1991_NEC_Product_Selection_Guide 1991 NEC Product Selection Guide
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PRODUCT SELECTION GUIDE
NEe
NEe Electronics Inc.
ttlEC
1991
PRODUCT SELECTION
GUIDE
March 1991
Stock No. 10006
@1991 NEe Electronics Inc.lPrinted in U.S.A.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Electronics Inc. The information in this document is subjectto change without notice. Devices sold
by NEC Electronics Inc. are covered by the warranty and patent indemnification provisions appearing in NEC
Electronics Inc. Terms and Conditions of Sale only. NEC Electronics Inc. makes no warranty, express, statutory,
implied, or by description, regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. NEC Electronics Inc. makes no warranty of merchantability or fitness for any
purpose. NEC Electronics Inc. assumes no responsibility for any errors that may appear in this document. NEC
Electronics Inc. makes no commitment to update or to keep current the information contained in this document.
~EC
ii
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Introduction •
Memory Products •
Single-Chip Microcomputers
4-Bit Microcontrollers
V-Series and RISC Microprocessors and Peripherals
Intelligent Peripheral Devices (IPD)
DSP and Speech Products
III
a
III
III
D
Development Tools for Micro products.
Telecom/ISDN Devices •
ASIC Products
Capacitors
Fluorescent Indicator Panel Displays (FIPs)
Optoelectronic Devices
m
m
IfJI
lEI
m
,
Consumer ICs
I
Field Sales Offices and ASIC Design Centers
iii
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t-IEC
iv
ftt{EC
Contents
Section 1. Introduction
Memory Products ............................................. 1-3
Single-Chip Microcomputers ................................... 1-3
4-Bit Microcontrollers ......................................... 1-3
V-Series Microprocessors and Peripherals ....................... 1-3
RISC Microprocessors ......................................... 1-4
Intelligent Peripheral Devices (lPD) ............................. 1-4
DSP and Speech Products ..................................... 1-4
Development Tools for Micro Products .......................... 1-4
Telecom/ISDN Devices ......................................... 1-4
ASIC Products ................................................ 1-5
Capacitors ................................................... 1-5
Fluorescent Indicator Panel Displays (FIPs) ...................... 1-5
Optoelectronic Devices .....................•.................. 1-5
Consumer ICs ................................................ 1-5
Section 2.
Memory Products
Device Numbering.Guide ...................................... 2-3
Product Line Overview ........................................ 2-5
Application-Specific Devices ................................... 2-7
Memory Cards ................................................ 2-8
Dynamic RAM Modules ........................................ 2-8
Dynamic RAMs ............................................... 2-10
Static RAMs ......................................... , ....... 2-11
ECl RAMs .................................................... 2-13
EPROMs ..................................................... 2-14
EEPROMs ............................................•...... 2-14
Mask Programmable ROMs ................................... 2-15
Section 3. Single.Chlp Microcomputers
Part Numbering System ....................................... 3-2
4-Bit, Single-Chip CMOS Microcomputers; 75xx Series ........... 3-3
4-Bit, Single-Chip CMOS Microcomputers; 75xxx Series .......... 3-4
8-Bit, Single-Chip CMOS Microcomputers; 78xx Series ........... 3-6
8-Bit, Single-Chip CMOS Microcomputers; 782xx (K2) Series ...... 3-7
8/16-Bit, Single-Chip CMOS Microcomputers; 783xx (K3) Series ... 3-8
Section 4. 4·Bit Microcontrollers
Part Numbering System ....................................... 4-2
17K Family of 4-Bit Microcontrollers ............................ 4-3
Development Tools for 17K Family .............................. 4-5
v
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Contents
Section 5. V-Series and RISC Microprocessors
and Peripherals
Part Numbering System ............ '" ........................ 5-2
V-Series CMOS Microprocessors ............................... 5-3
V-Series CMOS System Support Products....................... 5-4
RISC Microprocessors and Peripherals .......................... 5-5
Section 6. Intelligent Peripheral Devices (IPD)
Part Numbering System ....................................... 6-2
Communications Controllers ......................•........... 6-3
Graphics Controllers .......................................... 6-3
Advanced Compression/Expansion Engine ...................... 6-3
Floppy-Disk Controllers ....................................... 6-4
Hard-Disk Controllers ...................................., ..... 6-4
Section 7. DSP and Speech Products
Part Numbering System ....................................... 7-2
Digital Signal Processors ...................................... 7-3
Speech Processors............................................ 7-4
Section 8. Development Tools for Micro Products
V-Series Microprocessors ...................................... 8-3
75xx Series Single-Chip Microcomputers ........................ 8-7
75xxx Series Single-Chip Microcomputers ....................... 8-9
78xx Series Single-Chip Microcomputers ....................... 8-12
782xx Series Single-Chip Microcomputers .•.................... 8-14
783xx Series Single-Chip Microcomputers ...................... 8-16
DSP and Speech Products .................................... 8-18
PG-1500 Programming Adapters .............................. 8-20
Section 9. Telecom/ISDN Devices
Part Numbering System ....................................... 9-2
CMOS Combos ............................................... 9-3
SLICs ........................................................ 9-3
POTS ........................................................ 9-4
Crosspoint SWitches .......................................... 9-4
ISDN Devices ................................................. 9-4
Section 10. ASIC Products
ECL-3B, -4, -4A .............................................. 10-3
CMOS-4 ..................................................... 10-4
CMOS-4A, -4L ............................................... 10-4
CMOS-4R ................................................... 10-5
CMOS-5, -5U, -5V............................................. 10-5
CMOS-6, -6A ................................................ 10-6
CMOS-7 ..................................................... 10-6
BiCMOS-4, -4A, -5 ............................................ 10-7
SC-5 Standard Cell and CB-C7 Cell-Based CMOS ASICs ........ 10-8
vi
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Contents
Section 11. Capacitors
Capacitors Cross-Reference .................................. 11-3
Part Numbering System ..................................... 11-3
P-Series ................................................... 11-3
D-Series................................................... 11-4
Q-Series .................................................. 11-4
R-Series ................................................... 11-5
SVE-Series ................................................ 11-6
FA-Series .................................................. 11-7
FE, FS, FYD, FYH, FYL, FR-Series ........................... 11-7
High-Capacitance, Resin-Dipped ........................... 11-7
Solid Tantalum Capacitors
D-Series, Resin-Dipped Radial .............................. 11-8
P-Series, Miniature Epoxy-Dipped .......................... 11-11
Q-Series, Resin-Dipped .................................... 11-13
R-Series, Miniature Encapsulated Chip ..................... 11-15
SVE-Series, Surface-Mount Chip Tantalum
With Built-In Fuse ......................................... 11-19
Supercap Electric Double-Layer Capacitors
FA-Series................................................. 11-21
FE-Series................................................. 11-22
FS-Series................................................. 11-23
FYD-Series ............................................... 11-24
FYH-Series ............................................... 11-25
FYL-Saries ............................................... 11-26
FR-Series ................................................ 11-27
High-Capacitance, Resin-Dipped, Multilayer
Ceramic Capacitors ........................................ 11-28
Section 12. Fluorescent Indicator Panel Displays (FIPs)
Part Numbering System ...................................... 12-3
Data Terminal and Others (Dot Type and Graphic Type) ......... 12-4
Display Configuration Table .................................. 12-8
Data Terminal and Others (Alphanumeric Type) ................ 12-10
Automotive and Others ...................................... 12-12
Audio, Analog Instruments, and Others ....................... 12-14
Digital Clock, Timer, Measuring Meter, and Others ............. 12-16
ECR and Others .......•.......... '" ........................ 12-18
Calculator and Others ....................................... 12-20
Dot Type Fluorescent Indicator Modules ...................... 12-22
Mechanical Characteristics ................................ 12-22
General Characteristics ................................... 12-22
Electrical Characteristics .................................. 12-23
Display Functions........ '... '" '" ........................ 12-23
Chip-in-Glass FIP Modules ..... '" ........................... 12-24
Mechanical Characteristics ................................ 12-24
General Characteristics ................................... 12-24
Electrical Characteristics .................................. 12-25
Display Functions .............. '" ........................ 12-25
vii
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Contents
Section 13. Optoelectronic Devices
Part Numbering System ...................................... 13-3
ACTIVE DEVICES
Laser Diodes ................................................ 13-4
Light Emitting Diodes ........................................ 13-6
Fiber Optics .............................................. 13-6
Remote Control ........................................... 13-7
Avalanche Photo Diodes. '" ........ , ......................... 13-8
PIN Photo Diodes ............................................ 13-9
Fiber Optics ............................. '" ............... 13-9
Remote Control ...............•........................... 13-9
Optical Disk .............................................. 13-10
Photo Transistors ......................................... 13-10
Photo ICs ................................. '" .............. 13-11
Photo Interrupters ................... '" ...... , ... '" ..... 13-11
Optical Disk .............................................. 13-11
Optoisolators ............................................... 13-12
Can Type ................................................ 13-12
Multichannel Type .. : ..................................... 13-12
Surface-Mount Type .•.................................... 13-13
6-Pin Type .........................•..................... 13-14
High-Speed Type .......................................•. 13-15
Ultra-High-Speed Type .................................... 13-15
Photo SCR Coupler ....................................... 13-15
Photo Interrupters .......................................... 13-16
Transistor Output Type ...................................... 13-16
IC Output Type ................... , ......................... 13-18
Fiber-Optic Datalinks ....................................... 13-20
PASSIVE DEVICES
Acousto Optics
Modulators .............................................. 13-21
Modulator Drivers ........................................ 13-21
Fiber Optics
Atfenuators .............................................. 13-22
Cable Assemblies ........................................ 13-22
Connectors ............. '" ..... , ........................ 13-23
Couplers/Splitters/Line Monitors ........................... 13-23
SWitches ................................................. 13-23
Termination Equipment and Supplies ...................... 13-24
Wavelength Division Multiplexers!Bandpass Filters .......... 13-24
Optical Isolators ............................................ 13-24
Optoisolator Cross-Reference ................................ 13-25
Sensors and IR Emitters Cross-Reference ..................... 13-27
viii
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Contents
Section 14. Consumer ICs
Part Numbering System ...................................... 14-2
Audio ICs.................................................... 14-3
Radio/Cassette ICs ........................................ 14-3
Power Amplifier Circuits .................................... 14-3
Phase-Locked Loops ....................................... 14-4
Prescalers ................................................. 14-4
Digital Tuning Systems: pPD1700 Series ....................... 14-5
17K Family of 4-Bit Microcontrollers ........................... 14-7
TV ICs ....................................................... 14-9
IDTV (Improved Definition TV) ICs ............................. 14-9
EDTV (Enhanced Definition TV) ICs ............................ 14-9
On-Screen Display ICs ....................................... 14-10
Infrared Remote ControllCs .................... , ............. 14-10
Receiver Preamplifiers ..................................... 14-10
Transmitters .............................................. 14-10
Converters .....•........................................... 14-11
Digital-to-Analog Converters ............................... 14-11
Analog-to-Digital Converters ............................... 14-11
Display Driver ICs ...... " ......................... , ......... 14-11
RS-232 Line DriverS/Receivers ................................ 14-12
Charge-Coupled Devices (CCD Image Sensors) ................ 14-12
Clock ICs ................................................... 14-12
E2 PROMs ............. " ............. , ..................... 14-13
Hard-Disk Drive ICs.................... , ..................... 14-13
Miscellaneous ICs ........................................... 14-13
Section 15. Field Sales Offices and ASIC Design Centers
ix
Contents
x
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Introduction . .
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Introduction
Section 1.
Introduction
Memory Products .............................................. 1-3
Single-Chip Microcomputers .................................... 1-3
4-Bit Microcontrollers........................................... 1-3
V-Series Microprocessors and Peripherals .................. , ..... 1-3
RISC Microprocessors .......................................... 1-4
Intelligent Peripheral Devices (IPD) ............................... 1-4
DSP and Speech Products ...........................•.......... 1-4
Development Tools for Micro Products .......... ; ................ 1-4
Telecom/lSDN Devices .......................................... 1-4
ASIC Products ................................................. 1-4
Capacitors..................................................... 1-5
Fluorescent Indicator Panel Displays (FIPs) ....................... 1-5
Optoelectronic Devices ......................................... 1-5
Consumer ICs.................................................. 1-5
1-2
NEe
NEC, the world's largest semiconductor supplier, offers
one of the most diversified product lines in the industry. This product selection guide lists major NEC products in the categories described below. To order product literature, contact your local NEC sales
representative or call the toll-free number shown on the
back cover of this guide.
Memory Products
NEC's memory product line features the industry's
most comprehensive selection of device types, configurations, packaging options, and process technologies. Among our new application-specific products, for
example, are high-performance devices for graphics,
video/lV, communications, image processing, data
processing, and other specialized applications. Five
versions of the new 4M DRAM join our DRAM product
line. Other new products include by-B and by-16
DRAMs, a 1M SRAM, high-speed SRAMs, a 4M EPROM,
a 16M mask-programmable ROM, some ECl RAMs, and
EEPROMs too.
Sing Ie-Chip Microcomputers
NEC offers several series of 4-bit, B-bit, and 16-bit
microcomputers. Except for some 4-bit devices, all
products are available in OTP and EPROM versions for
quick turnaround time. Each product also comes in a
variety of packages, including SDIP, PlCC, and plastic
QFP.
The 4-bit microcomputer series are 75xx for low-end,
low-cost applications and 75xxx for high-performance
applications. Each series offers a selection of on-board
peripherals, such as LCD controller/drivers, FIP
controller/drivers, analog-to-digital converters, serial
ports, etc. In addition, the 75xxx series has a selection
of ROMs up to 32K bytes.
NEC continues to enhance the popular 78xx series. The
new members, 7BC1B and 7BCP1B, are now available
with 32K bytes of ROM, UVEPROM, or OTPROM.
The newly introduced K-series are families of B-bit (K2)
and B/16-bit (K3) microcomputers. What sets the
K-series apart from conventional microcomputers is
the peripheral management unit. The PMUT. allows the
peripherals to operate with minimal CPU intervention,
improving microcomputer throughput by a factor of 2
to 4.
Registered trademarks of NEC Corporation: V20, V30, FIP
Trademarks of NEC Corporation: V25, V33, V35, V40, V50. V53, PMU,
Supercaps
Introduction
4-Bit Microcontrollers
The 17K family of 4-bit digital microcontrollers comprises four device groups: digital tuning (J.tPD170xx),
general-purpose
(J.tPD171xx),
remote
control
(J.tPD172xx), and home automation (J.tPD173xx). All the
devices have the same CPU core but different on-chip
peripherals according to the target application. The
4-bit microcomputer on each device has a maximum
ROM address space of 16K 16-bit words.
V-Series Microprocessors and Peripherals
The V-series is a CMOS microprocessor family designed for high performance, high integration, and low
power consumption. The product line consists of two
groups, each designed for high-speed data processing
in embedded system environments.
(1) The microprocessor group contains the V20-V50
devices and their H-series versions as well as the
V33 and V53 devices.
(2) The microcontroller group contains the V25 and
V55 families.
Every V-series device supports an instruction superset
ofthe JlPDB08B/B086, which provides code transportability within the V-series as well as extremely efficient
software development in standard IBM-PC and compatible computers.
V20-V50. The JlPD70108/70116 (V20tl!!N3fJBJ) provide pin
compatibility and significant performance improvement over the JlPDB088/8086 devices. The V20H and
V30H target low-power 16-MHz system solutions with
fully static internal circuits. The JlPD70208/70216
(V40™ N50™) combine the V20N30 cores with traditional PC style peripherals and target high-bandwidth,
multichannel designs such as data controllers and host
system interfaces. The V40 and V50 also have fully
static 16-MHz cousins in the V40H and V50H.
V33 and V53. The JlPD70136/70236 (V33™N53TM) are
V30-compatible microprocessors using hard-wired
logic implementations, raising their performance several levels above the V20N30. The V53 uses the V33
core and again adds common PC-style peripherals.
These devices target designs requiring extremely high
performance combined with high-bandwidth data
transfer capability and large (16 megabyte) addressing
capacity. Both the V33 and V53 are supported by the
JlPD72291 hardware numeric coprocessor (for performance) or the standard Intel iB02B7 (for compatibility).
V25 and V55. The V25™ family comprises V20N30
instruction set compatible microcontrollers that integrate event and data control peripherals as well as
1-3
II.;
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Introduction
internal memory and parallel I/O port capability. The
members of this family include versions for SRAM
interfaces, DRAM interfaces, software secure operation, and built-in real-time executives. The extension of
the V25 family is with the V55 family, which boosts
performance and integration with multiple parallel external buses and synchronous serial port capability.
Peripherals. The V-series microprocessor peripherals
include many I/O peripherals in the PC-style tradition
as well as an advanced cache memory controller
(pPD71641) and high-integration devices like the
JlPD71101.
RISC Microprocessors
The VA series is a family of high-performance, 32-bit
RISC microprocessors targeted for workstation and
high-end embedded controller markets. It comprises
the following devices.
(1) JlPD30310 CPU. This VA3000A device includes a full
32-bit RISC CPU and a system control coprocessor.
The latter contains a translation lookaside buffer
and control registers to support a virtual memory
subsystem and separate instruction and data
cache controllers. System clock frequency options
are 25, 33, and 40 MHz.
(2) JlPD30311 FPP. This V~010A device operates as a
coprocessor to the CPU for floating-point arithmetic operatibns.
(3) JlPD31311 Bus Interface Unit. The BIU contains a
four-stage write buffer and a one-stage read buffer.
Frequency options are 25 and 33 MHz.
(4) JlPD30360 RISC Microprocessor. This V~6OO device
integrates a CPU and FPU on the same chip. Frequency options are 25 and 33 MHz.
(5) JlPD46710 and JlPD46741 SRAM. Memory is organized as two cores, each 16K x 10 bits (46710) or 8K x
20 bits (46741).
Intelligent Peripheral Devices (IPD)
The IPD family from NEC supports various functions
such as communication, graphics, and data storage
requested by a CPU. To provide customers a wide
choice of protocols, communication devices include
serial communication controllers (7201, 72001, 72002)
and an HDLC frame controller (72013).
For data storage, floppy-disk controllers 765B and
72064/65/67/68/69 are widely used in IBM PC; hard-disk
controllers 7261/62 and 72061 and SCSI controller
72111 are provided for magnetic media storage.
1-4
Graphics display controllers 7220 and the advanced
72120/72123 meet various customer requirements. The
advanced 72185 is the latest compression/expansion
controller for image processing applications.
DSP and Speech Products
NEC is a leading supplier of high-speed DSP and
speech products that excel in quality and performance. DSPs cover the full spectrum. From the 16-bit
fixed-point 77C20A to the enhanced 32-bit fixed-point
77C25, NEC provides a low-cost, high-performance
solution to customers' high-volume applications.
For advanced system deSigns, customers have a
choice of the 24-bit fixed-point 77220 to the 32-bit
floating-point 77230 (and the advanced 77240). For the
2400-b/s modem area, there are the applicationspecific 77810,77811, and 77812 devices.
The 775x speech encoder/decoders are the industry's
best quality. Further, NEC has the 77501 and 7730 in the
real-time recorder and playback devices.
All DSP and speech products are backed by userfriendly, advanced development tools.
Development Tools for Micro Products
A comprehensive line of development hardware and
software tools support NEC's microcomputer, microprocessor, and DSP/speech products. This extraordinary selection provides greater design alternatives
that truly fit your needs in data processing, communication, instrumentation, automotive, and consumer
applications.
Telecom/lSDN Devices
NEC offers telecom ICs for telephone sets, terminals,
pagers, mobile telephones, telephone exchanges,
switching, and data communication along with a complete line of integrated services digital network (ISDN)
components.
ASIC Products
NEC is committed to becoming the leading supplier of
application-specific integrated circuits (ASICs). Our
semiconductor technology is second to none, and we
offer three fast-growing gate array families: highdensity CMOS, exciting BiCMOS, and ultra-high-speed
ECL. Our comprehensive selection includes (1) 0.8micron CMOS cell-based ASICs with compilable RAM
and ROM and CPU/peripheral megafunctions; (2) 0.8micron CMOS gate arrays; and (3) the gate array
market leaders, BiCMOS-5 and ECL-4A
NEe
NEC's packaging technology is leading the way in the
ASIC industry with advanced packages like 280-pin
flat, B4-pin PLCC, 528-pin PGA, and tape automated
bonding (TAB).
ASIC product technology, coupled with state-of-the-art
design tools and CAD systems, will give your products
a leading edge.
Capacitors
NEC is an innovator in the capacitor market, offering
high-volume, high-quality products. NEC's tantalum
R-Series molded chip capacitors and dipped radial
capacitors offer advanced technological design and
excellent performance characteristics for filtering, bypassing, coupling, decoupling, blocking, and RC timing circuits. These capacitors are used exclusively in
industrial, commercial, entertainment, and medical
electronic equipment.
NEC's super capacitors (SupercapsTM) are used for
applications requiring battery back-up for CMOS
SRAMs and microprocessors. NEC's multilayer ceramic
capacitors offer a high-capacitance, resin dipped, multilayer capacitor for high-frequency switching power
supplies.
The SVE Series tantalum chip capacitor features a
built-in fuse to minimize circuit damage from reverse
current.
Fluorescent Indicator Panel Displays (FIPs)
NEC offers vacuum fluorescent indicator panel (FIP®)
displays for all major market applications. With lowvoltage operation and large, bright characters in blue,
green, and all other visible colors, FIPs are a more
effective and reliable display than most LEOs and gas
discharge displays. They are available in a variety of
standard sizes, characters, and number of digits.
The FIP module line has recently been expanded to
include the new chip-in-glass FIP (CIG-FIP), which offers low-power, compact, inexpensive display modules.
A full character set, power supply, electronics to drive
the FIP, and an on-board microprocessor are features
of these modules.
The mounting of the driver chips inside the glass
envelope and the use of surface-mount technology
make the NEC CIG-FIP module one of the most compact and inexpensive vacuum fluorescent display modules available.
Introduction
Optoelectronic Devices
Optoelectronics marks the forefront of today's technology. From optoisolators to DFB laser diodes, NEC offers
state-of-the-art quality, reliability, and performance.
Automated assembly provides low-cost, high-volume
production capabilities. And our broad line makes
one-stop shopping a reality at NEC.
Sample the wide variety of products available:
• Lasers, LEDs, and photodetectors
• Datalinks, optoisolators, and photointerrupters
• Fiber optic connectors, switches, and multiplexers
For telecommunications, information systems, industrial and consumer applications-we've got it all.
Consumer ICs
NEC's line of consumer ICs includes digital tuning
systems (DTS); prescalers; phase-locked loops (PLLs);
audio, radio, lV, EDlV, CAlV, VCR, compact disk, and
clock ICs; display drivers; monolithic broadband amplifiers; AID and D/A converters; RS-232C line drivers/
receivers; and amplifiers and spindle motor drivers for
hard-disk drives.
Digital tuning systems ofthe}1PD1700 series are singlechip, 4-bit CMOS microcontrollers with built-in PLLs.
The PLLs employ a pulse swallowing method of frequency dividing that enables higher frequency operation. The JlPD1700 series is suitable for audio, video,
automotive, and portable radio applications.
Note: Coverage of the 17Kfamily of 4-bit digital microcontrollers in Section 4 is repeated in Section 14 (Consumer ICs) following the tlPD1700 series.
The infrared remote control family includes a wide
variety of receivers, receiver preamplifiers, and transmitters. NEC's GaAs LEOs and PIN photodiode families
complete the remote control circuit requirements.
NEC's CMOS display driver family includes clock, latch,
and driver circuits for LCD, FIP (vacuum fluorescence),
plasma, and electroluminescent displays. Available in
surface mount packages, these circuits simplify board
design, improve quality and reliability, and operate at
voltages as high as 250 V.
In addition, NEC offers a complete line of A/D and D/A
converters and RS-232C line drivers/receivers for all
interfacing needs between and within the analog and
digital domains.
1-5
D
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Introduction
1-6
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Memory Products
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Memory Products
Section 2.
Memory Products
Part Numbering Guide.......................................... 2-3
Product Line Overview......... '" .............................. 2-5
Application-Specific Devices ... '" .............................. 2-7
Memory Cards ................................................. 2-8
Dynamic RAM Modules ......................................... 2-8
Dynamic RAMs ................................................ 2-10
Static RAMs................................................... 2-11
ECl RAMs .................................................... 2-13
EPROMs ...................................................... 2-14
EEPROMs .................................. " ................ 2-14
Mask Programmable ROMs ..................................... 2-15
2-2
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Memory Products
Device Numbering Guide
•
country of Origin _ _ _ _ _--'
Device Type
Date Code
Week
B = Digital bipolar
= Digital MOS
o
Product Class - - - - - - - - - - - - '
10 = 10K ECl RAM
100 = 100K ECl RAM
23(H)C = CMOS ROM
27(H)C = CMOS EPROM
28C = CMOS EEPROM
41 = NMOS dynamic RAM
42 = CMOS dynamic RAM
43 = CMOS static RAM
44 = CMOS static RAM (6-T cell)
46 = BiCMOS static RAM
Year
Low Power Indicator
[Optional]
l = low power
II = Very low power
Device Identifier - - - - - - - - - - - - - '
Speed Selection
-10 = 100 ns or 10 ns
-12 = 120 ns or 12 ns
-15 = 150 ns or 15 ns
-70 = 70 ns
-80 = 80 ns
-85 = 85 ns
-XX = Etc.
Package - - - - '
B or BH
C, CR or CZ
0, DH, DX or DZ
G (s 40 pins), GU or GW
G (> 40 pins) or GF
G5,GS, GX or GZ
K
l
LA, lB or lE
R
V
Ceramic flatpack, with a quartz window if appropriate
Plastic DIP
Cerdip or ceramic DIP, with a quartz window if appropriate
Plastic miniflat
Plastic OFP
= Plastic TSOP
= Ceramic lCC
.. PlCC
.. Plastic SOJ
= Ceramic PGA
= Plastic ZIP
=
..
=
=
=
Notes:
(1) The marking format may vary among package types.
(2) Regardless of the format, the device number does not change.
(3) The "~p. in NEC part numbers does not appear on the package.
(4) DIP = dual-inline package
(5) lCC = lead less chip carrier
(6) PlCC = plastic leaded chip carrier
(7) PGA = pin grid array
(8) SOJ = small-outline J-Iead package
(9) ZIP = zig-zag in line package
(10) TSOP .. thin small-outline package
(11) OFP = quad flatpack
83SL-7321B
2-3
Memory Products
2-4
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Memory Products
Product Line Overview
Bit
Density
Application
Specific
RAM
Module
Dynamic
MOS Static
Eel
1K
IlPB10422
IlPB100422
4K
IlPB10470
IlPB10474
IlPB10474A
IlPB10474E
IlPB100470
IlPB100474
IlPB100474A
IlPB100474E
8K
IlPD42101
IlP042102
16K
IlPD43501
40K
IlPD42505
64K
IlP043608
133K
IIP042271
IlPD42272
256K
IIPD41264
II PD42264
IIPD42532
2M
EEPROM
ROM
IlP028C04
IlP028C05
II
IIPB10480
IlPB10484
IIPB10484A
IIPB10A484
IIPB100480
IIPB100484
IlPB100484A
IIPB100A484
IIP04361
IIP04362
IIP D41256
IlP D41484
320K
1M
EPROM
IIP043251
IIP043254
IIP043256A
IIP043256B
IIP043258
IIP046251
IIP027HC65
IlP028C64
IlP028C25a
IIPD10500
IIPD10504
IIPD100500
liP D1 00504
IIP046710
IIP046741
IlP042270
IIPD42273
liP 042274
IIPD42275
IIP042601
MC-174
MC-41256A9
MC-157
IlP0421000
IlPD421001
IlP0421002
IlP D421660
IIPD421661
IlP0421664
IIPD421665
IlP0424258
IIP D424258
IlP0424266
IlPD424268
IIP0431000
IIP0431000A
IIP0431001
IIP0431004
IlP027C1000A
IlP027Cl001A
IIP027C1024A
IIP023C1000A
IIP023C1000B
IIP023C1000EA
IlP023C1001 E
IIP023C1001 EA
IlP023C1010A
IIP023C1024E
IlP027C2001
IIP023C2000
IIP023C2000A
IIP023C2001
IIP023C200lE
2-5
t¥EC
Memory Products
Product Line Overview (cant)
Bit
Density
Application
Specific
RAM
Module
4M
IlP D42641
IlPD42644
MC-176
8M
MC-42601 EA9B
MC-173
MC-421000A8
MC-421000A9
MC-42256A36
MC-424256A36
Dynamic
IlPD424100
pPD424101
IlPD424102
IlPD42417xx
IlPD42419xx
IlPD42426xx
IlPD42428XX
pPD424400
IlPD424402
IlPD424410
IlPD424412
IlPD4248xx
IlPD4249xx
MOS Static
Eel
EPROM
EEPROM
ROM
IlPD27C4000
IlPD27C4001
IlPD27C4096
IlPD23C4000B
IlPD23C4000J
IlPD23HC4000
IlPD23C4001 E
IlPD23C4001 EA
IlPD23C4001 EB
IlPD23HC400iE
IlPD23HC4096E
IlPD27C8000
IlPD27C8001
IlPD23C8000
IlPD23C8000B
IlPD23C8001 E
IlPD23C8001 EA
16M
MC-424512A36
MC-42512A36
IlPD23C16000
32M
MC-421000A32
MC-421000A36
MC-421000AA40
MC-424000A8
MC-424000A9
MC-424100A8
MC-424100A9
IlP D23C32000
64M
MC-422000A32
MC-422000A36
MC-422000AA40
2-6
NEe
Memory Products
Application-Specific Devices
Organization
Access Time (ns)
Package (Note 1)
Pins
64K x 4 with two ports
120 Port A
40 Port B
150 Port A
60 Port B
CN
24
IlPD42264-10
64K x 4 with two ports
100 Port A
25 Port B
C/LNV
24
IlPD42273-80
256K x 4 with two ports
80 PortA
25 Port B
100 PortA
30 Port B
120 PortA
40 Port B
LEN
28
256K x 4 with two ports
60 PortA
25 Port B
100 Port A
30 Port B
120 Port A
40 Port B
LEN
28
128K x 8 with two ports
80 PortA
25 Port B
100 PortA
30 Port B
120 PortA
40 Port B
LE
40
JlPD42101-3
IlPD42101-2
JlPD42101-1
910x 8
27
27
49
C/G
24
IlPD42102-5
IlPD42102-3
IlPD42102-2
IlPD42102-1
1135x 8
18
21
21
40
C/G
24
IlPD42505-50
IlPD42505-50H
JlPD42505-75
IlPD42505-75H
5048 x 8
40
40
55
55
C
24
Device
IlPD41264-12
IlPD41264-15
IlPD42273-10
IlPD42273-12
IlPD42274-80
IlPD42274-10
IlPD42274-12
IlPD42275-80
IlPD42275-10
IlPD42275-12
IlPD42270
910x 263 x 4
40
C
28
IlPD42271
IlPD42272
7568 x 18
6 MHz (input sampling)
GF
64
IlPD42532-10
32Kx8
50
C
40
IlPD42601-60
1Mx1
600 (Single)
100 (Page)
C/LNV
C = 18
LA = 26/20
V = 20
IlPD42641
4Mx1
80
LA
26/20
JlPD42644
1Mx4
80
LA
26/20
JlPD43501
2x1Kx8
60
R
132
512 x 32x 4 or
1Kx 16 x 4
64
R
132
1Mx9
600
B
30
IlPD42601-60L
IlPD43608-3
85
IlPD43608-2
MC-42601 EA9B-60L
II
Notes:
(1)
B= socket-mountable SIMM; C = plastic DIP; G = plastic
miniflat; GF = plastic QFP; LA or LE = plastic SOJ; R =
ceramic PGA; V = plastic ZIP.
2-7
NEe
Memory Products
Memory Cards
Device
Organization
Access Time (ns)
Package
Pins
MC-174
128K x 8 (static RAM)
250
Memory card
60
MC-176
512K x 8 (static RAM)
250
Memory card
60
Dynamic RAM Modules
Device
MC-157-80A
MC-157-10
MC-41256A8-80
MC-41256A8-10
4M
MC-424100A8-70
MC-424100A8-80
MC-424100A8-10
Pins
B
30
256K x 8 (page)
80
100
AlB
30
B
64
30
x8
x8
(fast-page)
(fast page, 0.8" high)
x8
(fast-page)
256K x 9 (page)
MC-421000A9-60
MC-421000A9-70
MC-421000A9-80
MC-421000A9-10
MC-424100A9-70
MC-424100A9-80
MC-424100A9-10
Package (Note 1)
80
100
4M
MC-41256A9-80
MC-41256A9-10
MC-424000A9-60
MC-424000A9-70
MC-424000A9-80
Access Time (ns)
1M
MC-173
MC-421000A8-60
MC-421000A8-70
MC-421000A8-80
MC-421000A8-10
MC-424000A8-60
MC-424000A8-70
MC-424000A8-80
Organization
256K x 8 (fast-page)
1M
4M
x9
x9
(fast-page)
(fast-page, 0.8" high)
4M
x9
(fast-page)
70
60
70
80
100
AlB
AlB/AA/AB/BA/BB
60
70
80
AA/BA
30
70
80
100
AlB
30
80
100
AlB
30
AlB
30
60
70
80
100
AlB/AA/AB/BA/BB
60
70
80
AAIBA
30
70
80
100
AlB
30
MC-42256A36-60
MC-42256A36-70
MC-42256A36-80
MC-42256A36-85
MC-42256A36-10
256K x 36 (fast-page)
60
70
80
85
100
B/F
72
MC-424256A36-80
MC-424256A36-85
MC-424256A36-10
256K x 36 (page)
80
85
100
B/F
72
256K x 36 (fast-page)
70
80
100
BH/FH
72
512K x 36 (page)
80
85
100
B/F
72
512K x 36 (fast-page)
70
80
100
BH/FH
72
MC-424256A36BH/FH-70
MC-424256A36BH/FH-80
MC-424256A36BH/FH-l0
MC-424512A36-80
MC-424512A36-85
MC-424512A36-10
MC-424512A36BH/FH-70
MC-424512A36BH/FH-80
MC-424512A36BH/FH-l0
2-8
NEe
Memory Products
Dynamic RAM Modules (cont)
Organization
Access Time (ns)
Package (Note 1)
Pins
MC-42512A36-60
MC-42512A36-70
MC-42512A36-80
MC-42512A36-85
MC-42512A36-10
512K x 36 (fast-page)
60
70
80
85
100
B/F
72
MC-421000A32-70
MC-421000A32-80
MC-4210ooA32-10
1M x 32 (fast-page)
70
80
100
B/F/BH/FH
72
MC-421000A36BH/FH-70
MC-421000A36BH/FH-80
MC-4210ooA36BH/FH-l0
1M
(fast-page)
70
80
100
B/FIB D/FD/BH/FH
72
MC-421000AA40-70
MC-421000AA40-80
MC-421000AA40-10
1M x 40 (fast-page)
70
80
100
B/F
72
MC-422oo0A32-70
MC-422oo0A32-80
MC-422000A32-10
2M
(fast-page)
70
80
100
B/F/BH/FH
72
MC-422000A36BH/FH-70
MC-422oo0A36BH/FH-80
MC-422000A36BH/FH-l0
2M x 36 (fast-page)
70
80
100
B/F/BD/FD/BH/FH
72
MC-422000AA4O -70
MC-422oo0AA40-80
MC-422000AA40-10
2M
70
80
100
B/F
72
Device
x 36
x 32
x 40
(fast-page)
•
Not,ea:
(1)
A
B,
BH
Leaded SIMM
Socket-mountable SIMM
Special-height, socket-mountable SIMM
F
FH
Socket-mountable SIMM with gold-plated contacts
Special-height, socket-mountable SIMM with gold-plated contacts.
