1988_Optoelectronics_Designers_Catalog 1988 Optoelectronics Designers Catalog
User Manual: 1988_Optoelectronics_Designers_Catalog
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.-------.:.:- Optoelectronics
Designer's
Catalog
,
..
1988-1989
O,S1RIBUT 0 8y
(1M1ltfM()
Hall-Mark Electronics Corporation
Co:
rt / .
1110 Ringwood
San Jose, CA. 95131
408/946-0900
--.....
.
.........-
Optoelectronics
Designer's
Catalog
To help you choose and design with HewlettPackard optoelectronic components, this catalog
includes detailed specifications for HP component
products. The products are divided into nine
sections:
High Reliability
Ink-Jet Components
Bar Code Components
Motion Sensing and Encoder Products
LED Light Bars and Bar Graph Arrays
LED Lamps
LED Displays
Fiber Optics
Optocouplers
How to Find the Right Information
The Table of Contents (pp. iii) indicates each of
the nine sections listed above by a thumb-tab. An
alphanumeric index (pp. iv) follows the Table of
Contents, and it lists every component
represented in this catalog.
"
. .
ji
;1
1 . /1
/l
JiP
.. '
.
At the beginning of each of the nine product
sections, there is a selection guide with basic
product specifications which allows you to quickly
select products most suitable for your application.
Following the product sections is a complete
listing of application bulletins and notes which are
frequently useful as design aids. The final section
is an appendix containing HP sales, service, and
authorized distributor locations.
How to Order
To order any component in this catalog or
additional applications information, call the HP
office nearest you and ask for the Components
representative. A complete listing of the U. S. sales '
offices is on pp. 11-13; offices located outside of
the U.S. are listed on pp. 11-6.
A world-wide listing of HP authorized
distributors is on pp. 11-2. These distributors can
offer off-the-shelf delivery for most HP
components.
Hewlett-PackardCotnponents:
A Brief Sketch
Quality and Reliability
Quality and reliability are two very important
concepts to Hewlett-Packard in maintaining the _
commitment to product performance.
History
In 1964, Hewlett-Packard established a new
division having the charter of developing and
producing state-of-the-art electronic components
for internal use. By 1975, both microwave and
optoelectronic devices contributed to the growing
business of Hewlett-Packard and the Components
Group was formed. Today there are three
divisions: the Optoelectronics division, Optical
Communications division and Microwave
Semiconductor division. In addition to these three
divisions there is a specialiZed team of people to
develop, manufacture and market bar code .
components.
At Hewlett-Packard, quality is integral to product
development, manufacturing and final
introduction. "Parts per million" (PPM) asa
measure of quality is used in HP's definition of
product assurance. And HP's commitment to
quality means that there is a continuQus process of
improvement and tightening of quality standards.
Manufacturing quality circles and quality testing
programs are important ingredients in HP
products.
The products of the Components Group are
vertically integrated, from the growing of LED
crystals to the development oCthe various onboard integrated circuits to package design.
Vertical integration insures that HP quality is
maintained throughout product development and
manufacturing.
Reliability testing is also required for the
introduction of new HP components. Lifespan
calculations in "mean-time-between-failure"
(MTBF) terms are published and available as .
reliability data sheets. HP's stringent reliability
testing assures long compOnent lifetimes and'
consistent product performance.
Over 5000 employees-are dedicated to HP
Components, including manufacturing facilities in
Malaysia and Singapore, factory and marketing
support in San Jose, California and a world-wide
sales force. Marketing operations for Europe are
located in Boeblingen, Germany.
/
Each field sales office is staffed with engineers
trained to provide-technical assistance. An
extensive communications network links field
with factory-to assure that each customer can
quickly attain the information and help needed.
ii
--~~~~~~~~-
~~~~-
-
~---
Table of Contents
Alphanumeric Index ........... ~ ................ : ................. : ................... , iv.
High Reliability ......................................................................... 1-1
Visible Product Screening Programs ............................................... 1~3
Hermetic Lamps Selection Guide ................................................. 1-7
Hermetic Displays Selection Guide .......... ; .................................... 1-9
Hermetic Optocoupler Screening Programs ..................................... 1-13
Hermetic Optocoupler Selection Guide ......................................... 1-18
Ink-Jet Components ... ; ............................... ~ ; ......................... '. " 2-1
Ink-Jet Components Selection Guide ............................................. 2-3.
Bar Code Components ...... ~ . . . . . . . . . . . . . . . .. . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 3-1
Bar Code Components Selection Guide ..................... : ..................... 3-3
Motion Sensing and Control .... ; ................................................ :.. 4. :1
Motion Sensing and .Control Selection Guide ................................. '.. 4-4
Light Bars and Bar Graph Arrays ................................................. 5-1
. Light Bars and Bar Graph Arrays Selection Guide ............................ 5-3
Solid State Lanips : .............................. , ................................... :.
6-L
Solid State Lamps Selection Guide ............ ; ...................... ; .......... ; 6,;.3
Hermetic Lamps . .'.: ............................ .'................................. 6-145"
Solid State Displays : ..... ; ..... : ...................... :.............................. 7-1'·
Solid State Displays Selection Guide ............................................. 7-4
Hermetic Displays ...... .' ....... , ................................................... ; .7-181·
Fiber Optics ................................................................................ '8-1 .
Fiber Optics Selection Guide ................. : ......................... ~ ........... 8-6,
Optocouplers ................ ; ...:................................................. :; ... ).. 9":'1
Optocouplers Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 9-4
Hermetic Optocouplers .: ............................................................·9.:.101
Applications Information ..... ; ...............................................':;.;. 10-1 .... .
Authorized Distributor and Representative Directory ................. : ....... 11:. 2
International Sales and Service Offices .......................................... 11-6
U.S. Sales and Service Offices ................................................... 11-13
iii
_ _-_._----
........... ..
Alphanutneric ·Index
HBCR-1800
HBCR-2.o.oO
HBCR-2010
HBCR-8100
HBCR-8300
......................... 3-31
...•..................... 3-37
......................... 3-43
.......................... 3-6
.......................... 3-6
HCPL-2211, OPT. 100 ................
HCPL-2212 ' .........................
HCPL-2212, OPT 010 ..•.... , ...... :..
HCPL-2212, OPT 100 ...... , .........
HCPL-2231 .........................
9-1.0
9-15
9-9
9-1.0
9-19
HBCR-8500
HBCR-8999
HBCS-11.o.o
HBCS-22.o.o
..................... ; ~ . .. 3-6
..... ,.......... .... . . . . .. 3-12
.......•.......•.....•..• 3-5.0
.•.....•..•.••.•...•...•. 3-19
.•...........•...•....•.. 3-19
HCPL-2231, OPT 010 .......... ;......
HCPL-2231, OPT 100 ...... '" . ; .... ;
HCPL-2232 ,. ',' ......................
HCPL-2232, OPT 010. . . . . . . . .. . . . . . ..
HCPL-2232, OPT 100 ................
9-9
9-1.0
9-19
9-9
9-1.0
HBCS~23.o.o
HBCS-24.o.o .............•....•....•. 3-19
HBCS-25.o.o ...............•......... 3-19
HBCS~2999 ..... ;................... 3-18
HBCS-4999 .••..•..•.......•........ 3-18
HBCS-5.o.o.o .....•..•.......••....... 3-13
HBCS-51.o.o
HBCS-52.o.o
HBC,S-53.o.o
HBCS-54.o.o
HBCS-55.o.o
.........................
... '......................
..........•....•.........
.•.....•..•...•.•.....•..
..••.•.••.............•..
HCPL-23.o.o
HCPL-23.o.o,
HCPL-23.oO;
HCPL-2400
HCPL-24.oO,
3~13
.........•.........•..... 9-23
OPT .01.0 ................. 9-9
OPT 10.0 .............•.. 9-10
............. , ........... 9-29
OPT 010 .•.......•..•...• 9-9
HCPL-24.oO, OPT 10.0 ' . . . . . . . . . . . . . . .. 9-10
HCPL-2411 '......................... 9-29
HCPL-25.o2 .;....................... 9-57
HCPL-2502, OPT 010 .........•....... 9-9
HCPL-2502, OPT 100 .......•....•... 9-1.0
3-13
3-13
3-13
3-13
HBCS~61.o.o .......•....••. ,. . . . . . . .• 3-13,'
HBCS-63.o.o ..........•.••.•...•..... 3-13
HBCS-65.o.o ..•.....•.•.•......•..•. : 3-13
HBCS~7.o.o.o ..••.••..•......•..•..... 3-44
HBCS-7.o5.o ...•.••..........•....... 3-44
HCPL-2530 ................• ;....... 9-63
HCPL-2530, OPT .010 ...•..•...•..•... 9-9
HCPL-2530, OPT 1.00 ........ : .• : .•. ~ 9-10
HCPL-2531 ..... , ................... 9-63
HCPL-2531, OPT 010 , ......... , ...... 9-9
HBCS-71.o.o
HBCS-715.o
HCPL-193.o
HCPL-1931
HCPL-22.o.o
.............•.•.....•... 3-44
..•..........•...•••...• ~ 3-44
..•...•..••..•..•...•.•• 9-153
..••..........••....•... 9-153
••..•. , ••..... ,.......... 9-11
HCPL-2531,
HCPL-2601
HCPL"2601,
HCPL-2601,
HCPL-26.o2
OPT 100 ..........•..... 9-1.0
.............•........... 9-39
OPT .010 .............•••• 9-9
OPT 100 ...............• 9-10
..•....•.•.............•• 9-43
HCPL-22.o.o, OPT .01.0 .......•....•.... 9-9
HCPL-22.o.o, OPT 1.0.0 .....•••........ 9-1.0
HCPL-2201 ......................... 9-15
HCPL~2201. OPT 010 ..............•.. 9-9
HCPL"2201, OPT 100 ................ 9-1.0
HCPL-2602,
HCPL-2602,
HCPL-2611
HCPL-2612
HCPL-2630
OPT .01.0 •. ;.............. 9-9
OPT ,10.0 ..•..•. ,......... 9-10
......................... 9-39
..................... ; ... 9-43
............. , .......... ; 9-49
HCPL-2202 ......................... 9-15
HCPL-2202, OPT 010 ................. 9-9
HCPL-2202,OPT 100 ................ ,9~1.o
HCPL-2211 ......................... 9-.15
HCPL-2211, OPT 010 '" . . . . . . . . . . .. . .. 9-9
HCPL-263.o, OPT 010 .,............... 9-9
HCPL-263.o, OPT 1.00 ...•.•.•....•... 9-1.0
HCPL-2631 ..•.........•............ 9-53
HCPL-2631, OPT 01.0 •..............•. 9-9
HCPL-2631, OPT 1.00 ................ 9-10
New Products in BOLD Type,
iV
HCPL-2730 ......................•.. 9-71
HCPL-2730, OPT 010 ................. 9-9
HCPL-2730, OPT 100 ................ 9-10
HCPL-2731 .......................... 9-71
HCPL-2731, OPT 010 ................. 9-9
HDSP-0782 ........................
HDSP-0782TXV ....................
HDSP-0782TXVB ...................
HDSP-0783 ........................
HDSP-0783TXV ....................
7-190
7-190
7-190
7-190
7-190
HCPL-2731, OPT 100 ................ 9-10
HCPL-3700 ......................... 9-79
HCPL-3700, OPT 010 ................. 9-9
HCPL-3700, OPT 100 ................ 9-10
HCPL-4100 ......................... 9-85
HDSP-0783TXVB ...................
HDSP-0784 ........................
HDSP-0784TXV ....................
HDSP-0784TXVB ....................
HDSP-0791 ........................
7-190
7-190
7-190
7-190
7-190
HCPL-4100, OPT 010 ................. 9-9
HCPL-4100, OPT 100 ................ 9-10
HCPL-4200 ......................... 9-93
HCPL-4200, OPT 010 ................. 9-9
HCPL-4200, OPT 100 ................ 9-10
HDSP-0791TXV ....................
HDSP-0791TXVB ...................
HDSP-0792 ........................
HDSP-0792TXV ....................
HDSP-0792TXVB. . . . . . . . . . . . . . . . . ..
7-190
7-190
7-190
7-190
7-190
HCPL-4502
HCPL-4502,
HCPL-4502,
HCPL-4661
HCPL-5200
......................... 9-57
OPT 010 ................. 9-9
OPT 100 ................ 9-10
......................... 9-53
9-102
HDSP-0794 ........................
HDSP-0794TXV ....................
HDSP-0794TXVB ...................
HDSP-0860 ........................
HDSP-0861 ........................
7-190
7-190
7-190
7-163
7-163
HCPL-5201
HCPL-5230
HCPL-5231
HCPL-5400
HCPL-5401
........................
........................
............. ...........
........................
........................
........................
........................
........................
........................
9-102
9-108
9-108
9-114
9-114
HDSP-0862 ........................
HDSP-0863 ........................
HDSP-0881 ........................
HDSP-0881TXV ....................
HDSP-0881TXVB ...................
7-163
7-163
7-190
7-190
7-190
'
HCPL-5430
HCPL-5431
HCPL-5700
HCPL-5701
HCPL-5730
........................
9-120
9-120
9-126
9-126
9-130
HDSP-0882 ........................
HDSP-0882TXV ....................
HDSP-0882TXVB ...................
HDSP-0883 ........................
HDSP-0883TXV .......... ;.........
7-190
7-190
7-190
7-190
7-190
HCPL-5731
HCPL-5760
HCPL-5761
HCTL-1000
HCTL-2000
9-130
........................ 9-134
........................ 9-134
......................... 4-43
......................... 4-67
HDSP-0883TXVB ...................
HDSP-0884 . . . . . . . . . .. . . . . . . . . . . . ..
HDSP-0884TXV ................. ;..
HDSP-0884TXVB ...................
HDSP-0960 ........................
7-190
7-190
7-190
7-190
7-163
HDSP-0760
HDSP-0761
HDSP-0762
HDSP-0763
HDSP-0770
........................
........................
........................
........................
........................
7-163
7-163
7-163
7-163
7-163
HDSP-0961 ........................
HDSP-0962 ........................
HDSP-0963 ........................
HDSP-0981 ........................
HDSP-0981TXV ............... ;....
7-163
7-163
7-163
7-190
7-190
HDSP-0771 ........................
HDSP-0772 ........................
HDSP-0781 ................... ;....
HDSP-0781TXV ....................
HDSP-0781TXVB ...................
7-163
7-163
7-190
7-190
7-190
HDSP-0981TXVB ...................
HDSP-0982 ........................
HDSP-0982TXV ....................
HDSP-0982TXVB ....... . . . . . . . . . . ..
HDSP-0983 ........................
7-190
7-190
7-190
7-190
7-190
New Products in BOLD Type.
v
HDSP-0983TXV ................. ;..
HDSP-0983TXVB ...........•..... ,.
HDSP-0984.. .. . . . ... . . . . .. . .. ... ..
HDSP-0984TXV ................ ; ...
HDSP-0984TXVB ...................
HDSP-2000
HDSP-2001
· HDSP-2002
HDSP-2003
HDSP-2010
7-190
7-190
7-190
7-190
, 7-190
HDSP-2450TXVB ...................
HDSP-2451 ........................
I;l DSP-2451 TXV ...............•....
HDSP-2451TXVB ...................
HDSP~2452 ........... ; ..... ; ......
...............••.... '" .. 7-46
......................... 7-46
.......................... 7-46
......................... 7-46
........................ 7-198
HDSP-2010TXV ....... ... . . . . .... ..
HDSP-2010TXVB ...................
HDSP-2111 ........................ ,
HDSP-2112 ........................ ;
HDSP-2300 ............... ; .........
7-235
,7c235
7-235
7-235
7-235
HDSP-2452TXV ................. , .. 7-235
.HDSP-2452TXVB .. . . . . . . . . . . . . . . . .. 7-235
HDSP"2453 .......... :.•... ;.......... 7"235
HDSP-2453TXV ........'. . . .. . . . . . .. 7-235
HDSP-2453TXVB .. . . . . . . . . . . . .. . . .. 7-235
7~198
HDSP~2470
7-198
.7-19
7-19
7-50
........................ ,
................ ; . . . . .. . ..
HDSP-2472 ............... " ... : .. ...
HDSP-2490 .........................
HDSP-2491 .........................
7-68
7-68
7-68
7-56
7-56
HDSP-2301 ......................... 7-50
HDSP-2302 .......................•. 7-50
HDSP-2303 ......................... 7-50
HDSP-2310 ........................ 7-228
HDSP-2310TXV ..................... 7-228
HDSP-2492 ..........................
HDSP-2493 ........... ;.............
HDSP-3350 ........................
HDSP-3351 ........................
HDSP-3353 ................... ,. . ..
7-56
7-56
!:"lDSP-2310TXVB ...................
HDSP-2311 ..................... ;..
HDSP-2311TXV .................. ,.
HDSP-2311TXVB ...................
HDSP-2312 ..................... ; ..
HDSP-3356
HDSP-3400
HDSP-3400,
HDSP-3401
HDSP-3403
HDSP~2471
7-228
7-228
7-228
7-228
7-228
7~109
7-109
7-109
.... ,.... ... . .. .... ..... .7-109
.................. ...... 7-138
OPT S02 ............... 7-153
........................ 7~138
................... ;.... 7-138
HDSP-2312TXV .................... 7~228
HDSP-2312TXVB ................... 7-228
HDSP-2;313 .. ....................... 7-228
HDSP-2;313TXV ... ... .. . .. . . . . . ....• 7-228
HDSP-2313TXVB ...............•... ·7-228
HDSP~3403, OPT S02 ............... 7-153
HDSP-3405 ........................ 7-138
HDSP-3406 ...............•......•. 7-138
HDSP-3406, OPT S02 ............... 7-153
HDSP~3530 ............ ,....... .... 7-145
HDSP-2351 .............. ,.........
HDSP-2351TXV .....................
HDSP-2351TXVB ...................
HDSP-2352 ........................
HDSP-2352TXV ....................
HDSP-3530, OPT S02 ............... 7~153
HDSP-3531 .................... ;... 7-145
HDSP-3531, OPT S02 ................ 7-153
HDSP-3533 ........................ 7-145
HDSP-3533, OPT S02 ........... i. • • • 7-153
7-214
7-214
7-214
7-214
7-214
HDSP-2352TXVB .. . . . . . . . . . . . .. . . .. 7-214
HDSP-2353 ...................... ..7-214
HDSP-2353TXV .................... 7-214
HDSP-2353TXVB ................ ; .. 7-214
HDSP-2416 ........•......•......... 7-68
HDSP-3536
HDSP-3536,
HDSP-3600
HDSP-3600,
HDSP-3601
........................
OPT S02 ...............
....................... ,.
OPT S02 .. .. .. .. . .. . ...
.........................
· H DSP-2424 ......................... 7-68
HDSP-2432 •.................•......• ' 7-68
HDSP-2440 .................... ; .. , .. 7-68
· HDSP-2450 ...............••....... 7-235
HDSP-2450TXV .............. ,..... 7-235
HDSP-3603
HDSP-3603,
HDSP-3606
HDSP-3606,
HDSP-3730.
.......................... 7-121
OPT S02 ............•.. 7~153
....................... ;.7-121
OPT S02 ............... 7-153
. . . . . .. . . . ... .• . ... . . ... 7~145
New Products in BOLD Type.
vi
7-145
7-153
7"121
7-153
7-121
~-~
HD8P-3730, OPT 802 ... . . . . . . . . . . ..
HD8P-3731 ........................
HD8P-3731, OPT 802 ...............
HD8P-3733 ........................
HD8P-3733, OPT 802 ... .. . . . . . . . . ..
HD8P-4840
HD8P-4850
HD8P-5301
HD8P-5301,
HD8P-5303
7-153
7-145
7-153
7-145
7-153
-
.........................
.........................
........................
OPT 801, 802 .. . . . . . . . ..
........................
--~------
5-27
5-27
7-130
7-153
7-130
........................ 7-145
OPT 802 ............... 7-153
................... 7-138/7-145
OPT 802 ........... , . .. 7-153
............. ;..... 7-138/7-145
HD8P-5303, OPT 801, 802 ..........
HD8P-5307 .................... ;...
HD8P-5307, OPT 801,802 ...........
HD8P-5308 ........................
HD8P-5308, OPT 801, 802 ..........
7-153
7-130
7-153
7-130
7-153
HD8P-3901, OPT 802 ............... 7-153
HD8P-3903 ................... 7-138/7-145
HD8P-3903, OPT 802 ............. .. 7-153
HD8P-3905 ................... 7-138/7-145
HD8P-3906 ................... 7-138/7-145
HD8P-5321 ........................
HD8P-5321, OPT 802 ...............
HD8P-5323 ........................
HD8P-5323, OPT 802 ..... . .. . . . . . ..
HD8P-5501 ........................
7-130
7-153
7-130
7-153
7-130
HD8P-3906, OPT 802 . .. . . . . . . . .. . ..
HD8P-4030 ........................
HD8P-4031
HD8P-4033
HD8P-4036
7-153
7-145
7-145
7-145
7-145
HD8P-5501, OPT 801, 802 . . .. . . . . . ..
HD8P-5503 ........................
HD8P-5503, OPT 801,802 ..........
HD8P-5507 ........................
HD8P-5507, OPT 801, 802 ....... ;...
7-153
7-130
7-15.3
7-130
7-153
HD8P-4130
HD8P-4131
HD8P-4133
HD8P-4133,
HD8P-4136
........................
........................
........................
OPT 820 ...............
........................
7-145
7-145
7-145
7-153
7-145
HD8P-5508 ........................
HD8P-5508, OPT 801, 802 ..........
HD8P-5521 ........................
HD8P-5521, OPT 801, 802 .. .. . . . . ...
HD8P-5523 ........................
7-130
7-153
7-130
7-153
7-130
HD8P-4136,
HD8P-4200
HD8P-4201
HD8P-4203
HD8P-4205
OPT 820 ............... 7-153
................... 7-138/7-145
................... 7-138/7-145
................... 7-138/7-145
................... 7-138/7-145
HD8P-5523, OPT 801,802 ..........
HD8P-5531 ........................
HD8P-5531, OPT 802 ...............
HD8P-5533 ........................
HD8P-5533, OPT 802 ........ . . . . . ..
7-153
7-145
7-153
7-145
7-153
HD8P-4206
HDSP-4401
HDSP-4403
HD8P-4501
HD8P-4503
................... 7-138/("-145
......................... 7-95
......................... 7-95
......................... 7-95
......................... 7-95
HD8P-5537 ........................
HD8P-5537, OPT 802 ...............
HD8P-5538 ........................
HD8P-5538, OPT 802 ...............
HD8P-5551 ........................
7-145
7-153
7-145
7-153
7-109
HD8P-4600
HD8P-4601
HD8P-4603
HD8P-4606
HDSP-4701
.........................
.........................
.........................
.........................
.................... ,....
7-121
7-121
7-121
7-121
7-95
HD8P-5553
HD8P-5557
HD8P-5558
HD8P-5601
HD8P-5601,
........................
........................
........................
........................
OPT 802 ........... ;...
7-109
7-109
7-109
7-130
7-153
HDSP-4703
HD8P-4820
HD8P-4830
HD8P-4832
HD8P-4836
.........................
.........................
.....................•...
.........................
.........................
.7-95
5-27
5-27
5-27
5-27
HD8P-5603
HD8P-5607
HD8P-5607,
HD8P-5608
HD8P-5621
................ ;.......
........................
OPT 802 ... , ............
........ ;...............
........................
7-130
7-130
7-153
7-130
7-130
HD8P-3736
HD8P-3736,
HD8P-3900
HD8P-3900,
HD8P-3901
New Products in BOLD Type.
vii
~~-
HD8P-5623
HD8P-5701
HD8P-5703
HD8P-5707
HD8P-5708
.. ~ ~ . . . . . . . . .. .. . . . .. . ..
........................
........................
.;......................
........................
7-130
7-130
7-130
7-130
7-130
HD8P-7508, OPT 801,802 . . . . . ... . ..
HD8P-7511 ........................
HD8P-7513
HD8P-7517
HD8P-7518
7-153
7-109
7-109
7-109
7-109
HD8P-5721
HD8P-5723
HD8P-5731
HD8P-5733
HD8P-5737
......... :..............
............... ;........
........................
.............. ;.........
........................
7-130
7-130
7-145
7-145
7-145
HD8P-7801 .........................
HD8P-7801, OPT 802 ...............
HD8P-7802 ...................... ; ..
HD8P-7803 .........................
HD8P-7803, OPT 802 ...............
7-115
7-153
7-115
7-115
7-153
HD8P-5738
HD8P-6300
HD8P-6504
HD8P-6508
HDSP-6621
............... ,........
.... ;; ......... : .........
.... , ....................
.... ,.; ..................
..................... ~ , ..
7-145
7-90
7-84
7-84
7-60
HD8P-7804 ..................•......
HD8P-7807 ........................ :
HD8P-7807, OPT 802 ...............
HD8P-7808 .........................
HD8P-7808, OPT 802 ...............
7-115
7-115
7-153
7-115
1-153
HDSP-6624
HD8P-7301
HD8P-7301,
HD8P-7302
HD8P-7303
.........................
........ , ........... ; ....
OPT 801,802 ......... ~.
.........................
.........................
7-60
7-115
7-153
7-115
7-115
HD8P-8600
HD8P-8601
HD8P-8603
HD8P-8605
HD8P-8606
............ '; .. .. .. . .. ..
........................
........................
........................
........................
7-138
7-138
7-138
7-138
7-138
HD8P-7303, OPT 801,802 ...........
HD8P-7304 ................. '... .' ....
HD8P-7307 .........................
HD8P-7307, OPT 801,802 ...........
HD8P-7308 ..... ; ........ , ..........
7-153
7-115
7-115
7-153
7-115
HD8P-8820
HD8P-8825
HD8P-8835
HDSP-A101
HDSP-A103
.........................
.........................
.........................
........................
........................
5-33
5-33
5-33
7-103
7-103
HD8P-7308,OPT 801,802 . . . . . . . . ...
HD8P-7311 ........... ; .............
HD8P-7313 ........... ; ~ ............
HD8P-7317 ...... ; ..................
HD8P-7318 .........................
7-153
7-115
7-115
7-115
7-115
HDSP-A107
HDSP-A108
HDSP-E100
HDSP-E101
HDSP-E103
.......... ;.............
........................
..................... -.. '.
........................
........................
7-103
7-103
7-103
7-103
HD8P-7401
HD8P-7402
HD8P-7403
HD8P-7404
HD8P-7407
.........................
.........................
.........................
.........................
.......... ; ... ; ...... ~ ...
7-115
7-115
7-115
7-115
7-115
HDSP-E106
HDSP-H101
HDSP-H103
HDSP-H107
HDSP-H108
........................
.................... -... :
................... .'. ...
........................
.........................
7-103
7-103
7-103
7-103
HD8P-7408
HD8P-7501
HD8P-7501,
HD8P-7502
HD8P-7503
........... , ......... , ...
.........................
OPT 801,802 ...........
.........................
....................... :.
7-115
7-115
7-153
7-115
7-115
HDSP-N100
HDSP-N101
HDSP-N103
HDSP-N105
HDSP-N106
.................... : . ..
........................
..................... : ..
. . . . . . . . . . . . . . . . . . . . . . ..
........................
7-103
7-103
7-103
7-103
7-103
HD8P-7503, OPT 801,802 ....... ~. ..
HD8P-7504 .........................
HD8P-7507 .........................
HD8P-7507, OPT 801, 802 ............
HD8P-7508 .................... : ....
7-153
7-115
7-115
7-153
7-115
HED8-0200
HED8-3000
HED8-3001
HED8-3050
HED8-5000
..................... : -:. 7-103
.......... '......... .- . . . .. 3-25
.................... : .... ' 3-30
......................... 3-25
.................... _... : 4-25
New Products in BOLD Type.
viii
7~103
7-103
HEDS-5010
4-25
HEDS-5100
4-25
HEDS-5110
4-25
HEDS-5200 ......................... 4-25
HEDS-5210 ......................... 4-25
HFBR-1522
HFBR-1523
HFBR-1524
HFBR-1531
HFBR-1532
8-13
8-13
8-13
8-13
8-13
HEDS-5300
HEDS-5310
HEDS-5500
HEDS-6000
HEDS-6010
.........................
.........................
.........................
.........................
4-25
4-25
4-19
4-33
4-33
HFBR-1533
HFBR-1534
HFBR-2204
HFBR-2208
8-13
8-13
8-78
8-90
8-98
HEDS-6100
HEDS-6110
HEDS-6200
HEDS-6210
HEDS-6300
.........................
.........................
.........................
...................' ......
.........................
4-33
4-33
4-33
4-33
4-33
HFBR-2402
HFBR-2404
HFBR-2406
HFBR-2412
HFBR-2414
8-78
8-37
8-37
8-37
8-37
HEDS-6310
HEDS-7500
HEDS-7501
HEDS-8923
HEDS-8924
4-33
......................... 4-41
................. ; ....... 4~41
......................... 4-25
......................... 4-25
8-37
HFBR-2416
HFBR-2501
8-60
HFBR-2502
8-60
HFBR-2503 ......................... ,8-60
HFBR-2521
8-13
HEDS-8925
HEDS-8926
HEDS-8927
HEDS-8928
HEDS-8929
.........................
.........................
.........................
.........................
.........................
HFBR-2522
HFBR-2523
HEDS-8931
HEDS-9000
HEDS-9100
HEDS-9200.
HEMT-1001
.......•................. 4-25
.......................... 4-7
................ , ........ 4-11
. . . . . . . . . . . . . . . . . . . .. . . .. 4-15
........................ 6-116
HFBR~2202
4-25
4-25
4-25
4-25
4-25
8-13
8-13
8-13
8-13
8-13
HFBR~2524
HFBR-2531
HFBR-2532
8-13
HFBR-2533
HFBR-2534 ......................... 8-13
8-78
HFBR-4202
HFBR-4501 .......................... 8-13
HFBR-4503
8~13
HEMT-3301 ........................ 6-116
HEMT-6000 ........................ 6-120
8-37
HFBR"0400
8-37
HFBR-0410
8-13
HFBR"0501
HFBR-4505
HFBR-4506
HFBR-4511
HFBR-4513
HFBR-4515
HFBR-1202 ............ ;.; ..........
HFBR-1204
HFBR-1402
,' ...... .
HFBR-1404
HFBR-1412 ............ ,. ........ '......
HFBR-4593
HFBR-4595 .........................
HFBR-AUD100 ......................
HFBR-AUD1 KM .....................
HFBR-AUS100 ......................
..................
HFBR-1414
HFBR-1502
HFBR-1510
HFBR-1512
HFBR-1521
8-78
8-86
8-37
8-37
8-37
. . . . . . . . . . . . . . .. . . . . . . . . .. 8~37
...................... '" 8-60
.......................... 8-60
....................... '" 8-60
.......................... 8-13
.. .. ... ... . . . . . .. . . ... ..
~
8-13
8-13
8-13
8-13
8-13
8-13
8-60
8-57
8 e 57
8~57
HFBR-AUS1 KM ................•.... 8-57
HFBR-AWD005 . . . . . . . . . . . . . . . . . . . . .. 8-57
HFBR-AWD010 ...................... 8-57
HFBR-AWD025 . . . . . . .. . . . . . . . . . . . . .. 8-57
HFBR-AWD050 ...................... : 8-57
New Products in BOLD Type.
ix
HFBR-AWD100
HFBR-AWS001
HFBR-AWSOOS
HFBR-AWS010
HFBR-AWS02S
......................
......................
......................
......................
..................... ;
8-57
8-57
8-57
8-57
8-57
HFBR-PNS1DM .....................
HFBR-PNSSDM. . . . . . . . . . . .. . . . . . . ..
HFBR-PUDSOO ......................
HFBR-PUSSOO
HFBR-QLS001
8-13
8-13
8-13
8"13
8-13
HFBR-AWSOSO ...................... 8-57
HFBR-AWS100 ...................... 8-57
HFBR-AXS001
8-57
8~57
HFBR-AXS010
HFBR-BXS001
8-57
HFBR-QLSOOS
HFBR-QLS010
HFBR-QLS020
HFBR-QLS030
HFBR-QLS04S
8-13
8-13
8-13
8-13
8-13
HFBR-BXS010
8-57
8-57
HFBR-CXS001
HFBR-CXS010 ...................... ·8-57
HFBR-PLS001
8-13
HFBR-PLSOOS
8-13
HFBR-QLS060
HFBR-QNS001
HFBR-QNSOOS
HFBR-QNS010
HFBR-QNS020
......................
......................
................... ; ..
......................
..... ; ................
8-13
8-13
8-13
8-13
8-13
HFBR-PLS010 ....................... 8-13
HFBR-PLS020
8-13
8-13
HFBR-PLS030
8-13
HFBR-PLS04S
8-13
HFBR-PLS060
HFBR-QNS030 .................... ..
HFBR-QNS04S ......................
HFBR-QNS060 ................. ; . . ..
HFBR-QUSSOO ......................
HLCP-A100 .........................
8-13
8-13
8-13
8-13
5-15
.....................
.....................
.................. ;...
. . . . . . . . . . . . . . . . . . . . ..
......................
8-13
8-13
8-13
8-13
HLCP-A100, OPT LOO, L01, L03, L04 ...
HLCP-A100, OPT S02 ................
HLCP-B100 .........................
HLCP-B100, OPT S02 . . . . . . . . . . . •. . ..
HLCP-C100 ..................... ; ...
5-51
5-53
5-15
5-53
5-15
HFBR-PMD020 ......................
HFBR-PMD030 . . . . . . . . . . . . . . . . . . . . ..
HFBR-PMD04S ......................
HFBR-PMD060 .................... ;.
HFBR-PMDSDM ....................
8-13
8-'13
8-13
8-13
8-13
HLCP-C100, OPT L01, L02, L03,
L04, L06 ...........
HLCP-C100, OPT S02 ...............
HLCP-D100 .........................
HLCP-D100, .OPT S02 ...............
5-51
5-53
5-15
5-53
HFBR-PND001
HFBR-PNDOOS
HFBR-PND010
HFBR-PND020
HFBR-PND030
......................
......................
.................... ;.
......................
......................
8-13
8-13
8-13
8-13
HLCP-E100
HCLP-E100,
HLCP-F100
HLCP-F100,
HLCP-G100
.........................
OPT S02 ............ . . ..
.........................
OPT S02 ................
. . . . . . . . . . . . . . . . . . . . . . . ..
5-15
5-53
5-15
5-53
5-15
HFBR-PND04S ......................
HFBR-PND060 .................... ;.
HFBR-PNDSDM .....................
HFBR-PNS001
HFBR-PNSOOS
8-13
8-13
8-13
8-13
8-13
HLCP"G100, OPT S02 ...............
HLCP-H100 .........................
HLCP-H100, OPT L01, L02, L03,
L04, LOS, L06 .......
HLCP-H100, OPT S02 ...............
5-53
5-15
HFBR-PLS1DM
HFBR-PLSSDM
HFBR-PMD001
HFBR-PMDOOS
HFBR-PMD010
8~13
8~13
.............. ...... .
HFBR-PNS010
8-13
HFBR-PNS020
8-13
HFBR-PNS030 ...................... 8-13
HFBR-PNS04S ...................... 8-13
HFBR-PNS060 ...................... 8-13
5-51
5-53
HLCP-J100 ......................... 5-41
~"
HLMP-0103
HLMP-0300
HLMP-0301
HLMP-0354
New Products in BOLD Type.
x
........................ 6-144
......................... 6-95
......................... 6-95
........................ 6-146
HLMP-0363
HLMP-0364
HLMP-0365
HLMP-0366
HLMP-0380
...................... ;.
...................•. ;...
........................
.................. ;.....
........................
6-152
6-152
6-152
6-152
6-146
HLMP-1301,
HLMP-1301,
HLMP-1301,
HLMP-1302
HLMP-1320
OPT 001, 002 ........... 6-132
OPT 010, 101 ........... 6-137
OPT 104 ............... 6-138
......................... 6-60
6-65
HLMP-0381
HLMP-0391
HLMP-0392
HLMP-0400
HLMP-0401
........................ 6-146
.......... : .............. 6-152
........................ 6"152
......................... 6~95
......................... 6-95
HLMP-1321
HLMP-1340
HLMP-1350
HLMP-1385
HLMP-1400
6-65
6-98
6-64
6-60
6-60
HLMP-0454
HLMP-0463
HLMP-0464
HLMP-0465
HLMP-0466
........................
........................
........................
........................
........................
6-146
6-152
6-152
6-15;2
6-152
HLMP-1401
HLMP-1401,
HLMP-1401,
HLMP-1401,
HLMP-1402
6-60
OPT 001, 002 ........... 6-132
OPT 010, 101 ............ 6-137
OPT 104 ............... 6-138
......................... 6-60
HLMP-0480
HLMP-0481
HLMP-0491
HLMP-0492
HLMP-0503
........................ 6-146
........................ 6-146
.............. ' .......... 6-152
......................... 6-152
......................... 6-95
HLMP-1420
HLMP-1421
HLMP-1440
HLMP-1450
HLMP-1485
6-65
6-65
6-98
6-64
6-60
HLMP-0504
HLMP-0554
HLMP-0563
HLMP-0564
HLMP-0565
......................... 6-95
........................ 6-146
........................ 6-152
........................ 6-152
........................ 6-152
HLMP-1503
HLMP-1503,
HLMP-1503,
HLMP-1503,
HLMP-1520
........................ ,6-60
OPT 001,002 ........... 6-132
OPT 010, 101 ........... 6-137
OPT 104 .............. .6-138
......................... 6-65
HLMP-0566
HLMP-0580
HLMP-0581
HLMP-0591
HLMP-0592
........................
........................
........................
........................
............ : ...........
HLMP-1521 ..................... ~ ... 6-65
HLMP-1523
6-60
HLMP-1540
6-98
HLMP-1550
6-64
HLMP-1585
6-60
6-152
6-146
6-146
6-152
6-152
HLMP-0904 ........................ 6-146
HLMP-0930 ........................ 6-146
HLMP-0931 ........................ 6-146
HLMP-1000 ......................... 6-58
HLMP-1002 ......................... 6-58
HLMP-1002, OPT 001, 002
6-132
HLMP-1002,
HLMP-1071
HLMP-1080
HLMP-1100
HLMP-1100,
OPT 010, 101 ........... 6-137
......................... 6-58
......................... 6-58
........................ 6-106
OPT 010 ............... 6-1'37
HLMP-1120
HLMP-1200
HLMP-1201
HLMP-1300
HLMP-1301
6-106
6-58
6-58
6-60
6-60
HLMP-1600
HLMP-1600,
HLMP-1600,
HLMP-1601
HLMP-1620
OPT 001.002 ...........
OPT 010, 101 ...........
........................
............... ,........
6-106
6-132
6-137
6-106
6-106
HLMP-1620,
. HLMP-1620,
HLMP-1621
HLMP-1640
HLMP-1640,
OPT 001. 002 ...........
OPT 010,101 .. ; ........
........................
................ ,.......
OPT 001, 002
6-132
6-137
6-106
6-106
6-132
HLMP-1640, OPT 010, 101 ...........
HLMP-1641 ........................
HLMP-1660
HLMP-1661
HLMP-1674 '" .'.', ." .. '. . ~ . . . . . ~ .- . . . . .
6-137
6-106
6-110
6-110
6-110
.
New Products in BOLD Type,
xi
HLMP-1675
HLMP-1687
HLMP-1688
HLMP-1700
HLMP-1719
6-110
6-110
6-110
6-102
6-102
HLMP-2685,
HLMP-2700
HLMP-2700,
HLMP-2720
HLMP-2720,
OPT 802 ................ 5-53
.......................... 5-8
OPT 802 ................ 5-53
........................... 5-8
OPT 802 ................ 5-53
HLMP-1740
HLMP-1760
HLMP-1790
HLMP-1800
HLMP-1801
......................... 6-44
......................... 6-44
........................ 6-102
......................... 6-44
......................... 6-44
HLMP-2735
HLMP-2735,
HLMP-2755
HLMP-2755,
.......................... 5-8
OPT 802 ............. ; .. 5-53
.......................... 5-8
OPT LOO, L01, L03,
L04, L06 ........... 5-51
HLMP-1819
HLMP-1820
HLMP-1840
HLMP-1841
HLMP-2300
......................... 6-44
......................... 6-44
...... , .................. 6-44
......................... 6-44
.......................... 5-8
HLMP-2755,
HLMP-2770
HLMP-2770,
HLMP-2785
OPT 802 ................ 5-53
.......................... 5-8
OPT 802 ................ 5-53
.......................... 5~8
HLMP-2300,
HLMP-2300,
HLMP-2350
'HLMP-2350,
HLMP-2400
OPT LOO, L01, L03, L04 ... 5-51
OPT 802 ................ 5-53
.......................... 5-8
OPT 802 ................ 5-53
.......................... 5-8
HLMP-2785, OPT LOO, L01, L02, L03, L04,
L05, L06 ........... 5-51
HLMP-2785, OPT 802 ................ 5-53
HLMP-2800 .......................... 5-8
HLMP-2800, OPT 802 ................ 5-53
HLMP-2400,
HLMP-2400,
HLMP-2450
HLMP-2450,
HLMP-2500
OPT LOO, L01, L03, L04 ... 5-51
OPT 802 ............ ; ... 5-53
.......................... 5-8
OPT 802 ................ 5-53
.......................... 5-8
HLMP-2820
HLMP-2820,
HLMP-2835
HLMP-2835,
HLMP-2855
HLMP-2500,
HLMP-2500,
HLMP-2550
HLMP-2550,
HLMP-2598
OPT LOO, L01, L03, L04 ... 5-51
OPT 802 .....•.......... 5-53
.......................... 5-8
OPT 802 ................ 5-53
......................... 5-49
HLMP-2855, OPT LOO, L01, L03,
L04, L06 ........... 5-51
HLMP-2855, OPT 802 ................ 5-53
HLMP-2870 .......................... 5-8
HLMP-2870, OPT 802 ................ 5-53
HLMP-2599
HLMP-2600
HLMP-2600,
HLMP-2620
HLMP-2620,
..................... '.... 5-49
........................... 5-8
OPT 802 ................ 5-53
.......................... 5-8
OPT 802 ................ 5-53
HLMP-2885 .......................... 5-8
HLMP-2885, OPT LOO, L01, L02, L03, L04,
L05, L06 ........... 5-51
HLMP-2885, OPT 802 ................ 5-53
HLMP-2898 ......................... 5-49
HLMP-2635
HLMP-2635,
HLMP-2655
HLMP-2655,
.............. '............ 5-8
OPT 802 ................ 5-53
.......................... 5-8
OPT L01, L02, L03,
L04, L06 ............ 5-8
HLMP-2899
HLMP-2950
HLMP-2965
HLMP-3000
HLMP-3000,
HLMP-2655,
HLMP-2670
HLMP-2670,
HLMP-2685
HLMP-2685,
OPT 802 ................ 5-53
.......................... 5-8
OPT 802 ...........•.... 5-53
...................... , ... 5-8
OPT L01, L02,L03, L04,
L05, L06 ........... 5-51
HLMP-3000, OPT 010, 100 ........... 6-139
HLMP-3001 ......................... 6-69
HLMP-3001, OPT 001,002 ........... 6-132
HLMP-3001, OPT 010,100 ........... 6-139
HLMP-3002 ......................... 6-69
New Products in BOLD Type.
xii
.......................... 5-8
OPT 802 ................ 5-53
.......................... 5-8
OPT 802 ................ 5-53
.......................... 5-8
........................ . 5-49
......................... 5-20
......................... 5-20
...... '................... 6-69
OPT 001,002 ........... ' 6-132
HLMP-3002,
HLMP-3002,
HLMP-3003
HLMP-3003,
HLMP-3003,
OPT 001, 002 ........... 6-132
OPT 010, 100 ........... 6-139
......................... 6-69
OPT 001,002 ........ ; .. 6-132
OPT 010, 100 ........... 6-139
HLMP-3507, OPT 010, 100 ........... 6-139
HLMP-3517 ......................... 6-81
HLMP-3517, OPT 001, 002 ........... 6-132
HLMP-3517, OPT 010, 100 ........... 6-139
HLMP-3519 ;........................ 6-81
HLMP-3050
HLMP-3105
HLMP-3105,
HLMP-3105,
HLMP-3112
......................... 6-69
........................ 6-106
OPT 001,002 ........... 6-132
OPT 010, 100 ........... 6-139
........................ 6-106
HLMP-3519,
HLMP-3519,
HLMP-3553
HLMP-3554
HLMP-3567
OPT 001,002 ........... 6-132
OPT 010, 100 ........... 6-139
......................... 6-71
......................... 6-71
......................... 6-75
HLMP-3112,
HLMP-3112,
HLMP-3200
HLMP-3201
HLMP-3300
OPT 001, 002 ........... 6-132
OPT 010, 100 ........... 6-139
......... ;............... 6-75
......................... 6-75
......................... 6-71
HLMP-3568
HLMP-3590
HLMP-3600
HLMP-3600,
HLMP-3600,
......................... 6-75
......................... 6-98
........................ 6-106
OPT 001,002 ........... 6-132
OPT 010, 100 ........... 6-139
HLMP-3300, OPT 001, 002 ........... 6-132
HLMP-3300, OPT 010, 100 ........... 6-139
HLMP-3301 ......................... 6-71
HLMP-3301, OPT 001,002 ........... 6-132
HLMP-3301, OPT 010, 100 ........... 6-139
HLMP-3601 ........................
HLMP-3601, OPT 001,002 ...........
HLMP-3601, OPT 010, 100 ...........
HLMP-3650 ........................
HLMP-3650, OPT 001, 002 ....•.... ;.
6-106
6-132
6-139
6-106
6-132
HLMP-3315
HLMP-3316
HLMP-3350
HLMP-3351
HLMP-3365
.........................
.........................
.........................
.........................
................. :.......
6-81
6-81
6-75
6-75
6-75
HLMP-3650, OPT 010,100 .... : ......
HLMP-3651 ...............•........
HLMP-3651, OPT 001,002 ...........
HLMP-3651, OPT 010, 100· ...........
HLMP-3680 ........................
6-139
6-106
6-132
6-139
6-106
HLMP-3366
HLMP-3390
HLMP-3400
HLMP-3400,
HLMP-3400,
......................... 6-75
...................... : .. 6-98
......................... 6-71
OPT 001,002 .......... ; 6-132
OPT 010, 100 ........... 6-139
HLMP-3680, OPT 001. 002 ...........
HLMP-3680, OPT 010, 100 ...........
HLMP-3681 ........................
HLMP-3681, OPT 001,002 ...........
HLMP-3681, OPT 010,100 ...........
6-132
6-139
6-106
6-132
6-139
HLMP-3401
HLMP-3401,
HLMP-3401,
HLMP-3415
HLMP-3416
......................... 6-71
OPT 001, 002 ........... 6-132
OPT 010,100 ........... 6-139
......................... 6-81
......................... 6-81
HLMP-3750
HLMP-3750,
HLMP-3750,
HLMP-3762
HLMP-3850
......................... 6-98
OPT 001,002 ........... 6-132
OPT 010, 100 ........... 6-139
......................... 6-71
......................... 6-98
HLMP-3450
HLMP-3451
HLMP-3465
HLMP-3466
HLMP-3490
.........................
.........................
.........................
.........................
....................... ;.
6-75
6-75
6-75
6-75
6-98
HLMP-3850,
HLMP-3850,
HLMP-3862
HLMP-3950
HLMP-3950,
OPT 001,002 ........... 6-132
OPT 010, 100 ........... 6-139
......................... 6-71
......................... 6-98
OPT 001,002 ........... 6-132
HLMP-3502 ....................•. ;.. 6-71
HLMP-3502, OPT 001,002 ... ~ ........ 6-132
HLMP-3502, OPT 010, 100 ........... 6-139
HLMP-3507 ......................... 6-71
HLMP-3507, OPT 001,002 ........... 6-132
HLMP-3950,
HLMP-3962
HLMP-3962,
HLMP-3962,
HLMP-4000
OPT 010, 100 ........... 6-139
......................... 6-71
OPT 001,002 ........... 6-132
OPT 010,100 ........... 6-139
........................ 6-113
New Products in BOLD Type.
xiii
-_."..
----,-,,-".----~-------
--~-------
---~.--~----------------.-----"'-
HLMP-4100
HLMP-4101,
tjLMP-4700
HLMP-4700,
HLMP-4700,
.... , ....... ;...... : .. ~' . .. 6-28
..................... ;~; . ,6-28,
, .... , ...•...•.. ; .•.. ;'.. 6-102
OPT 001,002 ..... ; ..• ~. 6.132
OPT 010, 100 .... , . . . . . .6-139
HLMP-6500, OPT P01,P02 .... i • • • •• ~-130
HLMP-6505 ....... , .......•. , ..... ,.,. 6,32
HLMP~6600 .....•..•....•..•.•..... ; 6-110
HLMP-6600, OPT 010; 011 .......... , 67122
HLMP-6600, OPT 021, 022 ....... i .... 6-126
HLMP-4719
tjLMP-4719,
HLMP-4719,
HLMP-4740
HLMP-5029
..•....•..•.. " . . . . . •..... 6-102
OPT 001, 002 ...•...... ~ ,6-132
OPT 010, 100 ........... 6~139
"........................ 6~102
............ , ..•..•... ;.. 6-141
HLMP-6600, OPT P01, P02 ..........
HLMP-6620 ..... '.' .. '.' ...... " .....
HLMP-6620, OPT 010 . . . . . . . . . . . . . ..
HLMP-6~20, OPT 011; 012 ...........
HLMP-6620, OPT 021,022 ...........
6-130
6-110
6-122
6-122
6-126
HLMP-6000 .......................... 6-38.
HLMP-6000, OPT 010 .... ,.......... 6-139
HLMP-6000,OPTOll,012 ........... 6-122
HLMP-6000. OPT 021,022 ......•..•.. 6-126
HLMP-6000, OPT P01,P02 .......... 6-130
HLMP-6620,
HLMP-6650,
HLMP-6653
HLMP-6653,
HLMP-6654
OPT POl, P02 ...... ,... 6-130
OPT 013 ............•.. 6-122
..., ...................•.. 6-43
OPT 013 ............... 6-122
......,................... 6-43
HLMP-6001
HLMP-6001,
HLMP-6001,
HLMP-6001,
HLMP-6203
, .............. :.......... .6-38
OPT 011,'012; .......... 6-136·
OPT 021, 022 ....••...... 6,-126
OPT P01, P02 ........... 6~130
,., .....,.... ;..... ; ..•.... J~-43
HLMP-6655
HLMP-6655,
HLMP-6656
HLMP-6656,
HLMP-6658
............... ,......... 6-43
OPT013 , . . .. . . . . . . . ... 6-122
..•..•.................... 6-43
OJ)T,013 ..... ~ . . . . . . . •• 67122
...................... ;.. 6,-43
HLMP-6203,
HLMP-6204
HLMP-6204,
HLMP-6205
HLMP-6205,
OPT 013 .. ; ..... ;'. .. . ... 6~38
............... , ........ ; .. 6-43
OPT 013 .. ;............. 6-1?2
.........,.. . . . . . . .. . . . . .. . 6-:-43
OPT 013 ............... 6~122
HLMP-6658, OPT 013 ............... 6-122
......................... 6-110
HLMP-6700, OPT 010 ............... 6~136
HLMP-6720 ......................... 6-110
HLMP-6720, OPT 010 ........... .•.. 6-136
HLMP-6206
HLMP-6206,
HLMP-6208
HLMP-6208,
HLMP-6300
........ ," ............. ; .. 6-43
OPT 013 ; ....... ; .. , .... 6-122
......................... 6-43
OPT 013 .... , .... ,.,. . .. .. 6~~22
........ ; ....•... ; ....•... 6~38
HI:.MP-6753 ............•......... ; .. 6-43
HLMP-6753, OPT 01.3 ........... ; .... 6-122
HLMP-6754 ...................... '... 6-43
HLMp-6754, qPT 013 .......•. " . . . .. 6-122
HLMP-6756, ........ ;' ...... ; ........ " 6-43
HLMP-6300,
HLrv'lP-6300,
HLMP-6300,
HLMP-6300,
HLMP-6305
OPT 010 ........... l ••• 6.136.
OPT 011,012 ... ~' ... , ... 6-122
OPT 021,.022 ............ 6-12~:
OPT P01, P02 ......... ; 6-130
.......................... 6.32
HLMP-6756,
HLMP-6758
HLMP-6758,
HLMP-6800
HLMP-6800,
HLMP-6400
HLMP-6400,
HLMP-6400,
HLMP-6400,
............• ; •.•....•.... 6_3~
OPT 010 .....• ;.....•. ;. 6~136,
OPT 011 ............. :... 6-122
OPT 021,022 ........ ,: .6-126
HLMP-6800, OPT 011, 012 .......... ,.:
HLMP-6800, OPT 021, 022 ...........
~LMP-6800, OPT POl, P02 ....... , ..
HI:.MP-6820 ........................
HLMP~6820, OPT010 ............ ;..
HLMP~6700
HLMP-6405 .......•. ; ..... :: ......... ;' 6-32
HLMP-6500 .............. ;.' .. '.... ,. '" !;i-38
I-:fLMP-6500, OPT 010 ............ ;.•.. 6-136
HlMP-6500, OPT 011, 012. i, •• ,; ••• " •• 6-122
HLMP-6500, OPT 021,02? .....•........ 6-126
New Products in BOLD Type,
OPT 013 ............... 6-122 '.
............ ; •......... ;.. 6-43
OPT 013. . .. . . . . . . . . . ... 6-122.
.................... ;. i . 6-110
OPT010 ................ 6.-136
6-122
6-126
6-130
6-110
6-122
HLMP-6820, ()PT 011, 012 ....... , : .... 6-122
HLMP-6~2Q, OPT 021, 022 .. , ........ : 6~126
HLMP-6820, OPT P01,:P02 .. ;.. , ..... 6.130
HLMP-6853 ......................... 6,-43
HLMp-6853, OPT 013 •.. , .... , .. :.•..•. 6-122
xiv
HLMP-6854
HLMP-6854,
HLMP-6855
HLMP-6855,
HLMP-6856
......................... 6-43
OPT 013 ............... 6-122
......................... 6-43
OPT 013 ............... 6-122
......................... 6-43
HLMP-K105, OPT 010,101 ...........
HLMP-K105, OPT 001, 002 ..........
HLMP-K150 . . . . . . . . . . . . . . . . . . . . . . . ..
HLMP-K150, OPT 010, 101 ...........
HLMP-K150, OPT 001, 002 ..........
6-137
6-132
6-24
6-137
6-132
HLMP-6856, OPT 013 ............... 6-122
HLMP-6858 ......................... 6-43
HLMP-6858, OPT 013 ............... 6-122
HLMP-7000 ........................ 6-102
HLMP-7000, OPT 011,012 ........... 6-122
HLMP-K155 . . . . . . . . . . . . . . . . . . . . . . . .. 6-24
HLMP-K155, OPT 010, 101 ........... 6-137
HLMP-K155, OPT 001, 002 .......... 6-132
HLMP-K400 ........................ 6"60
HLMP-K401 ......................... 6-60
HLMP-7000, OPT 021,022 ...........
HLMP-7000, OPT P01, P02 ..........
HLMP-7019 ........................
HLMP-7019, OPT 011,012 ...........
HLMP-7019, OPT 021, 022 ...........
6-126
6-130
6-102
6-122
6-126
HLMP-K402
HLMP-L250
HLMP-L251
HLMP-L350
HLMP-L351
........................
.........................
.........................
.........................
.........................
6-60
6-50
6-50
6-50
6-50
HLMP-7019, OPT P01, P02 .. . . . . . . . ..
HLMP-7040 ........................
HLMP-7040, OPT 011,012 ...........
HLMP-7040, OPT 021,022 ...........
HLMP-7040, OPT P01, P02 ..........
6-130
6-102
6-122
6-126
6-130
HLMP-L550 .........................
HLMP-L551 .........................
HLMP-M200 ........................
HLMP-M201
HLMP-M250
6-50
6-50
6-54
6-54
6-54
HLMP-A200 ......................... 6-85
HLMP-A300 ......................... 6-85
HLMP-A500 ......................... 6-85
HLMP-D101 ......................... 6-20
HLMP-D101, OPT 010,100 ........... 6-139
HLMP-M251
HLMP-M300
HLMP-M301
HLMP-M350
HLMP-M351
6-54
6-54
6-54
6-54
6-54
HLMP-D101, OPT 001, 002 ........... 6-132
HLMP-D105 ........................ 6-20
HLMP-D105, OPT 010, 100 .......... 6-139
HLMP-D105, OPT 001, 002 .......... 6-132
HLMP-D150 ........................ 6-24
HLMP-M500
HLMP-M501
HLMP-M550
HLMP-M551
HLMP-Q101
6-54
6-54
6-54
6-54
6-20
OPT 010,100 .......... 6-139
OPT 001, 002 .......... 6-132
........................ 6-24
OPT 010,100 .......... 6-139
OPT 001, 002 .......... 6-132
HLMP-Q150
HLMP-Q150,
HLMP-Q150,
HLMP-Q150,
HLMP-Q400
6-24
OPT 011, 012 ........... 6-122
OPT 021, 022 .......... 6-126
OPT P01, P02 .......... 6-130
........................ 6-38
HLMP-D400 ........................ 6-71
HLMP-D400, OPT 010, 100 .......... 6-139
HLMP-D400, OPT 001, 002 .......... 6-132
HLMP-D401 ........................ 6-71
HLMP-D401, OPT 010,100 ........... 6-139
HLMP-S200
HLMP-S201
HLMP-S300
HLMP-S301
HLMP-S400
............... . . . . . . . . ..
.........................
.........................
.........................
.........................
6-91
6-91
6-91
6-91
6-91
HLMP-D401, OPT 001, 002 .......... 6-132
HLMP-K101 ......................... 6-20
HLMP-K101, OPT 010, 101 ........... 6-137
HLMP-K101, OPT 001, 002 ........... 6-132
HLMP-K105 . . .. . .. . . .. . .. . .. .. . . .... 6-20
HLMP-S401
HLMP-S500
HLMP-S501
HLMP-T200
HLMP-T300
.........................
.........................
.........................
.........................
.........................
6-91
6-91
6-91
5-45
5-45
HLMP-D150,
HLMP-D150,
HLMP-D155
HLMP-D155,
HLMP-D155,
New Products in BOLD Type.
xv
HLMP-T400 ............... ; ......... 5-45
HLMP-T500 ......................... 5-45
HMDL-2416 ..................... ;.. 7-204
HMDL-2416TXV .................... 7-204
HMDL-2416TXVB . . . . . . . . .. . . . . . . ... 7-204
4N55/883B ........................ 9-140
4N55TXV .......................... 9-140
4N55TXVB . .. .. .. . .. .. .. .. . . .. ..... 9-140
5082-7100 ............. ; . . . . . . . . . . . .. 7-80
5082-7101 ........................... 7-80
HPDL-1414 . . . . . . . . . . . . .. . . . . . . . . . . .. 7-30
HPDL-2416. ......................... 7-38
JAN1N5765 ........................ 6-146
JAN1N6092 ........................ 6-146
JAN1 N6093 ........................ 6-146
5082-7102 ........................... 7-80
5082-7295 .......................... 7-174
5082-7300 ......................... 7-154
5082-7302
7-154
5082-7304
7-154
JAN1N6094 ........................ 6-146
JANTX1 N5765 ..................... 6-146
JANTX1N6092 ..................... 6-146
6-146
JANTX1 N6093
6-146
JANTX1 N6094
5082-7340
5082-7356
5082-7357
5082-7358
5082-7359
M001-01ACX .......................
M001-02ACX .......................
M001-03ACX .......................
M001-04ACX ...•.............. .... ..
SL5505 ........................ ;; ...
7-182
7c182
7-182
7c182
9-61
5082-7404
5082-7405
5082-7414
5082-7415
5082-7432
. . . . . . . .. . . .. . . . . . . . . . . . ..
..........................
..........................
..........................
..........................
7-169
7-169
7-169
7-169
7-169
16800A
16800A,
16800A,
16801 A
16801A,
............................. 3-56
OPT 001 ............... , ..... 3-62
OPT 002 .................... 3-64
............................. 3-56
OPT 001 .................... 3-62
5082-7433
5082-7441
5082-7446
5082-7610
5082-7610,
.. . . . . . . . . .. . . . . . . . . . .. . ..
...........................
...........................
...........................
OPT S01, S02 ............
7-169
7-174
7-174
7-121
7-153
16801A,
16830A
16832A
16840A
16842A
OPT 002 ................ ; ....
..............................
....................... : ......
.......................•.......
..............................
3-64
3-56
3-56
3-56
3-56
5082-7611
5082-7611,
5082-7613
5082-7613,
5082-7616
...........................
OPT S01, S02 ............
...........................
OPT S01, S02 ............
...........................
7-121
7-153
7-121
7-153
7-121
1 N5765 ............................ 6-146
1N6092 ........... : ................ 6-146
1N6093 ............... ~ ............ 6-146
1N6094 ............................ 6-146
4N45 ................................ 9-75
5082-7616,
5082-7620
5082-7621
5082-7623
5082-7626
OPT S01, S02 ............
....... ; ..................
...........................
..........................
..........................
7-153
7-121
7-121
7-121
7-121
4N46 .................................
4N51 ................................
4N51TXV ..........................
4N52 ...............................
4N52TXV ..........................
9-75'
7-182
7-182
7-182
7-182
5082-7650 ..........................
5082-7650, OPT S01,.S02 ............
5082-7651 ...........................
5082-7651, OPT S01, S02 ............
5082-7653 ..........................
7-121
7-153
7-121
7-153
7-121
4N53 ..............................
4N53TXV ..........................
4N54 ..............................
4N54TXV ..........................
4N55 .. : ...........................
7~182
7-182
7-182
7-182
9-140
5082-7653, OPT S01,S02 ............
5082-7656 ..........................
5082-7656, OPT 801, S02 ..... : . .. ...
5082-7660 ..........................
5082-7661 ...........................
7-153
7-121
7-153
7-121
7-121
New Products in BOLD Type.
xvi
7-154
7-158
7-158
7-158
7-158
..........................
OPT S01, S02 ............
..........................
OPT S01, S02 ............
..........................
7-121
7-153
7-121
7-153
7-121
6N134TXV ......................... 9-145
6N134TXVB ......................... 9-145
6N135 .............................. 9-57
6N135, OPT 010 ..................... 9-10
6N135, OPT 100 ..................... 9-10
5082-7730, OPT S01, S02 ............
5082-7731 ...........................
5082-7731, OPT S01, S02 ............
5082-7736 ..........................
5082-7736, OPT S01, S02 ............
7-153
7-121
7-153
7-121
7-153
6N136 .............................. 9-57
6N136, OPT 010 ...................... 9-9
6N136, OPT 100 ..................... 9-10
6N137 .............................. 9-35
6N137, OPT 010 ...................... 9-9
5082-7740 ...........................
5082-7740, OPT S01, S02 ............
5082-7750 ..........................
5082-7750, OPT S01, S02 ............
5082-7751 ...........................
7-121
7-153
7-121
7-153
7-121
6N137, OPT 100 ..................... 9-10
6N138 .............................. 9-67
6N139 .............................. 9-67
6N139, OPT 010 ...................... 9-9
6N139, OPT 100 ..................... 9-10
5082-7751, OPT S01, S02 ............
5082-7756 ..........................
5082-7756, OPT S01, S02 ............
5082-7760 ..........................
5082-7760, OPT S01, S02 ............
7-153
7-121
7-153
7-121
7-153
6N140A ...........................
6N140A/883B ......................
6N140TXV .........................
6N140TXVB ........................
8102801 EC .........................
5082-7663
5082-7663,
5082-7666
5082-7666,
5082-7730
9-159
9-159
9-159
9-159
9-149
8302401 EC ........................ 9-163
92261A .............................. 2-4
51605B .............................. 2-4
51605G .............................. 2-4
51605R .............................. 2-4
51610A .............................. 2-8
6N134 ............................. 9-145
New Products in BOLD Type.
xvii
.High Reliability
•
•
•
•
Screening Programs
Hermetic Lamps Selection Guide
Hermetic Displays Selection Guide
Hermetic Optocouplers Selection Guide
-------- - - - - - - - - -
High Reliability
can be enhanced by 100% screening and conditioning
tests. Lot capabilities can be confirmed by acceptance
qualfication test programs. MIL-D-87157 is used to
define the military requirements for plastic LED
indicators and displays.
Hewlett-Packard has supplied specially tested high
reliability optoelectronic products since 1968 for use in
state-of-the-art commercial, military, and aerospace
applications. To meet the requirements of high
reliability, products must be designed with rugged
capabilities to withstand severe levels of environmental
stress and exposure without failure. We have
accomplished this objective by designing a unique
family of hermetic products including lamps, displays,
and optocoup1ers which have proven their merits in
numerous advanced space and defense programs in the
international marketplace.
All testing is done by experienced Hewlett-Packard
employees using facilities which are approved by
DESC for JAN products and by customer inspection
for special programs. Environmental equipment
capabilities and operating methods of the test laboratory
meet MIL-STD-750 or MIL-STD-883 procedures.
Hewlett-Packard Quality Systems are in compliance
with MIL-Q-9858 or MIL-I-45208. The requirements
of MIL-STD-45662 are followed by Hewlett-Packard
Calibration Systems.
These products receive reliability screening and
qualification tests in accordance with the following
appropriate reliability programs: MIL-S-19500, MILD-87157 and MIL-STD-883. HP supplies JAN and
J ANTX LED indicators and optocoup1ers in
compliance with DESC selected item drawings and
parts with HP standard military equipment screening
programs for optocoup1ers and displays. In addition,
Hewlett-Packard optocoup1ers are considered hybrid
devices and are therefore line certified in accord~~ce
with MIL-STD-1772, as well as in conformance to
Appendices A and G of MIL-M-3851O.
Reliability programs are also performed to individual
customer control drawings and specifications when
needed. Some of these special testing programs are very
complex and may include Class S requirements for
microcircuits.
HP's epoxy encapsulated optoelectronic products are
designed for long life applications where non-man rated
or ground support requirements allow their use. As
with hermetic products, the capabilities of epoxy parts
1-2
---------'---
- - - - - - - - - - - - ----------
High Reliability
Optoelectronic Products
Hewlett-Packard offers the broadest line of high
reliability, solid state display products. They are
specially designed to withstand severe environmental
stresses and exposure without failure. This unique
product group includes lamps, integrated numeric and
hexadecimal displays, 5 x 7 dot matrix displays, and
fully intelligent monolithic 16 segment displays.
The integrated numeric and hexadecimal displays with
on board decoder/driver and memory are hermetically
sealed and have a character height of 7.4 mm (0.29 inch).
These devices are available in standard red; low power,
high efficiency red; high brightness, high efficiency red;
yellow; and a green epoxy sealed unit that conforms to
MIL-D-87157 hermeticity requirements. These devices
are designed and tested for use in military and
aerospace applications.
The hermetic solid state lamps are listed on the MILS-19500 Qua1ified Parts List (QPL). These devices
meet JAN and J ANTX quality levels and are furnished
in the basic lamp configuration or an integral panel
mountable assembly. Four colors are available: high
efficiency red, standard red, yellow and green. The
hermetic Ultra-bright lamps are provided with JAN
and J ANT~ equivalent testing. These devices are
sunlight viewable and are available in three colors: high
efficiency red, yellow and green.
The 5 x 7 dot matrix alphanumeric displays with
extended temperature range capabilities are available in
three character heights: 3.8 mm (0.15 inch), 5 mm
(0.2 inch) and 6~9 mm (0.27 inch). These displays are
available in several colors: standard red, high efficiency
red and yellow. Green devices conforming to MIL-D87157 hermeticity requirements are available in the
3.8 mm (0.15 inch) and 5 mm (0.2 inch) character
heights. The 5 mm (0.2 inch) and 6.9 mm (0.27 inch)
versions have the added features of having a solderglass seal and an even wider operating temperature
range than the 3.8 mm (0.15 inch) packiige. This wide
variety of character heights and colors makes these
products ideal for a variety of applications in avionics,
industrial cOntrols, and instrumentations.
The hermetically sealed 4N51-4N54 hexadecimal and
numeric displays are listed on the MIL-D-87157
Qualified Parts List and are supplied to Quality Level
A. Four types of devices are available: numeric
indicators with right-hand or left-hand decimals,
hexadecimal indicator and overrange display with righthand decimal.
In addition to the QPL products, Hewlett-Packard also
offers two in-house high reliability testing programs,
TXV and TXVB. The TXVB program conforms to
MIL-D-87157 Quality Level A test tables with 100%
screening and Quality Conformance Inspection testing
(QCI). The TXV program is a modification to Level A
testing and consists of 100% screening and Group A
testing. Products that are tested to TXV and TXVB
programs and comply with MIL-D-87157 hermeticity
requirements include the numeric and heXadecimal
displays, 5 x 7 dot matrix displays, and monolithic 16
segment displays. Detailed testing programs for these
devices are given in the individual data sheets.
1-3
-----------------
-------------------------------------
Optoelectronic Product
Qualification
DESC Qualified Products
Two military general specifications are presently in use
to qualify visible products. MIL-S-19500 establishes
the qualification requirements for JAN and JANTX
hermetic lamps. Four hermetic lamps and three
panel mountable hermetic lamps are listed on the MILS-19500 Qualified Parts List (QPL). Descriptions of the
individual devices and test program are given in the
slash (detail) specifications MIL-S-19500/467, /519,
/520 and/521.
MIL-D-87157 establishes the qualification
requirements for the 4N51-4N54 light emitting displays.
These four hermetic displays are listed on the MIL-D87157 Qualified Parts List. Descriptions of the
individual devices and test program are given in the
slash specification MIL-D-87157/1 (ER).
Hewlett-Packard Hi-Rei Testing Programs
By conforming to the requirements of MIL-D-87157
for all other .display and lamp products, not discussed
above, Hewlett-Packard is able to offer products of
significant value to. reliability oriented customers. MILD-87157 has provisions fodour different quality levels
as follows:
Level A Hermetic displays with 100% screening and
Group A, B and C testing.
Level B Hermetically sealed displays with Group A,
B, and C testing and without 100% screening.
Level C Non-hermetic displays with 100% screening
and Group A, Band C testing.
Level D Non-hermetic displays with Group A, B, and
Ctestingand without 100% screening.
Hewlett-Packard devices meeting the hermeticity
requirements of MIL-D-87157 include the hermetic
hexadecimal, numeric and alphanumeric displays
described in this section of the catalog. If the suffix
TXVB is added to the part number, the display is
tested to Level A with 100% screening and qualification
tests. When the suffix TXV is added. the devices are
submitted to 100% screening and Group A testing.
Detailed testing programs which follow the MIL-D87157 Quality Level A test tables are given in the
individual data sheets. The general MIL-D-87157
Quality Level C program for non-hermetic displays is
given on the following pages.
1-4
TABLE I. 100% SCREEN FORMAT FOR QUALITY LEVEL C
MIL-STD-750
Method
Test Screen
1. Precap Visuall1l
2072
Level C
When specified
2. High Temperature Storagel 11
1032
100%
3. Temperature Cyclingl1l
1051
100%
4. Constant Accelerationl 1.2 1
2006
When specified
5. Fine Leakl 11
1071
N/A
6. Gross Leakl11
1071
-
7. Interim Electrical/Optical Testsl 11
8. Burn-lnI 1.3 i
1015
9. Final Electrical/Optical Tests
10. Delta Determinationsl 11
11. External Visuall 3 1
N/A
When specified
100%
-
100%
-
When specified
2009
100%
Notes:
1. These tests are design dependent. The conditions and limits shall be specified in the detail specification when these tests are applicable.
2. Applicable to cavity type displays only.
3. MIL-STD-883 test method applies.
TABLE II. GROUP A ELECTRICAL TESTS[1]
LTPD
Subgroups
Subgroup 1
DC Electrical Tests at 25°C
5
Subgroup 2
Selected DC Electrical Tests at High Temperatures
7
Subgroup 3
Selected DC Electrical Tests at Low Temperatures
7
Subgroup 4
Dynamic Electrical Tests at TA = 25° C
5
Subgroup 5
Dynamic Electrical Tests at High Temperatures
7
Subgroup 6
Dynamic Electrical Tests at Low Temperatures
7
Subgroup 7
Optical and Functional Tests at 25°C
5
Subgroup 8
External Visual
7
Notes:
_
_
_
_
1: The specific parameters to be included for tests in each subgroup shall be as specified in the applicable detail specification.
1-5
----------
TABLE lila. GROUP B, CLASS A AND B OF MIL-D-87157
(CLASS C AND D DISPLAYS ONLY)
,
Test
MIL-STD-750
Method
Sampling Plan
1022
4 Devices/
Subgroup 1
Resistance to Solvents II I
2075[7J
Internal Visual and Design Verification[2. 5, 6J
o Failures
1 Device/
o Failures
Subgroup 2[3,4]
Solderabilityl I I
E[ectrical/Optical Endpointsl l I
2026
LTPD = 15
Subgroup 3
Therma[ Shockl l I
(Temperature Cycling)
1051
LTPD=15
1021
Moisture Resistancel I I
E[ectrica[/Optical Endpointsl l I
Subgroup 4
Operating Life Test (340 Hours)l1 I
Electrical/Optical Endpointsl I I
1027
LTPD = 10
Subgroup 5
Non-Operating (Storage) Life Test (340 Hours)ll I
Electrical/Optical Endpointsl l I
1032
LTPD = 10
Notes:
1.
2.
3.
4.
5.
6.
Test method or conditions in accordance with detail specification.
Not required for solid encapsulated displays.
The LTPD applies to the numberof leads inspected except in no ease shall
less than three displays be used to provide the number of leads required.
Whenever electrical/optical tests are not required as endpoints, electrical
rejects may be used.
7.
MIL-STD-883 test method applies,
Visual inspection is performed through the window display.
Equivalent to MIL-STD-883, Method 2014,
TABLE IVa. GROUP C, CLASS A AND B OF MIL-D-87157
MIL-STD-750
Method
Test
Subgroup 1[1]
Physical Dimensions
2066
Sampling Plan
2 Devicesl
o Failures
Subgroup 2[1]
Lead Integrityl61
2004
LTPD=15
Subgroup 3
Shockl 21
Vibration, Variable Frequencyl21
Constant Accelerationl 21
External Visuall 3 1
Electrical/Optical Endpointsl 4 1
2016
2056
2006
10100r 1011
LTPD= 15
Subgroup 4
Operating Life Test1 4,51
Electrical/Optical Endpointsl 4 1
1026
A = 10
Subgroup 5
Temperature Cycling (25 cycles min.)1 4 1
Electrical/Optical Endpointsl 4 1
1051
LTPD = 20
Notes
1. Whenever electrical/optical tests are not required as endpoints, electrical
rejects may be used.
2. Not required for solid encapsulated displays.
3. Visual requirements shall be as-specified in MIL-STD-883, method 1010 or
5.
lOll.
4.
Test method or conditions in accordance with detail specification.
6.
1-6
If a given inspection lot undergoing Group B inspection has been selected
to satisfy Group C inspection requirements, the 340 hour life tests may be
continued on test to 1000 hours in order to s~tisfy the Group C life test
requirements. I n such cases, either the 340 hour endpoint measurements
shall be made as a basis for Group B lot acceptance or the 1000 hours
endpoint measurements shall be used as the basis for both Group Band C
acceptance.
MIL-STD-883 test method applies,
Hermetically Sealed and High Reliability LED Lamps
Description
Device
Package Duiline Drawing
Part No.
1N5765
JAN1N576S1 4]
T
"....-
......
/
,
~ <:IT3 ~
\
Colorl 21
Red
(640 nm)
Package
Hermeticl
TO-4613]
. lens
Red
Diffused
Typical
luminous
Intensity
1.0 mcd
@20mA
2e 112111
70'
Typical
Forward
Voltage
1.6 V
@20mA
JANTX1 N576514]
1N6092
JAN1N6092[4]
High
Efficiency
Red
(626 nm)
5.0 mcd
@20mA
2.0 V
@20mA
JANTX1N6092[4]
1N6093
Yellow
(585 nm)
Yellow
Diffused
Green
(572 nm)
Green
Diffused
3.0 mcd
@25mA
2.1 V
@25mA
Red
Diffused
1.0 mcd
@20mA
1.6 V .
@20mA
5.0 mcd
@20mA
2.0 V
@20mA
3.0 mcd
@25mA
2.1 V
@25mA
JAN1N6093[4]
JANTX1 N609314]
/
~
-~
1N6094
JAN1N6094[4]
JANTX1N6094[4]
HlMP-0904
Red
(640 nm)
Panel Mount
Version
HlMP-0930
HlMP-0931
HlMP-0354
JANM195001
51901[4]
JTXM195001
51902[4]
HLMP-0454
0
JANM195001
52001[4]
JTXM195001
52002[4]
HLMP-0554
JANM195001
52101{4]
JTXM195001
52102[4]
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Yellow
Diffused
Green
(572 nm)
Green
Diffused
NOTES:
1. (-)112 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. Dominant Wavelength.
3. PC Board Mountable.
4. Military Approved and qualified for High Reliability Applications.
1-7
Page
No.
6-146
Hermetically Sealed and High Reliability LED Lamps (cant.)
Description
Device
Package Outline Drawing
r;(
Part No.
Colorl2]
HlMP-0363
High
Efficiency
Red
(626 nm)
HlMP-0391
HlMP-0392
HlMP-0463
HLMP-0491
Package
Hermetic
TO-1813]
lens
Typical
luminous
Intensity
Clear
Class
50 mcd
@20mA
201/211]
18
Typical
Forward
Voltage
2.0V
@20mA
Yellow
(585 nm)
50 mcd
@20mA
2.0 V
@20mA
Green
(572 nm)
50 mcd
@25mA
2.1 V
@25mA
50 mcd
@20mA
2.0V
@20mA
Yellow
(585 nm)
50 mcd
@25mA
2.0 V
@20mA
Green
(572 nm)
50 mcd
@25mA
2.1 V
@25mA
HlMP-0492
-,
Gill;,
-'
HLMP-0563
HLMP-0591
HlMP-0592
HLMP-0364
HLMP-0365
HLMP-0366
HLMP-0464
HLMP-0465
High
Efficiency
Red
(626 nm)
Panel
Mount
Version
Clear
Glass
HLMP-0466
0
HlMP-0564
HLMP-0565
HLMP-0566
NOTES:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. Dominant Wavelength.
3. PC Board Mountable.
1-8
Page
No.
6-152
- - - - - _......- - - - -
Hermetic Hexadecimal and Numeric Dot Matrix Displays
Description
Device
Ll
· .
IA)
[J
[J
· .
IB)
· .
Ie)
.....
·· ..
En
4N51
Numeric RHDP
4N51TXV
Decoder /Driver/Memory
M87157/00101ACXll) TXV - Hi Rei Screened
(4N51TXVB)
(A)
4N54
4N54TXV
M87157/00103ACXll)
(4N54TXVB)
(C)
4N53
4N53TXV
104ACXll)
(4N53TXVB)
(D)
Hexadecimal Built-in
Decoder /Driver/Memory
TXV - Hi Rei Screened
HDSP-0781
(A)
Numeric RHDP. Built-in
Decoder /Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
HDSP-0781
TXV
·.
(01
HDSP-0782
TXV
HDSP-0782
(B)
HDSP-0782
TXVB
HDSP-0783
(D)
7.4 mm (.29")
4 x 7 Single Digit
, Package:
8 Pin Glass Ceramic
15.2mm (.6"1 DIP
Truly Hermetic
Application
8 Pin Hermetic Built-in
15.2 mm (.6") DIP
with gold plated
leads
HDSP-0783
TXV
0
0
0
4N52
Numeric LHDP Built-in
4N52TXV
Decoder/Driver/Memory
M87157/00102ACX(1) TXV - Hi Rei Screened
(4N52TXVB)
(B)
HDSP-0781
TXVB
TIn
Package
Military High Reliability
Applications
Avionics/Space Flight
Systems
Fire Control Systems
HDSP-0784
TXV
HDSP-0784
TXVB
HDSP-0791
(A)
HDSP-0791
TXV
HDSP-0791
TXVB
HDSP-0792
(B)
HDSP-0792
TXV
7-182
0
Ground Support.
Shipboard Equipment
0
Ground_ Airborne. Shipboard 7-190
Equipment
Fire Control Systems
Space Flight Systems
Other High Reliability
Uses
Character Plus/Minus Sign
TXV - Hi Rei Screened
High Efficiency Red.
Low Power
··
0
NumeriC LHDP. Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Overrange .!: 1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
HDSP-0783
TXVB
HDSP-0784
(C)
Page
No.
Hexadecimal. Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
High Efficiency Red.
High Brightness
Numeric RHDP. Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
0
0
0
·
Numeric LHDP. Built-in
Decoder / Driver Memory •
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Ground. Airborne. Shipboard
Equipment
Fire Control Systems
Space Flight Systems
Other High Reliability
Uses
'.
HDSP-0792
TXVB
..
..
[1] Military Approved and Qualified for High Reliability Applications.
1-9
- - - - _ . __. -_._-----
..
-- -------------
Hermetic Hexadecimal and Numeric Dot Matrix Displays (continued)
Device
HDSP-0783
(D)
(See previous page)
HDSP-0783
TXV
Application
Color
Description
Overrange ±1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
·
··
High Efficiency Red.
High
Brightness
·
HDSP-0783
TXVB
HDSP-0794
(C)
HDSP-0794
TXV
HDSP-0794
TXVB
HDSP-0881
(A)
HDSP-0881
TXV
HDSP-0881
TXVB
HDSP-0882
(B)
HDSP-0882
TXV
HDSP-0882
TXVB
HDSP-0883
(0)
HDSP-0883
TXV
Hexadecimal. Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Numerrc RHDP. Built-in
Decoder I Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Yellow
Numeric LHDP. Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Overrange =1
TXV HI Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
HDSP-0883
TXVB
HDSP-0884
(C)
HDSP-0884
TXV
HOSP-0884
TXVB
(See previous page)
HDSP-0981
(A)
HDSP·0981
TXV
Hexadecimal. Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
High
Performance
Green
Numeric RHDP, Built·in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D·87157
HDSP·0981
TXVB
HDSP·0982
(B)
HDSP·0982
TXV
Numeric LHDP, Built·in
Decoder !Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D·87157
HDSP·0982
TXVB
HDSP·0983
(C)
HDSP·0983
TXV
Overrange ±1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL·D·87157
HDSP·0983
TXVB
.'
1-10
Page
No.
Ground. Airborne. Shipboard 7-190
Equipment
Fire Control Systems
Space Flight Systems
Other High Reliability
Uses
---------
Hermetic Hexadecimal and Numeric Dot Matrix Displays (continued)
Hexadecimal, Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
HDSP-0984
(D)
(See prevIous pagel
HDSP-0984
TXV
Page
No.
Applicalion
Color
Description
Device
·
··
·
High
Performance
Green
HDSP-0984
TXVB
Ground. Airborne. Shipboard 17-190
Equlpmenl
File Conllol Syslems
Space Fllghl Syslems
Olhel High Rellablilly
Uses
Hermetic Alphanumeric Displays
Description
Device
mI
r;:=;~:..
__ .J g
~r~~~J;
- - -"1!1
11:" ___ 10
~:-
=[:~Jn
'--
~
Color
HMDL-2416 4.1 mm (0.16") Four
Character Monolithic
HMDL-2416 Smart Alphanumeric
TXV
Display
HMDL-2416 Operating Temperature
TXVB
Range: -55'C to 100'C
Red
HDSP-2351
Yellow
HDSP-2351
TXV
HDSP-2351
TXVB
4.87 mm (0.19") 5 x 7 Four
Character Alphanumeric
Sunlight Viewable
Display
Operating Temperature Range:
-55'C to 100°C
HDSP-2352
···
Page
No.
Application
Military Equipment
High Reliability Applications
Military Telecommunications
• Military Avionics
• Military Cockpit
• Military Ground Support
Systems
7-204
7-214
High Efficiency Red
HDSP-2352
TXV
HDSP-2352
TXVB
HDSP-2353
High Performance
Green
HDSP-2353
TXV
HDSP-2353
TXVB
D~
HDSP-2010
I ::.: I
i ,.:-:!
!
1:.:.:'
I ~
. ~
~
j,1
:!-
HDSP-2010
TXV
HDSP-2010
TXVB
3.7 mm (.15") 5 x 7 Four
Character Alphanumeric
Operating Temperature
Range: -40'C to +85'C
TXV Hi Rei Screened
TXVB Hi Rei Screened to
Level A MIL-D-87157
Red, Red Glass
Contrast Filter
Extended temperature
applications requiring
high reliability.
liD Terminals
Avionics
7-198
For further information see
Application Note 1016.
-
1-11
......
·
··
__ ..-_
......... _.. _ - - - - - -
Hermetic Alphanumeric Displays (continued)
Paga
Dascrlptlon
Davlca
HDSp·2310
HDSp.2310
. TXV
HDSP.2310
TXVB
Color.
5.0 mm (.20") 5 x Hour
Character Alphanumeric
12 Pin Ceramic 6.35 mm
(.25") DIP with untinted
glass lens
Standard Red
Application
• Military Equipment
• Avionics
• High Rei Industrial
. Equipment
No.
7·228
1 - - - - - 1 Operating Temperature
HDSp.2311
HDSP.2311
TXV
HDSp·2311
TXVB
r-H-D-S-P.2-3---12-l
Range: ·55°C to +85°C
Yellow
True Hermetic Seal
TXV - Hi Rei Screened
TXVB - Hi Rei Screened
to Level A MIL·D·87157
High Elf. Red
HDSp·2312
TXV
HDSp·2312
TXVB
HDSp·2313
High Performance
Green
HDSP·2313
TXV
HDSP·2313
TXVB .
HDSp·2450
c ... ,
I
HDSp·2450
TXV
fiDSP.2450
TXVB
f-:-:,::c:-__:-:-I
HDSP·2451
HDSP·2451
TXV
HDSP·2451
TXVB
Operating Temperature
Range: .55° C to +85~ C
6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
28 Pin Ceramic 15.24 mm
(.6") DIP
True Hermetic Seal
TXV - Hi Rei Screened
Red
Yellow
TXVB -'Hi Rei Screened
to Level A MIL·D.87157
HDSp·2452
High Efficiency Red
HDSp·2452
TXV
HDSp·2452
TXVB
HDSp·2453
High Performance
Green
HDSp·2453
TXV
HDSP·24s3
TXVB '
1-12
• Military Equipment
• High Reliability
Applications
• Avionics
• Ground Support. Cock·
pit. Shipboard Systems
7.235
Hermetic Optocouplers
Several years ago, HP commenced the introduction of a
new series of 8 pin single and dual channel devices with
extraordinary capabilities. The HCPL-5700/l and
HCPL-5730/l are, respectively, single and dual channel
high gain Darlington units. The HCPL-5200/1 and
HCPL-5230/1 are high speed logic gate devices with a
wide supply voltage from 4.5 to 20 volts and high
CMR. The HCPL-5400/1 and HCPL-5430/1 are,
respectively, single and dual channel high speed
couplers featuring typical data rates of 40 Mbaud. The
most recent of our 8 pin hermetic products is the
HCPL-5760/1, a single channel, three chip, ACiDC to
logic interface optocoupler.**
Hewlett-Packard has selected several very popular
optocciupler types for assembly in our militarized
hermetic 8 pin and 16 pin dual in-line packages. These
devices offer a wide variety of LED input current
levels', speed and current transfer ratio. High
performance optocouplers are used in many U.S. and
international military, aerospace and high reliability
applications.
HP's hermetic optocouplers are classified by the U.S.
Department of Defense as hybrid microcircuits and
therefore comply with line certification requirements of
Mil-Std-1772. DESC* granted HP QML (Qualified
Manufacturing Line) status in April of 1987, which
allows us to continue the supply of both 883B marked
parts and DESC drawing parts. Virtually all of our
hermetic optocouplers may be purchased with
screening and quality conformance testing in
compliance with class level B of Mil-Std-883 as
standard catalog parts. Class S tested parts are also
available under special testing programs. Parts having
DESC* military drawings are 810280lEC and
830240lEC and are also available from stock.
Our Mil-Std-I772 line certification allows HPto
consider assembly and test of more technically
advanced hybrid devices where our expertise in
materials and processing may contribute to a new
product's success in OEM applications. Construction of
custom hybrid circuits requires the special working
relationship that HP has always enjoyed with its
customers toward the advancement of state-of-the-art
products.
The 8102801EC is a 6NI34 consisting of dual channel
high speed logic gates compatible with TTL inputs and
outputs. The common mode for this part was recently
improved to a minimum of 1000 VI p.s. A second family
of dual channel high speed logic gates, the HCPL1930/1, also features high common mode and has the
added feature of mput current regulation. The
830240lEC is a quad channel low input current photodarlington, ideal for MOS, CMOS, or RS232-C data
transmission systems. Finishing out our 16 pin devices
is the 4N55 product family. The 4N55 is a dual channel
coupler having low gain transistor output useful for
isolating circuits in power supply applications, logic
interfacing, and wide bandwidth analog applications.
*Defense Electronic Supply center (DESC) is an
agency of the United States Department of Defense
(DOD).
**Contact your HP field sales engineer for higher
withstand voltage up to 1500 V dc.
1-13
.., ..._----_._--
Plastic Optocouplers
Hewlett-Packard supplies plastic optocouplers with high
reliability testing for commercial/industrial applications
requiring prolonged operational life. Two of the most
frequently requested 100% preconditioning and screening
programs are given. The first program has burn-in and
electrical test only, the second program adds temperature
storage and temperature cycling. Either program is available for HP's plastic optocouplers. Electrical testing is to
catalog conditions and limits and will include 100% DC
parameters, sample testing of input-output insulation
leakage current and appropriate AC parameters. Contact
your local field representative for pricing and availability of
these programs.
PLASTIC OPTOCOUPLERS
PRECONDITIONING AND SCREENING 100%
COMMERCIAL BURN-IN·
Examinations or Tests
MIL-STD-883
Methods
Conditions
1. Commercial Burn-in
1015
TA= 70°C, 160 hours per designated circuit.
2. Electrical Test
Per specified conditions and min.lmax.
limits at TA = 25°C
SCREENING PROGRAM·
Examinations or Tests
MIL-STD-883
Methods
Conditions
1. High Temperature Storage
1008
2. Temperature Cycling
1010
10 cycles, -55°C to +125°C
3. Burn-in
1015
TA = 70°C, 160 hours per designated circuit
4. Electrical Test
5. External Visual
24 hours at 125°C
Per specified conditions and min.lmax.
limits atTA = 25°C
2009
'Contact your field salesman for details.
1-14
GROUP B TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)[l]
Method
Test
Subgroup 1
Physical Dimensions
(Not required if Group D is
to be performed)
Subgroup 2
Resistance to Solvents
Subgroup 3
Solderability
(LTPD applies to number of leads
inspected - no fewer than 3 devices
shall be used.)
Subgroup 4
I nternal Visual and Mechanical
Condillons
LTPD
2016
2 Devices/
o Failures
2015
4 Devices/
o Failures
2003
Soldering Temperature of 245 ±5° C for 10
seconds
2014
15
(3 Devices)
1 Device/
o Failures
Subgroup 5
Bond Strength
(1) Thermocompression (performed at
precap, prior to seal. LTPD applies to
number of bond pulls).
Subgroup 6
Internal water vapor content (Not
applicable - per footnote of MIL-STD)
Subgroup 7
Fine Leak
Gross Leak
2011
1014
Subgroup 8'
Electrical Test
Electrostatic Discharge Sensitivity
Electrical Test
(1) Test Condition D
15
-
Test Condition A
Test Condition C
5
Group A, Subgroup 1, except 11- 0
15
3015
Group A, Subgroup 1
...
(To be performed at Initial qualification only)
Group C testing is performed on a periodic basis from current manufacturing every 3 months.
GROUP C TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)[l]
Test
Subgroup 1
Steady State Life Test
Method
1005
Conditions
Condition B, Time + 1000 Hours Total
TA = +125°C
Burn-in conditions are product dependent
and are given in the individual device data
sheets.
Endpoint Electricals at 168 hours and
504 hours
Group A, Subgroup 1, except 11-0
Endpoint Electricals at 1000 hours
Group A, Subgroup 1
Subgroups 2 and 3 where applicable
Subgroup 2
Temperature Cycling
1010
Condition C, -65° C to +150° C, 10 cycles
Constant Acceleration
2001
Condition A, 5K Gs, V, and V2 axis only,
8 pin and 16 pin metal lid DIP
Condition E, 30K Gs, V, and V2 axis only,
8 pin ceramic lid DIP
Fine Leak
1014
Condition A
Gross Leak
1014
Condition C
Visual Examination
1010
Endpoint Electricals
Per visual criteria of Method 1010
Group A, Subgroup 1
1-15
LTPD
5
15
Group D testing is performed on a periodic basis from current manufacturing every 6 months.
GROUP D TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)!']
Test
Method
Conditions
LTPD
Subgroup 1
Physical Dimensions
2016
Subgroup 2
Lead Integ rity
2004
Test Condition B2 (lead fatigue)
15
Subgroup 3
Thermal Shock
1011
Condition B, (-55°C to +125°C)
15 cycles min.
15
Temperature Cycling
1010
Condition C, (-65°C to +150°C)
100 cycles min.
15
Moisture Resistance
1004
Fine Leak
1014
Condition A
Gross Leak
1014
Condition C
Visual Examination
Per visual criteria of Method 1004 and 1010
Endpoint Electricals
Group A, Subgroups 1, 2 and 3
where applicable
Subgroup 4
Mechanical Shock
2002
Condition B,.1500G, t = 0.5 ms,
5 blows in each orientation
Vibration Variable Frequency
2007
Condition A min.
Constant Acceleration
2001
Condition A, 5K Gs, V, and V2 axis only,
8 pin and 16 pin metal lid DIP
Condition E, 30K Gs, V, and V2 axis only,
8 pin ceramic lid DIP
Fine Leak
1014
Condition A
Gross Leak
1014
Condition C
Visual Examination
1010
Per visual criteria of Method 1010
Endpoint Electricals
Subgroup 5
Salt Atmosphere
15
Group A, Subgroups 1, 2 and 3
where applicable
1009
Condition A min.
1014
Condition A
Gross Leak
1014
Condition C
Visual Examination
1009
Per visual criteria of Method 1009
Subgroup 6
Internal Water Vapor Content
1018
5,000 ppm maximum water content at 100°C
Subgroup 7
Adhesion of lead finish
2025
15
2024
5 Devices
(0 failures)
Fine Leak
Subgroup 8
Lid Torque
(Applicable to 8 pin ceramic lid DIP only)
15
3 Devices
(0 failures)
5 Devices
(1 failure)
Notes:
1. Hewlett-Packard exercises a testing option as allowed by MIL-STD-883, Method 5008, Par. 3.1a. Paragraph 3.1 of Method 5008 states
that "hybrid and multichip microcircuits, which are contained in packages having an inner seal perimeter of less than 2.0 inches",
may be tested in accordance with the requirements of MIL-STD-883, Methods 5004 and 5005, with a change to the internal visual
from Method 2010 to Method 2017.
1-16
---~
--_ ..
--_.-----
Hermetic Optocoupler Product Screening and Quality Conformance Test Program
(MIL-STO-883 Class 8)
The following 100% Screening and Quality Conformance
Inspection programs show in detail the capabilities of our
hermetic optocouplers. This program will help customers
understand .the tests included in Methods 5004 and 5005
of MIL-STD-883 and to help in the design of special
product drawings where this testing is required. The
4N55/8838, 6N140A/8838, 5231/8838, 1931/8838,5401/8838,
5201/8838, 5431/883B, 5761/883B, 5701/8838, 5731/8838,
8102801 EC and 8302401 EC (DESC Selected Item Drawings
for the 6N134 a.nd 6N140A respectively) have standardized
test programs suitable for product use in military, high
reliability applications and are the preferred devices by
military contractors. (See note 1.)
100% Screening
MIL-STO-883, METHOD 5004 (CLASS 8 OEVICES)[l]
Test Screen
Method
Conditions
'.
1. Precap Internal Visual
2017
Condition B, DESC Partsl']
= 150°C, Time = 24 Hours minimum
2. High Temperature Storage
1008
Condition C, TA
3. Temperature Cycling
1010
Condition C, -65° C to +150° C, 10 cycles
4. Constant Acceleration
2001
Condition A, 5K Gs, Y" and Y2 , axis only, 8 pin and 16 pin metal lid DIP
Condition E, 30K Gs, Y" and Y2 , axis only, 8 pin ceramic lid DIP
5. Fine Leak
1014
Condition A
6. G ross Leak
1014
7. Interim Electrical Test
-
8. 8urn-ln
1015
9. Final Electrical Test
Electrical Test
Electrical Test
Electrical Test
-
10. External Visual
Condition C
Group A, Subgroup 1, except 11/0 (optional)
Condition B, Time = 160 Hours minimum, TA = 125°C
8urn-in conditions are product dependent and are
given in the individual data sheets.
Group A,
Group A,
Group A,
Group A,
Subgroup 1, 5% PDA applies
Subgroup 2
Subgroup 3
Subgroup 9
2009
Quality Conformance Inspection
Group A electrical tests are product dependent and are given in the individual device data sheets. Group A and 8 testing
is performed on each inspection lot.
GROUP A TESTING MIL-STO-883, METHOD 5005 (CLASS 8 OEVICES)[l]
LTPO
Subgroup 1
2
Static tests at TA = 25° C
Subgroup 2
Static tests at T A = +125° C
3
Subgroup 3
Static tests at T A = -55° C
5
Subgroup 4
Dynamic test at T A = 25° C (where applicable)
2
Subgroups 5, 6, 7 and 8
These subgroups are non-applicable to this device type
Subgroup 9
Switching tests at T A = 25° C
2
Subgroup 10
Switching tests at TA
= +125° C
3
= -55° C
5
Subgroup 11
Switching tests at TA
1-17
8 Pin Dual-In-Line Package
High-Speed Logic Gate Optocouplers
Description
Device
Application
3'
'~""
6 VE
HCPL-5200 Single Channel,
Hermetically Sealed
Wide Supply Voltage
Optocoupler
4
5GND
HCPL-5201 MIL-STD-883
Class B
Military/High
Reliability
HCPL-5230 Dual Channel,
Hermetically Sealed
Wide Supply Voltage
Optocoupler
High Speed Logic
Ground Isolation,
LSTTL, TTL, CMOS
Logic Interface
HCPL-5231 MIL-STD-883
Class B Part
Military/High
Reliability
HCPL-5400 Single Channel
Hermetically Sealed
High Speed
Optocoupler
High Speed Logic
Isolation, AID and
Paraliel/Serial
Conversion
2
';~.fJ
7 Vo
It¥i}IID-
2
po Vcc
P7 VOl
3~flID'------
6 V02
4
5 GND
.."
'~.."
High Speed Logic
Ground Isolation,
LSTTL, TTL, CMOS
Logic Interface
'~
II
7 VE
4
5 GND
HCPL-5401 MIL-STD-883
Class B Part
Military/High
Reliability
7 VOl
HCPL-5430 Dual Channel
Hermetically Sealed
High Speed
Optocoupler
High Speed Logic
Isolation, Communications, Networks,
Computers
HCPL-5431 MIL -STD-883
Class B Part
Military/High
Reliability
2
3
6 Vo
>.,.
2
\,
3
""
6 V02
4
5 GND
Typical
Data Rate
INRI]
Common
Mode
Specllied
Input
Current
Wilhstand
Test
Voltage"
Page
No.
5 M bills
1000 VII's
6.0 mA
500 Vdc
9-102
r-9-108
40 M bit/s
500 VII'S
9.0mA
500 Vdc
9-114
r-9-120
High Gain Optocouplers
Description
Device
'tg""
2,
3
4
7NC
6Vo
5GND
HCPL-5700 Single Channel
Hermetically Sealed
High Gain Optocoupler
MIL-STD-883
Class B Part
HCPL-5730 Dual Channel
Hermetically Sealed
7 VOl
High Gain Optocoupler
6 V02
5 GND HCPL-5731 MIL-STD-883
Class B Part
HCPL-5701
.
'~ "
2'
3 'l
4
I
Application
Typical
Data Rate
(NRII
Line Receiver, Low
60k bit/s
Current Ground
Isolation. TTLiTTL.
LSTTLITTL. CMOS/TTL
Military/High
Reliability
Line Receiver, Polarity
Sensing, Low Current
Ground Isolation
Military/High
Reliability
Current
Transfer
Ratio
Specified
Input
Current
Withstand
Test
Voltage"
Page
No.
200% Min.
0.5 mA
500 V dc
9-126
-
9-130
AC/DC to Logic Interface Optocoupler
Device
..
,
7NC
'~
'6Vo
2
3
4 --
Description
HCPL-5760
5GND
HCPL-5761
Single Channel
Hermetically Sealed
Threshold Sensing
Optocoupler
MIL-STD-883
Class B Part
Application
Limit Switch
Sensing, Low Voltage
Detector Relay
Contact Montitor
Military/High
Reliability
'Contact your HP field sales engineer for higher withstand voltage up to 1500V dc.
1-18
Typical
Data Rate
10 kHz
Input
Threshold
Current
2.5 mA TH+
1.3 mA TH-
Output
Current
Wilhstand
Test
Voltage"
Page
No.
2,6 mA
500 V dc
9-134
16 Pin Dual In-Line Package
High Speed Transistor Optocouplers
Device
rg~=~
I§:
~~ift
~~J
Description
Application
4N55
Dual Channel
Hermeticall,y Sealed
Analog Optical
Coupler
Line Receiver.
Analog Signal
Ground Isolation.
Switching Power
Supply Feedback
Element
4N55/8838
MIL-STO-883
Class 8 Part
Military/High
Reliability
~
Typical
Data Rate
INRZ)
Currenl
Transler
Ratio
Specilied
Input
Current
Wilhstand
Test
Voltage
Page
No.
700k bills
9% Min.
16mA
1500 V dc
g..140
Typical
Data Rate
INRZ)
Common
Mode
Specilied
Input
Current
Withstand
Test
Vollage
Page
No.
10M bills
1000 VII's
10mA
1500 V dc
9-145
High Speed Logic Gate Optocouplers
Device
Q~~
~
~vcc
Description
6N134
Dual Channel
Hermetically Sealed
Optically Coupled
Logic Gate
Line Receiver.
Ground Isolation for
High Reliability
Systems
8102801EC
DESC Approved
6N134
Military /High
Reliability
HCPL-1930
Dual Channel
Hermetically sealed
High CMR Line
Receiver Optocoupler
Line receiver. High
Speed Logic Ground
Isolation in High
Ground or Induced
Noise Environments
HCPL-1931
MIL-STD-883
Class 8 Part
Military/High
Reliability
il '~~v"
~}t!v.
~
I
a~_!i~'ND
~
:
IW1'
v,
.~~
r'~~
';'ND
~v,
~~OUT
I
;!VDUT
00"
Application
I 9-149
10M bills
1000 V/I'S
10 mA
1500 Vdc
g..153
Typical
Data Rate
INRZ)
Current
Transfer
Ratio
Specilied
Input
Current
Wilhstand
Test
Voltage
Page
No.
lOOk bills
300% Min.
05 mA
1500V dc
g..159
High Gain Optocouplers
Device
[jF~
~
{
~vcc
~}1~iJIvOi
~ 'F~~v"
~}J:~~V03
! ~ilv"
o~ JU ill'"
ID
~
-
Description
6N140A
(6N140)
Hermetically Sealed
Package Containing
4 Low Input Current.
High Gain Optocouplers
8302401EC
DESC Approved
6N140A
6N 140A / 8838 MIL-STD-883
(6N140/8838) Class 8 Part
Application
Line Receiver. Low·
Power Ground
Isolation for High
Reliability Systems
Military /High
Reliability
Use 8302401 EC
in New Designs
1-19
I-
9-163
I-
g..159
~
..•~
, '
'- ' ,
Ink-JetCotnponents
•
•
Thermal Ink-Jet Print Cartridge
Carriage Assembly
Ink-Jet Products
Non-contact printing permits marking on uneven
surfaces, a near impossible task for most printing
technologies; the silent operation makes the print
cartridge especially suitable for office, classroom, and
laboratory environments; and the small size and very
low power consumption of the print cartridge make it
ideal for battery/portable applications.
Thermal Ink-Jet Cartridges
Millions of Hewlett-Packard thermal ink-jet print
cartridges have demonstrated their performance and
reliability in HP ThinkJet and QuietTel printers. Now
this revolutionary, proprietary technology is available
for OEM printing devices. Its long list of advantages
make it attractive for a wide range of industrial and
commercial applications.
Among the many applications of this breakthrough
technology are: ticketing and receipting machines,
point-of-sale devices, printing calculators, medical and
scientific recorders, document marking machines, and
bar code printers.
The thumb-sized print cartridges completely integrate
all the printing elements and ink supply into a single,
disposable unit. Reliability is "designed-in", because
there are no moving parts, messy ribbons, or complex
ink pumps, typical of other printing technologies.
To put the printing technology of tomorrow in your
products today, look to Hewlett-Packard's thermal
ink-jet!
Downtime for ink replenishment or printhead failures
virtually eliminated, because the easy pop-outldropIn replacement requires no tools or technicians.
~s
2-2
Ink Jet Products
Device
Package Outline Drawing
Part No.
Color Ink
92261 A
Black
51605B
Blue
51605R
Red
51605G
Green
51610A
2-3
Description
Page
No.
Print cartridges
2-4
Carriage Assembly for the
Thermal Ink-Jet
Print Cartridge
2-8
rhO-
HEWLETT
~~ PACKARD
THERMAL INK-JET
PRINT CARTRIDGE
BLACK 92261 A
BLUE 51605B
RED 51605R
CREEN 516050
Features
• HEWLETT-PACKARD'S PROVEN THERMAL
INK-JET TECHNOLOGY
• LOW COST DISPOSABLE PRINTHEAD
• HIGH SPEED (1250 DOTS/SEC.)
• HIGH RESOLUTION (96 DOTS/INCH)
• 1/8 INCH PRINT ZONE (12 DOT VERTICALLY
IN-LINE)
• 10 MILLION DOT CAPACITY
(500K CHARACTERS)
• NON-CONTACT PRINTING
• SMALL SIZE
• VERY LOW POWER CONSUMPTION
• QUIET OPERATION
Description
• EASY REPLACEMENT
The HP Thermal Ink-jet print cartridge is a low cost
disposable 'inkjetprinthead which is suitable for a broad
range of industrial and commercial applications. The totally
self-contained print cartridge uses HP's Thermal Ink-jet
technology which overcomes the reliability problems of
conventional piezoelectric inkjet technologies.
Applications
• TICKETING AND RECEIPTING
Non-contact printing operation allows printing on irregular
surfaces at variable distances. It also eliminates printer
failures due to friction wear or foreign body interference.
The absence of any moving parts further enhances reliable
operation. The self-contained design and pressure interconnect allows fast, simple replacement, and it eliminates
the need for any other printer parts such as ribbons,
pumps, etc. It can be fired in any physical orientation.
• PORTABLE PRINTING
• SELECTIVE EJAR CODE PRINTING
• INDUSTRIAL AND COMMERCIAL MARKING
• POINT OF SALE PRINTING
The small size of the print cartridge makes it very suitable
for compact or portable printing devices. Its small size also
makes it possible to combine several cartridges to provide
larger print zones or higher throughput speeds. Virtually
silent operation matches the ergonomic needs of the office,
classroom and laboratory.
• ADDRESSING AND PERSONALIZATION
• SCIENTIFIC AND MEDICAL
INSTRUMENTATION
The power consumption of the print cartridge is radically
lower than other printing technologies. This dramatically
reduces the cost of the printer power supply and driver
electronics. It also makes battery operation possible, and
lowers radiated EMI levels. Driver circuitry can be made
with standard off-the-shelf components.
• PERSONAL COMPUTER PRINTING
2-4
A dot firing frequency of 1250 Hz provides a printing
speed of 13 inches/sec at 96 dots/inch resolution. This is
equivalent to over 155 characters per second at a density
of 12 characters per inch. A 2000 Hz dot frequency is
possible under certain low dot density printing conditions,
such as low resolution text. The typical ink capacity of 10
million dots will provide approximately 500K characters
using a common 96 dots/inch square font. Higher char-
acter capacities can be achieved by reducing the font
resolution (fewer dots per character).
Unlike multi-use ribbons used in dot matrix printers, the
print quality is consistent over the life of the print cartridge.
The print cartridge will print on a wide variety of papers
and porous surfaces. Optimum print quality is obtained on
HP designated papers.
PHYSICAL DIMENSIONS
r-10.125,
3.17 0.13
TYP
0.005)
•
I
±
r
ALL DIMENSIONS IN MILLIMETRES AND (INCHES)
22.23 ± 0,13
.lJ~~~====~__
1_0._87J.I' 0.005)
""~;J
4.27
~g:~
10.168 ~:g~)
ICENTER TO CENTER)
LOCATING
PINS
+0.13
B.30 -0.30 ) (CENTER TO CENTER)
(0.327 ~g:g~~
SUBSTRATE/CONNECTOR DETAIL
0.26410.0104) TYP.
12
NOZZLE 1:_;.
2.906
ATE
10.1144)
PL
1:",;_+'-___-,
NOZZLES [21
SUBSTRATE
[
12
0'1
010
09
08
1.420
NOTES:
10.=05:::59:;-)~TY:;;;P:-.-1-87
-Cile
CONTACT PADS 121
oo
o
o
o
COM
1
2
3
Cil
L J
5.022
10.1977)
1. DIMENSIONS ARE DEFINED BY PHOTOLITHOGRAPHIC PROCESS.
2. CONTACT PAD NUMBERS CORRESPOND TO NOZZLE NUMBERS.
3. CONTACT PADS ARE GOLD PLATED FOR CORROSION PROTECTION;
MATING CONTACTS SHOULD AVOID SCRATCHING.
2-5
Maximum Ratings
Parameter
Max. Rating
·10
Number of dots per print cartrldgell]
=
Condltioll$
Units
MOots
Nozzle life
2
MOots
Shelf life
18
Mos.
Shelf life
6
Mos.
Non-operating temperature
60
·C
Any single naule
At 25·C in container
At 25·C outside container
48 hours
Note:
1. Actual number of dots is application dependent. Value shown is typical.
Recommended Operating Conditions
Parameter
Symbol
Nozzle to Media Spaclng[l. 2)
Min.
Max.
Units
0.65
1.15
(0.045)
mm
(inches)
(o.D25)
Conditions
Operating Temperaturel:Jj
Top
10
40
·C
Operating Humidity[3j
Hop
5
80
%RH
25·C
-
0
4500
Meters
25"C
Operating Altitude
Notes:
1. Clogging may result if media comes in contact with print cartridge.
2. Larger spacing may be used but with degradation in print quality.
3. Prefiring may be req'uired in low humidity' and some low temperature conditions.
Electrical Specifications
Parameter
ReSistance (pad to common)
T":'
Symbol
Rpp
0
Dot frequency
Dots fired simultaneously
Operating Energy (pad to common)
Eo"
Max.
Units
70
Ohms
1250
Hz
2
Dots
Conditions
All nozzles firing
36.5
/.IJ
Tpw "'4.5/.15
Rpc'" 65 Ohms
40.5
/.IJ
Tpw "B.O /.IS
Rpc "85 Ohms
Tpw ;4.5JLS
Operating Voltage {Ped to common)
Vop
Pulse Wldth!lj
Tpw
4.5
4.5
Dead Time
TOT
0
0.5
Transition Time
Tr.
Tpw "6.0 JLs
8.0
/.Isee
500
nsec
/.Isec
10-90%
Note:
1. Any pulse width t'olerance must be compensated by tightening the voltage variation to maintain an equivalent pulse energy as if
there were no pulse width variation.
2-6
RESISTOR FIRING TIMING DIAGRAM
SCHEMATIC DIAGRAM
COMMON
R12
Rll
Rl0
R9
RB
R7
v
R6
R5
R4, R10
R3. R9
R4
r-\.
-+--~,
,\----'\--
~
____-J'r\ ____
,~
R3
R2
Rl
~~
R2, RB
supporting Information
RT, R7
L
For further information, refer to:
"Thermal Ink-jet Print Cartridge Designer's Guide",
Publication #5954-8400
"Hewlett-Packard Journal", May 1985,
Publication #5953- 8535.
I
TIME REQUIRED TO FIRE
ONE COLUMN OF 12 DOTS.---J
NOTES:
OTHER SEQUENCES ARE POSSIBLE.
These documents are available through your local HP
component sales office.
NO MORE THAN TWO DOTS FIRED SIMULTANEOUSLY.
safety Information
Ordering Information
The ink used in the print cartridge includes Diethylene
Glycol, which may be harmful if swallowed, but is nontoxic. Test results regarding toxicity and other health considerations are available on request.
PART NUMBER DESCRIPTION
This product complies with the Consumer Safety Protection Code of the Federal Regulations as well as the EPA
New Chemical Product Regulations.
No special procedures are necessary in disposing of the
print cartridge.
2-7
92261 A
Black tnk Print Cartridge
51605B
5i60SR
51605G
Blue Ink Print Cartridge
Red Ink Print Cartridge
Green Ink Print Cartridge
51610A
Carriage Assembly with Flex Olrcuit
from the Hewlett-Packard ThinkJet
Printer
Flin-
a:e..
HEWLETT
PACKARD
CARRIAGE ASSEMBLY FOR
THE THERMAL INK*JET
PRINT CARTRIDGE
51610A
For use With HP print cartridges
#: 92261 A, 51605B, 51605R,516050
"
Features
• PROVIDES MECHANICAL AND ELECTRICAL
INTERCONNECT FOR THE THERMAL INK-JET
PRINT CARTRIDGE
• EASY PRINT CARTRIDGE REPLACEMENT
• PRECISION MECHANICAL INTERCONNECT
• SIMPLE, RELIABLE, PRESSURE ELECTRICAL
CONTACTS
• 8 INCH PRINT ZONE SCANNING WIDTHS,'
• BUILT~iN POSITION DETECTOR ARM
Description
Note: Print cartridge not incl,ided with 51610A
Tl:1e 51!l10A carriage assembly is.a totally self-contained.
unit for connecting the HP Thermal Ink-jet print cartridge
to a host printing device. It includes all the parts necessary
to provide both electrical and mechanical interconnect
and comes totally pre-assembled. The 51610A is the same
carriage assembly used inihe HP ThinkJet printer.
Insertion or removal·of the print cartridge from the carriage assembly requires no tools and takes only a few
seconds to complete. Insertion is done by simply dropping
the cartridge into the carriage assembly and then rotating'
a cammed head latch upward as shown in Figur,e 2.
If:I ~CONNECTOR
ID IliJ
_ ...."v.......
CUSliION (2)
~~-
WEAl!
SHOE
I
CARRIAGE FRAME
.. ~
FLEX CIRCUIT SUPPORT
Figure. 1. Exploded View
2-8
13X. 1.310.050)
TRACE WIDTH
1
29.5
11.160)
rl~~iO)1
- - -n
8-12
591
(2.325)
SURFACE
FINISH
rnm,,,~,"J~-U
CARRIAGE ROD
06342 +0 000
-0,005 DIA
+0.0000)
( 02497 -00002
.
STRAIGHTNESS 0.076 (0.003)
NOZZLE PLATE
DETAIL
[3J
DIMENSIONS ARE IN MM (INCHES).
@]
PROVIDES PRIMARY MOUNTING SURFACE. MATERIAL SHOULD BE 303 STAINLESS STeEL WITH CLEAR
PASSIVATION FINISH. NO LUBRICATION IS NECESSARY OR RECOMMENDED.
o
NOTED PARTS ARE NOT INCLUDED IN CARRIAGE ASSEMBLY, BUT ARE SHOWN TO ILLUSTRATE
APPLICATION.
m
MATERIAL IS NYLON 6/6 BLENDED WITH GLASS FIBER (30 %), TFE (13 %) AND SILICONE (2
%J.
@] 6~~~~D:~OCU~~R~~~~~~:;~~~TA~CTRH~S~::~N;HzgEN!GAINST THE PRINTER RAIL.
I!J
:~~61~i~~~~~~; REFERENCE POINT. MATERIAL IS ACETAL FILLED WITH 20 % TFE, lNP # FULTON
[2J ge~~A;ri :tt~E~~~~~~~~~DO~I~~C3KOE~:~ROINCHES MINIMUM HARD GOLD (KNOOP 130 MINIMUM
Figure 2. Outline Drawing With Printer Interface.
2-9
Electrical connection to the host printer may be made with
a standard printed circuit board connector, Amp
#1-520315-3.
A flexible printed circuit provides electrical connection to
both the print cartridge and the host printer without the
need for additional connectors. This flex circuit also allows
the print cartridge to be scanned across print zone widths
of up to 8 inches.
A home position detector arm on the carriage assembly
may be used to detect when the carriage assembly passes
one or more detector locations on the printer. This may be
done by passing the detector arm through an interruptable
type optical sensor. Suggested parts: Optek #K-8150,
Kodenshi #SG-HP01.
A specially designed pressure interconnect system provides
reliable electrical contact to the print cartridge over a wide
range 'of environmental conditions while minimizing any
damage to the print cartridge contact pads. Electrical
contact is enhanced by using a special dimpling technique
on the flex circuit. This provides a greater degree of
insensitivity to paper dust and ink contamination. It also
makes the contact area easy to clean if contaminants
become excessive (see Maintenance).
For continuous sensing arid control of carriage motion,
HP offers an extensive line of rotary and linear motion
sensing and control components. Contact your local
Hewlett-Packard Component Sales Representative for more
information. '
Design Considerations
Maintenance
The carriage assembly is intended to be mounted on a
carriage rod and moved with a drive cable as shown in
Figure 2. The direction of drop firing is controlled by the
angular position of the carriage assembly on the carriage
rod. A wear shoe (see Figure 2) provides the means for
maintaining this angular reference by riding on a low
friction printer rail in the host printer. Ifink firing is done in
a horizontal orientation, gravitational forces on the carriage
assembly c~n be utilized to maintain this mating.
No routine cleaning or lubrication is required for the
carriage assembly. If excessive contamination of the electrical contacts causes loss of print, gently wipe the contacts with a swab dampened with Iso Propyl Alcohol as
shown in the Print Cartridge Designer's Guide. Avoid
harsh scrubbing.
supporting Information
The,51610A-carriage assembly is intended to be used in
applications where the paper path is curved, such as with
a round printer platen as'shown in Figure 2. This,allows
the paper to be brought closer to the print cartridge
nozzles than with a flat paper path. Optimum print quality
is ,obtained by maintaining the recommended nozzle to
paper spacing of 0.65 to 1.15 mm. Larger spacings are
possible, but with some degradation in print ,quality (see
Thermal Ink-jet Print Cartridge Designer's Guide). To maintain the recommended spacing, it is important that the
printer designer maintains good dimensional control from
the printer/carriage mating surfaces to the paper surface,
and understands which tolerances are important in a given
application.
2-10
Title
HPPub#
Thermal Ink-jet Print Cartridge Data Sheet
5954-8399
Thermal Ink-jet Prjnt Cartridge
Designer's Guide
5954-8535
Hewlett-Packard Journal, May 1985
5953-8535
2-11
:j
','
Bar Code Contponents
•
•
•
•
•
SmartWand
Digital Wands
Decoder ICs
Optical' Sensor
Readers
---
----- -- ---- ------ -----------------
- - - - - - - ------------
Bar Code Products
particularly for the commercial/office environment
where control over label quality is high. For those
customers beginning to use barcode scanners or
addressing consumer applications, Digital Bar Code
Wands (HEDS-3XXX) provide a very cost
effective solution.
The HP SmartWand family (HBCR-8XXX) is the
latest addition to the wide range of bar code products
offered by Hewlett-Packard. The HP SmartWand is an
intelligent peripheral designed to easily add bar code
scanning capability to any host system which can
support a 5 V serial asynchronous interface. This device
is designed specifically for the OEM who would rather
not expend valuable resources developing software and
integrating system hardware to support bar codes. A
powerful microcomputer, bar code decoding software,
optical and escape sequence programmability, nonvolatile configuration memory, and a high performance
contact scanner, are all combined into a standard size
industrial wand package.
The decoder IC family now includes three product
lines. The most recent, HBCR-20l0, is a CMOS
version of the Multi-Purpose HBCR-2000. This
product is especially well suited for low power/portable
applications_ and like the HBCR-2000, can decode the
output from virtually any hand-held scanning device,
including hand-held lasers and other solid state noncontact scanners. The general purpose digital wand
decode IC, HBCR-1800, offers both full duplex serial
or parallel output and provides a powerful, cost
competitive decode solution. All the decode ICs are in
40 pin DIP packages.
The HP digital wand selection now includes four
product families to meet the performance and price
requirements of every customer application. The stateof-the-art Low Current Digital Bar Code Wands are
available in both a metal case for indoor/outdoor
rugged industrial applications (HBCS-6XXX) and a
polycarbonate case for commercial/office applications
(HBCS-5XXX). Through an advanced/optical sensor
and signal processing circuitry, these wands are able to
provide superior performance while drawing 3.5 rnA at
5 V. In addition to the very low power requirements,
the advanced design allows performance improvements
which include high ambient light rejection, including
direct sunlight; a wider range of resolution choices; and
a sensor which reads thermally printed bar codes. For
customers who do not require the state of the art
performance of the Low Current Digital Bar Code
Wands the Sapphire Tip Digital Bar Code Wands
(HBCS-2XXX) offer an attractive alternative,
Hewlett-Packard's Industrial Digital Slot Reader,
HBCS-7XXX, is a rugged scanner designed specifically
for reading bar codes printed on I.D. cards, badges,
heavy paper stock, or traveling forms. It features a large
slot width for handling even multiple laminated cards, a
wide scan speed range, and digital output that is
compatible with wand decoding software.
Completing the product mix is the High Resolution
Optical Reflective Sensor, HBCS-ll00. The HBCS1100 is a unique 0.19 mm resolution sensor packaged in
a standard TO-5 header. This product is a cost
effective, dependable solution.
3-2
Bar Code Wands
Package Outline Drawing
~
~~.!::---
Part No.
Description
Features
HBCR·8100 HP SmartWand
Programmable Contact
Bar Code Reader
Low Resolution
(0.33 mm)
HBCR-8300 HP SmartWand
Programmable Contact
Bar Code Reader
Medium Resolution
(0.19 mm)
HBCR-8500 HP SmartWand
Programmable Contact
Bar Code Reader
High Resolution
(0.13 mm)
~
~
~
~
~"'1t!.
~
~
~
HBCS-5000 Low Current Digital
Bar Code Wand
(with Switch)
Resolution 0.33 mm
HBCS-5100 Low Current Digital
Bar Code Wand
(without Switch)
Resolution 0.33 mm
HBCS-5200 Low Current Digital
Bar Code Wand
(with Switch)
Resol'ution 0.19 mm
·
··
·•
·
·
Automatic Recognition and Decode of
Standard Codes
5 V Serial Asynchronous Output
All Code Reading Parameters Optical/Escape
Sequence and Configurable
Configuration Stored in Non-Volitile Memory
Standard Size Epoxy Coated Metal Case
655 Nanometer Sensor on Low and Medium
Resolution
Direct Sunlight Operation
·
·· o
·
··•
Low Continuous Current Draw
(Less Than 5 mAl
High Ambient Light Rejection
to 45' Scan Angle
Push to Read Switch for Ultra Low Power
Consumption
Rugged Polycarbonate Case
Sealed Sapphire Tip
Full Line of Options Available
HBCS-5300 Low Current Digital
Bar Code Wand
(without Switch)
Resolution 0.19 mm
HBCS-5400 Low Current Digital
Bar Code Wand
(with Switch)
Resolution 0.13 mm
HBCS-5500 Low Current Digital
Bar Code Wand
(without Switch)
Resolution 0.13 mm
HBCS-6100 Low Current Digital
Bar Code Wand
Resolution 0.33 mm
HBCS·6300 Low Current Digital
Bar Code Wand
Resolution 0.19 mm
HBCS·6500 Low Current Digital
Bar Code Wand
Resolution 0.13 mm
3-3
·
·•• o
·•
Low Continuous Current Draw
(Less Than 5 mAl
High Ambient Light Rejection
to 45' Scan Angle
Sealed Sapphire Tip
Metal Case
Full Line of Options Available
Page
No.
3-6
3-13
Bar Code Wands (Cont.)
Package Outline Drawing
~
~
~
Part No.
Description
Features
HBCS-2200 Sapphire Tip
Digital Bar Code Wand
(with Switch)
Resolution 0.19 mm
HBCS-2300 Sapphire Tip
Digital Bar Code Wand
(without Switch)
Resolution 0.19 mm
HBCS-2400 Sapphire Tip
Digital Bar Code Wand
(with Switch)
Resolution 0.19 mm
~
HBCS-2500 Sapphire Tip .
Digital Bar Code Wand
(without Switch)
Resolution 0.13 mm
~
HEDS-3000 Digital Bar Code Wand
(with Switch)
Resolution 0.3 mm
~
HEDS-3050 Digital Bar Code Wand
(Shielded)
Resolution 0.3 mm
Page
No.
··•
··•
·
Digital Output
0-45 0 Scan Angle
Replaceable Sapphire Tip
Internal Shielding
Push-to-Read Switch Available for Low Power
Applications
Rugged Polycarbonate Case
Full Line of Options Available
3-19
··
··
·•
Digital Output
0-30 0 Scan Angle
Replaceable Tip
Internal Shielding Available for Improved
Electrical Noise Rejection
Push-to-Read Switch Available for Low Power
Applications
Full Line of Options
3-25
Component Level Bar Code Readers
Package Outline Drawing
Part No.
Description
Features
HBCR-1800 Bar Code
Decoder IC
~::::::::::::::::::: :I
HBCR-2000 Multi-Purpose
Decoder IC
"
HBCR-2010 CMOS Multi:Purpose
Decoder IC
Package outline drawings not drawn to scale.
3-4
··
··
·
·•
·•
•
·
··
··
Page
No.
Industry $tandard Bar Codes
Automatic Code Recognition
Full Duplex Serial or Parallel ASCII Output
Single 5 Volt Supply
3-31
Accepts Inputs from All Hand-Held
Scanners, Including Lasers
Largest Selection of Codes Available
Automatic Code Recognition
Serial ASCII Output
Standard 40 Pin Package
3-37
CMOS Low Power Design
Accepts Inputs from All Hand-Held
. Scanners, Including Lasers
Largest Selection of Codes Available
Automatic Code Recognition
Serial ASCII Output
Standard 40 Pin Package
3-43
Component Level Bar Code Readers (Cont.)
Package Outline Drawing
f
01
1
[[8
f
01
[[8
:1
Part No.
Description
Features
HBCS-7000 Industrial Digital
Slot Reader,
Visible Red,
Resolution 0.19 mm
HBCS-7001 Optics/Electronics
Module, Visible Red,
Resolution 0.19 mm
0
0
0
0
0
125 Mil Slot Width
Epoxy Finshed Metal Housing
Wide Scan Speed Range
Tamper Proof Design
Digital Output
Page
No.
3-44
HBCS-7100 Industrial Digital
Slot Reader,
Infra-Red
Resolution 0.19 mm
HBCS-7101 Optics/Electronics
Module, Infra-Red,
Resolution 0.19 mm
Optical Reflective Sensors
Package Outline Drawing
~
Part No.
Description
Features
HBCS-1100 High Resolution
Optical Reflective
Sensor
0
•
0
0
0
0.19 mm spot size
Fully Specified and Guaranteed for
Assured Perfomance
Visible Light Source can Detect Most Colors
Photo IC Detector Optimizes Speed and
Response
Standard To-5 Header
Page
No.
3-50
Bar Coder Readers
Package Outline Orawlng
Part No.
Description
~
16800A
Programmable
Bar Code
Reader
~!~U~
Features
~
~
.'
.~~
'.~~
&
0
0
~~
.?JY
0
0
0
0
16801A
Non-Programmable
Bar Code
Reader
~
3-5
Flexible Configuration
All Standard Industrial and Commercial Bar
Codes Supported
Computer Control and Simple Operator
Feedback (16800A only)
Internal Power Supply
Meet UL, CSA, FCC Class B, VDE Level B
Low Current Digital Bar Code Wand Included
Page
'No.
3-56
F/i;-
HEWLETT
~~ PACKARD
HP smartWand
programmable Contact
Bar Code Reader
HBCR'S300
General purpose
HBCR·S500
High Resolution
HBCR-8100
low ReSolution
Description
prevent dust, dirt, and liquid contaminants from degrading
or destroying components inside the wand.
The HP SmartWand is an intelligent peripheral designed to
easily add bar code scanning capability to any host system
which can support a 5 V serial asynchronous interface. A
powerful microcomputer, bar code decoding software, optical and escape sequence programmability, non-volatile
configuration memory, and a high performance contact
scanner, are all combined into a standard size industrial
wand package. This integrated system transmits decoded
bar code data in a serial ASCII format, effectively freeing
the host system processor from the decoding task. The
optics and low power electronics allow operation in a wide
range of environments including direct sunlight, intense
aritificial light, and' in ; electromagnetic fields caused by
motors or radio frequency transmitters.
The HP SmartWand automatically recognizes and decodes
standard bar code symbologies. Code type identification,
label length checking, and check character verification
options when enabled ensure a high level of data integrity.
A power-on memory self test option ensures the decoder
is operating properly. Various code selections, interface
protocols, and other control options, can be selected and
automatically stored in non-volatile memory by either manually scanning a special bar code menu or transmitting
escape sequences from the host system.
In addition, the HP SmartWand has the ability to convert
any of the standard bar code symbologies to Code 39 and
emulate the undecoded output of a digital wand. This
allows an existing decode system, which can decode Code
39, to inClude symbologies not previously available.
The epoxy coated, textured metal case has O-ring seals at
each end, a labyrinth strain relief for the cord, and a
replaceable sealed sapphire tip. These design features
Block Diagram
3-6
Contact Scanner performance
SUMMARY
synthetic sapphire ball which contacts the labels is self
cleaning and nearly impervious to wear: The low weight
and compact shape allows ease of use and helps to
reduce worker fatigue. The rugged industrial design allows
use in both indoor and outdoor environments.
The HP SmartWand is a high performance contact bar
code reader designed to scan and decode bar code labels
located on uniform surfaces, The optics in the wand are
designed to operate with the tip touching the bar code
labels while scanning, The scanner is capable of reading
through plastic laminates up to 0,25 mm (0,010") thick. The
TYPICAL WAND CHARACTERISTICS
HBCR-8300
Ge,neral Purpose
Parameter
HBCR-asoo
HighR~solution
HBCR-8100
Low Resolution
0.13 mm (0.005 in,)
0.33 mm (0,013 in,)
Wavelength
655 nQl; (visible red)
820 nm (infrared)
655 nm (visible red)
Scan Speed
3-50 in.lsec;
3-50 in.!sec.
3-50 in.lsec.
0° - 40'
0° - 40'
0° ,. 40°
45%
45%
45%
No'minal Narrow Element Width
Tilt Angle
Minimum Bar/Space Contrast
at Specified Wavelength
ENVIRONMENTAL PERFORMANCE
Parameter
Conditions
Operating Temperature
-20' to +70°C (_4' to 158'F)
Storage Temperature
-40' to +70°C (-40° to +158'F)
Humidity
5% to 95% (non-condensing)
Operating Altitude
Sea Level to 4,600 metres (15,000 feet)
Storage Altitude
Sea Level to 15,300 metres (50.000 teet)
Vibration
Random: 5-500 Hz, 3.41 g rms. 10 minutes per axis
Swept Sine: 55-500 Hz, @ 3 g. 1 minute/octave, 10 minutes each resonance
Shock
500 g's at 1 millisecond, 18 shocks (3 each, 6 surfaces)
Ambient Light
o to 100kLux (Direct sunlight)
Rain
MIL-STD-810. Method 506, Procedure II. Drip
Dust
MIL-STD-810, Method 510, Blowing Dust
Mechanical Specifications
NOTE: All DIMENSIONS IN MILLIMETAES AND (INCHES,.
3-7
programmable configuration
configuration menu or by sendillg the appropriate escape
sequence from the host system. The wand can be reconfigured at any time to accommodate changing application
requirements. Configuration labels and the escape sequences with detailed instructions on how to use each of
them are printed in the HP SmartWand Users Manual (Part
# HBCR-8997). Configuration labels (Part # HBCR-8998)
can also be purchased separat€)ly·as an accessory.
The HP SmartWand can be configured by scanning a
series of special menu labels or by transmitting escape
sequences from the host system to the wand. This allows
decoding options and interface protocols to be tailored to
a specific application. The configuration is stored in nonvolatile memory and cannot be changed by removing
power from the wand or by scanning standard bar code
labels. The configuration information can be transmitted
to the host system by scanning a bar code label in the
An example configuration display screen with the default
settings is shown.
CONFIGURATION DISPLAY SCREEN
CONFIGURATION DISPLAY SCREEN
READ
CHECK CHAR
CODE
verlt
xmlt
(yes)
Code 39
(yes)
(no)
(yes)
Int. 2/5
(yes)
(no)
UPCIEAN
(yes)
yes
yes
(yes)
Codabar
no
no
Code 128
(yes)
yes
no
Code 11
(yes)
(1)
yes
MSI Code
(yes)
yes
yes
version 12.X
MESSAGE COMPONENTS (control character =
header:( )
trailer: (11M i\J)
reader address:( )
- - - SERIAL PORT baud rate:(9600)
parity: (0'5)
stop bits:(1}
(20ms)delay:(off)
LENGTH
min
max
(1)
(32)
(4)
(32)
fixed
(1)
(32)
(1)
(32)
(1)
(32)
(1)
(32)
A+
letter)
CODE ID
xmll:(off)
. (a)
(b)
(c)
(d)
(e)
(f)
(g)
(c) Hewlett Packard 1986
OTHER CONFIG. SETTINGS
(variable length)
(start/stop transmitted)
- - - -- -- -
--
----
no-read: ( )
message ready:( 1\ F)
message not ready:( 1\ U)
PACING - - - - - - MISCELLANEOUS XON/OFF protocol:(off)
no-read recognition:(off)
Single Read Mode:(off)
scanner: (enabled)
- - - - --
I
-
Note: This is a partial listing of configurable parameters. Please refer to the HP SmartWand
Users Manual (Part # HBCR-8997) for a complete listing.
Bar Code Decoding
performance
BAR CODE SYMBOLOGIES SUPPORTED
The HP SmartWandautomatically recognizes and decodes
Code 39 (3 of 9 Code). Interleaved 2 of 5, Universal
Product Code (UPC). European Article Numbering Code
(EAN), Japanese Article Numbering Code (JAN). Codabar
(NW7 Code), Code 128, MSI Code, and Code 11. Minimum
and maximum length values can be configured for each
code (except UPC/EAN/JAN) and all codes can be scanned
bi-directionally. All code types and their decoding format
options can be enabled or disabled using either the optical
configuration menu or escape sequences.
UPC-E, EAN-8, EAN-13, JAN-8 and JAN-13 are fixed length
numeric only bar codes that have automatic check character verification and transmission. Decoding can be restricted to UPC-A and UPC-E. UPC-E labels can be expanded into the UPC-A format upon transmission.Supplemental encodations can be enabled in 2 digit, 5 digit, or
both 2 and 5 digit lengths. Labels. with supplemental
encodations, or "add-on's" must be scanned from left to
right in'one stroke so that the supplementals are scanned
after the main label. When automatic recognition of supplemental encodations is enabled, labels with or without
add-on's are decoded.
Codabar, a numeric bar code with special characters, can
have a message lengths up to a maximum of 32 characters.
The HP SmartWand can be configured to transmit or
suppress the data contained in the start and stop characters.
Code 39, an alphanumeric bar code, can have message
lengths up to a maximum of 32 characters. An optional
check character can be used with these codes and the HP
SmartWand can be configured to verify this character.
Transmission of the check character is optional. Extended
Code 39 can be enabled as the full ASCII conversion
option for Code 39.
Code 128, a compact full ASCII bar code, can have message lengths up to a maximum of 31 characters in codes A
and B, and 62 characters in code C: Check character
verification is automatic and check character transmission
is always suppressed.
Interleaved 2 of 5, a compact numeric only bar code, can
be read with variable message lengths from 4 to 32 characters in even number increments. It can also be read with
fixed message length exactly 2 characters long, with fixed
message lengths that are exactly 6 or exactly 14 characters
long, or with a fixed message length from 4 to 32 characters
in even number increments. Check character verification
and transmission are optional.
Code 11, a numeric high density code, can have message
lengths up to 32 characters. Verification of one or two
check characters must be enabled, and the check character(s) are always transmitted.
MSI Code, a continuous numeric only code, can have
message lengths up to 32 characters. The check digit, a
modulo 10 Checksum, is always verified and transmitted.
Standard UPC, EANand JAN bar codes including UPC-A,
3-8
DECODING PARAMETERS
Other default decoding parameters:
Extended Code 39 (full ASCII conversion) is disabled.
Interleaved 2 of 5 message length is variable.
UPC/EAN/JAN supplemental digits are disabled.
Codabar stop/start characters are transmitted.
Parentheses indicate the parameter is optically configurable. Brackets indicate the parameter is escape sequence
configurable. Default settings are shown.
"Code
'Status
Code
Check Character
Verification
Transmit
Message Length
Minimum
Maximum
C'ode 1.0. Cha,racter
Transmit [(disabled)]
Code 39
[(enabled)J
[(disabled)]
[(yes)]
(1)
(32)
{(a)]
Interleaved 2 of 5
[(enabled)]
.[(disabled)]
[(yes)]
[(4)]
[(32)]
[(b)]
UPC/EAN/JAN
{(enabled»)
yes
yes
Codabar
[(enabled)]
no
no
(32)
[«:i)]
[(e)J
fixed
[(c))
(1)
Code 128
[(enabled) I
yes
no
(1 )
(32)
Code 11
[(enabled)]
[(1 )J
yes
(1)
(32)
[(f))
MSI Code
[(enabled)J
yes
yes
(1)
(32)
[(g)J
MESSAGE COMPONENTS
10 ASCII characters. The code identification character is a
single ASCII character which immediately precedes the
decoded data and is used to identify the bar code symbology that was decoded.' The no-read message can be up to
10 ASCII characters and can be transmitted in place of
decoded data if a bar code label is scanned and a decode
does not occur.
There are three optical or escape sequence configurable
message components that can be defined by the user and
added to the decoded data transmitted by the HP SmartWand. The message components are: header, trailer, and
code identification character. A no-read message option is
also available.
The header, which precedes the decoded data, and the
trailer, which follows the decoded data, can contain up to
The default settings for the message components are
shown,
Message Parameter
Conflgurable Options
Default Setting
Header:
Trailer:
No Read Message:
Code Identification Character:
01010 ASCII characters
o Characters (empty buffer)
o to 10 ASCII characters
o to 10 ASCII characters
1 ASCII character
CRLF
o Characters (empty buffer)
See "Decoding Parameters" table
Electricallnterface
PIN DIAGRAM
Wire
Pln# Color
Function
1
-
2
White
TxD Transmitted Data (from the wand)
3
Green
RxD Received Data (to the wand)
4
-
5
-
6
-
7
Black
o
;;
4
3
2
N/C
o
o
o
N/C
o
7
o8
o
9
N/C
N/C
MALE 9 PIN SUBMINIATURE 0 CONNECTOR
Ground
8
-
N/C
9
Red
Vee
Shell
-
Shield
3-9
Pin Description
PIN2
TxD - This is the transmitted serial data line from the HP
SmartWand. It obeys RS232. data formats, but uses.zero to
five volt logic level swings. It can be described as TTL level
RS232. This will drive TTL, LSTTL, and CMOS inputs. The
output circuit is shown:
HP SMART WAND
I----~---------I
I
1
I
I
I
m~
I
TxD Output Specifications
TxD
(Vee" 5 Yolts DC@TA=25°C)
VOH
2.00 VDC @ 740 pA
3.00 VDC @ 410 pA
4.00 VOC @ 95 pA
I
I
I
(VOH '" Vec-0.7(3100 'IOH)]
I
I":"
0.30 VOC @ 20 mA
I
I
I
7')~",~1'~W!"':':~~~"lJlP
t
illll:-==134==(5.31===u::g=::c
L
,)~~'.>11?'~:~~ I ! ~C::I===~
T
,M."
18
;J~
---c
i2~
19 (0.8)
CDJ)o==IlIIh~..dJ~
/.--260110)
·1·
200 18)
NOTE: DIMENSIONS IN MILLIMETRESAND (INCHES).
3~19
..
__.. _.... _._----_._-------_._--_._-_._..._ - - - _ .._---_._.-_... -
....
_-_._ - .__. _ - - - - - - ....
Applications
The digital bar code wand is a highly effective alternative to
keyboard data entry. Bar code scanning is faster and more
accurate than key entry and provides far greater throughput.
In addition, bar code scanning typically has a higher first read
rate and greater data accuracy than optical character recognition. When compared to magnetic stripe enCOding, bar
code offers significant adv::.ntages in flexibility of media,
symbol placement and immunity to electromagnetic fields.
Hewlett-Packard's sapphire tip wands are designed for use in
applications where dirt and debris are a common occurrence
and could cause clogging in a conventional open-tip wand. In
addition, the sapphire ball provides superior wear resistance and improves scanning ease. The rugged yet lightweight polycarbonate case makes these wands ideal for use
in commercial or light industrial applications.
Applications include remote data collection, work-in-process
tracking, point-of-sale data entry, inventory control, library
circulation control, medical records tracking, and repair/
service work.
Recommended Operating Conditions
Parameter
Symbol
Nominal Narrow Element Width
HBCS-2200/2300
H BCS-2400/2500
Min.
Max.
Units
0.19 (0.0075)
mm (in)
0.13 (0.005)
mmlin.l
Scan Velocity
VSCAN
7.6 (3)
Contrast
Rw-Rs
45
Supply Voltage
Vs
Temperature
TA
Notes
127 15m
cm/sec (in/sec)
%
1
4.5
5.5
Volts
2
-20
+65
°C
Tilt Angle
(See Figure 8)
Orientation
(See Figure 1)
3
Noles:
1. Contrast is defined as Rw-Rs, where Rw is the reflectance of the white spaces and Rs is the reflectance of the black bars. measured at the emitter
wavelength 1700 nm or 820 nml. Contrast is related to print contrast signallPCS) by PCS = IRw-Rs)/Rw or Rw-Rs = PCS·Rw.
2. Power supply ripple and noise should be less than 100 mV peak to peak.
3. Performance in sunlight will vary depending on shading at wand tip.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
Ts
-40
+75
°C
+65
°C
Operating Temperature
TA
-20
Supply Voltage
HBCS-2200/2300
Vs
-0.5
+6.00
V
HBCS-2400/2500
Vs
-0.5
+5.75
V
200
mW
-0.5
+20
V
Output Transistor Power
PT
Output Collector Voltage
Vo
3-20
Notes
Electrical operation
The HBCS-2XXX family of digital bar code wands consists
of a precision optical sensor, an analog amplifier, a digitizing circuit, and an output transistor. These elements provide
a TTL compatible output from a single 4.5V to 5.5V power
supply. The open collector transistor requires an external
pull-up resistor for proper operation.
Grounding the shield will provide a substantial improvement
in EMIIESD immunity in AC powered systems. However, it
is essential that the shield be properly terminated even
when EMI and ESD are not a concern, otherwise the shield
will act as an antenna, injecting electrical noise into the
wand circuitry.
A non-reflecting black bar results in a logic high (1) level
output, while a reflecting white space will cause a logic low
(0) level output. The initial or "wake-up" state will be indeterminate. However, after a short period (typically less than
1 second), the wand will assume a logic low state if no bar
code is scanned. This feature insures that the first bar will
not be missed in a normal scan.
The HBCS-2200/2400 wands incorporate a push-to-read
switch which is used to energize the LED emitter and electronic circuitry. When the switch is initially depressed,
contact bounce may cause a series of random pulses to
appear at the output (Vol. This pulse train will typically settle
to a final value within 5 ms.
The recommended logic interface for the wands is shown in
Figure 9. This interconnection provides the maximum ESD
protection for both the wand and the user's electronics.
The wands provide a case, cable, and connector shield
which must be terminated to logic ground or, preferably, to
both logic ground and earth ground. The shield is connected to the metal housing of the 5 pin DIN connector.
Electrical Characteristics
(Vs = 4.5V to 5.5V, TA = 25° C, RL = 1KO to 10KO, unless otherwise noted)
Parameter
Supply Current
Symbol
Is
High Level Output Current
IOH
Low Level Output Voltage
VOL
Min.
Typ.
Max.
Units
42
50
mA
Vs=5.0V
400
J,lA
VOH=2.4V
Conditions
0.4
V
IOL= 16 mA
Output Rise Time
tr
3.4
20
J,lS
Output Fall Time
10%-90%
Transition
RL=1K
Notes
4
If
1.2
20
J,lS
Switch Bounce
HBCS-22()0/2400
Isb
0.5
5.0
ms
5
Electrostatic Discharge Immunity
ESD
25
kV
6
Notes:
4. Push-to-read switch (if applicable) is depressed.
S. Switch bounce causes a series of sub-millisecond pulses to appear at the output (Vol.
6. Shield must be properly terminated (see Figure 9). The human body is modeled by discharging a 300 pF capacitor through a SOO
resistor. No damage to the wand will occur at the specified discharge level.
Block Diagram
HBCS-2300/2500
(without Switch)
HBCS-2200/2400
(with Switch)
3-21
n
Scanning performance
IVs
= 5.0 V, RL = 1.0 to 10 K!l, TA = 25° C, Scan Velocity = 50 cm/sec)
Symbol
Parameter
Decodability Index
01
Average Width Error
INarrow Bars)
OSbn
Average Width Error
IWide Bars)
OSbw
Average Width Error
INarrow Spaces)
Average Width Error
(Wide Spaces)
Deviation from Average
(InternaiJ
Deviation from Average
(First Bar)
OSsn
HBCS·
Typ.
Max.
Units
2200/2300
9
22
%
2400/2500
12
22
%
2200/2300
0.005
10.00021
mm
lin,)
2400/2500
0.024
(0.0009)
mm
lin,)
2200/2300
0.003
10.0001)
mm
lin.)
2400/2500
0.023
10.009)
mm
lin.!
2200/2300
-0.Q11
1-0.0004)
0.027
1-0.Q1 06)
mm
lin,)
mm
lin.)
-0.002
1-0.0001)
-0.026
i-0.0010)
mm
lin,)
mm
lin.)
2400/2500
2200/2300
OSsw
2400/2500
2200/2300
0.Q18
10.0007)
0.048
(0.0019)
mm
lin.)
2400/2500
0.019
(0.0007)
0.052
(0.00201
mm
lin,)
2200/2300
0,090
(0.0035)
0.152
(0.0060)
mm
lin.i
2400/2500
0.060
(0.0024)
0.100
(0.0039)
mm
On.)
de
db1
Condition
Fig.
Note
1,2,3
4,7,9
7,8
1,2,9
7
1,2,5
6,9
7
Tilt Angle 0° to 40°
Preferred Orientation
Standard Test Tag
Notes:
7. The test tag for the HBCS·2200/2300 Wands IFigure 2al consists of black bars and white spaces with a narrow element width of 0.19 mm
10.0075 in.1 and a wide element width of 0.42 mm 10.0165 in.l. This equates to a wide·to-narrow ratio of 2.2:1. A margin, or white reflecting
area, of at least 5 mm in width precedes the first bar.
The test tag for the HBCS-2400/2500 wands IFigure 2bl consists of black bars with a narrow element width of 0.13 mm 10.005 in.1 and
wide element width of 0.43 mm 10.017 in.l, giving a ratio of 3.4:1. The white spaces have a narrow element width of 0.28 mm 10.011 in.1 and
wide element width of 0.64 mm 10.025 in.1 yielding a ratio of 2.3:1. Both tags are photographically reproduced on diffuse reflecting paper
with a PCS greater than 90%.
8. Decodability index is a measure of the errors produced by the wand when scanning a standard test symbol at a constant velocity. It is
expressed as a percentage of the narrow element width.
For a more detailed discussion of the terms used here, see Hewlett-Packard Application Note 1013 "Elements of a Bar Code System"
Ipublication number 5953-93871.
HBCS·22/2400
H BCS·23/2500
a, HBCS·22/2300 Test Tag
b, HCBS·24/2500 Test Tag
Figure 2. Standard Test Tag Formats
(Test Tags Enlarged to Show Detail)
Figure 1, Preferred Wand Orientation
3·22
Typical Performance Curves
IVs = 5 V, RL = 1 Kil, TA = 25° C, Tilt = 15°, VSCAN = 50 cm/sec unless otherwise specified)
25
'"
1
X
25
'"
20
w
a
a
;:;
>f-
15
<>:
10
:::;
iii
a
a
u
20
1
X
w
;:;
-- --
........
w
a
....
1
-
-
HBCS-2200/2300
15
>f-
- --"
HBCS-2400/2500
:::;
iii
<>:
a
10
0
u
w
1--
a
1
Ci
Ci
VSCAN - SCAN VELOCITY - em/sec
Vs - SUPPLY VOLTAGE - VOLTS
Figure 3. Decodabllity Index vs. Supply Voltage.
Figure 4. Decodabllity Index vs. Scan Velocity.
0.140
0.140
0.120
'"0a::
0:::
o
0.120
a::
a::
a::
w 0.100
J:
f-
a
0.080
~
ei
>
<>:
ffi
--
--.
HBCS-2200/2300
J:
f-
db,
~ 0.080
g
<>: 0.060
0.060
:;;
0
~ 0.040
'"'0"
;:: 0.020
<>:
:;
w
0.100
a
-- -_.
-
---
...
o
a::
--- ---
I
~ 0.040
db,-
HBCS-2400f2500 -
ALL WANDS-;:;:::-
'o"
~
':;',;;-::
:;
o
Vs - SUPPLY VOLTAGE - VOLTS
(O.~8~
~
~
0
15
u
10
w
a
1
40
60
80
100
120
em/sec
,--.,----,---,--,---,
1.5
u (0.06)
;:;
a
<>:
20
u;
20
1;)
a
o
Figure 6. Deviation from Average Width Error
vs. Scan Velocity.
25
>f-
de
ALL JANOS
VSCAN - SCAN VELOCITY -
Figure 5. Deviation f.rom Average Width Error
vs. Supply Voltage.
:::;
iii
.....
0.020
db,
-
w
a
1
"
HBCS-2400i2500
db,
:;;
a
'"
"
HBCS-2200/2300
-----
I
I
E
E
-_.-
HBCS-24001250Q
1
fJ:
'"W
----
I
HBCS-2200/2300
1.0
(0.04)
J:
a
z
0.5
<>: (0.02)
s:
Ci
o
-40
-20
20
40
60
80
10
e-
TA - TEMPERATURE -"C
20
30
40
TI LT ANGLE - DEGREES
Figure 8. Wand Height vs. Tilt Angle.
Figure 7. Decodability Index vs. Temperature.
3-23
50
Selection Guide
NOMINAL
NARROW
ELEMENT
WIOTH?
NOTES:
IF IT IS NECESSARY TO READ BAR CODE PRINTED IN COLORS OTHER THAN BLACK AND WHITE IT IS RECOMMENDED THAT EITHER THE
HBCS-2200 DR HBCS-2300 WANDS BE SELECTED.
IF IT IS NECESSARY TO READ SECURITY "BLACK-ON-BLACK" BAR CODE (CARBON-BASED BLACK AND WHITE BAR CODE WITH A BLACK
OVERLAY). IT IS RECOMMENDED THAT EITHER THE HBCS-2400 OR THE HBCS-2500 WANDS BE SELECTED.
--------, r -
SHIELD
-
-
-
-
-
I
-
Mechanical Considerations
--,
)
I
Vs (1)
I
The wands include a standard 5 pin. 240 0 DIN connector.
The detailed specifications and pin-outs are shown in Figure
10. Mating connectors are available from RYE Industries and
SWITCHCRAFT in both 5 pin and 6 pin configurations.
These connecors are listed below.
WAND
SYSTEM INTERFACE
®TRANSZORB IS A REGISTERED TRADEMARK OF GENERAL
SEMICONDUCTOR INDUSTRIES. TEMPE AZ.
Figure 9. Recommended Logic Inlerface (When earth ground Is
nol available, connecl shield 10 logic ground, as shown by dolled
line).
Connector
Configuration
RYE MAB-5
5Pin
SWITCH CRAFT 61 GA5F
5 Pin
SWITCH CRAFT 61 HA5F
5 Pin
RYE MAB-6
6Pin
SWITCHCRAFT 61GA6F
6Pin
Maintenance Considerations
There are no user serviceable parts inside the wand. The tip
is designed to be easily replaceable. and if damaged it should
be replaced. Before unscrewing the tip. disconnect the wand
from the system power source. The part number for the wand
tip is HBCS-2999. The tip can be ordered from any HewlettPackard franchised distributor.
NOTES:
1. DIMENSIONS IN MILLIMETRES AND (INCHES).
WIRE COLOR
RED
Vo OUTPUT
BLACK
GROUND
N/A
N/C
N/A
CASE
Vs SUPPLY VOLTAGE
WHITE
Figure 11. Sapphire Tip.
optional Features
N/C
SHIELD (MUST BE
CONNECTED)
For options such as special cords. connectors or labels. contact your nearest Hewlett-Packard sales office or franchised
Hewlett-Packard distributor.
Figure 10. Connector Specifications.
3-24
DIGITAL
BAR CODE WAND
HEDS-30DO
HEDS-3D50
Features
• 0.3 mm RESOLUTION
Enhances the Readability of dot matrix printed
bar codes
• DIGITAL OUTPUT
Open Collector Output Compatible
with TTL and CMOS
• PUSH-TO-READ SWITCH (HEDS-3000)
Minimizes Power in Battery
Operated Systems
• SINGLE 5V SUPPLY OPERATION
• ATTRACTIVE, HUMAN ENGINEERED CASE
• DURABLE LOW FRICTION TIP
• SOLID STATE RELIABILITY
Uses LED and IC Technology
o SHIELDED CASE AND CABLE (HEDS-3050)
Maximizes EMI/ESD Immunity in AC
Powered Systems
electromagnetic interference, electrostatic discharge,
and ground loops in AC powered systems. Both wands
feature a strain relieved 104 cm (41 in.) cord with a ninepin subminiature D-style connector.
Description
The HEDS-3000 and HEDS-3050 Digital Bar Code Wands
are hand held scanners designed to read all common bar
code formats that have the narrowest bars printed with a
nominal width of 0.3 mm (0.012 in.). The wands contain an
optical sensor with a 700 nm visible light source, photo IC
detector, and precision aspheric optics. Internal signal
conditioning circuitry converts the optical information
into a logic level pulse width representation of the bars
and spaces.
The HEDS-3000 comes equipped with a push-to-read
switch which is used to activate the electronics in battery
powered applications requiring lowest power consumption. The HEDS-3050 does not have a switch, and features
internal metal shielding that maximizes immunity to
Applications
The Digital Bar Code Wand is an effective alternative to
the keyboard when used to collect information in selfcontained blocks. Bar code scanning is faster than key
entry and also more accurate since most codes have
check-sums built-in to prevent incorrect reads from being
entered.
Applications include remote data collection, ticket
identification systems, security checkpoint verification,
file folder tracking, inventory control, identifying assemblies in service, repair, and manufacturing environments,
and programming appliances, intelligent instruments and
personal computers.
Wand Dimensions
HEDS-3000
PUSIi-TQ.oREAO
23 (O.9)~
Li2 paper with a print contrast signal greater than 0.9.
8. The print contrast signal (PCS) is defined as: PCS = (Rw - Rb)
IRw, where Rw is the reflectance at 700 nm from the white
spaces, and Rb is the reflectance al 700 nm for the bars.
9. 1.0 in. = 2S.4 mm, 1 mm = 0.0394 in.
10. The Wand is in the preferred orientation when the surface of
the label is parallel to the height dimension of the bar code.
3-27
- - - _ ...
__
._--..
-
...-
------------------------------------
OPERATION CONSIDERATIONS
The Wand resolution is specified in terms of a bar and
space Width Error, WE. The width error is defined as the
difference between the calculated bar (space) width, B,
(S), and the optically measured bar (space) widths, b (s).
When a constant scan velocity is used, the width error can
be calculated from the following.
B = tb' Vscan
S '" ts' Vscan
~b = B - b
~s = S - s
orientation (Figure 1), tilted at an angle of 10° to 20°, and
the Wand tip is in contact with the tag. The Wand height,
when held normal to the tag, is measured from the tip's
aperture, and when it is tilted it is measured from the tip's
surface closest to the tag. The Width Error is specified for
the preferred orientation, and using a Standard Test Tag
consisting of black bars and white spaces. Figure 2
illustrates the random two level bar code tag. The
Standard Test Tag is photographed on Kodagraph
Transtar TC5® paper with a nominal module. width of
0.3 mm (0.012 in.) and a Print Contrast Signal (PCS) of
greater than 90%.
Where
~b, ~s= bar, space Width Error (mm)
b, s = optical bar, space width (mm)
B, S = calculated bar, space width (mm)
Vscan = scan velocity (mm/s)
tb, ts = wand pulse width output( s)
The magnitude of the width error is dependent upon the
width of the bar (space) preceeding the space (bar) being
measured. The Guaranteed Width Errors are specified as a
maximum for the margin to first bar transition, as well as,
maximums and minimums for the bar and space width
errors resulting from transitions internal to the body of the
bar code character. The Typical Width Error Performance
specifies all possible transitions in a two level code (e.g, 2
of 5). For example, the ~b2-1 Width Error specifies the
width error of a single bar module (0.3 mm) when
preceeded by a double space module (0.6 mm).
BAR WIDTH 0.3 mm (0.012 in.) BLACK & WHITE
RWHITE ~ 75%, pes;;t. 0.9 KODAGRAPH TRANST AR TC5® PAPER
Figure~.
The BarWidth Error ~b, typically has a positive polarity
which causes the calculated bar, B, to appear wider than
its printed counterpart. The typical negative polarity of the
Space Width Error ~s, causes the measured spaces to
appear narrower. The consistency of the polarity of the
bar and space Width Errors suggest decoding schemes
which average the measured bars and measured spaces
within a character. These techniques will produce a higher
percentage of good reads.
Standard Test Tag Format.
®TRANSZORB IS A REGISTERED
TRADEMARK OF GENERAL
SEMICONDUCTOR INDUSTRIES.
r- - - - - - - - -,
PUSH~READ I
Vs (9)
: Te:: AZ.
- - - - 0 o-~~----<~~--~~~~~~~~--
+
4.7J.lf
I@TRANSZORB
I
P6KE 7.5C
I 13
EAC~oI21
GNDI71
The Wand will respond to a bar code with a nominal
module width of 0.3 mm when itis scanned at tilt angles
between 0° and 30°. The optimum performance will be
obtained when the Wand is held in the preferred
- - - - - - ' L _________ ~
HEDS-300e
ELECTROSTATIC DISCHARGE
SUPPRESSION INTERI=ACE
SYSTEM INTERFACE
Figure 3a, Recommended Logic Interface for HI:OS-3000
®TRANSZORB IS A REGISTERED
TRADEMARK OF GENERAL
INDUSTRIES.
r- - - - - - -: - -~ ~i~~CEO~~UCTOR
SHIELD
I
+
4.7pF
Vs (9)
I-I!;V
I@TRANSlORB
I P6KE 7.5e
I
13
EAC~~ 121
GND(7)
L~J!,~~D_~ ___ _J
HEDS-3050
HEDS-3000
ELECTROSTATIC DISCHARGE
SUPPRESSION INTERFACE
SYSTEM INTERFACE
HEDS-3050
Figure 3b. Recommended Logic Interface for HEDS-3050.
(When earth ground is not available. connect shield
to logic ground, as shown by dotted line)
Figure 1. Preferred Wand Orientation.
3-28
Typical Performance Curves (RL = 2.2kO)
0.15
0.15
0.10
0:
0
~ 1S~ B~R
"
...... .-
./
0.05 "b. INTERNAL BAR
WIDTH ERROR
0:
0:
W
:I:
PREFERRED
ORIENTATION
0.10 0;;0;;; 1:- 1ST LR
.....
HEIGHT" 0.1 mm
vscan'" 50 em/s
-
STANDARD TAG
0.05
(O.3mm)
Vs "" 5V
"
~
W
-0.15
~
w
0.10
~
V
r- f-'"
0.05
5°
1/
\
\
0.10
-
~
;:
-0,10
-0.15
- - -
-
o
1O
~
;:
PREFERRED ORIENTATION
TILT = 0°
--
IY
:::::"
r-r
vscan = 50 em/s
STANDARD TAG (0.3 mm)
Vs = 5V
TA "" 25°C
- - -
-0.15
I
a
I
--,....
0.05
i!'o
c-
0.05
! -0,05
w
;:
I
-0.10
f-I--
-0.15
I I
I I
o
p'REFkRRkD
vr i
I
I
I
I
i i
l:
b
I
1O
\ -0.05
-0.10
~
As, INTERNAL SPACE
WIDTH ERROR
PREFERRED ORIENTATION
TILT-a'
HEIGHT = 0.25 mm
STANDARD TAG (0.3 mm)
TA = 25°C
Vs '" 5V
I-- I-- -
TILT = 0°- -
I
-
;:
-
TA = 25°C -
I
-
w
I
-0.15
o
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
10
20
30
40
50
60
70
so
vseao - SCAN VELOCITY - em/s
b, 5 - BAR. £PACE WIDTH - mm
Figure 8. Width Error vs. Bar Width.
WIDTH ERROR
ffi
O'R'E~TA~'ON I
T
.J.b, INTERNAL BAR
I--
0:
HEIGHT = 0.25 rom
Yscan= 50 emfs
5
-
0:
o
"s. INTERNAL SPACE WIDTH ERROR
~~--r
I 1
T
1O
I I
1ST BAR
I :
,,1'
'..L
ffi
r- r- -
J I
0.10
Ab, INTERNAL BAR WIDTH ERROR
0:
Ii!
-.
0.1 0.2 0.3 0.4 0.5 0.6 0.7 O.S 0.9 1.0
1dT B1R
~
I
PREFERRED ORIENTATION
TILT = a"
vscan = 50 em/s
STANDARD TAG (0.3 mm)
TA :; 25°C
Vs = 5V
r- r- -
0.15
1
-
r-.
Figure 7. Width Error vs. Height (Any Orientation).
0,15
1
-.
I- SPACE WIDTH ERROR
-
\
.,.-
h - HEIGHT - mm
Figure 6. Width Error vs. Height (Preferred Orientation).
0.10
--
1
INTE~NAL BAR
WIDTH ERROR
h - HEIGHT - mm
1
\
f-~tl
-0.05
-0.10
0.1 0.2 0,3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
1
/
a: 0.05 _Ab,
o
~
~~~~:~~~~~ ~R~OR
~,
1 1
1ST BAR
0.15
\
0:
0:
W
-0.05
lac 15° 20" 25" 30 e 35"
Figure 5. Width Error v:s. Tilt (Any Orientation).
w
§;'
,
fJ - TILT - DEGREES
a:
~
i""-
-0.15
t.b. INTERNAL BAR WIDTH ERROR
0:
_r-
TILT - DEGREES
~,
1ST BAR
iNTE'RNAL SPACE
- ~" WIDTH
ERROR
-0.10
Figure 4. Width Error vs. Tilt (Preferred Orientation).
0.15
-0.05
3:
5' 10' 15' 20' 25' 30' 35'
e-
±-:f-.-!. ......
~
i"-
-0.10
~,...
0:
0:
As. INTERNAL SPAC~ ...
WIDTH ERROR
I -0.05
(0.3 mm)
WIDTH ERROR
0:
t-
o
1O
vscaf'l= 50 em/s
STANDARD TAG
V
Ab.IINT~RNlL BAR r- ~~!:~~oC
-
o
TA "" 25°C
HEIGHT = 0.1 mm
/
I
Figure 9, Width Error vs. Scan Velocity.
3-29
- I-- r--
0.15
0.15'
-
0.10
E
E
I
a:
0
a:
a:
w
:r
I-
0.05
PREFERRED ORIENTATION
TIL T = D·
STANDARD TAG (0.3 mm)
HEIGHT'" 0.25 mm
J
0.10
1ST BAR
vscan::; 50 emls
Vs '" 5V
JBA~-
E
E
I
0.05
a:
a:
ab. INTERNAL BAR WIDTH ERROR
Ab. INTERNAL BAR WIDTH ERROR
0
ffi
0
~
~
As. INTEIRNAIL SP C~WID H EIRROR_
I -0.05
I -0,05
w
;:
~
-0.10
0
i"0
0
i - r--
PREFERRED ORIENTATION
HEIGHT'" 0.25 mm
TILT=O· -
r- ~
vscan'" 50 emls
STANDARD TEST TAG 10.3 mm)
TA ::; 25°
r- r-
-0.10
-0.15
3.5
4.0
4.5
5.0
5.5
As. INTERNAL SPACE WIDTH ERROR
-0.15
6.0
5"
10·
Vs - SUPPLY VOLTAGE - V
15· 20"
25· 3D· 35· 40· 45·
TA - TEMPERATURE _
Figure 10. Width Error vs. Supply Voltago.
60"
55·
°c
Figure 11. Width Error vs. Temperature.
MECHANICAL CONSIDERATIONS
The HEDS-3000/-3050 include a standard nine pin D-style
connector with integral squeeze-to-release retention mechanism. Two types of receptacles with the retention mechanism are available from AMP Corp. (printed circuit
header: 745001-2 Panel mount: 745018, body; 66570-3,
pins). Panel mount connectors that are compatible with
the Wand connector, but do not include the retention
mechanism, are the Molex A7224, and AMP 2074-56-2.
MAINTENANCE CONSIDERATIONS
While there are no user serviceable parts inside the Wand,
the tip should be checked periodically for wear and dirt, or
obstructions in the aperture. The tip aperture is designed
to reject particles and dirt but a gradual degradation in
performance will occur as the tip wears down, or becomes
obstructed by foreign materials.
Before unscrewing the tip, disconnect the Wand from the
system power source. The aperture can be cleaned with a
cotton swab or similar device and a liquid cleaner.
The glass window on the sensor should be inspected and
cleaned if dust, dirt, or fingerprints are visible. To clean the
sensor window dampen a lint free cloth with a liquid
cleaner, then clean the window with the cloth taking care
not to disturb the orientation of the sensor. DO NOT
SPRAY CLEANER DIRECTLY ON THE SENSOR OR
WAND.
~
o~O'T
L~."",
b
~DRl
HEDS-3001
Figure 12. Wand Tip.
After cleaning the tip aperture and sensor window, the tip
should be gently and securely screwed back into the
Wand assembly. The tip should be replaced if there are
visible indications of wear such as a disfigured, or
distorted aperture. Th.e part number for the Wand tip is
HEDS-3001.1t can be ordered from any franchised HewlettPackard distributor.
OPTIONAL FEATURES
The wand may also be ordered with the following special
features:
• Special colors
• Customer specified label
• No label
• Heavy duty retractable coiled cord
• No connector
• With/without switch button
For more information, call your local Hewlett-Packard
sales office or franchised distributor.
111
Pin
1
2
I
"Cb~
26.8
III
3
11.05)
4
5
6
.1
~
1!lJ
t
15.8
10.62)
7
8
9
54321
I
[llOOOOO
0000
!
NOTES,
1. ALL DIMENSIONS IN MILLIMETRES AND (INCHES).
II II
98 76
Figure 13. Connector Specifications.
3-30
I]
Wire
Color
NC
White
NC
NC
-NC
Black
NG
Red
HEDS-3000
FUnction
NC
Vo Output
NC
HEOS-3050
Function
NC
Vo Output
NC
NC
NC
NC
NC
Shield
NC
Ground
NC
Vs Supply Voltage
Ground
NC
Vs Supply Voltage
Flihl
HEWLETT
~~ PACKARO
BAR CODE DECODER IC
H8CR1800
Features
• INDUSTRY STANDARD BAR CODES
3 of 9 Code
Extended 3 of 9 Code
Interleaved 2 of 5 Code
UPC/EAN/JAN Codes
i-i
• AUTOMATIC CODE RECOGNITION
"
• FULL DUPLEX SERIAL OR PARALLEL ASCII
OUTPUT
I
':,p~. ~ :::':1:' <'
$1S't \ , ;,
~OH.~'~u:~' ~
!:.lIIckar d Co.
..."Int..,
I
,~ ~
,
82
• EXTENSIVE CONFIGURATION CONTROL
THROUGH SOFTWARE COMMANDS
~
,
• DECODER IC IN A STANDARD 40 PIN DIP
PACKAGE
• AUDIO AND VISUAL FEEDBACK CONTROL
• SINGLE 5 VOLT SUPPLY
Description
Applications
HewleU-Packard's HBCR-1800 Bar Code Decoder IC is a
high performance product designed to simplify the implementation of bar code reading capability in any OEM
system. The standard 40 pin decoder IC has been specially
designed to work with any of HewleU-Packard's digital
wands. When combined with an external RAM chip, the
result is a component-level reader that allows a manufacturer to easily add bar code reading to his equipment.
Bar codes are rapidly becoming a preferred alternative to
other forms of data entry. Bar coding has proven faster and
more accurate than keyboard entry. In addition, bar code
scanning typically has a higher first read rate and greater
data accuracy than Optical Character Recognition. When
compared to magnetic stripe encoding, bar code offers significant advantages in flexibility of media, symbol placement
and immunity to electromagnetic fields.
The standard decoding chip supports four of the most popular codes: 3 of 9 Code, Extended 3 of 9 Code, Interleaved 2 of
5 Code, and UPC/EAN/JAN Codes. If more than one standard code is enabled, the reader will automatically recognize
and decode the code being scanned. Bi-directional scanning
is allowed for all codes except UPC/EAN/JAN with supplemental digits. For 3 of 9 Codes and Interleaved 2 of 5 Code, a
maximum of 32 characters inot including start and stop characters) are allowed.
Manufacturers of data collection terminals, point-of-sale terminals, keyboards, weighing scales, and other data collection
and material handling equipment are finding a growing
demand for bar code reading capability in their products. The
HBCR-1800 Bar Code Decoder IC makes it easy to add this
capability without the need to invest in the development of
bar code decoding software.
HBCR-1800 Bar Code Decoder IC makes it easy to add this
capability without the need to invest in the development of
bar code decoding software.
The decoder IC may be set to communicate in either serial or
parallel ASCII. Operator feedback is supported through pins
that allow for external LED drive and a beeper drive circuits.
In addition, there are thirteen programmable functions covering items from terminator character selection to the tone of
the beeper.
The 40 pin decoder IC may be easily configured with most
common microprocessors using either a parallel ASCII or
serial ASCII interface. The IC may be added to an existing
board, designed into an add-on board, or designed into an
entirely new system. Using the decoder IC as an integral part
of the host system will eliminate the need for the external bar
code readers which are often used to perform the same
function.
3-31
Decoder Ie Specifications
Wand input can be disabled by the host system through a
software command. This allows the application program to
control the operator's ability to enter bar code data, thereby
preventing inadvertant data entry and allowing the host to
verify each scan before enabling subsequent scans.
General Information
The HBCR-1800 Bar Code Decoder IC consists of an NMOS
decoding IC in a 40 pin Dual In-Line package. The readers
require an external 1K x 8 bit multiplexed RAM chip (Intel
8185 or similar) or a 1K x 8 bit RAM and an address latch
chip (Mostek MK4801 or similar and a 74LS373). To complete the reader, a 12 MHz crystal must also be added.
The wand is connected to pin 12 of the decoder IC (see Figures 1 and 2).
Data Communications
The decoding IC is designed to interface with most standard
microprocessors, and can communicate in either serial or
parallel ASCII. It provides complete compatibility with the
output from Hewlett-Packard digital bar code wands.
The decoder IC can communicate with the host system
through either a serial ASCII or parallel ASCII port. The parallel port allows for faster data communication between the two
devices. Both parallel and serial ports are bi-directional.
Performance Features
The serial port may also be connected directly to RS-232-C
level shifters to produce an RS-232-C compatible output. A
wide range of baud rate, parity, stop bits and terminator
characters may be selected, as described in Table 1. In addition, XON/XOFF pacing for the decoder IC's data transmission
is available.
Bar Codes Supported
The HBCR-1800 Bar Code DecoderlC is capable of reading
four popular bar code symbologies: 3 of 9 Code, Extended
3 of 9 Code, Interleaved 2 of 5 Code and UPC/EAN/JAN
Codes.
The 3 of 9 Code, an alphanumeric code, and the Extended 3
of 9 Code, a full 128 character ASCII version of the 3 of 9
Code, may be read bi-directionally for message lengths up to
a maximum of 32 characters. An optional checksum character may be used with these codes, and the decoder IC may
be configured to verify this character prior to data transmission. Enabling the Extended 3 of 9 Code will disable the
standard 3 of 9 Code as the two are mutually exclusive.
The parallel port uti lizes both a send and receive handshake
for data transfer between the decode'r IC and the host system. Timing diagrams for these handshakes are shown on
page 5.
The decoder IC has a 255 character output buffer which will
store data if transmission to the host is prevented. A buffer
overflow will actuate a signal on the beeper line for the
beeper to sound three times in rapid succession.
The Interleaved 2 of 5 Code, a compact numeric only bar
code, may also be read bi-directionally for message lengths
up to a maximum of 32 characters. To enhance data accuracy, an optional checksum character verification and/or
label length checking may be enabled.
Feedback Features
The decoder IC has several provisions for signalling operator
feedback. Pin 14 provides a signal for an LED driver and pin
15 provides a signal for a beeper driver. An LED or beeper
driver connected to the decoder IC may be controlled directly
by the IC, with a signal generated after a good read; or may
be controlled by the host system. In addition, the tone of the
beeper can be varied by a software command to be one of 16
different tones.
.
All popular versions of the UPC, EAN, and JAN bar codes
may be read bi-directionally, including UPC-A, UPC-E, EAN8, EAN-13, JAN-8, and JAN-13. All codes may be enabled
simultaneously or only tlie UPC codes may be enabled.
UPC, EAN and JAN codes with complementary two digit or
five digit supplemental encodations, or "add-ons", may also be
read in one of two ways. If UPC, EAN and JAN codes are
enabled but neither tWo digit nor five digit supplemental
encodations are enabled, then only the main part of the symbols printed with supplemental encodations will be read. If
the two digit or the five digit supplemental encodations are
enabled, then only symbols with these supplementals will be
read. In this case, the symbols may only be read in the direction which results in the supplement being scanned last.
Power Requirements
Both the decoder IC and the wands operate from a single
+5 V DC power supply. The maximum current draw for the
decoder IC is 175 mA Themaximum ripple voltage should
be less than 100 mV peak-to-peak.
Configuration Control
Automatic code recognition is provided for the Interleaved 2
of 5 Code, UPC/EAN/JAN Codes, and either the 3 of 9 Code
or the Extended 3 of 9 Code. The decoder IC's default setting
is for simultaneous reading of the 3 of 9 Code, Interleaved 2
of 5 Code and UPC/EAN/JAN Codes.
Configuration of the decoder IC may be determined through
hardwire connections and/or through software commands.
Hardwire selection is limited to key operating parameters. A
much greater range of configuration control is available
through software commands. A summary of the decoder IC
features and configuration control these features is presented in the following table.
Wand Input
The decoder IC has been specially designed to operate with
any of several Hewlett-Packard digital bar code wands.
3-32
- - - - --_ ..
__._----
-----------------------------_._---------
Table 1. Summary of Features and Configuration Control
Feature
Function of Value
Hardwirel
Software
Control[1)
Mode of
Operation
Parallel or Serial Mode
Hardwire
Parallel
Default
Settlng[2]
Mode[3]
N/A
Baud Rate
300,1200,2400,9600
Hardwire
300 Baud
Serial
Parity
O's, 1's, Odd, Even
Hardwire
O's
Serial
Stop Bits
1 or 2
Hardwire
2
Serial
Terminator
Character,
CR, CR/LF, HT, None
Hardwire
CR
Serial
User Defined 110 Characters Max.)
Software
CR
Both
Both
Both
Header
Character
User Defined 110 Characters Max.)
Software
No Header
Character
Data Output
Pacing
XON/XOFF
Software
No Pacing
3 of 9 Code
Interleaved 2 of 5 Code
Software
Industrial
Code Select
Extended 3 of 9 Code
UPC/EAN/JAN
Code
Select
Both
5
Interleaved
2 of 5 Code
UPC/EAN/JAN together;
or UPC Only
Software
UPC/EAN/JAN
Codes
Enable 2 or 5 Digit
Supplements
Software
Supplements
Not Enabled
Suppress Zeros UPC-E
Software
Zeros Included
3 of 9 Code Checksum
Both
Both
Both
Interleaved 2 of 5
Checksum
Software
No
Checksum
Verification
Interleaved 2 of 5
Label Length
Check
User Defined up to 32 Characters
or Variable Length
Software
Variable Length
Both
Scanner Disable
Disables Wand Input
Software
Wand Input
Enabled
Both
Good Read
Beep Select
Enables Good Read Beep
in one of 16 Tones
Software
Beep Signal
Enabled; Tone = 15
Both
Sound Tone
External Command to Sound Tones
Defines 1 of 16 Tones
Software
N/A
Both
LED Control
Controls LED Driver Circuit
Software
LED to Flash Upon
Good Read
Both
Status Request
Gives Status of Decoder
Ie Configuration
Software
N/A
Both
Software
N/A
Both
Resets Decoder IC to Hardwire
Configuration and Default Software
Settings
4
3 of 9 Code
Checksum
Verification
Enable
Hard Reset
Notes
Notes:
1. Software commands are sent by means of escape sequence.
2. Default settings are those settings which result when the relevant pins have been tied to +SV and no software commands have been
sent to the decoder IC.
3. Some functions apply only when the decoder IC is operating in the serial mode. Others apply in both the parallel and serial modes.
4. In the parallel mode, the parity is always odd.
5. In the parallel mode the terminator character is "CR" unless changed through software commands.
3-33
Recommended Operating Conditions
Parameter
Absolute Maximum Ratings
Parameter
Symbol Min. Typ. Max. Units Notes
Supply
Voltage
Ambient
Temperature
Crystal
Frequency
Vee
4.5
5.5
V
TA
0
70
°C
12
XTAL
7
MHz
8
Note:
7. Maximum power supply ripple of 100 mV peak-to-peak.
S. 12 MHz crystal is recommended.
Symbol
Min.
Max.
Units
Storage
Temperature
Notes
Ts
-65
+150
·C
Pin
Voltage
V,N
-0.5
+7.0
V
Power
Dissipation
Po
2.0
Watts
9
Note:
9. Voltage on any pin with respect to ground.
Block Diagrams
SERIAL PINOUT
PARALLEL PINOUT
BAUD{
RATE
STOP BITS
PARITV{
3
4
TERMINATOR{
PARALLEL
OUTPUT
PORT
ADDRESS
AND
DATA
BUSTO
RAM CHIP
2
3
4
ADDRESS
AND
DATA
BUSTO
RAM
CHIP
SUPRESS ZEROS UPC-E
RESET
RxD
TxD
WAND IN
NC
LED
BEEPER
TO RAM CHIP
fWii
lIfO
XTAL2
XTAL 1
GND
NC- Pins should be lell floating
Figure 1.
.Flgure 2.
DECODER IC TO MEMORY
8185 MULTIPLEXED
1Kx8RAM
1Kx 8 RAM WITH
ADDRESS LATCH CHIP
,
ADDRESS CONTROL
ADDRESS
CONTROL
DATA
DECODER
IC
8185
OR
SIMILAR
MK4801
OR
SIMILAR
DECODER
IC
ADDRESS
ADDRESS
CONTROL
DATA
Figure 3.
74LS373
CONTROL
Figure 4.
3-34
DATA
-------.---------~
)arallel Mode Handshake Timing
lOST COMMANDS RECEIVED BY DECODER IC
(INPUT FROM
HOST)
tCR~
-tCS~1
,
.
tCA
I[
1\
(HOST COMMAND
TO BUS)
tcc
I
,
PORT I
PINS 8-1
I
\.
'tCR = Falling edge of COMMAND READY to falling edge
of COMMAND READ. Max. = 22!,s (MICRO SECONDS).
'Note: These timing specifications given are based on the assumptions that the wand is not active at the time. Since the wand input to
the microprocessor is interrupt driven. the timing might be
stretched if the wand is active during that time. All the timings
assume the microprocessor runs at 12 MHz.
tcs = Command setup to rising edge of COMMAND
READY. Min. = 0 !'S.
'tCA = Rising edge of COMMAND READY to rising edge
of COMMAND READ. Typical = 6 !'s.
tcc = Rising edge of COMMAND READ to falling edge of
COMMAND READY. Min. = 0 !'s.
DECODER IC DATA SENT TO HOST
~
(INPUT FROM
HOST)
~
I--tDD
(DATA TO
BUS)
PORT I
PINS 8-I
,
\-
~
tDF_
.
tDD
-}I
.I
I - - tDW-----.I - t D H -
(OUTPUT TO
HOST)
,
-.V
I
'too = Falling edge of DATA READY to data output to
bus. Max. = 140!,s.
'tow = Rising edge of DATA READY to rising edge of
DATA WRITE. Max. = 5 !'S.
This number reflects that there is no decoding in progress,
no status, terminal 10, header or terminator change command is being executed at the time.
'toH = Data hold after rising edge of DATA WRITE.
Max. = 2 !'s.
too = Rising edge of DATA WRITE to falling edge of
DATA READY. Min. = 0 !'s.
'tOF = Data output to bus to falling edge of DATA WRITE.
Max. = 2!,s
3-35
DC Characteristics (TA= ooe to 70 oe, Vee = 4.SV to S.SV, Vss =OV)
Symbol
Parameter
VIL
Input low Voltage
Max.
Unit
0.8
V
Test CondlUonr;
Input High Voltage (except Pins 9 and 18)
Vee + 0.5
V
Input High Voltage (Pins 9 and 18)
Vee +0.5
V
Output Low Voltage (Pins H!. 10-17. 21-28)
0.45
V
IOL= 1.6 rnA
VOLI
Output Low Voltage (Pins 30 and 32-391
0.45
V
IOL=3.2mA
VOH
Output High Voltage (Pins 1-8,
10-17 and 21-281
V
IOH=-80p.A
VOH1
Output High Voltage (Pins 30 and 32-391
V
IOH ""-400 p.A
2.4
Input low Current (Pins 1-8,
10-17 and 21-28)
Low Current (Pin 1S)
nput High Current to Pin 9 for Reset
Pin 19 toVss
-SOO
p.A
-2.5
rnA
Pin 19 to Vss; VIN .. 0.45V
±10
p.A
0.45 < VIN < Vee
SOO
p.A
VIN=Vee-1.5
175
rnA
AU Outputs Disconnected
VII'I=O.45V
Wand 1/0 Interfaces
~~
Vee
121
WAND
CDNNECTOR
WAND
i
WAND INPUT
CONNECTDRWV---.......---~
SHIELD
SHIELD
MINIMAL
TRANZDRBS
P6KE 7.5C (THREE EACHI
RECOMMENDED
Note:
The shield must be connected to ground for proper wand operation.
Figure 5. Wand Interfaces
3-36
- - - - - - - - - - - - - ----- - - - - - - - - - - - - - -
Flin-
HEWLETT
~GtI PACKARD
MULTI-PURPOSE
BAR CODE DECODER IC
HBCR-2000
Features
• IDEAL FOR HAND SCANNING APPLICATIONS
AND MANY AUTOMATED SCANNING
APPLICATIONS
• COMPATIBLE WITH THE SCANNERS NEEDED
FOR VIRTUALLY ALL HAND-HELD SCANNING
APPLICATIONS
- Laser Scanners·
- Wands
- Slot Readers
• WIDE SELECTION OF INDUSTRY STANDARD
BAR CODES SUPPORTED
- Code 39 (3 of 9 Code)
- Extended Code 39
- Interleaved 2 of 5 Code
- UPC/EAN/JAN Codes
- Codabar (NW7 Code)
-Code128
• AUTOMATIC CODE RECOGNITION
• FULL DUPLEX SERIAL ASCII INTERFACE
• EXTENSIVE CONFIGURATION CONTROL
THROUGH SOFTWARE COMMANDS
• STANDARD 40 PIN DIP PACKAGE
• AUDIO AND VISUAL FEEDBACK CONTROL
• SINGLE 5 VOLT SUPPLY
Description
Hewlett-Packard's HBCR-2000 Multipurpose Bar Code
Decoder IC offers a flexible 'bar code decoding capability
designed to give OEMs the ability to address a large number
of industry segments and applications. The decoder IC's
flexibility is made possible through sophisticated software
which allows the IC to accept data input from a wide variety
of digital scanners and to decode the most popular bar
code symbologies with full automatic code recognition.
Implbmeritation of the decoder IC is easy since it requires
only a few supporting chips and provides a standard
interface to the host.
The HBCR-2000 is compatible with the scanners needed
for virtually all hand scanning applications. Specifically,
it is compatible with moving-beam laser scanners such as
the Symbol Technologies' LS7000, Symbol TechnologieS'
LS7000 II, and Spectra Physics' SP2001; fixed-beam noncontact scanners; Hewlett-Packard . digital wands; and
Hewlett-Packard digital slot readers.
The decoder IC is also an excellent decoding .solution for a
number of the stationary scanning applications found in
automated systems. In this case, the scan rates for movingbeam applications must be similar to the scan rates for most
hand-held laser scanners (35-45, scans/second) and the
scan speeds for fixed-beam applications must be similar to
the scan speeds for wands and slot rE:laders. For moving
beam applications, it is also important for the scanner to
utilize the three laser control lines on the IC.
The standard decoder IC supports the bar code symbologies
now being used for most applications in the. industrial, retail,
commercial, government, and medical markets. The bar
codes supported are: Code 39 (3 of 9 Code), Extended
Code 39, Interleaved 2 of 5 Code, UPC/EAN/JAN Codes,
Codabar (NW7 Code) and Code 128. If more than one code
is enabled, the decoder IC will automatically recognize and
decode the code being scanned. Bi~directional scanning is
allowed for all codes except UPC/EAN/JAN codes with
supplemental digits.
The HBCR-2000 communicates with the host through a
flexible,.full duplex serial ASCII interface. OEMs may choose
either to convert this interface to a standard data communi-.
cations protocol such as RS-232-CN.24 or to connect the
decoder IC directly to another microprocessor for data
processing or data re-formatting. Operator feedback is sup~
ported through piiui that allow for external LED drive and
beeper drive circuits. In addition, there are 21 programmable
functions covering items from laser redundancy check to
the tone of the beeper.
3-37
_... _-_.__ .
-_.. _._------- ---------_._._---_._------ . _ - - - - - - - - - - - - - - - - - _..... _._-- .. _-- _.- ----- .._-_._-..- . _ - - - - - - - - - - -
Applications
All popular versions of the UPC, EAN, and JAN bar codes
may be read bi-directionally, including UPC-A, UPC-E,
EAN-8, EAN-13, JAN-8, and JAN-13. All codes may be
enabled simultaneously or only the UPC codes may be
enabled. UPC, EAN, and JAN symbols with complementary
two digit or five digit supplemental encodations,or "addons", may also be read.
Bar codes are rapidly becoming a preferred alternative to
other forms of data entry. Bar coding has proven faster and
more accurate than keyboard data entry. I n addition, bar
code scanning typically has a higher first read rate and
greater data accuracy than optical character recognition.
When compared to magnetic stripe encoding, bar code
offers significant advantages in flexibility of media, symbol
placement and immunity to electromagnetic fields.
Codabar, a numeric only bar code with special characters,
may be read bi-directionally for message lengths up to a
maximum of 32 characters. The start and stop c'haracters in
the symbol are normally transmitted, but transmission of
these characters may be disabled through a software
command.
Manufacturers of data collection terminals, point-of-sale
terminals, keyboards, weighing scales, automated test equipment and other data collection or material handling equipment are finding a growing demand for bar code reading
capability in their products. The HBCR-2000 Multipurpose
Bar Code Decoder IC makes it easy to add bar code
reading capability for a wide variety of applications without
the need to invest in the development of bar code decoding
software.
Code 128, a compact full ASCII bar code, may also be
scanned bi-directionally for message lengths up to a maximum of 32 characters.
Automatic code recognition is provided for the Interleaved 2
of 5 Code, UPC/EAN/JAN Codes, Codabar, Code 128, and
either Code 39 or Extended Code 39. Any subset of these
codes may be selected for decoding. The decoder IC's
default setting is for simultaneous reading of Code 39,
Interleaved 2 of 5 Code with variable lengths, UPC/EAN/JAN
Codes without'supplements, Codabar, and Code 128.
Decoder Ie Specifications
GENERAL INFORMATION
The HBCR-2000 is an NMOS decoding IC in a 40 pin Dual
In-Line package. When configured in a system, the HBCR2000 requires a crystal and an external 1K byte RAM. The
external RAM may be implemented using either a multiplexed RAM chip (Intel 8185 or equivalent) or a nonmultiplexed RAM chip and a latch chip (Mostek MK4801 or
equivalent and 74LS373). The recommended crystal frequency is 11.059 MHz (CTS Knights R1032-6BA.11.059 or
equivalent).
SCANNER INPUT
The HBCR-2000 is designed to accept a digital input signal
either from a fixed-beam scanner, such as a wand, slot
reader, or fixed-beam non-contact scanner, or from a
moving-beam scanner such as a hand-held laser scanner.
The state of pin 7 must be set prior to power-up to reflect
the type of scanner connected to the decoder IC.
The decoding software has been specially designed to
operate with any of Hewlett-Packard's digital bar code
wands. Sapphire-tip digital wands feature a scan angle of 0
to 45 degrees, a variety of resolutions, and a TIL compatible
digital output. A complete wand selection guide is presented
in Table 2.
The decoder IC is designed to interface with most standard
microprocessors or other host systems through a full duplex
serial asynchronous ASCII port. It offers complete compatibility with Hewlett-Packard digital wands and digital slot
readers as well as hand-held laser scanners from both
Spectra Physics, Inc. and Symbol Technologies, Inc. Other
scanners, such as hand-held fixed-beam non-contact scanners and the scanners used in some stationary scanning
applications, may also be used with the IC.
The decoder IC is also designed specifically for operation
with Hewlett-Packard's digital slot readers. These slot readers
feature a sealed case with a slot width of 3.2 mm (0.125 in.)'
and either an infrared (880 mm) or visible red (660 mm)
LED light source. A separate module which contains the
slot reader optics and electronics is available for stationary
scanning applications or for configuration in applications
requiring a different slot width.
'
Performance Features
BAR CODES SUPPORTED
The HBCR-2000 decoder IC is capable of reading six popular bar code symbologies: Code 39 (3 of 9 Code). Extended
Code 39, Interleaved 2 of 5 Code, UPC/EAN/JAN Codes,
Codabar (NW7 Code), and Code 128.
'
Code 39, an alphanumeric code, and Extended Code 39, a
full 128 character ASCII version of Code 39, may be read
bi-directionally for message lengths up to a maximum of 32
characters, An optional check character may be used with
these codes, and the decoder IC may be configured to
verify this, character prior to data transmission. Enabling
Extended Code 39 will disable standard Code 39 as the
two are mutually exclusive,
The Interleaved 2 of 5 Code, a compact numeric only bar
code, may also be read bi-directionally for message lengths
from 4 to 32 characters. To enhance data accuracy, optional
check character verification and/or label length checking
may be enabled.
The decoding software for moving-beam scanners has been
designed to work with hand-held laser scanners manufactured by Spectra Physics, Inc. and Symbol Technologies,
I nco The delay time for automatic laser shutoff is adjustable
through a software command to the IC. A redundancy
check feature is available for applications which require
extreme accuracy. Applications which require and ability to
sense motor failure in a laser scanner or to calculate the
ratio of laser on-time to laser ofHime must support these
requirements through external hardware.
The digital input Signal from the scanner is connectedto pin
12. When the decoder IC is used with a hand-held laser
scanner, the laser enable, laser trigger, and scanner synchronization signal 'lines are connected to pins 6, 8, and 1:3,.
respectively. Scanner input can be disabled by ttie host
system though a software command. This allows the, application program to enable bar code data entry only when
3c38
I'
expecting the operator to enter data which has been
encoded in bar code. The decoder Ie also offers a single
read mode which can be enabled through a software
command. The single read mode allows the application
program to prevent bar code data entry until a "Next Read"
command is sent, thereby allowing the host to process
transmissions and verify each scan before enabling subsequent decodes.
ware command to be one of 16 tones or the beeper may
be silenced.
POWER REQUIREMENTS
The decoder IC operates from a single 5 V DC power
supply. The maximum current draw is 175 mAo The maximum ripple voltage for the power supply should be less
than 100 mV peak-to-peak.
DATA COMMUNICATIONS
The decoder IC communicates with the host system
through a full-duplex, asynchronous, serial ASCII port. A
wide range of baud rate, parity, stop bits, and terminator
characters may be selected, as described in Table 1. In
addition, both request-to-send/clear-to-send hardware handshake and XON/XOFF (DC1/DC3) character pacing are
available for control of the decoder IC's data transmission.
CONFIGURATION CONTROL
Configuration of the decoder IC may be determined through
hardwire connections and/or through software commands.
Hardwire selection is limited to key operating parameters. A
much greater range of configuration control is available
through software commands. A summary of the decoder IC
features and the configuration control available for these
features is presented in Table 1. A users manual which
provides detailed configuration information and example
schematics is supplied with the HBCR-2000.
OPERATOR FEEDBACK
The decoder IC has several provisions for signalling operator
feedback. Pin 14 provides a signal for an LED driver and pin
15 provides a signal for a beeper driver. An LED or beeper
driver connected to the decoder IC may either be controlled directly by the IC, with a signal generated after a
good read, or may be controlled by the host system. In
addition, the tone of the beeper can be varied by a soft-
Handling Precautions
The decoder IC is extremely sensitive to electrostatic discharge (ESD). It is important that good anti-static procedures
be observed when handling the IC. The package should not
be opened except in a static free environment.
Recommended operating Conditions
Typ.
Parameter
Symbol
Min.
Max.
Units
Noles
Supply Voltage
Vcc
4.5
5.5
V
1
Ambient Temperature
TA
0
70
"C
Crystal Frequency
XTAL
MHz
2
Element Time Interval (MOVing-Beam)
ETiM
22
555
Itsec
2,3,4,5
Element Time Interval (Fixed-Beam)
ETIF
150
70,000
Itsec
2,3,5,6,7
11.059
NOTES:
1. Maximum power supply ripple of 100 mV peak-to-peak.
2. Crystal frequencies from 3.5 MHz to 12 MHz may be used. For
frequencies other than 11.059 MHz, multiply the specified baud
.
XTAL
rates and beeper frequencies by 11.059 MHz and multiply the
4. Corresponds to a scan rate of 35 to 45 scans per second, a
scan rate which is common for hand-held laser scanners.
5. Element time intervals which are smaller than the minimum
ETI's specified will still be processed, but with additional width
errors that may cause the input signal to be undecodable.
6. The maximum scan speed may be calculated by dividing the
smallest narrow element width by 150 Itsec. For example, for
0.19 mm (0.0075 in.) narrow elements, the maximum scan
speed is 127 cm/sec (50 in.!sec).
7. The minimum scan speed may be calculated by dividing the
largest wide element width by 70,000 Itsec. For example, for
1.52 mm (0.060 in.) wide elements, the minimum scan speed
is 2.2 cm/sec (0.9 in.!sec).
element time interval ranges by 11.~5~A~HZ. The ETI ranges
specified a crystal frequency of 11.059 MHz.
3. An element time interval (ETI) is the time period in the digital
signal from the scanner that corresponds to the physical width
of a printed element (bar or space) in the bar code symbol
ETIM applies when pin 7 is tied low and ETIF applies when pin
7 is tied high.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
-65
+150
°C
Pin Voltage
VIN
-0.5
+7.0
V
Power Dissipation
Po
1,5
Watts
Nole:
8. Voltage on any pin with respect to ground.
3-39
Notes
8
TABLE 1. SUMMARY OF FEATURES AND CONFIGURATION CONTROL
I
Scanner Type
~
Laser Shutoff Delay
I
Hardwlre/
Software
ControlI91
Function or Value
wand/Slot Reader or Moving Beam Laser Scanner
Hardwire
I
Defines Laser On-Time prior to Automatic Shutoff
from 0 to 10 seconds in 100 me steps
Laser RE!dundancy Check 'Enables Requirement for Two Consecutive,
Identical Decodes for a Good Read
~---------------4~------------------------------~SC~an~ne~rl~n~pu~t~E-n-a~bl~e----~E~na~b~le~$-D~~~a~A~cq~u~m~it~io~n_f_rom
__S~ca~n_ne_r________
Single Read Mode
Enables Requirement for a 'Next Read' Command
before Processing the next Scanner Input Signal
Extended Code 39
J!
Default
Settlng[10]
Software
MOVing Beam
Laser Scanner
3 seconds
Software
Not Enabled
-------+--------~
ftware
Enabled
Software
Not Enabled
Both
Co~39
Interleaved 2 of 5 Code
UPCIEAN/JAN Codes
Codabar
Code 128
Code Select
8~
iTil
rn
____________
UPC/EAN/JAN
Decoding Options
!~
~~
________________
Software
__________________________4-________
UPC/EANlJAN together; or UFC Only
Software
Code 39
Interleaved
20f 5 Code
UPC/EAN/JAN
Codes
Codabar
~~C~O~~1~~~
UPC/EAN/JAN
together
Supplement&
~~_a_b_le_2_or
__5_D_i9_it_S_u_p_~_em
__
en_~____________~___ftw
__a_~
__-+~N~ot~E~n~ab~l~ed~
No Check
Character
Verification
Transmit
Check Character
Verification Enable
Code 39 Check Character
Interleaved 2 of 5 C~ Check Character
Software
Codabar Data
1l'ansmlSSion Option
Interleaved 2 of 5
Label Length Check
Baud Rate
TransmIt or Suppress StartlStop Characters
Software
User Defined from 4 to 32 Characters
or Variable l.ength
1200,2400.4800,9600
0'$, 1's, Odd, Even
10r2
Software
Variable
Length
HardwltJi~
1200
Hardwire
O's
jl~
i
Terminator Charactar
(,)
Header Character
I
Data OUtput Pacing
1. Good Read Beep Select
I Sound Tone
Both
~-+__..;.,1_--l
CR,CR/L~ETX,None·
User Defined (10 Characters Max.)
User Defined (10 Characters Max.)
Software·
FITS/CTS
Harawire
Software '
Software
Enables Good Read Beep and sets 1 of 16 tones
Software
t
r=
CR
No PacIng
Beep Enal;lled;
Tone 12
N/A
Software
External Command to InHiate Beep Signal
in 1 of 16 tones
~~------------+-~------------~~----~-----4
LED Control
Defines LED Control to be Internal,
Software
LED to Flash
Po
External. or both
Automatically
o
Upon Good Read
u.
1
je
Status Request
~'E Hard Reset
ililj
Gives Status of Decoder IC Confl9ur~ion
Resets Decoder IC to Hardwire Configuration
and Default Software Settings
Software
Software
N/A
N/A
NOTES:
9. Hardwire control is accomplished by tying the appropriate
input pins high or low. Software commands are sent by means
of escape sequences.
10. Default settings are ,those settings which result when the
relevant Input pins have been tied to Ground and no software
commands have been sent to the decoder IC.
3-40
---~~
..
--------~-----~---------------------
Pinout
BAUD{
RATE
VCc(+5 V)
ADO
ADl
AD2
AD3
LASER ENABLE OUTPUT
6
ADDRESS
AND DATA
BUS
AD4
SCANNER TYPE INPUT
AD5
LASER TRIGGER INPUT
AD6
AD7
+5V
ADDRESS LATCH ENABLE
NC
SCANNER SIGNAL INPUT
LASER SYNCHRONIZATION INPUT
CODE 39 CHECK CHARACTER
EXTENDED CODE 39
LED OUTPUT
} TERMINATOR
}
A9
PARITY
}
TO RAM CHIP
AB
VSS(GND)
Figure 1.
Block Diagrams
DECODER IC TO MEMORY
1K x 8 RAM WITH ADDRESS LATCH CHIP
8185 MULTIPLEXED 1K X 8 RAM
ADDRESS CONTROL
A
MK4801
OR
SIMILAR
DECODER
IC
ADDRESS
CONTROL
DATA
74LS373
ADDRESS
CONTROl..
DATA
DECODER
IC
B1B5
OR
SIMILAR
ADDRESS
CONTROL
DATA
Figure 2.
Figure 3.
Scanner Compatibility
The HBCR-2000 is compatible with the complete line of
Hewlett-Packard digital wands, Hewlett-Packard digital slot
readers, and hand-held laser scanners manufactured by
both Symbol Technologies, Inc. and Spectra Physics, Inc.
ink smearing, spots and voids, or other minor print flaws,
the wands which specify a recommended nominal narrow
element width of 0.3 mm (0.012 in.) or 0.33 mm (0.013 in.)
are recommended.
The selection of Hewlett-Packard digital wands available for
use with the HBCR-2000 is presented in Table 2. For the two
families of sapphire-tip digital wands, the most widely used
wands are those which specify a recommended nominal
narrow element width of 0.19 mm (0.0075 in.). These wands
are capable of reading bar codes printed with a variety of
different printers and over a wide range of printed resolutions
(as specified by narrow element widths) and are, therefore,
considered to be general-purpose wands. The higher resolution wands, with a recommended nominal narrow element
of 0.13 mm (0.005 in.), are recommended for applications in
which only high resolution bar codes are being read. For
applications which require a scanner to read medium or low
resolution bar codes, particularly those with edge roughness,
The Hewlett-Packard slot readers and slot reader modules
which are available for use with the HBCR-2000 are presented in Table 3. The standard slot readers have a slot
width of 3.2 mm (0.125 in.) and are, therefore, capable of
reading bar codes on anything from paper to doublelaminated badges. For applications which require a different
slot width or. which require a fixed-beam scanner in an
automated system, a module which contains the slot reader
optics and electronics assembly is also available.
3-41
The hand-held laser scanners compatible with the HBCR2000 include the Symbol Technologies' LS7000, Symbol
Technologies' LS7000 II, and Spectra Physics' SP2001. For
detailed information on these scanners, please contact these
companies directly.
TABLE 2. HEWLETT-PACKARD DIGITAL BAR CODE WANDS
Emltter[13]
Wsvelength
Tilt
Angle
"TYpical
Current
Case
Material
Switch
Tip
O.Smm
(0.012 in.)
700nm
O-SO°
42 ma
ABS Plastic
Yes
Open
HEOS-30S0
I
I
I
I
I
No
I
HBGS-2200
OJ9mm
(0.0075 in.)
700nm
0-45°
42 ma
Poly carbonate
Yes
Sapphire
Ball
HBGS-2300
I
I
I
I
I
No
I
HBGS-2400
0.13mm
(0.005 in.)
820mm
I
I
Polycarbonate
Yes
I
HBGS-2500
I
I
I
I
I
No
I
HBGS-SOOO
0.33mm
(0.013 in.)
655nm
0-450
3.5 ma
Poly carbonate
Yes
Sapphire
Ball
I
I
I
I
No
I
Metal
I
)
Part Number
~';;
00
--10
Q.
i7
'"
.!::
HEOS-SOOO
s;
Q.
Q.
co
III
i
HBGS-5l00
~
HBCS-6WO
Q.
:a
Q.
Q.
HBGS·5200
co
III
i
HBCS-5300
HBGS-6300
::>
0
~
HBGS-5400
Q
--I
Recommended[11, 12J
Nominal Narrow
Element Width
HBCS-5500
HBCS-6500
I
I
I
I
I
0.19 mm
(0.0075 in.)
I
I
I
Polycarbonate
Yes
I
I
I
I
I
No
I
I
I
I
I
Metal
I
I
I
O.13mm
(0.005 in.)
820mm
I
I
Polycarbonate
Yes
I
I
I
I
I
I
I
I
I
I
No
Metal
I
I
I
tion) than specified may also be read as long as print quality is
good.
13. Wands with an emitter wavelength of 655 mm are recommended for reading bar codes printed on regular (white)
thermal paper or printed with Hewlett-Packard's Thinkjet
printer. Either 655 mm or 700 mm wands are recommended for
bar codes printed with dye-based ink or in color.
14. Low current sapphire-tip wands are designed to operate in all
ambient light environments including in direct sunlight and
under high intensity lamps.
NOTES:
11. The nominal narrow element width of a symbol may also be
referred to as the resolution of the symbol or as the 'x'
dimension of the symbol.
12. Nominal narrow element (bar/space) width, a term which
applies to the symbol and not to the scanner itself, is specified
to facilitate selecting the best scanner for the symbol being
read. The scanners are designed to accomodate printing
tolerances around the nominal dimension specified. Bar codes
having larger nominal narrow element widths (ie. lower resolu-
TABLE 3. HEWLETT-PACKARD DIGITAL SLOT READERS
Part Number
Configuration
Recommended(15)
Nominal Narrow
Element Width
Emitter[16)
Wavelength
Temperature
Range
Case
Material
HBCS-7000
Complete Slot Reader
0.19 mm (0.0075 in.)
660 nm
-20 to +55"G
Metal
HBGS-7001
Slot Reader Module
I
B60nm
I
HBCS-7100
Gomplete Slot Reader
0.19 mm (0.0075 in.)
880 nm
-40 to +70 0 G
I
I
HBGS-7101
Slot Reader
I
880 nm
I
I
NOTES:
15. The aperture design of the slot reader optical system allows
reading both high resolution bar code symbols and poorly
printed medium or low resolution bar code symbols with the
same scanner.
16. The 880 nm slot reader is recommended for bar code symbols
printed with carbon-based inks or for "black-an-black" bar
code symbols. The 660 nm slot reader is recommended for bar
code symbols printed with dye-based inks or printed on regular
thermal paper.
3-42
F/iP'l HEWLETT
CMOS MULTI-PURPOSE
BAR CODE DECODER IC
~e.. PACKARD
HBCR-2010
Description
The HBCR-2010 is a CMOS (low power) version of the
HBCR-2000. With the exception of the power consumption, the performance of the HBCR-2010 is identical to the
HBCR-2000. Please refer to the HBCR-2000 data sheet
and manual (part # 5954-2165) for a complete discussion
of the capabilities of the product. The following information summarizes the differences between the HBCR-2000
and the HBCR-2010.
Power Consumption (at Vee of 5.0 Volts)
15 mA
HBCR-2010
Idle Mode lYpfeal
Maximum
Typical
HBCR-2000
175mA
N/A
19 mA
4mA
Note:
Idle mode only occurs when the HBCR-2010 decoder is in the Wand Mode. Idle mode does not occur when the HBCR-2010
decoder is in the Laser Mode.
External Clock Drivers
If an external clock is to be used, the function of XTAL 1 (pin 19) and XTAL2 (pin 18) is different for the HBCR-2010.
18
Clock
TTL Level
19
20
XTAL2
18
No Connect
19
Clock
CMOS Level
XTAL1
20
Ground
I
Ground
Ground
HBCR-2010
HBCR-2000
3-43
XTAL2
XTAL1
Ground
Flin-
HEWLETT
~~ PACKARD
INDUSTRIAL
DIGITAL BAR CODE
SLOT READERS
HBCS~7000
HBCS-70S0
HBCS-7100
HBCS-7150
Features
• MULTI-RESOLUTION
Compatible with Virtually All Bar Code
Resolutions
• LARGE SLOT WIDTH
Allows Reading Multiple Laminated Cards
• SEALED METAL CASE (IP 66/67)
Can Be Installed Outdoors or in Wet
Environments
• TAMPER PROOF DESIGN
Ideal for Security Applications
• MINIMAL FIRST BAR DISTORTION
Compatible with Most Decoding Software
• AVAILABLE IN EITHER VISIBLE 660 nm OR
INFRARED 880 nm VERSIONS
• WIDE OPERATING TEMPERATURE RANGE
-40 to 70° C (HBCS-7100)
-20 to 55° C (HBCS-7000)
holes, the units become tamper-proof, making them excellent choices for security access control.
The optical system is centered in the slot track,allowing
the user to easily scan from either direction. The wide slot
width makes it easy to insert and slide the cards. The
optical system is covered with a recessed window to
prevent contamination and reduce the wear on the cards.
• WIDE SCAN SPEED RANGE
• BLACK TEXTURED EPOXY FINISH
• DIGITAL OUTPUT
Open Collector Output Compatible with TTL
and CMOS Logic
The standard slot reader comes with the optical/electrical
asembly mounted on a base plate with an opposite rail. A
122 em (48 in.) straight cord and a 5 pin, 240 degree,
locking DIN connector are also standard.
• SINGLE 5 VOLT SUPPLY
Description
Hewlett-Packard's Industrial Digital Slot Readers are designed to provide excellent scanning performance on a
wide variety of bar coded cards and badges. They contain
a unique optical/electrical system that integrates over a
large area of the bar/space pattern, providing a greatly
improved first read rate even on poorly printed bar codes.
The HBCS-7000 has a visible red (660 nm) optical system
with a resolution of 0.19 mm (0.0075 in.). The HBCS-7100
model has an infrared (880 nm) optical system with a
resolution of 0.19 mm (0.0075 in.).
The extra large depth of field allows these slot readers to
have a slot width of 3.2 mm (0.125 in.), thus making it
possible to read even multiple laminated cards and badges.
When used as a stand alone optics module, the maximum
depth of field is dependent on resolution.
The optics and electronics are housed in a rugged metal
case. The cases are fully gasketed and sealed, making
them suitable for use in outdoor or wet environments. The
black epoxy coating adds a durable, ·finished look to these
Digital Slot Readers. When installed using the rear screw
The optical/electrical system is also available as a separate
unit which can be integrated into other equipment or used
as a stand alone sensor assembly.
Applications
The digital bar codeslot reader is a highly effective alternative to keyboard data entry. Bar code scanning is faster
and more accurate than key entry and provides far greater
throughput. In addition, bar code scanning typically has a
higher first read rate and greater data accuracy than
optical character recognition. When compared to magnetic
stripe encoding, bar code offers significant advantages in
flexibility of media, symbol placement and immunity to
electromagnetic fields.
Hewlett-Packard's Industrial Digital Slot Readers are designed for applications where high first read rate and
durability are important factors. The epoxy coated metal
case, with its tamper-proof mounting system, makes these
slot readers ideal choices for security access control, time
and attendance recording and other bar coded badge and
card reading applications.
3-44
Recommended operating Conditions
Symbol
Parameter
Min.
Nominal Narrow Element Width
H8GS:YOOO/7050
0.19 (0.0075)
20 '(~l)
Scari'Velocity!l J
VSCAN
Gontrast!2]
Rw-Rs
45
Vs
4.5
Supply Voltage(31
Temperature(4]
HBGS-7000/70S0
.,
.
Amb!ent Lighj[5]
Units
mm(in.)
0.19 (0.0075)
H8GS-7100/7150
HBCS-7100/7l50
Max.
mm (in.)
317 (125)
cm/sec{ln .. sec/.) •
5.5
Volts
%
TA
-20
+55
°G
TA.
-40
+70
°C
lQP,OOO
lux
Ev
Notes:
1. Measured scanning a symbol with 0.19 mm (0.0075 in.1 narrow elements. For larger narrow element widths, the maximum scan
velocity will increase proportionately.
2. Contrast is defined as Rw-Rs where Rw is the reflectance of the white spaces and Rs is the reflectance of the black bars, measured
at the emitter wavelength (660 nm or 880 nm). Contrast is related to print contrast signal (PCS) by PCS = (Rw-Rs)/Rw or Rw-Rs =
PCSx Rw.
3. Power supply ripple and noise should be less than 100 mV peak to peak.
4. Non-condensing. If there is frost or dew covering over the optics window, it should be removed for optimal scanning performance.
5. Direct sunlight at any illumination angle.
Absolute Maximum Ratings
Symbol
Min.
Max.
Storage Temperature
Ts
-40
+80
°C
Supply Voltage
Vs
-0.3
+7:0
Volts
200
mW
-0.3
+20
Volts
Parameter
Output Transistor Power
Pr
Output Collector Voflage
Vo
Units
WARNING:
OBSERVING THE INFRARED LIGHT SOURCE IN THE HBCS-7150 AT CLOSE DISTANCES FOR PROLONGED
PERIODS OF TIME MAY CAUSE INJURY TO THE EYE. When mounted with the rail in place, the infrared output flux is
radiologically safe. With the rail removed, precautions should be taken to avoid exceeding the limits recommended in
ANSI Z136.1-1981.
Electrical Operation
The HBCS-7XXX family of digital slot readers consists of a
precision optical system, an analog amplifier, a digitizing
circuit, and an output transistor. These elements provide a
TTL compatible output from a single 4.5 V to 5.5 V DC
power supply. The open collector transistor requires a
pull-up resistor for proper operation.
The slot reader connector provides a shield which should
be terminated to logic ground or, preferably, to both logic
ground and earth ground. The shield is connected to the
metal housing of the 5 pin DIN connector, the metal
housing of the slot reader, and logic ground inside the slot
reader.
A non-reflecting black bar results in a logic high (1) level
output, while a reflecting white space will cause a logic
low (0) level output. After power-up, the slot reader will be
fully operational after a period of approximately 6 seconds.
During operation, the slot reader will assume a logic low
state after a short period (typically 1 second) if no bar
code is scanned. This feature allows multiple scanners
(both slot readers and Hewlett-Packard sapphire tip wands)
to be connected together with a simple OR gate.
The recommended logic interface for the slot reader is
shown in Figure 1. This interface provides ESD protection
for both the slot reader and the user's electronics.
The maximum recommended cable length for the slot
reader's output is 25 feet.
3-45
Electrical Characteristics (V s " 4.5 V to 5.5 V, T
Symbol
Parameter
Supply Current
HBCS-7000!7050
Is
HBCS-7100!7150
Is
Min.
A "
25°C, unless otherwise noted)
Max.
Units
50
100
mA
. Vs"5.0V
65
100
mA
Vs=S.OV
VOH=2.4V
'TYP·
High Level Output Current
IOH
1.0
p.A
Low Level Output Voltage
VOL
0.4
V
Output Rise Time
Output Fall Time
Electrostatic Discharge Immunity[6j
Ir
0.9
5.0
If
0.07
5.0
ESD
25
Conditions
IOL = 16 mA
p.S
10%-90%
Transition
P.s
Rl
"
1K 0;
kV
Notes:
6. Shield must be properly terminated (see Figure 1). The human body is modeled by discharging a 300 pF capacitor through a 500
resistor. No damage to the slot reader will occur at the specified discharge level.
Interface Specifications
The slot readers include a standard Spin, 240°, metal,
locking DIN connector. The recommended logic interface
is shown in Figure 1. The mechanical specifications and
wiring are shown in Figure 2. Mating connectors are
available from SWITCH CRAFT in both 5 pin and 6 pin
configurations. These connectors are listed on the right.
§
TRANZORB P6KE 7.5 C
I
V,(1)
SPin
SWITCH CRAFT 13EL5F
5 Pin
SWITCHCRAFT 61HA6F
6Pin
TRADEMARK OF GENERAL
r---------,I
I
I
SWITCH CRAFT 61 HASF
TRANZORB IS A REGISTERED
13 EACH)
SHIELD
Configuration
Connector
SEMICONDUCTOR INDUSTRIES.
TEMPE AZ
+5 V
74LS14
i
SLOT READER
ELECTROSTATIC DISCHARGE
SYSTEM INTERFACE
SUPPRESSION INTERFACE
Figure 1. Recommended Logic Interface (When earth ground is not available, connect shield to logic ground, as shown by dolled line).
"'_ _
""~
WIRE COLOR
13.6\0.53)
L"",,~---J
RED
Vs SUPPLY VOLTAGE
WHITE
Vo OUTPUT
BLACK
GROUND
N/A
N/C
N/C
N/A
CASE
HBCS-6XXX
NOTES:
1. DIMENSIONS IN MILLIMETRESAND IINCHES).
Figure 2. Connector Specifications.
3-46
SHIELD IMUST BE
CONNECTED I
n
Mounting Considerations
Slot Reader
(:'~)r------------------------'
The slot reader (HBCS-700017100) is designed to be virtually tamper-proof when mounted using the two rear
mounting holes. In this case, the cable must be routed
from the rear of the slot reader through the mounting
surface (wall, door, etc.). For applications where a tamperproof installation is less of a concern, an optional mounting bracket (HBCS-7999) allows for more convenient surface mounting.
_ 7.0
~ (0.23)
When mounting the slot reader, the cable may either be
routed through the mounting surface (see above), or it
may be routed along grooves in the base and exit the side
of the slot reader at anyone of four points. This allows
flexibility in the mounting orientation.
ffi (a. DB}
.=
6.0
E 10.241
7 5.0
~ (0.20)
z
4.0
~ (0.16)
is 3.0
~ (0.12)
~
Q..
a
2.0
1.0
(0.04)
0.05
0.10
0.15
0.20
0.25
0.30
0.35
10.0021 10.0041 10.0061 10.0031 10.0101 10.0121 10.0141
MINIMUM SYMBOL RESOLUTION - mm (inches)
Optics/Electronics Module
The optics/electronics module (HBCS-705017150) is designed for applications which require a different slot width,
integration into a larger housing, or a fixed-beam stationary scanner. When using the optics/electronics~ module,
the operating distance from the front surface of the module
to the symbol will vary depending on the symbol resolution. Figure 3 shows the relationship between operating
range and minimum symbol resolution for a typical optics/
electronics module. This relationship was applied in the
design of the slot reader, where a slot width of 3.2 mm
(0.125 in.) insures excellent performance reading bar code
symbols which have a nominal resolution of 0.19 mm
(0.0075 in.) and include printing errors.
When mounting the optics/electronics module it is important that the screws be tightened with a minimum static
torque of 2.5 Nm (22 in.-Ibs.). This will insure that the
sealing gasket is compressed sufficiently to provide proper
sealing.
Rail
The rail (HBCS-7998) is designed for use with the optics/
electronics module in applications which require a different slot width. It may also be used in applications where it
is preferable to mount the optics/electronics module and
rail flush to the mounting surface instead of using the base
provided with the slot reader.
Figure 3. Typical Operaling Distance vs. Minimum Symbol
Resolution.
and spaces should cross the area between 1.14 mm (0.45
in.) and 1.40 mm (0.55 in.) from the bottom edge of the
card(s) or document(s).
The bars should be perpendicular to the bottom edge of
the card(s) or document(s), however, a skew of ±4 degrees
from the perpendicular is acceptable.
Maintenance Considerations
The slot reader and optics/electronics module include a
window which is slightly recessed in order to prevent
direct contact with the bar code symbol. This reduces
wear on both the window and the symbol. The window
may, however, become dirty over a period of time. If this
occurs, clean the window with a commercial glass cleaner.
Testing
Mounting Bracket
The mounting bracket (HBCS-7999) is designed to provide
a convenient way of mounting the slot reader, optics/
electronics module, and/or rail to a flat surface.
All Hewlett-Packard Digital Bar Code Slot Readers are
100% tested for performance and digitizing accuracy after
manufacture. This insures a consistent quality product.
More information about Hewlett-Packard's test procedures,
test set-up, and test Ifmits are available upon request.
Symbol Placement
The center of the slot reader's optical system is located
12.7 mm (0.50 in.) from the bottom of the slot. Consequently, bar code symbols to be read by the slot reader
must be positioned on the card(s) or document(s) at a
height which insures that all bars and spaces will cross a
line located 12.7 mm (0.50 in.) from the bottom edge of the
card(s) or document(s). For optimal performance, all bars
optional Features
For options such as special cables or connectors, contact
your nearest Hewlett-Packard sales office or authorized
representative.
3-47
Dimensions
SLOT READER
(HBCS-7000/7100)
OPTICS/ELECTRONICS MODULE
(HBCS-7050/7150)
r-t=~~~~~~
0.32
M5 X O.BO
TAPPED HOLE
2.0310.80)
.L....._:c;::~=====i.-..J -------1..
10.125)
12)
F~
#8-32
TAPPED HOLE
(2)
~~~~~~~~7~1~IA;..'--i1i~=I-==""'_===__"U~,,!___...L
CABLE
EXIT
12)
12.70
2.0310.80) DIA.
11.43
14.50)
'~{-
MAX.
1+-----1270 15.00) ~---.j
CABLE
EXIT
RAIL
(HBCS-7998)
if'75
10.69)
L-_.J.._ _ _ _ _ _
#8·32
f
TAPP~~ HDLE~~
2.7911.10)
t
I
_
_
...I.._...Jl~·80)
~
~7.6213.00)~ ~.I
~12.7015.00)
MOUNTING BRACKET
(HBCS-7999)
0.5010.196) DIA. THRU
16 PLCS)
1
T)
7.11
7.62
0.43 10.170) DIA. THRU
CSK 42° X 0.99 (a.39) DIA.
14 PLCS)
13.00)
0.50 (0.196) DIA. THRU
CSK 42· X 0.9910.39) DIA.
12 PLCS)
2.1610.85) DIA. THRU
NOTES,
1. MOUNTING HOLES ON HBCS·7000/7100 ARE SUITABLE FOR EITHER #10-a:2 OR
MS·O.SO SCREWS.
2. MOUNTING HOLES ON HBCS-7050/7150 ARE FOR #8-32 SCREWS,
3. MOUNTING HOLES ON HBCS-799S ARE FOR #8·32 SCREWS.
4. THICKNESS Of THE HBCS·79S9 MOUNTING BRACKET IS 3.2 mm (0.125 in.)
5. HBCS·7000/7100 SLOT READERS, HBCS·705017150 MODULES, AND HBCS·799B
RAILS HAVE A BLACK TEXTURED EPOXY FINISH. HBCS·7999 MOUNTING
BRACKETS HAVE AN ELECTROLESS NICKEL FINISH.
6. ALL DIMENSIONS ARE NOMINAL AND ARE STATED IN MILLIMETRES AND (INCHES).
3"48
~
1.07
[10.42)
0.5310.21)
Selection Guide
Dellcr '"
Part Number
HBCS-7000
p!JiS-7100
I» HBCS-7050
HBCS-7150
n
Slot Reader with 660 nm visible red light source and 0.19 mm (0.0075 in.) nominal
resoluti'bn.
Reader with 880 nm Infrared light source and 0.19 mm (0.0075 in.) nominal
lution.
tics/Electronics MOdule~with gso nm visible red light source and 0.19 rrfifl'
.22
A
1\=700nm. Vo=5V
Detector Area
Ao
.160
IN
TA=25°C
TA-70·CI
Fig.
Note
IF=O, Vo"'5V;
Refiectlon"'O%
12
mm2 Square. with Length=.4mm/Side
Emitter Electrical/Optical Characteristics at TA=25°C
Parameter
Symbol
Forward Voltage
VF
Reverse Breakdown Voltage
BVA
Min.
Typ.
Max.
Units
1.6
1.8
V
IF=35mA
V
IR=l00I'A
5
Conditions
Radiant Flux
0
0
9~%
70
i!:
50
a:
30
,-I
20
UJ
~
40
qO,3
·0,2
-0,1
80
:'l::>
70
0
"
"::>
60
UJ
50
:::i
~10%
I-d- ~
.
;::
"...
\
10
~
100
2
0
1\
60
"...
110
I
100
0,1
0
0,2
I\,
I\.
40
30
~
'"
- r--- -
I- -
90
20
'"
10
00
0.3
1
Ad - EDGE DISTANCE (mm)
UJ
'"02
51
UJ
a:
,-
~
~
I
~
70
60
;;:
10
oS
...2
\\.
"...
40
~
I
600
700
900
800
0,1
0,01
1000
/
If_
I
~
20
0
"",,'
/ :3I
1§
.,
~O'C
25'C"
V
I
UJ
::>
~
30
::
a:
a:
"
50
10
6
100
io-.
80
""5
Figure 11. Modulation Transfer Function
I"",
90
4
SPATIAL FREQUENCY (LINE PAIR/mm)
Figure 10. Step Edge Response
100
3
2
E
If
1,3
A - WAVELENGTH (nm)
I
1,5
1,4
1,6
1,7
v, - FORWARD VOLTAGE (VI
Figure 12. Detector Spectral Response
Figure 13. LED Forward Current vs. Forward Voltage
Characteristics
vee
1,2
REFLECTOR
11 0'C 1
I
1,0
REFERENCE
PLANE
2S'C
"r-- ;I \
::>
it
0,8
2
C
I
0,6
I
7(rc
UJ
>
~
1\.1
6
VI
V,
,\
0,4
1/
uJa:
~
660
v.. v
680
CATHODE
~
R,
--,
dt=",
lip
V
-
2
720
740
Vee
VOUT = 1 + R2/R,
R,
I
~sI
--'
8
"':"
~~
700
1
~
--4-
4
SUBSTRATE, CASE
~\
I~
l
0,2
0
640
ANODE
I
a:
3
~I
x
.......
It
-lpRF
~
~T
760
A - WAVELENGTH (nm)
Figure 14. Relative Radiant Flux vs. Wavelength
Figure 15. Photodiode Interconnection
3-55
V
VauT
RF
Flidl
-=:e..
HEWLETT
PACKARD
BAR CODE READERS
16800A
16801A
Features
Description
• THREE INDUSTRIAL BAR CODES
STANDARD:
- 3 of9 Code
- Interleaved 2 of 5Code
- Industrial 2 of 5 Code
The 16800A and 1,6801A are high performance bar code
readers. The 16800A includes a wide range of programmable features which allow the reader to be fully integrated into
sophisticated data entry systems. The, 16801A is non- ,
programmable, providing a more cost-effective solution for
applications which do not requlr~ programmability.
• AUTOMATIC CODE RECOGNITION
The standard reader supports three popular industrial bar
codes: 3 of 9 code, Interleaved 2 of 5 code, and Industrial 2 of
5 code. If more ~han one standard code is enabled, the
reader will automatically recognize which code is being
read. Options are available for reading UPC/EAN/JAN
codes, Coda bar code, and other bar codes. Bidirectional
scanning is provided for all bar codes supported.
• OPTIONAL BAR CODES AVAILABLE
UPC/EAN/JAN
- Codabar
- Others
• FLEXIBLE DUAL RS-232-C (V.24) DATA
COMMUNICATIONS
- Facilitates a Wide Variety of Configurations
• PROGRAMMABLE OPERATION (16800A only):
- Two LED Status Indicators
Beeper Control
Code Selection
Data Communication Configuration
Reader Operational Status
• HIGH PERFORMANCE DIGITAL WANDS:
-45 Degree Scan Angle
- Sealed Sapphire Tip ,
- Polycarbonate or Metal Case
.
,
• INTEGRAL POWER SUPPLY
The 16800A and 16801A may be configured with a wide
range of computer systems; including minicomputers, desktop computers, and personal computers. Dual RS-232-C
(V.24) ports facilitate, operation in both stand-alone and
eavesdrop configurations. In an eavesdrop configuration,
the reader will generally be operated in conjunction with an
RS-232-C terminal.
'
'
Interactive systems design is supported in the, 16800A
through programmable operator feedback and reader control features. A multi-tone'beeper and two LED indicators are
provided to allow simple, yet flexible audio and visual programmable feedback. Local operator feedback is provided
in the 16801A through a beeper which sounds to signify a
good read.
Reader performance can be optimized by selecting the wand
appropriate for the 'environment and the type of symbol
being read. The wands offer a 45 degree scan angle, a
rugged case, and a sealed sapphire tip. The sapphire tip may
be replaced by the user if it is damaged.
• TABLETOP OR WALL MOUNTABLE
• BUILT-IN SELF TEST
• WORLDWIDE HP SERVICE
3'-56
Applications
Bar codes offer a method of entering data into computers
which is fast, accurate, reliable, and which requires little
operator training. Implementation of a bar code system can
lead to increased productivity, reduced inventory costs,
improved accountability, increased asset visibility, and
reduced paperwork. Customer satisfaction will also improve
as a result of improved quality control, reduced shipping
errors, and reduced order and ship times. On-line, real-time
interactive systems will allow the user to take full advantage
of the contributions offered by bar code systems. The
16800A and 16801 A provide a high performance solution for
applications which require on-line bar code data entry.
The most common type of data stored in bar code is item
identification information used in a wide range of applications such as:
-
Inventory Control
Work-in-Process Tracking
Distribution Tracking
Order Processing
Records Management
Point-of-Sale
Government Packaging and Shipping
Bar codes can also be used in applications where information about an item or a transaction must be accurately
entered into the host computer. Item location, employee
identification, work steps, equipment settings, equipment
status, and inspection results are some of the types of information which can be entered using bar codes.
Typical configuration
The dual RS-232-C (V.24) output provided by the 16800A
and 16801 A allows a single reader to be configured in a wide
range of on-line applications. Three typical system configurations are outlined below:
• Stand-Alone Reader - The 16800Al16801A is in direct
communication with the host minicomputer, desktop
computer, or personal computer.
Computer
3-57
•
A cluster of 16800N16801As communicates with the host computer through a multiplexer.
Where the advantages of fiber optic data communications are desired, the Hewlett-Packard 39301 A Fiber
Optic Multiplexer can be used.
Multiplexed -
MUX
Computer
•
The 16800N16801A is in an eavesdrop
configuration between an RS~232-C terminal and the
host computer. The reader c;an be configured to transmit
to the computer, to the terminal, or to both
simultaneously.
Eavesdrop -
Computer
Terminal
Wand Selection
The 16800A and 16801 A bar code readers include HBCS5300 digital bar code wand which is capable of reading bar
code symbols which have nominal narrow bar/space widths
of 0.19 mm (0.0075 in.) or greater. This includes a wide
range of high, medium, and low resolution bar codes
including standard 3 of 9 code [0.19 mm (0.0075 in.)].
An optional HBCS-5500 digital bar code wand is available
for very high resolution codes with nominal narrow bar/
space widths of 0.13 mm (0.005 in.) to 0.20 mm (0.008 in.).
The 820 nm near-infrared emitter in the HBCS-5500 wand
also enables it to read the black-on-black bar codes used
in some security systems. This wand is not recommended
for dot matrix printed bar codes or colored bar codes.
The HBCS-5000 series wands feature a rugged polycarbonate case designed for light industrial and commercial
applications. Applications which require an industrial wand
are supported by the optional HBCS-6300 and HBCS-6500
digital bar code wands. These wands feature a solid metal
case and internal construction designed for abusive environments. The HBCS-6300 and HBCS-6500 have the same
bar code reading characteristics as the HBCS-5300 and
HBCS-5500, respectively.
All wands are also available under accessory product
numbers.
Code Selection
The 16800A and 16801A offer user flexibility in the implementation of the th ree standard bar codes:
• Single Code Selection or Automatic Code Recognition
(any combination of the three standard codes)
• Checksum Verification Selectable
• Variable Message Length up to 32 characters
3-58
• Selectable Message Length Check (Interleaved 2 of 5
code and Industrial 2 of 5 code)
• Any specified code resolution
Optional bar codes will also provide a high degree of user
flexibility. The code reading configuration is switch selectable. Additional information on bar code symbologies is
available in the Operating and Installation Manual and in
Application Note 1013 - "Elements of a Bar Code System".
16800A Additional Capabilities
The 16800A offers the advantage of programmable control
over all aspects of the code reading configuration. This
capability enables the applications software to determine
what code can be read depending on the type of data to be
entered. For example, the 3 of 9 code could be enabled for
entering item identification information and then the 3 of 9
code disabled and Interleaved 2 of 5 code enabled for entering a different type of data such as employee identification
or job status. This allows different barcodes to be used in the
system while at the same time preventing the operator from
entering the wrong type of data into the data base.
Data Communications
The 16800A and 16801A provide a flexible dual RS-232-C
(V.24) serial ASCII data communications capability which
can support a wide range of system configurations. The
reader offers the user the choice of full 01 half duplex transmission when in character mode and, if in an eavesdrop
configuration with a terminal, the reader can also be operated in block mode. The user can tailor the reader's data
communication configuration to the application by selecting the appropriate transmission mode (full/half duplex),
operating mode (character/block mode), data rate, parity,
terminator, stop bits, and inter-character delay on the readily
accessible 01 P switches. Request to Send/Clear to Send and
DC1/DC3 (XON/XOFF) traffic control is available.
16800A Additional Capabilities
The 16800A offers expanded data communications capabilities with the added benefit of programmable control. In
addition to programmable control of the transmission mode
(full/half duplex) and the operating mode (character/block
mode), the 16800A provides the following programmable
features:
• User-definable header (up to 10 characters)
• User-definable terminator (up to 10 characters)
• DC1/DC3 (XON/XOFF) traffic control enable/disable
3-59
operator Feedbacl<
The 16800A and 16801 A provide good read feedback to the
operator by sounding an integral beeper. Beeper volume
can be adjusted as appropriate for the application.
16800A Additional Capabilities
Interactive operator feedback is provided in the 16800A
through two programmable LED indicators and programmable beeper control. The user has programmable control
over operator feedback as follows:
o Local good read beep enable/disable
o Local good read beep tone (16 tones available)
o Computer commanded beep (16 tones available)
o Red LED Indicator on/off
o Green LED Indicator on/off
Programmable operator feedback can be used to prompt the
operator, to signify that data has been validated by the computer, to differentiate between different workstations in
close proximity, to provide additional LED feedback in
extremely noisy environments, or for a variety of other
reasons.
Reader Control and status
(16800A only>
The 16800A provides the user with added programmable
control over the reader's operation and also enables the user
to obtain on-line status information regarding the reader's
configuration and functionality. The programmable control
and status features are described below:
Scanner Enable/Disable - When disabled, further bar code
scans are ignored.
Single Read Enable/Disable - When enabled, a single bar
code scan can be entered between "Next Read" commands.
Hard Reset - Commands the reader to return to the operating configuration prescribed by the DIP switch settings. An
automatic self-test is also executed.
Status Request - Commands the reader to send the status
of its operating configuration to the computer.
Specifications
Environmental Conditions
Temperature, Free Space Ambient:
-40 to 75° C (-40 to +167° F)
Non-Operating:
Operating:
0 to+55° C (+32 to 131 ° F)
General
Typical Wand Reading Characteristics:
Parameter
Units
Minimum
Recommended
Nominal Narrow
Element Width
HBCS-5300 HBCS-5500
or
or
HBCS-6300 HBCS-6500
mm
in.
0.190
0.0075
0.127
0.005
THtAngie
degrees
0-45
0-45
Scan Speed
cm/sec
In./sec
7.6-127
3-50
7.6-127
3-50
Wavelength
nm
655
820
Bar Codes Supported:
Standard: 3 of 9 Code (ANSI MH10.8M-1983;
MIL-STD-1189)
Interleaved 2 of 5 Code (ANSI MH10.8M-1983)
Industrial 2 of 5 Code
Optional:
UPC/EAN/JAN (Option 001)
Codabar (Option 002)
Others (contact factory)
Data Communications
5 to 95% (non-condensing)
Humidity:
Altitude:
Non-Operating:
Operating:
Shock:
30g, 11 ms, 1/2 sine
PhYSical Specifications
Weight, including wand:
2.0 kg (4,4 pounds)
Weight, polycarbonate
wand only:
(including coiled cord)
0.13 kg (0.3 pounds)
Weight, industrial
wand only:
(including coiled cord)
0.16 kg (0,4 pounds)
Reader Dimensions:
134 mmW x 23 mmD x 20 mmH
(5.3 inW x 0.9 in.D x 0.8 in.H)
158 mmW x 24 mmD x 18 mmH
(6.2 inW x 0.9 in.D x 0.7 in.H)
Industrial Wand
Dimensions:
Parity:
O's, 1's, Odd, Even. Switch
Selectable.
Wand Cord Length:
Terminator:
CR, CR/LF, Horizontal Tab
(HT), None. Switch Selectable.
Stop Bits:
1 or 2. Switch Selectable.
Inter-Character Delay:
30 ms or None. Switch
Selectable.
Standard Asynchronous
Communications
Interface:
Transmission Modes:
Operating Modes:
Traffic Control:
EIA Standard RS-232-C (CCITT
V.24)
Full or half duplex, asynchronous. Switch selectable.
Programmable in 16800A.
Character or Block Mode.
Switch selectable. Programmable in 16800A.
100V (+5%,
(Opt. 210)
120V (+5%,
(Standard)
220V (+5%,
(Opt. 222)
240V (+5%,
(Opt. 224)
Power Consumption:
-10%) at 48-66 Hz
-10%) at 48-66 Hz
-10%) a148-66 Hz
-10%) at 48-66 Hz
20 VA maximum
Regulatory Agency Approvals
RFI/EMI:
- VDE 0871 level B
- FCC Class B
Safety Approvals:
-
Request to Send/Clear to Send.
255 Characters
94 cm (37 in.) - retracted
206 cm (81 in.) - extended
Power Requirements
Input Voltage:
DC1/DC3 (XON/XOFF). Switch
Selectable. Programmable in
16800A.
Output Buffer:
260 mmW x 189 mmD X 71 mmH
(10.25 inW x 7,4 in.D x 2.8 in.H)
Polycarbonate Wand
Dimensions:
110,300,600,1200,2400,4800,
9600 baud. Switch Selectable.
User defined. Maximum of 10
characters each.
0.38 mm (0.015 in.) POp,
5 to 55 to 5 Hz, 3 axis
Vibration:
Data Rate:
Programmable Header/
Terminator (16800A
only):
Sea level to 15300 metres
(50,000 feet)
Sea level to 4600 metres
(15,000 feet)
UL478, UL114 forEDP and office equipment
CSA C22.2-154 for EDP equipment
VDE 0730 part 2P for EDP and office equipment
Complies with IEC standard #380 and #435 for EDP
and office equipment
Installation
All product preparation and installation can be performed by
the owner/user. Refer to the Operating and Installation
Manual supplied with the unit for detailed instructions.
3-60
Supporting Literature
Siegler ADM-31 to a DEC PDP-ll Computer", Publication
Number: 5953-9365 (Available through local sales office)
For further information refer to:
Application Bulletin 61, "HP 16800A/16801A Bar Code
Reader Configuration Guide for an IBM 3276/3278 Terminal", Publication Number: 5953-9361 (Available through
local sales office)
16800A/16801 A Option 001 Data Sheet, Publication Number
5954-2156 (Available through local sales office)
16800A/16801 A Option 002 Data Sheet, Publication Number
5954-2157 (Available through local sales office)
16800A/16801A Operating and Installation Manual, PIN:
16800-90001
16800A/16801 A Option 001 Operating and Installation Manual Addendum, PIN: 16800-90004
16800A/16801 A Option 002 Operating and Installation Manual Addendum, PIN: 16800-90006
Application Note 1013, "Elements of a Bar Code System",
Publication Number: 5953-7732 (Available through local
sales office)
Application Bulletin 59, "HP 16800A/16801A Bar Code
Reader Configuration Guide for a DEC VT-l00 or Lear
Application Bulletin 62, "HP 16800A/16801A Bar Code
Reader Configuration Guide for an IBM 4955F Series 1 Process Control CPU/Protocol Converter and an IBM 3101
Terminal", Publication Number: 5953-9362 (Available
through local sales office)
Application Bulletin 63, "HP 16800A/16801A Bar Code
Reader Configuration Guide for an IBM 5101 Personal
Computer", Publication Number: 5953-9363 (Available
through local sales office)
Application Bulletin 68, "HP 16800A/16801A Bar Code
Reader Configuration Guide for a MICOM Micro 280 Message Concentrator", Publication Number: 5953-9382 (Available through local sales office)
Ordering Information
PROOUCTNO.
DESCRIPTION
16800A
PROGRAMMABLE BAR CODE READER - Includes HBGS-5300 digital wand, Internal power
supply for 120V line voltage, power cord, and Operating and Installation Manual. Reader supports
3 of 9 Code, Interleaved 2 of 5 Code, and Industrial 2 of 5 Code.
16801 A
BAR CODe READER -Includes HBCS-5300 digital wand, internal power $upplyfor 120V line
voltage, power cord, and Operating and Installation Manual. Reader supports 3 of 9 Code,
Interleaved 2 of 5 Code, and Industrial 2 of 5 Code.
-001
-002
-210
-222
-224
Add UPG/EAN/JAN code reading capability; Delete Industrial 2 of 5 code
Add Codabar code reading capability; Delete Industrial 2 of 5 code
100V power supply
220V power supply
240V power supply
-320
Delete HBCS-5300 digital wand; Add HBCS-5500 ditlgal wand
-400
Delete HBCS-5300 digital wand; Add HBCS-6300 Industrial digital wand
-420
Delete HBCS-5300 digital wand; Add HBCS-6500 industrial digital wand
-610
Add Wall Mounting Kit
-910
Additional Operating and Installation Manual
ACCESSORIES
16830A
General Purpose Digital Bar Code Wand
16832A
High Resolution Digital Bar Code Wand
16840A
Industrial (Metal) General Purpose Bar Code Wand
16842A
HBCS-2999
HBCS-4~99
Industrial (Metal) High Resolution Bar Code Wand
HBCS-5300/5500 Replacement Sapphire Tip
HBCS-6300/6500 Replaoement Sapphire Tip
16800-61000
Wall Mount Kit
HEDS-0200
20 fool Wand Extension Cord
03075-40006
17355A
External Wand Holder
2.7 metres (9 feet) Male-Male RS-232-C cable. Shielded.
LITERATURE
16800-90001
16800-90004
16800-90006
Operating and Installation Manual
Option 001 Operating and Installation Manual Addendum
Option 002 Operating and Installation Manual Addendum
3-61
Flidl
HEWLETT
II:~ PACKARD
CODABAR
BAR CODE READERS
16800A
OPTION 002
16801A
OPTION 002
Features
Applications
• CODABAR CODE READING CAPABILITY,
Coda bar code is commonly used for material tracking,
customer Identification, and traceability in four specific
application areas:
'. TWO STANDARD INDUSTRIAL BARCODES
- 30f9Code
- Interleaved 2 of 5 Code
-
• AUTOMATIC CODE RECOGNITION
• HIGH PERFORMANCE DIGITAL WANDS
..,. 45 Degree Scan Angle
- Replaceable, Sealed, Sapphire Tip
- Polycarbonate or Metal Case
Description
Option 002 adds bar code reading capability for Codabar
to the HP16800A Programmable Bar Code 'Reader and
HP16801A Non-Programmable Bar Code Reader. Transmission of the start and stop characters which are part of
each Coda bar symbol is user-selectable.
,Two standard industrial codes, the 3 of 9 code and Interleaved 2 6f 5 code, may also be read with Option 002.
These two codes may be enabled individually, simultaneously, and/or in conjunction with the Codabar code.
Industrial 2 of 5 code reading capability, available with the
standard HP16800A and HP16801A, is not provided with
Option 002.
3-62
Libraries
Hospitals
FilmProcessing
Package Tracking
The 3 of 9 code is also popular' in these applications,
especially where an alphanumeric code is preferred. In
some circumstances, both the 3 of 9 code and Codabar
code may need to be read interchangeably. This capability
is provided by the automatic code recognition feature of
the HP16800A and HP16801A.
The 3 of 9 code. and Interleaved 2 of 5 code are generaily
preferred in industrial applications and in applications
which involve interfacility or intercompany movement of
goods. These applications include:
-
Inventory control
tracking
Distribution tracking
Records management
Government packaging and shipping
Labor reporting
Asset management
Work~in-process
wand Selection
Ordering Information
The HP 16800A and HP 16801A Bar Code Readers include
an HBCS-5300 digital bar code wand which is capable of
reading bar code symbols which have nominal narrow
bar/space widths of 0.19 mm (0.0075 in.! or greater. This
wand is recommended for reading all low resolution bar
codes, such as those produced with dot matrix printers,
and for reading high resolution 3 of 9 and Interleaved 2 of
5 bar codes. It may also be used to read most high resolution Codabar symbols.
An optional HBCS-5500 digital bar code wand is available
for very high resolution codes have nominal narrow
bar/space widths of 0.13 mm (0.005 in.! to 0.20 mm (0.008
in.!. This wand may provide superior performance when
reading high resolution Codabar symbols since this code
has a nominal narrow bar width of 0.17 mm (0.0065 in.>. An
820 nm near-infrared emitter enables the HBCS-5500 to
read black-and-white bar codes and the black-on-black bar
codes used in some security systems.
Applications which require an industrial wand are supported
by the optional HBCS-6300 and HBCS-6500 digital bar
code wands. These wands feature a solid metal case and
internal construction designed for abusive environments.
The HBCS-6300 and HBCS-6500 have the same bar code
reading characteristics as the HBCS-5300 and HBCS-5500,
respectively.
Product
Number
Programmable Bar Code Reader
Includes HBCS-5300 digital wand,
internal power supply for 120 V line
voltage, power cord, and Operating
and Installation Manuals. Reader
supports Codabar, 3 of 9, and
Interleaved 2 of 5 codes.
16801A
-002
Non-Programmable Bar Code Reader
Includes HBCS-5300 dig7tal wand,
internal power supply lor'20 V line
voltage, power cord, and Operating
and Installation Manuals. Reader
supports Codabar, 3 of 9, and
Interleaved 2 of 5 codes.
100V Power Supply
220V Power Supply
240V Power Supply
Delete HBCS-5300 digital wand;
add HBCS-5500 ditigal wand
Delete HBCS-5300 digital wand;
add HBCS-6300 industrial digital wand
Delete HBCS-5300 digital wand;
add HBCS-6500 Industrial digital wand
Add Wail Mounting Kit
Additional Operating and Installation
Manuals
-210
-222
·224
-320
-400
Supporting Literature
-420
For further information refer to:
-610
-910
16800Al16801A Option 002 Operating and Installation
Manual Addendum, PIN: 16800-90006
16800Al16801A Operating and Installation Manual,
PIN: 16800-90001
16800Al16801A Data Sheet, Publication No: 5954·2155
3-63
DescrlpUon
16aobA
-002
FliP'l
a:t:.
HEWLETT
PACKARD
UPC/EAN/JAN
BAR CODE READERS
16800A
OPTION 001
16801A
OPTION 001
Features
Description
• FLEXIBLE COMMERCIAL CODE READING
CAPABILITY
- UPC-A, UPC-E
- EAN-S, EAN-13
- JAN-S, JAN-13
- 2-Digit Supplemental Encodation
- 5-Digit Supplemental Encodation
Option 001 adds bar code reading capability for the Universal Product Code (UPC), European Article Numbering
Code (EAN), and Japanese Article Numbering Code (JAN)
to the HP 16800A Programmable Bar Code Reader and HP
16801A Non-Programmable Bar Code Reader.
• TWO STANDARD INDUSTRIAL BAR CODES
- 3 of9 Code
- Interleaved 2 of 5 Code
• AUTOMATIC CODE RECOGNITION
• COMPATIBLE WITH UPC SHIPPING
CONTAINER SYMBOL SPECIFICATION
• HIGH PERFORMANCE DIGITAL WANDS
- 45 Degree Scan Angle
- Replaceable, Sealed, Sapphire Tip
- Polycarbonate or Metal Case
All popular versions of the UPC, EAN and JAN bar codes
may be enabled, including UPC-A, UPC-E, EAN-8,
EAN-13, JAN-8 and JAN-13. All codes may be read simultaneously, or only UPC-A and UPC-E may be enabled.
UPC, EAN, and JAN codes with complementary 2-digit or
5-digit supplemental encodations, or "add-ons", may be
read in one of two ways. If UPC, EAN, and JAN codes are
enabled but neither 2-digit nor 5-digit supplemental encodations are enabled, then symbols printed with, or without,
supplements can be read and only the main symbol will be
output. If 2-digit (or 5-digitl supplemental encodations are
enabled, then only symbols with 2-digit (or 5-digitl supplements can be read and both the main symbol and the
supplement are output. 2-digit and 5-digit supplemental
encodations may be enabled simultaneously.
Two standard industrial codes, the 3 of 9 code and Interleaved 2 of 5 code, may also be read with Option 001.
These two codes may be enabled individually, simultaneously, and/or in conjunction with the UPC, EAN, and JAN
codes. The implementation of the Interleaved 2 of 5 code
is compatible with the UPC Shipping Container Symbol
Specification.
3-64
colored bar codes and, therefore, is not recommended for
reading the UPC, EAN, and JAN bar codes.
Industrial 2 of 5 code reading capability, available with the
standard HP 16800A and HP 16801 A, is not provided with
Option 001.
Applications which require an industrial wand are supported
by the optional HBCS-6300 and HBCS-6500 digital bar
code wands. These wands feature a solid metal case and
internal construction deSigned for abusive environments.
The HBCS-6300 and HBCS-6500 have the same bar code
reading characteristics as the HBCS-5300 and HBCS-5500,
respectively.
Applications
Option 001 to the HP 16800A and HP 16801A Bar Code
Readers provides an excellent solution for both commercial and industrial applications by supporting the popular
UPC, EAN, and JAN codes as well as the industry standard 3 of 9 and Interleaved 2 of 5 codes.
Supporting Literature
Typical applications for UPC, EAN, and JAN codes
include:
-
For further information, refer to:
16800Al16801A Option 001 Operating and Installation
Manual Addendum, PIN: 16800-90004
Point-of-sale
Inventory control in retail stores
Order entry for retail products
Tracking periodical and/or book returns
Tracking coupon receipts
Production line tracking in consumer products manufacturing plants
16800Al16801A Operating and Installation Manual, PIN:
16800-90001
16800Al16801A Data Sheet, Publication No.: 5954·2155
Ordering Information
The 3 of 9 code and Interleaved 2 of 5 code are commonly
used for work-in-process tracking and inventory control
applications. Some applications may require that the 3 of 9
code or Interleaved 2 of 5 code be read interchangeably
with the UPC, EAN, and/or JAN codes. For example, products which are marked with a UPC code may be shipped
in a container marked with the Interleaved 2 of 5 code.
The automatic code recognition capability of the HP
16800A and HP 16801A allows these codes to be read
interchangeably.
PrO'aUel
Number
Description
16800A
-001
PROGRAMMABLE BAR CODE
READER
Includes HBCS-5300 digital wand,
internal power supply for 120 V line
voltage, power cord, and Operating
and Installation Manuals. Reader
supports UPC, EAN, JAN, 3 of 9, and
Interleaved 2 of 5 codes.
16801A
-001
NON-PROGRAMMABLE BAR CODE
READER
Includes HBCS-5300 digital wand,
internal power supply for 120 V Hne
voltage, power cord, and Operating
and Installation Manuals. Reader
supports UPC, EAN, JAN, 3 of 9, and
Interleaved 2 of 5 codes.
Typical applications for 3 of 9 code and Interleaved 2 of 5
code include:
-
Inventory control
Work-in-process tracking
Distribution tracking
Records management
Government packaging and shipping
Labor reporting
Asset management
Wand Selection
The HP 16800A and HP 16801A Bar Code Readers include
an HBCS-5300 digital bar code wand which is capable of
reading bar code symbols which have nominal narrow
bar/space widths of 0.19 mm (0.0075 in.) or greater. A 655 nm
visible red emitter enables the HBCS-5300 to read a wide
variety of colored bar codes. This wand is recommended
for reading the UPC, EAN, and JAN bar codes
An optional HBCS-5500 digital bar code wand is available
for very high resolution codes having nominal narrow
bar/space widths of 0.13 mm (0.005 in.) to 0.20 mm (0.008 in.)
An 820 nm near-infrared emitter enables the HBCS-5500 to
read black-and-white bar codes and the black-on-black bar
codes used in some security systems. It cannot read
-210
100 V power supply
-222
220 V power supply
-224
240 V power supply
-320
Delete HBOS-5300 digital wand;
add HBOS-5500 ditigal wand
-400
Delete HBOS-5300 digital wand;
add HBCS-6300 industrial digital wand
-420
Delete HBOS-5300 digital wand;
add HBCS-6500 industrial digital wand
-610
Add Wall Mounting Kit
-910
Additional Operating and Installation
Manuals
3-65
- - - - -_._.__..
-
..
__ . - - - _
..
_--
Motion Sensing and Control
•
•
•
Optical Encoders
Digital Potentiometers
Motion Control ICs
Motion Sensing and Control
Motion Sensing
New Products
As an extension of our emitter/detector systems
capability, Hewlett-Packard has developed a family of
motion sensing products. These product include optical
shaft encoders, optical encoder modules for closed loop
servo applications and digital potentiometers for manual
input applications. HP's Optical products provide a
digital link converting mechanical shaft rotation into
TTL logic level signals.
Hewlett-Packard's new HEDS-9000 and HEDS-9100
series optical encoder modules provide sophisticated
rotary motion detection at a low price making it ideal
for high volume applications. The modular design
approach incorporates a unique photodetector array
allowing easy assembly and encoder design flexibility.
Standard resolutions for these modules range from 96
to 1000 counts per revolution.
Our HEDS-SOOO and HEDS-6000 series encoders may
be used in a wide variety of closed loop servo
applications varying from computer peripherals and
professional audio-video systems to automated
production equipment. Encoders also find widespread
use in industrial and instrument applications in which
digital information is needed to monitor rotary motion.
Hewlett-Packard has also introduced the HEDS-9200
series encoder modules which sense linear movement.
These encoder modules are based on the same
innovative emitter/detector technology as the HEDS9000 series, however they are optimized to sense linear
position. These linear encoder modules are extremely
tolerant to misalignment and well suited for printers,
copiers, x-y tables and a variety of other industrial and
office automation products.
The HP encoder system takes advantage of a
specialized optical design and a custom integrated
circuit to deliver superior performance in a compact
package. The design also minimizes the mechanical
tolerances required of the shaft and mounting surface.
The HEDS-SOOO and HEDS-6000 encoders are
available with a range of options including resolution
and shaft sizes.
The HEDS-7S00 series digital potentiometer is a 28
mm diameter encoder completely assembled with a
shaft and bushing, making it suitable for panel
mounting. The device converts manual rotary inputs
into digital outputs using the same high performance
emitter/detector technology used in our encoders. A
digital potentiometer can be used as an input
mechanism in a variety of applications including: test
and measurement equipment, CAD-CAM systems, and
positioning tables.
4-2
---------
-
The HEDS-5500 is a quick assembly, low cost,
complete optical encoder. This product does not require
adhesive, special tools, or any last minute adjustments
to complete the assembly process. The encoder features
high performance based on the HEDS-9100 series
encoder module and comes in a wide variety of
resolutions and shaft sizes.
Motion Control
To complement the motion sensing products, HP has
released two motion control ICs. The HCTL-lOOO
general purpose motion control.IC greatly simplifies
the task of designing digital motion control systems.
The HCTL-1000 compares .the command position or
velocity from a host processor to the actual position or
velocity from an incremental encoder, and outputs an
appropriate motor command using one of four
programmable position and velocity control modes.
Some of its other features include a programmable
digital filter, an electronic commutator, and a
quadrature decoder/counter.
The HCTL-2000 Quadrature Decoder Counter IC
provides a one chip, easy to implement solution to
interfacing the quadrature output of an encoder or
digital potentiometer to a microprocessor. It includes a
quadrature decoder, a 12 bit up/down state counter,
and an 8 bit bus interface. The use of Schmitt triggered
inputs and a digital noise filter allows reliable operation
in noisy environments.
For more information on these new product
developments, contact your local Hewlett-Packard
Components Field Engineer, or write Hewlett-Packard
Optoelectronics Division, 640 Page Mill Road, Palo
Alto, California 94304.
4-3
Motion Sensing and Control
Optical Encoder Modules
Package Outline Drawing
Part No.
/ofOF=~
oox g ~
@[I]
I I ffi
Resolution
Page No.
D
A.B
A 500 CPR
B 1000 CPR
HEDS-9100
OPT DO 0
A.B
K 96 CPR
C 100 CPR
o 192 CPR
E 200 CPR
F 256 CPR
G 360 CPR
H 400 CPR
A 500 CPR
I 512 CPR
4-7
IOND
2 DO NOT CONNECT
~
XXAA J:
Channels
HEDS'9000
OPT D 0 0
P=-
! ~~~
A
5 CH. B
~I=~
D
A.B
Part No.
Channels
I
D
L 120 LPI
M 127 LPI
•. 150 LPI
HEDS-9200
OPT rOO
4-11
I
4-15
Quick Assembly Encoder - HEDS-5500 Series
Option Code
Package Outline Drawing
Resolution
Shaft Size
D
CD
K 96 CPR
C 100 CPR
0 192 CPR
E 200 CPR
F 256 CPR
G 360 CPR
H 400 CPR
A 500 CPR
I 512 CPR
01
02
03
04
05
06
11
12
14
t
t
HEDS-5500
~.
-.~ ~ ~i~ ~~ =~.A
~.~
PIN =5 - CH.B
~""'OO"':H
OPTDCD
A,B
t~
~ ~i~;~: ~~D
J
28 mm Diameter Encoders -
Page No.
4-19
2mm
3mm
1/8 in.
5/32 in.
3/16 in.
1/4 in.
4mm
6mm
5mm
HEDS-5000 Series
Option Code
Package Outline Drawing
Part No.
Channels
Resolution
D
.
.,,)
~~C:\
a~'
HEDS-5000
OPT 0
OJ
HEDS-5010
OPT 0
A, B
OJ
I
4-4
A, B, I
C 100 CPR
o 192 CPR
E 200 CPR
F 256 CPR
G 360 CPR
H 400 CPR
A 500 CPR
I 512 CPR
J.-
Shaft Size
4-25
o:J
01
02
03
04
05
06
11
14
..
Page No.
2mm
3mm
1/8 in.
5/32 in.
3/16 in.
1/4 in.
4mm
5mm
56 mm Diameter Encoders - HEDS-6000 Series
Option Gode
Package Outline Drawing
Part No.
Ghannels
HEDS·6000
OPT 0 CD
A. B
HEDS-6010
OPTD CD
A. B, I
Resolution
D
E
H
A
I
200 CPR
400 CPR
500 CPR
512 CPR
B 1000 CPR
J 1024 CPR
Shalt Size
OJ
05
06
07
DB
09
10
11
12
13
Page No.
4-33
3/16 in.
1/4 in.
5/16 in.
3/B in.
1/2 in.
5/B in.
4mm
6mm
Bmm
Digital Potentiometer - HEDS-7500 Series
Package Outline Drawing
&
Part No.
Resolution
Termination
Page No,
HEDS-7500
256 CPR
Color Coded Wire
4-41
HEDS-7501
256 CPR
Ribbon Cable
Motion ControllCs - HCTL-XXXX Series
Package Outline
Part No.
NC·[~POE
2
39 ~
AD1/0Bl [
3
38 b"ALE
AD2/DB2 [
4
37
AD3/DB3 [
5
36
6
35 ] Vee
ADS/CBS [
7
34 ] EXTCLK
DB6 [
8
33 J'INDEX
DB7 [
9
32 ] Vss
Vss [
10
31 ] CHA
Vee [
11
4-43
30 ]
HCTL-2000
Quadrature Decoder/Counter IC
4-67
CHB
29 ] PHD
13
28 ] PHC
LlMIT[ 14
27
STOpe 15
PULSE [
General Purpose Motion ControllC
J R/W
J ·RESET
AD4/DB4 [
lNIT [
Page
No.
HCTL-1000
cs
ADO/DBO [
PROF[ 12
Description
26
16
25
SIGN [
17
24
Mea [
18
23
Mel [
19
22
Me2 [
20
21
P
P
P
P
P
PHS
PHA
Me7
MeG
MCS
P
P
MC4
Me3
• SHOULD BE LEFT FLOATING.
oo[~JVoo
elK [
2
SEL [
15
J
01
3
14 ] 02
DE/[ 4
13 JD3
RST/[ 5
12 JD4
CHS[ 6
'1J05
CHA,[ 7
10] 06
Vss [
B
9
P
07
4-5
Convenience Assembly Tools for 28 mm Diameter Encoders - Not Required
Page
Pa~kage
Outline Drawing
Part No.
Description
HEDS-8930
HEDS-5000 Series Tool Kit
•
•
•
•
Holding ScreWdriVer
Torquelimiting Screwdriver
HEDS-8920 Hub Puller.
HEDS-8922 Gap Setter, .'
HEDS-892X
Centering Cones
• Aidin High Volume Assembly
• Order in Appropriate Shaft Size '
No_
4-25
",':.
'.' ",
4-6
TWO CHANI\jEL
O~l~AL INeREME~TAL
~!NCODER MODULE
HEDS-9000
SERIES
Features
• HIGH PERFORMANCE
• HIGH RESOLUTION
• LOWCOST
• EASY TO MOUNT
• NO SIGNAL ADJUSTMENT REQUIRED
o INSENSITIVE TO RADIAL AND AXIAL PLAY
• SMALL SIZE
• -40 0 C to 1000 C OPERATING TEMPERATURE
o TWO CHANNEL QUADRATURE OUTPUT
• TTL COMPATIBLE
• SINGLE 5 V SUPPLY
Description
The standard resolutions presently avaihible are 500 CPR
and 1000 CPR for use with a HEDS-6100 series codewheel
or the equivalent. Consult local Hewlett-Packard sales representatives for custom resolutions.
The HEDS-9000 series is a high performance, low cost,
optical incremental encoder module. When operated in conjunction with a codewheel, this module detects rotary
position. The module consists of a lensed LED source and a
detector IC enclosed in a small C-shaped plastic package.
Due to a highly collimated light source and a unique photodetector array, the module is extremely tolerant to mounting
misalignment.
Applications
The HEDS-9000 provides sophisticated motion detection at
a low cost, making it ideal for high volume applications.
Typical applications include printers, plotters, tape drives,
and factory automation equipment.
The two channel digital outputs and the single 5 V supply
input are accessed through four 0.025 inch square pins
located on 0.1 inch centers.
