circuit requires CMR adjustment and has a 2% gain accuracy. Better gain accuracy Is difficult to obtain, since CMR and gain adjustments interact. See Figure 14. FIGURE 13, ±lOOV Common-Mode Range Difference Amplifier. 51 1.13kO A. , ...--- . I--+-M~ L __ .J120kO 390kO :>~--------~~----~~eo 'Optional Gain Adjust 90=e2-81 Common-Mode Aange = ±100V The add Ilion of an op amp to circuit of Figure 13 can eliminate the need for CMA and gain adjustments. CMA will be 20dB lower than that of the INA106. which Is specified in a gain of 10. Gain accuracy is set strictly by the A•• A, ratio and the Inilial gain accuracy of the INA106 (A = 1 + A./A.±.Ol%). CMA can be adjusted by adding a 100 resistor In series with A, (pin 2) and a 200 pot In series with A, (pin 2). Gain and CMR adjustments do not Interact. FIGURE 14. ±lOOV Common-Mode Range 'Difference Amplifier Requiring No Adjustments. 52 BURR-BROWN® INA110 IElElI Fast-Settling FET-Input Very High Accuracy INSTRUMENTATION AMPLIFIER FEATURES. APPLICATIONS • • • • • • • • • Fast scanning rate multiplexed Input data acquisition system amplltier • Fast differential pulse amplifier • High speed. low drift gain block • Amplification of low level signals from high impedance sources and sensors ct Instrumentation amplifier with input low pass filtering using large series resistors • Instrumentation amplifier with overvoltage input protection using large series resistors • Amplification of signals from strain gauges. thermocouples. andRTDs LOW BIAS CURRENT: 50pA. max FAST SETTLING: 4J.1s to 0.01% HIGH CMR: I06dB. min; 90dB at 10kHz CONVENIENT INTERNAL GAINS: 1.10.100.200.500 VERY-LOW GAIN DRIFT: 10 to 50ppm/oC LOW OFFSET DRIFT: 2J.1V/oC LOW COST PINOUT COMPATIBLE WITH A0524 AND A0624. allowing upgrading of many existing applications DESCRIPTION The INAIIO is a monolithic FET input instrumentation amplifier with a maximum bias current of 50pA. The circuit provides fast settling of 41'S to 0.01%. Laser trimming guarantees exceptionally good DC performance. Voltage noise is low, and current noise is virtually zero. Internal gain set resistors guarantee high gain accuracy and low gain drift . . Gains of 1, 10, 100, 200, and 500 are provided. The inputs are inherently protected by P-channel FETs on each input. Differential and commonmode voltages should be limited to ±Vcc. When severe overvoltage exists, use diode clamps as shown in the application section. The INAIIO is ideally suited for applications requiring large input resistors for overvoltage protection or filtering. Input signals from high source impedances can easily be handled without degrading DC performance. Fast settling for rapid scanning data acquisition systems is now achievable with one component, the INAIIO. Input +Vcc -Vee Offset Adjust Output Offset Adjust • Connect to Ro for desired gain. International Airport Industrial Park· P.O. Box 11400 . Tucson. Arizona B5734 • Tel. 1602) 746·11 11 . Twx: 9t0-952·1I 11 . Cabte: BBRCORP . Telex: 66·6491 PDS-645A 53 SPECIFICATIONS ELECTRICAL At +2S'C, ±Vcc = ISVDC, RL = 2kCl unless otherwise noted. INAll0AG PARAMETER CONDITIONS MIN INAll0,BGISG TYP MAX MIN GAIN Range 01 Gain Gain Equation l11 Gain Error, DC: G = 1 G=10 G=100 G=200 G=SOO Gain Temp. Coefficient: G = 1 G=10 G=I00 G =200 G =,SOO Nonlinearity, DC: G = 1 G=10 G=I00 G=200 G=SOO 1 I I 0.002 0.Q1 0.02 0.04 0.1 ±3 ±4 ±6 ±10 ±2S ±0.001 ±O.002 ±O.OO4 ±0.008 ±O.OI 800 0.04 0.1 0.2 0.4 1.0 ±20 ±20 ±40 ±eo ,±100 ±O.OI ±0.01 ±O.02 ±0.02 ±O.O4 OUTPUT Voltage, RL = 2kCl Current Short-Circuit Current Capacitive Load Overtemp Over temp ±10 ±5 Stability ±(100+ l000/G) · INA110KPIKU . · I I G = 1 + I40KI(R. + SOCl)] 0.02 0.005 O.OS 0.01 0.1 0.02 0.2 0.05 O.S ±10' ±10 ±2 ±3 ±20 ±S ±30 ±10 ±SO ±O.OOOS ±O.OO5 ±O.OOI ±0.005 ±0.Q1 ±O.002 ±O.OO3 ±0.01 ±O.OOS ±O.O2 · · ±(SO+ 8OO/G) ±(SOO+ Sooo/G) ±(2S0+ 3000/G) U BIAS CURRENT Initial Bias Current Initial Offset Current Impedance: Differential Common-Mode VOLTAGE RANGE Range, Linear Response CMR with lkCl Source Imbalance: G=1 G=10 G=100 G=200 G=500 Vcc= ±6V to ±18V Each input V1N ±(2+ 20/G) ±(4+ 60/G) ±(S+ l00/G) ±(30+ 3OO/G) ±(1+ 10/G) ±(2+ 3OIG) ±(2+ SO/G) ±(10+ 180/G) 20 2 5Xl012 116 2Xl012 111 100 SO 10 1 SO 25 DC DC DC DC DC ±10 ±12 70 87 100 100 100 90 104 110 110 110 60 98 106 106 106 65 8 -3dB Vou,=±10V, RL = 2kCl G =1 to 100 Vo=20V step 2.5 2.5 470 240 100 190 12 100 112 116 116 116 ·· · ·· ·· ·· · ·· ·· ·· ·· · 10 1 1.8 DYNAMIC RESPONSE Slew Rate Settling Time: O.I%,G=1 G=10 G= 100 G =200 G=500 ·· Diff. = OVI3) NOISE, Input'" Voltage, 10 = 10kHz Is = O.IHz to 10Hz Current, 10 = 10kHz NOISE, Output'" Voltage, 10 = 10kHz Is = O.IHz to 10Hz Small Signal: G = 1 G=10 G=100 G =200 G=500 Full Power I TVP I MAX I ·· ·· ··· ··· ·· ·· · ·· •• ·• · · · ··· · · · ·· ·· ·· ·· · · ·· · ·· ·· ··• ·· ·· ·· · ··· ·· ·· ·· · 270 17 4 2 3 5 11 54 · UNITS VN VN % % % % % pprn/'C pprnl'C pprn/'C ppml"C ~~;~ %oIFS %ofFS %ofFS %ofFS V mA mA pF · ±(200+ ±(looo+ 2OOO/G) ,SOOO/G) vs Temperature vs Supply MIN MAX ·· ·· ·· ±12.7 ±2S ±2S SOOO INPUT OFFSET VOLTAGE'2I Initial Offset: G, P I TVP pV pV pVI"C · ·· pVN pA pA ClllpF ClllpF V dB dB dB dB dB nVl,,(HZ pVp-p fAl,,(HZ nVl,,(HZ pVp-p MHz MHz kHz kHz kHz kHz VIpS pS pS pS ps pS ELECTRICAL (CO NT) INAll0BG/SG INAll0AG PARAMETER Settling Time: 0.01%, G = 1 G=10 G = lOa G = 200 G = 500 Overload Recovery4fil CONDITIONS MIN Vo = 20V step 50% overdrive TYP MAX 5 3 4 7 16 I 12.5 7.5 7.5 12.5 25 POWER SUPPLY Rated Voltage Voltage Range Quiescent Current ±15 ±6 Vo=OV ±18 ±4.5 ±3.0 TEMPERATURE RANGE Specification: A. B, K S Operation Storage 9J A -25 +85 MIN TYP +125 +150 100 TYP MIN ·· ·· ·· ·· ·· · MAX UNITS · ··· · ps ps ps ps ps ps · · · ·· ·· . · .. · · ·· · ·· · -55 -55 -65 INAll0KP/KU MAX a +70 -25 -40 +85 +85 V V rnA 'c 'c 'c +125 'C 'C/W • Same as INAll0AG. NOTES: II) Gains other than 1, la, lOa, 200. and 500 can be set by adding an external resistor, Ro, between pin 3 and pins 11,12, and 16. Gain accuracy is a function of RG and the internal resistors which have a ±20% tolerance with 20ppm/c C drift. (2) Adjustable to zero. (3) For differential input voltage other than zero, see Typical Performance Curves. (4) VNOISE RTI :;; ..jV~ INPUT + (VN OUTPuT/Gain)2. (5). Time required for output to return from saturation to linear operation following the removal of an input overdrive voltage. ORDERING INFORMATION PIN CONFIGURATION INA110 Basic Model Number _ _ _ _=r---' T Performance Grade Code A. B: -25°C to +85°C S: -55°C to +125°C K: DOC to +7DoC - X X -In +In RG Input Offset Adjust Input Offset Adjust Reference Package Code G: 16-Pin Hermetic DIP P: 16-Pin Plastic DIP U: 16-Pin Small Outline Surface Mount I 16 2 3 4 5 14 13 12 IS 6 II -Vee 7 10 +Vcc B 9 X200 Output Offset Adjust Oulput Offset Adjust Xl0 Xl00 X500 Output Sense Output ABSOLUTE· MAXIMUM RATINGS Supply ....................................................... ±18V Input voltage Range ....................................... ±Vcc bperating Temperature Range: G .......... -55°C to +125°C P, U . . . . . . .. -25°C to +85°C Storage Temperature Range: G ............ -65°C to +150°C P, U .......... -40°C to +85°C Lead Temperature (soldering lOS): G, P .............. +300°C (soldering 3s): U ................. +260°C Output Short-Circuit Duration ...... Continuous to Common MECHANICAL NOTE: Leads in true position within .010" (.25mm) R at seating plane. Pin numbers shown for reference only. Numbers are not marked on package. DIM A C G M 55 INCHES MIN MAX .790 .810 .105 .015 .170 .021 .048 .060 .100 BASIC .030 .070 .OOB .012 .120 .240 .300 BASIC 10' .025 .060 MILLIMETERS MIN MAX 20.07 20.57 2.67 4.32 0.38 0.53 1.22 1.52 2.54 BASIC 0.76 1.78 0.20 0.30 3.05 6.10 7.62 BASIC 10' 0.64 1.52 Small Outline Surface Mount A A, NOTE: Leads in true position within 0.010" (.2Smm) Rat MMC at seating plane. DIM A A, B B, C D G H J L M N INCHES MIN MAX .400 .416 .388 .412 .302 .286 .268 .286 ,109 .093 .015 .020 .050 BASIC .022 .038 .012 .008 .391 .421 5° TYP .000 .012 MILLIMETERS MIN MAX 10.16 10.57 9.86 10.46 7.26 7.67 6.81 7.26 2.36 2.77 0.38 0.51 1.27 BASIC 0.56 0.97 0.20 0.30 9.93 10.69 5' TYP 0.00 0.30 (1) Performance grade identifier box for small outline surface mount. Blank indicates K grade. Part is marked INA110U. Plastic DIP t-:,~ r"l r'1 r"l r p/ ~ / NOTE: Leads in true position within .010" (.2Smm) Rat MMC at seating plane. =nB~' ! :J 'v''v''v'V'v' V Pin 1 L---.J' .... Flo- ~ " -.j ..1\.-J --M TI~T~ G -1.-0 .... ~ H . • PINS: Pin material and plating composition conform to method 2003 (solderability) of MIL-STD883 (except paragraph 3.2). CASE: Plastic DIM A A, B B, C D F G H J K L M N P Seating Plane 56 INCHES MAX MIN .740 .800 .785 .725 .290 .230 .250 .200 .120 .200 .015 .023 .030 .070 .100 BASIC 0.02 0.05 .008 .015 .070 .150 .300 BASIC 0' IS' .010 .030 .050 .025 MILLIMETERS MAX MIN 18.80 20.32 18.42 19.94 7.38 5.85 6.38 5.09 5.09 3.05 0.38 0.59 0.76 1.78 2.548ASIC 1.27 0.51 0.20 0.38 1.78 3.82 7.83 BASIC IS' 0' 0.25 0.76 0.84' 1.27· BURR-BROWN® IElElI t~! .:::. INA117 ~~ , r: J\.I\f ADVANCE INFORMATION Subject to C~ange Precision High Common-Mode Voltage Unity-Gain DIFFERENTIAL AMPLIFIER FEATURES APPLICATIONS • HIGH COMMON·MODE RANGE: ±200VDC OR AC • AC OR DC POWER LINE MONITORING DI:AU' . . .nil" • • • • • ",,,ntlnll"II" uu ........ u .. '" UNITY GAIN: 0.02% GAIN ERROR. max EXCELLENT NONLINEARITY: 0.001 % max HIGH CMR: 86dB. min 8·PIN TO·99 OR PLASTIC DIP LOW COST • INDUSTRIAL PROCESS CONTROL • GROUND BREAKER • INDUSTRIAL DATA ACQUISITION SYSTEMS-INPUT BUFFER WITH OVER·VOLTAGE PROTECTION DESCRIPTION The INA1l7 is a precision unity-g/!in differential amplifier offering an extremely high common-mode input voltage range. As a monolithic circuit, it offers high reliability at low cost. The INA1l7 consists of a premium grade operational amplifier with an onchip precision resistor network. In instances where an isolation amplifier is used for its inherent high common-mope capabilities and not for galvanic isolation, the INAl17 may be substituted at substantially lower cost, especially since no costly isolation power supply is needed. The INAIl7 is completely self-contained and offers the user a highly versatile function. No adjustments to gain, offset or CMR are needed. This provides three important advantages: lower initial design engineering time, lower manufacturing assembly time and cost, and easy, cost-effective field repair of a precision circuit. +Vcc -Vee Reference B Compensation Inlematlonal Airport Industrial Park· P.O. Box 11400· Tucson. Arizona B5734· Tel. 16021 746-1111 • Twx: 9111-952·1111 • Cable: BBRCORp· Telex: 66-6491 PDS·748 57 SPECIFICATIONS ELECTRICAL At +25°C, Vee = ±15V unh;ss otherwise noted. INA117AM PARAMETER CONDITIONS MIN MAX 1 0.01 2 0.0002 0.05 10 0.001 MIN OUTPUT Rated Voltage Rated Current Impedance Current Limit Capacitive Load 10 = +20mA, -SmA Eo=10V 10.0 +20, -5 Stable operation INPUT Impedance Differential 800 400 Common-mode Voltage Range Differential Common-mode, continuous Common-mOde Rejection l31 vs Temperature: DC AC,60Hz TA = TUIN to TMAX vs Temperature TA :;:::: Supply vsTime ±Vcc = 5V to 18V OUTPUT NOISE VOLTAGE Fa = 0.01 Hz to 10Hz fo = 10kHz DYNAMIC RESPONSE Gain Bandwidth Full Power Bandwidth Slew Rate Settling Time: 0.1% 0.01% 0.01% POWER SUPPLY Rated Voltage Range Quiescerit Current TEMPERATURE RANGE Specification Operation Storage 80 75 80 TMIN to TMA]( 74 120 8.5 90 200 · 1000 40 80 RTO'" 25 550 -3dB Vo=20Vp-p 200 30 2 Vo= 10V step Vo= 10V step VCM = 10V step. V01FF = OV 2.6 6.5 10 .4.5 ±15 Derated performance VOUT=OV ±5 1.5 -25 -55 ±18 2.0 +85 +125 +150 -65 .. MIN 0.02 86 80 RT0141 OFFSET VOLTAGE Initial YS ±10 ±200 74 66 66 MAX ·· · · ·· ·· · · 12 0.01 +49, -13 1000 To common TYP ·· · ·· GAIN Initial 111 Error vs Temperature Noniineari ty l2J INA117P INA117BM TYP ·· 94 90 94 ·· ·· ·· 500 20 · TYP MAX ·· · ·· · · · ·· · ·· ·· · ·· · ·· ·· · ··· ·· ·· ·· ·· ·· · · · ·· ·· · ·· ·· ·· ·· · · 0 -25 -40 +70 +85 +85 UNITS VN % ppmloC % V mA Cl mA pF kCl kCl V VDC,ACpk dB dB dB pV pV/·C pVN pV/mo .pVP-P nV/VHz kHz kHz Vips ps ps ps V V mA ·C ·C ·C 'Speclflcallon same as for INA117AM. NOTES: (1) Connected as difference amplifier. (2) Nonlinearity is the maximum peak deviation flom the best-fit straight line as a percent of full-scale peak-topeak outpu\. (3) With zero source impedance (see Offset and CMR section). (4) Includes effects of amplifier's input bias and offset currents. (5) Includes effects of amplifier's input current noise and thermal noise contribution of resistor network. 58 MECHANICAL TO-99 Packago DIM A B C D E F G H J K L M NOTE: Leads in true position within 0.010" (0.25mm) R at MMC at seating plane. INCHES MIN MAX .335 .370 .305 .335 .165 .185 .016 .021 .010 .040 .010 .040 .200 BASIC .028 .034 .029 .045 .500 ,110 .160 MILLIMETERS MIN MAX 8.51 9.40 7.75 8.51 4.19 4.70 0.41 0.53 0.25 1.02 0.25 1.02 5.08 BASIC 0.71 0.86 0.74 1.14 12.7 2.79 4.06 45° BASIC 45° BAsrC 2,41 2.67 .095 N .105 "P" Pacltoga-Plastic DIP DIM A A, B B, C D H G H ~ Jlo G J K L M N MILLIMETERS MIN MAX 9.02 10.16 9.78 8.64 7.37 5.84 6.35 5.08 3.05 5.08 0.38 0.58 V./U ,., ... 2.54 BASIC 1.27 0.64 0.20 0.38 1.78 3.81 7.63 BASIC 0' IS' 0.25 0.78 0.64 1.27 ~~CT:::: !.~::~~!:-; !::.!::: position within 0.01" (0.25mm) R at MMC at seating plane. Pin material and plating composition conform to method 2003 (solderability) of MIL-STO-883 (except paragraph 3.2) . Seating Plane PIN DESIGNATIONS ·TopVlew INCHES MIN MAX .355 .400 .385 .340 .290 .230 .250 .200 .120 .200 .015 .023 .u;u .Wii .100 BASIC .060 .025 .008 .015 .070 .160 .300 BASIC 0' IS' .010 .030 .025 .050 ORDERING INFORMATION T INA117 X X Basic Model Number _ _ _ _ _ _ _ _ _ Molal TO-9!1-INA117AM, Dr.! :r__ Tab Performance Grade - - - - - - - - - - - - - - ' A, B: -2S·C to +8S·C None: O·C to +70·C Pacl -~---<--oOutPut L________ I~~_J Rs) + 1] FIGURE 4. Simplified Equivalent Circuit Diagram. 61 APPLICATIONS CIRCUITS The INA1l7 is ideally suited for a wide range of circuit functions. The following figures show many applications circuits. BATTERY CELL MONITOR Batteries are often charged in series. The INA1l7 is ideal for directly monitoring the condition of each cell. Operating range is up to ±200V, and differential fault conditions in this range will not damage the amplifier. Since the INAI17 requires no isolated front-end power, cost per cell is very low. . NE2H NE2H +200V max FIGURE 6. 4-20mA Current Receiver. INAl17 LEAKAGE CURRENT TEST MONITOR When the return path is not independently available, leakage current must be measured in series with the input. When the 400kfl input impedance of the INA1l7 is too low, a buffer amplifier may be added to the front end. In this example, an OPA128 electrometer-grade operational amplifier is used. The lkfl and 9kfl feedback resistors set a noninverting gain of 10. Bias current of the amplifier is less than 75fA. The diodes and lOOkfl resistor protect the amplifier from 200V short circuit fault conditions. Since common-mode rejection is the ratio of commonmode gain to differential gain, CMR is boosted. The 20dB gain ofthe OPA128 added to the 86dB CMR ofthe INAll7 results in a total CMR of lO6dB miuimum. 80= Cell VoltSge -200V max FIGURE 5. Battery Cell Monitor. 100MO INAl17 1-------, I Vee I eo = h. X 10V (lV1nA) FIGURE 7. Leakage Current Monitor. 62 currents II and 1, across sense resistors RI and R,. Since the INA1I7 has a ±2DOV CMV range, the inputs (pins 2 and 3) can be tied to ±Vcc as long as the differential input is less than IOV. If RI = R, = R then el = II X R e, = -I, X R and el + e, = lLOAD X R A, is an IN AID5 difference amplifier connected as a noninverting summing amplifier with a gain of 5. The accurate matching of the two 25kO input resistors makes a very accurate summing amplifier. eo = 5 (el + e,) = 5 (ILOAD X R) since R = 0.20 eo = hOAD (lV/A) BRIDGE AMPLIFIER LOAD CURRENT MONITOR Bridge amplifiers are popular because they double the voltage swing possible across the load with any given power supply. In this circuit AI and A, form a bridge amplifier driving a load. AI is connected as a follower and A, as an inverter. At low frequencies, a sense resistor could be inserted in series with the load and an instrumentation amplifier used to directly monitor the load current. Under high frequency or transient conditions, CMR errors limit the accuracy of this approach. An alternate approach is to measure the power amplifier supply currents. To understand how it works, notice that since essentially no current flows in the amplifier inputs, lLOAD = II - h. A3 and A. are INA1I7s used to monitor AI supply PoiNer Amplifier Supply (2DDV max) 1"-"'\ + >>------- 12V 30 12-bit resolution. 1LSB, 20VFS 16-bit resolution, lLSB, 20VFS 50 16 74 96 ·· ··· · · 70 5 0.5 100 40 vs Supplies vs Load Current Output Short Circuit Current +5.00 +5.005 ±5 10 20 400 ' 1000 +5 30 -0.1 6 69 · · · · ·· ·· · ·· ·· · · · · ··· · ·· ·· · ··· ·· · · · · Cl pF /1Arms ±0.025 +12 +4.995 · dB /1VrmslV dB pVrms/V dB /1VDCIV ±0.02 10000 No Load. · ±0.Q75 +10 vs Temperature ·· ··· ·· ·· ·· VIV % FSR ppm FSR/'C %FSR -10 Vo; ±10V Yo; ±10V Vo; -10V to +10V C,;C,;O Vrms Vpk ±25 -12 ±5 9 f ; 0.5MHz to 1.5MHz Vrms VDC Vrms VDC ±12 5 Current Drive UNITS ±0.25 ±50 -10 Rated Operation Capacitive MAX ±0.1 ±20 ±0.04 3.7 -3.7 Resistance TYP ··· · .:-Rated Continuous, 60Hz DC Barrier Resistance Barrier Capacitance Leakage Current TYP 14 · ·· mV mVlV mVIV V kCl pF V V mA mA mVp-p Cl pF /1S /1Vp-p /1V1vHz dB dB kHz kHz VI/1s /1s % VDC ppm/'C /1V1V /1V!mA mA rnA ELECTRICAL (CONT). IS01Q2, IS0108 PARAMETER CONDITIONS POWER SUPPLIES Rated Voltage. ±VCC1. ±V= Voltage Range Quiescent Current: +VCC1 MIN TVP IS01028, IS01088 MAX MIN ±15 Rated Performance ±10 No Load +11 :-9 -VCC1 +25 -15 300 600 +Vce. -Vcca Power Dissipation: ±VCC1 ±V= TEMPERATURE RANGE Specification Operatlng l91 Storage Thermal Resistance. BJA -25 -55 -65 ±20 +15 -12 +33 -20 400 BOO +B5 +125 +150 40 TVP MAX UNITS · ·· ·· ·· ·· ·· ·· · · · ·· · · · · V V mA mA mA mA mW mW 'C 'C 'C 'CIW • Same as IS0102. iS0108. NOTES: (1) 100% tested at rated continuous for 1 min~te. (2) Isolation-mode rejection is the ratio of the change in output voitage to a change in isoiation barrier voltage. It is a function of frequency as shown in the Typicai Performance Curves. This is specified for barrier voitage siew rates n'ot exceeding l00VlpS. (3) Adjustable to zeno. FSR Full Scale Range 20V. (4) Nonlinearity is the peak deviation of the output voltage from the best fit straight line. it is expnsssed as the ratio of deviation to FSR. (5) Power Suppiy Rejection = change in Vos/20V supply change. • (6) Ripple is the residual component of the barrier carrier frequency generated internally. (7) Dynamic Range = FSR/(Voltage Spectral Noise Density X square root of User Bandwidth). (B) Overshoot can be eliminated by band-limiting. (9) See Typical Performance Curve E for limitations. = = ABSOLUTE MAXIMUM RATINGS ORDERING INFORMATION Supply Without Damage ........................ , . .. ±20V Input Voltage Range ................................ ±50V Continuous Isolation Voltage Across Barrier IS0102 ................................ :.;..... 1500Vrms IS0106 ........................................ 3500Vrms Junction Temperature ............................. +160·C Storage Temperature Range .......... -65·C to +150·C Lead Temperature (soldering 10 seconds) ..... +300·C Amplifier and Reference Output Short Circuit Duration...... Continuous to Common IS010X X Basic model number----------=r--, ...J IS0102, 150106 Performance grade ----------'-----1 No designation, B: -25·C to +85·C I T. MECHANICAL 180102 24-Pin Double-Wide Hermetic DIP 124·23 A 101 [OJ ~ J U l.G L-J~ NOTE: Leads in true position within 0.01" (0.25mm) R at MMC at seating plane. CASE: Ceramic WEIGHT: 3.7g (0.130z) 40 2fi ~ 2 1.400 Cil ~ "§. 70 " ,60 > 50 Cl l!! "0 " 0. c. 40 .9- 30 ;;: :; " 0 lo-±15mA V," = ±15V 16 ~ 0 \ VIN > :; .9- 14 -.... "" Balanced Loads Single-ended' Loads - <5 \ = +15V l ~ " il!'" 20 10 , 18 80 .......;;; t:-- 12 f'. '::~:<-IO-ieak ......... 0.1 Capacitor Only DC I :; :; )111"'1 o +85 c. :; I I o 6 I o 0 8 / / 2 o 1 -25 4 ./ r V L V ~ 4 +25 +50 Temperature ("C) +75 8 +100 10 12 14 16 18 Input Voltage (V) OUTPUT VOLTAGE DRIFT Temperature \ 'C) THEORY OF OPERATION The PWS725 and the PWS726 DC-to-DC converters consist of a free-running oscillator, control and switch driver circuitry, MOSFET switches, a transformer, a bridge rectifier, and filter capacitors together in a 32-pin DIP (0.900 inches nominal) package. The control circuitry consists of current limiting, soft start, frequency adjust, enable, and synchronization features. In instances where several converters are used in a system, beat frequencies developed between the converters are a potential source of low frequency noise in the supply and ground paths. This noise may couple into signal paths. By connecting the SYNC pins together, up to eight converters can be synchronized and these beat frequencies avoided. The unit with the highest natural 84 frequency will determine the synchronized running frequency. To avoid excess stray capacitance, the SYNC pin should not be loaded with more than 50pF. If unused, the SYNC pin must be left open. Soft start circuitry protects the MOSFET switches during start up. This is accomplished by holding the gate-tosource voltage of both MOSFET switches low until the free-running oscillator is fully operational. In addition to the soft start circuitry, input current sensing also protects the MOSFET switches. This current limiting keeps the FET switches operating in their safe operating area under fault conditions or excessive loads. When either of' these conditions occur, the peak input current exceeds a safe limit. The result is an approximate 5% duty cycle, 300ilS drive period to the MOSFET switches. This protects the internal MOSFET switches as well as the external load from any thermal damage. When the fault or excessive load is removed, the converter resumes normal operation. A delay period of approximately 50lls incorporated in the current sensing circuitry allows the output filter capacitors to fully charge after a fault is removed. This delay period corresponds to a filter capacitance. of no more than I/LF at either of the output pins. This provides full protection of the MOSFET switches and also sufficiently filters the output ripple voltage (see specification table). The current sensing circuitry is designed to provide thermal protection for the MOSFET switches over the operating temperature range as well. The low thermal resistance of the package (OlC = JOoCj W) ensures safe operation under rated .conditions. When these rated conditions are exceeded, the unit will go into its shutdown mode. An optional potentiometer can be connected between the two FREQUENCY ADJUST pins to trim the oscillator operating frequency ±JO% (see Figure I). Care should be taken when trimming the frequency near the low frequency range. If the frequency is trimmed too low, the peak inductive currents in the primary will trip the input current sensing circuitry to protect the MOSFET switches from these peak inductive currents. NOTES: (1) (2) (3) (4) (5) The ENABLE pin allows external control of output power. When this pin is pulled low, output power is disabled. Logic thresholds are TTL compatible. When not used, the Enable input may be left open or tied to VIN (pin 16). OUTPUT CURRENT RATING The total current which can be drawn from the PWS725 or PWS726 is a function of total power being drawn from both outputs (see Functional Diagram). If one output is not used, then maximum current can be drawn from the other output. If both outputs are loaded, the total current must be limited such that: It should be noted that many analog circuit functions do not simultaneously draw full rated current from both the positive and negative supplies. For example, an operational amplifier may draw 13mA from the positive supply under full load while drawing only 3mA from the negative supply. Under these conditions, the PWS725 j 726 could supply power for up to five devices (SOmA +- 16mA = 5). Thus, the ?WS725/72G caii power. more circuit3 than is at first apparent. ISOLATION VOLTAGE RATINGS Because a long-term test is impractical in a manufacturing situation, the generally accepted practice is to perform a production test at a higher voltage for some shorter period of time. The relationship between actual test conditions and the continuous derated maximum specification is an important one. Burr-Brown has chosen a deliberately conservative one: VDCTEST = (2 X VACrms CONTINUOUS RATING) + JOOOV for ten seconds. This choice is appropriate for conditions where system transient voltages are not well defined.* Where the real voltages are well-defined or where the isolation voltage is not continuous, the user may choose a less conservative derating to establish a specification from the test voltage. Frequency Adjust is optional. with pins 19 and 20 left open. The normal switching frequency Is 400kHz. Leave SYNC pin open if unused, limit stray capacitance on SYNC pin to less than 50pF. leave ENABLE pin open or connect to V,N if not used. Optional output filtering, with Lo ~ 0, limit Co';; II'F, with Lo ~ 1001'H, limit Co';; 101'F, See Performance Curves for Lo ~ O. Optional input filtering, see Performance Curves for L,N ~ O. FIGURE I. PWS725j726 Functional Diagram. • Reference National Electrical Manufacturers Association (NEMA) Standards Parts ICS 1-109 and ICS I-Ill. 85 THIS PAGE INTENTIONALLY LEFT BLANK 86 BURR-BROWN® ADC80MAH-12 113131 Monolithic 12-811 ANALOG-TO-DIGITAL CONVERTER FEATURES • INDUSTRY-STANDARD 12-BIT ADC A !V!!!~!!UT!!!C C!!~!mmCT!!!~ • LOW COST • ±o.D12% LINEARITY It 25ps MAX CONVERSION TIME • ±12V or ±15V OPERATION • NO MISSING CODES -25°C 10 +B5°C • HERMETIC 32-PIN PACKAGE • PARALLEL OR SERIAL OUTPUTS • 705mW MAX DISSIPATION DESCRIPTION· The ADC80MAH-12 is a 12-bit single-chip successiveapproximation analog-to~digital converter for low cost converter applications. It is complete with a comparator, a 12-bit DAC which includes a 6.3V reference laser-trimmed for minimum temperature coefficient, a successive approximation register (SAR), clock, and all other associated logic functions. Internal scaling resistors are provided for the selection of analog input signal ranges of ±2.5V, ±5V, ± IOV, 0 to +5V, or 0 to + IOV. Gain and offset errors may be externally trimmed to zero, enabling initial end-point accuracies of better than ±O.l2% (±1/2LSB). The maximum conversion time of 25/Ls makes the ADC80MAH-12 ideal for a wide range of 12-bit applications requiring system throughput sampling rates up to 40kHz. In addition, this AI D converter may be short-cycled for faster conversion speed with reduced resolution, and an external clock may be used to synchronize the converter to the system clock or to obtain higher-speed operation. The convert command circuits have been redesigned to allow simplified free-running operation with internal or external clock. Data is available in parallel and serial form with corresponding clock and status signals. All digital input and output signals are TTLI LSTTL-compatible, with internal pull-up resistors included on all digital inputs to eliminate the need for external pullup resistors on digital inputs not requiring connection. The ADC80MAH-12 operates equally well with either ±15V or ±12V analog power supplies, and also requires use of a +5V logic power supply. However, unlike many ADC80-type products, a +5V analog power supply is not required. It is packaged in a hermetic 32-pin side-brazed ceramic dual-in-line package. I~~~~~ 0---,.-------, Ex~I~Ca~ 0 - - - - - - - , ~~~r! 0--:-----, Comparator In 0---..., 20V Range .......N-<...."......---ilc-.. 10V Range B~f~~:~ O------"'----......---Re-j-er-en-Oce Out Inlernational Airporllnduslrial Par~· P.O. Box 11400· Tucson. Arizona B5734· Tel. (6021746·1111 . Twx: 911).952·1111 . Cable: BBRCORp· Telex: 66·6491. PDS-694 87 SPECIFICATIONS ELECTRICAL At T. ~ +25'C, ±Vcc ~ 12V or 15V; VDD ~ +5V unless otherwise specified, MOOEL ADC80MAH-12 MiN RESOLUTION I I TYP MAX UNITS 12 Bits 2.55 5.1 10.2 V V kO kO kO INPUT ANALOG Voltage Ranges: Unipolar Bipolar Impedance: 0 to +5V, ±2.5V oto +10V, ±5V ±10V DIGITAL Logic Characteristics (Over specification temperature range) V'H (Logic "1") V" (Logic "0") I'H (V'N ~ +2.7V) I" (V'N ~ +0.4V) Convert Command Pulse Wldth lll 2.45 4.9 9.B a to +5, 0 to +10 ±2.5, ±5, ±10 2.5 5 10 2.0 -0.3 5.5 +O.B 20 -20 100ns 20 V V /lA /lAo /lS TRANSFER CHARACTERISTICS ACCURACY Gain Errorl21 Offset ErrortZ': Unipolar Bipolar Linearity Error Differential Linearity r;:rror Inherent Quantization"Error POWER SUPPLY SENSITIVITY 11.4V S ± VocS 16.5V +4.5V S VDD S +5.5V DRIFT " Total Accuracy. Bipolar"" Gain Offset: Unipolar Bipolar I.,.inearity Error Drift Differential Linearity over Temperature Range No Missing Code Temperature Range Monotonicity Over Temperature Range %ofFSR'31 %ofFSR % of FSR. %ofFSR LSB LSB ±0.1 ±0.05 ±0.1 ±O.S ±0.2 ±0.3 ±0.O12 ±1/2 ±1/2 ±3/4 ±0.O03 ±0.002 ±0.009 ±0.OO5 % of FSR/%Vee % of FSR/%VDD ±10 ±15 ±3 ±7 ±1 ±23 ±30 ±15 ±3 ±3/4 +B5 ppm/'C ppm/'C ppm of FSR/'C ppm of FSR/'C ppm of FSR/'C LSB 'C 25 /lS +0.4 V V kHz +6.3 +6.32 ±10 ±30 V /lA ppm/'C -25 Guaranteed CONVERSION TIME'" 22 OUTPUT DIGITAL (Bits 1-12, Clock Oul, Status, Serial Out) . Output Codes'" Parallel: Unipolar Bipolar Serial (NRZ)17I Logic Levels: Logic 0 (IS'NK S 3.2mA) Logic 1 (ISOURCE S BO/lA) Internal Clock Frequency CSB COB,CTC CSB,COB +2.4 520 INTERNAL REFERENCE VOLTAGE Voltage Source Current Avail~~le for External Loadslill Temperature Coefficient . +6.2B 200 POWER SUPPLY REQUIREMENTS Rated Supply Voltages Supply Ranges; ±Vcc VDD Supply Drain: +Iee (+Vee ~ 15V) -Icc (-Vee ~ 15V) 100 (Vee ~ 5V) Power Dissipation (±Vcc ~ 15V, VDD ~. 5V) Thermal R~sistance. 8JA ±16.5 +5.5 11 24 36 705 V V 'V mA mA mA mW 'C/W +B5 +125 +150 'C 'C 'C +5, ±12 or ±15 ±11.4 +4.5 B.5 21 30 593 50 TEMPERATURE RANGE (Ambient) Specification Operating (derated specs) Storage -25. -55 -65 NOTES: (1) Accurate conversIon WIll be obtaIned wIth any convert command pulse WIdth of greater than 100ns; .however, It must be .limited to 20/ls ,(max) to assure the spacifled conversion time. (2) Gain and offset errors are adjustable t6 zero: See "Optional External ·Galn and Offset Adjustment" section. (3) FSR means Full-Scale Range and is 20V for ±10V range, 10V for ±5V and 0 to +10V ranges, etc. (4) Includes drift due to linearity, gain, and offset drifts. (5) Conversion time is specified using internal clock. For operation with an external clock see "Clock Options" section. This converter may also be short-cycled to less than 12·bit resolution for shorter conversion time; see "Short Cycle Feature" section. (6) CSB means Complementary Straight Binary, COB means Complementary Offset Binary, and CTC means Complementary Two's Complement coding. See Table I for additional information. (7) NRZ means Non-Return-to-Zero coding. (B) ,External loading must be constant during conversion, and must not exceed 200pA for glJar~nteed specification, .' . 88 CONNECTION DIAGRAM Pin 32 Pin 31 Pin 30 Pin 29 Pin 28 Pin 27 Pin 26 Pin 25 Pin 24 Pin 23 Pin 22 Pin 21 Pin 20 Pin 19 Pin 18 Pin 17 Bit6 BitS Bit4 Bit3 Bit2 Bitl (MSB) N/C' Bitl (MSB) +5V Digital Supply, Pin 1 Pin 2 Pin3 Pin 4 Pin 5 Pin 6 Pin 7 PmS Pin 9 Pin 10 Pin 11 Digital Common Comparator In Pin Pin Pin Pin Pin Bipolar Offset Rl 10V Range R2 20V Range Analog Common Gain Adjust 12 13 14 IS 16 Bit 7 Bit8 Bit9 Bit 10 (LSB-l0 Bits) Bitll Bit 12 (LSB-12 Bits) Serial Out -Vee Reference Out (+6.3V) Clock Out Status Short Cycle Clock Inhibit External Clock Convert Command +Vcc • +SV applied to pin 7 has ne effect on circuit. ABSOLUTE MAXIMUM RATINGS MECHANICAL +Vee to Analog Common.. .. . .. . .. . . .. . .. .. .. .. .. .... 0 to +IS.5V -Vee to Analog Common. .. . .. .. .. . .. . • .. .. . . .. .. .. .. 0 to -1S.SV ,.-----A---11 p 11 l D '---~--__,r-' J Voo to Digital Common ... : .............................. 0 to +7V Analog Common to Digital Common •.•...•...•....•.••..••. ±0.5V Logic Inputs (Convert Command, Clock In) to Digital Common ................. : ............. -0.3V to +Vee Analog Inputs (Analog In, Bipolar Offset) to Analog Common •••.• , ..••••••••.•.•••...•••.•...••.• ±16.SV Reference Output •.•••••.•.•.•....•..• Indefinite Short to Common, Momentary Short to Vee Lead Temperature, Soldering •......•................. +300°C, 10s Leads in true position within .010" (.2Smm) R B at MMC at seating plane. Seal ring is connected to pin 15. lPin 15 ~ Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . .. +160°C I ~:.:::::..-iCF N ·K -t-J j.lG . Jl D ~g I--.-L--I ' CAUTION: These devices are sensitive to ele~trostatic discharge. Appropriate I.C. handling procedures should be followed. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to absolute maximum conditions for extendf:1~ periods.~~y affect device reliability. Plane DIM A B C D F G J K L N INCHES MIN MAX MILLIMETERS MIN MAX 1.584 1.616 .885 .905 .124 .188 .016 .020 .045 .055 .100 BASIC ,009 ,012 .165 .175 .900 BASIC .040 .060 40.23 22.48 41.05 22.99 4.22 0.51 1.40 3.15 0.41 1.14 2.54 BASIC 0.23 0.30 4.19 TYPICAL PERFORMANCE CURVES CASE: Ceramic, hermetic MATING CONNECTaR: 2302MC WEIGHT: 8.4gm (0.290z) POWER SUPPLY REJECTION VS POWER SUPP~Y RIPPLE FREOUENCY 4.45 22.86 BASIC 1.02 1.52 di t e.< 0.1 0.08 0.06 0.04 g~ ORDERING INFORMATION Relolutlon Model (bill) ADC80MAH-12 ADC80MAH-12/0M'" 12 12 7 0.02 w<> a: g» 0.0 1 fe ~ 0.008 ''0 ~ 0.006 #. ~ 0.004 -Vee ...... / ....+SV""-.Supply 0.002 0.00 I 1 NOTE: (I) 10M .ufflx Indlca,e. EnVironmental Screening; see Table IV for details. 89 +Vee--::7 10 lk 100 Frequency (Hz) 10k, lOOk LINEARITY ERROR VS CONVERSION TIME DIFFERENTIAL LINEARITY ERROR VS CONVERSION TIME 0.200 0.200 8-Bit Linearity* iI 0.175 8-Bit Differential Linearity* '""- .~ ~ e w ,.. " ~:Ja: 0.125 -'" "'"·.go t~ 0.100 .~ ~ 0.D75 :J ~ .0. 0.175 C 0 0.150 \ 10-Bil Linearity* i \. ~ 0.Q25 12-Bit Linearity ~ --~-~---l8 10 12 14 16 18 Conversion Time (J.ls) - 20 22 0.125 0.100 ~e 0.075 '-' .0. 0.050 coW 0.050 0.150 \ ~ ~ 0.025 12-Bit -- -- - - 24 26 1O-Bit Differential Linearity* Diff~ren~ial ~ine~rity --t--~-~- - 8 10 12 14 16 18 Conversion Time (,us) *Converslon Time can be further reduced by using Short-Cycle feature. DISCUSSION OF SPECIFICATIONS OOOH LINEARITY ERROR 001 H f~- 20 22 - 24 26 Gain Error Rotates the 002H Linearity error is defined as the deviation of actual code transition values from the ideal transition values. Under this definition of linearity (sometimes referred to as integral linearity), ideal transition values lie on a line drawn through zero (or minus full scale for bipplar operation) and plus full scale, providing a significantly better definition of converter accuracy than the beststraight-line-fit definition of linearity employed by some manufacturers. The zero or minus full-scale value is located at an analog input value Ij2LSB before the first code transition (FFF H to FFEH). The plus full-scale value is located at an analog value 3j2LSB beyond the last code transition (OOIH to OOOH). See Figure I. which illustrates these relationships. A linearity specification which guarantees ±lj2LSB maximum linearity error assures the user that no code transition will differ from the ideal transition value by more than ±lj2LSB. 7FDH ~ B- 7FEH 6 :§ .0, is 7FFH BOOH Offset I I: I I II II II : I-- Midscale I : I -i I- I 3/2LSB I-----i I +Full I I Scale I----Transition Values-----l I 1/2LSB Analog Input FIGURE 1. Transfer Characteristic Terminology. Thus, for a converter connected for bipolar operation and with a full-scale range (or span) of 20V (±IOV operation), the minus full-scale value of -lOY is 2.44mV below the first code transition (FFFH to FFEH at -9.99756V) and the plus full-scale value of + lOY is 7.32mV above the last code transition (OOIH to OOOH at +9.99268V). Ideal transitions occur ILSB (4.88mV) apart, and the ± I j 2LSB linearity specification guarantees that no actual transition will vary from the ideal by more than 2.44mV. The LSB weights, transition values, and code definitions for each possible ADC80 analog input signal range are described in Table I. TABLE I. Input Voltages, Transition Values, LSB Values, and Code Definitions. Input Voltage Range and LSB Values Binary Output Analog Input Voltage Range ±10V ±5V ±2.5V o to +10V eOB(1J or CTC '2) COBorCTC COB orCTC CSB I3 ) CSB FSR/2" n=8 n = 10 n = 12 20V/2" 78.13mV 19.53mV 4.88mV 10VJ2" 39.06mV 9.77mV 2.44mV 5V12" 19.53mV 4.88mV 1.22mV 10Vl2" 39.06mV 9.77mV 2A4mV 5VJ2" 19.53mV 4.88mV 1.22mV + Full Scale Midscale - Full Scale +10V - 3/2LSB 0 -10V + 1/2LSB +5V - 3/2LSB 0 -5V + 1I2LSB +2.5V - 3/2LSB 0 -2.5V + 1/2LSB +10V - 3/2LSB +5V 0+ 1/2LSB +5V - 3/2LSB +2.5V 0+ 1/2LSB Defined As: Code Designation One Least Significant Bit (LSB) Transition Values MSB LSB 001 H to OOOH 800H to 7FFH FFFH to FFEH o to +5V NOTES: (1) COB = Complementary Offset BiQary. (2) eTC = Complementary Two's Complement-obtained by using the complement of the most significant bit (MS8). MSB is available on pin B. (3) esa = Complementary Straight Binary. 90 CODE WIDTH (QUANTUM) Code width (or quantum) is defined as the range of analog input values for which a given output code will occur. The ideal code width is ILSB, which for l2-bit operation with a 20V span is equal to 4.BBmV. Refer to Table I for LSB values for other ADCBO input ranges. DIFFERENTIAL LINEARITY ERROR AND NO MISSING CODES Differential linearity error is the difference l;>etween an ideal ILSB code width (quantum) and the actual code width. A specification which guarantees no missing codes requires that every code combination appear in a monotonically increasing sequence as the analog input is increased throughout the range, requiring that every input quantum must have a finite width. If an input quantum has a value of zero (a differential linearity error of -ILSB), a missing code will occur but the converter may still be monotonic. Thus, no missing codes represent a more stringent definition of performance than does monotonicity. ADCBO is guaranteed to have no missing codes to 12-tit resulution over its fun ;;pccificatiot temperature range. QUANTIZATION UNCERTAINTY Analog-to-digital converters have an inherent quantization error of ±1/2LSB. This error is a fundamental property of the 'quantization process and cannot be eliminated. UNIPOLAR OFFSET ERROR actual 2SoC value to the value at the extremes of the Specification temperature range. The temperature coefficient applies independently to the two halves of the temperature range abov~ and below +2S°C. POWER SUPPLY SENSITIVITY Electrical specifications for the ADCBO assume the application of the rated power supply voltages of +SV and ±12V or ±ISV. The major effect of power supply voltage deviations from the rated values will be a small change in the plus full-scale value. This change, of course, results in a proportional change in all code transition values (i.e., a gain error). The specification describes the maximum change in the plus full-scale value from the initial value for independent changes in each power supply voltage. TIMING CONSIDERATIONS Timing relationships of the ADCBO are shown in Figure 2. During conversion, the decision as to the proper state of any bit (bit "n") is made on the rising edge of clock pulse "u + i"'. Thus, a c.:ullipleit: I..:UllVt:fSiulI i'c4uin:s 13 dut,;k pulses with the status output dropping from logic "I" to logic "0" shortly after the falling edge of the 13th clock pulse, and with valid output data ready to be read at that 'time. Additional convert commands applied during conversion will be ignored. S'tatus remains high until after the falling edge of the 13th clock pulse. This allows direct use of status for latching parallel data. An ADCBO connected for unipolar operation has an analog input range of OV to plus full scale. The first output code transition should occur at an analog input value 1/2LSB above OV. Unipolar offset error is defined as the deviation of the actual transition value from the ideal value, and is applicable only to converters operating in the unipolar mode. -I Status BIPOLAR OFFSET ERROR A/ D converter specifications have historically defined bipolar offset at the first transition value above the minus full-scale value. The ADCBO follows this convention. Thus, bipolar offset error for the ADCBO is defined as the deviation of the actual transition value from the ideal transition value located 1/2LSB above minus full scale. I-tSD --I I--tep --I Hew ---1 Bit12~ ~ 5 . I --I HDV ' D:~~ D&!&lnvalldi Bill! 811216'1316'141 BIISI BitS! ell7! B'Isl 8,'916,1101611"la" GAIN ERROR The last output code transition (OOIH to OOOH) occurs for an analog input value 3/2LSB below the nominal plus full-scale value. Gain error is the deviation of the actual analog value at the last transition point from the ideal value. Symbol Parameter Typ. Units teo Clock delay from convert command Nominal clock period Nominal clock pulse width Status delay from convert command All bits reset delay from convert command Data valid time from clock pulse high 15,3 1.81 0.87 186 141 -15 ns ps ps ns ns ns !cP tew tSD t, tDv ACCURACY DRIFT VS TEMPERATURE The temperature coefficients for gain, unipolar offset, and bipolar offset specify the maximum change from the 121 FIGURE 2. Timing Diagram (nominal values at +2SoC with internal clock). 91 DEFINITION OF DIGITAL CODES ANALOG SIGNAL SOURCE IMPEDANCE The signal source supplying the analog input signal to the ADC80 will be driving into a nominal DC input impedance of 2.3kfl to 9.2kfl depending upon the range selected. However, the output impedance of the driving source should bevery low, such as the output impedance· provided by a wideband, fast-settling operational amplifier. Transients in A/ D input current are caused by the changes in output current of the internal D / A converter as it tests the various bits. The output voltage of the driving source must remain constant while furnishing these fast current changes. If the application requires a sample/hold, select a sample/hold with sufficient bandwidth to preserve the accuracy or use a separate wideband buffer amplifier to lower the output impedance. Parallel Data Three binary c,odes are available on the ADC80 parallel output; all three are compleme'n'tary 'codes, meaning that logic "0" is true. The available codes are complementary straight binary (CSB) for unipolar input signal ranges, and complementary offset binary (COB) and complementary two's complemen't (CTC) for bipolar input signal ranges. CTC coding is obtained by complementing bit I (the MSB) relative to, its normal state for CSB or COB coding; the complement Of bit I is available on pin 8. Serial Data Two (complementary) straight binary codes are available on the serial output of the ADC80; as in the parallel case, they are CSB and COB. The serial data is available only during conversion and appears with the most significant bit (MSB) occurring first. The serial data is synchronous with the internal dock as shown in the timing diagram of Figure' 2. The LSB and transition values of Table I also apply to the serial data output, except that the CTC code is not available. All clock pulses available from the ADC80 have equal pulse widths to facilitilte transfer of the serial data into external logic devices without external shaping. INPUT SCALING The ADC80 offers five standard input ranges: OV to +5V, OV to +IOV. ±2.5V, ±5V, and ±IOV. The input range should be scaled as close to the maximum input signal range as possible in order to utilize the maximum signal resolution of the converter. Select the appropriate input range as indicated by Table II. The input circuit architecture is illustrated in Figure 3. External padding resistors can be added to modify the factory-set input ranges (such as addition of a small external input resistor to change the 10V range to a 10.24V range). Alternatively, the gain range of the converter may easily be increased a small amount by use of a low temperature coefficient potentiometer in series with the anaJog input signal or by decreasing the value of the gain adjust series resistor in Figure 5. LAYOUT AND OPERATING INSTRUCTIONS LAYOUT PRECAUTIONS Analog and digital commons are not connected together internally in the ADC80, but ,should be connected together as close to the unit as possible, preferably to an analog common ground plane beneath the converter. If these common lines must be run separately, use wide conductor pattern and a O.OI/tF to O.J/tF nonpolarized bypass capaCitor between analog and digital commons at the .unit. Low impedance analog and digital common returns are essential for low noise performance. Coupling between analog input lines and digital lilies should be, minimized by careful layout. For instance, if the lines must cross, they should do so at right angles. Parallel analog and digital lines should be separated from each other by a pattern connected to common. If external gain and offset potentiometers are used,' the potentiometers and associated resistors should be located as close to the ADC80 as possible. Capacitive loading on comparator and input pins should be kept to a minimum to maintain converter performance. TABLE II. Input Scaling Connections. Input Signal Range ±10V ±S4V ±2.SV oto +SV oto+l0V Output Code Connect Pin 12 To Pin Connect Pin 14 To Connect Input Signal To COB orCTC COBorCTC COBorCTC CSB CSB 11 11 11 15 15 Input Signal Open Pin 11 Pin 11 Open 14 13 13 13 13 10V Range ":"13::-------.., R2 20V Range -:-:-----'W...---+ 14 SkCl Rl POWER SUPPLY DECOUPLING SkCl Comp.ln ""'1"-1----~~~~-I The power supplies should be bypassed with I/tF to IO/tF tantalum bypass capacitors located close to the converter to obtain noise-free oper"ation. Noise on the power supply lines can degrade the converter's performance. Noise and spikes from a switching power supply are especially troublesome. ' ... !~om O/A Converter Bipolar Offset Analog 6~kcit 12 ~ Common 15 .. VREF FIGURE 3. Input Scaling Circuit. 92 CALIBRATION Optional External Gain And Offset Adjustments Gain and offset errors may be trim:ned to zero using external offset and gain trim potentiometers connected to the ADC80 as shown in Figures 4 and 5 for botli unipolar and bipolar operation. Multiturn potentiometers with 100ppm/oC or better TCR are recommended for minimum drift over temperature and time. These pots may be of any value between IOkn and 100kn. All fixed resistors should be 20% carbon or better. Although not necessary in some applications, pin 16 (Gain Adjust) should be preferably bypassed with a O.O\JlF nonpolarized capacitor to analog common to minimize noise pickUp at this high impedance point, even if no external adjustment is required. (8) (A) +vcc +vcc ~ _tt_..,~~",:J,...~___ ~g~~~o COIll~. In Adjust t.SMCl to ! Offset ~~ t ~~-!I ~g~~~o COI'np. In 122kCl to 28kCl -Vee AOdf~set • Just -Vee FIGURE 4. Two Methods of Connecting Optional Offset Adjust. (A) !. (8) +Vee Gain Adjust 8.2MCl to 16 10MCl +vcc ~g~~~o t6 Adjust « ;0.011116.8kCl to ~ 9.1kCl 270kCl 270kCl ~Gain .. "T" ~ Analog Common O,01I1 F -Vee -:- until the output code is alternating between OOOH and OOIH with an approximate 50% duty cycle. As in the case of offset adjustment, this procedure sets the converter end-point transitions to a precisely known value. CLOCK OPTIONS AND SHORT CYCLE FEATURE The ADC80 is extremely versatile in that it can be operated. in several different modes with either internal or external clock. Most of these options can be implemented with inexpensive TTL logic as shown in Figures 6 through 9. Pin 20 (clock inhibit) must be grounded for use with an external clock, which is applied to pin 19. A short-cycle input (pin 21) permits the conversion to be terminated after any number of desired bits has been converted, allowing shorter conversion times in applications not requiring full 12-bit resolution. In these situations, the short-cycle pin shoul~ be connected to the bit output pin of the next bit after the desired resolution. For example, when lO-bit resolution is desired, pin 21 is connected to pin 28 (bit II).. In this example, the conversion cycle terminates and status is reset after the bit 10 decision. Short-cycle pin connections and associated maximum 12-, 10-, and 8-bit conversion times (with internal clock) are shown in Table III. Shorter conversion times are possible with an external clock applied to pin 19. With increasing clock speed, linearity performance will begin to degrade as indicated in the Typical Performance Curves. These curves should be used only as . guidelines because guaranteed. 'peiformance is specified and tested only with the internal clock. . 10kClto 100kCl Gain Adjust TABLE III. Short-Cycle Conne'ctions and Conversion Times for 8-, 10-, and 12-Bit ResolutionsADC80MAH-12. -Vee Resotutlon (Bits) Connect pin 21 to FIGURE 5. Two Methods of Cunnecting Optional Gain Adjust. 12 10 8 Pin 90rNC Pin 28 Pin 30 25 22 18 J.012 0.048 0.20 Maximum Conversion Tima f11 Internal Clock (ps) Maximum Linearity Error at +25'C (% of FSR) Adjustment Proc.edure OFFSET -Connect the offset ·potentiometer as shown in Figure 4. Set the input voltage to the nominal zero or minus full-scale voltage plus 1/2LSB. For example, referring to Table I, this value is -lOY +2.44mV or -9.99756V for the -lOY to +IOV range. NOTE: (1) Conversion time to maintain ±1/2LSB linearity error. External Clock With the input voltage set as above, adjust the offset potentiometer until an output code is obtained which is alternating between FFEH and FFFH with approximately 50% occurrence of each of the two codes. In other words, the potentiometer is adjusted until bit 12 (the LSB) indicates a true (logic "0'') condition approximately half the time. GAIN-Connect the gain adjust potentiometer as shown in Figure 5. Set the input voltage to the nominal plus full-scale value minus 3/2LSB. Once again referring to Table I, this value is +IOV -7.32mV or +9.99268V for the -lOY to + lOY range. Adjust the gain potentiometer 19 External Clock Bit 11 28 Short Cycle 21 10·Bit ,.. Operation I I ADC80 18 Digital Common Cony. Com. Clock 20 Inhibit ":" Digital Common FIGURE 6. Continuous Conversion with External Clock. (Conversion is initiated by 14th clock pulse. Clock runs continuously.) 