AA
AB
Leaded SIMM, 2- or 3-plece solution using 300-mil SOJ
Leaded SIMM, 2- or 3-piece solution using 350-mll SOJ
BA
BB
Socket-mountable SIMM, 2- or 3-plece solution using 300-mil SOJ
Socket-mountable SIMM, 2- or 3-piece solution using 350-mil SOJ
BD
FD
Socket-mountable SIMM, 1.0" high, double-sided
Socket-mountable SIMM, 1.0" high, double-sided, with gOld-plated contacts.
2-9
NEe
Memory Products
Dynamic RAMs
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
IlPD41256-BO
IlPD41256-10
256K x 1 (page)
80
100
OIL
0= 16
l = 18
IlPD41464-80
IlPD41464-10
IlPD41464-12
64Kx4
80
100
120
O/LtV
0=18
l = 18
V = 20
IlPD421 000 -60
IlPD421000-70
IlPD421000-BO
IlPD421000-10
1M x 1 (fast-page)
60
70
80
100
O/LA/V
0=18
LA = 26/20
V = 20
IlPD421001-60
IlPD421001-70
IlPD421001-80
IlPD421001-10
1M x 1 (nibble)
60
70
80
100
C/LA/V
0=18
LA = 26/20
V = 20
IlPD421002-60
IlPD421002-70
IlPD421002-80
IlPD421002-10
1 M x 1 (static-column)
60
70
80
100
O/LNV
0=18
LA=26/20
V = 20
IlPD424256-60
IlPD424256-70
IlPD424256-BO
IlPD424256-10
256K x 4 (fast-page)
60
70
80
100
O/LNV
C = 20
LA = 26/20
V = 20
IlPD424258-60
IlPD424258-70
IlPD424258-BO
IlPD424258-10
256K x 4 (static-column)
60
70
80
100
O/LA/V
0=20
LA = 26/20
V = 20
IlPD424266-60
IlPD424266-70
IlPD424266-80
IlPD424266-10
256K x 4 (fast-page, wrlte-per-bit)
60
70
80
100
CILA/V
0=20
LA=26/20
V = 20
IlPD424268-60
IlPD424268-70
IlPD424268-80
IlPD424268-10
256K x 4 (static-column, wrlte-per-blt)
60
70
80
100
O/LNV
0=20
LA=26/20
V = 20
IlPD421660-80
IlPD421660-10
64K x 16 (static-column with byte write)
80
100
VILE
40
IlPD421661-80
IlPD421661-10
64K x 16 (static-column with word write
and wrlte-per-bit)
80
100
VILE
40
IlPD421664-80
IlPD421664-10
64K x 16 (fast-page with byte write)
80
100
VILE
40
IlPD421665-BO
IlPD421665-10
64K x 16 (fast-page with word write and
write-per-blt)
80
100
VILE
40
IlPD424100-60
IlPD424100-70
IlPD424100-80
IlPD424100-10
4M x 1 (fast-page)
60
70
80
100
LA/LB/GS/V
V = 20
LA/LB = 26/20
GS = 26/20
IlPD424101-60
IlPD424101-70
IlPD424101-80
IlPD424101-10
4M x 1 (nibble)
60
79
80
100
.LNLB/GS/V
V = 20
LA/LB = 26/20
GS = 26/20
IlPD424102-60
IlPD424102-70
IlPD424102-BO
IlPD424102-10
4M x 1 (static-column)
60
70
80
100
LA/LB/GS/V
V = 20
LA/LB = 26/20
GS = 26/20
2-10
NEe
Memory Products
Dynamic RAMs (cant)
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
JlP0424400-60
JlPD424400-70
JlPD424400-80
JlP0424400-10
1M x 4 (fast-page)
60
70
80
100
LA/LB/GS/V
v 20
LA/LB
26/20
GS = 26/20
JlPD424402-60
JlPD424402-70
JlP0424402-80
JlP0424402-10
1M x 4 (static-column)
60
70
80
100
LA/LB/GS/V
v = 20
LA/LB = 26/20
26/20
GS
JlP0424410-60
JlPD424410-70
JlPD424410-80
JlPD424410-10
1M x 4 (fast-page, write-per-bit)
60
70
80
100
LA/LB/GS/V
JlP0424412-60
JlP0424412-70
JlPD424412-80
JlPD424412-10
1M x 4 (static-column, write-per-bit)
60
70
80
100
LNLB/GS/V
v = 20
LA/LB = 26/20
GS = 26/20
JlPD4248xx-70
JlP04248xx-80
JlP04248xx-l0
512Kx 8
70
80
100
LE/V/G5
28
JlPD42417xx-70
JlPD42417xx-80
JlP042417xx-l0
256K x 16 (one CAS, two WE inputs)
70
80
100
LE/V/GX
LE = 40
V 40
GX = 44
JlP042426xx-70
JlP042426xx-80
JlPD42426xx-l0
256K x 16 (two CAS inputs, one WE)
70
80
LE/V/GX
LE = 40
V 40
GX = 44
JlPD42419xx-70
JlPD42419xx-80
JlP042419xx-l0
256K x 18 (one CAS, two WE inputs)
LE/V/GX
LE = 40
V 40
GX = 44
JlPD42428xx-70
JlPD42428xx-80
JlPD42428xx-l0
256K x 18 (two CAS inputs, one WE)
LE/V/GX
LE = 40
V 40
GX = 44
=
100
70
80
100
v
= 20
LA/LB = 26120
GS
26/20
=
100
70
80
=
=
=
=
=
=
Notes:
(1)
C = plastic DIP; L = PLCC; LA, LB or LE = plastic SOJ;
V = plastic ZIP; GS, G5 or GX = plastic TSOP.
Static RAMs
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
JlPD46710-15
JlPD46710-20
16Kx 10 x 2
15
20
LN
52
JlPD46741-15
JlPD46741-2O
8Kx20x2
15
LP
68
JlPD4361-45
JlPD4361-55
JlPD4361-70
64Kx 1
45
55
70
C/K/LA
C/K/LA
C
22
JlP04362-45
JlP04362-55
JlPD4362-70
16K x 4 (CS only)
45
55
70
C
22
JlPD43251-35
JlP 043251 -45
256Kx 1
35
45
C/LA
24
JlPD43254-35
JlPD43254-45
64Kx4
35
45
C
24
20
2-11
NEe
Memory Products
Static RAMs (cant)
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
32Kx8
85
100
120
150
C/GU/GX
C = 28
GU = 28
GX = 32
32Kx8
55
70
85
C/GU/GX
C = 28
GU = 28
GX= 32
~PD43258·35
~PD43258·45
32Kx 8
35
CAlLA
28
~PD431000·85
~PD431000·10
128Kx8
85
100
120
CZ/GW
32
128Kx8
70
85
CZ/GW/GZ
32
1Mx 1
20
25
35
LE
28
256Kx 4
-20
25
35
LE
28
~PD43256A..a5
~PD43256A·10
~PD43256A·12
~PD43256A.15
~PD43256B-55
~PD43256B-70
~PD43256B-85
45
~PD431000·12
~PD431000A·70
~PD431000A..a5
~PD431001.20
~PD431001·25
~PD431001.35
~PD431004·2O
~PD431004-25
~PD431004·35
Notes:
(1)
C, CR or CZ = plastic DIP; GU or GW = plastic miniflat;
GX or GZ
plastic TSOP; K
ceramic LCC;
LA or LE = plastic SOJ; LN or LP = PLCC.
2-12
=
=
NEe
Memory Products
Eel RAMs
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
/lPB10422-7
256x4
7
D
24
/lPB10470-10
/lPB10470-15
4Kx 1
10
15
D
18
/lPB10474-8
/lPB10474-10
/lPB10474-15
1Kx4
8
10
15
D
24
/lPB10474A-5
/lPB10474A-6
1Kx4
5
6
D
24
/lPB10474E-3
/lPB10474E-4
1Kx4
3
4
D
24
/lPB10480-10
/lPB10480-15
16Kx 1
10
15
BID
20
/lPB10484-10
/lPB10484-15
4Kx 4
10
15
BID
28
/lPB10484A-5
/lPB10484A-7
4Kx 4
5
7
BID
28
/lPB10A484-5
/lPB10A484-7
4Kx 4
5
7
BH/D
28
/lPD10500-15
/lPD10500-20
256Kx 1
15
20
D
24
/lPD10504-15
64Kx4
15
D
32
/lPB100422-7
256 x 4
7
B/DH
24
/lPB100470-10
/lPB100470-15
4Kx 1
10
15
D
18
/lPB100474-4.5
/lPB100474-6
/lPB100474-8
/lPB100474-10
/lPB100474-15
1Kx4
4.5
6
8
10
15
K
B/K
24
/lPB100474A-5
/lPB100474A-6
1Kx4
5
6
BH/D
24
/lPB100474E-3
/lPB100474E-4
1Kx4
3
4
BID
24
/lPB100480-10
/lPB100480-15
16Kx 1
10
15
BID
20
/lPB100484-10
/lPB100484-15
4Kx 4
10
15
BID
28
/lPB100484A-5
/lPB100484A-7
4Kx 4
5
7
BID
28
/lPB100A484-5
/lPB100A484-7
4Kx 4
5
7
BID
28
/lPD100500-15
/lPD100500-20
256Kx 1
15
20
D
24
/lPD100504-15
64Kx 4
15
D
32
•
BID
BID
BID
Notes:
(1)
=
B or BH
ceramic flatpack; D or DH
K
ceramic Lee.
=
= ceramic DIP and cerdip;
2-13
NEe
Memory Products
EPROMs
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
8Kx8
25
30
35
OX
24
IlPD27C1000A-12
IlPD27C1000A-15
IlPD27C1000A-20
128K x 8 (ROM compatible)
120
150
200
0
32
IlPD27C1001A-12
IlPD27C1001A-15
IlPD27C1001 A-2O
128K x 8 (JEDEC)
120
150
200
0
32
IlPD27C1024A-12
IlPD27Cl024A-15
IlPD27Cl024A-20
64Kx 16
120
150
200
0
40
IlPD27C2001-15
IlPD27C2001-17
IlPD27C2001-2O
256K x 8 (JEDEC)
150
170
200
D
32
IlPD27C4000-15
IlPD27C4000-17
IlPD27C4000 -20
256K x 16 or 512K x 8
150
170
200
DZ
40
IlPD27C4001-15
IlPD27C4001-17
IlP D27C4001-20
512K x 8 (JEDEC)
150
170
200
DZ
32
IlPD27C4096-12
IlPD27C4096-15
IlPD27C4096-2O
256K x 16 (JEDEC)
120
150
200
DZ
40
IlPD27C8000-12
IlPD27C8000-15
IlPD27C8000-17
512Kx 16 or 1M x 8
120
150
170
DZ
42
IlPD27C8001-12
IlPD27C8001-15
IlPD27C8001-17
1 M x 8 (JEDEC)
120
150
170
DZ
32
IlP D27HC65-25
IlPD27HC65-30
IlPD27HC65-35
Notes:
(1)
0, OX or DZ = ceramic DIP with quartz window.
EEPROMs
Organization
Access Time (ns)
Package (Note 1)
Pins
IlPD28C04-20
IlPD28C04-25
Device
512x 8
200
250
C/G
24
IlPD28C05-20
IlPD28C05-25
512 x 8
200
250
C/G
24
IlPD28C64-2O
IlPD28C64-25
8Kx8
200
250
C/GX
28
IlPD28C256-20
IlPD28C256-25
32Kx8
200
250
CZ
28
Notes:
(1)
C or CZ
2-14
= plastic DIP; G = plastic miniflat; GX = TSOP.
NEe
Memory Products
Mask-Programmable ROMs
Device
Organization
Access Time (ns)
Package (Note 1)
Pins
pPD23C1000A
128Kx 8 (CE)
200
C/G
28
pPD23C1000B
128Kx 8
150
C
28
pPD23C1000EA
128K x 8 (CElOE)
200
C
32
pPD23C1001 E
128K x 8 (JEDEC)
200
C/G
32
pPD23C1001 EA
128K x 8 (JEDEC)
150
C/G
32
pPD23C1010A
128Kx 8 (OE)
200
C
28
pPD23C1024E
64K x 16 (JEDEC)
200
C
40
40/52
pPD23C2000
128K x 16 or 256K x 8
250
C/GC
pPD23C2000A
128K x 16 or 256K x 8
175/200
C
40
256K x 8 (JEDEC)
250
C/G
32
pPD23C2001
pPD23C200lE
256K x 8 (JEDEC)
200
C/G
32
pPD23C4000B
256K x 16 or 512K x 8
200
C/GF
40/64
pPD23C400lEB
512K x 8 (JEDEC)
150
C/G
32
pPD23HC4000
512K x 8 or 256K x 16
100
C
40
pPD23C4001 E
512K x 8 (JEDEC)
250
C/GW
32
pPD23C400lEA
512K x 8 (JEDEC)
200
C/G
32
pPD23C4000J
256K x 16 or 512K x 8
150
C
40
pPD23HC 400lE
512K x 8 (JEDEC)
100
C/G
32
pPD23HC4096E
256K x 16 (JEDEC)
85
C
40
pPD23C8000
512Kx 16 or 1M x 8
200
CZ/G
42/64
pPD23C8000B
512Kx 16 or 1M x 8
150
C
42
1Mx8
150
C/G
32
pPD23C8001 EA
pPD23C8001 E
1M x 8 (JEDEC)
200
CZ/G
32
pPD23C16000
1M x 16 or 2M x 8
250
CZ/G
42
pPD23C32000
4M x 8 or 2M x 16
200
C
42
at
Notes:
(1)
Cor CZ = plastic DIP; G or GW = plastic miniflat;
GC or GF = plastic QFP.
2-15
Memory Products
2-16
t-IEC
NEe
Single-Chip Microcomputers . .
Single·Chip Microcomputers
Section 3. Single·Chip Microcomputers
Part Numbering System ........................................ 3-2
4-Bit, Single-Chip CMOS Microcomputers; 75xx Series ............ 3-3
4-Bit, Single-Chip CMOS Microcomputers; 75xxx Series ........... 3-4
8-Bit, Single-Chip CMOS Microcomputers; 78xx Series ............ 3-6
8-Bit, Single-Chip CMOS Microcomputers; 782xx (K2) Series ....... 3-7
8/16-Bit, Single-Chip CMOS Microcomputers; 783xx (K3) Series .... 3-8
Note: Section 4 covers the 17K family of 4-bit microcontrollers and
related development tools.
Part Numbering System
"PD78C10AL
"p
D
78C10A
L
Typical microdevice part number
NEC monolithic silicon integrated circuit
Device type (D = dig.ital MOS) .
Device identifier (alphanumeric)
Package type (L = PLCC)
A part number may include an alphanumeric suffix
that identifies special device characteristics.
3-2
NEe
NEe
Single-Chip Microcomputers
4-Bit, Sing Ie-Chip CMOS Microcomputers; 75xx Series
Device
("PO)
Features
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
I/O
Package
7502/7502A
LCD controller/driver
0,41
2.5 to 6.0
2K
128
23
QFP
64
7503/7503A
LCD controller/driver
0,41
2.5 to 6.0
4K
224
23
QFP
64
7507
General-purpose
0,41
2.5 to 6.0
2K
128
32
DIP
SDIP
QFP
40
40
52
75078
General-purpose
0.5
2.2 to 6.0
2K
128
32
SDIP
QFP
40
44
7507H
General-purpose
4.19
2.7 to 6.0
2K
128
32
DIP
SDIP
QFP
40
40
52
7508
General-purpose
0,41
2.5 to 6.0
4K
224
32
DIP
SDIP
QFP
40
40
52
75088
General-purpose
0.5
2.2 to 6.0
4K
224
32
SDIP
QFP
40
44
7508H
General-purpose
4.19
2.7 to 6.0
4K
224
32
DIP
SDIP
QFP
40
40
52
t
Pins
75CG08
Piggyback EPROM
0,41
4.5 to 5.5
2Kor4K
224
32
Ceramic DIP
40
75CG08H
Piggyback EPROM
4.19
4.5 to 5.5
2Kor4K
224
32
Ceramic DIP
40
7527A
FIP controller/driver
0.61
2.7 to 6.0
2K
128
35
DIP
SDIP
42
42
7528A
FIP controller/driver
0.61
2.7 to 6.0
4K
160
35
DIP
SDIP
42
42
75CG28
Piggyback EPROM; FIP
controller/driver
0.5
4.5 to 5.5
4K
160
35
Ceramic DIP
42
7533
ND converter
0.51
2.7 to 6.0
4K
160
30
DIP
SDIP
QFP
42
42
44
75CG33
Piggyback EPROM; ND
converter
0.51
4.5 to 5.5
4K
160
30
Ceramic DIP
42
7537A
FIP controller/driver
0.61
2.7 to 6.0
2K
128
35
DIP
SDIP
42
42
7538A
FIP controller/driver
0.61
2.7 to 6.0
4K
160
35
DIP
SDIP
42
42
75CG38
Piggyback EPROM; FIP
controller/driver
0.5
4.5 to 5.5
4K
160
35
Ceramic DIP
42
7554
Serial VO; external
clock or RC oscillator
0.71
2.5 to 6.0
lK
64
16
SDIP
SOP
20
20
7554A
Serial VO; external
clock or RC oscillator
0.71
2.0 to 6.0
lK
64
16
SDIP
SOP
20
Serial VO; external
clock or RC oscillator
0.71
SDIP
SOP
20
75P54
4.5 to 6.0
lKOTPROM
64
16
20
20
t Plastic unless ceramic (or cerdip) is specified.
3-3
•
NEe
Single-Chip Microcomputers
4-Bit, Single-Chip CMOS Microcomputers; 75xx Series (cont)
Device
(}lPD)
Features
Clock
(MHz)
Supply
VoItsge (V)
ROM (Xa)
RAM (X4)
I/O
Packaget
Pins
7564/7564A
Serial VO; ceramic
oscillator
0.71
2.7 to 6.0
1K
64
15
SDIP
SOP
20
20
75P64
Serial VO; ceramic
oscillator
0.71
4.5 to 6.0
1KOTPROM
64
15
SDIP
SOP
20
20
7556
Comparator; external
clock or RC oscillator
0.71
2.5 to 6.0
1K
64
20
SDIP
SOP
24
24
7556A
Comparator; external
clock or RC oscillator
0.71
2.0 to 6.0
1K
64
20
SDIP
SOP
24
24
75P56
Comparator; external
clock or RC oscillator
0.71
4.5 to 6.0
1KOTPROM
64
20
SDIP
SOP
24
24
7566/7566A
Comparator; ceramic
oscillator
0.71
2.7 to 6.0
1K
64
19
SDIP
SOP
24
24
75P66
Comparator; ceramic
oscillator
0.71
4.5 to 6.0
1KOTPROM
64
19
SDIP
SOP
24
24
t Plastic unless ceramic (or cerdip) is specified.
4-Bit, Single-Chip CMOS Microcomputers; 75xxx Series
Device ("PO)
Features
Clock
(MHz)
Supply
VoItsge (V)
ROM (X8)
RAM (X4)
I/O
Package t
Pins
75004
Genera~purpose
4.19
2.7 to 6.0
4K
512
34
SDIP
OFP
42
44
75006
Genera~purpose
4.19
2.7 to 6.0
6K
512
34
SDIP
OFP
42
44
75008
Genera~purpose
4.19
2.7 to 6.0
8K
512
34
SDIP
OFP
42
44
4.19
4.5 to 5.5
8KOTPROM
512 •
34
SDIP
OFP
42
44
4.19
2.7 to 6.0
8K
512
48
SDIP
OFP
64
64
4.19
2.7 to 6.0
16KOTPROM
1024
48
SDIP
OFP
64
64
4.19
2.7 to 6.0
8K
512
48
SDIP
OFP
64
64
16KOTPROM
1024
48
SDIP
OFP
64
64
Genera~purpose;
75P008
on-
chip OTPROM
75028
AID converter
75P036
AID converter;
on-Chip
OTPROM
75048
*
2.7 to 6.0
AID converter; 1K x 4
4.19
EEPROM; on-chip
OTPROM
Under development; consult your NEC Sales Office for availability.
75P056
*
AID converter; 1K x 4
EEPROM
75104
High-end with 8-bit
instruction
4.19
2.7 to 6.0
4K
320
52
SDIP
OFP
64
64
75104A
High-end with 8-blt
instruction
4.19
2.7 to 6.0
4K
• 320
52
OFP
64
75106
High-end with 8-bit
instruction
4.19
2.7 to 6.0
6K
320
52
SDIP
OFP
64
64
75108
High-end with 8-blt
instruction
4.19
2.7 to 6.0
8K
512
52
SDIP
OFP
64
64
75108A
High-end with 8-bit
Instruction
4.19
2.7 to 6.0
8K
512
52
OFP
64
3-4
NEe
Single-Chip Microcomputers
4-Bit, Single-Chip CMOS Microcomputers; 75xxx Series (cant)
Clock
(MHz)
Supply
Voltage (V)
ROM (Xa)
RAM (X4)
I/O
Package
High-end with 8-bit
instruction; on-chip
OTPROM or UVEPROM
4.19
4.5 to 5.5
8KOTPROM
512
52
SDIP
QFP
64
64
8K UVEPROM
512
52
Shrink cerdip
64
75P108B
High-end with 8-bit
instruction; on-chip
OTPROM
4.19
2.7 to 6.0
8KOTPROM
512
52
SDIP
QFP
64
64
75112
High-end with 8-bit
instruction
4.19
2.7 to 6.0
12K
512
52
SDIP
QFP
64
64
75116
High-end with 8-bit
instruction
4.19
2.7 to 6.0
16K
512
52
SDIP
QFP
64
64
75P116
High-end with 8-bit
instruction; on-chip
OTPROM
4.19
4.5 to 5.5
16KOTPROM
512
52
SDIP
QFP
64
64
75206
FIP controller/driver
4.19
2.7 to 6.0
6K
369
28
SDIP
QFP
64
64
75208
FIP controller/driver
4.19
2.7 to 6.0
8K
497
28
SDIP
QFP
64
64
75CG208
FIP controller/driver;
piggyback EPROM
4.19
4.5 to 5.5
8K
512
28
Ceramic SDIP
Ceramic QFP
64
64
75212A
FIP controller/driver
4.19
2.7 to 6.0
12K
512
28
SDIP
QFP
64
64
75216A
FIP controller/driver;
on-chip OTPROM
4.19
2.7 to 6.0
16K
512
28
SDIP
QFP
64
64
75CG216A
FIP controller/driver;
piggyback EPROM
4.19
4.5 to 5.5
16K
512
28
Ceramic SDIP
Ceramic QFP
64
64
75P216A
FIP controller/driver;
on-chip OTPROM
4.19
4.5 to 5.5
16KOTPROM
512
28
SDIP
64
75217
FIP controller/driver
4.19
2.7 to 6.0
24K
768
28
SDJP
QFP
64
SDJP
QFP
64
64
Device ("PO)
Features
75P108
75P218
FIP controller/driver;
on-chip OTPROM or
LNEPROM
4.19
2.7 to 6.0
75268
FIP controller/driver
4.19
2.7 to 6.0
75304
LCD controller/driver
4.19
75306
LCD controller/driver
4.19
75308
LCD controller/driver
75P308
32KOTPROM
t
Pins
64
1024
28
32K LNEPROM
1024
28
Ceramic LCC
64
8K
512
28
SDIP
QFP
64
64
2.7 to 6.0
4K
512
32
QFP
80
2.7 to 6.0
6K
512
32
QFP
80
4.19
2.7 to 6.0
8K
512
32
QFP
80
LCD controller/driver;
on-chip OTPROM or
LNEPROM
4.19
4.75 to 5.25
8KOTPROM
512
32
QFP
80
8KLNEPROM
512
32
Ceramic LCC
80
75312
LCD controller/driver
4.19
2.7 to 6.0
12K
512
32
QFP
80
75316
LCD controller/driver
4.19
2.7 to 6.0
16K
512
32
QFP
80
75P316
LCD controller/driver;
on-chip OTPROM
4.19
4.75 to 5.25
16KOTPROM
512
32
QFP
80
75P316A
LCD controller/driver;
on-chip OTPROM or
LNEPROM
4.19
2.7 to 6.0
16KOTPROM
512
32
QFP
80
16KLNEPROM
512
32
Ceramic LCC
80
3-5
•
t-{EC
Single-Chip Microcomputers
4-Bit, Single-Chip CMOS Microcomputers; 75xxx Series (cont)
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
I/O
Package
LCD controlier/driver;
AID converter
4.19
2.7 to 6.0
8K
512
36
QFP
80
75P328
LCD controlier/driver;
AID converter; on-chip
OTPROM
4.19
4.5 to 5.5
8KOTPROM
512
36
QFP
80
75402A
Low-end
4.19
2.7 to 6.0
2K
64
22
DIP
SDIP
QFP
28
28
44
75P402
Low-end; on-chip
OTPROM
4.19
4.5 to 5.5
2KOTPROM
64
22
DIP
SDIP
QFP
28
28
44
75512
High-end; AID
converter
4.19
2.7 to 6.0
12K
512
64
QFP
80
75516
High-end; AID
converter
4.19
2.7 to 6.0
16K
512
64
QFP
80
75P516
High-end; AID
converter; on-chip
OTPROM or lNEPROM
4.19
4.75 to 5.5
16KOTPROM
512
64
QFP
80
16KUVEPROM
512
64
Ceramic LCC
80
Device ("PO)
Features
75328
t
Pins
t Plastic unless ceramic (or cerdip) is specified.
a-Bit, Single-Chip CMOS Microcomputers; 78xx Series
Device ("PO)
Features
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
I/O
Package
78C10/78C10A
CMOS; A/D converter
15
4.5 to 5.5
External
256
32
QUIP
SDIP
QFP
PLCC
64
64
64
68
78C11/78C11A
CMOS; A/D converter
15
4.5 to 5.5
4K
256
40
QUIP
SDIP
QFP
PLCC
64
64
64
68
78Cl2A
CMOS; A/D converter
15
4.5 to 5.5
8K
256
40
QUIP
SDIP
QFP
PLCC
64
64
64
68
78C14/78C14A
CMOS; A/D converter
15
4.5 to 5.5
16K
256
40
QUIP
SDIP
QFP
PLCC
64
64
64
68
78CP14
CMOS; AID converter;
on-chip OTPROM or
UVEPROM
15
4.75 to 5.25
16KOTPROM
256
40
QUIP
SDIP
QFP
PLCC
64
64
64
68
16KUVEPROM
256
40
Ceramic QUIP
Shrink cerdip
64
64
t
Pins
78CG14
CMOS; A/D converter;
piggyback EPROM
15
4.5 to 5.5
4K, 8K, or 16K
256
40
Ceramic QUIP
64
78C17
CMOS; A/D converter
15
4.5 to 5.5
External
1024
40
QUIP
SDIP
QFP
64
64
64
3-6
NEe
Single-Chip Microcomputers
8-Bit, Single-Chip CMOS Microcomputers; 78xx Series (cont)
Device ("PO)
Features
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
110
Package
78C18
CMOS; AID converter
15
4.5 to 5.5
32K
1024
40
QUIP
SDIP
QFP
64
64
64
78CP18
CMOS; AID converter;
on-chip OTPROM or
UVEPROM
15
4.75 to 5.25
32KOTPROM
1024
40
QUIP
SDIP
QFP
64
64
64
32KUVEPROM
1024
40
Ceramic LCC
64
t
t
Pins
III
Plastic unless ceramic (or cerdip) is specified.
8-Bit, Single-Chip CMOS Microcomputers; 782xx (K2) Series
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
liD
Package
CMOS; AID converter;
advanced peripherals
12
4.5 to 5.5
8K
384
54
SDIP
QUIP
QFP
QFP
PLCC
64
64
64
74
68
78213
CMOS; AID converter;
advanced peripherals
12
4.5 to 5.5
External
512
54
SDIP
QUIP
QFP
QFP
PLCC
64
64
64
74
68
78214
CMOS; AID converter;
advanced peripherals
12
4.5 to 5.5
16K
512
54
SDIP
QUIP
QFP
QFP
PLCC
64
64
64
74
68
78P214
CMOS; AID converter;
advanced peripherals
12
4.5 to 5.5
16KOTPROM
512
54
SDIP
QUIP
QFP
QFP
PLCC
64
64
64
74
68
16KUVEPROM
512
54
Shrink cerdip
64
78220
CMOS; analog
comparator; large I/O
12
4.5 to 5.5
External
640
71
PLCC
QFP
84
94
78224
CMOS; analog
comparator; large I/O
12
4.5 to 5.5
16K
640
71
PLCC
QFP
84
94
78P224
CMOS; analog
comparator; large liD
12
4.5 to 5.5
16KOTPROM
640
71
PLCC
QFP
84
94
78233
CMOS; real-time
outputs; AID and DIA
converters
12
4.5 to 5.5
External
640
64
QFP
QFP
PLCC
80
94
84
78234
CMOS; rea~time
outputs; AID and DIA
converters
12
4.5 to 5.5
16K
640
64
QFP
QFP
PLCC
80
94
84
78237
CMOS; rea~time
outputs; AID and DIA
converters
12
4.5 to 5.5
External
1024
64
QFP
QFP
PLCC
80
94
84
78238
CMOS; real-time
outputs; AID and DIA
converters
12
4.5 to 5.5
32K
1024
64
QFP
QFP
PLCC
80
Device (l'PD)
Features
78212
t
Pins
94
84
3-7
NEe
Single-Chip Microcomputers
8-Bit, Single-Chip CMOS Microcomputers; 782xx (1<2) Series (cont)
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
I/O
Packaget
Pins
CMOS; reaHlme
outputs; AJD and D/A
converters
12
4.5 to 5.5
32KOTPROM
1024
64
QFP
QFP
PLCC
80
94
84
32KLNEPROM
1024
64
Ceramic LCC
94
78243
CMOS; AID converter;
EEPROM
12
4.5 to 5.5
External
512
512
EEPROM
54
SDIP
QFP
PLCC
64
64
68
78244
CMOS; AJD converter;
EEPROM
12
4.5 to 5.5
16K
512
512
EEPROM
54
SDIP
QFP
PLCC
64
64
68
Device ("PO)
Features
78P238
t Plastic unless ceramic (or cerdip) is specified.
8/16-Bit, Single-Chip CMOS Microcomputers; 783xx (1<3) Series
Device
!!,PD)
Features
Clock
(MHz)
Supply
Voltage (V)
ROM (X8)
RAM (X4)
I/O
Package t
Pins
78310A
Rea~tlme motor control
12
4.5 to 5.5
External
256
48
SDIP
QUIP
QFP
PLCC
64
64
64
68
78312A
Rea~time motor control
12
4.5 to 5.5
8K
256
48
SDIP
QUIP
QFP
PLCC
64
64
64
68
78P312A
Rea~tlme motor control
12
4.5 to 5.5
8K LNEPROM
256
48
Shrink cerdip
Ceramic QUIP
64
64
8KOTPROM
256
48
SDIP
QUIP
QFP
PLCC
64
64
64
68
78320
High-end; advanced
analog and digital
peripherals
16
4.5 to 5.5
External
640
55
QFP
PLCC
74
68
78322
High-end; advanced
analog and digital
peripherals
16
4.5 to 5.5
16K
640
55
QFP
PLCC
74
68
78P322
High-end; advanced
analog and digital
peripherals
16
4.5 to 5.5
16KOTPROM
640
55
QFP
PLCC
74
68
16KLNEPROM
640
55
Ceramic LCC
Ceramic LCC
68
74
78330
CMOS; rea~time pulse
unit
16
4.5 to 5.5
External
768
70
QFP
PLCC
94
78334
CMOS; rea~time pulse
unit
16
4.5 to 5.5
32K
768
70
QFP
PLCC
94
78P334
CMOS; real-time pulse
unit
16
4.5 to 5.5
32KOTPROM
768
70
QFP
PLCC
94
84
32K LNEPROM
768
70
Ceramic LCC
84
84
84
NEe
4-Bit Microcontrollers •
NEe
4·Bit Microcontrollers
Section 4. 4·81t Microcontrollers
Part Numbering System ...........•...........................• 4-2
17K Family of 4-Bit Microcontrollers ............................. 4-3
Development Tools for 17K Family ............................... 4-5
Note: Section 3 covers single-chip CMOS microcomputers, incl uding the
4-bit 75xx and 75xxx series.·
Part Numbering System
I'PD17001Xyy-zzz
I'P
o
17001
X
yy
zzz
4-2
Typical microcontroller part number
NEC monolithic silicon integrated circuit
Digital MOS
Device identifier. An inserted letter uP" indicates
a programmable device, as in u17P001"
Indicates the position of suffix letter
A or L, if applicable.