ESD WARNING: NORMAL HANDLING PRECAUTIONS
SHOULD BE TAKEN TO AVOID STATIC DISCHARGE.
package Dimensions
OPTION
CODE
ALIGNMENT
RECESS
DATE COPE
NorE I
t
1.85(1l·07~.-1
m
2.41 (O·085l
MAX.
I I
,-jl
I.S~\~~O)
11.•7
{O.GSOI
~
-
SIDEA
xx • WORK WEEK
ALIGNMENT
RECESS
12.07 (OA15)
MAX.
3.0, (0.119) MAX.
1-10028 (0.405) MAX.
NOTE 1: YY • YEAR
DIMENSIONS IN MILLIMETERS AND (INCHES)
II
4.75 OPTle:AL
(0.1871 CENTER
[ : : REF.
•
END VIEW
4-7
SIDEB
output Waveforms
Block Diagram
r-, r--------------,
I
I I
I
I I
I Vee
I
I
I
I
I
I
I
4
I
I
I
CHANNEL A
I3
~2
w
o
...:::>
CHANNEL B
I5
12
::;
I
"
I
I
I
I
CHANNEL B
EMITTER SECTION
CODE
WHEEL·
~
IGNO
L
I ______________
'- _______ ...JI
1
DETECTOR SECTION
ROTATION
Theory of operation
1 Shaft Rotation = 360 mechanical degrees
= N cycles
The HEDS-9000 is a C-shaped emitter/detector module.
Coupled with a codewheel it translates the rotary motion of
a shaft into a two-chan riel digital output.
As seen in the block diagram, the module contains a single
Light Emitting Diode (LED) as its light source. The light is
collimated into a parallel beam by means of a single lens
located directly over the LED. OppOSite the emitter is the
integrated detector circuit. This IC consists of multiple sets
of photodetectors and the signal processing circuitry necessary to produce the digital waveforms.
The codewheel rotates between the emitter and detector,
causing the light beam to be interrupted. by the pattern of
spaces and bars on the codewheel. The photodiodes which
detect these interruptions are arranged in a pattern that
corresponds to the radius and design of the codawheel.
These detectors are also spaced such that a light period on
one pair of detectors corresponds to a dark period on the
adjacent pair of detectors. The photodiode outputs are then
fed through the Signal processing circuitry resulting in A, A,
Band· B. Two comparators receive these Signals and produce the final outputs for channels A and B. bue to this
integrated phasing technique, the digital output of channel
A is in quadrature with that of channel B (90 degrees out of
phase).
1 cycle (c) = 360 electrical degrees (0 e)
. = 1 bar and window pair
Pulse Width (P): The number of electrical degrees that an
output is high during 1 cycle. This value is nominally 180 °e
or'h cycle.
Pulse Width Error (IlP): The deviation, in electrical degrees,
of the pulse width from its ideal value of 180 ° e.
State Width (S): The number of electrical degrees between
a transition in the output of channel A and the neighboring
transition in the output of channel B. There are 4 states per
cycle, each nominally 90 °e.
State Width Error (IlS): The deviation, in electrical degrees,
of each state width from its ideal value of 90° e.
Phase (w/rPb
0.7
1.4
Lw
1.8(.07)
Window Length
Absolute Maximum
Codewheel Radius
2.3(.09)
Units
mm(inch)
Rop +l.9(Om5) mm(inch)
Rc
4-9
Noles
Includes eccentricity errors
Mounting Considerations
ALIGNING BOSS
0.76 10.030i HIGH IMAX)
2.36 (O.093)±O.025(O.001) DIA.
0.25(0.010) x 450 CHAMFER
2 PLACES
CDDEWHEEL
ARTWORK SIDE
+-+---+---O,~
~UNTING
i
r- ""
----->..~ ~ - I
0\
cp\
PLANE
~'~:~~i:~~B)
2 PLACES
--I
OPTICAL CENTER
~ I~
i
20.83 (0.820)
12.60 !0.496) 21.08 10.830)
MOUNTING
PLANE
ALIGNING BOSS
0.76 10.030) HIGH IMAX)
2.36 (0 093l±O.025(O.OO1) DIA.
MAX. 4.4510.175)
NOTE 1
ROP+(:'l;71
~'~~~CO~~1 x 45
0
CHAMFER
NOTE1: THESE DIMENSIONS INCLUDE SHAFT
END PLAY, AND CODEWHEEL WARP.
Figure 2. Mounting Plane Side A.
Figure 3. Mounting Plane Side B.
Connectors
Manufacturer
Pari Number
Mounting Surface
AMP
103686-4
640442-5
80th
Side 8
6erg
Both
65039-032 with
4S25X-000 terminals
Molex
2695 series with
2759 series
terminals
SETSCREW
2·56
HOLLOW OVAL
POINT
SideB
rr=~
25,4
Figure 4. Connector Specifications
18,0
IJ~j
Ordering Information
. . "lJ
[[@]
(O,334±O,020)
Re$olution
(Cycles per Revolution)
A - 500 cpr
B-1000cpr
UNITSmm(lNCHES)
Shaft Diameter
05 - 3/16 IN. 11 - 4 mm
06 - 1/4 IN.
12 - 6 mm
07 - 5/16 IN. 13 - 8 mm
OS -SIS IN.
09-1/2 IN.
10 -5/SIN.
Figure 5. HEDS-6100 Codewheel
4-10
FliO'l
HEWLETT
~e.. PACKARD
TWO CHANNEL
OPTICAL INCREMENTAL
ENCOOER MODULE
11 mm, optical RadiLis
HEpS-9100
SERIES
Features
• HIGH PERFORMANCE
• HIGH RESOLUTION
• LOW COST
• EASY TO MOUNT
• NO SIGNAL ADJUSTMENT REQUIRED
• INSENSITIVE TO RADIAL AND AXIAL PLAY
• SMALL SIZE
• -40°C to 100°C OPERATING TEMPERATURE
" TWO CHANNEL QUADRATURE OUTPUT
• TTL COMPATIBLE
• SINGLE 5 V SUPPLY
Description
The HEDS-9100 series is a high performance, low cost,
optical incremental encoder module. When operated in conjunction with a codewheel, this module detects rotary
position. The module consists of a lensed LED source and a
detector IC enclosed in a small C-shaped plastic package.
Due to a highly collimated light source and a unique photodetector array, the module is extremely tolerant to mounting
misalignment.
The standard resolutions presently available range from
96 cpr to 512 cpr for use with a HEDS-5100 series codewheel or the equivalent. Consult local Hewlett-Packard
sales representatives for custom resolutions.
Applications
The two channel digital outputs and the single 5 V supply
input are accessed through four 0.025 inch square pins
located on 0.1 inch centers.
The HEDS-9100 provides sophisticated motion detection at
a low cost, making it ideal for high volume applications.
Typical applications include printers, plotters, tape drives,
and factory automation equipment.
ESD WARNING: NORMAL HANDLING PRECAUTIONS
SHOULD BE TAKEN TO AVOID STATIC DISCHARGE.
package Dimensions
~
z
z
8
OATe CODE
NOTE 1
ALIGNMENT
RECESS
'.. OPTICAL
CENTER
NOTE 1, VY
~·YEAR
XX ,. WORK WEEK
DIMENSIONS IN MILlIMETEAS AND HNCHESf
END VIEW
4-11
SIDEB
Block Diagram
output Waveforms
I------c------+j
I
14
I
I
I
I
CHANNEL A
3
1
..!:!&to,
w
C
:J
CHANNEL B
....
~
15
"<:
I
I
I
I
I
IGNO
IL
I
L _______ ...l
EMITTER SECTION
______________
CODe
.J
1
DETECTOR SECTION
WHEEL
ROTATION
Theory of Operation
1 Shaft Rotation = 360 mechanical degrees
= N cycles
The HEDS-9100 is a C-shaped emitter/detector module,
Coupled with a codewheel it translates the rotary motion of
a shaft into a two-channel digital output.
As seen in the block diagram, the module contains a single
Light Emitting Diode (LED) as its light source. The light is
collimated into a parallel beam by means of a single lens
located directly over the LED. Opposite the emitter is the
integrated detector circuit. This IC consists of multiple sets
of photodetectors and the signal processing circuitry necessary to produce the digital waveforms.
The codewheel rotates between the emitter and detector,
causing the light beam to be interrupted by the pattern of
spaces and bars on the codewheel. The photodiodes which
detect these interruptions are arranged in a pattern that
corresponds to the radius and design of the codewheel.
These detectors are also spaced such that a light period on
one pair of detectors corresponds to a dark period on the
adjacent pair of detectors. The photodiode outputs are then
fed through the signal processing circuitry resulting in A, A,
Sand B. Two comparators receive these signals and produce the final outputs for channels A and S. Due to this
integrated phasing technique, the digital output of channel
A is in quadrature with that of channel S (90 degrees out of
phase).
Definitions
Count (N) = The number of bar and window pairs or
counts per revolution (CPR) of the codewheel.
1 cycle (c) = 360 electrical degrees (Oe)
= 1 bar and window pair
Pulse Width (P): The number of electrical degrees that an
output is high during 1 cycle. This value is nominally 180 °e
or V, cycle.
Pulse Width Error (I!.P): The deviation, in electrical degrees,
.
of the pulse width from its ideal value of 180 °e.
State Width (S): The number of electrical degrees between
a transition in the output of channel A and the neighboring
transition in the output of channel S. There are 4 states per
cycle, each nominally 90 ° e.
State Width Error (I!.S): The deviation, in electrical degrees,
of each state width from its ideal value of 90° e.
Phase (<1»: The number of electrical degrees between the
center of the high state of channel A and the center of the
high state of channel B. This value is nominally 90 °e for
quadrature output.
Phase Error (f!.
2
10
15
elec deg,
Parameter
Case 1: Module mounted on tolerances 01 ±O.13mm(O.005").
Notes
Case 2: Module mounted on tolerances 01 ±O.38mm(O.015").
Electrical Characteristics
Electrical Characteristics over Recommended Operating Range, typical at 25° C
Parameter
Symbol
Supply Current
Icc
High Level Output Voltage
VOH
Low Level Output Voltage
Rise Time
Fall Time
Min.
Typ.
Max.
Unlls
17
40
mA
0.4
Volts
Volts
2.4
VOL
tr
200
ns
tf
50
ns
Notes
=-40 p.A Max.
IOl =3.2 mA
Cl =25 pF
Rl = 11 KH pull-up
IOH
Note:
1. For improved perlo""ance in noisy environments or high speed applications, a 3.3 kn pull-up resistor is recommended.
Codewheel Options
Recommended Codewheel
Characteristics
The HEDS-9100 is designed to operate with the HEDS-5100
series codewheel. See ordering information and specifications at the end of this data sheet.
CPR
(N)
OPTICAL RADIUS
Rop mm (inch)
96
11.00 (0.433)
100
11.00 (0.433)
192
11.00 (0.433)
200
11.00 (0.433)
256
11.00 (0.433)
360
11.00 (0.433)
400
11.00 (0.433)
500
11.00 (0.433)
512
11.00 (0.433)
Figure 1. Codewheel Design
Parameter
Symbol
Min.
Max.
Window/Bar Ratio
w/b
0.7
1.4
Lw
1.8(.07)
Window Length
Absolute Maximum
Codewheel Radfu$
Rc
2.3(.09)
Units
mm{inch)
Rop+1.9(0.075) mmUnch}
4-13
Notes
I ncludes eccentricity errors
Mounting Considerations
ARTWORK SIDE
+-~ ~~ O_'~
__
___
MOUNTING
OPTICAL CENTER
~
.
M 2.5 x 0.45
12·56 UNC·281
2 PLACES
~LANE
M 2.5xO.45
12·56 UNC·281
2 PLACES
....-1
OPTICAL CENTER
-~c-~: -t~
"'-----\-.......j....
t-..1.---+-t:jl~::rt_
I
, f\~" T
MOUNTING
PLANE
127
Q~ ~F'"'",~
20.9
0.7610.0301 HIGH
2.3610.093I'O.02510.001IDIA.
MAX. 4.4510.1751
NOTE 1
ROP+10~i7:71
~'~~~cO~~1 x 46" CHAMFER
NOTE1, THESE DIMENSIONS INCLUDE SHAFT
END PLAY, AND CODEWHEE~ WARP.
Figure 3. Mounting Plane Side B.
Figure 2. Mounting Plane Side A.
Connectors
Manufacturer Part Number
Mounting Surlaee
AMP
103686-4
640442-5
Both
SideS
Berg
65039-032 with
Both
4825X-OOO terminals
MoJex
2695 series with
2759 series
terminals
SideS
r 7.9~
I
10.210.401
t
Figure 4. Connector SP!clflcatlons
Ordering Information
[ill]
25.15
(0.9901 DIAMETER
~
~.,. lJ
10.212 + 0.0121
Resolution
(Cycles per Revolution)
K-96cpr G-360cpr
C·100cpr H-400cpr
o - 192 cpr A - 500 cpr
E • 200 cpr I - 512 cpr
F ·256 cpr
Shaft Diameter
01-2mm
02-3mm
03 - 1/8 in.
04-5/32 In.
05 -3116 in.
06-1/4 in.
11-4mm
14-5mm
12 - 6 mm
UNITS mm(INCHES)
Figure 5. HEDS.-5100 Codewheel
4-14
HEWLETT
PACKARD
L1NEA~
OPTICAL II\ICREMENTAL
ENC€JOER MODULE
HEOS-9200
SERIES
Features
• HIGH PERFORMANCE
• HIGH RESOLUTION
• LOW COST
• EASY TO MOUNT
• NO SIGNAL ADJUSTMENT REQUIRED
• INSENSITIVE TO MECHANICAL
DISTURBANCES
• SMALL SIZE
• -40 0 C TO 1000 C OPERATING TEMPERATURE
• TWO CHANNEL QUADRATURE OUTPUT
• TTL COMPATIBLE
o SINGLE 5 V SUPPLY
Description
The HEDS-9200 series is a high performance, .Iow cost,
optical incremental encoder module. When operated in
conjunction with a codestrip, this module detects linear
position. The module consists of a lensed LED source and
a detector IC enClosed in a small C-shaped plastic package.
Due to a highly collimated light source and a unique photodetector array, the module is extremely tolerant to mounting
misalignment.
The two channel digital outputs and the single 5 V supply
input are accessed through four 0.025 inch square pins
located on 0.1 inch centers.
The standard resolutions available are 4.72 counts per mm
(120 cpi), 5.00 courits per mm (127 cpi) and 5.91 counts per
mm (150 cpi). Consult local Hewlett-Packard sales representatives for other resolutions ranging from 1.5 to 7.8
counts per mm (40 to 200 counts per inch).
Applications
The HEDS-9200 provides sophisticated motion detection at
a low cost, making it ideal for high volume applications.
Typical applications include printers, plotters, tape drives,
and factory automation equipment.
ESD WARNING: NORMAL HANDLING PRECAUTIONS.
SHOULD BE TAKEN TO AVOID STATIC DISCHARGE.
package Dimensions
~z
8
~<
0
COOE
N
ALIGNMENT
REcess
Ql
tb:~
u >
u
~2 0:~Oi
....
1N >
OPTION
t
r:>') ...
ALIGNMENT
RECESS
1 ,
1.S51D.0131-i
~I
11.21
1·).600
SIDE A
NOTE 1, yy. VEAR
XX = WORK weeK
DIMENSIONS IN MILLIMETERS ANI:> [lNCHESI
SIDES
4-15
- - - - _ . _ - - - _ ..-
Block Diagram
output Waveforms
rlr----~--------l~
I
,4
I
I
I
I
CHANNEL A
I3
~2
CHANNEL 8
I5
I
I
I
I
I
I
I
I
I
I
I
I Gllio
I _______ .JI
L
EMITTER SECTION
CODE
CHANNEL B
~---------~----~,
DETECTOR SECTION
STRIP
LINEAR POSITION
Theory of Operation
The HEDS-9200 is a C-shaped emitter/detector module.
Coupled with a codestrip ,it translates linear motion into a
two-channel digital output
Pitch: 1/0, The unit length per count.
Electrical degree (De): Pitch/360, The dimension of one bar
and window pair divided by 360.
As seen in the block diagram, the module contains a single
Light Emitting Diode (LED) as its light source. The light is
collimated into a parallel beam by means of a single lens
located directly over the LED. Opposite the emitter is the
integrated detector circuit This IC consists of multiple sets
of photodetectors and the signal processing circuitry necessary to produce the digital waveforms.
1 cycle (C): 360 electrical degrees, 1 bar and window pair.
The codestrip moves between the emitter and detector,
causing the light beam to be interrupted by the pattern of
spaces and bars on the codestrip. The photodiodes which
detect these interruptions are arranged in a pattern that
corresponds to the count density of the' codestrip. These
detectors are also spaced such that a light period on one
pair of detectors corresponds to a dark period on the
adjacent pair of detectors. The photodiode outputs are,
then fed through the signal processing circuitry resulting in
A, A, Band B. Two comparators receive these signals and
produce the final outputs for channels A and B. Due to this
integrated phasing technique, the digital output of channel
A is in quadrature with that of channel B (90 degrees out of
phase).
State Wldth(S): The number of electrical degrees between a
transition in the output of channel A and the neighboring
transition in the output of channel B. There are 4 states per
cycle, each nominally 900 e.
Definitions
Count density (D): The number of bar and window pairs
per unit length of the codestrip.
Pulse Width (P): The number of electrical degrees that an
output is high during 1 cycle. This value is nominally 1800 e
or 112 cycle.
Pulse Width Error (Ll.P): The deviation, in electrical degrees,
of the pulse width from its ideal value of 1800 e.
State Width Error (Ll.S): The deviation, in electrical degrees,
of each state width from its ideal value of 900 e.
Phase (<1»: The number of electrical degrees between the
center of the high state of channel A and the center of the
high state of channel B. This value is nominally 90 0 e for
quadrature output.
Phase Error (Ll.+C",":..:AN",N:.:E::..1I+'0", VOl
¢1
Po
(;2
Theory of operation
The incremental shaft encoder operates by translating the
rotation of a shaft into interruptions of a light beam which are
then output as electrical pulses.
In the HEDS-5XXX the light source is a Light Emitting Diode
collimated by a molded lens into a parallel beam of light. The
Emitter End Plate contains two orthree similar light sources,
one for each channel.
The standard Code Wheel is a metal disc which has N
equally spaced apertures around its circumference. A
matching pattern of apertures is pOSitioned on the stationary'
phase plate. The light beam is transmitted only when the
apertures in the code wheel and the apertures in the phase
plate line up; therefore, during a complete shaft revolution,
there will be N alternating light and dark periods. A molded
lens beneath the phase plate aperture collects the modulated light into a silicon detector.
The Encoder Body contains the phase plate and the detection elements for two or three channels. Each channel
consists of an integrated circuit with two photodiodes and
amplifiers, a comparator, and output circuitry.
The apertures for the two photodiodes are positioned so that
a light period on one detector corresponds to a dark period
on the other ("push-pull"). The photodiode signals are
amplified and fed to the comparator whose output changes
state when the difference of the two photocurrents changes
sign. The second channel has a similar configuration but the
location of its aperture pair provides an output which is in
quadrature to the first channel (phase difference of 90° ).
Direction of rotation is determined by observing which of the
channels is the leading waveform. The outputs are TTL logiC
level signals.
The optional index channel is similar in optical and electrical
configuration to the Aand B channels previously described.
An index pulse of typically 1 cycle width is generated for
each rotation of the code wheel. Using the recommended
logic interface, a unique logic state (Po) can be identified if
such accuracy is required.
The three part kit is assembled .by attaching the Encoder
Body to the mounting surface using three screws. The Code
Wheel is set to the correct gap and secured to the shaft.
Snapping the cover (Emitter End Plate) on the body completes the assembly. The only adjustment necessary is the
encoder centering relative to the shaft. This optimizes quadrature. and the optional index pulse outputs.
Index Pulse Considerations
The motion sensing application and encoder interface circuitry will determine the necessary phase relationship of the
index pulse to the main data tracks. A unique shaft position
can be identified by using the index pulse output only or by
logically relating the index pulse to the A and B data channels. The HEDS-5010 allows some adjustment of the index
pulse position with respect to themain data channels. The
position is easily adjusted during the assembly process as
illustrated in the assembly procedures.
Definitions
Electrical degrees:
1 shaft rotation' = 360 angular degrees
= N electrical cycles
1 cycle
= 360 electrical degrees
Position Error:
The angular difference between the actual shaft position and
its pOSition as calculated by counting the encoder's cycles.
Cycle Error:
An indication of cycle uniformity. The difference between an
observed shaft angle which gives rise to one electrical cycle,
and the nominal angular increment of 1/N of a revolution.
Phase:
The angle between the center of Pulse A and the center of
Pulse B.
Index Phase:
For counter clockwise rotation as illustrated above, the
Index Phase is defined as:
1
=
(1 -2).
2
1 is the angle, in electrical degrees between the falling edge
of I and falling edge of B. 2 is the angle, in electrical
degrees, between the riSing edge of A and the rising edge
of I.
Index Phase Error:
The Ind.ex Phase Error (LlI) describes the change in the
Index Pulse position after assembly with respect to the A and
B channels over the recommended operating conditions.
4-26
Absolute Maximum Ratings
parilln~ter
Symbol
Min.
Max.
Units
Ts
TA
-55
-55
,'100
°Celsius
"Celsius
;, ",
g
mm(1 inch/JooO) T1R
Storage Temperature
Operating Temperature
Vlbratl,on
Shaft Aicialfllay,
Shaft Eccentricity Plus
Radial Play
SUPply;Voltage
OiJiput,Voltage
Output Current per
Channel
"
-0.5
-0.5
·1
Vee
Vo
10
Velocity
Acceleiatlqn
"
Notes
100
20
.50 (20)'
" :1 (4)
mm(i inch/i000) TlR,
7
Vee
5
Volts
Volts
mA
30,000
250,000
Ra~::Sec'2
See N<;>te 1
See Ni>te 1
Movement should be
limited even under
shock conditions.
,
R;p.M.
Recommended Operating Conditions
Parameter
Temperature
Supply Voltage
Code Wheel Gap
Shaft Perpendicularity
Plus Axial Play
Shaft Eccentricity Plus
Radial Play
Load Capacitance
Symbol
Min.
Max.
Units
T
-20
4.5
85
5.5
1.1 (45)
"Celsius
Volt
mm (inch/i000)
mm (Inch/1000)
TIR
mm (inch/1QOO)
TIR
pF
Yee
"
0.25 (i0)
0.Q4 (1.5)
100
CL
Notes
'Non-condensing atmos.
Ripple < 100mVp- p
Nominal gap =
0.63 mm (.025 in.) when shaft
is at minimum gap position,
10 mm (OAlnch) from
mounting surface.
Encoding Characteristics
The specifications below apply within the recommended operating conditions and reflect performance at 500 cycles per
revolution (N = 500). Some encoding characteristics improve with decreasing cycles (NI. Consult Application Note 1011 or
factory for additional details
Parameter
Symbol
Position ErrorWorst Error Full
Rotation
AS
Cycle Error Worst Error Full
Rotation
e.C
Max. Count Frequency
fMAX
Pulse Width ErrorWorst Error Full
Rotation
Phase Sensitivity to
Eccentricity
Min.
Typ.
Max.
Units
NotesiSee Definitions)
10
40
Minutes of Arc
1 Cycle = 43.2 Minutes
See Figure 5.
3
5.5
Electrical deg.
"-
130,000
e.P
200,000
Hertz
16
Electrical deg.
f = Velocity (RPM) x N/60
T "" 25° C. f = 8 KHz
See Note 2
520
(13)
Elec. deg./mm
(Elec. deg.lmil)
20
(.5)
Elec. deg.hom
(Elec. deg.!mil)
~S
25
Electrical deg.
T 25" C. f "" 8 KHz
See Note 2
Index Pulse Width
f1
360
Electrical deg.
T "" 25° C, f"" 8 KHz
See Note 3
Index Phase Error
AI
Electrical deg.
See Notes 4, 5
Electrical deg.
See Note 5
Phase Sensitivity to
Axial Play
Logic Slate Width ErrorWorst Error Full
Rotation
Index Pulse Phase
Adjustment Range
0
±70
17
±130
4-27
mil = inch/1QOO
mil = inch/1000
=
Mechanical Characteristics
Parameter
Symbol
Dimension
Outline Dimensions
Tolerance
Units
+.000
-.015
mm
+.0002
-.0005
Inches
+.0000
-.0007
inches
Notes
See Mech. Dwg.
Code Wheel Available to
Fitthe Following Standard
Shaft Diameters
4
2
3
5
5/32
1/8
3/16
Moment of Inertia
gcm2 (oz-in-s2)
0.4 (ex lo-6)
J
Required Shaft Length
Bol! Circle
Mounting Screw Size
1/4
12.8 (.50)
±0.5 (±0.02)
mm (inches)
See Figure 10,
Shaft in minimum
length position.
20.9 (.823)
±0,13 (±.OOS)
mm (inches)
See Figure 10,
1.6 x 0.35 x 5 mm
DIN 84
or
0-80 x 3/16
Bmding Head
mm
inches
Electrical Characteristics When operating within the recommended operating range.
Electrical Characteristics over Recommended Operating Range (Typical at 25° C).
Parameter
Supply Current
Symbol
Min.
Icc
High Level Output
Voltage
VOH
Low Level Output
Voltage
VOL
Typ.
Max,
Units
21
40
mA
36
60
2.4
0.4
RisaTime
tr
0.5
Fan Time
tf
0,2
Ceo
12
Cable Capacitance
Notes
HEDS·SOOO (2 Channel)
HEDS·5010 (3 Channel)
V
IOH = -401lA Max.
V
IOL=3.2 mA
Ils
CL "" 25 pF, RL
=11 K Pull-up
See Note 6
pF/metres
Output Lead to Ground
NOTES:
1. The structural parts of the HEDS-5000 have been tested to 20g and up to 500 Hz. For use outside this range, operation may be limited
at low frequencies (high displacement) by cable fatigue and at high frequencies by code wheel resonallces. Resonant frequency
depends on code wheel material and number of counts per revolution. For temperatures below -20 0 C the ribbon cable becomes
brittle and sensitive to displacements. Maximum operating and storage temperature includes the surface area of the encoder mounting. Consult factory for further information. See Application Note 1011.
2. In a properly assembled lot 99% of the units, when run at 25 0 C and 8 KHz, should exhibit a pulse width error less than 35 electrical
degrees, and a state width error less than 45 electrical degrees. To calculate errors at other speeds and temperatures add the values
specified in Figures 1 or 2 to the typical values specified under encoding characteristics or to the maximum 99% values specified in this
note.
3. In a properly assembled lot, 99% of the units when run at 25 0 C and 8 KHz should exhibit an index pulse width greater than 260
electrical degrees and less than 460 electrical degrees. To calculate index pulse widths at other speeds and temperatures add the
values specified in Figures 3 or 4 to the typical 360 0 pulse width or to the maximum 99% values specified in this note.
4. After adjusting index phase at assembly, the index phase error specification (:S:4
'~~A--l
.1J
10
V
T
L~
-------r=~PO
~_ii
I
~~ __ J
:
1I374LS11
1/674LS14
-=-oJ-.---~----- GROUND
4 - - } (GROUND OR 00
5 -NOT CONNECT)
(1/1000 INCH)
MILLIMETRES
SHAFT ECCENTRICITY -
DASHED LINES REPRESENT AN OPTIONAL INDEX SUMMING CIRCUIT.
STANDARD 74 SERIES COULO ALSO BE USED TO IMPLEMENT THIS CIRCUIT.
Figure 5. Position Error va. Shaft Eccentricity
Figure 6. Recommended Interface Circuit
4-29
...
_.. _- _._-----_._------------------------------ .- ....._--_._.-
/~r.:::"""\
PINOUT
I"
,"" ..
,,)
Vee
MOUNTING
SURFACE
~
Vee
CHANNELS
Vee
CHANNEL I
9
10
ENCODER BODY
NOTE: REVERSE INSERTION OF THE CONNECTOR
WI LL PERMANENTLY DAMAGE THE DETECTOR IC.
MATING CONNECTOR
BERG 65-692-001 OR EQUIVALENT
Figure 7. Connector Specifications
Figure 8. HEDS-5000 Series Encoder Kit
M 1.6 x .35 150 GH
OR
0-80 UNF·2B
--A------+---~~
20.90 DIA.
I.B23DIA.I
!"if! A !0'!.20/1.00BI
I
25.15
(.9901 DIAMETER
5.38 ± .31
UNITS mm (INCHES)
1- ,
1/
.\-~
GROUND
N.C. OR GROUND
N.C. OR GROUND
GROUND
BOTTOM VIEW
\\
\."':) ;:'\ \
CHANNEL A
MILLIMETRE .X±.5 .XX ±.10
(INCHES) (.XX ± .02 .XXX ± .005)
1.212' .0121
Figure 9. Code Wheel
Figure 10. Mounting Requirements
Ordering Information
HEDS-5
OPTION*y
PRODUCT TYPE
RESOLUTION ICYCLES PER REVOLUTION)
C-l00CPR
G -360CPR
D -192CPR
H - 400 CPR
E - 200 CPR
A - 500 CPR
F - 256 CPR
I - 512 CPR
NOTE: OTHER RESOLUTIONS AVAILABLE
ON SPECIAL REQUEST.
0- 28 mm COMPLETE KIT
1-28mm CODE WHEEL
2 - 28 mm ENCODER BODY
3 - 28 mm EMITTER END PLATE'
OUTPUTS
SHAFT DiAMETER
o-
2 CHANNEL DIGITAL
1 - 3 CHANNEL DIGITAL
01-2mm
02-3mm
03- 1/8 in.
04-5/32 in.
05- 3/16 in.
MECHANICAL CONFIGURATION
06-1/4;".
11- 4mm
0- 0.6 m (24 In.j CABLE
12 -6mm
14 - 5mm
00 - USE WHEN ORDERING
ENCODER BODIES
"NO OPTION IS SPECIFIED WHEN ORDERING
EMITTER END PLATES ONLY.
4-30
Shaft Encoder Kit Assembly
See Application Note 1011 for further discussion.
The following assembly procedure represents a simple and reliable method for prototype encoder assembly. High volume assembly may
suggest modifications to this procedure using custom designed tooling. In certain high volume applications encoder assembly can be
accomplished in less than 30 seconds. Consult factory for further details. Note: The code wheel to phase plate gap should be set between
0.015 in. and 0.045 in.
I WARNING: THE ADHESIVES USED MA Y Bli HARMFUL. CONSUL T THE MANUFACTURER'S RECOMMENDA TlONS. I
READ THE INSTRUCTIONS TO THE END BEFORE STARTING ASSEMBLY.
3.0 ENCODER BODY ATTACHMENT
1.0 SUGGESTED MATERIALS
1.1 Encoder Parts
Encoder Body
Emitter End Plate
Code Wheel
1.2 Assembly Materials
RTV - General Electric 162
- Dow Corning 3145
Epoxy-Hysol 1C
Acetone
Mounting Screws (3)
RTV and Epoxy Applicators
1.3 S\lggesled Assembly Tools
a) Holding Screwdriver.
b) Torque Limiting Screwdriver. 0.36 cm kg (5.0 in. oz.).
c) Depth Micrometer or HEDS-8922 Gap Setter.
d) Oscilloscope or Phase Meter (Described in AN 1011). Either
may be used for two channel phase adjustment. An oscillo,scope is required for index pulse phase adjustment.
3.1
Place the encoder body on the mounting surface and slowly
rotate the body to spread the adhesive. Align the mounting
screw holes with the holes in the body base.
3.2 Place the screws in the holding screwdriver and thread them
into the mounting holes. Tighten to approximately 0.36 cm kg
(5.0 in. oz.) using a torque limiting screwdriver if available (See
notes a and b below). Remove centering cone if used.
Notes:
a) At this torque value, the encoder body should slide on the
mounting surface only with considerable thumb pressure.
b) Thetorque limiting screwdriver should be periodically calibrated
for proper torque.
1.4 Suggested Circuits
a) Suggested circuit for index adjustment (HEDS-5010).
4.0 EPOXY APPLICATION
A
OUTPUT TO OSCILLOSCOPE
BUFFER
A
1/474LS32
For optimal index phase, adjust encoder position to equalize T1 and T2 pulse widths.
b)
~hase Meter Circuit
Recommended for volume assembly. Please see Application Note 1011 for details.
2.0 SURFACE PREPARATION
4,1
Collect a small dab of epoxy on an applicator.
4.2 Spread the epoxy inside the lower part of the hub bore.
4.3 Holding the code wheel by its hub, slide it down the shaft just
enough to sit it squarely. About 3 mm (1/8").
5.0 CODE WHEEL POSITIONING
-----... ,
.
~
THE ELAPSED TIME BETWEEN THIS STEP AND THE
COMPLETION OF STEP 8 SHOULD NOT EXCEED 112
HOUR.
'
2.1
5.1
Clean and degrease with acetone the mounting surface and
shaft making sure to keep the acetone away from the motor
bearings.
2.2 Load the syringe with RTV.
2.3 Apply RTV into screw threads on mounting surface. Apply
more RTV on the surface by forming a daisy ring pattern
connecting the screw holes as shown above. .
I CAUTION: KEEP RTV AWA Y FROM THE SHAFT BEARING. ,I
4-31
'\
~, 'J
'');
Take up any loose play by lightly pulling down on the shaft's
load end.
5.2 Using the gap setter or a depth micrometer, push the code
wheel hub down to a depth of 1.65 mm (.065 in.) below the
rim of the encoder body. The registration holes in the gap
setter will align with the snaps protruding from the encoder
body near the cable.
5.3 Check that the gap setter or micrometer is seated squarely
on the body rim and maintains contact with the code wheel
hub.
5.4 No epoxy should extrude through the shaft hole.
DO NOT TOUCH THE CODE WHEEL AFTER ASSEMBL Y.
6.0 EMITTER END PLATE
8.0 INDEX PULSE ADJUSTMEI':IT (HEDS-5010)
8.1
6.1
Visually check that the wire pins in the encoder body are
straig.ht and straighten if necessary.
6.2 Hold the end plate parallel to the encoder body rim. Align the
guiding pin' on the end plate with the hole in the encoder
body and press the end plate straight down until it is locked
into place.
6.3 Visually check to see if the end plate is properly seated.
Some applications require that the index pulse be aligned
with the main data channels. The index pulse position and
the phase must be adjusted simultaneously. This procedure
sets index phase to zero.
8.2 Connect the encoder cable.
8.3 Run the motor. Adjust for minimum phase error using an
oscilloscope or phase meter (see 7.3).
8.4 Using an oscilloscope and the circuit shown in 1.4, set the
trigger for the falling edge of the I output. Adjust the index
pulse so that Tl and T2 are equal in width. The physical
adjustment is a side to side motion as shown by the arrow.
8.5 Recheck the phase adjustment.
7;0 PHASE ADJUSTMENT
8.6 Repeat steps 8.3-8.5 until both phase and index pulse position are as desired.
8.7 No stress should be applied to the encoder package until the
RTV has cured. Cure time: 2 hours@70·Cor24hrs.atroom
temperature.
SPECIALITY TOOLS - Available from Hewlelt-Packard
7.1
a)
HEDS-8920 Hub Puller
This tool may be used to remove code wheels from shafts
after the epoxy has cured.
~
b)
H EDS-8922 Gap Setter
This tool may be used in place of a depth micrometer as
an aid in large volume assembly.
The following' procedure should be followed when phase
adjusting channels A and '8.
k
"65"03mm~~
7.2 Connect the encoder cable.
7.3 Run the motor. Phase corresponds to motor direction. See
output waveforms and definitions. Using either an oscilloscope or a phase meter, adjust the encoder for minimum
phase error by sliding the encoder forward or backward on
the mounting surface as shown above. See Application Note
1011 for the phase meter circuit.
(.DSS ± ,001 in.)
c)
7.4 No stress should be applied to the encoder package until the
RTV cures. Cure time·is 2 hours @ 70· Cor 24 hrs. at room
temperature.
Note: After mounting, the encoder should be free from mechanical forces that could cause a shift in the encoder's position
relative to its mounting surf~ce.
In the event that the code wheel has to be removed after the epoxy
has set, use the code wheel extractor as follows:
1 Remove the emitter end plate by prying a screwdriver in the
slots provided around the encoder body rim. Avoid bending
the wire leads.
2 Turn the screw on the extractor counter-clockwise until the
screw tip is no longer visible.
3 Slide the extractor's horseshoe shaped lip all the way into the
groove on the code wheel's hub.
4 While holding the extractor body stationary, turn the thumb
screw clockwise until the screw tip pushes against the shaft.
5 Applying more turning pressure will pull the hub upwards
breaking the epoxy bond.
6 Clean the shaft before reassembly.
HEDS-892X Centering Cones
For easier volume assembly this tool in its appropriate
shaft size may be used in step 3.0 to initially center the
encoder body with respect to the shaft and aid in locating
the mounting screw holes. Depending on the resolution
and accuracy required this centering may eliminate the
need for phase adjustment steps 7 and 8.
Part Number
HEDS-8923
HEDS-8924
HEDS-8925
HEDS-8926
HEDS-8927
HEDS-8928
HEDS-8929
HEDS-8931
CODE WHEEL REMOVAL
d)
4-32
0
Shaft Size
2mm
3mm
1/8in.
5/32 in.
3/16 in.
1/4 in.
4mm
5mm
HEDS-8930 HEDS-5000 Tool Kit
1
Holding Screwdriver
1
Torque Limiting Screwdriver, 0.36cm kg (5.0 in. oz.)
HEDS-8920 Hub Puller
.
1
HEDS-8922 Gap Setter
1
1
Carrying Case
Fli;'
56 mm DIAMETER
TWO AND THREE
CHANNEL INCREMENTAL
OPTICAL ENCODER ~T
HEWLETT
~~ PACKARD
HEDS-6ooD
SERIES
Features
•
•
•
•
•
•
•
•
•
192-1024 CYCLES/REVOLUTION AVAILABLE
MANY RESOLUTIONS STANDARD
QUICK ASSEMBLY
0.2S.mm (.010 INCHES) END PLAY ALLOWANCE
TTL COMPATIBLE DIGITAL OUTPUT
SINGLE SV SUPPLY
WIDE TEMPERATURE RANGE
SOLID STATE RELIABILITY
INDEX PULSE AVAILABLE
Description
The HEDS-6000 series is a high resolution incremental
optical encoder kit emphasizing ease of assembly and
reliability. The 56 mm diameter package consists of 3 parts:
the encoder body, a metal code wheel, and emitter end plate.
An LED source and lens transmit collimated light from the
emitter module through a precision metal code wheel and
phase plate into a bifurcated detector lens.
The light is focused onto pairs of closely spaced integrated
detectors which output two square wave signals in
quadrature and an optional index pulse. Collimated light and
a custom photodetector configuration increase long life
reliability by reducing sensitivity to shaft end play, shaft
eccentricity and LED degradation. The outputs and the 5V
supply input of the HEDS-6000 are accessed through a 10
pin connector mounted on a .6 metre ribbon cable.
outline Drawing
l-600(24)-1
~ION
r
A standard selection of shaft sizes and resolutions between
192 and 1024 cycles per revolution are available. Consult
the factory for custom resolutions. The part number for the
standard 2 channel bit is HEDS-600Q, while that for the 3
channel device, with index pulse, is HEDS-6010. See
Ordering I nformation for more details. For additional design
information, see Application Note 1011.
Applications
Printers, Plotters, Tape Drives, Positioning Tables, Automatic Handlers, Robots, and any other servo loop where a
small high performance encoder is required.
7.62
(Q.3oo)
n--+-....
10C CONNECTOR
CENTER
POLARIZED
PHASE PLATE
CODE
WHEE~
26.9
(1.020)
61.:t
(2.410)
EMlTTE.R END PLATE
3.25 DIA.
10.128)
~==~~
ENCOOER eDDy
L,9.6j
~
1+-_ _ _ 65.9 MAX. DIA., _ _ _...I
(0.776)
SECTIONA-A
TYPICAL DIMENSIONS IN MILUMETRES ANO (INCHES).
4-33
-_
...
__.- _ - - - ...
(2.200)
Block Diagram and output Waveforms
r- -
-
-
-
-
-
-
(FOR COUNTER CLOCKWISE ROTATION OF CODE WHEEL
AS VIEWED FROM EMITTER END PLATE)
REsiSroR- - - ---,
I
b
Vee
CHANNEL A
> + = = = t ' - o VOA
~}GROUND
---f.!o
I
) -J-CG:::H::::AN::.:N::E::..L::..Bf18",
I
>--=----t/
I
I
I
DOO:OT
CONNEGT
VOS
~-"'''
\ I i r-,".~"
>+C:::H:..:AN::.:N::E::..L,--'+,'0", VOl
¢1
Po
r/!2
ENCODER BODY
Theory of operation
The incremental shaft encoder operates by translating the
rotation of a shaft into interruptions of a light beam which are
then output as electrical pulses.
In the HEDS-6XXX the light source is a Light Emitting Diode
collimated by a molded lens into a parallel beam of light. The
Emitter End Plate contains two orthree similar light sources,
one for each channel.
.
The standard Code Wheel is a metal disc which has N
equally spaced slits around its circumference. An aperture
with a. matching pattern is positioned on the stationary
phase plate. The light beam is transmitted only when the slits
in the code wheel and the aperture line up; therefore, during
a complete shaft revolution, there will be N alternating
light and dark periods. A molded lens beneath the phase
plate aperture collects the modulated light into a silicon
detector.
The Encoder Body contains the phase plate and the detection elements for two or three channels. Each channel
consists of an integrated circuit with two photodiodes and
amplifiers, a comparator, and output circuitry.
The apertures for the two photodiodes are positioned so that
a light period on one detector corresponds to a dark period
on the other. The photodiode signals are amplified and fed to
the comparator whose output changes state when the difference of the two photo currents changes sign ("PushPull"l. The second channel has a similar configuration but
the location of its aperture pair provides an output which is in
quadrature to the first channel (phase difference of 90 0 I.
Direction of rotation is determined by observing which of the
channels is the leading waveform. The outputs are TTL logic
level Signals.
The optional index channel is similar in optical and electrical
configuration to the A,B channels previously described. An
index pulse of typically 1 cycle width is generated for each
rotation of the code wheel. USing the recommended logic
interface, a unique logic state (Pol can be identified if such
accuracy is required.
The three part kit is assembled by attaching the Encoder
Body to the mounting surface using two screws. The Code
Wheel is set to the correct gap and secured to the shaft.
Snapping the cover (Emitter End Platel on the body completes the assembly. The only adjustment necessary is the
encoder centering relative to the shaft, to optimize quadrature and optional index pulse output.
Index Pulse Considerations
The motion sensing application and encoder interface circuitry will determine the need for relating the index pulse to
the main data tracks. A unique shaft position is identified by
using the index pulse output only or by logically relating the
index pulse to the A and B data channels. The HEDS-6010
index pulse can be uniquely related with the A and B data
tracks in a variety of ways providing maximum flexibility.
Statewidth, pulse width or edge transitions can be used. The
index pulse position, with respect to the main data channels,
is easily adjusted during the assembly process and is illustrated in the assembly procedures.
Definitions
Electrical degrees:
1 shaft rotation = 360 angular degrees
= N electrical cycles
1 cycle
= 360 electrical degrees
Position Error:
The angular difference between the actual shaft position and
its position as calculated by counting the encoder's cycles.
Cycle Error:
An indication of cycle uniformity. The difference between an
observed shaft angle which gives rise to one electrical cycle,
and the nominal angular increment of 1/N of a revolution.
Phase:
The angle between. the center of Pulse A and the center of
Pulse B.
Index Phase:
For counter clockwise rotation as illustrated above, the
Index Phase is defined as:
<1>1 = (<1>1-<1>21.
2
<1>1 is the angle, in electrical degrees, between the falling edge
of I and falling edge of B.2 is the angle, in electrical
degrees, between the riSing edge of A and the rising edge
of I.
Index Phase Error:
The Index Phase Error (11<1>11 describes the change in the
Index Pulse position after assembly with respect to the A and
B channels over the recommended operating conditions.
4-34
Absolute Maximum Ratings
Storage Temperature
Operating Temperature
Symbol
Min.
Max.
Units
Ts
·55
-55
100
100
°Oelslus
°Celsius
20
g
:25(10)
mm (inch/10bb)
TIR
TA
Nbtes
See Note 1
See
'i: .·. ·,?5
.sl)iiffAxial Play
Shaft Eccentricity Plus
Radial Play
Supplyyglt(!ge ..
Outp{JifVoltage
Vee
Vo
-0,5
-0,5
Vee
Volts
Output Current
Velocity
'10
-1
5
mA
12.000
250.000
R,pLM,
7
a
Aq'celerC!Jign
Movement should 6eJimited
even under shock
cdhdittdO$:
.,
Recommended operating Conditions
Parameter
Temperature
Supply Voltage
Code Wheel Gap
Shaft Perpendicularity
Plus Axial Play
Shaft Eccentricity Plus
Radial Play
Load Capacitance
Symbol
Min.
Max.
Units
T
-20
4,5
85
5,5
1,1 (45\
°Celsius
Volt
mm (inch/10pO)
mm (inch/1000)
TlR
Non-condensing atmos,
Ripple < 100mVp_p
mm (inch/1000)
TlR
pF
10 mm (0.4 inch) from
mounting surface.
Vee
0,25 (10)
0,04 (1.5)
100
CL
Notes
Nominal gap '"
0,76 mm (,030 in,) when shaft
is at minimum gap position,
Encoding Characteristics
The specifications below apply within the recommended operating conditions and reflect performance at 1000 cycles per
revolution (N = 1000). Some encoding characteristics improve with decreasing cycles iN\, Consult Application Note 1011 or
factory for additional details.
Parameter
Position Error
Cycle Error
Max. Count Frequency
Pulse Width Error
Symbol
M)
Min.
AC
fMAX
AP
130,000
Typ,
Max.
Units
Notes (See Definitions)
7
18
Minutes of Arc
1 Cycle = 21.6 Minutes
See Figure 5.
3
5.5
Electrical deg.
200,000
Hertz
12 .
Electrical deg.
Phase Sensitivity to
Eccentricity
227
i5,8)
Elec. deg.!mm
(Elec. deg.!mill
Phase Sensitivity to
Axial Play
20
(.5)
Elec. deg.lmm
(Elec. deg.lmil)
f =Velocity (RPM) x N/60
T=25°C,f=8KHz
See Note 2
mil
=inch/1000
mil '" inch/1000
=
Logic State Width Error
olS
25
Electrical deg.
T 25°C, f= 8 KHz
See Note 2
Index Pulse Width
PI
360
Electrical deg.
T = 25° C, f
See NoteS
Index Phase Error
Al
Electrical deg.
See Notes 4, 5
Index Pulse
Adjustment Range
17
0
±165
4-35
Electrical deg.
= 8 KHz
/
Mechanical Characteristics
Parameter.
Dimension
Symbol
Outline Dimensions
Tolerance
Units
+.000
-.015
mm
+.0000
-.0007
inches
Notes
See Mech. Dwg.
4
6
8
Code Wheel Available to
Fit the Foltowing Standard
Shaft Diameters
3/16
1/4
5/16
1/2
5/8
7.7 (110 x 10-6)
J
Moment of Inertia
3/8
Required Shaft Length
Bolt Circle
gcm2 (oZ-in-S21
15.9 (0.625)
±0.6 (±.0241
mm (inches 1
See Figure 10.
Shaft at minimum
length position.
46.0 (1.811)
±0.13 (±.0051
mm (inches)
See Figure 10.
2.5 x 0.45 x 5
OR
#2-56 x 3/16
Pan Head
Mounting Screw Size
mm
inches
Electrical Characteristics When operating within the recommended operating range.
Electrical Characteristics over Recommended Operating Range (Typical at 25°CI.
Parameter
Supply Current
Symbol
Min.
Icc
High Level Output
Voltage
VOH
Low Level Output
Voltage
VOL
Typ.
Max.
Units
21
40
mA
36
60
2.4
0.4
Rise Time
Ir
0.5
Fait Time
tf
0.2
Ceo
12
Cable Capacitance
Notes
HEDS-6000 (2 Channel)
HEDS-6010 (3 Channel)
V
IOH '" -401'A Max.
V
IOL=3.2mA
1'$
CL'" 25 pF, RL = 11 K Pull-up
See NoteS
pFlmeter
Output Lead to Ground
NOTES:
1. The structural parts of the HEDS-6000 have been successfully tested to 20g. In a high vibration environment use is limited at low
frequencies (high displacement) by cable fatigue and at high frequencies by code wheel resonances. Resonant frequency depends on
code wheel material and number of counts per revolution. For temperatures below -20° C the ribbon cable becomes brittle and sensitive
to displacements. Maximum operating and storage temperature includes the surface area of the encoder mounting. Consult factory for
further information. See Application Note.l 011.
2. In a properly assembled lot 99% of the units, when run at 25° C and 8 KHz, should exhibit a pulse width error less than 32 electrical
degrees, and a state width error less than 40 electrical degrees. To calculate errors at other speeds and temperatures add the values
specified in Figures 1 or 2 to the typical values specified under encoding characteristics or to the maximum 99% values specified in
this note.
3. In a properly assembled lot, 99% of the units when run at 25°C and 8 KHz should exhibit an index pulse width greater than 260
electrical degrees and less than 460 electrical degrees. To calculate index pulse widths at other speeds and temperatures add the
values specified in Figures 3 or 4 to the typical 360° pulse width or to the maximum 99% values specified in this note.
4. Index phase is adjusted at assembly. Index phase error Ls the maximum change in index phase expected over the full temperature
range and up to 50 KHz, after assembly adjustment of the index pulse position has been made.
5. When the index pulse is centered on the low-low states of channels A and S as shown on page 2, a unique Po can be defined once per
revolution within the recommended operating conditions and up to 25 KHz. Figure 6 shows how Po can be derived from A, S, and I
outputs. The adjustment range indicates how far from the center of the low-low state that the center of the index pulse may be
adjusted.
6. The rise time is primarily a function of the RC time constant of Rl and Cl. A faster rise time can be achieved with either a lower value of
Rl or Cl. Care must be observed not to exceed the recommended value of IOl under worst case conditions.
4-36
ELECTRICAL
ELECTRICAL
DEGREES
DEGREES
130
lZ0
110
a: a: 100
00
a: a: 90
a: a:
WW
80
J:J:
70
........
00
60
H
50
ww
....
40
i:el;;
30
~~
20
ww
10
~~
a: a:
a: a:
a: a:
00
ww
J:J:
.... ....
00
H
WW
"
......
....
5~
i:el;;
==~
ww
..
~~
zz
J:J:
zz
J:J:
-10
-20
-30
uu
130
lZ0
110
100
90
80
70
60
50
40
30
20
10
-10
-20
-30
""
-40
-60
-40
-40
-60
10
0
-20
-30
..
-40
-50
'z"
-70
J:
-80
.
~
-70
J:
-80
u
~
w -60
-60
w
-20
i:e
-50
'z"
0
-10
....J:
0
i!:
w -30
-40
~
100
20
10
-10
~
80
30
"'~ ...
::~~~
-~" ..'l~....
20
w
60
ELECTRICAL
DEGREES
30
i:e
40
Figure 2. Maximum Change In Pulse Width Error or In
State Width Error Due to Speed and Temperature
ELECTRICAL
DEGREES
....
0
i!:
20
TEMPERATURE IN DEGREES CENTIGRADE
Figure 1. Typical Change In Pulse Width Error or in State
Width Error due to Speed and Temperature
J:
-20
-40
TEMPERATURE IN DEGREES CENTIGRADE
"
-90
-90
-100
-100
-110
-110
-120
-60
-40
-20
20
40
60
-120
100
80
-60
-40
TEMPERATURE IN DEGREES CENTIGRADE
-20
20
40
60
80
100
TEMPERATURE IN DEGREES CENTIGRADE
Figure 3. Typical Change in Index Pulse Width Due to
Speed and Temperature
Figure 4. Maximum Change in Index Pulse Width Due to
Speed and Temperature
PIN
50
.
- - . , . - - , - - - - - - - - Vee
"a:
u.
o
1
=>
"
30
I
a:
oa:
IE
.,.,.-
20
z
o
;::
~
0.1.uF
9~/674LS14
A
40
:il....
z
J;
7
10
i..-
--- - I---
I--"
-
10
99%
t-
0.00
(11
.02
V
.06
.08
1J
--1
T
~_il
I
l_
I
1/374LSll
1/674LS14
:-~-~--------GROUND
{3)
121
.04
~
1J -------r=D---Po
1/674LS14
8~--J
TYPICAL
I-'
o
.
(1/1000 INCH)
.10
MILlIMETRES
4 - - } (GROUND OR DO
5 --
NOT CONNECT)
SHAFT ECCENTRICITY
DASHED LINES REPRESENT AN OPTIONAL INDEX SUMMING CIRCUIT.
STANDARD 74 SERIES COULD ALSO BE USED TO IMPLEMENT THIS CIRCUIT.
Figure 5. Position Error vs. Shaft Eccentricity
Figure 6. Recommended Interface Circuit
4-37
PINOUT
PIN.;t
1
2
Vee
GROUND
N,C. OR GROUND
N,C. OR GROUND
GROUND
Vee
CHANNEL B
Vee
CHANNEL I
5
6
7
8
BOTTOM VIEW
FUNCTION
CHANNEL A
10
MATING CONNECTOR
BERG 65·692·001 OR EOUIVALENT
EMITTER
END PLATE
Figure 7~ Connector Specifications
CODE WHEEL
ASSEMBLY
PHASE
PLATE
ENCODER
BODY
Figure 8. HEDS·6000 Series Encoder Kit
SETSCREW
2·56
HOLLOW OVAL
POINT
8.48! 0.51
10.334 ± 0.020)
, MILLIMETRE ,x ± 0.5 .XX ± 0.10
(INCHES) I.XX. 0.02 .XXX' 0.0061
UNITS mm (INCHES)
Figure 9. Code Wheel
Figure 10. Mounting Requirements
Ordering Information
OPTION'
RESOLUTION tCYClES PER REVOLUTIONI
D-192CPR
e -200 CPR
H-400CPR
PRODUCT TYPE
1-512CPR
B -1000CPR
J-1024 CPR
o - 56 mm COMPLETE KtT
1 - 56 mm CODE WHEEL
2 - 56 mm ENCODER BODY
3 - 56 mm EMtTTER END PLATE·
A -500CPR
NOTE: OTHER RESOLUTIONS AVAILABLE
ON SPECIAL REOUEST
OUTPUTS
o - 2 CHANNEL DIGITAL
SHAFT OlAMETER
1 - 3 CHANNEL DIGtTAL
05 - 31161N.
06 - 1/4 IN.
07 -att6IN.
08 - SI8IN.
09 - 112 IN.
10 - 518 IN.
MECHANICAL CONfiGURATION
0-0.6 m (24 IN.l CABLE
11-4mm
12-5mm
'NO OPTION IS SPECIFIED WHEN ORDERING
EMITTER END PLATES ONLY.
IS-amm
00 - use WHEN ORDERING
ENCODER aDDlES
4-38
Shaft Encoder Kit Assembly
See Application Note 1011 for further discussion.
The following assembly procedure represents a simple and reliable method for prototype encoder assembly. High volume assembly may
suggest modifications to this procedure using custom designed tooling. In certain high volume applications encoder assembly can be
accomplished in less than 30 seconds. Consult factory for further details. Note - the code wheel to phase plate gap should be set between
0.015 in. and 0.045 in.
I WARNING: THE ADHESIVES USED MAY BE HARMFUL. CONSULT THE MANUFACTURER'S RECOMMENDA TlONS. I
READ THE INSTRUCTIONS TO THE END BEFORE STARTING ASSEMBLY.
1.0 SUGGESTED MATERIALS
3.0 ENCODER BODY ATTACHMENT
1.1
Encoder Parts
Encoder Body
Emitter End Plate
Code Wheel
1.2 Assembly Materials
RTV-General Electric 162
-Dow Corning 3145
Acetone
Mounting Screws 121
1.3 Assembly Tools
al Torque limiting screwdriver, 0.5 cm kg. 17.0 in. oz. I.
b I Straight edge. Straight within 0.1 mm 10.004 in. I
c I Oscilloscope. 1Phase meter may be optionally used for two
channel calibration I.
dl Hub puller. Grip-O-Matic-OTC #1000 2-jaw or equivalent.
Optional tool for removing code wheels.
el Syringe applicator for RTV.
f) Torque limiting Allen wrench. 0.5 cm kg (7.0 in. oz.)
0.035 in. hex.
1.4 Suggested Circuits
a I Suggested circuit for index adjustment (HEDS-6010 I.
74LS14
ll>O--l1J.~
____----.
A
OUTPUT TO.OSCILLOSCOPE
BUFFER
A
3.1
Place the encoder body on the mounting surface and slowly
rotate the body to spread the adhesive. Align the mounting
screw holes with the holes in the body base.
3.2
Place the two mounting screws into the holding bosses in the
body base, as shown.
3.3 Thread the screws into the mounting holes and tighten both to
0.5 cm kg 17.0 in. oz. I using the torque limiting screwdriver.
ISee notes A and BI.
3.4
1/474LS32
Foroptimal index phase adjust encoder pOSition to equalize
Tl and T2 pulse widths.
bl Phase Meter Circuit
Recommended for volume assembly. Please see Application Note 1011 for details.
2.0 SURFACE PREPARATION
It is not necessary to center the encoder body at this time.
Notes:
a I At this torque value, the encoder body should slide on the mounting surface only with considerable thumb pressure.
b I The torque limiting screwdriver should be periodically calibrated
for proper torque.
4.0
APPLICATION OF RTV TO THE HUB
THE ELAPSED TIME BETWEEN THIS STEP AND THE
COMPLETION OFSTEPB SHOULD NOT EXCEED 1/2
HOUR.
2.1
Clean and degrease with acetone the mounting surface and
shaft making sure to keep the acetone away from the motor
bearings.
2.2
Load the syringe with RTV.
2.3 Apply RTV into screw threads on mounting surface. Apply
more RTV on the surface by forming iI daisy ring pattern
connecting the screw holes as shown above.
, CAUTION: KEEP RTVAWAY FROM THE SHAFT BEARING.'
, CAUTION: HANDLE THE CODE WHEEL WITH CARE.
4.1
I
Make surethatthe hex screw on the hub does not enter intothe
hub bore.
4.2 Apply a small amount of RTVonto the inner surface of the hub
bore.
4.3 Spread the RTV evenly inside the entire hub bore.
4.4
Holding the code wheel by its hub, slide it down onto the shaft
until the shaft extends at least halfway into the bore.
4-39
- - - - - - - - - - - - - - - - - _ . --.._._-_.
5.0 CODE WHEEL POSITIONING
7.0 PHASE ADJUSTMENT
7.1
5.1
Position the Allen torque wrench into the hex set screw in the
hub, as shown.
5.2
Pull the shaft end down to bottom out axial shaft play. Using
the straight edge, push the top of the hub even with the top of
the encoder bocy. The Allen wrench should be used during
this movement to apply a slight upward force to the hub,
insuring continuous contact between the straightedge and the
hub.
.
The following procedure should be followed when.phase
adjusting channels A and B.
.
7.2 Connect the encoder cable.
7.3 Run the motor. Phase corresponds to motor direction. See
output waveforms and definitions. Using either an oscilloscope
or a phase meter, adjust the encoder for minimum phase error
by sliding the encoder forward or backward on the mounting
surface as shown above. See Application Note 1011 for the
phase meter circuit.
5.3 Tighten the hex set screw to approximately 0.5 em. kg. (7.0 in.
OZ.I and remove the straight edge.
7.4 No stress should be applied to the encoder package until
the RTV cures. Curve time is 2 hours @ 70· Cor 24 hours
at room temperature.
.
5.4 The code wheel gap may now be visually inspected to check
against gross errors. A nominal gap of 0.8 mm 10.030 ·in.1
should be maintained.
Note: After mounting, the encoder should be free from mechanical
forces that could cause a shift in the encoder's position relative to its
mounting surface.
6.0 EMITTER END PLATE
8.0
INDEX PULSE ADJUSTMENT-{HEDS-6010)
8.1
Some applications require that the index pulse be aligned with
the main data channels. The index pulse pOSition and the
phase must be adjusted simultaneously. This procedure sets
index phase to zero.
.
6.2 Align the emitter end plate so that the two flanges straddle the
track of the encoder body where the wire pins are located.
Press the end plate until it snaps into place.
8.2
Connect the encoder cable.
6.3 Visually check to see if the end plate is properly seated.
8.4
Using an oscilloscope and the circuit shown in 1.4, set the
trigger for the falling edge of the PI output. Adjust the index
pulse so thatTl and T2 are equal in width. The physical adjustment is a side to side motion as shown by the arrow.
8.5
Recheck the phase adjustment.
8.6
Repeat steps 8.3-8.5 until both phase and index pulse position
are as desired.
8.7
No stress should be applied to the encoder package until
the RTV has cured. Cure time: 2 hours @ 70· C or,24 hours
at room temperature.
6.1
Visually check that the wire pins in the encoder body are
straight and straighten if necessary.
8.3 Run the motor. Adjustfor minimum phase error using an oscilloscope or phase meter. (See 7.3).
4-40
--------
F/i'PW
HEWLETT
~e.tI PACKARO
PANEL MOUNT DIGITAL
POTENTIOMETER
HEDS-7500
SERIES
Features
• DESIGNED FOR MANUAL OPERATION
• SMALL SIZE
• RELIABLE OPTICAL TECHNOLOGY
• 256 PULSES PER REVOLUTION STANDARD
Other Resolutions Available
• TTL COMPATIBLE DIGITAL OUTPUT
• SINGLE 5 V SUPPLY
• -20 0 TO +85 0 C OPERATING RANGE
• 0.1 OZ.-IN. NOMINAL SHAFT TORQUE
Description
The HEDS-7500 series is a family of digital potentiometers
designed for applications where a hand operated panel
mounted encoder is required. The unit outputs two digital
waveforms which are 90 degrees out of phase to provide
resolution and direction information. 256 pulses per revolution is available as a standard resolution. The digital
outputs and the 5 V supply input of the HEDS-7500 are
accessed through color coded wire or through a 10 pin
connector mounted on a 6 inch ribbon cable. Each digital
output is capable of driving two standard TTL loads.
code wheel rotates between the LED and detector to provide digital pulses without wipers or noise. The
HEDS-7500 is configured to provide standard potentiometer type panel mounting. Additional design information is
available in Application Note 1025.
Applications
The HEDS-7500 series digital potentiometer may be used
in applications where a manually operated knob is
required to convert angular position into digital
information.
The HEDS-7500 emphasizes reliability by using solid state
LEDs and photodiode detectors. A non-contacting slotted
outline Drawing
j---' l61---t----"".911.221
rl13'2gl:~:~1 12.110,Wll
53
I
10POSITlON
IPC CONNECTOR
C.ENrt:R POLAFUZED
OR
4. COLOR CODED
~
,~
0
11''';~~=~
L
THReAD
31$~32:
NUT SUPPLIED
i~~~i MAX, OIA.
TYPICAlOIM£NS!ONS IN M:tlL1METRESANCHINCHES)
4-41
Absolute Maximum Ratings
Symbol
Min.
Max.
Units
Storage Temperature
Ts
-40
+85
°C
Operating Temperature
TA
-40
Parameter
Notes
+85
°C
Vibration
20
9
20 Hz-2 kHz
Shock
30
9
V
11 msec
Supply Voltage
Vee
-0.5
7
Output Voltage
Vo
-0.5
Vee
V
Output Current per Channel
10
-1
5
mA
1
Ibs.
Ibs.
Shaft Load - Radial
Axial
1
-
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
T
-20
85
°C
Vee
4.5
5.5
V
300
RPM
Temperature
Supply Voltage
Rotation Speed
Noles
Non-condensing atmosphere
Ripple < 100 mV p _p
Electrical Characteristics
When operating within the recommended operating range.
Electrical Characteristics Over Recommended Operating Range Typical at 25° C.
Parameter
Symbol
Supply Current
Icc
High Level Output Voltage
VOH
Low Level Output Voltage
VOL
Min.
Typ.
Max.
Units
21
40
mA
2.4
0.4
Notes
= -40 p.A Max.
V
IOH
V
IOL=3.2 mA
CAUTION: Device not intended for applications where coupling to a motor is required.
WAVEFORMS
RECOMMENDED INTERFACE CIRCUIT
CHANNEL A
f J
A
90' ± 4 5 . j
-
l
Vee
1
0
CHA
CHANNEL B
ILJl
CHB~B
1
_ _ _ _ _ _ _ _ _ GROUNO
GROUND
0
CH B LEADS CH A FOR COUNTERCLOCKWISE ROTATION.
CH A LEADS CH B FOR CLOCKWISE ROTATION.
STANDARD 74SERIES COULD ALSO BE USED TO IMPLEMENT THIS CIRCUIT.
TERMINATION
Ribbon Cable Termination
Color Coded Wire Termination
Ordering Information
PINOUT
~
CHANNEL A
Vee
GROUND
N.C. OR GROUND
N.C. OR GROUND
GROUND
DESIGNATION
WHITE/BLACK/RED
WHITE/BLACK/BROWN
WHITE/RED
BLACK
CHANNEL A
CHANNEL B
Vee
GROUND
Vee
BOTTOM VIEW
9
10
CHANNEL'B
Vee
N.C.
NOTE: REVERSE INSERTION Of THE
CONNECTOR WILL PERMANENTLY
DAMAGE THE DETECTOR IC.
MATING CONNECTOR
BERG 65·692'()01 OR EQUIVALENT
4-42
Part Number
Description
PPR
Termination
HEDS-7500
256
Wire
HEDS-7501
256
Cable
GENERAL PURPOSE
MOTION CONTROL Ie
. :'II HEWLETT
~
171~ PAC~ARD
Features
• DC, DC BRUSH LESS AND STEPPER MOTOR
CONTROL
o POSITION CONTROL
• VELOCITY CONTROL
AO,IDaS
• PROGRAMMABLE VELOCITY PROFILING
o
PROGRAMMABLE DIGITAL FILTER
o
PROGRAMMABLE COMMUTATOR
o
PROGRAMMABLE PHASE OVERLAP
o
PROGRAMMABLE PHASE ADVANCE
o
GENERAL 8 BIT PARALLEL 1/0 PORT
Vee
PROF
INIT
CiIiU'I'
ffijjI
PULSE
SIGN
• 8 BIT pARALLEL MOTOR COMMAND PORT
MCo
• PWM MOTOR COMMAND PORT
o
QUADRATURE DECODER FOR ENCODER
SIGNALS
o
24 BIT POSITION COUNTER
o
~NGLE5VPOWERSUPP~
1 OR 2 MHz CLOCK OPERATION
Package Dimensions
ORIENTATION NOTCH:
t:::~:
mn-----]
L
NOTES:
'I. EACH PIN CENTERLINE TO 8E LOCATEO
WITHIN 0.010" OF ITS TRUE
LONGITUOINAL POSITION.
2. LEAO FINISH: SOLOER COAT,
r--
-I r-
2.0601 0.010
0•080 t 0.010
--I
0.600tO.Ol0
CToe
OFBENOR
SEATING
PLANE
PIN NO, 1 10
0.200MAX
1-1
0.02 MIN
,e~--:!~
.J
Me,
Me2
'SHO·lu~i.-O-SE""L""E-FT-F-LO"'ATING
PINOUT
o TTL COMPATIBLE
o
7
:±=
4o-PIN PLASTIC DUAL INLINE PACKAGE
'"
General Description
The HCTL-1000 is a high performance, general purpose
motion control IC fabricated in Hewlett-Packard NMOS
technology, It performs all the time-intensive tasks of digital
motion control, thereby freeing the host processor for
other tasks. The Simple programmability. of all control
parameters provides the user with maximum flexibility and
Figure 1. System Block
Diagram
quick design of control systems with a minimum number
of components. All that is needed for a complete servo
system is a host processor to specify commands, an
amplifier and motor with an incremental encoder. No
analog compensation or velocity feedback is necessary
(see Figure 1).
Table of Contents
Page
General Description , .. " ... , ... ,',." ............. , 1
Theory of Operation " ... " .. ,', .. , .. , ......... ".,. :2
Absolute Maximum Ratings .... , .. , .. , ............ ,' 3
DC Characteristics .... , ... ,.,'" .:. , .. , .. , . , .. , , , , , ,. 3
AC Characteristics , ... , , ... , , ..' ... , , • , • , .. , , , , , .. , ,. 4
Timing Diagrams " .•• " •. ,., .. "."., .... " •. " .. .',. 5
Functional Pin Description ", ... ,"', .... ,"", ....• 9
Operation of the HCTL-1000 " ......... , ............ 10
- User Accessible Registers . '." . , , , , , ••.•..•.••.•• 10
- Operating Modes ,." .. , ... ,',., .. , ....... ,.,'" 13
- Commutator"" •.. , .. '.,.,.".,',., .. , .. ,""'.'., 17
Interfacing the HCTL-1000 .......... , , ....... , , ...... 20
- I/O Interface '., .. ,', .... ,.," ' ...•• ,"', ... ,......... 20
- Encoder Interface " .. , .. , .. , .............. , , ... , 20
,.... Amplifier Interface , .•. ', .. " ... , .. , ....... , , , .. , 21
ESD WARNING: Since this is an NMOS device, normal
precautions should be taken to avoid static damage.
4-43
PROF
INIT
r--~-------------------------------,
I
..
I
ADO/DBO
MC,
AD,/DB,
MC,
MC,
AD2/DB2
AD3/DB3
MOTOR
COMMANO
AD4/DB4
PORT
MC,
MC,
ADs/DBs
MC.
DB,
MC.
DB1
ALE
CS
PULSE
OE
SIGN
R/W
PHA
PHB
COMMUTATOR
i _r;;:;;:;:;,
PHC·
EXTCLK~
PHD
RESET+
I
IL _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
CHA CHB
Figure 2. Internal Block Diagram
Introduction
Theory of Operation
The purpose of this section is to describe the organization
of this data sheet. The front page includes the key features
of the HCTL-1000, a general description of the part, the
mechanical drawing and pin-out, and a Table of Contents.
Following this section is the Theory of Operation, which
gives the user a brief overview of how the HCTL-1000 operates by describing the internal block diagram shown in
Figure 2. The following five sections give the specifications
of the HCTL-1000, including Absolute Maximum Ratings,
DC Characteristics, AC Characteristics, Timing Diagrams,
and Functional Pin Descriptions. The final two sections
include the detailed information on how to operate and
interface to the HCTL-1000. The How to Operate section
discusses the function and address of each software register, and describes how to use the four position and velocity
control modes and the electronic commutator. The How to
Interface section describes how to interface the HCTL-1000
to a microprocessor, an encoder, and an amplifier.
The HCTL-1000 is a general purpose motor controller
which provides position and velocity control for dc, dc
brush less and stepper motors. The internal block diagram
of the HCTL-1000 is shown in Figure 2. The HCTL-1000
receives it input commands from a host processor and
position feedback from an incremental encoder with quadrature output. An a-bit directional multiplexed address/data
bus interfaces the HCTL-1000 to the host processor. The
encoder feedback is decoded into quadrature counts and
a 24-bit counter keeps track of position. The HCTL-1000
executes anyone of four control algorithms selected by
the user. The four control modes are:
•
•
•
•
4-44
Position Control
Proportional Velocity Control
Trapezoidal Profile Control for"point to point moves
Integral Velocity Control with continuous velocity profiling
using linear acceleration
--------- -----
-
The resident Position Profile Generator calculates the
necessary profiles for Trapezoidal Profile Control and
Integral Velocity Control. The HCTL-1000 compares the
desired position (or velocity) to the actual position (or
velocity) to compute compensated motor commands using
a programmable digital filter D(z). The motor command is
externally available at the Motor Command port as an 8bit byte and at the PWM port as a Pulse Width Modulated
(PWM) signal.
-
--- -------------- - - - - - - - - -
Absolute Maximum Ratings
Operating Temperature ................... O°C to 70°C
Storage Temperature ................. -40°C to +125°C
Supply Voltage ........................... -0.3 V to 7 V
Input Voltage ............................ -0.3 V to 7 V
Maximum Power Dissipation ................... 0.95 W
Maximum Clock Frequency .................... 2 MHz
The HCTL-1000 has the capability of providing electronic
commutation for dc brushless and stepper motors. Using
the encoder position information, the motor phases are
enabled in the correct sequence. The commutator is fully
programmable to encompass most motor encoder combinations. I n addition, phase overlap and phase advance
can be programmed to improve torque ripple and high
speed performance. The HCTL-1000 contains a number of
flags including two externally available flags, Profile and
Initialization, which allow the user to see or check the
status of the controller. It also has two emergency flags,
Limit and Stop, which allow operation of the HCTL-1000 to
be interrupted under emergency conditions.
The HCTL-1000 controller is a digitally sampled data system.
While information from the host processor is accepted
asynchronously with respect to the control functions, the
motor command is computed on a discrete sample time
basis. The sample timer is programmable.
D.C. Characteristics T
Parameter
A
= O°C to +70°C; Vee = 5 V ± 5%; Vss = 0 V
Symbol
Min.
lYP·
Max.
Units
Power Supply
Vee
4.75
5.00
5.25
V
Supply Current
Icc
80
180
mA
Iii
10
p.A
Tristate Output
Leakage Current
I'on
±10
p.A
Input Low Voltage
V
Input Leakage Current
Teit Conditione
"'5.25 V
VOUT " -0.3 to 5.25 V
VIL
-0.3
0.8
Input High Voltage
V'H
2.0
Vee
V
Output low Voltage
VOL
-0.3
0.4
V
Output High Voltage
VOH
2.4
Vee
V
950
mW
20
pF
T A" 25° C, f'" 1 MHz
unmeasured pins
returned to ground
pF
Same as above
Power DIssipation
Po
Input Capacitance
C'N
Output Capacitance load
COUT
400
100
4-45
=2.2mA
IOH = -200 p.A
A.C. Electrical Characteristics· TA =o·c to 70·C; Vcc =5 V± 5%; Units =nsec
2MHz
ID# Signal
1
Clock Period
Symbol
Min.
tCPER
500
230
200
=
2
Pulse Width, Clock High
3
4
Pulse Width, Olock Low
5
Input Pulse Width Reset
6
Input Pulse Width StoP. LImit
tiP
GOO
7
Input Pulse Width Index, Index
t,X
8
Input Pulse Width CHA, CHB
tlAB
1600
1600
tAB
600
tCPWH
tCPWL
tOR
Olock Rise and Fall Time
tlRsT
9 Delay CHA to CHB Transition
10 Input Rise/Fail Time OHA, CHB, Index
Input Rise/FaU Time Reset. ALE. OS. DE, Stop, Limit
12
Input Pulse Width ArE, OS
tlPW
tAC
14 Delay Time. ALE Rise to CS Rise
15 Address Set Up Time Before ALE Rise
tOA
tASR1
16 Address Set Up Time Before OS Fall
17 Write Data Set Up Time Before OS Rise
18
19
20
21
Delay Time. Write Cyo/e. CS Rise to ALE Fall
22
Delay Time. Read/Write, OS Rise to CS Fait
tASR
tOSR
AddresslOata Hold Time
tH
Set Up Time, RIW Before CS Rise
twos
Hold Time, RIW After CS Rise
tWH
I'
23 Write Cycle, ALE Fall to ALE Fall For Next Write
Hm., Cs RI" .. OE
26
27
twe
F~I
tosOE
ay Time. DE Fall to Data Bus valid
tOEDe
y Time, CS Rise to Data Bus Valid
tosoe
t Pulse Width DE
t'PWOE
28
Hold Time. Data Held After DE Rise
tOOEH
29
Delay Time, Read Cycle, CS Rise to ALE Fall
tOSALR
30 Read Cycle, ALE Fall to ALE Fall For Next Read
31 Output Pulse Width. PROF. INIT, Pulse. Sign,
PHA-PHD, MC Port
32 Output Rise/Fall Time. PROF, INn; Pulse, Sign
PHA-PHD. Me Port
50
5000
1100
3100
3100
1100
450
50
80
50
90
50
H
50
20
20
20
50
20
20
20
20
20
20
20
20
20
3400
3000
3530
3200
100
0
1830
1700
100
1800
100
20
3300
100
20
tRC
1820
1950
3320
3450
tOF
500
1000
tOR
20
tEP
20
150
20
300
20
33 Delay Time, Clock Rise to Output Rise
34 Delay Time, CS Rising to MC Port Valid
35 Hold Time, ALE High After CS Rise
tcsMO
tALH
100
100
36 Pulse Width, ArE High
tALPWH
100
100
4-46
Max.
200
tCSAL~
tcscs
M
1000
300
50
tlR
13 Delay Time, ALE Fall to OS Fall
Max.
2500
t'ABR
11
Clock Frequency
1 MHz
1600
150
300
3200
HCTL-1000 I/O Timing Diagrams
Input logic level values are the TTL Logic levels V,L = 0.8 V and V,H = 2.0 V.
Output logic levels are VOL = 0.4 V and VOH = 2.4 V.
n-
~
INDEX _ _ _
_ __
CHA
_~=:r_
INDEX
~
CHB
CLOCK
RESET
i~,~F ----\J,---------i.l~SIGN
~~~~~
_ _ _.....t
4-47
------
, . _.. _ - - - - _. ._-", . .
_0J=:r_
~
HCTL-1000 I/O Timing Diagrams
There are three different timing configurations which can be used to give the uSer flexibility to interface the HCTL-1000 to
most microprocessors. See the I/O interface section for more details.
ALE/CS NON OVERLAPPED
Write Cycle
R/W
AD/DB
~.I.~
~ALlD
ADDRESS
Read Cycle
4-48
HCTL-1000 I/O Timing Diagrams
ALE/CS OVERLAPPED
Write Cycle
t----------i12}----------i
RiW
AD/DB
Read Cycle
4-49
HCTL-1000 I/O Timing Diagrams
ALE WITHING CS
Write Cycle
1--------------------------~231r_------------------------~
ALE
1-----------{14r----------J+"'--'---------{ }----------l
Read Cycle
4-50
Functional Pin Description
INPUT/OUTPUT SIGNALS
~ymbol
Pin Number
Description
2-7
Add1(!lsslData bus - Lower 6 bits of S-bit I/O port which are multiplexed between address
and a,l1ta.
6;;9
Data bu~ ;;-Y12R!lr 2 bits 91 8-bit IIQport usest for (jaya only.
ADO/DBOAD5/DB5
IJ;ls, D7
INPUT SIGNALS
Symbol
CHA/CHa
Index
Description
Pin Number
31,30
33
Channel A,a - input pins for position feedback from an incremental shaft encoder. Two
channels, A and B. 90 degrees out of phase are required.
Index Pulse - input from the reference or Index pulse of an Incremental encoder. Used
only In conjunction with the Commutator. Either a low or high true signal can be used with
the Index pin. See Timing Diagrams and Encoder Interface section for more detail.
R/W
37
Read/Write - determines direction of data exchange for the I/O port.
A'l::'E
38
Address Latch Enable - enables lower 6 bits of external data bus into internal address
latch.
CS
39
Chip Select - performs 110 operation dependent on status of RIW line. For a Write. the
external bus data is written into the internal addressed location. For Read, data is read
from an internal location into an internal output latch.
OE
40
Output Enable - enables the data in the internal output latch onto the external data bus
to complete a Read operation.
Limit
14
Limit Switch - an Internal flag which when externally set, triggers an unconditional
branch to the Initialization/Idle mode before the next control sample is executed. Motor
Command is set to zero. Status of the LImit flag is monitored In the Status register.
SfOij
15
Stop Flag - an internal flag that is externally set. When flag Is set during Integral Velocity
Control mode, the Motor Command is decelerated to a stop.
Reset
36
Reset - a hard reset of internal circuitry and a branch to Reset mode.
ExtClk
34
External Clock
Vec
11,35
Voltage Supply - Both Veo pins must be connected to a 5.0 volt supply.
Vss
10,32
Circuit Ground
NC
1
Not Connected - this pin should be left floating.
OUTPUT SIGNALS
Symbol
MCO-MC7
Pulse
Sign
PHA-PHD
Description
Pin Number
18-25
Motor Command Port - 8-blt output port which contains the digital motor command
adjusted for easy bipolar DAC Interfacing. MC7 Is the most significant bit (MSB).
16
Pulse - pulse width modulated signal whose duty cycle is proportional to the Motor
Command magnitude. The frequency of the signal is External Clock/lOa and pulse width
is resolved Into 100 external clocks.
17
Sign - gives the sign/direction of the pulse signal.
26-29
Phase A. a, C, D -
Phase Enable outputs of the Commutator.
Prof
12
Profile Flag - Status flag which indicates that the controller is executing a profiled
position move in the Trapezoidal Profile Control mode.
lnlt
13
Initialization/Idle Flag - Status flag which indicates that the controller is in the
Initialization/Idle mode.
- - - - - - - - - - - - _. . ._.....
4-51
__
.. -_... _ ... ' - - -
.... - ......._------_ .. _--_..
-_._.. _ - - -
Operation of the HeTl-1000
F2 - Unipolar Flag - set/cleared by the user to specify
Bipolar (clear) or Unipolar (set) mode for the Motor
Command port.
USER ACCESSIBLE REGISTERS
The HCTL-l000 operation is controlled by a bank of 64 8-bit
registers, 32 of which are user accessible. These registers
contain command and configuration information necessary
to properly run the controller chip. The 32 user-accessible
registers are listed in Table I. The register number is also
the address. A functional block diagram of the HCTL-l000
which shows the role of the user-accessible registers is
also included in Figure 3. The other 32 registers are used
by the internal CPU as scratch registers and should not be
accessed by the user.
F3 - Proportional Velocity Control Flag - set by the user
to specify Proportional Velocity control.
F4 - Hold Commutator Flag - set/cleared by the user or
automatically by the Align mode. When set, this flag
inhibits the internal commutator counters to allow
open loop stepping of a motor by using the commutator. (See "Offset register" description in the
"Commutator section.")
F5 - Integral Velocity Control- set by the.user to specify
Integral Velocity Control. Also set and cleared by the
HCTL-l000 during execution of the Trapezoidal Profile mode. This is transparent to the user except
when the Limit flag is set (see "Emergency Flags"
section).
There are several registers which the user must configure
to his application. These configuration registers are discussed in more detail below.
Program Counter (ROSH)
Status Register (R07H)
The Program Counter, which is a write-only register, executes the preprogrammed functions of the controller. The
program counter is used along with the control flags FO,
F3, and F5 in the Flag register (ROOH) to change control
modes. The user can write any of the following four
commands to the Program Counter.
The Status register indicates the status of the HCTL-l000.
Each bit decodes into one signal. All 8 bits are user
readable and are decoded as shown below. Only the lower
4 bits can be written to by the user to configure the HCTL1000. To set or clear any of the lower 4 bits, the user writes
an 8-bit word to R07H. The upper 4 bits are ignored. Each
of the lower 4 bits directly sets/clears the corresponding
bit of the Status register as shown below. For example,
writing XXXX010l to R07H sets the PWM Sign Reversal
Inhibit, sets the Commutator Phase Configuration to "3
Phase", and sets the Commutator Count Configuration to
"full".
OOH - Software Reset
01H -Initialization/Idle mode
02H - Align mode
03H - Control modes; flags FO, F3, and F5 in the Flag
register (ROOH) specify which control mode will be
executed.
The commands written to the Program Counter are discussed in more detail in the section called Operating
Modes and are shown in flowchart form in Figure 4.
Status
Bit
Flag Register (ROOH)
The Flag register contains flags FO thru F5. This register is
also a write-only register. Each flag is set and cleared by
writing an 8-bit data word to ROOH. The upper four bits are
ignored by the HCTL-l000. The bottom three bits specify
the flag address and the fourth bit specifies whether to set
(bit = 1) or clear (bit = 0) the addressed flag.
Bit number
Function
7-4
3
Don't
set/clear
care
2
1
0
A02
AD1
ADO
FO - Trapezoidal Profile Flag - set by the user to execute
Trapezoidal Profile Control. The flag is reset by the
controller when the move is completed. The status
of FO can be monitored at the Profile pin (12) and in
Status register R07H bit 4.
Fl - Initialization/Idle Flag - set/cleared by the HCTL1000 to indicate execution of the Initialization/Idle
mode. The status of Fl can be monitored at the
Initialization/Idle pin (13) and in bit 5 of the Status
register (R07H). The user should not attempt to set
or clear Fl.
4-52
Function
Note
0
PWM Sign Reversal
Inhibit
0= off 1 =on
Discussed in Amplifier
Interface section
under PWM Port
1
Commutator Phase
Configuration
0=3 phase
1 "4 phase
Discussed in
Oommutator section
2
Commutator Count
Configuration
o=quadratu re
1 =: full
Discussed in
Commutator section
3
Should always be set
too
4
Trapezoidal Profile
Flag FO
1 " in Profile Oontrol
5
Initializatlonlldte
Discussed in Operating
Flag F1 1 =in
Mode sectio~~~~~de
Initialization/Idle Mode I nitializalionli
6
Stop Flag
Discussed in
sel (Stop triggered) Emergency Flags
1 = cleared (no Stop)
section
7
Limit Flag
Discussed in
=: set (Limit triggered) Emergency Flags
1'" cleared (no Limit)
section
Discussed in Operating
Mode section under
Trapezoidal Profife
Control
o"
o
I
TABLE I: REGISTER REFERENCE TABLE
Register
(Hel() (Dec)
ROOH
R05H
R07H
RoaH
ROSH
ROtH
RODH
ROEH
ROFH
R12H
R13H
R14H
R18H
R19H
R1AH
R1BH
R1CH
R1FH
R20H
R21H
R22H
R23H
R24H
R26H
R27H
R2aH
R29H
R2AH
R2BH
R34H
R35H
R3CH
User
f1!l'nctlon
Mode Used
Data Typel1]
Flag Regil\tar
~II
All
Program Counter
Status Register
All
a bit Motor '@Cftnmand Port 'All
PWM Motor Command Pori! iAll
Command Position (MSB) All except
Proportional Velocity
R130 Command Position
All except
Prop~tional Velooity
R140 Command Position (LSB)
All exc'ept
Proportional Velocity
R15D Sample Timer
'All
RlaD Aotual Position (MSS)
All
R190 Actual Position
All
R20D Actual Position (LSS)
All
R24D Commutator Ring
All
Rg.?D Commutator Velocity Timer All
R26D X
All
R27D Y Phase Overlap
All
R280 Offset
All
R31D Maximum Phase Advance
All
All except
R32D Filter Zero, A
Proportional Velocity
R33D Filter Pole, B
All except
Proportional Velocity
R34D Gain, K
All
R35D Command Velocity (LSB)
Proportional Velocity
R36D Command Velocity (MSS)
Proportional Velocity
R38D Acceleration (LSS)
Integral Velocity and
Trapezoidal Profile
R39D AcceleratIon (MSB)
I ntegral Velocity and
Trapezoidal Profile
R400 Maximum Velocity
Trapezoidal Profile
R41D Final Position (LSB)
Trapezoidal Proflle
R42D Final Position
Trapezoidal Profile
R430 Final Position (MSB)
Trapezoidal Profile
Proportional Velocity
R52D Actual Velocity (LSS)
R53D Aotual Velocity (MSB)
Proportional Velocity
R60D Command Velocity
Integral Velocity
ROOD
R050
R070
ROaD
R09D
R12D
-
A~ess
w
w
r/w121
Reference
Page~1.1lbber
r/w
"r/w
"r/wI3]
10
10
10, 1a
21
22
15
2's complement
r/w[3)
15
2'$ complement
r/w(3)
15
scalar
2's oomplemEfit
2's complement
2's complement
5calar[6.7)
scalar
scalar(6)
scalad6]
2's complementf7]
scalar[6,71
scalar
w
13
15
15
15
18
19
18
18
18
scalar
r/w
12
scalar
2's complement
2'$ complement
scalar
r/w
r/w
r/w
r/w
12
15
15
15, 16
scalarl 6]
r/w
15,16
scalar(6)
2'5 oomplement
2's complement
2's complement
2's complement
2's oomplement
2'5 complement
r/w
r/w
r/w
16
16
soalar
-
2's oomplem~faOH
2's complemei',
2's complement
rl4)
rf4l/w(5)
r[4)
r/w
w
r/w
r/w
r/w
r/w
r/w
r/w
r
r
r/w
,
19
12
16
16
15
15
15
Noles:
1.
2.
3.
4.
5. Writing to R13H clears Actual Position Counter to zero.
6. The scalar data is limited to positive numbers (OOH to 7FH).
7. The commutator registers (R18H, Rl CH, Rl FH) have further
limits which are discussed in the Commutator section of this
data sheet.
Consult appropriate section for data format and use.
Upper 4 bits are read only.
Writing to ROEH (LSB) latches all 24 bits.
Reading R14H (LSB) latches data into R12H and R13H.
4-53
POSITIOIII PROFILE GENERATION
INTEGRAL
VELOCITV
1127H AceEL Msa
1126H ACCEL LSS
~3CH COMMAND
VELOCITY
TRAPEZOIOAL
PROFILE
R27H ACCEL M58
1126H ACCEL lsa
R2SH MAXIMUM VELOCITY
R2aH FINAL POS Msa
R~AH fiNAL POS
R29H FINAL POS LSD
......
··
,·••
COMMANO VELOCITY
R24HMSS
~3H
COMMAND POSITION
ROCHMSS
ROOH
ROEH LSS
LSB
I
A)\ _o-B----'J
,-----1'
J
CONFIGURATION
,-==""",R",EG:-;I",ST:::Eo:RS=:---l/ . /
::~ ~~~~::::~~TeR r--- "
R07H STATUS FlEGI$TER
+
_
1
iL-- Dfd ~ ~
;r-
I
I
a'BIT PARALLEL
MOTOR COMMANO
PORT
DIGITAL FILTER
~~~~ :
R22HK
I
I
L_--~B
I
ACTUAL VElOCITV
R3SHMSS
R~4H lSS
-I
PWM MOTOR
COMMAND PORT
r - PULSE
...r-- SIGN
I R09HI
I SAMPLE TIMER I
lJ
I
COMMUTATOR PORT
1118H RING
ACTUAL POSITION
r------<~ :;:~ :
R'21-1 MS8
RI3H
I
R14H LSI<
t
A ;; • PROPORTIONAL VELOCITY
CONTROL MODE
B '" • POSITION CONTROL MODE
• INTEGRAL VELOCITY CONTROL MODE
• TRAPEZOIDAL PROFILE MODE
r-- MCo-MC,
L-RO_S_H_ _ _...
L-I
:
:-----------i
'i
I
0-----1
I
I
I
1
I
LQUADRATURE DECODER I
1
r-- PHA-PHD
R leH OFFSET
RlfH MAX ADVANCE
R19H VELOCITV TIMER
JB
Figure 3. Register Block Diagram
Emergency Flags - Stop and Limit
Stop and Limit flags are hardware set flags that signify the
occurrence of an emergency condition and cause the controller to immediately take special action.
The Stop flag affects the HCTL-1000 only in the Integral
Velocity mode. When the Stop flag is set, the system will
come to a decelerated stop and stay in this mode with a
command velocity of zero until the Stop flag is cleared
and a new command velocity is specified.
The Limit flag, when set in any control mode, causes the
HCTL-1000 to go into the Initialization/Idle mode, clearing
the Motor Command and causing an immediate motor
shutdown. When the Limit flag is set, none of the three
control mode flags (FO, F3, or F5) are cleared as the
HCTL-1000 enters the Initialization/Idle mode. The user
should be aware that these flags are still set before commanding the HCTL-1000 to re-enter one of the four control
modes from Initialization/Idle mode. In addition, the user
should note that if the Limit flag is set while the HCTL-1000
is in Trapezoidal Profile Control mode, then BOTH flags FO
AND F5 should be cleared before the HCTL-1000 is commanded to re-enter any of the fou r control modes from
Initialization/Idle mode.
Stop and Limit flags are set by a low level input at their
respective pins (15, 14). The flags can only be cleared
when the input to the corresponding pin goes high, signifying that the emergency condition has been corrected,
AND a write to the Status register (R07H) is executed.
That is, after the emergency pi n has been set and cleared,
the flag also must be cleared by writing to R07H. Any
word that is written to R07H after the emergency pin is set
and cleared will clear the emergency flag, but the lower 4
bits of that word will also reconfigure the Status register.
Digital Filter (R22H, R20H, R21 H)
All control modes use some part of the programmable digital filter D(z) to compensate for closed loop system stability. The compensation D(z) has the form:
4-54
K(Z-~)
D(z) =
256
---=-4 (z+lL)
256
[1)
where:
z = the digital domain operator
K = digital filter gain (R22H)
A = digital filter zero (R20H)
B = digital filter pole (R21 H)
- - - - - - _ . - - _ . _ - - - _ . _.....
The compensation is a first-order lead filter which in
combination with the Sample Timer T(ROFH) affects the
dynamic step response and stability of the control system.
The Sample Timer, T, determines the rate at which the
control algorithm gets executed. All parameters, A, S, K,
and T, are 8-bit scalars that can be changed by the user
any time.
The digital filter uses previously sampled data to calculate
D(z). This old internally sampled data is cleared when the
Initialization/ldle mode is executed.
In Position Control, Integral Velocity Control, and Trapezoidal Profile Control the digital filter is implemented in
the time domain as shown below:
MC n = (K/4)(Xn) - [(N256)(K/4)(X n_1 ) + (S/256)(MC n.1)] [2]
where:
n = current sample time
n-1 = previous sample time
MC n = Motor Command Output at n
MC n-1 = Motor Command Output at n-1
Xn = (Command Position - Actual Position) at n
Xn.1 = (Command Position - Actual Position) at n-1
Velocities are specified to the HCTL-1000 in terms of
quadrature encoder counts per sample time. In the Trapezoidal Profile and Integral Velocity Control modes, the
minimum velocity which may be specified is one encoder
count per sample time. The Proportional Velocity Control
mode, allows a minimum velocity of 1 encoder count per
16 sample times to be specified. To achieve the slowest
velocities possible, the sample times for the HCTL-1000
must be made as slow as possible.
For more information on system sampling times, bandwidth,
and stability, please consult Hewlett-Packard Application
Note 1032, "Design of the HCTL-1000's Digital Filter
Parameters by the Combination Method."
OPERATING MODES
- Reset
- Initialization/ldle
-Align.
[3]
where:
Yn = (Command Velocity - Actual Velocity) at n
The four control modes available to the user include:
-
Position Control
Proportional Velocity Control
Trapezoidal Profile Control
I ntegral Velocity Control
The HCTL-1000 switches from one mode to another as a
result of one of the following three mechanisms:
Sample Timer Register (ROFH)
The contents of this register set the sampling period of the
HCTL-1000. The sampling period is:
t = 16(T+1 )(lIfrequency of the external clock)
[4]
where: T = register ROFH
The Sample Timer has a limit on the minimum allowable
sample time depending on the control mode being executed.
The limits are given below:
ROFH Contents
Minimum Limit
Position Control
Proportional Velocity Control
Trapezoidal Profile Control
Integral Velocity Control
.
The HCTL-1000 executes anyone of 3 set up routines or 4
control modes selected by the user. The 3 set up routines
include:
In Proportional Velocity control the digital compensation
filter is implemented in the time domain as:
MC n = (K/4)(Y n)
__
07H
07H
OFH
OFH
1. The user writes to the Program Counter.
2. The user sets/clears flags FO, F3, or F5 by writing to the
Flag register (ROOH).
3. The controller switches automatically when certain initial
conditions are provided by the user.
This section describes the function of each set up routine
and control mode and the initial conditions which must be
provided by the user to switch from one mode to another.
Figure 4 shows a flowchart of the set up routines and
control modes, and shows the commands required to switch
from one mode to another.
Set Up Routines
(070)
(070)
(150)
(150)
1. RESET
The Reset mode is entered under all conditions by either
executing a hard reset (Reset pin goes low) or a soft reset
(write OOH to the Program Counter, R05H).
The maximum value of T (ROFH) is FFH (2550). With a 2
MHz clock, the sample time can vary from 64 !,sec to 2048
!,sec. With a 1MHz clock, the sample time can vary from
128 !,sec to 4096 !,sec.
Digital closed-loop systems with slow sampling times have
lower stability and a lower bandwidth than similar systems
with faster sampling times. To keep the system stability
and bandwidth as high as possible the HCTL-1000 should
typically be programmed with the fastest sampling time
possible.
The exception to this rule occurs when the user would like
to use the HCTL-1000 to control a motor with an encoder
at very slow velocities.
When a hard reset is executed, the following conditions
occur:
- All output signal pins are held low except Sign (17).
Databus (2-9). and Motor Command (18-25).
- All flags (FO to F5) are cleared.
- The Pulse pin of the PWM port is set low while the Reset
pin is held low. After the Reset pin is released (goes high)
the Pulse pin goes high for one cycle of the external clock
driving the HCTL-1000. The Pulse pin then returns to a low
output.
- The Motor Command port (R08H) is preset to 80H.
(1280)
- The Commutator logic is cleared.
- The 1/0 control logic is cleared.
- A soft reset is automatically executed.
4-55
When a soft reset is executed, the following conditions
occur:
- The digital filter parameters are preset to
A (R20H) = ESH (229D)
8 (R21 H) = K (R22H) = 40H (64D)
- The Sample Timer (ROFH) is preset to 40H. (64D)
- The Status register (R07H) is cleared.
- The Actual Position Counters (R12H, R13H, R14H) are
cleared to O.
From Reset mode, the HCTL-1000 goes automatically to
Initialization/Idle mode.
RESET PIN
LOW
2. INITIALIZATION/IDLE
The Initialization/Idle mode is entered either automatically
from Reset, by writing 01 H to the Program Counter (ROSH)
under' any conditions, or pulling the Limit pin low.
In .the Initialization/Idle mode, the following occur:
- The Initialization/Idle flag (F1) is set.
- The PWM port R09H is set to OOH (zero command).
- The Motor Command port (R08H) is set to 80H (128D)
(zero command).
- Previously sampled data stored in the digital filter is
cleared.
It is at this point that the user should pre-program all the
necessary registers needed to execute the desired control
mode. The HCTL-1000 stays in this mode (idling) until a
new mode command is given.
WRITE DOH
TO ROSH
3. ALIGN
WRITE 01H
TO ROSH
WRITE 03H
TO ROSH
SET/CLEAR FO, F3,OR FS*
FO
TRAI'EZOIOAL
PROFIL'
(CoNTROLLER CLEARS
. FOAT TH£ END
OF THE MoV1!.!
F3
PROPORTioNAL
VELOCITY
CoNTROL
FS
INTEGRAL
VE~QCITY
CONTROL
POSITION
CONTROL
The Align mode is executed only when using the commutator feature of the HCTL-1000. This mode automatically
aligns multiphase motors to the HCTL-1000's internal
Commutator.
The Align mode can be entered only from the Initialization/
Idle mode by writing 02H to the Program Counter register
(ROSH). 8efore attempting to enter the Align mode, the
user should clear all control mode flags and set both the
Command Position registers (ROCH, RODH, and ROEH)
and the Actual Position registers (R12H, R13H, and R14H)
to zero. After the Align mode has been executed, the
HCTL-1000 will automatically enter the Position Control
mode and go to position zero. 8y following this procedure,
the largest movement in the Align mode will be 1 torque
cycle of the motor.
The Align mode assumes: the encoder index pulse has
been physically aligned to the last motor phase during
encoder/motor assembly, the Commutator parameters have
been correctly preprogrammed (see the section called The
Commutator for details), and a hard reset has been executed while the motor is stationary.
The Align mode first disables the Commutator and with
open loop control enables the first phase (PHA) and then
the last phase (PHC or PHD) to orient the motor on the
last phase torque detent. Each phase is energized for 2048
system sampling periods (t). For proper operation, the
motor must come to a complete stop during the last phase
enable. At this point the Commutator is enabled and
commutation is closed loop.
The HCTL-1000 then switches automatically from the Align
mode to Position Control mode.
Control Modes
'Only one flag can be set at a time.
Figure 4. Operating Mode Flowchart
Control flags FO, F3, and FS in the Flag register (ROOH)
determine which control mode is executed. Only one
control flag can be set at a time. After one of these control
flags is set, the control modes are entered either automatically from Align or from the Initialization/Idle mode by
writing 03H to the Program Counter (ROSH).
4-56
1. POSITION CONTROL
FO, F3, FS cleared.
Position Control performs point-to-point position moves
with no velocity profiling. The user specifies a 24-bit
position command, which the controller compares to the
24-bit actual position. The position error is calcuated, the
full digital lead compensation is applied and the motor
command is output.
The controller will remain position-locked at a destination
until a new position command is given.
The actual and command position data is 24-bit two'scomplement data stored in six 8-bit registers. Position is
measured in encoder quadrature counts.
The command position resides in ROCH (MSB), ROOH,
ROEH (LSB). Writing to ROEH latches all 24 bits at once
for the control algorithm. Therefore, the command position
is written in the sequence ROCH, ROOH and ROEH. The
command registers can be read in any desired order.
Because the Command Velocity registers (R24H and R23H)
are internally interpreted by the HCTL-1000 as 12 bits of
integer and 4 bits of fraction, the host processor must
multiply the desired command velocity (in quadrature
counts/sample time) by 16 before programming it into the
HCTL-1000's Command Velocity registers.
The actual velocity is computed only in this algorithm and
stored in scratch registers R35H (MSB) and R34H (LSB).
There is no fractional component in the actual velocity
registers and they can be read in any order.
The controller tracks the command velocity continuously
until new mode command is given. The system behavior
after a new velocity command is governed only by the
system dynamics until a steady state velocity is reached.
The actual position resides in R12H (MSB), R13H, and
R14H (LSB). Reading R14H latches the upper two bytes
into an internal buffer. Therefore, Actual Position registers
are read in the order of R14H, R13H, and R12H for correct
instantaneous position data. The Actual Position registers
cannot be written to, but they can all be cleared to 0
simultaneously by a write to register R13H.
The largest position move possible in Position Control
mode is 7FFFFFH (8,388,6070) quadrature encoder counts.
3. INTEGRAL VELOCITY CONTROL
FS set
Integral Velocity Control performs continuous velocity profiling which is specified by a command velocity and command acceleration. Figure 5 shows the capability of this
control algorithm.
The user can change velocity and acceleration any time to
continuously profile velocity in time. Once the specified
velocity is reached, the HCTL-1000 will maintain that
velocity until a new command is specified. Changes between
actual velocities occur at the presently specified linear
acceleration.
F3 set
The command velocity is an 8-bit two's-complement word
stored in R3CH. The units of velocity are quadrature
counts/sample time.
Proportional Velocity Control performs control of motor
speed using only the gain factor, K, for compensation. The
dynamic pole and zero lead compensation are not used.
(See the "Digital Filter" section of this data sheet.)
The conversion from rpm to quadrature counts/sample
time is shown in equation 5. The Command Velocity
register (R3CH) contains only integer data and has no
fractional component.
The command and actual velocity are 16-bit two's-complement words.
While the overall range of the velocity command is 8 bits,
two's-complement, the difference between any two sequential commands cannot be greater than 7 bits in magnitude (i.e., 127 decimal). For example, when the HCTL-1000
is executing a command velocity of 40H (+640), the next
velocity command must fall in the range of 7FH (+1270),
the maximum command range, to C1H (-630), the largest
allowed difference.
2. PROPORTIONAL VELOCITY CONTROL
The command velocity resides in registers R24H (MSB)
and R23H (LSB). These registers are unlatched which
means that the command velocity will change to a new
velocity as soon as the value in either R23H or R24H is
changed. The registers can be read or written to in any
order.
R24H
IIII IIII
The command acceleration is a 16-bit scalar word stored
in R27H and R26H. The upper byte (R27H) is the integer
part and the lower byte (R26H) is the fractional part
R23H
IIII.FFFF
COMMAND VELOCITY FORMAT
The units of velocity are quadrature counts/sample time.
To convert from rpm to quadrature counts/sample time,
use the formula shown below:
Vq = (Vr)(N)(t)(0.01667/rpm-sec)
[5]
Where:
Vq =velocity in quadrature counts/sample time
Vr = velocity in rpm
N = 4 times the number of slots in the codewheel
(i.e., quadrature counts).
t = The HCTL-1000 sample time in seconds. (See the
section on the HCTL-1000's Sample Timer register).
4-57
(2)
CD
USER CHANGES ACCELERATION COMMAND
USER CHANGES VELOCITY COMMAND
Figure 5. Inlegral Velocily Mode
provided for resolution. The integer part has a range of
OOH to 7FH, The contents of R26H are internally divided
by 256 to produce the fractional resolution.
~
VELOCITY
_ _ _ _ _. - - MAXIMUM VELOCITY
USEVkeEL
..-
FO SET
BY
AC~
~~
._-- "\rCTl-1000
CLEARED BY
L----~----~T~R~A~PE~Z~O~ID~A~L----~~-----t
R27H
R26H
OIllIIII FFFFFFFF/256
-+--- MAXIMUM VELOCITY
COMMAND ACCELERATION FORMAT
VELOCITY
FOSE~ACCEL
BY USEr
t
FOClEARED BY
H TL-1000
•t
r
L-____~~------~------~~---_t
The units of acceleration are quadrature counts/sample
time squared.
TRIANGULAR
To convert from rpm/sec to quadrature counts/[sample
time]2, use the formula shown below:
Aq = (Ar)(N)(t2)(0.01667/rpm-sec)
ACCEL
1/2 WAY TO
FINAL POSITION
FINAL POSITION
Figure 6. Trapezoidal Profile Mode
[6]
4. TRAPEZOIDAL PROFILE CONTROL
Where:
Aq = Acceleration in quadrature counts/[sample timej2
Ar = Acceleration in rpm/sec
N = 4 times the number of slots in the codewheel (i.e.,
quadrature counts)
t = The HCTL-1000 sample time in seconds. (See the
section on the HCTL-1000's Sample Timer register).
FO-Set
Trapezoidal Profile Control performs point-to-point position
moves and profiles the velocity trajectory to a trapezoid or
triangle. The user specifies only the desired final position,
acceleration and maximum velocity. The controller computes
the necessary profile to conform to the command data. If
maximum velocity is reached before the distance halfway
point, the profile will be trapeZOidal, otherwise the profile
will be triangular. Figure 6 shows the possible trajectories
with Trapezoidal Profile control.
Because the Command Acceleration registers (R27H and
R26H) are internally interpreted by the HCTL-1000 as 8
bits of integer and 8 bits of fraction, the host processor
must multiply the desired command acceleration (in quadrature counts/[sample timej2) by 256 before programming
it into the HCTL-1000's Command Acceleration registers.
Internally, the controller performs velocity profiling through
position control.
Each sample time, the internal profile generator uses the
information which the user has programmed into the Command Velocity register (R3CH) and the Command Acceleration registers (R27H and R26H) to determine the value
which will be automatically loaded into the Command
Position registers (ROCH, RODH, and ROEH). After the new
command position has been generated, the difference
between the value in the Actual Position registers (R12H,
R13H, and R14H) and the new value in the Command
Position registers is calculated as the new position error.
This new position error is used by the full digital compensation filter to compute a new motor command output for
this sample time. The register block diagram in Figure 3
further shows how the internal profile generator works in
Integral Velocity mode. In control theory terms, integral
compensation has been added and therefore, this system
has zero steady-state error.
Although Integral Velocity Control mode has the advantage
over Proportional Velocity mode of zero steady state velocity
error, its disadvantage is that the closed loop stability is
more difficult to achieve. In Integral Velocity Control mode,
the system is actually a position control system and therefore the complete dynamic compensation D(z} is used.
If the external Stop flag F6 is set during this mode
signaling an emergency situation, the controller automatiically decelerates to zero velocity at the presently specified
acceleration factor and stays in this condition until the flag
is cleared. The user then can specify new velocity profiling
data.
The command data for Trapezoidal Profile Control mode
consists of a final position, a command acceleration, and a
maximum velocity. The 24-bit, two's-complement final position is written to registers R2BH, (MSB), R2AH, and R29H
(LSB). The 16-bit command acceleration resides in registers
R27H (MSB) and R26H (LSB). The command acceleration
has the same integer and fraction format as discussed in
the Integral Velocity Control mode section. The 7-bit maximum velocity is a scalar value with the range of OOH to
7FH (OD to 127D). The maximum velocity has the units of
quadrature counts per sample time, and resides in register
R28H. The command data registers may be read or written
to in any order.
The internal profile generator produces a position profile
using the present Command Position (ROCH-ROEH) as the
starting point and the Final Position (R2BH-R29H) as the
end point.
Once the desired data is entered, the user sets flag FO in
the Flag register (ROOH) to commence motion (if the HCTL-1000
is already in Position Control mode).
When the profile generator sends the last pOSition command
to the Command Position registers to complete the trapezoidal move, the controller clears flag FO. The HCTL-1000
then automatically goes to Position Control mode with the
final pOSition of the' trapezoidal move as the command
pOSition.
When the HCTL-1000 clears flag FO it does NOT indicate
that the motor and encoder are at the final pOSition NOR
that the motor and encoder have stopped. The motor and
encoder's true position can only be determined by reading
the Actual Position registers. The only Way to determine if
the motor 'and encoder have stopped is to read the Actual
Position registers at successive intervals.
4-58
The status of the Profile flag can be monitored both in the
Status register (R07) and at the external Profile pin (pin
12) at any time. While the Profile flag is high NO new
command data should be sent to the controller.
Each sample time, the internal profile generator uses the
information which the user has programmed into the Maximum Velocity register (R28H), the Command Acceleration
registers (R27H and R26H), and the Final Position registers
(R2BH, R2AH, and R29H) to determine the value which
will be automatically loaded into the Command Position
registers (ROEH, RODH, and ROCH). After the new command
position has been generated, the difference between the
value in the Actual Position registers (R12H, R13H, and
R14H) and the new value in the Command Position registers
is calculated as the new position error. This new position
error is used by the full digital compensation filter to
compute a new motor cor:nmand ouput for the sample
time. (The register block diagram in Figure 3 further shows
how the internal profile generator works in Trapezoidal
Profile mode.)
--POSITIVE DIRECT1QN_
1 _ 1 1 - - - - - - - - 1 MOTOR REVOLUTION
----PHA
-------PHB
---PHC
-----PHO
-------1
EXAMPLE: 4 PHASE, 2 POLE MOTOR
POSITION ENCODER INDEX PULSE AT POINTS
CD OR@
COMMUTATOR
The commutator is a digital state machine that is configured by the user to properly select the phase sequence
for electronic commutation of multi phase motors. The
Commutator is designed to work with 2, 3, and 4-phase
motors of various winding configurations and with various
encoder counts. Along with providing the correct phase
enable sequence, the Commutator provides programmable
phase overlap, phase advance, and phase offset.
Figure 7. Index Pulse Alignment to Molor Torque Curves
CHANNEL A & B DETECTORS
INDEX PULSE
DETECTOR
Phase overlap is used for better torque ripple control. It can
also be used to generate unique state sequences which can
be further decoded externally to drive more complex amplifiers and motors.
Phase advance allows the user to compensate for the frequency characteristics of the motor/amplifier combination.
By advancing the phase enable command (in position),
the delay in reaction of the motor/amplifier combination
can be offset and higher performance can be achieved.
Phase offset is used to adjust the alignment of the commutator output with the motor torque curves. By correctly
aligning the HCTL-1000's commutator output with the motor's
torque curves, maximum motor output torque can be
achieved.
ENCODER
CODEWHEEL
Figure 8. Codewheellndex Pulse Alignment
The inputs to the Commutator are the three encoder
signals, Channel A, Channel B, and Index, and the configuration data stored in registers.
The Commutator uses both channels and the index pulse
of an incremental encoder. The index pulse of the encoder
must be physically aligned to a known torque curve location
because it is used as the reference point of the rotor
position with respect to the Commutator phase enables.
The index pulse should be permanently aligned during
motor encoder assembly to the last motor phase. This is
done by energizing the last phase of the motor during
assembly and permanently attaching the encoder codewheel to the motor shaft such that the index pulse is active
as shown in Figures 7 and 8. Fine tuning of alignment for
commutation purposes is done electronically by the Offset
register (R1 CH) once the complete control system is set
up.
4-59
SIGN
PWM
PULSE
A
HeTl·1OO
TTL OUTPUT
PHA
TO POWER
AMPLIFIERS
PHB
COMMUTATOR
PHe
PHD
0
Figure 9. PWM Interface to Brushless DC Motors
3 PHASE
Each time an index pulse occurs, the internal commutator
ring counter is reset to O. The ring counter keeps track of
the current position of the rotor based on the encoder
feedback. When ttie ring counter is reset to 0, the Commutator is reset to its origin (last phase going low, phase A
going high) as shown in Figure 10.
ENCODER: 90 COUNTS/REVOLUTION
FULL COUNTS
RING' 9
CASE
X
V
,
2
3
4
OCCURS AT
3
0
2
1
2
2
THE ORIGIN
1
1
0
0
2
2
0
0
0
1
51s
7
OFFSET
ADVANCE
The output of the Commutator is available as PHA, PHB,
PHC, and PHD on pins 26-29. The HCTL-1000's commutator
acts as the electrical equivalent of the mechanical brushes
in a motor. Therefore, the outputs of the commutator
provide only proper phase sequencing for bidirectional
operation. The magnitude information is provided to the
motor via the Motor Command and PWM ports. The outputs
of the commutator must be combined with the outputs of
one of the motor ports to provide proper DC brush less
and stepper motor control. Figure 9 shows an example of
circuitry which uses the outputs of the commutator with
the Pulse output of the PWM port to control a DC brush less
or stepper motor. A similar procedure could be used to
combine the commutator outputs PHA-PHD with a linear
amplifier interface output (Figure 15) to create a linear
amplifier system.
OUTPUT VOLTAGE
INDEX
PULSE
COUNTS
,
(INPUT)
8485 8S{S7 88 89tO
1
213
4
8! 91011
I
PHA
r--x--l
0
~
I
PHC
I
I
IX!
~RING(1)~
:
CD
PHA
Iv
x Iv
PHC
PHA
1. STATUS REGISTER (R07H)
0
vi
OFFSE:~
Ivl x Iv
PHe
PHA
: I--
PHe
I
0
xlvi
I v I xlvi
RINGI1II
1·1
I
I
IvI x Iv
Jv
PHB
Bit #2 only affects the commutator's counting method.
This includes the Ring register (R18H), the X and Y registers
(R1 AH & R1 BH), the Offset register (R1 CH), the Velocity
Timer register (R19H), and the Maximum Advance register
(R1FH).
,
Iv I x Iv
Ivl x Iv
Iv I x Iv I
I
--+RINGII't-------l
I
I
I
I
I
I v I x Iv I
I vi x vi
PHB
Bit #1 -0 = 3-phase configuration, PH A, PHB, and PHC are
active outputs.
1 = 4-phase configuration, PHA - PHD are active
outputs.
Bit #2 - 0 = Rotor position measured in quadrature counts
(4x decoding).
1 = Rotor position measured in full counts
(1 count = i codewheel bar and space.)
I
I
Lvi x I vi
Commutation Configuration Registers
The Commutator is programmed by the data in the following
registers. Figure 10 shows an example of the relationship
between all the parameters.
.r>"-----------
CK
12BIT
BINARVCTR
12BIT
lATCH
4X
DECODE
lOGIC
CHA
CNT
CNT
00·07
12
Qll
UP/ON
CHANNEL
B
00-
UP/ON
CK
ClR
Do-011
CK
ClR
SE.l
INH
DE
CH B-I'!>-+-4
INHIBIT
r---------------,
INHIBIT lOGIC
SEl------+_-~~-------r_----~------------+_--~
~------~-~+_--------~+_--------+_----------------------_r-------J
Figure 6. Simplified Logic Diagram
straint derives from the operation of the input filters. It
relates the maximum clock period to the minimum encoder
pulse width. The second constraint derives from the decoder operation and is covered in the "Quadrature Decoder"
section. It relates the maximum clock period to the minimum encoder state width (Tes).
DIGITAL FILTER
The digital filter section is responsible for rejecting noise
on incoming quadrature signals. Schmitt-trigger conditioning addresses the problems of slow rise and fall times and
low level noise. The major task of the filter is to deal with
short-duration noise pulses that cause the input logic level
to momentarily change. Due to the nature of quadrature
decoding, noise pulses on one channel will not cause a
count error, but the coincidence of two overlapping noise
pulses, one on each input, can cause illegal state transitions. False counts of undetermined direction will result
from the decoding of these illegal transitions (see Fig. 8).
A pair of filters rejects these noise pulses by sampling the
CHA and CHB logiC levels and storing a time history in a
pair of shift registers. For each channel, if the input level
has had the same value on three consecutive riSing clock
edges, that val ue becomes the new output of the filter; otherwise the output is unchanged. This means that the CHA
filter output cannot change from high to low until the CHA
input has been low for three consecutive rising clock
edges. CHB is treated the same as CHA.
The operation of this digital filter section places one of two
timing constraints on the minimum clock frequency in relationship to the encoder count frequency. The first con-
The explanation of constrai nt one above is as follows: It
takes a minimum of four positive clock transitions for a
new logic level on either CHA or CHB to propagate through
their respective filters, but the signal only needs to be stable for tliree consecutive rising clock edges (See Figure 7).
This means that the minimum encoder pulse width (Te) on
each channel must be;:: 3TCLK, where TCLK is the period
of the clock.
In the presence of noise, the filter will require that 3TCLK
be less than T e, since noise pulses will interrupt the required
three consecutive constant level samples necessary for the
filter to accept a new input level. In general, the types of
noise that this filter will deal with will derive from the rotating system, i.e., motor noise, capacitively coupled level
changes from other encoder channels, etc. As such, these
noise sources will be periodic in nature and proportional to
the encoder frequency. Design for noise of this type is discussed later in the "Filter Optimization" section.
4-72
ClK
CHA~
I
r---T·-----;:::I.=-;:T-:-:::es~~=·==;'-T.=====1
I.
r-
I
CHB_------!I
T.--~·o+ol·~--T.-----I·I
Figure 7. Minimum Encoder Pulse Width with Respect to TelK
In addition to problems with noise, other common signal
problems enter into the determination of the maximum
TClK for each application. The following quadrature signal
aberrations can all be accounted for by designing with
short enough TClK to accommodate the reduction of the
effective encoder pulse width:
1) non-ideal encoder rise and fall times,
2) asymmetric pulses,
3) short « 180 electrical degrees) pulses.
The combination of the following two errors must be examined in light of the minimum state width constraint to
ensure proper operation of the decoder section:
1) Phase shift deviations from 90 electrical degrees
between the CHA and CHB signals;
2) Pulse width errors resulting in Te shorter than 180
electrical degrees in either or both CHA and CHB.
Design for these conditions is discussed in the "Filter
Optimization" section.
Designing for these non-ideal signals is discussed later in
the "Filter Optimization" section.
COUNT Up
~
,
QUADRATURE DECODER
The Quadrature Decoder section samples the outputs from
the CHA and CHB filters. Sampling occurs on the rising
clock edge. The Decoder Section observes changes in
these outputs, and, on the rising clock edge, it outputs two
signals to the position counter. These signals specify when
to count and in which direction (up or down).
Encoder state changes are detected by comparing the previous sampled state to the current sampled state. If the two
are different, the counter section is signaled to count on
the next rising clock edge. Count direction (up or down) is
also determined by observing the previous and current
states, as shown in the quadrature state transition diagram
(figure 8). An illegal state transition, caused by a faulty
encoder or noises severe enough to pass the filter, will produce a count but in an undefined direction.
The second constraint on the relationship between TCLK
and the input quadrature signal, as previously mentioned in
the "Digital Filter" section, is the requirement by the 4x
decoder for at least one positive clock transition to occur
during each quadrature state to detect the state. This constraint is satisfied if: Tes > TClK, where Tes is the time
interval corresponding to the shortest state width at the
maximum system velocity.
4-73
3
,,~
,
,
CHA
eKS
0
,
STATE
2
0
,
3
0
0
4
1
Figure 8. Elements of 4x Quadrature Decoding
POSITION COUNTER
This section consists of a 12-bit binary up/down counter
which counts on rising clock edges as specified by the
Quadrature Decode Section. All twelve bits of data are
passed to the position data latch. The system can use this
count data in three ways:
A. System total range is :512 bits, so the count represents
"absolute" position.
B. The system is cyclic with :512 bits of count per cycle,
RST is used to reset the counter every cycle, and the
system uses the data to interpolate within the cycle.
C. System count is >12 bits, so the count data is used as a
relative or incremental position input for a system computation of absolute position.
In case C above, counter rollover occurs. In order to prevent loss of position information, the processor must read
the outputs of the HCTL-2000 at intervals shorter than 512
times the minimum encoder line period. This minimum line
period (Tel p) corresponds to the maximum encoder velocity of the design. Two's complement arithmetic is normally
used to compute position from these periodic position
updates.
POSITION DATA LATCH
This section is a 12-bit latch which captures the position
counter output data on each rising clock edge, except when
its inputs are disabled by the inhibit logic section during
two-byte read operations. The output data is passed to the
bus interface section. The latch is cleared asynchronously
by the RST signal. When active, a signal from the inhibit
logic section prevents new data from being captured by the
latch, keeping the data stable while successive byte-reads
are made through the bus interface section.
of the position data latch output. Since the latch is only
twelve bits wide, the upper four bits of the high byte are
internally set to zero. The SEL and OE signals determine
which byte is output and whether or not the output bus is
in the high-Z state, respectively.
INHIBIT LOGIC
The Inhibit Logic Section samples the OE and SEL signals
on the falling edge of the clock and, in response to certain
conditions (see Figure 9 below), inhibits the position data
latch. The RST signal asynchronously clears the inhibit
logic, enabling the latch.
sTEP SEL
t
L
.2
tI
ACTION
'SET"INtlIBIT, READ HI Tesmin and Tmn < 2T CLK. This noise can
be subdivided into four categories, each having different
design constraints. These categories are differentiated by
the pulse width of noise on the individual encoder channels.
T nl = The fundamental period characteristic of a periodic noise source
T CLK = Period of HCTL-2000 clock input
signal
T mn = Maximum pulse duration of
encoder noise
Temin = Te(min) = Minimum encoder line
pulse width including encoder
errors
Tesmin = Tes(min) = Minimum encoder
statewidth including encoder
errors
Telpmin = Period of maximum designed
encoder line frequency
RPM = Maximum designed operating
speed of the encoder in revolutions
per minute
N = Encoder line count
= Number of encoder counts per
revolution
Kl = 60 sec.!min.
Dependant channel noise, as below in case Band C in
Table 6, is noise where the superposition of noise from
both encoder channels does not display a period shorter
than the minimum state width:
T nl > Tesmin.
The graphic analYSis of the effect of this type of noise
upon the filter operation is illustrated in Figure 11.
Tmn 4* (TcLKI
ENCODING ERRORS
Design for quadrature signal errors proceeds as follows for
an ideal quadrature signal, i.e. all errors = 0:
Tel p = 360 0 e = defined as one electrical
cycle in electrical degrees
Te = 1/2Telp = 1800 e ideal pulse
width
Tes = 1/4Telp = 1/2 Te = 90 0 e, ideal
state width
(1 )
(2)
(3)
In a real system there are quadrature signal errors, where
these errors are:
IlP = Maximum encoder pulse width
error in ° e, as a deviation from the
ideal pulse width of 180° e
*Signal after Internal Input Filter
Figure 11. Noise is Encoder Channel Dependent
Independant channel noise, as in case D and E in Table
6, is such that the noise on each channel is independant
of the noise on the other channel. The period 01 the
noise on each channel must satisfy the condition:
IlS = Maximum state width error in °e, as
a deviation from the ideal state
width of 900 e
The worst cases for pulse width and state width errors in
terms of time intervals will occur at the maximum designed
system operating velocity. These errors are typically available from encoder manufacturer's data sheets.
4-75
Tnl> Tesmin
independantly. The graphic analysis of the effect of this
type of noise on the filter operation is illustrated in Figure 12.
Tmn 4* (TCLK)
FILTER DESIGN EXAMPLES
Given the above rules, we can calculate the design parameters for a typical high performance motor loop as follows:
Where RPM = 3600 rev/min.
N = 1000 counts/rev.
AP=±48°e
AS=±600e
at 60° C, 11Telpmin = 60kHz
Then the following calculation accounts for signal errors:
K1
(RPMIIN)
Teipmin = (
60
from eq. 4
(3600)11000)
= 16667 ns
Temin=
(
= (
·Signal after Internal Input Filter
Figure 12. Noise Is Encoder Channel Independent
18o-IAPI
360
) Telpmin
180-48
360
) 116667 ns)
from eq. 5
= 6111 ns
The set of design rules that are presented in Table 6 can be
derived by examination of Figures 11 and 12, and the following constraints:
Tesmln=
a)The encoder output signals must stay at a logic level
for a minimum of three consecutive clock -pulses before
the HCTL-2000 recognizes the logic level change:
Temin > 3TCLK·
(
= (
90-IASI
360
) Telpmin
90-60
360
) 116667 nSf
from eq. 6
= 1389 ns
If the noise is as in case B of Table 6, we can use the above
to evaluate the system.
b)After acceptance by the HCTL-2000 input filtering section, a state must exist for a minimum of TCLK to be
recognized by the internal logic.
For the condition of noise such that T mn <: 260 ns:
TCLK> 260 ns
c)The minimum encoded pulse width must be greater
than twice the minimum state width: Temin > 2Tesm in.
255 ns:5 T CLK <. T esmin
4
d)The minimum clock period must be greater than 255
ns, which is the minimum clock period for which the
HCTL-2000 is -guaranteed to operate over the entire
specified operating temperature range.
Tesml n=
4
1389 =347 ns
4
Thus,
255 ns:5 T CLK <: 347 ns
Similar calculations can be performed to design the filter
for the specifics of each system.
-l
Table 6. Summary of Filter Design Rules for the HCTL-2000
case
Nolle
Relationship
Pulse Width
Clock Period
Constraint
DealS" Criteria
Temin > 2Tesmln
Tclk <: Te5min
255ns::;; Tclk <: (1/3)Temin
TClk>Tmn>O
2550$::;; Tclk <: (1/4)Tesm in
General
Conditions
A
No noise on
CHAorCHS
S
Superposition of noise
on CHAor CHS
Tesmln>Tnl
T emln > 2Te8min ..
C
Superposition of noise
on CHAor CHB
T esrnin > Tnf
T emin > 2Tesmln
2Tclk> Tmn<::Tclk
D
Noise on CHA or
on CHS Indepencklnt
of each other
Tesmin> Tnf
Temin > 2Tesmin
TClk> Tmn >'0
255ns::;; TcIk <. (115)Tesml n
E
Noise on CHA or
on CHS Independent
of each other
Te8min >Tnf
T emln > 2Tesmin
2Tclk > T mn <:: Telk
2550$::;; Telk <: (1n)Tesmln
4-76
I
255ns::;;Tolk<:(115)Tesm in
Interfacing the HCTL-2000:
General
The 12 bit latch and inhibit logic on the HCTL-2000 allows
access to 12 bits of count with an 8 bit bus. When only 8
bits of count are required, a simple 8 bit (1 byte) mode is
available by holding SEL high continously. This disables
the inhibit logic. OE provides control of the tri-state bus,
and read timing is per Figures 3 and 4.
The internal inhibit logic on HCTL-2000 inhibits the transfer
of data from the counter to the position data latch during
the time that the latch outputs are being read. The inhibit
logic allows the microprocessor to first read the high order
4 bits from the latch and then read the low order 8 bits
from the latch. Meanwhile, the counter can continue to
keep track of the quadrature states from the CHA and CHB
input signals.
For proper operation of the inhibit logic during a two-byte
read, OE and SEL must be synchronous with CLK due to
the falling edge sampling of OE and SEL.
Figure 10 shows a logic diagram of the inhibit logic circuit.
The operation of the circuitry is illustrated in the read timing shown in Figure 13.
CLK
JlfLfL~J1Jl-fl-fLJUl-fLf
I
I
I
I
I
I
I
I
SEL
DE
I
I
I
I
I
I
I
I
I
I
INHIBIT
SIGNAL
DATA
LINES
POSITION
LATCH
ACTIONS
I
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I
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I
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I
I
i
'~
I
'I
I.
I
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/
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u
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r II I
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II I
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II
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_'L
\'
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I W--~ow
I
TRI STATE
HIGH BYTE
I I BYTE
I
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I I
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/
"
II
II
II
I
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II
/
I I
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I NEW NEW I NEW
lyNEW
DATA UNCHANGED
DATA
I
DATA
I DATA DATA I
I
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('
,
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o
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!
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cbcb
II
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/
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TRI STATE
I
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Figure 13. Inlernallnhlbil Logic Timing
ACTIONS
1. On the rising edge of the clock, counter data is transferred to the position data latch, provided the inhibit
signal is low.
2. When OE goes low, the outputs of the multiplexer are
enabled onto the data lines. If SEL is low, then the high
order data bytes are enabled onto the data lines. If SEL
is high, then the low order data bytes are enabled onto
the data lines.
3. When the HCTL-2000 detects a low on OE and SEL during a falling clock edge, the internal inhibit signal is
activated. This blocks new data from being transferred
from the counter to the position data latCh.
4. When SEL goes high, the data outputs change from
high byte to low byte.
5. The first reset condition for the inhibit logic is met when
the HCTL-2000 detects a logic high on SEL and a logic
low on OE during a falling clock edge.
6. When OE goes high, the data lines change to a high
impedance state.
7. To complete the reset of the inhibit logic, after the first
reset condition has been met, the HCTL-2000 needs to
detect a logic high on OE during a falling clock edge.
4-77
Interfacing the HCTL-2000 to a Motorola 6801
This ,interface method provides the minimum part count
when the 6801 is operated in "MODE 5". A typical 6801 circuit is shown in Figure 14. In Figure .14, the 74LS138
22
3
A,
23
A,
A"
los
2
24
,
39
E;
A,
A,
A.
1~~
6601
3
r' 0, 30
p, 31
9
4
12
ClK
OE
SEl
0,
10
06
32
33
D.
3.
0,
35
0,
36
0,
37
" 00
11
06
PORT 4
Ii
]6
40
29
""
The processor clock output (E) is used to clock the HCTL2000 as well as the address decoder. One of the address
decoder outputs drives the OE input. This results in HCTL2000 counter data being enabled onto the bus whenever an
external memory access is made to the HCTL-2000. This
example assumes the address assigned to the HCTL-2000
high byte is an even address. The least significant address
bit is connected to theSEL input. It determines which data
byte is output. When AO on the decoder equals 0 the chip
selects the high byte, and when AO equals 1, the chip
selects the low byte. This configuration allows the 6801 to
read both data bytes with a single double-byte fetch instruction (LDD E, 01 XX). The LDD instruction is a five cycle
instruction which reads external memory location 01XX
and stores the high order byte in accumulator A and reads
external memory location 01 XX +1 and stores the low order
byte in accumulator B during the last two cycles. Figure 15
illustrates the sequence of events during all five cycles.
wpl
4E,
El
E
address decoder can be eliminated if the HCTL-2000 is the
only occupant of Port 4.
O.
12
0,
13
HCTL.200(l
03
0,
15
0,
"
1
o.
Figure 14. A Circuit to'interface to the 6801
CYCLE 1
CYCLE 5
ICLoCK)
ADDRESS
BUS
DATA BUS'
1
I
I
I
I
I
OPCODE
ACDR. +1
OPCODE
ADDR. +2
OPERAND
ADpR.
I
I
I
opdJDE
I
1
1
1
1
1
I
I
I
ACDR,. LOW
DATA
HIGH BYTE
OPE~AND
I
ACDR. HIGH
I
I
I
I
I
I
I
I
1
I
:
I
I
OPCOOE
ACDR.
I
los
1
1
OPE~AND
I
I
I
I
I
I
DATA
LOW BYTE
I
I
I
I
I
I
I
I
I
1
\
!
I
I
I
I
I
I
I
I
I
: 1 :I
.....--+---i-----t'.
AolSELI
I
I
OPERAND
ACDR. +1
/
I
~
i. . . .
1
1
I
I
I
1
1
1
1
1
1
1
I
1
1
I
,I"
I ,
I
I
I
IIII~IIII
I
I
1
INTERNAL
INHIBIT
:
I
I
I
1
I
I
I
1
:
I
I
:
I
II' "
I,
::
I
I
I
I
1
I
1
HCTL -2000
DATA'BUS
ACTIONS
1
I
I
cb,
:Ir-l
I I I ,
I
I
I
:
I
I
I
I
I
HIGH Z
I
I
I
I
cb
cb
I
I
I
HIGH Z
1
I
I
I
cb cb
Figure 15. Interface Timing for the 6801 LDD E
4-78
ACTIONS
1. E is the microprocessor clock output. On the rising edge
of E, if the internal inhibit is not active, then new data is
transferred from the internal counter to the position data
latch.
2. An even address output from the 6801 has caused SEL
to go low. E goes high which causes the address decoder output for the HCTL-2000 OE input to go low.
This causes the HCTL-2000 to. output the high byte of
the position data latch.
4. E is now low, so the address decoder output is disabled
and OE goes high. The 6801 increments the address, so
SEL goes high. The pOSition data latch is still inhibited.
5. The address decoder is enabled after E goes high, so
OE goes low and the low data byte is enabled onto the
bus.
6. The 6801 reads the data bus on the falling edge of E,
storing the low order data byte in accumulator B. The
chip detects that OE is low and SEL is high on the failing edge of E, so the first inhibit-reset condition is met.
7. E is now low, so the address decoder is disabled, causing OE to go high and the data lines to go to the high
impedence state. The 6801 continues its instruction execution, and the state of SEL is indeterminate.
3. The 6801 reads the data bus on the falling edge of E,
storing the high order data byte in accumulator A. The
chip detects that OE and SEL are low on the falling
edge of E and activates the internal inhibit signal. The
position data latch is inhibited and data cannot be transferred from the internal counter to the latch.
8. The HCTL-2000 detects OE is high on the next falling
edge of E. This satisfies the second inhibit reset condition so the inhibit signal is reset.
Interfacing the HCTL-2000 to
an Intel 8748
The circuit in Figure 15 shows the connections between an
HCTL-2000 and an 8748. Data lines 00-07 are connected
to the 8748 bus port. Bits 0 and 1 of port 1 are used to
control the SEL and OE inputs of the HCTL-2000 respectively. TO is used to provide a clock signal to the HCTL-2000.
The frequency of TO is the crystal frequency divided by 3.
TO must be enabled by executing the ENTO CLK instruction after each system reset, but prior to the first encoder
position change. An 8748 program which interfaces to the
circuit in Figure 16 is given in Figure 17. The resulting interface timing is shown in Figure 18.
To
Pll
1
2
28
3
27
• OE
P"
0.,
19
18
9
10
DB'
8748
D.5
17
11
16
12
15
,.
13
13
15
12
1
0.4
0.3
DB'
0.,
D ••
"
eLK
SEt
0,
0,
05 HCTt-2000
0,
03
0,
0,
00
Figure 16. An HCTL-2000 to Intel 8748 Interface
LOC
000
002
003
004
006
008
009
OOB
OBJECT
CODE
9900
08
A8
8903
08
A9
8903
93
SOURCE STATEMENTS
ANL P1, OOH
INSA, BUS
MOVE ROA
ORL P1, 01H
INS A, BUS
MOV R1, A
ORL P1, 03H
RETR
ENABLE OUTPUT AND OUTPUT HIGHER ORDER BITS
LOAD HIGHER ORDER BITS INTO ACC
MOVE DAT~ TO REGISTER 0
CHANGE PATA FROM HIGH ORDER TO LOW ORDER BITS,
LOAD ORDER BITS INTO AC
MOVE DATA TO REGISTER 1
DISABLE OUTPUTS
RETURN
Figure 17. A Typical Program for Reading HCTL-2000 with an 8748
4-79
11
elK
1
I
I
I
PROGRAM
ANL, P1, 004
EXECUTION
ORL Pl, OIH
1
I
I
I
RETR
INHIBIT
r - - - - - - B U S READ
DATA BUS
~
I
ACTIONS
I
-----;-1-------,
HIGH BYTE
I
6:
cb
Figure 18. 8748 READ Cycle from Figure 14.
ACTIONS
1. ANl P1. OOH has just been executed. The output of
bits 0 and 1 of Port 1 cause SEl and OE to be logic low.
The data lines output the higher order byte.
2. The HCTl-2000 detects that OE and SEl are low on the
next falling edge of the ClK and asserts the internal
inhibit Signal. Data can be read without regard for the
phase of the ClK.
3. INS A, BUS has just been executed. Data is read into
the 8748.
5. INS A, BUS has just been executed. lower order data
bits are read into the 8748.
6. ORl P1, 03H has just been executed. The HCTl-2000
detects OE high on the next falling edge of ClK. The
program sets OE and SEl high by writing the correct
values to port 1. This causes the data lines to be tristated. This satisfies the second inhibit-reset condition.
On the next rising ClK edge new data is transferred
from the counter to the position data latch.
4. ORl PORT 1, 01 H has just been executed. The program
sets SEl high and leaves OE low by writing the correct
values to port 1. The HCTl-2000 responds by outputting
the lower byte. The HCTl-2000 detects OE is low and
SEl is high on the next falling edge of the ClK, and
thus, the first inhibit-reset condition is met.
4-80
4-81
~~-------------
---------
----.-.---------.--.--~--------
Light Bars and
Bar Graph Arrays
•
•
•
Light Bars
Bar Graph Arrays
Legends
IJght Bars and
Bar Graph Arrays
LED Light Bars are Hewlett-Packard's innovative
solution to fixed message annunciation. The large,
uniformly illuminated light emitting surface may be
used for backlighting legends or simple indicators. Four
distinct colors are offered, AlGaAs red, high efficiency
red, yellow, and high performance green with two
bicolor combinations (see page 5-15). The AlGaAs Red
Light Bars provide exceptional brightness at very low
drive currents for those applications where portability
and battery backup are important considerations. Each
of the eight X-Y stackable package styles offers one,
two, or four light emitting surfaces. Along with this
family of stackable light bars, HP also provides a single
chip light bar for high brightness indication of small
areas. Panel Mounts and Legends are also available for
all devices.
In addition to light bars, HP offers effective analog
message annunciation with the lO-element and 101element LED Bar Graph Arrays. These bar graph
arrays eliminate the matching and alignment problems
commonly associated with arrays of discrete LED
indicators. Each device offers easy to handle packages
that are compatible with standard SIP and DIP
sockets. The lO-element Bar Graph Array is available in
standard red, AlGaAs red, high efficiency red, yellow,
and high performance green. The new multicolor lO~
element arrays have high efficiency red, yellow and
green LEDs in one package. The package is X-Y
stackable, with a unique interlock allowing easy end-toend alignment. The lOl-element Bar Graph Array is
offered in standard red, high efficiency red and high
performanc green with I % resolution.
5-2
LED Light Bars
Description
Device
Lens
Page
No.
Diffused
23 mcd
2.0V
5-8
Part No.
1c=J1
HLMP-2300
~
HLMP-2400
Yellow
Difjused
20 mcd
2.1 V
HLMP-2500
Green
Green
Diffused
25 mcd
2.2V
Diffused
45 mcd
2.0V
II
[~ ~ ~ ~ ~ ~ ~ ~J
~
I
~
38 mcd
2.1 V
HLMP-2550
Green
Green
Diffused
50 mcd
2.2 V
Diffused
22 mcd
2.0 V
Diffused
18 mcd
2.1 V
Green
Diffused
25 mcd
2.2 V
Diffused
25 mcd
2.0V
Diffused
18 mcd
2.1 V
Green
Diffused
25 mcd
2.2 V
Diffused
45 mcd
2.0 V
Diffused
35 mcd
2.1 V
Green
Diffused
50 mcd
2.2 V
Diffused
43 mcd
2.0 V
Diffused
35 mcd
2.1 V
Green
Diffused
50 mcd
2.2 V
HLMP-2620
HLMP-2720
HLMP-2820
HLMP-2635
I
~
D
Diffused
HLMP-2800
IDDDDI
High
8 Pin In-Line; 0.100"'
Efficiency Centers; 0.800"'L x
Red
0.195"'W x 0.245"'H
Yellow
HLMP-2700
~
High
4 Pin In-Line; 0.100"'
Efficiency Centers; 0.400"'L x
0.195"'W x 0.245"'H
Red
HLMP-2450
HLMP-2600
DO
B
HLMP-2350
Package
Typical
Forward
Imltage
@20mA
Package Outline Drawing
II
Color
Typical
Luminous
Intensity
@20mA
HLMP-2735
HLMP-2835
HLMP-2655
HLMP-2755
HLMP-2855
High
8 Pin DIP; 0.100"'
Efficiency Centers; 0.400"'L x
0.400"'W x 0.245"'H
Red
Dual Arrangement
Yellow
Green
High
16 Pin DIP; 0.100"'
Efficiency Centers; 0.800"'L x
Red
0.400"'W x 0.245"'H
Quad Arrangement
Yellow
Green
High
16 Pin DIP; 0.100"'
Efficiency Centers; 0.800"'L x
Red
0.400"'W x O.245"'H
Dual Bar
Yellow Arrangement
Green
High
8 Pin DIP; 0.100"'
Efficiency Centers; 0.400"'L x
0.400"'W x 0.245"'H
Red
Square
Yellow Arrangement
Green
5-3
LED Light Bars (Continued)
Package Outline Drawing.
Part No.
HLMP'2670
[JDI
,
Lens
. ~pli:al
Luminous
Intensity
. @20mA
Diffused
45 mcd
2.0 V
Diffused
35 mcd
2.1 V
Green
Diffused
50mcd
, 2.2V
Diffused
80 mcd
2.0V·
Diffused
70 mcd
2.1 V
Green
Diffused
100 mcd
2.2 V
Typical
Forward
Lens
Typlcill
Luminous
Intensity
@3ri1A
'@3mA
Page
No.
Diffused
7.5 mcd
' 1.6V
5-15
Description
Device
HLMp·2770
~
HLMp·2870
HLMP·2685
Cl
HLMp·2785
~.
HLMp·2885
. Package:'
Color·
High
16 Pin DIP; 0: 100" ,
Efficiency Centers; 0.800"L x
Red
0.400"W ~ 0.245"H
Dual Square
Yellow Arrangement ..
Green
High
16 Pin DIP; 0. 100"
Efficiency Centers; 0.800"L x
Red· O:4OO"W x 0.245"H
Single Bar
Yellow Arrangement
.,
Green
~plcal
Forward
~Itage
·@20rilA
Page
No.
5·8
,
DH AIGaAs Low Current LED Light Bars
,
Device
Package Dutllns Drawing
Descrlpllon
Part No.
1c=J1
I
Package
Color
HLCp·Al00 AlGaAs Red 4 Pin In·Llne; 0.100"
Centers; 0.400"L x
0.195"W xO.240"H
··fuiJ
II
~ltage
,
II
[~ ~ ~ ~ ~ ~ ~ ~J
m
~
IDDDO!
~
AIGaAs Red 8 Pinln·Line; 0.100"
Centers; 0.800"L x
0.195"W x 0.240"H
Diffused
'15.0 mcd
..
.-.
HLCp·Dloo
."
AIGaAs Red 8 Pin DIP; 0.100"
Centers; 0.400"L x
O.4oo"W x 0.240"H
Dual Arrangement
Diffused
,.
7.5 mcd
.. ,....
"
"
HLCp·El00
AIGa!\s Red 16 Pin DIP; 0.100"
Centers; 0.800"L x
0.400"W x: 0.240"H
Quad Arrangement
Diffused
I
,
"'1
HLCP·Bloo
:
7.5 mcd·
"',
..
;
DH AIGaAs Low Current LED Light Bars (Continued)
Device
Description
Lens
Typical
luminous
Intensity
@3mA
Typical
Forward
IhIltage
@3mA
AIGaAs Red 16 Pin DIP; 0.100"
Centers; O.SOO"L x
0.400"W x 0.240"H
Dual Bar
Arrangement
Diffused
15.0 mcd
1.6 V
D
HLCP-Cl00 AIGaAs Red SPin DIP; 0.100"
Centers; 0.400"L x
0.400"W x 0.240"H
Square
Arrangement .
Diffused
15.0 mcd
IO[JI
HLCP-Gl00 AIGaAs Red 16 Pin DIP; 0.100"
Centers; O.SOO"L x
0.400"W x 0.240"H
Dual Square
Arrangement
Diffused
15.0 mcd
HLCP-Hl00 AIGaAs Red 16 Pin DIP; 0.100"
Centers; O.SOO"L x
0.400"W x 0.240"H
Single Bar
Arrangemimt
Diffused
30.0 mcd
Package Outline Drawing
Part No.
[E:3
I
I
HLCP-Fl00
~
~
~
CJ]
~
Color
Package
Page.
No.
5-15
LED Bicolor Light Bars
Device
Package Outline Drawing
Description
. Pari No.
HLMP-2950
Color
High
Efficiency
Redl
Yellow
HlMP-2965
High
Efficiency
Red/
Green
D
@
,-
Package
S Pin DIP; .100"
Centers; .400"l x
.400"W x .245"H
Square
Arrangment
Lens .
Diffused
Diffused
5-5
Typical
Luminous
Intensity
@20mA
HER: 20 mcd
Yellow: 12 mcd
Typical
Forward
Voltage
. @20mA
HER: 2.0 V
Yellow: 2.1 V
HER: 20 mcd
Green: 20 mcd
HER: 2.0 V
Green: 2.2 V
Page
No.
5-20
LED Bar Graph Arrays
Description
Device
Package Outline Drawing
0000000000
~v~ ~ ~ ~ ~ ~ ~ ~
I[
r
--=:]1
L 11111111 i II: Ii i III
Package
20 Pin DIP; .
.100" Centers;
1.0"L x .400"W
x .200"
Lens
Diffused
Typical
Luminous
Intensity
1250 !lcd
@20mA DC
Typical
Forward
Voltage
1.6V@
20 mA DC
Part No.
HDSP-4820
Color
Standard
Red
HDSP-4830
High
Efficiency
Red
Diffused
3500 !lcd @
@10mA DC
2.1 V@
20 mA DC
HDSP-4840
Yellow
Diffused
1900 !lcd
@10mADC
2.2V@
20 mA DC
HDSP-4850
High
Performance
Green
Green
Diffused
1900 !lcd
@10mADC
2.1 V@
10 mA DC
HDSP-4832
Multicolor
Diffused
1900 !lcd
@ 10 mA DC
HDSP-4836
Multicolor
Diffused
1900 !lcd
@10mADC
HDSp·8820
Standard
Red
Red,
Non-Diffused
20 !lcd
@ 100 mA Pk:
1 of 110 D.F.
175 !lcd
@ 100 mA Pk:
1 of 110 DF
2.3 V
@ 100 mA Pk:
1 of 110 DF
175 !lcd
100 mA Pk:
1 of 110 OF
2.3 V
@ 100 mA Pk:
1 of 110 D.F.
mI J
22 Pin DIP;
.100" Centers;
4.16"Lx .390"W
x .236"H
HDSP-8825
High
Efficiency
Red
Clear
HDSP-8835
High
Performance
Green
Clear
@
1.7 V@
Page
No.
5-27
5-33
100 mA Pk:
1 of 110
D.F.
DH AIGaAs Low Current 10-Element Bar Graph Arrays
Device
Package Outline Drawing
lDDOD DODD DOl
Description
Part No.
HLCP-Jl00
Color
AlGaAs
Red
Package
20 Pin DIP;
.100" Centers;
1.0"L x .400"W
x .200"
~v~ ~ ~ ~ H~ ~ r
5-6
Lens
Diffused
Typical
Luminous
Intensity
1000 !lcd
@lmA
Typical
Forward
Voltage
1.6V@
1 mA
Page
No.
5-41
Single Chip LED Light Bar
Device
Lens
Typical
Luminous
Intensity
Tinted
Diffused
4.8 mcd
@20mA
Description
Package Dutllne Drawing
Part No.
Color
Package
HLMP-T200 High
One Chip
Efficiency LED
Red
Light Bar
(626 nm)
D
W
~O
201/2
100'
Typical
Forward
1hIitage
2.2V
@20mA
HLMP-T300 Yellow
(585 nm)
6.0 mcd
@20mA
2.2V
@20mA
HLMP-T400 Orange
(608 nm)
4.8 mcd
@20mA
2.2V
@20mA
HLMP-T500 Green
(569 nm)
6.0 mcd
@20mA
2.3 V
@20mA
Page
No.
5-45
Panel and Legend Mounts for LED Light Bars
Device
Package Outline Drawing
I
Corresponding Ughl Bar
Module Part Number
Part No.
HLMP-2598
HLMP-2350, -2450, -2550,
HLCP-B100
HLMP-2599
HLMP-2300, -2400, -2500,
HLCP-A100
HLMP-2898
HLMP-2600, -2700, -2800
-2655, -2755, -2855
-2950, -2965, HLCP-C100, '0100
HLMP-2899
HLMP-2620, -2720, -2820,
-2635, -2735, -2835
-2670, -2770, -2870
-2685, -2785, -2885
HLCP-E100, -F100, -G100, -H100
I
CJ
D
CJ
Page
No.
5-49
Special Options
Description
Legends
Intensity Selected
Option
Code
Applicable Part Number HLMp·
LOO, L01, L03, L04
LOO, LOt L03, L06, L04
LOO, L01, L02, L03, L04, L05, L06
S02
5-7
Page
No.
2300, 2400, 2500, HLCP-A 100
2655, 2755, 2855, HLCP-C100
2685, 2785, 2885, HLCP-H100
5-51
2300,2400,2500,2635,2735,2835
2350, 2450, 2550, 2655, 2755, 2855
2600, 2700, 2800, 2670, 2770, 2870
2620, 2720, 2820, 2685, 2785, 2885
5-53
LED LIGHT BARS
rhO- HEWLETT,
HIGH EFFICIENCY RED HLMP-2300/-2600 SERIES
YELLOW HlMP-2400/-2700 SERIES
HIGH PERFORMANCE GREEN HlMP-2500/-2800 SERIES
~:t:. PACKARD
Features
• LARGE, BRIGHT, UNIFORM LIGHT EMITTING
AREAS
'
Approximately LambertianRadiation Pattern
• CHOICE OF THREE COLORS
• CATEGORIZED FOR LIGHT OUTPUT
• YELLOW AND GREEN CATEGORIZED FOR
DOMINANT WAVELENGTH
• EXCELLENT ON-OFF CONTRAST
• EASILY MOUNTED ON P.C. BOARDS OR
INDUSTRY STANDARD SIP/DIP SOCKETS
• MECHANICALLY RUGGED
• X-Y.STACKABLE
• FLUSH MOUNTABLE '
Applications
'. CAN BE USED WITH PANEL AND LEGEND
MOUNTS
• BUSINESS MACHINE MESsAGE
AN",UNCIATORS
• LIGHT EMITTING SURFACE SUITABLE FOR
LEGEND ATTACHMENT PER'APpLICATION
NOTE 1012
'
• TELECO,MMUNICATIONS INDICATORS
• FRONT PANEL PROCESS STATUS INDICATORS
• SUITABLE FOR MULTIPLEX OPERATION
.PC BOARD IDENTIFIERS
• I.C. COMPATIBLE
• BAR GRAPHS
Description
The HLMP-2300/-2400/-2500/-2600/-2700/-2800 series light
bars are rectangular light sources designed fora variety of
applications where a large, bright source of light is required. These light bars are configured in single-in-line
and dual-in-line packages that qontairi' either Single or
segmented light emitting areas. The-2300/-2400/-2600/'
-2700 'seties' devices utilize LED chips which are made
from GaAsP' on a transparent GaP substrate. The -2500/
-2800 series devices utilize chips made from GaP on a
transparent GaP substrate.
Selection Guide
Light Bar Part Number
HLMPHigh
Green
EfIlclency Yellow
Red
Size of Light Emitting Areas
Number
of
Light
Emitting
Areas
Package
OuUine
Corresponding
Panel and
Legend Mount
Part No. HLMP-
2300
2400
2500
8.89 mm x 3,81 mm (0.350 in. x 0.150 in.)
1
A
t:::l
2599
2350
2450
2550
19.05 mm x 3.81 mm (0.750 in. x 0.150 in.)
1
B
c:::::J
2598
2600
2700
2800
8.89 mm x 3.81 mm (0.350 in. x 0.150 in.)
2
0
~
2698
2620
2720
2820
8.89 mm x 3.81 mm (0.350 in, x 0.150 in.)
4
2635
2735
2835
3.81 mm x 19.05 mm (0.150 in. x 0.750 in.)
2
2655
2755
2855
8.89 mm x 8.89 mm (0.350 in. x 0.350 in.)
1
C
~
0
2670
2nO
2870
8.89 mm x 8.89 mm (0.350 in. x 0.350 in.)
2
G
rn
2899
2685
2785
2885
8.89 mm 19.05 mm (0.350 in. x 0.750 in.)
1
H
0
2899
5e8
2899
2899
2898
Absolute Maximum Ratings
Parameter
Average Power Dissipation per LED Chiplll
Peak Forward Current per LED Chip. T A'" 50° C
(Maximum Pulse Width'" 2 ms l21
Time AVerage Fo~,Ja;d Cui~~rltper LED Chip.
Pulsed Conditions l2j
HI:~P.~OI
HI:MP-24001
HI:M.~;2?~~1
-2600 Series
-2700 Series
-2800 Stlries
135mW
85mW
135mW
90mA
60mA
90mA
20mA
TA"'50°C
25mA
TA'''' 25°C
25 mA
30mA
....•.. 25mA
DC Forward Current per LED Chip. T A'" 50° clSj
30mA
6V
Reverse Voltage per LED Cbip
Operating TemperaliJre Rarfg'e
Storage Tempef~t(i~ Range
-40" C to +85 0 C
260" C 10,r'3 seconds
Lead Soldering Temperature 1.6 mm (1/16 inch)
8elo;y:§eating Plane
NOTES: 1. For HLMP-23001-25001-26001-2800 series. derate above T A=25'C at 1.8 mW/'C per LED Chip. For HLMP-24001-2700 series, derate above
TA=50°C at 1.8 mW/oC per LED Chip. See Figure 2.
2. See Figure 1 to establish pulsed operating conditions.
3.. For HLMP-2300/-2500/-2600/-2800 series, derate above TA =50'C at 0.50 mA/'C per LED Chip. For HLMP-24001-2700 series, derate above
TA =60'C at 0.50 mA/'C per LED chip. See Figure 3.
r1
rt
'-1=7 +,
r- r
Package Dimensions
4.0b4"MIN,
0.50S 0.0.076
4953
10:1951
MAX
(0,160)
.
B.S90
10.3501
I
I
I~:~~I
3.S10
10.150}
1'i7~ ~
LD~
LII
10.1501
11:i
TOP A
PIN 1
3.S10
II
I
TOPS
CATHOOE ENO
END VIEW A, B
CQLOR
BIN
DATE
CQOE
ISEE NOTE 51
LUMINOUS
~\~~~~~
1
ISEENOT(4)
2.54 TYP
(0.1001
L
2 3 4
I
......J
(~:~)
IJTYP.
6.223 MAX,
10.2451
5 6 1 8
4
ro
0.584,0.016
10.023,0.003)
SIDE A
SIDE B
0.254 t 0,05
10,010 z
1=1
Cd
7.620
(0.3001
o.oozr1
:I:
(O.150)
4.064
~
MIN.
X
I
,
,
X
1,m6
(Q,04°
TYP. '
T+
x
x
6,223
(0.245)
MAX.
END VIEW C,D. E, F,G,H
SI DE VIew C, 0
2.640
(0.100)
T'l
T
~
...........J
I
DATE
CODE
LUMINOUS
INTENSITY
CATEGORY
ISEE NOTE 41
!
I
8.890
(0.350)
I
19.050
COLOR 81N
{SEE NOTE 5)
SIDE VIEW E, F, G, H
I
f t
PART
NUMBER
8.890 1.270
(0.350j{O.050
t
o.sOSz 0.05
10.020 ± 0.0(2)
TYP.
~~ I D
D 1_I
1--
S.890
(0.3501
-
I
I
10.160
(O.4001
MAX,
E
-
10.160
10.4WI
MAX.
F
-
I
10.160
10.400)
MAX,
G
NOTE, DIMENSIONS IN MILLIMETRES IINCHES). TOLERANCES ,0.26 mm ItO.010 in} UNLESS OTHERWISE INDICATED,
5-9
I_
Internal Circuit Diagrams
PIN
PIN FUNCTION
.2300/-2400
B
-23501-2450
·2500
-2550
A
A
PIN
1
Cathode-a
Cathode-a
:2
3
Anode-a
Cathode -b
Anode-a
Cathode-b
4
Anode-b
5
6
7
8
1
2
C,D
3
4
15
5
6
7
8
14
9
10
16
Anode-b
Cathode-c
11
Anode-C
Cathode - d
Anode-d
13
.12
11
12
13
14
15
16
PIN FUNCTION
C,D
E,F,G,H
CATHODE a
CATHODE a
ANODE a
ANODEa
ANODEb
ANODEb
CATHODE b CATHODE b
CATHODEc
CATHODEc
ANODEc
ANODEc
ANODEd
ANODEd
CATHODEd
CATHODEd
CATHODEe
ANODE.
ANODEf
CATHODEf
CATHODEg
ANODEg
ANODEh
CATHODEh
10
B
E,F,G,H
Electrical/Optical Characteristics at TA =25°C
High Efficiency Red HLMP-2300/-2600 Series
Parameter
HLMP2300
2350
2600
Luminous loteoSityl41
Per Light Em itt! ng
Area
2620
2635
2655
2670
2685
Peak Wavelength
Symbol
Min.
Typ.
6
23
mcd
20mA DC
26
mcd
60 mA Pk: 1 of 3 OF
45
mcd
20 mA DC
52
mcd
60 mA Pk: 1 013 OF
6
22
mcd
20 mA DC
25
mcd
60 mAPk: 1013 OF
6
25
mcd
20 mA DC
29
mcd
60 mA Pk: 1 of 3 OF
45
mcd
20 mA DC
52
mcd
60 rnA Pk: 1 013 OF
43
mcd
20 rnA DC
49
mcd
60 rnA Pk: 1 013 OF
45
mod
20 rnA DC
52
mcd
60 mAPk: 1013 OF
Iv
13
Iv
Iv
13
Iv
13
Iv
13
Iv
Test Condillons
22
80
mcd
20 mA DC
92
mcd
60 rnA Pk: 1 of 3 DF
om
Iv
"peak
635
Ad
626
Forward Voltage Per LED
VF
2.0
Thermal ReSistance LED
J unction-to-Pin
Unil$
Iv
Dominant WavelengthlSI
Reverse Breakdown VOltage Per LED
Mal<.
VeA
6
15
om
2.6
V
IF~
V
IR
"C/WI
R8J-PIN
5-10
150
LED
Chip
20 rnA
= 100pA
Yellow HLMP-2400/-2700 Series
Parameter
Luminous Intensityl4j
Per Ught Emitting
Area
HLMP-
Symbol
2400
Iv
2450
Iv
2700
Iv
2720
Iv
2735
Iv
2755
Iv
2170
2785
Min.
20 mA DC
6~~1013DF
38
46
mOd
20
mcd
60 rnA Pk: 1 of 3 DF
18
mcd
2Q:.mA DC : , / ,
22
mcd
60''iTIAPk: 1 of 3 OF
6
18
mcd
20 rnA DC
mcd
60 mA Pk: 1 of 3 DF
13
22
35
mcd
20 rnA DC
43
mcd
60 mA Pk: 1 of 3 OF
35
mcd
20mADC
43
mod
60 mA Pk: 1 of 3 DF
13
35
43
mcd
20 mA DC
70
85
mod
m¢d
60..mA Pk: 1 of 3 OF
26
mcd
60 mA Pk: 1 of 3 DF
13
),peak
583
),d
Forward Voltage Per LED
Reverse Breakdown Voltage Per LED
VF
585
2,1
6
VBR
Test Conditions
nfpd
Dominant Wavelengthl 5 1
Peak Wavelength
Units
24
6
Iv
Max.
mcd
13
Iv
Typ.
20
6
20'mA DC
nm
nm
2.6
15
V
IF=20 mA
V
IR = 100}J.A
"C/WI
Thermal Resistance LED
Junctlon-to-Pln
LED
Chip
150
ROJ-PIN
High Performance Green HLMP-2500/-2BOO Series
Parameter
Luminous Intensltyl41
Per Light Emltti ng
Area
HLMP-
Symbol
2500
Iv
2550
Iv
2BOO
Iv
2820
Iv
2835
Iv
2855
Iv
2870
Iv
2885
Iv
Min.
5
Typ.
Test Conditions
20 mADC
28
mcd
60 mA Pk: 1 013 DF
11
50
mcd
20mA DC
mcd
60 mA Pk: 1 of 3 OF
5
56
25
mcd
20 mA DC
mcd
60 mA Pk; 1 013 DF
5
28
25
mod
20 mA DC
mod
60 mA Pk: 1 013 OF
11
28
50
mcd
20mADC
56
mod
60 mA Pk: 1 of 3 OF
11
50
mod
20 mADC
mod
60 mA Pk: 1 of3 DF
11
56
50
mcd
20mA DC
56
mcd
60 mA Pk: 1 013 OF
22
100
mod
20 mADC
111
mcd
60 mA Pk: 1 of 3 DF
nm
Apeak
565
Ad
572
Forward Voltage Per LED
VF
2.2
Rever$e Breakdown Voltage Per LED
VSR
Thermal Resistance LED
Ju netion-to-Pin
Units
mcd
Dominant Wavelength1 5 1
Peak Wavelength
Max.
25
6
15
nm
2.6
V
IF=20 mA
V
IA
~
100 j.£A
"C/WI
R8J-PIN
150
LED
Chip
Notes:
4. These devices are categorized lor luminous intensity with the intensity category designated by a letter code on the side of the
package.
5, The dominant wavelength, Ad, is derived Irom the CIE chromaticity diagram and is that single wavelength which defines the color of
the device. Yellow and green devices are categorized lor dominant wavelength with the color bin designated by a number code on
the side of the package,
5-11
Electrical
,The HLMP-2300/-2400/-2500/-2600/-2700/-2800/ series of
light bar devices .are composed of two, four or eight light
emitting diodes, with the light from each LED optically
'scattered to form an evenly. illuminated light emitting surface. The LED's have a P-N junction diffused into the
epitaxial layer on a GaP transparent substate.
Size of Light
Emitting
Area
The anode and cathode.of each LED is brought out by
separate pins. This universal pinout arrangement allows
for the wiring of the LED's within a device in any of three
possible configurations: parallel, series, or series/parallel.'
The typical forward voltage values, scaled from Figure 5,
should be used for calculating,the current limiting resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design and
maximum power diSSipation may be calculated using the
following VF models:
SUrface Area
Sq. Metres
Sq. Feet
8.89 mm x 8.89 mm 61.74 x 10.6
729.16 x 10..tl
8,89 mm x 3,81 mm 33.B7 x 10'6
364.58
X
8.89 mm x 19.05 mm 135.48 x 10..tl 1458.32
3.81 mm x 19.05 mm 72.56
x 10-8
10.8
x 1o..t>
781.25 X 10.6
Refresh rates of 1 kHz or faster provide the most efficient
operation resulting in the maximum possible time average
luminous intensity.
VF = 1.8V + IPEAK (400)
For IpEAK ;:: 20mA
The time average luminous intensity may be calculated
using the relative efficiency characteristic of Figure 4,
l1iPEAK' and adjusted for operating ambient temperature.
The time average luminous intensity at TA = 25'C is
calculated as follows:
VF = 1.6V + IDe (500)
For 5mA'S IDe S 20mA
Iv "TIME AVG = [210AVG
mA] (111 PEAK ) (Iv Data Sheet)
The maximum power dissipation can be calculated for any
pulsed 'or DC drive condition. For DC operation, the
maximum power dissipation is the product of the maximum
forward voltage and the maximum forward current. For
pulsed operation, the maximum power dissipation is the
product of the maximum forward voltage at the peak
forward current times the maximum average forward
current. Maximum allowable power dissipation for any
given ambient tempenitureand thermal resistance (R8J-A)
can be determined by using Figure 2. The solid line in
Figure 2 (R8J-A of 538'C/W) represents a typical thermal
resistance of a device socketed in a printed circuit board.
The dashed lines represent achievable thermal resistances
that can be obtained through improved thermal design.
Once the maximum allowable power dissipation is determined, the maximum pulsed or DC forward current can be
calculated.
'
Example: For HLMP-2735 series
111 PEAK
Iv TIME AVG =
= 1.18 at IPEAK = 48 mA
[~~~~]
(1.18) (35 mcd) = 25
~cd
The time average luminous intensity may be adjusted for
operating ambient temperature by the following exponential equation:
Iv (TA) = Iv (25'C) e
[K ITA-2S'CI[
Device
K
-2300/-2600 Series
-2400/-2700 Series
-2500/-2800 Series
-o.0131/·C
-0.01121°C
-o.0104/°C
Optical
The radiation pattern for these light bar devices is
approximately Lambertian. The luminous sterance may
be calculated using one of the two following formulas:
L' (~d/m2) = Iv (cd)
v,
'A(m2)
.
.ITlv (cd)
Lv (footlamberts) = A (ft2)
Example: Iv (80· C) = (25 mcdle
[-0.0112 (80·2SI[
= 14 mcd
~g
~~
"'w
Zo
i=w
<0:
OPERATION IN
~: ~
a::::J
THIS REGION
~ ~ ~ 41-;;;m.;;\;;t+Hiffi--t-\l-tt-tHIt---t'H-l"flctitt'\.:t-+++ttttt;:~~~~~~URE
~~a
DERATING OF
:ieg
IDe MAX
"-0-"
OZ:>
9~~ 2~~~~~--~-HL~t&-~
~~~
I
~II~
~~
_~_g
1~~~~~__~-U~~~~uu~~~~~~
1
10
tp - PULSE DURATION - fJS
Figure 1. Maximum Allowed Peak Current vs. Pulse Duration.
5-12
Mechanical
These light bar devices may be operated in ambient
temperatures above +60 0 C without deratirig when
installed in a PC board configuration that provides a
thermal resistance to ambient value less than 250 0 C/W/
LED. See Figure 3 to determine the maximum allowed
thermal resistance for the PC board, Rope-A, which will
permit nonderated operation in a given ambient
temperature.
To optimize device optical performance, specially
developed plastiCS are used which restrict the solvents
that may be used forcleaning.lt is recommended that only
~
180
z
160
a
~
140
~
C
120
ffi
100
~
"
X
""
"
"
Q
~
- "'-:
REJ.GAoIEN
I
..
i
I "-
I
-.:.....-",
ROJA
40
-
20
-
I
I
I
1/
All,. -430'c,wILED
I
I
I
',/
0
o
tt
322~C/w/lEO
<'
./
\
•
~
~
20
""a
15
X
>-:..'
.
m _
a:
:>
R~r T'Cl'LEi
w
25
15a:
\
60
"E
,:.
M
TA -AMBIENT TEMPERATURE _
""
E
~l
M
IM
R8J" • 322'C,wILED
RUJ~ • 4~'ck'LE~ / '
ReJ~ • S18·ck'lE~./
I---
00
cc
10
20
YELLOW
~
1.0
13
"'i=>
~
a:
0.8
0.7
~
~
"
.)
1.1
0.9
0.6
\
\
X
V
10"\
\
~ ,)
'\
30
40
50
60
70
80
90
Figure 3. Maximum Allowable DC Current per LED vs. Ambient
Temperature, Deratlngs Based on Maximum Allowable
Thermal Resistance Values, LED Junction-to-Ambient
on a per LED Basis, Tj MAX = 1000 C.
1.3
1.2
\
TA - AMBIENT TEMPERATURE _ °c
Figure 2. Maximum Allowable Power Dissipalion per LED vs.
Ambient Temperature Deratlngs Based on Maximum
Allowable Thermal Resistance Values, LED Junction to
Ambient on a per LED Basis, Tj MAX = 1000 C.
,.
15"
'\
ylEUdw
10
u
"{
,
REd.GREkN
30
'I,
YELLOW
80
x
"
35
I
:>
mixtures of Freon (Fl13) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolv 01-15 or
DE-15, Arklone A or K. A 60 0 C (140 0 F) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35,
Ethanol, Isopropanol or water with a mild detergent.
IJ
.- -
r:-...
/
RED
-
I~REEN - -
H
I
0.5
IpEAK - PEAK CURRENT PER LED - mA
Figure 4. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak LED Current.
5-13
2.4
90
2.2
BO
"
E
>-
"'
"""'0
"'"
"
"'~
.!:
2.0
2°
_N
1.6
on>,,"
00
1.4
~;x
>- E
70
"
15
>
>-
60
50
2w
1.2
w"
O.B
i~'
.~«
40
30
1.8
>"'
0
20
~~
10
"'
I I I
1.0
1/
...<
0.4
0.2
/'
V
0.6
00
VF - FORWARD VOLTAGE - V
,/
;'
R~O,
YELLOW,
~AE~N
.......
10
15
-
~-
I
1- -
20
25
I--
f-30
IDe-DC CURRENT PER LED-rnA
Figure 5. Forward Current vs. Forward Voltage Characteristics.
Figure 6. Relative Luminous Intensity vs. DC Forward Current.
For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005,
5-14
DOUBLE HETEROJUNCTION AIGaAs
RliB LOW CURRENT LIGHT BARS
2 CHIP SIP HLCP-A100 4 CHIP DIP HLCP-C1001D100
4 CHIP SIP HLCP-B100 8 CHIP DIP HLCP-E10QLF100
tG100/H100
Features
• LOW POWER CONSUMPTION
3 rnA Drive Current
Low Forward Voltage
Excellent lor Battery Operated Applications
• X-V STACKABLE
• DEEP RED COLOR
Description
The HLCP-X100 Series light bars utilize Hewlett-Packard's
newly developed Double Heterojunction (DH) AIGaAs/GaAs
material to emit deep red light at 645 nm. This material has
outstanding efficiency at low drive currents and can be
either DC or pulse driven. Typical applications include
message annunciation for business machines, telecommunications, and instrumentation front panel, especially
those requiring portability or battery backup.
Absolute Maximum Ratings
Average Power Dissipation per LED Chip[1] ..... 37 mW
Peak Forward Currentper LED Chip[1] .......... 45 mA
Time Average Forward Current per LED Chip,
Pulsed Conditions[2] .............. 15 mA, T A = 25° C
DC Forward Current per LED Chip[3] ........... 15 mA
Reverse Voltage per LED Chip .................. 5 V
Operating Temperature Range ....... -20° C to +100° C
Storage Temperature Range ....•.... -55° C to +100° C
Lead Soldering Temperature 1.6 mm (1116 inch)
Below Seating Plane ............... 260° C for 3 sec.
Noles:
1. For pulsed operation, derate above TA = B7°C at 1.7 mW/oC
per LED.
2. See Figure 1 to establish pulsed operating conditions.
3. For DC operation, derate above T A = 91' C at O.B mAl' C per
LED.
Selection Guide
Light Bar
Part Number
HLCPAIGaAs
Red
Size of Light Emitting Areas
Number
of
Light
Emitting
Areas
A100
8.89 mm x 3.81 mm (0.350 in. x 0.150 in,)
1
A
CI
2599
8100
19.05 mm x 3.81 mm (0.750 in. x 0,150 in.)
1
B
c:::::J
2598
0100
8.89 mm x 3.81 mm (0,350 in. x 0.150 in.)
2
0
E100
8,89 mm x 3.81 mm (0.350 in. x 0.150 in.)
4
E
8.89 mm x 19,05 mm (0.150 in. x 0.750 in.)
2
F
1
C
E3
0
2899
8.89 mm x 8.89 mm (0.350 in. x 0.350 in.)
2899
2899
F100
C100
=
Package
Outline
Wi
G100
8.89 mm x 8.89 mm (0.350 in. x 0.350 in.)
2
G
IT]
H100
8.89 mm 19.05 mm (0.350 in. x 0.750 in.)
1
H
D
5-15
Corresponding
Panel and
Legend Mount
Part No. HLMP·
2698
2899
2898
Package Dimensions'
1\
4.064 MIN.
0.508 ±0.D76 1
10.020 ±0.0031
8.890
10.3501
MAX
111
'L
.r~~
PIN 1
CATHOOE END
rl
4953
10:,951
10.1601
4.953
10.1951
3.810
10.1501
19.050
.(0.7501
'.
~I
11:i
r
3.. 810
IJ'
II~
Lli
TOPB
TOP A
.
I
PART
NUMBER
END VIEW A, B
SEATING
PLANE
t...,...;,;,,;.._tTI
SEATING
PLANE
LUMINOUS
INTENSITY
CATEGORY
1 2
(SEE NOTE 41
2.54 TVP
J L
1
TypJ
2.54
10.1001
3
4
5
6
7 8
TLS.223
1.016
(0.2451
(0.0401
MAX.
~hTYP.
10.1001
0,584 ± 0.076
(0.023 '0.0031
SIDE B
SIDE A
I~
'
I
~PIN
I :- . - Ii II! ,~.:~
11g~;;,'r
M·AX.
3
6
4
1.016
(O.04°'l~
6.223
TYP.
10.2451
MAX.
10.3501
5
C
-.l
T
~
3.810
10.150'1-1
""I===I;==--I
LUMINOUS
INTENSITY
CATEGORY
ISEE NOTE 41
CJJ70
CJ
10.0501'
c:J
-1
TYP.
SIDE VIEW E, F, G, H
1,0.1501
3.810
10.1501
_ _ 4PLCS
PART
NUMBER
0.508 ± 0.05·
(0.020± 0.0021
.
L1 DF~I:~~~~O
:,'
I
TYP.
--,
I
10.160
10.4001
~
MAX.
E
NOTE: DIMENSIONS IN MILLIMETRES (INCHES). TOLERANCES :!:0.25 mm (:!;0.010 inl UNLESS OTHERWISE INDICATED.
5-16
.
7.620
(0.3001
4064-b]
(0:1601~
'no
r----1 - :3m'0:0501
L-..J __'0_,1501
T ~ I~~~g, It-=T --;I,~:~~g, It-
SIDE VIEW C, 0
2.540
10.1001
.
0.254' 0.05
_
(0.010 ± 0.002;-11
MIN.
END VIEW C,D, E, F,G,H
Internal Circuit Diagrams
~
"' .. '
,
"
2
3
•
A
PIN.FUNCTfON
PIN
C,D
PIN FUNCTION
B.',
-2100/-2350/-2450
.
·2550
A
PIN
-2000/-2300/-2400
-2500
1
•... Cathode-a
2
A~ode - a
Cathode -::- b
3
4
,i
-
Anode-b'
C,D
Caihode - a
16
Anode - a
'5
Cathod~.-
,'.
b
." Anode-b',
5 .'
Cathode -'c
13
6
Anode-.c
'2
'7
8
Cathode -d
"
Anode --,. d
10
B
1
2
3
4
C4THODEa
ANODE a'"
ANODE b
CATHODE b
CATHODE c
ANODEc
ANODEd
CATHODE d
S
6
7
8
9
10 "
11
12
13
14
15
16
E,F,G,H.
CATHODE a
ANODE a
ANODE b
CATHODE b
CATHODE c
ANODEc
ANODEd
CATHODEd
CATHODEe
ANODEe
ANODEf
CATHODEf
.CATHODE 9
ANODE'g
ANODEh
CATHODE h
E,F,G,H
Electrical/Optical Characteristics at TA = 25°C
Parameter
HLCP
A100
8100
C100
0100
Luminous.lntenslty[4)
Per Light Emitting
Area
E100
Fl00
Gl00
Hl00
Peak Wavelength
. Symbol
Min.
30
Iv
6.0
Iv
6.0
Iv
3.0
Iv
3.0
Iv
6.0
Iv
6.0
Iv
12.0
Iv
Typ.
Units Test Conditions
mcd
12.0
mcd
20 mA Pk: 1 of 4 OF
15
mcd
3mA DC
3mAOC
24.0
mcd
20 mA Pk: 1 of 4 OF
15
mcd
3mAOC
24.0
mcd
20 mA Pk: 1 of 4 OF
7.5
mcd
3mAOC
12.0
mcd
20 mA Pk: 1 of 4 OF
7.5
mcd
3mA DC
12.0
mcd
20 mA Pk: 1 of 4 OF
15
mcd
3mADC
24.0
mcd
20 mA Pk: 1 of 4 OF
15
mcd
3mAOC
24.0
mcd
20 mA Pk: 1 of 4 OF
30
mcd
3mAOC
48.0
mcd
20 mA Pk: 1 of 4 OF
nm
nm
Apeak
645
Dominant Wavelength[5]
Ad
637
Forward Voltage Pef Led
VF
Reverse Breakdown VOltage Per LED
VBR
Thermal Resistance LED
Junction-to-Pin
Mal(.
7.5
IF; 3 mA
1.6
1.8
5
2.2
V
IF= 20 mA Pk:
1 of4 OF
V
lR ~ 100,uA
"C/WI
ROJ _PIN
250
LED
Chip
Notes:
4. These devices are categorized for luminous intensity with the intensity category designated by a letter code on. the side of the package.
5. The dominant wavelength, Ad. is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.
5-17
Electrical
The HLCP-X100 series of light bar devices are compsed of
two, four or eight light emitting diodes, with the light from
each LED optically scattered to form an evenly illuminated
light emitting surface. These diodes have their P-N junctions
formed in AIGaAs epitaxial layers on a GaAs substrate.
The anode and cathode of each LED is brought out by
separate pins. This universal pinout arrangement allows
for the wiring of the LED's within a device in any of three
possible configurations: parallel, series, or series/parallel.
The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
values and typical power dissipation. Expected maximum
V F values for the purpose of driver circuit design and
maximum power dissipation may be calculated using the
following VF models:
The maximum power dissipation can be calculated for any
pulsed or DC drive condition. For DC operation, the maximum power dissipation is the product of the maximum
forward voltage and the maximum forward current. For
pulsed operation, the maximum power dissipation is the
product of the maximum forward voltage at the peak
forward current times the maximum average forward current. Maximum allowable current for any given ambient
temperature and thermal resistance (RIIJ-A) can be determined by using Figure 2. The solid line in Figure 2 (RIIJ-A
of 5380 C/W) represents a typical thermal resistance of a
device socketed in a printed circuit board. The dashed
lines represent achievable thermal resistances that can be
obtained through improved thermal deSign.
VFMAX = 2.0 V + IF (10 0), IF 2: 20 mA
VFMAX = 1.8 V + IF (20 0), IF ~ 20 mA
OPERATION IN THIS
REGION REQUIRES
TEMPERATURE DERATING
OF IDe MAX
tp - PULSE DURATION - /-IS
Figure 1. Maximum Allowable Peak Current vs. Pulse Duration
15
1.2
,,·t++~ ---~\
"
E
,.
/'
1.0
"iii
0.8
::>
~
0.6
"I
>
I-
iiia:
10
Ro", • 6Qo'c/WILEO
-, ~ -
::;
a:
"c
w
i=
~
X
".E'"
0.4
i
a:
0.2
°20
30
40
50
60
70
80
TA - AMBIENT TEMPERATURE _
90
100
10
°c
20
30
40
PEAK CURRENT PER LED (rnA)
Figure 2. Maximum Allowed DC Current per LED vs. Ambient
Temperature, Deratings Based on Maximum Allowable
Thermal Resistance Values, LED Junction-to-Ambient
on a per LED Basis, T JMAX = 110' C
Figure 3. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak LED Current
5-18
50.0
I
"
..1
20.0
I
E
...I
i:'a:i
10.0
5.0
a:
::>
u
c
2.0
~
a:
1.0
a:
it
0.5
I
-"
0.2
0.1
1.0
0.5
0
VF
-
'.5
2.0
0'1L
.2-l-LLJ
O."'5LU..I..L,--!c2-LJ""5~LJ.J,l:0--,J20
2.5
DC CURRENT PER LED (mAl
FORWARD VOLTAGE - V
Figure 5. Relative Luminous Intensity VB.
DC Forward Current
Figure 4. Forward Current vs. Forward Voltage
Characteristics
I
For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Notes 1005 and 1027.
5-19
I
LED BreOLOR LIGHT BARS
roUi HEWLETT
DIP - single Light Emitting Area
-.:~ PACKARD
HIGH EFFICIENCY REDIYElLOW HLMp·2950
HIGH EFFICIENCY RED/HIGH PERFORMANCE GREEN HLMp·2965
Features
• LARGE,BRIGHT, UNIFORM. LIGHT EMITTING
AREA'
.
.
8.89mm x8.89mm (0.35 x 0.35 inch)
ApprClximalely Lambertian Radialion Pattern
• CHOICE OF TWO.BICOLOR COMBINATIONS
• CATEGORIZED FOR LIGHT OUTPUT
A'ND
• YELLOW
GREEN
CATEGORIZED FOR DOMINANT WAVELENGTH
• EXCELLENT ON-OFF CONTRAST
• EASILY MOUNTED ON P.C. BOARDS OR
INDUSTRY STANDARD DIP SOCKETS
• MECHANICALLY RUGGED
• X-Y STACKABLE
• FLUSH MOUNTABLE
Applications
• CAN BE USED WITH HLMP-;!898 PANEL AND
LEGEND MOUNT
• TRISTATE LEGEND ILLUMINATION
• LIGHT EMITTING SURFACE SUITABLE FOR
LEGEND ATTACHMENT PER APPLICATION
NOTE 1012
• I.C. COMPATIBLE
o
SPACE-CONSCIOUS FRONT PANEL STATUS
INDICATORS
o
BUSINESS MACHINE MESSAGE
ANNUNCIATORS
o TELECOMMUNICATIONS INDICATORS
o
TWO FUNCTION LIGHTED SWITCHES
Description
The HLMP-2950/-2965 light bars are bicolor light sources
designed for a variety of applications where dual state or
tristate illumination is required for the same annunciator
function. In addition. both devices are capable of emitting a
range of colors by pulse width modulation. These light bars
'",-
are configured in dual-in-line packages which contain a
single light emitting area. The high efficiency red (HER)
and yellow LED chips utilize GaAsP on a transparent GaP
substrate. The green LED chips utilize GaP on a transparent
substrate.
I
package 'Dimensions
2.540
10.1001 -j-;;;;",'==iI
LUMINOUS
INTENSITV
-=~~~
~D-!
I
)gl~ 2
MAX.
:
D11-1
:
8--
1
T ---rjII
~
8.890
(0.3501
10.160
(0.4001
-I '
MAX.
SIDE VIEW
8.890
(O.350)
TOP VIEW
END VIEW
_
"'OTES, DIMENSIONS IN MllLiMETRes I1NCIIESI.
TOLERANCeS cO.25 min {'O.OIO Inl UNLESS
OTHERWISE INDICATED.
Absolute Maximum Ratings
Parameter
HLMP·2965
HLMP·2950
135mW
85mW
Average Power Dissipation per LED Chip!1j
Peak Forward Current per LED Chip, T A'" 50' C
(Maximum Pulse Width" 2 ms)I1.2!
Time AveragEj,Forward Current per LED Chip,
Pulsed Conditions[2!
.......... ,....•.. ,...
90mA
60mA
25,rnA;
TA = 25°C
29mA;
Ti<;'50°C
DC Fdrward Current per LED Chip, T A = 50' C[3!
OPllrating Temperature Range
.."
36"mA
'25mA
-20' C to +85.' C
_40° C to +85° C
Storage Tempe,rature Range
-40' C to +85' C
Lead So!dering,Temperature, 1.6 mm (V16 inch) Below Seating plane
260' C for 3 seconds
Notes:
1. For HLMP-2965, derate above T A = 25° C at 1.8 mW;o C per LED chip. For HLMP-2950, derate above T A = 50' C at 1.8 mW;oC per LED
chip. See Figure 2.
2. See Figure 1 to establish pulsed operating conditions.
3. For HLMP-2965, derate above TA = 50'C at 0.50 mA/'C per LED chip. For HLMP-2950, derate above TA = 60°C at 0.50 mA/oC
per LED chip. See Figure 3.
Internal Circuit Diagram
PIN
*
HIGH EFFICIENCY RED LED
*,.
YELLOWI
GREEN
HER
a
2
CATHODE
ANODE a
3
4
ANODE b
CATHODE b
5
CATHODE c
6
7
CATHODE 9"
CATHODE h
B
ANODEh
YELLOW OR GREEN LED
Electrical/Optical Characteristics at TA = 25°C
HIGH EFFICIENCY RED/YELLOW
HLMp·2950
Parameter
Symbol
HER
Min.
Typ,
13
43
13
Iv
HER
Peak Wavelength
Yellow
5
Yellow
Thermal ReSistance LED
Junction-to-Pin
Yellow
mcd
20 mA DC
49
mcd
60 mA Pk: 1 of 3
Duty Factor
35
mCd
20 mA DC
43
mod
60 mA Pk: 1 of3
Duty Factor
nm
583
626
Ad
nm
585
HER
Forward Voltage
Test Conditions
635
APEAK
HER
Dominant Wavelength
Units
Iv
Luminous Intensity •
Yellow
Max.
VF
2.0
2.6
2.1
2.6
150
OJC
5-21
V
"C/W/LED
iF=20mA
Electrical/optical Characteristics at TA
HIGH EFFICIENCY RED/GREEN
HLMP-2965
Symbol
Parameter
HER
Luminous Intensity
Min.
Typ.
19
43
25
20 mA DC
49
mcd
60 mA Pk: 1 of 3
Duty Factor
50
mcd
20 mA DC
mcd
60 mA Pk: 1 of3
Duty Factor
Iv
HER
Green
635
APEAK
Green
626
Ad
Green
Thermal Resistance LED
Junction-to-Pin
nm
572
HER
Forward Voltage
nm
565
HER
Dominant Wavelength: sl
Test Conditions
mcd
56
Peak Wavelength
Units
Iv
4
Green
Max.
VF
2.0
2.6
2.2
2.6
150
ReJ-PIN
V
IF '" 20 mA
°C/W/LED
Notes:
4. These devices are categorized for luminous intensity with the intensity categorization designated by a two letter combination code
located on the side of the package (Z =HER, W =Yellow or Green)
5. The dominantwavelength, "d, is derived from the C.I.E. chromaticity diagram and is that single wavelength which defines the color of
the device.
Electrical
The HLMP-2950/-2965 bicolor light bar devices are composed of eight light emitting diodes: four High Efficiency
Red and four that are either Yellow or Green. The light
from each LED is optically scattered to form an evenly
illuminated light emitting surface. The LED's are die attached and wire bonded in bicolor pairs, with the anodel
cathode of each LED pair brought out by separate pins.
The typical forward voltage values, scaled from Figure 5,
should be used for calculating the current limitin>j resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design and maximum power dissipation may be approximated using the
following VF models:
VF = 1.8V + IPEAK (400)
For IpEAK ~ 20 mA
VF = 1.6V + IDC (500)
For 5 mA ::; IDe::; 20 mA
The maximum power dissipation can be calculated for any
pulsed or DC drive condition. For DC operation, the
maximum power dissipation is the product of the maximum
forward voltage and the maximum forward current. For
pulsed operation, the maximum power dissipation. is the
product of the maximum forward voltage at the peak
forward current times the maximum average forward
current. Maximum allowable power dissipation for any
given ambient temperature and thermal resistance r R8J-A I
can be determined by using Figure 2. The solid line
in Figure 2 (R8J-A of 538 0 C/W) represents a typical thermal
resistance of a device socketed in a printed circuit board.
The dashed lines represent achievable thermal resistance
that can be obtained through improved thermal design.
Once the maximum allowable power dissipation is determined, the maximum pulsed or DC forward current can be
calculated.
Optical
The radiation pattern for these light bar devices is approximately Lambertian. The luminous sterance may be calculated using one of the two following formulas:
Lv (cd/m2) =
Iv (cd)
A (m2)
Lv (footlamberts) =
ITlv (cd)
A (ft2)
where the area (A) of the light emitting surface is 67.74 x
10-6 m 2 (729.16 x 10-6ft.2).
5-22
For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, see Application Note 1005.
10
100
10000
1000
tp - PULSE DURATION -lAS
Figure 1. Maximum Allowed Peak Current vs. Pulse Duration.
~
180
2
160
o
~
140
~
Ci
120
ffi
100
"~
RE~.G~EEN
!
!, I
80
"
X
60
"
"
40
X
"
20
:J
! I
I R.""
8~IIJA
t{V)A
_,c
." , ,
"
<-
~ 3~2 C~IILE? / /
"s'ssc
.30 CIWILED
.:.
25
a:
20
""0
15 I--
15a:
\
:J
\
,;
"E"
~" '\
C1/lEh~
j II I .
u
'I
I
\\
RUJA - 3Z2'CIWILEI>
ROJ~ "410' CJIiLEh /
R"J~ • 5~B'ckILEb/
10
00
TA - AMBIENT TEMPERATURE - C
'\ ', k"",
lX ,
V f:\: ,1
\,
vkuJw
E
, -""-b.
I
~
REb.GR~EN
30
,- "'~
VE,lOW
"
"
35
J J
10
20
30
40
50
60
70
TA - AMBIENT TEMPERATURE -
Figure 2. Maximum Allowable Power Dissipation per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance Values, LED Junction to
Ambient on a per LED Basis, Tj MAX = 100' C.
80
90
"c
Figure 3. Maximum Allowable DC Current per LED vs. Ambient
Temperature, Deratings Based on Maximum Allowable
Thermal Resistance Values, LED Junction-to-Ambient
on a per LED Basis, Tj MAX = 100' C.
5-23
90
80
, "t.
e,
I-
70
iiia:
60
:>
50
a:
"0a:
40
a:
30
~
.it,
.!:
20
10
VF - F.DRWARD VOLTAGE - V
IpEAK - PEAK CURRENT PER LED - rnA
Figure 4. Relative Elficlency (Luminous Intensity per Unit
Current) vs. Peak LED Cur~nt.
Figure 5. Forward Current vs. Forward Voltage Characteristics.
2.'
,.
I-
~<
2.2
2.0
1.8
~~
1.6
:><
I.'
",l-
00
zw
i~
:>~
~<
w:!1
>a:
-0
I-z
1.2
1.0
0.8
<- 0.6
iil
a:'
0.'
IOC-DC CURRENT PER LED-rnA
Figure 6. Relative Luminous Intensity vs.
5-24
DC, Forward
Current.
Reversing polarity LED Drivers
output control or provide other means for turning both
LED's off. An example of this circuit technique is shown in
Figure 11.
Bicolor LED light bar modules require a polarity reversing
scheme to turn on the desired LED. Reversing line drivers,
timers and memory drivers can be used to drive bicolor
LED light bars.
The NE556 dual timer, or two NE555 timers can also be
used to drive bicolor light bars, as shown in Figure 12. The
outputs at the NE555 timer are able to source or sink up to
200 mAo Connected as shown, each timer acts as an inverting buffer. This circuit has the advantage over the previous
line driver circuits of being able to operate at a wide variety
of power supply voltages ranging from 4.5 to 16 volts.
The reversing line driver, which was originally designed to
drive a data transmission line, can also be used as a polarity
reversing driver for bicolor LED modules. The reversing line
driver has a totem pole output structure that differs from
most TTL circuits in that the output is designed to source
as much current as it is capable of sinking.
Memory drivers can also be used to drive bicolor light bars.
Figure 13 shows a 75325 core memory driver being used to
drive several pairs of bicolor LEDs. The 75325 is guaranteed to supply up to 600 mA of current with an output
voltage considerably higher than 5V line drivers. The 75325
requires an additional 7.5V power supply at about 40 mA to
properly bias the sourcing drivers. The 75325 allows tristate (red, green, yellow, or emerald, off) operation.
Line drivers designed to operate from a single 5V supply
are typically specified to source or sink 40 mA. Figure 7
shows the typical output characteristics of three different
line drivers connected so that one output sources current
across a load and the current is sunk by another output.
This circuit is shown in Figure 8. At 40 mA output current,
the output voltage typically varies from 2.4V 1741281 to 2.9V
IDM 8830, 96141 for Vee = 5.0V. A basic bicolor LED circuit
is shown in Figure 9. Since a line driver can supply 40 mA, it
is capable of driving two LED pairs.
By employing pulse width modulation techniques to any of
these circuits a range of colors can be obtained. This technique is illustrated in Figure 14.
Some line drivers like the 9614 are constructed such that
the sourcing output is brought out separately from the sinking output. With this type of line driver, the LED currents for
each pair can be controlled separately. This technique is
shown in Figure 10. Other line drivers provide a tri-state
80
'E",
I-
to-...
-...,
"\
SO
a:
::>
"::>
40
::::>
'i'
E
,,
V
I-
---.---------1r---- vcc
V-OM8830
1-'96\4
"I .
"\ "<; K'
"\
ffi
a:
Hewlett-Packard cannot assume responsibility for use of
any circuitry described other than the circuitry entirely
embodied in an HP product.
74US -
\1\
20
1\\
'\
VO"OUTPUT VOLTAGE - V
Figure 8. Line Driver Equivalent Circuit.
Figure 7. Typical Output Characteristics of Reversing Line Drivers.
RED.
RED.
GREEN!r-E3~~'!~25D~M8=8=30~-r_-----l
5
YELLOW
3sn
RED
T-----l
GREEN·-l:i3::>==kYELLOW
3sn
lsn
GREEN!
YELLOW
RED
lsn
GREEN!
YELLOW
YIELDS APPROXIMATELY 20mAlRED LED
YIELDS APPROXIMATELY 25mAIYELLOW OR GREEN LED
Figure 9. Typical Line Driver Circuit; Approximately 20mA/LED Pair.
5-25
Figure 10. Techniques for Varying the Current of Each LED.
1/67404
RED,GREEN,VELIOW----~--~~;~r_----------_:31~~~------~--------------__,
lsn
l5n
GREENI
YELLOW
ENABLE-----r------------------~_7_i
Figure 11'. Tristate (Red,
Green/Yello~
Off) Bicolor LED Driver.
+6V
RED, GREEN, YELLOW
lOn:
10n
10fl
RED
YIELDS APPROXIMATELY 25mA/LED PAIR
Figure 12. Use of Dual Timer to Drive Bicolor Light Bars
+V:>7.5
1/67404
~~-.--~~fA~~~----~~~W~2~------~--~--------_1~----~
1/275325
X 15
ENABlE--~----~------~r_~ot~------~-----1
GREEN,
YELLOW
RED
+-____________--+______~ lOmA PER LED PAIR
rl0'--__-+__
D
1/275325
Yr------'
C
UP TO 20 LED PAIRS
(600mA TOTALI
Figure 13. 75325, High Current Bicolor Driver,
Vee
Vee
Vee
100Kfl
2Kfl
PULSE WIDTH MODULATION CDNTROL
.-/
100Kn
14
2.2Kfl
1/2 NE556
112 NE556
f------ OUTPUT (BICOLOR CIRCUIT)
2AVn'
n_
L-J
~
~ GREEN, YEL~OW
O.BV _______________
2.
4V
UlF
-RED
0.8V ________________
Figure 14. Pulse Width Modulation Technique
5-26
LED COLOR KEY FOR ALL FIGURES
XHER'
A
YELLOW OR GREEN LED
10-ELEMENT BAR GRAPH ARRAY
F/i;;'l
RED
HIGH-EFFICIENCY RED
YELLOW
HIGH PERFORMANCE GREEN
M!JlnCOlQR
MULTICOLOR
HEWLETT
a:~ PACKARD
HD5P-4820
HDSP'1l830
HDSP-481l0
HDSP-1l850
HP$P'1l832
HDSP-1l836
Features
• CUSTOM MULTICOLOR ARRAY CAPABILITY
• MATCHED LEOs FOR UNIFORM APPEARANCE
• END ST ACKABLE
• PACKAGE INTERLOCK ENSURES CORRECT
ALIGNMENT
• LOW PROFILE PACKAGE
• RUGGED CONSTRUCTIONRELIABILITY DATA SHEETS AVAILABLE
• LARGE, EASILY RECOGNIZABLE SEGMENTS
• HIGH ON-OFF CONTRAST, SEGMENT TO
SEGMENT
• WIDE VIEWING ANGLE
• CATEGORIZED FOR LUMINOUS INTENSITY
• HDSP-4832/-4836/-4840/-4850 CATEGORIZED
FOR DOMINANT WAVELENGTH
Applications
•
•
•
•
•
Description
These 10-element LED arrays are designed to display information in easily recognizable bar graph form. The packages
are end stackable and therefore capable of displaying long
strings of information. Use of these bar graph arrays eliminates the alignment, intenSity, and color matching problems
associated with discrete LEOs. The HDSP-4820/-48301
-4840/-4850 each contain LEOs of just one color. The
HDSP-4832/-4836 are multicolor arrays with High-Efficiency
Red, Yellow, and Green LEOs in a single package. CUSTOM
MULTICOLOR ARRAYS ARE AVAILABLE WITH MINIMUM
DELIVERY REQUIREMENTS. CONTACT YOUR LOCAL
DISTRIBUTOR OR HP SALES OFFICE FOR DETAILS.
INDUSTRIAL CONTROLS
INSTRUMENTATION
OFFICE EQUIPMENT
COMPUTER PERIPHERALS
CONSUMER PRODUCTS
Package Dimensions
1. DIMENSIONS IN MII_LIMETRES (lNCHESI.
Z. ALL UNTOLERANCEO DIMENSIONS fOR
REFERENCE ONLY.
3. HD$P-483ZI-4ll36/-4ll40!-48S0 ONLY.
2.54
(0.1001
DATE CODE
R- o.~
PIN I MARKING
{O.OISI
L
I'
!...........J
7.52" 0.36
I
I (0.300, 0.0151
~.54±O.2S
(O.100±Ml0)
5-27
Absolute Maximum Ratings£91
HDSP-4820
Parameter
Average Power DISsipation per LED
(T = 25° C) [1}
HDSP-4830
HDSP-4840
HDSP-4850
125mW
125mW
125mW
125mW
Peak Forward Current per LED
150 mWrll1
90 mA[3)
6OmA(3)
9OmAf3]
DC Forward Current per LED
30mA[41
30mA[Sj
SamAra]
30 mAFl
-40" C to +85" C
Operating Temperature Range
20" C to +85· C
-40' C to +85' C
Storage Temperature Range
3.0 V
Reverse Voltage per LE::D
Lead Soldering Temperature
(1.59 mm (1/16 inCh) below seating plane
260° C for 3 seconds
NOTES:
1. Derate maximum average power above TA = 25' C at 1.67 mW/' C. This derating assumes worst case. R0J-A = 600' C/WiLED.
2. See Figure 1 to establish pulsed operating conditions.
3. See Figure 6 to establish pulsed operating conditions.
4. Derate maximum DC current above TA=63' C atO.81 mAl' C per LED. Thisderating assumes worst case R0J-A= 600' C/W/LED. With
an improved thermal design, operation at higher temperatures without derating is possible. See Figure 2.
5. Derate maximum DC current above TA = 50' C atO.6 mAl' C per LED. This derating assumes worst case R0J-A = 600' C/W/LED. With an
improved thermal design, operation at higher temperatures without derating is possible. See Figure 7.
6. Derate maximum DC current above TA= 70' C atO.67 mAl' C per LED. This derating assumes worst case R0J-A=600' C/W/LED. With
an improved thermal design, operation at higher temperatures without derating is possible. See Figure 8.
7. Derate maximum DC current above TA = 37' C at 0,48 mAl' C per LED. This derating assumes worst case R0J-A = 600' C/W/LED. With
an improved thermal design, operation at higher temperatures without derating is possible. See Figure 9.
8. Clean only in water, Isopropanol, Ethanol, Freon TF or TE (or equivalent) and Genesolve 01-15 (or equivalent).
.
9. Absolute maximum ratings for the HER, Yellow, and Green elements of the multicolor arrays are identical to the HDSP-4830/-48401
-4850 maximum ratings.
Multicolor Array
segment Colors
Internal Circuit Diagram
1'-...
v
20
b
19
"
d
t-.. •
.
::: f
:::
::: h
~i
K
I
v
10
18
17
16
15
14
13
PIN
1
2
3
4
6
6
7
8
9
10
FUNCTION
AN()DE-a
ANODE-b
ANODE-c
ANOOE-d
ANODE-e
ANODE-f
ANODE-g
ANODE-h
ANODE-i
ANOOE-!
PIN
11
12
FUNCTION
CATHODE-j
CATHODE-;
CATHODE-h
CATHODE-g
CATHODE-f
CATHODE-.
CATHOOE-d
CATHODE-c
CATHODE-b
CATHODE-a
13
14
16
16
17
18
19
20
12
Segment
a
b
C
d
e
f
g
h
i
11
J
HDSp·4832
Segment Color
HER
HER
HER
Yellow
Yellow
Yellow
Yellow
Green
Green
Green
HD$P-4838
Segment Color
HER
HER
Yellow
YellOW
Green
Green
Yellow
Yellow
HER
HER
Electrical/Optical Characteristics at TA,= 25 0 C41
RED
HDSP-4820
Parameter
Luminous Intensity per LED
(Unit Average)111
Symbol
IF
Test Conditions
Min.
Typ.
IF=20mA
610
1250
APEAK
655
Dominant Wavefength l21
Ad
645
Forward Voltage per LED
VF
IF=20mA
Reverse Voltage per LED
VR
IR'" 100 p.A
Peak Wavelength
1.6
3
Max.
Units
I
I
!tcd
nm
nm
2.0
V
12(5)
V
Temperature Coefficient VI' per LED
AVF/oC
-2.0
mVioC
Thermal Resistance LED Junction-to-Pln
RSJ- P1N
300
"C/WI
LED
5-28
YELLOW
HDSP-4840
Parameter
Luminous Intensity per LED
(Unit Average}111
Peak Wavelength
t1' ,.
Symbol
d
Test Conditions
IF= 10 mA
Iv
"Min.
Ty!).
600
1900
Rax.
"cd
nm
583
APEAK
Dominant Wavelengthl2,3 1
Ad
581
Forward Voltage per LED
VF
11'=20 rnA
Reverse Voltage per LED
VA
IA = 100 "A
3
Units
585
592
2.2
2.5
nm
V
40(51
V
Temperature Coefficient VF per LED
AVF/"C
-2,0
mVl·C
Thermal Resistance LED Junction-to-Pin
RaJ-PIN
300
·ClWi
LED
GREEN
HDSP-4850
Parameter
Luminous Intensity per LED
(Unit Average}111
Peak Wavelength
Dominant Wavelength l2•31
Symbol
Iv
Test Conditions
Min.
Typ.
IF=10mA
600
1900
Max.
fled
APEAK
566
Ad
571
577
2.1
2.5
Forward Voltage per LED
VF
Reverse Voltage per LED
VA
IF"'" 10 rnA
I
IA'" 100 "A
3
Units
nm
nm
V
50(51
V
Temperature Coefficient VF per LED
AVF/·C
-2.0
mVl"C
Thermal Resistance LED Junction-te-Pin
RaJ-PIN
300
·C/WI
LED
NOTES:
1. The bar graph arrays are categorized for luminous intensity. The category is des.ignated by a letter located on the side of the package.
2. The dominant y.oavelength. Ad, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the
device.
3. The HDSP-4832/-4B36/-4B40/-4850 bar graph arrays are categorized by dominant wavelength with the category designated by a
number adjacent to the intensity category letter. Only the yellow elements of the HDSP-4B32/-4B36 are categorized for color.
4. Electrical/optical characteristics of the High-Efficiency Aed elements of the HDSP-4B321-4836 are identical to the HDSP-4B30
characteristics. Characteristics of Yellow elements of the HDSP-4B32/-4B36 are identical to the HDSP-4B40. Characteristics of Green
elements of the HDSP-4B32/-4B36 are identical to the HDSP-4B50.
5. Reverse voltage per LED should be limited to 3.0 V Max.
5-29
HDSP-4820
OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
IDe MAX
1
1
tp - PULSE DURATION - ,uSEe
Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration
"
E
I
z'
a:
a:
::J
"
""
>E
r--
25
I--
20
1',
H;.".48SE
X
15
>E
10
"
"~
1-0
*
0,9
(j
30
r-:- I'---
I
UJ
>
;::
~
RJ'A .loo,d'\'JlsJo/ h,",
""'- I-
If
>
35
IUJ
-
1-1
45
40
a:
I
I
\
!
0.8
C
0
0
0.7
00
20
40
60
80
100
120
140 I 160
150
Ipeak - PEAK SEGMENT CURRENT - rnA
Figure 2. Maximum Allowable D.C. Current per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance, LED Junction-to-Ambient
on a per LED basis. T JMAX = 1000 C
Figure 3. Relative Efficiency (Luminous Intensity per Unit
Current) VB. Peak Segment Current
1.4,----,..----,---,....---,..-----,
160
i
o
TA - AMBIENT TEMPERATURE - QC
<
E
140
~
z
!
~
120
100
~
~
B
80
60
~
<
~
40
I
20
~
",.
.4
.8
1.2
16
20
24
2.8
),2
V F - FORWARD VOL T AGE - V
IF - SEGMENT DC CURRENT - rnA
Figure 5. Relative Luminous Intensity VB. D.C. Forward ,Current
Figure 4. Forward Current vs. Forward Voltage
For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.
5-30
HDSP-4830/-4840/-4850
V
!dslilllo
Illtlll
HOSPI1Y'O
OPERATION IN
THIS REGION
REaUIRES
HDSP-.4j40
TEMPERATURE
"-\
\
"-
~'O
10
~
DERATING OF
IDe MAX.
J,..
\
1\
'oS>",
1\'<>oS>~
l~oS>
~~
I f\ I
~
1
~
1'\
~r-~~i'A
t:
~<"
~
f\ 1m
~
10,000
1000
100
DC OPERATION
'tp - PULSE DURATION - ~SEC
Figure 6. HDSP-4830/-4840/-4850 Maximum Tolerable Peak Current vs. Pulse Duration
45
"e
iii0:
35
::>
30
0:
"c"
::>
"
"X
""XI
"E"
u
I
iii
"- r\.
25
I
Re'_A = 600'elW/l
15
o
o w
~
~
~
~
~
12
~
10
"
W
00
L
"~
. 'It
~
"I
6
~
4
"E
I
2
o
o
00
10
TA - AMBIENT TEMPERATURE _ °C
"
zw
0:
0:
::>
u
"c
"
::>
~"
"
J!"
45
1.6
40
1.5
35
30
25
40
50
60
70
BO 90 100
~
1.4
iiiC3
1.3
~
1,2
....l
SERIES
/ / HDSP-4840
1
t
t
-I-
~
5w
20
,
10
1.0
I
0.9
~
0.8
1/
HDSP-4SS0 SERies
fA V
1.1
J
0:
15
HDSP-4B30 SERIES
/
w
I
~
30
Figure 8. HDSP-4840 Maximum Allowable D.C. Current per LED
vs. Ambient. Temperature. Deratlngs Based qn Maximum Allowable Thermal Resistance Values, LED Junctlon-to-Amblent on a
.
per LED basis. TJ MAX = 1000 C. .
I
I-
20
TA - AMBIENT TEMPERATURE -'C
Figure 7. HDSP-4830 Maximum Allowable D.C. Current per LED
vs. Ambient Temperature. Deratings Based on Maximum Allowable Thermal Resistance Values, LED Junctlon-to-Amblent on a
per LED basis. T J MAX = 1000 C.
e
-
c
-
,
5
14
a
u
~~
10
RSJ-" 06oo'CIWI$EO+
~
~y
I
1\1
16
I-
Re,••• 4~'CIW/LED
20
~
~ lB
J
I
I-
20
I
40
n
I
.:
0.7
0
0.6
0
o
10
20
30
40
50
60
70
80
90 100
IpEAK - PEAK SEGMENT CURRENT - rnA
TA - AMBIENT TEMPERATURE -'C
Figure 10. Relative Efficiency (Luminous Intensity per UnltCurrent) vs. Peak Segment Current
.
Figure 9. HDSP-4850 Maximum Allowable D.C. Current per
LED ¥s. Ambient Temperature. Deratlngs Based on Maximum
Allowable Thermal Resistance Values. LED Junctlon-to-Ambient
on a per LED basis. T J.MAX = 100°C C.
For a Detailed Explanation on the Use of Dat.a Sheet Inforl)1ation and Recommended
Soldering Procedures, See Application Note 1005:
....
5-31
HDSP-4830/-4840/-4850/-4890
90 r--rr:;HD;:;SP'".-::4S5=O"'1--;
.I./,
rr--r--,-,--,
4.0,-,--r--,-,--,-r--r-.
BO 1--+",SE'j'R",tE;::.Sr----t--I"+-I+-l~+-_1
35
"7 70 f-+-t-f-',+-+-+-t-+---l
Ii
~
60 I--+-+-I--I//'r-/
.-t-;H"'O!;;:SP:;--4S.h;4Q.-I---l
!5
1/- SERIES
50 I-H"'OS:±"P-4";;B;-!c3Q;c-'
~l-llllfH'--+-'''T'='-+--1
:=l-I---tT--1L/~
It
SERIES
'!III
~ 40 f-'=T"-r--'I;,rylH-+-+-t-+---l
2.0
"
~ 30f--r-t-r.~~-t-+-+-t-+---l
~ 20 f-+--tl"hfA'I+--+--I-_I--+-+--1
10
1.5
lhi
2.0
3.0
4.0
• /
1.0
o,:V
Vl
f--r-H. r-t---r-t-t---r-t--1
1.0
L
a
5.0
V
5
L
10
15
20
25
30
35
40
IDC - DC CURRENT PER LED - rnA
VF '- FORWARD VOLTAGE - V
Figure 11. Forward Current vs. Forward Voltage
Figure 12. HDSP-4830/-4840/-4850 Relative Luminous
Intensity vs. D.C. Forward Currenl
Electrical
These versatile bar graph arrays are composed often light
emitting .diodes. The light from each LED is optically
stretched to form individual elements. The diodes in the
HDSP-4820 bar graph utilize a Gallium Arsenide Phosphide
(GaAsP) epitaxial layer on a Gallium Arsenide (GaAs) Substrate. The HDSP-4830/-4840 bar graphs utilize a GaAsP
epitaxial layer on a GaP substrate to produce the brighter
high-efficiency red and yellow displays. The HDSP-4850
bar graph arrays utilize a GaP epitaxial layer on a GaP
substrate. The HDSP-4832/-4836 multicolor arrays have
high efficiency red, yellow, and green LEOs in one package.
The time averaged luminous intensity may be calculated
using the relative efficiency characteristic shown in Figures
3 and 10. The time averaged luminous intensity at TA =
25°C is calculated as follows:
These display devices are deSigned to allow strobed operation. The typical forward voltage values, scaled from Figure4
or 11, should be used for calculating the current limiting
resistor value and typical power dissipation. Expected maximum VFvalues, for the purpose of driver circuit design and
maximum power dissipation, may be calculated using the
following VF MAX models.
Example; For HDSP-4830 operating at IPEAK = 50 mA, 1 of 4
Duty Factor
Refresh rates of 1 KHz or faster provide the most efficient
operation resulting in.the maximum possible time averaged
luminous intensity.
1
r IFAVG
Iv TIME AVG = ~F SPEC AV~('1IPEAK) (Iv SPEC)
'1IPEAK = 1.35 (at IpEAK = 50 mAl
HDSP-4820 (Red)
VF MAX =1.75 V + IPEAK (12.5f1)
For: IPEAK :2: 5 mA
r12.5 mAl
Iv TIME AVG= l1 0 mA (1.35) 2280 !Lcd = 3847 !Lcd
j
HDSP-4830/-4840 (High Efficiency Red/Yellow)
VF MAX = 1.75V + IPEAK(38D)
For IPEAK :2: 20 mA
VF MAX = 1.6V+loc (45D)
For: 5 mA ~ loc ~ 20 mA
HDSP-4850 (Green)
VF MAX = 2.0V + IPEAK (50D)
For: IPEAK > 5 mA
I
For Further Information Concerning Bar Graph Arrays and Suggested Drive Circuits,
Consult HP Application Note 1007 Entitled "Bar Graph Array Applications".
-'-'
5-32
Fli;'
101 ELEMENT
BAR GRAPH ARRAY
HEWLETT
~~ PACKARD
HJPH
RED HDSp·8820
HIGH EFFICIENCY RED HDSP-8825
PERFORMANCE GR~EN HDSP:8835
TECHNICAL DATA
JANUARY 1986
Features
• HIGH RESOLUTION (1%)
• EXCELLENT ELEMENT APPEARANCE
Wide, Recognizable Elements
Matched LEDs for Uniformity
Excellent Element Alignment
• SINGLE-IN-LlNE PACKAGE DESIGN
Sturdy Leads on Industry Standard 2.54 mm
(0.100") Centers
Environmentally Rugged Package
Common Cathode Configuration
• LOW POWER REQUIREMENTS
1.0 rnA Average per Element at 1% Duty Cycle
• SUPPORT ELECTRONICS
Easy Interface with Microprocessors
Description
The HDSP-88XX series is a family of 101-element LED linear arrays designed to display information in easily
recognizable bar graph or position indicator form. The
HDSP-8820, utilizing red GaAsP LED chips assembled on
a PC board and enclosed in a red polycarbonate cover
with an epoxy backfill seal, has 1.52 mm (0.060 inch) wide
segments. The HDSP-8825 and HDSP-8835 are high efficiency red and high performance green respectively, each
with a 1.02 mm (0.040 inch) segment width. The HDSP8825 and HDSP-8835 have a clear polycarbonate lens.
Mechanical considerations and pin-out are identical
among all 3 devices. The common cathode chips are
addressed via 22 single-in-line pins extending from the
back side of the package.
Applications
o INDUSTRIAL PROCESS CONTROL SYSTEMS
o EDGEWISE PANEL METERS
o
INSTRUMENTATION
o POSITION INDICATORS
o FLUID LEVEL INDICATORS
Package Dimensions (1, 2)
MAGNIFIED ELEMENT DESCRIPTION!
5-33
Internal Circuit Diagram 15,61
C'~
co
1
Device Pin Description
PIN
LOCATION
@A
~
;g: A,
At
~
~ A,
i;j
A3
~
I"
~
LA
~
[
As
As
~
A7
7
As
31
Ag
27 AlO
Cl0
S
N
::
LA
IA
:"
~
LA
C200-1
C30®-f
SIX ADDITIONAL
GROUPSOF
TEN ELEMENTS
C40@)--l
C50@)--l
C60@--1
C70@--1
C80 33
1
1
1
I
I
I
I
N
LA
~
iA
:~
C90
"'
iA
L<
c:
I"
0'" PIN NUMBER
NOTES:
5. ELEMENT LOCATION NUMBER ~ COMMON CATHODE NUMBER + ANODE NUMBER,
FOR EXAMPLE, ELEMENT 83 IS OBTAINES BY ADDRESSING CSO AND A3.
6. A' AND C' ARE ANODE AND CATHODE OF ELEMENT ZERO.
5-34
FUNCTION
1
2
3
C'(6)
4
No Pin
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
C10
A1
A8
CO
A4
No Pin
C20
No Pin
A'(6)
No Pin
C30
No Pin
A7
No Pin
C40
No Pin
A2
No Pin
C50
No Pin
A3
No Pin
C60
No Pin
A10
No Pin
C70
No Pin
A9
No Pin
C80
A5
A6
No Pin
C90
Absolute Maximum Ratings
Parameter
HOSP·SS20
HOSP·SS25
Average Power per Element (TA "" 25· C)
15mW
20mW
HOSP·S835
20mW
Peak Forward Current per Element
(TA "" 25"0)17 1(Pulse Width:5 300 psI
200mA
150mA
1S0mA
7mA
5mA
SmA
Operating Temperature Range
-40· to +850 C
Storage Temperature Range
-40· to +85·C
-40" to +85" 0
-400 to+85.C
-40. to +850C
Average Forward Current per E'iement
(TA"" 25" C)[81
Reverse Voltage per Element or DP
Lead Solder Temperature 1.59 mm [1.16 inch]
below seating plane[Sl
-40" to +85· C
5.0 V
5.0V
S.OV
260· C for 3 sec.
260" C tor 3 sec.
260' C for 3 seo.
Notes:
7. See Figures 1 and 2 to establish pulsed operating
conditions.
8. Derate maximum average forward current above TA = 70 0 C
at 0.16 mAIO C/Element for the HDSP-8820 and 0.11
mN°C/Element for the HDSP-882s and HDSP-883s. See
Figures 3 and 4.
9. Clean only in water, Isopropanol, Ethanol, Freon TF. or TE
(or equivalent) and Genesolv DI-ls or DE-IS (or equivalent),
See mechanical section of this data sheet for Information on
wave soldering conditions.
Electrical/Optical Characteristics at TA
25°C
RED HDSP-8820
Para"",ier
Time averaged Luminous Intensity per Element
(Unit average) [Ill)
Symbol
Test Conditions
Min.
IV
100 mA Pk.: 1 of 110
Duty Factor
8
Peak Wavelength
Dominant Wavelength [111
APEAK
Max.
20
Ad
VF
IF'" 100 mA
Rel/erse Voltage per Element
VR
AVF/oC
tR" 100 pA
640
1.7
om
2.1
3.0
V
V
·2.0
700
R6J-PIN
Units
pod
nm
655
Forward Voltage per Element
Temperature cOefficient VF per Element
Thermal Resistance LEO Junetlon-ta-Pin
Typ.
'.eml
LED
HIGH EFFICIENCY RED HDSP-8825
Parameter
Time averaged Luminous Intensity per Element
(Unit average) [WI
Peak Wavelength
Dominant Wavelength (111
SymbOl
IV
Test Conditions
100 mA Pk.: 1 of 110
Duty Factor
Typ.
60
175
pod
635
626
2.3
nm
nm
APEAK
Ad
Forward Voltage per Element
VF
IF = 100 mA
Reverse Voltage per Element
VR
IR"" 100 pA
I
Max.
Min.
3.0
3.1
UnllS
V
V
Temperature Coefficient VF per Element
.lVF'oC
-2.0
mVrC
Thermal Resistance LED Junctlon-to-Pin
Rt)J-PIN
1000
·elWf
LEO
5-35
Electrical/optical Characteristics at TA
25° C (continued)
HIGH PERFORMANCE GREEN HDSP-8835
Parameter
Time Averaged Luminous Intensity per Element
(Unit average) [101
Peak Wavelength
Dominant Wavelength 1111
Symbol
Tesl Conditions
Min.
Typ.
IV
100 rnA Pk.: 1 of 110
Duty Factor
70
175
Max.
Units
j.lcd
/l.PEAK
568
nm
Ad
574
nm
Forward Voltage per Element
VI'
IF"" 100 mA
Reverse Voltage per Element
IF = 100 itA
Temperature Coefficient VF per Element
VR
J.VF/·C
Thermal ReSistance LED JUnction-ta-Pin
R('}J-PIN
2.3
3.0
3~
V
-2.0
mVl·C
1000
·C/WI
LED
Notes:
10. Operation at peak currents olless than 100 mA may cause intensity mismatch. Consult factory for low current operation.
11. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color
of the device.
i.OPERATION IN
~
"I
THIS REGION
REQUIRES
T. EMPERATURE
DERATING OF
Icc MAX.
tp - PULSE DURATION - p.sec
Figure 1. Maximum Tolerable Peak Current
VS.
Pulse Duration HDSp·8820
~~
~~ mRII.m~
:s
~~
I OPERATION IN
ffig
37
~~~6SU~~~~ON
~
:::E
30
"
~~
TEMPERATURE
DERATING
OF Icc MAX.
x"
~'~
u. ....
oz
Q~
'"
"'u
""
....
tp - PULSE DURATION -
~sec
Figure 2. Maximum Tolerable Peak Current vs. Pulse Duration HDSP·8825 and HDSP-8835
5-36
10
10
"EI
"EI
~
~
:i
:ia:
r--..
a:
a:
=>
"::;"c
7.
=>
:;
a:
=>
""c
:;
ROJA • 20WCiWILEO
""-
=>
::;
~.
::;
x
"
::;
I
ROJA. '" 2000~ClW/lED
I
w
.s
.s
10
20
3D
40
50
60
70 80 8590 100
TA - AMBIENT TEMPERATURE -
10
gc
20
30
40
50
60
70 808590 100
TA - AMBIENT TEMPERATURE -'C
Figure 4. Maximum Allowable D.C. Current per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance, LED Junction-toAmbient on a per LED basis. T JMAX "" 115' C
HDSP-8825/HDSP-8835
Figure 3. Maximum Allowable D.C. Current per LED vs.
Ambient Temperature. Deratings based on Maximum
Allowable Thermal Resistance, LED Junction-to-.
Ambient on a per LED basis. T JMAX = 115' C·
HDSP-8820
200
1.2
HDSP-8S25\.
1.1
I
>-
1ii"
1.0
1l0SP-8S20
OJ
0.9
*'"
0.9
c=>
z
:E
"-'w
>
~
ula:
~
vi /
HDSP-a636
"
i-o""
E
...zI
!I
w
a:
a:
IlDSP-8S20
""0
a:
,},
0.7
/I"
0.6
t'HOSP-S8:l5
I I
I
0.4
0.3
0.2
o
20
40
60
~
c--- r-- c---
140
120
";:a:
100
'"~
60
12
'HOsP-8a2S
0.5
190
I
~
90
HOSP-8820
~
~
40
20
o
80 100 120 140 160 180 200
,..-
160
II
D
-
1"'1I0SP-8825
HDSI'_
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VF - PEAK FORWARD VOLT AGE - V
IpEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 5. Retative Efficiency (Luminous Intensity per Unit Current) vs. Peak Segment Current
Figure 6. Forward Current vs. Forward Voltage
For A Detailed Explanation on the Use of Data Sheet Information, See Application Note 1005.
5-37
operational Considerations
ELECTRICAL
The HDSP-88XX is a 101 element bar graph. array. The
linear array is arranged as ten groups of ten LED elements
plus one additional element. The ten elements of each
group have common cathodes. Like elements in the ten
groups have common anodes. The device is addressed via
22 single-in-line pins extending from the back side of the
display.
This display is designed specifically for strobed (multiplexed) operation. Minimum peak forward current at which
all elements will be illuminated is 15 mA. Display aesthetics are specified at 100 mA, 1/110 DF, peak forward
current. The typical forward voltage values, scaled from
Figure 6 should be used for calculating the current limiting
resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following VF model:
HDSP-8820
VFMAX = 2.02 V + IPEAK (0.8 !1)
For IpEAK > 40 mA
HDSP-8825
VFMAX = 1.7 V + IPEAK (14!1)
For IpEAK > 40 mA
HDSP-8835
VFMAX = 1.7 V + IPEAK (14 0)
For IPEAK > 40 mA
The time averaged luminous intensity at TA = 25°C may
be calculated using:
Iv Time Avg. = [ I
IF-AVG
]
• 1)IPEAK . IV-SPEC
F-SPEC-AVG
where 1), relative efficiency, may be determined from Figure 5.
The circuit in Figure 7 displays an analog input voltage in
bar graph form with 101 bit resolution. The 74390 dual
decade counter has been configured to count from 0 to
99. The 10 outputs correspond to "ones" and the 20 outputs correspond to "tens". The "one" outputs from the
counter drives the display element anodes through a 7442
1 of 10 BCD decoder. Sprague UDN2585 drivers source
the anodes with 80 mA peaklsegment. The "ten" outputs
from the counter drive the group cathodes through a
74145 BCD decoder. The circuit multiplexes segments 100
to 91 first, then segments 90 to 81, and so on with segments 10 to 1 last. During the time that the output from the
T.r. TL507C AID converter is low the corresponding display elements will be illuminated.
The TL507C is an economical AID converter with 7 bit
resolution. The single output is pulse-width-modulated to
correspond to the analog input voltage magnitude. With
Vcc = 5 V the analog input voltage range is 1.3 V to 3.9 V.
The TL507C output is reset each time the 74390 resets.
Duration of the high output pulse is shorter for larger
analog input voltages. A high output from the TL507C disables the display by forcing the 7442 inputs to an invalid
state. Hence, as the analog input voltage increases more
elements of the bar graph display are illuminated. Display
element zero is DC driven.
The circuit in Figure 8 uses the HDSP-88XX as a 100 bit
position indicator. Two BCD input words define the position of the illuminated element. Display duty factor, 1/100,
is controlled by the ENABLE signal.
MECHANICAL
Suitable. conditions for wave soldering depend on the specific kind of equipment and procedure used. A cool down
period after flow solder and before flux rinse is recommended. For. more information, consult the local
Hewlett-Packard Sales Office or Hewlett-Packard Optoelectronics, Palo Alto, California.
5-38
Vee
1
l
Vee
lKUf
390n
L
NE555
18
Vee
74390
4 lB
10A 3
~2A
; R
~28
D
6 TH
2
I
10. 5
lOe 6
1 lA
OUT 3
TR
F~C.v.GNP
~.05"F
100 7
15 A
0
14 B
1
2
~c
3
,_
f'~'
-=1-
-=
14 ClRz
lOA 13
11
2a" 10
20e 9
3
~
5
l'
.01"F
Ion
9
~
4
5
12 0
6
7
6
-
200
1
18
2
2
17
3
4
3
16
4
15
5
5
14
6
6
7
9
7
13
12
6
11
p.!.!!-
~
~ IS
~ eLfI
,
10
13
1
18
19
117
6
15
74Ls32
20pF 14
~
9
A
14 B
12
C
5
4
3
2
D
i
1
I'471-1F
13
5
21
4
3
25
2
33
17
29
37
820n '1
Vee
VCC1
e,.
C1')
C40
C50
Coo
C70
Ceo
e,.
At
~C'
0l)T4
A
C
Ie.
"---
SKU
l~
IN
AI
: C,.
7
6
,,
0
Vee
11
10
8
9
1
6
13
5
A,
-=
9_
10J , 8
,----2-'A
AN ALOG
IN PUT
A.
34
2 110
23 A4
A,
10 UDN 2585
AIC
'EN
A,
15
35 A7
2
'---C
"----f
A,.
31
A.
7
-=
10Kn
~
27
10
9p!.!
L);
Vee
HDSP-88XX
UDN 2585
1
Tl507C
GNU
3
-=
Figure 7. 101 Element Bar Graph
5-39
Ion
Vee
I
7442
0
15
14
f
B
BCD
DATA
1
:
-
2J
r--r
~
,Ii.
2
3
S
4
$
~C
4_
5.1
1
8
7
12
rs
1
2
17
19
3
3
16
23
4
4 UDN_ 15
5
14
34
6
6
13
35
7
7
12
15
9
8
11
7
1Ip!2-
74lS32
e
2
EflAl!U
18
All
As
A.
As
31 At
,jUDN - 1 t 7
NESS!>
D
6 TH OUT
AJ
AO
~
,~ 9
1
300Kn
A2
1'0
Vee
R Vcc
6 A,
5
3~
D
18
1
2
27 AtO
7
3 KG
1'0
~
2 fR
5
;--
.001 pF
1
9
eNciND
~'
-=-
15
'Ii
A
a
1
14
B
a
BCD
DATA
13
C
12
D
L-
8
$
4
C
D
3
2
1
0
Figure 8. 100 Element Position Indicator
5-40
jI1DSP-88JO(
~
74145
11
37
10
33
9
29 C7(I
7
25
6
21
5
17
4
13
3
Coo
Coo
Ceo
Coo
Coo
Can
2
9 C""
5
1
Ie,.
Ct.
DOUBLE HETEROJUNETION AIGaAs
LOW EURRENT 10-ELEMENT
BAR GRAPH ARRAY
AIGaAs RED HLCP-J100
Features
• LOW POWER CONSUMPTION
Typical Intensity of 1.0 mcd @ 1 mA Drive Current
•
•
•
•
•
DEEP RED COLOR
END-STACKABLE
EXCELLENT ON-OFF CONTRAST
WIDE VIEWING ANGLE
MATCHED LEOs FOR UNIFORM APPEARANCE
Description
The solid state 10-element LED bar graph array utilizes
HP's newly developed double heterojunction (OH) AIGaAs/
GaAs material technology. The material is characterized
by outstanding light output efficiency over a wide range of
drive currents. Use of these bar graph arrays eliminates
the alignment, intensity and color matching problems associated with discrete LEOs. Typical applications are found
in office equipment, instrumentation, industrial controls,
and computer peripherals where portability or battery
backup are important considerations.
package Dimensions
1. DIMENSIONS IN MILLIMETERS (INCHES)
2. ALL UNTOLERENCEO DIMENSIONS FOR
REFERENCE DNLV.
r
6, to + 0.25
IQ.24
M-I0.G15)
I
I
1.62 ± 0.38
I - i {O.3OO, MiSl
2.&4+0.26
IO.loo±O.010)
5-41
Absolute Maximum' Ratings
Average Power Dissipation per LED
(TA = 25 0 C)[1) ............................... 37 mW
Peak Forward Current per LED .................. 45 mA
DC Forward Current per LED ................... 15 mA
Operating Temperature Range ......... -20° C to +100° C
Storage Temperature Range ..... '...... -55° C to +100° C
Reverse Voltage per LED .......................... 5 V
Lead Soldering Temperature (1.59 mm (1/16 inch)
below seating plane ................ 260° C for 3 sec.
Noles:
1, For pulsed operation, derate above TA = 87' e at 1.7 mW/' e
per LED.
.
2. See Figure 1 to establish pulsed operating conditions.
3. For De operation, derate above TA = 91'e at 0.8 mA/'e per
LED.
Internal Circuit Diagram
N'
~!b
~
.
:;:d
v
•
f
•
h
",i i
10
Ii
VI
PIN
1
20
2
3
4
5
6
7
8
9
19
18
17
16
15
to
FUNCTION
ANODE-.
ANODE-b
ANODE-c
AI'.)ODE-d
ANODE-e
ANODE-f
ANODE-g
ANODE-h
ANODE- i
ANODe-!
PIN
g
13
14
15
16
17
18
19
20
FUNCTION
CA1HODE-/
CATHODE-;
CATHODE-h
CATHODE~9
CATHODE-f
CATHODE-.
CATHODE-d
CATHODE-e
CATHODE-b
CATHODE-.
14
13
12
11
Electrical/Optical Characteristics at TA = 25°C
Parameter
luminous Intensity per LED
(Unit Average)!1)
Peak Wavelength
Dominant Wavelength(2)
Forward Voltage per LED
Reverse Voltage per LED
Symbol Test Conditions
Min.
Typ.
600
1000
5200
pcd
ApEAK
645
nm
Ad
637
nm
IF"1 mADC
IF - 20mA Pk;
1 of 4 Duty Factor
Iv
VF
IF=1 mADC
IF- 20 mA Pk
1 of 4 Duty Factor
VR
IR"100/LA
Max.
Units
1.6
1.a
5
2.2
V
V
Temperature Coefficient VF per LED
AVF/'C
-2.0
mVl'C
Thermal Resistance LEO Junction-to-Pin
R0J-PIN
300
"CIWILEO
Notes:
4. These devices are categorized for luminous intensity with the intensity category designated by a letter code on the side of the
package.
5. The dominant wavelength, Ad, is derived from the elE chromaticity diagram and is that single wavelength v.:hich defines the color of
the device.
5-42
HLCP-J100
8
19~~~
7
S~~rn=i::=j-;;;;;;.;:;:;;;;-d;,
1===
OPERATION IN THIS
REGION REQUIRES
TEMPERATURE DERATING
OF IDC MAX
11~~~~1~0-i~~~~~~~~~
tp - PULSE DURATION - "'
Figure 1. Maximum Allowed Peak Current vs. Pulse Duration
15
..
Ru
E
...2I
LJChV1L~ f..--
"I II
10
Rs... •
w
a:
a:
./
600"ChV1LED
1.2
~\
1.0
I
-
-
>
"2
w
OJ
0.8
w
w
O.S
u:
u.
:::I
""
-
r--
>
C
I
5
~
0.4
w
a:
:Ii
J
0.2
020
30
40
50
SO
70
so
TA - AMBIENT TEMPERATURE _
90
100
10
°c
Figure 2. Maximum Allowed DC Current per LED vs. Ambient
Temperature, Deratlngs Based on Maximum Allowable
Thermal Resistance Values, LED Junctlon-to-Amblent
on a per LED Basis, T JMAX = 1100 C
20
3D
40
PEAK CURRENT PER LED (mAl
Figure 3. Relative Elllclency (Luminous Intensity per Unit
Current) VB. Peak Segment Current
1I
~
w
a:
a:
:::I
"
~
~
Ii?
a:
I
v, -
FORWARD VOLTAGE - V
Figure 4. Forward Current VB. Forward Voltage
. DC CURRENT PER LED ImAI
Figure 5. Relative Luminous Intensity vs. DC Forward Current
For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.
5-43
Electrical
These versatile bar graph arrays are composed of ten light
emitting diodes. The light from each LED is optically
stretched to form individual elements. These diodes have
their P-N junctions formed in AIGaAs epitaxial layers grown
on a GaAs substrate.
.
'
These display devices are designated to allow strobed
operation. The typical forward voltage values. scaled from·,
Figure 4. should be used for calculating the current limiting
resistor value and typical power dissipation. Expected maximum VF values. for the purpose of driver circuit design and
maximum power dissipation. may be calculated using the
following VF MAX models.
The time averaged luminous intensity may be'balculated'
using the relative efficiency characteristic shown in Figure
3. The time averaged luminous intensity at TA = 25°C is
, calculated as follows:
[
.
Iv TIME AVG = I
IFAv~ '~
' ('11 PEAK) (Iv SPEC)
FSPECAVG ,
Example: 'For HLCP~J100ciperating at IpEAK = 45 mAo 1 of 3
Duty Factor
'1IPEAK = 0.94 (at IpEAK = 45 mAl
VFMAX = 1.8 V + 'F (20 0). IF S; 20 mA
15 mA]
: Iv TIME AVG= [ ~ (94) 1000 !tcd = 1410 !tcd
V FMAX = 2.0 V + 'F (10 0). IF 2: 20 mA
Refresh rates of 1 KHz or faster provide the most efficient
operation resulting in the maximum possible time averaged
luminous intensity.
For Further Information Concerning Bar Graph Arrays and Suggested Drive Circuits,
, consultHP Applicatlon,Note 1007 Entitled "Bar Graph Array Applications",
.'
;';'\'
'5-44
SINGLE CHIP LED LIGHT BAR
HIGH
EFFICIEN~Y
REQ.iHLMP-T2QQS
YELLOW···HLMP-T300··S
O~~~QE HLMP0S
S
HIGH PERFORMANCE GREENH[
00 SERIES
Features
• FLAT RECTANGULAR LIGHT EMITTING
SURFACE
• CHOICE OF 4 BRIGHT COLORS
• EXCELLENT ON/OFF CONTRAST
• IDEAL AS FLUSH MOUNTED PANEL
INDICATORS
• LONG LIFE: SOLID STATE RELIABILITY
• SOLDER COATED LEADS
Description
Applications
The HLMP-T200/-T300/-T400/-T500 light bars are rectangular light sources designed for a variety of applications
where this shape and a high sterance are desired. These
light bars consist of a rectangular plastic case around an
epoxy encapsulated LED lamp. The encapsulant is tinted to
match the Golor of the emitted light. The flat top surface is
exceptionally uniform i.n light emission and the plastic case
eliminate~ light leakage froin the sides of the device.
• BAR GRAPHS
• FRONT PANEL STATUS INDICATORS
• TELECOMMUNICATIONS INDICATORS
• PUSH BUTTON ILLUMINATION
• PC BOARD IDENTIFIERS
.• BUSINESS MACHINE MESSAGE
ANNUNCIATORS
Package Dimensions
,-
r
3.55
10.140)
t
f
03S
1.65
(0.0651
~~~~R
nn
E
NeE
CATHODE
NOTES:
1. DIMENSIONS ARE IN MILlIMETRES {lNCHESI.
2. TOLERANCES ARE '0.25 mm (,0.010 INCHI
UNLESS OTHERWISE NOTED.
&.73
~O.OISJ
(0.265)
m
I
----r
.;
--J
5-45
1
20.0
(0.780) MIN.
i
(O~O~~) Tvp.Ji~ i (O'; ';~)
SQ.
I
~
+
NOM.
2.54 NOM.
~IO.l00)
Electrical/Optical Characteristics at TA =25°C
DevIce
Symbol
Description
HLMP-
MIn.
~p.
Iv
Luminous Intensity
High Efficiency Red
T200
3.0
4.8
Orange
T400
3.0
4.8
Yellow
T300
3.0
6.0
Green
T500
3.0
6.0
201/2
>'PEAK
~
TS
C
Included Angle
Between Half
Luminous Intensity
Points
Peak Wavelength
Dominant Wavelength
Speed of Response
capacitance
All
100
High Efficiency Red
Orange
Yellow
Green
635
612
Max.
583
Unlta Test CondIIIons
moo
IF= 20mA
Deg.
I,," 20 inA
See Note 1
nm
Measurement at Peak
nm
See Note 2
565
High Efficiency Red
Orange
Yellow
Green
626
608
585
569
High Efficiency Red
Orange
Yellow
Green
350
350
ns
390
870
High EfficIency Red
Orange
Yellow
Green
"
pF
11
120
'OIW
R6JC
Thermal Resistance
All
Vf
Forward Voltage
HER/Orange
Yellow
Green
VR
Reverse Breakdown Volt.
All
'Iv
Luminous Efficacy
High Efficiency Red
Orange
Yellow
Green
4
8
1.5
1.5
2.2
2.2
2.6
1.6
5.0
2.3
2.6
2.6
VF"'O; f= 1 MHz
Junctlon to Cathode
Lead at Seating Plane
V
IF "'20 mA
V
'R" 100 I4A
145
262
500
59S
IUll'I$ns
-watt
See Note 3
Notes:
1. 0112 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of
the device.
3. Radiant intensity,_ 'e, in watts/steradian, may be found from the equation Ie = 'v/~v, where Iv is the luminolis intensity in candelas and ~v is
the luminous efficacy in lumens/watt.
5-46
Characteristics at TA = 25°C
'·'1-·------,--"""--"""-,-..,...,.--..,....,.--,---'------,...-------,
HIGH
£FFIC~ENCY
"EO
0.5
o
750
700
500
Figure 1. Relative Intensity vs. Wavelength.
High Efficiency Red, Orange, Yellow,
and Green Light Bars
90
II
0
0
z'"
WE
10
1.0
ZN
~~
~~.
,,-
-N
:0-'
-,'"
w"
5"
V~
4.0
u
'.0
w
>
.,/
.5
"
3.0
,.,
*~
1.0
W
/..J
2.0
/
1.5
>"
_0
.t
>u
ffi
00
ZW
Ii
0
2.0
1-0
""j
0
o
GRE~±- -
in-
Ii ~
RI'D.
ORANGE
~~~~e
V£llOW
1.2
>
t-
YELLOW
60
40
1.3
;
0
5.0
......V
"
~
~ ~-
1/
0.•
0 .•
0.7
0.6
-
\ GRE1N
f-- l -
II
f
~
'"
10
.\ .'
0.5
15
20
25
30
VF -FORWAROVOLTAGE-V
10
IpEAK -
~
~
~
60
M
m
80
00
PEAK CURRENT PER LED - rnA
Icc - DC CURRENT PER LED - rnA
Figure 2. Forward Current vs. Forward
Voltage Characteristics.
Ip - PULSE DURATION -
Figure 3. Relative Luminous Intensity
vs. DC Forward Current.
Figure 4. Relative Efficiency (Luminous
IntenSity per Unit Current) vs.
LED Peak Current.
jJ.S
Figure 6. Relative Luminous Intensity vs.
Angular Displacement.
Figure 5. Maximum Tolerable Peak Current vs. Pulse
Duration. (I DC MAX as per MAX Ratings).
5-47
Absolute Maximum Ratings at TA = 25°C
High Efficiency Red!
Orange
Yellow
Green
Peak Forward Current
90
60
90
mA
Average Forward Currentl1]
25
20
25
mA
Parameter
Units
DC Current[2j
30
20
30
mA
Power Dissipation [3J
135
85
135
mW
Operating Temperature Range
-40 to +85
-40 to +85
-20 to +85
Storage Temperature Range
-55 to +100
-55 to +100
-55 to +100
·C
Rel/erse Voltage (IR" 100 /LA)
5
V
Transient Forward Currentl4J
(10/Lsec Pulse)
500
mA
Lead Soldering Temperature
{1.6 mm (0,063 In.) below
seating planel
260" C for 3 seconds
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2, For Red, Orange, and Green derate linearly from 50" C at 0,5 mA!" C. For Yellow derate linearly from 50" C at 0,34 mAIo C. ,
3, For Red, Orange, and Green derate power linearly from 25°C B1.1.6 mWi~b. For,yellow derate power linearly from 50°C at 1.1;> mWrC,
4, The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond, It is not recommended that the device be operated at peak currents beyond'the peak 'forward current listed in: the
Absolute Maximum Ratings,
'
'.
Electrical
Mech~lni~al
The typical' forward voltage values,: scaled from Figure 2,
should be used for calculating· the current limiting resistor
values and typical, power dissipation. Expected maximum
VF values for the purpose of driver circuit design and .
maximum 'power dissipation may be calcullited using'the
.
following VF models:
These light. bar 'devices may be operated in ambient
temperatures above +50° C without derating when installed
in a PC board configuration that provides a thermal re~
sistance (junction' to ambient) valueless thari625° C/W.
VF = 1.8V + IpEAK (400)
For IpEAK <': 20mA
VF =; 1.6V + IDe (500)
For5 mA~ loe~ 20 mA
optical'
The radiation paiternfor these light bar devices is approximately Lambertian. The luminous sterance may be calculatedusing one of the two following formulas:
L ( d/ 2). = Iv: (Cd) .
v c m . A (m2)
To optimize device optical performance, speCiallydevel. oped plastics are used which restrict the solvents 'that may
be used for cleaning .. It is recommended, that only mixtures of. Freon (F113) and alcohol be used ·for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum.' Some suggested
vapor cleaning solvents are Freon TE, Genesolv DI-15 or
DE-15, Arklone A or K. A,60°C,(140°F) water. cleaning
process may also be used, which includes. a 'neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplis~ed with Freon T-E35.orT-P35, Ethanol,
Isopropanol or water with a mild detergent: '
_ 7Tlv(cd)
Lv (footlamberts) - A (ft2)
Size of light emitting area (A)= 3.18 mm x 5.72 mm
.
= 18.19 x 10c6 m 2
,; 195.8x 10-6 ft2'
"i."
5-48
- - _ .._ - - - - _ . _ . _ - - - _ . _ - - - - - ----.-.
-n.~
E~
HEWLETT
PACKARD
PANEL AND
LEGEND MOUNTS FOR
LED LIGHT BARS
HlMP-2598
HlMP-2599
HlMp·2898
HLMP-2899
Features
• FIRMLY MOUNTS LIGHT BARS IN PANELS
• HOLDS LEGENDS FOR FRONT PANEL OR
PC BOARD APPLICATIONS(1)
• ONE PIECE, SNAP-IN ASSEMBLY
• MATTE BLACK BEZEL DESIGN ENHANCES
PANEL APPEARANCE
• FOUR SIZES AVAILABLE
• MAY BE INSTALLED IN A WIDE RANGE OF
PANEL THICKNESSES
• PANEL HOLE EASILY PUNCHED OR MILLED
Description
This series of black plastic bezel mounts is designed to
install Hewlett-Packard Light Bars in instrument panels
ranging in thickness from 1.52 mm (0.060 inch) to 3.18 mm
(0.125 inch). A space has been provided for holding a 0.13
mm (0.005 inch) film legend over the light emitting surface
of the light bar module.
Selection Guide
Panel and Legend
Mount Part No.
HLMP-
Corresponding Light Bar
ModUle Part No.
HLCP- HLMP-
Panel Hole Inslallation
Dimensions(2)
Package
Outline;
2598
9100
2350,2450,2550
7,62 mm 10.300 inch, x 22.86 mm ,0,900 inch,
2599
Al00
2300,2400,2500
7.62 mm 10.300 inch, x 12,70 mm {0.500 inch,
ia::l
CI
A
2898
0100
0100
2600,2700,2800
2655,2755,2855
2950,2965,2980
12.70 mm '0.500 inch, x 12.70 mm ,0.500 inch,
[]
C
CI
0
B
El00
2899
2620,2720,2820
2635,2735,2835
G100 2670,2770,2870
Hloo 2685,2785,2885
Floo
12.70 mm 10.500 inch, x 22.86 mm ,0.900 inch'
Notes:
1. Application Note 1012 addresses legend fabrication options.
2. Allowed hole tolerance: +0.00 mm, -0.13 mm (+0.000 inch, -0.005 inch). Permitted radius: 1.60 mm (0.063 inch).
5-49
Package Dimensions
tI~:~:21
J - - 16.86 ---l
I
(0.7421
l_t..---I~li
1.:""",;;;;;;;;='"
j
illl
TOPB
SIDEA,B
I - 23.88. 0.25 -----l
I
10.94(h 0.0101
I
Tope
I~I
TOP D
NOTES, ,. DIMENSIONS IN MllllMETRES {INCHES}
2. I)r-rrOlERANCED DIMENSIONS ARE FOR
o
I1I
11----1
0.16
(O.030r-
6.22. 0.25
1(0.245. 0.0101
o
...
SIDEC,D
REFEAENCEONLV.
Mounting Instructions
1. Mill 131 or punch a hole in the panel. Deburr. but do not
chamfer. the edges of the hole.
Installation Sketches
2. Place the front of the mount against a solid. fiat surface.
A film legend with outside dimension~ equal to the outside dimensions of the light bar may be placed in the
mount or on the light bar light emitting surface.
Press the light bar into the mount until the tabs snap
over the back of the light barl41. When inserting' the
HLMP-2898. align the notched sides of the light bar
with the mount sides which do not have the tabs).
(See Figure 1)
3. Applying even pressure to the top of the mount. press the
entire assembly into the hole from the front of the paneil5 J.
(See Figure 2)
NOTE: For thinner panels. the mount may be pressed into
the panel first. then the light bar may be pressed into the
mount from the back side of the panel.
Notes:
3. A 3.18 mm (0.125 inch) diameter mill may be used.
4. Repetitve insertion of the light bar into mount may cause
damage to the mount.
5. Repetitive insertion of the mount into the panel will degrade the
retention force of the mount.
Figure 1. Installation of a Light Bar Into a Panel Mount
Suggested Punch Sources
Hole punches may be ordered from one of the following
sources:
Danly Machine Corporation
Punchrite Division
15400 Brookpark Road
Cleveland. OH 44135
(216) 267-1444
Ring Division
The Producto Machine Company
Jamestown. NY 14701
(800) 828-2216
Porter Precision Products Company
12522 Lakeland Road
Santa Fe Springs. CA 90670
(213) 946-1531
Figure 2: Installation of the Light Bar/Panel Mount Assembly into
a Front Panel
Di-Acro Division
Houdaille Industries
800 Jefferson Street
Lake City. MN 55041
(612) 345-4571
5-50
LIGHT BAR LEGENDS
STANDARD OPTIONS FC>R:
HLCP-A100ZHLMP-2300/-24QO/-25QO SE~IES
HLCP-C100/HLMP-26SS/-27S5/-28SS S~~IES
HLCP-H100/HLMP-2685/-278S/-2885 SERIES
Features
• FACTORY INSTALLATION SAVES TIME IN
MANUFACTURING, PURCHASING AND
STOCKING
.qta.
..
i~.,r'''~:
• LIGHT OR DARK FIELD FORMAT (DARK FIELD
STANDARD)
• HIGH STRENGTH ADHESIVE BACKING
o CUSTOM LEGENDS AVAILABLE
Description
option Guide
Light bar legends are available with factory installation on
all light bars, using either standard or custom legends.
Options LOO through L06 address our standard legend
formats and can be specified for various size light bars in
accordance with the Device/Option Selection Matrix.
Option
Legend Title
LOO
L01
L02
L03
L04
L05
L06
ON
OFF
READY
HIGH
LOW
RESET
STOP
Ordering Information
To order light bar legends, include the appropriate option
code along with the device catalog number. Example: to
order the HLMP-2655 with the "OFF" legend, order as follows: HLMP-2655 Option L01. Minimum order quantities
vary by part number.
For custom legends, please contact your local HewlettPackard sales office or franchised Hewlett-Packard
distributor.
Ratings and Characteristics
The absolute maximum ratings, mechanical dimensions and
electrical characteristics for light bars with legends are the
same as for the standard catalog devices. Refer to the basic
data sheet for the specified values. For use in applications
involving high humidity conditions, please contact your
Hewlett-Packard representative.
As with the standard light bar devices, the radiation pattern is
approximately Lambertion. The luminous sterance for a
given device is the same as for the standard light bar
products. To calculate this value, refer to the "Optical"
section of the LED Light Bars data sheet in this catalog.
5-51
Dimensional specifications for Legends
HLMP-2300 Series
HLMP-2655 Series
NOTE: A~~ OIMENSIONS IN MILl.IMETfles IINCHES)'
HLMP-2685 Series
Device/Option Selection Matrix
Applicable Light Bar Series
Option
Legend
HLMP-2300/·2400/2500
HLCP'A100
HLMP-2655/·2755/-2855
HLCP·C100
HLMP·2685/-2785/-2885
HLCP·H100
LOO
L01
L02
L03
LQ4
L05
LOS
ON
OFF
X
X
X
X
X
X
X
X
X
X
X
X
READY
HIGH
LOW>
RESET
STOP
X
X
X
5-52
X
INTENSITY SELECTED LIGHT BARS
Features
Luminous intensity selection is available for high efficiency
red, yellow, and high performance green.
• INTENSITY SELECTION IMPROVES
UNIFORMITY OF LIGHT OUTPUT FROM
UNIT TO UNIT. AVAILABLE IN HIGH
EFFICIENCY RED, YELLOW, AND HIGH
PERFORMANCE GREEN.
• TWO CATEGORY SELECTION SIMPLIFIES
INVENTORY CONTROL AND ASSEMBLY.
To ensure our customers a steady supply of product, HP
must offer selected units from the center of our production
distribution. If our production distribution shifts, we will
need to change the intensity range of the selected units our
customers receive. Typically, an intensity may have to be
changed once every 1 to 3 years.
Current intensity selection information is available through a
category reference chart which is available through your
local field sales engineer or local franchised distributor.
Description
Light bars are now available from Hewlett-Packard which
are selected from two adjacent intensity categories. These
select light bars are basic catalog devices which are presorted for luminous intensity then selected from two
predetermined adjacent categories and assigned to one
convenient part number.
Example: Two luminous intensity categories are selected
from the basic catalog HLMP-2300 production distribution
and assigned to the part number HLMP-2300 option S02.
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings, mechanical dimensions,
and electrical/optical characteristics are identical to the
basic catalog device.
Selected light bars are ideal for applications which require
two or more light bars per panel.
Device Selection Guide
The following table summarizes which basic catalog devices are available with category selection.
Package
4 Pin In-Line
8 Pin In-Une
8 Pin DIP
Dual Arrangement
16 Pin DIP
Quad Arrangement
16 Pin DIP
Dual Bar Arrangement
8 Pin DIP
Square Arrangement
16 Pin DIP
Dual Square Arangement
16 Pin DIP
Single Bar Arangement
Yellow
AIGaAs Red
HLCP-A 100 OPT 502
HLCP-Bl00 OPT S02
HLCP·C 100 OPT S02
High Efliciency Red
HLMP-2300 OPT 502
HLMP-2350 OPT S02
HLMp·2600 OPT 502
HLMP-2400 OPT 502
HLMP·2450 OPT S02
HLMP-2700 OPT S02
Green
HLMP-2500 OPT S02
HLMP-2550 OPT S02
HLMP-2800 OPT S02
HLCp·G100 OPT S02
HLMp·2620 OPT S02
HLMP-2720 OPT S02
HLMP-2820 OPT 502
HLCp·F100 OPT S02
HLMp·2635 OPT S02
HLMp·2735 OPT S02
HLMP·2835 OPT S02
HLCP-Dl00 OPT 502
HLMp·2655 OPT S02
HLMp·2755 OPT 502
HLMp·2855 OPT S02
HLCP-G100 OPT S02
HLMP-2670 OPT S02
HLMP-2770 OPT 302
HLMP·2870 OPT 802
HLCP-Hl00 OPT 502
HLMP-26B5 OPT 302
HLMp·2785 OPT 302
HLMP·2885 OPT 302
Note:Option 502 designates a two intensity category selection. Option S02s
of different part numbers may not have the same apparent brightness. Contact your HP Field Sales Office for design assistance.
5-53
/
.
"
...
'-
',
.'~'
,---
""
'
··SoUdState·Lantps
•
•
•
•
•
•
Optional Leadform/Packaging
A1GaAs Lamps .
Special Application Lamps
Generai Purpose Lamps
Emitters
Hermetic Lamps
Solid State Lamps . . . .
From General to SpecialPurpose Lamps, H~wlett~
Packard continues to grow its LED lamp product .
offering. This year, the broad line of lamp products is
expanding in aspects of performance, packaging, and
options.
D~uble Heterojunction Aluminum.Gallium Arsenide
(AlGaAs) Technology is born and bred to produce high
brightness, low current lamps in subminiature, T-I, and
T-l 3/4 families. In addition, a special T-I 3/4 version
offers 1 Candela (1000 mcd) performance.
New packages are always an area of growth and
importance to designers and Hewlett~Packard. That's
why HP has introduced a family of 2 mmx 5 mm
lamps, 940 nm emitter lamps,and now offers a
T-l 3/4 bi-colorlamp. In addition,HP offers a new T-2
lamp designed as an alternative to incandescent
backlighting.
Hermetic Lamps
In addition to Hewlett-Packard commercial solid state
lamps, Hewlett.,.Packard offers a complete:line of
hermetically sealed solid state lamps which are listed on
·MIL-S-19500 Qualified Parts List. All four colors are
supplied in the basic lamp configuration, as well as the
following two panelmo'unt assembly optitlns: Option
#001 represents an anodized lIluminum sleeve and .
Option #002 represents a conductive composite sleeve
for improved EMIIRFI shielding capabilities.
Hermetic ultra bright iamps ar~ provided with JAN
and J ANTX equivalent testing, two panel mount
options, and in three colors. These devices were
specially designed to meet the sunlight viewability
requirements of the military market.
HP has responded to requests for options and variations
of existing subminiature, T-I, and T-l 3/4 lamps in the
past and this year is no exception. Subminiature lamp
offerings grow with the addition of high brightness
lamps, standard bends, and tape and reel options.
6-2
Diffused (Direct View) Lamps
Description
Device
. package Outline Drawing
[g~
(
C3:~
Part No.
HlMP-3000
Color(2)
Package
Red
(640 nm)
T'13/4
lens
Tinted
Diffused
HlMP-3001
HlMP-3002
Thin
leadframe
HlMP-3003
HlMP-3300
HlMP-3301
High
Efficiency
Red
(626 nm)
T-13/4
HlMP-3762
r---;::-
HlMP-D400 Orange
(608 nm)
HlMP-D401
HlMP-3400
Yellow
(585 nm)
HlMP-3401
HLMP-3862
,..- " \
01
0
\
~_/.
/
HLMP-3502
Green
(569 nm)
HLMP-3507
HLMP-3962
HLMP-3200
HLMP-3350
HLMP-3351
~~
HLMP-3450
"...:.._/.
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
HLMP-3451
HlMP-3553
·0' 0')
"
T-13/4
Low Profile
HLMP-3201
,
8
Red
(640 nm)
,
Green
(569 nm)
HLMP-3554
6-3
Tinted
Diffused
Typical
luminous
Intensity
2.0 mcd
@20mA
4.0 mcd
@20mA
2.0 mcd
@20mA
4.0 mcd
@20mA
3.5 mcd
@10mA
7.0 mcd
@10mA
15.0 mcd
@10mA
3.5 mcd
@10mA
7.0 mcd .
@10mA
4.0 mcd
@10mA
8.0 mcd
@10mA
12.0 mcd
@10mA
2.4.mcd
@10mA
5.2 mcd
@10mA
11.0 mcd
@10mA
2.0 mcd
@20mA
4.0 mcd
@20mA
3.5 mcd
@10mA
9.0 mcd
@.10 mA
4:0 mcd
@10mA
10.0 mcd
@10mA
3.2 mcd
@10mA
10.0 mcd
@10mA
291/2(1)
Typical
Forward
Voltage
Page.
No.
75°
1.6 V
@20mA
6-69
65°
2.2 V
@10mA
6-71
2.2 V
@10mA
75°
2.2 V
@10mA
75°
2.3 V
@10mA
60°
1.6 V
@20mA
50°
2.2 V
@10mA
2.2 V
@10mA
2.3 V
@10mA
6-75
Diffused (Direct View) Lamps (cont.)
Device
Package Outline Drawing
b)
DLt
Description
Part No.
HLMP-1000
Color(2(
Red
(640 nm)
Package
T-1
Lens
Tinted
Diffused
HLMP-1002
HLMP-1080
HLMP-1300
HLMP-1301
Untinted
Diffused
Tinted
Diffused
High
Efficiency
Red
(626 nm)
HLMP-1302
HLMP-1385
e
' .... _"
HLMP-K400 Orange
(608 nm)
HLMP-K401
HLMP-K402
HLMP-1400
Yellow
(585 nm)
HLMP-1401
HLMP-1402
HLMP'1485
HLMP-1503 Green
(569 nm)
HLMP-1523
HLMP-1585
(
HLMP-1200
)Y
HLMP-1201
HLMP-1350
HLMP-1450
e
'--
HLMP-1550
Red
(640 nm)
T-1
Low Profile
High
Efficiency
Red
(626 nm)
Yellow
(585 nm)
Green
(569 nm)
Untinted
Non-Diffused
Tinted
Diffused
Typical
Luminous
Intensity
1.0 mcd
@20mA
2.5 mcd
@20mA
1.5 mcd
@20mA
2.0 mcd
@10mA
2.5 mcd
@10mA
4.0 mcd
@10mA
10.0 mcd
@10mA
2.0 mcd
@10mA
2.5 mcd
@10mA
4.0 mcd
@10mA
2.0 mcd
@10mA
3.0 mcd
@10mA
4.0 mcd
@10mA
10.0 mcd
@10mA
2.0 mcd
@10mA
4.0 mcd
@10mA
6.0 mcd
@10mA
1.0 mcd
@20mA
2.5 mcd
@20mA
2.0 mcd
@10mA
2811211J
60°
60°
Typical
Forward
Voltage
1.6 V
@20rnA
2.2V
@10mA
6-58
6-60
2.2 V
@10mA
2.2 V
@10mA
2.3 V
@10mA
. 1200
, 1.6 V
@20mA
540
2.2 V
@10mA
2.2 V
@10mA
2.3 V
@10mA
6-4
Page
No.
6-58
.
_._----_._--
Diffused (Direct View) Lamps (cont.)
Device
Package Outline Drawing
Color[2)
HLMP-6000 Red
(640 nm)
=~
=8=
Part No.
~
~plcal
Description
Package
Subminiature
Lens
Luminous
Intensity
Tinted
Diffused
1.2 mcd
@10mA
HLMP-6001
3.2 mcd
@10mA
HLMP-6300 High
Efficiency
Red
(626 nm)
3.0 mcd
@lOmA
20112[1)
90°C
6-38
HLMP-6305 High
Efficiency
Red
Untinted
Non-Diffused
12 mcd
@10mA
70°
2.2 V
@10mA
6-32
HLMP-Q400 Orange
(608 nm)
Tinted
Diffused
3.0 mcd
@10mA
90°
2.2V
@10mA
6-38
2.2V
@10mA
HLMP-6405
Untinted
Non-Diffused
12 mcd
@10mA
70°
2.2 V
@lOmA
6-32
HLMP-6500 Green
(569 nm)
Tinted
Diffused
3.0 mcd
@10mA
90°
2.2V
@10A
6-38
-;- Untinted
12 mcd
@lOmA
70°
2.3 V
@10mA
6-32
3 Tinted
4 Diffused
5
6
8
1.2 mcd
@10mA
90°
1.6 V
@10mA
6-43
3
4
5
6
8
3.0 mcd
@10mA
HLMP-6505
-B-a
1.6 V
@lOmA
Page
No.
2.2V
@10mA
HLMP-6400 Yellow
(585 nm)
g:
~
Typical
Forward
Iotltage
Non-Diffused
HLMP-6203 Red
HLMP-6204 (640 nm)
HLMP-6205
HLMP-6206
HLMP-6208
HLMP-6653
HLMP-6654
HLMP-6655
HLMP-6656
HLMP-6658
High
Efficiency
Red
(626 nm)
HLMP-6753 Yellow
HLMP-6754 (585 nm)
HLMP-6755
HLMP-6756
HLMP-6758
HLMP-6853 Green
HLMP-6854 (569 nm)
HLMP-6855
HLMP-6856
HLMP-6858
-
-3
4
5
6
8
-3
4
5
6
8
•Array Length
- - - - - - - - _ . -_._--------_ .. __ ..... _...
6-5
2.2 V
@10mA
2.2V
@10mA
2.3 V
@10mA
---.---
2mm Flat Top Lamps
Device
. Package Outline Drawing
ft
~
~
DaacrlpUon
Part No;"
Colorl2]
HLMP-1800 High
Efficiency
HLMP-I801 Red
(626 nm)
Package
2rTim Flat
Top, Round
Emitting
Surface
Lens
. Tinted
Diffused
HLMP-1819 Yellow
(585 nm)
HLMP-1820
HLMP-I840 Green
(569 nm)
HLMP-I841
@
r:-
tn~
D
@
HLMP-L250 High
Efficiency
HLMP-L251 Red
(626 nm)
HLMP-L350 Yellow
(585 nm)
HLMP-L351
2mm Flat
Top, Square
Emitting
Surface
Tinted
Diffused
HLMP-L550 Green
(569 nm)
HLMP-L551
Typical
Luminous
Intensliy
1.8 mcd
@10mA
2.9 mcd
@10mA
1.51)1cd
@10mA
2.5 mcd
@10mA
2.0 mcd
, @10mA
3.0 mcd
@10mA
I.Bmcd
@10mA
·2.9 mcd
@10mA
1.5 mcd
@10mA
2.5 mcd
@10mA
2.0 mcd
@10mA
3.0 mcd
@10mA
281/2\1]
: 140°
Typical
Forward
Voltage
2.2 V
@10mA
Page
No.