93. ,~ Convert +SV ADC80 Jl No Connection Necessary Command Short~, Cycle r-}' J 18 Bitll Convert Command Short Cycle 21 I' Clock 20 Inhibit ADC80 I;~~~i~ ~ 10-Bit Operation 28 External 19 Clock External ~, Clock FIGURE 7. Continuous Conversion. Optional Connection +5Y FIGURE 8. Internal Clock-Normal Operating Mode. (Conversion initiated by the rising edge of the convert command. The internal clock runs only during conversion.) External Bit 11 Clock External Clock 28 10-Bit Operation 1/ 1 ADC80 , -_ _ _ _ _ _ _ 22.... Status Short Cycle 21 _ _ _~_ _ _ _ _ _..;1,8 ConY, Com. Clock Inhibit 20 'Digital ":' Common FIGURE 9. Continuous External Clock. (Conversion intitiated by rising edge of convert command. The convert command must be synchronized with clock.) , ENVIRONMENTAL SCREENING The inherent reliability of a semiconductor device is controlled by the design, materials, and fabrication of the device-it cannot be improved by testing. However, the use of environ'mental screening can eliminate the majority of those units which would fail early in their lifetimes (infant mortality) through the application of carefully selected accelerated stress levels. Burr-Brown Q models are environmentally screened versions of our standard industrial products, designed to provide enhanced reliability. The screening illustrated in Table IV is performed to selected methods of MIL-STD-S83. Reference to these methods provides a convenient way of communicating the screening levels and basic procedures employed; it does not imply conformance to any other military standards or to any methods of MILSTD-883 other than those specified. Burr-Brown's detailed procedures may vary slightly, model-to-model, from those in MIL-STD-883. TABLE IV. Screening Flow for ADCSOMAH-12/QM. Screen Internal Visual MIL-STO-883 Method, Condition Screening Level 2010 High Temperature Storage (Stabilization Bake) 1008,C 24 hour, +IS0"C Temperature Cycling 1010, C 10 cycles, -6S"C to +IS0"C 2001,A SOOOG Constant Acceleration Electrical Test Burr-Brown test procedure Burn-in Hermeticity: Fine Leak Gross Leak Final Electrical 1015, B 160 hour, +12S"C, steady state 1014, AI or A2 1014, C 5 X 10-7 atm eels Burr-Brown test procedure Final Drift Burr-Brown test p'rocedure External Visual 94 2009 bubble test only, pre-cond,itioning omitted BURR-BROWN® ADC84 ADC85H ADC87H IEJEJI IC ANALOG-TO-DIGITAL CONVERTERS FEATURES • • • • • • • THREE TEMPERATURE RANGES: u:::\: io +iii=L: -25° C to +85° C -55°C to +125°C • NO MISSING CODES OVER FULL TEMPERATURE RANGE • PARALLEL AND SERIAL OUTPUTS • ±12V or ±15V POWER SUPPLY OPERATION • HERMETIC 32·PIN CERAMIC SIDE·BRAZED DIP INDUSTRY STANDARD 12·BIT AID CONVERTERS COMPLETE WITH CLOCK AND INPUT BUFFER HIGH SPEED CONVERSION: lOps (max) REDUCED CHIP COUNT-HIGH RELIABILITY LOWER POWER DISSIPATION: 450mW (typ) ±0.012%MAX LINEARITY DESCRIPTION The ADC8SH Series o(analog.to-digital converters utilize state-of-the-artIC and laser-trimmed thinfilm components, and are packaged in a 32-pin hermetic side-brazed package. Complete with internal reference and input buffer amplifier, they offer versatility and performance formerly offered only in larger modular or rackmount packages. Thin-film internal scaling resistors are provided for the selection of analog input signal ranges of ±2.SV, ±SV, ±IOV, 0 to +SV orO to +IOV. Gain and offset errors may be externally trimmed to zero, offering initial accuracies of better than ±O.OI2% (± 1/ 2LSB). The fast lOlLS conversion speed for 12-bit resolution makes these ADCs excellent for a wide range of applications where system throughput sampling rates of 100kHz are required. In addition, they may be short cycled and the clock rate control may be used to obtain faster conversion speeds at lower resolutions. Data is available in parallel and serial form with corresponding clock and status signals. All digital input and output signals are CMOS/TTL-compatible. Power supply voltages are ±12VDC or ±lSVDC and +SVDC. Inlernational Airporllnduslrlal Pa'rk • P.o. Box 11400· Tucson. Arizona 85734 • Tel. 1602f]46·1111 : Twx: 910·952·1111 • Cabla: BBRCORP • Telex: 66·6491 PDS-714 95 SPECIFICATIONS ELECTRICAL Specified at +2SClC and rated supplies unless otherwise noted. MODEL AOC84KG-12'" MIN ADC85H-12 TYP MAX RESOLUTION MIN TYP INPUTS I I ±2.5, ±5, ±10 o to +5, 0 to +10 2.45 2.5 2.55 4.9 5 5.1 9.8 10 10.2 100 50 ·· ·· 2 DIGITAL'" Convert Command Logic Loading I ±0.1 ±0.05 ±0.1 I I ±0.25 ±0.2 ±0.25 ±0.012 ±0.5 ±0.5 0 +70 POWER SUPPLY SENSITIVITY Gain and Offset: ±15V +5V -25 ±0.004 ±0.001 DRIFT Gain Guaranteed 10 DIGITAL OUTPUT'" I CSB COB,CTC 2 CSB,COB 2 Logic "1" during conversion I I I ,t I INTERNAL REFERENCE VOLTAGE Reference Output Max. External Curtent With No Degradation Tempeo of Drift +6.2 +6.3 +6.4 200 ±20 POWER SUPPLY REQUIREMENTS Rated Supply Voltages Supply Ranges: VDD ±Vcc Supply Drain: +Icc -Icc +5, ±12 or ±15 +4.75 ±".4 100 Total Power Dissipation 450 +5.25 ±16.5 20 25 10 725 TEMPERATURE RANGE Specification Operating (with Derated Specs) Storage PACKAGE 0 -25 -65 +70 +85 +150 Hermetic Ceramic IS MAX · ·· · UNITS Bits V V kO kO kO MO nA I1S +85 the same as ADC84KG-12 . 96 TTL Load I -55 ·· · .' +125 ±7 ±2 · · ·· ·· ··· ·· · · ··· ··· ··· · · ·· · · ·· ·· · ·· ·· · ·· ·· ·· · · ·· · · ±5 -25 -55 ±10 +85 +125 ±5 -55 % %ofFSR'5I % of FSR %ofFSR LSB LSB "C % of FSR/%V. % of FSR/%V. ±15 :\:5 ±10 ±2 ±3 ±15 ±3 Frequency(7) f I ±15 ±3 CONVERSION TIME .. ·Speclflcatlon · · ··· ·· ·· ··· · · ·· · ·'. · · · · ·· ·· ·· · ·· · ·· ·· ·· ·· ±30 Offset: Unipolar . Bipolar Linearity Monotonicity (All Codes Complementary) Parallel Output Codes: Unipolar Bipolar Output Drive Serial Data Codes (NRZ) Output Drive Status Output Drive Internal Clock: Output Drive TYP Positive pulse SOns (min). trailing edge initiates conversion 1 TRANSFER CHARACTERISTICS ACCURACY Gain ErrorC41 Offset ErrorC4J : Unipolar Bipolar Linearity Errorcs1 Inherent Quantization Error Differential Linearity Error No Missing Codes Temperature Range MIN · 12 ANALOG Voltage Ranges: Bipolar Unipolar Impedance (Direct Input): 0 to +5V, ±2.5V o to +10V, ±5V ±10V Bul!.r Amplifier: Impedance Bias Current Settling Time to 0.01% for 20V step'" ADCB7H-12 MAX ±10 +125 · · · · · · ppm/"C ppm of FSR/"C ppm of FSR/"C ppm of FSR/"C IJS TTL Loads TTL Loads TTL Loads TTL Loads MHz V I1A ppm/"C V V V mA mA mA mW "C "C "C NOTES: (1) Model ADCB4KG-l0 is the same as model ADC84KG-12 except for the following: (a) Resolution: 10 bits (max), (b) Linearity Error: ±0.048% of FSR (max), (c) Conversion Time: 6ps (max), (d) Internal Clock Frequency: 1.9MHz (typ). (2) If the buffer is used, delay Convert Command until amplifier settles. (3) DTUTTl compatible. For digital inputs logic "0" = 0.8V (max) end logic "1" = 2.0V min. For digital outputs logic "0" = O.4V (max) and logic "1" = 2.4V (min). (4) Adjustable to zero. (5) FSR means Full Scale Range. (6) The error shown is the same as ±1I2lSB max linearity error in % of FSR. (7) Internal clock is externally adjustable. CONNECTION DIAGRAM-ADC85H SERIES Top View (lSB for 12 bits) Bit 12 Serial Out Billl -Vee (lSB for 10 bits) Bit 10 Buffer In Bil9 Buffer Out Bit8 +Vcc Bit7 Gain Adjust Bit6 Analog Common BitS R, 20V Range Bit4 R,10V Range Bit3 Bipolar Offset Bit2 Comparator In Bltl (MSB) Convert Command Bit 1 (MSB) Status Clock Out Short Cycle Reference Out (+6.3V) Digital Common Clock Rate Control Vee MECHANICAL 32 D 17 __ I Pin numbers shown for 1... ' ...cT+-____ reference only. Pin numbers .. ! ~~-..-..--...l" I-I.--A----........--II +".OO~=i~' J . ~ ,-1 PIN: Pin material and plating composition conform to method 2003 (solderability) of Mll-STD-883 (excepl paragraph 3.2). HERMETICITY: Conforms to . Method 1014, Condition Alar A2 (fine leak) and Condition C (gross leak). Metal lid of package is connected to -Vee internally. ORDERING INFORMATION Resolution (Bits) Temp Range (OC) ADC84KG-l0 ADCB4KG-12 10 12 Oto+70 Oto+70 ADC85H-12 ADC85HQ-12' 12 12 -25 to +85 -25 to +85 ADC87H-12 ADC87HQ-12' 12 12 -55 to +125 -55 to +125 Model '" Q suffix mdlcates environmental screening; see Table" for details. 97 NOTE: leads in true position within .010" (0.25mm) R at MMC at seating plane. DIM A B C D F G H J K L N INCHES MIN MAX 1.580 1.620 .880 .900 .138 .186 .016 .020 .000TYP .100 BASIC .044 .056 .009 .012 .165 .185 .900 .920 .040 .060 MILLIMETERS MIN MAX 40.13 41.15 22.35 22.86 3.51 4.72 0.41 0.51 1.02TYP 2.54 BASIC 1.12 1.42 0.23 0.30 4.19 4.70 23.37 22.86 1.02 1.52 The ADC84, ADC85H and ADC87H are also monotonic, assuring that the output digital code either increases or remains the same for increasing analog 'input signals. Burr-Brown also guarantees that these converters will have no missing codes over a specified temperature range. Figure 2 is the timing diagram. THEORY OF OPERATION The accuracy of a successive approximation AI D converter is described by the transfer function shown in Figure I. All successive approximation AI D converters have an inherent Quantization Error of ± I I 2LSB. The remaining errors in the AI D conve'rter are combinations of analog errors due to the linear circuitry, matching and tracking properties of the ladder and scaling networks, power supply rejection, and reference errors. In summary, these errors consist of initial errors including Gain, Offset, .' Li'nearity, Differential Linearity and Power Supply Sensitivity, Initial Gain and Offset errors may be adjusted to zero. Gain drift over temperature rotates the line (Figure l) about the zero or minus full scale point (all bits OFF) and Offset drift shifts the line left or right over the operatiIig temperature range. Linearity error is unadjustable and is the most meaningful indicator of AI D converter accuracy. Linearity error is the deviation of an actual bit transition from the ideal transition value at any level over the range of the AI D converter. A Differential Linearity error of ±1/2LSB means that the width of each bit step over the range of the AI I) converter is ILSB ±1/2LSB. 000 .. 000 CD '0 0 () 000 .. 00' 0" ... '0' 0 ~ 0" ... "0 III ~ '0 0 () 0" ... ", ""- 100 .. 000 :; 0 '00 .. 00' ]j '0, is I"~ ... "0 I"~ ... ,,, +FSR -.1LSB 2 E," Off * See Table I for digital code definitions. FIGURE I. Input vs Output for an Ideal Bipolar AI D Converter. Maximum Throughput Time(21 Conved 11 Conversion Time Command MSB Bit2 Bit3 Bit4 BitS Bit6 Bit 7 BitS Bit9 Bit 10 Bit', LSB Serial(3) Data Out ~==J "0" ~~~~"=,,,======================== ==_-J :::1 LJ",,, 1"0" ---J Iv ---~------~.==~~===============-~ ::'-:J Lj"'" =:::: -l-,r-------------.U =="J ---I "t" Lj"'" 1"0" LJ . ,. LJ . ,. ___ J ::-J ===-J "0" 1 ::::= =- Wffa.:rJ ", .. 2 "0" . ,. . ,. 6 "0" "0" 7 ", . ", .. W'O.., .. "0" ..,. I "0" NOTES: (1) The convert command must be at least 50ns wide and must remain low during a conversion. The conversion is initiated by the .. trailing edge" of the convert command. (2) '0.5Ils for'2 bits and 6.4lls for 10 bits. (3) Use trailing edge of clock to strobe serial output. FIGURE 2. Timing Diagram. 98 definitions for each possible analog input signal range for 8-, 10-, and 12-bit resolutions. DIGITAL CODES Parallel Data Three binary codes are available on the ADC85H series parallel output: • complementary (logic "0" is true) straight binary (CSB) for unipolar input signal ranges; • complementary two's complement (CTC) for bipolar input signal ranges; • complementary offset binary (COB) for bipolar input signal ranges. Table I describes the LSB, transition values and code Serial Data Two straight binary (complementary) codes are available on the serial output line; they are CSB and COB. The serial data is available only during conversion and appears with the most significant bit (MSB) occurring first. The serial data is synchronous with the internal clock as shown in tlie timing diagram of Figure 2. The LSB and transition values shown in Table I also apply to the s'erial data output except for the CTC code. TABLE l. Input Voltages, Transition Values, LSB Values, and Code Definitions. Binary Output Input Vollage Range and LSB Values Analog Input Vottage Ranges ±IOV ±SV ±2.SV oto+IOV Oto +SV eos UI or CTC 421 COS lll or CTC l21 eDa l1l or CTC~21 ese(3) CSS l31 n= 10 n= 12 20V/2' 7B.13mV 19.53mV 4.BBmV IOV/2' 39.06mV 9.77mV 2.44mV SV/2' 19.53mV 4.BBmV 1.22mV IOV/2' 39.06mV 9.77mV 2.44mV SV/2' 19.53mV 4.BBmV 1.22mV +Full Scale Mid Scale -Full Scale +IOV - 3/2LSB 0 -IOV + 1I2LSB +SV -3/2LSB 0 -SV + 1I2LSB +2.SV - 3/2LSB 0 -2.SV + 1I2LSB +IOV - 3/2LSB +SV 0+ 1I2LSB +SV - 3/2LSB +2.SV 0+1I2LSB Defined As Code Designation One Least Significant Bit (LSB) FSR/2" n=8 Transition Values M:>fj L:>t! 000 .. 000('" Oil ... 111 III ... 110 NOTES: (I) COB = Complementary Offset Binary. (2) CTC = Complementary Two's Complement-obtained by using the complement of the most-significant bit (MSB). MSB is available on pin 13. (3) Complementary Straight Binary. (4) Voltages given are the nominal value fortransition to the code specified. ENVIRONMENTAL SCREENING The inherent reliability of a semiconductor device is controlled by the design, materials, and fabrication of the device-it cannot be improved by testing. However, the use of environmental screening can eliminate the majority of those units which would fail early in their lifetimes. Burr-Brown Q models are .environmentally screened versions of our standard industrial products, designed to provide enhanced reliability. The screening illustrated in Table iI is performed to selected methods of MIL-STD-883. Reference to these methods provides a convenient way of communicating the screening levels and basic procedures employed; it does not imply conformance to any other military standards or to any methods of MIL-STD-883 other than those specified. Burr-Brown's detailed procedures may vary slightly, model-to-model, from those in MIL-STD-883. TABLE II. Screening for ADC85HQ-12 and ADC87HQ-12. Screen Internal Visual MIL-STD-883 Method, Condillon Screening Level Burr-Brown OC4118* High Temperature Storage (Stabilization Bake) 100B. C 24 hour. +ISO'C Temperature Cycling 1010. C 10 cycles. -6S'C to+ISO'C Constant Acceleration 2001. A SOOOG Burn-in 1015. B 160 hour. +12S'C steady-state Electrical Test Burr-Brown test procedure Hermeticity: Fine Leak Gross Leak 1014, AI or A2 1014.C Final Electrical Burr-Brown test procedure Final Drift Burr-Brown test procedure DISCUSSION OF SPECIFICATIONS The ADC85H series is specified to provide critical performance criteria for a wide variety of applications. The most critical specifications for an AI D converter are linearity, drift, gain and offset errors, and conversion speed effects on accuracy. These ADCs are factorytrimmed and tested for all critical key specifications. 5 X 10-7 atm cc/s bubble test only. preconditioning GAIN AND OFFSET ERROR Initial Gain and Offset errors are factory-trimmed to ±O:l% of FSR (±0.05% for unipolar offset) at 25°C. These 'errors may be trimmed to zero by connecting external trim potentiometers as shown in Figures 6 and 7. omitted External Visual QCSISO' '" Available upon request. 99 ACCURACY DRIFT VS TEMPERATURE Three major drift parameters degrade AI D converter accuracy over temperature: gain, offset and linearity drift. The worst-case accuracy drift is the summation of all three drift errors over temperature. Statistically, these errors do not add algebraically, but are random variables which behave as root-sum-squared (RSS) or 10 errors as follows: RSS = . .J eg2 + e0 2 + ee2 where eg = gain drift error (ppm 1°C) EO = offset drift error (ppm of FSRrC) ee = linearity error (ppm of FSR/°C) For the ADC85H-12 operating in the unipol~r mode, the total RSS drift is ±15.42ppmloC and for bipolar operation the total RSS drift is ±16.7ppml°C. ACCURACY VS SPEED In successive approximation AID converters, the conversion speed affects linearity and differential linearity errors. The power supply sensitivity specification is a measure of how much the plus full-scale value will change from the initial value for independent changes in each power supply. This change results in a proportional change in all code transition values (i.e., a gain error). The conversion speeds are specified for a maximum linearity error of ±1/2LSB with the internal clock. Faster conversion speeds are possible but at a sacrifice in linearity (see Clock Rate Control Alternate Connections). POWER SUPPLY SENSITIVITY Changes in the DC power supplies will affect accuracy. Normally, regulated power supplies with 1% or less ripple are recommended for use with these ADCs. See Layout Precautions and Power Supply Decoupling. ~ iii t 0.1 0.08 0.06 0.04 ~> a: g> LAYOUT PRECAUTIONS Analog and digital commons are not connected internally in the ADC85H series, but should be connected together as close to the unit as possible, preferably to a large ground plane under the ADC. If these grounds must be run separately, use a wide conductor pattern and a . O.OIILF to O.lILF nonpolarizaed bypass capacitor between analog and digital commons at the unit. Low impedance analog and digital common returns are essential for low noise performance. Coupling between analog inputs and digital lines should be minimized by careful layout. POWER SUPPLY DECOUPLING The power supplies should be bypassed with tantalum or electrolytic type capacitors as shown in Figure 4 to reduce noise during operation. These capacitors should be located close to the ADC. IILF electrolytic type capacitors should by bypassed with O.OIILF ceramic capacitors for improved high frequency performance. ~ 31 +5VDC • Dig. Com. T • 1PF .. I+ • 0.02 -Vee 0.01 ~ 1! 0.008 26 1pF 15 T+ 28 /+vcc-L 26~ ~ 10 100 1k 10k 30 Uffer Direct Out Input ~ + _ 125------,24 29 R, R, R, = ..#+5V Supply 1 Com. .. +15VDC .INPUT SCALING The analog input should be scaled as close to the maximum input signal range as possible in order to utilize the maximum signal resolution of the AI D converter. Connect the input signal as shown in Table III. See Figure 5 for circuit details. Buffer Input 0.001 Ana. FIGURE 4. Recommended Power Supply Decoupling. '0 0 0.006 if'. ~ 0.004 0.002. 15VDC 1pF 16 Jot I c.~ e" w·; LAYOUT AND OPERATING INSTRUCTIONS 100k Frequency (Hz) C~~p. 22------__----~------~~ Bipolar 23~ , Offset FIGURE 3. Power Supply Rejection vs Power Supply Ripple Frequency. VAEF Converter FIGURE 5. Input Scaling Circuit. 100 TABLE III. Input Scaling Connections. (a) For Buffered Inputl1l Input Signal Range Output Code ±10V COB orCTC 22 ±5V ±2.5V o to +5V o to +10V COB orCTC COB orCTC CSB CSB 22 22 26 26 Connect Connect Connect Pin 23 Pin 25 Pin 29 To Pin To To Pin Input Signal 13J Open Pin 22 Pin 22 Open For Direct Input!21 Connect Input Signal To Pin 25 25 24 24 24 24 24 24 24 24 NOTES: (1) Connect to pin 29 or input signal as shown in next two columns. (2) If the buffer amplifier Is not used, pin 30 must be connected to ground (pin 26). (3) The input signal is connected to pin 30 if the buffer amplifier is used. OPTIONAL EXTERNAL GAIN AND OFFSET ADJUSTMENTS Gain and Offset errors may be trimmed to zero using external gain and offset trim potentiometers connected to the ADC as shown in Figures 6 and 7. Multiturn potentiometers with lOOppmjOC or hetter TCRs are recommended for minimum drift over temperature and time. These pots may be any value from IOkO to 100kO. All resistors should be 20% carbon or better. Pin 27 (Gain Adjust) should be bypassed with O.OJJ,LF to reduce noise pickup and Pin 22 (Offset Adjust) may be left open if no external adjustment is required. Gain Adjust 10MCl 27~ To.01pF 26-1 Ana. Com. Clock Rate Control Alternate Connections If adjustment of the "Clock Rate is desired for faster conversion speeds, the Clock Rate Control may be connected to an external multiturn trim potentiometer with TCR of ± 100ppmj °C or less as shown in Figure 8. If the potentiometer is connected to -15VDC, conversion time can be increased as shown in Figure 8. If these adjustments are used, delete the connections shown in Table IV for pin 17. See Typical Performance Curves for nonlinellrity error vs. clock frequency, and Figure 9 for the effect of the control voltage on clock speed. Operation with clock rate control voltage of less than -IVDC is not recommended. 1 +5VDC Clock 17- _ _ __ Rate Control . Camp. In -15VDC 180kCl 180kCl ~~~ Clock Frequency Adjust 20 +15VDC 10kCl to 100kCl Offset Adjust 2kClor 5kCl . FIGURE 8. 12-Bit Clock Rate Control Optional Fine Adjust. (b) 1.8MCl 22 -~'.,., ..,., ...--........_~ 10kCl to 100kCl Gain Adjust FIGURE 7. Two Methods of Connecting Optional Gain Adjust. Adjust the Offset potentiometer until the actual end point transition voltage occurs at Eotl. The ideal transition voltage values of the input are given in Table I. +15VDC +15VDC -15VDC Adjustment Procedure OFFSET-Connect the Offset potentiometer as shown in Figure 6. Sweep the input through the end point transition voltage that should cause an output transition to all bits off (EOI~I'). (a) (b) +15VDC ~ 10kClto 100kCl Offset Adjust c: 0 'f!? ~ c: -= -15VDC 0 (.l ~ 10-Bit Operation 10 I'!!o~ ~ ""~~ , 12-8ilOperation t-- 8-8it Operation. ~ FlGURE 6. Two Methods of Connecting Optional Offset Adjust. GAIN-Connect the Gain adjust potentiometers as shown in Figure 7. Sweep the inpilt through the end point transition voltage that should cause an output transition voltage to all bits on (E?~). Adjust the Gain potentiometer until the actual end point transition voltage occurs at E?~. Table I details the transition voltage levels required. 15 "E ;:: -1 0 4 10 12 Control Voltage on Pin 17 1415 FIGURE 9. Conversion Time vs Clock Speed Control. Additional Connections Required The ADC85H series may be operated at faster speeds for resolutions less than 12 bits by connecting the Short Cycle input, pin 14,as shown in Table IV. Conversion 101 speeds, linearity and resolution are shown for reference. Specifications for lO-bit units assume connections as shown below. Converter Initialization On power-up, the state of the ADC internal circuitry is indeterminate. One conversion cycle is required to initialize the converter after power is applied. TABLE IV. Short Cycle Connections and Specifications . for 8- to 12-Bit Resolution. Resolution (Bits) Connect Pin 17 to f11 Connect Pin 14 to Maximum Conversion Speed (ps)f21 Maximum Nonlinearity at 2S"C (% of FSR) 12 10 Pin 1S Pin 16 Pin 2 Pin 16 10 6 131 0.012 0.048141 Output Drive Normally all ADC84, ADC85H, and ADC87H logic outputs will drive two standard TTL loads; however, if long digital lines must be driven, external logic buffers are recommended. . 8 Pin 28 Pin4 4 0.2014' NOTES: (1) Connect only if clock rate control is not used. (2) Maximum conversion speeds to maintain ±1/2LSB nonlinearity error. (3) 12-bit models only. (4) 10- or 12-bit models. 102 BURR-BROWN® ADC600 IElElI 12-BIT ULTRA-HIGH SPEED AID CONVERTER FEATURES • • • • • • • • • • HIGH RESOLUTION: 12 bils '!!' !!~~!'!.~ !!~T~: !:!G t!! l!:!M!!! • HIGH SINAO RATIO: 67dB • LOW HARMONIC DISTORTION: -71dB • LOW INTERMODULATION DISTORTION: -70dB • INPUT RANGE: ±1.25V • COMPLETE SUBSYSTEM: Contains Sample/Hold . and Reference • LOW DISSIPATION: B.5W • DoC TO +70°C AND -40°C TO +85°C DIGITAL SIGNAL PROCESSING RADAR SIGNAL ANALYSIS TRANSIENT SIGNAL RECORDING FFT SPECTRUM ANALYSIS HIGH·SPEED DATA ACQUISITION JAM·RESISTANT SYSTEMS SIGINT. ECM. AND EW SYSTEMS DIGITAL COMMUNICATIONS DIGITAL OSCILLOSCOPES DESCRIPTION The ADC600 is an ultra-high speed analog-to-digital converter capable of digitizing signals at any rate from DC to 10 megasamples per second. Outstanding dynamic range has been achieved by minimizing noise and distortion. . - Samplel Hold ~ MSB Flash Encoder ... Digital-to Analog Converter The ADC600 is a two-step subranging ADC subsystem containing an ADC, sample/hold amplifier, voltage reference, timing, and error-correction circuitry. Laser-trimmed ceramic submodules are mounted on a 17-square-inch multilayer PC motherboard. Logic is ECL. ~~ ~ LSB Flash Encoder - Digital Error Corrector (Adder) - Digital Output r- Internalional Airport Industrial Park· P.O. Box 11400· Tucson. Arizona 85734· Tel. (602) 746·1111 . Twx: 910·952·1111 . Cable: BBRCORp· Telex: 66-6491 PDS-642A 103. SPECIFICATIONS ELECTRICAL TA = +25°C, 10MHz sampling rate, Rs otherwise noted. = 50n, ±Vcc = 15V, VD01 = +5V, VOD2 = -S.2V, and 15-minute warmup in normal convection environment, unless ADC600K PARAMETER CON'DITIONS MIN TYP ADC600B MAX RESOLUTION MIN 12 INPUTS ANALOG Input Range Input Impedance Input capacitance Full scale -1.25 +1.25 1.5 5 DIGITAL logic Family ECll0k-Compatible Negative Edge Convert Command Pulse Width 10 I I TRANSFER· CHARACTERISTICS · · ACCURACY Gain Error Input Offset Integral Linearity Error Differential Linearity Error F = 200Hz DC F=200Hz F = 200Hz: 68.3% of all codes 99.7% of all codes 100% of all codes ±0.1 ±0.1 Missing Codes ±0.5 ±0.5 1.25 0.25 1.00 +1.25 -1.00 none CONVERSION CHARACTERISTICS Sample Rate DC First conversion 'Conversion Time 140 10M 150 · DYNAMIC CHARACTERISTICS Differential Linearity Error F = 4.9MHz: 68.3% of all codes 99.7% of all codes 100% of all codes 0.5 1.5 2.0 Total Harmonic Distortion C2! F= F' = F= F= 4.8MHz (OdB) O.58MHz (OdB) 2.4MHz (OdB) 0.58MHz (OdB) Fs='10MHz -71 -74 Fs = 5MHz -73 -74.5 Two-Tone Intermodulation Distortion c2J1.. J F = 4.88MHz (-6dB) 4.65MHz (-6dB) F = 2.40MHz (-6dB) 2.25MHz (-6dB) SignaHo-Noise and Dislortion (SINAD) Fs= 10MHz -70.5 Fs=.5MHz -74.5 Fs =10MHz 65.8 66.6 67.2 69 6 ±5 Ratio F= F= F= F= 4.8MHz (OdB) 0.58MHz (OdB) 2.4MHz (OdB) 0.58MHz (OdB) I Fs=5MHz Aperture Time Aperture Jitter Analog Inpul Bandwidlh Small Signal Full Power -20dB input OdB input 70 40 OUTPUTS Logic Family Logic Coding Logic Levels EOC Delay Time Trand Tf Data Valid Pulse Widlh Logie "LO" logic "HI" Data Out 10 DV 20% to 80% 50% 5 5 Operating VOD1 VOD2 Supply Currents: +Vcc +14.25 -14.25 +4.75 -4.95 Operating -Vee VODl VOD2 Power Consumption Operating 104 +15 -15 +5 -5.2 75 45 400 900 8.5 +15.75 -15.75 +5.25 -5.46 ..· ·· ·· MAX · ·· · ·· ·· ·· · ··· ·· · ·· ·· · ·· ·· · · ·· ·· ·· ·· ·· ·· · ··· ··· ··· · ··· ECl with pull-down to -VOD2 (see text) Offset Binary. Twos Complement -1.7 -0.9 35 5 8 POWER SUPPLY REOUIREMENTS Supply Voltages: +Vcc -Vee TYP UNITS Bits V Mil pF ns %FSR % FSR llI LSB LSB lSB LSB LSB Samplesls ns LSB lSB LSB dBC'" dBC dBC dBC dBC dBC, dB dB dB dB ns ps MHz MHz V V ns ns ns V V V V rnA rnA rnA rnA W ELECTRICAL (FULL TEMPERATURE RANGE SPECIFICATIONS) ±V6c == 15V, V00 1 = +SV, VOD2;;;; -S.2V, As:::: 500,15-minute warmup, and TA = TMIN to Tw.x, unless otherwise noted. ADC600K PARAMETER CONDITIONS MIN TYP ADC600B MAX MIN +70 +100 -40 TEMPERATURE RANGE Specific~tion TCASE Storage 0 -40 max TAMBIENT TYP . F = 200Hz DC F= 200Hz F=200Hz 63% of all codes 98% of all codes 100% of all codes Differential Linearity Error .. ±30 ±50 1.5 Sample Rate DC 0.5 1.25 1.5 10 UNITS · 'C 'C +85 ACCURACY Gain Error Input Offset Integral Linearity Error MAX ppm/'C pV/'C LSB · ·· ·· . LSB LSB LSB MHz 'Same as ADC600K NOTE: (1) FSR: full-scale range = 2.5Vp-p. (2) Units with tested and guaranteed distortion specifications are available on special order-inquire. (3) dBC = level referred to carrier (input Signal = OdB); F = input Signal frequency; F. = sampling frequency. (4) IMD is referred to the larger of the two input test Signals. If referred to the peak envelope signal (= OdB), the intermodulation products will be 6dB lower. MECHANICAL 4.500 ±0.010 , - 1 l' ' , - I -, ,~~~] r /151 0.156 Diameter 4 Places A B 0.007 r-r=====~3g8~~DED~7-DII~~~U~'~~~1 115DD CEl ~~ B @J I I ;;~~ 1 Pin Location 40 Places 101 AI BI 0.002<9)1 -- Mating Lead Socket: Mill-Max 0314 or equivalent. A ORDERING INFORMATION ABSOLUTE MAXIMUM RATINGS TJ ±Vcc "." .. ,', ..• ,.,", •. " •.••..•••..••.•••.••••.••••.•• ±16.5V VDD, .•....•.•...•...•...•••..• : ..••..•..••••.•••••••..••••. +7.0V VDD.2 ....................................................... -7.0V Analog Input ... , .......................................... ±5.0V Logic Input ......................................... VDD• to +0.5V Case Temperature ••••••...••......••...•......•.•...•..•.. 100'C Junction Temperature 'll .................................... 150°C Storage Temperature .....••.•........•..•••..••• -40'C to +100'C Stresses above these ratings may cause permanent damage to the device. ADC600 X 0 Basic Model Number _ _ _ _ _ _ _ _ _ _==r-_..J Performance Grade Code K = O'C to +70'C B = '-40 to +85'C - Reliability S c r e e n i n g - - - - - - - - - - - - - - - - ' Q = Q-Screened (1). See Table I for thermal resistance data. 105 achieving high conversion speed without sacrificing accuracy is a difficult task. The analog input signal is sampled by a high-speed sample/hold amplifier with low distortion, fast acquisition time and very low aperture uncertainty (jitter); A diode bridge sampling switch is used to achieve an acceptable compromise between speed and accuracy. The diode bridge switching transients are buffered from the analog input by a high input impedance buffer amplifier. Since the hold capacitor does not appear in the feedback of the diode bridge output buffer the capacitor can acquire the signal in 25ns. The low-biascurrent output buffer is then required to settle to only the resolution (7 bits) ofthe first (MSB) flash encoder in 25ns while an additional 60ns is allowed for settling to the resolution (12 bits) of the second (LSB) flash encoder. Sample/hold droop appears as only an offset error and does not affect linearity. Both the MSB and the LSB flash encoder (ADC) are high-speed 7-bit resolution converters formed by parallelconnecting two 6-bit flash ADCsas shown in Figure 2. The DAC +IOV reference is also used to generate reference voltages Cor the MSB and LSB encoders to compensate drift errors. Buffering and scaling are performed by 1m and Ic2. Laser-trimming is used to minimize voltage offset errors and optimize gain (input full-scale range) symmetry. The subtraction DAC is an ECL 7-bit resolution DAC with l4-bit accuracy. Laser-trimmed thin-film nichrome resistors on sapphire and high-speed bipolar circuitry allow the DAC output to settle to l4-bit accuracy in only 25ns. A "remainder" or coarse conversion-error voltage is generated by resistively subtracting the DAC output from the output of the sample/hold amplifier. Before the second (LSB) conversion, the "remainder" is amplified by a wideband Cast.-settling amplifier with a gain of 32V/V. ,To prevent overload on large amplitude transients, a high-speed FET switch blanks the amplifier input from the beginning of the S/H acquisition time to end of the MSB encoder update time. The timing circuits shown in Figure 3 supply all the critical timing signals necessary for proper operation of the ADC600. Some noncritical timing signals are also generated in the digital error correction circuitry. Timing signals are laser-trimmed for both pulse width and delay. The ECLJogic timing delay is stable over a wide range of temperatures and power supply voltages. Basic timing is derived from the output of a three-stage shift register driven by a synchronized 20MHz oscillator. The convert command pulse is differentiated by IC I to allow triggering by pulses from as narroW as 5ns to as wide as 75% duty cycle. This differentiated signal sets flip-flop IC2, placing the Sf H back into its sample mode . The output of the third stage of the shift register is also differentiated by ICg and used to generate a strobe for the LSB flash encoder. RI is laser-trimmed to generate a precise 8ns pulse while the oscillator frequency is adjusted to trim the strobe pulse delay. IC4 and ICs comprise the PIN ASSIGNMENTS 1 2 3 4 S 6 7 8 9 10 11 12 13 14 1S 16 17 18 19 20 Common Common 21 22 23 24 2S 26 27 28 29 VDD. (-S.2V) 30 Common Common 31 32 +Vee(+1SV) -Vee (-1SV) VDD2 (-S.2V) Voo. (+SV) 33 -Vee (-1SV) VDrn (-S.2V) VDD• (+SV) +Vee (+1SV) . Common VDD• (-S.2V) VDD. (+5V) Common Dala Valid Bil12 (LSB) Bil11 BI110 Bil9 Bil8 BI17 BI16 BilS Bil4 Bit 3 Bil2 BI11 (MSB) Bii1 (MSB) VDrn (-S.2V) 34 3S 36 37 Common 38 Convert Command 39 Anal<;>9 Inpul 40 Analog Inpul Relurn Common VDD• (-S.2V) VDD• (+SV) VDD. (-S.2V) tyPICAL PERFORMANCE CURVE ANALOG INPUT BANDWIDTH +2 iii' :!!. 5l c i "S ~ r- L 1~oJv~pl, +1 , o -1 -2 ~ -3 -4 '0 '0 -S 0. -6 ~ ~ -7 -8 0.1 0.2 0.6 1 6 10 20 60 100 Frequency (MHz) THEORY OF OPERATION The ADC600 is a two-step subrlmging analog-to-digital converter. This architecture is shown in Figure 1. The major system building blocks are: Sample/Hold Amplifier, MSB Flash encoder. DAC and Error Amplifier, LSB Flash Encoder, Digital Error Corrector, and Timing Circuits. The ADC600 uses individually tested and lasertrimmed submodules mounted on a four-layer motherboard to integrate this complex circuit into a complete analog-to-digital converter subsystem with state-of-theart performance. Conceptually, the subranging technique is simple: sample and hold the input signal,convert to digital with a coarse . ADC, convert back to analog with acoarse-resolution (but high-accuracy) DAC, subtract this voltage from the S / H output, amplify this "remainder," convert to digital with a second coarse ADC, and combine the digital .output from the first ADC (MSB) with the digital output from the second ADC (LSB): In practice, however, 106 Encoder LSB Flash Encoder I-'+-----"\. Digital ht----v' Output ~~---v~~-v~~ 1--+1------- ~~~~ LSB Strobe MSBStrobe Amphfier Enable ' - - - - - - - - - - - - - - - - - - - t S a m p l e / H o l d Gate >-=C.::o"'nv:..:e::.rt:..C::.o:..:m=m.::a"'nd=--_ _ _ _ _ _ _ _ _ _-t Start Timing FIGURE I. Block Diagram of l2-Bit IOMHz ADC600. ________~R~3~ 2' (MSB) +Reference r+R~;m~~ a-Bit Flash Encoder Analog In From Sample/Hold N------l'-----<- 2' t-:!:+:;:==:=j=:::::: ... 2' 24 H++-1>----+--- 2' H-++i-t--ir--- 2' L:-~R~ef~e~rn~n~c~e.tt-t1rt-rlr~-~27 1000 +Reference 6-Bit Flash Encoder No Ground on MSB Encoder R5 FIGURE 2. 7-Bit Flash Encoder. 107 Register Strobe R2 C2 Convert Command C Amplifier Enable Q IC2 IC3 20MHz Oscillator Sample IHoid Gate IC10 Ice ~ ~ IC7 , • ~ MSB Strobe FIGURE 3. Schematic of Timing Module. principal elements of a 20MHz ring oscillator. R2 and C2 add additional delay and allow laser-trimming for the LSB delay. A blanking pulse to prevent error amplifier overload is generated by the second stage of the shift register. Proper timing is generated by laser-trimming R3 which, along with C3 forms a delay element along with two gates of IC;. A strobe pulse of the MSB flash encoder is generated and trimmed in a similar circuit using IC7• This technique generates a variable width S/H gate pulse which is determined by the conversion command pulse period minus the fixed 67ns AOC conversion time AOC600 conversion rates are therefore possible above the 10M Hz specification but S/H acquisition time is sacrificed and accuracy is rapidly degraded. The output of the MSB encoder is read into a separate 7-bit latch at the same time the LSB encoder is being strobed. The latched MSB data, along with the LSB data, is then read into a 14-bit latch 30ns after the leading edge of the LSB strobe and before being applied to the adder, where the actual error correction takes place. This latch eliminates any critical timing problems that would result when the converter is operated at the maximum conversion rate. The function of the digital error correction circuitry (Figure 4) is to assemble the 7-bit words from the two flash encoders into a 12-bit output word. In addition, the circuit uses the LSB flash encoder strobe to generate timing strobes for both data registers. A data valid (OV) pulse is also generated which is used to indicate when output data can be latched into an external register. This OV pulse is delayed Sns after the output data has settled to allow a sufficient set-up time for an external ECL data latch. The 14-bit register output is then sent to a 12-bit .adder where the final data output word is created. The MSB data forms the most significant seven bits of a l2-bit word, with the last five bits being assigned zeros. In a similar fashion, the LSB data from the least significant bits form the other input to the adder with the first five bits being assigned zeros. As two l2-bit words are being added, the output of the adder could excee,d 12 bits in range; however, the final data output is only a 12-bit word, so a means of detecting an overrange is included. To prevent reading erroneous data, the converter data output reads all ones for a full-scale positive input or overrange and reads all zeros for a negative full-scale input or overrange. The d~ta output does not "roll-over" if the converter input exceeds its specified full-scale ' range of ±I.2SV. DISCUSSION OF PERFORMANCE DYNAMIC PERFORMANCE TESTING The AOC600 is a very high performance converter and careful attention to test techniques is necessary to achieve accurate results. Spectral analysis by application of a Fast Fourier Transform (FFT) to the AOC digitial output will provide data on all important dynamic performance parameters: total harmonic distortion (THO), signal-to-noise raito (SNR) or the more severe signal-tonoise-and-distortion ratio (SINAO), total noise and distortion (TNO), and intermodulation distortion'(IMO). 108 Register Strobe Data Valid Carry Out Bit t 2' 7-Bit Latch 7-Bit Latch A 2' ,, ,, Bit 2 , ,, 14-Bit Latch and 12-Bit Adder I I 7-Bit Data From ________________-,,/ LSBEnc~o~d~er B Latch 2" 2" I Bit 11 Bit 12 FIGURE 4. Block Diagram of Digital Error Corrector. A test setup for performing high-speed FFT testing of analog-to-digital converters is shown in Figure S. This was used to generate the typical FFT performance curves shown on pages 112 through I1S. To prese1'¥e measurement accuracy, a very low side-lobe window must be applied to the digital data before executing an FFT. A commonly used window such as the Hanning window is not appropriate for testing high performance converters; a minimum four-sample Blackman-Harris window is strongly recommendedY) To assure that the majority of codes are exercised in the ADC600 (12 bits), a ten-sample average of Sl2-point FFTs is taken. Dynamic Performance Definitions I. Signal-to-Noise-and-Distortion(2) Ratio (SINAD): 10 10 sine wave signal power g nOIse . +h armomc . power 2. Total Harmonic Distortion (THD): 10 log harmonic power (first nine harmonics) sinewave signal power 3. Total Noise Distortion (TND): 10 10 noise power g smewave . . I power signa 4. Intermodulation Distortion (IMD): 10 10 IMD product power, g. . al smewave sign power IMD is referenced(3' to the larger of the test signals f, or f2 • Five "bins" either side of peak are used for calculation of fundamental and harmonic power. The "0" frequency bin (DC) is not included in these calculations as it is oflittie importance in dynamic signal processing applications. Attention to test set-up details can p'revent errors that 109 contribute to poor test results. Important points to remember when testing high performance converters are: I. The ADC analog input must not be overdriven. Using a signal amplitude slightly lower than FSRwill allow a small amount of "headroom"so that noise will not overrange the ADC and "hard limit" on signal peaks. 2. Two-tone tests can produce signal envelopes that exceed FSR. Set each test signal to slightly less than -6dB to prevent "hard limiting" on peaks. 3. Low-pass filtering (or bandpass filtering) of test signal generators is absolutely necessary for THD and IMD tests. An easily built LC low-pass filter (Figure 6) will eliminate harmonics from the test signal generator. 4. Test signal generators must have exceptional noise performance (better than -IS5dBC) to achieve accurate SNR measurements(4). GO,od generators together with fifth-order elliptical bandpass filters are recommended for SNR' and SINAD tests. 5. The analog input of the ADC600 should be terminated directly at the input pin sockets with the correct filter terminating impedance (SOO or 7S0) or it should be driven by an OPA600 buffer. Short leads are necessary to prevent digital noise pickup. 6. A low-noise (jitter) clock signal (convert command) generator is required for good ADC dynamic performance. A recommended interface circuit is shown in Figure 7. Short leads are necessary to preserve fast, ECL rise times. t 7. Two-tone testing will require isolation between test signal generators to prevent IMD generation in the test generator output circuits. An active summing amplifier using an OPA600 is shown in Figure 8. This circuit will provide excellent performance from DC to Power Supplies ±15V +5V -5V (Probe Signals) Status Burr·Brown AOC600 Test Fixture 0106 A146-2 Rev. C GPIS Analog Output Tektronix 4052A Graphics Computer FIGURE 5. Test Setup for High Speed FFT Testing. 5MHz with harmonic and intermodulation distortion products typically better than -70dBC. A passive hybrid transformer signal combiner can also be used (Figure 9) over a range of about IMHz to 30MHz. The port-to-port isolation will be ".. 45dB between signal generators and the input-output insertion loss will be ".. 6dB. 8. A very low side-lobe window must be used for FFT . calculation. A minimum four-sample Blackman-Harris window function is recommendedY) 9. Digital data must be latched into an external ECL 12-bit register only by the Data Valid output pulse. Due to the possibility of improper timing, output data cannot be latched by using the convert command! 10. Do not overload the data output logic. These outputs are already provided with internal 68n pull-down ' resistors tied to -S.2V. II. A well-designed, clean PC board layout will assure proper operation and clean spectral response(S)(6). Proper grounding and bypassing, short lead lengths and separation of analog and digital signals and ground returns are particularly important for high frequency circuits. Multilayer PC boards are recommended for best performance, but a two-sided PC board with large, heavy (20z-foil) ground planes can give excellent results, if carefully designed. Prototyping "plug-boards" or wire-wrap boards will not be satisfactory. NOTES: 1. On the Use of Windows for Harmonic Analysis with the Discrete Fourier Transform, Fredric J. Harris. Proceedings of the IEEE, Vol. 66, No. I, January 1978. pp 51-83. 2. SINAD test includes harmonics ~hereas SNR does not include these important spurious products. ' 3. If IMD is referenced to peak envelope power, an improvement of 6dB. 4. ·Test Report: EFT Characterization of Burr-Brown ADC600K, Signal Conversion Ltd., Swansea, Wales, U.K. 5. MEeL System Design Handbook, 3rd Edition, Motorola Corp. 6. Motorola MECL. Motorola ~orp. 50n L, L. son L. L. In~ @out r IT or C9. + 9th Order 0.5dS Ripple Tchebychev Low-Pass Filter Attenuation at 2X cutoff frequency = 90dS. Cutoff frequency = -3dS frequency; to convert cutoff frequency to -0.5dB frequency. multiply all LC values by 0.9897. Culoff Freq. (MHz) C, C, C, C, C, L., L. L, (pF) (pF) (pF) (pF) (pF) (PH) (!JII) (PH) L, (!JII) 2.056 4.11 8.23 16.45 2.216 4.43 8.86 17.73 2.216 4.43 8.86 17.73 2.056 4.11 8.23 16.45 5.0 1134.6 1729.2 2.5 2269 3458 1.25 4538 6917 0.625 9077 13.833 1765.6 1729.2 1134.6 3531 3458 2269 7062 6917 4538. 14.125 13.833 9077 FIGURE 6. Ninth-Order Harmonic Filter. 110 -5.2V 82n ADC600 Convert Command 38 L '''\ _50n MC10115 ECL Line Receiver , ECL Inpul From Generator 49.9n 120n "'if" po FIGURE 7. Optional Convert Command Interface Circuit. 1kn r---~~~--------~ +15V, Optional transmission line back·termination resistor; increases insertion loss by 6dB. r- - - , I I ~ .Jr. 50n Oulpul .. 1kn 50n~ 49.9n In . . 49.9n Bandwidlh: DC 10 ;;, 70MHz Insertion Loss: OdB FIGURE 8. Active Signal Combiner. 50n Oulpul 49.9n 50n In @- 49.9n Jr ~ • 49.9n 10 lurns #24 AWG bitilar wound on Amidon FT 50-4310roid core. II II II II II Bandwidlh: -lMHz 10 = 30MHz In-Io-In Isolal;'on: = 45dB al5MHz In-Io-Oul Loss: - 6dB FIGURE 9. Passive Signal Combiner. 111 TYPICAL FFT SPECTRAL PERFORMANCE All FFT data: 512-point FFT, 10-sample average; minimum 4-sample Blackman-Harris Window. Sample Rate = 10MHz,Input Vollage = Full·Scale (OdB) Frequency (MHz) 0 -10 -20 Level re: Full·Scale -30 ~ CD :!'!. -40 " ~ 4.8438MHz Fundamental = -0.7 Harmonics: 21 ;:::: -80.5 31 = -74.7 41 = -86.6 -50 C. E ..: -60 SINAD =' 67.2dB TND = -69.5dBC THD = -71.0dBC -70 -80 -90 -100 Frequency (MHz) -10 -20 10 :e " ~ Level re: Full·Scale -30 ~ -40 0.6055MHz Fundamental = -0.6 "0 Harmonics: 2f ;::;: -84.7 -50 31 = -84.6 41 = -87.5 C. E ..: -60 SINAD = 69.6dB TND = -70.7dBC THD = -76.4dBC -70 -80 -90 -100 Frequency (MHz) -6 -16 -26 Level re: Full·Scale -36 10 :e ~ F,: 4.9219MHz = -6.3 F,: 4.6484MHz = -6.3 Peak Envelope = -0.6 -46 ~ "0 .ec. E < -56 -66 IMD: 0.4883MHz = -80.8 4.1797MHz = -76.3 4.4336MHz = -78.9 -76 -86 -96 -106 112 'TYPICAL FFT SPECTRAL PERFORMANCE (CONT) All FFT data: 512-point FFT, 10-sample average; minimum 4-sample Blackman-Harris Window. Sample Rate = 10MHz, Input Voltage = Hall-Scale (-6dB) Frequency (MHz) 0 2 3 0 -10 II, III -20 Level re: Full-Scale -30 iii' I"il ~ -40 '" -50 "ill -50 tiilill "',,1 -70 :I,:il]! -80 !ii ~ 0. E ..: III,!'i 1 1 ~ 4.B438MHz Fundamental = -5.B Harmonics: 2f = -85.4 31 = -89.1 41 = -90.1 1::::1: SINAO TNO THO = 54.0dS = -65.2dBC = -70.2dSC -90 -100 Frequency (MHz) 0 2 3 0 -10 -20 Level re: Full-Scale -30 ~ iii' ~ -40 ~ '" -50 0. E ..: -50 0.5055MHz Fundamental = -5.5 Harmonics: 2f :;:: -86.6 = 31 -84.2 41 = -84.9 SINAO = 53.7dS -55.,1dSC TNO THO -69.2dBC -70 = = -80 -90 -100 Frequency (MHz) 0 -12 -22 -32 iii' -42 '" .~ -52 Level re: Full-Scale ~ ~ '0 0. E F,: 4.9219MHz = -12.35 F,: 4.5484MHz = -12.45 Peak Envelope = -5.7 -62 ..: -72 IMO: 0.2734MHz 0.4883MHz 4.7555MHz -82 -92 -102 -112 113 = -85.5 = -84.5 = -85.3 TYPICAL FFT SPECTRAL PERFORMANCE (CO NT) All FFT data: 512-point FFT, 10-sample average; minimum 4-sample Blackman-Harris Window. Sample Rate: 5MHz, Input Vollage : Full-Scale (OdB) 2.5 Level re: Full-Scale ~ : 2.4121 MHz Fundamental: Harmonics: 21 : 31: 41: -0.6 -77.9 -83.1 -85.3 SINAO : 67.3dB TNO : -68.5dBC THO: -73.3dBC 2.5 Level re: Full-Scale ~ 0.5859MHz Fundamental : Harmon ies: 21 : 31: 41: -0.7 -81.4 -87.2 -87.0 . SINAO : 69.6dB TNO : -70.7dBC THO: -76.1dBC 2.5 Level re: Full-Scale ~ F,: 2.2461MHz : -6.3 F.: 2.4023MHz : -6.4 Peak Envelope : -0.7 IMO: 0.3809MHz :. -81.2 2.0996MHz : -82.9 2.4707MHz : -83.9 114 TYPICAL FFT SPECTRAL PERFORMANCE (CO NT) All FFT data: S12-point FFT, 1D-sample average; minimum 4-sample Blackman-Harris Window. Sample Rate = 5MHz, Input Voltage = Hall-Scale (-6dB) Frequency (MHz) 0 O.S 1 1.S 2 2.S 0 -10 -20 Level re: Full-Scale -30 iii ~ :2- -40 '" :E 'C 2.4121MHz Fundamental = -6.6 -SO Harmonics: 2f = -87.6 'li E -60 31 = -80.4 41 = -88.3 « -70 SINAO = 64.3dB TNO = -6S.7dBC THO = -69.9dBC '-80 -90 -100 Frequency (MHz) 0 O.S 1 , 1.S 2.S 0 -10 -20 Level re: Full-Scale -30 ~ iii ., ':2- -40 0.S8S9MHz Fundamental = -6.6 Harmonics: 21 = -84.6 31 = -8S.9 41 = -87.8 'C :E -SO « -60 'li E SINAO = 64.8dB TNO = -6S.9dBC THO = -71.3dBC -70 -80 -90 -100 Frequency (MHz) 0 O.S 1 1.S 2.S -12 -22 -32 Level re: Full-Scale -42 ~ iii :2- -S2 :E " -62 'li E « -72 'C F,: 2.2461MHz t=.: 2.4023MHz = -12.4 = -12.4 Peak Envelope = -6.8 IMO: 1.6406MHz = -87.S 1.87S0MHz = -86.7 2.4609MHz = -86.0 -82 -92 -102 -112 115 DIGITIZING INPUT WAVEFORMS The response of the ADC600 is illustrated by the digitized waveforms of Figure 10. The 4.99MHz sine wave near the Nyquist limit is virtually identical to much lower frequency sine wave input. The under-sampled 19.999MHz sine wave illustrates the ADC600's excellent analog input full-power bandwidth. Figure 11 shows a block diagram of this high-speed digitizer. HISTOGRAM TESTING Histogram testing is used to test differential nonlinearity of the ADC600. This system block diagram is shown in Figure 12 and histogram test results for a typical converter are shown in Figure 13. Note that differential nonlinearity is 1/2LSB at 200Hz and it shows virtually no degradation near the Nyquist limit of 5MHz; there are no missing codes present and the peak nonlinearity does not exceed I LSB. Histogram t~sting is a useful performance indicator as the width of all codes can be determined. SPECTRUM ANALYZER TESTING A beat-frequency technique (Figure 14) can be used to view digitized waveforms on an oscilloscope and, with care, this technique can also be used for testing highspeed ADC dynamic characteristics with an analog spectrum analyzer. In this method a test signal is digitized by the ADC600 and the output digital data is latched into an external ECL latch by the converter Data Valid output pulse driving a divide-by-N counter. The holding register drives a 12-bit video-speed DAC which reconstructs the digital signal back into an analog replica of the ADC600 input. This analog signal also includes distortion products and noise resulting from the digitization, which can be viewed on an ordinary RF spectrum analyzer. Typical results are shown in Figures IS and 16. . It is important to realize that the distortion and noise measured by this technique include not only that from the ADC600, but also the entire analog-to-analog test 10MHz Sample rate. 2.5Vp-p Input signal F=4.999MHz . F = 1.000kHz ,/"-. \ r V F= 2.499MHz F = 19.999MHz FIGURE 10. Digitized Waveforms (512 points). 116 HP 9000. 300 Computer ECL Data Latch And HighSpeed RAM In HP3325A Synthesizerl Function Generator ADC600 ADC Cony, HP3325A Synthesizer! Function Generator Latch Fs • Plotter Out HP9133 Computer FIGURE II. High-Speed Digitizer. 'v'w"'", Clock Generator \ HP3325A Synthesizer Convert Command Digital Analog Input Function Data 12-Bit 10MHz ADC600 Generator Handshake Logic HP9816 Computer Data Valid HP3456 DVM IEEE-488 FIGURE 12. Block Diagram of Histogram Test. system. Nonlinearity of the reconstruction circuit must be very low to measure a high performance ADC, and this places severe requirements on the DAC, deglitcher, and buffer amplifiers. Using the high-speed video DAC63 in the analog reconstruction circuit aliows excellent test circuit linearity to be achieved. Clocking the DAC (demodulating) at felN allows a longer settling time and keeps linearity high in the digital-to-analog portion of the test circuit. Spectrum analyzer dynamic range can be a limiting factor in this method and a sharp notch filter can be used to attenuate the high-level fundamental frequency. Attenuating the fundamental allows the spectrum analyzer to be used on a more sensitive range without generating distortion products within the input of the analyzer. Note that even though the signal is demodulated at a frequenpy of sample ratejN (here N = 2 or 4), the distortion products still maintain a correct frequency relationship to the fundamental. While this analog tech. nique shows excellent performance, it cannot exclude 'some distortion products unavoidably generated within the analog reconstruction portion of the test system. For this reason, the digital FFT technique is capable of more accurate high-speed analogi digital converter dynamic performance measurements. TIMING The ADC600 generates .all necessary timing signals in laser-trimmed submodules. Only the timing between Convert Command, Output Data, and Data Valid must 117 DL Histogram DL Histogram Frequency = 200Hz Frequency = 4.9MHz Differential Nonlinearity Dillerentlal Non. linearity FIGURE 13. Histogram Test Results (10M Hz Sample Rate). NOTE: Two generators shown (IMDtest) FIGURE 14. Analog-to-Analog Spectral Analysis by Beat-Frequency Techniques. . \ be considered. Proper timing is shown in Figure 17. The output data cannot be timed by the conversion clock, since the data from the 12-bit adder is not guaranteed until the Data Valid pulse is generated. Data should be latched into an' external 12-bit ECL register that can operate reliably with a set-up time of 5ns minimum (Figure IS). Logic conversion to TTL can be accomplished by logic level translator ICs (such as 10125 or 10124), but care must be exercised, since TTL is very noisy and maintaining a clean analog signal can be difficult. To preserve the low noise of ECL logic, any conversion to TTL should be done on a separate circuit board which is driven by differential ECL drivers. THERMAL' REQUIREMENTS The ADC600 is tested and specified over a temperature range ofO°C to +70°C (K grade) and -40°C to +S5°C (B grade). The converters are tested in a forced-air environment with a 10 SCFM air flow. The ADC60U can be operated in a normal convection ambient-air environment if submodule case temperature does not exceed the upper limit of its specification.!') High junction temperature can be avoided by using forced-air cooling, but it is not required at moderate ambient temperatures. Worst-case junction temperature «(he) and top-surface submodule (8CA) are presented in Table I to aid the designer in determining cooling requirements. L FASr Applications Handbook, 1987. Fairchild Semiconductor Corp.' 2. Fairchild Advanced CMOS Techn%gy, Technology Seminar Notes. 