1989_Samsung_Linear_IC_Vol_2_Telecom_Industrial 1989 Samsung Linear IC Vol 2 Telecom Industrial
User Manual: 1989_Samsung_Linear_IC_Vol_2_Telecom_Industrial
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Data Book
I
II I
IIII 1. . __
Lin_e_ar_IC
-------1
I I II
VOL 2, 1989
I ,
I, ,
-Telecom
-Industrial
Copyright 1989 by Samsung
All rights reserved. No part of this publication may be reproduced, stored in a retrieval
system, or transmitted in any form or by any means, electronic, mechanical, photo copying,
recording, or otherwise, without the prior written permission of Samsung.
The information contained herein is subject to change without notice. Samsung
assumes no responsibility for the use of any circuitry other than circuitry embodied in
a Samsung product.
No other circuit patent licenses are implied.
SAMSUNG
DATA BOOK LIST
I. Semiconductor Product Guide
II. Transistor Data Book
Vol. 1: Small Signal TR
Vol. 2: Bipolar Power TR
Vol. 3: TR Pellet
III. Linear IC Data Book
Vol. 1: AudioNideo
Vol. 2: Telecom/lndustrial
Vol. 3: Data Converter IC
IV. CMOS Consumer IC Data Book
V. High Speed CMOS Logic Data Book·
VI. MaS Memory Data Book
VII. SFET Data Book
VIII. MPR Data Book
IX. CPL Data Book
X. Dot Matrix Data Book
LINEAR Ie DATA BOOK
VOLUME 1.
AUDIO les
VIDEO ICs
TOY RADIO CONTROL ACTUATOR
VOLUME 2.
TELECOM ICs
VOLTAGE REGULATORs
VOLTAGE REFERENCEs
OPERATIONAL AMPLIFIERs
COMPARATORs
TIMERs
VOLUME 3.
DATA CONVERTER ICs
TABLE OF CONTENTS
(VOLUME 2)
I.
QUALITY and RELIABILITY .........................................................'"
II.
PRODUCT GUIDE
21
1. Function Guide ........................................................................................... 61
2. Cross Reference Guide .............................................................................. 72
3. Ordering Information .................................................................................. 78
III.
IV.
TELECOMMUNICATION ICs .........................................................
79
INDUSTRIAL ICs
1.
2.
3.
4.
5.
Voltage Regulators .................................................................................... 313
Voltage References .................................................................................. 458
Operational Amplifiers ............................................................................. 472
Comparators .............................................................................................. 545
Timers ........................................................................................................ 577
V.
MISCELLANEOUS ICs ..................................................................... 601
VI.
PACKAGE DIMENSIONS ............................................................... 639
VII.
SALES OFFICES and MANUFACTURER'S
REPRESENTATIVES .......................................................................... 647
ALPHANUMERIC INDEX
Device
KA33V
KA201A
KA219
KA301A
KA319
KA331
KA336-5.012.5
KA337
KA340
KA350
KA431
KA710CII
KA711CII
KA733C
KA1222
KA2101
KA2102A
KA2103L
KA2104
KA2105
KA2106
KA2107
KA2130A
KA2131
KA2133
KA2134
KA2135
KA2136
KA2137
KA2153
KA2154
KA2181
KA2182
KA2183
KA2201B
KA2201/N
KA2206
KA22062
KA2209
KA2210
KA2211
KA2212
KA2213
KA22131
KA22135
KA2214
KA2220
KA2221
Function
Silicon Monolithic Bipolar Integrated Circuit Voltage
Stabilizer for Electronic Tuner
Single Operational Amplifier
Dual High Speed Voltage Comparator
Single Operational Amplifier
Dual High Speed Voltage Comparator
Voltage to Frequency Converter
Voltage Reference Diode
lA Negative Adjustable Voltage Regulator
1A Positive Voltage Regulator
3 AMP Adjustable Positive Voltage Regulator
Programmable Precision Reference
High Speed Voltage Comparator
Dual High-Speed Differential Comparator
Differential Video Amplifier
Dual Low Noise Equalizer AMP
TV Sound IF AMP
TV Sound System
Sound Mute System for TV
Auto Power off and Sound Mute System for TV
Limiter AMP and Detector for a TV SIF
Dual Sound Multiplex for a TV SIF
DC Volume, Tone Control Circuit
TV Vertical Deflection System
TV Vertical Output Circuit
1 Chip Deflection System
Color TV Deflection Signal Processing IC
Horizontal Signal Processing IC
Low Noise TV Vertical Deflection System
TV Horizontal Processor
Video-Chroma Deflection System for a Color TV
Video-Chroma Deflection System for a Color TV
Remote Control Pre-AM P
Remote Control Pre-AMP
Remote Control Pre-~MP
0.5W Audio Power AMP
1.2W Audio Power AM P
2.3W Dual Audio Power' AMP
4.3W Dual Power AMP
Dual Low Voltage Power AMP
5.5W Dual Power AMP
5.8W Dual Power AMP
O.5W Audio Power AMP
One Chip Tape Recorder System
Dual Pre-Power AMP for Auto Reverse
Dual Pre-Power AMP and DC Motor Speed Controller
lW Dual Power AMP
Equalizer AMP with ALC
Dual Low Noise Equalizer AMP
Package
TO-92
8 DIP/3 SOP
14 DIP/14 SOP
8 DIP/8 SOP
14 "DIP/14 SOP
8 DIP/8 SOP
TO-92
TO-220
TO-220
TO-3P
TO-92/8 DIP/8 SOP
14 DIP/14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
8 SIP
14 DIP
14 DIP HIS
8 SIP
9 SIP
9 SIP
16 DIP
12 SIP
10 SIP HIS
10 SIP HIS
16 DIP HIS
18 DIP
12 SIP
12 ZDIP/F
16 DIP
42 DIP
42 DIP
8 SIP
8 SIP
8 SIP
8 DIP
8 DIP
12DIP/F
12DIP/F
8 DIP
12 SIP HIS
12 SIP HIS
9 SIP
14 DIP HIS
24 SOP
22 SDIP
14 DIP HIS
9 SIP
8 SIP
Page
603
472
545
472
545
607
458
313
317
329
466
550
554
477
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
ALPHANUMERIC INDEX
Device
KA22211
KA2223
KA22233
KA22235
KA2224
KA22241
KA2225/D
KA22261
KA2230
KA22421/D
KA22424
KA2243
KA2244
KA22441
KA2245
KA22461
KA2247
KA22471
KA2248A/D
KA2249/D
KA2261
KA2262
KA2263
KA2264/D
KA2265
KA22682
KA2268N
KA2281
KA2283
KA2284
KA2285
KA2286
KA2287
KA2288
KA2303
KA2304
KA2401
KA2402
KA2404
KA2407
KA2410
KA2411
KA2412A
KA2413
KA2418
KA2425A/B
KA2580A
KA2588A
KA2605
KA2606
(Continued)
Function
Dual Low Noise Equalizer AMP
5 Band Graphic Equalizer AMP
3 Band Dual Graphic Equalizer AMP
5 Band Graphic Equalizer AMP
Dual Equalizer AMP with ALC
Dual Equalizer AMP with ALC
Dual Pre-AMP for 3V Using
Dual Equalizer AMP with REC AMP
9-Program Music Selector
AM 1 Chip Radio
AM/FM 1 Chip Radio
AM/FM IF System
FM IF System for Car Radio
FM IF System for Car Stereo
FM IF System for Car Radio
Electronic Tuning AM Radio Receiver for Car Stereo
FM IF/AM Tuner System
FM IF/AM Tuner System
3V FM IF/AM Tuner System
FM Front End for Portable Radio
FM Stereo Multiplex Decoder
FM Stereo Multiplex Decoder
FM Stereo Multiplex Decoder
FM Stereo Multiplex Decoder
VCO Non-Adjusting FM Stereo Multiplex Decoder
1 Chip TV MPX Demodulator
1 Chip TV Sound MPX
5 DOT Dual LED Level' Meter Driver
5 DOT Dual LED Level Meter Driver
5 DOT LED Level Meter Driver
5 DOT LED Level Meter Driver
5 DOT LED Linear Level Meter Driver
5 DOT LED Linear Level Meter Driver
7 DOT LED Level Meter Driver
Toy Radio Control Actuator
Toy Radio Control Actuator
DC Motor Speed Controller
Low Voltage DC Motor Speed Controller
DC Motor Speed Controller
DC Motor Speed Controller
Tone Ringer
Tone Ringer
Telephone Speech Circuits
Dual Tone Multi Frequency Generator
Tone Ringer with Bridge Diode
Telephone Speech Network with Dialer Interface
8-Channel Source Drivers
8-Channel Source Drivers
SYNC Separator
SYNC Separator
Package
8 SIP
16 DIP
22 DIP
18 ZIP
14 DIP
9 SIP
16 DIP/16 SOP
16 DIP
22 DIP
16 DIP/16 SOP
16 DIP
16 DIP
9 SIP
16 ZIP
7 SIP
19 ZIP
16 DIP
16 DIP
16 DIP/16 SOP
7 SIP/8 SOP
16 DIP
16 ZIP
9 SIP
9 SIP/16 SOP
16 DIP
28 DIP
28 DIP
16 DIP
16 DIP
9 SIP
9 SIP
9 SIP
9 SIP
16 DIP
9 SIP
9 SIP
8 DIP
8 DIP
TO-92L
TO-126
8 DIP
8 DIP
14 DIP
16 DIP
8 DIP
18 DIP
18 DIP
20 DIP
9 SIP
9 SIP
Page
Vol. 1
Vol. 1
Vol. 1
Vol. 1
. Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
81
81
87
95
101
104
611
611
Vol. 1
Vol. 1
ALPHANUMERIC INDEX
Device
KA2615
KA2616
KA2617
KA2618
KA2651
KA2654
KA2655/6/7/8/9
KA2803
KA2804
KA2807
KA2911
KA2912
KA2913A
KA2914A
.KA2915
KA2916
KA2917
KA2918
KA2919
KA2944
KA2945
KA2983
KA2988
KA3524
KA6101
KA6102
KA7500
KA78S40
KA78TXX
KA8301
KA8302
KA8401
KA9256
KAD0808
KAD0809
KAD0820A/B
KDA0800
KDA0801
KDA0802
KF347
KF351
(Continued)
Function
LED and Lamp Driver
LED and Lamp Driver
LED and lamp Driver
LED and Lamp Driver
Fluorescent Display Drivers
Line Transceiver
High Voltage, High Current Darlingt9n Arrays
Low Power Consumption Earth Leakage Detector
Zero Voltage Switch
Earth Leakage Detector
Video IF System for Color TV
Video IF Processor for BIW TV
Video and Sound IF AMP for Monochrome TV Receivers
Video IF + SIF System
TV VIF & SIF & Deflection System
Video IF System for Color TV
Video and Sound IF AMP for Monochrome TV Receivers
Video IF + SIF System
VIF + SIF System for Color TV
Write & Read AMP
Video AMP
Switchless Recording/Play Back AMP
Chroma Signal Processor
Regulator Pulse Width Modulator
Analog Interface Circuit for Teletex System
Analog Interface Circuit for Teletex System
Switchmode PWM Control Circuits
Switching Regulator
3A Positive Voltage Regulator
Driver for VTR '"')
Servo Control AMP
VTR Audio Switch less Recording/Play Back AMP
Dual Power Operational Amplifier
8 Bit /-tp-Compatible AID Converter with 8-Channel
Multiplexer
8 Bit /-tp-Compatible A/D Converter with 8-Channel
Multiplexer
8 Bit High Speed /-tP Compatible AID Converter with
Track/Hold Function
8 Bit D/A Converter
8 Bit D/A Converter
8 Bit D/A Converter
Quad Operational Amplifier
Single Operational Amplifier
Package
Page
9 SIP
9 SIP
9 SIP
9 SIP
18 DIP
8 DIP
16 DIP/16 SOP
8 DIP
8 DIP
8 DIP
16 DIP
14 DIP H/S
16 DIP
24 DIP
28 DIP
16 DIP
16 DIP
24 DIP
30 SSD
28 DIP
28 DIP
18 DIP
28 DIP
16 DIP
18 DIP
18 DIP
16 DIP
16 DIP
TO-220
10 SIP H/S
12- SIP
24 ZIP
10 SIP
Vol. 1
Vol. 1
Vol. 1
Vol. 1
616
111
619
624
627
630
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
337
Vol. 1
Vol. 1
345
349
355
Vol. 1
Vol. 1
Vol. 1
484
28 DIP
Vol. 3
28 DIP
Vol. 3
20 DIP
Vol. 3
16 DIP
16 DIP
16 DIP
14 DIP/14 SOP
8 DIP/8 SOP
Vol. 3
Vol. 3
Vol. 3
486
488
ALPHANUMERIC INDEX
Device
KF442
KS272
KS274
KS555
KS555H
KS556
KS5706
KS5788
KS5789A
KS5803A/B
KS5805A/B
KS58C/D05
KS58E05
KS5808
KS5809
KS581 0
KS5811
KS5812
KS58A/B/C/D19
KS58A/B/CID20
KS5822
KS58A/B/CID23
KS5824
KS7126
KS25C02
KS25C03
KS25C04
KSV3100A
KSV3110
KSV3208
KT3040/A
KT3170
KT5116
KT8520
KT8521
KT8554
KT8555
KT8557
KT8564
KT8567
LM224/A
LM239/A
LM248
LM258/A
(Continued)
Function
Dual Operational Amplifier
Dual Operational Amplifier
Quad Operational Amplifier
CMOS Timer
CMOS Timer
CMOS Timer
3 Line Drivers and 3 Line Receivers
Quad CMOS Line Driver
Quad CMOS Line Receiver
Remote Control Transmitter
Telephone Pulse Dialer with Redial
Telephone Pulse Dialer with Redial
Telephone Pulse Dialer with Redial
Dual Tone Multi Frequency Dialer
DTMF Dialer
DTMF Dialer with Redial
DTMF Dialer with Redial
Quad Universial Asychronous Receiver and Transmitter
Tone/Pulse Dialer with Redial
Tone/Pulse Dialer with Redial
10 Memory Tone/Pulse Repertory Dialer
10 Memory Tone/Pulse Repertory Dialer
Universial Asychronous Receiver and Transmitter
3 1/2 Digit AID Converter
8 Bit CMOS Successive Approximation Register
8 Bit CMOS Successive Approximation Register
12 Bit CMOS Successive Approximation Register
High-Speed A/D-DA Converter
High-Speed A/D-DA Converter
High-Speed AID Converter
PCM Monolithic Filter
DTM F Receiver
wLaw Companding CODEC
wLaw Companding CODEC
A-Law Companding CODEC
wLaw COMBO CODEC
Time Slot Assignment Circuit
A-Law COMBO CODEC
wLaw COMBO CODEC
A-Law COMBO CODEC
Quad Operational Amplifier
Quad Differential Compa~ator
Quad Operational Amplifier
Dual Operational Amplifier
Package
Page
8 DIP/8 SOP
8 DIP/9 SIP
14 DIP
8 DIP/8 SOP
8 DIP/8 SOP
14 DIP/14 SOP
16 DIP/16 SOP
14 DIP/14 SOP
14 DIP/14 SOP
16 DIP/20 SOP
18 DIP
18 DIP
16 DIP
16 DIP
16 DIP
16 DIP
16 DIP
40 DIP
22DIP/SDIP
18 DIP
22 DIP
18 DIP
24 DIP
40 DIP
16 DIP/24 SDIP
16 DIP/24SDIP
24 DIP/24SDIP
40 DIP
40 DIP
28 DIP
16 CERDIP
18 DIP
16 CERDIP
24 CERDIP
22 CERDIP
16 CERDIP
20 CERDIP
16 CERDIP
20 CERDIP
20 CERDIP
14 DIP/14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
490
492
496
577
582
586
115
119
122
Vol. 1
125
131
136
140
146
146
146
150
160
170
178
186
194
Vol. 3
Vol. 3
Vol. 3
Vol. 3
Vol. 3
Vol. 3
Vol. 3
205
217
227
240
240
249
260
249
268
268
500
557
509
515
ALPHANUMERIC INDEX
Device
LM293/A
LM311
LM317
LM323
LM324/A
LM339/A
LM348
LM358!A
LM386/S!D
LM393/A
LM567C
LM567L
LM723
LM741C!EII
LM2901
LM2902
LM2903
LM2904
LM3302
MC1458/C/I
MC1488
MC1489/A
MC3303
MC3361
MC3403
MC4558/C!AII
MC78XX
MC78LXX
MC78MXX
MC79XX
MC79LXX
MC79MXX
NE555
NE556
NE558
(Continued)
Function
Dual Differential Comparator
Voltage Comparator
3-Terminal Positive Adjustable Regulator
3-Terminal Positive Adjustable Regulator
Quad Operational Amplifier
Quad Differential Comparator
Quad Operational Amplifier
Quad Operational Amplifier
Low Voltage Audio Power AMP
Dual Differential Comparator
Tone Decoder
Micropower Tone Decoder
Precision Voltage Regulator
Single Operational Amplifier
Quad Differential Comparator
Quad Operational Amplifier
Dual Differential Comparator
Dual Operational Amplifier
Quad Differential Comparator
Dual Operational Amplifier
Quad Line Driver
Quad Line Receiver
Quad Operational Amplifier
Low Power Narrow Band FM IF
Quad Operational Amplifier
Dual Operational Amplifier
3-Terminal 1A Positive Voltage Regulator
3-Terminal 0.1A Positive Voltage Regulator
3-Terminal 0.5A Positive Voltage Regulator
3-Terminal 1A Negative Voltage Regulator
3-Terminal 0.1A Neagtive Voltage Regulator
3-Terminal O.5A Negative Voltage Regulator
Single Timer
Dual Timer
Quad Timer
Package
8 DIP/8 SOP
8 DIP/8 SOP
TO-220
TO-3P
14 DIP!14 SOP
14 DIP!14 SOP
14 DIP!14 SOP
8 DIP!8 SOP!9 SIP
9 SIP!8 DIP!8 SOP
8 DIP!8 SOP
8 DIP!8 SOP
8 DIP!8 SOP
14 DIPI14 SOP
8 DIP!8 SOP
14 DIP!14 SOP
14 DIP!14 SOP
8 DIP!8 SOP
8 DIP!8 SOP!9 SIP
14 DIP!14 SOP
8 DIP!8 SOP/9 SIP
14 DIP!14 SOP
14 DIP!14 SOP
14 DIP!14 SOP
16 DIP/16 SOP
14 DIP/14 SOP
8 DIP!8 SOP/9 SIP
TO-220
TO-92
TO-220
TO-220
TO-92
TO-220
8 DIP/8 SOP
14 DIP/14 SOP
16 DIP/16 SOP
Page
565
572
366
371
500
557
509
515
634
565
278
286
376
523
557
500
565
515
557
529
296
301
533
305
533
540
382
413
424
437
447
452
590
594
597
PRODUCT INDEX
1. Audio Application
Device
KA1222
KA2201B
KA2201/N
KA2206
KA22062
KA2209
KA221 0
KA2211
KA2212
KA2213
KA22131
KA22135
KA2214
KA2220
KA2221
KA22211
KA2223
KA22233
KA22235
KA2224
KA22241
KA2225/D
KA22261
KA2230
KA22421/D
KA22424
KA2243
KA2244
KA22441
KA2245
KA22461
KA2247
KA22471
KA224BAID
KA22491D
KA2261
KA2262
KA2263
KA2264/D
KA2265
KA2281
KA2283
KA2284
KA2285
KA2286
KA2287
KA2288
LM386/S/D
KA2303
KA2304
KA2401
Function
I
Dual Low Noise Equalizer AMP
O.5W Audio Power AMP
1.2W Audio Power AMP
2.3W Dual Audio Power AMP
4.5W Dual Power AMP
Dual Low Voltage Power AMP
5.5W Dual Power AMP
5.BW Dual Power AMP
O.5W Audio Power AMP
One Chip Tape Recorder System
Dual Pre·Power AMP for Auto Reverse
Dual Pre·Power AMP and DC Motor Speed Controller
1W Dual Power AMP
Equalizer AMP with ALC
Dual Low Noise Equalizer AMP
Dual Low Noise Equalizer AMP
5 Band Graphic Equalizer AMP
3 Band Dual Graphic Equalizer AMP
5 Band Graphic Equalizer AMP
Dual Equalizer AMP with ALC
Dual Equalizer AMP with ALC
Dual Pre·AMP for 3V Using
Dual Equalizer AMP with REC AMP
9·Program Music\$elector
AM 1 Chip Radio
AM/FM 1 Chip Radio
AM/FM IF System
FM IF System for Car Radio
FM IF System for Car Stereo
FM IF System for Car Radio
Electronic Tuning AM Radio Receiver for Car Stereo
FM IF/AM Tuner System
FM IF/AM Tuner System
3V FM IF/AM Tuner System
FM Front End for Portable Radio
FM Stereo Multiplex Decoder
FM Stereo Multiplex Decoder for Car Stereo
FM Stereo Multiplex Decoder
FM Stereo Multiplex Decoder
VCO Non·Adjusting FM Stereo Multiplex Decoder
5 DOT Dual LED Level Meter Driver
5 DOT Dual LED Level Meter Driver
5 DOT LED Level Meter Driver
5 DOT LED Level Meter Driver
5 DOT LED Linear Level Meter Driver
5 DOT LED Linear Level Meter Driver
7 DOT LED Level Meter Driver
Low Voltage Audio Power AMP
Toy Radio Control Actuator
Toy Radio Control Actuator
DC Motor Speed Controller
Package
Page
B SIP
8 DIP
B DIP
12 DIP/F
12 SIP HIS
B DIP
12 SIP HIS
12 SIP HIS
9 SIP
14 DIP HIS
24 SOP
22 SDIP
14 DIP HIS
9 SIP
B SIP
8 SIP
16 DIP
22 DIP
1B ZIP
14 DIP
9 SIP
16 DIP/16 SOP
16 DIP
22 DIP
16 DIP/16 SOP
16 DIP
16 DIP
9 SIP
16 ZIP
7 SIP
19 ZIP
16 DIP
--,
16 DIP
16 DIP/16 SOP
7 SIP/B SOP
16 DIP
16 ZIP
9 SIP
9 SIP/16 SOP
16 DIP
16 DIP
16 DIP
9 SIP
9 SIP
9 SIP
9 SIP
16 DIP
9 SIP/B DIP/B SOP
9 SIP
9 SIP
8 DIP
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
386
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
Vol. 1
634
Vol. 1
VoL 1
Vol. 1
PRODUCT IN DEX
(Continued)
1. Audio Application (Continued)
Device
KA2402
KA2404
KA2407
Function
Low Voltage DC Motor Speed Controller
DC Motor Speed Controller
DC Motor Speed Controller
Package
8 DIP
TO-92L
TO-126
Page
Vol. 1
Vol. 1
Vol. 1
2. Video Application
Device
KA2101
KA2102A
KA2103L
KA2104
KA21 05
KA21 06
KA2107
KA2130A
KA2131
KA2133
KA2134
KA2135
KA2136
KA2137
KA2153
KA2154
KA2181
KA2182
KA2183
KA22682
KA2268N
KA2605
KA2606
KA2615
KA2616
KA2617
KA2618
KA2911
KA2912
KA2913A
KA2914A
KA2915
KA2916
KA2917
KA2918
KA2919
KA2944
KA2945
KA2983
KA2988
KA6101
KA6102
KA8301
KA8302
KA8401
KS5803A1B
Function
TV Sound IF AMP
TV Sound System
Sound Mute System for TV
Auto Power off and Sound Mute System for TV
Limiter AMP and Detector for a TV SIF
Dual Sound Multiplex for a TV SIF
DC Volume Tone Control Circuit
TV Vertical Deflection System
TV Vertical Output Circuit
1 Chip Deflection System
Color TV Deflection Signal Processing IC
Horizontal Siganl Processing IC
Low Noise TV Vertical Deflection System
TV Horizontal Processor
Video-Chroma Deflection System for a Color TV
Video-Chroma-Deflection System for a Color TV
Remote Control Pre-AMP
Remote Control Pre-AMP
Remote Control Pre-AMP
1 Chip TV MPX Demodulater
1 Chip TV Sound MPX
SYNC Separator
SYNC Separator
LED and Lamp Driver
LED and Lamp Driver
LED and Lamp Driver
LED and Lamp Driver
Video IF System for Color TV
Video IF Processor for BIW TV
Video and Sound IF AMP for Monochrome TV Receivers
Video IF + SIF System
TV VIF & SIF & Deflection System
Video IF System for Color TV
Video and Sound IF AMP for Monochrome TV Receivers
Video IF + SIF System
VIF + SIF System for Color TV
Write & Read AMP
Video AMP
Switch less Recording/Play Back AMP
Chroma Signal Processor
Analog Interface Circuit for Teletex System
Analog Interface Circuit for Teletex System
Driver for VTR
Servo Control AMP
VTR Audio Switchless Recording/Play Back AMP
Remote Control Transmitter
Package
14 DIP
14 DIP H/S
8 SIP
9 SIP
9 SIP
16 DIP
12 SIP
10 SIP HIS
10 SIP H/S
16 DIP H?S
18 DIP
12 SIP
12 ZDIP/F
16 DIP
42 DIP
42 DIP
8 SIP
8 SIP
8 SIP
28 DIP
28 DIP
9 SIP
9 SIP
9 SIP
9 SIP
9 SIP
9 SIP
16 DIP
14 DIP H/S
16 DIP
24 DIP
28 DIP
16 DIP
16 DIP
24 DIP
30 SSD
28 DIP
28 DIP
18 DIP
28 DIP
18 DIP
18 DIP
10 SIP H/S
12 SIP
24 ZIP
16 DIP/20 SOP
Page
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
! Vol.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
PRODUCT INDEX
(Continued)
3. Telecommunication Application
Device
KA241 0
KA2411
KA2412A
KA2413
KA2418
KA2425A/B
KA2654
KS5706
KS5788
KS5789A
KS5805A/B
KS58C/D05
KS58E05
KS5808
KS5809
KS581 0
KS5811
KS5812
KS58A/B/C/D19
KS58A/B/C/D20
KS5822
KS58A/B/C/D23
.• KS5824
KT3040/A
KT3170
KT5116
KT8520
KT8521
KT8554
KT8555
KT8557
KT8564
KT8567
LM567C
LM567L
MC1488
MC1489/A
MC3361
KA2580A
KA2588A
KA2651
KA2655/6/7/8/9
Function
Tone Ringer
Tone Ringer
Telephone Speech Circuits
Dual Tone Multi Frequency Generator
Tone Ringer with Bridge Diode
Telephone Speech Network with Dialer Interface
Line Transceiver
3 Line Drivers and 3 Line Receivers
Quad CMOS Line Driver
Quad CMOS Line Receiver
Telephone Pulse Dialer with Redial
Telephone Pulse Dialer with Redial
Telephone Pulse Dialer with Redial
Dual Tone Multi Frequency Dialer
DTMF Dialer
DTMF Dialer with Redial
DTMF Dialer with Redial
Quad Universial Asychronos Receiver and Transmitter
Tone/Pulse Dialer with Redial
Tone/Pulse Dialer with Redial
10 Memory Tone/Pulse Repertory Dialer
10 Memory Tone/Pulse Repertory Dialer
Universial Asychronous Receiver and Transmitter
PCM Monolithic Filter
DTM F Receiver
wLaw Companding CODEC
wLaw Companding CODEC
A-Law Companding CODEC
wLaw COMBO CODEC
Time Slot Assignment Circuit
A-Law COMBO CODEC
wLaw COMBO CODEC
A-Law COMBO CODEC
Tone Decoder
Micropower Tone Decoder
Quad Line Driver
Quad Line Receiver
Low Power Narrow Band FM IF
8-Channel Source Drivers
8-Channel Source Drivers
Fluorescent Display Drivers
High Voltage, High Current Darlingtor Arrays
Package
8 DIP
8 DIP
14 DIP
16 DIP
8 DIP
18 DIP
8 DIP
16 DIP/SOP
14 DIP/SOP
14 DIP/SOP
18 DIP
18 DIP
16 DIP
16 DIP
16 DIP
16 DIP
16 DIP
40 DIP
22 DIP
18 DIP
22 DIP
18 DIP
24 DIP
16 CERDIP
18 DIP
16 CERDIP
24 CERDIP
22 CERDIP
16 CERDIP
20 CERDIP
16 CERDIP
20 CERDIP
20 CERDIP
8 DIP/SOP
8 DIP/SOP
14 DIP/SOP
14 DIP/SOP
16 DIP/SOP
18 DIP
20 DIP
18 DIP
16 DIP/SOP
Page
81
81
87
95
101
104
111
115
119
122
125
131
136
140
146
146
146
150
160
170
178
186
194
205
217
227
240
240
249
260
249
268
268
278
286
296
301
305
611
611
616
619
PRODUCT INDEX
(Continued)
4. Industrial Application
l.
Device
KA33V
KA201A
KA219
KA301A
KA319
KA331
KA336-5.0/2.5
KA337
KA340
KA350
KA431
KA710CII
KA711CII
KA733C
KA2807
KA3524
KA7500
KA78S40
KA78TXX
KA9256
KF351
KF347
KF442
KS272
KS274
KS555
KS555H
KS556
LM224/A
LM239/A
LM248
LM258/A
LM293/A
LM311
LM317
LM323
LM324/A
LM339/A
LM348
LM358/A
LM393/A
LM723
LM741C/EII
LM2901
Function
Silicon Monolithic Bipolar Integrated Circuit Voltage
Stabilizer for Electronic Tuner
Single Operational Amplifier
Dual High Speed Voltage Comparator
Single Operational Amplifier
Dual High Speed Voltage Comparator
Voltage to Frequency Converter
Voltage Reference Diode
1A Negative Adjustable-Voltage Regulator
1A Positive Voltage Regulator
3A Adjustable Positive Voltage Regulator
Programmable Precision Reference
High Speed Voltage Comparator
Dual High-Speed Differential Comparator
Differential Video Amplifier
Earth Leakage Detector
PWM Control Circuits
Switchmode PWM Control Circuits
Switching Regulator
3A Positive Voltage Regulator
Dual Power Operationai Amplifier
Single Operating Amplifier
Quad Operational Amplifier
Dual Operational Amplifier
Dual Operational Amplifier
Quad Operational Amplifier
CMOS Timer
CMOS Timer
CMOS Timer
Quad Operational Amplifier
Qual Differential Comparator
Quad Operational Amplifier
Quad Operational Amplifier
Dual Differential Comparator
Voltage Comparator
3-Terminal Positive Voltage Regulator
3-Terminal Positive Voltage Regulator
Quad Operational Amplifier
Quad Differential Comparator
Qual Operational Amplifier
Quad Operational Amplifier
Dual Differential Comparator
Precision Voltage Regulator
Single Operational Amplifier
Qual Differential Comparator
Package
Page
TO-92
603
8 DIP/8 SOP
14 DlP/14 SOP
8 DIP/8 SOP
14 DIP/14 SOP
8 DIP/8 SOP
TO-92
TO-220
TO-220
TO-3PITO-220
TO-92/8 DIP/8 SOP
14 DIP/14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
8 DIP
16 DIP
16 DIP
16 DIP
TO-220
10 SIP
8 DIP/8 SOP
14 DIP/14 SOP
8 DIP/8 SOP
8 DIP
14 DIP/9 SIP
8 DIP/8 SOP
8 DIP/8 SOP
14 DlP/14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
8 DIP/8 SOP
8 DIP/8 SOP
TO-220
TO-3P
14 DIP/14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
B DIP/B SOP/9 SIP
8 DIP/8 SOP
14 DIP/14 SOP
B DIP/8 SOP
14 DIP/14 SOP
472
545
472
545
607
458
313
317
329
466
550
554
477
630
337
345
349
355
484
488
486
490
492
496
577
582
586
500
557
500
515
565
572
366
371
500
557
509
515
565
376
523
557
PRODUCT INDEX (Continued)
4. Industrial Application
(Continued)
Device
LM2902
LM2903
LM2904
LM3302
MC1458/C/I
MC3303
MC3403
MC45581CIAll
MC78XX
MC78LXX
MC78MXX
MC79XX
MC79LXX
MC79MXX
NE555
NE556
NE558
Function
Quad Operational Amplifier
Dual Differential Comparator
Quad Operational Amplifier
Quad Differential Comparator
Dual Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Dual Operational Amplifier
3-Terminal 1A Positive Voltage Regulator
3-Terminal Positive Voltage Regulator
3-Terminal 0.5A Positive Voltage Regulator
3-Terminal Negative Voltage Regulator
0.1A Negative Voltage Regulator
3-Terminal 0.5A Negative Voltage Regulator
Timer
Dual Timer
Quad Timer
Package
14 DIP/14 SOP
8 DIPI8 SOP
"8 DIP/8 SOP/8 SIP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
14 DIPI14 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
TO-220
TO-92
TO-220
TO-220
TO-92
TO-220
8 DIP/8 SOP
14 DIPI14 SOP
16 DIP/16 SOP
Page
500
565
515
557
529
533
533
540
382
413
424
437
447
452
590
594
597
5. Data Converter Application
Device
KSV3100A
*KSV3110
* KSV3208
**KAD0206
KAD0808/09
*KAD0817
KAD0820
KS7126
**KDA0406
*KDA3310
KDA0800/08
KS25C02
KS25C03
KS25C04
-: New Product
**: Under Development
Function
8 Bit AID Converter + 10 Bit DIA Converter
8 Bit AID Converter + 10 Bit D/A Converter
8 Bit AID Converter
6 Bit AID Converter (20 MSPS)
8 Bit up-Compatible AID Converter (8 CH)
8 Bit up-Compatible AID Converter (16 CH)
8 Bit up-Compatible AID Converter
3 1/2 D.igit AID Converter
Tripple 6 Bit D/A Converter (20 MSPS)
10 Bit D/A Converter
8 Bit D/A Converter
8 Bit CMOS Successive Approximation Register
8 Bit CMOS Successive Approximation Register
12 Bit CMOS Successive Approximation Register
Package
40 DIP
40 DIP
28 DIP
32S0lCI30 SDIP
28 DIP
40 DIP
20 DIP
40 DIP
28S0lCI28 SDIP
28 CERDIP
16 DIP
16 DIP
16 DIP
16 DIP
Page
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
Vol.
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
QUALITY and RELIABILITY
INTRODUCTION
Samsung's linear Ie products are among the most reliable in the industry. Samsung has always made a commitment to achieve the highest possible quality, reliability, and customer satisfaction with its products.
Extensive qualification, monitor and outgoing programs are used to scrutinize product quality and reliability.
Stringent controls are applied to every wafer fabrication and assembly lot to achieve reproducibility, and therefore
maintain product reliability.
In this chapter, the quality and reliability programs established at Samsung will be discussed. In addition, a description
of reliability theory, reliability tests and various support efforts provides a broad framework from which to comprehend Samsung quality and reliability.
To better understand the Quality Department's role in product develoment and manufacturing, a detailed diagram
is listed below. As can be noted, Quality Engineering is involved in all phases, save that of initial product planning.
STEP
SALES
~
PROCESS ENG'S
MARKET SURVEY
Z
I
~
SPEC. REVIEW
Q.
I
I
==
I~
-'
a:<
DESIGN
____
.....
Z
iii
w
c
z
o
t
J
I
--,I
r -___
D_ES_IG
__
N_R_E_VI_EW
__________
jl-------iL..____
Q_U_A_L1_F_IC_A_TI_O_N_F_O_R_R_A_W__
M_AT_E_R_1A_L__---'
011
o
I
I
TRIAL MFG
I
I
I
EVALUATION & QUALIFICATION
STANDARDIZATION
::l
C
oII:
PRODUCTION
CONTROL
PRODUCTION
I
I
COUNCIL FOR DEVELOPMENT
oIi.
OC/OA
I
APPROVAL
I
P.P
Q.
I
W
II:
Q.
I
I
z
o
PROCESS CONTROL
t
::l
Q
Q.
III
III
<
==
I
I
11------·-----11
MASS PRODUCTION
1
L------r---
oII:
I
QUALIFICATION
INCOMING INSP.
I
PROCESS MONITOR
I
I
RELIABILITY TEST
I
I
I
I
I
l
J
LOT ACCEPTANCE TEST
~
L . . - - - - . , . . - - - j_ _------'J
I
I'-------_.....11----------11
FAILURE ANALYSIS
CLAIM
I
INITIATE CORRECTIVE ACTION
I
SHIPPING
J
CUSTOMER
I
I
Quality Assurance During Development
c8SAMSUNG
Electronics
23
I
QUALITY and RELIABILITY
QUALIFICATION
Procedures to qualify devices are listed below. There are both general and product-specific requirements. Procedures
are detailed for new products, die-only qualifications, and package-only qualifications. The latter two are for products
andlor packages already qualified, but where there is room for further product optimization.
I
I
New Product
•
•
•
•
•
•
•
•
•
•
•
HOPL 1000HR
HTRB 1000HR
1000HR
IOPL
1000HR
HTS
168HR
PCT
WHOPL 1000HR
WHTRB 1000HR
TIC, TIS 200CYC.
20000CYC.
PIC
Solderability
Other as
applicable
Qualification Program
I
I
I
Package
Sub-assembly
New Process
Wafer-fabrication
•
•
•
•
•
•
•
HOPL
HTRB
HTS
PCT
WHOPL
WHTRB
TIC, TIS
1000HR
1000HR
1000HR
168HR
1000HR
1000HR
200CYC.
I
•
•
•
•
•
•
HOPL 500HR
HTRB 500HR
200CYC.
TIC
200CYC.
TIS
168HR
PCT
Other as
applicable
1
*Other
• Same as
New product
Qual.
* Design, Equipment,
Material(s), etc ....
Qualification Programs.
c8SAMSUNG
Electronics
24
QUALITY and RELIABILITY
A) New Product Qualification Test Items
Test Item
No.
Part
Test Condition
High Temperature Ta=Tj(max)
1 Reverse Bias
VCB = 0.8 X VCBO
(HTRB)
1000HRS
High Temperature Ta = Top~max)
2 Operating Life
Vcc = Vcc (max)
(HOPL)
Static, Dynamic
1000HRS
3 ,High Temperature Ta=Tj(max)
Storage (HTS)
1000HRS
Operati ng Life
(OPL)
4
Intermittent
5 OPL (IOPL)
Ta= 25°C
Pc= Pc(max)
1000HRS
Ta= 25°C
Pc= Pc(max)
Reference
Method
Sample
ACC.
LTPD
Size
No
L·IC Discrete
10
1
48HR
for PRT
45
10
1
MIL-STD-883 48HR
for PRT
1005
45
10
1
YES
45
10
1
-
YES
45
10
1
YES
YES
45
10
1
YES
YES
45
10
1
45
10
1
45
10
1
-
YES
45
YES
-
YES
YES
-
I
•
Note
I
II
MIL-STD-750 for Small1026.3
Signal Device
IMIL-STD·750
1036.3
2min/2min OnlOff
1000HRS
Power Cycle
6 (PIC)
6 Tj = 125°C
45Sec/90Sec OnlOff
For
PWR TR,
PWR IC
20000CYC.
Pressure Cooker
7 Test (PCT)
Ta=121°C±2°C
RH = 100% 15PSIG
168HRS
Wet High
8 Temperature
Reverse Bias
(WHTRB)
Ta= 85°C, RH = 85%
VCB = 0.8 X VCBO
Wet High
Temperature
Operating Life
j
(WHOPL)
Ta= 85°C, RH = 85%
Vcc = Vcc(opr), Pdmin
91
- - f---Thermal Shock
10
(TIS)
11
48HR
for PRT
I
-
YES
1000HRS
I
iyES
i
-
I
I
I
1000HRS
-
- 65°.C-+150°C
(Liquid) YESI YES
5min< 10Sec, 5min
200 Cycles
I
Temperature Cycle - 65°C-+25°C-+150°C
10min, 5min, 10min
YES
(TIC)
200 Cycles
c8SAMSUNG
Electronics
YES
I
45
10
1
I
45
I
10
1
MIL-STD-883
1011
M I L-STD-883
1011
25
QUALITY and RELIABILITY
A) New Products Qualification Test Item (Continued)
No.
Test Item
Part
Test Condition
L·IC Discrete
Solder Heat
12 Resistance
(StH)
13 Solderability
14 Salt Atmosphere
15
Mechanical
Shock
16 Vibration
17
Constant
Acceleration
ESD
18 (Human Body
(Model)
Fine Leak
Gross Leak
Reference
Method
Note
Ta=260°C±5°C
t = 10 ± 0.5sec
YES
YES
10
N/A
0
MIL-STD-750
2031
Ta= 245°C ± 5°C
t = 10 ± 1SEc
YES
YES
10
NtA
0
MIL-STD-883
2003
YES
YES
10
N/A
0
1500G,0.5ms
3 Times each direction YES
of X, Y and Z Axis
YES
10
NtA
0
MIL-STD-750 For
2016
Hermetic
20G,3Axis
f = 20 to 2000 cps
for 4min, 4 cycles
YES
YES
10
NtA
0
MIL-STD-883 For
Hermetic
2007
2000G
X, Y, Z Axis
1min for each Axis
YES
YES
10
N/A
0
MIL-STD-883 For
2001
Hermetic
R= 1.SKQ
C= 100pF
5 Discharge
V~ ±1000V
YES
YES
5
NtA
0
YES
-
5
N/A
0
YES
YES
45
10
1
Ta=35°C, 5% NaCI
24HRS
19 Latch-up Test
20
Sample
ACC.
LTPD
Size
No
Helium
Fluoro carbon
MIL-STD-883
1009A
MIL-STD-883
3015
-
. For
CMOS
MIL-STD-883 For
1014
Hermetic
Note) • N/A: Not available
• SOT-23, TO-92S PKG: PCT 48HR
• PRT: Process Reliability Test (all outgoing Lots)
=8SAMSUNG
Electronics
26
QUALITY and RELIABILITY
B) New Process, Wafer Fabrication Qualification
No
Test Item
Package
Discrete
Sample
Size
LTPD
L·IC
ACC
No
Ta = Top~max)
Vcc = Vcdmax)
STATIC, DYNAMIC
1000HRS
YES
-
45
10
1
Ta=Tj(max)
VCB = 0.8 X VCBO
1000HRS
-
YES
45
10
1
Ta=Tj(max)
1000HRS
YES
YES
45
10
1
Ta=121°C±2°C
RH = 100% 15 PSIG
168HRS
YES
YES
45
10
1
Test Condition
1
High Temperature
Operating Life (HOPL)
2
High Temperature
Reverse Bias (HTRB)
3
High Temperature
Storage (HTS)
4
Pressure Cooker
Test (PCn
5
Wet High Temperature
Operating Life (WHOPL)
Ta=85°C, RH =85%
Vcc = VCC(oPr)
1000HRS
YES
-
45
10
1
6
Wet High Temperature
Reverse Bias (WHTRB)
Ta=85°C, RH =85%
VCB = 0.8 X VCBO
1000HRS
-
YES
45
10
1
7
Thermal Shock (TIS)
- 65°C-+150° C(Uquid)
5min<10sec,5min
200 Cycles
YES
YES
45
10
1
8
Temperature Cycle (TIC)
- 65°C-+25°C-+150°C
10min, 5min, 10min
200 Cycles
YES
YES
45
10
1
qsSAMSUNG
Electronics
27
I
QUALITY and RELIABILITY
C) Package Sub·Assembly Qualification
Test Item
No
Test Condition
High Temperature
1 Reverse Bias
(HTRB)
2
3
4
High Temperature
Operating Life (HOPL)
Temperature Cycle
YES
45
10
1
For
Discrete
Ta = Topr(max)
Vcc = Vcdmax)
Static, Dynamic 500H RS
YES
YES
45
10
1
For L-IC
YES
YES
45
10
1
YES
-
45
10
1
- 65°C ..... 150°C (Liquid)
5min< 10sec, 5min
200 Cycles
YES
YES
45
10
1
260°C ±5°C
10± 1 sec
YES
YES
10
N/A
0
100 - 200 - 100Hz
20G, 5min, 5Times, X, Y, Z
-
YES
10
N/A
0
For Discrete,
others as
applicable
1500G,0.5ms
3 Times, X, Y, Z
-
YES
10
NiA
0
same as above
20000G
X, Y, Z Axis
1 min for each Axis
-
YES
10
NtA
0
same as above
-
65°C~25°C""'150°C
Pressure Cooker Test
(PCT)
RH = 100%, 15PSIG
Solder Heat Resistance
(StH)
7
Vibration (VariableFrequency)
8 Mechanical Shock (MIS)
9 Constant Acceleration
Note) •
Notes
YES
10min, 5min, 10min
200 Cycles
6
Sample
ACC
LTPD
Size
No
Ta=Tj(max)
Vce = Vceo x 0.8
500HRS
(TIC)
5 Thermal Shock (TIS)
Package
Plastic Hermetic
Ta=121°C±2°C
168HRS
N/A: not available
c8SAMSUNG
Electronics
28
QUALITY and RELIABILITY
Product Reliability (Quality Conformance) Monitors
Samsung implements periodic testing to monitor the ongoing reliability of its products. A subset of stresses used
for qualification are run; they are seen as most critical for basic device reliability. Formally this is known as the
Device Reliability Test System, or simply as DRT.
Lot-by-Iot infant mortality reliability testing is also accomplished at Samsung. The purpose of this is to verify process
integrity in a full QA step. Formally this is known as Process Reliability Testing, or more simply as PRT. Normally
a short term accelerated lifetest and package reliability test are done, although exceptions are made in the case
of special devices.
Although Sam sung scrupulously utilizes statistical controls throughout it's production process, DRT and PRT serve
as confirmation that indeed the customer does receive only high-grade units. The tables on the following give details
of DRT and PRT processing.
I
Quality Conformance Program
I
I
I
PRT
(Process Reliability Test)
ILT
(Infant Life Test)
I
I
DRT
(Device Reliability Test)
• Every Fab Lot
• 1 Processlmonth
• Once/6 mo. per device
• HOPL 5 168HR
• HTRB 5 "168HR
• PCT 48HR
• HOPL 168HR
• HTRS 168HR
(24hr read outs)
•
•
•
•
•
•
•
HOPL
HTRS
PCT
WHOPL
WHTRS
TIC
TIS
1000HR
1000HR
168HR
1000HR
1000HR
200CYC
200CYC
Note: Test descriptions given on following pages.
Quality Conformance Program
c8SAMSUNG
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29
I
QUALITY and RELIABILITY
DESCRIPTION
Samsung has established a comprehensive reliability program to monitor and ensure the ongoing reliability of the
linear IC family. This program involves not only reliability data collection and analysis on existing parts, but also
rigorous in-line quality controls for a" products.
Listed below are details of tests performed to ensure that manufactured product continues to meet Samsung's
stringent quality standards. In line quality controls are reviewed extensively in later sections.
The tests run by the quality department are accelerated tests, serving to model "real world" applications through
boosted temperature, voltage, and/or humidities. Accelerated conditions are used to derive device knowledge through
means quicker than that of typical application situtations. These accelerated conditions are then used to assess
differing failure rate mechanisms that correlate directly with ambient conditions. Fo"owing are summaries of various
stresses (and their conditions) run by Samsung on linear IC products.
HIGH TEMPERATURE OPERATING LIFE TEST (HOPL)
(T1=125°C, Vee = Vee max, statiC)
High temperature operating life test is performed to measure actual field reliability. Life tests of 1000HR to 2000HR
durations are used to accelerate failure mechanisms by operating the device at an elevated ambient temperature
(125°C). Data obtained from this test are used to predict product infant mortality, early life, and random failure
rates. Data are translated to standard operating temperatures via failure analysis to determine the activation
energy of each of the observed failures, using the Arrhenius relationship as previously discussed.
WET HIGH TEMPERATURE OPERATING LIFE TEST (WHOPL)
(Ta=85°C, R.H.=81%, Vee = Vee opt, static)
Wet high temperature operating life test is performed to evaluate the moisture resistanr.e characteristics of plastic
encapsulated components. Long time testing is performed under static bias conditions at 85°C/81 percent relative
humidity with nominalvoltages. To maximize metal corrosion, the biasing configuration utilizes low power levels.
INTERMITTENT OPERATING LIFE (IOPL)
(Pmax, 25°C, 2min on/2 min off)
This test is normally applied to scrutinize die bond thermal fatigue. A stressed device undergoes an "ON" cycle,
where there is thermal heating due to power dissipation, and an "OFF" cycle, where there is thermal cooling due
to lack of inputted power. Die attach (between die and package) and bond attach (between wire and die) are the
critical areas of concern.
HIGH TEMPERATURE STORAGE TEST (HTS)
(Ta= 125°C, UNBIASED)
High temperature storage is a test in which devices are subjected to elevated temperatures with no applied bias.
The test is used to detect mechanical instabilities such as bond integrity, and process wearout mechanisms.
PRESSURE COOKER TEST
(pen
(121°C, 15PSIG, 100% R.H., UNBIASED)
The pressure cooker test checks for resistance to moisture penetration. A highly pressurized vessel is used to
force water (thereby promoting corrosion) into packaged devices located within the vessel.
TEMPERATURE CYCLING (TIC)
(- 65°C to + 150°C, AIR, UNBIASED)
This stess uses a chamber with alternating temperatures of - 65°C and + 150°C (air ambient) to thermally cycle
devices within it. No bias is applied. The cycling checks for mechanical integrity of the packaged device, in
particular bond wires and die attach, along with metallpolysilicon microcracks.
THERMAL SHOCK (TIS)
(- 65°C to + 150°C, LIQUID, UNBIASED)
This stress uses a chamber with alternting temperatures of - 65°C to + 150°C (liquid ambient) to thermally cycle
devices within it. No bias is applied. The cycling is very rapid, and primarily checks for die/package compatibility.
c8SAMSUNG
Electronics
30
QUALITY and RELIABILITY
RESISTANCE TO SOLDER HEAT
(Unbiased, 260°C, 10 sec)
Solder Heat Resistance is performed to establish that devices can withstand the thermal effects of solder dip,
soldering iron, or solder wave operations.
MECHANICAL SHOCK
(Unbiased, 1500g, Pulse = 0.5msec)
This test determines the suitability of a device to be used in equipment where mechanical "shocks" may occur.
Such shocks result from sudden or abrupt changes produced by rough (non-standard) handling, transportation,
or field operations.
VARIABLE FREQUENCY VIBRATION
(Unbiased, Range = 100 to 2000Hz)
Variable Frequency Vibration is done to model the effects of differential vibration in the specified range. Die attach
and bonding integrity are particularly stressed, testing the mechanical soundness of device packaging.
CONSTANT ACCELERATION
(Unbiased, 10kg to 20kg)
This is an accelerated test designed to indicate types or modes of structural and mechanical weaknesses not
necessarily detectable in Mechanical Shock and Variable Frequency Vibration stressing.
RELATIVE STRESS COMPARISONS
Many stresses are run at Sam sung on many different devices. Through both theoretical and actual results, it was
clearly determined which stresses were most effective. Also established were the stresses which weren't fully
effective.
Comparisons have been made on the basis of defects able to be determined, efficiency in detection, and cost.
For the reader's benefit, Samsung provides the results of its conclusions on the following pages.
qsSAMSUNG
Electronics
31
•
QUALITY and RELIABILITY
COMPARISON OF RELIABILITY TEST METHODS·
Test
Method
Internal
Visual
Inspection
Defect
Lead Structure
Metalization
Oxide Film
Foreign Particles
Die Bond
Wire Bond
Contamination
Corroded Substrate
Effectiveness
Cost
Good
Slightly
Inexpensive
to Moderate
Remarks
This method of screening must be
performed for high reliability
devices. Cost is affected by the
degree of visual inspection
Very Good
Expensive
For use in design evaluation only
Extremely Good
Good
Good
Good
Good
Good
Good
Good
Moderate
Advantage to using this
screening method lies in the
ability t test die framel
header bonding, and to be able to
perform inspection after sealing.
However, some materials being
transparent to X-rays (for example,
AI and Si) are not able to be
analyzed. The use of the complex
test system results in cost six times
that of visual inspection.
Good
Very
Inexpensive
This is a highly desirable screening
method
Package
Seal
Die Bond
Wire Bond
Cracked Substrate
Thermal Mismatching
Good
Very
Inexpensive
This screening method is one of
the most effective for use
Thermal
Shock
Package
Seal
Die Bond
Wire Bond
Cracked Substrate
Thermal Mismatching
Good
Inexpensive
While this screening method is
similar to temperature cycling,
it enables high stress levels as
well. It is probably equal to the
temperature cycling method.
Constant
Acceleration
Lead Structure
Die Bond
Wire Bond
Cracked Substrate
Good
Moderate
Doubt exists as to the effectiveness
of screening aluminum wires
with stress levels in the range of
0-20,000 G
Infrared ray
Design (thermal)
Radiography
Die Bond
Lead Structure (Gold)
Foreign Particles
Manufacturing
(Gross Error)
Seal
Package
Contamination
High
Temperature
Storage
Electrical stability
Metal izat ion
Bulk Silicon
Corrosion
Temperature
Cycling
c8SAMSUNG
Electronics
32
QUALITY and RELIABILITY
COMPARISON OF RELIABILITY TEST METHODS
Test
Method
Defect
Effectiveness
(Continued)
Cost
Shock
(Without
Monitoring)
Lead Structure
Fairly Poor
Moderate
Drop shock testing is thought to
be inferior to constant acceleration
methods. However, the pneupactor
shock test is more effective. Shock
test is a destructive test method.
Shock
(With
Monitoring)
Particles
Intermittent Short
Intermittent Open
Fairly Poor
Fairly Good
Fairly Good
Expensive
Visual inspection or radiography
is more desirable for detection of
particles
Vibration
Fatigue
Lead Structure
Package
Die Bond
Fairly Poor
I
Package
Die Bond
Expensive
t
I
Wire Bond
Cracked
Substrage
Variable
Frequency
1
I
Fairly Poor
•
Remarks
This test is destructive
without merit.
I and
~1---
Expen. sive
,
v.~
Vibration
Wire Bond
(Without
Substrate
I
Monitoring)
i-V-ar-ia-b-'-e--+-F-o-re-i-g-n-p-a-rt'-ic-'-es---+---F-a-ir-,y-G-o-od--+I Very
The effectiveness of the method for
Frequency
Vibration
(Without
Monitoring)
Lead Structure
Intermittent Open
Good
Good
Random
Vibration
(Without
Monitoring)
Package
Die Bond
Wire Bond
Substrate
Good
Random
Vibration
(Without
Monitoring)
Forei gn Particle
Lead Structure
Intermittent Open
Fairly Good
Good
Good
Vibrational
Noise
Foreign Particles
Good
Radioisotope
Leak Test
I Package
I Seal
c8SAMSUNG
Electronics
Good
I Expensive
. detecting particles depends on the
type of particle
I
Expensive
This screening method is more
effective than variable frequency
vibration (without monitoring), when
used with equipment intended for
space vehicle operation, although it
is more expensive
Very
This is one of the most expensive
screening methods
I Expensive
I
I Expensive
).11MOderat;IThiS screening method is effe~tl;';--l
I
for detecting leakage in the range
atm. mllsec
I 10E6 -10E12
33
QUALITY and RELIABILITY
COMPARISON OF RELIABILITY TEST METHODS
Test
Method
Defect
Effectiveness
Cost
(Continued)
Remarks
Helium
Leak Test
Package
Seal
Good
Moderate
This screening method is effective
for detecting leak in the range
10E6 -10E12 atm. mllsec
Gross
Leak Test
Package
Seal
Good
Inexpensive
Effectiveness is dependent upon
volume. Testing is possible for
detecting leaks above 10E-3 atm.
mllsec.
High Voltage
Test
Oxide Film
Good
Inexpensive
Effectiveness Depends on Structure
Insulation
Resistance
Lead Structure
Metallization
Contamination
Fairly Good
Inexpensive
Intermittent
Operation
Metallization
Bulk Silicon
Oxide Film
Inversion/Channeling
Design Parmeter
Drift Contamination
Good
Expensive
AC
Operation
Metallization
Bulk Silicon
Oxide Film
Inversion/Channeli ng
Design Parmeter
Drift Contamination
Very Good
Expensive
DC
Operation
Basically the Same
as Intermittent
Operation
Good
Expensive
The AC operation life method is
more effective for any failure
mechanism
High
Temperature
AC
Operation
Same as AC
Operation Life
Test
Extremely Good
Very
Expensive
Failures are accelerated by
temperature. This is probably
the most expensive and one of the
most effective screening methods.
High
Temperature
Reverse
Bias
Inversion
/Channeling
Fairly Poor
Expensive
=8SAMSUNG
Electronics
Probably about the same as AC
operating life
34
QUALITY and RELIABILITY
RELIABILITY TEST RESULTS
This section is divided into two parts-actual and predicted test results. Actual test results are those derived via
accelerated stressing done by the QA department. Predicted results are calculated by taking actual test results
and derating them using statistical and mathematical models to determine device performance in "real-time"user
conditions.
ACTUAL TEST RESU LTS
Stress
Conditions
HOPL
Tj = 125°C
Vee = Vee max
WHOPL
85°C/81 % R.H.
Vee = Vee opt
Number of
Devices
Number of
Hours/Cycles
Number of Device
Hours/Cycles
Number of
Failures
% Failures per
1OOOH RS (Cycles)
(60% UCL)
180
1,000
180,000
0
0.51%/1K HR
180
1,000
180,000
0
0.51%/1K HR
IOPL
Ta= 25°C
Vee = Vee max
180
1,000
180,000
0
0.51%/1K HR
HTS
Ta= 125°C
Unbiased
135
1,000
135,000
0
0.67%/1K HR
PCT
121°C
15 PSIG
225
168
37,800
1
0.89%/168 HR
TIC
-65°C to 150°C
Air to Air
180
200
36,000
0
0.51 %/200 CL
TIS
- 65°C to 150°C
Liquid to Liquid
135
200
27,000
0
0.67%/200 CL
PREDICTED TEST RESULTS
The Arrhenius equation, which is reviewed in another section of this chapter, can be applied to derive typical "usercondition" device failure rates.
STESS: HOPL
180,000 Device Hours at 125°C
Average Activation Energy: 1.0 eV.
De-Rating to User Conditions Yields:
70°C Operation
Equivalent
Device Hours
1.93x107
55°C Operation
% Failures Per
1000 Hours
*FITs
(60% UCL)
0.0047
47
**MTTF
(years)
Equivalent
Device Hours
% Failures Per
1000 Hours
(60% UCL)
* FITs
**MTTF
(years)
2435
9.07 x 107
0.0010
10
11447
* FIT
: Failure in time or failure unit. Represents the
number of failures expected for 1.09 (one billion)
device hours.