6-44
2.2 V
@10mA
2.3 V
@10mA
140°
2.2 V
@10mA
6-50
2.2 V
@10mA
2.3 V
@10mA
4mm FlatTop Lamps
Daacrlpllon
Davlca
Packaga Outllna Drawing
D
Colorl2]
Part No.
HLMP-M200 High
Efficiency
HLMP-M201 Red
(626 nm)
HLMP-M250
Packaga
4mm Flat
Top
Lans
Tinted
Diffused
Tinted
Non-Diffused
HLMP-M251
8
\
I
...•..
HLMP-M300 Yellow
(585 nm)
HLMP-M301
Tinted
Diffused
HLMP-M350
Tinted
Non-Diffused
HLMP-M351
HLMP-M500 Green
(569 nm)
HLMP-M501
Tinted
Diffused
HLMP-M550
Tinted
Non-Diffused
HLMP-M551
6-6
Typical
luminous
Intanslty
5.0 mcd
@20mA
7.0 mcd
@20mA
5.0 mcd
@10rTiA
7.0 mcd
@10mA
5.0 mcd
@20mA
7.0 mcd
@20mA
5.0 mcd
@10mA
7.0 mcd
@10mA
7.0 mcd
@20mA
10.0 mcd
@20mA
10.0 mcd
@10mA
16.0 mcd
@10mA
28112\1]
150°
Typical
Forward
Voltaga
2.2 V
@10mA
2.2 V
@10mA
2.3 V
@10mA
Paga
No.
6-54
--------------------------
High Intensity Lamps
Description
Device
Package Outline Drawing
Part No.
HLMp·3050
Color[2[
Red
(640 nm)
HLMp·3315 High
Efficiency
HLMp·3316 Red
(626 nm)
f""""\
r---
Package
Lens
Tinted
Non·Diffused
T·13/4
HLMp·3415 Yellow
(585 nm)
HLMp·3416
HLMp·3517 Green
(569 nm)
HLMp·3519
8)
o oj
')..,..,.-"'/
HLMp·3365
W
~~
"
High
Efficiency
HLMp·3366 Red
(626 nm)
Low Profile
HLMp·3465 Yellow
(585 nm)
HLMp·3466
HLMp·3567 Green
(569 nm)
HLMp·3568
8
I
"~--<
d
n
HLMp·l071
Red
(640 nm)
HLMp·1320 High
Efficiency
HLMp·1321 Red
(626 nm)
T·l
Untinted
Non·Diffused
Tinted
Non·Diffused
Untinted
Non·Diffused
Tinted
Non·Diffused
Untinted
Non·Diffused
Tinted
Diffused
HLMp·1420 Yellow
(585 nm)
HLMp·1421
HLMp·1520 Green
(569 nm)
HLMp·1521
8
Tinted
Non·Diffused
T·13/4
'".;"
Typical
Luminous
Intensity .
2.5 mcd
@20mA
18.0 mcd
@10mA
30.0 mcd
@10mA
18.0 mcd
@10mA
30.0 mcd
@10mA
10.0 mcd
@10mA
25.0 mcd
@10mA
10.0 mcd
@10mA
18.0 mcd
@10mA
12.0 mcd
@10mA
18.0 mcd
@10mA
7.0 mcd
@10mA
15.0 mcd
@10 rnA'
2.0 mcd
@20mA
12.0 mcd
@.10mA
28112[1)
24°
35°
Typical
Forward
Voltage
1.6 V
@20mA
2.2 V
@10mA
Pags
No.
5-69
5-81
2.2 V
@10mA
24°
2.3 V
@10mA
45°
2.2 V
@10mA
5-75
2.2 V
@10mA
40'
2.3 V
:@10mA
45'
1.6 V
@20mA
2.2 V
@10mA
45'
12.0 mcd
@10mA
2.2 V
@10mA
12.0 mcd
@10mA
2.3V
@10mA
Typical
Luminous
Intensity
2.5 mcd
@20mA
5.0 mcd
@20mA
2.5 mcd
@20mA
5.0 mcd
@20mA
2.5 mcd
@20mA
5.0 mcd
@20mA
Typical
Forward
Voltage
2.2 V
@20mA
5-58
5-65
Rectangular Lamps
Description
Devlcs
Package Outline Drawing
c=:J
~
~ ~
Color[2)
Part No.
HLMP·0300 High
Efficiency
HLMp·0301 Red
(626 nm)
Package
Rectangular
HLMp·0400 Yellow
(585 nm)
HLMp·0401
HLMp·0503 Green
(569 nm)
HLMp·0504
6-7
Lens
Tinted
Diffused
28112[1]
100'
2.2 V
@20mA
2.3 V
@20mA
Page
No.
5-95
2 mm x 5 mm Rectangular Lamps
Device
Package Outline Drawing
r---
-
~
Part No.
Colorl2)
HLMP-S200 High
Efficiency
Red
HLMP,S201 (626 nm)
Description
Package
2mmx5mm
Rectangular
Lens
Typical
Luminous
Intensity .
Tinted
Diffused
3.5 mcd .
@20mA
20112111
110'
Typical
Forward
Voltage
2.2 V
@20mA
Page
No.
6-91
4.8 mcd
@20mA
HLMP-S300 Yellow
(585 nm)
2.1 mcd
@20mA
HLMP-S301
3.5 mcd
@20mA
HLMP-S400 Orange
(608 nm)
3.5 mcd
@20mA
HLMP-S401
4.8. mcd
@20mA
HLMP-S500 Green
(569 nm)
4.0 mcd
@20mA
HLMP,S501
5.8 mcd
@20mA
2.2 V
@20mA
2.2 V
@20mA
2.3 V
@20mA
AIGaAs Lamps
Device
Package Outline Drawing
r ....
TI
Part No.
Colorl21
HLMP'D101 AlGaAs
Red
(637 nm)
Description
Package
T-13/4
HLMP-D105
.~
G
,
Lens
Typical
Luminous
Intensity
Tinted
Diffused
70 mcd
@20mA
65'
240 mcd
@20mA
24'
45 mcd
@20mA
60'
65 mcd
@20mA
45'
45 mcd
@20mA
70'
201/21 11
Maximum
Forward
Voltage
2.2 V
@20rriA
Page
No.
6-20
o oj
I.
"-"
f""',
HLMP-K101
T-1
r~?
2.2 V
@20mA
n
HLMP-K105
.
e
'- ... "
=c:OP
HLMP-Q101
Subminiature
~~
6-8
2.2 V
@20mA
- - - .._-_.-_._-----
-----------
Low Current AIGaAs Lamps
Device
Packaga Outllna Drawing
r-..
Part No.
HLMP·D1~O
Description
Packaga
Color[2[
T·13/4
AIGaAs
Red
(637 nm)
Lans
Typical
Luminous
Intanslty
Tinted
Diffused
3.0 mcd
@1mA
650
10 mcd
@1mA
24 0
2.0 mcd
@1mA
60 0
3.0 mcd
@1mA
450
1.8 mcd
@1mA
70 0
Maximum
Forward
20112[1]
.
~ltaga
3.0 V
@20mA
Paga
No.
6-24
~
HLMp·D155
D D)
(;)
,
.
I.
~-....:
,
r\
HLMp·K150
T·1
3.0V
@20mA
r~~
r.rr
.
,
HLMp·K155
e
..... _,
~
HLMp·Q150
Subminiature
3.0V
@20mA
~~
Very High Intensity AIGaAs Lamps
Davlca
Packaga Outllna Drawing
g
~~
.. ".
8»
,
Part No.
Color
HLMp·4100 AIGaAs
Red
(637 nm)
Dascrlptlon
Package
.. T·13/4
HLMp·4101
Lens
Typical
Luminous
Intensity
Untinted
Non·Diffused
750 mcd
@20mA
1000 mcd
@20mA
~-./
6-9
Typical
Forward
20112
~Itaga
80
1.8 V
@20mA
Page
No•
6-28
Low Current Lamps
Device
Description
Color(2]
Part No.'
HlMP-4700 High
Efficiency
Red
(626 nm)
Package Outline Drawing
~
~
~
",-"
,
0
50°
HlMP-4719 Yellow
(585 nm)
1.8 mcd
@2mA
1.9 V
@?mA
HlMP-4740 Green
(569 nm)
1.8 mcd
@2mA
1.8 V
@2mA
Page
No.
6-102
I.
HlMP-1700 High
Efficiency
Red
(626 nm)
~~
,
28112(1]
\
~
,
lens
Tinted
Diffused
Typical
Forward
Voltage
1.8 V
@2ri1A
OJ
~-.:/.
,
Package
T-13/4
' Typical
, luminous
' Intensity
2:0mcd
@2mA
e
T-1
Tinted
Diffused
1.8 mcd
@2mA
500
'1.8 V
@2'mA
HlMP-1719 Yellow
(1j85 nm)
1.6 mcd
@2mA
1.9V
@2mA
HlMP-1790 Green
(569 nm)
1.6 mcd
@,2mA
"1.8 V
@2mA
'_:..'
=~
==B=~
"
H
~
~
,
"
HlMP-7000 High
Efficiency
Red
(626 nm)
HlMP-7019 Yellow
(585 nm)
HlMp:7Q40 Green
(569nm)
HlMP-1740 High
Efficiency
Red
, ;,
, (626 nrn)
Subminiature
2 mm Flat
Top, Round
,Emitting
Surface
Tinted
Diffused
0.8 mcd
@2mA
Tinted
Diffused
0.6 mcd
@2mA
0.6 mcd
@2mA
0.5 mcd
@2mA
90°
140°
1.8 V
@2mA
1.9 V
@2mA
1.8 V
@2mA
1.8 V
@2mA
,
HlMP-1760 Yellow
(585 nm)
0.4 mcd
@2mA
@}
6-10
1.9V
@2mA
I '
6-44
Ultrabright Lamps
Descrlpllon
Device
Package Outline Drawing
g
~
Colorl2J
Part No.
HLMP-3750 High
Efficiency
Red
(626 nm)
Package
T-13/4
Lens
Untinted
Non-Diffused
Typical
Luminous
Intensity
125 mcd
@20mA
28112[1 [
24°
Typical
Forward
Voltage
2.2 V
@20mA
HLMP-3850 Yellow
(585 nm)
140 mcd
@20mA
2.2V
@20mA
HLMP-3950 Green
(569 nm)
120 mcd
@20mA
2.3 V
@20mA
~.
e
[[J] [[J]l
~
.
---'
I
~~
e
HLMP-3390 High
Efficiency
Red
(626 nm)
T-13/4
Low Profile
Untinted
Non-Diffused
55 mcd
@20mA
32°
2.2V
@20mA
HLMP-3490 Yellow
(585 nm)
2.2V
@20mA
HLMP-3590 Green
(569 nm)
·2.3 V
@20mA
IIIDIIIDj
~_-
....
iij
0;
.,....
cr:
cr:
:>
iij
"iil
0.5
w
>
~
cr:
~
~
,
cr:
~
300
2BO
260
240
220
200
lBO
160
140
120
100
BO
60
40
20
o
o
600
II
Ii
=It
1
.1
II
I
0,5
WAVELENGTH - nm
1.4
ffi:i
~~
1.2
5~
1.0
"0
:ow
:>N
.... ::;
0"
w:O
Ncr:
L
O.B
::;0
,,2
0.4
0
2
0.2
V'
v
>-
V
V
00
1.0
I
~ct
wE
(30
;;:N
2.5
3.0
3.5
.......
O.B
..... ~
tt!;;
wO
>w
0.6
...."
0.4
~~
/.
0.6
,,cr:
2.0
1.2
0;
",N
1.5
FORWARD VOLTAGE - V
Figure 2. Forward Current vs. Forward Voltage.
1.6
....>-
1.0
VF -
Figure 1. Relative Intensity vs. WaveleMgth.
I .....
f
L.
w:o
cr:cr:
,0
/
~~
0.2
10
15
20
25
05
30
10
I pEAK
I DC - DC FORWARD CURRENT - rnA
-
20
50
100
200 300
PEAK FORWARD CURRENT - rnA
Figure 4. Relative Efficiency v••
Peak Forward Current.
Figure 3. Relative Luminous Intensity vs.
DC Forward Current. .
40
35
"
E
....
iij
cr:
cr:
:>
30
1\
25
"
20 r- I-
~
15 r-
0
cr:
cr:
~
,
10
~
00
R(JJA = 459 z CIW ....
\
\
X, \
IIII
r\\
-R(" i sri v>< ~\
Rt,,!, 'Bref~
/'
20
40
60
BO
100
tp - PULSE DURATION -
TA - AMBIENT TEMPERATURE _ °C
Figure 5. Maximum Forward DC Current vs.
Ambient Temperature.
Derating Based on T J MAX ~ 1100 C.
jJS
Figure 6. Maximum Tolerable Peak Current vs.
Peak Duration (lpEAK MAX Determined
from Temperature Derated IDe MAX).
6-22
--------
---.---.~-~---------------
-----------
90·i---l--+----!--'--:':'E
90·i---l---+--I-I-f.'
Figure 7. Relative Luminous Intensity vs.
Angular Displacement. HLMP-D101.
Figure 8. Relative Luminous Intensity vs.
Angular Displacement. HLMP-K101.
BO'
90·1---+----+----+----=t::=~I-',10·,-2J,0~·,130"",140""'~50:::':::!60=='' '7' ' 0' ' SO='' '90=·.J,OO'
Figure 9. Relative Luminous Intensity vs.
Angular Displacement. HLMP-D105 ..
Figure 10. Relative Luminous Intensity vs.
Angular Displacement. HLMP-K105.
Figure 11. Relative Luminous Intensity vs. Angular Displacement
for Subminiature Lamp
6-23
rh~
~~
DOUBLE HETEROJUNCTION AIOaAs
lOW CURRENT RED LED LAMPS
HEWLETT
T-1 3/4 (Smm) HLMP-01S0/0155
T-1 (3mm) HLMP-K150/K155
SUBMINIATURE HLMP-Q150
PACKARD
Features
• MINIMUM LUMINOUS INTENSITY
SPECIFIED AT 1.mA
• HIGH LIGHT OUTPUT AT LOW CURRENTS
• WIDE VIEWING ANGLE
• OUTSTANDING MATERIAL EFFICIENCY
• LOW POWER/LOW FORWARD VOLTAGE
• CMOS/MOS COMPATIBLE
• TTL COMPATIBLE
• DEEP RED COLOR
Applications
Description
• LOW POWER CIRCUITS
• BATTERY POWERED EQUIPMENT
These solid state LED lamps utilize newly developed double
heterojunction (DH) AIGaAs/GaAs material technology.
This LED material has outstanding light output efficiency
at very low drive currents. The color is deep red at the
dominant wavelength of 637 nanometres. These lamps are
ideally suited for use in applications where high light
output is required with minimum power input.
• TELECOMMUNICATION INDICATORS
package Dimensions
5.""~
4.~ (0.1801
T
==¥'21
9.19 tQ.3ti2)
T
1
12.44 (.490)
1f.'6ii'
(.46QI
+-
Q&l! I.Q&W
0,64 (0.0251
23.01.90)
0-,45 il).Ola)
SQUARE NOMIN.Al.
I
MIN.
1.271.000.
NOM.
j
t
1.21 10.0(0)
NOM,
CATHOOE
~~~
nlnl !L!.J:?lli
/
~'~
"t/
A
NOTES,
1. ALL DIMENSIONS ARE IN MILLIMETRES tlNCHES).
2. AN EPOXY MINISCUS MAY EXTEND ABOUT
I mm (0.040"1 DOWN THE LEADS.
--.---1-,
CATHODE " -
254 (.100} NOM.
CATHODE
B
I..-
f
--!
5.6 (.220j
2.54(.1001
NOM.
~
-;
(Continu~d
6-24
on next page.)
package Dimensions
1--=---,-1 r
I II
17
MI to.020) NOM.
1.111 (M75) MAX,
::::;.--T9.s9 ~ 0.2010.0081 REF.
/
... ---
~
I
~
~.'4100451
r---If---'-I
~=
t===
T
CATHODE
1£ ~
0.1& (M30) MAX.
1.78(0,070)
ALL DIMENSIONS ARE IN MILLIMETRES (lNCHESI.
o
Axial Luminous Intensity and Viewing Angle @ 25°C
Part Number
HLMp·
Package
Description
Iv (mcd) @ 1 mA DC
Min.
'tYP·
2111/. Note 1.
Degrees
Package
Outline
A
1.2
3
65
5
10
24
B
1.2
2
60
C
D150
T-' % Red Tinted Diffused
0155
T-1 % Red Untinted, Non-diffused
K150
T-1 Red Tinted Diffused
K155
T-1 Red Untinted Non-diffused
2
3
45
C
Q150
Subminiature Red Tinted Diffused
1
1.8
70
0
Note:
1. BY, is the off axis angle from lamp centerline where the luminous intensity is Y, the on-axis value.
Absolute Maximum Ratings at TA =25°C
Peak Forward Current!1] ....................... 300 mA
Average Forward Current .............•........ 20 mA
DC Current!2] ................................. 30 mA
Power Dissipation ............................. 87 mW
Reverse Voltage (IR =100I'A) .........•............. 5 V
Transient Forward Current (10 I'S Pulse)!3] ...... 500 mA
Operating Temperature Range ........... -20 to +100°C
Storage Temperature Range ............. -55 to +100°C
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body] ... 260°C for 5 seconds
Notes:
1. Maximum IpEAK at f = 1 kHz, OF = 6.7%.
2. Derate linearly as shown in Figure 4.
3. The transient peak current is the maximum non-recurring peak
current the device can withstand without damaging the LED
die and wire bonds. It is not recommended that the device be
operated at peak currents beyond the Absolute Maximum
Peak Forward Current.
Electrical/Optical Characteristics at TA =25°C
Symbol Description
Min.
Typ.
Max.
1.6
1.8
5.0
15.0
V
Unit
Test Condition
VF
Forward Voltage
VR
Reverse Breakdown Voltage
Ap
Peak Wavelength
645
nm
Measurement at peak
Dominant Wavelength
637
nm
Note 1
20
nm
Ad
AX'h
Spectral line Halfwidth
~ed of Response
V
IF= 1 mA
11l=1001'A
30
ns
Exponential Time Constant. e-IITs
Capacitance
30
pF
VF = 0, f
8JC
Thermal ReSistance
220
·C/W
Junction to Cathode Lead
I1v
Luminous Efficacy
80
9.mIW
Note 2
C
=1
MHz
Notes:
1. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the color of the device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/~v, where Iv is the luminous intensity is in
candelas and ~v is luminous efficacy in lumens/watt.
6-25
. _ - - _.... _. -----_..... _._ .._._--
300.0 r--,--,--,.--,---,;01.....-r-"'I
1.0
200.0r-~--~--+--+-7~--~-~
C(
100.0
~ 50.0
>
liS
~
20.0
ac
5.0
~
2.0
a:
a: 10.0
~
I-
;!;
0.5
w
a:
>
5a:
a:
w
~
1.0
I
0.5
~
0.2
600
VF- FORWARO VOLTAGE -: V
WAVELENGTH - nm
Figure 2. Forward Current vs. Forward V~ltage.
Figure 1. Relative Intensity vs. Wavelength.
40
".
E
35
I
30
I-
2
w
II:
II:
:J
CJ
c
25
20
a:
~
a:
15
I
10
.
0
~
IF - DC FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - ·C
Figure 3. Relative Luminous Intensity vs.
.
DC Forward Current.
Figure 4. Maximum Forward DC Current vs.
Ambient Temperature.
Derating Based on TJ Max. =. 1.10· C.
I.
6-26
ao'
90'1--+--+--f---E~"-:'-:':;0'C-2;;;0::-'-:3;:'0·'":4tO';-'S::':Oc;:'·-:!60::;'-::7trt~a;::0~'9~Oc;:',~'OO'
Figure 6. Relative Luminous Intensity vs.
Angular Displacement. HLMP-K150.
Figure 5. Relative Luminous Intensity vs.
Angular Displacement. HLMP-D150.
90' t--+--+---Ic--F3!l."""',--:'--..:l.,..".,..""""""-::7"'0':-a"'0-g.J.0-.--"00'
Figure 8. Relative Luminous Inlenslty vs.
Angular Displacement. HLMP-K155.
Figure l Relative Luminous Intensity vs.
Angular Displacement. HLMP-D155.
Figure 9. Relative Luminous Intensity vs. Angular Displacement
for Subminiature Lamp
6-27
DOUBLE HETEROJUNCTION AIOaAs
VERY HIOH INTENSITY
RED LED LAMPS
T-1 3/4 (5 mm) HLMP-4100,-4101
Flin-
HEWLETT
~~ PACKARD
Features
• 1000 mcd AT 20 mA
• VERY HIGH INTENSITY AT LOW DRIVE
CURRENTS
• NARROW VIEWING ANGLE
• OUTSTANDING MATERIAL EFFICIENCY
• LOW FORWARD VOLTAGE
• CMOS/MOS COMPATIBLE
• TTL COMPATIBLE
• DEEP RED COLOR
Description
These solid state LED lamps utilize newly developed double
heterojunction (DH) AIGaAs/GaAs material technology.
This LED material has outstanding light output efficiency
over a wide range of drive currents. The lamp package has
a tapered lens, designed to concentrate the luminous flux
into a narrow radiation pattern to achieve a very high
intensity. The LED color is deep red at the dominant
wavelength of 637 nanometres. These lamps may be DC
or pulse driven to achieve desired light output.
Applications
• BRIGHT AMBIENT LIGHTING CONDITIONS
• EMITTER/DETECTOR AND SIGNALING
APPLICATIONS
• GENERAL USE
package Dimensions
~:: ;g:~~:l
r
0.64 (0.025)
SO!)A~E
1.32 10.0521
NOMINAL
liJi2ToJi4oi
~-r==~~T~======~~
ig::~:~J-23'0 MIN·d
l
::!;
12.44 t0A90)
11.{;8 10.460)
6-28
10.90)
1.27
{~g~)...--
--------
-------------- - - - -
Luminous Intensity @ 25°C
PIN
HLMP·
4100
r---
Package
Description
T-1 3/4 Red Untinted.
Non-diffused
4101
Iv (mcd)
@20mADC
Min.
Typ.
500
750
700
1000
281/2
Note 1Degrees
8
Note:
1.01/2 is the angle from optical centerline where the luminous
intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at TA = 25°C
Maximum Rating
Parameter
Units
Peak Forward CurrentP. 2]
300
mA
Average Forward Current(2]
20
mA
DC Currentl3 J
30
mA
Power Dissipation
87
mW
Reverse VOltage (lR = 100 ,"A)
5
V
500
mA
Operating Temperature Range
-20 to +100
°C
Storage Temperature Range
-55 to +100
°c
Transient Forward Current (10 '"s Pulse)14]
Lead Soldering Temperature [1.6 mm (0.063 in.) from body]
260°C for 5 seconds
Notes:
1. Maximum IpEAK at f = 1 kHz. DF = 6.7%.
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linerally as shown in Figure 5.
4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and
wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward
Current.
Electrical/Optical Characteristics at TA = 25°C
Symbol
Descripllon
VF
Forward Voltage
VR
Reverse Breakdown Voltage
APEAK
Min.
5.0
Typ.
Max.
Unit
1.8
2.2
V
20mA
IR=100!,A
Test Condition
15.0
V
Peak Wavelength
650
nm
Measurement at peak
Dominant Wavelength
Note 1
642
nm
Spectral Line Hallwidth
20
nm
Speed 01 Response
30
ns
Exponential Time Constant.
e- tls
Capacitance
30
pF
VF " 0, 1 '" 1 MHz
8jc
Thermal Resistance
220
°CIW
Junction to Cathode Lead
'iJV
Luminous Efficacy
80
1m/W
Note 2
Ad
~A
1/2
rs
C
Notes:
1. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the color of the device.
2. The radiant intensity. Ie, in watts per steradian. may be found from the equation Ie = Iv/~v, where Iv is the luminous intensity in
candelas and ~v is luminous efficacy in lumens/watt.
3. The approximate total luminous flux output within a cone angle of 20 about the optical axis, q,v(20), may be obtained from the
following formula:
q,v(20) = [q,V(O)/lv(O)]lv:
Where:q,v(O)/lv(O) is obtained from Figure 7.
6-29
300
1.0
..
E
I
~
;;;
i'!i
I-
i'!i
'::>'""
u
0
'"
;::
'"~
l-
i!;
W
0.5
..
>
~
'"
W
I
,."
280
260
240
220
200
180
160
140
·120
100
80
60
40
20
600
WAVELENGTH - nm
v, - FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs. Wavelength
Figure 2. Forward Current vs. Forward Voltage
1.2
>
1.0
~c
wE
§:w
-N
0.6
10
"''''
.!'~
0.4
~ti
!'i~
w:l!
0.2
I DC
-
DC FORWARD CURRENT - mA
"Igure 3. Relative Luminous Intensity vs. DC Forward Current
IPEAK - PEAK FORWARD CURRENT - mA
Figure 4. Relative Efficiency ve. Peak Forward Current
0
5
0
fIIi, •• • SS9'
51- R9, ..... 674'CIW=
o
6S9"CIW:
It,._••
5
!
0
1'\.1\ 1.\
(,,'
~1\\
~
5
0
10
20 30 40 50 60 70
80 80 100 110
TA - AMBIENT TEMPERATURE -'C
tp - PULSE DURATION - /.IS
Figure 6. Maximum Tolerable Peak Current vs.
Peak Duration (I PEAK MAX Determined
from Temperature Derated IDe MAX).
Figure 5. Maximum Forward DC Current vs. Ambient
Temperature Derating Based on T J MAX. =110· C
6-30
o
~
"'w
>-'
1-+-1-_1-+_1--1-_1-+-1_+-1°. 14
..~ "~
0,135 ~ ~
_I-H++--+-t-+-+-+-t--JI''--t---l 0.12
Hxt--I-+-t--+-t--7f<-I:--+-I0.10
\~",-H*-+--+-t--+"7f--I--I--I----l
0.08
~
0
OU
"Z
~2
-'to
~"
1--1--1-+-::....."-1--1--1-:--1--+-10.06
::JZ
0.04
35:
\).tH-+~"-+--t-+-t-+--+-t--l
"I\I-..+....I---I--I--I--I--+~I--+-I 0.02
O-ANGlE FROM OPTICAL CENTERLINE-DEGREES
(CONE HALF ANGLE)
Figure 7. Relative Luminous Intensity vs. Angular Displacement
6-31
~~
Fli;-
HEWLETT
SUBMINIATURE HIGH BRIGHTNESS
SOLID STATE LAMPS
~e. PACKARD
High Efficiency Red • HlMP-630S
Yellow • HlMP-640S
High performance Green • HLMP-6505
Features
• SUBMINIATURE PACKAGE STYLE
• END STACKABLE
• LOW PACKAGE PROFILE
• AXIAL LEADS
• NARROW VIEWING ANGLE
• LONG LIFE - SOLID STATE RELIABILITY
• AVAILABLE IN BULK, ARRAYS, TAPE AND
REEL, SURFACE MOUNT, AND BENT LEAD
CONFIGURATIONS
Description
Lamps in this series of solid state indicators are encapsulated in an axial lead subminiature package of molded
epoxy. They utilize an untinted non-diffused lens providing
superior product performance. Small size makes these
lamps suitable for PC Board mounting in space sensitive
applications.
Part
Special lead bending, packaging and assembly methods
can be used with these devices. Refer to the special data
sheet for lead bend configurations. Two special surface
mount lead configurations are also available. See the data
sheets for "gull wing" and "yoke lead" options for more
detailed information. Tape and reel packaging for the
standard product is also available (refer to Tape and Reel
Data Sheet).
Number
HLMP-
Minimum
Intensity
(mcd) at 10 mA
6305
3.4
High Efficiency
Red
(GaP on GaAsP)
3.6
Yellow
(GaP on GaAsP)
4.2
Green
(GaP)
6405
6505
package Dimensions
1§!i~I>IA
1.91 (0.0761
•
AU. DIMENSIONS AAE IN MIt.LIMETI\E$ !INCHES),
6-32
I
Color
(Material)
- - - - - - - - - - - - - - - ..- - - - - - - - - - - - -
Electrical Characteristics at TA = 25°C
Symbol
Iv
Parameter
Luminous Intensity
Device
HLMP-
Min.
Typ.
High Efficiency Red
6305
3.4
12
3.6
12
4.2
12
Yellow
6405
Green
6505
Max.
Units
Test Conditions
mcd
IF" 10 mA
(Figures 3.8, 13)
28
Deg.
See Note 1
(Figures 6, 11. 16)
201/2
Including Angle
Between Half
Luminous Intensity
Points
All
ApEAK
Peak Wavelength
High Efficiency Red
Yellow
Green
635
583
565
nm
Measurement at Peak
High Efficiency Red
Yellow
Green
626
585
569
nm
See Note 2
High Efficiency Red
Yellow
Green
40
36
High Efficiency Red
Yellow
Green
90
90
500
High Efficiency Red
Yellow
Green
11
15
18
Thermal Resistance
All
120
Forward VOltage
High Efficiency Red
Yellow
Green
1.5
1.5
1.5
5.0
Ad
AA1/2
7$
C
OJC
VF
Dominant Wavelength
Spectral Line
Halfwldth
Speed of Response
Capacitance
VA
Reverse Breakdown Voltage
All
'T}v
Luminous Efficacy
High Efficiency Red
Yellow
Green
nm
28
2.2
2.2
2.3
145
500
595
ns
pF
°G/W
3.0
3.0
V
VF=O; f" 1 MHz
Junction to Cathode
Lead
IF" 10 mA
(Figures 2, 7, 12)
3.0
V
IA" 100 p.A
lumens
See Note 3
Watt
Notes:
1. 81/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie, " IV/1)v, Where Iv is the luminous intensity in candelas
and 1)v is the luminous efficacy in lumens/watt.
.
6-33
Absolute Maximum Ratings at TA = 25°C
Green
High Eft. Red
HLMP-6305
Vellow
HLMP-6405
HLMp·S505
Uni"
135
85
135
rnW
30[2]
20[1]
30(2)
rnA
90
See Fig. 5
60
See Fig. 10
90
See Fig. 15
rnA
Reverse Voltage (lR = 100 p.A)
5
5
5
V
Transient Forward Currentl3]
500
500
500
mA
-55 to +100
-55 to +100
Parameter
Power Dissipation
DC Forward Current
Peak Forward Current
(10 p.sec Pulse)
Operating Temperature Range
-20 to +100
Lead Soldering
Thmperature [1.6 mm (0.063
In.) from body]
·C
-55 to +100
Storage Temperature Range
260°C for 3 seconds
Notes:
1. Derate from 50° Cat 0.2 mAIo C.
2. Derate from 50° C at 0.5 mAIo C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak current beyond the'peak forward current listed in the Absolute
Maximum Ratings .
.1.or-------,.--,,....:---......- - . . - - - - . . , . . . . , - - , , . - - - - - - - - . - - - - - - - .
T•• 25'0
HIGH EFfiCIENCY RED
O.5~------_+~--+_~---~--~---~~~----_4-------~
!lRSEN
. ~obo-------=~~~-----~~Sb~------::~65tO~==~~~::7=OO==..--------~750
WAVELENGTH-nm
Figure 1. Relative Intensity vs. Wavelength
\J
'6-34
High Efficiency Red HLMP-6305
60
.."
E
50
0
Z
w
40
II:
II:
::>
u
0
30
/
II:
i~
~
20
10
o
1.0
/
1.5
/
4.0
/
/
~
....
"
1.5
~g
1.0
....
w:'iE
>11:
-0
/
II:
2.0
,/
3.5
2.5
0.5
o/
o
3.0
VF - FORWARD VOLTAGE - V
,/
~
f"
V
/
10
15
20
25
30
IDC.- DC CURRENT PER LED - mA
Figure 2. Forward Current vs. Forward
Voltage Characteristics
Figure 3. Relative Luminous Intensity
vs. Forward Current
1.6
1.5
U
>0
u"
1.4
~.§
1.3
e'c"
wQ.
1.2
,,~
WW
- ....
>~:
S:l!
wa:
1.1
1.0
.9
II:Q
!;
.8
I
.7
50
~I'
jj
::d~
60
":Iii
!PEAK - PEAK CURRENT - mA
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs; Peak Current
tp - PULSE DURATION -~.
Figure 5. Maximum Tolerable Peak Current
vs. Pulse Duration (locMAX
as per MAX Ratings)
90°I----..f---I---I---l::!:
Figure 6. Relative Luminous Intensity vs. Angular'Dlsplacement
6-35
Yellow HLMP-640S
60
",
40
Z
50
E
....
w
0
I
0:
~
.l!-
TA·JC
30
20
I
ID
1.0
1.5
2.0
2.0
;;;0-
1.5
::>"
00
Zw
-N
:1;::>-'
J
-,"
1.0
/
w:I;
>a:
-0
5;;;
w
a:
./
o
~Ci
~.!l
Z_
II
0:
"ii:
,.
0-
0:
0:
::>
u
2.5
I
2.5
3.0
3.5
.5
L
V'
o
o
4.0
VF - FORWARD VOLTAGE - V
V
L
v
L
10
15
20
IF - FORWARD CURRENT - mA
Figure 7. Forward Current vs. Forward
Voltage Characteristics
Figure 8. Relative Luminous Intensity
vs. Forward Current
1.6
1.5
G
u"
,.0
1.4
§~
1.3
~~
1.2
Wo
WW
>N
1.1
:h
wo:
~~
1.0
0:0
.9
u-
;;;
.6
V
/
V
I
v
V
I
10
20
30
40
50
60
IpEAK - PEAK CURRENT - rnA
Ip - PULSE DURATION - P'
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current
Figure 10. Maximum Tolerable Peak
Current vs. Pulse Duration (IDC MAX
as per MAX Ratings)
90'i---+---t---i----e
Figure 11. Relative Luminous Intensity vs. Angular Displacement
6-36
~----~-
~~~~~~~~~~~~~~~-
Green HLMP-6S0S
60
..e
40
I
II
I-
ffi0:
50
0:
:::>
'0:"'
30
f2
20
"
~
0:
.!:
4.0
if
10
o
1.0
.I
1.5
/
'I
/
/
V
/
2.0
3.0
3.5
oV
4.0
VF - FORWARD VOLTAGE - V
V
/
o. 5
2.5
V
10
15
20
25
30
35
40
IpEAK - PEAK CURRENT PER LED - rnA
Figure .13. Relative Luminous Intensity
VS. Forward Current
Figure 12. Forward Current vs. Forward
Voltage Characteristics
1.7
1.6
1.5
1.4
1.3
/'
1.2
I
1.1
I
1.0
0.9
0.8
0.7 0
I
10
20
30
tt
40
50
60
70
\ .L.o........u.=O'-.L..L
80 90 100
IpEAK - PEAK CURRENT PER LEO - mA
'p -
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) VS. Peak Current
PULSE DURATION - " '
Figure 15. Maximum Tolerable Peak
Current VS. Pulse Duration (I DC MAX
as per MAX Ratings)
80'
+-_-l__-+'~
90'1-_+_ _
Figure 16. Relative Luminous Intensity vs. Angular Displacement
6-37
Fli;-
SUBMINIATURE SOLID STATE LAMPS
RED
HIGH EFFICIENCY RED
ORANGE
YELLOW
HIGH PERFORMANCE GREEN
HEWLETT
~e.. PACKARD
•
•
•
•
•
HLMP-6000/6001
HLMP-6300
HLMp·Q400
HLMP'6400
HLMp·6500
Features
• SUBMINIATURE PACKAGE STYLE
• END STACKABLE
• LOW PACKAGE PROFILE
• AXIAL LEADS
• WIDE VIEWING ANGLE
• LONG LIFE - SOLID STATE RELIABILITY
• AVAILABLE IN BULK, ARRAYS, TAPE AND
REEL, SURFACE MOUNT, AND BENT LEAD
CONFIGURATIONS
Description
Lamps in this series of .solid state indicators are
encapsulated in an axial lead .subminiature package of
molded epoxy. They,utilize a tinted, diffused lens providing
high on-off contrast and wide angle viewing. Small size
makes these lamps suitable for PC board mounting in space
sensitive applications.
Special lead bending, packaging and assembly methods can
be used with these devices. For example, lead bending on
2.54mm (0.100 in) and 5.0Bmm (0.200 in) centers is available.
Two special surface mount lead configurations are also
available. See the data sheets for "gull wing," "yoke lead"
and bend options for more detailed information.
Tape and reel packaging for the standard product and for
the surface mountable "gull wing" and "yoke lead" versions
is described in their respective surface mount data sheets.
package Dimensions
ALL DIMENSIONs ARE IN MU.LIMETRES {lNCHESl.
6-38
Part
Number
HLMP·
Minimum
Intensity
(mcd) at 10 mA
6000
0.5
Standard Red
(GaAsP)
6001
1.3
Standard Red
(GaAsP)
6300
1.0
High Efficiency
Red
(GaP on GaAsP)
Q400
1.0
Orange
(GaP on GaAsP)
6400
1.0
Yellow
(GaP on GaAsP)
6500
1.0
Green
(GaP)
Color
(Material)
------------------------------------------
Electrical Characteristics at TA = 25°C
r-
,~,
Symbol Parameter
Iv
Luminous Inten§ity
c
t\
iI%
Device
HLMP·
Min.
StandardRM
6000
01
'.
0.5
1.3
i
!!lrange
Q400
Yellow
6400
1.2
Max.
Units;
3.~'%
.
~
i~Efficien~y Red •
6300
Typ.
1.0
3.0
1.0
3.0
1.0
3.0
1.0
3.0
.-
!If
mcd
Test Conditions
gc,:1ltiG%"
IF= 10 mA
(Figures 3, 8, 13, 18)
~
Green
6500
201/2
Including Angle
Between Half
Luminous Intensity
Points
All
90
Deg.
See Note 1
(Figures 6, 11. 16. 21)
APEAK
Peak Wavelength
Standard Red
High Efficiency Red
Orange
Yellow
Green
655
635
612
583
565
nm
Measurement at Peak
Standard Red
High Efficiency Red
Orange
Yellow
Green
640
626
603
585
569
nm
See Note 2
Standard Red
High Eff, Red/Orange
Yellow
Green
24
40
36
28
Standard Red
High Efficiency Red
Orange
Yellow
Green
15
90
260
90
500
n$
Standard Red
High Efficiency Red
Orange
Yellow
Green
100
11
4
15
18
pF
120
·C/W
Ad
.1A1/2
TS
C
Dominant Wavelength
Spectral Line
Halfwidth
Speed of Response
CapaCitance
8JC
Thermal Resistance
All
VF
Forward Voltage
Standard Red
High Efficiency Red
Orange
Yellow
Green
VR
Reverse Breakdown Voltage
'f/v
Luminous Efficacy
1.4
1.5
1.5
1,5
1.5
1.6
2.2
2.2
2.2
2.3
5,0
Slandard Red
High Efficiency Red
Orange
Yellow
Green
Notes on following page.
6-39
65
145
262
500
595
•
nm
2.0
3.0
3.0
3.0
3.0
VF=O;f=lMHz
Junction to Cathode
Lead
V
IF= 10 mA
(Figures 2, 7, 12, 17)
V
IR" 100p.A
lumens
See Note 3
--watt
Notes:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/ryv. Where Iv is the luminous intensity incandelas and
ryv is the luminous efficacy in lumens/watt.
Absolute Maximum Ratings at TA
Parameter
Power Dissipation
DC Forward Current
Peak Forward Current
Red
HLMP·6000f1
High Eff. Red
HLMP-6300
Orange
HLMp·Q400
Yellow
HLMP-6400
Green
HLMP-6500
Units
100
135
135
85
135
mW
50PJ
3012 J
30[2}
20[1}
30[2J
mA
1000
See Fig. 5
90
See Fig. 10
90
See Fig. 10
60
See Fig. 15
90
See Fig. 20
mA
Reverse Voltage (I R= 100 pAl
5
5
5
5
5
V
Transient Forward Current(2)
(10 }tsec Pulse)
2000
500
500
500
500
mA
-55 to +100
-55 to +100
-55 to +100
-55 to +100
Operating Temperature Range
Storage Temperature Range
Lead Soldering
Temperature {1.6 mm
(0.063 in.) from body}
-20 to +100
-55 to +100
°C
2600 0 for 3 seconds
Notes:
1. Derate from 50' C at 0.2 mAl' C.
2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute
Maximum Ratings.
,.0r-------------,-~~--~~--~
__
~----,_~--~r_----------,_------------~
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength
6-40
standard Red HLMP-6000/6001
•
/'
•
•
•
•
1.7D
VF- FORWARD VOLTAGE - VOLTS
Figure 2. Forward Current vs.
Forward Voltage.
""
1.30 '-T"""T""""-'-"T""-r-""r-r-r-.
i \""
S f-t-~+-+-+--r-r-+-+~
~ ',l°f-Hf-f-
V
IV
.L
10
*
"
,.-f--
~ ',OOf-t-t-t~
f-'-
.
50
II' - FORWARD CURRENT - mA
Figure 3. Relative Luminous Intensity
vs. Forward Current.
'rEAK - PEAK CURRENT - mA
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
tp - PULSE DURATION - pi
Figure S. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
1
'•
V
I
·•
0
Figure 6. Relative Luminous Intensity vs. Angular Displacement.
1.•
/
I.S
U
>0
!~
tE~
/
/
"
1.2
wo
wW
1.1
j::::i
1.'
>N
S~
w~
I
I.'
1.3
~o
l!
..
..
.7
2.'
Vf • FORWARD VOLTAGE - V
IDC - DC CURRENT PER LED _ rnA
Figure 7. Forward Current vs. Forward
Voltage Characteristics
100
1000
tp '- PULSE DURATION
Figure 8. RelatlveLuminouslntenslty
vs. Forward Current.
!PEAK - PEAK CURRENT -mA
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
,....
- JlI
Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Figure 11. Relative Luminous Intensltyvs.AngularDlsplacement.
6-41
Yellow HlMP-6400
/
1.0
/
S
/
1.5
! 1~
Q
~'
/
5
./
./
2.0
/
'-0\ -25;c
2,
i
/
1.5
2.5
30
•
2,
J
•
•
·
•
•
v
00
35
4.0
\If - FORWARD VOLTAGE-V
5
'/
V
4
V
3
/
/'
2
•
•
9
I.
/
I
'01020
304050
60
IpEAK - PEAK CURRENT - mA
... - FORWARD CURRENT - mA
Figure 12. Forward Current vs. Forward
Voltage Characteristics
I
I
7
2.
15
I
/
I
Figure 13. Relative Luminous Intensity
vs. Forward Current.
Figure 14. Relat,lve Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
10000
tp - pULSE DURATION -,us
Figure 16. Relative Luminous Intensltyvs.AngularDlsplacement.
Figure 15. Maxlmum,Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Green HlMP-6500
v
'00
..
~~
•
/
.~
o
=
;
2
..
0
1.0
/
1.5
2.0
•
I
2, 5
2, 0
.
2.5
30
3.5
Figure 17. Forward Current vs.
Forward Voltage.
4
3
2
I
V
15
20
25
30
35
40
'PEAK - PEAK CURRENT PER LED - rnA
,Figure ;18. Relative 'Luminous Intensity
vs. DC Forward Current
o.
7
I
I
9
10
/
•
/
•1/
40
5
'"
•
VF-FORWARD VOLTAGE-V
v'
V
5
/
I
7
35
'3, 0
/
20
•
I
4,0
0
I
10
20
30
40
50
60
70
Figure 19. Relatlave Efficiency
(Luminous Intensity per Unit'
Current) vs. Peak LED Current
I
I
tp - PULSE DURATION -III
Figure 20. Maximum Tolerable Peak Current vs. Pulse Duration. (IDC MAX
as per MAX Ratings)
Figure 21. Relative Luminous Intensltyvs.AngularDlsplacement.
6-42
80 90 100
IpfAK - PEAK CURRENT PER LED - rnA
------.---~-.~-------
MA TCHED JltRRA'IS OF
SUE3MIf>JlATURE LAMPS
RED
HIGH EFFICIENCY RED
HlMPi~,~;QO
SERIES
HlMP~66QO SI=RIES
¥l=lLOWc'HlMP~6150 SERIES
GREEN HLMP-6850 SERIES
Features
• IMPROVED BRIGHTNESS
• AVAILABLE IN 4 BRIGHT COLORS
Red
High Efficiency Red
Yellow
High Performance Green
• EXCELLENT UNIFORMITY BETWEEN
ELEMENTS
/
• END STACKABLE FOR LONGER ARRAYS
o SELECTION OF VARIOUS LENGTHS
• COMPACT SUBMINIATURE PACKAGE STYLE
• NO CROSSTALK BETWEEN ELEMENTS
Description
Applications
The HLMP-6XXX Series Arrays are comprised of several
subminiature lamps molded as a single bar. Arrays are
tested to assure 2.1 to 1 matching between elements and
intensity binned for matching between arrays.
.. INDUSTRIAL CONTROLS
The HLMP-620X Series Arrays are Gallium Arsenide
Phosphide red light emitting diodes. The HLMP-665X,
HLMP-675X series arrays are Gallium Arsenide Phosphide
on Gallium Phosphide red and yellow light emitting diodes.
The HLMP-685X series arrays are Gallium Phosphide green
light emitting diodes.
Each element has separately accessible leads and a
diffused lens which provides a wide viewing angle and a
high on/off contrast ratio. The center-to-center spacing is
2.54 mm (.100 in.) between elements. Special lead bending
is available on 2.54 mm (.100 in.) and 5.08 mm
(.200 in.) centers.
o POSITION INDICATORS
o OFFICE EQUIPMENT
II
INSTRUMENTATION LOGIC INDICATORS
o CONSUMER PRODUCTS
Array
Length
3-Elem.~nt
4-Element
5-Element
6-Element
,8dilement
High
Efficiency
Red
Red
HLMP· E1?9?
HLMP- 6264
HLMp· 6205
HLMP- 6206
H!7MP- 6208
6e~3
6654
6655
66,56
6658
Yellow
6753
6754
67:,55
6756
6758
High
Performance
Green
6853
6854
6855
6856
6858
package Dimensions
Note'!
1. All ditmO$foll$ are in
mUHmetrB$-11ncoesl.
2. Qvetaillength i$ the number of elemenH time$
2.54mm (.l()() In.l •
.16W30j
MAX,
t::I.l
6-43
.
----~---------
-------
FliP'l
2mm FLAT TOP LED LAMPS
HEWLETT
High Efficiency Red, Yellow, Green Lamps
Low current Lamps
Integrated Resistor Lamps
a.:~ PACKARD
Features
• WIDE VIEWING ANGLE
• UNIFORM LIGHT OUTPUT
• MOUNTS FLUSH WITH PANEL
• CHOICE OF THREE BRIGHT COLORS
- High Efficiency Red
- Yellow
- High Performance Green
• LOW CURRENT VERSION AVAILABLE
- High Efficiency Red and Yellow
• INTEGRATED RESISTOR VERSION AVAILABLE
- Requires no External Current Limiter with
5 V -12V Supply
Description
These rugged solid state lamps are designed for applications requiring a bright, compact source of light. Uniform
light output, wide viewing angle and flat top make the lamp
ideal for flush mounting on a front panel.
The red and yellow devices use 'Gallium Arsenide Phosphide on Gallium Phosphide light emitting diodes, the green
devices use a Gallium Phosphide light emitting diode.
Axial Luminous Intensity and Viewing Angle
@.
Color
High
Efficiency
Red
Yellow
Green
Iv (mcd)
rI Number
HLMP·
-1800
1801
Min.
Typ.
Test
Condition
201/211J
Tinted, Diffused
0.8
1.8
10 mA
140
Tinted, Diffused, High Brightness
2.1
2.9
10mA
0.5
2mA
Description
Tinted, Diffused, Low Current
0.2
Tinted, Diffused,S V Integrated Resistor
0.5
5V
-1661
Tinted. Diffused, 12 V Integrated Resistor
0.8
12 V
-1819
Tinted, Diffused
0.9
1.5
10 mA
-1820
Tinted, Diffused, High Brightness
1.4
2.5
10 mA
-1760
Tinted, Diffused, Low Current
0.2
0.4
2mA
-1674
Tinted, Diffused,S V Integrated Resistor
0.5
5V
-1675
Tinted, Diffused, 12 V Integrated ReSistor
0.9
12 V
-1840
Ti nted, Diffused
1.0
2.0
10mA
-1841
Tinted, Diffused, High Brightness
1.6
3.0
10 mA
-1687
Tinted, Diffused,S V Integrated Resistor
0.5
5V
-1688
Tinted, Diffused. 12 V Integrated Resistor
1.0
12 V
NOTE:
1.
~)1/2
is the off-axis angle at which the luminous intensity is half the axial intensity.
6-44
140
140
Package Dimensions
0.45 (O.OlS)
CATHODE
SQUARE NOM/
dI:::::r========i==c::k
I
2.5410.1001
NOM.
'-r
",.~:~J'ib
t2.7 .fO.G50) NOM,
NOTES;
1 AU, DIMENSIONS ARE IN MILllMETRES ONCHES!.
2. AN"EPOXY MENISCU& MAY EXTEND ABOOT
1 mm {a,040l DOWN THE LEADS.
Absolute Maximum Ratings
atTA=25°C
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
.. '
Parameter
Peak Forward Current
Average Forward Currentl 11
DC Currentl 21
Power DissipationJ31
Reverse Voltage (fR - 100 }J.AI
Transient Forward Currentl41 no }J.sec Pulse)
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
11.6 mm 10.063 inl from body}
High Eliiciency , i; .•,
Yellow
Green
Red
HLMp·1800/-1801 HLMP;1819/·1820 HLMp·1840/·1841
90
60
90
,.",
25
25
20
.". 20
30
30
ii
135
85
135
'.. ,.•..••. 5
5
5
500
500
500
-20 to +100
-55 to +100
-55 to +100
Units
rnA
mA
mA
mW
V
mA
°C
260' C for 5 seconds
NOTES:
1. See Figure 3 to establish pulsed operating conditions.
2. For Red and Green Series derate linearly from 50° C at 0.5
mAIo C. For Yellow Series derate linearly from 50° C at 0.2
mArC.
3. For Red and Green Series derate power linearly from 25° C
at 1.8 mW/o C. For Yellow Series derate power linearly from
50° Cat 1.6 mW/O C.
4. The transient peak current is the maximum non-recurring
peak current that can be applied to the device without
damaging the LED die and wirebond. It is not recommended
that the device be operated at peak currents beyond the
peak forward current listed in the Absolute Maximum
Ratings.
LOW CURRENT LAMPS
High Ellici~ncy Red
HLMP~1740
Parameter
DC and Peak Forward Currentl 11
Transient Forward Current 110 msecPulse)
Power Dissipation
"
Reverse Voltage IIR - 50 MA)
Operating and Storage Temperature Rqnge
Lead Soldering Temperature n,6 mm 10:063 in.1
from body)
7
500
27
II
I
I
Yellow
HLMP·1760
7
500
24
5.0
-55 to +100
Units
mA
mA
mW
V
°C
260° C for 5 seconds
NOTES:
1. Derate linearly from 92° Cat 1.0 mAIO C.
INTEGRATED RESISTOR LAMPS
Parameter
Reverse Voltage (18 - 100 }J.Al
DC Forward Voltage ITA = 25° Cl
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
5 V Larhps
HER/Yellow
HLMp·1660
HLMP·1674
5V
7.5 VI 1 1
-40° C to 85° C
-55°C to 100°C
12 V Lamps
5 V Lamps
HER/Yellow
Green
HLMP-1661
HLMP-1687
HLMP-1675
5V
5V
7.5 VllJ
15 Vl21
-20° C to 85° C
-40° C to 85° C
-55°C to lOGoC
-550 C to 100° C
260·C for 5 seconds
NOTES:
1. Derate from TA = 50° Cat 0.071 Vlo C, see Figure 3.
2. Derate from TA = 50° Cat 0.086 Vlo C, see Figure 4.
6·45
12 V Lamps
Green
HLMP·1688
5V
15 V[2/
-20· C to 85° C
-55°C to 100°C
Electrical/Optical Characteristics at TA == 25° C
High
Efficiency Red
Symbol Parameter
Min,
Typ.
Yellow
Max.
Min.
Typ.
Green
Max.
Min.
lYP.
Max.
Units Test Conditions
APEAK
Peak Wavelength
635
583
565
nm
LlAl!2
Spectral Line
Halfwidth
40
36
28
nm
Ad
Dominant Wavelength
626
585
569
'7v
luminous Efficacy
145
500
595
VA
Reverse Breakdown
Voltage
nm
Note 1
lumen Note 2
Iwatt
5.0
5.0
5.0
V
IA
~
100 itA
NOTES:
1. The dominant wavelength, Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
2. Radiant intensity, Ie, in watts/steradian. may be found from the equation Ie = Iv/ryv' Where Iv is the luminous intensity in candelas
and ryv is the luminous efficacy in lumens/watt.
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
High
Green
Yellow
Efficiency Red
HLMP-1800/-1801 HLMP-1819/-1820 HLMP-1840/-1841
Symbol
Parameter
VF
Forward Voltage
TS
Speed of Response
C
Capacitance
OJC
Thermal Resistance
Min. Typ. Max.
1.5
2.2
Min. Typ. Max.
3.0
1.5
2.2
90
3.0
Min. Typ. Max.
1.5
2.3
3.0
500
90
Units Test Condllions
V
pF
20
15
18
120
120
120
IF= 10 mA
ns
VF = O. f = 1 MHz
°C/W Junction to
Cathode Lead
LOW CURRENT LAMPS
High Efficiency Red
HLMP·1740
Symbol
Parameter
VF
Forward Voltage
Min.
Typ.
Max.
1.8
2.2
Yellow
HLMP-1760
Min.
Typ.
Max.
Units
1.9
2.7
V
Test Conditions
2mA
Speed of Response
90
90
ns
C
Capacitance
11
15
pF
()JC
Thermal Resistance
120
120
°CIW
Junction to
Cathode Lead
Max.
Units
Test Conditions
20
mA
At rated voltage
°CIW
Junction to
Cathode Lead
.."8
Vp =0. 1= 1 MHz
INTEGRATED RESISTOR LAMPS
12V
HLMP·1661/
1675/·1688
5V
HLMP-16601
-16741-1687
Symbol
Parameter
Typ.
Max.
IF
Forward Current
Min.
10
15
IIJC
Thermal ReSistance
90
Min.
I Typ.
13
90
6-46
0"
1.0
10· 20· 30· 40· 50·
60
70
80
90 100
Figure 1. Relative Luminous Intensity vs. Angular Displacement
1.0r--------------,----~----~~_.--------~
--,_--------------r_------------_.
__
GAEEN
HIGH EfFICIENCY
/~
RED
OL-______~__~~________~~__~~--------~--~------------~~------------~
500
650
700
750
WAVELENGTH - nm
Figure 2. Relative Intensity vs. Wavelength
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
HER HLMP-1800,-1801
Yellow HLMP-1819,-1820
Green HLMP-1840,-1841
90
!J
80
~~
"'"
00
I
.
Zw
:E~
2.5
~'"
w:.
2.0
-0
1.5
w
1.0
5~
0:
0,5
1.4
OJ
1.3
~
>/
,
1£ 9"
1. 1
i=w'"
-
1.0
,
n
0.9
~
I
~
/
~ -:::
0.8
I
;;
0.7
0.6
10
15
~
20
~
~
~
~
00
!'arlEEN
fi=
J
0:
VHLOW
EFflCJENCY RED
V
L
/
1.2
.~
If
j.
If
o ./
o 5
>
.~
HIGH
YELlOW
1.5
I
,,~
>0:
1. 6
I
'HlGHIEF~lclI,JCY
flED ANIl OREEN
4.5
o
10
20
30
ff
40
50
60
70
80
90 100
IPEAK - PEAK LED CURRENT - rnA
IDe - DC CURRENT PER LED rnA
Figure 5. Relative Luminous .Intenslty vs. Forward Current
Figure 6. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak LED Current
LOW CURRENT LAMPS
HER HLMP-1740
Yellow HLMP-1760
10
10.0,---,----,----,---,----,
I
~
,
~ 8.01---t----t---i---++---:;j
~1
-tA .25"C
....
150:
·z N
~~
~fa
HIGH
EFFICIENCY
0:
Reo ....
i3
o
0:
-....
6.0 f---+---l----l....;~:tf-__l
~j
,
;! 4 . 0 r - - - t - - + " ' 7 ' ' r f - - - t - - - i
~~
:3~
2.0 f---+-::",-l----l---;--__l
~
~
Wo:
~
,
J
~
)
1.0
.5
f"lOW
2.0
1.5
VF.- FORWARD VOLTAGE
2.5
-v
IDe - DC CURRENT PER LED - rnA
Figure S. Relative Luminous Intensity vs. Forward Current
Figure 7. Forward Current vs. Forward Voltage
INTEGRATED RESISTOR LAMPS
5 Volt HLMP-1660, -1674, 1687
12 Volt HLMP-1661, -1675, -1688
24
'",
20
150:
16
""
12
E
...
I
I
I
;!:
0:
~
.,
o
o
II
16
""
12
0
I
V
/
0:
'"
~
,
;!:
0:
I
~
150:
0:
V
'"
20
...
/
0:
'",
E
V
0:
0
24
/
V
~
L
I8
7.5
10
12
14
I
15
o
o
16
1/;'
,/
V
I
I8
7.6
I
10
12
14
I
15
16
Vc;c -APPLIED FORWARD VOLTAGE-V
Vee - APPLIED FORWARD VOLTAGE - V
Figure 9. For:ward Current vs. Applied Forward Voltage. 5 Volt
Devices
..
Figure 10. Forward Current vs. Applied Forward. Voltage. 12
Volt Devices
6-48
2.5
2.0
2
w
1.5
~
a:
1.0
/
>
;:
0.5
0
0
2
/
/
~GH
w
>
~
a:
/
0.5
EFFICIENCV_
REO, YELLOW.
GREEI
4
/
1.0
2
6
o
I
8
4
I--
HIGH EFFICIENCV
I--J-+-v-++-~::;r~
a
10
5 VOLT DEVICE
/
8
12
16
20
12 VOLT DEVICES
Figure 11. Relative Luminous Intensity vs. Applied Forward
Voltage. 5 Volt Devices
Figure 12. Relative Luminous Intensity vs. Applied Forward
Voltage. 12 Volt Devices
6-49
FliU-
2mm SQUARE FLAT TOP LED LAMPS
HEWLETT
High Efficiency Red HLMP-l250, -l251
a:~ PACKARD
Yellow HLMP-L350, -L351
Green HlMP-L550, -L551
Features
• WIDE VIEWING ANGLE
• UNIFORM LIGHT OUTPUT
• SQUARE LIGHT EMITTING AREA
• MOUNTS FLUSH WITH PANEL
• CHOICE OF THREE BRIGHT COLORS
-
High Efficiency Red
Yellow
High Performance Green
Description
These rugged solid state lamps are designed for applications requiring a bright, compact source of light. Uniform
light output, wide viewing angle and flat top make the lamp
ideal for flush mounting on a front panel.
The red and yellow devices use Gallium Arsenide Phosphide on Gallium Phosphide light emitting diodes, the green
devices use a Gallium Phosphide light emitting diode.
Axial Luminous Intensity and viewing Angle
Color
Part Number
HLMP-
Description
Iv (mcd)
Typ.
Min.
Tesl
Condition
2(')1/2111
140
High
Efficiency
Red
-L250
Tinted, Diffused
0.8
1.8
10mA
-l251
Tinted, Diffused, High Brightness
2.1
2.9
10 mA
Yellow
-L350
Tinted, Diffused
0.9
1.5
10 mA
-L351
Tinted, Diffused, High Brightness
1.4
2.5
10 mA
-L550
Tinted, Diffused
1.0
2.0
10mA
-L551
Tinted, Diffused, High Brightness
1.6
3.0
lOrnA
Green
NOTE:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial intensity.
6-50
140
140
Package Dimensions
3Sl
i r lBOLI,r
~
0.B9 (0]81"
lo.o
0,64
,,"
i
F
4,19\0,185)
3.7S(if.J49J
i
2.'110.0811
"
,,'
~
~:;~~--
~~~:~:~~;l-
t
-
0.90 10.0351 REF.
fSOUA:;V
1
I
r--,I I
~10.2201_L
~CATHODE
0.4510.0101
2.54
'~'""":JL
3.fJ110.1211
r----24.13 10.9501
MIN.
4.83 (O.190)
~~~OOI
I
1.2110.OGOl
NOM.
NOTES:
1, ALL DIMENSIONS ARE IN MILLIMETRES (INCHES/'
2. AN EPO'>;Y--MENISCUS MAY EXTEND ABOUT
6,91 (O,272}
6,10 (0.240)
1 mm j(t04Q") DOWN THE LEADS.
Electrical/Optical Characteristics at TA -- 25°C
.COMMON CHARACTERISTICS
Symbol Parameter
High
Efficiency Red
Yellow
Green
L2501lL251
L350/351
L550/551
Min.
'TYP·
Max.
Min.
'TYP·
Max.
Min.
'TYP·
Max.
Units Test Conditions
ApEAK
Peak Wavelength
635
583
565
nm
~A1I2
Spectral Line
Halfwidlh
40
36
28
nm
Ad
Dominant Wavelength
626
585
569
llv
Luminous Efficacy
145
500
595
VR
Reverse Breakdown
Voltage
5.0
VF
Forward Voltage
1.5
TS
Speed of Response
C
Capacitance
IJJC
Thermal Resistance
3.0
5.0
1.5
2.2
90
90
Note 1
IWat't
5.0
2.2
nm
lumen Note 2
3.0
1.5
2.3
500
11
15
18
120
120
120
3.0
=100)LA
V
IR
V
IF'" 10 rnA
ns
pF
VF'" 0, f '" 1 MHz
°C/W Junction to
Cathode Lead
NOTES:
1. The dominant wavelength. Ad. is derived from the CIE chromaticity diagram and represents the single wavlength which defines the
color of the device.
2. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie ~ Iv/~v' Where Iv is the luminous intensity in candelas
and ~v is the luminous efficacy in lumens/watt.
6-'51
Absolute Maximum Ratings atTA=25'C
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
High Efficiency
Green
Yellow
Red
HlMP·l250/·L251 HlMP·L350/-L351 HLMP·1550/·l551
Parameter
Peak Forward Current
Average Forward Currentl11
DC Currentl:?l
Power Oissipationl 3 1
Reverse Voltage (lR - 100 JJA,)
Transient Forward Currentl 4l (i0 psee Pulse)
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
(a mm 10.063 in.1 from body)
60
20
20
65
5
500
90
25
30
135
5
500
-55 to +100
90
25
30
135
5
500
-20 to +100
-55 to +100
Unite
mA
mA
mA
mW
V
rnA
~C
260·C for 5 seconds
NOTES:
1. See Figure 3 to establish pulsed operating conditions.
2. For Red and Green Series derate linearly from 50' C at 0.5
mAl" C. For Yellow Series derate linearly from 50' C at 0.2
mN'C.
3. For Red and Green Series derate power linearly from 25' C
at 1.8 mW/' C. For Yellow Series derate power linearly from
50'C at 1.6 mW/'C.
4. The transient peak current is the maximum non-recurring
peak current that can be applied to the device without
damaging the LED die and wirebond. It is not recommended
that the device be operated at peak currents beyond the
peak forward current listed in the Absolute Maximum
Ratings.
90'1---+---+--1--+-===
Figure 1. Relative Luminous Intensity vs. Angular Displacement
1.0r----------.---~._--~~_r--------~~_.--------------~------------~
--------+--------_1
O.5f------------++---j!\-----+\--..,I------~.......
WAVELENGTH - nm
Figure 2. Relative Intensity vs. Wavelength
6-52
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
HER HLMP-L250, -L251
Yellow HLMP-L350, -L351
Green HLMP-L550, -L551
90
#
I
80
1/
)
1.5
0:
U
/
2.5
1.0
15
~V
1.2
w"'
>0:
>u
1.
yEt-LOW
1/
1
0.9
~
0.8
"
10
15
~ t:S
1''f-
VI
2.0
1.0
4.5
t--
fA
20
10
5.0
I
Af
,-........,'--------I-->.,--------l---------I
~~OO~---~--~~~-----~-~~------~--~------~~------~7~
WAVELENGTH - nm
Figure 2. Relative Intensity vs. Wavelength
6-56
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
HER HLMP-M2XX Series
Yellow HLMP-M3XX Series
Green HLMP-M5XX Series
90
~
BO
"E
70
I
I-
ffi
'a:"
"
i"E
";:a:
~
I
.!:
I
60
,.....
HIGH
EfflCIENCYJ
RED,
50
1/1/
40
30
20
10
jg
1.0
Figure 3. Maximum Tolerable Peak Current vs.
Pulse Duration. (Ioc MAX as per MAX Ratings.)
4.5
>I-
in_
wE
z"
~:=
",I-
""
00
i~
".... "....
4.0
I
3.5
3.0
2.0
~~
1.0
'"
0.5
"
>-
"JIGHiEFf!CIEJCY
RED AND GREEN
ffi"
u
-/
1.4
5.0
~
1.2
>
1. 1
~
1.0
I
0.9
YEL.lOW
~"
0.8
I
HIGH
EFFiCIENCY RED
/'"
II
/
1.3
I~ I/'
'f
w
-:::::
-'(
GREEN
/
III
;;
0.7
,/
5
4.0
YELLOW
a:
/
3.0
I.G
j
1.5
?VELLOW_ t----
rt
II/)
VI
2.0
1.5
'/
w"
>'"
0
t---- t----
Figure 4. Forward Current vs. Forward Voltage
/
2.5
~
I
VF - FORWARD VOLTAGE - V
tp - PULSE DURATION -ps
5.0
GRJEN
10
15
20
25
30
35
40
45
O.G
50
o
10
20
30
40
50
60
70
80
90
100
IPEAK - PEAK LED CURRENT - rnA
IDe - DC CURRENT PER LED rnA
Figure 5. Relative Luminous Intensity vs. Forward
Current. Nondlffused Devices.
Figure 6. Relative Efficiency (Luminous Intensity per Unit Current)
vs. Peak LED Current. Nondiffused Devices.
1.3
YELLOW
1.2
>I-
2.0
"ffi
U
§
in_
z"
~~
ZN
~~
/
1.5
00
zw
-N
,,,,""
"
1.0
....
w"
>'"
0
I-z
~-
/
.5
a:
---
V
V
w
V
g>
20
/
0.9
0.8
0.7
"~
O.G
"
15
l,.f. F"'"
1.0
25
I
o
10
20
30
40
50
60
70
80
90
IpEAK - PEAK CURRENT PER LED - rnA
IDe - DC CURRENT PER LED - rnA
Figure 7. Relative Luminous Intensity vs. Forward
Current. Diffused Devices.
-
dRIEEN
0.5
0.4
30
--
1/
w
V
10
1.1
'7
fE~
1"-,,, "
>-
Figure 8. Relative Efficiency (Luminous Intensity per Unit Current)
vs. Peak Current. Diffused Devices.
6-57
T-1 (3mm)
Flin-
a!e.
RED SOLID STATE LAMPS
HEWLETT
PACKARD
HlMP-1000 Series
HlMP-1200 Series
Features
- rr mr.nm
3.18 (.125)
2.61 [1Q5)
3.431.135)
• WIDE VIEWING ANGLE
• SMALL SIZE T-1 DIAMETER 3.18mm (0:125")
"'I
6.351t250)
t
4.io
~
mimi _~jl-----1 4.;a p 6s1
• IC COMPATIBLE
• RELIABLE AND RUGGED
Description
1.•2\'.4.,
JL
NOM.
24.13 ~O.95J
MIN.
The HLMP-1000 is a series of Gallium Arsenide Phosphide
Light Emitting Diodes designed for applications where
space is at a premium, such as in high density arrays.
OATHOO£-I--
The HLMP-1000 series is available in three lens configurations.
1.21LOSOIT'--J
NOM.
HLMP-1000 .,-- Red Diffused lens provides excellent on-off
contrast ratio, high axial luminous intensity, and wide viewing angle.
I
--- 2.54 to.1OO) NOMINAL
HLMP-1080 - Same as HLMP-1000, but untinted diffused to
mask red color in the "off" condition.
Figure A.
HLMP-1 071/-1201 - Untinted non-diffused plastic lens provides a point source. Useful when illuminating external lens,
annunciators, or photo-detectors.
Pari
Number
HLMP·
Iv (mcd)
@20mA
Package &
Lens Type
Min.
Typ.
_J
Viewing
Angle
201/2
-1000
A-Tinted
Diffused
,5
1.0
60"
-1002
A-Tinted
Diffused
1.5
2.5
60"
-1080
A-Untlnted
Diffused
.5
1.5
60'
A-Untinted
Non-Diffused
1.0
-1200
B-Untinted
Non-Dlffused
.5
1.0
120·
-1201
B-Untinted
Non-DJffuaed
1.5
2.5
120'
-1071
t-
4:)1
Typ.
~o
t-ii~HI
1--3.301.1301 MAX.
L
I~U£j
3.23 t.127)
11)
~L
24.1:1 (0.95)
MIN.
0.45 t.018t
CATHODE-
-+
I-----
h~~~~!L
'----
1.27t+{}Sms--i- :
2.0
NOM.
45'
I IJ.-I
-j
2.54 (0.100)
NOM1NAL
Figure B.
NOTES:
1, ALL OlMENSIONS ARE. IN Mltt.lMETAES (INCHES}.
2, Alii EPOXY MENt$¢US MAY EXHNO ABOUT 1mtll
(.040"1 DOWN THE LEApS.
6-58
Absolute Maximum Ratings at TA = 25° C
I IiMclHer
.
Dissipation
1000 Series
Units
100
mW
.
cDC.Forward Current (1)
50
mA
Average Forward CurrEln.i
50
mA
1000
mA
Peak Operating Forward Current
.CC> •• C
•.
·CCC.CC.
5
V
2000
mA
Reverse Voltage OR"" 100 !,Al
Transient Forward Currentl1! (10 !,sec Pulse)
Operating and Storage Temperature Range
-15°C to +100°C
26q~C for 5 seconds
cR~ad Solder TemperaWre (1,6 rum [0.06?lnChlbElI()wpaq~age base)
Note:
1. Derate linerarly from
sooe at 0.2 rnA/DC.
Electrical Characteristics at TA =25°C
Symbol
Parametilrs
ApEAK
Peak Wavelength
655
nm
Ad
Dominant Wavelength
648
nm
,',A112
Spectral Line Halfwidth
24
nm
TS
Speed of Response
10
ns
C
Capacitance
100
pF
8JC
Thermal Resistance
120
°C/W
VF
Forward Voltage
VR
Reverse Breakdown Voltage
Min,
Typ.
1.4
Max.
1,6
2.0
5
Units
Test Conditions
Measurement at Peak
VF = 0, f"" 1 MHz
Junction to Cathode Lead
V
IF "" 20 mA
V
IR
=100 JiA
HLMP-1200/-1201
50
.
40
~
30
2.60
<
~
~
,
~
..
--1---5
20
/
10
'I 1 1
I
00
0.4
0.8
1.2
1.6
2.0
:/
7
~-
10
20
30
50 90 1-----l--l----J---+'3i!ll--''::0·'':'20'::-·-:"30'::-'-"40C:-'-"so"""'607. ""70"'·...o~·9:':0:-:-'100°
Q
0
40
IF - FORWARD CURRENT - rnA
FORWARD CURRENT - VOLTAGE CHARACTERISTICS
Figure 1, Forward Current vs,
Voltage Characteristic.
Z-
/
0
-"
L
r-~-
5
W
~
I-~
-
2
~
<
-
Figure 2. Luminous Intensity vs.
Forward Current (IF),
HLMP-1000/-1002/-10BO
Figure 4. Relative Luminous Intensity vs. Angular Displacement.
Figure 3. Typical Relative Luminous
Intensity vs. Angular Displacement.
HLMP-1071
Figure 5. Relative Luminous Intensity vs. Angular Displacement.
6-59
T-1 (3mm)
Flin-
DIFFUSED SOLID STATE LAMPS
HEWLETT
HIGH EFFICIENCY RED •
ORANGE •
YELLOW •
HIGH PERFORMANCE GREEN.
~~ PACKARD
HLMP-1300 SERIES
HLMP-K400 SERIES
HLMP-1400 SERIES
HLMP-1500 SERIES
Features
• HIGH INTENSITY
• CHOICE OF 4 BRIGHT COLORS
High Efficiency Red
Orange
Yellow
High Performance Green
• POPULAR T-1 DIAMETER PACKAGE
• SELECTED MINIMUM INTENSITIES
• WIDE VIEWING ANGLE
• GENERAL PURPOSE LEADS
• RELIABLE AND RUGGED
• AVAILABLE ON TAPE AND REEL
package Dimensions
Description
This family of T-l lamps is widely used in general purpose
indicator applications. Diffusants, tints, and optical design
are balanced to yield superior light output and wide viewing
angles. Several intensity choices are available in each color
for increased design flexibility.
Part
Number
HLMp·
1300
General Purpose
1.0
1301
General Purpose
2.0
1302
High Ambient
3.0
1385
Premium lamp
6.0
K400
General purpose
1.0
K401
High Ambient
2.0
K402
Premium lamp
3.0
1400
General Purpose
1.0
1401
General Purpose
2.0
1402
High Ambient
3.0
1485
Premium Lamp
6.0
1503
General Purpose
1.0
1523
High Ambient
2.6
1585
Premium Lamp
4.0
~ 0.46 HW18, SQUARE NOM.
CATHODE
"
)j L
27NOM.50
10.0
2.5410.100)
NOM.
NOTES;
1. At.l OIMENSIONS ARE rN MIi..J..IMETRES !INCHES).
2. AN EPOXy MENISCt)S MAY EXTENOAa.O\,.JT lmm
(-Q'{)4O-"i DOWN THE LEADS,
6-60
Applicallon
Minimum
Intensity
(mcd) at 10mA
Color
(Material)
High
Efficiency
Red
(GaAsP
on GaP)
Orange
(GaAsP
on GaP)
Yellow
(GaAsP
on GaP)
Green
(GaP)
Electrical Characteristics at TA = 25°C
Symbol
Qescrlptlon
Iv
(uminous Intensity
20112
ApEAK
Ad
~A1I2
TS
C
I"'"
Device
High Efficiency Red
13,00
1301
1302
1385
Orange
K400
K401
K402
Yellow
1400
1401
1402
1485
Green
1503
1523
1585
Min.
'TYP.
1.0
2.0
3.0
6.0
2.0
2.5
4.0
10.0
to
2.0
3.0
2.0
2.5
4.0
to
2.0
3.0
6.0
2.0
3.0
4.0
10.0
1.0
2.6
4.0
2.0
4.0
6.0
Max.
Units
Test Condillons
~
mcd
IF'" 10 mA
60
Deg.
IF'" 10 mA
See Note 1
High Efficiency Red
Orange
Yellow
Green
635
603
583
565
nm
Measurement at Peak
High Efficiency Red
Orange
Yellow
Green
626
608
585
569
nm
See Note 2
Spectral Line
Halfwidth
High Efficiency Red
Yellow
Green
40
36
28
nm
Speed of Response
High Efficiency Red
Orange
Yellow
Green
90
280
90
500
ns
High Efficiency Red
Orange
Yellow
Green
11
4
15
18
pF
120
°CfW
Including Angle
Between Half
Luminous Intensity
Points
Peak Wavelength
Dominant Wavelength
Capacitance
All
8JC
Thermal Resistance
All
VF
Forward Voltage
HER/Orange
Yellow
Green
t5
1,5
1.5
5.0
VA
Reverse Breakdown Volt.
AU
rJv
Luminous Efficacy
High Efficiency Red
Orange
Yellow
Green
2.2
2.2
2.3
145
262
500
595
3.0
3.0
3.0
VF '" 0; f '" 1 MHz
Junction to Cathode'
Lead
V
IF=10mA
V
IR = 100 p.A
lumens
Watt
See Note 3
NOTES:
1. 0112 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/~v. where Iv is the luminous intensity in can del as and ~
is the luminous efficacy in lumens/watt.
6-61
Absolute Maximum Ratings at TA
HER/Orange
Yellow
Peak forward Current
90
60
Average Forward Current l11
25
20
DC Current l21
30
20
Power Dissipation l3J
135
Parameter
Reverse Voltage OR = 100 pAl
Units
90
rnA
25
rnA
30
rnA
135
rnW
5
5
5
V
500
500
500
rnA
-55 to +100
-55 to +100
Transient Forward Current l41 (10 psee Pulse)
Operating Temperature Range
±=
Green
Storage Temperature Range
-20 to +100
'0
-55 to +100
260· 0 for 5 seconds
Lead Soldering Temperature 11.6 mm (0.063 in.) from body]
NOTES:
1. See Figure 5 (Red/Orange). 10 (Yellow) or 15 (Green) to establish pulsed
4. The transient peak current is the maximum non-recurring peak current
that can be applied to the device without damaging the LED die and
operating conditions.
2. For Red, Orange, and Green series derate linearly from 50' C at 0.5
mAIo C. For Yellow series derate linearly from 500 Cat 0.2 mAID C.
wirebond. It is not recommended that the device be operated at peak
currents beyond the peak forward current listed in the Absolute Maximum
3. For Red, Orange, and Green series derate power linearly from 25°C at 1,8
mW/oC. For Yellow series derate power linearly from 50°C at 1.6 mW/oC.
Ratings.
1.0
~
~
w
HIOH EFFICIi:.NCY
••0
0.'
~
~
0
500
700
750
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength
T-1 High Efficiency Red, Orange Diffused lamps
1.6r-...-......--,.-,--...-.,......,.-,.....-,
90
BO
1,
70
~
80
~
a
~
~
~
.
...,
50
20
10
5.0
IDe - DC CURRENT PER L.ED - mA
VF - FORWARO VOL. TAGE - V
Figure 2. Forward Current vs. Forward
Voltage Characteristics.
Figure 3. Relative Luminous tntenslty
vs. DC Forward Current.
IpEAK - PEAK CURRENT PER L.ED - mA
Figure 4. Relative Elllclency (Luminous
Intensity per Unit Current)
vs. Peak LED Current.
100'
tp - PUL.SE DURATION -1'5
Figure 5. Maximum Toterable Peak Current vs. Putse
Duration. (Ioc MAX as per MAX Ratings).
Figure 6. Relative Luminous tntensity vs. Angular Disptacement.
6-62
T-1 Yellow Diffused Lamps
2. 5
I
TA ..
I
II
0
0
0
I
0
0
1.0
1.5
25~C
/
5
0
/
A
0
2.0
2.5
30
VF • FORWARD VOLTAGE -
35
1.5
g
/
/
5
1.6
/
/
,/
V
~
1.3
~
1.2
~
::;
1
i
1. 0
~
9
/
20
V
/
.7 0
4.0
If - FORWARD CURRENT - rnA
Figure 8. Relative Luminous Intensity
vs. Forward Current.
V
/
6
15
10
v
Figure 7. Forward Current vs. Forward
Voltage Characteristics.
,/'
u
10
20
30
40
50
60
IpEAK - PEAK CURRENT - mA
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
100"
tp - PULSE DURATION -I-'S
Figure 11. Relative Luminous Intensity vs. Angular Displacement.
Figure 10. Maximum Tolerable Peak Current
vs. Pulse Duration. (Ioc MAX
as per MAX Ratings.)
T-1 Green Diffused Lamps
0
7
0
0
I
0
I
,
s
/
0
s
0
I
0
V
5
0
0
0
10
/
0
II
VF - FORWARD VOLTAGE - V
Figure 12. Forward Current vs. Forward
Voltage Characteristics.
~
1.4
f3
1.3
ffi
1. 2
,
0
/
5
oL
20
5
>
/
: f
10
15
20
25
30
3540
IpEAK - PEAK CURRENT PER LED - rnA
Figure 13. Relative Luminous Intensity
vs. Forward Currenl.
7
0'0102030405060
70
80 90100
IpEAK -PEAK CURRENT PER LED - rnA
Figure 14. Relative Efficiency (Luminous
Intensity per Unit Current)
vs. Peak LED Current.
tp - PULSE DURATION -I'S
Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration. (Ioc MAX
as per MAX Ratings.)
Figure.16. Relative Luminous Intensity vs. Angular Displacement.
6-63
FliOW
LOW PROFILE T-1 (3mm) LED LAMPS
HEWLETT
~~ PACKARD
High Efficiency Red HLMP-1350
Yellow HLMP-1450
High Performance Green HlMP-1550
Features
package Dimensions
• LOW PROFILE HEIGHT
• SMALL T-1 SIZE DIAMETER
3.18 mm (.125 inch)
• HIGH INTENSITY
• IC COMPATIBLE
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
High Performance Green
Description
NOns:
t. AU, DIMENSI[)NSARE IN
This family of solid state lamps is especially suited for
applications where small package size is required without
sacrificing luminous intensity. The HLMP-1350 is a red
tinted, diffused lamp providing a wide viewing angle. The
HLMP-1450 and HLMP-1550 are similar products in yellow
and green respectively.
MILiIMETRE'S (INCHll.sl.
2. AN t;:POx-Y MENISCUS MAY
EXTEND ABOUT 1fl'1fll
(."040". DOWN THE LEADS
Axial Luminous Intensity and viewing Angle @ 25°C
Part
Number
HLMP-
Min.
Typ.
Test
Condition
rnA
IV (mcd)
Description
201/2
(Typ.)
[1]
Ad
(nm-Typ.)
[2]
626
High Efficiency
Red
Color
1350
Tinted, Wide Angle
1.0
2.0
10
55'
1450
Tinted. Wide Angle
2.0
2.0
55'
585
Yellow
Tinted, Wide Angle
1.0
1.0
10
1550
10
55'
569
Green
NOTES:
1. 01/2 is the off-axis angle at which the luminous intensity is half the axial intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the devi!;e.
For Maximum Ratings and Electrical/Optical Characteristics (including figures) see HLMP-1300/-1400/-1500 data
sheet, publication number 5953-7735, except for Figure A
shown here.
Figure A. Relative Luminous Intensity vs. Angular Displacement.
6-64
--~-----,-,--------
-
~------,
---------
._--
IIIU3 HEWLETT
1L'7'~ PACKARD
Features
• HIGH INTENSITY
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
High Performance Green
• POPULAR T-1 DIAMETER PACKAGE
• SELECTED MINIMUM INTENSITIES
• NARROW VIEWING ANGLE
• GENERAL PURPOSE LEADS
• RELIABLE AND RUGGED
• AVAILABLE ON TAPE AND REEL
package Dimensions
Description
This family of T-1 lamps is specially designed for applications requiring higher on-axis intensity than is achievable
with a standard lamp. The light generated is focused to a
narrow beam to achieve this effect.
Pari
Number
HLMP-
f
1.021.040)
NOM.
1320
1321
Description
Untinted
Non-Diffused
Tinted
Non-Diffused
CATHODE
°11
1420
1421
NOMINj\~
5
1.27l.O
-
1520
2.54 {.1001
NOMINAl.
1521
NOTES,
1. ALlDllIIENSIONSARE INMILLIIIIETRES (INCHES),
2. AN EPOXY Mf!NISCUS MAY EXHND ABOUT lmm
{,040··' DOWN THE LEADS-
6-65
Untinted
Non-Diffused
Tinted
Non-Diffused
Untinted
Non-Diffused
Tinted
Non-Diffused
Minimum
Intensity
(mcd)
al10 rnA
8.6
8.6
9.2
6.0
4.2
4.2
Color
(Material)
High
Efficiency
Red
!GaAsP
on GaP)
Yellow
(GaAsP
on GaP)
Green
(GaP)
--"-'
Electrical Characteristics at TA = 25°C
Symbol Description
Iv
Luminous Intensity
Device
HLMP·
Min.
Typ.
1320
1321
8.6
3.6
12.0
12.0
mcd
IF'" 10 mA (Figure 3)
1420
1421
9.2
12.0
12.0
mcd
IF" 10 mA (Figure 8)
6.0
1520
1521
4.2
4.2
5.0
5.0
mcd
IF" 10 mA (Figure 3)
Max. Unils
Test Conditions
20 1/2
Including Angle
Between Half
Luminous Intensity Points
All
45
Deg.
IF" 10 mA
See Note 1
(Figures 6, 11, 16, 21)
ApEAK
Peak Wavelength
132X
142X
152X
635
583
565
nm
Measurement at Peak
(Figure 1)
IlA 112
Spectral Line Halfwidth
132X
142X
152X
40
36
28
nm
I\d
Dominant Wavelength
132X
142X
152X
626
585
569
nm
TS
Speed of Response
132X
142X
152X
90
90
500
ns
C
Capacitance
132X
142X
152X
11
15
18
pF
8JC
Thermal Resistance
Ali
VF
Forward Voltage
132X
142X
152X
1.5
1.5
1.5
VR
Reverse Breakdown Voltage
All
5.0
'Iv
Luminous Efficacy
120
"C/W
2.2
2.2
\ 2.3
V
3.0
3.0
3.0
145
500
595
132X
142X
152X
See Note 2 (Figure 1)
VF = 0; f" 1 MHz
Junction to Cathode Lead
IF"'10mA
V
IR"1001'A
lumens
See Note 3
'"Wait
Notes:
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation
Ie = Iv/1Jv, where Iv is the luminous intensity in candelas and 1Jv is the
luminous efficacy in lumens/watt.
1. Eh/2 is the off-axis angle at which the luminous intensity is half the axial
luminous intensity.
2. The dominant wavelength, Ad. is derived from the erE chromaticity
diagram and represents the single wavelength which defines the color of
the device.
Absolute Maximum Ratings at TA
= 25°C
Red
Yellow
Gireen
Units
Peak Forward Current
90
60
90
mA
Average Forward Current!11
25
20
25
mA
DC Current!21
30
20
SO
mA
Power Dissipationl31
135
85
135
mW
5
5
5
V
500
500
500
mA
-5510+100
-20 to +100
-55 to +100
·C
Parameter
Reverse Voltage OR '" 100 I'Al
Transient Forward Currentl4! (10
,"sec Pulse)
~emperature Range
emperature Range
-5510+100
260· C for 5 seconds
Lead Soldering Temperature
(1,6 mm {0.063 InJ from bodyj
6-66
NOTES:
1. See FigureSIRedl. 10 IYeliowl. or 1SIGreeni to establish pulsed operating conditions.
2. For Red and Green series derate linearly from SO°C at O.S mAloC. For Yellow series derate linearly from SO'C at 0.2 mAl'C.
3. For Red and Green series derate power linearly from 2S'C at 1.8 mW/'C. For Yellow series derate power linearly from SO'C at 1.6 mW/oC.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
1.0
~
~
~
~
w
0.5
2
~
0
500
750
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength
T-1 High Efficiency Red Non-Diffused
0
0
0
0
I ojjji
I
,
I
01----
'I----
W
0
o
~~
0
0
0
1.0
V
0
0
'.0
3.0
Figure 2. Forward Current vs. Forward
Voltage Characteristics
tp -
PULSE DURATION
5
1--"-
4
1/
/
3
/
I
2
/
v
II
0
9
10
15
25
IDe - DC CURRENT PER LED - rnA
VF - FORWARD VOL TAG E - V
I.'
1
'/
2.0
q
,
I
/
Figure 3. Relative Luminous Inlenslly
vs. DC Forward Current
I
o., I
o.7
o
10
20
~
~
~
~
70
80
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current
-I'~
Figure 5. Maximum Tolerable Peak
Current vs. Pulse Duration.
(locMAX as per MAX Ratings)
Figure 6. Relative Luminous Intensity vs. Angular Displacement
6-67
00
IpEAK - PEAK CURRENT PER LEO - mA
T-1 Yellow Non-Diffused
'.B
2.S...---,---r--.,---"
~
2.'
h
w.!i
i
~~~~~---+~-
1l~.
"~~~~--f'--
~e
i
2O~"""'~~-I
;!
!~
~~
~i
~-
',.
~~
!;~
d
1.3
t~
'.2
u~
1.5
wQ
ww
~~
,~
:l~
wa:
a:~
.5
...
...
.,....
,.
S
u
\If - FORWARD VOLTAGE· V
Figure 7. Forward Current vs.
Forward Voltage
Characteristics
IF - FORWARD CURRENT - mA
Figure 8. Relative Luminous Intensity
vs. Forward Current
'PIEAK - Pl!AK CURRENT - mA
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current
tp - PULSE DURATION -~,
Figure 10. Maximum Tolerable Peak Current
vs. Pulse Duration. (IDCMAX
as per MAX Ratings)
Figure 11. Relative Luminous Intensity vs. Angular Displacement
T-1 Green NOn.,Diffused
I,. - FORWARD CURRENT - mA
VF - FORWARD VOLTAGE_V
Figure 12. Forward Current vs.
Forward Voltage
Characteristics
Figure 13. Relative Luminous Intensity
vs. Forward Current
"EAK - PEAK CURRENT PEA LED - mAo
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current
I
tp - PULSE DURATION -,ul
Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration. (locMAX
as per MAX Ratings)
Figure 16. Relative Luminous Intensity vs. Angular Displacement
6-68
T-1 3/4 (Smm)
RED SOLID STATE LAMPS
HLMP-3000
HLI\t1P-3Q01
HLMp·3002
HLMP-3003
HlMP·30S0
Features
•
•
•
•
LOW COST, BROAD APPLICATIONS
LONG LIFE, SOLID STATE RELIABILITY
LOW P-OWERREQUIREMENTS: 20 mA @ 1.6V
HIGH LIGHT OUTPUT:
2.0 mcd Typical for HLMP-3000
4.0 mcd Typical for HLMP-3001
• WIDE AND NARROW VIEWING ANGLE TYPES
• RED DIFFUSED AND NON-DIFFUSED
VERSIONS
Description
The HLMP-3000 series lamps are Gallium Arsenide
Phosphide light emitting diodes intended for High Volume/
Low Cost applications such as indicators for appliances.
smoke detectors. automobile instrument panels and many
other commercial uses.
The HLMP-3000/-3001/-3002/-3003 have red diffused
lenses where as the HLMP-3050 has a red non-diffused
lens. These lamps can be panel mounted using mounting
clip HLMP-0103. The HLMP-3000/-3001 lamps have .025"
leads and the HLMP-3002/-3003/-3050 have .018" leads.
NOTES:
1. The transient peak current is the maximum non-recurring peak current that
can be applied to the device without damaging the LED die and wirebond. It
is not recommended that the device be operated at peak currents beyond the
peak forward current listed in the Absolute Maximum Ratings.
Absolute Maximum Ratings
at TA = 25°C
~pation
DC Forward Current IDerate
100
50
Urilts
mW
mA
50
1000
5
2000
mA
rnA
V
mA
3000 Series
linearly from 50°C at 0.2 mN°C)
Average Forward Cu rrent
Peak Operating Forward Current
Reverse VoltaQe IIR = 100 itA)
Transient Forward Currentl 1 1
(10 I'sec Pulse)
Operating and Storage Temperature Range
Lead Solder Temperature (1.6 mm
[0.063 inch] below package base)
-55° C to +10Qo C
260· C for 5 seconds
package Dimensions
HLMP·3002/-3003/-3050
1--->1-- ~;:"'~
t
tWoi
HLMP-3000/-3001
NOTES:
1, AI..L DIMENSIONS ARE IN MILLIMETRES{lNCHES).
2, AN EPOXY MENISCUS MAY EXTEND A60UT lmm
, (.040"1 DOWN THE l.EADS.
~<~~-t
~'1J
n1nl
6,1 tMO)
5.6 <'ZJO}
/"-'~
CATHOOE
_
CATHODE
6-69
O~
2.54 ,.100) NOM.
Electrical Characteristics at TA=25°C
Symbol
Description
Luminous Intensity
Iv
Oevlce HLMP·
Min.
Typ.
30oof3002
3001/3003
1.0
2.0
1.0
2.0
4.0
2.5
60
Included Angle Between
Half Luminous
Intensity Points
Peak Wavelength
20112
Ap
Dominant Wavelength
Ad
3050
3000/3002
3001/3003
3050
Units Tesl Conditions
med IF=20 mA
med if=20 rnA
med IF=20 mA
De9· IF=20 rnA
Max.
60
24
655
655
655
648
3000/3002
3001/3003
3050
3000/3002
nm
Measurement at Peak
om
3001/3003
Spectral Line Halfwidlh
AA1J2
3050
3000/3002
24
nm
10
os
100
pF
3001/3003
3050
Speed of Response
TS
C
Capacitance
(-lJC
Thermal Resistance
3000/3002
3001/3003
3050
3000/3002
3001/3003
3050
VF
forward Voltage
VB
Reverse Breakdown
Voltage
3000/3002
'C/W Junction to Cathode Lead
95
120
120
1.6
3000/3001
3002/3003
3050
1.4
VF = 0, f - 1 MHz.
2.0
V
If - 20 mA (Fig, 2)
V
IR-l00IlA
300113003
3050
3000/3002
5,0
3001/3003
3050
2.50
50
40
2.25
....>-
30
"
E
0;
....:ii
20
~
....
:ii
'"
"'"
"'"0
~
::w
10
/"
I
2.00
I
/
1.75
/
1.50
2
u
"'"5:
"'"
>
;:
~
~
1.25
/
1.00
.75
/
a:
.50
-~
.25
1
1.40
/
/
.,./
o
o
1.70
/
10
20
30
40
50
IF - FORWARD CURRENT - rnA
V F - FORWARD VOLTAGE - VOLTS
Figure 1. Forward Current Versus Forward Voltage
Figure 2. Relative Luminous Intensity Versus Forward Current
O.5f-----I-----I-----I!--\----f------4
500
550
600
WAVELENGTH - nm
Figure 3, Relative Luminous Intensity Versus Angular
Displacement.
FIgure 4. Relative LumInous Intensity Versus Wavelength.
6-70
750
T·1 3/4 (Smm)
DIfi=FUSf;D SOLtD t
PS
HICH E~~ICIENC\1w ED
ORANGE
YELLOW
HIGH I?ERFiRMANCE &IEN ~
Features
o
HIGH INTENSITY
o
CHOICE OF 4 BRIGHT COLORS
High Efficiency Red
Orange
Yellow
High Performance Green
o POPULAR T-1'I4 DIAMETER PACKAGE
o SELECTED MINIMUM INTENSITIES
o WIDE VIEWING ANGLE
o GENERAL PURPOSE LEADS
o RELIABLE AND RUGGED
o AVAILABLE ON TAPE AND REEL
Description
This family of T-1% lamps is widely used in general purpose
indicator applications. Oiffusants, tints, and optical design
are balanced to yield superior light output and wide viewing
angles. Several intensity choices are available in each color
for increased design flexibility.
package Dimensions
~WL200j
Part
Number
HUJlP-
Application
Minimum
Intensity
(mod) at 10mA
3300
General Purpose
2.1
3301
High Ambient
4.0
3762
Premium Lamp
8.0
0400
General Purpose
2.1
0401
High Ambient
4.0
3400
General Purpose
2.2
3401
High Ambient
4.0
3862
Premium Lamp
8.0
3502
General Purpose
1.6
3507
High Ambient
4.2
3962
Premium Lamp
8.0
4.57 (.180)
T
0i,45j..o'1I1 SQUARE.
NQMINAL
I
I
LL
""
..011··
NOM.
NOTES:
1. ALL OIMENSIONS At:I£IN MII.LlMETRES IINCH~SI
Z. AN epoxy MENISCUSMAV EXTEND ABOUT lmm.
I 040") DOWN THE lEADS.
6-71
Color
(Material)
High
Efficiency
Red
(GaAsP
on GaP)
Orange
(GaAsP
on GaP)
Yellow
(GaAsP
on GaP)
Green
(GaP)
565nm
·Electrical Characteristics at TA =25°C
Symbol Parameter
Iv
201/2
APEAK
A)" 1/2
Ad
1's
C
(JJC
VF
VR
tlv
Luminous Intensity
Device
HLMP-
Min.
TYP·
High Efficiency Red
3300
3301
3762
2.1
4.0
8.0
3.5
7.0
15.0
Orange
D400
0401
2.1
4.0
3.5
7.0
Yellow
3400
3401
3862
2.2
4.0
8.0
4.0
8.0
12.0
Green
3502
3507
3962
1.6
4.2
8.0
2.4
5.2
11.0
Including Angle
Between Half
Luminous Intensity
Points
High Efficiency Red
Peak Wavelength
High Efficiency Red
Orange
Yellow
Green
60
60
60
Orange
Yellow
Green
HER/Orange
Yellow
Green
Dominant Wavelength
High Efficiency Red
Orange
Yellow
Green
626
608
585
569
High Efficiency Red
Orange
Yellow
Green
90
280
90
500
High Efficiency Red
Orange
Yellow
Green
11
4
15
18
Thermal Resistance
All
140
Forward Voltage
HER/Orange
Yellow
Green
1.5
1.5
1.5
Reverse Breakdown Voltage
All
5.0
Luminous Efficacy
High Efficiency Red
Orange
Yellow
Green
Capacitance
Units
Test Conditions
mcd
IF" 10 mA
Oeg.
IF" 10 mA
See Note 1
nm
Measurement at Peak
60
635
612
583
565
Spectral Line
Halfwidth
Speed of Response
Max.
40
36
28
2.2
2.2
2.3
145
262
500
595
nm
nm
See Note 2
ns
pF
·CIW
3.0
$.0
3.0
V
VF"'O;f=lMHz
Junction to Cathode
Lead
iF= 10 mA
V
h'l = 100 p.A
lumens
See Note 3
Watt
NOTES:
1. (-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the sin91e wavelength which defines the
color of the device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/T/V, where Iv is the luminous intensity in candelas and T/V
is the luminous efficacy in lumens/watt.
6-72
Absolute Maximum Ratings at TA = 25°C
Ii!ER/Orange
Yellow
90
60
rnA
-5510+100
-55 to +100
·C
Green
Units
Transient Forward Curreli'!1 41(10 !,sec Pulse)
Operating Temperature Range
NOTES:
1. See Figure 5 (Red/Orange), 10 (Yellow) or 15 (Green) to establish pulsed
operating conditions.
2. For Red, Orange, and Green series derate linearly from 5011 C at 0.5
mA/o C. For Yellow series derate linearly from 500 Cat 0.2 mA/o C.
For Red, Orange. and Green series derate power linearly from 25° C at
3. 18 mW/o C. For Yellow series derate power linearly from 50° C at 1.6
mW/"C.,
4. The transient peak current is the maximum non-recurring peak current
that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak
currents beyond the peak forward current listed in the Absolute Maximum
Ratings.
,.o.--------,--,...-~"'_;__."""',____."""'-_.------r_-----,
1:
HIGH EFFICIENCY
~
~,o
~
O.51_-------l-f--,I'r--fPr--f--~-~~-----I_-----_l
w
"~
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength
T-1 3A1 High Efficiency Red, Orange Diffused Lamps
0
0
I
o
II
I
I
o
10
V
20
30
t-
T+
~
~~
"
~
u
~:=
I
I
I
II
0
0
40
A I
/' I
0
~
~~
c- ..
r1-
-~- -- t-
~ffi
.,
..
::~
><
~~
g-
0.5
40
VF _ FORWARD VOLTAGE - V
Figure 2. Forward Current vs. Forward
Voltage Characteristics.
IDe - DC CURRENT PER LED - rnA
Figure 3. Relative Luminous Intensity
vs. DC Forward Current.
IpEAIt - PEAK CURRENT PER LED - rnA
Figure 4. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
LED Peak Current.
-+'r..::1~!--t-+--IO.2
tp -
PULSE DURATION -,..,
Figure 5. Maximum Tolerable Peak Current vs. Pulse
Duration. (IDC MAX as per MAX Ratings
Figure 6. Relative Luminouslntensltyvs.Angular
Displacement.
6-73
T-1 3;4 Yellow Diffused Lamps
2.'
~
lA
~4
20
~~
..,
Wg
~~
~<
"25~C
V
~@
~j
w·
~<
>«
-0
~~
'.0
/
.,
L
00
VF - FORWARD VOLTAGE - V
Figure 7. Forward Current vs. Forward
Voltage Characteristics.
/
'0
/
/
15
.7 0
20
10
20
30
40
50
60
'PEAl< - PEAK CURRENT:' rnA
'F - FORWARD CURRENT - mA
Figure 8. Relative Luminous Intensity
vs. Forward Current.
Figure 9. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
Peak Current.
lrt11-t-t--t--t--t--t--f=r""t--j 0.2
90'1--_+-_+__+_-£
Ip - PULSE DURATION - 115
Figure 10. Maximum Tolerable Peak Current vs. Pulse
Duration. (IDC MAX as per MAX Ratings)
Figure 11. Relative Luminous Intensity vs. Angular
Displacement.
T-1 % Green Diffused Lamps
·
·
·
..
90
u
2.0
I
I
1.5
I
fil
N
Cl
:J
e:
~
<{
1r
;;;
"e:
e:
1.0
0
.5
1.70
Vi
o
o
V F - FORWARD VOLTAGE - V
Figure 2. Forward Current versus
Forward Voltage.
/
10
/
_. 1-
/'
>~
/
uE
ffi:=
- r----
~~
:to
WW
w~
-~
r----
~
,.....
1.20
1.10
>~
i=~
:Ie:
l-
I
II
I
wO
e:~
20
30
40
50
IF - FORWARD CURRENT - rnA
Figure 3. Relative Luminous Intensity
versus Forward Current.
1.00
o
o
20
IpEAK -
40
60
Figure 4. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.
tp - PULSE DURATION -IJ-S
Figure 5. Maximum Tolerable Peak Current v'ersus Pulse
Duration. ilDe MAX as per MAX Ratings)
Figure 6: Relative Luminous Intensity versus
Angular Displacement.
6-76
80
PEAK CURRENT - mA
100
GREEN HlMP-3550 SERIES
Electrical Specifications at TA=25°C
Min.
Typ.
Axial Luminous Intensity
,3553
3554
3567
3568
1.6
6.7,
4.2
10.6
3.2
10.0
7.0
,15.0
"IQcluded Angle'Between
Hall Luminous Intensity
Points
3553
3554
3567
3568
Description
Iv
20112
,
Device
1'j~,fI{'IP~
Symbol
Maj(.
50 ,
Units Test Conditions
mcd
IF = 10 mA (Fig. 18)
Deg.
Note 1 (Figure 21)
50
40
40
APEAK
Peah Wayelength
565
nm
Measurement at Peak (Fig. 1)
Ad
Dominant Wavelength
569
nm
Note 2
..'.A1/2
Spectral Line Halfwidth
28
nm
T5
Speed of Response
500
ns
C
Capacitance
18
pF
OJC
Thermal Resistance
120
VF
Forward Volli:lge
1,5
VR
Reverse Breakdown
Voltage
5.0
'Iv
Luminous Efficacy
2.3
VF
= 0; 1= 1 MHz
°C/W Junction to Cathode Lead
3.0
V
IF = 10 mA (Fig. 17)
V
IR=100jlA
ImIW Note 3
595
Notes: 1.8112 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, A.ct, is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie. in watts/steradian may be found
from the equation Ie = Iv/flv. where Iv is the luminous intensity in candelas and T'iv is the luminous efficacy in lumens/watt.
90
1
1. 3
/
BO
0
I
>
t-
/
o;_
~
0
2"
wE
t-o
2N
::l
0
00
I
'"'"
"'"
~~
/
OJ
Q
~
40
~~
,,~"
w"
>'"
::l~
II
30
~
20
/
10
°
1.0
iE
u
~
1,0
'"
"~
~-
3.0
4,0
0
I
0, B
0, 7
0, 6
/
I
~
0, 5
0. 4
5,0
Figure 17. Forward Current versus
Forward Voltage.
"
-
./"
>
'"
VF - FORWARD VOLTAGE - V
1
~w "0,9
1.5
t-2
/
2,0
1;
_0
I
.'--
2
2,0
10
20
30
40
50
60
70
80
II' - FORWARD CURRENT - mA
IpEAK - PEAK CURRENT PER LED - rnA
Figure 18. Relative Luminous Intensity
versus Forward Current.
Figure 19. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.
tp - PULSE DURATION - J-lS
Figure 20. Maximum Tolerable Peak Current versus Pulse
Duration. (IDe MAX as per MAX ratings).
Figure 21. Relative Luminous Intensity versus
Angular Displacement.
6-77
90
HIGH EFFICIENCY RED HLMP-3350 SERIES
Electrical Specifications at TA =25°C
Device
HLMP-
Min.
Typ.
Axial Luminous Intensity
3350
3351
3365
3366
2.0
5.0
7.0
12.0
3.5
7.0
10,0
18.0
281/2
Included Angle Between
Half Luminous Intensity
Points
3350
3351
3365
3366
Symbol
Description
Iv
Max.
Units Test Conditions
mcd
IF"'" 10 mA (Fig, 8)
Oeg. Note 1 (Fig.
50
50
45
45
11)
AP
Peak Wavelength
635
nm
Measurement at Peak (Fig. II
Ad
Dominant Wavelength
626
nm
Note 2
AA1/2
Spectral Line Halfwidth
40
nm
T$
Speed of Response
90
ns
C
Capacitance
16
liJC
Thermal Resistance
120
VF
Forward Voltage
1.5
VR
Reverse Breakdown
Voltage
5.0
'Iv
Luminous Efficacy
pF
VF=O; f= 1 MHz
·C/W Junction to Cathode Lead
2.2
S.O
145
V
IF = 10 mA (Fig. 7l
V
IR= 100pA
Im/W NoteS
Notes: 1. Ow, is tM off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, ~d, is derived from the CIE
chromaticity diagram and represents the single wavelength which-aefines the color of the device. 3. Radiant Intensity Ie, in watts/steradian may be found
from the equation Ie = Iv/11v. where Iv is the lUminous intensity in candelas and 11v is the luminous efficacy in lumens/watt.
4.0
90
I
>
t: '
~~
/
0
I
I
II
0
0
o
1.0
V
2.0
~~
/
~~
00
~~
::J'"
~i
H=
3.0
4.0
2. 0
1.
a:
O.
5.0
Figure 7. Forward Current versus
Forward Voltage,
V
1.5
~~
>-
"til
"
/
5
~o
VF - FORWARD VOLTAGE -V
V
3.0
2.
1.6
L
3.5
0
:v
/
*~
/
w
>
;:
1.1
a:
V
I
~
~
10
16
20
25
30
IF - FORWARD CURRENT - mA
Figure 8. Relative Luminous Intensity
versus Forward Current.
(PEAK - PEAK CURRENT PER LED - mA
Figure 9. Relative Efficiencv
. (Luminous Intensity
per Unit Currentl
versus Peak Current.
90'f--t--+--+--t:
tp - PULSE DURATION - /-IS
Figure 10. Maximum Tolerable Peal, Current versus Pulse
Duration. (lOC MAX as per MAX Ratings)
'Figure 11. Relative Luminous Intensity versus
Angular Displacement.
6-78
YELLOW HLMP- 3450 SERIES
Electrical Specifications at TA =25°C
DevIce
HLMP.
Min.
Typ.
Axial Luminous Intensity
3450
3451
3465
3466
2.5
6.0
6.0
12.0
4.0
10.0
12.0
18.0
med
IF - 10mA (Fig. 13)
20112
Included Angle Between
Half Luminous Intensity
Points
3450
3451
3465
3466
50
50
45
45
Deg.
Note 1 (Fig. 16)
AP
Ad
Pe~k~aY7Iength
583
nm
Measurement at Peak (Fig. 1l
Domlhaht Wavelength
585
nm
Note 2
~A1/2
Spectral Line Halfwidth
36
nm
1's
Speed of Response
90
ns
C
Capacitance
18
pF
IJJC
Thermal Resistance
120
Symbol
Description
Iv
VF
Forward Voltage
1.5
VR
Reverse Breakdown
Voltage
5.0
'lV
LU[11inous Efficacy
Max.
Units Test Cq,ndltlons
VF '" 0; f = 1 MHz
°C/W Junction to Cathode Lead
2.2
3.0
V
IF = 10 mA (Fig. 12)
V
IR=100 "A
ImIW Note 3
500
Notes: 1.8% is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength. Ad. is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie, in watts/steradian may be found
from the equation Ie:; IV/flv, where Iv is the luminous intensity in candelas and T1v is the luminous efficacy in lumens/watt.
0
~
40
0
0
a:
0
:>
~
~
_~
/
10
0
~~
wE
>-0
z_
;;;>-
II
0:
a:
u
o
a:
,.>-
/
I
>-
a;
2.5
1/
:>"
00
zw
-N
:>-'
,,-,"
W"
J
1.5
2.0
~ 2slc
2.0
1.5
1.0
/
>0:
-0
>-z
~-
0:
/
1.0
TA
2.5
3.0
3.5
4.0
VF - FORWARD VOLT AGE - V
Figure 12. Forward Current versus
Forward Voltage.
.5
/
V
/
V
1.6
/
1.5
)-g
1.4
§~
1. 3
H:~
1. 2
~~
1. 1
u-
wo
~~
5::
1.0
0:0
9
V
wo:
5
8
o
o
V
10
15
20
IF - FORWARD CURRENT - rnA
Figure 13. Relative Luminous Intensity
versus Forward Current:
7
I
/
v
V
. r--
J
10
20
30
40
tp - PULSE DURATION - JAS
Figure 16. Relative Luminous Intensity' versus
Angular Displacement
6-79
60
Figure 14. Relative Efficiencv
(Luminous Intensity
per Unit Current)
versus Peak Current.
1,'-:.0-'-ULlllL-L
Figure 15. Maximum Tolerable Peak Current versus Pulse
Duration. (I DC MAX as per MAX Ratingsl.
50
IpEAK - PEAK CURRENT - rnA
GREEN HLMP- 3550 SERIES
Electrical Specifications at TA =25°C
D$vlC$
Units Test Condillons
HLMP-
Min.
Typ.
AXial Luminous Intensity
3553
3554
3567
3568
1.6
6.7
4.2
10.6
3.2
10.0
7.0
15.0
mcd
IF = 10 mA (Fig. 18)
Included Angle Between
Half Luminous Intensity
Points
3553
3554
3567
3568
50
50
40
40
Deg.
Note 1 (Figure 21)
Symbol
Description
Iv
281/2
Max.
AP
Peak Wavelength
565
nm
Measurement at Peak (Fig. 1)
Ad
Dominant Wavelength
569
nm
Note 2
nm
/lA1/2
Spectral Line Hal/width
28
rs
Speed of Response
500
ns
C
Capacitance
18
pF
8JC
Thermal Resistance
120
VF
Forward Voltage
1.6
Vf\
Reverse Breakdown
Voltage
5.0
t/v
Luminous Efflcacy
VF '" 0; f - 1 MHz
"C/W Junction to Cathode Lead
2.3
3.0
V
IF'" 10 mA (Fig. 17)
V
1f\=100"A
Im/W Note 3
595
Notes: 1. By: is the off·axis angle at which the luminous intensity is half the axial luminous intensity. 2. Dominant wavelength, Ad, is derived from the CI E
chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant Intensity Ie, in wat~s/steradian may be found
from the equation Ie = Iy/fly. where Iv is the luminous intensity in candelas and flv is the luminous efficacy in lumens/watt.
0
El
I
~
a:
a:
'"ou
J
°ttt
a:
30
i2
I
0
I
0
o
1.0
z"
'"w
2.0
3~
1.5
I-
,.u
u
~w
00
-N
j
zw
,,"'~
~"
w"
>a:
_0
J
I-Z
~-
1.2
15
E
1-0
ZN
0
40
TA ~ 25"(;
,.
I
0
a:
~
1.3
I
0
>
~
1.0
a:
~
.5
~
a:
/
2.0
3.0
4.0
YF - FORWARD VOLTAGE -
5.0
v
Figure 17. Forward Current versus
Forward Voltage.
IF - FORWARD CURRENT - mA
IpEAK - PEAK CURRENT PER LED - rnA
Figure 18. Relative Luminous Intensity
versus Forward Current.
Figure 19. Relative Efficiency
(Luminous Intensity
per Unit Current)
versus Peak Current.
90'
f--+--+--+-
tp - PULSE DURATION - ~s
Figure 21. Relative Luminous Intensity versus
Angular Displacement.
Figure 20. Maximum Tolerable Peak Current. versus Pulse
Duration. (lDC MAX as per MAX ratings).
6-80
--
~-~-~~-----------
T-1 3/4 (5 mm)
lTV SOLID ST TE LAMPS
rli~ HE\lVLETT
a:e...
PACKARD
EFFICIENC;Y
I-
X SERIES
~~.
HIO~JfRIiORMAN~EYIIJ,
GRN -
Features
• HIGH INTENSITY
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
Yellow
High Performance Green
• POPULAR T-1 3/4 DIAMETER PACKAGE
• SELECTED MINIMUM INTENSITIES
• NARROW VIEWING ANGLE
• GENERAL PURPOSE LEADS
• RELIABLE AND RUGGED
• AVAILABLE ON TAPE AND REEL
J
Package Dimensions
I
Description
This family of T-1 3/4 lamps is specially designed for
applications requiring higher' on-axis intensity than is
achievable with a standard lamp. The light generated is
focused to a narrow beam to achieve this effect.
Part
Number
HLMP3315
MS{,..(18)
SQVAB\;
NQMINAl.
3316
3415
3416
3517
3519
CA'THOOe
NOTES'
1. All. DIMENSIONS ARE IN MILUMETRES (iNCHES).
,. AN £POXV MtN.tSC:US MAY 'EXtENO ABOUT lmm
1,040" DOWN THe L~S.
6-81
Description
Illuminator/Point
Source
Illuminator/High
Brightness
Illuminator/Point
Source
illuminator/High
Brightness
Illuminator/Point
Source
illuminator/High
Brightness
Minimum
Intensity
(mcd)
at 10 mA
12
20
10
Color
(Material)
High
Efficiency
Red
(GaAsP
on GaPJ
20
Yellow
(GaAsP
on GaP)
6.7
Green
(GaP)
10.6
Electrical Characteristics at TA = 25°C
Description
Symbol
Luminous Intensity
Iv
2(-)112
Including Angle
Between Half
Luminous Intensity
Points
Peak Wavelength
ApEAK
Device
HLMP-
Min.
Typ.
3315
3316
12.0
20.0
18.0 I
30.0
mcd
3415
3416
10.0
20.0
IS.0
30.0
m ; t IF'" 10 mA IFigureS'
3517
3519
6.7
10.0
25.0
mc
IF = 10 mA (Figure 31
10.6
Deg.
IF'" 10 rnA
See Nole 1 IFigure 61
Spectral Une Haifwidlh
Dominant Wavelength
Ad
rs
Speed of Response
C
Capacitance
35
35
3415
3416
35
35
Oeg.
IF'" 10mA
See Note 1 (Figure III
3517
3519
24
24
Oeg.
IF =10 rnA
See Note 1 iFigure 16)
331 X
635
5S3
nm
Measurement at Peak
(Figure 11
565
331 X
40
341X
351X
331X
341X
351X
331X
341X
351X
36
Thermal ReSistance
nm
28
626
nm
See Note 2 (Figure 1)
585
569
ns
90
90
500
11
15
331 X
341X
OJc
I
Test Condilions
IF '" 10 mA (Figure 3'
3315
3316
341X
351X
..u 1/2
Unll$
Max.
VF""O; f= 1 MHz
pF
351X
18
331 X
120
"CIW
Junction to Cathode Lead
341X
351X
VF
Forward Voltage
VR
Reverse Breakdown Voll.
'IV
Luminous Efficacy
331 X
341 X
351X
1.5
1.5
1.5
All
5.0
331 X
341 X
3.0
3.0
3.0
2.3
145
500
595
351X
NOTES:
2.2
2.2
IF = 10 rnA (Figure 2)
IF = 10 rnA (Figure 71
IF = 10 mA (Figure 12)
V
V
Ill'" l00jJ.A
lumens
Watt
See Note 3
1. (~)112 is the off-axiS angle at which the luminous intenSity is half the axis/luminous intenSity.
2. The dominant wavelength, Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color
of the device.
3. Radiant intenSity, Ie. in watts/steradian, may be found from the equation I~ = lv/l1v, where Iv is the luminous intenSity in candelas and.l1v is
the luminous efficacy in lumens/watt.
Absolute Maximum Ratings at TA = 25°C
Parameter
331X$eries
341X Series
351 X Series
Units
Peak Forward Current
90
60
90
rnA
Average Forward CurrenVl,
25
20
25
rnA
DC Currentl 21
30
20
30
mA
Power Dissipallonl31
135
85
135
mW
5
5
5
V
500
500
500
-5510+100
-20 to +100
-55 to +100
Reverse VOltage 1111 = 100 p.AI
Transient Forward Curren~41 (10
p.sec Pulse)
Operating Temperature Range
Storage Temperature Range
-55 to +100
260·C for 5 seconds
Lead SOldering Temperature
!1.6 mm (0.063 In.! from bodyl
6-82
mA,
'C
NOTES:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50° Cat 0.5 mAloC. For Yellow series derate linearly from 50° Cat 0.2 mAIo C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/' C. For Yellow series derate power linearly from 50°C at 1.6 mW/o C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
1.0
~
.~
w
HIOH
~FFICIENC""
REO
0.5
2:
~
0
500
700
650
750
WAVELENGTH· nm
Figure 1. Relative Intensity. vs. Wavelength
High Efficiency Red HLMP-331 X Series
0
,
~
80
5
70
0
60
5
aa 50.,
I
/
/
•
30
0
20
:/
10
0
'-0
'.0
/
/
30
IOC • DC CURRENT PER LED. rnA
Vf' - FORWARO VOLTAGE - V
Figure 2. Forward Current vs. Forward
Voltage Characteristics
V
.
0
Figure 3. Relative Luminous Intensity
vs. DC Forward Current
IpEAK - PEAK CURRENT PER LED - mA
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current
90'f----+--+--+-Ip - PULSE DURATION -,..5
Figure 5. Maximum Tolerable Peak
Current vs. Pulse Duration
(IDC MAX as per MAX Ratings)
Figure 6. Relative Luminous Intensity vs. Angular Displacement
6-83
Yellow HLMP-341X Series
2.5
TA
>
~
!2~
<"to
/
2.0
~~
so
/V
~~
1.5
~:J
~.
1.0
w~
L
>~
~¥
.5
0/
VF - fORWARD VOLTAGE - V
Figure 7. Forward Current vs.
Forward Voltage
Characteristics
1.31--+-+7"'!--1--I--1
1.2 t--i'--;I'1--i--t---t--j
1.1
L
~fil
"
1. 5t--i'--r-i--t-":::!-'9
1.4 t--i'--r--t-:7""I----t--j
1.0
10
15
20
IF - FORWARD CURRENT - rnA
40
50
60
IpEAK - PEAK CURRENT - mA
Figure 8. Relative Luminous Intensity
vs. Forward Current
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current
90" 1---1---!----+-tp - PULSE DURATION - /.IS
Figure 10. Maximum Tolerable Peak Current
vs. Pulse Duration (Ioc MAX
as per MAX Ratings)
Figure 11. Relative Luminous Intensity vs. Angular Displacement
Green HLMP-351 X Series
I
II
0
0
-t-
0
o
0
so
II
40
l/
.0
JO
0
10
0
5
il
.If
0
4
VI
20
30
IF-DC fORWARD CURRENT-rnA
VF - FORWARD VOLTAGE - V
Figure 12. Forward Current vs.
Forward Voltage
Characteristics
/v
/
v
Figure 13. Relative Luminous Intensity
vs. DC Forward Current
Ip~AK - PEAK CURRENT PER L.EO -
t-t-i-i-i--r-r-r-T--;.6
.4
.2
tp - PULSE DURATION - /,s
Figure 15. Maximum Tolerable Peak Current
vs. Pulse Duration (loC MAX
as per MAX Ratings)
Figure 16. Relative Luml~ous Intensity vs. Angular Displacement.
T-l 3/4 Lamp
6-84
mA
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak LED Current
T-2 (6 mm) Incandescent
Alternative LED Lamps
High Efficiency Red H~I¥1P·A200
Yellow ~ll;ivtP·A300
High ~erformance Green HLMP;ASOO
Features
• FOUR LED CHIPS PER LAMP
• WIDE RADIATION PATTERN
20,/, = 120° typo
• HIGH LIGHT OUTPUT
• NON·DIFFUSED
• 3 COLORS
• POWER SAVING DESIGN
Advantages Over
Incandescent lamps
• MTBF IN EXCESS OF 5,000,000 HOURS
Applications
• SOCKETS NOT NEEDED
• MECHANICALLY RUGGED PACKAGE
o ALTERNATIVE TO INCANDESCENT LAMPS
• LOW POWER CONSUMPTION
• LIGHTED SWITCHES
• BACKLIGHTING PANELS, LEGENDS
Description
The devices have three leads: an anode, a cathode, and a
center heat sink which allows operation at elevated temperatures. These non-diffused lamps are designed for backlighting applications where uniform illumination of a translucent surface is required. Typical applications are illuminated switch keycaps and backlighted front panel annunciator functions.
The HLMP-A200/-A300/-A500 series of solid state lamps
incorporates four LED chips in a single package to give
bright uniform backlighting illumination to larger areas
than is possible using conventional LED lamps. They
provide a low power, long-life alternative to filtered incandescent lamps of similar size.
Axial luminous IntenSity and Viewing Angle
Color
Part Number
HLMP·
Iv (mea)
v(mlm)
Min.
lYP·
lYP·[ll
20,/,
Typ.£2J
Test
Conditions
Backlighting Lamp
General Purpose
22
40
180
114°
50mA
25°C
Description
High Efficiency
Red
A200
Yellow
A300
Backlighting Lamp
General Purpose
23
40
160
114"
50mA
25°C
High Performance
Green
A500
Backlighting Lamp
General Purpose
27
40
225
1240
50mA
25°C
Notes:
1.·v is the total luminous flux produced by the device, measured in millilumens.
2. Oy, is the off·axis angle at which the luminous intensity is half the peak intensity.
6-85
Package Dimensions
I
if.8i (Q.VOj -----..
r6"0(0240~
~.35
t
(0.2SO)
filfii.i8oj
FLANGE
r=
8.64 (0.340)
9.40 iif370j
..
~~~:~~~ I'"----
!
~ANODELEAD
I'
- - - - - - f-
5.11 (0.225)
6.3& 1015O}
/
\
LAMP
eODv
+
254 (0.1001
NOMINAL
\
t:""J
I
1___
~~
~
~,-
O.S9 (0.0351
CENTER LEAD
5.72 10.225'
HEAT SINK
SN~J?N3;~~ - - -
~
#
f
' -- -- ?
-
CATHODE
LEAD
(0 0301
102(0.040\
ANODE
AND
lEADS
I
2.5410
NOMINAL
---1
a.7l
100lTl--8\ 0 - -t,
j CJ\TH~De
t-
-
/""'''~
L /b-~
\~
0.56 (a.0221
-mI0.02SI
NOTES:
,. ALL DIMENSIONS ARE IN MILLIMETRES IINCHESI.
2. AN EPOXY MENISCUS MAY EXTEND ASOUT 1 mm
10.040"1 DOWN THE lEADS.
Internal Circuit Diagram
~
....1-1--'1
.... 1-1--'
I
1
YI
YI
...... -1--'
THE CENTER HEAT SINK LEAD IS REQUIRED FOR
EFFECTIVE HEAT DISSIPATION. NO EXTERNAL
1'1
GROUND OR OTHER ELECTRICAL CONNECTION
ANODE
HEJ SINK
SHOULD BE MADE TO THE HEATSINK LEAD.
CATHODE
Electrical/Optical Characteristics
at T A = 25°C
COMMON CHARACTERISTICS
High
Symbol
Parameter
Efficiency Red
Mal(.
Min.
Typ.
Min.
Yellow
Typ.
Max.
Green
Min.
Typ.
Test
MaJ(,
Units Conditlon&
Peak Wavelength
635
583
565
Ad
Dominant Wavelength[1!
626
585
569
nm
YJv
Luminous
Efficacyf 2 J
145
500
595
lumen
VR
Reverse Breakdown
Voltage
8.0
VF
Forward Voftage(3J
3.7
rs
Speed of Response
90
90
500
ns
C
Capacitance
11
15
18
pF
ApEAK
nm
Iwatt
8.0
4,2
4.8
3.7
8.0
4.3
4.8
4.1
4.6
5.2
V
IR"'100"A
V
IF"50mA
VF=O,
f" 1 MHz
OJC
Thermal Resistance[4J
60
60
60
·C/W Junction to
Pins (Total
Package)
..
Notes:
1. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
2. Radiant intensity, Ie' in watts/steradian, may be found from the equation Ie =Iv/~v. Where Ivis the luminous intensity in candelas and
nv is the luminous efficacy in lumens/watt.
3. Designers should be aware that selection of current limiting resistors becomes critical in 5 volt applications.
4. The value ROJ-PIN =60'C/W is the combined thermal resistance, LED junction-to-pin, when both the heat sink and cathode leads are
used for heat dissipation. For effective heat dissipation, it is recommended that both the heat sink and cathode leads have equivalent
thermal resistance paths to ambient.
6-86
Absolute Maximum Ratings
atT A =25°C
HIGH EFFICIENCY RED, YELLOW AND GREEN LAMPS
">,,'
High Efficiency
Red'
Peak f;orward Current
Average Forw-
>-
HIGH £l!flC1ENCY
:'i>-
REO
u;
;:;
w
0.5
>
;::
~
'"
a
700
500
750
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength
w
a
~
'"
W
'"
~ :;j>"
>-'"
" ,,'"
x"
"0"
2
;:: "
~
a
0
>-
~2
a
OW
::>
::>3
a
~u
xC)
HEJ. G!EE~
YE~LOl "
ROJA
I
-
ffi '2a
~
\
I
a
,,;j
I
J I
,.a
"E
\
9
Jo~ ~ 25~oC/~""" V
0
'6,
::>
u
~
~
ir
-"
HIGH
0 - ~ EFFICIENCY
REO
'0
0
TA - AMBIENT TEMPERATURE _ °C
Figure 3. Maximum Allowable DC Current
per Lamp vs. Ambient Temperature.
Deratings are shown for Three Thermal
Resistance Values, LED Junction to
Ambient (ROJA)'
6-87
/
~VELLOW
1-111
a
1I1/'GREEN
a
a
10 20 30 40 50 60 70 80 90 100 110
If-.II /
.."
0 0 (( 2.0
3.0
VF
-
fr
4.0
5.0
6.0
7.0
FORWARD VOLTAGE - V
Figure 4. Typical Forward Current vs.
Forward Voltage
1. 2
V
1. 0
~
E
~
~
@ A. 6
YELLOW
I?'
YELLOW,
GREEN
/.
20
~ ~
0,8
~ ~
0,7
.-
0.6
~
l - i-
30
40
Z
~
~
I I
I I
10
0.9
,gs
l..l
0.2
1.0
~ ~
~@
Ii":
0.4
o
;0
1. 1
ffi~
- E
~g
Q
\iIj
~
o~
o
1.2
>
~/
N
~
~
O. 81- HIGH ~~6'creNCY
v.:
1/
A
1\
\I-H£R. GREEN
Y/
1
'/
I
0.5
0.4
50
60
loe - DC CURRENT - rnA
IpEAK
Figure 5. Relative Luminous Intensity vs. Forward Current
-
PEAK LED CURRENT - rnA
Figure 6. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak LED Current
Figure 7. Far-Field Relative Luminous Intensity vs. Angular Displacement.
Operational Considerations for
the HLMP-A200/-A300/-ASOO
Series of LED Lamps
ELECTRICAl:. CONSIDERATIONS
The HLMP-A200/-A300/-A500 series of LED lamps was
designed to combine the light-output of filtered incandescent
lamps with the reliability and power savings of LEOs. These
LEDs present a number of advantages over incandescent
lamps in a wide variety of backlighting applications:
Long Life - When operated within data sheet conditions,
LED lamps exhibit MTBFs over 5,000,000 hours. Miniature
incandescent lamps typically have MTBFs varying from 500
to 25,000 hours. Due to the superior reliability of LEOs,
they may be permanently mounted on circuit boards,
eliminating sockets and their associated costs.
INTERNAL CIRCUIT - The HLMP-A200. -A300. and -A500
devices contain four LED chips wired in a "series-parallel"
electrical configuration. There are two pairs of parallelwired chips, with the two pairs wired in series. See Figure 8.
This electrical arrangement provides compatibility with low
voltage systems, yet still allows operation at relatively low
currents. The outer' two leads of the lamp serve as the
anode and cathode. The cathode lead also serves as a
heat sink for two of the LED chips with the center lead
providing a heat sink for the other two LED chips.
CAUTION: DO NOT connect the heat sink lead to any
external electrical circuitry or ground. This could either
turn off the LED chips or expose them to excessive drive
current.
Rugged Package - Since all the internal components of
an LED lamp are permanently encapsulated in a plastic
package, they are extremely resistant to shock, vibration,
and breakage.
Low Power - In many applications, these LED lamps provide
the same light output as a filtered incandescent lamp, yet
consume 50% to 75% less power. They therefore generate
less heat, and require smaller power supplies.
6-88
ANODE
HEAT SINK
Figure 8. Internal Circuit Diagram
CATHODE
-
---------~--------
The typical forward voltage values, either scaled from Figure
4 or calculated from the model listed below, can be used to
calculate the current limiting resistor value and typical
power dissipation. Expected minimum and maximum forward
voltages may be calculated from the following worst case
models. These models can be used to calculate the maximum power dissipation as well as minimum and maximum
forward currents for a given electrical design.
R
6.3 Voc
ANODE
VFMIN = VoMIN + IF (RsMIN)
VFTYP = VoTYP + IF (RsTYP)
VFMAX = VoMAX + IF (RsMAX)
For: IF ~ 20 mA
Figure 10. Circuit to Operate the Lamp at 6.3 V DC
v,
Referring to Figure 3, in a typical mounting scheme with
= 163° C/W, the maximum DC current is 60 mA at 45° C.
CATHODE
8JA
Figure 9. Electrical Model
The expected values for Va and Rs are listed below in
Table 1.
EXAMPLE - What is the expected minimum and maximum forward voltage for the HLMP-A200 operated at 60
mA?
R=Vs-Vo_Rs
IF
Where Vs = power supply voltage
Va = device voltage intercept from model
IF = desired forward current
Rs = device internal resistance from model
R = (6.3)(1.05) - 3.4 _ 6
(.060)
= 48 ohms
= 51 ohms (next higher standard 5% value)
VFMIN = 3.4 + (.060)(6)
= 3.76
VFMAX = 3.8 + (.060)(20)
= 5.00
DRIVING THE LAMP - Like other LED devices, this lamp
is current driven, and drive circuits must be designed to
prevent excessive current from flowing through the device.
The lamp has been designed for DC operation. Pulsed
operation at average currents in the range of 40-60 mA is
allowable but will not increase the light output significantly
as compared to the same DC current.
CONSTANT-CURRENT DRIVERS - The use of transistors
or certain driver ICs which have constant-current outputs
to power the lamp is recommended. Drive configurations
such as these provide high immunity to power-supply
voltage variation and easy interface to logic circuits. Examples of such drive circuits can be found in HewlettPackard's Fiber Optics Applications Manual (HPBK-2000),
Section 2.4.
Resistor power dissipation:
P = 12 R
= (.060)2 (51)
= .184 Watt
= % Watt resistor (next higher standard value)
Using this 51 ± 5% ohm resistor and a 6.3 V ± 5% power
supply, what is the expected minimum, typical, and maximum forward current?
IF=(VS-VO)
(R + Rs)
Where Vs = power supply voltage
Va = device voltage intercept from model
R = external current limiting resistor
Rs = device internal resistance from model
RESISTIVE CURRENT-LIMITING - The simplest method
of driving the lamp is to operate it with a series resistor
from a fixed voltage supply. Since this drive circuit is most
susceptible to variations in both the power supply voltage
and the LED's forward voltage, a worst-case design example is shown.
EXAMPLE - What is the resistor value needed to run the
HLMP-A200 at the maximum DC current at 45° C using a
6.3 ± 5% DC supply?
I MIN = (6.3)(.95) - 3.8
F
(51)(1.05) +20
= 21 mA
I TYP = 6.3 - 3.6
F
51 + 12
= 43 mA
I MAX = (6.3)(1.05) - 3.4
F
(51 )(.95) + 6
= 59 mA
Table 1. Expected typical and worst case values of Vo and Rs
Color
PIN HLMP
VOMIN
RsMiN
VOTYP
RsTYP
VoMAX
RsMAX
HER
Yellow
Green
A200
A300
A500
3.4 V
3.4 V
3.7V
Sohms
Sohms
Bohms
3.SV
3.8V
3.8V
12 ohms
10 ohms
16 ohms
3.8V
3.9V
4.1 V
20 ohms
18 ohms
22 ohms
6-89
MECHANICAL & HANDLING CONSIDERATIONS
LEAD CONSTRUCTION - Heavy copper leads were designed into this series of LED lamps to effectively dissipate
the heat generated (by the four LED chips. Because the
leads are so rigid, care must be taken that the leads are
NOT bent in such a way that cracking of the encapsulating
epoxy occurs.
LEAD PLATING - Lamp leads in this series are silver
plated. In order to prevent lead tarnishing, finger cots should
be worn whenever handling the devices.
SOLDERING - These LED lamps can withstand wave
soldering conditions as outlined in Application Note 1027,
"Soldering LED Components." Solder temperatures of
260°C for up to 5 seconds will not damage these devices.
THERMAL
Although LED lamps are extremely reliable within the normal
operating temperature range, problems may be encountered
at very high temperatures. Specifically, catastrophic failures
can occur when the LED junction temperature exceeds
110°C. Several guidelines have been incorporated into this
data sheet to prevent such operation.
MOUNTING THE LAMP - The Cathode and Heat Sink
(center) leads provide the thermal paths for heat generated
at the LED junctions to leave the package. Approximately
'12 the total package power is dissipated by each of these
two leads. For best results, all three leads should be
soldered to a printed-circuit board. It is recommended that
both the heat sink and cathode leads be soldered to small
('Is" x '!a") metalized areas on the board in the Vicinity of the
lamp, particularly if a number of lamps are placed close
together.
In most cases, forced air circulation around the lamp is not
necessary. It is important that the natural convection of air
around the device is not obstructed. Efficient heat sinking
of this sort will allow operation of the lamp at higher
ambient temperatures without exceeding the 110° C maximum LED junction temperature.
DETERMINING THE LED JUNCTION TEMPERATURE The LED junction temperature is difficult to measure direct-
Iy, but it can be computed if the lamp's lead temperature
and its thermal resistance (junction to pin) are known.
EXAMPLE - Is it safe to operate a HLMP-A200 device at
50 mA forward current if both the cathode and heat sink
lead temperatures are 65° C?
Maximum power dissipated by the lamp:
P = (IF)(VF)
.
= (0.050 A)(4.8 V)
= 0.240 W
Temperature difference between the LED junction and the
leads:
~ T = (OJ-PIN)(P)
= (60° C/W)(0.240 W)
= 14°C
Maximum LED junction temperature:
Tg = T plN + ~T
= 65°C +14°C
= 79°C
< 110° C, therefore safe
In situations where the worst-case lead temperature is
unavailable, OJA (the thermal resistance, junction to ambient)
may be used to determine the LED junction temperature
directly from the ambient temperature. This thermal resistance will be highly dependent on the physical configuration of the equipment in which the lamp is mounted.
Figure 3 shows the maximum allowable drive current vs.
ambient temperature for several different values of 0JA. The
worst case value of 250°C/Watt roughly corresponds to
mounting the LED in a very small, enclosed housing without efficient heat sinking (such as in a pushbutton switch).
The typical value of 163° C/W might be encountered if the
LED is mounted with other components on a PC board in a
naturally-convected piece of equipment. The best-case
value of 1000 C/W may be achieved if the lamp is soldered
to a PC board with large metal "lands" connected to the
leads and moderate airflow around the device. As shown in
this figure, the full-power operating temperature range is
extended as the thermal resistance is lowered.
OPTICAL
The radiation pattern for this series of lamps (shown in
Figure 7) has been specifically tailored for even illumination of flat translucent surfaces. In order to prevent objectionable "hot-spots" on the surface to be illuminated, the
luminous intenSity is designed to be greater off-axis than
on-axis. At more than 50 0 off-axis, the light output rapidly
drops off so as to minimize light loss out the sides and
back of the lamp.
The relative positioning of the lamp and the surface to be
illuminated will need to be optimized for the designer's
particular application. Placing the lamp in close proximity
to the legend results in bright illumination of a small area;
pulling the lamp farther back illuminates larger areas with
lower brightness.
It may be desirable to mount reflective white baffles around
the lamp to redirect some of the light emerging at wide
angles onto the legend. Such baffles are also effective at
eliminating "cross-talk", a situation in which light from one
lamp partially illuminates an adjacent legend. Care should
be taken to insure that such baffles do not completely
obstruct air flow around the device.
Figure 11. Use 01 Metalized Printed Circuit Board to Heat Sink
the Lamp
6-90
------~-----------------~--
2 mm x 5 mm RECTANGULAR LAMPS
Flidl
HEWLETT
HIGH EFFICIENCY RED
YELLOW
ORANGE
HIGH PERFORMANCE GREEN
~~ PACKARD
HLMP-S200 SERIES
HLMP-S300 SERIES
HLMP-S400 SERIES
HLMp·5500 SERIES
Features
• RECTANGULAR LIGHT EMITTING SURFACE
• EXCELLENT FOR FLUSH MOUNTING ON
PANELS
• CHOICE OF 4 BRIGHT COLORS
• LONG LIFE: SOLID STATE RELIABILITY
• EXCELLENT UNIFORMITY OF LIGHT OUTPUT
Description
The HLMP-S200, -S300, -S400, -S500 are epoxy encapsulated lamps in rectangular packages which are easily
stacked in arrays or used for discreet front panel indicators.
Contrast and light uniformity are enhanced by a special
epoxy diffusion and tinting process.
In addition to the standard high efficiency red, yellow, and
high performance green colors, this product comes in
Orange for greater flexibility in human factors design.
Package Dimensions
5.46 (0.2151
-.r:-4.95~
5.1810.204)
4lljO;19.il
t
I
'
1.27 (0.0$01
NOMINA~
NOTES:
1. ALL DIMENSIONS ARE IN MtLLIMETRES l/NCHESI.
2. AN EPOXY MENISCUS MAY EXTEND ABOUT
1 mm tlM)40") DOWN THE LEADS.
3. THERE is A MAXiMUM I" TAI'ER fROM
BASE TO THE TQl> OF LJ\M~.
6-91
-----
----
-----
Electrical/optical Characteristics at TA = 25°C
Symbol
Description
Device
HLMP·
Iv
Luminous Intensity
High Efficiency Red
Min.
Typ.
8201
2,1
3.4
3,5
4.8
Orange
8400
8401
2,1
3.4
3,5
4.8
Yellow
S300
8301
1.4
2.2
2.1
3,5
Green
8500
S501
2.6
4,'
4.0
5,8
S200
201/2
APEAK
Ad
TS
C
Included Angle
Between Hall
Luminous Intensity
Points
Peak Wavelength
Dominant Wavelength
Speed of Response
Capacitance
Max.
Units
Test Conditions
mcd
IF= 20 mA
All
110
Oeg,
IF~ 20 mA
See Note 1
High Efficiency Red
Orange
Yellow
Green
635
612
583
565
nm
Measurement at Peak
High Efficiency Red
Orange
Yellow
Green
626
603
585
569
nm
See Note 2
High Efficiency Red
Orange
Yellow
Green
350
350
390
870
ns
High Efficiency Red
Orange
Yellow
Green
11
4
15
18
pF
120
°CIW
OJC
Thermal Resistance
All
VF
Forward Voltage
HER/Orange
Yellow
Green
1.5
1.5
5.0
VR
Reverse Breakdown Volt.
All
'Iv
Luminous Efficacy
High Efficiency Red
Orange
Yellow
Green
1.5
2,2
2.2
2.3
145
262
500
VF"O;f=lMHz
Junction to Cathode
Lead at Seating Plane
3,0
3.0
V
Ip=20mA
V
IF!" 1ooJi.A
lumens
Watt
See Note 3
3,0
595
NOTES:
1, 0112 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2, The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the Single wavelength which defines the color
of the device.
3. Radiant intensity, Ie. in watts/steradian, may be found from the equation Ie = 'v/ryv. where Iv is the luminous intensity in candelas and ryv is
the luminous efficacy in lumens/watt.
6-92
Absolute Maximum Ratings at TA = 25°C
HlghEf~£iency Red!
Orange
Yellow
Green
Peak Forward Current
90
60
90
mA
Aver~ge
25
20
25
mA
DCGU rrent{21
30
20
30
Power DlsSlpl!lion[3]
135
85
135
Parameter
Forward Current!1l,
Transient F~rWard Currentl 4 ]
(19!,sec Pulse)
Units
/' mA
"
mW
mA
500
Operating Temperature Range
-55 to +100
Storage Temperature Range
-20 to +85
-55 to +100
Lead Soldering Temperature
[1.6 mm (0.063 in.) below
seating plane1
°C
';55 to +100
260· C for 5 seconds
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. For Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/oC. For Yellow series derate linearly from 50°C at 0.34 mA/oC.
3. For Red, Orange, and Green series derate power linearly from 25°C at 1.6 mW/oC. For Yellow series derate power linearly from 50°C at
1.6mW/oC.
'
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wire bond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
10
~
HIGH EFFICIENCV
~
RED
0.5
w
2
g
GREEN
0
500
700
750
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength.
High Efficiency Red, Orange, Yellow, and Green
Rectangular Lamps
90
70
;
1
iila:
60
/
a
50
a:
40
~
30
80
~
...~
a:
0
~
~
".
2.0
EMERAL.O GREEN
YELLOW
10
1.0
E
~
N
::;
""c:
0
~
IA.
3.0
1.5
"@
'II:
.~
2.0
~
~
t-
'1
Iii
20
,1 EO,ORANGE
YELLOW
1.2
OREEN.
It y
RED, ORANGE
o
1.3
4.0
5.0
1.0
//
.5
~
V
v'"
/
15
20
25
Figure 3. Relative Luminous Intensity
vs. DC Forward Current.
/
~
>
~
.
~
Icc - DC CURRENT PER LED - rnA
6-93
1,0
•
VF - FORWARD VOLTAGE - V
Figure 2. Forward Current vs. Forward
Voltage Characteristics.
1. 1
~
w
V
10
~
0.9
08
O. 7
0.6
.. \GREEJ.
,\ .'
~
~
!
-
j-
EMSRAI.D GAEEN
/1
I
O.5
30
IpEAK
-
PEAK CURRENT PER LED - rnA
Figure 4. Relative Efficiency (Luminous
Intensity per Unit Current) vs.
LED Peak Curren!.
Ip - PULSE DURATION - I'S
Figure 5. Maximum Tolerable Peak Current vs. Pulse
Duration. (I DC MAX as per MAX Ratings).
Figure 6. Relative Luminous Intensity vs.
Angular Displacemeni.
6-94
RECTANGULAR SOLID STATE LAMPS
r/i~ HEWLETT
~~ PACKARD
HIGH EFFICIENCY RED HLMP-030010301
YELLOW HLMP-0400 10401
HIGH PERFORMANCE GREEN HLMP-OS03/0S04
"
Features
• RECTANGULAR LIGHT EMITTING SURFACE
• FLAT HIGH STERANCE EMITTING SURFACE
• STACKABLE ON 2.54 MM (0.100 INCH)
CENTERS
• IDEAL AS FLUSH MOUNTED PANEL
INDICATORS
• IDEAL FOR BACKLIGHTING LEGENDS
• LONG LIFE: SOLID STATE,RELIABILITY
o CHOICE OF 3 BRIGHT COLORS
HIGH EFFICIENCY RED
YELLOW
HIGH PERFORMANCE GREEN
• IC COMPATIBLE/LOW CURRENT
REQUIREMENTS
Description
The HLMP-030X, -040X, -050X are solid state lamps
encapsulated in a radial lead rectangular epoxy package.
They utilize a tinted, diffused epoxy to provide high on-off
contrast and a flat high intensity emitting surface. Borderless package design allows creation of uninterrupted light
emitting areas.
The HLMP-0300 and -0301 have a high efficiency red
GaAsP on GaP LED chip in a light red epoxy package. This
lamp's efficiency is comparable to that of the GaP red, but
extends to higher current levels.
The HLMP-0400 and -0401 provide a yellow GaAsP on GaP
LED chip in a yellow epoxy package.
The HLMP-0503 and -0504 provide a green GaP LED chip in
a green epoxy package.
package Dimensions
Axial Luminous Intensity
~
2'~b"r;,:OO)
fO:ijjjf'c=L
7.62 (O.300)
ill
0.46 (O.OIB)
SQUARE NOM
7.62 (O.300J
6.9910.276)
ParI
\3
r
B.OO@lli
7.31 (0.200)
29.21
2.5410.100)
2.1lil1i:Dm
(1.1~)
Color
Number
High
Efficiency
Red
HLMp·0300
1.0
2.5
HLMP..Q301
2.5
5.0
HLMp·0400
1.5
2.5
HLMP..Q401
3.0
5.0
HLMP-0503
1.5
2.5
HLMP·0504
3.0
5.0
BOTTOM VIEW
\..... CATHODE
Yellow
LEAD
MIN.
--L
t*
\
Iv (mcd) @
20 mA DC
Min.
Typ.
1.27 (O.OOO)
NOM.
High
Performance
Green
NarES:
1. ALL DIME!,SIONS ARE IN MllUMETAES (INCHES).
2. ~~wr::~~~ r~~g~;us MAY EXTEND ABOUT lmm (O.040")
3. THEA!> IS A MAXIMUM l' TAPEA FROM
BASE TO TOP OF lAMP.
6-95
Absolute Maximum Ratings at TA
HLMP'()~O/'()301
HLMP.()400/0401
HLMP'()503/'()504
Units
Peak Forward Current
90
60
90
rnA
Average Forward Currentl 11
25
20
25
rnA
DC Currentt2J
30
20
30
mA
Power Dlssipation[3j
135
85
135
mW
5
5
5
V
500
500
500
rnA
-55 to +100
-55 to +100
-20 to +100
-55 to +100
°C
Parameter
Reverse Voltage (lR '" 100 p.Al
Transient Forward CUfrentl 41 (10 I's Pulsel
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
I
I
260 0 C for 5 seconds
NOTE~.
.
. .
1. See Figure 5 to establish pulsed operating conditions.
2: For Red and Green Series derate linearly from 50° C at
0.5 mA/oC. For Yellow Series derate linearly from 50·C
at 0.2 mAIO C.
3. For Red and Green series derate power linearly from 25° Cat
1.8 mWlo C: For Yellow series derate power linearly from
50° C at 1.6 mW/o C.
4. The transient peak current is the maximum non-recurring
peak current that can be applied to the device without
damaging the LED die and wirebond. It is not recommedned
that the device be operated at peak current beyond the peak
forward current listed in the Absolute Maximum Ratings.
Electrical/Optical Characteristics at TA = 25°C
HLMP-G300/-G301
Typ.
HLMP-0400/.(l401
Typ.
Description
2e1/2
Jneluded Angle
Between Half
Luminous intensity
Palms
100
100
.\p
Peak Wavelength
635
583
~
Spectral Line Hallwidth
1"$
Speed of Response
C
Capacitance
HLMP.(lS03/.(l504
Max.
Min.
Thermal Resistance
Forward Voltage
1.6
VA
Reverse Breakdown
Voltage
5.0
'Iv
Luminous EffiCscy
Typ.
Max.
100
-
m.
Dominant Wavelength
Al..l/2
;
Min.
Max.
Min.
Symbol
Units Test Conditions
Deg. Note 1. Figure 6.
565
nm
Measurement at
Peak
569
nm
Note 2
28
nm
:
90
500
ns
1
16
18
pF
120
120
120
2.2
3.0
1.6
2.2
5.0
145
Cathode Lead
3.0
1.6
2.3
5.0
. 500
VF""0;f=1 MHz:
'C/W Juncllon to
595
3.0
V
Ip=20mA
Figure 2.
V
IA= 100 pA
ImIW Note 3
NOTES:
1. 61/2 is the off-axis angle atwhich the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
a. Radiant intensity, I,. in watts/steradian, may be found from the equation 1,=ly/'lY, where Iv is the luminous intensity in candelas and
'1V is the. luminous efficacy in lumens/watt.
.
6-96
1.0
GREEN
...in>-
HIGH EfFICIENCY
RED
iii...
~
w
0.5
>
i=
~
a:
0
500
750
650
WAVELENGTH - nm
Figure 1. Relative Intemity .... Wavelength.
High Efficiency Red, Yellow and Green Rectangular Lamps
a
1.3
iI
a
il GRE~N±- r--
a
/
a
Ii V
a
a
a
1.0
~
:0
~IJ'
~
~
0
;;
J}
a
"~
~
VI.:
RED
a
a
yEL.lOW
2.0
.~
15
1.0
.5
I
f--o.
1-- --.,
V
'j,;.
/-
3.0
4.0
/
*
1. 1
u
w
1.0
0,9
~
o.
~
o. 6
>
,
. ,III
I
o.
-
\~R~E~_
#' F"'"
,
~
1S
20
25
30
5.0
loe - DC CURRENT PER LEO - rnA
VF - FORWARD VOLTAGE - V
IpEAK - PEAK CURRENT PER LED - rnA
Figure 2. Forward Current vs. Forward
Voltage.
Ip - PULSE DURATION -
V
/
.\ "
o.5
10
2.0
~+I
I
RW
YELLOW
1.2
~
~
Figure 3. Relative Luminous Intensity vs.
Forward Current.
Figure 4. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak Current.
~s
Figure 5. Maximum Tolerable Peak Current v50
Pulse Duration. (lDC MAX as per MAX Ratings.J
Figure 6. Relative Luminous Intensity vs. Angular Displacement.
6-97
rli~ HEWLETT
.:a PACKARD
ULTRA-BRIGHT LED LAMP SERIES
T~1 3/4 HlMp·3750,-3850,·3950
T-1 3/4 lOW PROFILE HlMP-3390,·3490,·3590
T-1 HLMP-1340,-1440, -1540
Features
• IMPROVED BRIGHTNESS
• IMPROVED COLOR PERFORMANCE
• AVAILABLE IN POPULAR T-1 and T-1 3/4
PACKAGES
• NEW STURDY LEADS
• IC COMPATIBLE/LOW CURRENT CAPABILITY
• RELIABLE AND RUGGED
• CHOICE OF 3 BRIGHT COLORS
High Efficiency Red
High Brightness Yellow
High Performance Green
Description
Applications
These clear, non-diffused lamps out perform conventional
LED lamps. By utilizing new higher intensity material, we
achieve superior product performance.
o LIGHTED SWITCHES
o BACKLIGHTING FRONT PANELS
The HLMP-3750/-3390/-1340 Series Lamps are Ga'lIium
Arsenide Phosphide on Gallium Phosphide red light
emitting diodes. The HLMP-3850/-3490/-1440 Series are
Gallium Arsenide Phosphide on Gallium Phosphide yellow
light emitting diodes. The HLMP-3950/-3590/-1540 Series
lamps are Gallium Phosphide green light emitting diodes.
o LIGHT PIPE SOURCES
o KEYBOARD INDICATORS
Axial Luminous Intensity and viewing Angle @ 25°C·
Part Number
Iv (mcd)
@20mADC
Typ.
Min.
Package
Description
Color
HER
80
T-1 3/4
Yellow
80
3950
Green
SO
3390
HER
HLMP3750
3850
3490
3590
1340
1440
1540
T-1 3/4 Low Profile
T-1
2ft 1/2
Note 1.
Package
Outline
125
24·
A
140
24·
A
120
24"
A
35
55
32·
Yellow
35
55
32°
Green
35
55
32"
HER
24
35
45"
Yellow
24
45°
Green
24
35
35
8
8
8
C
C
C
45·
NOTE:
1. 01/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.
6-98
package Dimensions
1-;:~~WoWI
10.J.4291
10.131.3991
I(
\ ~:;~!);~~:
r--
J T~
23 0 I 901
~
~
r
6.351t2501
56a l 220)
HtJL
1.321.0521
.
(.0401
_
.
1.02
....... 0.54 1.0251
"~il~ ~ :~~:,
--- ~::; :::~~:
4.7b 1.185)
~~'~-_-l....=!-~---1.0-2.Lt:~)t G66)
NOM.
0-4$ !.o1el
~SQUARE
24.13 (.95)
NOMINAL
MIN.
CATHODE- .........
1.271.0501
NOM •
.~
f
_..---_1_
1
j
-j
iI'""""
2.54 {.100l
NOM.
---~
pjD cIri) :~ ::;::
,!.-~
CATHODE
_
_
2.54 (.100) NOM.
PACKAGE OUTLINE "C"
HLMP-1340, 1440,1540
PACKAGE OUTLINE "8"
HLMP-3390, 3490, 3590
PACKAGE OUTLINE "A"
HLMP-3750, 3650, 3950
NOTES:
1, All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 1 mm lOAD") down the leads.
Absolute Maximum Ratings at TA = 25°C
Parameter
Red
Yellow
Green
Units
Peak Forward Current
90
60
90
mA
Average Forward Currentl 1 ]
25
20
25
mA
DC Currentl 2 1
30
20
30
mA
Power Dissipationl 3J
135
85
135
mW
Transient Forward Currentl 4 j
(10 Ilsec pulse)
500
500
500
mA
5
5
5
V
Reverse Voltage
(lR
= 100 p.AI
Operating Temperature Range
Storage Temperature Range
-55 to+100
-55 to +100
Lead Soldering Temperature
11,6 mm (0.063 in.) from bodyl
-20 to +100
-55 to +100
"C
260 0 C for 5 seconds
NOTES:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50° Cat 0.5 mAIo C. For Yellow series derate linearly from 50° C at 0.2 mAIO C.
3. For Red and Green series derate power linearly from 25° C at 1.8 mW;o C. For Yellow series derate power linearly from 50° Cat
1.6 mW/oC.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
6-99
Electrical/optical Characteristics at TA
Description
ApEAK Peak Wavelength
Symbol
Ad
Dominant Wavelength
..It..112
Spectral Line Halfwidth
rs
Speed of Response
0
Capacitance
6JC
Thermal Resistance
VF
Forward Voltage
VR
Reverse Breakdown
Voltage
'rfv
Luminous Efficacy
T-13/4
3750
3850
3950
3750
3850
3950
3750
3850
3950
3750
3850
3950
3750
3850
3950
3750
3850
3950
3750
3850
3950
3750
3850
3950
3750
3850
3950
Lo
T-1::
Dom
3390
3490
3590
3390
3490
3690
3390
3490
3590
3390
3490
3590
3390
3490
3590
3390
3490
3590
3390
3490
3590
3390
3490
3690
3390
3490
3590
I
T·1
1340
1440
1540
1340
1440
1540
1340
1440
1540
1340
1440
1540
1340
1440
1540
1340
1440
1540
1340
1440
1540
1340
1440
1540
1340
0
Min.
1.5
1.5
1.5
5.0
T~~
635
583
565
626
585
569
40
36
28
90
90
500
11
15
18
95
95
95
120
120
120
2.2
2.2
2.3
Units
nm
nm
I
T.8t Conditions
Measurement at
peak
Note 1
nm
ns
pF
·CIW
3.0
3.0
3.0
145
500
595
VF=O; f= 1 MHz
Junction to
Cathode Lead
V
IF=20 mA
(Figure 3)
V
IF= 100p.A
~
NoteZ
watt
NOTES:
1. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which
defines the color of the device.
2. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/~v, where Iv is the luminous intensity in
candelas and ~v is the luminous efficacy in lumens/watt.
Red, Yellow and Green
,.or-------r--.,..__-..,.....--..,----~...____r------_,_-----__,
HIGH EFfICIENCY
RED
O.5f-------++--/\-----I-\c-+----t-\-----+--------j
~O~O~---~--~~----~--=~----~--6~5~O-----~~------~700
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength.
6-100
90
111111111 !111m II
.J .J.I.\~I~Hi [I)!!I) 3601~!1
I-
30 KHz
V
100 KHz
~
3 KHz
80
"~E
1.J:rtj
1 KHz
/
100 Hz
1\
1\
60
"u
"
50
0:
30
0:
"
\ , 1\
70
150:
0:
1\
I
-'=
~
Ii ;V
40
.'1!
IN
20
I
.'1
lJ.
o
2.0
1.0
tp - PULSE DURATION -IJ.S
3.0
4.0
1.3
YELLOW
"' ...
""
"W
0"
:EN
1. 1
1.0
2.0
-'"
"'z
~0:
I
0.9
1.5
,,:::;
w:E
>0:
-0
.'!.•...-'
1.2
2.5
z"
~ E
~~
/'
1.0
o
o
y'
0.8
V
/'
.5
---
v
Figure 3. Forward Current vs. Forward Voltage.
3.0
...
in_
5.0
VF - FORWARD VOLTAGE -
Figure 2. Maximum Tolerable Peak Current vs, Pulse Duration.
(IDC MAX as per MAX Ratings,)
>-
-
YELLOW
It:
RED
10
11'::.0....LJ..LWU1'::0,.-L.J..LlJ-':1.,00:-'-...ll..u:'10~0c:O.L.lLU1UJO~,000
GRE1EN±-
/
;:
5:
/J
,
0.7
"~
0.6
~
V
.
~ ~-
RED
- ....
\lREEN_
rt
/1
I
0.5
10
15
20
25
10
30
20
30
40
50
60
70
80
90
IpEAK - PEAK CURRENT PER LED - rnA
IDe - DC CURRENT PER LED - rnA
Figure 4. Relative Luminous Intensity vs. Forward Current.
Figure 5. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak Current.
Figure 6. Relative Luminous Intensity vs. Angular Displacement.
T -1 3/4 Lamp.
Figure 7. Relative Luminous Intensity vs. Angular Displacement.
T -1 3/4 Low Profile Lamp.
Figure S. Relative Luminous Intensity vs. Angular Displacement.
T-1 Lamp.
6-101
FliUW
LOW CURRENT LED LAMP SERIES
HEWLETT
~e. PACKARD
T-1 3/4 (Smm) HLMP-4700, -4719, -4740
T-1 (3mm) HLMP-1700, -1719, -1790
SUBMINIATURE HLMP-7000, -7019, -7040
Features
• LOWPOWER
• HIGH EFFICIENCY
D
CMOS/MOS COMPATIBLE
• TTL COMPATIBLE
• WIDE VIEWING ANGLE
• CHOICE OF PACKAGE STYLES
• CHOICE OF COLORS
Applications
• LOW POWER DC CIRCUITS
• TELECOMMUNICATIONS INDICATORS
• PORTABLE EQUIPMENT
LOW CURRENT LAMP SELECTION GUIDE
• KEYBOARD INDICATORS
Color
Description
Size
These tinted diffused LED lamps were designed and optimized specifically for low DC current operation. Luminous
intensity and forward voltage are tested at 2 mA to assure
consistent brightness at TTL output current levels.
Red
HLMP'
Yellow
HLMP-
Green
HLMp·
T·1 3/4
4700
4719
4740
T·j
1700
1719
1790
SUbmln lature
7000
7019
7040
package Dimensions
0.45 LOUI)
SQUARE
NOflHNAt.
1,i7(,05Oo) ,
NOM.
HLMP-7000, ·7019, -7040
HLMP-4700, -4719,-4740
HLMP·1700, -1719, -1790
6-102
NOTES:
L ALL DIMENSIONS ARE 11'1 MILLIMETRES !INCHES).
2. AN EPOXY MINISCUS MAY EXTEND ABOUT
1 rom (0.040") DOWN THE lEADS.
AXIAL LUMINOUS INTENSITY AND VIEWING ANGLE @ 25°C
Part
Number
Package
Description ",m
HlMP~
T-13/4
-4700
-4719
-4740
-1700
-1719
-1790
-7000
-7019
-7040
Red
Yellow
Green
\2
1':2
1.2
T-l
Tinted
Diffused
Red""!)
Yellow
Green
JJ~.O l\
'1.0
1.0
Subminiature
Red
Yellow
Green
0.4
0.4
0.4
Tinted Diffused
%
'"
<#RJor
Iv (mcd)
@2mADC
Min.
Typ.
.r
mTinted Diffused
2(-) 1/2[1]
Package
Outline
50Q
A
50·
B
90·
C
2.0
1.8
1.8
1.e''''10:j
1.6
1.6
;;
0.8
0.6
0.6
Notes:
1. H1/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.
Electrical/Optical Characteristics at TA = 25°C
Symbol
Description
T-1 3/4
T-1
SUbminiature
Min.
Max.
Units
1.8
1.9
1.8
2.2
2.7
2.2
V
2mA
V
IR=50,..A
VF
Forward Voltage
4700
4719
4740
1700
1719
1790
7000
7019
7040
VR
Reverse Breakdown
Voltage
4700
4719
4740
1700
1719
1790
7000
7019
7040
!l.o
Dominant Wavelength
4700
4719
4740
1700
1719
1790
7000
7019
7040
626
585
569
nm
Spectral Line Halfwidth
4700
4719
4740
1700
1719
1790
7000
7019
7040
40
nm
36
.1;'.1/2
Test
Condition
Typ.
5.0
5.0
5.0
Note 1
28
1'8
Speed of Response
4700
4719
4740
1700
1719
1790
7000
7019
7040
90
90
500
ns
C
Capacitance
4700
4719
4740
1700
1719
1790
7000
7019
7040
11
15
18
pF
Thermal Resistance
4700
4719
4740
1700
1719
1790
7000
7019
7040
120
120
120
·OIW
Junction to
Cathode lead
Peak Wavelength
4700
4719
4740
1700
1719
1790
7000
7019
7040
635
583
nm
Measurement
at peak
Luminous Efficacy
4700
1700
1719
1790
7000
7019
7040
145
500
595
(-)JC
APEAK
ljv
4719
4740
VF=O
f=l MHz
565
Lumens
Note 2
V1iitt
Notes:
1.. The dominant wavelength, hD, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
2. Radiant intensity, Ie. in watts/steradian, may be found from the equation Ie = Iv/~v, where Iv is the luminous intenSity in candelas and ~v
is the luminous efficacy in lumens/watt.
'
6-103.
Absolute Maximum Ratings
Parameter
Maximum Rating
Red
Yellow
Green
Power Dissipation
(Derate linearly from 92° 0 at 1.0 mAIo 0)
Units
24
36
24
mW
7
DC and Peak Forward Current
Transient Forward Ourrent (10 I'sec pulse)111
rnA
rnA
V
500
Reverse Vof1age (fR'" 50 pAl
5.0
Red/Yellow
Green
Operating Temperature Range
-55·0 to 100·0
-20'0 to 100·0
-55·0 to 100·0
Storage Temperature Range
260· 0 for 5 Seconds IT-1, T-1 S/4J
260·0 for 3 Seconds (Subminiature)
Lead Soldering Temperature fl.6 mm 10.063 inl from body>
Notes:
1. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die
and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the
Absolute Maximum Ratings.
1.0.----------.---...----"....----,.----"'7"...---.-------...,--------,
0.5f-------++--j'\----t\---.f-------1--l...------+-------i
WAVELENGTH -
Figure 1. Relative Intensity
10
nm
VS.
Wavelength
10.0 r - - , - - - r - - , - - - r - - - ,
I
~ 8.0 I---I---I---I-......,'--H~-.I
~~
2 N.
TA • 25"C
RED_
!0 <
6.01---1---1--+-7'--7'1'---;
0
~~
--......
!i~
... '" 4.0f---+--H~~--+---1
Wa:
I
)
.5
1.0
1.5
2:~
~-
r
W
YELLOW!
a:
2.01---I--"j~t---I---t---;
eeror
2.0
2.5
loC - DC CURRENT
VF - FORWARD VOLTAGE - V
Figure 2. Forward Current vs. Forward Voltage
PER LED -
Figure 3. Relative Luminous Intensity
6-104
VS.
rnA
Forward Current
80'
90'/---+--+--+--+''3
Figure 4. Relallve Luminous Intensity vs. Angular Displacement
for T-1 3/4 Lamp
Figure 5. Relallve Luminous Intensity vs. Angular Displacement
for T-1 Lamp
90' f - - + - 4 - - j - - t
Figure 6. Relative Luminous Intensity vs. Angular Displacement for Subminiature Lamp
6-105
---------~
---~--~-.-.-
Fli;-
INTEGRATED RESISTOR LAMPS
HEWLETT
5 volt and 12 Volt Series
in T-1 and T-1 3/4 packages
~~ PACKARD
Features
, ..
r:-
• INTEGRAL CURRENT LIMITING RESISTOR
• TTL COMPATIBLE
Requires no External Current limiter with
5 VoIV12 Volt Supply
· • COST EFFECTIVE
Saves Space and Resistor Cost
• WIDE VIEWING ANGLE
o AVAILABLE IN ALL COLOR$
Red, High Efficiency Red, YellOW and
High Performance Green in T-1 and
T-1 3/4 Packages
l"
n
!~)~l'
1I I1h-!r~ _-.Ji~111
....
I .
I
Description
The 5 volt and 12 volt series lamps contain an integral cur· rent limiting resistor in' series with the LED. This allows ihe
· lamp to be driven from a 5 volt.i12 voli source without an
external current limiter. The red LEOs are made from
GaAsP on a GaAs substrate,. The High EfficiE1ncy Red .and
Yellow devices use GaAsP on a GaP substrate.
PIN
HLMP-
Color
Red
Red
Package
Outline
T-1 Tinted Diffused
5
0.8
60·
A
5
0.8
1.5
60·
A
5
1.0
2.0
60·
12
1.0
2.0
60·
B
B
60a
A
1.5
4.0
50"
S
60·
A
60"
S
50"
A
60"
S
1601
3600
3601
1621
3650
3651
1540
High
Performance
Green
2e 1f2£1)
T-1 Untinted Diffused
1620
Yellow
Iv mcd
1120
1600
I
Operating
Voltage
1100
3112
Efficiency
The T-1 3/4 lamps are provided with sturdy leads suitable
for wire wrap applications. The T-1 3/4 !limps may be front
panel mounted by using the HLMP-0103 clip and ring.
Typ.
1.5
3105
High
. The green .devices use GaP on a GaP substrate. The dif··fused lamps provide a wide off-axis viewing angle.
1641
3680
3681
Package
T-1 3/4 Tinted Diffused
Min.
5
T-1 Tinted Diffused
12
5
T-1 3/4 Tinted Diffused
12
5
T-1 Tinted Diffused
12
5
T-1 3/4 Tinted Diffused
1.5
4.0
12
5
T·1 TInted Diffused
12
5
T-1 3/4 Tinted Diffused
1.5
12
Notes:
1. 01/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
6-106
4.0
Absolute Maximum Ratings at TA = 25° C
~~------r---------~r---~r---~
Notes:
2. Derate from TA = 50· Cat 0.071 V/· C, see Figure 3.
3. Derate from TA = 50· Cat 0.086V!" C, see Figure 4.
Electrical/Optical Characteristics at TA = 25° C
Symbol
APEAK
Ad
.lA1I2
High
Green
Elflclenc Red
Yellow
Max. Min.
MIn" J'yp. Max. Min.
Max. Min. Typ. Max.
583
565
655
569
gth
6
585
648
40
28
24
36
Red
-
Spectral Line
Halfwidlh
ra.
Units Test Gqnllitions
nm
nm Illbte 4
nm
Thermal Resistance
120
120
120
120
°c!W Junction to Cathode
eJC
Thermal Resistance
95
95
95
95
IF
Forward Current 12 V
Devices
Forward Current 5 V
Devices
Luminous Efficacy
13
·C/W Junction to CathOde
Lead (Note 7)
mA VI'=12V
HJC
IF
"IV
VR
Lead (Note 6)
Reverse Breakdown
Voltage
20
13
20
13
20
13
20
10
15
12
15
It
13
10
20
65
5.0
15
145
500
5.0
5.0
Notes:
4. The dominant wavelength, Ad, ·is. derived from the CIE
chromaticity diagram and represents the single wavelength
which defines the Color of the device.
5. Radiant intensity, .Ie, in watts/steradian, may be found from the
S95
5.0
mA
VF=5V
lumen NoteS
/watt
V
IR=100 .. A
equation Ie = Iv/"IV. Where Iv is the luminous intensity in
candelas and "IV is the luminous efficacy in lumens/watt.
6. For Figure A package type.
7. For Figure B package type.
Package Dimensions
.-
-~~
-l
r-~~
U5!~11
·>ittm, 'i~
~~
--j. t·""
.OM
44,U(09S}
T
1- I-
CAT"OO"T
~~':;~'~QM'"''
l~ri:.",rrL
--f
Lb4fQ.1QOJNOM.ll\1AI.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETRES IINCHEs).
2. AN EPOXY MENISCUSMAV EXTENDABDUT lmm
1.040") DOWN THE LEADS;
Figure B. T·1 3/4 Package
Figure A. T·1 Package
6-107
24
"
E
I
I-
::;
a:
a:
::>
u
0
20
"E
II
,.
I
12
/
"
;0
a:
/
o
o
II
/
~
V
I
.!:
18
10
12
14
7.5
o
I ,.
15
v
>
I
"
I-
<5
>
""!:;'"
~
0
>
"
0
a:
"
;0
a:
~
/
V
/
V
18
10
12
14
7.5
I
1.
15
Figure 2. Forward Current vs. Applied Forward Voltage. 12 Volt
Devices
I
7.5
o
V
Vee - APPLIED FORWARD VOLTAGE - V
>
16
15
.......
.............
12
0
a:
"a:
;0
~
5l
5l
~
:::i
~
I
u
u
-!t
-!t
o
o
20
40
60
20
8085
TA - AMBIENT TErY'PERATURE - QC
Figure 3. Maximum Allowed Applied Forward Voltage vs.
Ambient Temperature ROJA = 175' C/W. 5 Volt
Devices
90'
12
"a:
Figure 1. Forward Current vs. Applied Forward Voltage. 5 Volt
Devices
""
0
a:
;0
Vee - APPLIED FORWARD VOL rAGE -
'"
,.
a:
a:
::>
u
/
.!:
20
::;
I-
a:
~
24
/
40
60
TA - AMBIENT TEMPERATURE _
8085
°c
Figure 4. Maximum Allowed Applied Forward Voltage vs.
Ambient Temperature ROJA = 175'C/W.12 Volt
Devices
r-+--+--t--\-:
Figure 5. Relative Luminous Intensity vs. Angular Displacement
for T·1 Package
Figure 6. Relative Luminous Intensity vs. Angular Displacement
for T·1 3/4 Package
6-108
2,5
1,5
2,0
:::
w
'/
1,5
>
~
w
0:
:::
V
G~A$P
A
0,5
\'/L
a
0
~
2
>
~
0:
j
0,5
~}
HIGH EfFICIENCYRED, YELLOW,
GRr EN
4
1,0
w
I
1,0
V
j
6
I
8
a
10
5 VOLT DEVICE
Figure 7, Relative Luminous Intensity vs, Applied Forward
Voltage. 5 Volt Devices
a
2
[
4
V
HIGH EFFICIENCY
~REQ,
YELLOW,
GRE,EN
6
8
10
12
J
14
16
18 20
12 VOLT DEVICES
Figure 8. Relative Luminous Intensity vs. Applied Forward
Voltage. 12 Volt Devices
6-109
FliiiW
SUBMINIATURE RESISTOR LAMPS
5 VOLT 4 rnA AND 5 VOLT
10 rnA SERIES
HEWLETT
~r.. PACKARD
Features
D
INTEGRAL CURRENT LIMITING RESISTOR
D
TTL AND LSTTL COMPATIBLE
o REQUIRES NO EXTERNAL RESISTOR WITH
5 VOLT SUPPLY
D
SPACE SAVING SUBMINIATURE PACKAGE
o WIDE VIEWING ANGLE
o
CHOICE OF CURRENT LEVEL, 4 rnA or 10 rnA
.. AVAILABLE IN HIGH EFFICIENCY RED,
YELLOW, AND GREEN
• IDEALLY SUITED FOR PORTABLE OR SPACE
CONSTRAINED APPLICATIONS
Description
The subminiature resistor lamps contain an integral current
limiting resistor in series with the LED. This allows the lamp
to be driven from a 5 volt source without an external current
limiter. The high efficiency red and yellow devices use
GaAsP on a GaP substrate. The green devices use GaP on
a GaP substrate. The tinted, diffused epoxy lens provides
high on-off contrast and a wide viewing angle. The follow-
ing special configurations are available on request:
1. Surface Mount Gull Wing Bend Mount Gull Wing Data Sheet.
Refer to the Surface
2. Tape and Reel Packaging
3. Special Lead Bending on 2.54 mm (0.100 in,) and 5.08
mm (0.200) in Centers
Device Selection Guide
High Efficiency Red
Yellow
Green
5 Volt. 10 mA
HLMP-6600
HLMP-6700
HLMP-B800
5 Volt, 4 mA
HLMP-B620
HLMP-6720
HLMP-6820
6-110
Package Dimensions
TOP VIEW
NOTES
1, ALL DIMENSIONS ARE IN MILLlMETRES (INCHES)
2, OPTIONAL LEAD FORM AVAILABLE,
SIDE VIEW
END VIEW
Absolute Maximum Ratings at TA = 25°C
HLMP-6600/6620
6700/6720
HLMP·6BOOJ6B20
High Efficiency Red/Yellow
Green
6 vons
6 Volts
5 Volts
5 Volts
DC Forward Voltage
Reverse Voltage OR = 1OOIlA)
Operating Temperature Range
-40'Ct085°C
-55' C to 100° C
Storage Temperature Range
Lead Soldering Temperature
1,6 mm (0.063 in.) From Body
260 0 C for 3 Seconds
Electrical/optical Characteristics at TA = 25° C
High J:Hiclency Red
HLMp·6600
HLMp·6620
Symbol Parameter
Yellow
HLMp·6700
Gr.en
HlMp·61Z0
HLMp·6S00
HLMp·6620
Min. Typ. Max, Min. Typ. Max, Min, Typ. Max, Min, Typ. Max. Min. Typ. Max. Min, Typ, Max.
08 2.0
1.4 5.0
1.6 5,0
1.3 5.0
0.9 2.0
08 2,0
Units
Test Conditions
mcd
'(it.ee~ Figure
5 Volts
2)
90
Oeg
Note 1
(See Figure 3
585
nm
28
569
26
nm
120
120
IV
Axiat Luminous
Intensity
2"'112
Included Angle Between
Half luminous
IntenSity Pomls
90
90
90
90
90
ApEAK
Peak Wavelength
Dominant Wavelength
583
585
36
565
569
Spectral line
Halfwidlh
635
626
40
585
..11.1/2
635
626
40
583
AD
36
r"JC
Thermal Resistance
120
120
120
120
'F
Forward Current
9.6
VR
Reverse Breakdown
lIoll3ge
W
Luminous Efficacy
nm
Note 2
'C/W Junction (0
Cathode Lead
35
13
5.0
50
145
9.6
5
13
5.0
145
3,5
50
5.0
500
9,6
5
500
35
13
mA
II
5.0
595
5
595
ifF ~5 Volts
ISee Figure 1)
IR ~
100~A
Imlw Note 3
Notes:
1. 2(-)1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color
of the device,
3. Radiant intenSity in watts/sterad ion, may be found from the equation Ie = 'v/ryv, where Iv is the luminous intensity in candelas and ryv is
the luminous efficacy in lumens/watt.
6-111
- - - _ . -_... _ . _ - - _.. _ - - - _....
1.6
>
..:
~~
2""
E
I
...
~g
2
w
-'"
"'"'..:...
0:
0:
'"
~fa
:!iN
u
0
0:
"'~~
0!!-
0:
0:
..:
;=
~o:
... 0
...0I
S~
w
1.4
I
1.2
I
1.0
I
0.8
0.2
=
/
0.6
0.4
I
/
/1/
VF - FORWARD VOLTAGE - VOLTS
VF - FORWARD VOLTAGE - VOLTS
Figure 1. Forward Current vs. Forward
Voltage.
Figure 2. Relative Luminous Intensity vs.
Forward Voltage.
Figure 3. Relative Luminous Intensity vs.
Angular Displacement.
6-112
------- - - - - - - - - - -
rl;;'
-----
---.
------
HIGH EFFICIENCY RED/T-1 3/4 (5 mm)
HIGH PERFORMANCE GREEN
SleOlOR SOLID STATE LAMP
HEWLETT
~~ PACKARD
HLMP-4000
Features:
• TWO COLOR (RED, GREEN) OPERATION
• POPULAR T-1 3/4 PACKAGE
• 3 LEADS WITH ONE COMMON CATHODE
• DIFFUSED, WIDE VISIBILITY LENS
• TTL COMPATIBLE
Description
The T-1 3/4 HLMP-4000 lamp is a three leaded bicolor light
source designed for a variety of applications where dual
state illumination is required in the same package. There
are two LED chips, high efficiency red (HER) and high
performance green (Green). mounted on a central common
cathode lead for maximum on-axis viewability. Colors between HER and Green can be generated by independently
pulse width modulating the LED chips.
package Dimensions
Absolute Maximum Ratings
at TA =25°C
HIgh Efficiency
Parameter
Peak Forward Current
Red/Green
Units
90
mA
mA
II:;;;:;:;::;:;:~-U~
Average Forward Current! l i(Total)
25
DC Current[4] (Total)
30
mA
Power Dissipation[3,51(Total)
135
mW
Operating Temperature Range
-20 to +85
-55 to +100
Reverse Voltage (lR '" 100 p.A)
5
V
Transient Forward Current[6]
(10 p'sec Pulse)
500
mA
25.40 11.00)
MIN.
I
NLL
QC
Storage Temperature Range
9.19 10.362)
M3 (O]32j
, .27
~~.50}
Lead Soldering Temperature
[1.6 mm (0.063 in.) below
seatl n9 plane1
COMMON
CATHOO.
0,508 10.0201
SQ, TYP,
2.64 (0.10CI NOM.
260" C for 5 seconds
GREEN
ANODE
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. The combined simultaneous current must not exceed the
maximum.
3. The combined simultaneous power must not exceed the
maximum.
4. For HER and Green derate linearly from 50' Cat 0.5 mAl' C.
5. For HER and Green derate linearly from 25'C at 1.B mW/'C.
6. The transient peak current Is the maximum non-recurring
current that can be applied to the device without damaging the
LED die and wlrebond. It Is not recommended that the device
be operated at peak currents beyond the peak forward current
listed In the Absolute Maximum Ratings.
6-113
flAT INDICATES
REO ANODE
R"D
ANOQE
COMMON
CATHOP"
NOTES:
" All OIMENSIONS ARE IN Mll~IMETRES (INCHES),
2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm
lo.Q4a"1
DOWN THE LEADS.
Electrical Characteristics at TA = 25°C
Red
Symbol
Parameters
Iv
Luminous Intensity
APEAK
Peak Wavelength
Ad
Dominant Wavelength
TS
Speed of Response
Typ.
Units
Test Conditions
4.2
8
mcd
IF" 1DrnA
635
565
nm
626
569
90
500
Typ.
2.1
5
C
Capacitance
11
VF
Forward Voltage
2.1
VB
Reverse Breakdown Voltage
°JC
Thermal Resistance
20112
'l/V
Green
Min.
Min.
Max.
Max.
See Note 1
ns
18
2.5
2.3
2.7
pF
VF"D, f= 1 MHz
V
IF=10mA
5
V
120
120
°CIW
Included Angle Between
Half Luminous Intensity
Points, Both Axes
65
65
Deg.
Luminous Efficacy
145
5
595
IA = 100 j1A
JUnction to
Cathode Lead
IF= 10 rnA
See Note 2
Lumen! See Note 3
Watt
Notes:
1. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the
color of the device.
2. 01/2 is the off-axis angle at which the luminous intenSity is half the axial luminous intensity.
3. Radiant intensity, Ie' in watts steradian, may be found from the equation Ie = 1./1)., where I. is the luminous intenSity in candelas and
1). is the luminous efficacy in lumens/watt.
1.0
HIGH
PERFORMANCE GREEN
0.5
0
500
/
J
V
\
/
~
TA <25"C
\;~IGH
EFFiCiENCY
I-...
550
600
650
~
Figure 1. Relative Intensity vs. Wavelength
6-114
AEO
700
750
0
«
E
....
:i
''""
"'o"
Yl
VI
0
40
'~"
30
I
0
o
1,0
~~~~ERFORMANCE _
~
Ii /
1,0
HIGH,PEA,fORMANCE
OREEN
',\,i'
/
0,5
./
4,0
00
5.0
10
15
20
25
30
35
40
IpEAK - PEAK CURRENT PER LED - rnA
Figure 3. Relative Luminous Intensity
vs. DC Forward Current.
I
/
//
1/1
1,3
1,2
1,1
i"'""
HIGH PERFORMANCE
GREEN
V
1,0
0.7 0
1,5
'"
>--
1,4
a,B
W
EffICIENCY REO
1,5
O,g
2,0
~-
3,0
I
:E~
w"
.... Z
2,0
V
j
>'"
0
rl
HI~H I
2.5
"'.... «....
Figure 2. Forward Current vs. Forward
Voltage Characteristics.
1,6
;;; ....
",«
Zw
VF - FORWARD VOLTAGE - V
1,7
3.0
00
II
lj
~~
.... E
HIGH
EFFICIENCY RED
z;2
,rj::'
0
/,
3.5
>
....
: HIO!
EFFICIENCY RED
0
'"
«
;:
4.0
i
I I II
J
I
I
10
20
30
40
50
60
70
80
90 tOO
IpEAK - PEAK CURRENT PER LED - rnA
tp -
Figure 4. Relative Efficiency (Luminous
tntensity per Unit Current) vs.
LED Peak Current.
PULSE DURATION - P'
Figure 5. Maximum Tolerable Peak Current
vs. Pulse Duration. (toe MAX as
per MAX Ratings)
goo r---j---t---j---r.;~"-7.'0::-·-:c2::::a,..,-::3a~'-:C4:7;a';-;:5~a'-:6~a""-::7a~'-:CB::::a""-::'ga::-'-::!,oo'
Figure 6. Relative Luminous Intensity vs. Angular
Displacement.
6-115
rh~
~~
940 nm HIGH RADIANT EMITTERS
HEWLETT
T-H-1t (5 mm Diameter) HEMT-3301
T-1 (3 mm Diameter> HEMT-1001
PACKARO
Features
• NONSATURATING, HIGH RADIANT FLUX
OUTPUT
• EFFICIENT AT LOW CURRENTS, COMBINED
WITH HIGH CURRENT CAPABI!.ITY
• THREE PACKAGE STYLES
• OPERATING TEMPERATURE RANGE
-55°C TO +100°C
• MEDIUM-WIDE RADIATION PATTERNS
• RADIATED SPECTRUM MATCHES RESPONSE
OF SILICON PHOTODETECTORS
Description
The HEMT-3301 and HEMT-l00l are infrared emitters, using
a mesa structure GaAs on GaAs infrared diode, IRED,
optimized for maximum quantum efficiency at a peak
wavelength of 940 nm. The HEMT-3301 and HEMT-l00l
emitters are untinted, undiffused plastic packages with
medium-wide radiation patterns. These medium-wide and
wide radiation patterns eliminate the beam focusing problems
that are encountered with emitters that have narrow
radiation patterns. Applications include optical transducers,
optical part counters, smoke detectors, covert identification,
paper tape and card readers and optical encoders.
Absolute Maximum Ratings
at TA =25°C
Power Dissipation ............................ 150 mW
DC Forward Current .......................... 100 mA
(Derate as specified in Figure 6)
Peak Forward Current ....................... 1000 mA
(Time average current as determined from Figure 7)
IRED Junction Temperature ..................... 110°C
Operating and Storage Temperature .... -55°C to +100°C
Lead Soldering Temperature ........ 260°C for 5 seconds
(1.6 mm (0.063 in.) from emitter body)
package Dimensions
~~
4.57
~~\'.~~\
to.tao)
r- ~::~~~~
t
6.35
Lso-)
ili
j
LlBS)
g,5Ili ..t2~} P-~....;:; ~ otti16S;
T
2$:,4011.001
Mlti,
""\0401
II
NOM,
;!4,13 {Q.'95J
0,4$ (G.o-UI)
SQUARE NOMINAL
M'["
CATHOO'T
I
li
1.21 1G.ll5Q}
NOMINAL
~ ~ :6~~~;'~O'''''AL
'lJ.i~50>rl- !
~ ~
~,54
{O.l001
NOMINAl.
CA1'1iOOE
HEMT-3301
NOTES<
1. Al~ DIMENSIONS ARE IN MllllMETRES (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND ASOUT
1 ",In {O.04D") DOWN THE LEADS.
6-116
2.54l(UQOll'l.OMINAl
HEMT-1001
Electrical/Optical Characteristics at TA = 25°C
Symbol
Description
Ie
Radiant Intensity
HEM
1
HE
1
Min.
Typ.
2.5
1.0
4.0
2.0
Max.
Units
Test Conditions
Fig.
mW/sr
IF= 20 mA
4.5
Measured at
ApEAK
1
Temperature Coeffieient for Radiant
Intensity[lj
-0.58
Temperature Coelfieien! for Peak
Wavelength [21
0.3
nm/oC
Measured at
ApEAK
1
APEAK
Peak Wavelength
940
nm
Measured at
il.PEAK
1
20'h
Half Intenslty[3]
Total Angle
HEMT-3301
HEMT-1001
60
deg.
IF = 20 mA
9
AlelAT
"A/"T
%/oC:
50
8
tr
Output Rise Time
(10% to 90%)
1700
ns
IpEAK =20 mA
tf
Output Fall Time
(90% to 10%)
700
ns
IpEAK :20 mA
C
Capacitance
30
pI
VF"0;f=1 MHz
VR
Reverse Breakdown
Voltage
V
[R = 10 p.A
VF
Forward Voltage
1.30
1.15
V
IF= 100 mA
IF =20 mA
OJC
Thermal Resistance
120
5.0
1.50
IRED Junction
to Cathode Lead
°C/W
Notes:
1. Radiant intensity at ambient temperature: le(TA) = le(25"C) + (.llel.H) (TA - 25"C)/100.
2. Peak wavelength at ambient temperature: I-PEAK(TA) = I-PEAK(25"C) + (.lI-I.lT) (TA - 25"C).
3. 0'12 is the off-axis angle from emitter centerline where the radiant intensity is half the on-axis value.
4. Approximate radiant flux output within a cone angle of 20: e(20) = [e(O)/le(O)] Ie (TA); e(O)/le(O) obtained from figure 8 or 9.
I.'
~
~
1.2
1. 1
faN
1.0
«
0.9
:::;
'a:"
"zu
'r !-I-i'Jo'cI
l'
1.3
m-26'~
0.8
0.7
~
0.6
II
0.5
1-'"
0.4
!;:(
0.3
~
0.2
~
O. 1
o
.,
I
I
II
I
E
.
V\TA - 8&
I
~
a:
a:
:::>
u
"a:~
c
a:
~
1\
1
1'\\
"
~~
860
880 900
;>" -
920
940
960 980 1000 1020
WAVELENGTH - nm
VF
Figure 1. Radiated Spectrum
-
FORWARD VOLTAGE - V
Figure 2. Forward Current VS. Forward Voltage
6-117
2
IF - FORWARD CURRENT - mA
IF - DC FORWARD CURRENT - mA
Figure 3. Forward Voltage Temperature Coefficient
va. Forward Current
Figure 4. Relative Radiant Intensity
vs. DC Forward Current
1I
...
iiiII:
II:
""
C
II:
i12
g
I
IPEAK -
PEAK FORWA~D CURRENT.-:-: mA,
TA - AMBIENT TEMPERATURE -'C
Figure 5. Relative Efficiency vs. Peak Forward Current
Figure 6. Maximum DC Forward Current
vs. Ambient Temperature
Derating Based on TJ MAX = 110·C
tp - PULSE DURATION - p.s
Figure 7. Maximum Tolerable Peak Current va. Peak Duration
(I PEAK MAX Determined from Temperature
Derated IDe MAX)
6-118
90'1-t--t--t--t--I-I-I-I-1-=13
9 - OFF AXIS ANGLE - OEGREES
(CONE HALF ANGLES)
NORMALIZEO INTENSITY
Figure 8. Far Field Radiation Pattern, HEMT-3301
1.4
0
;::
1.2
1.0
"w
...,.'""
-"
~~
0:'"
... 0
"U.
O.S
...0"~
0.6
"'''
u."
~c:;
... ,,:c
,,!:
53
"
0:
I
;;;~
l~
oNORMALIZED INTENSITY
OFF·AXIS ANGLE - DEGREES
(CONE HALF ANGLES)
Figure 9. Far Field Radiation Pattern, HEMT-1001
6-119
Fli;-
700nm
HIGH INTENSITY
SUBMINIATURE
EMITTER
HEWLETT
~1!.tI PACKARD
HEMT -6000
Features
• HIGH RADIANT INTENSITY
• NARROW BEAM ANGLE
• NONSATURATING OUTPUT
• BANDWIDTH: DC TO 5 MHz
~~OIA,
• IC COMPATIBLE/LOW CURRENT
REQUIREMENT
• VISIBLE FLUX AIDS ALIGNMENT
Description
The HEMT-6000 uses a GaAsP chip designed for optimum
tradeoff between speed and quantum efficiency. This
optimization allows aflat modulation bandwidth of 5 MHz
without peaking, yet provides a radiant flux level
comparable to that of 900nm IREDs. The subminiature
package allows operation of multiple closely-spaced
channels, while the narrow beam angle minimizes
crosstalk. The nominal 700nm wavelength can offer
spectral performance advantages over 900nm IREDs, and
is sufficiently visible to aid optical alignment. Applications
include paper-tape readers, punch-card readers, bar code
scanners, optical encoders or transducers, interrupt
modules, safety interlocks, tape loop stabilizers and fiber
optic drivers.
NOTEs,
.
1, Ai.LO:tMEN'Sl¢NSAAE IN MI1.L.1MUfU!8 (lNeH~$I.
1, SIL,Vrtl't,PL.ATiiO LEAPS, seE AT>IiLICATION (lUU.ErIN 3.
3. epoxy tiNOAI'SULANr HASA ~EfRAellva: tNOltx OF 1,53,
4. ¢H!P Cl!ir,Jr~RJNa WITHIN 'tliE MCKASE IS CONSiS1'SNl
WITH FOOtNOTe 3,
.
.
Maximum Ratings at TA = 25°C
Power Dissipation ............. . . . . . . . . . . . . .. 50 mW
(derate'linearly from 70°C @ 1.0mW/°C)
Average Forward Current ..................... 20 mA
(derate linearly from 70°C @ O.4mA/oC)
Peak Forward Current ................... See Figure 5
Operating and Storage
TemperatureRange ................. -55° to+100°C
Lead Solderi ng
Temperature ...................... 260° C for 3 sec.
[1.6 mm (0.063 in.) from body]
~
- WAVELENGTH - nm
Figure 1. Relative Intensltv versus Wavelength.
6-120
Electrical/optical Characteristics at TA=25°C
Symbol
Ie
Ke
Max.
Descripilon
Min.
TyPo
Radiant Intensity along Mechanical
Axis
Temperature Coefficient of Intensity
100
250
/J.W/sr
Units
IF
-0.005
°C·1
Note 1
fNote 2
lly
Luminous Efficacy
2.5
Im/W
20%
Optical Axis Half Intensity Totel Angle
Peak Wavelength (Range)
16
a9Q.715
deg.
tr
Spectral Shift Temperature Coefficient
Output Rise Time (10%-90%)
.193
70
nmfC
ns
tf
Output Fall Time
40
Co
BVR
capacitance
ns
pF
APEAK
IlAp'iI
(9O%~10%)
I
5
66
Forward Voltage
VF
I:l.VF/I:l.T Temperature Coefficient of VF
12
1.5
-2.1
Thermal Resistance
140
SJC
Reverse Breakdown Voltage
nm
V
V
1.B
mV/"C
°C/W
Test Conditions
Fig.
=10mA
3,4
Note 3, IF 0= 10 rnA
Measured @ Peak
6
1
Measured @ Peak, Note 4
IpEAK =lOrnA
IpEAK =10mA
Vp = O;f'" 1 MHz
IR =100J.I.A
,IF =lOrnA
2
IF =100 JI.A
Junction to cathode lead
NOTES: 1. le(T) = Ie (25°C) exp IKe (T - 25°C)].
2. Iv = 'lyle where Iv is in candela. Ie in watts/steradian. and 'ly In lumen/watt.
3. 9% is the off-axis angle at which the radiant intensity is half the intensity along the optical axis. The deviation batwlien the
mechanical and the optical axis Is typically within a conical half-angle of three degrees.
4. ~ (T) = ~ (26"C) + (A~ /AT) (T - 25°C)
PEAK
PEAK
PEAK
VF - FORWARD VOLTAGE-V
Figure 2. Forward Currant versus
Forward Volt....
IF - FORWARD CURRENT - mA
Figure 3. Relative Radiant Intensity
_ ... Forward' Current.
IpEAK - PEAK CURRENT - mA ,
Figure 4. Relative Efficiency (Radiant Intensity
per Unit Current) yarsus Peak Currant.
° 10 20 30 40 60 60 70 60 90°,00
tp - PULSE DURATION -1'1
NORMALIZED INTENSITY
Figura 6. Maximum Tolarable Peak Current versus Pulse
Duration. (lDC MAX as par MAX Ratings)
9-0FF·AXISANGLE - DEGREES
ICONE HALF·ANGLE)
Figura 6. Far-Field Radiation Pattarn.
6-121
I·
sl~
;J_
Flidl
HEWLETT
a:e.. PACKARD
SURFACE MOUNT OPTION FOR
SUBMINIATURE LAMPS
GULL WING LEAD CONFIGURATION
INDIVIDUAL SUBMINIATURE LAMP SUPPLIED IN 12mm TAPE - OPTION 011
SUBMINIATURE ARRAY SUPPLIED IN A SHIPPING TUBE - OPTION 013
Features
• GULL WING.LEAD CONFIGURATION,
INDIVIDUAL SUBMINIATURE LAMPS AND
ARRAYS
• COMPATIBLE WITH AUTOMATIC PLACEMENT
EQUIPMENT
• COMPATIBLE WITH VAPOR PHASE REFLOW
SOLDER PROCESSES
• LOW PACKAGE PROFILE
• WIDE VIEWING ANGLE
• LONG LIFE - SOLID STATE RELIABILITY
• INDIVIDUAL SUBMINIATURE LAMPS ARE
SUPPLIED IN 12mm TAPE
• SUBMINIATURE ARRAYS ARE SUPPLIED IN
TUBES
Description
Device selection Guide
These subminiature solid state lamps are encapsulated in an
axial lead package of molded epoxy. They utilize a tinted,
diffused lens providing high on-off contrast and wide angle
viewing.
Option
Description
Option 011
Individual subminiature lamps in gull
wing configuration. Supplied in 12mm
tape on seven inch reels; 1500 pieces per
reel. Minimum order quantity and order
increment are 1500 pieces.
Optlon 012
Bulk
Option 013
(Arrays only)
Subminiature array in gull wing
configuration. Supplied in shipping tubes.
The leads·of this device are bent in a gull wing configuration
for surface mounting. The device can be mounted using
automatic placement equipment.
The indiVidual gull wing subminiature lamp is supplied in
12mm tape on seven inch reels per ANSI/EIA standard RS481 specifications. Gull wing subminiature arrays are
supplied in shipping tubes. The lamp can be mounted with
either batch or in line vapor phase reflow solder processes.
Subminiature lamps for surface mount applications are
available in standard red, high efficiency red, yellow, green,
integrated resistor, and low current versions.
Examples:
HLMP-6300
Option 011
High Efficiency Red
Supplied on Tape
Ordering Information
To obtain gull wing surface mount subminiature lamps,
order the basic catalog device with the appropriate option
code. Note: Option 011 is available for individual subminiature lamps only. Option 013 is available for subminiature
arrays only.
6-122
HLMP-6658
Option 013
High Efficiency Red, 8 Element Array
Supplied in Tubes
--_.--- _._-----
vapor Phase Reflow Solder Rating
Absolute Maximum Rating
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
215°C fdr-S minute~
Material FC-5311
Vapor Phase Soldering
Temperature
Note: Lead soldering maximum rating is 260'C for 3 seconds.
The absolute maximum ratings and electrical/optical
specifications are identical to the basic catalog device.
except forthe vapor phase soldering rating as specified at
left.
Package Dimensions
INDIVIDUAL SUBMINIATURE
H& 10.0651
om 'Om"
ANODEo~'~J
J
3_8110_1501 MAX_
~""."
NOMINAl
NOTES,
1. ALL DIMENSIONS AliE IN MILLIMETRES
IINCHES).
CAT\19DE LEAD IS IDENTIFIED BV A
COLOR STRIPE.
121
L
SUBMINIATURE ARRAY
--j
r--- 0.51 ~ 0.020)
!I
NOTES,
1, All DJMENSIONS ARE IN MILLIMETRES
NOMINAL
ilNCHESI.
. Q=CATHOOE STRIPE
I-.Tfi;.-......;;:n.-J.
G~
1.6510.0651
m iG.075l DIA.
~@
I~
-
N [2_54 (Q.l00H MAX.
NOTE 2
j
6-123
2. OVERALL LENGTH .S THE NUMBER OF
ELEMENTS TIMES 2.54mrn iO.10O- io.L
3. CATHODE LEAD IS IDENTIFIED BY A
COLOR STRIPE.
12 mm TAPE AND REEL
t1,
TOP TAPE
' -_ _ _ _ FEED DIRECTION _ _ _ _ >
TOLERANCES (UNLESS OTHERWISE SPECIFIED):
.X' .1,.XX' .051.XXX '.0041
uv~
I
NOTES:
1.
EMPTY COMPONENT POCKETS SEALED WITH TOP
2.
COVER TAPE.
7 INCH REEL - 1,500 PIECES PER REEL.
3.
MINIMUM LEADER LENGTH AT EITHER END OF
THE TAPE IS500mm.
4.
THE MAXIMUM NUMBER OF CONSECUTIVE MISSING
LAMPS IS TWO.
5,
IN ACCORDANCE WITH ANSI/EtA RS-4Bl
SPECIFICATIONS, THE CATHODE IS ORIENTED
TOWARDS THE TAPE SPROCKET HOLE.
DIMENSIONS PER
ANSI/EtA STANDARD RS-4Bl*
ALL DIMENSIONS ARE IN
MILLIMETRES (INCHES).
c:==U::'S:=E=:R:::D:::IR:::E::C::T:'O::N::O::,F:::F:::E:=E:=D=>
A
178.012.0(7.010.08) OIA.
o
15 +0"(0059+0 .004) DIA
. -0.0 .
-0.000
.
13.010.512) DIA. TYP.
0,
1.010.039) DIA. MIN.
0,
20.2 (0.795) CIA. MIN.
E
F
Ko
N
1.75 ± 0.1 (0.069)
5.50 (0.127 ! 0.002)
3.05 (0.120) TVP.
Po
P,
~
50.011.970) MIN.
4.010.157) TYP.
4.010.157) TYP.
2.0 (0.079! 0.002) TVP.
T
0.310.012) TYP.
18.410.72) MAX.
w
12.0:!: 0.3 (0.472:!: 0.012)
THICKNESS OF TOP COVER TAPE
0.10 (0.004) MAX.
500 mm (19.7 in.) MIN.
BOTH ENDS
LEADER LENGTH
500119.7) MIN.
"'EXCEPTION: THE EJECTOR-PIN HOLE (0,) IS 1.0 (0.039) DIA. MIN.
6-124
REEL
REEL
!
I
-
-
- r--
C
N
FliiJI
HEWLETT
.:~ PACKARD
llT
OPERATOR _ _ _ _ __
HP PART NUMBER _ _ __
OATECODE _ _ _ _ __
TAPING DATE _ _ _ _ __
ELEC. VALUE _ _ _ _ __
TOLERANCE _ _ _ _ __
QUANTITy _ _ _ _ _ __
A
CUSTOMER PART NUMBER _ _
ARRAY SHIPPING TUBE
:1.:1\:=:= : : =43; ; ; ;:'I'=7'0): : f=J -:;.:;(:-\=(~\~1:.1--·
<________
SUGGESTED TUBE FEED _ _ _ _ _---'
(~\ ,---\ (~, ,--0,\ ,~, ,~\
(1)
,L_ll-.l.L_.l.L _1l._.l.L _ l l _
Ul Jl
~
~:_'--L+'
H.-,g"
TUBE LABEL IDENTIFIES
CATHODE SIDE OF ARRAYS.
(hi.] ~!~K~J6
/
NO. OF LAMP
~ ~..ru
HLMP-
6XX3
6XX4
6XX5
6XX6
6XXB
6-125
ELEMENTS
PER ARRAY
34
65
8
QUANTITY
OF ARRAYS
PER TUBE
403253
2620
SURFACE MOUNT OPTION
FOR SUBMINIATURE LAMPS "YOKE" LEAD CONFIGURATION
Flipta HEWLETT
a!r..tI PACKARD
INDIVIDUAL SUBMINIATURE LAMP SUPPUED IN 12mm TAPE -OPTION 021
INDIVIDUAL SUBMINIATURE LAMP SUPPLIED IN BULK -OPTION 022
Features
• "YOKE" LEAD CONFIGURATION FOR
THROUGH HOLE MO.UNTING ON PC BOARD
• COMPATIBLE WITH AUTOMATIC PLACEMENT
EQUIPMENT
. • COMPATIBLE WITH VAPOR PHASE REFLOW
SOLDER PROCESSES
• LOW PACKAGE PROFILE
• WIDE VIEWING ANGLE
• LONG LIFE-SOLID STATE RELIABILITY
• SUPPLIED IN 12 mm TAPE OR BULK
Description
Ordering Information
These subminiature solid state lamps are encapsulated in
an axial lead package of molded epoxy. The lens is diffused
for even light dispersion.
To obtain surface mount subminiature lamps with the
"yoke" lead configuration, order the basic catalog device
with the appropriate option code.
The lamps are designed to be inserted through holes in the
PC board to backlight switches, membrane panels, or
appliques. Other backlighting applications are equally
suitable. As shown in Figure 1, the leads are specially
formed to give two features: mechanical strain relief and
adequate solder pads.
Device Selection Guide
Option
Automatic placement equipment may be used to mount
the LEDs on the PC board if the designer selects the 021
option. These lamps are supplied in 12mm tape on seven
inch reels per ANSI/EIA standard RS-481 specifications.
Bulk lamps are available under the 022 option code. The
lamps can be mounted using either batch or in line vapor
phase reflow solder processes.
Subminiature lamps for surface mount· applications are
available in standard red, high efficiency red, yellow, green,
.
integrated resistor, and low current versions.
DesCription
Option 021
Individual subminiature lamps in "yoke"
lead configuration. Supplied In 12 mm
tape on seven InCh reels; 1500 pieces per
reel. Minimum order quantity and order
increment is 1500 pieces.
Option 022
Individual subminiature lamps in ''yoke''
lead configuration. Supplied in bulk.
Examples:
HLMP-6300
Option 021
High Efficiency Red
Supplied on Tape
Figure 1.
6c126
HLMP-6400
Option 022
Yellow
Supplied in Bulk
vapor Phase Reflow Solder Rating
Absolute Maximum Rating
Vapor Phase
SOld~ri~g Te!'lle,erature
NOTE: Lead soldering maximum rating is 260'C for 3 seconds.
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings and electrical/optical specifications are identical to the basic catalog device, except for
the vapor phase soldering rating as specified at left.
package Dimensions
INDIVIDUAL SUBMINIATURE LAMP
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETRES
(INCHES!.
2, CI\'jfItlDE LEAD IS IDENTIFIED BY A
COLOR STRIPE.
t
MG (D.0301 MAX.
9,94 !J!.!m!
1.24 (0,049)
6-127
12mm TAPE AND REEL
nil
IIII
IIII
rJJL L,
r
1 I
I I
I L
I I
I I
I
L.""j
TOP TAPE
F~.J
IIII
IIII
L!JJ
TOLERANCES IUNLESSOTHERWISE SPECIFIEDI:
:>
.X ± 0.1: .XX ± 0.05 (.XXX ± 0.004)
~______~F~E~ED~D~IR~E~C~T~IO~N~_______
NOTES:
1. EMPTY COMPONENT POCKETS SEALED WITH TOP
COVER TAPE.
2. 7 INCH REEL -1,500 PIECES PER REEL.
3. MINIMUM LEADER LENGTH AT EITHER END OF
THE TAPE IS50Dmm.
4. THE MAXIMUM NUMBER OF CONSECUTIVE MISSING
LAMPS IS TWO.
5. IN ACCORDANCE WITH ANSIIEIA RS-481
SPECIFICATIONS, THE CATHODE IS ORIENTED
TOWARDS THE TAPE SPROCKET HOLE.
~__~U~S~E~R~D~IR~E~C~TI~O~N~O~F~F~E~ED~--,:>
DIMENSIONS PER
ANSliEIA STANDARD RS-4Bl
ALL DIMENSIONS ARE IN
MILLIMETRES (lNCHESI.
TAPE
A
178.0± 2.0 (7.D! 0.08) CIA.
C
13.010.5121 DIA. TYP.
o
1.55IO.o61±0.0D2IDIA.
0, 20.210.7951 DIA. MIN.
1.75± 0.110.0691
5.5010.127 ± 0.0D21
NO
COMPONENTS
KO
N
P
NO
COMPONENTS
Po
P,
---------------
t
T
500 mm 119.710.1 MIN.
BOTH ENDS
3.05 ± 0.110.1201 TYP.
50.011.9701 MIN.
4.010.1571 TYP.
4.010.1571 TYP.
2.010.079 ± 0.0021 TYP.
0.310.0121 TYP.
18.410.721 MAX.
12.o± 0.3IO.472± 0.0121
THICKNESS OF TOP COVER TAPE
0.1010.0041 MAX.
LEADER LENGTH
500119.71 MIN.
6-128
C
N
(h~
HEWLETT
PACKARD
OPERATOR BER
HPPARTNUM
... __________
OATECODE
TAPING DATE
________
ELEC. VALUE
________
TOLERANCE
QUANTITY
RT NUMBER ___
CUSTOMER.P
.A______
6-129
F/iOW
TAPE AND REEL
SUBMINIATURE LAMPS
HEWLETT
~~ PACKARD
Tape and Reel Spacing:
2.S4mm (0.100 Inch) - OPTION P01
S.OOmm (0.200 Inch) - OPTION P02
Features
• COMPATIBLE WITH AXIAL LEAD AUTOMATIC
INSERTION EQUIPMENT
• REEL PACKAGING SIMPLIFIES HANDLING AND
TESTING
Description
Subminiature lamps are available on tape and reel. The
Option lamp devices have axial leads with 2.54 mm (0.100
inch) spacing for automatic insertion into PC Boards by
radial lead insertion equipment. The Option P02 lamp
devices have axial leads with 5.00 mm (0.200 inch) spacing
packaged on tape and reel for ease of handling.
Ordering Information
To order Subminiature lamps packaged on tape and reel,
include the appropriate option code along with the device
catalog part number. Example; to order the HLMP-6300 on
tape and reel, order as follows: HLMP-6300 - P01.
Minimum order quantities vary by part number. Orders
must be placed in reel increments. Please contact your
local Hewlett-Packard sales office or franchised HewlettPackard distributor for a complete list of lamps available
on tape and reel.
Device Selection Guide
Option
pal
paz
The absolute maximum ratings, mechanical dimension
tolerances and electrical optical characteristics for lamps
packaged on tape and reel are identical to the basic
catalog device. Refer to the basic data sheet for the
specified values.
Notes:
Description
Tape and reel, 2.54 mm (0.100 inch) spaced
axial leads.
Tape and reel. 5.00 mm (0.200 inch) spaced
axial leads.
I Option
I P01
Quantity/Reel
Order Increments
5,000 or 1,000
1,000
I
Z,500 or 1,000
1,000
Paz
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
1. Minimum leader length at either end of tape is 2 blank part
spaces.
2. Silver saver paper is used as the interlayer for silver plated lead
devices.
3. The maximum number of consecutive missing lamps is 2.
Drawings and option codes apply to devices with cathode tab
intact only.
6-130
------------ - - - - - - - -
OUTLINE A (TAPE AND REEL) - OPTION P01
2.54
mm
(0.100 inch) spacing
CATHOOE
I
t
14.61 (0.575)
12.07(0.475)
NOTE 1.
...... '0 MAX.
\=
0
-
I
~
6.35 (O.250)
TYP.
~.~"
1\
.750)
MAX.
L_ - -
-------
25.40 (1.000)
22.86 (O.900)
r\
~
I
I
-1-I
.-j f.-
I
I
1I.--
I--
3.05 (O.120)
2.03 (O.080)
-I- ,-,-
25.40(0.100)
MAX. ALLOWED
FOR SPLICES
----.J
LWHITE TAPE
NOTE: LED'S MUST FALL WITHIN 0.020" OF A COMMON CENTER,
OUTLINE B (TAPE AND REEL) - OPTION P02
5.08
mm
(0.200 inch) spacing
~1-'00MAX'
CATHODE
~=E
t
14.61 (0.575)
12.07 (0.475)
NOTE 1.
~
6.35 (O.250)
TYP,
I
~-"
,
1\
.750)
MA X.
L_ --
-.
----I
25.40 (1.000)
22.86 (0.900)
r\
~
I
I
t
I
I
t=
5.58 (0.220)
4.57 (O.180)
NOTE: LED'S MUST FALL WITHIN 0.020" OF A COMMON CENTER.
6-131
I
25.40 (O.100)
MAX. ALLOWED
FOR SPLICES
~-L
WHITE TAPE
Fhdl HEWLETT
TAPE AND REEL SOLID STATE LAMPS
~~ PACKARD
Leads:
Smm (0.197 Inch) Formed Leads - OPTION 001
2.54mm (0.100 inch) Straight Leads - OPTION 002
Features
• COMPATIBLE WITH RADIAL LEAD
AUTOMATIC INSERTION EQUIPMENT
• MEETS DIMENSIONAL SPECIFICATIONS OF
IEC PUBLICATION 286 AND ANSIIEIA
STANDARD RS-468 FOR TAPE AND REEL
• REEL PACKAGING SIMPLIFIES HANDLING
AND TESTING
• T-1 AND T-1 3/4 LED LAMPS AVAILABLE
PACKAGED ON TAPE AND REEL
• 5 mm (0.197 INCH) FORMED LEAD AND
2.54 mm (0.100 INCH) STRAIGHT LEAD
SPACING AVAILABLE
Device Selection Guide
Description
Option
T-1 and T-1 3/4 LED lamps are available on tape and reel
as specified by the IEC Publication 286 and ANSI/EIA
Standard RS-468. The Option 001 lamp devices have
formed leads with 5 mm (0.197 inch) spacing for automatic
insertion into PC boards by radial lead insertion equipment. The Option 002 lamp devices have straight leads
with 2.54 mm (0.100 inch) spacing, packaged on tape and
reel for ease of handling. T-1 lamps are packaged
1800/reel. T-1 3/4 lamps are packaged 1300/reel.
Ordering Information
To order LED lamps packaged on tape and reel, include
the appropriate option code along with the device catalog
part number. Example: to order the HLMP-3300 on tape
and reel with formed leads (5 mm lead spacing) order as
follows: HLMP-3300 Option 001. Minimum order quantities
vary by part number. Orders must be placed in reel increments. Please contact your local Hewlett-Packard sales
office or franchised Hewlett-Packard distributor for a
complete list of lamps available on tape and reel.
LED lamps with 0.46 mm (0.018 inch) square leads with 5
mm (0.197 inch) lead spacing are recommended for use
with automatic insertion equipment. It is suggested that
insertion machine compatibility be confirmed.
Description
001
Tape and reel, 5 mm (0.197 inch) formed leads.
'102
Tape and reel, 2.54 mm (0.100 inch) straight
leads.
Order Increments
Package
Quantity/Reel
T -1
1800
1800
T-13/4
1300
1300
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings, mechanical dimension
tolerances and electrical/optical characteristics for lamps
packaged on tape and reel are identical to the basic
catalog device. Refer to the basic data sheet for the specified val ues.
Noles:
1. Minimum leader length at either end of tape is 3 blank part
spaces.
2. Silver saver paper is used as the interlayer for silver plated
lead devices.
3. The maximum number of consecutive missing lamps is 3.
4. In accordance with EIA and IEC specs, the anode lead
leaves the reel first.
5. Drawings apply to devices with 0.46 mm (0.Q18 inch) square
leads only. Contact Hewlett-Packard Sales Office for dimensions of 0.635 mm (0.025 inch) square lead devices.
6-132
Tape and Reel LED Configurations
CATHODE
---t--h
.rllt'l----.""'---,-.-
t
I1
t
1
t
w
k
DO
Figure 1. T-1 High Profile Lamps, Option 001
CATHODE
r
H,
Figure 2. T -1 High Profile Lamps, Option 002
---+-!-,
CATHODE
t
1
--!--\,
f
I
DO
Figure 3. T -1 Low Profile Lamps, Option 001
DO
Figure 4. T -1 Low Profile Lamps, Option 002
1',
f
H3
11
DO
Figure 5. T -1 3/4 High Profile Lamps, Option 001
Figure 6. T-1 3/4 High Profile Lamps, Option 002
Do
Figure 7. T-1 3/4 Low Profile Lamps, Option 001
Figure B. T -1 3/4 Low Profile Lamps, Option 002
6-133
Dimensional Specifications for Tape and Reel
Item
T1 High Profile
Body Height
Body Diameter
Option
Component Height
T1 Low Profile
Body Height
Body Diameter
Component Height
T1-3/4 High Profile
Body Height
Body Diameter
001
~ ~
n~
Component Height
T1-314 Low Proftle
Body Height
BOdy Diameter
Component Height
Lead wire thickness
Pitch of component
002
~
-
i
n~
Feed hole pilch
Symbol
Al
01
HI
A2
02
H2
A3
03
H3
A4
D4
H4
d
P
Po
Specification
4.70 (0.1851
4.19 (0.1651
3.18 (0.125)
2.67 (0.105)
25.7 (1.012)
Max.
3.73 (0.147)
3.23 (0.127)
3.05 (0.120>
2.79 (0.110)
24.7 (0.974)
Max.
9.19 (0.362)
8.43 (0.3321
5.08 (0.200)
4.32 (0.1701
30.2 (1.189)
Max.
6.35 (0.250)
5.33 (0.2101
5.08 (0.200)
4.32 (0.170)
27.4 (1.079)
Max.
OA5 (0.018)
13.7 (0.539)
11.7 (0.461)
12.9 (0.508)
~
Feed hole center to lead center
PI
4.55 (0.179)
3.15 (0.124)
Hole center to component center
P2
Lead to lead distance
F
7.35 (0.289)
5.35 (0.211)
SAO 10.213)
4.90 (0.193)
o± 1.0 (0.039)
18.510.728)
17.5 (0.689)
15.3 (0.602)
14.7 10.579)
9.75 (0.384)
8.50 (0.335)
0.5 (0.020)
Max.
21.0 10.827)
20.0 (0.787)
16.5 (0.650)
15.5 (0.6101
4.20 (0.165)
3.8010.150)
0.90 (0.035)
0.50 10.020>
Oomponent alignment, front-rear'
Tape width
,c,h
W
Hold down tape width
Wo
Hole position
WI
Hold down tape positJon
W2
Height of componenl from hole center
H
Lead Clinch heighl
HO
Feed hole diameter
00
Total tape thickness
I
Length of snipped lead
L
Lead langlh under hold down tape
11
Note:
1. Dimensions in millimetres (inches), maximum/minimum.
6-134
11.0 (0.433)
Max.
14.5 (0.571)
Min.
Notes
Square Leacfs
Cumulative error:
1.0 mml20 pitches.
Measure at crimp
bottom. 5.7813.68
(0.227/0.1448) for straight
leads
.
2.54 (0.100) nominal for
straight leads.
Figure 9
Paper thickness:
~::! ;~:~:: Figure 9
-r-
20.0
(0.7871
L_
Figure 9. Front to Rear Alignment
and Tape Thickness, Typical,
All Device Types
F'" 100g MIN. APPLIED
FOR 3 ± 1 SEC.
F = 70g MIN. APPLIED
F = 500g MIN. APPLIED
FOR 3 ± 1 SEC.
FOR 3, 1 SEC.
Figure 10. Device Retention Tests and Speclflcallons
F .. 5009 MAX. EXTRACTION FORCE TO
TAPE lEADER
OPERATOR _ _ _ _ _ __
HP PART NUMBERI _ _ _ __
DATE COOE _ _ _ _ _ __
TAPING DATe' _ _ _ _ __
ELEe. VALUE _ _ _ _ __
TOLERArJCE _ _ _ _ _ __
, aUANTITY _ _ _ _ _ __
CUSTOMER PT. NO.
Figure 11 ~ Reel Configuration and Labeling
6-135
UNWIND REEL.
Fli;a
SUBMINIATURE LED
RIGHT ANGLE INDICATORS
HEWLETT
~I:. PACKARD
RED
HIGH EFFICIENCY RED
YELLOW
GREEN
HLMP-6000·010
HLMP-6300-010
HLMP·61100·010
HLMp·6500-010
Features
• IDEAL FOR PC BOARD STATUS INDICA1'ION
• SIDE STACKABLE ON.2.S4 mm (0.100 in)
CENTERS
• AVAILABLE IN FOUR COLORS
• HOUSING MEETS UL 94V-O FLAMMABILITY
SPECIFICATIONS
• ADDITIONAL CATALOG LAMPS AVAILABLE AS
OPTIONS
Description
The Hewlett-Packard ·series of Subminiature Right Angle
Indicators are industry st,mdard status indicators that
incorporate tinted diffused LED lamps in black plastic
housings. The 2.54 mm (0.100 in) wide packages may be
side stacked for maximum board space savings. The silver
plated leads are in line on 2.54mm (0.100 in) centers, a
standard spacing that makes the PC board layout straightforward. These products are designed to be used as back
panel diagnostic indicators and logic status indicators on
PC boards.
Ordering Information
To order Subminiature Right Angle indicators, order the
base part number and add the option code 010. For price
and delivery on Resistor Subminiature Right Angle Indicators
and other subminiature LEOs not indicated above, please ,
contact your nearest H.P. Components representative.
Absolute Maximum Ratings
and Other Electrical/Optical
Characteristics
The absolute maximum ratings and typical device characteristics are identical to those of the Subminiature lamps.
For information about these characteristics, see the data
sheets of the equivalent Subminiatwe lamp.
package Dimensions
l
r
Fl
5'33 !O'210I
4.ea1lilllO)
2.54l0.1OO1
mllr.iili4i
~~!!~:=-
....----...............:
~!l!JW
3Af(ijM
JL..",,.1
~~
.J
V-CATHODE
t±1 0.'O.2.3!J1,'l!l9t
(ij;ljij7f
2.6410.100) NOM.
m(O.016)
NOTE: ALL DIMENSIONS ARE IN MILLIMETRES IINCHE$l.
6-136
Flifl'l
T-1 (3mm) RIGHT ANGLE
LED INDICATORS
HEWLETT
~~ PACKARD
OPTION * 010
OPTION -101
Features
•
IDEAL FOR CARD EDGE STATUS INDICATION
PACKAGE DESIGN ALLOWS FLUSH SEATING ON A
PC BOARD
• MAY BE SIDE STACKED ON 4.57 mm (0.18 in)
CENTERS
• UP TO 8 UNITS MAY BE COUPLED FOR A
HORIZONTAL ARRAY CONFIGURATION WITH A
COMMON COUPLING BAR (SEE T-1 RIGHT ANGLE
ARRAY DATA SHEET)
• LEDs AVAILABLE IN ALL LED COLORS, WITH OR
WITHOUT INTEGRATED CURRENT LIMITING
RESISTOR IN T·1 PACKAGES
o EASY FLUX REMOVAL DESIGN
• HOUSING MATERIAL MEETS UL 94V-0 RATING
• ADDITIONAL CATALOG LAMPS AVAILABLE AS
OPTIONS
•
For example. by ordering HLMp·1302-010, you would
receive the long lead option. By ordering HLMP-1302-101.
you would receive the short lead option.
Arrays made by connecting two to eight Single Right Angle
Indicators with a Common Coupling Bar are available.
Ordering information for arrays maybe found on the T-l
Right Angle Array data sheet.
The above data sheet information is for the most commonly
ordered part numbers. Refer to other T-l base part number
specifications in this catalog for other lamp types that may
be ordered with the right angle option.
Description
Hewlett-PaCkard T-l Right Angle Indicators are industry
standard status indicators that incorporate a tinted diffused
T-l LED lamp in a black plastic housing. The indicators are
available in Standard Red, High Efficiency Red, Orange,
Yellow. and High Performance Green. with or without an
integrated current limiting resistor. These products are
designed to be used as back panel diagnostic indicators
and card edge logic status indicators.
Absolute Maximum Ratings
and Other Electrical/Optical
Characteristics
Ordering Information
To order other T-l High Dome Lamps in Right Angle
Housings in addition to the parts indicated above, select the
base part number and add the option code 010 or 101,
depending on the lead length desired (see drawing belowl.
The absolute maximum ratings and typical device characteristics are identical to those of the T-l LED lamps. For
information about these characteristics, see the data sheets
of the equivalent T-l LED lamp.
Package Dimensions
3.6810.145)
3:iS (0.125) DIA.
o
U
2'4~~~~95)l
Fr
6.4310.253)
mIO.247)
n-
I I
7.4410.293)
~[hR1ij~! ,~L
*
1 r - 1 2 7 (0050)
~
NOM~.70 (0185)
REF.
OPTION NO.
CATHODE LEAD
#010
18.03 (0.710)
MIN.
#101
3.43 (0.135)
3.43 (0.135)
MIN.
MIN.
LfNGTH
see TAOLf
NOM
MAX.
f
-'----tt-'lc
2.54 (0.100)
4.5110.160)
ANODE LEAD
LfNGTH
1.27 (O.OSO)
UNSHEARED
NOM. LONGER UNEVEN LEADS
THAN CATHODE
SHEARED
EVEN LEADS
0,4510,018)
saUARf NOM
6-137
NOTE: ALL DIMENSIONS ARE IN MILLIMETRES IINCHfS).
T-1 (3 mm) RIGHT
Fli;'
HEWLETT
-.=~ PACKARD
ANGLE ARRAYS
OPTION:
102 104
103 105
106 108
107
Features
• IDEAL FOR PC BOARD STATUS INDICATION
• STANDARD 4 ELEMENT CONFIGURATION
• EASY HANDLING
• EASY FLUX REMOVAL
• HOUSING MEETS UL 94V-OFLAMMABILITY
SPECIFICATIONS
• OTHER CATALOG LAMPS AVAILABLE
Description
These T-1 right angle arrays incorporate standard T-1 lamps
for a good balance. 9f viewing angle and intensity. Single
units: are held together by a plastic tie bar. The leads of
each member of the array are spaced on 2.54 mm (0.100 in)
centers. Lead spacil')g between adjacent lamps in the array
is. on 2.03 mm (0.080 in) centers. These products are
designed to be. used as back panel diagnostic indicators
and logic status indicators on PC boards.
Ordering Information
Use the option code 102 through 108 in addition to the
base part number to order' these amlys. Arrays from 2 to 8
elements in length and special lamp color combinations
within an array· are available. Please contact your nearest
Hewlett-Packard Components representative for ordering
information on these special items.
package Dimensions
NOTE: ALL DIMENSIOIIIS ARE IN
MI~L'MeTRES
(INCHES).
\'!--_.-...j_ :~;
(~!~l
3.68 (o.1~51
m~
1
8.64!!)~
~r
3.43(0.136)
MIN.
g~
38.45 (1AIS}
lU7@,7!!l
UJi(f.'ffll
6-138
r~;w
a!'g
LED RIGHT ANGLE
INDICATORS T-1 3/4~m)
HEWLETT
PACKARD
OFfl'ON ~O
OPTION -191
M
Features
• IDEAL FOR CARD EDGE STATUS INDICATION
• PACKAGE DESIGN ALLOWS FLUSH SEATING
ONAPCBOARD
• MAY BE SIDE STACKED ON 6.35 mm (0.25")
CENTERS
• .LEDs AVAILABLE IN FOUR COLORS, WITH OR
WITHOUT INTEGRATED CURRENT LIMITING
RESISTOR IN T-1 3/4 TINTED DIFFUSED
PACKAGES
• ADDITIONAL CATALOG LAMPS AVAILABLE AS
OPTIONS
Description
The T-1 3/4 Option 010 and 100 series of Right Angle
Indicators are industry standard status indicators that
incorporate a tinted diffused T-1 3/4 LED lamp in a black
plastic housing. The indicators are available in standard
Red, High Efficiency Red, Yellow, or High Performance
Green with or without an integrated current limiting
resistor. These products are designed to be used as back
panel diagnostic indicators and card edge logic status
indicators.
package Dimensions
OPTION NO.
CATHODE LEAD
LENGTH
#010
4.70 (0.1851
3.68 (0.1451
#100
20.32 (0.8001
MIN.
ANODE LEAD
LENGTH
4.70 (0.1851
3.68 (0.1451
SHEARED
EVEN LEADS
1.27 (0.0501
UNSHEARED
NOM. LONGER UNEVEN LEADS
THAN CATHODE
NOTes:
1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).
2. !.fAD WIDTH MAY BE 0.45 (Q.D1BI OR 0.6410.02.)
SQUARE NOMINAl. DEPENOING VPON PRODUCT
TYPE.
3. OPTION 100 IS AVAILABLE fOR LONGER LEADS.
5.ol\ {O.2QO)
WlUmlf
NOTE 2
OElIIGNATes CATHODE
I
~
I
" \ - - 2.64(0.100)
fATENT PENDING
L:i~,,~
REF.
NOM.
6-139
f
t
SEe TABLE
Ordering Information
To order T-1 3/4 high dome lamps in addition to the parts
indicated above, select the base part number and add the
option code 010 or 100. For example: HLMP-3750-010.
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
All Hewlett-Packard T-1 3/4 high-dome lamps are
available in right angle housing. Contact your local
Hewlett-Packard Sales Office or authorized components
distributor for additional ordering information.
The absolute maximum ratings and device characteristics
are identical to those of the T-1 3/4 LED lamps. For information about these characteristics, see the data sheets of
the equivalent T-1 3/4 LED lamp.
6-140
FliU-
HEWLETT
~~ PACKARD
T-1 3/4 LED LAMP
RIGHT ANGLE HOUSING
Features
• FITS ANY HP HIGH DOME T-1 3/4 LED LAMP
• SNAP-IN FIT MAKES MOUNTING SIMPLE
• HIGH CONTRAST BLACK PLASTIC
Description
The HLMP-5029 is a black plastic right angle housing
which mates with any Hewlett-Packard High Dome T-1 3/4
lamp. The lamp snaps into place. The material is fully
compatible with environmental specifications of all
Hewlett-Packard T-1 3/4 lamps.
Physical Dimensions
NOTES:
1. ALL DIMENSIONS ARE IN MllLlMETRES IINCHESI.
2. ALL TOLERANCES ± 0.254«0.0101 UNLESS
OTHERWISE SPECIFIED.
r--9.0210.33S}
4.57 (0.1801
~
3.731O.1411-+---->oj
0.64 (0.0331
6-141
HlMP-S029
F'in-
OPTIONAL LEADFORMS
FOR HP SUBMINIATURE
LAMPS
HEWLETT
~e. PACKARD
Features
• 100 OR 200 MIL BENDS
• CATHODE TAB OR CATHODE STRIPE
• SHORT OR LONG LEAD LENGTH
CATHODE TAB REMOVED
CATHODE STRIPE
/
A_~.J.,.,
H~
Description
The Hewlett-Packard Subminiature Lamps are available in
a variety of lead forms. In addition, these lead forms are
available with or without cathode tabs.
Iii
3.94 (0.1551
2.54 ( 0 . , 0 0 I U
NOM.
Ordering Information
To obtain subminiature lamps with these lead forms, contact
your local Hewlett-Packard sales office or franchised
Hewlett-Packard Distributor for specific ordering instructions. Be sure to specify either .100" or .200" spacing, short
Or long lead length, and cathode tab or cathode stripe.
+
.
*.~~L
M=
3.94 (0.1551
'----r
I
t
2.54 (0.,001-L-J·
NOM.
Figure 1, 0.100" Lead Spacing, Short Lead Length
CATHODE TAB REMOVED
CATHODE STRIPE
CATHODE TAB INTACT
A".
.0
D
I
1_,
10.16 (0.4001
10.67 (0.4201
n~·4201
~
I
2.54 ( 0 . , 0 0 I U
~---l
2.54 (O.,OOIU
NOM.
NOM.
NOTE: ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).
Figure 2. 0.100" Lead Spacing, Long Lead Length
6-142
"
+A
"
-
A-d.,",
~ I-.J_~
---a.d,,'35)
3,,9410,,155)
3.9410.155)
'f
I
'---rI
(0.200)~
I
I 5.0B
I- NOM.
L5"OB 10,,200)J
NOM.
Figure 3. 0.200" Lead Spacing, Short Lead Length
+-¥.
.+
[]
"'"OOnM
"~."m
CATHODE STRIPE
~
~
-~
10.16 (0.400)
10.67 (0.420)
~
- ---r
.
~~
~
1--5.0B (0.200)-1
~~
\.- 5.0B 10.200'-.1
NOM.
NOM.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).
2. REFER TO THE SPECIFIC DATA SHEET FOR
SUBMINIATURE LAMPS FOR THE DETAILED
DIMENSIONS OF THE LAMP.
Figure 4. 0.200" Lead Spacing, Long Lead Length
6-143
10.16 (0.400)
10.67 (0.420)
FliD'l
CLIP AND RETAINING
RING FOR PANEL
MOUNTED T1 3/4 LEOs
HEWLETT
a!~ PACKARD
OPTION 009 (HlMP-0103)
Description
The Option 009 (HLMP-0103) is a black plastic
mounting clip and retaining ring. It is designed to
panel mount Hewlett-Packard Solid State high profile T-1 3/4 size lamps. This clip and ring combination is intended for installation in instrument
panels from 1.52mm (.060") to 3.18mm (.125")
thick. For panels greater than 3.18mm (.125")
counterboring is required to the 3.18mm (.125")
thickness.
r;
N---T
1t!t7.37 (.290) DIA.
-r
; ~:)
(~~l)~ ;
"~
...
~
B.OO (.31S) OIA.
1. Drill an ASA C size 6.15mm (.242") dia.
hole in the panel. Deburr but do not
chamfer the edges of the hole.
2. Press the panel clip into the hole from
the front of the panel.
3. Press the LED into the clip from the
!;lack. Use blunt long nose pi iers to push
on the LED. Do not use force on the
LED leads. A tool such as a nut driver
may be used to press on the clip.
PLIERS
Ordering Information
T-1 3/4 High Dome LED Lamps can be purchased
to include clip and ring by adding Option Code 009
to the device catalog part number.
Example:
To order the HLMP-3300 including clip and
ring, order as follows: HLMP-3300 Option 009.
6-144
II
I. )t--
i~
6.731.265) DIA.
II
~~e
)I
--I
9.53 (.375J D t A . _
RETAINING
RING
Mounting Instructions
4, Slip a plastic retaining ring onto the back
of the clip and press tight using tools such
as two nut drivers.
2. TOLERANCES, .25 (.010).
'
CLIP
Note: Clip and retaining ring are also available for T-1
package, from a non-HP source. Please contact
Interconsal Association, 991 Commercial St., Palo
Alto, CA 94303 for additional information.
6.73
(.265)
0.641.025)
l 5'21('2051~
I-DIA.
--II
-
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES).
HerlDetie Lamps
.6-145
FhU-
HEWLETT
~~ PACKARD
JAN QUALIFIED
HERMETIC
SOLID STATE
lAMPS*
1N5765
1N6093
JAN1N5765
JAN1N6093
JANTX1N5765 JANTX1 N6093
1N6092
1N6094
JAN1N6092
JAN1N6094
JANTX1N6092 JANTX1N6094
Features
• MILITARY QUALIFIED
LISTED. ON MIL-S-19500QPL
• CHOICE OF 4 COLORS
Red
High Efficiency Red
Yellow
Green
HERMETIC T0-46 LAMP
• DESIGNED FOR HIGH-RELIABILITY
APPLICATIONS
• HERMETICALLY SEALED
• WIDE VIEWING ANGLE
• LOW POWER OPERATION
• IC COMPATIBLE
• LONG LIFE
• TWO PANEL MOUNT OPTIONS[4]
Option 001
Aluminum Black Anodized Sleeve
Option 002
Black Conductive Composite Sleeve
Both Options Have Wire Wrappable
Leads Electrically Isolated From The Sleeve
LAMP ASSEMBLY AS PANEL MOUNT
Description
The 1N5765, 1N6092, 1N6093 and 1N6094. solid state LED's
are hermetically sealed in a TO-46 package with a tinted,
diffused plastic lens over a glass window. The panel mountable versions consist of an LED unit permanently mounted
in a conductive composite or anodized aluminum sleeve.
The electrically conductive composite sleeve provides
electrical contact to the front and back panels and has RFI
shielding equivalent to the aluminum sleeve. Additionally,
the composite sleeve has excellent tensil strength and
superior scratch and wear resistance. All these devices are
designed for high reliability applications and provide excellent on-off contrast, high axial luminous intensity and a
wide viewing angle.
The 1N6092 has a high efficiency red GaAsP on GaP LED
chip with a red diffused lens over a glass window. This
device is comparable to the 1N5765 but it's efficiency
extends to higher currents and it provides greater luminous
intensity.
The 1N6093 provides a yellow GaAsP on GaP LED chip
with a yellow, diffused lens over a glass window.
The 1N6094 utilizes a green GaP LED chip with a green,
diffused lens over a glass window.
The plastic lens over glass window system is extremely
durable and has exceptional temperature cycling capa"
bilities.
The 1N5765 utilizes a GaAsP LED chip with a red diffused
lens over a glass window.
'Panel mount versions of all of ihe above are available per the selection matrix on the next page.
6-146
COLOR ..;;;. PART NUMBER ";;;LAMP AND PANEL MOUNT MATRIX
Standard
With JAN au,lilie,lIon[1]
JAN'P·lus TX Testing(2]
Description
Product
Sta ndard Red
High Elfleiency Red
Yellow
Green
rS],
lN5?;65
1N6092
lN6093
Yellow
Green
Standard Red
High Ellipeney Red
Controlling MIL,S-1.9500
Document
HLMP·0904
HLMp·0354
HLMP·0454
HLMP'0554
HLMP-0930
H'Mp;0380 IJANM19500/5l~Ol'
HLMP'0480 IJANM19500lp2P01)
HLMP·OSSO IJANM19500/52J01)
Notes:
1. Parts are marked J1 NXXXX or as indicated.
2. Parts are marked JTX1 NXXXX or as indicated.
3. Panel mountable packaging incorporates additional assembly of the
equivalent Table I TO-46 part into the panel mount enclosure. The
resulting part is then marked per Table II.
4. When ordering panel mount devices, specify either Option #001
(anodized aluminum sleeve) or Option #002 (conductive composite
sleeve).
5. JAN and JANTX parts only.
JAN PART: Samples of each lot are subjected to Group A
and B tests listed below. Every six months, samples from a
single lot of each part type are subjected to Group C
testing. All tests are to the conditions and limits specified
by the appropriate MIL-S-19500 slash sheet.
JANTX PART: These devices undergo 100% screening
tests as listed below to the conditions and limits specified
by the MIL-S-19500 slash sheet. The JANTX lot has also
been subjected to Group A, Band C tests as for the JAN
PART above.
Examination or Test
MIL-STD-7S0
Method
Examination or Test
GROUP A INSPECTION
GROUP C INSPECTION
Subgroup 1
Thermal shock (temperature cycling I
End points: (same as subgroup 2 of group BI
Subgroup 1
Visual and mechanical examination
Subgroup 2
Luminous intensity {fJ
Luminous intensity {O
Reverse current
MIL-STD-750
Method
= 0° I
= 30° 1
Forward voltage
Subgroup 3
Capacitance
2071
-
Subgroup 2
Subgroup 3
High-temperature life (nonoperating 1
End points: Luminous intensity iO = 0' 1
1031
4001
Subgroup 4
Steady-state operation life
End paints: Isame as subgroup 31
1026
Subgroup 5
Peak forward pulse current Itransientl
2066
Subgroup 2
Solderability
Thermal shock I temperature cycling 1
Thermal shock I glass strain
-
Resistance to solvents
4016
4011
GROUP B INSPECTION
Subgroup 1
Physical dimensions
I
Hermetic seal
Moisture resistance
End points: Luminous intensity (0 = 0' 1
Subgroup 3
Shock
Vibration, variable frequency
Constant acceleration
Subgroup 6
Peak forward pulse current 1 operating 1
-
-
End points: I same as subgroup 6 of group B I
-
PROCESS AND POWER CONDITION
("TX" types only)
2016
2056
2006
High temperature storage Inonoperating I
Thermal shock (temperature cyclingl
Constant acceleration
Hermetic seal
Luminous intensity (0
Forward voltage
= 0' 1
Subgroup 4
Terminal strength
End points: Hermetic seal
2036
1071
Reverse current
Subgroup 5
Salt atmosphere I corrosion 1
1041
Burn-in I Forward bias 1
End paints Iwithin 72 hours of burn-in!:
Subgroup 7
SteadY'state operation life
End paints: Isame as subgroup 61
-
End points: Isame as subgroup 6 of group BI
2026
1051
1056
1071
1021
End paints: Isame as subgroup 21
Subgroup 6
High-temperature life I nonoperating I
End paints: Luminous intensity iO = 0' I
1051
1032
1027
6-147
~
Luminous intensity
~
Forward voltage
1051
2006
1071
4011
4016
(0
= 0° I
4011
Absolute Maximum Ratings at TA=25°C
Red
HLMP-0904
Higb Eft. Red
HLMP·0354
Yellow
HLMP·0454
Green
HLMp·0554
Units
Power Dissipation
(derate linearly from 50ac at
1.6mW/oC)
100
120
120
120
mW
DC Forward Current
50[1)
35(2)
35[2]
mA
Parameter
35(2J
60
See Fig. 10
1000
See Fig. 5
Peak Forward Current
Operating and Storage
Temperature Range
60
See Fig. 15
60
See Fig. 20
mA
-65°C to 100°C
Lead Soldering Temperature
(1.6mm (0.063 in.) from body)
260°C for 7 seconds.
Notes: 1. Derate from 50' C at 0.2mA/' C
2. Derate from 50' C at O.SmA/' C
Electrical/Optical Characteristics at TA =25°C
Symbol
Description
IVl
Axial LumInous
HLMP-0904
Min.
Typ.
O.S
1.0
Max.
HLMP·0354
Min.
Typ.
3.0
8.0
Max.
HLMP-0454
Min.
Typ.
3.0
8.0
M••.
20, ,
At
Luminous
Intensity
., e e
Typ.
3.0.1 80
Int~nsity
1\12
HLMP-oS54
Min.
30'1 5 1
60
Included Angle
aetween Half
Luminous Intensity
Points
ApE!\1\
Peak Wavelength lSI
';d
Dominanl Wavelength
TS
Speed of Response
1.5
1.5
1.5
m
J
Unit.
Telt Condilloni
mcd
IF - 20mA
FigS. 3.8.13.16
mcd
ee
0.09
111
25mA
1.5
70
70
70
'F
M••.
INO
655
700
590
635
695
550
583
640
626
585
10
200
200
Capacitancel 51
200
(-)K
Thermal Re$istance'"
425
fiJ('
Thermal Re$lstance" 11
550
VF
Forward Voltage
1.6
35
300
100
35
425
2.0
525
100
Reverse Currentl S j
Revers~
Breakdown
3~'
Figures
2.0
Measurement
at Peak
570
nm
121
200
ns
600
100
'OJW
550
2.1
3.0
pF
'C/W
425
550
3.0
nm
565
35
425
550
2.0
660
3.0
V
At IF; 25mA
18
IF ~ 20 mA
6.11,16,21
0
av.
e ~ 0'
LO
1.0
4
5
5.0
1.0
1.0
5.0
5.0
V,-O; f-l MHz
131
131
'FFigures 2. 7,
~20mA
12,17
IJA
V
VR- 3V
Ik ~ 100pA
Voltage
~,
Luminous Efficacy
56
140
455
600
ImJW
141
NOTES:
1. e1/2 Is the off-axis angle at which the luminous 'intensity is half the axial luminous intensity.
2. 'The domil1ant wavelength,' Ad. is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
3. Junction to Cathode Lead with 3.18mm (0.125 inch) of leads exposed between base of flange and heat sink.
4. Radiant intensity, Ie. in watts/steradian, may be found from the equation Ie = 'v/t)v, where Iv is the luminous intensity in candelas and t)v is the luminous
efficacy in lumens/watt.
5. Limits do not apply to non JAN or JANTX parts.
'Panel mount.
""TO-46
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength.
6·148
Package Dimensions
1N5765,1N6092,1N6093,1N6094
HLMP-0904, 0354, 0454, 0554
TINTED PLASTIC
OVER GLASS LENS
4.511.1801
'T
24.6 (.910)
PART
MARKING
["'~
0.61
o.
GLASS/,METAL
HERl\leT1~CAN
n
4
~~u~~
:m2_l1.1iroi.1.t_O_1_ _ _ _ _
GOLD PLATED
KOVAR
0,41 10.016)
0.4810.019)
~t~llr
NOTES,
9'.~'''21~ _~_
0.89~
1.14r;o45j
- r - - - - - - - I - - - - f
I. THE PANELMOUNT SI.EEVE IS
'G.6?lt.4201
~
EITHER A BLACK CONDUCTIVE
COMPOSITE OR BLACK
ANODizeD ALUMINUM.
~. GOI.O PLATED LEADS.
3. MOUNTING I-IARDWARE WHICH INCLUDES ONE LOCK
1.425)
WASHER AND ONE H£X-NUT )S INCLUDED WITH EACH ~
PANEL MOUNTABLE HERMETIC SOLID STATE LAMP.
4. USE OF METRIC DRILL SIZE 8.20 MILLlMEtRES OR
ENGLISH DRILL SIZE P (o.~~ INCH) IS RECOMMENDED
+
FOR PRODUCING HOLE IN THE PANEL FOR PANEL
.
MOUNTING.
4. ALL DIMENSIONS IN MILLtMETRES (INCHES).
&. PACKAGE WEIGHT INCLUDING LAMP AND
PANEL MOUNT IS 1.2 - U GRAMS. NUT AND
WASHER 1$ AN exTlIA 0.6 -1.0 aRAM.
L
G,n.80;J-I1----;
II
I
~'53 (.0")
_
OUTLINE T0-46
l
f
m~
NOteS!
1. AI,.l.. DIMENSIONS AllE IN MILUMeTRESUNCHES),
2. GO\.D·PLATED \.EAOS.
:\. PACKAGE WEIGHT OF LAMP ALONE
IS .25 -.a5 GRAMS.
t.
Family of Red 1N5765/HLMP-0904
2.
60
40
"•
I
l-
'fA ·wc
30
I
20
ili
~
::>
•
fA
>
Iii
2.0
.
Qfa
1.5
ffi<
I- •
~
u
ZN
0
i~
a:
""
Ii"
~~
1.0
~~
~
~-
I
-"
a:
1.40
T.I, 25'J
/'
~~
10
1
1.5
'~5'C
1.70
1.60
VF- FORWARD VOLTAGE - VOLTS
Figure 2. Forward Current vs.
Forward Voltage.
.5
/
00
V
1/
10
20
U
>0
u"
/
~~
1.0
~
iE!:i
...
....
~o
~~
>~
-~
~!
..
-- - -
a:~
30
40
50
°0
IF - FORWARD CURRENT - rnA
Figure 3. Relative Luminous Intensity
vs. Forward Currant.
50
100
150
200
250
300
350
IpEAK - PEAK CURRENT -mA
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
1N5765/H LMP-0904
9O'f--+--+-+--+'3
tp -
PULSE WIDTH -,us
Figure 5. Maximum Tolerable Peak Current vs. Pulse Duration.
(lDC MAX as per MAX Ratings)
Figure 6. Relative Luminous Intensity vs. Angul~r Displacement.
Family of High Efficiency Red 1 N6092/HLMP-0354·
1
I
I
.
30
•
20
~
I
1/
0
15
".0
v, -
1.50
zw
~~
2.0
3.0
2.5
v
1.25
/'
1.00
.......
....
2
0
II
8
/
V'
0.00 5
3.4
V
/
0.50
0.25
~"25'b
4
/
0.75
10
15
20
25
30
35
IF - FORWARD CURRENT":' mA
PEAK FORWARD VOLTAGE - V
Figure 7. Forward Current v••
Forward Voltage.
3.0
....~~
~9
~<
~~
/
~
1.75
,g~
II
0
~
~
~<
I
40
C
~
•
1.
2.00
50
Figure 8. Relative Luminous Intensity
vs. Forward Cu~rant.
•
· 0
V
I
10
20
30
40
50
60
' ':£At< - PEAK CURRENT - mA
Figure 9. Relative Efficiency
(Luminous·lntensity par Unit .
Currentl vs. Peak Current.
rr",nmr-.-rr
.
,
10
tp":'
1,000
10,000
PULSE DURATION ":#l$
Figure '11. Relative Luminous Intensity vs. Angular DisPlacem8~.
Figure 10. Maximum Tolerable Peak Cur·
rent vs. Pulse Durati~n. (lDC MAX
as par MAX Ratings)
Family of Yellow 1N6093/HLMP-0454
1I
~
ac
!
...
30
~
.
,
i
J:
0
~.o
.15
\If -
2D
/
I
2.5
1.50
~~
1.2
!!i:::i
1.00
V
5
/
~:!i
!
I
o
~~
~!;(
,
!
0
I
2.00
~C( 1.75
'/
Ii!
~
j
~
6
40
1.6
2.25
I
0
3.0
I
PEAK FORWARD VOLTAGE - V
. F Ig·u;e 12. Forvikrd Current vs.
. Forward Voltage.
~~ 0.75
~~
0,60
...
0.25
/
/
0
/
""
10
I
•
15
20
25
30
......
;'
/"
2
V'
0,00 5
i.....~
4
35
IF - FORWARD CURRENT - mA
Figure 13. Relative Luminous Intensity
vs. Forward Current.
·/
· 0
·FigUre.1~.
10
/
20
30
---I-f-+--+--+lc++-+-t-+....,~ .75
.50
80'
tp
-PULSE DURATION -PI
Figure 16. Relative Luminous Inte~sitY· vs. Angular Displacement.
6-150
50
60 .
mA
Relative Efficiency
(Luminous Intensity par Unit
Currentl vs. Peak Current•
.....:l>+4+++++-t-t-H'·0.
Figure 15. Maximum Tolerable Peak Cur·
.
. rent vs. Pulse Duration. (lDC MAX
as par MAX Ratings)
40
IpEA~ '- PEAK CURRENT -
Family of Green 1 N6094/HLMP-0554
1.6
2.00
0
~
0
~~
II
~~ 1.25
00
z
w 1.0 0
~~
w~
0
~ ~ 0.50
...
V
'.5
2.0
0.75
~g
if
0
2.S
3.0
3.4
VF - PEAK FORWARD VOL.TAGE - V
Figure 17. Forward Current vs.
Forward Voltage.
0.25
+•. ,.·b
4
ffi1",.50
II
0
1.75
V
0.00 5
V
10
V
15
V
20
17
/'
;;
2
0
/V
25
30
, I
. 0
35
IF - FORWARD CURRENT - mA
10
20
""
V'"
30405060
IpEAK - PEAK CURRENT - rnA
Figure 18. Relative Luminous Intensity
vs. Forward Current.
Figure 19. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current .
.50
·.~+-++-l--f-4rl--i-f-H.25
,., r.+i11t,r:-rmlH+-I-Tr,1il!-rtt-mN
'.0,L...L.I.=":,o:-'-"""JlI,oo~.JW.u,.":OOO::-'-JWJlO"'.OOO
tp - PUL.SE DURATION -lois
Figure 20. Maximum Tolerable Peak Cur·
rent vs. Pulse Duration. (lOC MAX
as per MAX Ratings)
Figure 21. Relative Luminous Intensity vs. Angular Displacement.
6-151
F/ihl
ULTRA-BRIGHT HERMETIC
SOLID STATE LAMPS*
HEWLETT
~e. PACKARD
HLMP-0363
HLMP-0391
HLMP-0392
HLMP'0463
HLMP'0491
HLMP-0492
HLMP-0563
HLMP-0591
HLMP'0592
.Features
• SUNLIGHT VIEWABLE WITH PROPER
CONTRAST ENHANCEMENT FILTER
• HERMETICALLY SEALED
•
CHOICE OF 3 COLORS
High Efficiency Red
Yellow
High Performance Green
•
LOW POWEROPERATION
•
IC COMPATIBLE
•
LONG LIFE/RELIABLE/RUGGED
•
TWO PANEL MOUNT OPTIONS[2]
Option 001
Aluminum Black Anodized Sleeve
Option 002
Black Conductive Composite Sleeve
Both Options Have Wire Wrappable Leads
Electicallylsolated From The Sleeve
Description
The HLMP-0363, HLMP-0463, and HLMP-0563 are hermetically sealed solid state lamps in a TO-i8 package with a
clear glass lens. These hermetic lamps provide improved
brightness over conventional hermetic LED lamps, excellent on-off contrast, and high axial luminous intensity.
These LED indicators are designed for use in applications
requiring readability in bright sunlight. With a proper contrast enhancement filter, these LED indicators are readable
in sunlight ambients. All of these devices are available in a
choice of two panel mountable fixtures, a conductive
composite or anodized aluminum.
COLOR Description
PART NUMfJ'ER -
The HLMP-0363 utilizes a high efficiency red GaAsP on
GaP LED chip. The HLMP-0463 uses a yellow GaAsP on
a GaP LED chip. The HLMP-0563 uses a green GaP LED
chip.
These devices are offered with JAN equivalent quality
conformance inspection (OCI) and JANTX equivalent
screenings similar to MIL-S-i9500/519/520/521.
'Panel Mount version of all of the above are available per the
selection matrix on this page.
LAMP AND PANEL MOUNT MATRIX
JAN QCI
Standard Product
JANTX Equivalent
TABLE I HERMETIC TO·18 PART NUMBER SYSTEM
High Efficiency Red
Yellow
Green
HLMP-0391
HLMP-0491
HLMP-0591
HLMP·0363
HLMP·0463
HLMP-0563
HLMP-0392
HLMP-0492
HLMP-0592
TABLE II PANEL MOUNTABLE PART NUMBER SYSTEM{1,2]
High Efficiency Red
Yellow
Green
HLMP-0364
HLMP'()464
HLMP'()564
HLMP'0365
HLMP-0465
HLMP-0565
HLMP-0366
HLMP-Q466
HLMP-0566
NOTE:
1. Panel mountable packaging incorporates additional assembly of the equivalent Table I TO-18 part into the panel mount enclosure. The
resulting part is then marked per Table II.
2. When ordering panel mount devices, specify either Option #001 (anodized aluminum sleeve) or Option #002 (conductive composite
sleeve).
6-152
JAN Equivalent: Samples of each lot are subjected to
Group A and B, listed below. Every six months samples
from a single lot of each part type are subjected to Group
C testing. All tests are to the conditions and limits specified
by the equivalent MIL-S-19500 slash sheet for the device
under test.
Examination or Test
JANTX Equivalent: These devices undergo 100% screening
tests as listed below to the conditions and limits specified
by MIL-S-19500 slash sheet. The JANTX lot has also been
subjected to Group A, Band C tests as for the JAN
Equivalent PART above.
MIL-STD-750
Method
Examination or Test
GROUP C INSPECTION
GROUP A INSPECTION
Subgroup 1
Visual and mechanical examination
2071
Subgroup 2
Luminous intensity (8; 0')
Reverse current
Forward voltage
4016
4011
Subgroup 3
Capacitance
4001
Subgroup 1
Thermal shock (temperature cycling)
End points: (same as subgroup 2 of group B)
-
Subgroup 2
Resistance to solvents
GROUP B INSPECTION
Subgroup 1
Physical dimensions
MIL-STD-750
Method
-
Subgroup 3
High-temperature life (nonoperating)
End points: Luminous intensity (8; 0')
1031
Subgroup 4
Steady-state operation life
End points: (same as subgroup 3)
1026
Subgroup 5
Peak forward pulse current (transient)
2066
1051
-
-
End points: (same as subgroup 6 of group B)
Subgroup 2
Solderability
Thermal shock (temperature cycling)
Thermal shock (glass strain)
Hermetic seal
Moisture resistance
End points: Luminous intensity (8; 0')
2026
1051
1056
1071
1021
Subgroup 3
Shock
Vibration, variable frequency
Constant acceleration
End points: (same as subgroup 2)
2016
2056
2006
Subgroup 6
Peak forward pulse current (operating)
End points: (same as subgroup 6 of group B)
-
Subgroup 4
Terminal strength
End points: Hermetic seal
2036
1071
Subgroup 5
Salt atmosphere (corrosion)
1041
Subgroup 6
High-temperature life (nonoperating)
End points: Luminous intensity (8; 0')
1032
Subgroup 7
Steady-state operation life
End points: (same as subgroup 6)
1027
-
PROCESS AND POWER CONDITION
("TX" types only)
High temperature storage (nonoperating)
Thermal shock (temperature cycling)
Constant acceleration
Hermetic seal
Luminous intensity (8 ; 0')
Forward voltage
Reverse current
Burn-in (Forward bias)
End points (within 72 hours of burn-in):
" Luminous intensity (8 ; 0')
" Forward voltage
-
6-153
1051
2006
1071
4011
4016
4011
Absolute Maximum Ratings at T-A=25° C
Parameter
Power Dissipation
(derate linearly from 50·C at
1.6mW/·C)
DC Forward Current
High Elf. Red
HLMP'0363
Yellow
HLMP'0463
Green
HLMP-Q563
Units
120
120
120
mW
35 111
35111
.60
See Fig. 10
35111
60
See Fig. 15
mA
60
Peak Forward Current
See Fig.S
Operating and Storage
Temperature Range
mA
-65°C to i00·C
Lead Soldering Temperature
11.6mm (0.063 In.) from body]
260· C lor 7 seoonds.
NOTES: 1. Derate from 50° C a\ 0.5mAlo C
Electrical/Optical Characteristics at TA=25° C
HlMP-0363
Symbol Descripllon
IVl
Axial Luminous
Intensity
28112
Included Angle
Between Half
luminous Intensity
Points
>'PEAK
Peak Wavelength
Min.
Typ.
20
50
HlMP-0463
Max.
Min.
Typ.
20
50
16
590
635
HlMP-0563
Max.,
Min.
Typ.
20
I I
563
660
Unila Test Condilions
mcd
18
deg.
[11 Figures
6,11,16
nm
Measurement
at Peak
525
565
600
,
Ad
Dominant Wavelength
T.
Speed of Response
C
CapacltancelSI
0JC
Thermal Resistance'
6JC
m
626
585
570
nm
12J
200
200
ns
pF
Vl=O; 1=1 MHz
,oC/W
[3J
V
IF = 20mA
Figures 2,7,12
35
10a
100
35
425
425
425
Thermal ReSistance"
550
550
550
VF
Forward Voltage
2.0
I"
BVA
Reverse Current
3.0
2.0
1.0
5.0
[31
3.0
25mA
=
1.0
1.0
5.0
100
2.1
3.0
At IF
Reverse Breakdown
Voltage
iF=20mA
Figs. 3,8,13
/1=0'
50
AtlF=25mA
16
695
Mall.
5.0
/.IA
V
VR"'SV
IR=JooIlA
140
455
600
Im/W
[4)
luminous Efficacy
'Iv
NOTES:
1. 9'1.. is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
3. Junction to Cathode Lead with 3.18mm (0.125 inch) of leads exposed between base of flange and heat sink.
4. Radiant intensity, Ie, in watts/steradian. may be found from the equation Ie = IvI'1v, where Iv is'the luminous intensity in candelas
and 'Iv is the luminous efficacy in lumens/watt.
5. Limits do not apply to non screened parts.
'Panel mount.
"TO'~18.
1,0r-------------~~~-,__--~~~~--~~~------------~------------_,
O,5r------------tr---+-~----~~~r_------~~._--------~------------~
WAVELENGTH - nm
Figure 1. Relative Intensity ¥s. Wavelength.
6-154
package Dimensions
HLMP-0363, 0463, 0563
. "-a.'ll~
cr
L-
HLMP-0364, 0464, 0564
4'6~\('1781
MH~l
4,85
r.46
__
rr.-.,,--rt
DIA.
GLASS LENS
-r:;f'
"'~
Y-- t
262 tro01
c",' -
GLASS.I.. M
...ETAl
~ HERMETI~ CAN
1:215)
_~.
W~~.
~~
0.61
to:024i
-J~~~IOIA.
0.48 10.019'
QJ!l!~
1.141.045'
-~
NOTES:
1. THE PANELMOUNT SLEEVE 1$
EtTHEFl A BLACK CONDUCTiVE'
CATHODE
COMPOSlTE OR BLACK
ANODIZ~O AI.UMINt,JM,
HA~DWAftE WHICH INCLUOES ONE lOCK
WASH!:R AND ONE HEX·Nl,." IS INCLUDED WtTH EACH
PANEL MOUNTABLE HERMETIC 801..10 STATE LAMP.
2. MOUNTING
i
I
.J
O.81~
~ 1.01(.042)
OUTLINE TO-18
3, USE OF METRIC ORILL SIZE &20 MILUMETFlESOR
NOrEg,
ENGl.ISH OfULl SIZE P (0-,323 INCHI IS flECOMMENOEO
FOR: :PRODUCING HOLE tN THE MNEl FOR PAN.El
MOUNTING.
4. All OIMf;NSIONS ARE IN MILUMETRES fiNCHES).
1, ALL DIMENStONS ARE IN MILI.,IMETRES (INCHE$).
.2. GOLD·PLATEO LEADS.
3. PACKAGE WEIGHT OF LAMP ALONE
IS .2$. ,40GAAMs'
S. PACKAGE WEIGHT INCLUDING- LAMP AND
PAN~LMOUNT IS 1.z ~ 1.8-GAAMS. NUT AND WASHER ISANEXTRA .6-1.0GRAM.
Family of High Efficiency Red HLMP-0363/HLMP-0364
1
I
.
50
I
io ..
II
o
i
~
I
~
1.75
~<
~~
gS
1.1)0
~~
1.25
~~
;~
30
).o>s'!
/
1.00
/
~~
e
~
I .6
2.00
~~
~~
I
20
~-
/
0.25
0.00 5
3.0
/
7
0
Figure 2. Forward Current vs.
Forward Voltage.
/
20
25
35
Figure 3. Relative Luminous Intensity
vs. Forward Current.
.6 0
10
20
30
~
u 1.72
o
1.000
10,000
9O.1---J---J---J----=f::o
80' 90'
,08·
tp - PULSE DURATION - /.IS
Figure 5. Maximum Tolerable Peak Curent vs. Pulse Duration. (Ioc MAX
as per MAX Ratings)
Figure 6. Relative Luminous Intensity vs. Angular Displacement.
6-155
40
50
60
Figure 4. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
z
~ -2.0
100
.-
IpEAK - PEAK CURRENT - rnA
3.0
10
"
I
15
IF - FORWARD CURRENT - rnA
VF - PEAK FORWARD VOLTAGE - V
/
8
./
10
"
2
/
~g 0.50
10
0
0.75
4
Family of Yellow HLMP-0463/HLMP-0464
60
1I
~
~
a
II I
I
50
~
l-
30
I
~
~
20
•
o
1.50
~!il
1.25
~
~
21
~
1.00
:;
w~
>« 0.75
1. 0
1.5
2.0
3.0
2.5
j
~
1i0
0.50
g
•
6
1.0
1//1
1
I
I
V
I
'0102030405060
3.4
VF - PEAK FORWARD VOLTAGE - V
IpEAK - PEAK CURRENT - rnA
IF - FORWARD CURRENT - rnA
Figure 7. Forward Current vs.
Forward Voltage.
.....
Q
>i
-0
~~
,~
4
Q
~~
~~
i I
v
10
;;;1=>~
U
1.75
~~
I
I
;
~ct
I
~.-:wb
2.00
~
40
o
1.6
2.25
Figure 8. Relative Luminous Intensity
vs. Forward Current.
Figure 9. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
I-
Z
«
«
=>
u
u 1.72
o
100
tp - PULse DURATION - 1-1$
Figure 11. Relallve Luminous Intensity vs. Angular Displacement.
Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (Ioc MAX
as per MAX Ratings)
Family of Green HLMP-0563/HLMP-0564
1 .•
2.00
I
I
0
•
0
tt±
~
ffi~
~~
1.7
,
00
zw 1.00
~~ 0.7,
w~
>«
II
iLl
~~
0.5 0
...
0.2
'/
0.0 0
VF - PEAK fORWARD VOLTAGE - V
V
V
./
'/
./'
~ ~
~
~
W
W
0
W
::
~
~«15~
g
1.'
...""
1.2
~
..
/
1.'
//
..
I
10
15
20
25
30
35
IF - FORWARD CURRENT - rnA
Figure 12. Forward Current vs.
Forward Voltage.
g
ffi 1
>
1.50
~< 1.2
J. -..·h
,
Figure 13. Relative Luminous Intensity
vs. Forward Current.