1985. 3. Impedance Matching 1Weaks Advance CMOS IC Testing, Gerald C. Cox, Electronic Design, April, 1987. 4. Grounding for Electromagnetic Compatibility. Jerry H. Bogar. Design News, 23 February, 1987. I. Maximizing Heat Transfer from PCBs, Machine Design, March 26, 1987, Jeilong Chu~g. 118 Fs = B.OOOMHz. F = 1.73MHz. 2.5Vp-p Input Level (OdB) -20 -30 -40 iii' -50 ~ :; .e 6 C) 0 -60 OJ c: « -70 -BO 21s , , 31s Sis "-- a 1 61s , .; I ! ~ i A jTr·~~~ o IFBW=1kHz 100 200 300 400 500 600 Frequency (kHz) 700 BOO 900 1K -- = Notch Filter Loss Correction FIGURE 15. Analog-to-Analog Harmonic Distortion. Notch Filter at Midpoint""" a Fs = B.6249MHz F, = 1.93BB5MHz -6dB Input Level ',~ I I, I I I I -10 F, = 1.79517MHz -6dB Input Level I I I --20 iii' -30 ~ :; c. :; 0 -40 C) 0 OJ c: « -50 -60 \2',-', -70 -~ f2 -1 1 21,-1, 41,-31, ~a.. .-. 31 2 -311 21rll::. I .A- 1 1- - 311 -21 2 I d.. I ... .J. .A. .A -BO 0 100 200 300 400 500 Frequency (kHz) FIGURE 16. Analog-to-Analog Two-Tone IMD. 119 600 700 BOO 900 1K --- = Notch Filter Loss Correction TABLE I. Cooling Requirement Factors. Power 25°C Amblent Air Normal Con.ecllon DIP Package SubmOdule Dissipation (W) BJc(OCIW) BOA (OCIW) 1\'pe SHC600 SM10343 SM10344 SM10345 SM10346 SM10347 1.5 1.6 1.6 1.6 2.1 1.1 28.7 17.5 10.6 17.5 8.6 17.3 23.3 24.4 21.3 21.9 24-pin 24-pin 32-pin 24-pin 4o-pin 4o-pin 16T 28.2 other than those specified. Burr-Brown's detailed procedures may vary slightly, model-to-model, from those in MIL-STD-883. Table III shows the board-level screening flow for ADC600Q. TABLE II, Screening Flow for ADC600Q (active components). Screen Internal Visual Burr-Brown Electrical. Test Burr-Brown test procedure Not Valid X 'Valid High Temperature Storage (Stabilization Bake) Not lVaiid XValid Ji'Iid Temperature Cycling Data Valid 20 I 60 Screening Le..1 OC4118 Convert Command I 40 MIL-STD-883, Method, Condition I P I I I I I I I I 80 100 120 140 160 180 200 220 240 260 100S 24 hour, +125°C 1010 10 cycles, -55OC to -125°C Constant Acceleration 2001. A 2000 G; Y Axis only Burn":l" 1015,0 160 hour. +S5 or + 70°C, steady-state Hermeticity:' Fine Leak Gross Leak 1014,C Nanoseconds FIGURE 17. ADC600 Timing Diagram. bubble test only, preconditioning omitted Final Electrical Burr-Brown test procedure Exiernal Visual ENVIRONMENTAL SCREENING The. inherent reliability of a semiconductor device is controlled by the design, materials, and fabrication of the device-it cannot be improved by testing. However, the use of environmental screening can eliminate the majority of those units which would fail early in their lifetimes (infant mortality) through the application of carefully selected accelerated stress levels. Burr-Brown Q models are environmentally-screened versions of our standard industrial products, designed to provide enhanced reliability. The screening illustrated in Table II is performed to selected methods of MIL-STD-883.' Reference to these. methods provides a convenient way of communicating the screening levels and basic procedures employed; it does not imply conformance to any other military standards or to any methods of MIL-STD-883 Burr-Brown aC5150 TABLE III. Screening Flow for ADC600Q (board level). Screen External Visual MIL-STD-183, Method, Condition Screening Level Burr-Brown ac Specification Electrical Test Burr-Brown Data Sheet Stablilization Bake Bum-In 100S 24 hour, +125°C 1015.0 160 hour, +S5°C or + 70°C steady-state Final Electrical Burr-Brown Final External ViSual Burr-Brown Data Sheet Analog ADC Board ac Specification Pull-up Resistor r--~~d."';'''----- Only Required "FACT~" For "FACr' Logic "FAST~." or TTL Logic 1. ECL latch provides differential ECL output which is properly timed (Valid) data. 2. Data can be transmitted with termin-' ated cable between boards. Differential logic keeps ground- return noise low. 3. Log ic level is translated to TTL by MC 10125 which is mounted on the noisy digital logic PC board. 4. Use good bypass capacitor (not shown) and heavy ground plane (;?75% copper) PC boards. FACT'" FAST'" Fairchild Semiconductor Corp. VOD2 (-5.2V) Dual Latch FIGURE 18. ECL/TTL Logic Interface. 120 THIS PAGE INTENTIONALLY LEFT BLANK 121 THIS PAGE INTENTIONALLY LEFT BLANK 122 BURR-BROWN® DAC80 DAC80P IElElI Monolithic 12-Bit DIGITAL-TO-ANALOG CONVERTERS FEATURES • • • • • • • • • • INDUSTRY STANDARD PINOUT LOW POWER DISSIPATION: 345mW FULL ±lOV SWING WITH Vee = ±12VDC DIGITAL INPUTS ARE TTL- AND CMOS-COMPATIBLE GUARANTEED SPECIFICATIONS WITH ± 12V AND ±15V SUPPLIES SINGLE-CHIP DESIGN ±1I2LSB MAXIMUM NONLINEARITY, DoC to +70°C GUARANTEED MONOTONICITY, DoC to HO°C TWO PACKAGE OPTIONS: Hermetic side-brazed ceramic and low-cost molded plastic SETTLING TIME: 4118 max to ±O_O1% of Full Scale DESCRIPTION This monolithic digital-to-analog converter is pin" for-pin equivalent to the industry standard DAC80, first introduced by Burr-Brown. Its single-chip design includes the output amplifier and provides a highly stable reference capable of supplying up to 2.5mA to an external load without degradation of D / A performance. . This conllerter uses proven circuit techniques to provide accurate and reliable performance over temperature and power supply variations. The use of a buried zener diode as the basis for the internal reference contributes to the high stability and low noise of the device. Advanced methods of laser trimming result in precision output current and output amplifier feedback resistors, as well as· low integral and differential linearity errors. Innovative circuit design enables the DAC80 to operate at supply voltages as low as ± II.4V with no loss in performance or accuracy over any range of output voltage. The lower power dissipation of this 1I8-mil bv PI-mil chin re .5 SEtTLING TIME .,""'" Settling time for each DAC80 model is the total time (i,ncluding slew time) required for the output to settle within an error band around its final value after a change in input (see Figure I). J:: 0 -Vee 0.01 '0 - ~ +15V Supply .L ~ GAIN ADJ. ROTATES THE LINE INPUT = FFFFH ~+-I-I"""~~+flr-",,-tl-'-+1-+1-;( DIGITAL INPUT FIGURE 4. Relationship of,Zero and Gain Adjustments for Unipolar D/A Converters, DAC708 and DAC709. OPERATING INSTRUCTIONS POWER SUPPLY CONNECTIONS For optimum performance and noise rejection, power supply decoupling capacitors should be added as shown in the Connection Diagram. l/-LF tantalum capacitors should be located close to the D / A converter. EXTERNAL ZERO AND GAIN ADJUSTMENT Zero and gain may be trimmed by installing external zero and gain potentiometers. Connect these potentiometers as shown in the Connection Diagram and adjust as described below. TCR of the potentiometers should be lOOppm/oC or less. The 3.9Mfl and 270kfl resistors (±20% carbon or better) should be located close to the D j A converter to prevent noise pickUp. If it is not convenient to use these high-value resistors, an equivalent "Too network, as shown in Figure 3, may be substituted in place of the 3.9Mfl resistor. A O.OOI/-LF to O.OI/-LF ceramic capacitor should be connected from GAIN ADJUST to ANALOG COMMON to prevent noise pickUp. Refer to Figures 4 and 5 for the relationship of zero and gain adjustments to unipqJar D j A converters. RANGE AND OffSET ADJUST FIGURE 5. Relationship of Zero and Gain Adjustments for Bipolar Dj A Converters, DAC705j706j707 and DAC708j709. 137 TABLE II. Digital Input And Analog Output Voltage/Current Relationships. VOLTAGE OUTPUT MODELS Analog Oulpul Digital Inpul Code One LSB 'FFFFH OOOOH Analog Oulpul 'Unlpolar, 010 +10V 16-BII 15·BII 14·BII Unlls 153 +9,99985 0 305 +9,99969 0 610 +9.99939 0 pV V V Dlgllal Inpul Code Bipolar, ±10V One LSB 7FFFH 8000H Bipolar, ±5V 16·BII 15·BII 14·BII 16·BII 15-BII 14-BII Unlls 305 +9.99980 -10.0000 610 +9.99939 -10.0000 1224 +9.99878 -10.0000 153 . +4.99980 -5.0000 305 +4.99970 -5.0000 610 +4.99939 -5.0000 pV V V CURRENT OUTPUT MODELS Analog Oulpul Digital Input Cdd. On. LSB FFFFH OOOOH Analog Oulpul Digital Inpul Code 'Unlpolar, 0 10 -2mA 16-BII 15·BII 14·BII Unll. 0.031 -1.99997 0 0.061 -1.99994 0 0.122 -1.99988 0 pA rnA rnA Bipolar, ±lmA On. LSB 7FFFH 8000H 16·BII 15·BII 14·BII Units 0.031 -0.99997 +1.00000 0.061 -0.99994 +1.00000 0.122 -0.99988 +1.00000 pA rnA rnA *MSB assumed to be Inverted externally. Gain Adjustment Apply the digital input that gives the maximum positive output voltage. Adjust the gain potentiometer for this positive full-scale voltage. See Table II for positive fullscale voltages and the Connection Diagrams for gain adjustment circuit connections. LOGIC TIMING· Perillal Dr Serlll Olllinpul low lew t. w two IoH INTERFACE LOGIC AND TIMING DAC70an09 The signals CHIP SELECT (CS), WRITE (WR), register enables (Ao, At, and Ai) and CLEAR (CLR), provide the control functions for the microprocessor interface. They are all active in, the '!low" or logic "0" state. CS must be low to access any of the registers. An and Al steer the input. 8-bit data byte to the low- or high-byte, input latch respectively. A2 gates the contents ofthe two input latches through to the, D/ A latch in parallel. The contents are then applied to the input of the D / A converter. When WR goes low, data is strobed into the latch or latches which have been enabled. The serial input mode is activated when both Ao and Al are logic "O"·simultaneously. The DO (D8)/SI input data line accepts the serial data MSB first. Each bit is clocked in by a WR pulse. Data strobed through to the D/ A latch by A2 going to logic "0" the same as in the parallel input mode. . 'is Each of the latches can be made "transparent" by maintaining its enable signal at logic "0". However, as stated above, when both Ao and Al are logic "0" at the same time, the serial mode is selected. The ern line resets both input latches to all zeros and sets the D / A latch to OOOOH; This is the binary code that gives a null, or zero, at the output of the D / A in the bipolar mode. In the unipolar mode, activating CLR will cause the output to go to one-half of full scale. The maximum clock rate of the latches is 10MHz. The minimum time between write (WR) pulses for successive enables is 20ns. In the serial input mode (DAC708 and DAC709), the maximum rate at which data can be clocked into the input shift register is 10MHz. The timing of the control signals is given in Figure 6. TIMING DIAGRAM 0111 Vilid 18 and II Over Tall!plrltura ns. max ns. min Wi 80 80 80 80 Ci Vilid 18 and DI Wi AD. Ai. A2 valid 18 end II Wi Wrlll pul.. wldtlt Data hold IlIIr and 01 Wi 0 rlew----l Ci----~~ I./~----- ~~~J:===~~./.~----I. :IOW-1 iii,AI,A2" ~=OI~l:SI---------~ Wii--------~,~~,~~ I~r------ 10H-1 ~ y~------- !-Iwp=! FIGURE 6. Logic Timing Diagram. DAC706/707 The DAC705j706j707 interface timing is the same as that described above except instead of two 8-bit separately-enabled input latches, it .has a single 16-bit input latch ,enabled by Ao. The D/ A latch is enabled by AI. Also, there is no serial-input mode and no CHIP SELECT (CS) line. INSTALLATION CONSIDERATIONS Due to the extremely-high accuracy of the D / A converter, system design problems such as grounding and contact resistance become very important. For a 16-bit converter with a +IOV full-scale range, ILSB is 153/LV. With a load current of 5mA, series wiring and connector resistance of only 30mn will cause the output to be in error by lLSB. To understand what this means in terms 138 of a system layout, the resistance of typical I ounce copper-clad printed circuit board material is approximately lJ2mn per square. In the example above, a 10 milliinch-wide conductor 60 milliinches long would cause a lLSB error. In Figures 7 and 8, lead and contact resistances are represented by RI through Rs. As long as the load resistance RL is constant, R, simply introduces a gain error and can pe removed with gain calibration. R3 is part of RL if the output voltage is sensed at ANALOG COMMON. Figures 8 and 9 show two methods of connecting the currrent output model with an external precision output op amp. By sensing the output voltage at the load resistor (connecting RF to the output of the amplifier at RL) the effect of RI and R, is greatly reduced. RI will cause a gain error but is independent of the value of RL and can be eliminated by initial calibration adjustments. The effect of R, is negligible because it is inside the feedback loop of the output op amp and is therefore greatly reduced by the loop gain. DAC706 OR OAC71N1 ANALOG COMMON ±v"" SUPPLY FIGURE 9. Alternate Connection for Ground Sensing at the Load (Current Output Models). -v"" DIGITAL COMMON In many applications it is impractical to sense the outpUt voltage at ANALOG COMMON. Sensing the output voltage at the system ground point is permissible because these converters have separate analog and digital common lines and the analog return current is a nearconstant 2mA and varies by only IOI'A to 20l'A over the entire input code range. R. can be as large as 3.0 without adversely affecting the linearity of the DJ A converter. The voltage drop across R. is constant and appears as a zero error that can be nulled with the zero calibration adjustment. Another approach senses the output at the load as shown in Figure 9. In this circuit the output voltage is sensed at the load common and not at the D JA converter common as in the previous circuits. The value of R. and R7 must be adjusted for maximum common-mode rejection across RL. The effect of R. is negligible as explained previously. The D JA converter and the wiring to its connectors should be located to provide optimum isolation from sources of RFI and EMI. The key to elimination of RF radiation or pickup is small loop area. Signal leads and their return conductors should be kept close together such that they present a small flux-capture cross section for any external field. Voo SUPPLY v" FIGURE 7. DAC705j707j709 Bipolar Output Circuit (Voltage Out). ENVIRONMENTAL SCREENING IQM Screening All BH and SH models are available with Burr-Brown's JQM environmental screening for enhanced" reliability. The screening, tabulated below, is performed to selected methods of MIL-STD-883. Reference to these methods provides a convenient method of communicating the FIGURE 8: DAC706j708 Bipolar Output Circuit (with External Op Amp). 139 screening levels and basic procedures employed; it does not'imply conformance to any other military standards or to any methods of MIL-STD-883 other than those specified below. Burr-Brown's detailed procedures may vary slightly, model-to-model, from those in MIL-STD883. SCREENING FLOW FOR /QM MODELS MIL-STD-883 Screen Internal Visual Method CondlUon 2017 B 1008 C +150'C. 24hrs Comments High Temperature Storage (Stabilization Bake) Cycling 1010 C -6510 +150'C. 10 cycles Burn-in 1015 B +125'C. 160hrs Constant Acceleration 2001 B E 10.OOOG 30.000G Temperature 28-pin pkg. 24-pin pkg. Hermeticity Fine Leak 1014 AlorA2 2 X 10-7 atmee/sec 5 X 10-8 atmce/sec 28-pin pkg. 24-pin pkg. Gross Leak 1014 External Visual 2009 C 60psig.2hr APPLICATIONS LOADING THE DAC709 SERIALLY ACROSS AN ISOLATION BARRIER A very useful application of the DAC709 is in achieving low-cost isolation that preserves high accuracy. Using the serial input feature of the input register pair, only three signal lines need to be isolated. The data is applied to pin II in a serial bit stream, MSB first. The WR input is used as a data strobe, clocking in each data bit. A· RESET signal is provided for system startup and reset. These three signals are each optically isolated. Once the 16 bits of serial data have been strobed into the input register pair, the data is strobed through to the D/A register by the "carry" signal out of a 4-bit binary synchronous counter that has counted the 16 WR pulses used to clock in the data. The circuit diagram is given in Figure 10. VDD + POWER SUPPLY VOLTAGE , '::' L -ISOLATION BARRIER DATA STROBE SERIAL INPUT A2 ---v-v-v-v-... ~ ~"'.!!f15\.!!...l ~ I ANALOG OUTPUT --------1'V FIGURE 10. Serial Loading of Electrically Isolated DAC708!709. . WR~::::::::::::::::::::::~~ Iftil~~--------------------~ CONNECTING MULTIPLE DAC707s TO A 16-BIT MICROPROCESSOR BUS Figure 11 illustrates the method of connecting mUltiple DAC707s to a 16-bit microprocessor bus. The circuit shown has two DAC707s ana uses only one address Ime to select either the input register or the D / A register. An external address decoder selects the desired converter. • pP AoI------4i FIGURE II. Connecting Multiple DAC707s to a 16Bit Microprocessor. 140. BURR-BROWN® DAC729 IElI3I / ADVANCE INFORMATION Subject to Change Ultra-High Resolution 18-Bit DIGITAL-TO-ANALOG CONVERTER FEATURES _- tll.IIIT IINr:ftIlITV r.IIIIIIIINTl=l=n II( r.Rllnl=l IV . . . . . . . . . . _ . . . . . . . _ _ .......... ___ '" _ •••• _ _ , • USER ADJUSTABLE TO lB·BIT LINEARITY (K GRADE) • PRECISION. INTERNAL REFERENCE NOT DEDICATED • FAST SETTLING. LOW NOISE INTERNAL OP AMP NOT DEDICATED • LOW TEN!PERATURE DRIFT • HERMETIC 40-PIN CERAMIC PACKAGE • louT OR VOUT OPERATION Precision DESCRIPTION 10V 18-Bit The DAC729 sets the standard in very high accuracy digital-to-analog conversion. It is supplied from the factory at a guaranteed linearity of 16 bits, and is useradjustable to 18-bit linearity (ILSB = FSR/262144). To attain this high level of accuracy, the design takes advantage of Burr-Brown's thin-film monolithic DAC process; dielectric op amp process, hybrid capabilities, and advanced test and laser-trim techniques. The DAC729 hybrid layout is specifically partitioned to minimize the effect of external load-currentinduced thermal errors. The op amp design consists of a fast settling precision op amp with a current buffer within the feedback loop. This architecture isolates the load from the op amp, which results in a fast settling (IS/-Ls to 18 bits) op amp 'that boasts an open-loop gain of over SOOk. The standard 40-pin package offers full hermeticity, contributing to the excellent reliability of the DAC729. Referente lOUT DAC 5kfl 5kfl 5kfl 5kfl I Inlern,lIon,l Airporllnduslrlal Park· P.O .. 80x 11400· Tucson. Arizona 85734 . Tel. (602) 746·1111 . Twx: 91()'952·1111 • C,ble: 88RCORp· Telex: 66·6491 PDS-749 141 SPECIFICATIONS ELECTRICAL Typical at 25'C, ±Vcc = 15VDC. DAC729JH MODEL PARAMETER MIN DAC729KH MAX TYP MIN TYP MAX UNITS ·,, Bits V V I'A I'A ±0.0007 ±0.0015 % of FSR l41 % 01 FSR % mV mV I'A I'A Bits Bits INPUT DIGITAL INPUT Resolution Digitallnputs41l : V1H V" I)HI VIN hL. VIN 18 +2.4 0 +VL +0.8 +5.0 -300 = 2.7V = DAV ·· · , TRANSFER CHARACTERISTICS ACCURACY'" Linearity Error(3 ) Differential linearity Error Gain Error (51 Offset ErrorIS): Voltage, COSIS' eSSie) Current, COB CSB Monotonicily (O'C to 70'G) Differential linearity Adjustment Resolution C71 ±0.0015 ±0.003 ±0.10 ±10 ±0.8 ±5 ±1 ±0.05 ±5 ±0.5 15 ·· , 16 17 DRIFT (Over Specification Temperature Range) Total Voltage Error Over Temperature (DOC to +70°C)(SI Total Full-Scale Drift Gain Drift (Excluding Reference Drift) Offset Drift (Excluding Reference Drift): COB CSB Linearity Error Over Temperature Differential Linearity Error Over Temperature , , , , , 17 18 · ·· · , ±0.100 ±0.18 ±3.0 ±5.0 ±2.0 ±1.0 ±1.0 ±0.050 ±9 ±1 ±2.0 ±0.5 ±0.5 ±0.5 ±7 , , ±15 ±0.25 ±0.25 ±0.50 ±0.50 , % of FSR ppm of FSR/'C ppm/'C ppm of FSR/'C ppm of FSR/'C ppm of FSR/'C ppm of FSR/'C OUTPUT VOLTAGE OUTPUT MODE Ranges: COB CSB Output Current Output Impedance Short Circuit Duration ±5 .1 I I · 0.15 Indefinite to Common CURRENT OUTPUT MODE COB Ranges Output Impedance CSB Ranges Output Impedance Output Current Tolerance Compliance Voltage , -1 to+5 5 4 20 500 0.45 300 8 7 10.000 10.Q10 +4.0 ±2.5 ±1.0 , ·· , , ·· · , Inderite 10 COlman +9.990 10 10.010 -1.0 -2.0 142 V V mA 0 ··· · ±0.1 +9.990 , , , Indefinite to Common ±1.0 2.86 Oto-2 4.0 SETTLING TIME (To ±O.00038% of FSR)'" Voltage (Load = 2kO II 100pF): Full-Scale Step 1LSB Step (Major Carryto! Slew Rale Switching Transient Peak Switching Transient Energy Currenl Full-Scale Step (2mA X 100) REFERENCE Output (pin 32): Voltage Source Current!11J Temperature Coefficient Short-Circuit Duration Input Voltage Tolerance (external) Reference Load: Unipolar Mode Bipolar Mode ! ±2.5, ±5, ±10 o to 10, 0 10 5 , · ·, Inderite to com1mon , ··, . " , mA kO mA kO % of FSR V J1S I'S ViI's mV V-I'S ns V mA ppm/'C V mA mA ELECTRICAL (CO NT) MODEL DAC729JH PARAMETER DAC729KH MIN TYP MAX +13.S -16.S +4.75 +1S -15 +5 +30 -40 +1S 1.14 ±0.0001 ±0.0001 ±0.0004 ±0.0001 ±0.0005 ±0.0001 +16.S -13.5 +5.25 +40 -55 +25 1.55 ±0.0005 ±O.OOOS ±0.OO1S ±O.OOOS ±0.001S ±O.OOOS MIN TYP MAX ··· ··· ·· ·· ·· ·· ·· ··· ·· ·· ·· ·· ·· ·· POWER SUPPLY REQUIREMENTS Voltage: +Vcc -Vee +V, Current: +Vcc -Vee +V, Power Dissipation (Typical Supplies) Power Supply Sensitivity, Unipolar: ±15VDC +5VDC Bipolar: ±1SVDC +SVDC Gain: ±15VDC HVDC , ENVIRONMENTAL SPECIFICATIONS a Temperature Range: Specification Storage +70 +1S0 -60 *Specification same as DAC729JH. ·· UNITS V V V mA mA mA W %of FSR/%Vs %of FSR/%Vs %of FSR/%Vs % 'of FSR/%Vs %of FSR/%Vs %of FSR/%Vs ·C ·C NOTES: (1) TTL and CMOS compatible. (2) Specified for You, mode using the internal op amp. (3) ±0.00076% of full-scale range is 1I2LSB of 16-bit resolution. (4) FSR means full-scale range, 20V for ±10V range, etc. (S) Adjustable to zero error with an external potentiometer. (6) COB is complementary offset binary (bipolar); CSB is complementary straight binary (unipolar). (7) Using the MSB adjustment circuii, the user may improve the DAC linearity to 1I2LSB of this specification. (8) With gain and offset errors adjusted to zero at 2S·C. (9) Maximum represents 3 sigma limit, not 100%' production tested. (10) At the major carry; 20000 to lFFFF Hex and from lFFFF to 20000 Hex. (11) Maximum with no degradation in specifications. External loads must be constant. ABSOLUTE MAXIMUM RATINGS MECHANICAL r-- +Voo to Common ..................................... , OV to +7V +Vcc to Common ...................................... OV to +18V -Vee to Common ...........•.......................... OV to -18V Digital Data Inputs (pins 1-18) to Common ........... +O.SV to +18V Reference out (pin 32) to Common ..•.. Indefinite Short to Common External Voltage Applied to DIA Output (pin 29) ....... -SV to +SV Vou, (pin 23) .......................... Indefinite Short to Common Power Dissipation. . • . • • . • . • • • . . • . . . • . . • . . . . . . . . • . . • . . • •. 3000mW Storage Temperature ............................ -60·C to +1S0·C 2~1 A 1[: ::::::::::::::::: JlJ ~ 1 NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ~ Seating Plane jL D j NOTE: Leads in true position within 0.01" (.025mm) R at ~~_a,-seating ~~ane. Pin numbers are shown for reference only. Numbers may not be marked on package. DIM A B C D F G H J K L N K LG INCHES MIN MAX 1.980 2.040 .610 .630 .150 .200 ,016 .020 .050TYP .100 BASIC .030 .070 .012 .009 .155 .195 .600 BASIC .040 .060 PIN CONNECTIONS DAC729 Bitl Bit2 Bit 3 Bit4 BitS Bit6 Bit7 Bit8 Bit9 Bitl0 Bitll Bit12 Bit 13 Bit14 BitlS Bit16 Bit17 Bit18 +V,(SV) Power Ground MILLIMETERS MIN MAX 50.29 51.82 15.49 16.00 3.81 5.08 0.41 0.51 1.27 TYP 2.54 BASIC 0.76 1.78 0.23 0.30 3.94 4.95 15.24 BASIC 1.02 1.52 143 1 2 3 4 S 6 7 8 9 10 11 12 13 14 1S 16 17 18 19 20 40 39 38 37 36 3S 34 33 32 31 30 29 28 27 26 2S 24 23 22 21 VPOT Bit 1 Adjust Bit 2 Adjust Bit 3 Adjust Bit 4 Adjust Reference Adjust Gain Adjust Reference Common Reference Out Reference In Analog Common lOUT SkO Feedback SkO Feedback 10kO Feedback 10kO Feedback Summing Junction VOUT +VCC (1SV) -Vc~ (15V) THEORY OF OPERATION The DAC729 is an IS-bit digital-to-analog converter system, including' a precision reference, 'low noise, fast settling operational amplifier, and the IS-bit current source/ DAC chip contained in a hermetic 40-pin ceramic dual-in-line package. THE INTERNAL REFERENCE The reference consists of a very low temperature coefficient closed-loop reference zener circuit that has been slope-compensated by laser-trimming current-setting resistors to a zener current to achieve less than 1ppm/ °C temperature drift of VREF• By strapping pin 32 (Reference Out) to pin 31 (Reference In), the DAC will be properly biased from the internal reference. The internal reference may be fine adjusted using pin 35 as shown in Figure 7. The reference has an output buffer that will supply 4mA for use external to the DAC729. This load must remain constant because changing load on the reference may change the reference current to the DAC. In systems where several components need to track the same system reference, the DAC729 may be used with an external IOV reference, however, the internal reference has lower noise (61' Vp-p) and better stability than other references available. THE OPERATIONAL AMPLIFIER To support a DAC 'of this accuracy, the operational , amplifier must have a maximum gain~induced error of less than 1/3LSB, independent of output swing (the op amp must be linear!). To support 15 bits (1/2-bit linearity) the op amp must have a gain of 130,000V/V. For 18 bits, the minimum gain is well over 500,000V/V. Since thermal feedback is the major liinitation of gain for mono op amps, the amplifier was designed as a high gain, fast settling mono op amp, followed by a monolithic, . unity gain current buffer to isolate the thermal effects of external loads from the input stages of the gain transistors. The op amp and buffer are separated from the DAC chip, minimizing thermally-induced linearity errors in the DAC circuit. The op amp, like the reference, is not dedicated to the DAC729. The user may want to add a network, or select adifferent amplifier. The DAc729 internal op amp is intended to be the best choice for settling, speed, and noise. THEDACCHIP The heart of the DAC729 is a monolithic current source and switch integrated circuit. The absolute linearity, differential linearity, and the temperature performance of the DAC729 are the result of the design, which utilizes the excellent element matching of the current sources and switch transistors to each other, and the tracking of the current setting resistors to the feedback resistors. Older, 'more discrete designs cannot achieve the performance of this monolithic DAC design. The two most significant bits are binarily weighted inner-digitized current sources. The currents for bits 3 through 18 are scaled with both current sources weighting and an R-2R ladder. The circuit design is optimized for low noise and low superposition error, with the current sources arranged to minimize both code-dependent thermal errors and IR drop errors., As a result, the superposition errors are typically less than 20/LV. The DAC chip is biased from a servo amplifier feeding into the base liIie of the current sources. This servo amplifier. sets the collector current to be mirrored and scaled in the DAC chip current sources. The reference current for the servo is established by the reference voltage applied to pin 31 feeding an internal resistor (lOkO) to the virtual ground of the servo amplifier. DISCUSSION OF SPECIFICATIONS DIGITAL INPUT CODES The DAC729 accepts complementary digital input codes in either binary format (CSB, Unipolar or COB, Bipolar; see Table I). TABLE I., Digital Input Coding. DAC Analog Output Dlgllallnput COB I 20Y FSR I CSB I 10Y FSR 00 0000 0000 0000 0000 + Full Scale 1 9,999924V I + Full Scale 1 9,999962V -10V - Full Scale OV 111111111111111111 - Full Scale ACCURACY Linearity This specification describes one of the most important measures of performance of a D/ A converter. Linearity error is the deviation of the analog output from a straight line drawn through the end points (all bits ON point and all bits OFF point) . DIfferential Linearity Error Differential Linearity Error (DLE) of a D/ A converter is the deviation from an ideal ILSB change in the output from, one adjacent output state to the next. A differential linearity error specification of ±1/2LSB means that the output step sizes can be between 1/2LSB and 3/2LSB when the input changes from one adjacent input state to the next. A negative DLE specification of no more than -ILSB (-0.0015% for 16-bit resolution) insures monotonicity Monotonicity Monotonicity assures that the analog output will increase or remain the same for increasing input digital codes. The DAC729 is specified to be monotonic to 16 bits over the entire specification temperature range. DRIFT GaIn Drift Gain drift is a measure of the change in the full-scale 144 range output over temperature expressed in parts per million per degree centigrade (ppm/°C). Gain drift is measured by: (I) testing the end point differences for each D/ Aat tMIN, +25°C and tMAx; (2) calculating the gain error with respect to the +25°C value; and (3) dividing by the temperature change. Offset Drift Offset drift is a measure of the change in the output with 3FFFFH applied to the digital inputs over the specified temperature range. The maximum change in offset at tMIN or tMAX is referenced to the offset error at +25°C and is divided by the temperature change. This drift is expressed in parts per million of full-scale range per degree centigrade (ppm of FSR/°C). 0.16 0.14 0.12 ; 0.10 ~ 0.08 en u.. ;;';. a: 0.06 en a. 0.04 ~ 0.02 ~ 0.00 10 100 1k Frequency (Hz) 10k 100k FIGURE I. Power Supply Rejection vs Frequency Using Internal Reference and Op Amp. SETTLING TIME Settling time ofthe D/ A is the total time required for the analog output to settle within an error band around its final value after a change in digital input. Voltage Output Settling times are specified to ±O.00075% of FSR (±1/2LSB fcr.l6 bits) for t'.VO irrput conditions: a fullscale range change of 20V (COB) or IOV (CSB) and a ILSB change at the "major carry," the point at which the worst-case settling time occurs. (This is the worst-case point since all of the input bits change when going from one code to the next.) Figure 2. These capacitors (l/-iF to IO/-IF tantalum recommended) should be located close to the DAC729. Electrolytic capacitors, if used, should be paralleled with O.OI/-iF ceramic capacitors for best high frequency performance. 40 39 3 38 5 36 6 35 37 Current Output Settling times are specified to ±O.00075% of FSR for a full-scale range change with an output load resistance of 100. It is specified this way because the output RC time constant becomes the dominant factor in determining settling time for large resistive loads. 8 9 18- 34 Bit DAC 10 COMPLIANCE VOLTAGE Compliance voltage applies only to current output models. It is the maximum voltage swing allowed on the output current pin while still being able to maintain specified linearity. POWER SUPPLY SENSITIVITY Power supply sensitivity is a measure of the effect of a change in a power supply voltage on the D/ A converter output. It is defined as a percent of FSR change in the output per percent of change in either the positive supply (+Vee), negative supply (-Vee) or logic supply (VL) about the nominal power supply voltages (see Figure I). It is specified for DC odow frequency changes. The typical performance curve in Figure I shows the effect of high frequency changes in power supply voltages using internal reference, DAC, and op amp. OPERATING INSTRUCTIONS POWER SUPPLY CONNECTIONS For optimum performance and noise rejection, power supply decoupling capacitors should be added as shown in FIGURE 2. Ground Connections and Supply Bypass. EXTERNAL OFFSET AND GAIN ADJUSTMENT Offset and gain may be trimmed by installing external offset and gain potentiometers. Connect these potentiometers as shown in Figure 3 and adjust as described below. TCR of the potentiometers should be 100ppm/oC or less. The 3.9MO and 510kO resistors (20% carbon or better) should be located close to the DAC729 to prevent noise pickup. If it is not convenient to use these high-value resistors, an equivalent "T" network, as shown in Figure 4, may be substituted in place of the 3.9MO. A O.OOI/-IF to O.OI/-iF ceramic capacitor should be connected from Gain Adjust (pin 34) to common to shunt noise pickup. Refer 145 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 40 39 38 37 36 35 , 34 270kll 32 31 28 27 26 25 24 23 [~:n~~!es ~+Vcc=15V_ ~ -Vcc=15V FIGURE 3. TYPical Gam and Offset Adjust Hook-Up. 0--3--~9"''M''''n--O == -o--1"J80"'k~Il---'r--:l~80(' 23 22 ~+15V 2111):':::- lpF lpF Tantalum:::' I Tantalum _. FIGURE 9. Typical Hook-Up Diagram with "Holy Point" Ground and K.elvin Sense Load, Using Internal Op Amp and Reference. FIGURE 7. VREF Adjust. lLSB l t +Full Scale I II: " " 0; (/J :; Input = 3FFFFH /. ., ,. 0/ ~ (/'i / 1(/ r ////) //// IL /,j4 r I/~ 'l' ,,-/1' ~Bon.AII I / ~~ lr / r "g> -1~V>/''--+-__~ 100kCl ,-O.OlpF -Vs 3.9MCl Bit 3 Adjust 37H_~"""'--I----+--....~100kCl ..... O.OlpF -Vs 1.8MCl Erms Bit 4 Adjust 36M_YlIr---I---+----+--~100kCl where n is the number of samples in one cycle of any given sine wave, EL(i) is the linearity error of the DAC729 at each sampling point, and EQ(i) is the quantization error at each sampling point. The THD can then be expressed as -Vs 21}-------~~--~----~--~~ FIGURE 12. Differential Linearity Adjustment Circuit for the 4MSBs. rms 1- 3 4 8 9 10 11 12 13 14 15 16 17 18 19 20 38 18- (2) rms where E rms is the rms signal-voltage level. This cAprc:;:;ion indic~te~ th::.t, in genera!, there is a correlation between the THD and the square root ofthe sum of the squares of the linearity errors at each digital word of interest. However, this expression does not mean that the worst-case linearity error of the D I A is directly correlated to the THD. The DAC729 has demonstrated THD of better than 0.0009% of full scale (at 1kHz). This is the level of distortion that is desired to test other professional audio products, making the DAC729 ideal for professional audio test equipment. The ability to adjust the linearity of the 4MSBs, the 18-bit resolution, fast settling and low noise give the DAC729 unmatched performance. 13940 37 6 . I.!. .¥ [EL(i) + EQ(i)]2 Vnl=t THD = -E- = - - - E - - - - X 100% Erms 1 =.J J ~ [EL(i) + EQ(i)]2 i = 1 TO.OlpF -Vs 36 35 34 Bit DAC AUTOMATIC TEST EQUIPMENT The ability to adjust thl! absolute linearity and the ability to run several DACs from the same reference make the DAC729 ideal as the reference DAC for an entire data conversion system. Since the feedback resistors are absolute value (±O.l%), the addition of a 240n resistor makes the output 1O.24V.This feature makes discrete 10mV steps easy to create with a resolution of 39p. V for 1O.24V FSR. Figure 14 shows the DAC729 connected for OV to 1O.24V operation and using an external reference. The ·two 240n resistors are in series with the parallel IOkn internal resistors, resulting in 1O.24V out. This hook-up minimizes the thermal coefficient of resistance problems associated with this accuracy. The low superposition error of the DAC729 makes the system calibration routines become much less complicated. There is seldom a need to iterate through the calibration routine. Repeatability of the DAC output voltage is many times better than competitive products. This feature cuts system overhead time, improves accuracy, and cuts guard bands for the user. The entire set of test head DACs could be upgraded from 16 bits to 18 bits by replacing the existing 16-bit DACs. FIGURE 13. 0 to 10V FSR. APPLICATIONS The DAC729 is the DAC of choice for applications requiring very high resolution, accuracy, and wide dynamic range. DIGITAL AUDIO The excellent linearity and differential linearity are ideal for PCM professional audio and waveform generation applications. The DAC729 offers superb dynamic range. Dynamic range is a measure of the ratio of the smallest signals the converter can produce to the full-scale range, usually expressed in decibels (dB). The theoretical dynamic range of a converter is approximately 6dB per bit. For the DAC729 the theoretical range is 108dB! The actual dynamic range is limited by noise (signal-to-noise) and linearity errors. The DAC729's 6p.V typical noise floor, 149 T,HE HEART OF AN 18-BIT ADC The DAC729 makes a good building block in ADC applications. The key to ADC ,accuracy is differential linearity of the DAC. The ability to adjust to 18-bit linearity, coupled with the fast settling time of the DAC729 makes the design cycle for an 18-bit successive approximation ADC much faster, and the production more consistent. Figure IS shows the DAC asthe heart of a successive approximation ADC. The clock and successive approximation register could be implemented in 7400 series TTL, as a simple gate-array or standard cell, or part of a local processor. With the DAC out of the way, the comparator is the toughest part of the ADC design. To resolve an 18-bit LSB, and interface to a TTL logic device, the comparator must have a gain of 500kV/V (5X actual) as well as low hysteresis, low noise, and low thermally·induced offsets. With this much gain, a slow comparator may be desired to reduce the risk of instability. The feedback resistors of the DAC are the input scaling resistors of the ADC. An OPA404 and an OPA633 make an excellent buffer for the input signal, giving a very high input impedance to the signal (minimizing IR drop) while maintaining the linearity. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 r-- 34 18811 DAC 33 ~ 31 3n '- 10kn 10kn 29 28 27 240n 26 t .~ /"=F ~ 25 ') , 24 240n 010 10.24V . 23 22 21 . FIGURE 14. OV to 10.24V Using Internal Op Amp and Internal References. DAC729 10kn 10kn Ref. In To Holy Custom Design Comparalor ReI. Out Point Ground 18811s SAR FIGURE IS. Block Diagram of an 18-Bit ±IOVIN ADC. 150 BURR-BROWN® DAC811JU DAC811KU IElElI Microprocessor-Compatible 12-BIT DIGITAL-TO-ANALOG CONVERTER (Small-Outline Surface-Mount Package) FEATURES • SINGLE INTEGRATED CIRCUIT CHIP • MICROCOMPUTER INTERFACE: DOUBLE-BUFFERED LATCH • VOLTAGE OUTPUT: ±10V, ±5V, +10V • MONOTONICITY GUARANTEED OVER TEMPERATURE • ±3/4LSB MAXIMUM NONLINEARITY OVER TEMPERATURE • GUARANTEED SPECIFICATIONS AT ±12V AND ±15V SUPPLIES • TTL/5V CMOS-COMPATIBLE LOGIC INJJ(fTS DESCRIPTION The DAC81lU is a complete single-chip integratedcircuit microcomputer-compatible l2-bit digital-toanalog converter packaged in a 28-lead plastic SOIC. The chip' includes a precision voltage reference, microcomputer interface logic, double-buffered latch, and a l2-bit D / A converter with a voltage output amplifier. Fast current switches with laser-trimmed thin-film resistors provide a highly accurate and fast D/A converter. Microcomputer interfacing is facilitated by a dOublebuffered latch. The input latch is divided into three 4-bit nybbles to permit interfacing to 4-, 8-, 12- or l6-bit buses and to handle right- or left-justified data. The l2-bit data in the input latches is transferred to the D / A latch to hold the output value. Input gating logic is designed so that loading the last byte of data can be accomplished simultaneously with the transfer of data (previously stored in adjacent latches) from adjacent input latches to the D / A latch. This feature avoids spurious analog output values and saves computer instructions. The DAC81l is laser trimmed at the wafer level and is specified to ±1/4LSB maximum linearity error (K grade) at 2SoC and ±3/4LSB maximum over the temperature range. All grades are guaranteed monotonic over the specification temperatwe range. DAC8lIJU and KU are specified over the temperature range of O°C to +70°C. 4 MSBs 4 LSBs Intarnational Alrporllndustrlal Park. P.O. Box 11400 • Tucson. Arizona B5734 • Tel.: (602/ 746·1111 • Twx: 910-952·1111 • Cable: BBRCORP • Telex: 86-8491 PDS-717 151 SPECIFICATIONS . ORDERING INFORMATION ( ELECTRICAL r DAC811 XU TA .= +25°C. ±Vcc = 12V or 15V unless otherwise noted. MOOEL OAC811JU PARAMETER MIN TYP I I OIGITAL INPUT Resolution Codes!11 DAC811KU MAX MIN TYP 12 , USB, BOB Digital Inputs Over Temperature Range C2J +2.0 0.0 V," V" +15 +0.8 +10 ±2o hH. VI = +2.7V hL. VI = +O.4V Digital Interface Timing Over Temperature Range l31 twP, WR pulse width tAw1,.N; and LDAC valid to end of WR tow. data valid to end of WR 101"1, data valid hold time , MAX UNITS , Bits , , , , , , 50 50 80 0 VOC VDC pA pA ns ns ns ns i , , TRANSFER CHARACTERISTICS ACCURACY Li~earity ±1/4 ±1/2 Error Differential Linearity Error Gain Errorl .) Offset Errorl4 ,51 ±1/8 ±1/4 ±112 ±3/4 , , , , , , ±0.1 ±0.2 ±0.05 ±0.15 Guaranteed ±0.001 ±0.003 ±0.002 ±0.006 ±o.o005 ±0.0015 Monotonicity Power Supply Sensitivity: +Vcc -Vee 1Voo DRIFT (O'C 10 +70'C) Gain Unipolar Offset Bipolar Zero Linearity Error Over Temperature Range Monotonicity Over Temperature Range ±10 ±5 ±5 ±30 ±10 ±10 ±1/2 ±3/4 · ·, , ±1/4 Guaranteed ±1/4 ±1/2 , , ·· · , , , , LSB LSB % % of FSR(61 Basic Model ---~--I T Grade J Package Type - - - - - - - - ' ABSOLUTE MAXIMUM RATINGS ±Vee to ACOM ....... :..... 0 to ±18V VDD to OCOM ..... c. .. .. .... 0 to +7V Input Voltage Range ••.........•. ±Vcc Digital Inputs ........... ":'0.4V to Vee Lead Temp, Wave Soldering (3 seconds max) .. .. .. .. .... +260'C Output Short Circuit to Common. . . . • . . . . . .. Continuous Power Dissipation ............•... 1W NOTE: Stresses above those listed may cause permanent damage to the device. Exposures to absolute maximum conditions for extended periods may effect device reliability. % 01 FSR/%Vcc % 01 FSR/%Vee % 01 FSR/%VDD ppm/'C ppm of FSR/'C ppm of FSRI'C LSB CONVERSION SPEED SETTLING TIME'" (to within ±0.01% of FSR of final value. 2kQ load) For Full-Scale Range Change: 20V Range 10V Range For 1LSB Change at Major Carry'8) Slew Rate l71 MECHANICAL 8 3 3 1 12 4 4 , OUTPUT ANALOG OUTPUT Voltage Range (±Vcc ~ 15V)'91. Unipolar Bipolar Output Current Output Impedance (at DC) Short Circuit to Common Duration REFERENCE VOLTAGE Voltage Source Current Available for Exte:rnal Loads Temperature Coefficient Short Circuit to Common Duration Oto+10 ±5,±10 , ±5 0.2 Indefinite +6.2 +2.0 , +6.3 +6.4 ±10 Indefinite ±30 +15 -15 +5 +16 -23 +8 +16.5 -16.5 +5.5 +25 -35 +15 ±0.5 800 POWER SUPPLY REQUIREMENTS Voltage: +Vee I -Vee VDD Current (no load): +Vcc -Vee VDD Potential at DCOM with Respect to ACOM'101 Power Dissipation +11.4 -11.4 +4.5 625 TEMPERATURE RANGE Specification Storage 'Same as OAC811JU. 0 -60 ·,, ·, · ··, +70 +100 ·· · · ·, · ··, ·, ·· ·· ·· ·, ·, · ·· ·· ·· ps ps ps Vips A "-'lnnnnnnnlinnnn I t l B V V mA 6u "- ~i~ ; I~e~t~fi~r u u u u ~ Beveled n V mA Jp~OJlfl~'~ _11-0 ~ G H ppm/'C VDC VDC VOC mA mA mA V mW 'C 'C NOTES: (1) USB = Unipolar Straight Binary. BOB = Bipolar Offset Binary. (2) TTL-, LSTTL-, 74HC CMOS-compatible. (3) Refer to Figures 6 and 7. (4) Adjustable to zero with external trim potentiometer. (5) Error at input code 00018 for both unipolar and bipolar ranges. (6) FSR means FU,II Scale Range and is 20V for the ±10V range. (7) Maximum represents the 3u limit. Not 100% tested for this parameter. (8) At the major carry, 7FF" to 800" and 600 .. to 7FF,.. (9) Minimum supply voltage required for ±10V output swing is ±13.5V. Output swing for ±11.4V supplies is at least -8V to +8V with no external load. (10) The maximum voltage at which ACOM and DCOM may be separated without affecting accuracy specifications. 152 I" 19L J~J 'I_L_1f NOTE: Leads in true position within 0.010" (.25mm) Rat MMC at seating plane. DIM A B C 0 G H J L M N INCHES MIN MAX .700 .716 .288 .302 .109 .093 .015 .019 .050 BASIC .022 .038 .008 .012 .281 .309 5° TYP ,011 .007 MILLIMETERS MIN MAX 18.19 17.78 7.26 7.67 2.38 2.77 0.38 0.48 1.27 BASIC 0.56 0.97 0.20 0.30 7.14 7.85 5° TYP 0.18 0.28 PIN NOMENCLATURE PIN 6 NAME FUNCTION PIN NAME Voo Logic Supply, +5V 15 DCOM DIGITAL COMMON, Voo supply return WR WRITE, command signal to load latches, Logic low loads latches. 16 DATA, Bit 1, LSB 17 Do D, LDAC LOAD DIA CONVERTER, enables WR 10 load the D/A latch. logic low enables. 18 D, DATA, Bil3 19 D, 'DATA, Bil4 FUNCTION DATA, Bil2 N. NYBBLE A, enables WR to load input latch A (the most significant nybble). Logic low enables. 20 +Vcc Analog Supply Input, +15V or +12V No NYBBLE B, enables WR to load input lalch B. Logic low enables. 21 -Vee Analog Supply Input, -15V or -12V 22 GAIN ADJ To externally adjust gain No NYBBLE C, enables WR to load input latch C (the least significant nybble). Logic low enables. 23 ACOM ANALOG COMMON, ±Vcc supply return 24 VCUT D/A converter voltage output D" Doo D, DATA, Bit 12. MSB, positive true. 25 10V RANGE Connect to pin 24 for 10V Range DATA, Bit 11 26 SJ SUMMING JUNCTION 01 output amplifier DATA, Bit 10 27 BPO D. DATA, Bit 9 BIPOLAR OFFSET. Connect to pin 26 for Bipolar Operation 11 D, DATA, Bit 8 28 REF OUT 6.3V reference output 12 D, DATA, Bit 7 13 D, DATA, Bit 6 14 D, DATA, Bit 5 10 TABLE I. Digital Input Codes. CONNECTION DIAGRAM , MSB l LSB l 111111111111 100000000000 011111111111 000000000000 +15V i i DIGITAL INPUT Connect For Bipolar Operation ANALOG OUTPUT USB Unipolar Straight Binary +Full Scale +1/2 Full Scale .1/2 Full Scale -1 LSB Zero BOB Bipolar Offset Binary +Full Scale Zero -1LSB -Full Scale BTC' Binary Two's Complement -1LSB -Full Scale +Full Scale Zero -Invert the MSB of the BOB code with external inverter to obatin BTC code. + LINEARITY ERROR Linearity error as used iiI D / A converter specifications by Burr-Brown is the deviation of the analog output from a straight line drawn between. the end points (inputs all "I's" and all "0 's"). The DAC811 linearity error is specified at ± I /4LSB (max) at +25°C for the K grade and ±1/2LSB (max) for the J grade. DISCUSSION OF SPECIFICATIONS INPUT CODES The DAC811 accepts positive true binary input codes. It may be connected by the user for anyone of the following codes: USB (unipolar straight binary), BOB (bipolar offset binary) or, using an external inverter on the MSB line, BtC (binary two's complement). See Table I. DIFERENTIAL LINEARITY ERROR DifferentialliI)earity error (DLE) is the deviation from a I LSB output change from one adjacent state to the next. A DLE specification of 1/2LSB means that the output step size can range from 1/2LSB to 3/2LSB when the input ch'anges from one state to the next. Monotonicity requires that DLE be less than I LSB over the temperature range of interest. MONOTONICITY A D / A converter is monotonic if the output either increases ,or remains the same for increasing digital inputs. The DAC811 is monotonic over the entire specification temperature range, 153 DRIFT Gain drift is a measure of the change of the full-scale range output over the specificatidn temperature range. Drift is expressed in parts per million per degree centigrade (ppm/°C). Gain drift is established by testing the full-scale range value (e.g., +FS minus -FS) at high temperature, +25°C, and low temperature; calculating the error with respect to the +25°C value and dividing by the temperature change. Unipolar offset drift is a measure of the change in output with all O"s on the input over the specification temperature range. Offset is measured at high temperature, +25°C, and low temperature. The maximum change in offset referred to the +25°C value divided by the temperature change is the offset drift. It is expressed in parts per million of full-scale range per degree centigrade (ppm of FSR/°C). Bipolar zero drift is measured at a digital input of 80016, the code that gives zero volts output for bipolar operation. 1.0 ~~ " csg» -" 8g 0.1 li" ~ 8.'" II: :;; :x~ / '" u.. 3: 0 -~ ov.v a. n ~~ " U" -' 'x~c IJ'" 0.'<: O.UU ~ ~ 0.0001 100 10. lK lOOK 10k 1M Frequency (Hz) SETTLING TIME Settling time is the total time (including slew time) for the output to settle within an error band around its final value after a change in input. Three settling times are specified to ±O.Ol% of full-scale range (FSR): two for maximum full-scale range changes of 20V and lOY, and onefor a ILSB change. The ILSB change is.measured at the major carry (7FF16 to 80016 and 80016 to 7FFI6), the input transition at which worst-case settling time occurs. FIGURE 1. Power SupPly Rejection versus Power Supply Ripple Frequency. '5 c. '5 .L "'T , . .",/ ~/'" ~ .. ' • ,'"• -' /' +Full-Scale ~ ~(\) ~ ~ o g' 'il Range Of < Ollset Adjust Ollset Adjust Translates The Line REFERENCE SUPPLY DAC811 contains an on-chip 6.3Vreference. This voltage (pin 28) has a tolerance of ±O.I V. The reference output may be used to drive external loads, sourcing at least 2.0mA. This current should be constant for best performance of the DJ A converter. iB~ 1LSB ~ .r AIlBits Ii Range Of Gain Adjust ~ _;;)1' ~X Gain Adjust Logic 0 11 1•. ,1' Rotates The Line ? All Bits Logie 1 Digital Input FIGURE 2. Re\ationship of Offset and Gain Adjustments for a Unipolar D/A Converter. ::r POWER SUPPLY SENSITIVITY -S' o .2 <~ All Bits Logic 0 '" OllsetAdjUstl Ollset Adjust Translates / The Line T Figures 2 and.3 illustrate the relationship of offset and gain adjustments to unipolar and bipolar D / A converter t 1 Bipolar V .....t.....~ Ollset,J:'to Range Of OFFSET AND GAIN ADJUSTMENTS ' ~'.; ~. T lLSB ~ Full·Scale Range '5 Power supply sensitivity is a measure of the effect of a power supply change on the D / A coonverter output. It is defined as a percent of FSR output change per percent of change in either the positive, negative, or logic supply voltages about the nominal voltages. Figure I shows typical power supply rejection versus power supply ripple frequency. +Full Scale./· • '~L I .L Range Of T' Gain Adjust ~ 1J ,--- Gain Adjust ~./ ~:-'" Rotates The Line I'MSB On All Others Of -Full-Scale ~ All Bits Loglcl Ollset Digital Input FIGURE 3. Relationship of Offset and Gain Adjustments for a Bipolar DJA Converter. outp~t. 154 MSB D11 ...•.... D8 LSB D3 ..•••••• DO D7 ........ D4 FIGURE 4. DAC8!! Block Di!!gr!!!!!. OPERATION DAC8ll isa complete single IC chip l2-bit D(A converter. The chip contains a l2-bit D(A converter, voltage reference, output amplifier, and microcomputer-compatible input logic as shown in Figure 4. ±12V OPERATION The DAC811 is fully specified for operation on ±12V power supplies. However, in order for the output to swing to ±10, the power supplies must be ±13.5V or greater. When operating with ± l2V supplies, the output swing is restricted to approximately ±8V. transmit data to the D(A switches when both ~ and WR are at logic "0." When either LDAC or WR are .at logic "l,"the data is latched in the D/ A latch and held until LDAC and WR go to logic "0." All latches are level-triggered. Data present when the control signals are logic "0" will enter the latch. When anyone of the control signals returns to logic" I," the data is latched. A truth table for all latches is given in Table II and Relatative Timing Diagrams are shown in Figures 5 and 6. TABLE II. DAC8ll Interface Logic Truth Table. Wi!" ~ No Ne LDAC 1 X X X X a a a a a a 1 1 1 No Operation Enables Input Latch 4MSBs 1 1 a 1 1 a 1 1 Enables Input Latch 4 Middle Bits Enables Input Latch 4LSBs a a Loads D/A Latch From Input Latches All Latches Transoarent LOGIC INPUT COMPATIBILITY The DAC8ll digital inputs are TTL, LSTTL, and 54f74HC CMOS-compatible over the operating range of Voo. The input switching threshold remains at the TIL threshold over the supply range. ··X·· ~ 1 1 1 a a a OPERATION Don·t Care INTERFACE LuGIC Input latches A, B, and C hold data temporarily while a complete l2-bit word is assembled before loading into the D(A register. This double-buffered organization prevents the generation of spurious analog output values. Each register is independently addressable. These input lat.ches are controlled by NA, No, iii;; and WR.NA, NB, and Nc are internally NORed with WR so that the input latches transmit data when both NA (or NB, Nc) and WR are at logic "0." When either NA (or No, i'ifC) and WI'{ go to logic "1," the input data is latched into the input registers and held until both NA (or NB, Nc) and WR go to logic "0." The D( A latch is controlled by LDAC and WR. LDAC and WR are internally NORed so that the latches (Load First Rank F*ro:"Data _ ._ DB l1 -DBo B~s; ~ =: 1) _I 80ns minimum _______ ~I*~ __- WR FIGURE 5. Write Cycle #1 (Data Latched from Data Bus). 