** MTTF: Mean time to failures.
c8SAMSUNG
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35
•
QUALITY and RELIABILITY
PROCESS CONTROL
GENERAL PROCESS CONTROL
The general process flow in Samsung is shown in Figure 8. This illustration contains the standard process flow
from incoming parts and materials to customer shipment.
Acceptance inspection (according to acceptance inspection plan)
Process quality control
• Check of each condition by process quality control procedures
• Process inspection
• Lot control
• Equipment calibration and maintenance
100% Electrical Die Sorting
Process Quality Control and screening of infant mortality defects
• Mechanical screen
• Thermal shock
• Burn-in
Test
100% package sorting of electrical characteristics and marking
Reliability monitoring
1. PRT (Process Reliability Testing)
2. DRT (Device Reliability Testing)
• High Temperature Operating Life Test
• Environmental test
• Life Test
Finished Goods
Incoming
Inspection
Sampling Inspection
• Dimensions
• Visual
• Electrical characteristics
• Periodic calibration of measuring equipment
Stock control
• Age control
Sampling Inspection (when applicable)
Shipment
. General Process Flow Chart
c8SAMSUNG
Electronics
36
QUALITY and RELIABILITY
WAFER FABRICATION
Process Controls
The Quality Control program utilizes the following methods of control to achieve its previously stated objectives:
process audits, environmental monitors, process monitors, lot acceptance inspections, and process integrity audits.
Definitions
The essential method of the Quality Control Program is defined as follows:
1. Process Audit-Performed on all operations critical to product quality and reliability.
2. Environmental Monitor-Monitors concerning the process environment, i.e., water purity, temperature, humidity,
particle counts.
3. Process Monitor-Periodic inspection at designated process steps for verification of manufacturing inspection
and maintenance of process average. These inspections provide both attribute and variable data.
4. Lot Acceptance-Lot-by-Iot sampling. This sampling method is reserved for those operations deemed as critical,
and require special attention.
Environmental Monitor
Control Item
Process
Clean Room
•
•
•
•
0.1. Water
• Particle
• Bacteria
• Resistivity
Temperature
Humidity
Particle
Air Velocity
Insp. Frequency
Spec. Limit
•
•
•
•
Individual
Individual
Individual
Individual
24
24
24
24
Spec.
Spec.
Spec.
Spec.
• 5 ea/50ml (0.81L)
• 50 colonies/100ml (0.451L)
• Main (Line): More than
16 Mohm-cm
• Using point: More than
14 Mohm-cm
Hrs.
Hrs.
Hrs.
Hrs.
24 Hrs.
Weekly
24 Hrs.
24 Hrs.
* Instruments
•
•
•
•
•
•
FMS (Facility Monitoring System) HIAC/ROYCO
CPM (Central Particle Monitoring System-Dan Scientific)
Liquid Dust Counter Etch Rate
Filtration System for Bacterial check
Air Particle counter
Air Velocity meter
Process Monitor
Process
Control Item
Photo
•
•
•
•
•
•
Etch
• Etchant Temp.
• Etch Rate
• Spin Dryer N2 Flow
RPM
• Hard Bake Temp.
N2 Flow
Aligner N2 Flow Rate
Aligner Vacuum
Aligner Air
Aligner Pressure
Aligner Intensity
Coater Soft Bake
Temperature
Vacuum
c8 !e!"SUNG
Spec. Limit
Insp_ Frequency
•
•
•
•
•
•
•
•
Individual
Individual
Individual
Individual
Individual
Individual
1ndividual
Individual
Spec.
Spec.
Spec.
Spec.
Spec.
Spec.
Spec.
Spec.
Once/Shift
Once/Shift
Once/Shift
Once/Shift
Once/Shift
Once/Shift
Once/Shift
Once/Shift
•
•
•
•
•
•
Individual
Individual
Individual
Individual
Individual
Individual
Spec.
Spec.
Spec.
Spec.
Spec.
Spec.
Once/Shift
Once/Shift
Once/Shift
Once/Shift
Once/Shift
Once/Shift
37
•
QUALITY and RELIABILITY
Process Monitor (Continued)
Control Item
Spec. Limit
Insp. Frequency
Thin Film
• Cooling Water Temp.
• Thickness
·26±3°C
• Individual Spec.
Once/Shift
Once/Shift
CVD
• Pin Hole
• Thickness
• Individual Spec.
• Individual Spec.
Once/Shift
Once/Shift
Diffusion
• Tube Temp.
• C-V Plot Run
Tube
• Sheet Resistance
• Thickness
•
•
•
•
•
Once/Shift
Once/Shift
Once/10days
Once/Shift
Once/Shift
Process
Individual
Individual
Individual
Individual
Individual
Spec.
Spec.
Spec.
Spec.
Spec.
Raw Material Incoming Inspection
1. Mask Inspection
Defect Detection
• Pinhole & Clear-extension
• Opaque Projections &
Spots
• Scratch/Particle/Stain
• Substrate Crack/Glass-chip
• Others
Registration
• Run-out
(X-Y Coordinate)
• Orthogonality
• Drop-in Accuracy
• Die Fit/Rotation
Critical
Dimension
•
• Critical Dimension
All Masks
• Defect Size S 1.5/Lm
• Defect Density
sO.124EA/cm2
±0.75/Lm
20%
• All New Masks
±0.75/Lm
±0.50/Lm
±0.50/Lm
All Masks
Purchasing Spec.
• Instrument
• Auto mask inspection system for defect-detection (NJS 5MD-44)
• Comparator for registration (MVG 7X7)
• Automatic linewidth measuring system for CD (MPV-CD)
2. Wafer Inspection
Purpose
Insp. Items
Sample
Remarks
Structural
• Crystallographic Defect
All Lots
• Sirtl Etch
Electrical
• Resistivity
• Conductivity
All Lots
• Monitor Water
Dimensional
•
•
•
•
All Lots
TTV, NTV, Epi-thickness
Visual
Thickness
Diameter
Orientation
Flatness
• Surface Quality
• Cleanliness
TIR (FPD)
Local Slope
All Lots
Purchasing Spec.
• Instrument
• 4 point probe for resistivity (Kokusai VR-40A, Tencor sonogage, ASM AFPP)
• Flatness measuring system (Siltec)
• Epi. layer thickness gauge (Digilab FTG-12, Qualimatic S-100)
• Automatic Surface Insp. System (Aeronca Wis-150)
• Non-contact thickness gauge (ADE6034)
c8SAMSUNG
Electronics
38
QUALITY and RELIABILITY
In· Process Quality Inspection (FAB)
1. Manufacturing Section
Process Step
•
Frequency
Process Control Insp.
Oxidation
Oxide Thickness
All Lots
Diffusion
Oxide Thickness
Sheet Resistance
Visual
All Lots
All Lots
All Lots
Photo
Critical Dimension
Visual
Mask Clean Inspection
All Lots (MOS)
All Lots
All Masks with Spot Light (MOS)
or Microscope (BIP)
Etch
Critical Dimension
Visual
All Lots
All Wafers
Thin Film
Metal Thickness
Visual
All Lots
All Lots
Ion Implant
Sheet Resistance
All Lots (Test Wafer)
Low Temp.
Oxide
Thickness
All Lots
Visual
All Lots
E-Test
Electrical Characteristics
All Lots
Fab. Out
Visual
All Wafers
2. FAB, QC Monitor/Gate
Process Step
FAB, QC Insp.
Frequency
Oxidation
Oxide Thickness
C-V Test on Tubes
Visual
Once/Shift
Once/10 Days and After CLN
Once/Shift
Diffusion
Oxide Thickness
C-V Test on Tubes
Visual
Once/Shift
Once/10 Days and After CLN
Once/Shift
Photo
Critical Dimension
Visual
Mask CLN Inspection
All Lots (MOS)
Once/Shift
All Masks After 10 Times Use
Etch
Critical Dimension
Visual
All lots (MOS)
All Lots
Thin Film
C-V Test on Tubes
on Lots
Reflectivity
Once/10 Days and After ClN
Once/Shift
Once/Shift
Low Temp.
Oxide
Refractive Index,
Wt% of Phosphorus
Visual
1 Test Wafer/Lot
1 Test Wafer/Lot
1 Test Wafer/lot
E-Test
Measuring Data
All lots
Calibration
Instrument for Thickness
and C.D. Measuring
Once/week
c8SAMSUNG
Electronics
39
QUALITY and RELIABILITY
3. Photo/Etch process quality control
Process Flow
Process Step
MFG. Control Item
QC Monitor/Gate
Prebake
Oven PM, Temperature
Time
Photo Resist (PR)
-spin
Thickness Machine PM
Soft Bake
Oven PM, Temperature
Time
Temp. N2 Flow Rate
Align/Expose
Light Uniformity
Alignment, Focus Test
Mask Clean Inspection
Mask Clean Exposure
Light Intensity
Light Intensity
Mask Clean Insp.
Develop
Equipment PM
Solution Control
Vacuum
Develop
Check
PR/C.D.'S Alignment
Particles
Mask and Resist Defects
QC Inspection
Oven Particle Temp.
N2 Flow Rate
Critical Dimension (CD)
Hard Bake
Oven PM, Temperature
Time
Temp.
N2 Flow Rate
Etch
Etch rate, Equipment
PM & Settings, Etch
Time to Clear
Etchant Temp.
Etch Rate
Inspection
Over/Under
PR Strip
Machine-PM
Final Check
C.D.'S Over and under
Etch, Particles,
PR Residue, Defects,
Scratches
QC Inspection
Same as Final Check,
However, More Intense
on limited Sample
Basis. (AQL 6.5%)
Note: PM represents Preventive Maintenance
4. Reliability-related Interlayer Dielectric, Metallization, and Passivation Process Quality Control Monitor
Item
Frequency
Wt% Phosphorus Content of the Dielectric Glass
1/Shift
Metallization Interconnect
1/Month
AI Step Coverage
1/Month
Metallization Reflectivity
1/Shift
Passivation Thickness and Composition
1/Shift
Thin Film Defect Density
1/Shift
c8SAMSUNG
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40
QUALITY and RELIABILITY
Figure 9. General Wafer Fabrication Flow
Process Flow
Process Step
Major Control Item
I
Wafer and Mask
Input
Starting Material
Incoming Inspection
Mask: (See mask Inspection)
Wafer: (See wafer Inspection)
Wafer Sorting and
Labelling
Resistivity
Initial Oxidation
Oxide Thickness
Photo
• (See manufacturing section)
• (See FAB, QC Monitor/gate)
Inspection
• Critical Dimension
• Visual/Mech - Major: AQL 1.0%
- Minor: AQL 6.5%
QC Gate
• Critical Dimension
¢
Etch
• (See manufacturing section)
• (See FAB, QC Monitor/gate)
0
Inspection
• Critical Dimension
• Visual/Mech - Major: AQL 1.0%
- Minor: AQL 6.5%
QC Gate
• Critical Dimension
• Visual/Mech
Diffusion
Metalization
• (See in-process Quality Inspection)
E-test
• Electrical Characteristics
I
I
Diff'n
Metal
I
9
c8SAMSUNG
Electronics
41
QUALITY and RELIABILITY
Figure 9. General Wafer Fabrication Flow (Continued)
Process Flow
<>
Process Step
Major Control Item
QC Gate
• Electrical Characteristics
Back-Lap
• Thickness
Back Side Evaporation
• Thickness, Time
Evaporation Rate
Final Inspection
• All Wafers Screened
(Visual/Mech)
QC Fab. Final Gate
• Visual/Mech.
- Major: AQL 1.0%
- Minor: AQL 6.5%
EDS
(Electrical Die Sorting)
QC Gate
• Function Monitor
Sawing
Inspection
• Chip Screen
QC Final Inspection
•
•
•
•
AQL 1.0%
Fab. Defect
Test Defect
Sawing Defect
Die Attach
c8~SUNG
42
QUALITY and RELIABILITY
ASSEMBLY
The process control and inspection points of the assembly operation are explained and listed below:
1. Die Inspection:
Following 100% inspection by manufacturing, in-process Quality Control samples each lot according to internal
or customer specifications and standards.
2. Die Attach Inspection:
Visual inspection of samples is done periodically on a machine/operator basis. Die Attach techniques are monitored
and temperatures are verified.
3. Die Shear Strength:
Following Die Attach, Die Shear Strength testing is performed periodically on a machine/operator basis. Either
manual or automatic die attach is used.
DIE ADHESIVE THICKNESS MONITOR RESULTS. (JEOL SEM, JSM IC845)
4. Wire Bond Inspection:
Visual inspection of samples is complemented by a wire pull test done periodically during each shift. These
checks are also done on a machine/operator basis and XR data is maintained.
5. Pre-Seal/Pre-Encapsulation Inspection:
Following 100% inspection of each lot, samples are taken on a lot acceptance basis and are inspected
according to internal or customer criteria.
WIRE LOOP MONITOR RESULTS.
c8SAMSUNG
Electronics
CROSS SECTION INSPECTION FOR BALL BOND.
43
I
QUALITY and RELIABILITY
6. Seal Inspection:
Periodic monitoring of the sealing operation checks the critical temperature profile of the sealing oven for both
glass and metal seals.
7. Post-Seal Inspection:
Subsequent to a 100% visual inspection, In-Process Quality Control samples each for conformance to visual
criteria.
X-RAY MONITOR RESULT.'(PHILIPS MG161)
8. General Assembly Flow is shown in Figure 11.
Sampling Plans
1. Sampling plans are based on an AQL (Acceptable Quality Level) concept and are determined by internal or by
customer specifications.
2. Raw Material Incoming Inspection. (confinued)
Material
Inspection Item
Lead Frame
1)
2)
3)
4)
Wafer
1) Visual Inspection
AQL 0.65%
1) Visual Inspection
2) Bond Pull Strength Test
3) Bondability Test
n:5, C=O
n: 13, C=O
Critical Defect: 0.65%
Major Defect: 1.0%
Minor Defect: 1.5%
n: 5, C=O
AuiAI
Wire
Visual Inspection
Dimension Inspection
Function Test
Work Test
Acceptable Quality Level
4) Chemical Composition Analysis
1) Visual Inspection
2) Moldability Test
Molding
Compo~nd
3) Chemical Composition Analysis
c8SAMSUNG
Electronics
LTPD
LTPD
LTPD
LTPD
10%,
20%,
20%,
20%,
C=2
C=O
C=O
C=O
n: 5, C=O
Critical Defect: 0.15%
Major Defect: 1.0%
Minor Defect: 1.5%
n: 5, C=O
44
QUALITY and RELIABILITY
•
MOLDING COMPOUND INCOMING INSPECTION
(THERMAL ANALYSER, DUPONT 9900)
(Continued)
Material
Inspection Item
Visual Inspection
Dimension Inspection
Electro-Static Inspection
Hardness Test
Acceptable Quality Level
Packing Tube
& Pin
1)
2)
3)
4)
Solder
1) Visual Inspection
2) Weight Inspection
3) Chemical Composition Analysis
LTPD 20% C=O
LTPD 20% C=O
LTPD 20% C=O
Flux
1) Acidity Test
2) Specific Gravity Test
3) Chemical Composition Analysis
LTPD 20% C=O
LTPD 20% C=O
LTPD 20% C=O
Solder Preform
1) Visual Inspection
2) Work Test
3) Chemical Composition Analysis
AQL 1.0%
AQL 1.0%
AQL 1.0%
Coating Resin
1) Visual Inspection
2) Work Test
3) Chemical Composition Analysis
AQL 1.0%
AQL 1.0%
AQL 1.0%
1) Work Test
2) Mark Permanency Test
Critical Defect: 0.15%
Major Defect: 1.0%
Minor Defect: 1.5%
n: 5, C=O
Chip Carrier
1)
2)
3)
4)
Visual Inspection
Dimension Inspection
Electro-Static Inspection
Hardness Test
LTPD 15% C=2
LTPD 15% C=O
n: 5, C=O
n: 5, C=O
Vinyl Pack
1) Visual Inspection
2) Work Test
3) Electro-Static Inspection
LTPD 20% C=O
LTPD 20% C=O
LTPD 15% C=O
Ag Epoxy
1) Work Test
2) Chemical Composition Analysis
n:8, C=O
n:8, C=O
Letter Marking
1) Visual Inspection
2) Work Test
Spare Parts
& Others
1) Dimension Inspection
2) Visual Inspection
Marking Ink
qsSAMSUNG
Electronics
LTPD 15%, C=2
LTPD 15% C=2
n: 5, C=O
n: 5, C=O
n:5, C=O
n:5, C=O
45
QUALITY and RELIABILITY
3. In-Process Quality Inspection
A. Assembly Lot Acceptance Inspection
(1) Acceptance quality level for wire bond gate inspection
Defect Class
Critical Defect
Major Defect
Minor Defect
Inspection Level
AQL 0.65%
AQL 1.0%
AQL 1.5%
Type of Defect
-
Missing Metal
Chip Crack
No Probe
Epoxy on Die
Mixed Device
Wrong Bond
Missing Bond
-
Diffusion Defect
Ink Die
Exposed Contact
Bond Short
Die Lift
Broken Wire
-
Metal Missing
Metal Adhesion
Pad Metal Discolored
Tilted Die
Die Orientation
Partial Bond
-
Oxide Defect
Probe Damage
Metal Corrosion
Incomplete Wetting
Weakened Wire
Adjacent Die
Passivation Glass
Die Attach Defect
Wire Loop Height
Extra Wire
-
Contamination
Ball Size
Wire Clearance
Bond Deformation
.-
(2) Acceptance quality level for MoldlTrim gate inspection
Defect Class
Inspection Level
Kind of Defect
Critical Defect
AQL 0.15%
-
Incomplete Mold
Void, Broken Package
Misalignment
-
Deformation
No Plating
Broken Lead
Major Defect
AQL 0.4%
-
Ejector Pin Defect
Package Burr
Flash on Lead
-
Crack, Lead Burr
Rough Surface
Squashed Lead
Lead Contamination
Poor Plating
Package Contamination
Bent Lead
AQL 0.65%
-
-
Minor Defect
B. In-process monitor inspection
Inspection Item
Frequency
Reference
Die Shear Test
Bond Strength Test
Solderability Test
Mark Permanency Test
Lead Integrity Test
In-Process Monitor
Inspection for Product
• X-Ray Monitor
Inspection for Molding
• Monitor Inspection
for Production Equipment
Each Lot
Each Lot
Weekly
Weekly
Weekly
4 Times/Shift/Each Process
MIL-STD-883C,2019-2
MIL-STD-883C,2011-4
MIL-STD-883C,2003-3
MIL-STD-883C, 2015-4
MIL-STD-883C, 2004-4
Identify for Each ~ontrol Limit
2 Times/Shift/Mold Press
Identify for Each Control Limit
2 Times/Shift/Each Unit of
Equipment
Identify for Each Control Limit
•
•
•
•
•
•
c8SAMSUNG
Electronics
46
QUALITY and RELIABILITY
4. Outgoing quality inspection plan (LTPD)
Defect Class
Critical Defect
electrical
visual
Major
Minor
Discrete
LSI
Kind of Defect
1%
2%
Open, short
Wrong configuration, no marking
Defect
electrical
visual
1.5%
3%
Items which affect reliability most strongly
Defect
electrical
visual
2%
5%
Items which minimally or do
not affect reliability at all
(cosmetic, appearance, etc.)
·c8SAMSUNG
Electronics
I
47
QUALITY and RELIABILITY
Figure 10. General Assembly Flow
Process Flow
Major Control Item
Process Step
y
9
Wafer
Wafer Incoming
Inspection
Tape Mount
Sawing Q.C. Monitor
¢
Q.C. Wafer Incoming Inspection AQL 4.0%
Q.C. Monitoring:
- Chip-out
- Crack
- Sawing-speed
- D.1. Purity
-
Visual Inspection
100% Screen:
- FAB Defect
- EDS Test Defect
- Sawing & Scratch Defect
Q.C. Gate
1st AQL 1.0%
Reinspection AQL: 0.65%
Scratch
Sawing Discoloration
Cut Count
CO 2 Bubble Purity
--
I
Lead Frame (LlF)
Lead Frame Incoming
~~
*Q.C.LlF Incoming Inspection
1. Acceptance Quality Level
- Dimension LTPD 20%, C=O
- Visual & Mechanical: LTPD 10%, C=2
- Functional Work Test: LTPD 10%, C = 2
Die Attach (D/A)
Q.C. Monitor
I
I
*Q.C.D/A Monitor Inspection
1. Bond force
2. Frequency: 4 Times/Station/Shift
3. Sample: 24 ea Time
4. Acceptance Criteria
I
II
I
~l
Detect
Acceptance
Critical
a
Major
1
I
R~~I
2
I
Cure
c8SAMSUNG
Electronics
48
QUALITY and RELIABILITY
Figure 10. General Assembly Flow (Continued)
Process Flow
Process Step
Q.C. Monitor
<>
Major Control Item
•
*Q.C. Cure Monitor Inspection
1. Control Item
- Temperature
- In/out Time
2. Frequency
- 1 Time/Shift
Au Wire
Bonding Wire
Incoming Inspection
I
*Q.C Au Wire Incoming Inspection
1. Visual Inspection: N 5, C 0
2. Bond Pull Test Strength Test: N
3. Bondability Test
....:... Critical Defect: AQL 0.65%
- Major Defect: AQL 1.0%
- Minor Defect: AQL 1.5%
=
=
=13, C =0
Wire Bonding (W/B)
100% Visual
Inspection
Q.C. Monitor
*Q.C. W/B Monitor Inspection
1. Frequency: 6 Times/Mach/Shift
c---
Q.C. Gate
1. Q.C. Acceptance Quality Level
- Critical Defect: AQL 0.65%
- Major Defect: AQL 1.0%
- Minor Defect: AQL 1.5%
Mold Compound
Incoming Inspection
Mold
*Moldability Test
- Critical Defect: AQL 0.15%
- Major Defect: AQL 1.0%
- Minor Defect: AQL 1.5%
Mold
Q.C. Monitor
c8SAMSUNG
Electronics
*Q.C. Mold Monitor Inspection
1. In-Process Monitor Inspection
- Frequncy: 4 Times/Station/Shift
- Sample: 200 UnitslTime
2. Acceptance Quality Level
- Critical Defect: AQL 0.25%
- Major Defect: AQL 0.4 %
49
QUALITY and RELIABILITY
Figure 10. General Assembly Flow (Continued)
Process Flow
n
16
Process Step
Major Control Item
Cure
Q.C. Monitor
*Q.C. Cure Monitor Inspection
1. Control Item
- Temperature
- In/out Time
2. Frequency
- 1 Time/shift
Deflash
Q.C. Monitor
I
*Q.C. peflash Monitor Inspection
1. Control Item
- Pressure
- Belt Speed
- Visual/Mechanical Inspection
2. Frequency: 4 Times/Mach/Shift
3. Identify each Defect Control Limit
TRIM/BEND
)-
I
YI
Q.C. Monitor
*Q.C. Trim/Bend Monitor Inspection
1. Visual Inspection
2. Frequency: 4 Times/Station/Shift
Solder
100% Visual Inspection
Q.C. Monitor
*Q.C. Solder Monitor Inspection
1. Frequency: 4 Times/Mach/Shift
2. Criteria
- Critical Defect: AQL 0.65%
- Major Defect: AQL 1.0%
Q.C. Gate
*Q.C. Mold Gate
- Acceptance Criteria
Critical Defect: AQL 0.15%
Major Defect: AQL 0.4%
Minor Defect: AQL 0.65%
Test
100% Electrical Test
Q.C. Monitor
Correlation Sample Reading for Initial
Device Test
Mark
100% Visual Inspection
c8SAMSUNG
Electronics
50
QUALITY and RELIABILITY
Figure 10. General Assembly Flow (Continued)
Process Flow
o
Process Step
Major Control Item
PRT Monitoring
(Process Reliability
Testing)
1. PRT
- HOPL (168 HRS), PCT (48 HRS)
- Other (when applicable)
2. Acceptance Criteria: LTPD 10%
Q.C. Monitor
*Q.C. Marking Monitor Inspection
- Frequency: 4 Times/Station/Shift
- Sample: 24 UnitslTime
- Identify for Each C.L.
- Acceptance Criteria
Defect
Acceptance
Critical
o
Major
I
I
<>
I
Reject
2
Q.C. Gate
*Q.C. Final Acceptance Level
- Critical Defect: AQL 0.15%
- Major Defect: AQL 0.4%
- Minor Defect: AQL 0.65%
Q.A. Gate
*Q.C. Incoming Inspection
1. Critical Defect:
- Electrical Test: LTPD
- Visual Test:
LTPD
2. Major Defect:
- Electrical Test: LTPD
- Visual Test:
LTPD
3. Minor Defect:
- Electrical Test: LTPD
- Visual Test:
LTPD
2% (N = 116, C = 0)
2% (N =116, C=O)
3% (N = 116, C = 1)
3% (N = 116, C = 1)
5% (N = 116, C = 2)
5% (N = 116, C = 2)
Stock
* Age Control
Q.A. Gate
*Q.A. OutgOing Inspection
1. Quantity
2. Customer
3. Packing
4. Sampling Inspection (when applicable)
- Sampling plan is same as incoming
Inspection
Shipment
c8SAMSUNG
Electronics
51
QUALITY and RELIABILITY
SAMSUNG's BEST PROGRAM
The SAMSUNG Best Program has been designed to offer the customer an alternative to standard off-the-shelf plastic
encapsulated LI!(JEAR circuits. The Best Program will significantly reduce incoming inspection requirements as
well as early device failures (infant mortalify). These results are achieved by a tightened AQL inspection plan and
a burn-in of each unit for 160 + 8, - 0 hours at 125°C or equivalent conditions established from a time/temperature
regression curve.
The AQL Plan. Acceptable Quality Levels (AQL) are a measure of the quality of outgoing LINEAR circuits. These
levels are established by the manufacturer to show the process percent defective being produced and to ensure
that the customer is receiving material that meets his requirements. The SST Best Program has tightened these
AQL levels to a point at which incoming inspection by the customer is no longer a necessity. Best product quality
is monitored significantly more closely than standard product; those lots which fall the AQL level are 100% reworked
before resubmission to the AQL gate.
The Reliability Plan. Reliability is the statistical probabi~ity that a product will give satisfactory performance for
a specified period of time when used under specified conditions. A typical rate curve is shown below:
INFANT
MORTALITY
I
W
I-
«
a:
w
a:
:::J
....J
«
u..
o
RANDOM FAILURES AT A
LOW CONSTANT FAILURE RATE
~
____ _____________________________
~
BURN INI
PERIOD 1
OPERATING LlFE--
~-~-
eliability theory assumes that devices fail according to the above curve. When a group of devices is manufactured a small portion of the units will be inherently weaker than the average. These weak units will probably fail
during the first few hours of operation-hence the term "infant mortaH!y." If the units are burned-in however, thereby
allowing the weak units to fail, there is a much lower probability that those finally put into system use will fail.
The SAMSUNG Best Flow. In order to achieve an extremely high quality unit and reduce infant mortality failures
the following flow has been established:
c8SAMSUNG
Electronics
52
QUALITY and RELIABILITY
Process Flow
FLOW CHART
DESCRIPTION
I
I
I
ENCAPSULA TION
MOLDING COMPOUND ULTRA PURE FOR LINEAR
APPLICA nONS
I
I
POST MOLD BAKE
6 HOURS AT 175 DEG. C.
CURES PLASTIC
STRESSES ALL WIRE BONDS AND DIE
I
I
I
I
OIS FUNCTIONAL ELECTRICAL
100% TESTING
OPENS/SHORTS AND INTERMITTENTS REMOVE
I
HIGH TEMPERATURE BURN-IN
160 HOURS AT 125 DEG. C. OR EQUIVALENT
CONDITIONS ESTABLISHED FROM A TIME/
TEMPERATURE REGRESSION CURVE. 0.96 eV
I
FULL FUNCTIONAL AND PARAMETRIC
ELECTRICAL TESTING
100% ELECTRICAL TESTING AC, DC
88 DEG. C.
§
c8SAMSUNG
Electronics
I
WAFER FABRICATION
LINEAR PROCESS
CV PLOTS
OXIDE THICKNESS MEASUREMENTS
OPTICAL INSPECTIONS
SEM ANALYSIS
I
TIGHT AQL SAMPLING PLAN
ELECTRICAL-0.05% AQL AT 88 DEG. C.
MECHANICAL-O.o1% AQL CRITICAL & MAJOR
SHIP UNITS
53
QUALITY and RELIABILITY
RELIABILITY AND PREDICTION THEORY
RELIABILITY
Reliability can be loosely characterized as long term product quality.
There are two types of reliability tests: those performed during design and development, and those carried out
in production. The first type is usually performed on a limited sample, but for long periods or under very accelerated
conditions to investigate wearout mechanisms and determine tolerances and limits in the design process. The
second type of tests is performed periodically during production to check, maintain, and improve the assured quality
and reliability levels. All reliability tests performed by Samsung are under conditions more severe than those
encountered in the field, and although accelerated, are chosen to simulate stresses that devices will be subjected
to in actual operation. Care is taken to ensure that the failure modes and mechanisms are unchanged.
FUNDAMENTALS
A semiconductor device is very dependent on its conditions of use (e.g., junction temperature, ambient temperature, voltage, current, etc.). Therefore, to predict failure rates, accelerated reliability testing is generally used. In
accelerated testing, special stress conditions are considered as parametrically related to actual failure modes.
Actual operating life time is predicted using this method. Through accelerated stresses, component failure rates
are ascertained in terms of how many devices (in percent) are expected to fail for every 1000 hours of operation.
A typical failure rate versus time of activity graph is shown below (the so-called "bath tub curve")
>-(1)
Reduction due to
Failure t-----l.....---~-~-----7II:...-..;....r_- preventive maintenance
• m=1
• m: SHAPING PARAMETER
rate
s ern/CondUct
:----.., - - - __
Specified
Failure Rate
(rn ::: 0 5 oor Devices
. - .95)
TIME
Initial
Random Failure period
Failure period
Wear-Out Failure period
Figure 3_ Failure Rate Curve ("Bath Tub Curve")
During their initial time period, products are affected by "infant mortality," intrinsic to all semiconductor technologies.
End users are very sensitive to this parameter, which causes early assembly/operation failures in their own
system. Periodically, Samsung reviews and publishes life time results. The goal is a steady shift of the limits as
shown below.
>-(1)
Failure
Rate
\jl--+---'--------'-:
£',>-(1)
I
I
I
I
~
6(1) IREDUCED
--TIME
Figure 4. Failure Rate
=8SAMSUNG
Electronics
54
QUALITY and RELIABILITY
ACCELERATED HUMIDITY TESTS
To evaluate the reliability of products assembled in plastic packages, Samsung performs accelerated humidity
stressing, such as the Pressure Cooker Test (PCT) and Wet High Temperature Operating Life Test (WHOPL).
Figure 5 shows some results obtained with these tests, which illustrate the improvements in recent years. These
improvements result mainly from the introQuction of purer molding resins, new process methods, and improved
cleanliness.
1980
99.9
99
I
I
90
w
a:
3
~
I-
ifi
()
I
I
70
50
1982
30
20
II
...w
>
/~
1/
a: 10
w
./
5
5
J
/
/h
If
~
:=;;
~
/'"
If'
1985
1986
'"
,;'
()
0.5
..
~
_-
--
V'~
0.1
10
HOURS
1(J2
Figure 5. Improvement in Humidity Reliability
ACCELERATED TEMPERATURE TESTS
Accelerated temperature tests are carried out at temperatures ranging from 75°C to 200°C for up to 2000 hours.
These tests allow Samsung to evaluate reliability rapidly and economically, as failure rates are strongly dependent
on temperature.
The validity of these tests is demonstrated by the good correlation between data collected in the field and laboratory
results obtained using the Arrhenius model. Figure 6shows the relationship between failure rates and temperatures
obtained with this model.
25
40
60
80
100
125
150
180 200 T (0G)
Figure 6. Failure Rate Versus Temperature
=8SAMSUNG
Electronics
55
I
QUALITY and RELIABILITY
FUNDAMENTAL THEORY FOR ACCELERATED TESTING
Accelerated life testing is powerful because of its strong relation to failure physics. The Arrhenius model, which
is generally used for failure modelling, is explained below.
1. Arrhenius model
This model can· be applied to accelerated Operating Life Tests and uses absolute (Kelvin) temperatures.
L = A + EalK·Tj
L : Lifetime
A : Constant
Ea : Activation Energy
K : Boltzman's constant
Tj : Absolute Junction temperature
If Lifetimes L1 and L2 correspond to Temperatures T1 and T2:
L1 = L2 exp
Ea
K
1
1
(T1 - T2 )
/
/
Lifetime(L)
Temperature 11T (OK-1)
Actual junction temperature should always be used, and can be computed using the following relationship.
Tj =Ta+(P x
0ja)
Where Tj = Junction temperature
Ta = Ambient temperature
P = Actual power consumption
ja = Junction to Ambient thermal resistance (typically 100 degrees celsius/watt for a 16-Pin PDIP).
o
2. Activation Energy Estimate
Clearly the choice of an appropriate activation energy, Ea, is of paramount importance. The different mechanisms
which could lead to circuit failure are characterized by specific activation energies whose values are published
in the literature. The Arrhenius equation describes the rate of many processes responsible for the degradation
and failure of electronic components. It follows that the transition of an item from an initially stable condition to
a defined degraded state occurs by a thermally activated mechanism. The time for this transition is given by an
equation of the form:
MTBF = B EXP (EalKT)
MTBF = Mean time between failures
B
= Temperature-independent constant
MTBF can be defined as the time to suffer a device degradation. The dramatic effect of the choice of the Ea value
can be seen by plotting the MTBF equation. The acceleration effect for a 125°C device junction stress with respect
to lO°C actual device junction operation is equal to 1000 for Ea 1eV and 1 for Ea 0.3eV.
=
c8SAMSUNG
Electronics
=
56
QUALITY and RELIABILITY
Some words of caution are needed about published values of Ea:
A. They are often related to high-temp tests where a single Ea (with high value) mechanism has become dominant.
B. They are specifically related to the devices produced by that supplier (and to its technology) for a given period
of time
C. They could be modified by the mutual action of other stresses (voltage, mechanical, etc.)
D. Field device-application condition(s} should be considered.
(Activation energy for each failure mode)
Failure Mechanism
Ea
Contamination
Polarization
Aluminum Migration
·Trapping
Oxide Breakdown
Silicon Defects
1-1.4 eV
1 eV
0.5 -1 eV
1 eV
0.3 eV
0.3 -0.5 eV
THE CORRECT PROCEDURE
ACCELERATED TEST
t
CALCULATED AT TEST CONDITIONS
AND WITH A CERtAIN CONFIDENCE
LEVEL
FAILURE ANALYSIS
I
CHOICE OF Ea---CALCULATED AT OTHER
TEMPERATURES
Time
1.4 ey- f---1 eV
106
,
0
&i
u.
/
,
0
j
1()3
0.8e~
,
II
J
1()4
c:
~CD
/
/
105
,
/
.0.5~
/
O.4e~
CD
0
0
<{
// /
102
/)' '/
10'
10B
,
"
~
./
-
-0.3e~
~
. / . / ~-- ~
~-I
250
200 175 150 125
100
75
50
T(°C)
Junction Temperature
Figure 7. Acceleration Factor Vesus Temperature
c8SAMSUNG
Electronics
57
•
QUALITY and RELIABILITY
Failure Rate Prediction
Accelerated testing defines the failure rate of products. By derating the data at different conditions, the life
expectancy at actual operating conditions can be predicted. In its simplest form the failure rate (at a given temperature)
is:
N
FR=[5H
Where FR =
N =
D =
H =
Failure Rate
Number of failures
Number of components
Number of testing hours
If we intend to determine the FR at different temperatures, an acceleration factor must be considered. Some failure
modes are accelerated via temperature stressing based upon the accelerations of the Arrhenius Law.
For two different temperatures:
FR (T1)= FR (T2) exp
Ea
K
1
(T2 -
1
T1)
FR (T1) is a point estimate, but to evaluate this data for an interval estimate, we generally use a X2 (chi square)
distribution. An example follows:
Failure Rate Elaluation
Unit: %/1000HR
Dev. x Hours
at 125°C
Fail
1.7 x 106
2
Failure Rate at 60% Confidence Level
Point Estimate
0.18
I
I
85°C
0.0068
I
I
70°C
0.0018
I
I
55°C
0.00036
The activation energy, from analysis, was chosen as 1.0 eV based upon test results. The failure rate at the lower
operating temperature can be extrapolated by an Arrhenius p19t.
c8SAMSUNG
Electronics
58
IIIII
I
LINEAR ICs
FUNCTION GUIDE
1. TELECOMMUNICATION APPLICATION FUNCTION
Application
Type
Circuit Function
Package
'Tone Ringer
KA2410
KA2411
8 DIP
Adjustable warbling and 2 frequency tone
External triggering or ringer disable (KA2410)
Adjustable supply initiating current (KA2411)
Built-in hysteresis
Tone Ringer with
Bridge Rectifier
KA2418
8 DIP
Protect against over voltage
Low current consumption
Allow the parallel operation of 4 devices
Built-in hysteresis
External component's are minimized
High output voltage
DTMF Dialer
KS5808
16 DIP
Direct telephone line operation
Standard 2 of 8 key board use
Tone output: Bipolar output
Mute output: N-CH open drain
ttKS5809
16 DIP
Low power dfssipation
Single contact key board use
Tone output: Bipolar output
Mute output: N-CH open drain
ttKS5810
16 DIP
Low power dissipation
Single contact key board use
31 digit redial (Column 4 keys)
Tone output: Bipolar output
Mute output: N-CH open drain
ttKS5811
16 DIP
Low power dissipation
Standard 2 of 8 key board use
31 digit redial (# key)
Tone outp'u-t: Bipolar output
Mute output: N-CH open drain
KA2413
16 DIP
Wide operating line voltage and current range
Short start up time
External components are minimized
Internal protection of all inputs
KS5805A/B
18 DIP
KS5805A: Pi n 2; Vref
KS5805B: Pin 2; Tone output
RC oscillator used as frequency reference
DP out, 17 digit redial'
tKS58C/D05
18 DIP
KS58C05: Pin 2; Vref
KS58D05: Pin 2; Tone output
RC oscillator used as frequency reference
DP output, 32 digit redial
tKS58E05
16 DIP
DP output
Pulse Dialer with
Redial
•
RC oscillator used as frequency reference
32 digit redial
qsSAMSUNG
Electronics
61
LINEAR ICs
FUNCTION GUIDE
TELECOMMUNICATION APPLICATION
Application
DTMF/Pulse
Switchable Dialer
DTMF/Pulse
Switchable with
10 No Memory
(Continued)
Package
Circuit Function
22 DIP
18 DIP
Tone/pulse switchable dialing, touch key or slide switch
32 digit redialing & PABX auto-pause time
Make/break ratio pin selectable
tKS5822
22 DIP
10 No x 16 digit memory including a redial memory
Including PABX auto pause time
10 pps/20 pps pin selectable
Make/Break pin selectable
On/Off hook memory
tKS58A/B/CID23
18 DIP
10 No x 16 digit memory including a redial memory
Including PABX auto pause time
Make/Break pin selectable
Type
KS58A/B/CID19
KS58A/B/CID20
Speech Network
KA2412A
14 DIP
Transmit/Receiver amplifier
Side tone control
On Chip regulator
Low Voltage
Speech Network
with Dialer Interface
KA2425A/B
18 DIP
Low Voltage Operation (1.5V)
Tx, Rx & side tone gain set by external resistor
Loop length equalization for Tx, Rx & sidetone
Provides regulated voltage for CMOS dialer
DTMF level adjustable with a single resistor
A: Mute active low B: Mute active high
18 DIP
Full DTMF Receiver
Provides DTMF high and low group filtering
Dial tone suppression
Adjustabe acquisition and release times
Integrated bandsplit filter and digital decoder functions
High quality and performance
Single + 5 Volt power supply
DTMF Receiver
tKT3170
Tone Decoder
LM567C/L
8 DIP
t8 SOP
Touch tone decoding
Sequential tone decoding
Communication paging
High stable center frequency
LM567L: Micropower (4mW at 5V) dissipation
FM IF Amplifier
MC3361
16 DIP
t16 SOP
Small current dissipation (Typ. 3.5mA: Vee 4.0V)
Excellent input sensitivity
Communication paging
Used to cordless telephone parts required
Work from 1.8V to 7.0V
Codec
KT5116
tKT8520
ttKT8521
c8SAMSUNG
Electronics
16 CERDIP /A--Law: KT5116
24 CERDIP wLaw: KT8520
A-Law: KT8521
± 5V operation
22 CERDIP Low power consumption
Synchronous or asynchronous operation
62
LINEAR ICs
FUNCTION GUIDE
TELECOMMUNICATION APPLICATION
Application
Codec Filter
Combo Codec
Type
KT3040/A
tKT8554
tKT8557
tKT8564
ttKT8567
TSAC
tKT8555
Package
16 CERDIP
(Continued)
Circuit Function
Exceeds all D3/04 and CCITI spec.
± 5V operation
Low power consumption
20dB gain adjust range
Sin XIX correction in receive filter
TIL and CMOS compatible logic
I
16 CERDIP Exceeds all D3/D4 and CCITI spec.
16 CERDIP Complete CODEC and filtering system including
± 5V operation
20 CERDIP Low power consumption
20 CERDIP TIL and CMOS compatible logic
Receive push-pull power amp (KT8564/7)
20 CERDIP Controls up to 8 COMBO CODEC/Filters
Low power consumption
Single 5V operation
Up to 32 time slots per frame
Line Driver
MC1488
ttKS5788
14 DIP
t14 SOP
Conformance EIA standard No. RS-232C & V28 (CCITT)
Quad line driver
Interface between data terminal equipment (DTE)
and data communication equipment (DC E)
Current limited output: ± 10mA typo
Power-off source impedance 300 ohms min.
Compatible with DTL and TIL, HCTLS families
Flexible operating supply range
KS5788: Low power CMOS version
Line Receiver
MC1489/A
ttKS5789A
14 DIP
t14 SOP
Conformance EIA standard No. RS-232C & V28 (CCITT)
Quad line receiver
Interface between data terminal equipment (DTE)
and data communication equipment (DCE)
Input signal range ± 30 volts
Input threshold hysteresis built in
Response control
a) Logic threshold shifting
b) Input noise filtering
KS5789A: Low Power CMOS version
Line Transceiver
ttKA2654
8 DIP
Conformance EIA Standard No RS-232C & V28 (CCITT)
One Driver & One Receiver on chip
Wide supply voltage (±4.5V-±15V)
Including reference regulator
Response control provides
TIL compatible
ttKS5706
16 DIP
16 SOP
Conformance EIA Standard No RS-232 & V28 (CCITI)
Low power consumption (CMOS)
3 Drivers & 3 Receivers one chip
,c8SAMSUNG
Electronics
63
LINEAR ICs
FUNCTION GUIDE
TELECOMMUNICATION APPLICATION
Application
Peripheral
Driver Array
(Continued)
Type
Package
tKA2655/6/7/8/9
16 DIP
16 SOP
Including 7 NPN darlington-connected transistors
These arrays are well suited for driving lamps,
relays, or printer hammers in a variety of industrial
and consumer applications.
High breakdown voltage and internal suppression
diodes insure freedom from problems associated
with inductive loads
Circuit Function
Fluorescent
Display Driver
KA2651
18 DIP
Consisting of 8 NPN darlington output stages and
associated common-emitter input stages
Digit or segment drivers
Low input current, internal output pull-down resistor
High output breakdown voltage
Single or split supply operation
8·Channel
Source Driver
KA2580A
18 DIP
TIL, CMOS, PMOS, NMOS compatible
High output current ratings
Internal transient suppression
Efficient input/output pin structure
Drive telephone relays, incandescent lamps, and LEOS
KA2588A
20 DIP
KA2588A: Separated logic and driver supply line
24 DIP
40 DIP
The data formatting and control to interface serial
asynchronous data communications between main
system and subsystems.
Low power, high speed CMOS process
Serial/parallel conversion of data 8 and 9 bit
transmission
Programmable control register
Optional ..;- 1, ..;- 16, and ..;- 64 clock modes
Peripheral/modem control functions
Double buffered
Included 4 UART in one chip (KS5812)
Universal
Asynchronous
Receiver and
Transmitter (UART)
ttKS5824
KS5812
t New Product
tt Under Development
c8SAMSUNG
Electronics
64
FUNCTION GUIDE
LINEAR ICs
2. VOLTAGE REGULATOR
A. 3·Terminal Fixed Positive Voltage Regulator
Function
Type
Package
Features
Application
5V, 6V, 8V, 12V, 15V, 18V and
Output current in excess of 3A
Internal thermal overload protection 24V fixed output voltage
Internal short circuit current limiting 5V output voltage
Very High
Output
Current (3A)
KA78T05
ttKA78TXX
TO·220
TO·3P
LM323
TO·3P
High Output
Current
(l o =1A)
MC78XX
series
TO·220
5V, 5.2V, 6V, 8V, 8.5V, 9V, 10V,
Maximum output current 1A
External components are minimized 11V, 12V, 15V, 18V and
24V fixed output voltage
Internal protection circuit for
output short
Positive voltage regulator
Variable application control
tKA340XX
series
TO·220
Output current in excess of 1A
Very low line regulation: 0.01 %
Very low load regulation: 0.3%
TO·220
Maximum output current 500mA
5V, 6V, 8V, 10V, 12V, 15V, 18V,
External components are minimized 20V and 24V fixed output
Internal protection circuit for
voltage
output short
Positive fixed output voltage
regulator
Variable application circuit
Medium
Output
Current
(10 = 500mA)
MC78MXX
series
Low Output
Current
(l o =100mA)
MC78LXXAC TO·92
series
5V,6V, 8V, 9V, 10V, 11V, 12V,
15V, 18V and 24V fixed output
voltage
Output current in excess of 100mA 2.6V, 5V, 6.2V, 8V, 8.2V, 9V, 12V
External components minimized
15V, 18V and 24V fixed output
voltage
Internal protection circuit for
output short
Positive voltage regulator
Variable application circuit
B. 3·Terminal Fixed Negative Voltage Regulator
Function
Type
Package
Features
Application
High Output
Current
(l o =1A)
MC79XX
series
TO·220
Output current in excess of 1A
-2V, -5V, -6V, -8V, -12V,
Internal thermal overload protection -15V, -18V and - 24V fixed
Internal short circuit current limiting 'output
Medium
Output Current
(l o =500mA)
MC79MXX
series
TO·220
Output .current in excess of 500mA -5V, -6V, -8V, -12V, -15V,
Internal thermal over load protection - 18V and - 24V fixed output
Internal short circuit current limiting voltage
Low Output
Current
(10= 100mA)
MC79L05AC TO·92
ttMC79LXXAC
series
Output current in excess of 100mA - 5V, -12V, -15V, -18V and
Internal short circuit current limiting - 24V fixed output voltage
External components minimized
t New Product
tt Under Development
c8SAMSUNG
Electronics
65
•
LINEAR ICs
c.
FUNCTION GUIDE
Precision Voltage Regulator
Function
Type
Package
Features
Application
Adjustable
Regulator
LM723
14 DIP Positive or negative supply operation Output voltage adjustable from
14 SOP Series, shunt, switching or floating 2 to 37V
operation
0.01 % line and load regulation
Output current up to 150mA without
external pass transistor
Adjustable
Regulator
LM317
TO·220
Output current in excess of 1.5A
Positive output adjustable from
1.2V to 37V
Internal short circuit current limiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
KA337
TO·220
Output current in excess of 1.5A
Negative output adjustable from
-1.2V to -37V
Internal short circuit current limiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
tKA350
TO·3P
Output current in excess of 3A
Positive output adjustable from 1.2V
to 33V
Internal short circuit current limiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
ttKA7501
TO·92
Output current in excess of 100mA
Positive output adjustable from 1.2V
to 37V
Internal short circuit current rimiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
ttKA7502
TO·220
Output current in excess of 500mA
Positive output adjustable from 1.2V
to 37V
Internal short circuit current limiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
ttKA7503
TO·92
Output current in excess of 100mA
Negative output adjustable from
-1.2V to - 37V
Internal short circuit current limiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
ttKA7504
TO·220
Output current in excess of 500mA
Negative output adjustable from
-1.2V to 37V
Internal short circuit current limiting
Floating operation for high
voltage operation
Eliminates stocking many
fixed voltages
t New Product
tt Under Development
c8SAMSUNG
Electronics
66
LINEAR ICs
FUNCTION GUIDE
D. Switching Voltage Regulator
Function
Type
Package
Application
Features
Adjustable
1.25V to 40V
KA7aS40
16 DIP
16 SOP
Peak output current of 1.5A without
external transistor.
aOdB line and load regulation
Operation from 25V to 40V
Step-down converter
Step-up converter
Inverter
Voltage Mode
PWM Control
Ie
KA3524
16 DIP
Complete PWM power control circuitry
Internal short circuit current limiting
Complementary output
Output current up to 100mA
Flyback
Voltage
Voltage
Voltage
KA7500
16 DIP
Complete PWM power control circuitry
Dead-time control
Complementary output
Output current up to 200mA
Voltage inverter
Voltage step-down
Voltage step·up
KA7506
16 DIP
Adjustable dead-time control
Internal soft-start
Separate oscillator sync terminal
Pulse-by-pulse shutdown
Input undervoltage lockout with
hysteresis
Flyback
Voltage
Voltage
Voltage
coverter
inverter
step·down
step-up
Current Mode
PWM Control
IC
KA7505
a DIP
Automatic feed forward compensation
Pulse-by-pulse current limiting
Undervoltage lockout with hysteresis
Double pulse suppression
High current totem pole output
Flyback
Voltage
Voltage
Voltage
converter
inverter
step·down
step-up
DC to DC
Converter
KA7507
a DIP
Low standby current
Current Limiting
Output switch current of 1.5A
Output voltage adjustable from 1.25 to
40V
Voltage inverter
Voltage step·down
Voltage step-up
I
converter
inverter
step-down
step-up
3. VOLTAGE REFERENCE
Function
Type
Package
Features
Application
Adjustable
Reference
KA431
TO-92
a DIP
a SOP
Program,mable output voltage from Vref
to 36V
Voltage reference tolerance: ±1.0%
Low output noise voltage
Switching regulator
Constant current source
Constant current sink
Reference
KA336
TO-92
Adjustable 4V to 6V
Low temperature coefficient
O.6n dynamic impedance
Fast turn-on
Adjustable shunt regulator
Precision power regulator
TO-92
Low temperature coefficient
Low dynamic resistance
Electronic tuning system
33V Reference
KA33V
c8SAMSUNG
Electronics
67
LINEAR ICs
FUNCTION GUIDE
, 4. OPERATIONAL AMPLIFIER
Function
Type
OPAMP
Dual
OPAMP
Package
Features
Application
LM741
8 DIP
8 SOP
Internal frequency compensation
Short circuit protection
Comparator, DC amp,
Multivibrator, Summing amp,
Integrator or differentiator,
Narrow band or BPF
LM301A
8 DIP
8 SOP
Short circuit protection
External frequency compensation
Variable capacitance
Multiplier
Sine wave oscillator
KF351
8 DIP
8 SOP
Internally trimmed offset
Voltage: 10mV
Low input bias current
High input impedance: 10120
High slew rate: 13V/1Ls
Wide gain bandwidth: 4MHz
Hi-Zin inverting amp
Ultra low duty cycle
pulse generator
sample and Hold
MC4558
8 DIP
8 SOP
9 SIP
Internal frequency compensation
Low noise operation
Phone pre-amplifier
Tape playback amplifier
MC1458
8 DIP
8 SOP
9 SIP
Internal frequency compensation
Short circuit protection
Filter
Schmitt trigger
Comparator Multivibrator
LM358/A
LM258/A
LM2904
8 DIP
8 SOP
9 SIP
Internal frequency compensation
for unit gain
Large DC voltage gain
Wide power supply range
DC summing amplifier
Power amplification
RC active bandpass filter
Compatible with all forms
of logic.