'·0
10
20
30
l
~i
.;ll
-+--+-j-j-H.60
1.3
1.2
1.1
1.0
1
10
100
1.000
10,000
tp - PULSE DURATION - 1-11
Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (Ioc MAX
as per MAX Ratings)
80'1--+---+---+---1
Figure 16. Relative Luminous Intensity vs. Angular Displacement.
6-156
50
Figure 14. Relative Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Current.
-+--+--+-j"'--H·75
I
40
IpEAK - PEAK CURRENT - rnA
60
Contrast Enhancement
The objective of contrast enhancement is to optimize
display readability. Adequate contrast enhancement can be
achieved in indoor applications through luminous contrast
techniques. Luminous contrast is the observed brightness
of the illuminated indicator compared to the brightness of
the surround. Appropriate wavelength filters maximize
luminous contrast by reducing the amount of light reflected
from the area around the indicator while transmitting most
of the light emitted by the indicator. These filters are
described further in Application Note 1015.
6-157
.
"
l~
•
Solid State Displays
•
•
•
•
•
•
Smart Alphanumeric Displays
Alphanumeric Displays
AIGaAs Seven Segment Displays
Seven Segment Displays
Hexadecimal and Dot Matrix Displays
Hermetic Displays
Solid State Displays
Hewlett-Packard's line of Solid State Displays answers
all the needs of the designer. From smart alphanumeric
displays to low cost numeric displays in sizes from 3
mm (0.15 in.) to 20 mm (0.8 in.) and colors of red, high
efficiency red, yellow, and high performance green, the
selection is complete.
Hewlett-Packard's 5 x 7 dot matrix alphanumeric
display line comes in 3 character sizes: 3.8 mm (0.15
in.), 5 mm (0.2 in.), and 6.9 mm (0.27 in.). In addition,
there are now 4 colors available for each size: standard
red, yellow, high efficiency red, and green. This wide
selection of package sizes and colors makes these
products ideal for a variety of applications in avionics,
industrial control, and instrumentation.
The newest addition to HP's alphanumeric display line,
the intelligent eight character, 5.0 mm (0.2 in.)
alphanumeric display in the very flexible 5 x 7 dot
matrix font. Product features include, a low power onboard CMOS IC, ASCII decoder, the complete 128
ASCII character set, and the LED drivers. In addition,
an on-board RAM offers the designer the ability to
store up to 16 user-definable characters, such as foreign
characters, special symbols and logos. These features
make it ideal for avionics, medical, telecommunications,
analytical equipment, computer products, office and
industrial equipment applications.
Another addition to HP's alphanumeric display line is
the large (0.68 inch and 1.04 inch) 5 x 7 dot matrix
alphanumeric display family. This family is offered in
standard red (both sizes), high efficiency red (1.04 inch
only) and high performance green (both sizes). These
displays have excellent viewability; the 1.04 inch
character font can be read at up to 18 meters (12 meters
for the 0.68 inch display). Applicationis for these large 5
x 7 displays include industrial machinery and process
controllers, weighing scales, computer tape drive
systems and transportation.
Hewlett-Packard's line of numeric seven segment
displays is one of the broadest. From low cost, standard
red displays to high light ambient displays producing
7.5 mcd/segment, HP's 0.3 in., 0.43 in., 0.56 in., and
0.8 in. characters can provide a solution to every display
need. HP's product offering include 0.56 in. dual digit
displays and a line fo small package, bright 0.3 in.
displays - the 0.3 in. Microbright. HP's borad line of
numeric seven segment displays are ideal for electronic
instrumentation, industrial, weighing scales, point-ofsale terminals and appliance applications. The newest
addition to HP's line of numeric seven segment displays
is the Double Heterojunction AlGaAs red low current
display family. This family is offered in the 0.3 min.
Mini, 0.43 in., 0.56 in., and 0.8 in. package sizes. These
AlGaAs numeric displays are very bright at low drive
currents - typical intensity of 650 mcd/segment at I
rnA/segment drive. These displays are ideal for battery
operated and other low power applications.
7-2
High Reliability Displays
In addition to Hewlett-Packard commercial solid state
displays, Hewlett-Packard offers a complete line of
hermetic packages for high reliability military and
aerospace applications. These package consists of
numeric and hexadecimal displays, 5 x 7 dot matrix
alphanumeric displays with extended temperature
ranges, and fully intelligent monolithic 16 segment
displays with extended temperature ranges and on
board CMOS IC's. Similar to the commercial display
product selection, the high reliability display products
are available in a variety of character sizes and all four
colors: standard red, high efficiency red, yellow, and
high performance green.
Integrated numeric and hexadecimal displays (with onboard IC's) solve the designer's decoding/driving
problems. They are available in plastic packages for
. general purpose usage, ceramic/glass packages for
industrial applications, and hermetic packages for high
reliability applications. This family of displays has been
designed for ease of use in a wide range of
environments.
Hewlett-Packard offers three different testing programs
for the high reliability conscious display customer.
These programs include DESG Qualification on the
MIL-D-87157 for the hermetically sealed 4N51-4N54
hexadecimal and numeric displays; and two levels of inhouse high reliability testing programs that conform or
a modification to MIL-D-87157 Quality Level A Test
Tables for all other high reliability display products.
Please refer to the individual data sheets for a complete
description of each display's testing program.
7-3
Alphanumeric LED Displays
Page
Device
l
~
i-+-1
L ___ .J
~_=_J
,, ,
,
'
,
PIN
Description
HDSP-2111 5.0 mm (0.2 in.)
5 x 7 Eight Character
HDSP-2112 Intelligent Display
Operating Temperature
Range: -20°C to +70°C
Yellow
HPDL-1414 2.85 mm (.112")
Four Character
Monolithic Smart
Alphanumeric Display
Operating Temperature
Range: -40°C to +85°C
HPDL-2416 4.1 mm (.16") Four
Character Monolithic
Smart Alphanumeric
Display
Operating Temperature
Range: -40°C to +85°C
HDSP-2000 3.8 mm (.15") 5 x 7 Four
Character Alphanumeric
HDSP-2001 12 Pin Ceramic 7.62 mm
(.3") DIP with untinted
HDSP-2002 glass lens.
Operating Temperature
HDSP-2003 Range: -20°C to +85°C
HDSP-2300 5.0 mm (.20") 5 x 7
Character Alphanumeric
HDSP-2301 12 Pin Ceramic 6.35 mm
(.25") DIP with untinted
HDSP-2302 glass lens
Operating Temperature
HDSP-2303 Range: -20"C to +85°C
Application
Color
No.
•
•
•
•
•
•
•
Avionics
Medical
Telecommunications
Analytical Equipment
Computer Products
Office Equipment
Industrial Equipment
7-19
Red
•
•
•
•
Portable Data Entry Devices
Industrial Instrumentation
Computer Peripherals
Telecommunication
Equipment
7-30
Red
•
•
•
•
•
Portable Data Entry Devices
Medical Equipment
Industrial Instrumentation
Computer Peripherals
Telecommunication
Equipment
7-38
Red
• Computer Terminals
• Business Machines
• Portable, Hand-held or
mobile.data entry, readout or communications
High Efficiency Red
Yellow
High Efficiency Red
High Performance
Green
Red
Yellow
High Efficiency Red
High Performance Green
7-46
For further information see
Application Note 1016.
• Avionics
• Grounds Support, Cockpit,
Shipboard' Systems
• Medical Equipment
• Industrial and Process
control
• Computer Peripherals
and Terminals
7-50
For further information see
Application Note 1016.
HDSP-2490 6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
HDSP-2491 28Pin Ceramic 15.24 mm
(.6") DIP with untinted
HDSP-2492 glass lens
D~
Red
Yellow
High Efficiency Red
HDSP-2493 Operating Temperature
Range: -20°C to +85°C
High Performance Green
5082-7100
Red Untinted Glass Lens
5082-7101
5082-7102
6.9 mm (.27") 5 x 7 Three
Character Alphanumeric
22 Pin Ceramic 15.2 mm
(.6") DIP
6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
28 Pin Ceramic 15.2 mm
(.6") DIP
6.9 mm (.27") 5 x 7 Five
Character Alphnumeric
36 Pin Ceramic
15.2 mm (.6") DIP
7-4
• High Brightness Ambient
Systems
• Industrial and Process Control
• Computer Peripherals
• Ground Support Systems
7-56
For further information see
Application Note 1016.
General Purpose Market
• Business Machines
• Calculators
• Solid State CRT
• Industrial Equipment
7-80
Alphanumeric LED Displays (cont.)
Device
Description
HDSP-6504 3.8 mm (.15") Sixteen
Segment Four Character
Alphanumeric 22 Pin
15.2 mm (.6") DIP
HDSP-6508 3.8 mm (.15") Sixteen
Segment Eight Character
Alphanumeric 26 Pin
15.2 mm (.6") DIP
HDSP-6300 3.56 mm (.14") Sixteen'
Segment Eight Character
Alphanumeric 26 Pin
15.2 mm (.6") DIP
Color
Red
•
•
•
•
m-
n
,
,,,
,
g
g
g
g
g
g
·· ··•
Application
Computer Terminals
Hand Held Instruments
In-Plant Control Equipment
Diagnostic Equipment
• Computer Peripherals and
Terminals
• Computer Base Emergency
Mobile Units
. • Automotive Instrument
Panels
• Desk Top Calculators
• Hand-Held Instruments·
'---
A
Page
No.
7-84
7-90
For further information ask for
Application Note 931.
Alphanumeric Display Systems
Device
PIN
rI
~I
f
~
ug
".
$"
oi:,
[]j;
[]lj
r1
[]l':
ljil
DO
o
0
fh.lj)<:>~
,
0"
..
Description
Color
HDSP-6621 Single Line 16
Character Display
Board Utilizing
the HPDL-1414
114.30 mm (4.50") Lx
30.48 mm (1.20") H x
8.12 mm (0.32") D
HDSP-6624 Single Line 32
Character Display
Board Utilizing
the HPDL-2416
223.52 mm (8.80") L x
58.42 mm (2.30") H x
15.92 mm (0.62") D
HDSP-2416 Single-Line 16 Character
Display Panel Utilizing
the HDSP-2000
HDSP-2424 Single-Line 24 Character
Display Panel Utilizing
the HDSP-2000
HDSP-2432 Single-Line 32 Character
Display Panel Utilizing
the HDSP-2000
HDSP-2440 Single-Line 40 Character
Display Panel Utilizing
the HDSP-2000 Display
HDSP-2470 HDSP-2000 Display Interface Incorporating a 64
Character ASCII Decoder
HDSP-2471 HDSP-2000 Display Interface Incorporating a 128
Character ASCII Decoder
HDSP-2472 HDSP-2000 Display Interface without ASCII Decoder. Instead, a 24 Pin
Socket is Provid ed to
Accept a Custom 128
Character Set from a
User Programmed 1K x
8 PROM
162.56 mm (6.4") Lx
58.42 mm (2.3") H x
7.11 mm (0.28") D
m.80 mm (7.0") L x
58.42 mm (2.3") H x
7.11 mm (.28") D
171.22 mm (6.74") Lx
58.42 mm (2.3") H x
16.51 mm (.65") D
7-5
Appllcallon
•
•
•
•
Computer Peripherals
Telecommunications
Industrial Equipment
Instruments
• Data Entry Terminals
• Instrumentation
Page
No.
7-60
7-68
Large Alphanumeric Displays
PIN
Device
HDSP-4701 Red. Common Row Anode
I(5"6'Qc5O
00000
00000
00000
00000
00000
.QQQQQ
I
Page
No.
17.3 mm (0.6S")
Dual-in-Line
0.70" H x 0.50"W
x 0.26" D
770 !lcd/dot
(100 mA Peak. 1/5
Duty Factor)
7-95
26.5 mm (1.04")
Dual-in-Line
1.10" H x 0.79"W
x 0.25" D
S60 !lcd/dot
(100 mA Peak, 1/5
Duty Factor)
HDSP-4703 Red, Common Row
Cathode
HDSP-4401 Red, Common Row Anode
00000
00000
00000
00000
00000
00000
00000
Typical Iv @ 50 mA
Peak. 1/5 Duty Factor
Package
Description
HDSP-4403 Red, Common Row
Cathode
HDSP-4501 High Efficiency Red,
Common Row Anode
3500 !lcd / dot
HDSP-4503 High Efficiency Red,
Common Row Cathode
7-6
Double Heterojunction AIGaAs Red Low Current Seven Segment LED Displays
Package
Device
.:B:. §]
~
Description
Typical Iv @ 1 rnA DC
Page
No.
7-103
HDSP-A101
HDSP-A103
HDSP-A107
HDSP-A10S
AIGaAs
AIGaAs
AIGaAs
AIGaAs
Red,
Red,
Red,
Red,
Common Anode, RHDP
Common Cathode, RHDP
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
600 !'cd/seg.
HDSP-E100
HDSP-E101
HDSP-E103
HDSP-E106
AIGaAs
AlGaAs
AIGaAs
AIGaAs
Red,
Red,
Red,
Red,
Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Overflow ±1
650 !,cd / seg.
HDSP-H101
HDSP-H103
HDSP-H107
HDSP-H10S
AlGaAs
AIGaAs
AIGaAs
AIGaAs
Red,
Red,
Red,
Red,
Common Anode, RHDP
Common Cathode, RHDP
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
700 !,cd/seg.
HDSP-N100
HDSP-N101
HDSP-N103
HDSP-N105
HDSP-N106
AlGaAs
AIGaAs
AIGaAs
AIGaAs
AIGaAs
Red,
Red,
Red,
Red,
Red,
Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Common Cathode, LHDP
Universal Overflow ±1
590 !'cd/seg.
:=0 :
,
"
Z62 mm (0.3")
Mini Dual-in-Line
0.5"H x 0.3"W x 0.24"D
.
. =ff.
: 0=: :ao:
:U=O:?
,
B
•
~
0
0
10.92 mm (0.43")
Dual-in-line
0.75"H x 0.5"W x 0.25"D
=0
bQ9 ~
1BJ
++.?
14.2 mm (0.56")
Dual-in-Line (Single Digit)
0.6TH x 0.49"W x 0.31 "D
~ilu~
=.
lLD~
o
+
0
+
+
+
O~
! D !
FOil!
+
+
,+
o~
20 mm (O.S")
Dual-in-Line
1.09"H x 0.7S"W x 0.33"D
7-7
High Efficiency Red Low Current Seven Segment LED Displays
Device,
Package
:.~
.:8.:. .:=0 .:
§J
Description
HDSP-7511
HDSP-7513
HDSP-7517
HDSP-7518
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
Common Anode, RHDP
Common Cathode, RHDP .'
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
HDSP-3350
HDSP-3351
HDSP-3353
HDSP-3356
High Efficiency Red, Common Anode, LHDP
High Efficiency Red, Common Anode, RHDP
High Efficiency Red, Common Cathode, RHDP
High Efficiency Red, Universal Polarity and
Overflow Indicator, RHDP
Typical Iv @ 2 mA DC
Page
No.
270 /lcd / seg.
7-109
0
7.62 mm (0.3")
Microbright
Dual-in-Line
0.5"H x 0.3"W x 0.24"0
, 'B
.• U.=d·
'.
O'.
:U=O~ :~ O~.
~
D
}OO /lcdl seg.
,
~.
10.92 mm (0.43")
Dual-in-line
0.75"H x 0.5"W x 0.25"0
lS ~
[J._ =0
••• ?
HDSP-5551
HDSp:5553
HDSP-5557
HDSP-5558
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
Commoh Anode, RHDP
Common Cathode, RHDP
Overflow ±1 Common Anode
Overflow ±fCommon Cathode
14.2 mm (0.56")
Dual-in-Line (Single Digit)
0.67"H x 0.49"W x 0.31"0
7-8
370/lcd/seg.
Red, High Efficiency Red, Yellow, and High Performance Green Seven
Segment LED Displays
Package
. .
r--
-
,
;=0, :
.:8:
"
+
'---
,C{?O'
,
+
-
~
,
0'
•
+
7.62 mm (.3")
Microbright
Dual-in-Line
.5" H x .3" W x .24" D
.-,
-:---:,
: 0:::0;
/,0=° 0
:cr 0:
,
'----
,a
,
-
Description
Device
o
0'
~
,
7.62 mm (.3")
Dual-in-line
.75" H x .4" W x .1B" D
Typical Iv @ 20 rnA DC
HDSP-7301
HDSP-7302
HDSP-7303
HDSP-7304
HDSP-7307
HDSP-730B
HDSP-7311
HDSP-7313
HDSP-7317
HDSP-731B
Red, Common Anode, RHDP
Red, Common Anode, RHDP, Colon
Red, Common Cathode, RHDP
Red, Common Cathode, RHDP, Colon
Red, Overflow, ±1, Common Anode, RHDP
Red, Overflow, ±1, Common Cathode, RHDP
Bright Red, Common Anode, RHDP
Bright Red, Common Cathode, RHDP
Bright Red, Overflow, ±1, Common Anode
Bright Red, Overflow, ±1, Common Cathode
1100/lcd/seg
HDSP-7401
HDSP-7402
HDSP-7403
HDSP-7404
HDSP-7407
HDSP-740B
Yellow,
Yellow,
Yellow,
Yellow,
Yellow,
Yellow,
2750/lcd/seg
HDSP-7501
HDSP-7502
HDSP-7503
HDSP-7504
HDSP-7507
HDSP-750B
High
High
High
High
High
High
Efficiency
Efficiency
Efficiency
Efficiency
Efficiency
Efficiency
HDSP-7B01
HDSP-7B02
HDSP-7B03
HDSP-7B04
HDSP-7B07
HDSP-7BOB
High
High
High
High
High
High
Performance Green,
Performance Green,
Performance Green,
Performance Green,
Performance Green,
Performance Green,
50B2-7730
50B2-7731
50B2-7736
50B2-7740
Red,
Red,
Red,
Red,
Common Anode, LHDP
Common Anode, RHDP
Universal Polarity and Overflow Indicator, RHDP
Common Cathode, RHDP
50B2-7610
50B2-7611
50B2-7613
50B2-7616
High Efficiency
High Efficiency
High Efficiency
High Efficiency
RHDP
50B2-7620
50B2-7621
50B2-7623
50B2-7626
Yellow,
Yellow,
Yellow,
Yellow,
HDSP-3600
HDSP-3601
HDSP-3603
HDSP-3606
High
High
High
High
Common Anode, RHDP
Common Anode, RHDP, Colon
Common Cathode, RHDP
Common Cathode, RHDP, Colon
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode
Red,
Red,
Red,
Red,
Red,
Red,
Red,
Red,
Red,
Red,
Common Anode, RHDP
Common Anode, RHDP, Colon
Common Cathode, RHDP
Common Cathode, RHDP, Colon
Overflow, ±1, Common Anode
Overflow, ±1, Common Cathode
Common Anode, RHDP
Common Anode, RHDP, Colon
Common Cathode, RHDP
Common Cathode, RHDP, Colon
Overflow, ±1, Common Anode
Overflow, ±1, .Common Cathode
Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity Overflow Indicator,
Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity and Overflow Indicator, RHDP
Performance Green, Common Anode, LHDP
Performance Green, Common Anode, RHDP
Performance Green, Common Cathode, RHDP
Performance Green, Universal Overflow Indicator, RHDP
7-9
Page
No.
7-115
1355 /lcd/seg
5400 /lcd / seg
3700 /lcd /seg
770/lcd/seg
4400 /lcd /seg
3400 /lcd /seg
3950/lcd/seg
7-121
Red, High Efficiency Red, Yellow, and High Performance Green Seven
Segment LED Displays (continued)
Package
+
+
,
,
: a u:
:O=~ '=0'
:0=0: a ,
+
to,O
~
~
10.92 mm (.43")
Dual·in·line
.75" H x .5" W x .25" 0
+gj
f];qQ
1"-1'+++
90
=0
+"","+0
14.2 mm (.56")
Dual·in·Line (Single Digit)
.67" H x .49" W x .31" D
Device
5082·7750
5082·7751
5082·7756
5082·7760
5082·7650
5082·7651
5082·7653
5082·7656
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
Indicator, RHDP
5082·7660
5082·7661
5082·7663
5082·7666
Yellow,
Yellow,
Yellow,
Yellow,
HDSp·4600
HDSp·4601
HDSp·4603
HDSP·4606
HDSp·5301
HDSp·5303
HDSp·5307
HDSp·5308
HDSp·5321
HDSp·5323
High Performance Green, Common Anode, LHDP
High Performance Green, Common Anode, RHDP
High Performance Green, Common Cathode, RHDP
High Performance' Green, Universal Overflow Indicator, RHDP
Red, Common Anode, RHDP
Red, Common Cathode, RHDP
Red ±1, Common Anode, RHDP
Red ±1, Common Cathode, RHDP
Red, Common Anode, Dual Digit, RHDP
Red, Common Cathode, Dual Digit, RHDP
HDSp·5501
HDSP·5503
HDSp·5507
HDSp·5508
HDSp·5521
HDSp·5523
High
High
High
High
High
High
HDSp·5601
HDSp·5603
HDSp·5607
High Performance Green, Common
High Performance Green, Common
High Performance Green, Common
Indicator, RHDP
High Performance Green, Common
Indicator, RHDP
High Performance Green, Common
High Performance Green, Common
RHDP
HDSp·5608
'SIj
~20;;0o
14.2 mm (.56")
Dual-in'Line (Dual Digit)
.67" H x 1.0" W x .31" 0
Red,
Red,
Red,
Red,
Description
Common Anode, LHDP
Common Anode, RHDP
Universal Polarity and Overflow Indicator, RHDP
Common Cathode, RHDP
HDSp·5621
HDSp·5623
HDSp·5701
HDSP·5703
HDSP·5707
HDSp·5708
HDSp·5721
HDSP·5723
Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity and Overflow
Common Anode,LHDP
Common Anode, RHDP
Common Cathode, RHDP
Universal Polarity and Overflow Indicator, RHDP
Efficiency Red, Common Anode, RHDP
Efficiency Red, Common Cathode, RHDP
Efficiency Red ±1, Common Anode, RHDP
Efficiency Red ±1, Common Cathode, RHDP
Efficiency Red, Common Anode, Dual Digit, RHDP
Efficiency Red, Common Cathode, Dual Digit, RHDP
Anode, RHDP
Cathode, RHDP
Anode Overflow
Page
No.
7·121
6100 !lcd/seg
4600 !lcd/seg
3850 !lcd /seg
1300 !lcd /seg
6300 !lcd/seg
5600 /.Lcd / seg
Cathode Overflow
Anode, Dual Digit, RHDP
Cathode, Dual Digit,
Yellow, Common Anode, RHDP
Yellow, Common Cathode, RHDP
Yellow ±1, Common Anode, RHDP
Yellow ±1, Common Cathode, RHDP
Yellow, Common Anode, Dual Digit, RHDP
Yellow, Common Cathode, Dual Digit, RHDP
7-10
Typical Iv @ 2D rnA DC
1100 !lcd /seg
4200 /.Lcd / seg
7·130
Red, High Efficiency Red, Yellow, and High Performance Green Seven
Segment LED Displays (continued)
Package
1B1D"
+
,
+
+0
0+
+
1-
Device
HDSP·3400
HDSp·3401
HDSp·3403
HDSp·3405
HDSP·3406
HDSP·3900
HDSp·3901
HDSp·3903
HDSp·3905
HDSp·3906
Descrlpllon
Red, Common Anode, LHDP
Red, Common Anode, RHDP
Red, Common Cathode, RHDP
Red, Common Cathode, LHDP
Red, Universal Polarity Overflow Indicator, RHDP
High Efficiency Red, Common Anode, LHDP
High Efficiency Red, Common Anode, RHDP
High Efficiency Red, Common Cathode, RHDP
High Efficiency Red, Common Cathode, LHDP
High Efficiency Red, Universal Polarity Overflow
Indicator, RHDP
HDSp·4200
HDSp·4201
HDSp·4203
HDSp·4205
HDSp·4206
Yellow,
Yellow,
Yellow,
Yellow,
Yellow,
HDSp·8600
HDSp·8601
HDSp·8603
HDSp·8605
HDSp·8606
High
High
High
High
High
1-
t Dm
.+
-+c==:=I
!+
D
il!
o·
20 mm (.8")
Dual·in·Line
1.09" H x .78" W x .33" D
Common Anode, LHDP
Common Anode, RHDP
Common Cathode, RHDP
Common Cathode, LHDP
Universal Polarity Overflow Indicator, RHDP
Performance
Performance
Performance
Performance
Performance
Green, Common Anode, LHDP
Green, Common Anode, RHDP
Green, Common Cathode,.RHDP
Green, Common Cathode, LHDP
Green, Universal Overflow Indicator, RHDP
Typical Iv @ 20 rnA DC
1200 !lcd/seg
Page
No.
7·138
4800 !lcd / seg
3400 !lcd/seg
3600 !lcd / seg
High Ambient Light, High Efficiency Red, Yellow, and High Performance
Green Seven Segment Displays
Package
Device
Descrlpllon
HDSp·3530
High Efficiency Red, Common Anode, LHDP
. . r:---:
· .
:0=0: :0 0:O'
.,,°=° · .
-----
HDSp·3531
High Efficiency Red, Common Anode, RHDP
HDSp·3533
High Efficiency Red, Common Cathode, RHDP
HDSP·3536
High Efficiency Red, Universal Polarity Overflow Indicator,
RHDP
HDSp·4030
Yellow, Common Anode, LHDP
7.62 mm (.3")
Dual·in·Line
.75" H x .4" W x .18" D
HDSp·4031
Yellow, Common Anode, RHDP
HDSp·4033
Yellow, Common Cathode, RHDP
HDSP·4036
Yellow, Universal Polarity Overflow Indicator, RHDP
HDSp·3600
High Performance Green, Common Anode, LHDP
HDSP·3601
High Performance Green, Common Anode, RHDP
HDSp·3603
High Performance Green, Common Cathode, RHDP
HDSp·3606
High Performance Green, Universal Overflow Indicator, RHDP
-
•a
0
+
o
~
7-11
Typical Iv @ 100 rnA Peak
1/5 Duty Factor
Page
No.
7100 !lcd/seg
7·145
4500!lcd/seg
7000 !lcd/seg
(90 mA Peak
1/3 Duty Factor)
7·121
High Ambient Light, High Efficiency Hed, Yellow, and High Performance
Green Seven Segment Displays (continued) '.
Package
+
+
: O:=d.
:0=0:·f
~
.. Device
,
+
: a
+c:::::I
+
D
+
0IF
0
+
+
10,92 mm (.43")
Dual-in-Line
.75" H x .5" W x .25" D
[Q 90
+"t'+++-
~qo'
14.2.mm (.56")
Dual-in-Line
.67" H x .49" W x .31" D
'8'
a-
+
+
+
+.
+
+'
+ ..
+
,,+
+
+
+
'b
..
d
a at!
: a ll:
+
+
+
!
-+=+
+
+
HDSP-3730
HDSP-3731
HDSP-3733
HDSP-3736
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
High Efficiency Red,
Common Anode, LHDP
Common Anoae, RHDP
Common Cathode, RHDP
Universal Poliuity Overflow Indicator, RHDP
HDSP-4130
HDSP-4131
HDSP-4133
HDSP-4136
Yellow, Common Anode, LHDP
Yellow, Common Anode, RHDP
Yellow, Common Cathode, RHDP
Yellow, Universal Polarity ,Ove.~low Ind.icalo(;' RHDP
HDSP-4600
HDSP-4601
HDSP-4603
HDSP-4606
High
High
High
High
HDSP-5531
HDSP-5533
HDSP-5537
HDSP-5538
Typical Iv @ 100 mA Peak
115 Duty Factor
Page
No•
10000/lcd/seg
7-145
0
+
+
. DescripUon
+
0+
20 mm (.8")
Dual-in-Line
1.09" H x .78" W x ,33" D
5000 /lcd / seg
Performance Green, Common Anode, LHDP
Performance Green, Common Anode, RHDP'
Performance Green, Common Cathode,.RHDP
Performance Green, Universal Overflow Indicator, RHDP
6800/lcd/seg
(90 rnA Peak
1/3 Duty Factor)
7-121
High Efficiency Red, Common Anode, RHDP
High Efficiency Red, Common Cathode; RHDP
High Efficiency Red ±1, Common Anode
High Efficiency Red±l, Common Cathode
6000 /lcd/s~g
7-145
HDSP-5731
HDSP-5733
HDSP-5737
HDSP-5738
Yellow~:Common Anode, RHDP .
Yellow, Common Cathode, RHDP
Yellow, ±l,Common Anode
Yellow, ±1; Common Cathode
5500 /lcd/seg
HDSP-5601
HDSP-5603
HDSP-5607
HDSP-5608
HDSP-3900
HDSP-3901
HDSP-3903
HDSP-3005
HDSP-3006
High Performance Green, Common
High Performance Green, Common
High Performance Greell, Common
High Performance Green, Common
HDSP-4200
HDSP-4201
HDSP-4203
HDSp·4205
HDSP-4206
Yellow, Common Anode, LHDP
Yellow, Common Anode, RHDP
Yellow, Common Cathode, RHDP
"
Yellow, Common Cathode, LHDP
Yellow, Universal Polarity Overflow Indicator, RHDP
HDSP'-s600
HDSP~8601
HDSP-8603
HDSP-8605
HDSP-8606
High Performance Green, Common Anode, LHDP
High Performance Green, Cqmmon Aryode, RHDP
High Performance Green, Common Cathode, RHDP
High Performance Green, Common Cathode, LHDP
High Performance Green, Universal Overflow Indicator, RHDP
.'
Anode, RHDP
Cathode, RHDP
Anode Overflow Indicator
Cathode Overflow Indicator
High EffitiencyRed, Common Anode, LHDP
High Efficiency Red, Common Anode, RHDP
High Efficiency Red, Common Cathode, RHDP
High Efficiency Red, Common Cathode, LHDP
High Efficiency Red, Universal Overflow Indicator, RHDP
9400/lcd/seg
(90 rnA Peak
1/3 Duty Factor)
7-130
'. 7000 /lcd j seg
7-145
7000 /lcd/seg
5800 /lcd / seg
(90 rnA Peak
1/3 Duty Factor)
Solid State Display Intensity and Color Selections
:
:
Option
Option SOl
Option S02.
Option S20
DlI8cripUon
Intensity and Color Selected Displays.
7-12
Page
No.
7-153
Hexadecimal and Dot Matrix Displays
Description
Device
rc,,-,,-rc
·...·
···...
·· .
II I.
L.JL.JL.JL.J
rlrlrlrl
·...···
··...
. ·
I
•••
L.JL.JL.JL.J
(B)
rLJ"""lJ""1.J""
LJ
·....
··
,
..:,.. ,,,
·.
I-JL.JI-JL.J
(C)
(D)
. 7.4 mm (.29")
4 x 7 Single
Digit
1m
r.,
·...
···...··· ·.·, ...···
.,
· ..· , ·...·
r1rlr1"
,-, r l r l
I I ••
.,
L.JL.JL.JL.J
L.JL.JL.JL.J
(A)
(B)
rlrLI"Lf""l
rLJ"""lJ""1.J""
··, ...···
.1
· ••·
II
II
Numeric RHDP
Built-in Decoder/Driver/Memory
5082-7302
(B)
Numeric LHDP
Built-in Decoder /Driver /Memory
5082-7340
(C)
Hexadecimal
Built-in Decoder /Driver /Memory
5082-7304
Over Range ±1
8 Pin Epoxy
15.2 mm (.6") DIP
'
(A)
·,·....
5082-7300
(A)
Package
,
, ,
:
,
.. .. ··
· ··.
L.JL.JLJLJ
~~~~
(C)
(0)
1m
7.4 mm (.29")
4 x 7 Single Digit
Package:
8 Pin Glass Ceramic
15.2 mm (.6") DIP
Apptication
•
•
General Purpose Market
Test Equipment
.
Business Machines
Computer Peripherals
Avionics
Page
No.
7-154
·
·
(D)
5082-7356
(A)
Numeric RHDP
Buill-in Decoder /Driver /Memory
5082-7357
(B)
Numeric LHDP
Built-in Decoder /Driver /Memory
5082-7359
(C)
Hexadecimal
Built-in Decoder/Driver/Memory
5082-7358
Over Range ±1
8 Pin Glass Ceramic
15.2 mm (.6") DIP
·•
•
•
•
Medical Equipment
7-158
Industrial and Process
Control Equipment
Computers
Where Ceramic Package
IC's are required
High Reliability
Applications
(D)
HDSP-0760
(A)
Numeric RHDP
Built in Decoder/Driver/Memory'
HDSP-0761
(B)
Numeric LHDP
Built in Decoder !Driver /Memory
HDSP-0762
(C)
Hexadecimal
Built in Decoder /Driver /Memory
HDSP-0763
Over Range ± 1
High Efficiency Red
Low Power
•
·
·•
Military Equipment
Grou·nd Support
Equipment
Avionics
High Reliability
Applications
•
•
•
High Brightness
Ambient Systems
Cockpit, Shipboard
Equipment
High Reliability
Applications
•
•
•
Business Machines
Fire Control Systems
Military Equipment
High Reliability
Applications
(D)
HDSP-0770
(A)
Numeric RHDP
Built in Decoder /Driver /Memory
HDSP-0771
(B)
Numeric LHDP
Built in Decoder/Driver IMemory
High Efficiency Red
High Brightness
HDSP-0772 Hexadecimal
(C)
. Built in Decoder IDriver IMemory
HDSP-0763
Over Range ± 1
(D)
HDSP-0860
(A)
Numeric RHDP
Built in Decoder IDriver IMemory
HDSP-0861
(B)
Numeric LHDP
Built in Decoder IDriver IMemory
HDSP-0862
(C)
Hexadecimal
Built in Decoder IDriver IMemory
HDSP-0863
Over Range ± 1
·
Yellow
(D)
7-13
._._------_.. _ - - - -
7-163
Hexadecimal and Dot Matrix Displays (continued)
Description
Device and Package
(See previous page)
Color
HDSP-0960
(A)
Numeric RHDP
Builtin Decoder /Driver /Memory
HDSP-0961
(B)
Numeric LHDP
Built in Decoder /Driver /Memory
HDSP-0962
(C)
Hexadecimal
Built in Decoder/Driver /Memory
HDSP-0963
(D)
Over Range ± 1
Application
•
High Performance
Green
··
·
Business Machines
Fire Control Systems
Military Equipment
High Reliability
Applications
Page
No.
7-163
Monolithic Numeric Displays
w:m
~
A
ceo
II
I'
o
CXXDXXXD
Ql]2QQQ:i2QQ:QQQQQQQQ
.
~
~iU'!!lMl:2neef2~f!~m!e!l
I I~
I~
I~I ~
2.79 mm (.11") Red. 4 Digits
Centered D.P.
12 Pin Epoxy.
7.62 mm (.3") DIP
5082-7405
2.79 mm (.11") Red. 5 Digits.
Centered D.P.
14 Pin Epoxy.
7.62 mm (.3") DIP
5082·7414
2.79 mm (.11") Red. 4 Digits.
RHDP
12 Pin Epoxy.
7.62 mm (.3") DIP
5082-7415
2.79 mm (.11") Red. 5 Digits.
RHDP
14 Pin Epoxy.
7.62 mm (.3") DIP
5082-7432
2.79 mm (.11") Red. 2 Digits.
Right. RHDP
12 Pin Epoxy.
7.62 mm (.3") DIP
5082-7433
2.79 mm (.11") Red. 3 Digits.
RHDP
5082-7404
Page
No.
Application
Package
Description
Device
Small Display Market
Portable/Battery
Power Instruments
Portable Calculators
• Digital Counters
Digital Thermometers
• Digital Micrometers
Stopwatches
Cameras
Copiers
7-169
•
·
·
···
·
··
Digital Telephone
Peripherals
Data Entry Terminals
Taxi Meters
For further information ask for
Application Note 937.
5082-7441
2.67 mm (.105") Red. 9 Digits.
Mounted on P.C. Board
50.8 mm (2") PC Bd .•
17 Term. Edge Con.
5082-7446
2.92 mm (,115") Red. 16 Digits.
Mounted on P.C. Board
69.85 mm (2.750")
PC Bd .• 24 Term.
Edge Con.
5082-7295
4.45 mm (.175") Red. 15 Digits.
Mounted on P.C. Board. RHDP
91.2 mm (3.59") PC Bd ..
23 Term. Edge Con.
~m:l2!:m92
7-14
7-174
Hermetic Hexadecimal and Numeric Dot Matrix Displays
Device
[J
[J
..
(A)
..
J1.J1
(B)
[U~iJ
.'
.
JL
(e)
EJ
·· ..
·.
I •• '
•
(0)
\111
Description
4N51
Numeric RHDP
4N51TXV
Decoder /Driver / Memory
M87157/00101ACXll] TXV - Hi Rei Screened
(4N51TXVB)
(A)
8 Pin Hermetic Built-in
15.2 mm (.6") DIP
with gold plated
leads
Application
0
0
0
4N52
Numeric LHDP Built-in
4N52TXV
Decoder /Driver / Memory
M87157/00102ACXll] TXV - Hi Rei Screened
(4N52TXVB)
(B)
Military High Reliability
Applications
Avionics/Space Flight
Systems
Fire Control Systems
Page
No.
7-182
0
Ground Support.
Shipboard Equipment
0
Ground, Airborne, Shipboard 7-190
Equipment
Fire Contlol Systems
Space Flight Systems
Other High Reliability
Uses
4N54
Hexadecimal Built-in
4N54TXV
Decoder /Driver / Memory
M87157/00103ACX[I] TXV - Hi Rei Screened
(4N54TXVB)
(C)
4N53
4N53TXV
104ACX[I]
(4N53TXVB)
(D)
HDSP-0781
(A)
HDSP-0781
TXV
Character Plus/Minus Sign
TXV - Hi Rei Screened
Numeric RHDP. Built-in
Decoder / Driver Memory
TXV Hi Rei Scre~ned
TXVB Hi Rei Screened
to Level A MIL-D-87157
High Efficiency Red.
Low Power
0
0
0
HDSP-0781
TXVB
HDSP-0782
(B)
HDSP-0782
TXV
HDSP-0782
TXVB
HDSP-0783
(DI
74 mm (29")
4 x 7 Single Digit
Package
HDSP-0783
TXV
Package
8 Pin Glass Ceramic
15.2mm (6") DIP
HDSP-0783
TXVB
Tru)y Hermetic
HDSP-0784
(CI
HDSP-0784
TXV
Numeric LHDP, Built-in
Decoder/Driver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Overrange _c 1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Hexadecimal, Built-in
Decoder /Driver Memo ry
TXV HI Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
HDSP-0784
TXVB
HDSP-0791
(AI
HDSP-0791
TXV
Numeric RHDP, Built-in
Decoder !Driver Memory
TXV Hi Rei Screened
TXVB HI Rei Screened
to Level A MIL-D-87157
High Efficiency Red.
High Brightness
0
0
0
HDSP-0791
TXVB
HDSP-0792
(BI
HDSP-0792
TXV
0
Numeric LHDP, Built-in
Decoder IDriver Memory
TXV HI Rei Screened
TXVB HI Rei Screened
to Level A MIL-D-87157
HDSP-0792
TXVB
[1] Military Approved and Qualified for High Reliability ApplicatIOns,
7-15
Ground, Airborne. Shipboard
Equipment
Fire Control Systems
Spate Flight Systems
Other High Reliability
Uses
Hermetic Hexadecimal and Numeric Dot Matrix Displays (continued)
Device
Color
Descriplion
HDSP-0783
. (01
HDSP-0783
TXV
(See previous pagel
Overrange ± 1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87l57
High Elficiency Red.
High
Brightness
Applicalion
0
0
0
0
HDSP-0783
TXVB
HDSP-0794
(CI
HDSP-0794
TXV
HDSP-0794
TXVB
HDSP-088l
(A)
HDSP-OBBl
TXV
HDSP-OB8l
TXVB
HDSP-OB82
(B)
.
HDSP-0882
TXV
HDSP-0882
TXVB
HDSP-0883
(D)
HDSP-0883
TXV
Hexadecimal. Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87l57
Numeric RHDP. Built-In
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Yellow
Numeric LHDP. Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87l57
Overrange .: 1
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87l57
HDSP-0883
TXVB
HDSP-0884
(C)
HDSP-0884
TXV
HDSP-0884
TXVB
(See previous page)
HDSP-098l
(A)
HDSP-0981
TXV
Hexadecimal. Built-in
Decoder IDriver Memo ry
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87l57
Numeric RHDP, Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
High
Performance
Green
HDSP-0981
TXVB
HDSP-0982
(B)
HDSP-0982
TXV
Numeric LHDP, Built-in
Decoder IDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
HDSP-0982
TXVB
HDSP-0983
(C)
HDSP-0983
TXV
Overrange ±l
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87l57
HDSP-0983
TXVB
7-16
Page
No.
Ground. Airborne. Shipboard 7-190
Equipment
Fire Control Systems
Space Flight Systems
Other High Reliability
Uses
-----------------
-----------
----------- -
Hermetic Hexadecimal and Numeric Dot Matrix Displays (continued)
Color
Description
Device
HDSP-0984
(D)
(See previous pagel
HDSP-0984
TXV
Hexadecimal, Built-in
DecoderlDriver Memory
TXV Hi Rei Screened
TXVB Hi Rei Screened
to Level A MIL-D-87157
Application
·
··
·
High
Performance
Green
HDSP-D984
TXVB
Page
No_
Ground, Airborne, Shipboard 7-190
Equipment
Fire Control Systems
Space Flight Systems
OthlH High Reliability
Uses
Hermetic Alphanumeric Displays
Description
Device
m~
~
a" ___ ;~
;f~ ~~];
a:-·--"'l~
9.:" ___ Jo
~
J
Color
HMDL-2416 4.1 mm (0.16") Four
Character Monolithic
HMDL-2416 Smart Alphanumeric
Display
TXV
HMDL-2416 Operating Temperature
TXVB
Range: -55°C to lDDoC '
Red
HDSP-2351
Yeliow
HDSP-2351
TXV
HDSP-2351
TXVB
4.87 mm (0.19") 5 x 7 Four
Character Alphanumeric
Sunlight Viewable
Display
Operating Temperature Range:
-55°C to 100°C
Application
•
•
·
Military Equipment
High Reliability Applications
Military Telecommunications
Page
No_
7-204
• Military Avionics
• Military Cockpit
• Military Ground Support
Systems
7-214
Extended temperature
applications requiring
high reliability,
110 Terminals
Avionics
7-198
High Efficiency Red
HDSP-2352
HDSP-2352
TXV
HDSP-2352
TXVB
HDSP-2353
High Performance
Green
HDSP-2353
TXV
HDSP-2353
T~VB
D~
.. - - -
HDSP-2Dl0
~
I.
. •
i.
,
,k
~--:.....,
HDSP-2010
TXV
HDSP-2010
TXVB
3.7 mm (.15") 5 x 7 Four
Character Alphanumeric
Operating Temperature
Range: -40°C to +85°C
TXV Hi Rei Screened
TXVB Hi Rei Screened to
Level A MIL-D-87157
7-17
Red, Red Glass
Contrast Filter
~;
·•
For further information see
Application Note 1016.
-----
Hermetic Alphanumeric Displays (continued)
Description
Device
HDSP-2310
~L... J
to_Ai
:" ___ J
[~~J
HDSP-2310
TXV
Application
Color
5,0 mm (.20") 5 x 7 Four
Character Alphanumeric
HDSP-2310
TXVB
12 Pin Ceramic 6.35 mm
(.25") DIP with untinted
glass lens
HDSP-2311
Operating Temperature
Range: -55' Cto +85' C
HDSP-2311
TXV
True Hermetic Seal'
HDSP-2311
TXVB
TXVB - Hi Rei Screened
to Level A MIL-D-87157
··•
Standard Red
Military Equipment
Avionics
High Rei Industrial
Equipment
Page
No,
7-228
Yellow
TXV - Hi Rei Screened
HDSP-2312
High Eff. Red
HDSP-2312
TXV
HDSP-2312
TXVB
High Performance
Green
HDSP-2313
HDSP-2313
TXV
HDSP-2313
TXVB
HDSP-2450
r
.
c
I
I
?'
.
"; I
,
I
~
=
'?
"
I
I
~
~
-
i~
J! --,.,
HDSP-2450
TXV
HDSP-2450
TXVB
Operating Temperature
Range: -55'C to +85'C
6.9 mm (.27") 5 x 7 Four
Character Alphanumeric
28 Pin Ceramic 15.24 mm
(.6") DIP
Red
0
•
•
True Hermetic Seal
HDSP-2451
HDSP-2451
TXV
Yellow
TXV - Hi Rei Screened
TXVB - Hi Rei Screened
to Level A MIL-D-87157
HDSP-2451
TXVB
HDSP-2452
High Efficiency Red
HDSP-2452
TXV
HDSP-2452
TXVB
High Performance
Green
HDSP-2453
HDSP-2453
TXV
HDSP:2453
TXVB
7-18
·
Military Equipment
High Reliability
Applications
Avionics
Ground Support, Cockpit. Shipboard Systems
7-235
r/iO'l
a!1!II
EIGHT CHARACTER 5.0 mm (0.2 INCH)
SMART 5 X 7 ALPHANUMERIC DISPLAYS
HEWLETT
PACKARO
YELLOW
HIGH EFFICIENCY RED
HDSP-2111
HDSP-2112
Features
• SMART ALPHANUMERIC DISPLAY
On-Board CMOS IC
Built-in RAM
ASCII Decoder
LED Drive Circuitry
• 128 ASCII CHARACTER SET
• 16 USER DEFINABLE CHARACTERS
• PROGRAMMABLE FEATURES
Individual Flashing Character
Full Display Blinking
Multi-Level Dimming and Blanking
Self Test
Clear Function
• READ/WRITE CAPABILITY
Typical Applications
• FULL TTL COMPATIBILITY
• COMPUTER PERIPHERALS
o
AVIONICS
• INDUSTRIAL INSTRUMENTATION
• SINGLE 5 VOLT SUPPLY
• MEDICAL EQUIPMENT
• EXCELLENT ESD PROTECTION
• PORTABLE DATA ENTRY DEVICES
• TELECOMMUNICATIONS
• WAVE SOLDERABLE
• TEST EQUIPMENT
• END STACKABLE
Absolute Maximum Ratings
Description
The HDSP-2111 (yellow) and HDSP-2112 (high efficiency
red) are eight-digit, 5 x 7 dot matrix, alphanumeric displays.
The 5.0 mm (0.2 inch) high characters are packaged in a
standard 15.24 mm (0.6 inch) 28 pin DIP. The on-board
CMOS IC has the ability to decode 128 ASCII characters,
which are permanently stored in ROM. In addition, 16
programmable symbols may be stored in on-board RAM.
Seven brightness levels provide versatility in adjusting the
display intensity and power consumption. The HDSP-211X
is designed for standard microprocessor interface techniques. The display and special features are accessed
through a bidirectional eight-bit data bus. These features
make the HDSP-211X ideally suited for applications where
a low cost, low power alphanumeric display is required.
Supply Voltage, Vcc to Ground!1] .....•.... -0.3 to 7.0 V
Operating Voltage, Vcc to Ground!2] ............• 5.5 V
Input Voltage, Any Pin to Ground .... -0.3 to Vcc + 0.3 V
Free Air Operating Temperature
Range, TA . . . . . . . . . . . . . . . . . . . . . . . -20° C to +70° C
Relative Humidity (non-condensing) ...•.•••.••..• 85%
Storage Temperature, Ts ............. -40°C to +85°C
Maximum Solder Temperature 1.59 mm (0.063 in.)
below Seating Plane, t < 5 sec ....•.....•...• 260°C
7-19
._-_.... _ . _ - - - -
... -- . . - ..
--~
..
--~
..
-~--.-
....
Notes:
1. Maximum Voltage is with no LEDs illuminated.
2. 20 dots on in all locations at full brightness.
ESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED WITH THE
HDSP- 2111 AND HDSP-2112.
package Dimensions
4.81
10.1891
......
:::::
gi~~
0
nIl! HI~~
2
......
....
.....
......
.....
:in: .....
:::::
---r
9.8
10.3861
l-
PIN 1 IDENTIFIER
*
r
19.58
"r
2.88 10.1131 SYM
IMAGE PLANE
IFOR REFERENCE ONLYI
2.010.081
COLOR
BIN 131
5.31
10.2091
PIN
NO.
1
~
3
'
L
-II--DIA. 0.5 10.0201
79
1,o.0051
l~i89ISYM
I
--I
I
L2.S410.,001 TYP
(± 0.005) NON·ACCUM.
NOTES:
1. UNLESS OTHERWISE SPECIFIED, THE TOLERANCE ON ALL DIMENSIONS IS 0.254 mm (0.010 IN).
2. DIMENSIONS IN rnm (INCHES).
3. FOR YELLOW ONLY,
Character Set
07
o.------------~--~~
7-20
4
5
6
7
8
9
10
11
12
13
"
~UNCTION
PIN
NO.
RS'f
Fr
M
15
16
17
Al
A2
A3
SUBSTR. BIAS
SUBSTR.8IAS
SUBSTR. BIAS
A4
CLS
CLK
Wi'i
vee
18
19
FUNCTION
GNO (SUPPLY)
GNO(I.OGIC)
~
211
00
01
21
22
NO PIN
NO PIN
23
2'
25
26
27
28
02
OJ
Do
05
06
07
Recommended Operating Conditions
Parameter
Supply Voltage
Symbol
Units
Vee
v
Electrical Characteristics Over Operating Temperature Range
4.5 < Vcc < 5.5 V (unless otherwise specified)
Parameter
Min.
Symbol
Input leakage (Input
without pullup)
Ii
Input Current (input
with pullup)
lip
25°C
Typ.(1)
25°C
Max.tl]
18
11
Max.
Units
±1.0
pA
Test Conditions
Vin " 0 to Vcc pins ClK.
0tl-D7' Ao-A4
30
pA
Vin" 0 to '!.s,s; pins RST,
ClS, WR, RD, CEo Fl
Icc (BlK)
0.5
1.0
1.5
mA
Vin" 5.0V
Icc 8 digits
12 dots!character{2J
Icc{Vl
200
255
330
mA
"V" on in all 8 locations
Icc 8 digits
20 do!s/characterl21
Icc (#)
300
370
430
mA
"#" on in all 8 locations
Icc Blank
Input Voltage High
Vih
2.0
Vcc
+0.3 V
V
Vce "5,5 V
Input Voltage Low
Vii
GND
-0.3 V
0,8
V
Vee" 4.5 V
Output Voltage High
Voh
2.4
V
Vce " 4.5 V, loh " -40 p,A
Output Voltage Low
00-0 7
Vol
0.4
V
Vec "4.5 V, lot =
1.6mA
V
Vcc " 4.5 V. 10 1" 40 p,A
Output Voltage Low CLK
Thermal Resistance
IC Junction-Io-Case
0.4
°C/W
15
0j-c
Noles:
1. Vcc" 5.0 V
2. Average Icc measured at full brightness. See Table 2 in Control Word section for Icc at lower brightness levels. Peak Icc = 28/15 x
Average Icc (#).
optical Characteristics at 25 0 C[31
Vee
= 5.0 V, at Full Brightness
High Efficiency Red HDSP-2112
Description
luminous Intensity
Character average (#)
Peak Wavelength
Dominant Wavelength
Symbol
Min.
Iv
2.5
Typical
Max.
Units
7.5
mcd
"(peak}
635
nm
"(dl
626
nm
Yellow HDSP-2111
Description
luminous Intensity
Character average (#)
Peak Wavelength
Dominant Wavelength
Symbol
Min.
Iv
2.5
Typical
7.5
Max.
Units
mcd
"(peak)
583
nm
A{d)
585
nm
Note:
3. Refers to the initial case temperature of the device immediately prior to the light measurement.
7-21
AC Timing Characteristics Over Temperature Range
Vee = 4.5 V
Reference number
1
Symb()1
tacc
Descrlptl()n
Display Access Time
Write
Read
2
tacs
Address Setup Time to Chip Enable
$
tce
Chip Enable Active Time
Write
Read
Min.
UnIts
210
230
10
ns
4
tach
Address Hold Time to Chip Enable
5
tcer
Chip Enable Recovery Time
140
160
20
60
6
Ices
Chip Enable Active Prior to Rising Edge of
Write
Read
140
160
ns
ns
ns
ns
ns
7
lceh
8
9
10
tw
Write Actlve Time
twd
Data Valid Prior to Rising Edge of Write Signal
tdh
Ir
Data Write Hold Time
0
100
50
20
Chip Enable Active Prior to Valid Data
160
ns
Ird
Read Active Prior to Valid Data
tdf
Read Data Float Delay
ns
Ire
Reset Active Time
75
10
300
11
12
13
Chip Enable Hold Time to Rising Edge of ReadlWrite
Signal
ns
ns
ns
ns
ns
ns
Vee = 4.5 to 5.5 V
. Description
Units
Oscillator Frequency
25° C lYpical
57
70°C Min.
Fosc
Fri[l]
28
.kHz
Display Refresh Rate
256
128
Hz
Ffl[2]
Character Flash Rate
2
1
Hz
Ist lS ]
Self Test Cycle Time
4.6
9.2
Sec
Symbol
Noles:
1. Frj = Fosc/224
2. Fjl = Fosc/28,672
3. lSI = 262,144/F osc
Write Cycle Timing Diagram
CD
®
®
INPUT PULSE LEVELS - 0.6 V TO 2.4 V
7-22
Read cycle Timing Diagram
INPUT PULSE LEVELS: 0.6 V TO 2.4 V
OUTPUT REFERENCE LEVELS: 0.6 V TO 2.2 V
OUTPUT LOADING = 1 TTL LOAD AND 100pFd
Relative Luminous Intensity
VS. Temperature
Enlarged Character Font
L_~ .~~"~l"=l
r-••••.
5. 0
4. 5
4. 0
0.76 10.030) TYP
3.5
R2
0.25410.01l~
•
••
• • R3
•
•
•
•
•
•••••
3. 0
rJiDSP.ZI12
2.
R4
5,
2. 0
4.8110.189)
~R
1.5 '
il
:-<.
1 ~I::=..
1.0
~
•
••
• • R6
o.5
o
• • • • • R7
I
---l
I
-20 -10
0
10
20
r-- -.
30
40
50
60
70
TA - AMBIENT TEMPERATURE -'C
1-0.6510.026) TYP
7-23
- - _...._._---_._---
HDSP·2111
---_._._... ...
_
80
Electrical Description
PIN FUNCTION
RESET
(RST, pin 1)
Reset initializes the display.
FLASH
FL low indicates an access to the Flash RAM and is unaffected by the
state of address lines Aa-A4.
ADDRESS INPUTS
(Ao-A4, pins 3-6, 10)
Each location In memory has a distinct address. Address inputs (Ao-A2J
select a specific location in the Character RAM, the Flash RAM or a
particular row in the UDC (User-Defined Character) RAM. A~4 are
used to select which section of memory is accessed. Table 1 shows the
logic levels needs to access each section of memory.
{FL, pin 2)
TABLE 1. LOGIC LEVELS TO ACCESS MEMORY
Ft
A4
A3
Section of Memory
A2
0
X
X
Flash RAM
Char. Address
0
0
0
UDC Address Register
Don't Care
1
UDCRAM
Row Address
0
Control Word Register
Don't Care
Character RAM
Char. Address
A1
Ao
CLOCK SELECT
(ClS, pin 11)
This input Is used to select either an internal or external Clock source.
CLOCK INPUVOUTPUT
(ClK, pin 12)
Outputs the master clock (ClS '" 1) or Inputs a clock (ClS '" 0) for slave
displays.
WRITE
(WR, pin 13)
Data is written into the display when the
input is low.
CHIP ENABLE
(CE, pin 17)
This input must be at a logic low to read or write data to the display and
must go high between each read and write cycle.
READ
(RD, pin 18)
Data is read from the display when the RD input Is low and the CE input
is low.
DATA Bus
(00-07' pins 19, 20, 23-28)
The Data bus is used to read from or write to the display.
GND(SUPPLY)
(pin 15)
This Is the analog ground for the lED drivers.
GND(LOGICl
(pin 16}
This is the digital ground for internal foglc.
VCC(POWER)
{pin 14)
This is the positive power supply input.
VCC{SUBSTRATE)
These pins are used to bias the IC substrate and must be connected to
V cc These pins cannot be used to supply power to the display.
(pins 7-9)
WR
Input is low and the
CE
DISPLAY INTERNAL BLOCK DIAGRAM
Figure 1 shows the internal block diagram of the HDSP211 X display. The CMOS IC consists of an a. byte Character
RAM, an 8 bit Flash RAM, a 128 character ASCII decoder, a
16 character ASCII decoder, a 16 character UDC RAM, a
UDC Address Register, a Control Word Register and the
refresh circuitry necessary to synchronize the decoding
and driving of eight 5 x 7 dot matrix characters. The major
user accessible portions of the display are listed below:
Character RAM
This RAM stores either ASCII character data or a UDC RAM address.
Flash RAM
This Is a 1 x 8 RAM which stores Flash data
User-Defined Character RAM (UDC RAM)
This RAM stores the dot pattern for custom characters.
User-defined Character Address
Register (UDC Address Register)
This register is used to provide the address to the UDC RAM when the
user is writing or reading a custom character.
Control Word Register
This registar allows the user to adjust the display brightness. flash
Individual characters, blink, self test or clear the display.
7-24
..
A,
~
IT
UDC AODR
EN
REGISTER
eE
Ro
WR
DQ-O,
upe
APPR
-
elR
PRE SET
A;
~1'
uoe
RAM
eE::I--'
EN
nO
WR
DOT
0,
DATA
A,-A,
UOCAOOR
ROW SET
Do
A,
A,
-
,-.-
l
FlW
eE
8.8
RD
WR
00-0 1
Ao-A2
-..J
I
I\)
t11
A,
A,
.---
Fi: _
Fi:
CE
j=TIL)
L
EN CHARACTER
RD
RAM 01) ... 0 6
WR
0 0 -0,
0,
Ao-A:;!
RESET
eHARAODR
'tN
FLASH
DATA
RD
WR
0,
A,
iPL
FL
~
RST
CONTROL
WORD
REGISTER
RD
WR
0.0 ...0 1
il
T
elK
eLS
;.
B
RESULT
TEST
ASctl
EN
DECOOER
L - - D-o-D~
-
ROW
·'SEl
oor
DOT
DATA
DOT
DRIVERS
rl TIMING
S 5)( 1
-
lED
CHARACTERS
rl
DATA
SELF
TEST
RAM
RESET
CHAR
ADOR
~
2
b
[SELF
TEST
IN
INTENSITY
fJ.
3~
4
~RESET
SELF
-
0 0 -03
rfEN
FLASH
Ao,-A2
RESET
-
6
ROW DRIVERS
SELF
TEST
LTiMING
1
VISUAL
TEST
ROM
TEST
SELf
'TEST
eLA
START
BLINK
SELF
TEST
7~
TEST
OK
~
FLASH
CLR1
TEST OK
CLR2
l ::O-l f--
INTENSITV
fLASH
BLINK
RESET
CLOCK
CHAR
TIMING
AND
CONTROL
ADDR
Rowser
TIMING
-
Figure 1. HDSP-211X Internal Block Diagram
SOLIO STATE
OISPLAYS
iiiii'SEWiiiiii
RST
CE
ViA
I ' I I ~ I: I
·I
0
WRITE TO DISPLAY
....I._...L
• ....;......1.-.....;;..... READ FRDM DISPLAY
1..._ _
WRITE TO DISPLAY
READ FROM DISPLAY
o
CONTROL SIGNALS
CONTROL SIGNALS
I I I I
CHARACTER
I
000· LEFT MOST
L._'-....I_'...L_'_L.-_A_D_DR_E_SS_---I 111 = RIGHT MOST
UDC ADDRESS REGISTER ADDRESS
CHARACTER RAM ADDRESS
o
I
.28 ASCII CODE
X
X
X
I
X
X
X
I
X
UDC CODE
UDC ADDRESS REGISTER DATA FORMAT
UDCCODE
iiiTiiEWiiiiii
I.I I I I
CHARACTER RAM DATA FORMAT
o.
0
'0
WRITE TO DISPLAY
_....I._...L
. ....;......1.-.....;;..... READ FROM DISPLAY
1...
OlGa
0lG1
0lG2 DIG3 0lG4 DIGs 0lG6
0lG7
CONTROL SIGNALS
0000011010101'1100110'1"01'"
FL
SYMBOL IS ACCESSED IN LOCATION
SPECIFIED BY THE CHARACTER ADDRESS ABOVE
•
I
DISPLAY
LOGIC 0;,' • L,O,GIC '; X • DO NOT CARE
o•
Ao
'" I • I
I
A,
A.
iI
A,
ROW SELECT
I'OO.ROW.
'10, ROW7
UDC RAM ADDRESS
Figure 2. Logic Levels to Access the Character RAM
D7
I
CHARACTER RAM
X
D.
D,
X
X
UDCRAM
DATA FORMAT
Figure 2 shows the logic levels' needed to access the
HDSP~211X Character RAM. Address lines Ao-A2 are used
to select the location in the Character RAM. Two types of
data can be stored in each Character RAM location: an
ASCII code or a UDC RAM address. Data bit D7 is used to
dlfierentiate between an ASCII character and a UDC RAM
address. D7 ,; 0 enables the ASCII decoder and D7 = 1
enables the UDC RAM. Do-D6 are used to input ASCII data
and Do-D3 are used to input a UDC address.
D.
D,
I
D.
D,
D,
I
DOT DATA
C
C
0
0
L
L
•
5
o• LOGIC 0; •• LOGIC '; X • DD NOT CARE
Figure 3. Logic Levels to Access a UDC Character
UDC RAM AND UDC ADDRESS REGISTER
Figure 3 shows the logiC levels needed to access the UDC
RAM ,and the UDC Address Register. The UDC Address
Register is eight bits wide. The lower four bits (Do-D3) are
used to select one of the 1,6 UDC locations" The upper four
bits (D4-D7) are not used. Once the UDC address has been
stored in the UDC Address Register, the UDC RAM can be
accessed.
c c
C
c
C
0
0
0
0
0
L
L
L
L
L
4
5
• ,
2
•• •0 •0 •0 •0
•• 0• 0• 0• , 00
•• , 00 00 00 00
•0 0 0 0
To completely specify a 5 x 7 character requires eight write
cycles. One cycle is used to store the UDC RAM address in
the uric Address Register, Seven cycles are used to store
dot data in the UDC RAM. Data Is entered by rows, One
cycle is needed to access each row. Figure 4 shows the
organization of a UDC character assuming the symbol to
be stored is an "F", ArrA2 are used to select the row to be
accessed and DrrD4 are used to transmit the row dot data.
The upper three bits (D5-D7) are ignored, Do (least significant bit) corresponds to the right most column of the 5 x 7
matrix and D4 (most significant bit) corresponds to the left
most column of the 5 x 7 matrix.
..
UDC
CHARACTER
D4 03 D2 01 Do
ROW.
ROW2
ROW,
ROW.
ROWS,
ROWS
ROW 7
..
HEX
CODE
,F
10
,0
lD
10
10
10
IGNORED
0= LOGIC 0; 1 = LOGIC 1: • = ILLUMINATED LED.
Figure 4. Data to Load "F" Into the UDC RAM
7-26
RsTCEWRRD
I : I : I ~ I : I::!~EF~~~I~~~:~y
iiii
1
CONTROL SIGNALS
I
WRITE TO DISPLAY
• READ FROM DISPLAY
CONTROL SIGNALS
I : IA: I ~' I ~2~~~;;~~E:O I000
L.._
...._
AO
= LEFT MOST
.....L...-........_ _ _ _- - ' 111 - RIGHT MOST
FLASH RAM ADDRESS
I
0,
De
Ds
D4
D3
DZ
D1
X
X
==
CONTROL WORD ADDRESS
3L REMOVE FLASH AT
L.__ _ _ _ _ _ _ _ _ _·....L.Q::J...;I;...1
0,·
SPECIFIED DIGIT LOCATION
~~~~~iELt~~G~~ LOCATION
0,
0,
0,
0,
02
0,
Do
I I I I I I I I I
C
FLASH RAM DATA FORMAT
S
S
BL
F
B
B
o • LOGIC 0; 1 • LOGIC 1; X • DO NOT CARE
B
T'
1
80%
1
40%
27'"
20'"
130/0
0
o
o
1
o
Figure 5. Logic Leve.ls to Access the Flash RAM
1
DISABLE FLASH
ENABLE FLASH
FLASH RAM
X NORMAL OPERATION; X IS IGNORED
X START SELF TEST; RESULT GIVEN IN X
X =0 FAILED X =1 PASSeD
NORMAL OPERATION
CLEAR FLASH AND CHARACTER RAMS
CONTROL WORD DATA FORMAT
o • LOGIC 0; 1 • LOGIC 1; X • DO NOT CARE
Figure 6. Logic Levels to Access the Control Word Register
TABLE 2. CURRENT REQUIREMENTS AT DIFFERENT
BRIGHTNESS LEVELS
%
Symbol
Control Word Register
tec(V)
Figure 6 shows how to access the Control Word Register.
This is an eight bit register which performs five functions.
They are Brightness coritrol, Flash RAM control, Blinking,
Self Test and Clear. Each function is independent of the
others. However, all bits are updated during each Control
Word write cycle.
BRIGHTNESS (BITS 0-2)
Bits 0-2 of the Control Word adjust the brightnes.s of the
display. Bits 0-2 are interpreted as a three bit binary code
with code (000) corresponding to maximum brightness and
code (111) corresponding to a blanked display. In addition
to varying the display brightness, bits 0-2 also vary the
average value of Icc.. Icc can be calculated at any brightness
level by multiplying the percent brightness level by the
value of Icc at the 100% brightness level. These values of
Icc are shown in Table 2.
FLASH FUNCTION (BIT 3)
Bit 3 determines whether the flashing character attribute is
on or off. When bit 3 is a "1 ", the output of the Flash RAM is
BRIGHTNESS
CONTROL
LEVELS
DISABLE BLINKING
ENABLE BLINKING
Fi9ure 5 shows the logic levels needed to access the Flash
RAM. The Flash RAM has one bit associated with each
locatiOn of the Character RAM. The Flash input is used to
select the Flash RAM. Address lines A3-A4 are ignored.
Address lines Ao-A2 are used to select the location in the
Flash RAM to store the attribute. Do is used to store or
remove the flash attribute. Do = "1" stores the attribute and
Do ="0" removes the attribute.
When the attribute is enabled through bit 3 of the Control
Word and a "1" is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz. The actual
rate is dependent on the clock frequency. For an external
clock the flash rate can be calculated by dividing the clock
frequency by 28,672.
53%
Da 01 Do Brightness 25 Q CTyp.
Units
100
80
53
40
27
20
13
mA
mA
rnA
mA
mA
mA
mA
000
o0 1
010
011
100
101
110
200
160
106
80
54
40
26
checked. If the content of a location in the Flash RAM is a
"1", the associated digit will flash at approximately 2 Hz. For
an external clock, the blink rate can be calculated by diving
the clock frequency by 28,672. If the flash enable bit of the
Control Word is a "0", the content of the Flash RAM is
ignored. To use this function with multiple display systems
see the Reset section.
BLINK FUNCTION (BIT 4)
Bit 4 of the Control Word .is used to synchronize blinking of
all eight digits of the display. When this bit is a "1" all eight
digits of the display will blink at approximately 2 Hz. The
actual rate is dependent on the clock frequency. For an
external clock, the blink rate can be calculated by dividing
7-27
the clock frequency by 28,672. This function will overrride
the Flash function when it is active. To use this function
with multiple display systems see the Reset section.
SELF TEST FUNCTION (BITS 5,6)
Bit 6 of the Control Word Register is used to initiate the self
test function. Results of the internal self test are stored in
bit 5 of the Control Word. Bit 5 is a read only bit where bit 5
="1" indicates a passed selnest and' bit 5 ="0" indicates a
failed self test.
Setting bit 6 to a logic 1 will start the self test function. The
built-in self test function of the IC consists of two internal
routines which exercises major portions of the IC and
illuminates all of the LEDs. The first routine' cycles the
ASCII decoder ROM through all states and performs a
checksum on the output. If the checksum agrees with the
correct value, bit 5 is set to "1". The second routine
provides a visual test of the LEDs using the drive cicuitry.
This is accomplished by writing checkered and inverse
checkered patterns to the display. Each pattern is displayed
for approximately 2 seconds.
During the self test function the display must not be
accessed. The time needeclto execute the self test function
is calculated by multiplying the clock period by 262,144.
For example: assume a clock frequency of 58 KHz, then the
time to execute the self test function frequency is equal to
(262,144/58,000) =4.5 second duration.
At the end of the self test function, the Character RAM is
loaded with blanks, the Control Word Register "is set to
zeros except for bit 5, and the Flash RAM is cleared and
the UDC Address Register is set to all ones,
CLEAR FUNCTION (BIT 7)
Bit 7 of the Control Word will clear the Character RAM and
Flash RAM. The ASCII character code for a space will be
loaded into the Character RAM to blank the display. The
UDC RAM, UDC Address Register and the remainder of
'the Control Word are unaffected.
Display Reset
Figure 7 shows the logic levels needed to Reset the
'display. Thedispiay should be Reset on power-up. The
external Reset clears the Character RAM, Flash RAM,
Control Word Register and resets the internal counters. All
displays which operate with the same clock source must be
simultaneously reset to synchronize the Flashing and Blinking functions.,
RST
FE
WR
AD
Fi:
A4·AO DrDo
lolll x lxlxlxlxl
Mechanical and Electrical
Considerations
The HDSP-211X is a 28 pin dual-in-line package with 26
external pins, which can be stacked horizontally and
vertically to create arrays of any size. The HDSP-211X is
designed to operate continuously from -20°C to +70o,C
with a maximum of 20 dots on per character. Illuminating
all thirty-five dots at full brightness is not recommended.
The HDSP-211X is assembled by die attaching and wire
bonding 280 LED chips and a CMOS IC to a thermally
conductive printed circuit board. A polycarbonate lens is
placed over the PC board creating an air gap civerthe LED
wire bonds. A protective cap creates an air gap over the
CMOS IC, Backfill epoxy environmentally seals the display
package. This package construction makes the display
highly tolerant to temperature cycling and alloWs wave
soldering.
The inputs to the IC are protected against static discharge
and input current latchup. Howeve~ for best results standard
CMOS handling precautions should be used. Prior to use,
the HDSP-211X should be stored in antistatic tubes or in
conductive material. During assembly, a grounded conductive work area should be used, and assembly personnel
should' wear conductive wrist straps. Lab coats made,of
synthetic material should be avoided since they are prone
to static build-up, Input current latchup is caused when the
CMOS inputs are subjected to either a voltage below
ground (Vin < ground) or to a VOltage higher than Vcc (Vin >
Vccl,and when a high current is forced intqthe input. To
prevent input current latchup and ESD damage, unused
inputs should be connected either to ground or to Vcc ,
Voltages should not be applied to the inputs until Vcc has
been applied to the display,
'
.,
Thermal Considerations
The H DSP-211 X has been designed to provide a low thermal
resistance path for the CMOS IC to the 26 package pins.
This heat is then typically conducted through the traces of
the printed circuit board to free air. For most applications
no additional heatsinking is required.
Measurements were made on,a 32 character display string
to determine the thermal resistance of the display assembly.
Several display boards were constructed using 62 mil printed
circuit material, and 1 ounce copper 20 mil traces. Some ~f
the device pins were connected to a heatsink formed by
etching a copper area on the printed circuit board surrounding the display. A maximum metalized printed circuit
board was also evaluated.' The junction temperature was
measured,for displays soldered directly.to these PC boards,
displays installed in sockets, and finally displays installed in
sockets with a filter over the display to restrict airflow. The
results of these thermal resistance measurements, Elja, are
shown in Table 3 and include the affects of Eljc.
o =LOGIC 0; 1 '" LOGIC 1; X '" DO NOT CARE
NOTE:
IF RST, CE AND VIR ARE LOW, UNkNOWN
DATA MAY BE WRITTEN·INTO THE DISPLAY.
Figure l Logic Levels to Reset the Display
7-28
------
------~
to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the
solder side of the PC board.
TABLE 3. THERMAL RESISTANCE, 0]a, USING VARIOUS
AMOUNTS OF HEATSINKING MATERIAL.
He~lslnkil'lg ',:W/Sockets W/OSockets W/Sockets units
Metal
per device
sq.!n.
."
0
1
3
Max. Metal
4 board
avg.
W/O Filter
(avg.)
W/OFliter
(avg.)
W/Fllter
(avg.)
31
31
30
29
30
30
28
26
25
27
35
33
33
32
33
Post solder cleaning may be performed with a solvent or
aqueous process. For solvent cleaning, Allied Chemical's
Genesolv DES, Baron Blakeslee's Blaco-Tron TES or DuPont's
Freon TE may be used. These solvents are azeotropes of
trichlorotrifluoroethane FC-113 with low concentrations of
ethanol (5%). The maximum exposure time in the solvent
vapors at bOiling temperature should not exceed 2 minutes.
Solvents containing high concentrations of alcohols such
as methanol, ketones such as acetone, or chlorinated solvents
should not be used as they will chemically attack the
polycarbonate lens. Solvents containing trichloroethylene
FC-111 or FC-112 and trichloroethylene (TCE) are also not
recommended.
:~~
°C/W
°C/W
·CIW
Ground Connections
An aqueous cleaning process may be used. A saponifier,
such as Kesterbio-kleen Formula 5799 or its equivalent,
may be added to the wash cycle of an aqueous process to
remove rosin flux residues. Organic acid flux residues must
be thoroughly removed by an aqueous cleaning process to
prevent corrosion of the leads and solder connections. The
optimum water temperature is 60° C (140° F). The maximum
cumulative exposure of the HDSP-211X to wash and rinse
cycles should not exceed 15 minutes. For additional information on soldering and post solder cleaning, see Application Note 1027.
Two ground pins are provided to keep the internal IC logic
ground clean. The designer can, when necessary. route the
analog ground for the LED drivers separately from the
logic ground until an appropriate ground plane is available.
On long interconnects between the display and the host
system, the designer can keep voltage drops on the analog
ground from affecting the display logic levels by isolating
the two grounds.
The logic ground should be connected to the same ground
potential as the logic interface circuitry. The analog ground
and the logic ground should be connected at a common
ground which can withstand the current introduced by the
switching LED drivers. When separate ground connections
are used, the analog ground can vary from -0.3 V to +0.3 V
with respect to the logic ground. Voltage below -0.3 V can
cause all dots to be on. Voltage above +0.3 V can cause
dimming and dot mismatch.
Contrast Enhancement
The objective of contrast enhancement is to provide good
readability in the end user's ambient lighting conditions.
The concept is to employ both luminance and chrominance
contrast techniques. These enhance readability by having
the OFF-dots blend into the display background and the
ON-dots vividly stand out against the same background.
Contrast enhancement may be achieved by using one of
the following suggested filters:
Soldering and Post Solder
Cleaning Instructions for the
HDSP-211X
The HDSP-211X may be hand soldered or wave soldered
with SN63 solder. When hand soldering it is recommended
that an electronically temperature controlled and securely
grounded soldering iron be used. For best results, the iron
tip temperature should be set at 315° C (600° F). For wave
soldering, a rosin-based RMA flux can be used. The solder
wave temperature should be set at 245° C ±5° C (473° F
±9° F), and the dwell in the wave should be set between 1V,
HDSP-2112
Panel graphic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or -1265 GRAY
3M Louvered Filter R6310 RED or N0210GRAY
HDSP-2111
Panelgraphic AMBER 23 or GRAY 10
SGL Homalite H100-1720 AMBER or -1265 GRAY
3M Louvered Filter N0210 GRAY
For additional information on contrast enhancement see
Application Note 1015.
7-29
F/iP'l
HEWLETT
~~ PACKARD
FOUR CHARACTER
2.8Smm (0.112 inJ
SMART
ALPHANUMERIC DISPLAY
HPDL-1414
Features
• SMART ALPHANUMERIC DISPLAY
Built-in RAM, ASCII Decoder and
LED Drive Circuitry
• WIDE OPERATING TEMPERATURE RANGE
-40° C to +85° C
• FAST ACCESS TIME
160 ns
• EXCELLENT ESD PROTECTION
Built-in Input Protection Diodes
• CMOS IC FOR LOW POWER CONSUMPTION
• FULL TTL COMPATIBILITY OVER OPERATING
TEMPERATURE RANGE
V1L = 0.8 V
VIH=2.0V
• WAVE SOLDERABLE
• RUGGED PACKAGE CONSTRUCTION
• END-STACKABLE
• WIDE VIEWING ANGLE
Typical Applications
• PORTABLE DATA ENTRY DEVICES
• MEDICAL EQUIPMENT
• PROCESS CONTROL EQUIPMENT
• TEST EQUIPMENT
• INDUSTRIAL INSTRUMENTATION
Description
• COMPUTER PERIPHERALS
The HPDL-1414 is a smart 2.85 mm (0.112") four character,
sixteen-segment, red GaAsP display. The on-board CMOS
IC contains memory, ASCII decoder, multiplexing circuitry
and drivers. The monolithic LED characters are magnified by
an immersion lens which increases both character size and
luminous intensity. The encapsulated dual-in-line package
provides a rugged, environmentally sealed unit.
• TELECOMMUNICATION INSTRUMENTATION
The HPDL-1414 incorporates many improvements over
competitive products. It has a wide operating temperature
range, very fast IC access time and improved ESD
protection. The display is also fully TTL compatible, wave
solderable and highly reliable. This display is ideally suited
for industrial and commercial applications where a goodlooking, easy-to-use alphanumeric display is required.
Absolute Maximum Ratings
Supply Voltage, Vee to Ground ........... -0.5 V to 7.0 V
Input Voltage, Any Pin to Ground .... -0.5 V to Vee+0.5 V
Free Air Operating
Temperature Range, TA .............. -40°C to +85°C
Relative Humidity (non-condenSing) at 65°C ......... 90%
Storage Temperature, Ts .............. -40°C to +85°C
Maximum Solder Temperature, 1.59 mm (0.063 in.)
below Seating Plane, t<5 sec ................... 260°C
7-30
package Dimensions
PIN
NO.
1
2
3
4
5
6
4.10
(0.1601
FUNCTION
05 DATA INPUT
~DATAINPUT
WRITE
A, ADDRESS INPUTS
Ao
ADDRESS INPUTS
Vee
PIN
NO.
7
B
9
10
11
12
FUNCTION
GND
Do OATA INPUT
01 DATA INPUT
02 DATA INPUT
03 DATA INPUT
06 DATA INPUT
PIN 1
NOTES,
1. UNLESS OTHERWISE SPECIFIED THE TOLERANCE
ro~~~: ~:~51 TYP.
ON All DIMENSIONS IS 0.25 mOl (0.010 in.,.
2. DIMENSIONS IN mm (inch(l!Ot.
Recommended operating Conditions
Symbol
Parameter
=
Supply Voltage
Input Voltage High
Input Voltage Low
Min.
Nom.
Max.
Vee
4.5
5.0
5.5
VIH
2.0
Units
V
V
V,L
0.8
V
DC Electrical Characteristics Over operating Temperature Range
TYPICAL VALUES
Parameter
Symbol
Units
-40'C
-20·C
2S'C
SS'C
Icc
mA
90
SS
70
60
Vee =5.0 V
IcclBU
mA
1.8
1.5
1.2
1.1
Vce=5.0V
BL = 0.8 V
hl
pA
23
20
17
12
Vcc=5.0V
VIN = 0.8 V
Icc 4 digits on (10 seg/digit)il.21
Icc Blank
Input Current, Max.
Test Condition
GUARANTEED MAXIMUM VALUES
Symbol
Units
25·C
Vee 5.0 V
=
Maximum Over
Operating Temperature
Range
Vee =5.5 V
Icc
rnA
90
130
lec(BU
rnA
2.3
4.0
Input Current, Max.
lil.
p.A
30
50
Power Dissipation l31
Po
rnW
450
715
Parameter
Icc 4 digits on (10 segJdigit)11.21
icc Blank
Noles:
1. "%" illuminated in all four characters.
2. Measured at five seconds.
3. Power dissipation = Vee' Icc (10 seg.!.
7-31
AC Timing Characteristics Over Operating Temperature
Range at Vce = 4.5 V
-20°C
25¢C
10·C
Symbol
IMIN
IMIN
IM.N
Units
Address Setup Time
lAS
90
115
150
ns
Write Delay Time
twD
10
15
20
ns
Write Time
80
100
130
ns
Data Setup Time
tw
IDS
40
60
80
ns
Data Hold Time
tOH
40
45
50
ns
Address Hold Time
IAH
40
45
50
ns
Access Time
130
160
200
ns
Refresh Rate
420·790
310-630
270-550
Hz
Parameter
Optical Characteristics
Min.
Typ.
Unlls
0.4
1.0
mod
Apeak
655
nm
Ad
640
nm
Off Axis Viewing Angle
±40
degrees
Digit Size
2.85
mm
Parameter
Symbol
Test Condition
Peak Luminous Intensity per digit,
segments on (character average)
Iv Peak
Vcc"'5.0V
H;(" illuminated in
8114 digits,
a
Peak Wavelength
Dominant Wavelength
Timing Diagram
~
-'X
,
-.
tAS
2 0V
.
0.8 V
_tAH_
2.0 V
./
\
tw
_-two_I·
!
~:
Do-D6
O.B V
K2.0V
!---tos_ I--toH-1
7-32.
0,8 V
~---~-.----.--~------~
Magnified Character Font
Description
Relative Luminous Intensity
vs. Temperature
3.0
~
....~
."
:1"
~
2.0
...\ \;\
'\.
z
w
>
~
ula:
5" REF.
%Tl~
,,%C,
"- I\.
0
""-
'.0
~o
-20
20
'"
40
60
80
100
TA - AMBIENT TEMPERATURE - ("CI
Electrical Description
Figure 1 shows the intermil block diagram of the HPDL-1414.
It consists of two parts: the display LEOs and the CMOS IC.
The CMOS IC consists of a four-word ASCII memory, a 64word character generator, 17 segment drivers, four digit
drivers, and the scanning' circuitry necessary to multiplex the
four monolithic LED characters. In normal operation, the
divide-by-four counter sequentially accesses each of the four
RAM locations and simultaneously enables the appropriate
display digit driver. The output of the RAM is decoded by the
character generator which, in turn, enables the appropriate
display segment drivers. Seven-bit ASCII data is stored in
RAM. Since the display uses a 64-character decoder, half of
the possible 128 input combinations are invalid. For each
display location where 05=06 in the ASCII RAM, the display
character is blanked.
Data is loaded into the display through the DATA inputs
(D6-Do), ADDRE~S inputs (Al-Ao), and WRITE (WR). After a
character has been written to memory, the IC decodes the
ASCII data, drives the display and refreshes it without any
external hardware or software.
o ATA INPUTS (00.001
Do-D.
Os
2
WRITE
1
WRITE (Will
DATA INPUTS
Seven bit ASCII data is entered into
(00-06, pins 1, 2, 8-12) memory via the DATA inputs.
ADDRESS INPUTS
(Al-Ao, pins 4 and 5)
Each location in memory has a
distinct address. ADDRESS inputs
enable the designer to select a
specific location in memory to store
data. Address 00 accesses the far
right display location. Address 11
accesses the far left location.
WRITE (WR, pin 3)
Data is written into the display when
the WR input is low.
Vec and GND
(pins 6 and 7)
These pins supply power to the.
display.
~
6
ADD RESS INPUTS (A,-Aol
The HPDL-1414 uses 12 pins to control the CMOS IC.
Figure 1 shows the effect these inputs have on the display.
Os
---+s-
-
64.17
CllAAACTER
DECODER
r-m-
SEGMENT
OR IVERS
r-m--
$LANK
I
.II
,-
3r-- 3
3
2r--~
10f4
OECODER 1
r-'or--
+4
INTERNAL
OSC.
r-
COUNTER
Figure 1. HPDL-1414 Inlernal Block Diagram
7-33
2
DIGIT
1 DRIVERS 1
Q
0
~~~~
WR AJ Ao
a
a
0,
a
b
b
b
b
b
c
c
c
c
c
d
d
d
d
d
NC NC :B NC
NC c:: NC NC
11 NC NC NC
X
X
X
X
X
Previously Written
06
Os
a
04
a
H
a
b
b
L
c
c
L
L
L
L
L
L
L
H
H
H
d
d
H
X
X
X
X
0 3 02
00 0lG3DIG2DIG10lGO
a NC NC NC FI
Data
"a" = ASCII CODE CORRESPONDING TO SYMBOL" R"
NC = NO CHANGE
L = LOGIC LOW INPUT
H = LOGIC HIGH INPUT
X= DON'T CARE
Figure 2. Write Truth Table
using the HPDL-1414 with
Microprocessors
ADDRESS inputs (A, and Ao) are connected to microprocessor addresses A, and Ao. A 74LS138 may be used to
generate individual display WRITE signals. Higher order
microprocessor address lines are connected to the 74LS138.
The microprocessor write line must be wired to one of the
active low enable. inputs of the 74LS138. Both figures are
formatted with address 0 being the far right display character.
Figures 3 and 4 show how to connect the HPDL-1414 to a
Motorola 6800 or an Intel 8085. The major differences
between the two circuits are:
1. The 6800 requires two latches to store the ADDRESS
and ASCII DATA information to increase the address
and data input hold times.
2. The 6800 requires a flip-flop to delay the display
WRITE signal to increase the address input setup time.
74lS313
r"
l.i
1~1)s.
~ 004
1-.!!
MICROPROCESSOR
a.
D
a-
0,
-'- 0,
0,
DATA BUS
7
I~D,
2
•
5
2
a. ,.
a. ,.
12
9
•
•
a,
2
ao
••
..
.,.1] •
Of
74LS20
,.....
t
.1
~ 74kS74
D
2
~'LS04
3
.
_
.
tP
Q
I
'+b
.{
17
741.$373
D,
13 D4
8 0,
A
7 D,
,
A
A0
5
.,
4 •
9 10 11
2 12
8
~
WAA
14Ii
i
8
1 2 12
,.
,.
13
.
~
USED FOR HIGHER ORDER ADDRESS DECODING
Figure 3: Memory Mapped Interface for the 6800
7-34
1
R A, AD
3 •
3 4 •
3~
i
0
9 10 11
9 10 11
1 2 12
'~
~~
J
Oe
1.
1
8888
8EJ88
GJ941~
,~.
3~
'""";:i;4 ~
00
O.
c..!:!e
~
3
8
14LS13B
a.r-< £,
0,
2 12
~
.xXXF
WR III Ao:
'1'414
Q'~ ""
• 0,
3
16
1
888~
a.~ l,
o.~A2
a3~Al
'4 D.
A3
,
.
8 9 10 l'
~6
5
#
3 4
5
0,
05
DATA LINES
FROM
MICROPROCESSOR
OJ
0,
0,
Do
8 9 10'1
4
WR.......!'...c
2 12
8
9 10 11
1 2 12
8
9 10 11
1
2 12
B 9 10 11
1 2 12
74lS13S
6,
.{-~e,
-----L e,
A,
1
----L A,
3j:>-"...
2 _ _ _~
2j:>-""'3_ _ _ _ _
+-+_______----'
_________+_+---------J
AJ--1- A,
lj:>-"~4_ _ _ _~+-+
A,--1- Ao
at:>-"~5----~~--------_t_t---------~~------~
Al------------~~--------+-+_-------~~~-------~
Ao--------------~----
_____
_4---------_~------~--~
·USE FOR HIGHER ORDER ADDRESS DECODING.
Figure 4. Memory Mapped Interface lor the 8085
7-35
- - - - - - - - ------------------------
0
0
0
0
0
0
0
1
HEX
0,
1
(space)
D3
D2
D,
DO
BITS
D6 05 04
o
1
0
2
a
1. 1
3
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
% [1
/
< > *- + 0 I 2 j Y 5 5 1 B 9 - / L - ~ ?
OJ R B [ ]J E F [; H I J I-< L M N 0
P Q R 5 T U V hi X Y Z [ \ J A I
1/
:±J
~
/
I
.,--
'"
1
0
0
4
1
0
1
5
Figure 5. HPDL-1414 ASCII Character Set
Mechanical and Electrical
Considerations
The HPDL-1414 is a 12 pin dual-in-line package which can
be stacked horizontally and vertically to create arrays of any
size. The HPDL-1414 is designed to operate continuously
from -40° C to +85 0 C for all possible input conditions.
Soldering and Post Solder
Cleaning Instructions for the
HPDl-1414
The HPDL-1414 is assembled by die attaching and wire
bonding the four GaAsP/GaAs monolithic LED chips and
the CMOS IC to a high temperature printed circuit board. An
immersion lens is formed by placing the PC board assembly
into a nylon lens filled with epoxy. A plastic cap creates an
air gap to protect the CMOS IC. Backfill epoxy environmentally seals the display package. This package construction
gives the display a high tolerance to temperature cycling.
The HPDL-1414 may be hand soldered or wave soldered
with SN63 solder. Hand soldering may be safely performed
. only with an electronically temperature-controlled and
securely grounded soldering iron. For best results, the iron
tip temperature should be set at 315°C (600° Fl. For wave
soldering, a rosin-based RMA flux or a water soluble organic
acid (OAI flux can be used. The solder wave t€!mperature
should be 245°C ±5°C (473°F ±9°FI, and the dwell in the
wave should be set at 1 1/2 to 3 seconds for optimum soldering. Preheat temperature should not exceed 93° C (200° FI as
measured on the solder side of the PC, board.
'
The inputs to the CMOS IC are protected against static discharge and input current latchup. However, for best results,
standard CMOS handling precautions should be used. Prior
to use, the HPDL-1414 should be stored in anti-static tubes
or conductive material. A grounded conductive assembly
area should be used, and assembly personnel should wear
conductive wrist straps. Lab coats made of synthetic materials should be avoided since they may collect a static charge.
Input current latchup is caused when the CMOS inputs are
subjected either to a voltage below ground (VIN < groundl or
to a voltage higher than Vee (VIN > Veel, and when a high
current is forced into the input.
Post solder cleaning may be performed with a solvent or
aqueous process. For solvent cleaning, Allied Chemical
Genesolv DES, Baron Blakeslee Blaco-Tron TES or DuPont
Freon TE can only be used. These solvents are azeotropes of
trichlorotrifluoroethane FC-113 with low concentrations of
ethanol (5%1. The' maximum exposure time in the solvent
vapors at boiling temperature should not exceed 2 minutes.
Solvents containing high concentrations of alcohols, pure
alcohols, isopropanol or acetone should not be used as they
will chemically attack the nylon lens. Solvents containing
trichloroethane FC-111 or FC-112 and trichloroethylene
(TCEI are not recommended.
An aqueous cleaning process is highly recommended. A
saponifier, such as Kester Bio-kleen Formula 5799 or equivalent, may be added to the wash cycle of an aqueous
process to remove rosin flux residues. Organic acid flux
residues must be thoroughly removed by an aqueous cleaning process to prevent corrosion of the leads and solder
connections. The optimum water temperature is 60° C
(140°FI. The maximum cumulative exposure of the HPDL1414 to wash and rinse cycles should not exceed 15 minutes.
7-36
optical Considerations/
Contrast Enhancement
The HPDL-1414 display uses a precision aspheric immersion
lens to provide excellent readability and low off-axis distortion. The aspheric lens produces a magnified character
height of 2.85 mm (0.112 in.! and a viewing angle of ±40
degrees. These features provide excellent readability at distances of up to 1.5 meters (4 feet).
Each HPDL-1414 display is tested for luminous intensity and
marked with an intensity category on the side of the display
package. To ensure intensity matching for multiple package
applications, mixing intensity categories for a given panel is
not recommended.
The HPDL-1414 display is designed to provide maximum
contrast when placed behind an appropriate contrast
enhancement filter. Some suggested filters are Panelgraphic
Ruby Red 60, Panel graphic Dark Red 63, SGL Homalite
Hl00-1650, Rohm and Haas 2423, Chequers Engraving 118,
and' 3M R6510. For further information on contrast
enhancement, see Hewlett-Packard Application Note 1015.
7-37
- - - - .._..... __._---_.__._._.. ------_. _......-
r/idl
HEWLETT
~e. PACKARD
FOUR CHARACTER
4.1 mm (0.16 inJ
SMART
ALPHANUMERIC DISPLAY
HPDL-2416
Features
• SMART ALPHANUMERIC DISPLAY
Built-in RAM, ASCII Decoder, and LED Drive
Circuitry
• WIDE OPERATING TEMPERATURE RANGE
-40 0 C to +85 0 C
• VERY FAST ACCESS TIME
160 ns
• EXCELLENT ESD PROTECTION
Built-in Input Protection Diodes
• CMOS IC FOR LOW POWER CONSUMPTION
• FULL TTL COMPATIBILITY OVER OPERATING
TEMPERATURE RANGE
Typical Applications
VIL =0.8 V
VIH =2.0 V
• PORTABLE DATA ENTRY DEVICES
• WAVESOLDERABLE
• MEDICAL EQUIPMENT
• RUGGED PACKAGE CONSTRUCTION
• PROCESS CONTROL EQUIPMENT
• END-STACKABLE
• TEST EQUIPMENT
• WIDE VIEWING ANGLE
• INDUSTRIAL INSTRUMENTATION
• COMPUTER PERIPHERALS
Description
The HPDL-2416 has been designed to incorporate several
improvements over competitive products. It has a wide
operating temperature range, fast IC access time and
improved ESD protection. The HPDL-2416 is fully TTL
compatible, wave solderable, and highly reliable. This display
is ideally suited for industrial and commercial applications
where a good looking, easy-to-use alphanumeric display is
required.
The HPDL-2416 is a smart 4.1 mm (0.16 in) four character,
sixteen-segment red GaAsP display. The on-board CMOS
IC contains memory, ASCII decoder, multiplexing circuitry,
and drivers. The monolithic LED characters are magnified
by an immersion lens which increases both character size
and luminous intensity. The encapsulated dual-in-Iine
package construction provides a rugged, environmentally
sealed unit.
7-38
• TELECOMMUNICATION EQUIPMENT
Absolute Maximum Ratings
Supply Voltage, VCC to Ground .......... -{l.5 V to 7.0 V
Input Voltage, Any Pin to Ground ... -0.5 V to Vee +0.5 V
Free Air Operating, No Cursors On[1J
Temperature Range, T A .............. -40° C to +85° C
Relative Humidity (non-condensing) at 65° C ........ 90%
Storage Temperature, Ts .............. -40° C to +85° C
Maximum Solder Temperature, 1.59 mm (0.063 in.!
below Seating Plane, t < 5 sec. ................. 260° C
Nole:
1. Free air operating temperature range:
T A> 75° C No Cursors On
TA';; 60° C 3 Cursors On
T A';; 75' C 1 Cursor On
TA';; 55° C 4 Cursors On
T A';; 68' C 2 Cursors On
-------- - - - - -
package Dimensions
Ir ::1
25.2010.990)
r'
-
6.3510.250) TYP.
.~
fiv~~
L
I
2007
10.790)~
3.
~0~0005)
~'~""
f'
2
.1
0
15.03
10.600)
1
F=-~
REF.
~
10.160)
PIN
NO.
1
2
3
4
PART NUMBER
LUMINOUS INTENSITY CATEGORY
AND/\CODE
......-- r
',,,'"
6.6
10;61
HPDl 2416
L
... ",'"
""..
4,10
..,
REF
tlI0.160)
.
y~WWI
0.51 ± .013 TVP
10.020 ±0.005)
.
5
6
7
~~~~~tl
PIN 1 IDENTIFIER
TIe .
e
9
PIN
FUNCTION
NO.
ti, CHIP ENASlE
10
11
12
13
14
15
16
17
18
~W:A'WABLE
cull CURSOR ENABLE
CiJ CURSOR SELECT
Wll WRITE
ADOA ess INPUT Al
ADDRESS INPUT Ao
Vee
FUNCTION
GND
Do OATA INPUT
D, DATA INPUT
D, DATA INPUT
D, DATA INPUT
0, OATA I~PUT
D. DATA·INPUT
Oil OAT~ INpUT
If[ DISPLAY BLANK
NOTES:
1. UNLESS OTHERWISE SPECIFIED, THE TOLERANCE ON ALL DIMENSIONS IS 0.254 mm (0.010 IN.l
2. DIMENSIONS IN mm (INCHES).
2.5410.1001 TYP.
ReCOmmended Operating Conditions
Parameter
Symbol
Min.
N6m.
Max.
Supply Voltage
Vee
4.5
5.0
5.5
Input Voltage High
VIH
2.0
Input Voltage Low
VIL
Units
V
V
0.8
V
DC Electrical Characteristics Over Operating Temperature Range
TYPICAL VALUES
Parameter
Symbol
Units
-40°C
-20°C
2S"C
70°C
85°C
Test Condition
ICC
100
95
85
75
72
VCC=5.0V
147
140
125
110
105
VCC=S.OV
1.85
1.5
1.15
Vec =5.0V
BL=O.S V
20
17
14
ICC Cusor ,2 .J
ICC'CU,
ICC Blank
ICC1BLI
mA
mA
mA
IlL
J.1A
Icc 4 digits on! 10 seg/digit,
1.21
Input Current, Max.
Vcc=50V
VIN =0.8 V
GUARANTEED VALUES
Parameter
2S"C
Vee = 5.0 V
Maximum Over
Operating Temperature
Range
Vee "" S.S V
Symbol
Units
Icc
115
170
165
232
3.5
SO
Icc IBU
rnA
mA
mA
Input Current. Max.
IlL
p.A
30
40
Power Dissipation. 4
PD
mW
575
910
Icc 4 digits on (10 seg/digitl
1.2
Icc Cursor 2.3
1 ......
lce leU)
Icc Blank
I
Notes:
1. "%" illuminated in all four characters.
4. Power dissipation
2. Measured at five seconds.
3. Cursor character is sixteen segments and DP on.
7-39
= Vee'
lee lID seg.l.
AC Timing Characteristics Over Operating Temperature
Range at Vee = 4.5 V
-20o e
25°e
70c e
Symbol
tMIN
tMIN
tMIN
Units
Address Setup Time
lAs
90
115
150
ns
Write Delay Time
10
15
20
80
100
130
Data Setup Time
two
tw
tos
40
60
80
Data Hold Time
tOH
40
45
50
Address Hold Time
tAH
40
45
50
ns
ns
ns
ns
ns
ns
Parameter
Write Time
Chip Enable Hold Time
teEH
40
45
50
Chip Enable Setup Time
teEs
90
115
150
ns
Clear Time
telA
2.4
3.5
4.0
ms
Access Time
130
Refresh Rate
420-790
=~
160
200
ns
310-630
270-550
Hz
Optical Characteristics
Parameter
Symbol
Test Condition
Min,
Typ.
Units
Peak Luminous Intensity per digit,
8 segments on (character average)
Iv Peak
Vcc=5,QV
"%" illuminated in
al14 dIgits.
0.5
1.25
mcd
Petak Wavelength
Apeak
655
nm
Ad
640
nm
Off Axis Viewing Angle
±5Q
degrees
Digit Size
4,1
mm
Dominant Wavelength
Timing Diagram
f2.0V
--,
I
0.8V
teES
I
--'..- 2.0 V
I
~O.8V
I
-'e'H--'~(OV
~.
,
'AS
-two
0.8 V
"'-',H __
i
I
'- 2.0 V
0.8 V
tw
I
~r
00-0 6
-'DS"-- I--'OH--
7-40
~2.0V
O.8V
Magnified Character
Font Description
Relative Luminous Intensity
vs. Temperature
3.0
1 -(~:~~~)-1
a,
I
32
fl\111
0
'IVI~l
£12
~
1,\
0
1'\
I""I'--
0
d,
-40
-20
20
40
f'..
60
60
TA - AMBIENT TEMPERATURE _ (CO)
Electrical Description
Data Entry
Display Internal Block Diagram
Figure 2 shows a truth table for the HPDL-2416 display. Setting the chip enables (CE" CE2) to their low state and the
cursor select (CU) to its high state will enable data loading.
The desired data inputs (06-00) and address inputs (A"
Ao) as well as the chip enables (CE" CE2) and cursor
select (CU) must be held stable during the write cycle to
ensure that the correct data is stored into the display. Valid
ASCII data codes are shown in Figure 3. The display
accepts standard seven-bit ASCII data. Note that 06 = 05
for the codes shown in Figure 2. If 06 = 05 during the write
cycle, then a blank will be stored in the display. Data can
be loaded into the display in any order. Note that when A,
= Ao = 0, data is stored in the furthest right-hand display
location.
Figure 1 shows the internal block diagram for the
HPDL-2416' display. The CMOS IC consists of a four-word
ASCII memory, a four-word cursor memory, a 64-word
character generator, 17 segment drivers, four digit drivers,
and the scanning circuitry necessary to multiplex the four
monolithic LED characters. In normal operation, the divideby-four counter sequentially accesses each of the four RAM
locations and simultaneously enables the appropriate display digit driver. The output of the RAM is decoded by the
character generator which, in turn, enables the appropriate
display segment drivers. For each display location, the cursor enable (CUE) selects whether the data from the ASCII
RAM (CUE = Q) or the stored cursor (CUE = 1) is to be
displayed. The cursor character is denoted by all sixteen
segments and the DP ON. Seven-bit ASCII data is stored in
RAM. Since the display utilizes a 64-character decoder, half
of the possible 128 input combinations are invalid. For each
display location where Os = 06 in the ASCII RAM, the display character is blanked. The entire display is blanked
when BL=O.
Cursor Entry
As shown in Figure 2, setting the chip enables (CE" CE2) to
their low state and the cursor select (CU) to its low state will
enable cursor loading. The cursor character is indicated by
the display symbol having all16 segments and the DP ON.
The least significant data input (Do). the address inputs
(A" Ao). the chip enables (CE" CE2). and the cursor select
(CU) must be held stable during the write cycle to ensure
that the correct data is stored in the display. If Do is in a
low state during the write cycle, then a cursor character
will be removed at the indicated location. If Do is in a high
state euring the write cycle, then a cursor character will be
stored at the indicated location. The presence or absence
of a cursor character does not affect the ASCII data stored
at that location. Again, when A, = Ao = 0, the cursor
character is stored in the furthest right-hand display
location.
Data is loaded into the display through the data inputs (06Do). address inputs (A" Ao)~hip enables (CE" CE2).
cursor select (CU), and write (WR). The cursor select (CU)
determines whether data is stored in the ASCII RAM (CU =
1) or cursor memory (CU = 0). When CE, = CE2 = WR = 0
and CU = 1, the information on the data inputs is stored in
the ASCII RAM at the location specified by the address
inputs (A" Ao). When CE, = CE2 = WR = 0 and CU = 0,
information on the data input, Do, is stored in the cursor at
the location specified by the address inputs (A" AO)' If Do
= 1, a cursor character is stored in the cursor memory. If
DO = 0, a previously stored cursor character will be removed
from the cursor memory.
All stored cursor characters are displayed if the cursor enable (CUE) is high. Similarly, the stored ASCII data words are
displayed, regardless of the cursor characters, if the cursor
enable (CUE) is low. The cursor enable (CUE) has no effect
on the storage or removal of the cursor characters within
the display. A flashing cursor is displayed by pulsing the
cursor enable (CUE). For applications not requiring a cursor, the cursor enable (CUE) can be connected to ground
and the cursor select (CU) can be connected to Vee. This
inhibits the cursor function and allows only ASCII data to
be loaded into the display.
If the clear input (CLR) equals zero for one internal display
cycle (4 ms minimum), the data in the ASCII RAM will be
rewritten with zeroes and the display will be blanked. Note
that the blanking input (BU must be equal to logical one
during this time.
7-41
DATA INPUTS (D6-D,
1
6
4x7
DATA INPUT (DO 1
ADDRESS INPUTS (A,-A 01
64x 17
ASCII
MEMORY
2
OOrrt-"
O.
WRITE CLEAR READ
2
~
4xl
CURSOR MEMORY
l¥- t-- WRITE
READ
.... ..,
(CE,
SEGMENT
DRIVER
SLAN!\
D,
~
;::D-
2
~
CE2 1
WRITE (WA 1
CURSOR SELECT
Pf.
CURSOR
~D
t-
CHIP ENABLES
CftARACTER
GENERATOR
(CO' 1
CURSOR ENABLE (CUE 1
CLEAR IClR 1
.~)
BLANK IliL 1
B '.
$
COUNTER
f¥o-
'OF4
DECODER
f*.
DI
0
0
0
0
0
0
1
0
I
0
I
0
0
1
1
1
Q
0
1
1
1
5
8
7
(>
,
Q
0
0
0
1
1
0
1
0
8
9
A
1
Q
I
1
Q
1
, ,
1
1
0
0
0
1
1
1
0
B
C
D
E
1
1
1
I
1
F
/
:±J gj % &
< >
+
0 I 2 3 y 5 5 1 B 9 -- /- L
~ ?
N 0
IOJ IR B [ D E F G H I J K
P Q R 5 T U V WX YZ [ \ J A (space)
1
u
/
*
I
=
LiM
Figure 3. HPDL-2416 ASCII Character Set
Mechanical and Electrical
Considerations
either to a voltage below ground (VIN < ground) or to a
voltage higher than Vee (VIN > Vee) and when a high current is forced into the input. To prevent input current
latchup and ESD damage, unused inputs should be connected either to ground or to Vee. Voltages should not be
applied to the inputs until Vee has been applied to the display. Transient input voltages should be eliminated.
The HPDL-2416 is an 18 pin dual-in-line package that can
be stacked horizontally and vertically to create arrays of
any size. This display is designed to operate continuously
between -40° C to +85° C with a maximum of 10segments
on per digit.
During continuous operation of all four Cursors the operating temperature should be limited to -40° C to +55° C.
At temperatures above +55° C, the maximum number of
Cursors illuminated continuously should be reduced as
follows: No Cursors illuminated at operating temperatures
above 75° C. One Cursor can be illuminated continuously
at operating temperatures below 75° C. Two Cursors can
be illuminated continuously at operating temperatures below
68° C. Three Cursors can be illuminated continuously at
operating temperatures below 60° C.
The HPDL-2416 is assembled by die attaching and wire
bonding the four GaAsP/GaAs monolithic LED chips and
the CMOS IC to a high temperature printed circuit board.
An immersion lens is formed by plaCing the PC board
assembly into a nylon lens filled with epoxy. A plastic cap
creates an air gap to protect the CMOS IC. Backfill epoxy
environmentally seals the display package. This package
construction provides the display with a high tolerance to
temperature cycling.
The inputs to the CMOS IC are protected against static
discharge and input current latchup. However, for best
results standard CMOS handling precautions should be
used. Prior to use, the HPDL-2416 should be stored in antistatic tubes or conductive material. During assembly a
grounded conductive work area should be used, and
assembly personnel should wear conductive wrist straps.
Lab coats made of synthetic material should be avoided
since they are prone to static charge build-up. Input current latchup is caused when the CMOS inputs are subjected
Soldering and Post Solder
Cleaning Instructions for the
HPDL-2416
The HPDL-2416 may be hand soldered or wave soldered
with SN63 solder. Hand soldering may be safely performed
only with an electronically temperature-controlled and
securely grounded soldering iron. For best results, the iron
tip temperature should be set at 315°C (600°F). For wave
soldering, a rosin-based RMA flux can be used. The solder
wave temperature should be 245°C ±5°C (473°F ±9°F),
and the dwell in the wave should be set at 1V, to 3 seconds
for optimum soldering. Preheat temperature should not
exceed 93°C (200°F) as measured on the solder side of the
PC board.
Post solder cleaning may be performed with a solvent or
aqueous process. For solvent cleaning, Allied Chemical
Genesolv DES, Baron Blakeslee Blaco-Tron TES or DuPont
Freon TE can only be used. These solvents are azeotropes
of trichlorotrifluoroethane FC-113 with low concentrations
of ethanol (5%). The maximum exposure time in the solvent
vapors at boiling temperature should not exceed 2 minutes.
Solvents containing high concentrations of alcohols, pure
alcohols, isopropanol or acetone should not be used as
they will chemically attack the nylons lens. Solvents containing trichloroethane FC-111 or FC-112 and trichloroethylene (TCE) are not recommended.
7-44
An aqueous cleaning process is highly recommended. A
saponifier, such as Kester-Bio-kleen Formula 5799 or equivalent, may be added to the wash cycle of an aqueous
process to remove rosin flux residues. Organic acid flux
residues must be thoroughly removed by an aqueous cleaning process to prevent corrosion of the leads and solder
connections. The optimum water temperature is 60°C
(140°F). The maximum cumulative exposure of the HPDL2416 to wash and rinse cycles should not exceed 15 minutes.
optical Considerations/
Contrast Enhancement
The HPDL-2416 display uses a precision aspheric immersion lens to provide excellent readability and low off-axis
distortion. The aspheric lens produces a magnified character height of 4.1 mm (0.160 in.! and a viewing angle of ±50°.
These features provide excellent readability at distances up
to 2 metres (6 feet).
Each HPDL-2416 display is tested for luminous intensity
and marked with an intensity category on the side of the
display package. To ensure intensity matching for multiple
package applications, mixing intensity categories for a
given panel is not recommended.
The HPDL-2416 display is designed to provide maximum
contrast when placed behind an appropriate contrast
enhancement filter. Some suggested filters are Panelgraphic
Ruby Red 60, Panelgraphic Dark Red 63, SGL Homalite
H100-1650, Rohm and Haas 2423, Chequers Engraving 118,
and 3M R6510. For further information on contrast
enhancement, see Hewlett-Packard Application Note 1015.
7-45
Flidl
FOUR CHARACTER 3.8 mm (0.15 INCH)
5x7 ALPHANUMERIC DISPLAYS
HEWLETT
STANDARD REO
YEllOW
HIGH EFFICIENCY REO
HIGH PERFORMANCE GREEN
.:~ PACKARD
HDSP-2000
HDSP-2001
HDSP-2002
HDSP'2003
Features
• FOUR COLORS
Standard Red
Yellow
High Efficiency Red
High Performance Green
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
• COMPACT CERAMIC PACKAGE
• WIDE VIEWING ANGLE
• END STACKABLE FOUR CHARACTER
PACKAGE
•
•
•
•
TTL COMPATIBLE
5 x 7 LED MATRIX DISPLAYS FULL ASCII SET
CATEGORIZED FOR LUMINOUS INTENSITY
HDSP-2001/2003 CATEGORIZED FOR COLOR
Description
The HDSP-2000/-2001/-2002/-2003 series of displays are 3.B
mm (0.15 inch) 5 x 7 LED arrays for display of alphanumeric
information. These devices are available in standard red,
yellow, high efficiency red, and high performance green.
Package Dimensions
. _ _ _ 1.6991
17.7SMAX•••••
I
I--.....l
I_see
Typical Applications
•
"
•
•
INDUSTRIAL PROCESS CONTROL EQUIPMENT
BUSINESS MACHINES
PROGRAMMABLE LEGEND SWITCHES
MEDICAL INSTRUMENTS
o MILITARY GROUND SUPPORT EQUIPMENT
o COMPUTER PERIPHERALS
Each four character cluster is contained in a 12 pin dual-inline package. An on-board SIPO (SeriaHn-Paraliel-Out)
7-bit shift register associated wiih each digit controls constant current LED row drivers. Full character display is
achieved by external column strobing.
""'' l
NOTE 4
I COLUMN
FU~~TIO.N1 ~PI.N7 FUNCTI~~_
DATA OUT
t~--.· ~6ill~~·r ~ __ :~ -~~.
-;J
fp'N
J
1
I
4
5
_ 6
3.71 REf. He
1.290'
{.146)
1
/ " "'4'.13 __
PIN 1 MARKED BY
1.1-15 ' .0051
COLUMN 4
COLUMN 5
-
t INt _C~NN'ECP ~
10
11
-12
CLOCK
GROUND"
I~
I?ATA
"DONO"!' CONNECT OR USE
I
DOT ON SACK OF
PACKMe.
NOTES;
1. DIMENSiON$IN nun {mchtsl.
2. UNl£SS OTHERWISE: SF>SCfFleO TIU!
TOLERANCE ONAf..f..DIM£NSIONS
1$ ~,:t8mm
1~.{)1&"}
3, LEAD MATERIAL IS
COPPJ::R: AU.OY,
4, CHARACTER$ ARE CE:NTEREO
w,TH RESPeCT TO lMo$ W*THtN:
,.,3mlTll·.005"l.
1,21 __
(,050)
7-46
Absolute Maximum Ratings (HDSP-2000/-2001 /·2002/-2003)
Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB •. . . . . . . . . . . . . . .. -0.5V to Vee
Column Input Voltage, VeOl ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TA[1.2] ......... -20°C to +85°C
Storage Temperature Range, Ts ..... -55°C to +100°C
Maximum Allowable Power Dissipation
at TA = 25° C[1,2,3] ..•..........•..•.•.... 1.24 Watts
Maximum Solder Temperature 1.59 mm 10.063 in)
Below Seating Plane t < 5 sec ................ 260° C
Recommended operating Conditions
(HDSP-2000/-2001/-2002/-2003)
Parameter
Supply Vol1age
Data Out CUHent, Low State
Data Out Current. High State
Column Input Voltage,'oolumn On HOSP-2000
Column Input Voltage, Column On, HDSP-2001/-2002f-2003
Setup Time
Hold Time
Width of Clock
Clock Frequency
Clock Transition Time
Free Air Operating Temperature Rangep,21
SYmbol
Vee
IOl
IOH
VeOl
VeOl
Min.
Nom.
4.i5
5.0
fclock
tTHl
TA
-20
thold
tw(Clock)
V
mA
mA
V
V
ns
ns
ns
MHz
ns
°C
3.5
3.5
2.4
275
70
30
75
0
tsel up
Units
Max.
5.25
1.6
-0.5
45
0
3
200
85
Fig.
4
4
1
1
1
1
1
2
Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified I
,;'Descrlption
. Supply Current
Symbol
lec
Column Current at any Column Input
Column Current at any Column Input
Vs, Clock Or Data Input ThreshOld High
oNs, Clock Or Data Input Threshold Low
input Current Logical 1
Vs, Clock
Data In
Input Current Logical 0
Va, Clock
Data In
Data Out Voltage
Power DiSSipation Per Package"
Thermal Resistance IC
Junclion·to·Case
ICOl
ICOL
VIM
Vil
hH
hH
hL
hl
VOH
VOL
PD
Test Conditions
Vec = S.25V
VClOCK - VOATA 2.4V
All SR Stages =
Logical 1
Vcc=5.25 V
VeOl =3,5V
All SR Stages ~ logical 1
=
Vee
~
VeOl
~
mA
Vs= 2.4V
73
95
mA
Vs = OAV
Va = 2.4V
~
335
500
I"A
410
rnA
V
V
2.0
0,8
20
2.4V
10
Vec=4.75V, IOH --a.SmA, leOl = 0 mA
Vee - 4.7SV, IOl = 1.6 mA, leal = rnA
Vee - S.OV, VCOl - 3.5V, 17.5% OF
15 LEOs on per character, Va 2.4V
°
=
R&J-c
2.4
80
40
-500
·250
3.4
-800
0.2
004
-400
Fig:
4
J1A
iJA
I"A
I1A
V
V
0,72
W
2
25
°CIW!
Device
2
"Power dissipation per package with four characters illuminated.
7-47
._-_......__._.__......
Uillts
60
Vec = 5,25V, Vil = OAV
Notes:
1. Operation above 85°C ambient is possible provided the
following conditions are met. The junction should not
exceed 125°C TJ and the case temperature las measured
at pin 1 ·or the back of the display I should not exceed
100°CTc.
.---.-.-~
Max.
45
Min•
4.7SV
Vee = 5,25V, Viti
'All typical values specified at Vee = 5.0V and TA = 25°C unless
otherwise noted.
----~
Typ"
Vs =0.4V
2. The device should be derated linearly above 50°C at 16.7
mW/oC. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at
35°C/W per device. See Figure 2 for powerderatings based on
a lower thermal resistance.
3. Maximum allowable dissipation is derived from Vce - 5.2SV,
Vs = 2.4V, VeOL = 3.5V 20 LEOs on per character, 20% OF.
optical Characteristics
STANDARD RED HDSP-2000
Description
Peak Luminous Intensity per LEDI4.SI
!Character Average)
Peak Wavelength
Dominant Wavelength[7J
Symbol
I,Peak
Test Conditions
Vee'"' 5.0V, VeOL - 3.5V
Ti '" 25° CI6J , VB == 2.4V
Min.
Typ.'
Units
Fig.
105
200
,",cd
3
655
639
nm
nm
APEAK
Ad
Max.
YELLOW HDSP-2001
Description
Peak Luminous Intensity per LE014.81
(Character Average)
Peak Wavelength
Dominant Wavelengthl S,7j
Symbol
IYPeak
Test Coridltlons
Vee - 5.0V, VeOL - 3.5V
TI = 25° CI6J, VB"" 2.4V
Min.
Typ:
Units
Fig.
400
750
,",cd
3
583
585
nm
nm
• APEAK
Ad
Max.
HIGH EFFICIENCY RED HDSP-2002
Description
Peak Luminous IntenSity per LED14.61
(Character Average)
Peak Wavelength
Dominant Wavelength[7J
I Symbol
I
I
J
IvPeak
Test Coridllii:ms
Vee == 5.0V, VeOl - 3.5V
Ti = 25·C[61, VB'" 2.4V
Min.
Typ.'
Units
Fig.
400
1430
,",cd
3
635
626
nm
nm
APEAK
Ad
Max.
HIGH PERFORMANCE GREEN
HDSP-2003
-Description
Peak Luminous Intensity per LED!4.81
(Character Average)
Peak Wavelength
Dominant Wavelengthl5.7J
Symbol
IvPeak
Test Conditions
Vee'" 5.0V, VeOl - 3.5V
Ti '" 25° CI6J, Va = 2.4 V
APEAK
Ad
Typ:
Units
Fig.
850
1550
/lcd
3
568
nm
nm
Max.
574
'All typical values specified at Vce == 5.0V and TA == 25'C unless
otherwise noted.
Notes:
4. The characters are categorized for luminous intensity with the
intensity category designated by a letter code on the bottom of
the package.
5. The HDSP-2001/-2003 are categorized for color with the color
category designated by a number code on the bottom of the
package.
6. Ti refers to the initial case temperature of the device immediately prior to the light measurement.
Min.
"Power dissipation per package with four characters illuminated.
Dominant wavelength Ad. is derived from the CIE chromaticity
diagram. and represents the single wavelength which defines
the color of the device.
S. The luminous sterance of the LED may be calculated using the
following relationships:
Lv (cd/m2) == Iv (Candela)/A (Metre)2
Lv IFootlamberts) == rrlv ICandela)/A IFoot)2
A == 5.3 X 10.8 M2 == 5.S X 10-7 I Footl2
7.
Electrical Description
column 1 input is now enabled for an appropri'ate period of
time, T. A similar process is repeated for columns 2, 3, 4
and 5. If the time necessary to decode and load data into
the shift register is t, then with 5 columns, each column of
the display is operating at a duty factor of:
The HDSP-200X series of four character alphanumeric displays have been designed to allow the user maximum
flexibility in interface electronics design. Each four character display module features DATA IN and DATA OUT
terminals arrayed for easy PC board interconnection.
DATA OUT represents the output of the 7th bit of digit
number 4 shift register. Shift register clocking occurs on
the high to low transition of the clock input. The like
columns of each character in a display cluster are tied to a
single pin. Figure 5 is the block diagram for the displays.
High true data in the shift register enables the output
current mirror driver stage associated with each row of
LEDs in the 5 x 7 diode array.
T
D.F.= 5 (t + T)
Thetime frame, t + T, alloted toeach column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on I at a
minimum rate of 100 times per second.
With columns to be addressed. this refresh rate then gives a
value for the time t + T of:
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power consumption.
1/[5 x (100)1 = 2 msec
If the device is operated at 3.0 MHzclock rate maximum, it is
possibleto maintain t« T. Forshort display strings, the duty
factor will then approach 20%.
In the normal mode of operation, input data for digit 4
column 1 is loaded into the 7 on-board shift register locations 1 through 7. Column 1 data for digits 3, 2 and 1 is
similarly shifted into the display shift register locations. The
Forfurther applications information, refer to HP Application
Note 1016.
7-48
CLOCK
SERIAL
DECODED
DATA
INPUT
CLOCK
SERIAL
DECODED
DATA
OUTPUT
DATA IN
BLANKING
CONTROL
DATA OUT
htll,t"JIt
PrOp1;IgatiQO
Ct
delay CLOCK
to OArAoUT
=
15pF
RI.=2.4KU
125
n'S
Figure 1. Switching Characteristics HDSP-2000/-2001/-2002l-2003
ITA = _20· C to +85· C)
5
COLUMN DRIVE INPUTS
Mechanical and
Thermal Considerations
Figure 5. Block Diagram 01 HDSP-2000/-2001/-2002l-2003
The HDSP-2000/-2001/-2002/-2003 are available in standard
ceramic dual-in-line packages. They are designed for
plugging into sockets or soldering into PC boards. The
packages may be horizontally or vertically stacked for
character arrays of any desired size. Full power operation
(Vee = S.2SV, VB = 2.4V, VeOl = 3.SV) with worst case
thermal resistance from IC junction to ambient of 60· C/watVdevice is possible up to ambient temperature of SO° C. For
operation above SO°C, the maximum device dissipation
should be derated linearly at 16.7 mW/oC (see Figure 2).
With an improved thermal design, operation at higher
ambient temperatures without derating is possible.
Power derating for this family of displays can be achieved
in several ways. The power supply voltage can be lowered
to a minimum of 4.7SV. Column Input Voltage, VCOL, can
be decreased to the recommended minimum values of 2.4V
for the HDSP-2000 and 2.7SV for the HDSP-2001/-2002/2003. Also, the average drive current can be decreased
through pulse width modulation of VB' Please refer to HP
Application Note 1016 for further information.
The HDSP-2000/-2001/-2002/-2003 displays have glass
windows. A front panel contrast enhancement filter is
desirable in most actual display applications. Some
suggested filter materials are provided in Figure 6.
Additional information on filtering and constrast
enhancement can be found in HP Application Note 101S.
~s
~;:
0
1
~z
~Q
Polaroid
HNCP10-Glass
Marks Polarized
(HP Greenj
MPC·010'·5-12
Note: 1. Optically coated circular polarized filters, such as
Polaroid HNCP10.
Figure 6. Contrast Enhancement Filters
500
in
-
I.'
-
.......
~
1.2
"'i;;
::I~
0.8
"'0:
D•• I--
APJA' 50'C/W
I
,
J
',/
RtJJA" 4O"C/W
D••
11.1.1
r--
!
til/
00
f/-
ill
10
20
30
40
50
I
ill0:
~
0:
::I
~
~
V
u
,.
z
t
:E
~
I
100
"~
0:
70
eo
~
~
~
~
~
~
~
TJ - JUNCTION TE~PERATURE _·c
TA -AMBIENT TEMPERATURE _·c
- - - - - - - - - - - - - - - - - - _.. _----_..-----
0
Figure 3. Relative Luminous Intensity
vs. Temperature
7-49
.. -- ....
00
rt
....
-
'I
,I HDSP-2QOIf-2OW-2003
]
~
90 100
Figure 2. Maximum Allowable Power
Dissipation vs. Temperature
bUi
HOSNOOO
3
8
200
w
3
>
>=
60
300
z
0
J~~
~o
I-
3.0
I-
1
0.2
~
0:
100
TA -AMBIENT TEMPERATURE _
°c
FIgure 5. MaxImum Allowable Power
DIssIpatIon vs. Temperature
400
0:
0:
1.0
""z
HDSP._
~ ~ HD~
" I
"
-20
1IDSP·2303
20
40
60
80
'~"
r-r-
I
]
100
TJ - JUNCTION TEMPERATURE _
120
140
°c
FIgure 6. RelatIve LumInous IntensIty
vs. Temperature
7-53
8
~"
VeOL -COLUMN VOLTAGE -VOLTS
FIgure 7. Peak Column Current vs.
Column Voltage
Electrical Description
CLOCK
The HDSP-230X series of four character alphanumeric displays have been designed to allow the user maximum
flexibility in interface electonics design. Each four character display module features DATA IN and DATA OUT
terminals arrayed for easy PC board interconnection. DATA
OUT represents the output of the 7th bit of digit number 4
shift register. Shift register clocking occurs on the high to
low transition of the Clock input. The like columns of each
character in a display cluster are tied to a single pin. Figure
5 is the block diagram for the displays. High true data in
the shift register enables the output current mirror driver
stage associated with each row of LEOs in the 5 x 7 diode
array.
SERIAL
SERIAL
DECODED
DATA
OUTPUT
DECODED
DATA
INPUT
BLANKING
CONTROL
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power
consumption.
In the normal mode of operation, input data for digit 4
column 1 is loaded into the 7 on-board shift register locations 1 through 7. Column data for digits 3, 2, and 1 is
similiarly shifted into the display shift register locations.
The column 1 input is now enabled for an appropriate
period of time, T. A similar process is repeated for columns
2,3,4 and 5. If the time necessary to decode the load data
into the shift register is t, then with 5 columns, each
column of the display is operating at a duty. factor of:
COLUMN DRIVE INPUTS
Figure 8. Block Diagram 01 HDSP-2300/-2301/-2302/-2303
T
D.F. = 5 (1+ T)
The time frame, t + T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
HOSP·2001
(Yellow)
(HER)
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:
HOSP-2003
(HP Green)
1/[5 x (100)) = 2 msec
Panelgra-phlc
Chequers Grey
Ruby Red 60
105
Chequers Red 112
Panelg1aph,<
Green 48
Chequers Green
107
POlaroid
HNCP10~Glass
Marks Pofatized
MPC·OZ01·2·22
Polaroid
HNCP10,G,."
Marks Polarized
MPC·OlO,·5·12
Note: 1. Optically coated circular pOlarized lilters, such as
Polaroid HNCP10.
If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t« T. For short display strings, the duty
factor will then approach 20%.
Figure 9. Contrast Enhancement Fillers
Forfurther applications information, refer to HP Application
Note 1016.
Mechanical and Thermal Considerations
The HDSP-2300/-2301/-2302/-2303 are available in standard
ceramic dual-in-line packages. They are designed for plugging into sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character arrays
of any desired size. The HDSP-2301/-2302/-2303 utilize a
high output current IC to provide excellent readability in
bright ambient lighting. Full power operation (Vee = 5.25V,
VB = 2.4V, VeOL = 3.5V) with worst case thermal resistance
from IC junction to ambient of 60° C/waU/device is possible
up to ambient temperature of .37° C. For operation above
37° C, the maximum device dissipation should be derated
linearly at 16.7 mWrC (see Figure 5). With an improved
thermal design, operation at higher ambient temperatures
without derating is possible. Please refer to HP Application Note 1016 for further information.
The HDSP-2300 uses a lower power IC, yet achieves excellent readabilty in indoor ambient lighting. Full power
operation up to TA = 50° C (Vee = 5.25V, VB = 2.4V, VeOL =
3.5V) is possible byproviding a total thermal resistance from
IC junction to ambient of 60° C/wattldevice maximum. For
operation above 50° C, the maximum device dissipation
should be derated at 16.7 mW/o C/device (see Figure 2).
7-54
------------.-.----_.-
Power derating for this family of displays can be achieved in
several ways. The power supply voltage can be lowered to a
minimum of 4.75V. Column Input Voltage, VeOl, can be
decreased to the recommended minimum values of 2.6V for
the HDSP-2300 and 2.75V for the HDSP-2301/-2302/-2303.
Also, the average drive current can be decreased through
pulse width modulation of VB.
The HDSP-2300/-2301/-2302/-2303 displays have glass
windows. A front panel contrast enhancement filter is desirable in most actual display applications. Some suggested
filter materials are provided In Figure 9. Additional information on filtering and constrast enhancement can be found in
HP Application Note 1015.
Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is
permissible. Suggested solvents include Freon TF, Freon
TE, Genesolv DI-15, Genesolv DE-15, and water.
NOTE:
The HDSP-2301/-2302/-2303 are available in high intensity categories suitable for some applications where direct sunlight
viewing is required. For information on displays and filters for
sunlight viewable applications, contact your field salesman.
7-55
rlidl
FOUR CHARACTER 6.9 mm (0.27 INCH)
5X7 ALPHANUMERIC DISPLAYS
HEWLETT
STANDARD RED
YEllOW
HIGH EFFICIENCY RED
HIGH PERFORMANCE GREEN
~t:. PACKARD
HDSp·2490
HDSP-2491
HDSP-2492
HDSP-2493
Features
• FOUR COLORS
Standard Red
Yellow
High Efficiency Red
High Performance Green
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
• COMPACT CERAMIC PACKAGE
• WIDE VIEWING ANGLE
• END STACKABLE FOUR CHARACTER
PACKAGE
•
•
•
•
Typical Applications
TTL COMPATIBLE
5 x 7 LED MATRIX DISPLAYS FULL ASCII SET
CATEGORIZED FOR LUMINOUS INTENSITY
HDSP-2491/2493 ALSO CATEGORIZED FOR
COLOR
•
•
•
•
•
•
Description
The HDSP-2490/-2491/-2492/-2493 series of displays are 6.9
mm (0.27 inch) 5 x 7 LED arrays for display of alphanumeric
information. These devices are available in standard red,
yellow, high efficiency red, and high performance green.
Each four character cluster is contained in a 28 pin dual-inline package. An on-board SIPO (Serial-ln-Parallel-Out)
7-bit shift register associated with each digit controls constant current LED row drivers. Full character display is
achieved by external column strobing.
package Dimensions
35~.
~-4jjl.'$)
I
~-t-~
I
1
PIN1
MAAKED
&YIlOT
OHeAd(
OF
PACkA~E,
I
L_
.....(~:)-
I
I
I
_J
I
I
I
L_
I
-,
I
r- -1
r-
I
I
I
2-+----+-3
I
_J
I
I
L_
I
I
I
_J
I
-T
I
4-j-
I
L_
1
2
COLUMN 1
,.
FUNCTION
NO CONNECT
DATA OUT
3
COLUMN 1
17
DATA OUT
PIN
_L
[I
11
-
.voI
•••
•
7
9
10
11
12
13
14
!ii-ru
US)
2.54
(1.400) MAX.
I
r-
INSTRUMENTS
BUSINESS MACHINES
INDUSTRIAL PROCESS CONTROL EQUIPMENT
MEDICAL INSTRUMENTS
COMPUTER PERIPHERALS
MILITARY GROUND SUPPORT EQUIPMENT
31.2
(1.23)
aao 1.1
(~~-----------------------------------;
7-56
FUNCTIONI 11
NO CONNECT
COLUMN 2
PIN
15
,.
19
COLUMN 3
20
COLUMN 3
21
COLUMN 4
22
COLUMN 4
23
COLUMN 5
2'
COLUMNS
25
INT. CONNECTIZ I 2.
INT. CONNECTIZI 27
NO CONNECT
2'
COLUMN 2
V,
V,
V"
V"
CLOCK
CLOCK
GROUND
GROUND
DATA IN
DATA IN
NOCONNECT
--_._--_.. _-_ .. _.. _ - - - - - - - - - - - -
-----
Absolute Maximum Ratings (HDSP-2490/-2491/-2492/-2493)
Supply VOlt~e Vee to Ground .......... -0.5V to 6.0V
Inputs, Data ut and Vs •.............. " -0.5V to Vee
Column Input 1I0itage, VeOl ............ -0.5V to +6.0V
Free Air Opera ,ng
Temperature Range, TA[1,21 ........ ·-20°C to +85°C
Storage Temperature Range, T5 ..... -55°C to +100°C
Maximum Allowable Power Dissipation
at TA = 25°C 1,2.3 . . . . . . . . . . . . . . . . . . . . . . . . . 1.46 Watis
Maximum Solder Temperature 1.59 mm (0.063 in.)
Below Seating Plane t < 5 sec ................ 260° C
Recommended operating Conditions
(HDSP-2490/-2491/-2492/-2493)
Electrical Characteristics Over operating Temperature Range
(Unless otherwise specified)
Description
Supply Current
Symbol
Icc
Column Current at any Column Input
leoL
Column Current at any Column Input
VB, Clock or Data Input Threshold HiQh
Vs, Clock or Data I nput Threshold Low
Input Current Logical 1
Va, Clock
Data In
Input Current Logical 0
Va, Clock
Data In
leol
VIH
VIL
Data Out Voltage
Power Dissipation Per Package"
Thermal Resistance IC
Junction-to-Case
hH
hH
ilL
hL
VOH
VOL
PD
Test Conditions
Vee-5.25V
VClOCK = VOATA = 2.4V
All SR Stages =
Logical 1
Vee=5.25V
VCOl =3.5V
All SR Stages = Logical 1
Typ.-
Max.
UnUs
VB"'0.4V
45
6()
mA
VB =2.4V
73
95
rnA
Min.
VB =O.4V
380
Va=2AV
Vce = Veol = 4.75V
2.4
~
-250
-400
3.4
0.2
0.4
0_78
20
V
V
W
-oCIWI
Device
4
2
2
"Power c;lisslpation per package with four characters Illuminated.
'All typical values specified at Vce = 5.0V and TA = 25° C unless
otherwise noted. .
Notes:
1. Operation above 85° C ambient is possible provided the
following conditions are met. The junction should not
exceed 125°C TJ and the case temperature (as measured
at pin 1 or the back of the display I should not exceed
100°CTe.
7-57
- - - - - - - - - - - - - - - _.._---_._ .. __ . _ .__ ... -
rnA
V
V
0.8
Vee = 5.25V, Vil =_ ~.4V
R8J-c
/lOA
520
2.0
Vee = S.25V, VIIi = 2.4V
Vee - 4.75V, 10H '" -0.5 rnA, leoL - 0 rnA
Vee -4.75V.loL = 1.6 rnA, leol - a rnA
Vee - S.OV, VeOl - 3.5V, 17.5% OF
15 LEOs on per character, Ve = 2.4V
500
Fig.
2. The device should be derated linearly above 60° C at
22.2 mW/oC. This derating is based on a device mounted In a
socket having a thermal resistance from case to ambient at
25° C/W per device. See Figure 2 for powerderatings based on
a lower thermal resistance.
3. Maximum allowable dissipation Is derived from Vee = 5.25V, Ve
= 2.4V, VeOl = 3.5V20 LEOs on per character, 20% OF:
.
------
optical Characteristics
STANDARD RED HDSP-2490
Description
Peak Luminous Intensity per LED14,81
(Character Average)
Peak Wavelength
Dominant Wavelength[7]
Symbol
IvPeak
Test Conditions
Vee = 5.0V, VeOl = 3.5V
TI '" 25°CI61, VB'" 2.4V
Min,
Typ,'
220
APEAK
Ad
Max,
Units
Fig.
370
licd
3
655
639
nm
nm
YELLOW HDSP-2491
Description
Peak Luminous Intensity per LED14,81
(Character Average)
Peak Wavelength
Dominant Wavelengthl5 , 7}
Symbol
IvPeak
TesfC:ondjtlons
Vee'" 5.0V, VeOl = 3.5V
TI '" 250 Clel, Vs '" 2.4V
Unlls 1 Fig.
Min.
Typ.-
S50
1400
}LCd
I
563
585
nm
nm
I
I
APEAK
Ad
Max.
I
31
I
I
HIGH EFFICIENCY RED HDSP-2492
Description
Peak Luminous Intensity per LED14.81
(Character Average)
Peak Wavelength
Dominant Wavelength!?!
SymbOl
I.Peak
APEAK
Ad
Test Conditions
Vee'" 5.0V, VeOL '" 3.5V
TI = 25~CI61, Va = 2.4V
Min.
Typ,*
Units
Fig,
850
1530
}Lcd
3
635
626
nm
nm
,
Max.
HIGH PERFORMANCE GREEN HDSP-2493
Description
Peak Luminous Intensity per LED14.81
(Character Average)
Peak Wavelength
Dominant Wavelength [5,71
'All typical values specified at Vcc
otherwise noted.
~
5.0V and TA
Symbol
Ivp~ak
Test Conditions
Vee = 5.0V, VeOl "" 3.5V
T1 = 25" Cl61, VB = 2.4 V
Typo"
2410
Max.
568
574
APEAK
Ad
~
Min.
1280
25°C unless
I
Units
~
Fig.
3
nm
"Power dissipation per package with four characters illuminated.
Nol.s:
4. The characters are categorized for luminous intensity with the
intenSity category designated by a letter code on the bottom of
the package.
5. The HDSP-2491/-2493 are categorized for color with the color
category deSignated by a number code on the bottom of the
package.
6. T; refers to the initial case temperature of the device immediately prior to the light measurement.
7. Dominant wavelength Ad, is derived from the CIE chromaticity
diagram, and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv (cd/m21 ~ Iv (Candelal/A (Metre)2
Lv (Footlambertsl ~ 7rlv (Candelal/A (Foot)2
A ~ 5.3 X 10.8 M2 ~ 5.8 x 10-7 (Footl2
Electrical Description
column 1 input is now enabled for an appropriate period of
time, T. A similar process is repeated for columns 2, 3, 4
and 5. If the time necessary to decode and load data into
the shift. register is t, then with 5 columns, each column of
. the display is operating at a duty factor of:
The HDSP-249X series of four character alphanumeric
displays have been designed to allow the user maximum
flexibility in interface electronics design. Each four character display module features DATA IN and DATA OUT
terminals arrayed for easy PC board interconnection. DATA
OUT represents the output of the 7th bit of digit number 4
shift register. Shift register clocking occurs on the high to
low transition of the clock input. The like columns of each
character ina display cluster are tied to a single pin.
Figure 5 is the block diagram for the displays. High true
data in the shift register enables the output current mirror
driver stage associated with each row of LEDs in the 5 x 7
diode array.
OF =_T_
., 5 (t +T)
The time frame, t + T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power consumption,
1/[5 x (100)J = 2 msec
In the normal mode of operation, input data for digit 4
column 1 is loaded into the 7 on-board shift register locations 1 through 7. Column 1 data for digits 3, 2 and 1 is
similarly shifted into the display shift register locations. The
7-58
If the device is operated at 3,0 MHz clock rate maximum, it is
possible to maintain t« T. For short display strings, the duty
factor will then approach 20%,
Forfurther applications information, refer to HP Application
Note 1016.
CLOCK
2.4V
SERIAL
DECODED
DATA
INPUT
CLOCK
0.4V
SERIAL
DECODED
DATA
OUTPUT
2.4V
DATA IN
O.4V
~
2.4V
DATA OUT
0.4V·-----+.J
P'''.meler
~
klOCk
CLOCK Aajc
tnit
Propagation
delay CLOCK
r-'PHL
-I
Condillon Min. Typ. MaJ[,
BLANKING
CONTROL
Units
3
MHz
125
ns
trill.
CI "" 15pr
Rl",,24KH
to DATA OUT
Figure 1. Switching Characteristics HDSP-2490/-2491/-2492/-2493
(TA = _20 0 C to +85 0 C)
S
COLUMN DRIVE INPUTS
Mechanical and
Thermal Considerations
Figure 5. Block Diagram of HDSP-2490/-2491/-2492/-2493
filter materials are provided in Figure 6. Additional information on filtering and contrast enhancement can be found in
HP Application Note 1015.
The HDSP-2490/-2491/-2492/-2493 are available in standard
ceramic dual-in-line packages. They are designed for plugging into sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character arrays
of any desired size. The HDSP-2490/-2491/-2492/-2493 utilize a high output current IC to provide excellent readability
in bright ambient lighting. Full power operation (Vee =
5.25V, VB = 2.4V, VeOL = 3.5V) with worst case thermal
resistance from IC junction to ambient of 45 0 C/wattidevice
is possible up to ambient temperature of 60 0 C. For operation
above 60 0 C, the maximum device dissipation should be
derated linearly at 22.2 mW/ o C (see Figure 2). With an
improved thermal design, operation at higher ambient
temperatures without derating is possible. Please refer to
Application Note 1016 for further information.
Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is
permissible. Suggested solvents include Freon TF, Freon
TE. Genesolv DI-15, Genesolv DE-15, and water.
Power derating for this family of displays can be achieved in
several ways. The power supply voltage can be lowered to a
minimum of 4.75V. Column Input Voltage, VeOL, can be
decreased to the recommended minimum values of 2.4V for
the HDSP-2490 and 2.75V for the HDSP-2491/-2492/-2493.
Also, the average drive current can be decreased through
pulse width modulation of VB.
HDSP"2Q02
(HER)
Chequers
HDSP';2003
(HPGreeni
Panelgraphlc
Green 48
t07
Note: 1. Optically coated circular polarized filters. such as
Polaroid HNCP10.
Figure 6. Contrast Enhancement Filters
soo
4.0
1.8
~
S
~~
1,4
~~
1,2
~~
R'''i..I5{iW
+±
:i:
o. 6
Ef~
0.4
IW
I
3.0
1.0
~ ~ o.
""c:
~
1,6
~ "~~
I1JA "36 CIW
a
10
.:s,
HPSP·249·2491/·!49U·24$3
60
80
100
120
140
Figure 3. Relative Luminous Intensity
vs. Temperature
7-59
I
.
100
0
20
TJ -JUNCTION TEMPERATURE _ °C
J
HOSP·2400
z
,... Hosp·24a2
O. 2
0
400
ffi
"
2.0
POlarOid
HNCP10·(;lass
Marl..s polarized
MPC-0201-2-22
Polaroid
HNCP11)·Gla$!iMarks PolariZed
MPC·0101-5--12
112
CheQuers Gre-en
The HDSP-2490/-2491/-2492/-2493 displays have glass
windows. A front panel contrast enhancement filter is desirable in most actual display applications. Some suggested
2.0
Chequer$ Grey
105
Panefgr"phlC
AubyRed
"""
1.0
2.0
3.0
4.0
VCOL - COLUMN VOLTAGE - VOLTS
Figure 4. Peak Column Current vs.
Column Voltage
S.O
SMART DISPLAY
BOARD FAMILY
F/idl HEWLETT
II.!~ PACKARD
16 AND 32 CHARACTER
2.85 mm (0.112) AND 4.1 mm (0.16)
HDSP~6621
HDSP-6624
Features
• FULLY ASSEMBLED
• FUNCTIONALLY TESTED
• INCLUDE ON-BOARD CHARACTER
GENERATOR, MEMORY, DRIVER, DECODER,
MULTIPLEX, AND BUFFER CIRCUITRY
• 64 ASCII CHARACTER SET
• ALL DIGITS ALIGNED AND MATCHED
FOR INTENSITY
• 2.85 mm (0.112) or 4.1 mm (0.16)
CHARACTER HEIGHT
• VIEWING ANGLE GREATER THAN ±40o
• SINGLE 5 V POWER SUPPLY
• FULL TTL COMPATIBILITY
Description
The HDSP-6621 and HDSP-6624 smart display systems are
board assemblies based on the HPDL-1414 and HPDL-2416
displays. The HDSP-6621 consists of four HPDL-1414
displays (16 characters) plus a decoder and interface buffer
on a single printed circuit board. The HDSP-6624 consists
of eight HPDL-2416 displays (32 characters) plus a decoder
and interface buffers on a single printed circuit board. Each
display provides its own character memory, 64 character
ASCII decoder ROM, and refresh circuitry necessary to
synchronize the decoding and driving of four 17 segment
red LEDs. The HDSP-6624 has the additional features of a
cursor (all dots on) or a blanking (flashing) function. The
characters in each system are aligned and matched for
intensity.
The HDSP-662X family can be configured in custom string
lengths, and the HDSP-6621 is available without a connector. Contact your local Hewlett-Packard field sales
representative with your requirements.
Typical Applications
• COMPUTER PERIPHERALS
• TELECOMMUNICATIONS
• INDUSTRIAL EQUIPMENT
• INSTRUMENTS
Absolute Maximum Ratings
Supply Voltage, Vee to Ground .............. -0.3 to 7.0 V
Input Voltage, Any Pin to Ground ............. -0.3 to Vee
Free Air Operating Temperature Range ....... DOC to 7DoC
Storage Temperature ..................... -4DoC to 85°C
7-60
Package Dimensions
l
°L
HDSP-6621
......... 7.1110.281
PIN
FUNCTION
1
2
3
Ao DIGIT SElECT
Al DrGIT SElECT
04 DATA INPUT
3.175
t
92.08 (3.625}
~t;
o
J13
0
0
0
0
0
o
o
0
0
IL ~~
;--
<==)
I
ffi-r==-
--e:::::J-
12.k5
J
~- ~5}30.4
~
'"
;#
11,20
...
L---II
..-l
'K
'-fo.~}--l
10.82}
3.0 10.11B) DIA 4
PLC~
5
6
7
8
9
10
11
12
13
Do DATA INPUT (LSB)
OJ DATA INPUT
02 DATA INPUT
GND
A3 DIGIT SELECT
WRWRITE
A2 DIGIT SELECT
De DATA INPUT (MSB)
01 DATA INPUT
05 DATA INPUT
Vee
I.
NOTES,
1. TOLE RANCES; HOLES, 0.254 (0.011
ALL OTHERS, 0.50810.021
2. DIME NSIONS IN MILLIMETRES {INCHES}
56.3912.22)
package Dimensions
•
HDSP-6624
1---------------223.5218.80)--------------0.1
r<----------------215.80 (8.50)---------------1
1-------114,30 (4.501-------1
3.91 10.1541 DIA. 8 PLACES
00 NOT USE FOR MOUNTING
6,80 (0.261
L
II
A
CONNECTOR
I
CONNECTOR Jl
MONNECTOR
PIN 1~
CONNECTOR J2
Jl
I
V-PIN 2
"
CONNECTOR
Jl
"J
J
ll
BERG
3M
66900-026
3399-6000
J2
POWER
MOLEX
09-50-7041 HOUSING
08-50-0105 TERMINAL
PIN
1
2
3
"'-PIN 26
NOTES
1, TO !.fRANCES to.508 (D.02) t 0.264 (0,010)
2. SHU NT BAR PROVIDED WITH THE UNIT IS AMP PiN 531220-3
J2
3. DIM ENSIONS IN MII.LIMETRES (INCHES)
7-61
RECOMMENDED
MATING CONNECTOR
FUNCTION
CONTROL DATA
•
:~
PIN 25
I
J1
5
6
7
8
9
10
11
12
13
1
2
FUNCTION
A2 ADDRESS LINE
DE4 DISPLAY ENABLE
~DDRESSLINE
DE3 DISPLAY ENABLE
A4 ADDRESS LINE
DE, DISPLAY ENABLE
NO CONNECTION
DE2 DISPLAY ENABLE
DO DATA LINE
NO CONNECTION
D1DATALlNE
NO CONNECTION
02 DATA LINE
G'ND
Vee
PIN
I.
15
16
17
18
19
20
21
22
23
2.
25
26
3
•
FUNCTION
NO CONNECTION
06 DATA LINE
NO CONNECTION
04 DATA LINE
CUE CURSOR ENABLE
Os DATA LINE
CURSOR SElECT
Ao ADDRESS LINE
co
erR
CLEAR
A, ADDRESS LINE
WRWRITE
03 DATA LINE
BLBLANKING
Vee
GND
Recommended operating Conditions
Symbol
Min.
Nom.
Supply Voltage
Vee
4.75
5.0
5.25
V
Input Voltage High
V'H
VIL
2.0
Vee + 0.3
V
GND - 0.3
0.8
V
Parameter
Input Voltage Low
Electrical Characteristics
Parameter
Max,
Units
Over Operating Temperature Range
HDSP-6621
Max,
1}tp.
HDSP-6624
Typ.
Max,
315
720
Icc AU digits on (10 seg/digit)l1)
480
1200
1040
Icc Cursorl2. 3J (HDSP-6624 only)
1600
40
Icc Blank
30
Units
Test Conditions
mA
Vee ~ 5.0V
mA
Vee=5.25V
mA
Vee" 5.0V
mA
Vee = 5.25 V
mA
Vee" 5.0V
75
80
mA
Vee'" 5.25V
'IH with pullup
NA
-2.85
mA
Vee" 5.25 V, VIH ~ 2.4 V
IlL with pullup
NA
-4.85
mA
Vee" 5.25 V, V'L =0.4 V
IIH with pulldown
NA
2.4
mA
Vee" 5.25 V, VIH " 2.4 V
IlL with pulldown
NA
0.4
mA
Vee ~ 5.25 V, VIL " 0.4 V
IIH without resistor
40
40
J1.A
Vee" 5.25 V, VIH " 2.4 V
IlL without resistor
-1.6
-1.6
mA
Vee ~ 5.25 V, VIL '" 0.4 V
Notes:
1. "%" illuminated in all locations.
2. Cursor character is sixteen segments and DP on.
3. Cursor operates continuously over operating temperature range.
optical Characteristics
Symbol
Parameter
Peak Luminous Intensity per digit.
8 segments on (character average)
HDSP-6624
HDSP-6621
Peak Wavelength
Dominant Wavelength
011 Axis Viewing Angle
Digit Size
IvPeak
Min.
Typ.
0.5
1.25
0.4
1.0
Units
Test Condition
mcd
Vee'" 5.0 V
in all digits
APeak
655
nm
Ad
640
nm
HDSP-6624
±50
HDSP-6621
±40
HDSP-6624
2.85
HDSP-6621
4.1
deg.
mm
7-62
"*"
illuminated
_ .. _ - - - - - -
._--_._._-
-----_ .. -
AC Timing Characteristics
--------
Over Operating Temperature Range
HDSP.6621
Reference
Number
Parameter
HDSP·6624
Symbol
25"C
Min.
70·C
Min.
25"C
Min.
70"C
Min.
Units
IACC
180
220
350
480
ns
lAS
115
150
285
410
ns
65
70
65
70
ns
1
Access Time
2
Address Setup1!j'llFile
3
Address Hold Time
tAH
4
Write Delay Time
two
15
20
115
180
5
Write Time
tw
100
130
170
230
6
Data Setup Time
......... tos
80
100
160
220
ns
7
Data Hold Time
tDH
65
70
65
70
ns
8
Display Enable Hold Time
toes
N/A
N/A
65
70
ns
9
Display Enable Setup Time
IDEH
N/A
N/A
285
410
ns
Clear Time
teLR
3.5
4.0
3.5
4.0
ms
310
270
310
270
Hz
Refresh Rate
I
ns
ns
TIMING DIAGRAM FOR THE HDSP-6621 DISPLAY SYSTEM
-!.,
r--~
9
DE, -DE4
V
\
2.av
a.BV
i--®-------
6
~
K
~
2.av
a.BV
5
\
2.av
a.BV
..,v
I-®~
-0----
~
DO -06
K
2.av
a.BV
TIMING DIAGRAM FOR THE HDSP-6624 DISPLAY SYSTEM
1
r------
14LSI39
---!:c ill
.---2.
In
wR
IV2
3 IA
AJ - IB
WI
IYO
A2
7
6
5
4
Figure 1. Circuli Diagram for Ihe HDSP·6621
Display Interface
HDSP-6621
Figure 1 shows the circuit diagram for the HDSP-662l
Information is transferred to the display on a 4 pin connector. The following lines are available to the user to pass
data to the display.
For a detailed explanation of the function of the pins see
the HPDL-1414 data sheet. The HDSP-6621 has 2 Address
lines which are not on the HPDL-1414.
Data lines (0 0-06)
(pins 3-6, 11-13)
ASCII data is entered into the display on the Data lines.
Address lines (Ao-A3)
(pins 1-3, 8)
Each location In memory has a distinct address, Address inputs enable the designer
to select a specific location in memory to store data. Address 0000 accesses the far
right location and address 1111 accesses the far left location.
Write line (WR)
(pin9)
Data is written into the display when the display write line is low and the display has
been selected.
7-64
J2
9 ....... 10
26
U2
3 ..... 2
15
.....U2
1~'2
.....U2
7 ...... 6
'9
H
..... U2
9 ....... 10
.....U3
25
13
7..J'o.". 6
......U3
n
5 ..... 4
U3
3 ....... 2
-voo
HPDl~416~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Jio }.1}."}.!!.1
ltd
II I
."
.c
c:
iil
!"
0
a§:
c
-.J
1
ffi
iii"
';
3
g
.
_ _......_..:.'4'1~
21
Vu3
1~12
23
:;:
24
:I:
-20
C
......U3
~8
1:
""""'Ul
+5V
"""-UT
14~15
CU
..... U2
In
l'
'"'"
1R
I CUE
....
'"
22
I
CLR
DEI
DE2
4
I DE3
5 ..... 4
~
+5V
......U2
' .....
13",
2
12
~. II
....Ul
II
II
II
II
II
I:
DE4~
74L$42
H
A,
-b
-
15 ..
14 B
A3
13 C
A,
ALL RESISTORS'" 1 KU
Ul '" 74lS14
L.....E
0
U2, U3 '" Me 14050
SOLIO STATE
DISPLAYS
Display Interface
HDSP-6624
Figure 2 shows the circuit diagram for the HDSP-6624.
Information is transferred to the display on a 26 pin connector. The following lines are available to the user to pass
data to the display.
For a detailed explanation of the function of the pins see
the HPDl-2416 Data Sheet. The HDSP-6624 has four
display enable inputs and 3 address lines which are not on
the HPDl-2416.
Data lines (Do-D6)
(J2 pins 11, 13, 15, 17, 19, 25)
ASCII data or cursor data is entered into the display on the data lines.
Address lines (Ao-A4)
(J2 pins 1, 3, 5, 21, 23)
Each location in memory has a distinct address. Address inputs enable the designer
to select a specific location in memory to store data. Address 00000 accesses the far
right location. Address 11111 accesses the far left location.
Display Enables (DE,-DE4)
(J2 pins 2, 4, 6, 8)
The user can connect anyone of the four Display Enable inputs to all of the CE2
inputs of the HPDl-2416 displays. All that is required is to short the appropriate pins
on the display board with the shorting plug. This allows the user to display the same
character data on two or more systems or to display different data on up to four
display boards.
DE,
DE2
DE3
DE4
=shorting A and B
=shorting Band C
=shorting D and E
=shorting E and F or F and G
Shorting G and H will bypass DE,-DE 4 and enable the device.
Write line (WR)
(J2 pin 24)
Data is written into the display when the Write line is low and the display ha.s been
selected.
Cursor Select line (CU)
(J2 pin 20)
This. input is used to de.termine whether data is stored in ASCII memory or Cursor
memory. (1 =ASCII, a =Cursor)
Cursor Enable line (CUE)
(J2 pin 18)
This input is used to determine whether. Cursor data is displayed. (1
a ~ ASCII)
Blanking input (Bl)
(J2 pin 26)
The Blanking input can be used to create a flashing display or to blank the display
without clearing the ASCII memory. This input inhibits the IC segment drivers and
the display Clear function.
Clear input (ClR)
(J2 pin 22)
ASCII data will be removed from the ASCII Memory after the Clear input has been
held at a logic low for 4 ms. The Cursor data is unaffected by the Clear input.
= Cursor,
using. the Display Interface
Hewlett-Packard's Smart Display Systems can be treated
as a block of RAM locations, whose purpose is to store and
display 64 character .ASCII data using a sixteen-segment
character font as shown in Figure 3. To load data into the
display system, the host .system has. to supply the ASCII
1
0
1
0
o ..
0
1
0
1
0
1
1
0
: 0
1
1
. 1
3
4
5
6
7
D3
D2
Dl
Do
0
0
0
0
0
0
0
1
0
0
1
0
0
0
1
HEX
0
1
2
0
2
(space)
o 1. 1
3
1 0
0
4
1 0
1
5
BITS
D6 DS 04
o
1
data" the address and the proper control signals and the
. character will be stored in the location selected. See the
timing diagram for the necessary timing and signal
sequence.
,
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
o·
1
1
0
1
1
1
1
0
1
1
1
1
8
9
A
B
C
D
E
F
% & / < ) *- + I
0 I 2 j Y 5 5 1 8 g -- -/ L
OJ R B [ lJ E F G H I J K L
P Q R 5 T U V WX Y Z [ \
I
"
:H
gj
Figure 3. HDSP-6621/6624 ASCII Character Set
7-66
-
/
-- ~ ?
MN 0
J
/\
-
Design Considerations
Solvents containing alcohols, ketones and halogenated
hydrocarbons will attack the nylon lens of the displays and
should be avoided.
These display systems use CMOS components that may be
damaged by electrostatic discharge. These display systems
can be safely handled by the PC board edges. To avoid
static damage use standard CMOS handling procedures.
For additional information on handling and cleaning please
refer to the HPDL-1414 and HPDL-2416 data sheets and
Application Note 1026.
Cleaning may be performed with a solvent or aqueous
process. The following solvents may be used without
causing damage to the system:
Allied Chemical Genesolv DES
Baron Blakeslee Blaco-tron TES
DuPont Freon TE
7-67
rli~ HEWLETT
a=~ PACKARD
5 x 7 DOT MATRIX
ALPHANUMERIC
DISPLAY SYSTEM
HDSP-2416
HQSP-2424
HOSP- 2432
HDSP-2440
HOSP-2410
HQSP-2471
HllSp-2472
Features
• COMPLETE ALPHANUMERIC DISPLAY SYSTEM
UTILIZING THE HDSP-2000 DISPLAY
• CHOICE OF 64, 128, OR USER DEFINED ASCII
CHARACTER SET
• CHOICE OF 16, 24, 32, or 40 ELEMENT
DISPLAY PANEL
• MULTIPLE DATA ENTRY FORMATSLeft, Right, RAM, or Block Entry
• EDITING FEATURES THAT INCLUDE CURSOR,
BACKSPACE, FORWARDSPACE, INSERT,
DELETE, AND CLEAR
• DATA OUTPUT CAPABILITY
• SINGLE 5.0 VOLT POWER SUPPLY
Typical Applications
• TTL COMPATIBLE
CI
• EASILY INTERFACED TO A KEYBOARD OR
A MICROPROCESSOR
o
CI
CI
Description
The HDSP-24XX series of alphanumeric display systems
provides the user with a completely supported 5 x 7 dot
matrix display panel. These products free the user's
system from display maintenance and minimize the
interaction normally required for alphanumeric displays.
Each alphanumeric display system is composed of two
component parts:
DATA ENTRY TERMINALS
INSTRUMENTATION
BUSINESS EQUIPMENT
COMPUTER PERIPHERALS
PART NUMBER
1. An alphanumeric display controller which consists of a
preprogrammed microprocessor plus associated logic,
which provides decode, memory, and drive signals
necessary to properly interface a user's system to an
HDSP-2000 display. In addition to these basic display
support operations, the controller accepts data in any
of four data entry formats and incorporates several
powerful editing routines.
2. A display panel which consists of HDSP-2000 displays
matched for luminous intensity and mounted on a P.C.
board designed to have low thermal resistance.
These alphanumeric display systems are also available in
high efficiency red, yellow, and green. In addition, they are
available using the HDSP-2300 or HDSP-2490 series displays to form display systems with larger characters (5.0
mm and 6.9 mm, respectively). Contact your local HP sales
office for more information.
7-68
DESCRIPTION
Display Boards
HDSP-2416
Single-llne 16 character display panel
utifizing the HDSP-2000 display
HDSP-2424
Single-line 24 character display panel
utilizing the HDSP-2000 display
HDSP-2432
Single-line 32 character display panel
utilizing the HDSP-2000 display
HDSP-2440
Single-llne 40 character display panel
utilizing the HDSP-2000 display
Controller Boards
HDSP·2470
HDSP·2000 display interface Incorporating
a 64 character ASOtl decoder
HDSP-2471
HDSP-2000 display interface Incorporating
a 128 character ASCn decoder
HDSP-2472
HDSP-2000 dIsplay Interface without
ASCII decoder. Instead. a 24 pin socket
Is provided to accept a custom 128 character set from a user programmed 1 K x 8
PROM.
When ordering, specify one each of the Controlier Board and the
Display Board for each complete system.
"~-----.-----------------
HDSP-2470/-2471/-2472
Recommended
Operating Conditions
Absolute Maximum Ratings
Vee •.....................•............ -0.5V to 6.0V
Parameter
Operating Temperature Range,
Ambient (TA) ....................... O·C to 70·C
Supply Voltage
Storage Temperature Range (Ts) .... -55·C to 100·C
Data Out
Voltage Applied to any Input or Output .. -0.5V to 6.0V
Ready, Data Valid,
Column On, Display
Data
IsoUReE Continuous for any Column
Driver .......... 5.0 Amps (60 sec. max. duration)
Clock
Column1-5
Symbol
Min.
Max.
Vee
4.75
5.25
V
IOL
0.4
mA
IOH
-20
p.A
IOL
1.6
mA
IOH
-40
p.A
Units
IOL
10.0
mA
IOH
-1.0
mA
ISOUReE
-5.0
A
Electrical Characteristics Over operating Temperature Range
(Unless otherwise specified)
Symbol
Parameter
Supply Currentl1 ]
Min.
Typ.
Input Threshold High (except Reset)
Max.
400
Icc
Units
Conditions
mA Vee = 5.25V Column On and All
Outputs Open
± .25V
VIH
2.0
V
Vee;' 5.0V
VIH
3.0
V
Vee = 5.0V ± .25V
V
Vee = 5.0V
V
IOH =·-20p.A
Vee = 4.75V
V
IOL- O.4mA
Vee = 4.75V
V
IOH = -1000p.A
Vee = 4.75V
0.5
V
IOL= 10.0mA
Vee =4.75V
V
IOH - -40p.A
Vee = 4.75V
VOL
0.5
V
IOL= 1.6mA
Vee =4.75V
Input Current,(31 All Inputs Except
Reset, Chip Select, 01
ItH
-0.3
IlL
-0.6
mA VIL - O.SV
Vee =5.25V
Reset Input Current
hH
-0.3
mA VIH=3.0V
Vee == 5.25V
-0.6
mA
VIL - O.SV
Vee=5.25V
+10
p.A
0< VI < Vee
V
lOUT = -S.OA
Input Threshold High -
Reset l2 ]
Input Threshold Low -
All Inputs
Data Out Voltage
0.8
VIL
VOHData
2.4
VOLData
Clock Output Voltage
Ready, Display Data, Data Valid,
Column on Output Voltage
VOHClk
0.5
2.4
VOLClk
VOH
2.4
IlL
Chip Select, 01 Input Current
Column Output Voltage
II
-10
VOLCOL
2.6
3.2
± .25V
mA VIH = 2.4V
Vee == 5.25V
Vee -S.OOV
NOTES:
1. See Figure 11 for total system supply current.
2. External reset may be initiated by grounding Reset with either a switch or open collector TTL gate for a minimum timeef
50ms. For Power On Reset to function properly, Vee power supply'should turn on at a rate> 100V/s.
3. Momentary peak surge currents may exist on these lines. However, these momentary currents will not interfere with
proper operation of the HDSP-2470/1!2.
7-69
HDSP-2416/-2424/-2432/-2440
Recommended
operating Conditions
Absolute Maximum Ratings
Supply Voltage Vee to Ground ..•...... -0.5V to 6.0V
Parameter
Inputs, Data Out and VB
Supply Voltage
Vee
4.75
Column Input
Voltage, Column On
VeoL
2.6
Setup Time
tSETUP
70
45
Hold Time
tHoLD
30
0
............... -0.5V to Vee
Column Input Voltage, VeOL
.........
-0.5V to +6.0V
Free Air Operating Temperature
Range, TAlll ....................... O°C to +55°C
Storage Temperature Range, Ts •... -55°C to +100°C
Symbol Min. Norm. Max. Units
5.0
5.25
V
ns
ns
ns
tW(eLOeK) 75
Width of Clock
Clock Frequency
feLoeK
Clock Transition
Time
tTHL
Free Air Operating(1)
Temperature Range
0
0
TA
V
3
MHz
200
ns
55
·C
Electrical Characteristics Over operating Temperature Range
(Unless otherwise specified)
Parameter
Symbol
Min.
Supply Current
Typ."
Max.
45n
60n1 2)
73n
95n
Icc
1.5n
leOL
Column Current at any Column Input
335n
leOL
Peak Luminous Intensity per LED
(Character Average)
Iv PEAK
105
2.0
410n
VB,Clock or Data Input Threshold High
VIH
VIL
0.8
Input Current Logical 1
mA Vee = VeOL = 5.25V VB = OAV
All SR Stages =
Logical 1
VB = 2.4V
mA
V
V
ilH
80
}.lA
Data In
ItH
40
}.lA
Va, Clock
ilL
-500
-800
}.lA
ilL
-250
-400
}.lA
Po
0.66n
VB, Clock
Data In
Power Dissipation Per Board l41
'All typical values specified at Vec = 5.0V and TA
=
Conditions
mA Vee"" 5.25V
Va'" OAV
VeLoeK=VoATA'=2.4V
mA All SR Stages =
VB = 2.4V
Logical 1
Vee = 5.0V. VeOL = 3.5V
}.lCd T 1= 25°C1 3 1, VB = 2.4V
200
VB,Clock or Data Input Threshold Low
Input Current Logical 0
Units
W
Vee
= VeOL = 4.75V
Vee = 5.25V, VIH = 2.4V
Vee = 5.25V, VIL = O.4V
=
Vee 5.0V, VCOL = 2.6V
15 LED's on per Character,
VB = 2.4V
25°C unless otherwise noted.
NOTES:
1. Operation above 55° C (70° C MAX) may be. aC.hieved by the use of forced air (150 fpm normal to component side of
HDSP-247X controller board at sea level). Operation down to _20° C is possible in applications that do not require the
use of HDSP-2470/-2471/-2472 controller boards.
2. n = number of HDSP-2000 packages
HDSP-2416 n = 4
HDSP-2424 n = 6
HDSP-2432 n = 8
HDSP-2440 n = 10
3. Tj refers to initial case temperature immediately prior to the light measurement.
4. Power dissipation with all characters illuminated.
7-70
System Overview
The HDSP-2470/-2471/-2472 Alphanumeric Display
Controllers provide the interface between any ASCII
based Alphanumeric System and the HDSP-2000
Alphanumeric Display. ASCII data is loaded into the
system by means of anyone of four data entry modes Left, Right, RAM or Block Entry. This ASCII data is stored
in the internal RAM memory of the system. The1system
refreshes HDSP-2000 displays from 4 to 48 characters
with the decoded data.
The user interfaces to any of the systems through eight
DATA IN inputs, five ADDRESS inputs (RAM mode), a
CHIP SELECT input, RESET input, seven DATA OUT
outputs, a READY output, DATA VALID output, and a
COLUMN ON output. A low level on the RESET input
clears the display and initializes the system. A low level on
the CHIP SELECT input causes the system to load data
from the DATA IN and ADDRESS inputs into the system.
The controller outputs a status word, cursor address and
32 ASCII data characters through the DATA OUT outputs
and DATA VALID output during the time the system is
waiting to refresh the next column of the display. The
COLUMN ON output can be used to synchronize the
DATA OUT function. A block diagram for the HDSP2470/-2471/-2472 systems is shown in Figure 1.
DATA OUT
DATA VALID
COLUMN ON
VB, DISPLAY
BLANKING
f---
r-
-c
3
RAM ADDRESS
~
DATA IN
---+-
CHIP SELECT
-C
READY
r~:t ;..,
7
DISPLAY
CONTROLLER
1110
DECODER
+
+
DRIVE
TRANS
COLUMN 1-5
I
I
I
L __ _...J
I
I
I
-
7
-
PISD
DISPLAY DATA
CLOCK
-CHARACTER GENERATOR FOR HDSp·2471.
SOCKET FOR lK X8 PROM FOR HDSP·2472.
Figure 1. Block Diagram for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.
The system interfaces to the HDSP-2000 display through
five COLUMN outputs, a CLOCK output, DISPLAY DATA
output, and the COLUMN ON output. The user should
connect DISPLAY DATA to DATA IN of the leftmost
HDSP-2000 cluster and cascade DATA OUT to DATA IN
of all HDSP-2000 clusters. COLUMN outputs from the
system are connected to the COLUMN inputs of all HDSP2000 clusters. The HDSP-24XX Series display boards are
deSigned to interconnect directly with the HDSP-247X
Series display controllers. The COLUMN outputs can
source enough current to drive up to 48 characters of the
HDSP-2000 display. Pulse width modulation of display
luminous intenSity can be provided by connecting
COLUMN ON to the input of a monostable multivibrator
and the output of the monostable multivibrator to the VB
inputs of the HDSP-2000 displays. The system is designed
to refresh the display at a fixed refresh rate of 100 Hz.
COLUMN ON time is optimized for each display length in
order to maximize light output as shown in Figure 2.
20
I"l:::
18
w
::;;
;::
z
z::;;
'"
16
~
~
,HDSP.2471/.2472
" N'.
0
14
HDSP-2470"",
:::l
....
0
,."
"-
12
" i"-"'"
10
o
o
4
6
12 16 20 24 26 32 36 40 44 46
DISPLAY LENGTH
Figure 2. Column on Time vs. Display Length for the
HDSP-2470/-2471/-2472 Alphanumeric Display Controller.
7-71
Control Mode/Data Entry
User Interface to the HDSP-247X Series controller is via an
8 bit word which provides to the controller either a control
w'ordorstandardASCII data input. In addition tothis user
provided 8 bit word, two additional control lines, CHIP
SELECT and READV, allow easily generated "handshake"
Signals for iriterface pLirposes.
CONTROL
WORD: D7D6DSD4D3D2D1DO
111x xl-Iv v v vi
A logic low applied to the CHIP SELECT input (minimum
six microseconds) causes the controller to read the 8
DATA IN lines and determine whether a control word or
ASCII. data word
present, as determined by the logic
state of the 11)0st significant bit (07). If the controller
detects a logic high at 07, the state of 06-00 will define the
data entry mode and the number of alphanumeric
characters to be displayed.
The 8 bit control data word format is outlined in Figure 3.
For the control word (07 high), bits 06 and 05 define the
selected data entry mode (Left entry, Rightentry, etc.) and
bits 03 to Do define display length. Bit 04 is ignored.
CLEAR. OFFSCREEN CURSOR
DISPLAV LENGTH:
4 DIGITS
8
12
16
20
24
0 0
0 1
001 0
001 1
o1 0 0
o1 0 1
o1 1 0
011 1
1 000
100 1
101 0
1 0 1 1
is
Control word inputs are first checked to verify that the
control word is valid. The system ignores display lengths
greater than 1011 for left block or right, or 0111 for RAM. If
the word is valid, the present state-next state table shown
in Figure 4 is utilized to determine whether or not to clear
the display. For display lengths of up to 32 characters,
RAM entry can be used as a powerful editing tool, or can
be used to preload the cursor. With other transitions, the
internal data memory is cleared.
VVVV
o0
o0
28
32"
36
40
"
44
48
"maximum for RAM data entry mode
xX
o0
o1
1 0
1 1
DATA ENTRV MODES
RAM DATA ENTRV
LEFT DATA ENTRV
RIGHT DATA ENTRV
BLOCK DATA ENTRV
Figure 3. Control Word Format for the HDSP-2470/-2471/-2472
Alphanumeric Display Controller.
= 30,,,
(1)
RAM ENTRY MODE IS VALID FOR DISPLAYS OF
32 CHARACTERS OR LESS IN LENGTH.
(2)
FOLLOWING A TRANSITION FROM RAM TO
BLOCK. WHEN THE CURSOR ADDRESS IS 48
(30,.) DURING THE TRANSITION. THE FIRST
VALID ASCII CHARACTER WILL BE IGNORED
AND THE SECOND VALID ASCII CHARACTER
WILL BE LOADED IN THE LEFT· MOST DISPLAY
LOCATION.
WHERE BEGIN IS DEFINED AS FOLLOWS:
DISPLAY
~
4
8
12
16
20
24
28
32
36
40
44
4B
CLEAR.
BLINKING
CURSOR = BEGIN
CLEAR, INVISIBLE
CURSOR' BEGIN
CURSOR ADDRESS
OF BEGIN
2C, •• 44,0
28, •• 4010
24, •• 3610
20, •• 32,0
1C, •• 28,0
18, •• 24,0
14, •• 2010
10,.,16,0
OC, •• 12,0
08 16 • 8 10
0416 • 410
00,.
Figure 4. Present.State-Next State Diagram for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.
7-72
(space) to 5F16 Wl and ignores all ASCII characters
outside this subset with the exception of those characters
defined as display commands. These display commands
are shown in Figure 5. Displayed character sets for the
HDSP-2470/-2471 systems are shown in Figure 6.
If 07 is a logic low when the DATA IN lines are read, the
controller will interpret 06-00 as standard ASCII data to be
stored, decoded and displayed. The system accepts seven
bit ASCII for all three versions. However, the HDSP-2470
system displays only the 64 character subset [2016
DATA WORD:
ASCII ASSIGNMENT
LF
BS
HT
US
DEL
07
10
I
06 05 04
A
A
A
0
0
0
0
1
0
0
0
1
1
0 3 O2 0 1 DO
A
A
A
AI
DISPLAY COMMAND
I~';"," 1
CLEAR
Right Entry
BACKSPACE CURSOR
Mode
FORWARDSPACE CURSOR
INSERT CHARACTER
DELETE CHARACTER
Valid in
Left Entry
Modo
Figure 5. Display Commands lor the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.
128 CHARACTER ASCII SET
(HDSP'2471 )
64 CHARACTER ASCII SUBSET
(H DSP·2470)
'00'
DOlO
0011
0100
0101
0110
0111
'00'
'00'
1010
1011
1100
1101
11'0
"11
-DISPLAV COMMANDS WHEN USED IN LEFT ENTRY
+DISPLAV COMMANDS WHEN USED IN RIGHT ENTRY
Figure 6. Display Font lor the HDSP-2470 (64 Character ASCII Subset), and HDSP-2471 (128 Character ASCII Set) Alphanumeric
Display Controller.
7-73
Regardless of whether a control word or ASCII data word
is presented by the user, a READY signal is generated by
the controller after the input word is processed. this
READY signal .goes low for 251's and upon a positive
transition, a new CHIP SELECT may be accepted by the
controller. Data Entry Timing is shown in Figure 7.
DATA ENTRY TIMING
II
RAM ADDRESS
ADDRESS HOLD TIME
.,
1--10", MAX.
E
="M'l _________________________...
CHIPSELECT
DATA HOLD TIME--------=t
lL~I
___
--~I._~
6"_"_MI_N'__
~
___ _
DATA ENTRY TIME
---------.j.11--2.5"'.
II
READY
CELECT=O
I AFTER THIS TIME.
CONTROLLER WILL
ENTER NEXT CHARACTER.
j.-25",--l
MAXIMUM DATA ENTRY TIMES OVER OPERATING TEMPERATURE RANGE
FUNCTION
DATA ENTRY MODE
HDSP·
DATA HOLD TIME"
DATA
ENTRY
BACK
SPACE
CLEAR
FORWARD
SPACE
DELETE
INSERT
205!,s
225!,s
725!,s
745!,s
725!,s
735!,s
LEFT (2471/2)
LEFT (2470)
135!,s
150!,s
235!,s
245!,s
1951's
215!,s
505!,s
530!,s
RIGHT (2471/2)
RIGHT (2470)
85!,s
1051's
480!,s
490!,s
470!,s
490!,s
465!,s
485!"
120!'s' ,
130!'s'"
RAM (2471/2)
RAM (2470)
55!,s
551's
BLOCK (2471/2)
BLOCK (2470)
55!,s
55!,s
120!,s
130!,s
LOAD CONTROL (2471/2)
LOAD CONTROL (2470)
50!,s
50!,s
505!,s
505!,s
190!,s
200!,s
(155!,s FOR RIGHTMOST CHARACTER)
(165!,s FOR RIGHTMOST CHARACTER)
"Minimum time that data inputs must remain valid after Chip Select goes low.
"'Minimum time that RAM address inputs must remain valid after Chip Select goes low.
Figure 7. Data Entry Timing and Data Entry Times for the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.
7-74
Left Entry Mode
With Left entry, characters are entered in typewriter
fashion, i.e., to the right of all previous characters. Left
entry uses a blinking cursor to indicate the location where
the next character is to be entered. CLEAR loads the
display with spaces and resets the cursor to the leftmost
display location. BACKSPACE and FORWARDSPACE
move the cursor without changing the character string.
Thus, the user can backspace to the character" to be
edited, enter a character and then forward space the
cursor. The DELETE function deletes the displayed
character at the cursor location and then shifts the
character string following the cursor one location to the
left to fill the void of the deleted character. The INSERT
CHARACTER sets a flag inside the system that causes
subsequent ASCII characters to be inserted to the left of
the character at the cursor location. As new characters are
entered, the cursor, the character at the cursor, and all
characters to the right of the cursor are shifted one
location to the right. The INSERT function is terminated
by a second INSERT CHARACTER, or by BACKSPACE,
FORWARDSPACE, CLEAR or DELETE. In Left entry
mode, after the display is filled, the system ignores all
characters except BACKSPACE and CLEAR. The system
allows the cursor to be positioned "only in the region
between the leftmost display character and immediately
to the right (offscreen) of the rightmost display character.
Right Entry Mode
In Right entry mode, characters are entered at the right
hand side of the display and shifted to the left as new
characters are entered. In this mode,the system stores 48
ASCII characters,although only the last characters
entered are displayed. CLEAR loads the display with
spaces. BACKSPACE shifts the display one location to the
right, deleting the last character entered and displaying
the next character in the 48 character buffer. Right entry
mode is a simple means to implement the walking or
"Times-Square" display. FORWARDSPACE, INSERT,
and DELETE have character assignments in this mode
since they are not treated as editing characters. In this
mode, the cursor is located immediately to the right
(offscreen) of the rightmost displayed character.
Block Entry Mode
Block entry allows the fastest data entry rate of all four
modes. In this mode, characters are loaded from left to
right as with Left entry. However, with Block entry, after
the display is completely loaded, the next ASCII character
is loaded in the leftmost display location, replacing the
previous displayed character. While Block entry has a
nonvisible cursor, the cursor is always loaded with the
address of the next character to be entered. I n this entry
mode, the system can" display the complete 128 character
ASCII set. The display can be cleared and the cursor reset
to the leftmost display location by loading in a new
BLOCK control word.
RAM Entry Mode,
In RAM entry, ASCII characters are loaded at the address
specified by the five bit RAM address. Dueto the limitation
of only five address lines, RAM data entry is allowed only
7-75
for displays less than or equal to 32 characters.
Regardless of display length, address 00 is the leftmost
display character. Out of range RAM addresses are
ignored. While RAM entry has a non-visible cursor, the
cursor is always preloaded with the address to the right of
the last character entered. This allows the cursor to be
preloaded with an address prior to gOing into any other
entry mode. In RAM entry, the system can display the
complete 128 character ASCII set because it does not
interpret any of the characters as control functions. The
display can be cleared by loading in a new RAM control
word.
Data Out
For display lengths of 32 characters or less, the data
stored in the internal RAM is available to the user during
the time between display refresh cycles. The system
outputs a STATUS WORD, CURSOR ADDRESS, and 32
ASCII data characters. The STATUS WORD specifies the
data entry mode and the display length of the system. The
STATUS WORD output differs slightly from the CONTROL WORD input. This difference is depicted in Figure 8.
Regardless of display length, the CURSOR ADDRESS of
the rightmost character location is address 47 (2Fle) and
the offscreen address of the cursor is address 48 (301e).
The CURSOR ADDRESS of the leftmost location is
defined as address 48 minus the display length. A general
formula for CURSOR ADDRESS is:
CURSOR ADDRESS =
(47 - Display Length)
+ Number of Characters from
Left.
For example, suppose the alphanumeric display is 16
characters long and the cursor was blinking at the third
digit from the left. Then the CURSOR ADDRESS would be
47 -16 + 3 or34 (221e) and the 18th ASCII data word would
correspond to the ASCII character at the location of the
display cursor. In Left and Block entry, the CURSOR
ADDRESS specifies the location where the next ASCII
data character is to be entered. In RAM entry, the
CURSOR ADDRESS specifies the location to the right of
the last character entered. In Right entry, the CURSOR
ADDRESS is always 48 (301e). The negative edge of the
DATA VALID output can be used to load the 34 DATA
OUT words into the user's system. The DATA OUTtiming
for the HDSP-247X systems are summarized in Figure 8.
For displays longer than 32 characters, the system only
outputs the STATUS WORD between refresh cycles.
Master/Power On Reset
When power is first applied to the system, the system
clears the display and tests the state of the DATA INPUT,
D7. If D7 > 2.0V, the systems loads the control word on the
DATA INPUTS into the system. If D7 S .8V or the system
sees an invalid control word, the system initializes as Left
entry for a 32 character display with a flashing cursor in
the leftmost location. For POWER ON RESET to function
prp'perly, the power supply mustturn on ata rate> 100 Vis.
In" addition, the system can be reset by pulling the RESET
input low for a minimum of 50 milliseconds. POWER
ON/MASTER RESET timing is shown in Figure 9.
2000~s -------------------------------------------.,.1
I·
·~
ON
25ns
COLU~M~
2470
HDSP·
40n5
HDSP· COLUMN
2471/.2472
ON1~s
.~:...
DATA VALID
ASCII DATA
HDSP2470
X, COLUMN OFF TIME
(HDSp·2470)
(HDSP-2471/·2472)
HDSP·
2470
=
=
+ 20,1..15 X Display Length
17.5,us + 17.5ps X Display Length
30.5.us
Y, DATA VALID TO COLUMN OFF TIME
(Display Length .,;;;32 Characten)
(HDSp·2470)
= 813.5115 - 20,1..15 X Display Length
(HDSp·2471/·24721 ., 826.2~s - 17.5~s X Display Length
STATUS WORD FORMAT (WORD AI
HDSP2471/·2472
----1
HDSP2471/2472
L....._---J
I-l.2~s
L-_....Jn
35~s --:-l- 35~s
ASCII
DATA
l
..
500ns MIN
n!-___
----I
06
Os
04
0
0
0
0
0
1
0
1
0
1
0
0
03
0, 0,
Do
Y
Y
Y
RAM ENTRY
Y
BLOCK ENTRY
LEFT ENTRY
RIGHT ENTRY
YYYY = DISPLAY LENGTH
CURSOR ADDRESS FORMAT (WORD BI
CU RSOR ADDRESS = ( 47 - Display Lengthl + No. of
Characters from Left
I
STAT1S CU.RSOR +-DATA
DATA
WORD
ADDRESS
WORD~WORDS
jill
(BI
. (01
(1 - 31)
I ..
~
I
DATA WORD FORMAT (WORDS 0-311
STANDARD ASCII DATA Where Word (31) is Rightmost
Displayed ASCII Character
f----soons MIN
Figure 8,. Data Out Timing and Format lor the H'DSP-2470/-2471/-2472 Alphanumeric Display Controller.
-----,~•.-----------------50msMIN----------------~·1
l~ 330~s
L-__________________________________________________________
READY
;-~
l.-2.5,us*
I'IFCHIPSELECT=O
AFTER THIS TIME,
CONTROLLER WILL
r~__.....;E;;;.N;.;TER A CHARACTER.
READS IN CONTROL WORD
DATA INPUT, 0,
__~~~~~~~~~~~-L~~~~~
INITIALIZES AS LEFT ENTRY
MODE, 32 CHARACTER DISPLAY
LENGTH
Figure 9. Power-On/Master Reset Timing lor the HDSP-2470/-2471/-2472 Alphanumeric Display Controller.
7-76
Custom Character Sets
The HDSP-2472 system has been specifically designed to
permit the user to insert a custom 128 ASCII character set.
This system features a 24 pin socket that is designed to
accept a custom programmed 1K X 8 PROM, EPROM, or
ROM. The read only memory should have an access time:5
500ns, IIL:5 1-.4mA I and ItH :5 40!-,A. A list of pin compatible
read only memories is shown in Figure 10. Jumper
locations are provided on the HDSP-2472 P.C. board
which allow the use of ROM's requiring chip enables tied
either to 0 or 5V. For further information on ROM
programming, please contact the factory.
6
-
PEAK Icc. ALL SYSTE~
4
1/
/
/
./ -,,'
1
.5
V
/
/
AVG.l cc •
./
3
Power Supply Requirements
The HDSP-247X Alphanumeric Display System is
designed to operate from a single 5 volt supply. Total Icc
requirements for the HDSP-247X Alphanumeric Display
Controller and HDSP-24XX Display Panel are shown in
Figure 11. Peak Icc is the instantaneous current required
for the system. Maximum Peak Icc occurs for Vec =5.25V
with 7 dots ON in the same Column in all display
characters. This current must be supplied by a
combination of the power supply and supply filter
capacitor. MQl
!:
~
~
!g
~
40
DUTY
FACTOR;;:: 1/7
V
1.0
,..,....-- ~
ij
//
.8
l SO //
l/J#V
~V
,
20
1<
w
10
.4
/,~ V;
.6
.8 1,0
/
./
/.
/
.6
20
8 10
AVERAGE CURRENT PER LED - rnA
Figure 3.
°c
Relative Luminous Intensity vs. Case
Temperature at Fixed Current Level.
1/20 . , /
w·
,.;:
TC - CASE TEMPERATURE -
Figure 2.
I V
":3
~
2.0
Forward Current-Voltage Characteristic.
80
60
1.6
FORWARD VOLTAGE - V
100
~
ffi
1.2
40
60
80
100
PE".K CURRENT PER LED - mA
Figure 4.
Typical Time Average Luminous
Intensity per LED vs. Average
Current per LED.
7-81
Typical Relative Luminous Efficiency vs.
Peak Current per LED.
package Dimensions and Pin Configurations
'.271.0501
GLA$S
t.'
4.4S 1.57011
MAX.
, 651 Q6Sf
....._--'-_-_
flEF
2.64
1.
30~~~201
I~~
···VVWV
T
I I --l f...
..
0.43 1.0111 .
......-2,54 (,1001 ryp,
TV'.
5082·7101
111 f 2-80)
OAIENT ArlON MARK MET AI,. TAB
r"iICK1~':'~ATe"
13,46
1.530)
22.36
J
:"EF.··..' ~-l
1 __'-'::1-+-=:"=':=-'---
4.57
3
'6
(.180)
4
25
, lrem
36
35
34
33
32
24
32.00
31~4
I
23
(1,230)
!
22 35.6E;(1,4oo)
I
I
21
MAX.
20
I
,.
31
(~wo:'l:=·~eo) :
30
29
~10~~~~~~C--
1$
~a
27 45.7~l~eOOI
11
26
12
25
T7
13,-++---""'-'1"""-'-_
24
16
'5
14
23
22
"
20
Notes.:
19
1, OlrrMotion$ ilr(l-:ln mlUirnetru and (iochet),
2. Unten otherwbe ~Pftclflad, the tolerance on 411 dimen;lons 1$ 'to.3Smm {::.015 ioJ.
3, Char.a(:ter Site 6.9 x4.9mm t27 x +19 In.}.
Device Pin Description
5082·7100
5082·7101
5082·7102
Pin
Function
Pin
Function
Pin
Function
Pin
Function
Pin
Function
Pin
Function
1
2
3
4
AnodeG
12
13
14
Anode
a
1
N/C
Ie
16
Anode G
2b
2d
Anode 0
Anode E
3<:
15
16
17
Anode C
4c
4.
Anode B
1
2
3
4
19
20
Sa
5
3b
3a
6
N/C
1e
Ie
Anode F
2b
2d
28
Anode E
5e
5c
5a
Anode 0
48
40
N/C
Anode C
3d
3b
3a
Anode B
5
6
7
S
9
10
11
Ie
ld
Anode F
Anoda E
2b
2d
Anode C
3a
3c
3e
15
16
17
18
19
20
21
22
3d
2
3b
Anode A
28
2<:
2a
Anod.O
1e
lb
3
10
3d
la
11
Anode F
4b
4
5
6
7
8
9
12
13
14
1a 1b 1c
A
4d
4&
ld 1e 2a 2b 2c 2d 2e
18
19
20
21
22
23
24
25
26
27
28
2.
2<:
2.
Anode A
ld
lb
Ie
7
8
9
10
11
12
13
14
15
16
17
18
3c
3a
AnodeG
4a
4b
4d
NIC
5b
5d
N/C
3a 3b 3c 3d 3e 4a 4b 4c 4d 4e 5a 5b 5c 5d 5e
JtlJI' .~JtI.~
Jtlj< '.;tt"JII'.;tt'
,¥'.'Ji' 'J/' 'JI'J/'
,,''If' '1' ',,1'1'
5082·7100/7101/7102
Schematic Wiring Diagram
""
JtlJI'
'" ',I' ~
~.ytI'~
/.~ r~ 'ytI'~
G !-CHARACTER 1_!-CHARACTER 2-i+cHARACTER 3+CHARACTER 4+CHARACTER 5-1
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
20
28
Anode A
1d
lb
1a
-----
..
_---_ ... - - -
operating Considerations
ELECTRICAL
The 5 x 7 matrix of LED's, which make up each character, are X-V addressable. This allows for a
simple addressing, decoding and driving scheme between the display module and customer furnished
logic.
There are three main advantages to the use of this type of X-V addressable array:
1. It is an elementary addressing scheme and provides the least number of interconnection pins for the
number of diodes addressed. Thus, it offers maximum flexibility toward integrating the display into
particular applications.
2. This method of addressing offers the advantage of sharing the Read-Only-Memory character generator
among several display elements. One character generating ROM can be shared over 25 or more 5 x 7
dot matrix characters with substantial cost savings.
3. In many cases equipment will already have a portion of the required decoder/driver (timing and clock
circuitry plus buffer storage) logic circuitry available for the display.
To form alphanumeric characters a method called "scanning" or "strobing" is used. Information is
addressed to the display by selecting one row of diodes at a time, energizing the appropriate diodes in
that row and then proceeding to the next row. After all rows have been excited one at a time, the
process is repeated. By scanning through all rows at least 100 times a second, a flicker free character
can be produced. When information moves sequentially from row to row of the display (top to bottom)
this is row scanning, as illustrated in Figure 5. Information can also be moved from column to column
(left to right across the display) in a column scanning mode. For most applications (5 or more characters to share the same ROM) it is more economical to use row scanning.
MECHANICAL/THERMAL MOUNTING
The solid state display typically operates with 200 mW power dissipation per character. However, if the
operating conditions are such that the power dissipation exceeds the derated maximum allowable value,
the device should be heat sunk. The usual mounting technique combines mechanical support and thermal
heat sinking in a common structure. A metal strap or bar can be mounted behind the display using
silicone grease to insure good thermal control. A well-designed heat sink can limit the case temperature
to within 1oDe of ambient.
READ ONLY
MEMORY
ROW
DRIVERS
Figure 5.
Row Scanning Block Diagram.
7-83
Fli;'
HEWLETT
~~ PACKARD
16SEOMENT
SOLID STATE
ALPHANUMERIC
DISPLAY
HDSP-6504
HDSP-6508
Features
• ALPHANUMERIC
Displays 64 Character ASCII Set and
Special Characters
• 16 SEGMENT FONT PLUS CENTERED D.P.
AND COLON
•
3.~1mm (O.1S0") CHARACTER. HEIGHT
• APPLICATION. FLEXIBILITY WITH
PACKAGE DESIGN
4 and 8 Character Dual-In-Line Packages
End Stackable-On Both Ends for 8 Character and
On One End for 4 Character
Sturdy Gold-Plated Leads on 2.S4mm (O.100")
Centers
Environmentally Rugged Package
Common Cathode Configuration
• LOW POWER
As Low as 1.0-1.SmA Average
Per Segment Depending on Peak
Current Levels
• EXCELLENT CHARACTER APPEARANCE
Continuous Segment Font
High On/Off Contrast
6.3Smm (O.2S0") Character Spacing
Excellent Character Alignment
Excellent Readability at 2 Metres
• SECONDARY BARREL MAGNIFIER AVAILABLE
Increases Character Height to 4.45 mm (0.175")
• SUPPORT ELECTRONICS
Can Be Driven With ROM Decoders and Drivers
Easy Interfacing With Microprocessors and
LSI Circuitry
• CATEGORIZED FOR LUMINOUS INTENSITY
Description
The HDSP-6504 and HDSP-650B are 3.B1mm (0.150")
sixteen segment GaAsP red alphanumeric displays
mounted in 4 character and B character dual-in-line
package configurations that permit mounting on PC
boards or in standard IC sockets. The monolithic light
emitting diode character is magnified by the integral lens
which increases both character size and luminous
intensity, thereby making low power consumption
possible. The rugged package construction, enhanced by
the backfill design, offers extended environmental capabilities compared to the standard PC board/lens type of display
package. Its good temperature cycling capability is the
result of the air gap which exists between the semiconductor chip/wire bond assembly and the lens. In addition to
the sixteen segments, a centered D.P. and colon are in~
eluded. Character spacing yields 4 characters per inch.
Applications
These alphanumeric displays are attractive for applications such as computer peripherals and terminals,
computer base emergency mobile units, automotive
instrument panels, desk top calculators, in-plant control
equipment, hand-held instruments and other products
requiring low power, display compactness and alphanumeric display capability.
7-84
------------------------------------
Device Selection Guide
Characters
Per
Display
Device
Part No.
flDSP-
Package
4
(Figure 6)
""6504
8
(Figure 7)
6508
Absolute Maximum Ratings
Symbol
Min.
~.
IpEAK
Parameter
Peak Forward Current Per Segment
or DP (q,yration::;; 3121's)
lAva
Average'Current Per Segment or
DP[l)
PD
Average Power Dissipation Per
Characted' .2)
TA
Operating Temperature. Ambient
-4(iu",":1§
Ts
Storage Temperature
-40
200
mA
7
mA
138
wmW
85
>tOO
°C
·C
5
V
260
'c
Reverse Voltage
VR
Solder Temperature at 1.59mm
(1/16 inch) below seating plane.
t::;; 3 Seconds
Unitll
NOTES:
1. Maximum allowed drive conditions for strobed operation are derived from Figures 1 and 2. See electrical section of operational
considerations.
2. Derate linearly above TA = SO·C at 2.17mW/·C. Po Max. ITA = 8S·C) = 62mW.
Electrical/Optical Characteristics at TA =25°C
Symbol
11
Parameter
Test Condition
MI'ri.-
Typ.
0.40
1.65
Max.
Units
h~EAK
Iv
Luminous Intensity, Time
Average. Character Total with
16 Segments Illuminated (3,4)
VF
Forward Voltage Per
Segment or DP
APeAK
Peak Wavelength
655
nm
Dominant Wavelength [S]
640
nm
Ad
lR
=
AVF/AoC
ROJ-PIN
= 30m A
1/16 Duty Factor
IF- 30mA
(One Se~Biient On)
Reverse Current Per
Segment or DP
w
1.6
mcd
1.9
':<-'
V
10
p.A
Temperature Coefficient of
Forward Voltage
-2
mVioC
Thermal Resistance LED Junction-to-Pin
232
VR=5V
'C/WI
Seg
NOTES:
3. The luminous intensity ratio between segments within a digit is designed so that each segment will have the same luminous
sterance. Thus each segment will appear with equal- brightness to the eye.
4. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower peak
currents may cause intensity mismatch within the display. Operation at peak currents less than 7 rnA will cause objectionable
display segment matching.
S. The dominant wavelength, Ad, is derived from the C.I.E. chromaticity diagram and represents that single wavelength which defines
the color of the device, standard red.
--------
7-85
--------,,------------------
1.0
I'
0.9
1
II:
.."~
1
....
Z
w
II:
II:
"
2
8
~II:
"~
W
C
..
I
1
~
~
i
0.8
.......
"-
r-..
0.7
0.6
0.3
H=t
0.2
O. 1
50
tp -
"- .......
RU,wIN -340' iWiCIIAR.
0.5
0.45
0.4
60
70
80 85
TA - AMBIENT TEMPERATURE _ DC
PULSE DURATION -loll
Figure 1. Maximum A lIowed Peak Current vs. Pulse Duration. Derate derived
operating conditions above TA c 50°C using Figure 2.
Figure 2. Temperature Derating Factor
For Peak Current per Segment vs.
Ambient Temperature. TJMAX 'c Ilo"C
1.5
200
1.·1
>
"E
;:;
iiiII:
1
....
"iii
II:
~w
:>
~
II:
1
~
~
100
~
80
"
~
60
1
"'
140
120
II:
~
160
"c
II:
>
;:
I
180
40
1
I
-
~
1
20
o :1
1.0
j
1.2
1.4
1.6
I .•
2.0
VF - PEAK FORWARD Y-OLTAGE - V
lPEAK - PEAK SEGMENT CURRENT - rnA
Figure 3. Relative Luminous Efficiency
(Luminous Intensity Per Unit Current)
vs. Peak Segment Current.
Figure 4. Peak Forward Sagment .
Current vs. Peak Forward Voltage.
For a Detailed Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.
o
o
0
o
o
2
3
4
5
6
7
8
.9
A
B
C
o
E
F
[9RBCIlEFGHIJ"kLMND
PQR5TUVWXYZ [ \
/I
±g]%JJ
<> *+/
o 2 3 Y 5 [] 18 9 / L
Figure 5.
Typical 64 Character ASCII Set.
o
Additional Character Font
7-86
J~
t
/
~?
package Dimensions
r
l~~i~~1
MAX'1}
3.18
1.1251
22
i
12
t
10.67
10.4201
21.34'.4
1.840 .0201
r
L
PIN 1
INOTE 31
=
II
(~lra) TYP. -I
,
I---
I'*'
---r
3.81 ± .25
(.150 ± .010)
3.81 ± .25
1.150 , .0101
NOTES:
1, ALL DIMENSIONS IN MILLIMETRES AND (INCHES).
2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.
3. PIN llDENTIFIED BY INK DOT ADJACENT TO LEAD.
Figure 6. HDSP·6504
Magnified Character
Font Description
Figure 7. HDSp·650S
Device Piln Description
Function
Pin
No.
DEVICES
HDSP·6504
HDSP·6508
2.77
1
2
3
4
5
REF'~
(0.109)
6
/ :
,~~"'~v~l
U~u "U! ,.,,"
'~~~~~:J'
Figure S.
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
7-87
HDSP-6S04
Anod0
Anode
Cathode
Anode
Anode
Cathode
Anode
Anode
Anode
Cathode
Anode
Anode
Anode
Anode
Anode
Anode
Cathode
Anode
Anode
Anode
Anode
Anode
Segment 91
Segment DP
Digit 1
Segment d2
Segment I
Digit 3
Segment e
Segment m
Segment k
Digit 4
Segment d,
SegmentJ
Segment Co
Segment g2
Segment a2
Segment i
Digit 2
Segment b
Segment a,
Segment c
Segment h
Segment f
HDSP-6S08
Anode
Anode
Cathode
Anode
Anode
Cathode
Anode
Anode
Anode
Cathode
Anode
CathOde
Cathode
Cathode
Cathode
Anode
Anode
Anode
Anode
Anode
Cathode
Anode
Anode
Anode
Anode
Anode
Segment g1
Segment DP
Digit 1
Segment d2
Segment I
Digit 3
Segment e
Segment m
Segment k
Digit 4
Segment d,
Dig~t 6
Digit 8
Digit 7
Digit 5
SegmentJ
Segment Co
Segment g2;
Segment aa
Segment I
Digit 2
Segment b
Segment a,
Segment c
Segment h
Segment f
operational Considerations
ELECTRICAL
The HDSP-6504 and -6508 devices utilize large monolithic
16 segment GaAsP LED chips with centered decimal point
and colon. Like segments of each digit are electrically
interconnected to form an 18 by N array, where N is the
quantity of characters in the display. In the driving scheme
the decimal point or colon is treated as a separate
character with its own time frame.
These displays are designed specifically for strobed (multiplexed) operation. Under normal operating situations the
maximum number of illuminated segments needed to
represent a given character is 10. Therefore, except
where noted, the information presented in this data sheet
is for a maximum of 10 segments illuminated per
character:
The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design may be
calculated using the following VF model:
VF = 1.85V + IPEAK (1.80)
For: 30mA ::; IPEAK ::; 200mA
VF = 1.58V + IPEAK (10.70)
For: 10mA ::; IPEAK ::; 30mA
OPTICAL AND CONTRAST
ENHANCEMENT
Each large monolithic chip is positioned under a separate '
element of a plastic aspheric magnifying lens, producing a
magnified' character height 6f 3.81 mm (.150 inch). The
aspheric lens provides wide included viewing angles of typically 75 'degrees horizontal and 75 degrees vertical with
low off-axis distortion. These two features,coupled with
the very' high segment luminous sterance, provide to the
user a display with excellent readability in bright ambient
light for viewing distances in the range of 2 meters. Effective contrast enhancement can be obtained by employing
any of the following optical filter products: Panelgraphic:
Ruby Red 60, Dark Red 63 or Purple 90; SGL Homalite:
H100-1605 Red or Hl00~1804 Purple, Plexiglas 2423.For
very bright ambients, such as indirect sunlight, the 3M
Light Control Film is recommended: Red 655, Violet, Purple
or Neutral Density.
For those applications requiring only 4 or 8 characters, a
secondary barrel magnifier, HP pari number HDSP-6505
(four character) and -6509 (eight character), may be
inserted into support grooves on the primary magnifier.
This secondary magnifier increases the character ,height
to 4.45mm <'175 inch) without loss of horizontal viewing
angle.
'
MECHANICAL
These devices are co~structed by LED die attaching and
wire bonding to a high temperature PC board substrate. A
precision molded plastic lens is attached to the PC board
and the resulting assembly is backfilled with a sealing
epoxy to form an envi'ronmentally sealed unit.
The four character and eight character devices can be end
stacked to form a character string which is a multiple of a
basic four character grouping. As an example, one -6504
and two -6508 devices will form a 20 character string.
These devices may be soldered onto a printed ,circuit
board or inserted into 24 and 28 pin DIP L$I, sockets. The
socket spaCing must allow for device end stacking.
Suitable conditions for wave soldering depend upon the
specific kind of equipment and procedure used. For more
information, consult the local HP Sales Office or HewlettPackage Components, Palo Alto, California.
·More than 10 segments may be Illuminated in a given character,
provided the maximum allowed character power dissipation.
temperature derated, is not exceeded.
'
7-88
~~---
..
~----
OPTIONAL
4 DIGIT MAGNIFIER
HDSP-6505
OPTIONAL
8 DIGIT MAGNIFIER
HDSP-6509
END VIEW
(BOTH)
C
31.SSMAX'J
11.2551
C
53.67MAX'-j
.,'" =1
11.
kl
rut
11\JU-
9.25MAX·11
,-,
2
L
2S.SMAX.J
11.1351
MOUNTED ON HOsp·6504
L
50.67 MAX.
11.9951
----II
MOUNTED ON HDSP·650B
Figure 9. Design Data for Optional Barrel Magnifier in Single Display Applications.
7-89
NOTES:
1. ALL DIMENSIONS IN
MILLIMETRES AND (lNCHESI.
2. THIS SECONDARY MAGNIFIER
INCREASES THE CHARACTER
HEIGHT TO 4.45mm (.175 in.)
Fli;' HEWLETT
':1:.
PACKARD
16SEOMENT
SOLID STATE
ALPHANUMERIC
DISPLAY
HDSP-63DD
Features
• ALPHANUMERIC
Displays 64 Character ASCII Set and
Special Characters
• 16 SEGMENT FONT PLUS CENTERED D.P.
AND COLON
• 3.S6mm (0.140") CHARACTER HEIGHT
• APPLICATION FLEXIBILITY WITH
PACKAGE DESIGN
S Character Dual-ln-L,lne Package
End Stackable
..
Sturdy Leads on 2.S4mm (0.100") Centers
Common Cathode Configuration
• LOW POWER
As Low as 1.0-1.SmA Average
Per Segment Depending on Peak
Current Levels
• EXCELLENT CHARACTER APPEARANCE
Continuous Segment Font
High On/Off Contrast
S.OSmm (0.200") Character Spacing
Excellent Character Alignment
Excellent Readability at 1.5 Metres
• SUPPORT ELECTRONICS
Can Be Driven With ROM Decoders and Drivers
Easy Interfacing With Microprocessors and
LSI Circuitry
• CATEGORIZED FOR LUMINOUS INTENSITY
Description
The HDSP-6300 is a sixteen segment GaAsP red
alphanumeric display mounted in an 8 character dual-inline package configuration that permits mounting on PC
boards or in standard IC sockets. The monolithic light
emitting diode character is magnified by the integral lens
which increases both character size and luminous
intensity. thereby making iow power consumption
possible. The sixteen elements consist of sixteen segments for alphanumeric and special characters plus
centered decimal point and colon for good visual
aesthetics. Character spaCing yields 5 characters per
inch.
Applications
These alphanumeric displays are attractive for applications such as computer peripherals and mobile terminals.
desk top calculators. in-plant control equipment. handheld instruments and other products requiring low power.
display compactness and alphanumeric display capability.
7-90
Absolute Maximum Ratings
Symbol
:::'.;:;-
'i
Parameter
Min.
IPEAK
Peak Forward Current Per Segment
or DP ([Juration::::; 417 ,us)
IAVG
Ave(age';Current Per Segment or
DP(1j'./'
Po
Average Power Dissipation Per
CharI'\Pier [1.2j
TA
Ts
Operating Templlf~t~re. Ambient
Storage T ~i1lperatUre "
VR
Reverse Voltage
.,
Max.
Units
150
mA
6.25
mA
133
mW
-40
85
°C
-40
100
5
°C
V
2(30
°C
Solder Temp'erj'lture at1.59mm
(1/16 inch) belOw seating plane,
t :S 5 Seconds
NOTES:
1. Maximum allowed drive .conditions for strobed operation are derived from Figures 1 and 2. See electrical section of operational
considerations.
2. Derate linearly above TA = 50'C at 2.47 mW/'C. Po Max. ITA = 85'C) = 47 mW.
Electrical/Optical Characteristics at TA =25°C
Symbol
Iv
Parameter
Luminous Intensity. Time
Average, Character Total with
16 Segments Illuminated (3,4)
VF
Forward Voltage Per
Segment or DP
APEAK
Peak Wavelength
Dominant Wavelength (5]
Ad
Test Condition
Min.
Typ.
400
1200
IF'" 24mA
(One Segment On)
IR
Reverse Current Per
Segment or DP
R8J-PIN
Thermal Resistance LED
Junction-to-Pin per Character
Max.
Units
IPEAK =24mA
1/16 Duty Factor
,ucd
1.9
1.6
V
655
om
640
nm
10
VR "" 5V
,uA
°C/W/
Char.
250
NOTES:
3. The luminous intensity ratio between segments within a digit is designed so that each segment will have the same luminous
sterance. Thus each segment will appear with equal brightness to the eye.
4. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower peak
currents may cause intensity mismatch within the display. Operation at peak currents less than 7 mA will cause objectionable
display segment matching.
5. The dominant wavelength, Ad. is derived from the C.I.E. chromaticity diagram and represents that single wavelength which defines
the color of the device, standard red.
1.0
~
I
200
ffi
150
~
10 0
II:
'-
§
'-
il
"~
o?~'"
0
"
I
~
~
,'-
0.9
'\
20
0
7
~"',r.
~1.
"
10
'l;.
~
100
tp
7""
'(.
1000
~
0.7
~
0.6
~
0.5
ex:
r--
ReJ~IN •
'" ' '
390'C/WICHAA.
"
0.4
I 0.3 5
. ~ O. 3
0.2
O. 1
_DC
10000
PULSE DURATION -IJ.S
50
60
70
80
TA - AMBIENT TEMPERATURE _
Figure 1. Maximum Allowed Peak Current vs. Pulse Duration. Derate derived
operating conditions above T A = 50~ C using Figure 2.
7-91
..
"I
~
,,-~'"
1\II ~ '" rt, I ~~
I III
'"
o,a
8
°c
Figure 2. Temperature Derating Factor
For Peak Current per Segment v•.
Ambient Temperature. T JMAX ='110'C
>
!;!.
w
c:;
1.5
1.4
1.3
1.2
'1.1
1.0
0.9
'0.8
!Ew
w
2:
....
:l'
w
a:
.
I
i!
"
0.7
0.6
0.5
0.4
0.3
0.2
0.1
VF - PEAK FORWARD VOLTAGE - V
IPEAK. - PEAK SEGMENT CURRENT - mA
Figure 3. Relative Luminous Efficiency
(Luminous Intensity Per Unit Current)
vs. Peak Segment Current.
Figure 4. Peak Forward Segment
Current vs. Peak Forward Voltage.
For a Detai.led Explanation on the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.
A3 A2 A, Ao
1
A4
0
0
0
~
A5
2
3
4
5
6
7
8
9
B
A
0
E
F
R B C ]J E F G H I J f-< L M N·D
PQR5TUVWXYZ[
0
C
/I
0
:Eg]%1J
<>
0 I 2 3 Y5 5 1 B 9
j:igure 5.
*+
/
J?
\
~
/
/
L
~
?
Typical 64 Character ASCII Set.
fZJ
o
Additional Character Font
U5
(.25111
18.30 ••38
1.720 ••1115}
f
1
NOns;
I. ALL OIMENSlOI\I$ IN MILLIMI!TRES AND fiNCH E$},
2. All IJlI/TOLERANCED DlMENSIONSARE FOR REFERENC! ONLY.
3.l'IN 1 IDENTIFIED BY DOT ADJACENT TO LeAD.
7-92
Magnified Character
Font Description
Device Pin Description
Pin
No.
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Figure 7.
24
25
26
Function
Anode
Anode
Anode
Cathode
Cathode
Cathode
Cathode
Anode
Anode
Anode
Anode
Anode
Anode
Anode
Anode
Anode
Cathode
Cathode
Cathode
Cathode
Anode
Anode
Anode
Anode
Anode
Anqde
Segment K
Segment 01
Segment C
Digit 1
Digit 2
Digit 3
Digit 4
Segment L
Segment Gz
Selfment E
Segment M
Segment D2
Segment DP
Segment Az
Segment'
Segment J
Digit 8
Digit 7
Digit 6
Digit 5
Segment Co
Segment G1
Segment B
Segment F
Segment H
Segment Al
operational Considerations
ELECTRICAL
The HDSP-6300 device utilizes large monolithic 16 segment plus centered decimal point and colon GaAsP LED
chips. Like segments of each digit are electrically interconnected to form an 18 by N array, where N is the
quantity of characters in the display. In the driving scheme
the decimal point or colon is treated as a separate character with its own time frame.
This display is designed specifically for strobed (multiplexed) operation. Under normal operating situations the
maximum number of illuminated segments needed to
represent a given character is 10. Therefore, except where
noted, the information presented in this data sheet is for a
maximum of 10 segments illuminated per character:
7-93
The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
values and typical power dissipation. Expected maximum
VF values for the purpose of driver circuit design may be
calculated using the following VF model:
VF = 1.85V + IpEAK (1.8lll
For 30mA ~ IPEAK ~ 150mA
VF = 1.58V + IpEAK (10.7lll
For 10mA ~ IPEAK ~ 30mA
'More than 10 segments may be illuminated in a given character.
provided the maximum allowed character power dissipation,
temperature derated, is not exceeded.
OPTICAL AND CONTRAST
ENHANCEMENT
Each large monolithic chip is positioned under a separate
element of a plastic aspheric magnifying lens producing a
magnified character height of 3.56mm (0.140 inch). The
aspheric lens provides wide included viewing angles of 60
degrees horizontal and 55 degrees vertical with low off
axis distortion. These two features, coupled with the very
high segment luminous sterance, provide to the user a
display with excellent readability in bright ambient light
for viewing distances in the range of 1.5 metres. Effective
contrast enhancement can be obtained by employing an
optical filter product such as Panelgraphic Ruby Red 60,
Dark Red 63 or Purple 90; SGL Homalite H100-1605 Red or
H100-1804 Purple; or Plexiglas 2423. For very bright
ambients, such as indirect sunlight, the 3M Red 655 or
Neutral Density Light Control Film is recommended.
MECHANICAL
This device is constructed by LED die attaching and wire
bonding to a high temperature PC board substrate. A
precision molded plastic lens is attached to the PC board.
The HDSP-6300 can be end stacked to form a character
string which is a multiple of a basic eight character
grouping. These devices may be soldered onto a printed
circuit board or inserted into 28 pin DIP LSI sockets. The
socket spacing must allow for device end stacking.
Suitable conditions for wave soldering depend upon the
specific kind of equipment and procedure used. It is recommended that a non-activated rosin core wire solder or a low
temperature deactivating flux and solid wire solder be used
in soldering operations. For more information, consult the
local HP Sales Office or Hewlett-Packard Components, Palo
Alto, California.
7-94
FliOW
a!e..
LARGE 5 x 7 DOT MATRIX
ALPHANUMERIC DISPLAYS
HEWLETT
PACKARD
17.3 mm (0.68 inJ STANDARD RED HDSP-4701/4703
26.5 mm (1.04 inJ STANDARD ReD HOSP-4401/4403
26.5 mm (1.04 in.J HIGH EFFiCiENCY RED HDSP-4501/4503
Features
• LARGE CHARACTER HEIGHTS
• 5 x 7 DOT MATRIX FONT
• VIEWABLE UP TO 18 METERS (1.04 in. DISPLAY)
• X-Y STACKABLE
• IDEAL FOR GRAPHICS PANELS
• AVAILABLE IN COMMON ROW ANODE AND
COMMON ROW CATHODE CONFIGURATIONS
• CATEGORIZED FOR INTENSITY
• MECHANICALLY RUGGED
• AVAILABLE IN CUSTOM DISPLAY BOARDS
Description
The large 5 x 7 dot matrix alphanumeric display family is
comprised of 26.5 mm (1.04 inch) character height packages (HDSP-440X Standard Red, and HDSP-450X High
Efficiency Red) and 17.3 mm (0.68 inch) packages (HDSP470X Standard Red). These devices have excellent viewability; the 1.04 inch character font can be read at up to
18 metres (12 metres for the 0.68 inch device).
has an industry standard 7.6 mm (0.3 inch) DIP configuration.
Applications include electronic instrumentation, computer
peripherals, point of sale terminals, weighing scales, and
industrial electronics.
These devices utilize a 10.2 mm (0.4 inch) dual-in-line (DIP)
configuration for the 1.04 inch font, while the 0.68 inch font
Devices
Pari
Number
Color
Description
HDSP-4701
HDSP-4703
Standard
Red
17.3 mm Common Row Anode
17.3 mm Common Row Cathode
HDSP-4401
HDSP-4403
Standard
Red
26.5 mm Common Row Anode
26.5 mm Common Row Cathode
HDSP-4501
HDSP-4503
High Efficiency
Red
26.5 mm Common Row Anode
26.5 mm Common Row Cathode
7-95
Package Dimensions (HDSP-470X Series)
DATE
cooe
2.54
(O.IOl
L.
u;4
(0.1<»
i
r-
COLOR 81N
NOTE ••
LUMINOUS
INTENSITV
CATEGORY
NOTES,
1. ALL DIMENSIONS IN MILLIMETRES UNCHES).
2. ALL UNTOLERANCED DIMENSIONS ARE FOR
REFERENeE ONLY.
3. A NOTCH ON SCRAMBLeR SIDE DENOTES
PIN t.
4. FOR GREEN ONLY.
LEFT SIDE VIEW
FUNCTION
PIN
HDSP·4701
HDSP·4703
1
COLUMN 'I CATHODE
ROW 1 CATHODE
2
ROW 3 ANODE
ROW 2 CATHODE
3 COLUMN 2 CATHODE
COLUMN 2 ANODE
4
ROW 5 ANODE
COLUMN 1 ANODE
5
ROW 6 ANODE
ROW 6 CATHODE
6
ROW7 ANODE
'ROW 7 CATHODE
7 COLUMN 4 CATHODE
COLUMN 3 ANODE
8 COLUMN 5 CATHODE
ROW 5 CATHODE
9
ROW 4 ANODE
COLUMN 4 ANODE
10 COLUMN 3' CATHODE
ROW 4 CATHODE
n
ROW 2 ANODE
ROW 3 CATHODE
12
ROW 1 ANODE
COLUMN 5 ANODE
fRONT VIEW
&.GO
(O.260) MAJ(.
END VIEW
Package Dimensions (HDSP-440X/-450X/Series)
PIN 1 ReFERENCE
:1.25
(0.131
DATE ODDe
t
13
12
11
10
COLOR 81N
NOTE 4.
LUMINOUS
INTENSITV
CATEGORY
LEFT SIDE VIEW
f!==L j:JL-':
-bj'
I
,
NOTES:
6.35
1. ALl'DIMENSIONS IN MILLIMETIlES (lNCHESI. (O.25ll1 MAX.
2. ALL UNTOLERANCED DIMENSIONS ARE fOR
REF£RENCE ONLV.
3. A BLACK OCT ON SCRAM8LER $IDE
INDICATES I'IN #t.
.. FOR GREEN ONLY.
FUNCTION
PIN
1 COLUMN 1 CATHODE
ROW 1 CATHODE
NO PIN
NO PIN
2
3
ROW 3 ANODE
COLUMN 3 ANODE
COLUMN 2 CATHODE
ROW 3 CATHODE
4
NO PIN
NO PIN
5
6
ROW 5 ANODE
COLUMN 1 ANODE
7
NO PIN
NO PIN
1.0
S
ROW 6 ANODE
COLUMN 2 ANODE
Cc)'041
9
ROW 7 ANODE
ROW 7 CATHODE
10 COLUMN 3 CATHODE
ROW S CATHODE'
11, COLUMN 5 CATHODE
COLUMN 4 ANODE
12
NO PIN
NO PIN,
'
I
13
ROW 4 ANODE
ROW 5 CATHODE
4.76
14
NO PIN
' N O PIN
(O.19) 15 COLUMN 4 CATHODE
ROW 4 CATHODE
16
ROW 2 ANODE
, ROW2CATHODE
17
NO PIN
NO PIN
......IS--'__R_0_W_l_A_N_0_D_E_ _"-C_0_L_U_M_N_5_A_N_0_D_E.......
f
4.0&
""'11--""'111""
II
U
I;
to.161 (to2~ISO.
MIN.
II
U
to.16
to.4Ol
END VIEW
,7-96
Internal Circuit Diagrams
HDSP-4401/4501/
HDSP-4403/4503/
HDSP-4701/
COMMON
ANODE ROW
COMMON
CATHODE ROW
COMMON
ANODE ROW
COLUMN
x = ROW OR COLUMN NUMBER,
COLUMN
0·
HDSP-4703/
COMMON
CATHODE ROW
COLUMN
COLUMN
x • ROW OR COLUMN NUMBER,
PIN NUMBER
0=
PIN NUMBER
Absolute Maximum Ratings at 25°C
HDSP·440X Series
HDSP-470X Series
HDSP-450X Series
Average Power per Dot (TA" 25·C)j1]
75mW
75mW
Peak Forward Current per Dot (TA = 25·C)12]
90mA
125mA
Average Forward Current per Dot (TA = 25·C)!3]
15mA
25mA
Operating Temperature Range
-40· C to +850 C
Storage Temperature Range
-40·C to +85·C
Reverse Voltage per Dot
3.0 V
Lead Solder Temperature
(1.59 mm [1/16 inch] below seating plane)
260 C for 3 sec.
0
Notes:
1. Average power is based on 20 dots 'on' per character. Total package power dissipation should not exceed 1.S W.
2. Do not exceed maximum average current per dot.
3. For the HDSP-440X series and HDSP-470X series displays, derate maximum average current above SO°C at 0.4 mA/oC. For the
HDSP-4S0X series displays, derate maximum average current above 3SoC at 0.2 mA/oC. This derating is based on a device mounted
in a socket having a thermal resistance from junction to ambient of 1000°C/W per dot.
Electrical/Optical Characteristics at TA =25°C
STANDARD RED HDSP-470X SERIES
Description
Luminous Intensity/Dot!4!
(Digit Average)
Peak Wavelength
Dominant Wavelengtht5]
Symbol
Test Conditions
Min.
Typ.
Iv
100 mA PI<: 1 of 5
Duty Factor (20 mA Avg.)
360
770
Max.
Units
}lcd
APEAK
655
nm
AD
640
om
Forward Voltage/Dot
VF
IF= 100mA
1,8
Reverse Voltage/Dot or DPI61
VR
IR = 100}lA
12
V
2,2
V
Temperature Coefficient of VF/Dot
J:.VFJOC
-2.0
mWoC
Thermal Resistance LED Junctlon-to-Pin
per Dol
RcflJ-PIN
420
°C/W/
Dot
7-97
STANDARD RED HDSP-440X SERIES
Description
Luminous Intensity/Dotl4 1
(Digit Average)
Symbol
Test Conditions
Min.
Typ.
Iv
100 mA Pk: 1 of 5
Duty Factor (20 mA Avg.)
400
860
"cd
nm
'\PEAK
655
Dominant Wavelengthl 5j
'\D
640
Forward Voltage/Dot
VF
IF = 100 mA
Reverse Voltage/Dot or DP[6}
VA
I R " 100 J.tA
Peak Wavelength
1.8
3.0
Max.
Units
nm
2.2
V
12
V
Temperature Coefficient of VF/Dot
t;,.VF/"C
-2.0
mVl·C
Thermal Resistance LED Junction-to-Pln
per Dot
RJ-PIN
380
·C/W/
Dot
HIGH EFFICIENCY RED HDSP-450X SERIES
Description
Luminous Intensity/Dot[4]
(Digit Average)
Peak Wavelength
Dominant Wavelength[5]
Symbol
Test Conditions
Min.
Typ.
Iv
50 mA Pk: 1 of 5
Duty Factor (10 mA Avg.)
1400
3500
Max.
Units
"cd
APEAK
635
nm
"-0
626
nm
Forward Voltage/Dot
VF
IF= 50 mA
Reverse Voltage/Dot or DPI6]
VA
IA = 100 "A
2.6
3.0
:'k5
V
25.0
V
Temperature Coefficienl of VF/Dot
/:,VF/"C
-2.0
mVl"C
Thermal Resistance LED Junction-to-Pin
per Dot
RJ-PIN
380
·C/W/
Dot
Notes:
4. The displays are categorized for luminous intensity with the intensity category designated by a letter on the left hand side of the
package. The luminous intensity minimum and categories are determined by computing the numerical average of the individual
segment intensities.
5. The dominant wavelength is derived from the C.I.E. Chromaticity diagram and is that single wavelength which defines the color of the
device.
6. Typical specification for reference only. Do not exceed absolute maximum ratings.
7. The displays are categorized as to dominant wavelength with the category designated by a number adjacent to the intensity category
letter.
7-98
------------- - - - -
0
160
~
5
I
0
§
....~
I
5
: 'TfaJj.\;OX/440X
I
I"
5~
...... I'!-.
0
5
o
10
20
30
40
50
a:
r--.... "
J
E>JA • 1000'eM/DOT
0
a:
ac
)
60
70
SO
TA - AMBIENT TEMPERATURE -
I90
f.-
100
15a:
0
He P.450X
14 0
120
1/
0
0
I
0
I
II-
~
o
o
100
Figure 1. Maximum Allowable Average Current Per Dot
as a Function of Ambient Temperature
IpEAK
"""HDSP-460X
./)
v, -
~c
I
I
0
~
f-HOSP.41QXI440X
FORWARD VOLTAGE - V
Figure 2. -Forward Current vs. Forward Voltage
HDSP-440X/470X, HDSP-450X
-
PEAK DOT CURRENT - rnA
Figure 3. Relative Efficiency (Luminous Intensity Per Unit Dot)
vs. -Peak Current per Dot
operational Considerations ELECTRICAL
Circuit Design
These display devices are composed of light emitting diodes,
with the light from each LED optically stretched to form
individual dots.
These display devices are well suited for strobed operation.
The typical forward voltage values, scaled from Figure 2,
should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum VF
values, for the purpose of driver circuit design and maximum power disSipation, may be calculated using the following VF MAX models:
+ IpEAK (6.5 0)
For 5 mA::; IpEAK::; 125 mA
HDSP-440X/-470X Series:
VF = 1.55 V
HDSP-450X Series:
VF
MAX = 1.75 V + I PEAK (35 0)
For IpEAK ~ 5 mA
The Coded Data Controller circuit, shown in Figure 4, is
designed to display eight characters of ASCII text. ASCII
coded data is stored in a local 128 x 8 RAM. After the
7-99
microprocessor has loaded the RAM, local scanning circuitry controls the decoding of the ASCII, the display data
loading and the display row select function. With minor
modifications the circuit can be utilized for up to 128
display characters. The RAM used in this circuit is an
MCM6810P with the address and data inputs isolated with
tristate buffers. This allows the RAM to be accessed either
by the microprocessor or by the local scanning electronics.
The protocol is arranged such that the microprocessor
always takes precedence over the local scanning electronics.
The Motorola 6810 RAM stores 8 bytes of ASCII data which
is continuously read, decoded and displayed. The ASCII
data from the RAM is decoded by the Motorola 6674 128
character ASCII decoder. The 6674 decoder has five column
outputs which are gated to the Sprague UCN5832A 32 bit
shift register data input via a 74LS151 multiplexer. Strobing
of the display is accomplished ,via the 74LS90, 74LS393 and
74LS197 counter string.
THERMAL CONSIDERATIONS
The thermal resistance of the device may be used to
calculate the junction temperature of the central LED.
Equation 1 is used to calculate the junction temperature of
the central (hottest) LED.
Tj = Po X 0j-a + T A
Po = VF(max) x IF(avg)
0j-a = 0j-pin + 0 pin-a
(1 )
(2)
(3)
Tj is the junction temperature of the central LED.
T A is the ambient temperature.
0j-a is the thermal resistance from the central LED to the
ambient.
0 pin-a is the thermal resistance from the case (any pin) to
the ambient.
0j-pin is the thermal resistance of the device.
VF(max) is calculated using the appropriate VF model.
Po is the power diSSipated by one LED.
The 74LS197 is used as a divide by 7 counter. Output 0 0
resets the counter and loads output OA to logic 1 and
outputs as, Oc and 00 to logic O. Outputs OA, as, and Oc
of the 74LS197 are used to synchronize the row drivers and
the row data entry into the shift register. Row drivers are
sequentially turned on and off so that only one row driver
is on at a given time.
The junction temperature of the central LED was measured
with all of the dots on at a fixed drive current. The thermal
resistance was calculated by using equation 4.
The 74LS393 counter is used as a divide by 64 counter.
This counter has two functions. The first is to provide the
address of the character to be decoded. Outputs lOA, las,
and lac supply the address to the RAM. The other function
is to generate a signal which will simultaneously clock the
74LS197, disable the row drivers and shift register outputs,
and provide one of the logic signals needed to enable the
system clock to clock data into the shift register. Outputs
10o, 20A, and 20s are gated to create this Signal. The duty
factor for this system is 1 of 8 or 12.5%.
CONTRAST ENHANCEMENT
The 74LS90 is connected as a divide by 5 cascaded into a
divide by 2 for an effective divide by 10 counter. Outputs
as, Oc, and 00 are used to convert the parallel output
from the character generator to serial input for entry into
the shift register. Output QA in combination with the system
clock and the gated outputs of the 74LS393 counter are
used to clock data into the shift register. When character
data is loaded into the shift register, output OAalternates
between allowing data to be loaded and providing setup
time for a valid address at the RAM to generate valid
decoded character data at the output of the 74LS151 multiplexer.
0j-pin = (Tj - T pin)/Po
(4)
Where T pin is the temperature of the hottest pin.
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept
is to employ both luminance and chrominance contrast
techniques to enhance the readability by having the OFFdots blend into the display background and the ON-dots
stand out vividly against this same background. Therefore,
these display devices are assembled with a gray package
and matching encapsulating epoxy in the dots.
Contrast enhancement may be achieved by using one of
the following suggested filters:
HDSP-440X/-470X:
Panelgraphic RUBY RED 60
SGL Homalite Hl00-1605 RED
3M Louvered Filter R6610 RED or N0210 GRAY
HDSP-450X:
Panelgraphic SCARLET RED 65 or GRAY 10
SGL Homalite Hl00-1670 RED or Hl00 GRAY
3M Louvered Filter R6310 RED or N0210 GRAY
For further information on contrast enhancement please
see Application Note 1015.
This circuit can be used with the HDSP-4701 with minor
modifications due to different pin locations. HDSP-4X03
devices require a change of both the shift register and
drive transistors. The shift register can be changed to a
Sprague UCN-5818. This part has different pin assignments than the UCN-5832. For further details consult the
Sprague data sheet. The MJE700 Darlington transistors
need to be replaced with suitable npn Darlington transistors.
7-100
74LS367
D6
Os
D4
OJ
~____
D1
14 6A
6Vf.'~3----------------------------------------,
12 5AW~~~'~I--------------------------------------'
10 4A~~4Yf9~------------------------------____--,
6 3A;E3y~7~----------------------__________- - ,
4 2A
2 lA
m2V~5~
ly~3~
1
________________________________,
______________________________,
J
'"
MCM6810
V"
MCM6674
24
:
~
I~~:
M
Vee Do 2
Au
4Y 9
01 3
6 Al
7
024
SA2
5Y 11
~
-WR
."
OJ 5
4
D4
3 A4
05
~ ~
~
~
f,]
74lS151
UCN5832A
c
z
o
T
II.
~
- , '
4
38
g
~
~
n
1
no en <
o
~3
r-m .... n
~
;>:;
~n
Cl
2
C
UCN5832A
AJ
OS
~
74LS368 3 5 7
I:
Vee
iil
~
11 RS1
CS 13
10 RS2
CS 10
8 RS3
74LS14
0
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
17
0
Q.
0
'5V
0
3-
2~
0
if
lMHz
CLOCK
2.7k~l
-KSJ
INPUT
S:
h.
I
0
I
0
I
~
~
~
~
-5V
~
l!1
~
I
0
~
~
74lS14"
l ___..] .
74LS14
~
Y
12
9
11 ......... _10
DI~LAY
I DI~LAY I DI~LAY I
D1S:lAY
I OI~LAY I DI~lAY I DI~LAY I OIS;L~Y
MJE700
V
74LS10
74LS14
SOLID STATE
DISPLAYS
MECHANICAL HANDLING
To optimize device optical performance, specially developed
plastics are used which restrict the solvents which may be
used for cleaning. It is recommended that only azeotropes
of Freon (F113) and isopropanol and/or ethanol be used for
vapor cleaning processes, with an immersion time in the
vapors of less than 2 minutes maximum. Some suggested
vapor .cleaning solvents are Freon TE, Genesolve DES, DI15 or DE-15, Arklone A or K. A 60° C (140° F) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1 % detergent solution or equivalent), a hot water
rinse and thorough air dry. Total exposure to hot water
should not exceed 15 minutes. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, ethanol,
isopropanol or water with a mild detergent.
Cleaning agents from the ketone family (acetone, methyl
ethyl ketone, etc.) and from the chlorinated hydrocarbon
family (methylene chloride, trichloroethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED
parts. All of these various solvents attack or dissolve the
plastics and encapsulating epoxies used to form the packages of these LED devices.
For further information on soldering and cleaning please
see Hewlett-Packard Application Note 1027.
7-102
. _ - - - - - -. . .- - - .. ----.
FliPW
HEWLETT
-------
-----_._._._.
---
Double, ~eterOjuncti()n AIGaAS RED
LOW CURRENT SEVEN SEGMENT DISPLAYS
~I.!AI PACKARD
7.6 mm (0.3 In)
10.9 mm (0.43 In)
14.2 mm to.56 In)
20.0 mm to.a Inl
HOSP'A101 SERIES
HOSP-E100 SERIES
HDSP-H101 SERIES
HDSP-N100 SERIES
Features
• LOW POWER CONSUMPTION
Typical Power Consumption is 1.6 mW/Seg
at 1 rnA Drive
Ideal for Battery Operated Applications
Special Selection is Available for Operation
at '12 rnA
o
TYPICAL INTENSITY OF 650 /-Lcd/Seg AT 1 rnA
DRIVE
o
EXCELLENT FOR MULTIPLEXING LONG DIGIT
STRINGS
o
COMPATIBLE WITH MONOLITHIC LED
DISPLAY DRIVERS
• FOUR CHARACTER SIZES
7.6 mm (0.3 in), 10.9 mm (0.43 in), 14.2 mm
(0.56 in), 20.0 mm (0.8 in)
o
COMMON ANODE OR COMMON CATHODE
Overflow ± 1 Character
o
EXCELLENT CHARACTER APPEARANCE
Wide Viewing Angle
Grey Body for Optimum Contrast
• CATEGORIZED FOR LUMINOUS INTENSITY
Use of Like Categories Yields a Uniform Display
Description
This line of solid state LED displays uses newly developed
Double Heterojunction (DH) AIGaAs/GaAs material to emit
deep red light at 650 nm. This material has outstanding
efficiency at low drive currents and can be either DC or
pulse driven. Viewability at up to 10 metres (HDSP-Nl00
Series) is available for applications such as instruments,
weighing scales, meters and point-of-sale terminals.
Devices
Pari No.
HOSP·
Character
Size
Al01
A103
Al0?
Al0a
0.3" Mini
(?6mm)
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
A
B
C
El00
El01
E103
E106
E
0.43"
(10.9mm)
Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Universal Overflow ±1
Hl01
H103
Hl0?
Hl0S
0.56"
(14.2 mm)
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±l Common Anode
Overflow ±1 Common Cathode
Nl00
Nl01
N103
Nl0S
Nl06
O.S"
(20mm)
Package
Drawing
Description
Common Anode Left Hand Decimal
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Common Cathode Left Hand Decimal
Universal Overflow ±1
7-103
0
F
G
H
I
J
K
L
M
N
0
P
Q
package Dimensions (HDSP-A101 Series)
MITERED CORNER FOR
PIN 1 REFERENCE
lr IJ~.1
1.27
lcr
------.r-1.0501
LUMINOUS
INTENSITY
CATEGORY
,--,...----- t
II~~~I
------1
DATE CODE
~
1);
5.08
(.2001
.380
L~
TYP,
3.81
MINUS
1.1501
9.91
!
!
1.500 , .0151
'}
'-L
' 2.5
4
(.100)
S.09
(.240)
12.7
t
_J
~~1
~
TVP.
MIN.
1.3901
,~:,BL
j~
5.08
~ I~;~~I
NOTE 2
REF.
A,B
',f
2.97D
1.1171 I 7.S2· I
r-1.3001-J
C,D
Notes:
1. All dimensions in millimetres linchesl.
2. Maximum.
3. All untoleranced dimensions are for
reference only.
4. Redundant anodes.
5. Redundant cathodes.
fUNCTION
a
PIN
A
1 ANOOEt 4 1
2 CATHODE t
3 CATHODE 9
,.27
(,0501
1.200)
C
ANODE(4)
0
CATHODE IS)
ANODE 9
ANODE e-
CATHODE PLuS
CATHODE MINUS
NC
ANODE PLUS
ANODE MINUS
NC
ANOD, d
NC
NO
CArHoDE!5t
CATHODE IS!
ANODE t
4 CATHOOE e5 CATHODE"
6 ANOOt:-141
7 CATHODE OP
B CATHODE c
9 CATHODE h
10 CATKODE a
CATHOOE!SI
ANODE 141
ANODE DP
ANODE <
CATHODE OP
CATHODE (:
ANODE OP
ANOOE b
CATHOOE b
ANODE b
ANODE ~
NC
NC
ANOOE c
Package Dimensions (HDSP-E100 Series)
j
7.01 f.2761
: tf~ ~
-1-~~
j
.
+
1
10'
+
+'u.~u(;+
10.921.4301 4 +
5
-'--_--'s+-+o-=
7 0+
10
+
d1
"1:1-::----'-
~_-t--+I-a
~~
NO"4J
~.35 (.2501
3.1al.125)
NOTE (4]
- - 5.21 f.205)
H
F,G
E
FRONT VIEW
fUNCTION
1---'2.701.500)1
I
MAX.
.
LUMINOUS
INTENSITY
PIN
CATEGORY
~
uR-15-'}'-I~-)-ls-I2~-~)
f~
4.061. 1S0)
Ii
I
7,S2
I
'
I
ANOO-e:·a
2
CATHODE·i
CATHODE·'
ANOOE·'
a
ANODE{~1
ANODE~)!
CATHOOEISI
4
NO-PIN
NO PIN
5
NO PI"
CATHODE·dp
CATHODE·,
CATI
30
,-
1,3
60
70
8085 90
100
10
TA - AMBIENT TEMPERATURE _ °C
20
30
40
50
PEAK CURRENT - rnA
Figure 1. Maximum Allowable Average or DC Current
per Segment vs. Ambient Temperature
Figure 2. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak Segment Current
7-107
- - - - - . - - . -..- - - - . - -..
O.SmA
O.B
-.--~
.. - ..
50.0
20.0
1 10.0
I
!2w
0:'
0:
5.0
:>
"0
2.0
0:
~
1.0
~
0.5
0:
I
...
0.2
0.1
0
0.5
v, -
1.0
1.5
2.0
2.5
FORWARD VOLTAGE - V
I, - DC FORWARD CURRENT - mA
Figure 3. Forward Current VS. Forward Voltage
Figure 4. Relative L~mlnouB Intensity VB. DC Forward Current
Electrical
Contrast enhancement may be achieved by using one of
the following suggested filters:
The HDSP-A101lE100/H101/N100 series of display devices
are composed of light emitting diodes, with the light from
each LED optically stretched to form individual segments
and decimal points. These displays have their p-njunctions
formed in AIGaAs epitaxial layers grown on a GaAs substrate.
These display devices are well suited for strobed operation. The typical forward voltage values; scaled from Figure
3, should be used for calculating the current limiting
,resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit design
and maximum power dissipation, may be calculated using
the foilowing VF MAX model:
VF MAX = 2.0 V + IpEAK (10 OJ
For: IpEAK 2': 20 mA
VF MAX = 1.B V + Ibc (200)
For: loc:S; 20 mA
These displays are compatible with monolithic LED display
drivers. See Application Note 1006, for more information.
Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these disPlay devices are assembled
with a gray package and matching encapsulating epoxy in
the segments.
Panelgraphic RUBY RED 60
SGL Homalite H100-1605 RED
3M Louvered Filter R6610 RED or N0210
GRAY
Mechanical
To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve 01-15 or
DE-15, Arklone A or K. A 60°C (140°F) water cleaning
process may also be used, which includes a neutralizer
rinse (3 0/0 ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.
Such cleaning agents from the ketone family (acetone,
methyl ,ethyl ketone, etc.! and from the chlorinated
hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.) are not recommended for
cleaning LED parts. All of these various solvents,attack or
dissolve 'the encapsulating epoxies used to form the
packages of plastic LED devices.
7-108
-----------------
l0WCURRENT
FliHW
SEV
HEWLETT
a!~ PACKARD
HIGH Ef;FICIENC.:rRED
SEGMENT ell.SPLAYS
7.6 mm (0.3ih)
HDsp-i$11.?ERIES
10.9 mm (0.43 In) HqSPt 335Q.SERIES
14.2mm (0.56 in) HDSP-555t.SERIES
Features
o
LOW POWER CONSUMPTION
Typical Power Consumption is 3 mW/Seg
at 2 rnA Drive
o TYPICAL INTENSITY OF 300 !",cd/Seg
AT2 rnA DRIVE
o CAPABLE OF HIGH CURRENT DRIVE
Excellent for Long Digit String Multiplexing
o COMPATIBLE WITH MONOLITHIC LED
DISPLAY DRIVERS
• THREE CHARACTER SIZES
7.6 mm (0.3 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in)
o COMMON ANODE OR COMMON CATHODE
Overflow ±1 Character
o EXCELLENT CHARACTER APPEARANCE
Wide Viewing Angle
•
CATEGORIZED FOR LUMINOUS INTENSITY
Use of Like Categories Yields a Uniform Display
Description
The HDSP-7511, HDSP-3350, HDSP-5551 series are 7.6 mm
(0.3 in), 10.9 mm (0.43 in) and 14.2 mm (0.56 in) high efficiency red displays featuring low power consumption. The
HDSP-7511 series are designed for viewing distances up to
2 meters, the HDSP-3350 series for viewing distances up to
5 meters, and the HDSP-5551 series for viewing distances
up to 7 meters. Typical applications include instruments,
scales, point-of-sale terminals and meters.
Devices
Package
Drawing
Part Number
Color
Descriplion
HDSP-7511
HDSP-7513
HDSp·7517
HDSP-7518
High
Efficiency
Red
7.6
7.6
7.6
7.6
HDSP-3350
HDSP-3351
HDSP-3353
HDSP-3356
High
Efficiency
Red
10.9 mm
10.9 mm
10.9 mm
10.9 mm
Common Anode Left Hand Decimal
Common Anode Right Hand DeCimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Decimal
HDSP-5551
HDSP-5553
HDSP-5557
HDSP-5558
High
Efficiency
Red
14.2 mm
14.2 mm
14.2 mm
14.2 mm
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
OverflOw ±1 Common Anode
OverflOW ±1 Common Gathode
mm
mm
mm
mm
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
7-109
A
B
C
D
E
F
G
H
I
J
K
L
package Dimensions (HDSP-7511 Series)
MITERED CORNER FOR
PIN 1 REFERENCE
lr lJ~1
1.27
_.SI.0501
LUMINOUS
INTENSITY
.-----.:=----. -.
CATEGORV
T
QATECOOE
10'
.508
11.0201
----.i
TYP.
1lI~--.it
_{_~~
r.. I--LI~;~I
J.-
5.08
1.2001
6.09'1* --1.2401,
9.91
1---1.3901'
REF.
J
A, B
.254
(,0101
TVP.
3.81
1.1501
MIN.
MINUS
C,D
Noles:
9
J
FUNCTION
'~1.27
i '
4. Redundant anodes.
5. Redundant cathodes.
1. All dimensions in millimetres !inchesl.
2. Maximum.
3. All untoleranced dimensions are for
reference only.
PIN
1
2
3
4
5
-(,0501
5.0~.1.1.2001
B
A
ANODEI'I
CATHODE f
CATHODE 9
CATHODE.
CATHODe 151
ANODE'
ANOOEg
ANOOE e
ANOOE d
CATHODE d
CATHODEI~l
6 ANOOEI41
7
cATHODE OP
ANOOE DP
S CATHODE.
ANODE
9
ANODE b
ANODE: a
CA~HODE b
10 CATHODE.
~
0
C
ANODE 1.1
CATHODE PLUS
CATHOOE MINUS
ANODE PLUS
ANODE MINUS
NC
NO
NO
CATHODE h
NC
CATHQOEI"
ANODE 0.
AI'lODE <
ANOOEf b
NC
1';0
ANOOE!4.1
CATHODE DP
CATHOPE e
CATHODEI~I
package Dimensions (HDSP-3350 Series)
10'
10'
12
11
10
11-__1-_+\8
L.._ _.....,......... 8
3.181.1251
It
R.H.D.P.
NOTE 141
R.H.D.P.
I--.J"~-f- 5.21 1.2051
G
F,H
E
FRONT VIEW
1.17 MAX.
LUMINOUS
INTENSITV
CATEGORV
1--12.701.500'1
1-
MAX.
_..!!_-'L
u~ 1~:i~~1 I~~'
--==r--,
I
I
!~ltr~'
. :++1
1
4.061.1601
MIN.
r-I
7.62
I
2.~4
I
DATE CODE
END VIEW
16.24
1.6001
=f=-_l
~!~I~O~~'
1.3001~
FUNCTION
1.1001
SIDE VIEW
NOTES:
1. Dimensions in millimeters and (inches).
2. All untoleranced dimensions are
for reference only
3. Redundant anodes.
4.
5.
6.
7.
Unused dp position.
See Internal Circuit Diagram.
Redundant cathode.
See part number table for L.H.D.P. and R.H.D.P. designation.
7-110
PIN
Eo
F
G
H
1
CATHODE·,
2
CATHODE,f
3
4
ANODE III
NO PIN
NOPIN
CATHODE·dp
CATHODE",
CATHDDEod
NoeON""I'1
CATHODS·t;
CATftOOE·,
NO PIN
CATHODE·b
CATHODE·.
CATHODE-'
ANODEI31
NOPIN
NOPJN
NOCClNN.tsl
CATHODE·.
CATHODEod
CATHooe",.
CATtlODE.-e
CATHOOEo,
NO PIN
CATHOOE·b
ANODEt31
ANOOt·.
ANODE-I
CATHODE 101
NO PIN
NOCONN.lOl
ANODE..
ANODE'"
ANODEodp
CATHODE"
ANODE-d
NO PIN
CATHODE..
CATHODE·.
ANODh
ANODE-c
ANODE"'''
CATHODEod.
ANOD(·c
CATHODE.·b
ANODh
NOP'N
ANODE·b
CATHODE 1.1
CATHODE..
NO PIN
ANODe ..
""OOE·b
$
6
1
8
9
10
"12
13
14
ANODEI)I
~PIN
package Dimensions (HDSP-5551 Series)
TOP END VIEW I, J, K, L
FRONT VIEW I, J
100
LUMINOUS
INTENSITY
CATEGORY
FUNCTION
L
K
PIN
CATHODEe
CATHODEd
ANOOE!4~
CATHODEc
--I
I
9 8 7 6
B.OO
13151
CATHODEDP
I--I ~I~~~I
CATHOPEb
.254
CATHODE a
ANODEI 4 1
[1~-r~l
:'0
CATHODE!
10
CATHODEg
1.6001
..
J L
~
Noles:
1. All dimensions in millimetres (inches).
6.B6
12701
FRONT VIEW K, L
2.
3.
4.
5.
SIDE VIEW I, J, K, L
Maximum.
All untoleranced dimensions are for reference only.
Redundant anodes.
Redundant cathodes.
Internal Circuit Diagram
A
10
10
10
10
B
14
13
11
;.c+----+-11
10
E
F
1 2 3 4
H
G
5
1 2 3 4 5
K
J
7-111
1
2 3 4
L
5
Absolute Maximum Ratings (All Products)
Average Power per Segment
or DP (TA = 25°C) ..............•..•...•...... 52 mW
Peak Forward Current per Segment
or DP (TA = 25°C)11l ............•.............. 45mA
Notes:
1. Do not exceed maximum
average current per
segment.
2. Derate maximum average,
current above T A = 65° C at
0,4 mAr C per segment, see
Figure 1, Derate maximum
DC current above TA = 78 0 C
at 0.6 mAIo C per segment.
Average or DC Forward Current per Segment l2l
or DP (TA = 25°C) ......•..•....••.....••••... 15 mA
Operating Temperature Range ••••.••.• -40°C to +85°C
Storage Temperature Range .........• -55° C to +100° C
'Reverse Voltage per Segment or DP .............• 3.0 V
Lead Solder. Temperature
(1,59 mm [1/16 inch] below
seating plane) ........................ 260° C for 3 sec,
Electrical/Optical Characteristics at TA = 25 0 C
HIGH EFFICIENCY RED HDSP-7511 SERIES
Description
Luminous Intensity/Segmentl3j
(Digit Average)
Symbol
Iv
Test Conditions
Min.
Typ.
2mADC
160
270
5mADC
1050
40 mA Pk; 1 of 4
Duty Factor
3500
Max.
Unlts
licd
APEAK
635
nm
Dominant Wavelengthl 4j
hd
626
nm
Forward Voltage/Segment or DP
VF
Peak Wavelength
IF=2mA
IF=5 mA
IF= 20 mA Pk
=1.6
1.7
=
3,0
2.1
V
2.5
30,0
V
Temperature Coefficient of VF/Segment or DP
t:.VF/oC
-2,0
mVI"C
Thermal Resistance LED Junction-to·Pin
ROJ.PIN
200
°C/W/
Seg
Reverse Voltage/Segment or OpjSj
VA
IA '" 100 /lA
HIGH EFFICIENCY RED HDSP-3350 SERIES
Description
Luminous Intensity/SegmentlSj
(Digit Average)
Peak Wavelength
Symbol
Iv
Tesf Conditions
Min.
Typ.
2mADC
200
300
5mADC
1200
40 mA Pk: 1 of 4
Duty Factor
3900
Max.
Units
/led
APEAK
635
nm
Dominant Wavelengthl4j
Ad
626
nm
Forward VoltagelSegment or DP
VF
IF=2mA
1.6
V
IF=5mA
1,7
IF =20mA Pk
Reverse Voltage/Segment or OPI5j
VR
IR =100 pA
2.1
3,0
2.5
30.0
V
Temperature Coefficient of VF/Segment or DP
J.VF/oC
-2.0
mV/·C
Thermal Resistance LED Junction-to-Pin
R8J-PIN
282
°C/WI
Seg
7-112
----.-.-_._--.-.
HIGH EFFICIENCY RED HDSP-5551 SERIES
t;
Description
Symbol
Luminous Intensity/Segmentl31
(Digit Average)
Iv
Peak Wavelength
Tesl conditions
Min.
Typ.
2mADC
270
370
10 mA DC
3400
40 mA Pk; 1 of 4
Duty Factor_
4800
Units
Max.
I'cd
APEAK
635
nm
Dominant Wavelengthl 4 1
Ad
626
nm
Forward VOltage/Segment or DP
VF
IF= 2 mA
1.6
V
IF = 5 mA
1.7
IF=20 m-APk
Reverse Voltage/Segment or DPlsl
VR
2.1
3.0
IR=1001'A
2.5
30.0
V
Temperature Coefficient of VF/Segment or DP
::Np/"C
-2.0
mV/oC
Thermal Resistance LED Junction-to-Pin
RaJ.PIN
345
"c/WI
Seg
3. The digits are categorized for luminous intensity with the intensity category designated by a letter on the right hand side of the package.
The luminous intensity minimum and categories are' determined by computing the numerical average of the individual segment
intensities, decimal point not included. Operation at less than 2 mA DC or peak current per segment may cause objectionable display
segment matching and is not recommended.
4. The dominant wavelength is derived from the C.l.E. Chromaticity diagram and is that single wavelength which defines the color of the
device.
5. Typical specification for reference only. Do not exceed absolute maximum ratings.
HDSP-7511/-3350/-5551 SERIES
.
..ffi
3.0
E
I
'8r-~-+--+--~-+-+-~-+-+-4
a:
a:
/
"uw
!il
V
V
ffi
:t
"x
I
~
~
~
I
.
X
~
>
;
o
0 0'--',0-2-'-0-3J..
0 --'70-S""0"""9'-:-0-'-'00
0 ---'40-5-'-0-6J..
o
TA - AMBIENT TEMPERATURE _ °C
10
15
20
25
30
35
40
45
IpEAK - PEAK SEGMENT CURRENT - mA
Figure 1. Maximum Allowable Average Current per Segment as a
Function of Ambient Temperature
Figure 2. Relative Efficiency (Luminous Intensity per Unit
Current) vs. Peak Current per Segment
16
40
"
..
rlj
30
/
a:
a:
"u0
..
a:
....
....
>-
I
E
I
20
in E
rljN
'2
Z ..
'0
~q
,,00
/
/
/
z ..
/V
;Eo
"W
;:
-,N
a:
5'
10
.!:
o
o
0.5
1,0
V
1.5
2.0
/
w::;
I
>"
-:E
V
"0:
"0
~~
2.5
V
10
3.0
"
14
12
14
16
IF - SEGMENT DC CURRENT - mA
VF - FORWARD VOLTAGE - V
Figure 3. Forward Current vs. Forward Voltage
Figure 4. Relative Luminous Intensity vs. DC Forward Current
7-113
-------------»_._-------------
Electrical
Mechanical
The HDSP-7511/-3350/-5551 series of display devices are
composed of light emitling diodes, with the light from each
LED optically stretched to form Individual segments and
decimal pOints. These displays have their p-n junctions
diffused into GaAsP epitaxial layer on a GaP substrate.
To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve 01-15 or
DE-15, Arklone A or K, A 60°C (140°F) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse 11% detergent solution or equivalent), a hot water
rinse and a thorough air dry, Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.
These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 3, should be used for calculating the current limit'ing resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following VF MAX model:
= 1,75 V + IPEAK (38!})
For: IPEAK ~ 20 mA
VF MAX = 1.6 V + loc (45!})
For: 2 mA :5 IDe :5 20 mA
VF MAX
These displays are compatible with monolithic LED display
drivers. See Application Note 1006 for more information.
Contrast Enhancement
Such cleaning agents from the ketone family (acetone,
methyl 'ethyl ketone, etc') and from the chlorinated
hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc') are not recommended for
cleaning LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the
packages of plastic LED devices,
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a gray package and matching encapsulating epoxy in
the segments.
Contrast enhancement may be achieved by using one of
the fol'lowing suggested filters:
Panelgraphic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or -1266
GRAY
3M Louvered Filter R6310 RED or N0210
GRAY
7-114
7.6 mm <'3 inch)
M.IGRO BRIGHT 7 SEGMENT DISPLAVS
RED
HIGH EFFICIENCY RED
YELLOW
HIOl;l·R.~RFORI\II..~NC,g..qI5EEN
HD$P-7301
HDSP'7S01
HDSP'7401
HQ$P-7S01
Features
o
HIGH BRIGHTNESS
Package Optimized for High Amblenl Conditions
•
COMPACT PACKAGE
0.300 x 0.500 Inches
o
CHOICE OF FOUR COLORS:
Red, High Elliciency Red, Yellow,
High Performance Green
o
EXCELLENT CHARACTER APPEARANCE:
Evenly Lighted Segments
Mitered Segments
Wide Viewing Angle
Grey Package Provides Optimum On-Oil Contrast
•
EASY MOUNTING ON PC BOARDS OR SOCKETS
5.08 mm (0.2 inch) DIP Leads on 2.54 mm
(0.1 inch) Centers
•
AVAILABLE WITH COLON FOR CLOCK DISPLAY
o COMMON ANODE OR COMMON CATHODE
Right Hand Decimal Point
Overllow ±1 Character
•
CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN ALSO CATEGORIZED FOR
COLOR
Use of Like Category Yields a Uniform Display
Description
The HDSP-7301/-7501/-740117801 Series are 7.6 mm
(0.3 inch) character LED seven segment displays in a
compact package. Designed lor viewing distances up to
3 metres (10 feet), these displays are ideal lor high
ambient applications where space is at a premium. Typical
applications include instruments, aircraft and marine equipment, point-ol-sale terminals, clocks, and appliances.
Devices
Pari Number
Color
Package
Drawing
Description
HDSP·7301
HDSP-7311
HDSP-7302
HDSP-7303
HDSP-7313
HDSP-7304
HDSP-7307
HDSP-7317
HDSP-730B
HDSP-7318
Red
Bright Red
Red
Red
Bright Red
Red
Red
Bright Red
Red
Bright Red
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal, Colon
Common Cathode Right Hand Decimal
Common CathOde Right Hand Decimal
Common Cathode Right Hand Decimal, Colon
Overflow ±1 Common Anode
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
Overflow ±1 Common Cathode
HDSp·7501
HDSP-7502
HDSP·7503
HDSP·7504
HDSP·7507
HDSP-750S
HER
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal, Colon
Common Cathode Right Hand Decimal
Common Cathode Right Hand Decimal, Colon
OverflOW ±1 Common Anode
Overflow ±1 Common Cathode
HDSP-7401
HDSP-7402
HDSp·7403
HDSp·7404
HDSP·7407
HDSp·7408
Yellow
HDSP·7801
HDSP·7802
HDSP-7803
HDSP·7804
HDSP-7807
HDSp·780S
Green
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal, Colon
Common Cathode Right Hand Decimal
Common CathOde Right Hand Decimal, Colon
Overflow ±1 Common Anode
Overflow +1 Common Cathode
Common Anode Right Hand Decimal
Common Anode Right Hand Decimal. Colon
Common Cathode RighI Hand Decimal
Common Cathode Right Hand Decimal, Colon
OverflOW ±1 Common Anode
Overflow ±1 Common Cathode
7-115
A
A
B
C
C
0
E
E
F
F
A
B
C
0
E
F
A
B
C
0
E
F
A
B
C
D
E
F
package Dimensions
li ·
COLOR BIN
254
(.010)
1.27
~(.050)
(NOTE 6)
MITERED CORNER FOR
PIN 1 REFERENCE
LUMINOUS
INTENSITY
-.
CATEGORY
.508
r i(·020)
-------t TYP.
DATE CODe
~J-
5.08
(.200)
6.09
(.240)
t
_--1
--.-
ll; i:'
!i!,g.
9.91
(.390)
REF.
L2'54
(.100) TYP.
3.81
(.150)
MIN.
MITERED CORNER FOR
PIN 1 REFERENCE
10·
B, D
A,C
,~gL
J ;t=
.
~__
1.27
(,050)
E, F
5.08
(.200)
Notes:
I. All dimensions in millimetres (inches).
2. Maximum.
3. All untoleranced dimensions are for
reference only.
4. Redundant anodes.
5. Redundant cathodes.
6. For HDSP-7401/-7801 series product only.
FUNCTION
PIN
B
C
CATHODE COLON CATHODE lSI
CATHODE f
ANODE f
CA,HOOEg
3 CATHODE 9
ANODE,
4 CATHODE.
CATHODE.
ANODE.
5 CATHODE rl
CATHODE d
ANODE d
ANODE
CATHODE(')
6 ANODEI')
7 CATHODE DP CATHODE DP
ANODE OP
B CATHODE.
CATHODE c
ANODE c
9 CATHODE b
CATHODE b
ANODE b
10 CATHODE tlCATHODE: a
ANODE IJ
A
1 ANODEI')
2 CATHODE f
E
ANODEi')
CATHODE PLUS
CATHODE M)NUS
0
ANODE COLON
ANODE f
ANODE 9
ANODE.
ANODE d
CATHODE
ANODE DP
ANODE c
ANODE b
NC
NC
ANODE (41
CATHODE OP
CATHODE.
CATHODE b
NC
ANODE a
F
CATHOOE(5]
ANODE PLUS
ANODE MINUS
NC
NC
CATHODE)')
ANODE OP
ANODE c
ANODE b
NC
Internal Circuit Diagram
A
10
1
10 1
10
1
10
1
10
1
9
2
9
2
9
2
9
2
9
2
8
3
8
3
8
3
8
3
8
3
7
4
7
4
7
4
7
4
7
4
6
5
6
5
6
5
6
5
6
5
B
C
dp
dp
E
D
10
dp
F
Absolute Maximum Ratings
HDSP-73011
-7311 Series
Average Power Dissipation per Segment or D.P.
Operating Temperature Range
Storage Temperature Range
Peak Forward Current per Segment or D.P.f71
DC Forward Current per Segment or D.P. [8)
Reverse Voltage per Segment or D.P.
Lead Soldering Temperature
1.59 mm (1/16 inchl below seating plane
73mW
150mA
25mA
3V
HDSp·7501
Series
HDSP-7401
Series
81 mW
105mW
-40 0 C to + 1000 C
-55 0 C to + 100° C
90mA
30mA
3V
SOmA
20mA
3V
Hbsp-7801
Series
105mW
90mA
30mA
3V
260· C for 3 Sec.
7. See Figures 1,6.7, and 8 to establish pulsed operating conditions. (Figure I, HDSP-7301 Series; Figure 6. HDSP-7501 Series; Figure 7,
HDSP-7401 Series; Figure 8, HDSP-7801 Series).
8. See Figures 2,9,10, and II to derate maximum DC current. (Figure 2, HDSP-7301 Series; Figure 9, HDSP-7501 Series; Figure 10,
HDSP-7401 Series; Figure II, HDSP-7801 Series).
7-116
Electrical/Optical Characteristics at TA = 25°C
STANDARD RED HDSP-7301 SERIES
*.ViC&
~DSP-
Description
Luminous IilIfsity/seg m~ntl91
10igit Avera j
t!Jw')I
\Ibm
Symbol
Test Conditions
Iv
10mA DC
~2(j!mA DC 7fi,~
?Jo mA DC ~;J;,;
2C1imADC
7301"'1&£'
. *'M>C"
7311
Peak Wavelength
Min.
6@0
770
Typ.
655
~d
640
,,,,..'" v~gm'"t" D.P.
VF
IF=20 mA
VR
IR=100pA
Temperature Caef
t of Forward Voltage
.~
610
1355
~PEAK
gmen! or D.P.l 12j
Units
!t=
Dominant Wavel~gthll01
Reverse Voltage. a
.eMax.
lied
nm
nm
2.0
1.6*
V
12.0
V
.J.VF/oC
-2.0
mVioC
ROJ-PIN
200
°C/WI
Thermal Resistance LEO Junction-to·Pin
3.0
Seg
HIGH EFFICIENCY RED HDSP-7501 SERIES
Description
Luminous Intensity/Segmentf9 1
(Digit Average)
Peak Wavelength
SymBol
Iv
Test Conditions
Min.
Typ.
5mAD.C.
360
980
20mA D.C.
5390
60 mA Pk: 1 of 6
Duty Factor
3430
Max.
lJlits
licd
APEAK
635
nm
Dominant Wavelengthl 101
Ad
626
nm
Forward Voltage/Segment or D.P.
VF
Reverse Voltage/Segment or D.P. [12]
IF=5 mA
1.7
IF=20 mA
2.0
IF =60 mA
2.8
2.5
V
30.0
V
Temperature Coefficient Of VF/Segment or D.P.
/!"VF/oC
-2.0
mVioC
Thermal Resistance LED Junctlon-to-Pln
R9J.PIN
200
°CIWI
VR
IR=100IiA
3.0
Seg
YELLOW HDSP·7401 SERIES
Description
Luminous Intensity/Segmentl9 1
Symbol
Iv
(Digit Average)
Peak Wavelength
Test Conditions
Min.
Typ.
5mAD.C.
225
480
20 mA D.C.
2740
60 mA Pk: 1 of 6
Duty Factor
1700
~d
Forward Voltage/Segment or D.P.
VF
581.5
nm
586
IF""5mA
1.8
IF=20mA
2.2
IF=60 mA
3.1
Units
licd
583
APEAK
Dominant Wavelengthl 1O.11 j
I Max.
I
592.5
nm
2.5
V
50.0
V
Temperature Coefficient of VF/Segment or D.P.