155 (Load Second RankFom First LDAC WR t R~:~ 50ns minimum r TABLE III. Digital Input/Analog Output, ±VcC' =:!-i5V. 1) ANALOG OUTPUT VOLTAGE I /r---- ±5V ±10V 12-Bit Resolution MSB LSB t~ ~ ~ :_~1 _____ _ I I 111111111111 100000000000 011111111111 000000000000 lLSB ==c;Lt5ETT':' __ _____ ~~--r----- _._---------. Oto 10V DIGITAL INPUT +9.9976V +5.0000V +4.9976V O.OOOOV 2.44mV +4.9976V O.OOOOV -0.0024V -5.0000V 2.44mV +9.9951V O.OOOOV -0.0049V -10.0000V 4.88mV OUTPUT RANGE CONNECTIONS Internal scaling resistors provided in the DACSI I may be connected to produce bipolar output volt~ge ranges of ± lOY and ±5V or unipolar output voltage range of 0 to +lOY. The 20V range (±IOV bipolar range) is internally connected. Refer to Figure S. Connections for the output ranges are listed in Table IV. ±1/2LSB FIGURE 6. Write Cycle #2 (Data Transferred to DAC). EXTERNAL OFFSET AND GAIN ADJUSTMENT Offset and gain may be trimmed by installing external offset and gain potentiometers. Connect these potentiometers as shown in the Connection Diagram. TCR of the potentiometers should be 100ppmm/oC or less. The 1.0M!l and 3.9M!lresistors (20% carbon or better) should be located close to the DACSII to prevent noise pickup. If it is not convenient to use these high value resistors, an equivalent "T" network, as shown in Figure 7, may be substituted in each case. The Gain Adjust (pin 22) is a high impedance point and a 0.00221lF ceramic capacitor should be connnected from this pin to analog common to reduce noise pickup in all applications, including those not employing external gain adjustment. From 5.36kQ C\27 Bipolar Voltage ---"~,,.----0.:;:.1 Offset Reference RsPO Summing Junction 4.26kQ 10V Range From D/A Convert~r VOUT Resistor Tolerances ±.25% FIGURE S. Output Amplifier Voltage Range Scaling Circuit. ~=~~ 1.0MQ ~ 1:~~~ _ ~ TABLE IV. Output Range Connections. Output Range ~=~ ~ Oto +10V ±5V ±10V Digital Input Codes Connect Connect Pin 25 To Pin 27 To USB 24 23 BOB or BTC 24 26 BOB or BTC NC 26 FIGURE 7. Equivalent Resistances. Offset Adjustment For unipolar (USB) configurations, apply the digital input code that should produce zero voltage output and adjust the offset potentiometer' for zero output. For bipolar (BOB, BTC) configurations, apply the digital input code that should produce the maximum negative output voltage and adjust the offset potentiometer for minus full-scale voltage. Example: If the full-scale range is connected for 20V, the maximum negative output voltage is -lOY. See Table III for corresponding codes. Gain Adjustment For either unipolar or bipolar configurations, apply the digital input that should give the maximum positive voltage output. Adjust the gain potentiometer for this positive full-scale voltage. See Table III for positive fullscale voltages. INSTALLATION POWER SUPPLY CONECTIONS Decoupling: For optimum performance and noi~e rejection, power supply decoupling capacitors should be added as shown in the Connection Diagram. . These capacitors (IIlF tantalum recommended) should be located close to the DAC811. The DACSII features separate digital and analog power supply returns to permit optimum connections for low noise and high speed performance. The analog common (pin 23) and digital common (pin 15) should be connected together at one point. Separate returns minimize current flow in low level signal paths if properly connected. 156 Logic return currents are not added into the analog signal return path. A ±0.5V difference between ACOM and DCOM is permitted for specified operation. High frequency noise on DCOM with respect to ACOM may cause noise to be coupled through to the analog output. therefore. some caution is requried in applying these common connections. The analog common is the high quality return for the D / A converter and should be connected directly to the analog reference point of the system. The load driven by the output amplifier should be returned to the analog common. OBo DB. =>"Cl DB, E 8 § ~ OAC811 DB, APPLICATIONS WR AN MICROCOMPUTER BUS .INTERFACING A, The DAC811 interface logic allows easy interface to microcomputer bus structures. The control signal WR is derived from external device select logic and the I/O Write or Memory· Write (depending upon the· system design) signals from the microcomputer. The latch enable lines N, A. No. Nc, and LDAC determine which of the latches are enabled. It is permissible to enable two or more latches simultaneously as shown in some of the following examples. The double-buffered latch permits data to be loaded into the input latches of several DAC811s and later strobed into the D / A latch of all D / As, simultaneously updating all analog outputs. All the interface schemes shown below use a base address decoder. If blocks of memory are unused. the base address decoder can be simplified or eliminated altogether. For instance if half the memory space is unused. address line Als of the microcomputer can be used as the chip select control. A, N. AD FIGURE 9. Addressing and Control for 4-Bit Microcomputer Interface. 1x1x1x1x10,,10,,10.10.1 a. Right-Justified 10,,10,,10.10.10,10.10.10.1 .10,10,10.1001 xIxIxIx I b. Left-Justified FIGURE 10. 12-Bit Data Formats for 8-Bit Systems. 4-BIT INTERFACE An interface to a 4-bit microcomputer is shown in Figure 9. Each DAC811 occupies four address locations. A 74LS 139 provides the two to four decoder and selects these with the base address. Memory Write (WR) of the microcomputer is connected directly to the WR pin of the DAC811. An 8205 decoder is an alternative device to use instead of the 74LS 139. $ 8-BIT INTERFACE The control logic of DAC81 I permits interfacing to right- or left-justified data for~ats illustrated in Figure 10. When a 12-bit D/A converter is loaded from an 8-bit bus. two bytes of data are required. Figures I I and 12 show an addressing scheme for right-justified and leftjustified data respectively. The base address is decoded from the high-order address bits. Ao and AI address the appropriate latches. Note that adjacent addresses are used. For the right-justified format XI016 loads. the 8LSBs and XOl 16 ioads the 4MSBs and simultaneously transfers input latch data to the D / A latch. Addresses XOO l6 and XI 116 are not used. :3 Co E o e " ~ FIGURE II. Right-Justified Data Bus Interface. 157 12- AND 16-BIT MICROCOMPUTER INTERFACE For this application the input latch enable lines, 'lirA, No, and N; are tied low, causing the latches to be transparent. The D / A latch, and therefore DAC811, is selected by the address decoder and strobed by WR: Left-justified data is handled in a similar manner, shown in Figure 12. The DAC811 still occupies two adjacent locations in the microcomputer's memory map. WR WR mc DAC811 (1) A1P~ Do sc. :J DAC811 E 0 "e 'i"E N. 0, 0, 0, 0" 0, WAC DAC811 (2) Nc A, No N. l!l :J C. E 0 "e y. '11 74LS138 .2 ::;; A, C A, B Ao A Y. 10 , Y. 9 ,y, FIGURE 12. Left-Justified Data Bus Interface INTERFACING MULTIPLE DAC811s IN 8-BIT SYSTEMS Many applications require that the outputs of several' D / A converters be updated simultaneously such as automatic test systems. The interface shown in Figure 13 uses a 74LSI38 decoder to decode a set of eight adjacent addresses to load the input latches of four DAC811s. The example shows a right-justified data format. ADDRESS BUS A ninth address using A3 causes all DAC811s to be updated simultaneously. If a particular DAC811 is always loaded last, for instance, D/ A #4, A3 is not needed, thus saving eight address spaces for other uses. Incorporate A3 into the Base Address Decoder, remove the inverter, connect the common LDAC line to N, of D/A #4, and connect G, of the 74LSI38 to +5. OPERATION A, Ao A, Ao 0 0 0 0 LOAD 8LSB-D/A #1 0 0 0 1 LOAD 4MSB-D/A,#1 0 0 1 0 LOAD 8LSB-D/A #2 0 0 1 1 LOAD 4MSB-D/A #2 0 1 0 0 LOAD 8LSB-D/A #3 0 1 0 1 LOAD 4MSB-D/A #3 0 1 1 0 LOAD 8LSB-D/A #4 0 1 1 1 LOAD 4MSB-D/A #4 1 X X X LOAD D/A LATCH-ALL D/A FIGURE 13. Interfacing Multiple DAC811s to an 8Bit BlIS. 158 BURR-BROWN® DAC7541A 1E3E31 Low Cost 12-Bit CMOS Four-Quadrant Multiplying DIGITAL-TO-ANALOG CONVERTER FEATURES DESCRIPTION • FULL FOUR·QUADRANT MULTIPLICATION • 12·B11 END·POINT LINEARITY • DIFFERENTIAL LINEARITY ±1I2LSB MAX OVER TEMPERATURE (K/B/T GRADES) • MONQTONICITY GUARANTEED OVER TEMPERATURE • TTL·/CMOS·COMPATIBLE • SINGLE +5V TO +15V SUPPLY • LATCH·UP RESISTANT • 752117541 17541 A REPLACEMENT • PACKAGES: HERMETIC DIP. PLASTIC DIP. PLASTIC SOIC • LOW COST The Burr-Brown DAC7541A is a low cost 12-bit, four-quadrant multiplying digital-to·analog converLei. Laser-trimmed thin-film. r~:;i:;tG!,~ en. ~ !ncnclithic CMOS circuit provide true 12-bit integral and differentiallinearity over the full specified temperature ranges. The DAC7541A is a direct, improved pin-for-pin replacement for 7521, 7541, and 7541A industry standard parts. In addition to standard 18-pin plastic and hermetic ceramic packages, The DAC7541A is also available in a surface-mount plastic 18-pin SOIC. FUNCTIONAL DIAGRAM v... 10kCl 20kCl 10kCl 10kCl 20kCl 10kCl 20kCl 20kCl 20kCl SPDTNMOS Swilche~ .....- - - - o l o u.. ~+-I-""-"""''''''-n-+--!-~-4-+ L......j1--....+--~"+-·H·-+-I----!I!-....~10~kCl::---oIOUT1 I I I 6 ........,.,.........0 RFEEDBACK 6 Bit 1 (MSB) Bit 12 (LSB) Digital Inputs (DTLfITLJCMOS gompatible) Logic: A switch is closed to 10uTI for Its digital Input in a "high" state. Switches shown for digit.' Inputs "high". Inlernatlonel Alrporllndustrlal Perk • P.O. Box 11400 • Tucson, Arizona B5734 • Tel.: (602)748-1111 • Twx: 911).952·1111 • Cable: BBRCORP • Telex: 68-8491 PDS-639 159 SPECIFICATIONS ELECTRICAL At +25°C. +VDD::;;: +12V or +15V. VREF :::;;: +10V. VP1N 1 = VP1N 2:::; OV unless otherwise specified. MOOEL DAC7S41A PARAMETER ACCURACY Resolution Relative Accuracy Differential Non-linearity Gain Error Gain Temperature Coefficient (fiGain/,C..Temperature) Output Leakage Current: OUt, (Pin 1) Out, (Pin 2) REFERENCE INPUT Voltage (Pin 17 to GND) Input Resistance (Pin 17 to GND) = TMINI TMAAn' UNITS GRADE T.=+2SoC All J,A,S K, B, T . J,A, 5 K, B, T J,A,S K, B, T 12 ±1 ±1/2 ±1 ±1/2 ±6 ±1 12 ±1 ±1/2 ±1 ±1/2 ±8 ±3 Bits LSB max LSB max LSB max LSB max LSB max LSB max All J, K A, B 5, T' J, K A,B 5, T ±S ±S ±S ±S ±S ±S S ±10 ±10 ±200 ±10 ±10 ±200 ppm/DC max nA max All All -10/+10 7-18 -10/+10 7-18 kO: minimax TA TEST CONDITIONS/COMMENTS ±1 LSB = ±0.024% of FSR. ±1/2LSB = ±0.012% of FSR. All grades guaranteed monotonic to 12 bits, TMIN to TMAX. Measured using internal RFS and includes effect of leakage current and gain T.C. Gain error can be trimmed to zero. Typical value is 2ppm/oC. All digital inputs = OV. nA max nA nA nA nA max max max max All digital inputs;::::: VPD. V.min/max I Typical input resistance = l1kn. Typical input resistance temperature coefficient is -SOppmfOC. DIGITAL INPUTS V'H (Input High Voltage) V" (Input Low Voltage) ioN (Inp~t Current) All All All 2.4 0.8 ±1 2.4 0.8 ±1 pAmax Logic'inputs are MOS gates. ioN typ (2S0C) = 1nA. VIN=QV Vmin V max CIN (Input Capacitance)421 All 8 8 pFmax POWER SUPPLY REJECTION t.Gain/t.Voo All ±0.01 ±0.02 % per % max POWER SUPPLY Voo Range All +Sto +16 +S to +16 V minto 100 All 2 100 2 SOO mAmax Voo = +11.4V to +16V Accuracy is not guaranteed over this range. '!max IJAmax All digital inputs V" or V,H. All digital inputs OV or Voo. AC PERFORMANCE CHARACTERISTICS These characteristics are included for design guidance only and are not production tested. Voo = +1SV, VA.F = +10V except where stated, VP'N I = VPlN • = OV, output amp is OPA606 except where stated. PROPAGATION DELAY (from Digital Input change to 90% of Final Analog Output) All 100 DIGITAL-TO-ANALOG GLITCH IMPULSE All 1000 MULTIPLYING FEEDTHROUGH ERROR (V..FtoOut.) All 1.0 All 0.6 - All 1.0 - JJsmax To 0.01% of Full Scale Range. Out, load 1000, CEXT = 13pF. Digital Inputs: OV to Voo or Voo to OV. All All All 'AII 100 60 70 100 100 60 70 100 pFmax pFmax pF max pFmax Digital Inputs Digital Inputs DigltallnRuts = DIgltallnpuls = OUTPUT CURRENT SETTLING TIME OUTPUT CAPACITANCE COUT' (Pin 1) COUT • (Pin 2) CoUT' (Pin 1) COUTO (Pin 2) - nstyp nV-s typ mVp-p max /AS typ Out, Load = 1000, CEXT = 13pF. Digital Inputs = OV to Voo or Voo to OV. VA.F = OV, all digital Inputs OV to Voo or Voo to OV. Measured using OPA806 as output amplifier. VA.F = ±10V, 10kHz sine wave. = , = V'H = V'H V'l V" NOTES: (1) Temperature ranges are: 0 to +70°C for JP, KP, JU ,and KU versions; -2SoC to +8SoC for AH, BH versions; -55°C to +12SoC for SH, TH versions. (2) Guaranteed by design but not producthm tested. ' 160 MECHANICAL Hermetic DIP NOTE: Leads in true position INCHES MIN MAX .960 .220 .310 .200 .014 .023 .030 .070 .100 BASIC .098 .008 .015 .125 .200 .290 .320 .015 .080 DIM A B C D F G H J K L N within .010" (.25mm) Rat MMC at seating plane. MILLIMETERS MIN MAX 24.38 '7,87 5.59 5.08 0.58 0.36 1.78 0.76 2.54 BASIC 2.49 0.20 0.38 3.18 5.08 8.13 7.37 0.38 2.03 R L -ll~J L~ r Plastic DIP INCHES MIN MAX .840 .940 .240 .280 DIM A B C G D J H K L M N .210 .014 .022 .100 BASIC .040 .060 .008 .015 .115 .150 .280 .300 . 0' 10' 0.020 0.050 MILLIMETERS MIN MAX 21.34 23.88 B.l0 7.11 5.33 0.36 0.56 2.54 BASIC 1.02 1.52 0.20 0.38 2.92 3.81 7.11 7.B2 0' 10' 0.51 1.27 Pinl J:::::::JI G J H L M N JI--D G '-- Seating Plane ~ ~~~ 9.91 10.72 0' 0.00 10" 0.30 Q, K I -1M L--i NOTE: Leads in true position within .010" (.25mm) R at MMC at seating plane. 1, f B 11 11.84 11.33 11.25 7.26 7.67 B.86 7.24 2.36 2.74 0.38 0.48 1.27 BASIC 0.66 0.86 0.20 0.30 , 1 T MILLIMETERS MIN MAX 11.43 l IIPIfL-\1FI1IrY "~ II \.~ Plastic sOle DIM A A, B B, C D ! B -Hr _ INCHES MIN MAX .450 .466 .443 .446 .286 .302 .270 .285 .093 .108 .015 .019 .050 BASIC .026 .034 .008 .012 390 .422 0' 10' .000 .012 NOTE: Leads in true position '::ithin .010" (.2Smm) R at MMC et seating plane. I A : Pin 1 t1 lHJ H ~t~ Dt1 """"1 , JJj 1[1 n nJ U U _Gl 161 uJ-.J. N] , ,t-=- LL~IrfJ c cDr M D /1 ABSOLUTE MAXIMUM RATINGS· Vee (pin 16) to Ground .................................. +17V VREF (pin 17) to Ground ................................. ±25V VRPa (pin 18) to Ground ................................. ±25V Digitallnput Voltage (pins 4-15) to Ground ..., -0.4V, Vee VPIN " VPIN • to Ground ............................ -O.4V, Vee Power Dissipation (any package): To +75°C .............................................. 450mW Derates above + 75°C ............................ -6mW/oC Lead Temperature (soldering, 10s)................. +300°C Storage Temperature: Ceramic Package ........... +150·C Plastic Package ... ; ........ +125°C permanent damage may occur on unconnected devices subject to high energy electrostatic fields. When not in use, devices must be stored in conductive foam or shunts. The protective foam should be discharged to the destination socket before devices are removed. ENVIRONMENTAL SCREENING (QM SCREENING) Burr"Brown /QM models are environmentally screened' versions of our standard industrial products, designed to provide enhanced reliability. The screening is performed to selected methods of MIL-STD-883. Reference to these methods provides a convenient method of ~ommun icating the screening levels and procedures employed; it does not imply conformance to any other military standards ,or to any methods of MIL-STD-883 other than those specified. All of the DAC754lxH grades are available with /QM screening. • Strassas above those listed above may'cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition above those Indicated In the operational sections of this specification Is not Implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN CONNECTIONS lOUT 1 /QM Screening (hermetic packages only) lOUT 2 Ground +VDD la-Pin PI.ltlc DIP Bit 12 (LSB) (P Sufllx) Bltl (MSB) Bit2 Bit 3 1 Blt4 Blt9 BitS Bit 8 BitS BIt7 MIL-STD...3 Method, CondiDon Screen Bit 11 la-Pin HermetiC Ceramic DIP Bit 10 (H Sufllx) Internal Visual la-Pin Plasllc SOIC (USufflx) CAUTION The DAC7541A is an ESD (electrostatic discharge) sensitive device. The digital control inputs have a special FET structure, which turns on when the input exceeds the supply by 18V, to minimize ESP damag,e. However, High Temperature Storage 1008, C lSO'C, 24hra Temperalure Cycle 1010,C -6510 +150'C, 10 cycles Bum-In 1015, B +125'C Constant Accelerallon 2001, E 3O,000G 1014, AI or A2 1014,C 5 X 10" aim eels 60psig, 2hra Hermeliclly: Fine Leak Gross Leak Exlernal Visual 2009 ORDERING INFORMATION Model DAC7541AJP DAC7541AKP DAC7541AJU DAC7541AKU D,AC7541AAH DAC7541ABH DAC7541ASH DAC7541ATH Relative Accuracy (LSB) ±1 ±1I2 ±1 ±1/2 ±1 ±1I2 ±1 ±1/2 Gain Error (LSB) Package ±6 ±1 ±6 ±1 ±6 ±1 ±6 ±1 Plastic DIP Plastic DIP Plastic SOIC Plastic SOIC HermetiC DIP Hermetic DIP Hernietic DIP Hermetic DIP 162 Comments 2010. B Temperature , Range (OC) oto +70 Oto+70 Oto+70 Oto+70 -25 to +85 -25 to +85 -55 to +125 -55 to +125 TYPICAL PERFORMANCE CURVES T. = +25'C, Voo = +15V unle•• otherwise noted. GAIN ERROR VS SUPPLY VOLTAGE FEEDTHROUGH ERROR VS FREQUENCY 10.0 5/2 . , ED en :::!. g 3/2 i? ~ "- w c: 'iii 1.0 ff! .c: 0.10 C1 e" .c: ~ i (!l 0.010 u. 112 0.001 0 15 10 100 1500 1250 ~ :::!. E 1000 ",.. 750 ~ 3/4 U ifL C. i!:' "c: 1M SUPPLY CURRENT VS SUPPLY VOLTAGE 5/4 ':; 100k LINEARITY VS SUPPLY VOLTAGE i en e 10k Frequency (Hz) 3/2 ill 1k Supply Voltage (V) g. 1/2 en ......... ::; 114 0 5 500 (/ 250 10 ~~H=VDO . 15 10 Relative Accuracy This term (also known as linearity) describes the transfer function of analog output to digital input code. The linearity error describes the deviation from a straight line between zero and full scale. Differential Nonlinearity Differential Nonlinearity is the deviation from an ideal ILSB change in the output, from. one adjacent output state to the next. A differential nonlinearity specification of ±1.0LSB guarantees monotonicity. Gain Error .Gain error is the difference in measure of full-scale output versus the ideal DAC output. The ideal output for the DAC7541A is -(4095/4096) X (YREP). Gain error may be adjusted to zero using external trims. Output Leakage Current The measure of current which appears at Outl with the DAC loaded with all zeros, or at Out, with the DAC loaded to all ones. 15 Supply Voltage (V) Supply Voltage (V) DISCUSSION OF SPECIFICATIONS x~. ",-------_o lOUT 2 CIRCUIT DESCRIPTION FIGURE 2. DAC754IA Equivalent Cir,cuit (All Inputs Low). The DAC754IA is a 12-bit mUltiplying D/A converter consisting of a highly stable thin-film R-2R ladder network and 12 pairs of current steering switches on a monolithic chip. Most applications require the addition of a voltage or current reference and an output operational amplifer. A simplified circuit of the DAC754lA is shown in Figure 1. The R-2R inverted bidder binarily divides the input currents that are switched between lOUT I and lOUT 2 bus lines. This switching allows a constant current to be maintained in each ladder leg independent of the input code. The input resistance at VREFERENCE (Figure I) is always equal to RLDR (RLDR is the. R/2R ladder characteristic resistance and is equal to value "R''). Since RIN at the VREFERENCE pin is constant, the reference terminal can be driven by a reference voltage or a reference current, AC or DC, of positive or negative polarity. V••FeRENC. 10kCl RFEEDBACK R=10kCl IAEFERENGE _ ,t 1""-------1---.,---0 I 6 Bit 1 (MSB) Bit 2 I I 0 Bit 3 lOUT' I RFEEDBACK lOUT 2 55pF Output Impedance The output resistance, as in the case of the output capacitance, is also modulated by the digital input code. The resistance looking back into the lOUT I terminal may be anywhere between 10kn (the feedback resistor alone when all digital inputs are low) and 7.5kn (the feedback resistor in parallel with approximately 30kn of the R-2R ladder network resistance when any single bit logic is high).The static accuracy and dynamic performance will be affected by this modulation. The gain and phase stability of the output amplifier, board layout, and power supply decoupling will all affect the dynamic performance of the DAC754IA. The use of a compensation capacitor may be required when high-speed operational amplifiers are used. It may be connected across the amplifier's feedback resistor to provide the necessary phase compensation to critically dampen the output. See Figures 4 and 6. lOUT 2 I -+ DYNAMIC PERFORMANCE 20kCl I I ILEA.... FIGURE 3. DAC754lA Equivalent Circuit (All Inputs High). 10kCl 20kCl R-10kg ~~~~~-----,------~~--~--oIOOT1 ~ VREFERENCE 6 Bit12 (LSB) Digital Inputs (DTLlTTLlCMOS Compatible) Switches shown for digital inputs "'high"'. FIGURE 1. Simplified DAC Circuit. EQUIVALENT CIRCUIT ANALYSIS Figures 2 and 3 show the equivalent circuits for all digital inputs low and high respectively. The reference current is switched to lOUT 2 when all inputs are low and lOUT I when inputs are high. The ILEAKAGE current source is the combination of 'surface and junction leakages to the substrate; the 1/4096 current source represents the constant one-bit current drain through the ladder termi- APPLICATIONS OP AMP CONSIDERATIONS The input bias current of the op amp flows through the feedback resistor, creating an error voltage at the output of the op amp. This will show up as an offset through all 164 codes of the transfer characteristics. A low bias current op amp such as the OPA606 is recommended. unipolar D/A converter. With an AC reference voltage or current, the circuit provides two-quadrant mUltiplication (digitally controlled attenuation). The input/ output relationship is shown in Table I. C, phase compensation (10 to 25pF) in Figure 4 may be required for stability w'hen using high speed amplifiers. C, is used to cancel the pole formed by the DAC internal feedback resistance and output capacitance at Out,. Low offset voltage and Vos drift are also important. The output impedance of the DAC is modulated with the digital code. This impedance change (approximately IOkO to 30kO) is a change in closed-loop gain to the op amp. The result is that Vos will be multiplied by a factor of one to two depending on the code. This shows up as a linearity error. Offset can be adjusted out using Figure 4. Gain may be adjusted using Figure 5. TABLE I. Unipolar Codes. Binary Input MSB MSB B, • • • • • • • • • • 8 , 2 1111 1111 1111 1000 0000 0000 0000 0000 0001 0000 0000 0000 DAC7541A' -f-Vcc B' B. B, VREF ( -+-+-+ ,248 - < OUT - - o .. ) ... +B- 4096. BIPOLAR FOUR-QUADRANT OPERATION -10V " VRE' " +10V O --+--oVOUT OPA606 FIGURE 7. pigitally Programmable Gain Block. 166 DAC7545 BURR-BROWN® 113131 ADVANCE INFORMATION Subject to Change Low-Cost 12-Bit CMOS Buffered Multiplying DIGITAL-TO-ANALOG CONVERTER FEATURES • • • • • FOUR-QUADRANT MULTIPLICATION LOW GAIN TC: 2PPM/oC Iyp MONOTONICITY GUARANTEED OVER TEMPERATURE SINGLE 5V TO 15V SUPPLY TTL/CMOS LOGIC COMPATIBLE • • • • • VERY LOW OUTPUT LEAKAGE: IOnA max VERY LOW OUTPUT CAPACITANCE: 70pF max VERY LOW GLITCH ENERGY: 250nV-s Iyp PROTECTION SCHOTTKY NOT REQUIRED DIRECT REPLACEMENT FOR AD7545, PM7545A DESCRIPTION The DAC7545 is a low-cost CMOS, l2-bit fourquadrant multiplying, digital-to-analog converter with input data latches. The input data is loaded into the DAC as a i2-bit data word. The data flows through to the DAC when both the chip select (CS) and the write (WR) pins are at a logic low. Laser-trimmmed thin-film resistors and excellent CMOS current switches provide true 12-bit integral and differential linearity. The device operates on a single +5V to +15V supply and is available in 20-pin side-brazed DIP, 20-pin plastic DIP or a 20-lead plastic SOIC package. Devices are specified over the commercial, industrial, and military temperature ranges and are available with additional reliability screening. The DAC7545 is well suited for battery or other low power applications because the power dissipation is less than O.5m W when used with CMOS logic inputs and_ VDD = 5V. A,a OBll-0BO (Pins 4-15) International Airport Industrial Park - P.O. Box 11400· Tucson. Arizona B5734 - Tel. (6021746·1111 - Twx: 910-952-1111 - Cable: BBRCORP - Telex: 66-6491 PDS·747 167 SPECIFICATIONS ELECTRICAL VREf = +10V, VOUT , = OV, ACOM = DCOM unless otherwise specified. MODEL DAC7545 Voo = +5V PARAMETER STATIC PERFORMANCE Resolution Relative Accuracy Voo = +15V UNITS (max) GRADE T.=+25'C TM1N-TM,uI" T.=+25'C TMIN""TMAXI1J All J,A,S K,B,T L,C,U GL,GC,GU J,A,S K,B, T L,C,U GL,GC,GU J,A,S K,B, T L,C,U GL,GC,GU 12 ±2 ±1 ±1/2 12 ±2 ±I 12 ±2 ±I 12 ±2 ±1 ±1/2 ±1/2 ±1/2 ±1/2 ±1/2 ±4 ±I ±1 ±I ±25 ±15 ±10 ±6 ±4 ±I ±I ±1 ±25 ±15 ±10 ±7 Bits LSB LSB LSB LSB LSB LSB LSB LSB LSB LSB LSB LSB ±1/2 TEST CONDITIONS/COMMENTS ±4 ±1 ±I ±1 ±20 ±10 ±5 ±1 ±1I2 ±4 ±I ±I ±I ±2O ±IO ±6 ±2 All ±5 ±5 ±10 ±10 ppm/'C All J, K, L, GL A,B,C,GC S, T, U, GU 0.015 ±10 ±10 ±IO 0.03 50 50 200 0.01 10 10 10 0.02 50 200 %/% nA nA nA DYNAMIC PERFORMANCE Current Settling Time'" All 2 2 2 2 JJS To 1/2LSB. Out, load = lOOf1. DAC output ~asured from falling edge of WR. CS = OV. Propagation Delay'3I (from digital input change to 90% of final analog output) Glitch Energy AG Feedthrough at lOUT , 10' All All All 300 400 5 250 ns 5 250 5 5 mVp_ pll5l Out, load = l00f1. CEXT = 13pF14'. V..., = ACOM. VA.' '" ±IOV, 10kHz sine wave. REFERENCE INPUT .Input Resistance (pin 19 to ACOM) All 7 25 7 25 7 25 7 25 kn 171 All All '70 200 70 200 70 200 70 200 pF pF DIGITAL INPUTS V'H (Input High Voltage) VOl (Input Low Voltage) I'N (Input Current)'BJ Input Capacitance l31 : DBo-DBu WR.CS All All All All All 2.4 0.8 ±I 5 2.4 0.8 ±IO 5 20 13.5 1.5 ±I 5 Vl71 20 13.5 1.5 ±10 5 20 SWITCHING CHARACTERISTICS'" Chip Select to Write Setup Time All 280 200 0 250 175 140 100 180 120 0 160 100 90 60 10 200 150 0 240 170 120 80 10 2 100 10 2 100 10 Differential Nonlinearity Gain Error (with Internal RFB)'" Gain Temperature Coefflcientl31 (I!.Gain/l!.Temperature) DC Supply Rejectlon'3I (I!.Galn/I!.V••) Output Leakage Current at Out 1 ACOUTPUTS Output CapacitanceI3': COUT 1 ,COUT 2 20 'Chip Select io Write Hold Time, tC" Write Pulse Width, tWA All All Data Setup Time, tos All Data Hold Time, tOH All W 380 270 0 400 280 210 150 10 POWER SUPPLY,I.. All All All 2 100 10 2 500 10 Ics 50 nV-sf$l , 1D-bit monotonic, T..1N to TMAX• 12-bit monotonic, TMIN to TMAX. 12-bit monotonic, TMIN to TMAX• 12-bit monotonic, TM'N to T..... {D/A register loaded with FFFH. Gain error is adjustable using the circuits In Figures 4 and 5. Typical value is 2ppm/'C for V•• = +5V. I!.Voo=±5%. DBo-Ds" = OV; WR, CS = OV. Input resistance TC = 3OOppm/'C15': kCl DBa-Os" = OV; WR, CS = OV. DBo-Ds" = V•• ; WR, CS = OV. V /J A pF pF V1N ::;. 0 or Voo. ns·71 See Figure I. V'N= OV. V'N =OV. nsl51 ns· 71 nsm ns llli tcs ?!: tWA. tcH ;;:: O. n8m nsl51 ns'71 rnA /JA pAIS) All digital inputs VOl or V'H. All digital inputs OV or Voo. All digital Inputs OV or Va •. NOTES: (1) Temperature ranges-JP, KP, LP, GLP: D'C to 7D'C. AH, BH, CH. GCH: -25'C to +85'C. SH. TH. UH. GUH: -55'C to +125'C. (2) This includes the effect of 5ppm max gain TC. (3) Guaranteed but not tested. (4) DBo-DB" = OV to Vao or V.o to OV. (5) Typical. (6) Feedthrough can be further reduced by connecting the metal lid on the ceramic package (suffix H) to DCOM. (7) Minimum. (8) Logic Inputs are MOS gates. Typical input current (+25'C) is less than InA. (9) Sample tested at +25'C to ensure compliance. . 168 MECHANICAL 20-Pln Hermellc DIP (H Sulllx) IA'l ,,"J~[~~]] t ~ r LJ t-- k lUi IUl lUi lUi ~ ~ W:!~-1 J L JL . 0 Pin numbers shown for reference only. Numbers may not be marked on package. B F~ G NOTE: Leads in true position wilhin .010" (.25mm) R al MMC at seating plane. ,1 I C • K G i J K L N Sealing Piane INCHES MIN MAX .990 1.010 .285 .305 .100 .140 .016 .020 .054 TYP .095 .105 .009 .012 .170 BASIC .300 .320 .025 .045 DIM A B C D F MILLIMETERS MIN MAX 25.15 25.65 7.24 7.75 2.54 3.56 0.41 0.51 1.37TYP 2.41 2.67 0.23 0.31 4.32 BASIC 7.62 8.13 0.64 1.14 20-Pln Plasllc DIP (P Suffix) ~,J:::::::: ~ NOTE: Leads in true position wilhin .010" (.2Smm) R al MMC at seating plane. f Pin numbers shown for reference only. Numbers may not be marked on package. B r DIM A B C D G H • C t \ t Sealing~ Plane [I -J tl tl tlJttlo tl tl :l!f1ill1J1I1I1---.t LG .040 .060 J .008 .015 0.20 0.38 K L M N .115 .280 O· .000 .150 .300 10' .020 2.92 7.11 3.81 7.62 10' 0.51 o· 0.00 NOTE: Leads in true position wilhin .010" (.25mm) R ., MMC at seating plane. CJJJ ~~ tl .210 .022 .100 BASIC .014 MILLIMETERS MIN MAX 24.89 25.91 6.10 7.11 5.33 0.59 0.36 2.54 BASIC 1.02 1.52 20-Pln sOle (U Sulllx) E:~ Pin1 , K INCHES MIN MAX 1,020 .980 .240 .280 * C NJ f \-,JJf c> co k,JJ J1 M L L_ _ 169 DIM A A, B B, C D G H J L M N INCHES MIN MAX .502 .518 .518 .495 .286 .302 .270 .285 .093 .108 .015 .019 .050 BASIC .026 .034 .008 .012 .390 .422 O· 10' .000 .012 MILLIMETERS MIN MAX 12.75 13.16 12.57 13.16 7.26 7.67 6.86 7.24 2.36 • 2.74 0.38 0.48 1.27 BASIC 0.66 0.86 0.20 0.30 9.91 10.72 O· 10' 0.00 0.30 PIN DESIGNATIONS ABSOLUTE MAXIMUM RATINGS· TA = +25'C unless otherwise noted. OUTt OGNO (~SB)OB11 Voo to DCOM ................................... -0.3V, +17 Digital Input to DCOM .......................... -0.3V, Voo V'F., V'EF, to DCOM ................................... ±25V VPIN 1 to DCOM .................................. -0.3V, Voo ACOM to DCOM .... : ....: ...................... -0.3V, Voo (,ower Dissipation: Any Package to + 75'C ..... 450mW . Derates aboye +75'C by ... 6mW/'C Operating Temperature: Commercial-JP, KP, LP, GLP .......... O'C to +70°C Industrial-AH, BH, CH, GCH ........ -25°C to +85'C Military-SH, TH, UH, GUH ......... -55'C to +125°C Storage Temperature ................... -65'C to +150'C Lead Temperature (soldering, lOs) ............... +300'C 1 VDD WR 4 CS OB10 OBO(LSB) '20 Pin Epoxy DIP (P Suffix) OBI OB7 OB2 OB6 OB3 20 Pin Hermetic DIP (H Suffix) OB5 20 Pin SOIC (U Suffix) *NOTE: Stresses above those listed above may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. WRITE CYCLE TIMING DIAGRAM Mode.Selectlon VDD Write Mode Hold Mode CS and WR low, OAC responds to data bus (OB,-OB,,) inputs Either CS or WR high, dala bus (OB,-OB,,) is locked oul; OAC holds lasl data present when CS or WR assumed high state. ¥iii - - -....~tWR-}r---;DD NOTES: VDD = 5V; I, = tF = 20ns . Voo :;::: 15V; tR = tF = 40n5. All input signal rise and fall times measured from 10% to 90% oivDD. Timing measurement reference is VIM + VIL.2 . I:--tos-8 Data In -----~X Data Valid (OB,-OB,,) _ _ _ _ _J. ' - X'--VDD . . . - - - if> • ENVIRONMENTAL SCREENING (QM SCREENING) Burr-Brown /QM models are environmentally screened versions of our standard industrial products, designed to provide enhanced reliability. The screening is performed to selected methods of MIL-STD-883. Reference to these methods provides a convenient method of communicating the screening levels and procedures employed; it does not imply conformance to any other military standards or to any methods of MIL-STD-883 other than thQse specified. DISCUSSION OF SPECIFICATIONS Relative Accuracy This term (also known as linearity) describes the transfer function of analog output to digital input code. The linearity error describes the deviation from a straight line from zero to full scale (zero- and full-scale adjusted). Differential Nonlinearity' MIL-STD-883 High Temperature Storage 1008 C +150'C, 24hrs Differential nonlinearity is the deviation from an ideal lLSB change in the output, for adjacent input code changes. A differential nonlinearity specification of ±I.OLSB guarantees monotonicity. Temperature Cycl. 1010 C -65 to +150'C, 10 Cycles Gain Error Burn-In 1015 B +125'C, Figure 1 Constant Acceleration. 2001 E Hermeticity: Fine Leak Gross Leak 1014 1014 AlorA2 C External Visual 2009 Screen Method Condition Internal Visual 2010 B Comments Gain error is the difference in measure of full-scale output versus the ideal DAC output. The ideal output for the DAC7545 is -(4095/4096) (VREF). Gain error may be adjusted to zero using external trims as shown in . the applications section. 30,OOOG 5 X 10-' atm cels 60psig, 2hrs 170 Output Leakage Current Propogation Delay The measure of current which appears at OUT I with the DAC loaded with all zeros. This is the measure of the time that is required for the analog output to reach 90% of its final value for a change in digital input code. Multiplying Feedthrough Error CIRCUIT DESCRIPTION This is the AC error output due to capacitive feed through from VREF to OUT I with the DAC loaded to all zeros. This test is performed at 10kHz. Figure 2 shows a simplified schematic of the digi"tal-toanalog converter portion of the DAC7545. The current from the VREF pin is switched from lOUT 1 to AGND by the FET switch. This circuit architecture keeps the resistance at the reference pin constant and equal to RLDR, so the reference could be provided by either a voltage or current, AC or DC, positive or negative polarity, and have a voltage range up to ±20V even with Voo = 5V. The RLDR is equal to "R" and is typically Ilk!}. The output capacitance of the DAC7545 is code dependent and varies from a minimum value (70pF) at code OOOH to a maximum (200pF) at code FFFH. Output Current Settling Time This is the time required for the output to settle to a tolerance of ±0.5LSB of final value from a change in code of all zeros to all ones, or all ones to all zeros. Propagation Delay This is the measure of the delay of the internal circuitry and is measured as the time from a digital code change to the point at which the output reaches 90% ~f final value. Digital-To-Analog Glitch Impulse VREF R R R R ~ This is the measure of the area of the glitch energy measured in nanovoit-seconds. Key contributions to glitch energy are internal circuitry timing differences and charge injected from digital logic. The measurement is performed with VREF = GND and an OPA600 as the output op amp and C 1 (phase compensation) = OpF. 1 I Monotonicity I Monotonicity assures that the analog output will increase or stay the same for increasing digital input codes. The DAC7545 is guaranteed monotonic to l2-bit accuracy, ,except the J, A, S grades are specified to be IO-bit monotonic. OB9 Vee ~~ C, C, of OUT 1 R" AGNO R, 20 R, 19 1kO c, + APPLICATIONS VREF OGNO Figure 3 shows the DAC7545 connected for unipolar operation. The high-grade DAC7545 is specified for a ILSB gain error, so gain adjust is typically not needed. However, the resistors shown are for adjusting full-scale errors. The value of RI should be minimized to reduce the effects of mismatching temperature coefficients between the internal and external resistors: A range of adjustment of 1.5 times the desired range will be adequate. For example, for a, DAC7545JP, the gain error is specified to be ±25LSB. A range of adjustment of Vee 18 100kO 4 011(MSB) WR 17 ,---........;5'-1010 6 09 ' CS 16 ;--'NI.--, 07 (LSB)OO 01 14 13 02 9 06 03 12 10 05 04 11 7 08 8 OBO (LSB) The input buffers are CMOS inverters, designed so that when the DAC7545 is operated from a 5V supply (VOD), the logic threshold is TTL-compatible. Being simple CMOS inverters, there is a range of operation where the inverters operate in the linear region and thus draw more supply current than normal. Minimizing this transition time and insuring that the digital inputs are operated as close to the rails as possible will minimize the supply drain current. Power supply rejection is the measure of the sensitivity of the output (full scale) to a change in the power supply voltage. VREF AGNO I FIGURE 2. Simplified DAC Circuit of the DAC 7545. Power Supply Rejection +10V I I FIGURE I. Burn-In Circuit. 171 ±37LSB will be adequate. The equation below results in a value of 4580 for the potentiometer (use 5000). RI =:' RLADDER 4096 (3 X Gain Error) resistor of A2. The input/ output relationship is shown in Table II. TABLE II. Bipolar Codes. Analog Output Binary Code MSB R, 1111 1000 0111 0000 R, FIGURE 3. Unipolar Binary Operation. The addition of RI will cause a negative gain error. To compensate for this error, R2 must be added. The value of R2 should be one-third the value of R I. The capacitor across the feedback resistor is used to compensate for the phase shift due to stray capacitances of the circuit board, the DAC output capacitance, and op amp input capacitance. Eliminating this capacitor will result in excessive ringing and an increase in glitch energy. This capacitor should be as small as possible to minimize settling time. The circuit of Figure 3 may be used with input voltages up to ±20V as long as the output amplifier is biased to handle the excursions. Table I represents the analog output for four codes into the DAC for Figure 3. VOUT WR ::;; -VIN CS OBO-OBll +5V 18 OAC7545 19 NOTE: There must be at least lLSB or the amp will saturate due to the lack of feedback. VOUT -V'N (4095/4096) -V'N (2048/4096) = 1I2V,N -'V'N (1/4096) OVolls Figure 4. shows the connections for bipolar four-quadrant operation. Offset can be adjusted with the Al to A2 summing resistor, with the input code set to 10000000 0000. Gain may be adjusted by varying the feedback +VREF (2047/2048) OVolls -VREF (1/2048) -VREF (2048/2048) . . . - - - - - ' - - 0 V'N LSB 111111111111 1000 0000 0000 0000 0000 0001 0000 0000 0000 1111 0000 1111 0000 OB,,+ DB" + DB. + ... + DB. 1 2 3 4096 Analog Output Binary Code 1111 0000 1111 0000 Figure 5 shows a hook-up for a digitally-controlled gain block. The feedback for the op amp is made up of the FET switch and the R-2R ladder. The input resistor to the gain block is the RFB of the DAC7545. Since the FET switch is in the feedback loop, a "zero code" into the DAC wili result in the op amp having no feedback, and a saturated op amp output. TABLE I. Unipolar Codes. MSB LSB FIGURE 5. Digitally-Controlled Gain Block. APPLICATIONS HINTS CMOS DACS such as the DAC7545 exhibit a codedependent output resistance. This resistance and the Vos of the op amp cause error currents to flowlhat look like linearity and superposition errors. To minimize these errors, an op amp with a Vos of less· than O.lLSB should be selected. Also, the op amp should have a gain that is sufficient to keep Vos below O.lLSB for the desired swing and load at the op amp output. VOUT=+VREF( ~+~+~+ ••• +~-1) 124 2048 FIGURE 4. Bipolar Four-Quadrant Multiplier. As with all analog circuits, the care in designing the ground system is critical to system accuracy. Static (DC) errors should be held to less than O.lLSB for any point in the analog ground path. Holy point sensing is encouraged, so that all analog circuits are referenced. to the same potential. 172 THIS PAGE iNTENTIONAllY LEFT BLANK 173 BURR-BROWN® DAC8012 113131 ADVANCE INFORMATION I Subject to Change Low Cost 12-Bit CMOS Latched-Readback Multiplying DIGITAL-TO-ANALOG CONVERTER FEATURES • • • • • • • • • • data word. The data is loaded into the DAC from the bus when both the data strobe (DS) and the read/write (RD/WR) pins are held low. Data may be read back from the DAC by holding OS low and (RD/WR) high. This readback feature enables the user to monitor the state of mUltiple DACs on a single bi-directional bus. Laser-trimmed thin-film resistors and excellent CMOS current switches provide true l2-bit integral and differential linearity. The device operates on a single +SV to + ISV supply and is available in 20-pin side-brazed DIP, 20-pin plastic DIP or a 20-lead plastic SOIC package. Devices are specified over the commercial, industrial, and military temperature ranges and are available with additional reliability screening. The DAC8012 is well suited for battery or other lowpower applications because the power dissipation is' less than O.SmW when used with CMOS logic inputs and VDO= SV. DATA READ BACK CAPABILITY FOUR-QUADRANT MULTIPLICATION LOW-GAIN TC: 2PPM/oC typ MONOTONICITY GUARANTEED OVER TEMPERATURE SINGLE 5V TO 15V SUPPLY VERY LOW OUTPUT LEAKAGE (IOnA maxi VERY LOW OUTPUT CAPACITANCE (70pF maxi VERY LOW GLITCH ENERGY (400nVs maxi PROTECTION SCHOTTKY NOT REQUIRED DIRECT REPLACEMENT FOR PMI DACB012 DESCRIPTION The DAC8012 is a low-cost CMOS, 12-bit, fourquadrant multiplying, digital-to-analog converter with input data latches and read back capabilities. The input data is loaded into the DAc as a l2-bit I VRE , I 12-Bil . OUT 1 c H l - - - - - - - - - I Multiplying ) 1 L-JD~A~C~~-----~---toAGND ..., ?-L....._ _ _--, 1~---,__l1 RD/WRcHl--_-·~_· rr-l~np~u~tD~a~la.....,1 Os T ~L.....,:,L;at;:.\Ch~es~·... t ~ . :fL-------J I I_Three-State L Output Buffers .--- 1 ... DGND ~ 0 DB1.1 ... DBO International Airport Industrial Park - P.O. Box 11400· Tucson, Arizon. 85734· Tel. (6021 746-1111 - Twx: 9tO-952-111t - Cable: BBRCORP - Telex: 66-6491 PDS-7sn 174 SPECIFICATIONS ELECTRICAL CHARACTERISTICS VREF ;:;;; +10V. VOUT 1 ~ av, AGNO ;:;;; DGND ;:;;; OV unless otherwise noted. DACB012A, J, SI1I DAC8012B, K, TI1I PARAMETER CONDITIONS MIN TYP MAX MAX UNITS ±1I2 ±1 ±1 ±2 ±1 ±1 ±3 ±4 Bits LSB LSB LSB LSB ±5 0.002 ±5 0.002 ppm/oC %1% 0.004 0.004 %1% MIN TYP VOD ;:;;; +SV or +1SV STATIC ACCURACY Resolution 12 Relative Accuracy Differential Nonlinearityl21 Gain Error(3U41 TA TA Gain Temperature Coefficient /!l.Gain/.ll. Temperature(SU61 DC Supply Rejection .Il.Gain/8.VoD '" Output Leakage Current at OUT 1 DYNAMIC PERFORMANCE Propagation Delay(SU71181 Current Settling Timel5U81 n.Utr.h F.np.rgyISJ, V~O:" = AGND J:'.C Feedthrough at lOUT 1 (5)(111 12 T" = Full temperatura rango TA ;:;;; Full temperature range ;:;;; = +25°C Full temperature Range TA = +2S·C (t. Vee = ±S%) TA ::;;:; Full temperature range (t. Vee = ±S%) TA = +2S·C, ROIWR = iSS = OV, all digital inputs = OV TA ;:;;; Full temperature range S. T versions J, K. A. B versions 10 10 nA 200' 25 200 25 nA nA 300 300 ns 1 400 500 1 400 500 ps nVs nVs 5 5 mVp-p 15 kO 70 150 pF pF O.S 1 10 12 6 V V pA pA pF pF 0.4 10 V V pA 300 400 215 375 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 2 mA 100 pA TA=+25°C (OUT 1 Load = tOon, em = 13pF) T" ;:;;; Full temperature range (to 112 LSB) leuT' Load = loon T.=+25·C T... = Full temperature range TA = Full temperature range, VREF = ±10V, f = 10kHz REFERENCE INPUT In'put Resistance (Pin 19 to GNO)'''' T... = Full temperature range ANALOG OUTPUTS Output Capacitance'S) COUT2 COUT1 T... = Full temperature range DBO-DBII = OV, RDiWii =liS = OV 080-0811 = Vae, ROiWii =OS =OV 7 11 15 7 11 70 150 Vee = +5V DIGITAL INPUTS Input High Voltage Input Low Voltage Input Current(9) Input Capacitance l51 : OBO-OB11 ROIWR,D§ DIGITAL OUTPUTS Output High Voltage Output Low Voltage Three-State Output Leakage Current SWITCHING CHARACTERISTICS"" Write to Data Stobe Setup Time Data Strobe to Write Hold Time Read to Data Strobe Setup Time Data Strobe to Read Hold Time Write Mode Data Strobe Width Read Mode Data Stroba Width Data Setup Time Oata Hold Time Data Strobe to Output Valid Time (3 ) Output Active Time from Deselection POWER SUPPLY Supply Current T... = Full temperature T... = Full temperature TA=+25°C TA = Full temperature TA = Full temperature T... = Full temperature range range 2.4 2:4 0.8 1 10 12 6 range range range Ie = 400pA le=-1.6mA See timing diagram TA =+25·C TA =Full temperature range TA=+25·C TAo = Full ~emperature range TA=+2S·C TA = Full temperature range TA=+25°C TAo = Full temperature range TA=+25°C TAo = Full temperature range TA=+25°C TA = Full temperature range TA =+25·C TA = Full temperature range TA=+2S·C TA = Full ter:nperature range TA=+2S·C TAo = Full temperature range TA=+25°C TA = Full temperature range 4.0 4.0 0.4 10 0 0 0 0 0 0 0 0 180 250 220 290 210 250 0 0 0 0 0 0 0 0 0 0 180 250 220 290 210 250 0 0 300 400 215 375 TA = Full temperature range (all digital inputs V1NL or VINH) TA = Full temperature range (all digital inputs OV or Vee) 2 10 175 100 10 ELECTRICAL CHARACTERISTICS (CO NT) DAC8012A, J, Sm DAC8012B, K, T'" PARAMETER CONDITIONS MIN TYP I MAX MIN I TYP MAX I UNITS VDo =+15V DIGITAL INPUTS Input High Voltage Input Low Voltage Input Current(9 ) Input Capacitance"': DBO-DBII RDtWR, OS DIGITAL OUTPUTS Output High Voltage Output Low Voltage Three-State Output Leakage Current SWITCHING CHARACTERISTICSnm Write to Data Strobe Setup Time Data Strobe to Write Hold Time Read to Data Strobe Setup Time Data Strobe to Read Hold Time Write Mode Data Strobe Width Read Mode Data Strobe Width Data Setup Time Data Hold Time Data Strobe to Output Valid Time Output Active Time for Deselection POWER SUPPLY Supply Current TA = Full temperature range T. ;" Full temperature range T.=+25'C T. = Full temperature range T. = Full temperature range T. = Full temperature range 13.5 lo=3mA lo=-3mA 13.5 0 0 0 0 0 0 0 0 100 120 110 150 1.5 10 V V pA· 180 220 180 250 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 2 mA 100 pA 0 0 0 0 0 0 0 0 100 120 110 ISO 90 120 0 0 90 120 0 0 180 220 180 250 TA = Full temperature range (all digital inputs V,NL or V'NH) T. = Full temperature range (all digital inputs OV or Voo) V V pA pA pF pF 13.5 1.5 10 See Timing Diagram T.=+25'C TA::; Full temperature range T.= +25'C T. = Full temperature range T.= +25'C TA = Full temperature range TA= +25'C TA;;:; Full temperature range T.= +2S'C T. = Full temperature range T.=+2S'C TA = Full temperature range . TA=+2S'C T. = Full temperature range T.=+25'C TA = full temperature range TA=+2S'C T. = Full temperature range T.=+2S'C TA = Full temperature range 1.5 1 10 12 10 13.5 1.5 1 10 12 10 2 10 100 10 NOTES: (1) T. = -SS'C to +12S'C for S, T grades. T. = -25'C to +85'C for A. B grades. T. = O'C to +70'C for J. K grades. (2) 12-bit monotonic over full temperature range. (3) Includes the effects of Sppm max gain T.C. (4) Using Internal R'B. DAC register loaded with 111111111111. (5) Guaranteed but not testad. (6) Typical value is 2ppm/'C for Voo = +SV. (7) From digital input change to 90% of final analog output. (8) All digital inputs = OV to Voo: or Voo to OV. (9) Logic inputs are MOS gates. typical input current (at +2S'C) is.less than InA. (10) Sample tested at +2S'C to ensure compliance. (11) Feedthrough can further be reduced by connecting the metal lid on the sidebraze package (Suffix H) to DGND. (12) Resistor T.C. = +100ppm/'C max. (13) CL = l00pF. MECHANICAL 20-Pln Hermetic DIP (H Suffix) IA~ ~J~[~~]] F~ t-- I P-li jlJj jl.Q \Ill P-li ~ ~ [}lJ ~----.t J1 JL l~'~"~M' NOTE: Leads in true position within .010" (.2Smm) R at MMC at seating plane. t Pin numbers shown for reference only. Numbers may not be marked on package. B ~ t C rt • • K 176 DIM A B C D F G J K L N INCHES MIN MAX .990 1.010 .285 .305 .100 .140 .016 .020 .054 TYP .095 .105 .009 .012 .170 BASIC .300 .320 .025 .045 MILLIMETERS MIN MAX 25.15 ·25.65 7.24 7.75 2.54 3.56 0.41 0.51 1.37 TYP 2.41 2.67 0.23 0.31 4.32 BASIC 7.62 8.13 0.64 1.14 20-Pin Plastic DIP (P Suffix) NOTE: Leads in true position within .010" (.2Smm) R at MMC at seating plane. Pin numbers shown for reference only. Numbers may not be marked an package. B * DIM A B C D • C G K K L M N t Seating Plane J. H J 4 INCHES MIN MAX .!JSO 1.020 .240 .280 .210 .014 .022 .100 BASIC .040 .060 .008 .015 .115 .150 .280 .300 O· 10' .000 .020 MILLIMETERS MIN MAX 24.S!) ::!5.!l1 6.10 7.11 5.33 0.36 0.59 2.54 BASIC 1.02 1.52 0.20 0.36 2.92 3.81 7.11 7.62 O· 10' 0.00 0.51 20-Pln SOIC (U Suffix) NOTE: Leads in true position within .010" (.2Smm) R at MMC at seating plane. Pin numbers shawn far reference only. Numbers may not be marked on package. \=- J)L., IlJJ MLL~t 0 AGND DB10 DB9 MILLIMETERS MIN MAX 12.75 13.16 12.57 13.16 7.26 7.67 7.24 6.86 2.74 2.36 0.38 0.48 1.27 BASIC 0.86 0.66 0.30 0.20 9.91 10.72 0' 10' .0.00 0.30 (TA = +25°C, unless otherwise noted.) Vee to DGND .............................•.......••• -.03V. +17V Digital Input Voltage to DGND .......•...........•..•. , -0.3V. Vee ·AGND to DGND ........••....••.........•............ -0.3V. Vee VR, •• VREF to DGND • . . . . . . • . . • . . • • . . . . . .. . . . . . . . . . . . . . . . • • .• ±2SV V.,N , to DGND. . . . . • . . . . . . . . . . . . . • . • . . . .. . . . . . . . . . . . .. -0.3V. Vee Power Dissipation (any package) to +7S'C ...•.....•...... 4SomW Derates Above +7S'C by ..•....•............•...•....• 6mW/'C Operating Temperature Range Military Grades ......•.••....••.••....•••..... -SS'C to +12S'C Industrial Grades ....•.........•..•............ -2S'C to +BS'C Commercial Grades ............................... O°C to +70°C Storage Temperature .....•...•...•...... , ....... -6S'C to +1SO'C Lead Temperature (soldering. 60s) ••••....••••........•... +300'C CAUTION 1. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to above maximum rating conditions for extended periods may affect device reliability. . 2. Do not apply voltages higher than Vee or less than GND potential on any terminal except VREF. 3. The digital inputs are zener protected, however, permanent damage may occur on unprotected units from high-energy electrostatic fields. Keep units in conductive foam at all times until ready to use. Use proper antistatic handling procedures. 