A = Upgraded version
L = Low voltage
Package code (CT, GH, and GS are examples)
Mask version serial number
NEe
4·Bit Microcontrollers
17K Family of 4-Bit Microcontrollers
Device
(,uPD)
OTP Device
("PD)
Clock Supply
(MHz) Voltage (V)
ROM (X8)
RAM (X4)
1/0
Package :t:
Package
Code
Serial communication,
ND and D/A
converters, PLL
4.5
4.4 to 5.5
8K
224
32
48-pin OFP
GH
Serial communication,
image display
controller, AID and D/A
converters, PLL
8
4.5 to 5.5
8K
336
27
48-pin SDIP
64-pin QFP
CU
GF
Serial communication,
ND and D/A
converters, LCD, PLL
4.5
4.5 to 5.5
8K
320
63
80-pin QFP
GF
Serial communication,
4.5
4.5 to 5.5
16K
432
63
SO-pin QFP
GF
4.5
4.5 to 5.5
24K
896
61
80-pin QFP
GF
Features t
Digital Tuning Systems, 170xx
17001
17POOI
17002
17003A
17P005
17005
17P005
D
ND and D/A
converters, LCD, PLL
17006
17P006
Serial communication,
ND and D/A
converters, PLL
1700S
17POOS
Serial communication,
image display
controller, timer, ND
and D/A converters,
PLL
S
4.5 to 5.5
32K
672
45
64-pin SDIP
CW
17010
17P010
Serial communication,
ND and D/A
converters, LCD, PLL
4.5
4.5 to 5.5
16K
432
61
80-pin OFP
GF
17051
Serial communication,
image display
controller, timer, AID
and D/A converters
S
4.5 to 5.5
16K
4CU
31
48-pin SDIP
CU
17052
Serial communication,
image display
controller, timer, AID
and D/A converters
S
4.5 to 5.5
16K
4CU
44
64-pin SDIP
CW
17053
Serial communication,
timer, ND and D/A
converters, PLL
8
4.5 to 5.5
24K
672
44
64-pin SDIP
CW
Serial communication,
image display
controller, timer, AID
converter, LCD
10
4.5 to 5.5
24K
524
36
SO-pin QFP
GF
Serial communication,
timer, ND and D/A
converters, LCD
S
4.5 to 6.6
4K
222
3S
52-pin QFP
G
17401
17P401
General-Purpose Devices, 171xx
17102
17103
17Pl03
General purpose
8
2.7 to 6.0
lK
16
11
16-pin SDIP
16-pin SOP
CX
GS
17103L
17Pl03
General purpose, low
voltage
S
I.S to 3.6
lK
16
11
16-pin DIP
16-pin SOP
CX
GS
17104
17Pl04
General purpose
8
2.7 to 6.0
lK
16
16
22-pin SDIP
24-pin SOP
CS
GS
4-3
NEe
4·Bit Microcontrollers
17K Family of 4-Bit Microcontrollers (cont)
Device
(,lPD)
aTP Device
("PD)
Clock Supply
(MHz) Voltage (V)
ROM (X8)
RAM (X4)
I/O
Package :j:
Package
Code
17104L
17Pl04
General purpose, low
voltage
8
1.8 to 3.6
lK
16
16
22-pin SDIP
24-pin SOP
CS
GS
17106
17Pl06
Serial communication,
timer, LCD, front-panel
control
4.5
4.5 to 5.5
8K
178
25
64-pin OFP
GC
17107
17Pl07
General purpose
2.5 to 6.0
lK
16
11
16-pin SDIP
16-pin SOP
CX
GS
17107L
17Pl07
General purpose, low
voltage
1.5 to 3.6
lK
16
11
16-pln SDIP
16-pin SOP
CX
GS
17108
17P108
General purpose
2.5 to 6.0
lK
16
16
22-pln SDIP
24-pln SOP
CS
GS
17108L
17P108
General purpose, low
voltage
1.5 to 3.6
lK
16
16
22-pln SDIP
24-pln SOP
CS
GS
17134A
17P136
Serial communication,
timer, AID converter
2
2.7 to 5.5
2K
112
21
28-pin SDIP
28-pln SOP
CT
GT
17135A
17P137
Serial communication,
timer, AID converter
8
2.7 to 5.5
2K
112
21
28-pln SDIP
28-pln SOP
CT
GT
17136A
17P136
Serial communication,
timer, AID converter
2
2ft to 5.5
4K
112
21
28-pln SDIP
28-pin SOP
CT
GT
17137A
17P137
Serial communication,
timer, AID converter
8
2.7 to 5.5
4K
112
21
28-pin SDIP
28-pln SOP
CT
GT
4
2.0 to 6.0
6K
336
19
8O-pln OFP
GF
Features
t
Remote Control Devices, 172xx
17P201
Serial communication,
timer, AID converter,
LCD
17202A
17P201 .
Timer, LCD
4
2.0 to 6.0
4K
112
16
64-pln OFP
GF
17203A
17P203A
Serial communication,
learning remote
controller, timer, LCD,
16K bits of SRAM
4
2.0 to 6.0
8K
336
27
52-pin OFP
GC
17204
Serial communication,
learning remote
controller, timer, LCD,
8K bits of SRAM
4
2.0 to 6.0
16K
336
27
52-pin OFP
GC
17207
Serial communication,
timer, AID converter,
LCD
4
2.0 to 6.0
8K
336
19
80-pln OFP
GF
3.58
2.0 to 5.5
16K
336
48
64-pin OFP
GF
17201A
Home Automation Devices, 173xx
17301
t
17P301
Serial communication,
timer, AID converter,
DTMF generator!
receiver
DTMF: Dual-tone multifrequency
LCD: Liquid crystal display
PLL: Phase-locked loop
:I: Plastic
4-4
NEe
4·Bit Microcontrollers
Development Tools for 17K Family of 4-Bit Microcontrollers
Device ("PO)
Full Emulator
Mini Emulator
Probe
Evaluation Board
Assembler
Device File
Debugger
17001
IE-17K
IE-17K-ET
EP-17001
SE-17001
AS17K
AS17001
Simplehost
17002
IE-17K
IE-17K-ET
EP-17002
SE-17002
AS17K
AS17002
Simplehost
17003A
IE-17K
IE-17K-ET
EP-17003
SE-17003
AS17K
AS17003
Simplehost
17005
IE-17K
IE-17K-ET
EP-17003
SE-17003
AS17K
AS17005
Simplehost
17006
IE-17K
IE-17K-ET
EP-17201
SE-17001
AS17K
AS17006
Simplehost
17008
IE-17K
IE-17K-ET
EP-17008
SE-17008
AS17K
AS17008
Simplehost
17010
IE-17K
IE-17K-ET
EP-17003
SE-17003
AS17K
AS17010
Simplehost
17051
IE-17K
IE-17K-ET
EP-17051
SE-17051
AS17K
AS17051
Simplehost
17052
IE-17K
IE-17K-ET
EP-17052
SE-17052
AS17K
AS17052
Simplehost
17053
IE-17K
IE-17K-ET
EP-17053
SE-17053
AS17K
AS17053
Simplehost
17102
IE-17K
IE-17K-ET
EP-17102
SE-17102
AS17K
AS17102
Simplehost
17103
IE-17K
IE-17K-ET
EP-17103
SE-17103
AS17K
AS17103
Simplehost
17103L
IE-17K
IE-17K-ET
EP-17103
SE-17103
AS17K
AS17103
Simplehost
17104
IE-17K
IE-17K-ET
EP-17104
SE-17104
AS17K
AS17104
Simplehost
17104L
IE-17K
IE-17K-ET
EP-17104
SE-17104
AS17K
AS17104
Simplehost
17106
IE-17K
IE-17K-ET
EP-17106
SE-17106
AS17K
AS17106
Simplehost
17107
IE-17K
IE-17K-ET
EP-17103
SE-17107
AS17K
AS17107
Simplehost
17107L
IE-17K
IE-17K-ET
EP-17103
SE-17107
AS17K
AS17107
Simplehost
17108
IE-17K
IE-17K-ET
EP-17104
SE-17108
AS17K
AS17108
Simplehost
171b8L
IE-17K
IE-17K-ET
EP-17104
SE-17108
AS17K
AS17108
Simplehost
17134A
IE-17K
IE-17K-ET
EP-17134
SE-17134
AS17K
AS17134
Simplehost
17135A
IE-17K
IE-17K-ET
EP-17134
SE-17134
AS17K
AS17135
Simplehost
17136A
IE-17K
IE-17K-ET
EP-17134
SE-17134
AS17K
AS17136
Simplehost
17137A
IE-17K
IE-17K-ET
EP-17134
SE-17134
AS17K
AS17137
Simplehost
17201A
IE-17K
IE-17K-ET
EP-17201
SE-17207
AS17K
AS17201
Simplehost
17202A
IE-17K
IE-17K-ET
EP-17202
SE-17202
AS17K
AS17202
Simplehost
17203A
IE-17K
IE-17K-ET
EP-17203
SE-17203
AS17K
AS17203
Simplehost
17204
IE-17K
IE-17K-ET
EP-17203
SE-17204
AS17K
AS17204
Simplehost
17207
IE-17K
IE-17K-ET
EP-17201
SE-17207
AS17K
AS17201
Simplehost
17301
IE-17K
IE-17K-ET
EP-17301
SE-17301
AS17K
AS17301
Simplehost
17401
IE-17K
IE-17K-ET
EP-17401
SE-17401
AS17K
AS17401
Simplehost
4-5
D
4·Bit Microcontrollers
4-6
NEe
t-{EC
V-Series and RiSe Microprocessors and Peripherals
B
V-Series and RiSe Microprocessors and Peripherals
Section 5. V-Series and RiSe Microprocessors and
Peripherals
Part Numbering System ........................................ 5-2
V-Series CMOS Microprocessors ................................ 5-3
V-Series CMOS System Support Products ........................ 5-4
RISC Microprocessors and Peripherals ...................... '" .. 5-5
Part Numbering System
"PD70320L
lIP
o
70320
L
Typical microdevice part number
NEC monolithic silicon integrated circuit
Device type (D = digital MOS)
Device identifier (alphanumeric)
Package type (L = PLCC)
A part number may include an alphanumeric suffix that identifies
special device characteristics; for example, JlPD70320L-8 has an
8-MHz CPU clock rating.
5-2
NEe
NEe
V-Series and RiSe Microprocessors and Peripherals
V-Series CMOS Microprocessors
Device,
"PO
Features
Data Bits
Clock (MHz)
Packaget
Pins
70108 (V20)
8088 compati ble; enhanced
8/16
80rl0
DIP
Ceramic DIP
QFP
PLCC
40
40
52
44
70108H (V20H)
Fully static; pin compatible with 80C88
enhanced microprocessor
8/16
10,12,16
DIP
QFP
PLCC
40
52
44
70116 (V30)
8086 compatible; enhanced
16
8 or 10
DIP
Ceramic DIP
QFP
PLCC
40
40
52
44
70116H (V30H)
Fully static; pin compatible with 80C86
enhanced microprocessor
16
10,12,16
DIP
QFP
PLCC
40
52
44
70208 (V40)
MS-DOS, V20 compatible CPU with peripherals
8{16
8 or 10
Ceramic PGA
PLCC
QFP
68
68
80
70208H (V40H)
Fully static; low power; 80C88 compatible CPU
plus peripherals
8{16
10,12,16
Ceramic PGA
PLCC
QFP
68
68
80
70216 (V50)
MS-DOS, V30 compatible CPU with peripherals
16/16
8 or 10
PGA
PLCC
QFP
68
68
80
70216H (V50H)
Fully static; low power; 80C88 compatible CPU
plus peripherals
16
10,12,16
Ceramic PGA
PLCC
QFP
68
68
80
70136 (V33)
Hardwired, enhanced V30
8 and 16
dynamic
12 or 16
PGA
PLCC
68
68
70236 (V53)
V33 core-based; high-integration; DMA, serial
VO, interrupt controller, etc.
8 and 16
dynamic
10,12,16
Ceramic PGA
QFP
132
120
70320 (V25)
MS-DOS compatible microcontroller; highintegration; DMA, serial VO, interrupt controller,
etc.
8/16
50r8
PLCC
QFP
84
94
70330 (V35)
MS-DOS compatible microcontroller; highintegration; DMA, serial VO, interrupt controller,
etc.
16
8
PLCC
QFP
84
70325 (V25 PI us)
MS-DOS compatible microcontroller; highintegration; high-speed DMA
8{16
80r 10
PLCC
QFP
84
94
70335 (V35 Plus)
MS-DOS compatible microcontroller; highintegration; high-speed DMA
16
8 or 10
PLCC
QFP
84
94
70327 (V25
Software Guard)
MS-DOS compatible microcontroller; highintegration; software protection
8{16
8
PLCC
QFP
84
94
70337 (V35
Software Guard)
MS-DOS compatible microcontroller; highintegration; software protection
16
8
PLCC
QFP
84
94
70423 (V55 SCI
V25 upward-compatible, high-integration
microcontroller with full synchronous serial
support and buffer management
8 and 16
dynamic
12.5
Ceramic PM
PPGA
QFP
132
132
120
94
t Plastic unless ceramic (or cerdip) is specified.
5-3
.'
NEe
V-Series and RiSe Microprocessors and Peripherals
V-Series CMOS System Support Products
Device,
"PO
Features
71011
Clock Pulse Generator/Driver
71037
Programmable DMA Controller
71051
Clock (MHz)
Packaget
Pins
20
DIP
SOP
18
20
8
10
DIP
QFP
PLCC
40
40
44
Serial Control Unit
8
8/10
DIP
QFP
PLCC
28
44
28
71054
Programmable Timer/Controller
8
8/10
DIP
QFP
PLCC
24
44
28
71055
Parallel Interface Unit
8
8/10
DIP
QFP
PLCC
40
44
71059
Interrupt Control Unit
8
8110
DIP
QFP
PLCC
28
71071
Data Bits
DMA Controller
8/16
8/10
DIP
Ceramic DIP
QFP
PLCC
44
44
28
48
48
52
52
71082
Transparent Latch
8
8
DIP
SOP
20
20
71083
Transparent Latch
8
8
DIP
SOP
20
20
71084
Clock Pulse Generator/Driver
25
DIP
SOP
18
20
71086
Bus Buffer/Driver
8
8
DIP
SOP
18
20
71087
Bus Buffer/Driver
8
8
DIP
SOP
20
20
71088
System Bus Controller
8/10
DIP
SOP
20
20
71101
Complex Peripheral Unit; serial, parallel, timer,
interrupt
8
10
QFP
120
71641
Cache Memory Controller
8/16/32
25
PGA
132
72291
Floating Point Coprocessor for V33/V53
16
16
PGA
68
9335
Numeric Interface Adapter for V40/V50 -
8
DIP
20
t Plastic unless ceramic (or cerdip) is specified.
5-4
18087
NEe
V-Series and RiSe Microprocessors and Peripherals
Rise Microprocessors and Peripherals
Device
Name
Clock
Package
Pins
JlPD30310 (VR3000A)
RISC Microprocessor
25, 33, 40 MHz
PGA
175
JlPD30311 (VR3010A)
Floating-Point Processor
25, 33, 40 MHz
PGA
84
JlPD31311
Bus Interface Unit
25,33 MHz
PGA
208
JlPD46710
16K x 10-Bit x 2 SRAM
Access time: 12, 15 20 ns
PLCC
52
JlPD46741
8K x 20-Bit x 2 SRAM
Access time: 12, 15,20 ns
PLCC
68
JlPD30360 (V R3600)
RISC Microprocessor
25,33 MHz
PGA
189
•
5-5
V-Series and RiSe Microprocessors and Peripherals
5-6
NEe
NEe
Intelligent Peripheral Devices (lPD) •
Intelligent Peripheral Devices (IPD)
Section 6. Intelligent Peripheral Devices (IPD)
Part Numbering System ........................................ 6-2
Communications Controllers ................................... 6-3
Graphics Controllers ........................................... 6-3
Advanced Compression/Expansion Engine ....................... 6-3
Floppy-Disk Controllers ......................................... 6-4
Hard-Disk Controllers .......................................... 6-4
Part Numbering System
"PD72001 L
"p
D
72001
L
Typical microdevice part number
NEC monolithic silicon integrated circuit
Device type (0 = digital MOS)
Device identifier (alphanumeric)
Package type (L = PLCC)
A part number may include an alphanumeric suffix that identifies
special device characteristics; for example, IlPD72001L-11 has an
11-MHz CPU clock rating.
•
6-2
t\fEC
NEe
Intelligent Peripheral Devices (IPD)
Communications Controllers
Device,
"PO
Maximum
Data Rate
Packaget
Pins
Dual ful~duplex serial channels; four DMA
channels; programmable interrupt vectors;
asychronous COP and BOP support; NMOS
1 Mb/s
DIP
40
CMOS, Advanced
Multiprotocol Serial
Communications
Controller
Functional superset of 8530; 8OB6/V30
interface; two full-duplex serial channels; two
DPLLs; two baud-rate generators per channel;
loopback test mode; short frame and mark idle
detection; 12.5-MHz max clock
2.5 Mb/s
DIP
QFP
PLCC
40
52
52
72002
CMOS, Advanced
Multiprotocol Serial
Communications
Controller
Low-cost, single-channel version of 72001;
software compatible; direct interface to 71071/
8237 DMA controllers; 12.5-MHz max clock
2.5 Mb/s
DIP
QFP
PLCC
40
44
44
72103
CMOS, HDLC Controller
Single full-duplex serial channel; on-chip DMA
controller
4 Mb/s
SDIP
PLCC
QFP
64
68
80
Name
Description
7201 A
Multiprotocol Serial
Communications
Controller
72001-11
Graphics Controllers
Device,
"PO
Name
Description
Maximum
Drawing Rate
Packaget
Pins
7220A
High-Performance
Graphics Display
Controller
Genera~purpose,
high-integration controller;
hardwired support for lines, arc/circles,
rectangles, and graphics characters; 1024xl024
pixel display with four planes
500 ns/dot
Ceramic DIP
40
72020
Graphics Display
Controller
CMOS 7220A with 2M video memory; dual-port
RAM control; write-masking on any bit;
enhanced external sync
500 ns/dot
DIP
QFP
40
52
72120
Advanced Graphics
Display Controller
High-speed graphics operations including paint,
area fill, slant, arbitrary angle rotate, up to lax
enlargement and reduction; dua~port RAM
control; CMOS
500 ns/dot
PLCC
QFP
84
94
72123
Advanced Graphics
Display Controller II
Enhanced 72120; expanded command set;
improved painting performance; laser printer
interface controls; CMOS
400 ns/dot
PLCC
QFP
84
94
Advanced Compression/Expansion Engine
Device,
"PO
72185
Name
Description
Packaget
Pins
Advanced Compression/
Expansion Engine
High-speed CCITT Group 3/4 bit-map image compression/expansion
(A4 test chart, 400 PPI x 400 LPI in under 1 second); 32K-pixel line
length; 32-megabyte image memory; on-chip DMA and refresh timing
generator; CMOS
SDIP
PLCC
QFP
64
68
SO
t Plastic unless ceramic (or cerdip) is specified.
6-3
•
NEe
Intelligent Peripheral Devices (IPD)
Floppy·Disk Controllers
Maximum
Transfer
Rate
Packaget
Pins
Industry-standard controller supporting IBM
3740 and IBM System 34 double-density
format; enhanced 765B supports multitasking
applications
500 kb/s
DIP
40
Floppy-Disk Interface
Compatible with 765-family controllers and
others; supports multiple data rates from 125 to
500 kb/s
500 kb/s
SOP
SDIP
28
30
72064
Floppy-Disk Controller
CMOS. All features of 72068 with complete AT
register set and 48-mA drivers. Pin compatible
with WD 37C65/AIB but with higher
performance DPLL and reliable multitasking
operation
500 kb/s
PLCC
QFP
44
52
72065/65B
CMOS Floppy-Disk
Controlier
100% 765A/B microcode compatible;
compatible with 608x microprocessor families
500 kb/s
DIP
PLCC
QFP
40
44
52
72067
Floppy-Disk Controller
CMOS; 765A1B microcode compatible; clock
generation/switching circuitry; selectable write
precompensation; digital phase-locked loop
500 kb/s
DIP
PLCC
QFP
48
52
52
72068
Floppy-Disk Controller
All features of the 72067 plus IBM-PC, PC/XT,
PC/AT, or PS/2 style registers; high-current
drivers
600 kb/s
QFP
PLCC
80
84
72069
Floppy-Disk Controller
All features of the 72067/68 with substitution of
high-performance analog phase-locked loop for
digital PLL
1 Mb/s
PLCC
QFP
84
100
Device,
"PD
Name
Description
765A/B
Floppy-Disk Controller
71065/66
Hard·Disk Controllers
Maximum
Read/Wrlte
Clock
Packaget
Pins
Supports eight drives in SMD mode, four drives
in ST506 mode; error correction and detection
23 MHz
Ceramic DIP
40
Enhanced Smal~Disk
Interface (ESDI)
Controller
Seria~mode ESDI compatible; controls up to
seven drives; supports up to 60 heads; hard
and soft-sector interfacing
18 MHz
Ceramic DIP
40
72061
CMOS Hard-Disk
Controlier
Supports SMD/SMD-E and ST506/412 type
drives
24 MHz
DIP
QFP
PLCC
40
52
52
72111
Small Computer System
Interface (SCSI)
Controller
Selectable 8/16 data bus width; 16 high-level
commands including multiphase commands for
reduced CPU load; 5-Mb sync/async; CMOS
16 MHz
SDIP
PLCC
QFP
64
68
74
Device,
"PD
Name
Description
7261 AlB
Hard-Disk Controller
7262
6-4
NEe
DSP and Speech Products
D
DSP and Speech Products
Section 7. DSP and Speech Products
Part Numbering System ........................................ 7-2
Digital Signal Processors ....................................... 7-3
Speech Processors ............................................. 7-4
Part Numbering System
"PD77C20AL
lIP
o
77C20A
L
Typical microdevice part number
NEC monolithic silicon integrated circuit
Device type (D = digital MOS)
Device identifier (alphanumeric)
Package type (L = PLCC)
A part number may include an alphanumeric suffix that identifies
special device characteristics.
7-2
NEe
NEe
DSP and Speech Products
Digital Signal Processors
Device,
"PO
Description
Instruction
Cycle (ns)
Instruction
ROM (Bits)
Data ROM
(Bits)
Data RAM
(Bits)
77C20A
16-bit, fixed-point DSP; CMOS
244
512 x 23
510x 13
128x 16
DIP
PLCC
SOP
PLCC
28
28
32
44
77P20
16-bit, fixed-point DSP; CMOS
244
512 x 23
LNEPROM
510x 13
LNEPROM
128x 16
Cerdip
28
77C25
16-bit, fixed-point DSP; CMOS
122/100
2048 x 24
1024 x 16
256 x 16
DIP
PLCC
SOP
PLCC
28
28
32
44
77P25
16-bit, fixed-point DSP; CMOS
122/100
2048 x 24
OTPROM
1024 x 16
OTPROM
256 x 16
DIP
SOP
PLCC
28
32
44
2048 x 24
LNEPROM
1024 x 16
LNEPROM
256 x 16
Cerdip
28
Package
t
Pins
77220
24-bit, fixed-point DSP; CMOS
122/100
2048 x 32
1024 x 24
512 x 24
Ceramic PGA
PLCC
68
68
77P220L
24-bit, fixed-point DSP; CMOS
122/100
2048 x 32
OTPROM
1024 x 24
OTPROM
512 x 24
PLCC
68
77P220R
24-bit, fixed-point DSP; CMOS
122/100
2048 x 32
LNEPROM
1024 x 24
LNEPROM
512 x 24
Ceramic PGA
68
77230AR
32-bit, floating-point DSP; CMOS
150
2048 x 32
1024 x 32
1024 x 32
Ceramic PGA
68
77230AR-003
32-bit, floating-point DSP; CMOS;
standard library software
150
n/a
nla
n/a
Ceramic PGA
68
77P230R
32-bit, floating-point DSP; CMOS
150
2048 x 32
LNEPROM
1024 x 32
LNEPROM
1024 x 32
Ceramic PGA
68
77240
32-bit, advanced, floating-point
DSP; CMOS
90
64Kx 32
external
nla
16M x32
external
PGA
132
77810
16-bit fixed-point modem DSP;
CMOS
181
2048 x 24
1024 x 16
256 x 16
Ceramic PGA
PLCC
68
68
77811
Analog front end for 2400-b/s fullduplex modem
nla
nla
n/a
n/a
PLCC
44
77812
2400-b/s full-duplex modem
controller
181
n/a
n/a
256 x 16
PLCC
QFP
68
74
7281
Image pipelined processor; NMOS
5-MHz clock
n/a
n/a
512 x 18
Ceramic DIP
40
72181
Image pipelined processor; CMOS
10-MHz clock
n/a
n/a
512x 18
DIP
QFP
40
68
9305
Support device for IlPD7281
processors; CMOS
10-MHz clock
n/a
nla
n/a
Ceramic PGA
132
t
Plastic unless ceramic (or cerdip) is specified.
7-3
•
NEe
DSP and Speech Products
Speech Processors
Device,
"PD
Name
Technology
Bit Rate
(kb/s)
77C30
ADPCM Speech Encoder/Decoder
NMOS
32
7755
ADPCM Spe',"ch Synthesizer
CMOS
16, 20, 24, 32
7756
ADPCM Speech Synthesizer
CMOS
77P56
ADPCM Speech Synthesizer
7757
Data ROM
(Bits)
Package
t
Pins
DIP
PLCC
28
44
96K
DIP
SOP
18
24
16, 20, 24, 32
256K
DIP
SOP
18
24
CMOS
16, 20, 24, 32
256K
OTPROM
DIP
SOP
20
24
ADPCM Speech Synthesizer
CMOS
16,20,24,32
512K
DIP
SOP
18
24
7759
ADPCM Speech Synthesizer
CMOS
16,20,24,32
1024K
external RAM
DIP
QFP
40
52
77501
Speech Recording and Reproducing LSI
CMOS
12,18,24
16M
extern al RAM
QFP
80
t Plastic unless ceramic (or cerdip) is specified.
7-4
NEe
Development Tools for Micro Products •
Development Tools for Micro Products
Section 8. Development Tools for Micro Products
V-Series Microprocessors ....................................... 8-3
75xx Series Single-Chip Microcomputers ......................... 8-7
75xxx Series Si ngle-Chip Microcomputers ........................ 8-9
78xx Series Single-Chip Microcomputers ........................ 8-12
782xx Series Single-Chip Microcomputers ....................... 8-14
783xx Series Single-Chip Microcomputers ....................... 8-16
DSP and Speech Products ..................................... 8-18
PG-1500 Programming Adapters ................................ 8-20
Note: Section 4 covers the 17K family of 4-bit microcontrollers and
related development tools.
V20 and V30 are registered trademarks of NEC Corporation.
V25, V33, V35, V40 and V50 are trademarks of NEC Corporation.
MS-DOS Is a registered trademark of Microsoft Corporation.
VAX, VMS and Ultrix are trademarks of Digital Equipment Corporation.
UNiX is a trademark of AT&T Beli Laboratories.
8-2
NEe
NEe
Development Tools for Micro Products
V-Series Microprocessors
Device
(Note 1)
Full
Emulator
Full
Emulator
Probe
Relocatable
Assembler
(Note 13)
C Compiler
(Note 14)
pPD70136GJ12
IE-70136A016
DDK-70136
RA70136
CC70136
pPD70136GJ16
EP-70136L-PC
(Note 2)
DDK-70136
RA70136
CC70136
IE-70136-PC
EP-70136L-PC
DDK-70136
RA70136
CC70136
EP-70136L-A
IE-70136-PC
EP-70136L-PC
DDK-70136
RA70136
CC70136
IE-70136A016
EP-70136L-A
(Note 3)
IE-70136-PC
EP-70136L-PC
(Note 3)
DDK-70136
RA70136
CC70136
pPD70136R-16
IE-70136A016
EP-70136L-A
(Note 3)
IE-70136-PC
EP-70136L-PC
(Note 3)
DDK-70136
RA70136
CC70136
pPD70208GF8
IE-70208A010
(Note 12)
EB-V40MINIIE
EB-70208
RA70116
CC70116
pPD7020BGF10
IE-7020BA010
(Note 12)
EB-V40MINIIE
EB-7020B
RA70116
CC70116
pPD70208L-B
IE-70208AC10
IE-700002958
EB-V40MINIIE
ADAPT6BPGA
6BPLCC (Note
4)
EB-70208
RA70116
CC70116
pPD70208L-10
IE-70208A010
IE-700002958
EB-V40MINIIE
ADAPT6BPGA
6BPLCC
(Note 4)
EB-70208
RA70116
CC70116
pPD70208R-8
IE-7020BA010
IE-700002959
EB-V40MINIIE
(Note 4)
EB-70208
RA70116
CC70116
pPD70208R-10
IE-70208A010
IE-700002959
EB-V40MINIIE
(Note 4)
EB-70208
RA70116
CC70116
pPD70216GF8
IE-70216A010
EP-70320J
(Note 12)
EB-V50MINIIE
EB70216
RA70116
CC70116
pPD70216GF10
IE-70216A010
EP-7032OJ
(Note 12)
EB-V50MINIIE
EB70216
RA70116
CC70116
pPD70216L-8
IE-70216A010
IE-70000295B
EB-V50MINIIE
ADAPT6BPGA
6BPLCC (Note
4)
EB70216
RA70116
CC70116
pPD70216L-10
IE-70216A010
IE-700002958
EB-V50MINIIE
ADAPT6BPGA
6BPLCC (Note
4)
EB70216
RA70116
CC70116
pPD70216R-B
IE-70216A010
IE-700002959
EB-V50MINIIE
(Note 4)
EB70216
RA70116
CC70116
pPD70216R-10
IE-70216A010
IE-700002959
EB-V50MINIIE
(Note 4)
EB70216
RA70116
CC70116
pPD70236GD10
IE-70236-BX
EV-9500GD120
(Note 18)
DDK-70236
RA70136
CC70136
pPD70236GD12
IE-70236-BX
EV-9500GD120
(Note 1B)
DDK-70236
RA70136
CC70136
pPD70236GD16
IE-70236-BX
EV-9500GD120
(Note 1B)
DDK-70236
RA70136
CC70136
Mini-IE
Emulator
Mini-IE
Probe
Evaluation
Boards
EP-70136L-A
(Note 2)
IE-70136-PC
EP-70136L-PC
(Note 2)
IE-70136A016
EP-70136L-A
(Note 2)
IE-70136-PC
pPD70136L-16
IE-70136A016
EP-70136L-A
pPD70136L-12
IE-70136A016
pPD70136R-12
EPROM
Device
8-3
•
ttlEC
Development Tools for Micro Products
V-Series Microprocessors (cont)
Device
(Note 1)
Full
Emulator
Full
Emulator
Probe
/JPD70236R-10
IE-70236-BX
(Note 17)
/JPD70236R12
IE-70236-BX
(Note 17)
Mini-IE
Emulator
Mini-IE
Probe
Relocatable
Assembler
(Note 13)
C Complier
(Note 14)
DDK-70236
RA70136
CC70136
DDK-70236
RA70136
CC70136
Evaluation
Boards
EPROM
Device
/JPD70236R-16
IE-70236-BX
(Note 17)
DDK-70236
RA70136
CC70136
/JPD70320GJ
IE-70320AOoa
EP-70320GJ
(Note 5)
EB-V2SMINIIE-P
EP-70320GJ
(Note 6)
DDK-70320
RA70320
CC70116
/JPD70320GJ8
IE-70320A008
EP-70320GJ
(Note 5)
EB-V2SMINIIE,P
EP-70320GJ
(Note 6)
DDK-70320
RA70320
CC70116
/JPD70320L
IE-70320AOoa
EP-70320L
EB-V2SMINIIE-P
(Note 7)
DDK-70320
RA70320
CC70116
/JPD70320L-8
IE-70320AOoa
EP-70320L
EB-V2SMINIIE-P
(Note 7)
DDK-70320
RA70320
CC70116
/JPD70322GJ
IE-70320AOoa
EV-9500GJ94
(Note 16)
EB-V2SMINIIE-P
EP-70320GJ
(Note 6)
DDK-70320
RA70320
CC70116
/JPD70322GJ8
IE-70320AOoa
EP-70320GJ
EB-V2SMINIIE-P
EP-70320GJ
DDK-70320
RA70320
CC70116
/JPD70322L
IE-70320A008
(Note 15)
EB-V25MINIIE-P
(Note 7)
DDK-70320
70P322K
(Note 10)
RA70320
CC70116
/JPD70322L-8
IE-70320A008
(Note 15)
EB-V25MINIIE-P
(Note 7)
DDK-70320
70P322K
(Note 10)
RA70320
CC70116
/JPD70325GJ8
IE-70325-BX
EV-9500GJ94
(Note 16)
EB-V25MINIIE-P
EP-70320GJ
(Note 6)
DDK-70325
RA70320
CC70116
/JPD70325GJ10
IE-70325-BX
(Note 8)
EV-9500GJ94
(Note 16)
EB-V25MINIIE-P
EP-70320GJ
(Note 6)
DDK-70325
RA70320
CC70116
/JPD70325L-8
IE-70325-BX
(Note 15)
EB-V25MINIIE-P
EP-70320GJ
(Note 6)
DDK-70325
RA70320
CC70116
/JPD70325L-l0
IE-70325-BX
(Note 8)
(Note 15)
EB-V25MINIIE-P
EP-70320GJ
(Note 6)
DDK-70325
RA70320
CC70116
/JPD70327GJ8 (Note 9)
IE-70320AOOS
EP-70320GJ
(Note 5)
EB-V25MINIIE-P
EP-70320GJ
(Note 6)
RA70320
CC70116
/JPD70327L-8
(Note 9)
IE-70230AOOS
EP-70320L
EB-V25MINIIE-P
(Note 7)
RA70320
CC70116
/JPD70330GJ8
IE-70330AOoa
EP-70320GJ
(Note 5)
EB-V35MINIIE-P
EP-7032OGJ
(Note 6)
DDK-70330
RA70320
CC70116
/JPD70330L-8
IE-70330AOoa
EP-70320L
EB-V35MINIIE-P
(Note 7)
DDK-70330
RA70320
CC70116
/JPD70332GJ8
IE-70330AOoa
EP-70320GJ
(Note 5)
EB-V35MINIIE-P
EP-70320GJ
(Note 6)
DDK-70330
RA70320
CC70116
/JPD70332L-8
IE-70330AOOS
EP-70320L
EB-V35MINIIE-P
(Note 7)
DDK-70330
RA70320
CC70116
/JPD70335GJ8
IE-70335-BX
EV-9500GJ94
(Note 16)
EB-V35MINIIE-P
EP-70320GJ
(Note 6)
DDK-70330
RA70320
CC70116
8-4
70P322K
(Note 10)
NEe
Development Tools for Micro Products
V-Series Microprocessors (cont)
Relocatable
Assembler
(Note 13)
C Complier
(Note 14)
DDK-70330
RA70320
CC70116
EP-70320GJ
(Note 6)
DDK-70330
RA70320
CC70116
EB-V35MINIIE-P
EP-70320GJ
(Note 6)
DDK-70330
RA70320
CC70116
EP-70320GJ
(Note 5)
EB-V35MINIIE-P
EP-70320GJ
(Note 6)
RA70320
CC70116
IE-70330A008
EP-70320L
EB-V35MINIIE-P
(Note 7)
RA70320
CC70116
IlPD79011GJ8 (Note 11)
IE-70320A008
EP-70320GJ
(Note 5)
(Note 12)
(Note 12)
RA70320
CC70116
IlPD79011 L-8
(Note 11)
IE-70320AOO8
+IE-70320RTOS
EP-70320Lj
(Note 12)
(Note 12)
RA70320
CC70116
IlPD79021 L-8
(Note 11)
IE-70330A008
+IE-70330RTOS
EP-70320L
(Note 12)
(Note 12)
RA70320
CC70116
Device
(Note 1)
Full
Emulator
IlPD70335GJ10
IE-70335-BX
(Note 8)EV9500GJ-94
(Note 16)
IlPD70335L-8
Full
Emulator
Probe
Mini-IE
Emulator
Mini-IE
Probe
Evaluation
Boards
EV-9500GJ94
(Note 16)
EP-V35MINIIE-P
EP-70320GJ
(Note 6)
IE-70335-BX
(Note 15)
EB-V35MINIIE-P
IlPD70335L-10
IE-70335-BX
(Note 8)
(Note 15)
IlPD70337GJ8 (Note 9)
IE-70330A008
IlPD70337L-8
(Note 9)
Notes:
(1)
(2)
(3)
Packages:
GF
GJ
K
L
R
(9)
80-pin plastic QFP
74-pln or 94-pin plastic QFP
84-pin ceramic LCC with window
68-pin or 84-pin plastic LCC
68-pin PGA
The EP-70136GL-A and. EP-70136L-PC contain both a 68-pin
PLCC probe and an adapter which converts the 68-pin PLCC
probes to a 74-pin QFP footprint.