/!"VFI"C
-2.0
mW·C
Thermal Resistance LED Junction-to·Pin
ROJ-PIN
200
°CIWI
Reverse Voltage/Segment or D.P. [12]
VA
IR=100pA
3.0
Seg
..
digits are categorized
9. The
for luminous intensity With the intensity category designated by a letter on the nght hand side of the
package. The luminous intensity minimum and categories are determined by computing the numerical average of the individual
.
segment intensities. decimal point not included.
10. The dominant wavelength is derived from the C.I.E. Chromaticity diagram and is that single wavelength which defines the color of
the device.
11. The HDSP-7401/·7801 series are categorized as to dominant wavelength with the category designated by a number adjacent to the
intensity category letter.
12. Typical specification for reference only. Do not exceed absolute maximum ratings.
7-117
------_..
__
__._-_........_--
.__.
HIGH PERFORMANCE GREEN HDSP-7801 SERIES
Description
Symbol
Luminous intensity/Segment[9]
(Digit Average)
Test Conditions
Min.
Typ.
5mAD.C.
Iv
10 mA D.C.
/led
1935
APEAK
566
Dominant Wavelength[10, l1J (Digit Average)
Ad
571
577
Forward Voltage/Segment or D.P.
VF
2.1
2.5
Reverse Voltage/Segment or D.P.l 12 [
VR
IF"" 10 mA
3.0
IR '" 100 /lA
nm
nm
V
50.0
V
200
"C/W/
Seg
ROJ . P1N
Thermal Resistance LED Junction-Io-Pin
Units
1480
570
60 mA Pk: 1 of 6
Duty Factor
Peak Wavelength
Max.
545
HDSP-7301 SERIES
OPERATION INTHISAEGIQNREOUIRES
TEMPERATURE DERATING OF 'DC MAX. ]
20
28
~
15
10
9
8
7
1\
\
.f.'\'b
,
I Nol
clor .~
1
IO~
10
0:
""
o"
\.
r-' ~
~
I
~
"
~
~1;
\
\'
20
T~ ~
AOJ'
" 695" elW/SEGMENT
16
12.5 ,
12
RaJA
" 77ifCIW SEGMJNT--'
I
"
""o
I
X
E
\
III t
~
~~ -q;
~ 1,
~
1.5
I
t-
iii0:
2524
I
\
j
I
I
35
55
75
I
95
I
115
I
135
TA - AMBIENT TEMPERATURE _ °C
100
1000
10000
tp - PULSE DURA nON - /.lSEC
Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration
~
iii
u
Ii:
u.
w
w
>
~
~I
160
~
140
:;
~
120
~
100
Figure 2. Maximum Allowable DC Current
Dissipation per Segment as a
Function 01 Ambient Temperature
1.'
- !-,-
-.~
.--
I-- I--
,-
>-
t-"
in E
1.2
~~
t-t-
1.0
r---
"00..
.8
-
tZ
w
80
53N
""o
60
~
ii!
0:
0:
0:
:;
0:
0:
~
I
50
IpEAK - PEAK SEGMENT CURRENT - mA
Figure 3. Relative Elliciency (Luminous
Intensity per Unit Current) vs.
Peak Current per Segment
.!:
;Eo
.~-
o
I--
i
"w
.... N
w::l
.6
>"
-:;
.0 I-- '-- r--20
~"
,
~~
" 1I
IIlPJA '770"CIW/SEG
10
u
E
~!
OPERATION
itl
25
tp - PULSE DURATION -
VS.
45
55
65
75
85
95
105
TA-AMBIENT TEMPERATURE _ °c
~SEC
Figure 6. Maximum Tolerable Peak Current
Duration - HDSp·7501 Series
35
V"
.H
>...; \1
ROJA = aWClW/SEG
15
Pulse
Figure 9. Maximum Allowable DC Current and DC
Power Dissipation per Segment as a
Function 01 Ambient Temperature HDSp·7501 Series
20
"....,
E
2
W
a:
a:
""c
"
:;;
":;;x
\
18
\
V
16
-"\
RDJA = GoO'elW/SEG
14
\
ROJA • 770"CIWISEG
12
++
10
":;;,
x
":;;
f--
u
E
25
tp - PULSE DURATION - "SEC.
35
45
55
65
76
85
96
105
TA -AMBIENT TEMPERATURE -'C
Figure 10. Maximum Allowable DC Current and DC
Power Dissipation per Segment as a
Function 01 Ambient Temperature HDSp·7401 Series
Figure 7. Maximum Tolerable Peak Current VS. Pulse
Duration - HDSp·7401 Series
50
OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
IDe MAX.
~
....2
45
""
35
w
a:
a:
":;;
":;;
0
~
:;;
I
~:;;
u
40
R0J .... 52$' elWlSEa
30
25
20
15
i'-..
H
' ... '
"~ , ,
r-',
ReM' GliO'CIW/SEO"'-
)~,
10
~
R"IJ.A • 77I1'CIW/SEa
E
25
35
45
55
65
75
85
95
J
105
TA - AMBIENT TEMPERATURE -'C
Figure 11. Maximum Allowable DC Current per
Segment vs. Ambient Temperature HDSP·7801 Series
Figure 8, Allowed Peak Current vs. Pulse Duration HDSP·7801 Series
- - - - - - - - - - - - - -----
7-119
--_._---------------- ---------------
-----
«E
>
~
"
I
c:;
~
w
100
12
80
10
I-
~
a;
a;
1.4
60
""c
>
i=
:l
a;
~
w
a;
I
40
a;
~
"
~
I
20
.!:
"
0
Figure 12. Relative Luminous Efficiency
(Luminous Intensity per Unit
Current) vs. Peak Segment
Current
0
5.0
VF - FORWARD VOLTAGE - V
IpEAK - PEAK SEGMENT CURRENT - rnA
Flg'lIre 13. Forward Current vs. Forward
Voltage Characteristics
IF - SEGMENT DC CURRENT - rnA
Figure 14. Relative Luminous Intensity vs.
DC Forward Current
Electrical
The HDSP-7301/-740117501/-7801 series of display devices
are composed of light emitting diodes, with the light from
each LED optically stretched to form individual segments
and decimal points. The -7301 series uses a p-n junction
diffused into a GaAsP epitaxial layer on a GaAs substrate. The -7401 and -7501 series have their p-n junctions
diffused into a GaAsP epitaxial layer on a GaP substrate.
The -7801 series use a GaP epitaxial layer on Gap.
HDSP-7301: Panelgraphic RUBY RED 60
SGL Homalite H10D-1605 RED
3M Louvered Filter R6610 RED or N0210
GRAY
HDSP-7401: Panelgraphic YELLOW 27 or GRAY 10
SGL Homalite H100-1720 AMBER or -1266
GRAY
3M Louvered Filter A5910 AMBER or N0210
GRAY
HDSP-7501: Panelgraphic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or "1266
GRAY
3M Louvered Filter R6310 RED or N0210
GRAY
These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 4 or 13, should be used for calculating the current
limiting resistor value and typical power dissipation.
Expected maximum VF values, for the purpose of driver
circuit design and maximum power dissipation, may be
calculated using the following VF MAX models:
HDSP-7801: Panelgraphic GREEN 48
SGL Homalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY
H DSP-7301 Series:
VF MAX = 1.85 V + IPEAK (70)
For: IPEAK ~ 5 mA
HDSP-7401/-7501 Series:
VF MAX = 1.75 V + IPEAK (380)
For: IPEAK ~ 20 mA
VF MAX = 1.6 V + IDe (450)
For: 5 mA :s IDe :s 20 mA
Mechanical
To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for Cleaning. It is recommended that only
mixtures of Freon /F113) and alcohol be used for vapor
cleaning processes. with an immerSion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor Cleaning solvents are Freon TE, Genesolve DI-15 or
DE-15, Arklone A or K. A 60° C /140° F) water cleaning
process may also be used, which includes a neutralizer
rinse /3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.
H DSP-7801 Series:
VF MAX = 2.0 V + IPEAK (500)
For: IPEAK ~ 5 mA
Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a gray package and matching encapsulating epoxy in
the segments.
Contrast enhancement may be achieved by using one of
the following suggested filters:
Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.) are not recommended for Cleaning LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the packages of plastic LED devices.
7-120
F/in-
7.6/10.9 mm (0.3/0.43 INCH)
SEVEN SEGMENT DISPLAYS
HEWLETT
RED.
HIGH EFFICIENCY RED.
YELLOW.
HIGH PERFORMANCE GREEN.
a!~ PACKARD
5082-7730/-7750 SERIES
5082-7610/-7650'SERIES
5082-7620/-7q60 SERIES
HDSP-3600/-4600 SERIES
Features
• COMPACT SIZE
• CHOICE OF 4 BRIGHT COLORS
Red
High Efficiency Red
Yellow
High Performance Green
• LOW CURRENT OPERATION
As Low as 3mA per Segment
Designed for Multiplex Operation
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Body Color Improves "Off" Segment
Contrast
o EASY MOUNTING ON PC BOARD OR
SOCKETS
Industry Standard 7_62mm (0.3 in_) DIP
Leads on 2_54mm (0_1 in_) Centers
Description
• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN CATEGORIZED FOR
COLOR
Use of Like Categories Yields a
Uniform Display
The -7730/-7610/-7620/-3600 and -7750/-7650/-7660/-4600 series
are 7.62/10.92 mm (0.3/.43 in.) red, high efficiency red, yellow,
and green displays. The -7730/-7610/-7620/-3600 series displays
are designed for viewing distances of up to three metres and the
-7750/-7650/-7660/-4600 series displays are designed for viewing
distances of up to six metres. These displays are designed for
use in instruments, point of sale terminals, clocks and appliances.
o MECHANICALLY RUGGED
Devices
Pari Number
5082-7730
5082-7731
5082-7740
5082-7738
Color
5082-7610
5082-7611
5082-7613
5082-7616
5082-7620
5082-7621
5082-7623
5082-7626
HDSP-3S00
HDSP-3601
HDSP-36D3
HDSP-3606
High Efficiency Red
Red
Yellow
High Performance Green
Description
7.6 mm Common ArlOde Left Hand Decimal
7.6 mm Common Anode Right Hand Decimal
7.6 mm Common Cathode Right Hand Decimal
7.6 mm Universal Overflow ±1 Right Hand Decimal
7.6 mm Common Anode Left Hand Decimal
7.6 mm Common Anode Right Hand Decimal
7.6 mm Common Cathode Right Hand Decimal
7.6 mm Universal Overflow ±1 Right Hand Decimal
7.6 mm Common Anode Left Hand Decimal
7.6 mm Common Anode Righi Hand Decimal
7.6 mm Common Cathode Right Hand Decimal
7.6 mm Universal Overflow ±1 Right Hand Decimal
7.6 mm Common Anode Left Hand Decimal
7.6 mm Common Anode Right Hand Decimal
7.6 mm Common CathOde Righi Hand Decimal
7,6 mm Universal OverflOW ±1 Right Hand Decimal
NOTE: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagram D.
7-121
Package
Drawing
A
B
C
0
A
B
C
D
A
B
C
D
A
B
C
D
Devices
Package
Part Number
5082-7150
5082-1751
5082-7160
5082-7756
Color
5082-7650
5082-7651
5082-7653
5082-7656
5082-7600
5082-7661
50B2-7663
5082-7666
HOSP-4600
HDSP-4601
HOSP-4603
HDSP-4606
High Efficiency Red
Description
Red
Drawing
s:
10.9 mm Oommon Anode Left Hand Decimal
10.9 mm Common Anode Right Hand Decimal
10.9 mm Common Cathode Right Hand Decimal
10.9 mm Universal Overflow ±1 Righi Hand Decimal
F
G
H
s:
10.9 mm Common Anode Left Hand DeC1linal
10.9 mm Common Anode Right Hand Decimal
10.9 mm Common Cathode Right Hand Decimal
10.9 mm Universal Overflow ±1 Right Hand Deoimal
10.9 mm Common Anode Left Hand Decimal
10.9 mm Common Anode Right Hand Deoimal
10.9 mm Common Cathode flight Hand Decimal
10.9 mm Universal Overflow ±1 Right Hand Decimal
10.9 mm Common Anode Left Hand Decimal
10.9 mm Common Anode Right Hand Deaimal
10.9 mm Common Cathode flight Hand Decimal
10.9 mm Universal Overflow ±1 RIght Hand Deoimal
Yellow
High Performance Green
F
G
H
s:
F
G
H
E
F
G
H
NOTE: Unoversal pinout brings the anode and the cathode of each segment's LED out to separate pins. see Internal diagram H.
Internal Circuit Diagram
10
F
H
G
Absolute Maximum Ratings
·7730/-7750
·7610/-7650
-7620/-7660
-3600/·4600
Series
Series
Series
Series
65 mW[1)
105 mW[2]
81 mW(3)
Average Power Dissipation per Segment or DP
105 mW[4j
Operating Temperature Range
40· C to +100·C 40·C to +100·C -40· C to +100·C -4O·C to +100·C
-55·C to +100·C 55· C to +100· C -55"C to +100·C 55' C to +100· C
Storage Temperature
150 mA[S]
90 mA[6]
60 mA[7)
Peak Forward Current per Segment or DP
90 mAla]
25 mA[l]
20 mA[3)
DC Forward Current per Segment or DP
SO mAIZI
30 mA(4]
Reverse Voltage per Segment or DP
3.0 V
S.O V
3.0V
3.0 V
Lead Soldering Temperature
260· C for 3 sec. 260· C for 3 sec. 260· C for 3 sec. 260· C for 3 sec.
1.59 mm (1/16 in.) below seating plane
Noles: 1.
2.
3.
4.
See power derating curve (Figure 5).
See power derating curve (Figure 6).
See power derating curve (Figure 7).
See power derating curve (Figure 8).
5.
6.
7.
8.
7-122
See Figure 1 to establish
See Figure 2 to establish
See Figure 3 to establish
See Figure 4 to establish
pulsed operating conditions.
pulsed operating conditions.
pulsed operating conditions.
pulsed operating conditions.
------------"""
package Dimensions
(5082-7730/-7610/-7620/-3600)
fUNCTION
10
PIN
A
1
cATHODE -B
CATHODE - f
ANOD!;1121
CATHOOe -a
NO.,III
CATHODE - f
ANODEll2:)
CATHODEI1!Jl
ANODE;: ~ f
NOPIN
NOPIN
NOPIN
ANODE -9
2
1.
:l
4
2
A.H.D.P.
I
'
-ti--I-
-J---.JG.
B
5
6"
CATHODE -dp
7
CATHODE
-e
8
9
CATHODE
M
d
NOCONN.l14]
10 CATHOOE-c
11 CATHODE -,
12 NOPIN
13 CATHODE - b
14 ")'NODEI"I
Note 16
3.94 (.1651
5.08
(.2001
---------
3.94 (.1651
A,B,C
0
C
NOPIN
NO CONN.1141
CATHODE
-I}
CAlf-lODE
~d
ANODE
CAiHODE-dp
CATHODE ~c
CATHODE ~g
NOPIN
CATHODE - b
ANODEt;:!:]
ANOOE-d
NOPIN
~
CATHODE
d
CATHOOE -c
-e
~e
CATHODE
ANODE ~d
NOPIN
NOPIN
CATIiODEI15)
ANODE -e
ANOOEwc
ANODE -op
ANODE -c
ANODE ~ b
CATHODE - OP
CATHODE - b
ANODE ~dp
NOPIN
ANODE -a
CATHODE -8
ANODE -a
NOPIN
A"NODE - b
D
LUMINOUS
INTENSITY
CATEGORY
COLOA BIN
NOTE 17
'0 . '6
---1 (.4001
IMAX'I~
R
1
L
~~'OOI
MIN.
-t-- ,
~I~
~
DATE
DATE CODe
CODE
-
1
6.10
~
2.54
(100)
C
SIDE
SIDE
(.1801
--1'1-- 0.25 (.0101
7.62 (.3001+----1
051
(.020)
(.240)
A,B,D
t
4.06 (.1601 .
A,B,C,D
END
(5082-7750/-7650/-7660/-4600)
_I
7.01 (.276)
_1_
;:'u.~i;::
4
+eflC::Pn +
7
*'
~ + U, 1 lJ('"
-L'_~--c*+ c::±::r --!'~
L.H.DI'P,
3.18(.125)
_11-,0'
-1--1 ..----m
+
~ 14
-----r
a
'===:I -\- 11
l
I
1
2..1.
I
3 ,19.05 ± 0.25 4 ....
1.750,,010)
5..1.
11 10,92 (.430)
10
9_
:
~raNote13
d;
-r-II---f------I
7.01 (.276)
100
5.08
6.35 (.250)
II
13
a
e
0
12
..l..
9
___
E
1.4061
I
t
o,--I't- 8 - A.H.D.P.
I A.H.D.P.
-,
6.35 (.250) - - -
!
10.31
+ 10
b
0
_.L~~L~
3.18 (.125)
Not"3~'
(.2001
6..j..
d
N~te 13
- 5.21 (.205)
H
F,G
FRONT VIEW
I1--
1
'2 .70 (, 5001
MAX.
152
~
f-,I
MIN.
11
I
7.62
I
1
I
END VIEW
NOTES:
10. Dimensions in millimetres and (inches).
11. AU untoleranced dimensions are
for reference only.
FUNCTION
I
0.51
2.k4
DATE CODE
(.1001
SIDE VIEW
12. Redundant anodes.
13. Unused dp position.
14.5ee Internal Circuit Diagram.
E
1
CATHODE -a
CATHODE - f
CATHODE: -a
ANODE -
2
CATHODE _ j
ANODE -d
3
ANODEml
ANODE(12J
ANODE -t
CATHODE(15)
NOPIN
NOPIN
NOPIN
CATHODE-<:
NO PIN
NOPIN
NOPIN
CATHODE -e
•
F
H
~
CAtHODE
~d
NOPIN
CATHODE -dp
NOCONNJ14]
NOCONNJt41
ANODE
15.24
7
CATHOOE -6
ANODE -e
ANOOE-c
(.6001
8
9
10
CATHODE - d
NOCONN,[141
CATHODE -;I
CATHODE _ d
ANODE ~d
ANODE ~ dp
CATHODE ~dp
ANODE:-ffdp
CATHOD!; -e
CATHODE ~<:
ANODE
-e
11
CATHODE ~ 9
CATHODE ~ 9
ANODE
~g
12
13
"
NOPlf\I:
NOPIN
NOPIN
-e
CATHODE -dp
CATHODE ~ b
CATHODE-a
NO PIN
CAntOCE ~ b
CATHODE .. b
ANODE ~ b
ANODE-a
ANOOEf12J
ANODEl12J
CATHOOEll!;i]
ANODE
15. Redundant cathode.
16. See part number table for L.H.D.P. and R.H.D.P. designation.
17. For yellow and green devices only.
7-123
G
PI"
5
6
=t=--l
Iii 0.25
---1,1---(.0101
(.3001~
(·T
;: '~~T
:=rT
UM-(5-}L'~-I-(~-':i~'-~1
4.06(.1601
1.17 MAX.
~6t:
~
b
Electrical/Optical Characteristics at TA =25°C
RED 5082-7730/-7750 SERIES
Parameter
Luminous Intensity/
SegmeJ1t l181
!Digit Average)
Device
HDSP-7730
Series
Symbol
Teal Condition
Min.
Typ.
Iv
20 rnA DC
360
770
100 rnA Pk 1;10
Duty Factor
20 rnA DC
-7750
Series
360
1100
570
APEAK
655
Dominant Wavelength l191
Ad
640
Forward Voltage/Segment or D.p.1211
VF
IF'" 20 rnA
Reverse Voltage/Segment or D.p,I21,221
VR
iR= 100j.tA
Temperature Coefflcient of VFlSegment or D.P.
::"VFI"C
Thermal Resistance LED Junctlon-to-Pin
ROJ-PIN
Units
/tcd
400
100 rnA Pk 1;10
Duty Factor
Peak Wavelength
Max.
~
nm
nm
2.0
V
V
mVl"C
~C/WI
282
Seg
HIGH EFFICIENCY RED 5082-7610/-7650 SERIES
Parameter
Luminous Intensity!
Segment l181
(Digit Average)
Device
HDSP-7610
Series
Symbol
Test Condition
Min.
Typ.
Iv
5 rnA DC
340
800
60 rnA Pk 1:6
Duty Factor
-7650
Serles
5 rnA DC
340
Peak Wavelength
Forward Voltage/Segment or D.P) 21 1
Reverse Voltage/Segment or D.p)21,221
1115
3900
APEAK
Ad
VF
635
nm
626
nm
IF=5 rnA
1.7
iF=20mA
2.0
iF=60mA
2.8
3.0
2.5
V
30.0
V
Temperature Coefficient of VFlSegment or D.P.
!lVFl o C
-2.0
mV/oC
Thermal Resistance LED Junction-to-Pin
ROJ-PIN
282
°C/WI
Seg
VR
7-124
IR= 100p.A
Units
pCd
2800
60mA Pk 1:10
Duty Factor
Dominant Wavelength l191
Max.
-~-~~~-------------.~----
YELLOW 5082-7620/-7660 SERIES (continued)
Parameter
Luminous Intensity/
Segmentl181
(Digit Average)
Device
HDSP-7620
Series
Symbol
Test Condition
Min.
Typ.
Iv
5mADC
205
620
60 mA Pk 1:6
DutY Fac,:tor
-7660
Series
5mADC
Ad
Forward Voltage/Segment or DiP.l21I
VF
Reverse Voltage/Segment or D.p.121,221
",cd
2414
290
835
3250
583
APEAK
Dominant WavelengthllQ,201
Units
.........
60 mA Pk 1:6
Duty Factor
Peak Wavelength
Max.
513'1',5
586
IF=5 mA
1,8
IF=20 mA
2,2
IF=60 mA
3.1
nm
2.5
V
50,0
V
Temperature Coefficient of VF/Segment or D.P,
!.NFI"C
-2.0
mVI"C
Thermal Resistance LED Junction-to-Pin
ROJ-PIN
282
~C1WI
VR
fR = 100 JlA
3,0
nm
592.5
Seg
HIGH PERFORMANCE GREEN HDSP-3600/-4600 SERIES
Parameter
Luminous Intensity!
Segment l181
(Digit Average)
Device
HDSP-3600
Series
Symbol
Test Condition
Min.
Typ.
IV
10 mA DC
570
1800
60 mA Pk 1:6
Duty Factor
-7750
Series
10 mA DC
460
Dominant Wavelength 119,201( Digit Average)
Forward Voltage/Segment or D.p.1211
Reverse Voltage/Segment or D.pJ21,221
Thermal Resistance LED Junction-Io-Pin
Units
",cd
2350
60 mA Pk 1:6
Duty Factor
Peak Wavelength
Max.
1750
2280
APEAK
566
Ad
VF
VR
571
577
nm
2.1
2.5
V
ROJ_PIN
IF= 10 mA
lR = 100,uA
3.0
nm
50.0
V
282
"C/WI
Seg
NOTES:
18. The digits are categorized for luminous intensity with the intensity category designated by a letter located on the right hand side of the
package.
19. The dominant wavelength, Ad. is derived from the C.I.E. Chromaticity Diagram and is that single wavelength which defines the color of
the device.
20. The displays are categorized as to dominant wavelength with the category designated by a number adjacent to the intensity category
letter.
.
21. Quality level for electrical characteristics is 1000 parts per million.
22. Typical specification is for reference only. Do not exceed absolute maximum ratings.
7-125
I
20 r-T""l-rrrrm-T'""TTTI'TTlT"--,-.--rrrmr-.-n'TI'Tm .
15r--r~HH~r-~~~~--~~cltH*--1-tf+t~-----1
OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
IocMAx.
_DC OPERATION
10000
tp -
PULSE DURATION - J.LSEC
Figure 1. Maximum Tolerable Peak Current vs. Pulse Duration) 5082-7730/-7750 Series
..J..J.J.J~~J...Jll.I.1.L!~:-'-""'J..U~:!:"_ DC OPERATION
lp - PULSE DURATION - "SEC
Figure 2. Maximum Tolerable Peak Current vs. Pulse Duration - 5082-7610/-7650 Series
OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
IDe MAX.
~
'~,....J...J..u.L~....J._
lp - PULSE DURATION - "SEC.
Figure 3. Maximum Tolerable Peak Current vs. Pulse Duration - 5082-7620/-7660 Series
7-126
t:-'+_
"
~
r:h
'~
f-Tli
I'
.~
1
I
I
I
,-CI
t
i
,
I
-
Ii
I
1 I
,(
II;
,"
I .
II
r
II
:
i
i
OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
DERATING OF
I DC MAX.
I
~
tp - PULSE DURATION - pSEC
Figure 4. Allowed Peak Current VS. Pulse Duration -
26
25
.~
24
'"I
E
~
\
22
-
=>
"g
~ 12.5
"x
16
50
'"E
\
\
1
20
18
a:
a:
R"t • jBO'CrISIEGMfNT
'\
.
14
"'x",
"'"
RijJ~
45
.'.
40
a:
a:
35
~
=>
""c
~I'
12 ~'f r5.~tWISrGMfNT ./ \
V
10
HDSP-3600/-4600 Series
30
"=>
"x
'~"
x
'""
• 76QCIW/SEGMENT /
ROJA, '" 520'CIW/SEG
20
ROJA, '"
45
55
65
75
85
95
Figure 5. Maximum Allowable DC Current
Dissipation per Segment as a Function
01 Ambient Temperature- 5082-7730/-7750 Series
20
E
18
....
16
\
Rl!JA '" 600 C/W/SEG
a:
a:
14
""c
12
=>
"=>
"x
",::'"
""
35
45
55
65
75
85
95 105
TA - AMBIENT TEMPERATURE .. °C
Figure 6. Maximum Allowable DC Current and DC Power
Dissipation per Segment as a Function 01
Ambient Temperature -.5082-7610/-7650 Series
\
V·
....
A\
a:
a:
~
40
=>
35
"
ROJA • no'eM/SEG
RBJ .A "'525 CIWISEG
OJ
C
"=>
10
t
30
"x
"'x"
I
'""
I
u
-,
1
I
25
105
TA - AMBIENT TEMPERATURE - "C
~
'\ T
:-~
7!O~CIWISEG
10
Q
35
1--
••••• M._
P" "
ROJA '" Q35'CIW/SEG
15
..__..-
MM".M_
U
25
'",
"'-1-
~.
'\. t"~
"-'
25
U
10
Q
E
25
35 45
55
65
75 85
95 105
TA .. AMBIENT TEMPERATURE -
25
~c
Figure 7. Maximum Allowable DC Current and DC Power
Dissipation per Segment as a Function 01
Ambient Temperature - 5082-7620/-7660 Series
35
45
55
65
75
85
95
TA - AMBIENT TEMPERATURE -
105
C
Figure 8. Maximum Allowable DC Current per Segment
vs. Ambient Temperature - HDSP-3600/-4600 Series
7~127
1
~w
$
il
1.0
w
J
g ..
>
I
~
:;
~
o
---
/"
I
•
z
.7 0
10
20
40
30
50
100
Ipeak - PEAK SEGMENT CURRENT - rnA
IpEAK - PEAK SEGMENT CURRENT - rnA
Figure 9. Relative Efficiency (Luminous Intensity per Unit Current)
versus Peak Current per Segment- 5082-7730/-7750 Series
160
"
E
1
.ill
.""l:!
~
~
Ia
il
r---r--r
100r-----r----,-----r----;---~
140
"E
12.
ffi
100
a:
a:
"
a:
~
60
iZ
2'r--4-4-+---t--t---t--4---t--~
-'"
-7860
C
1
~
60~--_+----~---tT-_f----~
:J
SO
4.
~
BO~---1-----+-----+_+--+-__1
1
"
i2
Figure 10. Relative Luminous Efficiency (Luminous
Intensity per Unit Current) vs.
Peak Segment Current
~
,VF ..:.
FORWAR~
VOLTAGE -
~I
VOLTAGE :- V,
12
L
1.2
1. 0
/
.8
.6
0
FORW~RD
Figure 12. Forward Current vs. Forward Voltage
Characteristics
1.4
2
r----4-----ilr#--t--+---i
YF -
Figure 11.' Forw~rd Current;vs: Forward Voltage- ;
5082-7730/-7750 Serfes.
.4
20
V
v
>
/
1-
10
Ui
15
1:!;
'":Ja
z
>1
/
::
w
>
~
V
u:la:
10
15
20
25
I.F - SEGMENT DC CURRENT - mA
IF ,- SEGMENT DC CURRENT - rnA
Figure 13. Relative Luminous Intensity vs.
DC Forward Current- 5082-7730/-7750 Serfes
Rgure 14. Relative Luminous Intensity vs.
DC Forward Current
7-128
Electrical
Mechanical
These display devices are composed of light emitting
diodes, with the light from each LED optically stretched to
form individual segments and decimal points.
To optimize device optical performance, specially developed plastics are used which restrict the solvents that
may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes. with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolve 01-15 Qr
DE-15, Arklone A or K. A 60 0 C (140 0 F) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T-P35, Ethanol,
Isopropanol or water with a mild detergent.
These display devices are well suited for strobed operation. The typical forward voltage values, scaled from
Figure 8, should be used for calculating the current limiting resistor value and typical power dissipation. Expected
maximum VF values, for the purpose of driver circuit
design and maximum power dissipation, may be calculated using the following VF MAX models:
5082-7730/-7750 Series:
VF = 1.55V + IpEAK (70)
For 5 mA s: IpEAKS: 150 mA
Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc.! and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.! are not recommended for cleaning LED parts. All of these various solvents attack or
dissolve the encapsulating epoxies used to form the packages of plastic LED devices.
5082-7610/-7620/-7650/-7660 Series:
VF MAX = 1.75 V + IPEAK (380)
For: IPEAK;:: 20 mA
VFMAX = 1.6 V + I DC (450)
For: 5 mA s: IDC::; 20 mA
HDSP-3600/-4600 Series:
VF MAX = 2.0 V + IPEAK (50m
For: IPEAK;:: 5 mA
Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept is to employ both luminance and chrominance
contrast techniques to enhance readability by having the
OFF-segments blend into the display background and the
ON-segments stand out vividly against this same background. Therefore, these display devices are assembled
with a package color which matches the encapsulating
epoxy in the segments.
Contrast enhancement may be achieved by using one of
the following suggested filters:
5082-77301 Panelgraphic RUBY RED 60 or GRAY 10
-7750
SGL Homalite H100-1605 RED or -1266
GRAY
3M Louvered Filter R6510 RED or
N0210 GRAY
5082-76101 Panelgraphic SCARLET RED 65 or GRAY 10
-7650
SGL Homalite H10o-1670 RED or -1266
GRAY
3M Louvered Filter R6310 RED or N0210
GRAY
5082-76201 Panelgraphic YELLOW 27 or GRAY 10
-7660
SGL Homalite H10o-1720 AMBER or -1266
GRAY
3M Louvered Filter A5910 AMBER or N0210
GRAY
HDSP-36001 Panelgraphic GREEN 48
-4600
SGL Homalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY
7-129
Flin-
aa!e.
HEWLETT
PACKARD
14.2mm <'56 INCH)
SEVEN SEGMENT DISPLAYS
REO
HIGH EFFICIENCY REO
HIGH PERFORMANCE GREEN
YELLOW
HOSP-S301
HDSP-SS01
HOSP-S601
HDSP-5701
SERIES
SERIES
SERIES
SERIES
Features
• INDUSTRY STANDARD SIZE
• INDUSTRY STANDARD PINOUT
1S.24mm (.6 inch) DIP Leads on
2.S4mm (.1 inch) Centers
• CHOICE OF FOUR COLORS
Yellow
. Red
High-Efficiency Red
High Performance Green
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Mitered Corners on Segments
Gray Package Gives Optimum Contrast
• COMMON ANODE OR COMMON CATHODE
Right Hand Decimal Point
Overflow ±1 Character
• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN CATEGORIZED
FOR COLOR
Use of Like Categories Yields a Uniform Display
Devices
Description
The HDSP-5301/-5501/-5601/-5701 Series are large 14,22
mm (,56 inch) LED seven segment displays, Designed for
viewing distances up to 7 metres (23 feet), these displays
provide excellent readability in bright ambients,
These devices utilize an industry standard size package and
pin function configuration, Both the numeric and ±1 overflow devices feature a right hand decimal paint and are
available as either common anode or common cathode,
Part No.
HDSP5301
5303
5307
5308
5321
5323
5501
5503
5607
6508
5521
5523
5601
5603
5607
5608
5621
6623
5701
5703
5707
5708
5721
5723
Description
Color
Red
High Efficiency
Red
High Performance
Green
Yellow
Common Anode Right Hand Decimal
Common Cathode Right Hand D,eclmal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal
Package
Drawing
A
B
C
D
E
F
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overftow ±1 Common Anode
Overflow ±1 Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal
A
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal
A
Common Anode Right Hand Decimal
Common Cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
Two Digit Common Anode Right Hand Decimal
Two Digit Common Cathode Right Hand Decimal
7-130
B
C
D
E
F
B
C
D
E
F
A
B
C
0
E
F
~~~------~~~--~~~~-------~--~~-~~~~~---------------
package Dimensions
FRONT VIEW A, B
TOP END VIEW E. F
TOP END VIEW A, B, C, 0
COLOR
BIN
INOTE 51
2.54
1.1001
TYP
.51
1.0201
TVP
LUMINOUS
INTENSITY
CATEGORY
t
--I
I
17'0C-~9170
±L 9.
1.6731
,.
8.00
1.3151
I--
254
I ~ I~~~I
[r__
' 1 -I,5.
~r
~
12
10
0.9
...." .............-
I
i
"
25
35
45
55
65
75
85
o. 8
"
,~.~~
o. 7
95 105
20
TA - AMBIENT TEMPERATURE -"C
~
160
~
140
~
120
~
100
~
a:
80
:0
U
60
40
Ii'
120
140 I 160
150
/
/
/
V
1/
40
20
)
I
o
100
1.4
a:
~a:
80
Figure 3. Relative Efficiency (Luminous Intensity per
Unit Current) YS. Peak Segment Current.
C
a:
60
Ipeak - PEAK SEGMENT CURRENT - rnA
Figure 2. Maximum Allowable Average Forward Current
Per Segment vs. Ambient Temperature:
HDSp·5301 Series.
z
-
a:
I
<
~
l"'- t--
if
>u
~;\
RVJ.A "770'CIWISEG
ROJ.A
I--'
~
I
I
22
1
o
.4
,8
1.2
1.6
2.0
2.4
2.8
o
o
3.2
10
/
/
15
20
25
IF - SEGMENT DC CURRENT - rnA
VF - FORWARD VOLTAGE - V
Figure 5. Relative Luminous Intensity ys. D.C. Forward
Current.
Figure 4. Forward Current vs. Forward Voltage,
For a Detailed Explanation of the Use of Data Sheet Information and Recommended
Soldering Procedures, See Application Note 1005.
7-133
HIGH EFFICIENCY RED HOSP-5501 SERIES
Paramet&r
Luminous IntensltyfSegment(13]
(Digit Average)
Peak Wavelength
Dominant Wavelengthl14J
Forward Voltage/Segment or OpPEl]
Reverse Voltage/Segment or OP[171
Thermal Resistance LED Junction-to-Pin
Symbol
III
Test Condition
10mADC
60 mA Peak:
1 of 6 Duty Factor
Min.
900
VF
IF '" 20 mA
IR'" 100 /LA
Units
pcd
3700
APEAK
Ad
VR
R8J-PIN
~
3
635
626
2.1
30
345
2.5
nm
nm
V
V
·C/WI
8eg.
HIGH PERFORMANCE GREEN HOSP-5601 SERIES
Paramel&r
Luminous Intensity/Segmentl 131
(Digit Average)
Peak Wavelength
Dominant Wavelength[14, lSI
Forward Voltage/Segment or DPI'S]
Reverse Voltage/Segment or DPf1 6 • 17]
Thermal Resistance LED Junctlon-ta-Pin
Symbol
Iv
Test Condition
10 mADC
60mA Peak:
1 of 6 Duty Factor
Min.
900
VR
R8J-P1N
IF= 10 mA
IR = 100 pA
Max.
Units
/Lcd
3100
566
571
2.1
APEAK
Ad
VF
Typ.
2500
3
577
2.5
nm
nm
V
50
V
345
'CJW!
Seg.
YELLOW HOSP-5701 SERIES
Parameter
Luminous IntenSity/Segment!13]
(Diga Average)
Peak Wavelength
Dominant Wavelength[14. 15]
Forward Voltage/8egment or OpPEl]
Reverse Voltage/Segment or opPEI,171
Thermal ReSistance LED Junction-to-Pin
Symbol
Iv
Test Condition
10mADC
60mA Peak:
1 of 6 Duty Factor
Min.
600
Vp
VR
R8J-PIN
581.5
IF-20mA
IR-100 p.A
Max.
Units
/Lcd
2700
APEAK
Ad
Typ.
1800
583
586
2.2
3
40
345
592.5
2.5
nm
nm
V
V
·CJWf
Seg.
Notes:
13. The digits are categorized for luminous intensity with category deSignated by a letter located on top of the package. The luminous
intensity minimum and categories are deterrl)ined by computing the numerical average of the individual segment intensities, decimal
point not included.
14. The dominant wavelength, Ad, is derived from the C.I.E. Chromati,eity Diagram and is that single'wavelength which defines the color
of the device.
15. The H[)SP-5601 and HDSP,5701 series displays are categorized as to dominant wavelength with the category designated by a
number adjacent to the intensity category letter.
16. Quality level for Electrical Characteristics is 1000 parts per million.
17. Typical specification for reference only. Do nct exceed absolute maximum ratings.
7-134
HDSP-5501/-5601/-5701 SERIES
,,0
~~
~~
~~
~S~
§5~~
~~~
1
~~~
OPERATION IN
I02:>
THIS REGION
:e
LL.
REQUIRES
o ~:E
TEMPERATURE
~ ~ ~ 41--+-+++tH-tt-~H-Pk!-ItII---3o,d-N"""':Itl1f-++++++I!l DERATING
OF
a:CJ:E
loCMAX
~Ii
f
I
<
u
~.9
1
llL_I-Ll..l.lJLaL-:-..L-"'-LIJ.....':-:-....L..Jo..LJ..lJ]oI.!_oc OPERATION
..LL
1
10000
tp - PULSE DURATION - j.lsec
Figure 6. Maximum Tolerable peak Current vs. Pulse Duration - HDSP-5501 Series.
,,0
~~
~~
~~
~~I:e ffi ~
0<2
~~§.
g
~ ~
LL.
I-:e
~
~ CJ
~
X I~ ~ ~
20
13~~g~II~~~~I~~~~I;~~EII
10
8
a: CJ:e 4
OPERATION IN
THIS REGION
REQUIRES
TEMPERATURE
~~R~!~NG OF
I
~~
:11"
<
u
~E
2
l'--'--'-..LJ...L.ULlL._I-LL.l.lJ""-_..L......WJ..lll'---l-'l....l...l..LL1>I
1
10
1000
tp - PULSE DURATION -
10.000-- DC OPERATION
~sec
Figure 7. Maximum Tolerable peak Current vs. Pulse Duration - HDSP-5601 Series.
,,0
~~
",0:
!:~
I-w
<0:
0:"
~O ~o: ~
20
!5 ~ ~
f--I-+++I+I+-+++
+-f-H-+++l-H+--I-+-l-l-+++H OPERATION
THIS REGIONIN
REQUIRES
:Ht#:
~"~I-a ~~~t!ii~~~~~~~~~~~~~~~~~~T:EM~P:ErR~A:T~UR
<
0 '8
CJ
~~~ ~6
~~R;!~~G OF
llllL
I
!
02::J
o~::E
t=
0: ~
~G:e
5
41--+-H++HfI--P
35
:>
35
a:
""c
"
"
"",
""E
:>
a:
30
1,,\
25
[}
X
X
u
20
Rej~A
<1+
"
:>
•
45
~
"
I
" 1I
\
510~CIV'I!SEG
10
•
"X
""
::l
~
"'\
ROJ..A '" 1iO"C/W/SEG
15
""c
,
~
~
M
"E"
Re, .•• 525'cIW/SEG
30
""-
25
10
18
""c
X
65
14
\
RY'-A = 770"cIW/SEG
"15c:;
I.'
95 105
itw
1.2
>
;::
1.1 -
w
~
1.0
~
.9
ex:,
~
u
~
". HDSP-~Ol SERIES
/
1.3
I
I
8
85
/ 7 'HOSP-5101 SERIES
r\ !
AIi'J_A '" 510~C/W}SEG
12
10
>-
f\
1.,\
/'
75
~
1.5
16
"
"X
"",
.
"
E
55
1.6
a:
:>
45
Figure 10. Maximum Allowable Average Current
per Segment vs. Ambient Temperature.
- HDSP-5601 Series.
22
:>
35
TA - AMBIENT TEMPERATURE - °C
2.
20
"{
I
25
Figure 9. Maximum Allowable Average Current
per Segment vs. Ambient Temperature.
- HDSP-5501 Series.
15a:
,
If'...
RS, .•• 770·CIW!SEG
TA - AMBIENT TEMPERATURE _ °C
I-
~,
""'"
15
a
•
'. I
t'--.,
20
~
......,
I
ffi=
-'"
HOS~-S601
l -I -
SERIES
A
.8
r
.7
.6
25 35
45
55
65
75
85
95 105
o
TA - AMBIENT TEMPERATURE _ °C
~,
0
~a:
0
:>
a:
50
"ca:
0
~
a:
Ii:
50
>-
3.5
;!;
I
/1
'I)
~
'":>0
z
HDSP-5601 SERIES
"
3.0
-'
2.0
w
1.5
"uja:
1.0
>
;::
.5
3.0
80
90 100
4.0
V
V
V
o
o
5.0
/
/
2.5
:>
HOSP-5501
SERfES
rI
2.0
70
I
0;
15
WJ. '"
60
I-
I-
HDSP-5701
SERfES
0
1.0
40
4.0
I
30
0
30
Figure 12. Relative Efficiency (Luminous Intensity per
Unit Current) vs. Peak Segment Current.
/I
0
20
IpEAK - PEAK SEGMENT CURRENT - rnA
Figure 11. Maximum Allowable Average Current
per Segment vs. Ambient Temperature.
- HDSP-5701 Series.
0
10
1/
10
15
20
25
30
35
40
IDe - DC CURRENT PER LED - rnA
VF - FORWARD VOLTAGE - V
Figure 14. Relative Luminous Intensity vs. DC Forward
Current. - HDSP-5501/-5601/-5701
Figure 13. Forward Current vs. Forward Voltage
Characteristics.
7-136
Electrical
The HDSP-5301/-5501/-5601/-5701 series of display devices
are composed of light emitting diodes, with the light from
each LED optically stretched to form individual segments
and decimal points. The -5301 series uses a p-n junction
diffused into a GaAsP epitaxial layer on a GaAs substrate.
The -5501 and -5701 series have their p-n junctions diffused
into a GaAsP epitaxial layer on a GaP substrate. The -5601
series use a GaP epitaxial layer on GaP.
HDSP-5501: Panelgrahpic SCARLET RED 65 or GRAY 10
SGL Homalite H100-1670 RED or-1266 GRAY
3M Louvered Filter R6310 RED or N0210
GRAY
These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4 or
13, should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum
VF values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the
following VF MAX models:
HOSP-5701: Panelgraphic YELLOW 27 or GRAY 10
SGL Homalite H100-1720 AMBER or -1266
GRAY
3M Louvered Filter A5910 AMBER or N0210
GRAY
HDSP-5301 Series:
VF MAX = 1.55V + IPEAK (70)
For: IpEAK ~ 5 mA
HOSP-5601: Panelgraphic GREEN 48
SGL Homalite H100-1440 GREEN
3M Louvered Filter G5610 GREEN or N0210
GRAY
Mechanical
To optimize device optical performance, specially developed plastics are used which restrict the solvents that may
be used for cleaning. It is recommended that only mixtures
of Freon (F113) and alcohol be used for vapor cleaning
processes, with an immersion time in the vapors of less than
two (2) minutes maximum. Some suggested vapor cleaning
solvents are Freon TE, Genesolve 01-15 or OE-15. Arklone A
or K. A 60°C (140°F) water cleaning process may also be
used, which includes a neutralizer rinse (3% ammonia solution or equivalent), a surfactant rinse (1 % detergent solution
or equivalent), a hot water rinse and a thorough air dry.
Room temperature cleaning may be accomplished with
Freon T-E35 or T-P35, Ethanol, Isopropanol or water with a
mild detergent.
HDSP-5501/-5701 Series:
VF MAX = 1.75V + IPEAK (380)
For: IPEAK ~ 20 mA
VF MAX = 1.5V + IDe (450)
For: 5 mA ~ IDe ~ 20 mA
H DSP-5601 Series:
VF MAX = 2.0V + IPEAK (50m
For: IPEAK ~ 5 mA
Contrast Enhancement
The objective of contrast enhancement is to provide good
display readability in the end use ambient light. The concept
is to employ both luminance and chrominance contrast
techniques to enhance readibility by having the OFFsegments blend into the display background and the
ON-segments stand out vividly against this same
background. Therefore, these display devices are
assembled with a gray package and matching encapsulating
epoxy in the segments.
Such cleaning agents from the ketone family (acetone,
methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene,
carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve
the encapsulating epoxies used to form the packages of
plastic LED devices.
Contrast enhancement may be achieved by using one of the
following suggested filters:
HDSP-5301: Panelgraphic RUBY RED 60
SGL Homalite H100-1605 RED
3M Louvered Filter R6610 RED or N0210
GRAY
7-137
LAROE 20 mm (0.8")
SEVEN SEGMENT DISPLAYS
rhll HEWLETT
a:~ PACKARD
Reo
HIGH EFFICIENCV RED
YELLOW
HIGH PERFORMANCE GREEN
HDSP-3400 Series
HOSP'39oo series
HDSP-4200 series
HDSp·S600 Series
Features
• 20 mm (0.8") DIGIT HEIGHT
Viewable Up to 10 Metres (33 Feet)
• CHOICE OF FOUR COLORS
Red
Yellow
High Efficiency Red
Green
• EX.CELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
.
Wide Viewing Angle
. Mitered Corners on Segments
Grey Package Provides Optimum Contrast
• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW AND GREEN CATEGORIZED
FOR COLOR
Use of Like Categories Yields a Uniform Display
• IC COMPATIBLE
• MECHANICALLY RUGGED
Description
The HDSP-3400/-3900/~4200/-B600Series are very large
20 mm (O.B in.) LED seven segment displays. Designed lor
viewing distances up to 10 metres (33 leet), these single
digit displays provide excellent readability.
These devices utilize a standard 15.24 mm (0.6 in.) dual In
line package conliguration that permits mounting on PC
boards or in standard IC sockets. Requiring a low forward
voltage, these displays are inherently IC compatible,
allowing lor easy .integration into electronic Instrumentation, point-ol-sale terminals, TVs, weighing scales,
and digital clocks.
Devices
. Part Number
HDSP~3400
HOSp.,3401
HDSP-3403
HDSP-l'l405
HDSp·3406
HDSP-3900
HOSP-3901·
HOSP-3903
HDSP-3905
HOSP-3906
HDSP-4200
HOSP-4201
HDSP-4203
HOSP-4205
HOSP-420a
HOSP-8600
HDSP-B601
HDSP-8603
HDSP-a605
HDSP-B606
Color
Red
-
M
_+",
High Efflclency Fled
Yellow
High Performance ·Green
Description
Common Anode Left Hand Deolmal
Common Anode Rigl'lt Hand Decimal
Common Cathode Right Hand Decimal
CommOr'l Cathode Left Hand Decimal
Universal Overflow ±1 Flight Hand Decimal
Common Anode Lett Hand Deoimal
Common Anode Right Hand Decimal
Common Cathode Right Hand DeclmlODh
OATHODE f
ANODE!>I
2
3
16
17
SIDE VIEW
IS
•
CATHDDE~P
NO PIN
NO PIli
NO PIN
CATHODE d
ANooetJ1
CATHODe c
CATHODE 9
CATHODE b
NO PIN
ANOOSp·1
NO PIN
NO PIN
MIOOE a
ANDDE f
CATHODE")
NO PIN
ANODE.
ANODE f
CATHODEI•. ·
NO PIN
CATHODE.
ANODE d
.CATHODEd
;~~~~gf' ~~~~g;EI" ~~~g;~i~.· g~~g~;
NO.CONN~C. NO.CONNEC.
NO PIN
NO PIN •
NO 1'1111
CATHODE lip ANODE dp
CATHODE d
ANODe d
A.NOOet:lj
CATI100E!et
OATHOOE c ANODE c
OATHODE 9 ANODE 0
CATHooe b ANODE ~
NO PIN
NO PIN
AN006dP'
ND PIN
NO PIN
NO PIN
ANODE d
CATrtOoe: tflt
ANODE,
ANODE 0
ANODe b
NO PIN
ANooe131
NO PIN
NO PIN
NO PIN
CATHOOet$1
NO PIN
ANODE • .
CATHODE dP
NO PIN
ANODE dp
CATHODE dp
CATHODE; tl
ANOIlE"
ANODE c
ANODE'
NO PIN
CATHODE t\
NO PIN
CATHOOEt~1
.
NOTES:
1. Dimensions In millimeters and (inchesl.
4. Unused dp position.
7. For HDSP-4200/-8600 Series product only.
2. All untoleranced dimensions are for reference only. 5. See Internal Circuit Diagram. 8. See part number table for LHDP and
3. Redundant anodes.
6. Redundant Cathodes.
RHDP designation.
Internal Circuit Diagram
18
A
B
Absolute Maximum Ratings
Average Power per Segment or DP (TA = 25· 0)1 9 1
Operating Temperature Range l101
Storage Temperature Range
Peak Forward Current per Segment or DP ITA = 25' 0,
Pulse Width = 1.2 malin]
DO Forward Ourrent per Segment or DP (TA= 25°0)1 91
Reverse Voltage per Segment or DP
Lead Soldering Temperature (1.6 mm [1/6 in.1 Below
Seating Plane)
E
D
C
-3400 Series
120mW
-40· C to +85· C
-55°0 to +100'0
-3900/-4200
Series
-8600 Series
105 mW
105mW
-40° 0 to +850 0 -20·C to +fWC
-55"0 to +100· C -55°0 to +100·0
200mA
50mA
3.0 V
135mA
40mA
3.0 V
90mA
SOmA
3.0 V
260° 0 for 3 sec.
260· 0 for 3 sec.
260· 0 tor 3 sec.
Notes:
9. See Power Derating Curves (see Figure 2 for -3400 Series, Figure 7 for -3900/-4200 Series, and Figure 12 for -8600 Series).
10. For operation of -8600 series to -40'C consult Optoelectronics division.
11. See appropriate curves to establish pulsed operating conditions (see Figure 1 for -3400 Series, Figure 6 for -3900/-4200 Series.
Figure 11 for -8600 Seriesl.
7-139
Electrical/optical Characteristics at TA = 25° C
RED
HDSP-3400 SERIES
Description
Luminous Intensity/Segment
(Digit Averagel(12,13)
Peak Wavelength
Symbol
Iv
Test Condition
Min.
Typ.
11'=20 mA
500
1200
APEAK
- Ad
Dominant Wavelength[14J
Forward Voltage, any Segment or OP[16!
VI'
11'=20 mA
Reverse Voltage. any Segment or OP[15.16]
VA
IR= 100 /JA
Temperature Coefficient of
Forward Voltage
AVF/'C
IF=20mA
Thermal Resistance LED Junction-to-Pin
ROJ-PIN
Units
/Jcd
655
nm
640
nm
1.6
3.0
Max.
2.0
V
20.0
V
-1.5
mW·C
375
"C/WI
Seg
HIGH EFFICIENCY RED
HDSP-3900 SERIES
Description
Luminous Intensity/Segment
(Digit Average)f12.131
Symbol
Iv
Test Condition
Min.
Typ.
100 mA Pk; 1 of 5
Duty Factor
3350 -
7000
20 mADC
4800
Peak Wavelength
APEAK
635
Dominant Wavelength[14] (Digit Average)
Ad
626
Forward Voltage, any Segment or DP[161
VF
IF'" 100 mA
Reverse Voltage, any Segment or DP!16.17]
VR
IR '" 1oo}lA
Temperature Coefficient of
Forward Voltage
AVF/·C
11'= 100 rnA
Thermal Resistance LEO Junction-to-Pln
R8J-PIN
2.6
3,0
Max.
Units
/Jcd
t==
3.5
nm
nm
V
25.0
V
-1.1
mWoC
375
·C/WI
Sag
YELLOW
HDSP-4200 SERIES,
Description
Luminous Intensity/Segment
(Digit Average)(12,13]
Symbol
Test Condftlon
Min.
Units
100 mA Pk; 1 of 5
Duty Factor
Iv
}lcd
20mADC
nm
Oomlnan
nm
Forward
IF'" 100 mA
V
Reverse Voltage, any Segment or DPf16,17j
VR
IR= 1oo}lA
V
Temperature Coefficient of
Forward VOltage
AVF/oC
IF= 100 mA
Thermal Resistance LED Junction-to-Pln
R/lJ-PIN
7-140
mVioC
375
'C/WI
Sag
=
HIGH PERFORMANCE GREEN
HDSP-8600 SERIES
Symbol
Descrip!ion
Luminous Intensity/Segment
(Digit Average)112,13)
'Typ.
Min.
Test Condition
~10f5
Duty
or
Iv
ApEAK
Dominant Wavelength 114 ,15) migit Average)
Forward Voltage, any SegmentprDP(16)
Ad
VF
Reverse Voltage, any Segmentor DP[16, 17 1
VR
Thermal Resistance LED Junction-Io-Pin
R8J-PIN
:':
"",i"
•.."'.'.
3.0
190 Jl.A
!,cd
1500
566
571
2.1
50,0
375
IF='10"mA
IR=
,',"
1960
700
""",
Peak Wavelength
uiiits
Max.
nm
577
2,5
,""
nm
V
V
°g/W/
Seg
""
Notes:
12. Case temperature of the device immediately prior to the intensity measurement is 25' C,
13. The digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the package,
14. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and is that single wavelength which defines the
color of the device,
15. The yellow and green displays are categorized as to dominant wavelength with the category designated by a number adjacent
to the intensity category letter,
16. Quality level for electrical characteristics is 1000 parts per million,
17. Typical specification for reference only. Do not exceed absolute maximum ratings.
HDSP-3400 SERIES
6ar-r-.--r-r-r-.-,--r-r-.-,-,
13.3
551-+-+-++-1" HO,IIJ\ .. 14Z0,I(;i\oL';E(!MJ:~T··
~:j::j:+*~j::~+:j:Id:l4~::j:jlmHt--lltffiitl-----,---
~
OPERATION
IN THIS
REGION
i5
REQUIRES
TEMPERATURE
~
35
100
DC
25
u
laf---+-4-++-+-+~--~+-4-+~
15f---+-4-++-+-+~--~+-4-+~
TA -AMBIENT TEMPERATURE _ °C
Figure 2. Maximum Allowable DC
Current per Segment vs. Ambient
Temperature
Figure 1. Maximum Allowable Peak Current vs. Pulse Duration
>
u
~':I--I--l--r-
I
X
c
' - - ' - - ' -.....I..WJ-..J....l--'-I.J.J.l.......-'-'w..JL.L1.lJJo._'-........LJ.J.l.I1.-
10
4a r-r-+-+-+-+-
~
""x
""
""
1.51-+-H-f+ttIt-+-
E
<.J
<.J
o
DERATING
OF IDe MAX
::HHH--t-I-\ .~~:::. ····1·····,.·:1 • . ,.
"
I.'
2.a
V
V
1/
a
10
20
30
4a
50
60
IpEAK - PEAK SEGMENT CURRENT - rnA
VF - FORWARD VOLTAGE -V
IF - SEGMENT DC CURRENT - rnA
Figure 3. Relative Efficiency (Luminous
Intensity per Unit Current) vs, Peak
Segment Current
Figure 4. Peak Forward Segment
Current vs. Peak Forward Voltage
Figure 5. Relative Luminous Intensity
vs. DC Forward Current
7-141
HDSP-3900/-4200 SERIES
20
13.5
[\
'\.
10
\.
"-
4
3.4
3
"I"
""!i ""g
I~
1
1
, m '.rfm
"-
~t
~-
,
10
,
'~
~
100
..
(
~'b
~
OPE RATION IN
THI SREGION
RE QUIRES
TE MPERATURE
DE RATING OF
IDC MAX
"'-et"'..
1000
10.000
DC OPERATION
.. - PULSE DURATION - " '
Figure 6. Maximum Allowed Peak Current vs. Pulse Duration
!;;
w
0:
0:
:::>
"!:l
~
i"
I
i
u
E
TA - AMBIENT TEMPERATURE -"C
IpEAK - PEAK SEGMENT CURRENT - rnA
Figure 7. Maximum Allowable DC Current
per Segment vs. Ambient Temperature
Figure 8. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak
Segment Current
2.4
160
"
E
I
2.2
140
>
.w""
I-
iii0:
!::120
a:
:::>
1.8
~c§
1.6
:::>1-
1.4
SEw
1.2
"e
100
;:
"
SO
e"
Ze
5:!
. 60
:::>!:!
........
.. N
0:
0:
"~
I
~
j
w"
>"
I-e
~~
-0:
40
0:
20
2.0
ze
1.0
O.S
0.6
0.4
0.2
VF - PEAK FORWARD VOLTAGE - V
IF - SEGMENT DC CURRENT - rnA
Figure 9. Peak Forward Segment Current vs.
Peak Forward Voltage
Figure 10. Relative Luminous Intensity vs.
DC Forward Current
.'
7-142
HDSP-8600 SERIES
tp - PULSE DURATION - /lsec
Figure 11. Maximum Allowed Peak Current vs. Pulse Duration
1.4
60
55
l-
aia:
a:
u
u
:::>
c
"
:::>
"X
""
I
X
""
E
u
45
40
I I I
1. 1
I. . . . O(
'\.
/"
/
25
20
15
RfJA fS2j"CflSjGjENl
.9
.8
aia:
c
a:
-
--
.... ...
I
.6
I
I
.5
.4 0
10
20
30
40
50
60
70
80
90 100
IpEAK .. PEAK CURRENT PER LED - rnA
Figure 12. Maximum Allowable DC Current
per Segment vs. Ambient Temperature
Figure 13. Relative Efficiency (Luminous
Intensity per Unit Current) vs. Peak
Segment Current
4.0
I
II
80
60
a:
"'M_"
TA - AMBIENT TEMPERATURE - QC
70
:::>
u
I
-.l - f--- I -
.7
~
10 20 30 40 50 60 70 80 90 100 110 120
90
.:.
ff-
V
1.0
100
"E
...
1.2
V
30
00
1.3
j
RQJA "425"ClWISEGMENT
35
10
!
I
I
I
SO
50
"3:a:
40
:r
30
.!:
20
/
/
J
..
II
10
>-
I-
0;
ai
2.0
3.0
3.0
I
I-
;;
i
'":::>0
4.0
2.5
z
2.0
:l
1.5
;;
w
/
>
i=
~a:
1.0
0.5
oL
o
/
1.0
3.5
5.0
/
1/
J
V
10
15
20
25
30
35
40
IDe - DC CURRENT PER LED - rnA
VF - FORWARD VOLTAGE .. V
Figure 15. Relative Luminous Intensity vs.
DC Forward Current
Flgure,14. Peak Forward Segment Current vs.
Peak Forward Voltage
7-143
Electrical
Mechanical
These display devices are composed of eight light emitting
diodes, with light from each LED optically stretched to form
individual segments and a decimal point.
These devices are constructed utilizing a lead frame in a
standard DIP package. The LED dice are attached directly
to the lead frame. Therefore. the cathode leads are the
direct thermal and mechanical stress paths to the LED dice.
The absolute maximum allowed junction temperature,
TJ MAX. is 105°C. The maximum power ratings have been
established so that the worst case VF device does not
exceed this limit.
These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4, 9,
or 14 should be used for calculating the current limiting resistor value and typical power dissipation. Expected maximum VF values, for the purpose of driver circuit design
and maximum power dissipation, may be calculated using
the following VF MAX models:
HDSP-3400 Series
VF MAX = 1.55 V + IPEAK (7[1)
For: IPEAK 2': 5 mA
HDSP-3900/-4200 Series
VF MAX = 2.15 V + IPEAK (13.50)
For: IF 2': 30 mA
Worst case thermal resistance pin-to-ambient is 400° C/
W/Seg when these devices are soldered into minimum
trace width PC boards. When installed in a PC board that
provides ROPIN-A less than 400° C/W/Seg these displays
may be operated at higher average currents as shown in .
Figure 2.
VF MAX = 1.9 V + IDC (21.80)
For: 10 mA:S IF :S 30 mA
Optical
VF MAX = 2.0 V + IpEAK (50[1)
For: IPEAK 2': 5 mA
HDSP-8600 Series
Temperature derated strobed operating conditions are
obtained from Figures 1,6, or 11 and 2, 7, or 12. Figures 1,
6, and 11 relate pulse duration (tp), refresh rate (f), and the
ratio of maximum peak current to maximum dc current
(/PEAK MAX/IDC MAX). Figures 2, 7, and 12 present the
maximum allowed dc current vs. ambient temperature.
Figures 1, 6, and 11 are based on the principle that the
peak junction temperature for pulsed operation at a specified peak current, pulse duration and refresh rate should
be the same as the junction temperature at maximum DC
operation. Refresh rates of 1 kHz or faster minimize the
pulsed junction heating effect of the device resulting in the
maximum possible time average luminous intensity.
The time average luminous intensity can be calculated
knowing. the average forward current and relative efficiency characteristic, '7IPEAK, of Figures 3, 8, or 13. Time
average luminous intensity for a device case temperature
of 25° C, Iv (25° C), is calculated as follows:
The radiation pattern for these devices is approximately
Lamberlian. The luminous sterance may be calculated
using one of the two following formulas.
IvlCd]
LVI cd/m2 I = AI m2 I
7TIVI cd]
LVlfootlamberts] = - Alft2]
Area/Seg.
IpEAK
= 100
mAo For OF
= 1/5:
r?O
°
_
mAl O·OoJ [7.0 mCdJ = 7.0 mcd/
Iv (25 C) -l,?0 mAJ
segment
The time average luminous intensity may be adjusted for
operating junction temperature by the following exponential equation:
Iv (TJ) = Iv (25°C) elk(TJ + 25°C)1
where
TJ
=
TA
+
PD' ROJ-A
Device
K
-3400
-Om88rC
-3900
-0.0131/"C
-4200
-0.0112/oC
-8600
-o.0044/oC
0.0231
The objective of contrast enhancement is to optimize display readability. Adequate contrast enhancement can be
achieved in indoor applications through luminous contrast
techniques. Luminous contrast is the observed brightness
of the illuminated segment compared to the brightness of
the surround. Appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected
from the area around the display while transmitting most of
the light emitted by the segment. These filters are described
further in Application Note 1015.
Example: For HDSP-4200 series
= 1.00 at
in.2
14.9
Contrast Enhancement
IAVG ] ['7
] flv DATA SHEET]
Iv (25° C) = [ IAVG Test
IPEAK l.'
Condition
'7IPEAK
AreSlSeg.
mm 2
7-144
Chrominance contrast can further improve display readability. Chrominance contrast refers to the color difference
between the illuminated segment and the surrounding area.
These displays are assembled with a gray package and
untinted encapsulating epoxy in the segments to improve
chrominance contrast of the ON segments. Additional contrast enhancement in bright ambients may be achieved by
using a neutral density gray filter such as Panelgraphic
Chromafilter Gray 10, or 3M Light Control Film (louvered
filml.
'SEVEN SEGMENT DISPLAYS FQR
HIGH: LIGHT AMBIENT CONDITIONS
HIGH EFFICIENCY RED HDSP'3S30/'3Zc~O/'5531/'3900 SERIES
YEllOW HDSP-4030/-4130/-S731/-4200 SERIES
Features
• HIGH LIGHT OUTPUT
Typical Intensities of up to 7.0 mcd/seg at
100 mA pk 1 of 5 duty factor.
• CAPABLE OF HIGH CURRENT DRIVE
Excellent for Long Digit String Multiplexing
• FOUR CHARACTER SIZES
7.6 mm, 10.9 mm, 14.2 mm, and 20.3 mm
• CHOICE OF TWO COLORS
High Efficiency Red
Yellow
• EXCELLENT CHARACTER APPEARANCE
Evenly Lighted Segments
Wide Viewing Angle
Grey Body for Optimum Contrast
Description
The HDSP-3530/-3730/-55311-3900 and HDSP-4030/-4130/
-5731/-4200 are 7.6 mm, 10.9 mm/14.2 mm/20.3 mm high
efficiency red and yellow displays designed for use in high
light ambient condition. The four sizes of displays allow for
viewing distances at 3, 6, 7, and 10 meters. These seven
segment displays utilize large junction high efficiency LED
chips made from GaAsP on a transparent GaP substrate.
Due to the large junction area, these displays can be driven
at high peak current levels needed for high ambient
conditions or many character multiplexed operation.
• CATEGORIZED FOR LUMINOUS INTENSITY;
YELLOW CATEGORIZED FOR COLOR
Use of Like Categories Yields a Uniform Display
• IC COMPATIBLE
o
MECHANICALLY RUGGED
These displays have industry standard packages, and pin
configurations and ±1 overflow display are available in all
four sizes. These numeric displays are ideal for applications
such as Automotive and Avionic Instrumentation, Point of
Sale Terminals, and Gas Pump.
Devices
Part No. HDSP3530
3531
3533
3536
4030
4031
4033
4036
Color
Description
High Efficiency Red
7.6
7.6
7.6
7.6
mm
mm
mm
mm
Common
Common
Common
Universal
Yellow
7.6
7.6
7.6
7.6
mm
mm
mm
mm
Common Anode Left Hand DeCimal
Common Anode Right Hand DeCimal
Common Cathode Right Hand Decimal
Universal Overflow ±1 Right Hand Decimal
Anode Left Hand Decimal
Anode Right Hand Decimal
Cathode Right Hand Decimal
Overflow ±1 Right Hand Decimal
Package
Drawing
A
B
C
D
A
B
C
D
Note, Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagrams 0 and H.
7-145
Devices
Part No.
Color
HDSP
Common
Common
Common
Universal
10.9 mm
10.9 mm
10.S mm
10.9 mm
14.2 mm
14.2 mm
14.2 mm
14.2 mm
Common Anode Left Hand Decimal
Common Anode Right Hand DeCimal
Common Catl'lode Right Hand Decimal
Universal Overflow ±1 Right Hand Dec.
Common Anode Right Hand Decimal
Common cathode Right Hand Decimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
Yellow
14.2 mm
14.2 mm
14.2 mm
14.2 mm
Common Anode Right Hand Decimal
Common Cathode Right Hand DeCimal
Overflow ±1 Common Anode
Overflow ±1 Common Cathode
Common
Common
Common
Common
Universal
Anode Left Hand Decimal
Anode Right Hand Decimal
cathOde Right Hand Decimal
cathode Left Hand Decimal
Overflow ±1 Right Hand Decimal
M
High Efliclency Red
20,3 mm
20.3 mm
20.3 mm
20.3 mm
20.3 mm
Common
Common
Common
Common
Universal
Anode Left Hand Decimal
Anode Right Hand DeCimal
cathode Right Hand DeCimal
cathode Left Hand Decimal
Overflow ±1 Right Hand Decimal
M
Yellow
5731
5733
5737
5738
High Efflolency Red
High Efficiency
Red
f
i
390~6
4200
4201
4203
4205
4206
Yellow
.20.3
20.3
20.3
20.3
mm
mm
mm
mm
20.3 mm
Anode Left Hand Decimal
Anode Right Hand Dacimal
Cathode Right Hand Decimal
Overflow ±1 Right Hand Dec.
e
10,S mm
10.9 mm
10.9 mm
10,9 mm
3730
3731
3733
3736
4130
4131
4133
4136
5531
5533
5537
5538
3900
3901
3903
3905
Package
Drawing
Description
F
G
H
E
F
G
H
I
J
K
L
I
J
K
L
N
0
P
Q
N
0
P
Q
Note: Universal pinout brings the anode and cathode of each segment's LED out to separate pins. See internal diagram
Absolute Maximum Ratings (All Products)
Average Power per Segment
or DP (TA = 25°C)
Peak Forward Current per Segment
or.DP (TA = 25°C)111
DC Forward Current per Segmentl21
or DP (TA = 25°C)
105mW
135 mA
(Pulse Width = 0.16 ms)
40mA
Operating Temperature Range
-40° C to +85° C
Storage Temperature Range
-55°C to +100°C
Reverse Voltage per Segment or DP
Lead Solder Temperature
(1.59 mm [1/16 inch [ below seating plane)
3.0V
260° C for 3 sec.
7-146
Notes:
1. See Figure 1 to establish
pulsed operating conditions.
2. Derate maximum DC current above TA = 25° C at
.50 mAIo C per segment, see
Figure 2.
Q.
package Dimensions (HDSP-3530/4030 Series)
FUNCTION
~I
;'0
II
·353014030
C
·35331·4033
D
·353614036
1
2
3
CATHODE·,
CATHOOE·r
ANODEI'I
CATHODE·.
<;ATHODE·r
ANODEI3l
iNOPIN
ICATHODE t61
IANODE-!
ANODE-d
'laPIN
CATHODE-d
4
NO PIN
NO PIN
NO PIN
NO PIN
IIINODE_e
CATHODE-c
CATHODe·,
1 ,
2 •
LH.D.P.
NoteS
19.05
4
R.H.D.P.
NoteS
5.721.225)
4.19 (.165)
5.08
1.200)
4.19 (.165)
~
0.25
5
"TrJL...-I;!--¥
5.72
1.225)
'i.
_I
I
~
R.H.D.P.
9
10
11
12
0.25
1.010)
,
:ANODE~g
CATHODE·,
CATHODE."
CATHODEill::i\THOOEil
NO PIN
NO PIN
CATHODE·b
CATHODE·b
13
o
A,B,C
8
·3531/4031,
~~!~~~;~P ~~T~OO~~I:I ~~~~:-d
~~~~~::
CN~O~TC_~HO_~N~'N~.:·I~d5'1 CATHODE-d
,NO PIN
ANNOOpOINE-dp
CATHODE·dp CATHOOE[.]
a
Note 4
I
PIN
ANODE-dp
ANODE...
ANODE"""
ANODE-a
I
I
CATHOD:J-dP
CATHODE·b
CATliODE·.
ANODE·,
'-14_'--A_N_OD"'···. _E[_'[_...L.A_N_O_D_E""(~_J_..LN.:.O,-P",I",N_ _...l...-'ANODE.b
1
'0.
16
(.4001 MAX.
L
I-
R --t-
L
I-~
(.1801
4.06 (.160) ,
MIN.
I
.
-r- '--1 '1--
. 7.62
(.3001~
A,B,C,D
END
C
SIDE
SIDE
0.25 (.0101
1
package Dimensions (HDSP-3730/4130 Series)
7.01 (.276)
1
7.01 (.276)
_I
"---I r'O
_11--,0"
i'
1 ~:
+
,J ;:
19.05,025::cdl
[.750, .0101
a
L.H.D.P.
1
~
...L
3.18 (.125)
!)-_--t_-+~8
7
'-J'+---+-""'-5.-0'-['-'200 1
6.35 (.250)
Not'
-!
6.35 (.250}
3.18 (.125)
I ---I
4~
::' 0
-t.
n'U:~~J,6
1.40'1
bU_~ ~0--.l
....\
....
i-
R.H.D.P .
\
R.H.D.P.
Note4
~--5.21(.205)
H
F,G
E
FRONT VIEW
rI
1
12 .70 (.5001
MAX.
!
r
r
LUMINOUS
INTENSITY
CATEGORY
lN
U~-(5-}L'~-I-(6.Ii;-~1
f-,I
406 (.160)
MIN.
II
7.62
I
I
~!~(~O~~I
SIDE VIEW
7-147
I
I
I
fUNCTION
I
F
·3731/·4131
G
·3733/·4133
H
·3736/4136
AN06E:"'c-
2
3
4
5
6
7
CATHODE·!
ANOOeiJJ
NO PIN
NOVIN
CA'THOOEfij!
NOPIN
NOPIN
NOCONN.l5\
NOCONN,15J
ANOOE-d
NO PIN
CATHOOE·(:
CArHODE-e
ANOOE,e
CATHODS'e
CAT-HODE-1t
ANOOE+e-
ANOOE-c
a
CATHODEd
NOCONN,t51
ANODE'd
NOPJN
CATHODE·d
CATHODE,or
CATHOO.E.(:
CATHODE.g
NOPIN
CATHOOE·b
CATHODE·b
13
END VIEW
E
·3730/4130
CATHODE-a' CATHODE·a
10
11
12
I
I
1
9
(.300)~
I ..
14
CATHODE·,h,DP
ANoDe DP
ANODE.
CATHODE
•• b.DP
CATHODE
e,d
CATHODEd ANOOEd
NO PIN ,
NO PIN ,
-~
12.573
1.4951
MAX
FRONT VI EW K, L
SIDE VIEW I, J, K, L
package Dimensions (390014200 Series)
I
Ii.
I~:
ZO.32
10.8001
5
6
1
7
8
____ 9
+
1
.
+
+
+
~
8.2~·I
LHDP
RHOP
10.3251 •
NOTE 4
.
1_. 1.27
.110.0501
ILcHARACTER
l
FRONT VIEW M, P
19.96 MAX.
rlo.786MAx.1
FRONT VI EW N, 0
LUMINOUS
INTENSITY
CATEGORY
I.
PIN
2AND 17
~i~~::
CATHODE
4
CATHODE I
ANOOE"'
9
10
NO PI"
NO PIN
OATHODEd
ANODe!'1
e
13
CATHODE c
15
CAtHODE 9
CATHODe b
NOP'N
I.
16
SIDE VIEW M, N, 0, P, Q
NOTES:
1. Dimensions in millimeters and (inches).
2. All untoleranced dimensions are for reference only.
3. Redundant anodes.
.
a
CATHOOEe
ANQOe l3J
CArHOOE dp
NOPIN
.2
DATECQDE
NO PIN
S
$
1
n
:,.:;51
10.600, '0.0101
3900/4200
•
2
3
10.0401
END VIEW M, N,O, P, Q
N
M
Pin
..l10.330, 0.0101
I
FRONTVIEWQ
Funcllon
S~
10'F
PACKAGE..J
COLOR BIN(7I
~0'25
--.l.J
6.1 MIN.
Ii.
LpACKAGE
17
ANooe!31
18
NO PIN
3901/4201
NO PIN
CATHODEo
CATHODE I
ANOOE.!$!
CATHOOE~
ANOOi!31
NO. CONN~C
NO PIN
NOPI~
CATHODE dp
OATHODEd
ANOOI;1
""c
::E
35
:::>
::E
~
::E
I
~
2
u
'\
.....
30
I
~
~<
~~
\
,
\
25
R8JA ~ 430'( II'//SEGRBJA • 530'C/WI$EG15 ROJA • 625'C/WISEG
20
RqJA •
..~<
\
~
~
/'
6
:::.,.
\
\
/' /-
"
~~
w-'
I~
0.4
30
~
~
~
ro
20
°c
1~
a:
a:
w
120
"ca:
100
:::>
~
a:
:r
"'"
~
I
j"
BO
60
100
,
20
~
o
1.5
:::> ...
1.4
~c
1.2
w'"
>::E
-a:
O.B
::E
:::>t!
-'-'
~~
1/
2.0
1.6
",N
II
//
.
~
I.B
~c§
0'"w
wa:
1301
-5731/-4200 SERIES
2.5
/
2.0
zc
w'"
')'1
60
/
2.2
~
UiiJ
II
HDSP-35301-3730/
-5531!.3000SERles",
1~
120
2.4
BO
1.0
40
Figure 3. Relative Elliciency (Luminous
Intensity per Unit Current) vs. Peak
Segment Current
160
'"
H=H
IpEAK - PEAK SEGMENT CURRENT - mA
Figure 2. Maximum Allowable DC Current
per Segment vs. Ambient Temperature
....z
\. HDSP-4030/-41301
.Sf31/j 4200 SERIES
0.2
o
00 100
~
TA - AMBIENT TEMPERATURE _
E
I
1/
""
;;;.-
/
~~
E
-
./
,,0
"l0'C/wIS£G-
W
O.B
0.6
2
10
....
.;"
.;"
a:'"
)
10
o
o
HD~P'~30L3~'ao/1
~1/~39ilOll RIES
1.0
/
/
1.0
1/
0.6
0.4
,/
0.2
o ./
o
3.0
/
/
V
10
20
30
40
VF - PEAK FORWARD VOL'TAGE - V
IF - SEGMENT DC CURRENT - mA
Figure 4. Peak Forward Segment Current vs.
Peak Forward Voltage
Figure 5. Relative Luminous Intensity vs.
DC Forward Current
7-151
Electrical
Mechanical
These display devices are composed of eight light emitting
diodes, with light from each LED optically stretched to form
individual segments and a decimal point.
These devices are constructed utilizing a lead frame in a
standard DIP package. The LED dice are attached directly
to the lead frame. Therefore, the cathode leads are the
direct thermal and mechanical stress paths to the LED dice.
The absolute maximum allowed junction temperature,
TJ MAX, is 105°C. The maximum power ratings have been
established so that the worst case VF device does not
exceed this limit.
The devices utilize LED chips which are made from GaAsP
on a transparent GaP substrate.
These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4
should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum VF
values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the
following VF MAX models:
Worst case thermal resistance pin-to-ambient is 400° CI
W/Seg when these devices are soldered into minimum
trace width PC boards. When installed in a PC board that
provides ROPIN-A less than 400°C/W/Seg these displays
may be operated at higher average currents as shown in
Figure 2.
VF MAX = 2.15V + IpEAK (13.501
For: IF 2: 30 mA
optical
VF MAX = 1.9V + IDC (21.8!li
For: 10 mA S IF S 30 mA
Temperature derated strobed operating conditions are
obtained from Figures 1 and 2. Figure 1 relates pulse
duration (tp), refresh rate (f), and the ratio of maximum peak
current to maximum dc current (IPEAK MAX/IDC MAX).
Figure 2 presents the maximum allowed dc current vs.
ambient temperature. Figure 1 is based on the principle
that the peak junction temperature for pulsed operation at
a specified peak current, pulse duration and refresh rate
should be the same as the junction temperature at
maximum DC operation. Refresh rates of 1 kHz or faster
minimize the pulsed junction heating effect of the device
resulting in the maximum possible time average luminous
intensity.
The radiation pattern for these devices is approximately
Lambertian. The luminous sterance may be calculated
using one of the two following formulas.
Iv(cd)
Lvlcd/m2) = --2
A(m )
7Tlv(cd)
Lv(footlamberts) = A(ft2)
AREA/SEG,
The time average luminous intensity can be calculated
knowing the average forward current and relative efficiency characteristic, '1IPEAK, of Figure 3. Time average
luminous intensity for a device case temperature of 25° C, Iv
(25° C), is calculated as follows:
Iv (25°C) =
[2~:GAJ
'7IPEAK = 1.00 at IPEAK = 100 mAo For DF = liS:
r?O
°C mA]
) - L20 mA
~ .00J [4.5
mCdJ = 4.5 mcdl
segment
The time average luminous intensity may be adjusted for
operating junction temperature by the following exponential equation:
Iv (TJ) = Iv (25°C) elk(TJ
where
TJ = TA
+
+ 25°C)]
PD' ROJ-A
DEVICE
K
-3530/-3730/-5531/-3900
-0.0131!"C
-40301-4130/-5731/-4200
-0.0112/°C
mm 2
-35301-4030
2.5
.0039
-3730/-4130
4.4
.0068
-5531/-5731
8.8
.0137
-3900/-4200
14.9
.0231
Contrast Enhancement
['7IPEAKJ Ov DATA SHEETJ
Example: For HDSP-4030 series
Iv (25
AREA/SEG.
IN.2
DEVICE
The objective of contrast enhancement is to optimize display readability. Adequate contrast enhancement can be
achieved in indoor applications through luminous contrast
techniques. Luminous contrast is the observed brightness
of the illuminated segment compared tothe brightness of
the surround. Appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected
from the area around the display while transmitting most of
the light emitted by the segment. These filters are described
further in Application Note 1015.
Chrominance contrast can further improve display readability. Chrominance contrast refers to the color difference
between the illuminated segment and the surrounding area.
These displays are assembled with a gray package and
untinted encapsulating epoxy in the segments to improve
chrominance contrast of the ON segments. Additional contrast enhancement in bright ambients may be achieved by
using a neutral density gray filter such as Panelgraphic
Chromafilter Gray 10, or 3M Light Control Film (louvered
filml.
7-152
rh~
a.:~.
INTENSITY AND COLOR
SELECTEDDISPLAYS
HEWLETT
PACKARD
. ..,
Features
• INTENSITY SELECTION IMPROVES
UNIFORMITY OF LIGHT OUTPUT FROM
UNIT TO UNIT. AVAILABLE IN RED,
HIGH EFFICIENCY RED, AND HIGH
PERFORMANCE GREEN.
• COLOR SELECTION IMPROVES UNIFORMITY
OF COLOR FROM UNIT TO UNIT. AVAILABLE
IN YELLOW.
o ONE AND TWO CATEGORY SELECTION SIMPLIFIES INVENTORY CONTROL AND ASSEMBLY.
Description
Seven segment displays are now available from HewlettPackard which are selected from one category or from two
categories. These select displays are basic catalog devices
which are pre-sorted for luminous intensity and color, then
selected from one predetermined category (S01 Option) or
two predetermined adjacent categories (S02 Option). Each
option will be assigned to a part number.
Example: One luminous intensity category is selected from
the basic catalog 5082-7750 production distribution and
assigned to the part number 5082-7750 Option SOt Two
...
luminous intensity categories are assigned the part number
5082-7750 Option S02.
Luminous intensity selection is available for red and high
efficiency red for S01 Option and for red, high efficiency
red, and high performance green for S02 Option. Color
selection is available for yellow on selected products.
To ensure our customers a steady supply of product, HP
must offer selected units from the center of our distribution.
If our production distribution shifts, we will need to change
the intensity or color range of the selected units our
customers receive. Typically, an intensity may have to be
changed once every 1 to 3 years.
Current intensity and color selection information is available
through a category reference chart which is available
through your local field sales engineer or local franchised
distributor.
Absolute Maximum Ratings
and Electrical/Optical
Characteristics
The absolute maximum ratings, mechanical dimensions,
and electrical/optical characteristics are identical to the
basic catalog device.
Device Selection Guide
The following table summarizes which basic catalog devices are available with category selection.
COLOR
Character
Height
7.62mm
(0.3")
Microbright
7.62mm
(0.3")
10.92mm
(0.43")
14.2mm
(0.56")
Single Digit
14.2mm
(0.56")
Dual Digit
20mm
(0.8··)
Red
HDSP-7301 SOl & S02 Option
HDSP-7303 SOl & S02 Option
HDSP-7307 SOl & S02 Option
HDSP-7308 SOl & S02 Option
5082-7730 SOl & S02 Option
5082-7731 SOl & S02 Option
5082-7736 SOl & S02 Option
5082-7740 SOl & S02 Option
5082-7750 Sal & S02 Option
5082-7751 Sal & S02 Option
5082-7756 SOl & S02 Option
5082-7760 SOl & S02 Option
HDSP-5301 SOl & S02 Option
HDSP-5303 SOl & S02 Option
HDSP-5307 SOl & S02 Option
HDSP-5308 SOl & S02 Option
HDSP-5321 S02 Option
HDSP-5323 S02 Option
High Efficiency Red
HDSP-7501 SOl & S02 Option
HDSP-7503 SOl & S02 Option
HDSP-7507 SOl & S02 Option
HDSP-7508 SOl & S02 Option
5082-7610 SOl & S02 Option
5082-7611 SOl & S02 Option
5082-7613 SOl & S02 Option
5082-7616 SOl & S02 Option
5082-7650 Sal & S02 Option
5082-7651 Sal & S02 Option
5082-7653 SOl & 502 Option
5082-7656 SOl &.S02 Option
HDSP-5501 SOl & S02 Option
HDSP-5503 Sal & S02 Option
HDSP-5507 SOl & S02 Option
HDSP-5508 Sal & S02 Option
HDSP-5S21 Sal & S02 Option
HDSP-5523 Sal & S02 Option
HDSP-3400 S02 Option
HDSP-3403 S02 Option
HDSP-3406 S02 Option
Basic Family
Not Applicable
Notes:
1. Option Sal deSignates a one intensity category selection.
2. Option S02 designates two intensity category selection.
3. Option S20 designates a two color category selection.
High Ambient
High Efficiency Red
Basic Family
Not Applicable
HI gh Ambient
High Efficiency
Yellow
Yellow
Selected Version Basic Family
Not Available
Not Applicable
HDSP-3530 Option S02
HDSP-3531 Option S02
HDSP-3533 Option S02
HDSP-3536 Option S02
HDSP-3730 Option S02
HDSP-3731 Option S02
HDSP-3733 Option S02
HDSP-3736 Option S02
HDSP-5531 Option S02
HDSP-5533 Option S02
HDSP-5537 Option S02
HDSP-5538 Option S02
Basic Family
Not Applicable
Selected Version Basic Family
Not Available
Not Applicable
HDSP-3900 Option
HDSP-3901 Option
HDSP-3903 Option
HDSP-3906 Option
S02
S02
S02
S02
High Performance
Green
HDSP-7801 Option S02
HDSP-7803 Option S02
HDSP-7807 Option S02
HDSP-7808 Option S02
Selected Version Selected Version HDSP-3600 Option S02
Not Available
Not Available
HDSP-3603 Option S02
HDSP-3606 Option S02
5082-7663
HDSP-4133
Selected Version
Option S20
Option S20
Not Available
HDSP-4136
5082-7666
Option S20
Option S20
Selected Version Selected Version HDSP-5601 Option S02
Not Available
Not Available
HDSP-5607 Option S02
Basic Family
Not Applicable
Selected Version
Not Available
Selected Version Selected Version
Not Available
Not Available
4. Option Sal and S02 of different part numbers may not have the same
apparent brightness. Contact your HP Field Sales Office for design
assistance.
7-153
FliOW
5082·7300
5082·7302
5082·7304
5082·7340
HEXADECIMAL
AND NUMERIC
DISPLAYS
HEWLETT
~e.. PACKARD
Features
• NUMERIC
5082-7300/-7302
0-9, Test State, Minus
Sign, Blank States,
Decimal Point
7300 Right Hand D. P.
7302 Left Hand D.P.
• HEXADECIMAL
5082-7340
0-9, A-F, Base 16
Operation,
Blanking Control,
Conserves Power,
No Decimal Point
• TTL COMPATIBLE
• INCLUDES DECODER/DRIVER WITH MEMORY
8421 Positive Logic Input
The 5082-7302 is the same as the 5082-7300, except that
the decimal point is located on the left-hand side of the
digit.
• 4 x 7 DOT MATRIX ARRAY
Shaped Character, Excellent Readability
The 5082-7340 hexadecimal display decodes positive 8421
logic inputs into 16 states, 0-9 and A-F. In place of the
decimal point an input is provided for blanking the display
(all LEOs off), without losing the contents of the memory.
Applications include terminals and computer systems using
the base-16 character set.
• STANDARD DUAL-IN-LiNE PACKAGE
INCLUDING CONTRAST FILTER
15.2 mm x 10.2 mm (0.6 inch x 0.4 inch)
• CATEGORIZED FOR LUMINOUS INTENSITY
Description
The HP 5082-7300 series solid state numeric and hexadecimal displays with on-board decoder/driver and memory
provide 7.4 mm (0.29 inch) displays for reliable. low-cost
methods of displaying digital information.
The 5082-7300 numeric display decodes positive 8421
BCD logic inputs into characters 0-9, a "-" sign, a test
pattern, and four blanks in the invalid BCD states. The
unit employs a right-hand decimal pOint.
Package Dimensions
7300
The 5082-7304 is a (±1) overrange display including a
right-hand decimal point.
The ESD susceptibility of these IC devices is Class A of
MIL-STD-883 or Class 2 of DOD-STD-1686 and 000HDBK-263.
Applications
Typical applications include point-of-sale terminals, instrumentation, and computer system.
7302
7340
Function
lO.2MAX'=1
----
(0.400)
fT
I
'_
1.5
~6)
5062-7300
(0.06)
(1.2\) ~t--IH·"'lj--r.
Pin
I
(O.:9)
1.I
14.0
(0.19)
5
6
7
I-4o,lO'
8
LUMINOUS
INTENSITY
CATEGORY
T~
I~S~t~~~G
15.2
(.600)
DATE CODE
+
0.3' 0.08 TYP.
1 1 1 (0.012' 0.0031
PIN 1 KEY
4
3
2
1
(2;~}--j
41;-1
--l f-(0.17)
2
Inpul4
InputS
BlanKing
Control
~
IDQut4
InputS
Decimal
Poin1
LatCh
Enable
Ground
7
8
Vee
Input 1
Vee
Input 1
5
4.8
'B
~
~' I-~ff
"3TYP'~' ~~'
SEATING
PLANE
(.050)
1.5
(.15)
(.06)
I
11_0.5' 0.08 TYP.
-j
(0.020 ' 0.003)
2.5' 0,13 TYP,
(D.10' 0.005)
7-154
3.4
HexadeCimal
Inpul2
4
51
5082-7340
Numeric
InpuI2
3
T
I
...r-.I.......,.....",,..,... _5.
and 7302
1
Latch
Enable
Ground
Notes:
1. Dimensions in millimeters and
(Inches I
2. Unless otherwise specified. the
tolerance on all dimensions IS
±O 38 mm (:!:: 0,015 Inchl
3 Digit center line is :::0.25 mm
(±D 01 inch) from package center
line.
- - - - - - - - - - - _ ..._._--._---
Absolute Maximum Ratings
D~~Ilptl~n
Symbol
~lh~
Ts
-40
Max.
+100
Te
-20
+85
·C
·C
Vee
-0,5
-0.5
+7.0
+7.0 ..
:v
-0.5
Vee
V
230
·C
~
Storage temperature, ambTent
Operating temR~£p.ture, case[1,2}
Supply vOltagJ/ J )
~j
VOI~ed to input logic, dp and!ene,bl'li"'plns
Volt
" ..%
'k9:;. 'WV::WOP,VE
VB
'ed to?j9lanklng Input!m
Maximum solder temperature at 1.59mm (.062 inch)
below seating'15flane; t,.;;; 5 seconds
Unit
V
Recommended operating Conditions
Symbol
Desetl!Jtion
Supply Voltage
Operating temperature, case
Unit
Min.
Nom.
Max.
4.5
5.0
5.5
V
+85
·C
Vee
To
tw
-20
120
nsec
Time data must be held before positive transition
of enable line
tSEll'P
50
nsec
Time data must be held after positive transition
of enable line
tIlOL!>
50
nsec
Enable Pulse Width
Enable pulse rise time
200
IrLIl
Electrical/Optical Characteristics
Description
Supply Current
Power dissipation
Luminous Intensity per LED
(Digit average) (;,61
Test Conditions
Icc
Py
Vee" 5.5 V (characters
"5." or "B" displayed)
I,
Vec=5.0V, Te'" 25°C
V(L
Logic high-level Input voltage
VIll
Enable low-voltage; data being
entered
VEL
Enable high-voltage; data not
being entered
VEil
Blanking low-voltage; display
not blanked(1)
VBl
Blanking high-voltage; display
blanked '"
Blanking low-level input current Pl
(T c = -20° C to +85° C, Unless Otherwise Specified)
Symbol
Logic low-level input voltage
nsec
Min.
32
Typ.<4 1
Max.
1112
170
mA
560
935
mW
70
,ucd
0.8
2.0
V
V
0.8
Vcc=4.5V
2.0
V
V
0.8
V
3.5
VBH
Unit
V
IBe
Vcc=S.SV, VBL=0.8V
20
,uA
Blanking high-level input current m
IBII
Vcc=5.5V, VBH=4.SV
Logic low-level input current
hL
2.0
-1.6
mA
Logic high-level input current
Enable low-level input current
Vcc=5.SV, V'L=OAV
Vcc=5,5V, VUl=2AV
IEL
+250
-1.6
,uA
mA
Enable high-level input current
Peak wavelength
Dominant Wavelength
IS)
11/1
1£11
Vcc=5.SV, VEL=OAV
Vcc=S.5V, VEH =2.4V
+250
mA
,uA
)..PEAK
Tc = 25°C
655
nm
)..4
Tc = 2S0C
640
0.8
nm
WeLQht
gm
Notes: 1. Nominal thermal resistance of a display mounted in a socket which is soldered into a printed circuit board: 0JA = 50' CIW; 0 JC =
15°C/W; 2. eCA of a mounted display should not exceed 35°C/W for operation up to Tc =+85'C. 3.Voltage values are with respect to device
ground, pin 6. 4. All typical values at Vcc = 5.0 Volts, TA = 25'C. 5. These displays are categorized for luminous intensity with the intensity
category designated by a letter located on the back of the display contiguous with the Hewlett-Packard logo marking. 6. The luminous
intensity at a specific case temperature, Iv(T c) may be calculated from this relationship: Iv(T c) = Iv (25'C) e [-0.0188/'C(Tc-25'C)1
7. Applies only to 7340. 8. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
7-155
0,'
v«', 5.0
Vee
tsETUP-t----t-~~+tHOlD
ENABLE
DATA INPUT
(LOW LEVEl DATA)
~
_)(2
- X , LATCH
- X 8 MEMOR¥
INPUT
DP[2] 4
DATA INPUT
(HIGH LEVEl DATA)
E
_Xl
LOGIC
1.5V
~
-0'
f---
MATRIX
D-ECODER
-
~
~
a
":;;
0,3
/V
2
2
D.
BLANKING[3J
CONTROL
4
I
~
•
1.5V
T;:;: "'25 C
0.4
LED
MATRIX
DRIVER
0,2
~
f---
LeI>
MATRIX
IE
0.1
/"
GROUND
V
/
V
VB - BLANKING VOLTAGE - V
Figure 1. Timing Diagram of 5082-7300
Series Logic.
0.35
~
0.30
E
~
"- ,
Vee ~ 5<0 V
VE ""'IlV
VIN ",OV_
.........
0.25
V8i4SV
a
0.20
2
0.15
*
"
~
~
......
r-..l
va
j3.5V
0.10
IE 0.05
Figure 2. Block Diagram of 5082-7300
Series Logic.
-
-l.B
~
E
r--- r--.....
-
-20
20
40
60
u
w
~
'"
-
ill
~
;
-1.2
ill
-1.2
a
-1,0
-1.0
S
~
,
-O.B
~
::
u
a
9
-0.6
1\
-0.4
2$9 C
-1.4
-0.2
-0.4
-0.2
\.
1.0
Te - CASE TEMPERATURE - 'c
-0.8
-0.6
2
t
90
2.0
3.0
4,0
VE - LATCH ENABLE VOLTAGE - V
Figure 4. Typical Blanking Control
Input Current vs. Temperature,
5082-7340.
T~"
Vcc~5,OV
-1.6
-1.4
~
.!!'
80
_1.8
Vee ,,-SJ) V
~
Vs. "'o,SV
o
Tc '2S'C
-1.6
~
~
~
r--
r
Figure 3. Typical Blanking Control
Current vs. Voltage for 5082-7340.
Figure 5. Typical Latch Enable Input
Current vs. Voltage for the 50827300 Series Devices.
VIN - LOGIC VOLTAGE - V
Figure 6. Typical Logic and Decimal
Point Input Current vs. Voltage for
the 5082-7300 Series Devices.
Decimal Point Applies to 5082-7300
and -7302 Only.
TRUTH TABLE
BCDDATA[l\
X,
x.
x,
x,
5002·730<117302
I..
L
I-
f
,"
H
H
-'-
:,,!
Ll
i ••
,"
H
,"
"
H
-
.-,
j
,BLANK)
H
1",
H
;
H
iBLANKI
H
iBtANKI
BlANKING(J)
,
1:';
i•• :
H
ENABLE( 1)
.-
/BLANKI
H
OECIMAL PT. (21
i ••
,,
"
H
_.
i".
',,'
H
H
,-
.~:;
H
H
.J
H
l
H
S002·n40
..
1'''
r,,,
ON
Vop "" L
OFf
tOAD DATA
VOl'"' H
LATCH DATA
VE -H
OfSPLAY.oN
VB - l
DlSPLAY·OF'!!
Va =H
VE 'L
Notes:
1, H = Logic High: L = Logic Low, With the enable input at logic high
changes in BCD input logic levels or D.P. input have no effect upon
display memory, displayed character, or D.P,
2. The decimal point input, DP, pertains only to the 5082-7300 and
5082-7302 displays,
3, The blanking control input. B. pertains only to the 5082-7340
hexadecimal display. Blanking input has no effect upon display
memory.
7-156
Solid State Over Range Display
For display applications requiring a ±. 1. or decimal point designation. the 5082-7304 over range display is available. This
display module comes in the same package as the 5082-7300 series numeric display and is completely compatible with it.
package Dimensions
REAR
FRONT
END
SIDE
........... SEATING
PLANE
0.3 :to.OB TVP.
+
1.012 :t.0031
I~;~I--l
.fl-J
1.1711-
NOTES:
1. DIMENSIONS IN MILLIMETERS AND (INCHES).
2. UNLESS OTHERWISE SPECIFIED, THE TOLERANCE
5082-7304
ON ALL DIMENSIONS IS :to.3S MM 1=0.015 INCHES).
TI'IUTH TABLE FOR 5082-7304
r---------- ----------,
~1
PIN
CHARACTER
1
2,3
4
8
+
H
L
1
Decimal Point
Blank
X
X
X
X
H
X
X
X
1-1
L
H
H
X
-
X
l
L
4,5
S.O
5.0
I
I
I
X
---",
L
---'
sso!!
Figure l Typical Driving Circuit for 5082-7304
SYMBOL MIN NOM MAX UNIT
IF
5.5
10
Absolute Maximum Ratings
V
mA
DESCRIPTION
Storage temperature, ambient
NOTE:
LED current must be externally limited. Refer to Figure 7
Operating temperature, cas.
Forward current. each lEO
for recommended resistor values.
Reverse voltage, each LEO
SYMBOL MIN •. MAX.
+100
-20 +85
--40
TS
Te
IF
VR
10
4
Electrical/Optical Characteristics
5082-7358
(T C = -20 0 C to +85 0 C. Unless Otherwise Specified)
DESCRIPTION
SYMBOL
TEST CONDITIONS
Forward VOltage per LED
Power di~$ipation
VF
PT
luminous Intensity per LEO (digit average}
Iv
IF' 6mA
Peak wavelength
Apeak
TC =25°C
Tc: =25"C
TC" 250e
I
Dominant Wavelength
Weight
I
N:!
IF -lOrnA
IF "IOmA
all diodes lit
=~
MIN
~MAA
UNIT
25
mW
2.0
32
~
0.8
7-157
. - - - . , - , - , _ . _ ...
J
I
Recommended Operating
Conditions
Vec
~
I
NOTES: L: Line switching transistor in Fiqure 7 cutoff.
H: Line switching transistor in Figure 7 saturated.
X: 'Don't care'
LEO supply vOltas"
Forward eutrentt each LeO
V<:<;
~~s.
N\,lMff'A.LOtlll;
_-------------
I
V
j.lcd
nm
nm
gm
UNIT
·C
·c
rnA
V
Flin-
HEWLETT
~~ PACKARD
HEXADECIMAL AND
NUMERIC DISPLAYS
FOR INDUSTRIAL
APPLICATIONS
5082-7366
6082-7351
5082-1358
6082·7369
Features
• CERAMIC/GLASS PACKAGE
• ADDED RELIABILITY
• NUMERIC 5082-7356/-7357
0-9, Test State, Minus Sign, Blank States,
Decimal Point
7356 Right Hand D.P., 7357 Left Hand D.P.
• HEXADECIMAL 5082-7359
0-9, A-F, Base 16 Operation, Blanking Control,
Conserves Power, No Decimal Point
• TTL COMPATIBLE
• INCLUDES DECODER/DRIVER WITH MEMORY
8421 Positive Logic Input
The 5082-7357 is the same as the 5082-7356, except that
the decimal point is located on the left-hand side of the
d~~
.
.
• 4 x 7 DOT MATRIX ARRAY
Shaped Character, Excellent Readability
The 5082-7359 hexadecimal display decodes positive 8421
logic inputs into 16 states, 0-9 and A-F. In place of the
decimal point an input is provided for blanking the display
(all LED's off), without losing the contents of the memory.
Applications include terminals and com'puter systems using
the base-16 character set.
• STANDARD DUAL-IN-LiNE PACKAGE
15.2 mm x 10.2 mm (0.6 Inch x 0.4 inch)
• CATEGORIZED FOR LUMINOUS INTENSITY
Description
The HP 5082-735X series solid state numeric and hexadecimal displays with on-board decoder/driver and memory
provide 7.4 mm (0.29 inch) displays for use in adverse
industrial environments.
The 5082-7358 is a (±1) overrange display including a
right-hand decimal point.
Applications
The 5082-7356 numeric display decodes positive 8421
BCD logic inputs into characters 0-9 "-" sign, a test
pattern, and four blanks in the invalid BCD states: The
unit employs a right-hand decimal point.
Typical applications include control systems, instrumentation, communication systems, and transportation equipment.
package Dimensions
1--".2 MAX.--!
I..... (.400) ...., I
7359
1
1
1
13.5
1.r+1-rl-r:l-ri
1
I
4.8
1
2
6
7
•
·T
4
5
LUMINOUS
INTENSITY
CATEGORY
1S
SEATING
PLANE
PIN 1 KEY
1.3 TV']
(.050)
3
2
(.061
f.151
!
~'
DATE CODE
4
.l1ri:'-TIl
Q.~,
END VIEW
REAR VIEW'
_
1
I'
.
11-
-j
3.4
0.5 '0.08 TV'.
'.020 !.003)
2.5±.13TYP.
(.10±.005)
7-158
I
T,
3
r-------r- (.191
•
T
PIN
6
7
8
I
I
I
T
I
I
FUNCTION
5082·7359
5082·7356
AND 7357
HEXA·
NUMERIC , DECIMAL
Input 2
Input 2
I
Input 4
Input 8
I
Input 8
Decimal
point
Latch
enable
Ground
'flPut4
Blanking
1
I
Vee
I
Input 1
i
oontrol
Latch
enable
Gtcond
Vee
Joput1
NOTES,
1. Dimensions in millimeters and (inches).
2. Unless otherwise specified, the tolerance
on ell dimensions is ± O.38mm (±~Mn5 in.)
3. Digit center,line is ± O.25mm (fO.01 in.)
from package center line.
I
Absolute Maximum Ratings
Description
Symbol
Min.
MaK.
Unit
Ts
-65
+125
°C
'T"
-55
+100
°C
Vee
-0.5
+7.0
V
VI,VOP.VE
-0.5
+7.0
V
Vo
-0,5
Vee
V
260
°C
""','
Storage temperature, ambient
Operating temp~rature, ambient {I,ll
.:t,'·
SuppIY,)loltage me
"
i""'"
,
VoltaQeapplied to input 16gic, dp and enable pins
Voltage applied to blanking input i1l
Ma~imu~~~~~~:; t~rnperature at 1.59mm (.062 inch)
be!ow seplane; t
~
5 seconds
Recommended Operating Conditions
Symbol
Descrlptig"
Min.
Nom.
Max.
5.0
5.5
V
+85
°C
Unit
Vee
4.5
T"
h,,'
-55
100
nsec
Time data must be held before positive transition
of enable line
tSETuP
50
nsec
Time data must be held after positive transition
of enable line
tnoLD
50
nsec
SUpply Voltage
Operatipg temperature, ambient
Enable Pulse Width
Enable pulse rise time
200
hLH
Electrical/Optical Characteristics
(T A = -55° C to +85° C, Unless Otherwise Specified)
Symbol
Test Conditions
Supply Current
Icc
Power dissipation
Pr
Vee = 5.5 V (characters
"5." or "B" displayed)
Luminous intensity per LED
(Digit average) (5,"1
L
Vcc=c.5,OV, T,,="25°C
Description
nsec
Min.
40
Typ.l'l
Max.
Unit
112
170
mA
560
935
mW
85
/lCd
Logic low-level input voltage
VII.
Logie high-level input voltage
V IH
Enable low-voltage; data being
entered
VEL
Enable high-voltage; data not
being entered
VEil
Blanking low-voltage; display
not blanked (11
VBL
Blanking high-voltage; display
blanked (71
VBH
Blanking low-level input current<7l
10L
Vcc=5.5V, VBL=0.8V
50
/lA
Blanking high-level input current I7l
hm
Vec=5.5V, VBH=4.5V
1.0
mA
Logic low-level input current
IlL
Vce=5.5V, VII.=OAV
-1.6
mA
Logie high-level input current
lIB
Vcc=5.5V, VlH""2.4V
+100
p.A
Enable low-level input current
!"I.
Vec=5.5V, Vn=OAV
-1.6
mA
Enable high-level input current
Peak wavelength
Dominant Wavelength
(SI
IEH
0.8
2,0
V
V
0.8
Vcc"'4.5V
2.0
V
V
0.8
3.5
V
V
Vcc=5.5V, VEH"'2.4V
+130
p.A
APEAK
T,,=25°C
655
nm
Ad
TA=25°C
640
nm
1.0
gm
Weight
Notes: 1. Nominal thermal resistance of a display mounted in a socket which is soldered into a printed circuit board: 8JA=50°C/W;
8Jc=15°CIW; 2. 8CA of a mounted display should not exceed 35° ClWforoperation up to T A=+100" C. 3. Voltage values are with respect to
device ground, pin 6. 4. All typical values at Vcc=5.0 Volts, TA=25°C. 5. These displays are categorized for luminous intensity with the intensity category designated by a letter located on the back of the display contiguous with the Hewlett-Packard logo marking. 6. The
luminous intensity at a specifiC ambient temperature, Iv (TAL may be calculated from this relationship: Iv(TA)=lv["Oq (.985) [TA -25°Cl
7. Applies only to 7359. 8. The dominant wavelength, Ad, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
7-159
TRUTH TABLE
DATA INPUT
(LOW LEVEL DATA)
1.5V
1'--+_"'
J
DATA INPUT
(HIGH LEVEL DATA)
L
H
I- 'nH
H
I"I~==:-_
INPUT
15V
10%
5082·7359
L
~
1.5V
ENABLE
~
5082·7356/1357
x,
x,
~90%
~\v~
K
H
H
H
H
Figure 1. Timing Diagram of 5082-735X
Series Logic.
H
{BLANK)
H
Pin.
Vee
ENABLE
LOGIC
INPUT
N;~
(BLANKI
5------.
H
H
8_X1
l_XZ
2-X4
3-XB
op[Z]
H
LAiCH
MEMORY
r--
H
H
MAHHX
OECODER
IBLANKI
....
(BLANKI
ON
DECIMAL PT. 121
4-0P
:
:."
OFF
LOAD DATA
J
ENABLEP1
1_
LATCH DATA
DP
BLANKING(31
CONTROL
4_
lEO
MATRIX
DRNER
DlSPLAY·ON
BLANKINGl3)
r--
lED
MATRIX
GROUND
Figure 2. Block Diagram of 5082-735X
Series Logic.
Notes:
1. H = Logic High; L =Logic Low. With the enable input at logic high
changes in BCD input logic levels or D.P. input have no effect upon
display memory. displayed character. or D.P.
2. The decimal point input. DP. pertains only to the 5082·7356 and
5082·7357 displays.
3. The blanking control input. B. pertains only to the 5082·7359
hexadecimal display. Blanking input has no effect upon display
memory.
J
.l.B
L
~
-1.6f-----f---+-- ~C" 25~C .1_
."
-l.0f----+--+---/---+--j
!!!~
Vee' 5.0V
...
:Z .l.4t----f---+---t----t----1
~ -1.2t----f---+---t----t----1
w
~
!.
B:--", ......
3 -.6t-----j+--+--+---f----1
I -.4f----++
,-1----+----+--1
~ 50f--+---f---i---r--+---f---+--~
Va = O,BV
~~5~.~40"-.2~O~~O"~2~O~4~O"~W~~.O~~'00
VB - BLANKING VOLTAGE - V
Figure 3. Typical Blanking Control
Current vs. Voltage for 5082·
7359.
TA - AMBIENT TEMPERATURE -
"c
Figure 4. Typical Blanking Control
Input Current vs. Ambient
Temperature for 5082·7359.
7-160
_w
.. 21----++__
'-+--+--1---..1
\
°O~-~l~.0~~~2~.O----~3.~O--~4~.O~~5.·O
VE - LATCH ENABLE VOLTAGE-V
Figure 5. Typical Latch Enable Input
Current vs. Voltage.
1.0
-1.8
~
iT "25"C
c
-1.6
I
~
:0a:
-
Vee" $lJV
~
~
I
2
~ -1.2
g
(5
-.8
I
-.6
z
.B
l"- I--
~
~
~
I't
~ ~~
-....
\
y£ '"'
al
ffi"
V
I
4
2
°0
.5
- ..........
2
-~ ~
B -10
u
I
I-
26
.......
B ~ .7
~ B .6
2
1-1.4
~
"E .9
Vee ":5:-oV
V1l "O.BV
.4
u .3
g
~
_;;! ~= .2
V£ .. 5V \
1..1'
0.5
I"
1.0
2.0
3.0
4.0
5.0
-55 -40
VIN - LOGIC VOLTAGE - V
Figure 6. Typical Logic and Decimal
Point Input Current vs.
Voltage.
z
'i
24
I 22
~ !z
a~
20
18
~§
~ u 16
100
Figure 7. Typical Logic and Enable
Low Input Current vs.
Ambient Temperature.
-
'0[-
-
Vee +r- S.OV ,
V'H"24V I
-~
Y
/i_
~ 14
""
~i
10
~ ~
8
I
i :.: 12
~
9
_w
_=
<
/
4
o
I
/
.x
6
2
-20
0
20
40
60
80
TA - AMBIENT TEMPERATURE _ °C
-
2~
i
~I
1
o
I-
-
/
./
~
-55 -40
-20
0
20
40
60
80
TA - AMBIENT TEMPERATURE - °C
100
Figure 8. Typical Logic and Enable
High Input Current vs.
Ambient Temperature.
Operational Considerations
ELECTRICAL
MECHANICAL
The S082-73SX series devices use a modified 4 x 7 dot
matrix of light emitting diodes (LED's) to display
decimal/hexadecimal numeric information. The LED's are
driven by constant current drivers. BCD information is
accepted by the display memory when the enable line is at
logic low and the data is latched when the enable is at
logic high. To avoid the latching of erroneous information,
the enable pulse rise time should not exceed 200
nanoseconds. Using the enable pulse width and data
setup and hold times listed in the Recommended
Operating Conditions allows data to be clocked into an
array of displays at a 6.7MHz rate.
These displays are designed for use in adverse industrial
environments.
These displays may be mounted by soldering directly to a
printed circuit board or inserted into a socket. The leadto-lead pin spacing is 2.S4mm (0.100 inch) and the lead
row spacing is 1S.24mm (0.600 inch). These displays may
be end stacked with 2.54mm (0.100 inch) spacing between
outside pins of adjacent displays. Sockets such as Augat
324-AG2D (3 digits) or Augat 50S-AGSD (one digit, right
angle mounting) may be used.
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +1000 C, it is important to
maintain a case-to-ambient thermal resistance of less
than 3S o C/watt as measured on top of display pin 3.
The blanking control input on the 50S2-7395 display
blanks (turns off) the displayed hexadecimal information
without disturbing the contents of display memory. The
display is blanked at a minimum threshold level of 3.5
volts. This may be easily achieved by using an open
collector TTL gate and a pull~up resistor. For example,
(1/6) 7416 hexinverter buffer/driver and a 1200hm pull-up
resistor will provide sufficient drive to blank eight
displays. The size of the blanking pull-up resistor may be
calculated from the following formula, where N is the
number of digits:
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-1S, Genesolv DE-1S.
CONTRAST ENHANCEMENT
Rbi'" = (Vee - 3.5V)/[N (1.0mA)]
The S082-73SX displays have been designed to provide the
maximum posible ON/OFF contrast when placed behind
an appropriate contrast enhancement filter. Some
suggested filters are Panelgraphic Ruby Red 60 and Dark
Red 63, SGL Homalite H100-1605, 3M Light Control Film
and Polaroid HRCP Red Circular Polarizing Filter. For
further information see Hewlett-Packard Application Note
964.
The decimal point input is active low true and this data is
latched into the display memory in the same fashion as is
the BCD data. The decimal point LED is driven by the onboard IC.
The ESD susceptibility of these IC devices is Class A of
MIL-STD-883 or Class 2 of DOD-STD-1686 and 000HDBK-263.
7-161
Solid State Over Range Display
For display applications requiring a ±, 1, or decimal point deSignation, the 5082-7358 over range display is avaiiable. This
display module comes in the same package as the 5082-735X series numeric display and is completely compatible with it.
package Dimensions
----------,
.. 111t:f:
r-----~---NlJMJi(I.AI.ON~
-;--;-+--+
M~S
I
~
I
I
1
"SEAtiNG
PLA.NE
0,3 'OM TVP.
(.Ol~ r.003)
t....;]'
I~~I-l
.FI-f
-I f-
FRONT
_ _ _..
I
I
~
'DOl'
WI
SIDE
Flgur. 9. Typical Driving
Clrcuit~
TRUTH TABLE
PIN
Ct.fARACTER
REAR
1
PIN
FUNCTION
1
Noras,
2
Plus
Numeral One
t:
••
3
Numeral One
1. DIM'~SIQNS IN M,.t.IMETEAS AND (INCHES).
UNLESS orllalWI66 SPECifiED. TliE 10LERANCE
ON ALL OIMENSIO~S IS 1(1,38 MM (.o.ole INCHIiSl.
·
4
B
j(
X.
X.
H
H
X
+
-1
OP
Open
Open
6
7
2,3
j(
H
Decimal Point
X
X
Blank
L
L
X
H
L
X
L
NOTES: L: Line switching transistor in Figure 9 cutoff.
H: Line switching transistor in Figure 9 saturated.
X: 'Don't care'
..
Vee
MlnUS/l"luI
Electrical/Optical Characteristics
5082-7358
(TA = -55 0 C to +85 0 C, Unless Otherwise Specified)
DESCRIPTION
SYMBOL
TEST CONDITIONS
FOrVWItd Voltage per LEO
VF
IF = 10mA
Power dissipation
PT
Luminous Intensity pet LEO (digit average)
Iv
Peak wavelength
Dominant Wavelength
Apeak
hd
=10mA
all diodes lit
If -emA
TC ~25°C
Tc ~ 26°C
TC=2SoC
VO".
LEO supply
Forward current. e.cll LeO
IF
4,5
5.0
5.0
5.5
10
NOTE:
LED current must be externally limited. Refer to Figure 9
MAX
UNIT
1.6
2,0
V
40
280
320
mW
85.
655
640
1.0
lied
nm
nm
gm
Absolute Maximum Ratings
SYMBOL MIN NOM MAX UNIT
Vee
TYP
IF
weight
Recommended operating
Conditions
MIN
V
mA
DESCRIPTION
SYMBOl. MIN. MAX.
Storage temperatura, ambient
-65 +125
TS
Operating temperature. ambient
-55 +100
TA
Forward current, each LED
10
IF
Reverse voltage, each LEO
4
VR
for recommended resistor values.
7-162
~
·c
rnA
V
XA[1ECfMAL AND NUI'I1I RIC
DISPLAYS FOR IN9USTRIAL APPLICATIONS
Flidl
HIOH EFFICIENCY RED
lOw POytTer HDSP'0760/0761/0762/0763
High Brlghtfless HDSP'0770/0771 10772/0763
YELLOW HDSP-0860/0861/0862Idss3
O~EEN H, PrrQ960LQ :1:/0962L0963
HEWLETT
a:~ PACKARD
Features
• THREE COLORS
High-Efficiency Red
Yellow
High Performance ,Green
• THREE CHARACTER OPTIONS
Numeric
Hexadecimal
Over Range
o TWO HIGH-EFFICIENCY RED OPTIONS
low Power
High Brightness
L
o PERFORMANCE GUARANTEED OVER
TEMPERATURE
o MEMORY lATCH/DECODER/DRIVER
TTL Compatible
Description
o 4x7 DOT MATRIX CHARACTER
o CATEGORIZED FOR LUMINOUS INTENSITY
o YEllOW AND GREEN CATEGORIZED
FOR COLOR
Typical Applications
The numeric devices decode positive BOD logic in'to
characters "0-9", a "-" sign, decimal paint, and a test
pattern. The hexadecimal devices decode positive BCD
logic into 16 characters, "0-9, A-F", An input is provided on
the hexadecimal devices to blank the display (all LED's
off) without losing the contents of the memory.
o INDUSTRiAL EQUIPMENT
o COMPUTER PERIPHERALS
o INSTRUMENTATION
o TELECOMMUNICATION EQUIPMENT
The over range device displays "±1" and right hand
decimal point and is typically driven via external switching
transistors.
Devices
Pari Number
HDSP0760
0761
0762
0763
0770
0771
0772
0763
0860
0861
0862
0863
0960
0961
0962
0963
These solid state display devices are designed and tested
for use in adverse industrial environments. The character
height is 7.4mm (0.29 inch). The numeric and hexadecimal
devices incorporate an on-board 10 that contains the data
memory, decoder and display driver functions.
Description
Numeric, Right Hand DP
Numeric, Left Hand DP
Hexadecimal
Over Range ±1
Numeric, Right Hand DP
Numeric, Left Hand DP
Hexadecimal
Over Range ±1
Numeric, Right Hand DP
Numeric, Left Hand DP
Hexadecimal
Over Range ±1
Color
High-Efficiency Red
Low Power
High-Efficiency Red
High Brightness
Yellow
..
Numeric, Right Hand DP
Numeric, Left Hand DP
Hexadecimal
Over Range ±1
Green
7-163
- - _ ..... - - - - -
Front
View
A
B
C
D
A
B
C
D
A
B
C
0
A
B
0
D
package Dimensions
f.-'0.2 MAX.
10.4001
C
I ,..,
,-----J~U~N~C~T~IO~N~____~
I
PIN
1
HEXA.
DECIMAL
NUMERIC
13.5
31
Lr-riT-rtMh-,...d
I
5
L..... B
~0.'0°
REAR VIEW
5
6
7
B
PLANE
4
3
15
1.061
1151
I
I
*
1.3
1050)
PIN 1 KEY
I
Inpu, 1
Inpu, 1
1. Dimensions in millimetres and (inches).
2. Digit center line is ±O.S8 mm (±O.015 inch)
from package center line.
3. Unless othecwlse specIfied, the tolerance on
all dimensions is ±O.3S mm (±O.015 inch).
~
~ -~If
TYP]~' D~
SEATING
DATE CODE
Latch
enable
END VIEW
'B
LUMINOUS
INTENSITY
CATEGORY
Latch
enable
3.4
4. HDSP-0860 and HDSP-096Q series.
11_0.5 ±0.08 TYP.
10.020 ±0.003)
2.5 ±O,1a TYP.
10.1010.0OS)
-j
2
tsETUP-t---......-t---......+tHOLD
DATA INPUT
ILOW LEVEL DATA)
TAUTHTABLE
x,
1.5V
DATA INPUT
IHIGH LEVEL DATA)
NUMERIC
HEXA·
DECIMAL
1.5V
H
90%
H
L
H
'''I
H
Figure 1. Timing Diagram
Vee
H
7~
H
+
INPUT
DP(2)
=:
=:
-
1(1
X2
X4
X8
H
MATAlX
LATCH
MEMORY
DECODER
{BLANK)
(BLANKI
H
(BLANK)
..
tl
~
'
IBLANK)
H
"::-i. -1
OECIMAL PT, lil f-c0"'N"'________.....,.v;:.n::... L __
DP
ENA8UI11
~
.-
H
H
H
+
OP
BLANKING(3)
CONTROL
H
H
ENABLE
LOGIC
i
H
~EO
MATRI"
DRIVER
BLANKING ,"
f-
OFF
VD~·
LATCH DATA
V• • H
DISPLAY·OFF
VB "H
H
Notes:
1, H '" Logic High; L '" Logic Low. With the enable input at logic high
changes in BCD input logic levels have no effect upon display
memory, displayed character, or DP.
2. The decimal point input, DP, pertains only to the numeric displays,
LED
MATRIX
3. The blanking control input, e, pertains only to the hexadecimal
displays. Blanking input has no effect upon display memory.
GROUND
Figure 2. Logic Block Diagram
7-164
-
- - - - - - - - - - - - - - - - - - - - _ ..- - - - - - - - - - - - -
Absolute Maximum Ratings
Symbol
Description
Storage t~e, am~i.ent
Operating
ture, ambient 111
Supply vol
1
.,>
."
Min.
-65
-55
-0.5
-0.5
-0.5
J;j;
,,'
TA
'.
Vee
VloVDP,V C
volia'ge applied to input logic, dp and enable pins
VOltCige applied to ~.!.anking input 121
VB
Maximum solder temperature at 1.59mm (.062 inch)
below se~ting plane; t ~ 5 seconds
Max.
Unit
+tOO
ob
+§5
·C
+7.0
Vee
V
V
Vee'
V
260
°C
Recommended Operating Conditions
Description
S,ymbol
'\tee
Supply Voltage 121
Op~rating temp~rature, ambient 111
TA
tw
Enable Pulse Width
Time data must be held before positive transition
of enable line
Time data must be held after positive transition
of enable line
Enable pulse rise time
HDSP-0760
Series
HDSP-0770
Series
HDSP-0860
Series
HDSP-0960
Series
Description
Luminous intensity per LED
(Digit Average)l3.4j
Nom.
5.0
Max.
5:5
+85
Unit
V
·C
nsec
tSET~P
50
nsec
tHOW
50
nsec
trLH
1.0
msec
Max.
Unit
s.ov
Optical Characteristics at TA
Device
Min.
4.5
-55
100
Symbol
Iv
Peak Wavelength
Dominant Wavelength(5)
APEAK
Ad
Luminous Intensity per LED
(Digit Average)f3.4]
Iv
Min.
65
260
Typ.
140
!,cd
635
nm
626
nm
620
!,cd
Peak Wavelength
APEAK
635
nm
Dominant Wavelength l5j
Ad
626
nm
Luminous Intensity per LED
(Digit Average)'3-AJ
Iv
490
/lcd
Peak Wavelength
APEAK
583
nm
Dominant Wavelength!5,6J
Ad
585
nm
Luminous intensity per LED
(Digit Average)13.4J
Iv
1100
!,cd
nm
nm
215
298
Peak Wavelength
APEAK
568
Dominant Wavelength lS.6J
Ad
574
Notes:
1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is RBJA =50°C/W/device.
The device package thermal resistance is RBJ-PIN = 15°C/W/device. The thermal· resistance device pin-to-ambient through the PC
board should not exceed 35'C/W/device for operation at TA = +85°C.
2. Voltage values are with respect to device ground, pin 6.
3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back of the
display package. Case temperature of the device immediately prior to the light measurement is equal to 25' C.
7-165
Electrical Characteristics; TA
Descrlpllon
Supply
Current
Power
Dissipation
= -55°C to +85°C
Symbol
HOSP-0760 Series
HDSP-0770 Series
HDSP-0860 Series
HOSP·0960 Series
Icc
HDSP-0760 Series
HDSP-0770 Series
HOSP-0860 Series
HDSP·0960 Series
Pr
Test Conditions
Min.
Typ.l71
Max.' Unit
78
lOS
Ycc'" 5.SV
120
175
(characters "S." or
"8" displayed)
390
S73
690
963
mA
mW
Logic, Enable and Blanking
Low-Level Input Voltage
VIL
Logic, Enable and Blanking
High-Level Input Voltage
VIH
Logic and Enable
Low-Level Input Current
ttL
Vee = S.SV
Blanking Low-Level Input Current
leL
Logic, Enable and Blanking
High-Level Input Current
hH
0.8
M
Vee'" 4.5V
.
V
V
-1.6
mA
VIL = OAV
-10
Vee =S.SV
VIH"" 2AV
+40
p,A
p,A
Weight
1.0
Leak Rate
gm
5xl0-S
cc/sec
Notes:
4. The luminous intensity at a specific operating ambient temperature, Iv (TA) may be approximated from the following expotential equation:
Iv ITA = Iv 125'C) elk ITA' 25' C1 1.
Device
HDSP-0760 Series
HDSP-0770 Series
HDSP-0660 Series
HOSP-09S0 Series
K
-O.0131/'C
-O.0112!'C
-O.0104/'C
5. The dominant wavelength, Ad, is derived from the CIE Chromaticity Diagram and is that single wavelength which defines the color of
the device.
6. The HDSP-0860 and HDSP-0960 series devices are categorized as to dominant wavelength with the category designated by a number
on the back side of the display package.
7. All typical values at Vee = 5.0V and TA = 25' C.
Operational Considerations
ELECTRICAL
These devi'ces use a modified 4 x 7 dot matrix of light
emitting diode to display decimal/hexadecimal numeric
information. The high efficiency red and yellow LED's are
GaAsP epitaxial layer on a GaP transparent substrate. The
green LED's are GaP epitaxial layer on a GaP.transparent
substrate. The LED's are' driven by constant current
drivers, BCD information is accepted by the display
memory when the enable line is at logic low and the data is
latched when the enable is at logic high. Using the enable
pulse width and data setup and hold times listed in the
Recommended Operating Conditions allows data to be
clocked into an array of displays at a 6.7 MHz rate.
blanked at a minimum threshold level of 2.0 volts. When
blanked, the display standby power is nominally 2S0 mW
at TA = 2S'C.
The decimal point input is active low true and this data is
latched into the display memory in the same fashion as
the BCD data. The decimal point LED is driven by the onboard IC. "
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixutres formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-1S, Genesolv DE-1S.
The blanking control input on the hexadecimal displays
blanks (turns off) the displayed information without
disturbing the contents of display memory. The display is
MECHANICAL
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambieni temperature of +85'C, it is important to
maintain a cast-to-ambient thermal resistance of less
than 35° C wattldevice as measured on top of display
~n3.
'
7-166
CONTRAST ENHANCEMENT
These display devices are designed to provide an
optimum ON/OFF contrast when placed behind an
appropriate contrast enhancement filter. The following
filters are suggested:
Ambient Lighting
Display
Color
Dim
HDSP-0860 Series
Yellow
Panelwaphic Yellow 27
Chequers Amber 107
Moderate
Bright
Polaroid HNCP 37
3M light Control Film
Polaroid Gray HNCP10
HOYA Yellowish-OraAge
HLF-608-3Y
Marks Gray
MCP-0301-8·10
Panelgraphic Gray 10
HDSP-0760 Series
HDSP-0770 Series
High Efficiency Red
Panelgraphic Ruby Red 60
Chequers Red 112
HDSP-0960 Series
HP Green
Panelgraphic Green 48
Chequers Green 107
Chequers Grey 105
Polaroid Gray HNCP10
HOYA Yellow-Green
HLF-608-1G
Marks Yellow-Green
MCP-0101-5-12
Over Range Display
Absolute Maximum Ratings
The over range devices display u±1 u and decimal pOint.
The character height and package configuration are the
same as the numeric and hexadecimal devices. Character
selection is obtained via external switching transistors
and current limiting resistors.
DeScription
Storage Temperature,
Ambient
Operating Temperature
Ambient
Forward Current,
Each LED
Reverse Voltage,
Each LED
package Dimensions
I-(~O~) MAX'_I
,&,,L,,&,"§"
--.1.5
_.
~('O6)
[1
7.4 4.8
(.29) (.19)
IT
.• .i• I
---t-iiT
or-
1.9
li'r'p
0
Pin
1
2
:l
j:)(T
i'1''2' 1'3' 'i
C
.075
}s
13.5
3.3
(0.13)
4
5
6
Plus
Numeral One
Numeral One
DP.
Open
Open
7
8
Minus/Plus
Vee
FRONT VIEW
-
1
Decimal Point
Blank
I
I
I
~'7
UnU
+100
·0
TA
-55
+85
·0
IF
10
I mA
VA
5
V
>-- - - ,,2'
R,
R,
~
Pin
2,3
4
1
0
X
X
0
X
X
X
X
1
0
Vee'" 5.0V
8
1
~'7
.,
'7
~
#3
1
1
X
0
Max.
-65
~7
L_
X
Min.
----------"1
r---------PLUS
NUMERAL ONE
MINUS PLUS
I
I
.....-'----,
r---'I
I
~;p
~'7
'7 ~'7
'7 ~ I
~
I ~'7
Note:
1. Dimensions in millimetres and (inches).
+
Symbol
Ts
Function
;)
::':haf8cler
Polaroid Gray HNCP10
HOYA Reddish-Orange
HLF-608-SR
Marks Gray
Mep-OS01-8-l0
Marks Reddish-Orange
MCP-020l-2-22
--#8'>- - -
----
#4
R,
'::'
1
X
Figure 3. Typical Driving Circuit
X
0
Notes:
0: Line switching transistor in Figure 7 cutoff.
1: Line switching transistor in Figure 7 saturated.
X: 'don't care'
7-167
~
'---r-
#;<
RJ
RJ
'::'
'7
'::'
I
I
I
__oJ
Recommended
Operating Conditions. Vee = 5.0V
Luminous Intensity Per LED
Forward
Device
Low Power
HDSP-0763 High
Brightness
HDSP-0863
HDSP-0983
Current Per
lEO, mA
2.8
8
8
B
Electrical Characteristics; TA =-55°C to +85°C
Device
DeSCription
HD$P·0763
Power Dissipation
(all LED's lIIuminatedl
HDSP·08S3
HDSP-D963
I
PT
Forward Voltage
per LED
VF
Power DI$$ipation
(aU LED's Illuminated I
Pr
Forward Voltage
per LED
Power DI$$lpation
(all LED's Illuminated)
Forward Voltage
per LED
Test Condition
Symbol
IF"" 2.8 mA
IF=8mA
IF" 2.8 mA
IF=8 mA
Min.
Max.
Units
=ij~
282
mW
237
282
Typ.
72
g.?
V
mW
IF"" 6 mA
VF
1.90
243 -
Pr
IF =8 mA
VF
1.85
7·168
2.2
V
282
mW
2.2
V
r
Flio-
HEWLETT
~~ PACKARD
LEADFRAME MOUNTED SEVEN
SEGMENT IVIONOLITHIC
NUMERIC INDICATORS
508+-740017430 SERIES
Features
• COMPACT PACKAGE SIZES
.25" Package Width
.150" and .200" Digit Spacing
• STROBED OPERATION
Minimizes Lead Connections
• FULLY ENCAPSULATED STANDARD DIP
PACKAGES
End Stackable
Integral Red Filter
Extremely Rugged Construction
• I.C. COMPATIBLE
• CATEGORIZED FOR LUMINOUS INT-ENSITY
Assures uniformity of light output from unit to
unit within single category.
Description
The HP 5082-7400/-7430 series are 2.79 mm (.11"), seven
segment GaAsP numeric indicators packaged in 2, 3,4 and
5 digit clusters. An integral magnification technique
increases the luminous intensity, thereby making low
power consumption possible. Options include either the
standard lower right hand decimal pOint or a centered
decimal point.
.
Applicaiions include mobiJe.telephones, hand held calculators, portable instruments and many other products
requiring compact, rugged, long lifetime active indicators.
Device Selection Guide
Configuration
Digits per
Cluster
Device
2 (right)
I
3
IBIBlal
4
5
IBIBI
IBIBIBIBI
IBIBIBIBIBI
Inter·Digit
Spacing
mm (inches)
Part Number
Center Decimal Point
Right Decimal Point
5.08 (,200)
5082·7432
5.08 (.200)
50'12·7433
3.81 (.150)
5082·7404
5082·7414
5082·7405
5082·7415
J
3.81 (.150)
7-169
Absolute Maximum Ratings
Symbol(
Parameter
Min.
Max.
Units
Peak Forward Current per Segment or dp (Duration < 500 /-Is)
5082-7432/7433
IPEAK
50
mA
Peak Forwa'rd Current per Segment or dp (Duration < 1 mseo)
5082-7404174051741417415
IPEAK
110
mA
Average Current per Segment or dp
IAVG
5
mA
Power Dissipation per Dlgit!11
Po
80
mW
Operating Temperature, Ambient
TA
-40
75
·C
Storage Temperature
Ts
-40
100
·C
Reverse Voltage
VR
V
5
Solder Temperature 1/16" below seating plane (t $ 3 8ec)12 1
230 '
·C
Max.
Units
Notes: 1. Derate linearly @ 1 mW/oC above 25°C ambient.
2. See Mechanical section for recommended flux removal solvents ..
Electrical/Optical CharacteristiCS at TA
Parameter
Luminous Intensity/Segment or dpl3.41
5082-743217433
Luminous Intensity/Segment or dpl3.41
(Time Averaged)
5082·7404174051741417415
Symbol
Test Condition
Min.
Typ.
Iv
IAVG = 500 /-IA
(lPK =5 mA
duty cycle"" 10%)
10
40
/-Icd
Iv
IAVG = 1 mA
IPK =10 mA
dutY cycle"" 10%)
5
20
/-Icd
655
Peak Wavelength
APEAK
Forward Voltage/Segment or dp
5082-7432/-7433
VF
IF =5 mA
1.55
2.0
nm
V
Forward Voltage/Segment or dp
5082-7404174051741417415
VF
IF'" 10 mA
1.55
2.0
V
I
Reverse Voltage/Segment or dp
VR
Rise and Fall Timel51
tr, If
V
5
IR = 200 /-IA
ns
10
NOTES:
3. The digits are categorized for luminous intensity. Intensity categories are designated by a letter located on the back side"of the
'
package.
4. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower
peak currents may cause intensity mismatch within the display. Operation at peak currents less than 5.0 mA may cause objectionable display segment matching.
5. Time for a 10%-90% change of light intensity for step change in current.
5082-743217433
'B
"I
I-
C Z
~~
«C>
1000
I
500
400
300
DUTY
CVCL~ • 5% "
':.~ I
ffi~ 200
>0:
«~
w> 100
C1~.
A:!
1-:>
C
Z
~
:>
->
50
40
30
,20
~
Z
w
ij
/
ii:
::;
".
1/ 11'/
Iht?
10
0,1
0.2 0.3
'-'"
I
,8
.6
~
,4
.
2
1,0
w
0:
I
"
1.0
V ""
1,2
5 I
/
1/
0.5
1,4
w
>
'& 'Y
3E11- ..
->Z
>",
.,
5082-7432n433
1,6
3
5
I
,2
00
10
"'AVG - AVe'RAGE CURRENT'PER SEGMENT - rnA
5
10
16
20
25
30
35 40
45
50
IpEAK - PEAK CURRENT PER SEGMENT - I1'IA
Figure 1. Typical Time Averaged Luminous Intensity per
Segment (Digit Average) VB. Current
per Segment.
Figure 2. Relative Luminous Efficiency va. Peak Current
per Segment.
'
7-170
- - - - -_._----_.
- - - - - - - - -------------
__.- _ . _ - - - - - - - 5082~7404/7405/7414/7415
5082-7404/74Q5/7414/7415
>
I-
-
1.8
0;
[iii "C
~ E,
&%/
lOy ~
.15
~ffi .10
~ ~ .08
~~
a!::
~§
/77
~g
-'w
,,~
~"
,0
1
~~
1.2
w
1.0
~w
.8
I
.6
~
.4
a:
//
v,~
0.4
ifw
>
~o/w
":;
1.4
U
~ t;I
DUTY CYCLE·
,04
~~ ,02
I-a:
20%
I.V/
,06
1--;-
1.6
>
"Z
w
~
I
II
/
V
.2
0.6 0.8 1.0
4,0
2.0
00
6.0
l.vI • - AVERAGE CURRENT PER SEGMENT - rnA
20
40
60
80
100
IpEAK - PEAK CURRENT PER SEGMENT - mA
Figure 4. Relative Luminous Efficiency vs. Peak Current per
Segment.
Figure 3. Typical Time Averaged Luminous Intensity per
Segment (Digit Average) vs. Average Current per
Segment.
5082-7400/7430 SERIES
80
<
~
5.0 r----..--,--sr-O..,.RA""'G""EC"A-NO.,...-..--.,...,
II
60
I-
k--j::!t:::=t=:;;-~~t~~TlNG -I==~:!-I
~
a:
a:
::J
"
a
40
i
o
.. 20
I
~
00
-I
.4
.8
1_2
1.6
.4 '--..J.._...l-_'--..J.._~---''--UII
2,0
2.4
VF - FORWARD VOLTAGE -
2,8
3.2
-60
v
-40
-20
a
20
40
60
80
Tc - CASE TEMPERATURE - °c
Figure 6. Relative Luminous Intensity vs. Case
Temperature at Fixed Current Level.
Figure 5. Forward Current vs. Forward Voltage.
Electrical/optical
The 5082-740017430 series devices utilize a monolithic
GaAsP chip of 8 common cathode segments for each
display digit. The segment anodes of each digit are
interconnected, forming an 8 by N line array, where N is
the number of characters in the display. Each chip is
positioned under an integrally molded lens giving a
magnified character height of 2.79mm (0.11) inches.
Satisfactory viewing will be realized within an angle of
±SO· for the 7404174051741417415 and ±20· for the
743217433, measured from the center line of the digit.
.Mechanical
The decimal point in the 7432, 7433, 7414, and 7415
displays is-located at the lower right of the digit for
conventional driving schemes.
The 5082-7404 and 7405 displ!lYs contain a centrally
located decimal point which is activated ih place of a digit.
In long registers, this technique of setting off the decimal
point significantly improves the display'S readability. With'
respect to timing, the decimal point is treated as a separate
character with its own unique time frame.
'To improve display contrast, the plastic incorporates a red
dye that absorbs strongly at all visible wavelengths except
the 655 nm emitted by the LED. An additional filter, such
as Plexiglass 2423, Panelgraphic 60 or 63, and SGL
Homalite 100-1605, will further lower the ambient reflectance and improve display contrast.
7-171
The 5082-740017430 series package is a: standard 12 or 14
Pin DIP consisting of a plastic encapsulated lead frame with
integral molded lenses. It is designed for plugging into
DIP sockets or soldering into PC boards. The lead frame
construction allows use of standard DIP insertion tools
and techniques. Alignment problems are simplified dueto
the clustering of digits in a single package. The shoulders
of the lead frame pins are intentionally raised above the
bottom of the package to allow tilt mounting of up to 20· .
from the PC board.
To optimize device optical performance, specially.
developed plastics are used which restrict the solvents
that may be used for cleaning. It is recommended that only
mixtures of Freon (F113) and alcohol be used for vapor
cleaning processes, with an immersion time in the vapors
of less than two (2) minutes maximum. Some suggested
vapor cleaning solvents are Freon TE, Genesolv 01-15 or
DE-15, Arklone A or K. A 60·C (140·C) water cleaning
process may also be used, which includes a neutralizer
rinse (3% ammonia solution or equivalent), a surfactant
rinse (1% detergent solution or equivalent), a hot water
rinse and a thorough air dry. Room temperature cleaning
may be accomplished with Freon T-E35 or T -P35, Ethanol,
Isopropanol or water with a mild detergent.
package Description 5082-7404, -7405, -7414, -7415
Notes: 6. Dimensions in millimeters and (inches).
7. Tolerances on all dimension are ±.38 mm (±.015 in.) unless otherwise noted.
6.35.± 0.25
1.2S0' .010)
~~2rE~~~
7.62± 0.25
1.('300±,0101.1
LED
LriB~I
2.54
(.100)
REF.
5°
REF.-I
Figure 7. 5082-7404/7414
0.25
(.010)-.\
I--
Figure 9. 5082-7404174051
Figure 8. 5082-7405/7415.
741417415
Magnified Character Font Description
O"~'O"" """"m""" ""'"~ r:~!",j
DEVICES
~::~:;:::
'T
DIMENSIONS IN MILLIMETERS AND (INCHES),
,
EJ
'. .
1.57. (.062)
REF.
~I
I
-/ '"~ d- :l"
DEVICES
5082-7414
5082-7415
U ~.
9
so
e
d
Figure 10. Center Decimal Point Configuration
Figure 11. Right Decimal Point
Configuration
Device Pin Description
5082-7404/7414
5082-740517415
FUNCTION.
CATHODE 1
CATHODE 1
.2
ANODEe
ANODEe
3
ANODEc
ANODEc
4
CATHODE 3
CATHODE 3
S
ANODEdp
ANODEdp
6
7
OATHODE4
ANODEd
ANODEg
CATHODES
8
9
10
ANODEd
ANODEg
ANODE!
CATHODE 4
OATHODE2
ANODEf
11
ANODE!>
SEE NOTE 8
12
13
ANODE a
ANODE!>
-
OATHODE2
PIN NO.
1
14
27~~~1I
.1.
FUNCTION
ANODE a
Note 8: Leave Pin Unconnected.
7-172
d~
dP.
.79 (.031)
REF.
'
.53 (.021)
REF.
Package Description 5082-7432, -7433
NOTES' 9. DIMENSIONS IN MILLIMOTERS AND HNC~ESI.
10. TOLERANCES ON ALL DIMENSIONS ARE 0.038 ,(.0151
UNLESS OTHERWISE SPECIFIED.
Figure 11.
Magnified Character Font Description
DEVICES
5082·7432
5082-7433
DIMENSIONS IN MILliMETERS AND IINCHESI.
Figure 12.
Device Pin Description
PIN
5082·7432
508~·7433
NUMBER
FUNCTION
FUNCTION
1
SEE NOTE 11.
ANODEe
ANODEd
CATHOOE 2
ANOOEc
ANODEdp
CATHODE 3
ANODE b
ANODEg
ANOOEa
ANODEf
SEE NOTE 11.
CATHODE 1
ANODEe
ANODEd
CATHODE 2
ANODEc
ANODEdp
CATHODE 3
ANODEb
ANOOEg
ANODE a
ANOOEf
SEE NOTE 11.
2
3
4
5
6
7
8
9
10
11
12
NOT E 11. Leave Pin unconnected.
7-173
rli~ HEWLETT
~~ PACKARD
PRINTED CIRCUIT BOARD MOUNTED
SEVEN SEGMENT
NUMERIC INDICATORS
5082-720017440 SERIES
Features
• MOS COMPATIBLE
• AVAILABLE IN 9 TO 16 DIGIT
CONFIGURATIONS
• CHARACTER HEIGHTS OF .105", .115"
AND .175"
• LOW POWER
• CATEGORIZED FOR LUMINOUS INTENSITY
Description
The HP-5082-720017440 series of displays are seven
segment GaAsP Numeric Indicators mounted on printed
circuit boards. A plastic lens magnifies the digits and
includes an integral protective bezel. Character heights of
.105" (2.67 mm), .115" (2.92 mm) and .175" (4.45 mm) are
available. For large quantity applications, digit string
lengths of 8,12 and 14 digits are available by special order.
Applications are hand held calculators and portable
equipment requiring compact, low power, long lite time,
active displays.
Device Selection Guide
Part
Number
Digits Per
PC Board
Decimal Point
Package
Character
Height
(mm) in.
Inter-Digit
. Spacing
(mm) in.
(5.08) .200"
5082-7441
9
Right Hand
Fig. 9
(2.67) .105"
5082-7446
16
Right Hand
Fig. 11
(2.92) .115"
i3.81) .150"
5082-7285
5
Right Hand
Fig. 14
(4.45) .175"
(5.84) .230"
5082-7295
15
Right Hand
Fig. 13
(4.45) .175"
(5.84) .230"
7-174
Maximum Ratings 5082-7441/7446
Symbol
Parameter
Peak Forward Current per Segment or dp (Duration
< 500/ls)
Min.
IpEAK
Average Current per Segment or dp[l]'
IAVG
Power Dissipation per Digit [2]
Po
Operating Temperature, Ambient
TA
Storage Temperatu re
Ts
Reverse Voltage
VR
Max.
Units
50
mA
3
mA
50
mW
-20
+85
-20
+85
°c
°c
Solder Temperature at connector edge (t";3 sec.)13)
3
V
230
°c
NOTES: 1. Derate linearly at O.lmAfC above 60°C ambient.
2. Derate linearly at 1.7rrlNfC above 60°C ambient.
3. See Mechanical section for recommended soldering techniques and flux removal solvents.
Maximum Ratings 5082-7285/7295
Parameter
Symbol
Peak Forward Current per Segment or OP
(Duration <35!'s)
IpEAK
Average Current per Segment or DP ,41
Max.
Min.
Units'
m,A' •
200
IAVG
7
mA
Power Dissipation per Diglt i51
Pn
125
mW
Operating Temperature. Ambient
TA
-20
+70
·C
Storage Temperature
Ts
-20
+80
°C
Reverse Voltage
VR
Solder Temperature at connector edge
(t';;3 sec.)161
3
V
230
·C
NOTES: 4. Derate linearly at 0.12mA/oC above 25°C ambient.
5. Derate linearly at 2.3mW/oC above 25°C ambient.
6. See Mechanical section for recommended soldering techniques and flux removal solvents.
Electrical/Optical Characteristics at TA
Parameter
Symbol
Luminous Intensity/Segment or dp[7]
5082·7441
25°C 5082-7441/7446
Test Condition
Min.
Typ.
IAVG = 500llA
(lPK = 5mA
duty cycle 10%)
9
40
/led
5mA Peak
1/16 Duty Cycle
7
35
/led
655
nm
1.55
V
=
Iv
5082-7446
Peak Wavelength
Apeak
Forward Voltage/Segment or dp
VF
IF =5mA
Max.
Units
NOTES:,
7. Each character of the display is matched for luminous intenSity at the test 'conditions shown. Operation of the display at lower
pea'k currents may cause intensity mismatch within the display. Operation at peak currents less than 3.5 mA may cause objectionable display segment matching.
7-175
50
"....
E
0
1000
1
45
I
.... 500
400
2
cWW
40
ffi
35
::>
30
to::; 300
a:
25
w>
20
-'2
a:
a:
"ca:
~
a:
~
""
~
0
.!:
~ ....
......
",
;;
5
..
.2 .4
/
.8
1;0 1.2
3
1.4 1.6
1.6
5
4:-.."
3 .........
:::::--..
2
~
0
2
;;
3
w
>
f'
~
a:
0.2 0.3
1.4
>
u
1.2
U
1.0
ffi
~
1
~
~
~
0.5
0.4
0.3
0.2
>
~ :::-...
~
a:
0
~
-40
TA
-20
-
0
20
1.0
2
3
10
5
V
I
-
W
"~
0.1
-60
0.5
Figure 2. Typical Time Averaged Luminous Intensity per
Segment vs. Average Current per Segment.
10
~
V.
V.V/ /
,oh~ II
IAVG - AVERAGE CURRENT PER SEGMENT - rnA
Figure 1. Peak Forward Current vs. Peak Forward Voltage.
>
....
50
40
30
0.1
1.8 2.0
~ !/
~ vy
100
" 20
0
2
VF - ?EAK FORWARD VOLTAGE - V
.
10"AI<-
2°~1
<~
0
0
:i....
OUTY CYCLE .. 5%"
40
60
80
8 /
.6
11
.4
.2
00
AMBIENT TEMPERATURE _oC
5 10
15 20 25 30
35
40
45
50
IPEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 4. Relative Luminous Efficiency vs. Peak Current per
Segment.
Figure 3. Relative Luminous Intensity vs. Ambient
Temperature at Fixed Current Level.
Electrical/Optical Characteristics at TA =25°C 5082-7285/7295
Symbol
Test Condition
Min.
Typ.
Luminous IntensitY/Segment or dp
(Time Averaged) 15 digit display
5082-72951 8 .10 1
Parameter
I,
I"g. = 2 mA
(30 mA Peak
1/15 duty cycle)
30
90
pod
Luminous Intensity/Segment or dp
(Time Averaged) 5 digit display
5082-7285 18,10 1
Iv
I..g. = 2 mA
(10 mA Peak
1/5 duty cycle)
30
70
pod
Forward Voltage per Segment or dp
5082-7295 15 digit display
VF
IF = 30mA
1.60
2.3
V
Forward Voltage per Segment or dp
5082-7285 5 digit display
VF
IF = 10 mA
1.55
2.0
V
Peak Wavelength
DominanIWavelength[9[
Max.
Units
APEAK
655
nm
Ad
640
nm
Reverse Current per Segment or dp
IR
Temperature Coefficient of Forward
Voltage
t:NF/'C
VR=5V
10
pA
-2.0
mVI'C
-~
NOTES:
8. The luminous intensity at a specific ambient temperature, Iv (TA), may be calculated from this relationship:
Iv(TA) = IVI250CI (,985) ITA - 25°CI.
9. The dominant wavelength. Ad, is derived from the C.I.E. Chromaticity Diagram and represents the single wavelength which
defines the color of the device.
10. Each character of the display is matched for luminous intensity at the test conditions shown. Operation of the display at lower
peak currents may cause intensity mismatch within the display. Operation at peak currents less than 6.0 mA may cause objectionable display segment matching.
7-176
200
I
180
~, 160
...
150: 140
0:
=>
120
C
100
"a:
'3:"
0:
l2
80
~'"
60
-'=
20
40
0
.8
./
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
IAVO - AVERAGE CURRENT PER SEGMENT - rnA
V F - PEAK FORWARD VOLTAGE - V
Figure 6. Typical Time Averaged Luminous Intensity per
Segment vs. Average Current per Segment.
Figure 5. Peak Forward Current vs. Peak Forward Voltage.
>
1.8 f---+-+-l-+-+--+--+--Jr--t----
ffiCj
1.7
1.6~
r=:t:t=t=6l=+~~=R
~ 1.51-++7l-1.e-::=1-+-+-+--i-t--i
:;;
>
~
:
~
~
V-+-+-+-+-+-+--+----I
1.4I-hof
1.31----+t/'+-l-t-+--+--+--J-t-1
12 1---+--+--t-t-+--t---T--J-t-1
1.1 f-H
L_I-+-+-+--i-t--i--+-I
':: f-'HL-t--++---t-I-+-+-+--J
.71---+--+--+-!--+--t--+-t-t-1
o~o
-40
-20
0
20
40
T A - AMBIENT TEMPERATURE _
60
~o
80
"c
m ~
W
W 100
lWl~l~
l00WO
IpEAK - PEAK CURRENT PER SEGMENT - rnA
Figure 7. Relative Luminous Intensity vs. Ambient Temperature
at Fixed Current Level.
Mechanical
These devices are constructed on a standard printed
circuit board substrate. A separately molded plastic lens is
attached to the PC board over the digits. The lens is an
acrylic styrene material that gives good optical lens
performance, but is subject to sc~atching so care should
be exercised in handling.
Figure 8. Relative Luminous Efficiency vs. Peak Current per
Segment.
displays should be stored in the unopened shipping
packages until they are used. Further information on the
storage, handling, and cleaning of silver plated components is contained in Hewlett-Packard Application Bulletin NO.3.
Electrical/Optical
The device may be mounted either by use of pins which
may be hand soldered into the plated through holes at the
connector edge of the PC board or by insertion into a
standard PC board connector. The devices may be
hand soldered for up to 3 seconds per tab at a maximum
soldering temperature of 230°C. Heat should be applied
only to the edge connector tab areas of the PC board.
Heating other areas of the board to temperatures in excess
of 85°C can result in permanent damage to the display. It
is recommended that a non-activated rosin core wire solder
or a low temperature deactivating flux and solid wire solder
be used in soldering operations.
The PC board is silver plated. To prevent the formation of a
tarnish (Ag2S) which could impair solderability the
7-177
The HP 5082-7441, -7446, -7285 and 7295 devices utilize a
monolithic GaAsP chip containing 7 segments and a
decimal point for each display digit. The segments of each
digit are interconnected, forming an 8 by N line array, where
N is the number of digits in the display. Each chip is
positioned under a separate element of a plastic magnifying
lens, producing a magnified character. Satisfactory viewing
will be realized within an angle of approximately ±20° from
the centerline of the digit. A filter, such as plexiglass 2423,
Panelgraphic 60 or 63, and Homalite 100-1600, will lower
the ambient reflectance and improve display contrast. Digit
encoding of these devices is performed by standard 7
segment decoder driver circuits.
package Dimensions
1.02±.38
-
(.040 ± ,015) -)
r.
~'7;~~---·--~---- --5:~~;7(:'~:O)----------
(.030)
I
-(l.940±.010)----~
5.08 (.200)
TYP.
~
t
7.11 ± .38
(.2ao± ,015)
--'-12'70 ± .38
-.1___ _
- !
DIGIT =1
.LT-_._-_i- _-_-:.-_-_-_~l~...~"':~...Il '"'<;~ ~ ~"'!...~ j})'"'~t)i-!(iI':!-~ ~ ~'"'\~-:(j'I~ ~1.~":':~!. I~
L _I
720 1
...-:..--.. _1._-,1,-'0_15_--,---t---
...
2
1.91 ± .38
(.075± .015)
5.08 _
3
4
5
6
7
8
L
(.500± .015)
18.9±.38
9 10 11 12 13 14 15 16 17 \
1.....-.- 2.54 (.100) NON·CUMULATIVE
(.200)
1.02± .13
(,040±.OOS)
DIA, TYP,
LB,mu,
1.202 ± .0121
NOTES: 1. Dimensions in millimeters and (inches).
2. Logo and part number ara on back of package.
3. Secondary 1.25X magnifier that slides into
primary lens and increases character height
to 3.33 (.131) available as special product.
4. Tolerances: ±.88 (.015)
Figure 9. 5082-7441
Magnified Character Font Description
5082-7441
Note:
All dimensions in millimeters
and (inches).
Figure 10.
Device Pin Description
Pin
No.
1
2
3
4
5
6
7
8
9
6082·7441
Function
Dig. 1 Cathode
Seg. c Anode
Dig. ;1 Cathode
d,p. Anode
Dig. 3 Cathode
Seg. a Anode
Dig. 4 Cathode
Seg. e Anode
Dig. 5 CathOde
7-178
Pin
No.
6082-7441
Function
10
Seg, d Anode
11
12
13
14
15
16
17
Dig. 6 Cathode
Seg. gAnode
Dig. 7 Cathode
Seg. bAnode
Dig. 8 Cathode
Seg. f Anode
Dig. 9 Cathode
----------------~~~-
package Dimensions
1----------- (~~:~: ~~:)-------
~~
j
I----------(~~~~: ~~~)-----------·ll
--
.I
++++--'j11.18
.~~~~~~~~~~~~~~~~~~~~~~~~~~ (';r)
1.02 (.0401 DIA
PLATED THRU
24 HOLES
(.52
(.248' .0151
5.64 (.2221
+- 1.581.25
1--1 ,-,''''
M
"l".
13.34,o.38
6.30'0'38
t~r!J1..~"w
4.72 ± 0.38
1.186:!: .015)
Figure 11. 5082-7446
Magnified Character Font Description
NOTES: 1. ALL DIMENSIONS IN MILLIMETRES AND
(INCHES).
2. TOLERANCES ON ALL DIMENSIONS ARE
to.3D (.0151 UNLESS OTHERWISE
SPECIFIED.
Figure 12.
Device Pin
Description
Pin
5082-7446
Function
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
16
19
20
21
22
23
24
Cathode-Digit 1
Cathode-Digit 2
Cathode-Digit 3
Cathode-Digit 4
Cathode-Digit 5
Anode-Segment e
Cathode-Digit
Anode-Segment d
Cathode-Digit 7
Anode-Segment a
Cathode-Digit 8
Anode-Segment DP
Cathode-Digit 9
Anode-Segment c
Cathode-Digit 10
Anode-Segment g
Cathode-Digit 11
Anode-Segment b
Cathode-Digit 12
Anode-Segment f
Cathode-Digit 13
Cathode-Digit 14
Cathode-Digit 15
Cathode-Digit 16
e
7-179
package Dimensions
ALL DIMENSIONS IN MILLIMETERS AND (INCHES!.
r-
I~--------------(~:~~: :O!~I_--_-_-_-==~_-_-_--_·-_-_--_-_-_-_--··-------~I
(3.590± .0151
-
-
(~2~b) TYP.
1_------
.
(Oig~1 ~~~T
,(~i~~1
_
45.59± 0.38
(1.795±",015)..
~
28.32 ±0.38
(1.'1S± .015)
15.24± 0.38
(.GOO± .015)
(~1~~) DIA. TYP.
Figure 13. 5082-7295
Magnified Character
Font Description
Device Pin Description
DEVICE
Pin
5082.7295
No.
Function
1
2
3
5082-7295
4
5
6
7
I>
9
10
11
12
13
14
15
16
d.p.
17
18
19
20
ALL DIMENSIONS IN MILLIMETERS AND (INCHES).
21
22
2~
Figure 14.
7-180
lr
TOLERANCES ARE ±O.20 (±.OOS) UNLESS OTHERWISE NOTED
Cathode Digit 1
Cathode Digit 2
Cathode Digit 3
Cathode Digit 4
Anode Segment dp
Cathode Digit 5
Anode Segment c
Cathode Digit 6
Anode Segment e
Cathode Digit 7
Anode Segment a
Cathode Digit 8
Anode Segment 9
Cathode Digit 9
Anode Segment d
Cathode Digit to
Anode Segment f
Cathode Digit 11
.Anode Segment b
Cathode Digit 12
Cathode Digit 13
Cathode Digit 14
Cathode Digit 15
HEIGHT
,
.
Hermetic Displays
7-181
JAN QUALIFIED, HERMETIC, NUMERIC
AND HEXADECIMAL DISPLAYS FOR
HIOH AiLiABILITY APPLICATIONS
FliDW
HEWLETT
a:~ PACKARD
4N51/4N51TXV /
4N52 / 4N52TXV I
4N53 I 4N53TXV /
4N54! 4N54TXV I
M87157/00101ACX
M87157/00102ACX
M87157/00103ACX
M87157/00104ACX
Features
• MILITARY QUALIFIED LISTED ON MIL-D-87157
QPL
• TRUE HERMETIC PACKAGE
• TXV VERSION AVAILABLE
• THREE CHARACTER OPTIONS
Numeric, Hexadecimal, Over Range
• 4 x 7 DOT MATRIX CHARACTER
• PERFORMANCE GUARANTEED OVER
TEMPERATURE
• HIGH TEMPERATURE STABILIZED
• GOLD PLATED LEADS
• MEMORY LATCH/DECODER/DRIVER
TTL Compatible
• CATEGORIZED FOR LUMINOUS INTENSITY
part numbers are defined as follows: "Pi' signifies MIL-D87157 Quality Level A, "C" signifies gold plated leads, "X"
signifies the luminous intensity category.
Description
These standard red solid state displays have a 7.4 mm
(0.29 inch) dot matrix character and an on-board IC with
data memory latch/decoder and LED drivers in a glass/
ceramic package. These devices utilize a solder glass frit
seal and conform to the hermeticity requirements of MILe
0-87157, the general specification for LED. displays. These
4N5X series displays are deSigned for use in military and
aerospace applications.
These military qualified displays are designated as M87157/
00101ACX through -/00104ACX in the MIL-D-87157 Qualified
Parts List (QPL).The letter deSignations at the end of the
The 4N51 numeric display decodes positive 8421 BCD
logic inputs into .characters 0-9; a "-" sign, a test
pattern, and four blanks in the invalid BCD states. The unit
employs a right-hand decimal point.
The 4N52 is the same as the 4N51 except that the decimal
point is located on the left-hand side of the digit.
The 4N54 hexadecimal display decodes positive 8421
logic inputs into 16 states, 0-9 and A-F. In place of the
decimal point an input is provided for blanking the display
(all LED's off), without losing the contents of the memory.
The 4N53 is a "±1." overrange display, including a righthand decimal point.
Package Dimensions *
".2 MAX
"1
j
~
.:......
.......
- . (0.4,001
1.5
(0.061
-
7.4
(0.291
1
1.5
(0.06)
~:.
••••
N51
5.'
......
:ttj.!l
....
•
13.5
10.531
:- t-l-_-
(D.22}
•. i
-,
'"r::r'CM--n::r'- ...1_
3.'
---I
-'
7
7. ,
7'
(0.29)
(0.29)
1. (~~6;) .
,
8
· ... I
·.--1.
13.5
(0.53)
4 ••
--L...:
2
'JEDEC Registered Data.
3.'
(.135)
1rJi
2.5 =0,13 TYP.
(.10 :!:.005)
1
MIL.STD.MARKING(Sl
7-182
Latch
enable
enable
Input 1
I.
1.061
1:3TVP_~'
~~'----J.
11_ 0.5(.020'0.08:!:.OO~)
TVP.
{.0501
PIN 1 KEY
Input 4
InputS
Sianking
DATA
v. =L
v. -H
lATCH DATA
I>'SPLAV.ON
DISPLAY,OfF
Va
-L
VB 'H
1, H =Logic High; L =LogiC Low. With the enable Input at logic. high
changes in BCD inputloglc levels or D,P, input have no effect upon
display memory. displayed character. or D,P.
2. The decimal point Input. DP. pertains only to the 4N51 and 4N52
displays,
.
3, The blanking control input. B. pertains only to the4N54hexadecimai
display, Blanking Input has no effect upon display memory,
350
1., 300
I I
I
Vcc""s.ov
Tc"'2S C
Q
V
/
••
::::
~
NDtes:
.5
/
;":
,"
MATRIX
Figure 2. Block Diagram 014N51-4N54
Serlel Logic;
...... /'
!:::
..
!
~ED
GROUND
1
6
"1
}:)
H
H
'-
,
.:::f."
Ii
OpI21 4 - 01'
~
::::
f..l
(BLANK)
H
MAT1<,X
DECODER
'''t
.;:~
!.
L
H
H
~.
C:
.::;
H
H
~~
;:::....
'-'
1'"
H
Ii
Vee
,",
.'!
Ii
Figure 1. Timing Diagram 01 4N51-4N54
"ENABLE
....
"
H
L
Pin.
4NS4
.1+'.
-t."
V
~
",250
'"rJ
~
200
~ 150
"~,
V
\.
"_=
f'..
r... r-....
Figure 3. Typical Blanklng.Control
Current VB. Voltage lor 4N54.
....... ".-'BV
r- l""-
-... -... ~V
t-
50
•
-"v
.......
100
·55 -40
VB - BLANKING VOLTAGE
V~'5.Jv
v."OVv,"ov
\Ia- • .BV
-20
,20
40
60
TA - AMBIENT TEMPERATURE -
80
Figure 4. Typical Blanking Control
Input Current VB. Ambient
. Temperature lor 4N54.
"JEDEC Registered Data.
7-184
6 ••
100
°c
V E - LATCH ENABLE VOLTAGE - V
Figure 5. Typical Latch Enable Input
Current VB. Voltage.
~~~--~---
-1.
1.0
I
•
0
~
...z1-1.•
-
26
r-
ITC .2l; C 1 _
Vee" s.ov
-1, 6
-
r-.
~ -1. 2
Vee" 5.0V
G -1. 0
V1L ..
u
§ -.,I't
I
_, 6
"
\
2
•
2
0
a
v~'"
1.0
o.av:
--
-~-----
I
...Z ..,I 2'22
I
a~ - rr-~ !z
... gj
I
20
Vcc "'5.QV
18 '--
V'H-"'2.4V
/
~ u 16
z'"
X i2
"'"
~~
/
14
:I: X 12
CC,
:§!
V
~
~
_w
9
2.0
3,0
4.0
5.0
o
-55 -40
V1N - LOGIC VOLTAGE - V
Figure 6. Typical Logic and Decimal
Point Input Current vs.
Voltage.
-20
20
40
60
80
TA - AMBIENT TEMPERATURE _·C
100
Figure 7. Typical Logic and Enable
Low Input Current vs.
Ambient Temperature.
_=
/
/
/
10
8
/
6
/
,I
lriV~
0.5
.-----~--
4
o
-55 -40
-.-.-20
/'
a
20
40
60
80
100
TA - AMBIENT TEMPERATURE _·C
Figure 8. Typical Logic and Enable
High Input Current vs.
Ambient Temperature.
Operational Considerations
ELECTRICAL
leak rate of 5 x 10-8 CC/SEC and a fluorocarbon gross
leak bubble test.
The 4N51-4N54 series devices use a modified 4 x 7 dot
matrix of light emitting diodes (LED's) to display
decimal/hexadecimal numeric information. The LED's are
driven by constant current drivers. BCD information is
accepted by the display memory when the enable line is at
logic low and the data is latched when the enable is at
logic high. To avoid the latching of erroneous information,
the enable pulse rise time should not exceed 200
nanoseconds. Using the enable pulse width and data
setup and hold times listed in the Recommended
Operating Conditions allows data to be clocked into an
array of displays at a 6,7MHz rate.
These displays may be mounted by soldering directly to a
printed circuit board or inserted into a socket. The leadto-lead pin spacing is 2.54mm (0.100 inch) and the lead
row spacing is 15.24mm (0.600 inch). These displays may
be end stacked with 2.54mm (0.100 inch) spacing between
outside pins of adjacent displays. Sockets such as Augat
324-AG2D (3 digits) or Augat 50S-AGSD (one digit, right
angle mounting) may be used.
The primary thermal path for power dissipation is through
the device leads. Therefore, to insure reliable operation up
to an ambient temperature of +100°C, it is important to
maintain a case-to-ambient thermal resistance of less
than 35°C/watt as measured on top of display pin 3.
The blanking control input on the 4N54 display blanks
(turns off) the displayed hexadecimal information without
disturbing the contents of display memory. The display
is blanked at a minimum threshold level of 3.5 volts. This
may be easily achieved by using an open coliectorTTL gate
and a pull-up resistor. Forexample, (1/6) 7416hexinverter
buffer/driver and a 120 ohm pull-up resistor will provide
sufficient drive to blank eight displays. The size of the
blanking pull-up resistor may be calculated from the
following formula, where N is the number of digits:
Rbi'" = (Vee - 3.5V)/[N (1.0mA)]
The decimal point input is active low true and this data is
latched into the display memory in the same fashion as
the BCD data. The decimal point LED is driven by the onboard IC.
The ESD susceptibility of the IC devices is Class A of
MIL-STO-883 or Class 2 of OOO-STD-1686 and DOOHDBK-263.
MECHANICAL
4N51-4N54 series displays are hermetically tested for use
in environments which require a high reliability device.
These displays are designed and tested to meet a helium
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv DI-15, Genesolv DE-15.
PRECONDITIONING
4N51-4N54 series displays are 100% preconditioned by 24
hour storage at 125° C.
CONTRAST ENHANCEMENT
The 4N51-4N54 displays have been designed to provide the
maximum posible ON/OFF contrast when placed behind
an appropriate contrast enhancement filter. Some
suggested filters are Panelgraphic Ruby Red 60 and Dark
Red 63, SGL Homalite H100-1605, 3M Light Control Film
and Polaroid HRCP Red Circular Polarizing Filter. For
further information see Hewlett-Packard Application Note
1015.
'JEDEC Registered Data.
7-185
Solid State Over Range Display
For display applications requiring a ±, 1, or decimal point designation, the 4N53 over range display is available: This
display module comes in the same package as the 4N51-4N54 series numeric display and is completely compatible with it.
package Dimensions *
r----------
.,
I
I
NUMERAL ONe
'oleIC
----------~
M~S
PUIS
1
...
I
I
I
I
'S.ATING
PLANE
I
t
0.3 :to,na!yp,
I
(.012:1;.-003)
.,
1..-
...L..f"~=-+
---.,
-
---,,2" ----;;4
",,"
FRONT
f
I
---'
Figure 9. Typical Driving Circuit.
TRUTH TABLE
PIN
CHARACTER
REAR
liP STANDARD MARKING
PIN
FUNCTION
2·
3
Numeral One
Numeral One
1. DIMENSIoNS IN MIUIMETIIES ,.,.0 UNCHE'~
2. UNLESSDTHERwtSESl'El:1FIED. TH£ TOLEAANCE
ON ALL DIMENSIONS 1$ '.38 MM Ct .0'16 INCHEII.
4
CP
Open
6
Open
8
Mmus'l"'lus
2,3
4
8
H
X
X
H
H
X
H
X
L
L
1
X
X
X
X
H
X
BI~nk
L
L
+
-
Plu.
Nmll&
1
L
X
NOTES: L: Line switching transistor in Figure 9 cutoff.
H: Line switching transistor in Fig'ure 9 saturated.
X:· 'Don't care'
Electrical/Optical Characteristics *
4N53 (TA = -SS"C to +100°C, Unless Otherwise Specified)
DESCRIPTION
SYMBOL
Forw81d 1I00tage per LEO
Power dissipetlon
TEST CONDITIONS
'F=10mA
IF-IOmA
all diodes lit
IF-SmA
Tc ~25"C
Tc "250(:
TC=250 (;
IIF
PT
.
Luminous Intensity per LEO (digit average 1
Iv
~peak
Peak wavelength
Dominant Wav.length
Ad
MIN
40
Weight**
Recommended Operating
Conditions *
4,6
5.0
5.0
6.6
10
NOTE:
LED current must be extern.allylimited. Refer to Figure 9
for recommended resistor values.
'JEDEC Registered Data. "Non Registered Data.
tvP
MAX
UNIT
1.6
2.0
V
280
320
mW
85
!it:d
855
640
nm
nm
1.0
gm
Absolute Maximum Ratings *
V
rnA
SVMBOL MIN. MAX. UNIT
·65 +125 ·c
TS
·C
Operating temperature, ambient
-55 +100
TA
Forward currellt, each t..ED
10
rnA
IF
Reverse \loltege, each LeO
4
V
VA
DESCRIPTION
Storege temperature, ambient
7-186
High Reliability Testing
PART MARKING SYSTEM
Two standard reliability testing programs are available.
The military program provides QPL parts that comply to
MIL-D-87157 Quality Level A, per Tables I, II, lila, and IVa.
A second program is an HP modification to the full
conformance program and offers the 100% screening
portion of Level A, Table I, and Group A, Table II. In
addition, a MIL-D-87157 Level S equivalent testing program is available upon request.
With T,!~.!'ls I,
II, ilia and IVa
With Table I
and II
Standard Product
PREFERRED PART NUMBER SYSTEM
4N51
4N52
4N54
4N53
4N51TXV
4K!52TXV
4N54TXV
4N53TXV
M87157/00101ACX
M87157/00102A0X
M87157/00103ACX
M87157/00104ACX
100% Screening
TABLE L
QUALITY LEVEL A OF MIL-D-87157
MtL-STD-750
Method
Test Screen
Conditions
1. Precap Visual
2072
Interpreted by HP Procedure 5956-7572-52
2. High Temperature Storage
1032
TA
3. Temperature Cycling
1051
Condition S, 10 Cycles, 15 Min. Dwell
=125
0
C, Time
= 24 hours
4, 0onstan! Acceleration
2006
10,000 G's at Y1 orientation
5. Fine Leak
1071
Condition H
6. Gross Leak
1071
Condition C
7. Interim Electrical/Optical Testsl 2 1
8. Burn-lnl l • 31
-
lv, Icc, ISL, IBH, IEL, IEH, hL. and IIH
TA =25°0
Condition S at Vee = 5V and cycle
through logic at 1 character per second,
TA = 100°0, t"" 160 hours
1015
-
9. Final Electrical Tesll:!l
10. Delta Determinatlons
11. External Visua" 11
Same as Step 7
ulv =: -20%, ulce = ± 10 mA, uliH = ±lOIlA
and ulEH = ±13 pA
2009
Notes:
1. MIL-STD-883 Test Method applies.
2. Limits and conditions are per the electrical/optical characteristics.
3. Burn-in for the over range display shall use Condition B at a nominal IF
minimum.
=8 rnA per LED,
with all LEOs illuminated for t
=160 hours
TABLE II
GROUP A ELECTRICAL TESTS - MIL-D-87157
Tesl
Subgroup 1
DC Electrical Tests at 25°0 111
Parameters
LTPD
lv, Icc, ISL, ISH, IEL, IEH, ilL, and hH and
visual1unction, TA = 25'C
5
Subgroup 2
DC Electrical Tests at High
Temperaturei 11
Same as Subgroup 1, except delete Iv and visual
function. TA=+100'C
7
Subgroup 3
DC Electrical Tests at Low
Temperaturel 11
Same as Subgroup 1, except delete Iv and visual
function. TA"" -55" C
7
Subgroup 7
Optical and Functional Tests at 25¢C
Satisfied by Subgroup 1
5
SubgroupS
External Visual
MIL-STD-8S3, Method 2009
7
Subgroup 4, 5, and 6 not applicable
1. Limits and conditions are per the electrical/optical characteristics.
7-187
TABLE lila
GROUP B, CLASS A AND B OF MIL-D-87157
Test
Subgroup 1
MIL-STO-7S0
Method
Conditions
Resistance to Solvents
1022
Internal Visual and
Design Verification!11
20751 7 ]
Sample Size
4 Devices!
o Failures
1 Devicei
o Failures
Subgroup 2[2,3)
Solderability
2026
T A = 245" C for 5 seconds
LTPD= 15
1051
1021
1071
1071
Condition 61,15 Min. Dwell
LTPD"'15
Subgroup 3
Thermal Shock (Temp. Cycle)
Moisture Aesistance[4]
Fine Leak
Gross Leak
Electrical/Optical Endpointsl51
Condition H
Condition C
lv, Icc. IBL. IBH. IEL. IEH. ilL. IIH and
visual function. TA '" 25"C
-
$ubgroup4
Operating Ufe Test (340 hrs.}16]
Electrical/Optical Endpointsl 5]
1027
-
TA'" +100°C at Vee'" 5.0V and
cycling through logic at 1 character
per second.
Same as Subgroup 3.
LTPD= 10
TA=+125°C
LTPD = 10
SubgroupS
Non-operating (Storage) Ufe
Test (340 hrs.J
Electrical/Optical Endpoints l51
1032
-
Same as Subgroup 3
Notes:
1. Visual inspection performed through the display window.
2. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
3. The LTPO applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of
leads required.
4. Initial conditioning is a 15' inward bend, one cycle.
S. Limits and conditions are per the electrical/optical characteristics.
6. Burn-in for the over range display shall use Condition B at a nominal IF = 8 mA per LED, with all LEOs illuminated for t = 160 hours
minimum.
7. Equivalent to MIL-STO-883, Method 2014.
7-188
TABLE IVa
GROUP C, CLASS A AND B OF MIL-D-87157
Test
MIL.STO:750
Method
Conditions
Subgroup 1
Physical Dimensions
2066
Subgroup 2[2,7,9]
Lead Integrity
2004
Condition 82
Fine Leak
Gross Leak
1071
1071
Condition H
Condition C
2016
1500G, Time = 0.5 ms, 5 blows in
each orientation Xl, Yl, Zl
Subgroup 3
Shock
Vibration, Vari,able Frequency
Constant Acceleration
External Visuall 4 1
Electrical!Optical Endpoints[8}
2 Devices!
o Failures
LTPD= 15
2056
2006
1010 or 1011
-
LTPD'" 15
10,000G at Yl orientation
lv, Icc, ISL, ISH, IEL, IEH, ilL, hH and visual Function, TA = 25° C
Subgroup 4[1,31
Salt Atmosphere
External Visuall 4 1
1041
1010 or 1011
Subgroup 5
Bond Strengthl 5 )
2037
Condition A
1026
TA=+100°C
Same asSubgroup 3
Subgroup 6
Operating Life Test( 6 )
Electrical/Optical Endpointsl 81
Sample
Size
LTPD= 15
LTPD'" 20
(C=O)
A= 10
-
1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The L TPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C Life Test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics.
9. Initial conditioning is a 15' inward bend, three cycles.
7-189
Flifl'l
HERMETIC, NUMERIC AND HEXADECIMAL
DISPLAYS FOR MILITARY APPLICATIONS
HEWLETT
a!~ PACKARD
HIGH EFFICIENCY RED
LOW Power
High Brightness
YELLOW
High Performance GR.EEN
HDSp·078X/078XTXV /078XTXVB
HDSP-079X/079XTXV /079XTXVB
HDSP-088X/088XTXV /088XTXVB
HDSP-098X/098XTXV/098XTXVB
Features
• CONFORM TO MIL-D-87157, QUALITY LEVEL A
TEST TABLES
• TRUE HERMETIC PACKAGE FOR HIGH
EFFICIENCY RED AND YELLOW[lj
• TXV AND TXVB VERSIONS AVAILABLE
• THREE CHARACTER OPTIONS
Numeric, Hexadecimal, Over Range
• THREE COLORS
High Efficiency Red, Yellow,
High Performance Green
• 4 x 7 DOT MATRIX CHARACTER
• HIGH EFFICIENCY RED, YELLOW, AND HIGH
PERFORMANCE GREEN
• TWO HIGH EFFICIENCY RED OPTIONS
Low Power, High Brightness
The hermetic HDSP-078X,-079X/-088X displays utilize a
solder glass frit seal. The HDSP-098X displays utilize an
epoxy glass-to-ceramic seal. All packages conform to the
hermeticity requirements of MIL-D-87157, the general specification for LED displays. These displays are designed
for use in military and aerospace applications.
• PERFORMANCE GUARANTEED OVER
TEMPERATURE
The numeric devices decode positive BCD logic into
characters "0-9", a "-" sign, decimal point, and a test
pattern. The hexadecimal devices decode positive BCD
logic into 16 characters, "0-9, A-F". An input is provided on
the hexadecimal devices to blank the display (all LEOs off)
without losing the contents of the memory.
• HIGH TEMPERATURE STABILIZED
• GOLD PLATED LEADS
• MEMORY LATCH/DECODER/DRIVER
TTL Compatible
• CATEGORIZED FOR LUMINOUS INTENSITY
Description
The over range device displays "±1" arid right hand
decimal point and is typically driven via external switching
transistors.
These solid state displays have a 7.4 mm (0.29 inch) dot
matrix character and an onboard IC with data memory
latch/decoder and LED drivers in a glass/ceramic package.
Note:
1. The HDSP-098X high performance green displays are epoxy
sealed and conform to MIL-D-87157 hermeticity requirements.
Devices
Part Number
HDSP·
0781/0781 TXV/0781 TXVB
0782/0782TXv/0782TXVB
0783/0783TXV/0783TXVB
0784/0784TXV/0784TXVB
0791/0791 TXV/0791 TXV B
0792/0792TXV/0792TXVB
0783/0783TXVI0783TXVB
0794/0794TXVI0794TXVB
0881 /0881TXV10881 TXV B
0882/0882TXv/0882TXVB
0883/0883TXv/0883TXVB
0884/0884TXV10884 TXVB
0981/0981 TXVl0981 TXVB
0982/0982TXVl0982TXVB
0983/0983TXVl0983TXVB
0984/0984TXVlO984TXVB
Color
Description
Front
View
High-Efficiency Red
Low Power
Numeric, Right Hand D?
Numeric, Left Hand D?
Over Range ±1
Hexadecimal
A
B
C
0
Numeric, Right Hand DP
Numeric, Left Hand OP
Over Range ±1
Hexadecimal
A
High-Efficiency Red
High Brightness
Yellow
Numeric, Right Hand DP
Numeric, Left Hand DP
Over Range ±1
Hexadecimal
B
C
D
High Performance
Green
Numeric, Right Hand D?
Numeric, Left Hand DP
Over Range ±1
Hexadecimal
A
B
C
0
7-190
B
C
0
A
-
.~----~-----
--------_._--- - - - -
package Dimensions
FRONT VIEW A
FRONT VIEW D
PIN
HEXA,
NUMERIC
DECIMAL
Input 2
Inp,yt 2
Inpul4
Input 4
Input 8
Inp~t
Ori'dmal
Blanking
control
ppint
REAR VIEW
5
6
7
SlOE VIEW
8
LUMINOUS
INTENSITY
CATEGORY
DATE CODE
PIN 1 KEY
4
3
2
IT
15.2
(.6001
I
~O'10'
~
"-- SEATING
PLANE
1
0.3 .t 0.08 TVP.
(0.12.t 0.003)
/l~~H-+
-I r-
END VIEW
38
\
I
~
I
I
Typ.jD~
1.3
(.0501
Latch
~nable
Ground
Ground
Vee
Vee
jnput 1
Input 1
1. Dimensions in millimetres and (inches).
2. Unless otherwise specified, the tolerance
on all dImensIons IS ± 38 mm (± 015").
3 Digit center line is :±-.25 mm (±.01")
from package center line.
4 Lead material is gold plated
5 Color code for HDSP·088X/·098X senes
{~~,
~
3.4
TI('1~51
_
Laten
en
I
~J±
ENABLE
l
l
H
DEC".AL
,',
i
J.
L
L
-"2!
I
"
I
.
,
1
,',
,
~",
'''.
(BLANKI
.':;'
i.
l
IBLANK!
H
,,,
L
IBLANKI
H
(BLANKl
ON
+.
1"
VDp " L
OFF
VO? ~ H
LOAD DATA
V,
~
LATCH DATA
V,
~H
DISPLAY-ON
V,
" L
DISPLAY·OFF
VB • H
l
Notes:
1. H'" Logic High; L '" Logic Low. With the enable input at logic high
changes in BCD input logic levels have no effect upon display
memory, displayed cha;acter, or DP.
2. The decimal point input, DP. pertains only to the numeric displays.
3. The blanking control input, S, pertains only to the hexadecimal
displays. Blanking input has no effect upon display memory.
LED
MATR(X
GROUND
Figure 2. Logic Block Diagram
7-191
B
Absolute Maximum Ratings
Symbol
Min.
Max.
Unit
Storage temperature. ambient
T,
-65
QC
Operating temperature, ambient \'
Supply voltage
T,,\
-55
+125
+100
Vee
-0,5
+7,0
V
VI,VDP,Vr
-0,5
V('(
V
V~
-0,5
V('c
V
260
°C
Description
:2:
Voltage applied to input logic, dp and enable pins
Voltage applied to blanking input l2 !
Maximum solder temperature at 1,59mm (.062 Inch)
below seating plane; t to;;: 5 seconds
°C
Recommended Operating Conditions
Desorlptlon
Symbol
Supply Voltage 2
Operating temperature, ambient Y
Min.
Vcc
T,,\
4.5
-55
Nom.
Max.
5.0
5,5
+100
Unit
V
"C
tv.
100
nsec
Time data must be held before positive tranSition
of enable line
tSEn~
50
nsec
Time data must be held after positive transition
of enable Une
hlOLl)
50
Enable Pulse Width
Enable pulse rise time
Optical
HDSP·078X
Series
HDSP-079X
Series
HDSP·OB8X
S~Hies
. HDSP-098X
Series
Description
1.0
msec
Max.
Unit
s.ov
Characteristics at TA
Device
nsec
till!
Symbol
Min.
Typ,
65
140
~typerLED
,41
Iv
Peak Wavelength
Dominant Wavelength[5J
/l.PEAK
635
A"
626
L~
JD'
,
Iv
260
620
Mcd
~
Mcd
Peak Wavelength
APEAK
635
nm
Dominant Wavelength(5]
/l.d
626
nm
Luminous Intensity per LED
,Digit Average)[3.4j
Iv
490
Mcd
Peak Wavelength
APEAK
583
nm
Dominant Wavelength(5,6)
/1.0
585
nm
Luminous Intensity per LED
(Digit Average) 13 ,4)
Iv
1100
!,cd
Peak Wavelength
ApEAK
568
nm
Dominant Wavelength
Act
574
nm
215
298
Notes:
1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is ROJA =50'C/W/device.
The device package thermal resistance is ROJ-PIN = 15'C/W/device. The thermal resistance device pin-to-ambient through the PC
board should not exceed 35°C/W/device for operation at TA = +100°C,
2. Voltage values are with respect to device ground, pin 6.
3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back of the
display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.
7-192
Electrical Characteristics; (TA = _55° C 10 +100° C)
Description
,
Supply
Current
HDSP-078X Series
HD13P-079XI-088X/
-098X Series
HDSpc078X Series
Power
,.. Di~~ipation
HD$P-079l-- -
#4
'8
RT
R3
-=-
-~
-
-;,'"
R3
-=-
Figure 3. Typical Driving Circuit
-=-
__..1
~~~~~-
---------------
~~--
Recommended
operating Conditions
Luminous Intensity Per LED
(Digit Averagel at TA = 25°C
Device
HDSP-D783
HDSP-0883
HDSP-0983
Tesl contillion;
IF-2!8"mA
IF '" 8 mA
IF S mA
liif8)ilA
Min.
65
T9p~
140''''
620
215
298
~
490
Units
,ued
/led
,ucd
Oevice
HDSP-0883
HDSP-0983
Device
Low Power
HDSP-0783 High
Brightness
HDSRc0883
HQse;0983
1100 ''''i!i;d
Electrical Characteristics ITA = -55
HDSP-0783
Descrlplion
Power Dissipation
lall LEOs Illuminated)
---~~-------~-------~~-
0
1300
200.
8
360
47
68 ,. .
8
8
360
360
36
30
56
43
Tesl"Condition
Min.
Pr
Power Dissipation
(all LEOs Illuminated)
Pr
Forward Voltage per LED
VF
Power Dissipation
(all LEOs illumi'1ated)
Pr
Forward Voltage per LED
VF
Typ.
= 2.8 mA
IF = 8 mA
,;)00
224
IF
= 2.8 mA
1.6
IF
= 8 mA
"Max.
Units
282
mW
72
IF
VF
Ri.$I~tSFValue
C to +100 0 C)
Symbol
Forward Voltage
per LED
Vcc = 5.0V
Forward
Current Per
LED, mA
2.8
1.75
2.2
237
282
V
mW
IF = 8 mA
=8 mA
V
2.2
1.90
IF
243
282
1.85
2.2
mW
V
High Reliability Testing
PART MARKING SYSTEM
Two standard reliability testing programs are available.
The TXVB program is in conformance with Quality Level A
Test Tables of MIL-D-87157 for hermetically sealed displays
with 100% screening tests. A TXVB product is tested to
Tables I, II, Ilia, and IVa. A second program is an HP
modification to the full conformance program and offers
the 100% screening portion of Level A, Table I, and Group
A, Table II.
100% Screening
With Table I
and"
HDSP-078XTXV
Standard Product
HDSP-078X
HDSP-079X
HDSP-088X
HDSP-098X
HDSP-079XTXV
HDSP-088XTXV
HDSP-098XTXV
With Tables I,
ii, ilia and IVa
HDSP-078XTXVB
HDSP-079XTXVB
HDSP-088XTXVB
HDSP-098XTXVB
TABLE I. QUALITY LEVEL A OF MIL-D-87157
Teat Screen
M1L-STD-750
Method
Conditions
1. Precap Visual
2072
Interpreted by HP Procedure 5956-7572-52
2. High Temperature Storage
1032
TA
3. Temperature Cycling
1051
Condition B, 10 Cycles, 15 Min. Dwell
1250 C, Time
at Y1
4. Constant Acceleration
2006
10,000 G
5. Fine Leak
1071
Condition H
6. Gross Leak
1071
Condition C
7. Interim Electrical/Optical Testsl 2 1
8. Burn-lnll,31
1015
= 24 hours
orientation
lv, Icc, ISL, ISH, IEL. iEH, IlL, and hH
TA =: 25°C
Condition B at Vee"" 5V and cycle
through logiC at 1 character per second.
TA 1000 C, t '" 160 hOurs
=
9. Final Electrical Testl 2 1
10. Delta Determinations
11. External Visuali 11
-
Same as Step 7
-
j,lv -20%, ..lIce = ± 10 rnA, ..lIiH
and ..lIEH = ±13 j.lA
=
=±10j.lA
2009
Noles:
1. MIL-STD-883 Test Method applies.
2. Limits and conditions are per the electrical/optical characteristics.
3. Burn-in for the over range display shall use Condition B at a nominal IF = 8 mA per LED, with all LEDs illuminated for T = 160 hours
minimum.
7-195
TABLE II
GROUP A ELECTRICAL TESTS - MIL-D-87157
Test
Parameters
SUbgroup 1
DC Electrical Tests at 25"C 1,
LTPD
Iv. Icc. ISl. ISH. tSl.ISH, Ill. and hH and
visual function, T A"" 25" C
5
Subgroup 2
DC Electrical Tests at High
Temperature;l,
Same as Subgroup 1. except delete Iv and visual
function. TA'" +100·C
7
Subgroup 3
DC Electrical Tests at Low
Temperaturel1 ,
Same as Subgroup 1, except delete Iv and visual
function. T A '" -55" C
7
Subgroup 7
Optical and Functional Tests at 25·C
Satisfied by Subgroup 1
5
Subgroup 8
External Visual
MIL-STD-SS3, Method 2009
7
SUbgroup 4, 5, and 6 not applicable
Notes:
1. Limits and conditions are per the electrical/optical characteristics.
TABLE lila
GROUP B, CLASS A AND B OF MIL-D-87157
Tnt
Subgroup 1
Resistance to Solvents
Internal VIsual and Design
Verification!!]
Subgroup 2[2.31
Solderability
Subgroup 3
Thermal Shock (Temp. Cycle)
MOisture Resistance[4j
Fine Leak
Gross Leak
Electrical/Optical Endpointst51
Subgroup 4
Operating Life Test (340 hrs.)l6)
Electrical/Optical Endpoints!5)
SubgroupS
Non-operating (Storage) Life
Test (340 hrs.1
Electrical/Optical Endpoints[5]
MIL-STD-7SO
Method
Conditions
4 Devices/
o Failures
1 Device/
Failures
1022
2075(1)
2026
1051
1021
1071
1071
Sample Size
o
ITA == 245· C for 5 seconds
LTPD= 15
I Condition 81, 15 min. Dwell
LTPD=15
Condition H
Condition C
Iv. Icc. ISL., ISH. IEL. ISH, ilL, hH and
visual function. TA == 25°C
-
1027
1032
-
TA"" +100°C at Vee" 5.0V and
cycllng through logic at 1 character
per second.
Same as Subgroup 3.
LTPO=10
TA=+125·C
LTPO=10
Same as Subgroup 3
Notes:
,
t. Visual inspection performed through the display window.
2. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
3. The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of
leads required.
4. Initial conditioning is a 15° inward bend, one cycle.
5. Limits and conditions are per the electrical/optical characteristics.
6. Burn-in for the over range display shall use Condition B at a nominal IF ± 8 rnA with '+' illuminated for t = 160 hours.
7. Equivalent toMIL-STD-883, Method 2014.
7-196
TABLE IVa
GROUP C, CLASS A AND B OF MIL-D-87157
Test
MIL-STO-750
Method
Conditions
Sample
Size
Subgroup 1
Physical Dimensions
2066
2 Devices/
o Failures
Subgroup 2[2.7.9)
'LTPD = 15
Lead Integrity
2004
Condition B2
Fine Leak
Gross Leak
1071
1071
Condition H
Condition C
2016
1500G. Time = 0.5 ms. 5 blows in
each orientationX,. Y,.Z1
Subgroup 3
Shock
Vibration. Variable Frequency
C,onstant Acceleration
External Visuall 4J
Electrical/Optical Endpointsl 8 ]
2056
2006
1010 or 1011
-
LTPD=15
10.000G at Y1 orientation
Iv. Icc. ISl. ISH. IEL, IEH. IlL. IIH and visual Function. TA =0 25° C
Subgroup 4£1.3]
Salt Atmosphere
Extemal Visuall 4 1
1041
1010 or 1011
LTPD = 15
Subgroup 5
Bond Strength[51
Subgroup 6
Operating Life Testl 6 1
Electrleal/Optical EndpointslSI
2037
Condition A
1026
TA=+100°C
Same as Subgroup 3
LTPD= 20
(C=O)
A= 10
-
Notes:
1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C Life Test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpOint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics.
9. Initial conditioning is a 15° inward bend, 3 cycles.
7-197
F/in-
FOUR CHARACTER
RED ALPHANUMERIC
DISPLAY FOR EXTENDED
TEMPERATURE APPLICATIONS
HEWLETT
a.!~ PACKARD
HDSP-2010
HDSp·2010TXV
HDSP-2010TXVB
Features
• OPERATION GUARANTEED TO T A = ·40°C
• LEAK RATE GUARANTEED
• TXVB VERSION CONFORMS TO MIL·D·87157
QUALITY LEVEL A TEST TABLES
• GOLD PLATED LEADS
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
• CERAMIC 7_S2mm (.3 in.) DIP
Integral Red Glass Contrast Filter
• WIDE VIEWING ANGLE
• END STACKABLE 4 CHARACTER PACKAGE
• PIN ECONOMY
12 Pins for 4 Characters
• TTL COMPATIBLE
• 5 x 7 LED MATRIX DISPLAYS FULL ASCII
CODE
• RUGGED, LONG OPERATING LIFE
• CATEGORIZED FOR LUMINOUS INTENSITY
Assures Ease of Package to
Package Brightness Matching
Description
The HDSP-2010 display is designed for use in
applications requiring high reliability. The character font
is a 3.8mm (0.15 inch) 5 x 7 red LED array for displaying
alphanumeric information. The device is available in 4
character clusters and is packaged in a 12-pin dual-in-line
type package. An on-board SIPO (serial-in-parallel-out)
7-bit shift register associated with each digit controls
constant current LED row drivers. Full character display is
achieved by external column strobing. The constant
current LED drivers are externally programmable and
typically capable of sinking 13.5mA peak per diode.
Applications include interactive I/O terminals, avionics,
portable telecommunications gear, and hand held
equipment requiring alphanumeric displays.
PIN
I
r-l
I
I
I
L
I
, +--t
"
/
I
~
__ 4.44·
PIN 1 MARKED BY
DOT ON $ACK OF
I
L
.1~
2
I
r-,
I
I
H-l -3 +--t " I
I
I
I
I
I
~
.
r-j
I
1___
I
L_~
(.;461
,
L_~
7
COLUMN 3
6 --
INT. CONNECT"
FUNCTION
DATA OUT
-.• ~~-10
"
I 12
~~~~~DDATA IN
"DO NOT CONNECT OR USE
!
L 175· .0051
'
--+
r~~~~t;~~
1.200)
~
-'-_- - .-
NOTES~
1. OtMI:NS*ONS tN nil'rl Hnc;hesl.
Z. t)NLESSOTHERWfS€ SPECiFtEOTHE
~
TOLEAANcE ON Al.l nlM"ENSIONS
l$!.3B mm (!.o-iS")
3. LEAD MATeRtAt 1$ 001..0 PLATE(!COj;lPER ALLOY.
Sl:ATING
PLANE
(,050;·
PIN
_
3
-1.-~OLUM!'l ~
5 __ t .cOLUMN 5
3.7
PACKAGe.
1.27
FUNCTION
~~MN'
----i-2
COLUMN 2
4. CHA~ACTERS ARE:: CENTEREO
_I
I
-I
I
WITH RESPECT to LEAO$ WITHIN"
'.13mm h,OOS").
2.54t,1$tY-p,
.......... U{)O t.005J
NON ACCUM,
7-198
Absolute Maximum Ratings
~
Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB ................ -0.5V to Vee
Column Input Voltage, VeOL .......... -0.5V to +6.0V
Free Air Operating Temperature
Range, T.P........................ -40°C to +85°C
Storage Temperature Range, Ts ..... -55°C to +100°C
Maximum Allowable Power Dissipation
atT A =25°C",2." ......•..........•....... 1.29 Watts
Maximum Solder Temperature 1.59mm (.063")
Below Seating Plane t<5 secs •.............. 260°C
Recommended Operating Conditions
Symbol
Parameter
Supply Voltage
Data Out Cu rrent. Low State
Data Out Current. HighState
Column Input Voltage. Column On
Min.
4.75
Vee
Max.
5.25
10L
1.6
lou
-0.5
t5etlJp
fclod:.
ns
ns
ns
0
3
MHz
ns
200
85
hHL
-40
TA
V
45
30
75
0
thold
tw(Clo.:k)
Units
V
mA
mA
3.5
2.6
70
VCOL
Setup Time
Hold Time
Width of Clock
Clock Frequency
Clock Transition Time
Free Air Operating Temperature Range
Nom.
5.0
°C
Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified.)
Description
Supply Current
Column Current at any Column Input
Symbol
Icc
leOl
Column CUrrent at any Column Input
Icol
Peak Luminous Intensity per LEDI3.71
IvPEAK
! Character Average)
VB. Clock or Data Input Threshold High
V,H
VB. Data Input Threshold Low
V,l
Clock Threshold Low
V'l
Input Current Logical 1
VB, Clock
IIH
Data In
IiH
Input Current Logical 0
VB. Clock
III
Data In
III
VOH
Oat, Out Voltage
VOL
Power Dissipation Per Package"
Peak Wavelength
Dominant Wavelength l51
Thermal Resistance IC
J unction-to-Case
Leak Rate
Test Conditions
Vee - 5.25V
VClOCK = VOATA = 2.4V
All SR Stages =
Logical 1
Vee - 5.25V
VCOl = 3.5V
All SR Stages = Logical 1
Typ.'
Max.
Units
VB = OAV
Min.
45
60
mA
VB
= 2.4V
73
95
mA
VB
= OAV
= 2.4V
500
I"A
350
435
mA
VB
Vee - 5.0V. Veol - 3.5V
T, = 25° CI41 VB = 2.4V
105
200
I"cd
2.0
Vee = Veol
4.75V
Vee = 5.25V, VIH
= 2.4V
Vee = 5.25V, V,l
= OAV
Vee - 4.75V. IOH - -0.5mA. VeOl - OV
Vec - 4.75V, IOl - 1.6mA, VCOL - OV
Vce - 5.0V, VeOl = 3.5V 17.5% OF
15 LEOs on per character. VB = 2.4V
20
10
-500
-250
204
0.8
0.6
80
40
-800
-400
304
0.2
0.4
V
V
V
I"A
flA
I"A
I"A
V
V
.74
W
Ad
655
640
ROJ-c
25
nm
nm
°C/WI
Device
Po
APEAI(
5x10- 7
ccls
·AII typical values specified at Vee = S.OV and TA = 25°C unless othefWise noted.
··Power dissipation per package with 4 characters illuminated.
1. Operation above 85°C ambient is possible provided the following conditions are met. The junction temperature should not exceed 1250 C
TJ and the case temperature as measured at pin 1 or the back of the display should not exceed 10QoC Te.
2. The device should be derated linearly above 50° Cat 16.7 mW JOC. This derating is based on a device mounted in a socket having a thermal
resistance from case to ambient at 35° C/W per device. See Figure 2 for power deratings based on a lower thermal resistances.
3. The characters are categorized for Luminous Intensity with the category designated by a letter code on the bottom of the
package.
4. Ti refers to the initial case temperature of the device immediately prior to the light measurement.
.\d, is derived from the CIE chromaticity diagram, and represents the single wavelength which defines the color
of the device.
S. Maximum allowable dissipation is derived from Vee = Va = 5.25 Volts, VeOl = 3.5V, 20 LEOs on per character, 20% OF.
7. The luminous stearance of the LED may be calculated using the following relationships:
5. Dominant wavelength
lv (cd/m') =" (Candela/A (Metre)'
l, (Footlamberts) = 71'1, (Candela)/A (Foot)'
A = 5.3 x 10-8 M2 = 5.8 x 10-7 (Foot)2
7-199
3M Light Control Film (louvered filters). OCLI Sungard
optically coated glass filters offer superior contrast
enhancement.
Post solder cleaning may be accomplished using water,
Freon/alcohol mixtures formulated for vapor cleaning
processing (up to 2 minutes in vapors at boiling) or
Freon/alcohol mixtures formulated for room temperature
cleaning. Suggested solvents: Freon TF, Freon TE,
Genesolv 01-15, Genesolv DE-15.
Electrical Description
The HDSP-2010 display provides on-board storage of
decoded column data and constant current sinking row
drivers for each of 28 rows in the 4 character display. The
device consists of four LED matrices and two integrated
circuits that form a 28-bit serial input-parallel output
(SIPO) shift register, see Figure 5. Each character is a
5 x 7 diode array arranged with the cathodes of each row
connected to one constant current sinking output of the
SIPO shift register. The anodes of each column are
connected together, with the same column of each of the
4 characters connected together (i.e. column 1 of all four
characters are connected to pin 1). Any LED within any
character may be addressed by shifting data to the
appropriate shift register location and applying a voltage
to the appropriate column.
Condition Min. Typ. Max. Units
Parameter
fcloCk
CLOCK Rate
tPLH. tPHL
Propagation
delay CLOCK
to DATA OUT
C L := 15pF
Rl.=2.4KD
3
MHz
125
ns
Figure 1. Switching Characteristics. (Vee = 5V,
TA = -4:l°C to +70'C)
Mechanical and
Thermal Considerations
The HDSP-201 0 is available in a standard 121ead ceramicglass dual in-line package. It is designed for plugging into
DIP sockets or soldering into PC boards. The packages
may be horizontally or vertically stacked for character
arrays of any desired size.
The HDSP-2010 can be operated over a wide range of
temperature and supply voltages. Power reduction can be
achieved by either decreaSing VCOl or decreasing the
average drive current through pulse width modulation
of VB.
The· HDSP-2010 display has a glass lens. A
front panel contrast filter is desirable in most actual
display applications. Some suggested filters are Panel
graphic Ruby Red 60, SGL Homalite H100-1605 Red and
1.6
a:E
~~
:I'
1.4
x
~
3.0
-.....
-
1. 2
~2 1.o - R&JA" 6O"CIW
":§~.... o.B_1 R$J~ '" 5~"C,w/
i~
,
'"V><'"
\
10
W
~
~
~
!i...
w
1. 0
~ .....
a:
O
-60
-40
-20
20
r--....
40
t'- t -
60
TA - AMBIENT TEMPERATURE
Electrical Description
Display Internal Block Diagram
Figure 1 shows the internal block diagram for the
HMDl-2416 display. The CMOS IC consists of a four-word
ASCII memory, a four-word cursor memory, a 64-word
character generator, 17 segment drivers, four digit drivers,
and the scanning circuitry necessary to multiplex the four
monolithic lED characters. In normal operation, the divideby-four counter sequentially accesses each of the four RAM
locations and simultaneously enables the appropriate display digit driver. The output of the RAM is decoded by the
character generator which, in turn, enables the appropriate
display segment drivers. For each display location, the cursor enable (CUE) selects whether the data from the ASCII
RAM (CUE = OJ or the stored cursor (CUE = 1) is to be
displayed. The cursor character is denoted by all sixteen
segments and the DP ON. Seven-bit ASCII data is stored in
RAM. Since the display utilizes a 64-character decoder, half
of the possible 128 input combinations are invalid. For each
display location where Os = De in the ASCI,I RAM, the display character is blanked. The entire display is blanked
when Bl=O.
Data is loaded into the display through the data inputs
(06- Do), digi~lects (Al' AQh..chip enables (CE1, CE2,
cursor select (CU), and write (WR). The cursor select (CU)
determines whether data is stored in the ASCII RAM (CU =
1) or cursor memory (CU = 0). When CE l = CE2 = WR = 0
and CU = 1, the information on the data inputs is stored in
the ASCII RAM at the location specified by the digit
selects (Al' Ao). When CE l = CE 2 = WR = 0 and CU = 0, the
information on the data input, Do, is stored in the cursor at
the location specified by the digit selects (Al' Ao). If Do = 1,
a cursor character is stored in the cursor memory. If Do =
0, a previously stored cursor character will be removed
from the cursor memory.
If the clear input (ClR) equals zero for, one internal display
cycle (4 ms minimum), the data in the ASCII RAM will be
rewritten with zeroes and the display will be blanked. Note
that the blanking input (BLl must be equal to logical one
during this time.
80
100
-loCI
Data Entry
Figure 2 shows a truth table for the HMDl-2416 display. Setting the chip enables (CE 1, CE2) to their low state and the
cursor select (CU) to its high state will enable data loading.
The desired data inputs (06-00) and address inputs (Al'
Ao) as well as the chip enables (CE1, CE2) and cursor
select (CU) must be held stable during the write cycle to
ensure that the correct data is stored into the display. Valid
ASCII data codes are shown in Figure 3. The display
accepts standard seven-bit ASCII data. Note that 06 = 05
for the codes shown in Figure 2. If 06 = 05 during the write
cycle, then a blank will be stored in the display. Data can'
be loaded into the display in any order. Note that when Al
= Ao = 0, data is stored in the furthest right-hand display
location.
Cursor Entry
As shown in Figure 2, setting the chip enables (CE1, CE2) to
their low state and the cursor select (CU) to Its low state will
enable cursor loading. The cursor character is indicated by
the display symbol having all 16 segments and the DP ON.
The least significant data input (Do), the digit selects
(Al' Ao), the chip enables (CE1, CE2), and the cursor select
(CU) musi be held stable during the write cycle to ensure
that the correct data is stored in the display. If Do is in a
low state during the write cycle, then a cursor character
will be removed at the indicated location. If Do is in a high
state during the write cycle, then a cursor character will be
stored at the indicated location. The presence or absence
of a cursor character does not affect the ASCII data stored
at that location. Again, when Al = Ao = 0, the cursor
character is stored in the furthest right-hand display
location.
All stored cursor characters are displayed if the cursor enable (CUE) is high. Similarly, the stored ASCII data words are
displayed, regardless of the cursor characters, if the cursor
enable (CUE) is low. The cursor enable (CUE) has no effect
on the storage or removal of the cursor characters within
the display. A flashing cursor is displayed by pulsing the
cursor enable (CUE)' For applications not requiring a cursor, the cursor enable (CUE) can be connected to ground
and the cursor select (CUI can be connected to Vee. This
inhibits the cursor function and allows only ASCII data to
be loaded into the display.
7-207
CURSOR ENABLE ICUE)
CLEAR (ClR)
---
I
~
BLANK (BL)
8
+4
COUNTER
F-
10F4
DECODER
W-
DIGIT
DR.IVER
3
2
1
0
BLANK
r
Figure 1. HMDL-2416 Inlernal Block Diagram
7-208
f
Clear
Cursor
Disable
Cursor
Memory
X
I'
X
"
X
X
X
X
X
X
X
X
X
.,
.
L
L
L
X
L = LOGIC LOW INPUT
H = LOGIC HIGH INPUT
X = DON'T CARE
L
.'
L
X
X
H
L
X
H
X
L
H
L
X
X
x'
x
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
H
H
H
L
L
H
H
L
H
L
H
X
X
X
X
X
X
X
X
X
X
X
X
X.
X
H '.-.JC' 'ffJ NC NC
H ~ NC NC NC
X
L
L
X
X
X
X
X
L
L
X
X
X
r -,
c __
NC NC NC
c-, L_J
I
I
NC
NC NC
cc__,
NC I I NC NC
r-,
L_J NC NC NC
Previously Written
Cursor
"a" = ASCII CODE CORRESPONDING TO SYMBOL" R"
NC = NO CHANGE
~ = CURSOR CHARACTER (ALL SEGMENTS ONI
Figure 2a, Cursor/Data Memory Write Truth Table
Function
BL CLR CUE
CUE
H
Clear
CU
CE l
CE2
WR
L
H
X
X
X
X
X
X
X
H
H
H
H
L
X
X
X
X
X'
X
0lG3 0lG 2 olG, OIGo
R
W
.
C
B
~
,c-,
c_J
,c
c-,
c-,
,
I
~_J
-NOTE: CLR should be held low for 4 ma
fOllowing the. last WRITE cycle to ensure
all data is cleared.
Blanking
L
X
X
X
X
X
X
t_J
I
I
--"
]
W W
c-,
,c_J, L_J
r-~
,cr-,__,
c-,
U
Figure 2b. Displayed Data Truth Table
7-209
Display previously written data
Display previously written cursor
Clear data memory, cursor memory
unchanged
Blank display, data and cursor
memories Unchanged.
01
DO
0
0
0
0
0
0
0
1
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
·1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
HEX
0
1
2
3
4
5
6
7
8
9
A
B
C
°
E
F
(spacII)
03
O2
BITS
De 05 04
o
1
0
2
o
'1 .• 1
3
1
0
0
4
1
0
1
5
%& I <>
I
+
0 I 2 j Y 5 5 1 B 9
I
L
Q] R B [ 11 E F G H I J K L
P Q R 5 T U V WX Y Z [ \
I
/I
:±J
g]
*
-
/
-- ~ ?
M N 0
J
/\.
-
Figure 3. HPDL-2416 ASCII Character Set
Mechanical and Electrical
Considerations
soldering and post Solder
Cleaning Instructions for the
The HMDL-2416 is an 18 pin dual-in-line package, that can
be stacked horizontally and vertically to create arrays of
any size. The HMDL-2416 is designed to operate continuously from -55° to +100°C for all possible input conditions including the illuminated cursor in all four character
locations. The HMDL-2416 is assembled by die attaching
and wire bonding the four GaAsP/GaAs monolithic LED
chips and the CMOSIC to a 18 lead ceramic-glass dual-inline package. It is designed either to plug into DIP sockets
or to solder into PC boards.
HMDL-2416
The inputs of the CMOS IC are protected against static
discharge and input current latchup. However, for best
results standard CMOS handling precautions should be
used. Prior to use, the HMDL-2416 should be stored in
anti-static tubes or conductive material. During assembly,
a grounded conductive work area should be used. The
assembly personnel should use conductive wrist straps.
Lab coats made of synthetic materials should be avoided
since they are prone to static charge build-up. Input current latchup is caused when the CMOS inputs are subjected to a voltage either below ground (V IN < ground) or
to a higher voltage than Vee (VIN > Vee! and a high
current is forced. into the input. To prevent input current
latchup and ESD damage, unused inputs should be
connected either to ground or to Vee, voltages should not
be applied to the inputs until Vee has been applied to the
display, and transient input voltages should be eliminated.
The HMDL-2416 may be hand soldered or wave soldered
with SN63 solder. Hand soldering may be safely performed
only with an electronically temperature-controlled and
securely grounded soldering iron. For best results, the iron
tip temperature should be set at 315° C (600° F). For wave
soldering, a rosin-based RMA flux or a water soluble
organic acid (OA) flux can be used. The solder wave
temperature should be 245°C ±5~C (473°F ±9°F), and the
dwell in the wave should be set at 1 1/2 to 3 seconds for
optimum soldering.
Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is permissible. Suggested solvents include Freon TF, Freon TE,
Genesolv DI-15, Genesolv DE-15, Genesolv DES, and water.
For further information on soldering, refer to Application
Note 1027, "Soldering LED Components".
.
7-210
High Reliability Testing
optical Considerations/
Contrast Enhancement
Each HMDl-2416 display is tested for luminous intensity
and marked with an intensity category on the back of the
display package. To ensure intensity matching for multiple
package applications, all displays for a given panel should
have the same category.
Two standard high reliability testing programs are available.
The TXVB program is in conformance with Mll-D-87157
level A Test Tables. The TXVB product is tested to Tables
I, II, lila, and IVa. The TXV program is an HP modification to
the full conformance program and offers the 100% screening of Quality level A, Table I, and Group A, Table II.
The HMDl-2416 display is designed to provide maximum
contrast when placed behind an appropriate contrast enhancement filter. Some suggested filters are Panelgraphic
Dark Red 63, SGl Homalite H100-1650, Rohm and Haas
2423, Chequers Engraving 118, and 3M R6510. For further
information on contrast enhancement, see Hewlett-Packard
Application Note 1015.
Part Marking System
Standard Product
HMDL-2416
wn~ Ta~les
I, II; Ula,IVa ..!
HMDL-2416TXVB
100% Screening
Table I. Quality level A of Mll-D-87157
Test Screen
Mll-STO-750
Method
Conditions
1. Precap Visual
2072
Interpreted by HP Procedure 5956-7235-52
2. High Temperature Storage
1032
TAo'" 125'C. Time'" 24 hours
3. Temperature Cycling
1051
Condition B, 10 cycles. 15 min. dwell
4. Constant Acceleration
2006
5,000 G's at Y1 orientation
5. Fine Leak
1071
Condition H
6. Gross Leak
1071
Condition C
7. Interim Electrical/Optical Tests[2J
-
8, Burn-ln!l)
1015
Condition B at Vee'" 5.5 V
TAo "" 100'C
t 160 hours
9, Final Electrical Testl 21
-
Icc%, Icc (CU), Icc (Bl)
Ill, Iv@ Vee'" 5.0 V
TAo = 25'C
10. Delta Determinations
-
~Iec=± 10%
2Ilv= - 20%
TAo = 25'C
11. External Visual[lj
2009
Icc, Iv@Vee""5.0V
TAo'" 25°C
=
Notes:
1. MIL-STD-883 Test Method Applies
2, Limits and conditions are per the electrical optical characteristics.
7-211
Table II. Group A Electrical Tests - MIL-D-871S7
LTPD
Parameters
Subgroup/Test
SUbgroup 1
DC Electrical Tests at 25°C·1
Icc%. Icc (CU), Icc (Bl). Ifl, Iv and visual function
@Vce""S.OV
5
Subgroup 2
DC Electrical Tests at High
Temperature lT '
Same as Subgroup 1. except delete Iv and visual
function, TA =0 + 100°C
7
Subgroup 3
DC Electrical Tests at low
Temperatureill
Same as Subgroup 1, except delete Iv and visual
function, TA = -S5°C
7
Subgroup 7
Optical and Functional Tests al 25°C
Satisfied by Subgroup 1
5
Subgroups
External Visual
Mil-STD-883. Method 2009
7
Subgroup 4, 5, and 6 not applicable
Note:
1. Limits and conditions are per the electrical/optical characteristics.
Table ilia. Group B. Class A and B of MIL-D-871S7
Subgroup/Test
Subgroup 1
ReSistance to Solvents
Internal Visual and Design Verification[l]
Subgroup 2[2.31
Solderability
Subgroup 3
Thermal ShOck ITemp. Cyclel
Moisture Resistancel4 ]
Fine leak
Gross leak
ElectriCal/Optical Endpoints[5J
Subgroup 4
Operating Life Test (340 hrs.1
Electrical/Optical Endpointsl5J
SubgroupS
Non-operating ,Storagel Life
Test 1340 hrs.,
Electrical/Optical EndpointslSj
MIL-STD-7S0
Method
Conditions
Sample Size
4 Devices!
Failures
1 Device/
Failures
1022
o
2075[6J
o
2026
T A = 245 0 C for 5 seconds
lTPD= 15
1051
1021
Condition 81, 15 minute dwell
lTPD"" 15
1071
Condition H
1071
Condition C
-
lec%.lee (CU). Icc (Bl), l'l.lv
@ V cc =0 5.0 V and visual function.
TA = 25°C
1027
TA = 100°C@V ee '" 5.5 V
1032
lTPO = 10
Same as Subgroup 3
TA=+125°C
-
lTPD=10
Same as Subgroup 3
Notes:
1. Visual inspection is performed through the display window.
2. Whenever electrical/optical tests are not required as endpoints. electrical rejects may be used.
3. The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads
required.
4. Initial conditioning is a 15° inward bend for one cycle.
5. Limits and conditions are per the electrical/optical chara.cteristics.
6. Equivalent to MIL-STD-883, Method 2014.
7-212
Table IVa. Group C, Class A and B 01 MIL-D-87157
MIL-$TD-750
Method
Conditions
Subgroup/Test
Subgroup 1
Physical Dimensions
Sample Size
2066
Subgroup 2[2]
Lead IntegrityJ;; 9J
Fine Leak
Gross Leak
Subgroup 3
Shock
Vibration, Variable Frequency
Constant Acceleration
External Visual(4 )
Electrical/Optical Endpoints(8j
2 Devicesl
o Failures
2004
1071
1071
Condition B2
Condition H
Condition C
LTPD""15
2016
1500G, Time = 0.5 ms, 5 blows in
each orientation Xl, Y1, Z1
LTPD "" 15
2056
2006
1010 or 1011
-
Subgroup 4{1,3]
Salt Atmosphere
External Visual[4j
5,000 G's at Y1 orientation
Ice%, Icc (CU), Icc (BL), IlL, Iv
@Vce= 5.0 V and visual function.
TA'" 2SoC
1041
1010 or 1011
SubgroupS
Bond StrengthJ5]
2037
"
LTPD = 15
Condition A
,
SubgroupS
Operating Life TesU6]
,'~
1026
-
Electrical/Optical Endpoints[8]
TA
"'-, ,. .:.....~-,·--".i,.~"
= 100°C@Vec=5.5V
LTPD =20
,'IC ~,o,
.-
A = 10
Same as Subgroup 3
Notes:
1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The L TPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used,
4. Visual requirements shall be as specified in MIL·STD-883. Methods 1010 or 1011,
5, Displays may be selected prior to seal.
6, If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C life test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance,
7, MIL-STD-883 test method applies,
8, Limits and conditions are per the electrical/optical characteristics.
g, Initial conditioning is a 15° inward bend for three cycles.
7·213
,,-.~,-,.,.-,-.---~---------
..
--------
F/iP'W
EXTENDED TEMPERATURE
FOUR CHARACTER 5.0 mm (0.20 INCH)
5 X7 ALPHANUMERIC DISPLAY FOR
SUNLIGHT VIEWABLE APPLICATIONS
HEWLETT
a!~ PACKARD
YELLOW HDSP-2351/2351 TXV/2351 TXVB
HICH EFFICIENCY RED HDSP-2352/2352TXV/2352TXVB
HIGH PE~.F
~
uJa:
I
I-
RADIATED SPECTRUM OF
GREEN LED
T (" = 0
BELOW
530 pm
T (570 nm) = 0.11 TO 0.11
0.4
SINGLE PASS TRANSMISSION
CHARACTERISTIC
0.3
0.2
0.1
480
500
660
520
~
680
- WAVELENGTH - nm
Figure 11. Relative Transmission Characteristics for a Yellow-Green Bandpass Antireflection Coated, Circular Polarized Glass Filter for
use with the HDSP-2353 Green LED Alphanumeric Display.
t---;liI&__
RFS = 0.0025 SPECULAR
.".~,
:~R~
",H""
RS ::: 0.25 SPECULAR
AR COATING
RD = 0.25 DIFFUSE
~~~
SSI;-POLARIZER
DISPLAY
GLASS
WINDOW_i==":fJ.r==t.t====~":{
LED CHIP AND
DIE ATTACH PAD
(LED PIXEL)
DISPLAY
CERAMIC
SUBSTRATE
Figure 12. Reflectances off Surfaces of an HDSP-235X Series Display and an AR/CP Glass Filter.
7-223
..•.
---.----~
-- .... .
...... _ - - - ....•...
ID = .;'IDL2 + IDC2
IDL=4.79
ID = .;'<4.79)2 +(1.07)2
IDC=1.07
mI TRANSMISSION Y£LLOW.QREEN
FI LTER WINDOW I
~·O.255 v-Q.374
ID = 4.91
0.3
0.2
Figure 13a. Discrimination Index for the HDSP-2353 Green
LED Alphanumeric Display Combined with a
12% Transmission Yellow-Green Bandpass
AR/CP Glass Filter In Indirect 107000 Im/m2
(10,000 Ic) sunlight.
I---'H---t---f'=-;--:;-;c-t---;---i
0.1-
0.2
0.3
0.4
0.5
Figure 13c. Color Difference and Chromlnance Index
eR '" LvS + LvB + Lv F
LvB + LvF
IDL"~
CR '" 13::.3+ +452~/ 274
LOG,. 15.22)
IOL = --0.-'5--
CR '" 5.22
IDL '" 4.79
lOG10 CR
Figure 13b. Contrast Ratio and Luminance Index.
7-224
0.6
0.7
High Reliability Testing
Part Marking System
Two standard reliability testing programs are available. The
TXVB program is in conformance with MIL-D-87157 Quality
Level A Test Tables for hermetically sealed LED displays
with 100% screening tests. A TXVB product is tested to
Tables I, II, Ilia, and IVa. The TXV program is an HP
modification to the full conformance program and offers
the 100% screening of Quality Level A, Table I, and Group
A, Table II.
Standard
Product
With Table I and II
With Tables
I, II, ilia, IVa
HDSP-2351
HDSP-2352
HDSP-2353
HDSP-2351TXV
HDSP-2352TXV
HDSP-2353TXV
HDSP-2351 TXVB
HDSP-2352TXVB
HDSP-2353TXVB
100% SCreening
Table I. Quality Level A of MIL-D-87157
Test Screen
MIL-STD-750
Method
1. Precap ViSUal
2072
Conditions
Interpreted by HP Procedure 5956-7512-52
2. High Temperature Storage
1032
T A = 125° C, Time = 24 hours!3]
3. Temperature Cycling
1051
Condition B, 10 cycles, 15 min. dwell
4. Constant Acceleration
2006
10,000 G's at Y1 orientation
5. Fine Leak
1071
Condition H
6. Gross Leak
1071
Condition C
7.
Interim Electrical/Optical Tests111
-
Icc lat VB = O.4V and 2.4V), leOL (at VB =
O.4V and 2.4V I
hH IVB, Clock and Data In), IlL IVB, Clock
and Data Inl, IOH, IOL, Visual Function
and Iv Peak. VIH and Vil inputs are
guaranteed by the electronic shift
register test. T A = 25' C
8. Burn-ln!l]
9. Final Electrical Testf2]
10. Delta Determinations
1015
-
Condition B at Vee
3.5V, TA = +85° C,
= VA = 5.25V, VeOL =
LED ON-Time Duty Factor = 5%, 35 Dots
On; t = 160 hours
Same as Step 7
..lIce - ±6 mA, ...lIIH (clock I - ±10 I'A,
...lhH iData In) = ±10 I'A
...lIOH = ±10% of initial value, and
...llv = -20%, TA = 25°C
11. External Visual!1]
2009
.-
Notes:
1. MIL-STD-883 Test Method applies.
2. Limits and conditions are per the electrical/optical characteristics. The IOH and IOl tests are the inverse of VOH and VOL specified in
the electrical characteristics.
3. TA = 100' C for HDSP-2353.
7-225
~~~-~~------
..
Table II. Group A Electrical Tests - MIL-D-87157
SubgrouplTest
Parameters
Subgroup 1
DC Electrical Tests at 25°C
1
LTPD
5
Icc at VB '" OAV and 2.4V'o leal
,at VB = OAV and 2.4V,
IIH ,VB, Clock and Data In', ill Va, Clock and Data
In '. IOH, IOl Visual Function and Iv peak, VIH and Vil
inputs are guaranteed by the electronic shiJt
register test.
Subgroup 2
DC Electrical Tests at High
Temperature 1
Same as Subgroup 1, except delete Iv and visual
function, TA'" +85°C
7
Subgroup 3
DC Electrica.l Tests at Low
Temperature 11
Same as Subgroup 1, except delete Iv and visual
function, TA = -55°C
7
Subgroup 7
Optical and Functional Tests at 25°C
Satisfied by Subgroup 1
5
Subgroup 8
External Visual
MIL-STO-883 Method 2009
7
Subgroup 4, 5, and 6 not tested
Note:
1
limits and conditions are> per the electncal/optical characteristics. 'The IOH and IOL tests are the inverse of VOH and VOL speCified in the electrical characteristics.
Table ilia. Group B, Class A and B 01 MIL-D-87157
Subgroup/Test
Subgroup 1
Resistance to Solvents
Internal Visual and
DeSign Verlfication[1J
Subgroup 2[2,3]
Solderability
Subgroup 3
Thermal Shock (Temp, Cyclel
Moisture Reslstance!4]
Fine Leak
Gross Leak
Electrical/Optical Endpoints!5]
Subgroup 4
Operating Ufe Test 1340 hrS.1
Electrical/Optical Endpoints[5]
Subgroup 5
Non-operating IStoragsl Ufe
Test 1340 hrs,j
Electrical/Optical Endpointsl S)
Mll-STD·750
Method
Conditions
SampleSl;z:e
4 Devices!
Failures
1 Devicel
o Failures
1022
o
20751 6J
2026
T A '" 245° C for 5 seconds
LTPD =15
1051
1021
1071
1071
Condition 81, 15 min, Dwell
LTPO=15
Condition H
Condition C
Icc I at VB - DAV and 2AV I,
leol lat VB = OAV and 2.4VI,
IiH IVa. Clock and Data In), hL IVa,
Clock and Data Inl, lOH, 10L Visual
Functfon and Iv peak, VIH and VIL
inputs are guarante_ed by the electronic
shift registertest TA = 25'C
-
=
1027
1032
-
TA "" +85"C at Vee = Va 5,25V,
VeaL = 3,5V, LED ON-Time Duly Factor'" 5%, 35 Dots On
Same as Subgroup 3
LTPD=10
TA = +125 Q C(6]
LTPO'" 10
Same as Subgroup 3
Notes:
1. Visual inspection is performed through! the display window.
2. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
3. The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads required.
4. Inilial conditioning is a 15 c inward bend for one cycle
5. Limits and conditions are per the electrical/optical characteristics. The IOH and IOl tests are the inverse of VOH and VOL specified in the electrical characteristics.
6. Equivalent to MIL·STD·883, Method 2014.
7-226
Table IVa. Group C, Class A and B of MIL-D-87157
subgrOu.,/Tesl
MIL·STD-7S0
Conditions
Method
Subgroupw1
Physical Dimensions
2066
Subgroup 2[2]
Lead Integrlty(7, 9]
Fine Leak
Gross Leak
2004
1071
1071
Subgroup 3
Shock
2016
Vibration, Variable Frequency
Constant Acceleration
Externat Visual1 4 1
electrical/Optical Endpointsl 81
Sample Size
2;tviCeS!
0" ' lIures
ill
Condition B2
i€ondition H
Condition C
=
lS00G, Time 0,5 ms, 5 blows in
each orientation Xl. Yl. 21
2056
2006
1010 or 1011
-
Icc f at Va - OAV and 2.4V,
leOl {at Va = O.4V and 2,4VI
hH IVe, Clock and Data 1m
hL IVa, Clock and Data In1
tOH, 10L. Visual Function and Iv peak.
VIH and VIL Inputs are guaranteed by
the electronic shift register
test. TA '" 2S·C,
1041
1010 or 1011
SubgroupS
Bond Strength,SI
2037
Condition A
Subgroup 6
Operating Life Testl6!
1026
T A = +8S"C at Vee'" VB = 5.25V,
Veol. '" S.5V. 35 Dots On
Same as Subgroup 3
-
LTPD "" 15
10,000G at VI orientation
Subgroup 4(1,3J
Salt Atmosphere
External Visual1 41
Electrical/Optical EndpolntslSI
LTPD=1S
LTPD:= 15
LTPD=20
(C",O,
,,=
10
Noles:
1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C life test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics. The IOH and IOL tests are the inverse of VOH and VOL specified in the
electrical characteristics. '
9. Initial conditioning is a 15 degree inward bend, 3 cycles.
7-227
Fliifl
HEWLETT
HERMETIC, EXTENDED TEMPERATURE RANGE
S.Omm <'20") SX7 ALPHANUMERIC DISPLAYS
STANDARD REO
YELLOW
HIGH EFFICIENCY REO
HIGH PERFORMANCE GREEN
~~ PACKARD
HDSP-2310/2310TXV12310TXVB
HDSP-2311 12311 TXV 12311 TXVB
HDSp·2312/2312TXV /2312TXVB
HDSP-2313/2313TXV 12313TXVB
Features
• WIDE OPERATING TEMPERATURE RANGE
-55°C TO +85°C
• TRUE HERMETIC PACKAGE FOR RED, YELLOW
AND HIGH EFFICIENCY RED DISPLAYS[1]
• TXVB VERSION CONFORMS TO MIL-D-87157
QUALITY LEVEL A TEST TABLES
• FOUR COLORS
Standard Red
High Efficiency Red
Yellow
High Performance Green
• CATEGORIZED FOR LUMINOUS INTENSITY
• YELLOW AND GREEN DISPLAYS CATEGORIZED
FOR COLOR
Description
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT LED DRIVERS
• 5x7 LED MATRIX DISPLAYS FULL ASCII
CHARACTER SET
• WIDE VIEWING ANGLE
• END STACKABLE
• TTL COMPATIBLE
Nole:
1. The HDSP-2313 high performance green displays are epoxy
sealed and conform to MIL-D-87157 hermeticity requirements.
The HDSP-2310 series displays are 5.0mm (0.20 in.) 5x7
LED arrays for display of alphanumeric information. These
devices are available in standard red, yellow, high efficiency
red and high performance green. All displays use a 14 pin
dual-in-line glass ceramic package. The hermetic HDSP2310/-2311/-2312 displays utilize a solder-glass seal. The
HDSP-2313 displays utilize an epoxy glass-to-ceramic seal.
All display packages conform to the hermeticity requirements of MIL-D-87157. An on-board SIPO (Serial-In-ParallelOut) 7-bit shift register associated with each digit controls
constant current LED row drivers. Full character display is
achieved by external column strobing.
Package Dimensions
QATE CODE
S€E NOTE 3
4.87 I1Of.
r
8.43
(.192)
(.3nl
_=-----1
PIN 1 MARKED BY oor
ON SACK Of PACKAGE
LUMINOUS
INT€NSITY
5.00, "3
1,197 > .0051
PIN ..
CATEOORY
,
PIN
s.oe
(.2001
t
L
COLUMN
COLUMN
COLUMN
COLUMN
CLOUMN
1
2
3
4
5
6
INT. CONNECP
PIN
7
8
9
'0
11
'2
00 NOT CONNECT OR USE
t
2.54
(.1001
FUNCTION
2
3
4
5
,
FUNCTION
DATA OUT
VB
Vee
CLOCK
GROUND
DATA IN
NOTES,
" DIMENS!ONS IN mm ttll<:ned,
2. UNLESS OTHERWISE SPECIFIED TflE TOLERANCE ON
ALL OIMENSIONs IS , 0.38 mm (; MS"J.
2i~:oo '::.io;r -l
NON ACCUM.
S, CHAAACTERS ARE CENTERED WITH RESPECT TO
,.AO$ WITHIN, 0,'3
O.OQS") ,
4. LEAD MATERIA. 1$ GOLD PLATEO COPPER ALLOY,
mm',
7-228
Typical Applications
• MILITARY EQUIPMENT
• AVIONICS
• HIGH RELIABILITY INDUSTRIAL EQUIPMENT
Absolute Maximum Ratings (HDSP-231 0/-2311/-2312/-2313)
Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs, Data Out and VB . . . . . . . . . . . . . . . .. -0.5V to Vee
Column Input Voltage, VeOl ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TA 1.2 •.•••••••• -55°e to +85°e
Storage Temperature Range, T5
HDSP-2310/-2311/-2312 ............ .. -65°C to +125°C
HDSP-2313 ........................ -55°e to +100°C
Maximum Allowable Power Dissipation
at TA = 25°Cll.2.3] ......................... 1.46 Watts
Maximum Solder Temperature 1.59 mm (.063")
Below Seating Plane t<5secs .................. 260°C
Recommended Operating
Conditions (HDSP-231 0/-2311/-2312/-2313)
Parameter
Supply Vollage
Data Out Current, Low State
Oala Out Current. H'9h State
Column Input Voltage, Column On HOSP-2310
Column Input VOltage, Column On HOSP-2311/-2312/-2313
SetupT,me
Hold Time
Width of Clock
Clock Frequency
Clock Transition Time
Free Air Operating Temperature Range 1.2·
Symbol
Vee
IOl
IOH
Veol
Veol
Min.
475
Nom.
Max.
50
525
1.6
-0.5
3.5
35
2.4
tho1d
275
70
30
t . . -1C!ock;
75
fcloCK
0
tTHl
TA
3
200
-55
85
Isetup
45
0
Units
V
rnA
rnA
V
V
ns
ns
Fig;
ns
1
1
1
MHz
ns
°C
4
4
1
1
Electrical Characteristics Over Operating Temperature Range
IUnless otherwise specified I
Description
Suppty Current
Symbol
lec
Test Conditions
Vec - 5.25V
VCLOCK = VOATA "2AV
All SR Stages
Logical 1
Vee =5.25 V
Veal =3.5V
All SR Stages = Logical 1
=
Column Current at any Column Input
leaL
Column Current at any Column Input
VB, Clock or Data Input Threshold High
VB, Data Input Threshold Low
Clock Input Threshold Low
Input Current Logical 1
VB, Clock
Data In
Input Current Logical a
Va, Clock
Data In
leOl
V,H
Data Out Voltage
Power Dissipation Per Package"
Thermal Resistance IC
Junction-to-Case
Leak Rate
V'L
V'L
IIH
hH
III
lil
VOH
VOL
Po
Typ.'
Max.
Units
VB =OAV
45
60
mA
Va" 2.4V
73
95
mA
Min.
Va
ffl
OAV
Va = 2.4V
380
500
p.A
520
mA
V
V
V
MA
p.A
2.0
0.8
0.6
Vee =4.75V
Vee
=5.25V, V1H =2AV
Vee; 5.25V. V'l = DAV
=
Vee = 4.75V, JOH - -0.5 mA, leOL 0 mA
Vee =4.75V,
1.6 mA, leol = 0 mA
Vce - 5.0V. VCOL - 3.5V, 17.5% OF
15 LEOs on per character. VB - 2.4V
=
ROJ-C
2.4
20
10
-500
-250
3.4
0.2
80
40
-800
-400
0.4
Fig;
4
rA
p.A
V
V
0.78
W
2
25
'C/WI
Device
;:
5xlQ-8
cc/sec
'All typical values specified at Vee = 5.0V and TA = 25' C unless
otherwise noted.
"Power dissipation per package with four characters illuminated.
Notes:
1. Operation above 85°C ambient is possible provided the Ie
junction temperature. TJ, does not exceed 125°C.
2. The device should be derated linearly above 3]0 C at
16.7 mW/' C. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at
35° C/W per device. See Figure2 for powerderatings based on
a lower thermal resistance.
3. Maximum allowable dissipation is derived from Vee - 5.25V,
VB - 2.4V, VeaL - 3.5V 20 LEOs on per character, 20% OF.
7-229
·. Optical Characteristics
."'. STANDARD RED
HDSP-2310
Description
Peak Luminous Intensity per LED
: Character Average I
Peak Wavelength
Dominant Wavelength!7}
YELLOW
Symbol
4.8
IvPeak
Test Conditions
Vee'" 5.0V, VeOl '" 3.5V
Tj = 25° Clol, VB = 2.4V
Min.
220
APEAK
Ad
Typ.'
Units
Fig.
370
pcd
3
655
639
nm
nm
Max.
HDSP-2311
Description
Peak LuminOus Intensity per LED 4.8
I Character Averagel
Peak Wavelength
Dominant Wavelength[S. 7}
HIGH EFFICIENCY RED
Min.
Typ.*
Units
Fig.
650
1140
",cd
3
APEAK
583
Ad
585
nm
nm
Symbol
IvPeak
Test Conditions
Vee = 5.0V, VeOl = 3.5V
Tj = 25°CI 61, VB = 2.4V
Max,
HDSP-2312
Description
Peak Luminous Intensity per LED 4.8
(Character Average I
Peak Wavelength
Dominant Wavelength(7)
Symbol
Ivpeak
Test Conditions
Vee - 5.0V, VeOl - 3.5V
Tj = 25" CISI, Va = 2.4V
ApEAK
Ad
Min.
IYp.'
Units
Fig.
650
1430
Max.
",cd
3
635
626
nm
nm
HIGH PERFORMANCE GREEN HDSP-2313
Min. Typ.' Max.
Description
Symbol Test Conditions
Ulilts Fig.
Peak Luminous Intensity per LED 4.8
Vee = 5.0V, VeOl 3.5V
6
pcd
1280 2410
Iv Peak
TI'" 25° CISI, VB'" 2.4V
I Character Average I
Peak Wavelength
568
nm
APEAK
Dominant Wavelength[S. 7)
nm
Ad
574
. All tYPical values specified at Vec ~ 5.0V and TA ~ 25° C unless
"Power dissipation per package with four characters Illuminated.
=
otherwise noted.
Noles:
4. The characters are categorized for luminous intensity With the
IntenSIty category designated by a letter code on the bottom of
the package.
5. The HDSP-2311 and HDSP-2313 are categorized for color with
the color category designated by a number code on the
bottom of the package.
6. The luminous intensity is measured at TA = Ti = 25°C. No
time is allowed for the device to warm-up prior to
Dominant wavelength Ad. Is derived from the CIE chromaticity
diagram. and represents the single wavelength which defines
the color of the device.
8. The luminous sterance of the LED may be calculated using the
following relationships:
Lv Icd/m2) = Iv ICandela)1 A IMetre)2
Lv IFootiamberts) = rrlv = ICandelal/A IFootl 2
A = 5.3 x 10'a M2 = 5.8 x 10-7 IFootl2
7.
measurement.
column 1 input is now enabled for an appropriate period of
time, T. A similar process is repeated for columns 2, 3, 4 and
5. If the time necessary to decode and load data into the shift
register is t, then with 5 columns, each column of the display
is operating at a duty factor of:
Electrical Description
The HDSP-2310 series of four character alphanumeric
displays have been deSigned to allow the user maximum
flexibility in interface electronics design. Each four character module is arranged as a 28 bit serial in parallel out shift
register as is shown in Figure 5. The display module features Data In and Data Out terminals arrayed for easy PC
board interconnection. Data Out represents the output of
the 7th bit of digit number 4 shift register. Shift register
clocking occurs on the high to low transition of the Clock
input. The like columns of each character in a display
cluster are tied to a single pin. Figure 5 is the block diagram for the displays. High true data in the shift register
enables the output current mirror driver stage associated
with each row of LEDs in the 5x7 diode array.
D.F.= _ _
T_
5 (t+TI
The time frame, t + T, alloted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned onl at a
minimum rate of 100 times per second.
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power
consumption.
If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t«T. For short display strings, the duty
factor will then approach 20%.
With five columns to be addressed, this refresh rate then
gives a value for the time t + T of:
In the normal mode of operation, input data for digit 4,
column 1 is loaded into the 7 on-board shift register
locations 1 through 7. Column 1 data for digits 3, 2, and 1 is
similarly shifted into the display shift register locations. The
1/[5 x (10011 = 2 msec
The ESD susceptibility of these devices is Class A of MILSTD-883 or Class 2 of DOD-STD-1686 and DOD-HDBK-263.
Forfurther applications iniormation, refer to HP Application
Note 1016.
7-230
CLOCK
2.4V
SERIAL
CLOCK
SERIAL
DECODED
DATA
O.4V
DECODED
DATA
OUTPUT
INPUT
2.4V
DATA IN
O.4V
BLANKING
CONTROL
2.4V
DATA OUT
O.4V-----+....I
Figure 1. Switching Characteristics HDSP-2310/-2311/-2312/-2313
(TA = -55°C to +85°C)
5
COLUMN DRIVE INPUTS
Mechanical and
Thermal Considerations
Figure 5. Block Diagram 01 HDSP-2310/-2311/-2312/-2313
The HDSP-2310 series displays are available in standard
ceramic dual-in-line packages. They are designed for
plugging into sockets or soldering into PC boards. The
packages may be horizontally or vertically stacked for
character arrays of any desired size. HDSP-2310 series
displays utilize a high output current IC to provide excellent readability in bright ambient lighting. Full power
operation (Vee = 5.25V, VB = 2.4V, VeOl = 3.5V) with
worst case thermal resistance from IC junction to ambient
of 60°C/watVdevice is possible up to ambient temperature'
of 37°C. For operation above 37°C, the maximum device
dissipation should be derated linearly at 16.7 mW/oC (see
Figure 2). With an improved thermal design, operation at
higher ambient temperatures without derating is possible.
Power derating for this family of displays can be achieved
in several ways. The power supply voltage can be lowered
to a minimum of 4.75V. Column Input Voltage, VeOl, can
be decreased to the recommended minimum values of
2.4V for the HDSP-2310 and 2.75V for the HDSP-23111-2312/
-2313. Also, the average drive current can be decreased
through pulse width modulation of VB.
information on filtering and contrast enhancement can be
found in HP Application Note 1015.
Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning
processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is permissible.
Suggested solvents include Freon TF, Freon TE, Genesolv
DI-15, Genesolv DE-15, and water.
High Reliability Testing
Two standard reliability testing programs are available. The
TXVB program is in conformance with Quality Level A of
MIL-D-87157 for hermetically sealed LED displays with
100% screening tests. A TXVB product is tested to Tables I,
II, Ilia, and IVa. The TXV program is an HP modification to
the full conformance program and offers the 100% screening
of Quality Level A, Table I, and Group A, Table II.
Part Marking System
Standard
Product
HDSP~2310
The HDSP-2310 series displays have integral glass windows. A front panel contrast enhancement filter is
desirable in most actual display applications. Some suggested filter materials are provided in Figure 6. Additional.
HDSP-2311
HDSP-2312
HDSP-2313
With Tables
I, II. ilia, IVa
With Table I alld II
HDSP-2310TXV8
HDSP-2311TXVB
HDSP·2312TXV8
HDSP-2313TXVB
HDSP-2310TXV
HDSP-2311 TXV
HDSP-2312TXV
HDSP~2313TXV
500
40 0
/ 'I?'
0
J
HDSI'·;/3l0
ffi
I/HOSP-2311/-2312/",.ma
1/
200
100
0
.oJ
1.0
TA - AMBIENT TEMPERATURE
_·c
Figure 2. Maximum Allowable Power
Dissipation vs. Temperature
TJ t"C)
Figure 3. Relative Luminous Intensity
vs. Temperature
7-231
2.0
3.0
4.0
VeOL - COLUMN VOLTAGE - VOL T8
Figure 4. Peak Column Current vs.
Column Voltage
5.0
Ambient Lighting
Display
Color
HDSP-2310
Standard Red
Dim
Moderate
Panelgraphic Dark Red 63
Ruby Red 60
Chequers Red 118
prexiglass 2423
Polaroid HNCP 37
3M Light Control Film
Bright
Panelgraphic Gray 10
Polaroid Gray HNCP10
HOYA Yellowish-Orange
HLF-60S-3Y
Marks Gray
MCP-0301·S-l0
HDSP-2311
Yellow
Panefgraphic Yellow 27
Chequers Amber 107
HDSP·2312
HER
Panelgraphic Ruby Red 60
Chequers Red 112
Polaroid Gray HNCP10
HOYA Reddish-Orange
HLF-608-SR
Marks Gray
MCP-0301-8-10
Marks Reddish-Orange
MCP-D201-2-22
HDSP-2313
HP Green
Panelgraphic Green 4S
Chequers Green 107
Polaroid Gray HNCP10
HOYA Yellow-Green
HLF-60&-lG
Marks YellOW-Green
MCP-Ol01-5-12
Chequers Grey 105
Figure 6. Contrast Enhancement Filters
100% Screening
Test Screen
Table I. Quality Level A of MIL-D-87157
MIL-STD·750
Method
±
Conditions
1. Precap Visual
2072
2. High Temperatura Storage
1032
Interpreted by HP Procedure 5956-7512-52
3. Temperature Cycling
1051
4. Constant Acceleration
5. Fine Leak
2006
1071
10,000 G's at y, orientation
6. Gross Leak
1071
CondltionC
TA'" 125°C, Time =24 hours[3)
Condition B, 10 cycles, 15 min. dwell
Condition H
7,
Interim Electrical/Optical Tests[11
-
Icc (at VB = O.4V and 2.4V}, leOL (at Va =
OAV and 2.4V)
hH (Va, Clock and Data In), ItL (Va, Clock
and Data In), 10H, IOL
and Iv Peak. VIH and VIL inputs are
guaranteed by the electronIc shift
register test. TA=25° C
a.
Burn-lnP!
1015
Condition B at Vee"" VB "" 5.25V. VeOL
S.SV, TA=+a5·C,
L.ED ON-Time Duty Factor" 5%. 35 Dots
On; t= 160 hours
Same as Step 7
.:llec ±6 mA, .:lIIH (clock) '" ±10 ItA,
.:lIIH (Data In) =±10 p.A
alOH ±10% of initial value, and
.lIV -20%, TA'" 25" C
9. Final Electrical Testl2 j
10. Delta Determinations
11. External Visualfll
-
=
=
=
=
2009
Notes:
1. MIL-STD-BB3.Test Method applies.
2. Lim.its and conditions are per theelectricailoptical characteristics,The 10H and 10L tests are the inverse of VOH and VOL specifie.9 in
the electrical ·characteristics. "
.
.
3. T A = 100· C for HDSP-2313. '
.
.'
'
7-232
Table II. Group A Electrical Tests - MIL-D-B7157
SubgroupiTest
Parameters
Subgroup 1
DC Electrical Tests at 25°C111
LTPD
Icc lat VB = OAV and 2AVI, ICOL
(at VB "'" OAV and 2.4VI
IIH (VB, Clock and Data Inl, IlL (VB, Clock and Data
1m. IOH, IOL Visual.,.fu?ction and Iv peak. VIH and,YIL
inputs are guaranteed by the electronic shift
register test.
5
Subgroup 2
DC Electrical Tests at High
Temperaturei11
Same as Subgroup 1, except delete Iv and visual
function, TA = +85°C
7
Subgroup 3
DC Electrical Tests at Low
Tem peraturel 1I
Same as Subgroup 1, except delete Iv and visual
function. TA=-55°C
7
Subgroup 7
Optical and Functional Tests at 25°C
Satisfied by Subgroup 1
5
Subgroup B
External Visual
MIL-STD-883 Method 2009
7
I'"
;",
SUbQroup 4, 5, and 6 not lested
Note:
1. Limits and conditions are per the electrical/optical characteristics. The IOH and tOl tests are the inverse of VOH and VOL specified in the electrical characteristics.
Table ilia. Group B, Class A and B of MIL-D-B7157
Subgroup/Test
Subgroup 1
Resistance to Solvents
Internal Visual Design Verification(1)
Subgroup 2[2.31
Solderability
Subgroup 3
Thermal Shock (Temp. Cycle)
Moisture Resistance[4]
Fine Leak
Gross Leak
Electrical/Optical Endpoints[5]
Subgroup 4
Operating Life Test (340 hrs,1
Electrical/Optical Endpoints[5]
SubgroupS
Non-operating (Storage) Life
Test (340 hrs.1
Electrical/Optical Endpoints[51
MIL-STD-750
Method
Conditions
Sample Size
4 Devices!
Failures
1 Devicel
Failures
1022
o
2075[7]
o
245" C for 5 seconds
2026
TA
1051
1021
1071
Condition 81. 15 min. Dwell
LTPD=15
LTPD'" 15
Condition H
Condition C
1071
-
Icc (at VB = OAV and 2AVI.
leaL (at VB =; OAV and 2AVI.
IiH (VB. Clock and Data Inl, hL (Vs.
Clocl< and Dala Inl. IOH, IOl Visual
Function and Iv peak. VIH and VIL
inputs are guaranteed by the electronic
shift register test. TA"'" 25°C
1027
1032
-
TA = +85°C at Vee'" VB = 5.25V.
VeOL '" 3.5V, LED ON-Time Duty Factor = 5%, 35 Dots On
Same as Subgroup 3
LTPD=10
TA = +125"Cf6)
LTPD= 10
Sarne.as Subgroup 3
Notes:
1.
2.
3.
4.
5.
Visual inspection is performed through the display window.
Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads required.
Initial conditioning is a 15° inward bend for one cycle.
Limits and conditions are per the electrical/optical characteristiCS. The IOH and IOL tests are the inverse of VOH and VOL specified in the electrical characteristics.
6. TA =100°C for HDSp·2313,
7. Equivalent to Mll·STD·883. Method 2014.
7-233
Table IVa. GroupC, Class A and B of MIL-D-87157
SUbgrouplTest
Subgroup 1
Physloal Dimensions
Subgroup 212]
Lead Integrity!?, 9J
Fine Leak
Gross Leak
Subgroup 3
ShOck
Vibration, Variable Frequency
Con&tant Acceleration
External Visuaj/ 41
Electrical/Optical Endpointsl8!
MIL4TD·7SO
Method
Conditions
2066
2 Devices!
a Failures
2004
1071
1071
2016
2056
2006
10100r 1011
-
nB2
Condition H
ConditionC
LTPD=15
1500(3, Time"" 0.5 ms, 5 blows In
each orientation Xl. V1,Z1
LTPD = 15
10.000G at Y1 orientation
Icc {at Va =O.4Vand 2.4VJ
leoL (at VB '" O.4V and 2.4VI
hH (Va, Clock and Data In!
ilL (Va, Clock and Data In!
IOH, Jot., Visual Function and Iv peak.
VIH and VIL inputs are guaranteed by
the eleotronic shift register
test. TA" 25°C.
Subgroup 411,$)
Salt Atmosphere
External Visuall 4j
1041
1Pl0 or 1011
SUbgroupS
Bond Strengthl 51
2037
ConditlonA
SubgroupS
Operating Ufe Test lSI
1026
r A'" +8S' C at Vee" Va:;; 5.25V.
Electrical/Optloal Endpointsllli
-
Sample Size
LTPD=15
VCOL'" 3.SV, 35 Dots On
Same as Subgroup 3
LTPD=- 20
(C=:;O)
,\ = 10
Notes:
1. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
'
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011.
5. Displays may be selected prior fo seal.
S. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests
may be continued on tesllo 1000 hours in orderto satisfy the Group C life test requirements. In such cases, either the 340 hour endpoint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics. The lo'H and IOL tests are the inverse of VOH and VOL specified in the
electrical characteristics.
9. Initial conditioning is a 15 degree inward bend, 3 cycles.
7-234
---_._------ - - - - - - - - - - - - - - - - - - - - - -
Fliffl
HERMETIC, EXTENDED TEI\!IPERATURE RANGE
6.9mm <'27") 5X7 ALPHANUMfiRIC DISPLAYS
H'EWLETT
STANDA:fll~;P, ~OfP·zg~~~f~~~~~~~~i~~:
HIGH iFFICIENCY
H
452/2452TXV /2452TXYB
HIGH PERFORMANCE GREEN HDS '45i/2453TXV 1245,,~~X"'B
~J:. PACKARD
Rfo
Features
• WIDE OPERATING TEMPERATURE RANGE
-55°C TO +85°C
• TRUE HERMETIC PACKAGE FOR RED, YELLOW
AND HIGH EFFICIENCY RED DISPLAYS[1]
• TXVB VERSIONS CONFORM TO MIL·D-87157
QUALITY LEVEL A TEST TABLES
• FOUR COLORS
Standard Red
High Efficiency Red
Yellow
High Performance Green
• CATEGORIZED FOR LUMINOUS INTENSITY
• YELLOW AND GREEN DISPLAYS CATEGORIZED
FOR COLOR
Description
• INTEGRATED SHIFT REGISTERS WITH
CONSTANT CURRENT DRIVERS
The HDSP-2450 series displays are 6.9 mm (0.27 in.) 5x7
LED arrays for display of alphanumeric information. These
devices are available in standard red, yellow, high efficiency
red and high performance green. All displays use a 28 pin
dual-in-line glass ceramic package. The hermetic HDSP2450/-2451/-2452 displays utilize a solder-glass seal. The
HDSP-2453 displays utilize an epoxy glass-to-ceramic seal.
All display packages conform to the hermeticity requirements of MIL-D-87157. An on-board SIPO (Serial-In-ParallelOut) 7-bit shift register associated with each digit controls
constant current LED row drivers. Full character display is
achieved by external column strobing.
• 5x7 LED MATRIX DISPLAYS FULL ASCII
CHARACTER SET
°
WIDE VIEWING ANGLE
o END STACKABLE
• TTL COMPATIBLE
Note:
1. The HDSP-2453 is epoxy sealed and complies with MIL-D87157 hermeticity requirements.
package Dimensions
'-
~-t-~
I
1
PlN 1
OF
PACKA
I
I
MARKEI>
8VOOT
DNSAeK
I
I
L_ _J
Go,
-
1-,'.6-1
(.18'
,
-!.... - - -, ..... -
-,
r-
I
I
I
I
L_
2
--+- -
r- -1
r- -T
I
I
I
I
-+-3
I
I
_J
L_
--:/2..
[.88)
I
I
I
_J
-- --
'~~
1.53)
'II
35,& (1.40J MAX
~-4.9(.19)
31.~
11.231
.-----:-I
_L
L_
IT
.I,
FUNCTIONI"
P'N
1
2
NO CONNECT
15
NOCONNECT
COLUMN 1
3
COLUMN 1
17
"
DATA OUT
DATA OUT
COLUMN 2
18
VB
VB
V",
V",
CLOCK
CLOCK
GROUND
GROUND
DATA IN
DATA IN
NO CONNECT
COLUMN 2
211
IT
r-
P'N
6
COLUMN 3
7
COLUMN 3
•
•
COLUMN 4
COLUMN 4
"
2'
21
22
23
2.
10
COLUMN 5
11
25
COLUMN 5
tNT. CONNECT1 1 1 26
'2
13
INT. CONNECTI21 27
14
NO CONNECT
2B
FUNCTION
~TEs:
'J. AU.lJSeA8f.ia FUNCTION
PINS AIlE: REQUNDANf,
GI.&(!lRfCAI. CONNECTION
(fA"., 8E MADEl 10
EITH~~
tt1n oR BOTH.
.a. 00 NOT CONNECl 0I't USf,
a.
DItIIENStQNlIN
~(tncHesJ,
4. UNt.E$S: OTHERW.S!
SPE(:IFtED, THE
rOLEflANCE OkALL
DIMENSIONS 1S 1 ,,38 mm
f',015 INCHES.,
So. U'AO MATEfUAllS
OOLD~t.A"Et) IRON
ALLOY.
3.30(.1
~.54
(.10)
I
LI
J
2.54, .13TYJ'
(.100;1:. ,0051 NONA¢CUPr!,
I, ,I
[ [J ~
-H---
Iu
~
,64..09
(.020.:..003)
7-235
- - - - - - - - - _.._ - - _ .... _.....
Typical Applications
• MILITARY EQUIPMENT
• AVIONICS
• HIGH RELIABILITY INDUSTRIAL EQUIPMENT
Absolute Maximum Ratings (HDSP-2450/-2451/-2452/-2453)
Supply Voltage Vee to Ground .......... -0.5V to 6.0V
Inputs. Data Out and VB ... ..... ..... .. .. -0.5V to Vee
Column Input Voltage, VeOL ............ -0.5V to +6.0V
Free Air Operating
Temperature Range, TAI1.21 .......... -55°C to +85°C
Storage Temperature Range, Ts
HDSP-2450/-2451/-2452 ............. -65°C to +125°C
HDSP-2453 ........................ -55°C to +100°C
Maximum Allowable Power Dissipation
at TA = 25°C[1.2,3] ......................... 1.46Watts
Maximum Solder Temperature 1.59 mm (.063")
Below Seating Plane t < 5 secs .................. 260°C
Recommended Operating Conditions
(HDSP-2450/-2451/-2452/-2453)
Parameter
Supply Voltage
Data Out Current, Low State
Data Out Current, High Stale
Column Input Voltage, Column On HDSP-2450
Column Input Voltage, Column On HDSP-2451/2452/2453
Setup Time
Hold Time
Width of Clock
Clock Frequency
Clock Transition Time
Free Air Operating Temperature Range 11.21
Symbol
Min,
Nom,
Max.
Vee
IOL
4.75
5.0
5,25
1.6
-0.5
3.5
JOH
VeoL
VeoL
!setup
2.4
2.75
70
45
tnold
30
0
tw(ClodJ
fclock
75
0
3
tTHl
TA
-55
200
85
Units
V
mA
mA
Fig:
V
V
4
3,5
ns
ns
ns
MHz
ns
4
1
1
1
1
1
PC
Electrical Characteristics Over Operating Temperature Range
(Unless otherwise specified 1
[Oescrlption
Supply Current
Symbol
ICC
Column Currenl at any Column Input
ICOl
Column Current at any Column Input
VB, Clock or Data Input Threshold High
VB, Data Input Threshold Low
Clock Input Threshold Low
leoL
VIH
V,L
Input Current Logical 1
Input Current Logical 0
Va, Clock
Data In
VB, Clock
Data In
Data Qut Voltage
Power Dissipation Per Package"
VIL
hH
hH
lil
lil
VOH
VOL
PD
Thermal Resistance IC
Junction-la-Case
Test Conditions
Vee - 5,25V
VelOCK VOATA ~ 2,4V
All SR Stages ~
Logical 1
Vee - 5,25 V
VCOl 3.SV
All SR Stages ~ Logical 1
=
=
I
Va
~
2AV
VB
~
OAV
Typ.'
Max,
Units
45
60
rnA
73
95
mil
500
p,A
520
rnA
V
V
V
p,A
p.A
380
Ve=2AV
20
Vee
= 4.7SV
0.8
0.6
Vee = 5,25V, VIH
Vee
20
=2AV
=5.25V, Vil = OAV
Vee = 475V. 10H - -0.5 rnA, ICOl - 0 rnA
Vee - 4,75V lOl = 1,6 rnA, leOl - 0 rnA
Vee - 5,DV, VeOl - 3,5V, 17.5% OF
15 LEOs on per character, Va = 2.4V
ROJ-e
2.4
80
10
40
-500
-800
-400
-250
3,4
0.2
0.4
= 5,OV
and TA = 25°C unless
Fig.
4
JlA
JlA
V
V
078
W
2
20
"C/WI
Device
2
5x10·e
Leak Rate
'All typical values specified at Vcc
otherwise noted.
Min.
VB ~ OAV
co/sec
"Power dissipation per package with four characters Illuminated,
Noles:
1, Operation above 85°C ambient is possible provided the IC
junction temperature, TJ, does not exceed 125°C,
2, The device should be derated linearly above 60° C at
22,2 mW/o C. This derating is based on a device mounted in a
socket having a thermal resistance from case to ambient at
25° C/W per device, See Figure 2 for powerderatings based on
a lower thermal resistance,
3, Maximum allowable dissipation is derived from Vec = 5,25V, VB
= 2.4V, VCOl = 3,5V 20 LEOs on per character, 20% OF.
7-236
Optical Characteristics (continued)
STANDARD RED HDSP-2450
Description
Peak luminous Intensity per LED,4,8,
I Character Average I
Peak Wavelength
Dominant Wavelength[7]
YELLOW
Symbol
Test Conditions
Vee - 5.0V, WOOL - 3.5V
TI=25~Ct61, VB '" 2.4V
Min" 'Typ.'
,Units
Fig.
3
370
fled
APEAK
655
Ad
639
nm
nm
Iv Peak
220
Max.
HDSP-2451
Oescripllon
Peak Luminous Intensity per lEOI4.B,
(Character Average I
Peak Wavelength
Dominani WavelengjhJ5.71"
HIGH EFFICIENCY RED
Symbol
IVPeak
APEAK
Ad.
TeslCondltlons
Vee - 5.0V, VeOl - 3.5V
TI = 25° C1 61, VB:;= 2.4V
.
Min.
Typ.·
Wilts
Fig.
850
1400
fl cd
3
583
"585
nm
nm
Test C!ofoaillons
Vee - 5.QV. VeOl - 3.5V
Ti = 25°C[61, VB = 2.4V
Min.
Typ.' 'Max.
Units
Fig.
850
1530
;tcd
3
635
626
nm'
nm
Max.
HDSP-2452
Description
Peak Luminous Intensity per LEDI4,81
I Character Average I
Peak Wavelength
Dominant Wavele'1gth[7)
Symbol
IvPeak
APEAK
Ad
HIGH PERFORMANCE GREEN HDSP-2453
DescriptIon
Peak Luminous Intensity per LEO;4.S,
I Character Average I
Peak Wavelength
Dominant Wavelength!?)
Symbol
Iv Peak
Test Conditions
Vee = 5.0V, VeOl - 3,5V
T) = 25° CI 6 1, VB = 2.4V
Min.
Typ,"
1280
APEAK
Ad
• All tYPical values specified at Vee ~ 5.0V and T A ~ 25"C unless
otherwise noted.
Notes:
4. The characters are categorized for luminous intensity with tile
intensity category deSignated by a letter code on the bottom of
the package.
5. The HDSP-2451 and HDSP-2453 are categorized for color with
the color category designated by a number code on the
bottom of the package.
6. The luminous intensity is measured at TA = Tj = 25" C. No time
is allowed for the device to warm-up prior to measurement.
Electrical Description
The HDSP-2450 series of four character alphanumeric
displays have been designed to allow the user maximum
flexibility in interface electronics design. Each four
character display module features Data In and Data Out
terminals arrayed for easy PC board interconnection. Data
Out represents the output of the 7th bit of digit number 4
shift register. Shift register clocking occurs on the high to
low transition of the Clock input. The like columns of each
character in a display cluster are tied to a single pin.
Figure 5 is the block diagram for the displays. High true
data in the shift register enables the output current mirror
driver stage associated with each row of LEDs in the 5x7
diode array.
The TTL compatible VB input may either be tied to Vee for
maximum display intensity or pulse width modulated to
achieve intensity control and reduction in power
consumption.
The normal mode of operation input data for digit 4, column
1 is loaded into the 7 on-board shift register locations 1
through 7. Column 1 data for digits 3, 2, and 1 is similarly
shifted into the display shift register locations. The column 1
input is now enabled for an appropriate period of time, T. A
Max.
Units
Fig,
2410
pcd
3
568
574
nm
nm
.. Power diSSipation per package with four characters Illuminated .
7. Dominant wavelength Ad. is derived from the CIE chromaticity
diagram, and represents the single wavelength which defines
the color of the device.
8. The luminous ster&nce of the lED may be calculated using the
following relationships;
l, Icdfm2, = I, (Candela,fA IMetre,2
Lv IFootiamberts) = rrlv ICandela)/A IFoot)2
A ~ 5.3 X 10.8 M2 ~ 5.8 x 10-7 Foot 2
similar process is repeated for columns 2, 3, 4 and 5. If the
time necessary to decode and load data into the shift register
is t, then with 5 columns, each column of the display is
operating at a duty factor of:
T
D.F.=--5 (t+T)
The time frame, t +T, al/oted to each column of the display is
generally chosen to provide the maximum duty factor consistent with the minimum refresh rate necessary to achieve a
flicker free display. For most strobed display systems, each
column of the display should be refreshed (turned on) at a
minimum rate of 100 times per second.