4. Remove power before inserting or removing units from their sockets. OUT1 (MSB)DB11 J L M N INCHES MIN MAX .502 .518 .495 .518 .286 .302 .270 .285 .093 ,108 .015 .019 .050 BASIC .034 .026 .012 .008 .390 .422 0' 10' .000 .012 ABSOLUTE MAXIMUM RATINGS PIN DESIGNATIONS DGND DIM A A, B B, C D G H Voo RDIWR os DBB DBo(LSB) -20 Pin Epoxy DIP DB1 (P Suffix) DB7 DB2 DB6 DB3 DBS DB4 20 Pin Hermetic DIP (H'Suffix) 20 Pin SOIC (U Suffix) 177 TIMING DIAGRAM twsu _____ Read Cycle NOTES: VDn = +5V; tR = tF :::: 20n8 Voe = +15V; tR :;:: lJ = 40n8 os All input signal rise and fall ties measured trom 10% to 90% of VDD , Timing measurement 3-State Data Bus -...;..;.;....;;..c reference level is 'VlN+VIL Dilts Valid --2- ENVIRONMENTAL SCREENING (aM SCREENING) Output Leakage Current Burr-Brown IQM models are environmentally-screened versions of our standard industrial products, designed to provide enhanced reliability. The screening is performed to selected methods of MIL-STD-883. Reference to these methods provides a convenient method of communicating the screening levels and procedures employed; it does not imply conformance to any other military standards or to any method of MIL-STD-883 other than those specified. The measure of current which appears at OUT, with the DAC loaded with all zeros. Screen MIL-STD-883 Method, Condition , 2010, B High Temperature Storage 1008, C 150'C, 24hrs Temperature .Cycle 1010, C -65'C to +150'C, 10 Cycles Burn-In 1015, B +125'C, Figure 1 Constant Acceleration 2001, E 30,000G Hermeticity: Fine Leak 1014, A1 or A2 5 X 10'" atm cc/s 1014,C 60psig, 2hrs Gross Leak This is the AC error output due to capacitive feedthrough from VREF to OUT, with the DAC loaded to all zeros. This test is performed at 10kHz. Output Current Settling Time Comments Internal Visual External Visual Multiplying Feedthrough Error 2009 DISCUSSION OF SPECIFICATIONS Relative Accuracy This term (also known as linearity) describes the transfer function of analog output to digital input code. The linearity error describes the deviation from a straight line from zero to full scale (zero and full scale adjusted). Differential Nonlinearity Differential nonlinearity is the deviation from an ideal ILSB change in the output, for adjacent input code changes. A differential nonlinearity specification of ±ILSB guarantees monotonicity. Gain Error Gain error is the difference in measure of full-scale output versus the ideal DAC output. The ideal output for the D~C8012 is -(409~/4096) (~REF) •. Gain error may be adjusted to zero usmg external tnms as shown in the applications section., This is the time required for the output to settle a tolerance of ±1/2LSB of final value from a change in code of all zeros to all ones, or 'all ones to all zeros. Propagation Delay This is the measure of the delay of the internal circuitry and is measured as the time from a digital code change to the point at which the output reaches 90% of final value. Dlgital-To-Analog Glitch Impulse :rhis is the measure of the area of the glitch ene'rgy measured in nanovolt-seconds. Key contributions to glitch energy are internal circuitry timing differences and charge injected from digital logic. The measurement is performed with V REF = GND. Monotonicity Monotonicity assures that the analog output will increase or stay the same for increasing digital input codes. The DAC8012 is guaranteed monotonic to 12-bit accuiacy except the J, A, S grades are specified IO-bit monotonic. Power Supply Rejection Power supply rejection is the measure of the sensitivity of the Qutput (full scale) to.a change in the power supply ' voltage. Propagation Delay This is the measure of the time that is required fo'r th~ analog output to reach 90% of its final value for a change in digital input code. 178 +10V VREF sition time and insuring that the digital inputs are operated as close to the rails as possible will minimize the supply drain current. c, VOO DIGITAL SECTION 100kO OUT1 R,. AGNO VREF OGNO Vee 011(MSB) RO/WR R, 19 18 17 Os 010 10 Figure 3 shows the basic current switch. Figure 4 shows the schematic of the input/ output buffers. When the OS and the RD / WR are held low the latches are transparent and pass data from the data bus to the DAC. When the OS is held low and the RD / WR line is held high, the three-state buffer becomes active and the data at the DAC is presented to the digital input/ output lines for data read back. 20 09 (LSB)OO DB 01 07 02 06 03 04 05 R, 14 13 To Ladder 5kO 12 From Interface 11 Logic 0--1 FIGURE I. Burn-In Circuit. AGNO FIGURE 3. N-Channel Current Steering Switch. CIRCUIT DESCRIPTION DIGITAL-TO-ANALOG SECTION Figure 2 shows a simplified schematic of the digital-toanalog portion of the DAC80l2. The current from the VREF pin is switched from louT I to AGND by the FET switch for that bit. This circuit architecture keeps the resistance at the reference pin constant and equal to RWR, so the reference could be provided by either a voltage or R ,------------RB r-----------------<=~---------,ToAGNO Switch ..-:----+-~ To OUT 1 Switch R A R WR 2R 2A 2R 2R OUT1 1 WR 2R FIGURE 4. Digital Input/Output Structure. APPLICATIONS I I I OB9 I I I OBO LSB AGNO FIGURE 2. Simplified Circuit ofthe DAC80l2. current, AC or DC, positive or negative polarity, and have a voltage range up to ±20V even with Voo == 5V. The RWR is equal to "R" and is typically llkO. The output capacitance of the DAC8012 is code dependent and varies from a minimum value (70pF) at code OOOH to a maximum (200pF) at code FFFH. The input buffers are CMOS inverters, designed so that when the DAC8012 is operated from a 5V supply (Voo), the logic threshold is TTL compatible. Being simple CMOS inverters, there is a range of operation where the inverters operated in the linear region and thus draw more supply current than normal. Minimizing the tran- Figure 5 shows the DAC8012 connected for unipolar operation. The high-grade DAC8012 is specified for a lLSB gain error, so gain adjust is typically not needed. However, the resistors shown are for adjusting full-scale errors. The value of RI should be minimized to reduce the effects of mismatching temperature coefficients V,N FIGURE 5. Unipolar Binary Operation. 179 between the internal and external resistors. A range of adjustment of 1.5 times the desired range will be adequate. For example, for a DACSOI2JP, the gain error is specified to be ±3LSB. A range of adjustment of ±4.5LSB will be adequate. The equation shows a minimum value of 330 for the pot. . RI = (RLADDER/4096) X (3 X Gain Error) The addition of RI will cause a negative gain error. To compensate for this error, R2 must be added. The value of R2 should be one third the value of R I. The capacitor across the feedback resistor is used to compensate for the phase shift due to stray capacitances of the circuit board, the DAC output capaCitance, and· op amp input capacitance. Eliminating this capacitor will result in excessive ringing and an increase in glitch energy in higher speed applications. This capacitor should be as small as possible to minimize settling time. The circuit of Figure 5 may be used with input voltages of up to ±20V as long as the output amplifier is biased to handle the excursions. Table I presents the analog ouput for four codes into the DAC for Figure 5. TABLE I. Unipolar Output Code for Figure 5. Binary Code Analog Output MSBI ILSB 111111111111 1000 0000 0000 0000 0000 0001 0000 0000 0000 -Y,N (4095/4096) -Y'N (2048/4096) = 1/2V,N -Y,N (1/4096) OVolls BIPOLAR FOUR-QUADRANT OPERATION Figure 6 shows the connections for bipolar four-quadrant operation. Offset can be ·adjusted with the Al to A2 summing resi!rtor, with the input code set to 10000000 0000. Gain may be adjusted by varying the feedback resistor of A2. The input! output relationship is shown iri Table II. Bo B, 82 Figure 7 shows a hook-up for a digitally-controlled gain block. The feedback for the op amp is made up of the FET switch and the R-2R ladder. The input resistor to the gain block is the RFB of the DACSOI2. Since the FET switch is in the feedback loop, a "zero code" into the DAC will result in the op amp having no feedback and a saturated op amp output. TheDAC8012 readback feature makes the DACSOl2 espeCially good for this configuration VOUT :;:;:: -VIN OB,,+ OB,o+ DB, + ... + OBo 1 2 3 4096 RO/WR OS OBO-OBll +5V 18 19 VOUT FIGURE 7. Digitally-Controlled Gain Block. when an automatic gain or automatic calibration routine is used. If the logic were set up to calibrate a value via logic external to the processor (successive approximation register), then when the calibration is done, the procc:ssor could read the DACSOl2 to store away the calibration code. Figure S shows the DACSOl2 interfaced to a l6-bit Bn vouT=+VREF(,+T + 3 + ••• + 2048 -1 ). FIGURE 6. Bipoiar Four-Quadrant Mulitplier. T~BLE II. Bipolar Codes and Analog Output for Figure 6. 68000MPU Binary MSBI ILSB 111111111111 1000 0000 0000 0111 11111111 0000 0000 0000 Analog Output +VREF (2047/2048) oVolts FIGURE S. l6-Bit Microprocessor to DACSOl2 Interface. -VREF (1/2048) -VREF (2048/2048) 180 microprocessor. The interface requires only address decoding to select the DAC to be written to or read from. Figure 9 shows an interface scheme for using the DAC8012 with an 8-bit microprocessor. The data for the first 4 bits are written and latched into the external write latch and the next 8 bits are presented on the bus. The DAC8012 is then instructed to pass the data through the internal DAC latch (WR + DS) and all 8 bits are transferred into the DAC. Reading data back is done in the same manner. ·Qo = Oecoded address for latch to DAe operations. Q, = Decoded address for data bus to input latch operation. a, = Decoded address for output latch to data bU5 operation. A,5t-----------------------------------------------------------~ Address Bus Ao t-------...., Q2' Processor System FIGURE 9. 8-Bit Processor to DAC8012 Interface. 181 BURR-BROWN® PCM56P 1E3E31 DESIGNED FOR AUDIO Serial Input 16-Bit Monolithic DIGITAL-TO-ANALOG CONVERTER This converter is completely self-contained with a stable, low noise, internal zener voltage reference; high speed current switches; a resistor ladder. network; and a fast settling, low noise output operational amplifier all on a single monolithic chip. The converters are operated using two power supplies that can range from±5V to ±12V. Power dissipation with ±5V supplies is typically less than 200mW. Also included is a provision for external adjustment of the MSB error (differential linearity error at bipolar zero) to further improve total harmonic distortion (THO) specifications if desired. Few external components are necessary for operation, and all critical specifications are 100% tested. This helps assute the user of high system reliability and outstanding overall system performance. The PCM56P is packaged in a high-quality f6-pin molded plastic DIP package and has passed operating life tests under simultaneous high-pressure, high-temperature, and high-humidity conditions. FEATURES • • • • • • • • • • • • • • • SERIAL INPUT LOW COST NO EXTERNAL COMPONENTS REQUIREO. 16~BIT RESOLUTION 15-BIT MONOTONICITY, TYP 0.001% OF FSR TYP DIFFERENTIAL LINEARITY ERROR 0.0025% MAX THO IFS Input, K Grade, 16 Bits) 0.02% MAX THO 1-20dB Input, K Grade, 16 Bits) 1.511s SETTLING TIME, TYP (Voltage Oul) 96dB DYNAMIC RANGE ±3V or ±lmA AUDIO OUTPUT EIAJ STC-OD7-COMPATIBLE OPERATES ON ±5V 10 ±12V SUPPLIES PINOUT ALLOWS lOUT OPTION PLASTIC DIP PACKAGE DESCRIPTION The PCM56P is a state-of-the-art, fully monotonic, digital-to-analog converter that is designed and specified for digital audio applications. This device employs ultra-stable nichrome (NiCr) thin-film resistors to provide monotonicity, low distortion, and low differential linearity error (especially around bipolar zero) over long periods oftime and over the full operating temperature. 16-Bit Input Latch 16-Bit Serial-te-Parallel Conversion . Clock LE Data International Airport Induslrial Park· P.O. Box 11400 . Tucson. Ari~ona 85734 . Tel. (6021 746·1111 . Twx: 91()'952·1I11 • Cable: BBRCORP • Telex: 66·6491 PpS-700 182 SPECIFICATIONS ELECTRICAL MECHANICAL Typical at +25°C and nominal power supply voltages of ±5V unless otherwise noted. MODEL PCMS6P/-J/-K MIN TYP MAX UNITS +VL +0.8 +1.0 -50 Bits V V pA pA MHz E- INPUT 16 +2.4 0 bH. V1N = +2.7V ItL. V1N = +O.4V Input Clock Frequency 10.0 l,l Jl P .r' 'v' 'v' 'v' V 'v' 'v' 'lI Pin 1 ACCURACY Gain Error Bipolar Zero Error Differential Linearity Error Noise (rms, 20Hz to 20kHz) at Bipolar Zero (Vou, models) ±2.0 ±30 ±0.001 6 TOTAL HARMONIC DISTORTION Vo = ±FS at I = 991Hz: PCM56P-K PCM56P-J PCM56P Vo = -20dB at f = 991 Hz: PCM56P-K PCM56P-J 0.0025 0.004 0.008 0.020 0.040 % % % % % 0.018 C.C~C ". Vo = -60dB at f = 991 Hz: PCM56P-K PCM56P-J PCM56P 1.8 1.8 1.8 2.0 4.0 4.0 % % % MONOTONICITY 15 Bits ±25 ±4 ppm of FSRI'C ppm of FSR/'C 1.5 1.0 12 350 350 ps ps VIps ns ns I~VI"I"'UI' DRIFT (O'C to +70'C) Total Oriftl31 Bipolar Zero Drift SETTLING TIME (to ±0.006% of FSR) Voltage Output: 6V Step lLSB Slew Rate Current Output, lmA Step: 100 to 1000 load 1kCl load l41 WARM-UP TIME OUTPUT ±8.0 ±3.0 I I 1 ±1.0 1.2 +4.75 -4.75 +VL = -VL = +VL = -VL = ..I 0.10 Indefinite to Common POWER SUPPLY REQUIREMENTS'" +5V) -5V) +12V) -12V) ----1 rrrv~ -J~D G... -, ,- H ::"..:'0" :-1"0" ~ IL.---.J -II-M j\..J Min 1 Voltage Output Configuration: Bipolar Range Output Current Output Impedance Short Circuit Duration Current Output Configuration: Bipolar Range (±30%) Output Impedance (±30%) .... FI-- % mV %of FSR I21 pV 0.002 0.002 0.002 O.ot8 0.018 Voltage: +Vs and +VL -Vsand -VL. Supply Drain (No Load): +V (+V. and -V (-Vs and +V'(+Vs and -V (-V. and Power Dissipation: Vs and VL. = ±5V Vs and VL = ±12V r"d - , }- TRANSFER CHARACTERISTICS +5.00 -5.00 +10.0 -25.0 +12.0 -27.0 175 468 +13.2 -13.2 +17.0 -35.0 260 V mA 0 +70 +70 +100 0 -25 -60. mA kO V V mA mA mA mA mW mW 'C 'C 'C NOTES: (1) Logic input levels are TTL/CMOS-compatible. (2) FSR means full-scale range and is equivalent to 6V (±3V) for PCM56 in the Vom moile. (3) This is the combined drift error due to gain, offset, and linearity over temperature. (4) Measured with an active clamp to provide a low impedance for approximately 200ns. (5) All specifications assume +Vs connected to +VL and -Vs connected to -VL.. If supplies are connected separately. -VL. must not be more negative than -Vs supply voltage to assure proper operation. No similar restriction applies to the value of +VL. with respect to +Vs. 183 NOTE; Leads in true position within .010" (.25mm) R at MMC at seating plane. PINS: Pin material and plating composition conform to method 2003 (solderability) of MIL-STD-. 883 (except paragrah 3.2). TEMPERATURE RANGE Specification Operation Storage A A, - - - - r1 r"1 r'l r'l DIGITAL INPUT Resolution Digitallnputs 'll · V," VOL CASE: Plastic DIM A A, B B, C D F G H J K L M N p INCHES MILLIMETERS MIN MAX .740 .800 .725 .7B5 .230 .290 .200 .250 .120 .200 .015 .023 .070 .030 .100 BASIC 0.02 0.05 .OOB .015 .150 .070 .300 BASIC 15' 0' .030 .010 .050 .025 MIN MAX 1B.BO 20.32 1B.42 '9.94 5.85 7.38 6.36. 5.09 3.05 5.09 0.38 0.59 1.78 0.76 2.54 BASIC 0.51 1.27 0.20 0.38 1.7B 3.B2 7.63 BASIC 15' 0' 0.25 0.76 0.64 1.27 ORDERING INFORMATION Model THO at FS ('!oj PCM56P PCM56P-J PCM56P-K 0.008 Max 0.004 0.0025 CONNECTION DIAGRAM PIN ASSIGNMENTS 1 2 3 4 5 6 7 B 9 10 11 12 13 14 15 16 -Vs lOG COM +VL NC ClK lE DATA -VL VO UT RF SJ ANA COM louT MSBADJ TRIM +Vs Analog Negative Supply logic Common logic Positive Supply No Connection Clock· Input Latch Enable Input Serial Data Input logic Negative Supply Voltage Output Feedback Resistor Summing Junction Analog Common Current Output MSB Adjustment Terminal MSB Trim-pot Terminal Analog Positive Supply NOTE: '(1) MSB error (Bipolar Zero differenllailinearity error) can be adjusted to zero using the external circuit shown 'In Figure 6. ABSOLUTE MAXIMUM RATINGS DC Supply Voltages ..................................... ±16VDC Input logic Voltage ............... , ........... -tV to +VS/+VL Power Dissipation....... .......... ... .. ...... .. ... ... .. .. 850mW Operating Temperature ....................... -25·C to +70·C Storage Temperature ....................... -60·C to +100·C lead Temperature During Soldering ............ lOs at 300·C or time is due to the drift of the internal reference zener diode. The converter is designed so that these drifts are in opposite directions. This way the Bipolar Zero voltage is virtually unaffected by variations in the reference voltage. DISCUSSION OF SPECIFICATIONS The PCM56P is specified to provide.critical performance criteria for a wide variety of applications. The most critical specifications for a D j A converter in audio applications are Total Harmonic Distortion, Differential Linearity Error, Bipolar Zero Error, parameter shifts with time and temperature, and settling time effects on accuracy. The PCM56P is factory-trimmed and tested for all critical key specifications. The accuracy of a D j A--i:onverter is described by the transfer function shown in Figure I. Digital input to analog output relationship is shown in Table I. The errors in the DjA converter are combinations of analog errors due to the linear circuitry, matching and tracking properties ~f the ladder and scaling networks, power supply rejection, and reference errors. In summary, these errors consist of initial errors including Gain, Offset, Linearity, Differential Linearity, and Power Supply Sensitivity. Gain drift over temperature rotates the line (Figure I) about the bipolar zero point and Offset drift shifts the line left or right over the operating temperature range. Most of the Offset and Gain drift with temperature 0)11...1111 0111 ... 1110 :; c. t 1 AIIBItSOn, Gain Drift, • _oo'"~ • 0000 ... 0001 .5 0000 ... 0000 ]i 'c, 1111 ... 1111 0 1111 ... 1110 1000 ... 0001 1000 ... 0000 Offset Drift \ • L' • \ Bipolar Zero I • -FSR/2 , . I' Analog Output I (+FSRl2) -ILSB ·See Table I for digital code' definitions. FIGURE I. Input vs Output for an Ideal Bipolar DjA Converter. TABLE I. Digital Input to Analog Output Relationship. Digital Input 184 Analog Output Binary Twos Complement (BTC) DACOutput VOUT Mode Current (mA), lOUT Mode 7FFF Hex 8000 Hex 0000 Hex FFFF Hex + Full Scale - Full Scale Bipolar Zero Zero-1LSB +2.999908 -3.000000 0,000000 -0.000092 -0.999970 +1.000000 0.000000 +0.030500"A Voltage (V), Settling times are specified to ±0.006% of FSR: one for a large output voltage change of 6V and one for a ILSB change. The ILSB change is measured at the major carry (0000 hex to ffff hex), the point at which the worst-case settling time occurs. DIGITAL INPUT CODES The PCM56P accepts serial input data (MSB first) in the Binary Twos Complement (BTC) form. Refer to Table I for input/ output relationships. BIPOLAR ZERO ERROR Initial Bipolar Zero Error (Bit I "on" and all other bits "off") is the deviation from OV out and is factorytrimmed to typically ±30mV at +25°C. 1.01 l !ii" u" em 0.31---\----'__--+-+---_ Cl 0.11---\-+ ,.,a: DIFFERENTIAL LINEARITY ERROR Differential Linearity Error (DLE) is the deviation from an ideal ILSB change from one adjacent output state to the next. DLE is important in audio applications because excessive DLE at Bipolar Zero (at the "major carry') can result in audible crossover distortion for low level output signals. Initial DLE on the PCM56P is factory trimmed to typically ±0.001% of FSR. The MSB DLE is adjustable to zero using the circuit shown in Figure 6. a~ u..!. <3 0.031----1H- u. 0.011--~~1__--_\r_--_I c " ~ 0.0031-----1~--_44_--_I !! . 0.001 ' -_ _---II.-~......_L_._..J 0.1 1.0 10.0 0.01 Settling Time (ps) FIGURE 3. Full Scale Range Settling Time vs Accuracy. POWER SUPPLY SENSITIVITY Changes in the DC power supplies will affect accuracy. The PCM56P power supply sensitivity is .shown by Figure 2. Normally, regulated power supplies with 1% or less ripple are recommended for use with the DAC. See also Power Supply Connections paragraph in the Installation and Operating Instructions section. 126 JstW~LUs 120 STABILITY WITH TIME AND TEMPERATURE The parameters of aD/A converter designed for audio applications should be stable over a relatively wide· temperature range and over long periods of time to avoid undesirable periodic readjustment. The most important parameters are Bipolar Zero Error, Differential Linearity Error, and Total Harmonic Distortion. Most of the Offset and Gain drift with temperature or time is due to the drift of the internal reference zener diode. The PCM56P is designed so that these drifts are in opposite directions so that the Bipolar Zero voltage is virtually unaffected by variations in the reference voltage. Both DLE and THD are dependent upon the matching and tracking of resistor ratios and upon VBE and hFE of the current-source transistors. The PCM56P was designed, so that any absolute shift in these components has virtually no effect on DLE or THD. The resistors are made of identical links of ultra-stable nichrome thinfilm. The current density in these resistors is very low to further enhance their stability. , 114 ~ 10 108 :2. "o 102 '"a:,., 96 ~ C. g- en - ~ Negative Supplies 90 DYNAMIC RANGE The Dynamic. Range is a measure of the ratio of the smallest signals the converter can produce to the fullscale range and is usually expressed in decibels (dB). The theoretical dynamic range of a converter is approximately 6 X n, or about 96dB of a l6-bit converter. The actual, or useful, dynamic range is limited by noise and linearity errors and is therefore somewhat less than the theoretical limit. However, this does point out that a resolution of at least 16 bits is required to obtain a 90dB minimum dynamic range, regardless ofthe accuracy ofthe converter. Another specification that is useful for audio applications is Total Harmonic Distortion. 11. 84 1\ 78 72 66 1 10 100 1k Frequency (Hz) 10k 100k FIGURE 2. Power Supply Sensitivity. SETTLING TIME Settling time is the total time (including slew time) required for the output to settle within an error band around its final value after a change in input (see Figure 3). TOTAL HARMONIC DISTORTION THD is useful in audio applications and is a measure of the magnitude and distribution of the Linearity Error, 185 Differential Linearity Error, and Noise, as well as Quantization Error. To be useful, THD should be specified for both high level and low level input signals. This ~rror is unadjustable and is the most meaningful indicator of D/ A converter accuracy for audio applications. Figure 5 shows typical THD as a function of frequency. 0.1 ~ 0.05 c The THD is defined as the ratio of the square root of the sum of the squares of the values of the harmonics to .the valueofthe fundamental input frequency and is expressed in percent or dB. The rms value of the PCM56P error . referred to the input can be shown to be ~rrns =V I/n 0 (J '~" ~ 0.001 100 X 100% For optimum performance and noise rejection, power supply decoupling capacitors should be added as shown in the Connection Diagram. These capacitors (lp.F tantalum or electrolytic recommended) should be located close to the converter. MSB ERROR ADJUSTMENT PROCEDURE (OPTIONAL) The MSB error of the PCM56P can be adjusted to make the differential linearity error (D LE) at BPZ essentially zero. This is important when the signal output levels are very low, because zero crossing noise '(DLE at BPZ) becomes very significant when compared to the small code changes occurring in the LSB portion of the converter. Differential linearity error at bipolar zero and THD are guaranteed to meet data sheet specifications without any external adjustment. However, a provision has been made for an optional adjustment of the MSB linearity point which makes it possible to eliminate DLE error at BPZ. Two· procedures are given to allow either static or dynamic adjustment. The dynamic procedure is preferred because of the difficulty associated with the static method (accurately measuring 16-bit LSB steps). To statically adjust DLE at BPZ, refer to the circuit shown in Figure 6 or the PCM56 connection diagram. 10.0 c 0 0 (J 0.4 0.2 0.1 'E." 0.04 0.02 ]i ~ 0.01 0 J: ,,\ '" 0.004 0.002 14 Bits r0:V ~ I~Bits ~ 200kO 100kO 470kO Trim 15O---¥.Iv--ooooiIj,..,.....----"""'''r--_Q I -Vs 0.001 -60 -50 -40 -30 -20 -10 OdB equals Full Scale Range (FSR) 20k POWER SUPPLY CONNECTIONS , t: ~ 10k INS.TALLATION AND OPERATING INSTRUCTIONS I ~ Ik Frequency (Hz) FIGURE 5. Total Harmonic Distortion (THD) vs Frequency. This expression indicates that; in general, there is a correlation between theTHDand the square root of the sum of the squares of the linearity errors at each digital word of interest. However, this expression does not mean that the worst-case linearity error of the D / A is directly correlated to the THD. For the PCM56P the test period was chosen to be 22.7p.s (44.1kHz), which is compatible with the EIAJ STC-007 specification for peM audio. The test frequency is 991Hz and the amplitude of the input signal is OdB, -20dB, and -60dB down from full scale. Figure 4 shows the typical THD as a function of output voltage. 1.0 I I\~~II scale) iii (I) where Errns is the rms signal-voltage level. ~ 0.005 ;§ 0.002 i = 1 i =1 --~----=---------Errns 4.0 2.0 ( 20dB) 0.01 0 J: where n is the number of samples in one cycle of any given sine wave, El(i) is the linearity error of the PCM56P at each sampling point, and EQ(i) is the quantization error at each sampling point. The THD can then be expressed as (2) THD = ~nns/Enns VI/n 0 t: ~ 0.02 0 MSB Adjust 1 4 o - - - - - - - - l VO~T (dB) FIGURE 6. MSB Adjustment Circuit. FIGURE 4. Total HarmOniC Distortion (THD) vs YOUT. 186 After allowing ample warm-up time (5-10 minutes) to assure stable operation of the PCM56, select input code FFFF hexadecimal (all bits on except the MSB). Measure the audio output voltage using a 6-1/2 digit voltmeter and record it. Change the digital input code to 0000 hexadecimal (all bits off except the MSB). Adjust the 100kO potentiometer to make the audio output read 92p,V more than the voltage reading ofthe previous code (a ILSB step = 92p,V). A much simple~ method is to dynamically adjust the DLE at BPZ. Again, refer to Figure 6 for circuitry and component values. Assuming the device has been installed in a digital audio application circuit, send the appropriate digital input to produce a -80dB level sinusoidal output. While measuring the THD of the audio circuit output, adjust the 100kO potentiometer untit"a minimum level of distortion is observed. stopped before the "17th" Clock cycle occurs, however, the last serial input shift will not occur (the MSB will be in the bit 2 position). In any application where clock is noncontinuous, attention must be given to providing enough clocks to fully input the data word. Figure 7 refers to the general input format required for the PCM56P. Figure 8 shows the specific relationships between the various signals and their timing constraints. Data Input INPUT TIMING CONSIDERATIONS Figures 7 and 8 refer to the input timing required to interface the inputs of PCM56P to a serial input data stream. Serial data is accepted in Binary Twos Complement (BTC) with the MSB being loaded first. Data is clocked in on positive going clock (CLK) edges and is latched into the DAC input register on negative going latch enable (LE) edges. MSB FIGURE 8. Input Timing Relationships. INSTALLATION CONSIDERATIONS The latch enable input must be high for at least one clock cycle before going low, and then must be held low for at least one clock cycle. The last 16 data bits clocked into the serial input register are the ones that are transferred to the DAC input register when latch enable goes low. In other words, when more than 16 clock cycles occur between a latch enable. only the data present during the last 16 clocks will be transferred to the OAC input register. One requirement for clocking in al: 16 bits is the necessity for a "17th" clock pulse. This automatically occurs when the clock is continuous (last bit shifts in on the first bit of the next data word). When the clock is If the optional external MSB error circuitry is used, a potentiometer with adequate resolution and a TCR of 100ppm/oC or less is required. Also, extra care must be taken to insure that no leakage path (either AC or DC) exists to pin 14. If the circuit is not used, pins 14 and 15 should be left open. The PCM converter and the wiring to its connectors should be located to. provide the optimum isolation from sources of RFI and EMI. The important consideration in the elimination of RF radiation or pickUp is loop area; 111 Clock Data Latch Enable t r - - - - - - - - - - -- - - - - - -- - -- - - - - - - - - -- - - --- ~: !~ .. -.. _.... .-_ ..... -- - .. - .. - - - - - - .. - - - - - - - -- - _.. -- --- - - _... - .. NOTES: (1) II clock is stoppad between Input 01 16-blt data words, latch enable (LE) must remain low until after the first clock of the next 16-bit data word stream. (2) Data format ·is binary two's complement (BTC). Individual data bits are clocked in on the corresponding positive clock edge. (3) Latch enable (LE) must remain low at least one clock cycle after going negative. (4) Latch enable (LE) must be high for at least one clock cyclebelore going negative. FIGURE 7. Input Timing Diagram. 187 therefore, signal leads and their return conductors should be kept close together. This reduces the external magnetic field along with any radiation. Also, if a signal lead and its return conductor are wired close together, they represent a small flux-capture cross section for any external field. This reduces radiation pickup in the circuit. between the left and right channels. The design is greatly simplified because the PCM56P is a complete D/ A converter requiring no external reference or' output op , amp. A sample/hold (S/H) amplifier, or "deglitcher" is required at the output of the D / A for both the left and right channel, as shown in Figure 9. The S/H amplifier for the left channel is composed of AI, SWI, and associated circuitry. Al is used as an integrator to hold the analog voltage in CI. Since the source and drain of the FET swtich operate at a virtual ground when "C" and "B" are connected in the sample mode, there is no increase in d,istortion caused"by the modulation effect of RON by the audio signal. APPLICATIONS Figures 9 and 10 show a circuit and timing diagram for a single PCM56P used to obtain both left- and rightchannel output in a typical digital audio system. The audio output of the PCM56P is alternately time-shared 2,2kO 2,2kO Serial Data Clock PCM56P Latch Enable Left Channel Output to LPF 2,2kO Left Channel Deglitcher Control 2,2kO R3 Right Channel Deglitcher Control A "low" signal on the deglitcher control closes switch "A", while a "high" Signal closes switch "8". ·1 OPA101AM or 1/4 OPA404KP or 1 OPA606KP FIGURE 9. A Sample/Hold Amplifier (Deglitcher) is Required at the Digital-to-Analog Output for Both Left and Right Channels. I I -t1 "'1".'- - - - - - 4 4 , l k H z - - - - -_ _ I I I,-----------~ ,----------~I,-----------~ LeltChannel Right Channel Lelt Channel Right Channel Serial Data nL...--_---'nL.-__rL Latch E n a b l e l ' - - _ - - - - - ' n n: --l Right Channel -i DeglitcherControl _ _ _ _ _ _ _ I ~ t", = 1,51'5 DAC Settling Time II --l . n..----------- I I -In. ._.. . ;_____________...In. ________ Left Channel _ _ _ _ _ _ _ _+!I_ _ Deg litcher Control •• I ' • • • I f-- tOEt.Ay 4.5p8 max The deglitcher control signals are generated by timing control logic, The fast settling time of the PCM56P makes it possible to minimize the delay between left and right channels to about 4.5l's, which reduces phase error at the higher audio frequencies, FIGURE 10. Timing Diagram for the Deglitcher Control Signals. 188 Most previous digital audio circuits used a higher order (9-13 pole) analog filter. However, the phase response of an analog filter with these amplitude characteristics is nonlinear and can disturb the pulse-shaped characteristic transients contained in music. Figure 10 shows the deglitcher controls for both left and right channels which are produced by timing control logic. A delay of I.5/lS (teu) is provided to allow the output of the PCM56P to settle within a small error band around its final value before connecting it to the channel output. Due to the fast settling time of the PCM56P it is possible to minimize the delay between the left- and right-channel outputs when using a single 0/ A converter [or both channds. This is important because the right- and left-channel data are recorded in-phase and the use of a slower 0/ A converter would result in significant phase error at higher frequencies. The obvious solution to the phase shift problem in a two-channel system would be to use two 0/ A converters (one per channel) and time the outputs to change simultaneously. Figure II shows a block diagram of the final test circuitry used for PCM56P. It should be noted that no deglitching circuitry is required on the DAC output to meet specified THO performance. This means that when one PCM56P is used per channel, the need for all the sample/hold and controls circuitry associated with a single DAC (two-channel) design is effectively diminat~u. The ?Civi56? is tested to meet its 'fHU specifications without the need for output deglitching. A low-pass filter is required after the PCM56P to remove all unwanted frequency components caused by the sampling frequency as well as those resulting from the discrete nature of the 0/ A output. This filter must have a flat frequency response over the entire audio band (O-20kHz) and a very high attenuation above 20kHz. Use 400Hz High-Pass Filter and 30kHz Distortion Meter I--- SECOND GENERATION SYSTEMS One method of avoiding the problems associated with a higher order analog filter would be to use digital filter oversampling techniques. Oversampling by a factor of two would move the sampling frequency (88.2kHz) out to a point where only a simple low-order phase-linear analog filter is required after the deglitcher output to remove unwanted intermodulation products. In a digital compact disc application, various VLSI chips perform the functions of error detection/ correction, digital filtering, and formatting of the digital information to provide the clock, latch enable, and serial input to the PCM56P. These VLSI chips are available from several sources (Sony, Yamaha, Signetics, etc.) and are specifically optimized for digital audio applications. Oversampled circuitry requires a very fast OJ A converter since the sampling freuqency is multiplied by a factor of two or more (for each output channel). A single PCM56P can provide two-channel oversampling at a 4X rate (I 76.4kHz/ channel) and still remain well within the settling time requirements for maintaining specified THO performance. This would reduce the complexities of the analog filter even further from that used in 2X oversampling circuitry. Programmable Gain Amp oto 60dB Low-Pass I--- Filter (Toko APQ-25 (Shiba Soku Model 725 or Equivalent) Binary Counter I I--- Digital Code (EPROM) I--- ParallelTo-Serial - Conversion o CmHARACTERISTIC I CD -20 DUT (PCM56P) ~ -60 ~ -40 " -80 -100 I Clock I [1 LOW-PASS FILTER or Equivalent) Low-Pass Filter I Latch Enable Timing Sampling Rate ~ 44,1kHz X 4 (176.4kHz) Output Frequency ~ 991Hz Logic FIGURE 11. Block Diagram of Distortion Test Circuit. 189 1 10' 10' 10' 10' 10' Frequency (Hz) THIS PAGE INTENTIONALLY LEFT. BLANK 190 BURR-BROWN® DAC703/883B SERIES IE:lE:lI DAC703VG/883B DAC703VG DAC703VL/883B DAC703VL REVISION NONE APRIL,1987 Monolithic 16-Bit Military DIGITAl-TO-ANALOG CONVERTER FEATURES FULLY COMPLIANT MIL-STO-883 PROCESSING • MONOLITHIC CONSTRUCTION II) HIGH ACCURACY: linearity Error ±O.003% of FSR inax Differential linearity Error ±O.006% of FSR max • MONOTONIC lat 14 bits) OVER FULL MILITARY TEMPERATURE RANGE o PIN-COMPATIBLE WITH OAC72 ICOB model). It OUAL-IN-lINE AND.LCC PACKAGES CI DESCRIPTION This is a complete 16-bit bipolar output (±IOV) digital-to-analog converter that includes a precision buried-zener voltage reference and a low-noise, fastsettling output operational amplifier, all on one small monolithic chip. A combination of currentswitch design techniques accomplishes not only 14bit monotonicity over the military operating temperature range but also a maximum end-point linearity error of ±0.003% of full-scale range (at +25°C). Differential linearity at +25°C is 0.006% of FSR. Digital inputs are complementary binary coded and are TTL-, LSTTL-, 54f74C- and 54f74HCcompatible over the entire temperature range. Internalional Airport Industrial Park • P.O. Box 11400 0 Two product assurance levels are available: Standard and /883B. The Standard product assurance level offers Hi-Rei manufacturing where many MILSTD-883 screens are performed routinely. The /883B product assurance level, /883B suffix, offers Hi-Rei manufacturing, 100% screening per MIL-STD-883 method 5004 and 5% PDA. Quality assurance further processes /883B devices, by perform·ing group A and B inspections on each inspection lot and group C and D inspections as required by MIL-STD-883. A report containing the most recent group A, B, C, and D tests is available for a nominal charge. Tucson. Arizona 85734 0 Tel.: (6021746·1111 • Twx: 910·952·1111 • Cabl.: BBRCORP PDS-75I 191 0 Telex: 66·6491 DETAILED SPECIFICATION MICROCIRCUITS, LINEAR DIGITAL-TO-ANALOG CONVERTER MONOLITHIC, SILICON 1. SCOPE l.l Scope. This specification covers the detail requirements for a 16-bit, voltage output, digital-to-analog converter monolithic microcircuit. 1.2 Part number. The complete part number is as shown below. DAC703 V G /883B T l ~ T Basic Model Grade Package Hi-Rei Product (see 1.2.3) Number (see 1.2.1) Designator (see 1.2.2) 1.2.1 Device type. The device is a single 16-bit bipolar voltage output digital-to-analog converter. The input coding is complementary offset binary (COB). There is one electrical performance grade (V grade). This grade features specifications and testing over the Military temperature range (-55°C to +125°C). Electrical specifications and tests are shown in Tables I and II. 1.2.2 Device class. The device class is similar to the class B product assurance level as defined in MIL-M-3851O. The Hi-Rei product designator portion of the part number distinguishes the product assurance levels available as follows: Hi-Rei product designator Requirements Standard model plus 100% MIL-STD-883B class B screening, with 5% PDA, plus Quality /883B Conformance Inspection (QCI) consisting of Groups A and Bperformed on each inspection lot, plus Groups C and D performed as required by MIL-STD-883. (none) Standard model including 100% electrical testing. 1.2.3 Case outline. Two case outlines are available. 1.2.3.1 24-pin ceramic side-brazed (DIP). The "G" package identifier is utilized to specify the 24-pin ceramic side-brazed package, which is MIL-M-3851O, Appendix C, designator D-3, configuration 3. Figure I depicts the case outline for this package type. 1.2.3.2 28-terminalleadlesschip carrier (LCC). The "L" package identifier is utilized to specify the 28-terminal square leadless chip carrier package, which is MIL-M-3851O, Appendix C, designator C-4. Figure I depicts the case outline for this package type. 1.2.4 Absolute maximum ratings. Supply voltage, Vee to common ±18VDC Supply voltage, Voo to common OVDC to + 18VDC -IVDC to +7VDC Digital data input voltage to common Short circuit duration: Continuous Reference output to common D/ A voltage out to common Continuous -5V to +5V External voltage applied to D / A output -65°C to +165°C Storage temperature range Temperature (soldering lOs) +300°C Junction temperature 1.2.5 Recommended operating conditions. Supply voltage, ±Vcc ±15VDC Supply voltage, ±Voo +5VDC Ambient temperature range -55°C to +125°C 1.2.6 Power and thermal charactefistics. Maximum Case Maximum allowable Package OJ-C outline power dissipation 24-lead DIP Figure I 1000mW 28-terminal LCC Figure I 1000mW 192 t:;;;;A- NOTE: Leads In Irue posilion wilhin 0.0'" (0.25mm) R al MMC at seating plane. Pin numbers shown for reference only. Numbers may not be marked on package. ~·U o DIM A B C D F G H J K L M N INCHES MIN MAX 1.185 1.215 .600 .620 .125 .171 .015 .021 .Q35 .()';IJ .100 BASIC .030 .070 .008 .012 .120 .240 .600 BASIC 10' .025 .060 MILLIMETERS MIN MAX 30.10 30.86 15.24 15.75 3.18 4.34 0.53 . 0.38 1.5~ tH!9 2.54 BASIC 0.76 1.78 0.20 0.30 2.06 6.10 15.24 BASIC 10' 0.64 1.52 I I DIM A B C F G H (a) 24-pin side braze; package 10: "G". 1 *-------++-8 ::::::::::: MIN MAX .442 .458 .442 .458 .064 .100 .022 .028 .050 BASIC .OO8R TYP I ~.::LL:;.:..: en:> I MIN 11.23 I MAX 11.63 11.63 11.23 1.63 2.54 0.56 0.71 1.27 BASIC O.20RTYP (b) 28-lerminal LCC; package 10: "L" FIGURE 1. Case Outlines. 2. APPLICABLE DOCUMENTS 2.1 Government specification and standard. Unless otherwise specified, the following specifications and standards form a part of this specification to the extent specified herein. SPECIFICATION MILITARY MIL-M-38SI0-Microcircuits, general specification for. STANDARD MILITARY MIL-STD-883-Test metho.ds and procedures for microcircuits. 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. 3. REQUIREMENTS 3.1 General. Burr-Brown used production and test facilities and a quality and reliability assurance program adequate to assure successful compliance with this specification. 3.1.1 Detail specifications. The individual item requirements are specified herein. In the event of conflicting requirements, the order of precedence wiH be the purchase order, this specification, and then the reference documents. 3.2 Design, construction, and physical dimensions. 3.2.1 Package, metals, and other materials. The packages, metal surfaces, and other materials are in accordance with MIL-M-38SI0. 3.2.2 Design documentation. The design documentation is in accordance with MIL-M-38SI0. 3.2.3 Internal conductors and internal wires. The internal conductors and internal lead wires are in accordance with MIL-M-38SI0. , 3.2.4 Lead material and finish. The lead material and finish is in aC,cordance with MIL-M-38SI0 and is solderable per MIL-STD-883, method 2003. 193 3.2.5 Die thickness. The die thickness is in accordance with MIL-M-38510. 3.2.6 Physical dimensions. The physical dimensions are in accordance with paragraph 1.2.3 herein and are shown in Figure 1. " 3.2.7 Circuit diagram and terminal connections. The circuit diagram and terminal connections are shown in Figures 2 and 3. 3.2.8 Glassivation. The microcircuit dice are glassivated. 3.3 Electrical performance characteristics. The electrical performance characteristics are specified in Table I and apply over the full operating ambient temperature range of -55°C to +125°C unless otherwise specified. 3.4 Electrical test requirements. Electrical test requirements are shown in Table II. The subgroups of Table I, which constitute the mmimum electrical test requirements for screening, qualification, and quality conformance inspection, are specified in Table II. PIN# +Vee } -_ _=,.,....,:-:!::'-_2'\j70/\jk~O_~131 '-_..-_L--- Voo''' +.121 NOTES: 1. Can be tied to +Vee Instead of having separate Vo~ supply. 2. Decoupling capacitors are O.lpF tol.0pF. 3. Potentiometers are 10kO to 100kO. "G"PACKAGE Bit 1 (MSB) Bit2 Bit3 Bit 4 Bit5 Bit6 Bit7 BI18 Blt9 Blt12 Bllll Bit12 Bit 13 Bit 14 Bit 15 Bit 16 (lSB) VOUT Voo -Vee 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22" 23 24 Common Summing Junction (Zero Adjust) Gain AdJust +Vee +6.3V Reference Output FIGURE 2. "G" Package Circuit Diagram and Terminal Connections. +Vcc '21 PIN# +Ij-.....- " ' f ' - - -Vee 1 2 3 "I~ 4 5 6 7 8 I------.~ '21 9 I------.....---.~ +-f"1 1-------......-- VOD I31 +,*,"1 Digital Inputs Digital Inputs NOTES: 1. Decoupllng capacitors are O.lpF tol.0pF 2. Potentiometers are 10kO to 100kO. 3. Can be tied to +Vee instead of having separate Voo supply. 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 "l"PACKAGE No connection Bitl (",SB) Bit2 Bit3 Bit4 Bit 5 Bit6 No connection Blt7 Bit8 Bit 9 Bitl0 Bitll Bit12 No connection Bit13 Bit14 Bit15 Bit16 (lSB) VOUT Voo No connection -Vee Common Summing Junction Gain Adjust +Vee +6.3V Reference Output FIGURE 3. "L" Package Circuit Diagram and Terminal Connections. '194 TABLE 1. Electrical Performance Characteristics. (T. = -55'C to +125'C. Supply Voltages: ±Vee = ±15VDC. VDD= +5VDC) CONDITIONS CHARACTERISTICS GROUP A SUBGROUPS DAC703 "V" GRADE MIN TYP MAX UNITS 16 Bits INPUT DIGITAL INPUT Resolution J} Digital Inputs 2/ V'H VIL I'H III V, = +2.7V V, =+0.4V 1 1 1 1 +2.4 -1.0 +Vee +0.8 +40 -0.5 V V pA mA 1 2.3 1 2,3 1 1 1,2,3 -0.003 -0.006 -0.006 -0.006 -0.1 -0.1 14 +0.003 +0.006 +0.006 +0.009 +0.1 +0.1 %01 FSRaJ %oIFSR %01 FSR %oIFSR %oIFSR %oIFSR Bits 2,3 2,3 -20 -15 -0.1 +20 +15 +0.1 TRANSFER CHARACTERISTICS ACCURACY Linearity Error T.= +25'C -55'C ::; T. ::; +125'C T.= +25'C -55'C ::; T.::; +125'C T.=+25'C T.=+25'C Differential Linearity Error Gain Errorgj Zero Errorgj Monotoniclty over Temp. Range J} DRIFT Gain Drift Zero Drllt Total Error over Temperature ppm/'C ~pml'C %oIFSR DYNAMIC CHARACTERISTICS Settling Time to ±0.003%, RL = 2kCl Full-Scale Output Step R,=2kCl Slew Rate 9 OUTPUT Output Voltage Output Current Output Impedance 4 9 10 1 ±5 1,2,3 +6.0 1,2,3 -15 ps 8 VlJ.IS ±10 V mA Cl 0.15 Relerence Voltage Source Current Temperature Coefficient For external loads +6.3 +2.5 V mA ppm/'C +6.6 +15 POWER SUPPLY REQUIREMENTS Suply Voltage. +Vee -Vee VDD Supply Currents, -Icc +13.5 -13.5 +4.5 1 1 1 1 1 1 -Icc 100 Power Supply Rejection +15 -15 +5 Delta +Vee = ±1V T. = 25'C Delta -Vee = ±1V T. = 25'C Delta VDD = ±1V T. = 25'C V V V mAo mA mA mVN mVN' mVN +16.5 -16.5 +16.5 +30 -30 +8 4 4 4 NOTES: J} 1LSB = 0.305mV. 2/ Digital Inputs are TTL-, LSTTL-, 54174C-, 54174HC-, and 54/74HTC-compatlble over the operating voltage range 01 VDD = +5V to +15V and over the operating temperature range. The input switching threshold remains at the TTL threshold 01 1.4Voverthe supply range 01 VDD = +5V to +15V. As logic "0" and "1" Inputs vary over OV to +0.8V and +2.4Vto +10V respectively, the change In the D/A converter output voltage will not exceed ±0.003% 01 FSR. aJ FSR = lull-scale range =.20V. gj Adjustable to zero. TABLE II. Electrical Test Requirements. (The individual tests within the subgroups appear in Table I) MODELS MIL-STD-883 TEST REQUIREMENTS DAC703VG/883B DAC703VL/883B DAC703GL DAC703VL Subgroups (see table I) Interim electrical parameters (preburn-in) (method 5005) Flna! electrical test parameters (method 5005) Group A test requirements (method 5005) Group C and 0 end point electrical parameters (method 5005)' Additional electrical subgroups performed in addition to Group C inspection ·*PDA applies to subgroup I. "Performed to an LTPD of 5. 195 1 1 1',2,3 1.2,3 1,2,3 N/A 1 and Table III N/A 9" N/A TABLE III. Additional End-Point Limits (after 1000Hr Life Test). PARAMETER LIMIT Gain Error Linearity Error Differential Linearity Error ±O.2% of FSR' ±SLSB" ±8LSB . 'FSR = full-scale range. ··ILSB = O.30SmV 3.5 Marking. Marking is in accordance with MIL-M-38510. The following marking is placed on each microcircuit as a minimum: a. Part number (see paragraph 1.2) b. Inspection lot identification code 11 c. Manufacturer's identification ( d. Manufacturer's designating symbol (CEBS) e. Country of origin f. Electrostatic sensitivity identifier(~} 3.6 Workmanship. These microcircuits are manufactured, processed, and tested in a workmanlike manner. Workmanship is in accordance with good engineering practices, workmanlike instructions, inspection and test procedures and training, prepared in fulfillment of Burr-Brown's product assurance program. 3.6.1 Rework provisions. Rework provisions, including rebonding for the ",883B" product designation, are in . .accordance with MIL-M-38510. . 3.7 Traceability. Traceability for the ",883B" product designation is in accordance with MIL-M-3851O. Each microcircuit is traceable to the production lot and to the component vendor's component lot. 3.8 Product and process change. Burr-Brown will not implement any major change to the design, materials, construction, or manufacturing process which may .affect the performance, quality or interchangeability of the microcircuit without full or partial requalification. 3..9 Screening. Screening for the ",833B" Hi-Rei product designation is in accordance with MIL-STD-883B, method 5004, class B, and as specified herein. Screening for the standard model includes Burr-Brown QC4118 internal visual inspection, stabilization bake, fine leak, gross leak, constant acceleration (condition A), temperature cycle (condition C), and external visual per MIL-STD883B method 2009. For the ",883B" product designation, all microcircuits will have l!assed the screening requirements prior to qualification or quality conformance inspection. 3.10 Qualification. Qualification is not required. See paragraph 4.2 herein. 3.11 Quality conformance inspection. Quality conformance inspection (QCI), for the ",883B" product designation, is in accordance with MIL-STD-883, and as specified in paragraph 4.4 herein. The microcircuit inpsection lot will have passed quality conformance inspection prior to microcircuit delivery. r..LIfi" ) 4. PRODUCT ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures are in accordance with MIL-M-38510 and MILSTD-883, method 5005. 4.2 Qualification. Qualification is not required unless specifically required by contract or purchase order. When so required, qualification will be in accordance with the inspection routine of MIL-M-3851O. The inspections to be performed are those specified herein for Groups A, B, C, and D inspections (see paragraphs 4.4.1, 4.4.2, 4.4.3, and 4.4.4 herein.). 4.3 Screening. Screening for the ",883B" Hi-Rei product designation is in accordance with MIL-STD-883, method 5004, class B, and is conducted on all devices. The following criteria apply: a. Interim and final test parameters are specified in Table II. b. Burn-in test (MIL-STD-883, method 1015) conditions: (l) Test condition B. (2) Test circuit is Figure 4. (3) TA = +125°C. (4) Test duration is 160 hours minimum. y A 4-digit code, indicating year' and week of seal, and a 4- or 5-digit lot identifier are marked on each unit. 196 c. Percent defective allowable (PDA). The PDA, for "/883B" product designation only, is five percent and includes both parametric and catastrophic failures from Group A, Subgroub I test, after cool-down as final electrical test in accordance with MIL-STD-883, method 5005, and with no intervening electrical measurements. If interim electrical parameter tests are performed prior to burn-in, failures resulting from preburn-in screening failures may be excluded from the PDA. If interim electrical parameter tests are omitted, all screening failures shall be included in the PDA. The verified failures of Group A, Subgroup I, after burn-in are used to determine the Percent Defective for each manufacturing lot, and the lot is accepted or rejected based on PDA. d. External visual inspection need not include measurement of case and lead dimensions. 4.4 Quality conformance inspection. Groups A and B inspections of MIL-STD-883, method 5005, class B, are performed on each inspection lot. Groups C and D inspections of MIL-STD-883, method 5005, class B are performed as required by MIL-STD-883. A report of the most recent Group C and D inspections is available from Burr-Brown. 4.4.1 Group A inspection. Group A inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5005, and as specified in Table II herein. 4.4.2 Group B inspection. Group B inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5005, class B. 4.4.3 Group C inspection. Group C inspection consists of the subgroups and LTPD values shown in MIL-STD-883, method 5005, class B, and as follows: a. Operating life test (MIL-STD-883, method 1005) conditions: (I) Test condition B. (2) Test circuit is Figure 4. (3) TA = +125°C minimum. (4) Test duration is 1000 hours minimum. b. End point electrical parameters are specified in Table II herein. 4.4.4 Group D inspection. Group D inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5005. End point electrical parameters are specified in Table II herein. 4.4.5 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-M-3851O. 4.5 Methods of examination and test. Methods of examination and test are specified in the appropriate tables. Electrical test circuits are as prescribed herein or in the referenced test methods of MIL-STD-883. 4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential Voltage) are referenced to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-3851O. 1kQ 1kQ Cbl 28·Terminal LCC "L" Package Cal 24·Pln Side-Brazed "Goo Package FIGURE 4. Test Circuit for Burn-In and Operating Life Test. 197 6. NOTES 6.1 Notes. The notes specified in MIL-M-38510 are applicable to this specification. 6.2 Intended use. Microcircuits conforming to this specification are intended for use in applications where the, use qf screened parts is required or desirable. 