68-pin PGA parts are supported by using the EP-70136L-A
PLCC probe or EP-70136L-PC PLCC probe, plus a PLCC socket
with a PGA-pinout. A PLCC socket of this type is supplied with
the EP-70136L-A.
(4)
The EB-V40 MINI-IE and EB-V50 MINI-IE support PGA packages
directly; the ADAPT68PGA68PLCC adapter converts the PGApinout on the MINI-IE to a PLCC footprint. This adapter is
supplied with the MINI-IE.
(5)
The EP-70320GJ is an adapter to the EP-70320L, which converts
84-pin PLCC probes to a 94-pin QFP footprint. For GJ parts,
both the PLCC probe and the adapter are needed.
(6)
The EP-70320GJ adapter can be used to convert the supplied
M-pin PLCC cable of the EB-V25 MINI-IE-P or EB-V35 MINI-IE-P
to a 94-pin QFP.
(7)
The EB-V25 MINI-IE-P and EB-V35 MINI-IE-P are supplied with an
84-pin PLCC cable.
(8)
Contact your local NEC Sales Office for the latest Information on
10-MHz emulation.
EPROM
Device
Development for the IlPD70327 or IlPD70337 can be done using
the appropriate IlPD70320 or IlPD70330 tools; however, debugging the programs in the Software Guard mode is not supported
at this time.
(10) The IlPD70P322K EPROM device can be used for both IlPD70322
and IlPD70332 emulation. The IlPD70P322K EPROM device can
be programmed by using the PA-70P322L Programming Adapter
and the PG-1500 EPROM Programmer.
(11) For emulation of IlPD79011 or IlPD79021, the base emulator
(IE-70320 or IE-70330) plus Real-Time Operating System software (IE-70320-RTOS or IE-70330-RTOS) Is required.
(12) This emulation option is not currently supported, but may be
available In the future. Contact your local NEC Sales Office for
further information.
(13) The following relocatable assemblers are available:
RA70116-D52
For V20f1!I/V3(J8f
(MS-DOSIIIj
RA70116-VVT1
V40'·/V50~
(VAX/VMS'·)
RA70116-VXT1
(VAX/UNIX~ 4.2 BSD
or Ultrix~)
For V33'· /V53(MS-DOS)
RA70136-D52
RA70136-VVT1
(VAX/VMS)
RA70136-VXT1
(VAXJUNIX 4.2 BSD or
Ultrix)
For V25'· /V35'·
RA70320-D52
(MS-DOS)
(VAX/VMS)
RA70320-VVT1
RA70320-VXT1
(VAX/UNIX 4.2 BSD or
Ultrix)
8-5
•
:
.
Development Tools for Micro Products
(14) The following C compilers are available:
For V2fYIJ/V30@!
(MS-DOS)
CC70116.D52
CC70116·VVn V40'·/V50~
N/l\XIVMS)
CC70116·VXT1
NAX/UNIX 4.2 BSD or
Ultrlx)
For V33~ /V53~
(MS-DOS)
CC70136·D52
CC70136·VVT1
N/l\XIVMS)
CC70136-VXn
N/l\XIUNIX 4.2 BSD or
Ultrix)
(15) 84-pin PLCC probe shipped with IE·70325-BX and IE-70035-BX.
(16) The EV-9500GJ-94 Is an adapter 1ha1 convens the 84'pin PLCC
probe to a 94·pin QFP. Target sockets must also be purchased to
mate to this adapter. Target sockets are sold in packs of five as
part number EV-92006-94x5.
(17) The IE-70236·BX Is shipped with the 132-pin PGA probe.
(18) The EV-9500GD-120 Is an adapter that converts the 132-pin PGA
probe to a 120-pin QFP. Target scckets must also be purchased
to mate to this adapter. Target sockets are scld in packs of five as
part number EV-9200GD-120.
8-6
NEe
NEe
Development Tools for Micro Products
75xx Series Sing Ie-Chip Microcomputers
Device (Note 1)
Emulator·
Add·on Board*
System
Evaluation
Board
/lPD7502G·12
EVAKIT·7500B
EV·7514
SE·7514·A
ASM75
/lPD7502AGF·368
EVAKlT·7500B
EV·7514
SE·7514-A
ASM75
/lPD7503G·12
EVAKIT·7500B
EV·7514
SE·7514-A
ASM75
/lPD7503AGF.3B8
EVAKlT·7500B
EV·7514
SE·7514-A
/lPD7507C
EVAKlT·7500B
/lPD7507CU
EVAKlT·7500B
ASM75
/lPD7507G-OO
EVAKlT·7500B
ASM75
/lPD7507BCU
EVAKlT·7500B
ASM75
/lPD7507BGB-3B4
EVAKIT·7500B
/lPD7507HC
EVAKlT·7500B
EV·7508H
/lPD7507HCU
EVAKlT·7500B
EV·7508H
ASM75
/lPD7507HG·22
EVAKIT·7500B
EV·7508H
ASM75
/lPD7508C
EVAKIT·7500B
/lPD7508CU
EVAKlT·7500B
ASM75
/lPD7508G-OO
EVAKIT·7500B
ASM75
/lPD7508BCU
EVAKlT·7500B
ASM75
/lPD7508BGB-3B4
EVAKIT·7500B
ASM75
/lPD75CG08E
EVAKIT·7500B
ASM75
EPROM/OTP
Device
PG·1500
Adapter
(Note 2)
Absolute
Assembler
(Note 3)
ASM75
/lPD78CG08E
ASM75
ASM75
/lPD75CG08HE
/lPD78CG08E
ASM75
ASM75
/lPD7508HC,
EVAKlT·7500B
EV·7508H
/lPD7508HCU
EVAKlT·7500B
EV·7508H
ASM75
/lPD7508HG·22
EVAKIT·7500B
EV·7508H
ASM75
/lPD75CG08HE
EVAKIT·7500B
EV·7508H
ASM75
/lPD7527AC
EVAKIT·7500B
EV·7528
/lPD7527ACU
EVAKIT·7500B
EV·7528
/lPD7528AC
EVAKIT·7500B
EV·7528
/lPD7528ACU
EVAKlT·7500B
EV·7528
/lPD75CG28E
EVAKlT·7500B
EV·7528
/lPD7533C
EVAKIT·7500B
EV·7533
/lPD7533CU
EVAKIT·7500B
EV·7533
ASM75
/lPD7533G·22
EVAKlT·7500B
EV·7533
ASM75
/lPD75CG33E
EVAKIT·7500B
EV·7533
/lPD7537AC
EVAKlT·7500B
EV·7528
/lPD7537ACU
EVAKlT·7500B
EV·7528
/lPD7538AC
EVAKlT·7500B
EV·7528
/lPD7538ACU
EVAKIT·7500B
EV·7528
ASM75
/lPD75CG38E
EVAKlT·7500B
EV·7528
ASM75
/lPD78CG08HE
/lPD78CG28E
•
ASM75
ASM75
ASM75
/lPD78CG28E
ASM75
ASM75
ASM75
/lPD75CG33E
ASM75
ASM75
/lPD75CG38E
ASM75
ASM75
/lPD75CG38E
ASM75
* Required tools
8·7
NEe
Development Tools for Micro Products
75xx Series Single-Chip Microcomputers (cont)
Device (Note 1)
Emulator*
Add-on Board*
System
Evalustlon
Board
J,lPD7554CS
EVAKrr·7500B
EV-7554A
SE·7554·A
J,lPD75P54CS
PA·75P54CS
ASM75
J,lPD7554G
EVAKIT·7500B
EV·7554A
SE·7554·A
J,lPD75P54G
PA·75P54CS
ASM75
J,lPD7554ACS
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P54CS
PA·75P54CS
ASM75
J,lPD7554AG
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P54G
PA·75P54CS
ASM75
J,lPD75P54CS
EVAKrr·7500B
EV·7554A
J,lPD75P54G
EVAKlT·7500B
EV·7554A
J,lPD7556CS
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P56CS
PA·75P56CS
ASM75
J,lPD7556G
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P56G
PA·75P56CS
ASM75
J,lPD75P56CS
PA·75P56CS
ASM75
J,lPD75P56G
PjI..75P56CS
ASM75
J,lPD7556ACS
EVAKlT·7500B
EV·7554A
EPROM/OTP
Device
PG-1S00
Adapter
(Note 2)
Absolute
Assembler
(Note 3)
ASM75
ASM75
SE·7554·A
J,lPD7556AG
EVAKIT·7500B
EV·7554A
J,lPD75P56CS
EVAKrr·7500B
EV·7554A
J,lPD75P56G
EVAKIT·7500B
EV·7554A
J,lPD7564CS
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P64CS
PA·75P54CS
ASM75
J,lPD7564G
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P64G
PA·75P54CS
ASM75
J,lPD7564ACS
EVAKlT·7500B
EV-7554A
SE-7554-A
J,lPD75P64CS
PA·75P54CS
ASM75
J,lPD7564AG
EVAKIT·7500B
EV·7554A
SE·7554·A
J,lPD75P64G
PA·75P54CS
ASM75
J,lPD75P64CS
EVAKIT·7500B
EV·7554A
ASM75
J,lPD75P64G
EVAKIT·7500B
EV·7554A
ASM75
J,lPD7566CS
EVAKIT·~500B
EV·7554A
SE·7554·A
J,lPD75P66CS
PA-75P56CS
ASM75
J,lPD7566G
EVAKlT·7500B
EV·7554A
SE·7554·A
J,lPD75P66G
PA·75P56CS
ASM75
J,lPD7566ACS
EVAKIT-7500B
EV-7554A
SE·7554·A
J,lPD75P66CS
PA-75P56CS
ASM75
J,lPD7566AG
EVAKIT·7500B
EV·7554A
SE·7554·A
J,lPD75P66G
PA·75P56CS
ASM75
J,lPD75P66CS
EVAKlT-7500B
EV-7554A
ASM75
J,lPD75P66G
EVAKIT·7500B
EV-7554A
ASM75
SE·7554·A
ASM75
ASM75
Notes:
(1)
8-8
Packages:
C
40-pin plastic DIP (uPD7507/07H/OS{08H)
42·pin plastic DIP (uPD7527AI28N33/37N38A)
CS
20·pln plastic shrink DIP
(uPD7554/54NP54/64/64NP64)
24·pln plastic shrink DIP
(uPD7556/56NP56/66I66A/P66)
CU
40·pin plastic shrink DIP
(uPD7507/07B{07H/08/OSB/OSH)
42·pin plastic shrink DIP
(uPD7527A128N33/37N38A)
E
40·pin ceramic piggy·back DIP (uPD75CG08/08H)
42·pin ceramic piggy.back DIP (uPD75CG28/33/38)
G
20·pin plastic SO (uPD7554/54NP54/64/64NP64)
24·pin plastic SO (uPD7556/56NP56/66/66A/P66)
52·pin plastic QFP
G·OO
54·pln plastic QFP (2.05 mm thick) (uPD7502{03)
G·12
G·22
44·pin plastic QFP (1.45 mm thick)
GB-3B4
44·pin plastic QFP (2.7 mm thick)
.GF·3B8
64·pln plastic QFP (2.7 mm thick)
(2)
By using the specified adapter, the PG·1500 EPROM program·
mer cen be used to program the OTP device.
(3)
The ASM75 Absolute Assembler is provided to run under the
MS-DOS® operating system. (ASM75·D52).
NEe
Development Tools for Micro Products
75xxx Series Sing Ie-Chip Microcomputers
Device (Note 5)
Emulator*
/lPD75004CU
IE·75000·R
Emulation Probe*
EP·75008CU·R
/lPD75004GB·SB4
IE·75000·R
EP·75008GB·R
/lPD75006CU
IE·75000·R
Ep·75008CU·R
/lPD75006GB-3B4
IE·75000·R
EP·75008GB·R
/lPD75008CU
IE·75000·R
EP·75008CU·R
/lPD75008GB-3B4
IE·75000·R
Ep·75008GB·R
/lPD75POO8CU
IE·75000·R
Ep·75008CU·R
/lPD75POO8GB
IE·75000·R
EP·75008GB·R
/lPD75028CW
IE·75000·R
Ep·7502BCW·R
/lPD75028GC-AB8
IE·75000·R
Ep·75028GC·R
/lPD75P036CW
IE·75000·R
EP·75028CW·R
/lPD75P036GC-AB8
IE·75000·R
EP·75028GC·R
/lPD75048CW
IE·75000·R
Ep·75028CW·R
/lPD75048GC·AB8
IE·75000·R
EP·75028GC-R
/lPD75P056CW
IE·75000·R
Ep·7502BCW·R
/lPD75P056GC-AB8
JE·75000·R
Ep·75028GC·R
/lPD75104CW
IE·75000·R
Ep·75108CW·R
/lPD75104G·1 B
IE·75000·R
EP·75108GF·R
/lPD75104GF·3BE
JE·75000·R
/lPD75104AGC·ABB
Optional Socket
Adapter (Note 1)
EPROM/OTP
Device (Note 2)
Relocatable
Assembler
(Note 3)
Structured
Assembler
(Note 4)
/lPD75P008CU
RA75X
ST75X
EV·9200G·44
/lPD75POO8GB
RA75X
ST75X
/lPD75P008CU
RA75X
ST75X
/lPD75P008GB
RA75X
ST75X
/lPD75POO8CU
RA75X
ST75X
/lPD75POO8GB
RA75X
ST75X
RA75X
ST75X
RA75X
ST75X
EV-9200G·44
EV-9200G·44
EV·9200G·44
/lPD75P036CW
RA75X
ST75X
/lPD75P036GC
RA75X
ST75X
RA75X
ST75X
RA75X
ST75X
/lPD75P056CW
RA75X
ST75X
/lPD75P056GC
RA75X
ST75X
RA75X
ST75X
RA75X
ST75X
/lPD75P108CW/
DW/BCW
/lPD75P116CW
RA75X
ST75X
EV-9200G·64
/lPD75P108G
/lPD75P116GF
RA75X
ST75X
EP·75108GF·R
EV·9200G·64
/lPD75P108G/
BGF
/lPD75P116GF
RA75X
ST75X
IE·75000·R
Ep·75108AGC·R
EV-9200GC·64
RA75X
ST75X
/lPD75106CW
IE·75000·R
EP·75108CW·R
/lPD75P108CW/
DW/BCW
/lPD75P116CW
RA75X
ST75X
/lPD75106G·1 B
IE·75000·R
EP·75108GF·R
EV-9200G·64
/lPD75P108G
/lPD75P116GF
RA75X
ST75X
/lPD75106GF·3BE
E·75000·R
Ep·75108GF·R
EV·9200G·64
/lPD75P108G!
BGF
/lPD75P116GF
RA75X
ST75X
EV-9200GC·64
EV·9200GC-64
EV·9200GC-64
EV-9200GC·64
/lPD75108AG·22
IE·75000·R
Ep·75108AGC·R
EV·9200GC-64
RA75X
ST75X
/lPD75108AGC·AB8
IE·75000·R
EP·75108AGC·R
EV-9200GC·64
RA75X
ST75X
/lPD75108CW
IE·75000·R
Ep·75108CW·R
/lPD75P108CW/
DW/BCW
/lPD75P116CW
RA75X
ST75X
/lPD75108G·1 B
IE·75000·R
Ep·75108GF·R
EV·9200G·64
/lP D75P1 08G
/lPD75P116GF
RA75X
ST75X
/lPD75108GF·3BE
IE·75000·R
Ep·75108GF·R
EV·9200G·64
/lPD75P108G/
BGF
/lPD75P116GF
RA75X
ST75X
/lPD75P108BCW
IE·75000·R
EP·75108CW·R
RA75X
ST75X
/lPD75P108BGF
IE·75000·R
EP·75108GF·R
RA75X
ST75X
EV-9200G·64
•
8·9
NEe
Development Tools for Micro Products
75xxx Series Single-Chip Microcomputers (cont)
Optional Socket
Adapter (Note 1)
EPROM/OlP
Device (Note 2)
Relocatable
Assembler
(Note 3)
Structured
Assembler
(Note 4)
Device (Note 5)
Emulator*
Emulation Probe*
IIPD75P108CW
IE-75000-R
EP-75108CW-R
RA75X
ST75X
IIPD75P108DW
IE-75000-R
EP-75108CW-R
RA75X
ST75X
IIPD75P108G-1 B
IE-75000-R
EP-75108GF-R
RA75X
ST75X
IIPD75112CW
IE-75000·R
EP·75108CW-R
IIPD75P116CW
RA75X
ST75X
IIPD75112GF·3BE
IE-75000·R
EP·75108GF·R
IIPD75Pl16GF
RA75X
ST75X
IIPD75116CW
IE·75000-R
EP·75fo8CW-R
IIPD75P116CW
RA75X
ST75X
IIPD75116GF-3BE
IE·75000-R
EP·75108GF-R
IIPD75P116GF
RA75X
ST75X
IIPD75P116CW
IE·75000·R
EP-75108CW-R
RA75X
ST75X
IIPD75P116GF
IE-75000·R
EP-75108GF·R
RA75X
ST75X
IIPD75206CW
IE·75000-R
EP-75216ACW-R
RA75X
ST75X
EV·9200G·64
EV-9200G·64
EV-9200G·64
EV-9200G-64
IIPD75P216ACW
IIPD75206G.1 B
IE·75000·R
EP-75216AGF·R
EV-9200G·64
RA75X
ST75X
IIPD75206GF.3BE
IE·75000-R
EP·75216AGF·R
EV-9200G·64
RA75X
ST75X
IIPD75208CW
IE-75000-R
EP·75216ACW-R
RA75X
ST75X
IIPD75208G.1 B
IE·75000·R
EP·75216AGF·R
EV-9200G-64
RA75X
ST75X
IIPD75208GF·3BE
IE·75000-R
EP·75216AGF·R
EV-9200G·64
RA75X
ST75X
IIPD75CG208E
IE·75000·R
Ep·75216ACW·R
RA75X
ST75X
IIPD75CG208EA
IE·75000-R
EP-75216AGF-R
RA75X
ST75X
IIPD75212ACW
IE·75000·R
EP·75216ACW-R
RA75X
ST75X
IIPD75212AGF-3BE
IE·75000·R
EP-75216AGF-R
RA75X
ST75X
IIPD75216ACW
IE·75000·R
EP-75216ACW-R
IIPD75216AGF
IE·75000-R
EP·75216AGF·R
IIPD75CG216AE
IE-75000-R
EP-75216ACW-R
IIPD75CG216AEA
IE·75000-R
EP-75216AGF·R
IIPD75P216ACW
IE-75000·R
EP·75216ACW·R
IIPD75217CW
IE-75000-R
EP-75216ACW·R
IIPD75217GF·3BE
IE-75000-R
EP-75216AGF·R
IIPD75P218CW
IE-75000-R
Ep·75216ACW-R
IIPD75P218GF-3BE
IE-75000-R
Ep·75216AGF·R
IIPD75P218KB
IE-75000·R
EP-75216AGF·R
IIPD75268CW
IE·75000-R
Ep·75216ACW·R
IIPD75268GF·3BE
IE-75000·R
EP-75216AGF·R
EV-9200G·64
IIPD75304GF·3B9
IE·75000-R
EP-75308GF-R
EV-9200G-80
IIPD75306GF-3B9
IE-75000·R
EP-75308GF-R
IIPD75308GF-3B9
IE-75000-R
EP-75308GF-R
IIPD75P308GF
IE-75000-R
EP-75308GF·R
IIPD75P308K
IE-75000-R
IIPD75312GF-3B9
IIPD75316GF-3B9
8-10
IIPD75P216ACW
EV-9200G-64
IIPD75P216ACW
EV-9200,G-64
RA75X
ST75X
RA75X
ST75X
RA75X
ST75X
RA75X
ST75X
IIPD75P216ACW
RA75X
ST75X
IIPD75P218CW
RA75X
ST75X
IIPD75P218GF/KB
RA75X
ST75X
RA75X
ST75X
EV-9200G-64
RA75X
ST75X
EV-9200G-64
RA75X
ST75X
RA75X
ST75X
IIPD75P216ACW
EV·9200G-64
EV-9200G-64
EV·9200G-64
IIPD75P216ACW
RA75X
ST75X
IIPD75P308GF/K
RA75X
ST75X
EV-9200G-80
IIPD75P308GF/K
RA75X
ST75X
EV-9200G-80
IIPD75P308GF/K
RA75X
ST75X
EV-9200G-80
RA75X
ST75X
EP-75308GF-R
EV·9200G-80
RA75X
ST75X
IE-75000-R
EP-75308GF-R
EV·9200G-80
IIPD75P316GFI
AGF/AK
RA75X
ST75X
IE-75000-R
EP-75308GF-R
EV-9200G-80
IIPD75P316GFI
AGF/AK
RA75X
ST75X
ttiEC
Development Tools for Micro Products
75xxx Series Single-Chip Microcomputers (cont)
Structured
Assembler
(Note 4)
Device (Note 5)
Emulator·
Emulation Probe·
JlPD75P316GF
IE-75000-R
EP-75308GF-R
EV-9200G-80
RA75X
ST75X
JlPD75P316AGF
IE-75000-R
EP-75308GF-R
EV-9200G-SO
RA75X
ST75X
JlPD75P316AK
IE-75000-R
EP-75308GF-R
EV-9200G-SO
RA75X
ST75X
JlPD75328GC-3B9
IE-75000-R
EP-75328GC-R
EV-9200GC-80
RA75X
ST75X
JlPD75P328GC-3B9
IE-75000-R
EP-75328GC-R
EV-9200GC-80
RA75X
ST75X
JlPD75402AC
IE-75000-R
EP-75402C-R
JlPD75P402C
RA75X
ST75X
JlPD75402ACT
IE-75000-R
EP-75402C-R
JlPD75P402CT
RA75X
ST75X
JiPD75402AGB-3B4
IE-75000-R
EP-75402GB-R
JlPD75P402GB
RA75X
ST75X
JlPD75P402C
IE-75000-R
EP-75402C-R
RA75X
ST75X
JlPD75P402CT
IE-75000-R
EP-75402C-R
RA75X
ST75X
JlPD75P402GB-3B4
IE-75000-R
EP-75402GB-R
EV-9200G-44
RA75X
ST75X
JlPD75512GF-3B9
IE-75000-R
EP-75516GF-R
EV-9200G-80
JlPD75P516GF/K
RA75X
ST75X
JlPD75516GF-3B9
IE-75000-R
EP-75516GF-R
EV-9200G-80
JlPD75P516GF/K
RA75X
ST75X
JlPD75P516GF
IE-75000-R
EP-75516GF-R
EV-9200G-80
RA75X
ST75X
JlPD75P516K
IE-75000-R
EP-75516GF-R
EV-9200G-80
EV-9200G-44
EPROM/OTP
Device (Note 2)
Relocatable
Assembler
(Note 3)
Optional Socket
Adapter (Note 1)
JlPD75P32SGC
Notes:
(1)
The EV-9200G-XX is an LCC socket with the footprint of the flat
package. One unit is supplied with the probe. Additional units
are available as replacement parts In sets of five.
(2)
All EPROM/OTP devices can be programmed using the NEC
PG-1500. Refer to the PG-1500 Programming Socket Adapter
Selection Guide for the appropriate socket adapter.
(3)
The RA75X reloeatable assembler package is provided for the
following operating system:
RA75X-D52 (M9-DOSIill
(4)
The ST75X structured assembler preprocessor Is provided with
RA75X.
(5)
Packages:
2S-pin plastic DIP
C
CT
2S-pin plastic shrink DIP
CU
42-pin plastic shrink DIP
ON
64-pin plastic shrink DIP
DW
64-pin ceramic shrink DIP with window
E
64-pin ceramic piggy-back shrink DIP
EA
64-pln ceramic piggy-back QFP
G-1B
64-pin plastic QFP (2.05 mm thick)
G-22
64-pin plastic QFP (1\55 mm thick)
GB-3B4
44-pin plastic QFP
GC-ABS
64-pin plastic QFP (2.55 mm thick)
GC-3B9
SO-pin plastic QFP
64-pin plastic QFP (2.77 mm thick)
GF-3BE
GF-3B9
SO-pin plastic QFP
SO-pin ceramic LCC
K
KB
64-pln ceramic LCC
* Required tools.
8-11
NEe
Development Tools for Micro Products
7axx Series Sing Ie-Chip Microcomputers
PG-1500
Adapter (Note 2)
Relocatable
Assembler
(Note 9)
C Complier
(Note 9)
Device (Note 1) t
Emulator·
Emulation Probe·
IIPD7BC10CW
IE-7BCll-M
EV-9001-64
(Note 3)
RAB7
CC87
IIPD7BC10Gl B
1E-7BCll-M
(Note 5)
RAB7
CCB7
IIPD7BC1OGF-3BE
IE-7BC11-M
(Note 5)
RAB7
CCB7
IIPD7BC10L
IE-7BCll-M
(Note 7)
RA87
CCB7
IIPD7BC10ACW
IE-7BC11-M
EV-9001-64
(Note 3)
RA87
CC87
IIPD7BC10AGQ36
IE-78C11-M
(Note 4)
RA87
CCB7
IIPD7BC10AGF
IE-7BCll-M
(NoteS)
RA87
CCB7
IIPD7BC10AL
IE-7BCll-M
(Note 7)
RA87
CC87
IIPD7BC11 CW
IE-7BC11-M
EV-9001-64
(Note 3)
IIPD7BCP14CW/DW
PA-7BCP14CW
RA87
CCB7
IIPD7BC11 G-36
IE-7BCll-M
(Note 4)
IIPD7BCP14G36/R
IIPD7BCP14E
PA-7BCP14GQ
RAB7
CC87
IIPD7BCllG-1B
1E-7BC11-M
(Note 5)
IIPD7BCP14GF
PA-7BCP14GF.
RAB7
CC87
IIPD7BC11 GF-3BE
IE-78Cl1-M
(Note 5)
IIPD78CP14GF
PA-78CP14GF
RA87
CC87
IIPD7BC11L
IE-7BC11-M
(Note 7)
IIPD7BCP14L
PA-7BCP14L
RA87
CC87
IIPD7BCllACW
IE-7BCll-M
EV-9001-64
(Note 3)
IIPD7BCP14CW/DW
(Note 6)
PA-7BCP14CW
RA87
CCB7
IIPD78CllAGQ-36
IE-78Cl1-M
(Note 4)
IIPD78CP14G36/R
(Note 6)
PA-78CP14GQ
RA87
CC87
IIPD7BCll AGF-3BE
IE-7BC11-M
(Note 5)
IIPD78CP14GF
(Note 6)
PA-78CP14GF
RA87
CC87
IIPD7BCllAL
IE-7BCll-M
(Note 7)
IIPD78CP14L
(Note 6)
PA-7BCP14L
RA87
CCB7
IIPD7BCl2ACW
IE-7BC11-M
EV-9001-64
(Note 3)
IIPD78CP14CW/DW
(Note 6)
PA-78CP14CW
RA87
CC87
IIPD7BC12AGQ
IE-7BC11-M
(Note 4)
IIPD7BCP14G36/R
(Note 6)
PA-78CP14GQ
RA87
CC87
IIPD7BCl2AGF
IE-7BCll-M
(Note 5)
IIPD7BCP14GF
(Note 6)
PA-78CP14GF
RA87
CC87
IIPD7BCl2AL
IE-7BC11-M
(Note 7)
IIPD7BCP14L
(Note 6)
PA-78CP14L
RA87
CC87
IIPD7BC14CW
IE-78Cl1-M
EV-9001-64
(Note 3)
IIPD7BCP14CW/DW
PA-78CP14CW
RA87
CC87
IIPD7BC14G-36
IE-78Cll-M
(Note 4)
IIPD7BCP14G36/R
IIPD7BCG14E
PA-78CP14GQ
RA87
CCB7
EPROMJOTP Device
IIPD7BC14G-l B
IE-7BC11-M
(Note 5)
IIPD78CP14GF
PA-7BCP14GF
RA87
CCB7
IIPD7BC14GF
IE-7BC11-M
(Note 5)
IIPD78CP14GF
PA-78CP14GF
RA87
CC87
IIPD7BC14L
IE-78Cl1-M
(Note 7)
IIPD7BCP14L
PA-7BCP14L
RA87
CC87
IIPD7BC14AG-ABB
IE-7BCll-M
(Note 5)
RA87
CC87
IIPD7BCG14E
(Note B)
IE-7BCll-M
(Note 4)
RA87
CCB7
8-12
NEe
Development Tools for Micro Products
78xx Series Single-Chip Microcomputers (cont)
t
PG-1500
Adapter (Note 2)
Relocatable
Assembler
(Note 9)
C Complier
(Note 9)
Emulator*
Emulation Probe*
pPD7BCP14CW
IE-7BCll-M
EV-9001-64
(Note 3)
PA-780P14CW
RA87
CC87
pPD7BCP14DW
IE-7BCll-M
EV-9001-64
(Note 3)
PA-78CP14CW
RA87
CC87
pPD78CP14G36
IE-78011-M
(Note 4)
PA-78CP14GQ
RA87
CC87
pPD78CP14GF
IE-78Cll-M
(Note 5)
PA-78CP14GF
RA87
C087
pPD78CP14l
IE-78011-M
(Note 7)
PA-78CP14l
RA87
CC87
pPD78CP14R
IE-78011-M
(Note 4)
PA-78CP14GQ
RA87
CC87
pPD78C17CW
IE-78Cll-M
EV-9001-64
(Note 3)
RA87
CC87
pPD78C17GQ36
IE-78Cll-M
(Note 4)
RA87
CC87
pPD78C17GF
IE-78Cll-M
(Note 5)
RA87
CC87
pPD78C18CW
IE-78Cl1-M
EV-9001-64
(Note 3)
pPD78CP18CW
(Note 6)
PA-78CP14CW
RA87
CC87
pPD78C18GQ
IE-7BCll-M
(Note 4)
pPD78CP18GQ
(Note 6)
PA-78CP14GQ
RA87
CC87
pPD78C18GF
IE-78Cll-M
(Note 5)
pPD78CP18GF
(Note 6)
PA-78CP14GF
RA87
CC87
pPD78CP18KB
(Note 6)
PA-78CP14KB
Device (Note 1)
EPROM/OTP Device
pPD78CP18CW
IE-78C11-M
EV-9001-64
(Note 3)
PA-78CP14CW
RA87
C087
pPD78CP18GQ
IE-78011-M
(Note 4)
PA-78CP14GQ
RA87
CC87
pPD78CP18GF
IE-78Cll-M
(Note 5)
PA-78CP14GF
RA87
CC87
pPD78CP18KB
IE-78Cll-M
(Note 5)
PA-78CP14KB
RA87
CC87
* Required tools
t For all pPDC1X devices, you may use the DDK-78Cl0 for
evaluation purposes.
Notes:
(1)
Packages:
CW
OW
E
G-l B
G-36
G-AB8
GF-3BE
GQ-36
KB
l
R
64-pin
64-pin
64-pln
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
68-pin
64-pln
plastic shrink DIP
ceramic shrink DIP with window
ceramic piggyback QUIP
plastic QFP (resin thickness 2.05 mm)
plastic QUIP
plastic QFP (Interpln pitch 0.8 mm)
plastic QFP (resin thickness 2.7 mm)
plastic QUIP
ceramic lCC with window
PlCC
ceramic QUIP with window
(2)
By using the specified adapter, the PG-1500 EPROM programmer can be used to program the EPROMlOTP device.
(3)
64-pin shrink DIP adapter which plugs into the EP-7811HGQ
emUlation probe supplied with each IE.
(4)
The emulation probe for the 64-pin QUIP package (EP-7811 HGQ)
is supplied with the IE.
(5)
No emulation probe available.
II
(6)
The pPD78CP14/CP18 EPROMlOTP devices do not have pull-up
resistors on ports A, S, and C.
(7)
The optional AS-QIP-PCC-D781X QUIP-to-PlCC adapter can be
used with the EP-7811 HGQ emulation prObe supplied with each
IE.
(8)
The pPD78CG14E Is a piggyback EPROM device in a ceramic
QUIP package. It accepts 27C256 and 27C256A EPROMs.