With columns to be addressed, this refresh rate then gives a
value for the time t + T of:
1/[5 x (100)1
= 2 msec
If the device is operated at 3.0 MHz clock rate maximum, it is
possible to maintain t«T. For short display strings, the duty
factor will then approach 20%.
The ESD susceptibility of these devices is Class A of MILSTD-883 or Class 2 of DOD-STD-1686 and DOD-HDBK-263.
For further applications information, refer to HP Application Note 1016.
7-237
1----- 1/f;:~ __;~_=1
CLOCK
~I
j.
-
tTHL
2.4V
SERIAL
CLOCK
O.4V
SERIAL
DECODED
DECODED
DATA
INPUT
DATA
OUTPUT
2.4V
DATA IN
O.4V
BLANKING
CONTROL
2,4V
DATA OUT
O,4V
Parameter
Unh..
klcck
MHz
CL.OCK Rare
os
Figure 1. SWitching Characteristics HDSP-2450/-2451/-2452/-2453
(TA = -55'C to +85'C)
5
COLUMN DRIVE INPUTS
Figure 5. Block Diagram 01 HDSP-24S0/-24S1/-24S2/-24S3
Mechanical and
Thermal Considerations
The HDSP-245X series displays are available in standard
ceramic dual-in-line packages. They are designed for
plugging into sockets or soldering into PC boards. The
packages may be horizontally or vertically stacked for
character arrays of any desired size. HDSP-245X series
displays utilize a high output current IC to provide excellent readability in bright ambient lighting. Full power
operation (Vee = 5.25V, VB = 2.4V, VeOL = 3.5V) with
worst case thermal resistance from IC junction to ambient
of 45' C/watVdevice is possible up to ambient temperature
of 60°C. For operation above 60°C, the maximum device
dissipation should be derated linearly at 22.2 mW/'C (see
Figure 2). With an improved thermal design, operation at
higher ambient temperatures without derating is possible.
Power derating for this family of displays can be achieved
in several ways. The power supply voltage can be lowered
to a minimum of 4.75V. Column Input Voltage, VeOL, can
be decreased to the recommended minimum values of
2.4V for the HDSP-2450 and 2.75V for the HDSP-2451/
-2452/-2453. Also, the average drive current can be
decreased through pulse width modulation of VB.
on filtering and contrast enhancement can be found in HP
Application Note 1015.
.
Post solder cleaning may be accomplished using water or
Freon/alcohol mixtures formulated for vapor cleaning
processing or Freon/alcohol mixtures formulated for room
temperature cleaning. Freon/alcohol vapor cleaning processing for up to 2 minutes in vapors at boiling is permissible.
Suggested solvents include Freon TF, Freon TE, Genesolv
DI-15, Genesolv DE-iS, and water.
High Reliability Testing
Two standard reliability testing programs are available. The
TXVB program is in conformance with Quality Level A of
MIL-D-87157 for hermetically sealed LED displays with
100% screening tests. A TXVB product is tested to Tables I,
II, Ilia, and IVa. The TXV program is an HP modification to
the full conformance program and offers the 100% screening
of Quality Level A, Table I, and Group A, Table II.
Part Marking System
The HDSP-245X series displays have glass windows. A
front panel contrast enhancement filter is desirable in
most actual display applications. Some suggested filter
materials are provided in Figure 6. Additional information
With Tables
Standard
Product
With Table I and II
J, II, ilia, IVa
HDSP-2450
HDSP-2451
HDSP-2452
HDSP-2453
HDSP-2450TXV
HDSP-2451TXV
HDSP-2452TXV
HDSP-2453TXV
HDSP-2450TXVB
HDSP-2451TXVB
HDSP-2452TXVB
HDSP-2453TXVB
500
2.0
1.a
~E
1.•
~~
1.'
~2
1.2
0
1
~Q
§5~
~~
I --
1.0 I oa I -
~o
~'"
IW
~~
m
F= ==
-
OS
0.'
'\
40 0
/ ' '?'
\
300
>n
J
HOSl'-2450
/l'IOSP-24511-24521
-2453
I
200
100
0.2
0
°0
10
20
30
40
50
60
70
80
TA - AMBIENT TEMPERATURE _
°c
Figure 2. Maximum Allowable Power
Dissipation vs. Temperature
J
1.0
90 100
TJ (Oel
Figure 3. Relative Luminous Intensity
vs. Temperature
2.0
3.0
4.0
VCOl - COLUMN VOLTAGE - VOLTS
Figure 4. Peak Column Current vs.
Column Voltage
5.0
Ambient Lighting
Display
Color
Dim
Moderate
HDSP-2450
Standard Red
Panelgraphic Dark Red 63
Ruby Red 60
Chequers Red; 18
Plexlglass 2423
Polaroid HNCP 37
3M Light Control Film
Bright
HDSP-2451
Yellow
Panel graphic Yellow 27
Chequers Amber 107
Chequers Grey 105
HDSP-2452
HER
Panelgraphic Ruby Red 60
Chequers Red 112
Polaroid Gray HNCP10
HOYA Reddish-Orange
HLF-608-5R
Marks Gray
MCP..Q301-8-10
Marks Reddish-Orange
MCP-0201-2-22
HDSP-2453
HP Green
Panel graphic Green 48
Chequers Green 107
Polaroid Gray HNCP10
HOYA Yellow-Green
HLF-608-1G
Marks Yellow-Green
MCP-Ol01-5-12
Panelgraphic Gray 10
Polaroid Gray HNCP10
HOYA Yiillowish-Orange
HLF-608-3Y
Marks Gray
MCP-0301-8-10
Figure 6. Contrast Enhancement Filters
100% Screening
Test Screen
Table I. Quality Level A of MIL-D-87157
MIL-STD-750
Method
Conditions
1. Precap Visual
2072
Interpreted by HP Procedure 5956-7512-52
2. High Temperature Storage
1032
T A = 1250 C, Time" 24 hours[31
3. Temperature Cycling
1051
Condition B, 10 cycles, 15 min. dwell
4. Constant Acceleration
2006
10,000 G's at Y1 orientation
5. Fine Leak
1071
Condition H
6. Gross Leak
1071
7.
Interim Electrical/Optical Tests[1)
-
Condition C
Icc (at VB ~ DAV and 2.4V), feOL (at VB
OAV and 2AV)
=
ilH (VB, Clock and Data In), ilL (VB, Clock
and Data In), IOH, IOL
and Iv Peak. VIH and VIL inputs are
guaranteed by the electronic shift
register test. TA = 2S"C
8. Burn-lnPl
1015
Condition B at Vee = VB"" 5.25V, VeOl =
3.5V, TA=+85°C,
LED ON-Time Duty Factor = 5%,35 Dots
On; t'" 160 hours
9. Final Electrical Test[2]
-
Same as Step 7
10. Delta Determinations
-
Alee"" ±6 rnA, AhH (clock) = ±8I'A,
AhH (Data In) = ±51'A
AloH = ±SO /lA, and Alv '" -20%,
TA = 25°C
11. External Visuall ' )
2009
Notes:
1. MIL-STD-883 Test Method applies.
2. limits and conditions are per the electrical/optical characteristics. The 10H and 10 tests are the inverse of VOH and VOL specified in the
electrical characteristics.
3. TA = 100' C for HDSP-2453.
7-239
Table II. Group A Electrical Tests - MIL-D-87157
SubgrouplTesl
Parameters
Subgroup 1
DC Electrical Tests at 25°C111
LTPD
Icc (at Va = OAV and 2.4V). ICOL
(at Va = 0.4V and 2.4V)
hH (Ve, Clock and Data In), IlL (Ve. Clock and Data
In), IOH. IOL Visual Function and Iv peak. VIH and Vil
Inputs are guaranteed by the electronic shift
register test.
5
Subgroup 2
DC Electrical Tests at High
Temperaturel1l
Same as Subgroup 1, except delete Iv and visual
function, T A = +S5c C
7
Subgroup 3
DC Electrical Tests at Low
Temperature l11
Same as Subgroup 1, except delete Iv and visual
function, TA "" -55"C
7
Subgroup 7
Optical and Functional Tests at 25°C
Satisfied by Subgroup 1
5
Subgroup 8
External Visual
MIL-STD-S83 Method 2009
7
Subgroup 4, 5, and 6 not applicable
Note:
1. Limits and conditions are per the electrical/optical characteristics. The IOH and IOL tests are the inverse of VOH and VOL specified in the electrical characteristics.
Table /IIa. Group B,Class A and B of MIL-D-87157
SubgrouplTest
Subgroup 1
Resistance to Solvents
Internal Visual and
DeSign Verlfication[1j
Subgroup 2[2,3}
Soldera.bility
Subgroup 3
Thermal Shock (Temp. Cycle)
Moisture Resistance[4!
Fine Leak
Gross Leak
Electrical/Optical Endpoints[5)
Subgroup 4
Operating Life Test (340 hrs.}
MIL-STO-750
Method
Conditions
Sample SIze
4 Devices!
Failures
1 Device!
Failures
1022
o
,2075[7)
o
2026
TA '" 245" C for 5 Seconds
LTPD=15
1051
1021
1071
1071
Condition 81, 15 Min. Dwell
LTPD==15
-
1027
Condition H
Condition C
Icc (at VB - OAV and 2.4VI,
leoL (at Ve "" 0.4V and 2.4V),
hH (Va, Clock and Data In), ill (VB,
Clock and Data Inl, IOH, 10L Visual
Function and Iv peak. VIH and V1L
inputs are guaranteed by the electronlc
shift register test. TA = 25" C
TA=+85¢C at Vee "'Va == 5.25V,
VeOL = 3.5V, LED ON-Time Duty Factor 5%, 35 Dots On
Same as Subgroup 3
LTPD=10
TA" +125"C[6j
LTPD == 10
=
Electrical/Optical Endpolnts[5j
SubgroupS
Non-operattng (Storage) Life
Test (340 hrs.1
Electrical/Optical Endpoints[S!
1032
-
Same as Subgroup 3
Notes:
1. Visual inspection is performed through the display window.
2. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used.
3. The LTPD applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads required.
4. Initial conditioning is a 15 0 inward bend for one cycle.
5. Limits and conditions are per the electrical/optical characteristics. The IOH and IOL tests are the inverse.of VOH and VOL specified in the electrical characteristics.
6. T A = 100°C for HDSP-2453.
7. Equivalent to MIL-STD-883, Method 2014.
7-240
Table IVa. Group C, Class A and B of MIL-D-87157
Subgroup/Test
Subgroup 1
Physical Dimensions
I"""· Subgroup 2[2J
Lead Integrityl? 9J
Fine Leak
Gross Leak
Subg:OUP3
Shock
Vibration, Variable Frequency
Constant Acceleration
External Visual1 4 1
Electrical/Optical Endpoints!8r
Subgroup 4[1.3)
Salt Atmosphere
External Visual1 4 1
MIL-STD:750
Method
Sample Sil:e
Conditions
2 Devices/
o Failures
2066
,g2~:§:·"""····
".""."""j
CondItion 62
Condition H
2004
1071
1071
Condition C
1500G. Time = 0.5 ms. 5 blows in
each orientatiol'f"X 1. Y1, Z1
2016
2056
2006
LTPD
= 15
10,000G'atY10rientation
1010 or 1011
-
Ice I at VB - OAV and 2AV I
leal (at VB = O.'ilV and 2AV)
IIH (VB. Clock and Data In)
ilL (VB, Clock and Data In)
IOH. loL. VisUal Function and Iv peak.
VIH and VIL inputs are guaranteed by
the electronic shift register
test. TA = 25"C.
1041
LTPD=15
1010 or 1011
Subgroup 5
60nd Strengthl51
2037
Condition A
Subgroup 6
Operating Life Testl 61
1026
TA = +85°C at Vee = VB 5.25V,
VeOl = 3.5V. 35 Dots On
Electrical/Optical EndpointslSI
,
-
LTPD= 20
IC=OI
=
A = 10
Same as Subgroup 3
Noles:
1. Whenever electrical/optical tests are not required as endpOints. electrical rejects may be used.
2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of leads
required.
3. Solderability samples shall not be used.
4. Visual requirements shall be as specified in MIL-STD-883. Methods 1010 or 1011.
5. Displays may be selected prior to seal.
6. If a given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements. the340 hour life tests
may be continued on test to 1000 hours in order to satisfy the Group C life test requirements. In such cases. either the 340 hour endpOint
measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both
Group B and Group C acceptance.
7. MIL-STD-883 test method applies.
8. Limits and conditions are per the electrical/optical characteristics. The IOH and IOl tests are the inverse of VOH and VOL specified in the
electrical characteristics.
9. Initial conditioning is a 15 degree inward bend. 3 cycles.
7-241
::;",
,,',','.:'
,
T
.
,
'
:
,'"
",
",',,,.,'
c"'··,,·
,
,
,',
,'\'"
-.'
.
,
'
.;,
,
~~,,'
:.'
,
Fiber Optics
•
•
Fiber Optic TransmitterlReceiver Components
Evaluation Cables, Connectors, and Accessories
Fiber Optics
HP's Commitment
Versatile Link Components
Hewlett-Packard has been committed to Fiber Optics
since the introduction of our first link in 1978. Years of
technological experience with LED emitters, detectors,
integrated circuits, precision optical packaging and
optical fiber qualify HP to provide practical solutions
for your application needs.
Low cost and ease of use make this family of link
components well suited for applications connecting
computers to terminals, printers, plotters, test
equipment, medical equipment and industrial control
equipment. These links utilize 665 nm technology and
1 mm diameter plastic fiber cable. Assembling the
plastic snap-in connectors onto the cable is extremely
easy. The HFBR-050l evaluation kit contains a
complete working link including transmitter, receiver, 5
metres of connectored cable, extra connectors, polishing
kit and technical literature.
HP's unique combination of technologies and high
volume manufacturing processes provide you with high
quality transmitter and receiver components to meet a
wide variety of computer, local area network,
telecommunication and industrial communication
needs.
Low Cost Miniature Link Components
This family offers a wide range of price/performance
choice for computers, central office switch, PBX, local
area network and industrial-control applications. These
components utilize 820 nm technology and glass or
plastic clad silica fiber cable. The unique design of the
lensed optical coupling system makes this family of
components extremely reliable. The Dual-In-Line
Package requires no mounting hardware. The package
is designed for auto insertion and wave soldering. These
components are available for use with industry standard
ST or SMA connectors. Specifications are provided for
four fiber sizes: 62.5/125 JJ.m, 50/125 JJ.m, 100/140 JJ.m
and 200 JJ.m Plastic Clad Silica (PCS) cable. Evaluation
kits are available for both ST and SMA connectors. A
transmitter, receiver, connectored cable and technical
literature are contained in the evaluation kits.
Three major families of fiber optic components offer a
wide range of application solutions. Each family is
designed to match HP's technology to your application
requirements resulting in minimum cost and maximum
reliability. The design and specification of each of these
families allow easy design-in and provide guaranteed
performance.
Hewlett-Packard's method of specification assures
guaranteed link performance and easy design-in. The
transmitter optical power and receiver sensitivity are
specified at the end of a length of test cable. These
specifications take into account variations over
temperature and connector tolerances. All families of
components incorporate the fiber optic connector
receptacle in the transmitter and receiver packages.
Factory alignment of the emitter/detector inside the
package minimizes the variation of coupled optical
power, resulting in smaller dynamic range requirements
for the receiver. The guaranteed distance and data rates
for various transmitter/receiver pairs are shown in the
following selection guide.
Hewlett-Packard offers a choice of fiber optic cable,
either glass fiber or plastic, simplex or duplex, factory
connectored or bulk. Connector attachment has been
designed for your production line economy.
8-2
FUTURE 1300 nm PRODUCT PLANS
1300 nm PRODUCTS UNDER DEVELOPMENT
HP Experience with 1300 nm Materials
Technology
Emitter and Detector Chip Development
The first two 1300 nm device chips developed at HP
were transferred onto our high volume manufacturing
lines in the middle of 1987. The chips are a doubleheterostructure surface-emitting, InGaAsP. LED and a
top-illuminated planar InGaAs PIN detector. These
chips have demonstrated extremely consistent
optoelectronic performance over many production
runs. They have also demonstrated outstanding
reliability performance based on accelerated life tests
performed at stress levels up to 200 degrees C and
times up to 5 K hours. These tests have lead to
estimations of failure rates which exceed by many
orders of magnitude the most stringent requirements of
commercial fiber optic applications.
HP begll:n the development of 1300 nm materials and
device technology in the early 1980's based on the
perceived needs for greater performance and reliability
in the markets for local fiber optic data links that we are
committed to serve.
These markets have requirements for links with data
rates in the 50 MBd to 1000 MBd range at distances
anywhere from a few hundred metres to tens of
kilometres. The fundamental transmission properties of
fiber optic waveguides dictate that the 1300 nm
wavelength region of operation will give lower
attenuation and chromatic dispersion with consequently
higher effective bandwidth for either multimode or
single mode fibers than can be obtained at the 820850 nm first wavelength window.
Additional 1300 nm devices are under investigation at
HP. These devices include: 1. Advanced surfaceemitting LED structures for enhanced coupled power.
into multimode and single mode fibers 2. Edge emitting
LED and Laser structures for use primarily with single
mode optical fibers.
These markets are. also demanding a level of reliability
in the 100-300 FIT range for fiber optic transceivers
used in commercial applications. The fundamental
physics of 1300 nm emitter devices show these materials
to be less susceptible to the primary failure mechanisms
found in 820 nm materials without any significant new
failure modes to offset the advantage. This results in
fundamentally superior reliability for 1300 nm devices,
and systems which use these devices, when they are
produced on controlled high volume manufacturing
lines.
Integrated Product Development
Parallel development is underway to develop package
designs and integrated circuits which will lead to fully
integrated transmitter and receiver products. The
integrated products will offer high performance to
system designers in user-friendly, logic-compatible
building blocks. This will allow the system designer to
obtain the benefit of high performance fiber optic links
without having to design the complex optics and analog
circuits that are contained within these products.
HP's fiber optic package designs are concentrating on
optimum optical coupling, thermal management and
high volume assembly techniques. The optical designs
are aimed at optimal solutions to interface our 1300 nm
emitter and detector chips to multimode and single
mode fibers via connectorized optical ports or fiber
pigtails. The thermal design efforts are aimed at
minimizing the thermal resistance from the III/V chips
and the support ICs to achieve the best possible device
reliability. High volume assembly techniques are
essential to provide consistant performance, high
8-3
reliability and cost effective products. HP is capitalizing
on its long history of packaging optoelectronic devices
to develop state of the art manufacturing techniques for
1300 nm products.
These products will be fully characterized and
guaranteed to meet the optoelectronic requirements of
the FDDI Local Area Network Standard now under
development as an American National Standard by
ASC X3T9.5. One version of this product will be
compatible with the mechanical requirements of the
duplex fiber optic connector receptacle under
development in the committee.
Hewlett-Packard has a large variety of IC processes
available for use in its integrated fiber optic transmitter
and receiver products. High speed processes such as
our 5 GHz silicon bipolar process are being used to
provide the sophisticated digital to analog transmitter
LED driver functions and very sensitive receiver
amplification and digitization functions. These custom
ICs are.being developed with the assistance ofHP
created computer models of the fiber uptic links and the
IC performance.
3. Discrete Emitter and Detector Products
A series of discrete products are being investigated in a
variety of package styles including TO style packages
without integral optics, complete optical subassembly
packages with integral optics and connector ports, and
pigtailed packages for optimum coupling to single mode
fibers.
Initial Product Plans
For Further Information
Some of the specific integrated products that will be
introduced in the near future (1988/9) are the
following:
For further information on these 1300 nm products,
contact your local HP Components Sales Representive
at the offices listed in the Appendix of this Catalog. You
may also contact the Optical Communication Division's
Product Marketing Department directly at 408-4357400 or by mail at 350 West Trimble Road, Mail Stop
90-2H2, San Jose, CA 95131-1096.
1. High Speed 40-200 MBd Transmitter and Receiver
Pair
These products will be available initially in the package
illustrated below with ST* fiber optic connector ports.
2. FDDI Compatible 125 MBd Transmitter and
Receiver Pair
*ST (R) is a registered trademark of AT&T for
Lightguide Cable Connectors.
8-4
------_._----
HP Fiber Optic Performance Characteristics
The charts on this page illustrate the performance
ranges of Hewlett-Packard's fiber optic components.
Both charts are coded by family. To determine which
family is appropriate for your deisgn, use the
distance/data rate chart (Figure 1). The performance of
each family incorporates the entire area below each
boundary. Specific component choices and their
associated optical-power budget are indicated in Figure 2.
100,000
1,1 VERSATILE LINK COMPONENTS
'lllI/J LOW
10,000
COST MINIATURE LINK COMPONENTS
E:J.:f}t!'J FUTURE HIGH PERFORMANCE 1300 nm MODULES
d! PRODUCTS UNDER INVESTIGATION
1,000
"C
::l
ca
.c
:a:
I
w
!:c
a:
~
100
10
-
1-'"
rna:
24041
~~
=:::::1
<.:>1-
HFBR-
=:!:
-':IE
2414
24041
~::
...
-
HFBR-
=
~ p~~~p
... :::::I"
PINI
. Preamp
&.LIEffi
a: c -,
i=gi5
:::::1..,=
"'-:IE
1300 nm
Module
1 A=820nm
140211412
1404/1414
I
HFBR-
HFBR-
1 A=820nm I
HFBR-
1404/1414
1300 nm
Module
I
1300nm
Module
..
-8.2
'@60mA
1
-10.3
,@60mA
'I
-8.2
@60mA '
1
-8.5
@60mA
1
@-~'~A
1
-12.0
@60mA
1
-16.5·
@60mA
I
I
FIBER SIZE [I'm) [ATTENUATION)
1000
(0.25 dB 1m)
1000
(O.25dB/m)
1000
(0.25 dB/m)'
1000
(O.25dB/m)
200 PCS
(5.3dB/km)
100/140
62.5/125
50/125
62.5/125
62.5/125
(3.3dB/km)
(2.8dB/km)
(2.BdB/km)
(2.BdB/km)
(2.BdB/km)
5MBd
40m
1 MBd
65m
1 MBd
35m
40 KBd
'125m
I-
;;;
;:::
r;;
z
...
""
..
-36
-33
5MBd
3.5Km
' 5MBd
4.rKm
5MBd
' 4.7Km
5MBd
3.2Km
5MBd
5.6Km
5MBd
7.3Km
' 5MBd
' 8.6Km
5MBd
7.0Km
30MBd
6OOm"
30MBd
3.0Km"
30MBd
4.0Km"
30MBd
4.0Km"
"
PINI
Preamp
-35.6
30MBd
65Om",
30.MBd
3.3Km"
30MBd
4.5Km"
30MBd
4.5Km"
PINI
Preamp
-32,
100 MBd
130m"
100 MBd
75Om"
100 MBd
1.0Km"
100 MBd
1.0Km"
Logic
IC
125 MBd
2.0Km
Logic
IC
200 MBd
2-0Km
-----
Future 1300 nm modules are discussed on page 8-3.
"Distance is limited by a combination of fiber bandwidth and transmitter optical riselfall time and LED spectral width.
'"I!!
<0
'"
ii:
co
:::I
'-
1300 nm
Module
--::-
1 A=820nm
1402/1412
-
24061
2416
A=820nm
HFBR-
COUPLED OPTICAL POWER [dBm)
-25.4
-, HFBR24061
2416'
HFBR-
1523il533
'-
24021
~
l A=665nm I
1522/1532; 1524/1534
"---
HFBR-
z
::;
-21.6
logic
IC
25211
-11.1
@60mA
A= 665nm
HFBR- "
1 A=665nm I,
152111531
I
Fiber Optic Selection Guide
The newer transmitter/receiver product families located at
the front of the selection guide provide the designer with
significantly improved price/performance benefits over
older products. These newer product families have been
specifically designed for easy use in high volume
manufacturing operations. Each can be auto-inserted and
wave soldered. No mounting hardware is required.
The optical-power budget is determined by subtracting the
receiver sensitivity (dBm) from the transmitter optical
output power (dBm). The distance specification can be
calculated simply by dividing the optical-power budget
(dBm) by the cable attenuation (dBlkm).
Versatile Link Family
Features: Dual-in-line package. horizontal and vertical PCB mounting. plastic snap-in connectors.
specified for 1 mm dia. plastic fiber. TIL/CMDS compatible output. auto insertable. wave solderable.
$~
Products/Part Numbers
Page
No.
Description
Evaluation Kit
HFBR-0501
HFBR-1524 Transmitter. HFBR-2524 Receiver. 5 metre connectored
cable. connectors, bulkhead feedthrough adapter, polishing kit,
literature.
8-13
Transmitter/Receiver Pairs
5 MBd High Performance Link
1 MBd High Performance Link
1 MBd Standard Performance
Link
40 KBd Extended Distance Link
Low Current Link
Photo Interrupter Link
Horizontal
Vertical
HFBR-1521/2521 HFBR-1531/2531
HFBR-1522/2522 HFBR-1532/2532
40iil
Distance'
65m
1 MBd
HFBR-1524/2524' HFBR-1534/2534
HFBR-1523/2523 HFBR-1533/2533
HFBR-1523/1523 HFBR-1533/2523
HFBR-1523/1523 HFBR-1533/1523
HFBR-1522/2522 HFBR-1532/2532
35 m
. 125 m
40 m
NA
NA
1 MBd
40 KBd
40 KBd
20 KHz
500 KHz
Data Rate
5M'8d
Plastic Fiber Cable
Standard Attenuation
Improved Attenuation
Simplex
Various PIN
Various PIN
Duplex
Various PIN
NA
Connectored cable available in standard lengths.
Unconnectored cable available in 500 m reels.
HFBR-4501
HFBR-4511
HFBR-4503
HFBR-4513
HFBR-4506
Gray connector/crimp ring
Blue connector/crimp ring
Gray connector/crimp ring
Blue connector/crimp ring
Parchment connector/crimp ring
Connectors
Simplex Standard
Simplex Latching
Duplex
Polishing Kit
HFBR-4593
Bulkhead Feedthrough/in-line splice
HFBR-4505
HFBR-4515
Plastic polishing fixture (used for ali connectors), abrasive
paper, lapping film
Gray bulkhead feedthrough adapter
Blue bulkhead feedthrough adapter
'Link performance at 25'C, improved attenuation cable.
8-7
._.
__ .
--- ----._---
---------
-----
Low Cost Miniature Link Family
Features: Dual-in-line package, interfaces directly with ST or SMA connectors, specified for use with
50/125 I'm, 62.5/125 I'm, 1001140 I'm and 200 I'm Plastic Coated Silica (PCS) fiber. Auto insertable,
wave solderable, no mounting hardware required.
~
Evaluation Kits
HFBR-0410 (ST)
Page
No.
Description
Products/Part Numbers
8-37
HFBR-1412 transmitter, HFBR-2412 receiver, 3 metre connectored
cable, literature
HFBR-1402 transmitter, HFBR-2402 receiver, 2 metre connectored
cable, literature
HFBR-0400 (SMA)
Transmitter/Receiver Pairs
ST Series
SMA Series
Optical Power Budget'
HFBR-1412/2412
HFBR-1402/2402
20.5 dB (200 I'm fiber)
15 dB (100/140 I'm fiber)
5 MBd
5 MBd
HFBR-1414/2412
HFBR-1404/2402
15 dB (62.5/125 I'm fiber)
10.5 dB (50/125 I'm fiber)
5 MBd
5 MBd
HFBR-1412/2414
HFBR-1402/2404
18 dB (100/140 I'm fiber)
13.5 dB (100/140 I'm fiber)
5 MBd
30 MBd
HFBR-1414/2414
HFBR-1404/2404
18 dB (62.5/125 I'm fiber)
13.5 dB (62.5/125 I'm fiber)
5 MBd
30 MBd
HFBR-1412/2416
HFBR-1402/2406
21 dB (100/140 I'm fiber)'
19 dB (100/140 I'm fiber)
30 MBd
150 MBd
HFBR-1414/2416
HFBR-1404/2406
21 dB (62.5/125 I'm fiber)
19 dB (62.5/125 I'm fiber)
30 MBd
100 MBd
Data Rate
HFBR-1412 Standard transmitter - ST
HFBR-1402 Standard Transmitter - SMA
Optimized for large size fiber such as 100/140 I'm and 200 I'm PCS
HFBR-1414 High Power Transmitter - ST
HFBR-1404 High Power Transmitter - SMA
Optimized for small size fibers such as 50/125 I'm or 62.5/125 I'm
HFBR-2412 5 MBd Receiver - ST
HFBR-2402 5 MBd Receiver - SMA
TTL/CMOS compatible receiver with -25.4 dBm sensitivity
HFBR-2414 25 MHz Receiver - ST
HFBR-2404 25 MHz Receiver - SMA
PIN - preamp receiver for data rates up to 35 MBd
HFBR-2416 125 MHz Receiver - ST
HFBR-2406 125 MHz Receiver - SMA
PIN - preamp receiver for data rates up to 150 MBd
, Link performance at 25°C.
8-8
Connectored Cable for Versatile Link
~~
,
Features: Fully specified fiber cable, simplex or duplex (zip cord style), factory installed connectors or
unconnectored, standard or improved attenuation cable, standard simplex, simplex latching or duplex
connectors.
Description
Product!
Part Number
Siandard Improved Latching
Plasllc
Plastic Slmpl"
N.w PIN
Did HP PIN
P
Q
L
Standard
Slmpl"
N
Dupl"
Unean·
neclared
Singi.
Channel
M
U
S
HFBR·PNSIOM ·3511
X
X
X
·PNS5DM ·3512
X
X
X
·PNSDDI
·3513
X
X
X
·PNSDD5
·3514
X
X
X
·PNSD10
·3515
X
X
X
·PNS020
·3516
X
X
·PNS030
·3517
X
·PNS045
·3518
X
X
X
X
·PNS06O
·3519
X
HFBR·ONSOOI
·3530
X
X
·QNS005
·3530
X
·3530
X
·QNS02D ·3530
X
X
X
X
X
·QNS010
·QNS03O ·3530
X
X
·QNS045
·3530
X
X
X
·ONS060
·3530
X
X
HFBR·PL51DM ·3521
X
·PL55DM ·3522
X
X
X
X
X
·PL5001
·3523
·PL5DD5
·3524
·PL5010
·3525
·PL5020
·3526
X
X
·PL5030
·3527
X
·PL5045
·3528
·PL5060
·3529
X
X
HFBR·QL5001
·3540
X
·OL5005
·3540
·QL5010
-3540
X
X
·OL5020
·3540
·QL503O
·3540
·QL5045
·3540
·QLS060
·3540
HFBR·PMD5DM ·3632
·PMDDDI
·3633
·PMDDD5 ·3634
·PMD010
·3635
·PMDD20 ·3636
·PMD03O ·3637
·PMD045 ·3638
·PMD060 ·3639
HFBR·PND5DM ·3612
10 M 20M
30M 45M 60M
005
DID
030
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
·PNDOOI
·3613
·PNDOO5
·3614
X
X
X
X
·PND010
·3615
X
·PND020
·3616
·PND03O
·3617
X
X
X
X
X
·PND045
·3618
·PND060
·3619
X
X
HFBR·PU5600
·3581
X
·QU5500
·3582
·PUD500
·3681
500
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Pago
N~
8-13
X
X
X
X
X
500M
X
X
X
060
X
X
X
045
X
X
X
X
X
D20
X
X
X
X
X
X
X
10M 5DM 001
5M
X
X
X
X
X
X
X
0
X
X
X
X
X
X
Dual
Channel [I M [5M 1M
X
X
X
X
X
Cabl. Length
Cabl. Typo
Conneclor Slyi.
fiber TIP'
X
X
X
X
X
X
X
X
X
X
8-9
.........- . - . - -...
~~~~~~-
ST Connectored Evaluation Cables
Features: Evaluation cables for link testing. factory installed ST connectors. simplex cables only.
Description
Fiber Size (I'm)
Part Number
62.5/125
1001140
50/125
Length
Conneclor
Cable
ST·Ceramlc
Simplex
1 metre
X
HFBR·AXS001
X
X
X
HFBR·AXS010
X
X
X
HFBR·BXS001
X
X
X
HFBR·BXS010
X
X
X
HFBR·GXS001
X
X
X
HFBR·GXS010
X
X
X
Page
No.
10 metres
8-37
X
X
X
X
X
SMA Connectored Cable
Features: Fully specified fiber cable. simplex or duplex (zip cord style). factory installed SMA connectors
or unconnectored.
Description
Fiber Size
Connector Style
Cable Type
Cable Length
Single
Channel
Dual
Channel
1M
5M
10M 25 M 50 M 100M
S
0
001
005
010
Productl
Part Number
100/140
SMA
Uncon·
nectored
Old HP PIN
A
W
U
HFBR·AWS001
-3000
X
X
X
·AWS005
-3000
X
X
X
·AWS010
-3021
X
X
X
-AWS025
-3000
X
X
X
-AWS050
-3000
X
X
X
-AWS100
·3000
X
X
X
HFBR-AWD005
·3100
X
X
X
1000 M
lKM
X
X
X
X
X
X
-3100
X
X
X
-AWD050
-3100
X
X
X
-AWD100
·3100
X
X
X
HFBR-AUS100
·3200
X
X
X
·3200
X
X
X
-3300
X
X
X
-3300
X
X
X
X
X
X
X
X
X
X
8-10
Page
No.
8-57
X
·3100
·AUD1KM
100
X
·AWD010
HFBR·AUD100
050
X
·AWD025
·AUS1KM
025
X
X
Snap-In Link Family
Features: Operate with 1 mm dia. plastic fiber, plastic snap-in connector compatible (standard simplex only),
TIL compatible output.
~
FOR NEW DESIGNS: Refer to the Versatile Link Family on page 8-13 to achieve the best price/performance
value.
Transmitter/Receiver Pairs
5 MBd Link
1 MBd Link
Extended Distance Link
Low Current Link
Photo tnterrupter Link
Page
No.
Description
Products/Part Numbers
Data Rate"
5MBd
1 MBd
40 kBd
40 kBd
20 kHz
500 kHz
Distance"
40 metre
65 metre
125 metre
40 metre
N/A
N/A
HFBR-1510/-2501
HFBR-1502/-2502
HFBR-1512/-2503
HFBR-1512/-2503
HFBR-1512/-2503
HFBR-1502/-2502
8-60
"Link performance at 25°C, improved attenuation cable.
Miniature Link Family
Futures: Interfaces directly with SMA style connectors, specified for use with 100/140 I'm fiber.
Precision metal connector interface.
FOR NEW DESIGNS: Refer 'to the Low Cost Miniature Link Family on page 8-37 to achieve the best
price/performance value.
Distance"
800 metre
1200 metre
1800 metre
2100 metre
500 metre (typical)
Transmitter/Receiver Pairs
HFBR-1202/-2202
HFBR-1202/-2204
HFBR-1204/-2202
HFBR-1204/-2204
HFBR-1204/-2208
Mounting Hardware
HFBR-4202
Page
No. ,
Description
Products/Part Numbers
Data Rate"
5 MBd
40 MBd
5 MBd
40 MBd
125 MBd (typical)
PCB mounting bracket, EMI shield, mise, hardware
for HFBR-1202/-1204/-2202/-2204/2208.
"Link performance at 25°C.
8-11
8-78
The following products are available but not recommended for new designs.
For lIIerature on these products please contact your local HP sales oillce.
Products/Part Nos.
Description/Features
Transmitter/Receiver Pairs
Specified for 100/140 I'm fiber, HP style connector, TIL compatible, Link monitor.
Distance'
Data Rate'
Connector Style
180 metre
10 MBd
HFBR-4000
1500 metre
10 MBd
HFBR-4000
HFBR-1001/-2001
HFBR-1002/-2001
RS·232-CIV.24 to Fiber Optic Multiplexer
39301A Multiplexer
PIN Photodiodes
5082-4200 Series
1250 metres length, 19.2 kbps/channel data rate, 16 channels RS-232-C Input/Output
High Speed PIN Photodiodes for use in Fiber Optic Applications
Variety of packages, high speed, low capacitance, low noise.
HP Style Connectors
HFBR-4000
HFBR-3099
Metal body. metal ferrule
Connector-connector junction. bulkhead feedthrough for HFBR-4000 connector.
HP Style Connector Assembly Tools
HFBR-0100
HFBR-0101
HFBR-0102
Field installation kit for HFBR-4000 connectors (includes case. tools, consumables)
Replacement consumables for HFBR-0100 Kit
Custom tool set only
HP Style Connectored Cable
Fully specified 100/140 I'm fiber cable, simplex or duplex (zip cord style), factory installed
HP style connectors
Description
Fiber Size
Connector Style
Cable Type
Cable Length
Uncon·
nectored
Single
Channel
Dual
Channel
1M
5M
10 M 25 M 50 M 100 M
U
S
0
001
005
010
100/140
HFBR·
4000
Old HP PIN
A
H
HFBR-AHS001
-3000
X
X
X
-AHS005
-3000
X
X
X
-AHS010
-3001
X
X
X
-AHS025
-3000
X
X
X
-AHS050
·3000
X
X
X
-AHS100
·3000
X
X
X
HFBR-AHD005
-3100
X
X
X
-AHD010
-3100
X
X
X
-AHD025
·3100
X
X
X
-AHD050
·3100
X
X
X
-AHD100
-3100
X
X
X
Product!
Part Number
8-12
025
050
100
X
X
X
X
X
X
X
X
X
X
X
VERSATILE LINK
Fli;-
HEWLETT
~~ PACKARD
The Versatile Fiber
Optic Connection
HFBR-OS01
SERIES
Features
• LOW COST FIBER OPTIC COMPONENTS
• GUARANTEED LINK PERFORMANCE OVER
TEMPERATURE
High Speed Links: dc to 5 MBd
Extended Distance Links: up to 82 m
Low Current Link: 6 rnA Peak Supply Current
Low Cost Standard Link: dc to 1 MBd
Photo Interrupter Link
• COMPACT, LOW PROFILE PACKAGES
Horizontal and Vertical Mounting
"N-plex" Stackable
Flame Retardant
• EASY TO USE RECEIVERS
TTL, CMOS Compatible Output Level
High Noise Immunity
• EASY CONNECTORING
Simplex, Duplex and Latching Connectors
Flame Retardant Material
Versatile Link Applications
• Reduction of lightning/Voltage transient
susceptability
• LOW LOSS PLASTIC CABLE
Selected Super Low Loss Simplex
Simplex and Zip Cord Style Duplex
Flame Retardant
• Motor controller triggering
o Data communications and Local Area Networks
• Electromagnetic Compatibility (EMC) for
regulated systems: FCC, VDE, CSA, etc.
• NO OPTICAL DESIGN REQUIRED
• AUTO-INSERTABLE AND WAVE SOLDERABLE
• Tempest-secure data processing equipment
• DEMONSTRATED RELIABILITY @40°C
EXCEEDS 3 MILLION HOURS MTBF
• Isolation in test and measurement instruments
o Error free signalling for industrial and
manufacturing equipment
Description
o Automotive communications and control networks
The Versatile Link series is a complete family of fiber optic
link components for applications requiring a low cost
solution. The HFBR-0501 series includes transmitters, receivers, connectors and cable specified for easy design.
This series of components is ideal for solving problems
with voltage isolation/insulation, EMI/RFI immunity or data
security. The Link design is simplified by the logic compatible receivers and complete specifications for each
component. No optical design is necessary. The key optical
and electrical parameters of links configured with the
HFBR-0501 family are fully guaranteed from 0° to 70° C. A
wide variety of package configurations and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver components have been designed for use in high
volume/low cost assembly processes such as autoinsertion and wave soldering.
• Communication and isolation in medical
instruments
o Power supply control
8-13
• Noise immune communication in audio and video
equipment
• Remote photo interrupter for office and industrial
eqUipment
• Robotics communication
Link Selection Guide
Specific Product Numbers and Component Selection Guide on page 23.
~plcal
Guaranteed Minimum Link Length
Metres
V$reatlle Link
=
0·C·70·C
~--$.-
Standard
Cable
Improved
Cable
12
17
Link Length
Metres
25"C
25°C
Standard
Cable
Page
Standard
Cable
Improved
Cable
17
24
35
40
8-16
30
41
50
65
8-16
-
30
35
8-16
100
125
8-16
Improved
Cable
MBd
24
Low Current Link
40 kBd
8
11
Extended Distance
Link
40 kBd
60
82
65
90
1 MBd
5
7
30
40
8-16
N.A.
11
N.A.
15
500kHz
N.A.
N.A.
N.A.
8-22
Contents: Horizontal transmitter. horizontal receiver packages: 5
metres of simplex cable with simplex and simplex latching connectors instalted; individual connectors: simplex, duplex, simplex
latching, bulkhead adapter; polishing tool. abrasive paper, literature.
8-35
High Performance
Standard
Photo Interrupter
EvaluatIon Kit
1 MBd
(Standard)
versatile Link Product Family
5 MBd, 1 MBd and 40 kBd FIBER OPTIC LINKS
Simplex Link - Horizontal Packages
Simplex Link - Vertical Packages
Duplex Link - Combination 01 Horizontal & Vertical Packages
N-Plex Link - Comblnallons
8-14
Table of Contents
Designing with versatile link
Versatile Link Configurations ........................ 2
Versatile Link Product Description .................... 3
Designing with Versatile Link ........................ 3
Manufacturing with Versatile Link .................... 4
Versatile Link Performance
High Performance 5 MBd Link .................... 4
High Performance 1 MBd Link .................... 4
Low Current Extended Distance 40 kBd Link ....... 4
Standard 1 MBd Link ............................ 4
Versatile Link Design Considerations ................. 7
Photo-Interrupter Link .............................. 10
Transmitter Specifications .......................... 11
Receiver Specifications ............................ 13
Cable Specifications ............................... 15
Connector Descriptions ............................ 16
Connector Specifications .......................... 18
Connectoring ..................................... 18
Versatile Link Mechanical Dimensions ............... 20
Component Selection Guide ........................ 23
When designing with Versatile Link, the following topics
should be considered:
Distance and Data Rate
Distances and data rates guaranteed with Versatile Link
depend upon the Versatile Link transmitter/receiver pair
chosen. See the Versatile Link guide (Page 4).
Typically, a data rate requirement is first specified. This
determines the choice of the 5 MBd, 1 MBd or 40 kBd
Versatile Link components. Distances guaranteed with Versatile Link then depend upon choice of cable, specific
drive condition and circuit configuration. Extended distance
operation is possible with pulsed operation of the LED
(see Figure 2a, 2b, 2c, 2d, 2e and 2f dotted lines.)
Drive circuits are described on page 7. Cable is discussed
on page 15. Pulsed operation of the LED at larger current
will result in increased pulse width distortion of the receiver
output signal.
Versatile Link can also be used as a photo interrupter at
frequencies up to 500 KHz. This is described on page 10.
versatile link
Product Description
Mechanical: The compact Versatile Link package is made
of a flame retardant material (UL V-D) in a standard, eight
pin dual-in-line package (DIP) with 7.6 millimetre (0.3 inch)
pin spacing. Vertical and horizontal mountable parts are
available. These low profile Versatile Link packages are
stackable and are enclosed to provide a dust resistant seal.
Snap action simplex, simplex latching, and duplex connectors are offered with simplex or duplex cables.
Electrical: Transmitters incorporate a 660 nanometre light
emitting diode (LED). Receivers include a monolithic DC
coupled, digital IC receiver with open collector Schottky
output transistor. An internal pullup resistor is available for
use in the HFBR-25X1/2/4 receivers. Transmitter and receiver are compatible with standard TTL circuitry. A shield
has been integrated into the receiver IC to provide additional, localized noise immunity.
Optical: Internal optics have been optimized for use with
1 mm diameter plastic optical fiber. Versatile Link specifications incorporate all component interface losses. Therefore,
the need of optical calculations for common link applications is eliminated.
Optical power budget is graphically displayed to facilitate
electrical deSign for customized links.
Package Orientation
As shown in the photograph, Versatile Link is available in
vertical and horizontal packages. Performance and pinouts
for the two packages are identical. To provide additional
attachment support for the Vertical Versatile Link housing,
the designer has the option of using a self-tapping screw
(2-56) through a printed circuit board into a mounting hole
at the bottom of the package. For most applications this is
not necessary.
Connector Style
As shown, Versatile Link can be used with three snap-in
connectors: simplex, simplex latching, and duplex.
The simplex connector is intended for applications requiring
simple, stable connection capability with a moderate retention force. The simplex latching connector provides similar
convenience with a larger retention force. Connector/cable
retention force can be improved by using a RTV adhesive
within the connector. A suggested adhesive is 3M Company
product: RTV-739.
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connections. Versatile Link transmitters are gray and Versatile Link
receivers are blue.
The duplex connector connects a cable containing two
fibers to two similar Versatile Link components. A lockout
feature ensures the connection can be made in only one
orientation. The duplex connector is intended for Versatile
Link components "n-plexed" together, as discussed in the
next section.
N-plexing
Versatile Link components can be stacked or interlocked
(n-plexed) together to minimize use of printed circuit board
space and to provide efficient, dual connections via the
duplex connector. Up to eight identical package styles can
be n-plexed and inserted by hand into a printed circuit
board without difficulty. However, auto-insertability of
stacked units becomes limited when more than two packages are n-plexed together.
8-15
Cable
Two cable versions are available: Simplex (single channel)
and color coded duplex (dual channel). Each version of the
cable is flame retardant (UL VW-1) and of low optical loss.
Two grades of the simplex cable are available: standard
cable and improved cable. Improved cable is recommended
for applications requiring longer distance needs, as reflected
in the Link Selection Guide on page 2. Flexible cable
construction allows simple cable installation techniques.
Cables arediscussed in detail on page 15.
Accessories
A variety of accessories are available. The bulkhead feedthrough adapter discussed on page 16 can be used to
mate two simplex snap-in connectors. It can be used either
as a splice or a panel feedthrough for a panel thickness
< 4.1 mm (0.16 inch).
Manufacturing with
versatile Link
Non-stacked Versatile Link parts require no special handling
during assembly of units onto printed circuit boards. Versatile Link components are auto-insertable. When wave
soldering is performed with Versatile Link components, an
optical port plug is recommended to be used to prevent
contamination of the port. Commercially available port
plugs are obtainable from companies such as Sinclair &
Rush Co., Saint Louis, MO. Water soluable fluxes, not rosin
based fluxes, are recommended for use with Versatile Link
components. Proper cleaners are Freon TMS (DuPont) and
halide-free solvents.
Refer to the Connectoring Section on page 18 for details of
connectors and cable connectoring.
Several accessories are offered to help with proper fiberl
connector polishing. These are shown on page 16.
versatile Link performance
5 MEGABITS PER SECOND (NRZ)
1 MEGABIT PER SECOND (NRZ)
40 KILOBITS PER SECOND (NRZ)
The 5 Megabaud (MBd) Versatile Link is guaranteed to
perform from DC to 5 Mb/s (megabits per second, NRZ).
Distances up to 17 metres are guaranteed when the transmitter is driven with a current of 60 milliamperes. This
represents worst case performance throughout the temperature range of 0 to 70 degrees centigrade. With the required
drive circuit of Figure 1b and at 60 milliamp drive current,
the 1 Megabaud Versatile Link has guaranteed performance
over 0 to 70 degrees centigrade from DC to 1 Mb/s (NRZ)
up to 34 metres.
The low current link requires only 6 mA peak supply
current for the transmitter and receiver combined to achieve
an 11 metre link. Extended distances up to 82 metres can
be achieved at a maximum transmitter drive current of
60 mA peak. The 40 kBd Versatile Link is guaranteed to
perform from DC to 40 kbis (NRZ) over 00 to 70 0C up to
the distances just described.
Receivers are compatible with LSTTL, TTL, CMOS logic
levels and offer a choice of an internal pull-up resistor or
an open collector output. Horizontal or vertical packages
provide identical performance and are compatible with
simplex, simplex latching, and duplex connectors. Refer to
the connector section (page 16) and the cable section
(page 15) for further information about these products. A
list of specific part numbers is found below and in the
Selection Guide on page 23.
VERSATILE LINK GUIDE
Cable Link Length
Unit
VersaUle Link
High Performance
High Performance
5MBd
1 MBd
Low Current!
Extended Distance
40kBd
Standard
1MBd
Horizontal
Package
Vertical
Package
Tx
HFBR-1521
HFBR-1531
Rx
HFBR-2521
HFBR-2531
Tx
HFBR-1522
HFBR-1532
Rx
HFBR-2522
HFBR-2532
Tx
Rx
HFBR-1523
HFBR-2523
HFBR-1533
HFBR-2533
Tx
HFBR-1524
HFBR-1534
Rx
HFBR-2524
HFBR-2534
8-16
Standard
Cable
Improved
Cable
12 metres
17 metres
24 metres
34 metres
8 metresi
60 metres
11 metresl
82 metres
5 metres
7 metres
RECOMMENDED OPERATING CONDITIONS
Pii'rameter
Ambient Temperature
Transmitter
Peak Forward Current
Avg, Forward Cur(ept
Receiver
Supply Voltage
.....;.
Min.
Max.
Units
TA
0
70
°C
IF PK
10
750
IF AV
o
HFSR-25X1/25X2/25X4
HFSR-2§Xl(25X2/25X4
Vee
4.50
5.50
4.75
5,25
m.~ ........
V
1
N
HFSfl;,2SX1!25X2!2q«4
;
."
;;.
18
HFSR-2$X3
Note 1,8
V
Vee
Vo
Ret.
;. . . . ;:•. ~1', • .•. . . . . . .
~O
......;.>...
HFSR-2Q 3
Output Voltage' HE§R-25X3
Fanout (TTU
Symbol
Note2
;;
...,.•i;.
5
SYSTEM PERFORMANCE Under recommended operating conditions unless otherwise specified.
I:':::;
Parameter
Symbol
'JI,tp.[5]
de
Data Rate
High
Performance
5MSd
Min.
Link Distance
with
Standard Cable
Q
Link Distance
with
Improved Cable
Q
Max.
Units
COI'\~itions
5
MSd
SER':oS 10-9, PRSS: 21-1
12
17
35
17
24
40
m
IpPK=60mA
m
IFPK=60mA.25·C
Ref.
Fig.2a
Note 7
m
IFPK=60mA
m
iFPK=60mA,25°C
Rl =5600, CL =30pF
Q =0.5 metre
-21 ,6S PRS-9.5 dSm
Fig.3,5
Notes 3, 6
P R=-15dSm
RL =5600, CL =30pF
Fig. 3,4
Note 4
Fig.2b
Note 7
_ _ .... 00.
Propagation
Delay
PulseWidlh
Distortion
tpLH
80
140
ns
tpHL
50
140
ns
tD
30
Data Rate
dc
Link Distance
with
Standard
Cable
30
ns
1
24
High
Performance
1MBd
50
Propagation
Delay
Pulse Width
Distortion
IFPK=60mA
m
IFPK=60 mA, 25°C
m
60
m
50%
I FPK =120mA
Duty
IFPK = 120 mA, 25·C Factor
m
IFPK=60mA
65
m
IfPK = 60 mA, 25·C
m
50%
IFPK=120mA
Duty
IFPK = 120 mA, 25°C Factor
30
36
41
£
44
51
SER S 10-9, PRBS: 27_1
m
Q
34
Link Distance
with
Improved
Cable
MSd
75
m
tpLH
180
250
ns
tpHL
100
140
ns
to
80
ns
8-17
Fig.2a
Notes
1,7,8
Fig.2b
Notes
1,7,8
RL =5600, CL =30 pF
Q = 0.5 metre
PR=-24dBm
Fig. 3, 5
Notes 3, 8
PR=-24dBm
RL =5600, C L =30pF
Fig. 3, 4
Notes 4, 8
SYSTEM PERFORMANCE Under recommended operating conditions unless otherwise specified.
Link
Low Current/
Extended
Distance
40k8d
Parameter
Symbol
Min.
Typ.t5]
Max.
dc
Q
8
30
m
IFPK ~ 2 mA
60
100
m
IFPK=60 mA
link Distance
with
Improved Cable
Q
11
35
m
IpPK" 2 mA
125
m
IpPK" 60 mA
RL " 3.3 kO, CL " 30 pF
" 1 metre
PR'" -25 d8m
4
,..s
tpHL
2.5
,..s
7.0
D
1
dc
5
Link Distance
with
11
30
12
1B
40
?
link Distance
with
Improved
Cable
Propagation
Delay
Pulse Width
Distortion
P.s
MBd
15
40
-39 S; PR S; -14 dBm
25
50
m
I fPK " 60 mA, 25°C
m
i FPK "120mA
Fig. 3, 6
Note 4
Fig.2e
Notes
1,7,8
m
50%
Duty
tFPK" 120mA, 25"C Factor
m
I FPK =60mA
m
i FPK "60mA,25°C
m
lVPK" 120mA
m
IpPK =120mA, 25°C
RL = 560n. CL =30pF
£ =0.5metre
PR"-20d8m
Fig. 3, 5
Notes 3, 8
PR=-20d8m
RL "560H, CL =30pF
Fig. 3,4
Notes 4, 8
tpLH
180
250
ns
tpHL
100
140
ns
to
80
Noles:
1. For IFPK > 80 rnA, the duty factor must be such as to keep
IFOe ,; 80 rnA. In addition, for IFPK > 80 rnA, the following
rules for pulse width apply:
I FPK'; 160 rnA: Pulse width,; 1 ms
IFPK'" 160 rnA: Pulse width,; 1 its, period", 20 itS.
2. It is essential that a bypass capacitor (0.01 ItF to 0.1 ,..F
ceramic) be connected from pin 2 to pin 3 of the HFBR25X1I25X2/25X4 receivers and from pin 2 to pin 4 of the
HFBR-25X3 receiver. Total lead length between both ends of
the capacitor and the supply pins should not exceed 20 mm.
3. The propagation delay for one metre of cable is typically 5 ns.
Fig. 3,?
Note 3
8ER S; 10-9, PR8S: 27.1
I FPK =60mA
Q
17
Fig.2d
Note?
RL '" 3.3 kG, CL " 30 pF
m
Q
Standard
Cable
Fig.2c
Note?
B2
tpLH
Data Rate
Ref.
SER:S; 10-9, PRSS: 27_1
Data Rate
Pulse Width
Distortion
Standard
1MBd
k8d
Conditions
Link Distance
with
Standard Cable
Propagation
Delay
40
Units
nS
~OO/O
F:
Fig. 21
Notes
1,7,8
uty
actor
to = tpLH - tpHL'
Typical data is at 25° C, Vee = 5 V.
Typical propagation delay is measured at PR = -15 dBm.
Estimated typical link life expectancy at 40° C exceeds 10
years at 60 rnA.
8. Pulsed LED operation at IF> 80 rnA will cause increased link
tpLH propagation delay time. This extended tpLH time
contributes to increased pulse width distortion of the receiver
output Signal.
9. Pins 5 and 8 of both the transmitter and receiver are for
mounting and retaining purposes only. Do not electrically
connect pin 5 and/or pin 8.
4.
5.
6.
7.
8-18
versatile Link Design Considerations
Simple interface circuits for 5 MBd, 1 MBd and 40 kBd
applications are shown in Figure 1. The value of the
transmitter drive current depends upon the desired link
distance. This is shown in Figures 2a through 2f. After
selecting a value of transmitter drive current, IF, the value
of R1 can be determined'with the aid of Figures 1a, 1band
1d. Note that the 5 MBd and 40 kBd Versatile Links can
have an overdrive and underdrive limit for the chosen
value of IF while the 1 MBd Versatile Link has only an
underdrive limit. Dotted lines in Figures 2a through 2f
Vre
RI
VF 2
represent pulsed operation for extended link distance requirements. For the 1 MBd interface circuit, the R1 C1 time
constant must be> 75 ns. Conditions described in Note 1
must be met for pulsed operation. Refer to Note 8 for
performance comments when pulsed operation is used.
All specifications are guard banded for worst case conditions between 0 to 70 degrees centigrade. All tolerances
and variations (including end-of-life transmitter power,
receiver sensitivity, coupling variances, connector and cable
variations) are taken into account. '
•
HFBR-152111531--------_. HFBR-252112531 (5 MBd-HIGH PERFORMANCE L1NKI
Figure 1a. Typical 5 Mild Interface Circuit:
HFBR-2622/2632 (I MBd-HIGH PERFORMANCE L1NKI
HFBR-2524/2534 (I MBd-STANDARO L1NKI
RI
vee
PIN
1'40.
t
2
3
4
5
6
HFBR-1622/1532-------'
7
8
HFBR-1524/1534 _ _ _ _ _ _ _...J
Rx
TX
~
ANODE
CATHODE
OPEN
Vee
OPEN
RL
DO NOT CONNECT' DO NOT CONNECT'
--
--
DO 'lOT CONNECT' DO NOT CONNEcT'
·seE. NOTE
9 PG.&
Rl "" VCC-VF -VOLI754511
IF
R1Cl~.1~
ns
1c. Electrical Pin Assignments for 5 MBd and
1 MBd Transmitters and Receivers
1b. Required 1 MBd Interface Circuit:
~·"'E::.
- - - - - - - - ' " " " - , HFBR·262312633 (COW CURRENTI
EXTENDED DISTANCE LINK)
PIN
NO.
1d. Typical 40 kBd Interface Circuit;
t
2
OPEN
6
--
7
8
VI>
CATHODE
GilD
OPEN
oPEN
Veo
DO NOT CONNECT DO NOT OONNECT'
3
4
6
Ax
Tx
ANODE
--
DO III)T CONNECT' DO NOT CONNECT'
·SEE NOTE 9 PG.6
1e. Electrical Pin Assignments for 40 kBd Transmitters and
Receivers
8-19
,
lOa
100~~
;;:
!
...z
w
a:
a:
:>
u
c
a:
";:a:
It
.1:
10
5
20
10
0
30
50~~~10-----2~0----~3~0----~40-----"50
40
£ -CABLE LENGTH-METRES
\I-CABLE LENGTH-METRES
Figure 2a. Guaranteed System Performance for the
HFBR-15X1/25X1 and HFBR-15X2/25X2 Links
with Standard Cable
120
lOa
80
60
..."I
E
40
~
20
:>
u
10
a:
a:
ca:
Figure 2b. Guaranteed System Performance for the
HFBR-15X1/25X1 and HFBR-15X2/25X2 Links
with Improved Cable
120~_
fftl
10°
~
/'
/
/
~ f'>.H
O'C
10'e
'I<
./
LV
"
BR"1SX3! 5X3
2S'C
;:
a:
It
/
.1:
VJ
'0
//
10
I
20
30
40
50
60
70
80
90
80
~ - CABLE LENGTH- METRES
Figure 2c. Guaranteed System Performance for the
HFBR-15X3/25X3 Link with Standard Cable
laO
90
i
;rz
80
70
/
60
/
w
a:
a:
ac
so
a:
40
It
30
~
.1:
/
;;:
/'
/<
/ ,/
~~
~
VI
0
A
Figure 2d. Guaranteed System Performance for the
HFBR-15X3/25X3 Link with Improved Cable
E
hl
"O'C-70'0
60
so
ca:
40
It
30
"Ii!
.1:
1S
V
70
a:
a:
~HFBR-rX4125X4
80
T
...z
w
:>
u
'25'C
10
,-
100
90
..-
/
90 100
11 - CABLE lENGTH- METRES
/
A
~
£ -CABLE LENGTH-METRES
Figure 2e. Guaranteed System Performance for the
HFBR-15X4/25X4 Link with Standard Cable
/
K"
"~
I
•
•
/
HFBR-1SX4/,5X4
\...0'C-70'C
/
20
ZV
/
20
25.c"1
a
10
~
20
30
-CABLE LENGTH-METRES
Figure 2f. Guaranteed System Performance for the
HFBR-15X4/25X4 Link with Improved Cable
-------
~---
-.
I,
~--~~--~----~--~'5V
INPUT
MONITORING 0------....
NODe
OUTPUT
VI
'----------4-__+-0 MONITORI NG
51
vo
n
HFBR·1523/1533
------------_1
NODE
HFBR·2523!2533
Al 40 kBd PROPAGATION DELAY TEST CIRCUIT
5' n
IF
5Vo-----~~----~~--~~._~
VF 2
rr--------.-O +5 V
RL
OUTPUT
'------~__--4-_o
vo
PULSE
GENERATOR
HFBR-1521/1531 - - - - - - - - - - - - .
MONI TORING
NODE
HFBR-2521/2531 (5 MBd-HIGH PERFORMANCE LINK)
HFBR-2522/2532 (1 MBd-HIGH PERFORMANCE LINK)
B) 5 MBd PROPAGATION DELAY TEST CIRCUIT
HFBR-2524/2534 (1 MBd-STANDARD LINK)
5' n
HFBR-'52211532 ----------'
PULSE
GENERATOR
VaH
HFBR-'52411534 _________--'
C) , MBd PROPAGATION DELAY TEST CIRCUIT
DJ PROPAGATION DELAY TEST WAVEFORMS
Figure 3. Propagallon Delay Tesl Clrculls and Waveforms: a) 40 kBd, b) 5 MBd, c) 1 MBd, d) Tesl Waveforms
500
2
0
400
400
;::
~
~c
300
Q
...c
~
200
"~
~
~
I
JOO
2
0
J:
liE
1--+-+-+-
>
a:
200
::
'00
9
~~2~5--=-~20~----~'5~----'~0-----~5~--~
PR - INPUT OPTICAL POWER - dBm
PR - INPUT OPTICAL poweR - dBm
Figure 4. Typical HFBR-15X1/25X1, HFBR-15X2/25X2 and
HFBR-15X4/25X4 Link Pulse Wldlh Dlslorllon
vs. Opllcal Power
Figure 5. Typical HFBR-15X1/25X1, HFBR-15X2/25X2 and
HFBR-15X4/25X4 Link Propagation Delay
VS. Opllcal Power
8-21
-----~-----~------------
!!l
I
>
~
! !
r- --1.
.,.-
~~
t¥LIf
C
2
).- V
o
~
,--
-,
)I
1/
f'
~
"
I
~
tPHl
I
-2.
-22
-'6
-'0
p~. - INPUT OPTICAL POWER - dBm
PR, -INPUT OPTICAL POWER, dB'1'
Figure 6. Typical HFBR-15X3/25X3 Link Pulse Width
Distortl~n VB. Optical Power
'
Figure 7. Typical HFBR-15X3/25X3 Link Propagation
Delay VB. Optical Power
,
Versatile Link Photo Interrupter
20 KHz (40 kBd) LINK, 500 kHz (1 MBd) LINK
RECOMMENDED OPERATING CONDITIONS
Versatile Link may be used as a photo-interrupter in optical
switches, shaft position sensors, velocity sensors, position
sensors, and other similar applications. This link is P8(ticularly useful where high VOltage, electrical noise, or
explosive environments prohibit the use of electromechanIcal or optoelectronic sensors. The 20 kHz (40 kBd) transmitter/rgceiver: pair has an optical power budget of 25 dB.
The 500 kHz (1 MBd) tranllmitter/receiver pair has an optical
power budget of 10 dB. Total system losses (cable attenuation, air gap loSS, etc.) must not exceed the link optical
pciwerbudget:
Recommended operating conditions' are identical to those
of ttie Low CurrenVExtended Distance and High Performance 1 MBd links. Refer to page 5.
Parameter
Min.
lYp.l11
SYSTEM PERFORMANCE
These specification apply' wh'en using Standard and
, Improved cable and, unless otherwise specified, under
recommended operating conditions. Refer to the
appropriate link data on pages 7 and 8 for additional
design information.
Max.
Units
Conditions
Ref.
HFBR·15X3I2SX3
Max, Count Frequency
de
Optical Power Budget
25.4
27.8
34
~
kHz
dB
IFPK '" 60 mA, 0-70"C
dB
IFPK = 60 mAo 25"C
Note 2
HFBR-15X2I25X2 '
Max. Count Frequency
dc
Optical Power Budget
lOA
12.8
500
15.6
kHz
dB
tl'PI( '" 60 mAo 0-700 C ,
dB
I!'PK = 60 mA, 25·C
Notes:
1. Typical data is at 2S'·C, Vee '= 5 V.
2. Optical Power Budget = PT min. - PR (L) min. Refer to pages 11-14 for additional design information.
8:22
Note 2
Photo Interrupter Link Design considerations
The fiber optic Transmitter/Receiver pair is intended for
applications where the photo interrupter must be physically separated from the optoelectronic emitter and detector.
This separation would be useful where high voltage, electrical noise or explosive environments prohibit the use of
electronic devices. To ensure reliable long term operation,
link design for this application should operate with an
ample optical power margin "'M :::: 3 dB, since the exposed
fiber ends are subject to environmental contamination that
will increase the optical attenuation of the slot with time. A
graph of air gap separation versus attentuation for clean
fiber ends with minimum radial error :50.127 mm (0.005
inches) and angular error (:53.0°) is provided in Figure 1.
The following equations can be used to determine the
HFBR·15X3
HFBR-1SX2
20
STANDARD CABLE
HFBR--4501/4511 CONNECTORS
transmitter output power, PT, for both the overdrive and
underdrive cases. Overdrive is defined as a condition where
excessive optical power is delivered to the receiver. The
first equation calculates, for a predetermined link length
and slot attenuation, the maximum PT in order not to
overdrive the receiver. The second equation defines the
minimum PT allowed for link operation to prevent underdrive condition from occurring.
PT (MAX) - PR (MAX) :5
"'0 MIN
PT (MIN) - PRL (MIN)::::
"0 MAX Q+
Q+ "SLOT
Eq. 1
"SLOT + "M
Eq.2
Once PT (MIN) has been determined in the second equation
for a specific link length ( Q ), slot attenuation ("SLOT) and
margin ("M). Figure 2 can then be used to find IF.
HFBR·25X3
HFBR-25X2
+10
~~
.g
AXIAL~ ~
+5
l'
ffi
;:
SEPARATION
15
~
-5
,..
\,
-10
;r,..
"0
l
~
~
0
10
V I-"
PTIMAXI
~
"u
ii'
-15
-20
~
-25
......-
r-
i- I--
pr~'NI
-30
10
10
11
12
20
30
40
50
100
IF-TRANSMITTER DRIVE CURRENT-rnA
13
AXIAL SEPARATION (mm)
Figure 2. Typical HFBR-15X3/15X2 Optical Power
YS. Transmitter IF (O-70°C)
Figure 1. Typical Loss YS. Axial Separation
HFBR-152XI153X SERIES TRANSMITTERS
Versatile Link n-ansmitters
HFBR-1S21/1S31 (S MBd - High Performance)
HFBR-1S22/1S32 (1 MBd - High Performance)
HFBR-1S23/1S33 (40 kBd - Low Current/Extended
Distance)
HFBR-1S24/1S34 (1 MBd - Standard)
Versatile Link transmitters incorporate a 660 nanometre
LED in a gray horizontal or vertical housing for the HFBR15X1I2/4 transmitters or a black horizontal or vertical housing for theHFBR-15X3 receiver. The transmitters can be
easily interfaced to standard TTL logic. The optical output
power of the HFBR-152X/153X series. is specified at the end
of 0.5 m of cable. The mechanical and electrical pin spacing
and connections are identical for both the horizontal and
vertical packages.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Cycle
l
I
Symbol
Min.
Max.
Units
Ts
-40
+75
°C
TA
0
+70
°C
Temp.
260
Time
to
t=
°C
rnA
iFPK
1000
OC Forward Input Current
IFOC
80
mA
VR
5
V
8-23
Note 1
sec.
Peak Forward Input Current
Reverse I nput Voltage
Ref.
Nole2
Electrical/Optical Characteristics
Param$ltr
Symbol
Transmitter Output
Optical Power
HFBR-15X2
and
HFBR-15X3
PT
HFBR-15X3
PT
HFBR·15X4
PT
Typ.lG]
Min.
-1M
PT
HFBR-15X1
OOG to +700G Unless Otherwise Specified
APT
AT
Peak Emission Wavelength
APK
Forward Voltage
VF
. ~~~~~r~lVoltage
tu fe Coefficient
Units
Condillons
-7.6
dBm
IF; 60mA, 0-70°0
-14.3
-8.0
dBm
IF = 60mA, 25"0
-13.6
-4.5
dBm
IF" 60mA, 0-70"0
-11.2
-5.1
dBm
IF'" 60mA, 25°G
-35.5
dBm
-17.8
-4,5
-15.5
Output Optical Power
Temperature Ooefficient
Max.
-5.1
660
Fig. 2
Notes
3,4
" 2 mA, 0-70'0
dBm
IF'" 60mA, 0-70 0 e
dBm
IF" 60 rnA, 25'G
nm
1.67
AVF
R$f.
%/eO
-0.85
1.45
I IF
j
V
2.02
IF'" 60mA
-1.37
mV/cO
mm
Fig. 1
-;IT
Effective Diameter
DT
1
Numerical Aperture
N.A.
0.5
Reverse Input Breakdown Voltage
VSR
11.0
V
IF = -10/JA. TA = 25°e
Diode Oapacitance
00
86
pF
VF " 0, f " 1 MHz
Rise Time
tr
80
ns
10%(090%,lF"'60mA
Fall Time
If
40
ns
5.0
Notes:
1. 1.6 mm below seating plane.
2. l}.1s pulse, 20}.ls period.
3. Measured at the end ·of 0.5 m Standard Fiber Optic Gable with
large area detector.
4. Optical power. P (dBm) = 10 Log [P (}.IW)/1000 }.IW].
5. Typical data is at 25°G.
6. Rise and fall times are measured with a voltage pulse driving
the transmitter and a series connected 50 Ohm load. A wide
bandwidth optical to electrical waveform analyzer (trans-
Nole6
ducer), terminated to a 50 Ohm input of a wide bandwidth
oscilloscope, is used for this response time measurement.
7.
Pins 5 and 8 of the transmitter are for mounting and retaining
purposes only. Do not electrically connect pin 5 and/or pin 8.
WARNING: When viewed under some conditions. the optical port
of the Transmitter may expose the eye beyond the Maximum
Permissible Exposure recommended in ANSI Z-136-1, 1981. Under
most viewing conditions there is no eye hazard.
1.B
~
w
IE
1.7
to
;:....
a
>
a
0:
1.6
«
;:
0:
it
I
it
,
1
1.5
--
~
S-"K
1".4
2
!5
- vKI--'
,.,;1--'
'"
"a
@
N
:;
........-;;:
...-1-"
10
'\T',1il
,....1-'
~
,.,;
/
-5
-10
l/
«
~
II
o -15
'T
.:-
V
-2 0 2
100
IF-TRANSMITTER DRIVE CURRENT (rnA)
10
100
IF-TRANSMITTER DRIVE CURRENT-rnA
Figure 1. Typical Forward Voltage vs. Drive Current for
HFBR·152X/153X Series Transmitters
Figure 2. Normalized HFBR-152X/153X Series Transmitter
Typical Output Optical Power vs. Drive Current
8-24
versatile Link Receivers
HFBR-25X1/25X2/25X4 RECEIVER
VO~'
HFBR-2521/2531 (5 MBd - High Performance)
HFBR-2522/2532 (1 MBd - High Performance)
HFBR-2524/2534 (1 MBd - Standard)
GROUND
The blue plastic Versatile Link receivers feature a shielded,
integrated photodetector and a wide bandwidth DC amplifier for high EMI immunity. A Schottky clamped opencollector output transistor allows interfacing to common
logic families and enables "wired-OR" circuit designs. The
open collector output is specified up to 18 V. An integrated
1000 ohm resistor internally connected to Vee may be
externally connected to provide a pull-up for ease of use
Vee
RL
8
00 NOT CONNECT"
~i
:
~.
4 "' ,_1000
'
n
5 DO NOT CONNECT-
"SEE NOTE 7
with +5 V logic. Under pulsed LED current operation (I F >
80 mAl, the combination of a high optical power level and
the optical falling edge of the LED transmitter will result in
increased pulse width distortion of the receiver output
signal.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Ts
-40
+75
°C
TA
0
Storage Temperature
+70
'C
Temp.
260
°C
Time
10
sec.
Operating Temperature
I
I
Lead Soldering Cycle
Supply Voltage
-0.5
Vee
Output Collector Current
10
Output Collector Power Dissipation
POD
Output Voltage
Vo
-0.5
VRL
-0.5
Pullup Voltage
Note 1
7
V
25
mA
40
mW
18
V
Vee
V
ReI.
Note 6
Electrical/Optical Characteristics DOC to +70°C, 4.75V S Vccs 5.25V Unless Otherwise Specified
Typ.(5]
Min.
Max.
Units
Conditions
Symbol
Ref.
-Parameter
0-70°C. VOL" 0.5 V
Receiver Input Optical
Power Level for
LogiC "0"
-21.6
HFBR-2521
and
HFBR-2531
PRILl
HFBR-2522
and
HFBR-2532
PRIl)
HFBR-2524
and
HFBR-2534
-9.5
dBm
d8m
dBm
0-70°C, VOL "O.5V
IOL =8mA
-24
dBm
25°C. VOL" 0.5 V
IOL" SmA
-20
dBm
0-70°C, VOL = O.5V
IOL '" 8mA
-20
dBm
25'C, VOL" 0.5 V
IOL :8mA
-43
dBm
VOH" 5.25V.
IOHS250/lA
-B.7
-21.6
-24
PRIL)
Input Optical Power Level
for Logie ''1''
PRtH)
High Level Output Current
IOH
5
250
fJ.A
VOL
0.4
0.5
V
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
ICCH
3.5
63
ICCl
62
10
Effective Diameter
DR
1
Numerical Aperture
NAR
0.5
Inlernal Pull-Up Resistor
RL
IOL "BmA
25°C, VOL" 0.5 V
IOl" SmA
lQOO
680
r
Vo
~
lB V, PR ~ 0
IOL~8mA,
PR ~ PRIL)MIN
Notes 2.
3.B
Notes 2,
3,$,9
Notes 2,
3.8,9
Note 2
Note 4
Note 4
mA
Vcc" S.2SV.
PR ~OfJ.W
Note 4
mA
VCC" 5,25V.
PR" -12.5dBm
Note 4
mm
1700
Ohms
8-25
~---'~~-----""
Note.:
of the capacitor and the pins should not exceed 20 mm.
7. Pins 5 and 8 of. both the transmitter and receiver are for mounting and
retaining purposes only. Do not electrically connecfpin 5 andlor pin 8.
8. Pulsed LED operation at IF > 80 rnA will cause Increased link tpLH
propagation delay time. This extended tpLH time 'contributes to in-
1. 1.6 mm below seating plan.
2. Optical flux, P (dBm) = 10 Log IP (~W)11000 ~Wl.
3. Measured at the end of Fiber Optic Cable with large area detector.
detector.
4. RL is open.
5. Typical data Is at 25' e, Vee = 5 V.
6. It is essential that a bypass capacitor 0.Q1 ~F to 0.1 ~F be connected
from pin 2 to pin 3 of the receiver. Total lead length between both ends
creased pulse width distortion of the receiver output signal.
9. The LED driver circuit of Figure 1b on page 7 (Link Design Considera-
tions) is required for 1 MBd operation of the HFBR-2522/253212524/2534.
High Sensitivity Receiver
HFBR-25X3 RECEIVER
DO NOT CONNECT*
HFBR-2.5X3
The blue plastic HFBR-25X3 Receiver module has a sensitivity of -39 dBm. It features an integrated photodector
and DC amplifier for high !:MI immunity. The output is an
open collector with a 150 p.A internal current source pullup and is compatible with TTULSTTL and most CMOS
logic families. For minimum rise time add an external pullup resistor of at least3.3K ohms. Vee must be greater than
or equal to the supply voltage for the pull-up resistor.
GROUND
OPEN
vee
-"-E::=;;;;:!...J
DO NOT CONNECT*
'SEE NOTE 8
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Ts
TA
--40
+75
·C
0
+70
·C
Storage Temperature
Operating Temperature
I Temp
Lead Soldering Cycle
I Time
260
·C
10
sec
Vee
-D.5
7
V
Output Collector Current !
Notee
=5.5V. PR =0 p.W
Note 6
5. Typical data is at 25' e. Vee =5 V.
6. Including current in 3.3 K pull-up resistor.
7. It is recommended that a bypass capacitor om ~F to 0.1 ~F ceramic be
connected from pin 2 to pin 4 of the receiver.
8. Pins 5 and 8 are for mounting and retaining purposes only. Do' not
electrically connect pin 5 andlor pin 8.
to filter out sIgnals from this source if they pose a h~ar~ to the system.
8-26
Plastic Fiber Optic Cable
I,. ,',
Simplex Fiber Optic Cable is constructed of a single step
index plastic fiber sheathed in a PVC jacket. Duplex Fiber
Optic Cable has two plastic fibers, each in a cable of
construction similar to the Simplex Cable, joined with a
web. The individual channels are identified by a marking
on one channel of the cable. The Improved Fiber Optic
Cable is identical to the Standard Cable except that the
attenuation is lower.
SIMPLEX CABLE
These cables are UL recognized components and pass UL
VW-1 flame retardancy specification. Safe cable properties
in flammable environments, along with non-conductive electrical characteristics of the cable may make the use of
conduit unnecessary. Plastic cable is available unconnectared or connec!ored. Refer to pages 23 and 24 for part
numbers.
DUPLEX CABLE
Absolute Maximum Ratings
Symbol
Min.
IVJ~)(·
Units
Storage Temperature
Ts
-40
+75
"C
I nstallation Temperature
Tl
-20
+70
°C
Parameter
Short Term
Tensile Force
I Single Channel
I Dual Channel
FT
50
N
FT
100
N
Short Term Bend Radius
r
10
mm
Long Term Bend Radius
r
35
mm
Long Term Tensile Load
FT
Flexing
Impact
Cable Attenuation
l Standard Cable
Improved Cable
"'0
Cycles
Note 3
0.5
Kg
Note 4
h
150
mm
DoC to +70°C Unless Otherwise Specified
Typ.tS]
Malt.
0.19
0.31
0.43
0.19
0.25
0,31
Min.
Units
Conditions
dB/m
Source is HFBR-152X/153X
(660 nm), Q= 20 m
N.A.
0.5
Diameter, Core
1.0
2.2
mm
Travel Time Constant
Dc
DJ
Q/v
5.0
nsec/m
Mass per Unit Length/Channel
m/Q
4.6
g/m
Without Connectors
IL
12
nA
50 kV, Q= 0.3 m
Cable Leakage Current
Ref.
Note?
Q> 2m
Numerical Aperture
Diameter, Jacket
Note 2
1000
Symbol
j
N
Note 1
m
Electrical/Optical Characteristics
Parameter
1
Ref.
mm
Simplex Cable
NoteS
Notes:
1.
2.
Less than 30 minutes.
Less than 1 hour, non-operating.
3.
90° bend on 10 mm radius mandrel.
4.
Tested at 1 impact according to MIL-STD-1678, Method 2030,'
5.
6.
Typical data is at 25'C.
Travel time constant is the reciprocal of the group velocity for propagation 01 optical power. Group velocity is v = cln, where c is the
7.
Procedure .1.
8.
8-27
velocity of light in space (3 )( 108 m/s) and n equals effective 'core
index of refraction. Unit length of,cable is Q .
In addition to standard Hewlett-Packard 100% product testing, HP
provides additional margin to ensure link performance. Under certain
conditions, cable installation and improper connectoring may reduce
performance. Contact Hewlett-Packard for recommendations.
Improved cable is available in 500 metre spools and in factoryconnectored lengths less than 100 metres.
versatile Link
Fiber Optic Connectors
Absolute Maximum Ratings
Versatile Link transmitters and receivers are compatible
with three connector styles; simplex, simplex latching, and
duplex. All connectors provide a snap-action when mated
to Versatile Link components. Simplex connectors are color
coded to match with transmitter and receiver color coding.
Duplex connectors are keyed so that proper orientation is
ensured. When removing a connector from a module, pull
at the connector body. Do not pull on the cable alone. The
same, quick and simple connectoring technique is used
with all connectors and cable. This technique is described
on page 18.
Units Notes
Symbol
Min.
Max.
Storage
Temperature
Ts
-40
+75
·C
Operating
Temperature
TA
0
+70
·C
Nut Torque
HFBR·4505/4515
0.7
N-m
TN
100
OZ~~jn
Parameter
CONNECTORS
FEEDTHROUGH/SPLICE
POLISHING TOOLS
1
Noles:
1. Recommended nut torque is 0.57 N-m (8DOzF-in).
HFBR-4501 (GRAY)/4511 (BLUE) SIMPLEX CONNECTOR
9~'
Simplex Connector Styles
HFBR-4501l4511 - Simplex
0
SILVER COLOR CRIMP RING
The simplex connector provides a quick and stable
connection for applications that require a component to
provide retention force of 8 Newtons (1.8Ibs). These connectors are available in colors of gray (HFBR-4501) or blue
(HFBR-4511 ).
HFBR-4503 (GRAY)/4513 (BLUE)
SIMPLEX LATCHING CONNECTOR
SILVER COLOR
HFBR-4503/4513 - Simplex Latching
CRIMP RING
The simplex latching connector is designed for rugged
applications requiring greater retention force, 80 N (18Ibs),
than that provided by a simplex connector. When inserting
the simplex latching connector into a module, the connector
latch mechanism should be aligned with the top surface of
the horizontal module, or with the tall vertical side of the
vertical module. Misorientation of an inserted latching connector into either module housing will not result in a
positive latch. The connector is released by depressing the
rear section of the connector lever, and then pulling the
connector assembly away from the module housing.
HFBR-4506 (PARCHMENT) DUPLEX CONNECTOR
If the cable/connector will be used at elevated operating
temperatures or experience frequent and wide temperature
cycling effects, the cable/connector attachment can be
strengthened by applying a RTV adhesive within the connector. A recommended adhesive is 3M Company product
RTV-739. In most applications, use of RTV is unnecessary.
The simplex latching connector is available in gray (HFBR4503) or blue (HFBR-4513).
HFBR-4505 (GRAY)/4515 (BLUE) ADAPTER
Duplex Connector HFBR-4506 - Duplex
Duplex connectors provide convenient duplex cable termination and are keyed to prevent incorrect connection. The
duplex connector is compatible with dual combinations of
identical Versatile Link components (e.g., two horizontal
transmitters, two vertical receivers, a horizontal transmitter
and a horizontal receiver, etc.). A duplex connector cannot
connect to two different packages simultaneously. The
duplex connector is an off-white color.
(USE WITH SIMPLEX CONNECTORS ONLY)
HFBR-4593 POLISHING KIT
600 GRIT ABRASIVE PAPER
Feedthrough/Spllce HFBR-4505/4515 - Adapter
The HFBR-4505/4515 adapter mates two simplex connectors for panel/bulkhead feedthrough of plastic fiber cable.
Maximum panel thickness is 4.1 mm (0.16 inch). This adapter
can serve as a cable in-line splice using two simplex
connectors. The colors of the adapters are gray (HFBR4505) and blue (HFBR-4515). The adapter is not compatible
with the duplex or simplex latching connectors.
(USED WITH ALL CONNECTOR TYPES)
8-28
connector Applications
ATTACHMENT TO HEWLETT-PACKAi:co HFBR-152X/153X/252X/253X VERSATILE LINK FIBER OPTIC COMPONENTS
SIMPLEX
CONNECTOR
HORIZONTAL
PACKAGE
VERTICAL
PACKAGE
SIMPLEX
LATCHING
CONNECTOR
HORIZONTAL
PACKAGE
TWO STACKED
VERTICAL
PACKAGES
DIMENSIONS IN MILLIMETRES (INCHES)
ADAPTER
BULKHEAD FEEDTHROUGH OR PANEL MOUNTING FOR HFBR-4501/4511 SIMPLEX CONNECTORS
DIMENSIONS IN MILLIMETRES (INCHES)
IN-LINE SPLICE FOR HFBR-35XX/36XX FIBER OPTIC CABLE WITH HFBR-4501/4511 SIMPLEX CONNECTORS
8-29
----------------------------
Connector Mechanical/optical Characteristics 25°C Wnless Otherwise Specified.
Parameter
Retention Force Connector to
HFBR-152X/153X1252X1253X
Modules
Tensile Force Connector
to Cable
Symbol
Pert Number
Simplex
HFBR-4501l4511
Simplex
Latching
HFBR-4503/4513
Duplex
HFBR-4506
Simplex
HFBR·4501/4511
Simplex
Latching
HFBR-4503/4513
Duplex
HFBR-4506
FR.G
FT
Min.
"TYP.
7
8
47
80
7
12
8.5
22
8.5
22
Mex.
Units
Ref.
N
Note 4
N
Notes 3, 4
dB
Notes 1, 5
N
Note 4
N
Notes 2, 4
.......
14
35
Adapter
Connector to Connector Loss
HFBR-4505/4515 with
HFBR-4501/4511
«ce
0.7
1.5
Retention Force Connector
to Adapter
HFBR-4505/4515 with
HFBR·4501/4511
FR·B
7
8
Simplex
HFBR-4501l4511
I nsertion Force Connector to
HFBR-152XI153X/252X/253X
Modules
Simplex
Latching
HFBR-4503/4513
Duplex
HFBR·4506
F,
2.8
8
12
16
35
13
46
Notes:
1. Factory polish or field polish per recommended procedure.
2. No perceivable reduction in insertion force was observed after 2000 insertions. Destructive insertion force was typically at 178 N
(40Ibs).
3. For applications where frequent temperature cycling over temperature extremes is expected please contact Hewlett·Packard for
alternate connectoring techniques.
4. All mechanical forces were measured after units were stored at 70°C for 168 hours and returned.t025°C for one hour.
5. Minimum and maximum limits of OICC are for O°C to 70°C temp\lrature range. Typical value of OICC is at 25°C.
connectoring
The fOllowing easy procedure'describes how to make cable
terminations. It is ideal for both field and factory installation,
If a high volume connectoring technique is required please
contact your Hewlett·Packard sales engineer for the recom·
mended procedure and equipment.
6) Industrial Razor Blade or Wire Cutters
7) 16 Gauge Latching Wire Strippers
8) Crimp Tool, AMP 90364-2
Step 1
The zip cord structure of the duplex cable permits easy
separation of the channels. The channels should be separated approximately 50 mm (2.0 in.) back from the ends to
. '.
permit connectoringand polishing.
Connectoring the cable is accomplished with the HewlettPackard HFBR-4593 Polishing ,Kit consisting of a Polishing
Fixture, 600 grit abrasive paper and 3 micron pink lapping
film (3M Company, OC3-14), No adhesive material is needed
to secure the cable in the connector, and the connector
can be used immediately after polishing. Improved connector to cable attachment can be achieved with the use of
a RTV adhesive for frequent, extreme temperature cycling
environments orlor elevated temperature operation.
After cutting the. cable .. to the desired length, strip off
approximately 7 mm (0.3 in.) of the outer jacket with the 16
gauge wire strippers. Excess webbing on duplex cable may
have to be trimmed to allow the simplex or simplex latching
connector to slide over,.the cable.
When using the duplex connector and duplex cable, the
separated duplex cable must be stripped to equal lengths
on each cable. This allows easy and p(oper seating of the
cable into the duplex connector.
Connectors may be easily installed on the cable ends with
readily available tools. Materials needed for the terminating
procedure are:
1) Hewlett·Packard Plastic Fiber Optic Cable
2) HFBR-4593 Polishing Kit
3) HFBR-4501/4503 Gray Simplex/Simplex Latching Connector and Silver Color Crimp Ring
4) HFBR-4511/4513 Blue Simplex/Simplex Latching Connector and Silver Color Crimp Ring
5) HFBR-4506 Parchment Duplex Connector and Gold
Color Crimp Ring'
8-30
7mm
--~~~----~------------.
Step 2
This plastic polishing fixture can be used to polish two
simplex connectors or two simplex latching connectors
simultaneously, or one duplex connector.
Place the crimp ring and connector over the end of the
cable; the fiber should protrude about 3 mm (0.12 in.)
through the end of the connector. Carefully position the
ring so that it is entirely on the connector and then crimp
the ring in place with the crimping tool. One crimp tool is
used for all connector crimping requirements.
Note: The four dots on the bDttom of the polishing fixture
are wear indicatDrs. Replace the polishing fixture when any
dot is nD IDnger visible.
Place the 600 grit abrasive paper on a flat smooth surface.
Pressing down on the connector, polish the fiber and the
connector using a figure eight pattern of strokes until the
connector is flush with the bottom of the polishing fixture.
Wipe the connector and fixture with a clean cloth or tissue.
Note: Place the gray connector on the cable end to be
connected to the transmitter and the blue CDnnectDr Dn the
cable end to be cDnnected to the receiver tD maintain the
CD lor cDding (bDth connectDrs are the same mechanically).
FDr duplex CDnnectDr and duplex cable applicatiDn, align
the cDIDr cDded side Df the cable with the apprDpriate
ferrule Df the duplex CDnnectDr in Drder to match CDnnectiDns tD the respective optical ports. The simplex CDnnectDr
crimp ring (silver cDIDr) cannDt be used with the duplex
CDnnectDr. The duplex CDnnectDr crimp ring (gDld colDr)
cannot be used with the simplex Dr simplex latching
connectDrs.
!!
FIBER END
~I
:
-----I~~'.5';'m
MINIMUM
Step 4
Place the flush connector and polishing fixture on the dull
side of the 3 micron pink lapping film and continue to
polish the fiber and connector for approximately 25 strokes.
The fiber end should be flat, smooth and clean.
SIMPLEX
~~
The cable is now ready for use.
Note: Use of the pink lapping film fine polishing step
results in approximately 2 dB improvement in coupling
performance of either a transmitter-receiver link or a bulkhead/splice over 600 grit polish alone. This fine polish is
comparable to Hewlett-Packard factDry polish. The fine
polishing step may be omitted where an extra 2 dB of
optical pDwer is not essential, as with short link lengths.
Proper polishing of the tip of the fiber/connector face
results in a tip diameter between 2.8 mm (0.110 in.) minimum
and 3.2 mm (0.125 in.) maximum.
CRIMP RING
SIMPLEX LATCHING
DUPLEX
POLISHING
FIXTURE
CRIMP RING
Step 3
Any excess fiber protuding from the CDnnector end may be
cut off; however, the trimmed fiber ShDUld extend at least
1.5 mm (0.06 in.) from the connector end.
Insert the connector fully into the polishing fixture with the
trimmed fiber protruding from the bottom of the fixture.
POLISHING PAPER
For simultaneous multiple connector polishing techniques
please contact Hewlett-Packard.
8-31
versatile
Link Mechanical Dimensions All
All dimensions in mm (inches).
.
dimensions ±O.25 mm unless otherwise specified.
HORIZONTAL MODULES
HFBR-4501 (GRAY)/4511 (BLUE) S.IMPLEX CONNECTOR
HFBR-1521/152211523/1524 (GRAY)
HFBR-2521/2522/2523/2524 (BLUE)
7.6 10.3001"
1
6~
0.270l'
CJcj
.~
~o"
2.0
10.0601
3.810.1501'"
[
CRIMP RING
SILVER COLOR
2.2 10.0801"
.
.
.
.
..
~IS.6
r--10.7701
0.64
10L
I
7.62
'. . ~1___
I-r
+--I ~I ~·.::t-II
rl'=i-.JL
!----
CONNECTORS OIFFER ONLY IN COLOR
....,i.IP.I.I.
3.81
3.5610.1401 MIN.
10.300~'?
I .":";:
2.B
10.10SI
4.2
10.1651
1.27
,:-r.'
HFBR-4503 (GRAY)/4513 (BLUE) SIMPLEX LATCHING
CONNECTOR
5.1(0.2001
II
.LU5·
- I r--. 10.0731
~=~I-rJl I]~lIl 1I.I.I~ ~
po8.s{0.3501
VERTICAL MODULES
HFBR-1531/1532/1533/1534 (GRAY)
HFBR-2531/253212533/2534 (BLUE)
CRIMP RING
SILVER COLOR
!-4.6710.1801
HFBR-4506 (PARCHMENT) DUPLEX CONNECTOR
f~.......r"'1
10.210.4001
I
Lr-.-"'I...JJI
3.81
10.1601
3.61
I
10.1601-1
OPTIONAL
MOUNTING
HOLE FOR
#2 SELFTAPPING
SCREW
IMETRIC EOUIVALENT M2.2 x 0.451
6.B 10.2301
8-32
BULKHEAD FEEDTHROUGH WITH TWO HFBR-4501/4511
CONNECTORS
HFBR-4505 (GRAY)/4515 (BLUE) ADAPTERS
10'~:~1"
9.1
1\
'I
10.375
lI0.4201.J
I ~ MAX. WAl.L THICKNESS:
-
1:0
ADAPTERS DIFFER DNLY IN COLOR
4.1 (0,1601
PANEL MOUNTING - BULKHEAD FEEDTHROUGH
FIBER OPTIC CABLE DIMENSIONS
THREE TYPES OF PANEL/BULKHEAD HOLES CAN BE USED.
~"""
1:":b:--.l
I
6.4
-WIO.2501 MIN.
DOUBLE 'D'
7.910.3121 DIA. MIN.
r
'D' HOLE
7.910.3121 DIA. MIN.
7.910.312)
HOLE MIN.
DIMENSIONS IN mm (INCHES)
ALL DIMENSIONS ~O,2 mm UNLESS NOTED.
DIMENSIONS IN MILLIMETRES AND (lNCHESI
versatile Link Printed Circuit Board Layout Dimensions
VERTICAL MODULE
HORIZONTAL MODULE
~
10.3001
2.54_
10.1001
-
I
--
1.01
lo.o40)DIA.
1.01 10.0401 DIA.
~-~-~-.€H---"T'"
4
3
2
.,-'7'''----.
2.25 10.090) CLEARANCE
HOLE FDR OPTIONAL
VERTICAL MOUNT
SELF- TAPPING SCREW #2.
;
TOP VIEWS
--r-----
PCB EDGE - - -
10~;638IMIN
DIMENSIONS IN MILUMETRES AND (lNCHESI
ELECTRICAL PIN FUNCTIONS
PIN
NO.
1
2
3
4
5
6
TRANSMITTERS
HFBR-15XX
ANODE
CATHOOo
OPoN
OPEN
DO NOT CONN ECT
DO NOT CONNECT
RECEIVERS
oXCLUolNG
HFBR-26)(3
REceiVER
I.fFBR-25X3
Vee
Vo
GROUND
OPEN
RL
DO NOT CONNECT
DC NOT CONNECT
00 NOT CONNeCT
DO NOT cONNeCT
Vo
GRDUND
8-33
Vee
Interlocked (Stacked) Assemblies
STACKING HORIZONTAL MODULES
I __ 10.16 ±0.127
J
I¥
1D.400
±0.0061
Recommended stacking assembly of horizontal packages
is easily accomplished by placing units upside down with
pins facing upward. Initially engage the interlocking mechanism by sliding the L bracket body from above into the L
slot body of the lower package. Lay the partially interlocked
units on a flat surface and push down with a thin, rigid,
rectangular edged object to bring all stacked units into
uniform alignment. This technique prevents potential harm
that could occur to fingers and hands of assemblers from
the package pins. Refer to Figure 1 below that illustrates
this assembly. Stacked horizontal packages can be disengaged should there be a need to do so. Repeated stacking and unstacking causes no damage to individual units.
PIN TO IDENTICAL PIN OF
ADJACENT PACKAGE SPACING
MAXIMUM OF EIGHT INTERLOCKED PACKAGES.
STACKING VERTICAL MODULES
,
~
!
I ...- 10.16 ±0.127
j¥
10.4001
Recommended stacking of vertical packages is to hold two
vertical units, one in each hand, with the pins facing away
from the assembler and the optical ports located in the
bottom front of each unit. Engage completely, the L bracket
unit from above into the lower L slot unit. Package to
package alignment is easily insured by laying the full, flat,
bottom side of the assembled units onto a flat surface
pushing with a finger the two packages into complete,
parallel alignment. The thin rectangular edged tool, used
for horizontal package alignment, is not needed with the
vertical packages. Stacked vertical packages can be disengaged should there be a need to do so. Repeated stacking and unstacking causes no damage to individual units.
PIN TO IDENTICAL PIN OF
±0.005) ADJACENT PACKAGE SPACING
MAXIMUM OF EIGHT INTERLOCKED PACKAGES.
THIN, RECTANGULAR EOGE
ASSEMBLY TOOL
Figure 1. Interlocked (Stacked) Horizontal or Vertical Packages.
8-34
versatile Link polishing Kit
Contents:
a) One polishing tool.
b) One piece, 600 grit abrasive paper: 3M Company.
c) One piece, 31'm lapping film: 3M company, OC3-14.
component Selection Guide
TRANSMITTERS {Tx)/RECEIVERS (Rx)
fJi:ersatile Unk
Unit
Horizontal
Modules
Pages 11114
Connectored 'Iahdard Plastic Fiber Optic Cable
l?,lJplex Standard Cable
Vertical
Modules
1B,~Bd High Performance
1 ~Bd High Performance
40 kBd Low CurrenV
Extended Distance
1 MBd Standard
Tx
Tx
HFBA-1521 HFBR-1531
HFBA-1522 HFBR-1532
Tx
Tx
HFBA-1523 HFBR-1533
HFBR-l§24 HFBA-1534
5 MBd High Performance
1 MBd High Performance
40 kBd Low Current!
Extended Distance
1 MBd Standard
Ax
Ax
HFBA-2521 HFBR-2531
HFBA-2522 HFBA-2532
Rx
Rx
HFBA-2523 HFBR-2533
HFBR-2524 HFBR-2534
Standard
Simplex
C
Lllihlng
Simplex
H
ND5DM
D5DM
HFBR-PND001 HFBtl-PLD001
HFBR-PN0005 HFBA-PL0005
HFE\!1-P 010 HFBR-PLD010
HFBRH !R-PL0020
'
HFBR- 0030 H. R-PLe030
HFBR-P~J5 HF
-PLD045
HFBA-PNI!!tJ60 HF -PLD\l~O
Connectored Standard PlastIc Fiber Optic Cable
Simplex Standard Cable
Standard
Simpt.x Connectors
Latcblng
Simplex Connectors
Length
(metres)
HFBA-PNS10M
HFBR-PNS5DM
HFBR-PNSOO1
HFBR-PNS005
HFBR·PNS010
HFBR-PNS020
HFBR-PNS03O
HFBR-PNS045
HFBR-PNS060
HFBR-PLS10M
HFBA-PLS50M
HFBR-PLSOOl
HFBR-PLS005
HFBR-PLS010
HFBR-PLS020
HFBR-PLS030
HFBR-PLS045
HFBR-PLS060
0.1
0.5
Standard Attenuation
Simplex Cable
Standard Attenuation
Duplex Cable
Improved Attenuation
Simplex Cable
1
HFBR-QNS001
HFBR·QNSOO5
HFBR-QNS010
HFBR-QNS020
HFBR-QNS030
HFBA-QNS045
HFBR-QNS060
Latching
Simplex Connectors
HFBR-QLSOOl
HFBR-QLS005
HFBA-QLS010
HFBR-QLS020
HFBR-OLS030
HFBR-QLS045
HFBA-QLS060
. Length
(metres)
HFBR-PMD50M
HFBR-PMD001
HFBR-PMOqp5
HFBR-PMOcfio
HFBR-PMO" 0
HFBR-P
0
HFBR-P
5
HFBR-PM0060
0.5
1.0
5.0
10.0
20.0
30.0
45.0
60.0 .
Length
(metres)
HFBR-PUS500
500
HFBA-PUD500
500
HFBR-QUS500
500
CONNECTORS
5
10
20
30
45
60
Page 16
HFBR·4501 Gray Simplex Connector/Crimp Ring
HFBR·4511 Blue Simplex Connector/Crimp Aing
HFBR-4503 Gray Simplex Latching Connector
with Crimp Ring
HFBR-4513 Blue Si~plex Latching Connector
with Crimp Ring
HFBR-4506 Parchment Duplex Connector
with Crimp Ring
HFBR-4593 Polishing: Kit (Polishing Fixture,
Abrasive Paper, Lapping Fifm)
HFBR-4505 Gray Adapter
HFBR-4515 Blue Adapter
Simplex Improved Cable
Standard
Simplex Connectors
Duplex
Connectors
Unconn~ctored Cable
. Page 15
CABLES
rs
Lenglh
(metres)
1
5
10
20
30
45
60
EVALUATION KIT, HFBR-OS01
CONTENTS:
HFBR-1524 Transmitter
HFBA-2524 Aeceiver
HFBA-4506 Duplex Connector with Crimp Ring
5 metres of Connectored Simplex Cable
with Blue Simplex and Gray Simplex
Latching Connectors
HFBA-4501 Gray Simplex Connector with Crimp Ring
HFBA-4513 Blue Simplex Latching Connector with
Crimp Ring
HFBR-4505 Gray Adapter
Polishing Tool and 600 grit paper
HFBA-0501 Data Sheet and Brochure
MECHANICAL DIMENSIONS
8-35
Page 20
A Note About Ordering Cable
There are four steps required to determine the proper part
number for a desired cable.
Step 1
Select Standard or I mproved Cable.
.---.r--r-.,.---,---,-----,
As explained on page 15, two levels of attenuation are
available: Standard and Improved.
Step 2
To determine the appropriate part number, select the
letter corresponding to your selection and fill in the following:
H FBR-LI-L-L-...l...-..l...-.l.......J
I'
Select the connector style.
Connector styles are described on page 16.
Step 3
Select Simplex or Duplex.
Step 4
Determine the cable length.
L"gth io
M",,"
Simplex Cable = S
Duplex Cable = 0
The following standard lengths are available.
Unconnectored = U
Standard Simplex
Connectors = N
Latching Simplex = L
Duplex Connectors = M
Lasl Three D1911$
length
L
of Pari Number
0.1 m
10M'
O.5m
1m
Sm
10m
SOM"
2Qm
020
030
HFBR~PUD500
045
060
500 (Unconnectored only)
A complete list of plastic cable part numbers isshown on
page 23.
30m
4Sm
eOm
500 m
Standard Attentuation = P
I mproved Attenuation = Q
001
005
010
(Custom-length cables are also available. Contact
Packard for details.)
'Standard simplex cable only.
"Standard simplex and duplex cable only.
For example:
is a Standard Attenuation, Unconnectored,
Duplex, 500 metre cable.
Hewlett~
Please note that several cable combinations are not available. These include duplex Improved Cable, 0.1 metre and
0.5 metre simplex Improved Cable, and 0.1 metre duplex
standard cables.
8-36
r/i~ HEWLETT
a!~ PACKARD
LOW COST, MII\UATURE
FIBER OPTIC COMPONENTS
WITbi ST* AND SMA PORTS
H~BR-0400
ST* and
SMA SERIES
....
Features
• LOW COST TRANSMITTERS AND RECEIVERS
• CHOICE OF ST OR SMA PORTS
• 820 NANOMETRE WAVELENGTH
TECHNOLOGY
• DATA RATES UP TO 150 MEGABAUD
• LINK DISTANCES UP TO 4 KILOMETRES
o
GUARANTEED WITH 62.5/125 ",m, 100/140 ",m,
50/125 ",m, AND 200 ",m PCS FIBER SIZES
• QUICK TWIST DELIVERS LOCKING AND
SPRING LOADED ST CONNECTION
o REPEATABLE ST CONNECTIONS WITHIN
0.2 dB TYPICALLY
o
UNIQUE OPTICAL PORT DESIGN FOR
EFFICIENT COUPLING
o
AUTO-INSERTABLE AND WAVE SOLDERABLE
o
NO MOUNTING HARDWARE REQUIRED
o
WIDE OPERATING TEMPERATURE RANGE
-40°C to 85°C
o
AIGaAs EMITTERS 100% BURN-IN ENSURES
HIGH RELIABILITY
o
DEMONSTRATED RELIABILITY @ 40°C
EXCEEDS 5 MILLION HOURS MTBF
Applications
o
COMPUTER TO PERIPHERAL LINKS
o
LOCAL AREA NETWORKS
• CENTRAL OFFICE SWITCH LINKS
Description
The HFBR-0400 Series of components is designed to
provide cost effective, high performance fiber optic communication links for information systems and industrial
applications with link distances of up to 4 kilometres. With
the latest addition to the HFBR-0400 series, the 125 MHz
analog receiver, data rates of up to 150 megabaud are
attainable.
Transmitters and receivers are directly compatible with
popular "industry-standard" connectors; ST and SMA. They
are completely specified with multiple fiber sizes; including 62.5/125 I'm, 100/140 I'm, 50/125 I'm, and 200 I'm PCS.
Complete evaluation kits are available for ST and SMA
product offerings; including transmitter. receiver, connectored cable, and technical literature. In addition, ST and
SMA connectored cables are available.
• PBX LINKS
• COMPUTER MONITOR LINKS
o
VIDEO LINKS
• MODEMS AND MULTIPLEXERS
• SUITABLE FOR TEMPEST SYSTEMS
'ST is a registered trademark of AT&T Lightguide Cable Connectors.
8-37
HFBR-0400 Series Selection Guide
Description
Part Number
(STSeries)
Part Number
(SMA Series)
Standard Transmitter
High Power Transmitter
5 MBd TTL Receiver
25 MHz Analog Receiver
125 MHz Analog Receiver
Evaluation Kit (5 MBd)
Connectored Cables
HFBR-1412
HFBR-1414
HFBR·2412
HFBR-2414
HFBR-2416
HFBR-0410
Various
HFBR-1402
HFBR-1404
HFBR-2402
HFBR-2404
HFBR-2406
HFBR.o400
Various
Literature Guide
Tide
Description
HFBR.o400 Series Reliability Data
Transmitter & Receiver Reliability Data
Application Bulletin 73
Low-Cost Fiber Optic Transmitter & Receiver Interface Circuits
Application Bulletin 74
Digital Interface Circuits for the 125 MHz Receiver
Technical Brief 105
ST Connector/Cable Guide
Technical Brief 101
Fiber Optic SMA Connector Technology
HFBR-0400 ST and SMA Series
Transmitter & Receiver Specifications
Contact your local HP components sales office to obtain these publications.
Handling and Design
Information
package Information
All HFBR-0400 Series transmitters and receivers are housed
in a low-cost, dual-In-line package that is made of high
strength, heat resistant, chemically resistant, and UL V-O
flame retardant plastic. The transmitters are easily identified
by the light grey color connector port. The receivers are
easily identified by the dark grey color connector port. The
package is designed for auto-insertion and wave soldering
so it is ideal for high volume production applications.
When soldering, it is advisable to leave the protective cap
on the unit to keep the optics clean.
Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressed air often is sufficient to remove particles of
dirt; methanol or Freon on a cotton swab also works well.
LED OR DETECTOR Ie
LENS-SPHERE
(ON TRANSMITTERS ONLY)
LENS·WINDOW
CONNECTOR PORT
HEADER
EPOXY BACKFILL
Figure 1. HFBR-0400 ST Series Cross-Sectional View
8-38
Link Design Considerations
LOGIC LINK DESIGN UP TO 150 MBd
The HFBR-14XX transmitter and the HFBR-24XX receiver
can be used to design fiber optic data links that operate
with 62.5/125 I'm, 100/140 I'm, 50/125 I'm, and 200 I'm PCS
fiber cables.
The HFBR-14X2 standard transmitter and the HFBR-24X2
receiver are suitable for systems requiring up to 5 MBd
and 2 Km. For higher data rate or longer distance, the
HFBR-14X4 high power transmitter and/or the HFBR-24X4
receiver should be considered.
5 MBd LOGIC LINK DESIGN
The HFBR-14X4/24X2 Logic Link is guaranteed to work
with 62.5/125 I'm fiber optic cable over the entire range of
o to 1200 metres at a data rate of dc to 5 MBd, with
arbitrary data format and typically less than 25% pulse
width distortion, when the transmitter is driven with IF =
30 mA, RL = 89 Ohm as shown in Figure 2. If it is desired to
economize on power or achieve lower pulse distortion,
then a lower drive current (IF) may be used. The following
example will illustrate the technique for optimizing IF.
EXAMPLE: Maximum distance required = 400 metres. From
Figure 3 the drive current should be 20 mA. From the
transmitter data VF = 1.6 V (max) as shown in Figure 9.
R1 = Vcc- V F=5V-1.6V =1700hm
. IF
20 mA
The curves in Figures 3,4, and 5 are constructed assuming
no in-line splice or any additional system loss. Should the
link consist of any in-line splices, these curves can still be
used to calculate link limits provided they are shifted by
the additional system loss in dB. For example, with 20 mA
of transmitter drive current, 1.6 km link distance is achievable. With 2 dB of additional system loss, 1.2 km link distance is achievable.
LOGIC LINK DESIGN UP TO 35 MBd
For data rates up to 35 MBd, or longer distance, the HFBR14X4 high power transmitter and/or the HFBR-24X4 receiver can be used. The table on the following page
summarizes the typical performance of a 30 MBd link. For
more details, please refer to HP Application Bulletin 73
(5954-8415). If circuit design assistance is needed, please
contact your local Hewlett-Packard Components Field
Sales Engineer.
For data rates of up to 150 MBd, the HFBR-14XX transmitters and the HFBR-24X6 receiver can be used. The table
on the following page summarizes the typical performance
of a 100 MBd link. For more details, please refer to HP
Application Bulletin 74. If circuit design assistance is
needed, please contact your local Hewlett-Packard Components Field Sales Engineer.
CABLE SELECTION
The HFBR-0400
as 62.5/125 I'm,
1000 I'm Plastic.
ameters need to
Series can be used with fiber sizes such
100/140f.Lm, 50/125 I'm, 200f.Lm PCS and
Before selecting a fiber type, several parbe carefully evaluated.
The bandwidth and attenuation (dB/km) of the selected
fiber, in conjunction with the amount of optical power
coupled into it will determine the achievable link length.
The parameters that will significantly affect the optical
power coupled into the fiber are as follows:
a.
Fiber Core Diameter. As the core diameter is increased,
the optical power coupled increases, leveling off at
about 250 I'm diameter.
b. Numerical Aperture (NA). As the NA is increased, the
optical power coupled increases, leveling off at an NA
of about 0.34.
In addition to the optical parameters, the environmental
performance of the selected fiber/cable must be evaluated.
Finally, the ease of installing connectors on the selected
fiber/cable must be considered .
ST connectored fiber optic cable is available from a variety
of manufacturers and distributors, including those listed in
HP Technical Brief 105; ST Connector/Cable Guide. For
ST Evaluation Cables from Hewlett-Packard, please refer
to page 13.
ST CONNECTORS
ST connections are locking, vibration resistant, low loss
and very repeatable. The HFBR-0400 ST Series Transmitters and Receivers are compatible with AT&T's ST
Connector and bayonet connectors from a varietyof manufacturers and distributors. For more information about ST
Connectors, please refer to Technical Brief 105; ST Connector/Cable Guide.
SMA CONNECTORS
The HFBR-0400 SMA Series Transmitters and Receivers
are compatible with SMA type connectors. Depending
upon the type of SMA connector that is chosen, price,
performance, and reliability will vary. For more information
about SMA connectors, please refer to Technical Brief 101;
Fiber Optic SMA Connnector Technology.
8-39
....
---
...
, - - _...
"
._._---
5 MBd Link performance -40°C to +85°C unless other wise specified
Symbol
Min.
1} -24 dBm Peak
Asynchronous data rate limit is based on these assumptions:
a) NRZ data; b) arbitrary timing - no duty factor restriction;
c) TTL threshold,
The EYE pattern describes the timing range within which there
is no uncertainty of the logic state, relative to a specific threshold, due to either noise or intersymbol prop, delay effects.
(see Application Bulletin 73 for details)
Min.
Mal(.
Parameter
Symbol
Optical Power Budget
w/62.5/12S I'rn Fiber
OPB62,$
13'S
dB
HF8R·14X4/24X4
w/62,S/125 Jim, NA" 0.27
Optical Power Budget
w/100/140 I'm Fiber
OPB,oo
13.5
dB
HFBR-14X2/24X4
w/100/140 /otm, NA '" 0.30
OPB50
9
dS
HFBR·14X2/24X4
w/SO/125 I'm, f\lA = 0.18
OPB200
19
dB
HFBR-14X4/24X4
w/200 11m POS, NA " 0.40
30
MBaud
Optical Power Budget
w/50/125 Mm Fiber
Optical Power Budget
w/200 11m PCS Fiber
.
Data Format
NRZ
de
lYp.[1]
Units
propagation Delay
LOW to HIGH
tpLH
12
naea
Propagation Delay
HIGH to LOW
t~HL
e
naec
tpl.WtpHL
4
nsec
System Pulse Width
Distortion
Bit Error Rate
10-9
SER
Notes:
1. Typical data at T = 25' C, Vee = 5.0 V dc,
2. This circuit utilizes the LT1016 comparator from Linear Technology Corporation, If operated at 5 MBd, an additional 4.5 dB
of optical power budget can be obtained.
8-40
Conditions
Reference AB 73
forelreults detailS, Note 2, 3
TA'" 25"0,
PR=~13 dBm Peak
.£" 1.0 metre
Data Rate so 30 MBaud
PR > ~2S.5 dBm Peak
3. If HFBR-24X4 is replaced with the HFBR-24X6, an additional
5.5 dB of optical power budget can be obtained at 30 MHd NRZ.
100 MBd Link Performance
(see Application Bulletin 74 for details)
Min.
Typ,(1)
Parameter
Symbol
Optical Power Budget
w/62.5/125 pm Fiber
OPBSZ,5
19
dB
HFBR-14X4/24X6
w/62.5/125 I'm, NA .. 0.27
Optical Power Budget
w/100!140 I'm Fiber
OPB 100
19
dB
HFBR-14X2/24X6
w/l00/140 I'm; NA " 0.30
Optical Power 8udget
w!50!125,um Fiber
OP85Q
14
dB
Optical Power 8udget
w/200 ,um PCS Fiber
OP820Q
Max.
Units
Conditions
HF8R-14X4/24X6
w/50/125 I'm, NA " 0.18
Data Format
20% to 80% Duty Factor
24
d8
HFBR-14X2/24X6
w/200 I'm
NA ;: DAD
100
M8aud
Reference AS 74
for circuit details, Note 2
Propagation Delay
LOW to HIGH
tpLH
5
nsec
Propagation Delay
HIGH to LOW
tpHL
4
nsec
tpu,-tpHL
1
nsec
pes.
TA" 25"C,
PR" -7 d8m Peak
System Pulse Width
Distortion
Bit Error Rate
10-9
SER
Q;: 1.0 metre
Data Rate:5 100 M Baud
PR> ·31 dBm Peak
Notes:
1. Typical data at TA =25°C, VEE =-5.,2 Vdc, Vee =0 (ECL),
2, The optical power budgets at 100 MBd were measured with an unrestricted receiver, without a Nyquist filter. A 10116 ECL line receiver
was used in the receiver digitizing circuit. If unnecessary bandwidth is eliminated by low-pass filtering, an additional 2 dB of link
budget is attainable at 30 MBd.
5 MBd Link Performance
SELECT R, TO SET IF .
TLDATA
t5V
HFBR-24X2
RECEIVER
HFBR-14XX
TRANSMITTER
~
OUT
2
R
6
7&3
TRANSMISSION
DISTANCE - 2
NOTE:
IT IS ESSENTIAL THAT A BYPASS CAPACITOR (0,01 "F TO 0.1 "F
CERAMIC) BE CONNECTED FROM PIN 2 TO PIN 7 OF THE RECEIVER.
TOTAL LEAD LENGTH BETWEEN BOTH ENDS OF THE CAPACITOR
AND THE PINS SHOULD NOT EXCeeD 20 mm,
Figure 2. Typical Circuit Configuration
8-41
RL
I
Vee
r-...",.....,~-"""'---r-~...,.O
50
P"T==~'-_"'l40
--i---r+---j30
_:7f_ _+
__"1 20
1
is
Ie
~
Io
Ie
it
~~#r----+---4----j'O ~~
!
UNK LENGTH (kml
UNK LENGTH (km)
Figure 3. HFBR-1414/HFBR-2412 Link
Design Limits with
62.5/125 /Lm. Cable
Figure 4. HFBR-14X2IHFBR-24X2 Link
Design Limits with
100/140 /Lm Cable
Figure 5. HFBR-14X4/HFBR-24X2Unk
Design Limits with
.
50/125 /Lm Cable
55
50
45
z
0
;::
a:
40
0
In
2i
N
a:
35
z
9
20L-~~-~~--~~-~~~~
-22 -21 -20 -19 -18 -17 -16 -15 -14 -13 -12
PR - RECEIVER POWER - dBm
PR - RECEIVER POWER - dBm
Figure 6. Propagation Delay through System with
One Metre 01 Cable
Figure 7. 1\'plcal Distortion 01 NRZ EYE-pallern with
Pseudo Random Data at 5 Mb/s
(see nole 2) ..
PULSE REPETITION
FRED."" MHz
INPUT
INPUTUF)
~
~
D-
~
I -
FROM l-METRE
TEST CABLE
+5V
Pr
lIMIN.G
ANAl.YSlS
EQUIPMENT
~~E
__J
I: pt~~1F.=1~~~r-~O=U=T;PU~T.L._~
15pF +}vo
Va
:~.~ ~~~'I"
1,6V
o
HFBR-2412 RECEIVER
. Figure 8. System Propagation Delay Test Circuit and Waveform Timing Definitions
8-42
.
~-
H' H SP&lED
LOW COST
FIBER OPT,c
TRAt:t§MITTeR
Absolute Maximum Ratings
Parameter
HFBR-141i (STI
HFBR-14141§'rh
HEaR-1402 (SM$i
Storage
Operating
Lead
Soldering
Cycle
HF§R-140:(SM'I'
Forward
Input
Current
Description
Reverse Input
The HFBR-14XX fiber optic transmitter contains an 820 nm
GaAIAs emitter capable of efficiently launching optical
power into four different optical fiber sizes: 62.S/12Spm,
100/140pm, SO/12Spm, and 200pm PCS. This allows the
designer flexibility in choosing the fiber size. The HFBR14XX is designed to operate with the Hewlett-Packard
HFBR-24XX fiber optic receivers.
V
1.B
PIIIl
!
ANODE
2'
CATHODE
The HFBR-14XX transmitter's high coupling efficiency allows the emitter to be driven at low current levels resulting
in low power consumption and increased reliability of the
transmitter. The HFBR-14X4 high power transmitter is
optimized for small size fiber and typically can launch
-16.SdBm optical power into SO/12Spm fiber and -12dBm
into 62.S/12Spm fiber. The HFBR-14X~ standard transmitter
typically can couple -11.SdBm of optical power into
100/140 pm fiber cable. It is ideal for large size fiber such
. as 100/140pm. The high power level is useful for systems
where star couplers, taps, or inline connectors create
large fixed losses.
Consistent coupling efficiency is assured by the doublelens optical system (Figure 1). Power coupled into any of
the three fiber types varies less than S dB from part to part
at a given drive current and temperature. The benefit of
this is reduced dynamic range requirements on the receiver.
VSR
Volt ge
3
4
S
6'
7'
8
PINNO.!
INDICATOR
FUNCTION
N.C.
ANODE
CATHODE
N.C.
N.c.
ANODE
AIIlDoe
N.C.
"PINS 2, 6 AND 7
ELECTRICALLY
CONNECTED TO HEADER
BOTTOM VIEW
CAUTION: The small junction sizes inherent to the deSign
of this component increases the component's susceptibility
to damage from electrostatic discharge (ESD). It is advised
that normal static precautions be taken in handling and
assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
Electrical/Optical Characteristics -40° C to +8So C unless otherwise specified
Parameter
Forward Voltage
Symbol Min. Typ.l2} Max.
VF
Forward Voltage
Temperature Coefficient
VF/T
Reverse Input Voltage
VSR
1.58
Units
Conditions
Notes
V
IF=60mA
Fig. 9
mVioC
IF=60mA
Fig. 9
3.8
V
IR;; 100pA
nm
1.80
-0.86
1.8
Peak Emission
Wavelength
AP
820
Diode CapaCitance
CT
14S
Optical Power
APT/AT
Temperature Coefficient
-0.016
2.19
II
dB/oC
Fig. 12
V= 0, f= 1 MHz
IF=60mA
·OIW
NoteS, 8
290
,um
Note 4
1S0
,urn
Note 4
Thermal Resistance
SJA
240
Numerical Aperture
(HFBR-14X2)
NA 14X2
0.49
Numerical Aperture
{HF6R-14X4}
NA14X4
0.31
Optical Port Diameter
(HF6R-14X2)
DT14X2
Optical Port Diameter
(HFBR-14X4)
DT14X4
8-43
Electrical/Optical Characteristics -40°C to +85°C unless otherwise specified
HFBR-1412 and HFBR-1402 Peak Output Optical Power Measured Out of 1m of Cable
Parameter
62.5/125 j.
+-
I"
E
Q
£
0.4
0.2
,I
00
2.2
>=
-2
~
-3
a:
-4
-5
-6
-7
-9
lI
;;
E
,;:
10
20
30
40
50
60
70
IF - FORWARD CURRENT -,mA
VF - FORWARD VOLTAGE-V
Figure 10. Normalized Transmitter Output vs. Forward Current
Figure 9. Forward Voltage and Current Characteristics
8-45
1.3
r\1
1.2
r-----------~~--------------------_r--~+5V=VCC
ffi
~
Ry
!;
i=
o"
I
1.1
~
0.9
0.8
J 1
1. IL
::-{-I
I
F
-
-~-l
I
I
I
L_____ -t~~_J
0.5
IT
1n
0.4
0:
E
0.2
0
~
0:
O.
1~
L
IL
w
760
r-----
r-
~5"C
1L
.... NO.3
""", E"
.<
fi
I
0.7
0.6
~L-.i-~IT1~'-r~R~x~21 HFBR-1412/1414
TTL IN >-.......+--=..-LJ
\ ·41rC
1.0
1\ 1\.\
~ ~
"\1\.
~ l\...."\
Z
~~
780
800
820
840
860
880
900
A -WAVELENGTH - NANOMETRES
Figure 11. Recommended Drive Circuit
Figure 12. Transmitter Spectrum Normalized to the Peak
at 25°C
Figure 13: Test Circuit lor Measuring t r• tl
8-46
Absolute Maximum Ratings
5MBd
LOW COST
FIBER OPTIC
HFBR-2412 (ST)
HFBR-2402 (SMA)
f,
Storage Temperature
Ts
Operating Temperature
TA
Lead
So/derlng
Cycle
RECEI~iR
Description
The HFBR-24X2 receiver incorporates an integrated photo
IC containing a photodetector and dc amplifier driving an
open-collector Schottky output transistor. The HFBR-24X2
is designed for direct interfacing to popular logic families.
The absence of an internal pull-up resistor allows the.
open-collector output to be used with logic families such
as CMOS requiring voltage excursions much higher than
Vee·
Both the open-collector "Data" output Pin 6 and Vee Pin
2 are referenced to "Com" Pin 3, 7. The "Data" output
allows busing, strobing and wired "OR" circuit configurations. The transmitter is designed to operate from a single
+5 V supply. It is essential that a bypass capacitor (0.01 JLF
to 0.1 JLF ceramic) be connected from Pin 2 (Vee> to Pin 3
(circuit common) of the receiver.
CAUTION: The small junction sizes inherent to the design
of this component increases the component's susceptibility
to damage from electrostatic discharge (ESD). It is advised
that normal static precautions be taken in handling and
assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
Max.
-55
+8$'
Units R.ferene.
'C
+260 'C
Ii -Temp.
---/----/---t---,;j---;
I Time"
Supply Voltage
Vee
Output Current
1o
Oulput Voltage
The HFBR-24X2 fiber optic receiver is designed to operate
with the Hewlett-Packard HFBR-14XX fiber optic transmitter
and 62.5/125 JLm, 1001140 JLm, and 50/125 JLm fiber optic cable.
Consistent coupling into the receiver is assured by the
lensed optical system (Figure 1). Response does not vary
with fiber size.
Min.
-0.5
25'
Vo
Output Collector
Power DISSipation
7.~
18.0
V
Po AV
4'(f
mW
N
5
Pan Out (TTL)
-0.5
V
rnA
I:~R
PIN NO. 1 INDICATOR - - . .
f-J .405
"
0306
Note 2
Vee
DATA
COMMON
l"'1__........"
1'\..~~01
~108
BOTTOM VIEW
PIN
1
2
3'
4
5
6
7'
a
FUNCTION
N.C.
V.d5V)
COMMON
N.C.
N.C.
OATA
COMMON
N.C,
'PINS 3 AND 7 ARE ELECTRICALLY
CONNECTED TO HEADER
(Continued on next page)
8-47
- - - - - _... _ •.._ - - - - -
Electrical/optical Characteristics -40°C to +85°C unless otherwise specified
Fiber sizes with core diameter::; 100 /.1m and NA::; 0.4, 4.75::; Vee::; 5.25 V
Parameter
Symbol
1\Ip.(3) Max.
Min,
Units
High Level Output
Current
IOH
5
250
IJA
Low Level Output
Voltage
VOL
0.4
0.5
V
High Level Supply
Current
lecH
35
6.3
Low Level Supply
Current
lecL
6.2
10
Equivalent NA
NA
.50
Optical Port Diameter
DR
400
Reference
Vo'" laV
PR <: -40dBm
10 ~ a mA
PR;' -24 d6m
I
mA
Vee'" 5.25 V
PR'" -40 dBm
mA
Vec - 5.25 V
PR" -24 dBm
Dynamic Characteristics
Parameter
Condition,
Symbol
Peak Input Power
Level Logic HIGH
PRH
Peak Input Power
Level Logic LOW
PRL.
Note 4
/.1m
-40°C to +85°C unless otherwise specified; 4.75::; Vee::; 5.25 V
Min.
1\Ip.13]
Max.
Unit$
Condillon$
Notes
-40
dBm
AP =820 nm
Note 5
TA'" +25°C,
IOL"'8 mA
NoteS
0.1
/.IW
-25.4
-9.2
dBm
2.9
120
/.IW
-24.0
-10.0
dBm
4.0
100
/.IW
Propagation Delay
LOW to HIGH
tPLHR
65
nsec
Propagation Delay
HIGH to LOW
tPHLA
49
nsec
Notes:
1. 2.0 mm from where leads enter case.
2. 8 mA load (5 x 1.6 mAl, RL = 560 n.
3. Typical data at TA = 25'C, Vee = 5.0 V dc.
4. DR is the effective diameter of the detector image on the plane
of the fiber face. The numerical value is the product of the
actual detector diameter and the lens magnification.
5. Measured at the end of 100/140 I'm fiber optic cable with large
area detector.
-40 40IJW, then pulse width distortion may increase. At Pin = 80J.l.W
and T A = 85° C, some units have exhibited as much as 100 ns pulse width
distortion.
5 Typical specifications are for operation at TA = 25°C and Vee = S.OV.
6. Input optical signal is assumed to have 10% - 90% rise and fall times of
less than 6 ns.
7. Percent overshoot is defined as:
VPK - V100% x 100%
V100%
3. VaUT = Va DC -IRp x PR"
4. OR is the effective diameter of the detector image on the plane of the
fiber face. The numerical value is the product of the actual detector
diameter and the lens magnification.
'
(VPOWER SUPPLY RIPPLE)
8. Output referred PS.R.R. .
15 defined as 20 log
8-50
VOUT RIPPLE
---------------------------------
125 MHz
LOW COST
FIBER OPTIC
RECEIVER
Absolute Maximum Ratings'
HFBR-241 Er(ST)
HFBR-2406 (SMA)
Description
The HFBR-24X6 fiber eptic receiver is designed to. eperate
with the Hewlett-Packard HFBR-14XX fiber eptic transmitters and 62.5/125 I'm, 1001140 I'm, and 50/125 I'm fiber eptic
cable. Censistent ceupling into. the receiver is assured by
the lensed eptical system (Figure 1). Respense dees net
vary with fiber size fer cere diameters ef 100 I'm er less.
The receiver eutput is an analeg signal which allews
fellew-en circuitry to. be eptimized fer a variety ef distancel
. data rate requirements. Lew-cest external cempenents
can be used to. cenvert the analeg eutput to. legic cempatible signal levels fer varieus data fermats and data rates
up to. 150 MBaud. This distanceldata rate tradeeff results
in increased eptical pewer budget at lewer data rates
which can be used fer additienal distance. er splices.
The HFBR-24X6 receiver centains a PIN phetediede and
lew. neise transimpedance pre-amplifier integrated circuit.
The HFBR-24X6receives an eptical signal and cenverts it
to. an analeg veltage. The eutput is a buffered emitterfellewer. Because the signal amplitude from the HFBR-24X6
receiver is much larger than frem a simple PIN phetediede,
it is less susceptible to. EMI, especially at high Signal rates.
The receiver has a minimum dynamic ral1ge ef 23 dB ever
temperature (assuming 10-9 BER). Because the maximum
receiver input pewer is 6 dB larger and the neise is 2 dB
lewer ever temperature than HP's HFBR-24X4 25 MHz
receiver, the HFBR-24X6 is well suited fer mere demanding
link designs that require wide receiver dynamic range.
The frequency respense is typically dc to. 125 MHz. Fer
bandwidth selectien centact yeur HP Cempenents sales
engineer. Altheugh the HFBR-24X6 is an analeg receiver, it
is easily made cempatible with digital systems. Please refer
to. Applicatien Bulletin 74 fer simple and inexpensive
circuits that eperate up to. 150 MBaud.
PIN NO, 1 INDICATOR
BOTTOM VIEW
PIN
1
2
3'
4
5
S
7'
8
FUNcTION
N.c.
SIGNAl.
V..
N.c
N.C.
Vee
V..
N,C.
'PINS 3 AND 7 ARE ELECTRICALLY
CONNECTED TO HEADER
CAUTION: The small junction sizes inherent to the design
ef this component increases the compenent's susceptibility
to damage from electrestatic discharge (ESD). It is advised
that normal static precautions be taken in handling and
assembly of this cempenent to prevent damage andler
degradation which may be induced by ESD.
The recemmended AC ceupled receiver circuit is shewn in
Figure 14. It is essential that a 10 ehm resister be cennected between VEE and the pewer supply, and a 0.1 I'F
ceramic bypass capaciter be cennected between the pewer
supply and greund.
(Continued en next page)
8-51
Electrical/Optical Characteristics
RLOAD = 511
n,
Fiber sizes with core dia.
~
-40°C to +85°C; -5.45 ~ Supply Voltage~, - 4.75,
100 microns. and N.A. ~ 0.35 unless otherwise specified.
Symbol
Min.
Typ.t2J
Max.
Unit
Responsivlty
Rp
5
7
9
mV/I"W
TA = 25°C
at 820 nm, 50 MHz
11.5
mV/I"W
@ 820 nm, 50 MHz
RMS Output
Noise Voltage
VNO
0.38
0.53
mV
Bandwidth Filtered
@75MHz
PR= O,uW
0.70
mV
Unfiltered Bandwidth
PR '" O,uW
-43.0
-41.9
dBm
0.050
0.065
pW
Bandwidth Filtered
@75MHz
-7.6
dBm
TA=25°C
175
,uW
-8.2
dBm
150
,uW
Parameter
4.5
Equivalent Optical Noise
Input Power (RMS)
PN
Peak Input Power
PR
Output Impedance
20
DC Output Voltage
Vodc
30
Conditions
n
Test Frequency =
50 MHz
-3,1
-2.4
V
PR" O/tW
lEE
9
15
rnA
RLOAD" 00
Equivalent NA
NA
0.35
Equivalent Diameter
DR
324
Power Supply Current
-4.2
pm
Reference
Note 3, 4
NoteS
Figure 15
Figure 16
Note 6
Note 7
Dynamic Characteristics -40° C to +85° C; -5.45 ~ Supply Voltage~, - 4,75, RLOAD = 511 n,
CLOAD '" 5 pF unless otherwise specified
Parameter
Rise/Fall Time
10% to 90%
Pulse Width Distortion
Typ.[2}
Max.
Unit
Ir, If
3,3
6.3
ns
PWD
0.4
2,5
Symbol
Overshoot
Min.
Reference
PR = l00,uW
Figure 17
ns
PR '" 150 pW Peak
2
%
PR " 5 pW Peak,
tropt" 1.5 ns
Note 9
-3 dB electrical
Note 10
at 10 MHz
Note 11
Bandwidth (Electrical)
BWe
125
MHz
Power Supply Rejection
Ratio
PSRR
20
dB
0.41
Hz,s
Bandwidth, Rise Time
Product
Conditions
Note 8, Figure 17
Note 12
Noles:
1, 2,0 mm from where leads enler case,
2, Typical specifications are for operation al TA; 25°C and VEE; -5,2 Vdc,
3, For 200 I'm PCS fibers, typical responsivity will be 6 mVlI'W Other parameters will change as well.
4, Pin #2 should be ac coupled to a 511 ohm load, Load capacitance must be less than 5 pf,
S. Measured with a 3 pole Bessel filter with a 7S MHz, -3 dB bandwidth, Recommended receiver filters for various bandwidths are
provided in Application Bulletin 74,
6, Overdrive is defined al PWD ; 2,S ns,
7, DR is the effective diameter of the detector image on Ihe plane of the fiber face, The numerical value is the product of the actual
detector diameter and the lens magnification,
8, Measured with a 10 ns pulse width, SO% duty cycle, at the SO% amplitude point of the waveform,
g, Percent overshoot is defined as: VPK - V100%
x 100%,
V100%
10, For bandwidth selection contact your HP Componenets sales engineer,
11, Output referred P'S,R,R, is defined as 20 log (VPOWER SUPPLY RIPPLE)
Your RIPPLE
12, The conversion factor for the rise time to bandwidth is 0.41 since the HFBR-24X6 has a second order bandwidth limiting
characteristic,
8-52
- - - - - - - - - - - - - - - - - - - - - -..
VC:~
r - -----<)---,
I
:+
"t..-, ./
I
""
.I.:IGNAL
T1:
1
....
L -
-
3.7
>iiEE-
1=
150
~>
.
125
>
100
I
!:
O.I.F
511
-.-~
'"w2
n
0
75
'"02
...<
50 .........
w
...J
Ion
"'-......
V
t-.
a:
t;
25
~
POWER SUPPLY
°0L--~60--1~0-0--1~50-~2~OO-~2~50~~300
(-5.2 VI
FREQUENCY - MHz
Figure 14. Recommended AC Coupled Receiver Circuit
Figure 15. Typical Spectral Noise Density vs. Frequency
6.0
3.0
2
0
,
2.5
;::
a:
~
2.0
J:
1.5
:;;
;::
II
2i
t-
5.0
w
o
i
w
~
1.0
I
0
0,5
."
III
w
1
........
if
00
40
PR
-
80
120
a:
200
1ft-3.0
tr
I
1/
160
4.0
w
'"02
=-
$
2.0
1.0
-60 -40
240
-20
20
40
TEMPERATURE _
INPUT OPTICAL POWER. PEAK - IlW
Figure 16. Typical Pulse Width Distortion vs. Peak Input Power
60
80
100
°c
Figure 17. Typical Rlse,and Fall Times vs. Temperature
8-53
- - - - - - - - - - - - - - - ' _...
__
....
- ..........---..-
ST Evaluation Kit
The HFBR-0410 kit is a simple and inexpensive way to
demonstrate the performance of Hewlett-Packard's HFBR0400 ST Series transmitters and receivers.
The HFBR-0410 ST Evaluation Kit contains the following
items:
• One HFBR-1412 transmitter
• One HFBR-2412 five megabaud TTL receiver
• Three metres of ST Connectored 62.5/125 I'm fiber
optic cable with low cost plastic ferrules
• HFBR-0400 Series data sheets
• HP Application Bulletin 73
• ST connector and cable data sheets
To order an ST Evaluation Kit. please specify HFBR-0410.
Quantity 1.
SMA Evaluation Kit
The HFBR-0400 kit is a simple and inexpensive way to
demonstrate the performance of Hewlett-Packard's HFBR0400 SMA Series transmitters and receivers.
The HFBR-0400 SMA Evaluation Kit contains the following
items:
• One HFBR-1402 transmitter
• One HFBR-2402 five megabaud TTL receiver
• Two metres of SMA connectored 1000 I'm plastic core
fiber optic cable
• HFBR-0400 Series data sheets
• HP Application Bulletin 73
To order an SMA Evaluation Kit. please specify HFBR0400. Quantity 1.
ST Evaluation Cables
Hewlett-Packard offers six different ST connectored cables.
available for prototyping purposes. These simplex cables
use an ST Connector with a precision ceramic ferrule.
One and ten metre simplex cables are available with
62.5/125I'm. 1001140 I'm. and 50/125 I'm fiber sizes. To order
any of these cables. please select the desired part number
found below:
For example. to order two connectored simplex cables
with 62.5/1251'm fiber. and ST connectors with ceramic
ferrules. each ten metres long. specify:
HFBR-BXS010
Quantity:
2
ST CABLE SELECTION MATRIX
Fiber Size (I'm)
Part Number
100/140
HFBR-AXS001
X
HFBR-AXS010
X
HFBR-8xSOO1
HFBR-8XS010
62.5/125
50/125
X
X
Connector
Cable
ST·Ceramic
Simplex
1 metre
X
X
X
X
X
X
X
HF8R-CXSOO1
X
X
X
HFBA-CXS010
X
X
8-54
Length
X
X
X
X
X
10 metres
X
X
X
Because our ST evaluation cables are short in length,
optical attenuation will be insignificant. The optical loss
throughout the cable will typically be 0.5 dB, attributable
to the ST Connectors on each end of the cable. It should
be noted that Hewlett-Packard's HFBR-0400 ST Series
transmitter and receiver specifications already account for
losses through the ST Connectors.
For longer distance cable lengths, mechanical and optical
parameters can be guaranteed by a variety of cable suppliers. For technical information about ST Connectors,
and a listing of ST connectored cable suppliers, please
refer to Technical Brief 105, or call your local HP Components Field Sales Engineer.
Mechanical Dimensions
HFBR-0400 ST SERIES
SECTION A-A
HFBR-0400 SMA SERIES
_ ---1I
4.8
l'
I~
-It
2.5
(0.10)
(O~O~)
DIA.
PIN NO.1 INDICATOR
NOTE:' ALL DIMENSIONS IN MI LLIMETRES AND (INCHES).
8-55
f
9.5
(0.375)
~
1.27
(0.05)
i
ST CONNECTOR (See note 3)
~-----------~~l>------------~
(O'~:rDIA'
r
SMA CONNECTOR
(Used on HP's 100/140 J.lm fiber optic cable assemblies)
NOTES,
1. ALL DIMENSIONS ARE IN MILLIMETRES AND (INCHES).
2. FOR APPLICATIONS WITH SPACE CONSTRAINTS. THE HFBR-0400
ST AND SMA SERIES PACKAGE CAN BE SUPPLIED WITHOUT THE
UPPER AND LOWER HOUSING (SEE FIGURE 1). FOR MECHANICAL
DIMENSIONS, PLEASE SEE YOUR HP COMPONENTS FIELD SALES
ENGINEER. THE DIMENSIONS ARE SIMILAR TO THE HFBR-0200.
3. FOR THE ST CONNECTOR SHOWN ABOVE. THE CORRESPONDING
AT&T PART NUMBERS ARE P2020A·C·125. P2030A·C·125. P2020A·M25.
AND P2030A·C·140.
4. COLOR CODING; PART MARKING IS IN RED FOR HFBR-14XX
TRANSMITTERS AND BLACK FOR HFBR-24XX RECEIVERS. THE
PORTS ARE SHADED AS SHOWN BELOW.
RECEIVERS
TRANSMITTERS
8-56
F/in-
GLASS FIBER'OPTIC
CABLE/CONNECTOR
ASSEMBLIES
HEWLETT
~~ PACKARD
Features
• SMA CONNECTORS OR UNCONNECTORED
o CONNECTORS FACTORY INSTALLED AND
TESTED
• SIMPLEX OR DUPLEX CABLE WITH 100/140 j.lm
GLASS FIBER
• UL RECOGNIZED COMPONENT PASSES UL
VW·1 FLAME RETARDANCY SPECIFICATION·
o RUGGED TIGHT JACKET CONSTRUCTION
• PARAMETERS OPTIMIZED FOR LOCAL DATA
COMMUNICATIONS
• BANDWIDTH: 40 MHz AT 1 km
Fiber OptiC Cable construction
Description
2.65 mm NOMINAL CIA.
6.3 mm NOMINAL WIDTH
POLYURETHANE OUTER JACKET
ARAMID STRENGTH MEMBERS
SECONDARY JACKET
SILICor~E BUFFER
GLASS OPTICAL
FIBER
•
SMA connectored cable assemblies are intended for use
with the HFBR-0400 SMA Series transmitters and receivers.
These cables are available in standard lengths. as shown in
the cable assembly ordering guide. Unconnectored 100/140
I'm fiber optic cable is also available.
The simplex cable is constructed of a single graded index
glass fiber surrounded by a silicone buffer, secondary
jacket, and aramid strength members. The combination is
covered with a scuff resistant polyurethane outer jacket.
The duplex cable has two glass fibers each in a cable of
construction similar to the simplex cable, joined with a
web. The individual channels are identified by a marking
on one channel of the cable.
DUPLEX
,SIMPLEX
The cable's resistance to mechanical abuse, safety in flammable environments, and absence of electromagnetic
interference effects may make the use of conduit unnecessary. However, the light weight and high strength of the
cables allows them to be drawn through most electrical
conduits. The connectors must be protected during installation by a pulling grip such as Kellems 033-29-003.
'UL File Number E84364
Mechanical Dimensions
r
CABLE LENGTH TOLERANCE
Cable Length (Metres)
REF. PLANE FOR
J
391151 M A X ; s j
FERRULE
CABL~.~:NGTH
316
(.12351
1"Z451~
-:}Q.301J:J
8.38 (0.33)
SMA STYLE CONNECTOR
8-57
Tolerance
1-10
+10/-0 %
11-100
+1/-0 Metre
> 100
+1/-0 %
NOTES:
1. DIMENSIONS ARE IN mm (lNeIlES).
2. FIBER END IS LOCKED FLUSHIIIITH
FERRULE fACE.
CAUTION,
,. COUPLING NUT SHOULD NOT BE OVERTlGfHENED:
TORQUE 0.05 TO 0.1 UNITS N'm OVoR
TIGIiTENING MAY CAu~E EXCESSIVE flSER
MISALIGNMENT OR PERMANENT DAMAGE.
2. GOOD SYSTEM PEI1FORMANCE REOUI flES
CLEAN FERRULE fACES TO AVOID DeSTRUCTING
THE OPTICAL PATH. CLEAN COMPRESSED AIR
OFrEN IS SUFFICI ENT TO REMQVE PARTIClES.
A COTTON Sll/AB SOAKED IN METHANOL OR !'REON··
MAY ALSO BE USED.
Absolute Maximum Ratings
Parameter
Symbol
Min. Max. Units
Relative Humidity
at TA'" 70"C
95
%
Note
13
Storage Temp.
Ts
-40
+85
Operating Temp.
TA
-20
+85
r
25
mm
10
50K
Cycles
1
Bend Radius,
No Load
Flexing
Symbol
Numerical Aperture
Alten uation
Symbol
Fe
200
m
1.5
N
kg
h
0,15
m
on Cable
Tensile
Force on Conneclor/Cable
Min. TypJ6J
0:0
3.5
4,5
20
Max.
Units
8
dB/Krn
Conditions
A = 820 nrn, Q ?; 300m
MHz
A = 820 nm (LEO)
5
ns/m
A =820 nm
Optical Fiber Core Diameter
Dc
100
Cladding Outside Diameter
DCL
140
4
11
I'm
Index Grading Coefficient
g
2
-
Cable Structural Strength
Fc
1800
N
I Dual Channel
Note
5, 14
40
Cable Leakage Current
Fig.
7,12
IN
Unit Length
9,8
A= 820 nm
BW
mlQ
N
100
-20° C to +85°C Unless Otherwise Specified,
0,3
NA
300
Fr
Bandwidth @ 1 km
I Single Channel
2,8
3
Travel TI me Constant
Mass per
Note
Impact
°C
Mechanical/Optical Characteristics
Parameter
Min, Max. Units
Parameter
Crush Load
6
8
kg/km
12
IL
nA
30
Noles:
1,180° bending at minimum bend radius, with 10N tensile
load,
2, Force applied on 2,5 mm diameter mandrel laid across the
cable on a flat surface, for 100 hours, followed by flexure
lest.
3. Tested at 1 impact according to DOD-STD-1678, Method
2030, Procedure 1,
4. Fiber N,A, is measured at the end of 2 metres of mode slripped
fiber, using the far field pattern, N,A, is defined as the sine of
Ihe half angle, determined at 5% of the peak intensity point.
5. Bandwidth is measured with a pulsed LED source (h = 820
nm), and varies as Q -0,85, where Q is the length of the fiber
(km), Pulse dispersion and bandwidth are approximately
inversely related,
6. Typical values are at TA = 25°C,
7, Fixed losses (length independent) are included in Transmitter/Receiver optical specifications,
SOKV, Q'" O.3m
8, One Newton equals approximately 0.225 pounds force.
g, Short term, '" 1 hr,
10, The probability of a fiber weak point occurring at a point of
maximum bend is small, consequently the risk of fiber
breakage from exceeding the maximum curvature is
extremely low,
11, Travel time constant is the reciprocal of the group velocity
for propagation of optical power, Group velocity, V = hln
where h = velocity of light in space = 3 x 108 m/s and n =
effective core index of refraction,
12, For lower attenuation cable consult local HP sales office,
13, This applies to cable only,
14, For wider bandwidth cable consuillocal HP sales office,
8-58
-------------------------
I,r~ =
Cable Assembly Ordering Guide
= SIMPLEX
The desired fiber optic cable assembly can be identified
by examining the part number description in Figure 1. To
minimize delivery turnaround time, fixed lengths of cable
have been adopted. The standard offerings of connectored
and unconnectored glass fiber optic cables are listed below.
LD
HFBR-l X
1 Iz
y
Lr--
#
DUPLEX
I 1
#
#
A = 100/140 GLASS FIBER CABLE
r- W = SMA CONNECTOR, PRECISION FERRULE
' - - U = UNCONNECTORED
Figure 1. Part Number Description for SMA Connectored Cables
and Unconnectored Cables
SMA AND UNCONNECTORED CABlES[1,2]
Fiber
Size
Part Number
100/140
pm
HP Code
Connector
Style
Cable Type
Uncon- Single
Dual
SMA neetored Channel Channel
u
s
o
Cable Length
1M
5M
10M
25M
SOM
100M
1000M
001
005
010025
050
100
1KM
A
W
x
x
x
x
x
HFBR-AWS010
x
x
x
,HFBR-AWS025
x
x
)(
"HFBR-AWS050
x
HFBR-AWS100
x
x
HFBR-AWD005
x
x
x
x
HFBR-AW0010
x
x
x
HFBR-AWD02S
x
x
x
HFBR-AWDOSO
x
x
x
x
HFBR-AWD100
x
II
x
x
HFBR-AUS100
x
HFBR-AUS1KM
x
HFBR·AUD100
x
x
HFBR·AWSOO1
HFBR-AWS005
HFBR·AUD1KM
x
x
x
)(
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Notes:
1. Please contact your local HP sales office for delivery and pricing of non-standard lengths of SMA connectored cables, and
unconnectored cables with 100/140 I'm fiber.
2. For cables with HFBR-4000 (HP Style) connectors, the standard offerings are identical to the SMA connectored cable offerings. To
order, replace the W (SMA) in the part number with H (HFBR-4000). For example, for one piece of 100/140 I'm duplex fiber cable.
S metres long. with HFBR-4000 connectors. specify HFBR-AHDOOS, Quantity 1.
Examples:
A. To order Ihree duplex 100/140 I'm cable assemblies. 100 metres long each. with SMA connectors, specify: HFBR-AWD100, Quantity 3.
B. To order one simplex 100/140 I'm cable assembly. 10 metres long .. wilh SMA connectors, specify: HFBR-AWS010._Quantity 1.
C. To order two duplex 100/140' I'm cable assemblies, 1000 metres long each, unconnectored. specify: HFBR-AUD1 KM, Quantity 2.
8-59
FliD'l
SNAP-IN FIBER OPTIC LINKS
TRANSMITTERS, RECEIVERS,
CABLE AND CONNECTORS
HEWLETT
a!~ PACKARD
HFBR-0500
SERIES
Features
• GUARANTEED LINK PERFORMANCE OVER
TEMPERATURE
High Speed Links: dc to 5 MBd
Extended Distance Links up to 82 m
Low Current Links: 6 mA Peak Supply Current for
an 8 m Link
Photo Interrupters
• LOW COST PLASTIC DUAL-IN-LiNE PACKAGE
• EASY FIELDCONNECTORING
• EASY TO USE RECEIVERS:
Logic Compatible Output Level
Single +5 V Receiver Power Supply
High Noise Immunity
.
• LOW LOSS PLASTIC CABLE:
Selected Super Low Loss Simplex Cable
Simplex and Zip Cord Style Duplex Cable
Description
The HFBR-OSOO series is a complete family of fiber optic
link components for configuring low-cost control, data
transmission, and photo interrupter links. These components
are designed to mate with plastic snap-in connectors and
low-cost plastic cable.' Link design· is simplified by the
logic compatible receivers and the ease of connectoring
the plastic fiber cable. The key parameters of links configured
with the HFBR-OSOO family are fully guaranteed.
Applications
• HIGH VOLTAGE ISOLATION
• SECURE DATA COMMUNICATIONS
• REMOTE PHOTO INTERRUPTER
• LOW CURRENT LINKS
• INTER/INTRA-SYSTEM LINKS
• STATIC PROTECTION
• Cable is available in standard low loss and selected super low
loss varieties.
• EMC REGULATED SYSTEMS (FCC, VDE)
Link Selection Guide
GUARANTEED LINKS
Guaranteed Link Length
O·70~C
Data
Rate
Standard
Cable
Improved
Cable
Typical Link Length$
2S"C
Standard
Improved
Cable
Cable
Tran&mltter
Receiver
Page
5MBd Link
5MBd
12
17
3Sm
40m
HFBR-1S10 HFBR-2S01
8-62
1 MBd Link
1 MBd
24
34
SOm
65m
HFBR-1S02
HFBR-2S02
8-64
low Current link 40kBd
8
11
30m
35m
HFBR-1512 HFBR·2503
8-66
HFBR-1512 HFBR-2S03
8-66
HFBR-1S12
HFBR·1502
8-68
8-68
Extended
Di$tance Link
40kBd
60
82
100m
12Sm
Photo Interrupter
Unk
20kHz
SOO kHz
N/A
N/A
NlA
N/A
N/A
NfA
N/A
N/A
8-60
HFBR-2503
HFBR·2502
component Selection Guide
TRANSMITTERS
CABLES
Please refer to page 15 (of the Versatile Link Fiber Optics
Data Sheet) for cable specifications.
Minimum Output
Optical Power
o lo70Q C
Peak Emission
Wavelength
Page
HF8R-1510
-16.5 d8m
665 nm
11
HF8R-1502
-13.6 d8m
665 nm
11
-13,6 dBm
665 nm
11
Sensllivily
o to 70° C
DalaRale
~
HF8R-2501
-21,6 dBm
5MBd
12
HF8R-2502
-24dBm
1 MBd
12
HFBR-2503
-39 dBm
40 kBd
14
HFBR-1512
CONNECTORS
Page 17
HF8R-4501 Gray Connector/Crimp Ring
HFBR4511 Blue Connector/Crimp Ring
HFBR-4595 Polishing Kit
Polishing Fixture - Abrasive Paper
HFBR-4596 Polishing Fixture
8ulkhead Feedthrough/ln-Line Splice
HF8R-4505 Gray
HFBR-4515 Blue
RECEIVERS
Mechanical Dimensions
Page 19
5 MBd Link
HFBR-1510 AND HFBR-2501
The dc to 5 MBd link is guaranteed over temperature to
operate up to 17 m with a transmitter drive current of 60
mA. This link uses the 665 nm HFBR-1510 Transmitter, the
HFBR-2501 Receiver, and Plastic Cable. The receiver
compatible with LSTTL/TTL/CMOS logiC levels offers a
choice of internal pull-up or open collector output.
RECOMMENDED OPERATING CONDITIONS
Symbol
Min.
Mal(.
Units
TA
0
70
°C
Transmitter Peak Forward Current
IFPK
10
750
mA
Avg. Forward Current
IFAV
60
rnA
Receiver Supply Voltage
Vee
5,25
V
Parameter
Ambient Temperature
Fan-Out (TTLI
4.75
5
N
8-61
Ref.
Note 1
Note 2
SYSTEM PERFORMANCE Using Standard Cable under recommended operating conditions unless otherWise specified.
Parameter
01
S~"
Data Rate
Transmission Distance
Standard Cable
Pulse Width Distortion
TypJ5]
dc
Q
Max.
Units
Conditions
5
M8d
BER:S 10-9
12
17
Transmission Oistance
Improved Cable
Propagation Oelay
Min.
35
17
24
40
m
IFPK = 60 mA, 0-70"C
m
IFPK = 60 mA, 25" C
m
tFPK'" 60 mA, 0-70° C
m
IFPK = 60 mA, 25" C
n, CL "" 30 pF
Ref.
tPLH
80
140
ns
RL = 560
tpHL
50
140
ns
PR "" -21.6SPR:S-9.5dBm
Note 3
tD
30
ns
PR=-15 dBm
RL"" 5600, CL =30 pF
Fig. 4,6
Note 4
8000
Vim
EMllmmunity
Fig.4,5
BER:S 10.9
Notes: 1. For IFPK > 80 mA, the duty factor must be such as to keep IFAV oS 80 mAo In addition, for IFPK > 80 mA, the following rules for
pulse width apply: IFPK oS 160 mA: Pulse width oS 1 ms
IFPK> 160 mA: Pulse width oS 1 I's
2. It is essential that a bypass capacitor (0.01 I'F to 0.1 I'F ceramic) be connected from pin 3 to pin 4 of the receiver. Total lead
length between both ends of the capacitor and the pins should not exceed 20 mm.
3. The propagation delay of 1 m of cable (5 ns) is included.
4. T D = tpLH - tpHL'
5. Typical data is at 25°C, Vee = 5 V.
Link Design Considerations
The HFBR-1510/2501 Transmitter/Receiver pair is guaranteed for operation at data rates up to 5 MBd over link
distances from 0 to 12 metres with standard cable and
from 0 to 17 metres with improved cable. The value of
transmitter drive current, IF, depends on the link distance
as shown in Figures 2 and 3. Note that there is an upper
as well as a lower limit on the value of IF for any given
distance. The dotted lines in Figures 2 and 3 represent
pulsed operation. When operating in the pulsed mode, the
conditions in Note 1 must be met. After selecting a value
of the transmitter drive current IF, the value of R1 in
Figure 1 can be calculated as follows:
R1
=
Vee-VF
IF
vee
HFBR-2501
Figure 1, Typical Circuit Operation (5 MBd oS 12 m)
8-62
.:
100
90
80
70
60
.!.
50
E
iiia:
a:
40
U
0
30
Y"
V
a:
~
20
't'/
...a
.....
~
~25'C
'-0'C-7D'd
':~
'/
1o
100~----~--~10----1~5----2~0--~~~~30·
."
h
~V
" r
~~
.:
~
./
A
:J
I."
L
o
10
-CABLE LENGTHMETRES OF STANDARD CABLE
15
20
25
30
35
-CABLE LENGTHMETRES OF IMPROVED CABLE
Figure 2. Guaranteed System Performance with HFBR-1510 and
HFBR-2501, Standard Cable
Figure 3. Guaranteed System Performance with HFBR-1510
and HFBR-2501, Improved Cable
HP80078
P!JlSE
GENERATOR
INPUT
MONITORING
NODE
VI
0------+
51n
HFBR-1510
HFBR-2501
Figure 4. A.C. Test Circuil
100
z
0
;:
200
2
I
75
>
~
e
z
e
Q
:z:
....e
;: 100
.:
50
to
i
~
~
150
:3w
a:
~
0
g:
25
I
I!;
I
f;
0
o
-5
-~
50
-25
PR - INPUT OPTICAL POWER - dBm
"'-.
-20
"'....
---
"-
~
-15
...
-10
-
-;"L
-5
PR - INPUT OPTICAL POWER - dBm
Figure 5. HFBR-1510/2501 Link Pulse Width Distortion vs.
Optical Power
Figure 6. HFBR-1510/2501 Link Propagation Delay vs. Optical
Power
8-63
1 MBd Link
HFBR-1502 AND HFBR-2502
The dc to 1 MBd link is guaranteed over temperature to
operate from 0 to 34 m with a transmitter drive current of
60 mA. This link uses the 665 nm HFBR-1502 Transmitter,
the HFBR-2502 Receiver, and Improved Cable. The
receiver is compatible with LSTTL/TTUCMOS logic levels
and offers a choice of an internal pull-up or open collector
output.
RECOMMENDED OPERATING CONDITIONS
Symbol
Min.
Max.
Units
TA
0
70
QC
Transmitter Peak Forward Current
IF PK
10
750
mA
Avg. Forward Current
IF AV
60
mA
Receiver Supply Voltage
Vee
5.25
V
Parameter
Ambient Temperature
Fan-Out (TTL)
4.75
Ref.
Note 1
Note 2
5
N
SYSTEM PERFORMANCE Using Standard Cable under recommended operating conditions unless otherwise specified.
Parameter
Symbol
Transmission Distance
Standard Cable
£
Transmission Distance
Improved Cable
£
Transmission Distance
Standard Cable
Transmission Distance
Improved Cable
Propagation Delay
Pulse Width Distortion
Min.
TypJ5]
dc
Data Rate
Max.
Units
Conditions
1
MBd
BER:::: 10-9
m
IFPK = 60 mA, 0-70°C
50
m
\FPK = 60 mA, 25° C
m
IFPK'" 60 mA, 0-70°C
65
m
24
30
34
41
36
60
IFPK
41
£
50
IFPK '" 60 mA, 25" C
IpPK = 120 mA, 0;-70° C
30
£
Ref.
IFPK
= 120 mA, 25° C
= 120 mA, 0-70 C
0
IFPK = 120 mA, 25" C
75
n, CL'= 30
tpLH
180
250
ns
Rl = 560
pF
Fig. 4, 5
tPHL
100
140
ns
PR=-24 dBm
to
80
ns
PI'! =-24 dBm
Rl. '" 560 n, Cl = 30 pF
Fig. 4, 6
Note 4
8000
Vim
EMllmmunity
Note 3
BER:::: 10"9
Noles: 1. For IFPK > 80 mA, the duty factor must be such as to keep IFAV 5 80 mAo In addition, for iFPK > 80 mA, the following rules for
pulse width apply: IFPK 5160 mA: Pulse width 5'1 ms
IFPK > 160 mA: Pulse width 51 /.IS
2. It is essential that a bypass capacitor (0.01 /.IF to 0.1 /.IF ceramic) be connected from pin 3 to pin 4 01 the receiver. Total lead
length between both ends of Ihe capacitor and the pins should not exceed 20 mm.
3. The propagation delay of 1 m of cable (5 nSI is included,
4. TD = tpLH - tpHL'
5. Typical data Is at 25°C, Vee = 5 V.
Link Design Considerations
The HFBR-1502/2502 Transmitter/Receiver pair is guaranteed for operation at data rates up to 1 MBd over link
distances from 0 to 24 metres with standard cable and
from 0 to 34 metres with improved cable. The value of
transmitter drive current, IF, depends on the link distance
as shown in Figures 2 and 3. Note that there is a lower
limit on the value of IF for any given distance. The dotted
lines in Figures 2 and 3 represent pulsed operation. When
operating in the pulsed mode, the conditions in Note 1
must be met. After selecting a value of the transmitter
drive current IF, the value of Rl in Figure 1 can be
calculated as follows:
Rl = Vce-VF-Vol (754511
IF
For the HFBR-1502/2502 pair, the value of the capacitor,
C, (Figure 1) must be chosen such that R, C, 2: 75 ns.
vee
HFBR·1502
Figure 1. Typical Clrcuil Operation (1 MBd 5 24 m)
8-64
100
90
80
70
=
>=
a:
0
lL
400
400
.... f-"""
g:
,
100
i>
~
0
-25
-20
-15
-10
10 0
0
-25
-5
PR - INPUT OPTICAL POWER - dBm
i'
/"
VtPI.H
/
--
-20
V
-15
"'ML
-10
-5
PR - INPUT OPTICAL POWER - dBm
Figure 5. HFBR-1502/2502 Link Pulse Width Distortion vs.
Optical Power
Figure 6. HFBR-1502/2502 Link Propagation Delay vs. Optical
Power
8-65
Low Current/Extended Distance Link
HFBR-1512 AND HFBR-2503
The low current link requires only 6 mA peak supply current
for the transmitter and receiver combined to achieve an 11
m link. Extended distances up to 82 m can be achieved at a
maximum transmitter drive current of 60 mA peak. This link
can be driven with TTULSTTL and most CMOS logic gates.
The black plastic housing of the HFBR-1512 Transmitter is
designed to prevent the penetration of ambient light into the
cable through the transmitter. This prevents the sensitive
receiver from being triggered by ambient light pulses.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min.
Max.
Units
TA
0
70
"C
2
l20
mA
60
mA
Ambient Temperature
Transmitter
Peak Forward Current
J!
IF PK
Avg. Forward Current
IPAY
Receiver
Supply Voltage
Vee
5.5
V
Output Voltage
Vo
Vee
V
Fan-Out (TTL)
N
1
4.5
Ref.
Note 1
Note 2
SYSTEM PERFORMANCE Using Standard Cable lInder recommended operating conditions unless otherwise specified.
Parameter
Symbol
Data Rate
Min.
Typ,[5]
dc
Transmission Distance
Standard Cable
R
Transmission Distance
Improved Cable
l'
Propagation Delay
Pulse Width Distortion
Bit Error Rate
Max.
Units
40
kBd
Conditions
tD::; 7.0
2 mA, 0-70° C
8
30
m
IFPK'"
60
100
m
IFPK "" 60 rnA, 0-70·C
11
35
m
IFPK'" 2 mA, 0-70° C
82
125
m
IFPK '" 60 mAo 0-70·C
tPLH
4
"S
RL'" 3.3K .0. CL = 30 pF
tPHL
2.5
"S
PA =-25 dBm
Jls
-39::; PA oS -14 dBm
Rt. = 3.3 Kn. CL = 30 pF
7.0
to
10"9
BER
EMI Immunity
Ref.
"s
Fig. 4. 5
Note 3
Flg.4,6
Note 4
PA=-30 dBm
5000
Vim
PR=O mW
Notes:
1. For IFPK > 80 mA, the duty factor must be such as to keep IFAV :s 80 mA. In addition, if IFAV > 80 mA, then the pulse width must be
equal to or less than 1 ms.
2. It is recommended that a bypass capacitor (0.01 I'F to 0.1 I'F ceramicl be connected from pin 3 to pin 4 of the receiver.
3. The propagation delay of 1 m of cable 15 nsl is included.
4. tD ~ tPLH - tPHL.
5. Typical data is at 25° C, Vcc ~ 5 V.
Link Design Considerations
The HFBR-1512/2503 Transmitter/Receiver pair is guaranteed for operation at data rates up to 40 kBd for transmitter
drives as low as 2 mA. The value of transmitter drive current, IF, depends on the link distance as shown in Figures 2
and 3. Note that there is an upper as well as a lower limit on
the value of IF for any given distance. After selecting a value
of the transmitter drive current IF, the value of Rl in Figure 1
can be calculated as follows:
Rt = VCC-VF
IF
N.C.
vee
IF
HFBR-1512
Figure 1. Typical Circuit Operation (40 kBd)
8-66
--------------------
120
100
BO
60
'E"
40
z
w
a:
a:
20
::>
u
0
~/
./
,!.
./
10
/V
,/""
;1) ~
t/<
a:
'a:"
25'C
;:
It
0'C"'-70,'C
1.
//,'.",.,
I
Vj
10
10
20
~
30
40
50
60
70
80
90
- CABLE LENGTH-METRES
OF STANDARD CABLE
\!-CABLE LENGTH-METRES OF
IMPROVED CABLE
Figure 2. Guaranteed System Perlormance with HFBR-1512 and
HFBR-2503, Standard Cable
HP BOO7B
IF
PULSE
GENERATOR
INPUT
Figure 3. Guaranteed System Perlormance with HFBR-1512 and
HFBR-2503, Improved Cable
0----;
MONITORING
NODE
VI
51n
HFBR-1512
Vo
HFBR-2503
NODE
Figure 4. A.C. Test Circuit
/
/
/
-
V
~
,.I
~
I
~
/
o
-40
V
-34
-2B
IE
I
tpHl,
1
-22
-16
0
-40
-10
PR - INPUT OPTICAL POWER, dBm
---
-2B
-22
-16
-10
Figure 6. HFBR-1512/2503 Link Propagation Delay vs. Optical
Power
8-67
------
-34
PR - INPUT OPTICAL POWER - dBm
Figure 5. HFBR-1512/2503 Link Pulse Width Distortion vs.
Optical Power
- - - - -.._---_._-
>-
"-
~
/'
/'
o
......-V
1
'PCH
o
z
o
Photo Interrupter Links
HFBR-1S02/2502
HFBR-1S12/2503
'
The HFBR-151212503 link (20 kHz) has an optical power
budget of 24 dB, and the HFBR-1502l2502 link (500 kHz)
budget is 10 dB. Total system losses (cable attenuation, airgap loss, etc) must not exceed the link optical power
budget.
These links may be used in optical switches, shaft position
sensors, imd velocity sensors. They are particularly useful
where high voltage, electrical noise, or explosive environments prohibit the use of electromechanical or
optoelectronic sensors.
RECOMMENDED. OPERATING CONDITIONS
Symbol
Min.
Max.
Units
TA
0
70
·C
Transmitter
Peak Forward Current
IF PK
10
750
mA
Avg. Forward Current
IFAV
60
mA
Parameter
Amblelit Temperature
Receiver
Supply Voltage
Output Voltage
FanouttTTL>
!HFBR-2503
1"'-:
Vee
4.50
5.50
4.75
5.25
V
Vee
Vo
HFBR-2503
1
5
Note 1
Note 2
V
18
IHFBR-2502
Ref.
SYSTEM PERFORMANCE
See HFBR-1502/2502 link data sheet (page 5) and HFBR-1512/2503 link data sheet (page 7) for more design information.
These specifications apply when using Standard Cable and, unless otherwise specified, under recommended operating
conditions.
Parameter'
Conditions
Ret.
HFBR-15121HFBR4503
Max. Count Frequenoy
20
Optical Power Budget
kHz
dB
HFBR·1S02, HFBR-2502
Max. Count Frequency
500
Optical Power Budget
15.6
IFPK=?eO
mA,Q-70·C
dB
fFPK '" 60
rnA,0-7O"C
dB
IFPK=60mA,25°0
kHz
Note 3
Notes:
1. For IFPK > 80 mA, the duty factor must be such as to keep IFAV ::; 80 mAo In addition, for IFPK > 80 mA, the following rules' for pulse
width apply:
IFPK::; 160 mA: Pulse width::; 1 ms
IFPK> 160 mA: Pulse width::; 1 I's
2. A bypass capacitor (0.01 I'F to 0.1 I'F ceramic) connected from pin 3 to pin 4 of the receiver Is recommended for the HFBR-2503
and essential for the HFBR-2502. For the HFBR-2502, the total lead length between both ends of the capacitor and the pins should
not exceed 20 mm.
3. Optical Power Budget = PT Min, - PR(L) Min. Refer to HFBR-1502/1512 data sheet,page 11; HFBR-2502 data sheet, page 12; and
HFBR-2503 data sheet, page 14 for additional design information.
4. In addition to a minimum power budget, care should be taken to avoid overdriving the HFBR-2503 receiver with too much optical
power. For this reason power levels into the receiver should be kept less than -13.7 dBm to eliminate an'y overdrive with the
recommended operating conditions.
5. Typical data is at 25°C, Vcc = 5 V.
8-68
Link Design Considerations
The HFBR-1512/2503 and HFBR-1502/2502 Transmitter/
Receiver pairs are intended for applications where the photo
interrupter must be physically separate from the optoelectronic emitter and detector. This separation would be useful
where high voltage, electrical noise or explosive environments prohibit the use of electronic devices. To ensure
reliable long term operation, links designed for this application should operate with an ample optical power margin
CX:M 2 3 dB, since the exposed fiber ends are subject to
environmental contamination that will increase the optical
attenuation of the slot with time. A graph of air gap separation versus attenuation for clean fiber ends with minimum
radial error ~ 0.005 inches (0.127 mm) and angular error
(~3.0 0 ) is provided in Figure 2. The following equations can
now be used to determine the_ transmitter output power, PT,
for both the overdrive and minimum drive cases. Overdrive
is defined as a condition where excessive optical power is
delivered to the receiver. The first equation enables the maximum PT that will not result in receiver overdrive to be
calculated for a predetermined link length and slot attenuation. The second equation defines the minimum PI allowed
for link operation.
PT (MAX) - PR (MAX) ~ "'0 MINQ
PT
STANDARD CABLE
20
Eq.1
Eq.2
Once PT (MIN) has been determined in the second equation
for a specific link length (Q), slot attenuation ("'SLOT) and
margin ("'M), Figure 3 can then be used to find IF.
Figure 1. Typical Slot Interrupter Configuration. Refer to 1 MBd
or Low Current Links for Schematic Diagrams
HFBR-15XX
+ "'SLOT
(MIN) - PRL (MIN) 2 "'0 MAXQ+ "'SLOT + "'M
HFBR-4501/4511 CONNECTORS
HFBR-25XX
~~
AXIAL~ ~
SEPARATION
15
10
10
11
12
AXIAL SEPARATION (mm)
Figure 2. Typical Loss
VS.
Axial Separation
-3o1'::-o----!2o:---.......-:4':-o--J.--="6o,......-:'Bo~100
IF-TRANSMITTER DRIVE CURRENT-rnA
Figure 3. Typical HFBR-1S02/1S12 Optical Output Power vs.
Transmitter IF (0-70' C)
8-69
- - - - - - - - - - - - - - - - - - - -------------
13
665 nm Transmitters
HFBR-1510/1512J1502 Transmitter
HFBR-1S02lHFBR-1S10and HFBR-1S12
The HF~R"15l0/Hi02ll5l2 Transmitter mod.ules incorporate a 665 nm LED emitting at a.low attenuation wavelength
for the HFBR-3510/36l0 plastic fiber optic cable. The
trans~itters can be easily interfaced to standard TTL logic.
The optical power output of the HFBR-15l0/l5l21l502 is
specified at the tmd of 0.5 m of cable. The HFBR-15l2 output optical power is tested and guaranteed at low drive
.currents.
N.C.
ANODE 2.l-.!...~=I.r-"i
N.C.
Absolute Maximum· Ratings
Symbol
Min.
Max.
Storage Temperature
Ts
-40
+75
Operating Temperature
TA
0
+70
Parameter
Lead Soldering Cycle
I Temp.
260
I Time
10
Peak Forward Input Current
fFPK
1000
Average Forward Input Current
IFAV
80
VR
5
=
Reverse Input Voltage
F'e
I
Units
Ref.
·C
·C
~
sec.
mA
=
Note 1
Note 2
mA
I
V
Electrical/optical Characteristics 0° C to +70°CUnless Otherwise Specified
Typ.l5l
Symbol
Min.
Max.
Unll$
HFBR-1510
Pr
-16.5
-7.6
dBm
= 60 mA. 0-70"C
-14.1
• -8.4
d
=60mA.25"C
HFBR-1502
Pr
Parameter
Transmitter Output
Optical Power
and
HFBR-1512
HFBR-1512
Pr
APr
Output Optical Power
Temperature Coefficient
-AT
Peak Emission Wavelength
N>K
Forward Voltage
VF
Forward Voltage
Temperature Ooefficient
~
-35.5
-1.37
AVF
-
60 mA. 0-70·C
Fig. 2
60 mA.25°C
Note 4
2mA,D-70·C
NoteS
I nm
665
1.67
Ref.
dB/DC
4>.026
1.45
ndltlona
2.~
mVrC
IF=60 mA
Fig. 1
4T
Effective Diameter
Dr
1
Numerical Aperture
N.A.
0.5
Reverse Input Breakdown Voltage
VBR
Diode Capacitance
Co
Rise and Fall Time
tR.1F
5.0
mm
12.4
V
IF "'-10 p.A, TA = 25·0
86
50
pF
VF=O.f=l MHz
ns
10% to 90%
Notes:
1. 1.6 mm belew seating plane.
2. 1 I's pulse, 20 I'S peried.
3. Measured at the end .of 0.5 m standard Fiber Optic Cable with large area detecter.
4. Optical pewer, P (dBm) = 10 Leg P (I'W)/1000 I'W.
.
5. Typical data is at 25° C.
.
WARNING. When viewed under seme cenditiens, the .optical pert .of the. Transmitter may expese the eye beyend the Maximum
Permissible Expesure recemmended in ANSI Z-136-1, 1981. Under mest viewing cenditiens there is ne eye hazard.
8-70
..:
1000
E
I
I-
iiia:
a:
:>
">
w
ii:
c
a:
w
I:
iii
'"..:z
a:
l-
I
.!!-
2
1.4
1.5
1.6
1.7
1.S
1.9
2.0
2.1
IF-TRANSMITTER DRIVE CURRE,NT-mA
VF - FORWARD VOLTAGE - V
Figure 1. Typical Forward Voltage vs. Drive Current for
HFBR-1510/1502l1512
Figure 2. Normalized HFBR-1510/1502l1.512 Typical Output
Optical Power vs. Drive Current
Receivers
HFBR-2501/2502 Receiver
HFBR-2501 (5 MBd) and HFBR-2502 (1 MBd)
The HFBR-2501/2502 Receiver modules feature a shielded
integrated photodetector and wide bandwidth DC amplifier for high EMI immunity. A Schottky clamped
open-collector output transistor allows interfacing to
common logic families and enables "wired-OR" circuit
designs. The open collector output is specified up to 18V.
An integrated 1000 ohm resistor internally connected to
Vee may be externally jumpered to provide a pull-up for
ease-ol-use with +5V logiC. The Combination 01 high optical power levels and fast transitions falling edge could
result in distortion of the output signal (HFBR-2502 only),
that could lead to multiple triggering of following circuitry.
RL
Absolute Maximum Ratings
Parameter
\\!Storage Temperature
~Operating Temperature
Lead Soldering Cycle
Symbol
Min.
M~x.
Units
Ts
-40
+75
·C
TA
0
+70
·C
260
·C
10
sec
I Temp
I Time
Supply Voltage
Output Collector Current
Vee
-D.5
10
7
V
25
mA
40
mW
Output Voltage
Vo
-D.5
18
V
Pullup Voltage
VRL
-D.5
Vee
V
Output Collector Power Dissipation
POD
8-71
Ref.
Note 1
Note 6
Electrical/Optical Characteristics 0° C to +70° C, 4.75 :5 Vee :55.25 Unless Otherwise Specified
Parameter
Receiver Input Optical
Power Level for
Logic "0"
HFBR-2501
HFBR-2502
Input Optical Power Level for Logic "1"
Typ,[$)
Symbol
Min.
Max.
Units
Conditions
PR(l)
-21.6
-9.5
dBm
0-70° C, VOL = 0.5 V
IOL=8 mA
-21.6
-8.7
dBm
25°C, VOL=0.5 V
IOL=8 mA
-24
dBm
0-70° C, VOL = 0.5 V
IOL=8 mA
-24
dBm
25° C, VOL = 0.5 V
IOL""8 mA
-43
dBm
VOH = 5.25 V,
IOH:5250 /JA
PRIL}
PRIH)
Ref.
Note 2,
3
Note 2
"
High Level Output Current
IOH
5
250
/Jo A
Low Level Output Vol'tage
VOL
0.4
0.5
V
High Level Supply Current
ICCH
3.5
6.3
mA
Vo=1BV,PR"'0
Note 4
IOL"'BmA,
PR'" PRLMIN
Note 4
Vee = 5.25 V,
Note 4
PR=OpW
Low Level Supply Current
Effective Diameter
Numerical Aperture
Internal Pull-Up Resistor
6.2
ICCL
DR
1
NAR
0.5
RL
680
1000
10
mA
Vec =5.25 V,
PR = -12.5 dBmJ
Note 4
mm
1700
Ohms
Notes:
1.
2.
3.
4.
5"
6"
1.6 mm below seating plane.
Optical flux, P IdBml = 10 Log P II'WI/l000 I'W.
Measured at the end of standard Fiber Optic Cable with large area detector.
RL is open.
Typical data is at 25° C, Vcc = 5 V"
It is essential that a bypass capacitor 0.01 I'F to 0.1 I'F be connected from pin 3 to pin 4 of the receiver. Total lead length between
both ends of the capacitor and the pins should not exceed 20 mm.
8-72
High sensitivity Receiver
HFBR-2S03 Receiver
HFBR-2503
The blue plastic HFBR-2503Heceiver module has a sensitivity of -39 dBm. It features an integrated photodetector
and DC amplifier for high EMI immunity. The output is an
open collector with a 150 I'A internal current source pullup and is compatible with TTLILSTTL and most CMOS
logic families. For minimum rise time add an external puilup resistor of at least 3.3K ohms. Vee must be greater than
or equal to the supply voltage for the pull-up resistor.
Absolute Maximum Ratings
MIll(,
Units
-40
+75
·C
Om
Parantlter
Storage Temperature
Ts
+70
·C
I Temp
260
·C
I Time
10
sec
Opilrating Temperature
Lead Soldering Cycle
Vee
-0.5
7
V
Output Collector Current (Average)
10
-1
5
mA
Output Collector Power Dissipation
POD
25
mW
O,'!!aut Voltage
Vo
-0,5
Vee
V
Supply Voltage
Ref.
Note 1
Note 7
Electrical/Optical Characteristics o· C to +70· C, 4.5 :5 Vee:5 5.5 Unless Otherwise Specified
Parameter
Receiver Input Optical
Power Level for
Logic "0"
HFBR-2503
Symbol
Min.
Mal(.
Uhlts
Conditions
PR (L)
-39
-13.7
dBm
0-70· C, Vo = VOL
fOL=3.2 mA
-39
-13.3
dBm
25° C, Vo = VOL
-53
dBm
VOH =5.5V,
IOH :540 I'A
Input Optical Power Level
for Logic "1"
PR (H)
High Level Output Voltage
VOH
Low Level Output Voltage
VOL
High Level Supply Current
leeH
Low Level Supply Current
leel
Effective Diameter
DR
Numerical Aperture
N.A.R
Typ. (5)
2.4
Ref.
Note
2,3,4
IOL = 3.2 mA
V
IOH=-40}J.A,
PR =OI'W
0.4
V
lOL=3,2 mAo
PR = PRL MIN
1.2
1.9
rnA
Vee'" 5.5V, PR = 0 I'W
2.9
3.7
rnA
Vee =5.5V,
PR 2: PRl (MIN)
Note 2
Note6
Note 6
mm
0.5
Noles:
1.6 mm below seating plane.
1.
2.
3.
4.
Optical flux, P (dBm) ~ 10 Log P (I'W)/1000 I'W.
Measured at the end of the standard Fiber Optic Cable with large area detector.
Because of the very high sensitivity of the HFBR-2503, the digital output may switch in response to ambient light levels when a cable
is not occupying the receiver optical port. The designer should take care to filter out signals from this source if they pose a hazard to
the system.
5. Typical data is at 25° C, Vee ~ 5 V.
6. Including current in 3.3K pull-up resistor.
7. It is recommended that a bypass capacitorO.OlllF to 0.1 I'F ceramic be connected from pin 3to pin 4 of the receiver.
8-73
----------------------_..
Snap-in Fiber Optic
connector, Bulkhead
Feedthrough/Splice and
Polishing Tools
HFBR-4501 (GRAY)/4511 (BLUE) CONNECTOR
HFBR-45C1/4511 CONNECTORS
HFBR-4505/4515 BULKHEAD FEEDTHROUGHS
HFBR-4505 (GRAY)/4515 (BLUE) BULKHEAD FEEDTHROUGH
The HFBR-4501 and HFBR-4511 snap-in connectors terminate low cost plastic fiber cable and mate with the
Hewlett-Packard HFBR-{)500 family of fiber optic transmitters and receivers. They are quick and easy to install. The
metal crimp ring provides strong and stable cable retention
and the polishing technique ensures a smooth optical finish
which results in consistently high optical coupling
efficiency.
HFBR-4595 POLISHING KIT
,'"
<1>
The HFBR-4505 and HFBR-4515 bulkhead feedthroughs
mate two snap-in connectors and can be used either as an
in-line splice or as a panel feedthrough for plastic fiber
cable. The connector to connector loss is low and
repeatable.
'
..'"
v,', ",.',
..
'
6
Applications
A" .. .rr'l
'. CONNECTOR
c::::=~CltC'j,r'"\.ft_
I ~! Ji
c:::::=OIJ_Hu.o-'---,,0
TERMINATION FOR HEWLETT-PACKARD PLASTIC
FIBER OPTIC CABLE
INTERFACE TO HEWLETT-PACKARD HFBR-15XXl25XX
SNAP-IN FIBER OPTIC LINK COMPONENTS
• BULKHEAD FEEDTHROUGH
BULKHEAD FEEDTHROUGH OR PANEL MOUNTING OF HFBR-45XX CONNECTORS
IN-LINE SPLICE FOR PLASTIC FIBER OPTIC CABLE
Absolute Maximum Ratings
Parameter
Symbol Min. Max. Units
Storage
Temperature
Ts
Operating
Temperature
TA
Nut Torque
HFBR-4505/4515
TN
-40 +75
cC
+70
QC
-0.7
N-m
0
Notes
1
100 OZF-IN
Noles:
0 57 N-m
1, Recommended nut torque is ~ OZF-IN
8-74
Mechanical/Optical Characteristics
0° to 70°C Unless Otherwise Specified.
Typical Data at 25° C.
Parameter
:
Retyp,tlon Force Connector/Module
HFBR-4501/4511 to
HFBR-15XX;25XX
Tensile Force Connector/Cable,
Symbol
Min.
FRG
6.8
Fr
22
HFBR-4505/4515 Conri:'lo
Conn. Loss
aCG
Retention Force Connector/
Bulkhead HFBR-4501/4511 to
HFBR-4505/4515
FRB
0.7
Max.
Typ.
Units
Note!
N
I····:
1.5
2.8
7.8
N
dB
2,3
N
Notes:
2. Factory polish or field polish per recommended procedure.
3. Module to connector insertion loss is factored into the transmilter output optical power and the receiver input optical power level
specifications.
Note:
For applications where frequent temperature cycling over extremes is expected please contact Hewlelt-Packard for alternate
connectoring techniques.
Cable Terminations
The following easy procedure describes how to make
cable terminations. It is ideal for both field and factory
installaiton. If a high volume connectoring technique is
required please contact your Hewlett-Packard sales engineer for the recommended procedure and equipment.
Connectoring the cable is accomplished with the HewlettPackard HFBR-4595 Polishing Kit consisting of a
Polishing Fixture and 600 grit abrasive paper and 3 micron
pink lapping film (3M Company, OC3-14). No adhesive
material is needed to secure the cable in the connector,
and the connector can be used immediately after
polishing.
Connectors may be easily installed on the cable ends with
readily available tools. Materials needed for the terminating procedure are:
Step 2
Place the crimp ring and connector over the end of the
cable; the fiber should protrude about 3 mm (0.12 in.)
through the end of the connector. Carefully position the
ring so that it is entirely on the connector and then crimp
the ring in place with the crimping tool.
Note: Place the gray connector on the cable end to be
connected to the transmitter and the blue connector on
the cable end to be connected to the receiver to maintain
the color coding (both connectors are the same
mechanically).
~~
CRIMP RING
,c
1)
2)
3)
4)
5)
6)
7)
Plastic Fiber Optic Cable
HFBR-4595 Polishing Kit
HFBR-4501 Gray Connector and Crimp Ring
HFBR-4511 Blue Connector and Crimp Ring
Industrial razor blade or wire cutters
16 gauge latching wire strippers
Crimp Tool, AMP 90364-2
Step 3
Any excess fiber protruding from the connector end may
be cut off; however, the trimmed fiber should extend at
least 1.5 mm (0.06 in.) from the connector end.
Insert the connector fully into the polishing fixture with the
connector end protruding from the bottom of the fixture.
Step 1
The zip cord structure of the duplex cable permits easy
separation of the channels. The channels should be separated approximately 50 mm (2.0 in.) back from the ends to
permit c~nnecting and polishing.
For high volume connectoring use the hardened steel
HFBR-4596 polishing fixture.
After cutting the cable to the desired length, strip off
approXimately 7 mm (0.3 in) of the outer jacket with the 16
gauge wire strippers. Excess webbing on duplex cable
may have to be trimmed to allow the connector to slide
over the cable.
Place the 600 grit abrasive paper on a flat smooth surface.
Pressing down on the connector, polish the fiber and the
connector until the connector is flush with the end of the
polishing fixture. Wipe the connector and fixture with a
clean cloth or tissue.
Note: The four dots on the bottom of the polishing fixture
are wear indicators. Replace the polishing fixture when
any dot is no longer visible.
~
l
FIBER END
~l ~~!-,.5mm
MINIMUM
8-75
Step 4
Place the flush connector and polishing fixture on the dull
side of the 3 micron pink lapping film and continue to polish the fiber and connector for approximately 25 strokes.
The fiber end should be flat, smooth and clean.
The cable can now be used.
Note: Use of the pink lapping film fine polishing step
results in approximately a 2 dB improvement in coupling
performance of either a transmitter-receiver link or a bulkhead/splice over 600 grit polish alone. This polish is
comparable to Hewlett-Packard's factory polish. The fine
polishing step may be omitted where an extra 2 dB of
optical power is not essential as with short link lengths.
POLISHING PAPER
Mechanical Dimensions AllAll dimensions
dimensions in mm (inches).
±O.25 mm unless otherwise specified.
HFBR-15XX (GRAY OR BLACK)/250X (BLUE) MODULE
r-
J.7
L---
--.l
7.1 (.2801
[.61.30010
1.5001
r1
5.31.2101
HFBR-4501 (GRAY)/4511 (BLUE) CONNECTOR
;"rl~·"
19.1 (,751--1
j~~:~J;LP~
~,
o'f~~fX :J L
i
2.5
1101
--
1~"('75ID
I
~25.411.001~
CONNECTORS DIFFER ONLY IN COLOR
2
BULKHEAD FEEDTHROUGH WITH TWO HFBR-4501/4511
CONNECTORS
I
HFBR-4505 (GRAY)/4515 (BLUE) BULKHEAD FEEDTHROUGH
10~24~01
'9.1
I'
1:.0
'I
1..10.4201..1
-
I
I
f.-
MAX, WALL THICKNESS:
4.1 (0.160)
BULKHEAD FEEDTHROUGHS DIFFER ONLY IN COLOR
8-76
10.3751
PANEL MOUNTING
----.l
~6.4
--wfO.250) MIN.
r
DOUBLE '0'
7.9 (0.312) DIA. MIN.
FIBER OPTIC CABLE CONSTRUCTION
~"""
r-
'D' HOLE
7.9 (0.312) DIA. MIN.
Simplex
7.9 (0.312)
HOLE MIN.
DIMENSIONS IN mm (INCHES)
ALL DIMENSIONS :!:O.2 mm UNLESS NOTED,
8-77
Duplex
Flidl
MINIATURE
FIBER OPTIC
LOGIC LINK
HEWLETT
~~ PACKARD
HFBR-1202
HFBR-2202
HFBR-4202
Features
• DC TO 5 MBAUD DATA RATE
• MAXIMUM LINK LENGTH
625 Metres (Guaranteed)
1600 Metres (Typical)
• TTL/CMOS COMPATIBLE OUTPUT
• MINIATURE, RUGGED METAL PACKAGE
• SINGLE +5V RECEIVER POWER SUPPLY
• INTERNALLY SHIELDED RECEIVER FOR
EMI/RFIIMMUNITY
• PCB AND PANEL MOUNTABLE
• LOW POWER CONSUMPTION
Applications
• EMC REGULATED SYSTEMS (FCC, VDE)
• EXPLOSION PROOF SYSTEMS IN OIL
INDUSTRY/CHEMICAL PROCESS
CONTROL INDUSTRY
• SECURE DATA COMMUNICATIONS
• WEIGHT SENSITIVE SYSTEMS
(e.g. Avionics, Mobile Stations)
• HIGH VOLTAGE ISOLATION IN POWER
GENERATION
efficiency is assured by factory alignment of the LED with
the optical axis of the package. Power coupled into the
fiber varies less that 4 dB from part to part at a given
temperature and drive current. The benefit of this is reduced dynamic range requirements on the receiver.
The HFBR-2202 Receiver incorporates a photo IC containing a photodetector and dc amplifier. An open collector
Schottky transistor on the IC provides logic compatibility.
The combination of an internal EMI shield, the metal
package and an isolated case ground provides excellent
immunity to EMI/RFI. For unusually severe EMI/ESD environments, a snap-on metal shield is available. The receiver is easily identified by the black epoxy backfill.
Description
The HFBR-1202 Transmitter and HFBR-2202 Receiver are
SMA style connector compatible fiber optic link components. Distances to 1600 metres at data rates up to 5 MBaud
are achievable with these components.
The HFBR-1202 Transmitter and HFBR-2202 Receiver are
compatible with SMA style connectors, types A and B (see
Figure 11.
The HFBR-1202 Transmitter contains a high efficiency
GaAIAs emitter operating at 820 nm. Consistent coupling
Mechanical Dimensions
HFBR-2202 RECEIVER
HFBR-1202 TRANSMITTER
1/4-3G UNS-ZA
fHRfAO flAT
FLAT
1.54 t1001 DIA_~
PIN CIRCLE
_
~~--
""-~
WHITE BACKFill,.
PIN
in
FLAT
L (.230)
5.8.
SLACK
BACKFU.t
FUNCTION
PIN
1
ANODE
CATHODE
2
3
•
CASE
DIMENSIONS IN MllllMETRES !INCHES;
UNLESS OIHERWtSE SPECIFIE.D, THE TOLERANCES ARE:
:X !. .51 mm CXX !. .{l2 IN •
.XX:± .13 mm {.XXX;t .0(}6: IN-l
8-78
FUNCTION
CASE
Vee
DATA
COMMON
system Design Considerations
The Miniature Fiber Optic Logic Link is guaranteed to work
over the entire range of 0 to 625 metres at a data rate of dc
-5 MBd, with arbitrary data format and typically less than
25% pulse width distortion, if the Transmitter is driven with IF
= 40 mA, Rl = 820. If it is desired to economize on power or
achieve lower pulse distortion, then a lower drive current (IF)
may be used. The following example will illustrate the technique for optimizing IF.
will significantly affect the optical power coupled into the
fiber are as follows:
a. Fiber Core Diameter. As the core diameter is increased,
the optical power coupled increases, leveling off at about
250 I'm diameter.
b. Numerical Aperture (NA). As the NA is increased, the
optical power coupled increases, leveling off at an NA of
about 0.34.
c. Index Profile (01). The Index profile parameter of fibers
varies from 2 (fully graded index) to infinite (step index).
Some gains in coupled optical power can be achieved at
the expense of bandwidth, when 01 is increased.
EXAMPLE: Maximum distance required = 250 metres.
From Figure 2 the worst case drive current = 20 mA. From
the Transmitter data - VF = 1.8V (max,).
Rl = Vcc-VF=5-1.8V = 1600
IF
20 mA
In addition to the optical parameters, the environmental
performance of the selected fiber/cable must be evaluated.
Finally, the ease of installing connectors on the selected
fiber/cable must be considered. Given the large number of
parameters that must be evaluated when using a nonstandard fiber, it is recommended that the 100/140 I'm fiber
be used unless unusual circumstances warrant the use of an
alternate fiber/cable type.
The optical power margin between the typical and worst
case curves (Figure 2) at 250metres is 4 dB. To calculate the
worst case pulse width distortion at 250 metres, see Figure 8.
The power into the Receiver is PRL + 4 dB = -20 dBm.
Therefore, the typical distortion is 40 ns or 20% at 5 MBd.
CABLE SELECTION
SMA STYLE CONNECTORS
The link performance specifications on the following page
are based on using cables that contain glass-clad silica
fibers with a 100 I'm core diameter and 140 I'm cladding
diameter. This fiber type is now a user accepted standard
for local data communications links (RS-458, Class I, Type
B). The HFBR-1202 Transmitter and HFBR-2202 Receiver
are optimized for use with the 100/140 I'm fiber. There is,
however, no fundamental restriction against using other
fiber types. Before selecting an alternate fiber type, several
parameter need to be carefully evaluated.
The HFBR-1202/2202 is compatible with either the Type A or
Type B SMA style fiber optic connector (see Figure 11). The
basic difference between the two connectors is the plastic
half-sleeve on the stepped ferrule tip of the Type B connector. This step provides the capability to use a full length
plastiC sleeve to ensure good alignment of two connectors
for an inline splice. Hewlett-Packard offers connectored
cable that utilizes the Type A connector system because of
the inherent environmental advantages of metal-to-metal
interfaces.
Typical Circuit configuration
NOTE,
IT IS ESSENTIAL THAT ASYPASS CAPACITOR (O.OI.f., 0.1."
CERAMIC) 8E CONNECTEQ FROM PIN 2 TO PIN 4 OF THE RECEiVER.
TOTAL LEAD LENGTH BErw!;eN BOTH ENDS OF THE CAPACITOR
AND THE PINS SHOULD NOT EXCEED 20 mm.
SELECTR, T0501I,
+5V
Vee
TRANSMISSION
OI$TANCE
1-------
CABLE/CONNECTOR ASSEMBLY
Figure 1.
8-79
-------1
Recommended Operating Conditions
Parameter
SymbOl
Min.
Max.
Units
TA
-40
+85
40
·C
IF. PK
IFAV
40
Reference
TRANSMITTER
Ambient Temperature
Peak Forward Input Current
Average Forward Input Current
Note 7
mA=
mA
Note 7
RECEIVER
Ambient Temperature
TA
-40
Supply Voltage
fan Out (TTLI
Vee
4.75
N
+85
5.25
°C
V
Note 3, Fig. 1
5
CABLE (see SMA conneotored cable data sheet}
system performance -40°C to +85°C unless otherwise specified
Parameter
Symbol
MlnJ'1
£
625
Transmission Distance
I
I
Data Rate
. Synchronous
.' .. Asynchronous .'
Typ.
1600
Units
Max.
de
5
de
2.5
Conditions
Reference
Metres
Fig. 2, Note 9
MBaud
MBaud
Note 10
Note 10, Fig. 8
Propagation Delay •.
LOWtoHIGH ...
tPt..H
82
nsec
Propagation Delay.
HII3H to LOW
System Pulse Width'
Distortion
tPHL
55
nsec
to
27
nsac
Bit Error Rate
BER
10-9
Fig. 7,8,9
TA '" 2S·C.
PR '" -21 d8m
IF. PK" 15 mA
Q ,. 1 metre
Data Rate S5 MBaud
PR> -24 dBm (4pW)
NOMOGRAPH
dBm.- pW CONVERSION
-10
-12
40
~
I
cw ...
z
!2w
cO:
i~
~o:
~~
.!!-
TVPIc;")I
2$'0
-40'1;, +85"0
-I'
30
25
/
l-
ffi§
I:~
0
WORSTC~/
35
20
15
12
/
/
-1
/
/
V
/
-3
-16
/
800
1200
~
w
-18
15
~
dBm -20
10
9
8
7
>
• - LINK (CABLE) LENGTH - m
0:
-22
-5
-2'
-6
-26
1600
45
40
35
30·
25
20
w
-'
w
-4
JV
400
I
0:
-2
10
!!l
100
90
80
70
60
50
-28
'1.6
-30
Figure 2. System Performance: HFBR-1202lHFBR-2202 with HP's 1001140 pm fiber cable
8-80
pW
~ ~~-----~~- ~
-------------
--~--~------------
HFBR-1202 TRANSMITTER
HFBR-1202 TRANSMITTER
Absolute Maximum Ratings
Parameler
Storage Tempi-24 dBm
High Level Supply
Current
leCH
3,5
6,3
mA
Low Level Sypply
Current
'
lecl
6.2
NA
.32
Vec
Reference
= 5.25 V
PI'! < -40dBm
Optical Port Diameter
Numerical Aperture
,1'.1\
mA
10
Vec = 5.25 V
PR > -24 dBm
Note 12
700
Dynamic Characteristics -40°C to +85°C and 4.75::; Vee::; 5.25 V unless otherwise specified.
Parameter
Symbol
Min.
Typ.l1 1 Max.
Input Power Level
Logic HIGH
-40
Input Power Level
Logie LOW
Conditions
Reference
dBm
!\p= 820 nm
Note5
TA'" +25°C
Flg,4,
Note 5
TA '" 25°C, PR = -21 dBm
Note 8,
Fig. 7
0.1
v.W
-25.4
-11.2
dBm
2.9
76
v.W
-24
-12.0
dBm
r----r----+----r----~
63
4.0
Propagation Delay
LOW to HIGH
Propagation Delay
HIGH to LOW
Units
tPLHR
fJ.W
65
nsec
49
osec
11. DT is measured at the plane of the fiber face and defines a diameter where
the optical power density is within 10 dB of its maximum.
12. DR is the effective diameter of the detector image on the plane of the fiber
face. The numerical value is the oroduct of the actual detector diameter
.
and the lens magnification.
13. HP's 100/140 J,tm Fiber Cable is specified at a narrower temperature
range, -20° C to 85° C.
14. Measured at the end of 1.0 metre 50/125 .um fiber with large area detector
and cladding modes stripped, approximating a Standard Test Fiber. The
fiber NA is 0.21, measured at the end of a 2.0 metre length, the NA being
defined as the sine of the half angle determined by the 5% of peak intenSity
points.
15. Output Optical Power into connectored fiber cable other' than HP's
Fiber Optic Cable/Connector Assemblies may be different than specified because of mechanical tolerances of the connector, quality of the
fiber surface, and other variables.
16. Measured at the end of 1.0 metre Siecor 100/140 J,tm fiber cable or
equivalent, with large area detector and cladding modes stripped, terminated with the appropriate type of connector. This assembly approximates a Standard Test Fiber. The fiber NA is 0.275, measured at the
end of a 2.0 metre length. the NA being defined as the sine of the half angle
determined by the5% of peak intensity points.
Notes:
8. Propagation delay through the system is the result of several
sequentially-occurring phen0mena. Consequently it is a combination of
data-rate-limiting effects and of transmission-time effects. Because of
this, the data-rate limit of the system must be described in terms of time
differentials between delays imposed on falling and rising edges.
As the cable length is increased, the propagation delays increase at 5 ns
per metre of length increase. Data rate, as limited by pulse width distortion, is not affected by increasing cable length if the optical power level
at the Receiver is maintained.
9. Worst case system performance is based on worst case performance of
individual components: transmitter at +85 0 C, receiver at -40°C and cable
at- 20·C.
10. Synchronous data rate limit is based on these assumptions: (al 50%
duty factor modulation, e.g. Manchester lor BiPhase I Manchester III;
I bl continuous data: (C I PLL (Phase Lock Loop I demodulation; Idl TTL
threshold.
Asynchronous data rate limit is based on these assumptions: (al NRZ
data; (b I arbitrary timing - no duty factor restriction; IC) TTL threshold.
The EYE pattern describes the timing range within which there is no
uncertainty of the logic state, relative to a specific threShold, due to
either noise or intersymbol (prop. delay) effects.
8-82
- - - - - - _ . __. _ - - - - - - - - - - - - - - -
!:l
~
/
\
1
~w
-3
-4
>
~
-5
llirV
-6
'"I
-7
~
/
-a
-9
~
~
/
"
-2
ill
'/
-10
40
"r
I
o
/
.
;*.
~n;;
«E
~
...I
15
::.
'"'"u
20
'"
~
20
~
«
;::
w
>
;:
10
it'"
~
if
•
10
!:l
I
1
I
.!!-
'"
40
VF -FORWARD VOLTAGE-VOLTS
TA - AMBIENT TEMPERATURE _·C
IF - FORWARD CURRENT - mA
Figure 3. Normalized Transmitter Output
vs. Forward Current
Figure 4. Normalized Thermal Effects In
Transmitter Output, Receiver Threshold,
and Link Performance (Relative
Threshold)
Figure 5. Forward Voltage and Cur.rent
Characteristics for the Transmltter.LED.
j!:
~~
z-'
::'w
",>
w«
0.;:
.
o
I
~'"
... w
~~
'" t0::.
wa..
~g
"'"~
1,3
1,2
1,1
1.0
•
o.
r---- ..
J
O. 1
d~
780
800
'"
0
860
40
'"zI
TO
tmI,..MIN.)
~
~
-t\
+25'C,
:~ ~
f-'"""
-",'
- ~\...
, ....
f} 20
'"
0
·:we
~
$
-24
900
}.- WAVELENGTH - NANOMETRES
Figure 6. Transmitter Spectrum NormalIzed to the Peak at 25° C
'"
N
t
880
I
i5
I
"- 1-""'
~"::: ~
840
1".1 MAX.I
60
t;
it
"I\,
820
z
0
;:
0
\. \
~
760
0
~
85"C
\
f
'.
~
/
I /
/ '/
~
0
z
\
0.4
;:~
>
\
0.5
0.2
I
\
0.6
0.3
0
I
I
25'C
0.8
D. 7
Ii:)
aD
:'\-40"0
/\
-22
-20
-12
-24
-22
-18
-16
-14
-12
Figure 8. Worst-Case Distortion of NRZ
EYE-pattern with Pseudo Random Data
at 5 Mb/s. (see note 10)
Figure 7. Propagation Delay through System with One Metre of Cable
1_
INPUT
-20
PR - RECEIVER POWER - dBm
PR - RECEIVER POWER - dBm
100
ns-J
"""I
PULSE REPETITION
fREQ.'" 1 MHz
~--------
IF
INPUT (IF)
S :;~,;~~~~~~~~~~~~L~sxw~~~·':·E~
FROM l-METRE
• I -
TEST CABLE
TIMING
+5V
ANALYSIS
EQUIPMENT
r 1.
}
~-::;:;:-;:::;-.
~w.~~t..~j4t1:::~~:'~5~.~F Vo
I
OUTPUT
+
.:'i.
Va 1.:;
~~~'I
Figure 9. System Propagation Delay Test Circuit and Waveform Timing Definitions
8-83
~_
o----~======~------~~~--------
Typical Circuit Configuration
HFBR-1201 TRANSMITTER
HFBR-2201 RECEIVER
Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressed air often is sufficient to remove particles of dirt;
methanol or Freon'· on a cotton swab also works well.
It is essential that a bypass capacitor (0.01 I'F to 0.1 I'F
ceramic) be connected from pin 2 to pin 4 of the receiver.
Total lead length between both ends of the capacitor and
the pins should not exceed 20 mm.
Horizontal PCB Mounting
Mounting at the edge of a printed circuit board with the
lock nut overhanging the edge is recommended.
the leads at the base of the package and bend the leads as
desired.
When bending the leads. avoid sharp bs •. ds right where the
lead enters the backfill. Use needle nose pliers to support
When soldering. it is advisable to leave the protective cap
on the unit to keep the optics clean.
MOUNTING HARDWARE: HFBR-4201
1 EMI/ESD SHI ELD
1 1/4-32 NUT
1 1/4x .005 INCH WASHER
2 2-56 SELF TAPPING SCREWS
1 MOUNTING BRACKET
DIMENSIONS FOR BULKHEAD
MOUNTING HOLE
W
5.88D
~
. '
---
6.25'{.250)
OIA.
(STANDARD 1/4INCH "0" HOLE - RU PUNCH)
2-56 SELF TAPPING SCREWS
(METRIC EOUIV. M2.2 x 0.451
8-84
~
~
~--.----
-----
HFBR-1202 TRANSMITTER
HFBR-2202 RECEIVER
1.95 (.078) DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW
1.95 (.078) DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW
PIN 1
7.8
TRANSMITTER PCB LAYOUT DIMENSIONS
PCB EDGE
RECEIVER PCB LAYOUT DIMENSIONS
Figure 13. Mounting Dimensions
DIMENSIONS IN MILLIMETRES (INCHES).
Ordering Guide
Transmitter:
HFBR-1202 (SMA Connector Compatible)
Receiver:
HFBR-2202 (SMA Connector Compatible)
Mounting
Hardware:
HFBR-4202 (SMA Connector Compatible)
8-85
PCB EOGE
FliP'l
HIGH EFFICIENCY
FIBER OPTIC
TRANSMITTER
HEWLETT
a!~ PACKARO
HFBR-1204
Features
• OPTICAL POWER COUPLED INTO 100/140 ILm
FIBER CABLE
-9.8 dBm Guaranteed at 25° C
-7.4 dBm Typical
• FACTORY ALIGNED OPTICS
• RUGGED MINIATURE PACKAGE
• COMPATIBLE WITH SMA CONNECTORS
Description
The HFBR-1204 Fiber Optic Transmitter contains an etchedwell 820 nm GaAIAs emitter capable of coupling greater
than -10 dBm of optical power into HP's 100/140 I'm SMA
connectored cable assemblies. This high power level is
useful for fiber lengths greater than 1 km, or systems where'
star couplers, taps, or in-line connectors create large fixed
losses.
Consistent coupling efficiency is assured by factory
alignment of the LED with the mechanical axis of the
package connector port. Power coupled into the fiber varies less than 5 dB from part to part at a given drive current
and temperature. The benefit of this is reduced dynamic
range requirements on the receiver.
HFBR-1204 is compatible with SMA style connectors. The
low profile package is designed for direct mounting on
printed circuit boards or through panels without additional
heat sinking. A complete mounting hardware package
(HFBR-4202) is available for horizontal mounting on PCBs,
including a snap~on metal shield for harsh EMI/ESD environments.
High coupling efficiency allows the emitters to be driven at
low current levels resulting in low power consumption and
increased reliability of the transmitter. Another advantage
of the high coupling efficiency is that a significant amount
of power can still be launched into smaller fiber such as
501125 I'm (-19.1 dBm typ.l.
The HFBR-1204 transmitter is housed in a rugged miniature
package. The lens is suspended to avoid mechanical contact with the active devices. This assures improved reliability
by eliminating mechanical stress on the die due to the lens.
For increased ESD protection and design flexibility, both
the anode and cathode are insulated from the case.
Figure 1. Cross Sectional View
Mechanical Dimensions
HFBR·1204
flAT
2'$4i'1(0)OIA.~
P1NCfRClE
_
'Ao'
"'(0'
REO aACKFILL
DIMENSIONS IN MILLIMETRES IINCHES!
8-86
PIN
1
FUNCTION
ANODE
CATHODE
CASE
HFBR-1204 TRANSMITTER
HFBR·1204 TRANSMITTER
Absolute Maximum Ratings
Symbol
Min.
Max.
Unit
Storage Temperature
1'8
-55
+85
Operating Temperature
TA
-40
+85
°C
dC
+260
"e
Parameter
Lead
Soldering
Cycle
Temp.
>
o
0:
~
~
_1°
~~
I
.!:
~.
'.o-~ ....
i'-
......
r"-
" ['...
-1
~
-20
20
40
60
TJ - JUNCTION TEMPERATURE _
VF - FORWARD VOLTAGE - VOLTS
Figure 2, Forward Voltage and Current Characteristics
..
~~ ~
-1.5
-60 -40
80
100
°c
Figure 3. Normalized Thermal Effects In Transmitter Output
!g
1.3,--,-,--=--:-::::--,-,---,-.
I
o
~
....
,......."
0:
a:
w
-'
~
"'0:
O:w
>-;:
~~
;:
~
w
"'>0::>
~
~5 ~~
:;
::>w
wo.
>
N>-
W
0:
0:
o
I
0:>
w0.;:
I
-I~
~g
>-
~
o
•
• E
0.
~I~
!~
}.- WAVELENGTH - NANOMETRES
IF - DC FORWARD CURRENT - rnA
Figure 4. Normalized Transmitter Output vs. DC Forward
Current
Figure 5. Transmitter Spectrum Normalized to the Peak at
25°C
Ordering Guide
Transmitter:
HFBR-1204 (SMA Connector Compatible)
Mounting
Hardware:
Receiver:
HFBR-2202 (5 MBaud, SMA Connector)
HFBR-2204 (40 Mbaud, SMA Connector
Compatible)
HFBR-4202 (SMA Connector Compatible)
Fiber OptiC Cable - see data sheets
8-88
(2) PT = Po + 10 log (1/10)
High speed operation
Rise and fall times can be improved by using a pre-bias
current and "speed-up" capacitor. A 1 mA pre-bias current
will significantly reduce the junction capacitance and will
couple less than -34 dBm of optical power into the fiber
cable. The TTL compatible circuit in Figure 7 using a
speed-up capacitor will provide typical rise and fall times
of 10 ns.
IPEAK = 100 mA = Vee - VF
34.90
where
Po = transmitter power speCification (dBm) at 10
10 = specified transmitter current (100 mAl
I = selected transmitter current (mA)
To allow for the dynamic range limits of proper receiver
performance, it is necessary that a link with maximum
transmitter power and minimum attenuation does not
OVERDRIVE the receiver and that minimum transmitter
power with maximum attenuation does not UNDERDRIVE
it. These limits can be expressed in a combination of the
two equations above:
(3) Po MAX + 10 log (lMAX/lo) - Q. "'oMIN < PR MAX
IAVG = 78 mA = Vee - VF
34.9 + 100
(4) Po MIN + 10 log (IMIN/lo) -
Q. "'oMAX > PR MIN
where
Po MAX, Po MIN = max., min. specified power from
transmitter (dBm) at I = 10
IMAX, IMIN
max., min. selected transmitter
operating current (mA)
PR MAX, PR MIN = max., min. specified power at
receiver (dBm)
"'oMAX, "'oMIN = max., min. attenuation (dB/km)
A more useful form of these equations comes from solving
them for the current ratio, expressed in dB:
(5) 10 log (lMAX/l o) < PR MAX - Po MAX + Q • "'oMIN
(6) 10 log (lMIN/l o) > PR MIN - Po MIN + Q. "'oMAX
These are plotted in Figure 8 as the OVERDRIVE LINE,
and UNDERDRIVE LINE, respectively for the following
components:
Figure 6. Tesl Clrcuil lor Measuring Ir, II
34.9n 11W)
~L->-----------~~t--I
HFBR-1204 Transmitter -11.2 < PT < -4 dBm
HFBR-2204 Receiver (25 MHz) -28.5 < PR < 12.6 dBm
HFBR-2204 Receiver (2.5 MHz) -35.5 < PR < -12.6 dBm
HP's 100/140 I'm Fiber Cable 4 < 0:0 < 8 dB/km
10.n
680
pF
III
I
0
;::
u
:::>
u
I
w
>
a:
Link Design
Q
-10
I
With transmitter performance specified as power in dBm
into a fiber of particular properties (core size, NA, and
index profile), and receiver performance given in terms of
the power in dBm radiated from the same kind of fiber,
then the link design equation is simply:
0:
I-
-0
~
t!l
g
::
~
- CABLE LENGTH - km
Figure 8. Link Design Limits.
(1) PT-Q· "'0 = PR
where
PT = transmitter power into fiber (dBm)
Q= fiber (cable) length (km)
"'0 = fiber attenuation (dB/km)
PR = receiver power, from fiber, (dBm)
For transmitter input current in the range from 10 to 100
mA, the power varies approximately linearly:
8-89
These design equations take account only of the power
loss due to attenuation. The specifications for the receiver
and transmitter include loss effects in end connectors. If
the system has other fixed losses, such as from directional
couplers or additional in-line connectors, the effect is to
shift both OVERDRIVE and UNDERDRIVE lines upward
by the amount of the additional loss ratio.
Flin-
40 MBd MINIATURE
FIBER OPTIC
RECEIVER
HEWLETT
~~ PACKARD
HFBR-2204
Features
• DATA RATES UP TO 40 MBd
• HIGH OPTICAL COUPLING EFFICIENCY
• RUGGED, MINIATURE METAL PACKAGE
• COMPATIBLE WITH SMA STYLE
CONNECTORS
• VERSATILE ANALOG RECEIVER OUTPUT
• 25 MHz ANALOG BANDWIDTH
Applications
• DATA ACQUISITION AND PROCESS CONTROL
• SECURE DATA COMMUNICATION
• EMC REGULATED SYSTEMS (FCC/VDE)
• EXPLOSION PROOF SYSTEMS
• WEIGHT SENSITIVE SYSTEMS (e.g., AVIONICS,
MOBILE STATIONS)
• VIDEO TRANSMISSION
The signal from this simple analog receiver can be optimized
for a variety of transmission requirements. For example, the
circuits in Application Bulletin 73 add low-cost external
components to achieve logic compatible signal levels optimized for various data formats and data rates.
Description
Each of these fiber optic components uses the same rugged,
lensed, miniature package. This package assures a consistent, efficient optical coupling between the active devices
and th~ optical fiber.
The HFBR-2204 Receiver is capable of data rates up to
40 MBd at distances greater than 1 km when used with
cable and HFBR-1202/4 Transmitters. The HFBR-2204 Receiverscontains a discrete PIN photodiode and preamplifier
IC.
TheHFBR-2204 Receiver is compatible with SMA style
connectors: types A and B (see Figure 11 and HP's
100/140 I'm SMA connectored cable assemblies. HP's
100/140 I'm fiber optic cable can be ordered with or without
con nectors.
Mechanical Dimensions
HFBR-2204 RECEIVER
~
FI.AT
GREEN
5.84
l.laOI
.450 {.OlB)
TYP.
BACKFILL
DIMENSIONS IN M'LI.IMETRES IINCflES}
UNLESS OTHERWiSE SP-cCIFIED, THE 'tOLERANCES ARE,
.X t. ,51 !'11m ~,XX :t ,02 IN)
.xX ± ,13 mm i.XXX :':+005 tN~
8-90
PIN
1
2
3
4
FUNCTION
CASE
SIGNAL
COMMON
Vee
Electrical Description
3. The versatile miniature package is easy to mount. This
low profile package is designed for direct mounting on
printed circuit boards or through panels without additional heat sinking.
A complete mounting hardware package is available for
horizontal PCB applications, including a snap-on metal
shield for harsh EMIIESD environments.
The HFBR-2204 Fiber Optic Receiver contains a PIN photodiode and low noise transimpedance pre-amplifier hybrid
circuit with an inverting output (see note 10). The HFBR2204 receives an optical signal and converts itot an analog
voltage. The output is a buffered emitter-follower. Because
the signal amplitude from the HFBR-2204 Receiver is much
larger than from a simple PIN photodiode, it is less susceptible to EMI, especially at high signal rates.
Good system performance requires clean port optics and
cable ferrules to avoid obstructing the optical path. Clean
compressed air often is sufficient to remove particles of
dirt; Methanol or Freon on a cotton swab also works well.
Note:
When installing connectored cable on the optical port, do
not use excessive force to tighten the nut. Finger tightening is sufficient to ensure connectoring integrity, while
use of a wrench may cause damage to the connector or
the optics.
The frequency response is typically dc to 25 MHz. Although
the HFBR-2204 is an analog receiver, it is easily made
compatible with digital systems (see Application Bulletin
73). Separate case and signal ground leads are provided
for maximum design flexibility.
It is essential that a bypass capacitor (0.01 IlF to 0.1 IlF
ceramic) be connected from Pin 4 (Vee) to Pin 3 (circuit
common) of the receiver. Total lead length between both
ends of ~he capacitor and the pins should be less than 20
mm.
system Design Considerations
Mechanical Description
For additional information, see Application Bulletin 73.
The HFBR-2204 Fiber Optic Receiver is housed in a miniature package intended for use with HP's 100/140 Ilm SMA
connectored cable assemblies. This package has important
performance advantages:
OPTICAL POWER BUDGETING
The HFBR-2204.Fiber Optic Receivers when used with the
HFBR-1202 Fiber Optic Transmitter can be operated at a
signalling rate of more than 40 MBd over a distance greater
than 1000 metres (assuming 8dB/km cable attenuation).
For shorter transmission distances, power consumption can
be reduced by decreasing Transmitter drive current. At a
lower data rate, the transmission distance may be increased
by applying bandwidth-filtering at the output of the HFBR-
1. Precision mechanical design and assembly procedures
assure the user of consistent high efficiency optical
coupling.
2. The lens is suspended to avoid contact with the active
devices, thereby assuring improved reliability.
Figure 1. Cross Sectional View
8-91
minimum optical power bUdget of 11.8 dB is obtained:
2204 Receiver; since noise is reduced as the square root of
the bandwidth, the sensitivity of the circuit is proportionately
improved provided these two conditions are met:
[-18 dBm -3 dB +32.8 dBm)] ;= 11.8 dB
Using 8 dB/km optical fiber, this translates into a minimum
link length of 1475 metres (typical link power budget for this
configuration is approximately 17.2 dB or 3130 mettes with
5.5 dB/km fiber).
a. input-referred noise of the follow on circuit is well below
the filtered noise of the Receiver
b. logic comparator threshold is reduced in the same proportion as the noise reduction
BANDWIDTH
As an example, consider a link with a maximum data rate of
10 MBd (e.g., 5 Mb/s Manchester); this requires a 3 dB bandwidth of only5 MHz. Forthis example, the input-referred rms
noise voltage of the follow-on circuit is 0.03 mV. The'equivalent optical noise power of the complete receiver (PNO) is
given by:
PNO
= [(VNO)2 (B/Bo) + (VNI)2JO.5
The bandwidth of the HFBR-2204 is typically 25 MHz.
Over the entire temperature range of -40° C'to +85° C, the
rise and fall times vary in an approximately linear fashion
with temperature. Under worst case conditions, tr and tf may
reach a maximum of 26 ns, which translates to a 3 dB bandwidth of:
/Rp
i3dB ~ 350
tr
VNO = rms output noise voltage of the HFBR-2203/04
with no banCtwidth filtering
VNI = input-referred rms noise voltage of the follow-on
circuit
B = filtered 3 dB bandwidth
Bo = Unfiltered 3dB bandwidth of the HFBR-2203/04
(25 MHz)
Rp = optical-to-electrical responsivity (mV/p'w) of the
HFBR-2240
=
350
26 ns
= 13.5 MHz
The receiver response is essentially that of a single-pole
system, rolling off at 6 dB/octave. In orderforthe receiver to
operate up to 40 MBd even though its worst case 3 dB
bandwidth is 13.5 MHz, the received optical power must be
increased by 3 dB to compensate for the restricted receiver
transmission bandwidth.
PRINTED CIRCUIT BOARD LAYOUT
Note that noise adds in an rms fashion, and that the square of
the rms noise voltage of the HFBR-2204 is reduced by the
bandwidth ratio, B/Bo.
When operating at data rates above 10 MBd, standard PC
board precautions should be taken. Lead lengths greater
than 20 mm should be avoided whenever possible and a
ground plane should be used. Although transmission line
techniques are not required, wire wrap and plug boards are
not recommended.
From the receiver data (Electrical/Optical Characteristics)
taking worst-case values, and applying NO bandwidth filtering (B/Bo = 1):
PNO = I (0.43)2+(0.03)2JO.5 mV = 0.094!,Wor-40.3 dBm
4.6 mV/!,W
OPERATION WITH HEWLETT-PACKARD
TRANSMITTERS
To ensure a bit error rate less than 10-9 requires the signal
power to be 12 times larger (+11 dB) than the rms noise as
referred to the Receiver input. The minimum Receiver input
power is then:
Hewlett-Packard offers two transmitters compatible with
the HFBR-2204 Link performance with each transmitter is
shown below for 25°C operation with HP's 100/140!'m
glass fiber cable. See product data sheets for further
information.
PRMIN = PNO + 11 dB = -29.3 dBm
With the application of a 5 MHz low-pass filter, the bandwidth ratio becomes:
B/Bo = 5 MHZ/25 MHz = 0.2
HFBR-1202
-11dBm
Note that 25 MHz should be used for the total noise bandwidth of the HFBR-2204. Inserting this value of the bandwidth ratio in the expressions for PNO and PRM1N above
yields the results:
PNO
HFBR-1204
-9.8 dBm
Coupled Optical Coupled Optical
Power
Power
= 0.042 !'W or -43.8 dBm and PRMIN = -32.8 dBm
Given the HFBR-1202 Transmitter optical power PT
-18 dBm at IF = 40 mA, and allowing a 3 dB margin, a
8-92
HFBR-2204
-27 dBm Sensitivity
1200m
40MBd
2100 m
40MBd
HF8R-2204
-32 dBm Sensitivity
1800M
10 MBd
2800 M
10 MBd
----.-.--.~.-
HFBR-2204 RECEIVER
HFBR-2204 RECEIVER
Absolute Maximum Ratings
Parameter
Storage Temperature
Ts
Min.
-55
Operating Tf!,wperature
"fA
-40
"Lead
Soldering
Cycle
Symbol
Max.
Unit
Reference
85
85
°C
·C
Note 9
I"emp.
"260
·C
Time
10
sec
25
Case Voltage
Signal Pin Voltage
SlPply Voltajle
..----+-'--vcc
r--+~,SIGNAL
CASE
'-----t-"--COMMON
Note 1
VeASE
VSIGNAL
-0.5
1
V
V
Vee
-0.5
7.0
V
Electrical/optical Characteristics
-40° C to +85° C;
4.75:5 Vee :5 5.25;
RLOAD = 5110
unless otherwise specified
Symbol
Min.
Typt4J
Max.
Unit
Conditions
Reference
Responsivitlty
Rp
5.1
7
10.9
mVlp.W
TA = 25°C
at 820 nm
Note 10
Figure 3
12.3
mVlp.W
-40 :5 TA:5 +85° C
RMS outRut
Noise Vo tage
VNO
.36
mV
.43
mV
TA = 25°C,
PIN Op.W
-40 :5 T A ::;85· C,
P1N=0 p.W
-12.6
dBm
55
p.W
-14
dBm
40
p.W
Parameter
4.6
.30
Peak Input Power
PR
Output Impedance
Zo
20
DC Output Voltage
Vode
.7
Power Supply Current
Icc
Equivalent NA
NA
3.4
.35
Equivalent Diameter
DR
Input Power
PN
TA=25°C
Figures 4. 7
Note 2
-40::;TA:58SoC
Test Frequency =
20 MHz
0
V
PIN=OP.W
6.0
mA
RLOAO="
-43.7
-40.3
dBm
.042
.094
JAW
p'm
250
Equivalent Optical Noise
=
Notes
Dynamic Characteristics
-40°C to +85°C;
4.75:5 Vee:5 5.25;
Parameter
Rise/Fall Time,
10% to 90%
Poise Width Distortion
Symbol
tr. tf
tphl- tpln
Overshoot
Bandwidth
Power Supply
Rejection
Ratio (Referred to
Output)
RLOAD = 5110, CLOAD = 13 pF unless otherwise specified
PSRR
Min.
TypJ1l
Max.
Units
19.5
ns
Conditions
TA","25°C
PIN'" 10 p.W Peak
Reference
14
~
ns
-40:5 TA::; 85·C
Figorea8,9
Pit"
ns
%
I
=40 /lW Peak
NoteS
Figure 9
TA"'25°C
Note 6
Figures 8, 9
at2 MHz
Note 7
FIgures 5. 6
MHz
50
dB
Notes:
1. 2.0 mm from where leads enter case.
2. If Pin < 40 ,..W, then pulse width distortion may increase. At Pin = BO,..W and TA = BO·C, some units have exhibited as
much as 100 ns pulse width distortion.
8-93
.-----'---.--.-~---
.. -.
...
Notes (conU:
3. DR is the effective diameter of the detector image on the plane of the
fiber face. The numerical value is the product of the actual detector
diameter and the lens magnification.
4. Typical specifications are for operation at TA = 25° C and Vee = 5.0V.
5. Input optical signal is assumed to have 10% - 90% rise and fall times
of less than 6 ns.
6. Percent overshoot is defined as:
VPK - V100% x 100%
See Figure 16.
V100%
It is essential that a bypass capacitor (0.01 JlF to 0.1 JlF ceramic) be
connected from pin 4 (Vee) to pin 3 (circuit common) of the receiver.
Total lead length between both ends of the capacitor and the pins
should be less than 20 mm.
9. HP's 1001140 fJm fiber cable is specified at a narrower temperature
range, -20° C to 85° C.
10. Vour = VaDe - IRp x PINI.
8.
7. Output referred P.S.R.R. is defined as
20 10 (VPOWER SUPPLY RIPPLE)
g
VOUT RIPPLE
1.00
.25
.....
V
1/
.75
.50
a
5
1.25
/"\
i\
\
/
V
/
./'
480
\
\
a
-2a
-4a
-.o~
V
a
-8
1\
-10a
--
--'
0.4 0.6
•
-12a
o
400
a
1
560
640
720
800
880
0
0.1
960 1040
A. - WAVELENGTH - nm
.llll
10
1.0
100
-1'a
-1.a0.1
0.2
f - FREQUENCY - MHz
f - FREQUENCV - MHz
Figure 3. Receiver Spectral Response
Normalized to 820 nm
Figure 4. Receiver Nolse·Spectral
Density
HP 1120A
500MHt
ACTIVE
13 pF
PROSE
Figure 6. Power Supply Rejection Test Circuit
Vee
HP 1120A
600 MHz
ACtiVE
PROSE
PiN =OJ.lW
CL
13 pF
(CL IS THE SUM OF A lOAD CAPACITOR AND
INPUT CAPACITANCE OF THE ACTIVE PROBE)
Figure 7. RMS Output Noise Voltage Test Circuit
8-94
Figure 5. Receiver Power Supply
Rej. vs. Freq.
HPII!568A
SPECTRUM
ANALYZER
•
1a
----~--~------
Vee
HFBR-1202
HP 172SA
~OScILLO.
SCOPE
son
PULSE
GENERATOR
Figure 8. Rise and Fall Time Test Circuit
RISE AND FALL TIMES
PULSE WIDTH DISTORTION
40---,
10--,
+-----
.1-
iii
...
">
~
250 "' ----1---- 250 " , - - .
50%
\
.1-
~
\
250 ",--'..,..r--250", ~
I
VPEAK
100
90
Cl
:l
in
~
Cl
lO
>0
10
f;
PULSE WIDTH DISTORTION = I tpHL - tpLH I
Figure 9. Waveform Timing Definitions
8-95
~~---~----~-~--~
HFBR-2204 RECEIVER
RECEIVER PCB LAYOUT DIMENSIONS
1.951.078) DIA. HOLES ACCEPT A
2-56 SELF TAPPING SCREW
PIN 1
1/4-38 UNS-2A
~HREAD
1.625 1.065)
,
f
13.2111.520)
j
,7.BI.3:12J
.h~I~~~~
2.251.090) DIA.
CLEARANCE HOLES FOR
MOUNTING BRACKET ,SCREWS
PCB EDGE
DIMENSIONS IN'MILLIMETRES (INCHES) •
• 13.751.550) -
Figure 10. Mounting Dimensions
SMA STYLE CONNECTORS
TYPE A'
(Used in HP's SMA Connectored Cable Assemblies).
TYPEB
(Not Available from Hewlett-Packard)
3.141.12351
3.16 {.12451
Figure 11. Fiber Optic Connector Styles
8-96
Horizontal PCB Mounting
Mounting at the edge of a printed circuit board with the
lock nut overhanging the edge is recommended.
the leads at the base of the package and bend the leads as
desired.
When bendi ng the leads, avoid sharp bends right where the
lead enters the backfill. Use needle nose pliers to support
When soldering, it is advisable to leave the protective cap
on the unit to keep the optics clean.
DIMENSIONS FOR BULKHEAD
MOUNTING HOLE
5.BBDID
~
6.251.2501
DIA.
(STANDARD 1/4INCH "0" HOLE·- RU PUNCH)
.£
2-56 SELF TAPPING SCREWS
(METRIC EQUIV. M2.2 x 0.45)
MOUNTING HARDWARE: HFBR-4202 (HFBR-2204)
1
1
1
2
1
EMJ/ESD SHIELD
1/4-36 NUT
1/4x .005 INCH WASHER
2-56 SELF TAPPING SCREWS
MOUNTING BRACKET
Ordering Guide
Transmitter:
HFBR-1202 (SMA Connector Compatible)
HFBR-1204 (SMA Connector Compatiblei
Receiver:
HFBR-2204 (SMA Connector Compatible)
Moun"ling
Hardware:
HFBR-4202 (SMA Connector Compatible)
8-97
;
~
Flin-
HEWLETT
~~ PACKARD
PIN PHOTODIODE
FIBER OPTIC RECEIVER
HFBR-2208
Features
• GUARANTEED PERFORMANCE: .
60 MHz Bandwidth at 5 V Reverse Bias
Low Capacitance: Less than 1.6 pF
0.29 A/W Minimum Responsivity
Low Dark Current: Less than 500 pA
• MATES DIRECTLY WITH SMA STYLE
CONNECTORS
• RUGGED, ISOLATED MINIATURE METAL
PACKAGE WITH FACTORY ALIGNED OPTICS
Applications
• HIGH SPEED FIB.ER OPTIC LINKS
• WIDE BANDWIDTH ANALOG FIBER OPTIC
LINKS
• HIGH SENSITIVITY, LOW BANDWIDTH LINKS
• OPTICAL POWER SENSOR
Description
The HFBR-2208 Fiber Optic Receiver is a silicon PIN photodiode mounted in a rugged metal package. Well suited for
high speed applications, the HFBR-2208 Fiber Optic Receiver has low capacitance and low noise. The high coupling
efficiency of the miniature package provides·l;i minimum of
0.29 AIW responsivity. Receiver responsivity·includes the
optical power lost in coupling light from the fiber onto the
PIN photodiode as well as the responsivity of the PIN
photodiode itself.
HFBR-2208 mates with SMA style connectors.
The HFBR-2208 is a member of the family of transmitters
and receivers which use the miniature package. HP ·also .
offers connectored and unconnectored 100/140 I'm fiber
cable in simplex and duplex configurations.
Cross Sectional View
Mechanical Dimensions
HFBR-2208 SMA STYLE COMPATIBLE
~
~
~
~
0,39 0
1.01---I-+-+--:l,e.4
~
"
0.996
I
> 0.38
I-
§ 0.9921---I-+'~+--I--t-
:;
~
a:
0 0.984
iq
~
!!:
~ 0.37
O,9BO I--I+-+-t--+-+-+---I--I
'0
'2
I-
IU
I
15a:
";!
::J
U
~
Z
a:
"a:"
2.0
'.5
I
(j
I
:I!
"
I
J:
TA =+r5~-C
~
,
E
'.0
''\
'"~
- .I
T~ -- --
_oc
'5
~:::;
~
"z
"
2.0
I
w
U
~
l\
"'\
~
05
~
-55
I
0
30
I
'0
'5
Figure 6. 3 dB Bandwidth vs. Reverse
Voltage
'0
"-'
"\
~
\.
I
-'5
\
"w~
.........
I
-35
............- ~
iia:
~
25
>
~
"- -...
45
65
-5
a:
I
~
85
~
-1 0
-30
-25
-20
-'5
-'0
\
PR - OPTICAL POWER - dBm
TA - AMBIENT TEMPERATURE _oC
Figure 8. Linearity Characteristic vs.
Optical Power
Figure 7. Normalized Bandwidth vs.
Ambient Temperature
8-100
20
VA -REVERSE VOLTAGE-V
~
'.0
0.15
/
z
o
1.25
~
0
10
1/
V
~
o
I
25
~
Figure 5. Capacitance vs. Reverse
Voltage
J:
'.5
20
0
15
I
VR - REVERSE VOLTAGE - V
Figure 4. Dark Current vs. Ambient
Temperature
~ 1.75
V
250
:a
.f
'0
./
300
5
~z 200
~T =+25"C
""
Cl
25
35 0
2.5
I
20
Figure 3. Responslvlty vs. Reverse
Voltage
3.0
~
~
'5
VR - REVERSE VOLTAGE - V
3.5
!llM
V
0.365
Figure 2. Normalized Responslvity
vs. Ambient Temperature
Figure 1. Normalized Responslvity
vs. Wavelength
b
~
0/
TA -AMBIENT TEMPERATURE _oC
h - WAVELENGTH - nm
TA - AMBIENT TEMPERATURE
TA-~I---100 VII'S
VCM = 10V
(Typical)
5.0mA 3000 V dc 2500 V ac
HCPL·2601 High Common Mode
Rejection, Optically
Coupled Logic Gate
High Speed
Logic Ground
Isolation
10 M bills 1000 VII'S
5.0 mA
HCPL·2611
Motor Controls
Switch·mode Power
Supplies Electrically
Noisy Environments
6 VOUT
9-19
1M
5000 VII's
4.0 M bills 1000 VII's
Optically Coupled
Logic Gate
~
5000 VII's
Very High Speed
Logic Isolation
AIO and Parallel
to Serial Conversion
7 v,
9-11
1M
VCM = 50 V
HCPL·2400 20 MBaud, High
Common Mode
Rejection, Optically
Coupled Logic Gate
3 State Output
HCPL·2411
6N137
1M
@
High Speed, Long
Distance Line
Rec l iver, Computer
Perip'herallnterfaces
CMOS Logic Interface
~
3000 V dc 2500 V ac
1000 VII's
HCPL·2300 Very Low Input
Current, High Speed
Optocoupler
~IIDGNO
[!
1,6mA
VCM = 50 V
Motor Controls
Switch·mode Power
Supplies Electrically
Noisy Environments
J!Jvcc HCPL·2231 Dual Channel Low
Input Current
CATHODE 1 11 il!V JLl V"
Optically Coupled
CATHODE 2 ~ ~elID\ID V"
Logic Gate
ANODE 2 B rL..ffi GN.
HCPL·2232 VCC = 20 V Max
Withstand Test
Specified
Voltage
Input
Page
Current Standard' Option mo" No.
@
Logic Gate
VCC = 20 V Max.
ANODEID~.'r.=.
1M
9-35
1M
5 GNO
IT
\!IVcc
ANOOE~~~V'
~
jIDVDUT
YGNO
~
~~
HCPL·2602 Optically Coupled
4
HCPL·2612
+IN 2
-IN
5 M bills
HCPL·2201 Low Input Current
GNO
[!
[!
Guaran·
teed
CMR
~+IIDt:DVD HCPL·2202 Optically Coupled
,"ODE [1
CATHODE!}
Appllcatlon!t!
High Speed Logic
Ground Isolation
LSTTL, TTL, CMOS
Logic Interference
Typical
Dala Rate
[NRZ[
7 v,
'"
Line Receiver
VOUT
5 GNO
Replace Conventional
Line Receivers
@
9-4
9-39
1M
5000 VII'S
@
VCM=300V
10 M bills 1000 VII'S
@
5000 VII'S
@
VCM=300V
'Standard Parts meet the UL1440 V ac test for 1 minute.
"Option 010 parts meet the UL 2500 V ac test for 1 minute.
1M
VCM = 50 V
VCM =50V
Electrically Noisy
Environments
3000 V dc 2S00 V ac
5.0mA
3000 V de 2S00 V ac
1M
1M
9·43
High-Speed Logic Gate Optocouplers
Device
.---
Description
ANOOE,(j~,
~Vee HCPL·2630 Dual Channel
ANOOE,@
tID GNO
CATHODE1 ~
,"t>-~ VOl
CATHODE, ~13'~C>-~ V"
-
Optically Coupled
Gate
.--HCPL·2631
ANODE, [I
ID Vee
CATHOOE'~ "C>-~VOI
ICATHOOEz~i3'~C>-]I V"
ANOOE,@
'---- ]] GNO HCPL-4661
13-:
Dual Channel,
High Common Mode
Rejection, Optically
Coupled LogiC Gate
~
Applfcationlll
Typical
Data Rate
[NRZ]
Guaran·
teed
Ratio
Line Receiver, High 10 M bitls >100 VI J-tS
@
Speed Logic Ground
Isolation
VCM = 10 V
(Typical)
High Speed
Logic Ground
Isolation
10 M bitls
1000 VI J-tS
Specified
Input
Current
5.0 mA
Withstand Test
Voltage
Page
Standard' Option 010" No .
3000 V dc 2500 V ac
'iU
5,0 mA
@
3000 V dc 2500 V ac
'iU
VCM=50V
9-49
'iU
9-53
'iU
5000 VI J-tS
Motor Controls
Switch-mode
Power Supplies
Electrically Noisy
Environments
@
VCM=300V
'Standard Parts meet the UL 1440 V ac test for 1 minute,
"Option 010 parts meet the UL 2500 V ac test for 1 minute,
High-speed Transistor Output Optocouplers
Device
.---
Ill¥F~IDvee
] V,
Description
6Nt35
Transistor Output
[I
ANODE
CATHODE @
@
~
]I V,
]I GNO 6N136
HCPL·4502
HCPL·2502
··"m'·
HCPL·2530
Line Receiver, Analog
Circuits, TTLiCMOS,
TTLiLSTTL Ground
Isolation
Current
Transfer
Ratio
Specified
Input
Current
Standard'
Option Of 0"
Page
No,
t M bitls
7% Min.
t6mA
3000 V de
2500 V ac
9·57
'iU
'iU
19% Min.
Pin 7 Not Connected
15·22%
SL5505
CATHODE, 2. ;
CATHODE, 3 ;
ANODE, 4
APplicatlonl!1
Withstand Test
Voltage
Typical
Data Rate
INRZI
Dual Channel
Transistor Output
7 VOl
6 V" HCPL·2531
5 GNO
Telephone circuits,
Approved by CNET
1 M bitls
Line Receiver, Analog
Circuits, TTLiCMOS,
TTLiLSTTL Ground
Isolation
1 M bltls
15% Min,
16mA
t500Vdc
16 mA
3000 V de
9-61
40% Max.
7°10 Min.
'iU
2500 V ac
9·63
'iU
19% Min.
High Gain Optocouplers
Device
B'·
ANODE 2
CATHODE
-,
4
3,,.
ANOOh 4
V, 6N139
5 GNO
..
HCPL·2730
6 '.102
HCPL·2731
71101
5 GNO
AHOOE~V'
5 Vo
4N45
CATHODE 2 .. "
3
Specilied
Input
Current
Siandard'
Option OlD"
Page
No,
Line Receiver, Low
Current Ground
Isolation, TTLiTTL,
LSTTLITTL,
CMOS/TTL
Line Receiver, Ultra
Low Current Ground
Isolation, CMOSI
LSTTL, CMOSITTL,
CMOSICMOS
lOOk bitls
300% Min,
1.6 mA
3000 V de
2500 V ac
9-67
Dual Channel. High
Gain, Vcc = 7 V Max,
Dual Channel, High
Gain, Vec = 18 V Max.
Line Receiver, Polarity
Sensing, Low Current
Ground Isolation
lOOk bitls
Darlington Output
Vce = 7 V Max.
Darlington Output
Vce = 20 V Max,
AC Isolation, Relay·
Logic Isolation
Low Saturation
Voltage, High Gain
Output. VCC = 7 V Max.
7 V8
.~'~
2
Current
Transler
Ratio
Description
6N138
4 GNO 4N46
Withstand Test
Voltage
Typical
Data Rate
INRZI
Low Saturation
Voltage, High Gain
Output. Vce = 18 V
Max,
Applicatlonlll
'iU
3k bitls
400% Min,
0,5mA
300% Min.
1.6mA
400% Min,
0,5mA
250% Min,
1.0mA
350% Min.
9-5
0,5 mA
3000 V de
'iU
'iU
2500 V ac
9-71
'iU
3000 V de
2500 V ac
'iU
'iU
9-75
AC/DC to Logic Interface Optocoupler
Device
'~.
2
Description
HCPL·3700
,7
3
6
4
5
AC/DC to Logic
Threshold Sensing
Interface Optocoupler
Appllcatlonlll
Typical
Data Rales
4 KHz
Limit Switch
Sensing. Low Voltage
Detector. Relay
Contact Monitor
Oulpul
Currenl
Wllhstand Tesl
Vollage
Slandard' Option Ol~''
2.5 mA TH+
1.3 mA TH-
4.2·mA
3000 V dc
Input
Char·
aclarlstlcs
Output
Char·
acterlstlcs
Inpul
Threshold
Currenl
1M
_-25Iio V l\C
Page
No.
9-79
1M
20 mA Current Loop Optocouplers
Devlca
'~.
2
:
7
3
:
6
4
"
5
Description
HCPL·4100
HCPL-4200
i~~
4
'
8
7
Optically Coupled
20 mA Current Loop
Transmitter
Appllcatlonl 11
Isolated 20 mA
Current Loop in:
• Computer
Peripherals
• Industrial
Control Equipment
• Data
Communication
Equipment
Typical
Oala Ratas
20 kBd (at TTL/CMOS 27 V Max.
400 metres)
Compliance
Voltage
Optically Coupled
20 mA Current Loop
Receiver
6.5mA
Typ.
Threshold
Current
6
Withstand Test
Voltaga
Standard'
Option DID"
Paga
No.
3000 V dc
2500 V ac
9-85
1M
1M
3 State
Output
t-9-93
5
Optocoupler Options
OptlDn
DescrlptlDn
010
SpeCial conslruclion and testing to ensure the capability to withsland 2500 V ac input 10 outpul for one minute. Testing is
recognized by Underwriters Laboratories. Inc. (File No. E55361). This specification is required by U.L. in some applications
where working voltages can exceed 220 Vac.
9-9
IDa
Surface mountable optocoupler in a standard sized dual·in-line package with leads trimmed (butt joint). Provides an
optocoupler which is compatible with surface mounting processes.
9-10
'Standard Parts -meet the UL1440 Vae test for 1 minute.
"Opiion 010 parts meet the UL 2500 V ae test for 1 minute.
9-6
--
-------~--------------------
8 Pin Dual-In-Line Package
High-Speed Logic Gate Optocouplers
Description
Device
Application
'~
iT
..
HCPL-5200 Single Channel,
Hermetically Sealed
Wide Supply Voltage
Optocoupler
4
5GNU
HCPL-5201 MIL -STD-883
Class B
Military/High
Reliability
1~"
8 Vcc
HCPL-5230 Dual Channel,
Hermetically Sealed
Wide Supply Voltage
Optocoupler
High Speed Logic
Ground Isolation,
LSTTL, TTL, CMOS
Logic Interface
HCPL-5231 MIL-STD-883
Class B Part
MilitarylHigh
Reliability
HCPL-5400 Single Channel
Hermetically Sealed
High Speed
Optocoupler
High Speed Logic
Isolation, AID and
Parallel/Serial
Conversion
2
';-
3'
~lID
3W lID
2
4
'<--
'~
2
3
'" 11
"
7 Vo
6 Ve
7 VOl
6 V02
5 GNU
...
7 Ve
6 Vo
High Speed Logic
Ground Isolation,
LSTTL, TTL, CMOS
Logic Interface
4
5 GNU
HCPL-5401 MIL-STD-883
Class B Part
MilitarylHigh
Reliability
'~
.."
HCPL-5430 Dual Channel
Hermetically Sealed
High Speed
Optocoupler
High Speed Logic
Isolation, Communications, Networks,
Computers
4
5 GNU
HCPL-5431 MIL-STD-883
Class B Part
Military/High
Reliability
2
\.
3
"'" IJ
7 VOl
6V02
Typical
Data Rate
[NRZ]
Common
Mode
Specified
Input
Current
Withstand
Test
Voltage'
Page
No.
5 M bitls
1000 ViI's
6.0 rnA
500 Vdc
9-102
I-9-108
40 M bitls
500 ViI's
9.0 rnA
500 Vdc
9-114
'--9-120
High Gain Optocouplers
Description
Device
.
.."
'~ "
2,
3
4
7NC
6Vo
5GND
'~
2'
3 'l
4
I
HCPL-5700 Single Channel
Hermetically Sealed
High Gain Optocoupler
MIL-STD-883
Class B Part
HCPL-5730 Dual Channel
Hermetically Sealed
7 VOl
High Gain Optocoupler
6 V02
5 GND HCPL-5731 MIL-STD-883
Class B Part
HCPL-5701
Application
Typical
Data Rate
[NRZJ
Line Receiver. Low
60k bills
Current Ground
Isolation. TTLiTTL.
LSTTLITTL. CMOS/TTL
Military/High
Reliability
Line Receiver, Polarity
Sensing. Low Current
Ground Isolation
Military/High
Reliability
Current
Transfer
Ratio
Specilied
Input
Current
Withstand
Test
Voltage
Page
No.
200% Min.
O.5mA
500 V dc
9-126
9-'i3O
AC/OC to Logic Interface Optocoupler
Description
Device
't!~r
2
•
3
•
4·
HCPL-5760
7NC
6Vu
5GND
HCPL-5761
Single Channel
Hermetically Sealed
Threshold Sensing
Optocoupler
MIL-STD-883
Class B Part
Application
Limit Switch
Sensing, Low Voltage
Detector Relay
Contact Montitor
Military / High
Reliability
9-7
Typical
Data Rate
10 kHz
Input
Threshold
Current
2.5 rnA TH+
1.3 rnA TH-
Output
Current
Withstand
Test
Voltage
Page
No.
2.6 rnA
500 V dc
9-134
16 Pin Dual In-Line Package
High Speed Transistor Optocouplers
Device
'i'
~
Q;
Description
4N55
;
~~~~=
~~LJ
Dual Channel
Hermetically Sealed
Analog Optical
Coupler
4N55/8838 MIL-STD-883
Class 8 Part
Application
Line Receiver.
Analog Signal
Ground Isolation.
SWitching Power
Supply Feedback
Element
Typical
Data Rate
(NRZI
Current
Transfer
Ratio
Specified
Input
Current
Withstand
Test
Voltage
Page
No.
700k bitls
9°'0 Min.
16 mA
1500 V dc
9-140
Typical
Data Rate
(NRZI
Common
Mode
Specified
Input
Current
Withstand
Test
Voltage
Page
No.
10M bitls
1000 V/"s
10 mA
1500 V dc
9-145
Military/High
Reliability
High Speed Logic Gate Optocouplers
Device
~~
.If
j~
~
!~
Description
6N134
Dual Channel
Hermetically Sealed
Optically Coupled
Logic Gate
Line Receiver.
Ground Isolation for
High Reliability
Systems
8102801EC
DESC Approved
6N134
Military/High
Reliability
HCPL-I930
Dual Channel
Hermetically sealed
High CMR Line
Receiver Optocoupler
Line receiver, High
Speed Logic Ground
Isolation in High
Ground or Induced
Noise Environments
HCPL-I931
MIL-S1O-883
Class 8 Part
Military/High
Reliability
'~v"
~
~
11
~
,
~
GND
iVE
::~tc
~£;
1 VE
13VOUT
'rn:r;::" 1 VDUT
:~~
8
10
.
Application
f--9'149
10M bit/s
1000 VI ItS
10mA
1500 Vdc
9-153
Typical
Data Rate
(NRZI
Current
Transfer
Ratio
Specified
Input
Current
Withstand
Test
Voltage
Page
No.
lOOk bitls
300% Min.
0.5mA
1500 V dc
9-159
High Gain Optocouplers
Description
Device
Q~~
~
J
~vcc
~lt~~,V.
4
'1
I VO!
~}J:I>-~V03
~
!I>-~VM
~5tJ-~G"
~-~
Hermetically Sealed
Package Containing
4 Low Input Current.
High Gain Optocouplers
DESC Approved
8302401EC
6N140A
6N140A/8838 MIL-STD-883
(6NI40/883B) Class 8 Part
6N140A
(6NI40)
Application
Line Receiver, Low
Power Ground
Isolation for High
Reliability Systems
Military/High
Reliability
Use 8302401 EC
in New Designs
9-8
-
9-163
-
9-159
OPTOCOUPLER OPTION
FOR 2500 Vac/
1 MINUTE REQUIREMEN;r
Features
OPTION 010
DEVICE MARKING
• SPECIAL CONSTRUCTION AND TESTING
• UL RECOGNITION FOR 2500 Vae/1 MINUTE
REQUIREMENT (FILE NO. E55361)
./" TYPE NUMBER
Fh;;"l xxx~;::
DATE CODE
•
~~COGNITlDN
a:~YYWW~
• AVAILABLE FOR ALL PLASTIC OPTOCOUPLERS
010,
6~~
• 480 V ae LINE VOLTAGE RATING
. . . . OPTION CODE
Description
Option 010 consists of special construction on a wide range
of Hewlett-Packard plastic optocouplers. After assembly,
each unit is subjected to an equivalent electrical performance test to insure its capability to withstand 2500 Vac
input to output for 1 minute. This test is recognized by
Underwriters' Laboratory as proof that these components
may be used in many high voltage applications.
5pecifications
All specifications for optocouplers remain unchanged when
this option is ordered. The 2500 Vac/1 Minute capability is
validated by a factory 3200 Vac/1 Second dielectric voltage
withstand test.
Applications
Ordering Information
The 2500 Vac/1 Minute dielectric withstand voltage is
required by Underwriters Laboratory when components are
used in certain types of electronic equipment. This requirement also depends on the specific application within the
equipment. Some applicable UL documents are listed
below.
UL Spec.
Number
1577
114
347
478
508
544
698
773
913
916
1012
·1244
1410
To obtain this high voltage capability on plastic optocouplers order the standard part number and Option 010.
Examples:
6N135
Option 010
HCPL-3700
Option 010
This option is currently available on all standard catalog
plastic optocouplers except SL5505.
Specification Title
Standard for Optical Isolators
Applications
Appliance and Business Equipment
High Voltage Industrial Control
Equipment
Information Processing and Business
Equipment
Industrial Control Equipment
Medical and Dental Equipment
Industrial Control Equipment for Use in
Hazardous Locations
Plug-in, Locking Type Photocontrols
Intrinsically Safe Apparatus and
Associated Apparatus
Standard for Energy Management
Equipment
Power Supplies
Electrical and Electronic Measuring and
Testing Equipment
Television and Video Products
9-9
F4.. HEWLETT
.:'~ PACKARD
SURFACE MOUNT OPTION
FOR OPTOCOUPlERS
OPTION 100
Features
• SURFACE MOUNTABLE
Leads Trimmed for a Butt Joint Connection
• COMPATIBLE WITH,VAPOR PHASE REFLOW AND
WAVE SOLDERING PROCESSES
• MEETS ALL ELECTRICAL SPECIFICATIONS OF
CORRESPONDING STANDARD PART'
NUMBERS
• LEAD COPLANARITY WITHIN 0.004 INCHES
• AVAILABLE FOR ALL OPTOCOUPLERS IN
PLASTIC PACKAGES
• AVAILABLE IN STANDARD SHIPPING TUBES
Description
Ordering Information
Option 100 is an optocoupler in a standard sized dual-in-line
package, with trimmed leads (butt joint>. The distance from ,
the printed circuit board (PCB), to the bottom of the optocoupler package, will be typically 0.035 ,inches. The height of
the optocoupler package is typically 0.150 inches, leaving a
distance of 0.185 inches from PCB to the top of the optacoupler package.
'
Option 100 is available for all optocouplers in plastic
packages.
To. obtain surface-mountable optocouplers, order'the standard part number and Option 100.
Examples:
6N136
Option 100
Applications
Option 100 enables electronic component assemblers to
include HP optocouplers on a PCB that utilizes surfacemount assembly processes. Option 100 does not require
"through holes" in a PCB. This reduces board costs, while
potentially increasing assembly rates and increasing companent density per board.
HCPL-22oo
Option 100
OPTION 100 DRAWING
TVP£NUM8ER
r/~
xxxx
a!~vvww
, '.
100
t~: "T:-'l""T":"T""T':"T""I'~
specifications
OATEOOIIE
UL RECOGNITION
OPTION CODE
a
All electrical specifications for optocouplers remain unchanged whIm this option is ordered. In addition, the
device will withstand typical vapor phase reflow soldering
conditions of 215° C for 30 seconds, and wave solder
immersion for 5 seconds, @ 260°C.
DIMilN$IONS IN MI L.UMETRES IINCHES)
Not.: For complete dimensions, refer 10 outline drawing
of corresponding catalog part number.
9-10
---.-~-.--
F/iO'l
.. - -..- - -
--------
HEWLETT
~e.. PACKARD
lOW INPUT CURRENT
lOGIC GATE
OPTOCOUPlER
HCPL-2200
SCHEMATIC
:
1
~--,----o8
Vee
+J~1"
2
_"··40,1.370J
ii,OO 13001 _
VF
-
i
7
6
;rYPENUMBEA
I •. 10~
7,36 (,2oo) 6,60 (.260)
1
1
UL
~=-;-rnr:;-,...,...,-J RECOGNITION
~----~-----4-------oGND
SHIELD
..i
Tt----I--ry~~=-~
5
OATE COOE
1
3
a
0.181.0071
O.33/1ii3l
•. 1
1
1
TRUTH TABLE
(Positive Logic)
1]l![:j'jjj')
I
I
~_,,==::::;::;;;:;=-
5
Features
• COMPATIBLE WITH LSTTL, TTL, AND CMOS
LOGIC
• WIDE Vcc RANGE (4.5 TO 20 VOLTS)
• 2.5 MBAUD GUARANTEED OVER
TEMPERATURE
• LOW INPUT CURRENT (1.6 mA)
• THREE STATE OUTPUT (NO PULLUP
RESISTOR REQUIRED)
• GUARANTEED PERFORMANCE FROM 0° C
TO +85°C
• INTERNAL SHIELD FOR HIGH COMMON
MODE REJECTION
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
• . HCPL-5200/1 COMPATIBILITY
OIMENSIONS IN MllLIMETAE:S ANt) {INCHES).
eliminates the need for a pullup resistor and allows for direct
drive of data busses. The hysteresis provides differential
mode noise immunity and eliminates the potential for output
Signal chatter. The detector IC has an internal shield that
provides a guaranteed common mode transient immunity of
1,000 volts/!,sec. Higher CMR specifications are available
upon request. Improved power supply rejection eliminates
the need for special power supply bypassing precautions.
The Electrical and Switching Characteristics of the HCPL2200 are guaranteed over the temperature range of 0° C to
85° C. The HCPL-2200 is guaranteed to operate over a Vee
range of 4.5 volts to 20 volts. Low IF and wide Vee range
allow cOiroatibility with TTL, LSTTL, and CMOS logic. Low
IF and low Icc result in lower power consumption compared
to other high speed optocouplers. Logic signals are transmitted with a typical propagation delay of 160 nsec.
Applications
•
•
•
•
•
•
•
The HCPL-2200 is useful for isolating high speed logic interfaces, buffering of input and output lines, and implementing
isolated line receivers in high noise environments.
Isolation of High Speed Logic Systems
Computer-Peripheral Interfaces
Microprocessor System Interfaces
Ground Loop Elimination
Pulse Transformer Replacement
Isolated Buss Driver
High Speed Line Receiver
Recommended Operating Conditions
Description
The HCPL-2200 is an optically coupled logic gate that com- .
bines a GaAsP LED and an integrated high gain photon
detector. The detector has a three state output stage and has
a detector threshold with hysteresis. The three state output
9-11
Parameter
Power Supply Voltage
Enable Voltage High
Enable Voltage -Low
Forward Input Current
Forward Input Current
Operating Temperature
Fan Out
Symbol
Vce
VEH
Vel
IF(ON)
IF(OFF)
TA
N
Units
Min. Max.
Volts
4.5
20
2.0 . 20
Volts
Volts
0
0.8
rnA
1.6
5
mA
0.1
85111
0
'C
TTl. Loads
4
Absolute Maximum Ratings
Recommended Circuit Design
(No Derating Required up to 70· C)
..----1~o() ~~I
~c.;) 0--,,;_...,120 pF
Storage Temperature ••.••.••.•...••• -55·C to +125·C
Operating Temperature •..•..••.••.. -40·C to +85·Cll!
Lead Solder Temperature •.•.•.•...••.• 260· C for 10 s
(1.6 mm below seating plane)
Average Forward Input Curr,ent - IF •.•••...••.. 10 mA
Peak Transient Input Current - IF •.....•.••.•••..• 1A
(:51 I'S Pulse Width, 300 pps)
Reverse Input Voltage ............................ 5V
Supply Voltage - Vee ••••...•••••• O.OV min., 20V max.
Three State Enable Voltage
- Va ......... . • . . . . . . • • . . • . • .• -C.5V min., 20V max.
Output Voltage - Vo ..........•.. -C.5V min., 20V max.
Total Package Power
Dissipation - P .......................... 210 mWll!
Average Output Current - 10 .••••••••••••••••• 25 mA
DATA
I
I
OUTPUT
,
: ,,~:
•.J ">-0
: ~'f'
UP TO 16 LSTTL
I
I
LOADS
, r'-.!., OR 4 TTL LOADS
H
DATA
INPUT
I
I
l,.A"
>-0
I
11"... '
L1
.-I
"'>--0
-
Figure 1. Recommended LSTTL to LSTTL Circuit
Electrical Characteristics
For DoC::; TAil!::; 8S D C. 4.S V::; Vee::; 20 V. 1.6 rnA ::;IF(ON)::; S rnA. 2.0 V::; VEH::; 20 V. 0.0 V::; VEL::; 0.8 V.
o rnA ::;IF(OFF)::; 0.1 rnA. All Typicals at TA = 2S D C. Vee = SV, IF(ON) = 3 rnA unless otherwise specified.
Parameter
=
Symbol
Logic Low Output Voltage
LogiC High Output Voltage
VOL
VOH
Output Leakage Current
,VOUT:> Vec',
IOHH
Logic High Enable Voltage
VeH
Logic Low Enable Voltage
VeL
Min.
Typ.
Max.
Unlt$
Test Conditions
Voila
IOL '" 6.4 rnA (4 TTL Loadal
2.4
.
0.5
Volts
pA
100
500
~
leH
Logic Low Enable Current
la
O.B
ICCL
LogIc High Supply Current
ICCH
"A
pA
=~eN=2.7V
fJA
VEN = 20V
mA
VEN = OAV
4.5
6.0
mA
Vee = 5.5V
IF=OmA
5.25
7.S
mA
Vec =20V
VEl '" Oon't Care
2.7
4.5
mA
Vce=5.5V
3.1
6.0
Logic High Short CiroUit
Output Current
IOSH
Input CUrrent Hysteresis
IH'ls
Input Forward Voltage
VF
Input Reverse Breakdown
Voltage
VR
Input Diode Temperature
Coefficient
-.lTA
Input-Output
Insulalion
11-0
I
IF=5mA,
~=20V
-20
fJ
HPA
pA
500
IO$~
Vcc=4.6V
Vo=20V
250
IOZH
Logie Low Short Circuit
Output Current
VEl '" Don't ~re
Vo=O.4V
VEN '" 2V,IF "" 5 mA
Vo=2.4V
VEN = 2V. IF =0
Vo=5.5V
!'A
Vo=20V
25
mA
Vo = Vee = 5.5V
40
mA
Vo = Vee =2OV
-10
mA
VCC""5.5V
-25
mA
Vcc= 20V
mA
Vce~5V
0.12
1.5
1.70
5
:J,VF
-1.7
2
4
Volts
IR= 10!,A, T A "25"C
45% flH,t '" 5s,VI_O"'3kV dC,TA"'25 D C
t "" 1 min.
VRMS
flH ::; 50%.
1012
ohms
V,-O '" 500 VDC
Input-output Capacitance
C,..(l
0.6
pF
f= 1 MHz, VI..(l '" OVDC
Input Capacitance
C'N
60
pF
f., 1 MHz. VF '" OV, Pins 2 and 3
9-12
5
IF=5mA
RJ..o
VISO
2500
IF=5mA,
VO=GNO
=25"C
IF'" 5 rnA, TA
pA
1
2
..
Volts
mV!'C
IF=OmA
Inpu!-Oulpul Resi$lance
OPT. OW
3
1,,"'SmA
-0.32
loll.
High Impedance State
Output Current
I
Volts
100
.004
Logic Low Supply Current
'VOH" VCC- 2•1II
Note
2.0
20
Logic High Enable Current
10H =-2.6mA
Vo~5.5V
figure
2
3.7
e
3
3
switching Characteristics
0.0 mA:S IF(OFF):S 0.1 rnA. All Typicals at TA
~
For O'C:s TAlll:s 85'C, 4.5V:S Vee:S 20V, 1.6 mA:S IF(ON):S 5 rnA,
25'C, Vee ~ 5V, IF(ON) ~ 3 rnA unless otherwise specified.
Min.
uti lIs
Max.
Typ.
4,5
6,7
4,5
Propagation Delay Time to
Logic High Output Level
tPLH
Output Enable Time to
Logic High
tPZH
25
ns
8,10
Output Enable Time 10
Logic Low
tPZl
28
ns
8,9
Output Disable Time
from Logic High
tPHZ
105
ns
8,10
Output Disable Time
IPLZ
60
ns
8,9
Output Rise Time (10-90%1
t(
55
ns
6,11
Output fall Time (90-10%)
If
15
ns
210
160
170
115
ns
Without Pellking Capacitor
With Peaking Capaoitor
ns
Without Peaking"Capacitor
With Peaking Capacitor
300
300
".
6,11
Logic High Common Mode ICMHI
Transient fmmunily
1000
10,000
VII's
TA '" 2S'C.IF ~ 1.6 mA
VeM ~ 50 V
12,13
6
Logic Low Common Mode
Transient Immunity
1000
10,000
Vlj.J.s
T A - 25' C, IF - 0
VCM"'50V
12,13
6
ICMLI
1
0.9
w
CI
vL ')OV-
0.8
",-S.4mA-
tF:"'QmA
V~.4.~V _
1
0.7
0,6
~
0,5
...J
0.4
0,3
§
0.2
I
w
Vo"'1..7V
-3
Va "2AV
~
O. 1
I
o
-so
~g
\
-4
"- ....
-6
TA" 25"C
>
-5
~
V~=4.5V
III "'SmA
1\
-2
~
o
Nole
6,7
tPHL
~
:=
Figure
$ymbol
tram Logic Low
~
g
Tesl Conditions
Parameler
Propagation Delay Time to
Logic Low Output Level
"
::>
o
I
~
lOt'" 6.4 rnA
-7
-40
-20
20
40
60
80
100
-.