8 DIP
8 SOP
9 SIP
Low input noise voltage
High gain bandwidth: 10MHz
High slew rate: 10V/1Ls
Large supply voltage range:
± 3 to ± 20V
DC Amp
Telephone channel amplifiers
Audio equipment
10 SIP HIS
Internal current limiting: Isc = 350m A
Internal frequency compensation
Minimal cross over distortion
High power amplifier
CD motor driver
8 DIP
8 SOP
9 SIP
Low supply current: 5001LA (max)
Low input bias current
High input impedance
High gain bandwidth: 1MHz
High slew rate: 1V/1Ls
Active filter
DC summing amplifier
Oscillator
8 DIP
Wide range of supply voltage
: 3V - 16V
Common mode input voltage
including the negative rail
Battery-powered application
Active filter
Signal buffer
ttKA3000
KA9256
tKF442
KS272
tt Under Development
t New Product
~
c8SAMSUNG·
Electronics
68
FUNCTION GUIDE
LINEAR ICs
OPERATIONAL AMPLIFIER
Function
Quad
OPAMP
Type
Package
(Continued)
Features
Application
LM324/A
LM224/A
LM2902
14 DIP
14 SOP
Internal frequency compensation
Wide supply voltage range
Single supply: DC 3V- 32V
Dual supply: DC ± 1.5V - ± 16V
Audio power booster
DC amp, Multivibrator
Switch, Comparator
Schmitt trigger
LM348
LM248
14 DIP
14 SOP
Each amplifier is functionally
equivalent to the LM741C
Pin compatible with LM324
Short circuit protection
Comparator with hysteresis
Voltage reference
MC3403
MC3303
14 DIP
14 SOP
Class AB output stage for minimal
crossover distortion
Single or split supply operation
Internal frequency compensation
Comparator with hysteresis
BI-Quad filter
tKF347
14 DIP
14 SOP
Low bias current
Wide gain bandwidth: 4MHz
High slew rate: 13V/!-'s
High input impedance
D/A converter
Sample and hold
Integrator
KS274
14 DIP
Wide range of supply voltage
: 3V - 16V
Single supply operation
Very low input bias current, Typ 1p'A
Battery-powered application
Energy-conserving
application
14 DIP
14 SOP
Low supply current: 200!-,A
Single supply operation: 5V to 30V
Low input offset voltage
Remote line filters
DC Amps
Battery powered application
ttKA3001
tNew Product
tt Under Development
c8SAMSUNG
Electronics
69
I
LINEAR ICs
FUNCTION GUIDE
5. VOLTAGE COMPARATOR
Function
Type
Package
Features
Application
8 DIP
8 SOP
Operates from Single 5V supply
Maximum input current: 250nA
Maximum offset current: 50nA
Differential input voltage range: ±30V
Multivibrator output is
compatible with DTL and
as well as MOS circuits
voltage controlled oscillator
14 DIP
low offset and thermal drift
Compatible with practically
all types of integrated logic
Line receiver
AID converter
Memory sense amplifier
8 DIP
8 SOP
9 SIP
High precision comparators
Reduced Vas drift over temperature
Eliminates need for dual supply
Allows sensing near ground
Compatible with all form of logic
Power drain suitable for battery
operation
Low input biasing current: 25nA
low output saturation voltage 250mA
at 4mA
Output voltage compatible
with TTL, DTL, ECl and
CMOS logic system
Basic comparator
Pulse generator
MOS clock driver
lM319
LM219
14 DIP
Two independent comparators
Operates from a single 5V
High common mode slew rate
Relay driver
Window detector
KA711C
14 DIP
14 SOP
Separate differential input and single
output
Strobing each side
Sense amplifier for core memory
Dual comparator with ORed output
Double-ended limit detector
14 DIP
14 SOP
Wide single supply voltage
range or dual supplies
Very low supply current drain
(O.8mA)-independent of supply
voltage (2mW/Comparator at + 5V DC)
low input biasing current: 25nA
Input common-mode voltage range
included GND
low output saturation voltage 250mV
at 4mA
Compatible with all forms of logic
Bi-stable multivibrator
One-shot multivibrator
Time delay generator
Square wave oscillator
Pulse generator
Limit comparator
Crystal controlled oscillator
Single
LM311
Comparator
KA710C
Dual
lM393/A
Comparator LM2903
LM293/A
Quad
LM339/A
Comparator LM2901
LM239/A
lM3302
tt Under Development
c8SAMSUNG
Electronics
70
LINEAR ICs
FUNCTION GUIDE
6. TIMER
Function
Single
Timer
Dual
Timer
Quad
Timer
Type
Package
Features
Application
NE555
8 DIP
8 SOP
Maximum operating frequency: 500KHz Precision timing
Pulse generator
Adjustable duty cycle
KS555
KS555H
8 DIP
8 SOP
Low power consumption by using
CMOS process
High speed operation
Wide operation supply voltage:
2 to 18 volts
Pin compatible with NE555
Precision timing
Pulse generator
NE556
14 DIP
14 SOP
TTL Compatible
Dual NE555
Time delay generation
KS556
14 DIP
14 SOP
Low power consumption
by using CMOS process
Pin compatible with NE556
Time delay generation
NE558
16 DIP
Wide supply voltage range: 4.5 to 16V Quad monostable
Sequential timing
100mA output current per section
Time period equal RC
Precision timing
I
7. MISCELLANEOUS ICs
Function
Type
Voltage to
Frequency
Converter
ttKA331
Package
8 DIP
Features
Application
V-F Conversion
F-V Conversion
Wide range of full scale
frequency: 1Hz to 100KHz
Li ght intensity to
frequency converter
Temperature to frequency
converter
Earth
Leakage
Detector
KA2803 8 DIP
Low power consumption
Built-in voltage regulator
1mA output current pulse to
trigger SCR's
Earth leakage detector
Zero
Voltage
Switch
KA2804 8 DIP
Very few external compontents
Reference voltage output
Supply voltage control
On-Off temperature control
Time proportional temperature
control
Earth
Leakage
KA2807 8 DIP
Full advantage of the UL943
Direct interface to SCR
Trim time in normal
Earth leakage detector
Video
Amplifier
KA733C 14 DIP
120MHz bandwidth
Selectable gains of 10000 and 400
No frequency compansation required
Video recorder systems
Video amplifier
Pulse amplifier in communications
Magnetic memories
c8SAMSUNG
Electronics
71
LINEAR ICs
CROSS REFERENCE GUIDE
1. TELECOMMUNICATION ICs
A. Dialer
Application
Pulse Dialer
DTMF Dialer
SAMSUNG
MOSTEK
KS5805A
KS5805B
tKS58C05
tKS58D05
tKS58E05
*MK50992
*MK50993
MK50981
MK50982
MK50991 12
AMI
S2560A/B
SHARP
UMC
*T40992
"T40993
UM9151
Others
"LR40992
"LR40993
UM9151-3
"MK5089
MK5087
MK5380
DTMF/Pulse
Switchable with
Redial
KS5819
KS5820
MK5370
*UM91230
*UM91210
LR48081
LR48082
*S7230A/B
S7235
* LC7360
DTMF/Pulse
Switchable with
10 No. Memory
tKS5822
tKS5823
MK5375/6
*UM91261
*UM91260
LR4803
PCD3315
SAMSUNG
MOTOROLA
*S25089
*UM95089
UM95087
UM9559
*SBA5089
SBA5091
SBA5099
KS5808
ttKS5809
ttKS5810
ttKS5811
KA2413
*LR4089
LR4087
*PBD3535
B. Tone Ringer
Application
Tone Ringer
KA2410
KA2411
1 Chip Tone
Ringer
KA2418
MC34012
MC34017
SGS
MITEL
CHERRY
Others
*ML8204
*ML8205
*CS8204
*CS8205
*TA31 001
*TA31002
Included
Bridge Diode
*LS1240
LS3240
C. Speech Network
SGS
RIFA
ITT
ERSO
Subset Amplifier
KA2412A
* LS285/A
PBL3726
TEA1045
*CIC9185
Speech Network
with Dialer
Interlace
KA2425A
KA2425B
LS356
PBL3781
Application
SAMSUNG
Others
U4053/7
U4055/6
TP5700
D. Tone Decoder
Application
Tone Decoder
SAMSUNG
LM567C
NATIONAL
SHARP
SIGNETICS
*LM567
*IR3N05
"NE567
LM567L
Others
"XR567 (EXAR)
*XRL567 (EXAR)
E. FM IF Amplifier
Application
SAMSUNG
MOTOROLA
SPRAGUE
Others
FM IF Amplifier
MC3361
* MC3361
ULN3859
"LM3361
F. DTMF Receiver
Application
DTMF Receiver
SAMSUNG
tKT3170
MITEL
*MT8870
GTE
Others
*G8870
t New Product tt Under Development * Direct Replacement
c8SAMSUNG
Electronics
72
LINEAR ICs
CROSS REFERENCE GUIDE
G. CODEC, CODEC FILTER, COMBO CODEC
SAMSUNG
N.S
SGS
INTEL
wLaw CODEC
KT5116
*TP5116
* ILA5116
*M5116
2910
CODEC FILTER
KT3040
*TP3040
* ILA5912
*M5912
*2912
Application
wLaw COM BO CODEC
tKT8564
*TP3064
wLaw COM BO CODEC
tKT8554
*TP3054
A-Law COM BO CODEC ttKT8567
*TP3067
A-Law COM BO CODEC
tKT8557
wLaw DODEC
A-Law CODEC
TSAC
FAIRCHIJ-D
2913
MOTOROLA
THOMSON
*ETC5040
MC14400-5
*ETC5064
* ILA3054
*2916
*ETC5054
*TP3057
* ILA3057
*2917
*ETC5057
tKT8520
* TP3020
ILA5151
ttKT8521
*TP3021
tKT8555
*TP3155
•
*ETC5067
*2910
*2911
H. INTERFACES
Application
Line Driver
RS-232C
Line Receiver
SAMSUNG
MOTOROLA
TI
ttKS5788
FAIRCHILD
SIGNETICS
*DS14C88
MC1488
*MC1488
*SN75188
*OS1488
*ILA1488
*MC1488
MC1489
*MC1489
*SN75189
*OS1489
*ILA1489
*MC1489
MC1489A
*MC1489A
*SN75189A
*OS1489A
*ILA1489A
*MC1489A
*DS14C89A
ttKS5789A
Transceiver
N/S
ttKA2654
ttKS5706
*SN751701
*MC145406
I. Driver
Application
8ch Source Driver
Flouscent Display Driver
Peripheral Driver Array
SAMSUNG
SPRAGUE
KA2580A
*UDN2580A
EXAR
MOTOROLA
TI
KA2588A
*UDN2588A
KA2651
*UDN6118
tKA2655
*ULN2001
*MC1411
SN75476
. tKA2656
*ULN2002
*MC1412
SN75477
tKA2657
*ULN2003
*MC1413
SN75478
tKA2658
*ULN2004
*MC1416
tKA2659
*ULN2005
Others
*XR6118
J. UART
Application
SAMSUNG
HITACHI
MOTOROLA
Single UART
ttKS5824
*HD6350
* MC6850
Quad UART
Others
KS5812
·t New Product tt Under Develo·pment * Oirect Replacement
c8~SUNG
73
LINEAR ICs
CROSS REFERENCE GUIDE
2. VOLTAGE REGULATOR
A. 3·Terminal Fixed Positive Voltage Regulator
Description
KA78TXX
Series
(10 = 3A)
SAMSUNG
KA78T05
ttKA78T06
ttKA78T08
ttKA78T12
ttKA78T15
ttKA78T18
ttKA78T24
MOTOROLA
FAIRCHILD
NEC
MATSUSHITA
LM323 (10 = 3A)
LM323
LM323
MC78XXAC/C
Series
(10= 1A)
MC7805AC/C
MC7852C
MC7806AC/C
MC7808AC/C
MC7885AC/C
MC7809AC/C
MC7810AC/C
MC7811AC/C
MC7812AC/C
MC7815AC/C
MC7818AC/C
MC7824AC/C
MC7805AC/C
J.tA7805
J.tPC7805
AN7805
MC7806AC/C
MC7808AC/C
J.tA7806
J.tA7808
J.tA7885
J.tPC7808
AN 7806
AN7808
MC7812AC/C
MC7815AC/C
MC7818AC/C
MC7824AC/C
J.tA7812
J.tA7815
J.tA7818
J.tA7824
J.tPC7812
J.tPC7815
J.tPC7818
J.tPC7824
AN7812
AN7815
AN7818
AN7824
KA340XX
Series
(10= 1A)
tKA340T05
tKA340T06
tKA340T08
tKA340T09
tKA340T10
tKA340T11
tKA340T12
tKA340T15
tKA340T18
TK.A340T24
MC78MXXC
Series
(lo=0.5A)
MC78LXXAC
(l o =0.1A)
MC78M05C
MC78M06C
MC78M08C
MC78M10C
MC78M12C
MC78M15C
MC78M18C
MC78M20C
MC78M24C
MC78L26AC
MC78L05AC
MC78L62AC
MC78L08AC
MC78L82AC
MC78L09AC
MC78L12AC
MC78L15AC
MC78L18AC
MC78L24AC
Package
TO-220
TO-3P
MC78T05
MC78T06
MC78T08
MC78T12
MC78T15
MC78T18
MC78T24
TO-3P
LM340-5.0
LM340-6.0
LM340-8.0
TO-220
TO-220
LM340-12
LM340-15
LM340-18
LM340-24
MC78M05C
MC78M06C
MC78M08C
J.tA78M05C
J.tA78M06C
J.tA78M08C
MC78M12C
MC78M15C
MC78M18C
MC78M20C
MC78M24C
J.tA78M12C
J.tA78M15C
MC78L05AC
J.tA78L05AC
J.tA78L62AC
J.tA78M20C
J.tA78M24C
J.tPC78M05
J.tPC78M08
J.tPC78M10
J.tPC78M12
J.tPC78M15
J.tPC78M18
J.tPC78M20
J.tPC78M24
AN78M05
AN78M06
AN78M08
AN78M10
AN78M12
AN78M15
AN78M18
AN78M20
AN78M24
TO-220
TO-92
MC78L08AC
MC78L12AC
MC78L15AC
MC78L18AC
MC78L24AC
J.tA78L82AC
J.tA78 L09AC
J.tA78L 12AC
J.tA78L15AC
t New Product
tt Under Development
c8SAMSUNG
Electronics
74
CROSS REFERENCE GUIDE
LINEAR ICs
B. 3·Terminal Fixed Negative Voltage Regulator
Description
MC79XXC
Series
(10= 1A)
MC79MXXC
(l o =0.5A)
MC79LXXAC
(l o =0.1A)
c.
SAMSUNG
MOTOROLA
FAIRCHILD
MC7902C
MC7905C
MC7906C
MC7908C
MC7912C
MC7915C
MC7918C
MC7924C
MC7905C
MC7906C
MC7908C
MC7912C
MC7915C
MC7918C
MC7924C
~A7905
~PC7905
~A7908
~PC7908
MC79M05C
MC79M06C
MC79M08C
MC79M12C
MC79M15C
MC79M18C
MC79M24C
MC79L05AC
ttMC79L 12AC
ttMC79L 15AC
ttMC79L 18AC
ttMC79L24AC
NEC
~A7912
~PC7912
~A7915
~PC7915
~PC7918
~PC7924
MC79M05C
~A79M05
MC79M12
MC79M15
~A79M12
MATSUSHITA
Package
AN7905
AN7906
AN7908
AN7912
AN7915
AN7918
AN7924
I
TO-220
~A79M08
~A79M15
MC79L05AC
MC79L12AC
MC79L15AC
MC79L18AC
MC79L24AC
TO-92
I
Precision Voltage Regulator
Description
Adjustable
Voltage
33V Regulator
Adjustable
Voltage
I
MOTOROLA
FAIRCHILD
LM723
MC1723
~A723
LM317
lM317
~A317
KA337
LM337
SAM SUNG
NEC
LM317
TO-220
LM337
TO-220
~PC574
LM350
LM317L
LM317M
LM337L
LM337M
~A350
Package
14 DIP/14 SOP
KA33V
tKA350
ttLM317L
ttLM317M
ttKA337L
ttKA337M
MATSUSHITA
LM723
TO-92
LM350
LM317M
LM337M
D. Switching Voltage Reg'ulator
Description
Adjustable
1.25V to 40V
(to = 100KHz)
PWM
Controller IC
SAMSUNG
KA78S40
KA3524
**KA7500
qsSAMSUNG
ElectronICs
MOTOROLA
FAIRCHILD
~A78S40
~A78S40
SG3524
TL494
NEC
MATSUSHITA
Package
16 DIP
LM3524
SG3524
16 DIP
TL494
16 DIP
75
CROSS REFERENCE GUIDE
LINEAR ICs
3. PRECISION VOLTAGE REFERENCE
Description
Adjustable
Reference
(2.5V - 36V)
Reference
I 5V
!2.5V
SAMSUNG
MOTOROLA
FAIRCHILD
KA431
TL431
",A431
N/S
TI
Package
TL431
TO-92
8 DIP
8 SOP
LM336
LM336
KA336
KA336
TO-92
TO-92
4. OPERATIONAL AMPLIFIER
Description
Single OP Amp
Dual OP Amp
Quad OP Amp
MOTOROLA
NATIONAL
FAIRCHILD
LM741
KA301
KF351
MC1741
LM301
LF351
LM741
LM301
LF351
",A741
",A301
LM358/A
LM258/A
LM2904
MC1458
MC4558
KA9256
tKF442
ttKA3000
LM358/A
LM258
LM2904
MC1458
MC4558
LM358/A
LM258/A
LM2904
LM1458
LM324/A
LM224/A
LM2902
LM348
LM248
MC3403
MC3303
tKF347
KS274
ttKA3001
LM324/A
LM224
LM2902
LM348
LM248
LM3403
MC3303
LF347
SAMSUNG
JRC
NJM741
Others
",PC301A
TL081
NJM358
",A1458
",A4558
NJM2904
NJM458
NJM4558
TA75358
BA4558
TA7256
LF442
LM324/A
LM224/A
LM2902
LM348
LM248
",A324
",A224
",A2902
",A348
",A248
",A3403
",A3303
NJM4558
TLC272, ICL7621
NJM324
TA75324
CA224
",PC451
NJM2902
NJM340J
LF347
",PC3403
",PC452
TLC274, ICL7641
OP-420
5. VOLTAGE COMPARATOR
Description
MOTOROLA
NATIONAL
FAIRCHILD
Single Comparator
LM311
KA710C
LM311
MC710C
LM311
LM710
LM311
",A710
Dual Comparator
LM393/A
LM2903
LM293
KA319
KA219
KA711C
LM393/A
LM2903
LM293
LM393/A
LM2903
LM293
LM319
LM219
LM711
",A393
",A711C
LM339/A
LM2901
LM239
LM3302
LM339/A
LM2901
LM239
LM339/A
LM2901
LM239
LM3302
",A339
IlA2901
IlA239
",A3302
Quad Comparator
SAMSUNG
,c8SAMSUNG
Electronics
JRC
NJM311
NJM2903
Others
",PC311
MB4001
TA75393
",PC277
NJM2903
NJM319
NJM2901
TA75339
",PC177
CA239
CA3302
76
CROSS REFERENCE GUIDE
LINEAR ICs
6. TIMER
Function
SAMSUNG
MOTOROLA
NATIONAL
SIGNETICS
Single Timer
NE555
KS555
KS5357
MC1455
LM555
NE555
Dual Timer
NE556
KS556
Quad Timer
NE558
TI
Others
TA75555
TLC555
ICM7555
LM556
NE556
NE555
TLC556
•
ICM7556
NE558
7. MISCELLANEOUS ICs
Function
Toy Radio
Control Actuator
DC Motor Speed
Controller
SAMSUNG
TOSHIBA
NATIONAL
MATSUSHITA
NEC
Others
3 Function
KA2303
2 Function
KA2304
tKA2309
TA7657D
Turbo +
7 Function (RX)
tKA2310
TA7330
Turbo +
7 Function (TX)
j!PC1470H
KA2401
KA2402
AN6612
*LA5521D
KA2404
AN6610
j!PC1470H
*AN6651
tKA2407
Earth Leakage
Detector
KA2803
LM1851
Earth Leakage
Detector
KA2807
LM1851
*M54123
Zero Voltage SW
KA2804
FDD Read AMP
KA6201
*HA16631P
Smoke Detector
KS3502
S566
j!PC1701C
Conventional Timer
KS8701
TD6347S
Flasher Controller
KA8702
TA8027P
V/F Converter
KA331
c8SAMSUNG
Electronics
UAA1041
LM331
77
LINEAR IC's
3100A
KSV
ORDERING INFORMATION
N
C
A+
L=
BURN·IN (OPTIONAL)
(SEE BURN·IN PROGRAM)
PACKAGE TYPE
~----------------TEMPERATURERANGE
~-------------------
DEVICE NUMBER AND SUFFIX (OPTIONAL)
A: IMPROVED VERSION
' - - - - - - - - - - - - - - - - - - - - - - - - - DEVICE FAMILY
TEMPERATURE RANGE
BLANK
SEE INDIVIDUAL SPEC
+ 70°C
PACKAGE TYPE
CODE
D
C
COMMERCIAL 0 -
I
INDUSTRIAL - 25 - + 85°C
-40-+85°C
N
M
MILITARY -55 -+ 125°C
S
Q
J
E
B
P
INTEGRATED CIRCUIT
KA
LINEAR IC
KS
CMOS IC
KT
TELECOM IC
LM
NATIONAL
W
U
L
PL
M
H
Z
V
A
MC
MOTOROLA
NE
S!GNETICS
KSV
A/D·D/A CONVERTER
KAD
AID CONVERTER
T
X
KDA
D/fl. CONVERTER
G
c8SAMSUNG
Electronics
PKG.TYPE
SOIC
CERAMIC DIP
PLASTIC DIP (300/600 mil)
SIP
FQP
SD (400 mil)
SSD (Skinny Shrink DIP)
(400 mil. Small Pitch)
SHD (Shrink DIP)
(300 mil. Small Pitch)
ZIP
PGA
LCC
PLCC
TO·3
TO·3P
TO·92
TO·92L
TO·126
TO·220
TO·247
BARE CHIP
78
Telecommunication Application
Device
KA2410
KA2411
KA2412A
KA2413
KA2418
KA2425A/B
KA2654
KS5706
KS5788
KS5789A
KS5805A/B
KS58C/D05
KS58E05
KS5808
KS5809
KS581 0
KS5811
KS5812
KS58A/B/CID19
KS58A/B/C/D20
KS5822
KS58A/B/C/D23
KS5824
KT3040/A
KT3170
KT5116
KT8520
KT8521
KT8554
KT8555
KT8557
KT8564
KT8567
LM567C
LM567L
MC1488
MC1489/A
MC3361
KA2580A
KA2588A
KA2651
KA2655/6/7/8/9
Function
Tone Ringer
Tone Ringer
Telephone Speech Circuits
Dual Tone Multi Frequency Generator
Tone Ringer with Bridge Diode
Telephone Speech Network with Dialer Interface
line Transceiver
3 line Drivers and 3 line Receivers
Quad CMOS Line Driver
Quad CMOS Line Receiver
Telephone Pulse Dialer with Redial
Telephone Pulse Dialer with Redial
Telephone Pulse Dialer with Redial
Dual Tone Multi Frequency Dialer
DTMF Dialer
DTMF Dialer with Redial
DTMF Dialer with Redial
Quad Universial Asychronos Receiver and Transmitter
Tone/Pulse Dialer with Redial
Tone/Pulse Dialer with Redial
10 Memory Tone/Pulse Repertory Dialer
10 Memory Tone/Pulse Repertory Dialer
Universial Asychronous Receiver and Transmitter
PCM Monolithic Filter
DTM F Receiver
wLaw Companding CODEC
wLaw Companding CODEC
A-Law Companding CODEC
wLaw COMBO CODEC
Time Slot Assignment Circuit
A-Law COMBO CODEC
wLaw COMBO CODEC
A-Law COMBO CODEC
Tone Decoder
Micropower Tone Decoder
Quad Line Driver
Quad Line Receiver
Low Power Narrow Band FM IF
8-Channel Source Drivers
8-Channel Source Drivers
Fluorescent Display Drivers
High Voltage, High Current Darlingtor Arrays
Package
8 DIP
8 DIP
14 DIP
16 DIP
8 DIP
18 DIP
8 DIP
16 DIP/SOP
14 DIP/SOP
14 DIP/SOP
18 DIP
18 DIP
16 DIP
16 DIP
16 DIP
16 DIP
16 DIP
40 DIP
22 DIP
18 DIP
22 DIP
18 DIP
24 DIP
16 CERDIP
18 DIP
16 CERDIP
24 CERDIP
22 CERDIP
16 CERDIP
20 CERDIP
16 CERDIP
20 CERDIP
20 CERDIP
8 DIP/SOP
8 DIP/SOP
14 DIP/SOP
14 DIP/SOP
16 DIP/SOP
18 DIP
20 DIP
18 DIP
16 DIP/SOP
Page
81
81
87
95
101
104
111
115
119
122
125
131
136
140
146
146
146
150
160
170
178
186
194
205
217
227
240
240
249
260
249
268
268
278
286
296
301
305
611
611
616
619
I
ill
1111
i
LINEAR INTEGRATED CIRCUIT
KA2410/KA2411
8 DIP
TONE RINGER
The KA2410/KA2411 is a bipolar integrated circuit designed for telephone
bell replacement.
FUNCTIONS
• Two oscillators
• Output amplifier
• Power supply control circuit
•
FEATURES
•
•
•
•
•
•
•
•
•
•
Designed for telephone bell replacement
Low current drain.
Small size 'MINIDIP' package.
Adjustable 2-frequency tone.
Adjustable warbling rate.
Built-in hysteresis prevents false triggering and rotary dial
'CHIRPS'
Extension tone ringer modules
Alarms or other alerting devices.
External triggering or ringer disable (KA2410).
Adjustable for reduced supply initiation current (KA2411)
ORDERING INFORMATION
Device
Operating Temperature
KA2410N
KA2411 N
-45- +65°C
APPLICATION CIRCUIT 1 (KA2410)
100K-200K ohm
R2
165K±1%
Note: 1. Output amplifier
2. High frequency oscillator
3. Low frequency oscillator
4. Hysteresis regulator
Fig. 1
c8SAMSUNG
Electronics
81
LINEAR INTEGRATED CIRCUIT
KA2410/KA2411
ABSOLUTE MAXIMUM RATINGS (Ta
Characteristic
Supply Voltage
Power Dissipation
Operating Temperature
Storage Temperature
=25°C)
Symbol
Vee
Po
Topr
T slg
value
Unit
30
400
-45to 65
-65to 150
V
mW
°C
°C
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
(All voltage referenced to GND unless otherwise specified)
Characteristic
Symbol
Test Condition
Min
Typ
Max
Unit
29.0
V
Operating Supply Voltage
Vee
Initiation Supply Voltage l
Initiation Supply Current l
VSI
See Fig. 2
17
19
21
V
lSI
KA2411-6.8K-Pin 2 to GND
1.4
2.5
4.2
rnA
Sustaining Voltage2
Vsus
See Fig. 2
9.7
11.0
12.0
V
Sustaining Current 2
Isus
No Load Vee=Vsus, See Fig. 2
0.7
1.4
2.5
rnA
Trigger Voltage 3
VTR
KA2410 Only Vee =15V
9.0
Trigger Current3
IrR
KA241 0 Only
Disable Voltage4
V OIS
KA241 0 Only
lOIs
KA241 0 Only
-40
-50
Output Voltage High
VOH
Vcc=21V,le=-15mA
Pin 6=6V, Pin 7=GND
17.0
19.0
Output Voltage Low
VOl
Vcc=21V,le=15mA
Pin 6=GND, Pin 7=6V
Disable Current
4
liN (Pin 3)
hN (Pin 7)
High Frequency 1
High Frequency 2
Low Frequency
Pin 3=6V, Pin 4=GND
Pin 7=6V, Pin 6=GND
fHl
fH2
fL
R3=191K, C3=6800pF
R3=191K,C3=6800pF
R2=165K, C2=0.47I'F
10.5
12.0
V
20.0
10005
pA
0.5
461
576
9.0
V
pA
21.0
V
/1.6
V
-
-
500
500
nA
nA
512
640
10
563
704
11.0
Hz
Hz
Hz
• NOTE (see electrical characteristics sheet)
1. Initiation su pply voltage (V SI) is the supply voltage required to start the tone ringer oscillating.
2. Sustaining voltage (Vsus) is the supply voltage required to maintain oscillation.
3. VTR and IrR are the conditidfls applied to trigger in to start oscillation for Vsus~VCC~VSI
4. VOIS and lOIs are the conditions applied to trigger in to inhibit oscillation for VSI ~ Vee
5. Trigger current must be limited to this value externally.
c8SAMSUNG
Electronics
82
LINEAR INTEGRATED CIRCUIT
KA2410/KA2411
CIRCUIT CURRENT-SUPPLY VOLTAGE (No Load)
I
4.0
3.5
i
I
I
-H
",
V
~
A'
~I-""'
./
1.0
,
05
--
1
~~ ---ff·-- ._-
I
f--+- - -
;
~
~
L
/
10
14
Vee;
18
22
26
30
34
M, Supply voltage
Fig. 2
APPLICATION NOTE
The application circuit illustrates the use of the KA2410/KA2411 devices in typical telephone or extension tone ringer
application.
The AC ringer signal voltage appears across the TIP and RING inputs of the circuit and is attenuated by capacitor Cl and
resistor Rl.
Cl also provides isolation from DC voltages (48V) on the exchange line.
After full wave rectification by the bridge diode, the waveform is filtered by capacitor C4 to provide a DC supply for the tone
ringer chip.
As this voltage exceeds the initiation voltage (Vsl),osciliation starts.
With the components shown, the output frequency chops between 512 (fh1 ) and 640Hz (fh2) at a 10Hz (fd rate.
The loudspeaker load is coupled through a 13000 to 80 transformer.
The output coupling capacitor C s is required with transformer coupled loads.
When driving a piezo-ceramic transducer type load, the coupling C s and transformer (13000: 80) are not required.
However, a current limiting resistor is required.
The low frequency oscillator oscillates at a rate (fd controlled by an external resistor (R 2) and capacitor (C 2).
The frequency can be determined using the telation fl =111.289 R2. C2 • The high frequency oscillates at a fH1' fH2 controlled
by an external resistor (R3) and capacitor (C 3). The frequency can be determined using the relation fHI=1/1.504 R3. C 3.
fH2 =111.203 R3 , C3 •
Pin 2 of the KA2411 allows connection of an external resistor RSL , which is used to program the slope of the supply current vs supply voltage characteristics (see Fig 4), and hence the supply current up to the initiation voltage (Vsi). This initiation voltage remains constant independent of RSL '
The supply current drawn prior to triggering varies inversely with RSL .· decreasing for increasing value of resistance. Thus,
increasing the value of RSL , will decrease the amount of AC ringing current required to trigger the device. As such, longer
sucribser loopS are possible since less voltage is dropped per unit length of loop wire due to the lower current level. RSL
can also be used to compensated for smaller AC coupling capacitors (Cs on Fig 3) (higher impedance) to the line which can
be used to alter the ringer equivalence number of a tone ringer circuit.
The graph in Fig. 4 illustrates the variation of supply current with supply voltage of the KA2411. Three curves are drawn to
show the variation of initiation current with RSL . Curve B (RSL =r6.8K) shows the I-V characteristic for the KA2411 tone ringer.
Curve A is a plot with RSl <6.8KO and shows an increase in the current drawn up to the initiation voltage Vsi. The I-V charac'l
teristic after initiation remains unchanged. Curve C ill u rates the effect of increasing RSL above 6.8K Initiation current decreases
but again current after triggering is unchanged.
c8SAMSUNG
Electronics
83
LINEAR INTEGRATED CIRCUIT
· KA2410/KA2411
APPLICATION CIRCUIT 2 (KA2411)
10K!}
VOL
KA2411
RING
~--+----'
RSL
C4
Fig. 3
LINEAR INTEGRATED CIRCUIT
KA2411 Supply Current (No Load) Vs. Supply Voltage
8.5
1 -
---
.-~
j--+1--
-+- -
i-
7.5
+-+-
6.5 I--- ---
i
i
c3
-+----1- -
-~--- +-f--c._
4.S
t
13.S
2.5
lII'{
A) RsL-SKO
B) RSL=6.8KC
C)RS\.=13KO
t----.V
..+
~
,
rv') f,1.J1'i
,
~'~ ~'fI
v
1.5
0.5
f-+-- t---V' :
v' 1'1;
~V
i.IIII
10
14
:
I
'----
18
22
26
!
;+-
30
34
Supply Voltage (V)
c8SAMSUNG
Electronics
84
LINEAR INTEGRATED CIRCUIT
KA2410/KA2411
EQUIVALENT CIRCUIT
INHIBITING OSCILLATION
(Pin 2 Input)
+Vcc
KA241 0
r- -,
I
I
IRl
I
I
,,I
I
I
L....------_-.t :
I
I
O >ZL); the main part is sent to the line Via R6.
The impedance AM is defined as,fu
14-3
To reduce the receiving input signal,
also, In order to reduce power loss in RS & ZB and to transfer the maximum power to the line via R6.
RS+ZB> > R6+ZL
R6+ZM =ZL
c8~SUNG
93
KA2412A
LINEAR INTEGRATED CIRCUIT
Then the line impedance ZL grows from 600 ohm up to 900 ohm when the line length increases.
The voltage driven to the line is
In order to maximize sending Gain
ZL> >R6
Therefore, in the case of the KA2412 test circuit:
R6=75, ZM=6.8KI11, ZL=600
'VL =
ZL
xZMh =286.82h
ZM+R6+ZL
* In receiving mode:
The AC signal coming from the line is sensed across the second diagonal of the wheastone bridge (pin 11 and pin 13).
After amplification it is applied to the receiver.
VR =
VI
(Rs+R5+ Ze)/IZM(1-~))
ZL +Rs +(R5 +Ze)IIZM
Ze +R5
VI
(R6+ ZM R5 )
ZL+Rs+(R5+Ze)/IZM
ZM+R5+ RS
To avoid the reflection
ZL =Rs +ZM' 10 ZM =R5 +Zs
Therefore
VR =
VI
(Rs+ZS)
2 Rs+1.91 ZM
11
In the case of the KA2412A test circuit
ZL=600n, Rs =75n, ZM=6.8Kn/11=6.8n
Rs =536n, Ze=6.076Kn (fREF=1KHz)
3. Automatic Gain Control.
The KA2412A automatically adjusts the gain of the sending and receiving amplifiers to compensate for line attenuation
Maximum gain is reached for a line current of range 10 - 20mA and minimum gain can also be reached for a line current
of range 60 -100mA.
c8SAMSUNG
Electronics
94
KA2413
LINEAR INTEGRATED CIRCUIT
DUAL TONE MULTI FREQUENCY GENERATOR
16 DIP
The KA2413 is a monolithic integrated DTMF generator designed for use
in a telephone set in parallel with an electronic speech circuit. The DC
characteristic to the line is set by the speech circuit.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Wide operating line voltage and current range
Operates with a standard crystal at 3.58MHz
Operates with a single contact or matrix key-board
Levels from the high and low frequency group can be adjusted
separately.
No individual level adjustment is necessary for every circuit
The signal levels are stabilized against variations in temperature and line voltage.
Short start-up time
All tones can be generated separately for testing.
Easy PCB layout; all keyboard connections on one side of the
chip
Internal protection of all inputs
Minimum number of external parts required.
ORDERING
Device
•
INFORMATION
Operating Temperature
KA2413N
BLOCK DIAGRAM
Mute
Rl
330
RL
47KQ
C24.7nF
Line
L---------~~------~----~----~__oA
Fig. 1
=8SAMSUNG
Electronics
95
KA2413
LINEAR INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
Characteristic
Value
Symbol
t p =2 sec
tp=20m sec
Line Voltage (Conditions)
Power Dissipation
Operating Temperature
Storage Temperature
Line Voltage (Peak)
Unit
20
22
15
400
-20-+70
-55- + 150
VL (peak)
VL (cont)
Po
Topr
Tstg
V
V
V
mW
°C
°C
ELECfRICAL CHARACfERISTICS (Ta =25°C)
(VL =4.3-9V, unless otherwise specified)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
Operating Line Voltage
VL (opr)
Tone Generation
1.3 Vp Signal
4.3
9.0
V
Stand-By Line Voltage
VL (std)
Stand-By
2.0 Vp Signal
4.3
9.0
V
Operating Line Current
k(opr)
VL=4.3V
10.0
rnA
Stand-By Line Current
k (std)
No Key Pressed
VL=4.3V
250
JA
Mute Current
1M
One or More Keys Pressed
Key Resistance
RK
Key Circuit Closed
--
p.A
125.0
1.0
kO
Tone Output Frequency
Low
(Row)
fl =697 Hz
-1.0
-0.32
+1.0
%
f2 =770 Hz
-1.0
+0.02
+1.0
%
h=852 Hz
-1.0
+0.03
+1.0
%
-1.0
-0.11
+ 1.0
%
-1.0
-0.03
+1.0
%
f4 =941 Hz
f5 =1209 Hz
High
(Column)
fosc =3.5795 MHz
f6=1336 Hz
-1.0
-0.03
+1.0
%
f7=1477 Hz
-1.0
-0.68
+1.0
%
f8=1633 Hz
-1.0
-0.36
+1.0
%
c8SAMSUNG
Electronics
~f
--
96
KA2413
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS (Continued)
Characteristic
High
Low
Signal
level
High
Low
High
Low
Ratio Signal Level
Impedance to Line
Symbol
VH
VL
VH
VL
VH
VL
VHNL
ZL
-9.0
RH=33.0KO
RL =47.0KO
dBm
-S.O
-6.0
-4.0
-10.0
-8.0
-6.0
-4.0
RH =26.1KO
RL =39.2KO
dBm
--
--
dBm
-6.0
2.0
1.0
Tone Generation
Stand-By
THO
Tone Generation
VNO
Stand-By
I
KO
-31.0
dBm
-80.0
dBm
300-3400Hz
-33.0
dBm
3.4-50KHz
-33.0
dBm
-80.0
dBm
I
I
II
Output level within
11dB from final level
3
I
I
I
dB
3.0
~
6.0
50.0
~50KHz
ts
Unit
Max
-11.0
Output Noise
Start-up Time
Typ
RH=46.4KO
RL =69.SKU
Total Harmonic Distortion
Harmonics
Min
Test Conditions
5
i
I
--
mS
t
I
I
R1
TEST CIRCUIT
330
RLOAD
300n
Vl
1M
C2
4.7nF
MUTE
+
Rl
47KO
RH
33K!1
Fig. 2
ciS !ec.MSUNG
97
LINEAR INTEGRATED CIRCUIT
KA2413
• KA2413 can also be controlled by a microprocessor (see Fig 5). The negative branch of the microprocessor- voltage
supply is connected to pin 7 of KA2413 and the inputs (8) are connected with resistors.
For tone-generating one input of the low group (pin 13 - 16) is connected to the positive voltage and one input of
the high group (pin 9 - 12) is connected to the negative voltage, then KA2413 is activated and the mute output is put
in High state.
Microcomputer interface
~
R9
liD
+
I
9
10
'l!1
microprocessor
11
J11l
12
!lI 3
13
KA2413
R1,.4
R15
14
15
R1~
16
l
1
Fig. 5
1) R9, R10, R11, R12 (60K - 80K)
The resistors have two functions are:
- To raise the OFF/ON voltage
- To limit the current when the input levels are high. Too high current will interfere with the functions of the other
three inputs (the resistors can be exchanged with diodes directly away from KA2413)
High-frequency group resistors to microcomputer
To other
Inputs (3)
one of
R9-R12
I
121
microprocessor
---+:J------.
KA2413
L __________________________________ _
Fig. 6
c8SAMSUNG
Electronics
98
LIENAR INTEGRATED CIRCUIT
KA2413
2) R13, R14, R15, R16 (20K - 30K)
The two functions of the resistors are:
- To raise the OFF/ON voltage
- To limit the current when the input levels are high.
Low-frequency group resistors for microcomputer
I
I
I
I
I
I
13 I
KA2413
I
MICROPROCESSOR
141
one of
R13-R16
I
15 I
16 I
I
I
I
I
-------
J
L _______________________________ _
-m----~
Fig. 7
c8SAMSUNG
Electronics
99
LINEAR INTEGRATED CIRCUIT
KA2418
8 DIP
TELEPHONE TONE RINGER WITH
BRIDGE DIODE
The KA2418 is monolithic integrated circuit telephone
tone ringer with bridge diode, when coupled with an appropriate transducer, replace the electromechanical bell.
This device is designed for use with either a piezo transducer or an inexpensive transformer coupled speaker
to produce a-pleasing tone composed of a high frequency (fH ) alternating with a low frequency (fL) resulting in
a warble frequency. The supply voltage is obtained from
the AC ring signal and the circuit is designed so that
noise on the line or variations of the ringing signal cannot affect correct operation of the device.
FEATURES
• On chip high voltage full wave diode bridge rectifier
• Low current consumption, in order to allow the
parallel operation of the 4 devices
• Low external component count
• Tone and switching frequencies adjustable by
external components
• High noise (mmunity due to built-in voltage·
current hysteresis
• Activation voltage adjustable
• Internal zener diodes to protect against over
voltages
• Ringer impedance adjustable with external
components.
ORDERING INFORMATION
Device
Operating Temperature
KA2418N
APPLICATIONS
• Electronic telephone ringers
• Extension ringers
BLOCK DIAGRAM
ACTIVATION
VOLTAGE ADJUSTABLE
RECTIFIER
CAPACITOR
POWER
SUPPLY
CONTROL
CIRCUIT
GND
SWEEP RATE
CONTROL CAPACITOR
OUTPUT FREQUENCY
CONTROL RESISTOR
Fig. 1
c8SAMSUNG
Electronics
100
LINEAR INTEGRATED CIRCUIT
KA2418
ABSOLUTE MAXIMUM RATINGS (Ta=2S0C)
Characteristic
Calling Voltage (f=50Hz) Continuous
Calling Voltage (f=50Hz)
5 Sec ON/10 Sec OFF
Supply Current
Operating Temperature
Storage and Junction Temperature
Value
Unit
VAS
120
Vrms
VAS
200
Vrms
lee
Top
Tstg
22
-20- +70
-65- + 150
mA
°C
°C
Symbol
I
Absolute maximum ratings are those values beyond which peramanent damage to the device may occur. These
are stress ratings only and functional operation of the device at or beyond them is not implied. Long exposure
to these conditions may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Ta = 25°C unless otherwise specified)
Characteristic
Symbol
Supply Voltage
Vee
Current Consumption without Load
Icc
Activiation Voltage
VON
Activiation Voltage Range
VONR
Sustaining Voltage
Vsus
Differential Resistance in
Off Condition
RD
Output Voltage Swing
VOUT
Short Circuit Current
lOUT
Test Condition
Min
I
Vs =8.8 to 26V
Max
Typ
!
Unit
~---L--1.8
mA
---~'.5
-1-3-r
V
12.2
26
-+:----
V
--
1-----
RA=1kO
6.8
V
V
--
j
--~J
mA
6.4
kU
Vce-3
35
Vs =26V
--
10
I
AC OPERATION
Characteristic
Output Frequencies
fH1
fH2
Symbol
fH1
fH2
fH1 Range
Sweep Frequency
c8SAMSUNG
Electronics
Test Condition
Vee = 26V, R1 =14kO
Vcc=OV
Vee=6V
R1 =27kO to 1.7kO
fL
Min
R,=14kO,C 1=100nF
Typ
Max
1,900
1,300
0.1
I
15
10
Unit
Hz
Hz
KHz
Hz
101
LINEAR INTEGRATED CIRCUIT
KA2418
TEST AND APPLICATION CIRCUIT
r------------------~""'"---,
I
Ra
I
1~,
250VAC!
O.221'F
2.2KO
, - - - - - - - -----U------l
I
I
I
10K~
10K
I
I
I
I
I
I
I
I
KA2418
VAS TEL LINE
VOUT
4
I
~i[fu
I
C,
RING
100nF
I
R,
I
I
12KO
I
I
I
I
I
-+_ _ _........._ _ __+_------+-------------....l
L -_ _ _ _ _ _ _ _
2.67-104
f1 == R, (KO)
f2==
1000
~ f1
fsweep=--
C,(nF)
7
Fig. 2
DESCRIPTION
The KA2418 tone ringer derive its powen supply by rectifying the AC ringing signal. It uses this power to activate two tone
generators. The two tone frequencies generated are switched by an internal oscillator in a fast sequence and made audible
across an output amplifier in the loudspeaker; both tone frequencies and the switching frequency can be externally adjusted.
The device can drive either directly a piezo ceramic converter (buzzer) or small loudspeaker. In case of using a loudspeaker,
a transformer is needed.
An internal shunt voltage Regulator provides DC voltage to output stage, low frequency oscillator, an High frequency oscillator. To protect the IC from telephone line transients, a zener Diode is included.
cU2!'ISUNG
102
KA2425A1B
LINEAR INTEGRATED CIRCUIT
18 DIP
SPEECH NETWORK WITH DIALER
INTERFACE
The KA2425A/B is a telephone speech network integrated circuit which includes transmit amp, receive amp,
sidetone amp, DC loop interface function, DTMF input,
voltage regulator for speech, a regulated output voltage
for a dialer, and equalization circuit.
FEATURES
• Low voltage operation (1_5V: speech)
• Transmit, receive, side tone and DTMF level are
controled by external resistors
• Regulated voltage for dialer
• Loop length equalization
• MUTE: KA2425A MUTE: KA24258
• Linear interface for DTMF
I
ORDERING INFORMATION
Device
BLOCK DIAGRAM
Package
Function
KA2425AN
18 DIP
MUTE
KA2425BN
18 DIP
MUTE
Operating Temperature
- 20-+60°C
TIP~
.......-.J"'~-'----()RECEIVER
>-~-""'------IY~-----------
DC LOOP
INTERFACE
DTMF INPUT O--~~--+--I
MUTE/MUTE
INPUT
DTMF DRIVER
MICROPHONE
INPUT
c8SAMSUNG
Electronics
103
LINEAR INTEGRATED CIRCUIT
KA2425A1B
(Ta = 25 DC)
ABSOLUTE MAXIMUM RATINGS
Characteristic
V + Voltage
Voo (V + =0)
MT, MT, MS Inputs
VLR
Storage Temperature
Value
Unit
-1.0 -+18
-1.0 - +6
-1.0 -V oo + 1
- 1.0 - V + - 3.0
-65-+150
V
V
V
V
°C
RECOMMENDED OPERATING CONDITIONS
Characteristic
hxo (Instantaneous)
V + Voltage: Speech Mode
Tone Dialing Mode
Operating Temperature
Value
Unit
0-10
mA
V
V
DC
+ 1.5 - + 15
+3.3 - + 15
-20 - +60
ELECTRICAL CHARACTERISTICS
(Ta= 25°C, Refer to Fig. 1)
Test Conditions
Characteristic
SYSTEM SPECIFICATIONS (Refer to Fig. 1
Tip-Ring Voltage (including polarity guard
bridge drop of 1.4V) (Speech Mode)
Transmit
Gain from Vs to V +
Gain Change
Distortion
Output Noise
Max
Unit
k=5.0mA
k=10mA
IL=20mA
IL=40mA
IL=60mA
-
2.4
3.9
4.6
5.6
6.6
-
VdC
29.5
-4.5
2.0
11
31
-3.6
-15
-3.0
2.0
-13
-2.0
-
-
28
-S.O
-
f = 1.0KHz, IL = 20mA
(See Figure 4) IL = 60mA
Sidetone Level
VRxolV + (Figure 3)
-16
-5.0
-
-
-
-
dB
dB
%
dBme
dB
dB
%
dB
IL=20mA
IL=SOmA
Sidetone Cancellation
4)ldB -
Typ
Fig. 4)
Figure 3 (IL = 20mA)
!t=60mA
Receive
VRxoNs
Receive Gain Change
Distortion
!~R:O (Figure
Min
!~R:O (Figure
3)ldB
DTMF Driver
V + VIN (Figure 2)
AC Impedance
Speech mode (incl. Cs , See Figure 4)
Zac = (600)V + l(Vs - V +)
Tone Mode (including Cs)
-
-36
-21
-
20
26
-
dB
3.2
4.8
6.2
dB
-
750
300
1650
-
IL=20mA
IL=20mA
n
IL=20mA
IL=60mA
20mA 100Kn.
8
RXO
Receive amplifier output.
9
RMT
Receiver mute.
10
V-
Negative supp.ly.
11
VR
Regulated voltage output. The VR Yoltage is regulated at 1.2V.
12
LC
AC load capacitor.
13
LR
DC load resistor. This resistor determines the DC resistance of the
telephone, and removes power dissipation from the chip.
--
----
14
V+
Positive supply.
15
Voo
Voo regulator. Voo is the output of a shunt type regulator with a nomina
voltage of 3.3V.
---
16
TI
DTMF input. Increasing R7 will reduce the DTMF output levels.
17
MS
Mode select. A logic "I" (>2.0V) _selects the pulse dialing mode. A logic
"0" « 1.0V) selects the tone dialing mode.
18
MT
Mute input for KA2425A. MT is connected through an internal 100KO
resistor to the base of an NPN transistor, with the emitter at Voo. A logic
"0" «1.0V) will mute the network for dialing. A logic "I" (>Voo-O.3V) puts
the KA2425A into the speech mode.
MT
Mute input for KA2425B. MT is connected through an internal 50Kn to the
base of a NPN transistor, with the collector to the base of a PNP transistor.
A logic "I" (> Voo - 0.3V) will mute the network for dialing. A logic "0"
« 1.0V) puts the KA2425B into the speech mode.
c8SAMSUNG
Electronics
108
KA2425A/B
LINEAR INTEGRATED CIRCUIT
Fig. 2 DTMF Driver Test
v+
TI
JO.02
400mVrms
1.0KHz
KA2425A1B
Iloop
LR
MT
='1.0V
MS
1
LC
v-
•
Fig. 3 Transmit and Sidetone Level Test
VR
150
TXO
v+
CD
:::t
Lt)
N
LR
o::r
N
ct
~
LC
Voo
Mf
v-
MS
Fig. 4 AC Impedance, Receive and Sidetone Cancellation Test
150K
v+
8.2K
STA
V+
0.05
RXI
33K
RXO
10
:::t
it)
l~f'05l
C\I
LR
LC
o::r
IIOOp
~ I"F
47
600n
0.2
C\I
ct
250mVrms(Vs)
1.0KHz
~
MS
V-
c8SAMSUNG
Electronics
CD
MT
Voo
109
KA2654
LINEAR INTEGRATED CIRCUIT
8 DIP
LINE DRIVER AND RECEIVER
The KA2654 is a monolithic one line driver and one line
receiver designed to interface DTE (Data Terminal Equipment) with DCE (Data Communication Equipment) in
conformance with the specifications of EIA standard
No.RS-232C.
The driver is similar to the MC1488. The receiver is similar to the MC1489 and that a separate response control
terminal is provided for.
A resistor or a resistor and bias voltage can be connected between this terminal and ground to shift the input
threshold voltage level. An external capacitor can be
connected from terminal to ground to provide input
noise filtering.
8 soP
FEATURES
•
•
•
•
•
•
•
ORDERING INFORMATION
Meet specifications of EIA RS·232C
Current limited output: 12mA (Typ)
Wide supply voltage: ± 4.5 - ± 15V
Low power consumption: 117mW
Power off source impedance: 300 ohms
Response Control Provides
Receiver output compatible with TIL
Device
Package
KA2654N
8 DIP
Operating Temperature
-20 - +85°C
KA2654D
8 SOP
-20 - + 70°C
,
BLOCK DIAGRAM
PIN CONFIGURATION
Vee
VEE
VEE
1
•
8
Vee
DRIVER
INPUT
;>0-----+---------4 7
DRIVER
OUTPUT
REFERENCE
REGURATOR
•
RECEIVER
INPUT
RESPONSE
CONTROL
c8SAMSUNG
Electronics
110
LINEAR INTEGRATED CIRCUIT
KA2654
ABSOLUTE MAXIMUM RATINGS
(Ta=25°C, unless otherwise noted)
Characteristic
Positive Supply Voltage
Negative Supply Voltage
Input Voltage Range of Driver
Input Voltage Range of Receiver
Output Voltage Range of Driver
Output Voltage Range of Receiver
Output Current of Driver
Response Control Current
Power Dissipation
Operating Temperature Range
Symbol
Value
Unit
Vee
VEE
Vird
Virr
Vord
Vorr
ICd
Ires
-0.4 - + 18
0.4 --18
-5 -18
-30 - 30
-25 - 25
-0.4 - 7
50
-10 - 10
V
V
V
V
V
V
mA
mA
DIP
Pd
762
mW
SOP
Pd
543
mW
DIP
Ta
-20 - 85
°C
SOP
Ta
-20 - 70
°C
T sig
-65 -150
°C
Symbol
Value
Unit
Vee
VEE
IRES
V ID
VIR
lOR
4.5 -15
-4.5 - -15
-5.5 - 5.5
15
-25 - 25
24
V
V
mA
V
V
mA
Storage Temperature Range
•
RECOMMENDED OPERATING CONDITIONS
Characteristic
Positive Supply Voltage
Negative Supply Voltage
Response Control Current
Input Voltage of Driver
Input Voltage of Receiver
Output Current of Receiver
ELECTRICAL CHARACTERISTICS
(Vee = 12V, VEE = -12V, Ta = - 20°C - 85°C, unless otherwise noted)
Characteristic
Positive Supply Current
Positive Supply Current
Test Condition
Min
Typ
Max
Vee=5V
Vee=9V
Vee = 12V
leel
VID = 2.0V
V 1R = 2.3V
No Load
6.3
9.1
10.4
8.1
11.9
14.0
Vee = 5V
Vee = 9V
Vee = 12V
lee2
V1D =O.8V
V 1R =0.6V
No Load
2.5
3.7
4.1
3.4
5.1
5.6
VEE =
VEE =
VEE =
NegatilSe Supply Current V =
EE
VEE =
VEE =
I
Symbol
- 5V
-9V
-12V
-5V
- 9V
-12V
Vee =5V
Vee = 12V
c8SAMSUNG
Electronics
IEEl
IEE2
lee3
VID = 2.0V
VIR=2.3V
No Load
V'D=O.8V
V'R=0.6V
No Load
VID = OV, VIR = 2.3V
VEE = OV, No Load
-3.1
-4.9
-4.8 -6.1
-0.20 -0.35
-0.25 -0.40
-0.27 -0.45
- 2.4
Unit
mA
-3.9
4.8
6.7
6.4
9.1
111
KA2654
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
Min
Typ
Max
Unit
DRIVER
Input Voltage High
V,H
Input Voltage Low
V,L
2.0
Vee =5V, VEE = -5V
Output Voltage High
Vee = 9V, VEE = - 9V
VOH
V\D = 0.8V, RL = 3KO
Vee = 12V, VEE = -12V
3.2
3.7
6.5
7.1
8.9
9.8
Vee =5V, VEE = -SV
Output Voltage Low
Vee = 9V, VEE = - 9V
VOL
VID = 2.0V, RL = 3KO
Voc= 12V, VEE= -12V
Input Current High
Input Current Low
hH
VID = 7.0V
I'L
V'O=O.OV
10SH
V,o =0.8V, Vo=O.OV
-7.0
Output Short Circuit Current (Negative)
10SL
VID = 2.0V, Vo=O.OV
6.5
Output Impedance
Ro
Vee = VEE = OV, Vo = ± 2V
300
Output Short Circuit Current (Positive)
V
0.8
V
-3.6
-3.2
-7.1
-6.4
-9.7
-8.8
5
JLA
-0.73
-1.2
rnA
V
-12.0 -14.5 rnA
11.5
14.0
rnA
0
RECEIVER
Input Threshold Voltage (Positive)
VT +
1.2
1.9
2.3
Input Threshold Voltage (Negative)
VT -
0.6
0.95
1.2
Input Hysteresis
VHYS
0.6
4.1
4.5
Vee =5V, VEE = -5V
Output Voltage High
VOH
V'R = 0.6V, 10H= -10JLA
3.7
V
Vee = 12V, VEE = -12V
4.4
4.7
5.2
Vec ';'5V, VEE = -5V
3.1
3.4
3.8
VOH
V,R = 0.6V, 10H = 0.4mA
VOL
V'R = 2.3V, 10L = 24mA
3.6
Vec = 12V, VEE = - 12V
Output Voltage Low
Input Current High
Input Current Low
Output Short Circuit Current
c8SAMSUNG
Electronics.
I'H
I'L
los
V
4.0
4.S
0.2
0.3
V,R = 25V
3.6
6.7
8.3
V,R =3V
0.43
0.67
1.0
V,R = -25V
-3.6
-6.7
-8.3
V,R = -3V
-0.43 -0.74
-1.0
V,R =0.6V
-2.8
-3.7
V
V
rnA
rnA
rnA
112
LINEAR INTEGRATED CIRCUIT
KA2654
SWITCHING CHARACTERISTICS
(Vee = 12V, VEE = -12V, Ta = - 25°C, unless otherwise noted)
Characteristic
Symbol
Test Condition
Min
Typ
Max
340
480
ns
100
150
ns
120
180
ns
105
160
ns
2.1
3.0
P.s
2.1
3.0
p's
150
240
ns
50
100
ns
250
360
ns
18
35
ns
Unit
DRIVER
Propagation Delay Time Low to High
tPLH
Propagation Delay Time High to Low
t pHL
Transition Time Low to High
tTLH
Transition Time High to Low
trHL
Transition Time Low to High.
trLH
TranSition Time High to Low
trHL
RL =3KO
C L 50pF
=
RL =3KO - 7KO
CL =2500pF
RECEIVER
Propagation Delay Time Low to High
tpLH
Propagation Delay time High to Low
t PHL
Transition Time Low to High
trLH
Transition Time High to Low
trHL
Note: Measu red between
+ 3V
RL=4000
C L =50pF
and - 3V points on the output waveform.
TEST CIRCUIT
3V
INPUTo------i
1
OUTPUT
C,"50pF
INPUT
ov
tpLH
OUTPUT
90%
VOH
VOL
(TEST CIRCUIT)
tTLH
Fig. 1 Driver
(WAVE FORM)
+5V
,---------~--------4V
INPUT
0------1
INPUT
---~
----oV
OUTPUT --------'"\.
I ' - - - -...............Lf---+---- VOL
(TEST CIRCUIT)
(WAVEFORM)
Fig. 2 Receiver
c8SAMSUNG
Electronics
113
I
NOTES
CMOS INTEGRATED CIRCUIT
KS5706
16 DIP
3 LINE DRIVERS AND
3 LINE RECEIVERS
The KS5706 is a CMOS 3 line drivers and 3 line receivers
in a single chip designed to interface data terminal
equipment with data communications equipment in conformance with the electrical specifications of EIA standard RS-232-C and CCITT V.28.
16 SOP
FEATURES
•
•
•
•
•
•
•
•
Current limited output
Power·off sourcljI impedance: 300 Ohms
Compatible with TTL
Flexible operating supply range (± 5 to ± 12V)
Output voltage swing selectable
Input resistance (3 to 7 KQ)
Input voltage range: ± 25V
Input threshold hysteresis built in
1
•
16
Device
Package
KS5706N
16 DIP
KS5706D
16 SOP
Operating Temperature
-40 - +85°C
SCHEMATIC DIAGRAM
PIN CONFIGURATION
Voo
•
ORDERING INFORMATION
(1/3 OF CIRCUIT SHOWN)
Vee
Vee
Tx
300n
LEVEL
SHIFT
c8SAMSUNG
Electronics
.
115
CMOS INTEGRATED CIRCUIT
KS5706
ABSOLUTE MAXIMUM RATINGS
Characteristic
Power Supply Voltage
(Ta=25°C, unless otherwise noted)
Symbol
Value
Unit
Voo
Vss
Vee
- 0.5 -13.5
+0.5 - -13.5
-0.5 -6.0
Vdc
(Voo~ Vee)
Input Voltage Range
Receiver Input (Rx1-3)
Oriver Input (011-3)
VIR
Maximum Current Per Pin
Power Oissipation
Operating Temperature
Storage Temperature
--
-25 - 25
-0.5 -Voo+0.5
Vdc
Imax
±60
rnA
Po
1.0
W
Ta
-40 -85
°C
T 5tg
-85-150
°C
--
ELECTRICAL CHARACTERISTICS
(Voo = + 5 to + 12V, Vss = - 5 to -12V, VOO~ Vee, Ta = - 40° to 85°C, unless otherwise noted)
Symbol
Characteristic
Test Condition
Min
Typ
Max
Unit
4.5
-4.5
4.5
5 to 12
-510 -12
5.0
13.2
-13.2
5.5
Vdc
140
340
300
400
600
450
p.A
0.8
Vdc
RECOMMENDED OPERATING CONDITIONS
Power Supply Voltage
Voo
Vss
Vee
Quiescent Current (Inputs tied to GNO,
outputs unloaded)
DRIVER (Vee
Voo
Vss
Vee
VDo~Vee
100
Iss
-lee
Voo = + 12.0V
Vss= -12.0V
Vee= +5.0V
VIL
VIH
Low
High
= +5V±5%)
Input Voltage (011-3)
2.0
Input Leakage Current (011-3)
liN
011-3=Vce
Output Voltage High (011-3 = 0.8V,
RL = 3.0Kn), Tx1·3
VOH
Voo=5.0V, Vss = -5.0V
Voo=6.0V, Vss = -6.0V
VOD = 12.0V, Vss = -12.0V
3.5
4.3
9.2
3.9
4.7
9.5
Vdc
Output Voltage Low (011-3 = 2.0V,
RL=3.0Kn), Tx1-3
VOL
Voo = 5.0V, Vss = - 5.0V
Voo=6.0V, Vss= -6.0V
Voo= 12.0V, Vss= -12.0V
-4.0
-4.5
-10.0
-4.3
-5.2
-10.3
Vdc
Output Short Circuit Current
Ise
(Voo = 12.0V, Vss = - 12.0V)
Tx1·3 shorted to Gnd
Tx1·3 shorted to ± 15.0V
Power Off Source Resistance (Tx1-3)
c8SAMSUNG
Electronics
Rn
Voo = Vss = Gnd = OV,
Tx1-3 = ± 2.0V
± 1.0
± 10
±40
300
±20
±60
p.A
rnA
n
116
CMOS INTEGRATED CIRCUIT
KS5706
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
(Continued)
Test Condition
Min
Typ
, Max
Unit
RECEIVER
Input Turn-On Threshold Voltage,
Rx1-3
V 1H
001-3 = VOL,
Vee = 5.0 -6.0V
1.35
1.80
2.35
Vdc
Input Turn-Off Threshold Voltage,
Rx1-3·
V 1L
001-3::: VOH,
Vee::: 5.0 -6.0V
0.75
1.00
1.25
V dc
Input Threshold Hysteresis, Rx1-3
V HY
V 1H - V 1L
0.6
0.8
Input Resistance, Rx1-3
RIN
Rx1-3= ±3 -±25V
3.0
5.4
Output Voltage High, 001-3
(Rx1-3::: - 3 - - 25V)
VOH
lOUT::: - 20J-tA, Vee = 5.0V
louT= -1mA, Vee=5.0V
4.9
3.8
4.3
Output Voltage Low, 001-3
(Rx1-3 = 3 - 25V)
VOL
louT = 20J-tA, Vee = 5.0V
lOUT = 2mA, Vee = 5.0V
lOUT = 4mA, Vee = 5.0V
Vdc
7.0
KO
Vdc
0.Q1
0.2
0.5
0.1
0.5
0.7
VdC
200
200
325
325
nS
SWITCHING CHARACTERISTICS (Vcc=5V±5%, V DD =6V-12V, Vss= -6V --12V. Fig 2)
Drivers Propagation Delay Time, Tx1-3
t pLH
t pHL
RL =3Kn, CL=50pF, Low to High
RL=3Kn, CL=50pF, High to Low
Drivers Output Slew Rate, Tx1-3
SR
RL = 3KO, C L ::: 50pF
±6
±30
V/p,s
Receivers Propagation Delay Time,
001·3
tpLH
t PHL
C L = 50pF, Low to High
C L = 50pF, High to Low
150
150
300
300
nS
Receivers Output Rise Time, 001-3
t,
C L =50pF
250
400
nS
Receivers Output Fall Time 001·3
tf
C L =50pF
40
80
nS
--+3V
011
012
Tx1
14
RX1·3
'------oV
Tx2
12
VIN= ±2V
DI3
Tx3
10
'Voo
8
RO=VIN/I
Vss
001·3
ir---- VOH
--VOL
t,
9
GND
OV
VOH
Fig. 1 Power Off Source Resistance
SLEW RATE (SR) = (0.8) (VOH - Vall or (0.8) (VOL -'VOH}
t,
tf
Fig. 2 SWitching Characteristics
c8SAMSUNG
Electronics
117
•
CMOS INTEGRATED CIRCUIT
KS5706
PIN DESCRIPTION
Pin
Name
Functions
1
Voo
8
Vss
Negative power supply. Typically - 5 to -12V
Vee
Digital power supply. This pin is connected to the logic
power supply (Max. 5.5V). Vee must be less than
or equal to Voo
16
Positive power supply. Typically 5 to 12V
9
GNO
10, 12, 14
011, 012, 013
3, 5, 7
Tx 1, Tx2, Tx3
Transmit data output. These are the RS-232-C transmit
signal output pins. A logic "0" causes the output to swing
to Voo and a logic "1" causes the output to swing to Vss
2, 4, 6
Rx1, Rx2, Rx3
Receive qata input. These are the RS-232-C receive signal
input pins which swing from + 25 to - 25V. A voltage
between + 3 and + 25V causes the correspanding DO pin to
swing to GNO and a voltage between - 3 and - 25V causes
the DO pin to swing to Vee
11, 13, 15
DO 1, 002, 003
Ground. All voltage levels are referenced to this pin
Driver data input. These are the high impedance digital
input pins. These input levels are compatible with TTL
--1--
qsSAMSUNG
Electronics
Receive data output. Swing from Vee to GNO. Each output
pin is capable of driving TTL input load
118
KS5788
CMOS INTEGRATED CIRCUIT
QUAD CMOS LINE DRIVER
The KS5788 is designed to interface data terminal equipment (OTE) with data communications equipment (OCE)
in conformance with the specifications of EIA RS-232-C,
CCITI V.24 standards. The KS5788 is direct replacement
for the bipolar device (MC1488).