(9)
The following relocatable assemblers and C compilers are available:
(MS-DOSGI)
Relocatable assemRA87-D52
RA87-WTl
blers for 78XX
tYAX/VMSGI)
series
CCMSD-15DD-87
(MS-DOS)
CCMSD-15DD-87-16 (MS-DOS;
extended memory)
COVMS-0T16-87
tYAX/VMS)
00UNX-OT16-87
tYAX/UNIX";
4.2 SSD or UltrlxO!l
C Compilers
78XX Series
for
8-13
NEe
Development Tools for Micro Products
782xx Series Single-Chip Microcomputers
Device
(Notes 1,2)
Evaluation
Kit
(Note 3)
Designer
Kit
(Note 4)
Emulator
Kit
(Note 5)
IlPD78212CW
EK·78K2·21X
DK·78K2·
21XCW
IlPD78212GC
EK·78K2·21X
IlPD78212GJ
Low-End
Emulator
Emulation
System
Emulation
Probe
EPROM/OTP
Device (Note 6)
IK·78K2·
21XCW
EB-78210·PC
IE·78240·R
Ep·78240CW·R
IlPD78P214CW/DW
DK·78K2·
21XGC
IK·78K2·
21XGC
EB-78210·PC
IE·78240·R
EP·78240GC·R
(Note 9)
IlPD78P214GC
EK·78K2·21X
DK·78K2·
21XGJ
IK·78K2·
21XGJ
EB-78210·PC
IE·78240·R
EP·78240GJ·R
(Note 7)
IIPD78P214GJ
IIPD78212GQ
EK·78K2·21X
DK·78K2·
21XGQ
IK·78K2·
21XGQ
EB-78210·PC
IE·78240·R
EP·78240GQ·R
IIPD18P214GQ
IIPD78212L
EK·78K2·21X
DK·78K2·
21XL
IK·78K2·
21XL
EB-78210·PC
IE·78240·R
Ep·78240LP·R
IIPD78P214L
IIPD78213CW
EK·78K2-21X
DK·78K2·
21XCW
IK·78K2·
21XCW
EB-78210·PC
IE·78240·R
EP·78240CW·R
IIPD78213GC
EK·78K2·21X
DK·78K2·
21XGC
IK·78K2·
21XGC
EB-78210·PC
IE·78240·R
Ep·78240GC·R
(Note 9)
IlPD78213GJ
EK·78K2·21X
DK·78K2·
21XGJ
IK·78K2·
21XGJ
EB-78210·PC
IE·78240·R
EP·78240GJ·R
(Note 7)
IlPD78213G36
EK·78K2·21X
DK·78K2·
21XGQ
IK·78K2·
21XGQ
EB-78210·PC
IE·78240·R
EP·78240GQ·R
IlPD78213L
EK·78K2·21X
DK·78K2·
21XL
IK·78K2·
21XL
EB-78210·PC
IE·78240·R
Ep·78240LP·R
IIPD78214CW
EK·78K2-21X
DK·78K2·
21XCW
IK·78K2·
21XCW
EB-78210·PC
IE·78240·R
Ep·78240CW·R
IIPD78P214CW/DW
IIPD78214GC
EK·78K2·21X
DK·78K2·
21XGC
IK·78K2·
21XGC
EB-78210·PC
IE·78240·R
Ep·78240GC-R
(Note 9)
IIPD78P214GC
IlPD78214GJ
EK·78K2·21X
DK·78K2·
21XGJ
IK·78K2·
21XGJ
EB-78210·PC
IE·78240·R
Ep·78240GJ-R
(Note 7)
IIPD78P214GJ
IlPD78214G36
EK·78K2-21X
DK·78K2·
21XGQ
IK·78K2·
21XGQ
EB·78210·PC
IE·78240·R
Ep·78240GQ-R
IIPD78P214GQ
IlPD78214L
EK·78K2-21X
DK·78K2·
21XL
IK·78K2·
21XL
EB-78210·PC
IE·78240·R
Ep·78240LP·R
IIPD78P214L
IlPD78P214CW
EK·78K2·21X
DK·78K2·
21XCW
IK·78K2·
21XCW
EB-78210·PC
IE·78240·R
Ep·78240CW·R
IIPD78P214DW
EK·78K2-21X
DK·78K2·
21XCW
IK·78K2·
21XCW
EB·78210·PC
IE·78240·R
EP·78240CW·R
IIPD78P214GC
EK·78K2·21X
DK·78K2·
21XGC
IK·78K2·
21XGC
EB·78210·PC
IE·78240·R
EP·78240GC·R
(Note 9)
IIPD78P214GJ
EK·78K2·21X
DK·78K2·
21XGJ
IK·78K2·
21XGJ
EB-78210·PC
IE·78240·R
Ep·78240GJ·R
(Note 7)
IlPD78P214GQ
EK·78K2-21X
DK·78K2·
21XGQ
IK·78K2·
21XGQ
EB-78210·PC
IE·78240·R
Ep·78240GQ·R
IlPD78P214L
EK·78K2·21X.
DK·78K2·
21XL
IK·78K2·
21XL
EB-78210·PC
IE·78240·R
Ep·78240LP·R
IlPD78220GJ
EK·78K2·22X
DK·78K2·
22XGJ
IK·78K2·
22XGJ
EB-78220·PC
IE·78230·R
Ep·78230GJ·R
(Note 8)
IIPD78220L
EK·78K2-22X
DK·78K2·
22XL
IK·78K2·
22XL
EB-78220·PC
IE·78230·R
EP·78230LQ-R
IlPD78224GJ
EK·78K2·22X
DK·78K2·
22XGJ
IK·78K2·
22XGJ
EB-78220·PC
IE·78230·R
Ep·78230GJ·R
(Note 8)
8·14
IIPD78P224GJ
NEe
Development Tools for Micro Products
782xx Series Single-Chip Microcomputers (cant)
Device
(Notes 1, 2)
Evaluation
Kit
(Note 3)
Designer
Kit
(Note 4)
Emulator
Kit
(Note 5)
/lPD78224L
EK-78K2-22X
DK-78K222XL
IlPD78P224GJ
EK-78K2-22X
/lPD78P224L
Low-End
Emulator
Emulation
System
Emulation
Probe
EPROM/OTP
Device (Note 6)
IK-78K222XL
EB-78220-PC
IE-78230-R
EP-78230LQ-R
/lPD78P224L
DK-78K222XGJ
IK-78K222XGJ
EB-78220-PC
IE-78230-R
EP-78230GJ-R
(Note 8)
EK-78K2-22X
DK-78K222XL
IK-78K222XL
EB-78220-PC
IE-78230-R
EP-78230LQ-R
/lPD78233GC
EK-78K2-23X
DK-78K223XGC
IK-78K223XGC
EB-78230-PC
IE-78230-R
EP-78230GC-R
(Note 10)
/lPD78233GJ
EK-78K2-23X
DK-78K223XGJ
IK-78K223XGJ
EB-78230-PC
IE-78230-R
EP-78230GJ-R
(Note 8)
/lPD78233LQ
EK-78K2-23X
DK-78K223XL
IK-78K223XL
EB-78230-PC
IE-78230-R
EP-78230LQ-R
/lPD78234GC
EK-78K2-23X
DK-78K223XGC
IK-78K223XGC
EB-78230-PC
IE-78230-R
EP-78230GC-R
(Note 10)
/lPD78P238GC
/lPD78234GJ
EK-78K2-23X
DK-78K223XGJ
IK-78K223XGJ
EB-78230-PC
IE-78230-R
EP-78230GJ-R
(Note 8)
/lPD78P238GJ/KF
/lPD78234LQ
EK-78K2-23X
DK-78K223XL
IK-78K223XL
EB-78230-PC
IE-78230-R
EP-78230LQ-R
/lPD78P238LQ
/lPD78237GC
EK-78K2-23X
DK-78K223XGC
IK-78K223XGC
EB-78230-PC
IE-78230-R
EP-78230GC-R
(Note 10)
/lPD78237GJ
EK-78K2-23X
DK-78K223XGJ
IK-78K223XGJ
EB-78230-PC
IE-78230-R
EP-78230GJ-R
(Note 8)
/lPD78237LQ
EK-78K2-23X
DK-78K223XLQ
IK-78K223XLQ
EB-78230-PC
IE-78230-R
EP-78230LQ-R
/lPD78238GC
EK-78K2-23X
DK-78K223XGC
IK-78K223XGC
EB-78230-PC
IE-78230-R
EP-78230GC-R
(Note 10)
/lPD78P238GC
/lPD78238GJ
EK-78K2-23X
DK-78K223XGJ
IK·78K2·
23XGJ
EB-78230·PC
IE·78230·R
Ep·78230GJ-R
(Note 8)
IlPD78P238GJ/KF
/lPD78238LQ
EK·78K2·23X
DK·78K2·
23XLQ
IK·78K2·
23XLQ
EB-78230·PC
IE-78230-R
Ep·78230LQ·R
/lPD78P238LQ
IlPD78P238GC
EK-78K2·23X
DK-78K2·
23XGC
IK·78K223XGC
EB-78230-PC
IE-78230-R
Ep·78230GC-R
(Note 10)
IlPD78P238GJ
EK·78K2-23X
DK·78K223XGJ
IK·78K2·
23XGJ
EB-78230·PC
IE-78230-R
EP·78230GJ-R
(Note 8)
IlPD78P238KF
EK-78K2·23X
DK·78K223XGJ
IK-78K223XGJ
EB·78230·PC
IE·78230-R
Ep·78230GJ-R
(Note 8)
/lPD78P238LQ
EK·78K2·23X
DK·78K2·
23XL
IK·78K2·
23XL
EB·78230-PC
IE-78230·R
EP·78230LQ·R
IlPD78243CW
EK-78K2·24X
DK·78K2·
24XCW
IK-78K224XCW
EB-78240·PC
IE·78240·R
EP-78240CW·R
/lPD78243GC·
AB8
EK-78K2·24X
DK·78K224XGC
IK·78K2·
24XGC
EB-78240·PC
IE·78240·R
Ep·78240GC·R
(Note 9)
/lPD78243LP
EK·78K2·24X
DK·78K2·
24XLP
IK·78K2·
24XLP
EB-78240·PC
IE·78240-R
Ep·78240LP-R
/lPD78244CW
EK-78K2·24X
DK·78K224XCW
IK·78K224XCW
EB·78240·PC
IE-78240-R
Ep·78240CW·R
/lPD78244GC
EK-78K2·24X
DK-78K2·
24XGC
IK-78K224XGC
EB·78240-PC
IE·78240·R
EP-78240GC-R
(Note 9)
II
8-15
ttiEC
Development Tools for Micro Products
782xx Series Single-Chip Microcomputers (cont)
Device
(Notes 1, 2)
Evaluation
Kit
(Note 3)
Designer
Kit
(Note 4)
Emulator
Kit
(Note 5)
J.lPD78244L
EK-78K2-24X
DK-78K224XLP
IK-78K224XLP
Low-End
Emulator
Emulation
System
Emulation
Probe
EB-78240-PC
IE-78240-A
EP-78240LP-A
Notes:
(1)
(2)
The following software packages are available for the 782xx
Series.
RA78K2 Aelocatable Assembler Package: AA78K2-D52
(MS-DOSI&l
ST78K2 Structured Assembler Preprocessor: provided with
RA78K2
CC78K2 C-Compiler package: CC78K2-D52 (MS-DOS)
Packages:
CW
OW
G36
GC
GC
GC-AB8
GJ
GJ
GQ
KF
L
LP
LQ
(3)
64-pin plastic shrink DIP
64-pin ceramic shrink DIP with window
64-pin plastic QUIP (J.IPD78213/214)
64-pin plastic QFP (J.IPD782121213/214/P2141244)
80-pln plastic QFP (J.IPD782331234/2371238/P238)
64-pin plastic QFP
94-pin plastic QFP (J.IPD782201224/P2241233/234/
2371238/P238)
74-pin plastic QFP (J.IPD7821212131214/P214)
64-pin plastic QUIP (J.IPD782121P214)
94-pln ceramic LCC with window
68-pin PLCC (J.IPD78213/214/P214L)
84-pln PLCC (J.IPD78220/224/P224L)
68-pin PLCC
84-pln PLCC
The J.lP.D782xx Evaluation Kit contains the appropriate DDB78K2-2xx Evaluation Board for the part selected, the RA78K2
Aelocatable Assembler Package, and the ST78K2 Structured
Assembler Preprocessor.
EPROM/OTP
Device (Note 6)
(4)
The J.lPD782xx Designer Kit contains the appropriate EB782xx-PC low-end emulator and emulation probe for the part
selected, the RA78K2 Aelocatable Assembler Package, and the
ST78K2 Structured Assembler Preprocessor.
(5)
The J.lPD782xx Emulator Kit contains the appropriate IE-782xx
system and emulation probe for the part selected, the RA78K2
Relocatable Assembler Package, and the ST78K2 Structured
Assembler Preprocessor.
(6)
All EPAOM/OTP devices can be programmed using the NEC
PG-1500. Refer to the PG-1500 Programming Socket Adapter
Selection Guide for the appropriate programming adapter.
(7)
The EP-78240GJ-R Emulation Probe is shipped with one EV9200G-74, a 74-pin LCC socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
in sets of five.
(8)
The EP-78230GJ-R Emulation Probe Is shipped with one EV9200G-94, a 94-pin LCC socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
in sets of five.
(9)
The EP-78240GC-R Emulation Probe Is shipped with one EV9200GC-64, a 64-pin LCC socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
In sets of five.
(10) The EP-78230GC-R Emulation Probe is shipped with one EV9200GC-80, an 80-pln LC C socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
in sets of five.
783xx Series Sing Ie-Chip Microcomputers
Emulator Kit
(Note 4)
Evaluation
Board
Emulation
System
J.lPD78310ACW
IK-78K3-31XACW
(Note 6)
oDK-7831OA
IE-78310A-R
EP-78310CW
(Note 7)
J.lPD78310AGF3BE
IK-78K3-31XAGF
DDK-78310A
IE-76310A-A
EP-76310GF (Note 8)
J.lPD78310AGQ..36
IK-78K3-31 XACW
(Note 6)
DDK-78310A
IE-78310A-A
EP-78310GQ
(Note 9)
J.lPD78310AL
IK-78K3-31 XAL
DDK-78310A
IE-78310A-A
EP-78310L
J.lPD78312ACW
IK-78K3-31 XACW
(Note 6)
DDK-78310A
lE-78310A-R
EP-78310CW
(Note 7)
J.lPD78P312ACW/DW
J.lPD78312AGF
IK-78K3-31XAGF
DDK-78310A
IE-78310A-R
EP-78310GF (Note 8)
J.lPD78P312AGF
J.lPD78312AGQ
IK-78K3-31XACW
(Note 6)
DDK-78310A
IE-78310A-R
EP-76310GQ
(Note 9)
J.lPD78P312AGQfRQ
J.lPD78312AL
IK-78K3-31XAL
DDK-78310A
IE-78310A-A
EP-78310L
J.lPD78P312AL
J.lPD78P312ACW
IK-78K3-31XACW
(Note 6)
DDK-78310A
IE-78310A-A
EP-78310CW
(Note 7)
J.lPD78P312ADW
IK-78K3-31 XACW
(Note 6)
DDK-78310A
IE-78310A-R
EP-78310CW
(Note 7)
Device (Notes 1, 2)
8-16
Evaluation Kit
(Note 3)
Emulation Probe
EPROM/OTP
Device (Note 5)
NEe
Development Tools for Micro Products
783xx Series Single-Chip Microcomputers (cont)
Emulator Kit
(Note 4)
Evaluation
Board
Emulation
System
IIPD78P312AGF
IK-78K3-31XAGF
DDK-78310A
IE-78310A-R
EP-78310GF
(Note 8)
IIPD78P312AGQ-36
IK-78K3-31XACW
(Note 6)
DDK-78310A
IE-78310A-R
EP-78310GQ
(Note 9)
IIPD78P312AL
IK-78K3-31XAL
DDK-78310A
IE-78310A-R
EP-78310L
IIPD78P312ARQ
IK-78K3-31XACW
(Note 6)
DDK-78310A
IE-78310A-R
EP-78310GQ
(Note 9)
Device (Notes 1, 2)
Evaluation Kit
(Note 3)
Emulation Probe
EPROM/OTP
Device (Note 5)
liP D78320GJ
EK-78K3-32X
IK-78K3-32XGJ
EB-78320PC
IE-78327-R
EP-78320GJ-R
(Note 10)
IIPD78320L
EK-78K3-32X
IK-78K3-32XL
EB-78320PC
IE-78327-R
EP-78320L-R
liP D78322GJ
EK-78K3-32X
IK-78K3-32XGJ
EB-78320PC
IE-78327-R
EP-78320GJ-R
(Note 10)
IIPD78P322GJ/KD
IIPD78322L
EK-78K3-32X
IK-78K3-32XL
EB-78320PC
IE-78327-R
EP-78320L-R
IIPD78P322L/KC
IIPD78P322GJ
EK-78K3-32X
IK-78K3-32XGJ
EB-78320PC
IE-78327-R
EP-78320GJ-R
(Note 10)
IIPD78P322KC
EK-78K3-32X
IK-78K3-32XL
EB-78320PC
IE-78327-R
EP-78320L-R
IIPD783P322KD
EK-78K3-32X
IK-78K3-32XGJ
EB-78320PC
IE-78327-R
EP-78320GJ-R
(Note 10)
IIPD78P322L
EK-78K3-32X
IK-78K3-32XL
EB-78320PC
IE-78327-R
EP-78320L-R
IIPD78330GJ
EK-78K3-33X
IK-78K3-33XGJ
EB-78330PC
IE-78330-R
EP-78330GJ-R
(Note 11)
IIPD78330LQ
EK-78K3-33X
IK-78K3-33XLQ
EB-78330PC
IE-78330-R
EP-78330LQ-R
IIPD78334GJ
EK-78K3-33X
IK-78K3-33XGJ
EB-78330PC
IE-78330-R
EP-78330GJ-R
(Note 11)
IIPD78P334GJ
IIPD78334LQ
EK-78K3-33X
IK-78K3-33XLQ
EB-78330PC
IE-78330-R
EP-78330LQ-R
IIPD78P334LQ/KE
IIPD78P334GJ
EK-78K3-33X
IK-78K3-33XGJ
EB-78330PC
IE-78330-R
EP-78330GJ-R
(Note 11)
IIPD78P334KE
EK-78K3-33X
IK-78K3-33XLQ
EB-78330PC
IE-78330-R
EP-78330LQ-R
IIPD78P334LQ
EK-78K3-33X
IK-78K3-33XLQ
E8-78330PC
IE-78330-R
EP-78330LQ-R
D
Notes:
(1)
The following software packages are available for the IIPD783xx
series:
RA78K3 Relocatable Assembler Package: RA78K3-D52
(MS-DOS~
ST78K3 Structured Assembler Preprocessor: provided with
RA78K3
CC78K3 C-C,ompiler Package: CC78K3-D52 (MS-DOS)
8-17
NEe
Development Tools for Micro Products
(2)
Packages:
ON
OW
GF-3BE
GJ-5BG
GJ-5BJ
GQ-36
KC
KD
KE
L
LQ
R
64-pin plastic shrink DIP
64-pin ceramic shrink DIP with window
64-pln plastic QFP (resin thickness 2.7 mm)
94-pin plastic QFP
74-pln plastic QFP (20 mm x 20 mm)
64-pln plastic QUIP
68-pin ceramic LCC with window
74-pin ceramic LCC with window
84-pln ceramic LCC with window
44-pin PLCC (uPD71P301L)
68-pin PLCC
(uPD783l0N3l2NP3l2AL,IlPD78320/322L)
84-pin PLCC
64-pin ceramic QUIP with window
(3)
The IlPD783xx Evaluation Kit conlains the appropriate EB783xx-PC evaluation board for the part selected, the RA78K3
Relocatable Assembler Package, and the ST78K3 Structured
Assembler Preprocessor.
(4)
The IlPD783xx Emulator Kit contains the appropriate IE-783xx
and Emulation Probe for the part selected, the RA78K3 Relocatable Assembler Package, and the ST78K3 Structured Assembler
Preprocessor.
(5)
All EPROM/OTP devices can be programmed using the NEC
PG-1500. Refer to the PG-1500 Programming Socket Adapter
Selection Guide for the appropriate programming adapter.
(6)
The IK-78K3-31XACW Is shipped with the emulation probes for
both the 64-pln shrink DIP and 64-pin QUIP packages.
(7)
The emUlation probe for the 64-pin shrink DIP package (EP78310CW) is supplied with the IE.
(8)
The EP-78310GF Emulation Probe is shipped with one EV9200G-64, a 64-pin LCC socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
In sets of five.
(9)
The emulation probe for the 64-pin QUIP package (EP-78310GQ)
is supplied with the IE.
(10) The EP-78320GJ-R Emulation Probe Is shipped with one EV9200G-74, a 74-pin LCC socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
in sets of five.
(11) The EP-78330GJ-R Emulation Probe is shipped with one EV9200G-94, a 94-pin LCC socket with the footprint of the QFP
package. Additional sockets are available as replacement parts
in sets of five.
DSP and Speech Products
Device
(Note 7)
Emulator
Evaluation
Board
Assembler
(Note 1)
Simulator
(Note 2)
EPROM/OTP
Device
PG-1S00 Adapter
(Note 3)
(Note 5)
IlPD77P2OD
EVAKIT-772OB
ASM77
SM77C25
IlPD77C2OAC
EVAKIT-7720B
ASM77
SM77C25
IlPD77P2OD
IlPD77C2OAGW
EVAKIT-772OB
ASM77
SM77C25
IlPD77P2OD
IlPD77C20AL
EVAKIT-772OB
ASM77
SM77C25
IlPD77C20ALK
EVAKIT-772OB
ASM77
SM77C25
IlPD77220L
EVAKIT-77230
RA77230
SM77230,
SIM77230
IlPD77220R
EVAKIT-77230
RA77230
SM77230,
SIM77230
IlPD77P220L
EVAKIT-77230
RA77230
SM77230
SIM77230
PA-77P22OL
IlPD77P220R
EVAKIT-77230
RA77230
SM77230,
SIM77230
PA-77P230R
IlPD77230AR
EVAKIT-77230
RA77230
SM77230,
SIM77230
IlPD77P230R
PA-77P230R
IlPD77230AR-003
EVAKIT-77230
DDK-77230
RA77230
SM77230,
SIM77230
IlPD77P230R
PA-77P230R
IlPD77P230AR
EVAKIT-77230
DDK-77230
RA77230
SM77230,
SIM77230
IlPD77P230R
PA-77P230R
IlPD77240R
IE-77240
IE-77240
RA77240
SIM77240
IlPD77C25C
EVAKIT-77C25
RA77C25
SM77C25
IlPD77P25C/D
PA-77P25C
IlPD77C25GW
EVAKIT-77C25
RA77C25
SM77C25
IlPD77P25GW
IlPD77C25L
EVAKIT-77C25
RA77C25
SM77C25
IlPD77P25L
IlPD77P25C
EVAKIT-77C25
RA77C25
SM77C25
PA-77P25C
IlPD77P25D
EVAKIT-77C25
RA77C25
SM77C25
PA-77P25C
IlPD77P25GW
EVAKIT-77C25
RA77C25
SM77C25
PA-77P25GW
8-18
DDK-77220
(Note 8)
DDK-77220
(Note 8)
IlPD77P220R (EPROM)
IlPD77P220L (OTP)
PA-77P230R
PA-77P25L
NEe
Development Tools for Micro Products
DSP and Speech Products (cant)
Device
(Note 7)
Emulator
Evaluation
Board
Assembler
(Note 1)
Simulator
(Note 2)
j./PD77P25L
EVAKrr-77C25
j./PD7755C
NV-300 System
(Note 9)
EB-7759
RA77C25
SM77C25
j./PD77P56CR
PA-77P56C
j./PD7755G
NV-300 System
(Note 9)
EB-775/NV-310
(Note 6)
j./PD77P56G
(Note 10)
PA-77P56C
j./PD7756C
NV-300 System
(Note 9)
EB-775/NV-310
IlPD77P56CR
(Note 10)
PA-77P56C
j./PD7756G
NV-300 System
(Note 9)
EB-775/NV-310
(Note 6)
j./PD77P56G
(Note 10)
PA-77P56C
j./PD77P56CR
NV-300 System
(Note 9)
EB-775/NV-310
PA-77P56C
j./PD77P56G
NV-300 System
(Note 9)
EB-775/NV-310
(Note 6)
PA-77P56C
j./PD7757C
NV-300 System
(Note 9)
EB-775/NV-310
j./PD7757G
NV-300 System
(Note 9)
EB-775/NV-310
(Note 6)
j./PD7759C
NV-300 System
(Note 9)
EB-775/NV-310·
j./PD7759GC
NV-300 System
(Note 9)
EB-775/NV-310
j./PD77501 GC
NV-300 System
(Note 9)
j./PD77810L
IE-77810
RA77810
j./PD77810R
IE-77810
RA77810
Notes:
(1)
The following assemblers are available:
ASM77-D52
Assembler for 7720 (MS-DOSGil
RA77C25-D52
Assembler for 77C25 (MS-DOS)
RA77C25-VVT1 Assembler for 77C25 C>/AX/VMS'")
RA77230-D52
Assembler for 77230 (MS-DOS)
RA77230-VVTl Assembler for 77230 C>/AX/VMS)
RA77230-VXTl
Assembler for 77230 C>/AX/UNIX~ 4.2 BSD or
Ultrix'")
(2)
The following simulators are available:
SIM77230-VVTl Simulator for 77230 C>/AX/UNIX)
SIM77230-VXTl Simulator for 77230 C>/AX/UNIX~ 4.2 BSD or
Ultrix)
SM77C25
Simulator for 77C25 (IBM-PC)
Simulator for 77220, 77230 (IBM-PC)
SM77230
Simulator for 77240 (IBM-PC)
SIM77240
(3)
By using the specified adapter, the NEC PG-1500 EPROM
programmer can be used to program the EPROM/OTP device.
(4)
Please check with your NEC Sales Representative on the availability of a PLCC emulation probe.
(5)
The IlPD77P20D can be programmed using the EVAKlT-772OB.
(6)
The EB-775 comes with an emulation probe for only the 18-pin
DIP.
(7)
Packages:
C
D
G
GC
L
LK
R
GW
EPROM/OTP
Device
PG-1500 Adapter
(Note 3)
PA-77P25L
18, 28, or 40-pin plastic DIP.
28-pin ceramic DIP
24-pin plastic SOP
52-pin plastic QFP
44-or 68-pin PLCC
28-pin PLCC
68-pin ceramic PGA
32-pin SOP
(8)
DDK-77220 is supported by Hypersignal Workstation/Window, a
DSP software platform from Hyperception.
(g)
The NV-300 current version is Version 3.0. An upgrade from
previous versions (hardware and software) is available under the
designation NV-30L
(10) The NV-310 emulation board includes a simple 77P56 programmer module.
8-19
NEe
Development Tools for Micro Products
PG·1500 Programming Adapters
Target Chip
Socket Adapter
(Note 1)
PG·1500 Programming Adapters (cont)
Adapter Module
(Note 2)
Socket Adapter
(Note 1)
Adapter Module
(Note 2)
jlPD75P402C
(Note 3)
OZlA Board
OZlA Board
jlPD75P402CT
PA-75P402CT
OZlA Board
Standard 27xxx EPROM Devices
jlPD27256 (21 V)
Target Chip
jlPD27256A (12.5 V)
027ABoard
jlPD75P402GB
PA-75P402GB
027A Board
jlPD27C256 (21 V)
OZlA Board
jlPD75P516GF
PA-75P516GF
04A Board
jlPD27C256A (12.5 V)
027A Board
jlPD75P516K
PA-75P516K
04A Board
jlPD27C512
027ABoard
7Bxx Series Devices
jlPD27Cl000
OZlA Board
jlPD78CP14CW
PA-78CPI4CW
OZlA Board
jlPD27Cl00l
027A Board
jlPD78CP14DW
PA-78CPI4CW
OZlA Board
jlPD27Cl024
OZlA Board
jlPD78CPI4G36
PA-78CPI4GQ
OZlA Board
027A Board
jlPD78CP14GF
PA-78CPI4GF
PA-75P54CS
04A Board
jlPD78CP14L
PA-78CPI4L
027A Board
. PA-75P54CS
04A Board
jlPD78CP14R
PA-78CPI4GQ
027A Board
jlPD75P56CS
PA-75P56CS
04A Board
jlPD78CP18CW
PA-78CP14CW
OZlA Board
jlPD75P56G
PA-75P56CS
04A Board
/lPD78CPI8GQ
PA-78CPI4GQ
OZlA Board
jlPD75P6~CS
PA-75P54CS
04A Board
jlPD78CP18GF
PA-78CPI4GF
027A Board
jlPD78CP18KB
PA-78CPI4KB
OZlA Board
75xx Series Devices
jlPD75P54CS
jlPD75P54G
jlPD75P64G
PA-75P54CS
04A Board
jlPD75P66CS
PA-75P56CS
04A Board
7B2xx Series Devices
jlPD75P66G
PA-75P56CS
04A Board
/lPD78P214CW
PA-78P214CW
OZlA Board
jlPD78P214GC
PA-78P214GC
OZlA Board
75xxx Series Devices
jlPD75POO8CU
PA-75POO8CU
04A Board
jlPD78P214GJ
PA-78P214GJ
OZlA Board
jlPD75POO8GB
PA-75POO8CU
04A Board
jlPD78P214GQ
PA-78P214GQ
OZlA Board
/lPD75P036CW
PA-75P036CW
04A Board
/lPD78P214L
PA-78P214L
027ABoard
jlPD75P036GC
PA-75P036GC
04A Board
jlPD78P224GJ
PA-78P224GJ
OZlA Board
jlPD75Pl08BCW
PA-75Pl08CW
04A Board
jlPD78P224L
PA-78P224L
027A Board
PA-78P238GC
027A Board
jlPD75Pl08CW
PA-75Pl08CW
04A Board
/lPD78P236GC
jlPD75Pl08DW
PA-75Pl08CW
04A Board
/lPD78P238GJ
PA-78P236GJ
027A Board
PA-78P238KF
OZlA Board
PA-78P238LQ
027A Board
027A Board
jlPD75Pl08BGF
PA-75P116GF
04A Board
jlPD78P236KF
jlPD75Pl08G
PA-75Pl08G
04A Board
jlPD78P238LQ
jlPD75P116CW
PA-75Pl08CW
04A Board
783xx Series Devices
jlPD75P116GF
PA-75P116GF
04A Board
jlPD78P312ACW
PA-78P312CW
jlPD75P216ACW
PA-75P216ACW
04A Board
jlPD78P312ADW
PA-78P312CW
027A Board
jlPD75P218CW
PA-75P216ACW
04A Board
jlPD78P312AGF
PA-78P312GF
OZlA Board
jlPD75P218GF
PA-75P218GF
04A Board
jlPD78P312AGQ
PA-78P312GQ
027A Board
jlPD75P218KB
PA-75P218KB
04A Board
jlPD78P312AL
PA-78P312L
027A Board
jlPD75P308GF
PA-75P308GF
04A Board
jlPD78P312ARQ
PA-78P312GQ
027A Board
jlPD75P308K
PA-75P308K
04A Board
jlPD78P322GJ
PA-78P322GJ
OZlA Board
jlPD75P316GF
PA-75P308GF
04A Board
/lPD78P322KC
PA-78P322KC
027A Board
jlPD75P316AGF
PA-75P308GF
04A Board
jlPD78P322KD
PA-78P322KD
027A Board
jlPD75P316AK
PA-75P308K
04A Board
jlPD78P322L
PA-78P322L
027A Board
jlPD75P328GC
PA-75P328GC
04A Board
jlPD78P334GJ
PA-78P334GJ
OZlA Board
8-20
NEe
Development Tools for Micro Products
PG-1500 Programming Adapters (cont)
Target Chip
Socket Adapter
(Note 1)
Adapter Module
(Note 2)
IlPD78P334KE
PA-78P334KE
OVA Board
IlPD78P334LQ
PA-78P334LQ
OVA Board
PA-70P322L
027A Board
V-Series Devices
IlPD70P322K
Digital Signal Processors
IlPD77P56CR
PA-77P56C
04A Board
IlPD77P56G
PA-77P56C
04A Board
IlPD77P25C
PA-77P25C
027A Board
IlPD77P25D
PA-77P25C
027A Board
IlPD77P220R
PA-77P230R
OZTA Board
IlPD77P230R
PA-77P230R
OZTA Board
Notes:
(1)
Adapters must be purchased separately.
(2)
The 27A and 04AAdapter Modules are shipped with the PG-l500.
(3)
The IlPD75P402C does not require a programming socket
adapter. It can be plugged directly into the OVA board.
II
8-21
Development Tools for Micro Products
8-22
NEe
NEe
Telecom/ISDN Devices
lit
Telecom/ISDN Devices
Section 9. Telecom/ISDN Devices
CMOS Combos ................................................ 9-3
SLlCs .......................................................... 9-3
POTS ......................................................... 9-4
Crosspoint Switches .............................•.............. 9-4
ISDN Devices .................................................. 9-4
9-2
NEe
t\fEC
Telecom/ISDN Devices
CMOS Combos
Companding Law
Sync/Async
Operation
Signaling
Loopback
Test
One master clock; 1.536 or
1.544 or 2.046 MHz
A- or /l-Iaw
Sync only
No
No
20-pin CERDIP
/lPD9514
(Direct replacement
for Intel 29C14/2914)
Separate transmit!
receive clock
A- or /l-Iaw
Both
Yes
Yes
24-pin CERDIP
/lPD9516
(Direct replacement
for Intel 29C16/2916)
2.048-MHz master clock
/l-Iaw
Sync only
No
No
16-pin CERDIP
/lPD9517
(Direct replacement
for Intel 29C17/2917)
2.048-MHz master clock
A-law
Sync only
No
No
16-pin CERDIP
/lPD9601
(Compatible
replacement for
Hitachi 44233C/
44237C)
On-chip PLL
A-law
Both
No
Yes
16-pin CERDIP
/lPD9602
(Compatible
replacement for
Hitachi 44234C/
44238C)
On-chip PLL
/l-Iaw
Both
No
Yes
16-pin CERDIP
/lPD9604
Digital gain setting (Note 1)
/l-Iaw
Both
No
Yes
16-pin CERDIP
/lPD9605
Digital gain setting (Note 1)
A-law
Both
No
Yes
16-pin CERDIP
/lPD9621
PLCC version of /lPD9601
A-law
Both
No
Yes
18-pin PLCC
/lPD9622
PLCC version of /lPD9602
/l-Iaw
Both
No
Yes
18-pin PLCC
JlPD9624
PLCC version of JlPD9604
JI-Iaw
Both
No
Yes
18-pin PLCC
JlPD9625
PLCC version of JlPD9605
A-law
Both
No
Yes
18-pin PLCC
Part No.
Description
/lPD9513
(Direct replacement
for Intel 29C13/2913)
Package
Notes:
(1)
From 0 to 15 dB In O.5-dB steps
SLiCs
Part No.