-60
-40
TA - TEMPERATURE -"C
Figure 2. Typical Logic Low Output
Voltage vs. Temperature
'Oti "'-VirnA
~
20
-20
40
60
80
°0~----~.5------~----'~.5~--~
100
IF -INPUT CURRENT - rnA
TA - TEMPERATURE _oC
Figure 3. Typical Logic High Output
Current vs. Temperature
Figure 4. Oulpul Voltage vs. Forward
Input Current
PULSE
GENERATOR
Vee
E
I
>
D,
~
0
D,
"0
D,
~
';'t"
0
IE
I
f;
RI
2.15 Kn
1.1 Kn
GaUl
I (ONI
1.6mA
3mA
SmA
50L-~--J-~--~~~~--~~
ALL DIODES ARE lN916DR lN3064
VF - FORWARD VOLTAGE - VOLTS
INPUT IF
-d ------
Figure 5. Typical tnput Diode Forward
Characteristic
-60
___ IF (ON)
-40
-20
20
40
60
80
100
TA - TEMPERATURE _·C
-)50% 'F{ONI
PLH
OUTPUT
Vo
1001----+-f-2II11O!!'+-t--+--f---l
~
--------1.3V VOL
tPHL
OmA
.--VOH
Figure 6. Test Circuit lor tpLH, tpHl> to
and tf
9-13
Figure 7. Typical Propagation Delays vs.
Temperature
. - - - . . . , CL • 15 pF INCLUDING PROBE
PULSE
AND JIG CAPACIT ANCE
~ +5V
GENERATOR
Vee
c!»
Zg=50n
100
81
tr=tt.- Sns
Vo
Ct. •
~
16 pF
I
~
80
e
2
D.
D3
~
60
lE
40
"~
D4
w
~
:\!
20
ff;
INPUT
I
V,
b
0
-60
TA - TEM-:'ERATURE _ °C
TA - TEMPERATURE _·C
Vo
Vee
120
~cc'5~
CL-t5pF
2 100
I
/
w
!
:c
80
~
~
50
Ii;:
I
V
4D
";
.....,
V
~,oooo
.11
I 9000
r
LoooJI
"~ 7000
~
-5DV
VeM
OV
'
SWITCH AT A: IF ·1.6 mA
,VOH~
"
20
6ODO
~
5000
II .
.
~ 4000
.........
50 -4D
ffi
a:
20
o
Figure 10. Typical LOgic High Enable
Propagation Delay vs. Temperature
Figure 9. Typical Logic Low Enable
Propagation Delay vs. Temperature
Figure 8. Test Circuit for tpHZ, tpZH. tpLZ.
and tpZL
20
OUTPUT
40
60
80
SWITCH AT 8: IF .. 0 mA
vo.~
100
VOL
TA .,.. TEMPEflATURE _·C
~
3000
i§
2000
!
I
tl
1000
0
0
500
1000
1500
2000
VCM -COMMON MODE TRANSIENT VOLTAGE-V
"SEE NOTE 6
Figure 11. Typical Rise. Fall Time VB.
Temperature
Figure 12., Test Circuit for Common Mode
Transient Immunity and Typical
Waveforms
Figure 13. Typical Common Mode,
Transient Immunity vs. Common Mode
Transient Amplitude
VCC2
l4.5ta 20VI
VCCI
Ii5VI
DATA
INPUT
Figure 14; LSTTL to CMOS Interface Circuit
Figure 15. Recommended LED
Drive Circuit
Figure 16. Series LED,Drlve with
Open Collector Gate (6.04 K!l
Resistor Shunts IOH from the LED)
The 120 pF capacitor may be omitted in applications where 500 ns propagation 'delay is sufficient.
Notes:
1. Derate total package power dissipation, P, linearly above 70° C free air
temperature at a rate of 4.5 mW/oC.
2. Duration of output short circuit time should not exceed 10 ms.
3. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted
together. and pins 5, 6. 7 and 8 shorted together.
4. The tpLH propagation delay is measured from the 50% point on the
leading edge of the input pulse to the 1.3V point on the leading edge of
the output pulse. The tPHL propagation delay is measured from the 50%
point on the trailing edge of the input pulse to the 1.3V point on the
trailing edge of the output pulse.
When the peaking capacitor is omitted, propagation delay times may
increase by 100 ns.
6. CML is the maximum rate of rise of the common mode voltage that can
be sustained with the output voltage in the logic low state (Va < 0.8VI.
CMH is the maximum rate of fall of the common mode voltage that can
be sustained with the output voltage in the logic high state (Vo > 2.0VI.
7. This is a proof test. This rating is equally validated by a 2500'Vac. 1 sec.
test.
8. See Option 01,0 data sheet for more information.
5.
9-14
~---
-~~~~-~~~~--.-----.--
----
~---
VERY HIGH CMR, WU9E VCC
LOGIC GATE
OPTOCOUPLER
..
+~~ T
2
:I
3
I
I
H,§~L-2202
HCPL-2211
HCPL-2212
.
~ ~~
SCHEMATIC
I
HceL-2201
OUTLINE DRAWING
....----_----08 Vee
Va
VF
-
I
-1
___ I
1-
.,:.4---- 1.73 ( 070) MAX
L19 1-047) MAX
TRUTH TA91.S
~POSITIVE t.OGIC~
.. ,,_: __
HPCL-2201!11
~t0901
2:.80 Cno)
HCPL-2202!12
DIMENSIONS tN Mltl.lMHAES ANo (lNCHES).
Features
Description
• VERY HIGH COMMON MODE REJECTION,
5 KVJMsec AT 300 V GUARANTEED
(HCPL-2211/12)
The HCPL-2201/02/11/12 are single-channel, opticallycoupled logic gates. The detectors have totem pole output
stages and optical receiver input stages with built-in Schmitt
triggers to provide logic-compatible waveforms, eliminating
the need for additional waveshaping.
• WIDE Vcc RANGE (4.5 TO 20 VOLTS)
• 300 ns PROPAGATION DELAY GUARANTEED
OVER THE FULL TEMPERATURE RANGE
o 5 MBAUD TYPICAL DATA RATE
o LOW INPUT CURRENT (1.6 mA)
o TOTEM POLE OUTPUT (NO PULLUP
RESISTOR REQUIRED)
• GUARANTEED PERFORMANCE FROM
_40 0 C TO +85 0 C
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND 2500 Vac,
1 MINUTE (OPTION 010)
A superior internal shield on the HCPL-2211112 guarantees
common mode transient immunity of 5,000 V/Msec at a
common mode voltage of 300 volts.
The electrical and switching characteristics of the HCPL2201/02/11/12 are guaranteed from -400 C to +85 0 C and a
Vce from 4.5 volts to 20 volts. Low I F and wide Vee range
allow compatibility with TTL, LSTTL, and CMOS logic and
result in lower power consumption compared to other high
speed couplers. Logic signals are transmitted with a typical
propagation delay of 150 nsec.
Recommended operating
Conditions
Parameter
Applications
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• COMPUTER-PERIPHERAL INTERFACES
• MICROPROCESSOR SYSTEM INTERFACES
• PULSE TRANSFORMER REPLACEMENT
• HIGH SPEED LINE RECEIVER
Units
Power Supply Voltage
Vee
4.5
20
Forward Input Current
IF{ON)
2.2'
5
mA
VF(OFF)
-
0.8
Volts
Operating Temperatu
TA
-40
85
·C
Fan Out
N
4
TTL Loads
Forward Input ~
• GROUND LOOP ELIMINATION
Symbol Min. Max.
Volts
'2.2 mA condition includes an LED degradation guard band. Initial
switching threshold is 1.6 mA or less. See Figure 11.
9-15
Recommended Circuit Design
,-----.--0 i~J)
DATA
,I
OUTPUT
: i"~. . . .
:l. . . >.;;.~o
I
r-.,
+. .
16 LSTTL
LOADS
OR 4 TTL LOADS
i[........... -O
DATA
INPUT
I
I
r··.. .
L.1 "..:>--0
L-
Absolute Maximum Ratings
(No Derating Required up to 70°C)
Storage Temperature ................... -55°C to +125°C
Operating Temperature .................. -40°C to +85°C
Lead Solder Temperature ................. 260°C for 10 s
(1.6 mm below seating plane)
Average Forward Input Current-IF ............... 10 mA
Peak Transient Input Current-IF .................... 1 A
(:=;1 ,.,s Pulse Width, 300 pps)
Reverse Input Voltage .............................. 5 V
SupplyVoltage-Vcc ............... O.OV min., 20V max.
Output Voltage - Vo ............... -0.5 V min., 20 V max.
Total Package Power Dissipation - P ........... 210 mWI1)
Average Output Current -10 ..................... 25 mA
-0.1 ~F BYPASS
SEe NOTE 8
Figure 1. Recommended LSTTL to LSTTL Circuit
Electrical Characteristics .
-40°C:=; TA:S 85°C, 4.5 v:s Vce:S 20 V, 1.6 mA:S IF(ON):S 5 mA, OV:s VF(OFF):S 0.8 V, unless otherwise specified.
All Typicals at TA = 25°C.
Parameter
Symbol
LogiC Low Output Voltage
. VOL
Logic High Output Voltage
:VOH
OutPLit Leakage Current
(Vour:> Vccl
'
'., .:.
:",:
Logic !-Ugh SUPPlY· Current
leCH
Logic Low Sholj.DircUlt
Output Current ,>
idsl
.,
..OSH
'"
InPUt.Forward Voltage
.VF
Input'Rever$8 Bili'!akdown
Voltage
' ...
VR
InpulDiode Temperature
Ooefficlent
100
pA
Vo" 5.5V
500
pA
Vo" 20V
Vee "S.5V
2.4
4.0
Vee = 5,5V
2.7
5.0·
7,0
mA
mA
Vee =4.5V
IF=5mA
Vee = 20V
mA
Vo '" Vee'" 5,5 V
mA
Vo=Vec=20V
rnA
Vee = 5.5V
-20
mA
Vee::: 20V
1.5
1.70
'-
Vp=OV
2
II'''' SmA
Vo =GND.
2
Volts IF=SmA, TA=2S·0
5
Volts IR =10MA, TA '" 2S·C
5
' AVF
3,4,8
VF=OV
Vce= 20V
15 .
,~
Note
2,4
Ip"'SmA
Vge=4.5 V
20
mVl"C IF =SmA
-1.7
ATA
....
Inpilt-Outputlnsulatlon
IOH=-2,6mA
~ tmA
3.7
.
Figure
Volts IOL = 6.4 mA(4 TTL Loads)
IOH = ..().4mA
4.3
.
Units Test Conditions
Volts
.
,',
.
2.4
2.7
.
:
'.cCL
.'
0.5
"'.
Logic High Short Circuit
Output Current .
TYP· Max,
IOHH
LogloLoW Supply Current
,".
Min.
1
{I-O
p.A
IVr-o = 3000 VDe
""
. 3,6
Reletive Humidity = 45%
.. \ OPTION 010
'VISO
2500
min.
VRMS
Input~Dutput ReSistance
RI-O
1012
Input-Output Oapacitance
CI-O
0.6
pF
f'" 1 MHz, V.-o = OVDC
OIN
60
pF
f = 1 MHz. VI''' Ov,Plns 2 and 3
Input Capacitance
ohms VI'O '" 500 voe
9-16
7
3
3
switching Characteristics
-40°C:s TA:S 85°C, 45V:S Vee:S 20 V, 1.6mA:S IF(ON):S 5 mA,
OV:S VF(OFF):S 0.8V. All Typicals at TA " 25°C. Vee" 5V, IF(ON) " 3mA unless otherwise specified.
Symbol
Parameter
Typ,
Min,
Max.
Units
150
tpHL
Propagation Delay Time to
Logic High Output Level
tpLH
Output Rise Time (10-90%)
tr
30
ns
Output Fall Time (90-10~!o)
tf
7
nsi
90
ICMHI
Logic Low Common Mode
Transient Immunity
ICMLI
~
0.8
g
0, 7
I-
0,6
~
o
.J
~
0.5
0.4
...
0.3
~
0.2
~
~
vc:t .. 4.! v. .
v~
"' av
r-
-60 -40
Grins
Test Co'nditions
1,000
VII's !Vcml=50V
5,000
VII'S IVem 1= 300 V
1,000
VII's IVcml:c50V
5,000
Vlp.S IVcml=300V
40
5
2()~C
I
~
g
-,'
w
-5
:r
-6
~
"
l(j "'-2.6mA
f-
::>
~
1;o
I
o
>
;:
-7
10 "'SArnA.
o
o
100
TA - TEMPERATURE -
Figure 2. Typical Logic Low Output
Voltage va. Temperature
10
w
~
80
5
Vee'" 4,5 V
-3
::>
0
GO
10
VF =OV
Vee= 5 V
TA = 25°C
'fA"
-2
I
20
Note
>
1i
-20
Figure
IF" 1,6 mA
Vee ;'5 V
T A" 25°C
-1
~
l-
6,9
,
::>
-
4
,',
~
13
O. I
o
HCPL-2201
HCPL-2202
HCPL-2211
HCPL-2212
~
6, 7
6,9
~
10 • 6.4 mA-
4
With Peaking Capacitor
Min.
Logic High Common Mode
Transient Immunity
1
6.7
Without Peaking Capacitor
300
Device
O. 9
Note
With Peaking Capacitor
I"":
ns
f10
HCPL-2201
HCPL-2202
HCPL-2211
HCPL-2212
I
w
I;i{',
300
150
Symbol
>
Figure
Without Peaking Capacitor
Propagation Delay Time to
Logic Low Output L!i'V!i'1
Parameter
Test Conditions
1.0
0,5
°c
1.5
IF - INPUT CURRENT - rnA
Figure 4. Output Voltage VB. Forward
Input Current
Figure 3. Typical Logic High Output
Current va. Temperature
PULSE
GENERATOR
Vee
5V
250
D,
D,
~
I
IS US-EI),
>
see
0:
RI
2.15 Kn
1.10 Kn
681 n
IF (ON)
1.6 rnA
3 rnA
5 rnA
"z
>=
"";t
ALL DIODES ARE 1N916 OR 1N3064
~
-::.- THE PROBE AND JIG CAPACITANCES
::>
"
~
ARE INCI.UDED IN C, AND C2.
i
I
(NPUT IF
OUTPUT
Vo
VF - FORWARD VOL lAGE - VOLTS
Figure 5. Typical Input Diode Forward
Characteristic
d. ------: -
- - - I F (ONi
-)50% IF(ONI
~,~r-=vo~rnA
~---------~VOL.
·0.1 jJF BYPASS
SEE NOTE 8
0
(mAl
FIGURE G.
200
'/
~
ffi
0:
t,
Vet;'e"
50
-60
V V
40
-20
.-:::: ~ ,./
/
,./ V
20
V
40
/
60
•
21.6
1.S-
6
SO
100
TA - TEMPERATURE _·C
Figure 6. Circuit for tpLH, tpHL, t r , tf
9-17
Figure 7. Typical Propagation Delays
Temperature
VB.
20
>
.
I
to.
~ ·1 5
g
~
o
.
100
n'PICA~
VQtI tJ$. Vee
AT lo ""-2.6 mA
T,p,
-as"c
10
-'
V
/
~
:z:
";:
/
'/
/
,..;::
0
-'
~
ili'
00
10
15
o
Vee - SUPPLY VOLTAGE,- V
1.0
.§
IIcc
IFIO~
0
~
'"
0.8
:z:
ff-
ffi
'"::>'"
"~
f-
0.7
0.•
~
r
SWITCH AT A: I, .. 1.6 rnA
VOH~
OUTPUT
'f
20
SWITCH AT B: V F = 0 V
vo~
40
60
80
Figure 9. Typical Rise, Fall Time vs.
Temperature
100
VOL
• SEE NOTE 5, 8
Figure 10. Test Circuit for Common Mode
Transient Immunity and Typical
Waveforms
~/
l5.Q
0.•
13
-VCMPEAK
OV
TA - TEMPERATURE _ °C
Figure 8. Typical LogiC High Output Voltage vs.
Supply Voltage
;;
-
-60 -40 -20
20
IVeMI .~
.
.
.. ~-
I
%
~
I
0
a:
,/
I
Joe .Jv
80
f
~
<"(OFF!
~
0.5
-60 -:-40
-20
20
40
60
80
100
Flgur!! 11. Typical Input Threshold Current vs.
Temperature
Figure 12. LSTTL to CMOS Interlace Circuit
Figure 13. Alternative LED Drive Circuit
Figure 14. Series LED Drive with Open Collector Gate
(6.04 KG Resistor Shunts IOH from the LED)
Notes:
1. Derate 10tal package power dissipation, P, linearly above 70°C
free air temperature at a rate of 4.5 mW/oC.
2. Duration of output short circuit time should not exceed 10 ms.
3. Device considered a two terminal device: pins 1, 2, 3 and 4
shorted together, and pins 5, 6; 7 and S shorted together.
4. The tpLH propagation delay is measured from the 50% point
on the leading edge of the input pulse to the 1.3 V point on the
leading edge of the output pulse. The tpHL propagation delay
is measured from the 50% point on the trailing edge of the
input pulse to the .1.3 V point on the trailing edge of the output
pulse:
5. CML is the maximum slew rate of the common mode voltage
that can be sustained with the output voltage in the logic low
state. Vo < O.SV. CMH is the maximum slew rate of the
common mode voltage that can be sustained with the output
voltage in the logic high state Vo > 2.0 V.
6. This is a proof test to validate the UL 220 Vac rating. This
rating is equally validated by a 2500 Vac 1 sec· test.
7. See Option 010 data sheet for more information.
S. For HCPL-2202/12, Vo is on pin 6
9-18
VERY HIGH CMR, WIDE Vee
DUAL LOGIC GAlE
HCPL-2231
HCPL-2232
OPlQ~QUPLER
SCHEMATIC
OUTLINE DRAWING
~ .....-...1
II-~
9.90 (,300)
I"
+v):
-!
5
-J
DAfE CODE
4
+
~
~
_!
6Ta (Xci
l I
-------==_
PIN1riT,,...,..,,,..,r.;-r-r:;T.J RECOGNITIQN
ONEIl
T
6.10 \.24OJ
],36lJ2Qi
7.88 (:JTOI
UL
L.-_ _+--_...,...---'
3
v"
!
1
!+---.-1,7S{,070lMAX
............... 1,191-0411 MAX
.......!I
1
.----~====- •
I
.-"'-~CJ....J'-"-'-""-"'-iTYPE NUMSER
---I
2
{Ita 1.007)
rn
(]'fJJ
I
--I
---I
I
I
I
L--==-~---+----+---<>GND
Features
Description
.. VERY HIGH COMMON MODE REJECTION
5 KVJtlsec AT 300 V GUARANTEED (HCPL-2232)
The HCPL-2231/2 are dual-channel, optically-coupled logic
gates. The detectors have totem pole output stages and
optical receiver input stages with built-in Schmitt triggers
to provide logic compatible waveforms, eliminating the
need for additional waveshaping.
.. WIDE Vcc RANGE (4.5 TO 20 VOLTS)
.. 300 ns PROPAGATION DELAY GUARANTEED
OVER THE FULL TEMPERATURE RANGE
.. 5 MBAUD TYPICAL DATA RATE
.. LOW INPUT CURRENT (1.8 rnA)
.. TOTEM POLE OUTPUT (NO PULLUP
RESISTOR REQUIRED)
.. GUARANTEED PERFORMANCE FROM
-40°C TO +85°C
.. RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010)
.. HCPL-5230/1 COMPATIBILITY
A superior internal shield on the HCPL-2232 guarantees
common mode transient immunity of 5,000 V/!,sec at a
common mode voltage of 300 volts.
The electrical and switching characteristics of the HCPL223112 are guaranteed from -40°C to +85°C and a Vee from
4.5 volts to 20 volts. Low I F and wide Vee range allow
compatibility with TTL, LSTTL, and CMOS logic and result
in lower power consumption compared to other high speed
couplers. Logic Signals are transmitted with a typical
propagation delay of 150 nsec.
Recommended operating
Conditions
Parameter
Applications
Power Supply Voltage
.. ISOLATION OF HIGH SPEED LOGIC SYSTEMS
Input Current (High)
.. COMPUTER-PERIPHERAL INTERFACES
.. GROUND LOOP ELIMINATION
.. PULSE TRANSFORMER REPLACEMENT
.. HIGH SPEED LINE RECEIVER
Min. Max.
Units
Vee
4.5
20
Volts
IF (ON)
2.5'
5
rnA
Volts
VF(OFF)
-
0.8
Operating Temperature
TA
-40
85
°C
Fan Out per Channel
N
4
TTL Loads
Input Voltage {Low)
.. MICROPROCESSOR SYSTEM INTERFACES
Symbol
'2.5 mA condition includes an LED degradation guardband. Initial
switching threshold is 1.8 mA or less. See Figure 12.
9-19
Absolute Maximum Ratings
Recommended Circuit Design
CHANNEL ONE SHOWN
Storage Temperature ., ................. -55°C to +125°C
Operating Temperature .................. -40°C to +B5°C
Lead Solder Temperature ................. 260°C for 10 s
(1.6 mm below seating plane)
Average Forward Input Current-IF ............. 10 mAPI
Peak Transient Input Current-IF .................. 1 API
(51 ,..s Pulse Width, 300 pps)
Reverse Input Voltage ............................ 5 VI11
Supply Voltage - Vee ............... 0.0 V min., 20 V max.
OutputVoltage-Vo ............. -0.5V min., 20V max.PI
Total Package Power Dissipation ................. 294 mW
Output Power Dissipation - Po per Channel ........ Fig. B
Average Output Current-I o per Channel ......... 25 mA
r----.()~~~l
DATA
OUTPUT
~ ..r""~",,>-O
: i. . . . . .
UP TO 16 LSTTL
I.
I I .........
LOADS
OR 4 TTL LOADS
H
DATA
INPUT
I
-;"-.()
t...........
PER
CHANNEL
: r. . . .
L-i
:;~~o
l......f
*0.1 pF BYPASS
Figure 1. Recommended LSTTL to LSTTL Circuit
Electrical Characteristics
-40°C 5 TA 5 B5°C, 4.5 V 5 Vee 5 20 V, I.B mA 5 I F(ON) 5 5 mA, 0 V 5 VF (OFF) 5 O.B V, unless otherwise specified.
All Typicals at TA " 25°C.
Symbol
Parameter
Logic Low Output Voltage
VOL
Logic High Output Voltage
VOH
Output Leakage Current
(VOUT> Vecl
IOHH
Logic Low Supply Current
lecL
Logic High Supply Current
loSL
Logic High Short Circuit
Output Current
laSH
VF
Input Reverse Breakdown
Voltage
VR
Input Diode Temperature
Coefficient
AVr:
-ATA
OPTION010
'TYP·
0.5
Units Test Conditions
Volts IOL ~ SAmA (4 TTL Loads)
Volts
'oH"-2.6mA
IOH"'-o·4mA
100
/lA
Va" 5.5V
500
,..A
Vo
7.4
12.0
mA
Vee" 5.5V
8.6
14.0
mA
Vee" 'l0V
4.B
8.0
mA
Vee" 5.5V
SA
10.0
mA
Vee'" 'l0V
15
mA
Va =Vee" 5.5V
20
mA
Va" Vee" 'l0V
='20 V
~=5.5V
=
-10
Input Forward Voltage
I
Max.
m
lecH
Logic Low Short Circuit
Output Current
Input-Output Insulation
Min.
-20
m
t5
1.7
Volts
"'l0V
Vee =4.5 V
-1.7
Note
2,4
1
3,4.9
1
IF=5mA
Vee" 4.5 V
1
VF"'OV
IF"5mA
VF=OV
1,2
IF'" 5mA
Vo"GND
1, '2
IF=5mA,TA "25"C
Volts IR" 10/lA, TA" 25°C
5
Figure
5
1
1
mVI"C IF"5mA
1
'1-0
2500
p.A
VI-O " 3000 VDC
TA '" 25°C, t " 5 s
Relative Humidity" 45%
3,6
VRMS RH 5 50%, t '" 1 min,
7
ohms VI-O '" 500 VDC
3
Input-Output Resistance
VISO
RI_o
I nput-Output Capacitance
CI-O
0.6
pF
f" 1 MHz. V'-o" OVDC
3
Input Capacitance
C IN
60
pF
f" 1 MHz. VF" 0 V
1
,..A
Relative Humidity" 45%
t"5s, VI-!" 500V
8
1012
•
I nput-lnput Insulation
Leakage Current
IH
0.005
Resistance (Input·lnput)
RI_ 1
1011
n
VI-! =500 V
8
Capacitance (Input-Input)
CI_1
0.25
pF
f'" 1 MHz
8
9-20
---------.------
Switching Characteristics
-40°C :STA:S 85°C, 4.5V:S Vee:S 20 V, 1.8mA:S IF(ON):S 5mA,
O:S VF(OFF):S 0.8 V. All Typicals at TA = 25°C, Vee = 5 V, IF(ON) = 3 mA unless otherwise specified.
Parameter
Symbol
Propagation Delay Time 10
Logic Low Output Level
tpHL
110
Without pe3f
I
w
VQ'"2.1V
5
0.3
~
'"
Note
Ir
0.5
~
With Peaking C~
300
Figure
Output Fall Time (90-10%)
::0
~
Without Peaking Capacitor
Output Rise Time (10-90%)
....
0
Test Conditions
ns
150
w
g
Units
tpLH
Logic Low Common Mode
ICMLl
Transient Immunity
'~"
Max.
150
Logic High Common Mode
ICMHI
Transient Immunity
I
Typ.
Propagation Delay Time to
Logic High Output Level
Parameter
>
J. . . In.
80
0~0------~0~5------~1~.0~----~'.5
100
°c
IF - INPUT CURRENT - mA
Figure 3. Typical Logic High Output
Current vs. Temperature
Figure 4. Output Voltage vs. Forward
Input Current
PULSE
GENERATOR
1
I
ffi0:
0:
iJ
o
100
0f!j
10
o~
~ ,zot;/or r-[}
/
~
D,
T.
0,
D,
0.0
":"
/V'
~
I
'~
1/
./ "
r
1.20
IF (ON)
INPUT IF
1.30
.,
THE PROBE AND JIG CAPACITANCES ARE
INCLUDED IN CLAND Cz
1,96 Kn 1.10 Kn
1.8mA
3mA
6am
5mA
ALL DIODES ARE 1N916 OR 1N3064
0.00
1.10
1.40
1.50
VF - fOR'WARD VOLTAGE - VOLTS
,
2
~
200
C
2
.0
iit .1
~
250
OUTPUT
Vo
-d ------
- __ IF (ONI
0
~
150
'~"
..,
if
100
~50% IFIONJ
---I
~r-=vo: mA
----1'---------\.1=i.VOL
TA - TEMPERATURE _ °c
Note: Channel one shown.
Figure 5. Typical Input Diode Forward
Characteristic
Figure 6. Circuit for tpLH. tpHL, tr• tf
9-21
Figure l
Typical Propagation Delays vs.
Temperature
20
80
100
>
TYPICAL
vat!
~
1!
T"'~
~
~
"0
""
"X
40
""
20
~
10
-\;,::
/
Vee
15
/
tA; =- 2S'C
\80 C
\,
10
\\
15
\1$.
Ai to'" -.til mA
TA .. i5 (;
60
f<
/
V
/
60
0
,V
$
20
10
15
20
Vee - SUPPLY VOLTAGE - V
Vee - SUPPLY VOL.TAGE - V
Figure 8. Maximum Output Power per
Channel vs. Supply Voltage
"'"t-}-
80
Figure 9. Typical Logic High Output
Voltage vs. Supply Voltage
20
o
t, _
-
-60 -40
20
,."
tj
20
40
TA - TEMPERATURE _
60
80
100
cc
Figure 10. Typical Rise, Fall Time vs.
Temperature
Vee
1.0
Vee
0.9
1,,1~ ~
o. 8
-vcmpEAK
~
VCM
L~
o. 7
~
OV
SWITCH AT A: IF = 1.8 mA
VOH~
°llTPUT
fl
I. 5..1
0.6
~(OFF!
V
SWITCH AT B: VF " OV
VO~
VOL
0.5
-60
-40
·SEE NOTE 5
-20
20
40
60
80
TA - TEMPERATURE _ °C
Figure 11. Test Circuit for Common
Mode Transient Immunity
and Typical Waveforms
100
NOTE: CHANNEL ONE SHOWN
NOTE: CHANNEL ONE SHOWN
Figure 12. Typical Input Threshold
Current vs. Temperature
Figure 13. LSTTL to CMOS Interface Circuit
Vee
I.. VI
DATA
INPUT
NOTE: CHANNEL ONE SHOWN
Figure 14. Alternate LED Drive Circuit
Figure 15. Series LED Drive with Open Collector Gate
(6.04 KO Resistor Shunts IOH from the LED)
Notes:
1. Each channel.
2. Duration of output short circuit time should not exceed 10 ms.
3. Device considered a two terminal device: pins 1. 2. 3 and 4
shorted together. and pins 5. 6. 7 and 8 shorted together.
4. The tpLH propagation delay is measured from the 50% point
on the leading edge of the input pulse to the 1.3 V point on the
leading edge of the output pulse. The tpHL propagation delay
is measured from the 50% point on the trailing edge of the
input pulse to the 1.3 V point on the trailing edge of the output
pulse.
5. CML is the maximum slew rate of the common mode voltage
that can be sustained with the output voltage in the logic low
state. Va < 0.8 V. CMH is the maximum slew rate of the
common mode voltage that can be sustained with the output
voltage in the logic high state Va > 2.0 V.
6. This is a proof test to validate the UL 220 Vac rating. This
rating is equally validated by a 2500 Vac 1 sec test.
7. See Option 010 data sheet for more information.
8. Measured between pins 1 and 2. shorted together. and pins 3
and 4. shorted tog.ether.
9-22
Flio-
LOW INPUT CURRENT
HIGH SPEED
QPTQCQUPLER
HEWLETT
~~ PACKARO
OUTLINE DRAWING
...-ICC
r-~----O
1000 n
Vee
.--
.-----===1.1
8
6.10~
I
~:
VFJ-?I
3
SHIELD
HCPL-2300
6.60 (0.2601
'.36~L'
7.66 (0.310)
•\-r.I"""r',.,..,.."...,..-,-J UL RECOGNITION
/'---_----~ GND
---r
I
5
A 0.01 TO 0.1 ,uF BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
TRUTH TABLE
PINS 8 AND 5. (SEE NOTE 1).
(POSITIVE lOGIC)
t
!!:1!~
0.33 (0.(1131
sQTVP•
-,
. . -'~'==_ r
DIMENSIONS IN MILLIMETRES AND (INCHES)
4.10 (0.185) MAX.
I
I
I
II
t
~O.51MIN.
(0.0201
. 2.92 lO.llO1 MIN.
, - 1+-0.66 (0.025) MAX.
Figure 1. Schematic
!-o+ ~:: :~:~~~:
Features
Description
• GUARANTEED LOW THRESHOLDS: IF = 0.5 rnA,
VF :S1.5V
The HCPL-2300 optocoupler combines an 820 nm AIGaAs
photon emitting diode with an integrated high gain photon
detector. This combination of Hewlett-Packard designed
and manufactured semiconductor devices brings high
performance capabilities to designers of isloted logic and
data communication circuits.
• HIGH SPEED: GUARANTEED 5 MBd OVER
TEMPERATURE
• VERSATILE: COMPATIBLE WITH TTL, LSTTL AND
CMOS
•
MORE EFFICIENT 820 nrn AIGaAs IRED
The low current, high speed AIGaAs emitter manufactured
with a unique diffused junction, has the virtue of fast rise
and fall ties at low drive currents. The HCPL-2300 has a
typical propagation delay of 120 ns at 0.5 mA forward
current. With special selection, the device can achieve 80
ns propagation delay at 150 IJ.A. Figure 6 illustrates the
propagation delay vs. input current characteristic. These
unique characteristics enable this device to be used in an
RS-232-C interface with ground loop isolation and improved
common mode rejection. As a line receiver, the HCPL-2300
will operate over longer line lengths for a given data rate
because of lower IF and VF speCifications.
• INTERNAL SHIELD FOR GUARANTEED COMMON
MODE REJECTION
• SCHOTTKY CLAMPED, OPEN COLLECTOR
OUTPUT WITH OPTIONAL INTEGRATED PULL-UP
RESISTOR
• STATIC AND DYNAMIC PERFORMANCE
GUARANTEED FROM -40° C to 85° C
• SPECIAL SELECTION FOR LOW FORWARD
CURRENT APPLICATIONS (IF ~ 150 IJ.A)
•
RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
The output of the shielded integrated detector circuit is an
open collector Schottky clamped transistor. The shield,
which shunts capacitively coupled common mode noise to
ground, provides a guaranteed transient immunity specification of 100 V/lJ.s. The output circuit includes an optional
integrated 1000 Ohm pull-up resistor for the open collector. This gives designers the flexibility to use the internal
resistor for pull-up to five volt logic or to use an external
resistor for 18 volt CMOS logic.
Applications
•
GROUND LOOP ELIMINATION
•
COMPUTER-PERIPHERAL INTERFACES
•
LEVEL SHIFTING
•
MICROPROCESSOR SYSTEM INTERFACES
•
DIGITAL ISOLATION FOR AID, D/A CONVERSION
•
RS-232-C INTERFACE
•
HIGH SPEED, LONG DISTANCE ISOLATED LINE
RECEIVER
The Electrical and Switching Characteristics of the HCPL2300 are guaranteed over a temperature range of -40° C to
85° C. This data sheet will allow users of the HCPL-2300 to
confidently implement all necessary static and dynamic
performance requirements which may be subjected to a
broad range of operating environments.
9-23
Recommended operating
Conditions
Max. Units
0.8
1.0
0.75
Supply Voltage, Output
Fan Out (TTL Load)
V
mA
V
Vee 4.75 5.25
5
N
Operating Temperature
TA
-40
85
'C
VF - FORWARD VOLTAGE - VOLTS
Figure 2. Typical Input Diode Forward Characteristic.
Absolute Maximum Ratings
(No derating required)
Symbol
Min.
T8
·55
Max.
125
Units
Storage Temperature
Parameter
Operating Temperature
TA
-40
85
·C
Lead Solder Temperature
Reference
'c
260·C for 10 s. (1.6 mm below seating plane)
Average Forward Input Current
IF
5
Reverse Input Voltage
VR
4.5
mA
V
Supply Voltage
Vee
0.0
7.0
V
Pull-up Resistor Voltage
VRL
-0.5
Output Collector Current
10
·25
Vee
25
mA
V
Input Power Dissipation
PI
10
mW
Output Collector Power Dissipation
Po
40
mW
Output Collector Voltage
Vo
18
V
-0.5
See Note 2
Electrical Characteristics
For -40'C::;; TA::;; 85'C, 4.75 V::;; Vee::;; 5.25 V, VFL::;; 0.8 V, unless otherwise specified.
All typicals at TA = 25' C, Vcc"= 5 V, unless otherwise specified.
Parameter'
Symbol
Min.
TYP'~
Units
jJ.A
Test Conditions
High Level Output Current
10H
Low Level Output Voltage
VOl..
0.4
High Level Supply Current
teCH
4.0
6,$
mA
IF "" a mA, Voe = 5.25 V
Low Level Supply Current
leoL
6,2
10,0
mA
IF= 1.0 mA,
1.3
1,5
Input Forward Voltage
VF
Input Diode Temperature
Coefficient
AVF
ATA
Input Rellet'$e Breakdown
Voltage
BVR
Input Capacitance
I
1.0
Ii-o
J OPT010
ReSistance (Input-outputJ
RI-O,
Capacitance (Input-Outputl
01.0
0,5
-1.6
18
1
2500
RL
1012
1000
V
1700
VF '" 0.8 V, Vo = 18 V
IF "'0.5 mA
10L (Sinking) ... 8 mA
IF"" 1.0 mA, TA "" 25'C
III = 10 SlA, TA = 25·0
pF
VF=OV. f= 1 MH:z.
SlA
45% RH. t = 5s.
n
VI-o '" 500 V
f=1 MHz
~3kVdC,TA':"25.C
VRMS
0% t "" 1 MiN
Ohms
Figure Note
4
3
2
IF"" 1.0 mA
V
pF
0.6
680
V
mVI"C
4.5
CII~
Input-Output Insulation
Internal Pull-up Resistor .
0.05
TA",25"C
r
3,9
10
8
t±
Switching Characteristics
For -40° C:5 TA:5 85° C, 0.5 mA:5 IFH:5 0.75 rnA;
For 0° C :5 TA:5 85° C, 0.5 rnA :5 IFH:5 1.0 rnA; With 4.75 V:5 VCC :5 5.25 V, VFL :5 0.8 V, unless otherwise specified.
All typicals at TA = 25°C, Vcc = 5 V, IFH = 0.625 rnA, unless otherwise specified.
S.6bl
r
Propagation
y Ti"1~ to
Logic High Output Leve~
Min.
illlt1alt.
Typ.
1!ILillLH
"
stY 5,6,8
C!;!i20 pF
110
Propagation Delay Time to
Logic Low Output Level
IPHL
Output Rise Time (10-90%)
If
40
ns
Outpul Fall Time (90-10%1
If
20
ns
ns
200
35
Cp1d!pF
ns
160
85
Figure I J\fote
T~~t9on
Units
e5
5,8
f
Cp=ofpF
5,6,8
CP '" 20 pF
5,8
CP"" 20 pF
4'b
5,8
7,8
8
Common Mode
Transient Immunity
at High Output Level
ICMHI
100
400
Vips
VCM = 50 V (peak),
Vo (m~n.) = 2 V,
RL = ~on, IF "" 0 rnA
9, 10
6
Common Mode
Transient Immunity
at Low Output Level
ICMLI
100
400
Vips
VCM '" 50 V (peak),
V,O (max,) = 0.8 V,
RL '" ~~60n. IF = 0.5 mA
9, 10
7
(See page 5-35 for Notes)
>
r" ~-4O'C'-,
I
w
~
tIf$$oa:
AI..
~
/:Ac
~
~
I
100
o
r-----
is
~
~
~
,!-
I
50
I
\
200
300
400
sao
-40
a
-20
i"""'"
Figure 3. Typical Output Voltage VS.
Forward Input Current vs.
Temperature.
~
........
_
F
,,0C
....
-~ ~ ~
-60
- -- -40
-20
0
I---
20
40
60
ao
A
100
TA - TEMPERATURE _ °C
TA - TEMPERATURE _·C
IF - FORWARD INPUT CURRENT -p,A
-~
,..8
;;E
~..,
8:~
100
V"c~5 If
Rl."'560n
Cl" 15~F
>
T" =25"C
g
150
V""~5V
'\
Figure 4. Typical Logic High Output
Current vs. Temperature.
tPHL {
A {-O.5 rnA TO 1.0 rnA, Cp .. 20 pF
- -0.5 rnA TO 0.75 rnA. Cp" 20 pF
B
-Q,5mA,Cp"OpF
C -1.0mA,Cp=OpF
15
tpLH {
1'",,=51'
l'I,·5son
C, -15.F
D r-O.5 rnA TO 1.0 rnA, Cp .. 20 pF
-0.5 rnA TO 0.76 rnA. Cp" 20 pF
E -O.5mA,Cp"OpF
F -1.0mA, Cp. OpF
1-
Cp*'20pF
>
300
w
~
,.
>=
c
::l
:i!
z
0
~
"0f
g:
200
..
::-
100
,!-
0.' 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
IF - FORWARD INPUT CURRENT - mA
Figure 6. Typical Propagation Delay VB.
Forward Current.
25
o
-60
t,
.......
V
-
ill'
a:r
-
so
i-"
Figure 5. Typical Propagation Delay VS.
Temperature and Forward
Current With and Without
Application 01 a Peaking
Capacitor.
,....
tf
V
,
-40
-20
20
40
60
80
TA - TEMPERATURE _ °C
Figure 7. Typical Rise, Fall Time vs.
Temperature.
9-25
100
PUlse
GeNERATOR
...>-
Z
+5 V
.,""...
560 S2
OUTPUT Vo
CL"
iii
MONITOR
NODE
u;
z
5V SWITCH AT A: VF '" 0 V
OUTPUT Vo
MONITORING
NODE
r-
'------"
CM
H
SWITCH AT B: IF '" 0.5 rnA
Vo 0.5 V
f\- -
Vo IMAX.I"
*SEE NOTES 6, 7.
Figure 10. Test Circuit for Common Mode Transient Immunity and Typical Waveforms.
Applications
The HCPL-2300 optocoupler has the unique combination
of low 0.5 mA LED operating drive current at a 5 MBd
speed performance. Low power supply current requirement of 10 mA maximum and the ability to provide
isolation between logic systems fulfills numerous applications ranging from logic level translations, line receiver
and party line receiver applications, microprocessor 1/0
port isolation, etc. The open collector output allows for
wired-OR arrangement. Specific interface circuits are illustrated in Figures 11 through 18 with corresponding
component values, performance data and recommended
layout.
For -40° C to 85° C operating temperature range, a mid
range LED forward current (IF) of 0.625 mA is recommended in order to prevent overdriving the integrated
circuit detector due to increased LED efficfency at
temperatures between 0° C and -40° C. For narrower
temperature range of 0° C to 85° C, a suggested operating
LED current of 0.75 mA is recommended for the mid range
operating point and for minimal propagation delay skew: A
peaking capacitance of 20 pF in parallel with the current
limiting resistor for the LED shortens tPHL by approximately 33% and tPLH by 13%. Maintaining LED forward
voltage (VF) below 0.8 V will guarantee that the HCPL-2300
output is off.
The recommended shunt drive technique for TTULSTTU
CMOS of Figure 11 provides for optimal speed performance, no leakage current path through the LED, and
reduced common mode influences associated with series
switching of a "floating" LED. Alternate series drive tec-
9-26
niques with either an active CMOS inverter or an open
collector TTL/LSTTL inverter are illustrated in Figures 12
and 13 respectively. Open collector leakage current of 250
p.A has been compensated by the 3.16K Ohms resistor
(Figure 13) at the expense of twice the operating forward
current.
An application of the HCPL-2300 as an unbalanced line
receiver for use in long line twisted wire pair communicac
tion links is shown in Figure 14. Low LED IF and VF allow
longer line length, higher speed and multiple stations on
the line in comparison to higher IF, VF optocouplers.
Greater speed performance along with nearly infinite
common mode immunity are achieved via the balanced
split phase circuit of Figure 15. Basic balanced (differential) line receiver can be accomplished with one
HCPL-2300 in Figure 15, but with a typical 400 V/p.s common mode immunity. Data rate versus distance for both
the above unbalanced and balanced line receiver applications are compared in Figure 16. The RS-232-C interface
circuit of Figure 17 provides guaranteed minimum common mode immunity of 100 V/p.s while maintaining the 2:1
dynamic range of IF.
A recommended layout for use with an internal 1000
Ohms resistor or an external pullcup resistor and required
Vee bypass capaCitor is given in Figure 18. Veel is used
with an external pull-up resistor for output voltage levels
(VOl greater than or equal to 5 V. As illustrated in Figure
18, an optional Vee and GND trace can be located
between the input and the output leads of the HCPL-2300
to provide additional noise immunity at the compromise of
insulation capability (VI-OI.
OUTPUT
INPUT
r----------,
HCPL-2300
Vee, ---.----If---~-_,
r---~_¢~--~--5V
I
I
·20 pF :
V,N
I
Vo
~-~--~~=_-_4~----t_-~---GN02
R,
k.Il
?Jfd~
15
RL
kll
VCC2
Vae
6.19
1
(INTERNALI
5
14.7
2.37
10
21.5
3.16
15
'SCHOTTKY DIODE (HP 5082·2800. OR EQUIVALENT) AND 20 pF CAPACITOR
ARE NQT REQUIRED FQR UNITS WITH OPEN COLLECTOR OUTPUT.
Figure 11. Recommended Shunt Drive Circuit lor Interlacing Between TTL/LSTTLICMOS Logic Systems •.
HCPL-2300
OUTPUT
r----------,
INPUT
5V
I
Vaa
I
OUTPUT
)
I
I
5 V
HCPL-2300
r - - - - - - -...,
INPUT
--,---+-----,
V,N
GND 1
v,,,
lIoa
lIoe
Vae
RI
kll
5.11
5
AL
kll
Vee
Voe
5
1
IINTERNALl
10
15
TO
1:1.3
237
10
16
19.6
3.16
15
Figure 12. Active CMOS Series Drive Circuit.
Figure 13. Series Drive Irom Open Collector TTLILSTTL Units.
I~~~I
DRIVER
+12 V ----~=-,
5V
VIN
I"Lo v
/ ./ l!l--r----,
/// ~
I / I /
.
I /
I
I /
I /
/
/
/
r----------,
HCPL-2300
I
-12 V
0.1.uF
, -__~~r8~--~--~--~---5V
I
20 pF
I
I
2I
Vo
GND1-+_~~--~
.. \ 1
INPUT
L---~----~~----+_--f_--+----GND2
I
LINE
·OTHER DEVICES: MC3488A/B
TI-pA9636A.
** MAY BE REQUIRED ON OLDER VERSIONS OF pA9636A.
"·SCHOTTKY DIODe (HP 5082-2800, OR eQUIVALENT).
REFERENCE FIGURE 16 FOR DATA RATE VS. L!NE DISTANCE L.
Figure 14. Application 01 HCPL-2300 as Isolated, Unbalanced Line Receiver(s) •.
9-27
INPUT
HCPL-2300
.~
,
r----------,
20 pF
I
I
I
I
~A9638*
I
Va
I
LINE
GND 1
.OTHER DEVICE: TI-IJA963BA
REFERENCE FIGURE 17 FOR DATA RATE
vs. LINE DISTANCE L.
FOR LESS SEVERE COMMON MODE INTERFERENCE ENVIRONMENTS,
ONE HCPL-2300 OPTOCOUPLER WITH NO EXCLUSIVE -OR FLIP FLOP
CIRCUIT CAN BE USED FOR BALANCED LINE RECEIVER APPLICATIONS.
Vo = VIN.
Figure 16. Application of Two HCPL-2300 Units Operating as an Isolated, High Speed, Balanced, Split Phase Line Receiver with
Significantly Enhanced Common Mode Immunity.
10% PULSE WIO,H DISTORTION
22 Awn UNSHieLDED TWISTEQ
PAIR WIRE CAlllE
r:=::~~(O;,;E;;:A~R;a::::joRN NO. 8622(5)
Ie
HCPL-2300
~S-232-C
TA ·2S'C
SIGNAL
3 v - 25 V
-3V--25V
7.15K
r ----------, B
I
.
5V
I
I
I
I
Va
n
GND
, OK ~,---'-:':,o:--:-,!'!o"'o-'-~-'!,""oo::o,.......JJ-!',O~.OOO
L -
Figure 18. RS-232-C Interface Circuit with HCPL-2300.
ODC < TA < 85 DC.
LINE lENGTH - METRES
Figure 17. Typical Point to Point Data Rate vs. Length of Line
for Unbalanced (Figure 15) and Balanced
(Figure 16) Line Receivers using HCPL-2300
Optocouplers.
/ GND BUS (BACK)
(OPTIONAL)
______ ..1'_
N.C.
N.C.ar.==T1idh~~
N.C.
""1.---'l-f"'~
Va
0_
*SEE NOTE 1
NOTES:
1. Bypassing of the power supply line is required with a 0.01 ~F
ceramic disc capacitor adjacent to each optocQupler as illustrated in
Figure 19. The power supply bus for the optocoupler(s) should be
separate from the bus for any active loads, otherwise a larger value
.of bypass capacitor {up to 0.1 J,tFl may be needed to suppress regen·
erative feedback via the power supply.
2. Peaking circuits may produce transient input currents up to 100 rnA,
500 ns maximum pulse width, provided average current does not
exceed 5 rnA.
3. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted
together, and pins 5, 6, 7 and 8 shorted together.
4. The tPLH propagation delay is measured from the 50% point on the
trailing edge of the input pulse to the 1.5 V point on the trailing edge
of the output pulse.
5. The tPHL propagation' delay is measured from the, 50% paint on the
leading edge of the input pulse to the 1.5 V point on the leading edge
of the output pulse.
6. CMH is the maximum tolerable rate of rise of the common mode vol·
tage to assure that the output will remain in a high logic state (Le.,
VOUT > 2.0 VI.
7. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e.,
VOUT < 0.8 VI.
8. Cp is the peaking capacitance. Refer to test circuit in Figure 9.
9. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec.
test.
10. See Option 010 data sheet for more information
Figure 19. Recommended Printed Circuit Board Layout.
9-28
~~--
---------
Flidl
-
..
~--
----- -
--
---------.- ..
HEWLETT
~~ PACKARD
-~---~
-.-------~---------------
20 M BAUD HIGH CMR
LOGIC GATE
OPTOCOUPLER
HCPL-2400
HCPL-2411
OUTLII~E DRAWING
SCHEMATIC
r-~~~_-~I"'CC'--o8 Vee
0.1. (,(>!ill
ANODE
-.
ij]J(;Oj3)-:i
2 1;-
VF~1
CATHODE~
5
TRUTH TABLE
T
TYPE NUMBER
DATE
'--~~~~~--<>
GND
(POSITIVE LOGIC)
PI
7.36 ~2jJql
J.B1j {310)
Ul
N 1
2
ONEil
_
CODE
3
-I
4f--
4
RECOGNITION
I
6.10~
if.6lI ,.2601
t
I
L
S'
L...--==-":=:JE~=::;::::='-
1-1.781.0701 MAx.
1.19{.041}MAX.
,.
DIMENSIONS IN MILlIMETRES AND (lNC~ESi
Features
• HIGH SPEED: 40 MBd TYPICAL DATA RATE
• HIGH COMMON MODE REJECTION
I -.-....
• HCPL-2400 = 50 VCM
o
HCPL-2411 = 300 VCM
o
AC PERFORMANCE GUARANTEED OVER
TEMPERATURE
II
1_ _
2.921.1151 MIN.
f--0,65 (.025) MAX.
~
1- 2.80 10901
(.1101
Description
The HCPL-2400/11 high speed optocouplers combine an
820 nm AIGaAs photon emitting diode with a high speed
photon detector. This combination results in very high
data rate capability and low input current. The three state
output eliminates the need for a pull-up resistor and allows
for direct drive of data buses. The hysteresis provides typically 0.25 mA of differential mode noise immunity and
minimizes the potential for output signal chatter. Improved
power supply rejection minimizes the need for special
power supply bypassing precautions.
• COMPATIBLE WITH TTL, STTL, LSTTL, AND
HCMOS LOGIC FAMILIES
• NEW, HIGH SPEED AIGaAs EMITTER
• THREE STATE OUTPUT (NO PULL-UP
RESISTOR REQUIRED)
• HIGH POWER SUPPLY NOISE IMMUNITY
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
The electrical and switching characteristics of the HCPL2400/11 are guaranteed over the temperature range of O°C
to 70°C.
The HCPL-2400/11 are compatible with TTL, STTL, LSTTL
and HCMOS logic families., When Schottky type TTL
devices (STTL) are used, a data rate performance of 20 MBd
over temperature is guaranteed when using the application
circuit of Figure 13. Typical data rates are 40 MBd.
• HCPL-5400/1 COMPATIBILITY
Applications
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• COMPUTER-PERIPHERAL INTERFACES
• ISOLATED BUS DRIVER (NETWORKING
APPLICATIONS)
Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (High)
• SWITCHING POWER SUPPLIES
• GROUND LOOP ELIMINATION
Input Voltage (Low)
Symbol
Vcc
IF (ON)
VF (OFfl
• HIGH SPEED DISK DRIVE I/O
Enable Voltage (Low)
VEL
• DIGITAL ISOLATION FOR AID, DIA
CONVERSION
Enable Voltage 1High)
VEH
Operating Temperature
TA
Fan Out
N
• PULSE TRANSFORMER REPLACEMENT
9-29
Min. Max.
4.75 5.25
4
8
0.8
0
0.8
2.0 Vee
70"
0
-
5
Units
Volts
mA
Volts
Volts
Volts
·C
TTL Loads
.-~----
Absolute Maximum Ratings
(No derating required up to 85° C)
Max.
Units
125
·C
-65
·C
85
TA
0
260'Cforl0 s.ll.6 mm betowseating plane)
Symbol
Parameter
Storage Temperature
Min.
Note
Ts
Operating Temperature
Lead Solder Temperature
IF
Average Forward I nput CUrrent
~putcurrent
10.0
2().Q
IFPK
VI>
ollage
Average Output Collector Current
Output Collector Voltage
-25.0
--().5
Vo
Po
Output Collector Power Dissipation
7.0
10.0
0
--().5
9
mA
V
3.0
Vee
Ve
10
Three State Enable Voltage
mA
V
10.0
V
mA
V
4().Q
mW
25.0
Electrical Characteristics
ForO'C 5 TA 5 70·C, 4.75 V 5 Vee 5 5.25 V, 4 mA5IF(ON) 5 8 mA, 2.0 V 5 VEH 5 5.25, a V 5 VEL 50.8 V,
a V 5 VF(OFF) 5 0.8 V except where noted. All Typicals at TA = 25° C, Vee = 5 V, IF(ON) = 5.0 mA, VF(OFF) = a V except where noted.
Parameter
Symbol
Logic Low Output Voltage
VOL
Lagle High Output Voltage
VOl'!
Max.
Unlls
Test Conditions
0.5
Volts
10L ~ 8.0 mA (S TTL Loads)
1
2A
VailS
IOH--4.0mA
:<
2.0
"A
Volts
Min.
Typ.
Figure Note
Vo~5.25V
Output Leakage Current
IOI'!H
Lagle High Enable Voltage
VliJi
Logic Low Enable Voltage
VEL
O.B
Lagle High Enable Current
IEH
20
p.A
Vs=2AV
100
p.A
VE"'5.25 V
--(),28
--(),4
mA
Ve=OAV
Vee
VF'"O.8 V
Volts
Logic Low Enable Current
IEL
Logic Low Supply Current
ICCL
19
26
Logic High Supply Current
ICCH
17
26
mA
rnA
High impedance State
Supply Current
lecz
22
28
mA
VeC = 5.25 V
VE=S,25 V
High Impedance State
Output Current
lozl
20
p.A
Vo=O.4V
Ve"'2V
10m
20
Jl.A
Vo "'2.4 V
VE=2V
IOZH
100
p.A
Vo ~ 525 V
I
=5.25 V
Ve=OV
LogiC Low Short Circuit
Output Current
lOSt
52
mA
Vo=Vce~S.25V
11'=8 mA
1
Logic High Short Circuit
Output Current
10SH
-45
mA
Vee = S.25 V
Ip'O mAo
Vo""GND
1
mA
Input Current Hysteresis
Vcc=5V
$
Volts
IF~
4
5.0
Volts
IR
-1.44
mV/"C
0.25
IHYS
I VF
1.1
1.3
Input Reverse Breakdown
Voltage
VR
3.0
Input Diode Temperature
Coelficient
.lVF
-"TA
Input-Output Insulation
11-0
Input Forward Voltage
I
Option 010
VISO
1
2500
RI-O
1012
I nput-Output Capacitance
01-0
0.5
I nput Capacitance
GIN
20
Input-Output Resistance
1.5
p.A
VRMS
ohms
5 mA, TA= 25'C
=10 p.A, TA = 25°C
1,=5 mA
450/, RH, t '" 55,
VI_O '" 3kVdc, T A
4
=25" C
RH $50%. t-1 min.
Vl-O - 500 VDC
di~irHl' VI-O ~ a V de
pF
pF
9-30
MHl, VF = OV, Pins 2 and 3
2,8
10
2
2
switching Characteristics
0' CoSTA oS 70' C, 4.75 V oS Vee oS 5.25 V, 0.0 V oS VEN oS 0.8 V, 4 mA oS IF oS 8.0 mAo All Typicals Vee'" 5 V, TA '" 25'C,
IF'" 5.0 mA except where noted.
Parameter
Symbol
Propagation Delay Time to
Logic Low Output Level
tpHL
Propagation Delay Time to
Logic High Output Level'
tplH
Pulse Width Distortion
Channel Distortion
Typ.
Min.
Max.
Units
Tesi"CoridlUons
Figure
55
ns
IF(ON)= 7.0mA
5,6,7
4
ns
5,6,7
3
5,6,7
4
15
33
60
55
ns
15
30
60
ns
ItPHL-tPLH I
2
15
ns
3
25
ns
.:I.tpHL
8
25
ns
5,8
5
"tPLH
8
25
ns
5
tr
20
ns
5
Output Fall Time
tf
10
ns
5
Output Enable Time to
Logic High
tpZH
15
ns
9,10
Output Enable Time to
Logic Low
tpZL
30
ns
9,10
Output Disable Time
from Logic High
tpHZ
20
ns
9,10
Output Disable Time
from Logic Low
tpLZ
15
ns
9,10
Logic High Common Mode
Transient Immunity
ICMHI 2400
1000
10,000
V/p.s
VCM'" 50V
2411
1000
V/p.s
VCM= 300V
2400
1000
2411
1000
Output Rise Time
Logic Low Common Mode
Transient Immunity
ICMLI
Power Supply Noise
Immunity
PSNI
.50 0
~
w
~ .400
TA
TA '" 0'0
~
~
.300
~
=>
o
~
.20 0
"
§
,
.100
k;::::~
#25~-C
VII's
VCM=50V
VCM=300V
0.5
V/p.s
Vp _p
V
4. 0 ' \
l\
I\,
~ ;;.-5
+t3. 0
10.0
20.0
IOL - LOGIC lOW OUTPUT CURRENT - rnA
Figure 1. Typical Logic Low Output
Voltage vs. Logic Low Output Current
3
5,8
4
I
5
5
TA = 25'C, IF= 0
11,12
6
TA"'25'C,IF=4mA
11. 12
6
VCC= S.OV, 48Hz ~ FAC~50MHz
7
6. CMH is the maximum slew rate of common mode voltage
that can be sustained with the output voltage in the logic
high state (VO(MINI > 2.0 VI. CML is the maximum slew rate of
common mode voltage that can be sustained with the output
voltage in the logic low state (VO(MAXI < 0.8 VI.
7. Power Supply Noise Immunity is the peak to peak amplitude
of the ac ripple voltage on the Vee line that the device will
withstand and still remain in the desired logic state. For
desired logic high state, VOH(MINI > 2.0 V, and for desired
logic low state, VOL(MAXI < 0.8 volts.
8. This is a proof test. This rating is equally validated by a
2500 V ac, 1 second test per UL E55 361.
9. Peak Forward Input Current pulse width < SOl'S at 1 KHz
maximum repetition rate.
10. See Option 010 data sheet for more information.
1
"
T", "7Q'C
~
o
5,6;7
5.0
~
~ PJ
.,
IF(ON) = 7.0 mA
Note
I 1
I I
I I
TA '" 70?C
i'<
I.......
i' l-<
,
I=ttf"tYC
"'o"
3. 0
~=>
2. 0
~
1.0
>
I'.
l"" I:'-.. 1'1'.
~ ::--..
~
""
~
-10.0
'OH - LOGIC HIGH OUTPUT CURRENT - rnA
Figure 2. Typical Logic High Output
Voltage vs, Logic High Output Current
9-31
'"" ....
j.,...
o,
I I
-5.0
4. 0
w
~
'Ir::::-
I
>
I
TA -=:25'C
o
o
1.0
2.0
IF - INPUT FORWARD CURRENT - rnA
Figure 3, Typical Output Voltage vs.
Input Forward Current
3.0
Vee
5.0V
Va
OUTPUT
MONITORING
NODE
1.3K
n
Cl
15pF
THE PROBE AND JIG CAPACITANCES ARE INCLUDED IN
~tC~?0~2ES ARE ECG 619 o'R EQUIVALENT.
VF - FORWARD VOLTAGE - V
Figure 4. Typical Diode Input Forward
Current Characteristic
Figure 5. Test Circuit lor tpLH. tpHL. t,. and If
0
10
~
45
~
C
"'N'
0
i
~
35
",
,.,V
30
25
~'
~ ,'"
......
Z
c
o
I
~
c
!l
35 ~_-+__+-_~__;-_~
~I
30~---+--+-
~
50
__ ____
~
,...'
6
.......
/
~~~
2
1
25
8
40~---+----+---~----;---~
.~
70
TA - TEMPERATURE - 'C
Figure 6. Typical Propagation Delay vs.
Ambient Temperature
25
IF - INPUT FORWARD CURRENT - mA
II.
I.
50
85
70
TA - TEMPERATURE _·C
Figure 8. Typical Pulse Width
Distortion VB. Ambient Temperature
Figure 7. Typical Propagation Delay
vs, input Forward Current
Vee
I
J
0
25~0----=---~--~--~~-~,0·
6.0 V
T.,
HCPL-2400/11
50
IF
o--+---IlH
~
I
~c
02
03
INPUT VE
MONITORING
NODE
.2
.,
.,
CLOSED
OPEN
CLOSED
CLOSED
CLOSED
CLOSED
CLOSED
OPEN
3.0 V
INPUTVE
SWITCH MATRIX
'.6V
OUTPUT Va
"'.5V
VOL'
VOH
"'.5V
OUTPUT Va
tPHZ
tPZH
tPLZ
tPZL
z
c
30
''''''
~
~
20
"HZ
::1
10
~
04
0-""'-+------------'
...-- ,.-
40
~
"",..-
"',.
t,...
..-
---
ill
o
o
25
50
TA - TEMPERATURE
70
85
_·c
Figure 10. Typical Enable Propagation
Delay vs. Ambient Temperature
ALL DIODES ARE EC6 619 OR EQUIVALENT
C1· 30 pF INCLUDING PROBE AND JIG CAPACITANCE.
Figure 9. Test Circuit for tpHZ. IpZH. IpLZ and tpZL'
9-32
HCPL-2400111
~
>10000
Vee "-5.Q V
IFI'~" 4.0mA
I
~
~
OUTPUT Va
A
vfL"o,av
VOH .. 2.0 V (NUN.)
VOL'" 0-.8 V (MAX.;
fA. b.2$"C
(SEE NOTE G)
8000
~
1--+---1~.o MONITORING
~
NODE
>-
1E
'"
;2
6000
Z
\.
CMLAND CMH
>w 4000
c
o
~
z
50V',-----------~~~~--~
VCM
~
VOH
"
-/
8
I
1i
v::. .
SWITCH AT A: IF ,. 0 rnA
VOL
~ 200 0
0V
..Va MAX."
0
1000
500
1500
2000
VCM - COMMON MODE TRANSIENT VOLTAGE - V
\
SWITCH AT B: IF - 4 rnA
·MUST BE LOCATED < 1 em FROM DEVICE UNDER TEST.
"SEE NOTE 6.
tCl IS APPROXIMATELY 15 pF, WHICH INCLUDES PROBE AND
STRAY WIRING CAPACITANCE.
Figure 12. Typical Common Mode Transient Immunity vs.
Common Mode Transient Voltage
Figure 11. Test Diagram for Common Mode Transient Immunity
and Typical Waveforms
Applications
Vec, = +5 V - - -.....- . . ,
r-----;=::;:~Im----r--- VCC2 = 5 V
IN
OATA
DATA
OUT
A
Y
GND
Figure 13. Recommended 20 MBd HCPL-2400/11 Interface Circuit
1--+---',.-'
'-'--t--'.::-- GND 2
Figure 14. Alternative HCPL-2400/11 Interface Circuit
20
18
16
~
SEE fiGURE 13
2
lNN1~0:::A
roo---
8
2 Y Y 50 BIPHASE-MARK
4
2n
74S04
2YY50~:~~~SE74LS04
7404
74HC04
2 N Y 50 MANCHESTER
'J
RATE
(~
SECOND
X NO. SYMBOLS)
BIT
~
I I
1 I I 11 I
n n n n nn nnn
i II I'll 1'1'1I1i-1
I
6
SIGNALING (SYMBOLS OR BAUO\
RATE
SECOND
J '" DATA
SELF~CLOCKING?
DUTY FACTOR RANGE (%)
0
0
J
NUMBER SYMBOLS PER BIT
INVERTIBLE?
roo---
14
I
I
I
I
~I..J..J....L.II..J
1..1..
I~II1..1..I~I~III
J U U W U U LU U U U
DRIVER TYPE
Figure 15. Typicai Puise Width Distortion vs. input Driver Logic
Famiiy
Figure 16. Modulation Code Selections
9-33
Data Rate, Pulse-width
Distortion, and Channel
Distortion Definitions
Applications Circuits
A recommended application circuit for high speed operation is shown in Figure 13. Due to the fast current switching
capabilities of Schottky family TTL logic (74STTL), ,data
rates cif 20 MBd are achievable from 0 to 70°C. the 74S04
totem-pole driver sources current to series-drive the input
of the HCPL-2400/11 optocoupler. The 3480 resistor limits
the LED forward current. The 30 pF speed-up capacitor
assists in the turn-on and turn-off of the LED, increasing
the data rate capability of the circuit. On the output side,
the following logic can be directly driven by the output of
the HCPL-2400/11 since a pull-up resistor is not requii'ed. If
desired, a non-inverting buffer may be substituted on either
the input or the output side to change the circuit function
from Y = A to Y = A. This circuit satisfies all recommended
operating conditions.
In the world of data communications, a bit is defined as
the smallest unit of information a computer operates with.
A bit is either a Logic 1 or Logic 0, and is interpreted by a
number of coding schemes. For example, a bit can be
represented by one symbol through the use of NRZ code,
or can contain two symbols in codes such as Biphase or
Manchester (see Figure 16). The bit rate capability of a system is expressed in terms of bits/second (b/s) and the
symbol rate is expressed in terms of Baud (symbols/second>. For NRZ code, the bit rate capability equals the
Baud capability because the code contains one symbol
per bit of information. For Biphase and Manchester codes,
the bit rate capability is equal to one half of the Baud capability, because there are two symbols per bit.
An alternative circuit is shown in Figure 14, which utilizes a
74S05 open-collector inverter to shunt-drive the HCPL2400/11 optocoupler. This circuit also satisfies all
recommended operating conditions.
Propagation delay is a figure of merit which describes the
finite amount of time required for a system to translate
information from input to output when shifting logic levels.
Propagation delay from low to high (tPLH) specifies the
amount of time required for a system's output to change
from a Logic 0 to a Logic 1, when given a stimulus at the
input. Propagation delay from high to low (tPHL) specifies
the amount of time required for a system's output to
change from a Logic 1 to a Logic 0, when given a stimulus
at the input (see Figure 5).
The HCPL-2400/11 optocouplers are compatible with other
logic familes, such as TTL, LSTTL, and HCMOS. However,
the output drive capabilities of Schottky family devices
greatly exceed those associated with TTL, LSTTL, and
HCMOS logic families, and are recommended in high data
rate (20 MBd) applications where fast drive current transitions are required to operate the HCPL-2400/11 with
minimum pulse-width distortion.
When tpLH and tPHL differ in value, pulse width distortion
results. Pulse width distortion is defined as jtPHL-tPLH
and determines the maximum data rate capability of a
distortion-limited system. Maximum pulse width distortion
on the order of 20-30% is typically used when specifying
the maximum data 'rate capabilities of systems. The exact
figure depends on the particular application (RS-232,
PCM, T-1, etc.>.
I
Channel distortion, (AtPHL, AtpLH), describes the worst
case variation of propagation delay from device to device
at identical operating conditions. Propagation delays tend
to shift as operating conditions cha'nge, and channel distortion specifies the uniformity of that shift. Specifying a
maximum value for channel distortion is helpful in parallel
data transmission applications where the synchronization
of signals on the parallel lines is important.
\l
The HCPL-2400/11 optocouplers offer the advantages of
specified propagation delay (tPLH, tPHU, pulse-width distortion 1000 Vlp.s TYPICAL
GUARANTEED PERFORMANCE OVER TEMPERATURE
RECOGNIZED UNDER THE COMPONENT PROGRAM
OF U.L. (FILE NO. E55361) FOR DIELECTRIC
WITHSTAND PROOF TEST VOLTAGES OF 1440 Vac,
1 MINUTE AND 2500 Vac, 1 MINUTE (OPTION 010).
Description / Applications
The 6N137 consists of a GaAsP photon emitting diode
and a unique integrated detector. The photons are collected
in the detector by a photodiode and then amplified by a high
gain linear amplifier that drives a Schottky clamped open
collector output transistor. The circuit is temperature,
current and voltage compensated,
This unique isolator design provides maximum DC and AC
circuit isolation between input and output while achieving
LSTTLITTL circuit compatibility. The isolator operational
parameters are guaranteed from O°C to 70°C, such that a
minimum input current of SmA will sink an eight gate fan-out
(13mA) at the output with S volt Vee applied to the detector.
This isolation and coupling is achieved with a typical
propagation delay of SSns. The enable input provides gating
of the detector with input sinking and sourcing requirements
compatible with LSTTUTTL interfacing.
The 6N137 can be used in high speed digital interfacing
applications where common mode signals must be rejected,
such as for a line receiver and digital programming of floating
power supplies, motors, and other machine control systems.
It is also useful in digital/analog conversion applications, like
compact disk players, for noise elimination. The open collector
output provides capability for bussing, OR'ing and strobing.
CAUTION: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which
may be induced by ESD.
'JEDEC Registered Data.
UC
I
R€COGNITJON .LI_ _ _ _ _ _ _====~:::::::~
t
4,70- (, UJ5! MAX.
---
[!
rl
~
0.'16 (,030)
it-c
IIr-- o
I
I
,-
I
ANODE
2
C.B.10201
MIN
CATHOOe.
2.921.1151 M1N
55 (025) MAX
lAo (.OSS) !+-~ ~:;~ i:~~~~
DIMENSIONS IN MII.lIMETRES ANPllNCtiESI.
Recommended operating
CondOt"
I Ions
Sym. Min. Max. Units
Input Current, Low Level
Each Channel
Input Current, High Level
Each Channel
High Level Enable Voltage
Low Level Enable Voltage
(Output High)
Supply Voltage, Output
Fan Out
(TTL Load)
Operating Temperature
IF!.
0
250
iJA
IFH
6.3"
15
mA
VBI
2.0
0
Vee
0.8
v
Vee
N
4.5
5.5
8
V
T\
0
70
·C
VEL
Absolute Maximum Ratings'
(No derating required up to 70°C)
Storage Temperature ........................... -Sso C to +12So C
Operating Temperature .............................. 0° Cto +70° C
Lead Solder Temperature ....................
260°C for lOS
(1.6mm below seating plane)
Peak Forward Input
Current ........................... 40mA (t S; 1msec Duration)
Average Forward Input Current ............................. 20mA
Reverse Input Voltage .................................................. SV
Enable Input Voltage ................................................. S.SV
(Not to exceed Vee by more than SOOmV)
Supply Voltage - Vee ................. 7V (1 Minute Maximum)
Output Current-Io .................................................. SOmA
Output Collector Power DiSSipation ..................... 8SmW
Output Voltage - Vo ...................................................... 7V
**S.3mA condition permits at least 20% eTR degradation
guardband. Initial switching threshold is 5mA or less.
9-35
V
Electrical Characteristics
OVER RECOMMENDED TEMPER.ATURE (TA = O°C TO 70°C) UNLESS OTHERWISE NOTED
Parameter
Typ.**
Max.
Units
Test Conditions
Figure
High Level Output CUrrent
Symbol
IOH*
2
250
p.A
VCC=5.5V. VO=5.5V,
IF=250J,IA, Ve;"'2.0V
6
Low Level Output Voltage
VOL *
0.4
0.6
V
Vce=5.5V,IF=SmA,
VEH=2.0V
'OL (Sinking) =l3mA
3,5
High Level Enable Current
IEH
Low Level Enable Current
.
IEL
High Level Supply Current
leCH"
Low Level Supply
leeL *
Input-Output In~'ation
1'.0
J
Min.
-1.0
•
-2.0
mA
Vce=5.5V, VE=O.5V
7
15
mA
Vce"'5.5V. IF"'O
VE=0.5V
18
mA
Vcc=5.5V,IF=10mA
VE"'0.5V
1
p.A
45% AH. t = 55,
VI.O'" 3 kV dC,TA'" 25°C
AHS50%t=1 MIN
14
2500
VISO
R,_o
~)
<4-0
0.6
Vp*
1.5
. ",,,,,.
Input Forward
Input Reverse
Voltage
own
Input Capacltiloce
Current Trahsfer Ratio
eVR"
Vcc"5.5V. VE=2.0V
-1.4
OPT010
Resistance (Input-dutput)
",
mA
VRMS
n
.1012
pF
1.75
CIN
CTR
10
5
f=1MHz. TA=25·C
1","'10mA, TA=25"C
V
IR"'10f,lA, TA=25"C
5
5,9
VI_o"'500V, TA'"
V
60
pF
Vp=O, foot MHz
700
%
'p=5.0mA, RL=tOOn
Note
5
4
8
2
7
**AII typical values are at Vec = 5V, TA = 25°C
Switching Characteristics at TA =25°C, VCC = 5V
Parametef®
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Figure
Note
Propagation Delay Time to
High Output "Le~el
tPLH*
55
75
nS
RL =350n, CL =15pF,
Ip=7.5mA
7,9
1
Propagation Delay Time to '
Low Output Lev~1
Pulse Width Distortion
tPHL *
55
75
ns
RL =350n, CL =15pF,
IF"'7.5mA
AL =350n, CL -15pF,
IF=7.5mA
7,9
2
ItPHL- tPLH \
10
ns
tr. tf
50,20
ns
RL =350n,
IF=7.5mA
tELH
65
ns
RL =350n, CL =15pF ,
'F"'7.5mA, VEH-3.0V,
VEL=0.5V
8
3
tSHL
20
ns
RL =350n, CI. =l5pF,
IF=7.5mA VEH=3.0V,
VeL "'O.5V
8
4
Common Mode Transient
Immunity at Logic High
Output Level j, u~
ICMHI
100
vlJ.ls
VCM=10V RI. =350n,
Vo(min.)",:lV, IF"'OmA
11
6
Common Mode Transient
Immunity at Logic Low
Output Level
ICMLI
-300
vtp.$
VCM=10V RL =350n,
Vo {max.j=0.8V,
IF "'SmA
11
6
Output Rise-Fall Time
(1(}90%)
Propagation Delay)rime of
Enable from VEH to VEL
"'
~
Propagation Del~YilTime of
Enable from VEL to VEH
1
•JEDEC Registered Data.
9-36
Ct."'15pF,
----- - - - - - - - - - - - - - - - - -
------- - - - -
Operating Procedures and Definitions
Logic Convention. The 6N 137 is defined in terms of positive
logic.
Bypassing. A ceramic capacitor (.01 to 0.1MF) should be con·
nected from pin 8 to pin 5 (Figure 12). Its purpose is to stab·
ilize the operation of the high gain linear amplifier. Failure to
provide the bypassing may impair the switching properties. The
total lead length between capacitor and coupler should not ex·
ceed 20mm.
Polarities. All voltages are referenced to network ground (pin
5). Current flowing toward a terminal is considered positive.
Enable Input. No external pull·up required for a logic (1), i.e.,
can be open circuit.
..
80
70
«E
,
......
1~~ -'"
.'"
~" -""" ~~. ......
60
.
...
ffi
...... ,... ..
_......
'
...-
TA
~
-- --V ,
-- -- -f.-- -- r--, . .
50
a:
a:
a~P.
s",p,
:;)
a:
"
40
~
30
IF
=1soc
I
lmASTEPS
NOTES:
1. The tPLH propagation delay is measured from the 3,75mA point on the trailing
edge 01 the input pulse to the 1.5V point on thetraillng edge of the output pulse.
2. The bHl propagation delay is measured from the 3.75mA point on the leading
edge of the input pulse to 1.5V paint on the leading edge of the output pulse.
3. The tELH enable propagation delay Is measured from the 1.SV point of the trailing
edge of the input pulse to the 1.SV point on the trailing edge of the output pulse.
4. The tEHL enable propagation delay is measured from the 1.SV point on the
leading edge of the input pulse to the 1.SV point on the leading edge of the
output pulse.
5. Device considered a two terminal device: pins 2 and 3 shorted together, and
pins 5, 6, 7, and 8 shorted together.
6. Common mode transient immunity in Logic High level is the maximum tolerable
(positive) dVcM/dt on the leading edge of the common mode pulse, VCM, to
assure that the output will remain in a Logic High state (I.e., Vo>2.0V). Common
mode transient immunity in Logic Low level is the, maximum tolerable
(negative) dVcM/dt on the trailing edge of the common mode pulse signal, VCM,
to assure that the output will remain in a Logie Low state (I.e., Vo<0.8V).
7. DC Current Transfer Ratio Is defined as the ratio of the output collector current
to the forward bias Input current times 100%.
8. At 10mA VF decreases with increasing temperature at the rate of 1.6mVf'C.
9. This is a proof test. This rating is equally validated by a 2500 Vae, 1 sec. test.
10. See Option 010 data sheet for more information.
~
1-""-
...0
\
8,
~,
4mP,
20
.....
3mA
_0
.""
10
--
~
a:
a:
:;)
"Ca:
O- -
MAX. DC
RAT'i
~
a:
o
o
,
~
10
Vo - COLLECTOR VOLTAGE - v
""
Note: Dashed characteristics - denote pulsed operation only,
V F - FORWARD VOLTAGE - VOLTS
CURVE
Figure 4. Input Diode Forward Characteristic.
TRACER
TERMINALS
>,
1f!:O 5mA
i" .... _
w
"«
'>..."
Figure 2. Optocoupler Collector Characteristics.
__ ~:.!s.:A_
0,6
0
I--
\:," namA
:;)
I'--.
\:, -9,SmA
:=
0.5
:;)
,O-6.... A
,
0
Vee = 5.0V
,
>0 0.4
TA~25·C-
\\;:
1
50
25
\' '\:\
\\
-
TA - TEMPERATURE _
BL
75
°c
Figure 5. Output Voltage, VOL vs. Temperature and Fan-Out.
350il
/lk!1
4k!1
100
J1
'( '-
If! '" 250/l-A
Vee
'i,
...
ffi
a:
a:
IF - INPUT DIODE FORWARD CURRENT - rnA
50
:;)
"...
Erl------v.:1m~~--~-o+5V
~
5.5 V
Vo .... s.SV
r--
:;)
:=
:;)
0
,
l>fWl--+---"'---o
~
Vo
_0
25
50
TA - TEMPERATURE -
Figure 6. Output Current, IOH
Figure 3. Input-Output Characteristics.
9-37
V50
75
°c
Temperature {iF=250ILAI.
+SV
INPUT VE
r--~~., MONITORING NODE
PULSE
GENERATOR
puLse
GENERATOI!r----- MONITORING
I,
NODE
OUTPUT Va
47n
MONITORING
NODE
t U - + - - - + - o MONITORING
NODE
·CL Is ~~p'roximately 15pF, which includes
~robe.a.nd stray wiring ca~acjtance.
INPUT
I,
- - 350mV IIF"'!7.5mAI
.
.
J-----\---17~mVII,.3.7SmAI
- I tpHl
I--- . ~
tpLH
t*"I
~
I __ ~ ____ I
e~TPUT
.
VOH
----1.SV
"
- - " - - - VOL
Figure 7. Test Circuit for tpHL and tPLH"*
Figure 8. Test Circuit for tELH and tEHL .
.. JEDEC. Registered Data.
e,
;>O~---'----------;~>O-"'Ch.n
~
Chan B
rnr--V;;J;!l-t"""--+~':--__ +5V
c
~
i
,
ChanA~
__ I tOL
"'50ns (delay in response to
logic High Level input)
~
'
Chan B
~ tOH '" 20n5 .(delay in response to logic Low Level input)
IFH - PULSE INPUT CURRENT - rnA
Figure 9. Propagation Delay, tpHL and tPLH
VI. Pulse Input Current, IFH.
Figure 10. Response Oelay·Between TTL Gates.
t, "'160ns
tf- 55nl
"
~
~+---~-__oVO
Va
A
A
_ _ _ _ _ _ _ _ SV
~;;;
SWITCH AT A: IF= OmA
~VOL
VO.. - · · - - - - : . - - - - - -..
PULSE GEN.
SWITCH AT B: IF- 5mA
VcM
+
Figure 11. Test Circuit for Transient Immunity and Typical Wa.veforms.
______ LGNDBUSlaACK)
N.C.
CIf.;-!rlt===~==~
ENABLE
(IF USED)
N.C•
OUTPU:r1
.........-..:;..!f:r--
Figure 12. Recommended Printed Circuit Board Layout.
9-38
FliRW
HIGH CMR, HIGH SPEED
OPTOCOUPLER
HEWLETT
~e.tI PACKARD
~I
S'.90 !:39'3'1
I_~I."OI
'F
I
+-
I
~:
]
VF
-
8
7
6
OUTLINE DRAWING
!lli.CW!._
0 ..').3 1.013.1 ..t
~i-~!"··-"""'=~-r
5.
TYPE NUMBeR
DATE CODe
I
ti~Pl-2601
f4CPL-2611
u,
l:r.,......,,,-,..,,,...,..,,....
j al()~
7.36 ~ iI60 L~601
'f88 1-310)
~ECOGNITION
t_~~=:;;;;=
I
L---~--_t~----~---o5GND
'.
A 0.01 TO 0.1 pF BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
PINS 8 AND 5 (See Note 1).
Figure 1. Schematic.
t
V.
7
--I
TRUTH TABLE
(Positive Logic)
Input
Enable
Output
H
L
H
H
H
L
H
H
H
4,70\.leSI MAX,
I
I
II '."
I
'.1
2:9:/,1,. 115t MIN
41--0,65 C02S} MAX.
0_]6 (.0301
j
1:40 f1i55j
!__ ~ ~:.~~;
---
MIN
DIMENSIONS- tN MllLIMHRES AND (INCHESl.
Applications
o INTERNAL SHIELD FOR HIGH COMMON MODE
•
•
I
rI -
Features
•
•
•
•
·:to. '. ".
I
II I
•
•
•
•
•
•
•
•
•
REJECTION (CMR)
HCPL-2601 = 1000 V/p.s
HCPL-2611 = 3500 V/p.s
HIGH SPEED: 10 MBd TYPICAL
LSTTL/TTL COMPATIBLE
LOW INPUT CURRENT REQUIRED: 5 rnA
GUARANTEED PERFORMANCE OVER
TEMPERATURE: ODC to 70DC
STROBABLE OUTPUT
RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vae, 1 MINUTE AND 2500
Vae, 1 MINUTE (OPTION 010).
Isolated Line Receiver
Simplex/Multiplex Data Transmission
Computer-Peripheral Interface
Microprocessor System Interface
Digital Isolation for A/D, D/A Conversion
Switching Power Supply
Instrument Input/Output Isolation
Ground Loop Elimination
Pulse Transformer Replacement
Recommended operating
Conditions
"Sym.
Description
The HCPL-2601/11 optically coupled gates combine a
GaAsP light emitting diode and an integrated high gain
photon detector. An enable input allows the detector to be
strobed. The output of the detector I.C. is an open collector
Schottky clamped transistor. The internal shield provides a
guaranteed common mode transient immunity specification
of 1000 V/J1.S for the 2601, and 3500 V/J1.S with the 2611.
This unique design provides maximum D.C. and A.C.
circuit isolation while achieving TTL compatibility. The
isolator D.C. operational parameters are guaranteed from
00 C to 700 C allowing troublefree system performance.
This isolation is achieved with a typical propagation delay
of 40 nsec.
The HCPL-2601/11 are suitable for high speed logic
interfacing, input/output buffering, as line receivers in
environments that conventional line receivers cannot
tolerate and are recommended for use in extremely high
ground or induced noise environments.
9-39
Min.
Max.
Ulllls
Input Current, Low Level
IFe
0
250
Input Cu rrent, High Level
IfH
6.3'
15
I'A
rnA
V
Supply Voltage, Output
Vee
4.5
5.5
High Level Enable Voltage
VEH
2.0
Vcc
V
Low Level Enable Voltage
VEL
0
0.8
V
0
70
Fan Out (TTL LOad)
Operating Temperature
N
T"
8
'c
CAUTION: The small junction sizes inherent to the deSign of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which
may be induced by ESD.
*6.3 mA condition permits at least 20% eTR degradation guard
band. Initial switching threshold is SmA or less.
Absolute Maximum Ratings
(No Derating Required up to 70°..C) .
SupplyVoltage-Vee ......... 7V (1. MinuteMaxim~m)
Enable I nput Voltage - VE ..................... ,.. 5:5 V
(Not to exceed Vee by more than 500 mY)
Output Collector Current - 10 ................. 25 mA
Output Collector Power Dissipation .... . .. . . .. 40 mW
Output Collector Voltage- Vo .................... 7V
StorageTemperature . . . . . . . . . . . ... -55° C to +125· C
Operating Temperature ................ O·C to +70· C
LeadSolderTemperature ..... .......
260·Cfor10S
(1.6mm below seating plane)
Forward Input Current - IF (see Note 2) ....... 20 mA
Reverse Input Voltage ........................... 5 V
Electrical Characteristics
(Over Recommended Temperature, TA = DoC to +70°C, Unless Otherwise Noted)
Typ,'
Max.
Units
Test Condilions
High level Output Current
10H
20
250
I'A
Vee'" S.5V. Vo '" 5.5V.
IF 250 p.A, VE = 2.0 V
2
Low level Output Voltage
VOl.
0.4
0.6
V
~~c = 5.5V, IF '" SmA
E = 2.0 V,
101. (Sinking) = 13 rnA
3,5
High level Supply Current
!cen
10
15
mA
Vee = 5.5V, IF = 0,
Va'" 0.5 V
Low level Supply Current
len
15
19
mA
Vee'" 5.5V, IF'" 10 mA,
Va =0.5 V
Low level ~Current
High Level
Current
lal.
.1.4
-2.0
Ian
-1,0
High Level Enable Voltage
VEH
L;ow Level Enaqle Voltage
VEl.
Symbol
Parameter
Min.
eVil
Inpul Diode Temperature
. £!.1.
1.75
10mA.
v
5
eo
GIN
~OElfflclent
V
11
V
0.8
1.5
own
. Input Capacitance
~a
mA
2,0
VI'
'Input Reverse 8
Voltage
=
Figure Nole-
4
11\ '" 10p.A, T
pF
VF "" 0, f = 1 MHz
mVJOG IF= 10 mA
-1.6
~TA
'1,-0
Input.Output Insulation
'%
~jt%1i I OPT 010
Re$lstance (Input-Output)
CapacitllBse (Inf&t:OutplJt)
VISO
1
45% RH, I"" 5s,
VI-o =$ kV do. TA >= 25·0
VRMS IRHS50%t=1 MIN
n VI-O 0= 500 V
pF
f=l MHz
2500
".Ar-o
' 10"
.... OI~O
0.6
3,12
I'A
13
3
3'
'All typical values are al Vee = 5V.TA = 25'C.
switching Characteristics
Paramelar
Plop/Igatlon Diay Time to
High Output; evel
Propagation Delay Time to
Low output Level
• symbol .
Min,
ITA = 2Soc. Vee"" SV)
lYp.
Max. Units
.1PLH
40
75
os
tp.HL
40
75
ns
RI."'$50n
FliJura Note
6
4
6
5
9
8
9
7
Ot.= 15pF
Pul8eWldlh DlstortiQn
. f!PHL;.tpl.H1
10
os
outpUt Flise Time (10-90%)
:Ir .
If
20
n$
30
ns
25
n$
Output Fall Time (90-10%)
Tett Condition.
propagation Delay Time 01
Enable from VEH to Vel.
tEl.H
Propagation Delay nme of
Enable from VEL to VEH
. !EHI.
IF=7.5mA
i'lL'" 3500, GL'" 15pF,
IF"'7.5mA, VSH=3V,
VEL"OV
Common Mode
TranslenllmmunilY
at High Output Level
10M i'll
Common Mode
. Transient Irnmunlt)/
at low Output Level
ICrvld
.'
25
2601
1000 110.000
2611
3500
~1ooo
3500
10,000
os
. III,.s
RL =350.0, CL'" 15pF,
IF=1.5mA, VEH=3V.
VIiI."'OV
VCM=50V
VO(MIN}=211.
RI.=350n
IIlp/&
VOM" 400 II IF=OmA
VII'S
VOM"SOV
Vlp.$
110M: 400 II IF=7.5mA
9-40
VO(MAx)=O.BII
RL=350n
12 . 5.10
12
9,10
--
----~
-----
--~~--~-~----~~~
NOTES:
1. Bypassing of the power supply line is required, with a 0.01 J.lF ceramic
disc capacitor adjacent to each isolator as illustrated in Figure 15. The
power supply bus for the isolator(s) should be separate from the bus for
any active loads, otherwise a larger value of bypass capacitor (up to 0.1
J.tF) may be needed to suppress regenerative feedback via the power
supply.
2. Peaking circuits may produce transient input currents up to 50 rnA, 50
ns maximum pulse width, provided average current does not exceed 20
mAo
3. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted
together, and pins 5, 6, 7 and 8 shorted together.
4. The tpl.H propagation delay is measured from the 3.75 rnA pOint on the
trailing edge of the input pulse to the 1.5 V point on the trailing edge of
the output pulse.
5. The tpHl propagation delay is measured from the 3.75 mA point on the
leading edge of the Input pulse to the 1.5V paint on the leading edge of
the output pulse.
Ve• l • 5.6~
Vo • 5.•V
Vs ·:/'oV
15
10
"-
o
o
20
10
.... .........
30
'..0....
40
J
10. For sinusoidal voltages, (ldvnl l
--dt
~
"fCMVCM (p-p)
rna"
11. No external pull up is required for a high logic state on the enable input.
12. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec.
test.
13. See Option 010 data sheet for more information,
-
• 26Q"A-
'"
~
6. The tEI.H enable propagation delay is measured from the 1.5 V point on
the trailing edge of the enable input pulse to the 1.5 V point on the
trailing edge of the output pulse.
7. The tEll!. enable propagation delay is measured from the 1.5 V point on
the leading edge of the enable input pulse to the 1.5 V paint on the
leading edge of the output pulse.
8. CMH is the maximum tolerable rate of rise of the common mode voltage
to assure that the output will remain in a high logic state (Le., VOl''!"
>2.0 V).
9. eM!. is the maximum tolerable rate of fall of the common mode voltage
to assure that the output will remain in a low logic state (i.e., Vm'T
I
.,v
1111:- !>nl
4.0 f---i'flr--+--!--+--+--4
w
"~
g
~
60
Z
~
o
IE
·CL Is Ipproxlmately 16 pF, which Includes
probe and stray wiring capacllance,
I
1.0
INPUT
IF
J
IF '- FORWARD INPUT CURRENT - mA
V8,
Forward
I
~---IF-7.'mA
~.
1 - - - - - - , - - - IF -3.75mA
---+I
1- ---,
r-~~TPUT~_l.'V
tpHL
Output Voltage
Input Current.
70
o
~ 2.01---+~
Figure 5,
Vee - 5.0V
I, • 1.s",A+----...Jr----r--l-----I
I
Q
3,0 f--"lllft--+"o-::-'-';""",.........J-,.--+--4
o
-i
2
10
tpLH
Figure 6, Test Circuit for tpHL and t pLH '
20
30
40
60
60
TA =TEMPERATURE-'C
Figure 7, Propagation Delay vs.
Temperature,
9-41
~.--.~.~-.------
70
MJLse
a
70
~
60
GENERATOR
8OH-+--j--.j
c
I
5
w
c
~
", • ."n
Vet t:: S.OV
-TA ·25"C
70i---:--r--
60H-+-
CL'"
Output,vo
"iinTOl....L...._.....J. Monitoring
Nod.
L -_ _ _ _ _ _
'V
o
Figure 8. Propagation Delay vs. Pulse
Input Current,
200
~-l-_
R
60
I
L):il'HF=~-o:::r~~
Nodo
10
20
3q
40
50
BOOO
w
~
w
c
o
:0
z
'35on
60
!;;
in
ov
~MH
5V SWITCH AT A: IF = 0
RL #4kD
) 0'
!
!!:
VCM
o
:>
:0
'!:"f-
Rl
Figure 10. Enable Propagation Delay
vs. Temperature.
~ 10000 I-r+-+-I-+--!
3500
10
·0
~----1.5V
R }360n
Rl = lk~
0
~ 12000 F=t==f=F=t==f=F=t==F=F'1
I
--- -- -- -
20
0
r--
Figure 9. Test Clrcult.for tEHL and tELH.
RL -lkn
40
30
tELH
____ .__ .
I
--- - -
50
~
I-
.'4kn
t,---
w
tEHL
l:T.:.:c
~l
Vee = 5.0 V
190 r l , • 7.SmA
70
TA - TEMPERATURE _cC'
Figure 11. Rise, Fall Time vs.
Temperature.
Vo O.5V _ _,....-~f\--Vofmax.1
1000
~
V eM -
COMMON MODE
TRANSIENT AMPLITUDE
0 -
V
Figure 13. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.
~ ______ LGND BUS (BACK)
~ ~ 1.31--1---1'--1--+~ ~ 1.21--1--+
.
Figure 12. Test Circuit for Common Mode
Transienllmmunlty and
Typical Waveforms.
1.4 r--;-,--,---r-,--,---r
~z
~
:0
8
·1
SWITCH AT B: IF .. 7.5 mA
w
10
I
,!i'
OUTPUT~I
.,
'.
I
IF - PULSE INPUT CURRENT ~ rnA
J-
w
~PUT J------}.---'.5V
--I
iT
20
«
"'z
\----3.0V
20
"r
30
w
....
It
.oC L Is approxlma~ly 15pF. which includes
", prDbe.ndstraywiringcapacitance.·
.~
40
"0i1:
~
I
'"
~
RL
210
50
z
0
It
:0
c
'5V
i
;:
....
....
~
w
I
~ff.. tI'"'
N.C.
ctP~rt~==~==~
c3!i
ENABLE
"~ ffi... 1.1/-'::"'~-I'--f--+-
(IF USED)
j:Cii
~. ~
a: ...
1.0 /--I--I""'d--+-+-+-;
.9 1---1--\--+--'''''',-1--4-'';
N.C.
N.C.~~~
N.C.
Figure 14. Relative Common Mode
Transient Immunity vs.
Temperature.
~-7+.'J-'
Figure 15. Recommended Printed Circuit
Board Layout.
9-42
OUTPUT 1
OUTPUT 2
----~-~--~--~
------------------
HIGH CMR
LINE RECEIVER
OPTOCOUPLER
9.90 (.390)
I-~~
la
7
_I
HCPl-2602
HCPl-2612
OUTLINEDRAWING*
65.
TYPE NUMBER
1t
'DATE eOOE
6.10 tMID
1.36 (.290, 6.60- i.2601
I
7']8(.310)
PlN~'T""I"""'"2T""1"""'"3T""1"""4..J
ONEil
-
_I
UL
flECOGNITION ----=\S~o;;;;::::-
t
1_t78L0701MAX.
.............. 1<19 (.047) MAX.
OIMENSIO~
IN MllLJMEifleSANO ~rNCHES~.
TRUTH TABLE
(Positive Logic)
A 0.01 TO 0.1 p.F BYPASS CAPACITOR
MUST BE CONNECTED BETWEEN
PINS BAND 5 (See Note 1).
Figure 1. Schematic.
Input
Enable
Output
H
L
H
L
H
H
L
L
H
H
H
L
Features
Applications
• HIGH COMMON MODE REJECTION
2602 = 1000 VII'S
2612 = 3500 VII'S
• LINE TERMINATION INCLUDED - NO EXTRA CIRCUITRY
REQUIRED
• ACCEPTS A BROAD RANGE OF DRIVE CONDITIONS
• GUARDBANDEDFOR LED DEGRADATION
• LED PROTECTION MINIMIZES LED EFFICIENCY
DEGRADATION
• HIGH SPEED - 10MBd (LIMITED BY TRANSMISSION LINE
IN MANY APPLICATIONS)
• INTERNAL SHIELD PROVIDES EXCELLENT COMMON
MODE REJECTION
• EXTERNAL BASE LEAD ALLOWS "LED PEAKING" AND
LED CURRENT ADJUSTMENT
• RECOGNIZED UNDER THE COMPONENT PROGRAM OF
U.L. (FILE NO. E55361) FOR DIELECTRIC WITHSTAND
PROOF TEST VOLTAGES OF 1440 Vac, 1 MINUTE AND 2500
Vac, 1 MINUTE (OPTION 010).
• HCPL-1930/1 COMPATIBILITY
o
Computer-Peripheral Interface
Digital Isolation for A/D, 0/A Conversion
o Current Sensing
o Instrument Input/Output Isolation
o Ground Loop Elimination
o
Pulse Transformer Replacement
DC specifications are defined similar to TTL logic and are
guaranteed from 0° C to 70° C allowing trouble free interfacing with digital logic circuits. An input current of 5 mA
will sink an eight gate fan-out (Till at the output with a
typical propagation delay from inpL.' to output of only 45
nsec.
The HCPL-2602/12 are useful as line t>.'!rs in high noise
environments that conventional line re",,:. 'rs cannot tolerate. The higher LED threshold volt". 'l provides
improved immunity to differential noise and th, internally
shielded detector provides orders of magnitude improvement in common mode rejection with little or no sacrifice
in speed.
CAUTION: The small junction sizes inherent to the design
of this bipolar component increase the component's susceptibility to damange from electrostatic discharge (ESD).
It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
9-43
~-----.---.~-
Simplex/Multiplex Data Transmission
o
o
The HCPL-2602/12 optically coupled line receivers combine
a GaAsP light emitting diode, an input current regulator
and an integrated high gain photon detector. The input
regulator serves as a line termination for line receiver
applications. It clamps the line voltage and regulates the
LED current so line reflections do not interfere with circuit
performance.
The regulator allows a typical LED current of 8.5 mA
before it starts to shunt excess current. The output of the
detector IC is an open collector Schottky clamped transistor. An enable input gates the detector. The internal
detector shield provides a guaranteed common mode
transient immunity specification of 1000 ViI's for the 2602,
and 3500 ViI's for the 2612.
-
o
o Microprocessor System Interface
Description
------
Isolated Line Receiver
Recommended Operating
Conditions
Sym. Min. Max. Units
IlL
Input Current, High Level
lIB
0
6.3"
Supply Voltage, Output
VtT
4.5
60
5.5
High Level Enable Voltage VEll
Low Level Enable Voltage VEl.
2.0
Vee
V
0
0.8
V
Fan Out (TTL Load)
N
Operating Temperature
TA
..
Storage Temperature ........ ; ..... -55·Cto+125°C
Operating Temperature ................ 0·Clo+70°C
Lead Solder Temperature ...........
260·C for 10 S
(1.6mm below seating plane)
Forward Input Current -I) •••••••..••. ,....... 60 mA
Reverse Input Current ....••..•..••..•..•••.•. 60 mA
Supply Voltage-Vee ......... 7V (1 Minute Maximum)
Enable Input Voltage - VE ........................ 5,5 V
(Not to exceed Vee by more than 500 mY)
Output Collector Current -10 .................. 25 mA
Output Collector Power DiSSipation . . . . . . . .. .. 40 mW
Output Collector Voltage - Vo .................... 7 V
InputCurrent,Pin4 •..•..... , ..•...••••.•••. ±10mA
~
Input Current, Low Level
250
Absolute Maximum Ratings
V
8
0
DC
70
6.3 rnA con.dltlon permits at least 20% degradation guard band.
Initial switching threshold is 5 rnA or less.
NOTES:
1. Bypassing of the power supply line is required. with a 0.01 pF ceramic
disc capacitor adjacent to each isolator as illustrated in Figure 15. The
power supply bus for the isolator(s) should be separate from the bus for
6. The t':1I1. enable propagation delay is measured from the 1.5 V point on
the leading edge of the enable input pulse to the 1.5 V pOint on the
leading edge of the output pulse.
7. eMil is the maximum tolerable rate of rise of the common mode voltage
any active loads, otherwise a larger value of bypass capacitor (up to 0.1
pF) may be needed to suppress regenerative feedback via the power
supply.
2. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted
logether. and pins 5. 6. 7 and 8 shorted together.
3. The tl'l.lI propagation delay is measured from the 3.75 rnA point on the
trailing edge of the input pulse to the 1.5 V pOint on the trailing edge of
the output pulse.
.
4. The tpHi. propagation delay is measured from the 3.75 rnA point on the
leading edge of the input pulse to the 1.5V point on the leading edge of
the output pulse.
to assure that the output will remain in a high logic state (I.e., VO\'l'
a.
>2.0 V).
CM!. is the maximum tolerable rate of fall of the common mode voltage
to assure that the output will remain in a low logic state (I.e., VOl''!'
,
4.0
>
w
w
'~"
~§!
3.0
§!
...
~,
!;
~
2.0
0
I
.f
">
1.0
10
1.'
10
20
30
40
50
60
,I, - INPUT CURRENT - rnA
~
§!
!;
~
1
>'5
0
10
20
30
40
50
60
Figure 3. Input Characteristics.
I
[
'f
~
S.OmA
0.61--r--~---:.·--'---'--+--l
0.51----4--I.--!-
0.3
OutputVo
Monitoring
Node
·CL is approxim~taly 15 pF, which includes
proba and stray wiring capacitanc:a.
INPUT
0.2
t~ "6.4mA
0.1 0'---'10--2Q.l--ao
J--.'-0--'50--6..1.0--'70
TA -TEMPERATURE_OC
Figure 5. Low Level Output Voltage
vs. Temperature.
I,
~~----~'-7.~_mA
--"------~A
--+l
tpHL_I-
----., tpLH
~~TPUT~I
____
r--
~_~
__ 1'5V
Figure 6•. Test Circuit lor tpHL and·tpLH.
9-44
70
Figure 4. High Level Output Current
vs. Temperature.
0.8 r--r-,--.,.--r---"--'---,
Vee' MV
0.71---.,.----".--- V. • 2.0V
~~ 0'4E~~~~~
§
:----...
TA -TEMPERATURE-"C
IF - FORWARD INPUT CURRENT - rnA
Figure 2. Output Voltage vs. Forward
Input Current.
,
r-- -...
1.2
0
w
I\..
~ --.
1.0
>
-
Figure 7. Propagailon. Delay vs.
Temperature.
Electrical Characteristics
(Over Recommended Temperature, TA = O'Cto +70'C, Unless Otherwise Noted)
Parameter
Symbol
High Level Output Current
Low level Output Voltage'
Typ."
Max.
Units
10H
20
250
I1A
VOL
0.4
0.6
V
V
Input Voltage
Min.
VI
Input Reverse Voltage
VR
Test Conditions
Vee" 5.5V, Va = 5.5V
1,=250 /.lA, VE=2.0V
Vcc=5.5V,I,=5 rnA
Ve 2•.oY,
10 L (Slnking)=13 rnA
2.0
2.4
2.3
2.7
0.75
0.95
V
-2.0
rnA
Vec=5.5V, VE=0.5V
rnA
Vec=5.5V, VE=2.0V
Low Level Enable Current
IEL
-1.4
High Level Enable Current
IgH
-1.0
High level Enable Voltage
VEH
2.0
Figure
Note
4
2,5
1,=5mA
3
1,?60mA
3
IR=5 rnA
10
V
Low Level Enable Voltage
VEL
0.8
V
High Level Supply Current
leeH
10
15
rnA
Vce=5.5V, 1,=0,
VE=0.5V
Low level Supply Current
ICCL
16
19
rnA
Vec"5.5V, 1,=60 rnA
VE=0.5V
CtN
90
pF
V,=O, f"'l MHz,
(PIN 2·3)
p.A
45% RH, t = 5s,
V'.O""3 kV dC,TA= 25°C
2,11
RH$50%t"" 1 MIN
12
Input Capacitance
Input·Output Insulation
I
1
I,·a
OPT010
2500
Visa
VRMS
Resistance (lnput·Output)
R,_o
10 12
n
Capacitance (lnput·Output)
CI-O
0.6
pF
V,_0=500V
2
f'" 1 MHz
2
--All typical values are at Vee = 5V, TA = 25'e.
Switching Characteristics
(TA" 25°C, Vec" 5V)
Parameter
Symbol
Typ.
Max.
Units
Propagation Delay Time to
High Output Level
tpLH
45
75
ns
Propagation Delay Time to
Low Output Leve'
tpHL
45
75
ns
Output Rise Time (10-90%)
tr
25
Output Fall Time (90-10%)
tf
25
ns
Propagation Delay Time of
Enable from VEH to VEL
tELH
15
ns
Propagation Delay Time of
Enable from VEL to VEH
tEHL
15
Common Mode
Transient Immunity
at High Output Level
ICMHI
Common Mode
Transient Immunity
at Low Output Level
ICMLI
Min.
2602
1000
2612
3500
2602
1000
2612
3500
10,000
10,000
9-45
Test Conditions
Figure Note
6
3
6
4
10
5
10
6
VO(MIN)=2V
RL'" 350.0
1,=OmA
12
7,9
VO(MAX) "'0.8 V
RL = 350.0
1,=7:5mA
12
8,9
RL'" 350!)
CL = 15pF
1,= 7,5mA
ns
RL = 350!), CL = 15 pF.
1,= 7.5 rnA. VEH =3V,
VEL = OV
Vlp.s
VcM =50V
Vips
VCM= 300 V
VI!J,s
VCM=50V
Vips
VCM=300V
80
E
240 r--r"'v.:-cc~=-:5-:.0:-:V~-"~-"-"---'
1m 1!11.5mA tt
70
I
>
'"
60
9
Z
50
~
40
..J
;::
:::
uI
ii:
I
30
"
20
OutputVo
II::~~~~~~~::=j
.
0
I
so
~
!;;
If
RC
w
::;
W
0
40l--+--~~~~--
00t:~10t::120:::3!0:::40r::J6EO::6tO::j70
TA - TEMPERATURE _ °C
11 - PULSE IN!:'U:r CURRENT - rnA
Figure 8. Propagation Delay vs. Pulse
Input Current.
Figure 9. Rise, Fall Time vs.
Temperature,
Figure 10. Test Circuit for tEHLand tELH'
70
~ 12000 F=F=F=F=F=F=F=F=F=1=:::::J
5
60
0
Z
50
~ 10000
i
40
!tpLH for proper operation. A NOR flipflop has infinite CMR for POSITIVELY sloped transients
but requires tpHL < tpLH for proper operation. An
exclusive-OR flip-flop has infinite CMR for common mode
transients of EITH ER polarity and operates with either
tpHL > tpLH or tpHL tpLH, so NAND gates are preferred in the R-S
flip-flop. A higher drive amplitude or different circuit
configuration could make tpHL
tpLH or tpHL--r~~~-o
I
I
I
I
I
EXCLUSIVE-OR FLIP FLOP
Figure d. Flip Flop Configurations.
9-48
NAND flip flop tolerates
simultaneouslV HIGH
. inputs; NOR flip flop
tolerates simultaneously
LOW inputs; EXCLUSIVE·
OR flip flop tolerates
simuttanaously HIGH OR
LOW inputs without
causing either of the
outputs to change.
FliOW
DUAL TTL
COMPATIBLE
OPTOCOUPLER
HEWLETT
a.!~ PACKARO
+3
V~' 2
NOTE:
HCPL-2630
01JTLINE DRAWING
Vee
vo,
:::::::
:,: "*~
8765
vo,
I
I
PINm-;-,T"T":;'2"""":;'3T"T-;-r4-'
ONE,)
L------+--<~-_o GND
_
~~COQNITION
!UQ~
i
The HCPL-2630 can be used in high speed digital interface
applications where common mode signals must be rejected
such as for a line receiver and digital programming of floating
power supplies, motors, and other machine control systems.
It is also usefull in digital/analog conversion applications, like
compact disk players, for noise elimination.
The open collector output provides capability for bussing,
strobing and "WIRED-OR" connection. In all applications, the
dual channel configuration allows for high density packaging,
increased convenience and more usable board space.
5' TYP ••
~'t
........1 1_,.78 1.0701 MAX.
___ 1.19(,0471 MAX.
ANODE,
1
4.701.1851 MAX.
I t lo.51 I
4
II
CATHODE,
2
(.0201
I
MIN.
¢ATHOOE2
~.9Z {.1151 MIN.
~ ~ -11,65 (.025) MAX.
ANOOE
~
I- I- g£I!
2.80 (.1101
4
'-01..-_ _--1:-"'"
DIMENSIONS IN MI Ll.lMnRES AND {INCHESI,
Recommended Operating
Conditions
Input Current, Low Level
Eaeh Channel
Input Current, High Level
Each Channel
Supply Voltage, Output
Fan Out (TTL Load)
Each Channel
Operating Temperature
The HCPL-2630 consists of a pair of inverting optically coupled
gates each with a GaAsP photon emitting diode and a unique
integrated detector. The photons are collected in the detector
by a photodiode and then amplified by a high gain linear
amplifier that drives a Schottky clamped open collector output
transistor. Each circuit is temperature, current and voltage
compensated.
This unique dual coupler design provides maximum DC and
AC circuit isolation between each input and output while
achieving LSTTL/TTL circuit compatibility. The coupler
operational parameters are guaranteed from 0° C to 70° C,
such that a minimum input current of 5 mA in each channel
will sink an eight gate fan-out (13 mAl at the output with 5
volt Vee applied to the detector. This isolation and coupling
is achieved with a typical propagation delay of 55 nsec.
I
_
Features
Description/Applications
\
736 1.290) 660 I 2601
7JjjjDWI
• LSTTL/TTL COMPATIBLE: 5V SUPPLY
• HIGH SPEED: 10 MBd TYPICAL
• LOW INPUT CURRENT REQUIRED: 5 mA
o GUARANTEED PERFORMANCE OVER
TEMPERATURE
• HIGH DENSITY PACKAGING
o RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vae, 1 MINUTE AND
2500 Vae, 1 MINUTE (OPTION 010).
.---u-
•
TYPE NUMBER
DATE CODE
Sym,
Min.
Max.
Units
IFL
0
250
pA
IFH
VCC
4.5
16
6,5
mA
V
0
70
6.3·
S
N
TA
·c
Absolute Maximum Ratings
(No derating required up to 70°C)
Storage Temperature ..•........•..... -55°C to +125·C
Operating Temperature ... , .•.... ,',., .•. DoC to +70°C
Lead Solder Temperature ..... , ...• , ...• , . 260°C for 10s
(1.6mm below seating plane)
Peak Forward Input
Current (each channel) ..... 30 mA (<;; 1 msec Duration)
Average Forward Input Current (each channel) ..... 15 mA
Reverse Input Voltage (each channel) .•... , .... , , . . .. 5V
Supply Voltage - Vee ...... ".. 7V (1 Minute Maximum)
Output Current - 10 (each channel) ..• , •.•...... , 16 mA
Output Voltage - Vo (each channel) ...•. , .. ,....... 7V
Output Collector Power Dissipation ....• ,....... 60 mW
*6.3mA condition permits at least 20% eTR degradation guardband.
Initial switching threshold is 5mA or less.
9-49
Electrical Characteristics
OVER RECOMMENDED TEMPERATURE (TA
Parameter
Symbol
= O°C TO 70°C) UNLESS OTHERWISE NOTED
Min.
Typ.** Max.
Units
Figure
Test Conditions
High Level Output Current
IOH
2
250
IJA
Vee" 5.5V, Vo '" 5.5V,
IF = 250IJA
Low Level Output Voltage
VOL
0.5
0.6
V
Vce "5.5V, IF = 5mA
IOl (Sinking) = 13mA
High Level Supply Current
leeH
14
30
rnA
Vee = 5.5V, IF = 0
(Both Channels)
Low Level Supply
leCl
28
36
rnA
Vec = 5.5V, If' = lOrnA
(Both Channels)
Input-Output Insulation
11-0
1
,..A
45% RH, t "" 5$,
VI-O "" 3 kV dc, TA '" 25°C
J OPT 010
Resistance (I nput·Output)
Vise
Capacitance (Input-Output)
RI-o
CI_O
Input Forward Voltage
VF
YAMS
RHS50%t=1 MIN
10 12
n
VI-O
0.6
pF
f= lMHz, TA '" 25°C
2500
1.5
3
3
3
4,9
10
4
500V, T A = 25°C
4
IF = 10mA, TA '" 25°C
V
I A '" 101JA, T A = 25°C
60
pF
VF=O,f=lMHz
3
0.005
JJ.A
Relative Humidity'" 45%,
t=5s, VI_I=500V
8
VH '" 500V
f= lMHz
8
pF
%
IF '" 5.0mA, RL = lOOn
BVR
Input Capacitance
CIN
Input-Input Insulation
Leakage Current
II-I
Resistance (Input-Input)
RI.I
1011
n
Capacitance (I nput-Input)
CI-I
CTR
0.25
700
5
4
7,3
V
1.75
I nput Reverse Breakdown
Voltage
Current Transfer Ratio
=
Note
8
2
6
** All typical valUes are at VCC = 5V, TA = 25°C
Switching Characteristics at TA=2SoC,VcC=SV
EACH CHANNEL
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Figure
Note
Propagation Delay Time to
High Output Level
tplH
55
75
ns
RL = 350 n, Cl '" 15pF,
.IF =7.5mA
6,7
1
Propagation Delay Time to
Low Output Level
tPHL
55
75
os
Rl " 350 n, CL
IF =7.5mA
6,7
2
Pulse Width Distortion
tPHL - tpLH
10
ns
Rl '" 350 n, Cl
If' '" 7.5mA
Output Rise Time (10-90%)
OUtput Fall Time {90-10%l
Common Mode Transient
Immunity at High Output Level
tr
50
tf
20
ns
ns
Rl '" 350 n, Cl = 15pF,
IF =7.SmA
VCM " 10Vp _p ,
Rl" 350 n,
Vo (min.) '" 2V, IF '" OmA
9
5
9
5
Common Mode Transient
Immunity at Low Output Level
NOTE:
ICMHI
100
V/p.s
ICMLI
300
VIp..
15pF,
C
~
VeM '" 10Vp _p,
Rl" 350 n,
Vo (max.) '" O.BV
IF'" 7.5mA
15pF,
It is essential that a bypass capacitor I:01IlF to O.lIlF, ceramicl be connected from pin 8 to pin 5. Total lead length between both
ends of the capacitor and the isolator pins should not exceed 20mm. Failure to provide the bypass may impair the switching properties (Figure 5),
9-50
---~-.---------------
NOTES:
1. The tpLH propagation delay is measured from the 3.75 rnA point
on the trailing edge of the input pulse to the 1.5V point on the trail-
Vee"'- 5,OV
iA" 2S2.0V). Common mode transient. immunity
in Logic Low level is the max imum tolerable (negative) dV CM/dt on
RL
35iffi
/lkfl
~41d]
/V'
'(
IF - INPUT DIODE FORWARD CURRENT .• rnA
the trailing edge of the common mode pulse signal, VCM, to assure
that the output will remain in a Logic Low. state (i.e., VOo-~
+5V
~ChanB
rr---+-~--o+5V
7404
CMnA----,L________~
Chan B
---+,-'
1
• I
470n
tDL '" 50 ns (delay in response to
,
logiC low lavel input)
~'tDH = 30 m
.01j.tF
BYPASS
(delay in response to
logic high level input)
TA-2S g C
Figure 8. Response Delay Between TTL Gates.
t, '" 160115
tf" 55n5
~~------~-o+5V
350n
Vo
Vo ---_~
..- - - - - - - 5V
SWITCH AT A: IF"" OmA
VeM
Vo
+ Il}----.......,
-----------~VOL
SWITCHATB: IF ;o7.SmA
PULSE GEN.
Figure 9. TIIIit Circuit for Transient Immunity and Typical Waveforms.
9-52
Fhdl
HEWLETT
.:~ PACKARD
DUAL CHANNEL
HIGH CMR HIGH SPEED
OPTOCOUPLER
:,: '" *leo .-__
OUTLINE DRAWTNG
1
----.--..:.--'cc--.,.--o :::
2'
_~('310'_!
B
1
6
I
IF2
+ -
o:J:lr:Di3)"J:.
I
·.--~~-~~~=1
I
rnCiWI
VF2J~
3
5
TYPE NUMBER
I
DATE CODE
6.101d1Q!
1.36 (.2901 6.60 (.2601
I
4
O.lHOO]}
1
9.90 (.390)
I
-
HCPL-2631
HCPL-4661
~T"T-;;-r'''''-:;-''''''..,.-J ~~COGNITION l
I
-
=::!S~~-
7
I
I
I
5
L - - - - J - - -__~~---oGND
NOTE,
A ,01 TO 0.1 ~F BYPASS CAPACITOR MUST BE
CONNECTED BETWEEN PINS BAND 5. SEE NOTE 1.
ANODE1 1
I 4.70 (.1861 MAX.
i "l
Figure 1. Schematic
Features
rl -
0.75 (.0301
1.40~)
• INTERNAL SHIELD FOR HIGH COMMON
MODE REJECTION (CMR)
I
I
--~--.
t lo.51 1.0201CATHODE,
f
II --c:...
2
MIN. CATHODE 2 3
2.92 1.1151 MIN.
, - -0.66 [.025) MAX.
MlODE. 4
I_I-- ~
(.0901
2.80 (.110)
' -_ _- - f
DIMENSIONS IN MI L~!.~ETRES AN~ !iNCH"SI.
2631 = 1000 VIJ.ls
• LSTTL AND TTL COMPATIBLE
receivers in environmen1s that conventional line receivers
cannot tolerate. The HCPL-263114661 can be used for the
digital programming of machine control systems, motors,
and floating power supplies. The internal shield makes the
HCPL-2631/4661 ideal for use in extremely high ground or
induced noise environments.
• GUARANTEED PERFORMANCE OVER
TEMPERATURE O°C to 70°C
Applications
4661
= 3500
VIJ.ls
• HIGH DENSITY PACKAGING
• HIGH SPEED: 10 MBd TYPICAL
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vae, 1 MINUTE AND
2500 Vae, 1 MINUTE (OPTION 010).
• COMPUTER-PERIPHERAL INTERFACES
• 6N134 COMPATIBILITY
• GROUND LOOP ELIMINATION
• MICROPROCESSOR SYSTEM INTERFACES
• ISOLATED LINE RECEIVER
• DIGITAL ISOLATION FOR AID, D/A CONVERSION
Description
The HCPL-2631/4661 are dual channel optically coupled
logiC gates that combine GaAsP light emitting diodes and
integrated high gain photodetectors. Internal shields provide a guaranteed common mode transient immunity specification of 1000Vl}.Ls with the HCPL-2631, and 3500Vl}.Ls
with the HCPL-4661. The unique design provides maximum
DC and AC circuit isolation while achieving LSTTL and
TTL logic compatibility. The logic isolation is achieved
with a typical propagation delay of 40 nsec. The dual
channel design saves space and results in increased
convenience.
The HCPL-2631/4661 are recommended for high speed
logic interfacing, input/output buffering and for use as line
Recommended operating
Conditions
Sym,
Min. Max. Units
Input Current, Low Level
}.LA
250
Each Channel
0
IFL
Input Current, High Level
6.3'
15
mA
Each Channel
IFH
V
4.5
5.5
Supply VoltaQe. Outout
Vee
Fan Out (TTL Load)
8
Each Channel
N
QC
70
Operating Temperature
0
TA
'6.3 mA condition permits at least 20% eTR degradation
guardband. Initial switching threshold is 5 rnA or less.
9-53
Absolute Maximum Ratings
(No derating required up to 70· C)
Storage Temperature .•.............. -55·C to +125·C
Operating Temperature ................. O·C to +70·C
Lead Solder Temperature ...........•... 260·b for 108
(1.6 mm below seating plane)
Average Forward
Input Current (each channell ...... 15 mA (See Note 2)
Reverse Input Voltage (each channell ...........•.. 5 V
Supply Voltage - Vee ........ 7 V (1 Minute Maximum)
Output Current - lo.(each channell ............ 16 mA
Output Voltage - Vo (each channell .......•........ 7 V
.Output Collector Power Dissipation
(each channel) .............................. 40 mW
Electrical Characteristics
(Over Recommended Temperature, TA'= O· C to +70· C, Unless Otherwise Noted)
Symbol
Parameter
Low Level Output Voltage
High Level Output Current
High Level Supply Current
Low Level Supply Current
Input Forward Voltage
Input Reverse Breakdown
Min.
Max.
Units
3
4
3
5
3
0.6
V
10H
20
250
p.A
Vee -= 5.5V, Vo" 5,5 V.
JF=250,.A
leeH
20
30
mA
Vee 5.5V, IF = O.
(Both Channels)
JeeL
30
38
mA
Vee = 5.5V,IF 10 mA,
(Both Channels)
Vr:
1.5
1.75
V
IF= 10 mAo TA=25°C
V
IR""10}1A. TA=25°C
3
VF =0. f= 1 MHz
3
I
5
CIN
60
pF
AVF
-1.6
mVl"C
ATA
1
11-0
2500
VISO
Input-Input Leakage
Current
p.A.
VRMS
h-1
• 0.005
RI-I
CI_I
1011
Capacitance (Input-Input)
Resistance (lnput.Qutputl
RI-Q
0.25
1012
CI-O
0.6
Capacitance 2.0 VI.
10.CML is the maximum tolerable rate of fall of the common
mode voltage to assure that the output will remain in a low
logic state (i.e., VOUT > O.B VI.
NOTES:
1. Bypassing of the power supply line is required, with a 0.D1
}.IF ceramic disc capacitor adjacent to each isolator as illustrated in Figure 14. Total lead~length between both ends of
the capacitor and the isolator pins should not exceed 20
mm. The power supply bus for the isolator(s) should be
separate from the bus for any active loads, otherwise a
larger value of bypass capacitor (up to 0.1 "F) may be
needed to suppress regenerative feedback via the power
supply. Failure to provide the bypass may impair the switching properties.
2. Peaking circuits may produce transient input currents up to
50 rnA, 50 ns maximum pulse width, provided average current does not exceed 15 rnA.
3. Each channel.
4. Measured between pins 1, 2, 3, and 4 shorted together, and
pins 5, 6, 7, and 8 shorted together.
5. This is a proof test. ~This rating is equally validated by a 2500
Vac, 1 sec. test.
6. Measu'red between pins 1 and 2 shorted together, and pins 3
and 4 shorted together.
>
0.8
.~g
0.7
~
0.5
...
~
o
.J
w
~
~
I
:III
~
>
40
15
It
4.0
It
::>
w
'~"
5.6~
Veel •
Vo • 5.6V
~
1~'~A/
\.
CJ
0
oJ
w
2.0
'"
"
~
::>
20
r---...
oJ
l:
'"I
;:
1.0
-
• 260pA
t'-..
~
0
I
/
~l~ 'U:nA/ / /
30
5
3.0
0
...>
...::>~
0.3 '-1 ' 12.BmA
0
O. 1 0
"....
I
10 ' 16.0..A
0.2
12. As illustrated in Figure 14, the Vee and GND traces can be
I,ocated between the input and the output leads of the
HCPL-263114661 to provide additional noise immunity at the
compromise of insulation capability.
13. See Option 010 data sheet for more information.
5.0mA
0.4
~
= ,.fCMVCM (p-p)
I
"'I J
0.6
1d~~MI )
max
5.0
v~. 5.~V
I
w
11. For sinusoidal voltages, (
10
r--. r-.....
:r
.SJ
10
20
30
40
50
10
70
60
20
30
40
50
60
70
6.0
TA - TEMPERATURE -"C
TA - TEMPERATURE _DC
IF - FORWARD INPUT CURRENT - rnA
Figure 2.
Low Level Output Voltage vs.
Temperature
Figure 3.
Output Voltage
Input Current
VS.
Forward
Figure 4.
80
+SV
~
I
70
~
60
>
I
0
::>
2
0
Vee - S.OV
IF
E
~
It
It
JII:
7.5mA
;::
CJ
o
~"
0
It
~
It
.
It
~
*Ct. is approximately 15 pF, which includes
I
-t- r---
probe and stray wiring capacitai1ca.
::PUT~_ 1.30
1.40
1.50
V F - FORWARD VOLTAGE - VOLTS
Figure 5.
High Level Output Current
Temperature
VS.
Input Diode Forward
Characteristic
--I
'PHL
'F"'7.5mA
-
--
I--
I
~
20
-IF -3.7SmA
I
10
'PLH
Figure 6.
:
______
Figure 7.
SO
Propagation Delay vs.
Temperature
9-55
--
40
--~.1.SV
Test Circuit for tpHL and
tpLH' Note 3
~-~
30
TA -TEMPERATURE-"C
~
I
OUTPUT
Vo
20
-----~-----------
60
70
210,--,---,---,--,....-,,--r-..,
Vee ·6.0V
~
200~-4~~--~~~~
TA • 26'C
80
I
...w~
70
c
zQ
80
~
50
0
40
I
30
'~"
Output Vo
Monitoring
l!jt:~~~!!t-""",----ONoda
IE
".
OV~·
5V SWITCH AT A: I, • 0
12
CM
H
20
18
16
14
SWITCH AT B: IF = 7.5 rnA
TA - TEMPERATURE -'C
I, - PULSE INPUT CURRENT - rnA
Figure 8.
Figure 9.
Propagation Delay vs.
Pulse Input Current
1\- -
Vo 0.5 V
Rise, Fall Time vs.
Temperature
Vo (max.)
Figure 10. Test Circuit for Common
Mode Transient Immunity
and Typical Waveforms. Note 3
12000
Vee·S.OV
IFH • 7.SmA
~;OOOO
-
ZZ
o=>
n
6000
~~
4000
I-
2000
"l!i0:
I
I
VOH " 2.0V
~~ 8000
8;:
CHANNEL 1 SHOWN
r----------,
'FL ,. OmA
>
j!ll
VOL' O.BV
TA .. 26"C
11
_~ANOCMrn
I
1
J
GN01~.-~-----~~
I I I
111
I
200
600
400
V eM -
'OIODE 01 11N916 OR EQUIVALENT) IS NOT REQUIRED FOR UNrrSWITH OPEN COLLECTOR OUTPUT.
V
Figure 11. Common Mode Transient
Immunity vs. Common Mode
Transient Amplitude
w
1.4
1.3
~~
1.2
8~
~~
j:US
1.
VOH "
VOL w
IFH •
1Ft. ;,.
1 ........
~~ 1.0
.9
-k1~
.8
" "I
.7
2.0V ______ LGND BUS (BACK)
O.8V
7.5",A0 rnA
RL • 350R -
,~
'
0:1-
I
Figure 12. Recommended TTL/LSTTL to TTLILSTTL Interlace Circuit
Vc~' Soolv
C
~~
~~--~--4-~~---t---GN02
1000
600
COMMON MODE
TRANSIENT AMPLITUOE -
5V VCC2
~I
I-- ilL • 350R
"
I
18
.......
~~==~~==~~==~OUTPUTI
........
==~'> O.UTPUT 2
I'.....
['..
a
10
20
30
40
50
60
70
NOTES 1.12
TA - TEMPERATURE -'C
Figure 13. Relative Common Mode Transient
Immunity vs. Temperature
Figure 14. Recommended Printed Circuit Board Layout
9-56
rh~
~~
6N135
6N136
HIGH SPEED
OPTOCOUPLERS
HEWLETT
PACKARD
HCPl·2502
HCPl·4502
I
OUTLINE DRAWING'
SCHEMATIC
~ 8
r - - - - - - - O Vee
2
TVPI; NUMBER
bATE CODE
i
ANODE
6,10 ('240)
7.36 f.290J
7.88 C:ITO)
6.65 (.260)
CATHODE
"""'3;-r-"4r ~~COGNITION 1__!__.---.;==5.=Ty~~' t
~
I~
~>--F
~
_ _ _-....J
5
t
1_,.781.070' MAX.
..-.- 1,'9 (,041' MAX.
L------o
7
*4.10 !.l8S! MAX.
I
!
I
r-I 1-
II
ANODE 2
MIN,
CATHODE 3
~ 2.921.1151 MIN.
- j .......... 0,65 ('025) MAX-
0.76 COSOl
I
1.40 (iiGS)
j-~
;:;6 ~:~~i
NC 4
'------'
•
•
Video Signal Isolation
Line Receivers - High common' mode transient immunity
(>1000V/",sl and low input-output capacitance (0.6pFI.
o
High Speed logic Ground Isolation - TTL/TTL, TTLIL TTL,
TTL/CMOS, TTL/LSTTL.
o
Replace Slow Phototransistor Isolators - Pins 2-7 of the
6N135/6 series conform to pins 1-6 of 6 pin phototransistor
couplers. Pin,8 can be tied to any available bias voltage of
1.5V to 30V for high speed operation.
Features
•
•
•
o
o
""
Applications
OIMf:NSIONS INMILL1METRESAND {fNCHES},
o
VB
GND
** Note: For HCPL-4502, pin 7 is not connected.
NC 1
i
l0.511 020'
6
~----------==--'¥
HIGH SPEED: 1 Mbitls
TTL COMPATIBLE
HIGH COMMON MODE TRANSIENT IMMUNITY:
>1000VlfLS TYPICAL
9 MHz BANDWIDTH
OPEN COLLECTOR OUTPUT
RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
Description
These'diode-transistor optocouplers use an insulating layer
between the light emitting diode and an integrated photon
detector to provide electrical insulation between input and output. Separate connection for the photodiode bias and output
transistor collector increases the speed up to a hundred times
that of a conventional photo-transistor coupler by reducing the
base-collector capacitance.
The 6N135 is for use in TTL/CMOS, TTLILSTTL or wide
bandwidth analog applications. Current transfer ratio (CTRI for
the 6N135 is 7% minimum at IF = 16 mA.
The 6N136 is designed for high speed TTLITTL applications. A
standard 16 mA TTL sink current through the input LED will
provide enough output current for 1 TTL load and a 5.6 kG pullup resistor. CTR of the 6N136 is 19% minimum at IF 16 mA.
=
The HCPL-2502 is suitable for use in applications where
matched or known CTR is desired. CTR is 15 to 22% at IF = 16 mA.
The HCPL-4502 provides the electrical and switching performance of the 6N136 and increased ESD protection.
*JEDEC Registered Data (The HCPL-2502 and HCPL-4502 are not
registered.)
Replace Pulse Transformers - Save board space and
weight.
o Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.
o
Absolute Maximum Ratings
Storage Temperature" ... , .............. --55°C to +125°C
Operating Temperature" ................. --55°C to 100°C
Lead Solder Temperature" ................. 260°C for 10s
(1.6mm below seating plane)
Average Input Current - IF" ..................... 25mAI11
Peak Input Current - IF" ....................... 50mAI 2 1
(50% duty cycle, 1 ms pulse widthl
Peak Transient Input Current - IF' .................. 1.0A
(:O;1",s pulse width, 300ppsl
Reverse Input Voltage - VR' (Pin 3-21 ................. 5V
Input Power Dissipation" ........................ 45mWl 3 1
Average Output Current - 10" (Pin 61 ................ 8mA
Peak Output Current" ............................ 16mA
Emitter-Base Reverse Voltage" (Pin 5-7, except -45021 ... 5V
Output Voltage" - Va (Pin 6-5) ............... -0.5V to 15V
Supply Voltage" - Vee (Pin 8-5) ..........•... -0.5V to 15V
Output Voltage - Vo (Pin 6-5) ............... --D.5V to 20V
Supply Voltage - Vee (Pin 8-5) .............. --D.5V to 30V
Base Current - IB" (Pin 7, except HCPL-45021 . . . . . . .. 5mA
Output Power Dissipation" ..................... 100mWI 4 1
CA UTlON: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which may
be induced by ESD.
See notes, following page.
9-57
Electrical Specifications Over recommended temperature (TA = O°C to 70° C) unless otherwise specified.
Parameter
Sym.
CTR'
CTR
VOL
Logic High
Output Current
6Nl36
HCPL-4502
19
24
15
18
HCPL-2502
6Nl35
Current Transfer Ratio
Logic Low
Output Voltage
Min.
7
TYP....
6N135
Device
6N136
HCPL-4502
Max.
5
19
15
25
%
%
%
IF = l6mA, Vo '" 0.5V. Vee = 4.5V
6N135
0.1
0.4
V
IF'" 16 mAo to'" 1.1mA, Vee"" 4.5V.
TA=25°C
8Nl36
HCPL-2S02
HCPL-4502
0.1
0.4
V
3
500
nA
1
p.A
0.01
50
10H
50
leoL I
IF "'OmA. Vo '" Vee'" 15V
IF'" OmA, Vo - Open. Vee'" l5V
TA=25·C
p.A
Input Forward Voltage
leCH
VF'
1.5
2
1.7
Il A
V
Temperature Coefficient
of Forward Voltage
J.VF
J.TA
Input Reverse
Breakdown Vollage
aVR'
Input capacitance
CIN
Input-Output
Insulation
It-o'
mV/'C
5
60
1,"'16mA, TA=2S'C
V
IR = lOIlA. TA = 25'C
pF
f= lMHz, VF =0
!l
2500
VRMS
OJ-o
0.6
pF
t~1MHz
Trenslstor 00
Current Gain
hFE
150
-
Vo=5V,10=SmA
Sym,
Propagation Delay
Time to Logic High
at Output
Common Mode Translenllmmunity at Logio
High Level Output
Common Mode Translenllmmunityat Logic
Low Level Output
tPLH'
e
e
e
Max,
Units
0.2
1.5
!'S
RL =<4.1kO
6N136
HCPL-2502
HCPL-4502
6N135
0.2
0.8
liS
RL=1.9kH
1.3
1.5
!'s
6Nl36
HCPL-2502
HCPL-4502
0.6
0.8
6N135
1000
6NiS6
ICMHI HCPL-2502
HCPL-4502
6N135
6N136
ICMLl HCPL-2502
HCPL-4502
BW
Bandwidth
Noles:
tPHL'
,,5
Vlp.s
1000
I
VIliS
Test Conditions
Vlp.s
VCM = 10Vo_D-, RL = 4.1k!l
VI!,s
VCM'" 10Vp _p , RL '" 1.9k!l
MHz
See Test Circuit
8.
9.
10.
11.
12.
13.
9-58
Note
5,9
8.9
5,9
8,9
10
7,8,9
10
7,8.9
8
10
IF'" OmA. VCM = 10 Vo-n, RL'" 4.1kll
IF'" 0 m, VCM '" 10 V p_p, RL
1000
9
Fig.
RL=4.1kn
RL = 1.9kH
1000
Derate linearly above 700 free-air temperature at a rate of 0.8 rnA/DC.
Derate linearly above 70 0 free-air temperature at a rate of 1.6·mAl~C.
Derate linearly above 70 0 e free-air temperature at a rate of 0.9 mwrc.
Derate linearly above 70 0 free-air temperature at a rate of 2.0 mW/o C.
CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10, to
the forwarc;l LEO Input current, IF, times 100%.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5,
6, 7, and 8 shorted together. .
' .
,
7. Common mode transient immunity In Logic High level is the maximum tolerable
(positive) dVCM/dt on the leading edge of the common mode pulse, VCM' to assure that
the output w,I." remain In a Logic High state (I.e., Va > 2.0 V). Common mode transient
1.
2.
3.
4.
5.
"All typicals at TA = 25° C
Typ.··
Min,
13
6
Vee =5V,IF= 16mA, unless otherwise specified
6N135
Device
6,11
6
'For JEDEC registered parts.
Switching Specifications at TA = 25°C
Parameter
3
1012
IlA
5
IF=16mA
Capacitance
(Input-Outpull
Propagation Delay
Time to Logic Low
at Output
5.12
IF '" OmA, Vo = Open, Vce '" 15V
45% RH. I - 5s, VI.O = SkV dc,
TA=25·C
RH S 50%. t - 1 min.
VI-o - 500Vdo
1
VISO
RI-o
1.2.4
6
IF = 16mA. Vo = Open. Vee'" 15V
1
-1.6
IF -OmA. Vo ~ Vee =MV
TA=2S·C
IF = OmA, Vo = Vee'" 15V
TA=25·C
p.A
0.02
OPT. 010
Resistance (Input-Outpull
Note
IF'" l6mA, 10 =2.4mA. Vee "'4.5V.
TA"'2SoC
p.A
ICCH'
Logic High
Supply Current
Fig.
IF"" l6mA, Vo =0.4V, Vee =4.5V
TA=25°C
%
%
22
lOH'
Logic Low
Supply Current
Test Condltlons
Units
18
=1.9kll
immunity in Logic Low level is the maximum tolerable (negative) dVCM/dt on the
trailing edge of the common mode pulse signal, VCM, to ass.ure that th~ output will
remain in a Logic Low state (I.e., Va < 0.8 V).
T~~ 1.9 kn load represents 1 TTL u~it load of 1.6 rnA and the 5.6 kn pull-u'p resistor.
The 4.1 kU load represents 1 LSTTL unit load of 0.36 rnA' and 6.1 kn pull-up resistor.
The frequency at which the ae output voltage is 3 dB below its maximum value.
The Is a proof test. This rating is equally validated by a 2500 Vac', 1 sec. test.
-The JEOEC registration for the 6N136 specifies a minimum CTR of 15%. HP guarantees
a minimum CTR of 19%.
See Optidn 010 data sheet for more Information.
---"'-" ----
TA' 2!>C
10 -Veo·S.OV
........ .... ....
-
I
ffi
"
I::l
-- ----
~I
a:
a:
::l
----Srlil35
-6111136, HCPL-4502
.,.... .".,.35 mA
....
/
I ,-~/
t'..,."._ ...........
~
1.5.-------,------,------,
.".40 rnA
o
.-
~
_ ...... ..,.,,30
--
a:
a:
w
mj
~
,;?il.\,• • Wlf:i"
_25mA
If
ffi
Vee =5V
TA -25"C
::l
_20mA
~
o
"o
m"*,,
-16mA
Va -OAV
a:
a:
1-
S
._--__I
1.0 I-------l="----J~...........
W
N
:::;
I
E
0.51------tf------+---------l
:!
15 mA
IS2
10mA
IF -smA
o
o
10
0.1 0!:---I.......I-I.J.l.llJ!--.J.......L..u..Ll.I:!I!:-O-...L.-L...L.LJ.J~,t!O·O
20
Vo -OUTPUTVOLTAGE-V
IF -INPUTCURAENT- rnA
Figure 1. DC and I'ulsed Transfer Characteristics.
Figure 2. Current Transfer Ratio vs. I nput Current.
1.1
......
- .. -.
'\
;
I
L..-
I
'3S
-6N13s, HCPL·4S02
~
-,,'"
1.0
_L- sl
........
0.9
-+---+NORMAliZED
1'\,
I, = ISmA
Va '*o.4V
'\.,,
0.8
Vee -5V
T.
= 26"C
\'~
\
0.7
V F - FORWARD VOLTAGE -VOLTS
O.6
-60
-40
-20
20
40
60
TA - TEMPERATURE
Figure 3. Input Current vs. Forward Voltage.
IF·'emA.Vc;e~5.0V
~
0
"
2
0
~
1000
~
....
.... '"
J .l J
_--10-.. . -
I
~
500
::::-:::: ~
-40
I•• 0
iiia:
10+3
::l
10+ 2
~
I
"
/"
40
so
80
10+1
~
100
"a9
10- 1
,/
V
./
............ ~
/
V"
I
:z:
.9 10-2
-50
100
TA - TEMPERATURE _oC
-25
+25
+50
+75
+100
TA - TEMPERATURE - °C
Figure 6. Logic High Output Current vs. Temperatura.
Figure 5. Propagation Delay vs. Temperature.
9-59
. _ - - - - - _...._----- ._._..
~
o
:c
P
t '\
20
140
/
Vo=Vce IIIS.OV
I::l
--- -- ---1--- _1\ ...-
-20
120
10+ 4
I
I-
a:
\LH
if
1
......"" .....
:/
f..;....
0
100
Figure 4. Current Transfer Ratio vs. Temperatura.
- -6N135{R•• 4.1kU)
!---6NI36.HCPL-2502,HCPL-4502 (ft•• '.9knl
I 1500
~
80
-~C
+5
~
~
\.
-5
\
a:
TA ... 2&~C, Al "" loon. Vee "SV
/
/
...-
V
~
-10
"z -15
0.1
..
'l'A"'f!:S"C
.......
I1i
~
\
a:
0
Jill
-20
1.0
11111
10
100
III
f - FREQUENCY - MHz
+12
16
12
r--;::==b!l-t---;-;-""'-tct-:-r-,o
V<>-1r--"T-~----' [!
0,01
!IF
25
IF - QUIESCENT INPUT CURRENT - mA
Figure 7. Sman-8ignal Current Transfer Ratio vs. Quiascant
Input Currant.
TYPICAL
TYPICAL
TYPICAL
TYPICAL
TYPICAL
LINEARITY" +/- 3% AT VIN .. , Vp-p
SNR" 60 dB
RT .. 376 n
Vo de " 3.B V
If .. 9 rnA
Figure 8. Frequencv Response.
I:~
PU\..SE
I
I
5V
I
Va
GEN.
ZO'50n
t,."Sns
l--r---o+5V
1/f< 100PI
I--I--"f-O Va
1.5V
IF MONITOR
Figure 9. Switching Test Circuit ••
10V---.Jt~
OV
1~
-J
1,.
1:
90%
1--1-----0 +5V
tr,t,"Bns
..:.:::'0%::.....-_
"
I--~---ovo
A
Va - - - -....
'--"""
....- - -_ _ _ _ _ 5V
SWITCH AT A: IF"",OmA
IIcM
+ .fl}--~--;
Va --..;..--------~VOL
SWITCH AT B: IF .. '16mA
'JEDEC Registered Data
PULSE GEN.
Figura 10. Test Circuit for Transient I mmunitv and TVPical Waveforms.
9-60
0,01
!IF
+12V
HIGH SPEED
OPTOCOYPLER
SL5505
SCHEMATIC
0.18/.00n
ilTlf.Oi3l-:L
1"
.----=~'='=CC=-o8 vee
2
ANOOE~
'F
VF
CATHODE~
'f4
..l..
K-
--t
+4.70 £.IB5f MAX.
!I
I
"
r-I -
0,76 (,030)
iAO rOSs!
I
I
1 -
-
t
Vo
5
GND
7
ANODE 2
I)""-0,65 (.026). 2.'2£.1151
MIN.
MAX.
1-1- ~:: ~
I,.
NO 1
-to.Sl
£.0201
MJN, CATHODE
10
V.
3
NO 4
'--__..s-
DIMENSIONS It.! MILLIMETRES AND (INCHES).
Absolute Maximum Ratings
Storage Temperature .............. -55·Cto +125·C
Operating Temperature ............. "55·C to 100·C
Lead Solder Temperature ............. 260·C for 10s
(1.6mm below seating plane)
Average Input Current - IF ................. 25mAI 1 1
Peak Input Current - IF .................... 50mAI 2 1
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF ............. 1.0A
(:51 ILs pulse width, 300pps)
Reverse Input Voltage - VR (Pin 3-2) ............. 3V
Input Power Dissipation . . . . . . . . . . . . . . . . . .. 45mW 13 ]
Average Output Current - 10 (Pin 6) ........... 8mA
Peak Output Current ......................... 16mA
Emitter-Base Reverse Voltage (Pin 5-7) ........... 5V
Supply and Output Voltage - Vee (Pin 8-5),
Vo (Pin 6-5) ............................ -0.5V to 15V
Base Current - Is (Pin 7) ............•......... SmA
Output Power Dissipation ................. 100mWI 4 1
Switching Specifications at TA =25°C
Vee = 5V, IF = 16mA, unless otherwise specified
Min.
Max.
Units
tpHL
0.8
p.s
Rl
=1.9kn
7
tpLH
0.8
p.s
RL
=1.9kn
7
Parameler
Symbol
Propagation Delay
Time to Logic Low at
Output (Fig. 1)
Propagation Delay
Time to Logic High at
Output (Fig. 1)
Test Conditions
9-61
-------_._-_._--
_ _._-_ _------_.- - - - - -
.__ .. _._ ...• ..
...
Note
Electrical Specifications (TA = 25°C) unless otherwise specified.
Parameter
Min.
Max.
CTR
15
40
CTR
8
Units
%
%
004
V
Symbol
Test Conditions
Note
Logic High
Output Current
101-1
50
nA
=4.5V
IF = 2mA. Vo '" 5.0V, Vee = 4.5V
IF = l6mA, 10'" 2.4mA, Vee = 4.5V
IF'" Om A, Vo =Vee = 10V
10H
25
p.A
IF = OmA. Vo= Vee'" 10V, TA= 70°C
Input Forward Voltage
VF
1.8
V
Input Reverse Current
IR
50
J.lA
VR='3V
J.lA
45% Relative Humidity. t '" 55
VI-O =' 1500Vdc
n
VI-O
Current Transfer Ratio
Logic Low
Output Voltage
VOL
Inpul-Output Insulation
Leakage Current
Resistance
(Input-Output)
1.0
11-0
Rf-O
109
Transistor DC
Current Gain
hFe
100
Capacitance
CI-O
Breakdown Voltage
Collector/Emitter
V{SR) CEO
Breakdown Voltage
Collector/Base
IF - 16mA. Vo '" OAV, Vee
5
IF = 20mA
6
= 100Vdc
6
400
-
Vo = 5V, 10 = 3mA
1.3
pF
f = 1 MHz
6
22
V
Ie" 10mA
8
V IBR } eBO
40
V
Ie" 10llA
Breakdown Voltage
Emitter/Base
V(SR) EBO
3
V
'10" 10ilA
Collector/Base
Current
leBO
nA
Vea '" 22V
50
Notes:
1. Derate linearly above 70°C free-air temperature at a rate of 0.8mAI DC.
2. Derate linearly above 70°C free-air temperature at a rate of 1.6mAI DC.
3. Derate linearly above 70° C free-air temperature at a rate of 0.9mWfO C.
4. Derate linearly above 70° C free-air temperature at a rate of 2.0mW/o C.
5. CURRENT TRANSFER RATIO is defined as the ratio of output collector current, 10, to the forward LED input current, IF, times 100%.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. The 1.9 Kfl load represents 1 TTL unit load of 1.6 mA and .the 5.6 Kfl pull-up resistor.
8. Duration of this test should not exceed 300!,s.
I:~
va-I,
PULSE
I
I
1
GEN.
I
I
....Z_t?:5_S!'....
)
(SATURATED
RESPONSE)
)
1.5V
~[¥"j -~~I--""'R-L
---<> +5V
1
)
I'------+I-'.j---VOL
tPLH~
10% DUTY CYCLE
1/f
= 100~s
_
r.
'I'
~
I, MONITOR 0------.
E
h
pt--+--.1-Q
...
~-=-
•
Tel: 15pF
..L
lOon
*CL INCLUDES PROBE AND
FIXTURE CAPACITANCE
Figure 1. Switching Test Circuit.
CAUTION: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage andlor degradation which may
be induced by ESD.
9-62
Va
FliO'l
DUAL HIGH SPEED
OPTOCOUPLER
H F:WLETT
a!r..
pACKARD
SCHEMATIC
Of" IliE OItAWING
I-~(~-I
0.90 (.3901
: 8
7
6
HCPL-2530
HCPL-2&31
0.18 (JlO1)
ii.33r.o13i:J.
~------~======.I
5!
T
Type NUMBER!
OATE COOE
6.10 (.240)
7.36 t.2901 iiJij C26O)
j'
7]l! [.3iO)
I
UL
!rT.-T""T':;"1"'''-::-T""T-:rJ
RECOGNITION.
'.,
-
7 v.,
/""------0
4
14.70 L185! MAX.
---
I
II
MIN.
CATHOOE 1
2.92 (.1I5J M'N.
"'IIt-O.651.025~
__
'"
3~
CATHOO-S 1
- l 0 ' S ! {.0201
II
I""'"
t
'.2
./"'----4___.06
V02
5 GND
.......---..1>----0
MAX.
1--1- ~! ::~~~~
ANOO<,
4
1-_ _ _...1
DIMENSIONS IN MILLIMETERS AND CINCHES)
Features
Applications
o HIGH SPEED: 1 Mbitls
•
• TTL. COMPATIBLE
• HIGH COMMON MODE TRANSIENT IMMUNITY:
>1000V/lLs TYPICAL
'
• HIGH DENSITY PACKAGING
o 3 MHz BANDWIDTH
o OPEN COLLECTOR OUTPUTS
o RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac,1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
o 4N55 COMPATIBILITY
•
•
•
•
•
Line Receivers - High common mode transient immunity
(>lOOOV IlLS) and low input-output capacitance (0.6pF).
High Speed Logic Ground Isolation - TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/LSTTL.
Replace Pulse Transformers, - Save board ·space and weight.
Analog Signal Ground Isolation - Integrated photon detector provides improved linearity over phototransistor type.
Polarity Sensing.
Isolated Analog Amplifier - Dual channel packaging enhances thermal tracking. '
'
Description
Absolute Maximum Ratings
The HCPL-2530/31 dual couplers contain a pair of light
emitting diodes and integrated photon detectors with
electical insulation between input and output. Separate
connection for the photodiode bias and output transistor
collectors increase the speed up to a hundred times that of
a conventional phototransisior coupler by reducing the
'
base-collector capaCitance.
Storage Temperature ••.....•......• -SSoC to +12SoC
Operating Temperature ..•..••...•..• -S5°C to +100°C
Lead Solder Temperature . . • . . . • • • . • • .• 260°C for lOs
(1.6mm below seating plane)
Average Input Current - IF (each channel) .... ,. 2SmA[l)
Peak Input Current - IF (each channel) .••.••••. SOmA[2)
(SO% duty cycle, 1 ms pulse width)
Peak Transient Input Current -IF (each channel) .•.• 1.0A
(~llLs pulse width, 300pps)
Reverse Input Voltage - VR (each channel) ..•..•.••• SV
Input Power Dissipation (each channel) . . . • . • •. 4SmW[3)
Average Output Current - 10 (each channel) •••..•• 8mA
Peak Output Current - 10 (each channell ..••••..•• l6mA
Supply Voltage - V cc (Pin 8-S) • • • . • • • . •• - O.SV to 30V
Output Voltage - Va (Pin 7,6-S) .•.•••••. - O.SV to 20V
Output Power Dissipation (each channel) • • • • ..
3SmW[4J
The HCPL~2530 is for use in TTL/CMOS, TTL/LSTTL or
wide bandwidth analog applications. Current transfer ratio
.(CTR) forthe -2530 is 7% minimum at IF = 16 mA.
The HCPL-2531 is designed for high speed TTLITTL
applications. A standard 16 mA TTL sink current through
the input LED will provide enough output curent for 1 TTL
load and a 5.6 kO pull-up resistor. CTR of the -2531 is 19%
minimum at IF = 16 mA.
See notes, following page.
9-63
- - - - - - - - _..... "._ .. ....
"
"
..."._" .. _ - - - - " - - - - -
Electrical Specifications
Over recommended temperature (TA = O°C to 70°C) unless otherwise specified
Parameter
Current Transfer Ratio
Sym.
CTR
Device
HCPL·
Min.
Typ.*"
~
Max.
m
%
%
%
15
0.1
2530
Logic Low
Output Voltage
Logic High
Output Current
VOL
0.5
V
2531
600
nA
TA ~ 26"C,IF1 "IF2=o,
VOl ~ V02" VCC" 5.5V
50
itA
IF1 " IF::!" 0,
VOl" V02" VCC "15V
itA
1FT - IF2 = 16mA
VOl" V02" Open, VCC" 15V
IF1 " IF2" OmA
VOl" V02" Open. VCC" 15V
ICCH
0.06
4
itA
1.6
1.7
V
Input Raverse
Breakdown Voltage
VR
Input Capacitance
CIN
Input·Output
Insulation
1'-0
I
OPT,OlO
Resistance
(lnput-OutpUt)
Capacitance
(lnput·Output)
Input-Input Insulation
Leakage Current
5,6
IF" lSmA, 10 = 1.lmA, VCC "4.5V,
3
Logic High
Supply Cu rrent
Ai'A
1.2
IF ~ TSmA, Vo ~ O.5V, Vec = 4.5V
V
100
AVF
Note
4.6V
0.5
ICCL
VF
~
0.1
Logic Low
Supply Current
Input Forward VolTage
IF ~ lSmA, VO" O.5V, Vec
TA"::!5"C
Fill.
TA~25°C
lOH
Temperature Coefficient
of Forward Voltage
Test Conditions
-1.6
mVfC
V
5
SO
1
2500
V'SO
5
IF" lemA. 10 - 2AmA, VCC =4.5V,
TA=26"C
S
5
5
3
IF" lEimA, TA" 25'C
5
IF "HimA
5
IF" 1altA, TA" 26"c
5
pF
f"1MH2,VF=0
5
pA
45% RH,t w 5s. VI.O= 3kV dC,TA"'25°C
7,13
RH ,,; 50%. t = 1 min.
14
VRMS
RI_O
1012
S1
CI_O
0.6
pF
1= 1MHz
7
11-1
0.005
itA
45% Relative Humidity, t = 5 s
VI_I 500Vdc
a
Resistance (Input-Inputl
fll_1
1011
n
VI_I = 500Vdc
8
Capacitance
( Input-Input)
CI_I
0.25
pF
VI-O
~
7
600Vdc
=
f = lMHz
8
•• All typicals at 25' C.
Switching Specifications at TA = 25°C Vcc = 5V, IF = 16mA, unless otherwise specified
Parameter
Gym.
Propagation Delay
Time To Logic Low
at Output
tpHL
Propagation Pelay
Time to Logic High
at Output
tpLH
Common Mode Tran·
sient ImmunitY at Logic
High Level Output
ICMHI
Common Mode Translent Immunity at Logic
Low Level Output
ICMLj
Bandwidth
Device
HCPL·
Typ.
Max.
Units
2530
0.2
1.5
liS
RL~4.1kS1
2531
0.2
O.S
liS
flL = 1.9kn
2530
1.3
1.5
/.l'
RL =4.1 kn
2531
0.6
0.8
/.lS
RL=1.9kS1
2530
1000
VIps
IF =OmA,RL =4.1 kS1,VCM'"10Vp•p
2531
1000
VIlIS
IF=OmA,RL=1.9kS1, VCM=10Vp-p
2530
1000
Vllts
VCM,"10Vp-p , RL = 4.1kn
2531
1000
Vlp.s
VCM
MHz
RL'" lOOn.
Min.
BW
NOTES:
1.
2.
3.
4.
5.
6.
Derate linearly above 70°C free-air temperature at a rate of O.8mAfC:
Derate linearly above 70°C free-air temperature at a rate of 1.6mAfC.
Derate linearly above 70°C free-air temperature at a rate of O.9mwtC.
Derate linearly above 70°C free-air temperature at e rate of 1.0mW('C.
Each channel.
CURRENT TRANSFER RATIO Is defined as the ratio of output collector
current, 10, to the forward LED input current, IF. times 100%.
7. Device considered a two·terminal device: Pins 1, 2, 3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted together.
3
Test Conditions
=10Vp-p. RL = 1.9kS1
8. Measured between pins 1 and 2 shorted together, and pins 3 and 4
shorted together.
9. Common mode transient immunity in Logic High level Is the maximum
tolerable (positive) dVCM/dt on the leading edge of the common mode
pulse VCM. to assure that the output will remain in a Logic High state
(i.e., Va > 2.0V). Common mode trensient immunity In Logic Low
level is the maximum tolerable (negative) dVCM/dt on the trailing
edge of the common mode pulse signal, VCM, to assure thet the output
will remain in a Logic Low state (I.e .. Vo < a.aV).
10. The 1.9kn load represents 1 TTL unit load of 1.6mA and the 5.6kn
pull·up resistor.
9-64
Fig.
Note
6,9
10,11
5,9
10,11
10
9,10,11
10
9,10,11
8
12
11. The 4.1kn load represents 1 LSTTL unit
load of a.36mA and 6.1 kn pull·up resistor.
12. The frequency at which the Be output
voltage Is 3dB below the low
frequency asymptote.
13. ThiS IS a proof test. This rating is equally
validated by a 2500 Vae, 1 sec. test.
14. See Option 010 data sheet for more
information.
T. -26 C
10
f-- Vee -
_.... --
-- --"" ...---,,S.OV
.......
I/
li
I
ffi
a:
_HCPL·253t
0
~
a:
a:
~
.... _30 mA
I
NORMALIZED
I, ·IGntA
l-
_2SmA
r--
1.0
:i!"'a:
--
¥- - -
""
"~
I-
- - - - - HCPL·2530
_ ...
I
a:
1.5
_40mA
~_35mA
~ ........ ."..
I"r-_ _ t'"'
~
_...
I-
ffi
a:
Vo -MV
Vee ~6V
TA -25"0
a:
"
fil"
20 mA
o
N
::;
0.5
,.'a:"
I
E
15 mA
.
0
10 mA
o
If "'SmA
,
o
10
0.1 .,.0-.....L-1.....L..w...uJ!--.1--'-J...J...u."!1.,.0--'-...L.......1.J.J~1~00
20
Va - OUTPUT VOLTAGE - V
IF -INPUTCURRENT-mA
Figure 1. DC and Pulsed Transfer Characteristics.
Figure 2. Current Transfer Ratio vs. Input Current.
o
~
a:
a:
~
~
a:
I-
!;;
W
a:
a:
""o
~
~
,.
..
a:
o
V, - FORWARD VOLTAGE -VOLTS
0.6 ' - _....._ ......_ ....._ ....._ ....._ ' - - ' - - ' - - ' - - '
-60
-40
-20
20
40
60
80
100 120 140
TA
Figure 3. Input Current vs. Forward Voltage.
-TEMPERATURE_o~
Figure 4. Current Transfer Ratio vs. Temperature.
'F '" 16mA~Vcc '*0.0\1
I- - - .2&30 !RL ~ 4.1kn)
·2531 IRL -1.9kn)
I 15001-- -
I-
~
o
..
c
i
100 0
IE
I
~
600
.,..,.""
l-
",'"
~
1---
, V 1\
1-'/
liLM
~c. ~
I-"'
I-
0
-60
-40
-20
IF -0
......1-......
t'H~
-- -- -20
1---
40
L
I
.1- vo' Vee • 6.OV
V'
~
_l~ ~~
60
80
~
100
/"""
V"
L
V
L
,/
10-2
-50
-25
+25
+50
+75
+100
TA - TEMPERATURE - C·
Figure 5. Propagation Delay vs. Temperature.
Figure 6. Logic High Output Curre.nt vs. Temperature.
9-65
__
------_.
.....
__............_...._ - - -
!ll
I
T. ·21;oc
-5
tF *"16mA
w
'"z
-10
a:
-15
i2
::J
TA • 25°C. nL • 1QQQ,
fil
~CC • 5V
N
:;
"'a:z"
0
/
/
V
-20
-25
-30
..01
0.1
1.0
10
f - FREQUENCY - MHz
+5V o----..~----1
+15V
,,12
16
25
IF - QUIESCENT INPUT CURRENT - rnA
Figure 7. Small-Signal Current Transfer Ratio vs.
Quiescent I "put Current.
Figure 8. Frequency Response.
':~
Vo
PULSE
1
GEN.
I
ZOo
t,'" 5f\~
5V
I
son
1--1~---o
+5V
1.5V
l/f< 100,(15
IF MONITOR
Figure 9. -Switching Test Circuit.
1
VCM
90%
tf
I---t----o
t"t,=1005
t:
A
Vo - - - -.....
'--""
.....- - - - - - - _ 5V
SWITCH AT A: IF= OmA
Vo
+5V
.,:.::10::.,%_ _
-----------~VaL
SWITCH AT B: IF'" 16mA
Figure 10. Test Circuit for Transient Immunity and Typical Waveforms.
9-66
'-'----Ova
----
------~-.--------.~-------------------
lOW INPU'.·CURRE~r,
BIGH GAIN
OPTOeOUPlERS
1
~9.40 1~370)_1 OUTLINE DRAWiNG9.90 (.390;
8
7
+_
51
6
TYPE NUMBER
FJ;;"I XXXX
a!!~ VYWW R.J
I
SCHEMATIC
0.18 {.OOl)
mlF13lJ.
!
I
DATE CODE
6.101240)
7.36 1229.) 6.60 [260}
UL
1.310)
I
ANODE
res
~,...,...".,...,...",,,...,.-;,..., RECOGNITION ~
6N138
6N139
L
3
2
+
Vee
B
~ Icc
IF
VF
.:::;.
10
----~~==~=-
4
CATHODE -
3
---t
II" I
rl 1-
0.76 (.Q301
1,40
(1lSSl
I --
I
I
II
-
NC 1
*4.70 Cla5) MAX,
I ANODE'
I,
t
-t-t
lO.51 (.0201
MIN.
CAtHODE 3
~ 2.92 (.l15) MIN.
1 -0,$5 (.025) MAX.
l-l-- ~:: ~:~~~;
Applications
DIMENSIONS IN MH.l.IMETRESAND INcHES.
•
Features
Ground Isolate Most Logic Families - TTLITTL, CMOS/
TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL
o Low Input Current Line Receiver - Long Line or Party line
• HIGH CURRENT TRANSFER RATIO-2000% TYPICAL
• LOW INPUT CURRENT REQUIREMENT - 0.5 mA
• TTL COMPATIBLE OUTPUT - 0.1 V VOL TYPICAL
o HIGH COMMON MODE REJECTION - 500 V/IJ.S
• PERFORMANCE GUARANTEED OVER TEMPERATURE 0° C 10 70° C
o BASE ACCESS ALLOWS GAIN BANDWIDTH
ADJUSTMENT
• HIGH OUTPUT CURRENT - 60 mA
• RECOGNIZED UNDER THE COMPONENT PROGRAM
OF U.L. (FILE NO. E55361) FOR DIELECTRIC
WITHSTAND PROOF TEST VOLTAGES OF 1440 Vac,
1 MINUTE AND 2500 Vac, 1 MINUTE (OPTION 010).
• .HCPL-5700/1 COMPATIBILITY
G
EIA RS-232C Line Receiver
II
Telephone Ring Detector
e 117 Vac Line Voltage Status Indicator - Low Input Power
Dissipation
e Low Power Systems - Ground Isolation
Absolute Maximum Ratings *
Storage Temperature ............. _55°C to +125°C
Operating Temperature" .............. -40°C to +85°C
Lead Solder Temperature .. . . . . . . . . . .
260°C for lOs
(1.6mm below seating plane)
Average Input Current - IF . . . . . . . . . . . . . . . . 20mA [1]
Peak Input Current - IF ........ , . . . . . . . . . .. 40mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - IF . . . . . . . . . . . . . , 1.0A
« 11.ts pulse width, 300 pps)
Reverse Input Voltage - VR . . . . . . . . . . . . . . . . . . . 5V
Input Power Dissipation. . . . . . . . . . . . . . . .. 35mW[2]
Output Current - 10 (Pin 6) ....... . . . . . .. 60mA [3]
Emitter-Base Reverse Voltage (Pin 5-7) . . . . . . . . . . . 0.5V
Supply and Output Voltage - Vcc (Pin 8-5). Vo (Pin 6-5)
6N138 . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7V
6N139 . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5to18V
Output Power Dissipation . . . . . . . . . . . . . . . . 100mW [4]
Description
These high gain series couplers use a Light Emitting
Diode and an integrated high gain photon detector to provide extremely high current transfer ratio between input
and output. Separate pins for the photodiode and output
stage result in TTL compatible saturation voltages and
high speed operation. Where desired the Vee and Vo termi nals may be tied together to achieve conventional
photodarlington operation. A base access terminal allows
a gain bandwidth adjustment to be made.
The 6N139 is for use in CMOS, LSTTL or other low power
applications. A 400% minimum current transfer ratio is
guaranteed over a~-70° C operating range for only 0.5 mA
of LED current.
See notes, following page.
CAUTION: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESo). It is advised that
normal static precautions be taken in handling and assembly of
this component to preventdamageandlordegradation which may
be induced by £SO.
The 6N138 is designed for use mainly in TTL applications.
Current Transfer Ratio is 300% minimum over 0-70° C for an
LED current of 1.6 mA [1 TTL Unit load (U.L.)]. A 300%
minimum CTR enables operation with 1 U.L. out with a 2.2
kIJ. pull-up resistor.
'JEDEG Registered Data.
..JEDEG Registered QOG to 7QoG
9-67
.~
.-~~~-~----.~~--------
Electrical Specifications
OVER RECOMMENDED TEMPERATURE (TA=
Parameter
Curienl Transfer Ratio
Sym,
CTR'
Device
6N139
6N138
Logie Low
Output Voltage
VOL
ooe to 70°C).
Min.
Typ,H
400
500
300
2000
1600
1600
Max.
%
%
6N13S
0.1
0.1
0.2
0.1
0.4
0.4
0.4
0.4
6N139
6N138
0.05
0.1
100
250
6N139
UNLESS OTHERWISE SPECIFIED
Test Conditions
Fig.
Note
IF ~ 0.5mA, Vo ~ OAV, VCC ~ 4.6V
11'= 1.6mA. VO~OAV, VCC=4.6V
IF -1.6mA, VO=O.4V, VCC-4.5V
3
5.G
'F ~ 1,6mA. 10 = SmA, VCC = 4.5V
IF = 5mA. 10 = 15mA, VCC = 4.SV
'F ~ 12mA, 10 = 24mA, Vce = 4.SV
IF = 1.6mA, 10 - 4.SmA. VCC 4.5V
1,2
6
Units
V
V
IJA
p.A
IF - OmA. Va = Vee = ISV
IF = OmA, Va = Vec =7V
0.4
mA
IF = 1.6mA, Vo
tecH
10
nA
IF
Input Forward Voltage
VF*
lA
V
IF = 1,GmA, TA
Input R .Verse
Breakdown Voltage
BVR<
Logic High
OutPUt Current
'OH'
Logic Low
Supply Current
ICCL
Logic High
SupplV Current
5
V
Temperature Coefficient
of Forward Voltage
AVF
Ai"A
-1.8
Input Capacitance
CIN
60
Input-Output
Insulation
11-0'
I OPT.OIO
VIsa
1.7
mvfC
1
2500
= Open, Vec = BV
6
= OmA, Va = Open. VCC = 5V
=25"C
IR
=10JjA, TA=25'e
IF
~
6
4
1.6mA
=0
pI'
f=1 MHz. VF
JjA
45% RH. t "" 5s. VI_O = 3kV dc.
TA =2$¢C
VRMS
6
7,11
AH s; 50%. t "" 1 min.
12
Re$istance
(Input-Output)
RI_O
10"
!1
VI.O ; 500Vdc
7
Capacitance
II nput-Outpull
C'·O
O.S
pF
fe 1 MHz
7
*JEDEC registered data.
**AII typ;cals at TA
= 2 SoC and Vee = 5V.-unless otherwise noted.
Switching Specifications
AT TA = 25°C, Vee = 5V
Parameter
Sym.
Propagation Delay Time
To Logic Low at Output tPHL'
Dellica
SN139
6N138
Propagation Delay Time
tPLH~
To Logic High at Output
6N139
6N138
Min.
Typ.
Max.
Units
5
0.2
1.6
25
1
10
JjS
18
60
7
35
2
10
Jj$
(.IS
JjS
Common Mode Transie.nt
Fig.
Note
IF - 0.5mA. RL e 4.7k!1
IF: 12mA, RL = 21m'!
IF - 1.6mA. RL = 2.2k!1
7
6,8
IF = 0.5mA, RL - 4.7k!1
IF = 12mA. RL =21011
IF - 1.6mA. RL - 2.2k!1
7
6.8
Test Conditions
leMHI
500
Vips
IF = OmA, RL = 2.2kn, Rce ~ 0
IVcm 1= 10Vp.p
8
9,10
Common Mode Transient
Immunity at Logic Low ICMLI
Level Output
500
VIj1s
IF =1.6mA, R L ~ 2.2k!1, RCC =0
IVcm l=10Vp.p
S
9,10
Immunity at Logi¢ High
Leval Output
NOTES:
1. Derate linearly above 50"C free-air temperature at a rate of O.4mA/oC.
2.
3.
4.
5.
6.
7.
Derate Iinearly above 50° C free-. ir temperature at a rate of 0.7 mW /" C.
Derate linearly above 25°C free-air temperature at a rate of 0.7 mAIo C.
Derate linearly above 25°C free-air temperature at a rate of 2.0mW/"C.
DC CURRENT TRANSFER RATIO is defined as the ratio of output collector current. 10, to the forward LED input current. IF. times 100%.
Pin 7 Open.
.
Device considered a two-terminal device: Pins 1, 2, 3. and 4 shorted together and Pins 5. 6.7, and 8 shorted together.
8. Use of a resistor between pin 5 and 7 will decrease gain and delay time. See Application Note 951-1 for more details.
9. Common mode transient immunity in Logic High level is the maximum tolerable (positive) dVcmldt on the leading edge of the common mode
pulse, Vem • to assure that the output will remain in a Logic High state (i.e., Va> 2.0V). Common mode transient immunity in Logic Low level
is the maximum tolerable (negative) dVcmldt on the trailing edge of the common mode pulse signal. Vcm • to assure that the output will remain
in a Logic Low state (i.e.• Vo < 0.8V).
10. In applications where dV Idt may exceed 50,OOOVIJJs (such as static discharge) a series resistor. Rce. should be included to protect
the detector IC from destructively high surge currents. The recommended value is Rce '"
1V
k!1.
0.15 'F (mA)
11. This is a proof test. This rating is equally validated by a 2500 Vac. 1 sec. test.
12. See Option 010 data sheet for more information.
9-68
"'F"7 -;...
50
4
I
II'/"
I-
ffi0:
r.;
0:
::>
"
"::>i=
--- -
-~
;.y .;::.-r-
'"E
I-
-
I.--
25
I-
'/
/,
0
I
.;'
II
::
l/
o
e~ ~
~,o
~~ ~.bJ.-.:
mA~ ,...".
,.-
~0:
po
-~ ~
l- i-
o
p
~
1.Gm~
I
\
TAl " 25iC
-
I
1//
1600
'"
0:
lI-
ffi0:
O'C
2S~C
,
c~ 70'C
~~
\
'LVcc-sv
Vo"'O.4V
800
"I
"
2.0
\.
'\
400
o
0.1
Vo - OUTPUT VOLTAGE - V
\
\.
0:
::>
0:
I-
1,0
/ /
'1/"
~
z 1200 if
OS~A '==
Vee "'6 V
.,--...---
" 2000
I
0
1,0
10
"
IF - FORWARD CURRENT - rnA
Figure 1. SN138/SN139 DC Transfer
Characteristics
Figure 2. Current Transfer Ratio vs
Forward Current SN138/SN139
~
I
ffi
0:
0:
::>
"~
II-
5
I
E
10
V F - FORWARD VOLTAGE - VOLTS
IF - INPUT DIODE FORWARD CURRENT - rnA
Figure 3. SN138/SN139 Output Current vs
Input Diode Forward Current
Figure 4. Input Diode Forward Current vs.
Forward Voltage.
26
100.1--------+_-------,."9----_1
\
2.
22
\
2J. Kll
"I
20
RL'·
~c
18
Jlf+" 50[.tS
V
IF'" 1.6mA
16
z
,.
~
Cl
12
0
~
g:
,,~y
I
~
;:
"",
10
\
I
'1
V
.......
/'
10,1------/-'-~+_-------+---_1
ISr FIG. ~ FOR TEST CIRCUIT)
~
IF ADJUSTED FOR VOL' 2V
tpHL
00
10
20
30
40
50
60
70
80
90
100
',OO'":.l--.l.-....l......L...LL..L"':'l,::-O--'--'-....L.L..w.":,~O.--'-...J,.J
RL - LOAD RESISTANCE - kS1
Figure 5. Propagation Delay vs. Temperature.
Figure S. Non Saturated Rise and Fall Times vs. Load
Resistance.
9-69
I,
...._ _ _ _ _ _-..,
o~
PUI.SE
I
I
Va
5V
I
GEN.
2o"lll60n
t r "'5M
I--...,----.Q +5V
1/f< 100",s
1---+----,r-
VCM.
1---""'--<> Va
A
Va ______
~~~
SWITCH AT A:
IF'" OmA
+5V
__- - - - - - - - - - - - 5 V
VCM
Va -----------~VaL
+
SWITCH AT B: IF = 1.6 rnA
Jl}---+--,
PULSE GEN.
Figure 8. Test Circuit for Transient Immunity and Typical Waveforms.
"See Note 10
'JEDEC RegiStered Data.
9-70
Flin- HEWJ;;.ETT
.:a PACKARD
_
1
9 ,40
~I -IOUTL'NEDR'A'W'NG
9.00 C390)
is
7
65
TYPE NIJMaEJl
rJ;;tI XXXX
a!1P.A YYWW!U
"
2
~t,Z401
I
7.3G1.2901 6.60 (Ta{f)
rn ITlOl
UL
4
~
_
-
t.l9 (047) MAX.
DIMENSIONS IN MII..LlMETAE$ ANO (INCHES).
-t
' ,I t
I~
I I
ANODE"
VOl
~ 4]0 t.1Bfi) MAX.
--
I
"TYP'l
7
_I I-us {.01O) MAX.
ONEil
-...
3
SCHEMATIC
---.!E.c 8
.--1'"--...---==--HL
2730/1
2731
tNt
2730/1
20
Ten Conditions
Units
p.,
p..
IF " O.SmA, Rt. "4.7kO
IF • I.GmA, Al " 2.2kl1
IF = 12mA, RL "270n
If - O,SmA, A~" 4,7kOl
0.5
2
10
SO
1'$
10
35
10
j1S
IF = I.GmA, At. " 2.2kf!
IF" 12mA, R~ = 2700
1
Fig.
Not.
9
6
9
6
ICMHI
500
VIliS
If " OmA. Al = 2.2kl'l
IVCMI = IOVp.p
10
6,10,11
ICMd
500
V/p.s
IF" 1,6mA, Rt. = 2.2kf!
IVCM 10Vpop
10
6.10,11
0
NOTES: 1. Derate linearly above 50 C frelHllr temperature at a rate of O.5mAI C.
2. Derate linearly above 50°Cfree-alr temperature at a rate of O.9mWr·C.
3. Derate linearly above 3~ C free-alr temperature at a rate of 0.6mArC.
4. Pin 5 should be the most negative voltage at the detector side.
5. Derate linearly above 35°C free-air .temperature at a rate of 1.7mW/oC.
Output powsr is collector output power plus supply power.
6. Each channel.
7. CURRENT TRANSFER RATIO i, defi~ed as the ratio of output
collector current, la, to the forward LED input current, IF, times 100%.
B. Device considered a two·termlnal device: Pins 1, 2, 3, and 4,hort8ct
. together and Pins 5, 6, 7, and 8 shorted together.'
9. Measured between pins 1 and 2 shorted together. and plns3 and 4
shorted together.
9-72
1=
10. Common mode transient Immunity In LogiC High level IS the maximum
tolerable (positive) dVCM/dt on the leading edge of the i::ommon mode
pulse VCM. to essure that the output will remain in Logic High state
Ii.e .. Va > 2.0VI. Common mode tran,lent Immunity in Logic Low
level is the maximum tolerable (negative) dVCM dt on the trailing edge'
of the common mode pulse signal, VCM, to assu~e that the output will
remain In a Logic Low state U.e., Va < O.BVI.
11. In applications where dV/dt may exceed 50,000 V/lJ.s (such as B static
discharge) a series resistor, RCC .. should be in~luded to protect the
detector IC from destructively high surge currents. The recommended
value Is RCC
R:j
0.3
1;'~mA)
kn .
12. This Is a proof test. This rating is equally validated bye 2500 Vee, 1 sec. test.
13. See Option 010 data sheet for more Information.
----------.~~--------~~---~--
~---.----
Absolute Maximum Ratings
Storage Temperature .......... -55°C to +12S o C
Operating Temperature ......... -40° C to +85° C
Lead Solder Temperature ....... 260°C for 10sec
(1.6mm below seating plane)
Average Input Current - IF
(each channel) ..................... 20mA[1]
Peak Input Current - IF
(each channel) . • . . . . . . . • . . • • . . • . . . . .. 40 mA
(50% duty cycle, 1 ms pulse width)
Reverse Input Voltage - VR
(each channel) . . . . . . . . . . . • . . • . . . • • . . . . .. SV
Input Power Dissipation
(each channel) . . . . . . . . . . . . . .. . . . .. 35 mW [2J
Output Current - 10
(each channel) . . . . . • . . . . . . . . . . . . .. 60 mA [3J
Supply and Output Voltage - Vee (Pin 8-5), Vo (Pin
7,6-S)[4 J
HCPL-2730 ........................ -0.Sto7V
HCPL-2731 ....................... -0.5 to 18V
Output Power Dissipation
(each channel) . . . • . . . . . • . . . . .. . .. 100 mW [51
'00 f_.:.:.HC:;:.P:;:.L2'1=30;,;""',,,"CPr"L.;:;27.;:;31,--_V~ ::~v
HOPL - ~'I3OIHCI'L - 2131
~ 25oof_---:+~--_:l:-d
o
~
~200Df_~~~~~~~-+--_1
I
iii
ffi
a:
11600
a:
i
i!:
~
~"c.---l--=""'~;'-'+""--!
1000 Hi
a:
1l
I
E
I
~
O·'OL:.,-------!----,:!:O---'
IF -INPUT DIODE FORWARD CURRENT - mA
IF - FORWARD CURRENT - mA
Vo - QUTPUTVOLTAGE-V
Figure 1. DC Transfer Characteristics
(HCPL-2730/HCPL-2731 )
Figure 3. Output Current VB Input Diode
Forward Current
Figure 2. Current Transfer Ratio VB
Forward Current
aI
1
I
~
ffi
a:
a:
§"
i
~
1l
~
I
o
az
g
!5
~
~
f
iii
e,
I
Ji
VF -FORWARDVOLTAGE-VOLTS
Figure 4. Input Diode Forward Current
vs. Forward Voltage.
'00
IF - INPUT DIODE FORWARD CURRENT - mA
Figure 5. Supply Current Per Channel
vs. Input Diode Forward
Current.
9-73
1
'~0L:-,..J...LllJlIL.II:-,...L.ll.LIIJ,IlL.o,........L.U.1Il!':,o:-'--U
T - INPUT PULSE PERIOD - ml
Figure 6. Propagation Delay To Logic
Low vs. Pulse Period.
33 _-HCPr.m'I!lF
ot
0.5mA.RI.. ... 4.7kn)
.....·HCPl213Qihc "".6mA, ~1.."'22kn!
30
27~~~--~4--+--+-4--4--4
~r-4--f~~~-+--+-~~--1
21 1--4--+-~-I
'.I--+-+--~-I
15r-4--+--r-+~~~~~--1
12
10
IF -INPUT DIODE FORWARD CURRENT - rnA
TA - TEMPERATURE _ °C
Figure 7. Propagation Delay vs.
Temperature.
"
Figure 8. Propagation Delay vs. Input
Diode Forward Current.
r-----
---~I
PUL.S!:
Vo-....,-~ 1,5V
',---
HCPL·2730
HCPL·2731
GEN,
H---- 2.5V). Common mode transient immunity in
Logic Low level is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode pulse signal, Vcm , to assure
that the output will remain in a Logic Low state (I.e., Vo < 2.5Vl.
10. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec. test.
11. See Option 010 data sheet for more Information.
9-76
100
~
-rl.J.c r- ~.to"'"
\f;r.-1·
80
,,
I
~
::>
'"
"5
5o
60
:
~~
0
..•....
~
iCY
1.6
'"w
1.4
Z
1.2
ee-
1.0
~
~
;i
::;
a'"'"
- --
."",
I'-"
;",A1
O.SJA
=- -
YO:l1mA
3.0
2.0
5.0
4.0
Va - OUTPUT VOLTAGE - V
Figure 1. Input Diode Forward Current vs.
Forward Voltage.
~
~
k·.··
1.0
VF - FORWARD VOLTAGE - VOLTS
0
r--
. -~~
~.~:{-: -- =
.
- -
~ :i,,!,.~
':r-
20
o
o
IF - FORWARD CURRENT - rnA
Figure 2. Typical DC Transfer
Characteristics.
10,000
Vo "'1.0V
;i
~
,
V~
I
.$}
"
~
~
I----±--~ ~~~~1;~Z;.~ ~o,;
Figure 3. Output Current vs. Input
Current.
~ _ _ tpl.H
---til
TA~ 26~C
I
~
,
~
1000
V_Rlll0kll
C
Z
Z
o
0.8
~
~
~
::;
~
~
I
'"Z
100
o
E\ <'
\ ' .. .....
10
~
I
5
10
20
IF - FORWARD CURRENT - rnA
.........
10
TA
It
r-~"""
15
I
I
25~C
"
20
1'~5C:0--_2::5---:!:---:!:25:--:50:--:7:-5--:C
'00
TA - TEMPERATURE _ °C
IF - fORWARD CURRENT - mA
Figure 4. Current Transfer Ratio vs.
Input Current.
10,000
.....
--- ---
' .....
1.0
50 100
~
>Rl"220n
0
'"t;
1000
o
Figure 5. Propagation Delay vs. Forward
Current.
Figure 6. Propagation Delay vs.
Temperature.
"O---~r----
""---~---r---r---'
_ _'tpUt
--tPHL
I
I
~
vo----r' .
"He-! t="----,!-,----
o
2."5V'
z
o
~
~
o
o
:l:
---Val
,,
I
I
,I
I
I
I
1·~"::.I---I"'.0:---""":'1O:-----":"0:':O--1000
Rl - LOAD RESISTOR - kn
Figure 7. Propagation Delay vs Load
Resistor.
Figure 8. Switching Test Circuit
90%}
VCM
,.:;10%:;;:.._ _
'f
C
Va
Vo - - - - ' - . . . - . -..
-_ - - - - - - - - 5V
SWITCH AT A: IF= OmA
Vo
-----------~VOl
SVoJITCH AT B: IF
= 1.0 rnA
Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.
9-77
.e
2,0
~
i1
1,6
I-
a:
a:
.
a:
1,8
,
I
~
I,'
I-
1,2
~
a:
1,0
---+-"X'~
C
'------1
z
e
Ax =A7kn
I..
a:
""
fil
Vo
..
N
::;
I
"a:z
0
I
100
a:
t;
Figure 10. External Base
Resistor, RX
IF - FORWARD CURRENT - mA
Rx - EXTERNAL RESISTOR -kU
Figure11. Effect of RX On
Current Transfer Ratio
Figure 12. Effect of R X On
Propagation Delay
Applications
100KO
RH <>-'WIrt-l
-48 V DC
AX tkHl
'00
lP"J..wsJ
5
6
47
5
200
140
20
10
B
00
6
48
~
tPUf t#sl
320
T{+)
100 KO
Vo
NOTE: AN INTEGRATOR MAY BE REQUIRED AT THE OUTPUT TO
ELIMINATE DIALING PULSES AND LINE TRANSIENTS.
·SCHMIDT TRIGGER RECOMMENDED
BECAUSE OF LONG
tf.
t,.
TTL Interface
Telephone Ring Detector
v
4N46
O,S mA - 'N46)
j" (>>1,OmA-.N.S
Vee
RS
ADD FOR
AC INPUT
I
Vo
Line Voltage Monitor
CMOS Interface
+vcc,o----,...r-,
CHARACTERISTICS
RIN '" 30M!!, ROUT" 50n
VIN1MAX.l = Vee, -1V'jLlNEARITV BETTER THAN 5%
/---l-
Rs>
1 m,A
VIN !MAX.I
2.5mA
R,
22k
6.ak
NOTE: ADJUST R3 SO VOUT '" VIN AT VIN '" VIN tMAX.1
2
R,
-Vee,
0,.02 - 2N3904
03 - 2N3908
Analog Signal Isolation
9-78
------.-~~---~-.
AC/DC TO LOGIC
INTERFACE
OPTOCOUPLER
F/i'PW HEWLETT
.:~ PACKARI;)
HCPL~3100
SCHEMATIC
Vee
Dc+ INPUT
!
-
14.10 1.IS5t MAX.
I .--c...
t G.•
II
I
rl
Features
•
•
•
•
•
•
AC OR DC INPUT
PROGRAMMABLE SENSE VOLTAGE
HYSTERESIS
LOGIC COMPATIBLE OUTPUT
SMALL SIZE: STANDARD 8 PIN DIP
THRESHOLDS GUARANTEED OVER
TEMPERATURE
• THRESHOLDS INDEPENDENT OF
LED CHARACTERISTICS
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vae, 1 MINUTE AND
2500'Vac,1 MINUTE (OPTiON 010).
• HCPL-5760 COMPATIBILITY
LIMIT SWITCH SENSING
LOW VOLTAGE DETECTOR
AC/DC VOLTAGE SENSING
REL.AY CONTACT MONITOR
RELAY COIL VOLTAGE MONITOR
CURRENT SENSING
MICROPROCESSOR INTERFACING
• TELEPHONE RING DETECTION
HCPL-3700
2 ••2 (,116)
'--0.65 (.025) MAX.
O.181.03(U
I -
1.401.0.51
I.........J- ~;:::~~:
MIN.
DIMENSIDI 2.0V). Common mode transient immunity in Logic Low level
is the maximum tolerable (negative) dVCM/dt on the trailing edge of the
common mode pulse Signal, VCM, to ensure that the output will remain
in a Logic Low state (i.e., Vo < 0.8 V). See Figure 10.
13. In applications where dVCM/dt may exceed" 50,000 V/Jl.s (such as static
discharge), a series resistor, Ace, should be included to protect the
detector Ie from destructively high surge currents. The recommended
value for Rce is,240n per volt of allowable drop in Vee (between Pin 8
and Vee) with a minimum value of 2400,
14. Logic low output level at Pin 6 occurs under the conditions of VIN;:::
VTH+ as well as the range of VIN > VTH- once V1N has exceeded VTH+.
Logic high output level at Pin 6 occurs under the conditions OrVIN::;
VTH- as well as the range of V1N < VTH+ once V1N has decreased below
VTH-.
15. AC voltage is instantaneous voltage.
16. Device considered a two terminal device: pins 1, 2. 3, 4 connected
together, and Pins 5,6,7,8 connected together,
17; This is a proof test. This rating is equally validated by a 2500 Vac,
1 sec. test.
18. See Option 010 data sheet for more information.
60
d;tHIPC)
TH+
3.8V
S.W
VTH fAC.'
'TH IACIDC) 2.SmA
55
50
'E"
...
>
45
I
I
w
40
~
.~
35
"""
"...
25
~
20
I
~
10
PINS 2. 3
P)NS1.4
OR
I I
~ACVOlTAGE
PlNS 1,4
is
INSTANTANEOU$
I I I
VO<) ·4.SV
10l '" 4.2mA
VOL" MV
lQH .;;; 100pA
1
.I I I
~".I:-J-J.
01~~2~3~4~-5--6--~7~S--9~1~0--1-1-1~2~'3
PINS 2,3
1.3mA
'.ev
VAI-Uf
I
15
2
r-
g
~
!:io
30
~
Vo"
TH_
f.iiii
TH_
VIN -INPUT VOLTAGE - V
Figure 1. Typical Input Characteristics, liN 'vs. VINo
(AC voltage is instantaneous value.)
4.2
,
4.0
>
3.S
90
3.6
I
J:
iil
"...J:
w
"'~"
2.6
I
2.4
>
~
i
I
'3.0
-~
I
' VTH+ 1
......
~
3.2
2.S
[
i J
3.4
0
!
!
3.2
;
3.0
LI
I If±:
I
L
11H+
j
I J
I
2.8
l- 2.6
-- !--
I
Iitt:
I
~,
I
2.2
--
2.2
1
9
0
~
"~
ffi
1 .6
~
1.4
""I
1 .2
i
2.0
1.S
2.4
-- !-- 2.0
!-- 1.8
;--4-
IT~_
Figure 2. Typical Transfer Characteristics.
(AC voltage is instantaneous value.)
j
I
-40
-20
20
40
I
60
1 .0
so
0.8
TA - TEMPERATURE - °e
Figure 3. Typical DC Threshold Levels vs. Temperature.
TA - TEMPERATURE _ °c
Figure 4, Typical High Level Supply Current; ICCH vs, Temperature,
9-82
4.2
!
I
4.0
1
'E"
3.6
....
3.4
a:
a:
3.2
~
:>
3.0
~
2.8
"....
;!;
I
z
VIN
I
i
, ,
I I i
! , i
2.4
2.2
2.0
-20
-
I
VOL
I I
40
60
TA - TEMPERATURE _
80
~
~
>
w
20
~0
'"0
I
12
-
14
~t!l
I
10
;t
...I
g:
g
I
I>
I
-40
80
I/(
1I I
I I I tpHl
f-- t--
I 1I
I J I
,
60
80
i
20
40
TA - TEMPERATURE _ °C
Figure 6. Typical Propagation Delay vs. Temperature.
5000
liN
4000
40
VOt."'O.8V
Rt. o;4,7k!t
TA ". 25~C
u;
CML
30
300
~
'"'a:"
...I
'"i<
~
I i
!
fit
:;
'"
1000
8
~
°c
Figure 7. Typical Rise, Fall Times vs. Temperature.
I
7MH
I
I
I
I
.1
I
~4.1kQ
I
I I
:;
"
!
I
TA _25°C
~
10
I
II
VOH"" 2.0V
o
;>
,
Vee "'5.0V
lIN .. DmA
~ 2000
o
200 I
20
I
~ 3000
w
:;
~3.tlmA
'"
....
I
I
i
I
tc Js.oJ
:§
TA - TEMPERATURE _
I
1
-20
°c
w
:;
I
L
I
I
.:
I
Yl I
I
IJ
~
~
W
,
~
~
;::
,,
I
:%.
//, ! I
~
Figure 5, Typical Input Current, liN, and Low Level Output
Voltage, VOL. vs. Temperature.
~
I
,
I
0
60 ;:
40
I
I i
20
---c 100
-
'Ol,4.2mA
I I
I I
20
140 ~
_,
~ II
: I i
-40
1
16
J II
I I I I I
V1Cf~
I
Vi • 1 m. PU LSE WIDTH I tpLH ~
r- ,'"1 I-IDOH,
.
I" It· '"' (1()"91m) 1./
I ' I i I 1/
18
>-
g
R~ .~.7~n
i Cl '30pF
20
~
I
180 ~
160
I
22
200 w
t!l
I
I
24
~
I
I
I
I
1
220
"'5.OV
(PINS 2, 3)
Vee'" 5.0V
1
2.6
1.8
~
.....-r
240
I
I
I,
I
3.8
I
I
I
500
00
400
800
1200
,I
!" I
,
1600
2000
VCM - COMMON MODE TRANSIENT AMPLITUDE - V
Figure 8. Common Mode Transient Immunity vs, Common
Mode Transient Amplitude.
HCPL-3700
+SV
HCPL-3700
RCC·
Vee 81--,----+
A
O.01J.1f
PULSE
BYPASS
GENERATOR
to. son
Vo 6 f---t----1~-o
1-~------~~_oVa
Va
GNP 51--1-------+
V,N
PULSE AMPLITUDE::: 5.0V
PULSE WIDTH::: 1 ms
f'" 100 Hz
t r '" tf = 1.0~s (10-90%)
PULSE GENERATOR
• CL IS 30 pF, WHICH INCLUDES PROBE
AND STRAY WIRING CAPACITANCE.
r-----------~------SV
INPUT
----2.5V
V,"
-=
• SEE NOTE 13
** CL IS 30 pF, WHICH INCLUDES PROBE
AND STRAY WIRING CAPACITANCE.
VCM
OV
J--1~---\~~~=:::
OV
90%
-.J..o=--VaH
Vo
OUTPUT
Va
10%
~
SWITCH AT A:
liN:: OmA
~----l.SV
t-'.;;..;.;;...---'--------I''''''''t---- VOL
Va
VOMAX----I\.
'------VOL. CML
Figure 10. Test Circuit for Common Mode Transient
Figure 9. Switching Test Circuit.
Immunity and Typical Waveforms.
9-83
eMH
- - - - VOMIN
--------------~,~
S\'VITCH AT B:
liN =3.11 rnA
If
~rl---------------sv
V ___
_
Electrical Considerations
The HCPL-3700 optocoupler has internal temperature
compensated, predictable voltage and current threshold
pOints which allow selection of an external resistor, Rx, to
determine larger external threshold voltage levels. For a
desired external threshold voltage, V" a corresponding
typical value of Rx can be obtained from Figure 11.
Specific calculation of Rx can be obtained from Equation
(1) of Figure 12. Specification of both V. and V- voltage
threshold levels simultaneously can be obtained by the
use of Rx and Rp as shown in Figure 12 and determined by
Equations (2) and (3).
Rx can provide over-current transient protection by
limiting input current during a transient condition. For
monitoring contacts of a relay orswitch, the HCPL-3700 in
combination with Rx and Rp can be used to allow a specific
current to be conducted through the contacts for cleaning
purposes (wetting current).
The choice of which input voltage clamp level to choose
depends upon the application of this device (see Figure 1).
It is recommended that the low clamp condition be used
when possible to lower the input power dissipation as well
as the LED current, which minimizes LED degradation
over time.
In applications where dVCM/dl may be extremely large
(such as static discharge), a series resistor, Rcc, should
be connected in series with Vcc and Pin 8 to protect the
detector IC from destructively high surge currents. See
note 13 for determination of Rcc. In addition, it is
recommended that a ceramic disc bypass capacitor of
0.D1 ILf be placed between Pins 8 and 5 to reduce the effect
of power supply noise.
IYH+
I-I
%Rx
HCPL-3700
t Ac
Vee
-( "~'"'( :
DC+
H
Vo
DC-
%Rx
I
4AC
Figure 12. External Threshold Voltage Level Selection.
Either AC (Pins 1,4) or DC (Pins 2, 3) input can be used to
determine external threshold levels.
For one specifically selected external threshold voltage
level V. or V- , Rx can be determined without use of Rp via
R x-
V. -
H
VTH.
ITH.
H
(1 )
(-)
For two specifically selected external threshold voltage
levels, V. and V-, the use of Rx and Rp will permit this
selection via equations (2), (3) provided the follovying
conditions are met.
and
Rx =
For interfacing AC signals to TTL systems, output low
pass filtering can be performed with a pullup resistor of
1.5 kO and 20 ILf capacitor. This application requires a
Schmitt trigger gate to avoid slow rise time chatter
problems. For AC input applications, a filter capacitor can
be placed across the DC input terminals for either signal
or transient filtering.
ITH.
< -ITH_
VTH_ (V.) - VTH. (V_ )
ITH. (VTH_) - ITH_ (VTH.)
VTH_ (V.) - VTH. (V_ )
Rp = ITH. (V_ - VTH_ ) + ITH_ (VTH+ _ V.)
See Application Note 1004 for more information.
>
I
w
~
g
9
~a:
F
-'
~
a:
~
I
';'
RX - EXTERNAL SERIES RESISTOR - kD:
Figure 11. TVplcal External Threshold Characteristic, V± vs. RX-
9-84
(2)
(3)
Fli;'
OPTICALLY COUPLED
20 rnA CUR'RENT LOOP
HEWLETT
~e.. PACKARD
T~ANS.M1TTER
SCHEMATIC
OUTLINE DRAWING'
1~~:~~1
ICC
Vee 0-=--.-----,
~
i
~~:
~
Fh;:tj xxxx
t.:~VVWWfU
o--=--_+_--+----'
SHIELD
4
O.lS 1.0ll?J
Q33"(;ffiJ::l
r
TYPE NUMBER
DATE CODE
ONEil
3
'".:.....1
4
-
1_1.781.070) MAX.
- f-- 1.191.047) MAX.
L
10
TRUTH TABLE
(POSITIVE LOGIC)*
V,
H
L
H
L
Vee
ON
ON
OFF
OFF
I
DL
2
-,
\
!!l!! 1.2401
~r.mi a.•0(.260)
),.,:..,........".,....,...".,....,....,.-' RECOGNITION , _ _
PIN 1
-
GND
HCPL-4100
I
~=I"::-=~i§:::=::::-L
5' TVP'l
-,-
DIMENSIONS IN M)LLlMETRES AND (INCHES)
14.70 1.186) MAX.
10
I!
H
L
H
H
*CURRENT. LOOP CONVENTION - H
=
MARK:
10;;;' 12 rnA, L = SPACE: 10 .;;; 2 rnA.
!
1.40 1.056)
II
-lo.511:20J
'I
d 0.761.030) ,--I
MIN.
2.921.115} MIN.
-0.65 1.025} MAX.
~ 1.D901
,.... 2.BO 1.110)
1___1
Features
Description
• GUARANTEED 20 rnA LOOP PARAMETERS
• DATA INPUT COMPATIBLE WITH LSTTL, TTL
AND CMOS LOGIC
• GUARANTEED PERFORMANCE OVER
TEMPERATURE (0° C to 70° C)
• INTERNAL SHIELD FOR HIGH COMMON MODE
REJECTION
• 20 KBaud DATA RATE AT 400 METRES LINE
LENGTH
• GUARANTEED ON AND OFF OUTPUT
CURRENT LEVELS
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
• OPTICALLY COUPLED 20 rnA CURRENT LOOP
RECEIVER, HCPL-4200, ALSO AVAILABLE
The HCPL-4100 optocoupler is designed to operate as a
transmitter in equipment using the 20 rnA current loop. 20
mA current loop systems conventionally signal a logic
high state by transmitting 20 mA of loop current (MARK),
and signal a logic low state by allowing no more than a
few milliamperes of loop current (SPACE). Optical
Applications
coupling of the signal from the logic input to the 20 mA
current loop breaks ground loops and provides very high
immunity to common mode interference.
The HCPL-4100 data input is compatible with LSTTL, TTL,
and CMOS logic gates. The input integrated circuit drives
a GaAsP LED. The light emitted by the LED is sensed by a
second integrated circuit that allows 20 mA to pass with a
voltage drop of less than 2.7 volts when no light is emitted
and allows less than 2 mA to pass when light is emitted.
The transmitter output is capable of withstanding 27 volts.
The input integrated circuit provides a controlled amount
of LED drive current and takes into account LED light
output degradation. The internal shield allows a guaranteed
1000 V/J.Ls common mode transient immunity.
• IMPLEMENT AN ISOLATED 20 rnA CURRENT
LOOP TRANSMITTER IN:
Computer Peripherals
Industrial Control Equipment
Data Communications Equipment
9-85
Absolute Maximum Ratings
Recommended operating
Conditions
Parameter
Power Supply
Voltage
Input Voltage Low
(No Derating Required up to 55°C)
Symbol
Min.
Max.
Units
Vee
VIL
VIH
4.5
0
20
0.8
Volts
Volls
2.0
20
Volts
TA
Vo
10
0
70
27
°C
Volts
mA
Input VOltage High
Operating
Temperature
Output Voltage
Output Curren!
0
0
24
Storage Temperature ................. -55° C to 125° C
Operating Temperature................ -40°C to 85°C
Lead Solder Temperature ............ 260°C for 10 sec.
(1.6 mm below seating plane)
Supply Voltage - Vee ........................ 0 to 20 V
Average Output Current - 10 ••...••• -30 mA to 30 mA
Peak Output Current - 10 •.••...•... internally limited
Output Voltage - Vo ................... -0.4 V to 27 V
Input Voltage - VI ..................... -0.5 V to 20 V
Input Power Dissipation - PI .............. 265 mW[ll
Output Power Dissipation - Po ............ 125 mW[2l
Total Power Dissipation - P ............... 360 mW[3l
Electrical Characteristics
for 0° C ~ TA ~ 70° C, 4.5 V ~ Vee
Parameter
~
Symbol
Mark State Output
Voltage
20 V, all typicals at TA = 25° C and Vee = 5 V unless otherwise noted
Min.
~:.
.2
2.35
VMO
Max.
Units
Test Conditions
2.25
Volts
Volts
Volts
10 =2 mA
lo=12mA
10= 20 mA
2.7
Mark State Short Circuit
Output Current
Ise
30
85
Space State Output
Current
Iso
0.5
1.1
2.0
.0.12
Low Level Input Current
IiL
Low Level Input Voltage
VIl_
High Level Input Voltage
VIH
High Level Input Current
IiH
Supply Current
Icc
Input-Output Insulation
11-0
I OPT 010
ViSO
ReSistance
(Input-output)
RI-o
Capacitance
(input-outpull
CI-O
Fig.
VI'" 2.0 V
rnA
VI'= 2 V, Vo = 5 V to 27 V
mA
VI =0.8 V, Vo= 27 V
.0.32
rnA
Vee = 20 V, VI = 0.4 V
0.8
Volts
2.0
Note
1.2
4
3
-
=
-
Volts
0.005
20
100
250
#A
p.A
#A
VI'" 2.7 V
VI =5.5V
VI=20V
7.0
7.8
11.5
13
rnA
rnA
Vee = 5.5 V
Vee =20 V
1
JiA
OV::;;VI$20V
45% RH, t = 55,
VI-O '" 3 kV dc, TA '" 25°C
5,6
VRMS
RH~50%t=1
1012
Ohms
VI-O = 500 V dc
5
1
pF
f == 1 MHz, VI-O = 0 V dc
5
2500
MIN
13
Notes:
1. Derate linearly above 55° C free air temperature at a rate of 3.8 mW/' C. Proper application of the derating factors will prevent IC
junction temperatures from exceeding 125' C for ambient temperatures up to 85' C.
2. Derate linearly above a free-air temperature of 70'C at a rate of 2.3 mW/oC. A significant amount of power may be dissipated in
the HCPL-4100 output circuit during the transition from the SPACE state to the MARK state when driving a data line or capacitive
load (COUT). The average power dissipation during the transition can be estimated from the following equation which assumes a
linear discharge of a capacitive load: P = Isc (V so + VMoI/2, where Vso is the output voltage in the SPACE state. The duration of
this transition can be estimated as t = COUT (Vso - VMo)/lse. For typical applications driving twisted pair data lines with NRZ data
as shown in Figure 11, the transition time will be less than 10% of one bit time.
3. Derate linearly above 55°C free-air temperature at a rate of 5.1 mW/'C.
4. The maximum current that will flow into the output in the mark state lise) is internally limited to protect the device. The duration of
the output short circuit shall not exceed 10 ms.
5. The device is considered a two terminal device, pins 1, 2, 3, and 4 are connected together, and pins 5, 6, 7, and 8 are connected
together.
6. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec. test.
9-86
Switching Characteristics
for 0::; TA::; 70° C, 4.5 V::; Vee::; 20 V, all typicals at TA = 25° C and Vee = 5 V unless otherwise noted
Symbol
Parameter
Min.
Typ.
Max.
Units
O.~••
1.6
pS
1.0
Propagation
to
Logic HighD~I~~~~¥~
",<,
Level
tPLH
Propagation Delay Time
to Logic Low Output
Level
tPHL
0.2
Propagation Delay
Time Skew
tpLH-tPHL
Output RiSe Time
(10-90%)
Output Fall Time
(90-10%)
Testing Conditions
Co'" 1000 pF,
=1000 pF, CL = 15 pF, 10 = 20 mA
10 = 20 mA, Co'" 1000 pF, CL = 15 pF.
5,7
9
10 = 20 mA, Co'" 1000 pF, CL = 15 pF.
5,7
10
8,9,10
11
ps
10=20 mA
tr
16
ns
tf
23
ns
Common Mode
Transient Immunity at
Logic Low Output Level
ICMLI
VII's
VI =2 V, TA=25°C
VCM = 50 V (peak), Vee = 5 V
10 (min.l '" 12 mA
1,000 10,000
VII's
VI = 0.8 V, TA = 25°C
VeM = 50 V (peak), Vce = 5 V
8,9,10 12
10 (max.) '" 3 mA
Notes:
7. The tPLH propagation delay is measured from the 1.3 volt level on the leading edge of the input pulse to the
leading edge of the output pulse.
8. The tPHL propagation delay is measured from the 1.3 volt level on the trailing edge of the input pulse to the
trailing edge of the output pulse.
9. The rise time. tr. is measured from the 10% to the 90% level on the rising edge of the output current pulse.
10. The fall time. tf. is measured from the 90% to the 10% level on the falling edge of the output current pulse.
11. The common mode transient immunity in the logic high level is the maximum (positive) dVCM/dt on the leading
mode pulse. VCM. that can be sustained with the output in a Mark (UH") state (i.e .• 10> 12 mAl.
12.The common mode transient immunity in the logic low level is the maximum (negative) dVCM/dt on the leading
mode pulse. VCM. that can be sustained with the output in a Space (ULU) state (i.e .• 10> 3 mAl.
13. See Option 010 data sheet for more information.
3.0
>
I
2.6
w
'"!::i"
0
>
t-
~
t::>
2.4
2.2
to
-
-~ ---.,
12mA
r-::-:- ---.,
2.0 r- 2mA
I
0
I
1.8
,;<
1.6
10 mA level on the
10 mA level on the
edge of the common
edge of the common
3.5
2.8
3.0
>
.......
..........., r---..... .......
.....,
....., ...........,
t"--.....
VI ""2V
1.4
1.2
-40
-20
20
-
60
2.5
0
2.0
'"
;0
....
>
--
40
I
w
t::>
~
::>
0
I
,;<
1.5
f
i--:---
--
1.0
V, =2V
TA -25 C
g
0.5
10
80
15
20
25
30
10 - OUTPUT CURRENT - rnA
Figure 1.
7
8
0.1
1,000 10,000
4,5,6
4,5,6
CO
ICMHI
yL = 15 pF, 10 == 20 mA
Noti
i,
I'S
Common Mode
Transient Immunity at
Logic High Output Level
Fig.
Typical Mark State Output Voltage
Temperature
VB.
Figure 2.
9-87
Typical Output Voltage
Mark State
VB.
Output Current In
1.3
1
1.2
I
1.1
~
1.0
izw
Vee
:0
..,.. -? ......
Vo
""
O.9 -
'"I
O.8 - 20V
W
~
.!!.'
3 V,10 KHz
SOUAREWAVE
i-""
~~
[}~~
~ P'
PULSE
__~a~E:~TgR
5.6K
tr=tf=6M
~1.O.8y
o.7
o. 6
~-ffi~,
'
INCLUDING,PROBE'AND JIG CAPACITANCES.
-40
-20
20
40
60
80
TA -,TEMPERATURE _oC
Figure 3:
Typical Space State Output Current vs.
Temperature
'Figure 4.
Test Circuit for tpLH. tpHL. t r • and tf
0.6
'!l
0.5
..,.
I
V,
....
w
0.4
~
0.3
~ f--
0.2
~ f..-
0
Z
0
to
~
10
0
if
Co',OODpF
I
CL-15pF
a-
--
0.1
-40
-20
20
40
60
80
TA - TEMPERATURE _ °C
Figure 5.
Figure 6.
Waveforms for tpLH. tpHL. t r• and tf
Typical Propagallon Delay vs. Temperature
70
2,
I
'"w
'........"
;::
;t
60
40
..
30
'"iii:
20
0
z
w
I
=-
'"
CoUT • 1000 pF
C,. "SpF
50
f\.
~
-
If
t'-;;- r-- ......
10
-40
-20
20
40
TA - TEMPERATURE _
Figure 7.
60
80
°c
Typical Rise. Fall Times vs. Temperature
9-88
~~~~~~~~~~-
~~------
50V~
VllNE
124VI
VCM
OV
VMON
[V
SWITCHATA
CMH
VMON
SWITCH ATB
CML
Figure 8.
Test Circuit for Common Mode Transient
Immunity
Figure 9.
0.8 V OR MORE
~
OV------------------------
l
f1 v -----------------------0.4 V OR LESS
0.6VMAX.~
OV------------------------
Typical Waveforms for Common Mode
Transient Immunity
12000
l
TAl " 25 C
~
10000
>
~ I
0>-
:;;>-
8000
ZZ
o
:J
:;; :;;
:;; :;;
6000
0-
u>-
Iffi
0:0;
4000
:;;Z
u"
0:
>-
2000
00
100 200 300 400 500 600 700 800 900 1000
VCM - COMMON MODE TRANSIENT AMPLITUDE - V
Figure 10. Common Mode Transient Immunity vs.
Common Mode Transient Amplitude
Applications
Data transfer between equipment which employs current
loop circuits can be accomplished via one of three configurations: simplex, half duplex or full duplex communication. With these configurations, point to point and
multidrop arrangements are possible. The appropriate
configuration to use depends upon data rate, number of
stations, number and length of lines, direction of data flow,
protocol, current source location and voltage compliance
value, etc.
ISOLATED
STATION
r------,
I
I
I
I
I
DATA
I
IL
I
I
I
I
I
I
XMTR
HCPL-4100
I
SIMPLEX
The simplex configuration, whether point to point or multidrop, gives unidirectional data flow from transmitteris) to
receiver. This is the simplest configuration for use in long
line length itwo wire), moderate data rate, and low current
source compliance level applications. A block diagram of
simplex point to point arrangement is given in Figure .11
for the HCPL -4100 transmitter optocoupler.
I
I
NON-ISOLATED
STATION
r----,
I
I
_____ -'
I
I
I
I'- _ _
I
_ _ ---lI
Figure 1",. Simplex Point to Point Current Loop System
Configuration
9c89
DATA
Major factors which limit maximum data rate performance
for a simplex loop are the location and compliance voltage
of the loop current source as well as the total line capacitance. Application of the HCPL-4100 transmitter in a
simplex loop necessitates that a non-isolated active receiver (containing current source) be used at the opposite
end of the current loop. With long line length, large line
capacitance will need to be charged to the compliance voltage level of the current source before the receiver loop
current decreases to zero. This effect limits upper data
rate performance. Slower data rates will occur with larger
compliance voltage levels. The maximum compliance level
is determined by the transmitter breakdown characteristic.
In addition, adequate compliance of the current source
must be available for voltage drops across station(s) during
the MARK state in multidrop applications for long line
lengths.
distance and number of stations on the loop are fixed. A
minimum transmitter output load capacitance of 1000 pf
is required between pins 3 and 4 to ensure absolute'
stability.
Length of the current loop (one direction) versus minimum
required DC supply voltage, Vee, of the circuit in Figure
12 is graphically illustrated in Figure 13. Multidrop configurations will require larger Vee than Figure 13 predicts in
order to account for additional station terminal voltage
drops.
40
36
32 I - vee ~ 0.00212;;'{L) +5.7 V
A recommended non-isolated active receiver circuit which
can be used with the HCPL-4100 in point to point or in
multidrop 20 mA current loop applications is given in Figure 12. This non-isolated active receiver current threshold
must be chosen properly in order to provide adequate
noise immunity as well as not to detect SPACE state current (bias current) of the HCPL-4100 transmitter. The
receiver input threshold current is Vth/Rth ~ 10 mA. A simple transistor current source provides a nominal 20 mA
loop current over a Vee compliance range of 6 V dc to
27 V dc. A resistor can be used in place of the constant
current source for simple applications where the wire loop
-
28 r---!l,CAaLE oco"0.05296 flIm
In a simplex multidrop application with multiple HCPL4100 transmitters and one non-isolated active receiver,
priority of transmitters must be established.
ILOOl'f 20mA
V/>lARK "2.7 Yd. (HCPl~l00l
-1.5 Vd. (CURRENT SOURCE) ~
~
24 I-VSAT
g
20
I
I
-»
16
/
12
/.
o
1111
o
1111
10000
Iitli
1000
100
L = LOOP LENGTH (ONE DIRECTION) METRES
Figure 13. Minimum Required Supply Voltage. VCC. vs.
Loop Length lor Current Loop Circuit 01
Figure 12
TRUTH TABLE
(POSITIVE LOGIC)
(6 V de - 27 V del
ALTERNATIVE
I
HCPL-4100
OPTIONAL
TERMINATION
r~RT
r-I
I
I
I
Vee
~~~:~~T
I 2N3740
~I
RS~
5V de
I
I
·Ii
Figure 12. Recommended Non-Isolated Active Receiver with HCPL-4100 Isolated Transmitter lor Simplex Point to Point
20 rnA Current Loop
..
9-90
1K H
FULL DUPLEX
Full duplex pOint to point communication of Figure 15
uses a four wire system to provide simultaneous, bidirectional data communication between local and remote
equipment. Basic application uses two simplex point to
point lOOPS which have two separate, active, non-isolated
units at one common end of the lOOps. The other end of
each lOOP is isolated.
1000
As Figure 15 illustrates, the combination of HewlettPackard current lOOP optocouplers, HCPL-4100
transmitter and HCPL-4200 receiver, can be used at the
isolated end of current lOOps. Cross talk and common
mode coupling are greatly reduced when optical isolation
is implemented at the same end of both lOOps, as shown.
Full duplex data rate is limited by the non-isolated active
receiver current lOOp. Comments mentioned under simplex configuration apply to the full duplex case. Consult
the HCPL-4200 receiver optocoupler data sheet for specified device performance.
10,000
L - LOOP LENGTH (ONE DIRECTION) - METRES
Figure 14. Typical Data Rate vs. Distance and Supply
Voltage
Typical data rate performance versus distance is illustrated in Figure 14 for the combination of a non-isolated
active receiver and HCPL-4100 optically coupled current
lOOP transmitter shown in Figure 12. Curves are shown for
25% distortion data rate at different Vee values. 25% distortion data rate is defined as that rate at which 25%
distortion occurs to output bit interval with respect to the
input bit interval. Maximum data rate (dotted line) is restricted by device characteristics. An input
Non-Return-to-Zero (NRZ) test waveform of 16 bits
(0000001011111101) was used for data rate distortion measurements. Enhanced speed performance of the loop
system can be obtained with lower Vee supply levels, as
illustrated in Figure 14. In addition, when loop current is
supplied through a resistor instead of by a current source,
an additional series termination resistance equal to the
characteristic line impedance can be used at the HCPL4100 transmitter end to enhance speed of response by
approximately 20%.
HALF DUPLEX
The half duplex configuration, whether point to point or
multidrop, gives non-simultaneous bidirectional data flow
from transmitters to receivers shown in Figures 16a and
16b. This configuration allows the use of two wires to
carry data back and forth between local and remote units.
However, protocol must be used to determine which specific transmitter can operate at any given time. Maximum
data rate for .a half duplex system is limited by the loop
current charging time. These considerations were explained in the Simplex configuration section.
Figures 16a and 16b illustrate half duplex application for
the combination of HCPL-4100/-4200 optocouplers. The
unique and complementary designs of the HCPL-4100
transmitter and HCPL-4200 receiver optocouplers provide
many designed-in benefits. For example, total optical isolation at one end of the current lOOP is easily
accomplished, which results in substantial removal of
common mode influences, elimination of ground potential
differences and reduction of power supply requirements.
With this combination of HCPL-4100/-4200 optocouplers,
specific current lOOP noise immunity is provided, i.e., min-·
imum SPACE state current noise immunity is 1 mA, MARK
state noise immunity is 8 mA.
The .cable used contained five pairs of unshielded, twisted,
22 AWG wire (Dearborn #862205), Loop current is 20 mA
nominal. Input and output logic supply voltages are 5 V
dc.
,-----,
NON-ISOLATED STATION
I
DATA
DATA
I
I
I
DATA
DATA
L- _ _ _ _ ....l
Figure 15. Full Duplex Point to Point Current Loop
System Configuration
9-91
Voltage compliance of the current source must be of an
adequate level for operating all units in the loop while not
exceeding 27 V dc, the maximum breakdown voltage for
the HCPL-41 00. Note that the HCPL-4100 transmitter will
allow output loop current to conduct when input Vee
power is off. Consult the HCPL-4200 receiver optocoupler
data sheet for specified device performance.
For more informaton about the HCPL-4100/-4200 optocouplers, consult Application Note 1018.
NON-ISOLATED
STATION
DATA
DATA
DATA
IL
_ _ _ _ ....I
(a) POINT TO POINT
DATA
DATA
--,
I
NON-ISOLATED
STATION
XMTII
HCPI.-4100
ilSOLATED
1STATION
I
---'
DATA
DATA
r-I
ISOLATED·I
XIIITR
STATION 1 HCPL-4'OO
IICVII
HCP\._
I
L_
DATA
DATA
(b) MULTIDROP
Figure 16. Half Duplex Current Loop System Configurations for (a) Point to Point, (b) Multidrop
9-92
rli~ HEWL..J~TT
a!~ PACKARD
OPTICALLY C0UPLED
20 rnA CURRENT LOOP
RECEIVER
SCHEMATIC
I+m
:-, IJ
1
HCPl-4200
OOTLINE DRAWING'
_~!'3701_1
9.901.MO)
.--lcC
l
r--_t_--QVCC
8
I
~I
I
I
L
L----+..---4--oGND
s
TRUTH TABLE
(POSITIVE LOGIC)·
!
*CURRENT LOOP CONVENTION - H '" MARK:
II;;;' 12 rnA, L '" SPACE: I, 0;; 3 rnA, Z '" OFF
(HIGH IMPEDANCE) STATE.
0.76 (.03O)
iTo 1-:o55j
I
II
-
t
t
j 4.70 (.lasl MAX.
-to.51 1.020)
I
MtN.
2.921.1151 MIN.
,....... -0.651.0261 MAX.
I_Ir- 2.BO
~~
1.1101
Features
Description
• DATA OUTPUT COMPATIBLE WITH LSTTL,
TTL, AND CMOS
• 20K BAUD DATA RATE AT 1400 METRES LINE
LENGTH
• GUARANTEED PERFORMANCE OVER
TEMPERATURE (0 0 C TO 70 0 C)
• GUARANTEED ON AND OFF THRESHOLDS
• LED IS PROTECTED FROM EXCESS CURRENT
• INPUT THRESHOLD HYSTERESIS
• THREE-STATE OUTPUT COMPATIBLE WITH
DATA BUSES
• INTERNAL SHIELD FOR HIGH COMMON MODE
REJECTION
• RECOGNIZED UNDER THE COMPONENT
PROGRAM OF U.L. (FILE NO. E55361) FOR
DIELECTRIC WITHSTAND PROOF TEST
VOLTAGES OF 1440 Vac, 1 MINUTE AND
2500 Vac, 1 MINUTE (OPTION 010).
• OPTICALLY COUPLED 20 mA CURRENT LOOP
TRANSMITTER, HCPL-4100, ALSO AVAILABLE
The HCPL-4200 optocoupler is designed to operate as a
receiver in equipment using the 20 mA Current Loop. 20
mA current loop systems conventionally signal a logic
high state by transmitting 20 mA of loop current (MARK),
and signal a logic low state by allowing no more than a
few milliamperes of loop current (SPACE), Optical coupling of the signal from the 20 mA current loop to the
logic output breaks ground loops and provides for a very
high common mode rejection. The HCPL-4200 aids in the
design process by providing guaranteed thresholds for
logic high state and logic low state for the current loop,
providing an LSTTL, TTL, or CMOS compatible logic
interface, and providing guaranteed common mode rejection. The buffer circuit on the current loop side of the
HCPL-4200 provides typically 0.8 mA of hysteresis which
increases the immunity to common mode and differential
mode noise. The buffer also provides a controlled amount
of LED drive current which takes into account LED light
output degradation. The internal shield allows a guaranteed
1000 VIf.J.S common mode transient immunity.
Applications
• IMPLEMENT AN ISOLATED 20 mA CURRENT
LOOP RECEIVER IN:
Computer Peripherals
Industrial Control Equipment
Data Communications Equipment
9-93
Recommended Operating
Conditions
Parameter
Absolute Maximum Ratings
(No Derating Required up to 70° C)
Symbol
Min.
Max.
Units
Power Supply
Voltage
Vee
4.5
20
Volts
Forward Input
Current (SPACE)
lSI
0
2.0
mA
Forward Input
Current (MARK)
1M!
14
24
mA
Operating
Temperature
TA.
°C
N
0
0
70
FanOut
4
TTL Loads
LogiC Low
Enable Voltage
VEL
0
0.8
Volts
Logic High
Enable Voltage
VEH
2.0
20
Volts
Storage Temperature .••..•...•.•..•• -55°C to 125°C
Operating Temperature ••...••....•..• -40° C to 85° C
Lead Solder Temperature •.•••••••... 260°C for 10 sec.
(1.6 mm below the seating plane)
Supply Voltage - Vee ..................... 0 V to.20 V
Average Input Current - II ........•• -30 mA to 30 mA
Peak Transient Input Current - Ii ............. 0.5 A11]
Enable Input Voltage - VE •••.••••.•... -0.5 V to 20 V
Output Voltage - Vo ....••...••••.•••. -0.5 V to 20 V
Average Output Current - 10 .........••••.•••• 25 mA
Input Power Dissipation - PI .....•.•.•••••• 90 mW1 2]
Output Power Dissipation - Po ..•..•..••.• 210 mW13]
Total Power Dissipation - P ••••••...•...•• 255 mW14]
Electrical Characteristics
For 0° C:S; T A.:S; 70° C, 4.5 V:S; Vee :s; 20 V, VE = 0.8 V, all typicals at T A. = 25° C and Vee = 5 V unless otherwise noted
Parameler
Symbol
Mark State Input Current
Mark State Input Voltage
.....
Space State Inpul Current
lSI
Space State Input Voltage
VS,
Input Hysteresis Currem
IHVS
Logic Low Output Voltage
VOL
Logic High Output Voltage
VOH
Output Leakage Current
NOUT>Vccl
IoHH
Logic High Enable Voltage
VEH
Logic Low Enable Voltage
VeL
Logic High Enable
Current
Min.
IEH
LogiC Low Enable Current
IEL
Logic Low Supply
Current
ICCL
Logic High Supply
Current
ICCH
Typ.
0.3
Logic Low Short
Circuli Output CUrrent
2.52
2.75
3
mA
1.6
2.2
Volts
Logic High Short
Circuit Output Current
10SH
Input-Outpullnsulalion
11-0
I OPT. 010
VISO
Yolts
0.5
Valls
2.4
Volts
100
500
2.0
h=20mA
VE'" Don't Care
II '" 0.5 to 2.0mA Ve - Don't Care
10L <= 6.4 rnA!4 TTL Loads) Ii = 3 mA
10H = -2.6 mA,
11=12rnA
p.A
Vo=5.SV
1,=20 rnA
p.A
• Vo=2OV
0.8
Volts
20
p.A
Ve=2.7V
100
p.A
VE=S.5 V
250·
p.A
Ve=2OV
-0.32
rnA
Ve= 0.4 V
~
mA
•
.
mA
Vcc = 5.5 V
3.1
6.0
rnA
: Vcc=20V
VE" Don't Care
-20
p.A
p.A
100
pA
• Vo" 0.4 V
Vo '" 2.4 V
Vo=5.5V
Ve=2.0Y,It=20mA
20
500
p.A
Vo=20V
h= 20 rnA
Ve=2Y,
h"'OmA
26
40
mA
Vo=Vcc=5.5VI
rnA
Yo = Vcc "" 20 V
-10
mA
Vcc=5.5V
1t-20 mA
-25
mA
Vcc=20V
Vo=GND
pA
45% RH, t .. 5s.
1
2500
I h=OmA
VI.o=3kVdc, TA=25'C
RH S:50%, t= 1 min.
1.0
pF
1= 1 MHz, VI-o=QVdc
C,N
120
pF
f - 1 MHz, VI - 0 V do, Pins 1 and 2
Input Capacitance
6
Ve= Don't Care
CI-O
Input-Output CapaCitance
1
5
1,= 0 rnA
• Vcc"'S.5V
Vcc=20V
VRMS
ohms
RI-O
•
1,
Vcc=4.5V
1012
Input-Output Resistance
~
Volts
~
I
Test Conditions
mA
0.8
IOZH
10SL
Units
rnA
loZL
High Impedance S'late
Output Current
Max.
12
IMI
VMI
9-94
VI.O = 500 V dc
5
5
6,7
14
6
6
--------------- - - - - -
--------------------------
switching Characteristics
For 0° C ~ TA ~ 70° C, 4.5 V ~ Vee ~ 20 V, Ve
Parameter
Symbol
= 0.8 V, all typicals at TA = 25° C and Vee = 5 V unless otherwise noted
Min.
TeSI'e~ndllions
Typ.
Max.
Units
0.23
1.6
IJ.S
tPHL
0.17
1.0
pS
Ve '" 0 V, CL
tPLH-tPHL
60
ns
II
OUlput Enable Time
to Logic Low Level
tPZL
25
ns
II = 0 mA, CL = 15 pF
Output Enable Time
to Logic High Level
tPZH
26
ns
Ii = 20 mA, CL'" 15 pF
Propagation Delay Time
to Logic High Output
Level
tPLH
Propagation Delay Time
to Logic Low Output
Level
Propagation Delay
Time Skew
...
Fig.
Note
Ve =OV, CL= 15 pF
7,8,9
8
= 15 pF
7,B,9
9
.i\p;rA. CL =
=•
15 pF
7,8,9
11,12,
14
11,1,2,
13
Output Disable Time
from Logic Low Level
tpLZ
60
ns
Ii = 0 mA, CL'" 15 pF
11,12,
14
Output Disable Time
from Logic High Level
tPHZ
105
ns
,,= 20 mA, CL =15 pF
11, 12,
13
Output Rise Time
(10-90%)
Ir
55
ns
Vee
= 5 V, CL "" 15 pF
7,8,10
10
OutpUI Fall Time
(90-10%)
If
15
ns
Vee = 5 V, Cl'" 15 pF
7,8,10
11
Common Mode
TranSient Immunity at
Logic High Output Level
ICMHI
1,000
10,000
V/p$
VeM = 50 V (peak)
/J=12mA,TA=25°C
15,16
12
Common Mode
TranSient Immunity at
Logic Low Output Level
ICMLI
1,000
10,000
VlfJ.s
VCM = 50 V ipeak)
II = 3 mA, T A = 25° C
15, 16
13
NOTES:
1. :S 1 p's pulse width, 300 pps.
2. Derate linearly above 70° C free air temperature at a rate of 1.6 mW/o C. Proper application of the derating factors will prevent IC
junction temperatures from exceeding 125° C for ambient temperatures up to 85°C.
3. Derate linearly above 70° C free air temperature at a rate of 3.8 mW/o C.
4. Derate linearly above 70° C free air temperature at a rate of 4.6 mW/o C.'
5. Duration of output short circuit time shall not exceed 10 ms.
6. The device is considered a two terminal device, pins 1, 2, 3, and 4 are connected together and pins 5, 6, 7, and 8 are connected
together.
7. This is a proof test. This rating is equally validated by a 2500 Vac, 1 sec. test.
8. The tpLH propagation delay is measured from the 10 mA level on the leading edge of the input pulse to the 1.3 V level on the
leading edge of the output pulse.
9. The tpHL propagation delay is measured from the 10 mA level on the trailing edge of the input pulse to the 1.3 V level on the
trailing edge of the output pulse.
10. The rise time, t" is measured from the 10% to the 90% level on the rising edge of the output logiC pulse.
11. The fall time, tf, is measured from the 90% to the 10% level on the falling edge of the output logic pulse.
12. Common mode transient immunity in the logic high level is the maximum (negative) dVCM/dt on the trailing edge of the common
mode pulse, VCM, which can be sustained with the output voltage in the logic high state Ii.e., Vo 2': 2 V).
13. Common mode transient immunity in the logic low level is the maximum (positive) dVCM/dt on the leading edge of the common
mode pulse, VCM, which can be sustained with the output voltage in the logic low state ILe., Vo:S 0.8 V).
14. See Option 010 data sheet for more information.
9-95
10
3.0
:::: ::::::
1-~
tr
2.5
::::
,
":;"
>
w 2.0
0
>
1.5
/
/
I
TA =25 C
\--- -
--
~
0
9,
--
1.0
">
0.51--+--+-+--+--1---;
o
-so
II - 'INPUT CURRENT - mA
Figure 1.
-25
25
50
Typical Output Voltage
vs. Loop Current
Figure 2.
~
2.6
I, =20mA
""
:;
I--:
:;:; i""'
0
,,"12mA
~.
0
,
S
2.'
II - LOOP CURRENT - mA
vic <.1
~
0.8
10 "'"6.4ntA-
g
0.7
~
0.6
~
0.5
5V _
1,=3mA
w
>
~.'
:
o
~
w
~
~,
">
-25
25
50
75
TA - AMBIENT TEMPERATURE -
Figure 4.
Typical Input Voltage
Temperature
~
0.2
-40
-20
20
40
60
80
100
-.
-60 -40
TA - TEMPERATURE -'C
Figure 5.
" ot
.r-..
'"
-20
20
Typical Logic Low Output
Voltage VB. Temperature
Figure 6.
r---------~-,~~5V
10 -son
lSI "'OmA
02
VOH--
03
90% - - -
04
Vo
10%--":"
Figure 7.
VOL
---t-"
CL '" 15 pF INCLUDING PROBe
AND JIG CAPACITANCE
Test Circuit for tpHL. tpLH. t r • and tf
Figure 8_
9-96
60
80. 100
Typical Logic High Output
Current VB. Temperature
PULSE
GENERATOR
1r=tp*$nJ
40
TA - TEMPERATURE -"C
1M' =20mA-----.,--_ _ _ _ _ _""""'\
VIN = 5 VOLT, 100 KHz 10% DUTY CYCLE
D1 - 04 ARE lN916 OR lN3064
12mA-
\
0.3
-60
J. ..1v
I\,
Vo -MV
"c
VB.
Typical Input Loop Voltage
. VB. Input Current
VO..:2.7V
0.4
o
100
1
2
~ '0. 1
2.2
-50
°0L--~-~10~--'~5--2~0-~25~~30
Figure 3.
0.9
~
w
100
Typical Current Switching
Threshold vs. Temperature
1
2.•
g
,
75
TA - AMBIENT TEMPERATURE -"C
Waveforms for tpHL. tPLH. t r • and tf
- _ ..._-_.... - - - -
120
100
~
I
w
~
";::
80
~
Q
~
Z
:1:
o
~
lIi
~
"
60
a:
'"
I
..
40
~
I
20
TA - TEMPERATURE
TA - TEMPERATURE -'C
Figure 9.
Typical Propagation Delay vs. Temperature
r - - - - ' C L = 15 pF INCLUDING PROBE
AND JIG CAPACITANCE
PULSE
GENERATOR
,-----3.0 V
INPUT
V,
Zo = 50n
tr
-= tf"d;
_·c
Figure 10. Typical Rise. Fall Time vs. Temperature
n$
02
03
04
INPUT Ve
MONITORING
NODE
OUTPUT
= 1.5 V
Vo
Sl OPEN
S2 CLOSED
01-4 ARE lN916 OR lN3064
Figure 11. Test Circuit for tpZH. tpZL. tpHZ. and tpLZ
----r- -J;0
200
CL .. 15pF
~
I
~
~
I
rov
150
Q
'';'z
z
I
Figure 12. Wavelorms lor tpZH. tpZL. tpHZ. and tpLZ
o
~
I
Q
Z
o
i
4.5V
100
:::
w
~
~
w
rov
0
..
-
20
20
~
j}v
tpZIi
I
~
40
TA - TEMPERATURE -
60
80
..
I
100
'c
TA - TEMPERATURE _OC
Figure 13. Typical Logic High Enable Propagation Delay
vs. Temperature
Figure 14. Typical Logic Low Enable Propagation Delay
vs. Temperature
50V
VCM
~
Z
8000
I-
6000
,.-
"
4000
II =12mA
0
0
3000
w
~
'" 0,8 V
'\\\W,
T:='25-C-1
j
hl
5000
I-
a:
Pfm
7000
_V
_VO(MAX.)
VOL
9000
15
!i1
=2.0V
Vo
10000 ;
I
>
I-
""O!
OV
VOH~
.
Vo iMIN.)
~
"z
2000
""u
1000
0
11=3.0mA
0
I
"
u
Figure 15. Test Circuit lor Common Mode Transient
Immunity
0
"0
500
1000
1500
2000
VCM - COMMON MODE TRANSIENT VOLTAGE - V
Figure 16. Typical Common Mode Transienllmmunity
vs. Common Mode Transient Amplitude
9-97
Applications
Data transfer between equipment which employs current
loop circuits can be accomplished via one of three configurations: simplex, half duplex or full duplex communication. With these configurations, point-to-point and
multidrop arrangements are possible. The appropriate
configuration to use depends upon data rate, number of
stations, number and length of lines, direction of data flow,
protocol, current source location and voltage compliance
value, etc.
SIMPLEX
The simplex configuration, whether point to point or multidrop, gives unidirectional data flow from transmitter to
receiver(s). This is the simplest configuration for use in
long line length (two wire),for high data rate, and low current source compliance level applications. Block diagrams
of simplex pOint-to-point and multidrop arrangements are
given in Figures 17a and 17b respectively for the HCPL4200 receiver optocoupler.
For the highest data rate performance in a current loop,
the configuration of a non-isolated active transmitter (containing' current source) transmitting data to a remote
isolated receiver(s) should be used. When the current
source is located at the, transmitter end, the loop is
charged approximately to VMI (2.5 V). Alternatively, when
the current source is located at the receiver end, the loop
is charged to the full compliance voltage level. The lower
the charged voltage level the faster the data rate will be. In
the configurations, of Figures 17a and 17b, 'data rate is
independent of the current source voltage compliance
level. An adequate compliance level of current source
must be available for voltage drops across station Is) during
the MARK state in multidrop applications or for long line
length. The maximum compliance level is determined by
the transmitter breakdown characteristic.
A recommended non-isolated active transmitter circuit
which can ,be used with the HCPL-4200 in pOint-to-point
or in multidrop 20 mA current loop applications is given in
Figure 18. The currerit source is controlled via a standard
TTL 7407 buffer to provide high output impedance of current source in' both the ON and OFF states. This
non-isolated active transmitter provides a nominal 20 mA
lOOp' current for the listed values of Vee, R2and R3 in
Figure 18.
NON-ISOLATED
STATION
r-----,
I
I
ISOLATED
STATION
2~
,...----,
DATA
DATA
L _ _ _ _ _ _ .J
(a) POINT-TO-POINT
DATA
DATA
ISOLATED' STATION
I ......--'-......
I
I
NON-ISOLATED
r - -STATION
----,
,..----.
ISOLATED
STATION
2~1
r----'
DATA
DATA
, ISOLATED'
STATION
r-Io--l-,
I
I
I
DATA
•
.., ISOLATED
I r-Io--l-, I STATION
I
I
I
I
DATA
(b) MULTIDROP
Figure 17. 'Simplex Current Loop System 'Configurations for' (a) Polnt-Io-Polnt, (b) Multidrop
ILOOP'= 20 rnA
Vee =5Vdc-27Vdc
Vec
Vdc
R2
H
R3
II
10
15
24
27
1K
2.15K
3.16K
5.62K
6.19K
82.5
237
383
681
750
Figure 18. Recommended Non-Isolated Active Transmitter with HCPL-4200 Isolated Receiver lor Simplex Point-Io-Polnt 20 mA
Current Loop
Length of current loop (one direction) versus minimum
required DC supply voltage, Vee, of the circuit in Figure
18 is graphically illustrated in Figure 19. Multidrop configurations will require larger Vee than Figure 19 predicts in
order to account for additional station terminal voltage
drops.
Typical data rate performance versus distance is illustrated in Figure 20 for the combination of a non-isolated
active transmitter and HCPL-4200 optically coupled current loop receiver shown in Figure 18. Curves are shown
for 10% and 25% distortion data rate. 10% (25%) distortion
data rate is defined as that rate at which 10% (25%) distortion occurs to output bit interval with respect to input bit
interval. An input Non-Return-to-Zero (NRZ) test waveform
of 16 bits (0000001011111101) was used for data rate distortion measurements. Data rate is independent of current
source supply voltage, Vee.
The cable used contained five pairs of unshielded, twisted,
22 AWG wire (Dearborn #862205), Loop current is 20 mA
nominal. Input and output logic supply voltages are 5 V
dc.
FULL DUPLEX
The full duplex point-to-point communication of Figure 21
uses a four wire system to provide simultaneous, bidirectional data communication between local and remote
=
Vee'" 0,00212
~
equipment. The basic application uses two simplex pointto-point loops which have two separate, active, nonisolated units at one common end of the loops. The other
end of each loop is isolated.
As Figure 21 illustrates, the combination of Hewlet.tPackard current loop optocouplers, HCPL-4100
transmitter and HCPL-4200 receiver, can be used at the
isolated end of current loops. Cross talk and common
mode coupling are greatly reduced when optical isolation
is implemented at the same end of both loops, as shown.
The full duplex data rate is limited by the non-isolated
active receiver current loop. Comments mentioned under
simplex configuration apply to the full duplex case. Consult the HCPL-4100 transmitter optocoupler data sheet for
specified device performance.
HALF DUPLEX
The half duplex configuration, whether pOint-to-point or
multidrop, gives non-simultaneous bidirectional data flow
from transmitters to receivers shown in Figures 22a and
22b. This configuration allows the use of two wires to
carry data back and forth between local and remote units.
However, protocol must be used to determine which specific transmitter can operate at any given time. Maximum
data rate for a half duplex system is limited by the loop
current charging time. These considerations were explained in the Simplex configuration section.
~ III t 4.~S V _ _ _ _
:....- RCAllL.E -= 0.05298 Q/m
:--IWOV':/OmA
~
28 :,............. VMARK ,. 2.75 Vdc (HCPl-4200) 24
VSAT" 1,5 Vdc (CORRENT SOURCE):::;
=
~2°111
~
16
L
12
0, a
100
1000
10000
100,000
L = LOOP LENGTH (ONE DIRECTION) - METRES
LOOP LENGTH (ONE DIRECTION) - METRES
Figure 19. Minimum Required. Supply Voltage, Vee, VS.
Loop Lenglh lor Currenl Loop Circuit 01 Figure 18
Figure 20. Typical Dala Rale vs. Dlslance
9-99
,-----,
NON-ISOLATED STATION
I
DATA
DATA
I
I
I
DATA
DATA
L- _ _ _ _ -I
Figure 21. Full Duplex Polnt-to-Polnt Current Loop
System Conllguration
Figures 22a and 22b illustrate hali duplex application for
the combination of HCPL-4100/-4200 optocouplers. The
unique and complementary designs of the HCPL-4100
transmitter and HCPL-4200 receiver optocouplers provide
many designed-in benefits. For example, total optical iso-
lation at one end of the current loop is easily accomplished, which results in substantial removal of common
mode influences, elimination of ground potential differences and reduction of power supply requirements. With this
combination of HCPL-4100/-4200 optocouplers, specific
current loop noise immunity is provided, i.e., minimum
SPACE state current noise immunity is 1 mA, MARK state
noise immunity is B mA.
Voltage compliance of the current source must be of an
adequate level for operating all units in the loop while not
exceeding 27 V dc, the maximum breakdown voltage for
the HCPL-4100. Note that the HCPL-4100 transmitter will
allow loop current to conduct when input Vee power is
off. Consult the HCPL-4100 transmitter optocoupler data
sheet for specified device performance.
For more information about the HCPL-4100/-4200 optocouplers, consult Application Note 101 B.
NON-ISOLATED
STATION
DATA
DATA
DATA
DATA
IL- _ _ _ _ - I
(a)POINT-TO-POINT
DATA
DATA
ISOLATED
STATION
NON-ISOLATEO
STATION
1.----,
...... - - - - 1
I
I
I
DATA
I
I
I
I
I
~~~x=~~~~=x~~>c>C>C~t
DATA
i--
I
ISOLATED
STATION
I
I
I
XM"TR
HCl't.-4100
RCVR
HCl'L-4200
L_
DATA
I
I
_.J
DATA
(b) MULTIDROP
Figure 22. Half Duplex Current Loop System Configurations for (a) Point-to-Polnt, (b) Multidrop
9-100
I
I
I
I
I
DATA
HerInetic Optocouplers
9-101
rlin-
a!aI
WIDE SUPPLY VOLTAGE,
HIGH CMR, HERMETICALLY
SEALED OPTOCOUPLER
HEWL.ETT
PACKARD
SCHEMATIC
I
~
HCPL~5200
HCPL-S201
(883B)
OUTLINE DRAWING
,-----1t-----Qs Vee
+J'!'"1":
2
I
3
I
I
I
VF
-
~--~--~---oGND
SHIELD
TRUTH TABLE
5
(Positive Logic)
Features
• NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
• HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
• PERFORMANCE GUARANTEED OVER ~55° C TO
+1250 C AMBIENT TEMPERATURE RANGE
• WIDE Vcc RANGE (4.5 TO 20 VOLTS)
• MIL-STD-883 CLASS B TESTING
• 500 Ydc WITHSTAND TEST VOLTAGE
• COMPATIBLE WITH LSTTL, TTL, AND CMOS
LOGIC
• 300 ns PROPAGATION DELAY GUARANTEED
OVER TEMPERATURE
• HCPL-2200 FUNCTION COMPATIBILITY
• THREE STATE OUTPUT (NO PULLUP RESISTOR
REQUIRED)
• INTERNAL SHIELD FOR HIGH COMMON MODE
REJECTION -1000 V/IJ.S GUARANTEED
Applications
• MILITARY/HIGH RELIABILITY SYSTEMS
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• COMPUTER-PERIPHERAL INTERFACES
• MICROPROCESSOR SYSTEM INTERFACES
• GROUND LOOP ELIMINATION
• PULSE TRANSFORMER REPLACEMENT
• ISOLATED BUS DRIVER
• HIGH SPEED LINE RECEIVER
Description
The HCPL-5200 and 5201 units are hermetically sealed,
logic gate optocouplers. The products are capable of
operation and storage over the full military temperature
range and can be pu rchased as either a standard product
(HCPL-5200) or with full MIL-STD-883 Class Level 8 testing (HCPL-5201). 80th products are in eight pin hermetic
dual in-line packages.
Each unit contains an AIGaAs light emitting diode which is
optically coupled to an integrated high gain photon detector. The detector has a three state output stage and has
a detector threshold with hysteresis. The three state output
eliminates the need for a pullup resistor and allows for
direct drive of data busses. The hysteresis provides differential mode noise immunity and eliminates the potential
for output signal chatter. The detector IC has an internal
shield that provides a guaranteed common mode transient
immunity of 1,000 Volts/lLsec. Improved power supply
rejection eliminates the need for special power supply
bypassing precautions.
The HCPL-5200 and HCPL-5201 are guaranteed to operate
over a Vee range of 4.5 Volts to 20 Volts. Low IF and wide
Vee range allow compatibility with TTL, LSTTL,.and CMOS
Logic. Low IF and low Icc result in lower power consumption compared to other high speed optocouplers. Logic
signals are transmitted with a typical propagation delay of
100 nsec when used in the circuit of Figure 12.
These devices are useful for isolating high speed logic
interfaces, buffering of input and output lines, and implementing isolated line receivers in high noise environments.
Recommended operating
Conditions
Absolute Maximum Ratings
MaX.
Units
Power Supply \/oltage
Vec
4.5
20
V~its
Enable Voltage High
2.0
VEH
VEL . . 0
2q.;
Volts
0:8
Volts
'Parameter
ri f
Enable Voltage Low
Symbol Min.
Input Current (High)
IF (ON)
4
8
mA
Input Voltage (Low)
VF (OFF)
0
0.8
Volts
4
TTL Loads
N
rFan Out
Storage Temperature ...•.•..•.....• -65° C to +150° C
Operating Temperature .............. -55° C to 125° C
Lead Solder Temperature. . . . . . . . . . . . •. 260° C for 10 s
(1.6 mm below seating plane)
Average Forward Input Current - IF ............. 8 mA
Peak Transient Input Current - IFPK . .. . . . . .. 20 mA [11
Reverse Input Voltage - VR ....•.•.•........... 5 V
Supply Voltage - Vcc ........... 0.0 V min., 20 V max.
Three State Enable
Voltage - V E ..........•... " -0.3 V min., 20 V max.
Output Voltage - Vo ........... -0.3 V min., 20 V max.
Total Package Power Dissipation - Pd .... " .. 200 mW
Average Output Current - 10 ................. 15 mA
Electrical Characteristics
TA = -55°C to 125°C, unless otherwise specified.
For 0 V ~ VF(OFF) ~ 0.8 V, 4.5 V ~ Vcc ~ 20 V, 4 mA ~ IF(ON) ~ 8 mA, 2.0 V ~ V EH ~ 20 V, O. V ~ VEL ~ 0.8 V
.iPafliitWler
Symbol
Logic Low Output Voltage
VOL
Logic High Output Voltage
VOH
Output Leakage Current
(VOUT> Vecl
10HH
cdjiglliilns
Min.
lYp,.
Max.
Unlt$
Test
Volts
'Ol'" 6.4 mA (4 TIL Loads)
2.4
..
0.5
Volts
Volts
IOH=-2.6 mA
10H = -0.32:IliA
("VOH = V('.('. - 2.1 V)
Vo=5.5V
Vo = 20 V
IF = 8 mA
Vee = 4.5 V
3.1
100
500
p.A
JlA
2.0
VEH
Logic Low Enable Voltage
VEL
0.8
Volts
20
p.A
VEN" 2.7 V
Logic High Enable Curent
IEH
100
p.A
VEN= 5.5 V
250
JlA
VEN = 20 V
-0.32
mA
VEN = 0.4 V
0.004
IEL
Logic Low Supply Current
ICCl
4.5
3.3
IOZl
High Impedance State
Output Current
6.0
5.3~
2.9
Logic High Supply Current ICCH
IOZH
.
IOSL
Logic High Short Circuit
Output Current
10SH
Input Forward Voltage
VF
1.0
Input Reverse Breakdown
Voltage
VR
5
Input-Output Insulation
11-0
1.3
mA
Vee = 5.5 V
VF= 0 V
mA
VCC=20V
VE = Don't Care
mA
mA
Vce = 5.5 V
Vec=20V
'F" 8 mAo
VE = Don't Care
VEN" 2 V, VF = 0 V
-20
,..A
VO=O.4V
20
p.A
Vo = 2.4 V
100
p.A
VO=5.5V
500
,..A
Vo=20V
rnA
rnA
Vo
-10
-25
mA
mA
Vce=5.5V
Vee- 20V
1.B
Volts
IF=8mA
Volts
'R: 10IlA
20
35
Logic Low Short Circuit
Output Current
Nole
1,3
2,3
Volts
Logic High Enable Voltage
Logic Low Enable Current
Fig.
1
p.A
~
Vce" 5.5 V
VEN = 2 V, 'F = 8 mA
VF = 0.8 V
:2
IF ~ 8 mAo
Vo=GND
2
Vo~Vec=20V
4
45% RH, t " 55,
VI-O = 500 Vdc, TA " 25°C
3,4
Propagation Delay Time to
tPHL
Logic Low Output Lavel
100
300
ns
5.6
5
Propagation Delay Time to
tpLH
Logic High Output Lellel
90
300
nS
5,6
5
9,10
6
9,10
6
LogiC High Common Mode
ICMHI
Transient Immunity
1000
10,000
VII'S
Logic Low Common Mode
jCMd
Transient Immunity
1000
10,000
Vlp.s
TA=25·C.fF~4mA
VCM: 50 Vp.p
T A ~ 25' C, IF = 0 mA
VCM: 50 Vp_p
'All typical values are at TA = 25'C, Vee = 5 v. IF(ON) = 5 rnA unless otherwise specified.
9-103
Typical Characteristics
AI.I typical values are at Vee = 5 V, T A = 25 0 G, IF(ON) = 5 mA unless otherwise specified.
Parameter
Symbol Typ.
Units
Test Conditions
Figure Note
Input Current Hysteresis
IHYS
0.Q7
Input Diode Temperature Coefficient
~
-1.25 mV/"G
Input-Output Resistance
RI-o
1012
ohms
Input-Output Capacitance
CI-O
2.0
pF
f '" 1 MHz
Input Capacitance
GIN
15
pF
f '" 1 MHz, VF " 0 V
Output Enable Time to Logic High
tpZH
30
ns
mA
Vee=5 V
3
IF'" 8 mA
ATA
4,7
VI.O " 500 V dc
7
8
7
Output Enable Time to Logie Low
tpZL
30
ns
7
Output Disable Time from Logic High
tpHZ
45
ns
7
Output Disable Time from Logie Low
tpLz
55
ns
7
Output Rise Time (10-90%)
Ir
45
ns
5,8
Output Fall Time (90-10%)
If
10
ns
5,8
Notes:
1. Peak Forward Input Current pulse width < SOl'S at 1 KHz maximum repetition rate.
2. Duration of output short circuit time not to exceed 10 ms.
3. Device considered a two terminal device: pins 1, 2, 3 and 4 shorted together, and pins 5, 6, 7 and 8 shorted together.
4. This is a momentary withstand test, not an operating condition.
5. The tpLH propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.3 V point on the leading
edge of the output pulse. The tpHL propagation delay is measured from the 50% point on the trailing edge of the input current pulse
to the 1.3 V point on the trailing edge of the output pulse.
6. CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state
(Vo < 0.8 V). CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic
high state (Vo > 2.0 V).
7. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together.
8. Zero bias capacitance measured between the LED anode and cathode.
1
l« .•15
>
I
0.9
0.7
'"~
0.6
::>
o
_
'"
If "'OmA
~
g
lo-""MmA-
O.B
-2
-3
0.5
-4
~
I--0.4
-5
§
0.3
I
0.2
.;
O.
~
-6
,
o
"""-
v••
,I,
'"
~cc ~41v_
If
"~rnA
65
95
V
f'\.
Vo '" 2AV
---
-7
-55
-25
35
95
65
-8
-55
125
-25
Figure 1. Typical Logic Low Output Voltage vs. Temperature
10.0
>
I
~
lo~ -
-i.o ff1A
~o
I
r
_v'
1.0
~i3
o.
'~
0.0
'~
~
1,1
~
~
.s
w
~
125
Figure 2. Typical Logic High OutpulCurrent vs. Temperature
Vile'" 4.5 V
TA .. 25"C
§;
35
TA - TEMPERATURE -"C
TA - TEMPERATURE - "C
/
~
1
~
o
>
10"1.- "'K4mA
°o~------L-------~----~
0.00
, /
V
1.050 1.100
I" - INPUT CURRENT - rnA
V
+:)
V
TA
,,~t:~c
/
1.150
1.200
1.250
1.300
1.350
VI' - FORWARD VOLT AGE (V)
Figure 3. Output Voltage vs. Forward Input Current
Figure 4. Typical Input Diode Forward Characteristic
9-104
PULSE
GENERATOR
200
~mA
IF '"
.-kG
Vee. '" 5 V
CL
c
I
15 pF
'"
150
~
C
Z
C
-=-
~
,/
100
::::::: ~V
;;:'"
c
g:
THE PROBE AND JIG CAPACITANCES ARE
INCLUDED IN CL
..
I
ALL DIODES ARE 1N916 OR 1N3064
/
.....
k'
-
50
o
INPUT IF
,/
..........-
-
PWO·
-55
-25
65
35
125
95
TA - TEMPERATURE _ °C
OUTPUT
Vo
"PULSE WIDTH DISTORTION (ns) AT 100 KHz, 10"10 DUTY CYCLE.
Figure 6. Typical Propagation Delay vs. Temperature
Figure 5. Tesl CirculI for 'pLH. tpHL. I r • and If
. - - - - ' C L = 15 pF INCLUDING PROBE
AND JIG CAPACITANCE
Vee
120
Vee)s V
I~
100
02
03
04
:E
;::
80
-'
-'
;l
ii'
..
INPUT
V,
I
"
40
;;
20
Vo
1,3V
,//
t,.
60
lii
01-4 ARE 1N916 OR 1N3064 "':"
OUTPUT
-
-25
-55
S2 CLOSED
..........-
r-.l!
o
-S-'-0-P-EN-'"--OV
35
~10000
"...
125
\
:!
a5
i',.
6000
~
u;
~
a;
~ 4000
~
-50V'
c
o
"
OV
SWITCH AT A: IF = 4 rnA
~
2000
I
0
"8"
VOH
o
95
I
\
I
~
~ 8000
eUTPUT
65
Figure 8. Typical Rise. Fall Time vs. Temperature
Figure 7. Test Circuli for tpHZ. 'pZH. 'pLZ. and 'pZL
VeM
=5mA __
Cl. '" 15.pF
SWITCH AT B: IF = 0 rnA
u
"
VOL
Figure 9. Tesl Clrcuil for Common Mode Transienllmmunity and
Typical Waveforms
9-105
100
0
VCM
.. SEE NOTE 6
-
200
300
400
500
COMMON MODe TRANSIENT VOLTAGE - V
Figure 10. Typical Common Mode Transient Immunity vs.
Common Mode Transient Amplllude
Figure 12. Recommended LED Drive Circuit
Figure 11. LSTTL to CMOS .Interlace Circuit
,..----.,---0 ~~)
Vee
I<5V)
DATA
I
,.
, •
OUTPUT
I
I
II"'-!..
.... >-0
:I LAI LOADS
UP TO 16 LSTTL
' .r......!... OR 4 TTL LOADS
H
>-0
DATA
INPUT
.:
I
I
~-1
i'..~. .
L.1
L.....
Figure 13. Series LED Drive with Open Collector Gate (4.02 Kfl
Resistor Shunts 10H from the LED)
,,""""-0
Figure 1". Recommended LSTTL to LSTTL Circuit
MIL-STD-883 CLASS B TEST PROGRAM
PART NUMBERING SYSTEM
Hewlett-Packard's HCPL-5201 optocoupler is in compliance with MIL-STD-883, Revision C. Testing consists of
100% screening to Method 5004 arid quality conformance
inspection to Method 5005. Details of these test programs
may be found in Hewlett-Packard's Optoelectronics Designer's Catalog.
Commercial Product
Class B Product
HCPL-5200
HCPL-5201
Vee + 20 V
See table for specific electrical tests, pg. 6.
+
11t.=.--AN'v--f
VIN
1.90 V
1Don
l!....._~......- ......-I
CONDITIONS: IF • 8 mA
10
";
-15 mA
Figure 15. Operating Circuit for Burn-In and Steady State
.
Life Tests
9-106
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO.
= 116/0
Subgroup 1
'Static tests aLTA
=25"C -
VF, VR' 11-0, 'OHH, VOH, VOL, iccH. IGCl~ioZL. 'EH. '~k' VEL, VEH• 10Sl. IOSH
Subgroup 2
'Static tests alTA
Subgroup 3
=+125°C -
"
.••';; EL. <
VF, VR, 10HH. VOHo VOL, ICCH. ICCl. 10Zl, IEH.IEL.
...
"". ...
VEH, 10SL' 10sH
.;.'. .'•.
"Stalic tests at TA = -55°9 - VF• VR. 10HHiVOH. VoL.lcCH. 'ceblozl. IEH,JElIeYEL, VEH. 10SL' 10§H
Subgroup 4. 5, 6, 7, SA and 88
These subgroups are not applicable to this device type.
Subgroup 9
'Switching tests at T A
=25"C -
tpHL. tpLH.lcMHI, ICMLi
Subgroup 10
'Switching tests at T A" +125° C - tpHL' IpLH
Subgroup 11
'Switch tests at T A
=-55" C -
tpHL, tpLH
"Limits and conditions per Electrical Characteristics.
9-107
rlin-
DUAL CHANNEL
WIDE SUPPLY VOLTAGE,
HIGH CMR, HERMETICALLY
SEALED OPTOCOUPLER
HEWLETT
~e.. PACKARD
I"
+}'- J
r~--j
I.!.
9.90 (0.390) 1.1
SCHEMATIC
r-----~-~-ov"
8
I
v"
-
2
1F2
_J3V"
7
-I
I
I
I
PIN . .
ONE,
~~::f:~:E
5
LETTER)
2
3
4
n
TYPE
NUMBER
l~i~~S::~)
7.'J1 (0.290)
~J
8.'3 (0.3201
AX . U
M
"20 (00'°)
v., 3• (O.·0'~4)
O
•
""=::!===ilp...!..
0.51 IQ.020)
~j' c:~~:~o:
J
(POSITIVE LOGICI
6
XXXXXXXXX
i
-I
4
I
T~UTH TABLE I
7
(883B)
OUTLINE DRAWING
HP YYWWX
U. S.A.
t--t--oVo,
HCPl-S230
HCPl-5231
~ ~ ~ ~-l
OS, --II-~JI
5
(0.0201
~--=-"":";-+---""""-""""---oGND
MAX.
381
(0:'50)
MIN.
CATHODE"
CATHODE 23
AI'IOPE 2 4
5 GND
....._ _.J'
2.28 (0.901
2.80: m:111il
DIMENSIONS IN MILLIMETERS AND (INCHES)
Features
Applications
• NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
• MILITARY/HIGH RELIABILITY SYSTEMS
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
• COMPUTER-PERIPHERAL INTERFACES
• MICROPROCESSOR SYSTEM INTERFACES
• PERFORMANCE GUARANTEED OVER -55° C TO
+125° C AMBIENT TEMPERATURE RANGE
• PULSE TRANSFORMER REPLACEMENT
• WIDE Vcc RANGE (4.5 TO 20 VOLTS)
• ISOLATED BUS DRIVER
• MIL-STD-883 CLASS B TESTING
• HIGH SPEED LINE RECEIVER
• 500 Vdc WITHSTAND TEST VOLTAGE
• COMPATIBLE WITH LSTTL, TTL, AND CMOS
LOGIC
• 300 ns PROPAGATION DELAY GUARANTEED OVER
TEMPERATURE
• HCPL-2231 FUNCTION COMPATIBILITY
• TOTEM POLE OUTPUT (NO PULL-UP
RESISTOR REQUIRED)
• NO OPTICAL CROSSTALK
• INTERNAL SHIELD FOR HIGH COMMON MODE
REJECTION - 1000 V/!-,s GUARANTEED
Description
The HCPL-5230 and 5231 units are dual channel, hermetically sealed, logic gate optocouplers. The products are
capable of operation and storage over the full military
temperature range and can be purchased as either a
standard product (HCPL-5230) or with full MIL-STO-883
Class Level B testing (HCPL-5231). Both products are in
eight pin hermetic dual in-line packages.
Each unit contains two independent channels, consisting
of an AIGaAs light emitting diode optically coupled to an
integrated high gain photon detector. The detector has a
totem pole output and a threshold with hysteresis. The
hysteresis provides differential mode nois.e immunity and
eliminates the potential for output signal chatter. The
detector IC has an internal shield that provides a guaranteed common mode transient immunity of 1,000 volts/
!-,sec. Improved power supply rejection eliminates the need
for special power supply bypassing precautions.
The HCPL-5230 and HCPL-5231 are guaranteed to operate
over a Vcc range of 4.5 Volts to 20 Volts. Low I F and wide
Vec range allow compatibility with TTL, LSTTL, and CMOS
logic. Low IF and low Icc result in lower power consumption compared to other high speed optocouplers. Logic
signals are transmitted with a typical propagation delay of
100 nsec when used in the circuit of Figure 11.
These devices are useful for isolating high speed logiC
interfaces, buffering of input and output lines, and implementing isolated line receivers in high noise environments.
9-108
Recommended Operating
Conditions
Parameter
SynUlol Nlln. IlVIax.
Power Supply Voltage
Vee
4.5
20
4
8
mA
VF (OFF)
0
a8
Volts
4
TTL Loads
@®
Fan Out
N
Storage Temperature •.••••••••••••• -65°C to +150°C
Operating Temperature ..•••.••.••.• -55°C to +125°C
Lead Solder Temperature. • • . • . . • . • . • •. 260° C for 10 s
(1.6 mm below seating plane)
Average Forward Input Current - IF •.••.•••••.•• 8 mA
Peak Transient Input Current - IFPK •..•..•••• 20 mA11]
Reverse Input Voltage ..•.•••••••••••••.••.•.•• 5 V
Supply Voltage - Vee •....•.••.• 0.0 V min., 20 V max.
Output Voltage - Vo •••.••.••.• -0.3 V min., 20 V max.
Total Package Power DisSipation - Pd • • •• •• •• 400 mW
Average Output Current - lo(per channel) •.•..• 15 mA
Units
IF (ON)
Input Current (High)
Input Voltage (Low)
Absolute Maximum Ratings
Volts
Electrical Characteristics T
A = -55°C to 125° C, unless otherwise specified.
For 4.5 V:S; Vee:S; 20 V, 4 mA:S; IF(ON):S; 8 mA, 0 V:S; VF(OFF):S; 0.8 V
Parameter
~ym~bol
Logic Low Output Voltage
VOL
Logic High Output Voltage VO H
Output Leakage Current
(VouT>Ved
"Min.
1)'p••
Max.
Units
Test Conditions
Volts
]OL
2.4
..
0.5
Volts
IOH"-2.6mA
3.1
IOHH
Logic Low Supply Current
Ieel
I
Logic High Supply Current
5.8
6.6
ICCH
Logic Low Short Circuit
Output Current
Logic High Short Circuit
Output Current
9.0
10.6
IOSL
20
35
IOSH
-10
-25
Input Forward VOltage
VF
1.0
Input Reverse Breakdown
Voltage
VR
5
I
I
1.3
Volts
100
500
p.A
p.A
12.0
mA
*
12.0
1.8
Fig.
=6.4 mA (4 TTL Loads)
("VOH '" Vee-2.1Af)
Note
1,3
2
2,3
2
IOH :: -0.32 mA
=
Vo 5.5 V
Vo"20V
IF'" 8 mA
Vcc 4.5 V
=
~
Vee'"
V
2
VF1=VF2"OV
mA
5.5
Vee = 20 V
mA
rnA
Vo '" Vee 5.5 V
Vo = Vee = 20V
VF"'OV
2,3
mA
mA
Vce = 5.5 V
Vee 20V
IF=8 mA,
Vo =GND
2,3
=
Volts
IF=8mA
Volts
IR =10 p.A
IF1 " IF2
=8 mA
4
2
2
........
Input-Output
Insulation
1'-0
1
p.A
Propagation Delay Time to tpHL.
Logic Low Output Level
100
300
ns
Propagation Delay Time to tpLH
Logic High Output Level
90
300
ns
=
45% RH, t 55,
V,-o " 500 Vdc, T A = 25"C
=
I
4,5
5,6
2,6
5,6
2,6
Logic High Common Mode ICMHI
Transient Immunity
1000 10,000
Vlp,s
TA 25°C,IF"4 rnA
VeM =50 Vp,p
8,9
2,7
Logic Low Common Mode ICMt!