14 SOP
FEATURES
•
•
•
•
•
I
Low power consumption & low delay slew
Pin for pin equivalent to MC1488
Power-off source impedance: 300n (min)
Compatible with TTL and HCTLS families
Flexible operating supply range: 4.S-12.6V
ORDERING INFORMATION
PIN CONFIGURATION
•
Device
14 Vee
Package
KS5788N
14 DIP
KS57880
14 SOP
Operating Temperature
-40 - +85°C
BLOCK DIAGRAM
(1/4 OF CIRCUIT SHOWN)
INPUT 1
LEVEL SHIFT
TTL LEVEL
INPUT 2
OUTPUT V - - - . . - - - - - - - C K
SLEW RATE
CONTROL
c8SAMSUNG
Electronics
119
KS5788
CMOS INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristic
(Ta = 25°C, unless otherwise noted)
Symbol
Value
Unit
Vee
VEE
-0.5 -13.5
0.5 - -13.5
VdC
VIN
-0.3 -Vee+0.3
V dC
VOUT
-25- 25
VdC
Power Supply Voltage
Input Voltage (Any Input Pin)
Output Voltage (Any Output Pin)
Power Dissipation
Po
1.0
W
Operating Temperature
Ta
-40 -85
°C
Storage Temperature
Tstg
-65 -150
°C
ELECTRICAL CHARACTERISTICS
(Vee = 4.5 to 12V, V Ee = - 4.5 to -12V, GND = OV, Ta
Characteristic
= - 40°
Symbol
to 85°C, unless otherwise noted)
Test Condition
Min
Typ
Max
Unit
4.5
-4.5
12.6
-12.6
V dc
RECOMMENDED OPERATING CONDITIONS
Power Supply Voltage
Vee
VEE
Vee
Vee
DC ELECTRICAL CHARACTERISTICS
Input Current 1
III
VIN=GND
-10
10
J1.A
Input Current 2
ItH
VIN =V ee
-10
10
J1.A
lee1
Vee=4.5V, V ee = -4.5V
Vee = 9.0V; Vee = - 9.0V
Vee = 12.0V, V ee -12.0V
10
30
60
J1.A
J1.A
J1.A
lee2
Vee=4.5V, Vee= -4.5V
Vee=9.0V, V eE = -9.0V
Vee 12.0V, Vee = -12.0V
30
190
425
J1.A
J1.A
J1.A
Negative Supply Current 1
(VIN = Vll , RL =00 , per package)
IEE1
Vee = 4.5V, Vee = - 4.5V
Vee=9.0V, VEE= -9.0V
Vee = 12.0V, VEE = -12.0V
-10
-10
-10
J1.A
J1.A
J1.A
Negative Supply Current 2
(VIN = VIH , Rl = 00, per package)
lee2
Vcc=4.5V, VEE = -4.5V
Vee = 9.0V, Vee = - 9.0V
Vee = 12.0V, Vee = -12.0V
-30
-30
-60
J1.A
J1.A
J1.A
InRut Voltage High
VIH
2.0
Voo
Vdc
GND
GND
0.8
0.6
Vdc
Positive Supply Current 1
. (VIN = Vll, Rl = 00, per package)
Positive Supply Current 2
(VIN = V IH , RL = 00, per package)
Input Voltage Low
c8~SUNG
V IL
=
=
Vee~ 7V, VEE~ - 7V
Vcc~7V, VEE~ -7V
120
CMOS. INTEGRATED CIRCUIT
KS5788
ELECTRICAL CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
Min
Output Voltage High
(VIN = V IL , RL = 3KO - 7KO)
VOH
Vee = 4.5V, VEE = - 4.5V
Vee = 9.0V, VEE = - 9.0V
Vee = 12V, VEE = -12V
Output Voltage Low
(V IN = V IH , RL = 3KO - 7KO)
VOL
Vee = 4.5V, VEE = - 4.5V
Vee = 9.0V, VEE = - 9.0V
Vee = 12V, VEE = -12V
Output Short Circuit current
IVIN =VIL
l
VIN =V IH
Power Off Output Resistance
los
Ro
Typ
Max
3.0
6.5
9.0
Unit
V dC
-3.0
-6.5
-9.0
V dC
45
Vo=GND
rnA
-45
Vee = 12V, VEE = - 12V
Vee = VEE == OV, VOUT = ± 2V
0
300
SWITCHING CHARACTERISTICS (Vcc=4.5V to 12V, V EE = -4.5V to -12V, Ta= -40°C - 85°C, Fig. 1)
Propagation Delay
tpd
6.0
5.0
4.0
Vee = 4.5V, VEE = - 4.5V
Vee = 9.0V, VEE = - 9.0V
Vee = 12V, VEE= -12V
itS
Output Rise Time
t,
VOUT == from - 3V to 3V
0.2
itS
Output Fall Time
tl
VOUT = from 3V to - 3V
0.2
itS
Output Slew Rate
SR
RL = 3KO to 7KO
15pF>CL>2.5nF
Typical Propagation Delay Skew
tSK
Vee = 12V, VEE = - 12V
30
400
V/p.S
nS
--'-.5V-----~\-11-,'5_V~~~·~~_-:~:
u--__..-------1'~---O VOUT
VIN
_~
tpo
~tpo
VOUT--- .......
%" I
90
!
10%
'CL includes probe and jig capacitance
10%
tl
Fig. 1 AC Test Circuit
c8SAMSUNG
Electronics
Fig. 2 Switching Waveforms
121
•
CMOS INTEGRATED CIRCUIT
KS5789A
14 DIP
QUAD CMOS LINE RECEIVER
The KS5789A is designed to interface data terminal
equipment (DTE) with data communications equipment
(DCE) in conformance with the specifications of EIA
RS-232-C, CCITT V.24 standards. The KS5789A is direct
replacement for the bipolar device (MC1489/A).
14 SOP
FEATURES
•
•
•
•
•
•
Low power consumption & low delay slew
Pin for pin equivalent to MC1489/A
Inputs withstand ± 30V
Fail-safe operating mode
Internal noise filter
Internal input threshold with hysteresis
ORDERING INFORMATION
Package
Device
PIN CONFIGURATION
KS5789AN
14 DIP
KS5789AD
14 SOP
Operating Temperature
-40 _ +85°C
BLOCK DIAGRAM
(1/4 OF CIRCUIT SHOWN)
COMPARATOR
14
Vee
INPUT
c8SAMSUNG
Electronics
NOISE
FILTER
122
KS5789A
CMOS INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristic
(Ta=25°C, unless otherwise noted)
Symbol
Value
Unit
Vee
Y'N
VOUT
Po
Ta
T5tg
-0.5 -7.0
-30-30
- 0.3 - Vee + 0.3
500
-40 -85
-65 -150
Vdc
Vdc
Vdc
mW
°C
°C
Power Supply Voltage
Input Voltage
Output Voltage
Power Dissipation (85°C)
Operating Temperature
Storage Temperature
I
ELECTRICAL CHARACTERISTICS
(Vee=5V±0.5V, Ta:::: -40° to 85°C, unless otherwise noted)
Characteristic
Symbol
Test Condition
Min
Typ
Max
Unit
DC ELECTRICAL CHARACTERISTICS
Input Voltage High
V,H
1.3
2.5
Vdc
Input Voltage Low
V,L
0.5
1.7
V dc
Input Hysteresis Voltage
VH
V,H - V,L
liN
V,N =3V
Y,N = -3V
Y,N =25V
Y'N = - 25V
1.0
-1.0
8.3
-8.3
mA
Input Current
1.0
0.43
-0.43
3.6
-3.6
V dc
Output Voltage High
VOH
Y,N = V'L(min), lOUT = - 3.2mA
Output Voltage Low
VOL
Y'N = V'H(max)o lOUT = 3.2mA
0.4
Vdc
Supply Current
Icc
RL =00, Y'N = VIl.(min) to V'H(max)
600
,.,.A
6.5
300
300
1.0
,.,.S
nS
nS
,.,.S
nS
2.8
Vdc
SWITCHING CHARACTERISTICS (Vee = 4.5V to 5.5V, Ta::;: -40°-85°C, C L=50pF, Note 1)
Propagation Delay
Output Rise Time
Output Fall Time
Pulse Width Assumed to be Noise
Propagration Delay Skew
Note 1: Test waveform tr
=tl =200ns, V,H =
c8SAMSUNG
Electronics
tp
tr
tl
Input pulse width ~ 10,.,.S
tnw
t5k
+ 3V,
400
V,L = - 3V, f = 20KHz
123
CMOS INTEGRATED CIRCUIT
KS5789A
Vee
INPUT
>o~-e~-o
OUTPUT
Vour
90%
Fig. 1 AC Test Circuit
Fig. 2 Switching Waveforms
TYPICAL APPLICATION
TIL
INTER
CONNECTING
CABLE
KS5788
TIL
LINE RECEIVER
LINE DRIVER
LINE RECEIVER
KS5789A
LINE DRIVER
KS5789A
TTL
KS5788
SIGNAL GROUND
(DTE)
(DCE)
RS-232-C Data Transmission
c8SAMSUNG
Electronics
124
CMOS INTEGRATED CIRCUIT
KS5805A1KS5805B
TELEPHONE PULSE DIALER WITH REDIAL
The KS5805A1B is a monolithic CMOS integrated circuit and provides
all the features required for implementing a pulse dialer with redial.
18 DIP
FUNCTIONS
•
•
•
•
•
•
•
•
Mute output logic "0"
Pulse output logic "0"
RC oscillation for reference frequency
Designed to operate directly from the telephone line
Used CMOS technology for low voltage, low power operation
Power up clear circuitry
KS5805A pin 2: V REF
KS5805B pin 2: Tone out
•
FEATURES
• Uses either a standard 2 of 7 matrix keyboard with negative true
common or the inexpensive form A-type keyboard
• Make/Break ratio can be selected
ORDERING INFORMATION
• Redial with * or #
• Continuous MUTE
Device
Pack~ge Function
Operating Temperature
• Tone signal output or on-chip reference Voltage by
Pin 2=
bonding option on chip
KS5805AN 18 DIP
Vref
• 10 pps/20 pps can be selected
-30 - +60°C
Pin 2 =
KS5805BN 18 DIP
Tone Out
TEST CIRCUIT
GND
voo
Voo ~----------------------------~--------~~------~
1MO
KS5805 AlB
60% Break
20pps
Fig. 1
c8SAMSUNG
Electronics
10pps
125
CMOS INTEGRATED CIRCUIT
KS5805A1KS5805B
ABSOLUTE MAXIMUM RATINGS (Ta =25°C)
Characteristic
Symbol
DC Supply Voltage
Voltage on Any Pin
Power Dissipation
Operating Temperature
Storage Temperature
Voo
V1N
Po
Topr
Tstg
Value
VDO
Unit
6.2
+0.3, Gnd-0.3
500.0
-30-+60
-65- +150
V
V
mW
°C
°C
DC ELECTRICAL CHARACTERISTICS
(Ta =25°C unless otherwise specified)
Max
Supply Voltage
Voo
6.0
V
Key Contract Resistance
RKI
1
KG
Keyboard Capacitance
C K1
30
pF
KIH
KIL
Typ
Unit
Symbol
Key Input Voltage
Test Conditions
Min
Characteristic
2.5
2 of 7 input
mode
O.8Voo
Voo
Gnd
O.2Voo
V
Notes
1
1
Key Pull-Up Resistance
K 1Ru
Voo =6.0V
100
KG
Key Pull-Down Resistance
K 1Ro
VIN=4.8V
4.0
KG
Mute Sink Current
1M
Voo=2.5V
Vo=0.5V
500
/LA
2
Pulse Output Sink Current
Ip
Voo=2.5V
Vo=0.5V
1.0
rnA
3
Tone Output Sink Current
hL
Voo = 2.5V
Vo=0.5V
250
/LA
4
Tone Output SourcE;! Current
hH
Voo=2.5V
Vo=0.5V
250
/LA
4
Memory Retention Current
IMR
All outputs under
no load
0.7
/LA
6
Operating Current
lop
All outputs under
no load
100
150
/LA
Mute or Pulse Off Leakage
kKG
Voo=6.0V
Vo =6.0V
0.001
1.0
/LA
2.3
VREF Output Source Current
IREF
Voo - VREF = 6.0V
rnA
5
1.0
7.0
Note 1) Applies to key input pin. (R1-R4' C1-C 3)
2) Applies to MUTE output in.
3) Applies to PULSE output pin.
4) Applies to TONE pin (KS5805B)
5) Applies to V REF pin (KS5805A)
6) Current necessary for memory to be maintained. All outputs unloaded.
* Typical values are to be used as a design aid are not subject to production testing.
c8SAMSUNG
Electronics
126
KS5805A1KS5805B
CMOS INTEGRATED CIRCUIT
AC ELECTRICAL CHARACTERISTICS (Ta =2S0C)
Charactistic
Symbol
Min
Typ
Max
Unit
Notes
Oscilator Frequency
Fose
4
KHz
1
Key Input Debounce Time
TOB
10
ms
3,4
Key Down Time for Valid Entry
TKO
40
ms
4,5
Key Down Time During
Two-Key Roll Over
tKR
5
ms
4
=2.5V)
tos
1
Mute Valid After Last Outpulse
tMO
5
ms
3,4
Pulse Output Pulse Rate
PR
10
PPS
2
On-Hook Time Required to
Clear Memory
tOH
ms
4
Pre-Digital Pause
Tpop
800
ms
3,4
Inter-Digital Pause
TIDP
800
ms
3,4
Frequency Stability
Voo 2.5 - 3~5V
.if
±4
%
.if
±4
%
1
KHz
Oscillator Stat-Up Time (Voo
=
Frequency Stability Voo
=3.5- 6.0V
Tone Output Frequency
Note: 1)
2)
3)
4)
5)
6)
ms
300
FTONE
•
4,6
Rs=2MO, R=220KO, C=390pF.
If pin 10 is tied to Vee, the output pulse rate will be 20pps.
If the 20pps option is selected, the time will be 1/2 these shown.
These times are directly proportional to the oscillator frequency.
Debounce plus oscillator start-up time ::5 40ms.
If the 20pps option is selected, the tone output frequency will be 2KHz. (KS5805B ONLY)
PIN CONNECTIONS
Pin 1:
Pin 2:
Pin 3:
Pin 4:
Pin 5:
Pin 6:
Pin 7:
Pin 8:
Pin 9:
Voo
V rel (KS5805A)/Pacifier tone (KS5805B)
Column 1
Column 2
Column 3
GND
RC Oscillator
RC Oscillator
RC Oscillator
c8SAMSUNG
Electronics
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
10:
11:
12:
13:
14:
15:
16:
17:
18:
10/20pps Select
Make/Break Select
Mute Output
ROW 4
ROW 3
ROW 2
ROW 1
On-HooklTest
Pulse Output
127
CMOS INTEGRATED CIRCUIT
KS5805A1KS5805B
TIMING CHARACTERISTICS
Digit
Key input
Digit
Redial
------~L2-Jr------'~r----------------,~r---------------------
Column scan
RIJI1
nnnn
nnnn
(only KS58058)
----ullUUUl-- "H;-----1l.I1Jl1lf ___________~
Row scan
~-----------1llf"LJ1Jl.-----------~
On-Hook input
Ii,
Tone output
soo
I
,
!
MUTE output
:
I
PULSE output
I~
1
I
I
, I
:7
,
,:
I
I I
I
I
I
II .(~~
~!
/,
H
'~
I
r
f' n
I!H!
I
"
I ,It; I
r
'~n
4KHz 11
: I: n.~nn
I
UUL--------,-}---------t-++-JUU Os~ o~ UUI;-----n--------------~.nr
I
::
:I
TS! : :
: ~
: I
I
I
i
I
___ t--TOB
"
TIDP
::::1
H- i i™O1: :
: :
110ms.1
II
II~r' I
I
I
osc output
!
:
(pin 8)
! !Ii!PDP BOOms
!
i :
On hook
800ms
1/PR
Normal dialing
I
I
Off hook mode
I
I'
I~
i i i
I
Redial mode
Off hook mode
-
Test mode
Fig. 2
PIN DESCRIPTIONS
1. Voo (Pin 1)
This is positive supply pin. The voltage on this pin is measured relative to Pin 6 and is supplied from a 150llA
current source. This voltage should be regulated to less than 6.0 volts using on external form or regulation.
2. Tone signal outputN REF (Pin 2)
Tone signal out pin is CMOS comperementaly output and drives external bipolar transistor. This pin generates
a tone signal when a key is depressed. Tone signal frequency is 1KHz when 10pps pulse rate is selected. (the
frequency is 2KHz when 20pps pulse rate is selected). Only the pin 2 of KS5805A is VREF (on-chip reference voltage).
TYPICAL I-V CHARACTERISTICS
The VREF output provides a reference voltage that tracks internal
parameters of the KS5805A. VREF provides a negative voltage reference
to the Voo supply. Its magnitude will be approximately 0.6 volt higher
than the minimum operating voltage of each particular KS5805A.
7.0
6.0
The typical application would be to connect the VREF pin to the GND
pin (Pin 6). The supply to the Voo pin (Pin 1) should then be regulated
to 150IlA (lop max). With this amount of supply current, operation of the
KS5805A is guaranteed.
5.0
IREF
MA
4.0
3.0
The internal circuit of the VREF function is shown in Figure 3 with its
associated I-V characteristic.
2.0
VREF
1.0
voo
1.0
-VREF
2.0
3.0
4.0
5.0
VOLTS
c8SAMSUNG
Electronics
Fig. 3
128
CMOS INTEGRATED CIRCUIT
KS5805A1KS58058
3. Keyboard inputs (Pin 3, 4, 5, 13, 14, 15, 16,)
The KS5805A1B incorporates an innovative keyboard scheme that allows either the standard 2-of-7 keyboard with negative common or the inexpensive single contact (form A) keyboard to be used.
A valied key entry is defined by either a single row being connected to a single column or GND being simultaneously
presented to both a single row and column. When in the on-hook mode, the row and column inputs are held high and no
keyboard inputs are accepted.
When off-hook, the keyboard is completely static until the initial valid key input is sensed. The oscillator is then enabled
and the rows and columns are scanned alternately (pulled high, then low) to verify the varied input. The input must
remain valid for 10msec of debounce time to be accepted .
• Form A type keyboard
____________~
• 2 of 7 keyboard (negative common)
.4L-___________
COL
ROW
ROW
• 2 of 7 keyboard
• Electron ic input
H
~~~-----_________ U
?_~
U
VOD
COL
ROW
COL
_V_DD_ _ _ _ _ _-,
______
ROW
n _ n __
KEY BOARD CONFIGURATIONS
4. GND (Pin 6)
This is the negative supply pin and is connected to the common part in the general applications.
5.
O~,CILLATOR
(Pins 7, 8, 9)
The KS5805A1B contains on-chip inverters to provide oscillator which will operate with a minimum external components.
Following figure shows the on-chip configuration with the necessary external components. Optimum stability occurs with
the ratio K=Rs/R equal to 10.
The oscillator period is given by:
T=RC (1.386+(3.5KC s)/C-(±K/(K+1)) In (K/(1.5K+O.5))
Where Cs is the stray capacitance on Pin 7.
Accuracy and stability will be enhanced with this capacitance minimized.
Rs
r--<>----
c
8
L----
KS5805 AlB
9
R
c8SAMSUNG
Electronics
129
•
CMOS INTEGRATED CIRCUIT
KS5805A1KS5805B
6. 20110 pps (Pin 10)
Connecting this pin to GND (pin 6) will select an output pulse rate of 10pps.
Connecting the pin V DD (pin 1) will select an output pulse rate of 20pps.
7. MAKE/BREAK (Pin 11)
The MAKE/BREAK pin controls the MAKE/BREAK ratio of the pulse output. The MAKE/BREAK ratio is controlled
by connection V DD or GND to this pin as shown in the following table.
Input
V DD (Pin 1)
Make
Break
34%
66%
.~
GND (Pin 6)
'--_._-_.-
40%
60%
8. MUTE OUTPUT (Pin 12)
The mute output is an open-drain N-channel transistor designed to drive external bipolar transistor.
This circuitry is usually used to mute the receiver during outpulsing. As shown in Fig. 2 the KS5805 mute output
turns on (pulls to the VGND-supply) at the beginning of the predigital pause and turns off (goes to an open circuit)
fol:owing the last break.
The delay from the end of the last break until the mute output turns off is mute overlap and is specified as tMO.
9. ON·HOOKITEST (Pin 17)
The "ON-HOOK" or "Test" input of the KS5805A/B has a 100KQ pull-up to the positive supply. A Vee input or
allowing the pin to float sets the circuit in its on-hook or test mode while a VGND input sets it in the off-hook or
normal mode. When off-hook the KS5805A/B will accept key inputs and outputs the digits in normal fashion. Upon
completion of the last digit, the oscillator is disabled and the circuit stands by for additional inputs.
Switching the KS5805A/B to on-hook while it is outpulsing causes the remaining digits to be outpulsed at 100x
the normal rate (M/B ratio is then 50/50).
This feature provides a means of rapidly testing the device and is also on efficient method by which the circuitry
is reset. When the outpulsing in this mode, which can be up to 300msec, is completed, the circuit is deactivated
and will require current only necessary to sustain the memory and power-up-clear detect circuity (refer to the electrical specifications).
Upon retuning off-hook, a negative transistion on the mute output will insure the speech network is connected
to the line. If the first key entry is eithr a * or #, the number sequence stored on-chip will be outpulsed. Any other
valid key entries will clear the memory and outpulse the new number sequence.
10. PULSE OUTPUT (Pin 18)
The pulse output is an open drain N-channei transistor designed to drive external bipolar transistor. These transistor would normally be used to pulse the telephone line by disconnecting and connecting the network. The
KS58A/B05 pulse output is an open circuit during make and pulls to the GND supply during break.
c8SAMSUNG
Electronics
130
KS58C05/KS58 005
CMOS INTEGRATED CIRCUIT
PULSE DIALER WITH REDIAL
The KS58C/D05 is a monolithic CMOS integrated circuit
which uses an inexpensive RC oscillator for its frequency reference and provides all the features required for
implementing a pulse dialer with 32 digit redial.
FUNCTIONS
•
•
•
•
Mute output logic "0"
Pulse output logic "0"
RC oscillation for reference frequency
Designed to operate directly from the telephone
line
• Used CMOS technology for low voltage,
low power operation
I
FEATURES
• Wide operating voltage range (2.0 - 6.0V)
• Low power dissipation
• Use either a standard 2 of 7 matrix keyboard with
negative true common or the inexpensive form
A-type keyboard
• Make/Break ratio can be selected
• Redial with * or #
• Continuous MUTE
• Power up clear circuitry on chip
• KS58C05 pin 2: Vref, KS58D05 pin 2: Tone output
• 10 pps/20 pps can be selected
ORDERING INFORMATION
Device
KS58C05N
18 DIP
KS58D05N
18 DIP
Pin 2=
Tone Out
I
--+----11
..----1
I
~
------~-+----+--,
~---------<6
HOOK
i FROM c~--
1~~;D~-
FROM
KEYBOARD
'----("'J
Fig. 1
c8SAMSUNG
Electronics
Operating Temperature
-20 -
+ 70°C
PIN CONNECTIONS
QVDD
I
Function
Pin 2=
Vref
TEST CIRCUIT
QGND
Package
Pin
Pin
Pi n
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Piri
Pin
Pin
1: VDD
2: Vref (KS58C05)/Pacifier tone (KS58D05)
3: COfUrTil11
4: Column 2
5: Column 3
6: GND
7: RC Oscillator
8: RC Oscillator
9: RC Oscillator
10: 10/20pps Select
11: Make/Break Select
12: Mute Output
13: ROW 4
14: ROW 3
15: ROW 2
16: ROW 1
17: On-HooklTest
18: Pulse Output
20pps
~
131
CMOS INTEGRATED CIRCUIT
KS58C05/KS58 005
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
Characteristic
Symbol
Supply Voltage
Input Voltage
Output Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Voo
V1N
VOUT
Po
Ta
Tstg
Unit
Value
V
V
V
mW
°C
°C
6.2
Gnd-0.3, Voo+0.3
Gnd - 0.3, Voo + 0.3
500
-20 - + 70
-40 - + 125
ELECTRICAL CHARACTERISTICS
(V DO
=3.5V, fosc =2.4KHz. Ta =25°C, unless otherwise specified)
Characteristic
Test Conditions
Symbol
Min
Supply Voltage
Voo
2.0
Memory Retention Voltage
VOR
1.0
Typ
Max
Unit
6.0
V
f - - - - - - - - - - - - - - - i - - - - - - - 1----------------------+--------+-----+------------
f---,n_p_u_t_H_ig_h_V_o_'_ta_g'-e_ _-----,-___-+___V
___
IH - - ~ _
Input Low Voltage
VIL
-R;, C~ _ ~, H$, DRS,
----------
---MIS
--
Output Current (MUTE, PULSE)
101
V
V
------~--__t------1---
Operating Current
100
All output under no load
1-------------------1-------Output Leakage Current
10L
Vcc=6.0V, MOTE, PULSE=6.0V
-------1------1------
V
----~------+----~--~
1----0_.B_V_oo---+_____+_ Voo
Gnd
0.2V OD
100
150
0.001
1
p.A
p.A
--------~----+_-------l----+_--~
VO =O.4V, Voo=2.5V
0.5
1.5
mA
Vo =0.4V, Voo =3.5V
1.7
5.0
mA
2.4
KHz
--------+---------------------------~-----~--_4------~--4
102
f---------------_4-----l-------------------------I-----------+------t------1
Oscillator Frequency
fosc
f-------------_4----
---------------------\-----
-l----------l---- - -
Valid Key Entry Time
TKo
14
20
mS
f----------.:...----------t-------f-------------------i-------J----- - - - - t - - - On Hook Time Required to
300
mS
Clear Memory
f------------------------ e-----f---------------------i-------t-----l--- -+------1
Inter Digital Pause
Tlop
BOO
mS
-----------+-----+-------------------
Frequency Stability
.6 f
Voo = 2.0~ 6.0V
---- t - - - ----%
± 10
I - - - - - - - - - - - - - - - - - - - - - - - - - l - - - - I - - - - - - - - - - - - - - - - - - - - - - - 1 - - - - - - I-------r----- t - -
Tone Output Frequency
hONE
1.2
KHz
FUNCTION DESCRIPTION
1. "ON·HOOK" MODE
When "ON-HOOK," key inputs will not be recognized because the oscillator is disabled which prevents the
circuit from drawing excessive current.
2. "DIAL" MODE
When "OFF-HOOK," the device senses key down condition by detecting one key input and enters the key's
code into an on-chip memory.
The memory can be store up to 32 digits, and it allows key strobes to be entered at rates comparable to tone
dialing telephone. Output pulsing will continue until all entered digits have been dialed. To implement the pulse
dialer function, two outputs, one to pulse the telephone line and one to mute the receiver, are provided.
3. "REDIAL" MODE
The first 32 digits entered will be stored in the on-Chip redial memory and can be redialed by pressing either
* or H, provided that the receiver is "ON-HOOK" for minimum TOH (on hook time required to clear memory).
4. POWER UP CLEAR
The on-chip "POWER UP CLEAR" circuit reliable operation of the device. If the supply to the circuit is not
sufficient to retain data in the memory, a "POWER UP CLEAR" will help regaining a proper supply level.
This function will prevent the "Redial" or spontaneous outputing of incorrect data.
c8SAMSUNG
Electronics
132
KS58C05/KS58 005
CMOS INTEGRATED CIRCUIT
TIMING CHARACTERISTICS
Digit
Key input
Digit
Redial
------~L2-Jp----~~r--------------~~r---------------------
Tone output
___rum____
Column scan
~ --SOOH;-----J1Jl-JlIlf ___________~'
---Innnn~
_______. .RRM'__________
(only KS58D05)
LJuuutnr------------u-u---tJUl------------uu--
Row scan
I
On-Hook input - - ,
!
MUTE output
I
I
PULSE output
1
OSC output
i
r
n
I
i, :
! i:
:
11
I I . (f--,r---f
I
I
I
,
I
I
.
I
!i
'nn--------~+--------l_H-JUU Os~ o.ff UUl:"--------------------~.ru_
~~t
:!
TB I ::
::
:! ' i i
I
110;;-1
':
/,
1
4KHz
Tpop800ms
I
I
"
,
I
,
1 I:
I
II
:-TOS
:, I
H
SOOms
Normal dialing
I
n.~nn
=1 ~
TIDP
ITMO!:
~'
Off hook mode
I
r
! -
I
:
1
I
"
{f--!!
!
(pin 8)
On hook
I
I!
Ij
I'
I
l
I.
:I
I ~'
i
Redial mode
Off hook mode
=
Test mode
Fig. 2
PIN DESCRIPTIONS
1. Voo (Pin 1)
This is positive supply pin. The voltage on this pin is measured relative to Pin 6 and is supplied from a 150l-tA
current source. This voltage should be regulated to less than 6.0 volts using on external form or regulation.
2. Tone signal output/V REF (Pin 2)
Tone signal out pin is CMOScomplementally output and drives external bipolar transistor. This pin generates
a tone Signal when a key is depressed. Tone Signal frequency is 1.2KHz when 10pps pulse rate is selected.
TYPICAL I-V CHARACTERISTICS
The VREF output provides a reference voltage that tracks internal
parameters of the KS58C05. VREF provides a negative voltage
reference to the Voo supply. Its magnitude will be approximately 0.6
volt higher than the minimum operating voltage of each particular
KS58C05.
7.0
6.0
5.0
,The typical application would be to connect the VREF pin to the GND
'pin (Pin 6). The supply to the Voo pin (Pin 1) should then be regulated
to 150l-tA (lop max). With this amount of supply current, operation of
jthe KS58C05 is guaranteed.
IREF
MA
4.0
3.0
The internal circuit of the V REF function is shown in Figure 3 with its
associated I-V characteristic.
2.0
VREF
1.0
1.0
Voo -
VREF
2.0
3.0
4.0
5.0
VOLTS
c8SAMSUNG
Electronics
Fig. 3
133
CMOS INTEGRATED CIRCUIT
KS58C05/KS58D05
3. Keyboard inputs (Pin 3, 4, 5, 13,. 14, 15, 16)
The KS58CIDOS incorporates an innovative keyboard scheme that allows either the standard 2-of-7 keyboard with
negative commOn or the inexpensive single contact (form A) keyboard to be used.
A valied key entry is defined by either a single row being connected to a single column or GND being simultaneously
presented to both a single row and column. When in the on-hook mode, the row and column inputs are held high
are no keyboard inputs are accepted.
When off-hook, the keyboard is completely static until the initial valid key input is sensed. The oscillator is then
enabled and the rows and columns are scanned alternately (pulled high, then low) to verify the varied input. The
input must remain valid for 14-20 msec of debounce time to be accepted.
• Form A type keyboard
• 2 of 7 keyboard (negative common)
-----------~
COL
• 2 of 7 keyboard
-.~----------
ROW
±----
r--------------..
~-----~
COL
..
~-----------
ROW
G~L---_~
~ ~
COL
-------------
ROW
• Electronic input
Vcc
H
~~~--------------~
_vc_c__________- ,
~--""___ n____ mU
KEY BOARD CONFIGURATIONS
4. GND (Pin 6)
This is the negative supply pin and is connected to the common part in the general applications.
5. OSCILLATOR (Pin 7,8,9)
The KS58C/D05 contains on-chip inverters to provide oscillator which will operate with a minimum external
components.
Following figure shows the on-chip configuration with the necessary external components. Optimum stability
occurs with the ratio K = Rs/R equal to 6.67.
The oscillator period is given by:
T= RC [1.386 + (3.5Kcs}/C-(2K1CK+ 1) In CKI(1.5K+ O.5)l
Where Cs is the stray capacitance on Pin 7.
Accuracy and stability will be enhanced with this capacitance mini'!!}zed.
KS58C/D05
R
=8SAMSUNG
Electronics
134
KS58C05/KS58 DOS
CMOS INTEGRATED CIRCUIT
6. 20/10 pps (Pin 10)
Connecting this pin to GND (pin 6) will select an output pulse rate of 10pps.
Connecting the pin Voo (pin 1) will select an output pulse rate of 20pps.
7. MAKE/BREAK (Pin 11)
The MAKE/BREAK pin controls the MAKE/BREAK ratio of the pulse output. The MAKE/BREAK ratio is controlled
by connection Voo or GND to this pin as shown in the following table.
Input
Voo (Pin 1)
GNO (Pin 6)
Make
Break
I
33.4%
66.6%
40%
60%
8. MUTE OUTPUT (Pin 12)
The mute output is an open-drain N-channel transistor designed to drive external bipolar transis~.
This circuitry is usually used to mute the receiver during outpulsing. As shown in Fig. 2 the KS58C/005 mute
output turns on (pulls to the VGNo-supply) at the beginning of the predigital pause and turns off (goes to an open
circuit) following the last break.
The delay from the end of the last break until the mute output turns off is mute overlap and is specified as tMO'
9. ON·HOOKITEST (Pin 17)
This pin detects the state of the hook switch contact "OFF HOOK" corresponds to Vss condition. "ON HOOK"
corresponds to Voo condition. When outpulsing in this mode, which can be up to 300msec, is completed, the circuit
is deactivated and will require current only necessary to sustain the memory and power-up-clear detect circuitry
(refer to the electrical specifications).
Upon retuning off-hook, a negative transistion on the mute output will insure the speech network is connected
to the line. If the first key entry is either a * or #, the number sequence stored on-chip will be outpulsed. Any other
valid key entries will clear the memory and outpulse the new number sequence.
10. PULSE OUTPUT (Pin 18)
The pulse output is an open drain N-channel transistor designed to drive external bipolar transistor. These transistor
would normaliy be used to pulse the telephone line by disconnecting and connecting the network. The KS58C/005
pulse output is an open circuit during make and pulls to the GNO supply during break.
c8SAMSUNG
Electronics
135
•
KS58E05
PULSE
CMOS INTEGRATED CIRCUIT
DIALER
WITH
1'·D~
REDIAL
The KS58E05 is a monolithic CMOS integrated circuit
which uses an inexpensive RC oscillator for its
frequency reference and provides all the features
required for implementing a pulse dialer with 32 digit
redial.
FUNCTIONS
•
•
•
•
Mute output logic "0"
Pulse output logic "0"
RC oscillation for reference frequency
Designed to operate directly from the telephone
line
• Used CMOS technology for low voltage,
low power operation
FEATURES
• Wide operating voltage range (2.0 6.0V)
• Low power dissipation
• Use either a standard 2 of 7 matrix keyboard with
negative true common or the inexpensive form
A·type keyboard
• Make/Break ratio can be selected
• Redial with * or #
• Continuous MUTE
• Power up clear circuitry on chip
• 10 pps only.
ORDERING INFORMATION
Operating Temperature
-20 - + 70·C
TEST CIRCUIT
GND
PIN CONNECTIONS
voo
1MO
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
1: Voo
2:C
::-~ol'--u-m-n--'1
3: Column 2
4: Column 3
5: GND
6: RC Oscillator
7: RC Oscillator
8: RC Oscillator
9: Make/Break Select
10: Mute Output
11: ROW 4
12: ROW 3
13: ROW 2
14: ROW 1
15: On·HooklTest
16: Pulse Output
060% BREAK
Fig. 1
c8SAMSUNG
Electronics
136
CMOS INTEGRATED CIRCUIT
KS58E05
ABSOLUTE MAXIMUM RATINGS (Ta
=25°C)
Characteristic
Symbol
Value
Unit
Supply Voltage
Input Voltage
Output Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Voo
V,N
VOUT
Po
' Ta
T51g
6.2
GND-0.3, Voo +0.3
GND-0.3, Voo +0.3
500
-20 -+ 70
-40 -+ 125
V
V
V
mW
·C·
·C
ELECTRICAL CHARACTERISTICS
(Voo = 3.5V, fose = 2.4KHz, Ta = 25°C, unless otherwise specified)
Characteris tic
Symbol
Test Conditions
Min
Typ
Max
Unit
~SUPPIY Voltage
Voo
2.0
6.0
V
~MemOry Re-te--n-t-io-n-V-o-,-ta--g-e----;f---- - - f - - - - - - - - - - - - + - --.--+---+----+-----i
voR
10
V
Input High Voltage
V,H
f---------------l-----
Input Low Voltage
V'l
_
_
_
-
R1 - R4 , C1 - C4 , HS, MIS
O.SVoo
Voo
V
GND
O.2Voo
V
---------+---+-------------4----+--4----+-~
~a-t-in-g-C--ur-ffi-n-t-------~-'-o-o-~A-"-0-u-t-pu-t-u-n__d_e_r_n_o_'_oa_d_ _ _+ ___~-1-0-0-+-1-5-0-~~-A~
Output Leakage Current
10l
Vee = 6.0V, MUTE, PULSE = 6.0V
101
Vo =O.4V, Voo·=2.5V
0.5
1.5
mA
102
Vo=0.4V, Voo =3.5V
1.7
5.0
mA
0.001
1
p,A
O~p~CuITe~(MUT~PULS~ f----~------------+_--~--~---~~
Oscillator Frequency
fose
Valid Key Entry Time
TKO
14
On Hook Time Required to
Clear Memory
TOH
300
2.4
Inter Digital Pause
Frequency Stability
Tone Output Frequency
.6f
fTONE
Voo = 2.0 - 6.0V
KHz
20
mS
mS
sao
mS
±10
%
1.2
KHz
FUNCTION DESCRIPTION
1. "ON·HOOK" MODE
When "ON-HOOK," key inputs will not be recognized because the oscillator is disabled which prevents the
circuit from drawing excessive current.
2. "DIAL" MODE
When "OFF-HOOK," the device senses key down condition by detecting one key input and enters the key's
code into at on-chip memory.
The memory can be store up to 32 digits, and it allows key strobes to be entered at rates comparable to tone
dialing telephone. Output pulsing will continue until all entered digits have been dialed. To implement the pulse
dialer function, two outputs, one to pulse the telephone line and one to mute the receiver, are provided.
3. "REDIAL" MODE
The first 32 digits entered will be stored in the on-chip redial memory and can be redialed by pressing either
* or #, provided that the receiver is "ON-HOOK" for minimum ton (on hook time required to clear memory).
4. POWER UP CLEAR
The on-chip "POWER UP CLEAR" circuit reliable operation of the device. If the supply to the circuit is not
sufficient to retain data in the memory, a "POWER UP CLEAR" will help regaining a proper supply level.
This function will prevent the "Redial" or sportaneous outputing of incorrect data.
c8SAMSUNG
Electronics
137
•
KS58E05
CMOS INTEGRATED CIRCUIT
TIMING CHARACTERISTICS
Digit
Key input
Digit
------~~
Redial
~
~.----------------------
Column scan
. ----utnruUl- -3OciH~-----.I1JLILIlf ------------",u-L-11nruulr-----------lIlrLJ1IL-----------~
i'
'/ n
I
Row scan
I
On-Hook input - ,
MUTE output
,
I,
r
I
PULSE output
I!
I•
fH!
I
ff---1.----f
H
,~
.
I
,
I
!
:I
;
UUL---------rr--------t-t+-JUU OS~ o!f UUt"--------------------lm--
'
~~n
4KHz: :
I
;:
:I
110~ r- TDB
OSCoutput
(pin 7)
1r
, \:
'::
I I
Ii!
I
' I
I,
I
iI
i ',
!
II'
TPDP BOOms
TIDP
BOOms
I
I
:
!!
,
TB!
:!
:
I I
nll~nn
r:
::
:
I
=1 ~ I™OI
I
:
i
:
:
:
1/PR
I:
~
Normal dialing
i
;
Redial mode
On hook ~.......- - - - - - - - - - - - - - - - _ _ I
Off hook mode
•
:
~
__
Off hook mode
Test mode
FiQ.2
1. Voo (Pin 1)
This is positive supply pin. The voltage on this pin is measured relative to Pin 6 and is supplied from a 150ILA
current source. This voltage should be regulated to less than 6.0 volts using on external form or regulation.
2. Keyboard inputs (Pin 2, 3, 4, 11, 12, 13, 14)
The KS58E05 incorporates an innovative keyboard scheme that allows either the standard 2-of-7 keyboard with
negative common or the inexpensive single contact (form A) keyboard to be used.
A valied key entry is defined by either a single row being connected to a single column or GND being simultaneously
presented to both a single row and column. When in the on-hook mode, the row and column inputs are held high and no
keyboard inputs are ac"V ss ")
OPERATION MODE INITIAL SWITCHING
SELECT
SELECT MODE ENTRY MODE
I
Voo
Voo
I
Vss
Vss
I
I
-J
Voo
Vss
I
Pulse
IT] Key-In
Tone
N/A
Pulse
Tone
NOTES
MODE SELECT
defines only initial mode
after going Off Hook and is
latched at first key entry.
I
MODE SELECT IT] key is disabled under
this condition.
input Vss
=
N/A
If choice of switching method is desired (either [f] key or MODE SELECT).
Operation select should be connected to MODE SELECT in order to avoid false
operation.
9
OSCIN
10
OSC OUT
11
Voo
12
Vss
Oscillator Input/Output
These pins are provided to connect an external 3.58MHz crystal. Oscillator starts
(at Off Hook) and is sustained until pulse or DTMF signal are finished.
--
Power
These are the power supply inputs. The device is designed to be operated on 2,QV
to 5.5V.
c8SAMSUNG
Electronics
163
•
'KS5819
CMOS INTEGRATED CIRCUIT
PIN DESCRIPTION
(Continued)
Pin
Name
Description
13
KEY IN TONE
Key In Tone Output
•
Key in tone signal is provided only in pulse mode for all Key-ins except [IJ
key-in. No KEY IN TONE is generated in DTMF mode. Fkt: 1.75KHz, Tkt: 23mS.
(N channel open drain)
14
OPERATION
SELECT
Operation Select Input
Mode switching (from Pulse to DTMF) entry is selectable with this input, i.e.
key entry or MODE SELECT input entry is selectable.
whether
15
TONE OUT
DTMF Signal Output
When a valid keypress is detected in DTMF mode appropriate low and high
group frequencies are generated which hybrided the Dual Tone Output.
Tone out is Off State in pulse mode.
16
X'MIT MUTE
III
X'mit Mute Output
HS
X'mit Mute Output
Voo
"ON"
Vss
Normally "OFF"
"ON" during pulse and DTMF dialing
(N channel open drain)
17
MUTE
Mute Output
HS
MUTE OUTPUT
Voo
"ON"
Vss
Normally "OFF" in DTMF mode.
"ON" during pulse dialing
(N channel open drain)
18
DP,DP
Dial Pulse Out. DP: CID, DP: AlB
DP: The normal output will be "OFF" during break and "ON" during make at
"OFF HOOK."
The output will be "ON" at "ON HOOK,"
DP: The normal output will be "ON" during break and "OFF" during make at
"OFF HOOK."
The output will be "OFF" at "ON HOOK."
c8SAMSUNG
Electronics
164
KS5819
CMOS INTEGRATED CIRCUIT
KEYBOARD OPERATION
1. SINGLE MODE OPERATION
• Pulse Mode Operation
Off Hook
I G···B
Pulse mode is defined by the initial mode after going Off Hook and latched at
under Mode Select = Voo.
ru
key entry. This is the condition
• Tone Mode Operation
Off Hook
I B .. ·B
Tone mode is defined by the initial mode after going Off Hook and latched at [Q] key entry. This condition is under
Mode Select:: Vss.
Off Hook
IGB···8
If initial mode is at pulse mode after going Off Hook and Mode Select - Voo , Operation Select = VOD. Switching
mode from pulse to tone can be done by ITl key entry and latched at [Q] key entry.
• Manual Dialing with Automatic Access Pause
BG8B···B
Multiple Pause key entries can be accepted and stored in the redial memory, each as a digit. Each IE! key provides
3.5 seconds pause time, but [pJ key entry as first digit after going Off Hook is ignored. 0 key can also be used
as pause key in pulse mode. Pause (s) can be cancelled with [EJ, ITJ or !BQ] key during pause time in redialing.
[Q] = Any numeric key.
• Redialing
I
Off Hook
I EJ
Up to 32 digits can be dialed with M key. lBQl key is disabled while pulse or DTMF signals are transmitted.
When more then 32 digits are stored, redial is also inhibited.
00 key can be used as [fiQ] key in pulse mode.
• Inhibiting Redial
Off Hook
I El .. 8 8 EJ
Redial can be inhibited by depressing IBQ] IB.QI keys after DTMF or pulse signals are transmitted.
c8SAMSUNG
Electronics
165
I
CMOS INTEGRATED CIRCUIT
KS5819
2. PULSEITONE SWITCHABLE OPERATION
• Mode Switching by MODE SELECT Input (OPERATION SELECT = Vss)
Off Hook
18··· EJ c:::J
f---
Switching MODE SELECT to V,.
Pulse M o d e - - - - - - - - - - - - !
B· ··1
~ OTMF
Dn+m
1
MOde--i
Pulse mode is initially defined MODE SELECT = Voo , mode switching to OTM F can be accepted by MODE
SELECT = Vss , OTMF mode will be set up after pulse mode is finished. In this mode, digits IOn + II ... IOn + ml are
transmitted from Tone Out as OTMF signals by depressing corresponded keys.
If no lEI key is contained serially before or after mode switching, following condition is obtained.
L--0_ff_H_O_O_k----l1
G···G
Switching MODE SELECT to V"
EJ··
·1 Dn+m 1
~OTMF MOde--i
f-I------pulse Mode
(On, On + I =1= Pause)
If digit IOn + 11 is depressed after pulse mode is finished, OTMF mode will be set up after last pulse signal ([QDl)
is generated. In this mode, digits IOn + 11 ... IOn + m\ are transmitted from Tone Out as DTMF signals by depressing
corresponded keys. If digit IOn + 11 is depressed during dialing pulse signals, OTMF mode but in Hold State will
be set up after last pulse signal \QnJ is finished. MODE OUT will flash to indicate this Hold State IDn + 11 ... IOn + ml
are stored in redial memory as OTMF data and not transmitted from Tone Out. When it is ready to transmit OTMF
data in redial memory, [TI, [BQ] or IE] keys is depressed to reset this Hold State and IOn + 11 ... IOn + ml data are
serially transmitted.
• Mode Switching by
Of/Hook
ill key (OPERATION
SELECT = V oo)
1[~J··B [j 8
I
Pulse Mode
E~J··B
I ~ Tone MOde----l
Pulse mode is initially defined with MODE SELECT = Voo. Mode switching to DTMF can be accepted by IT] key.
In DTMF mode, digits IOn + 11 ... IOn + ml are transmitted from Tone Out as DTMF signals by depressing corresponding
key. If no (PJ key is contained serially before or after IT! key.
Off Hook
18· .. 8 GJ
r---Pulse Mode---j
B···lon+ml
(Dn'Dn+l{~}
f---Tone MOde---i
It results the next condition:
If digit IDn + 1] is depressed after pulse mode is finished DTMF mode will be set up after last pulse signal [Q6} is out.
In this mode, digits IOn + 11 ... IOn + ml are transmitted from TONE OUT as DTMF signals by depreSSing corresponded.
key
c8SAMSUNG
Electronics
166
CMOS INTEGRATED CIRCUIT
KS5819
If digit IOn + 11 is depressed during dialing pulse signal, the Hold State will be set up after last pulse Signal [QDl
is finished. When DTMF MOOE is set up. MODE OUT will flash to indicate this Hold State.
Digits IDn + 11 ... IDn + ml are stored in redial memory as DTMF data and not transmitted from Tone Out.
When it is ready to transmit DTMF data in redial memory, CD, IffQ] or [EJ keys is depressed to reset this Hold State
and IDn + 11 ... IDn + ml data are serially transmitted .
• Redial with Hold State Cancell
I
I 8 GJ G, G
Off Hook
(or
key)
Pause can be cancelled with !el, ITl or IB.QI keys in redialing. Any pause in series corresponding with pause is
also cancelled. When no pause is stored before or after mode switching, chip will go into the Hold State when
DTMF mode is set up. MODE OUT will flash to indicate this Hold State. OTMF data are stored in redial memory
and not transmitted from tone out.
[I], [EQI or [E] keys is depressed to reset this Hold State and OTMF data are serially transmitted.
Single Tone Operation in DTMF Mode (Test mode)
1. The MIS pin is used to trig the chip into test made by applying a positive or negative pulse after "Off Hook."
Test mode is sustained until On Hook. The single tone is shown in the following table which contrast with normal
mode.
Normal mode
Single tone mode
R1
1
2
3
R1
R1
C2
C3
R2
4
5
6
R2
C1
C2
R2
R3
7
8
9
R3
R3
C2
C3
R4
*
0
#
R4
C1
R4
C3
C1
C2
C3
C1
C2
C3
2. Single tone can be generated by simultaneously depressing two digit keys in the appropriate Rowand Column.
If two digit keys, not in the same Row or Column, the dual tone disabled and no output is provided.
c8SAMSUNG
Electronics
167
I
KS5819
CMOS INTEGRATED CIRCUIT
TONE MODE TIMING
AS
(MODE SELECT = Vss)
_ __
I'---:--:---_ _-----'r~
--iD~
~r-----mmlllill
KEY INPUT
3
I
~~
n
KEY TONE
t""\
~
"""
-.::;j TITP b -i~~utTONE OUT _ _ _ _ _ J
L____ J
L____ J L_-1\-__ J "L _JL_JL ______ _
V
X'MITMUTE~~rfI------
OSC -------II------a-----._------11111111111111111111111111111IIIIIIIIIIIIIIIIII~------MUTE~
U
MODEOUT~
r1~
110mS
___________________
110mS
D: Debouncing time: 25mS
TITP:
Tout:
PULSE MODE TIMING
(MODE SELECT = V oo)
~~-------------------------------------------------KEY INPUT ---rrrmm
~
--1iJ=
,-----------------------------------
3
KEYTONE----~~---___~---------------------------------=ll=TKT
1m
UUUUi-----TIOp~1
DP
X'MITMUTE
flJlJ--ulf----TloP-----t!
----i--l B~ -i Mf-~"------
UUU
nnn"------
_ _ _ _ _ _ _ _ _ _ _..J
~~~-----------------------~
OSC------~IIIIIIIIII""t------Fosc=3.579545MHZ------ilijll"III"11~--------
879mS 1.75KHz
D (Debouncing Time): 25mS TKT: 23mS
TIDP:
fKT:
c8SAMSUNG
Electronics
168
KS5819
CMOS INTEGRATED CIRCUIT
TIMING DIAGRAM
(for Switching Mode Operation by IT] key) (OPERATION SELECT, MODE SELECT
KEY INPUT
= =voo)
----1m!
MODEOUT--------------------------------------~
BP---LfLJ
Uf----TAP-----"I
TOUT
1'"LJ~LJ~
L--
--!-II
TONE OUT - - - - - - - -_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
:H
___
X'MIT MUTE
MUTE
OSC
TIDP
I-
r"l'---_ _ _ _ _ _ _ _ _ _ _ _...JFTMOP=i
--.J L
-
~L.....-
_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _----I
-------1""""111111111------
FOSC 3.579545MHz
------IlIllllllllwlllllllllt----
TIMING DIAGRAM
(for Switching Mode Operation by MODE SELECT Input) (OPERATION SELECT = Vss)
KEYINPUT--------~
Switching MS = Vss
MODEOUT-----------------------------------~
I
5P---UU
UUU=TAP~
I
1
i"L.r'LrI
TONE OUT ------------------------------------:.1i
i . . . -_ _
I
X'MIT MUTE . - n 1 - -_ _ _ _ _ _ _ _ _ _ _----J"--T-MO-Pi.._ _ _ _...1
MUTE.-n~--------------...J
MODE SELECT - - - - - - - - - - - - - - - - - - - - - - ,
. OSC
------illlllllllllllll.--1----FOSC=3.579MHZ---~lllIlIIIlllIlllr----TAP: 3.5sec
c8SAMSUNG
Electronics
169
•
KS5820
CMOS INTEGRATED CIRCUIT
TONE/PULSE DIALER WITH REDIAL
16 DIP
The KS5820 is a DTMF/PULSE switchable dialer with a 32-digit redial
memory. Through pin selection, switching from pulse to DTMF mode
can be done using slide switch. All necessary dual-tone frequencies are
derived from a 3.579545MHz TV crystal, providing very high accuracy
and stability. The required sinusoidal wave form for each individual tone
is digitally synthesized on the chip. The wave form so generated has
very low total harmonic distortion (7% Max). A voltage reference is
generated on the chip which is stable over the operating voltage and
temperature range and regulates the single levels of the dual tone to
meet telephone industry specifications. CMOS technology is applied
to this device, for very low power requirements high noise immunity,
and easy interface to a variety of telephones requiring external
components.
._--------
ORDERING INFORMATION
FEATURES
• Tone/Pulse switchable (slide switch).
• 32 digit capacity for redial
• Automatic mix redialing (last number dial) of
PULSE-+DTMF with multiple auto access pause
• PABX auto.pause for 3.5 sec.
• 4 x 4 or (2 of 8) keyboard available
• Low power CMOS process (2.0 to 5.5V)
• Numbers dialed manually after redial are cascadable
and stored as additional numbers for next redialing
• Uses inexpensive TV crystal (3.579545MHz)
• Make/Break ratio (33 1/3 -66213 or 40/60) pin selectable
• Touch key hooking (604ms)
• Low standby current
PIN CONFIGURATION
Device
Dial
Pulse
PPS
KS58A20N
DP
10
DP
20
V00: 33.3/66.6
Vss: 40/60
1--_.-
KS58B20N
-
KS58C20N
KS58D20N
DP
10
DP
20
Voo: 33.3/66.6
Vss: 40/60
,--
Voo: 33.3/16.6
Vss: 40/60
Voo: 33.3166.6
Vss: 40/60
ARRANGEMENT OF KEYBOARD
CiJ00
o
KS5820
Make/Break Ratio
W
t-R1
[~JEJ
~000
~00~
I
C1
I
C2
I
C3
-R2
-R3
-R4
I
C4
[BEl : HOOKING (604ms)
[EJ : PAUSE (3.5
(@] : REDIAL
c8SAMSUNG
Electronics
second)
170
KS5820
CMOS INTEGRATED CIRCUIT
BLOCK DIAGRAM
HS
MIS
MODE SEL
R1
R2
X'MIT MUTE
R3
R4
KEYBOARD J - - - - - - 4
LOGIC
C1
OUTPUT
LOGIC
REDIAL
MEMORY
32 DIGIT
i5P
C2
I
(DP)
C3
C4
Voo
DTMF
GENERATOR
OSC
I 1
OSC IN
TONE OUT
OSC OUT
TONE DURATION & PAUSE IN
REDIAL
TONE FREQUENCIES
Input
Specified
Actual
% Error
Symbol
Typ
Unit
R1
697
699.1
+0.31
Tone Duration
To
110
mS
R2
770
766.2
-0.49
Minimum Pause
ITP
110
mS
R3
852
847.4
-0.54
Cycle Time
Tc
220
mS
Characteristic
c8SAMSUNG
Electronics
R4
941
948.0
+0.74
C1
1209
1215.7
+0.57
C2
1336
1331.7
-0.32
C3
1477
1471.9
-0.35
171
KS5820
CMOS INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristics
(Ta=25°C)
Symbol
Value
Unit
V
Supply Voltage
Voo
6.0
Input Voltage
VIN
Vss-0.3, Voo +0.3
Output Voltage
VOUT
Vss - 0.3, Voo+0.3
Output Voltage
VOUT
Tone Output Current
V
~ Voo,(DP, X'MITMUTE)
hONE
V
50
mA
mW
Power Dissipation
Po
500
Operating Temperature
Topr
-20 -+ 70
Storage Temperature
TSl9
-40 -+125
°C
ELECTRICAL CHARACTERISTICS
(Vss = OV, Voo = 3.5V, tx'tal = 3.579545MHz, Ta = 25°C, unless otherwise noted)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Operating Voltage
Range
VooP
Pulse Mode
All inputs connected
2.0
5.5
VooT
Tone Mode
to Voo or Vss
2.0
5.5
Memory Retention Voltage
VOR
looP
MODE = Voo
looT
MODE = Vss
One key selected
HS = Vss. All outputs
unloaded
Iso 1
HS = Voo = 1.5V
Is02
-HS=Vss
Operating Supply Current
Standby Current
Output Current
IOl1
IOl2
Input Voltage
Input Current
No key selected.
All outputs
unloaded
DP.I VOl=0.4V I V,,=3.5V
I Voo=2.5V
X'MIT MUTE
0.05
p,A
50
1.7
5.0
0.5
1.5
mA
Voo
Vss
0.2Voo
hN1
Voo = 3.5V VIN = OV
hN2
Voo:::: 2.5V VIN = OV
Tap
Tone Output Delay Time
mA
O.BVoo
Auto Access Pause Time
Distortion
1.0
MODE SELECT
Fer
Ratio of Column to Row Tone
0.5
0.5
R1-R4. C1-C3. HS. MIB
Tkd
Tone Output
0.3
Vil
Valid Key Entry Time
Vo•
I
I
25.3
ONLY
I
I
-16.0
-12.0
Voo=3.5V Rl =5K
-14.0
-11.0
Voo = 3.5V
1.0
2.0
1.5
mS
sec
Voo = 2.5V Rl :::: 5K
%DIS
p,A
Hz
3.5
ROW TONE
V
50
437
Voo =3.5V
c8SAMSUNG
Electronics
116
R1-R4
23
dBer
T psd
V
1.0
VIH
Column and Row
Scanning Frequency
Unit
dBV
3.0
dB
7
%
mS
172
KS5820
CMOS INTEGRATED CIRCUIT
PIN DESCRIPTION
Pin
~Name
Description
1-4
15-18
R1-R4
C1-C4
Keyboard (R1, R2, R3, R4, C1, C2, C3, C4)
These inputs can be interfaced to an XY matrix keyboard.