Description
Key Features
Package
JlPC7059
-48 V SLIC; constant resistance feed
Battery feed, supervision, 2-wire to 4-wire conversion
28-pin LCC
28-pin LCC
JlPC7062
-24 V SLIC for key telephone
Battery feed, supervision, 2-wire to 4-wire conversion
JlPC7069
-48 V SLlC; constant current feed
Battery feed, supervision, 2-wire to 4-wlre conversion
28-pin LCC
JlPC7051
PLCC version of JlPC7059
Battery feed, supervision, 2-wire to 4-wire conversion
32-pin PLCC
JlPC7063
PLCC version of pPC7062
Battery feed, supervision, 2-wire to 4-wire conversion
32-pin PLCC
JlPC7061
PLCC version of JlPC7069
Battery feed, supervision, 2-wire to 4-wire conversion
32-pin PLCC
9-3
II
NEe
Telecom/ISDN Devices
POTS
Part No.
Description
Key Features
Package
pPD9706
Repertory tone/pulse dialer
Switchable tone/pulse, one·touch dialing,
abbreviated dialing, 32·digit redial, loudspeaker
hearing mode function
28·pin SOP or shrink
DIP
Crosspoint Switches
Part No.
Description
Key Features
Package
pPD22100
4 x 4 analog crosspoint switch
16 crosspoint switches with control memory
16·pin DIP
pPD22148
4 x 8 analog crosspoint switch
32 cros.spoint switches with control memory
24·pin DIP
ISDN Devices
Part No.
Description
Key Features
Package
pPD98001
Digital line interface controller
(DUC)
2·wire TCM transceiver, AMI·line code, 2.6·km loop
length, + 5·volt single supply voltage
64·pin shrink DIP or
68-pin PLCC
pPD98201
SIT interface transceiver
4-wire interface, conforms to CCITT 1.430
recommendations, multiframing capability,
collision detection/priority control, loopback test
modes, +5-volt ~ingle supply voltage
64-pin flat
pPD72305
LAP-D controller
Performs all layer 2 processing, on-chip DMA,
supports both basic and primary access rate
64-pin shrink DIP or
68-pin PLCC
pPD72107
LAP-B controller
Fully implemented LAP-B protocol, on-chip DMA,
NRZ/NRZI coding
pPD72307
Signaling system #7 controller
Supports CCITT 0.703 recommendation, on.chip
DMA, 4.8-64 kb/s serial baud rate
pPD98202
S·interface for TE
4·wire interface, conforms to CCITT 1.430, CPU
interface, HDLC functions, + 5-volt single supply
voltage
28-pin PLCC or
plastic DIP
pPD98203
S-interface for N17LT
4-wire interface, conforms to CCITT 1.430,
multiframing capability, + 5-volt single supply
voltage
20-pin plastic DIP
9-4
NEe
ASIC Products
a
i
ASIC Products
Section 10. ASIC Products
ECl-3B, -4, -4A ............................................... 10-3
CMOS-4 .•.................................................... 10-4
CMOS-4A, -4L. ................................................ 10-4
CMOS-4R ... , ...•............ '" .............................. 10-5
CMOS-5, -SU, -5V .............................................. 10-5
CMOS-6, -SA ................................................. 10-6
CMOS-7 .•...•................................................ 10-6
BiCMOS-4, -4A, -5 ............................................. 10-7
SC-5 Standard Cell and CB-C7 Cell-Based CMOS ASICs.......... 10-8
10-2
NEe
NEe
ASIC Products
Eel-3B, -4, -4A
Device
Delay Time (ns)
Maximum
Available Gates
Internal Gate
Number of Buffers
Output Buffer
Input Buffer
Output
Input
Power Dissipation
1.9 mW/gate
ECL-3B (100K, 10KH, TTL) (Notes 3, 4)
pPB6323
2400
0.7
1.6 (ECL)
4.8 (TTL)
0.7 (ECL
0.9 (TTL)
55
120
pPB6341
4000
0.7
1.6 (ECL)
4.8 (TTL)
0.7 (ECL
0.9 (TTL)
72
156
pPB6351
5000
0.7
1.6 (ECl)
4.8 (TTL)
0.7 (ECL
0.9 (TTL)
80
172
ECL-4 (100K, 10KH) (Notes 1, 2, 5)
pPB6303
600
0.22
0.77
0.23
48
88
pPB6312
1200
0.22
0.77
0.23
48
108
3.2 mW/gate
ECL-4A (1ooK, 10KH, TTL) (Notes 3, 6)
pPB63020
2400
0.09
0.8 (ECl)
4.0 (TTL)
0.3 (ECl)
0.7 (TTL)
60
102
pPB63040
4000
0.09
0.8 (ECL)
4.0 (TTL)
0.3 (ECL)
0.7 (TTL)
84
140
pPB63060
6000
0.09
0.8 (ECL)
4.0 (TTL)
0.3 (ECl)
0.7 (TTL)
90
174
pPB63080
8000
0.09
0.8 (ECL)
4.0 (TTL)
0.3 (ECL)
0.7 (TTL)
108
200
pPB63100
10,000
0.09
0.8 (ECl)
4.0 (TTL)
0.3 (ECl)
0.7 (TTL)
120
236
Notes:
(6)
ECL-4A: number 01 maoros = 173.
(1)
Power source: -4.5 V :1:10% (100K).
(7)
Ambient temperature: 0 to + 700C.
(2)
Power source: -5.2 V :1:10% (10KH).
(8)
Teohnology: advanced bipolar process.
(3)
Power souroe: -4.5 V :1:0.3 V (100K); -5.2 V :1:5% (10KH);
+5 V :1:5% (TTL).
(9)
(4)
ECL-3B: number 01 macros
Gate delay loading
ECL-3B, -4: FlO = 3, L = 3 mm
ECl-4A: FlO = 1; L = 0 mm.
(5)
ECL-4: number 01 macros = 93.
= 72.
2.7 mW/gate
10-3
NEe
ASIC Products
CMOS-4
Delay Time (ns)
Maximum
Device
Available Gates
Number of Buffers
Internal Gate
Output Buffer
Input Buffer
Output
Input
Power Dissipation
15 pW/gate/MHz
CMOS-4 (1.5-micron)
pPD65022
2128
1.4
4.2
2
84
84
pPD65031
3575
1.4
4.2
2
108
108
pPD65042
4727
1.4
4.2
2
124
124
pPD65050
5742
1.4
4.2
2
142
142
pPD65070
7164
1.4
4.2
2
152
152
pPD65081
8510
1.4
4.2
2
180
180
pPD65101
10,496
1.4
4.2
2
198
198
pPD65150
14,943
1.4
4.2
2
234
234
pPD65200
19,551
1.4
4.2
2
266
266
Notes:
(1)
Number of macros: 180
(2)
Ambient temperature: -40 to
(3)
Power source: 5 V ±10% (5V ±5% for TTL Interface)
+ 85·C
(4)
InpuVoutput interface: TTL/CMOS compatible
(5)
Technology: silicon-gate CMOS, two-layer AI metallization
(6)
FlO
= 3; L = 3 mm
CMOS-4A, -4L
Device
Maximum
Available Gates
Delay Time (ns)
Internal Gate
Number of Buffers
Output Buffer
Input Buffer
Output
Input
Power Dissipation
15 pW/gate/MHz
CMOS-4A (1.5-micron)
pPD65005
320
1.4
4
2
54
54
pPD65006
504
1.4
4
2
62
62
pPD65012
1088
1.4
4
2
82
82
pPD65013
1584
1.4
4
2
100
100
pPD65024
2360
1.4
4
2
108
108
8
62
62
CMOS-4L (1.5-micron) Low-voltage product, VDD
= 1.0 to 3.6 V
10
22
1656
10
22
8
62
82
2457
10
22
8
100
100
3360
10
22
8
106
106
pPD65045
4320
10
22
8
120
120
pPD65052
5632
10
22
8
138
138
pPD65007
pPD65014
pPD65026
pPD65033
858
Notes:
(1)
Number of macros: 160
(2)
Ambient temperature: 0 to
(3)
Power source: Voo = 1.0 to 3.6 V (above ratings at 1.5 V)
10-4
+ 70·C
3 pW/gate/MHz
(4)
InpuVoutput interface: CMOS compatible
(5)
Technology: silicon-gate CMOS, two-layer AI metallization
(6)
FlO = 3; L = 3 mm.
tt{EC
ASIC Products
CMOS-4R
Maximum
Available Gates
Device
Number of Buffers
Delay Time (ns)
Internal Gate
Output Buffer
Input Buffer
Output
Input
Power
Dissipation
RAM (Bits)
CMOS-4R (1.S-micron)
JlPD65023
2240
1.4
4.2
2
120
120
15 JlW/gate/MHz
2304
JlPD65043
4440
1.4
4.2
2
180
180
15 JlW/gate/MHz
4608
Input
Power
Dissipation
RAM (Bits)
12 JlW/gate/MHz
Notes:
(1)
Number of macros: 180
(2)
Ambient temperature: -40 to + 85'C
(3)
Power source: 5 V ±5% (TTL level); 5 V ±10% (CMOS level)
(4)
Technology: silicon-gate CMOS, two-layer AI metallization
(5)
F/O
= 3; L = 3 mm.
CMOS-5, -5U, -5V
Device
Maximum
Available Gates
Delay Time (ns)
Inter nal Gate
Number of Buffers
Output Buffer
Input Buffer
Output
CMOS-S (1.2-micron) Two-layer metallization
JlPD65025
2016
1.0
2.5
2.0
88
88
JlPD65032
3366
1.0
2.5
2.0
106
106
JlPD65044
4400
1.0
2.5
2.0
120
120
JlPD65051
5292
1.0
2.5
2.0
132
132
JlPD65061
6348
1.0
2.5
2.0
144
144
JlPD65071
7500
1.0
2.5
2.0
156
156
JlPD65082
8748
1.0
2.5
2.0
164
164
JlPD65103
10,800
1.0
2.5
2.0
180
180
JlPD65140
14,256
1.0
2.5
2.0
212
212
JlPD65180
18,144
1.0
2.5
2.0
244
244
JlPD65240
24,000
1.0
2.5
2.0
284
284
III
CMOS-SU (1.2-micron) TWO-layer metallization
JlPD65015
1152
0.5
2.5
1.3
94
94
JlPD65016
1680
0.5
2.5
1.3
108
108
JlPD65029
2340
0.5
2.5
1.3
120
120
12 JlW/gate/MHz
CMOS-SV (1.2-micron) Two-layer metallization; high I/O count
JlPD65027
2340
1.0
2.5
1.5
116
116
JlPD65034
3366
1.0
2.5
1.5
128
128
JlPD65046
4400
1.0
2.5
1.5
142
142
JlPD65053
5292
1.0
2.5
1.5
142
142
JlPD65062
6348
1.0
2.5
1.5
142
142
JlPD65072
7500
1.0
2.5
1.5
142
142
12 JlW/gate/MHz
Notes:
(5)
Technology: silicon-gate CMOS
(1)
Number of macros: 310
(6)
F/O
(2)
Ambient temperature: -40 to +85'C
(3)
Power source: 5 V ±10% (5 V ±5% for TTL)
(4)
InpuVoutput interface: TTL/CMOS compatible
= 2; L = 2 mm.
10-5
NEe
ASIC Products
CMOS-S, -SA
Delay Time (ns)
Maximum
Available Gates
Device
Internal Gate
Output Buffer
Number 01 Buffers
Input Bulfer
Output
Input
Power Dissipation
12/lW/gate/MHz
CMOS-6 (1.0-micron) Three-layer metallization; channelless sea-of-gate array
/lPD65658
42,240
0.4
2.0
1.0
220
220
/lPD65664
72,576
0.4
2.0
1.0
288
288
/lPD65672
119,232
0.4
2.0
1.0
368
368
/lPD65676
117,408
0.4
2.0
1.0
446
448
CMOS-SA (1.0-micron) Three-layer metallization; channelless sea-ol-gate array
/lPD65630
5376
0.4
2.0
1.0
84
84
/lPD65636
8000
0.4
2.0
1.0
100
100
/lPD65640
11,520
0.4
2.0
1.0
120
120
/lPD65646
16,240
0.4
2.0
1.0
140
140
/lPD65650
21,120
0.4
2.0
1.0
160
160
/lPD65654
30,720
0.4
2.0
1.0
192
192
12/lW/gate/MHz
Notes:
(1)
Number of maoros: 310
(2)
Ambient temperature: -40 to
(3)
Power souroe: 5 V ±10% (5 V ±5% for TTL)
+ 85°C
(4)
InpuVoutput interfaoe: TTL/CMOS oompatible
(5)
Teohnology: sllioon-gate CMOS
(6)
F/O
= 2; L = 2 mm.
CMOS-7
Number of Buffers
Delay Time (ns)
Maximum
Available Gates
Device
Internal Gate
Output Buffer
Input Buffer
Output
Input
Power Dissipation
6.51JW/gate/MHz
CMOS-7 (0.8-mlcron) Three-layer metallization; channelless sea-ol-gate array
/lPD65762
60,500
0.3
0.8
220
220
/lPD65770
103,680
0.3
1.8
0.8
288
288
/lPD65776
169,280
0.3
1.8
0.8
368
368
/lPD65782
250,880
0.3
1.8
0.8
448
448
Notes:
(1)
Number of maoros: 310
(2)
Ambient temperature: -40 to
(3)
Power sou roe: 5 V ±10% (5 V ±5% for TTL)
+ 85°C
(4)
InpuVoutput interfaoe: TTL/CMOS oompatible
(5)
Teohnology: silioon-gate CMOS
(6)
F/O
10-6
= 2; L = 2 mm.
NEe
ASIC Products
BiCMOS-4, -4A, -5
Maximum
Device
Available Gates
Number of Buffers
Delay Time (ns)
Internal Gate
Output Buffer
Input Buffer
Output
Input
Power Dissipation
18 j./W/gate/MHz
BiCMOS-4 (1.5-micron CMOS and bipolar with fT=4 GHz)
pPD67001
624
0.8
3.0
1.2
64
64
pPD67010
1124
0.8
3.0
1.2
84
84
pPD67020
2248
0.8
3.0
1.2
120
120
pPD67030
3140
0.8
3.0
1.2
140
140
BICMOS-4A (1.5-mlcron CMOS and bipolar with fT=4 GHz)
pPD67060
6372
0.8
3.0
1.2
180
180
pPD67100
10,348
0.8
3.0
1.2
228
228
18 pW/gate/MHz
BiCMOS-5 (1.2-micron CMOS and bipolar with fT=8 GHz)
pPD67021
2208
0.5
1.3 (ECl)
1.9 (TTL)
1.8 (ECl)
0.9 (TTL)
80
80
pPD67031
3240
0.5
1.3 (ECl)
1.9 (TTL)
1.8 (ECl)
0.9 (TTL)
96
96
pPD67050
5320
0.5
1.3 (ECl)
1.9 (TTL)
1.8 (ECl)
0.9 (TTL)
124
124
pPD67070
7216
0.5
1.3 (ECl)
1.9 (TTL)
1.8 (ECl)
0.9 (TTL)
148
148
pPD67101
10,152
0.5
1.3 (ECl)
1.9 (TTL)
1.8 (ECl)
0.9 (TTL)
176
176
pPD67240
24,528
0.5
1.3 (ECl)
1.9 (TTL)
1.8 (ECl)
0.9 (TTL)
272
272
48 pW/gate/MHz
Notes:
(1)
Number of macros: 146; 180 (BiCMOS-5)
(2)
Ambient temperature: 0 to
(3)
Power source:
BiCMOS-4
BiCMOS-4A
BiCMOS-5
CMOS/TTL
5 V :1::10%
5 V :1::10%
5 V :1::5%
+ 85°C; 0 to + 70°C (SiCMOS-5)
ECll0KH
ECll00K
-5.2 V :1::5%
-4.5 V :1::0.3 V
(4)
InpuVoutput interface: CMOS, AlS-TTL (inpuVoutput) and ECl10KH, -lOOK for BiCMOS-5
(5)
F/O
= 3; l = 3 mm
10-7
NEe
ASIC Products
SC-s Standard Cell CMOS ASICs and C B-C7 Cell-Based CMOS ASICs
Delay Time (ns)
Maximum
Available
Gates
Device
Internal
Gate
Output
Buffer
Input
Buffer
Number of
Buffers
Input/Output
Total
Power
Dissipation
RAM
ROM
C B-C7 (O.B-micron CMOS)
pPD94000
5000 to 100,000
0.3
1.8
0.8
348
6.5 JNI/gale/MHz
Up to 64K bits
Up to 512K bits
1.0
2.5
2.0
280
18 pW/gale/MHz
128K bits max
1M bits max
SC-5 (1.2-mlcron CMOS)
pPD93000
2000 to 30,000
Notes:
(1)
Number of macros: 180
(2)
Ambient temperature: -40 to +85°C
(3)
Power source: 5 V ±10% (CMOS); 5 V ±5% (TTL)
(4)
Input/output Interface: TTL/CMOS compatible
(5)
Technology: silicon-gate CMOS, two-layer AI metallization
(6)
CB-C7 ASles: Megafunctions available at initial offering.
Compatible Device
pPD70108H (V20H)*
pP D70116H (V30H) *
Function
8-bit microprocessor
16·bit microprocessor
pPD72065B
pPD72020
pPD71037
pPD71051
Floppy-disk controller
Graphics display controller
Programmable DMA controller
Serial interface
pPD71054
pPD71055
pPD71059
pPD4991A
Programmable timer/counter
Parallel interface
Interrupt controlier
Rea~time clock
* 16-MHz, 3-V operation
10-8
ttlEC
Capacitors . .
ttlEC
Capacitors
Section 11. Capacitors
Capacitors Cross-Reference .................................. 11-3
Part Numbering System ..................................... 11-3
P-Series ................................................... 11-3
D-Series................................................... 11-4
Q-Series .................................................. 11-4
R-Series ................................................... 11-5
SVE-Series ................................................ 11-6
FA-Series .................................................. 11-7
FE, FS, FYD, FYH, FYL, FR-Series ........................... 11-7
High-Capacitance, Resin-Dipped ........................... 11-7
Solid Tantalum Capacitors
D-Series, Resin-Dipped Radial .............................. 11-8
P-Series, Miniature Epoxy-Dipped .......................... 11-11
Q-Series, Resin-Dipped ......... '" ........................ 11-13
R-Series, Miniature Encapsulated Chip ..................... 11-15
SVE-Series, Surface-Mount Chip Tantalum
With Built-In Fuse ......................................... 11-19
Supercap Electric Double-Layer Capacitors
FA-Series................•................................ 11-21
FE-Series...................•............................. 11-22
FS-Series................................................. 11-23
FYD-Series .... , .. " ......... , ..•......................... 11-24
FYH-Series ..............................•................ 11-25
FYL-Series ............................................... 11-26
FR-Series .......................•........................ 11-27
High-Capacitance, Resin-Dipped, Multilayer
Ceramic Capacitors ........................ , ............... 11-28
11-2
ttlEC
Capacitors
Capacitors Cross Reference
AVX
NEC
Malaua
NEC
Plnllanlc
NEC
TAP
TAM
TAJITAQ
O-Series (NO)
P-Series (NP)
R-Series (NE)
TE
YE
O-Series (NO)
R-Series (NR)
R-Series (NR)
NEC
O-Series (NO)
O-Series (NO)
R-Series (NR)
R-Series (NR)
sa
Kamel
221L
202
267
268
Sprlgue
NEe
T350
T360
T491
O-Series (NO)
O-Series (NO)
R-Series (NR)
MEPCO
NEC
410S
416S
49BC
49MC
O-Series (NO)
O-Series (NO)
R-Series (NR)
R-Series (NR)
1990
1960
1860
1950
1930
2930
8940
O-Series (NO)
a-Series (NO)
P-Series (NP)
R-Series (NR)
R-Series (NR)
R-Series (NR)
SVE-Series
Part Numbering System
P-Series
NP A
225
-
20
T1
Volla.e
Capacitance tolerance:
M =±20%
K = ±10%
Capacitance (pF)
Case size
' - - - - - - - - - - NEC P-Series
III
11-3
t\'EC
Capacitors
Part Numbering System (cont)
D-Series
NO A 104 -
35 S
L - Lead configuration
Bulk: S, C, F, K
Tape and reeled:
SIT = Negative lead off first
STP = Positive lead off first
SIP = Ammo Pack
' - - - - - Voltage
' - - - - - - - Capacitance tolerance
M=±20%
K =±10%
J=±5%
' - - - - - - - - Capacitance (pF)
' - - - - - - - - - - Case size
' - - - - - - - - - - - - NEC O-Series
Q-Series
NO
(BULK)
G 106 -
35 S
1" "--- Leadfo,m,
S = Straight leads
C = Crimped .250
K = Kinked .125
F = Snap-fit .200
DC working voltage in volts
' - - - - - - Capacitance tolerance:
M=±20%
K=±10%
' - - - - - - - - - Capacitance (pF):
First two digits represent significant figures.
Third digit specifies number of zeros to follow.
' - - - - - - - - - - Case size
' - - - - - - - - - - - NEC O-Series
Note:
11-4
Crimped, kinked, and snap-fit leads are available on special order ..
t\'EC
Capacitors
Part Numbering System (cont)
Q-Series (cont)
NO
(TAPING)
G 106 -
35
DTP
L
Packaging
DTP = Taping on reel. Positive lead is first to leave reel with
negative lead to leave last.
DTN = Taping on reel. Negative lead is first to leave reel with
positive lead to leave last.
DTB = Fan fold box.
' - - - - - DC working voltage in volts
' - - - - - - Capacitance tolerance:
M =±20%
K = ±10%
' - - - - - - - - Capacitance (pF):
First two digits represent significant figures. Third digit specifies
number of zeros to follow.
' - - - - - - - - - - Case size
' - - - - - - - - - - - NEC O-Series
Nole: Parts are taped per EIA standard RS-488.
R-Series
NR
A
105
16
*
*
(* Omit if bulk pack)
1TI...-----
8=8mmtape
12 = 12 mm tape
R-7 inch R"
L-7 inch L"
P-13 inch R"
N-13 inch L"
S-Stick
C-Cartridge
Rated voltage:
35 V; 25 V; 20 V; 16 V; 10 V; 06 V; 04 V; 02 V
&I
Capacitance tolerance:
M =±20%
K = ±10%
L.._ _ _ _ _ _ _ _ _ _ _ _ _ _ _
Capacitance (pF)
Case size
A
S (B2)
L-_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
B
NEC R-Series
C
U (A2)
T (D2)
D
"Polarity direction in taping.
11-5
ttlEC
Capacitors
Part Numbering System (cont)
SYE·Series
Tape and Reel (Standard)
T
E
SVE
B2
1V
105
M
8
R
TI
L.==
Packing orientation
Tape width
8 mm for B2 case
12 mm for C & 02 cases
' - - - - - - - - Capacitance tolerance
M for±20 %
' - - - - - - - - - - - Capacitance in pF code
First two digits represent significant figures.
Third digit specifies number of zeros to follow.
L - ._ _ _ _ _ _ _ _ _
Rated voltage:
1H : 50 V
1V : 35 V
1E: 25 V
10: 20V
1C: 16 V
1A: 10 V
' - - - - - - - - - - - - - Case code
L -_ _ _ _ _ _ _ _ _ _ _ _ _
SVE-series
' - - - - - - - - - - - - - - - - - Reel number
.1..-_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _
BULK (Packed in poly bag. Non-standard)
SVEB21 V1 05M
L I_ _ _ _ _
11-6
See above
Tape and reel
E : 178 mm (7 inch)
ttlEC
Capacitors
Part Numbering System (cont)
FA·Series
FA
L
OH
105
Z
Capacitance tolerance:
Z
= +80%,
-20%
Capacitance:
First two digits represent significant figures. Third digit specifies number
of zeros to follow Microfarad code.
' - - - - - - Rated voltage:
OH =5.5 V DC
1A = 11 V DC
' - - - - - - - - Supercap series
FE, FS, FYD, FYH, FYL, FA Series
FS
OH
L
473
Z
Capacitance tolerance:
Z
= +80%,
-20%
Capacitance:
First two digits represent significant figures. Third digit specifies number
of zeros to follow Microfarad code.
' - - - - - - Rated voltage:
OH =5.5 V DC
' - - - - - - - Supercap series
High.Capacitance, Aesin Dipped
DB
Y5V
1N
106
Z
III
1
T1
L
New design
Capacitance tolerance:
Z
= +80%,
-20%
' - - - - - Capacitance (pF):
First two digits represent significant figures. Third digit specifies number
of zeros to follow.
' - - - - - - Working voltage:
1N = 75 V DC
1H = 50 V DC
1E= 25 V DC
' - - - - - - - - Temperature characteristic
' - - - - - - - - - - Case size
11-7
t\'EC
Capacitors
D·Series Resin Dipped Radial,
Solid Tantalum Capacitors
Standard Ratings
Part
Number (Nota I, 21
Capacitance
(PFI
Case
Leakage
Current
@ 25 DC
pA Max
Dissipation
Factor
@ 25 DC, 120 Hz
% Max
Part
Number (Note I, 2)
Capacitance
(PF)
Case
Leakage
Current
@25 D C
pA Max
Dissipation
Factor
@25 D C, 120 Hz
% Max
25 V Rating (cont)
50 V Rating
0.1
A
0.5
4
NDK226_25 _
22
K
5.5
8
0.15
A
0.5
4
NDL336_25_
33
L
8.2
8
0.22
A
0.5
4
NDN476_25_
47
N
10.0
8
NDB334_50_
0.33
B
0.5
4
NDP686_25_
68
P
10.0
8
NDB474_S0_
0.47
B
0.5
4
20 V Rating
NDC684_S0_
0.68
C
0.5
4
NDA155_20_
NDD10S_S0_
1.0
o
O.S
4
NDE15S_50_
1.S
E
0.7
6
NDF22S_50_
2.2
F
1.1
NDG335_S0_
3.3
G
1.6
6
6
NDA104_50_
1.5
A
0.5
6
2.2
B
0.5
6
3.3
C
0.6
6
4.7
o
0.9
6
NDE685_20_
6.8
E
1.3
6
NDF106 _20_
10
F
2.0
8
4
NDG156_20 _
15
G
3.0
8
8
35 V Rating
NDA104_35_
0.1
A
O.S
NDC335_20 _
0.15
A
0.5
4
NDH226 _20_
22
H
4.4
0.22
A
0.5
4
NDJ336_20_
33
J
6.6
8
0.33
A
0.5
4
NDK476_20_
47
K
9.4
8
0.47
A
0.5
4
68
L
10.0
8
0.68
A
0.5
4
NDN107 _20_
100
N
10.0
10
1.0
A
0.5
4
16 V Rating
1.5
B
0.5
6
NDA225_16_
2.2
A
0.5
6
2.2
C
0.7
6
NDB335 _ 16_
3.3
B
0.5
6
3.3
o
1.1
6
NDC475 _ 16_
4.7
C
0.7
6
4.7
E
1.6
6
NDD685_ 16_
6.8
o
1.0
6
6.8
F
2.3
6
NDE106_16_
10
1.6
8
NDG106 _35_
10
G
3.5
8
NDFl56_16_
15
E
F
2.4
NDKl56_35_
15
K
5.0
8
NDG226_16 _
22
G
3.5
8
8
H
5.0
8
7.5
8
NDB155 _35_
NDE475_35_
NDL226_35_
22
L
7.0
8
NDH336_16_
33
NDN336_35_
33
N
10.0
8
NDJ476_16 _
47
NDP476_35_
47
P
10.0
8
NDK686_16_
68
K
10.0
8
NDL107 _ 16_
100
L
10.0
10
150
N
10.0
10
25 V Rating
1.0
A
0.5
4
NDN157 _16_
1.5
A
0.5
6
Notes:
2.2
B
0.5
6
3.3
C
0.8
6
(1) In the first dash to complete part number, insert capacitance
tolerance symbol M = ±20%, K = ±10%, J = ±5%.
4.7
o
1.1
6
NDE685_25_
6.8
E
1.7
6
NDF106_25_
10
F
2.5
8
NDJ156_25_
15
J
3.7
8
NDC335_25_
11-8
(2) In the second dash add lead type S, C, K, F, SIT for tape and
reeling with negative lead coming off reel first and STP for
positive lead coming off reel first. Use SIP for ammo pack.
NEe
Capacitors
D·Series Resin Dipped Radial,
Solid Tantalum Capacitors
Standard Ratings [cont]
Part
Number (Note 1. 21
Capacitance
(PFI
Case
Leakage
Current
@25°C
pA Max
Dissipation
Factor
@ 25°C, 120 Hz
%Max
10 V Rating
Part
Number (Note 1. 21
Capacitance
(PF)
Case
Leakage
Current
@25°C
pA Max
Dissipation
Factor
@ 25°C, 120 Hz
% Max
4 V Rating (contI
NDA335_ 10_
3.3
A
0.5
6
NDF686_04 _
68
F
2.7
8
NDB475_10_
4.7
B
0.5
6
NDG107 _04_
100
G
4.0
10
NDC685_ 10_
6.8
C
0.6
6
Noles:
NDD106_10_
10
D
1.0
8
(1) In the first dash (-) toconiplete part number, insert capacitance
tolerance symbol M = ±20%, K =± 10%, J = ±5%.
NDE156 _ 10_
15
E
1.5
8
NDF226_10 _
22
F
2.2
8
NDG336_ 10_
33
G
3.3
8
NDH476 _ 10_
47
H
4.7
8
NDJ686_10_
68
J
6.8
8
NDK107 _10_
100
K
10.0
10
NDL157 _ 10_
150
L
10.0
10
NDM227 _10_
220
M
10.0
10
NDA475 _06_
4.7
A
0.5
6
NDB685_06_
6.8
B
0.5
6
NDC106_06_
10
C
0.6
8
(2) In the second dash, add lead type S, C, K, F, SIT for tape and
reeling with negative lead coming off reel first and STP for
positive lead coming off reel first. Use SIP for ammo pack.
6.3 V Rating
NDD156 _06_
15
D
0.9
8
NDE226_06 _
22
E
1.3
8
NDF336_06 _
33
F
2.0
8
NDG476 _06_
47
G
2.9
8
NDH686_06_
68
H
4.2
8
NDJ107 _06_
100
J
6.3
10
NDK157 _06_
150
K
9.4
10
NDL227 _06_
220
L
10.0
10
NDM337 _06_
330
M
10.0
10
NDA685 _04_
6.8
A
0.5
6
NDA106 _04_
10
A
0.5
8
NDB156_04_
15
B
0.6
8
NDC226_04_
22
C
0.8
8
NDD336_04 _
33
D
1.3
8
NDE476 _04_
47
E
1.8
8
III
4 V Rating
11-9
ftlEC
Capacitor.
Case Size Dimensions, D-Serles
Leads, Form S
Leads, Form C
Diameter. D _ _ _ _
Ha_lg_hl_M_lx_lm_u_m___ laad Spicing
Cua Maximum
HI
H2
H3
H4 S±D.51±D.D2)
A
4.5
(0.18)
7.0
(0.28)
10.5
(0.41)
9.0
(0.35)
10.5
(0.41)
2.5
(0.098)
B
5.0
(0.20)
7.5
(0.30)
11.0
(0.43)
9.5
(0.37)
11.0
(0.43)
2.5
(0.098)
c
5.5
(0.22)
8.0
(0.32)
11.5
(0.45)
10.0
(0.39)
11.5
(0.45)
2.5
(0.098)
D
5.5
(0.22)
8.5
(0.34)
12.0
(0.47)
10.5
(0.41)
12.0
(0.47)
2.5
(0.098)
E
5.5
(0.22)
9.0
(0.35)
12.5
(0.49)
11.0
(0.43)
12.5
(0.49)
2.5
(0.098)
F
6.5
(0.26)
9.5
(0.37)
13.0
(0.51)
11.5
(0.45)
13.0
(0.51)
2.5
(0.098)
G
7.0
(0.28)
10.0
(0.39)
13.5
(0.53)
12.0
(0.47)
13.5
(0.53)
2.5
(0.098)
H
7.5
(0.30)
11.0
(0.43)
14.5
(0.57)
2.5
(0.098)
J
7.5
(0.30)
11.0
(0.43)
14.5
(0.57)
2.5
(0.098)
K
9.0
(0.35)
14.5
(0.57)
18.0
(0.71)
5.0
(0.20)
L
10.0
(0.39)
14.5
(0.57)
18.0
(0.71)
5.0
(0.20)
M
11.0
(0.43)
17.0
(0.67)
20.5
(0.81)
5.0
(0.20)
N
11.0
(0.43)
17.0
(0.67)
20.5
(0.81)
5.0
(0.20)
p
11.0
(0.43)
17.0
(0.67)
20.5
(0.81)
5.0
(0.20)
.,.,--v=== .08 (0.003) max
20.07±3.05
(0.79±O.12)
1-
3.05
6.35
(0.25)
Leads, Form K
Leads, Form F
4.50±1.52
(0.177±O.06)
Note:
(1)
Dimension: mm (inch)
20.07±3.05
(0.79±O.12)
(2) Lead-wire diameter: 0.5 ±O.05 (0.02 ±a.002)
5.08
(0.20)
3.18
(0.125)
83VL·7608A
11-10
t-fEC
Capacitors
P-Series Miniature, Epoxy Dipped,
Solid Tantalum Capacitors
Standard Ratings
Part
Number (Note 11
Capacitance
(PFI
Case
leakage
Dissipation
Current
Factor
@ 25°C @ 25°C, 120 Hz
pA Max
% Max
35 V Rating
Part
Number (Note 11
Capacitance
(PFI
Case
leakage
Dissipation
Current
Factor
@ 25°C @ 25°C, 120 Hz
pA Max
% Max
----------------------~-----------10 V Rating
0.Q1
A
0.5
4
NPB105 _ 10
1.0
B
0.5
4
NPA153 _35
0.015
A
0.5
4
NPC155_10
1.5
C
0.5
6
NPA223_35
0.022
A
0.5
4
NPD225_10
2.2
o
0.5
6
NPA333 _35
0.033
A
0.5
4
NPE335_ 10
3.3
E
0.5
6
NPA473_35
0.047
A
0.5
4
NPF475_ 10
4.7
F
0.5
6
NPA683_35
0.068
A
0.5
4
NPG685 _ 10
6.8
G
0.6
6
0.10
A
0.5
4
NPH106_ 10
10
H
1.0
8
NPB154 _35
0.15
B
0.5
4
NPJl56 _ 10
15
1.5
8
NPB224_35
0.22
B
0.5
4
NPK226_10
22
K
2.2
8
NPC334_35
0.33
C
0.5
4
NPl336_10
33
L
3.3
8
NPD474_35
0.47
o
0.5
4
NPM476_ 10
47
M
4.7
8
NPE684 _35
0.68
E
0.5
4
6.3 VRallng
1.0
F
0.5
4
NPB155_06
1.5
B
0.5
,6
NPC225 _06
2.2
C
0.5
NPD335_06
3.3
o
0.5
6
6
4.7
E
0.5
6
25 V Rating
NPC334 _25
0.33
C
0.5
4
0.47
C
0.5
4
NPD684_25
0.68
o
0.5
4
NPF685 _06
6.8
NPE105_25
1.0
E
0.5
4
NPG106_06
10
NPF155_25
1.5
F
0.5
6
NPHl56_06
15
NPJ226_06
22
NPK336_06
33
20 V Rallng
NPC474_20
0.47
C
0.5
4
NPD684 _20
0.68
o
0.5
4
NPl476 _06
47
NPE105_20
1.0
E
0.5
4
NPM686_06
68
NPF155 _20
1.5
F
0.5
6
4 V Rating
NPG225_20
2.2
G
0.5
6
NPB225 _04
0.5
6
G
0.6
8
H
0.9
8
K
1.3
8
2.0
8
2.9
8
M
4.2
8
2.2
B
0.5
6
3.3
0.5
6
0.5
6
NPC684_16
0.68
C
0.5
4
NPD475_04
4.7
c
o
NPD105 _ 16
1.0
o
0.5
4
NPE685_04
6.8
E
0.5
6
NPE155 _ 16
1.5
6
NPF106_04
10
F
0.5
8
8
16 V Rating
E
0.5
NPF225_ 16
2.2
F
0.5
6
NPG156_04
15
G
0.6
NPG335_ 16
3.3
G
0.5
6
NPH226_04
22
H
0.8
8
NPH475_ 16
4.7
H
0.7
6
NPJ336 _04
33
1.3
8
NPJ685_ 16
6.8
1.0
6
NPK476 _04
47
K
1.8
8
NPK106_16
10
1.6
8
NPL686 _04
68
L
2.7
8
100
M
4.0
10
K
NPl156_ 16
15
L
2.4
8
NPM107 _04
NPM226_ 16
22
M
3.5
8
Note:
(1) To complete part number, insert capacitance tolerance symbol
M = ±20%, K = ±10%.