Transient Immunity
1000 10,000
V!p.S
T A = 25"C, IF'" 0 mA
VeM '" 50 Vp.P
8,9
2,7
"All typical values are at TA = 25°C,Vee = 5 V, IF (ON) = 5 mA unless otherwise specified.
Notes:
1. Peak Forward Input Current pulse width < 50 "s at 1 KHz maximum repetition rate.
2. Each channel.
3. Duration of output short circuit time not to exceed 10.ms.
4. Device considered a two-terminal device: Pins 1 through 4 are shorted together, and pins 5 through 8 are shorted together.
5. This is a momentary withstand test, not an operating condition.
6. tpHl propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.3 V paint on the leading edge
of the output pulse. The tplH propagation delay is measured from the 50% point on the trailing edge of the input pulse to the 1.3 V
paint on the trailing edge of the output pulse.
7. CMl is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state
(Vo < 0.8 V). CMH is the maximum rate of fall of the common mode voltage that can be sustained .with .the output voltage in the
logic high state (Vo > 2.0 V).
8. Measured bet~een the LED anode and cathode shorted together and pins 5 through 8 shorted together.
9. Measured between adjacent input pairs shorted together, i.e. between pins 1 and 2 shorted together and pins 3 and 4 shorted
together.
10. Zero-bias capacitance measured between the LED anode and cathode.
9-109
Typical Characteristics
All typical values are at Vee" 5 V, T A" 25° C, IF (ON)" 5 rnA unless otherwise specilied.
Parameter
Fig.
Note
3
2
Symbol
TYP·
Units
Input Current Hysteresis
IHYS
0.07
rnA
Vee'" 5V
Input Diode Temperature Coefficient
AVF
ATA
-1.25
mW·C
IF=8 mA
I nput-Output Resistance
RI-o
1012
ohms
VI_O " 500 Vdc
2,8
Input-Output Capacitance
CI-O
2.0
pF
I
2,8
IH
0.5
nA
45% Relative Humidity,
VH "500 Vdc, T A = 2Soc, t = 5 s
Input-Input Insulation
Leakage Current
Test Conditions
2
=, MHz
9
Resistance (Input-Input)
RI-)
1012
n
VI-I" 500 Vdc
9
Capacitance (Input-I nput)
Cf-I
1.3
pF
f" 1 MHz
9
Input Capacitance
f=1MHz,VF=OV
CIN
15
pF
Output Rise Time (10-90%)
Ir
45
ns
5, 7
2
Output Fall Time (90-10%)
tf
10
ns
5,7
2
~
0.9
"~
~e<:
.4!S IF "'UmA
0.8
10·6,4 mA-
>
g
....
::::>
1=
0.7
0,5
w
0,4
9I
~
I
....
-1
a:
a:
-2
~
""....
~"
0.6
"....o
~
;::
"E
o
l--
~
....
-5
;J:
-6
":;:
0.2
I
,o
0.1
-55
-4
....
w
0.3
o
-3
35
-25
65
95
L '4.~V_
IF'" SmA
Vo .217 V
""" '"I\.
r--
I"'"- ~'2.4V
-7
-8
-55
125
2,10
-25
35
95
65
125
TA - TEMPERATURE _ DC
Figure 2. Typical Logic High Output
Current vs. Temperature
Figure 1. Typical Logic Low Output
Voltage vs. Temperature
10.0
Vee
II>
4$ V
E
>
~
I
w
.s....
"~
a:
~
....
....
;r
";r
!;
o
0.1
~
~
I
oJ
::J
r
ffi
fOM '" -2.6 mA
g
1.0
.,1
1
1. ·;I5"C
~
0.01
1
~
101. "'6..4 mA
/
0.00 1
0
1.050
/
1.100
/
L
V
V
' •• 26'C
/
1.150
1.200
1.250
1.300
1.350
VF - FORWARD VOLTAGE {V}
IF -INPUT CURRENT - mA
Figure 4. Typical Diode Input Forward
Characteristic
Figure 3. Output Voltage vs. Forward
Input Current
9-110
PULSE
GENERATOJI
lR =tF -5ns
f -100kHz
Vee
IGf\QjJTY
6V
CVC~E
~
I
~
w
Q
Z
o
~
-=
co
~
o
THE PROBE AND JIG CAPACITANCES ARE
INC~UDED IN CL
if
..
I
ALL DIODES ARE IN91B OR lN3064
PWD"
PLH
' .
- - VOH
~
OUTPUT
Vo
tPHL
-25
35
__
65
~
____
~
__
~
__
~
~
-55
OmA
---------
__
~
___ IF (ONI
-)50% IF ION)
95
__
~
-d ------
O
INPUT IF
126
TA - TEMPERATURE _DC
1.3V VOL
"PULSE WIDTH DISTORTION (nsl AT 100 KHz. 10% DUTY
CYC~E.
Figure 6. Typical Propagation Delay vs.
Temperature
Figure 5. Test Circuit for tpLH. tpHL. t r • and tf
120
Vee .. Is V
~L :;~F-
100
w
:0
;::
80
oJ
oJ
;1:
...
60
........
:l!'
a:
I
.
::
..... .".
/
V
20
~
-50V
VCM'
40
-
OV
-
-.!!.
o
-65
SWITCH Pir A: IF = 4 mA
VOH~~""
-25
35
65
95
OUTPUT
Vo
'\.L_vo (mlnl*
SWITCH AT B: IF • 0 rnA
V
VOL
125
·SEE NOTE 7
TA -TEMPERATURE _oC
Figure 8. Test Circuit for Common Mode Transient
Immunity and Typical Waveforms
Figure l Typical Rise. Fall Time vs.
Temperature
~10000
1
\
\.
I
~
§
BODO
:0
!
~
~
w
6000
"-
..........
4000
~
~ 2000
RL
:0
8
I
~
'1.ii<
2.37K
3.83K
5.11K
0
100
0
VCM
-
200
300
COMMON MODE TRANSIENT
400
VO~TAGE
500
- V
Figure 9. Typical Common Mode Transient Immunity vs.
Common Mode Transient Amplitude
Figure 10. LSTTL to CMOS Interface Circuit
9-111
Vee
1+5V)
Vee1
I+5V)
619 n
750 n
DATA
INPUT
Figure
DATA
INPUT
11. Recommended LED Drive Circuit
Figure
12. Series LED Drive with Open Collector Gate
(4.02 KO Resistor Shunts 10H from the LED)
,..---.,...-0 ~~~I
DATA
OUTPUT
I
I
665
n
665
i'~. L
tI ..~L......1. >'-0
UP TO 16 LSTTL
n
HCPL·5230
I
•
I
DATA
INPUT
LOADS
~
i......t.. OR 4 TTL LOADS
I
L......."
n,
I
;....0
I
i'."~"''''
.....
t..'
DATA I
OUTPUT L 1
;10 ..
-0
Figure 13. Recommended LSTTL to LSTTL Circuit
MIL-STD-883 CLASS B TEST PROGRAM
PART NUMBERING SYSTEM
Hewlett-Packard's HCPL-5231 optocoupler is in compliance with MIL-STD-883, Revision C. Testing consists of
100% screening to Method 5004 and quality conformance
inspection to Method 5005. Details of these test programs
may be found in Hewlett-Packard's Optoelectronics Designer's Catalog.
Commercial Product
Class B Product
HCPL-5230
HCPL-5231
Vee + 20 V
See table on next page for specific electrical tests.
Figure 14. Operating Circuit for Burn-In and
Steady State Life Tests
9-112
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Subgroup 1
'Static tests at T A
=25°C -
VF• VR. II-a. IOHH. VOH. VOL. ICCH. ICCL. iOSL. laSH
Subgroup 2
'Stalic tests at TA
=+125"C...,. VF. VR. 10HH. VOH. VOL, ICCH. leCl' 10SL. IOSH
Subgroup 3
'Static tests at T A
=-55"C -
VF. VA. IOHH' VOH. VOL, ICCH. leCl, 10SL. IOSH
Subgroup 4, 5, 6, 7, 8A and 88
These subgroups are not applicable to this device type,
Subgroup 9
'Switching tests at T A
Subgroup 10
'Switching tests at T A
=25°C -
tpHL. tplH, iCMHl.iCMd
=+12S"C -
tpHL. tpLH
Subgroup 11
'Switch tests at T A" -55" C - tpHL, tplH
'Limits and conditions per Electrical Characteristics.
9-113
Flin-
HEWLETT
~~ PACKARO
HIGH SPEED,
HERMETICALLY SEALED
OPTOCOUPLER
SCHEMATIC
HCPl-S400
HCPl-S401
(8838)
OUTLINE ORAWING
r--_ _~_---"""CC,--o8 Vee
2,ANODE ) '
v,'
CATHODE
DATE CODe
~
TRUTH TABLE
(POSITIVE LOGIC)
n
(-,SUffiX
~
5
XXXXXXXXX
L---~---OGND
DIN
<
1
LETTER 1
TVPE
S.ll W.3201
NUMBER
MAX.
U
H1CPL.54001
{64011l1113B)
...
-
ONE
2
7.:r7 (O.290)
7.87 (Q.3101
4
0.2010.008)
0.:l6 (0,0141
"""'~==l:,...L
I
Y1fl7'" ~~ '~s
3.91 (0.160)-1
Features
ANODE Z
• NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
o.a1
10.020)
-ll-~'I
MAX,
• HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
3.81
(0.160)
MIN.
CATHODE 3
Vee
7 VE
.....
11.
NC 4
6 Va
5 GND
2.ZB IO.aOl
2.ao to.ll01
• PERFORMANCE GUARANTEED OVER -55°C TO
+125°C AMBIENT TEMPERATURE RANGE
DIMENSIONS IN MILLIMETERS AND (iNCHES)
Applications
• MIL-STD-883 CLASS B TESTING
• MILITARYIHIGH RELIABILITY SYSTEMS
• HIGH SPEED GUARANTEED OVER
TEMPERATURE
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• COMPUTER-PERIPHERAL INTERFACES
• 75 ns MAXIMUM PROPAGATION DELAY
• 35 ns MAXIMUM PULSE WIDTH DISTORTION
• ISOLATED BUS DRIVER (NETWORKING
APPLICATIONS)
• HIGH COMMON MODE REJECTION - 500 VlJ,lS
GUARANTEED
• GROUND LOOP ELIMINATION
• HCPL-2400 FUNCTION COMPATIBILITY
• HIGH SPEED DISK DRIVE 1/0
• COMPATIBLE WITH TTL, STTL, LSTTL, AND
HCMOS LOGIC FAMILIES
• DIGITAL ISOLATION FOR AID, DIA CONVERSION
• SWITCHING POWER SUPPLIES
• PULSE TRANSFORMER REPLACEMENT
• THREE STATE OUTPUT (NO PULL-UP
RESISTOR REQUIRED)
a three state output stage. The three state output eliminates
the need for a pull-up resistor and allows for direct drive of
a data bus. The hysteresis provides typically 0.25 mA of
differential mode noise immunity and minimizes the potential for output signal chatter.
• HIGH POWER SUPPLY NOISE IMMUNITY
• 500 Vdc WITHSTAND TEST VOLTAGE
Description
The HCPL-5400 and HCPL-5401 units are hermetically
sealed, high speed optocouplers. The products are capable
of operation and storage over the full military temperature
range and can be purchased as either a standard product
(HCPL-5400) or with full MIL-STD-883 Class Level B testing (HCPL-5401). Both products are in eight pin hermetic
dual in-line packages.
Each unit contains an AIGaAs light emitting diode which is
optically coupled to an integrated high speed photon
detector. This combination results in very high data rate
capability. The detector has a threshold with hysteresis and
The HCPL-5400 and HCPL-5401 are compatible with TTL,
STTL, LSTTL, and HCMOS logic families. The 35 ns pulse
width distortion specification guarantees a 10 mBaud signaling rate at 125°C with 35% pulse width distortion, Figure 11
shows a recommended circuit for reducing pulse width
distortion and improving the signaling rate of the product.
CAUTION: The small junction sizes inherent to the design
of this bipolar component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is
advised that normal static precautions be taken in handling
and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
9-114
~--~------------~--------~
Recommended operating
Conditions
Parameter
Max.
Units
4.75 5.25
Volts
Symbol' Min.
Power Supply Voltage
Vee
Absolute Maximum Ratings
Input Current (High)
IF (ON)
8
10
mA
Input Voltage (Low)
VF (OFF)
-
0.7
Volts
'Enable Voltage (Low)
VEL
0
0.8
Volts
Enable Voltage (High)
VEH
2.0
Vcc
Volts
5
TTL Loads
N
fan Out
Storage Temperature .. , ................ -65°C to +150°C
Operating Temperature ................. -55°C to +125°C
Lead Solder Temperature ................. 260°C for 10 s
(1.6 mm below seating plane)
Average Forward Current-I FAVG ................. 10mA
Peak Input Current-IFPK ..................... 20 mAil]
Reverse Input Voltage - VR •••••••••••••••••••••••••• 5 V
SupplyVoltage-Vcc ................. OV min., 7.0V max.
Three State Enable Voltage - VE .... -0.5 V min., 10 V max.
Average Output Current-Io .... -25 mA min., 25 mA max.
OutputVoltage-Vo ............... -0.5 V min., 10V max.
Output Power Dissipation - Po .................. 130 mW
Total Package Power Dissipation Pd .............. 400 mW
Electrical Characteristics
TA = -55°C to 125°C, 4.75 V 5, Vce 5, 5.25 V, 8 mA 5, IF (ON) 5, 10 mA, 2.0 V 5, VEH 5, 5.25,0 V 5, VEL 5, 0.8 V, OV 5, VF(OFF) 5, 0.7V,
unless otherwise specified.
Symbol
Parameter
Logic Low Output Voltage
Min.
Typ.*
VOL
Logic High Output Voltage
VOH
Output Leakage Current
IOHH
Logic High Enable Voltage
VEH
Logic Low Enable Voltage
VEL
Logic High Enable Current
IEH
Max.
Units
Test Conditions
0.5
Volts
10l = 8.0 mA (5 TTL Loads)
1
IOH = -4.0mA
2
Volls
2.4
100
/lA
0.8
Volts
Volts
20
/lA
100
p.A
VE" 5.25V
VE '" 204 V
-0.28
-004
mA
Ve=Oo4V
Logic Low Supply Current
ICCL
19
26
mA
Vcc= 5.25V
Logic High Supply Current
lecH
17
26
mA
VE = OV
High Impedance State
Supply Current
lecz
22
28
mA
Vcc "5.25V
VE=5.25V
IOZl
20
j.lA
Va
fOZH
20
j.lA
Va'" 204V
100
/lA
I Vo = 5,25V
1.85
Volts
IF=10mA
Volts
IR" 10j.lA
High Impedance State
Output Current
Input Forward Voltage
VF
1.0
1.4
Input Reverse Breakdown
Voltage
VR
5.0
7.0
Input-Output Insulation
Leakage Current
11-0
Propagation Delay Time to
Logic Low Output Level
tpHL
Propagation Delay Time to
Logic High Output Level
Pulse Width Distortion
Note
Va" 5.25\1, VF= 0.7V
IEL
Logic Low Enable Current
Figure
=004\1, VE =2V
I VE =2V
I
4
1
j.lA
45% RH, t = 55,
VI-O " 500 Vdc, TA " 25°C
33
75
ns
IF (ON) = 9mA
5,6,7
4
tplH
30
65
ns
IF (ON) "9mA
5,6,7
4
ItpHL-tpLHI
3
35
ns
IF (ON) = 9mA
5,6
2,3
Logic High Common Mode
Transient Immunity
ICMHI
500
3000
VII'S
TA=25°C,fp=0
10
5
Logic Low Common Mode
Transient Immunity
ICMd
500
3
V/p.s
TA = 25°C, IF = 8mA
10
5
'All typical values are at Vec
=5V, TA =25'C
9-115
Typical Characteristics All typicals Vee = 5 V. VE = OV. TA = 25°C. IF = 9 mA except where noted.
Symbol
Typ.
Units
Input Current Hysteresis
IHVS
0.25
mA
Input Diode Temperature Coefficient
AVF
--
-1.11
mV/oC IIF=10mA
Input-Output Resistance
RI-o
1012
0~O=500VDC
Input·Output Capacitance
CI-o
0.6
Input Capacitance
CIN
15
Parameter
Figure Note
3
Test Conditions
4
aTA
pF
~
Logic Low Short Circuit Output Current
IOSl
65
Logic High Short Circuit Output Current
lasH
-50
tr
15
ns
Output Rise Time (10-90%)
Output Fall Time (90-10%)
2
"1 MHz, V,.o = OVdc
2
f'" 1 MHz, VF'" OV, Pins 2 and 3
6
{ ' " Vee" 5.25 V, IF'" lOrnA
6
co" S.25 V, IF';' OmA, Va'" GND
5
tf
10
ns
5
tpZH
15
ns
Output Enable Time to Logic Low
tpZL
30
ns
Output Disable Time from Logic High
tPHZ
20
ns
Output Disable Time from Logic Low
tpLZ
15
ns
8,9
8.9
8,9
8.9
PSNI
0.5
Vp-p
Output Enable Time to Logic High
Power Sl!PJ2fy Noise Immunity
7
46Hzs fAO:::; 50 MHz
Notes:
1. Not to exceed 5% duty factor. not to exceed 50 "sec pulse width.
2. Device considered a two terminal device: pin 1·4 shorted together, and pins 5·8 shorted together.
3. This is a momentary withstand test. not an operating condition.
4. tpHL propagation delay is measured from the 50% level on the rising edge of the input current pulse to the 1.5 V level on the falling
edge of the output' pulse. The tpLH propagation delay is measured from the 50% level on the falling edge of the input current pulse
to the 1.5 V level on the rising edge of the output pulse.
5. CMH is the maximum slew rate of common mode voltage that can be sustained with the output voltage in the logic high state
(Vo (MIN) > 2.0). CML is the maximum slew rate of common mode voltage that can be sustained with the output voltage in the logic
low state (Vo (MAX) <: 0.8 V).
6. Duration of output short circuit time not to exceed 10 ms.
7. Power Supply Noise'lmmunity is the peak to peak amplitude of the ac ripple voltage on the Voe line that the device will withstand
and still remain in the desired logic state. For desired, logic high state. VOH (MIN) > 2.0V. and for desired logic low state. VOL (MAX) <
0.8 volts.
>
>
w
g
g
!;
!5
~
~
~
o
~o
~
;:
§
§
l:
c:J
u
I
4.5
I
I
w
4.0
3.6
I
I
·c I
-- - lTTAT•i125
... ks·c
'"' .............
./
I
I I
vT fA '~55
2.0
-2
-4
-6
-8
-10
IOH - LOGIC HIGH OUTPUT CURRENT - mA
IOL - LOGIC LOW OUTPUT CURRENT - rnA
Figure 2. Typical Logic High Output Voltage
VS. Logic High Output Current
Figure 1. Typical Logic Low Output Voltage
VB. Logic Low Output Current
9-116
1000,----,--,.--...,..--,.---,
Vcc~5.0V
TA '" 25 "C
>,
~
Jot-! '" -4 mA
w
100
v~~
-+---1----,f-----i
t-
:ia:
~
a:
g
~
:J
t.>
o
a:
;:
a:
"
!;
,
o
ir
§
IOL."'.smA
o
o
1.5
IF-INPUT CURRENT - rnA
VF -
Figure 3. Typical Output Voltage vs. Input Forward Currenl
PVLSS
QENERATOR
lr"1f"'S,U
f;j- 500 KHz
25% DUTY
FORWARD VOLTAGE - VOLTS
Figure 4. Typical Diode Input Forward Current Characteristic
s.ov
Vee
HCPL·5400
CYCLE
Vo
OUTPUT
MONITORING
1.3K
NODE
n
100
IF
INPUT
MONITOR ING o--.,.-~ill-...t
NODE
,.
~ ~ mA
Vee "15 V
= 30 pF
Cl.
75
~
0
C1
15 pF
z
0
THE PROBE AND JIG CAPACITANCES ARE
~
REPRESENTED BY Cl AND C2.
ALL DIODES ARE ECG 519 OR EQUIVALENT.
INPUT
" tP~ - --- - -
- ...-t:::
f...-
~
-:1---5::",'ONI
IF (ON)
0
Ii:
25
"5-
~
-
I>
PWD
o r-
90%- -
1.SV
OUTPUT
50
to
-55
Vo
-25
35
65
TA - TEMPERATURE _
Figure 5. Test Circuit for tpLH. tpHL. I r • and If
95
125
°c
Figure 6. Typical Propagation Delay
vs. Ambient Temperature
Vee
PUL.SE
GENERATOR
Zo " 50})
5.0"
T
t f .. tf'" $ri$
51
'F o---+---1.lh
1.3K
n
50
fA"" 25-"C
D2
D3
,.
40
~0
z
0
i=
30
"
~
Ii:,
~
tPt.H
INPUT VE
MONITORING
NODE
----- ----
D4
0----4-+-----------'
3.QV
1.5 V
INPUT VE
OUTPUT Vo
20
52
"'1.5V
{IF" 9 mAl
VOL
o!
VOH
(IF =
"
IF - INPUT FORWARD CURRENT -rnA
5,
5,
CLOSED
OPEN
CLOSED
CLOSED
CLOSED
CLOSED
CLOSED
OPEN
"'1.5 V
OUTPUT Vo
10
SWITCH MATRIX
tPHZ
tPZH
tPLZ
tPZL
a rnA)
12
ALL DIODES ARE. ECG 519 OR EQUIVALENT
C1 = 30 pF INCLUDING PROBE AND JIG CAPACITANCE.
Figure 7. Typical Propagation Delay
vs. Input Forward Current
Figure 8. Test Circuli for tpHZ. IpZH. IpLZ. and tPZL
9c117
HCPL·5400
60
!
I
...~
w
c
50
CL -15
---- .,
40
:/
Q
~if:
.
30
-65
NODE
pF-
TI'I/Z
Tp%.H
TpLZ
60V'r------"====,
VCM
-26
35
65
95
OV
VOH
----
10
o
'-I,IiI--I--....~ MONITORING
.>-
-.?
20
!!l
'zw"
OUTPUTVO
A
vee! 6 V
z
li
Vee" 5.0 V
SWITCH AT A: IF '= 0 rnA
---.l'\vo
MAX."
.....-sw=,T~e~H~A::T-:.~':-,,-.~·8~m~A~-----
VOL
-TOTAL LEAD LENGTH
125
~...
<
10 mm FROM DeVICE UNDER TEST.
"SEE NOTE 5.
t Cl IS APPROXIMATELY 15 pF, WHICH INCLUDES PROBE AND
STRAY WIRING CAPACITANCE.
TA - TEMPERATURE _ °C
Figure 9. Typical Enable Propagailon Delay
vs. Ambient Temperature
Figure 10. Test Diagram lor Comlllon Mode Transient
Immunity and Typl,cal Wavelorms
Applications
Vee, • +5 V - -.....-...,
r----:=::;3!5l~-___<..--...:.VCC2 = 5V
OATA
IN
DATA
A
OUT
GND 1
Figure 11. Recommended HCPL-5400 Interlace Circuit
--+-'-'.-'
L---~::~~~~_+-~__ :ND2
Figure 12. Alternative HCPL-5400 Interlace Circuit
9-118
Data Rate, and Pulse-Width Distortion Definitions
Propagation delay is a figure of merit which describes the
finite amount of time required for a system io translate
information from input to output when shifting logic levels.
Propagation delay from low to high (tpLH) specifies the
amount of time required for a system's output to change
from a Logic a to a Logic 1, when given a stimulus at the
input. Propagation delay from high to low (tpHd specifies
the amount of time required for a system's output to
change from a Logic 1 to a Logic 0, when given a stimulus
at the input (see Figure 5).
and determines the maximum data rate capability of a
distortion-limited system. Maximum pulse width distortion
on the order of 25-35% is typically used when specifying
the maximum data rate capabilities of systems. The exact
figure depends on the particular application (RS-232, PCM,
T-1, etc.).
The HCPL-5400 optocoupler offers the advantages of
specified propagation delay (tpLH, tpHd, and pulse-width
distortion (ItpLH-tpHL I) over temperature, and power supply
voltage ranges.
When tpLH and tpHL differ in value, pulse width distortion
results. Pulse width distortion is defined as ItpHL-tpLH I
MIL-STD-883 CLASS 8 TEST PROGRAM
Hewlett-Packard's HCPL-5401 optocoupler is in compliance
with MIL-STD-883, Revision C. Testing consists of 100%
screening to Method 5004 and quality conformance inspection to Method 5005. Details of these test programs may be
found in Hewlett-Packard's Optoelectronics Designer's
Catalog.
Vee =f5.5 V
1
...!.!:....
~II2.IV
loon
8
2
7
3
6
4
5
~
~~c:
loon
See table below for specific electrical tests.
Commercial Product
HCPL-5400
I
I
Class 8 Product
I
HCPL-5401
J
Figure 13. Operating Circuit for Burn-In and
Steady State Life Tests
Subgroup 1
'Static tests at TA '" 25°C - VOL, VOH, IOHH' VSH, VEL, 'SH, 'El, fCCl' ICCH' 'eez, 10Zl, 10ZH' VF, VR, Ir-o
Subgroup 2
'Static tests at TA = +125D C - VOL, VOH' fOHH' VSH' VEL, ISH, IEL' 'CCl' 'eeH, leez, 10Zl, 10ZH' VF, VR
Subgroup 3
'Static tests at TA '" -55·C - VOL, VOH, 'OHH, VSH' VEl. ISH, 'El, IceL' 'eCH, leez, IOZl, IOZH' VF, VR
Subgroup 9
'Switching tests at TA" 25°C - tpHL. tplH, ItpHL-tpLHI. ICMHI. ICML/
Subgroup 10
'Switching tests at TA '" +125Q C - tpHL. tpLH, ItpHl-tplHI
Subgroup 11
'Switching tests at TA '" -55·C - tpHL. tpLH. ItpHL-tPLH I
'Limits and conditions per Electrical Characteristics.
9-119
,bO.01.F
CONDITIONS:
IF '" 10 rnA, Icc = 25 rnA,
10 '" 25 rnA, TA .. +125°C
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Subgroup 4. 5, 6, 7, 8A and 88
These subgroups are not applicable to this device type.
111
'::'
":"
PART NUM8ERING SYSTEM
+
Flipta
DUAL CHANNEL,
HIGH SPEED,
HERMETICALLY SEALED
OPTOCOUPLER
HEWLETT
~e.tI PACKARO
HCPL-S430
HCPL·S431
(8838)
r~~--j OUTLINE DRAWING
SCHEMATIC
I 1..
8 765I :~:~F::E
r----~---,-ovcc
-
9.90 (0.3901
HP VVW
7
)--+--oVo,
!.
x
lETTE AI
U.S.A.
1o,
PIN
ONe
...
TYPE
XXXXXXXXX
n
0.13 (O.a20)
NuMBER
MUAX.
:::t;;::~JD)
vo,
ANOPE I
0.51
II- t
(0.0<0) --I
MAX.
~
I
- I
I
r--'
,~svoe
CATHODE I 2
\.
7 VOl
CATHOPE 23
yo!'.£J
~
ANODE 2 4
v.,
5 GNP
(0.90)
2.ao (0.1101
DIMENSIONS IN MILLIMETI;RS AND (INCHES)
Features
Applications
• NEW-MANUFACTURED AND TESTED ON A
MIL·STD·1772 CERTIFIED LINE
• MILITARY/HIGH RELIABILITY SYSTEMS
• HERMETICALLY SEALED 8 PIN DUAL IN·LlNE
PACKAGE
• COMPUTER-PERIPHERAL INTERFACES
• ISOLATION OF HIGH SPEED LOGIC SYSTEMS
• ISOLATED BUS DRIVER (NETWORKING
APPLICATIONS)
• PERFORMANCE GUARANTEED OVER -55°C TO
+125°C AMBIENT TEMPERATURE RANGE
• SWITCHING POWER SUPPLIES
• MIL·STD·883 CLASS B TESTING
• GROUND LOOP ELIMINATION
• HIGH SPEED GUARANTEED OVER
TEMPERATURE
• HIGH SPEED DISK DRIVE I/O
• DIGITAL ISOLATION FOR AID, D/A
CONVERSION
• 75 ns MAXIMUM PROPAGATION DELAY
• 35 ns MAXIMUM PULSE WIDTH DISTORTION
• PULSE TRANSFORMER REPLACEMENT
• HIGH COMMON MODE REJECTION 500V/~s GUARANTEED
speed photon detector. This combination results in very
high data rate capability. The detector has a threshold with
hysteresis. The hysteresis provides typically 0.25 mA of
differential mode noise immunity and minimizes the potential for output signal chatter.
• COMPATIBLE WITH TTL, STTL, LSTTL, AND
HCMOS LOGIC FAMILIES
• HIGH POWER SUPPLY NOISE IMMUNITY
• 500Vdc WITHSTAND TEST VOLTAGE
Description
The HCPL-5430 and HCPL-5431 units are dual channel
hermetically sealed, high speed optocouplers. The products
are capable of operation and storage over the full military
temperature range and can be purchased as either a
standard product (HCPL-5430) or with full MIL-STD-883
Class Level B testing (HCPL-5431). Both products are in
eight pin hermetic dual in-line packages.
Each unit contains two channels, consisting of an AIGaAs
light emitting diode optically coupled to an integrated high
The HCPL-5430 and HCPL-5431 are compatible with TTL,
STTL, LSTTL, and HCMOS,logic families. The 35 ns pulse
width distortion specification guarantees a 10 mBaud signaling rate at 125°C with 35% pulse width distortion. Figure 9
shows a recommended circuit for reducing pulse width
distortion and improving the signaling rate of the product.
CAUTION: The small junction sizes inherent to the design
of this bipolar component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is
advised that normal static precautions be taken in handling
and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
9-120
Absolute Maximum Ratings
Recommended operating
Conditions
Max.
Units
Volts
Storage Temperature ...••.•......••.••. -65°C to +150°C
Operating Temperature ...............•. -55°C to +125°C
Lead Solder Temperature ..•••.••......... 260°C for 10 s
(1.6mm below seating plane)
Average Forward Current-IFAVG ............••... 10 mA
Peak Input Current-IFPK ..•..••............•. 20 mAltl
Reverse Input Voltage-VR •••.•......•.............. 5 V
Supply Voltage - Vee ...........•....• 0 V min., 7.0 V max.
Average Output Current -10 .... -25 mA min., 25 mA max.
Output Voltage - Vo ..•.•.••.••.••. -0.5 V min., 10 V max.
Output Power Dissipation - Po (per channel) .•••. 130 mW
Total Package Power Dissipation Pd ••.•......... .400 mW
Electrical Characteristics
TA = -55°C to 125°C, 4.75 V S; Vee S; 5.25 V, 8 mA S; IF(ON) S; 10 mA, 0 V S; VF(OFF) S; 0.7 V, unless otherwise specified.
Parameter
Symbol
Logic Low Output Voltage
VOL
Logic High Output Voltage
VOH
Output Leakage Current
10HH
Logic Low Supply Current
lecL
Logic High Supply Current
ICCH
Input Forward Voltage
Input Reverse Breakdown
Voltage
Typ.'
Max.
Units
Test Conditions
Figure
Note
0.5
Volts
10L:; 8.0 mA (5 TTL Loads)
1
9
Volts
IOH = -4.0mA
2
9
2.4
100
38
I
52 .....
pA
1 mA
Vo = 5.25\1, VF=0.7V
9
Vee = 5.25 V
34
52
mA
VF
1.0
1.4
1.85
Volts
IF= 10mA
' VR
5.0
7.0
Volts
IR
VE=OV
4
= 10/iA
9
9
1
/i A
45% RH, t = 5s,
V,.o '" 500 Vdc, TA '" 25°C
33
75
ns
IF(ON)"'9mA
5,6,7
4,9
tpLH
30
65
ns
IFrON) = 9mA
5,6,7
4,9
ItpHL-tPLH I
3
35
ns
IF (ON):; 9mA
5,6
9
Input-Output Insulation
Leakage Current
1,-0
Propagation Delay Time to
Logic Low Output Level
tpHL
Propagation Delay Time to
Logic High Output Level
Pulse Width Distortion
Min.
2,3
Logic High Common Mode
Transient Immunity
ICMHI
500
3000
VI/is
TA:; 25°C, IF =0
8
5,9
Logic Low Common Mode
Transient Immunity
ICMLi
500
3000
Vlp.s
TA =25°C, if:; SmA
8
5,9
'AIi typical values are at Vee = 5 V, TA = 25'C, IF = 9 mA except where noted.
9-121
Typical Characteristics All typicals Vee" 5 V, TA" 25°0, IF" 9 mA except where noted.
Symbol
lYp.
Units
Test Conditions
I nput Current Hysteresis
IHY$
0.25
Vee" 5V
3
Input DJode Temperature Coefficient
AVF
-ATA
-1.11
mA
mVloO
IF=10mA
4
10 '2
ohms
VI-a" 500 vao
2
0.6
pF
f" 1 MHz, VI_O '" OVdc
2
15
pF
hrl
f'" 1 MHz, Vo'" OV,
Pins 1 and 2, Pins 3 and 4
pF
f " 1 MHz, VF " 0 V
Parameter
I
Figure
I nput-Output Resistance
RI_O
Input-Output Capacitance
CI-O
I nput Capacitance
CIN
Input-Input Capacitance
01_1
Input-I nput Leakage Current
II-I
0.5~A
V,_, " 500 VDC, 45% RH
Input-Input Resistance
RI_I
1012
VH"SOOVDC
I
ms
a
8
8
6,9
'F '" 10mA
Logic Low Short Circuit Outpul Current
IOSL
65
rnA
Vo " Vee =5.2SV,
Logic High ShOrt Circuit Output Current
laSH
-SO
mA
Vee'" 5.25 V. IF" 0 mA, Vo =GND
Output Rise Time (10-90%)
tr
15
ns
Output Fall Time (90-10%)
If
PSNI
10
0.5
ns
Vp_p
Power Suppl~ Noise Immunity
Note
6,9
5
5
48Hz::; fAeS SOMHz
7
Notes:
1. Not to exceed 5% duty factor, not to exceed 50/Lsec pulse width.
2. Device considered a two terminal device: pins 1~4 shorted together. and pins 5-8 shorted together.
3. This is momentary withstand test. not an operating condition.
4. tpHL propagation delay is measured from the 50% level on the rising edge of the input current pulse to the 1.5 V level on the falling
edge of the output pulse. The tpLH propagation delay is measured from the 50% level on the falling edge of the input current pulse
to the 1.5 V level on the rising edge of the output pulse.
5. CMH is the maximum slew rate of common mode voltage that can be sustained with the output voltage in the logic high state
(Vo (MIN) > 2.0 V). CML is the maximum slew rate of common mode voltage that can be sustained with the output voltage in the logic
low state (Va (MAX) < 0.8 V).
6. Duration of output short circuit time not to exceed 10 ms.
7. Power Supply Noise Immunity is the peak to peak amplitude of the ac ripple voltage on the Vee line that the device will withstand
and still remain in the desired logic state. For desired logic high state. VOH(MIN) > 2.0V, and for desired logic low state, VOL(MAX) <
0.8 volts.
8. Measured between pins 1, 2 shorted together and pins 3, 4 shorted together.
9. Each channel.
>
>
I
w
I
w
'"~
'"~
::"
o"
~
§;
....
§;
....
4.5
,
4. o~
3. 5
':;
o
~
:J:
'"
:;:
u
3. 0
u
a
§
9
I
2. 5
I
z
o
oJ
>
.0
I
I
- - trTA
=
125·C
I
I
T,,=25"C
. 1(_ j . =~55·C~
L
- ..... 1'?'+-l.L
t-,i7' t-. 'f"'-o. t-. I-.
f..;:: r-...
-1--,-
"'"
m
-2
-4
-6
-8
-10
IOH - LOGIC HIGH OUTPUT CURRENT - rnA
IOL - LOGIC LOW OUTPUT CURRENT - rnA
Figure 2. Typical Logic High Output Voltage
vs. Logic High Output Current
Figure 1. Typical Logic Low Output Voltage
vs. Logic Low Output Current
9-122
1000.---,---r---r--..,----,
~
....
>
I
fOH'" -4 rnA
w
~
15a:
~
....
a:
100
I
a:
g
=>
"c
~
=>
o
~
I
I
~
1.5
IF-INPUT CURRENT - rnA
VF -
Figure 3. Typical Output Voltage vs. Input Forward Current
FORWARD VOLTAGE - VOLTS
Figure 4. Typical Diode Input Forward Current Characteristic
PULSE
GENERATOR
tr lltf=5flS
1"'500 KHt
25% DUTY
CYCLg
',!
INPUT
MON ITOR ING
NODE
Vo
5.0 V
OUTPUT
MONITORING
NODE
L -_ _ _ r.11
1.3 Kn
o--,-t--llI1--'
100
.~mA
I,
Vee
Ot
Cl
15 pF
~c
"
THE PROBE AND JIG CAPACITANCES ARE REPRESENTED BY
0
--:1-----
AtL DIODES ARE ECG 519 OR EQUIVALENT,
INPUT
I,
~ ________
tPLH
t!l
I (ON)
5 0% I: (ON)
--
25
I
~
tPHL
9
-----
50
~
it0
if
C, AND C2.
6V
30 pF
75
>
-=-
;t
~
o r--
1.5 V
OUTPUT
Vo
-55
-25
35
"5-...........
........... ~
-
PWD
Figure 5. Test Circuit for tpLH, tpHL, t r , and tf
95
65
TA - TEMPERATURE _
125
°c
Figure 6. Typical Propagation Delay vs. Ambient Temperature
Vee'" 5.0V
HCPL-5430
OUTPUT Vo
B
A
IU!J--f!l--+--'--+--o MONITORING
1
0
TA .... 25-¢C
NODE
'="VFF
0
0
k
- - tPt.H
----- ----
50V~------------------~
VCM
av
VOH ________~SW~IT~C~H~A~T~A~:~I~f=~O~m~A~__.
1\- VoMAX.**
20
VOL----I
10
11
12
IF - INPUT FORWARD CURRENT -rnA
VOMIN ...
Y
\~~~~~~~~~-------
SWITCH AT B: IF - 8 rnA
*TOTAL LEAD LENGTH < 10 mm FROM DEVICE UNDER TEST.
**SEE NOTE 5.
tCI. IS APPROXIMATELY 15 pF. WHICH INCLUDES PROBE AND
STRAY WIRING CAPACITANCE.
Figure 7. Typical Propagation Delay vs. Input Forward Current
Figure 8. Test Diagram for Common Mode Transient
Immunity and Typical Waveforms
9-123
Applications
Vee1'''' 5 V
100 pF
---o__------,
r-r--..,....--VCC2= +5 V
DATA
INA - - - , .
DATA
OUT Y
TOTEM POLE
OUTPUT GATE
(e.g. 54AS1000)
~A~A
_ _ _ _ _ _ _~__~
GND1---------~-~
L-~---1--GND2
Figure 9. Recommended HCPL-5430 Inter/ace Circuit
Vee, = + 5 V - - - - - - - - ,
+---~---'lN'v--..,
,............- -....--VCC2= +5 V
DATA
OUT Y
STTL
OPEN COLLECTOR
OUTPUT GATE
(e.g. 54505)
L-~--~~---GND2
Figure 10. Alternative HCPL-5430 Interlace Circuit
Data Rate and pulse-width
Distortion Definitions
Propagation delay is a figure of merit which describes the
finite amount of time required for a system to translate
information from input to output when shifting logiC levels.
Propagation delay from low to high (tpLH) specifies the
amount of time required for a system's output to change
from a Logic 0 to a Logic 1, when given a stimulus at the
input. Propagation delay from high to low (tpHLl specifies
the amount of time required for a system's output to
change from a Logic 1 to a Logic 0, when given a stimulus
at the input (see Figure 5).
When tpLH and tpHL differ in value, pulse width distortion
results. Pulse width distortion is defined as ItpHL-tpLH I
and determines the maximum data rate capability of a
distortion-limited system. Maximum pulse width distortion
on the order of 25-35% is typically used when specifying
the maximum data rate capabilities of systems. The exact
figure depends on the particular application (RS-232, PCM,
T-1, etc.).
The HCPL-5430 optocoupler offers the advantages of
specified propagation delay (tpLH, tpHL), and pulse-width
distortion (ItpLH-tpHL Il over temperature and power supply
voltage ranges.
9-124
MIL-STO-883 CLASS B TEST PROGRAM
PART NUMBERING SYSTEM
Hewlett-Packard's HCPL-S431 optocoupler is in compliance
with MIL-STD-883, Revision C. Testing consists of 100%
screening to Method 5004 and quality conformance inspection to Method 5005. Details of these test programs may
be found in Hewlett-Packard's Optoelectronics Designer's
Catalog.
I
I
J
CommercillNproduct
I
Class B Product
I
HCPL-S4~0
J
HCPL-5431
Vee" 5.25 V
--.!o:.....
See table below for specific electrical tests.
2.1
100 n TYP.
v
.--t,JIII - 1
100 n TYP.
V,N
--r,;-
1
8
2
1
3
4
-=
4---
Y
Icc
:::!:: 0.01 pF
_10
'rt
5
100
100
n
n
~-
=
Vac= 3.0 V
10 rnA. Icc = 48 rnA.
10" 25 rnA. TA" +125°C
CONDITIONS: IF
-=
Figure 11. Operallng Circuit lor Burn-In and
Steady State Llle Tests
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Subgroup 1
'Static tests at TA = 2S"C - VOL, VoH,loHH,leCL, leCH' VF, VR, 1,-0
Subgroup 2
'Statlo tests at Til
=+12S"C -- VOL> VOH, 10HH' ICOl' lecH. Vr; Vp,
Subgroup 3
'Static tests at Til .. -55~C -- VOL, VOH, IOHH'
ICCL' ICCH' Vp, VA
Subgroup 4. 5, 6. 7, 8A and 88
These subgroups are not applicable to this device type.
Subgroup 9
'Switchlng tests at Til
=25c C -
Subgroup 10
'Switching tests at TA
= +125·C -- tpHl, tpLH, ItpHL-tpLHI
tpHL, Ipl.H, ItpHL-tpLHI, ICMHI, ICMLI
Subgroup 11
'Switching tests at TA" --5So C -- tpHL> tpLH, ItpHL-tpLH I
'Limits and conditions per Electrical Characteristics.
9-125
. _ - - - - - - - - - - - - - _..
__ __ _ - - - - _ __
..
..
..
.-
Flin-
HEWLETT
~~ PACKARO
LOW INPUT CURRENT,
HIGH GAIN, HERMETICALLY
SEALED OPTOCOUPLER
Schematic
~~-:;1
r;:8
7
6
5
9.90 10.3901
3
2
ANODE +
lice
HCPL-5700
HCPl-5701
(8838)
Outline Orawlng
7.37 (0.290)
7.87~J
DATE CODE
•
!
Icc
"
v,
'l
PIN ...,...
;;....""--.:::r-.",,..
ONE'"
CATHODE -
3.81 (0.150)
3
r;=;c::::::;;::::;::;:::::r;]--t--t
MAX.
NClfgJ8VCC
PIN
ONE
ANODE 2
~
CATHODE 3
NC 4
Features
5 GNP
DIMENSIONS IN MllLlMET!;RS AND (INCHES)
• NEW-MANUFACTURED AND TESTED ON A MILSTD-1772 CERTIFIED LINE
Applications
•
• MILITARY/HIGH RELIABILITY SYSTEMS
HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
• TELEPHONE RING DETECTION
• PERFORMANCE GUARANTEED OVER -SsoC TO
+12SoC AME\IENT TEMPERATURE RANGE
•
7 NC
6 Vo
•
MICROPROCESSOR SYSTEM INTERFACE
• EIA RS-232-C LINE RECEIVER
MIL-STD-883 CLASS B TESTING
• LEVEL SHIFTING
• 6N138, 6N139 AND 6N140A OPERATING
COMPATIBILITY
•
DIGITAL LOGIC GROUND ISOLATION
•
LOW INPUT CURRENT REQUIREMENT - O.S rnA
•
CURRENT LOOP RECEIVER
•
HIGH CURRENT TRANSFER RATIO 1S00% TYPICAL
• ISOLATED INPUT LINE RECEIVER
•
LOW OUTPUT SATURATION VOLTAGE0.11 V TYPICAL
• PROCESS CONTROL INPUT/OUTPUT ISOLATION
•
SOO Vdc WITHSTAND TEST VOLTAGE
•
HIGH COMMON MODE REJECTION
higher signaling speed than possible with conventional
photo-darlington optocouplers.
• SYSTEM TEST EQUIPMENT ISOLATION
The supply voltage can be operated as low as 2.0 V without adversely affecting the parametric performance.
• LOW POWER CONSUMPTION
• HIGH RADIATION IMMUNITY
The HCPL-5700 and 5701 units are hermetically sealed.
low input current. high gain optocouplers. The products
are capable of operation and storage over the full military
temperature range and can be purchased as either a
standard product (HCPL-570Q) or with full MIL-STD-883
Class Level B testing (HCPL-570n Both products are in
eight pin hermetic dual in-line packages.
The HCPL-5700 and HCPL"5701 have a 200% minimum
CTR at an input current of only 0.5 mA making them ideal
for use in low input current applications such as MOS.
CMOS. low power logic interfaces or line receivers. Compatibility with high voltage CMOS logiC systems is assured
by the 18 V Vee. VOH current and the guaranteed maximum output leakage current at 18 V. The shallow depth
and small junctions offered by the IC process provides
better radiation immunity than conventional phototransistor
optocou piers.
Each unit contains an AIGaAs light emitting diode which is
optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector
output providing both lower output saturation voltage and
Upon speCial request. the following device selections can
be made: CTR minimum of 300% to 600% at 0.5 mAo lower
drive currents to 0.1 mAo and lower output leakage current
levels to 100 /LA.
Description
9-126
Recommended operating
Conditions
Parimeter
Input Voltage, Low
Level
Average Input Current
'M?"t\t.;3
'High Level
Sugply V~SJe
Symbol
Current Transfer Ratio
EJI1lts
Min, Max.
VFL
V
0.1
..
VIP
IFH
"1°·5
5
rilHiJ
&:
2.0
18
Electrical Characteristics
Parameter
Absolute Maximum Ratings
Storage Temperature •••••.•.•••.•••..••.. -65·C to +150·C
Operating Temperature ..•..•••••••.•. ,... -55·C to +125·C
Lead Solder Temperature .•..••••.•..•....•• 260·C for 10 sec.
11.6 mm below the seating planel
Output Current 10 ....••..•••...••.•••••••.••••.•.••• 40 rnA
Output Voltage Vo .•••••••..••...•..••••.••• -0.5 V to 20 Vl 11
Supply Voltage Vee •.•••••••..••.•••..•...•.•• -0.5 to 20 WI
Output Power Dissipation .•••...•.••....••••.•••.• 50 mWl 21
Peak Input Current ....••••••.••••••••.•••.••••.•••••. 8 rnA
Reverse Input Voltage, VR .••••••••.•••••.•••..••....••.. 5 V
V
-wc to 125·C, unless otherwise specified
TA =
Symbol
Min.
Typ.-
CTR
200
200
200
1500
1000
500
Max.
Ufill$
T
Fig,
%
V
V
V
IF- 0.5 rnA, 10 1.0 rnA, Vee- 4.5 V
IF = 1.6 rnA, 10 = 3.2 rnA, Vee'" 4.5 V
IF = 5.0 rnA, 10 = 10 rnA, Vee = 4.5 V
0.4
0.4
0.4
Logic High Output Current
10H
0.001
250
I'A
Logic Low Supply Current
leeL
1.0
2.0
rnA
IF '" 1.6 mA, Vee
Logic High Supply Current
leeH
0.001
7.5
,..A
1Ft =0, Vee-1S V
1.3
1.6
V
IF -1.6 rnA, TA -25·C
V
IR=1O"A
VF
1.0
Input Reverse Breakdown
Voltage
BVfI
5
Input-Output Insulation
Leakage Current
h-o
Propagation Delay
Time to LogiC High
At Output
Propagation Delay
Time to Logic Low
AtOutpul
tpLH
tpHL
3
=
0.11
0.13
0.16
Inpul Forward Voltage
3
=
VOL
L~9iC Low Output Voltage
Nole
=
IF '" 0.5 rnA, Vo 0.4 , Vee=4.5V
IF = 1.6 mA, Vo 0.4 V, Vee'" 4.5 V
IF=5 rnA, Vo =0.4 V, Vee =4.5 V
%
%
1.0
I'A
2
VF =0.7 V, Va =Veej'ffi 18 V
=HIlI!
4
1
45% Relative Humidity, TA = 25' C
t = 5 sec, VI-O = 500 Vdc
4,5
17
185
f.lS
IF =0.5 rnA, RL- 4.7 kil, Vee = 5 V
14
115
/lS
IF= 1.6 rnA, RL = 2.2 kll, Vee=5 V
7,8
8
60
/ls
IF = 5.0 rnA, RL =680 fl, Vee'" 5 V
7,8
10
185
f.lS
IF =0.5 rnA, RL-4.7 ktl, Vee = 5 V
7$
5
$0
ItS
IF= 1.6 mA, RL ~2.2 kll. Vee=5 V
7,8
2
12
IF = 5.0 mA, RL =680 ll. Vcc '" 5 V
7Jl
9,10
6,8
9,10
7,8
,..S
7,8
Common Mode Transient
Immunity At Logic High
Level Output
ICMHI
500
2:2000
Vlp.s
IF = 0, RL'" 2.2 kll
IVeMI = 50 Vp-p, Vee'" 5.0 V, TA = 25·C
Common Mode Transient
Immunity At Logic Low
Level Output
ICMLI
500
2:1000
VI/ls
IF'" 1.6 rnA, RL = 2.2 kll
IVCMI '" 50V p_p, Vee =5.0 V. TA = 25·C
'All typi.cal values are at Vee'" 5 V, TA '" 25·C.
Typical Characteristics TA = 25°C, Vee = 5 V
Parameter
Typ.
Units
RI-o
1012
II
VI-O = 500 Vdc
9
Capacitance Hnput-Output)
Ci-o
2.0
pF
f - l MHz:
9
Temperature Coefficient
of Forward Voltage
ATA
~
-1.5
mVi
·C
Input Capacitance
CIN
15
pF
NOTES:
1. GND Pin should be the most negative voltage at the detector side. Keeping Vee
as low as possible. but greater than 2.0 V, will provide lowest total IOH over
temperature.
2. Output power is collector output power plus one half of total supply power.
3. CURRENT TRANSFER RATIO is defined 85 the ratio of output collector current,
10 , to the forward LED input current, IF' times 1000Al.
4. D.evice considered a two-~ermlnal device. Pins 1 through 4 are shorted together
and pins 5 through 8 are shorted together.
5. This is a momentary withstand test, not an operating condition.
6. CM H is the maximum tolerable common mode transient such that the output will
• remain in a high logic state U.e. Va > 2.0 V)'
Test Conditions
Nole
Symbol
Resistance (Input-Output)
Fig.
IF=1.6mA
f= 1 MHz, VF =0
7. CM L is the maximum tolerable common mode transient such that the output will'
remain in a low logic state (Le. Va < 0.8 VI.
8. In applications where dVldt may exceed 50,000 VlIlS (such as a static discharge) a
series resistor, Ace. is recommended to protect the detector Ie from destruc·
tively high surge currents. The recommended maximum value is
Ace'" 0.15 :;(mAI kO.
9. Measured between the LED anode and cathode shorted together and pins 5
through 8 shorted together.
9-127
._..._--_...
__ .._._._------------------_
.. _..
5.0
1
1.0
ffi
a" O.11;r-+--+-+.f--!---+--I
~
~
~
0,01 lE--t--,if--+-+--!---I
Vo -QUTPUTVOLTAGE (V)
VF - FORWARD VOLTAGE (V)
Figure 1. 'Inpul Current vs. Forward
Voltage.
50
54
g
"
""u
u
~
>
7
.3
G
>
g
~
..
~
0
iilN
"""
z
0
";1;
~
~
1.;. .. 25-~C
I
0
"";1;
vcc ... taV
0
if,
...
~
II
I
0,01
0.1
1.0
10
§
100
0.1
0.1
Figure 4. Normalized Supply Current
vs. Input Forward Current.
25
.l!tU...
At.
20
>
15
z
0
~
~if
10
I
"'t;son
RI. .. 2.2 kO
AI.. "'4.1kn
'\
.,...,.
vcc"""ov
TA "'2t'¢
PIJL.S~WIOTH""$Op$
".. k '4.7~!l
"\. ""'-"
Itt. '*'680n
-.......:: .....:::::-.
~
0
20
40
60
80 100 120 140
TA - TEMPERATURE (OC)
Figure 6. Propagation Delay vs.
Temperature.
.------
"
0--- --.J
~I)C$E
VO---JE-V
I
GEN.
Zo""5()ft
l r,t;
'" (:: Ii$
f= tOOt-b'
li'lILSt! ... 50jJ!
1.5V
--,
tpHL
\
-20
100
Figure 5. Propagation Delay to Logic
Low vs. Input Pulse Period.
RL'2.2~n=
IT
10.0
1.0
T -INPUT PULSE PERIOD (ms)
IF - INPUT FORWARD CURRENT (rnA)
"
35
z
~
Z
0
NORMAt.lZEP- TO:
lee AT t~ .. 'M, rnA
4'
0
0
::;
~
0
Figure 3. Normalized Current Transfer
Ratl.o vs. Input Forward
Current.
-;:
..ill
.;;
IF -INPUT FORWARD CURRENT (rnA)
Figure 2. Normalized DC Transfer
Characteristics.
',---
-
-
-VOL
-
¥!---.
. 5V_=:vo
o
00
+5V
Vo
IF MONITOR
1.5V
---
IF -INPUT FORWARD CURRENT (rnA)
VOL
t pLH -
Figure 7. Propagation Delay vs. Input
Forward Current.
Figure 8. Switching Test Circuit
7
'"
10K
~
~
.
Vo .
+5V
"
lK
ill
~
~
w
0
0
"z
""u
,
Vo ----,,____""-------- 5V
0
SWITCH AT A: IF. OmA
Va ----------~VOl
SWITCH AT B: IF = 1.6 rnA
E
100
~
E
10 ~
0
VeM
+
Jl.}---~---,
PULSE GEN.
Figure 9. Test Circuit for Transient Immunity and Typical Waveforms
'See Note 8
9-128
1i"
'0
\:r
l--CMlI
\
I
\.
VCC"'5V
IFH'~UmA
At. ·2.2kll
T. . 'S'C
J
200
j
400
600
800
1000
1200
VCM - COMMON MODE TRANSIENT AMPLITUDE (V)
Figure 10. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude
MIL-STD-883 CLASS B TEST PROGRAM
PART NUMBERING SYSTEM
Hewlett-Packard's HCPL-S701 optocoupler is in compliance with MIL-STD-883, Revision C. Testing consists of
100% screening to Method S004 and quality conformance
inspection to Method SOOS. Details of these test programs
may be found in Hewlett-Packard's Optoelectronics Designer's Catalog.
I
Commercial Product
I
Class B Product
I
I
J
HCPL-S700
HCPL-5701
I
r
Vee +18 V
See table below for specific electrical tests.
~IIV,N
1.71 V
1
a
2
7
)
:-1
100 n TYP.
":"
CONDITIONS: IF .. 6 rnA
ID -10 rnA
4
Voe + 1.4
To.o1 "F
100 !lTYP.
TA • +126'C
Figure 11. Operating Circuli for Burn-In and SIeady SIale Life
Tesls
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Subgroup 1
'Static tests at TA = 2SoC -IOH, VOL, tCCL. ICCH, CTR, VF, BVR and ' 1-0
Subgroup 2
'Statlc tests at TA '" +125°C -IOH, VOL, leCL,lcCH, BVA and CTR
Symbol
I
VF
I
Min.
I
Max.
I
1.8
Subgroup 3
'Static tests at TA = -55° C Symbol
I
VF
I
Min.
I
j
Units
V
I
I
Test Conditions
IF =1.6mA
10H, VOL, lecl, teCH, BVA and CTR
I
I
Max,
1.8
J
I
Units
V
I
Test Conditions
I 'F = 1.6 mA
Subgroup 4, 5, 6, 7, 8A and 88
These su bgroups are not applicable to this device type.
Subgroup 9
'Switchlng tests at TA = 25° C - tpLH1, tpHL I, IpLHZ, tpHL2' tpLH3, IpHL3, CMH and CML
Subgroup 10
'Switching tests at TA = +125°C -tpLH" tpHL1, tpLH2, tpHL2, tpLH3, tpHL3
Subgroup 11
'Switching tests at TA '" -55°C - tpLH1> tpHl1' tpLH2' tpHL2, tpLHS, tpHL3
'limits and conditions per Table II.
9-129
v
FliP'l
a!a
HEWLETT
PACKARD
DUAL CHANNEL
LOW INPUT CURRENT,
HIGH GAIN, HERMETICALLY
SEALED OPTOCOUPLER
r;
Schematic
8
r---~~----------~~c
PIN . .
QNE
~.40 10.3701-:;]
•.00 (0.300)
7
HP
•
5
Outline Drawing
n
DATE COOE
YYW~ I-t~~~~\X
U.S.A.
HCPl-S730
HCPL-S731
(8838)
U~ :~:~~~-
"FT'==::::>--
MUII
1_ TYPE
8.13 {0.320}
AX •
NVM9EfI
IHCI'L·51301
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OIMEN$loNS IN MllUMETERS AND f!NCI"U:iS)
Features
Applications
• NEW - MANUFACTURED AND TESTED ON A MILSTD-1772 CERTIFIED LINE
•
• HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
•
MICROPROCESSOR SYSTEM INTERFACE
•
EIA RS-232-C LINE RECEIVER
MILITARY/HIGH RELIABILITY SYSTEMS
• TELEPHONE RING DETECTION
• PERFORMANCE GUARANTEED OVER -SsoC TO
+12SoC AMBIENT TEMPERATURE RANGE
•
LEVEL SHIFTING
•
DIGITAL LOGIC GROUND ISOLATION
• HCPL-2730/2731 AND 6N140A OPERATING
COMPATIBILITY
•
CURRENT LOOP RECEIVER
• LOW INPUT CURRENT REQUIREMENT - O.S mA
•
ISOLATED INPUT LINE RECEIVER
• HIGH CURRENT TRANSFER RATIO 1S00% TYPICAL
• SYSTEM TEST EQUIPMENT ISOLATION
• MIL-STD-883 CLASS B TESTING
• PROCESS CONTROL INPUT/OUTPUT ISOLATION
• LOW OUTPUT SATURATION VOLTAGE 0.11 V TYPICAL
• HIGH COMMON MODE REJECTION
lower output saturation voltage and higher signaling
speed than possible with conventional photo-darlington
optdtouplers,
• LOW POWER CONSUMPTION
• HIGH RADIATION IMMUNITY
The supply voltage can be operated as low as 2.0 V without adversely affecting the parametric performance,
Description
The HCPL-5730 and HCPL-5731 units are dual channel,
hermetically sealed, low input current. high gain optocouplers, The products are capable of operation and
storage over the full military temperature range and can be
purchased as either a standard product IHCPL-5730) or
with full MIL-STD-883 Class Level B testing IHCPL-5731l.
Both products are in eight pin hermetic dual in-line
packages,
The HCPL-5730 and HCPL-5731 have a 200% minimum
CTR at an input current of only 0,5 mA making them ideal
for use in low input current applications such as MOS.
CMOS, low power logic interfaces or line receivers, Compatibility with high voltage CMOS logic systems is assured
by the 18 V Vee, VOH current and the guaranteed maximum output leakage current at 18 V, The shallow depth
and small junctions offered by the IC process provides
better radiation immunity than conventional phototransistor
optocouplers.
Each unit contains two independent channels. consisting
of an AIGaAs light emitting diode optically coupled to an
integrated high gain photon detector. The high gain output stage features an open collector output providing both
Upon special request. the following device selections can
be made: CTR minimum of 300% to 600% at 0,5 mAo lower
drive currents to 0,1 mA, and lower output leakage current
levels to 100 J1.A.
• SOO Vdc WITHSTAND TEST VOLTAGE
9-130
------.~.-------
Recommended operating
Conditions
Absolute Maximum Ratings
Parameter'
iiM'Symbol' Min. Max.
Input Voltage;i.iqw
VFL
0.7
Level (Each Ch.annell
i't'verage Input Current
1i
IFH
5
High Level (Each Channell
2.0
S~pply Voltqge
Yee
18
Electrical Characteristics
'PlIrameter
Current Transfer Ratio
Logic Low Output Voltage
Symbol
CTR
Storage T~mperature ............... ..,.65°C to +150°C
Operating Temperature ............. -55°C to +125°C
Lead Solder Temperature .....•...... 260° C for 10 sec ..
(1.6 mm below the seating plane)
Output Current 10 (Each Channell ............ " 40 mA
Output Voltage Vo (Each Channell ..... -0.5 V to 20 VIII
Supply Voltage Vee .................... -0.5 to 20 VI1I
Output Power Dissipation (Each Channell .... 50 mWl2J
Peak Input Current (Each Channell ..•.•......... 8 mA
Reverse Input Voltage, VR (Each Channell ....•..... 5 V
Units
V
mA
V
TA = -55°C to 125°C, unless otherwise specified
Min.
Typ."
200
1500
0/0
200
1000
%
200
500
VOL
Max.
Units
TesICoii~!ljons
$
%
IF - 0.5 mA, 10 = 1.0 mA, Vee = 4.5 V
IF = 1.6 rnA, 10'" 3.2 mA, Vcc = 4.5 V
IF = 5.0 rnA, 10'" 10 mA. Vcc '" 4.5 V
2
0.11
0.13
0,16
0.4
0,4
0.4
V
V
V
Logic High Output Current
10HX
IOH
0.001
250
Jl.A
VF - 0.7 V 1Channel Under Test)
IF '" 6 rnA (Other Channell
Vo= Vce = 18 V
Logic Low Supply Current
lecl
1.0
4
mA
1Ft'" IF2 '" 1.6 mA
Vee '" 18V
Jl.A
IF1- I FZ=0
Vee = 18 V
Logic High Supply Current
Input Forward Voltage
ICCH
Vf
1.0
Input Reverse Breakdown
Voltage
BVA
5
Input-Output Insulation
Leakage Current
11-0
Propagation Delay
Time to Logic High
At Output
Propagation Delay
Time to Logic Low
At Output
tPHL
ICMHI
Common Mode Transient
Immunity At Logic Low
Leyel Output
ICMd
15
1,3
1.6
1.0
tPLfi
Common Mode Transient
Immunity At logic High
Level Output
0.001
500
500
FIg.
IF'" 0.5 rnA, Vo = 0.4 V, Vec '" 4.5 V
IF= 1.6 rnA. Vo "'0.4 V, Vec =4.5 V
IF =5 rnA. Vo = 0.4 V, Vee =4.5 V
V
'f -1.6 rnA, TA - 25°C
V
IA= IO I'A
Note
$,4
3
3,5
4
3
1
3
pA
45% Relative Humidity, T A '" 25" C
t = 5 sec, VI-O '" 500 Vdc
6,12
17
185
,.5
IF "'0.5 mA, Rl =4.7 kil, Vee'" 5 V
7,8
8
14
115
I's
IF= 1,6 mA, Rl =2,2 kil, Vee'" 5 V
7,8
3
8
60
1'5
IF- 5.0 mA,RL =680 il, Vec =5 V
10
185
JI.S
IF -0.5 mA, Rl =4.7 kil, Vce-5 V
I
5
30
/.lS
IF - i.6 mA, RL - 2.2 kO, Vee - 5 V
1.7,8
3
2
12
I's
IF -5.0 rnA, Rl "'680 0, Vec -5 V
L7,8
3
;::2000
VII'S
;::1000
V/p.s
7,8
3
7,8
3
IF = 0, RL = 2.2 kfl
IVCMI = 50Vp- p, Vee =5.0 V, TA =25·C
9,10
IF = I.S mA, RL'" 2.2 kn
IVeMI = 50 Vp-p' Vee = 5.0 V, TA = 25°C
9,10
3
9,11
3
10,11
"All typical values are at Vee = 5 V, TA = 25°C.
Typical Characteristics
TA = 25°C, Vee = 5 V
Symbol
Typ.
UnUs
Te$t Conditions
Resistance (input-Output)
RI-O
10'2
n
VI-O = 500 Vdc
3, 7
Capacitance (lnput-Outputl
CI-O
2.0
pF
f= 1 MHz
3,7
Parameter
Input-Input Insulation
Leakage Current
ii-I
0,5
nA
45% Relative Humidity, VI-t '" 500 Vdc
Fig.
Note
8
TA '" 25"C, t '" 5s.
Resistance (fnput-lnpull
RI-J
10'2
fl
V,-,- 500 Vdc
8
Capacitance (Input-Input!
C,_I
1.3
pF
f'" 1 MHz
6
Temperature Coefficient
of Forward Voltage
AVF
ATA
-1.5
mVl
·C
IF=l.SrnA
3
Input Capacitance
C'N
15
pF
f = 1 MHz, VF = a
:3
9-131
NOTES:
G~D Pin should be the most negative voltage at the detector side. Keeping Vee
as low' as possible. but greater than 2.0 V, will provide lowest total IOH over
temperature.
2. Output power is collector output power plus one half of total supply power.
3, Each channel
4. CURRENT TRANSFER RATIO Is defined as the ratio of output collector current.
1.
'0' to·the forward LEO input current, IF' times 100%.
5. 'OHX Is the leakage current resulting from channel to channel optical crosstalk.
VF 0.7 V for channel under test.
=
8. Measured between adjacent Input pairs shorted together, I.e. between pins 1 and
2 shorted together and pins 3 and 4 shorted together.
9. CM H Is the maximum tolerable common mode transient such that the output will
.
remain In a high logic state (j.e. Vo > 2.0 V)'
10.CM L is the maximum tolerable common mode transient such that the output will
remain In a low logic state (/.e. Vo < 0.8 Vl.
,
11. In applications where dV/dt may exceed 50,000 V/IJS (such 8S a static dlsc~argel a
series resistor, Ace, is recommended to protect the detector IC's from destructively high surge currents. The recommended maximum value is
6. Device considered a two-terminal "device: Pins 1 through 4 arB shorted together
and pins 5 through 8 are shorted together.
7. Measured between the LED anode and cathode shorted together and pins 5
thro'ugh 8 shorted together.
10.0
6.0
1
1.0
~
II:
B
~
~
O.
1
0.0 1
~
I.J
//
r ~:J
~
~
/
/
0.00 1
1.050 1.100
/
/
~4 -2\VC
2.0f-==....,.....--~':~~o~'tv
1----+--- i!'! ~bF "O.5,"A
l-....,rl'R~
~
/
~
1.0 f--"lH'-+"7'....
:;
~
II:
g
I
1.150
1.200
1.250
1.300
~
1.350
1.0
10.0
IF -INPUT FORWARD CURRENT (mAl
Vo -OUTPUT VOLTAGE IVI
Figure 2. Normalized DC Transfer
Characteristics.
Figure 3. Normalized Current Transfer Ratio
VS. Input Forward Current.
];
...
~.
~
"9":e
:>
"
~
I
>-
~C
~
:;
,.
«
2
0
NO~MALIZED TO:
~
1t"
0
If
lee A.T Ip "" 'f.6mA
Vtc -I$V
II:
0
z
T",
I
~
2trc
!l
I
0.01
0.1
1.0
10
J
100
0.1
0.1
1.0
Figure 4. Normalized Supply Current vs.
Input Forward Cu.rrent.
Figure 5. Propagation Delay to Logic Low
VS. Input Pulse Period.
I,
.6
~60
-40 -2"; 0-20 -40
.0
o
v -
I'UL$I;
GEN.
1r, tf~ 5na
'-'00110
*PtJu;£" 60 oilS
'--vo~
,
',----,
tpHL
10
0
I
¥~5V::VO
o
~
1.6V
-IF - INPUT FORWARD CURRENT (mA)
80 100 120 140
Figure 6. Propagation Delay vs.
Temperature.
Zo-Gon
-:h=-V
1.5V
.
16
IE
60
,..-_ _ __
o--~
>-
100
10.0
T -INPUT PULSE PERIOD (ml)
IF - INPUT FORWARD CURRENT (mA)
~
r::::===+===-;;tf;;Q;~M;;A;;;L:;:'U;;;D-:;ro;;,:I
:i
1l
iii
z
9
kfi.
2.5
:=
~
Figure 1. Input Current vs. Forward Voltage.
~c
1~~mAl
S
~
VF - FORWARD VOLTAGE (V)
J
Aee .. 0.3
12. This Is a momentary withstand test. not an operating condition.
VOL
tpLH-
Figure B. Switching Test Circuit.
Figure 7. Propagation Delay VB. Input
.
Forward Current;
9-132
1-1---o+5V
10K
E
1K
t r• tf =
\:"1'
80 ns
100
I
VO~5V
S'NITCH AT A:
IF = OmA
10
=-
r-
CMH
1\
'\..
Vee'" 5 V
IfH '" 1.6mA
Al" 2.2 kn
TA '" 25~C
VO-------~VOL
SWITCH AT B:
1
IF = 1.6mA
I
200
I
400
600
800
1000
1200
VCM - COMMON MODE TRANSIENT AMPLITUDE (V)
Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.
Figure 10. Common Mode Transient
Immunity vs. Common
Mode Transient Amplitude.
MIL-STD-883 CLASS B TEST PROGRAM
Voc +1.4 V
Hewlett-Packard's HCPL-5731 optocoupler is in compliance with MIL-STD-883, Revision C. Testing consists of
100% screening to Method 5004 and quality conformance
inspection to Method 5005. Details of these test programs
may be found in Hewlett-Packard's Optoelectronics Designer's Catalog.
100 n TYP.
-=
CONDITIONS: IF = 5 rnA
10'" 10mA
See table below for specific electrical tests.
Figure 11. Operating Circuit for Burn-In and
Steady State Life Tests.
PART NUMBERING SYSTEM
Commercial Product
Class 8 Product
HCPL-5730
HCPL-5731
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Subgroup 1
'Static tests at TA = 25"C -I OH ' 10HX, VOL, 'CCl, ICCH' CTR, VF, BVR and 1'.0
Subgroup 2
'Static tests at TA = +125 0 C - IOH, 10HX, VOL leCl, leCH. BVR and CTR
Symbol
I
VF
)
Min,
I
Max.
I
Units
I
Test Conditions
)
1.8
I
V
I
IF
Subgroup 3
"Static tests atTA = -55°C Symbol
I
VF
I
Min,
= 1.6 mA
IOH, IOHX, VOL, ICCl, leCH, BVR and CTR
I
I
Max.
1.8
I
j
Units
V
I
I
Test Conditions
IF
= 1.6 rnA
Subgroup 4, 5, 6,7, SA and 88
These subgroups are not applicable to this device type.
Subgroup 9
'Switching tests at TA = 25°C - tpLH1, tpHL1' tplH2, tpHL2' tpLH3, tpHL3, CMH and CML
Subgroup 10
•SWitch; ng tests at TA = +125° C - tplHl, tpHL1, tpLH2, tpHL2, tpLH3, tpHL3
Subgroup 11
'Switching tests at TA = -55°C - tpLH1, IpHU, tpLH2, tpHL2, tPLH3, tpHL3
'Limits and conditions per Table II.
9-133
--_._---_.. -_ ... _---'
FliP'l
a:e.
AC/DC TO LOGIC
INTERFACE
HERMETICALLY SEALED
OPTOCOUPLER
HEWLETT
PACKARD
SCHEMATIC
OUTLINE DRAWING
J
!!..
9.40 (0.3701
9.90 10.3901-1
1
G
5
DATE CODE
-HP-Y--'-Y-Ww-'N'!?--+--rE~~::t
U.S.A.
xxxxxxxxx~
II
MAX.
• MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
• HERMETICALLY SEALED 8 PIN DUAL IN-LINE
PACKAGE
• PERFORMANCE GUARANTEED OVER -55°C TO
+125°C AMBIENT TEMPERATURE RANGE
• MIL-STD-883 CLASS B TESTING
• AC OR DC INPUT
• PROGRAMMABLE SENSE VOLTAGE
• HYSTERESIS
• LOGIC COMPATIBLE OUTPUT
• HCPL-3700 OPERATING COMPATIBILITY
• 500 Vdc WITHSTAND TEST VOLTAGE
• THRESHOLDS GUARANTEED OVER
TEMPERATURE
• THRESHOLDS INDEPENDENT OF
LED CHARACTERISTICS
Applications
MILITARY/HIGH RELIABILITY SYSTEMS
LIMIT SWITCH SENSING
LOW VOLTAGE DETECTOR
AC/DC VOLTAGE SENSING
RELAY CONTACT MONITOR
RELAY COIL VOLTAGE MONITOR
CURRENT SENSING
MICROPROCESSOR INTERFACING
TELEPHONE RING DETECTION
ACIOC
POwER
LOGIC
1
3,81 (0,1501
O.51 £0,0201
-.1N
P
I-t-
0.51
(0,020)-+1 I'-~
Features
n
..- TYPE
S,13 {0.320J
NIJMBER
MAX,
(110Pl·57601
(5761168381
__
nn
GND
DC- INPUT
•
•
•
•
•
•
•
•
•
HCPL~5760
HCPL-5761
(8838)
MAX.
j
3.81
10.1501
MIN.
2,26 10.901
2.90 {o,1101
OIMENSIONS IN MILLIMETRES AND {INCHES)
Description
The HCPL-5760 and HCPL-5761 units are hermetically
sealed, voltage/current threshold detection optocouplers.
The products are capable of operation and storage over the
full military temperature range and can be purchased as
either a standard product (HCPL-5760) or with full MILSTD-883 Class Level 8 testing (HCPL-5761). 80th products
are in eight pin hermetic dual in-line packages.
Each unit contains an AIGaAs light emitting diode (LED), a
threshold sensing input buffer IC, and a high gain photon
detector to provide an optocoupler which permits adjustable
external threshold levels. The input buffer circuit has.a
nominal turn on threshold of 2.5 rnA (I TH +) and 3.6volts
(VTH+)' The addition of one or more external attenuation
resistors permits the use of this device over a wide range of
input voltages and currents. Threshold sensing prior to the
LED and detector elements minimizes effects of different
optical gain and LED variations over operating life (CTR
degradation). Hysteresis is also provided in the buffer for
extra noise immunity and switching stability.
The buffer circuit is designed with internal clamping diodes
to protect the circuitry and LED from a wide range of overvoltage and over-current transients while the diode bridge
enables easy use with ac voltage input.
The HCPL-5760/1, by combining several unique functions
in a single package, provides the user with an ideal
component for computer input boards and other applicatiors where a predetermined input threshold optocoupler
level is desirable.
The high gain output stage features an open collector
output providing both TTL compatible saturation voltages
and CMOS compatible breakdown voltages.
9-134
Recommended operating
Conditions
Symbol Min. Max.
Parameter
Power Supply Voltage
Units
Vcc
3,0
18
Volts
f
0
10
Kfjz
Operating Frequ~ncyf1J
Operating Temperature ................. -55°C to +125°C
Lead Solder Temperature ............... 260°C for 10 s[2)
Average Input Current-liN .................... 15 mA[3)
Surge Input Current-IIN,SG ., ............... 140 mA[3A)
Peak Transient Input Current -IIN,PK .......... 500 mA[3A)
Input Power Dissipation- PIN .... , .... , ....... 195 mW[S)
Total Package Power Dissipation - Pd . , .......... 225 mW
Output Power Dissipation - Po ' ....... , .......... 50 mW
Average Output Current -10 ..................... 40 mA
Supply Voltage - Vcc (Pins 8-5) .... -0.5 V min., 20 V max.
Output Voltage - Vo (Pins 6-5) ..... -0.5 V min., 20 V max.
Absolute Maximum Ratings
Storage Temperature ................... -65°C to +150°C
Electrical Characteristics TA = -55°C to 125°C, unless otherwise specified.
Symbol
Parameter
Min.
'Jyp.*
Max.
Units
1.75
2.5
3.20
rnA
ITH-
0.93
1.3
1.62
rnA
VIN " VTH-: Vcc " 4,5 V;
Vo = 2.4 V; iOH$2S0I-'A
VTH+
3.18
3.6
4.10
V
VIN " V2 - V3; Pins 1 & 4 Open
Vec 4.5 V; Vo 0.4 V;
=
7
=
10~2,6mA
dc (Pins 2, 3)
VTH_
1,90
2.5
3.00
V
VIN " V2 - V3; Pins 1 & 4 Open
Vcc -= 4.5 V; Vo " 2.4 V;
10$ 250JlA
V
VIN 1V 1 - V41 ; Pins 2 & 3 Open
Vcc " 4.5 V; Vo '" 0.4 V;
10;;:2,6mA
1,2
-
=
VTH+
3.79
5.0
5.62
ac (Pins 1,4)
Input Clamp Voltage
VTH _
2.57
3.7
4.S2
V
VIN '" I V 1 - V41 ; Pins 2 & 3 Open
Vee'" 4.5 V; Vo = 2.4 V;
10$ 250JlA
V1HC1
5.3
5.9
6.7
V
VIHC1 '" V,;; - Va; V3 '" GND
liN -= 10mA; Pin 1 &4
Connected to Pin3
VIHC2
6.0
6.6
7.4
V
VIHC2 -= IV1 - V41; IIIN! '" 10mA;
Pins 2 & 3 Open
12.0
13.0
V
VIHC3
Input Current
liN
Logic Low Output Voltage
VOL
Logic High Output Current
10H
Logic Low Supply Current
ICCl
logic High Supply Current
ICCH
Input-Output Insulation
1'.0
Propagation Delay Time to
Logic Low Output Level
tpHL
Propagation Delay Time to
Logic High Output Level
tpLH
Logic High CommOn Mode
Transient Immunity
ICMHI
Logic Low Common Mode
Transient Immunity
Note
=
ITH+
Input Threshold Current
Input
Threshold
Voltage
Fig.
Conditions
VIN = VTH+; Vcc 4.5 V;
Vo -= 0.4 V; lo~ 2.6 mA
3.0
3.9
4.5
mA
=
4
Vcc = 4.5 V; 10L =2.6 rnA
4
V
JlA
0,05
2.0
mA
0.001
7.S
JlA
Vce'" 18 V; Vo " Open
1
JlA
45% RH, t = 55,
V1-0" 500Vdc, TA" 25"C
20
ps
Rt." 1.8kn, CL
VOH -= Vee
=l8V
7
V2 - Va = 5,0 V; Vo= Open
VCC:: l8V
5
g, 10
=15pF
6, 7
4
25
Jl$
1000 ;;;:10,000
Vips
;;;:10,000
!CMt.!
Rt." t8kn, Ct." 15pF
VeM" SOV
VCM" 450 V
1000 ;;:5,000
V/p,s
;;;:5,000
, All typical values are at TA = 25°C, Vce = 5 V, unless otherwise specified.
9-135
-
liN" 15mA, Pins 1 & 4 Open
VIN V2 - Va " 5.0 V;
Pins 1 & 4 Open
0.4
7
3
VIHC3 " V2 - Va: Va " GND,
2S0
0.1
7,8
VCM"50V
VCM
=250 V
-
6,11
6, 12
TA "'25"C
IIN"OmA
8
TA = 25"C
I'N"'4mA
13,14
Typical Characteristics
Parameter
All typical values are at VCC = 5 V. T A = 25°C unless otherwise specified:
Conditions'
Fig.
Symbol
'TYP·
Unit.
IHVS
1.2
mA
VHVS
1.1
V
VHvs:O VTH+ - VTH-
VILC
-0.76
V
VILC=V2- Vs: Vs= GND; liN'" -10mA
Hysteresis
Input Clamp Voltage
IHYS =ITHt ~ ITH-
Note
1
V01.2
0.62
VOSA
0.73
Input-Output Resistance
RI_o
1012
n
VI-O '" 500 Vdc
9
Input-Output Capacitance
C,-o
2.0
pF
9
Input Capaoitance
CIN
50
pF
f'" 1 MHz. VI-O= OVdc
f= 1 MHz:; VIN=OV, Pins 2 & 3,
Output Rise Time (10-90%)
Ir
10
p.e
7
Output Fall Time (90-10%)
If
0.5
p's
7
Bridge Diode Forward Voltage
liN = 3 mA (see schematic)
Pins 1 &. 4 Open
12~~~~-.-.-.-.-.-.-.-.
Vc-e ." 4,.6 V
101. '1= 2.6mA
>
10
VOL
~
G.4 V
VOtl
'>t
4,$ V
>
I
'OH .., 2S0~A
9
0
~
4.2
3.2
3.8
2.8
I
3.4
2.4
~
3.0
2.0
2.6
1.6
TH_
TH+
INPUT VOLTAGE OR CURRENT
......J:
ffia:
a:
::>
u
I
,
->
J:
a:
'-'
0
0
:fl
J:
>
E
c
..J
a:
...
w
..
2.2
1.2
1.8
0.8
,I
"
TA - TEMPERATURE -"C
Figure 1. Typical Transfer Characteristics
(ac voltage Is Instantaneous value,)
Figure 2. Typical dc Threshold Levels vs. Temperature.
Notes:
1. Maximum operating frequency is defined when output waveform (Pin 6) attains only 90% of VCC with RL = 1.8 kn. CL =
15 pF using a5 V square wave input signai.
2. Measured at a point 1.6 mm below seating plane.
3. Current int%ut of any single lead.
4. Surge input current duration is 3 ms at 120 Hz pulse repetition
rate. Transient input current duration is 10l'S at 120Hz pulse
repetition rate. Note that maximum Input power. PIN. must be
observed.
5. Derate linearly above 100°C free-air temperature at a rate of
4.26 mW/oC. Maximum input power dissipation of 195 mW
allows an input IC junction temperature of 150°C at an
ambient temperature of TA = 125°C with a typical thermal
resistance from junction to ambient of OJAi = 235°C/W. The
typical thermal resistance from junction to case is equal to
170°C/W. Excessive PIN and TJ may result in device
deg radation.
6. The 1.8 kn load represents 1 TTL unit load of 1.6 mA and the
4.7 kn pull-up resistor.
7. Logic low output level alPin 6 occurs under the conditions of
VIN 2! VTH+ as well as the range of VIN > VTH- once VIN has
exceeded VTH+' Logic high output level at Pin 6 occurs under
the conditions of VIN ::; VTH- as well as the range of VIN <
VTH+ once VIN has decreased below VTH-.
8. The ac voltage is instantaneous voltage.
9. Device considered a two terminal device: pins 1. 2. 3. 4
connec,ted together. and Pins 5. 6. 7. 8 connected together.
10. This is a momentary withstand test. not an operating
condition.
11. The tpHL propagation delay is measured from the 2.5 V level
of the leading edge of a 5.0V input pulse (11's rise time) to
the 1.5 V level on the leading edge of the output pulse (see
Figure 7).
12. The tpLH propagation delay is measured from the 2.5 V level
of the trailing edge of a 5.0V input pulse (1 I'S fall time) to the
1.5 V level on the trailing edge of the output pulse (see
Figure7).
13. Common mode transient immunity in Logic High level is the
maximum tolerable dVCM/dt of the common mode voltage.
VCM. to ensure that the output will remain in a Logic High state
(i.e .• Vo > 2.0V). Common mode transient immunity in Logic
Low level is the maximum tolerable dVCM/dt of the common
mode voltage. VCM. to ensure that the output will remain in a
Logic Low state (i.e .• Vo < 0.8 V). See Figure 8.
14. In applications where dVCM/dt may exceed 50.000 V/I'S (such
as static discharge). a series resistor. RCC. should be included
to protect the detector IC from destructively high surge
currents. The recommended value for RcC is 240.0 per volt of
allowable drop In VCC (between Pin 8 and VCC) with a
minimum value of 240.0.
9-136
60
65
50
~
I
ffi
II:
§
"
~
1
TAl.
m
2~C I-
>
!
i
45
40
~
I
V
0
Ie
f'"
CONNEClep
S
" 'fOGETllER:
,
de 'PINS3.4
CONNECTED
TOGETHER
0
15
10
I I
3
4
a
g
5
3.0 I-hHH-f-+-+-+-+++++-1120 ~
o
~
M
~ ~
2.2
~
~
do IPINS 2. 3 ' ,l.'PINS1.4_
OPEN) __ !-
I- ""11
I I
2
~
f- jr
~
~
I
1mil
5
6
7
B
9
10 11 12 13
TA ... TEMPERATURE ... ·C
V,N'" INPUT VOLTAGE ... V
Figure 4. 'iYplcallnput Current, liN, and Low level Output
Voltage, VOL, vs. Temperature.
Figure 3. 'iYplcallnput Characteristics, liN vs. VIN'
(ac voltage Is Instantaneous value.)
-;,
I
10
~
24
I I
./
lr~
E
-
~1~NttDn'lA
V"
/
~
Ic~V'
Vcc"lav
VO' OPEN
~
20
,/'
,/
1 I 1
R,
Vf~~ 6.~
~
c
16
2
0
12 1-1...... I-
~
~
11:
c
1.:
..
I
"
'I.d.!!
f-f- Cl.. *" 15,pF
H-
I
~
1-1f-I--
i-\.I
v
I
fOV
1 "IS PULSE WIDTH
Itt
f= 100 Hz:
tl. tl • 1/J," (10·90%)
I
'7
I
~H=t±
I"-oI-J..I
35
65
TA ... TEMPERATURE ...
95
125
-55
'c
-25
I
,
I
,
I
""H '/
.".
I
I
ttttL.
I I
I
~I
-25
~
~
~
I--
w
01
I~;zg:; l-
rr-0PENJ
E
I
w
u
~
~
I
5
200
3.0
35
65
95
125
TA ... TEMPERATURE ... C
Figure 6. 'iYPlcal Propagation Delay VI. Temperature.
Figure 5. 'iYplcal High Level Supply Current,
ICCH vs. Temperature.
9...137
HCPL·5760/1
Rce·
+5V
HCPL·5760/1
-t--'IIIiIr-....,.-O+5V
0.01.'
BYPASS
-;---+---o Vo
-;r.-'---+-o Vo
Y,N
·SEE NOTE 14
PULSE AMPLITUDE = 5.0V
PULSE WIDTH -1 m.
f .. 100Hz
t:, .. tf = 1.0"s (1O-900A.)
PULSE GENERATOR
·CL IS 16 pF. WHICH INCLUDES PROBE
. AND STRAY WIRING CAPACITANCE.
AND STRAY WIRING CAPACITANCE.
tr = 40 ns
tf = 40 ns
r-----------~----5V
INPUT
--- - ---
Y,N
.".
"C L IS 15 pF, WHICH INCLUDES PROBE
- - - 2.5V
OV
'------VOH
__
..- - - - - - - 5 V
Vo
OUTPUT
SWITCH AT A: liN '" 0 rnA
Vo
-+---1.5V
I~~~~~~~~~~~-----~L
VO----------~VOL
"
SWITCH AT B: liN = 4 rnA
Figure 7. Switching Test Circuit.
Figure 8. Test Circuit for Common Mode Transient
Immunity and Typical Waveforms. .
PART NUMBERING SYSTEM
MIL-STD-883 CLASS B TEST PROGRAM
HewleU-Packard's HCPL-5761 optocoupler is in compliance
with MIL-STD-883, Revision C. Testing consists of 100%
screening to Method 5004. and quality conformance inspection to Method 5005. Details of these test programs may be
found in Hewlett-Packard's Optoelectronics Designer's
Catalog.
Commercial Produi:t
Class B Product
HCPL-5760
HCPL-5761
8t-..,..--......--,
560
See table below for specific electrical.tests.
560
3
liN .. 12 rnA RMS
lo=20mA
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Figure 9. Operating Circuit for Burn-In and Steady State Life
Tests
Subgroup 1
"Static tests at TA "
26°C - ITH+, ITH~ VTH+{dC), VTH-(d.Q1o VTH+~a..Q1o VTH.:La..Q1o VlfiCl, V HC2, VIHC3, IOH' Iccl.> ICCH
'
Subgroup 2
'Statlc tests at TA +125°C -ITH.. ITt,.., VTH+ldCl, VTH .. (dc), VTH+(ae), VTH..(ae}, VIHC1. VIHC2' V'HC3, IOH' ICCL' lecH
SUbgroupS
'Static tests at TA -55°C -ITH+o IrH-, VTH+(dc},VTH-(dCj, V'rH-{acl. VTH-Iacr VIHC1, VIHC2, VIHC3. IOH' JceL' leCH
Subgroup 4, 5, 6.1, SA and 6B
These SUbgroups are not applicable to this device type.
=
=
Subgroup 9
'Switching tests at TA" 25"C - tpHL, tpLH. ICMHI, ICMLi
Subgroup 10
'Switchlng tests at TA '" +125"C - tpHL. tPLH
Subgroup 11
'Switchlng tests at TA =-65·C - tpHL< tpLH
'Limits and conditions per Electrical Characteristics.
9-138
Electrical Considerations
ITH+
%R ~
x
(-)
P
1-)
Va ~6
3 L dc-
h.
I.r
~4Lac
)lAx
GNDW5
'---~
S·01
Va
PF
Figure 11. External Threshold Voltage Level Selection.
Either ac (Pins 1, 4) or dc (Pins 2, 3) input can be used to
determine external threshold levels.
Rx can provide over-current transient protection by limiting
input current during a transient condition. For monitoring
contacts of a relay or switch, the HCPL-5760/1 in combination with Rx and Rp can be used to allow a specific current
to be conducted through the contacts for cleaning purposes
(wetting current).
For one specifically selected external threshold voltage
level V+ or V_, Rx can be determined without use of Rp via
V+ - VTH+
The choice of which input voltage clamp level to choose
depends upon the application of this device (see Figure 3).
It is recommended that the low-clamp condition be used
when possible to lower the input power dissipation as well
as the LED current, which minimizes LED degradation
overtime.
For interfacing ac signals to TTL systems, output low pass
filtering can be performed with a pullup resistor of 1.5 fl.
and 20 J.Lf capacitor. This application requires a Schmitt
trigger gate to avoid slow rise time chatter problems. For ac
input applications. a filter capacitor can be placed across
the dc input terminals for either signal or transient filtering.
V"~8U:VCC
P7 AL
h,
t[
V+(~A
~I VTH+(~[::+
,r
The HCPL-5760/1 optocoupler has internal temperature
compensated, predictable voltage and current threshold
points which allow selection of an external resistor, Rx, to
determine larger external threshold voltage levels. For a
desired external threshold voltage, V±, a corresponding
typical value of Rx can be obtained from Figure 10. Specific
calculation of Rx can be obtained from Equation (1) of
Figure 11. Specification of both V_ and V+ voltage threshold
levels simultaneously can be obtained by the use of Rx and
Rp as shown in Figure 11 and determined by Equations (2)
and (3).
In applications where dVeM/dt may be extremely large (such
as static discharge), a series resistor, R ee , should be
connected in series with Vee and Pin 8 to protect the
detector IC from destructively high surge currents. See
note 14 for determination of Ree. In addition, it is
recommended that a ceramic disc bypass capacitor of
0.01 J.Lf to 0.1 J.Lf be placed between Pins 8 and 5 to reduce
the effect of power supply noise.
HCPL·5760!1
Rx =
(-)
(-)
(1 )
ITH+
(-)
~
For two specifically selected external threshold voltage
levels, V+ and V_, the use of Rx and Rp will permit this
selection via equations (2). (3) provided the following
conditions are met:
~ 2: VTH+ and V+ - VTH+ < ITH+
V_
Rx =
VTH-
V_ - VTH-
ITH-
(2)
ITH+ (VTH-) - ITH- (VTH+)
(3)
See Application Note 1004 for more information.
If
100
VVTH, - 3.6V} do' PINS 2 3
J /'
1# 1-'
50
VI
If"
JV
VTH~ =
2.5V
VTH, = 5.0V}
.
•
. PI'NS 1 4
VTH. =3.7V
a~. 'I'
j'
ITH+ = 2.5 rnA __LhLHJ--j
'1
H
A - :
~5~;A -+--!i-j'-----l
II' lac VOLTAGE IS INSTANTANEOUS VALUE)
00
40
80'
120
160
200
240
RX - EXTERNAL SERIES RESISTOR - kH
Figure 10. Typical External Threshold Characteristics, V± vs. Rx.
9-139
Flipa
DUAL CHANNEL
HERMETICALLY
SEALED
OPTOCOUPLER
HEWLETT
a:~ PACKARD
4N55
4N55/8838
Outline Drawing'"
DAT£CODE
-~: ' 3'1 <: ;:
4
I
VF
Va
I
CATHODE _
h SUFFIX U1T61\)
11
Mr
Lt-c-~~~_,
hpVYWW X
,6.4N55
PIN 1IOENT,FIEA
•. 13 (.320)
TYPE !-. U.S.A.883B)
13
~
~:D
V.
~
7
ANOOE:
8
-#(
IF
I
9
Vo
V,
CATHODE _
11
Vee
1
'-t--...----o~~D
'-----==--0 ~~
Features
• NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
• PERFORMANCE GUARANTEED OVER -SS"C TO +12S"C
AMBIENT TEMPERATURE RANGE
• MIL-STD-883 CLASS B TESTING
• HERMETICALLY SEALED
• HIGH SPEED: TYPICALLY 400k BIT/S
• 2 MHz BANDWIDTH
• OPEN COLLECTOR OUTPUTS
•
•
•
•
•
18VOLTVcc
DUAL-IN-LINE PACKAGE
1S00 Vdc WITHSTAND TEST VOLTAGE
HIGH RADIATION IMMUNITY
HCPL-2S30/2S31 FUNCTION COMPATIBILITY
channel has a light emitting diode and an integrated
photon detector. Separate connections for the photodiodes
and output transistor collectors improve the speed up to a
hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance.
The 4N55 is suitable for wide bandwidth analog
applications, as well as for interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF
= 16mA over the full military operating temperature range,
-55 0 C to +125 0 C. The 18V Vee capability will,enable the
designer to interface any TTL family to CMOS. The
availability of the base lead allows optimized gainl
bandwidth adjustment in analog applications. The
shallow depth of the IC photodiode provides better
radiation immunity than conventional phototransistor
couplers.
Applications
• HIGH RELIABILITY SYSTEMS
• LINE RECEIVERS
Hewlett-Packard's new high reliability part type 4N55/883B
meets Class B testing requirements for MIL-STD-883. This
part is the recommended and preferred device from the
4N55 product family for use in high reliability applications.
• DIGITAL LOGIC GROUND ISOLATION
• ANALOG SIGNAL GROUND ISOLATION
• SWITCHING POWER SUPPLY FEEDBACK
ELEMENT
See the selection guide at the front of this section for other
devices in this family.
• VEHICLE COMMAND/CONTROL
• SYSTEM TEST EQUIPMENT
• LEVEL SHIFTING
Description
The 4N55 conSists of two completely independent optocouplers in a hermetically sealed ceramic package. Each
CA UT/ON: The small junction sizes inherent to the design of this
bipolar component increases the component's susceptibility to
damage from electrostatic discharge (ESD). It is advised that
normal static precautions be taken in handling and assembly of
this component to prevent damage and/or degradation which may
be induced by ESD.
*JEDEC Registered Data
9-140
Absolute Maximum Ratings*
Emitter Base Reverse Voltage, VEBO ............ 3.0V
Base Current, Is (each channel) ................ SmA
Output Power Dissipation (each channel) ..... SOmW
Derate linearly above 100° C free air
temperature at a rate of 1.4mW/o C.
Storage Temperature ............... -6So C to +1S0° C
Operating Temperature ............ -SsoC to +12SoC
Lead Solder Temperature ............ 260° C for 10 s
(1.6mm below seating plane)
Average Input Current, IF (each channel) ...... 20mA
Peak Input Current, IF (each
channel, ~ 1ms duration) .................. 40mA
Reverse Input Voltage, VR (each channel) ......... SV
Input Power Dissipation (each channel) ...... 36mW
Average Output Current, 10 (each channel) ..... SmA
Peak Output Current, 10 (each channel) ....... 16mA
Supply Voltage, Vee (each channel) ..... -O.SV to 20V
Output Voltage, Va (each channel) ...... -O.SV to 20V
TABLE I.
Recommended Operating
Conditions (EACH CHANNEL)
~Ymbol
Input Current. Low Level
$Upply Voltage
Min. Max. Units
IFl
2
Vec
""
TABLE II.
Electrical Characteristics
Parameter
Current Transfer Ratio
Symbol
CTA'
TA = -Ssoc to +125°C, unless otherwise specified
Min. Typ.·' Max. Units
9
20
Test Condlllons
Fig. Note
%
IF=16mA. Vo=OAV, Vec"'45V
2.3
1,2
4
1
IOH
10
100
flA
IF=O. IF lather channel,=20mA
Vo=Vec=J8V
IOH1'
30
250
p.A
IF250p.A, IF lather channel\=20mA
Vo=VCG;S18V
4
1
Logic Low Supply Current
ICCl'
35
200
p.A
IF1'-IF2='20mA, Vcc=18V
5
1
Logic High Supply Current
ICCH'
0.1
10
p.A
IF=OmA, IF lather channel'=20mA
Vcc=18V
1.5
1.8
V
IF20mA
V
IR=10p.A
Logic High Output Current
Output Leakage Current
Input Forward Voltage
VF'
Input Reverse Breakdown
Voltage
BVR'
Input-Output Insulation
Leakage Current
11-0'
Propagation Delay Time
to Logic High at Output
Ipu-t"
Propagation Delay Time
to Logic Low at Output
3
1.0
OA
tPHl'
1
1
1
1
1.0
p.A
45% Relative Humidity,
TA=2S Q C, t=5s, V,-o=1500Vdc
6.0
p.s
RL=8.2Kfl, Cl =50pF
IF16mA. Vcc=5V
6,9
1
pS
RL=8.2Kfl, Cl=50pF
IF=16mA. Vcc=5V
6,9
1
2.0
3,9
"JEDEC RegIstered Data.
*-
All typical values are at Vee
= 5V, TA = 25° C.
TABLE III.
Typical Characteristics at TA =25°C
Parameter
Temperature Coefficient
of Forward Voltage
Symbol
,,\,VF
"TIA
Typ.
Units
-1.5
mV/'C
Test Conditions
Fig. Note
IF=20 mA
1
1=1 MHz. VF=O
1
Cin
120
pF
Resistance Ilnput.Output.l
RI-o
1012
n
~VI-o=500
Capacitance (Input·Output)
CI-O
1.0
pF
1=1 MHz
Ii-I
1
pA
45% Relative Humidity,
VI-I=500Vdc, t=5s
5
Capacitance (Input-Input I
CI-I
.55
pF
1=1 MHz
5
Transistor DC Current Gain
hFE
150
-
Vo=5V. 10=3mA
1
Small Signal Current
Transfer Ratio
"\'10
21
00/
Input Capacitance
Input-Input Insulation
Leakage Current
1
1,4
0
Vcc=5V, Vo=2V
7
1
1000
V//J-s
IF=O, RL=8,2kfl
VCM=10V p- p
Vo (min,) = 2.0 V
10
1,6
ICMLI
1000
V/p.s
IF=lSmA, RL=8.2kfl
VCM=10V p - p
Vo (max,) = 0.8 V
10
1.7
6W
2
MHz
Rl=10Pfl
8
8
TiF
Common Mode Transient
Immunity at Logic High
Level Output
ICMHI
Common Mode Transient
Immunity at Logic Low
Level Output
Bandwidth
Vdc
9-141
250
p.A
18
V
Notes:
1. Each channel.
2. Current Transfer Ratio is defined as the ratio of output collector current. 10. to the forward LED input current. IF. times 100%, CTR is
known to degrade slightly over the unit's lifetime as a function of input current. temperature. signal duty cycle and system on time.
Refer to Application Note 1002 for more detail. In short it is recommended that designers allow at least 20-25% guard band
for CTR degradation.
3. Measured between pins 1 through 8 shorted together and pins 9 through 16 shorted together.
4. Measured between each input pair shorted together and the output pins for that channel shorted together.
5. Measured between pins 3 and 4 shorted together and pins 7 and 8 shorted together.
6. CMH is the steepest slope (dV/dt) on the leading edge of the common mode pulse. VCM. for which the output will remain in the
logic high state (i.e. Vo > 2.0 V).
7. CML is the steepest slope (dV/dt) on the trailing edge of the common mode pulse. VCM. for which the output will remain in the
logic low state (i.e. Vo < 0.8 V).
8. Bandwidth is the frequency at which the ac output voltage is 3dS below the low frequency asymptote.
9. This is a momentary withstand test. not an operating condition.
20
0cc ~ sv I
'8 I-- TA
• 2S'C
"E ,.'6
"E
I
I
t-
t-
iiia:
a:
iiia:
'2
a
'0
a:
ao
a:
t-
a:
~
"
I
.9
"i=
~
Ii
0
I
v
r
o
.-'
~
tt-
o
'DO
1
Vee "'-5V
I
Va -0.4V
~
a:
a:
"c.>
,.ol----·---+-----b-.;-~-_1
8
,."a:
:;:
c.>
(;
9
I
I,· 250 ~A. I,
12
14
16
18
20
.9
0.0
~
,~
,J
V
V
0.00
-60 -40 -20
'DO
I~TH~R C~AN~El) i 20 i A
,
~
I
a:
'0
r---
10
I, - I, (OTHEA CHANNELl'
ffi o.
0.51------~~---+--·-_1
oz
t;
If ",lO-rnA
I, • SmA
,rl'"jAA((rrrr)·:m;
"o
a
fil
~
i=
a:
N
\f::~!:::: ._2O':':;t,.....,...
:=ie::
-,••15 mA _
-
10
~
iiia:
:::;
-
~: t:- -~~~~.-.-
Figure 2. DC and Pulsed Transfer Characteristic
'"~
a:
-
Va - OUTPUT VOLTAGE - V
Figure 1. Input Diode Forward Characteristic.
o
~
-
- - ~ -=
V F -FORWARDVDLTAGE-VOLTS
a:
\~;'2!.!?
~-;~.:'~
IF - INPUT DIODE FORWARD CURRENT - mA
./
V
v
V
,,/
vcr vr 1iV
0
20
40
60
80 100 120 140
TA - TEMPERATURE _
°c
Figure 4. Logic High Output Current vs. Temperature.
Figure 3. Normalized Current Transfer Ratio vs. Input Diode
Forward Current.
50r-.--,-,--,-.--,-,--r-,-,
4.0
3.6
"I
>-
~
0
3.2
2.8
2.4
2
0
i=
"'"
"&g:
I
~
2.0
'.6
'.2
0.6
0.4
25
IF - INPUT DIODE FORWARD CURRENT - rnA
TA - TEMPERATURE _
Figure 5. Logic Low Supply Current vs. Input Diode
Forward Current.
°c
Figure 6. Propagation Delay vs. Temperature.
9-142
o
~
2.0
z
1.B f--ITA
Vo =2V
1.6 f-- VCC' 5V
a:
*
~
II-
.125'J
1.4
:ia:
1.2
::>
1.0
a:
<.J
j
......
iii" 0.6 If
Ii!
NO.4
;:;
~
a:
o
z
,
e"
"."
~
~~RMALIZED TO: _ -
I
O.B
I'F
','6 mt
1
0,2
o
o
~I:a
15
10
20
10
25
f - FREQUENCY - MHz
IF - QUIESCENT INPUT CURRENT - rnA
Figure Sa. Frequency Response
Figure 7. Normalized Small Signal Current Transfer Ratio vs.
Quiescent Input Current.
,--,---0 +15V
+5V
RL
o---~-----,
/'-I----~--oVo
Figure Sb. Frequency Response
t" tf "" 8ns
VCM
':~,
Va
,,
5V
Va
1.5V
----""~
__- - - - - - - 5 V
SWITCH AT A:
Va
IF= OmA
-----------~VOL
SWITCH AT B: If=16mA
,.....-----,,6
...------.,6
r-+--~~-~-~O+5V
r-+---+~-~--O+5V
'--"""--0 Va
,--........--0 VA
IF MONITOR
50% DUTY CYCLE
1/f = 100,l.ls
10% DUTY CYCLE
1/fo;;;; 100llS
Figure 9. Switching Test Circuit*.
'JEDEC Registered Data
Figure 10. Test Circuit for Transient Immunity and
Typical Waveforms.
9-143
Vee
lOGIC FAMilY
DEVICE NO.
Vee
RlS%
TOLERANCE
LSTTL
54LS14
CMOS
6V
CD40106aM
5V 15V
·l9kn
8.2kn J22k!l
*THE EOUIVALENT OUTPUT LOAD RESISTANCE IS AFFECTED
BY THE LSTTllNPUT CURRENT AND IS APPROXIMATELY B.2kn.
This is a worst case design which takes into account 25%
degradation of CTR. See App. Note 1002 to assess actual
degradation and lifetime.
Figure 11. Recommended Logic Interface.
LOGIC GATE
MIL-STD-883 CLASS B TEST PROGRAM
PART NUMBERING SYSTEM
Hewletl-Packard's 883B optocouplers are in compliance
with MIL-STD-883, Revision C. Deviations listed below are
specifically allowed in DESC drawing 81028 for an H.P.
Optocoupler from the same generic family using the same
manufacturing process, design rules and elements of the
same microcircuit group.
Commercial Product
Class B Product
4N55
4N55/8838
Testing consists of 100% screening to Method 5004 and
quality conformance inspection to Method 5005 of MILSTD-883. Details of these test programs may be found in
Hewlett-Packard's Optoelectronics Designer's Catalog.
200n
4N55/883B Clarifications:
I. 100% screening per MIL-STD-883, Method 5004 constant acceleration - condition A not E.
200n
Voe
+3.5V
270n
270n
':'
II. Quality Conformance Inspection per MIL-STD-883,
Method 5005, Group A, B, 0 and D.
Group A Group B Group C Group D -
Vee
+5.5V
16
15
14
13
12
11
10
9
CONDITIONS: IF = 20 rnA
See table below for specific electrical tests.
No change
Constant Acceleration - Condition A not E.
Constant Acceleration - Condition A not E.
TA = +125°C
Figure 12. Operating Circuit for Burn-In and Steady State Life
Tests
GROUP A - ELECTRICAL TESTS
QUANTITY/ACCEPT NO. = 116/0
Subgroup 1
• Static tests at TA "" 25· C, 10H. BVR. leel. leeH CTR,
Subgroup 2
VF, 10HI and It-o.
* Static tests at TA '" +125· C, 10K, BVR lecl.. leCH. OTR, VF and 10HI
subgroup 3
• StatiC tests at TA = -55'0, 10K, eVR leCL, leeH, CTR, VF and IOHI
subgroup 4, 5, 6, 7, 8A and 8S
These subgroups are non-applicable to this device type
Subgroup 9
• Switching tests at TA '" 25·C, tPLH and tPHL
subgroup 10
• Switching tests at TA = +125·0. tPLH and tPHL
Subgroup 11
• Switching tests at T A"" -55" C, tPLH and tPHL
• Limits and Conditions per Table II.
9-144
DUi';
HIGH CMR RIGH
HEJiMETICALLY
OP:rO
;1M
+3
2
.!..EL..,
~
VFI
-
VF2
5
l+--======..----'~
I
PIN 1 IDENTIFIER
I
I
4I
I
~
CONNECTED BETWEEN PINS 15 AND 10.
;
(,990)
--;; r2.79 mlii
Features
°
NEW - MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
o
PERFORMANCE GUARANTEED OVER -55°C
TO +125°C AMBIENT TEMPERATURE RANGE
o
HERMETICALLY SEALED
• HIGH SPEED
o
NEW - INTERNAL SHIELD FOR HIGHER CMR
o
TTL COMPATIBLE INPUT AND OUTPUT
• HIGH COMMON MODE REJECTION
DUAL-IN-L1NE PACKAGE
1500 VDC WITHSTAND TEST VOLTAGE
o
EIA REGISTRATION
o
HIGH RADIATION IMMUNITY
o
HCPL-2631 FUNCTION COMPATIBILITY
Applications
o
LOGIC GROUND ISOLATION
• LINE RECEIVER
• COMPUTER - PERIPHERAL INTERFACE
• VEHICLE COMMAND/CONTROL ISOLATION
o
HARSH INDUSTRIAL ENVIRONMENTS
o
SYSTEM TEST EQUIPMENT ISOLATION
MAX
I0.51 f.(J20)
foj3 ~ _
Yfli11ffl :'"
10
L---~----+---<~--o GND
o
4,32 (,170)
20 06 P~OI-------l
•
NOTE:
A 0.01 TO O.1flF BYPASS CAPACITOR MUST BE
o
~ll~l-:.o)
6Nl34
I
I
+36,~
-
hpVYWW X
I
1
-r
h SUFFj/j LETTER)
OATfeOOE
I
6N134
0." (,OZO)
113
MAX.--;
3,0\1.150)
MIN.
DIMENSION'S IN MILLIMETERS AND fiNCHES).
16
15
11
10
Description
The 6N134 consists of a pair of inverting optically coupled
gates, each with a light emitting diode and a unique high
gain integrated photon detector in a hermetically sealed
ceramic package, The output of the detector is an open
collector Schottky clamped transistor. Internal shields
provide a guaranteed common mode transient immunity
specification of 1000 V/p,s,
This unique dual coupler design provides maximum DC
and AC circuit isolation between each input and output
while achieving TTL circuit compatibility. The isolator
operational parameters are guaranteed from -550 C to
+125 0 C, such that a minimum input current of 10 mA in
each channel will sink a six gate fanout (10 mAl at the
output with 4.5 to 5,5 V Vee applied to the detector. This
isolation and coupling is achieved with a typical propagation delay of 55 nsec.
Hewlett-Packard's high reliability part type 8102801 EC
meets Class B testing requirements of MIL-STD-883. This
part is the recommended and preferred device from the
6N134 product family for use in high reliability applications. Details of the 8102801 EC test program may be seen
in the data sheet for this part.
See the selection guide at the front of this section for
other devices in this family.
*JEDEC Registered Data
9-145
Absolute Maximum Ratings*
Recommended operating
Conditions
(No derating required up to 125° C)
Storage Temperature ............. , ........ -65°C to +150° C
Operating Temperature .... , .............. -55° C to +125° C
Lead Solder Temperature .................... 260° C for 10 s
(1.6mm below seating plane)
Peak Forward Input
Current (each channel) ........ 40 mA (:'>1 ms Duration)
Average Input Forward Current (each channel) ... 20 mA
Input Power Dissipation (each channel) ............ 35 mW
Reverse Input Voltage (each channel) .................. 5 V
Supply Voltage - Vce ........... 7 V (1 minute maximum)
Output Current - 10 (each channel) ., .............. 25 mA
Output Power Dissipation (each channel) .......... 40 mW
Output Voltage - Vo (each channel) ................... 7 V
Total Power Dissipation (both channels) ......... 350 mW
TABLE I
Input Current, Low Level
Each Channel
Sym.
Min.
Max.
Units
250
J.lA
IFL
0
Input Current, High Level,
Each Channel
IFH
12.5t
20
rnA
Supply Voltage
Vee
4.5
5.5
V
-55
125
Fan Out (TTL Load)
Each Channel
N
Operating Temperature
TA
6
"C
t12.S mA condition permits at least 20% eTR degradation
guardband. Initial switching threshold is 10 mA or less.
TABLE II
Electrical Characteristics
Over Recommended Temperature (T A = -55° C to +125° C) Unless Otherwise Noted
'tYP···
Max.
Units
High Level Output Current
10H*
5
250
pA
Vee" 5.5 V, Vo" 5.5 V,
IF" 250 pA
Low Level Output Voltage
VOL*
0.4
0.6
V
Vce=5.5V, IF" lOrnA
10l (Sinking) = 10 mA
High Level Supply Current
leeH'
18
28
mA
Vee "'5.5V,IF=0
(Both Channels)
Low Level Supply Current
leel'
26
36
mA
Vee'" 5.5 V, IF" 20 mA
(Both Channels)
Vp'
1.5
1.75
V
IF" 20 mA, T A " 25" C
1
1
1.85
V
iF"20mA
1
1
V
IR = 10 p.A, T A
Parameter
Input Forward Voltage.
Symbol
Min.
VF
Input Reverse
Breakdown Voltage
BVR*
Input-Output Insulation
Leakage Current
1,-0'
Propagation Delay Time to
tpLH*
High Output Level
tpLH
Propagation Delay Time to
tpHl*
Low Output Level
tpHL
5
1.0
60
90
90
Figure
4
=25° C
2, 10
n$
Cl = 15 pF
RL "5100
Cl" 50 pF
IF" 13 rnA. T A 25°C
CL = 15 pF
RL=5100
CL = 50 pF
IF = 13 mA, T A " 25" C
ns
1,9
1
VI-O " 1500 Vdc,
Relative Humidity
TA"25"C,t=5s
100
Note
1
J.lA
100
55
Test Conditions
=45%
2,3
1.5
2,3
1,6
=
Common Mode
Transient Immunity
at High Output Level
ICMHI
1000
10000
VI/J.s
VeM'" 50 V (peak),
Vo (min.) " 2 V,
RL "5100, IF =0 mA
6
1,7
Common Mode
Transient Immunity
at Low Output Level
ICMJ
1000
10000
V/IlS
V eM '" 50 V (peak),
Vo (max.) =0.8 V,
RL" 5100, IF" 10 mA
6
1,8
'JEDEe Registered Data
"All typical values are at Vee = 5 V. TA = 25°e
9-146
TABLE III
"TYpical Characteristics
tiN
loput Capacitance
: t;V F
Input Diode Temperature
Coefficient
:
d3.esistance (Input-Output)
Typ.
Max.
Units
60
pF
-1.5
mV/oC
Test Conditions
IF=20mA
CI.a
Note
1
....
:....
n
V,.o = 500 V
1.7
pF
f = 1 MHz
05
nA
1012
Figure
VF = 0, f = 1 MHz
.....
t;TA
RI·a
Capacitance (Input-Output)
EACH CHANNEL
at T A = 25°C, Vee = 5 V
SYmi:l91 Min.
Parameter
1
..; ...••..••••.•..•••.....
13
3
RelativeHumidity= 45%
Input-Input
Leakage Current
11-1
Resistance (Input-input)
RI-I
1012
n
:VI-I= 500 V
4
:·f = 1 MHz
4
\:'1"
\1,+= .500 V, t = 55
4
Capacitance (Input-Input)
CI-I
0.55
pF
Output Rise Time (10-90%)
tr
35
ns
RL = 510 n, CL " 15 pF
Output Fall Time (90-10%)
tf
35
ns
IF" 1?mA
1
NOTES:
1. Each channel.
2. Measured between pins 1 through 8 shorted together and
pins 9 through 16 shorted together.
3. Measured between pins 1 and 2 or 5 and 6 shorted together,
and pins 10, 12, 14 and 15 shorted together.
4. Measured between pins 1 and 2 shorted together, and pins 5
and 6 shorted together.
5. The tpLH propagation delay is measured from the 6.5 mA
point on the trailing edge of the input pulse to the 1.5 V point
on the trailing edge of the output pulse.
6. The tpHL propagation delay is measured from the 6.5 mA
point on the leading edge of the input pulse to the 1.5 V point
on the leading edge of the output pulse.
7. CMH is the max. tolerable common mode transient to assure
that the output will remain in a high logic state (i.e., Va >
2.0V).
8. CML is the max. tolerable common mode transient to assure
that the output will remain in a low logic state (i.e., Va < 0.8 V).
9. It is essential that a bypass capacitor (.01 to 0.1I'F, ceramic)
be connected from pin 10 to pin 15. Total lead length between
both ends of the capacitor and the isolator pins should not
exceed 20 mm.
10. This is a momentary withstand test, not an operating
condition.
I h
'"co,
GENERATOR
ZO" 50!'::
'DOD ~
100
~
a:
'0 §
'.0
E
I
...
::l
CJ
C
~
a:
0.001
~/ V
1,10
'i
5
MONITORING
NODE
47~!
1.20
RL
14
;
I
6
I
CLo
11
LGND
10
-=-
a
'CL INCLUDES PROBE AND STRAY WIRING CAPACITANCE .
',~PUT
1.40
J-----\---
---
-I
1.50
~~TPUT
V F - FORWARD VOLTAGE - VOLTS
tPHL
1--
-I
tPLH
IF-13mA
IF-05mA
~
~VOH
1 _ _ _ _ _ _ _ I _ _ _ _ _ l.5V
- - - - - VOL
Figure 1. Input Diode Forward Characteristic
Figure 2. Test Circuit for tpHL and tPLH*
9-147
Va
.01 i-IF
BYPASS
12
7
./
1.30
5V
I ,1>_13
~I~
8
V
I
0.01
INPUT
4
IG
15
1-'
1 .....
3
-
/v
"'a:" 0"11
~
.!!-
tH~511~
~ TA' 20t/'~ /
§
"
'L. c-o2 I~.J, ;..cc
,.
100
TA'= 2&~(:
RL =51onl..-
RL
#
RL
4k.n - - - -
Vec~5V
0
0
0
-- ----
'-~--oVo
1--1--I-
K r-- ....-f..- F.t
><: ........r--.... r-- rr-
- .... ~H~
>,
;g
0
§~
0
'2
10
14
20
18
16
2~----~----~-b~~~~~--~~--~
'"
'0
>
IF - PULSE INPUT CURRENT • rnA
6
I.
If - INPUT DIODE FORWARD CURRENT
Figure 3. PropagationD~lav, tpHL and tpLH
YS. Pulse Input Current, IFH
12
mA
Figure 4. Input·Output Characteristics,
.
,
.b~--1---....-Q+5V
. 120
VCC=5V
Ip'"13mA
/
~L ~51on
I
100
>
~
0
V
z
0
;::
"~
to
60
0
IE
40
/
/
80
k"
t.PUf
11
-<
......
./
'0
'PHt
PUl~E
GEN.
-=
20
VCM
OV
-40 -20
20
40
60
·80
100
5V
120
Vo
TA - TEMPERATURE·"C
va ~~~Im_._.,_'___...JI\..________~IF~·..:'.:.O:::m;;.A_________
Figure 5. Propagation Delav
YS.
Figure 6. TVpical Common Mode Rejection Characteristics/Circuit
Temperature
*JEDEC Registered Data
9-148
~-----------.----.------.--~~------.--
F/in-
--
-------~----
b13AL CfiliANNEL
HIGH CM,R HIGH SPEED
HERMETICALLY SEALED
HEWLETT
~~ PACKARD
,:,: "'Jt
6
hpYVWW
SUFFIX LE.TTER)
n
~~~~B1~02r'O~1E~C~~~~
a, 13 (,320)
__
M_rX.
v:'3- ~
-
x
U.S.A.
lF2
5
(~,
DATECODE::::J
I
I
1
8102801EC
OPTQCOUPL~R
QESC ARRROVEQ .
..
_
--------
fiN 110ENTIFIER
I
I
16
I
10
'------<'------+---+----0 GND
V"
NOTE:
A .01 TO O.l"F BYPASS CAPACITOR MUST BEICONNECTED BeTWEEN PINS 15 AND 10.
15
14
Features
•
o
•
•
•
•
•
•
•
•
•
NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
RECOGNIZED BY DESC*
HERMETICALLY SEALED
MIL-STD-883 CLASS B TESTING
HIGH SPEED
NEW-INTERNAL SHIELD FOR HIGHER CMR
PERFORMANCE GUARANTEED OVER -55°C TO
+125° C AMBIENT TEMPERATURE RANGE
TTL COMPATIBLE INPUT AND OUTPUT
DUAL-IN-LINE PACKAGE
1500 VDC WITHSTAND TEST VOLTAGE
HIGH RADIATION IMMUNITY
GND
10
DtMEr-$lONS IN MIt..LIMcTER$ AND (INCHES),
a minimum input current of 10 mA in each channel will sink a
six gate fanout (10 mAl at the output with 4.5 to 5.5 V Vee
applied to the detector. This isolation and coupling is
achieved with a typical propagation delay of 55 nsec.
The photo ICs used in this device are less susceptible to,
radiation damage than PI N photo diodes or photo transistors due to their relatively thinner photo region.
The test program performed on the 8102801 EC is in compliance with DESC drawing 81028 and the provisions of
Method 5008, Class B of MIL-STD-883.
Applications
Recommended Operating
Conditions
• MILITARY/HIGH RELIABILITY SYSTEM
• LOGIC GROUND ISOLATION
• LINE RECEIVER
• COMPUTER-PERIPHERAL INTERFACE
• VEHICLE COMMAND/CONTROL ISOLATION
• SYSTEM TEST EQUIPMENT ISOLATION
Supply Voltage
Description
The 8102801 EC is the DESC selected item drawing assigned
by DOD for the6N134 optocoupler which is in accordance
with MIL-STD-883 class B testing. Operating characteristic
curves for this part can be seen in the 6N134 data sheet.
The 810280EC consists of a pair of inverting optically
coupled gates, each with a light emitting diode and a
unique high gain integrated photon detector in a hermetically sealed ceramic package. The output of the detector is
an open collector Schottky clamped transistor. Internal shields
provide a guaranteed common mode transient immunity
specification of 1000 VIliS.
This unique dual coupler design provides maximum DC and
AC circuit isolation between each input and output while
achieving TTL circuit compatibility. The isolator operational
parameters are guaranteed from -55° C to +125° C, such that
.................. 4.5 V dc minimum to
5.5 V dc maximum
High Level Input Currentl 1] •••.••• 12.5 mA dc minimum
(each channel)
Low Level Input Current ..•....... 250 IIA dc maximum
(each channel)
Normalized Fanout (TTL Load) ...........• 6 maximum
(each chan nel)
Operating Temperature Range ....... -55° C to +125° C
1. This condition permits all east 20 percent hF (CTRI degradation.
The initial switching threshold is 10 mA dc or less.
Absolute Maximum Ratings
Supply Voltage Range ......... 7 V (1 minute maximuml
Input Current (each channel) ................ 20 mA dc
Storage Temperature Range ......... -65°C to +150°C
Maximum Power Dissipation (both channels) .. 350 mW
Lead Temperature
(soldering 10 seconds) .......... 300°C for 10 seconds
(1.6 mm below seating plane)
Junction Temperature (TJI ..................... 175°C
'Defense Electronic Supply Center IDESC) is an agency of the Department of Defense 10001.
9-149
100% Screening
MIL-STD-883, METHOD 5004 (CLASS B DEVICES)
TestScl'$Wi
1. Precap Internal Visual
2. High Temperatvre Storage
Conditions
Meth
2017
1008
3. Temperature Cycling
4. Oonstant Acceleration
5, Fine Leak
6. Gross Leak
7. Interim Electrical Test
6. Bum-In
Oondltion O. TA'''' 150·C,
Time 24 hours minimum
Oondltion 0, -65°C to +150·0.10 cycles
Oonditlon A. 5KG's. Vi and V:a axis only
Oonditlon A
Condition C
Optional
Condition B, Time 160 hours minimum
TA=+125"C, Vcc "'5,5V, IF=2O mA,
10'" 25 mA (Figure 1)
Group A, Subgroup 1, 5% PDA applies
Group A. Subgroup 2, 3, 9
=
1010
2001
1014
1014
-
=
1015
-
9. Final Electrical Test
Electrical Test
10. External Visual
2009
Quality Conformance Inspection
GROUP p., ELECTRICAL PERFORMANCE CHARACTERISTICS
QUANTITY/ACCEPT NO. = 116/0
limits
Group A
SubgroupS£61 Min. Max.
Test
Symbol
Low Level Output Voltage
VOl.
Current Transfer RatiO
hf'{CTR)
Vo" 0,6 V; IF = 10 mA;!1l
Vec=5.5V
High Level Output Current
10H
Vcc = 5.5 V; Vo
Ip=250 /lA
High Level Supply Current
lecH
Vee = 5.5 V; 11'1 = 1F2"'OmA
1,2,3
leol
Vee = 5.5 V; 1Ft = 11'2'" 20 mA
1,2,3
VI'
11'=20 mAil)
Low Level Supply Current
Input Forward Voltage
Condhlons
0'" 5.5 V; IF'" 10 mAl1l;
=5.5 Vf11;
-
0.6
V
1,2.3
100
-
%
1,2,3
-
250
/LA dc
1,2
3
Input Reverse Breakdown
Voltage
tnputtoOvtput
Insulation Leakage
Current
Capacitance Between
Input/Output
i
VBR
• '11-0
IR=10pA!11
V10= 1500 V de121;
aUve Humidity 45 percent
5 seconds
=
Unit
1,2,3
*
mAdc
mAdc
~VdC
1,2.3
5.0
-
Vdc
1
-
1.0
/LAde
4.0
pF
Ct-o
f'" 1 MHz; To '" 25"CI3!
4
Propagation Delay Time,
Low to High Output Level
tPlH
Al"" 5100; OL '" 50 pFI1,4!;
IF=13mA
9
10.11
Propagation Delay Time,
High to LOW Output Level
WHL
RL =5100; CL =50 pFlt,5l;
IF'" 13 mA
10, 11
9
-
100
140
100
ns
ns
-
120
-
40
ns
-
Al = 510 ottl;
CL =050 pF;
IF'" 13 mA
9,10,11
ICMHI
VCM=50V (peak);Il.81
Vo '" 2 V (minimum);
Rl=5100;
IF=OmA
9,10.11
1000
-
VIpS
iCMLi
VCM" 50V (peak);!1. 8J
Vo = 0.8 V (maximum);
Rl",S10n;
IF"" 10 rnA
9.10,11
1000
-
V/ItS
Output Rise Time
ILH
Output Fall Time
tHL
Common Mode Transient
Immunity at High
Output Level
Common Mode Transient
Immunity at Low
Output Level
See notes on followmg page.
9-150
90
Notes: 1.
2.
3.
4.
5.
6.
7.
8.
Each channel.
Measured between pins 1 through 8 shorted together and pins 9 through 16 shorted together.
Measured between input pins 1 and 2, or 5 and 6 shorted together and output pins 10, 12, 14 and 15 shorted together.
ThetpLH propagation delay is measured from the6.5 mA point on the trailing edge oftheinput pulsetothe 1.5 V point on the trailing
edge of the output pulse.
ThetpHL propagation delay is measured from the6.5 mA point on the leading edge of the input pulse tothe 1.5 V point on the leading
edge of the output pulse.
Conditions of Group A subgroups may be seen in the High Reliability section of this catalog.
This is a momentary withstand test, not an operating condition.
The DESC drawing for this part guarantees a minimum CMH and CML of 40Vll's and -60Vll's respectively at VCM =
10 V (peak). HP's CMR testing exceeds these requirements.
GROUP B TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Ci'
Test
Subgroup 1
~')::':"':;
Physical Dimensions (Not,t$quired if
Group 0 is to be performed)
Subgroup 2
Resistance to Solvents
Subgroup 3
Solderability
(LTPD applies to number of leads
inspected - no fewer than 3 devices
shall be used).
Subgroup 4
Internal Visual and Mechanical
SubgroupS
Bond Strength
Thermocompression: '
(Performed at precap, prior to seal
LTPD applieS to number of bond).
Subgroup 6
Internal Water Vapor Content
(Not applicable - does not contain
deSiccant)
Method
'Condiii8ns
2016
2 Devices
(0 failures)
4 Devices
(0 failures)
2015
,
Solderi~~T~mperature of 245
2003
± 5° C
for 10 seconds
10
(3 Devices)
1 Device
(0 failures)
2014
Test Condition D
2011
-
15
-
Subgroup 7*
Electrical Test
Electrostatic Discharge Sensitivity
LTPO
Group A, and Delta Limits In
Accordance with Method 3015
3015
3(0) with repeat
for cumulative
effects 15(0)
Group A, and Delta Limits in
AccordqQce with. Method 30)5
Electrical Test
'(To be performed at initial qu"!!jfication only)
GROUP C TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test
Subgroup 1
Steady State Life Test
M'ethod
Condition B, Time = 1000 hours total
TA = +125° C, Vee = 5.5 V,
IF = 20 mA, 10 = 25 mA (Figure 1)
1005
LTPD
5
Group A, Subgroup 1, 2, 3
Endpoint Electricals at 1000 hours
Subgroup 2
Temperature Cycling
Conditions
Condition C, -65°C to +150°C,
10 cycles
1010
Constant Acceleration
2001
Condition A, 5KGs, Y1 and Y2 axis only
Fine Leak
1014
Condition A
Gross Leak
1014
Condition C
Visual Examination
1010
Per Visual Criteria of Method 1010
Group A, Subgroup 1,2,3
EndpointElectricals
9-151
15
GROUP D TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test
Conditions
Method
LTPD
Subgroup 1
Physical Dimensions
2016
Subgroup 2
lead Integrity
2004.
Test Condition B2 (lead fatigue)
15
Subgroup 3
Thermal Shock
1011
Condition 8, (-55· C to +125°C)
15 cycles min.
Condition C, (-65°C to +150·C)
100 cycles min.
15
Temperature Cycling
1010
Moisture Resistance
Fine leak
Gross leak
Visual Examination
Endpoint Electricals
1004
1014
1014
Subgroup 4
Mechanical Shock
15
Condition A
Condition C
Per Visual Criteria of Method 1004 & 1010
Group A, Subgroup 1,2,3
2002
Condition S, 1500G, t '" 0.5 ms,
5 blows in each orientation
Condition A
Condition A, 5KGs, Y, and Y2 axis only
Condition A
Condition C
Per Visual Criteria of Method 1010
Group A. Subgroup 1, 2, 3
15
1009
1014
1014
1009
Condition
Condition
Condition
Per Visual
15
1018
5000 ppm maximum
water content at 100 0 C.
2007
2001
1014
1014
1010
Vibration Variable Frequency
Constant Acceleration
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals
SubgroupS
Salt Atmosphere
Fine Leak
Gross Leak
Visual Examination
Subgroup 6
Internal Water Vapor
Content
Subgroup 7
Adhesion of Lead Finish
Subgroup 8
Lid Torque
(not applicable - solder seal}
A min.
A
C
Criteria of Method 1009
202~
15
2024
5 Devices
10 failures)
Vee
Voe
+5.5 V
+5.5 V
200n
I
c--- 2
200n
-
3
4
S
>--- 6
-7
- a
VIN
5.3 V
3 Devices
(0 failures)
5 Devices
(1 failure)
161lfir--
200
n
14
131-
200n
12
111101--91-
.Ol~F
-
.;-J-
TA = +125"C
J:.
-=
Figure 1. Operating Circuit for Burn-in and Steady State Life Tests.
9-152
DUAL C
L
LINE RECEIVER
LETT
HE~f\ltETIC
ARC
SCHEMATIC
:~~1
1F1
OUTLINE DRAWING
DATE. CODE
I h SUFFix ~eTTER!
~~~~~~~~~
~----:-:15:-2.0 VI·
10. CM L is the maximum, tolerable rate of fall of the common mode
voltage to assure that the output will remain in a low logic state (i.e.
VOUT MONITORING
NODE
'taut
o
z
!2
1\ /
;>
tiHL
\1 ...........
'f"
....~
....."
40
0
~,
~::~~
0
Vel,..""ov
~:UT
t"7~-
0
Il'
0
-55
'CL INCLUDES PROBE AND STRAY WIRING CAPACITANCE -:
--3.0V
-
-25
35
95
65
-.i------\---UN
:....i 'EHL I-
'25
Figure 6. Enable Propagation Delay vs. Temperature
-.I 'ELH to-
i------Y-=
OUTPUT
Vo
T A- TEMPERATURE-·C
Figure 7. Test Circuit for tEHL and tELH'
Vee .Js.ov
lU-I"10mA
11I,,"'OmA
a,ov
VOH ..
VD\.""o.aV
RL "SlOO:
TA;W:ZWC
/" "M, AN\) eM"
0
0
~----~·~Il~-~.----i
'<
200
PULSE GEN.
r-"'\----5OV
400
600
800
.'CMH
1000
VCM- COMMON MODE TRANSIENT AMPLITUDE - V
Vo
f\-
O.SV----J·
Figure 8. 1\tplcal Common Mode Transient Immunity
r--
VCM O V - - '
'-------' .
SWITCH AT A: II" 0
5V~'
Vo
.
- - - - - V o (min.)
SWITCH AT B: I, -,OmA
.
--Volmax.)
CMl
Figure 9. Test Circuit for Common Mode Transient Immunity and
1\tplcal Waveforms
9-156
PART NUMBERING SYSTEM
'Commercial Rr~duct
HCP,L-1930
MIL-STD-883 CLASS B TEST PROGRAM
Glass B Product
·'····1
li,:l;lCPL-1931
,,:
Hewlett-Packard's 883B Optocouplers are in compliance
with Mll-STD-883, Revision C. Deviations listed below are
specifically allowed in DESC drawing 81028 for an H.P.
Optocoupler from the same generic family using the same
manufacturing process, design rules and elements of the
same microcircuit group.
1
1
Vee
+5.5V
VOUT
+2.6 V
loon
1
~2
15-
-3
100n
Testing consists of 100% screening to Method 5004 and
quality conformance inspection to 'Method 5005 of MllSTD-883. Details of this test program may be found in the
High Reliability section of the Optoelectronics Designer's
Catalog.
10-
"
-"
13
5
12
200n
HCPl-1931 Clarifications:
200n
~6
-7
+5.0 v +
-8
VI~
+t-
J-
I. 100% screening per Mll-STD-883, Method 5004 constant
acceleration - Condition A not E.
11
O.01.u F
-
10-
9T A'" +125°C
CONDITIONS: 11=30mA
-=-
10= 10 rnA
Vee'" 5.5 V
Figure 10. Burn In Circuit
Il. Quality Conformance Inspection per M I l-STD-883,
Method 5005, Group A, B, C, and D.
Group A - See table on next page for specific electrical
tests.
Group B - No change.
Group C - Constant Acceleration - Condition A not E.
Group D - Constant Acceleration - Condition A not E.
GROUPA
QUANTITY/ACCEPT NO. = 116/0
Subgroup 1
'Static tests at T A = 25° C -
IOH, VOL, VI, leCH, ICCL' IEL, VEH, VEL, VR, 11-0
SUbgroup 2
'Static tests at T A = +12S'C Subgroup 3
'Static tests at TA = -55°C -
10H, VOL, V,. ICCH' ICCl' tEL, VEH, VEL, VR
10H' VOL, V" leCH, ICCl' IEL, VEH, VEL, VR
Subgroup 4, 5, 6, 7, 8A & 88 - These subgroups are non-applicable to this device type.
Subgroup 9
'Switching tests at T A = 25° C - tplH, tpHl, CMH and CMl
Subgroup 10
Switching tests at TA = +125° C
Mal(,
Units
tpLH
140
ns
II = 13mAdc. RL = 510il, CL = 50pF
tpHL
120
ns
II
Symbol
Test Conditions
= 13mAdc. Rl = S1011,
CL
= 50pF
= 13mAdc, RL = 5100, C l
= 50pF
Subgroup 11
Switching tests at T A = -55'C
Symbol
Max.
Units
tpLH
140
ns
Test Conditions
II
tpHL
120
ns
I,
13mAdc, RL = 51 on, CL = 50pF
'Limits and conditions per Electrical Characteristics Table.
9-157
Application Circuits*
~~~~--~--~~-------o+5V
);Hf-"'---+--~,---+--------o VOUT1
l.>!Il-'-'---+----II----+--------o VOUT2
TYPICAL INCREMENTAL DELAY TIMES'"
R
I.
R
lpHl
I tpLH
¢:o~
C
~OPEN
<1 I 1$0 I 300
42
21
121
31112112911
1'1 =33(l, C = OPEN 1'1=330, C =39OpF UNITS
m
<1 1150 I 3DO
<1 I 150 I 3DO
37
28
146 nsec
43 I 47 I 171
0$00
26111146
31 1 31 1 71
PROPAGATION DELAY TIMES SHOWN EXCLUDE DRIVER AND LINE DELAYS.
Figure AI Polarity Non-Reversing.
...-__:.;H;;:CP.:L;;;.1:,;:9;;:30;;;/3::;1:......--.'6
~1~5__~__~~__~__________--o+5V
560n
Your
VOUT
-=
TYPICAL INCREMENTAL DELAY TIMES"
II'
----wiTH
WITHOUT
SCHOTTKY DIODES SCHOTTKY 010
<1
<1
150
150
300
78
112
455
820
365
$4
52
410
130
305
410
54
52
490
395
SWITCH SWITCH UNITS
A
B
m
OPEN OPEN nsec
OPEN CLOSED rtsec
CLOSED CLOSED nooo
PROPAGATION DELAY TIMES SHOWN EXCLUDE DRIVER AND LINE DELAYS
USING 1/3 74LSQ4 INVERTERS AND 74LSOO QUAD NAND
Figure A2 Polarity Reversing, Split Phase.
NAND flip flop tolerates
simultaneously HIGH
inputs; NOR flip flop
tolerates simultaneously
LOW inputs; EXCLUSIVE-
r
I
~~~~~r-"..
I
I
~~
~-.~~
OR flip flop tolerates
simultaneously HIGH OR
LOW inputs without
causing either of the
outputs to change.
EXCLUSIVE-OR FLIP FLOP
Figure A3 Flip Flop Configurations.
*FOR A DESCRIPTION OF THESE CIRCUITS
SEE HCPL-2602 DATA SHEET.
**THE INCREMENTAL DELAY TIMES ARE THE TIME DIFFERENCES BETWEEN THE TIME AT WHICH
THE OUTPUT VOLTAGE CROSSES THE 1.5-V LEVEL AND THE TIME AT WHICH THE VOLTAGE
WAVEFORM CROSSES 50% ON A RESISTIVE TERMINATION OF THE TRANSMISSION LINE.
9-158
Flidl
,HERMETICALLY SEALED
FOUR CHANNEL
LOW INPUT CURRENT
OPTOCOUPLER
HEWLETT
Ita!~ PACKARD
Schematic
*--: ; *I"
15
I
:V;~
.--l-I
I
I
I
I"
~
DATE COD€=:J.
Vee
,.
I
V"
?
13
I·
1F3
I
12
VOJ
1F4
I
--j
I
V
a;
.....J...I
I
I
~
11
NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
•
PERFORMANCE GUARANTEED OVER -55 0 C TO
+125 0 C AMBIENT TEMPERATURE RANGE
•
MIL-STD-883 CLASS B TESTING
•
HIGH DENSITY PACKAGING
•
NEW-INTERNAL SHIELD FOR HIGHER CMR
•
HERMETICALLY SEALED
•
LOW INPUT CURRENT REQUIREMENT: 0.5 rnA
•
HIGH CURRENT TRANSFER RATIO: 1500% TYPICAL
•
LOW OUTPUT SATURATION VOLTAGE: 0.1 V
TYPICAL
•
LOW POWER CONSUMPTION
• 1500 Vdc WITHSTAND TEST VOLTAGE
•
HIGH RADIATION IMMUNITY
•
HCPL-2730/2731 FUNCTION COMPATIBILITY
Applications
MILITARY/HIGH RELIABILITY SYSTEMS
ISOLATED INPUT LINE RECEIVER
SYSTEM TEST EQUIPMENT ISOLATION
•
DIGITAL LOGIC GROUND ISOLATION
•
EIA RS-232C LINE RECEIVER
•
MICROPROCESSOR SYSTEM INTERFACE
•
CURRENT LOOP RECEIVER
•
LEVEL SHIFTING
•
PROCESS CONTROL INPUT/OUTPUT ISOLATION
*JEDEC Registered Data
I
I-?. 2.0VI.
..
11. CM L is the maximum tolerable common mode transient to assure that the
output will remain in a low logic. state (i.~; Va. < 0.8VI.
12. In applications where dV/dt may exceed 50,000 VllJs (such as a static
discharge) a series reSistor, Ace, should .. be included to protect the
detector IC's from destructively high surge currents. The recommended
value is ACC'" 0.6
1:~mA)
kU.
13,. This is a momentary withstand t!lsl, not an operating conditior:l.,
9-160
10000
1000
.s<'
~
'00
~
'0
""
~
«
'.0
1i:
~
O.
...
I
0.0
12
§
~
g---
~
L#
~
~
a
,/
1.20
1.30
TA, "'25"C
f/
-'.o~-
,;, i-"'"
~
"
0
~
:::;
I.k""
It- ~
«
~
0
IV
Z
I
y
E
1.40
.-
/j;<,,~
I~ p.....,.~
"
/
--'"1
H'
,,,,,
s~
1/ ~o"" . - ......
!J v.::
~
/'
'~
Vee "6V
11
'0
~
/.
'~
0.00
1.10
~
TA "'" 25"C
1,
o 'V
o
1.50
0.8
NORMALIZED TO.
1o AT IF'" 0.5 rnA,
Vo"'OAV
IF ""O.5mA
I
1.2
2.0
1.6
Vo - OUTPUT VOLTAGE -
Figure 1. Input Diode Forward Current vs.
Forward Voltage.
t
'-I -
,\.Oltlf'-
I
0.4
VF - FORWARD VOLTAGE IV)
.-I-
?
-......,..-
--
-
I-'"
i-"'"
2.0"'~
v
IF - INPUT DIODE FORWARD CURRENT (rnA)
Figure 3. Normalized Current Transfer
Ratio vs. Input Diode Forward
Current.
Figure 2. Normalized DC Transfer
Characteristics
'00 , - - - - . , . - - - - - , - - - - - ,
60
1\1:-,--
50
I
...
/""
-- ----------
_-_ .....
................... --_ ........ --... -...
~
o
z
o
40
~
0
~,
20
!>
0
";;<
'\
,LL,UL.LL
If" L6mA. RL "L5 kE
If <+ZOrnA,RL "680H
r'>.
......
..... ;-....
tpHL
tpUi
/"
-_ .....- . -.-
tPHI
tPt."H
... "Il>HL
_r!!> flI';.;
0
20
T - INPUT PULSE PERIOD (ms)
IF - INPUT DIODE FORWARD CURRENT (rnA)
Figure 4. Normalized Supply Cl,lrrent vs.
Input Diode Forward Current.
eo
-60 -40 -20 0 20 40 60
TA - TEMPERATURE (OC)
Figure 5. Propagation Delay to Logic Low
vs. Input Pulse Period.
"
~ tPHL
100 120
Figure 6. Propagation Delay vs.
Temperature
..--..,..--
---~
vo-.,.- ~'1.5V
tPHLj~
PULSE
GEN.
---VOL
"---1
¥!---5V ===Vo
~: ;~,(l =~-'-"::.
.,;v
t"' 100Hz
tp-=SO/.lt
IF MONITO~
o
1.5V
10
12
IF - INPUT DIODE FORWARD CURRENT {mAl
-- -
VOL
t pLH -
-
Figure 7. Propagation Delay vs. Input Diode
Forward Current.
Figure 8. Switching Test Circuit.'
(f, tp not JEDEC registered)
VOM
2.4- VF
"'>-,,-
Vo ----.. .;;.,;;;..;;o"'--------5V
.
R,
0;;
VCC-VF-IFR2
IF
SWITCH AT A: IF= OmA
+ ILEAK
r------,
I
,
,
Vo -----------~VOL
SWITCH AT B: IF'" 1.6mA
I
I
R2 MAY BE OMITTED IF ____ I
I
ADDITIONAL FANOUT
I
I
IS NOT USED.
L _____ .J
**See Note 12.
Figure 9. Test Circuit for Transient Immunity and Typical Waveforms.
*JEDEC Registered Data
I
9-161
Figure 10. Recommended Drive Circuitry
Using TTL LogiC.
MiL-STD-883 CLASSB TEST PROGRAM
Group C - Constant Acceleration - Condition A not E.
Group D - Constant Acceleration - Condition A not E.
Hewlett Packard's 883B Optocouplers are in compliance
with MIL-STD-883, Revision C. Deviations li,sted below are
specifically allowed in DESC drawing 83024 for an H.P.
Optocoupler from the sarrie generic family using the same
manufacturing. process, design rules and elements of the
same microcircuit group.
PART NUMBERING SYSTEM
I
Commercial Product
I
Class B Product
6N140A
I
6N140Al883B
I
Testing consists of 100% screening to Method 5004 and
quality conformance inspection to Method 5005 of MILSTD-883. Details of these test programs may be found in
Hewlett-Packard's Optoelectronics Designer's Catalog.
200n
1
r- 2
P----
6N,140A/883B Clarifications:
I. 100% screening per MI L-STD-883, Method 5004 constant
acceleration - condition A not E.
II. Quality' Conformance Inspection per MIL-STD-883,
Method 5005, GroupA,B,C and D.
Group A.,.- See table below for specific electrical tests,
Group B - No change
GROUP A -
ELECTRICAL TESTS
Vcc+ 18V
TYP.
s
V,N
2.3 V
-=
3
4
~6
+f
~1
8
CONDITIONS:
16
IS
14
13
12
8
"
10q
9'-
Subgroup 2
'Static tests at TA = +1250 C -IOH, IOHX. !ceL, lOCH. CTR
Min.
VF
BVR
Max.
Units
1.7
V
IF=1.6mA
V
IR""10p.A
5
Test Conditions
Subgroup 3
'Static tests at TA = -550 C - IOH. IOH)(, Icct... lecH. CTA
Symbol
Min.
VF
BVA
Max.
Units
1.8
V
IF=1.6 mA
V
IR"" 10 pA
5
Test Conditions
Subgroup 4, 5, 6, 7, SA and 8B
These subgroups are not applicable to this device type.
Subgroup 9
'Switching tests at TA ""2SQ C -If>J..Hl, tpHL1' tpt..H2, tpHt..2. CMH and CML
Subgroup 10
Switching tests at TA = +l25°C
F
Max.
Units
tpLHl
60
p's
IF"" 0.5 rnA, Rt.. = 4.7 kfl
tpt..H2
30
pS
IF = 5 mA, RL = 680
4:>Ht..l
100
pS
IF = 0.5 mA, RL "" 4.7 kfl
Vee = 5.Q V
tpHt..2
10
pS
IF=5 rnA, AL =6800
Vee = 5,Q V
Symbol
Test Conditions
n
Voc=5.0V
Vcc = S.O V
Subgroup 11
Switching tests at TA = -55°C
SVmbol
Max.
-
Units
TYP.
TA "+125 C
Figure 11. Operating Circuit for Burn-In
and Steady State Life Tests.
Subgroup 1
'Static tests at TA = 25°C -IOH, IOH)(, ICCl> ICCH • CTR, VF. BVR and 11-0
Symbol
Voc,+2AV
200n
If =5·~A
10 = 10mA
Vee = 1SV
QUANTITY/ACCEPT NO. = 116/0
Test Conditions
tpt..Hl
60
I'S
IF "" 0.5 mA, RL = 4.7 lUI
Vee=5.0V
tpLH2
30
I'S
IF" 5 rnA, RL =6800
Vcc
tpHl:.l
100
I'S
IF ... 0.5 mA, RL = 4.7 kO
VeC= 5.0 V
tPHt..2
10
p$
IF == 5 rnA, RL = 680 n
Vcc = 5.0 V
• Limit~ .a(ld COl)ditions per T .able II.
9-162
=5.0 V
I
J
D
---~---.-"---~
~.7iiJI HE;¥V LETT
~~ PA"€KARO
QI;~C
15
SCHEMATIC
~
--------
...
FOUR CHANNEL
;.HERMETICALLV seA'EeD
OPTOCOUPLER
.•......
20
,VF~.
------
8302401EC
APPROVED
OUTLINE DRAWING
Vee
(-. SUFFIX
,.
LETTEA~
~
V01
U.
"8.131.3201
30
5
60
70
U,S,A.
8302401EC
I"
;lb--.::r~~r-=
~
13
VOl
~
12
Vo,
~
11
MAX
_
PIN llD€NT1FIER
1F3
:F~
1F4
sV;
V04
10
DIMENSIONS IN MllLlMETERSAND fINCH€SL
GND
Features
Applications
o NEW-MANUFACTURED AND TESTED ON A
MIL-STD-1772 CERTIFIED LINE
o
•
•
o
•
o
o
o
o
•
o
o
o
o
o
o
o
o
o
•
•
RECOGNIZED BY DESC·
HERMETICALLY SEALED
MIL-STD-883 CLASS B TESTING
HIGH DENSITY PACKAGING
NEW-INTERNAL SHIELD FOR HIGHER CMR
PERFORMANCE GUARANTEED OVER -55 0 C
TO +125°C AMBIENT TEMPERATURE RANGE
1500 V de WITHSTAND TEST VOLTAGE
LOW INPUT CURRENT REQUIREMENT: 0.5 rnA
HIGH CURRENT TRANSFER RATIO: 1500%
TYPICAL
LOW OUTPUT SATURATION VOLTAGE: 0.1 V
TYPICAL
LOW POWER CONSUMPTION
HIGH RADIATION IMMUNITY
MILITARY/HIGH RELIABILITY SYSTEMS
ISOLATED INPUT LINE RECEIVER
SYSTEM TEST EQUIPMENT ISOLATION
DIGITAL LOGIC GROUND ISOLATION
EIA RS-232C LINE RECEIVER
MICROPROCESSOR SYSTEM INTERFACE
CURRENT LOOP RECEIVER
LEVEL SHIFTING
PROCESS CONTROL INPUT/OUTPUT
ISOLATION
Description
The 8302401 EC is the DESC selected item drawing assigned
by DOD forthe 6N140A optocoupler which is in accordance
with MIL-STD-883 class B testing. Operating characteristic
curves for this part can be seen in the 6N140A data sheet
This hybrid microcircuit is capable of operation over the full
military temperature range from -55 0 C to +125 0 C.
The 8302401 EC contains four GaAsP light emitting diodes,
each of which is optically coupled to a corresponding
integrated high gain photon detector. The high gain output
stage features an open collector output providing both lower
output saturation voltage and higher speed operation than
possible with conventional photo-darlington type optocouplers. Also, the separate Vee pin can be strobed low as an
output disable or operated with supply voltages as low as
2.0V without adversely affecting the parametric performance.
(Continued on next page)
• Defense Electronic Supply Center IDESC) is an agency of the Department of Defense IDOD).
9-163
Absolute Maximum Ratings
The high current transfer ratio at very low input currents
permits circuit designs in which adequate margin can be
.allowed for the effects of CTR degradation over time.
Storage Temperature Range ....... :.. -65° C to +150° C
Operating Temperature .........•.... -55° C to +125° C
Lead Solder Temperature ......•....•.. 260°C for 10 s.
(1.6mm below seati ng plane)
Output Current,l o (each channell ....•.......... 40 mA
Output Voltage, Va (each channell .' . . . . .. -0.5 to 20 Vl11
Supply Voltage, Vee ,................... -0.5 to 20 Vl11
Output Power Dissipation (each channell ...... 50 mWl21
Peak Input Current (each channel,
~ 1 ms duration) .............................. 20 mA
Average Input Current, IF (each channell ....... 10 mAI 3 1
Reverse Input Voltage, V R (each channell ............ 5V
rhe 8302401 EC has a 300% minimum CTR at an input
current of only 0.5mA making it ideal for use in low input
current applications such as MOS, CMOS and low power
logic in'terfacing or RS-232C data transmission systems.
Compatibility with high voltage CMOS logic systems is
assured by the 18V Vee and by the guaranteed maximum
output leakage (JOH) at 18V. The shallow depth of the IC
photodiode provides better radiation immunity than
conventional phototransistor couplers.
The test program' performed on the 8302401 EC IS In
compliance with DESC drawing 83024 and the provisions of
method 5008, Class B of MIL-STD-883.
Recommended operating
Conditions
Mal(.
Units
2
p.A
0.5
5
mA
2.0
18
V
Symbol Min.
Input Current, Low Level
(Each Channel)
IFL
Input Current. High Level
(Each Channell
IFH
Supply Voltage
Vee
100% Screening
MIL-STD-883, METHOD 5004 (CLASS B DEVICES)
Test Screen
Method
Conditions
1. Precap Infernal Visual
2017
2. High Temperature Storage
1008
Condition C, TA '" 150· C,
Time;: 24 hours minimum
3. Temperature Cycling
1010
Condition C, -65"C to +150·C, 10 cycles
4. Constant Acceleration
2001
Condition A, 5KG's, Y1 and Y2 axis only
5. Fine Leak
1014
Condition A
6. Gross Leak
1014
Condition C
7. Interim Electrical Test
8. Burn-In
9. Final Electrical Test
1015
-
Electrical Test
10, External Visual
2009
9-164
Optional
Condition S, Time = 160 hours minimum
TA"'+125·C, Vee = 18V, IF= 5 mA,
10" 10 mA (Figure 1)
Group A, Subgroup 1, 5% PDA applies
Group A, Subgroup 2, 3, 9
Quality Conformance Inspection
GROUP A ELECTRICAL PERFORMANCE CHARACTERISTICS
QUANTITY/ACCEPT NO. = 116/0
Parameter
Symbol
GYOupA
Subgroups
Test Conditions
Uffil\s
Min.
Max.
Ip=O.SmA, \(q¥0:1)(, Vcc",4.5Vc Ai. 1,2, 3
300
I F:;'i.6mA, \!8bo:4V;Ycc=4ISV
1,2.3
300
IF=SmA, Vo=O.4V, Vcc=4;$V
1,2,3
200
IF=0.5rl1A 10l=1 ,SmA,Vcc=4.5V
1,2,3
0.4
Val
'T~b5mA, lOl=10mA,.Vcc=4.5V
1,2,3
lOH
Ip=2/1A
10HX
logic Low Supply Current
logic High Supply Current
Current
logic low Output Voltage
logic High Output Current
Input Forward Voltage
·• •·• •· .·c.•.•.•.•.
Unit
O/,~
Note
,0
4,5
0/0
4,"S:
0/0
4,5
V
4
0.4
V
4
1,2,3
250
/1A
4
Vo=Vcc=18V
1,2,3
250
/1A
4,6
ICCl
IF1=IF2=I FTIF4=1.6mA
Vcc=lBV
1,2,3
4
mA
ICCH
IF1'=IFFI F3=IF4=OmA
Vcc=lBV
1,2,3
40
/1 A
1\'2
1.7
V
4
3
1.8
V
4
V
4
hF IcTAl
VF
Ip=L6mA
Input Reverse Breakdown
Voltage
BVR
IR=10/1A
Input-Output Insulation
Leakage Current
11-0
45% Relative Humidity, T=25°C,
1=5s., VI . o=1S00 Vdc
1
1.0
/1A
7, 12
Capacitance Between
Input-Output
C'_O
f=lMHz, Tc=25°C
4
4
pF
4,8
9,10,11
60
/15
Propagation Delay Time
To logic High At Output
tpLH
9
20
/15
1,2,3
I p=O.SmA,RL=4.7kfl, Vcc=5.0V
I F=5mA, RL=680n, Vcc""5.0V
IF=0.5mA,RL=4.7kn, Vcc=5.0V
Propagation Delay Time
To logic Low At Output
Common Mode Transient
Immunity At Logic High
Level Output
Common Mode Transient
Immunity At Logic Low
Level Output
tPHL
1p=5mA, RL=680n, Vcc=5.0V
5
10, 11
30
/15
g, 10, 11
100
ps
9
5
ps
10,11
10
"'s
ICMHI
'p=0, RL=1.5k!l
jVc MI=25Vp_p , Vcc=S.OV
9,10,11
500
Vips
ICMLI
1p=1.6mA, RL=l.5kfl
jVcMI=25Vp_p, Vcc=5.0V
9,10,11
SOO
Vips 10, 11
NOTES: 1. Pin 10 should be the most negative VOltage at the
detector side. Keeping Vcc as low as possible, but
greater than 2.0 volts, will provide lowest totalloH over
temperature.
2. Output power is collector output power plus one
fourth of total supply power. Derate at 1.66mWfO C
above 110' C.
3. Derate IF at 0.33mAl'C above 110'C.
4. Each channel
5. CURRENT TRANSFER RATIO is defined as the ratio
of output collector current, 10 , to the forward LED
input current, IF, times 100%.
6. 10HX is the leakage current resulting from channel to
channel optical crosstalk. IF = 2MA for channel under
test. For all other channels, IF = 10mA.
7. Device considered a two-terminal device: Pins 1
through 8 are shorted together and pins 9 through 16
are shorted together.
9-165
9.11
8. Measured between the LED anode and cathode shorted
together and pins 10 through 15 shorted together.
9. CM H is the maximum tolerable common mode transient
to assure that the output will remain in a high logic state
Ii.e. Va> 2.0V).
10. CM L is the maximum tolerable common mode transient
to assure that the output will remain in a low logic state
Ii.e. Vo < 0.8VI.
11. In applications where dVldt may exceed 50,000 V/MS
Isuch as a static discharge) a series resistor, Rce , should
be included to protect the detector IC's from destructively
high surge currents. The recommended value is
Rec
=
1V
0.6 IF ImA) kfl.
12. This is a momentary withstand test, not an operating
condition.
GROUP B TESTING MIL~STD-883, METHOD 5005 (CLASS B DEVICES)
Method
Teat
Subgroup 1
Physical Dimensions (Not required if
Group 0 is to be performed)
SUbgroup 2
Resistance to Solvents
Subgroup 3
Solderablfity
il.TPD applles to number of lead$
Inspected - no fewer than 3 devices
shall be used),
Subgroup 4
Internal Visual and Mechanical
SubgroupS
Bond Strength
Thermocompresslon:
(Performed at precap, prior to $9al
LTPO applies to number of bond).
Subgroup 6
Internal Water Vapor Content
(Not applicable - does not contain
desiccant)
2016
2 Devioes
(no failures)
2015
4 Devices
(no faUures)
Soldering Temperature of 245 ± 5· C
for 10 $9conds
2003
2014
(3
10
Devices)
1 Device
(no failures)
Test Condition 0
2011
15
-
-
Subgroup 7*
Electrical Test
Electrostatic Discharge Sensitivity
LTPD
Conditions
Group A, and Delta Limits In
Accordance with Method 3016
3015
Group A, and Delta Limits in
Accordance with Method 3015
Electrical Test
"(To be performed at IniUal qualification only)
3(0) with repeat
for cumulative
effects 15(0}
GROUP C TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Test
Subgroup 1
Steady State Life Test
Method
Condition S, Time .. 1000 hours total
TA ,.. +125"C. Vee = 18 V.
IF'" 5 mA, 10"" 10 mA (Figure 1)
1005
LTPD
5
Group A, Subgroup 1, 2, 3
Endpoint Electrlcals at 1000 hours
Subgroup 2
. Temperature Cycling
Conditions
Condition C, -65 0 C to +150· C,
10 cycles
1010
Constant Acceleration
2001
Condition A, SKG's, V1 and V2 axis only
Fine Leak
1014
ConditlonA
Gross Leak
1014
Condition C
Visual Examination
1010
Per Visual Criteria of Method 1010
Group A. Subgroup 1, 2.3
Endpoint Electricals
9-166
15
GROUP D TESTING MIL-STD-883, METHOD 5005 (CLASS B DEVICES)
Mlithod
Test
~onditlons
LTPD
Subgroup 1
2016
Physical Dimensions
15
Subgroup 2
2004
Test Condition B2 !lead faJigue}
15
Thermal Shock
1011
15
Temperature Cycling
1010
Condition B, (-55°C to +125° C)
15 cycles min.
Condition C, (-659C to +150·C)
100 cycles min.
Moisture Resistance
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals
1004
1014
1014
Lead Integrity
Subgroup 3
11
it
~
Condition A
Con71ition C
PerVistTa''briteria of Method 1004,1010
Group A, Subgroup 1, 2, 3
Subgroup 4
Condition B, 1~t&OG. t = 0.5 ms,
5 blows eac ) orientation
Condition A
Condition A,5KG's'Y1 and Y2 axis only
Condition A
Condition C
Per Visual Criteria of Method 1010
Group A. Subgroup 1, 2, 3
15
1009
1014
1014
1009
Condition
Condition
Condition
Per Visual
15
1018
5,000 ppm Maximum
Water content at 100· C
Mechanical Shock
2002
Vibration Variable Frequency
Constant Acceleration
Fine Leak
Gross Leak
Visual Examination
Endpoint Electricals
2007
2001
1014
1014
1010
in
SubgroupS
Salt Atmosphere
Fine Leak
Gross Leak
Visual Examination
A min.
A
C
Criteria of Method 1009
SUbgroupS
Internal Water Vapor
Content
3 Devices
(0 failures)
5 Devices
<1 failurel
Subgroup 7
Adhesion of Lead Finish
2025
15
2024
5 Devices
(0 failures)
SubgroupS
Lid Torque
(not applicable-solder seal)
200n
TYP.
-=
V,N
2.3 V
+f
1
-2
0--- 3
4
0--0---
5
6
7
8
;J+18V
16200n
16
TYP.
14
13
12
11
10=-1.
9-
Voe +2.4V
TA "+125°C
Figure 1. Operating Circuit for Burn-In and Steady State-Life Tests.
9-167
---
--
-
-_._-----------
--
Applications
•
•
Application Bulletins, Notes, Handbooks, and
Manual Listing .
Abstracts
Applications
Because technology is growing and changing so rapidly,
HP's commitment to customers includes an extensive
applications department. In an effort to anticipate
design needs and answer design questions, this team of
engineers has published a complete library of
applications literature. This literature is available, free
of charge, through HP sales and service offices,
authorized distributors, and direct from the factory.
Also available for $12 each are application handbooks
which contain complete application notes bound
together with additional product information, allowing
you to keep the design information you need from
year-to-year.
These handbooks are available through your local
authorized distributor. A listing of these distributors
can be found in the appendix.
This section contains a listing of all available application
bulletins, application notes, technical briefs, and
designer guides.
10-2
~~~~~---~~-----
-~~-
---------
_
..
- - - - - - - - - _.. - . _ - - _ .
Applications . ··Listing
MOTION SENSING AND CONTROL
Model
Pub. No. (Date)
AN-951-1
5953-7794 (10/82)
AN~951-2
Description
AN-1011
5953-9393 (12/83)
Design and Operational Considerations
for the HEDS-5000 Incremental Shaft
Encoder
.
AN~1025 .
5954-0920 (9/85)
Applications and Circuit Design for the
HEDS-7500 series Digital Potentiometer
. AN-1032
5954-0932' (4/86)
Design of the HCTL-1000's Digital Filter
Parameters by the Combination Method
AB-59
5953-9365 (7/83)
AB-61
5953-9361 (8/83)
Linear Applications of Optocouplers
5963-7730 (4/82)
BAR CODE COMPONENTS
Model
Pub. No. (Date)
Applications for Low Input Current,
High Gain Optocouplers
Description
HP 16800A/16801A Bar Code Reader
Configuration Guide for a DEC VT-100 or
Lear Siegler ADM-31 to a DEC PDP-11
Computer
AN-1002
5953-7799(10/82)
Consideration of CTR Variations in
Optically Coupled Isolator Circuit
Designs
AN"1004
5953-0406 (11/79)
Threshold Sensing for Industrial Control
Systems with the HCPL-3700 Interface
Optocoupler
..
AN-1018
5953-9359 (8/83)
Designing with HCPL-4100 and
HCPL-4200 20·mA Optocouplers
AN-1023
5954-1003 (3/85)
Radiation'lmmunity of HP Optocouplers
AN-1024
5954-1006 (3/85)
Ring Detection_with the
HCPL-3700 Optocoupler
FIBER OPTICS
HP 16800A/16801A Bar Code Reader
Configuration Guide for an IBM
3276/3278 Terminal
Model
Pub. No. (Date)
Description
AB-65
5953-9370 (9/83)
Using 50/125 I'm Optic;al Fiber.with
Hewlett-Packard Components
AB-71
5954-1021 (12/85)
Using 200 I'm PCS Optical'
Fiber with HP Components
AB-73
5954-8415 (6/87)
LOW-Cost Fiber Optic Transmitter and
Receiver Interface Circuits
AN-915
5953-0431 (4/80)
Threshold Detection of Visible and
Infrared Radiation-with PIN Photodiodes
AN-1022
'5954-0979 (1/85)
High Speed Fiber Optic Link Design with
Discrete Components
TB-101
5954-1004 (4/85)
Fiber Optic SMA Connector Technology
AB-62
5953-9362 (8/83)
HP 16800A/16801A Bar Code Reader
Configuration Guide for an IBM 4955F
Series 1 Process Control CPU/Protocol
Converter and an IBM 3101 Terminal
AB-63
5953-9363 (8/83)
HP 16800A/16801A Bar Code Reader
Configuration Guide for an IBM 5101
Personal Computer
AB-68
5953-9382 (11/83)
HP 16800Al16801A Bar Code Reader
Configuration Guide for a MICOM
Micr0280 Message Concentrator
AB-75
5954-2170 (12/86)
ESD Control in Portable Bar Code
Readers
AB-77
5954-2176 (9/87)
Interfacing the HP SmartWand
TB-102
5954-1011(5/85)
Fiber/Cable Selection for LED Based
LoCal Communications Systems
AB-1008
5953-0460 (1 /81 )
Optical Sensing with the HEDS-1000
TB-104
5954-1025 (12/85)
Baseband Video Transmission with Low
CosfFiber Optic Components
AN-1013
5953-9387 (11/83)
Elements of a Bar Code System
,TB-1Q5
5954-8436 (6/87)
STConnector/Cable Guide
LIGHT BARS·,ANDBAR GRAPH ARRAYS
OPTOCOUPLERS
Model
Pub. No. (Date)
Model
Pub. No. (Date)
Description
TB-103
5954-1017 (7/85)
High Speed Optocouplers vs. Pulse
Transformer
AB-60
5953-9347(4/83)
Applications Circuits for
HCPL-3700 and HCPL-2601
Description
AN-1007
5953-0452 ('1/81)
Bar Graph Array Applications.
AN-1012
5953-0478 (2/81)
Methods of Legend Fabrication
SOLID STATE LAMPS
AB-69
5953-9384 (10/83)
CMOS Circuit Design using HewlettPackard Optocouplers
AN-939
5953-9368 (10/73)
High Speed Optocouplers
Model
Pub. No. (Date)
AN-947
5953-7759 (6/82)
Digital Data Transmission Using Optically
Coupled Isolators
AB-1
5952-8378 (1/75)
AN-948
5953-7716 (12/81)
Performance of the 6N135, 6N136 and
6N137 Optocouplers in Short to Moderate
Length Digital Data Transmission
Systems
Construction and Performance of High
Efficiency Red, Yellow and Green
LED Materials
AB-74
5954-8402 (11/86)
Auto-I nsertion of Option 002 Tape and
Reel LED Lamps
10-.3
Description
INK-JET COMPONENTS
SOLID STATE LAMPS (Cont.)
Model
Pub. No. (Date)
AN-945
5952-0420 (10/73)
AN-l005
5953-0419 (3/80)
AN-l017
5953-7784 (10/82)
AN-l019
5954-0921 (1/86)
AN-l021
5953-0861 (5/84)
AN-l027
Model
Pub. No. (Date)
Description
Designer's Guide
5954-8535 (11/86)
Photometry of Red LEOs
Operational Considerations for LED
Lamps and Display Devices
Model
Pub. No. (Date)
Using the HLMP-47001-1700/~7000 Series
Low Current Lamp
Utilizing LED Lamps Packaged on Tape
and Reel
Soldering LED Components
Surface Mount Subminiature LED Lamps
5954-0902 (9/85)
SOLID STATE DISPLAYS
Model
Pub. No. (Date)
AB-4
5952-8381 (4/75)
AB-64
5953-9366 (9/83)
Description
Detection and Indication of Segment
Failures in 7-Segment LED Displays
Mechanical and Optical Considerations
for the 0.3" Microbright
Seven-Segment Display
AB-76
5954-8427 (5/87)
Use of LED Lamps and Displays in Night
Vision Goggle Secure Lighting
Applications
AN-934
5952-0337 (11/72)
5082-7300 Series Solid State Display
Installation Techniques
AN-l006
Seven Segment LED Display Applications
5953-0439 (7/80)
AN-l015
5953-7788 (11/82)
AN-l016
5953-7787 (3/84)
AN-l026
5954-0886 (6/85)
AN-l029
5954-0923 (2/86)
Contrast Enhancement Techniques for
'
LED Displays
Using the HDSP-2000 Alphanumeric
Display Family
Designing with HP's Smart Display - the
HPDL-2416
Luminous Contrast and Sunlight
Readability of the HDSP-238X Series LED
Alphanumeric Displays for Military
Applications
AN-l031
5954-0933 (3/86)
Achieving Uniform Front Panel
Appearance using Hewlett-Packard's S02
Option LED Devices
AN-l033
5954-8424 (3/87)
Designing with the HDSP-211 X Smart
Display Family
Thermal Ink-Jet Print Cartridge
Designer's Guide
APPLICATIONS HANDBOOKS
LED Solid State Reliability
5954,0893 (7/85)
AN-l028
Description
10-4
Description
HPBK-4000
(1986)
5954-8416
LED Indicators and Displays Applications
Handbook
$12
HPBK-5000.
(1986)
5954-8417
Optocouplers and Fiber Optics
Applications Handbook
$12
Abstracts
and an IBM Series 1 Process Control CPU/Protocol
Converter. In this configuration the IBM Series 1 is
connected to an IBM mainframe computer.
APPLICATION BULLETIN 1
Construction and Performance of High Efficiency Red,
Yellow and Green LED Materials
The high luminous efficiency of Hewlett-Packard's High
Efficiency Red, Yellow and Green lamps and displays is
made possible by a new kind of light emitting material
utilizing a GaP transparent substrate. This application
bulletin discusses the construction and performance of
this material as compared to standard red GaAsP and
red GaP materials.
'
This application bulletin provides information to aid in
configuring the HP 16800A/16801 A bar code reader with
an IBM 5101 Personal Computer.
APPLICATION BULLETIN 4
Detection and Indication of Segment Failures in Seven
Segment LED Displays
APPLICATION BULLETIN 64
Mechanical and Optical Considerations for the 0.3"
Microbright Seven-Segment Display
The occurrence of a segment failure in certain
applications of seven segment displays can have
serious consequences if a resultant erroneous message
is read by the viewer. This application bulletin discusses
three techniques for detecting open segment lines and
presenting this information to the viewer.
The need to conserve space in electronic instruments
has increased drastically in the drive to design more
compact, more portable equipment. Hewlett-Packard has
facilitated the saving of space in the design of front
panels with the introduction of the Microbright, HewlettPackard's new HDSP-7300/-7400/-7500/-7800 series
compact 0.3" seven segment displays. Smaller than the
conventional 0.3" device, the Microbright requires less
space without sacrificing display height and is also
Hewlett-Packard's most sunlight viewable seven segment
display.
APPLICATION BULLETIN 63
HP 16800A/16801A Bar Code Reader Configuration
Guide for an IBM 5101 Personal Computer
APPLICATION BULLETIN 59
HP16800A/16801A Bar Code Reader Configuration
Guide for a DEC VT-100 or Lear Siegler ADM-31 to a
DEC PDP-11 Computer
This application bulletin provides informatiOn to aid in
configuring the HP 16800A/16801A bar code reader with
a.DEC-PDP-11 computer, and either a DEC-VT-100
terminal or a LEAR SIEGLER ADM-31 terminal.
This application bulletin deals with several issues in the
use of the Microbright. Optical filtering is covered, with
recommendations on filters to use over the devices.
Adjusting the package height and recommended sockets
are also presented, followed by a discussion on the
brightness of the display.
APPLICATION BULLETIN 60
Applications Circuits for HCPL-3700 and HCPL-2601
APPLICATION BULLETIN 65
Using 501125 I'm Optical Fiber with Hewlett-Packard
Components
Simple circuit illustrations are given for use of the
HCPL"3700 threshold detection optocoupler for ac or
dc sensing requirements. Programmable threshold
levels are given for the HCPL-3700.
.'
Also, a basic LSTTL to LSTTL isolation interface circuit
for 10 MBd operation is given which uses the high
common mode transient immunity HCPL-2601
optocoupler.
Applications Bulletin 65 explains factors that influence
the power coupled into various fiber diameters and
numerical apertures. Test results showing coupled
power from HP LED sources into 100/140 J.I metre and
50/125 I' metre fiber are included.
APPLICATION BULLETIN 61
HP 16800Al16801A Bar Code Reader Configuration
Guide for an IBM 3276/3278 Terminal
APPLICATION BULLETIN 68
HP 16800A/16801A Bar Code Reader Configuration
Guide for a MICOM Micr0280 message concentrator
This application bulletin provides information to aid in
configuring the HP 16800A/16801A bar code reader with
an IBM 3276/3278 terminal to an IBM3272/3274 Remote
Communications Controller. In this configuration the
IBM 3272/3274 is connected to an IBM mainframe
computer.
In some applications, multiple bar code readers may be •
required to input data to a logging terminal or a central"
processing unit. However, connecting each unit to a
CPU may utilize more input(output ports than desired.
A port concentrator will allow several devices to be
connected using only one port to the CPU. This
application bulletin provides information to aid in
configuring the HP 16800A/16801A bar code reader with
a MICOM Micro280 Message Concentrator.
APPLICATION BULLETIN 62
HP 16800A/16801A Bar Code Reader Configuration
Guide for an IBM 4955F Series 1 Process Control CPU!
Protocol Converter and an IBM 3101 Terminal
This application bulletin provides information to aid in
configuring the HP 16800A/16801A bar code reader in
an eavesdrop configuration with an IBM 3101 terminal
10-5
Abstracts (cont.)
APPLICATION BULLETIN 69
CMOS Circuit Design Using Hewlett-Packard
Optocouplers .
'
'.
,
Within this appiicatio~ q~lI~tiri are CMOS isolatio~" ,
interface circuits
use with ihe various, low input'
current, Hewlett-Packard optocouplers,specificillly, the
HCPL-2200/2300/2731 and 6.N1~9 devices. Advantages,
of and recommen.dations fOT different, input and output.,
circl!il configurations are given in tabular formfor low,
pO\l\ler,op,eration at v~rious sig'nalling 'rates. , :
.
ior
APPLICATION BULLETIN 7'1'
200-lLm PCS Fiber with Hewlett-Pac,kar,d Fiber, Optic., ..'
Transmitters and Receivers " " " ,
'
A description of the properties of ,200-lLm PCS,fiberis
given and the performance when used with HewlettPackard fiber optic components ii:i,'described in ihe form
of graphs and tables,
APPLICATION BULLETIN 73 '
Low-cost Fiber Optic Transmitter and Receiver Interface'
Circuits
'
Thisbulletin provide's assistance in designing circ\,lits to
interface Hewlett-Packard HFSR-0400 low~cost
' ,
miniature fiber optic components with TTL I/O for
applications at data rates up to 35 Msb. The tTL t xlRx
circuits presented in this applications bulletin have been'
designed, built, and tested. They are suitable forawide
range of applications.' The HFSR-0400 fiber optic,
components are compatible with'either SMA or ST style
connectors; The concepts illustrated in this bulletin are' .'
applicable to both types.
';
APPLICATION BULLETIN 74
Option 002 Tape and Reel LED Lamps ,'.
Hewlett-Packard Option 002 tape and reel LED. lamps ,
have straight leads on standard 2.54 mm (0.100'inch)
center spacing, These lamps maybeauto-inserted into
printed circuit boards'With most radial autocinsertion
equipment. However, it is important to have the 'proper
plated through hole siie and spacing ih the printed '
circuit to assure high insertion yields.' .
issued a Secure Lighting Statement of Work, SOW,
which details the lighting modification, guideli.ne~ t!lat.
may be incorporated to make variouslightsources NVG .
secure. The objective of tile'Secure Lighting' Program "
(paraphrased) is "to render all' combat nomen'clatured .
items designated for use at Corps levelandbeiow'less'
detectable tothrest image intensifier night observation' '
as far as is practicaL" , .
This' applicati6n bulletin di'scusses theparticulafs of the
u.s: Army NVG Secure Lighting sow. 'Hlgh 7 '
perforrTuince green and yellow LED/NVG filter
. .
combinations that satisfy secure lighting requirements
are discussed. Predicted performance values are
,.
presented ,in tabular for~at. .
APPLICATION BULLETIN 71
Interfacing t~e Hewlett-P~ckard SmartWand
This application bulietin.prOliides circyits to allow the'
user to interface the Hp, SmartWarid to true RS232 '
conn.~cti6ns:.
'.
"
APPLICATION NOTE 915
Threshold Detection of Visible and ,Infrared Radiation
with PIN,Photodiod!'S'
. ,
PIN photcidiodes are:compared with multiplier
phototubes in an 11-point summary of their relative'
merits. This .is followed bya ,description, pf PIN
photcidiode device structur(3, ,.-:node of operation, and,
analysis of the diode's equivalent circuit.
Four pre-amplifier circuits are presented, Two of these ,.
describe use of operational amplifiers - one for linear
response, the other for logarithmic response. The other:
two circuits are·design'edfo(substantially higher:
speeds of response, using discrete components to '"
obtain v.!ide band'width as w!3lf as'hi9h sensitivity.
APPLICATION NOTE 93~
.".
5082-7300 Series Solid State Display Installation
Techniques .
' . ', ,
This application bulletin details the specific,i,nformatiqn ..
on the printed board .plated through hQle size, spaci'ng
and tolerances necessary to assure,high insertion ,yields
of Option 002 LED lamps with 0:46 mm (0.018 inch)
.
square leads.
'
The 4N5X, HDSP-07XX/08XX/09XX, and5082-73XX
series Numeric/Hexadecimal' i'ndicators are a'n excellent'
solution to most standard display problems in :
commercial, industrial and military applications. The :
unit integrates the display c,haracter and associated
drive electronics in a~ingle package. Ttii's advantage
allows for space, pin and labor cost reductions, at the
same time improving oVerall reliability,
APPLICATION BULLETIN 75
ESC Control in Portable Bar Code Readers
The information presented. in this note describe!!
,
general Il')ethodsof incorporating this series, intciitaried
,
applications. . '
This application bulletin provides information to heip'
the designer of portable bar,code decoders to harden .. "
their system to ESD. (Elect~ostaticdischarge). ' .',
APPLICATION NOTE 945
Photometry of Red LEOs
..
APPLICATION BULLETIN 76
Use of LED Lamps and Displays in Night Vision Goggle
Secure Lighting Applications
NVG secure lighting is concerned with the detectability
of a light source on the ground by GEN II night vision
goggles at some distance. The U.S. Army CECOM has
!:
. ',
.
'. :
"."
.i ,
•
.. \, ~ ••
Nearly ail, LEOs .areused either. as discreteil')dicator
lamps or,as,eiemElnts of a segmented or dot-m,atrix
display. As such, they are viewed directly by human ....
viewers, sothe primary criteria for determining thElir
performance is the jocigmeritof a viewer. Equipme'nt fo~
meas~ring LED lightoutput shouid, therefore, simulate
human vision.
.
,
. ,
,
/
Abstracts (cont.)
.
~--
This application note will provide answers to these
questions:
1. What to measure (definitions of terms)
2. How to measure it (apparatus arrangement)
3. Whose equipment to use (criteria for selection)
--
...
..--
- ...----------
- ....
.... ~-- ........
_00'-' -
""',
...
APPLICATj.ON·NOTE 1002
\
Consideration of CTR Variations in Optocoupler Circuit
Designs
1
A lersistent, and sometimes crucial, concern of ,/
dfsigners using optocouplers is that of the curr~r\t
transfer ratio, CTR, changing with time. The change, or
~TR degradation, must be accounted for if 100ig,
functional lifetime of a system is to be guaranteed. This
ap'plication note will discuss a numbe!.•o{clifferent
soiJrces for this degradation.
.~./"
APPLICATION NOTE 947
Digital Data Transmission Using Optically Coupled
Isolators
Optocouplers make ideal line receivers for digital data
transmission applications. They are especially useful for
elimination of common mode interference between two
isolated data transmission systems. This application
note describes design considerations and circuit
techniques with special emphasis on selection of line
drivers, transmission lines, and line receiver termination
for optimum data rate and common mode rejection.
Both resistive and active terminations are described in
detail. Specific techniques are described for
multiplexing applications, and for common mode
rejection and data rate enhancement.
APP~ON-NGT-E"10!i4'"
.........'
Threshold Sensing for Industrial Control Systems with
the HCPL-3700 Interface Optocoupler
Interfacing from industrial control systems to logic
systems is a necessary operation in order to monitor
system progress. This interfacing is found in wocess
control systems, programmable controllers,
microprocessor subsystems which monitor limit and
proximity switches, environmental sensors and ac line
status; in switching power supplies for detection of ac
power loss; in power back up systems which need an
early warning of power loss in order to save special
microprocessor memory information or switch to
battery operation, etc. Applications of· the HCPL-3700
interface optocoupler are addressed in this' note. The
isolation and threshold detection capability of the
HCPL-3700 allows it to provide unique features which
no other optocoupler can provide. Addressed in this
note are the advantages of using this optocoupler for
isolating systems as well as the device characteristics,
dc/ac operational performance with and without
filtering, simple calculations for setting desired
thresholds, and four typical application examples for
the HCPL-3700. Additional coverage is given to
protection considerations for the optocoupler from the
standpoint of power transients; thermal conditions, and
electrical safety requirements of the industrial control
environment.
APPLICATION NOTE 948
Performance of the 6N135/6/7 Series of Optocouplers in
Short to Moderate Length Digital Data Transmission
Systems
Describes use of HP 6N135/6/7 optocouplers as line
receivers in a TTL-TTL compatible NRZ (nonreh,J.rn-tozero) data transmission link. It describes several useful
total systems including line driver, cable, terminations,
and TTL compatible connections.
APPLICATION NOTE 951-1
Applications for Low Input Current, High Gain
Optocouplers
Optocouplers are useful in line receivers, logic isolation,
power lines, medical equipment, and telephone lines.
This note discusses use of the 6N138/9 series high CTR
?ptocouplers in each of these areas.
APPLICATION NOTE 1005
Operational Considerations for LED Lamps and Display
Devices
APPLICATION NOTE 951-2
Linear Applications of Optocouplers
Although optocouplers are not inherently linear, the
separate photodiodes used in Hewlett-Packard
optocouplers provide better linearity as well as higher
speed of response than phototransistor detectors.
Linearity enhancement by use of paired optocouplers is
described with specific circuit examples offering DC-to25 KHz response. These examples illustrate the relative
merits of differential and servo techniques.
In the deSign of a display system, which incorporates
LED lamps and display devices, the objective is to
achieve an optimum between light output, power
dissipation, reliability, and operating life. The
performance characteristics and capabilities of each
LED device must be known and understood so that an
optimum design can be achieved. The primary source
for this information is the LED device data sheet. The
data sheet typically contains Electrical/Optical
Characteristics that list the performance of the device.
and Absolute Maximum Ratings in conjunction with
characteristic curves and other data which describe the
capabilities of the device. A thorough understanding of
this information and its intended use provides the basis
for achieving an optimum design. This application note
presents an in-depth discussion of the theory and use
of the electrical and optical information contained
A circuit with IinearAC response to 10 MHz is also
described for analog optocouplers having the
photodiode terminals externally accessible.
Digital techniques of voltage-to-frequency conversion
and pulse width modulation are discussed. Their
linearity is quite independent of optocoupler linearity
but require use of high speed optocouplers for low
distortion.
10-7
Abstracts (cont.)
depth of field; and reflective sensor design. It also
discusses the optical and electrical operation of the
HBCS-1100 High Resolution optical sensor. Finally, it
presents electrical design techniques which allow the
HBCS-1100 to interface with popular logic families.
within a data sheet. Two designs using this information
in the form of numerical examples are presented, one
for dc operation and one for pulsed (strobed) operation.
APPLICATION NOTE 1006
Seven Segment LED Display Applications
APPLICATION NOTE 1011
Design and Operational Considerations for theHEDS5000 Incremental Shaft Encoder
This application note begins with a detailed explanation
of the two basic product lines that Hewlett-Packard
offers in the seven segment display market. This
discussion includes mechanical construction
techniques, character heights, and typical areas of
application. The two major display drive techniques, dc
and strobed, are covered. The resultant tradeoffs of
cost, power, and ease of use are discussed. This is
followed by several typical instrument applications
including counters, digital voltmeters, and
microprocessor interface applications. Several different
microprocessor based .drive techniques are presented
incorporating both the monolithic and the large seven
segment LED displays.
This application note is directed toward the system
designer using the HEDS-5000 and HEDS-6000
modular incremental shaft encoders. First the note
briefly analyzes the theory of design and operation of
the HEDS-5000 and HEDS-6000. Apractical approach
to design considerations and an error analysis provide
an indepth treatment of the relationship between motor
mechanical parameters and encoding error
accumulation. Several design examples demonstrate
the analysis techniques presented. Operation
considerations for assembly, test, trouble shooting and
repair are presented. Finally some circuits and software
concepts are introduced which will be useful in
interfacing the shaft encoder to a digital or
microprocessor based system. Appendix A summarizes
the uses and advantages of various encoder
technologies while Appendix B provides guidance for
selecting DC motors suitable for use with the HEDS5000 and HEDS-6000.
The application note contains a discussion of intensity
and color considerations made necessary if the devices
are to be end stacked. Hewlett-Packard has made
several advances in the area of sunlight viewability of
LED displays. The basic theory is discussed and
recommendations made for achieving viewability in
direct sunlight. Information concerning display
mounting, soldering, and cleaning is presented. Finally,
an extensive set of tables has been compiled to aid the
designer in choosing the correct hardware to match a
particular application. These tables include seven
segment decoder/drivers, digit drivers, LSI chips
designed for use with LEOs, printed circuit board edge
connectors, and filtering materials.
APPLICATION NOTE 1012
Methods of Legend Fabrication
Hewlett-Packard LED Light Bar Modules inscribed with
fixed messages or symbols can be used as economical
annunciators. Annunciators are often used in front
panels to convey the status of a system, to indicate a
selected mode of operation or to indicate the next step
in a sequence. This application note discusses
alternative ways the message or symbols (legends) can
be designed. A selection matrix is provided to assist in
the selection of the most appropriate method of legend
fabrication. Each fabrication method is explained in
detail along with mounting and attachment techniques.
Finally, prevention of cross-talk is discussed for legend
areas of a multi-segmented light bar.
APPLICATION NOTE 1007
Bar Graph Array Applications
This application note begins with a description of the
manufacturing process used to construct the 10
element array. Next is a discussion of the package
design and basic electrical configuration and how they
affect designing with the bar graph array. Mechanical
information including pin spacing and wave soldering
recommendations are made:
Display interface techniques of two basic types are
thoroughly discussed. The first of these two drive
schemes is applicable in systems requiring display of
analog signals in a bar graph format. The second major
drive technique interfaces bar graph arrays in systems
where the data is of a digital nature. Examples of
microprocessor controlled bar graph arrays are
presented.
APPLICATION NOTE 1013
Elements of a Bar Code System
This application note describes in detail the elements
that make up most bar code systems. Included is a
discussion of the fundamental system design, detailed
discussion of 7 popular code symbologies, a section on
symbol generation, and methods of data entry. A
glossary of terms and a reference section are also
included. This is an excellent publication for people'
who are just learning about bar code, or for those who
need a more comprehensive understanding of the
subject.
Summarized for the design engineer are tables of
available integrated circuits for use with bar graph
arrays. Finally, a list of recommended filters is included.
APPLICATION NOTE 1008
Optical Sensing with the HBCS-1100
APPLICATION NOTE 1015
Contrast Enhancement Techniques for LED Displays
This application note gives the basic optical flux
coupling design for discrete emitters and detectors.
Presents the concepts of modulation transfer function,
Contrast enhancement is essential to assure readability
of LED displays in a variety of indoor and outdoor
10-8
Abstracts (cont.)
along with applications for digital, 20 mA, simplex, half
duplex and full duplex loops. These loops can be either
point-to-point or multidrop configurations. Factors
which affect data performance are discussed. Circuit
arrangements with specific data performance are given
in graphical and tabular form.
ambients. Plastic filters are typically used for contrast
enhancement with indoor lighting and glass circular
polarized filters are typically used to achieve readability
in sunlight ambients.
This application note discusses contrast enhancement
technology for both indoor and outdoor ambients, the
theory of Discrimination Index and provides a list of
tested contrast enhancement filters and filter
manufacturers.
APPLICATION NOTE 1019
Using the HLMP-4700/-1700/-7000 Series Low Current
Lamps
Hewlett-Packard manufactures a series of LED lamps
that are designed for operation at 2 rnA DC. These
lamps are available in high efficiency red, yellow, and
high performance green in a variety of package styles.
These lamps allow the designer to reduce system power
dissipation, and drive circuit costs.
APPLICATION NOTE 1016
Using the HDSP-2000 Alphanumeric Display Family
The HDSP-2000 family of alphanumeric display
products provides the designer with a variety of easy-touse display modules with on board integrated circuit
drivers. The HDSP-2000 family has been expanded to
provide three display sizes with character heights
ranging from 3.B mm (0.15") to 6.9 mm (0.27"), four
display colors, and both commercial and military
versions. These displays can be arranged to create both
single line and multiple line alphanumeric panels.
This application note contrasts electrical characteristics
of the low-current lamp with HP's conventional lamp.
Costs of implementing lamp drive circuits are
discussed, as in power conservation in TTL and circuits
involving higher Voltages. Finally, telecommunications
and battery information are presented.
This note is intended to serve as a design and
application guide for users of the HDSP-2000 family of
alphanumeric display devices. It covers the theory of
the device design and operation, 'considerations for
specific circuit designs, thermal management, power
derating arid heat siriking, and intensity modulation
techniques.
APPLICATION NOTE 1021
Utilizing LED Lamps Packaged on Tape and Reel
Hewlett-Packard offers many of its LED lamps
packaged on tape and reel for radial insertion by
automatic equipment during high volume production of
PC board assemblies.
APPLICATION NOTE 1017
LED Solid State Reliability
This application note is a guide to the use of tape and
reel LED lamps in the automatic insertion process.
Discussed are the LED lamp tape and reel
configuration, the radial lead insertion process, PC
board design considerations, a method to maintain LED
lamp alignment during soldering and lamp stand-off
height information.
Light emitting diode display technology offers many
attractive features including multiple display colors,
sunlight readability, and a continuously variable intensity
adjustment. One oithe most common reasons that LED
displays are designed into an application, however, is
the high level of reliability of the LED display. HewlettPackard has taken a leadership role in setting reliability
standards for LED displays and documenting reliability
performance.
This note explains how to use the reliability data sheets
published for HP LED indicators and displays. It
describes the LED indicator and display packages,
defines device failures, and discusses parameters
affecting useful life, failure rates and mechanical test
.
performance.
APPLICATION NOTE. 1022
High Speed Fiber Optic Link Design with Discrete
Components
As the technology of fiber optic communication
matures, design considerations for large volume
applications focus as much on cost and reliabiiity, as
bandwidth and bit-error-rate. This application note
describesa 100 MBd fiber optic communication link
which was implemented with low-cost, non-exotic
technology, including LED transmitter, PIN photodiode
detector, off-the-shelf ICs and discrete components, laid
out on epoxy-glass circuit boards.
APPLICATION NOTE 1018
Designing with the HCPL-4100 and HCPL-4200 Current
Loop Optocoupler
APPLICATION NOTE 1023
Radiation Immunity of Hewlett-Packard Optocouplers
Opening with a quotatio[l from MIL-HDBK-279
describing optocouplers containing .photodiodes as
superior to optocouplers containing phototransistors,
the text describes the properties of ionizing radiation
(particles and photons) and how it affects the
performance of optocouplers. Graphs show
degradation of CTR (Current Transfer Ratio) in the
6N140 as a function of gamma total dose (up to 1000
Digital current loops provide unique advantages of large
noise immunity and long distance communication at
low cost. Applications are wide and varied for current
loops, but one of the critical concerns of a loop system
is to provide a predictable, reliable and isolated
interface with the loop. The HCPL-4100 (transmitter)
and HCPL-4200(receiver) optocouplers provide for
easy interfacing to and from a current loop with minimal
design effort. Within this application note.a complete
description of the HCPL-4100/4200 devices is given
10-9
Abstracts (cont.)
rad lSi] and. as a function of total neutron fluence (up to
6 x 10 12 n/cm 2). A table gives radiation hardness
requirements for various military requirements.
APPLICATION NOTE 1024
Ring Detection with the HCPL-3700 Optocoupler
With the increased use of modems, automatic phone
answering equipment, private automatic branch .
exchange (PABX) systems, etc., low-cost, reliable,
isolated ring detection becomes important to many
electronic equipment manufacturers. This application
note addresses the definition of ringing requirements
(U.S.A. and Europe), applications of the HCPL-3700
optocoupler as a simple, but effective, ring detector. A
design example is shown with calculations to illustrate
proper use of the HCPL-3700. Features which are
integrated .into the HCPL-3700 provide for predictable
detection, protection and isolation when compared to
other optocoupler techniques.
APPLICATION NOTE 1025
Applications and Circuit Design for the HEDS-7500
series Digital Potentiometer
This application note demonstrates some ofthe uses for
the Hewlett-Packard HEDS-7500 series digital
potentiometer, explains how a digital potentiometer
works, and explains some of the advantages of a digital
potentiometer over a standard .resistive potentiometer.
I n addition, this application note provides some
examples of circuitry which will interface the digital
potentiometer to a microprocessor, and provides
mechanical design considerations and available options
for the HEDS-7500 series digital potentiometer.
APPLICATION NOTE 1026
Designing with Hewlett-Packard's Smart Display HPDL-2416
The
The trend in LED Alphanumeric displays is to simplifiy a
designer's job as much as possible by incorporating on
board character storage, ASCII character generation,
and multiplexing within the display. The HPDL-2416 is a
four character alphanumeric display which incorporates
a 64 charaCter ASCII decoder and an on board CMOS
IC to perform these functions. This ,application note is
intended to serve as a design and application guide for
users of the HPDL-2416. The information presented will
cover: electrical description, electrical design
considerations, interfacing to micro-processors, preprogrammed message systems, mechanical and
.
electrical handling, and contrast enhancement.
APPLICATION NOTE 1027
Soldering LED Components
The modern printed circuit board is assembled with a
wide variety of semiconductor components. These
components may include LED lamps and displays in
combination with other components. The quantity of
solder connections will be' many times the component
count. Therefore, the solder connections must be good
on the first pass through the soldering process. The
effectiveness of the soldering process is a function of
the care and attention paid to the detai Is of the process.
It is important for display system designers and PC
board assembly engineers to understand the aspects of
the soldering process and how they relate to LED
components to assure high yields.
This application note provides an in depth discussion
on the aspects of the soldering process and how they
relate to LED lamps and display components, with the
objective of being to serve as a guide towards achieving
high yields for solder connections.
APPLICATION NOTE 1028
Surface Mount Subminiature LED Lamps
Modern printed circuit boards are being assembled with
surface mounted components, replacing through hole
mounted components in many traditional applications.
Hewlett-Packard has s.urface mount options for its
HLMP-6000/7000 series of subminiature LED lamps,
Options 011 and 013 for "gull wing" leads and Option
021 for "yoke" leads for inverted mounting.
This application note provides information on how to
surface mount and vapor phase reflow solder these
surface mount subminiature LED lamps.
APPLICATION NOTE 1029
Luminous Contrast and Sunlight Readability of the
HDSP-238X Series LED Alphanumeric Displays for
Military Applications
Military specifications for avionics and other kinds of
electronics that require readability in sunlight use
specific definitions for luminous contrast. The concept
of chrominance contrast and the theory of
Discrimination Index (see Hewlett-Packard Application
Note 1015) are not used by the military as a means of
determining readability in sunlight.Thus, the military
requirements for readability in sunlight are based solely
on luminous contrast measurements. This application
note discusses the luminous contrasts used by military
specifications, describes anti-reflection/circular
polarized filters designed for use with the HDSP-238X
series sunlight viewable LED displays and presents
luminous contrast data for various HDSP-238X
display/filter combinations.
APPLICATION NOTE 1031
Front Panel Design
In many applications designers are faced with the
problem of how to match the perceived brightness of an
assortment bf seven segment displays, light bars, linear
arrays, and lamps on the same front panel. To simplify
this problem Hewlett-Packard has introduced S02
option selected parts. S02 option selected parts provide
a restricted range of luminous intensity for a given part
number. This application note is written.as a design
guide to matching the perceived brightness of LED
displays and lamps on a front panel. The procedure
shown in the application note will enable the designer
to calculate the needed display drive currents (either dc
or pulsed) for a given ambient light level and specified
filter. Two techniques are explained.The first is how to
10-10
Abstracts (com.)
calculate the drive currents to insure minimum
acceptable brightness. The second is how to calculate
the drive currents to match the display on the front
panel to a known display.
TECHNICAL BRIEF 103
High Speed Optocouplers
VS.
Pulse Transformers
For high speed signaling with ground loop isolation,
pulse transformers are often used. Here are summarized
briefly the difficulties encountered in the use of pulse
transformers, such as rise-time, sag, and interwinding
capacitance. A table summarizes the parameters of
Hewlett-Packard optocouplers designed for high speed
signaling. A second table summarizes the advantages of
using these optocouplers instead of pulse transformers.
APPLICATION NOTE 1032
Design of the HCTL-1000's Digital Filter Parameters by
the Combination Method
Digital closed loop motion control systems employing a
dedicated IC as a controller are becoming increasingly
popular as a solution to the need for controlled velocity
and positioning systems. Hewlett-Packard's HCTL-1000
is a general purpose motion control IC which has been
designed for this type of closed loop systems. A digital
compensator has been designed into the HCTL-1000 to
provide a stable response to an input command. This
application note explains how the combination method
can be used for calculation of the HCTL-1000's digital
compensation filter parameters to provide a stable,
closed loop position control system.
The transmission of video signals over fiber-optic links
offers several advantages relative to comparable wire
distribution systems. Technical Brief 104 describes
simple Tx/Rx circuits providing 20 MHz, 3 dB
bandwidth for high resolution analog video
transmission.
APPLICATION NOTE 1033
Designing with the HDSP-211X Smart Display Family
TECHNICAL BRIEF 105
ST Connector/Cable Guide
TECHNICAL BRIEF 104
Baseband Video Transmission with Low Cost Fiber
Optic Components
Hewlett-Packard's smart alphanumeric display, the
HDSP-211X, is built to simplify the user's display design.
Each HDSP-211X has an on board CMOS IC which
displays eight characters. All of the IC features are
software driven. These features include 128 character
ASCII decoder, 16 user-defined symbols, seve~
brightness levels, flashing characters, a self test, and all
of the circuitry needed to decode, drive, and refresh
eight 5 x 7 dot matrix characters.
A fairly recent development, by AT&T, is the sr
Connector, and its rapid acceptance by users of fiber
optic components is an indication that it may soon
become a standard connector.
Technical Brief 105 provides a quick comparison
between the SMA and the ST style connector. A table at
the end lists some suppliers of the ST style connectored
cables.
This application note discusses how to interface the
HDSP-211 X display to either a Motorola 6808 or an Intel
8085 microprocessor. A 32 character display interface is
explained for each microprocessor. The note includes a
detailed description of the hardware and software. The
software illustrates how the user-defined symbols and a
string of ASCII characters are loaded into the display.
*ST is a registered trademark of AT&T Lightguide Cable
Connectors.
INK-JET DESIGNER'S GUIDE
This Designer's Guide is intended to supplement the
print cartridge data sheet by providing technical
assistance in the design and operation of any printing
device using the Thermal Ink-jet print cartridge. To this
end, it will:
provide a basic understanding of the print
cartridge operation
identify the key design parameters affecting
printing performance
suggest methods for optimizing or enhancing
performance
identify the primary failure modes and limitations
of the print cartridge
provide guidelines for maintenance and
troubleshooting of the print cartridge
TECHNICAL BRIEF 101
Fiber Optic SMA Connector Technology
Technical Brief 101 discusses tradeoffs between various
SMA connector techniques and provides a contact
matrix of manufacturers versus SMA connector type.
TECHNICAL BRIEF 102
Fiber/Cable Selection for LED Based
Local Communications Systems
Technical Brief 102 is intended to assist the first time
user of fiber optics with the selection of a fiber cable
that best meets desired system requirements. Issues
discussed in Technical Brief 102 include: Tradeoffs
between various fiber types, the effect of LED emitters
on fiber performance, coupled power versus numerical
aperture and factors that influence cable selection. A
contact matrix that lists fiber cable manufacturers
versus cable type is also included.
10-11
Appendix .
•
•
•
HP Components Authorized Distributor and
Representative Directory
HP International Sales and Service Offices
HP Components U.S. Sales and Service Offices
UP COlDponents
Authorized Distributor
and Representative Directory
United States
Alabama
California (cont)
California (cont)
Florida (cont.)
Hall-Mark Electronics"
4900 Bradford Drive
Huntsville 35807
(205) 837-8700
Hamilton/Avn~t
Schweber Electronics
90 East· Tasman Drive
San Jose 95134
(408) 432-7171
Hamilton/Avnet
6947 University Blvd,
lIinter Park 32792
(305) 628 - 3888
Hami 1 toniAvne t
Southwest Regional
Stocking Center
350 McCormick Avenue
Costa Mesa. CA 92626
(714) 754-6100
4940 Research Drive N.W.
Huntsville 35805
(205) 837-7210
Schweber Electronics
4910 Corporate Drive, Suite J
'Huntsville 35805
(205) 895-0480
Colorado
Hamilton/Avnet (Corp)
10950 II. lIashington Blvd,
Culver City 90230
(213) 558-2020
Hamilton/Avnet
8765 East Orchard
Suite 708
Englewood 80111
(303) 740-1000
Hamilton/Avnet
3002 East G Street
Ontario 91764
(714) 989-4602
Schweber Electronics
8955 E, Nichols Avenue
Suite 200
Englewood 80112
(303) 799-0258
Arizona
Hami 1 toniAvne t
30 S. McKemy Avenue
Chandler 85226
(602) 961-6400
Schweber Electronics
11049 N, 23rd, Drive
Suite 100
'Phoenix 85029
(602) 997-4874
California
Avnet Electronics
350 McCormick Avenue
Costa Mesa 92626
(714) 754-6100
Hall-Mark Electronics
Hamilton/Avnet
4103 Northgate Blvd,
Sacramento 95834
(916) 925-2216
Connectlcul
Hanl1lton/Avnet
4545 Viewridge Avenue
San Diego 92123
(619) 571-7510
Hall-Mark Electronics
Barnes Industrial Park
33 Village Lane
P,O. Box 5024
lIallingford 06492
(203) 269-0100
Hamilton/Avnet
1175 Bordeaux Drive
Sunnyvale 94086
(408) 743-3300
Hamilton/Avnet
Commerce Drive
Commerce Industrial Park
Danbury 06810
(203) 797-2800
·Hamilton Electro Sales
3170 Pullman Street
Costa Mesa 92626·
(714) 641-4199
Canoga Park 91304
(818) 716-7300
Hamilton/Avnet
1361 "B"I West 190th Street
Gardena 90248
(213) 217-6700
Hall-Mark Electronics
6341 Auburn Blvd. I Suite D
Citrus Heights 95610
(916) 722-8600
Schweber Electronics
21139 Victory Blvd,
Canoga Park 91303
(818) 999-4702
Hall-Mark Electronics
19220 S, Normandie
Torrance 90502
,(213) 217-8400
Schweber Electronics
371 Van Ness Way
Suite 100
Torrance 90501
(213) 320-8090
8130 Remmet Avenue
Hall-Mark Electronics
1110 Ringwood Court
San Jose 95131
(408) 432-0900
Hall-Mark Electronics
14831 Franklin Avenue
Tustin 92680
(714) 669-4100
Hamilton/Avnet
9650 De Soto Avenue
Chatsworth 91311
(818) 700-6565
Schweber Electronics
Finance Drive
Commerce Industrial Park
Danbury 06810
(203) 748-7080
Hami 1 tonI Avne t
5825 D. Peachtree Corners East
Norcross 30092
(404) 447-7500
Schweber Electronics
303 Research Drive
Suite 210
Norcross 30092
(404) 446-5842
illinois
Hamilton/Avnet
1130 Thorndale Ave~ue,
Bensenville 60106
(312) 860-7700
Hamilton/Avnet
3197 Tech Drive North
St. Petersburg 33702
(813) 576-3930
11-2
Hall-Mark Electronics
6410 Atlantic Boulevard
Suite 115
Norcross 30071
(404) 447-8000
Florida
Hamilton/Avnet
6801 N, II, 15th -llay
Ft, Lauderdale 33309
(305) 971-2900
Schweber Electronics
6750 Nancy Ridge Drive
Bldg. 7, Suites D & E
San Diego 92121
(619) 450-0454'
Georgia
Hall-Mark Electronics
15301 Roosevelt Blvd.
Suite 303
Clearwater 33520
(813) 530 -4543
Hall-Mark Electronics
3161 S, II. 15th Street
Pompano Beach 33069-4800
(305) 971-9280
Schweber Electronics
1771 Tribute Road
Suite B
Sacramento 95815
(916) 929-9732
Schweber Electronics
3665 Park Central Blvd, North
Building #6
Pompano Beach 33064
(305) 977-7511
Hall-Mark Electronics
210 Mittel Drive
Wooddale 60191
(312) 860-3800
Hall-Mark Electronics
7648 Southland Blvd,
Suite 100
Orlando 32809
(305) 855 -4020
Schweber Electronics
17822 Gillette Avenue
Irvine 92714
(714) ,863-0200
Schweber Electronics
317 S, North Lake Blvd,
Suite 1024
Altamonte Springs 31701
(305) 331-7555
Schweber Electronics
904 Cambridge Drive
Elk Grove Village 60007
(312) 364-3750
Indiana
Hall-Mark Electronics
4275 \I, 96th Street '
Indianapolis 4626'8
(317) 872-8875
Hamilton/Avnet
485 Gradle Drive
Carmel 46032
(317) 844'-9333
Iowa
Minnesota
New Mexico
Ohio (cont.)
Hami 1 ton/Avne t
Hall-Hark Electronics
10300 Valley View Road
Suite 101
Eden Prairie 55344
(612) 941-2600
Hamilton/Avnet
2524 Baylor S. E.
Albuquerque 87106
(505) 765-1500
Hamilton/Avnet
954 Senate Drive
Dayton 45459
(513) 439-6700
Haml1ton/Avnet
12400 Whi tewater Road
Minnetonka 55343
(612) 932-0600
New York
Hamilton/Avnet
777 Brooksedge Blvd.
Westerville 43081
(614) 882-7004
915 33rd Avenue S. W.
Cedar Rapids 52404
(319) 362-4757
Schweber Electronics
5270 North Park Place N. E.
Cedar Rapids 52402
(319) 373-1417
Kansas
Hall-Mark Electronics
10809 Lakeview Drive
Lenexa 66215
(913) 888-4747
Hamilton/Avnet
9219 Quivira Road
Overland Park 66215
(913) 888-8900
Schweber Electronics
10300 W. 103rd. Street
Suite 200
Overland Park 66214
(913) 492·2922
Maryland
Hall-Mark Electronics
10240 Old Columbia Road
Columbia 21046
(301) 988-9800
Hamilton/Avnet
6822 Oak Hall Lane
Columbia 21045
(301) 995-3500
Schweber Electronics
9330 Gaither Road
Gaithersburg 20877
(301) 840-5900,
Schweher Electronics
7424 W. 78th Street
Edina 55435
(612) 941-5280
HamiltonJAvnet
100 Centennial Drive
Peabody 01960
(617)· 531-7430
Schweber Electronics
25 Wiggins Avenue
Bedford 01730
(617) 275-5100
Michigan
Hamilton/Avnet
2215 29th Street S.E.
Grand Rapids 49508
(616) 243-8805
Hamil toniAvne t
32487 Schoolcraft Road
Livonia 48150
(313) 522-4700
Schweber Electronics
12060 Hubbard Drive
Livonia 48150
(313) 525-8100
Hamilton/Avnet
933 Motor Park Way
Hauppauge 11788
(516) 434-7421
Missouri
Hall-Hark Electronics
13750 Shoreline Drive
Earth City 63045
(314) 291-5350
Hamilton/Avnet
13743 Shoreline Court
Earth City 63045
(314) 344-1200
Schweher Electronics
502 Earth City Expwy.
Suite 203
Earth City, 63045
(314) 739-0526
New Hampshire
Hamilton/Avnet
444 East Industrial Park Dr.
Manchester 03103
(603) 624-9400
Schweber Electronics
Bedford Farms, Bldg.
Kilton & South River Road
Manchester 03102
(603) 625-2250
MassachuseHs
Hall-Hark Electronics
6 Cook Street
Pinehurst Park
Billerica 01521
(617) 935-9777
Hall-Mark Electronics
101 Comac Street
Ronkonkoma 11779
(516) 737-0600
New Jersey
Hall-Mark Electronics
107 Fairfield Road
Suite IB
Fairfield 07006
(201) 575-4415
Hall-Mark Electronics
1000 Midlantic Drive
Mt. Laurel 08054
(609) 235-1900
Hamilton/Avnet
1 Keystone Avenue, Bldg 36
Cherry Hill 08003
(609) 424-0118
Hamilton/Avnet
10 Industrial Road
Fairfield 07006
(201) 575-3390
Schweber Electronics
18 Madison Road
Fairfield 07006
(201) 227 -7880
Hamilton/Avnet
2060 Town Line Road
Rochester 14623
(716) 475-9130
Hamilton/Avnet
103 Twin Oaks Drive
Syracuse 13206
(315) 437-2641
Schweber Electronics
3 Town Line Circle.
Rochester 14623
(716) 424-2222
Schweber Electronics
Jericho Turnpike, CB 1032
Westbury 11590
(516) 334-7474
Schweber Electronics
23880 Commerce Park Road
Beachwood 44122
(216) 464·2970
Schweber Electronics
7865 Paragon Road
Suite 210
Dayton 45459
(513) 439-1800
Oklahoma
Hamilton/Avnet
12121 E. 51st Street
Suite 102A
Tulsa 74146
(918) 252-7297
Schweber Electronics
4815 S. Sheridan
Fountain Plaza, Suite 109
Tulsa 74145
(918) 622-8000
Oregon
North Carolina
Hall-Mark Electronics
5237 North Boulevard
Raleigh 27604
(919) 872-0712
Hamilton/Avnet
3510 Spring Forest Road
Raleigh 27604 .
(919) 878-0810
Schweber Electronics
I North Commerce Center
5285 North Boulevard
Raleigh 27604
(919) 876-0000
Ohio
Hall-Hark Electronics
5821 Harper Road
Solon 44139
(216) 349-4632
Hall-Mark Electronics
400 E. Wilson Bridge Rd.
Suite S
Worthington 43085
(614) 888-3313
Hall-Mark Electronics/DESC
938 Blackfoot Trail
Jamestown, 45335
(513) 675-2129
Hamilton/Avnet
30325 Bainbridge Road, Bldg A
Solon
44139
(216) 349-5100
11-3
Almac Electronics
1885 N. W. 169th Place
Beaverton 97006-4849
(503) 629-8090
Hamilton/Avnet
6024 SoW. Jean Road
Bldg. C, Suite 10
Lake Oswego 97034
(503) 635-8831
Pennsylvania
Hamilton/Avnet
2800 Liberty Avenue
Bldg. E
Pittsburgh 15222
(412) 281·4150
Schweber Electrol'.ics
900 Business Center Dr.
Horsham 19044
(215) 441-0600
Schweber Electronics
1000 R.I.D.C. Plaza
Suite 203
Pittsburgh 15238
(412) 782-1600
Texas
Texas (cont.)
Utah
Wisconsin
Hall-Mark Electronics (Corp.)
11333 Pagemill Drive
Dallas 75234
(214) 343-5000
Hamilton/Avnet
4850 IIright Road
Stafford. 77477
(713) 240-7733
Haml1ton/Avnet
1585 .lIest 2100 South·
Salt Lake City 84119
(801) 972-2800
Hall-Hark Elec tronies
Hall-Mark Electronics
12211 Technology Blvd.
Suite B
Austin 78727,
(512) 258-8848
Hami 1 toni Avne t
2111 II. lIa1nut Hill Lane
Irving 75038
(214) 659-4111
Hall-Mark Electronics
11420 Pagemil1 Road
Dallas 75238
(214) 553-4300
Schweber Electronics
6300 La Calma Drive
Suite 240
Austin 78752
(512) 458-8253
Hall-Mark Electronics
8000 lJestglen
Houston 77063
(713) 781-6100
4202 Beltway Drive
Dallas 75234
(214) 661-5010
Hamil ton/Avnet
IS07A West Braker Lane
Austin 78758
(512) 837-8911
Washington
Almac Electronics
14360 S. E. Eastgate lIay
Bellevue 98007 -6458
(206) 643-9992
Almac Electronics
10905 Montgomery
Spokane 99206
(409) 924-9500
Schweber Electronics
16255 West Lincoln Ave.
New Berlin 53151
(414) 797 -7844
Hamilton/Avnet
2975 Moorland Road
New Berlin 53151
(414) 784-4510
Schweber Electronics
3050 South Calhoun
New Berlin 53151
(414) 784-9020
Hamilton/Avnet
14212 N. E .. 21st Street
Bellevue 98007 (206) 453-5844
Schweber Electronics
10625 Richmond Avenue
Suite 100
Houston 77042 .
(713) 784-3600
International
Australia
Canada
Canada (cont.)
Denmark
VSI Electronics Pty. Ltd.
Office 4
116 Melbourne Street
North Adelaide
South Australia 5006
(61) 8 267 4848
Hamilton/Avnet Electronics Ltd,
2550 Boundary Road, Suite 115
Burnaby, BC V5M 3Z3
(604) 437-6667
Zentronics, Ltd.
8 Tilbury Court
Brampton, Ontario L6T 3T4
(416) 451-9600
Distributoren
Silovej 18
,
DK- 2690 Karlslunde
(45) 3 140700
Hamilton/Avnet Electronics Ltd.
2816 21st Street NE
Calgary, . Alberta T2E 6Z2
(403) 250-9380 .
Zentronics, Ltd.
Bay #1
3300 14th Avenue, N. E.
Calgary, Alberta T2A '6J4
(403) 272-1021
VSI Electronics Pty. Ltd.
Suite 3, Bell Court
'
Cnr. Water & Brunswick Streets
Fortitude Valley
Brisbane, Queensland 4006
(61) 7 52 5022
VSI Electronics Pty. Ltd.
Unit I
25 Brisbane Street
East Perth, W.A. 6000
(61) 9 328 8499
VSI Electronics Pty. Ltd.
16 Dickson Avenue
Artarmon, N. S. W. 2064'
(61) 2 439 8622
VSI Electronics Pty. Ltd.
6/417 Ferntree Gully Road
Mt. Waverle'y
Melbourne, Victoria 3149
(61) 3 543 6445
Austria
Transistor V.m.b.H
Auhofstr. 4la
A-1130 lIien
(43) 222 829451
Belgium
Diode Belgium
Excelsiorlaan 53
B-1930 Zaventem
(02) 721 29 92
Hamilton/Avnet
Electronics Ltd.
6845 Rexwood Drive
Units 3, ,4 & 5
Mississauga, Ontario' "L4V lR2
(416) 677-7432
Zentronics, Ltd.
155 Colonnade Road
Units 17 & 18
Nepean, Ontario K2E 7Kl
(613) 226-8840·
.
Zentronics, Ltd.
817 McCaffrey Street
Ville St. Laurent
Montreal, Quebec H4T lN3
(514) 737-9700
Hamilton/Avnet
Electronics Ltd.
2795 Halpern ~treet
St. Laurent
Montreal, Quebec H4S lP8
(514) 335-1000
Zentroni~s, Ltd.
Unit 108
11400 Br1dgeport Road
Richmond, B. C. V6X 1 T2
(604) 273-5575
Hamilton/Avnet
Electronics Ltd.
190 Colonnade Road
Nepean, Ontario K2E 7J5
(613) 226-1700
Hi-Tech Sales Limited (REP)
Box 115
'
339 10th Avenue S. E.
Calgary I Alberta T2G OW.2
(403) 239-3773
Hi-Tech Sales Limited (REP)
75l0B Kingsway
Burnaby, B. C. V3N 3C2
(604) 596-1886'
Zentronics, Ltd.
#173-1222 Alberta Ave.
Saskatoon, Saskatchewan
Canada
S7K lR4
(306) 955-2202
Zentronics, Ltd.
60-1313 Border Street
Winnipeg, Manitoba R3H OX4
(204) 694-1957
.
China
Hi-Tech Sales Limited (REP)
102-902 St. James Street
Winnipeg, Manitoba R3G 3J7
(204) 786-3343
EBV Elektronik
Excelsiorlaan 35
B-1930 Zaventem
(20) 720 99 36
11-4
(Peoples Republic of China)
China HP Rep Office
4th Floor, 2nd Watch Factory
Shuang Yu Shu
Bei San Huan Lu
Hai-Dian District, Beijing
(560) 280-567
Finland
Field-OY
Niittylanpolku 10
SF-00620 Helsinki
(435) 80 757 10 11
France·
Almex
Zone Industrielle d'Antony
48, rue de I' Aubepine
92160 Antony
(33) 1 6662112
F. Feutrier
8, Benoit Malon
F-921S0 Surensnes
(33) 1 7724646
F. Feutrier
Rue des Trois Glorieuses
42271 St. Priest En Jarez
(33) 7 7746733
S.C.A.LB.
80 rue d' Arceui1
Zone Sillc 137
94523 Rungis Cedex
(33) 1 6872313
Germany
EBV- Elektronik
Oberweg 6
D- 8025 Unterhaching
Munich
(49) 89 611051
Germany (cont.)
Italy
New Zealand
Switzerland
ING. -BUERO K. -H. Dreyer
Celdis Italiana S.p.A.
Via Fratel!i Gracchi. 36
1-20092 Cinisello Balsamo
Milano
(39) 261 83 91
VSI Electronics Pty. Ltd.
#7 Beasley Ave., Penrose
Auckland
(64) 9593603
Baerlocher AG
Foerrllbuckstrasse 150
CH-8037 Zuerich
(41) 142 99 00
VSI Electronics Pty. Ltd.
Box 21-239
Chris tchurch
(64) 60928
Fabrimex Ag
Kirchenweg 5
CH-8032 Zuerich
(41) 12 51 29 29
VSI Electronics Pty. Ltd.
P.O. Box 11145
Wellington
(64) 4848922
Taiwan (Republic of China)
Flensburger Strasse 3
0-2380 Schleswig
(49) 4621 23121
JERMYN GmbH
1m Dachsstueck 9
0-6250 Limburg/Lahn
(49) 64 31 5 08-0
SASCO GmbH
Herrnann-Oberth Strasse 16
D-8011 Putzbrunn
Munich
(49) 89 46 11-211
Dis tron GmbH & Co
Behaims trasse 3
0-1000 Berlin 10
(49) 30 342 10 41-45
Hong Kong
CET Ltd. (REP)
22/F Chuang I s Finance Centre
81-85" Lockhart Road
Wanchai
(852) 5 200922
(FAX) 5 285764
Japan
Ryoyo Electric Corporation
Meishin Building
1-20-19 Nishiki
Naka-Ku, Nagoya, 460
(81) 52 2030277
Ryoyo Electric Corporation
Taiyo Shoj i Building
4-6 Nakanoshima
Kita-Ku, Osaka, 530
(81) 6 4481631
Ryoyo Electric Corporation
Konwa Building
12-22 Tsukiji, 1-Chome
Chuo-Ku, Tokyo
(81) 3 543771
Tokyo Electron Company, Ltd.
Sinj uku-Nomura Building
Tokyo 160
(81) 3 3434411
Norway
HEFRO E1ectronikk A/S
Postboks ,6, Haugenstua
N-0915 Oslo 9
(47) 210 73 00
Singapore
Dynamar International Ltd. (REP)
12. Lorong Bakar Batu, #05-11
Kolam Ayer Industrial Park
Singapore 1334
(65) 747-6188
India
Blue Star Ltd. (REP)
Sabri Complex 11 Floor
24 Res Idency Road
Bangalore 560 025
(91) 812-578881
Blue Star Ltd. (REP)
Sahas
414/2 Veer Sarvarkar
Prabhadevi
Bombay 400 025
(91) 22-430-6155
Blue Star Ltd.
(REP)
13 Communi ty Centre
New Friends Colony
New Delhi 110 065
(91) 11-633-773
Blue Star Ltd. (REP)
2-2-47/1108 Bo1arurn Road
Secunderabad 500-003
(91) 842-72057
Israel
Computation & - Measurement
Systems. Ltd. (REP)
11 Masad Street
P.o. Box 25089
Tel Aviv
(972) 3 388456
Korea
So. Africa
Supertek Korea Inc. (REP)
Han Ryo Building
34-2 Yoido-Dong
Youngdungpo-Ku, Seoul
(82) 2 782-9076/8
AdVanced Semiconductor Devices
(Pty) Ltd.
P.O. Box 2944
Johannesburg 2000, S .A.
(27) 11 802-5820
Malaysia
Spain
Dynamar International Ltd.
Lot 3.03, 3rd Floor,
Wisma, Esplanade
43. Green Hall, 10200 Penang
(60) 4 377269 or
4 377292
Diode Espana
Avda. Brasil 5. 1st Planta
E-Madrid 20
(34) 914 55 36 86
Sweden
Netherlands
Diode Nederland
Meidoornkade 22
NL- 3992 AE Houten
(31) 15 60 99 06
EBV Elektronik
3606 AK-Maarssenbroek
Planetenbaan 2
(31) 3/. 65 62 353
Traco AB
Box 103
5-12322 Farsta
(46) 893 00 00
ITT Multikomponent AB
Ankdammsgatan 32
Box 1330
S-17126 Solna
11-5
Morrihan Internati'onal Inc.
9F, No. 176
Fu, Hsing N. Road
Taipei
(886) 2 7151083
TUrkey
EMPA
Refik Saydam Cad 89/5
Sishane/Istanbul
United Kingdom
Celdis Ltd.
37-39 Loverock -Road
Reading. Berkshire
RG3 lED
(44) 734 585171
Farnell Electronic
Components Ltd.
Canal Road
Leeds LS12 2TU
(44) 532-636311
Jermyn Distribueion
Vestry Estate
Otford Road
Sevenoaks. Kent
TN14 5EU
(44) 732 450144
Macro Marketing Ltd.
Burnham Lane
Slough, Berkshire
SL1 6LN
(44) 628 64422
Yugoslavia
Elektrotehna
Do Junel 0.So1.0.
Tozd Elzas O. Sol. O.
Titova 81
61001 Lj ub1j ana
(38) 61 347749
(38) 61 347841
International Sales Offices
and Representatives
.---------.,-,-----:-::-----,--,::---------'-----------, Brisbane, Queensland
Product Line Sales/Support Key
Olflee
Key Product Line
Hewlett-Packard Australia Ltd.
A Analytical
10 Payne Road
CM Components
THE GAP, Queensland 4061
C Computer Systems
Tel: 61-7-300-4133
E Electronic Instruments & Measurement Systems
Telex: 42133
M Medical Products
Cable: HEWPARD Brisbane
P Personal Computation Products
A,C,CM,E,M,P
Sales only for specific product line
Support only for specific product line
Canberra, Australia
IMPORTANT: These symbols designate general product line capability. They do not insure sales or
g~fr~~1 Territory
support availability for all products within a line, at all locations. Contact your local sales office for Hewlett-Packard Australia Ltd.
in.:.:fo~rm.::.a::t.:.:io.::.n.::re:!'g::a:.:rd.::.in:.eg.::1o:.:c:::at:::io:.:,n::.s,e:w",h",er.:.e",H;,..P.:.su",p",p.:.or..:.t.:.:is-'a"-v;::.ai..:.la..:.b..:.le_fo"-r..:s2:.pe_c_if_ic-'-p_ro_d_uc_t_s._ _ _ _~ Thyn ne Street, Fern Hill Park
L:::
BRUCE, A.C.T. 2617
HEADQUARTERS OFFICES
P.O. Box 257,
If there is no sales office listed for your area, contact one of these headquarter offices.
JAMISON, A.C.T. 2614
Tel: 61-62-80-4244
UNITED KINGDOM
ANGOLA
ASIA
Telex: 62650
Hewlett-Packard Asia Ltd.
Hewlett-Packard Ltd.
Telectra Angola LOA
Cable: HEWPARD Canberra
Empresa Tecnica de
47/F,26 Harbour Rd ..
Nine Mile Ride
C,CM,E,P
Wanchai, HONG KONG
Equipamentos
WDKINGHAM
Melbourne, Victoria
G.P.O. Box 863, Hong Kong
Berkshire, RG113LL
16 rue Cons. Julio de Vihelma
Olfiee
Tel: 5-8330833
Tel: 0344 773100
LUANDA
Hewlett-Packard Australia Ltd.
Telex: 76793 HPA HX
Telex: 848805/848814/848912
Tel: 355 15,355 16
31-41 Joseph Street
Cable: HPASIAL TO
Telex:
3134
UNITED STATES OF
P.O, Box 221
E,P
AMERICA
CANADA
BLACKBURN, Victoria 3130
Hewlett-Packard (Canada) Ltd.
Customer Information Center
ARGENTINA
Tel: 61-3-895-2895
3877 Goreway Drive
(800) 752-0900
Hewlett-Packard Argentina SA
Telex: 31-024
MISSISSAUGA, Ontario L4V 1M8 6:00 AM to 5 PM Pacific Time
Montaneses 2140/50
Cable: HEWPARD Melbourne
Tel: (416) 678-9430
1428 BUENOS AIRES
EASTERN USA
A,C,CM,E,M,P
Telex: 069-8644
Tel: 541-11-1441
Hewlett-Packard Co.
Perth, Western Australia
Telex: 22796 HEW PAC-AR
EASTERN EUROPE
4 Choke Cherry Road
Olfiee
A,C,E,P
Hewlett-Packard Ges.m.b.h.
ROCKVILLE, MD 20850
Hewlett-Packard Australia Ltd.
Biotron
S,A.C,I.M.e.l.
Lieblgasse 1
Tel: (301) 948-6370
Herdsman
Business Park
Av. Paso Colon 221, Pi so 9
P.O. Box 72
MIDWESTERN USA
CLAREMONT, W.A. 6010
1399 BUENOS AIRES
A-1222 VIENNA, Austria
Hewlett-Packard Co.
Tel: 61-9-383-2188
Tel: 541-333-490,
Tel: (222) 2500-0
5201 Tollview Drive
Telex: 93859
541-322-587
Telex: 1 34425 HEPA A
ROLLING MEADOWS, IL 60008
Cable: HEWPARD Perth
Telex: 17595 BIDNAR
Tel: (312) 255-9800
NORTHERN EUROPE
C,CM,E,P
M
Hewlett-Packard SA
Laboratorio Rodriguez
SOUTHERN USA
Sydney, New South
V. D. Hooplaan 241
Corswant S.R.L.
Hewlett-Packard Co.
Wales Office
P.O. Box 999
Misiones, 1156-1876
2000 South Park Place
Hewlett-Packard Australia Ltd.
NL-118 LN 15AMSTELVEEN
Bernal, Oeste
ATLANTA, GA 30339
17-23 Talavera Road
The Netherlands
BUENOS AIRES
. Tel: (404) 955-1500
P.O. Box 308
Tel: 20 5479999
Tel: 252-3958, 252-4991
NORTH RYDE, N.SW. 2113
WESTERN USA
Telex: 18919 hpner
A
Tel:
61-2-888-4444
Hewlett-Packard Co.
Intermaco S.R.L.
SOUTHEAST EUROPE
Telex: 21561
5161 Lankershim Blvd.
Florida 537/71
Hewlett-Packard SA
Cable:
HEWPARD Sydney
NORTH HOLLYWOOD, CA 91601
Galeria Jardin-Local 28
World Trade Center
A,C,CM,E,M,P
Tel: (818) 505-5600
1005 BUENOS AIRES
110 Avenue Louis-Casai
AUSTRIA
OTHER
Tel: 393-4471/1928
1215 Cointrin, GENEVA
Hewlett-Packard Ges.m.b.h,
INTERNATIONAL
Telex: 22796 HEW PAC-AR
Switzerland
Verkaufsbuero Graz
AREAS
P (Calculators)
Tel: (022) 98 96 51
Grottenhofstrasse 94
Hewlett-Packard Co.
Argentina Esanco S.R.L.
Telex: 27225 hpser
A-8052 GRAZ
Intercontinental Headquarters
A/ASCO 2328
Mail Address:
Tel: 43-316-291-5660
3495 Deer Creek Road
1416 BUENOS AIRES
P.O. Box
Telex: 312375
PALO
ALTO,
CA
94304
Tel:
541-58-1981,
541-59-2767
CH-1217 Meyrin 1
C,E
Tel: (415) 857-1501
Telex: 22796 HEW PAC-AR
GENEVA
Telex: 034-8300
Hewlett-Packard Ges,m.b.h.
A
Switzerland
Cable: HEWPACK
All Computers SA
Lieblgasse 1
MIDDLE EAST AND
Montaneses 2140/505 Piso
P.O. Box 72
ALGERIA
CENTRAL AFRICA
A-1222
VIENNA
1428
BUENOS
AIRES
Hewlett-Packard Trading SA
Hewlett-Packard SA
Tel: 781-4030/4039/783-4886
Tel: 43-222-2500
Bureau de Liaison Alger
Middle East/Central
Telex: 18148 Ocme
Telex: 134425 HEPA A
Villa des Lions
Africa Sales H.O.
P
A,C,CM,E,M,P
9, Hai Galloul
7, rue du Bois-du-Lan
DZ-BORDJ
EL
BAHRI
AUSTRALIA
BAHRAIN
P.O. Box 364
Tel: 76 03 36
Adelaide, South
Green Salon
CH-1217 Meyrin 1
Telex:
63343
dilon
dz
P.O. Box 557
Australia Office
GENEVA
Hewlett-Packard Australia Ltd. MANAMA
Switzerland
153 Greenhill Road
Tel: 255503-250950
Tel: (022) 83 12 12
Telex: 84419
PARKSIDE, SA 5063
Telex: 27835 hmea ch
Tel: 61-8-272-5911
P
Telefax: (022) 83 1535
Telex: 82536
Cable: HEWPARD Adelaide
A',C,CM,E,P
11-6
Wael Pharmacy
P,O. Box 648
MANAMA
Tel: 256123
Telex: 8550 WAEL BN
E,M
Zayani Computer Systems
218 Shair Mubarak Building
Government Avenue
P.O. Box 5918
MANAMA
Tel: 276278
Telex: 9015 plans bn
P
BELGIUM
Hewlett-Packard Belgium SA/N.V.
Blvd de la Woluwe, 100
Woluwedal
B-1200 BRUSSELS
Tel: (02) 32-2-761-31-11
Telex: 23494 hew pac
A,C,CM,E,M,P
BERMUDA
Applied Computer Technologies
Atlantic House Building
P.O. Box HM 2091
Par-La-Ville Road
HAMILTON 5
Tel: 295-1616
Telex: 3803589/ ACT BA
P
BOLIVIA
Arrellano Ltda
Av. 20 de Octubre #2125
Casilla 1383
LA PAZ
Tel: 368541
M
BRAZIL
Hewlett-Packard do Brasil SA
Alameda Rio Negro, 750-L AND.
ALPHAVILLE
06400 Barueri SP
Tel: (011) 421.1311
Telex: (011) 71351 HPBR BR
Cable: HEWPACK 5ao Paulo
CM,E
Hewlett-Packard do Brasil SA
Praia de Botafago 228-A-614
6. AND.-CONJ,601
Edificio Argentina - Ala A
22250 RIO DE JANEIRO, RJ
Tel: (021) 552-6422
Telex: 21905 HPBR BR
Cable: HEWPACK Rio de Janeiro
E
Van Den Cientifica Ltda.
Rua Jose Bonifacio, 458
Todos os Santos
20771 RIO DE JANEIRO, RJ
Tel: (021) 593-8223
Telex: 33487 EGLB BR
A
ANAMED I.C.E.I. Ltda.
Rua Vergueiro, 360
04012 SAO PAULO, SP
Tel: (011) 572-1106
Telex: 24720 HPBR BR
M
Datatronix Electronica Ltda.
Av. Pacaembu 746-C11
SAO PAULO, SP
Tel: (118) 260111
CM
BRUNEI
Komputer Wisman Sdn Bhd
G6, Chandrawaseh Cmplx,
Jalan Tutong
P.O. Box 1297,
BAN DAR SERI BEGAWAN
NEGARA BRUNI DARUSSALAM
Tel: 673-2-2000-70/26711
C.E,P
CAMEROON
Beriac
B.P.23
DOUALA
Tel: 420 153
Telex: 5351
C,P
CANADA
Alberta
Hewlett-Packard (Canada) Ltd.
3030 3rd Avenue N.E.
CALGARY, Alberta T2A 6T7
Tel: (403) 235-3100
A,C,CM,E',M,P'
Hewlett-Packard (Canada) Ltd.
11120-178th Street
EDMONTON, Alberta ISS lP2
Tel: (403) 486-6666
A,C,CM,E,M,P
British Columbia
Hewlett-Packard (Canada) Ltd.
10691 Shell bridge Way
RICHMOND,
British Columbia V6X 2W8
Tel: (604) 270-2277
Telex: 610-922-5059
A,C,CM,E',M,P'
Hewlett-Packard (Canada) Ltd.
121-3350 Douglas Street
VICTORIA, British Columbia
V8Z 3L1
Tel: (604) 381-6616
C
Manitoba
Hewlett-Packard (Canada)Ltd.
1825 Inkster Blvd.
WINNIPEG, Manitoba R2X 1R3
Tel: (204) 694-2777
A,C,CM,E,M,P'
New Brunswick
Hewlett-Packard (Canada) Ltd.
814 Main Street
MONCTON, New Brunswick
E1C 1E6
Tel: (506) 855-2841
C
Nova Scotia
Hewlett-Packard (Canada) Ltd.
Suite 111
900 Windmill Road
DARTMOUTH, Nova Scotia
B3B lP7
Tel: (902) 46S-7820
C,CM,E',M,P'
Ontario
Hewlett-Packard (Canada) Ltd.
3325 N. Service Rd., Unit W03
BURLINGTON, Ontario UN 3G2
Tel: (416) 335-8644
C,M'
Hewlett-Packard (Canada) Ltd.
552 Newbold Street
LONDON, Ontario N6E 2S5
Tel: (519) 686-9181
A,C,CM,E',M,P'
Hewlett-Packard (Canada) Ltd.
6877 Goreway Drive
MISSISSAUGA, Ontario L4V 1M8
Tel: (416) 678-9430
Telex: 06S-83644
A,C,CM,E,M,P
Hewlett-Packard (Canada) Ltd.
2670 Queensview Dr.
OTTAWA, Ontario K2B 8K1
Tel: (613) 820-6483
A,C,CM,E',M,P'
Hewlett-Packard (Canada) Ltd.
3790 Victoria Park Ave.
WILLOWDALE, Ontario M2H 3H7
Tel: (416) 49S-2550
C,E
Quebec
Hewlett-Packard (Canada) Ltd.
17500 Trans Canada Highway
South Service Road
KIRKLAND, Quebec H9J 2XB
Tel: (514) 697-4232
Telex: 058-21521
A,C,CM.E,M,P'
Hewlett-Packard (Canada) Ltd.
1150 rue Claire Fontaine
QUEBEC CITY, Quebec G1R 5G4
Tel: (418) 648-0726
C
Hewlett-Packard (Canada) Ltd.
130 Robin Crescent
SASKATOON, Saskatchewan
S7L 6M7
Tel: (306) 242-3702
C
CHILE
ASC Ltda.
Austria 2041
SANTIAGO
Tel: 223-5946, 223-6148
Telex: 392-340192 ASC CK
C,P
Jorge Calcagni y Cia
Av. Italia 634 Santiago
Cas ilia 16475
SANTIAGO 9
Tel: S-Oll-562-222-0222
Telex: 392-440283 JCYCL CZ
CM.E,M
Metrolab S.A.
Monjitas 454 of. 206
SANTIAGO
Tel: 395752, 398296
Telex: 340866 METLAB CK
A
Olympia (Chile) Ltda.
Av. Rodrigo de Araya 1045
Casilla 256-V
SANTIAGO 21
Tel: 225-5044
Telex: 340892 OLYMP
Cable: Olympiachile
Santiagochile
C,P
CHINA, People's.
Republic of
China Hewlett-Packard Co., Ltd.
471F China Resources Bldg.
26 Harbour Road
HONG KONG
Tel: 5-8330833
Telex: 76793 HPA HX
Cable: HP ASIA LTO
A',M'
China Hewlett-Packard Co., Ltd.
P.O. Box 9610, Beijing
4th Floor,
2nd Watch Factory Main
Shuang Yu Shou,
Bei San Huan Road
Hai Dian District
BEIJING
Tel: 33-1947 33-7426
Telex: 22601 CTSHP CN
Cable: 1920 Beijing
A,C,CM,E,M,P
China Hewlett-Packard Co., Ltd.
CHP Shanghai Branch
23/F Shanghai Union Building
100 Van An Rd. East
SHANG-HAl
Tel: 265550
Telex: 33571 CHPSB CN
Cable: 3416 Shanghai
A,C,CM,E,M,P
COLOMBIA
Instrumentacion
H.A. Langebaek &Kier S.A.
Carrerra 4A NO.52A-26
Apartado Aereo 6287
BOGOTA 1, D.E.
Tel: 212-1466
Telex: 44400 INST CO
Cable: AARIS Bogota
CM,E,M
Nefromedicas Ltda.
Calle 123 No. 9B-31
Apartado Aereo 100-958
BOGOTA D.E, 10
Tel: 213-5267, 213-1615
Telex: 43415 HEGAS CO
A
Compumundo
Avenida 15 # 107-80
BOGOTA D.E.
Tel: 57-214-4458
Telex: 39645466 MARCO
P
Carvajal, S.A.
Calle 29 Norte No. 6A-40
Apartado Aereo 46
CALI
Tel: S-011-57-3-621888
Telex: 39655650 CUJCL CO
C,E,P
CONGO
Seric-Congo
B.P.2105
BRAZZAVILLE
Tel: 815034
Telex: 5262
COSTA RICA
Cientifica Costarricense SA
Avenida 2, Calle 5
San Pedro de Montes de Dca
Apartado 10159
SAN JOSE
Tel: S-011-506-243-820
Telex: 3032367 GALGUR CR
CM,E,M
O.Fischel R. Y. Cia. SA
Apartados 434-10174
SAN JOSE
Tel: 23-72-44
Telex: 2379
Cable: OFIR
A
11-7
CYPRUS
Telerexa Ltd.
P.O. Box 1152
Valentine House
8 Stassandrou SI.
NICOSIA
Tel: 45 628, 62698
Telex: 5845 IIrx cy
E,M,P
DENMARK
Hewlett-Packard A/S
Kongevejen 25
DK-3460 BIRKEROD
Tel: 45-02-81-6640
Telex: 37409 hpas dk
A,C,CM,E,M,P
Hewlett-Packard A/S
Rolighedsvej 32
DK-8240 RISSKOV, Aarhus
Tel: 45-06-17-6000
Telex: 37409 hpas dk
C,E
DOMINICAN REPUBLIC
Microprog S.A.
Juan Tomas Mejia y Cotes No. 60
Arroyo Hondo
SANTO DOMINGO
Tel: 565-6268
Telex: 4510 ARENTA DR (RCA)
P
ECUADOR
CYEDE Cia. Ltda.
Avenida Eloy Alfaro 1749
y Belgica
Casilla 6423 CCI
QUITO
Tel: S-011-593-2-450975
Telex: 39322548 CYEDE ED
E,P
Medtronics
Valladolid 524 Madrid
P.O. 9171, QUITO
Tel: 2-238-951
Telex: 2298 ECUAME ED
A
Hospitalar S.A.
Robles 625
Casilla 3590
QUITO
Tel: 545-250,545-122
Telex: 2485 HOSPTL ED
Cable: HOSPITALAR-Quito
M
Ecuador Overseas Agencies C.A.
Calle 9 de Octubre #818
P.O. Box 1296, Guayaquil
QUITO
Tel: 306022
Telex: 3361 PBCGYE ED
M
EGYPT
Sakrco Enterprises
P.O. Box 259
ALEXANDRIA
Tel: 802908, 808020, 805302
Telex: 54333
C
International Engineering
Associates
6 EI Gamea Street
Agouza
CAIRO
Tel: 71-21-68134-80-940
Telex: 93830 lEA UN
Cable: INTEGASSO
E
Sakrco Enterprises
70 Mossadak Street
Dokki, Giza
CAIRO
Tel: 706440, 701 087
Telex: 9337
C
S.S.C. Medical
40 Gezerat EI Arab Street
Mohandessin
CAIRO
Tel: 803844, 805998, 810263
Telex: 20503 SSC UN
M'
ELSALVADOR
IPESA de EI Salvador S.A.
29 Avenida Norte 1223
SAN SALVADOR
Tel: S-011-503-266-858
Telex: 301 205391PESA SAL
A,C,CM,E,P
ETHIOPIA
Seric-Ethiopia
P.O. Box 2764
ADDIS ABABA
Tel: 185114
Telex: 21150
C,P
FINLAND
Hewlett-Packard Finland
Field Oy
Niittylanpolku 10
00620 HELSINKI
Tel: (90) 757-1011
Telex: 122022 Field SF
CM
Hewlett-Packard Oy
Piispankalliontie 17
02200 ESPOO
Tel: (90) 887-21
Telex: 121563 HEWPA SF
A,C,E,M,P
FRANCE
Hewlett-Packard France
Z.I. Mercure B
Rue Berthelot
13763 Les Milles Cedex
AIX-EN-PROVENCE
Tel: 33-42-5S-4102
Telex: 410770F
A,C,E,M
Hewlett-Packard France
64, Rue Marchand Saillant
F-61 000 ALENCON
Tel: (33) 29 04 42
C~'
Hewlett-Packard France
Batiment Levitan
2585, route de Grasse
Bretelle Autoroute
06600 ANTIBES
Tel: (93) 74-5S-19
'C
FRANCE (Cont'd) ,
Hewlett-Packard France
28 Rue de ,Ia Republique
Boite Postale 503
25026 BESANCON Cedex
Tel: (81) 83-16-22
Telex: 361157
C.E'
Hewlett-Packard France
ZA Kergaradec
Rue Fernand Forest
F-29239 GOUEESNOU
Tel: (98) 41-87-90 '
E
Hewlett-Packard France
Chemin des Mouilles
Boite Postale 162
69131 ECULLY Cedex (Lyon)
Tel: 33-78-33-8125'
,
Telex: 310617F
A,C.E,M,P'
Hewlett-Packard France
Parc d'activites du Bois Briard
2 Avenue du Lac
F-91040 EVRY Cedex
Tel: 3311/6077 9660
Telex: 692315F
C
Hewlett-Packard France
Application Center
5, avenue Raymond Chanas
38320 EYBENS (Grenoble) ,
Tel: (76) 62-57-98
Telex: 980 124
HP GRENOB EYBE
C
Hewlett-Packard France
Rue Fernand, Forest
Z.A. Kergaradec
29239 GOUESNOU
Tel: (98) 41-87-90
Hewlett-Packard France
Parc Club des Tanneries
Batiment B4
4, Rue de la Faisanderie
67381 LlNCOLSHEIM
(Strasbourg)
Tel: (88) 76-15-00
Telex: 890141F
C,E',M',P'
Hewlett-Packard France
Centre d'aflalres Paris-Nord'
Batiment Ampere
Rue de la Commune de Paris
Boite Postale 300
93163 LE BLANC-MESNIL
Tel: (1) 865-44-52.
Telex: 211032F
C,E,M
Hewlett-Packard France
Parc d'activites Cadera
Quartier Jean-Mermoz
Avenue du President JF
Kennedy
33700 MERIGNAC (Bordeaux)
Tel: 33-56-34-0084
Telex: 550105F
C,E,M
Hewlett-Packard France
3, Rue Graham Bell
BP 5149
57074 METZ Cedex
Tel: (87) 36-13-31
Telex: 860602F
C,E.
Hewlett-Packard,France
Miniparc-ZIRST
Chemin du Vieux Chene
38240 MEYLAN (Grenoble)
Tel: (76) 90-38-40
980124 HP Grenobe
C
Hewlett-Packard France
Bureau vert du Bois Briand
Cheman de la Garde
-CP 212 212
44085 NANTES Cedex
Tel: (40) 5{)-32-22
Telex: 711085F
A,C,E,CM',P
Hewlett-Packard France
125: Ruedu Faubourg
Bannier
,':'
45000 ORLEANs
Tel: 33-38-62-2031
E,P'
Hewlett-Packard France
Zone Industrielle de
Courtaboeuf
Avenue des Tropiques
91947 LES ULiS Cedex
(Orsay)
Tel: 33-6-907 7825
Telex: 600048F
A,C,CM,E,M,P"
Hewlett-Packard'France
15, Avenue de L:Amiral-Bruix
75782 PARIS Cedex 16
Tel: 33-15-02-1220
Telex: 613663F
C,P'
Hewlett-Packard France
242 Ter. Ave J Mermoz
64000 PAU
Tel: 33-59-8{)-3802
Telex: 550365F
C,E'
Hewlett-Packard France
6, Place Sainte Croix
86000 POITIERS
Tel: 33-49-41-2707
Telex: 792335F
C,E'
Hewlett-Packard France
47, Rue de Chativesle
51100 REIMS
Tel: 33-26-88-6919
C,P'
Hewlett-Packard France
Parc d'activites de la Poterie'
Rue Louis Kerautel-Botmel
35000 RENNES
Tel: 33-99-51-4244
Telex: 740912F
A',C,E,M,P'
Hewlett-Packard France
98 Avenue de Bretagne
76100 ROUEN
Tel: 33-35-63-5766
Telex: 770035F
C,E
Hewlett-Packard France
4. Rue Thomas-Mann
Boita Posta Ie 56
67033 STRASBOURG Cedex
Tel: (88) 26-56-46,
Telex: 890141F
C,E,M,P'
Hewlett-Packard France
Le Peripoledll
3. Chemin du Pigeonnier de
la Cepiere
31081 TOULOUSE Cedex
Tel: 33-61-4{)-1112
Telex: 531639F
A,C,E,M,P"
Hewlett-Packard France
Les Cardoulines
Batiment B2
Route des Oolines
Parc d'activite de Val bonne
Sophia Antipolis
06560 VALBONNE (Nice)
Tel: (93) 65-39-40' "
C
Hewlett-Packard France
9, Rue Baudin
26000 VALENCE
Tel: 33-75-42-7616
C"
Hewlett-Packard'France
Carolor
ZAC de Bois Briand
57640 VIGY (Metz)
Tel: (8) 771 2022
C
Hewlett-Packard France
Parc d'activite des Pres
1, Rue Papin Cedex
59658 VILLENEUVE O'ASCQ
Tel: 33-2{)-91-4125
Telex: 160124F
Telex: 160124F
C,E,M,P
Hewlett-Packard France
Parc d'activites Paris-Nord 11
Boite Postale 60020
95971 Roissy Charles de Gaulle
VILLEPINTE
Tel: (1) 48 63 80 80
Telex: 211032F
C,E,M,P'
GABON
Sho Gabon
P.O. Box 89
LIBREVILLE
Tel: 721 484
Telex: 5230
GERMAN FEDERAL
REPUBLIC
Hewlett-Packard GmbH
Vertriebszentrum Mitte
Hewlett-Packard-Strasse
0-6380 BAD HOMBURG
Tel: (06172) 40{)-0
Telex: 410 844 hpbhg
A,C,E,M,P
Hewlett-Packard GmbH
Geschaftsstelle
Keithstrasse 2-4
0-1000 BERLIN 30
Tel: (030) 21 9904-0
Telex: 018 3405 hpbln d
A,C,E,M,P
11-8
Hewlett-Packard GmbH '
Verblndungsstelle Bonn
Friedrich-Ebert-Allee 26
5300 BONN
Tel: (0228) 234001
Telex: 8869421
Hewlett-Packard GmbH
Vertriebszentrun Sud west
Schickardstrasse 2
0-7030 BOBLINGEN
Postlach 1427
Tel: (07031) 645-0
Telex: 7265743 hep
A,C,CM,E,M,P
Hewlett-Packard GmbH
Zeneralbereich Mktg
Herrenberger Strasse 130
0-7030 BOBLINGEN
Tel: (07031) 14-0
Telex: 7265739 hep
Hewlett-Packard GmbH
Geschaftsstelle
Schleefstr. 28a
0-4600 00RTMUNO-41
Tel: (0231) 45001
Telex: 822858 hepdod
A,C,E
Hewlett-Packard GmbH
Reparaturzentrum Frankfurt
Berner Strasse 117
6000 FRANKFURT /MAIN 60
Tel: (069) 500001-0
Telex: 413249 hpffm
Hewlett-Packard GmbH
Vertriebszentrum Nord
Kapstadtring 5
0-2000 HAMBURG 60
Tel: 49-4{)-63-804-0
Telex: 021 63032 hphh d
A,C,E,M,P
Hewlett-Packard GmbH
Geschaftsstelle
Heidering 37-39
0-3000 HANNOVER 61
Tel: (0511) 5706-0
Telex: 092 3259 hphan
A,C,CM,E,M,P
Hewlett-Packard GmbH
Geschaftsstelle
Rosslauer Weg 2-4
0-6800 MANNHEIM
Tel: 49-0621-7{)-05-0
Telex: 0462105 hpmhm
A,C,E
Hewlett-Packard GmbH
Geschaftsstelle
Messerschmittstrasse 7
0-7910 NEU ULM
Tel: 49-0731-7{)-73-0 ..
Telex: 0712816 HP ULM-O
A,C,E'
Hewlett-Packard GmbH
Geschaftsstelle
Emmericher Strasse 13
0-8500 NURNBERG 10
Tel: (0911) 5205-0
Telex: 0623 860 hpnbg
C,CM,E,M,P
Hewlett-Packard GmbH
Vertriebszentrum ,Ratingen
Berliner Strasse 111
0-4030 RATI NGEN 4
Postfach 3112
Tel: (02102) 494-0
Telex: 589070 hprad
A.C,E,M,P
Hewlett-Packard GmbH
Vertriebszentrum Muchen
Eschenstrasse 5
0-8028 TAUFKIRCHEN
Tel: 49-89-61-2070
Telex: 0524985 hpmch
A,C,CM,E.M,P
Hewlett-Packard GmbH
Geschaftsstelle
Ermlisallee
7517 WALOBRONN 2
Postfach 1251
Tel: (07243) 602-0
Telex: 782 838 hepk
A,C,E
GREAT BRITAIN
See United Kingdom
GREECE
Hewlett-Packard A.E.
178. Kirissias Ave. Je
6th Floor
Halandri-ATHENS
Greece
Tel: 301116473360,
301116726090
Telex: 221 286 HPHLGR
A,C,CM",E,M;P
Kostas Karaynnis SA
8, Omirou Street
ATHENS 133
Tel: 32 30 303,32 37 371
Telex: 215962 RKAR GR
A,C',CM,E
Impexin
Intelect Oiv,
209 Mesogion
11525 ATHENS
Tel:. 647448112
Telex: 216286
P
Haril Company
38, Mihalakopoulou
ATHENS 612
Tel: 7236071
Telex: 218767
M'
Hellamco
P.O. Box 87528
18507 PIRAEUS
Tel: 4827049
Telex: 241441
A
GUATEMALA
IPESA DE GUATEMALA
Avenida Reforma ~48, Zona 9
GUATEMALA CITY
Tel: 316627, 317853,66471/5
9-011-502-2-316627 ,
Telex: 3055785IPESA GU
A,C,CM,E,M,P
Blue Star Ltd.
HONG KONG
Hewlett-Packard Hong Kong, Ltd. 7 Hare Street
P.O. Box 506
G.P.O. Box 795
5th Floor, Sun Hung Kai Centre CALCUTTA 700 001
Tel: 230131, 230132
30 Harbour Road, Wan Chai
Telex: 031-61120 BSNF IN
HONG KONG
Cable: BLUESTAR
Tel: 852-5-832·3211
A,M,C,E
Telex: 66678 HEWPA HX
Cable: HEWPACK HONG KONG
Blue Star Ltd.
E,C,P
133 Kodambakkam High Road
MADRAS 600 034
CET Ltd.
10th Floor, Hua Asia Bldg.
Tel: 472056, 470238
Telex: 041-379
64-66 Gloucester Road
Cable: BLUESTAR
HONG KONG
Tel: (5) 200922
A,M
Telex: 85148 CET HX
Blue Star Ltd.
CM
13 Community Center
Schmidt &Co. (Hong Kong) Ltd. New Friends Colony
18th Floor, Great Eagle Centre
NEW DELHI 110 065
23 Harbour Road, Wanchai
Tel: 682547
Telex: 031-2463
HONG KONG
Cable: BLUEFROST
Tel: 5-8330222
Telex: 74766 SCHMC HX
A,C',CM,E,M
A,M
Blue Star Ltd.
15/16 C Wellesley Rd.
ICELAND
Hewlett-Packard Iceland
PUNE 411011
Hoe/dabakka 9
Tel: 22775
112 REYKJAVIK
Cable: BLUESTAR
Tel: 354·1-67-1000
A
Telex: 37409
Blue Star Ltd.
A,C,CM,E,M,P
2-2-47/1108 Bolarum Rd.
SECUNDERABAD 500 003
tNDIA
Computer products are sold
Tel: 72057, 72058
through Blue Star Ltd. All
Telex: 0155-459
computer repairs
Cable: BLUEFROST
and maintenance service
A,C,E
is done through Computer
Blue Star Ltd.
Maintenance Corp.
T.C. 7/603 Poornima
Blue Star Ltd.
Maruthunkuzhi
B. D. Patel House
TRIVANDRUM 695013
Near Sardar Patel Colony
Tel: 65799, 65820
AHMEDABAD 380 014
Telex: 0884-259
Tel: 403531, 403532
Cable: BLUESTAR
Telex: 0121-234
E
Cable: BLUE FROST
Computer Maintenance
A,C,CM,E
Corporation Ltd.
81ue Star Ltd.
115, Sarojini Devi Road
SECUNDERABAD 500 003
40/4 Lavelle Road
Tel: 310-184, 345-774
BANGALORE 560 001
Tel: 57881, 867780
Telex: 031-2960
Telex: 0845·430 BSLBIN
C"
Cable: BLUESTAR
INDONESIA
A,C',CM,E
BERCA Indonesia P.T.
P.O. Box 496/Jkl.
Blue Star Ltd.
Band Box House
JI. Abdul Muis 62
Prabhadevi
JAKARTA
Tel: 21-373009
BOMBA Y 400 025
Tel: 4933101, 4933222
Telex: 46748 BERSAL IA
Cable: BERSAL JAKARTA.
Telex: 011·71051
Cable: BLUESTAR
P
A,M
BERCA Indonesia P.T.
P.O. Box 2497/Jkl.
Blue Star Ltd.
Antara Bldg .. 12th Floor
Sahas
JL Medan Merdeka Selatan 17
414/2 Vir Savarkar Marg
JAKARTA-PUSAT
Prabhadevi
Tel: 21·340417
BOMBAY 400 025
Telex: 46748 BERSAL IA
Tel: 422-6155
A,C,E,M,P
Telex: 011-71193 BSSS IN
Cable: FROSTBLUE
BERCA Indonesia P.T.
A,CM,E,M
Jalan Kutai 24
Blue Star Ltd.
SURABAYA
Kalyan, 19 Vishwas Colony
Tel: 67118
Alkapuri, BORODA, 390005
Telex: 31146 BERSAL SB
Tel: 65235, 65236
Cable: BERSAL-SURABAYA
Cable: BLUE STAR
A',E,M,P
A
IRAQ
Hewlett-Packard Trading·S.A.
Service Operation
AI Mansoor City 9B/3/7
BAGHDAD
Tel: 551-49-73
Telex: 212-455 HEPAIRAQ IK
C
IRELAND
Hewlett-Packard Ireland Ltd.
Temple House, Temple Road
Blackrock, Co. DUBLIN
Tel: 88/333/99
Telex: 30439
C,E,P
Hewlett-Packard Ltd.
75 Belfast Rd, Carrick/erg us
Belfast BT38 8PH
NORTHERN IRELAND
Tel: 09603·67333
Telex: 747626
M
ISRAEL
Eldan Electronic Instrument Ltd.
P.O. Box 1270
JERUSALEM 91000
16, Ohaliav SI.
JERUSALEM 94467
Tel: 533 221, 553 242
Telex: 25231 AB/PAKRD IL
A,M
Computation and Measurement
Systems (CMS) Ltd.
11 Masad Street
67060
TEL-AVIV
Tel: 388388
Telex: 33569 MotillL
C,CM,E,P
tTALY
Hewlett-Packard Italiana S.p.A.
Traversa 99C
Via Glulio Petroni, 19
1-70124 BARI
Tel: (080) 41-07-44
C,M
Hewlett-Packard Italian a S.p.A.
Via Emilia, 51/C
1-40011 BOLOGNA Anzola
Dell'Emilia
Tel: 39-051-731061
Telex: 511630
C,E,M
Hewlett-Packard Italiana S.p.A.
Via PrinCipe Nicola 43G/C
1-95126 CA TANIA
Tel: (095) 37-10-87
Telex: 970291
C
Hewlett-Packard Italiana S.p.A.
Via G. di Vittorio 10
20094 CORSICO (Milano)
Tel: 39-02-4408351
Hewlett-Packard Italiana S.p.A.
Viale Brigata Bisagno 2
16129 GENOVA
Tel: 39-10-541141
Telex: 215238
Hewlett·Packard Italiana S.p.A.
Viale G. Modugno 33
1-16156 GENOVA PEGU
Tel: (010) 68-37-07
Telex: 215238
C,E
11-9
Hewlett-Packard Italiana S.p.A
Via G. di Vittorio 9
1-20063 CERNUSCO SUL
NAVIGLIO
(Milano)
Tel: (02) 923691
Telex: 334632
A,C,CM,E,M,P
Hewlett·Packard Italiana S.p.A.
Via Nuova Rivoltana 95
20090 LlMITO (Milano)
Tel: 02-92761
Hewlett-Packard Italiana S.p.A.
Via Nuova San Rocco a
Capodimonte, 62/ A
1-80131 NAPOLt
Tel: (081) 7413544
Telex: 710698
A",C,E,M
Hewlett-Packard Italiana S.p.A.
Via Orazio 16
80122 NAPOLI
Tel: (081) 7611444
Telex: 710698
Hewlett-Packard Italiana, S.p.A.
Via Pellizzo 15
35128 PADOVA
Tel: 39-49·664-888
Telex: 430315
A,C,E,M
Hewlett-Packard Italiana S.p.A.
Viale C. Pavese 340
1-00144 ROMA EUR
Tel: 39-65-48-31
Telex: 610514
A,C,E,M,P'
Hewlett-Packard Italiana S.p.A.
Via di Casellina 571C
500518 SCANDICCI-FIRENlE
Tel: 39-55·753863
C,E,M
Hewlett-Packard Italiana S.p.A.
Corso Svizzera, 185
1-10144 TORINO
Tel: 39-11-74-4044
Telex: 221079
A',C,E
IVORY COAST
S.I.T.E.L.
Societe Ivoirienne de
Telecommunications
Bd. Giscard d'Estaing
Carre/our Marcory
lone 4.A.
Boite postale 2580
ABIDJAN 01
Tel: 353600
Telex: 43175
E
S.I.T.I.
Immeuble "La General"
Av.du General de Gaulle
01 BP 161
ABIDJAN 01
Tel: 321227
Telex: 22149
C,P
JAPAN
Yokogawa-Hewlett-Packard Ltd.
152-1, Onna
ATSUGI, Kanagawa, 243
Tel: (0462) 25-0031
C,CM,E
Yokogawa-Hewlett-Packard Ltd.
Meiji·Seimei Bldg. 6F
3-1 Motochiba-Cho
CHIBA,280
Tel: (0472) 257701
C,E
Yokogawa-Hewlett-Packard Ltd.
Yasuda-Seimei Hiroshima Bldg.
6-11, Hon-dori, Naka-ku
HIROSHIMA,730
Tel: (082) 241-0611
Yokogawa-Hewlett-Packard Ltd.
Towa Building
2-2-3 Kaigan·dori, Chuo-ku
KOBE,650
Tel: (078) 392-4791
C,E
Yokogawa-Hewlett-Packard Ltd.
Kumagaya Asahi 82 Bldg.
3-4 Tsukuba
KUMAGAYA, Saitama 360
Tel: (0485) 24-6563
C,CM,E
Yokogawa·Hewlett-Packard Ltd.
Asahi Shinbun Daiichi Seimei Bldg.
4-7, Hanabata-cho
KUMAMOTO, 860
Tel: 95-354-7311
C,E
Yokogawa-Hewlett-Packard Ltd.
Shin-Kyoto Center Bldg.
614, Higashi-Shiokoji-cho
Karasuma-Nishiiru
KYOTO, 600
Tel: 075-343-0921
C,E
Yokogawa-Hewlett-Packard Ltd.
Mito Mitsui Bldg.
1-4-73, Sanno-maru
MITO, Ibaraki 310
Tel: (0292) 25-7470
C,CM,E
YOkogawa-Hewlett-Packard Ltd.
Meiji-Seimei Kokubun Bldg.
7-8 Kokubun, 1 Chome, Sendal
MIYAGI,980
Tel: (0222) 25-1011
C,E
Yokogawa-Hewlett-Packard Ltd.
Gohda Bldg. 2F
1-2-10 Gohda Okaya-Shi
Okaya-Shi
NAGANO, 394
Tel: (0266) 23 0851
C,E
Yokogawa-Hewlett-Packard Ltd.
Nagoya Kokusai Center Building
1-47-1, Nagono, Nakamura-ku
NAGOYA, AICHI450
Tel: (052) 571-5171
C,CM,E,M
YOkogawa-Hewlett-Packard Ltd.
Sai·Kyo-Ren Building
1-2 Dote·cho
OOMIYA·SHI SAITAMA 330
Tel: (0486) 45-8031
JAPAN (Cont'd)
Yokogawa·Hewlett,Pack
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