C1·C4 & R1-R4 are set to low at On Hook (HS high). C1-C4 key inputs are set
to low and R1-R4 are set to high at OFF HOOK (HS low) which enables the keyinput operation. Oscillator starts running when a keypress is detected. Scanning
signals are presented at both column and row inputs (TYP: 437Hz) until the
input key is released. Key inputs are compatible with standard 2-of-8 form or
single-contact keyboard. Debouncing is provided to avoid false entry (TYP: 25mS) .
=
=
5
HS
Hook Switch
This input detects the state of the hook switch contact. "Off Hook"
corresponds to Vss condition. "On Hook" corresponds to Voo condition.
6
M/B
Make/Break Ratio
This input provides the selection of the Make/Break ratio (33.3: 66.6/40:60)
when M/B is connected to VoolV ss .
7
MODE SELECT
Mode Select Input
Pulse/DTMF mode is selected as shown in the following table.
Initial Mode means the state after going Off Hook (HS->"Vss ")
MODE
SELECT
INITIAL
MODE
SWITCHING
ENTRY MODE
Voo
Pulse
MODE SELECT
Input Vss
Vss
Tone
N/A
=
8-9
OSCIN
OSC OUT
Oscillator Input/Output
These pins are provided to connect an external 3.58MHz crystal. Oscillator
starts (at Off Hook) and is sustained until pulse or DTMF signals are finished.
10-11
Voo , Vss
Power
These are 'the power supply inputs. The device is designed to be operated on
2.0V to 5.5V.
12
TONE OUT
DTM F Signal Output
When a valid keypress is detected in DTMF mode appropriate low and high
group frequencies are gen~ra:ted which hybrided the Dual Tone Output.
Tone out is Off State in pulse mode.
13
X'MIT MUTE
X'mit Mute Output
X'mit Mute Output
, HS
"ON"
Voo
Vss
Normally "OF.F"
. "ON" during pulse and DTMF dialing
(N channel open drain)
14
DP, DP
Dial Pulse Out
DP: The normal output
"OFF HOOK." The
DP: The normal output
"OFF HOOK." The
c8SAMSUNG
Electronics
will be
output
will be
output
"OFF" during break and "ON" during make at
will be "ON" at "ON HOOK,"
"ON" during break and "OFF" during make at
will be "OFF" at "ON HOOK."
173
•
KS5820
CMOS INTEGRATED CIRCUIT
KEYBOARD OPERATION
1. SINGLE MODE OPERATION
• PUlse Mode Operation
I
OffH09k
i 8···8
Pulse mode is defined by the initial mode after going Off Hook and latched at [Q1] key entry. This is the condition
under Mode Select = Voo.
• Tone Mode Operation
I
Off Hook
I
B···8
Tone mode is defined by the initial mode after going Off Hook and latched at
Mode Select V55.
=
IQI) key entry. This condition is under
• Manual Dialing with Automatic Access Pause
i
Off Hook
i G G B···8
Multiple Pause key entries can be accepted and stored in the redial memory, each as a digit. Each [E1 key provides
3.5 seconds pause time, but lEl key entry as first digit after going Off Hook is ignored. El key can also be used
as pause key in pulse mode. Pause (s) can be cancelled with I.E], or IBQ] key during pause time in redialing.
[QJ = Any numeric key.
• Redialing
I
Off Hook
iB
Up to 32 digits can be dialed with IBQl key. IBQ] key is disabled while pulse or DTMF signals are transmitted.
When more then 32 digits are stored, redial is also inhibited.
[£] key can be used as [BQ] key in pulse mode.
• Inhibiting Redial
I
Off Hook
i B···B B B
Redial can be inhibited by depressing IBQ] [BQl keys after DTMF or pulse signals are transmitted.
c8SAMSUNG
Electronics
174
CMOS INTEGRATED CIRCUIT
KS5820
2. PULSE/TONE SWITCHABLE OPERATION
• Mode Switching by MODE SELECT Input
L--_O_ff_H_O_O_k--l1
B··· BG
Switching MODE SELECT to V,.
r l- - - - - -
EJ··· EJ
r---
Pulse Mode
OTMF MOde----!
Pulse mode is initially defined MOOE SELECT = Voo , mode switching to OTMF can be accepted by ~
SELECT = Vss , OTMF mode will be set up after pulse mode is finished. In this mode, digits IOn + 11 ... lQrLt!!!J are
transmitted from Tone Out as OTMF Signals by depressing corresponded keys.
If no [EJ key is contained serially before or after mode switching, following condition is obtained.
Off Hook
lB··· B
Switching MODE SELECT to V,.
~-----Pulse
B··· B
~OTMF
Mode
Mode----i
(On + 1 :;:. Pause)
If digit IOn + 11 is depressed after pulse mode is finished, OTMF mode will be set up after last pulse signal ([Q!])
is generated. In this m~de, digits [Qfril ... IOn + ml are transmitted from Tone Out as OTMF signals by depressing
corresponded keys. If digit IOn + 11 is depressed during dialing pulse signals. When OTMF mode is set up Hold
State will be set up after last pulse signal [Qill is finished. MOOE OUT will flash to indicate this Hold State
IOn + 11 '" IOn + ml are stored in redial memory as OTMF OATA and not transmitted from Tone Out. When it is
ready to transmit OTMF data in redial memory, [BQ] or [E] keys is depressed to reset this Hold Stale and
IOn + 11 '" IOn + ml data are serially transmitted.
Single Tone Operation in DTMF Mode (Test mode)
1. The MIS pin is used to trig the chip into test made by applying a positive or negative pulse after "Off Hook."
Test mode is sustained until On Hook. The single tone is shown in the following table which contrast with normal
mode.
Normal mode
Single tone mode
R1
1
2
3
R1
R1
C2
C3
R2
4
5
6
R2
C1
C2
R2
R3
7
8
9
R3
R3
C2
C3
*
0
#
R4
C1
R4
C3
C1
C2
C3
C1
C2
C3
R4
2. Single tone can be generated by simultaneously depressing two digit keys in the appropriate Rowand Column.
If two digit keys, not in the same Row or Column, the dual tone disabled and no output is provided.
c8SAMSUNG
Electronics
175
•
CMOS INTEGRATED· CIRCUIT
KS5820
TONE MODE TIMING
(MODE SELECT=V ss)
~l~________~r~
_______
r Iml lil
__ M
~
TONEOUT----1L---n-----rt--.l\.---"---rL--n--r'L.
KEY INPUT
=Ji71
mll!I"
I
3
11111 •
l
Rolr---
- -
~
X'MITaUT
ase - - - - _ - - - - _ _ _
1TP:
D: Debouncing Time: 25mS
T
110mS
PULSE MODE TIMING
-----_--------~IIIIIIIIIIII!I
r-
IIIlllllllllllr--
Tout: 110mS
(MODE SELECT=V oo)
~~~--------------------------------------------------------l Dr--
KEY INPUT----,U'm!'lTl!l
4
~~---------------------------------------
T'''~: LJUlJ
i"-utFm::=====_TID_P__..I.-nJlJl'"---__
DP-HLfl-IlJ
DP _ _
X'MlTMUTE~~------------------------------------------~
asc -----11111111111111---1- - - Fase=3.579545MHZ-----lIIIIIIIII~------D: Debouncing Time: 25mS
T1op: Inter Digit Pause: 879mS
c8SAMSUNG
Electronics
176
CMOS INTEGRATED CIRCUIT
KS5820
TIMING DIAGRAM
(for Switching Mode Operation by MODE SELECT Input)
KEY INPUT --.........,.,;
P
5P--LfU
Switching
MS =Vss
LJlJ1J==TAP~
l1f1f1==r,,=
D P _ I U l_ _ _ _ _
~~I..-.----
TONE OUT
11, - - - - - - - - - - . . . . . . .f"=TMOP=i......- - _.......
X'MIT MUTE----.J
MODE SELECT
oSC------11111111111IE--FOSC=3.579545MHZ-----iIlIIIIII~------TAP: Auto Pause Time 3.5sec
c8~SUNG
177
•
CMOS INTEGRATED CIRCUIT
KS5822
10 MEMORY TONE!
PULSE REPERTORY DIALER
The KS5822, a CMOS digital LSI, is a 10 number by 16
digit tone/pulse switchable dialer, with 32 digit redial
memory. Through pin selection, switching from pulse
to tone mode, 10 or 20pps and make/break ratio can be
done.
1
22 DIP: 400 mil width
FEATURES
• 32 digit redial memory with buffer
• 10 No x 16 digit repertory memory
• Tone/Pulse switch able via slide switch with
multiple auto access pause (3.5 sec)
• Uses inexpensive TV crystal (3.579545MHz)
• Make/Break ratio pin selectalJle (1/2, 2/3)
• Dialing pulse rate pin selectable 10pps/20pps
• Two key single tone operation
• Redial memory cascadable with normal dialing
• Fully debounced 4 x 4 keyboard
• low voltage operating: 2.0 - S.SV
• low standby current
• Includes power on reset function
• Minimum tone duration: 110mS
• Minimum interdigit tone pause time: 110mS
PIN CONFIGURATION
•
ORDERING INFORMATION
Device
Package
Operating Temperature
KS5822N
300 mil Width
KS5822E
400 mil Width
-20 -
+ 70°C
ARRANGEMENT OF KEYBOARD
1
2
3
ST
4
5
6
R/L
7
8
9
P
...
0
#
RD
ST : Store
R/L: Recall/Location
P
: Pause
RD: Redial
KS5822
c8SAMSUNG
Electronics
178
CMOS INTEGRATED CIRCUIT
KS5822
PIN DESCRIPTION
Description
Pin
Name
1-4
19-22
R1-R4
C1-C4
S
HS
Hook Switch Input.
Voo = On Hook, Vss = Off Hook
6
M/B
Make/Break Ratio Select.
V00 = 1:2 (M/B), Vss = 2:3 (M/B)
7
DRS
Dial Pulse Ratio Select
Voo = 20pps, Vss = 10pps
8
MDS
Mode Select.
Voo = Pulse mode, Vss = Tone mode
9
OSC IN
10
OSC OUT
11
Voo
12
Vss
13
KT
14
OHI
15
TONE
16
XMUTE
17
MUTE
18
DP
c8SAMSUNG
Electronics
Keyboard Input
These inputs can be interfaced to an XV matrix keyboard.
I
Oscillator InputlOutput
Power.
This device is designed to operate on 2.0V to 5.5V
Key In Tone Output.(ln Pulse & Tone Mode)
fKT = 1. 785KHz, tKT = 36.6mS
On Hook Store Inhibitive Input.
Voo = Store available, Vss = Inhibitive store function
DTMF Signal Output
XMUTE Output.
This is a N-channel open drain output.
Operating pulse and tone mode.
MUTE Output.
Operating only pulse mode.
Dial Pulse Output.
(N-chnanel open drain)
179
CMOS INTEGRATED CIRCUIT
KS5822
BLOCK DIAGRAM
OSCI
PULSE
COUNTER
OSCO
M/S
1----_----+------1
DRS~----1_--------~--------~
MDS
WRITE/READ
ADDRESS
COUNTER
TONE
Voo
TONE FREQUENCIES
TONE DURATION & PAUSE
Characteristic
Symbol
Typ
Unit
Input
Specified
Actual
% Error
Tone Duration
To
110
mS
R1
697
699.1
Minimum Pause
hp
110
mS
R2
770
766.2
-0.49
R3
852
847.4
-0.54
R4
941
948.0
+0.74
C1
1,209
1,215.9
+0.57
C2
1,336
1,331.7
+0.32
C3
1,477
1,471.8
-0.35
c8 !!e!'ISUNG
+0.31
180
CMOS INTEGRATED CIRCUIT
KS5822
ABSOLUTE MAXIMUM RATINGS
(Ta=2S°C)
Characteristics
Symbol
Value
Unit
Supply Voltage
Input Voltage
Output Voltage
Operating Temperature
Storage Temperature
Power Dissipation
Voo
VIN
VOUT
Ta
Tstg
Po
-0.3-6.0
-0.3 -Voo + 0.3
-0.3 -V oo + 0.3
-20 - + 70
-SS-+150
SOO
V
V
V
°C
°C
mW
I
ELECTRICAL CHARACTERISTICS
(Voo= 3.SV, Vss=OV, fosc =3.S79S4SMHz, Ta=2SoC, unless otherwise noted)
Characteristic
Operating Voltage
Memory Retention Voltage
Operating Supply Current
Standby Current
Output Sink Current
(DP, XMUTE, MUTE)
Key In Tone Current
- - _.Input Voltage (R1-R4, C1-C4,
HS, MOS, M/B, DRS)
Input Current
(R1-R4, C1-C4)
Row Tone Level
Symbol
Test Conditions
Min
Voo
2.0
Vr
1.0
loop
Typ
Tone Mode, all outputs unloaded
ID01
Hs = Voo = 1.0V, all outputs unloaded
ID02
Hs = V ss , all outputs unloaded
lou
VOL = O.4V
1.7
Unit
S.S
V
O.S
mA
V
Pulse Mode, all outputs unloaded
lOOT
Max
1.0
mA
0.03
O.OS
p.A
30
SO
p.A
5.0
mA
mA
IOL2
VoL =0.4V, Voo=2.SV
O.S
1.S
IOHK
VOH = 0.4V
1.7
5.0
mA
IOHL
VoL =3.0V
1.8
S.2
mA
VIH
0.8Voo
Voo
V
VIL
Vss
0.2Voo
V
ItH
VIN =Vss
116
p.A
IlL
VIN = Vss , Voo = 2.SV
SO
p.A
VTH
Voo = 3.SV, RL = SKn
-14
-11
VTL
Voo = 2.SV, RL = SKn
-16
-12
Ratio of Column to Row Tone
dBcr
Distortion
THO
1
2
Valid Key Entry Time
TKO
9.1
Pause Time
tpa
3.51
3
dBV
dB
7
%
19.1
mS
sec
I
c8SAMSUNG
Electronics
181
KS5822
CMOS INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS
Characteristic
Pulse Interdigit Pause Time
Symbol
(Continued)
Test Conditions
tIDP1
DRS
t lDP2
DRS
Min
=Vss , 10pps
=VDD , 20pps
Typ
805.6
402.8
Max
Unit
mS
Tone Interdigit Pause Time
tlDT
109.8
Minimum Tone Duration
trD
109.8
mS
Minimum Key In Tone Duration
tKT
36.6
mS
Key In Tone Frequency
fKT
Make/Break Time
Make/Break Time
mS
1.785
KHz
mS
DRS
=Vss, M/B =VDD , 10pps
34.33
68.66
DRS
=Vss , M/B =Vss, 10pps
41.19
61.79
mS
DRS
=VDD , M/B =VDD , 20pps
17.17
34.33
mS
DRS
=VDD , M/B =Vss , 20pps
20.60
30.90
mS
t M/S
t M/S
KEY DESCRIPTION
• 1, 2, 3, 4, 5, 6, 7, 8, 9, 0 KEYS
These are Tone/Pulse dialing signal keys in normal state but their entry right after store mode or recall mode
provides store memory location.
• *, # KEYS
These are served as dialing signal at tone mode. But during pulse mode
* key modulates pause and # key redials.
• PAUSE KEY
Pause key is stored in RAM as a digit and while"this digit is processed no dialing can be operated. During the
pause time (3.51 sec) no output is generated.
• REDIAL KEY
The redial key is valid only when it is pressed as the 1st key after OFF·HOOK operation.
• RECALL/LOCATION KEY
Location or recall number selection is enabled by detecting R/L key input.
• STORE KEY
If the ST key is allowed when the dialer is set to the corresponding condition, pressing the ST key will change
the dialer into the ST mode.
The ST mode is released after the memory transfer operation is executed. This pin is a master control key. The
dialing sequence will be interrupted when the key is activated.
c8~SUNG
182
KS5822
CMOS INTEGRATED CIRCUIT
OPERATION OF TONE/PULSE
• SYMBOL DEFINITION
TIp
= Tone Mode tIP = Pulse
Op
Ot
Om
RII
Mode
= Pulse Data: 1, 2, 3, 4, 5, 6, 7, 8, 9, 0 Keys
= Tone Data: 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #
= Memory Location
= RIL Key for Recalling
= RIL Key for Location
rlL
RD
= Redial Key
= Pause Key
P
ST
= Store Key
Cony = Conversation Mode
I
• NORMAL DIALING IN PULSE MODE
Oft Hook, tIP; Dp1, Op2, ...... Dpn; Cony; On Hook
• NORMAL DIALING IN TONE MODE
Off Hook, TIp; Dt 1, Oh, ...... Dtn; Cony; On Hook
• NORMAL DIALING IN PULSE TO TONE MODE
Off Hook, tIP; Op1, Op2, ...... Dpn; TIp; Dt" Dt 2, ...... Dtn; Cony; On Hook
• REDIALING
Off Hook; RO; Cony; On Hook
Note: More than 33 digit in redial memory inhibits redial function and RD input after Off Hook is ignored.
• STORING A NUMBER FOR PULSE MODE
1) OH'= Low
Off Hook, tIP; ST; Dp1, Dp2, ...... Dpn; r/L; Dm; On Hook
(Return to Normal Mode)
2) OHI= High
On Hook, tIP; ST; Dp" Dp2, ...... Dpn; r/L; Dm;
(Return to Normal Mode)
• STORING A NUMBER FOR PULSE·TO·TONE MIXED DIALING
On (Off) Hook (By Condition), tiP; ST; Dp1, Dp2, ...... Dpn; TIp; Dt" Dt 2 ,
(Return to Normal Mode)
••••••
Dtn; r/L; Om; On Hook
• STORING A NUMBER FOR TONE MODE
On (Off) Hook (By Condition), TIp; ST; Dt 1, Dt2, ...... Dtn; r/L; Om; On Hook (Return to Normal Mode)
Note: The tone data is a one digit in tone mode and the device provides 31 digit redial memory and 15 digit
storing memory in tone mode.
• A NUMBER REPERTORY DIALING
Off Hook; RII; Om; Cony; On Hook
• REPERTORY DIALING FOR CASCADED MEMORIES
Oft Hook; RIl; Dm; ...... ; RIl, Om; Cony; On Hook
Note: If cascade number exceeds 32 digits, the next digit is ignored. The number cannot be redialed by being
truncated.
c8SAMSUNG
Electronics
183
KS5822
CMOS INTEGRATED CIRCUIT
TONE GENERATOR
Single tone generated consists of 14 level and 28 segments. It's column tone output is 2dB pre-emphasized than
row tone output.
TIMING DIAGRAM
PULSE MODE
HS
1~
________________~rl~__________~1
KEY INPUT
OSC
COL SCAN
--(------------------~----~------~>-~
__
.-f1JL. ___ jlJ1JL.------
ROWSCAN-ulrLIU"U--LJ1J----uuu- - - - - - -
MUTE
XMUTE
~
_________
I
~
~
------~
I 'Mw-1"
U
~~
y'----,-.
_____
~r
______________r_
LJLJU
n1..---------
ri rI
tplOP
KEY IN TONE -----1
L-J 1_ _ _ _ _ _ _ _ _ _ _---'
c8SAMSUNG
Electronics
184
KS5822
CMOS INTEGRATED CIRCUIT
TONE MODE
HS
~---------
__________~rl________________
KEYINPUT~
Ot
Dt
OSC
COL SCAN
ROW SCAN
~-----------~>~------~<~----------~>--
-IUL____
lJU----
_ ___ ~
------uu-
XMUTE
--___~I
PULSE TO TONE DIALING
HS
1--------------------------------------MOS
KEY INPUT
1__. . .
COL SCAN
-<~-------------------------------->--JUL________________ JlJUL-__
ROWSCAN
I
MUTE
~---;"I
OSC
n
I'----------------~---
RtDB
rf
!--tPAUSE
XMUTE
I
---j
DP
T O N E O U T P U T - - - - - - - - - - - - - - - - - - - I r L f I.....- - -
c8SAMSUNG
Electronics
185
I
CMOS INTEGRATED CIRCUIT
KS5823
10 MEMORY TONE!
PULSE REPERTORY DIALER
18 DIP
The KS5823 series, a CMOS digital LSI, is a 10 number
by 16 digit tone/pulse switchable dialer, with 32 digit
redial memory. Through pin selection, switching from
pulse to tone mode and make/break ratio can be done.
FEATURES
• 32 digit redial memory with buffer
• 10 No x 16 digit repertory memory
• Tone/Pulse switchable via slide switch with
multiple auto access pause (3.5 sec)
• Uses inexpensive TV crystal (3.579545MHz)
• Make/Break ratio pin selectable (1/2, 213)
• Two key single tone operation
• Redial memory cascadable with normal dialing
• Fully debounced 4 x 4 keyboard
• Low voltage operating: 2.0- 5.5V
• Low standby current
• Includes power on reset function
• Minimum tone duration: 110mS
• Minimum interdigit tone pause time: 110mS
ORDERING INFORMATION
Device
PPS
Storage Mode Operating Temperature
KS58A23N 10pps Off Hook Only
KS58B23N 20pps On/Off Hook
-20 _
KS58C23N 10pps On/Off Hook
+ 70°C
KS58D23N 20pps Off Hook Only
PIN CONFIGURATION
•
KS58A1B/C/D 23
c8SAMSUNG
Electronics
ARRANGEMENT OF KEYBOARD
1
2
3
ST
4
5
6
R/L
7
8
9
P
".
a
#
RD
ST :
R/L:
P :
RD:
Store
Recall/Location
Pause
Redial
186
KS5823
CMOS INTEGRATED CIRCUIT
PIN DESCRIPTION
Pin
Name
1-4
15-18
R1-R4
C1-C4
5
HS
Hook Switch Input.
Voo On Hook, Vss Off Hook
6
M/B
Make/Break Ratio Select.
VDO 1:2 (MIS), Vss 2:3 (M/B)
7
MDS
Mode Select.
Voo Pulse mode, Vss
8
OSCIN
9
OSC OUT
10
Voo
11
Vss
Description
Keyboard Input
These inputs can be interfaced to an XY matrix keyboard.
=
=
12
TONE
13
XMUTE
14
DP
c8SAMSUNG
Electronics
=
•
=
=
=Tone mode
Oscillator InputlOutput
Power.
This device is designed to operate on 2.0V to 5.5V
DTMF Signal Output.
XMUTE Output.
This is a N-channel open drain output.
Dial Pulse Output.
(N-chnanel open drain)
187
KS5823
CMOS INTEGRATED CIRCUIT
BLOCK DIAGRAM
OSCI
OSCO
MDS
Voo
Note: KS58A/C23
KS58B/D23
KS58A/D23
KS58B/C23
Vss
TONE DURATION & PAUSE
Characteristic
Symbol
Typ
DRS = Vss
DRS = Voo
OHI Vss
OHI = Voo
=
TONE FREQUENCIES
Unit
Input
Specified
Actual
% Error
Tone Duration
To
110
mS
R1
697
699.1
+0.31
Minimum Pause
hp
110
mS
R2
770
766.2
-0.49
R3
852
847.4
-0.54
c8~SUNG
R4
941
948.0
+0.74
C1
1,209
1,215.9
+0.57
C2
1,336
1,331.7
+0.32
C3
1,477
1,471.8
-0.35
188
KS5823
CMOS INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
(Ta=25°C)
Characteristics
Symbol
Value
Unit
Supply Voltage
Input Voltage
Output Voltage
Operating Temperature
Storage Temperature
Power Dissipation
Voo
V IN
VOUT
Ta
Tstg
Po
-0.3-6.0
- 0.3 - Voo + 0.3
-0.3 - Voo + 0.3
-20 - + 70
-55 -+150
500
V
V
V
°C
°C
mW
ELECTRICAL CHARACTERISTICS
(Voo = 3.5V, Vss = OV, fosc = 3.579545MHz, Ta = 25°C, unless otherwise noted)
Characteristic
Operating Voltage
Symbol
Standby Current
Min
Voo
2.0
Vr
1.0
Memory Retention Voltage
Operating Supply Current
Test Conditions
loop
Typ
Tone Mode, all outputs unloaded
1001
HS=V oo = 1.0V, all outputs unloaded
Unit
5.5
V
0.5
mA
V
Pulse Mode, all outputs unloaded
lOOT
Max
1.0
mA
0.03
0.05
p.A
30
50
p.A
1002
HS = Vss , all outputs unloaded
Output Sink Current
(DP, XMUTE)
lOll
VOL=0.4V
1.7
5.0
mA
IOL2
VOL =O.4V, Voo=2.5V
0.5
1.5
~mA
Input Voltage (R1-R4, C1-C4,
HS, MDS, M/B)
VIH
0. 8V oo
Voo
V
VIL
Vss
0.2Voo
V
Input Current
(R1-R4, C1-C4)
IIH
VIN =vss
116
p.A
IlL
V IN = Vss , Voo = 2.5V
50
p.A
VTH
Voo = 3.5V, RL = 5KO
-14
-11
VTL
Voo=2.5V, Rl =5KO
-16
-12
Row Tone Level
Ratio of Column to Row Tone
dBcr
Distortion
THO
1
2
Valid Key Entry Time
TKo
9.1
Pause Time
tpa
3.51
c8~SUNG
3
dBV
dB
7
%
19.1
mS
sec
189
•
KS5823
CMOS INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS
Characteristic
Pulse Interdigit Pause Time
(Continued)
Symbol
Min
Test Conditions
Typ
tIDP1
(KS58A/C23)
805.6
tIDP2
(KS58BID23)
402.8
Max
Unit
mS
Tone Interdigit Pause Time
t lOT
109.8
mS
Minimum Tone Duration
ho
109.8
mS
mS
Make/Break Time
Make/Break Time
M/B
=V
KS58A/C23
34.33
68.66
M/B
=Vss, KS58A/C23
41.19
61.79
mS
MIS
=Voo , KS58B/D23
17.17
34.33
mS
M/B
=Vss, KS58BID23
20.60
30.90
mS
DO,
t M/S
t M/S
KEY DESCRIPTION
• 1, 2, 3, 4, 5, 6, 7, 8, 9,0 KEYS
These are Tone/Pulse dialing signal keys in normal state but their entry right after store mode or recall mode
provides store memory location.
• *, # KEYS
These are served as dialing signal at tone mode. But during pulse mode
* key modulates pause and # key redials.
• PAUSE KEY
Pause key is stored in RAM as a digit and while this digit is processed no dialing can be operated. During the
pause time (3.51 sec) no output is generated.
• REDIAL KEY
The redial key is valid only when it is pressed as the 1st key after OFF-HOOK operation.
• RECALL/LOCATION KEY
Location or recall number selection is enabled by detecting R/L key input.
• STORE KEY
If the ST key is allowed when the dialer is set to the corresponding condition, pressing the ST key will change
the dialer into the ST mode.
The ST mode is released after the memory transfer operation is executed. This pin is a master control key. The
dialing sequence will be interrupted when the key is activated.
OPERATION OF TONE/PULSE
• SYMBOL DEFINITION
TIp
Dp
Dt
Dm
RII
= Tone Mode tIP = Pulse Mode
= Pulse Data: 1, 2, 3, 4, 5, 6, 7, 8, 9, 0 Keys
= Tone Data: 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #
= Memory Location
= R/L Key for Recalling
r/L
R/L Key for Location
RD
= Redial Key
P
= Pause Key
ST
= Store Key
Conv
Conversation Mode
=
qsSAMSUNG
Electronics
190
KS5823
CMOS INTEGRATED CIRCUIT
• NORMAL DIALING IN PULSE MODE
Off Hook, tIP; Op1, OP2, ...... Opn; Conv; On Hook
• NORMAL DIALING IN TONE MODE
Off Hook, TIp; Ot1, Ot2, ...... Otn; Conv; On Hook
• NORMAL DIALING IN PULSE TO TONE MODE
Off Hook, tIP; Op1, OP2, ...... Opn; TIp; Ot 1, Ot2, ...... Otn; Conv; On Hook
• REDIALING
Off Hook; RO; Conv; On Hook
Note: More than 33 digit in redial memory inhibits redial function and RO input after Off Hook is ignored.
• STORING A NUMBER FOR PULSE MODE
1) OHI = Low (KS58A1D23)
Off Hook, tIP; ST; Op1, Op2, ...... Opn; r/L; Om; On Hook
(Return to Normal Mode)
2) OHI
= High (KS58B/C23)
On Hook, tiP; ST; Op1, Op2, ...... Opn; r/L; Om;
(Return to Normal Mode)
• STORING A NUMBER FOR PULSE·TO·TONE MIXED DIALING
On (Off) Hook (By Condition), tiP; ST; Op1, Op2, ...... Opn; TIp; Ot 1, Oh, ...... Otn; r/L; Om; On Hook
(Return to. Normal Mode)
• STORING A NUMBER FOR TONE MODE
On (Off) Hook (By Condition), TIp; ST; Ot 1, Ot2, ...... Otn; r/L; Om; On Hook (Return to Normal Mode)
Note: The tone data is a one digit in tone mode and the device provides 31 digit redial memory and 15 digit
storing memory in tone mode.
• A NUMBER REPERTORY DIALING
Off Hook; RIl; Om; Conv; On Hook
• REPERTORY DIALING FOR CASCADED MEMORIES
Off Hook; RIl; Om; ...... ; RIl, Om; Conv; On Hook
Note: If cascade number exceeds 32 digits, the next digit is ignored. The number cannot be redialed by being
truncated.
TONE GENERATOR
Single tone generated consists of 14 level and 28 segments. It's column tone output is 2dB pre-emphasized than
row tone output.
c8SAMSUNG
Electronics
191
I
CMOS INTEGRATED CIRCUIT
KS5823
TIMING DIAGRAM
PULSE MODE
I~
________________~rl~__________~r-
KEYINPUT~
2
1
asc
COLSCAN
ROW SCAN
--<.'-_____________>-<. . ______--"'>-
mL ___ ~ ____ ~
Lfl11JUlJ--UlJ---LflJ1J1j----~__
--'I
L - -_ _ _ _
TONE MODE
I~~~~~~~~
__~rl~______________
KEYINPUT~
Dt
asc
COL SCAN
ROW SCAN
Dt
~-----------~>~------~<-------------"'>--
--_._JUL
Jl.JL____
1Jlr----
----~
----------',
XMUTE
TONEOUTPUT~~'
~~~~~
~~
I
c8~SUNG
192
KS5823
CMOS INTEGRATED CIRCUIT
PULSE TO TONE DIALING
HS
~~------------------------------------
MDS
KEY INPUT - - ,
•
osc
COL SCAN
2
I
-<--------------------------->--
~________________
J1JUL __
ROWSCA~'LnJ----------------~--
DP
IVI_____
TONE ouTPUT _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
c8SAMSUNG
Electronics
193
I
KS5824
CMOS INTERGRATED CIRCUIT
24 DIP
UNIVERSAL ASYNCHRONOUS RECEIVER
AND TRANSMITTER
The KS5824 UART, is a Si-gate CMOS IC which provides the data
formatting and control to interface serial asynchronous data communications between main system and subsystems.
The bus interface of the KS5824 includes select, enable, read/write,
interrupt and bus interface logic to allow data transfer over an 8-bit bidirectional data bus. The parallel data of the bus system is serially,
transmitted and received by the asynchronous data interface, with proper
formatting and error checking. The functional configuration of the UART
is programmed via the data bus during system initialization. A programmable control register provides variable word lengths, clock division
ratios, transmit control, receive control, and interrupt control. For
peripheral or modem operation, three control lines are provided.
Exceeding Low Power dissipation is realized due to adopting CMOS
process.
ORDERING INFORMATION
FEATURES
•
•
•
•
•
•
•
•
•
•
Operating Temperature
Low-power, high-speed, CMOS process
Serial/parallel conversion of data
8-and 9-bit transmission
Optional even and odd parity
Parity, overrun and framing error checking
Programmable control register
Optional + 1, + 16, and + 64 clock modes
Peripheral/modem control functions
Double buffered
One-or two-stop bit operation
BLOCK DIAGRAM
PIN CONFIGURATION
CTS
DCD
DATA BUS
DATA
BUS
BUFFERS
DO
TRANSMIT
DATA
01
RECEIVE
DATA
ADDRESS
CONTROL
AND
INTERRUPT
SELECTION
AND
CONTROL
c8SAMSUNG
Electronics
vee
194
KS5824
CMOS INTERGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristic
Symbol
Supply Voltage
Input Voltage
Maximum Output Current
Operating Temperature
Storage Temperature
Value
Vee *
VIN*
10 * *
Topr
T5tg
Unit
V
V
rnA
°C
°C
-0.3 to + 7.0
-0.3 to + 7.0
10
-20 to + 75
-55 to + 150
* With respect to Vss (SYSTEM GND)
* * Maximum output current is the maximum current which can flow out from one output terminal or I/O common
terminal (00 - 0 7 , RTS, Tx Data, IRQ).
Note: Permanent IC damage may occur if maximum ratings are exceeded. Normal operation should be under
recommended operating conditions are exceeded, it could affect reliability of IC.
I
RECOMMENDED OPERATING CONDITIONS
Characteristic
Supply Voltage
Input "low" Voltage
Input "High"
Voltage
I
I
Symbol
Min
Typ
Max
Unit
Vee*
4.5
5.0
5.5
V
0
V
2.2
-
0.8
Vee
-20
25
75
VIL*
0 0 - 0 7, RS, Tx ClK, DCD, CTS, Rx Data
CSo, CS2 , CS 1 , R/W, E, Rx ClK
Operating Temperature
2.0
VIH*
Topr
Vee
V
°C
* With respect to Vss (SYSTEM GND)
ELECTRICAL CHARACTERISTICS
DC CHARACTERISTICS (Vee=5V±5%, Vss=OV, Ta= -20 - +75°C, unless otherwise noted.)
Characteristic
Input "High" Voltage
Do - 0 7 , RS, Tx ClK,
DCD, CTS, Rx Data
CSo, CS 2 , CS 1 , RIW, E,
Rx ClK
Symbol
Test Conditions
Min
Typ
Max
Unit
2.0
Vee
2.2
Vee
-0.3
0.8
V
V
VIH
I
Input "low" Voltage
All inputs
VIL
Input leakage Current
RIW, CSo, CS 1, CS 2 , E
hN
VIN =0 - Vee
-2.5
2.5
p.A
Three-State (Off State)
Input Current
Do - 0 7
hSI
VIN = 0.4 - Vee
-10
10
p.A
10H= -205p.A
2.4
10H = -100p.A
2.4
Output "High" Voltage
Output "Low" Voltage
Do - 0 7
Tx data, RTS
All outputs
c8SAMSUNG
Electronics
VOH
VOL
10H = 1.6mA
V
0.4
V
195
KS5824
CMOS INTERGRATED CIRCUIT
DC CHARACTERISTICS (Continued)
Symbol
Characteristic
Output leakage Current
IRQ
(Off State)
Test Conditions
Output Capacitance
E, Tx ClK, Rx ClK,
R/W, RS, Rx Data, CSo,
CS 1, CS2, CTS, DCD
-
10
-
-
12.5
-
-
7.5
VIN=OV, Ta=25°C
f=1.0MHz
-
-
10
-
5.0
E=1.0MHz
-
-
3
E= 1.5MHz
-
-
4
E=2.0MHz
-
-
5
E = 1.0MHz
-
-
200
E=1.5MHz
-
-
250
E=2.0MHz
-
-
300
VOH = Vee
CIN
VIN=OV, Ta=25°C,
f=1.0MHz
COUT
RTS, Tx Data
IRQ
• Under transmitting and
receiving operation
• 500 kbps
• Data bus in Rm operation
Supply Current
• Chip is not selected
• 500 kbps
• Under non transmitting
and receiving operation
• Input level (Except E)
VIH min = Vee - O.SV
VIL max = O.SV
lee
Typ Max Unit
-
kOH
Do-D 7
Input Capacitance
Min
p.A
pF
pF
rnA
p.A
AC CHARACTERISTICS (Vcc=5.0V±5%, VSS=OV, Ta= -20-+75°C, unless otherwise noted.)
1. TIMING OF DATA TRANSMISSION
Characteristic
Symbol
Test Conditions
PWCL
Fig. 1
-+ 1 Mode
Minimum Clock Pulse Width
-+ 16, -+ 64 Modes
-+ 1 Mode
-+ 16, -+ 64 Modes
Clock Frequency
PWCH
. Fig. 2
Max
Unit
900
-
ns
600
900
-
ns
600
-+ 1 Mode
-+ 16, -+ 64 Modes
Min
fc
-
ns
ns
-
500
KHz
SOO
KHz
Clock-to-Data Delay for Transmitter
trOD
Fig. 3
-
600
ns
Receive Data Setup Time
-+ 1 Mode
t ROSU
Fig. 4
250
-
ns
Receive Data Hold Time
-+ 1 Mode
t ROH
Fig. 5
250
-
ns
tlR
Fig. 6
-
1200
ns
tRTS
Fig. 6
-
560
ns
-
1000'
ns
IRQ Release Time
RTS Delay Time
Rise Time and Fall Time
Except E
t r, tf
• 1.0p.s or 10% of the pulse width, whichever is smaller.
·c8SAMSUNG
.
Electronics
196
KS5824
CMOS INTERGRATED CIRCUIT
2. BUS TIMING CHARACTERISTICS
1) READ
Max
Unit
1000
-
ns
450
430
-
ns
Fig. 7
80
-
ns
tooR
Fig. 7
-
290
ns
Data Hold Time
tH
Fig. 7
20
100
ns
Address Hold Time
tAH
Fig. 7
10
-
ns
tEr, tEt
Fig. 7
-
25
ns
Symbol
Test Conditions
Min
Max
Unit
·Enable Cycle Time
tcycE
Fig. 8
1000
-
ns
Enable "High" Pulse Width
PW EH
Fig. 8
450
-
ns
Enable "Low" Pulse Width
PW EL
Fig. 8
430
-
ns
tAs
Fig. 8
80
-
ns
Characteristic
Symbol
Test Conditions
Min
Enable Cycle Time
tCYC E
Fig. 7
Enable ,~'High" Pulse Width
PW EH
Fig. 7
Enable "Low" Pulse Width
PW EL
Fig. 7
Setup Time, Address and R/IN Valid
to Enable Positive Transition
tAs
Data Delay Time
Rise and Fall Time for Enable Input
ns
I
2) WRITE
Characteristic
Setup Time, Address and R/W
Valid to Enable Positive Transition
Data Setup Time
tosw
Fig. 8
165
-
ns
Data Hold Time
tH
Fig. 8
10
-
ns
Address Hold Time
tAH
Fig. 8
10
-
ns
t Er, tEt
Fig. 8
-
25
ns
Rise and Fall Time for Enable Input
PWCL
TX ClK
OR
Rx elK
TX elK
OR
Rx elK
2.2V
O.BV
PWCH
• Tx elK is VIH=2.0V
Fig. 1 Clock Pulse Width, "Low" State
Fig. 2 Clock Pulse .Width, "High" State
Tx elK
Ri< DATA
VCC-2.0V
O.4V
Fig. 3 Transmit Data Output Delay
c8SAMSUNG
Electronics
RX elK
Fig. 4 Receive Data Setup Time (+ 1 Mode)
197
KS5824
CMOS INTERGRATED CIRCUIT
ENABLE
Rx ClK
tRTS
VcC-2.0V
O.4V
~
--J/'-2.0V
IRQ _ _ _ _ _ _ _ _ _ _ _ _ _
Fig. 5 Receive Data Hold Time ( + 1 Mode)
* (1) IRQ Release Time applied to Rx Data Register
read operation.
(2) IRQ Release Time applied to Tx Data Register
write operation
(3) IRQ Release Time applied to control Register
write TI E 0, RI E 0 operation.
** IRQ Release Time applied to Rx Data Register
read operation right after read status register,
when IRQ is asserted by DCD rising edge.
f-----tCyC E - - - - - - j
=
ENABLE
RS, CS, R/IN
=
Note: Note that following take place when IRQ is
asserted by the detection of transmit data register
empty status. IRQ is released to "High"
asynchronously with E signal when CTS goes
"High". (Refer to Figure 14)
DATA BUS
Fig. 6
Fig. 7 Bus Read Timing Characteristics
(Read information from UART)
R'fS Delay and IRQ Release Time
LOAD B
lOAD A
(Do-D7. RTS, Tx DATA)
1------tcycE - - - - - - i
PWEH
(TFfO
0=JlY)S.OV
RL = 2.4K!l
3K!l
TEST POINT
TEST POINT
lOOPF
c=
130pF for Do-D7
30pF for FITS and Tx Data
R = 10K!l for Do-D7. Fi'ffi and Tx Data
All diodes are 1S2074@or Equivalent.
=
Fig. 8 Bus Write Timing Characteristics
(Write information into UART)
c8SAMSUNG
Electronics
Fig. 9 Bus Timing Test Loads
198
KS5824
CMOS INTERGRATED CIRCUIT
I
Fig. 10 110 Baud Serial ASCII Data Timing
TRANSMIT
CLOCK 4
ENABLE 14
READ/WRITE
CHIP SELECT 0
CHIP SELECT 1
CHIP SELECT 2
13
8
10
9
REGISTER SELECT 11-
CHIP
SELECT
AND
READ/
WRITE
CONTROL
TRANSMIT
DATA
REGISTER
6 TRANSMIT
DATA
24 CLEAR
TO SEND
DO
22
01
21
02
20
03
19
D4
18
05
17
D6
16
07
15
STATUS
REGISTER
7 INTERRUPT
REQUEST
DATA BUS
BUFFERS
23 DATA
CARRIER
DETECT
5 REQUEST
TO SEND
CONTROL
REGISTER
Vee = Pin 12
Vss= Pin 1
RECEIVE
DATA
REGISTER
RECEIVE
SHIFT
REGISTER
~~g~~~----------------------------------~~----~
Fig. 11 Expanded Block Diagram
c8SAMSUNG
Electronics
199
KS5824
CMOS INTERGRATED CIRCUIT
DEVICE OPERATION
transmitted (because of double buffering). The second
character will be automatically transferred into the Shift
Register when ·the first character transmission is
completed. This sequence continues until all the
characters have been transmitted.
At the bus interface, the UART appears as two
addressable memory locations. Internally, there are four
registers: two read-only and two write-only registers. The
read-only registers are Status and Receive Data; the
write-only registers are Control and Transmit Data. The
serial interface consists of serial input and output lines
with independent clocks, and three peripheral/modem
control lines.
POWER ON/MASTER RESET
The master reset (CRO, CR1) should be set during
system initialization to insure the reset condition and
prepare for programming the UART functional configuration when the communications channel is required.
During the first master reset, the IRQ and RTS outputs
are held at level 1. On all other master resets, the RTS
output can be programmed high or low with the IRQ
J)utput held high. Control bits CR5 and CR6 should also
be programmed to define the state of RTS whenever
master reset is utilized. The UART also contains internal
power-on reset logic to detect the power line turn-on
transition and hold the chip in a reset state to prevent
erroneous output transitions prior to initialization. This
circuitry depends on clean power turn-on transitions.
The power-on reset is released by means of the busprogrammed master reset which must be applied prior
to operating the UART. After master resetting the UART,
the programmable Control Register can be set for a
number of options such as variable clock divider ratios,
variable word length, one or two stop bits, parity (even,
odd, or none), etc.
TRANSMIT
A typical transmitting sequence consists of reading
the UART. Status Register either as a result of an
interrupt or in the UART's turn in a polling sequence.
A character may be written into the Transmit Data
Register if the status read operation has indicated that
the Transmit Data Register is empty. This character is
transferred to a Shift Register where it is serialized and
transmitted from the Transmit Data output preceded by
a start bit and followed by one or two stop bits. Internal
parity (odd or even) can be optionally added to the
character and will occur between the last data bit and
the first stop bit. After the first character is written in
the Data Register, the Status Register can be read again
to check for a Transmit Data Register Empty condition
and current peripheral status. If the register is empty,
another character can be loaded for transmission even
though the first character is in the process of being
RECEIVE
Data is received from a peripheral by means of the
Receive Data input. A divide-by-one clock ratio is
provided for an externally synchronized clock (to its data)
while the divide-by-16 and 64 ratios are provided for
internal synchronization. Bit synchronization in the
divide-by-16 and 64 modes is initiated by the detection
of 8 or 32 low samples on the receive line in the divideby-16 and 64 modes respectively. False start bit deletion
capability insures that a full half bit of a start bit has
been received before the internal clock is synchronized
to the bit time. As a character is being received, parity
(odd or even) will be checked and the error indication
will be available in the Status Register along with
framing error, overrun error, and Receive Data Register
full. In a typical receiving sequence, the Status Register
is read to determine if a character has been received
from a peripheral. If the Receiver Data Register is full,
the character is placed on the 8-bit UART bus when a
Read Data command is received from the MPU. When
parity has been selected for a 7-bit word (7 bits plus
parity), the receiver strips the parity bit (D7 = 0) so that
data alone is transferred to the MPU. This feature
reduces MPU programming. The Status Register can
continue to be read to determine when another
character is available in the Receive Data Register. The
receiver is also double buffered so that a character can
be read from the data register as another character is
being received in the shift register. The above sequence
continues until all characters have been received.
INPUT/OUTPUT FUNCTIONS
UART INTERFACE SIGNALS FOR MPU
The KS5824 interfaces to the MPU with an 8-bit
bidirectional data bus, three chip select lines, a register
select line, an interrupt request line, read/write line, and
enable line. These signals permit the MPU to have
complete control over the KS5824.
UART Bidirectional Data (00·07) - The bidirectional
data lines (DO-07) allow for data transfer between the
KS5824 and the MPU. The data bus output drivers are
three-state devices that remain in the high-impedance
(off) state except when the MPU performs an UART read
operation.
200
KS5824
UART Enable (E) - The Enable signal, E, is a highimpedance TTL-compatible input that enables the bus
input/output data buffers and clocks data to and from
the KS5824.
Read/Write (R/W) - The ReadlWrite line is a highimpedance input that is TTL compatible and is used to
control the direction of data flow through the UART's
input/output data bus interface. When ReadIWrite is high
(MPU Read cycle), KS5824 output drivers are turned on
and a selected register is read. When it is low, the
KS5824 output drivers are turned off and the MPU writes
into a selected register. Therefore, the ReadlWrite signal
is used to select read-only or write-only registers within
the KS5824.
Chip Select (CSO, CS1, CS2) - These three highimpedance TTL-compatible input lines are used to
address the KS5824. The KS5824 is selected when CSO
and CS1 are high and CS2 is low. Transfers of data to
and from the KS5824, are then performed under the
control of the Enable Signal, ReadIWrite, and Register
Select.
Register Select (RS) - The Register Select line is a
high-impedance input that is TTL compatible. A high
level is used to select the Transmit/Receive Data
Registers and a low level the Control/Status Registers.
The Read/Write signal line is used in conjunction with
Register Select to select the read-only or write-only
register in each register pair.
Interrupt Request (IRQ) - Interrupt Request is a TTLcompatible, open-drain (no internal pullup), active low
output that is used to interrupt the MPU. The IRQ output
remains low as long as the cause of the interrupt is
present and the appropriate interrupt enable within the
UART is set. The IRQ status bit, when high, indicates
the IRQ output is in the active state.
Interrupts result from conditions in both the
transmitter and receiver sections of the UART. The
transmitter section causes an interrupt when the
Transmitter Interrupt Enabled condition is selected
(CR5-CR6), and the Transmit Data Register ,Empty
(TORE) status bit is high. The TDRE status bit indicates
the current status of the Transmitter Data Register
except when inhibited by Clear-to-Send (CTS) being high
or the UART being maintained in the Reset condition.
The interrupt is cleared by writing data into the Transmit
Data Register. The interrupt is masked by disabling the
Transmitter Interrupt via CR5 or CR6 or by the loss of
CTS which inhibits the TORE status bit. The Receiver
section causes an interrupt when the Receiver Interrupt
Enable is set and the Receive Data Register Full (RDRF)
status bit is high, an Overrun has occurred, or Data
Carrier Detect (DCD) has gone high. An interrupt
resulting from the RDRF status bit can be cleared by
=8SAMSUNG
Electronics
CMOS INTERGRATED CIRCUIT
reading data or resetting the UART. Interrupts caused
by Overrun or loss of DCD are cleared by reading the
status register after the error condition has occurred and
then reading the Receive Data Registeror resetting the
UART. The receiver interrupt is masked by resetting the
Receiver Interrupt Enable.
CLOCK INPUTS
Separate high-impedance TTL-compatible inputs are
provided for clocking of transmitted and received data.
Clock frequencies of 1, 16, or 64 times the data rate may
be selected.
Transmit Clock (Tx ClK) - The Transmit Clock input
is used for the clocking of transmitted data. The
transmitter initiates data on the negative transition of
the clock.
Receive Clock (Rx ClK) - The Receive Clock input
is used for synchronization of received data. (In the .;- 1
mode, the clock and data must be synchronized
externally.) The receiver samples the data on the positive
transition of the clock.
SERIAL INPUT/OUTPUT LINES
Receive Data (Rx Data) - The Receive Data line is
a high-impedance TTL-compatible input through which
data is received in a serial format. Synchronization with
a clock for detection of data is accomplished internally
when clock rates of 16 or 64 times the bit rate are used.
Transmit Data (Tx Data) - The Transmit Data output
line transfers serial data to a modem or other peripheral.
PERIPHERAL/MODEM CONTROL
The UART includes several functions that permit
limited control of a peripheral or modem. The functions
included are Clear-to-Send, Request-to-Send and Data
Carrier Detect.
Clear·to·Send (CTS) - This high-impedance TTL·
compatible input provides automatic control of the
transmitting end of a communications link via the
modem Clear·to-Send active low output by inhibiting the
Transmit Data Register Empty (TORE) status bit.
Request·to·Send (RTS) - The Request·to-Send output
enables the MPU to control a peripheral or modem via
the data bus. The RTS; output corresponds to the state
of the Control Register bits CR5 and CR6. When CR6 = 0
or both CR5 and CR6 = 1, the RTS output is low (the
active state). This output can also be used for Data
Terminal Ready (DTR).
201
•
KS5824
CMOS INTERGRATED CIRCUIT
Data Carrier Detect (DCD) - This high-impedance
TIL-compatible input provides automatic control, such
as in the receiving end of a communications link by
means of a modem Data Carrier Detect output. The DCD
input inhibits and initializes the receiver section of the
UART when high. A low-to-high transition of the Data
Carrier Detect initiates an interrupt to the MPU to
indicate the occurrence of a loss of carrier when the
Receive Interrupt Enable bit is set. The Rx ClK must
be running for proper DCD operation.
character is being transmitted, then the transfer will take
place within 1-bit time of the training edge of the Write
command. If a character is being transmitted, the new
data character will commence as soon as the previous
character is complete. The transfer of data causes the
Transmit Data Register Empty (TORE) bit to indicate
empty.
RECEIVE DATA REGISTER (RDR)
Data is automatically transferred to the empty Receive
Data Register (RDR) from the receiver deserializer (a
shift register) upon receiving a complete character. This
event causes the Receive Data Register Full bit (RDRF)
in the status buffer to go high (full). Data may then be
read through the bus by addressing the UART and
selecting the Receive Data Register with RS and RIW
high when the UART is enabled. The non-destructive
read cycle causes the RDRF bit to be cleared to empty
although the data is retained in the RDA. The status is
maintained by RDRF as to whether or not the data is
current. When the Receive Data Register is full, the
automatic transfer of data from the Receiver Shift
Register to the Data Register is inhibited and the RDR
contents remain valid with its current status stored in
the Status Register.
UART REGISTERS
The expanded block diagram for the UART indicates
the internal registers on the chip that are used for the
status, control, receiving, and transmitting of data. The
content of each of the registers is summarized in Table
1.
TRANSMIT DATA REGISTER (TOR)
Data is written in the Transmit Data Register during
the negative transition of the enable (E) when the UART
has been addressed with RS high and Rm low. Writing
data into the register causes the Transmit Data Register
Empty bit in the Status Register to go low. Data can then
be transmitted. If the transmitter is idling and no
DEFINITION OF UART REGISTER CONTENTS
Buffer Address
RS • RIW
Transmit
Data
Register
RS • RIW
Receive
Data
Register
RS • RIW
RS· RIW
Control
Register
Status
Register
(Write Only)
(Read Only)
(Write Only)
(Read Only)
0
Data Bit 0*
Data Bit 0
Counter Divide
Select 1 (CRO)
Receive Data Register
Full (RDRF)
1
Data Bit 1
Data Bit 1
Counter Divide
Select 2 (CR1)
Transmit Data Register
Empty (TORE)
2
Data Bit 2
Data Bit 2
Word Select 1
(CR2)
Data Carrier Detect
(DCD)
3
Data Bit 3
Data Bit 3
Word Select 2
(CR3)
Clear-to-Send
(CTS)
4
Data Bit 4
Data Bit 4
Word Select 3
(CR4)
Framing Error
(FE)
5
Data Bit 5
Data Bit 5
Transmit Control 1
(CR5)
Receiver Overrun
(OVRN)
6
Data Bit 6
Data Bit 6
Transmit Control 2
(CR6)
Parity Error (PE)
7
Data Bit 7* * *
Data Bit 7**
Receive Interrupt
Enable (CR7)
Interrupt Request
(IRQ)
Data
Bus
Line
Number
=
=
* Leading bit LSB Bit 0
* * Data bit will be zero in 7 bit plus parity modes
*** Data bit is "don't care" in 7 bit plus parity modes.
c8SAMSUNG
Electronics
202
KS5824
CMOS INTERGRATED CIRCUIT
CONTROL REGISTER
The UART Control Register consists of eight bits of
write-only buffer that are selected when RS and RiW are
low. This register controls the function of the receiver,
transmitter, interrupt enables, and the Request-to-Send
peripheral/modem control output.
Counter Divide Select Bits (CRO and CR1) - The
Counter Divide Select Bits (CRa and CR1) determine the
divide ratios utilized in both the transmitter and receiver
sections of the UART. Additionally, these bits are used
to provide a master reset for the UART which clears the
Status Register (except for external conditions on CTS
and DCD) and initializes both the receiver and
transmitter. Master reset does not affect other Control
Register bits. Note that after power-on or a power
fail/restart, these bits must be set high to reset the
UART. After resetting, the clock divide ratio may be
selected. These counter select bits provide for the
following clock divide ratios:
CR1
CRO
Function
a
a
1
1
a
1
a
1
+1
+16
+64
Master Reset
Word Select Bits (CR2, CR3, and CR4) - The Word
Select bits are used to select word length, parity, and
the number of stop bits. The encoding format is as
follows;
CR4
a
a
a
0
1
1
1
1
CR3 CR2
a
a
1
1
a
a
1
1
a
1
a
1
0
1
a
1
Function
7
7
7
7
8
8
8
8
Bits + Even Parity + 2 Stop Bits
Bits + Odd Parity + 2 Stop Bits
Bits + Even Parity + 1 Stop Bit
Bits + Odd Parity + 1 Stop Bit
Bits + 2 Stop Bits
Bits + 1 Stop Bit
Bits + Even Parity + 1 Stop Bit
Bits + Odd Parity + 1 Stop Bit
Word length, Parity Select, and Stop Bit changes are
not buffered' and therefore become effective
immediate!y.
Transmitter Control Bits (CRS and CR6) - Two
Transmitter Control bits provide for the control of the
interrupt from the Transmit Data Register Empty
condition, the Request-to-Send (RTS) output, and the
transmission of a Break level (space). The following
encoding format is used:
c8SAMSUNG
Electronics
CR6
CR5
a
a
a
1
1
a
1
1
Function
=
=
=
RTS low, Transmitting Interrupt
Disabled.
RTS low, Transmitting Interrupt
Enabled.
RTS high, Transmitting Interrupt
Disabled.
RTSi: low. Transmits a Break level
on the Transmit Data Output.
Transmitting Interrupt Disabled.
Receive Interrupt Enable Bit (CRn - The following
interrupts will be enabled by a high level in bit position
7 of the Control Register (CR7): Receive Data Register
Full Overrun or a low-to-high transition on the Data
Carrier Detect (DCD) signal line.
STATUS REGISTER
Information on the status of the UART is available to
the MPU by reading the UART Status Register. This readonly register is selected when RS is low and Rm
is high. Information stored in this register indicates the
status of the Transmit Data Register, the Receive Data
Register and error logic, and the peripheral/modem
status inputs of the UART.
Receive Data Register Full (RDRF), Bit 0 - Receive
Data Register Full indicates that received data has been
transferred to the Receive Data Register. RDRF is
cleared after an MPU read of the Receive Data Register
or by a master reset. The cleared or empty state
indicates that the contents of the Receive Data Register
are not current. Data Carrier Detect being high also
causes RDRF to indicate empty.
Transmit Data Register Empty (TDRE), Bit 1 - The
Transmit Data Register Empty bit being set high
indicates that the Transmit Data Register contents have
been transferred and that new data may be entered. The
low state indicates that the register is full and that
transmission of a new character has not begun since
the last write data command.
Data Carrier Detect (DC D), Bit 2 - The Data Carrier
Detect bit will be high when the DeD input from a
modem has gone high to indicate that a carrier is not
present. This bit going high causes and Interrupt
Request to be generated when the Reoeive Interrupt
Enable is set. It remains high after the DCD input is
returned low until cleared by first reading the Status
Register and then the Data Register or until a master
reset occurs. If the DCD input remains high after read
203
•
KS5824
CMOS INTERGRATED CIRCUIT
status and read data or master reset has occurred, the
interrupt is cleared, the DCD status bit remains high and
will follow the DCD input.
in succession without a read of the RDR having
occurred. The Overrun does not occur in the Status
Register until the valid character prior to Overrun has
been read. The RDRF bit remains set until the Overrun
is reset. Character synchronization is maintained during
the Overrun condition. The Overrun indication is reset
after the reading of data from the Receive Data Register
or by a Master Reset.
Clear·to·Send (CTS), Bit 3 - The Clear-to-Send bit
indicates the state of the Clear-to-Send input from a
modem. A low CTS indicates that there is a Clear-toSend from the modem. In the high state, the Transmit
Data Register Empty bit is inhibited and the Clear-toSend status bit will be high. Master reset does'not affect
the Clear-to-Send status bit.
Framing Error (FE), Bit 4 - Framing error indicates
that the received character is improperly framed by a
start and a stop bit and is detected by the absence of
the first stop bit. This error indicates a synchronization
error, faulty transmission, or a break condition. The
framing error flag is set or reset during the receive data
transfer time. Therefore, this error indicator is present
throughout the time that the associated character is
available.
Receiver Overrun (OVRN), Bit 5 - Overrun is an error
flag the indicates that one or more characters in the data
stream were lost. That is, a character or a number of
characters were received but not read from the Receive
Data Register (RDR) prior to subsequent characters
being received. The overrun condition begins at the
midpoint of the last bit of the second character received
c8SAMSUNG
Electronics
Parity Error (PE), Bit 6 - The parity error flag indicates
that the number of highs (ones) in the character does
not agree with the preselected odd or even parity. Odd
parity is defined to be when the total number of ones
is odd. The parity error indication will be present as long
as the data character is in the RDR.lf no parity is
selected, then both the transmitter parity generator
output and the receiver parity check results are
inhibited.