11-11
11-12
NEe
Capacitors
Q-Series Resin
Solid Dipped, Tantalum Capacitors
Standard Ratings
ParI
Number (Note 1. 21
Capacitance
aI25°C.
120 Hz
IJJFI
Case
Leakage
Currenl
@25°C
IlA Max
Dissipallon
Factor
@25°C. 120 Hz
% Max
35 V Raling aI85°C. 22 V Raling a1125°C
Part
Number (Nole 1. 21
Capacilance
aI25°C.
120 Hz
IJJFI
Case
Leakage
Currenl
@25°C
IlA Max
Dissipalion
Faclor
@25°C. 120 Hz
% Max
16 V Raling al 85°C. 10 V Rallng al 125°C (conll
NQA104_35_
0.1
A
0.3
4
NOG226_ 16_
22
G
1.7
6
NQA154_35_
0.15
A
0.3
4
NQH336 _16_
33
H
2.6
6
NQA224_35 _
0.22
A
0.3
4
10 V Raling al 85°C. 6.3 V Raling a1125°C
NOA334_35_
0.33
A
0.3
4
NQA335 _ 10_
3.3
A
0.3
6
NOA474_35_
0.47
A
0.3
4
NOB475_ 10_
4.7
B
0.3
6
NQA684_35_
0.68
A
0.3
4
NOC685_ 10_
6.8
C
0.3
6
NQA105 _ 35_
1.0
A
0.3
4
NQ0106_10_
10
0
0.5
6
NOB155 _35_
1.5
B
0.3
6
NQE156 _10_
15
E
0.7
6
NOC225_35_
2.2
C
0.3
6
NQF226_10_
22
F
1.1
6
N00335 _35_
3.3
0
0.5
6
NOG336_10_
33
G
1.6
6
NOE475_35_
4.7
E
0.8
6
6.3 V Raling al 85°C. 4 V Rallng al125 °C
NQF685_35_
6.8
F
1.1
6
NOA475_06_
4.7
A
0.3
6
NQG106 _35_
10
G
1.7
6
NQB685_06_
6.8
B
0.3
6
NQC106_06_
10
C
0.3
6
25 V Rallng aI85°C. 15 V Rallng al125°C
NQA105_25_
1.0
A
0.3
4
NQ0156_06_
15
0
0.4
6
NOA155_25_
1.5
A
0.3
6
NQE226_06_
22
E
0.6
6
NQB225 _25_
2.2
B
0.3
6
NQF336 _06_
33
F
1.0
6
NQC335 _25_
3.3
C
0.4
6
NQG476_06_
47
G
1.4
6
N00475 _25_
4.7
0
0.5
6
Noles:
NQE685_25_
6.8
E
0.8
6
NQF106_25_
10
F
1.2
6
(1) In the first dash (-) to complete part number. insert capacitance
tolerance symbol M = ±20%. K = ±1 0%.
(2) In the second dash (-). add leadtypeC. K. F. DTP. DTN. orDTB.
20 V Raling al85 °C. 13 V Raling al125 °C
NQA155_20_
1.5
A
0.3
NOB225_20 _
2.2
B
0.3
6
NOC335_20 _
3.3
C
0.3
6
III
6
N00475_20 _
4.7
0
0.4
6
NOE685 _20_
6.8
E
0.6
6
NQF106 _20_
10
F
1.0
6
NOG156_20 _
15
G
1.5
6
16 V Raling al 85°C. 10 V Raling al 125°C
NOA225 _ 16_
2.2
A
0.3
6
NOB335_ 16_
3.3
B
0.3
6
NOC475_ 16_
4.7
C
0.3
6
N00685_ 16_
6.8
0
0.5
6
NOE106 _ 16_
10
E
0.8
6
NOF156_16_
15
F
1.1
6
11-13
NEe
Capacitors
Case Size Dimensions, Q-Serles
Case Code
tflD
H
A
4.5
(0.177)
7.0
(0.276)
B
5.0
(0.197)
7.5
(0.295)
C
5.0
(0.197)
8.0
(0.315)
0
5.0
(0.197)
8.5
(0.335)
E
5.5
(0.217)
9.0
(0.354)
F
6.0
(0.236)
9.5
(0.374)
G
6.5
(0.258)
10.5
(0.413)
7.5
(0.295)
12.0
(0.472)
H
Note: Dimensions: mm (inch)
11-14
~+.-i
2.5±O.5
(0.098 ±O.02O)
00.5
(0.020)
_t_
3
(0.118)
t
83VL-7808A
ftlEC
Capacitors
R·Series Miniature Encapsulated Chip,
Solid Tantalum Capacitors
Standard Ratings
Part
Numbar (Nota 11
Capacltanca
(PFI
Casa
Laakage
Currant
@25·C
pA Max
Dissipation
Factor
@ 25·C. 120 Hz
% Max
35 V Rating atB5·C. 22 VRating at 125·C
Part
Numbar (Nola 11
Capacitance
(PFI
Casa
Laakage
Current
@ 25·C
pA Max
Dissipation
Faclor
@25·C. 120 Hz
% Max
25 VRating al85·C. 13 VRating a1125·C (coni,
0.D1
A
0.5
4
NR5225 _ 25
2.2
62(5)
0.5
6
0.015
A
0.5
4
NR8335 _ 25
3.3
B
0.8
6
NRA223 _35
0.022
A
0.5
4
NR5335 _ 25
3.3
6(5)
0.8
6
NRA333 _35
0.033
A
0.5
4
NRC335_25
3.3
C
0.8
4
NRA473_35
0.047
A
0.5
4
NRC475_25
4.7
C
1.1
4
6
NRA 103 _ 35
0.068
A
0.5
4
NR0685_25
6.8
o
1.7
0.10
A
0.5
4
NRT685 _25
6.8
02
1.7
6
0.15
A
0.5
4
NR0106_25
10.0
o
2.5
6
NRA224_35
0.22
A
0.5
4
NRT106 _25
10.0
02
2.5
6
NRA334_35
0.33
A
0.5
4
20 VRallng It 85·C. 13 VRallng a1125·C
NRA474 _35
0.47
A
0.5
6
NRU104 _ 20
0.10
A2(U)
0.5
6
NR8474 _35
0.47
8
0.5
4
NRUl54 _20
0.15
A2(U)
0.5
6
NR5474 _35
0.47
82(5)
0.5
4
NRU224_20
0.22
A2(U)
0.5
6
NRA684_35
0.68
A
0.5
6
NRU334_20
0.33
A2(U)
0.5
6
NR8684_35
0.68
8
0.5
4
NRU474_20
0.47
A2(U)
0.5
NR5684 _35
0.68
82(5)
0.5
4
NRA474_20
0.47
A
0.5
6
4
NRA684_20
0.68
A
0.5
4
1.5
A
0.5
6
NRA683_35
NR8105 _35
1.0
8
0.5
4
NR5105_35
1.0
82(5)
0.5
4
NR8155_35
1.5
8
0.5
6
NR6225_20
2.2
B
0.5
4
NR5155_35
1.5
82(5)
0.5
6
NRS225_20
2.2
62
0.5
4
NRC155_35
1.5
C
0.5
4
NRS335 _20
3.3
B2(5)
0.6
6
NR8225_35
2.2
8
0.7
6
NRB475_20
4.7
B
0.9
6
NR5225_35
2.2
82(5)
0.7
6
NR5475_20
4.7
82(5)
NRC225_35
2.2
C
0.7
4
NRC475 _20
4.7
C
0.9
0.9
4
NRC335_35
3.3
C
1.2
4
NRC685_20
6.8
C
1.4
6
NR0335_35
3.3
1.2
4
NRC106 _20
10.0
C
2.0
6
4.7
o
o
1.6
4
NRT106_20
10.0
02
2.0
6
6
NR0685 _35
4.7
02(T)
1.6
4
15.0
o
3.0
6.8
o
2.3
6
NRT156_20
15.0
02
3.0
6
6.8
02(T)
2.3
6
NR0226 _20
22.0
o
4.4
6
NRT226_20
22.0
02(T)
4.4
6
A
0.5
4
16 VRallng al 85 ·C. 10 VRating al 125·C
25 VRating al 85 ·C. 13 VRating a1125·C
NRA334 _ 25
0.33
III
6
NRA474_25
0.47
A
0.5
4
NRA684 _ 16
0.68
A
0.5
4
NRA105_25
1.0
A
0.5
6
NRU684 _ 16
0.68
A2(U)
0.5
6
NR8155_25
1.5
8
0.5
1.0
A
0.5
4
1.5
B2
0.5
4
4
NRA105_ 16
NR5155_25
Nole:
(1) To complete part number. insert capacitance tolerance symbol
M = ±20%. K = ±10%.
11-15
t-IEC
Capacitors
A-Seri.. Miniature Encapsulated Chip,
Solid Tantalum Capacitors (cont)
Standard Ratings
Part
CapaGitanGe
Number (Note II
(PFI
Case
16 VRallng al85°C, 10 VRIling al125°C (conll
Leakage
Current
@ 25°C
pA Max
Dlsslpallon
FaGlor
@ 25°C, 120 Hz
% Max
Leakage
Currenl
ParI
Capacitance
@ 25°C
Number (Note II
(PFI
Case
pA Max
10 VRating aIB5°C, 6.3 VRallng all25°C (contI
Dlssipallon
FaGlor
@25°C, 120 Hz
'loMax
NRA155 _ 16
1.5
A
2.4
4
NRT226 _ 10
22.0
02
2.2
6
NRA225 _ 16
2.2
A
0.5
6
NR0336 _ 10
33.0
02
3.3
6
NRB225_16
2.2
B
0.5
4
NRT336_ 10
33.0
02
3.3
6
NRB335_16
3.3
B
0.5
4
NR0476 _10
47.0
o
4.7
8
NRS335_16
3.3
B2
0.5
4
NRT476 _ 10
47.0
02(T)
4.7
8
NRS475 _16
4.7
B2(S)
0.7
6.3 VRaling aIB5°C, 4 VRallng a1125°C
NRC475_16
4.7
C
0.7
6
4
NRA155_06
1.5
A
0.5
4
NRB685 _16
6.8
B
1.0
6
NRU155 _ 06
1.5
A2(U)
0.5
8
NRS685_16
6.8
B2(S)
1.0
6
6
NRA225 _ 06
2.2
A
0.5
4
NRA335_06
3.3
A
2.1
4
NRA475_06
4.7
A
0.5
8
2.4
6
6
NRB475 _06
4.7
B
0.5
4
2.4
6
NRB685 _06
6.8
B
0.5
6
o
3.5
6.8
B2
0.5
6
3.5
6
6
NRS685 _06
02
NRS106_06
10.0
B2(S)
0.6
8
o
5.2
6
NRC106_06
10.0
C
0.6
6
02(T)
5.2
6
NRC685_ 16
6.8
C
1.0
NR0106_ 16
10.0
C,O
1.6
NRC156_16
15.0
C
NRT156_ 16
15.0
02
NR0226_16
22.0
NRT226_16
22.0
NR0336_16
33.0
NRT336_ 16
33.0
NRBI56_06
15.0
B
0.9
8
10 VRallng al85°C, 6.3 VRallng a1125°C
NRSI56_06
15.0
B2(S)
0.9
8
NRA105 _ 10
1.0
A
0.5
4
NRCI56_06
15.0
C
0.9
6
NRU105 _ 10
1.0
A2(U)
0.5
8
NRC226 _06
22.0
C
1.4
6
NRAI55_ 10
1.5
A
0.5
4
NRC336 _06
33.0
C
2.0
8
NRA225_10
2.2
A
2.2
4
NR0336_06
33.0
o
2.0
6
NRA335_10
3.3
A
0.5
NRT336 _06
33.0
02
2.0
NRB335_10
3.3
B
0.5
8
4
NR0476_06
47.0
o
3.0
6
6
NRB475_ 10
4.7
B, B2
0.5
4
NRT476 _06
47.0
02
3.0
6
NRS475_ 10
4.7
B2
0.5
4
NR0686_06
68.0
o
4.2
8
NRS685_10
6.8
B2(S)
0.6
8
NRT686 _06
68.0
02 (T)
4.2
8
NRC685_ 10
6.8
C
0.7
6
NRB106_10
10.0
B
1.0
8
4 VRallng al 85 °C, 2.5 VRallng al 125°C
NRA225 _ 04
2.2
A
0.5
4
NRS106 _10
10.0
B2(S)
1.0
8
NRU225 _ 04
2.2
A2(U)
0.5
8
NRC106_10
10.0
C
1.0
6
NRA335 _04
3.3
A
0.5
4
NROI56_ 10
15.0
C,O
1.5
NRU335 _04
3.3
A2(U)
0.5
8
NRC226_10
22.0
C
2.2
6
8
NRA475 _04
4.7
A
1.9
4
NR0226 _ 10
22.0
o
2.2
6
NRA685 _04
6.8
A
0.5
8
11-16
tttlEC
Capacitors
R·Series Miniature Encapsulated Chip,
Solid Tantalum Capacitors (cont)
Standard Ratings
Part
Number (Note 1I
Capacitance
(PFI
Case
Leakage
Current
@25·C
/JAMax
Dissipation
Factor
@25·C, 120 Hz
% Max
6
4 V Rating at 85 ·C, 2.5 V Rating at 125·C (contI
NRB685_04
6.8
B
0.5
NRA106 _04
10.0
A
0.5
8
NRB106_04
10.0
B
0.5
6
NRS106_04
10.0
B2
0.5
6
NRSl56_04
15.0
B2(S)
0.6
8
NRCl56_04
15.0
C
0.6
6
NRB226_04
22.0
B
0.8
8
NRS226_04
22.0
B2(S)
0.8
8
NRC226_04
22.0
C
0.6
6
NRC336_04
33.0
C
1.3
6
NRC476_04
47.0
C
1.8
8
NR0476_04
47.0
0
1.9
Ii
NRT476_04
47.0
02
1.9
6
NR0686_04
68.0
0
2.7
6
NRT686_04
68.0
02
2.7
6
NR0107 _04
100.0
0
4.0
8
NRT107 _04
100.0
0
4.0
8
2.5 V Rating at 85·C, 1.6 VRating at 125·C
NRU475_02
4.7
A2(U)
0.5
8
NRAl56_02
15.0
A
0.5
8
m
11-17
ttlEC
Capacitors
R·Series Miniature Encapsulated Chip,
Solid Tantalum Capacitors (cont)
Case Size Dimensions
Case Sizet
y
L
W,
W2
H
Z
A2
3.2 :t 0.2
(0.126 :t 0.008)
1.6 :t 0.2
(0.063 :t 0.008)
1.2 :t 0.1
(0.047 :t 0.004)
1.2 max
(0.047 max)
0.8 :t 0.3
(0.031 :t 0.012)
A
3.2 :t 0.2
(0.126 :t 0.008)
1.6:t 0.2
(0.063 :t 0.008)
1.2:t 0.1
(0.047 :t 0.004)
1.6 :t 0.2
(0.063 :t 0.008)
0.8:t 0.3
(0.031 :t 0.012)
82 (8)
3.5 :t 0.2
(0.138 :t 0.008)
2.8 :t 0.2
(0.110 :t 0.008)
2.3:t 0.1
(0.091 :t 0.004)
1.9 ± 0.2
(0.075 :t 0.008)
0.8 :t 0.3
(0.031 ± 0.012)
8
4.7 :t 0.3
(0.185 :t 0.012)
2.6 :t 0.3
(0.102 :t 0.012)
1.4 ± 0.1
(0.055 :t 0.004)
2.1 :t 0.3
(0.063 :t 0.012)
0.8 :t 0.3
(0.031 :t 0.012)
0.40
0.0160
0
6.0.:t 0.3
(0.236 :t 0.012)
3.2 :t 0.3
(0.126 :t 0.012)
1.8:t 0.1
(0.071 :t 0.004)
2.5 ± 0.3
(0.098 :t 0.012)
1.3 :t 0.3
(0.051 ± 0.012)
0.40
0.016C
~(l)
5.8 :t 0.3
(0.228 :t 0.012)
4.6 :t 0.3
(0.181 :t 0.012)
2.4:1: 0.1
(0.095 :t 0.004)
3.2:t 0.3
(0.126 :t 0.012)
1.3 :t 0.3
(0.051 :t 0.012)
D
7.3:t 0.3
(0.287 :I: 0.012)
4.3 :t 0.3
(0.169 :t 0.012)
2.4 :t 0.1
(0.095 ± 0.004)
2.8 ± 0.3
(0.110:1: 0.012)
1.3:t 0.3
(0.051 :t 0.012)
t Dimensions: mm (inoh)
A
A2
B2
L
~
1
D2
L
~
B,C,D
H
1
11-18
J
H
0.50
0.0200
ttlEC
Capacitors
SVE-Series Surface Mount Chip Tantalum With Built-In Fuse
Specifications
Working Voltage
IV.DC)
Capacitance
IF)
Dissipation
Factor
Leakage Current
(PA)
Case Code
TESVEB21A47SMBR
10
4.7
0.04
O.S
B2
TESVEC1A1S6M12R
10
lS.0
0.06
1.5
C
TESVE021A156M12R
10
15.0
0.06
1.5
02
TESVE021A336M12R
10
33.0
0.06
3.3
02
TESVEB21C33SMBR
16
3.3
0.04
0.5
B2
TESVEC1C475M12R
16
4.7
0.04
0.7
C
TESVEC1C6B5M12R
16
6.B
0.06
1.0
C
TESVEC1Cl06M12R
16
10.0
0.06
1.6
C
TESVE021C156M12R
16
15.0
0.06
2.4
02
TESVE021C226M12R
16
22.0
0.06
3.5
02
TESVEB210225MBR
20
2.2
0.04
0.5
B2
TESVEC1047SM12R
20
4.7
0.04
0.9
C
TESVE0210106M12R
20
10.0
0.06
2.0
02
TESVEB21 E155MBR
25
1.5
0.04
0.5
B2
Part Number
TESVEC1E335M12R
25
3.3
0.04
O.B
C
TESVE021 E6BSM12R
25
6.B
0.06
1.7
02
TESVEB21Vl05MBR
35
1.0
0.04
0.5
B2
TESVEC1V225M12R
35
2.2
0.04
0.7
C
TESVE021V47SM12R
35
4.7
0.04
1.6
02
TESVECl Hl0SM12R
50
1.0
0.04
0.5
C
TESVE021H33SM12R
SO
3.3
0.04
1.6
02
ID
11-19
t\'EC
Capacitors
SYE-Series Surface Mount Chip Tantalum With Built-In Fuse (cont)
B2
C,D2
Cease
02 case
~
~
+
83YL·7610B
Dimensions
(Unit:mm)
Casa
Code
WI
B2
3.5 ± 0.2 2.8 ± 0.2 2.3±0.1
C
6.0 ± 0.3 3.2 ± 0.3 1.8±0.1 2.5 ±0.3 1.3±0.3
D2
5.8 ± 0.3 4.6±0.3 2.4 ± 0.1
11-20
W2
H
Z
Y
1.9 ± 0.2 0.8 ± 0.3
3.2 ± 0.3 1.3 ± 0.3
OAC
t\fEC
Capacitors
FA·Series Supercap Electric Double Layer Capacitor
Specifications
Catalog
NBR
Capacitance
Rated V
MaxWV
Max ESR
(Farads)
[VOC)
[1I0C)
[0 at I kHz)
0
H Max
Dimensions mm [Inches)
P
d,
dZ
II
Walght
g [oz.)
15.5
(0.610)
5
(0.197)
0.6
(0.024)
1.2
(0.047)
5.0
(0.197)
6.2
(0.219)
FAOH473Z
0.047
5
5.5
20
16.0
(0.630)
FAOH104Z
0.1
5
5.5
8
21.5
(0.846)
15.5
(0.610)
7.5
(0.295)
0.6
(0.024)
1.2
(0.047)
5.5
(0.217)
12
(0.423)
FAOH224Z
0.22
5
5.5
5
28.5
(1.122)
16.5
(0.650)
10
(0.394)
1.0
(0.039)
1.4
(0.055)
9.5
(0.374)
25
(0.882)
FAOH474Z
0.47
5
5.5
3.5
36.5
(1.437)
16.5
(0.650)
15
(0.591)
0.6
(0.024)
1.7
(0.067)
9.5
(0.374)
42
(1.482)
FAOH105Z
1.0
5
5.5
2.5
44.5
(1.752)
18.5
(0.728)
20
(0.787)
1.0
(0.039)
1.4
(0.055)
9.5
(0.374)
65
(2.293)
FA1A223Z
0.022
10
11
20
16.0
(0.630)
25.0
(0.984)
5
(0.197)
0.6
(0.024)
1.2
(0.047)
5.0
(0.197)
7.5
(0.265)
FA1A104Z
0.1
10
11
8
28.5
(1.122)
25.5
(1.004)
10
(0.394)
1.0
(0.039)
1.4
(0.055)
9.5
(0.374)
32
(1.129)
FA1A224Z
0.22
10
11
6
36.5
(1.437)
27.5
(1.083)
15
(0.591)
1.0
(0.039)
1.4
(0.055)
9.5
(0.374)
55
(1.940)
FA1A474Z
0.47
10
11
4
44.5
(1.752)
28.5
(1.122)
20
(0.787)
1.0
(0.039)
1.4
(0.055)
9.5
(0.374)
83
(2.928)
Notes:
(1) Capacitance tolerance: +80%. -20%
(2) Weight is typical
sD±O.5
(±O.020)
-I
101
t
H max
J
01
P±O.5
(±O.020)
I
-
11f
2!
III
+
ax
(0.079 max)
ImmliliIII.
d1 ±O.1
(±O.004)
-'1
I~
O
· d2 ±O.1
_t_(±O·004)
Unit: mm (inch)
83Vl-761tA
11-21
t\'EC
Capacitors
FE·Series Supercap Electric Double Layer Capacitor
VO NECS.SV
Insulation Sleeve
NEC S.SV
FEO.047F
00' FE O.047F
Date Code
Lead Terminal
Connecting With The
Metal Can Case
H Negative Polarity
f
Hmax
----
NEC S.SV
{VO NECs.sV
.....
00' FE O.047F
Lead Identification Mark
FEO.047F
/
Lmin
7i---m--t--m---"~
0.3 min
Sleeve
Dimensions
P±O.S -+----t-----i
.D±0.5
(Unit: mm)
Part no.
110
H
P
L
d,
d2
FEOH473Z
14.5
14.0
5.1
2.2
0.4
1.2
FEOH104Z
16.5
14.0
5.1
2.7
0.4
1.2
FEOH224Z
21.5
15.5
7.6
3.0
0.6
1.2
FEOH474Z
28.5
16.5
10.2
6.1
0.6
1.4
FEOH105Z
36.5
18.5
15.0
6.1
0.6
1.7
FEOH155Z
44.5
18.5
20.0
6.1
1.0
1.4
Lead (Case)
H Negative Polarity
Lead
Specifications
Part Number
(V)
Nominal
Capacitance
(F)
FEOH473Z
5.5
0.047
0.071
14.0
FEOH104Z
5.5
0.10
0.15
6.5
FEOH224Z
5.5
0.22
0.33
3.5
FEOH474Z
5.5
0.47
0.71
1.8
FEOH105Z
5.5
1.0
1.5
1.0
FEOH155Z
5.5
1.5
2.3
0.6
Maximum
Working Voltage
11-22
Max. Current
(at 30 Min.)
(mA)
Max. Equivalent Series
Resistance
(0.)
NEe
Capacitors
FS-Series Supercap Electric Double Layer Capacitor
Specifications
Catalog
NBR
Capacitance
Rated V
MaxWV
Max ESR
(Faradsl
(VDCl
(VDCl
(n at 1 kHzl
D
H Max
P
d,
d2
L,
Weight
g (oz.l
8.5
(0.335)
5.08
(0.200)
0.4
(0.016)
1.2
(0.047)
2.2
(0.087)
2.6
(0.092)
Dimensions mm (inchesl
FSOH473Z
0.047
5
5.5
40
13.0
(0512)
FSOH104Z
0.1
5
5.5
25
16.5
(0.650)
8.5
(0.335)
5.08
(0.200)
0.4
(0.016)
1.2
(0.047)
2.7
(0.106)
4.1
(0.145)
FSOH224Z
0.22
5
5.5
25
16.5
(0.650)
13.0
(0.512)
5.08
(0.200)
0.4
(0.016)
1.2
(0.047)
2.7
(0.106)
5.3
(0.187)
FSOH474Z
0.47
5
5.5
13
21.5
(0.846)
13.0
(0.512)
7.62
(0.300)
0.6
(0.024)
1.2
(0.047)
3.0
(0.118)
10
(0.353)
5
5.5
7
28.5
(1.122)
14.0
(0.551)
10.16
(0.400)
0.6
(0.024)
1.4
(0.055)
6.1
(0.240)
18
(0.635)
FSOH105Z
Notes:
(1) Capacitance tolerance: +80%, -20%
(2) Weight is typical
sD±O.S
(±O.020)
~I
1
L
Hmax
Iii
II
~
E
P ±O.S
(±O.020)
+t
~
0.3 max
(0.012 max)
d1 ±O.1
(±O.004)
-'1
II
I~
O
-'-d2 ±O.1
_f_(±O·004)
Unit: mm (Inch)
83Vl·7812A
11-23
ttlEC
Capacitors
FYD-Series Supercap Electric Double Layer Capacitor
Marking on Insulallon Slaava
NEe 5.5V
V5NEe 5.5V
In8ulaHon Sleeve
001 FYD .047F
FYD.047F
NEe 5.5V
DalaCode
FYD.047F
Lead Tannln.1
ConnacUng With Tha
MaI8l Con Co..
Lead ldantilication Mark
-1Hmax
_T ~~==i=i=
Dimensions
(Unit:mm)
Part no.
aD
H
P
L
d1
d2
FYDOH473Z
11.S
8.5
5.08
2.7
0.4
1.2
FYDOH104Z
13.0
8.5
5.08
2.2
0.4
1.2
FYDOH224Z
14.5
15.0
5.08
2.4
0.4
1.2
FYDOH474Z
16.S
1S.0
5.08
2.7
0.4
1.2
eD± 0.5
Laad(Casa)
FYDOH10SZ
21.S
16.0
7.62
3.0
0.6
1.2
FYDOH145Z
21.5
19.0
2.62
3.0
0.6
1.2
FYDOH225Z
28.5
22.0
10.16
3.0
0.6
1.2
Laad
Specifications
In)
Voltage Holding
Characlerislic
IV)
Current
ImA)
5.5
220
4.2
0.071
5.5
100
4.2
0.15
0.22
5.5
120
4.2
0.33
0.47
5.5
65
4.2
0.71
FYDOH105Z
1.0
5.5
35
4.2
1.5
FYDOH145Z
1.4
5.5
45
4.2
2.1
FYDOH225Z
2.2
5.5
35
4.2
3.3
DC Working Vollage
IV)
ESR
Part Number
CapacillAce
IF)
FYDOH473Z
0.047
FYDOH104Z
0.1
FYDOH224Z
FYDOH474Z
11-24
NEe
Capacitors
FYH·Series Supercap Electric Double Layer Capacitor
Marking on Insulation Sleeve
NEe 5.5V
V5NEe 5.5V
Insulation Sleeve
Date Code
001 FYH .022F
FYH .022F
V5 fIIEC 5.5V
NEe 5.5V
FYH.022F
Lead Terminal
Connactlng With The
Metal can ca..
Hmax
-L..-.....---r--
Lead ldantlllcatlon Mark
Lmln
i'---rlr-i--rtr---';-.i
Slaave
o±.
Dimensions
(Unit:mm)
Part no.
1110
H
P
L
dl
d2
FYHOH223Z
11.5
7.0
5.08
2.7
0.4
1.2
FYHOH473Z
13.0
7.0
5.08
2.2
0.4
1.2
FYHOH104Z
16.5
7.5
5.08
2.7
0.4
1.2
FYHOH224Z
16.5
9.5
5.08
2.7
0.4
1.2
FYHOH474Z
21.5
10.0
7.62
3.0
0.6
1.2
FYHOH105Z
28.5
11.0
10.16
6.1
0.6
1.4
t-IEC
Capacitors
FYL-Ser••• Supercap Electric Double La,er Capacitor
eO±O.5
~I
1'T
J i±Ot
/'
Sleeve
vs
NEC
001
FYL
001
--
~.
,
L1 min
J+
0.3 min
P±O.s
Lead Terminal
Connecting with
the Metal can case
(-) Negative Polarity
OateCoc:Ie_ {VS
I
NEC
FYL
NEC
S.SV
.047F
FYL
NEC
S.SV
.047 F
FYL
S.SV
.047F
S.SV
.047F
Marking on Insulation Sleeve
83YL·76138
Dimensions (mm)
Part No.
q,o
H
P
L
d1
d2
FYLOH103Z
11.0
s.O
5.08
2.7
0.2
1.2
FYLOH223Z
11.0
5.0
5.08
2.7
0.2
1.2
FYLOH473Z
12.0
5.0
5.08
2.7
0.2
1.2
Specifications
Part Number
Maximum Working
Voltage (V)
Nominal Capacitance
Current (30 min)
(F)
ESR (ohms)
(mA)
Voltage Holding
Characteristic (V)
FYLOH103Z
5.5
0.01
300
0.015
4.2
FYLOH223Z
5.5
0.022
200
0.033
4.2
FYLOH473Z
5.5
0.047
200
0.071
4.2
11-26
NEe
Capacitors
FR·Series Supercap Electric Double Layer Capacitor
Marking on Insulation Sleeve
Insulation Sleeve _
VS
/lIE(;
S.SV
/lIE(;
001 FR .022F
5.SV
FR .022F
Date Code
/lIE(;
5.5V
FR .022F
Lead Terminal
Connecting With The
_ I C8n C8ee
Lead Identification Mark
I
Hmax
Dimensions
y.'--rr---+--rr-Sloeve
__
I
p ±0.5
Part no.
I--
80± 0.5
.D
(Unit:mm)
H
P
L
d1
d2
FROH223Z
11.5
14.0
5.08
2.7
0.4
1.2
FROH473Z
14.5
14.0
5.08
2.4
OA
1.2
FROH104Z
14.5
15.5
5.08
2.4
0.4
1.2
FROH224Z
14.5
21.0
5.08
2.4
0.4
1.2
FROH474Z
16.5
21.5
5.08
2.7
0.4
1.2
FROH105Z
21.5
22.0
7.62
3.0
0.6
1.2
DI
Leed(C..e)
Operation Temperature -40°C to +85°C
Leed
Specifications
Part Number
Maximum
Working Voltage
(V)
NomlDlI
Capacitance
(F)
ESR
(0)
Current
(30 Min.)