6.3 Ordering Data. The contract or purchase order should specify the following: a. Complete part number (see paragraph 1.2). b. Requirement for certificate of compliance, if desired. 6.4 Microcircuit group assignment. These microcircuits are assigned to technology group D with a microcircuit group number of 56 as defined in MIL-M-38510, Appendix E. 6.5 Electrostatic sensitivity. Caution-these microcircuits may be damaged by electrostatic discharge. Precautions should be observed at all times. 6.6 Definitions. 6.6.1 Linearity. This specification describes one of the most important measures of performance of a D/ A converter. Linearity error is the deviation of the analog output from a straight line drawn through the end points (all bits ON point . and all bits OFF point). 6.6.2 Differential linearity error. Differential linearity error (DLE) of a D/ A converter is the deviation from its ideal lLSB change in the output from one adjacent output statj: to the next. A differential linearity error specification of ±1/2LSB means that the output step sizes can be between 1/2LSB and 3/2LSB when the input changes from one adjacent input state to the next. A negative DLE specification of no more than -ILSB (-O.OO6%FSR for 14-bit resolution) insures monotonicity. 6.6.3 Monotonicity. Monotonicity assures that the analog output will increase or remain the same for increasing input digital codes. The DAC703 is specified to be monotonic to 14 bits over the entire specification temperature range. 6.6.4 Gain error. Gain error is the difference between the ideal full-scale output and the actual output of the D/ A converter. For the DAC703 this is at OOOOH and FFFFH. 6.6.5 Zero error. Zero error is the difference between zero volts and the actual D/A converter output at the zero output code (7FFFH). 7. APPLICATION INFORMATION. 7.1 Power supply decoupling. For optimum performance and noise rejection, each power supply should be decoupled by connecting a I/oiF tantalum- or electrolytic capacitors, is used, should be parralleled with O.OI/olF ceramic capacitors for best high-frequency performance. . 7.2 Power-supply sensitivity. Power-supply sensitivity is specified in Table 1. Power-supply sensitivity versus ripple frequency is shown in Figure 5. 7.3 External zero and gain error adjustment. The untrimmed accuracy of the DAC can be adjusted using the circuitry ' shown in Figures 2 and 3. 7.3.1 Zero adjustment. Apply the digital input code 7FFFH, which should produce zero volts output. Adjust the offset " potentiometer until the output is zero volts. 7.3.2 Gain adjustment. Apply the digital input code OOOOH, which should produce 9.99969 volts output. Adjust the gain potentiometer to produce 9.99969 volts. 7.4 Further information. Further application information can be found in Burr-Brown's commercial data sheet for the DAC700f702, DAC701f703. 198 0.030 E 0.025 ;; -15V Supply .5 "g> 0.020 " .r::; (J '0 #. 0,015 l; a. g w 0.010 a: IL Ul u. '0 #. 0.005 +15V ~PPI ~5V ~~ 0 1 10 100 lk 10k lOOk Power Supply Ripple Frequency (Hz) FIGURE 5. Power Supply Rejection Versus Power Supply Ripple Fre4,uency. 199 BURR-.BROWN® IElElI INA101/8838 SERIES INA101VM/883B INA101VM INA101VG/883B INA101VG REVISION NONE APRIL,1987 Very High Accuracy Military INSTRUMENTATION AMPLIFIER FEATURES APPLICATIONS • • • • • • • • AMPLIFICATION OF SIGNALS FROM SOURCES SUCH AS: Strain Gauges Thermocouples RTDs • REMOTE TRAN$DUCERS • LOW LEVEL SIGNALS FULLY COMPLIANT MIL-STD-883 PROCESSING ULTRA-LOW VOLTAGE DRIFT: 1.75pV/oC (A = 1000) LOW OFFSET VOLTAGE: 50pV LOW NONLINEARITY: 0.005% LOW NOISE: 13nV/JIiZ at fa = 1kHz HIGHCMR: 106d8 at 60Hz HIGH INPUT If!1PEDANCE: 101°n DESCRIPTION The INAIOI is a high-accuracy, multistage, militarygrade, integrated-circuit instrumentation amplifier designed for signal conditioning requirements where very high performance is desired. All circuits, including the interconnected laser-trimmed thin-film resistors, are integrated on a single monolithic substrate. A multiamplifier design is used to provide the highest performance and maximum versatility with monolithic construction for low cost. The input stage uses Burr-Brown's· ultra-low drift, low-lioise technology to provide exceptional input characteristics. Two product assurance levels are available: Standard and /883B. The Standard product assurance level offers Hi-Rei manufacturing where many MILSTD-883 screens are performed routinely. The /883B product assurace level, /883B suffix, offers Hi-Rei manufacturing, 100% screening per MIL-STD-883 method 5004 and 5% PDA. Quality assura!lce further processes /883 devices, by performing lot and group C and D inspections as required by. MIL-STD-883. A report containing the most recent group A, B, C, and D tests is available for a nominal charge. International Airport Industrial Park • P.O. Box 114011 • Tucaon. Arizona 85134 • Tel.: (1102) 146-1111 • Twx: 910-952·1111 • Cable: BBRCORP • Talax: 116-8491 PDS-752 200 DETAILED SPECIFICATION MICROCIRCUITS, LINEAR INSTRUMENTATION AMPLIFIER MONOLITHIC, SILICON I. SCOPE l.l Scope. This specification covers the detail requirements for a very high accuracy instrumentation amplifier. For description of operation see paragraph 8. 1.2 Part Number. The complete part number is as shown below. INAIOI V I Basic model number l M l Grade Package Hi-ReI product designator designator designator (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type. The device is a single instrumentation amplifier. One electrical performance grade ("V") is provided. The "V" grade offers specifications and operation over the Military temperature range (-55°C to +125°C). Electrical performance characteristics are shown in Table I, and Electrical tests are shown in Tables II and III. 1.2.2 Device class. The device class is similar to the product assurance level B, as defined in MIL-M-3851O. The Hi-ReI product designator portion of the part number distinguishes the product assurance level as follows: Hi-ReI product des~g!!~!,?!... Requirements Standard model,. plus 100% MIL-STD-883 class B screening, with 5% PDA, plus /883B quality conformance inspection (QCI) consisting of Groups A and B performed on each inspection lot, plus Groups C and D perfotmed initially and annually thereafter. (none) Standard model including 100% electrical testing. 1.2.3 Case outline. Two package options are available ("G" and "M'). a. The "G" package is a 14-terminal ceramic side braze DIP and is case outline D-I, configuration 3, as defined in MIL-M-3851O, Appendix C (see Figure la). b. The "M" package is a IO-Iead can, TO-100, and is case outline D-I as defined in MIL-M-38510, Appendix C (see Figure Ib). 1.2.4 Absolute maximum ratings. Positive supply voltage (+Vee) Oto +20VDC Oto -20VDC Negative supply voltage (,,-Vec) Duration output short circuit to ground Continuous Lead temperature (soldering, lOs) +300°C Junction temperature +175°C· -65°C to +150°C Storage temperature range 1.2.5 Recommended operating conditions. Positive supply voltage (+Vee) +HVDC to +20VDC -HVDC to -20VDC Negative supply voltage (-Vee) -55°C to +125°C Ambient temperature range 1.2.6 Power and thermal characteristics. Package Case outline Maximum allowable power dissipation Maximum/he IO-Iead TO-100 Figure I 600mW 60°CfW 14-lead DIP Figure I 600mW 50°CfW 2. APPLICABLE DOCUMENTS 2.1 The following form a part of this specification to the extent specified herein. SPECIFICATION MILITARY MIL-M-3851O-Microcircuits, general specification for. STANDARD MILITARY MIL-STD-883-Test methods and procedures for microcircuits. 201 TABLE 1. Electrical Performance Characteristics. All characteristics at -SS'C:;; TA:;; +12S'C. ±Vcc = lSVDC. unless otherwise specified. INA101VM/883B INA101VM INA101VG/883B INA101VG CHARACTERISTICS GAIN Range of Gain Gain Equation Error Gain TempcQ Y \ Av EAV I!.Avll!.T DC Nonlinearity NL RATED OUTPUT Voltage Current Impedance V.P I. Z. INPUT OFFSET VOLTAGE Initial 3/ vs Temperature vs Supply CONDITIONS SYMBOL VI. VI. I!.VloIl!.T PSRR Av = 1 + (40k/Ro) li Av = 1. TA = +2S'C Av = 10. T. = +2S'C Av = 100. T. = +2S'C Av = 1000. T. = +2S'C INPUT OFFSET CURRENT Initial TempeD II. I!.IIoIl!.T TA:::: +25°C ZID TA = +25°C TA = +25 11 C INPUT VOLTAGE Linear Response Range Rejection VIN CMR INPUT NOISE Input Voltage Noise ENPP EN Input Current Noise INPp IN DYNAMIC RESPONSE Slew Rate Bandwidth SR BW Settling Time BW T. POWER SUPPLY Rated Voltage Quiescent Current ±Vcc 10 1000 ' O.OS 0.10 0.10 0.40 VN %FS %FS %FS % FS ppm/'C ppm/'C ppm/'C ppm/'C % % % % O.OOS O,OOS 0.007 0.025 V mA n ±10 ±S Av = 10. TA = +2S'C Av = 1000. TA = +2S'C Av = 10, -55°C::;; TAo:::;; +125°C Av = 1000, -55°C S T" S +125 11 C Av = 1, I!.Vcc = ±SVDC, T. = +2S'C Av = 1000, I!.Vcc = ±SVDC, T. = +2S'C TAo Common~Mode UNITS 0,2 lIB 1!.11a/I!.T ZtCM MAX 2 20 22 22 Av=l R, = 2kn. TA = +2S'C TYP 1 Av=10 Av = 100 Av = 1000 Av = 1, TAo = +25°C Av = 10, TAo = +251;1C Av = 100. T. = +2S'C Av = 1000. TA = +2S'C INPUT BIAS CURRENT Initial ,TempeD INPUT IMPEDANCE Differential Co 'TImon Mode MIN ±7S ±SO ±2.S ±1,75 3S 2 "V "V "VI'C pV/'C "VN "VIV ±30 nA nAl°e- ±30 ±O,S nA nAl'C 101°113 10"113 nil pF nil pF = +25°C ±0,2 \ DC-60Hz, Av = lkQ Source Imbalance TA= +25°C DC-60Hz, Av = 10, lkn Source Imbalance TAo = +25°C DC-60Hz, Av = 100-1000, lkO Source Imbalance. TAo = +25°C ±10 V 80 dB 96 dB 106 dB 0,8 18 ',S 13 50 0,8 0,46 0,3S fa = 0,01 to 10Hz, TA = +2S'C Av = 1000, fa = 10Hz. TA = +2S'C Av = 1000, fa = 100Hz, TA = +25°C Av = 1000, fa = 1kHz. TA = +2S'C fa = 0.01 Hz to 10Hz, TA = +2S'C fa = 10Hz, TA = +2S'C fa = 100Hz, T. = +2S'C fa = 1kHz. T. = +2S'C Av = 1 to 100, R, = 2kn, T. = +2S'C 3dB small signal, Av = 1, T" = +25°C Av = 10, TA = +2S'C Av = 100, T. = +2S'C Av = 1000, T. = +2S'C Full power Av = , to 1000, T. = +2S'C 0,01%, Av = 1, TA = +2S'C Av = 100, T. = +2S'C Av = 1000, TA = +25'C 0.2 NOTES, jj Typically the tolerance of RG will be the major source of gain error. Not including TCR of Ro, 3/ Adjustable to zero at anyone gain. Y 202 VI"s kHz kHz kHz kHz kHz ps 300 140 25 2.S SA 30 SO SOO ±S T. =+2S'C "V. p-p nVNHz nV/v'Hz nV/v'Hz pA, p-p pAlv'Hz pAlv'Hz pAlv'Hz· ±lS "s "s ±20 ±8,S V mA TABLE II. Electrical Test Requirements. (The individual tests within the subgroups appear in Table III) INAt01VM/883B INA101VG/883B MIL·STD-883 REQUIREMENTS (Class B) Interim electrical parameters (preburn-in) (method 5004) Final electrical test parameters (method 5004)" Group A test requirements (method 5005) Group C and 0 end point electrical parameters (method 5005) INAt01VM INA101VG 1 1'.2.3.4 1.2.3.4 1 1.2.3.4 - 'PDA applies to subgroup 1 (see 4.3.c). TABLE III. Group A Inspection. LIMITS SUBGROUP SYMBOL MIL-STD-883 METHOD OR EQUIVALENT 1 V,O 4001 TA 1,0 2 T. = 125'C 3 T. = -55'C UNITS pV pV 4001 4001 ±75 ±50 ±20 ±20 ~CC!j ..J...U.W 111M ±35 ±2 pVN pVN PSRR '" 4003 CMR 4003 !;V,ol!;T 4001 !;V,ol!;T 4 T. = 25'C unless otherwise specified) MAX = 25°C It. CONDITIONS (±Vee = 15VOC INA101VM/883B INA101VM INA101VG/883B INA101VG 4001 Av = 1. !;Vee = ±5VDC Av = 1000, !;Vee = ±5VDC DC, Av = 1. lkO Source Imbalance DC, Av = 10.lkO Source Imbalance DC. Av = 100-1000. lkO Source Imbalance Av=10 [V,O (25'C) - V,O (-55'C)] .;. 80 Av = 1000 . [V,O (25'C) - V,O (-55'C)] .;. 80 =1 Av= 10 Av = 100 Av = 1000 VOP 4004 SR NL 1/ Figure 4 R, = 2kO R,;=2kO Av=l Av= 10 Av = 100 Av = 1000 dB dB dB ±2.5 pVl'C ±1.75 pVI;C ±25 pVl'C ±1.75 pVI'C 0.05 0.10 0.10 0.40 %FS %FS %FS %FS V Vips ±10 0.2 0.005 0.005 0.007 0.025 NOTES: 11 E, = OV and E2 is varied to enable nonlinearity error to be measured by sampling 21 pOints between -10V:5 and de~ermining nA nA 80 96 106 Av= 10' lV,o (125'C) - V,O (25'Cll .;. 100 Av = 1000 [V,O (125'C) - V,O (25'C)] .;. 100 Gain Equation Error: Av E.v MIN Av = 10 Av = 1000 worst CBse deviation from straight line connecting these end pOints at each gain setting. 203 % % % % EOUT :5 + 10V' NOTE: Leads in true position wilhin 0.01" (0.25mm) R al MMC at seating plane. . Pin numbers shown for reference only. Numbers may not be marked on package. DIM A C D F G H J K L M N INCHES MIN MAX .670 .710 .065 .170 .015 .021 .045 .060 .100 BASIC .025 .070 .012 .008 .120 .240 .300 BASIC 10' .009 .060 MILLIMETERS MIN MAX 18.03 17.02 1.65 4.32 0.53 0.38 1,14 1.52 2.54 BASIC 0.64 1.78 0.20 0.30 3.05 6.10 7.62 BASIC 10' 0.23 1.52 (a) 14-Pln Ceramic Side Braze-Package 10: "G" NOTE: L~ads in t~ue position wilhin 0.01" (0.25mm) R al MMC at seating plane. Pin numbers shown for reference only. Numbers may not be marked on package. DIM A B C D E F G H J K L M N INCHES MIN MAX '.335 .370 .305 .335 .165 .185 .016 .021 .010 .040 .010 .040 .230 BASIC .028 .034 .029 .045 .500 .120 .160 36' BASIC .110 .120 MILLIMETERS MIN MAX 8.51 9.40 7.75 8.51 4.19 4.70 0.41 0.53 0.25 1.02 0.25 1.02 5.84 BASIC 0.71 0.86 0.74 1.14 12.70 3.05 4.06 36° BASIC 2.79 3.05 Bottom View (b) TO-l00 Melal Can-Package 10: "M" FIGURE 1. Case Outlines. 3. REQUIREMENTS 3.1 General. Burr-Brown uses production and test facilities and a quality and reliability assurance program adequate to assure successful compliance with this specification. 3.1.1 Detail specifications. The individual item requirements are specified herein. In the event of conflicti~g requirements, the order of precedence will be the purchase order, this specification, and then the reference documents. 3.2 Design, construction and physical dimensions. 3.2.1 Package, metals, and other materials. The package, metal surfaces, and other materials are in accordance with MIL-M-3851O. 3.2.2 Design documentation. The design documentation is in accordance with MIL-M-38510. 3.2.3. Internal conductors and internal lead wires. The internal conductors and internal lead wires are in accordance with MIL-M-38510. 3.2.4. Lead material and finish. The lead material and finish (gold plate) are in accordance with MIL-M-38510 and is solderable per MIL-STD-883, method 2003. 3.2.5 Die thickness. The die thickness is in accordance with MIL-M-3851O. 3.2.6 Physical dimensions. The physical dimensions are in accordance with paragraph 1.2.3 herein. 3.2.7 Circuit diagram and terminal connections. The circuit diagram and terminal connections are shown in Figure 2. 204 Offset Adjust a 6 7 A, Output 1kn -Input 3 Gain Sense 1 4 Gain Set1 5 1kn 10kn 20kn 10kn 20kn 10kn Output 1 Gain S.t2 10 1kn Gain Sense 2 11 1kn 10kn + Input 12 2 +Vcc 14 Common 9 13 -Vee A, Output (a) "G" Package Offset Adjust 2 3 -Input 10 10kn 10kn Gain Set 1 Output 20kn a 10kn Gain Set 2 4 10kn +Input 5 Common (b) "M" Package FIGURE 2. Circuit Diagram and Terminal Connections. 3.2.8 Glassivation. The microcircuit die is glassivated. 3.3 Electrical performance characteristics. The electrical performance characteristics are specified in Table I and apply over the full operating ambient temperature range of -55°C to +125°C unless otherwise specified. 3.4 Electrical test reguirements. Electrical test requirements are shown in Table II. The subgroups of Table III which constitute the minimum electrical test requirements for screening, qualification, and quality conformance, are specified in Table II. 205 3.5 Marking is in accordance with MIL-M-38SI0. The following marking is placed on each microcircuit as a minimum: a. Part number (see paragraph 1.2) b. Inspection lot identification code II c. Manufacturer's identification ( r&i;j® ) d. Manufacturer's designating symbol (CEBS) e. Country of origin f. Electrostatic sensitivity identifier(t.) 3.6 Workmanship. These microcircuits are manufactured, processed, and tested in a workmanlike manner. Workmanship is in accordance with good engineering practices, workmanlike instructions, inspection and test procedures, and training prepared in fulfillment of Burr-Brown's product assurance program. 3.6.1. Rework provisions. Rework provisions, including rebonding for the "/883B" Hi-ReI product designation are in accordance with MIL-M-38SIO. 3.7 Traceability. Traceability for the "/883B" Hi-ReI product designation is in accordance with MIL-M-38SIO. Each microcircuit is traceable to the production lot and to the component vendor's component lot. 3.8 Product and process change. Burr-Brown will not implement any major change to the. design, materials, construction, or manufacturing process which may affect the performance, quality, or interchangeability,of the microcircuit without full or partial requalificati0!l. 3.9 Screening. a. Screening for the "/883B" Hi-ReI product designation is in accordance with MIL-STD-883, method 5004, class B, except as modified in paragraph 4.3 herein. All microcircuits will have passed the screening requirements prior to qualification or quality conformance inspection. ' b. Screening for the standard model (no Hi-ReI product designation) includes Burr-Brown QC4118 internal visual inspection, stabilization bake, fine leak, gross leak, constant acceleration (condition E), temperature cycle (condition C), and external visual per MIL-STD-883, method 2009. 3.10 Qualification. Qualification is not required. See paragraph 4.~ herein. 3.11 Quality conformance inspection. Quality conformance inspection, for the "/883Bn Hi-Rel product designation is in accordance with MIL-STD-883 and MIL-M-38SIO, except as modified in paragraph 4.4 herein. The microcircuit inspection lot will have passed quality conformanc~ inspection prior to microcircuit delivery. 4. PRODUCT ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures are in accordance with MIL-M-38510and MILSTD-883, method SOOS, except as modified herein. 4.2 Qualification. Qualification is not required unless specifically required by contract or purchase order. When so required, qualification will be in accordance with the inspection routine of MIL-M-3851O, paragraph 4.4.2.1. The inspections to be performed are those specified herein for Groups A, B, C, and D inspections (see paragraphs 4.4.1, 4.4.2, 4.4.3, and 4:4.4). Burr-Brown has performed and successfully completed qualification inspection as described above. The most recent report is available from Burr-Brown. 4.3 Screening. .screening for the ~'/883B" Hi-ReI product designation is in accordance with MIL-STD-883, method S004, class B, and is conducted on all deviCes. The following criteria apply: a. Interim and final test parameters are specified in Table II. b. Burn-lit test (MIL-STD-883, method lOIS) conditions: (I) Test condition B. (2) Test circuit is shown in Figure 3. (3)TA = +125°C minimum. (4). Test duration 160 hours minimum. c. Percent defective allowable (PDA). The PDA, for the "/883B" Hi-ReI product designation only, is·5% based on failures from Group A, subgroup I test after cool-down as final electrical in accordance with MIL-STD883, method 5004, and with no intervening electrical measurements. If interim electrical parameter tests performed prior to burn-in are omitted, a1l screening failures shall be included in the PDA calculation. The verified failures of group A, subgroup 1 after burn-in for each manufacturing lot are used to determine the percent defective for that lot. Each lot is accepted or rejected based on the PDA. d. External visual inspection does not include measurement of case and lead dimensions. 1/A 4-digit code, indicating year and week of seal, and a 4- or S.cIigit lot identifier are marked on each unit. 206 2kCl 2kCl (a) (b) "G" Package "M" Package FIGURE 3. Test Circuit-Bum-In and Operating Life Test. 4.4 Quality conformance inspection. Groups A and B inspection of MIL-STD-883, method 5005, class B, are performed on each inspection lot. Group C and D inspections of MIL-STD-883, method 5005, class B are performed as required by MIL-STD-883. A report of the most recent group C and D inspections is available from Burr-Brown. 4.4.1 Group A inspection. Group A inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5005, and as specified in Table II herein. 4.4.2 Group I! insp\;ctioiJ.. Gi"uup D inspcctiuii C0iiSists of tlie test SUtgi0UpS a.uu. LTeD viLluc;s ~llUW1J lu iv1iL-STD883, method 5005, class B. 4.4.3 Group C inspection. Group C inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5005, and as follows: a. Operating life test (MIL-STD-883, method 1005) conditions: (I) Test condition B. (2) Test circuit is shown in Figure 3. (3) TA = +125°C minimum. (4) Test duration is 1000 hours minimum. ,b. End point electrical parameters are specified in Table II. 4.4.4 Group D. Group D inspection consists of the test subgroups and LTPD values shown in MIL-STD-883, method 5005, end point electrical parameters. 4.4.5 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-M-3851O. 4.5 Methods of examination and test. Methods of examination and test are specified in the appropriate tables. Electrical test circuits are as prescribed herein or in the referenced test methods of MIL-STD-883. 4.5.1 Voltage and current. All voltage values given are referenced to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-3851O. 6. NOTES 6.1 Notes. The notes specified in MIL-M-3851O are applicable to this specification. 6.2 Intended use. Microcircuits conforming are intended for use in applications where the use of screened parts is required or desirable. 6.3 Ordering Data. The contract or purchase order should specify the following: a. Complete part number (see paragraph 1.2). b. Requirement for certificate of compliance, if desired. 6.4 Microcircuit group assignment. These microcircuits are assigned to Technology Group D as defined in MIL-M38510, Appendix E. 6.5 Electrostatic sensitivity. CAUTION-these microcircuits may be damaged by electrostatic discharge. Precautions should be observed at all times. 207 7.0 ELECTRICAL PERFORMANCE CURVES (Typical at +25°C unless otherwise specified.) 0.01 ,...:';'G;;,A..;;I;.;N..;,N;.;O;,;N;.;L;;,IN;.;E,;;A..;;R..;;I..;,TY;.:.V,;;S.:G;;,A;;,IN';"'2 120.-_C.,.M_R...,V,.;"S,..S..,O,.,U",R",C_E_I_M_BA_LA,...N..;C_E--. in u. ci C. ~ O.OO3t----t----:~-~oL-I Max ~ ": .= ==:::::=-+_..:..._-I ~ O.OOII-_T,;,y;;,P_..... c: 60t----t-----r----+---~ 'OJ Cl 60Hz-DC ••••• 0.0003 r...._ _....I._ _ _oI.._ _..... 10 100 Gain (VN) 1000 iii' c: " 100 ~ G =1 10 'OJ Cl 20 G=1 1% Error"""'" a: 80 ::; Source 60 101< lOOk lk Frequency (Hz) 1M 10 WARM-UP DRIFT VS TIME := '" ~ is :; 0. .5. ~ '"c: ~ .c: U r---3 0 4 ±5 5 o Time (Minutes) Frequency (Hz) STEP RESPONSE Gli /aCl00b +5 S" C> ~ 0 i\ :; o.e- -5 '\ ...... -10 ±5 ±10 ±15 ±20 o 100 200 RL =2kn CL = l000pF :> g C> c: INPUT NOISE VOLTAGE VS FREQUENCY 1100 S GAIN S 10001 g> g '0 51 ~ '15 10 100 Z z :; 0. :; '-- a., __ & 0 1000 10 .5 0 32 600 Q) S'" g "E 500 ~100~------+--------r-------i 20 Q) i= 400 ~ .§ 320 300 Timews) 1000 30 100 10 Gain (VN) / / / ~ OUTPUT NOISE VS GAIN SETILING TIME VS GAIN ien O.OI''\·L.O---:l~OO:---I~k---l~O::-k-~I00..l- k Supply Voltage (V) 1000 ! lk 100 Frequency (Hz} G=10 10k +10 \...... .= GAIN ERROR VS FREQUENCY " ~ g-+8 \ \ S '0 > 100 ±9 ~ ~ 32 QUIESCENT CURRENT VS SUPPLY 10 :; ~_~ " Balanced u I I 100 :!O ~ \ G=II iii \~ \ 10 "" G= 10 G)IOO 40 __ 10 G - 100. 1000 GJooo :!!. ~ CMR VS FREQUENCY 120 0 __ 3.2 Source Resistance Imbalance (knl GAIN VS FREQUENCY 60 40L-_~ 1 C3ain (VN) 208 100 10 Frequency (Hz) 1000 8. APPLICATION INFORMATION 8.1 Description. The INAIOI is a three-amplifier device which provides all the desirable characteristics of a premium performance instrumentation amplifier. In addition, it has features not normally found in integrated circuit instrumentation amplifiers. See simplified schematics in Figure 2. The input section (AI and A2) incorporates high performance, low drift amplifier circuitry. The amplifiers are connected in the noninverting configuration to provide the high input impedance (10 1°0) desirable in the instrumentation amplifier function. The offset voltage and offset voltage versus temperature are low due to the monolithic design, and are improved even further by state-of-the-art laser-trimming techniques. The output section (A3) is connected in a unity-gain difference amplifier configuration. A critical part of this stage is the matching of the four 10kO resistors which provide the difference. These resistors must be initially well matched and the matching must be maintained over temperature and time in order to retain excellent common-mode rejection. 8.2 Using the INAIO!. Figure 4 shows the simplest configuration of the INAJO!. The gain is set by the external resistor, RG, with a gain equation of G = I + (40kl RG). The reference and TCR of RG contribute directly to the gain accuracy and drift. For gains greater than unity, resistor RG is connected externally. At high gains, where the value of RG becomes small, additional resistance (i.e., relays, sockets) in the RG circuit will contribute to a gain error. Care should be taken to minimize this effect. 8.3 Typical applications. Many applications of instrumentation amplifiers involve the amplification of low-level differential signals from bridges and transducers such as strain gauges, thermocouples, and RTD's. Some of the important parameters include common-mode rejection (differential cancellation of common-mode offset and noise), input impedance, offset voltage and drift, gain accuracy, linearity, and noise. The INAIOI accomplishes all these with high precision. I I I I +Vcc +vcc I I This circuit may be used as a replacement I I for the single potentiometer. It will adjust I offset and leave drift unchanged. L . . : - - - - - - - - - - : l 0 . 3I1A Optional Offset Adjust I I I • I This circuit may be used as a replacement for the single potentiometer. It will adjust I offset and leave drift unchanged. L- _ _ _ _ --~;;;.:lO.311.A I Offset Adjust I Tantalum (a) +Vcc I __ 100kO L __ ~ +vcc (b) "Goo Package FIGURE 4. Basic Circuit Configuration. 209 I I iL-L_2. l~nI __ _ "MOO Package I::IURR-BROWN® 113131 OPA111/8838 SERIES OPA111VM/883B OPA111VM REVISION NONE APRIL,1987 Low Noise Precision O//e'® Military OPERATIONAL AMPLIFIER FEATURES APPLICATIONS • • • • • • • • • • • • FULLY COMPLIANT MIL-STD-883 PROCESSING LOW NOISE: 100% tested, 8nV/v'ifz max at 10kHz LOW BIAS CURRENT: 2pA max LOW OFFSET: 500pV max LOW DRIFT: 10pV/oC max HIGH OPEN-LOOP GAIN: 114dB min HIGH COMMON-MODE REJECTION: 90dB min PRECISION INSTRUMENTATION DATA ACQUISITION TEST EQUIPMENT OPTOELECTRONICS RADIATION:HARD EQUIPMENT DESCRIPTION The OPAlil/883B is a precision monolithic dielectrically-isolated FET (O;/el') operational amplifier. Outstanding performance characteristics allow its use in the most critical instrumentation applications. The /883B versions are fully compliant to the requirements of MIL-STD-883. Noise, bi,as current, voltage offset, drift, open-loop gain, common-mode rejection, and power supply rejection are superior to BIFET® amplifiers. Very low bias current is obtained by dielectric isolation with on-chip guarding. Laser-trimming of thin-film resistors gives very low offset and drift. Extremely low noise is achieved with new circuit design techniques (patented). A new cascode design allows high precision input specifications and reduced susceptibility to flicker noise. Standard 741 pin configuration allows upgrading of existing designs to higher performance levels. Dire'S Burr-Brown Corp., BIFET8 National Semiconductor Corp. International Airport Industrial Park· P.O. Box 11400· Tucson. Arizona 85734· Tel. 16021 746·1111 : Twx: 91(1.952·1111· Cable: BBRCORp· Telex: 66·6491 PDS-735 210 DETAILED SPECIFICATION MICROCIRCUITS, LINEAR LOW NOISE PRECISION O//e'® OPERATIONAL AMPLIFIER MONOLITHIC, SILICON 1. SCOPE 1.1 Scope. This specification covers the detail requirements for a precision low noise dielectrically-isolated (Dire') operational amplifier 1.2 Part Number. The complete part number is as shown below. OPAlll V T l M J883B T l Basic model Grade Package Hi-Rei product (see 1.2.1) number (see 1.2.3) designator (see 1.2.2) 1.2.1 Device type. The device is a single precision dielectrically-isolated (Dire') low noise operational amplifier. One electrical performance grade (V) is provided. The V grade offers specifications and operation over the "MIL" temperature range (-55°C to +125°C). Electrical specifications are shown in Table I, and electrical tests are shown in Tables II and III. 1.2.2 Device class. The device class is similar to the class B product assurance level as defined in MIL-M-3851O. The !Ii-Rcl product dcsiguatoi' portiuii of thi; part iiuiiitcf distiiiguishcs the prodiict aiiiiUl'iiu~c level as lulluws: Hi-Rei product designator Requirements Standard model, plus 100% MIL-STD-883 class B screening, with 5% PDA, plus quality J883B conformance inspection (QCI) consisting of groups A and B performed on each inspection lot, plus groups C and D performed as required by MIL-STD-883. (none) Standard model including 100% electrical testing. 1.2.3 Case outline. The case outline is A-I (8-lead, TO-99) as defined in MIL-M-3851O, Appendix C 'and is shown in Figure 1. The case is metal and is conductive. ~:=1 t-1i Saot;n. Plane IIIII --it..- DIM A B C 1=+-1 0 I D E F G H J K NOTE: Leads in true position L M N within .010" (.25mm) R at MMC at seating plane. FIGURE 1. Case Outline (TO-99) Package Configuration. 1.2.4 Absolute maximum ratings: Supply voltage +Vcc . Input voltage range Differential input voltage Internal power dissipation Output short circuit duration Storage temperature range Temperature (soldering lOs) J unction temperature 1.2.5 Recommended op.erating conditions. Supply voltage Ambient temperature range ±18VDC ±18VDCl! ±36VDCl! 500mW continuous to power supply common only -65°C to + 165°C +300°C TJ= +175°C ±15VDC -55°C to +125°C lIFor supply voltages less than ±18VDC the absolute maximum input voltage is equal to +18V > 211 VIN > -Vee -6V. INCHES . MAX MIN .335 .370 .305 .335 .165 .185 .016 .021 .010 .040 .010 .040 .200 BASIC .028 .034 .029 .045 .500 .110 .160 45 0 BASIC ,105 .095 MILLIMETERS MIN MAX 8.51 9.40 7.75 8.51 4.19 4.70 0.41 0.53 0.25 1.02 0.25 1.02 5.08 BASIC 0.71 0.86 0.74 1.14 12.7 2.79 4.06 45° BASIC 2.41 2.67 1.2.6 Power and thermal characteristics Case outline Package 8-lead can Figure I Maximum allowable power dissipation 500mW MaximumOJC 60°C/W 2. APPLICABLE DOCUMENTS 2.1 The following form a part of this specification to the extent specified herein. SPECIFICATION MILITARY MIL-M-3851O-Microcircuits, general specification for. STANDARD MILITARY MIL-STD-883-Test methods and procedures for microcircuits. 3. REQUIREMENTS 3.1 General. Burr-Brown uses production and test facilities and a quality and reliability assurance program adequate to ensure successful compliance with this specification. 3.1.1 Detail sRecifications. The individual item requirements are specified herein. In the event of conflicting requirements, the order of precedence will be the purchase order, this specification, and then the reference documents. 3.2 Design, construction and pl!ysical dimensions. 3.2.1 Packa~, metals, and other materials. The package, metal surfaces, and other materials are in accordance with MIL-M-3851O. 3.2.2 Design documentation. The design documentation is in accordance with MIL-M-3851O. 3.2.3. Internal conductors and internal lead wires. The internal conductors and internal lead wires are in accordance with MIL-M-3851O. 3.2.4. Lead material and finish. The lead material and finish is in accordance with MIL-M-38510 and is solderable per MIL-STD-883, method 2003. 3.2.5 Die thickness. The die thiCkness is in accordance with MIL-M-38510. 3.2.6 Physical dimensions. The physical dimensions are in accordance with paragraph 1.2.3 herein and are shown in Figure 1. 3.2.7 Circuit diagram and terminal connections. The circuit diagram and terminal connections are shown in Figure 2. Substrate and Case Case and Substrate -In Trim 10kCl 2kCl -Vee Trim (b) Terminal Connections 10kCl ~----~--------~----{4 -Vee "Patented (a) Circuli Diagram FIGURE 2. Circuit Diagram and Terminal Connections. 3.2.8 Glassivation. The microcircuit dice are glassivated. 212 3.3 Electrical p'erformance characteristics. The electrical performance characteristics are specified in Table I and apply over the full operating ambient temperature range of -55°C to +l25°C unless otherwise specified. TABLE I. Electrical Performance Characteristics. All characteristics at -55°C:5 T A :5 +125°C, ±Vcc = 15VDC, pin 8 connected to ground unless otherwise specified. OPA111VM/883B OPA111VM CHARACTERISTICS CONDITIONS 1/ SYMBOL MIN TYP MAX UNITS GAIN Open-Loop Voltage Gain Avs T. = +25'C -55'C:5 T.:5 +125'C R,=2kn } Vo = ±10V. F = OHz 114 110 dB dB RATED OUTPUT Voltage Current Output Resistance Load Capacitance Stability Short Circuit Current VoP 10 Ro C, los R, = 2kn ±10 ±5 DC. Open Loop Gain =+1 T. = +25'C T. = +25'C V mA n pF mA 100 1000 ±10 To Ground DYNAMIC RESPONSE Bandwidth Bandwidth Slew RAte Setlling Time (0.1%) Settling Time (0.01%) Overload Recovery 21 BW 'BW SR Ts Ts T. Unity Gain-Small Signal T. T. Tn T. T. T. Full Power R:. = 2~Q, \!~ - =10'.' G = -1. R, = 2kn. 10V step G = -1. R, = 2kn. 10V step Gain =-1 = +25'C =+25'C -+~5°C 2 MHz kHz Vlji" ps 16 1 = +25'C =+25'C =+25'C 6 10 5 pS ps INPUT OFFSET VOLTAGE W Initial Offset Temperature Sensitivity vs Power Supply V,o DVlo PSRR VeM =OVDC V,o (T.) - V,o (+25'C) AT Vee = ±10Vee = ±18VDC T.= +25'C -500 +500 pV -55:5 T.:5 +125'C T. = +25'C -55:5 T.:5 +125'C -10 -31 -50 +10 +31 +50 pV/'C pVIV pVIV INPUT BIAS CURRENT;)j Initial ~ias I" VCM=O T.=+25'C -55°C :S TA :5 +125°C -2 -4100 +2 +4100 pA pA 100 VCM = 0 T.=+25'C -55'C:5 T.:5 +125'C -1.5 -3100 +1.5 +3100 pA pA T.=+25'C T. = +25'C 10" 111 10" 113 vs Supply Voltage INPUT OFFSET CURRENT ;)j Initial Offset INPUT IMPEDANCE Differential Common-Mode Z,o ZICM nil pF nil pF INPUT NOISE Voltage Current eN iN fo = 10Hz fo = 100Hz .10= 1kHz fo = 10kHz f. = 10Hz to 10kHz f. = 0.1Hz to 10Hz fo = 0.1Hz thru 20kHz T. =+25'C T.= +25'C 80 40 1.5 8 1.2 TA = +25°C T. = T.= T.= T.= +25'C +25'C +25'C +25'C nVlv'Hz nVlv'Hz nVlv'Hz nVlv'Hz pVrms fA, p-p fAlv'Hz 7.5 0.4 INPUT VOLTAGE RANGE Common-Mode Common-Mode Rejection V. eM CMRR T.= +25'C T. = +25'C -55'C:5 T.:5 +125'C V'N = ±10V V dB dB ±10 90 86 POWER SUPPLY Rated Voltage Voltage Range . Quiescent Current ±15 Vee ±5 ±18 ±3.5 -55 -65 +125· +150 10 VDC VDC mA TEMPERATURE RANGE (ambient) Operating Storage 'C 'C 1/ Optimum device performance is characterized in a reduced ambient light environment. 21 Overload recovery is defined as the time required for the output to return from saturation to linear operation following the removal of a 50% input overdrive signal. 'J/ Offset voltage. offset current, and bias current are measured with units fully warmed up. 213 3.4 Electrical test reHuirements. Electrical test requirements are shown in Table II. The subgroups of Table III which constitute the minimum electrical test requirements for screening, qualification, and quality conformance inspection, are specified in Table II. TABLE II. Electrical Test Requirements. The individual tests within the subgroups appear in Table III. MODELS MIL-STD-BB3 REQUIREMENTS OPAll1VM/BB3B Interim electrical parameters (pre burn-in, method 5004) OPAll1VM I' 1 Final electrical test parameters (method S004) 1. 2. 3. 4. S, 6, 7 I, 2, 3, 4, S, 6, 7 Group A test requirements (method SOOS) 1. 2. 3. 4. S, 6, 7 - Group C and D end pOint electrical parameters (method 5005) 1 'PDA appfies to subgroup 1 (see 4.3d). TABLE III. Group A Inspection. LIMITS SUBGROUP SYMBOL 1 TA = +2S'C V,o 2 TA = +12S'C 3 TA = -SS'C I" 1'0 PSRR CMRR ±Icc los DVlo I" 100 PSRR CMRR ±Icc los DVlo I" 100 PSRR CMRR ±I cc los 4 TA= +2S'C ±Vop S TA = +12S'C ±Vop 6 TA = -SS'C ±Vop 7 TA = +25'C MIL-STD-8B3 METHOD OR EQUIVALENT 4001 4001 4001 4003 CONDITIONS ±Vee = ±ISVDC OPAll1VM/BB3B OPAll1VM unless otherwise specified MIN MAX UNITS VeM = OVDC -SOO -2 -1.S -31 90 +SOO +2 +1.S +31 /1V pA pA Vee = ±10VDC to ±18VDC V'N = ±10V 10 = OmA ±3.S ±10 4001 4001. 4001 4003 VeM = OVDC Vee = ±10VDC to ±IBVDC V'N = ±10V 10 =OmA -10 -4100 -3100 -SO 8S ±3.S ±1O 4001 4001 4001 4003 VCM = OVDC Vee = ±10VDC to ±IBVDC V'N = ±10V 10= OmA -10 -4100 -3100 ±3.5 ±10 RL = 2kO RL 22kO 114 4004 RL = 2kO RL22kO 110 Avs 4004 RL = 2kO RL 22kO 110 SR eN 4002 Avs +10 +4100 +3100 ±50 B6 4004 Avs +10 +4100 +3100 +SO Vo = ±10V. RL = 2kO fo = 10Hz fo = 100Hz fo = 1kHz fo = 10kHz f. = 10Hz to 10kHz BWFP dB mA mA /1V/'C pA pA /1VIV dB mA mA /1V1'C pA pA /1VIV dB mA mA ±10 V • dB ±10 V dB +10 V dB BO 40 15 8 1.2 nVJF!z nVJRZ nVJRZ nVJRZ VI/1s 1 16 /1VIV pVrms kHz 3.5 Marking,. Marking is in accordance with MIL-M-3851O. The following marking is placed on each microcircuit as a minimum: a. Part number (see paragraph 1.2) b. Inspection lot identification code 11 c. Manufacturer's identification ( iU~E;r ) jJ A 4-digit code, indicating year and week of seal. and a 4- or 5-digit lot identifier are marked on each unit. 214 d. Manufacturer's designating symbol (CEBS) e. Country of origin f. Electrostatic sensitivity identifier (tl) 3.6 WorkmanshiQ. These microcircuits are manufactured, processed, and tested in a workmanlike manner. Workmanship is in accordance with good engineering practices, workmanlike instructions, inspection. and test procedures and training, prepared in fulfillment of Burr-Brown's product assurance program. 3.6.1 Rework provisions. Rework provisions, including rebonding for the "/883B" product designation, are in accordance with MIL-M-3851O. 3.7 Traceability. Traceability for the "/883B" product designation is in accordance with MIL-M-3851O. Each microcircuit is traceable to the production lot and to the component vendor's component lot. 3.8 Product and process change. Burr-Brown will not implement any major change to the design, materials, construction, or manufacturing process which may affect the performance, quality, or interchangeability of the microcircuit without full or partial requalification. 3.9 Screening. Screening for the "/883B" Hi-Rei product designation is in accordance with MIL-STD-883, method 5004, class B, except as modified herein. Screening for the standard model includes Burr-Brown QC4118 internal visual inspection, stabilization bake, fine leak, gross leak, constant acceleration (condition A), temperature cycle (condition C), and external visual per MIL-STD883, method 2009. Pui' the "/0030" product designation, all microcircuits will have passed the screening requirements prior to qualification or quality conformance inspection. 3.10 Qualification. Qualification is not required. See paragraph 4.2 herein. 3.11 Quality conformance inspection. Quality conformance inspection, for the "/883B" product designation, is in accordance with MIL-M-38510, except as modified in paragraph 4.4 herein. The microcircuit inspection lot will have passed quality conformance inspection prior to microcircuit delivery. 4. PRODUCT ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures are in accordance with MIL-M-3851O and MILSTD-883, method 5005, except as modified herein. 4.2 Qualification. Qualification is not required unless specifically required by contract or purchase order. When so required, qualification will be in accordance with the' inspection routine of MIL-M-3851O, paragraph 4.4.2.1. The inspections to be performed are those specified herein for groups A, B, C, and D inspections (see paragraphs 4.4.1, 4.4.2, 4.4.3, and 4.4.4). Burr-Brown has performed and successfully completed qualification inspections as described above. The most recent report is available from Burr-Brown. 4.3 Screening. Screening for the "/883B" Hi-Rei product designation is in accordance with MIL-STD-883, method 5004, class B, and is conducted on all devices. The following criteria apply: a. Interim and final test parameters are specified in Table II. b. Burn-in test (MIL-STD-883, method lOIS) conditions: . (I) Test condition B. (2) Test circuit is Figure 3. (3) TA = +125°C minimum. (4) Test duration. is 160 hours minimum. c. Percent defective allowable (PDA). The PDA, for "/883B" product designation only, is five percent and includes both parametric and catastrophic failures from group A, subgroup I test, after cool-down as final electrical test in accordance with MIL-STD-883, method 5005, and with no intervening electrical measurements. If interim electrical parameter tests are performed prior to burn-in, failures resulting from preburn-in screening failures may be excluded from the PDA. If interim electrical parameter tests .are omitted, all screening failures shall be included in the PDA. The verified failures of group A, subgroup I, after burn-in are used to determine the percent defective for each manufacturing lot, and the lot is accepted or rejected based onPDA. d. External visual inspection need not include measurement of case and lead dimensions. 4.4 Quality conformance insp'ection. Groups A and B inspections of MIL-STD-883, method 5005, class B, are performed on each inspection lot. Groups C and D inspections of MIL-STD-883, method 5005, class B are performed as required by MIL-STD-883. . 215 A report of the most recent group C and D inspections is available from Burr-Brown. 4.4.1 Group A inspection. Group A inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method SOOS, and as specified in Table II herein. 4.4.2 Group B inspection. Group B Inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method SOOS, class B. 4.4.3 Group C inspection. Group C inspection consists of the subgroups and LTPD values shown in MIL-STD-883, method 100S, class B, and as follows: a. Operating life test (MIL-STD-883, method 100S) conditions: (I) Test condition B. (b) Testcircuit is Figure 3. (3) TA = +12SoC minimum. (4) Test duration is 1000 hours minimum. b. End point electrical parameters are specified in Table II herein. R, 100kO +15VDC R, lkO FIGURE 3. Test Circuit, Burn-In and Operating Life Test. 4.4.4 Group D inspection. Group D inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method SOOS. 4.4.5 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-M-38SIO. 4.S Methods of examination and test: Methods of examination and test are specified in the appropriate tables. Electrical test circuits are as prescribed herein or in the referenced test methods of MIL-STD-883. 4.S.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. S. PACKAGING S.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-38SI0. 6. NOTES 6.1 Notes. The notes specified in MIL-M-38SIO are applicable to this specification. 6.2 Intended use. Microcircuits conforming to this specification are intended for use in applications where the use of screened parts is required or desirable. 6.3 Ordering data. The contract or purchase order should specify the following: a. Complete part number (see paragraph'1.2). b. Requirement for certificate of compliance, if desired. 6.4 Microcircuit group assignment. These microcircuits are assigned to Technology Group E with a microcircuit group number of 61 as defined in MIL-M-38SI0, Appendix E. 216 6.5 Electrostatic sensitivity. CAUTION-these microcircuits may be damaged by electrostatic discharge. Precautions should be observed at all times. 7. ELECTRICAL PERFORMANCE CURVES. TA = +25 D C, Vee INPUT CURRENT NOISE SPECTRAL OENSITY 100 ~ ~ = ±15VDC unless otherwise noted. INPUT VOLTAGE NOISE SPECTRAL DENSITY 1k ~~ 10 100 S ill ill z ~ '0 z 1/ C ~ I""i"'!!. '0 " 10 '" !!! "0 > :; C"l 0.1 100 10 10k 1k 100k 1M 100 10 Frequency (Hz) TOTAL' INPUT VOLTAGE NOISE SPECTRAL DENSITY vs SOURCE RESISTANCE 1k 100 '" S R. 10 0. > 100 r- . ill '0 .J.IlI ~ "0 " f, = 0.1 to 101 100 1k 10k "0 I"" 100k 10' 10' 1011 12 ill 0 f o J1kHZ 8 Z " '" !!! "0 > 6 ~ p 4 -75 -50 --25 1k ~ ........:: -- 10' ~~ l.,.....- ~ : tln=t=tttt-l. ~ .J. 10 ~ ~ ~ 108 TOTAL INPUT VOLTAGE NOISE'SPECTRAL DENSITY AT 1kHz vs SOURCE RESISTANCE 100 S 107 Sour~e Resistance (0) VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs TEMPERATURE 10 \.00' > Frequency (Hz) ~~ Z 10 _lilt 1111 from source r~rista~e 10 ~ z ill ·Includes contribution 0.1 ~ 3' 100kO 10!O > 1M source resistance Ci 1111 '0 " ~ 100k .1'nl~lu~:-J~tr;tj~JtJm r- 10MO J.UUo+ ill z 10k TOTAL' INPUT VOLTAGE NOISE (PEAK-TO-PEAK) vs SOURCE RESISTANCE 1k R. ~~ 1k Frequency (Hz) :a iloa in' g z0 u1 " '0 ~ ~o_ 1 'itft=I:::;M'fI=I=::J:l#=t=f:I:I:I R. 0r-;11;\ resistor Z ~ ~~ - ~ 10 01~ "0 > +25 +50 + 75 0.01 +100 +125 1 ~~ 100 Temperature (0 C) Resistor noise only 1k 10k 100k 1M !3ource Resistance (0) 217 10M 100M INPUT OFFSET VOLTAGE WARM-UP DRIFT SUPPLY CURRENT vs TEMPERATURE +20 ~ -10 5 0-7~5~--~5~0----~2~5--~---+~25~-+~5~0~~+~7~5--~+~10~0~+~125 -20 Ambient Temperature (0 C) Time From Power Turn-On (Min) COMMON-MODE REJECTION vs INPUT COMMON MODE VOLTAGE BIAS AND OFFSET CURRENT vs TEMPERATURE 1k 1k '£L 100 '"" ~ L IL ~ 100 0 ;( 10 120 iii' 10 t---- ~ ~ ~ a: ~ " ~ u ~ ~ .2: ./ .,./ 0.1 0.01 -50 -25 E E +25 +50 I I BO d 0 0.01 +125 +100 +75 90 u -- 0 I 0 0.1 i75" t- r j 100 ~ "0 0 'C ~ iii 110 c II 70 -15 -10 -5 Ambient Temperature (OC) I o .1 +10 +5 +15 Common-Mode Voltage (V) GAIN-BANDWIDTH AND SLEW RATE vs TEMPERATURE POWER SUPPLY REJECTION vs FREQUENCY 4 140 iii' ~ c 120 N .2 100 " 80 Ci 60 U ~ a: I "" >- g. I Ii Q; ~ 0 0- 40 I !I """- j " - .- i'- (/) 1-_ J. ~ 1 I L I' ~ 20 0 I _1'10. 1 10 100 1k 10k 100k I o 1\1. I 1M -75 50 -25 +25 +50 10M Frequency (Hz) Ambient Temperature (0 C) 218 +75 +100 +125 BIAS AND OFFSET CURRENT ys INPUT ·COMMON MODE VOLTAGE OPEN-LOOP FREQUENCY RESPONSE 140 -t- 10 10 120 1il :<: .e Bias Current E ~ u ::: iii 0.1 :!!. [ ~ 80 " 60 C> !!! 15 > a uridn 0.1 . -15 -10 -5 a +10 +5 '0 . 0 'P. 100 - Phase Margin o ~~ ~ -135 ~6rll 20 om +15 -- 40 2! om -45 II -- c ~ [0 fsel 100 Q "a II II " JJll~r ""'Io.l 1 10 lk 100 10k lOOk 1M -180 10M Frequency (Hz) Common-Mode Vollage (V) GAIN-BANDWIDTH AND SLEW RATE ys SUPPLY VOLTAGE COMMON-MODE REJECTION ys FREQUENCY 140 3 1il :!!. 120 c ~ 1--, N I 100 " II: ~ ·is GO "a ~c: 80 E E 40 ~ N. 80 i ".c OJ a 1 c: ~ 0 u 2 20 a 1 10 100 lk 10k lOOk 1M a a 10M 15- 10 5 20 Frequency (Hz) Supply Voll.ge (±Vcc) OPEN-LOOP GAIN ys TEMPERATURE 140 1il - 130 :!!. c ·iii . 4!0 > SETTLING TIME ys CLOSED-LOOP GAIN 10 0 E j:: ~ 7 60 II C> .5 ~ 0.1% 40 0.01% '" 110 V. 0 100 -75 -50 -25 a .,.25 +50 +75 Ambient Temperature (OC) ~ If If' I' a +100 +125 1 10 100 Closed-Loop Gain (VIV) 219 lk I MAXIMUM UNDISTORTED OUTPUT VOLTAGE vs FREQUENCY 30 c: 6. G 20 \ \ ~ E g "- ~ 10 :; r-- o ...... r-- 1--o lk _ 10k --- f- r-... r1M lOOk Frequency (Hz) LARGE SIGNAL TRANSIENT RESPONSE 25 SMALL SIGNAL TRANSIENT RESPONSE 50 Time (115) Time (115) 8. APPLICATION INFORMATION 8. I Offset voltage adjustment. Although the OPAlllj883B Series has a low initial offset voltage (500ji V), some applications may require external nulling of this small offset. Figure 4 shows the recommended circuit for adjustment of the offset voltage. External offset voltage adjustment changes the laser-adjusted offset-voltage temperature drift slightly. The drift will change approximately 0.3jiVjOC for every 100jiV of offset adjustment. 3 ±iomv Typical Trim Range -Vee '10kO to lMO Trim Potentiometer (100kO Recommended) FIGURE 4. Offset Voltage Trim. 8.2 Guarding and shielding. The ultra-low bias current and high input impedance of the OPAlllj883B Series are well,suited to a number of stringent applications; however, careless signal wiring of printed circuit board layout can degrade circuit performance several orders of magnitude below the capability of the OPAlllj883B Series. As in any situation where high impedances are involved, careful shielding is required to reduce "hum" pickup in input leads. If large feedback resistors are used, they should also be shielded along with the external input circuitry. 220 Leakage currents across printed circuit boards can easily exceed the amplifier's bias current of the OPAlll/ 883B Series. To avoid leakage problems, it is recommended that the signal input lead of the OPAIlI/883B Series be wired to a Teflon'· standoff. If the OPAIlI/883B Series is to be soldered directly.into a printed circuit board, utmost care must be used in planning the board layout. A "guard" pattern should completely surround the two amplifier input leads and should be connected to a low input impedance point which is at the signal input potential. The amplifier case should be connected to any input shield or guard via pin 8. This insures that the amplifier itself is fully surrounded by guard potential, minimizing both leakage and noise pickUp. Figure 5 illustrates the use of the guard. The resistor R3 shown in Figure 5 is optional. It may be used to compensate effects of very large source resistances. However, note that its use would also increase the noise due to the thermal noise of R3. 8.3 Additional application information. Additional application information is presented in the commercial OPAIl! data sheet. Qutpul Input ()------+--+-I Follower Inverting Amplifier Noninverting Amplifier *R 3 may be used to compensate for very large source resistances. (R, X R,) + (R, + R,) must be low impedance. Board layout for input guarding with TQ-99 package. FIGURE 5. Connection of Input Guard. Teflon" E.1. du Pont de Nemours and Company. 221 BURR-BROWN® IElElI OPA501/883B SERIES OPAS01VM/8838 OPAS01VM OPAS01UM/8838 OPAS01UM High Current, High Power Military OPERATIONAL AMPLIFIER FEATURES • • • • • WIDE SUPPLY RANGE. ±10Vto ±40V HIGH OUTPUT CURRENT. ±10A Peak HIGH OUTPUT POWER. 260W Peak LOW DC THERMAL IMPEDANCE: 2.2°C/W MIL·STD·BB3 SCREENING DESCRIPTION The OPA501 is a high power operational amplifier. Its high current output stage delivers ±IOA, yet the amplifier is unity-gain stable and it can be used in any operational amplifier configuration. The 260W peak output capability allows the OPA501 to drive loads (such as motors) with a greater safety margin. Safe operating area is fully specified and output current limiting is provided to protect both the amplifier and the load from excessive current. This hybrid Ie is housed in an 8-pin hermetic TO-3 package. The electrically· isolated package allows direct mounting to chassis or heat sink without an insulating washer or spacer which would increase thermal resistance. Two electrical performance grades are available. The premium grade operates from -55°e to + l25°e and is designed for military, aerospace, and demanding industrial applications. The U grade has specifications for operation from -25°C· to +85°e and from -55°C to + 125°C. Applications include test equip- ment, shipboard, and ground support equipment where operation is normally between -25°C and +85°e and full temperature range operation must be assured. The OPA501/883B Series is manufactured on a separate Hi-Rei manufacturing line with impeccable clean room conditions, which assures inherent quality and provides for long product life. Two product assurance levels are available: Standard and /883B. The Standard product assurance level offers Hi-Rei manufacturing where many MILSTD·883 screens are performed routinely. The /883B product assurance level, /883B suffix, offers'Hi-Rel manufacturing, 100% screening per MIL-STD-883 method 5008 and 10% PDA. Quality assurance further processes /883B devices, by performing group A and B inspections on each inspection lot and group e and D inspections as required by MILSTD-883. A report containing the most recent group A, B, e, and D tests is ~vailable for a nominal charge. NOTE: This device was previously identified as OPA8785/883B Series. Inlernational Alrporllndustrlal Park • P.O. Box 11400 • Tucson. Arizona 85734 • Tel.: (602) 7411-1111 • Twx: 910-952·1111 • Cable: BBRCORP • Talax: 66-6491 PDS·707 222 DETAILED SPECIFICATION MICROCIRCUITS, LINEAR HIGH CURRENT, HIGH POWER OPERATIONAL AMPLIFIER HYBRID, SILICON I. SCOPE 1.I ScoP.!O: This specification covers the detail requirements for a high current, high power operational amplifier. 