Interrupt Request (IRQ), Bit 7 - The IRQ bit indicates
the state of the IRQ output. Any interrupt condition with
its applicable enable will be indicated in this status bit.
Anytime the IRQ output is low the IRQ bit will be high
to indicate the interrupt or service request status. IRQ
is cleared by a read operation to the Receive Data
Register or a write operation to the Transmit Data
Register.
204
KT3040/A
CMOS INTEGRATED CIRCUIT
16 CERDIP
PCM TRANSMIT/RECEIVE FILTER
The KT3040 PCM CODEC Filter is a monolithic circuit
that provides the transmit and receive filtering necessary to interface a voice telephone circuit to a time division multiplexed application in 8KHz sampling system.
The device consists of two switched capacitor filters,
transmit and receive, and power amplifiers which may
be used to drive a transformer hybrid (2 to 4 wire converter) or an electronic hybrid (SLlC). If an electronic
hybrid is used, the power amplifiers are not needed and
may be deactivated to minimize power dissipation. The
transmit filter is a fifth order low pass filter in series
with a fourth order high pass filter. It provides a flat band
pass filter which will pass frequencies between 200Hz
and 3400Hz and provides rejection of the 50/60Hz power line frequency as well as the anti aliasing needed in
an 8KHz sampling system. The receive filter is a low
pass filter which smooths the voltage steps present in
the CODEC output waveform and provides the sin x/x
correction necessary to give unity gain in the passband
for the CODEC-decoder-and-receive-filter pair.
•
ORDERING INFORMATION
Device
KT3040N
FEATURES
KT3040AN
KT3040J
• Exceeds all 03/04 and CCITT specifications
KT3040AJ
• Low power consumption: 45 mW (0 dBmO into 600n)
30 mW (power amps disabled)
• Power down mode: 0.5 mW
• External gain adjustment, both transmit and receive filters.
• Transmit filter includes SO/60Hz rejection
• Receive filter includes sin xix compensation
• Direct interface with transformer or electronic telephone
hybrids
• TTL and CMOS compatible logic
• Power supplies: + 5V, - 5V
• All inputs protected against static discharge due to
handling
• 300 mil ceramic package available
c8SAMSUNG
Electronics
Package
Operating Temperature
Plastic
Plastic
Ceramic
-25 -
+ 125°C
Ceramic
205
CMOS INTEGRATED CIRCUIT
KT3040/A
BLOCK DIAGRAM
PDN
GNDA
GNDD
Vee
VBB
7
PWIRO-
ClK
ClKO
\
VFxO
I
L.. ___________~A..!:!..S~T..£I£.E~ _ _ _ _ _ _ _ _ _
GSx
Fig. 1
PIN CONFIGURATION
1~
VFxO
1~J GNDA
KT3040/A
ABSOLUTE MAXIMUM RATINGS
Characteristics
Supply Voltages
Power Dissipation
Input Voltage
Symbol
Value
Unit
Vee, VBB
±7
V
Po
1
W/PKG
VIN
±7
V
Output Short-Circuit Duration
Ts.e OUT
Continuous
sec
Operating Temperature Range
Ta
-25 to + 125
°C
Storage Temperature
T51g
-65 to + 150
Lead Temperature (Soldering 10 seconds)
c8SAMSUNG
Electronics
TL
300
°C
°C
206
KT3040/A
CMOS INTEGRATED CIRCUIT
DC ELECTRICAL CHARACTERISTICS
(Ta=ooe to 70 oe, Vcc= +5V±5%, VBB = -5V±5%, fc=2.048MHz, GNDA=OV, GNDD=OV;
unless otherwise specified)
Characteristic
Symbol
Test Conditions
KT3040
Min
Typ
KT3040A
Max
Min
Typ
Max
Unit
POWER CONSUM PTION
lee
PDN = High
50
400
50
100
IlA
IBB
PDN = High
50
400
50
100
IlA
Vee Operating Current
1CC1
PWRI = VBB ,
Power amp inactive
3
4
3
4
mA
VBB Operating Current
IBB1
PWRI = VBB ,
Power amp inactive
3
4
3
4
mA
Vee Operating Current
Jee2
RL = 600n connected between
PWRO + and PWRO -, Input
Level =0 dBmO (Note 1)
4.6
6.4
4.6
6.4
mA
VBS Operating Current
ISB2
(Note 1)
4.6
6.4
4.6
6.4
mA
liNe
VBB5,VIN5,Vee
-10
10
IlA
Vee Standby Current
VBB Standby Current
DIGITAL INTERFACE
CLK Input Current
10
-10
-100
PDN Input Current
hNP
VBB5,VIN5,Vee
-100
CLKO Input Current
hNO
VBB5,VIN5,Vee - 0.5
-10
0.1
-10
0.1
High Level Input Voltage
VIH
Except CLKO
2.2
Vee
2.2
Vee
V
Low Level Input Voltage
VIL
Except CLKO
0
0.8
0
0.8
V
High Level Input Voltage
VIHO
CLKO Pin
Vee - 0.5
Vee
Vee -0.5
Vee
V
Low Level Input Voltage
VILO
CLKO Pin
VBB
VBB + 0.5
VBB
Vss+0.5
V
Input Intermediate Voltage
VIIO
CLKO Pin
-0.8
0.8
-0.8
0.8
V
c8SAMSUNG
Electronics
IlA
IlA
207
•
CMOS INTEGRATED CIRCUIT
KT3040/A
DC ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Test Conditions
(Continued)
KT3040
Min
Typ
KT3040A
Max
Min
100
-100
Typ
Max
Unit
TRANSMIT FILTER GAIN SETTING AMPLIFIER
VFXI Input Leakage Current
VFXI Input Resistance
VFXI Input Offset Voltage
VFXI Common Mode Range
IBxl
-100
VBB5.VFxl5.Vee
10
100
nA
~-r--
Rixi
VOSxl
- 2.5V 5. VIN 5.
+2.5V
VeM
Common Mode Rejection Ratio CMRR
Power Supply Rejection
Ratio of Vee or VBB
VBB 5. VFXI5. Vee
- 2.5V 5. VIN 5. 2.5V
PSRR
10
Mf!
-20
20
-20
20
-2.5
2.5
-2.5
2.5
mV
V
60
60
dB
60
60
dB
Open Loop Output Resistance
of GS x
ROL
Minimum Load Resistance
of GS x
RLxl
Maximum Load Capacitance
of GS x
COL
Output Voltage Swing of GS x
VOXI
RL~10Kf!
±2.5
±2.5
V
Open Loop Voltage Gain
of GS x
AVOL
RL~10Kf!
5,000
5,000
VIV
Open Loop Unity Gain
Bandwidth of GS x
fe
c8SAMSUNG
Electronics
1
1
10
Kf!
10
Kf!
100
2
100
2
pF
MHz
208
KT3040/A
CMOS INTEGRATED CIRCUIT
AC ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, Ta = 25°C. All parameters are specifi(d for a signal level of OdBmO at 1KHz.
The OdBmO level is assumed to be 1.54Vrms measured at the output of the transmit or receive filter)
Characteristic
Symbol
Test Conditions
KT3040A
KT3040
Min
Typ
Max
Min
Typ
Max
Unit
TRANSMIT FILTER (Transmit filter input OP amp set to the non·inverting unity gain mode, with VFX1 = 1.09Vrms unless otherwise noted)
Minimum Load Resistance
of VFXO
RLx
Load Capacitance VFXO
CLx
Power Supply Rejection
Ratio, VFXO
Power Supply Rejection
Ratio, VFXO
Absolute Gain
Gain Relative to GAX
-2.5V-~~---+-P-W-R-O-+---------t--~~--~
I
Rs
"-
-- -- -
PWROI
-- -
-
-
-
-
-
-
-
-
-
-
_ _ -I
KT3040/A
Typical Connection of Output Driver Amp
The power amps can be deactivated, when not required, by connecting the power amplifier input (pin 5) to the
negative power supply Vss. This reduces the total filter power consumption by approximately 10mW-20mW
depending on output signal amplitude.
Power Down Mode
Pin 13 (PDN) provides the power down control. When the level on this pin is high, the KT3040/A goes into standby,
power down mode. The total filter power consumption will reduce to less than 1mW. This feature allows multiple
KT3040/A to drive the same analog bus on a time shared basis. Connect PDN to GNDD for normal operation.
c8SAMSUNG
Electronics
214
KT3040/A
CMOS INTEGRATED CIRCUIT
APPLICATION INFORMATION
R1
INTERFACE
R2
CIRCUIT
1--- --------l
I
TRANSFORMERS
I
I
I
600
I
16 >0.1I'F
VFXI
VFXO
VFXI+
Irv
DIGITAL
OUTPUT
50K
I
I
KT5116
KT3040
GNDA
PWRO-
V FR1
6000
10
13
I
12
VFRO
0.11'F
I
I
L _________ ~
50K
DIGITAL
INPUT
Fig. 2
Note 1: Transmit voltage gain = R1;2 R2 x.J2 (The filter itself introduces a 3dB gain), (R1
+ R2~ 10K)
Note 2: Receive Gain = R R4R (R3 + R4~ 10K)
3+
4
Note 3: In the configuration shown, the receive filter amplifiers will drive a 6000 T to R termination to a maximum
signal level of B.SdBm. An alternative arrangement, using a transformer winding ratio equivalent to 1.414:1
and 3000 lesistor, Rs , will provide a maximum signal level of 10.1dBm across a 6000 termination
impedance.
Gain Adjust
Fig. 2 shows the signal path interconnections between the KT3040 and KT5116 single-channel CODEC. The transmi-t
RC coupling components have been chosen both for minimum passband droop and to present the correct impedance
to the CODEC during sampling.
Optimum noise and distortion performance will be obtained from the KT3040 filter when operated with system
peak overload voltages of ± 2.S to ± 3.2V at VFXO and VFRO . When interfacing to a PCM CODEC with a peak
overload voltage outside this range, further gain or attenuation may be required.
For example, the KT3040 filter can be used with the KT3000 series CODEC which has a 5.5V peak overload voltage.
A gain stage following the transmit filter output and an attenuation stage following the CODEC output are required ..
Decoupling Recommendations
PC board decoupling should be sufficient to prevent power supply transients from exceeding the absolute
maximum rating of the device. A minimum of 1/lF is recommended for each power supply.
A O.OS/lF bypassing capacitor should also be connected from each power supply to GNDA. However, this
decoupling may be reduced depending on board design and performance. Ground loops should be avoided.
c8SAMSUNG
Electronics
215
I
KT3040/A
CMOS INTEGRATED CIRCUIT
TYPICAL PERFORMANCE CURVE
RECEIVE FILTER STAGE
TRANSMIT FILTER STAGE
10
-10
-20
10
,- ~ iJEl
,
~
/
V
-10
------
~
r-~
-
r---..
FILTER + SIN XIX "'" ~
SI~X~
-20
~~
-30
-30
"""
-40
-50
-50
-60
-60
-70
0.1
10
FREQUENCY (KHz)
c8SAMSUNG
Electronics
I~
I ,
-40
~
t--X=~
-70
0.1
I
I
10
FREQUENCY (KHzl
216
KT3170
CMOS INTEGRATED CIRCUIT
LOW POWER DTMF RECEIVER
18 DIP
The KT3170 is a complete Dual Tone Multiple Frequency
(DTMF) receiver which is fabricated by the low power
CMOS and the Switched-Capacitor Filter technology.
This LSI consists of band split filters, which separates
the high and low group tones, followed by a digital
counting section which verifies the frequency and
duration of the received tones before passing the corresponding code to the output bus. It decodes all 16
DTMF tone pairs into a 4bits digital code.
The externally required components are minimized by
on chip provision of a differential input AMP, clock
oscillator and latched three state interface. The on chip
clock generator requires only a low cost TV crystal as
an external component.
•
FEATURES
•
•
•
•
•
•
Detects all 16 standard tones.
Low power consumption: 15mW (Typ)
Single power supply: 5V
Uses inexpensive 3.58MHz crystal
Three state outputs for microprocessor interface
Good quality and performance for using in
exchange system
• Package options include standard plastic and
ceramic 300 mil DIPs
• Power down mode/input inhibit
APPLICATIONS
·PABX
• Central Office
• Paging Systems
• Remote Control
• Credit Card Systems
• Key Phone System
• Answering Phone
• Home Automation System
• Mobile Radio
• Remote Data Entry
c8SAMSUNG
Electronics
ORDERING INFORMATION
Device
Package
KT3170N
Plastic
KT3170J
Ceramic
Operating Temperature
-40 - +85°C
PIN CONFIGURATION
•
KT3170
217
KT3170
CMOS INTEGRATED CIRCUIT
BLOCK DIAGRAM
OSC1
OSC2
TO ALL
CHIP CLOCK
DIGITAL SECTION
ANALOG SECTION
HIGH
GROUP
FILTER
ANTI
ALIASING
FILTER
DIAL
TONE
NOTCH
FILTER
DETECTORS
DIGITAL
DETECTION
ALGORITHM
OUTPUT
DECODER
AND LATCH
LOW
GROUP
FILTER
CHIP POWER CHIP BIAS
STEERING
LOGIC
Voo
GND
ABSOLUTE MAXIMUM RATINGS
Characteristics
Symbol
Value
Unit
Power Supply Voltage
Analog Input Voltage Range
Digital Input Voltage Range
Output Voltage Range
Current On Any Pin
Operating Temperature
Storage Temperature
Voo
VINA
VINO
Vo
liN
Ta
T stg
6
- 0.3 - Voo + 0.3
- 0.3 - Voo + 0.3
- 0.3 -Voo + 0.3
10
-40 - +85
-60 -+150
V
V
V
V
rnA
°C
°C
* Absolute Maximum Ratings are these value beyond which permanent damage to the device may occur. These are
stress rating only and functional operation of the device at or beyond them is not implied. Long exposure to these
condition may affect device reliability.
c8SAMSUNG
Electronics
218
KT3170
CMOS INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS
Characteristics
Symbol
(V oo =5V, Ta=25°C, unless otherwise noted)
Test Condition
Min
Typ
Operating Supply Voltage
Voo
Operating Supply Current
100
3.0
15
Power Dissipation
Po
. Input Voltage Low
VIL
Input Voltage High
VIH
4.75
0.1
Ipu
OE=GND
7.5
Analog Input Impedance
RIN
fiN = 1KHz
Steering Input Threshold Voltage
VTS
Output Voltage Low
VOL
Output Voltage High
8
No Load
VOH
No Load
4.97
sink
VOL=0.4V
1
2.5
Output Current
Isource
VOH=4.6V
0.4
0.8
'
mA
45
mW
1.5
V
Vref
p.A
15
10
2.2
Output Current
Vref Output Voltage
V
9.0
V
VIN=GND or Voo
Pull Up Current On OE Pin
Unit
5.25
3.5
IIHIIIL
Input Leakage Current
Max
p.A
MO
2.5
V
0.03
V
V
mA
mA
2.8
2.4
V
Vref Output Resistance
Rref
10
KO
Analog Input Offset Voltage
Vos
25
mW
Power Supply Rejection Ratio
PSRR
Gain Setting Amp
at 1KHz
60
dB
Common Mode Rejection Ratio
CMRR
- 3.0V < VIN < 3.0V
60
dB
Av
Gain Setting Amp at 1KHz
65
dB
Open Loop Voltage Gain
Open Loop Unit Gain Bandwidth
BW
1.5
MHz
Analog Output Voltage Swing
VAO
RL= 100K
4.5
Vp- p
Acceptable Capacitive Load
CL
GS
100
pF
Acceptable Resistive Load
RL
GS
50
KO
3.0
Vp- p
Analog Input Common Mode
Voltage Range
c8SAMSUNG
Electronics
VCM
No Load
219
•
CMOS INTEGRATED CIRCUIT
KT3170
AC ELECTRICAL CHARACTERISTICS
Characteristics
Symbol
Valid Input Signal Range
(each tone of composite signal)
V1NA
Dual Tone Twist Accept
TW
Acceptable Frequency Deviation
FDA
Frequency Deviation Reject
(V DD =5V, Ta=25°C, f c =3.579545MHz)
Test Condition
Min
Typ
-29
Unit
1.0
dBm
±10
dB
±1.5%
±2Hz
FDR
±3.5%
Third Tone Tolerance
T3
-25
Noise Tolerance
NT
Dial Tone Tolerance
DT
18
22
fc
3.5759
3.5795
Crystal Clock Frequency
Max
-16
dB
-12
dB
dB
3.5831
MHz
Maximum Clock Input Rise Time
t,
External Clock
110
nS
Maximum Clock Input Fall Time
tf
External Clock
110
nS
Acceptable Clock Input Duty Cycle
DC
External Clock
CLO
OSC2 PIN
Acceptable Capacitive Load
40
50
60
%
30
pF
mS
Tone Present Detect Time
TDP
5
11
14
Tone Absent Detect Time
TDA
0.5
4
8.5
mS
Minimum Tone Duration Accept
TUA
User Adjustable
40
mS
Maximum Tone Duration Reject
TUR
User Adjustable
Acceptable Interdigit Pause
TAID
User Adjustable
Rejectable Interdigit Pause
TRID
User Adjustable
Propagation Delay Time SI to a
TPsa
OE=High
8
Propagation Delay Time SI to DSO
Tpsds
OE=High
12
p,S
Output Data Setup a to DSO
TSU
OE=High
3.4
p,S
20
mS
40
20
mS
Propagation Delay Time OE to a
(Enable)
TPEa
RL
=10K, CL=50pF
50
Propagation Delay Time OE to a
(Disable)
TPDa
RL= 10K, CL= 50pF
300
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
mS
11
60
p,S
nS
nS
Digit sequenc€ consists of all 16 DTMF tones.
Tone duration = 40mS, Tone pause = 40mS.
Nominal DTMF frequencies are used.
Both tones in the composite signal have an equal amplitude.
Tone pair is deviated by ± 1.5% ± 2Hz.
Bandwidth limited (3KHz) Gaussian Noise.
The precise dial tone frequencies are (350Hz and 440Hz) ± 2%.
For an error rate of better than 1 in 10000.
Referenced to lowest level frequency component in DTMF signal.
Minimum signal acceptance level is measured with specified maximum frequency deviation.
This item also applies to a third tone injected onto the power supply.
Referenced to Fig. 1 Input DTMF .tone level at - 28dBm.
c8SAMSUNG
'::Iectronics
220
CMOS INTEGRATED CIRCUIT
KT3170
PIN DESCRIPTION
Pin
Name
Description
1
IN+
Non inverting Input of the op amp.
2
IN-
Inverting Input of the op amp.
3
GS
Gain Select. The output used for gain adjustment of analog input
signal with a feedback resistor.
4
Vret
Reference Voltage output (VoD/2, Typ) can be used to bias the op amp
input of Voo/2.
5
hN
6
PON
Control input for the stand-by power down mode. Power down occurs
when the signal on this input is high states. This pin is pulled down
internally.
7, 8
OSC1
OSC2
Clock input/output. A inexpensive 3.579545MHz crystal connected
between these pins completes internal oscillator. Also, external clock
can be used.
Ground pin.
•
Input inhibit. High input states inhibits the detection of tones. This
pin is pulled down internally.
9
GND
10
OE
11-14
01-04
Three state data output. When enabled by OE, these digital outputs
provide the hexadecimal code corresponding to the last valid tone
pair received.
15
DSO
Delayed Steering Output. Indicates that valid frequencies have been
present for the required guard time, thus constituting a valid signal.
Presents a logic high when a received tone pair has been registered
and the output latch is updated. Returns to logic low when the
voltage on SIIGTO falls below Vrs .
16
ESO
Early Steering Outputs. Indicates detection of valid tone outputs a
logic high immediately when the digital algorithm detects a
recognizable tone pair. Any momentary loss of signal condition will
cause ESO to return to low.
17
SIIGTO
18
Voo
Output Enable input. Outputs 01-04 are CMOS push pull when OE is
High and open circuited (High impedence) when disabled by pulling
OE low. Internal pull up resistor built in.
Steering Input/Guard Time Output. A voltage greater than Vrs
detected at SI causes the device to register the detected tone pair
and update the output latch. A voltage less than Vrs frees the device
to accept a new tone pair. The GTO output acts to reset the external
steering time constant, and its state is a function of ESO and the
voltage on SI.
Power Supply ( + 5V, Typ)
c8SAMSUNG
Electronics
221
CMOS INTEGRATED CIRCUIT
KT3170
APPLICATION INFORMATION
The KT3170 is complete Touch-Tone detection system. It combines high precision active filter with analog circuits
and digital control logic on a monolithic CMOS chip. This application information describes device operation of
each block, performance and typically application circuit.
ANALOG INPUT CONFIGURATION
The KT3170 is designed to accept sinusoidal input waveforms but will operate satisfactorily with any input that
has the correct fundamental frequency. The input arrangement provides a differential input op amp, bias source
(reference voltage VREF) which is used to bias the inputs at mid-rail. Connection of a feedback resistor to the op
amp output (GS) makes gain of op amp adjust. The signal level at the input must be operated in power supply
range on the data sheet. In a single ended configuration, the input pins are connected as shown in application
circuit with unity gain and VREF biasing. In a differential ended configuration the input pins are connected as shown
in Fig. 2 with voltage gain (R5/R1).
IN+
Voo
IN-
SIfGTO
10nF
IN+
01
C1
INGS
GS
ESO
VREF
DSO
10nF
o-l
C2
IC
04
IC
03
OSC1
02
OSC2
01
GND
OE
A5
100K
R2
A3
37.5K
R2
60K
100K
VREF
R3= R2R5/(R2+ A5), VOLTAGE GAIN = R5/R1
INPUT IMPEDANCE: 2.JR1 2 + (1/WC)2
All resistors are 1% tolerance
All capacitors are 5% tolerance
Fig. 1 Single Ended Input Configuration
c8 SAIUISUNG
Electronics
All resistors are 1% tolerance
All capacitors are 5% tolerance
Fig. 2 Differential Ended Input Configuration
222
KT3170
CMOS INTEGRATED CIRCUIT
FILTER SECTION
After analog signal is passed op amp, separation of the low group and high group tones is achieved by applying
the DTMF signal to the inputs of two 9th-order switched capacitor band pass filter, the bandwidths of which
correspond to the low and high group frequencies. The band split filters are actually rejecting all frequencies except
the 16 DTMF tone pairs. The filter section also incorporates notches at 350 and 440Hz for exceptional dial tone
rejection as shown below. Each filter output is followed by a single order switched capacitor section which smoothes
the signals prior to limiting. Limiting is performed by high-gain comparator which are provided with hysteresis to
prevent detection of unwanted low level signals. The outputs of teh comparators provide full-rail logics swing at
the frequencies of the incoming DTMF signals.
•
10~-----------------~------------~------------------------~
m
~
20~--------------~------------~~~----------------------~
z
o
i=
«
:J
z
w
~
30~-------------.------------~~---+------------------------;
«
40r-------------.-------~~~-.------+_--~. .~------------__;
!x !
Y
I I ! It
A
B C
0
, ! !
E
F
G
,
2K
I
H
FREQUENCY (Hz)
PRECISE DIAL TONES
X==350Hz
Y==440Hz
DTMF TONES
A=697Hz
B=770Hz
C=852Hz
D==941Hz
E= 1209Hz
F== 1336Hz
G == 1477Hz
H == 1633Hz
Fig. 3 Typical Filter Characteristics
c8~SUNG
223
KT3170
CMOS INTEGRATED CIRCUIT
DECODER SECTION
Following the filter section is a decoder employing digital counting techniques to determine the frequencies
of the incoming tones and to verify that they correspond to standard DTMF frequencies. A complex averaging
algorithm protects against tone simulation by extraneous signals such as voice while providing tolerance to small
frequency deviations and variations.
The averaging algorithm has been developed to ensure an optimum combination of immunity to "talk-off" and
tolerance to the presence of interfering signals (third tones) and noise. When the detector recognizes the
simultaneous presence of two valid tones (known as "signal condition"), it raises the "Early Steering" flag (ESO).
Any loss of signal condition will cause ESO to fall.
OSCILLATOR SECTION
The KT3170 contains an on chip inverter with sufficient gain a feedback resistor Rf to provide oscillation when
connected to a low cost television "color-burst" crystal. The oscillator circuit is connected as shown in application
circuit. It is possible to operate several KT3170 devices employing only a Single crystal oscillator. The oscillator
output of the first devices in the chain is coupled through a 30pF capacitor to the oscillator input (OSC1) of the
next device, subsequent devices are connected in a simuliar fashion as shown Fig. 4. The problems for unbalanced
loading are not a concern with the arrangement shown, i.e., balancing capacitors are not required.
KT3170
KT3170
OSC1 1 - - - - + - - - - 1 1------fOSC1
CJ 3.579545MHz
OSC2
11:------~I
TO OSC1 of next KT3170
Fig. 4 Oscillator Connection
c8SAMSUNG
Electronics
224
KT3170
CMOS INTEGRATED CIRCUIT
STEERING CIRCUIT
Before registration of a decoded tone pair, the receiver checks for a valid signal duration. This check is performed by an external RC time constant driven by ESO. A logic high on ESO causes Vc (see Fig. 5) to rise as the
capacitor discharges. Providing signal condition is maintained (ESO remains high) for the validation period (tGTP),
VC reaches the threshold (VTST) of the steering logic to register the tone pair, thus latching its corresponding 4bits
code (see Table 1) into the output latch. At this point, the GTO output is activated and drives Vc to Voo. GTO continues to drive high as long as ESO remains high, finally after a short delay to allow the output latch to settle,
the "delayed steering" output flag (STO) goes high, signalling that a received tone pair has been registered. The
contents of the output latch are made available on the 4-bit output bus by raising the three-state control input
(OE) to a logic high. The steering circuit works in reverse to validate the interdigit pause between signals. Thus
as well as rejecting signals too short to be considered valid, the receiver will tolerate signal interruption (drop outs)
too short to be considered a valid pause. This capability, together with the capability of selecting the steering time
cOnstants externally, allows the designer to tailor performance to meet a wide variety of system requirements.
-----1~---VOD
C
tGTA
=RC IN (VVDD
)
TST
tGTP=(RC) IN (v
VOVD
)
DD - TST
Fig. 5 Basic Steering Circuit
DIGITAL OUTPUT
Outputs Q1-Q4 are CMOS push pull when enabled (EO = High) and open circuited (high impedance) when disabled
by pulling EO = Low. These digital outputs provide the hexadecimal code corresponding to the DTMF signals. The
table below describes the hexadecimal.
HIGH
NO
LOW
FREQUENCY
FREQUENCY
1
697
1209
OE
Q4
Q3
Q2
Q1
H
0
0
0
1
0
2
697
1336
H
0
0
1
3
697
1477
H
0
0
1
1
4
770
1209
H
0
1
0
0
5
770
1336
H
0
1
0
1
6
770
1477
H
0
1
1
0
7
852
1209
H
0
1
1
1
8
852
1336
H
1
0
0
0
9
852
1477
H
1
0
0
1
0
941
1336
H
1
0
1
0
*
941
1209
H
1
0
1
1
#
941
1477
H
1
1
0
0
A
697
1633
H
1
1
0
1
B
770
1633
H
1
1
1
0
C
852
1633
H
1
1
1
1
D
941
1633
H
0
0
0
0
ANY
-
-
L
Z
Z
Z
Z
Z: High Impedance
H: High Logic Level
L: Low Logic Level
c8SAMSUNG
Electronics
225
I
KT3170
CMOS INTEGRATED CIRCUIT
GUARD TIME ADJUSTMENT
In a situations which do not require independent selection of receive and pause, the simple steering of Fig. 5
is applicable. Component values are chosen according to the following formula:
tREe = top + tGTP, tGTP = 0.63RC
The value of top is a parameter of the device and tREe is the minimum signal duration to be recognized by thf::!
receiver. A value for C of 0.1J.'F is recommended for most application, leaving R to be selected by the designer.
For example, a suitable value of R for a tREe of 40 miliseconds would be 300K. A typical circuit using this steering
configuration is shown in Figure 1. The timing requirements for most telecommunication application are satisfied
with this circuits. Different steering arrangements may be used to select independently the guard times for tonepresent (tGTP) and tone-absent (tGTA). This may be necessary to meet system specifications which place both tone
duration and interdigit pause. Guard time adjustment also allows the designer to tailor system parameter such
as talk-off and noise immunity. Increasing tREe improves talk-off performance since it reduces the probability that
tones simulated by speech will maintain signal condition for long enough to be registered. On the other hand,
a relatively short tREe with a long too would be appropriate for extremely noisy environments where fast acquisition
time and immunity to drop-outs would be requirements. DeSign information for guard time adjustments is shown
in Figure 6.
0....-------,1
vooO>--------l' c
SI/GTO
0-----_---.
SIiGTOn-------~
R1~
R1
R2
ESO
0---------'
tGTP =(R1C)ln(VooiVoo - VTST)
tGTA = (RpC)ln(VooiVTST)
Rp = R1 R2/(R1 + R2)
(a) Decreasing tGTA(tGTP>tGTA)
ESO
cr------1-
R2
tGTP =(RpC)ln(VoolVoo - VTST)
tGTA =(R1 C)I n(VooiVTST)
Rp = R1R2/(R1 + R2)
(a) Decreasing tGTP(tGTP
a.
1001 0000
~
1OO00000}
0
-...J
~
0000 0000
ao
0001 0000
00100000
00110000
0100 0000
j
,.,.'
0101 0000
01100000
-
01110000
~
01111111
. /~
~
o
-VREF
-2-
+VREF
-2-
+VREF
ANALOG INPUT (VOLTS)
Fig. 8
D/A CONVERTER ~·Law Decoder) TRANSFER CHARACTERISTIC
-.... r-......
0111 1111
0111 0000
""""'" ~
01100000
~
01010000
01000000
,
\..
0011 0000
00100000
00010000
0000 0000\
10000000f
10010000
10100000
1011 0000
,
1100 0000
\.
1101 0000
11100000
"' -r--..
........
11110000
1111 1111
- VREF
-VREF
t--- 0.-
+ VREF
2
2
ANALOG OUTPUT (VOLTS)
Fig. 9
c8~SUNG
236
KT5116
CMOS INTEGRATED CIRCUIT
64KHz OPERATION, TRANSMITTER SECTION TIMING
t---------------125I'sec
--------------1
XMIT SYNC
1 MASTER
CLOCK
PERIOD
(MIN)
•
PCM DATA PRESENT
Fig. 10
Note: All rise and fail times are measured from O.4V and 2.4V. All delay times are measured from 1.4V.
64KHz OPERATION, RECEIVER SECTION TIMING
125I'sec------------~--;
JRCVSYNC
17 MASTER
-i
CLOCK
PERIODS
(MIN)
tRDS
~
tRDH
•
~O'V'Jit.Q'V\fi},QI\f\l0QfiflY'.{;Jtl'N0.QWI\Qw:A{;;;~lWv.Q1
11iit::J~tfi1:jEJVi:ti ~{iiJ ~ViJj ~~ ~'i:iiiEJ~ ~v:tli EJ \
Fig. 11
Note: All rise and fail times are measured from O.4V and 2.4V. All delay times are measured from 1.4V.
PCM SYSTEM BLOCK DIAGRAM
r-----------
KT5116
I
I
I
I
GAIN ADJUST
I
~'II
8
BAND
PASS
FILTER
TRANSMITTER
DIGITAL
MUX
(AID)
!
13
LOW
PASS
FILTER
RECEIVER
(D/A)
12
DIGITAL
DEMUX
TO
{
OTHER
CHANNELS
c8SAMSUNG
Electronics
DIGITAL
TRUNK
FROM
{
OTHER
CHANNELS
DIGITAL
TRUNK
237
KT5116
CMOS INTEGRATED CIRCUIT
SYSTEM CHARACTERISTICS TEST CONFIGURATION
r------------,
I
I
1.004KHz
SIGNAL
SOURCE
I
I
I
I
SYSTEM
I
I
IL _ _ _ _ _ _ _ _ _ _ _ . ,
NOUT
HP3551A
I
I
. I
1.004KHz
NOTCH
FILTER
I
FILTER
I
L _________________ ____ I
~
~
SOUT+NoUT
Fig. 12
Note: The ideal decoder consists of a digital decomponder and a 13-bit precision DAC.
PERFORMANCE EVALUATION
The equipment connections shown in Figure 12 can be used to evaluate the performance of the KT5116.
An analog signal provided by the HP3551 a transmission test set is connected to the Analog Input (Pin 1) of the
KT5116. The Digital Output of the CODEC is tied back to the Digital Input and the Analog Output is fed through
a low-pass filter to the HP3551A.
Remaining pins of the KT5116 are connected as follows:
1. RCV SYNC is tied to XMIT SYNC.
2. XMIT CLOCK is tied to Master CLOCK. The signal is inverted and tied to RCV clock.
The following timing signals are required:
1. Master CLOCK=2.048MHz
2. XMIT SYNC repetition rate=8KHz
3. XMIT SYNC width=8 XMIT CLOCK periods.
when all the above requirements are met, the set-up of Figure 12 permits the measurement of synchronous system
performance over a wide range of Analog Inputs.
The data register and' ideal decoder provide a means of checking the encoder portion of the KT5116 independently
of the decoder section. To test the system in the asynchronous mode, Master CLOCK should be separated from
RCV CLOCK. XM IT CLOCK and RCV CLOCK are separated also.
.
c8SAMSUNG
Electronics
238
CMOS INTEGRATED CIRCUIT
KT5116,
ANALOG INPUT
DEMO SET CIRCUIT'DIAGRAM
ANALOG OUTPUT
2.048MHz
,-----ID~-~
R6
11
•
5V
2K!l±1%
• Power Supply Ripple Rejection
C7
C6
C5
C4
+ 5V o"---1Ir--I~-I~-I~o-.o-5j.1-F-x-4----'1.o5j.1F
C3
GNDDo---~~~~~~~
GNDAQ-----------------+---------+-----.
-5VQ-----------------+-------~
NOTE: All unused input connected to GNDD or Vee, only in HCT series.
c8SAMSUNG
Electronics
239
KT8520/KT8521
CMOS INTEGRATED CIRCUIT
MONOLITHIC CODECS
The devices are monolithic PCM COOECs implemented
with high reliability CMOS technology. The KT8520 is
intended for wlaw applications and the KT8521 is
intended for A-law applications.
Integrated into the COOECs are circuits for signaling
interface, PCM time-slot control logic, analog-to-digital
(AID) conversion, and digital-to-analog (O/A) conversion.
The devices are intended to be used with. the KT3040
monolithic PCM filter which provides the input antialiasing function for the encoder and smoothes the
output of the decoder and corrects for the sinx/x
distortion introduced by the decoder sample and hold
output.
FEATURES
• Low power consumption: 45 mW (operation)
1 mW (standby)
• ± 5V power supplies.
• TTL compatible digital inputs and outputs
• Optional programmable time slot selection
• Internal sample and hold capacitors, auto zero
circuit
• KT8520: wlaw, 24 DIP
• KT8521: A·law, 22 DIP
• Synchronous or asynchronous operation
ORDERING INFORMATION
Device
KT8520N
Package
Operating Temperature
Plastic
KT8521N
Plastic
KT8520J
Ceramic
KT8521J
Ceramic
- 25 - + 125°C
BLOCK DIAGRAM
VFX---J~~~~----------I
SC2 t - - - - - - '
SAMPLE & HOLD
SUCCESSIVE
APPROXIMATION
REGISTER
DX
SC1
CLKx
CLKR
FSx
- FSR
- SIGx (KT8520 ONLY)
t-----t-_ghGR (KT8520 ONLY)
CLKc
PDN
c8SAMSUNG
Electronics
240
KT8520/KT8521
CMOS INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristic
Symbol
Value
Unit
Vee
V BB
Any Analog Input or Output
Any Digital Input or Output
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 secs)
Vee
V BB
Analog 1/0
Digital flO
Ta
Tstg
TL
7
-7
VBB - 0.3 to Vee + 0.3
GND - 0.3 to Vee + 0.3
-25 -+125
-65 - + 150
300
V
V
V
V
°C
°C
°C
DC ELECTRICAL CHARACTERISTICS
(Unless otherwise noted, Vee = 5.0V ± 5%, VBB = - 5.0V ± 5%, Ta = O°C to 70°C, typical characteristics specified
at Vee=5.0V, V BB = -5.0V, Ta=25°C. All signals referenced to GND.)
Characteristic
Symbol
Test Condition
Min
Typ
Max
Unit
POWER DISSIPATION
Operating Current, Vee
lee1
4.5
8.0
mA
Operating Current, Vss
Iss1
4.5
8.0
mA
Standby Current, Vee
Iceo
0.1
0.4
mA
Standby Current, VSB
ISBo
0.03
0.1
mA
10
p.A
0.6
V
DIGITAL INTERFACE
Input Current
h
O
-5V
III
III
>
«
z
o
(!l
Fig. 1
ABSOLUTE MAXIMUM RATINGS
Characteristic.
Symbol
Value
Unit
Vee to GNDA
VBB to GNDA
Voltage at Any Analog Input or Output
Voltage at Any Digital Input or Output
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 secs)
Vee
7
-7
V ee +0.3 to GNDA-0.3
V
V
V
V
-25 to + 125
-65 to + 150
300
°C
°C
°C
c8SAMSUNG
Electronics
VBB
A I/O
0110
Ta
Tstg
TL
Vee + 0.3 to VBB - 0.3
250
KT8554/KT8557
CMOS INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS
(Unless otherwise noted, Vee=5.0V±5%, VBB= -5.0V±5%, GNDA=OV, Ta=O°C to 70°C; typical characteristics
specified at Vee=5.0V, VBB = -5.0V, Ta=25°C; all signals referenced to GNDA.)
Characteristic
Symbol
Test Condition
Min
Typ
Max
Unit
Power Dissipation
Power-Down Current
leeO
No Load
0.5
1.5
mA
Power-Down Current
IBBO
No Load
0.05
0.3
mA
Active Current
lee1
No Load
6.0
9.0
mA
IBB1
No Load
6.0
9.0
mA
0.6
V
10
p.A
10
p.A
0.4
0.4
0.4
V
V
V
Active Current
Digital Interface
Input Low Voltage
VIL
Input High Voltage
VIH
Input Low Current
IlL
GNDA~VIN~VIL' all digital inputs
-10
Input High Current
IIH
VIH~VIN~Vee
-10
2.2
Output Low Voltage
VOL
Ox, k=3.2mA
SIG R, IL= 1.0mA
TS x, IL = 3.2mA, open drain
Output High Voltage
V OH
Dx, IH = - 3.2mA
SIG R, IH = - 1.0mA
2.4
2.4
Ox, GNDA~Vo~Vee
-10
Output Current in High Impedance
State (TRI-STATE)
loz
V
V
V
10
p.A
Analog Interface with Receive Filter
Output Resistance
RoRF
Pin VFRO
Load Resistance
RLRF
VFRO= ±2.5V
Load Capacitance
Output DC Offset Voltage
1
0
0
500
pF
-200
200
mV
200
CLRF
VOSRO
3
600
Analog Interface with Transmit Input Amplifier
Input Leakage Current
"XA
- 2.5V ~V ~ + 2.5V, VFxl + or VFxl-
-200
Input Resistance
RIXA
- 2.5V ~V ~ + 2.5V, VFxl + or VFxl-
10
Output Resistance
RoXA
Closed loop, unity gain
Load Resistance
RLXA
GSx
Load Capac itance
CLXA
GSx
VoXA
GSx,
Voltage Gain
AvXA
VFxl +to GSx
Unity Gain Bandwidth
FuXA
Offset Voltage
VosXA
Common-Mode Voltage
VeMXA
1
3
10
Output Dynamic Range
±2.8
CMRRXA>60dB
pF
V
VIV
5,000
1
0
KO
50
RL~ 10KO
nA
MO
2
MHz
-20
20
-2.5
2.5
mV
V
Common-Mode Rejection Ratio
CMRRXA
DC Test
60
dB
Power Supply Rejection Ratio
PSRRXA
DC Test
60
dB
c8SAMSUNG
Electronics
251
•
CMOS INTEGRATED CIRCUIT
KT8554/KT8557
TIMING CHARACTERISTICS
(Unless otherwise noted, Vee=5.0V±5%, VBB = -5.0V±5%, GNDA=OV, Ta=O°C to 70°C; typical characteristics
specified at Vee = 5.0V, VBB= -5.0V, Ta=25°C; all signals referenced to GNDA.)
Characteristic
Frequency of Master Clocks
Symbol
Test Condition
1/tPM
Depends on the device used and the
BClKR/ClKSEl Pin.
MClKx and MClKR
Min
Typ
Max
1.536
1.544
2.048
Unit
MHz
MHz
MHz
Rise Time of Bit Clock
tRB
tpB = 488ns
50
ns
Fall Time of Bit Clock
tFB
tpB =488ns
50
ns
Holding Time from Bit Clock
low to Frame Sync
tHBFL
long frame only
0
ns
Holding Time from Bit Clock
High to Frame Sync
tHOLO
Short frame only
0
ns
Set-Up Time from Frame Sync
to Bit Clock low
tSFB
long frame only
80
ns
Delay Time from BClKx High
to Data Valid
tOBo
load = 150pF plus 2 lSTTl loads
Delay Time to TSx low
hop
load = 150pF plus 2 lSTIl loads
Delay Time from BClKx low to
Data Output Disabled
toze
Delay Time to Valid Data from
FS x or BClKx, Whichever
Comes later
tOZF
Set-Up Time from DR Valid to
BClKR/x low
tSDB
50
ns
Hold Time from BClKR/x low to
DR Invalid
tHBo
50
ns
Delay Time from BClKR/x low
to SIG R Valid
tOFSSG
Set-Up Time from FSXlR to
BClKXlR low
tSF
CL=OpF to 150pF
180
ns
140
ns
50
165
ns
20
165
ns
0
load = 50pF plus 2 lSTIl loads
300
ns
Short frame sync pulse (1 or 2 bit
clock periods long) (Note 1)
50
ns
ns
Width of Master Clock High
tWMH
MClK x and MClKR
160
Width of Master Clock low
tWML
MClKx and MClKR
160
Rise Time of Master'Clock
tRM
MClKx and MClKR
50
ns
Fall Time of Master Clock
tFM
MClKx and MClKR
50
ns
Set-Up Time from BClKx High
(and FSx In long Frame Sync
Mode) to MClKx Falling Edge
tSBFM
Period of Bit Clock
ns
First bit clock after the leading
edge of FS x
tpB
485
488
15,725
ns
Width of Bit Clock High
tWBH
VIH=2.2V
160
ns
Width of Bit Clock low
tWBL
V1L =0.6V
160
ns
=82!'1SUNG
252
CMOS INTEGRATED CIRCUIT
KT8554/KT8557
TIMING CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
Min
Typ
Max
Unit
Hold Tir:ne from BCLKXlR Low
to FS XlR Low
tHF
Short frame sync pulse (1 or 2 bit
clock periods long) (Note 1)
100
ns
Hold Time from 3rd Period of
Bit Clock Low to Frame Sync
(FS x or FS R)
tHBFI
Long frame sync pulse (from 3 to
8 bit clock periods long)
100
ns
Minimum Width of the Frame
Sync Pulse (Low Level)
tWFL
64K bitls operating mode
160
ns
•
Note 1: For short frame sync timing, FS x and FS R must go high while their respective bit clocks are high.
TIMING DIAGRAM
TSx - - - - - - - - h
MCLKR
MCLKx
BCLKX
FSX _ _ _ _-...,;T
DX-----------~
FSR _ _ _ _ _ _-"
Fig. 2. Short Frame Sync Timing
qsSAMSUNG
Electronics
253
CMOS INTEGRATED CIRCUIT
KT8554/KT8557
TIMING DIAGRAM
FSx
SIGx
(Continued)
------'\/\I\/\/'\I\,I\/\I\I\I\/\I\/\)
Dx-----------N
Fig. 3 Long Frame Sync Timing
c8SAMSUNG
Electronics
254
KT8554/KT8557
CMOS INTEGRATED CIRCUIT
TRANSMISSION CHARACTERISTICS
(Unless otherwise specified: Ta = O°C to 70°C, Vee = 5V ± 5%, Vee = - 5V ± 5%, GNDA = OV, f = 1.02KHz,
V1N = OdBmO, transmit input amplifier connected for unity-gain non-inverting.)
Characteristic
Symbol
Test Condition
Max
Unit
-0.15
0.15
dB
-0.15
-0.35
-0.7
0.15
0.05
0
-14
dB
dB
dB
dB
Min
Typ
Amplitude Response
Receive Gain, Absolute
GRA
Receive Gain, Relative to GRA
GRR
Absolute Receive Gain Variation
with Temperature
Absolute Receive Gain Variation
with Supply Voltage
Ta=25°C, Vcc =5V, Vss = -5V
Input = Digital code sequence for
OdBmO signal at 1020Hz
f = OHz to 3000Hz
f=3300Hz
f=3400Hz
f=4000Hz
GRAT
Ta= O°C to 70°C
±0.1
dB
GRAV
Vcc =5V±5%, Ves= -5V±5%
±0.05
dB
Receive Gain Variations with
Level
GRRL
Sinusoidal test method; reference
input PCM code corresponds to an
Ideally encoded - 10dBmO signal
PCM level = - 40dBmO to + 3dBmO
PCM level = - 50dBmO to - 40dBmO
PCM level = - 55dBmO to - 50dBmO
Receive Output Drive Level
VRO
0.2
0.4
1.2
2.5
dB
dB
dB
V
Absolute Levels
AL
Max Overload Level
Transmit Gain, Absolute
Transmit Gain, Relative to GXA
Absolute Transmit Gain Variation
with Temperature
Absolute Transmit Gain Variation
with Supply Voltage
Transmit Gain Variations with
Level
tMAX
GXA
GXR
RL=6000
Nominal OdBmO level is 4dBm (6000)
OdBmO
Max overload level (3.17dBmO): KT8554
Max overload level (3.14dBmO): KT8557
Ta=25°C, Vcc =5V, Ves = -5V
Input at GSx = OdBmO at 1020Hz
f=16Hz
f=50Hz
f=60Hz
f=200Hz
f = 300Hz - 3000Hz
f=3300Hz
f=3400Hz
f=4000Hz
f = 4600Hz and up, measure
response from OHz to 4000Hz
-0.2
-0.4
-1.2
-2.5
-0.15
-1.8
-0.15
-0.35
-0.7
1.2276
Vrms
2.501
VPK
0.15
dB
-40
-30
-26
-0.1
0.15
0.05
0
-14
-32
dB
dB
dB
dB
dB
dB
dB
dB
dB
GXAT
Ta=O°C to 70°C
±0.1
dB
GXAV
Vcc =5V±5%, Ves= -5V±5%
±0.05
dB
GXRL
Sinusoidal
Reference
VFxl + = VFxl + = VFxl + = -
0.2
0.4
1.2
dB
dB
dB
c8SAMSUNG
Electronics
test method
level = -10dBmO
40dBmO to + 3dBmO
50dBmO to - 40dBmO
55dBmO to - 50dBmO
-0.2
-0.4
-1.2
255
•
CMOS INTEGRATED CIRCUIT
KT8554/KT8557
TRANSMISSION CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
Min
Typ
Max
Unit
180
200
p's
-40
-30
-25
-20
70
100
145
90
125
175
p's
p's
p's
p's
p's
290
315
p's
195
. 120
50
20
55
80
130
220
145
75
40
75
105
155
p's
p's
p's
p's
p's
p's
p's
8
11
dBrncO
-82
-79
dBmOp
Envelope Delay Distortion with Frequency
Receive Delay, Absolute
DRA
f= 1600Hz
Receive Delay, Relative to DRA
DRR
f=500Hz-1000Hz
f = 1000Hz -1600Hz
f = 1600Hz - 2600Hz
f = 2600Hz - 2800Hz
f = 2800Hz - 3000Hz
Transmit Delay, Absolute
DXA
f = 1600Hz
DXR
f = 500H z - 600Hz
f = 600Hz - 800Hz
f = 800Hz - 1000Hz
f= 1000Hz-1600Hz
f = 1600Hz - 2600Hz
f = 2600Hz -:.2800Hz
f = 2800Hz - 3000Hz
NRC
PCM code equals alternating
positive and negative zero, KT8554
Receive Noise, P Message
Weighted
Npp
PCM code equals, positive zero,
KT8557
Transmit Noise, C Message
Weighted
Nxc
KT8554
12
15
dBrncO
Transmit Noise, P Message
Weighted
Nxp
KT8557
-74
-67
dBmOp
Noise, Single Frequency
N Rs
f = OKHz to 100KHz, loop around
measurement, VFxl + = OV rms
-53
dBmO
Transmit Delay, Relative to DXA
Noise
Receive Noise, C Message
Weighted
Positive Power Supply Rejection,
Transmit
VFxl + =OV rms ,
PPSR x Vcc = 5.0V oc + 100mV rms
f = OKHz- 50KHz
40
dBC
Negative Power Supply Rejection,
Transmit
VFxl + = OV rms ,
NPSRx V BB = - 5.0V oc + 100mV rms
f = OKHz - 50KHz
40
dBC
Positive Power Supply Rejection,
Receive
PCM code equals positive zero
Vcc = 5.0Voc + 100mV rms
PPSR R f = OHz - 4000Hz
f = 4KHz - 25KHz
f = 25KHz - 50KHz
40
40
36
dBC
dB
dB
Negative Power Supply Rejection,
Receive
PCM code equals positive zero
VBB = - 5.0V oc + 100mVrms
NPSRR f = OHz - 4000Hz
f = 4KHz - 25KHz
f = 25KHz - 50KHz
40
40
36
dBC
dB
dB
c8~SUNG
256
CMOS INTEGRATED CIRCUIT
KT8554/KT8557
TRANSMISSION CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
SOS
Loop around measurement, OdBmO,
300Hz - 3400Hz input applied to
VFxl +, Measure individual image
signals at VFRO
4600Hz - 7600Hz
7600Hz - 8400Hz
8400Hz - 100,OOOHz
Spurious Out-ot-Band Signals
at the Channel Output
Min
Typ
Max
-32
, -40
-32
I
Unit
dB
dB
dB
Distortion
Signal to Total Distortion
STD x
Sinusoidal test method
Transmit or Receive
Half-Channel
STD R
Level = 3.0dBmO
= OdBmO to 30dBmO
= - 40dBmO XMT
RCV
= - 55dBmO XMT
RCV
Single Frequency Distortion,
Transmit
SFDx
-46
dB
Single Frequency Distortion,
Receive
SFD R
-46
dB
Intermodulation Distortion
IMD
Loop around measurement,
VF x + = -4dBmO to -21dBmO, two
frequencies in the range
300Hz - 3400Hz
-41
dB
Transmit to Receive Crosstalk,
OdBmO Transmit Level
CTX.R
f = 300Hz - 3400Hz
DR = Steady PCM code
-90
-75
dB
Receive to Transmit Crosstalk,
OdBmO Receive Level
CT R.x
f = 300Hz - 3400Hz, VFxl = OV
-90
-70
(Note 1)
dB
33
36
29
30
14
15
dBC
dBC
dBC
dBC
dBC
dBC
Crosstalk
Note 1. CT R.X is measured with a - 40dBmO activating signal applied at VFxl
+
ENCODING FORMAT AT Dx OUTPUT
wLaw KT8554
A·Law KT8557
10000000
10101010
VIN (at GSx)=OV
11111111
01111111
11010101
01010101
VIN (at GSx) = - Full - Scale
00000000
00101010
VIN (at GSx) =
+ Full - Scale
c8SAMSUNG
Electronics
257
I
KT8554/KT8557
CMOS INTEGRATED CIRCUIT
PIN DESCRIPTION
Pin No.
Symbol
Description
Negative power supply. Vss
= - 5V ± 5%.
1
Vss
2
GNDA
Analog ground. All signals are referenced to this pin.
3
VFAO
Analog output of the receive filter.
4
Vee
Positive power supply. Vee = + 5V ± 5%.
5
FS A
Receive frame sync pulse which enables BClK A to shift PCM data
into OA. FS A is an BKHz pulse train.
6
OA
Receive data input. PCM data is shifted into OA following the FS A
leading edge.
?
BClKAI
ClKSEl
The bit clock which shifts data into OA after the FSR leading edge.
Many vary from 64KHz to 2.04BMHz. Alternatively, may be a logic
input which selects either 1.536MHzl1.544MHz or 2.04BMHz for
master clock in synchronous mode and BClKx is used for both
transmit and receive directions.
B
MClKAI
PDN
Receive master clock. Must be 1.536MHz, 1.544MHz or 2.04BMHz.
May be asynchronous with MClKx, but should be synchronous with
MClKx for best performance. When MClKA is connected continously
low, MClK A is selected for all internal timing. When MClKA is
connected continuously high the device is powered down.
9
MCLKx
Transmit master clock. Must be 1.536MHz, 1.544MHz or 2.04BMHz.
May be asynchronous with MClK A.
10
BClKx
The bit clock which shifts out the PCM data on Ox. May vary from
64KHz to 2.04BMHz, but must be synchronous with MClKx.
11
Ox
The TRI·STATE PCM data output which is enabled by FS x.
12
FS x
Transmit frame sync pulse input which enables BClKx to shift
out the PCM data on Ox. FS x is an BKHz pulse train.
13
TS x
Open drain ouptut which pulses low during the encoder time slot.
GSx
Analog output of the transmit input amplifier.
Used to externally set again.
14
15
VFXI -
Inverting input of the transmit input amplifier.
16
VFXI +
Non·inverting input of the transmit input amplifier.
PIN CONNECTION
VBS
VFx l +
1
VFxlGSx
KT85541
KT855?
DA
6
BelKAI
ClKSEl
MClKAI
7
TSx
FSx
BClKx
PDN
c8SAMSUNG
Electronics
258
KT8554/KT8557
CMOS INTEGRATED CIRCUIT
APPLICATION CIRCUITS
Vee
VFxl+
GNDA
VFx l -
Vaa
-5V
KT85541
FROM SliC
GSx
ANALOG
PART
TO SliC
-FROM TSAC·
KT8557
VFRO
-
---
---------FSx
FSR
______ 1
FROM TSAC
DR
Dx
•
I
DIGITAL
PART
5V OR GNDA
PDN
BCLKR/CLKSEL
BCLKx
MCLKR/PDN
MCLKx
Note: XMIT
.
R1 + R2
galn=20xlog(~),
BCLKx (2.048MHzl1.544MHz)
(R1 +R2»10KO.
Fig. 4
c8SAMSUNG
Electronics
259
KT8555
CMOS INTEGRATED CIRCUIT
20 CERDIP
TIME SLOT ASSIGNMENT CIRCUIT
(TSAC)
The KT8555 is a per channel Time Slot Assignment Circuit (TSAC) that produces a-bit receive and transmit time
slots for 4 COMBO CODEC/Filters.
Each frame synchronization pulse may be independently
assigned to a time slot in a frame of up to 64 time slots.
FEATURES
•
•
•
•
•
•
•
•
Single, 5V operation
Low power consumption: 5mW
Controls 4 COMBO CODEC/Filters
Independent transmit and receive frame syncs and
enables
8 channel unidirectional mode
Up to 64 time slots per frame
Compatible with KT855417, KT856417, KT8520/1
CODECs
TTL and CMOS compatible
ORDERING INFORMATION
Device
Package
KT8555N
20 Plastic DIP
KT8555J
20 Ceramic DIP
Operating Temperature
-20 - +125°C
PIN CONFIGURATION
KT8555
c8SAMSUNG
Electronics
260
CMOS INTEGRATED CIRCUIT
KT8555
PIN DESCRIPTION
Pin
Name
Function
3
1
18
16
FSxO
FS x1
FS x2
FS x3
A frame sync output which is normally low, and goes active-high for 8 cycles of
BClK when a valid transmit time slot assignment is made.
4
2
19
17
FSRO
FS R1
FSR2
FS R3
A frame sync output which is normally low, and goes active-high for 8 cycles of
BClK when a valid receive time slot assignment is made.
5
TS x
This pin pulls low during any active transmit time slot. (N-channel open drain)
6
De
The input for an 8 bit serial control word. X is the first bit clocked in.
7
ClKe
8
CS
9
MODE
•
The clock input for the control interface.
The active-low chip select for the control interface.
Mode 1 = Open or Vee
Mode 2=Gnd
10
GND
Ground
11
BClK
The bit clock input
The transmit TSO sync pulse input. Must be synchronous with BClK.
12
XSYC
13
RSYdCH2
14
CH1
The input for the NSB (next significant bit) of the channel select word.
15
CHO
The input for the lSB (last significant bit) of the channel select word,
which defines the frame sync output affected by the following control word.
20
Vee
Power supply pin. 5V ± 5%
This input function is determined by the MODE input (Pin 9).
In mode 1 this input is the receive TSO sync pulse, RSYe, which must be
synchronous with BClK. In mode 2 this is the CH2 input for the MSB of the
channel select word.
c8SAMSUNG
Electronics
261
CMOS INTEGRATED CIRCUIT
KT8555
BLOCK DIAGRAM
Vee
p-----------------------------------~20~------------------------------~
6--------------------~~--------~
Receive
Assignment
Registers (4)
Time
Slot
Comparators
Receive
Output
Drivers
CHO
&
CH1
Control
RSYe/CH2
Control
Register
FSXO
Transmit
Assignment
6 , - - - - - - 1 Registers (4)
FSX2
FSx3
~------------------------------~10~--------------------------~
GND
ABSOLUTE MAXIMUM RATINGS
Characteristic
Symbol
Value
Unit
Vee to GND
Any Input Voltage
Any Output Voltage
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 secs)
Vee
VI
Vo
Ta
Tstg
TL
7.0
Vee + 0.3 - - 0.3
Vee +0.3 --0.3
-25-125
-65-150
300
V
V
V
°C
°C
°C
c8SAMSUNG
Electronics
262
CMOS INTEGRATED CIRCUIT
KT8555
ELECTRICAL CHARACTERISTICS
Characteristic
(Unless otherwise noted; Vcc=5.0V±5%, Ta=0°C-70°C)
Symbol
Test Condition
Operating Current
Icc
BCLK = 4.096MHz, All outputs open
Input Voltage High
VIH
Input Voltage Low
VIL
Min
1
111
All Inputs Except Mode, V IL
o
a:
o
-5V
0.1
OV
-
I);
co
....
CLKSEL ::.::
DR
~
TSx r - -
-
FSx r - - -
-
Ox
-
MCLKx~
BCLKx
PDN
O~
~
Vee
VFxl+
GNDA
Vee
!i
.."