1.2 Part Number. The complete part number is as shown below. OPA501 =r= Basic model V M l ~ /883B -=r Hi-Rei product Grade Package number (see 1.2.1) (see 1.2.3) designator (see 1.2.1) 1.2.1 Device typ.!O: The device is a single operational amplifier. Two electrical performance grades are provided. The V grade offers performance specifications over the MIL temperature range (-55°C to + 125°C) and the U grade is specified over the industrial temperature range (-25°C to +85°C). Electrical specifications are shown in Table I and electrical tests are shown in Tables II and III. 1.2.2 Device class. The device' class is similar to the class B product assurance level as defined in MIL-M-3851O. The Hi-ReI pj"uduct designator portion of th\:: P"i"t number di:;tingui:;he:; the prcduct ~~~u!":!nce le'.'e!~ available as follo'.1.'s: Hi-Rei Product Designator Reguirements /883B Standard model plus 100% MIL-STD-883 class B screening, with 10% PDA, plus quality conformance inspection (QCI) consisting of Groups A and B performed on each inspection lot, plus Groups C and D performed as required by MIL-STD-883. (none) Standard model including 100% electrical testing. 1.2.3 Case Outline. The case outline is an 8-pin TO-3 package and is depicted in Figure 1. IE;~~ Seating Plane E K • NOTE: Leads in true position within .010" (.2Smm) R at MMC at seating plane. Pin numbers shown for reference only. Numbers may not be marked on package. DIM A B C D E Q F G H J K a R INCHES MIN MAX 1.510 1.550 .745 .770 .34() .260 .038 .042 .105 .080 4()' BASIC .500 BASIC 1.166 BASIC .593 BASIC .400 .500 .151 .161 .980 1.020 FIGURE 1. Case Outline (TO-3) Package Configuration. 223 MILLIMETERS MIN 38.35 18.92 6.60 0.97 2.03 MAX 39.37 19.56 8.64 1.07 2.67 40 a BASIC 12.7 BASIC 30.12 BASIC 15.06 BASIC 10.16 12.70 3.84 4.09 24.89 25.91 1.2.4 Absolute maximum rati'ng~ Supply Voltage Vee .................................................... ±40VDC Differential input voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. ± Vcc -:- 3 DC internal power dissipation .......................................... 80W Jj AC internal power dissipation (10kHz, SO% duty cycle) ............... l60W Jj Output short circuit duration ............................ Continuous to ground Storage temperature range ................................... -6SoC to +l6SoC Lead temperature (soldering, 60sec)...................................... 300°C Junction temperature ................................................ Tj = 200°C Common~mode input voltage .............................................. ±Vcc I.2.S Recommended orerating conditions. Supply voltage Range ................................... ±34VDC (see Table I) Ambient temperature range .................................. -'-SsoC to +l2SoC 1.2.6 Power and thermal characteristics. Case Maximum allowable Maximum outline Packag~ Rower dissip'ation OJ-C 8-lead TO~3 Figure I 80W 2.2°CfW with heat sink with heat sink 2. APPLICABLE DOCUMENTS 2.1 The following documents form a part of this specification to the extent specified herein. SPECIFICATION MILITARY MIL-M-38SIO-Microcircuits, general specifications for. STANDARD MILITARY MIL-STD-883-Test methods and procedures for microcircuits. 3. REQUIREMENTS 3.1 General. Burr-Brown uses production and test facilities and a quality and reliability assurance program adequate to assure successful compliance with this specification. 3.1.1 Detail sp'ecifications. The .individual itein requirements are specified herein. In the event of conflicting requirements the order of precedence will be the purchase order, this specification, and then the reference documents. 3.2 Design, construction, and PEysical dimensions. 3.2,1 Package, metals, and other materials. The packages, metal surfaces, and other materials are in accordance with MIL-M-38SIO. 3.2.2 Design Documentation. The design documentation is in accordance with MIL-M-38SIO. 3.2.3 Internal conductors and internal lead wires·. The internal conductors and internal lead wires are in accordance with MIL-M-38SIO. 3.2.4 Lead material and finish. The lead material and finish is in accordance with MIL-M-38510 and is solderable per MIL-STD-883, method 2003. 3.2.5 Die thickness. The die thickness is in accordance with MIL-M-38SIO. 3.2.6 Physical dimensions. The physical dimensions are in accordance with paragraph 1.2.3 herein. 3.2.7 Circuit diagram and terminal connections. The circuit diagram and terminal connections are shown in Figure 2. 3.2.8 Glassivation. The microcircuit dice are glassivated. 3.3 Electrical rerformance characteristics. The electrical performance charactersitics are specified in Table I and apply over the full operating ambient temperature range of -SsoC to + 125°C unless otherwise specified. 224 +Vee +Current Limit (+Rse) Output -In Out Tin -Current Limit (-:Rse) No Internal Connection -Vec (b) Terminal Connections-Top View (a) Circuli Diagram FIGURE 2. Circuit Diagram and Terminal Connections. TABLE I. Electrical Performance Characteristics. All characteristics at -55°C:$ TA S +125°C. ±Vcc;;::; 34VDC unless otherwise specified. OPAS01VM/883B OPAS01VM CHARACTERISTICS RATED OUTPUT 11 Output Current Continuous 'J/ Output Voltage 'J/ SYMBOL CONDITIONS MIN TYP MAX MIN -10 -30 +10 +30 -26 +26 ·· '?/ DYNAMIC RESPONSE Bandwidth Bandwidth Slew Rate INPUT OFFSET VOLTAGE Initial Offset lop Vop Vo. BW BW SR V,O Tempco OVIO Vs Supply Voltage PSRR INPUT BIAS CURRENT Initial 10. RL = 2.60, T. = +2S'C RL = 10kO 10 = lOA peak, 10kHz sine wave, T. = +25'C Unity Gain, Small Signal T. = +2S'C Full Power Vo = 40Vp-p, RL = 80, T.=+25'C RL = 6.S0 T.= +2S'C [V,O (T.) - V,O (+2S'C)].;. AT -S5'C:5 T.:5 +12S'C -2S'C:5 T.:5 +8S'C Vee = ±10, Vee = ±40, T. = +25'C -55'C:5 T.:5 +125'C OPAS01UM/883B OPAS01UM -20 1 ·· 10 1.35 -S +5 -40 +40 -100 -200 +100 +200 TYP UNITS ·· A V +20 · kHz Vips +10 ·· +65 ·· ±40 ±20 ±35 ±50 Vs Supply ±0.02 V MHz -10 -6S T.= +2S'C -55'C:5 T.:5 +12S'C -25'C:5 T.:5 +85'C MAX ±0.02 mV pVl'C pVl'C pVN pVlV nA nA nA nAN INPUT DIFFERENCE CURRENT Initial los T. = +2S'C OPEN LOOP GAIN, DC Av. INPUT IMPEDANCE Z,O ±10 ±3 ±7 -55°C:::; TA.::s;: +125°C -25°C:::; TA $: +85°C ±7 RL =10kO 94 90 10 2S0 ZICM 225 ·· nA nA nA dB MO MO TABLE I. Electrical Performance Characteristics (cont) . . OPA501VM/883B OPA501VM CHARACTERISTICS SYMBOL INPUT NOISE Voltage Noise e, Current Noise i, INPUT VOLTAGE RANGE Common-mode Common-mode Rejection VICM CMRR POWER SUPPLY 'Rated Voltage Operating Voltage Range Current, Quiescent CONDITIONS f, f, f, f, MIN TYP = 0.3Hz to 10Hz = 10Hz to 10kHz = 0.3Hz to 10Hz = 10Hz to 10kHz OPA501 UM/883B OPA501UM MAX MIN TYP /lV, p-p /lV,rms pA,p-p pA,rms' · · ±(lVccl- 6) 76 80 V dB dB 70 70 Vee · · ·· ±34 ±10 ±4O ±10 -55 -65 +125 +150 la TEMPERATURE RANGE Specification Storage UNITS ··· 3 5 20 4.5 Linear Operation F = DC, V,CM = ±22V T. = +25'C MAX -25 · . V V mA · +85 'C 'C ·Speclflcatlon same as OPA501 V" grade. NOTES: 1/ Package must be derated based on a junction-ta-case thermal resistance of 2.2 Q CIW or a junction-ta-ambient thermal resistance of 30°CtW. 21 Safe Operating Area and Power Derating Curves must be observed. W With ±Rsc = O. Peak output currenlls Iypical!y greaterthan lOA if duty cycle and pulse width limitations are observed. Output current greaterlhan lOA is not guaran,teed. 3.4 Electrical test requirements. Electrical test requirements are shown in Table II. The subgroups of Table III which constitute the minimum electrical test requirements for screening, qualification, and quality conformance are specified in Table II. . TABLE II. Electrical Test Requirements. MODELS MIL-STO-883 REQUIREMENTS (HYBRID CLASS) OPA501VM/883B OPA501VM OPA501UM/883B 1 1 1 I Final electrical test parameters (method 5008) 1',2,3,4,5,6,7 1,2.3,4,5,6,7 1',2,3,4,5,6,7 1,2,3,4.5,6,7 Group A test requirements (method 5008) 1,2,3,4,5,6,7 - 1,2,3,4,5,6,7 Interim el.eetrieal parameters (Preburn-in) (method 5008) Group C end point electrical parameters (method 5008) 1 OPAS01UM - 1 'PDA applies to subgroup 1 for 1883B Hi-Rei designator (see 4.3e). TABLE III. Group A Inspection. , LIMITS SUBGROUP SYMBOL 1 T. = +25'C V,a 118+ 118- 100 +PSRR -PSRR CMRR lee. Icc- MIL-STD-883 METHOD OR EQUIVALENT 4001 4001 4001 4001 4003 4003 4003 4005' 4005 CONDITIONS ±Vcc = ±34VDC . unless otherwise specified -Vee = 34VDC, +Vee = 10 to 40VDC +Vee = 34VDC, -Vee = 10 to 40VDC VCM = ±22V, F = DC VCM ;; 0, no load condition V CM ;; 0, no load condition 226 OPA501VM/883B OPA501VM OPA501 UM/883B OPA501UM MIN MAX MIN MAX UNITS -5 -20 -20 -3 -100 -100 80 +5 +20 +20 +3 +100 +100 -10 -40 -40 -10 +10 +40 +40 +10 mV nA nA nA /lV/V IlV/V dB mA mA +10 -10 ·· ·· · · 70 TABLE III. Group A Inspection (cont). LIMITS' SUBGROUP TA ;:::: 2 +125°C SYMBOL MIL-STD-883 METHOD OR EQUIVALENT 4001 4001 4001 4001 4003 4003 4003 4005 4005 OVlo 118+ IIB- 1,0 +PSRR -PSRR CMRR Icc+ Icc- 3 TA ;:::: -55°C OPA50WM/883B OPA501VM OPA501UM/883B OPA501UM unless otherwise specified MIN MAX MIN MAX UNITS [V,0(+125'C) - Vm(+25'C)] + 100 -40 -35 -35 -7 -200 -200 76 +40 +35 +35 -65 -60 -60 -20 +65 +60 +60 +20 70 ·· · pVl'C nA nA nA pVIV pVIV dB rnA rnA -65 -60 -60 -20 +65 +60 +60 +20 pVl'C nA nA nA pVIV pVIV dB rnA rnA CONDITIONS ±V"" = ±34VDC -Vee = 34VDC. +Vee = 10 to 40VDC +Vee = 34VDC. -Vee = 10 to 40VDC VeM = ±22V. F = DC VCM = D. no load condition VCM = D. no load condition [V,0(+25'C) - V,0(-55'C)] + 80 +7 +200 +200 +10 -10 -40 -35 -35 -7 -200 -200 76 lee- 4001 4001 4001 4001 4003 4003 4003 4005 4005 4 T, = +25'C Vop** lop·· Avs 4004 4004 4004 10:;::: 10A peak, 10kHz sine wave RL = 2.60, 10kHz sine wave RL=10kO' -10 94 5 T,= +125'C Vop Avs 4004 4004 RL= 10kO RL= 10kO -30 94 +30 6 T, = -55'C Vop Avs 4004 4004 . RL= 10kO RL = 10kO -30 94 +30 7 T,= +25'C SR 4002 RL= 6.50 1.35 OVLo hs+ 118- 1,0 +PSRR -PSRR CMRR Icc+ -Vee = 34VDC. +V"" = 10 to +40VDC +Vee = 34VDC. -Vee = 10 to 40VDC VeM = ±22V. F = DC VCM:;;:; 0, no load condition VCM = 0, no load condition +40 +35 +35 +7 +200 +200 ·· 70 +10 -10 -~ti ·· · +20 +10 · -20 · · · · 90 90 90 ·· · · +~u · · V A dB V dB V dB Vips ... Specification same as OPA501 "V" grade . • * Performed in final electrical only. 3.5 Markin&. Marking is in accordance with MIL-M-385IO. The following marking is placed on each microcircuit as a . minimum: a. Part number (see paragraph 1.2) b. Inspection lot identification code If c. d. e. f. • •.. BURR-BROWN® Manufacturer's IdentificatIOn (IElElI ) Manufacturer's designating symbol (CEBS) Country of origin Electrostatic sensitivity identifier (~) 3.6 Workmanship-! These microcircuits are manufactured, processed, and tested in a workmanlike manner. Workmanship is in accordance with good engineering practices, workmanlike instructions, 'inspection and test procedures and training, prepared in fulfillment of Burr-Brown's product assurance program. 3.6.1 Rework'llrovisions. Rework provisions, including rebonding for the /883B product designation, are in accordance with MIL-M-38510. 3.7 Traceability-! Traceability for the /883B product designation is in accordance with MIL-M-3851O. Each microcircuit is traceable to the production lot and to the component vendor's component lot. 3.8 Product and llrocess change. Burr-Brown will not implement any major change to the design, materials, construction, or manufacturing process which may affect the performance, quality or interchangeability of the microcircuit without full or partial requalification. 3.9 Screening~ Screening for /883B Hi-ReI product designation is in accordance with MIL-STD-883, method 5008, class B, except as modified in paragraph 4.3 herein. Screening for the standard model includes Burr-Brown QC41l8 internal visual inspection, stabilization bake, fine leak, gross leak, constant acceleration (condition A), temperature cycle (condition C), and external visual per MIL-STD-883, method 2009. 11 A 4-digit code, indicating year and week of seal, and a 4- or 5-digit lot identifier are marked on each unit. 227 For the /883B product designation, all microcircuits will have passed the screening requirements prior to qualification or quality conformance inspection. 3.10 Qualification. Qualification is not required. See paragraph 4.2 herein. 3.11 Quality conformance insp'ection. Quality conformance inspection, for the /883B .product designation, is in accordance with MIL-M-3851O,except as modified in paragraph 4.4 herein. The microcircuit inspection lot will have passed quality conformance inspection prior to microcircuit delivery. 4. PRODUCT ASSURANCE PROVISIONS 4.1 Samlliing and insllection. Sampling and inspection procedures are in accordance with MIL-M-3851O and MILSTD-883,-;:;i"ethod 5008, except as modified herein. 4.2 .Qualification. Qualification is not required unless specifically required by contract or purchase order. When so required, qualification will be in. accordance. with the inspection routine of MIL-M-3851O, paragraph 4.4.2.1. The inspections to be performed are those specified herein for groups A, B, C and D inspections (see paragraphs 4.4.1, 4.4.2, 4.4.3, and 4.4.4). . Burr-Brown has performed and successfully completed qualification inspection as described above. The most recent report is available from Burr-Brown. 4.3 Screening~ Screening for the / 883B Hi-Rei product designation is in accordance with MIL-STD-883, method 5008, class B, and is conducted on all devices. The following criteria apply: a. Interim and final test parameters are specified in Table II. b. Burn-in test (MIL-STD-883, method 1015) conditions: (I) Test condition B or D (2) Test circuit is Figure 3 herein for condition B (3) TA = +125°C minimum (4) Test duration is 160 hours minimum c. Percent defective allowable (PDA). The PDA, for /883B product designation only, is 10 percent and includes both parametric and catastrophic failures. It 'is based 'on failures from group A, subgroup I test, after cool-down as final electrical test in accordance with MIL-STD-883, method 5008, and with no intervening electrical measurements. If interim electrical parameter tests are performed prior to burn-in, failures resulting from preburn-in screening failures may be excluded from the PDA. If interim electrical parameter tests are omitted, all screening failures shall be included in the PDA. The.verified failures. of group A, subgroup I, after burn-in are used to determine the percent defective for each manufacturing lot; and the lot is accepted or rejected based on the PDA: d. External visual inspection need not include measurement of case and lead dimensions., 1kO 10kO . +34VDC JO.01I1F 100 100 -34VDC FIGURE 3. Test Circuit-Bum-in and Operating Life Test (Condition B). 228 4.4 Quality conformance insJlection. Groups A and B inspections of MIL-STD-883, method 5008, class B, are performed on each inspection lot. Groups'C and D inspections of MIL-STD-883, method 5008, class B are performed as required by MIL-STD-883. A report of the most recent group C and D inspections is available from Burr-Brown. 4.4.1 GrouJl A insJlection. Group A inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5008, and as specified in Table II herein. 4.4.2 GroUJl B insJlection. Group B inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5008, class B. 4.4.3 GroUJl C insJlection. Group C inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5008, class B and as follows: a. Operating life test (MIL-STD-883, method 1005) conditions: (I) Test condition B or D '(2) Test circuit is Figure 3 herein for condition B (3) TA ::: +125°C minimum (4) Test condition is 1000 hours minimum b. End point electrical parameters are specified in Table II herein. 4.4.4 GroUJl D insJlection. Group D inspection consists of the test subgroups and LTPD values shown in MIL-STD883, method 5008 and as follows: a. End point electrical parameters are specified in Table II herein. 4.4.5 InsJlection of Jlackag~g~ Inspection of packaging shall be in accordance with MIL-M-3851O. 4.5 Methods of examination and test. Methods of examination and ~est are specified in the appropriate tables. Electrical test circuits are as prescribed herein or in the referenced test methods of MIL-STD-883. 4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) arc referenced to the external zero reference level _of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. 5. PACKAGING 5.1 Packagl!lg~quirements. The requirments for packaging shall be in accordance with MIL-M-3851O. 6. NOTES 6.1 No~ The notes specified in MIL-M-3851O are applicable to this specification. 6.2 Intended use. Microcircuits conforming to this specification are intended for use in applications where the use of screened parts is required or desirable. 6.3 Ordering data. The contract or purchase order should specify the following: a. Complete part number (see paragraph 1.2). 1,. Requirement for certificate of compliance, if desired. 6.4 Microcircuit grouJl assignment. These microcircuits are assigned to Technology Group I as defined in MIL-M38510, Appendix E. 6.5 Electrostatic sensitivity..:. CAUTION-these microcircuits may be damaged by electrostatic discharge. Precautions' should be observed at all times. 229 7. ELECTRICAL PERFORMANCE CURVES Typical at +25°C case and ±Vcc :;;: 28VDC unless otherwise noted. OPEN-LOOP FREQUENCY RESPONSE 120 100 iii" 80 -0 i 60 :5.E" 4 0 <: +-- ~ 'I'.. 1\ ~ Phase I" Ampli1Ude 7 0 ~ o -20 ~ 1"\.1 ' ~ .~ 2. " 'iii' -120! ii! '8" ~ ,4 0 E E 0 -150'.!. -180 -210 10 100 lK 10K lOOK 1 M 10M Frequency (Hz) . a: 0 o 8 I\. , 1 I 40 ·i'" 20 ~ 10 g 6 '" J!! o 0; E 20 ~ o -so 0.24 ~ ~ '" tlJe ='2.2°C/W ~ 0.16 '[jj "'~ a: 0.12 1. is. 1.0 (J '" o 0.8 E :2 RL 811 Av =+1'0'1 s Tc = +2~,~C {!. 4 6 10 20 4060 Frequency (kHz) 100 CURRENT LIMITING _ ±6 ~ r= ±5 II 11 ~ <3 j E ~ 4 6 10 12 14 Current (A) PULSE RESPONSE, Av = +1 Time (100I's/~lv) 230 /]Rsc=0.1211 ~ , ±Rsc = 0.28n r- b ~ o -SO -25 0 25 50 75 100 125 Case Temperature (OC) PULSE RESPONSE, Av = +1 Time (10pS/dlv) ~ r- r-.... tj ±1 I"""-2 ±2 r- t---- o l"- 0.04 0 ±4 ":; ±3 1\ () 25 50 75 100 125 150 Case Temperature (OC) 103 102 Frequency (Hz) 10 ±7 c " 75 100 125 ~ 1.2 Ma~m~~'!G~~~~rted"~ ~ 0.08 ~ 50 ~ 1'::~~11~~~~~11 E_SJne Wave Output 'E ...... 25 ;!;.1 ~ Tc = +25°C .: 0.20 0 Case Temperature (OC) CURRENT LIMITING §: -25 HARMONIC DISTORTION Maxim um Output 28VD '" 0 0.28 cf100 C 40 iii '5 O. 4 c. .5 1 ~'I... POWER DERATING CURVE 120 J j 34VDC +Vcc 2 60 gt O.8 100 1K 10K 100K 1M Frequency (Hz) ~+Vcc rr- .S c. S ! " .... 1. 2 () FULL POWER RESPONSE ~ .2 80 ~~ ~ 10 c: 60 'Ii is E 2. o z ';:"1. 6 0 100 ~ 0; ~ o ~ 8C OUTPUT VOLTAGE SWING VS POWER SUPPLY VOLTAGE ~ " :i_\ iii" :2.100 c: f -90 2.8 120 30 -60 INPUT BIAS CURRENT' VS TEMPERATURE COMMON MODE REJECTION VS FREQUENCY o 8. APPLICATION INFORMATION 8.1 Grounding~ Because of the high output current capability of the OPASOI/883B Series, the user is cautioned to observe proper grounding techniques. Figure 4 illustrates a recommended technique. Note that the connections are such that the load current does not flow through the wire connecting the signal ground point to the power supply common. Also, power supply and load leads should be run physically separated from the amplifier input and signal leads. FIGURE 4. Proper Power Supply Connections. 8.2 Supp"lyJ?YI~assing! The OPASOI power supplies should be bypassed with SOILF tantalum capacitors connected as close as possible to pins 3 and 6. These bypass capacitors should be connected to, the load ground rather than the signal ground. 8.3 Current limits. OPASOI amplifier is designed so that both positive and negative load current limits can be set independently with external resistors +Rsc and -Rsc respectively. The approximate value of these resistors is given by the equation: Rsc = [(0.6S + ILIMIT) - 0.0437] ohms ILIMIT is the desired maximum current in amperes. The power dissipation of the current limit resistor is: = Pm" Rsc (ILIMIT)2 watts Rsc is in ohms and ILIMIT is in amperes. Current limit resistors carry the full amplifier output current so lead lengths should be minimized. Highly inductive resistors can cause loop instability. Variation in limit with case temperature is shown in the Typical Performance Curves, paragraph 7. ' The amplifier should be used with as Iowa current limit as possible for its particular application. This will minimize the chance of damaging the amplifier under abnormal load conditions and will increase reliability by limiting internal power dissipation. The c.urrent limits may be used to generate other functions such as constant current supplies and torque or stall current limits for servomotor applications. 8.4 Heat sinking~ The OPASOI requires a heat sink to limit output transistor junction temperature (TJ) to an absolute . maximum of +200°C. The steady-state thermal circuit is illustrated in Figure S. 231 1--.,.--...........- - - - ' 0 Junction Case Heat Sink L-----'--------o FIGURE 5. Simplified Steady-~tate Ambient Heat Flow Model. Junction temperature (Tl) is found from the equation: , Tl = Po (Ole + Oes + OSA) + TA where Po = average amplifier power dissipation (W) Ole = junction-to-case thermal resistance (OC/'W) Oes = case-to-sink thermal resistance (OCj W) OSA = sink-to-ambient thermal resistance ("CjW) TA = ambient temperature (0C) For most heat sink calculations the quiescent power dissipation is very low «lW) and can be disregarded with only a small error. The maximum size heat sink can be found as follows: Example: Find the maximum thermal resistance (smallest heat sink) that can be used for an OPA501 with ±Vee = '28VDC. Output voltage is + JOVDC across a JOn resistor and ,ambient temperature is +50°C: OSA = [(Tl - TA) + PD] - Oes - Ole As large a heat sink as possible should be used. Oes depends on the flatness of the heat sink, the thermal compound used, and the roughness of the mating surfaces. Typical values are between O.l°Cj Wand O.3°Cj W for TO-3 package properly mounted on a heat sink. The OPA501 mounting flange is electrically-isolated and can be mounted directly to a heat sink without insulating washers or spacers. The output transistor thermal resistance (Ole) is a function of the output current pulse width, pulse shape, and duty cycle. Long duration pulses allow the junction temperature to approach its steady state value while shorter pulses cause a lower peak junction temperature due to the junction's thermal time constant. Heat is conducted away from the junction rapidly so that as the duty cycle decreases, junction temperature decreases. Steady state Ole is rated at 2.2°Cj W maximum. In applications where the amplifier's output current alternates between output transistors-for example, an AC amplifier-the transistor Ole will depend on frequency as shown in Figure 6. Duty Cycle = 0,5 for Each Transistor 1.2 1.0 u .;; ." - 0.8 Q) .!:! E 0 z 0.6 I"' 0.4 0.2 0.1 10 100 lk 10k Frequency (Hz) FIGURE 6. Effective Ole for Applications Where Output Current Alternates Between Output Transistors. 232 8.5 Safe operating area (SOA). In addition to the limits imposed by power dissipation, the amplifier's output transistors are also limited by a second breakdown region. This occurs because of increased emitter current density due to current crowding at higher operating voltages. Both the dissipation and second breakdown limits depend on time and temperature. Figure 7 shows each output transistor's SOA at a case temperature of +25°C. 10 "8 MaXimum Specified I t I\, Current TI"'6 Power _ , DIssipation 4 '\~ ~- "- (T1 '--'" ~ ~\ ~ tecond Breakdown" c g 1.0 t-- T It---. Limit = +25°C CASE u 0.8 I-- TJUNCTION = +200°C "5 Co 0.6 I- 8,e = 2.2°C/W "5 0 \ ,~ 0.4 0.1 \1 MaXimum"}U Grade Specified I Voltage V Grade I I I I I I 6 8 10 '", ~~ ~ , 0.2 "%, I I 20 40 ,m, I 6080100 Voltage Across Output Transistor (V) FIGURE 7, Transistor Safe Operating Area at +25°C Case Temperature. Limits for short,pulse widths are substantially greater than for steady state (DC). At a case temperature of + 125°C the SOA limits are reduced (see Figure 8). The SOA shown in these curves is based on a conservative linear derating of both the power dissipation and the second breakdown region. 10 8 I I " ~,MaXimum 6 Specified ~ ~ '- TeASE = +125°C TJUNCTION = +200°C 1,0 5 u 0,8 8JC " i\. _'- "- I\. 138 60 32 16 V 0 -10 o PMI U12M4T, Motor, No Load f = 4Hz, Sine Wave ±Vcc 28V, Tc 2S' Av= +10 = PMI U12M4T Motor, No Load f = 4Hz, Square Wave ±Vcc = 28V, Tc = 2S' Av=+10 = FIGURE 12. DC Servomotor Load Line, FIGURE 13, Servomotor Dnve-"P1ugging': +S A 0 -S +10 V 0 -10 PMI U12M4T Motor, No Load f = 4Hz, Sine Wave ±Vcc = 28VDC, ±Rsc = 0.IS0 Tc=2S',Av=+10 FIGURE 14, Servomotor Drive With Current Limit, 236 BURR-BROWN® PWR7XX Series 1E3E31 5W Rated Output Power REGULATED DC/DC CONVERTER SER~ES FEATURES o Linear Output Regulation o Wide Operating Temperature Range: • Isolation Voltage Tested per UL544. VDE750. and CSAC22.2 DIelectric Withstand Requirement • Barrier Leakage Current 100% Tested at 240VAC • Single Channel • iiingie or jju~i iillgui~illu uuillUi~ III -40°C to +IOO°C Input and Output Filtering DESCRIPTION The PWR 7XX Series offers a large selection of regulated 5W DC/DC converters for use in such diverse applications as process control, telecommunications, portable equipment, medical systems, airborne and shipboard electronic circuits, and automatic test equipment. Thirty-six models allow the user to select input voltages ranging from +5VDC to +48VDC and output voltages of +5, +12, +15, ±5, ±12, or ±15V. CONNECTION DIAGRAM Surface-mounted devices and manufacturing processes are used in the PWR 7XX Series to give the user a device which is more environmentally rugged than most DC/DC converters. The use of surfacemount technologies also gives the PWR7XX Series superior isolation voltage. Each PWR7XX Series unit is tested in compliance with the dielectric withstand voltage requirements of UL544, VDC750, and CSAC22.2. ORDERING INFORMATION T Device FamiIY _ _ _ _ _ _ _ _ ~_'WR 7XX ;G PWR indicates DCI DC converter Model Number Selected from table of Electrical Characteristics Reliability Screening - - - - - - - - - - ' No designator indicates standard manufacturing processing I G indicates Level I screening-burn~in only IT indicates Level II screening-stabilization bake. temperature cycling, and burn-in TYPICAL APPLICATIONS 3 3 2 5~--"'" (S~ln~gl:-eO::-U~IP~UI~M:-od~el') 5 (Dual Oulpul Models)' Inlernalional Airport Industrial Park· P.O. Box 11400· T~cson. Arizona 85134· Tel. (602) 146·1111 . Twx: 910-952·1111 • Cable: BBRCORP • Telex: 66·6491 PDS-662 237 SPECIFICATIONS ELECTRICAL SPECIFICATIONS f1I Input Cumint Regulation Nominal Input Voltege (VDC) Rlted Output Voltege (VDC) Rated Output Current (mA) NoLoed, typ (mA) RltedLoed, typ (mA) Reflected Ripple Current, typ(mA) p-p typ ('10) Load, typ('Io) Elliciency, mln(%) PWR700 PWR701 PWR702 PWR703 PWR704 PWR705 5 5 12 15 ±5 ±12 ±15 1000 417 334 ±500 ±209 ±167 168 168 168 168 168 166 1600 1535 1490 1560 1490 1450 30 30 30 30 30 30 .02 .02 .02 .02 .02 .02 .04 .04 .04 .04 .04 .04 61 63 65 62 65 67 PWR706 PWR707 PWR708 PWR709 PWR710 PWR711 12 5 12 15 ±5 ±12 ±15 1000 417 334 ±500 ±209 ±167 38 36 38 38 36 38 620 550 535 640 550 535 10 10 10 10 10 10 .02 .02 .02 .02 .02 .02 .04 .04 .04 .04 .04 .04 61 63 65 62 65 67· PWR712 PWR713 PWR714 PWR715 PWR716 PWR717 15 5 '12 15 ±5 ±12 ±15 1000 417 334 ±500 ±209 ±167 35 35 35 35 35 35 510 490 470 520 .02 .02 .02 .02 .02 .02 .04 .04 .04 .04 .04 .04 61 63 65 455 10 10 10 10 10 10 PWR718 PWR719 PWR720 PWR721 PWR722 PWR723 24 5 12 15 ±5 ±12 ±15 1000 417 334 ±500 ±209 ±167 33 33 33 33 33 33 320 305 300 330 310 305 20 20 20 20 20 20 .02 .02 .02 .02 .02 .02 .04 .04 .04 .04 .04 .04 61 63 65 62 65 67 PWR724 PWR725 PWR726 PWR727 PWR728 PWR729 28 5 12 15 ±5 ±12 ±15 1000 417 334 ±500 ±209 ±167 33 33 33 33 33 33 280 270 260 280 270 260 20 20 20 20 20 20 .02 .02 .02 .02 .02 .02 .04 .04 .04 .04 .04 .04 61 63 65 62 65 67 PWR730 PWR731 PWR732 PWR733 PWR734 PWR735 48 5 12 15 ±5 ±12 ±15 1000 417 334 ±500 ±209 ±167 31 31 31 '31 31 31 165 160 155 165 155 155 10 10 10 10 10 10 .02 .02 .02 .02 .02 .02 .04 .04 .04 .04 .04 .04 61 63 65 62 65 67 Model I 460 COMMON SPECIFICATIONS f1I Parameter INPUT Voltage Range Condition. VrN = 5V Models VrN = 12V Models VrN = 15V Models VrN = 24V Models VrN = 48V Models 4.65 11.00 13.70 21.00 25.00 44.50 60 Seconds, 60Hz 1000 3000 VIN ISOLATION Rated Voltage Test Voltage Resistance Min = 28V Models MIx Unit. 6 15 17 27 31 53 VDC VDC VDC VDC Leakage Current 240V rms, 60Hz OUTPUT Voltage Accuracy Voltage Balance Temperature Coelliclent Ripple and Noise Dual Output Units Only -25·C ,,; T. ,,; +65·C BW = ec to 10MHz V•• Gn 25 ±C.5 ±0.3 ±0.01 30 -25 -40 .,.55 vec vec vec 10 170 Capacitance TEMPERATURE Specification Operation Storage Typ ±1 pF IIA,rms '10 % %/·C mV, p-p +85 +100 +125 ·C ·C ·C NOTE: (1) Specifications typical at T. = +25·C, nominal input yoltage, and rated output current unless otherwise noted. 238 Line, 62 65 67 +VOUT V'N VOUT (Bottom'View-"B" Package Option) IT I 0.410 - - Max (10.41) ~LT'"-0~.0~2-0-±-O-.0-03-------"'I1'[~ 0.170 +-i-++-H 11.02 ± 0.081 +VOUT .... "+VIN Min (4.32) (Side View-"B" Package Option) COM· .....l-+--+---I-l-l H-+++-l--+-V'NH-++--i-I-+++-l---l--l H-+++-l-++H+-VoUT ot--I-++-!-+-l (Bottom View-"A" Package Option) COM·to iT =.± (~:.:~) I U Max o.o4oL-±-o.-oo-3-=u=-..-----.... 0.170 Min (1.02 ±0.08) (4.32) (Bottom View-"C" Package Option) (Side View-"A" Package Option) IT (~:.:~) NOTES: All dimensions are in inches (millimeters) I GRID: 0.100 Inches (2.54 millimeters) * Common Max _L-TTF....,'-0.-04-0-±-0.-0-03--------rr~=t 0.170 Min pins are niissing on single output models. MATERIAL: Units are encapsulated in a low thermal·resistance molding compound which has excellent chemical resistance, wide operating temperature range, and good electrical properties under high humidity environments. Lead material is brass with hot·solder·dipped surface to allow ease of solderability. (1.02 ±0.08) (4.32) (Side View-"C" Package Option) a ABSOLUTE MAXIMUM RATINGS Input VOltage ......................... : ........ 120% of nominal Output Short-Circuit Duration ........................ 5 seconds Internal Power Dissipation . ....................... : ........ 3.5W Lead Temperature (soldering, 10 seconds) .••.......•.... +300'C Junction Temperature . ................................. +150°C ~ackage Therma,1 Resistance. Junction-to·Ambient, 9JA • •• 15°C/W 239 APPLICATION NOTES . TESTING ISOLATION BARRIER CHARACTERISTICS The insulation and spacings of the PWR 7XX Series are 100% tested to meet the dielectric withstand requirements of UL544, paragraph 31. A 60Hz essentially sinusoidal potential is applied between the primary and secondary for a period of one minute. The potential used for this test is twice the maximum rated voltage plus 1000V. For the PWR7XX Series the test voltage is 3000V peak. Dielectric withstand testing is intended to be done at the manufacturer's site only. This test will not be repeated. Exposing the dielectric material of the isolation barrier to repeated testing causes microscopic carbonizing of the dielectric, resulting in a weakened barrier. A low resistance path will eventually be created across the barrier. PRESERVING ISOLATION CHARACTERISTICS If intrinsic safety is required, care should be taken in the layout and assembly of the printed wiring board (PWB) to avoid degrading the isolation barrier of the PWR7XX. Precautionary measures include cleaning the PWB prior. to installing the PWR 7XX to prevent trapping contaminates under the unit. Use nonconductive spacers to keep the PWR7XX off the PWB. Use epoxy solder mask to isolate PWB conductive traces which must run under or close to the PWR 7XX. In the layout of the PWB, avoid placing PWB traces under the unit. Do not use conductive inks on the PWB under the unit; e.g., inks used in. inspection stamps or component identification marking. DC/DC Converter FIGURE 1. Recommended Power Distribution. MEASURING NOISE Measuring the input and output noise performance of ~ DC! DC converter is a very difficult task that should be attempted only in a controlled laboratory test environment due to extraneous noise sources. Figure 2 illustrates two recommended methods for testing output voltage ripple and noise. Reflected input current ripple and noise should be measured with a high performance current probe. Measuring input current and noise into a "known" impedance with a voltage probe should be avoided. Output ~Toscope a. Preferred Method Grounded Probe TIp OUTPUT POWER DISTRIBUTION Figure 1 shows the recommended method of connecting multiple loads to the PWR 7XX. Single-point power distribution prevents ground loops and interaction between parallel load circuits. b. Altemate Method FIGURE 2. Recommended Noise Measurement Methods. 240 PWR1011 BURR-BROWN® l'ElE31 Four-Channel, Dual-Outpuit, SYl1u:hroli'ilozalbl~e UNREGULATED DC/DC CONVERTER FEATURES APPUCAT~ONS () Synchronizable CD All Outputs Isolated CD Output Power to 3W • High Isolation Voltage-l000Vpk .. Six-Sided Shielding o Input and Output Filtering () Low Profile Package-O.4" High o Power lor High Resolution Data Acquisition CD Precision Test Equipment • Spot Regulator o Process Control o Portable Equipment o Multiple Power Supplies DESCRIPTION The PWRI017 is a four-channel, dual-output unregulated DC! DC converter designed for low noise applications where high efficiency and switching synchronization are required. Any unit whose slave pin is connected to another unit's master pin will cause the oscillators to lock together. The PWRI017 may also be driven from a system master clock. The free running switching frequency is 250kHz. The PWRI017 has four isolated plus and minus output voltages approximately equal to the magnitude of the input voltage. It operates over an input voltage range of IOVDC to 18VDC. Rated output current for the PWRIOl7 is 25mA for all outputs. CONNECTION DIAGRAM Osc. Out 4. +V'N 3411 2' -V'N Sync. In HI ,-c o rt~t;;tl l~_ .. Ch.l N "10 Ch.2· T R o '. ,-- ,,9 ]; ~ :L: 'F+-::+" uvlO 151614 MECHANICAL 2.000 ±0.01S _0.410 (10.41) AI II TL-y-r-I' "'T__..-~102so±0080 IIII Ch.3 ,~ -- , . 12 : ~13 L__ 11 J:....r~: [ Ch.4 Isolation voltage between the input and any of the four output circuits is 1000Vpk continuous. The same isolation specification applies between any of the four dual outputs, Six-sided shielding suppresses electromagnetic radiation which could disturb sensitive analog measurements or interfere with system timing signals. Filtering the PWRI017 input and outputs minimizes the effects of electrical noise on the source and loads of the converter. Each PWRIOl7 is tested in compliance with UL544, VDE750, and CSA C22.2 dielectric withstand specifications. In addition, barrier leakage current is 100% tested. I~ (~.3S ±2:03) 0.040 ±0.002--! (1.02 ±O.OS) ill It) ~ - ~~~ ·8 N!!? I .. (50.80 ±0.38) "" ~5 8 6 7 9 10 3 :1• • ~161S14 11 _;ma3 12 NOTE: All dimensions are in inches (millimeters). Grid = 0.100" (2.S4mm). International Airport Industrial Park· P.O. Box 11400· Tucson. Arizona 85734 . Tei. (6021 746·1111 • Twx: 910-952·1111 • Cable: BBRCORP . Telex: 66·6491 PDS-706 241 . SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ELECTRICAL At TA :;; 25°C. VIM :;; 15VDC, ILoAD = ±25mA and in free running mode unless otherwise noted. PWR1017 PARAMETER CONDITIONS INPUT Rated Voltage'" Voltage Range Input Current NORM MIJII MAX UNITS 15 10 ILoAD :;; ISOLATION Rated Load Ratings apply input-to-output and channel-ta-channel Test: 60sec, 60Hz, 3000V, pk Rated Voltage Resistance 70 285 80 = Rated Load kOAD Ripple Current V,sa OUTPUT Rated Voltage Voltage Range ~ 10 15 0.9 240VAC, 60Hz ILoAD ILOAC Rated Current =OmA = Rated Load Each output Total of all outputs Each output Totat of all outputs 10VDC V'N 18VDC 0> ILOAD > 25mA Current Range. < Line Regulation Load Regulation Ripple Voltage < kOAD;;;:; kOAD 350 1000 Capacitance Leakage Current ±15 ±16.5 ±16 ±14.25 ±25 200 0 0 VSYNC, max Max dBviation from -VIN < < VDC VDC VDC mA mA mA mA mVlmV mVlmA mV, pk mV, pk ±18 ±15.75 ±40 500 1.16 12.5 ±10 0 VSYNC> 6.4Vp-p 400kHz fSYNC 700kHz VDC GO pF pA 3 = Rated Load SYNCHRONIZATION'" f SYNC Range VSYNC Range Oscillator Output Fanout VDC VDC mA mA mA, p-p 18 kOAO=O ±100 400 6.4 VSYNC Duty Cycle 5 TEMPERATURE Specification Operating Storage -25 -40 -55 50 700 36 2 50 60 kHz V, p-p Synch Inputs V +85 +100 +125 'C 'C 'C Input Voltage .....•........ 18VDC Output Current ............ 500mA Output Short Circuit Duration ............ Momentary ORDERING INFORMATION PWR 1017.X Device Family T PWR indicates DC/DC converter Model Number--------' Reliability Screening ------~ No designator indicates standard manufacturing process /G indicates Level I screeningburn-in only IT indicates Level II screeningstabilization bake, temperature cycling, and burn-in Control Circuitry Block Diagram % NOTE: (1) Other voltages available on request. (2) Operating frequency (10 sync mode) ~ fSYNcl2. Oscillator frequency (pin 4, free running) ~ 2 (f operation). Oscillator frequency (pin 4, sync mode) ~ fSYNC. NOTE: Care should be taken when the synchronization input pin is not used, in order to avoid the possibility of noise pick-up and false PLL locking. This could destroy the unit and/or any other units that are coupled to its synchronization output (pin 4). This protection may be accomplished byeither tying the synchronization pin to -VINo or clipping pin 1 off flush with the module surface. Tying pin 1 to -VIN is preferred. TYPICAL PERFORMANCE CURVES OUTPUT VOLTAGE VS LOAD CURRENT INPUT VOLTAGE VS OUTPUT VOLTAGE TAC' +25'C 17 450 "- 10 __ ~ 12 __ ~ ____ 14 ~ 16 Input Voltage (VDC) . T. ~ +25'C, V'N ~ 15VDC; each output loaded to indicated value. T. ~ +25'C, V'N ~ 15V; each output loaded to indicated value. 25r----r----r----r--~ 5~ INPUT CURRENT VS OUTPUT CURRENT __ ~ 18 13 o ~ " .s E f' ~ ::I 250 () '5 c. E 150 50 10 20 30 Load Current (mA) 242 / _350 « 40 / o V 10 / 20 30 Load Current (mA) 40 TYPICAL PERFORMANCE CURVES (CONT) INPUT CURRENT VS INPUT VOLTAGE TA ~ TA ~ +2S'C, I, '" ±2SmA 320 18 ;;( 300 .§. E ~ 280 :J o :; Co -= / / V V ,; ,; Cl l!! 16 g :; 14 14 12 16 Input Voltage (VDC) 18 ISYNC VS OUTPUT VOLTAGE AND INPUT CURRENT +2S'C, V,N = lSVDC, I, = ±2SmA, VsyNc -60 ~ Z o 10 '" o a: .. > .. 'S at ~£ - 8 0 t - - + - ,; - I 50 25 75 Load Current, I, (mA) ,; ~15.---1---1--~~ g 3 ., :; Load Current, I, (rnA) TEMPERATURE CHARACTERISTICS VIN = +15V, !LOAD = ±25mA, free running. . ::, Cl "" g \ m~ a :D ;; :!'3 Mfr [OHC /[OIlC CO U\lJVlE lR1l'lE [p1 o Isolation Voltage 500 VOC o Barrier leal(age Current 100% Tested at 240VAC o low Cost o Wide Operating Temperature Range o ,0 The PWR5038 offers a triple output 2.75W DC to DC converter for use in such diverse applications as process control, telecommunications, portable equipment medical systems, airborne and shipboard electronic circuits, and automatic test equipment. This model gives the user an output voltage of +5 and ± l5VDC with an input voltage of +5VDC. Input and Output Filtering Surface-mounted devices and manufacturing processes are used in the PWR5038 to give the user a device which is more environmentally rugged than most DC to DC converters. The use of surface-mount technology also gives the PWR5038 a low cost reflected in our low prices. Six-Sided Shielding CONNECTION DIAGRAM ORDERING INFORMATION 0+ T PWR 5038 /G Device Family --,-PWR indicates DC! DC converter Model Number------------.J VOUT2 @common, G)-Vou., Reliability Screening _ _ _ _ _ _ _ _ _ _..J No designator indicates standard manufacturing processing / G indicates Level I screening-bum-in only / T indicates Level II screening-stabilization bake, temperature cycling, and burn-in ~+Vour, '------_.- 0-VOUT1 TYPICAL APPLICATION 3~ Q' 1 Input Voltage I Load I I LODd I 4 5----1 6~ I Load I 7----1 Inlernalional Airporllnduslrial Park· P.O. Box 11400· Tucson. Arizona 85734· Tel. 16021746·1111 . Twx: 910·952·1111· Cable: BBRCORp· Telex: 66·6491 PDS-738 245 SPECIFIC~TIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS Ta '" Specifications Typical at +25 deg C., nominal input voltage and rated output current unless otherwise noted. PARAMETER INPUT VOLTAGE RANGE CURRENT RIPPLE CURRENT CONDITION MIN TVP 5.00 5.25 4.75 NO LOAD FULL LOAD 150 FULL LOAD 60 1.0 OUTPUT 1 VOLTAGE 150 RIPPLE -25 to + 85 CEG C I LOAD SOmAta 150 rnA INPUT VOLTAGE 4.75 to 5.25 V OCto 10 MHz 4.75 UNT vae vae mA A mA pop 5 CURRENT ACCURACY MSX BURR-BRO\NN8 mV pop ±,5 67 -25 vae mA 1.625 ±0.015 (41.28 ±0.38) to +85 DEG C MarkedwitJ specific model humber ordered. I LOAD 33 mAteS7 rnA INPUT VOLTAGE 4.75 to 5.25 V RIPPLE IElElI PWR5038 QUTPUT2 VOLTAGE CURRENT ACCURACV MECHANICAL VDe mA 5.25 20 Input Voltage................ 120% X rated voltage Output Short..Circuit Duration. . . . . . . .. Momentary Internal Power Dissipation ......•........•.. 4W Junction Temperature ....................... 2W Package Thermal Resistance ....•....•..•. +l50°C Lead Temperature (soldering, 10 seconds) ...........•..•.. +300'C 13.5 16.5 300 OCto 10 MHz mV pop (Top VIew) ISOLATION VOLTAGE RESISTANCE CAPACITANCE LEAKAGE CURRENT vac 500 Mn '0 45 3 pF 4 Viso = 240 VAC 5 pA +85 +100 +125 "C "C "C 5 TEMPERATURE SPECIFICATION OPERATION STORAGE -25 -40 -55 2 1 6 7 (Bottom View) t 0.410 Max W (Side View) • U _11_ 0.020 ±0.002 (0.51 ±0.05) (1°r: O~ Min=--J (4.32) NOTES: All dimensions are in inches (millimeters) . GRID: 0.100 inches (2.54 millimeters) MATERIAL: Low thermal resistance molding compound which has excellent chemical resistance, wide operating temperature range and good electrica'i properties under high humidity environments. Lead material Is • brass with a hot~solder-dlpped surface to allow ease of solderability. 246 BURR-BROWN® PWR5104 PWR5105 IElElI 9W Rated Output Power REGULATED DC-TO-DC CONVERTER FEATURES • LOW COST • ±12VDC AND ±15VDC OUTPUTS .i.iiW i1iii8E -- .. IDIIT Alln nllTDIlT r:IITr:IIINI! I I • • U I h i . . . . . . . . . . . . . . . . . . . . . . . _ ...... _ • LINEAR OUTPUT REGULATION • WIDE OPERATING TEMPERATURE RANGE: -40°C TO +100°C • SIX-SIDED SHIELDING • BARRIER LEAKAGE CURRENT 100% TESTED AT 240VAC DESCRIPTION The PWR5104 and PWR5105 offer respectively ±12VDC and ±15VDC ouputs of regulated 9W power driven from your +5V system bus. These units are designed for use in such diverse applications as process control, telecommunications, portable equipment, medical systems, airborne and shipboard electronic circuits, and automatic test equipment. The PWR5104 and PWR5105 offer a low cost alternative to the models currently in the market. In addition these models utilize high frequency switching in order to maintain a low EMI and RFI environment. Both models incorporate input and output filtering along with six-sided shielding to keep unwanted noise from your circuit. Surface-mounted devices and manufacturing processes are used in the PWR5104 and PWR5105 to give you a device which is more environmen~ally rugged than most DC-to-DC converters. These manufacturing and design technologies also give superior isolation voltage. The PWR5104 and PWR5105 are tested in compliance with the dielectric withstand voltage 'requirements of UL544, VDC750, and CSAC22.2. ORDERING INFORMATION CONNECTION DIAGRAM -VIN (!:: G)-VOUT (!)common +VIN~ 0 +VOUT T PWR 510X/G Device Family . PWR indicates DC/DC converter =r Model Number-----------' Selected from table of Electrical Characteristics Reliability Screening--------.J No designator indicates standard manufacturing processing IG indicates Levell screening-burn-in only IT indicates Level" screening-stabilization bake. temperature cycling. and bUrn-in Inlernalional Alrporllnduslrlal Park· P.O. Box 11400 . Tucson, Arizona 85734 • Tel. (6021 746·1111 • Twx: 910-952-1111 • Cable: BBRCORP • Telex: 66·6491 PD5-713 247 I SPECIFICATIONS ELECTRICAL Specifications typical at TA otherwise noted. ::; +25°C, nominal input voltage and rated output current unless MECHANICAL PWR5104/5105 PARAMeTER INPUT Nominal Voltage Voltage Rangel1l Input Current Input Current Ripple Current CONOITIONS MIN 5.25 60 2400 5 ±12 ±15 ±0.5 ±0.3 -25'C to +85'C 2570 ±1.0 ±0.01 BW = DC to 10MHz 70 6 0.02 0.04 75 UNITS I r-- 2.000 ±0.Q15 35 '" ;; ci +i % % %/oC rnA rnA mV,p-p §~ N!e. ~~1 Top View "A" Package Option • t " . , ., .; ••• t,f+ h :• :t :............. : : : : : : : :. :...:-: : !:~2 2. * ..... .. ~ 10 50 15 GENERAL Switching Frequency TEMPERATURE Specification Operation Storage I VDC VDC rnA rnA mA,p-p % % % 750 240Vrms, 60Hz . (50.80 ±0.38) - - - - - , VDC VDC ±375 ±300 Efficiency ISOLATION Rated Voltage Resistance Capacitance Leakage Current MAX 5.00 4.75 No load Rated load At rated load OUTPUT PWR5104 PWR5105 Rated Voltage Rated Voltage Accuracy Voltage Balance Temperature Coefficient PWR5104 Rated Current PWR5105 Rated Current Ripple and Noise Line Regualtion Load Regulation TYP VDC GO pF pA, rms kHz 50 , • ~ . . . . . . . . . "'t .. + t , . . . . . . . . . . . . . _"'t .......... ,+VOUT.·· ....... . ~ ..... -+ ..... .... t ~ .,. -+ • ~COt".·.·~ • • '.' ........... r'" .. .. · • • . . • +VIN· ...... , .. · • . • . • -V'N·· .. -t • ...... • ............. · •••••••••• t·· .. • .. -+·· • . • . • • • • --VOUTe· .... .. . . . . . . . . . . . . . . . . T .... .. -25 -40 -55 +85 +100 +125 'C 'C 'C .......... t···· t · 'T ••••••••••••••••• T Bottom View-"A" Package Option NOTE. (1) Other voltage ranges available. Conlact lactory. ABSOLUTE MAXIMUM RATINGS ~ u L.._ _,.,..._ _ _....,.,. ,--u-- Input Voltage ............................. 110% of nominal putput Short-Circuit Duration ............... 15 seconds Internal Power Dissipation .......................... 4.0W Lead Temperature (soldering, 10 seconds)..... +300·C Junction Temperature ............................. +150·C Package Thermal Resistance, Junction-to-Ambient, IIJ •.•..••••.•••.•.••.••••• 15°CIW LOMO ±0.OO3 . 0'410M (10.41) ax 0.170 Min (4.32) (1.02 ±0.08) Side View-"A" Package Oplion NOTES: All dimensions are in inches (millimeters) GRID: 0.100 inche& (2.54 millimeters) MATERIAL: Units are encapsulated in a low thermal resistance molding compound which has excellent chemical resistance. wide operating temperature range, and good electrical properties under high humidity environments. Lead material is brass with a hot-solder-dipped surface to allow ease of solderability. 248 TVP~CAl PERfORMANCE CURVES EFFICIENCY VS LOAD (at Nominal Input Voltage) EFFICIENCY VS INPUT VOLTAGE (at Full Power Out) 100 80 90 70 r---- 80 l rJc w 70 .!2 iij 20 ---- 60 ~ ,.. u c w ;g ~~ iii 20 10 10 o +4.50 +4.75 +5.00 +5.25 0 +5.50 Input Voltage (V) 41 9 INPUT CURRENT VS TEMPERATURE I ~ ~ 0; 5.0 \ O 2.5 0 12 +85'C 7.5 ~ 0 9 Power Out (W) OUTPUT POWER DERATING 10.0 I a. "5 S- v ~ +25 +50 +75 \ ~5~0~----2~5~----~----+~2~5----~+~570-----+~7~5----+~1~00 +100 Temperature ('C) At Nominal V,N (5V) Temperature (Oe) All Burr-Brown DCI DC converters are manufactured using stringent in-process controls and quality inspections,The custo~er may also choose one of two additional levels of screening to meet specific requirements, The advanced reliability program is designed to reduce infant mortality, system rework, field failures, and equipment downtime, Standard Manufacturing Process IG-Levell Screening Incoming Material Inspection Per MIL-S-19500 Standard Manufacturing Process I Burn-in, MIL-STD-8B3, method 1015, 160 hours, T. = + 125'C Stabilization Bake, MIL-STD-BB3, method 1008, 24 hours, T. = + 125'C 100% Internal Visual Inspection Final Electrical Test Temperature Cycling, MIL-STD-883, method 1010, Condition B (-55'C to +125'C) 100% Electrical Test OA Lot Acceptance Testing, AOL = 0,5 Component Attachment I I I I I IT-Level II Screening Standard Manufacturing Process I I I I Burn-in, MIL-STD-883, method 1015, 160 hours, T. = +125'C 100'10 Final Electrical Test Final Electrical Test Seal T I I I External Visual OA Lot Acceptance Testing, AOL = 0,25 I OA Lot Acceptance Testing, AOL = 1,0 249 MEASURING NOISE Measuring the input and output noise performance of a DC! DC converter is a very difficult task that should be attempted only in a controlled laboratory test environment due to extraneous noise sources. Figure 2 illustrates two recommended methods for testing output voltage ripple and noise. Reflected input current ripple and noise should be measured with a high performance current probe. Measuring input current and noise into a "known" impedance with a voltage probe' should be avoided. APPLICATION NOTES PRESERVING ISOLATION CHARACTERISTICS If intrinsic safety is required, care should be taken in the layout and assembly of the printed wiring board (PWB) to avoid degrading the isolation barrier of the PWR51OX. Precautionary measures include cleaning the 510X prior to installing the PWR510X to prevent trapping contaminates under the unit. Use nonconductive spacers to keep the PWR510X off the PWB. Use epoxy solder mask to isolate PWB conductive traces which must run under or close to the PWR51OX. In the layout of the PWB, avoid placing PWB traces under the unit. Do not use conductive inks on the PWB under the \lnit; e,g., inks used in inspection stamps or component identification marking. ~ / OUTPUT POWER DISTRIBUTION To Scope Grounded Probe Tip Figure I shows the recommended method of connecting multiple loads to the PWR510X. Single-point power distribution prevents ground loops and interaction between parallel load circuits. a. Preferred Method b. Alternate Method FIGURE 2. Recommended Noise Measurement Methods. DC/DC Converter FIGURE I. Recommended Power Distribution. 250 SDM862 SDM863 BURR-BROWN® 113131 16 Single Ended I 8 Differential Input 12-81T DATA ACQUISITION SYSTEMS FEATURES DESCRIPTION • COMPLETE 12-BIT DATA ACQUISITION SYSTEM IN A MINIATURE PACKAGE _. __ .. . ....... -"" ,,'""'. ,." The SDM862 and SDM863 are coinplete data acquisition systems housed in a hermetically sealed 1" square leadless chip c~rrier or 8. 1.\" 5'111~re !1in grid array. Tlie small package outlines and low power consumption provide an ideal data acquisition solution where space is at a premium. -_ " ~.-- -. --_ ..... ... .Nru. ""NUCi) i)CI.CII.KDI.': run U",.-uum • • • • • o OR BIPOLAR OPERATION THROUGHPUT RATES B-BIT ACCURACY - 45KHz 12-BIT ACCURACY - 33KHz SELECTABLE GAINS OF 1. 10 and 100 FULL MICROPROCESSOR COMPATIBLE INTERFACE GUARANTEED NO MISSING CODES OVER TEMPERATURE SURFACE MOUNT OR PIN GRID ARRAY PACKAGE OPTIONS FULL SPECIFICATION OVER 3 TEMPERATURE RANGES oto +70°C -25 to +85°C -55 to +125°C. The devices comprise of an input multiplexer (SDM862 16 single-ended inputs. SDM863 8 differential inputs). instrumentation amplifier with selectable gains. samplel hold amplifier and AID converter with microprocessor interface and 3-state buffers. The SDM862 and SDM863 will accept unipolar or bipolar voltage inputs in the range 0 to + 1OV. ± 5V and ± IOV. For low level signals jumper-selectable gains of 10 or 100 can be applied. The number of input channels can be expanded by the addition of multiplexers. The microprocessor interface and the facility of the samplelhold amplifier being controlled directly by the AID converter simplifies system integration. a: g 0 X ::> ::; N <0 0.. f- ::; a. f- ::> « .. f- ::> ::> 0 !!: '"' <0 ff- t; ZW 0.. Ul !!: Ul i§ zw ::> a. U ~ .. 