.."
VFRO
rr-
FSx f - - Ox
FSR
r-- DR
I);
~x
TSx
co
t-
CLKSEL ::.:::
~
r--
VFx l - I - -
MCLKx
~
~
-
r---
r-
BCLKx H
PDN
VFxl+ I---
Vee
VFx l -
GNDA
Vee
VFRO
!i
.."
.."
t-
r--
r----
FSx
r--- r---
Ox
FSR
MCLKx
r--
DR
~
PON
K>
RCV
DATA
o
K;J 1-
XMT
DATA
~
~
GSx
co
CLKSEL ::.:::
-
f--
TSx
r-
BCLKx I-<~
Vee
GNDA
Vee
VFxl+
r--
VFxl-
I--
GSx
r--
!i
.."
.."
-
FSx ! - - Ox
FSR
II
<0
C\I
TSx f - -
co
VFRO
ICLKSEL ~
,--- DR
,...
MCLKx
r---
I
r-
BCLKx H
PDN
1
K>
CLK
-
:E
.."
.."
FSR
r--
Z
o
VFRO
~
r--
GSx ' - -
!i
-
i
en
Vee
+5V
w
VFxl+ I--VFx l -
GNDA
0.1*
c
C!J
W
t-
Vee
=i=
L-
r-
0
CD
OTHER
L- COMBOs
20K
"' ...
'Eca
TO
CD
C
:::;
5V
(I)
~
r--
..
e
L
2K
........
,
0
c
.c
u
c
en>-
5V
r--
~
FSx1
Vee
FSR1
FSR2
FSxO
il
FROM OTHER TSACs
FROM§
CONTROLLER
~
.."
.."
.."
TSx
DC
t::.:::
CLKe
CS
MODE
it)
it)
it)
~
XMT
SYN
RCV
SYN
CH1
SEL
CHO
SELE
---
K>
K>
~ GND
'ii
.~
Q.
~
ca
c
0
FSx2
FSRO
-
;t01
5V
co
(I)
FSR3
I
U
CD
FSx3
C
C
CHO
CH1 r - - RSYC/CH2 >--XSYC
BCLK
c
.2
n
I
0
~
CD
~
S
·61
C
C")
dl
~
"
en
11
2
::)
cn~
qp
KT8564/KT8567
CMOS INTEGRATED CIRCUIT
COMBO CODECS
The KT8564 and KT8567 are single-chip PCM encoders
and decoders (PCM COOECs), PCM line filter and
receive power amp.
These devices provide all the functions required to interface a full-duplex voice telephone circuit with a timedivision-multiplexed (TOM) system.
These devices are designed to perform the transmit enI coding and decoding as well as the transmit and receive
filtering functions in PCM system.
They are intended to be used at the analog termination
of a PCM line or trunk.
These devices provide the bandpass filtering of the analog signals prior to encoding and after decoding. These
combination devices perform the encoding and decoding of voice and call progress tones as well as the signalling and supervision information.
20 CERDIP
FEATURES
• Complete CODEC and filtering system
• Meets or exceeds 03/04 and CCITT specifications.
,....Law: KT8564 A·Law: KT8567
• On·chip auto zero, sample and hold and precision
voltage references.
• Receive push· pull power amplifiers
• Low power dissipation: 70mW (operating)
3mW (standby)
• ± 5V operation
• TTL or CMOS compatible
• Automatic power down
ORDERING INFORMATION
Device
KT8564N
Package
Operating Temperature
Plastic
KT8567N
Plastic
KT8564J
Ceramic
KT8567J
Ceramic
-25 -
+ 125°C
TYPICAL I-V CHARACTERISTICS
c8SAMSUNG
Electronics
268
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
ABSOLUTE MAXIMUM RATINGS
Characteristic
Symbol
Value
Unit
V
Vee to GNDA
Vee
7
Vee to GNDA
Vee
-7
V
Voltage at Any Analog Input or Output
110
Vee + 0.3 to Vee - 0.3
V
Voltage at Any Digital Input or Output
I/O
Vee +0.3 to GNDA-0.3
V
Operating Temperature Range
Ta
-25-+ 125
°C
Storage Temperature Range
Ts1g
-65-+150
°C
Lead Temperature (Soldering 10 secs)
Tl
300
°C
I
ELECTRICAL CHARACTERISTICS
=
(Unless otherwise noted: Vee 5.0V ± 5%, Vee = - 5V ± 5%, GNDA = OV, Ta = O°C to 70°C; typical characteristics
specified at Vee 5.0V, Ta 25°C; all signals are referenced to GNDA)
=
=
Characteristic
Symbol
Test Condition
Min
Typ
Max
Unit
Power Dissipation
Active Current
led1
Power amplifiers active, VPI = OV
7.0
10.0
mA
Active Current
lee 1
Power amplifiers active, VPI = OV
7.0
10.0
mA
Power-Down Current
leeo
0.5
1.5
mA
Power-Down Current
leeo
0.05
0.3
mA
Digital Interface
Itl
GNDA~V'N~V'l'
-10
10
p.A
Input High Current
I'H
V'H~V'N~Vee
-10
10
p.A
Output Current in High
Impedance State (TRI-STATE)
loz
Dx, GNDAsVoSVcc
-10
10
p.A
0.6
V
Input Low Current
Input Low Voltage
V'l
Input High Voltage
V'H
All digital inputs
2.2
Output Low Voltage
VOL
Dx, Il = 3.2mA
SIG R, k= 1.0mA
TS x, k = 3.2mA, Open Drain
Output High Voltage
VOH
Dx, IH = - 3.2mA
SIG R, IH = - 1.0mA
V
0.4
0.4
0.4
2.4
2.4
V
V
Analog Interface with Transmit Input Amplifier
I,XA
- 2.SV ~V ~ + 2.SV, VFxl + or VFxl -
-200
Input Resistance
R,XA
- 2.SV ~V ~ + 2.SV, VFxl + or VFxl-
10
Output Resistance
Input Leakage Current
1--
RoXA
Closed loop, unity gain
Load Resistance
RLXA
GSx
Load CapaCitance
CLXA
GSx
Output Dynamic Range
VoXA
GSx,
c82!'1SUNG
200
1
3
0
50
pF
10
RL~ 10KO
±2.8
nA
MO
KO
V
269
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
ELECTRICAL CHARACTERISTICS
Characteristic
(Continued)
Test Conditions
Symbol
Voltage Gain
AvXA
Unity-Gain Bandwidth
FuXA
Offset Voltage
VosXA
Common-Mode Voltage
VeMXA
VFxl + to GSx
Min
Max
5000
1
CMRRXA>60dB
Typ
Unit
VIV
2
MHz
-20
20
mV
-2.5
2.5
V
Common-Mode Rejection Ratio CMRRXA DC Test
60
dB
PSRRXA DC Test
60
dB
Power Supply Rejection Ratio
Analog Interface with Receive Filter
Output Resistance
Output DC Offset Voltage
Load Resistance
Load Capacitance
1---
RoRF
VOSRO
1
Pin VFRO
Measure from VFRO to GND A
RLRF
VFRO= ±2.5V
CLRF
Connect from VFRO to GND A
-200
3
0
200
mV
10
KO
25
pF
Analog Interface with Power Amplifiers
IPI
Input Leakage Current
Input Resistance
RIPI
Input Offset Voltage
Vlos
Output Resistance
ROP
Unity-Gain Bandwidth
Fe
---
-1.0V ~VPI~1.0V ~VPI~1.0V
-1.0V~VPI~1.0V
Gain from VPO - to VPO +
Power Supply Rejection of
Vee or VBB
CLP
GA p+
100
10
RL = 6000
RL = 3000
25
1
Open loop (VPO - )
KHz
100
500
1000
GNDA
mV
0
400
VPO+ or
VPO- to
RL=3000 VPO+ to GNDAlevel at
VPO- = -1.77Vrms (+3dBmo)
nA
MO
-25
Inverting unity gain at
VPO+ or VPORL~15000
Load Capacitance
-100
-1
pF
pF
pF
VIV
VPO - connected to VPI
PSRR p
OKHz-4KHz
OKHz-50KHz
60
36
dB
dB
Frequency of Master Clock
I/tpM
Depends on the device used and
the BCLKR/CLKSEL Pin
MCLKx and MCLKR
Width of Master Clock High
tWMH
MClKx and MClKR
160
ns
Width of Master Clock Low
tWML
MClKx and MClKR
160
ns
Rise Time of Master Clock
tRM
MCLKx and MCLKR
50
ns
Fall Time of Master Clock
tFM
MCLKx and MClKR
50
ns
Set-Up Time from BClKx High
(and FS x in Long Frame Sync
Mode) to MCLKx Falling Edge
tSBFM
Period of Bit Clock
First bit clock after the leading
edge of FS x
tpB
1.536
1.544
2.048
MHz
MHz
MHz
100
485
ns
488
15,725
ns
Width of Bit Clock High
tWBH
VIH=2.2V
160
Width of Bit Clock Low
tWBL
V 1L =0.6V
160
Rise Time of Bit Clock
tRB
tpB=480ns
50
ns
Fall Time of Bit Clock
tFB
tpB = 488ns
50
ns
c8SAMSUNG
Electronics
ns
ns
270
KT8564/KT8567
CMOS INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS
Characteristic
(Continued)
Test Conditions
Symbol
Min
Typ
Max
Unit
Holding Time from Bit Clock
Low to Frame Sync
tHBF
Long frame only
0
ns
Holding Time from Bit Clock
High to Frame Sync
tHOLO
Short frame only
0
ns
Set-Up Time for Frame Sync
to Bit Clock Low
tSFB
Long Frame Only
80
ns
Delay Time from BCLK x High
to Data Valid
tOBO
Load
=150pF plus 2 LSTTL loads
Load =150pF plus 2 LSTTL loads
0
Delay Time to TS x Low
txop
Delay Time from BCLKx Low
to Data Output Disabled
tOEc
Delay Time to Valid Data from
FS x or BCLK x,
whichever Comes Later
tOZF
Set-Up Time from
BCLK Rlx Low
DR
Valid to
=
CL OpF to 150pF
180
ns
140
ns
50
165
ns
20
165
ns
tSDB
50
ns
Hold Time from BCLK Rlx Low
to DR Invalid
IHBD
50
ns
Delay Time from BCLKRlx Low
to SIG R Valid
tDFSSF
Load
=50pF pius 2 LSTTL loads
300
ns
-- r----
Set-Up Time from FS XlR to
BCLK XlR Low
tSF
Short frame sync pulse
(1 or 2 bit clock periods 10ng)(Note 1)
50
ns
Hold Time from BCLKx1R Low
to FS X1R Low
tHF
Short frame sync pulse
(1 or 2 bit clock periods 10ng)(Note 1)
100
ns
Hold Time from 3rd Period of
Bit Clock Low to Frame Sync
(FS x of FS R)
tHBFI
Long frame sync pulse
(from 3 to 8 bit clock periods long)
100
ns
Minimum Width of the Frame
Sync Pulse (Low Level)
tWFL
64K bit/s operating mode
160
ns
Note 1: For short frame sync timing, FS x and FS R must go high while their respective bit clocks are high.
PIN CONFIGURATION
x
I
x
CD
CD
+
0
Cl.
>
c8SAMSUNG
Electronics
x
lL
>
(/)
>
~
I
0
Z
0
0
>
Cl.
lL
0::
>
0
a:
lL
>
<..)
0
>
a:
(/)
lL
x
o
a:
Cl
:s
l)
co
a:
~
..J
l)
co
Z
Cl
~
~
..J
l)
~
271
•
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
MCLKx
MCLKR
BLCKX
FSx
Ox
BCLKR
Fig. 2. Short Frame Sync Timing
MCLKX
MCLKR
BCLKx
FSx
Ox
Fig. 3 Long Frame Sync Timing
c8SAMSUNG
Electronics
272
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
PIN DESCRIPTION
Pin
Function
Name
1
VPO+
2
GNOA
Analog ground. All signals are referenced to this pin.
3
VPO-
The inverted output of the receive power amplifier.
4
VPI
5
VFRO
6
Vee
Positive power supply pin Vee = +5V±5%.
FS R
Receive frame sync pulse which enables BClKR to shift PCM data into
DR, FS R is an 8KHz pulse train. (refer to Fig 2 and 3 for timing details)
8
DR
Receive data input. PCM data is shifted into DR following the FS R
leading edge.
9
BClK R!
ClKSEl
The bit clo,ck which shifts data into DR after the FS R leading edge.
May vary from 64KHz to 2.048MHz. Alternatively, may be a logic input
which selects either 1.536MHzl1.544MHz or 2.048MHz for master clock
in synchronous mode and BClKx is used for both transmit and receive
directions. (see Table 1)
10
MClKR!
PON
Receive master clock. Must be 1.536MHz or 2.048MHz. May be
asynchronous with MClKx, but should be synchronous with MClKx
for best performance. When MClKR is connected continuously low,
MClKx is selected for all internal timing. When MClKR is connected
continuously high, the device is powered down.
11
MClKx
Transmit master clock. Must be 1.536MHz, 1.544MHz or 2.048MHz.
May be async~ronous with MClKR.
12
BClKx
The bit clock which shifts out the PCM data on Ox. May vary from
64KHz to 2.048MHz, but must be synchronous with MClKx.
13
Ox
The TRI·STATE PCM data output which is enabled by FS x.
14
FS x
Transmit frame sync pulse input which enables BClKx to shift out.the
PCM data a on Ox, FS x is an 8KHz pulse train. (refer to Fig 2, 3)
15
TSx
7
The non·inverted output of the receive power amplifier.
Inverting input to the receive power amplifier.
Also powers down both amplifiers when connected to VBS •
Analog output of the receive filter.
Open drain output which pulses low during the encoder time slot.
Analog loopback control input. Must be set to logic '0' for normal
operation. When pulled to logic '1', the transmit filter input is dis
connected from the output of the preamplifier and connected to the
VPO+ output of the receive power, amplifier.
16
ANlB
17
GSx
Analog output of the transmit input amplifier.
Used to externally set again.
18
VFxl-
Inverting input of the transmit input amplifier.
19
VFxl +
Non·inverting input of the transmit input amplifier.
20
VBB
Negative power supply pin VBB = :....5V±5%.
c8SAMSUNG .
E~ctromcs
I
273
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
TRANSMISSION CHARACTERISTICS
(Unless otherwise specified: Ta=O°C to 70°C, Vcc=5V±5%, VBB = -5V±5%, GNDA=OV, f=1.02KHz,
VIN = OdBmO, transmit input amplifier connected for unity-gain non-inverting.)
Characteristic
Symbol
Test Condition
Max
Unit
-0.15
0.15
dB
-0.15
-0.35
-0.7
0.15
0.05
0
-14
dB
dB
dB
dB
±0.1
dB
±O.05
dB
0.2
0.4
1.2
2.5
dB
dB
dB
V
Min
Typ
AMPLITUDE RESPONSE
Receive Gain, Absolute
G RA
Receive Gain, Relative to GRA
GRR
Absolute Receive Gain Variation
with Temperature
Absolute Receive Gain Variation
with Supply Voltage
Ta=25°C,'Vcc =5V, VBB = -5V
Input = Digital code sequence for
OdBmO signal at 1020Hz
f = OHz to 3000Hz
f=3300Hz
f = 3400Hz
f = 4000Hz
GRAT
Ta=O°C to 70°C
GRAV
Vcc =5V±5%, VBB = -5V±5%
Receive Gain Variations with
Level
GRRL
Sinusoidal test method; reference
input PCM code corresponds to an
Ideally encoded -10dBmO signal
PCM level = - 40dBmO to + 3dBmO
PCM level = - 50dBmO to - 40dBmO
PCM level = - 55dBmO to - 50dBmO
Receive Filter Output at VFRO
VRO
Absolute Levels
AL
Max Transmit Overload Level
tMAX
Transmit Gain, Absolute
GXA
RL= 100
Nominal OdBmO level is 4dBm (6000)
OdBmO
Max transmit overload level
KT8564(3. 17d BmO), KT8567(3.14dBmO)
Ta=25°C, Vcc =5V, VBB = -5V
Input at GSx = OdBmO at 1020Hz
f=16Hz
f = 50Hz
f=60Hz
f = 200Hz
f = 300Hz - 3000Hz
f = 3300Hz
f=3400Hz
f=4000Hz
f = 4600Hz and up, measure
Response from OHz to 4000Hz
-0.2
-0.4
-1.2
-2.5
-0.15
-1.8
-0.15
-0.35
-0.7
1.2276
Vrms
2.501
2.492
VPK
0.15
dB
-40
-30
-26
-0.1
0.15
0.05
0
-14
-32
dB
dB
dB
dB
dB
dB
dB
dB
dB
Transmit Gain, Relative to G XA
GXR
Absolute Transmit Gain Variation
with Temperature
GXAT
Ta = O°C to 70°C
± 0.1
dB
Absolute Transmit Gain Variation
with Supply Voltage
GXAV
Vcc =5V±5%, VBB= -5V±5%
±0.05
dB
GXRL
Sinusoidal test method
Reference level = - 10dBmO
VFxl + = - 40dBmO to + 3dBmO
VFxl + =- 50dBmO to - 40dBmO
VFxl + = - 55dBmO to - 50dBmO
0.2
0.4
1.2
dB
dB
dB
Transmit Gain Variations with
Level
c8SAMSUNG
Electronics
-0.2
-0.4
-1.2
274
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
TRANSM ISSION CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
Min
Typ
Max
Unit
ENVELOPE DELAY DISTORTION WITH FREQUENCY
Transmit Delay, Absolute
DXA
f = 1600Hz
290
315
itS
Transmit Delay, Relative to DXA
DXR
f = 500Hz - 600Hz
f = 600Hz - 800Hz
f = 800Hz -1000Hz
f = 1000Hz -1600Hz
f = 1600Hz - 2600Hz
f = 2600Hz - 2800Hz
f = 2800Hz - 3000Hz
195
120
50
20
55
80
130
220
145
75
40
75
105
155
its
its
itS
itS
itS
itS
its
Receive Delay, Absolute
DRA
f = 1600Hz
180
DRR
f = 500Hz -1000Hz
f = 1000Hz-1600Hz
f = 1600Hz- 2600Hz
f = 2600Hz - 2800Hz
f = 2800Hz - 3000Hz
Transmit Noise, C Message
Weighted
N xc
Transmit Noise, P Message
Weighted
200
itS
-25
-20
70
100
145
90
125
175
itS
its
its
its
itS
VFxl + = OV, KT8564
12
15
dBrncO
Nxp
VFxl + = OV, KT8567
-74
-67
dBmOp
Receive Noise, C Message
Weighted
NRC
PCM code equals alternating
positive and negative zero, KT8564
8
11
dBrncO
Receive Noise, P Message
Weighted
N RP
PCM code equals positive zero,
K"T8567
-82
-79
dBmOp
Noise, Single Frequency
N Rs
f = OKHz to 100KHz, loop around
measuremenr, VFxl += OV rms
-53
dBmO
Receive Delay, Relative to DRA
-40
-30
NOISE
Positive Power Supply Rejection,
Transmit
VFxl + = OV rms,
PPSR x Vcc = 5.0V oc + 100mV rms
f = OKHz - 50KHz
40
dBC
Negative Power Supply Rejection,
Transmit
VFxl + =OV rms ,
NPSRx VBB = - 5.0V oc + 100mV rms
f = OKHz - 50KHz
40
dBC
Positive Power Supply Rejection,
Receive
PCM code equals positive zero
Vcc = 5.0V oc + 100mV rms
PPSR R f = OHz - 4000Hz
f = 4KHz - 25KHz
f = 25KHz - 50KHz
40
40
36
dBC
dB
dB
Negative Power Supply Rejection,
Receive
PCM code equals positive zero
V BB = - 5.0V oc + 100mV rms
NPSR R f = OHz - 4000Hz
f = 4KHz - 25KHz
f = 25KHz - 50KHz
40
40
36
dBC
dB
dB
c8SAMSUNG
Electronics
275
•
KT8564/KT8567
CMOS INTEGRATED CIRCUIT
TRANSMISSION CHARACTERISTICS
Characteristic
(Continued)
Symbol
Test Condition
SOS
Loop around measurement, OdBmO,
300Hz - 3400Hz input applied to
VFxl + , measure individual image
signals at VFRO
4600Hz - 7600Hz
7600Hz - 8400Hz
8400Hz - 100,OOOHz
Spurious Out-of-Band Signals
at the~hannel Output
Min
Typ
Max
Unit
-32
-40
-32
dB
dB
dB
Distortion
Signal to Total Distortion
STDx
Sinusoidal test method
Transmit or Receive
Half-Channel
STD R
Level = 3.OdBmO
= OdBmO to 3OdBmO
= -40dBmO XMT
RCV
= - 55dBmO XMT
RCV
Single Frequency Distortion,
Transmit
SFDx
-46
dB
Single Frequency Distortion,
Receive
SFD R
-46
dB
-41
dB
-90
-75
dB
-90
-70
(Note 1')
dB
33
36
29
30
14
15
dBC
dBC
dBC
dBC
dBC
dBC
IMD
Loop around measurement,
VFx + :::: - 4dBmO to - 21dBmO, two
frequencies in the range
300Hz - 3400Hz
Transmit to Receive Crosstalk
CTX.R
f = 300Hz - 3400Hz
DR = Steady PCM code
Receive to Transmit Crosstalk
CTR.X
f = 300Hz - 3000Hz, VFxl = OV
VOL
Balanced load, RL connected
between VPO + and VPORL=600n
RL= 1200n
RL=30Kn
3.3
3.5
4.0
Vrms
Vrms
Vrms
RL = 6oon, OdBmO
50
dB
Intermodulation Distortion
Crosstalk
Power Amplifiers
Maximum OdBmO Level for
Better than ± 0.1dB Linearity
Over the Range -10dBmO to
+3dBmO
Signal/Distortion
SlOp
Note 1. CTR.X is measured with a -50dBmO activating signal applied at VFxl +.
c8SAMSUNG
Electronics
276
CMOS INTEGRATED CIRCUIT
KT8564/KT8567
SELECTION OF MASTER CLOCK FREQUENCIES
MASTER CLOCK FREQUENCY SELECTED
BCLKRlCLKSEL
KT8564
KT8567
Clocked
1.536MHz or 1.544MHz
2.048MHz
0
2.048MHz
1.536MHz or 1.544MHz
1 (or open circuit)
1.544MHz
2.048MHz
•
ENCODING FORMAT AT Ox OUTPUT
KT8564 {J,t-Law)
KT8567 (A-Law, Includes Even Bit Inversion)
VIN = + Full Scale
10000000
1 01 0 1 0 1 0
VIN=OV
11111111
01111111
11010101
01010101
VIN = - Full Scale
00000000
00101010
APPLICATION CIRCUIT
R1
R2
300
Vss
0.1
600
GNDA
KT85641KT8567
0.1
+5V
Vee
300
Note 1: Transmit gain = 20 x
R3
R4
IOg(R1R~ R2),(R1 + R2)~ 10Kn
Note 2: Receive gain = 20 x log(2 ~:\R4~ 10KO
c8SAMSUNG
Electronics
277
LM567C
LINEAR INTEGRATED CIRCUIT
TONE DECODER
8 DIP
The LM567C is a monolithic phase locked loop system designed to provide a saturated transistor switch to GND, when an input signal is present
within the passband. External components are used to independently
set center frequency bandwidth and output delay.
FEATURES
•
•
•
•
•
•
Wide frequency range (O.01Hz - 500kHz).
Bandwidth adjustable from 0 to 14%
logic compatible output with 100mA current sinking capability.
Inherent Immunity to false signals.
High rejection of out-of-band Signals and noise.
Frequency range adjustable over 20:1 range by an external
resistor.
8 SOP
APPLICATIONS
•
•
•
•
•
•
•
Touch Tone Decoder
Wireless Intercom .
Communications paging decoders
Frequency monitoring and control.
Ultrasonic controls (remote TV etc.)
Carrier current remote controls.
Precision oscillator.
ORDERING INFORMATION
Device
Package
LM567CN
8 DIP
LM567CD
8 SOP
Operating Temperature
0- + 70°C
SCHEMATIC DIAGRAM
c8SAMSUNG
Electronics
278
LINEAR INTEGRATED CIRCUIT
LM567C
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
Characteristic
Operating Voltage
Input Voltage
Output Voltage
IPower Dissipation
Operating Temperature
Storage Temperature
Symbol
Vee
VIN
Vo
Pd
Topr
Tstg
-10
Value
Unit
10
V
V
~Vee+0.5
V
15
300
mW
°C
°C
O~+70
-65-+150
I
ELECTRICAL CHARACTERISTICS
(Vec=5.0V, Ta=25°C unless otherwise specified)
Characteristic
Operating Voltage Range
Supply Current Quiescent
Supply Current Activated
Quiescent Power Dissipation
Symbol
Vee
lee-1
lee-2
PaD
Test Conditions
Min
Typ
4.75
5.0
7
12
35
c-----500
±60
0.7
RL =20K
--~--
Highest Center Frequency
Center Frequency Stability
Center Frequency Shift
With Supply Voltage
H Fo
FSE
R L =20K
OOC to 70°C
100
Fcs
-~
Largest Detection Bandwidth
Largest Detection B.w Skew
Largest Detection Bandwidth
Variation With Supply Voltage
Largest Detection Bandwidth
Variation With Temperature
I
RIN
VIN-1
I
V
rnA
rnA
mW
-~
KHz
ppm/oC
2
%/V
18
3
±5
% otto
% of 10
%/V
%/OC
±0.1
20
IL =100mA, fi=fo
20
V IN -2
Greatest Simultaneous
Outband Signal To Inband
Signal Ratio
Minimum Input Signal to
Wideband Noise Ratio
S1/Sd
Fastest On-Off Cycling Rate
Output Leakage Current
Four
c8SAMSUNG
Electronics
9.0
10
15
Unit
I
--
Input Resistance
Output Fall Time
Output Rise Time
14
2
±2
B.wt
Smallest Detectable
Input Voltage
Largest No Output
Input Voltage
Output Saturaton Voltage
Max
---t--~
10
B.w
B.ws
B.wv
I
S2/Sd
leo
VSAr-1
Vsw 2
TF
TR
10
R L =20k
VIN = 300mVRMS
fi=fo=100KHz
fi1 =140KHz
fi 2 =60KHz
R L =20K
VIN = 25mVRMS
k =30mA, VIN = 25mVrms
IL =100mA,
R L =50
RL =50
VIN = 25mVrms
1--I
Kohm
25
mVrms
15
mVrms
+6
dB
-6
dB
--c------10/20
0.01
25
0.2
0.6
30
150
0.4
1.0
pA
V
V
nS
nS
279
LM567C
LINEAR INTEGRATED CIRCUIT
CIRCUIT DESCRIPTION
BLOCK DIAGRAM
The LM567C monolithic tone decoder consists of a phase detector, low
pass filter, and current controlled oscillator which comprise the basiC
Output 1
Filter
phase-locked loop, plus an additional low pass filter and quadrature
detector enabling detection on in-band signals. The device has a
Low Pass
normally high open collector output capable of sinking 100 mAo
Loop Filter 2
The input signal is applied to Pin 3 (20 kO nominal input resistance). Free
running frequency is controlled by an RC network at Pins 5 and 6 and
can typically reach 500 kHz. A capacitor on Pin 1 serves as the output
filter and eliminates out-of-band triggering. PLL filtering is accomplished
with a capacitor on Pin 2; bandwidth and skew are also dependant upon
the circuitry here. Bandwidth is adjustable from 0% to 14% of the center
frequency. Pin 4 is +Vcc (4.75 to 9V nominal, 10V maximum); Pin 7 is
ground; and Pin 8 is open collector output, pulling low when an in-band
signal triggers the device.
Fig. 1
DEFINITION OF LM567C PARAMETERS
CENTER FREQUENCY fo
fa is the free-running frequency of the CL controlled oscillator with no input Signal. It is determined by resistor R1 between
pins 5 and 6, and capacitor C l from pin 6 to ground fa can be approximated by
fo:::::_1-
R 1C l
where R1 is in ohms and C 1 is in farads.
LARGEST DETECTION BANDWIDTH
The largest detection bandwidth is the largest frequency range within which an input signal above the threshold voltage will cause a logical zero state at the output. The maximum detection bandwidth corresponds to the lock range of the PLL.
DETECTION BANDWIDTH (BW)
The detection bandwidth is the frequency range centered about to. within which an input signal larger than the threshold
voltage (typically 20mVrms) will cause a logic zero state at the output. The detection bandwidth corresponds to the capture
range of the PLL and is determined by the low-pass bandwidth filter. The bandwidth of the filter, as a percent of fa, can
be determined by the approximation
BW=1070
j
Vi
f OC2
where Vi is the input signal in volts, rms, and C2 is the capacitance at pin 2 in p,F.
DETECTION BAND SKEW
The detection band skew is a measure of how accurately the largest detection band is centered about the center frequency,
It is defined as (fmax +fmin -2fo)/fo, where fmax and f min are the frequencies corresponding to the edges of the detection
band. If necessary, the detection band skew can be reduced to zero by an optional centering adjustment.
fa.
c8SAMSUNG
Electronics
280
LINEAR INTEGRATED CIRCUIT
LM567C
PIN DESCRIPTION
OUTPUT FILTER -
C3 (Pin 1)
Capacitor C3 connected from pin 1 to ground forms a simple low-pass post detection filter to eliminate spurious outputs
due to out-of-band signals. The time constant of the filter can be expressed as T3 =R 3C3, where R3 (4.7kO) is the internal
impedance at pin 1.
The precise value of C3 is not entical for most applications. To eliminate the possibility of false triggering by spurious
signals, it is recommended that C3 be ~ 2 C 2, where C2 is the loop filter capacitance at pin 2.
If the value of C 3 becomes too large, the turn-on 200mV rms. Then, as noted on the graph, bandwidth will be controlled
solely by the foC 2 product.
3. Capacitor C3 sets the band edge of the low-pass filter which attenuates frequencies outside of the detection band and
thereby eliminales spurious outputs. If C3 is too small, frequencies adjacent to the detection band may switch the output
stage off and on at the beat frequency, or the output may pulse off and on during the turn-on transient. a typical
minimum value of C 3 is 2 C2 .
Conversely, if C 3 is too large, turn-on and turn-off of the output stage will be delayed until the voltage across C3 passes
the threshold value.
PRINCIPLE OF OPERATION
The LM567C is a frequency selective tone decoder system based on the phase-locked loop (PLL) principle. the system
is comprised of a phase-locked loop, a quadrature AM detector, a voltage comparator, and an output logic driver. The four
sections are internally interconnected as shown in Figure 1.
When an input tone is present within the pass-band of the circuit, the PLL synchronizes or "locks" on the input signal.
The quadrature detector serves as a lock indicator: when the PLL is locked on an input signal, the dc voltage at the output of
the detector is shifted. This dc level shift is then converted to an output logic pulse by the amplifier and logic driver. The
logic driver is a "bare collector" transistor stage capable of switching 100 mA loads.
The logic output at pin 8 is normally in a "high" state, until a tone that is within the capture range of the decoder is present
at the input. When the decoder is locked on an input signal, the logic output at pin 8 goes to a "low" state.
The center frequency of the detector is set by the free-running frequency of the current-controlled oscillator in the PLL.
This free-running frequency, fa. is determined by the selection of R1 and C 1 connected to pins 5 and 6, as shown in
Figure 3. The detection bandwidth is determined by the size of the PLL filter capacitor, C2 ; and the output response speed
is controlled by the output filter capacitor, C3
c8SAMSUNG
Electronics
282
LINEAR INTEGRATED CIRCUIT
LM567C
TYPICAL CHARACTERISTICS
CENTER FREQ. VS TEMPERATURE
TYP. BW VS TEMPERATURE
15
+2
lz
14
12
Vee.
+1
4.7SV
2
!c
iE
!II
Iii
10
............
i
Vee ..
0
5.75V
f
II:
0
8
I
6_
t.
!Z - 1
4_~
~
-2
2-
VCC=7.0V
- 25
75
50
25
-25
BW VS CENTER FREQUENCY
15
300
Ii:'
_200
100
75
25
TEMPERATURE rCI
BW VS INPUT VOLTAGE.
i
I
- ......... -r---r---
............
r---
100
TEMPERATURE rC)
-..
--
r---
W
~
~
~
~
::!
~
;
~
""
~
~
~
.:1
~
""'"
~
::!
10
~
'15
t.
i
I
!;
'"
"
i'
Go
i!E 100
0
10
12
14
100
16
lK
10K
1001(
1M
CENTER FIEQUENCY. ~
_(.,..orfo)
CURRENT DRAIN va vee
BW (C2, C3 atARCI'.)
25
20
.~~
15
1'\t':
ij
10
1\ ~
C2~ f'.. i'-....
'"
r-- r--......
r---
10
c8SAMSUNG
Electronics
12
14
16
Vcc(V)
283
LM567C
LINEAR INTEGRATED CIRCUIT
OUTPUT SATURATION VOLTAGE
VS AMBIENT TEMPERATURE
OPERATING CYCLE VS BANDWIDTH
1000
500
1.0
'\.
"\A
1,\
200
V~.5V. t.25.6 I 1 __ r----.A: Bandwidth limited by CI -
8: Bandwidth Hmlted by
E
!l
~ "r\.
g
~~ ~
external resistor
0.6
~
{Minimum CII
w 100
50
0.8
r-----
~
t
--
" "~
I~ i'--
0.4
_Vv
r'jl';'iOOmA
~
~
"
20
0.2
I"
10
10
50
20
/
---. -25
100
BANDWIDTH (~ or 101
~
t--
~
Il-30mA
25
50
75
100
BANDWIDTH (OC)
AC TEST CIRCUIT
+5V
LM567C
Vin
+5V
fi=100KHz
Note: Adjust for fo=100KHz
Fig. 2
c8SAMSUNG
Electronics
284
LM567C
LINEAR INTEGRATED CIRCUIT
APPLICATION CIRCUIT
(b) 2·Phase Oscillator
(8) Touch Tone Decoder
LM567C
Digit
RL
2
LM567C
3
6
5
3
Rl
RL>lK
I
4
::+; Cl
6
(c) variable Oscillator
7
RL
8
LM567C
6
5
0.51'F
·200mVrms
o--f
10
Rl
(d) Frequency Doubler
RL
LIlJU2to
LM567C
2
6
LrL
RL
C2~
c8~SUNG
to
;:hC1
285
LM567L
LINEAR INTEGRATED CIRCUIT
MICROPOWER TONE DECODER
a DIP
The LM567L is a micropower phase-locked loop (PLL) circuit designed
for general purpose tone and frequency decoding. In applications requiring very low power dissipation, the LM567L can replace the popular 567 type decoder with only minor component valu~ changes. The
LM567L offers approximately 1/10th the power dissipation of the conventional567 type tone decoder, without sacrificing its key features such as
the oscillator stability, frequency selectivity, and detection threshold.
Typical quiescent power dissipation is less than 4mW at 5 volts.
a SOP
FEATURES
•
•
•
•
•
•
•
•
Very low power dissipation (4mW at 5V)
Bandwidth adjustable from 0 to 14% of fo
Logic compatible output with 10mA current sinking capability.
Highly stable center frequency.
Center frequency adjustable from O.01Hz to 60KHz.
Inherent immunity to false signals.
High rejection of out-of-band signals and noise.
Frequency range adjustable over 20:1 range by external resistor.
APPLICATIONS
• Battery-operated tone detection • Touch-tone decoding
• Sequential tone decoding
• Communications paging
• Ultrasonic remote-control
• Telemetric decoding
ORDERING INFORMATION
Device
Package
LM567LN
8 DIP
LM567LD
8 SOP
Operating Temperature
0-+ 70°C
SCHEMATIC DIAGRAM
c8SAMSUNG
Electronics
286
LINEAR INTEGRATED CIRCUIT
LM567L
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
Characteristic
Power Supply
Power Dissipation
Plastic Package
Derate Above +25°C
Operating Temperature
Storage Temperature
Symbol
Value
Uni\
Vee
10
V'
Pd
300
2.5
0- +70
-65 - +150
mW
mW/oC
°C
°C
Topr
Tstg
ELECTRICAL CHARACTERISTICS
(Vee = +5V, Ta.=25°C, unless otherwise specified)
Characteristic
Symbol
Test Conditions
Vee
Supply Current/Quiescent
Supply Current/Activated
lee-2
RL= 20KO,
RL = 20KO, V1N = 300mV rms, f; = to
Highest Center Frequency
H,o
R1 =3KO-5KO
Center Frequency Drift
Temperature
0 200mV rms . Then, as noted on the graph, bandwidth will be
controlled solely by the fo C2 product.
3. Capacitor C3 sets the band edge of the low-pass filter which attenuates frequencies outside of the detection band
and thereby eliminates spurious outputs. If C3 is too small, frequencies adjacent to the detection band may switch
the output stage off and on at the beat frequency, or the output may pulse off and on during the turn-on transient.
A typical minimum value for C3 is 2 C2.
Conversely, if C3 is too large, turn-on and turn-off of the output stage will be delayed until the voltage across C3
passes the threshold value.
PRECAUTIONS
1. The LM567L will lock on signals near (2n+1) fo and produce an output for signals near (4n+1) fa, for n=O, 1,2 etc.
Signals at 5 fo and 9 fo can cause an unwanted output and should, therefore, be attenuated before reaching the input
of the circuit.
2. Operating the LM567L in a reduced bandwidth mode of operation at input levels less than 200mVrms results in
maximum immunity to noise and out-band signals. Decreased loop damping, however, causes the worst-case lock-up
time to increase, as shown by the graph of Fig 13.
c8SAMSUNG
Electronics
291
I
LM567L
LINEAR INTEGRATED CIRCUIT
3.
Bandwidth variations due to changes in the in-band signal amplitude can be eliminated by operating the LM567L
in the high input level mode, above 200mV nns• The input stage is then limiting, however, so that out-band signals
.or high noise levels can cause an apparent bandwidth reduction as the in-band signal is suppressed. In addition,
the limited input stage will create in-band components from subharmonic signals so that the circuit becomes sensitive to signals at fot3, fot5 etc.
4. Care should be exercised in lead routing and lead lengths should be kept as short as possible. Power supply leads
should be properly bypassed close to the integrated circuit and grounding paths should be carefully determined to
avoid ground loops and undesirable voltage variations. In addition, circuits requiring heavy load currents should be
provided by a separate power supply, or filter capacitors increased to minimize supply voltage variations.
OPTIONAL CONTROLS
PROGRAMMING
Varying the value of resistor R1 and/or capacitor C1 will change the center frequency. The value of R1 can be changed
either mechanically or by solid state switches. Additional C1 capacitors can be added by grounding them through saturated
npn transistors.
SPEED OF RESPONSE
The minimum lock-up time is inversely related to the loop frequency. As the natural loop frequency is lowered, the turn-on
transients becomes greater. Thus maximum operating speed is obtained when the value of capacitor C2 is minimum. At
the instant an input signal is applied, its phase may drive the oscillator away from the incoming frequency rather than toward
it. Under this condition, the lock-up transient is in a worst case situation, and the minimum theoretical lock-up time will not
be achievable.
The following expressions yield the values of C2 and C3, in microfarads, which allow the maximum operating speeds
for various center frequencies where fo is Hz.
13
C2= - ,
fo
26
C3=
fo
IlF
The minimum rate that digital information may be detected without losing information due to turn-on transient or output
chatter is about 10 cycles/bit, which corresponds to an information transfer rate of fol10 baud. In situations where minimum
turn-off is of less importance than fast turn-on, the optional sensitivity adjustment circuit of Fig 5 can be used to bring
the quiescent C3 voltage closer to the threshold voltage. Sensitivity to beat frequencies, noise, and extraneous signals,
however, will be increased.
+v
~, ~A
l:::Jt,
1
DECREASE
SENSITIVITY
,
+V
DECREASE
SNESITIVITY
LM567L
LM567L
INCREASE
SENSITIVITY
1'C3
INCREASE
SENSITIVITY
R
SILICON
DIODES FOR
TEMPERATURE
COMPENSATION
(OPTIONAL)
Fig. 5. Adjustable Sensitivity Connections
c8~SUNG
292
LM567L
LINEAR INTEGRATED CIRCUIT
CHATTER
When the value of C3 is small, the lock transient and ac components at the lock detector output may cause the output
stage to move through its threshold more than once, resulting in output chatter.
Although some loads, such as lamps and relays will not respond to chatter, logic may interpret chatter as a series of output
signals. Chatter can be eliminated by feeding a portion of the output back to the input (Pin 1) or, by increasing the size of
capacitor C3. Generally, the feedback method is preferred since keeping C3 small will enable faster operation. Three
alternate schemes for chatter prevention are shown in Fig 6. Generally, it is only necessary to assure that the feedback time
constant does not get so large that it prevents operation at the highest anticipated speed.
+v
+v
+v
+V
RL.
LM567L
t2K~"K_
RL
LM567L
CI
Rf
lOOK
l:C3
I
~
I~~K~
I
RL
LM567L J."8~_-,
C3
*~A
l
tK'laIOK
;,1
Fig. 6. Methods of Reducing Chatter
SKEW ADJUSTMENT
The circuits shown in Fig 7 can be used to change the position of the detection band (capture range) within the largest
detection band (lock range). By moving the detection band to either edge of the lock range, input signal variations will expand
the detection band in one direction only, since R3 also has a slight effect on the duty cycle, this approach may be useful to
obtain a precise duty cycle when the circuit is used as an oscillator.
+V
+v
B-t1
L~RSm
LOWERS fa
R2
5K
RI
LM567L
LM567L
r' <
50K
RAISES fa
83
t.OK
RAISES fa
RAISESf o
SILICON
DIODES FOR
TEMPERATURE
COMPENSATION
(OPTIONAL)
Fig. 7. Detection Band Skew Adjustment
c8SAMSUNG
Electronics
293
LM567L
LINEAR INTEGRATED CIRCUIT
TYPICAL PERFORMANCE CHARACTERISTICS
FIG 8. SUPPLY CURRENT
Vo SUPPLY VOLTAGE
FIG 9. LARGEST DETECTION BANDWIDTH
Vo OPERATING FREQUENCY
3.0
15
I\.
2.5
'\
NO LOAD "ON" CURREN:/
00(
E 2.0
I
ffi
a::
a::
;:)
1.5
V
0
~
IL
IL
;:)
III
1.0
"'
/
./
./
~
~SCENT CURRENT
0.5
o
V
~
---
v---
4
10
10Hz
100Hz
SUPPLY VOLTAGE - VOLTS
FIG 10. DETECTION BANDWIDTH
Vs A FUNCTION OF C2 AND C3
1KHz
10KHz
CENTER FREQUENCY
1:OOKHz
FIG 11. BANDWIDTH Vs INPUT SIGNAL
AMPLITUDE (C2 IN I'F)
10' r--,..--,..--,..--,..--,..--,..--,..-----,
250
III
~
~ 200~-~~~~~r_~~~~_1~_1~~
E
I
w
~ 150 I--ft--~t
~
g
I~ 100
f----H-I----"I-
~
C3
Adjustment
Required
C2
16
10
BANDWIDTH - % OF fo
FIG 12. BANDWIDTH VARIATION
WITH TEMPERATURE
0,\
15.0
14
400
12
l!i 10.0
!
300
200
10
%
I-
-
8
~ 7.5
z
-r--
6
5.0
2.5
.....
100
fo-.
16
FIG 13. GREATEST NUMBER OF
CYCLES BEFORE OUTPUT
2
r-- r--
0
BrNDWlrH AT(5 C
~
o
"
[
-
50
r--.
-r---r--
4
-75
14
50
12.5
~
12
BANDWIDTH - % of fo
"'
~~
I
BANDWIDTH LIMITED BY C2
~
~
\
40
-25
25
50
TEMPERATURE, °C
c8SAMSUNG
Electronics
75
100
125
20
1
I
'\!1TERNAL RESljR
(MINIMUM C2)
10
-50
~
BANDWIDTH LIMITED BY
"'
30
3 45
~
10
I
20
I--------
30 40 50
100
BANDWIDTH (% of fo)
294
LM567L
LINEAR INTEGRATED CIRCUIT
FIG 15. TYPICAL CENTER FREQUENCY DRIFT
WITH TEMPERATURE(V cc = SV, R1 80kO,fo = 1KHz)
FIG 14. POWER SUPPLY DEPENDENCE
OF CENTER FREQUENCY
=
1.2
100
1.1
1.0
0.9
....i=" O.B
~
~
~
f----
~-
f--
0.5
.-/
0.4
I
I
-"""1'..
o
V
V --
0.7
I 0.6 f----------
.]
I
- - - I---
~--~
I
17
-100
\
"'r\
~
a:
0-200
\
g
If
~ -30()
«
I
II:
w
0.3
ii!
0.2
-400
I
0.1
0.1
0.2
3
0.3 0.4 0.5
45
10
-500
-25
25
50
75
TEMPERATURE, DC
CENTER FREQUENCY - KHz
FIG 16. TYPICAL FREQUENCY DRIFT
AS A FUNCTION OF TEMPERATURE
~
~
~
II:
~o -1
~
~--+---+---~---r---+--~~~--~
w
CI
~
~
-2~--+---+---~---r---+---+--~--~
'if.
-4
~--~--~--~--~--~--~--~--~
-25
25
50
75
TEMPERATURE, DC;
c8SAMSUNG
Electronics
295
MC1488
LINEAR INTEGRATED CIRCUIT
QUAD LINE DRIVER
14 DIP
The MC1488 is a monolithic quad line driver designed to interface data
terminal equipment with data communications equipment in conformance with the specifications of EIA Standard No. RS-232C.
FEATURES
•
•
•
•
•
Current Limited Output: ± 10mA typ
Power-Off Source Impedance: 300 Ohms (min)
Simple Slew Rate Control with External Capacitor
Flexible Operating Supply Range
Compatible with DTL and TTL, HCTLS Families
SCHEMATIC DIAGRAM
14 sOP
(1/4 of Circuit Shown)
Vee 14
ORDERING INFORMATION
Device
Package
MC1488N
14 DIP
MC1488D
14 SOP
INPUT
300
OUTPUT
PIN 6, 8, 11 or 3
Operating Temperature
0- + 70°C
TYPICAL APPLICATION
LINE DRIVER
MC1488
INTERCONNECTING
CABLE
LINE RECEIVER
MC1489
.s--'~...r--'\0- TTUOTL
TTUOTL o-j
""L _ .... 1
' - __ .I
70
VEE 1
I
I
I
I
I-
--l
I
I
I
I
INTERCONNECTING
CABLE
ABSOLUTE MAXIMUM RATINGS
(Ta = 25°C unless otherwise noted)
Symbol
Value
Unit
Power Supply Voltage
Vee
VEE
+15
-15
Voe
Characteristic
Input Voltage Range
V'R
-15:s V,R:s 7.0
Voc
Output Signal Voltage
Vo
±15
Voe
Power Dissipation
Po
1000
mW
1/ROJA
6.7
mW/oC
Ta
0:"'+70
°C
T5tg
-65- +150
°C
Derate Above Ta = + 25°C
Operating Temperature Range
Storage Temperature Range
c8.SAMSUNG
Electronics
296
LINEAR INTEGRATED CIRCUIT
MC1488
ELECTRICAL CHARACTERISTICS
(Vee =9.0±1%V, VEE =-9.0 ± 1%V, Ta =0-70°C unless otherwise noted)
Characteristic
1--
Symbol
Input Current 1
IlL
--~----~~---~~--~
Low Logic State (VIL =0)
t
1.0
1.6
mA
Fig
~A
10
-~----~~-----~----
- - - - ----------t~~__j
-~--
V IL =0.8V, RL=3.0KO
Vee = 9.0V, VEE = - 9.0V
6
VIL =0.8V. RL =3.0KO
Vee = 13.2V, VEE=-13.2V
9
10.5
-6
-7
-9
-10.5
VIH=1.9V, RL=3.0KO
Vee=9.0V, VEE=-9.0V
V = 1.9V, RL = 3.0KO
IH
Vee=13.2V, VEE=-13.2V
VOL
10_s_+~~r---PO_s_it_iv_e_______~_
=
----------~---~
Output Resistance
Unit
7
---4--~~-~~--1
Output Voltage-High Logic State
Output Short Circuit Current
Max
~:~~~g~) State
Input Current 2
Output Sh_ ort Circuit Current _
Typ
---~-4------~-t--~--+-----+~~-+-~--j--~-1
---------------------------~~~+----~----
Output Voltage-Low Logic State
Min
Test Conditions
los-
_+_-
-6
6
Negative
Vee =V EE =0, Vo = ± 2.0V
2
V
2
-10
-12
mA
3
10
12
mA
3
I
-~-~~~4----~
--~-+--~-~--~~--~---
Ro
V
o
300
~-+--
VIH=1.9V, Vee=+9.0V
V IL =O.8V, Vee = +9.0V
VIH=1.9V, Vee=+12V
Positive Supply Current (RL=oo)
lee
--~~~~-~--
~-----t-----t---
VIL =0.8V, Vee = +12V
~-----r---~~-~+---~
VIH =1.9V, Vee = + 15V
mA
-~
~A
mA
~A
5
mA
-----
mA
mW
* Maximum package power dissipation may be exceeded if all outputs are shorted simultaneously.
SWITCHING CHARACTERISTICS
(Vee = 9.0± 1%V, VEE= -9.0 ± 1 %V, Ta= 0
Characteristic
Propagation Delay Time
Symbol
25°C)
Test Conditions
tpLH
ZL =3.0K and 15pF
Min
Typ
Max
Unit
Fig
275
350
nS
6
Fall Time
tTHL
ZL =3.0K and 15pF
45
75
nS
6
Rise Time
hLH
ZL =3.0K and 15pF
55
100
nS
6
Propagation Delay Time
tpHL
ZL =3.0K and 15pF
110
175
-, nS
6
c8SAMSUNG
Electronics
297
I
LINEAR INTEGRATED CIRCUIT
MC1488
DC TEST CIRCUIT
FIGURE 1 INPUT CURRENT
+9V
FIGURE 2 OUTPUT VOLTAGE
+9V
-9V
-9V
+1.9V
J
3K
VIL
1
FIGURE 3 OUTPUT SHORT CIRCUIT CURRENT
Vee
FIGURE 4 OUTPUT RESISTANCE (POWER OFF)
VEE
+1.9V
L
Vo
±2Vdc
±6mA Max
c8SAMSUNG
Electronics
298
LINEAR INTEGRATED CIRCUIT
MC1488
FIGURE 5 POWER SUPPLY CURRENTS
+1.9V
J
•
MC1488
VIL
+0.8V
VEE
FIGURE 6 SWITCHING RESPONSE
D
VIN 0
l~
i'~F
RL
+1E:X'
VIN
Va
-11
50%
ITHL
~ '"Of
OVa
CL
ov
ITLH
tTHL and tTLH Measured 10% to 90%
c8SAMSUNG
Electronics
299
LINEAR INTEGRATED CIRCUIT
MC1488
TYPICAL PERFORMANCE CHARACTERISTICS
FIGURE 8 - SHORT CIRCUIT OUTPUT CURRENT
Vs TEMPERATURE
FIGURE 7 - TRANSFER CHARACTERISTICS
Vs POWER-SUPPLY VOLTAGE
+12
+12
+9.0 t------- Vccr2V, ViE=-r
<+9.0
r-- t--- r--
!--.
.§.
1---
ifi+6.0
,
II:
II:
-C'-
::I
Vcc =6V, VEE =-6V
~+3.0
-r;;:-+--
I-
Vcc =9V, VEE =-9V
+6.0
~+3.0
::I
CI
~
l!:
I-
5
~-3.0
is
~
I
I
0
1'~
I-
::I
l!: -3.0
V,
(3
::I
o
3K
~ -6.0 t------- f- VI~VO
- - +------ j - -
O.BV
Ii:0-6.0
VEE=-9V
I-
:z:
Ul
-9.0
-12
o
0.2
0.4
0.6
c5'
!!!-9.0
T
O.B
-12
1.0
1.2
Vln, INPUT VOLTAGE
1.4
1.6
~
~ J---55
1.B 2.0
~
j..----
~t:=1I
+25
+125
+75
T, TEMPERATURE eCI
M
FIGURE 9 - OUTPUT SLEW RATE Vs LOAD
CAPACITANCE
FIGURE 10 - OUTPUT VOLTAGE
AND CURRENT LIMITING CHARACTERISTICS
+20
1000
+16
+12
f+B.O
100
;:
--
ifi+4.0
t
i3
w
!(
==
~
0
!:i
II:
Ul
f----+-~Ir-+_-+---+
~
~
l!:-4.0
I
10
::I
r= ~
==
meL
~
1---
1.0
o
.i-B.O 1---+_-+_-*--+_-+__-4_-+-\----I
1---1\
f-
11111111
11111
11111111
11111
10
1.0
-121--1~~~~+_-+_-+_-+---+__-4_-~~H
VI~
-16
O.BV ~cc-::;:~~
~vo
_20L-__~V~EE_=_-9~V__~__~__~__~____L_~
1,000
100
10,000
-16 -12
-B.O
-4.0
+4.0
+B.O
+ 12
+16
Vo, OUTPUT VOLTAGE 'M
CL, CAPACITANCE (pF)
FIGURE 11 - MAXIMUM OPEATING TEMPERATURE
Vs POWER SUPPLY VOLTAGE
PIN CONNECTIONS
6
""" I"~
14
~1 2
w
~
~
~
IL
10
Vee'
8.0 l -
•
~
~
I-
InputD2
Output B
InputC2
I~
6.0 I-
~ 4.0
Output A
li>-it
Ul
>
'"
I
3K
::I
ffi
Input A
"1'...
CI
InputCl
I~
t
1
rn
OutputC
I VEE I
2.0
i
!
-55
+25
+75
+125
T, TEMPERATURE (OC)
c8SAMSUNG
Electronics
300
MC1489/MC1489A
LINEAR INTEGRATED CIRCUIT
QUAD LINE RECEIVER
14 DIP
The MC1489 monolithic quad line receivers are designed to interface
data terminal equipment with data communications equipment in conformance with the specifications of EIA Standard No. RS-232C.
FEATURES
• Input Resistance: 3.0KO to 7.0KO
• Input Signal Range: ;t 30 Volts
• Response Control
a) Logic Threshold Shifting
b) Input Noise Filtering
• Input Threshold Hysteresis Built in
14 SOP
I
SCHEMATIC DIAGRAM
(114 OF CIRCUIT SHOWN)
r - - -___--------- nUOTL
'
~-~
~_/
I
Vee
OutputA 3
InputD
12 Response
Control D
I
I
I
r--
InputA 1
Response
ControlA 2
I
I
--I
!
:
INTERCONNECTING
CABLE
c8SAMSUNG
Electronics
Response
Control B
Output B 6
Ground 7
InputC
9
Response
Control C
8 OutputC
302
MC1489/MC1489A
LINEAR INTEGRATED CIRCUIT
TEST CIRCUIT
Fig 1 -
SWITCHING RESPONSE
Fig 2 -
RESPONSE CONTROL NODE
VA
+5Vdc
R
orequiv
~----~h--------l'-----'·VO
Vin
_ _ _"'" +3V
50%
~
RESPONSE NODE
Vin ------1-'4--1
Vin
tTHL
- - - - - - - - - -.... Va
MC1489A
C, capacitor is for noise filtering
R, reistor is for threshold shifting
tTLH and tTHL
measured
10%-90%
Va
•
C;;;
CL
1.5V
CL =15pF=total parasitic capacitance, which includes
probe and wiring capacitances
TYPICAL PERFORMANCE CHARACTERISTICS
(vee =5.0 Vdc T a = +25°C unless otherwise noted)
Fig. 3 - TYPICAL TURN-oN THRESHOLD Vs
CAPACITANCE FROM RESPONSE CONTROL PIN TO
GND
IL-________L -________L -______
10
100
1000
pw, INPUT PUlSE WIDTH (ns)
c8SAMSUNG
Electronics
Fig. 4 - TYPICAL TURN-ON THRESHOLD Vs
CAPACITANCE FROM RESPONSE CONTROL PIN TO
GND
~
10,000
10
PW, INPUT PULSE WIDTH (ns)
303
LINEAR INTEGRATED CIRCUIT
MC1489/MC1489A
MC1489 INPUT THRESHOLD
VOLTAGE ADJUSTMENT
Fig. 6 Fig. 5 -
INPUT CURRENT
+10
6.0
+8.0
.,
+6.0
1/
:(+4.0
.s.
!2,+2.0
I/
II!
~
5.0
V
0
U
!:i-2.0
D.
I/
!:
,::!-4.0
v
v
'i
4.0
~
w
~
3.0
~
. . .V
I-
\--
it
RT
RT
RT
RT
5K
13K
00
11K
V..
V'h
V'h
+5V
+5V
-5V
"E'
AT
2.0
if, Vth
~
~ 1.0
.,V
-6.0
--
.,V
y
V
-8.0
L-
'--
'--
r-
VIlH V'HL
~
-10
-25-20
-15
-10
-5.0
0
+5.0 +10 +15
+20 +25
-3.0 -2.0 -1.0
VIN, INPUT VOLTAGE M
Fig. 7 - MC1489A INPUT THRESHOLD
VOLTAGE ADJUSTMENT
+3.0 +2.0 +1.0
Fig. 8 - INPUT THRESHOLD VOLTAGE
Vs. TEMPERATURE
6.0
24
5.0
'i
0
VI, INPUT VOLTAGE'M
lw
4.0
~
RT
CI
5K
11K
g
V'h
V'h
I-
+5V
w
~ 3.0
~ 2.0
Al
22
e-.-
20
~---
--r-:--
18
MC1J9AV,,~
CI
RT
V~O
-5V
AT
j, V'h
~
g
12
II:
10
II-
0.8
:I:
o
~
~ 1.0
14
Q
81
~
16
5:I:
D.
-
h-
I--- I---
-j---.::
k--~-
~H
t--=: ~ t - - ~l:rV"H
1--MC1489AVIlH
!: 0.6 f-.
I--
V1LH I--- V1HL
i-'-
r--I-
t
r---f-
F
0
+10
+20
+30
.--
--=
i
-60
+40
----
0.4
0.2
-30 -20 -10
.-~
r-::::: r-- ,........,
t---
+60
+120
T, TEMPERATURE (OC)
VI, INPUT VOLTAGE M
Fig. 9 - INPUT THRESHOLD Vs.
POWER SUPPLY VOLTAGE
2.0
V'HL MCl489A
V'HLMC1489
V'LHMCl489
V"HMC1489A
f---
a
o
4.0
8.0
12
Vee POWER SUPPLY VOLTAGE M
c8SAMSUNG
Electronics
304
LINEAR INTEGRATED CIRCUIT
MC3361
16 DIP
LOW VOLTAGE/POWER NARROW
BAND FM IF
The MC3361 is designed for use in FM dual conversion
communication. It contains a complete narrow band FM
demodulation system operable to less than 2.SV supply
voltage. This low-power narrow-band FM IF system
provides the second converter, second IF, demodulator.
Filter Amp and squelch circuitry for communications
and scanning receivers.
16 soP
I
FEATURES
• Stable operation with wide supply voltage
(2.5V to 7.0V)
• Low power consumption (4.0mA typo at Vee =4.0V)
• Excellent input sensitivity
(- 3dB limiting. 2.0/LVnns typ)
.' Minimum number of external components required.
~---~---------------
ORDERING INFORMATION
APPLICATION
Device
• Cordless phone (for home use)
• FM dual conversion communications equipment
Package Operating Temperature
MC3361N
16DIP
MC3361D
·16 SOP
-20 -
+ 70°C
BLOCK DIAGRAM
MUTE
SCAN
OUTPUT CONTROL
SQUELCH
INPUT
FILTER
OUTPUT
FILTER
INPUT
AUDIO
OUTPUT
~~---L-...,
SQUELCH TRIGGER CONTROL
CIRCUIT WITH HYSTERESIS
RF
INPUT
(10.7MHz)
osc
OSC
c8SAMSUNG
Electronics
MIXER
OUTPUT
vee
LIMITER
INPUT
DECOUPLING
DECOUPLING
QUADRATURE
INPUT
305
MC3361
LINEAR INTEGRATED CIRCUIT
PIN CONFIGURATION
osc
1
OSC
2
•
MIXER
OUTPUT
Vee
16
RF INPUT
15
GND
14
MUTE
SCAN
13 CONTROL
4
MC3361
LIMITER
INPUT
DECOUPLING 6
DECOUPLING
7
QUADR~~~n~
8
ABSOLUTE MAXIMUM RATINGS
12
SQUELCH
INPUT
11
FILTER
OUTPUT
FILTER
10 INPUT
AUDIO
OUTPUT
(Ta = 25°C)
Characteristic
Symbol
Value
Unit
Supply Voltage
Operating Voltage Range
Detector Input Voltage
RF Input Voltage (Vee~4.0V)
Mute Function
Operating Temperature
Storage Temperature
Vee (max)
Vee
Va
V'6
V'4
Topr
Tstg
10
2.5 to 7.0
1.0
1.0
-0.5 - +5.0
-20 -+70
-65 -+150
V
V
Vp-p
Vrms
Vpeak
°C
°C
Absolute maximum ratings are those values beyond which permanent damage to the device may occur. These
are stress ratings only and functional operation of the device at or beyond them is not implied. Long exposure
to these conditions may affect device reliability.
c8SAMSUNG
Electronics
306
LINEAR INTEGRATED CIRCUIT
MC3361
ELECTRICAL CHARACTERISTICS
(Vcc=4.0V, fo=10.7MHz, 6f= ±3KHz, f Moo =1KHz, Ta=25°C, unless otherwise specified)
Characteristic
Symbol
Test Conditions
Icc
Squelch off (V12 = 2V)
Squelch on (V12 = GND)
4.0
6.0
Input Limiting Voltage
VINL
- 3.0dB limiting
2.0
,N
Detector Output Voltage
Detector Output Impedance
Vg
Zoo
2.0
400
Vrlr.
100
160
mVrms
40
48
dB
Supply Current
Min
Typ
Max
Unit
mA
mA
(}
Audio Output Voltage
Vo
Filter Gain
AVF
Filter Output DC Voltage
VOF
1.5
V dc
Trigger Hysteresis of Filter
VTH
50
mV
Yin
= 10mV
f = 10KHz,
Yin
= 5mV
Mute Switch-on Resistance
RON
Mute "Low"
10
(}
Mute Switch-off Resistance
ROFF
Mute "High"
10
M(}
Scan Control "Low" Output
V13L
Scan Control "High" Output
V13H
Mixer Conversion Gain
AVM
24
dB
Mixer Input Resistance
RIM
3.3
K(}
Mixer Input Capacitance
CIM
2.2
pF
c8 !!e!'ISUNG
M ute off (V 12
=2V)
Mute on (V12=GND)
0.5
Vdc
Vdc
3.0
307
•
MC3361
LINEAR INTEGRATED CIRCUIT
PIN DESCRIPTION,
Pin No.
Name
1,2
OSC
Function
The crystal oscillator terminals for mixer conversion.
The colpitts oscillator is internally biased with a regulated current
source which assures proper operation over a wide supply range. The
collector, base and emitter terminals are at pins 4, 1, and 2
respectively. The crystal which is used in the parallel resonant mode,
may be replaced with an appropriate inductor if the application does
not require the stability of a crystal oscillator.
Vee
PIN 4
3, 16
Mixer Input,
(RF Input)
Mixer Output
The mixer input/output terminals. The mixer converts the input
frequency (10.7MHz) down to 455KHz. The mixer is double balanced
to reduce spurious response. The mixer output impedance will
properly match the input impedance of a ceramic filter which is used
as a bandpass filter coupling the mixer output to the IF limiting
amplifier. Following the mixer, a ceramic bandpass filter is
recommended. The 455KHz types come in bandwidth from ± 2KHz to
± 15KHz.
Power supply pin.
4
Vee
5, 6, 7
Limiter
Amp Input,
Decoupling
Limiter Amp inputs and decoupling terminals.
The IF limiter amplifier consists of five differential gain stag_es,
with the input, impedance set by 1.8KO resistor to properly terminate
the ceramic filter driving the IF. The IF output is connected to the
external quad coil at pin 8 via an internal 10pF capacitor. The
frequency limitation is due to the high resistance values in the IF,
which were necessary to meet the low power requirement. The output
of· the limiter is internally connected to the quadrature detector.
8, 9
Quadrature
Input, Audio
Output
Quadrature detector input and output terminals.
A conventional quadrature detector is used to demodulate the FM signal.
The Q of the quad coil, which is determined by the external resistor
placed across it, has multiple affects on the audio output. (QC:<:R)
Increasing the Q increases audio output level but because of nonlinearities in the tank phase characteristic, also increases distortion.
For proper operation, the voltage swing on pin 9 should be adequate
to prevent distortion (160mV rms typ). The detector output is amplified
and buffer~d to the audio output pin 9, which has an output
impedance-of approximately 4000.
c8SAMSUNG
Electronics
308
MC3361
LINEAR INTEGRATED CIRCUIT
PIN DESCRIPTION
(Continued)
Pin No.
Name
Function
10, 11
Filter Input!
Output
Filter Amp input/output terminals.
The inverting OP Amp is provided with an output at pin 11 providing
dc bias (externally) to the input at pin 10 which is referred internally to
0.7V. The OP Amp is normally utilized as either a bandpass filter to
extract a specific frequency from the audio output, such as a ring or
dial tone, or as a high pass filter to detect noise due to no input at
the mixer.
12, 13,
14
Squelch In,
Scan Control,
Mute Output
Squelch control input, scan control output, mute output terminals.
A low bias to pin 12 sets up the squelch trigger circuit such that pin 13
is high, and the audio mute (pin 14) is internally short circuited to
ground (typically 100 to GND). If pin 12 is raised above mute threshold
(0.7V) by the noise or tone detector, pin 13 (scan control output) will
become low level output and the audio mute will be an open circuit.
There is 50mV of hysteresis at pin 12 which effectively prevents jitter.
15
GND
GND pin.
TYPICAL APPLICATION CIRCUIT
vee
MURATA
CFU
4550
MC3361
0.11'J
TOKO TYPE
RMC·2A6597HM
In the above typical application, the audio signal is recovered using a conventional quadrature FM detector. The
absence of an input signal is indicated by the presence of noise above the desired audio frequencies. This "noise
band" is monitered by an active filter and a detector. A squelch trigger circuit indicates the presence of noise
(or a tone) by an output which can be used to control scanning. At the same time, an internal switch is operated
which can be used to mute the audio.
c8SAMSUNG
Electronics
309
•
NOTES
Voltage Regulator
Device
KA337
KA340
KA350.
KA3524
KA7500
KA78S40
KA78TXX
LM317
LM323
LM723
MC78XX
MC78LXX
MC78MXX
MC79XX
MC79LXX
MC79MXX
Package
Function
Page
3-Terminal Negative Adjustable Regulator
3-Terminal Positive Voltage Regulator
3 AMP Adjustable Positive Voltage Regulator
Regulator Pulse Width Modulator
Regulator Pulse Width Modulator
Switching Regulator
3A Positive Voltage Regulator
3-Terminal Positive Adjustable Regulator
3-Terminal Positive Voltage Regulator
Precision Voltage Regulator
3-Terminal 1A Positive Voltage Regulator
3-Terminal 0.1A Positive Voltage Regulator
3-Terminal 0.5A Positive Voltage Regulator
3-Terminal 1A Negative Voltage Regulator
3-Terminal 0.1A Negative Voltage Regulator
3-Terminal 0.5A Negative Voltage Regulator
TO-220
TO-220
TO-3PITO-220
16 DIP
16 DIP
16 DIP
TO-220
TO-220
14 DIP/14 SOP
14 DIP/14 SOP
TO-220
TO-92
TO-220
TO-220
TO-92
TO-220
Voltage Reference Diode
Voltage Reference Diode
Programmable Precision Reference
TO-92
TO-92
TO-92/8 DIP/8 SOP
458
462
466
8 DIP/8 SOP
8 DIP/8 SOP
14 DIP/14 SOP
10 SIP
14 DIP
8 DIP/8 SOP
8 DIP
8 DIP
14 DIP
14 DIP/14 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
14 DIP/14 SOP
14 DIPf14 SOP
8 DIP/8 SOP/9 SIP
8 DIP/8 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
8 DIP/8 SOP/9 SIP
14 DIP/14 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
472
472
477
484
486
488
490
492
496
500
509
515
500
509
515
523
500
515
529
533
533
540
j
j
313
317
329
337
345
349
355
366
371
376
382
413
424
437
447
452
Voltage Reference
1
KA336-2.5
KA336-5.0
KA431
I
I
Operational Amplifier
I
KA201A
KA301A
KA733C
KA9256
KF347
KF351
KF442
KS272
KS274
LM224/A
LM248
LM258/A
LM324/A
M348
r
M;$Ots/A
LM741C/EII
LM2902
LM2904
MC1458AC/C/SII
MC3303
MC3403
MC4558C/ACII
Single Operational Amplifier
Single Operational Amplifier
Differential Video Amplifier
Dual Power Operational Amplifier
Quad Operational Amplifier
Single Operational Amplifier
Dual Operational Amplifier
Dual Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Quad Uperatlonal ArtlpliHor
Single Operational Amplifier
Quad Operational Amplifier
Dual Operational Amplifier
Dual Operational Amplifier
Quad Operational Amplifier
Quad Operational Amplifier
Dual Operational Amplifier
I
I
Voltage Comparator
KA219
KA319
KA710CII
KA711CII
LM239/A
LM293/A
LM311
LM339/A
LM393/A
LM2901
LM2903
LM3302
Dual High Speed Voltage Comparator
Dual High Speed Voltage Comparator
High Speed Voltage Comparator
Dual High Speed Differential Comparator
Quad Differential Comparator
Dual Differential Comparator
Voltage Comparator
Quad Differential Comparator
Dual Differential Comparator
Quad Differential Comparator
Dual Differential Comparator
Quad Differential Comparator
14 DIP/14 SOP
14 DIP/14 SOP
14 DIPI14 SOP
14 DIP/14 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
8 DIP/8 SOP
14 DIP/14 SOP
8 DIP/8 SOP/9 SIP
14 DIPI14 SOP
8 DIP/8 SOP
14 DIP/14 SOP
545
545
550
554
557
565
572
557
565
557
565
557
CMOS Timer
CMOS Timer
CMOS Dual Timer
Timer
Dual Timer
Quad Timer
8 DIP/8 SOP
8 DIP/8 SOP
14. DIPI14 SOP
8 DIP/8 SOP
14 DIP/14 SOP
16 DIPI16 SOP
577
582
586
590
594
597
Timer
KS555
KS555H
KS556
NE555
NE556
NE558
I"
I,illl
LINEAR INTEGRATED CIRCUIT
KA337
3·TERMINAL NEGATIVE
ADJUSTABLE REGULATOR
TO·220
The KA337 is a 3-terminal negative adjustable regulator.
It suppty in excess of -1.5A over an output voltage
range of -1.2V to - 37V.
This regulator requires only two external resistor to set
a output voltage and 1 capacitor to compensate
frequency.
FEATURES
Output current in excess of - 1.SA
Output voltage adjustable between - 0.2V & - 37V
Internal thermal·overload protection
Internal short·circuit current-limiting
constant with temperature
• Output transistor safe· area compensation
• Floating operation for high,voltage applications
• Standard 3'pin, TO·220 package
•
•
•
•
1: Adj 2: Input 3: Output
ORDERING INFORMATION
Device
TO-220
**KA237T
TO-220
Operation Temperature
0- + 125°C
-25 - + 150°C
** Under development
APPLICATION CIRCUIT
KA337
L,
Package
KA337T
I-----------~------O
- VOUT
ADJ
C2
* - VOUT = -1.25V (1 + R2/1200) + (-ladj*R2)
* Output current depends on maximum power dissipation
c8SAMSUNG
Electronics
313
•
KA337
LINEAR INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristic
Symbol
VaJue
Unit
Input-Output Voltage Differential
Power Dissipation
Operating Temperature Range
Storage Temperature Range
V1wVbuT
Po
Topr
Tstg
40
Internally limited
0- + 125
-65 - + 150
V
°C
°C
ELECTRICAL CHARACTERISTICS
(Vin-Vout=5V, lout = -0.5A, 0°C::s;Tj::s;125°C, Pmax =20W, unless otherwise specified)
Characteristic
Line Regulation
Load Regulation
Adjustable Pin Current
Symbol
Vo
Vo
Vref
Temperature Stability
Ts
h (min)
,
en
Ripple Rejection
RR
Max
Ta=25°C
- 40V ::s;VOUT - V1N::s; - 3V
0.01
0.04
-40VVoor =100mV
2.5
55
I
'"
i'.....
S
15II:
I
"'1\
I-
II:
::>
0
1.5
,
~
I-
::>
IL
I-
::>
0
l"- I-.5
35
30
-50
o
-25
25
50
75
100
125
150
o
10
15
20
25
30
35
INPUT·OUTPUT DIFFERENTIAL (V)
TEMPERATURE (OC)
Fig. 6 LOAD TRANSIENT RESPONSE
Fig. 5 LOAD REGULATION
0.2"""-.,....----.---r-----,.--,---r--r--I""""I
1f::;::::::j:::;::::t:::::4==:t= i'l = O.SA
l
W
t----
::::--t--+---+~-_+r--.....---=""_I
i _'O.4I----+--+-+----+-~-_+r--.....~....t__"=-1-.5_+A-~
-0.21-----t---+--......
~ -0.61----+--+-+--t--+--+~-~"'--I
,
~
g -0.8l----+--+--+--+---+--+--+--.lI
~
o
0.6
~~
00
;:~
O. 4
o.2
v
-1.21-----+--+--+--+---+-c7=5-+--+-----j
-1.4_1.:50:::--....1._2=5-J..----:l:""5-50J..----I--1~OO--:-:!12:""5----1
150
2
~)
TEMPERATURE (OC)
c8SAMSUNG
Electronics
O
-
.\~ I--.
1... -C J=1OI'F
A
-0.2
-0.4
1'1\
IV
/
S -0.6
ffi
-1.0J----+--+--+--+---+--+--+------.j
VIN= -15V
oor = -10V
II
,CAeT
J.. ...
~~
!;c
o
I
/"I
II:
II:
::>
0-0.5
cc(
g -1.0
-1.5
~
,
\
V'N= -15V
Voor = -10V
INl=50mA
T1=25°C
Cl
I =1r
10
20
)
I
V
I
30
40
TIMElI's)
316
KA340XX
LINEAR INTEGRATED CIRCUIT
I.::--~-~
3-TERMINAL POSITIVE VOLTAGE
REGULATORS
I
I
TC>220
The KA340XX series of three-terminal positive voltage
regulators are available in TO-220 package and with
several fixed output voltages, providing better performance than 78XX series regulators. These are designed
to have outstanding ripple rejection, superior line and
load regulation in high power applications (over 15W).
Each type employs internal current limiting, thermal
shutdown and safe area protection.
Although designed primarily as fixed voltage regulators,
these devices can be used with external components
to obtain adjustable voltage and currents.
FEATURES
•
•
•
•
•
•
•
Maximum output current: 1.5A
Output voltage of 5, 6, 8, 9, 10, 11, 12, 15, 18, 24V
Superior line and load regulation than 78XX series
Output transistor SOA protection
Internal short·circuit current limit
Thermal overload protection
Output voltage tolerances of :!: 4% at 25°C and
:!: 5% over the temperature ,range
I
1: Input 2: GND 3: Output
ORDERING INFORMATION
Operating Temperature
BLOCK DIAGRAM
SERIES
PASS
ELEMENT
OUTPUT
~--~------------------------------+---------------------------~~O
GND
=8SAMSUNG
Electronics
317
LINEAR INTEGRATED CIRCUIT
KA340XX
SCHEMATIC DIAGRAM
r----,-------~---------~~-___r--....__---...___{) VIN
Q11
R16
L----+---+------4------ili..---oVOUT
R20
01
R21
~~--~----~-~--~--*--~~-~--~---~-oGNO
ABSOLUTE MAXIMUM RATINGS
Characteristic
Input Voltage (for Vo = 5V)
Thermal Resistance Junction-Cases
Thermal Resistance Junction-Air
Junction Operating Temperature
Storage Temperature
c8 !e!'lSUNG
Symbol
Value
Vi
35
5
65
0-+150
-65 - +150
e jc
e ja
ToP!
Tstg
Unit
V
°CIW
°CIW
°C
°C
318
LINEAR INTEGRATED CIRCUIT
KA340XX
ELECTRICAL CHARACTERISTICS KA340TOS
(Refer to test circuit, O°C ~Tj~ 125°C, Vi = 10V, 10 = 0.5A, unless otherwise specified)
Characteristic
Symbol
Test Conditions
Tj =25°C,
Output Voltage
Vo
5mA~lo~1.0A
5mA~lo~1.0A, PD~15W
Vi = 7.5V to 20V
Line Regulation
Id
Output Noise Voltage
Ripple Rejection
5.25
3
50
50
Vi =8V to 12V
-
-
25
Vi = 7.5V to 20V
Tj = 25°C
-
-
50
5mA~lo~1.5A
-
10
50
0.25A~lo~0.75A
-
-
25
-
-
50
Tj = 25°C
-
-
8
0°C~Tj~125°C
-
-
8.5
0.5
-
-
1.0
Tj = 25°C
10= 1A
V
mV
mV
mA
Vi = 7V to 25V
-
-
1.0
Vn
Ta=25°C, f=10Hz to 100KHz
-
40
-
80
-
62
-
-
10 = 1A, Tj = 25°C
-
2.0
-
V
Tj = 25°C
-
2.2
Vi = 35V, Tj = 25°C
250
-
A
-0.6
17
RR
Vd
Ipeak
Ise
Output Resistance
-
61d
Short-Circuit Current
YOU!
4.75
Unit
Tj = 25°C
lo~ 1A, Vi = 7.5V to 20V
Peak Output Current
Average TC of
5.20
-
f = 120Hz, Vi = 8V to 18V
Tj = 25°C
f = 120Hz, Vi =8V to 18V
0°C~Tj~125°C
.Dropout Voltage
5.00
-
5mA~lo~1A
Quiescent Current
Change
4.80
-
5mA~lo~1A
Quiescent Cu rrent
Max
Vi =8V to 20V
6V o
6Vo
Typ
Tj =25°C, Vi =7V to 25V
10~1A
Load Regulation
Min
62
..
mA
/LV
dB
6V o/6T
10=5mA
-
Ro
f=1KHz
-
-
mA
mV/OC
t mO.,
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
319
•
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T06
(Refer to test circuit, O°C;s;Tj;S; 12SoC, Vi = 11V, 10 = O.SA, unless otherwise specified)
Characteristic
Output Voltage
Vo
Line Regulation
Test Conditions
Min
Typ
Max
Tj =2SoC, SmA;s;lo;s;1.0A
S.7S
6.00
6.26
SmA;s;lo;s;1.0A, PD;S;1SW
Vi = 8.SV to 21V
S.70
-
6.30
Symbol
Tj = 2Soc, Vi = 8V to 2SV
-
3
60
Vi =9V to 21V
-
-
60
Vi =9V to 13V
-
-
30
Vi = 8.SV to 21V
Tj = 2SoC
-
-
60
SmA;s;lo;s;1.SA
-
10
60
0.2SA;S;lo;S;0.7SA
-
-
30
-
-
60
Tj =2SOC
-
-
8
0°C;S;Tj;S;125°C
-
-
8.5
-
-
0.5
-
-
1.0
6V o
10;s;1A
Load Regulation
6V o
T j = 2SoC
SmA;s;l o ;s;1A
Quiescent Current
Id
10= 1A
5mA;s;lo;s;1A
Quiescent Current
Change
61d
Output Noise Voltage
Vn
Ripple Rejection
RR
. Tj =25°C
10;s;1A, Vi =8.5V to 22V
Vi =8V to 2SV
-
-
1.0
Ta = 2SoC, f = 10Hz to 100KHz
-
45
-
f = 120Hz, Vi = 9V to 19V
Tj = 25°C
59
75
-
59
-
-
-
2.0
-
f = 120Hz, Vi = 9V to 19V
0~C;S;Tj~125°C
Dropout Voltage
Vd
Peak Output Current
Ipeak
Short-Circuit Current
Ise
Average TC of
YOU!
Output Resistance
10 = 1A, Tj = 2SoC
Unit
V
mV
mV
rnA
rnA
p.V
dB
V
Tj = 2SoC
-
2.2
-
A
Vi = 35V, Tj = 25°C
-
250
-
rnA
6V o /6T
10=5mA
-
-0.7
-
mV/oC
Ro
f=1KHz
-
18
-
rna
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account" separately. Pulse testing with low duty cycle is used.
c8~UNG
320
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T08
(Refer to test circuit, 0°C::;;Tj::;;125°C, Vi =14V, 10 = 0.5A, unless otherwise specified)
Characteristic
Output Voltage
Line Regulation
Min
Typ
Max
Tj =25°C,5mA::;;l o ::;;1.0A
7.70
8.00
8.30
5mA::;;lo::;; 1.0A, PD::;;15W
Vi = 10.5V to 23V
7.60
-
8.40
80
Symbol
Vo
Test Conditions
Tj = 25°C, Vi = 10.5V to 25V
-
3
Vi = 11V to 23V
-
-
80
Vi = 11.5V to 17V
-
-
40
Vi = 10.5V to 23V
Tj = 25°C
-
-
80
DVo
10::;;1A
Load Regulation
Tj = 25°C
5mA::;; '0::;; 1.5A
-
10
80
0.25A::;;I0::;;0.75A
-
40
Quiescent Current
Change
0.5
Output Noise Voltage
Ripple Rejection
mV
5mA::;;lo::;;1A
-
Did
Tj = 25°C
'0::;; 1A, Vi = 10.5V to 23V
-
-
1.0
Vi = 10.5V to 25V
-
-
1.0
Vn
Ta=25°C, f=10Hz to 100KHz
-
52
-
f = 120Hz, Vi = 11.5V to 21.5V
Tj = 25°C
56
72
-
f = 120Hz, Vi = 11.5V to 21.5V
0°C::;;Tj::;;125°C
56
-
-
--
2.0
mV/oC
mn
..
-
Id
RR
10= 1A
Tj = 25°C
-
0°C~Tj::;;125°C
-
Dropout Voltage
Vd
10 = 1A, Tj =25°C
Peak Output Current
Ipeak
Tj =25°C
8
8.5
-
250
DVo/DT
10=5mA
-
-0.9
Output Resistance
Ro
f=1KHz
-
20
-
Vi =35V, Tj
=25°C
mA
mA
p.V
dB
Average TC of VOU!
Ise
mV
80
-
Short-Circuit Current
V
-
Ii Vo
5mA::;; '0::;; 1A
Quiescent Current
Unit
2.2
V
A
mA
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
321
I
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T09
(Refer to test circuit, QOC5Ti5125°C, Vi =15V, 10=0.5A, unless otherwise specified)
Characteristic
Output Voltage
Min
Typ
Max
Tj = 25°C, 5mA51051.0A
8.65
9.00
9.35
5mA51051.0A, PD515W
Vi = 11.5V to 24V
8.60
-
9.40
-
3
90
-
90
Vi = 12V to 19V
-
-
45
Vi = 11.5V to 24V
Tj = 25°C
-
-
90
5mA5 1051.5A
-
10
90
0.25A 510 5 O. 75A
-
-
45
-
-
90
Test Conditions
Symbol
Vo
Tj = 25°C, Vi = 11.5V to 25V
Vi = 12V to 24V
Line Regulation
6V o
1051A
Load Regulation
6Vo
Tj =25°C
5mA5 1051A
Quiescent Current
Quiescent Current
Change
Output Noise Voltage
Ripple Rejection
Dropout Voltage
Id
61d
Vn
RR
Vd
Peak Output Current
Ipeak
Short-Circuit Current
Isc
10= 1A
Tj =25°C
-
-
8
0°C5 Tj5125°C
-
8.5
0.5
Unit
V
mV
mV
mA
5mA5 1051A
-
-
Tj = 25°C
1051A, Vi = 11.5V to 24V
-
-
1.0
Vi= 11.5V to 25V
-
-
1.0
Ta =25°C, f=10Hz to 100KHz
-
58
-
f = 120Hz, Vi = 12.5V to 22.5V
Tj =25°C
56
72
-
f = 120Hz, Vi = 12.5V to 22.5V
0°C5 Tj5125°C
56
-
-
10=1A, Tj =25°C
-
2.0
-
Tj = 25°C
-
2.2
-
A
250
mA
-1.0
-
mV/oC
22
-
mO
Vi = 35V, Tj = 25°C
Average TC of Vout
6V o/6T
10=5mA
Output Resistance
Ro
f=1KHz
mA
p.V
dB
V
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used .
.c8SAMSUNG
Electronics
322
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T10
(Refer to test circuit, 0°C::s;Tj::s;125°C, Vi = 16V, 10 = 0.5A, unless otherwise specified)
Characteristic
Output Voltage
Line Regulation
Symbol
Vo
Test Conditions
Min
Typ
Max
Tj =25°C,5mA::s;l o ::s;1.0A
9.60
10.00
10.40
5mA::s;lo::s;1.0A, PD::s;15W
Vi = 12.5V to 25V
9.50
Load Regulation
-
3
100
-
-
100
Vi = 12.5V to 25V
Tj =25°C
-
-
100
SmA::s;lo::s;1.SA
-
10
100
-
100
-
8
-
O.S
Vi = 13V to 20V
Tj =25°C
0.25A::s;lo::s;0.75A
SmA::s;lo::s;1A
Quiescent Current
Tj =25°C
Id
10.50
Vi = 13V to 25V
10::s;1A
!:,.Vo
V
-
Tj =25°C, Vi=12.5V to 25V
!:,.V o
10= 1A
0°C::s;Tj::s;125°C
5mA::s;lo::s;1A
50
50
!:"Id
Tj = 25°C
10::S; 1A, Vi = 12.6V to 25V
-
-
1.0
Vi = 12.6V to 25V
1.0
Vn
Ta = 2SoC, f = 10Hz to 100KHz
-
-
Output Noise Voltage
S8
-
f = 120Hz, Vi = 13V to 23V
Tj = 25°C
56
72
-
f = 120Hz, Vi = 13V to 23V
0°C::s;Tj::s;125°C
56
-
-
RR
mV
mV
rnA
8.S
Quiescent Current
Change
Ripple Rejection
Unit
rnA
IN
dB
Dropout Voltage
Vd
10 = 1A, Tj = 25°C
-
2.0
-
V
Peak Output Current
I peak
Tj =25°C
-
2.2
A
Vi = 3SV, Tj = 2SoC
-
-1.1
-
Short·Circuit Current
Isc
Average TC of V aut
!:"Vo/6T
10=5mA
Output Resistance
Ro
f=1KHz
2S0
24
rnA
mV/oC
mO
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
323
•
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T11
(Refer to test circuit, O°C;:s;Tj;:S; 125°C, Vi = 18V, 10 = 0.5A, unless otherwise specified)
Characteristic
Output Voltage
Min
Typ
Max
Tj =25°C,5mA;:s;l o ;:s;1.0A
11.60
11.00
11.40
5mA;:s;lo;:s;1.0A, PD;:s;15W
Vi = 13.5V to 26V
10.50
-
-
3
110
-
110
Vi = 14V to 21V
-
-
55
Vi = 13.5V to 26V
Tj = 25°C
-
-
110
5mA;:s;lo;:s;1.5A
-
10
110
0.25A;:s;lo;:s;0.75A
-
-
55
-
-
110
Test Conditions
Symbol
Vo
Tj = 25°C, Vi = 13.5V to 25V
Vi = 14V to 26V
Line Regulation
f-,V o
10;:s;1A
Load Regulation
f-,V o
Tj =25°C
5mA;:s;lo;:s;1A
Quiescent Current
Tj =25°C
Id
10= 1A
O°C;:s;Tj;:S; 125°C
5mA;:s;lo;:s;1A
11.50
-
8
-
8.5
-
0.5
-
1.0
Quiescent Current
Change
f-,I d
Tj = 25°C
10;:S; 1A, Vi = 13.7V to 26V
-
Vi = 13.5V to 25V
-
-
1.0
Output Noise Voltage
Vn
Ta = 25°C, f = 10Hz to 100KHz
-
70
-
f = 120Hz, Vi = 14V to 24V
Tj =25°C
55
72
-
f=120Hz, Vi =14V to 24V
o°C;:s; Tj;:s; 125°C
55
-
-
Ripple Rejection
RR
Average TC of Vout
f-,Vo/f-,T
10=5mA
Output Resistance
Ro
f=1KHz
-
Vd
10 = 1A, Tj = 25°C
Peak Output Current
Ipeak
Tj =25°C
Short-Circuit Current
Isc
Vi = 35V, Tj = 25°C
V
mV
mV
mA
mA
p.V
dB
-
Dropout Voltage
Unit
2.0
-
V
2.2
-
A
250
-
mV/oC
-1.3
26
mA
mO
• Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
324
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T12
(Refer to test circuit,
O°C~Tj~ 125°C,
Characteristic
VI = 19V, 10 = 0.5A, unless otherwise specified)
Symbol
Test Conditions
Tj = 25°C,
Output Voltage
Vo
5mA~lo~1.0A
5mA~lo~1.0A, PD~15W
Vi = 14.5V to 27V
Tj = 25°C, Vi = 14.5V to 30V
Vi = 15V to 27V
Line Regulation
l:,.Vo
Vi = 16V to 22V
10~1A
Load Regulation
f'::"V o
Tj = 25°C
Vj = 14.6V to 27V
Tj = 25°C
5mA~lo~1.5A
0.25A ~ '0 ~ O. 75A
5mA~lo~1A
Quiescent Current
Id
10= 1A
Tj =25°C
0° C ~ Tj ~ 125 ° C
5mA~lo~1A
Quiescent Current
Change
Output Noise Voltage
Ripple Rejection
f'::" Id
Vn
RR
Min
Typ
Max
11.50
12.00
12.50
11.40
-
12.60
-
4
120
-
120
-
-
120
-
60
12
120
-
120
-
8
-
8.5
0.5
60
Tj = 25°C
lo~ 1A, Vi = 14.BV to 27V
-
-
1.0
Vi = 14.5V to 30V
-
-
1.0
75
-
55
72
-
55
-
-
Ta = 25°C, f = 10Hz to 100KHz
f = 120Hz, Vi = 15V to 25V
Tj =25°C
"
f = 120Hz, Vi = 15V to 25V
0°C~Tj~125°C
Unit
V
mV
mV
mA
mA
p.V
dB
Dropout Voltage
Vd
10 = 1A, Tj = 25°C
-
2.0
-
V
Peak Output Current
Ipeak
Tj =25°C
-
2.2
-
A
-
mV/oC
Vi = 35V, Tj = 25°C
-
250
Average TC of Vout
f'::"Vo/f'::"T
10=5mA
-
-1.5
Output Resistance
Ro
f= 1KHz
-
28
Short-Circu it Current
Isc
mA
mO
* Load and line regulation are specified at a const~nt junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
325
•
LINEAR INTEGRATED CIRCUIT
KA340XX
ELECTRICAL CHARACTERISTICS KA340T15
(Refer to test circuit, O°C:sTj:s 125°C, Vi = 23V, 10 = 0.5A, unless otherwise specified)
Characteristic
Output Voltage
Line Regulation
Min
Typ
Max
Tj = 25°C, 5mA:slo:s1.0A
14.40
15.00
15.60
5mA:slo:s1.0A, PD:s;15W
Vi = 17.5V to 30V
14.25
-
15.75
Test Conditions
Symbol
Vo
Tj =25°C, Vi = 17.5V to 30V
-
4
150
Vi = 18.5V to 30V
-
150
Vi = 20V to 26V
-
-
Vi = 17.7V to 30V
Tj =25°C
-
-
120
5mA:slo:s;1.5A
-
12
150
-
75
-
-
150
-
-
8.5
0.5
-
-
1.0
Vi = 17.5V to 30V
-
-
1.0
90
-
f = 120Hz, Vi = 18.5V to 28.5V
Tj =25°C
54
70
-
f = 120Hz, Vi = 15V to 25V
O°C:sTj:S; 125°C
54
-
-
10 = 1A, Tj = 25°C
-
2.0
Tj =25°C
-
2.2
-
6Vo
10:s;1A
Load Regulation
6Vo
Tj =25°C
O.25A:slo:s0.75A
5mA:slo:s1A
Quiescent Current
Id
10= 1A
Tj =25°C
0°C:s;Tj:s;125°C
5mA:s;lo:s1A
Quiescent Current
Change
6 1d
Tj =25°C
10:S 1A, Vi = 17.9V to 30V
Output Noise Voltage
Vn
Ta = 25°C, f = 10Hz to 100KHz
Ripple Rejection
RR
Dropout Voltage
Peak Output Current
Short-Circuit Current
Vd
Ipeak
Isc
Vi = 35V, Tj = 25°C
Average TC of Vout
6V o/6T
10=5mA
Output Resistance
Ro
f=1KHz
60
8
Unit
V
mV
mV
mA
mA
p.V
dB
250
-1.8
29
V
A
mA
mV/oC
mO
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
326
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T18
(Refer to test circuit, 0°C::s;Tj::s;125°C, Vi =27V, 10=0.5A, unless otherwise specified)
Characteristic
Output Voltage
Min
Typ
Max
Tj = 25°C, 5mA::s;lo::s;1.0A
17.30
18.00
18.70
5mA::s;lo::s;1.0A, PD::s;15W
Vi = 21V to 33V
17.10
Symbol
Vo
Test Conditions
5
180
-
180
-
90
Vi = 21V to 33V
Tj = 25°C
-
-
180
5mA::s;lo::s;1.5A
-
12
180
-
-
-
1.0
Vi = 22V to 33V
f::.Vo
Vi = 24V to 30V
10::s;1A
Load Regulation
f::.Vo
Tj =25°C
0.25A::s; 10::S; O. 75A
5mA::s;l o ::s;1A
Quiescent Current
Id
10= 1A
18.90
-
Tj = 25°C, Vi = 21V to 33V
Line Regulation
-
Tj =25°C
0°C::s;Tj::s;125°C
5mA::s;lo::s;1A
90
8
Vi = 21V to 33V
-
-
1.0
Output Noise Voltage
Vn
Ta=25°C, f=10Hz to 100KHz
-
110
53
69
Ripple Rejection
RR
f = 120Hz, Vi = 22V to 32V
Tj =25°C
-
f = 120Hz, Vi = 22V to 32V
O°C::s;Tj::s;125°C
53
-
-
-
2.0
Tj =25°C
-
Ipeak
10 = 1A, Tj = 25°C
2.2
Vi = 35V, Tj = 25°C
-
250
f::.Volf::.T
10=5mA
-
-2.2
Output Resistance
Ro
f=1KHz
-
32
Isc
mA
mA
p.V
dB
Average TC of Vout
Short-Circuit Current
I
mV
0.5
L':dd
Vd
mV
8.5
Tj = 25°C
10::S; 1A, Vi = 21.5V to 33V
Peak Output C!Jrrent
V
180
Quiescent Current
Change
Dropout Voltage
Unit
V
A
mA
mV/oC
mO
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
327
KA340XX
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS KA340T24
(Refer to test circuit, 0°C::;Tj::;125°C, Vi = 33V, 10 = 0.5A, unless otherwise specified)
Characteristic
Output Voltage
Min
Typ
Max
Tj =25°C,5mA::;l o ::;1.0A
23.00
24.00
25.00
5mA ::;lo::;1.0A, PD ::;15W
Vi = 27V to 38V
22.80
-
25.20
-
5
240
-
240
-
120
Vi = 27V to 38V
Tj = 25°C
-
-
240
5mA ::;10 ::;1.5A
12
240
-
240
Tj =25°C
-
0°C::;Tj::;125°C
-
-
8.5
Test Conditions
Symbol
Vo
Tj =25°C, Vi =27V to 38V
Vi = 28V to 38V
Line Regulation
6Vo
Vi = 30V to 36V
10::;1A
Load Regulation
6V o
Tj =25°C
0.25A ::;10::; 0.75A
5mA::; 10 ::; 1A
Quiescent Current
Id
10= 1A
120
8
5mA::;lo::;1A
-
-
0.5
61d
Tj =25°C
10::;1A, Vi = 28V to 38V
-
-
1.0
Vi = 27V to 38V
-
-
1.0
Output Noise Voltage
Vn
Ta = 25°C, f
-
170
-
50
66
-
Ripple Rejection
RR
50
-
-
-
2.0
-
Quiescent Current
Change
=10Hz to 100KHz
=
=28V to 38V
=
f =120Hz, Vi =28V to 38V
f 120Hz, Vi
Tj 25°C
0°C::;Tj::;125°C
Dropout Voltage
Vd
Peak Output Current
Ipeak
Short-Circu it Current
Ise
Average TC of Vout
6V o/6T
Output Resistance
Ro
=1A, Tj =25°C
Tj =25°C
10
Vi
=35V, Tj =25°C
10=5mA
f
=1KHz
Unit
V
mV
mV
mA
mA
p.V
dB
V
-
2.2
-
A
-
250
-
mA
-2.8
37
mV/oC
mn
* Load and line regulation are specified at a constant junction temperature. Changes in Vo due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
.
328
LINEAR INTEGRATED CIRCUIT
KA350
T0-3P
3A ADJUSTABLE POSITIVE VOLTAGE
REGULATOR
The KA350 is adjustable 3·terminal positive voltage regulator capable
of supplying in excess of 3.0A over an output voltage range of 1.2V to 33V.
This voltage regulator is exceptionally easy to use and require only two
external resistors to set the output voltage. Further, they employ internal
current limiting, thermal shutdown and safe area compensation, making
them essentially blow-out proof. All overload protection circuitry remains
fully functional even if the adjustment terminal is accidentally
disconnected.
FEATURES
•
•
•
•
•
•
•
•
•
•
Output adjustable between 1.2V and 33V
Guaranteed 3A output current
Internal thermal overload protection
Load regulation typically 0.1 %
Line regulation typically 0.005%N
Internal short·circuit current limiting constant
with temperature.
Output transistor safe·area compensation
Floating operation for high voltage application
Standard 3·lead transistor package
Eliminates stocking many fixed voltages
1: Ad! 2: Output 3: Input
Device
Package
KA350H
TO·3P
KA350T
TO·220
Operating Temperature
o -125°C
BLOCK DIAGRAM
VOLTAGE
REFERENCE
PROTECTION
CIRCUITRY
RSC
ADJUSTABLE
c8SAMSUNG
Electronics
OUTPUT
329
•
KA350
LINEAR INTEGRATED CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Characteristic
Input-Output Voltage Differential
Lead Temperature
(Soldering, 10 sec)
Symbol
Value
Unit
YIN - VOUT
35
Voc
T'ead
300
°C
Po
Internally limited
Power Dissipation
Operating Junction Temperature Range
Topr
o-
+ 125
°C
Storage Temperature Range
T stg
-65 -
4-150
°C
ELECTRICAL CHARACTERISTICS
(V'N-VOUT =5V, IOUT=1.5A, Tj=O°C to 125°C; Pmax , unless otherwise specified)
Characteristic
Symbol
Test Conditions
Line Regulation
6Vo
Ta=25°C,3VsV,-Vos35V
(Note 1)
Load Regulation
6Vo
Ta= 25°C, 10mAslos3A
Vos5V (Note 1)
Vo~5V (Note 1)
Adjustment Pin Current
Min
ladj
Adjustment Pin Current Change
61 adj
3VSV,-Vos35V,
10mAs1 L s3A, POSPMAX
Thermal Regulation
REG therm
Reference Voltage
VREF
3V 5,V,- Vo5,35V, 10mA5,lo5,3A, P5,30W
Line Regulation
6V o
3.0VSV,- VoS35V
Load Regulation
6Vo
10mAslos3.0A
Vos5.0V
Ts
1.2
0.03
%N
5
0.1
25
0.5
mV
50
100
/LA
0.2
5.0
/LA
%
%fW
1.25
1.30
V
0.02
0.07
%N
20
0.3
70
1.5
mV
%
%
3.0
4.5
A
V,-V o=30V, POSPMAX, Ta=25°C
0.25
1.0
A
Minimum Load Current
IM'N
RMS Noise, % of VOUT
VN
10HzSfS10KHz, Ta=25°C
RR
Vo=10V, f=120Hz,
Cadj =0
Cadj = 10/LF
S
0.005
V,- VoS10V, POSPMAX
IMAX
Long-Term Stability
Unit
1.0
Tj =O°C to 125°C
Maximum Output Current
Ripple Rejection
Max
0.002
Pulse = 20mS, Ta= 25°C
Vo~5.0V
Temperature Stability
Typ
V,-V o=35V
Tj = 125°C
3.5
66
10
mA
0.003
%
65
80
dB
dB
0.3
1
%
Note 1: Regulation is measured at constant junction temperature. Changes in output voltage due to heating effects
must be taken into account separately. Pulse testing with low duty cycle is used.
c8SAMSUNG
Electronics
330
KA3S0
LINEAR INTEGRATED CIRCUIT
TYPICAL PERFORMANCE CHARACTERISTIC
Fig. 2 WRREN UMIT
Fig. 1 LOAD REGULATION
T,=25"C
LWQUT=l00mV
0.4
~
ILl
CI
0.2
"\.
z
c
-
:z::
()
ILl
c:J
~-0.2
~
-
k=500mA-
~- ~
\,
~~
5-0.4
I!:
'\ '-
--+
~
~-0.6
>
I-
~
~
0
I
I-
it
1.5
iii!:
40
oj
I
->
35
o
25
50
75
100
25
125
Fig. 5 TEMPERATURE STABILITY
T,=25"C
--......r--..-
ILl
~
~
1
--.......
z
ILl
rr:
~
()
I-
~
1/1
ILl
ffi
lI!
S
0
.J 1,230
,
2.5
V
1.5
.l
.5
1,220
50
75
100
TJ, JUNCTION TEMPERATURE (OC)
c8SAMSUNG
Electronics
125
i
,
3.5
125
o
/
/V
ffi
()
25
I
I-
~1,240
o
100
Fig. 6 MINIMUM LOAD CURRENT
4.5
1,260
~1,250
75
50
TJ, JUNCTION TEMPERATURE (OC)
TJ, JUNCTION TEMPERATURE (OC)
I~
C---/~I
I
I
o
i
10
15
20
25
30
35
V,-v", INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V..)
331
KA350
LINEAR INTEGRATED CIRCUIT
TYPICAL PERFORMANCE CHARACTERISTICS
Fig. 8 RIPPLE REJECTION vs loUT
Fig. 7 RIPPLE REJECTION vs Vour
140
100
I
...
80
~
~
120
'~........
iii'
z
2
CA"j=10I'F
60
r-----
iii' 100
~
.1
z
'"'"- Codl=O
~
~
Ul
a:
w
..J
""-
...-
0
w
""-
..J
40
80
-
V
60
iii:
a:
a:
N
C""I=O
40
V,=15V
20 f-V,-Vo=5V
1,=500mA
f-f=120Hz
TJ=r5 'C
r- Vo=10V
20
--
f= 120Hz
TJ=25'C
'J III
o
10
15
20
25
30
35
0.1
0.Q1
Yo. OUTPUT VOLTAGE (V)
Fig. 9 RIPPLE REJECTION vs FREQUENCY
....
/
1"---.
V/ ~ ~
V
~ \
f\ 1\
\, \
iii'
~
z
60
&l
~V,_15V
V,=15V Vo= 10V
TJ=25'C _
t- Vo 10V
t-1c=500mA
TJ=25'C
40
iii:
a:
a:
20
,
C""I=O
1
10
\
"~
1.5
~~
1.0
1K
10K
100K
f. FREQUENCY (Hz)
1M
10
10M
o!;( 0.5
~i1i
<]C
rr-
~. \
C,=1I'F: CADJ=1OI'F
.
1.0
~'=O:C"'I=O
~~
=>z
~~
c'=11I'F:
0_
c5Gj
$
~
-1
ffi
-3
C
«
0.5
~«
9
<]u
:J
>x:
20
f. TIMEII'S)
c8~SUNG
30
40
I
.
0.5
f
J'"
ADJ = 10I'F
,
'
,Ic,=o! Codl!O
V
1.5
a:
a:
:::> 1.0
u
V,
10
1M
n
~
0
-2
0
~~
=>w
~~
100K
12 LOAD TRANSIENT RESPONSE
Fig.
I
-1.0
10K
w
:/
-1.5
1K
CI
<]C
-0.5
!:;
J
Vo =10V _
1,=50mA
2
11\
100
f. FREQUENCY (Hz)
.I.
;2
w
I
10- 3
100
Fig. 11 LINE TRANSIENT RESPONSE
«CI
/
V
Ij:Codl = 1Ol'F
V- i'- ~
w
~z
./
'-
°
0
V
C""I=O
w
..J
Fig. 10 OUTPUT IMPEDANCE
C.c1J=lO"F
Ul
a:
""-
.............
10
10
1'~500mA
80
'1
10 • OUTPUT CURRENT (A)
100
i=
~
iii:
a:
a:
0
CADJ=10I'F
f-""""
L
J~'=15V
~Ic
Vo =10V -
\ I\~:r'-
1\
II
~
10
20
30
40
f. TIMEII's)
332
KA350
LINEAR INTEGRATED CIRCUIT
APPLICATION INFORMATION
STANDARD APPLICATION
VIN
0
IN
KA350
111
ADJ
Ig'~'F
I.~
-0 VOUT
OUT
R1
. ~ 120
I
). VR2
1~:F
I
Ii
Fig. 13
ein: e in is required if regulatpr is located an appreciable distance from power supply filter.
eo: Output capacitors in the range of 1,uF to 100,uF of aluminum or tantalum electrontic are commonly used to
provide improved output impedance and rejection of transients.
In operation, KA350 develops a nominal 1.25V reference voltage, Vret, between the output and adjustment
terminal. The r~ference voltage is impressed across program resistor R1 and, since the voltage is constant, a
constant current 11 then flows through the output set resistor R2, giving an output voltage of
R2
Vout = 1.25V (1 +~) + IADJ R2
Since IADJ current (less than 100,uA) from the adjustment terminal represents an error term, the KA350 was
designed to minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating
current is returned to the output establishing a minimum load current requirement. If there is insufficient load on
the output, the output voltage will rise.
Since the KA350 is a floating regulator, it is only the voltage differential across the circuit which is important
to performance, and operation at high voltage with respect to ground is possible.
c8SAMSUNG
Electronics
333
KA350
LINEAR INTEG·RATED CIRCUIT
TYPICAL APPLICATIONS
Fig. 14 LIGHT CONTROLLER
VIN
KA350
IN
Ffg. 15 PRECISION POWER REGULATOR WITH
LOW TEMPERATURE COEFFICIENT
OUT t---~~-----1>-O Your
ADJ
VIN
KA350
IN
OUT 1--..__----_._-0 Voun~4V
IN457
R1
375
A---<10K
IN457
R2
* Adjust for 3.7SV across R1 L-_~--~2~K~
OUTPUT
ADJUST
Fig. 17 SLOW TURN·ON 15V REGULATOR
Fig. 16 ADJUSTABLE REGULATOR WITH
IMPROVED RIPPLE REJECTION
VIN
VIN 0----.----11 N
C2
KA350
OUTIt--------~r-O Your
ADJ
'----..,......--... R1
1·1!'F
C1 +
10!,F
240
01"
1M4802
IN
C2
KA350
OUT
ADJ
1·1!'F
1N4002
+
C3
1!,Ft
R2
5K
+
C1
100!,F
t Solid tantalum
.. Discharges C1 if output is shorted to ground
Fig. 18 0 TO 30V REGULATOR
KA350
Fig. 19 5V LOGIC REGULATOR WITH
ELECTRONIC SHUTDOWN*
OUTt---~.....--o VOUT
VIN Q - -_ _---IIN
7V-36V
KA350
OUTt--_.__-__-Q ~~ur
ADJ
R1
240
LM113
1.2V
I--+--'VY'I~O
TIL
1K
R3
680
-10V
c8SAMSUNG
Electronics
.
.. Min output = 1.2V
334
KA350
LINEAR INTERGRATED CIRCUIT
TYPICAL APPLICATIONS
(Continued)
Fig. 20 PRECISION CURRENT LIMITER
Fig. 21 1.2V - 20V REGULATOR WITH MINIMUM
PROGRAM CURRENT
IN
R1*
KA350
OUTJ------QVOUT
ADJ
*
O.4~R1 ~120n
* Minimum load current = 4mA
Fig. 22 5A CONSTANT VOLTAGE/CONSTANT CURRENT REGULATOR
35V D--..----4\NV+---1IN
KA350
OUT I-.-_____---.;:==========~~~-~~
__
ADJ
C3
>--
1.2V- 30
+
+
t Solid tantalum
" Lights in constant current mode
•
OUTPUT
C6
lO",F
-6V TO -15V
Fig. 23 12V BATTERY CHARGER
500
R6
0.2
OUT~--__-_------_--~rvY-----.----uVOUT
+
ADJ
LED
TO 12V
BATTERY
R1
3K
c8SAMSUNG
Electronics
335
KA350
LINEAR INTEGRATED CIRCUIT
R2
720
Fig. 24 TRACKING PREREGULATOR
Fig. 25 3A CURRENT ·REGULATOR
R1
240
VIN
KA350
IN
OUT
ADJ
VIN
KA350
IN
KA350
IN
OUT
OUT
C1
VOUT
0.1"FJ;
ADJ
R3
120
+ C2
C1
0.1"F
1"F
R4
1K
OUTPUT
ADJUST
Fig. 26 ADJUSTING MULTIPLE ON·CARD REGULATORS WITH SINGLE CONTROL *
VIN
IN
VOUT
KA350
OUTI--1..........-o
IN
KA350
-+-_ _ _ _ _ _ _--' ________ -
Fig. 28 SIMPLE 12V BATTERY CHARGER
Rs*
0.2
-
OUT
~
IN
VIN
KA350
OUT
ADJ
:
1\
---+--------'
* All outputs within ± 100mV
ADJ
12 V p. p
- - -
t Minimum load -10mA
Fig. 27 AC VOLTAGE REGULATOR
KA350
120
6 Vp.Q
3A
,
1000"F**
1
\
I
LJ
R2
2.4K
I
480
R1
120
+
I
\J
VOUTt
1N4002
L..-_ _ _ _
R2
1K
OUT
ADJ
1N4002 .
1N4002
0 - - IN
KA350
IN
OUT
ADJ
ADJ
1
:~ 480
I
120
~~
0--- IN
KA350
OUT
c8SAMSUNG
Electronics
ZoUT = Rs (1
Use of Rs allows low charging rates with fully
charged battery.
** 1000j.!F is recommended to filter
out any input transients.
* Rs - sets output impedance of charger
ADJ
-
.~
+~)
1
336
KA3524
LINEAR INTEGRATED CIRCUIT
REGULATOR PULSE WIDTH MODULATOR
16 DIP
The KA3524 regulating pulse width modulator contains all of the
control circuitry necessary to implement switching regulators of either
polarity, transformer coupled DC to DC converters, transformerless
polarity converters and voltage doublers, as well as other power control
applications. This device includes a 5V voltage regulator capable of
supplying up to 50mA to external circuitry, a control amplifier, an
oscillator, a pulse width modulator, a phase splitting flip-flop, dual
alternating output switch transistors, and current limiting and shut-down
circuitry. Both the regulator output transistor and each output switch
are internally current limiting and, to limit junction temperature, an
internal thermal shutdown circuit is employed.
FEATURES
•
•
•
•
•
•
•
I
Complete PWM power control circuitry
Operation beyond 100KHz
2% frequency stability with temperature
Total quiescent current less than 10mA
Single ended or push-pull outputs
Current limit amplifier provides external component protection
On-Chip protection against excessive junction temperature and
ORDERING INFORMATION
output current
• 5V, 50mA linear regulator output available to user
Device
BLOCK DIAGRAM
Package
Operation Temperature
KA3524N
16 DIP
o-70°C
**KA2524N
16 DIP
-25 -85°C
* * Under development
OSCILLATOR
OUTPUT
CIII
81
EA
CBI
82
Es
CURRENT
LIMIT
GROUND
(SUBSTRATE)
Fig. 1
c8SAMSUNG
Electronics
337
LINEAR INTEGRATED CIRCUIT
KA3524
ABSOLUTE MAXIMUM RATINGS
Symbol
Characteristic
Value
Unit
Power Supply Voltage
Vee
40
V
Reference Output Current
IREF
50
mA
Output Current (Each Output)
10
100
mA
Oscillator Changing Current (pin 6 or 7)
Icharge
5
mA
Lead Temperature (Soldering, 10 sec)
Tlead
300
°C
mW
Power Dissipation
Po
1000
Operating Temperature
Topr
0-+70
°C
Storage Temperature
T519
-65 -+ 150
°C
ELECTRICAL CHARACTERISTICS
(VIN
= 20V, f = 20KHz, Ta = 0 to 70°C. unless otherwise specified)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
4.6
5.0
5.4
V
REFERENCE SECTION
Output Voltage
Vo
Line Regulation
6V o
VIN =8-40V
10
30
mV
Load Regulation
L.Vo
IL =0-20mA
20
50
mV
Ripple Rejection
RR
f = 120Hz, Ta= 25°C
66
dB
Short~Circuit
Ise
Vref=O, Ta=25°C
100
mA
Output Current
Temperature Stability
Ts
Long Term Stability
S
0.3
• Ta= 25°C
1
%
20
mV/Khr
CT = 0.001JLF, RT = 2Kn
350
KHz
RT and CT constant
5
OSCILLATOR SECTION
Maximum Frequency
f MAX
Initial Accuracy
Frequency Change with Voltage
Frequency Change with Temperature
6f
VIN =8-40V, Ta=25°C
%
1
%
2
%
6f
Over operating temperature range
VA3
Ta= 25°C
3.5
V
V3PW
CT=0.01JLF, Ta=25°C
0.5
JLS
Input Offset Voltage
VIO
VCM=2.5V
2
10
mV
Input Bias Current
118
VCM=2.5V
2
10
. JLA
Output Amplitude (Pin 3)
Output Pulse Width (Pin 3)
ERROR AMPLIFIER SECTION
Open Loop Voltage Gain
Avo
Common-Mode Input Voltage Range
VeR
Ta= 25°C
CMRR
Ta=25°C
BW
Av == OdB, Ta == 25°C
Vosw
Ta=25°C
Common-Mode Rejection Ratio
Small Signal Bandwidth
Output Voltage Swing
c8SAMSUNG
Electronics
60
80
1.8
dB
3.4
70
3
0.5
V
dB
MHz
3.8
V
338
KA3524
LINEAR INTEGRATED CIRCUIT
ELECTRICAL CHARACTERISTICS (Continued)
(V 1N =20V, f=20KHz, Ta=0-70°C unless otherwise specified)
Characteristic
Symbol
Test Conditions
Min Typ
Max
Unit
COMPARATOR SECTION
Maximum Duty Cycle
DC max
% Each output on
Input Threshold (Pin 9)
VTH1
Zero duty cycle
1
V
Input Threshold (Pin 9)
VTH2
Maximum duty cycle
3.5
V
1
p,A
Input Bias Current
45
Ie
%
CURRENT LIMITING SECTION
Sense Voltage
V(Pin 2) - V(Pin 1)~50mV
Pin 9=2V, Ta=25°C
Vsanse
180
Sense Voltage T.C.
200
220
mV/oC
0.2
•Common-Mode Voltage
0.7
mV
1
V
0.1
50
p,A
1
2
OUTPUT SECTION (EACH OUTPUn
Collector-Emitter Voltage
Collector Leakage Current
40
VCEO
V
kKg
VcE =40V
V SAT
IC=50mA
Emitter Output Voltage
VE
V1N =20V,
Rise Time (10% to 90%)
tr
Fall Time (90% to 10%)
tl
ISTD
V1N =40V, PINS 1,4,7,8,11
and 14 are grounded, Pin 2 = 2V
All other inputs and
outputs open
5
Saturation Voltage
Total Standby Current
17
V
18
V
RC=2KO, Ta=25°C
0.2
p,s
RC=2KO, Ta=25°C
0.1
p,s
10
rnA
APPLICATION INFORMATION
Voltage Reference
An internal series regulator provides a nominal 5 volt output which is used both to generate a reference voltage
and is the regulated source for aI/ the internal timing and controlling circuitry. This regulator may be bypassed
for operation from a fixed 5 volt supply by connecting pins 15 and 16 together to the input voltage. In this configuration,
the maximum input voltage is 6.0 volts.
This reference regulator may be used as a 5 volt source for other circuitry. It will provide up to 50mA of current
itself and can easily be expanded to higher current with an external PNP as shown in Figure 2.
EXPANDED REFERENCE CURRENT CAPABILITY
1000
VREF
+
",l
J ~E~~~~~G
ON
CHOICE FOR 01
GNDo---------------~--------~u
Fig. 2
c8SAMSUNG
Electronics
339
I
LINEAR INTEGRATED CIRCUIT
KA3524
Oscillator
The oscillator in the KA3524 uses an external resistor (R T) to establish a constant charging current into an external
capacitor (CT). While this uses more current than a series connected RC, it provides a linear ramp voltage on the
capacitor which is also used as a reference for the comparator. The charging current is equal to 3.6V + RT and
should be kept within the range of approximately 30JtA to 2mA, i.e., 1.8K Source Exif Data:
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