13 ::>f0 x 9 0 in J: i§ f- ::> 0 f- ff- ::> W ~£;5 W U.W zC!l oUU « a: S~~ OWW . ~~~ f- ::> !!: ~o~ " " Ul Ul 16 SINGLE ENDED DIGITAL DATA OUTPUTS "-r-"'" W ~~@ zz-' z - @@@@ PIN 1 IDENT Terminations: Gold plated KOVAR. Case: Black ceramic with gold plated nickel lid. Hermeticity: Gross leak test. Weight: 9 grms (0.320z) B 0~@@)@®®®®®® r 00 "C t PC/XT/AT or compatible ,into an easy-touse DSP workstation, even for the nonexpert. DSPlay Software features a menu-driven interface with pull-up lists to process, analyze, and display real-world signals. Built-in editor functions make program developme,nt and modification simple; and, the package utilizes a concept familiar to the user for program development-the block diagram approach. DSPlay XL is slated for introduction in the fourth quarter of 1987. For more information about DSPlay products, contact the factory at 602-741-1155 or write DSP Marketing, Burr-Brown Corporation, 6550 S. Bay Colony, Tucson, AZ 85706. DSPlay"', DSPlay XL'·, Burr-Brown Corp.; IBMS IBM Corp. STD BUS INDUSTRIAL I/O PRODUCTS The Burr-Brown STD Bus products provide the most cost-effective tool for solving the application-oriented problems of process control and system integration. The modularity and simplicity offered by this well-defined standard have led to the development of a complete line of STD Bus products. The line includes a disk controller and operating system, a Z80 CPU with onboard DMA, vari,ous memory boards, a 32-channel 12-bit A/D converter, two , CRT controllers, an I EEE-488 interface card, and two types of discrete I/O cards. 260 Burr-Brown Data Communications products provide the most cost-effective tool for solving the local data communications problems for industrial and institutional iacilities. shake. It features 1000V isolation and surge protection. Fiber optic modems offer the maximum in isolation and EMI/RFI immunity. The LDMBO is signal powered from RS-232 ports and transmits up to 3.5km at 19.2k bits per second. The LDMa5 is a unique mUltipoint-capable modem with data rates to 5M bits per second. Limited Distance and Fiber Optic Modems provide extension of RS-232 ports up to several miles. In addition, electrical isolation for wire units is provided by transformers and optical couplers, eliminating ground loops, equipment damage, and noise pickup. Surge suppression devices are internally mounted on all field inputs and outputs. The LDM422 serves as a Limited Distance Modem and as an RS-232-to-RS-422 converter with multipoint capability. It has two complete high speed transmit and receive channels for data and hand- Other products include: o LDM35-Signal-Powered Limited-Distance Modem o LDM70-High Speed Ruggedized Industrial Modem o APA120-Personal-Computer-Based Protocol . Analyzer. 261 NORTH AMERICAN SALES DIRECTORY For Component Products BURR-BROWN OFFICES AND SALES REPRESENTATIVES ALABAMA Rep, Inc. .205-881-9270 Huntsville, AL IOWA Rep Associates Corporation 319-373-0152 Marion, IA NEVADA (Southern) Burr-Brown Corporation 818-991-8544 Agoura, CA ALASKA Burr-Brown Corporation 206-455-2611 Bellevue, WA KANSAS BC Electronic Sales, Inc. 913-342-1211 Kansas City, KS 316-722-0104 Wichita, KS NEW HAMPSHIRE Burr-Brown Corporation 617-273-9022 Burlington, MA ARIZONA Burr-Brown Corporation 602-746-1111 Tucson, AZ ARKANSAS Burr-Brown Corporation 214-681-5781 Garland, TX CALIFORNIA (Northern) Burr-Brown Corporation 408-559-8600 San Jose, CA CALIFORNIA (Southern) Burr-Brown Corporation 818-991-8544 Agoura, CA 805-496-7581 Agoura, CA 714-835-0712 Santa Ana, CA KENTUCKY Burr-Brown Corporation 513-891-4711 Cincinnati, OH LOUISIANA (Northern) Burr-Brown Corporation 214-681-5781 Garland, TX LOUISIANA (Southern) Burr-Brown Corporation 713-988-6546 Houston, TX MAINE Burr-Brown Corporation 617-273-9022 Burlington, MA CANADA Allan Craw10rd Associates 416-890-2010 Mississauga, ONT MARYLAND Marktron, Inc. 301-628-1111 Hunt Valley, MD 301-251-8990 Rockville, MD COLORADO Burr-Brown Corporation 303-663-4440 Loveland, CO MASSACHUSETTS Burr-Brown Corporation 617-273-9022 Burlington, MA CONNECTICUT Burr-Brown Corporation 914-964-5252 Yonkers, NY MICHIGAN Burr-Brown Corporation 313-474-6533 Farmington, MI DELAWARE OED Electronics, Inc. 215-643-9200 Spring House, PA MINNESOTA FLORIDA Burr-Brown Corporation 305-740-7900 Orlando, FL 305-586-7162 Palm Beach, FL GEORGIA Rep, Inc. 404-938-4358 Atlanta, GA HAWAII Burr-Brown Corporation 818-991-8544 Agoura, CA IDAHO Burr-Brown Corporation 206-455-2611 Bellevue, WA ILLINOIS Burr-Brown Corporation 312-832-6520 Addison, IL INDIANA Burr-Brown Corporation 513-891-4711 Cincinnati, OH Electronic.~ales Agency, Inc. 612-884-8291 Bloomington, MN MISSISSIPPI Rep, Inc. 404-938-4358 Atlanta, GA MISSOURI BC Electronic Sales, Inc. 314-521-6683 SI. Louis, MO MONTANA Aspen Sales, Inc. 801-467-240tSalt Lake City, UT NEBRASKA BC Electronic Sales, Inc. 913-342-1211 Kansas City, KS NEVADA (Noi1hern) Burr-Brown Corporation 408-559-8600 San Jose, CA NEW JERSEY Burr-Brown Corporation 914-964-5252 Yonkers, NY NEW MEXICO Thorson Desert States, Inc.· 505-293-8555 Albuquerque, NM NEW YORK (Metro Area) Burr-Brown Corporation 914-964-5252 Yonkers, NY NEW YORK Advanced Components Corp. 315-853-6438 Clinton, NY 607-785-3191 Endicott, NY 315-699-2671 N, Syracuse, NY 716-544-7017 Rochester, NY 716-889-1429 Scottsville, NY NORTH CAROLINA Murcota Corporation 919-722-9445 WlnstonSalem, NC NORTH DAKOTA Electronic Sales Agency, Inc. 612-884-8291 Bloomington, MN OHIO Burr-Brown Corporation 513-891-4711 Cincinnati, OH OHIO (Northeastern) K-T/DEPCO Marketing, Inc. 216-442-6200 Cleveland, OH OKLAHOMA Burr-Brown Corporation 214-681-5781 Garland, TX OREGON Burr-Brown Corporation . 206-455-2611 Bellevue, WA PENNSYLVANIA (Eastern) OED Electronics, Inc. 215-643-9200 Spring House, PA PENNSYLVANIA (Western) K-T/DEPCO Marketing, Inc. 412-367-1011 Pittsburgh, PA SOUTH CAROLINA MUrCota Corporation 919-722-9445 WinstonSalem,NC SOUTH DAKOTA Electronic Sales Agency, Inc. 612-884-8291 Bloomington, MN TENNESSEE Rep, Inc. 615-475-4105 Jefferson City, TN TEXAS (Northern) Burr-Brown Corporation 214-681-5781 Garland, TX TEXAS (Southern) Burr-Brown Corporation 713-988-6546 Houston, TX TEXAS (EI Paso) Thorson Desert States, Inc,· 505-293-8555 Albuquerque, NM UTAH Aspen Sales, Inc. 801-467-2401 Salt Lake City, UT VERMONT Burr-Brown Corporation 617-273-9022 Burlington, MA VIRGINIA Marktron, Inc. 301-251-8990 Rockville, MD WASHINGTON Burr-Brown Corporation 206-455-2611 Bellevue, WA WASHINGTON,D,C. Marktron, Inc. 301-251-8990 Rockville, MD WEST VIRGINIA Burr-Brown Corporation 513-891-4711 Cincinnati, OH WISCONSIN (Eastern) Burr-Brown Corporation 312-832-6520 Addison, IL WISCONSIN (Western) Electronic Sales Agency, Inc. 612-884-8291 Bloomington, MN WYOMING Aspen Sales, Inc. 801-467-2401 Salt Lake City, UT RHODE ISLAND Burr-Brown Corporation 617-273-9022 Burlington, MA • Microcircuits only. BURR-BROWNiI!J BURR-BROWN CORPORATION IElElI CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity disoounts available. Prices in U.S. dollars MODEL 0100M5 0145MC 0546 0548MC 0700 0700M 0700U 0700UH 0710 0722 07228G 0722MG 0724 0803H5 0803HC 0804H5 0805H5 0807H5 2014HC 2020HC 2026MC 2302HC 2350HC 2525HC 3291/14 ,3292/14 3293/14 3329/03 3354/25 3355/25 3356/25 3450 3451 3452 3500A 35008 3500C 3500E 3500HP 3500R 3500R/8838 3500RQ 35005 35005Q 3500T • 3500TQ Page No.1 P.O. BOX 11400· Tucson, Arizona 85734 Telephone: (602) 746-1111 • TWX: 910·952-1111 • Telex: 66·6491 FOOT NOIE 1-24 14.98 5.21 25-99 100-249 12.74 4.43 10.34 3.78 W4.00 ~.OO %.00 28.00 27.00 26.00 50.00 ~.OO %.00 53.00 44.00 51.00 43.00 49.00 41.00 60.00 ~.OO ~.OO 121.00 52.96 67.59 60.ro 73.85 4.20 5.75 5.61 25.25 1.54 17.00 9.00 117.00 40.77 53.14 112.00 36.23 47.09 ~.ro ~.~ 56.86 3.24 4.43 4.32 19.44 1.19 14.00 7.00 50.98 2.84 4.04 3.94 ~.OO ~.OO H.OO 9.00 14.00 8.60 13.50 8.20 13.00 1.00 11.00 6.00 28.00 n.oo ".00 1n.00 125.00 125.00' 43.23 165.00 133.00 125.00 280.00 228.00 240.00 11..54 19.71 25.14 40.60 40.60 23.80 120.00 120.00 120.00 35.64 159.00 128.00 120.00 269.00 219.00 230.00 8.80 15.61 20.14 30.24 30.24 17.93 1~.00 115.00 115.00 25.20 152.00 123.00 115.00 258.00 210.00 221.00 6.72 11.39 14.91 23.36 23.36 13.13 ~.OO ~.OO ~.OO ~.~ n.oo W.OO 36.96 52.48 59.64 82.72 27.27 38.72 44.28 62.87 22.26 31.60 35.28 50.40 IiODEL 3500U/8838 35015 3507J 3507JQ 3508J 3510AM 35108H 3510CH 35105H 3510VM/8838 3521H 3521J 3S21.J() 3521K 3521L 3521R 3521RQ 3522J 3522K 3522L 35225 35225Q 3523J 3523JQ 3523K 3523L 3523LQ 3527AH 3527AMQ 35278M 35278MQ 3527CH 3528AM. 3528AMQ 35288M 35288HQ 3528CH 3528CMQ 3550J 3550K 35505 35505Q 3551J 35515 35515Q 3553AM FOOT NOfE 1-24 30.00 28.56 13.05 19.43 11.48 10.47 13.27 20.44 20.44 70.00 27.65 39.50 52.00 59.30 83.50 97.00 137.75 20.60 27.00 37.78 53.40 71.15 38.50 50.75 45.80 54.90 73.85 18.20 24.42 24.36 29.96 37.13 22.68 30.30 27.83 36.96 33.88 45.86 34.94 44.52 64.74 87.36 35.62 62.89 78.40 40.32 Effective June 1, 1987 25-99 26.00 22.41 10.42 15.07 8.91 8.10 10.15 15.39 15.39 60.00 21.65 28.80 38.55 43.20 61.45 76.50 105.65 16.00 21.55 28.10 ·41.50 57.80 29.20 4'1.20 36.00 42.00 60.65 13.72 18.52 17.82 23.81 28.89 17.12 23.27 20.90 28.03 26.08 36.34 27.00 33.75 50.60 69.66 27.27 49.95 64.80 31.21 100-249 24.00 17.80 8.72 12.97 7.77 6.25 7.82 12.18 12.18 50.00 16.49 22.31 30.87 35.96 49.35 58.49 86.78 12.34 16.80 22.16 31.34 45.83 22.73 33.08 28.93 33.39 51.40 11.50 15.59 15.38 20.21 24.47 13.60 18.32 18.43 24.78 23.00 30.45 22.52 26.78 37.49 53.55 22.52 37.49 51.45 23.57 Page No.2 CUSTOMER PRICE LlST--COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars MODEL 3553AMQ 3554AM 3554AMQ 3554BM 3554BMQ 35545M 35545MQ 3571AM 3571AMQ 3572AM 3572AMQ 3573AM 3573AMQ 3580J 3580JQ 3581J 3582J 3582JQ 3583AM 3583AMQ 3583JM 3584JM 3584JMQ 3606AG 3606BG 3627AM 3627AMQ 3627BM 3627BMQ 3650HG 3650JG 3650KG 3650MG 3652HG 3652JG 3652MG 3656AG 3656BG 3656HG 3656JG 3656KG 4025MC 4085BM 4085KG 40855M 4115/04 FOOT NOfE 1-24 25-99 63.84 77.35 95.50 88.85 111.30 105.00 145.60 81.14 109.76 92.96 125.44 40.32 54.88 65.72 94.35 99.05 107.60 143.00 106.00 148.40 97.85 100.00 136.75 117.60 153.44 14.00 28.00 18.76 36.40 63.00 54.00 60.00 76.96 73.50 93.60 88.00 118.80 58.32 85.32 69.12 99.36 28.62 42.12 49.40 72.30 72.65 90.90 123.75 88.40 122.75 83.20 75.40 113.35 102.60 136.62 10.64 17 .55 13.61 21.60 46.22 100-249 46.20 50.09 68.25 58.96 80.85 73.50 99.23 50.40 72.45 57.23 '81.90 26.25 36.75 42.25 60.75 62.85 73.15 107.15 72.10 106.10 66.95 67.45 100.95 91.35 .119.54 9.61 14.18 11.81 17 .59 35.44 ~.93 ~.% ~." 99.57 56.45 81.93 99.57 64.12 96.71 119.56 81.38 39.53 61.94 75.28 51.03 74.52 92.18 68.25 33.60 49.04 67.20 44.94 60.74 81.74 85.W ~.88 ~.~ 91.06 111.94 39.00 91.84 79.52 115.36 74.26 70.20 86.35 32.00 79.38 65.50 102.06 56.70 57.23 70.30 26.00 61.95 51.98 79.28 51.19 MODEL 4127 JG 4127KG 4203J 4203K 42035 420350 4204J 4204K 42045 420450 4205J 4205K 42055 4205S0 4206J 4206K 4213AL 4213AL-BS 4213AL-BSSI 4213AL-B5S2 4213AL-B5S3 4213AL-BS54 4213AM 4213AM-B5 4213AM- BSS 1 4213AM-BSS2 4213AM-BSS3 4213AM-B5S4 4213AMQ 4213BL 4213BL-BS 4213BL-B5S1 4213BL-B5S2 4213BL-BSS3 4213BL-BSS4 4213BM 4213BM-BS 4213BM-85S1 4213BM-B552 4213BM- BSS3 4213BM- B5S4 42135L . 4213SL-BS 42135L-BS51 42135L-BSS2 42135L-BSS3 FOOT NOfE 1-24 56.84 65.46 43.50 59.58 92.40 122.40 76.16 99.40 113.12 150.08 35.78 52.08 74.42 98.95 54.26 77.06 34.20 34.20 112.86 44.46 39.33 37.62 31.15 31.15 104.61 40.50 35.82 34.27 38.90 48.40 48.40 159.72 62.92 55.66 53.24 45.05 45.05 151.47 58.57 51.81 49.56 61.90 61.90 204.27 80.47 71.19 Effective June 1, 1987 25-99 42.55 53.41 29.15 47.90 66.10 91.85 64.75 85.91 101.52 139.32 28.08 40.88 56.16 77.60 43.15 61.18 27.10 27.10 89.43 35.23 31.17 29.81 24.40 24.40 81.18 31.72 28.06 26.84 31.85 37.50 37.50 123.75 48.75 43.13 41.25 34.75 34.75 115.50 45.18 39.96 38.23 51.75 51.75 170.78 67.28 59.51 100-249 36.12 46.10 21.55 38.30 58.30 81.40 53.55 67.73 86.10 121.80 20.95 31.76 42.00 59.48 31. 76 44.36 21.95 21.95 72.44 28.54 25.24 24.15 19.50 19.50 64.19 25.35 22.43 21.45 26.25 31.65 31.65 104.45 41.15 36.40 34.82 29.15 29.15 96.20 37.90 33.52 32.07 41.40 41.40 136.62 53.82 47.61 CUSTOMER PRICE LIST-COMPONENT PRODUCTS Quantity discounts available. F.O.B. Tucson, Arizona Prices in U.S. dollars MODEL 4213Sl-BSS4 4213SM 4213SM-BS 4213SM-BSSI 4213SM-BSS2 4213SM-BSS3 4213SM-BSS4 4213UM 4213UM/883B 4213VM 4213VM/883B 4213WM 42!3HM/8838 4214AP 4214BP 4214RM 4214SM 4302 4340 4341 4423 8300201XC AD515JH AD515Jl AD515KH AD515Kl AD515lH AD515ll ADC10HT ADC574AJH ADC574AKH ADC574ASH ADC574ATH ADC600B ADC600K ADC674AJH ADC674AKH ADC674ASH ADC674ATH ADC71JG ADC71KG ADC72AM ADC72BM ADC72JM ADC72KM ADC76AM FOOT NOTE 1-24 25-99 100-249 68.09 56.93 45.54 ~.~ ~.M ~.~ MODrl ~.OO ~.OO ~.OO ADC76BM ADC76JG ADC76JM ADC76KG ADC76KM ADC803BM ADC803BMQ ADC803CM ADC803CMQ ADC803SM ADC803SMQ ADC804BH 75.00 62.00 48.00 .l'DC8048HQ ~.~ ~.80 ~.90 196.02 75.79 62.04 64.13 31.00 43.00 45.00 60.49 162.53 63.44 56.12 53.68 26.00 37.00 39.00 38.00 128.37 50.57 44.74 42.79 23.00 29.00 31.00 35.00 28.28 22.95 17.64 41.94 33.70 28.35 34.16 26.95 24.52 55.33 45.36 38.59 58.86 42.88 33.76 108.90 79.95 70.65 32.70 25.97 18.85 27.10 17.48 21.06 170.00 163.00 155.00 14.31 9.98 19.04 19.50 15.75 12.00 25.48 19.71 14.54 20.75 16.35 25.25 24.30 18.90 31.36 30.50 25.00 20.50 477.75 414.75 577.50 45.00 36.00 30.00 59.00 47.20 39.50 124.00 99.00 91.35 177.00141.00118.50 2375.00 2090.00 1695.00 1495.00 58.50 46.75 39.25 75.00 60.00 50.25 158.00 126.00 106.00 228.00 182.00 153.00 98.70 86.10 66.15 107.10 81.90 122.85 156.45 239.40 203.70 298.20 254.10 195.30 199.50 170.10 131.25 249.90 212.10 162.75 281.40 224.70 193.20 ADC804SH ADC804SHQ ADC80AG-l0 ADC80AG-12 ADC80AG-12Q ADC80AGZ-12 ADC80H-AH-12 ADC80H-AH-12Q ADC80KD ADC80MAH" 12 ADC80MAH-12/QM ADC82AG ADC82AM ADC82AMQ ADC84KG-l0 ADC84KG-12 ADC85-10 ADC85-12 ADC85H-12 ADC85HQ-12 ADC87 ADC87/883B ADC87H-12 ADC87HQ-12 ADC87U ADC87U/883B ADC87V ADC87V /883B DAC10HT DACI200KP-V DACI201KP-V DACI600JP-V DACI600KP-V FOOT flOlE Page No.3 Effective June 1, 1987 1-24 25-99 330.75 156.45 193.20 179.55 242.55 2E.OO 321. 00 292.00 369.00 382.00 502.00 66.15 102.90 124.95 156.45 83.48 85.05 110.25 B5.05 85.05 110.25 264.60 135.45 154.35 153.30 194.25 226.80 103.95 132.30 124.95 165.90 1~.OO I~.OO E,O 100-249 256.00 205.00 225.00 180.00 293.00 234.00 304.00 243.00 399.00319.00 47.25 40.95 72.45 57.75 69.30 87.15 109.20 B7.15 66.15 46.20 46.73 67.20 88.20 60.90 67.20 46.73 67.20 46.73 88.20 60.90 33.00 33.00 ~.OO ~.OO ~.OO 67.00 78.75 113.40 153.30 92.40 97.65 158.55 179.55 131.25 163.80 119.00 130.00 173.25 216.30 110.00 121.00 119.00 130.00 355.95 9.50 11.20 15.10 16.70 54.00 54.60 78.75 115.50 73.50 77.70 143.85 144.90 105.00 131.25 102.00 113.00 138.60 173.25 94.00 104.00 102.00 113.00 241.50 9.50 11.20 14.35 15.95 45.00 46.20 66.15 105.00 61.95 65.10 103.95 110.25 88.20 . 110.25 94.00 105.00 115.50 143.85 91.00 96.00 94.00 105.00 178.50 5.95 6.95 8.95 9.95 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Page No.4 Prices in U.S. dollars MOOEl DAC60-10 DAC60-12 DAC63BG DAC63BM DAC63CG DAC63CH DAC63SH DAC63TH DAC700BH DAC700BH/QH DAC700BL DAC700BL/QH DAC700CH DAC700KH DAC700LH DAC700SH DAC700SH/QH DAC700SL DAC700SL/QH DAC70lBH DAC701BH/QH DAC701BL DAC70IBL/QM DAC70lCH DAC70lKH DAClOILH DAClOISH DAClOISH/QH DAClOlSL DAClO(SL/QH DAC702BH DAC702BH/QH DACl02BL OAC702BL/QH DAC702CH OACl02JP DAC702KH DAC702KP OAC702LH DAC702SH DAC702SH/QH DAC702SL DAC702SL/QH DAC703BH OAC703BH/QH OAC703BL FOOT NOfE 1-24 25-99 100-249 I~.OO IU.OO le.oo 165.00 159.00 152.00 121.80 97.65 91.35 117.60 107.10 141.75 137.55109.20101.85 160.65 131.25 117.60 192.15 252.00 210.00 276.15 234.15 212.10 n.H u.~ Q.% 73.50 95.55 109.20 88.20 48.30 71.40 55.65 72.45 82.95 67.20 36.75 54.60 47.25 61.95 71.40 56.70 30.45 46.20 ~.Q ~.~ ~.M 107.10 154.35 177 .45 60.90 73.50 95.55 109.20 00.20 80.85 122.85 140.70 68.25 103.95 119.70 48.~ Q.% 55.65 72.45 82.95 67.W 47.25 61.95 71.40 48.~ 36.~ ~.~ 71.40 92.40 107.10 154.35 177.45 54.60 70.35 80.85 122.85 140.70 46.20 58.80 68.25 103.95 119.70 n.H 48.~ Q.% 73.50 95.55 109.20 00.20 23.10 48.30 25.20 71.40 92.40 107.10 154.35 177 .45 55.65 72.45 82.95 67.20 19.58 36.75 21.95 54.60 70.35 80.85 122.85 140.70 47.25 61.95 71.40 56.70 17.85 30.45 19.95 46.20 58.80 68.25 103.95 119.70 n.H 48.~ Q.% 73.50 95.55 55.65 72.45 47.25 61.95 ~.ro MODEL DACl03BL/QM DAC703CH DAC703JP DAC703KH OAC703KP OAC703LH OAC703SH OAC 703SH/QM OAC703SL DAC703SL/QM OACl03VG OAC703VG/883B OAC703VL OAC703VL/883B OAC705BH OAGO 5BH / QH OACl05KH OAC705SH OACl05SH/QM OAC706BH DAC706BH/QH DAC706KH DAC706SH DACl06SH/QH OAC707BH DAC707BH/QH DAC707JP DAC707KH DAC707KP DAC707SH DAC707SH/QM DAC708BH DAC708BH/QH DAC708KH DAC708SH DAC708SH/QM DAC709BH DAC709BH/QM DAC709KH DAC709SH DAC709SH/QM DAC 70BH-COB- I DAC70BH-CSB- I DAC71-CCD-I DAC 7l-CCD- V DAC71-COB-I FOOT NOTE 1-24 109.20 88.20 23.10 48.30 25.20 71.40 Effective June 1, 1987 25-99 82.95 67.20 19.58 36.75 22.03 54.60 100-249 71.40 56.70 17.85 30.45 19.95 46.20 ~.Q ro.~ ~.M 107.10 154.35 177.45 102.00 118.50 143.50 165.50 76.65 88.20 66.15 99.75 114.45 80.85 122.85 140.70 77.00 89.00 108.00 125.00 72.45 82.95 53.55 97.65 108.15 68.25 103.95 U9.70 64.50 75.00 90.00 105.00 56.70 65.10 46.20 77.17 89.30 ~.e 72.~ ~.~ 88.8 66.15 99.75 114.45 76.65 88.W 27.30 66.15 32.55 99.75 114.45 76.65 88.20 66.15 99.75 114.45 76.65 88.20 66.15 99.75 114.45 150.15 150.15 67.10 70.40 56.70 ~.% ~.~ 53.55 93.45 108.15 72.45 48.51 77.17 89.30 59.54 ~.95 e.w 21.53 53.55 25.73 93.45 108.15 72.45 82.95 53.55 93.45 108.15 72 • 45 82.95 53.55 93.45 108.15 113.40 113.40 52.80 57.20 44.10 18.3.7 46.20 22.05 73.50 85.05 56.70 65.10 46.20 73.50 85.05 56.70 65.10 46.20 73.50 85.05 94.50 94.50 46.20. 52.80 38.85 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity dis(X)unfs available. Prices in U.S. dollars HODEL FOOT 1-24 25-99 100-249 DAC7541AAH OAC7541AAH/QM OAC7541ABH OAC7541ABH/QH DAC7541AJP OAC7541AJU OAC7541AKP OAC7541AKU OAC7541ASH OAC7541ASH/QM OAC7541ATH OAC7541ATH/QM DAC7700KD DAC7701KO OAC80-CBI-1 OAC80-CBI-V OAC80-CCO-1 DAC80-CCD-V OAC800-CBI- I DAC800-CBI-V DAC800P-CBI - I DAC800P-CBI-V OAC80KD-1 DAC80KD-V DAC80P-CBI-1 DAC80P-CBI-V DAC80Z-CBI-I DAC80Z-CBI-V DAC811AH DAC811AH/QM DAC811Al OAC811Al/QH DAC811BH FOOT 1-24 25-99 35.75 37.00 46.50 28.25 29.25 37.00 . 15.25 14.90 16.40 19.80 21.20 63.00 73.00 82.00 95.00 100-249 NorE NorE OAC71-COB-V DAC71-CSB-1 DAC71-CSB-V DAC710KH DAC711KH OAC72BH-COB-1 OAC72BH-COB-V OAC72BH-CSB-1 OAC72BH-CSB-V OAC736J OAC736K OAC73J MODEL Page No.5 Effective June 1, 1987 59.85 56.70 59.85 42.00 42.00 87.15 90.30 87.15 90.30 375.00 415.00 373.00 47.25 44.10 47.25 35.70 35.70 66.15 70.14 66.15 69.30 360.00 399.00 35B.00 40.95 3B.B5 40.95 30.45 30.45 53.55 55.65 53.55 55.65 345.00 3B2.00 344.00 "tJ.c..uv ... ,., nn 395.00 3no.CO 13.10 16.20 14.45 17.90 11.80 14.15 13.10 15.70 . 38.35 57.00 44.75 66.50 10.75 12.70 11.85 14.10 9.70 11.65 10.75 12.90 31.35 44.70 36.60 52.20 25.20 25.20 18.25 19.00 37.50 38.00 19.95 24.15 17.01 22.05 15.25 15.25 16.00 16.37 18.25 19.00 18.35 23.00 23.25 29.25 22.50 7.95 9.30 8.75 10.20 7.15 B.55 7.95 9.55 23.25 32.60 27.10 38.00 IB.37 18.37 15.25 16.00 25.00 26.00 15.75 IB.90 14.33 16.80 9.60 9.60 13.25 14.00 15.25 16.00 14.90 18.75 19.40 24.25 IB.90 E E 23.00 24.00 42.00 42.50 24.15 28.87 21.26. 26.25 20.00 21.00 23.00 24.00 23.25 29.15 29.25 36.75 28.50 DAC811BH/QM DAC811Bl OAC811Bl/QH DAC811JO DAC811JP OAC811 JU DAC811KP DAC811KU OAC811 RH DAC811RH/QM DACBllRl OAC811Rl/QM !)l'.C81!SH OAC811SH/QH DAC811Sl DAC811Sl/QM OAC812BH DAC812CM DAC82KG OACB50-CB I-I DAC850-CBI-I/QH OAC850-CBI-V DAC850-CBI-V/QH DAC850Bl-I OAC850Bl-I/QM DAC850Bl-V DAC850Bl-V/QH DAC851-CBI-1 OAC851-CBI-I/QM OAC851-CBI-V OAC851-CBI -v /QH DAC851Sl-1 OACB51Sl-I/QH DAC851Sl-V DAC851Sl-V/QH DAC85H-CBI-1 OAC85H-CBI- I /QH OAC85H-CBI-V OAC85H-CBI-V/QM DAC87-CBI-I J DAC87-CBI-I/B J,+ OAC87-CBI-V OAC87-CBI-V/B OAC870U OAC870U/883B OAC870Ul 130.00 106.00 150.00 169.00 195.00 137.55 IB3.75 40.95 38.12 47.36 40.43 50.82 49.35 62.37 53.03 66.99 56.59 65.20 61.21 70.36 74.03 85.?8 79.80 91.35 36.23 44.10 37.80 46.20 122.00 138.00 159.00 126.00 139.65 28.35 27.30 34.12 29.40 36.75 35.70 45.15 37.80 47.25 40.95 47.25 44.62 51.45 53.55 61.95 58.80 67.20 28.87 35.18 30.45 35.18 23.75 24.60 31.00 9.60 11.90 13.50 15.85 17.20 53.00 61.00 69.00 80.00 86.00 99.00 112.00 129.00 96.60 127.05 24.15 23.10 28.87 . 24.68 30.98 30.45 38.33 32.02 40.43 34.65 39.90 37.27 43.05 45.15 51.98 48.30 55.65 25.20 30.98 26.25 32.02 98.00 105.00 45.00 65.00 50.00 78.50 85.00 40.00 60.00 45.00 70.50 76.50 35.00 55.00 40.00 IB.60 20.50 24.75 26.50 79.00 91.00 103.00 119.00 Page No.6 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars MODEL FOOT 1-24 25-99 70.00 80.00 100.00 85.00 105.00 82.95 100.80 65.00 75.00 95.00 80.00 100.00 66.15 80.85 60.00 67.00 80.00 72.00 90.00 57.75 70.35 58.00 61.00 25.30 35.07 75.00 85.00 33.88 47.32 67.59 48.80 49.50 20.12 28.06 44.00 47.00 16.96 23.46 26.19 39.15 56.11 8.90 13.50 13.00 13.00 42.90 16.90 14.95 14.30 10.50 10.50 34.65 13.65 12.08 11. 55 15.25 15.25 50.33 19.83 17 .54 16.78 17.00 42.08 22.10 19.55 18.70 17.25 16.30 16.30 19.06 29.14 41.84 4.95 11.00 9.75 9.75 32.18 12.68 11.21 10.73 7.25 7.25 23.93 9.43 8.34 7.98 11.30 11.30 '37.29 14.69 13.00 12.43 16.15 29.04 21.00 18.57 17.77 16.35 15.35 15.35 100-249 MODEL NorE OAC870Ul/883B OAC870V OAC870V 1883B OAC870Vl OAC870Vl/883B DAC87H-CBI-V OAC87H-CBI -v IQM DAC87U-CBI - I J OAC87U-CBI-I/B J,+ OAC87U-CBI - V OAC87U-CBI-V/B DAC90BG OAC90SG DEMI02 KIT DEMI06 KIT DTVIOOHP OIVIOOJP DIVIOOKP INAIOIAD INAIOIAG INAIOIAl INAIOIAl-BS INAIOIAl-BSSI INAIOIAl-B~SS2 lNA10IAl-BSS3 INAIOIAl-BSS4 INAIOIAH INAIOIAM-BS INAIOIAM-BSSI lNAI0IAM-BSS2 INAIOIAf1-BSS3 INAIOIAM-BSS4 lNAlOIBl INAIOIBl-BS· INAIOIBl-BSSI INAIOIBl-BSS2 lNAI0IBl-BSS3 lNAI0IBl-BSS4 INAI0IBM-BS INAIOIBM-BSSI INAIOIBM-BSS2 INAI0IBM-BSS3 INAIOIBM-BSS4 INAIOICG lNAIOICl INAI01Cl-BS 17.95 16:50 16.50 54.45 21.45 18.98 18.15 14.00 14.00 46.20 18.20 16.10 15.40 19.50 19.50 64.35 25.35 22.43 21.45 18.70 56.10 24.31 21. 51 20.57 23.00 20.90 20.90 INAIOICl-BSSI INAIOICl-BSS2 INAIOICl-BSS3 INAIOICl-BSS4 INAIOICM INAI0ICM-BS INAIOICM-BSSI INAI0ICM-BSS2 INAIOICM-BSS3 INAIOICM-BSS4 INAIOIHP INAIOIKU INAIOISG INAI0lSGQ INAIOISl INAIOISl-BS INAIOISl-BSSI INAIOISl-BSS2 INAIOISl-BSS3 INAIOISl-BSS4 INAIOISM INAIOISM-BS INAIOISfl-BSSI INAIOISfl-BSS2 INAIOISM-BSS3 . INAIOISM-BSS4 INAIOISMQ INAIOI VG INAIOIVG/883B INAIOIVM INAIOI VM/883B ,INAI02AD INAI02AG INAI02AL INAI02CG INAI02CL INAI02KP INAI02SL INAI04AM INAI04BM INA104CM INAI04HP INAI04JP INAI04KP INAI04SM INAI05AD FOOT NOTE .I Effective June 1, 1987 1-24 25-99 68.97 27.17 24.04 22.99 20.61 20.61 60.72 26.79 23.70 22.67 7.37 8.29 27.72 39.20 22.00 22.00 72.60 28.60 25.30 24.20 21.84 21.84 64.35 28.39 25.12 24.02 31.36 46.00 49.50 43.75 47.25 53.79 21.19 18.75 17.93 14.90 14.90 45.54 19.37 17.14 16.39 5.67 6.26 19.98 29.16 17.15 17.15 56.60 22.30 19.72 18.87 15.82 15.82 48.35 20.57 18.19 17 .40 22.68 41.60 44.75 39.50 42.50 9.35 11.15 13.65 17.12 18.35 5.95 23.10 20.79 25.11 32.24 16.15 19.39 25.11 34.29 4.65 13.95 16.45 20.61 20.90 7.60 26.40 27.16 32.48 41. 94 21.00 25.20 32.48 44.80 100-249 50.66 19.96 17.65 16.89 13.49 13.49 42.14 17.54 15.51 14.84 5.10 5.51 18.53 26.25 16.45 16.45 54.29 21.39 18.92 18.10 14.65 14.65 46.04 19.05 16.85 16.12 21.00 39.50 42.50 37.50 40.50 5.20 7.95 10.45 II. 92 13.85 5.40 17.25 18.85 22.73 29.24 14.65 17.59 22.73 31. 13 3.50 CUSTOMER PRICE LIST-COMPONENT PRODUCTS Prices in U.S. dollars MODEL INAI05AL INAI05AM I NAI 05AM- BS INAI05AM-BSSI INAI05AM-BSS2 INAI05AM-BSS3 INAI05AM-BSS4 INAI05BL INAI05BM INAI05BM-BS INAI05BM-BSSI INAI05BM-BSS2 INAI05BM-BSS3 INAI05BM-BSS4 INA105KP INAI05KU INAI05SL INAI06AM INAI06BM INAI06KP INA110AD INA110AG INA110AL INA110BG INA110BL INA110KP INAIIOKU INAllOSG INA110SL INA258UG INA258UG/883B INA258UL INA258Ul/883B INA258VG I NA258VG/883B INA25BVL I NA2 58Vl/883B INA258WG INA258WG/883B INA25BWL INA258WL/883B ISOIOOAP ISOIOOBP ISOIOOCP ISOl02 ISOI02B F.O.B. Tucson, Arizona FOOT NOTE 1-24 25-99 100-249 Quantity discounts available. MODEL FOOT 'Page No.7 Effective June 1, 1987 1-24 25-99 100-249 NorE 12.45 9.50 9.50 32.B4 12.35 10.93 10.45 15.25 11.85 11.85 42.08 15.41 13.63 13.04 6.25 7.34 19.10 10.00 12.45 6.50 16.85 19.35 26.43 26.10 7.40 8.74 28.11 27.60 38.15 42.40 41. 35 45.60 49.80 65.70 54.00 74.20 63.60 84.80 69.95 93.30 36.40 39.65 44.24 25.50 34.45 9.95 7.15 7.15 24.59 9.30 8.22 7.87 12.00 8.95 8.95 31. 35 II. 64 10.29 9.85 4.65 5.35 14.85 7.50 9.40 4.89 9.45 12.65 15.15 19.17 20.25 5.80 6.59 20.36 21. 35 36.00 40.30 39.20 43.50 43.45 '58.30 47.70 64.65 55.10 74.20 60.40 81.60 31.05 34.13 39.20 19.50 26.95 8.45 5.75 5.75 19.64 7.48 6.61 6.33 10.15 7.20 7.20 25.25 9.36 8.28 7.92 3.50 3.99 12.45 6.05 7.55 3.65 5.25 8.85 II. 35 12'.97 14.85 5.50 6.09 18.85 20.45 26.50 29.70 28.60 32 ~86 40.30 56.20 44.50 61. 50 51. 95 69.95 56.20 76.30 26.78 30.08 35.28 16.50 22.30 ISOI06 I SOl06B LOGIOOJP MA51414 MP22BG MP32BG MP32CG MPCI6S MPC40 MPC800KG MPC800SG MPC80lKG MPC80lSG MPC8D MPC8S MPYlOOAG MPYlOOAL MPYlOOAL-BS MPYlOOAL-BSSI MPYI OOAL - 8SS2 MPY I OOAL- BSS3 MPYI OOAL -BSS4 MPYlOOAM MPYI OOAM- BS MPYlOOAM-BSSI MPYlOOAM-BSS2 MPYlOOAM-BSS3 MPYI OOAM- BSS4 MPYlOOBG MPYlOOBL MPYI OOBL - BS MPYlOOBL-BSSI MPYlOOBL-BSS2 MPYI OOBL - BSS3 MPYI OOBL - BSS4 MPYlOOBM MPYlOOBM-BS MPYlOOBM-BSSI MPYI OOBM- BSS2 MPY I 00BM-BSS3 MPYlOOBM-BSS4 MPYlOOCG MPYlOOCL MPYlOOCL-BS MPYlOOCL-BSSI MPYlOOCL-BSS2 34.00 45.90 48.16 26.60 35.95 37.80 22.00 29.75 31.50 340.20 340.20 425.25 24.37 13.62 29.25 58.45 15.23 31.50 24.37 13.62 15.51 13.85 13.85 45.71 18.01 15.93 15.24 11.76 11.76 37.46 15.29 13.52 12.94 25.14 20.85 20.85 68.81 27.11 23.98 22.94 19.04 19.04 60.56 24.75 21.90 20.94 37.74 30.50 30.50 100.65 39.65 271.95 271.95 340.20 21.06 11.81 24.21 48.37 12.60 26.07 21.06 11.77 13.94 12.45 12.45 41.09 16.19 14.32 13.70 10.58 10.58 32.84 13.75 12.17 11.64 22.09 18.75 18.75 61.88 24.38 21.56 20.63 16.69 16.69 53.63 21.70 19.19 18.36 33.48 27.35 27.35 90.26 35.56 227.85 227.85 285.60 17.85 9.97 20.18 40.31 10.50 21.72 17.85 9.97 12.26 10.00 10.00 30.00 13.00 11.50 11.00 8.40 8.40 24.75 10.92 9.66 9.24 17.22 14.15 14.15 46.70 18.40 16.27 15.57 12.23 12.23 38.45 15.90 14.06 13.45 27.56 23.00 23.00 75.90 29.90 Page No.8 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars MODEL FOOT 1-24 25-99 100-249 MODEL NOTE MPYlOOCL-BSS3 MPYlOOCL-BSS4 MPYlOOCM MPYlOOCM-BS MPYlOOCM-BSSI MPYlOOCM-BSS2 MPYlOOCM-BSS3 MPYlOOCM-BSS4 MPYlOOSG MPYlOOSGQ MPYlOOSL MPYlOOSL-BS MPYlOOSL-BSSI MPYlOOSL-BSS2 MPYlOOSL-BSS3 MPYlOOSL-BSS4 MPYlOOSM MPYlOOSM-BS MPYlOOSM-BSSI MPYlOOSM-BSS2 MPYlOOSM-BSS3 MPYlOOSM-BSS4 MPYlOOSMQ MPY534AD MPY534JD MPY534JH MPY534JH-BS MPY534JH-BSSI MPY534JH- BSS2 MPY534JH-BSS3 MPY534JH-BSS4 MPY534JL MPY534JL-BS MPY534JL-BSSI MPY534JL-BSS2 MPY534JL-BSS3 MPY534JL - BSS4 MPY534KD MPY534KH MPY534KH-BS . MPY534KH-BSSI MPY534KH-BSS2 MPY534KH-BSS3 MPY534KH- BSS4 MPY534KL MPY534KL-BS roOT Effective June 1, 1987 1-24 25-99 122.10 48.10 42.55 40.70 70.45 57.23 57.23 168.14 74.40 65.81 62.95 53.45 53.45 176.39 69.49 61.47 58.80 89.50 76.41 76.41 224.24 99.33 87.87 84.05 70.45 70.45 232.49 91. 59 81.02 77 .50 107.40 91.80 91.80 317.39 119.34 105.57 100.98 98.68 98.68 325.64 128.28 113.48 108.55 20.00 20.00 66.00 98.51 38.81 34.33 32.84 58.23 47.14 47.14 131.84 61.28 54.21 51.85 42.45 42.45 140.09 55.19 48.82 46.70 74.28 62.95 62.95 176.06 81.84 72.39 69.25 55.85 55.85 184.31 72.61 64.23 61.44 89.50 76.50 76.50 252.45 99.45 87.98 84.15 79.00 79.00 260.70 102.70 90.85 86.90 16.35 16.35 53.95 100-249 NOTE 35.08 33.55 28.56 28.56 92.40 37.13 32.84 31.42 56.62 77 .28 44.50 44.50 146.85 57.85 51.18 48.95 42.84 42.84 138.60 55.69 49.27 47.12 58.24 32.98 25.37 25.37 74.42 32.98 29.18 27.91 25.05 25.05 82.67 32.57 28.81 27.56 47.14 38.76 38.76 113.85 50.39 44.57 42.64 37.00 37.00 31.45 30.09 25.33 25.30 82.01 32.89 29.10 27.83 50.22 67.50 39.45 39.45 130.19 51.29 45.37 43.40 38.02 38.02 121.94 49.43 43.72 41.&2 51.30 12.57 27.67 21.18 21.18 59.23 27.53 24.36 23.30 20.45 20.45 67.49 26.59 23.52 22.50 39.94 32.27 32.27 90.26 41. 95 37.11 35.50 29.85 29.85 26.45 25.30 20.95 20:95 67.65 27.24 24.09 23.05 33.60 48.83 30.50 30.50 100.65 39.65 35.08 33.55 28.61 28.61 92.40 37.19 32.90 31.47 43.05 9.38 19.77 15.16 15.16 42.41 19.71 17.43 16.68 15.35 15.35 50.66 19.96 17 ;65 16.89 29.09 23.42 23.42 65.51 30.45 26.93 25.76 22.35 22.35 MPY534KL-8SS1 MPY534KL-8SS2 MPY534KL-BSS3 MPY534KL-BSS4 MPY534LD MPY534LH MPY534LH-BS MPY534LH-BSS1 MPY534LH-BSS2 MPY534LH-BSS3 MPY534LH-BSS4 MPY534LL MPY534LL-BS MPY534LL-BSSI MPY534LL-BSS2 MPY534LL-BSS3 MPY534LL-BSS4 MPY534SD MPY534SH MPY534SH-BS MPY534SH-BSS1 MPY534SH-BSS2 MPY534SH-BSS3 HPY534SH-BSS4 MPY534SL MPY534SL-BS MPY534SL-BSSI MPY534SL-BSS2 MPY534SL-BSS3 MPY534SL - BSS4 MPY534TD MPY534TH MPY534TH-BS MPY534 TH-BSS 1 HPY534TH-BSS2 HPY534TH-BSS3 MPY534TH-BSS4 MPY534TL MPY534TL-BS MPY534TL~BSS1 MPY534TL-BSS2 MPY534 TL- BSS3 MPY534 TL -BSS4 MPY634AL MPY634AL-BS MPY634AL-BSS1 73.76 29.06 25.70 24.59 43.48 34.81 34.81 97.35 45.25 40.03 38.29 32.00 32.00 105.60 41.60 36.80 35.20 55.46 47.02 47.02 131. 51 61.13 54.07 51. 72 42.35 42.35 139.-76 55.06 48.70 46.59 64.00 54.50 54.50 179.85 70.85 62.68 59.95 57.00 57.00 188.10 74.10 65.55 62.70 12.45 12.45 41.09 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars MonEL MPY634AL-BSS2 MPY634AL-BSS3 MPY634Al-BSS4 MPY634AM MPY634AM-BS MPY634AM-BSSI MPY634AM-BSS2 HPY634AM-BSS3 MPY634AM-BSS4 MPY634BL MPY634BL-BS MPY634BL-BSSI HPY634BL-BSS2 MPY634BL-BSS3 MPY634BL-BSS4 MPY634BM MPY634BM-BS MPY634BM-BSSI MPY634BH-BSS2 MPY634BH-BSS3 MPY634BM-BSS4 MPY634KP MPY634SL MPY634SL-BS MPY634SL-BSSI HPY634SL-BSS2 MPY634SL-BSS3 MPY634SL-BSS4 MPY634SM HPY634SM-BS MPY634SM-BSSI HPY634SM-BSS2 MPY634SM-BSS3 MPY634SM-BSS4 0245MC OPAI0IAH OPAIOIBH OPAI02AM OPAI02BM OPAI03AM OPAI03BM OPAI03CM OPAI03DH OPAI04AM OPAI04BM OPAI04CM roOT NOlE 1-24 25-99 26.00 23.00 22.00 18.65 18.65 57.75 24.25 21. 45 20.52 28.45 28.45 93.89 36.99 32.72 31.30 27.72 27.72 85.64 36.04 31.88 30.49 14.39 65.15 65.15 214.99 84.70 74.92 71.67 66.81 66.81 206.75 86.B5 76.83 73.49 6.05 42.00 52.20 44.4ry 54.00 11. 76 15.90 20.83 33.43 19.60 26.49 33.04 21.26 IB.80 17 .99 14.96 14.96 45.71 19.45 17.20 16.45 23.05 23.05 76.07 29.97 26.51 25.36 22.19 22.19 67.82 2B.85 25.52 24.41 11.50 52.35 52.35 172.76 68.06 60.20 57.59 53.84 53.84 164.51 69.99 61.92 59.22 5.05 33.45 42.00 35.56 43.30 9.29 12.37 16.04 25.76 15.07 20.47 25.38 100-249 16.19 14.32 13.70 10.45 10.45 32.B4 13.59 12.02 II. 50 17.75 17.75 5B.58 23.0B 20.41 19.53 16.01 16.01 50.33 20.BI 18.41 17 .61 B.35 40.35 40.35 133.16 52.46 46.40 44.39 39.74 39.74 124.91 51.66 45.70 43.71 4.B5 25.60 36.00 26.70 36.B5 7.14 9.40 12.13 19.43 10.76 15.23 19.95 MOOEL OPAI05UM OPAI05UH/883B OPAI05VM OPAI05VM/B83B OPAI05WH OPAI05HM/BB3B OPAI06UM OPAI06UM/BB3B OPAI06VM OPAI06VM/8B3B OPAI06WM OPAI06WM/BB3B OPAI1IAD UPAlllAL OPAIIIAL-BS OPAIIIAL-BSSI OPAIIIAL-BSS2 OPAIlIAL-BSS3 OPAIIIAL-BSS4 OPAII1AM OPAIIIAM-BS OPAIIlAM-BSSI OPAI1IAM-BSS2 OPAII1AM-BSS3 OPAIIIAH-BSS4 OPAI1IBL OPAI1IBL-BS OPAI1IBL-BSSI OPAI1IBL-BSS2 OPAlllBL-BSS3 OPAl llBL-BSS4 OPAI1IBH OPAlllBM-BS OPAl llBH-BSSI OPAl llBH-BSS2 OPAllIBH-BSS3 OPAllIBM-BSS4 OPAlllHT OPA111SL OPAlIl SL-BS OPAlIISL-BSSI OPAllISL-BSS2 OPAlIISL-BSS3 OPAllISL-BSS4 OPAll ISM OPAllISM-BS FOOT NOTE Page No.9 Effective June 1, 1987 1-24 25-99 27.00 32.00 37.00 50.00 47.00 68.00 30.00 36.00 40.00 55.00 52.00 72.00 23.50 2B.00 32.00 44.00 42.00 59.00 25.00 32.00 35.00 49.00 45.00 63.00 7.29 Il.l5 lU.45 12.25 40.43 15.93 14.09 13.48 10.92 10.92 32.18 14.20 12.56 12.01 17.85 17.85 58.90 23.21 20.53 19.64 17.19 17.19 50.66 22.35 19.77 18.91 63.30 19.35 19.35 63.86 25.16 22.25 21.29 20.25 20.25 10.45 34.49 13.59 12.02 11. 50 8.59 8.59 26.24 11.17 9.88 9.45 14.75 14.75 48.6B 19.18 16.96 16.23 13.23 13.23 40.43 17.20 15.21 14.55 50.70 16.45 16.45 54.29 21. 39 18.92 18.10 15.65 15.65 100-249 22.00 25.00 30.00 40.00 40.25 52.00 22.00 28.00 32.00 44.00 42.00 57.00 4.04 I.Y5 7.95 26.24 10.34 9.14 B.75 5.72 5.72 17.99 7.44 6.5B 6.29 12.45 12.45 41.09 16.19 14.32 13.70 10.45 10.45 32.84 13.59 12.02 II. 50 40.70 14.45 14.45 47.69 IB.79 16.62 15.90 13.15 13.15 Page No.IO CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars HODEL OPA111 SH- BSSI OPA111SM-BSS2 OPAl 11 SM-BSS3 OPAl 11 SH-BSS4 OPAl l1SHQ OPAl11VH OPAl 11 VH/883B OPA11HT OPAI21KL OPAI2IKL-BS OPAI2IKL-BSSI OPAI2IKL-BSS2 OPAI2IKL-BSS3 OPAI2IKL-BSS4 OPAI21KH OPAI2IKH-BS OPAI2IKH-BSSI OPAI2IKH-BSS2 OPAI21KH-BSS3 OPAI2IKH-BSS4 OPAI21KP OPAI21KU OPAI21SL OPAI2ISL-BS OPAI2ISL-BSSI OPAI2ISL-BSS2 OPAI2ISL-BSS3 OPAI2ISL-BSS4 OPAI2ISH-BS OPAI2ISM-BSSI OPAI2ISH-BSS2 OPAI2ISH-BSS3 OPAI2ISM_BSS4 OPAI28JD OPAI28JL OPAI28JL-BS OPAI28JL-BSSI OPAI28JL-BSS2 OPI\128JL-BSS3 OPAI28JL-BSS4 OPAI28JH OPAI28JH-BS OPAI28JM-BSSI OPAI28JM-BSS2 OPAI28JH-BSS3 OPAI28JH-BSS4 FOOT NOTE 1-24 55.61 26.33 23.29 22.28 27.30 26.00 35.00 58.BO 9.35, 9.35 30.86 12.16 10.75 10.29 6.85 6.85 22.61 8.91 7.88 7.54 5.65 7.78 15.05 15.05 49.67 19.57 17.31 - 16.56 12.55 41.42 16.32 14.43 13.81 20.00 20.00 66.00 26.00 23.00 22.00 21.25 21.25 57.75 27.63 24.44 23.38 25-99 46.04 20.35 18.00 17.22 21.85 20.50 30.00 52.15 7.00 7.00 23.10 9.10 8.05 7.70 4.50 4.50 14.85 5.85 5.18 4.95 3.65 4.27 11.55, 11.55 38.12 15.02 13.28 12.71 9.05 29.87 II. 77 10.41 9.96 14.58 16.45 16.45 54.29 21.39 18.92 18.10 16.95 16.95 46.04 22.04' 19.49 18.65 100-249 39.44 17.10 15.12 14.47 17.55 '17.00 27.00 43.15 5.90 5.90 19.47 7.67 6.79 6.49 3.40 3.40 11.22 4.42 3.91 3.74 2.75 3.20 8.75 8.75 28.88 11.38 10.06 9.63 6.25 20.63 8.13 7.19 6.88 8.66 12.75 12.75 42.08 16.58 14.66 14.03 12.50 12.50 33.83 16.25 14.38 13.75 MODEL OPAI28KL OPAI28KL-BS OPAI28KL-BSSI OPAI28KL-BSS2 OPAI28KL-BSS3 OPAI28KL-BSS4 OPAI28KM OPAI28KH-BS OPAI28KH-BSSI OPAI28KH-BSS2 OPAI28KH-BSS3 OPAI28KH-BSS4 OPAI2Bll OPAI28ll-BS OPAI28lL-BSSI OPAI28ll-BSS2 OPAI28ll-BSS3 OPAI28ll-BSS4 OPAI28lH OPAI28lH-BS OPAI28lH-BSSI OPAI28LM-BSS2 OPAI28lM-BSS3 OPAI28LM-BSS4 OPAI28Sl OPAI28Sl-BS OPAI28Sl-BSSI OPAI2BSL-BSS2 OPAI28Sl-BSS3 OPAI28Sl-BSS4 OPAI28SH OPAI28SH-BS OPAI28SH-BSSI OPAI28SH-BSS2 OPAI28SH-BSS3 OPAI28SH-BSS4 OPAI56AH OPA20lAG OPA20lBG OPA20lCG OPA201SG OPA2 I 11 AD OPA2111Al OPA2111AM OPA2111Bl OPA211IBM FOOT NOIE 1-24 27.50 27.50 90.75 , 35.75 31.63 30.25 32.80 32.80 82.50 42.64 37.72 36.08 34.00 34.00 112.20 44.20 '39.10 37.40 41.38 41.38 103.95 53.79 47.59 45.52 56.75 56.75 187.28 73.78' 65.26 62.43 60.76 60.76 179.03 78.99 69.87 66.84 12.60 9.00 14.00 16.75 18.30 18.15 16.24 29.50 29.06 Effective June 1, 1987 25-99 100-249 18.00 22.50 18.00 22.50 59.40 74.25 23.40 29.25 20.70 25.88 19.80 24.75 19.50 25.75 19.50 25.75 66.00 51.15 33.48 25.35 22.43 29.61 28.33 21.45 27.50 22.50 27.50 22.50 90.75 74.25 35.75 29.25 25;88 31.63 24.75 30.25 25.15 32.02 25.15 32.02 66.00 82.50 , 32.70 41.63 28.92 36.82 27.67 35.22 47.45 41.00 47.45 41.00 156.59' 135.,30 61.69 53.30 54.57 47.15 52.20 45.10 48.55 40.43 48.55 40.43 127.05 148.34 52.56 63.12 46.49 55.83 53.41 44.47 7.09 9.67 6.30 4.35 6.80 9.80 8.20 11.70 9.00 12.05 7.30 10.75 14.45 12.45 12.42 10.45 24.20 19.35 17.33 22.52 CUSTOMER PRICE LIST-COMPONENT PRODUCTS Prices in U.S. dollars MODEL OPA2I11KM OPA2I11KP OPA2lliSL OPA2ll ISM OPA21£Z OPA2IGl OPA27AJ OPA27AJ-BS OPA27AJ-BSSI OPA27AJ-BSS2 OPA27AJ-BSS3 OPA27AJ-BSS4 OPA27AJQ OPA27AL OPA27AL-BS OPA27AL-BSSI OPA27AL-BSS2 OPA27AL-BSS3 OPA27AL-BSS4 OPA27AZ OPA27AZQ OPA27BJ OPA27BJ-BS OPA27BJ-BSSI OPA27BJ-BSS2 OPA27BJ-BSS3 OPA27BJ-BSS4 OPA27BJQ OPA27BL OPA27BL-BS OPA27BL-BSSI OPA27BL-BSS2 OPA27BL-BSS3 OPA27BL-BSS4 OPA27BZ OPA27BZQ OPA27CD OPA27CJ OPA27CJ-BS OPA27CJ-BSSI OPA27CJ-BSS2 OPA27CJ-BSS3 OPA27CJ-BSS4 OPA27CJQ OPA27CL OPA27CL-BS F.O.B. Tucson, Arizona FOOT NOIE 1-24 9.90 7.90 31.15 29.68 10.02 4.98 19.95 19.95 70.46 25.94 22.94 21. 95 32.85 23.85 23.85 78.71 31.01 27.43 26.24 19.95 32.85 12.85 12.85 45.38 16.71 14.78 14.14 21.20 16.25 16.25 53.63 21.13 18.69 17.88 12.85 21.20 9.95 9.95 35.15 12.94 11.44 10.95 16.45 13.15 13.15 25-99 7.90 5.50 24.50 22.90 7.72 3.89 15.65 15.65 53.63 20.35 18.00 17.22 25.00 18.75 18.75 61.88 24.38 21. 56 20.63 15.65 25.00 9.65 9.65 33.00 12.55 11.10 10.62 15.45 12.50 12.50 41.25 16.25 14.38 13.75 9.65 15.45 6.30 7.50 7.50 25.74 9.75 8.63 8.25 12.00 10.30 10.30 100-249 5.25 4.25 19.60 17.59 6.25 3.10 12.50 12.50 41.25 16.25 14.38 13.75 18.75 15.00 15.00 49.50 19.50 17.25 16.50 12.50 18.75 7.65 7.65 25.25 9.95 8.80 8.42 11.85 10.15 10.15 33.50 13.20 11.67 11.17 7.65 11.85 4.20 5.95 5.95 19.64 7.74 6.84 6.55 9.25 8.45 8.45 Quantity discounts available. MODEL OPA27CL-BSSI OPA27CL-BSS2 OPA27CL-BSS3 OPA27CL-BSS4 OPA27CZ OPA27CZQ OPA27EJ OPA27EJ-BS OPA27EJ-BSSI OPA27EJ-BSS2 OPA27EJ-BSS3 OPA27EJ-BSS4 OPA27EL OPA27EL-BS OPA27EL-BSSI OPA27EL-BSS2 OPA27EL-BSS3 OPA27EL-BSS4 OPA27EZ OPA27FJ OPA27FJ-BS OPA27FJ-BSSI OPA27FJ-BSS2 OPA27FJ-BSS3 OPA27FJ-BSS4 OPA27FL OPA27FL-BS OPA27FL-BSSI OPA27FL-BSS2 OPA27FL-BSS3 OPA27FL-BSS4 OPA27Fl OPA27GO OPA27GJ OPA27GJ-BS OPA27GJ-8SS1 OPA27GJ-BSS2 OPA27GJ-BSS3 OPA27GJ-BSS4 OPA27GL OPA27GL-BS OPA27GL-BSSI OPA27GL-BSS2 OPA27GL-BSS3 OPA27GL-BSS4 OPA27GP FOOT NOTE Page No. 11 Effective June 1, 1987 1-24 43.40 17.10 15.12 14.47 9.95 16.45 11.00 11. 00 38.78 14.30 12.65 12.10 14.25 14.25 47.03 18.53 16.39 15.68 11.00 8.55 8.55 30.20 11.12 9.83 9.41 11.65 11.65 38.45 15.15 13.40 12.82 8.55 6.00 6.00 21.29 7.80 6.90 6.60 8.95 8.95 29.54 11.64 10.29 9.85 5.25 25-99 33.99 13.39 11.84 11. 33 7.50 12.00 8.35 8.35 28.71 10.86 9.60 9.19 11.20 11.20 36.96 14.56 12.88 12.32 8.35 5.95 5.95 20.46 7.74 6.84 6.55 8.70 8.70 28.71 11. 31 10.01 9.57 5.95 4.20 4.95 4.95 17 .00 6.44 5.69 5.45 7.65 7.65 25.25 9.95 8.80 8.42 4.15 100-249 27.89 10.99 9.72 9.30 5.95 9.25 6.65 6.65 21. 95 8.65 7.65 7.32 9.15 9.15 30.20 II. 90 10.52 10.07 6.65 4.95 4.95 16.34 6.44 5.69 5.45 7.45 7.45 24.59 9.69 8.57 8.20 4.95 2.80 4.00 4.00 13.20 5.20 4.60 4.40 6.50 6.50 21.45 8.45 7.48 7.15 2.95 Page No. 12 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars MODEL OPA27GU OPA27GZ OPA27HT OPA356AM OPA37AJ OPA37AJ-BS OPA37AJ-BSSI OPA37AJ-BSS2 OPA37AJ-BSS3 OPA37AJ-BSS4 OPA37AJQ OPA37AL OPA37AL-BS OPA37AL-BSSI OPA37AL-BSS2 OPA37AL-BSS3 OPA37 AL-BSS4 OPA37AZ OPA37AZQ OPA37BJ OPA37BJ-BS OPA37BJ-BSSI OPA37BJ-BSS2 OPA37BJ-BSS3 OPA37BJ-BSS4 OPA37BJQ OPA37BL OPA37BL-BS OPA37BL-BSSI OPA37BL-BSS2 OPA37BL-BSS3 OPA37BL-BSS4 OPA37BZ OPA37BZQ OPA37CD OPA37CJ OPA37CJ-BS OPA37CJ-BSSI OPA37CJ-BSS2 OPA37CJ-BSS3 OPA37CJ-BSS4 OPA37CJQ OPA37CL OPA37CL-BS OPA37CL-BSSI OPA37CL-BSS2 FOOT NOTE 1-24 5.95 6.00 67.09 8.12 19.95 19.95 70.46 25.94 22.94 21.95 32.85 23.85 23.85 78.71 31.01 27.43 26.24 19.95 32.85 12.85 12.85 45.38 16.71 14.78 14.14 21.20 16.25 16.25 53.63 21.13 18.69 17.88 12.85 21.20 9.95 9.95 35.15 12.94 11.44 10.95 16.45 13.15 13.15 43.40 17.10 25-99 4.45 4.95 55.46 6.43 15.65 15.65 53.63 20.35 18.00 17.22 25.00 18.75 18.75 61.88 24.38 21. 56 20.63 15.65 25.00 9.65 9.65 33.00 12.55 11.10 10.62 15.45 12.50 12.50 41.25 16.25 14.38 13.75 9.65 15.45 6.30 7.50 7.50 25.74 9.75 8.63 8.25 12.00 10.30 10.30 33.99 13.39 100-249 3.25 4.00 44.10 4.73 12.50 12.50 41.25 16.25 14.38 13.75 18.75 15.00 15.00 49.50 19.50 17.25 16.50 12.50 18.75 7.65 7.65 25.25 9.95 8.80 8.42 11.85 10.15 10.15 33.50 13.20 11.67 11.17 7.65 11.85 4.20 5.95 5.95 19.64 7.74 6.84 6.55 9.25 8.45 8.45 27.89 10.99 MODEL OPA37CL-BSS3 OPA37CL-BSS4 OPA37CZ OPA37CZQ OPA37EJ OPA37EJ-BS OPA37EJ-BSS1 OPA37EJ-BSS2 OPA37EJ-BSS3 OPA37EJ-8SS4 OPA37EL OPA37EL-BS OPA37EL-BSSI OPA37EL-BSS2 OPA37EL-8SS3 OPA37EL-BSS4 OPA37EZ OPA37FJ OPA37FJ-BS OPA37FJ-8SS1 OPA37FJ-8SS2 OPA37FJ-BSS3 OPA37FJ-BSS4 OPA37FL OPA37FL-BS OPA37FL-BSSI OPA37FL-BSS2 OPA37FL-BSS3 OPA37FL-BSS4 OPA37FZ OPA37GD OPA37GJ OPA37GJ-BS OPA37GJ-BSSI OPA37GJ-BSS2 OPA37GJ-BSS3 OPA37GJ-BSS4 OPA37GL OPA37GL-BS OPA37GL-BSSI OPA37GL-BSS2 OPA37GL-8SS3 OPA37GL-BSS4 OPA37GP OPA37GU OPA37GZ FOOT NOIE 1-24 15.12 14.47 9.95 16.45 11.00 11.00 38.78 14.30 12.65 12.10 14.25 14.25 47.03 18.53 16.39 15.68 11.00 8.55 8.55 30.20 11.12 9.83 9.41 11.65 11.65 38.45 15.15 13.40 12.82 8.55 6.00 6.00 21.29 7.80 6.90 6.60 8.95 8.95 29.54 11.64 10.29 ' 9.85. 5.25 5.95 6.00 Effective June 1. 1987 25-99 11.84 11. 33 7.50 12.00 8.35 8.35 28.71 10.86 9.60 9.12 11.20 11.20 36.96 14.56 12.88 12.32 8.35 5.95 5.95 20.46 7.74 6.84 6.55 8.70 8.70 28.71 11. 31 10.01 9.57 5.95 4.20 4.95 4.95 17.00 6.44 5.69 5.45 7.65 7.65 25.25 9.95 8.80 8.42 3.95 4.45 4.95 100-2~9 9.72 9.30 5.95 9.25 6.65 6.65 21. 95 8.65 7.65 7.32 9.15 9.15 30.20 11.90 10.52 10.07 6.65 4.95 4.95 16.34 6.44 5.69 5.45 7.45 7.45 24.59 9.69 8.57 8.20 4.95 2.80 4 •.00 4.00 13.20 5.20 4.60 4.40 6.50 6.50 21.45 8.45 7.48 7.15 3.25 4.00 Prices in CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. u.s. dollars MODEL FOOT 1-24 2S-99 100-249 MODEL HorE OPA37HT OPA404AO OPA404AG OPA404AL OPA4048G OPM048L' OPA404KP OPA404SG OPM04SL OPASOIAM OPASOl8M OPA50lRM OPA501SM OPA50lSMQ OPA50lUM OPASOIUM/8838 OPASOIVM OPASOI VM/8838 OPA511AM OPAS128M OPAS12SM OPA541AM OPAS418M OPA541SM OPA6008M OPA600CH OPA600SH OPA600TH OPA600UM OPA600UH/8838 OPA600VH OPA600VH/8838 OPA605AH OPA60SCH OPA60SHG OPA605KG OPA606KO OPA606KH OPA606KP OPA606LH OPA606SH OPA633AH OPA633KP OPA633SH OPA8780UH OPA8780UH/8838 + 16.74 17.45 22.12 22.2S 11.85 32.76 31. 75 59.81 70.56 76.72 91.84 125.44 86.00 94.75 96.00 100.00 45.00 55.46 8.59 13.50 15.00 17.01 18.25 9.25 25.11 25.75 43.20 51.68 53.19 64.64 93.96 75.75 83.40 84.50 88.00 44.10 6.25 9.40 11.45 13.49 15.35 6.95 20.95 22.45 34.13 39.74 44.63 52.45 75.60 68.10 74.85 76.00 79.00 ~.~ ~.~ 63.~ ".% ~.~ 76.50 29.50 34.75 49.00 101.85 124.95 128.10 156.45 143.00 165.00 175.00 195.00 76.80 106.80 61.80 91.98 66.50 21.40 25.20 61. 50 16.85 19.85 B.~ ~.~ 85.05 106.05 106.05 141.75 115.00 145.00 153.00 176.00 61.00 83.45 50.40 75.00 3.78 4.70 3.10 10.75 lI.07 9.10 4.85 20.35 77.70 101.85 101.85 135.45 102.00 137.75 143.00 163.00 52.80 73.45 44.55 63.25 2.42 3.68 2.60 8.65 8.95 7.60 4.00 16.95 6.38 4.20 15.51 15.96 10.95 5.80 24.50 J J, + Effective June 1, 1987 1-24 2S-99 50.00 50.00 22.05 22.05 24.68 24.68 19.43 22.05 24.68 19.43 22.05 20.46 23.10 25.73 137.55 156.45 72.80 80.64 40.63 40.63 20.48 20.48 22.31 22.31 16.38 20.46 22.31 17.90 20.56 19.43 21.53 23.36 119.70 135.45 59.40 66.96 4.43 9.72 17.55 5.13 21. 55 43.15 50.49 43.15 50.49 37.00 52.00 42.00 41.00 29.00 33.00 37.00 42.00 51.00 46.00 69.00 79.00 66.00 50.00 59.00 27.70 36.00 100-249 HorE 67.09 + rOOT Page No. 13 OPA8780VM OPA8780VH/8838 PCH53JG- I PCH53JG-V PCM53JP-I PCM53JP-V PCH53KP-I PCH53KP-V PCH54HP PCM54JP PCH54KP PCH55HP PCH55JP PCH56P PCH56P-J PCH56P-K PCH75JG PCH75KG PGAIOOAG PGAI008G PGAI02AO PGAI02AG PGAI02BG PGAI02KP PGAI02SG PGA200AG PGA200BG PGA20IAG PGA20lBG PWR 70 PWR 71 PIIR 72 PWR 74 PWR IXX PWR 2XX PWR 3XX PWR 4XX PWR 5XX PWR 6XX PWR 7XX PWR 8XX PWRIOl7 PWR5038 PWR510X PIIS 725 PWS 726 J, + K K K K K K K K K K K K K K K 12.26 22.34 6.66 27.36 57.66 64.79 57.66 64.79 43.00 61.00 49.00 48.00 33.00 38.00 43.00 49.00 59.00 54.00 81.00 92.00 76.00 65.00 65.00 36.00 46.80 26.75 26.75 12.76 12.76 13.91 13.91 11.45 12.76 13.91 11.45 12.76 12.60 13.91 15.23 91.35 103.95 51.96 56.70 3.57 8.03 14:44 4.15 17.59 36.49 43;05 36.49 43.05 30.10 42.70 34.30 33.60 23.00 27.00 30.00 34.00 41.00 38.00 57.00 65.00 58.75 35.00 51.00 21. 30 27.70 Page No. 14 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in U.S. dollars HODEL FOOT NorE REflOIJL REfIOIJM REFI0lKL REFlOIKM REFIOIRL REflOIRM REfIOIRMQ REfIOISL REFI0lSM REflOISMQ REFIOJL REFIOJM REFI0KL REFIOKM REFIORL REFlOR~l REFlORMQ REFIOSL REFIOSN REFIOSMQ RF-500-108 SOM853 SOf1854AG SOM8548G SOM856JG SOM856KG SOM857JG SOM857KG SOM862AH SOM862AL SOM862BH SDM862BL SDM862JH SDM862JL SDM862KH SDM862KL SDM862RH SDM862RL SOM862SH SDM862SL SDM863AH SDM863AL SDM863BH SDM863BL SDM863JH SDM863JL L.M L.M L.M L.M L.M L.M L.M L.M L.M 1-24 25-99 35.85 34.61 44.10 43.12 38.95 37.80 53.20 48.25 47.43 66.08 21. 30 19.49 26.10 24.47 24.05 22.34 31. 36 34.25 32.93 45.92 8.95 346.00 241.50 267.95 208.15 251.85 223.10 266.80 154.00 154.00 178.00 178.00 128.00 128.00 145.00 145.00 239.00 239.00 298.00 298.00 154.00 154.00 178.00 178.00 128.00 128.00 31. 70 30.02 39.25 37.80 34.75 33.16 46.44 43.40 42.07 58.32 18.95 16.90 23.15 21.22 21.35 19.39 27.00 30.15 28.46 39.42 8.25 333.00 193.20 215.05 166.75 201.25 178.25 213.90 129.00 129.00 146.00 146.00 117.00 117.00 129.00 129.00 204.00 204.00 255.00 255.00 129.00 129.00 148.00 148.00 117.00 117.00 100-249 25.65 23.63 32.15 30.24 28.45 26.46 36.75 35.85 34.02 48.30 16.25 14.02 19.75 17.59 18.30 16.12 22.94 25.70 23.63 33.44 7.65 319.00 162.15 179.40 139.15 .169.05 149.50 178.25 11 1.00 11 1. 00 127.00 127.00 103.00 103;00 118.00 118.00 189.00 189.00 235.00 235.00 111.00 111.00 127.00 127.00 103.00 103.00 HODH SDM863KH SDM863KL SDM863RH SOM863RL SDM863SH SDM863SL SHC298Af1 SHC5320KH SHC5320SH SHC600BH SHC76BM SHC76KM SHC803BM SHC803BMQ SHC803CM SHC803CMQ SHC804BM SHC804BMQ SHC804CM SHC804CMQ SHC80KP SHC85 SHC85ET SHC85ETQ SHC85Q SHM60 TM25-300HT TM25-300NT TM2500 TM27-12 TM2700 TM70 TM71 TM71-10 TM76 TM76K TM77 TM77-I/O TM77K TM77K-IO UAF11 UAF21 UAF41 VFCIOOAG VFCI00AL VFCIOOBG FOOT NorE L.M L.M L.M Effective June 1, 1987 1-24 25-99 100-249 145.00 145.00 239.00 239.00 298.00 298.00 8.35 13.40 61.00 129.00 129.00 204.00 204.00 255.00 255.00 5.78 11.60 52.75 304.50 75.00 65.10 141.75 177.45 160.65 201.60 127.05 158.55 138.60 174.30 43.05 78.20 126.50 186.30 126.50 1«.00 267.00 267.00 290.00 267.00 315.00 496.00 582.00 658.00 496.00 587.00 562.00 658.00 671.00 746.00 45.60 88.10 15.23 8.70 11.20 13.65 118.00 )18.00 189.00 189.00 235.00 235.00 4.73 9.80 44.70 280.35 63.00 54.60 129.15 160.65 147.00 182.70 115.50 143.85 127.05 . 158.55 35.70 65.55 121.90 178.25 105.80 138;00 226.00 226:00 195.00 226.00 210.00 402.00 456.00 533.00 402.00 476.00 456.00 533.00 543.00 604.00 29.05 58.69 12.08 6.95 9.45 10.95 D 99.00 85.05 182.70 234.15 212.10 265.65 168.00 207.90 183.75 229.95 64.05 112.70 170.20 215.25 180.55 I~.OO 320.00 320.00 325.00 320.00 350.00 595.00 675.00 790.00 595.00 705.00 675.00 790.00 805.00 895.00 64.35 102.60 23.35 10.45 12.95 16.40 CUSTOMER PRICE LIST-COMPONENT PRODUCTS F.O.B. Tucson, Arizona Quantity discounts available. Prices in u.s. dollars HODEL FOOT 1-24 25-99 100-249 HODEL HorE VFCI00BL VFCI00SG VFCI00SL VFC320BG VFC320BL VFC320BL-BS VFC320BL-BSSI VFC320BL-BSS2 VFC320BL-BSS3 VFC320BL-BSS4 VFC320BM VFC320BH-BS VFC3209H-BSSI V~C32IitlM-tlSS2 VFC320BM-BSS3 VFC320BM-BSS4 VFC320CG VFC320CL VFC320CL-BS VFC320CL-BSSI VFC320CL-BSS2 VFC320CL-BSS3 VFC320CL-BSS4 VFC320CM VFC320CM-BS VFC320CM-BSSI VFC320CM-BSS2 VFC320CM-BSS3 VFC320CM-BSS4 VFC320SL VFC320SL-BS VFC320SL-BSSI VFC320SL-BSS2 VFC320SL-BSS3 VFC320SL-BSS4 VFC320SM VFC320SM-BS VFC320SM-BSSI VFC320SM- BSS2 VFC320SM- BSS3 VFC320SM-BSS4 VFC32BD VFC32BL VFC32BL-BS VFC32BL-BSSI VFC32BL-BSS2 18.90 18.95 21.45 15.95 19.65 19.65 64.85 25.25 22.60 21.62 15.60 15.60 56.59 2u.28 17.94 17.76 20.72 20.75 20.75 68.48 26.98 23.86 22.83 18.59 18.59 60.23 24.17 21.38 20.45 25.20 25.20 83.16 32.76 28.98 27.72 23.13 23.13 74.91 30.07 26.60 25.44 15.65 15.65 51.65 20.35 16.15 15.95 18.45 11.75 14.45 14.45 47.69 18.79 16.62 15.90 11.40 11.40 39.44 14.82 13.11 12.55 14.74 15.50 15.50 51.15 20 ..15 17.83 17.05 13.45 13.45 42.90 17.49 15.47 14.80 18.90 18.90 62.37 24.57 21.73 20.79 16.85 16.85 54.12 21.91 19.38 18.54 8.45 12.95 12.95 42.73 16.84 13.45 13.65 16.15 8.95 11.50 11. 50 37.95 .14.95 13.23 12.65 8.75 8.75 29.70 1l.38 10.06 9.63 12.08 13.25 13.25 43.73 17.23 15.24 14.58 - 10.97 10.97 35.48 14.26 12.62 12.07 16.30 16.30 53.79 21.19 18.75 17.93 14.07 14.07 45.54 18.29 16.18 15:48 5.55 10.45 10.45 34.49 13.59 VFC32Bl-8SS3 VFC32Bl-BSS4 VFC32BM VFC32BM-BS VFC32BM-BSSI VFC32BM-BSS2 VFC32BM-BSS3 VFC32BM-BSS4 VFC32BMQ VFC32KP VFC32Sl VFC32Sl-BS VFC32Sl-BSSI VFCJZSL-oSS2 VFC32SL-BSS3 VFC32Sl-BSS4 VFC32SM VFC32SM-BS VFC32SM-BSSI VFC32SM-BSS2 VFC32SM-BSS3 VFC32SM-BSS4 VFC32SMQ VFC32UM VFC32UM/883B VFC32VM VFC32VM/8838 VFC32I1M VFC32I1M/883B VFC42BM VFC42BP VFC42SM VFC52BM VFC52BP VFC52SH VFC62BG VFC62Bl VFC62Bl-BS VFC62BL-BSSI VFC62BL-BSS2 VFC62Bl-BSS3 VFC62BL-BSS4 VFC62BH VFC62BH-BS VFC62BM-BSSI VFC62BM-BSS2 roOT NOTE 1-24 18.00 17.22 11.95 11.95 43.40 15.54 13.75 13.15 IB.87 8.95 21.45 21.45 70.79 27.89 24.67 23.60 18.30 18.30 62.54 23.79 21.05 20.13 24.70 15.00 20.00 24.00 36.00 30.00 34.00 33.21 23.91 40.32 33.21 23.91 40.32 17.86 1~.65 19.65 64.85 25.55 22.60 21.62 17.47 17.47 56.59 22.71 Page No.15 Effective June 1, 1987 25-99 14.89 14.25 9.95 9.95 34.48 12.94 I!. 44 10.95 15.07 7.45 17.65 17.65 58.25 22.95 20.30 19.42 14.98 14.98 50.00 19.47 17.23 16.48 20.25 11.00 16.00 19.50 28.75 24.00 27.50 27.16 18.74 32.40 27.00 18.74 32.40 12.69 14.45 14.45 47.69 18.79 16.62 15.90 12.31 12.31 39.44 16.00 100-249 12.02 11.50 7.95 7.95 26.24 10.34 9.14 8.75 12.55 5.95 14.35 14.35 47.36 io.o6 16.50 15.79 11.85 11.85 39.11 15.41 13.63 13.04 16.00 10.45 15.20 18.50 27.25 22.75 26.00 23.05 16.49 25.88 23.05 16.49 25.88 9.40 11.50 11.50 37.95 14.95 13.23 12.65 9.19 9.19 29.}0 11.95 CUSTOMER PRICE LIST-COMPONENT PRODUCTS Page No. 16 Prices in u.s. dollars MODEL VfC628M-8SS3 VfC628H-8SS4 VFC62CG vrC62CL VFC62CL-BS VFC62CL-BSSI VFC62CL-BSS2 VFC62CL-BSS3 VFC62CL-BSS4 VFC62CH VFC62CH-BS VFC62CH-8SS1 VfC62CH-BSS2 vrC62CH-BSS3 VFC62CH-BSS4 VFC62SL VFC62SL-BS VFC62SL-BSSI VFC62SL-BSS2 vrC62SL-BSS3 VFC62SL-BSS4 VFC62SH VFC62SM-BS vrC62SM-BSSI F.O.B. Tucson, Arizona FOOT NOTE 1-24 25-99 20.09 19.22 22.20 20.75 20.75 68.48 26.9B 23.86 22.83 19.95 19.95 60.23 25.94 22.94 21.95 25.20 25.20 83.16 32.76 28.98 27.72 24.80 24.80 74.91 14.16 13.54 15.30 15.50 15.50 51.15 20.15 17 .83 17 .05 13.95 13.95 42.90 18.14 16.04 15.35 18.90 18.90 62.37 24.57 21. 73 20.79 17 .50 17.50 54.12 100-249 10.57 10.11 12.65 13.25 13.25 43.73 17.23 15.24 14.58 11.45 11.45 35.48 14.89 13.17 12.60 16.30 16.30 53.79' 21.19 18.75 17 .93 14.75 14.75 45.54 Quantity discounts available. MODEL VfC62SH-8SS2 VFC62SM-8SS3 VFC62SH-8SS4 XTRI00AM XTRI00AP XTRI00BH XTRI00BP XTRI0IAD XTRI0IAG XTRI0IAL XTRI01AP XTRI0IAU XTRI0IBG XTRI0IBL XTRIOlSL XTRllOAD XTRllOAG XTRllOAL XTRllOBG XTRllOBL XTRllOKP XTRllOKU XTR110SL rOOT NOTE Effective June 1, 1987 1-24 32.24 28.52 27 .28 42.56 33.60 51.52 40.32 11. 75 14.25 8.50 8.95 17.35 19.85 25.05 10.B5 14.25 16.25 20.05 7.45 8.40 25.30 25-99 22.75 20.13 19.25 38.50 30.02 46.B2 36.67 7.30 9.75 12.25 7.05 7.40 14.45 16.95 21. 30 '7.45 8.75 11.65 13.10 16.15 5.95 6.55 20.25 A) Not necessarily pin 'or spec compatible. B) Expected date of last order 6/30/88. C) AOC600K pricing: 1-4 $1995; 5-9 $1895; 10-24 $1795; AOC600B; 1-4 $2790; 5-9 $2650; 10-24 $2510. 0) SHC600BH pricing: 1-4 $329; 5-9 $321; 10-24 $314. E) 25 piece minimum. F) Minimum order is 10 pieces. G) Connector supplied with each un~. H) These products slated to be discontinued June 30, 1987. I) Prices effective upon introduction. J) Consult factory. K) /G level I screening add 25% to pricing above; IT level II screening add 45% to pricing indicated above. L) Eurocard evah,Jation PCB part #PC862/863-1 $16.00 each. M) 68 pin LCC socket (Note N) part #MC0068-1 $14.00. N) Manufacturer and part # for this socket is "Robinson Nugent" part #ICC503 68-2-G (It is a U.S. part). 0) AOC80KO must be ordered in multiples of 36. tQualification reports $100 each. Prices subject to change w~hout notice. Minimum order $75. ©1987 Burr-Brown Corp. MKT-173B Printed in U.S.A. June, 1987 100-249 19.18 16.96 16.23 30.40 25.04 37.75 30.71 5.50 8.25 10.75 5.95 6.25 12.25 14.75 18.45 4.95 7.45 10.15 H.IO 13.95 4.95 5.40 17.40
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