(mA)
Voillge Holding
Characteristic
(V)
FROH223Z
5.5
0.022
220
0.033
4.2
FROH473Z
5.5
0.047
110
0.071
4.2
FROH104Z
5.5
0.10
150
0.15
4.2
FROH224Z
5.5
0.22
180
0.33
4.2
FROH474Z
5.5
0.47
100
0.71
4.2
FROH105Z
5.5
1.0
60
1.5
4.2
11-27
t-IEC
Capacitors
High-Capacitance, Resin Dipped
Multilayer Ceramic Capacitors
Lmax
AE
Standard Ratings
Capacilanca
al 25°C. 1 kHz
(PF)
Case
Insulallon
Rasislanca
(25°C)
MoMln
DBY5V1Nl06Z1
10
DB
50
5
DBY5V1Nl56Z1
15
DB
33
5
DBY5Vl N226Z1
22
DB
22
5
DCY5Vl N336Z1
33
DC
15
5
DCY5Vl N476Z1
47
DC
10
5
DAY5V1H106Z1
10
DA
50
5
Dimensions (mm)
DBY5V1H156Z1
15
DB
33
5
Size Code
DBY5Vl H226Z1
22
DB
22
5
DBY5Vl H336Z1
33
DB
15
5
DBY5V1 H476Z1
47
DB
10
5
DA
DB
DC
DCY5Vl H6B6Z1
68
DC
7
5
DCY5V1H107Z1
100
DC
5
5
5
ParI
Numbar
75 V Raling
Dlsslpallon
Factor
(25 ·C. 1 kHz)
% Max
(I
Tmax
~~
~l
I
r-
~I
t
7 min
~
-p- -~
sd
83Vl·76t4A
50 V Rallng
25 VRallng
DAY5V1E106Z1
10
DA
50
DAY5V1El56Z1
15
DA
33
5
DBY5Vl E226Z1
22
DB
22
5
5
DBY5V1E336Z1
33
DB
15
DBY5Vl E476Z1
47
DB
10
5
DBY5V1 E686Z1
68
DB
7
5
DCY5V1 El07Z1
100
DC
5
5
11-28
L
W
T
P
q,d
19.0
9.0
6.5
12.7 ±1.5
0.5
24.0
18.0
7.5
15.2 ±1.5
0.8
35.0
21.0
7.5
25.4 ±1.5
0.8
ttlEC
Fluorescent Indicator Panel Displays (FIPs)
IfJI
I'
t-IEC
FIPs
Section 12. Fluorescent Indicator Panel Displays (FIPs)
Part Numbering System ...................................... 12-3
Data Terminal and Others (Dot Type and Graphic Type) ......... 12-4
Display Configuration Table .................................. 12-8
Data Terminal and Others (Alphanumeric Type) ................ 12-10
Automotive and Others ...................................... 12-12
Audio, Analog Instruments, and Others .... , ....... , .......... 12-14
Digital Clock, Timer, Measuring Meter, and Others ............. 12-16
ECR and Others ............................................. 12-18
Calculator and Others ....................................... 12-20
Dot Type Fluorescent Indicator Modules ...................... 12-22
Mechanical Characteristics ................................ 12-22
General Characteristics ................................... 12-22
Electrical Characteristics .................................. 12-23
Display Functions......................................... 12-23
Chip-in-Glass FIP Modules ................................... 12-24
Mechanical Characteristics ................................ 12-24
General Characteristics ................................... 12-24
Electrical Characteristics .. " .............................. 12-25
Display Functions......................................... 12-25
Abbreviations used in these tables
Mode of Fil. = Mode of filament (AC or DC)
Ef = Filament voltage (AC: unit in Vrms , DC: unit in Vde>
If = Filament current (AC: unit in mA rms • DC: unit in mAde>
Mode of Oper. = Mode of operation (static driving or multiplex driving)
eb. ee = Peak anode voltage and peak grid voltage
Eb. Ee = DC anode voltage and DC grid voltage
Duty = Duty cycle or duty factor
Ek = Cathode bias voltage or cut-off bias voltage
ib/dig.
Peak anode current per digit or per bar (in case of multiplex operation mode)
DC anode current per digit or per bar (in case of static operation mode)
ib/1seg
Peak anode current per segment (in case of multiplex operation mode)
DC anode current per segment (in case of static operation mode)
ie/dig.
Peak grid current per digit (in case of multiplex operation mode)
DC grid current per panel (in case of static operation mode)
L = Brightness in cd/m2 (81 unit)
Bright value (cd/m2) shown in the table is the calculated value according to the equation. 1
(ft. L) 3.43 (cd/m2)
=
=
=
12-2
tttfEC
FIPs
Part Numbering System
FIP
5
A
-
15
A
S
L
Special classification: Use following alphabets according to the structure
of the FIP
R == Alpha-numeric type
S == Static driving type
Multiplex driving type of FIP has no letter
T == Graphic type
} Old numbering system
X == Dot-matrix type
Y == Bar-graphic type
Serial number of minor change:
Use in alphabetical order from A to N (The original FIP has no letters.)
' - - - - - Character height or pattern height:
Use Arabic numerals with unit in mm
' - - - - - - Special classification:
Use "M" only for multidisplay type of FIP
Use "W" only for multidisplay (level meter) type of FIP
' - - - - - - - - Special number of development:
Use in alphabetical order. (I, M, 0, U, V, Wand Z are not used.)
' - - - - - - - - - Number of digits:
Use Arabic numerals
' - - - - - - - - - - NEC's abbreviation for fluorescent indicator panel
'FIP
20 X -
1T
1 A
A
L
$e,;.'
""mbe, 01 m'oo, ,hooge,
Use in alphabetical order from B to N (The original FIP has A.)
Special number of development:
Use in alphabetical order (I, M, 0, U, V, Wand Z are not used.)
Number of line:
Use arabic numerals. (Use perpendicular dot numbers in case of graphic type.)
' - - - - - - Special classification: Use "M" only for multidisplay type of FIP
' - - - - - - - Classification
X == Dot matrix type
GX == Graphic type
' - - - - - - - - - Number of digits/line:
Use arabic numerals for number of digits per one line.
(Use horizontal dot numbers in case of graphic type.)
'---_ _ _ _ _ _ _ _ NEC's abbreviation for fluorescent indicator panel
12-3
ftlEC
FIPs
Data Terminal and Others (Dot Type and Graphic Type)
No. 01
Digits
Character
Format, Symbol
Display
Conllg
Drawing
(Note 21
FIP16X1EA
16
5x7
A
3.95
2.3
260+0.8
820 +0.8
7.4 max
2.54
14.0
FIP16X1CA
16
5x7
A
5.05
3.3
340+0·8
8.5 max
2.54
14.0
FIP16Xl BAlFIP16B6X
16
5x7,OP
B
6.0
4.2
34.0 ±1.0
1000 +0.8
· -0.3
125.0 ±1.0
9.5 max
2.54
14.0
FIP16X1FA
16
5x7
A
9.1
6.28
410+0·8
170.0 ±1.0
8.5 max
2.54
14.0
FIP16X1KA
16
5x7
A
5.0
3.22
96.7 ±O.5
6.5 ±0.5
2.54
6.2
208 0 +0.8
9.85 max
2.54
14.0
14.0
Type No. (NOIe 11
Oulline Dimensions (In millimetersl
Character
Panel
Lead
Height
Width
Height
Length
Thickness
Pilch Length
· -0.3
· -0.3
· -0.5
. -0.3
FIP16XM1 BA/FIP16B11X
16
5x7, OP, COMMA
C
11.3
7.25
19.5±0.5
410+0.8
FIP16XM1CA/FIP16CllX
16
5x7. DP. COMMA.
CURSOR (V)
D
11.3
7.25
43.2 max
208.0 ~:~
9.85 max
2.54
FIP16XM1DA/FIP16011X
16
5x7. DP. COMMA.
CURSOR (V)
o
11.3
7.25
43.2 max
2080+0·8
9.9 max
2.54
14.0
· -0.3
· -0.3
· -0.3
FIP17X1AA
17
5x7
A
6.0
3.8
19.6±1.0
118.0 ±to
6.5 ±0.7
2.54
9.5
FIP10XM2AA
20
5x7. OP. COMMA. OCT
E
11.3
7.25
70.0 ±to
140.0 ±to
12.3 ±0.7
2.54
7.4
1157+0·8
FIP20X1LB
20
5x7
A
5.0
3.5
205+0.7
· -0.5
6.1±0.7
2.54
6.2
FI P20X1 AAI FI P20A5X
20
5x7. CURSOR
F
5.05
3.55
34 0 +1.0
138.0±0.7
8.5 max
2.54
14.0
FIP20X1EA/FIP2009X
20
5x12
G
8.75
3.5
33.0 ±to
144.0 ±to
78+1.5
2.54
5.5
138 0 +0.6
· -0.5
· -0.5
FI P20X1 CAl FI P20B9X
20
5x12
G
8.8
3.55
410+0.8
FIP20X1DB
20
5x7
A
9.0
6.3
41.0 ±0.5
FIP20X1KA
20
5x12
G
15.85
6.4
42.4 ±to
FIP20X1MA
20
5x7
A
8.99
6.3
41.0 ±0.5
FIP20XM1AA
20
5x7. DP. OCT
H
11.3
7.25
FIP20XM1BA
20
5x7, OP, COMMA, OCT
o
11.3
7.25
FIP12XM2AA
24
5x7. OP, COMMA, DCT
8.15
FIP24X1AA/FIP24A7X
24
5x7
A
6.75
FI P26Xl AAI FI P26A9X
26
5x12
G
FIP16XM2AA/FIP32A11X
3216x2
line
5x7, OP. COMMA,
2 line
FIP16X2BA
32
16x21ine
5x7
32
5x7, CURSOR
FIP32X1BA/FIP32B5X
FIP32X1CA/FIP32A9X
32
5x12
FIP18X2AA
3618x2
line
5x7, OP. COMMA,
2 line
FI P20X2AAI FI P40C5X
4020x2
line
5x7.2line
FIP20X2CA
4020x2
line
5x7, OP, COMMA,
2 line
· -0.3
· -0.3
2080+1.0
· -0.5
· -0.5
83+1.0
2.54
7.4
8.0 ±0.7
2.54
14.0
9.5 ±0.7
· -0.8
2.54
14.0
8.0 ±0.7
2.54
14.0
49.0 ±1.0
208.0 ±1.0
2025+0.8
· -0.3
244.0 ±to
11.3 ±0.7
2.54
14.0
42.4 ±1.0
244.0 ±to
9.2 ±0.7
2.54
14.0
5.25
58.0 ±1.0
130.0 ±to
11.3 ±0.7
2.54
14.0
4.75
33.0 ±to
185.0 ±to
2.54
13.0
8.75
3.0
43.0 ±0.5
160.5±0.5
85+1.0
· -0.7
10.0 max
2.54
14.0
11.3
7.25
GO.O ±1.0
208.0 ±1.0
13.0 max
2.54
14.0
A
5.38
3.03
39.0~~:~
98.0~~:~
7.8~~:~
2.0
10.0
F
5.35
3.55
34.0 ~~:~
185.0 ±0.5
10.0 max
2.54
14.0
8.8
3.55
208.0 ±1.0
10.2 max
2.54
14.0
9.1
6.4
41 0 +0.8
· -0.3
GO.O ±to
208.0 ±to
11.3 ±0.7
2.54
14.0
5.05
3.55
41.0 ~:~
125.0 ~~:~
7.8 ±0.7
2.54
14.0
11.3
7.25
60.0 ±1.0
252.0 ±1.0
12.0 max
2.54
16.0
G
A
Noles:
(1) These characteristics are given when the panels are turned on at the recommended electrical ratings and in case of AC filament mode when eb a
is also supplied from the center tap of the filament transformer.
(2) See the display configuration drawing table that follows to match the example of the display with the letter codes in the display configura'
drawing column.
12-4
t-{EC
FIPs
Recommended Electrical Ratings
Mode
~ode
II
:if.
\C
E,
I,
IV rms)
4.2
ImArms )
01
Dper.
22
dynamic
eb = ee IV p.p)
'Eb = Ee
IVde)
22
1/18
'b/dig.
ImA)
'ib/l seg
ie/dig.
ImA)
4.5
1.6
1.4
Icd/m2)
690
(200)
Duty
H
Itt.L)
\C
5.2
23
dynamic
28
1/20
5
2.5
2.0
690
(200)
\C
4.3
78
dynamic
35
1/20
5
2.3
2.4
690
(200)
\C
4.8
120
dynamic
35
1/20
5.5
10.0
10.0
690
(200)
\C
5.2
34
dynamic
25
1/20
5.0
2.5
2.5
860
(250)
\C
8.3
106
dynamic
35
1/20
7
20.0
12.0
1030
(300)
\C
8.3
133
dynamic
43
1/38
8
28.0
20.0
1720
(500)
\C
8.3
133
dynamic
43
1/38
8
26.0
23.0
1720
(500)
\C
4.4
78
dynamic
50
1/20
7
6.0
7.0
2740
(800)
\C
5.0
260
dynamic
35
1/23
6
10.0
10.0
1200
(350)
\C
5.6
38
dynamic
27
1/25
6
2.7
2.9
690
(200)
\C
5.7
56
dynamic
35
1/24
5.5
3.5
3.5
1030
(300)
\C
5.0
78
dynamic
25
1/25
5.5
4.5
5.5
690
(200)
\C
5.1
78
dynamic
35
1/24
6
10.0
6.0
690
(200)
\C
6.4
120
dynamic
35
1/24
8.5
9.0
9.0
1030
(300)
8.3
130
dynamic
35
1/24
9
16.0
14.0
690
(200)
\C
6.4
120
dynamic
45
1176.8
10.0
21.0
15.0
860
(250)
\C
9.6
156
dynamic
45
1/25
10.0
20.0
25.0
1710
(500)
\C
9.6
130
dynamic
45
1/25
10.0
20.0
25.0
1710
(500)
\C
4.6
189
dynamic
45
1/26
15.0
22.0
1710
(500)
\C
6.5
75
dynamic
40
1/30
6
13
5.4
6.6
690
(200)
\C
\C
5.7
78
dynamic
40
1/32
3.0
690
(200)
8.3
212
dynamic
35
1120
7
. 10
5.0
\C
30.0
25.0
1030
(300)
\C
6.8
78
dynamic
45
1/35
7
3.0
2.4
690
(200)
IC
8.4
78
dynamic
42
1140
8.5
8.0
7.0
690
(200)
IC
8.0
208
dynamic
45
1145
9
14.0
15.0
690
(200)
\C
6.0
125
dynamic
50
1/45
5
4.0
4.0
860
(250)
\C
9.5
212
dynamic
35
1124
10
30.0
25.0
860
(250)
\C
8.0
260
dynamic
45
1150
9
20.0
18.0
690
(200)
12-5
ttlEC
FIPs
Data Terminal and Others (Dot Type and Graphic Type) (cont)
No.oI
Digits
Character
Format, Symbol
Display
Conllg
Drawing
(Note 21
Height
Width
Height
Length
Thickness
Pitch Length
FIP20X2BA
4020x2
line
5xl2,2line
G
15.85
6.4
68.0±1.0
208.0 ±to
12.3 ±0.7
2.54
FIP20X2EA
4020x2
line
5x7, CURSOR
F
5.05
3.55
49.0~~:~
142.0~~:~
10.0 ±0.7
2.54 14.0
FI P40Xl AA I FI P40A5X
40
5x7, CURSOR
K
5.05
3.55
220.0 ±0.7
10.0 max
2.54
7.0
FIP40X1DA/FIP40E5X
40
5x7
A
5.05
3.55
220.0 ±O.7
10.0 max
2.54
8.76
FIP40X1HB
40
5x7, CURSOR
F
5.05
3.55
220.0 ±O.7
8.0 ±0.7
2.54
14.0
2400+0·8
· -0.3
2400+0.8
· -0.3
100 +1.0
. -0.8
2.54
14.0
11.0 max
2.54
9.5
Type No. (Note 11
Outline Dimensions (In mlilimetersl
Character
Panel
Lead
14.0
FIP40Xl FB/FIP40B9AX
40
5x12
G
8.8
3.55
FI P40Xl GAl FI P40C9X
40
5x12, CURSOR (V)
L
8.8
3.55
34 0 +1.0
· -0.5
340+1.0
· -0.5
340 +0.8
· -0.5
410+0.8
· -0.3
410+0.8
· -0.3
FIP24X2AA
48
24x2line
5x7, CURSOR
F
4.51
2.5
34.0~~:~
124.0~~:~
78+0.7
. -0.5
2.0
14.0
FI P20X3AAI FI P60A5X
60
20x31ine
5x7,3line
A
5.05
3.55
49.0 ±to
138.0 ±1.0
11.0 max
2.0
10.2
FIP32X2AA
64
32x21ine
5x7, CURSOR,
2 line
F
5.35
3.55
500 +0.8
· -0.3
185.0 ±0.7
10.3 ±0.7
2.54
14.0
FIP20X4AA
80
20x41ine
5x7,4line
A
11.3
7.25
90.0 ±to
240.0 ±to
13.3 ±O.7
2.54
10.0
FIP40X2CB
80
40x21ine
5x7, CURSOR,
2 line
F
5.35
3.55
50 0 +0.8
· -0.3
220.0 ±0.7
12.2 max
2.54
14.0
FIP40X2CC
80
40x2 line
5x7, CURSOR
F
5.05
3.55
490+0.8
· -0.3
220.0 ±O.7
12.2 max
2.54
14.0
FIP40X2BAI FIP80A9X
80
40x21ine
5xl2,2line
G
9.35
3.55
60.0 ±to
238.0 ±to
12.0 max
2.54
14.0
FIP42X2AA
80
42x2 line
5x7, CURSOR,
2 line
F
5.35
3.55
67.0 ±to
228.75 ±to
11.0 ±0.7
2.54
14.0
FIP80A6BX
80
5x12
G
6.29
1.8
44.0~~:~
300.0~~:~
10.0 ±0.5 2.54
5.5
FI P80X2AA I FI P160A4X
160
80x21ine
5x7, CURSOR,
2 line
F
3.55
2.05
440+0·8
· -0.3
298 0 +0.8
· -0.3
10.0 ±0.7
2.54
7.0
FIP40X6AA
240
40x61ine
5x7, CURSOR,
61ine
A
5.0
3.5
90.0 max
250.0 ±to
14.0 max
2.0
20.0
FI P48GX7AAI FI P48A8XT
48x7, GRAPHIC
7.9
57.1
34.0 ±to
93.0 ±to
9.5 max
2.54
7.4
FIP72GX7AA
72x7, GRAPHIC
7.9
85.9
32.7 ±to
122.5 ±to
9.5 max
2.54
14.0
128x20, GRAPHIC
29.7
191.7
60.0 ±to
238.0 ±to
13.0 max
2.54
14.0
FIP128GX20AAI
FIP36Al0XT
FIPI80GX48BA
lBOx48, GRAPHIC
29.54
111.38
60.0 ±1.0
156.0 ±to
11.0 max
1.27
20.0
FI P280GX60AA I
FIP240A4XT
280x60, GRAPHIC
38.75
181.75
70.0 ±1.0
265.0 ±to
12.0 max
1.27
20.0
12-6
t-IEC
FIPs
Recommended Electrical Rallngs
E,
(Vrmal
(mArmsl
Mode
01
Oper.
AC
8.9
78
dynamic
45
1/50
AC
8.9
78
dynamic
45
AC
8.9
78
dynamic
AC
8.9
78
AC
9.0
78
AC
9.7
AC
Mode
01
FII.
eb = ee (Vp_pl
*Eb = Ee
(Vdel
Duty
(-I
Ib/dlg.
(mAl
*ib/1 seg
ie/dig.
(mAl
(cd/m21
(llLI
8
4.4
3.5
690
(200)
1/50
10
7.0
6.0
690
(200)
45
1/50
8
4.4
3.5
690
(200)
dynamic
45
1/50
10
7.0
6.0
690
(200)
dynamic
45
1/50
7
7.5
7.0
690
(200)
78
dynamic
45
1/50
9
15.0
10,0
690
(200)
9.7
104
dynamic
43
1/50
9
15.0
12.0
690
(200)
AC
4.6
162
dynamic
36
1/26
5
10.0
7.5
1030
(200)
AC
4.8
156
dynamic
48
1/25
9
5.0
15.0
1270
(400)
AC
6.8
156
dynamic
45
1/40
8
15.0
15.0
860
(250)
AC
9.0
432
dynamic
35
1/24
10
14.0
60.0
600
(175)
AC
9.0
156
dynamic
45
1/50
8
15.0
15.0
860
(250)
AC
9.0
156
dynamic
45
1/45
8
8.0
15.0
690
(200)
AC
9.7
156
dynamic
45
1/50
8
15.0
15.0
860
(250)
AC
9.2
156
dynamic
45
1/50
10
6.0
22.0
690
(200)
AC
9.3
160
dynamic
55
1/113
15
10.0 max
5.0
690
(200)
AC
8.2
200
dynamic
48
1/100
10
7.0 max
11.0 max
510
(150)
AC
8.8
312
dynamic
50
1/50
10
4.5
27.0
690
(200)
AC
AC
AC
3.0
78
dynamic
35
1/18
5
0.2*
4.0
1030
(300)
AC
AC
I,
L
4.2
78
dynamic
36.2
1/24
6
4.8
4.3
820
(240)
9.2
234
dynamic
60
1/75
12
0.7*
15.0
690
(200)
52
5.3
312
dynamic
8.9
450
dynamic
1/100
6
4.0
4.0
690
(200)
1/175
12
0.1*
6.0
690
(200)
12-7
ftlEC
FIPs
Display Configuration 18ble
D ____________
A _ _ _ _ _ __
.....
.....
:::::
.....
FIP16X1EA
FIP16X2BA
•••••
.....
•••••
•••••
•••••
•••••
•••••
••••••
••••
•••••
••••••
••••
•••••
•••••
FIP20X1MA
FIP16X1CA
FIP24X1AAlFIP24A7X
FIP20X4AA
•••••
•••••
•••••
•••••
•••••
•••••
• • • • • FIP16X1FA
::::: FIP20X2AAlFIP40C5X
FIP20X3AAlFIP60A5X
FIP40X1 DAlFIP40E5X
•••••
•••••
•••••
•••••
•••••
•••••
8 _ _ _ _ _ _ _ _ _ ____
•••••
FIP16X1KA
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
• ••• : FIP16XM1BA/FIP16B6X
•••••
::::: FIP17X1AA
.....
,
••••••
••••
C
•••••
•••••
•••••
•••••
•••••
::::: FIP20X1LB
•••••
•••••
•••••
•••••
•••••
•••••
•••••
12-8
••••••
••••
••••••
••••••
••••
••••
••••••,.
••••••
••••
•••••
••••• •
,
FIP20X1DB
FIP16XM1 CAlFIP16C11X
FI P16XM1 DAIFI P16 D11X1
FIP16D11AX
FIP20XM1BA
....
•••••
E _____________
•••••
•••••
•••••••
••••
•••• ,.
•••••••
••••••
••••
•••••
•••••
•••••
••••• ,.
••••••
FIP10XM2AA
FIP16XM1BA/FIP16B11X
ttlEC
FIPs
Display Configuration Table (cont)
L _ _ _ _ _ _ _ _ __
F
•••••
•••••
•••••
•••••
•••••
•••••
.....
FIP20X1AA/FIP20A5X
FIP32X1BA/FIP32B5X
FIP40X1HB
FIP32X2AA
FIP40X2CB
FIP40X2CC
FIP80X2AAlFIP160A4X
FIP42X2AA
FIP40X6AA
FIP20X2EA
FIP24X2AA
G
•••
•••
•••
•••
•••
•••
•••
•••
•• •
•••
•••
•••
FIP20X1 EAlFIP20D9X
FIP20X1CAlFIP20B9X
FIP26X1AA
FIP26A9X
FIP32X1 CAl FIP32A9X
FIP40X1 FB/FIP40B9AX
FIP80A6BX
H ____________________
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
•••••
FIP20X1KA
FIP20X2BA
FIP40X2BA/FIP80A9X
..... FIP80X1AA/FIP80A6X
•••••
•••••
•••••
•••••
•••••
•••••
••••• •
'"
J _ _ _ _ _ _ _ __
..-..
••••••
••••
••••••
••••
•••••
•••••
••••••
____
FIP16M2AA/FIP32A11X
FIP18X2AA
FIP20X2CA
M _ _ _ _ _ _ _ __
•••••
•• ••••
•••••
••••
EEEEE
• ••••
FIP40X1AA/FIP40A5X
FIP40A5AX
FIP20XM1AA
N _______________
K __________
•••••
•••••
•••••
•••••
•••••
•••••
••••••
'"
••••••
••••
••••••
••••
•••••••
••••
•••••
'"
•• ••••
••••
•••••
••••
••••••
•• ••••
••••
••••
••• ••••
••••
••••
•••••••
••••
!:::! FIP40X1GA/FIP40C9X
FIP12XM2AA
12-9
ftlEC
FIPs
Data Terminal and Others (Alphanumeric Type)
Outline Dimensions (in millimetersl
Type No. (Note 11
No. 01
Digits
Character
Forma\, Symbol
Character
Height
Width
Height
Panel
Length
Thickness
Pilch Length
Lead
7S.0 ±1.0
7.5 ±O.7
2.54
20.0
65.5 max
7.3 max
2.54
14.0
7.0
70.0. ±1.0
65+0·5
. -1.0
2.54
9.2
FIP6ASR
6
1111:11
S.15
4.4
FIPSA5R
FIPSA5AR
S
IIIIIIII
5.0
3.0
2S.0 HO
24.5 +0.5
FIPSA6R
S
5.5
3.0
20.0 HO
FIP10A6R
10
IIIIIIII
11.11111111.
6.0
3.0
22.S HO
75.2 ±0.7
7.2 max
2.54
24.0
FIP12AllR
12
Ii.UIUUUIi.ill.
10.7
6.35
31.0 HO
160.0 ±1.5
10.0 max
14.0
FIP16A5R
FIP16A5CR
FIP16AllR
16
;;;;:;;;@::=;##:
5.0
3.0
20.0 ±1.0
110.0 H5
S.O max
2.54
2.54
16
11111111111 ........ 1
10.7
6.35
31.0 HO
200.0±1.5
7.4
16
11111::1.::11::111
12.5
7.0
33.0 HO
205.0 ±1.0
S.O ±O.7
10.0 max
2.54
FIP16B13R
5.0S
10.0
FIP20B6R
FiP20B9AR
20
11111,.'::111=.';:11
6.0
3.0
22.S HO
134.0 HO
9.2 max
2.54
14.0
20
........IlII .... U ...
9.0
5.0
33.0 HO
205.0 ±1.0
9.6 max
2.54
14.0
FiP32A6R
32
I:::U:::::::::::::::'::;;;I':::::
6.0
3.0
2.54
14.0
32
,..........",,,.. uu,,,.u,,,,
6.0
3.5
202.0 ±1.5
20S 0 +0.8
9.2 max
FiP32B6R
30.0 ±1.0
410+0·8
2.54
14.0
FIP32D6R
32
................................
. -0.3
10.2 max
6.0
3.2
10.2 max
2.54
14.0
FIPSOB5R
SO
40x2line
14 segment.
CURSOR. COMMA. 2 line
5.0
3.0
41.0 ~:~
39.0 ±1.0
208 0 +0.8
250.0 ±1.0
9.7±0.7
2.54
10.0
-0.3
. -0.3
. -0.3
10.0
Noles:
(1) These characteristics are given when the panels are turned on at the recommended electrical ratings and in case of AC filament mode when eb or E
is also supplied from the center tap of the filament transformer.
12-10
t-IEC
FIPs
Recommended Eleclrlcal Ratings
dynamic
eb = ee (V p_pl
'Eb = Ee
(Vdel
26
1/20
Ek
(Vdcl
4.0
22
dynamic
24
1/20
2.3
78
dynamic
30
1/20
3.9
16.5
dynamic
26
1/16
5.0
2.5
2.5
860
(250)
5.9
104
dynamic
28
1/20
6.0
1.5'
8.5
1200
(350)
5.5
4.8
16.5
40.0
dynamic
24
1/20
6.0
2.5
3.0
3.0
690
1230
(360)
AC
AC
AC
AC
AC
AC
8.0
104
dynamic
28
1/20
7.0
to'
8.5
1200
(350)
7.2
75
dynamic
47
1/20
15.0
8.0
9.0
1030
(300)
5.8
37
dynamic
32
1/24
7.0
3.5
3.5
1030
(300)
7.2
130
dynamic
35
1/24
8.5
9.0
9.0
690
(200)
7.5
50
dynamic
38
1/40
10.0
5.0
5.0
860
(250)
6.8
80
dynamic
45
1/40
7.0
5.0
5.0
890
(260)
AC
8.4
78
dynamic
45
1/40
8.0
7.0
7.0
890
(260)
AC
9.5
162
dynamic
40
1/48
8.5
5.0
12.0
690
(200)
Mode
of
FIt_
E,
(Vrmll
2.4
(mArmsl
125
3.0
AC
AC
AC
AC
AC
AC
I,
Mode
of
Dper_
Duty
(-I
Ib/dlg_
(mAl
'Ib/l seg
le/dlg(mAl
(cd/m21
(fHI
4.5
9.8
620
(180)
3.0
2.5
2.5
690
(200)
3.5
0.3'
6.0
1370
(400)
l
200
ItI
,.,
12-11
NEe
FIPs
Automotive and Others
Outline Dimensions (In millimeters)
Type No. (Note 1)
No. 01
Digits
Character
Format. Symbol
Character
Panel
Lead
Height
Width
Haight
Length
Thlcknass
Pitch Langth
FIP4C5
4
; 8:8. 8
5.0
2.4
14.5 ±to
41.0 ±to
60+0·5
· -0.7
2.0
FIP4B6S
4
a8·B.8
6.0
3.0
18.5 ±to
44.0 ±to
6.5 max
2.0
8.7
FIP4F6S
4
aB:BB
6.0
3.0
18.5 ±1.0
44.0 ±to
2.0
5.21
LD8164/FIP4A8S
4
7.6
4.0
24.5 ±1.0
55.4 ±to
2.54
8.7
FIP4B8
4
BB:BB
BB:BB
7.6
4.0
24.5 ±1.0
55.4 ±1.0
2.54
10.5
FIP4B8AS
4
88:88
7.6
4.3
24.5 ±to
55.4 ±to
2.54
8.7
FIP4E8S
4
4.0
20.0 ±1.0
48.0 ±1.0
2.54
8.7
FIP4E8BS
4
7.6
4.0
20.0 ±to
48.0 ±1.0
2.54
8.2
FIP4Y8S
4
IB:B8
IB.'88
IB:BB
7.6
6.5 max
65+0·5
· -1.0
65+0.5
· -1.0
65+0·5
· -1.0
65+0.5
· -1.0
6.1 ±0.5
7.6
4.0
20.0 ±to
48.0 ±to
2.54
8.7
FIP4S8S
4
H8,88
(Note 2)
7.6
4.0
24.5 ±to
55.4 ±1.0
2.54
8.2
FIP4Q8S
FIP4Q8AS
4
18:B8
(Note 2)
8.0
4.4
20.0 ±to
48.0 ±to
2.54
8.2
5.0
FIP4E13S
4
BB:BB
12.6
6.6
29.0 max
79.0 max
FIP5C8S
5
3.6
24.5±1.0
55.4 ±1.0
FIPSF6
6
6.0
2.7
FIPSF8
6
/:88:88.
RH
FH I 8:8.8
'8 B:B B.B.B.
7.6
7.6
4.0
17.0 ±1.0
22.8 ±to
~
6.5±O.7
65+0.7
· -1.0
6.5 ±0.7
6.0
2.0
10.0
2.54
8.7
62.5 ±to
7.5 ±1.0
65+0·5
· -1.0
6.5 max
2.54
8.0
75.2 ±1.0
7.7 ±1.0..
2.54
10.5
Notes:
(1) These characteristics are given when the panels are turned on at the recommended electrical ratings and in case of AC filament mode when eb or,
is also supplied from the center tap of the filament transformer.
(2) White back
12-12
ftlEC
FIPs
Recommended ElectrIcal RatIngs
Mode
of
Fil.
eb = Be (Vp·pl
*Eb = Ec
(Vdel
Duty
(-I
Ek
(Vdel
Ib/dlg.
(mAl
*lb/1 seg
Ie/dIg.
[mAl
(cd/m21
(H.LI
22
116
2
1.2
1.5
1710
(500)
Ef
(Vrmal
If
(mArmal
ModB
of
Oper.
AC
1.2
52
dynamic
DC
DC
DC
1.6
57
static
12*
0.7
4.0
2060
(600)
1.3
90
static
10.5*
0.9
7.0
2740
(800)
1.7
78
static
12*
0.8
6.0
1370
(400)
DC
1.7
78
dynamic
24
3.2
4.5
1440
(420)
AC
1.7
78
static
18*
1.5
8.5
2570
(750)
DC
1.4
78
static
12*
0.8
5.0
1370
(400)
DC
DC
DC
1.4
78
static
12*
0.8
5.0
2060
(600)
1.5
110
static
12*
1.4
8.0
2740
(800)
1.7
104
static
12*
1.4
7.5
2740
(800)
DC
1.5
110
static
12*
1.9
8.0
2740
(800)
AC
DC
2.3
108
static
12*
1.0
13.0
1030
(300)
1.7
78
static
12*
1.1
6.0
1370
(400)
DC
DC
2.3
85
dynamic
21
117.5
3
1.6
2.0
1540
(450)
2.3
78
dynamic
24
117.5
3
2.6
3.6
1710
(500)
117.5
L
12-13
t\'EC
FIPs
Audio, Analog Instrument, and Others
Oulllne Dimensions lin millimeters)
Type No. (Note 1)
No. of
Digits
Character
Character
Formal. Symbol
Panel
Lead
Height
Width
Height
Length
Thickness
Pitch Length
FIP2A13
2
·BB
12.5
6.6
2B 0 ±to
. -0.5
SO.0±1.0
7.5 ±1.0
2.54
10.0
FIP2A15S
2
BB
15.0
B.O
33.0 ±1.0
55.0 ±1.0
BO+1.5
. -0.5
2.54
10.0
,., ,., ,-, t-,
FIP4H5
4
FIP6ABB
6
"
""
::: "
/8:8.8
~:
FIP6ABS
6
FIP7ABS
FIP7ABAS
FIP7BBS
FIP7BBAS
7
7
FIP7DB
FIP7DBA
FIP7DBF
7
FIP7EBS
7
FIP7FBS
FIP7GB
FIP7GBA
FIP7GBD
7
7
FIP7PB Series
FIP7QB Series
7
7
FIP9B6
FIP9B6A
9
FIP9LM6
FIP9BM12
9
: 8 B.B
~
5.0
2.5
14.5 ±1.0
41.0 ±1.0
6.5 ±O.7
2.54
B.O
7.62
3.B
22.B ±1.0
75.2 ±1.0
7.7 ±1.0
2.54
10.0
B.O
4.B
2B.0 ±1.0
7B.0 ±1.0
7.5 ±1.0
2.0
7.5
f! I B B.B8:!
B.O
4.B
2B.0 ±1.0
7B.0±1.0
7.5 ±1.0
2.0
\~
B.O
4.B
2B.0 ±1.0
7B.0 ±1.0
7.5 ±1.0
2.0
7.5
3.5
7.5
3.5
B.O
4.6
2B.0 ±1.0
7B.0±1.0
7.5 ±1.0
2.54
7.5
2.7
3.2
(Note 2)
B.O
B5.0 ±1.0
7.7
24.5 ±1.0
2.0
7.7
B.O
4.6
2B.0 ±1.0
B5.0 ±1.0
7B.0 ±1.0
7.5 ±O.7
7.5 ±0.7
2.0
B.O
4.5
4.5
24.5 ±1.0
(Note 2)
7.5 ±1.0
2.54
7.5
3.2
3.2
I B B.B::::
f: J B B.BB:
B.O
B.O
4.6
4.6
24.5 ±1.0
24.5 ±1.0
76.0 ±1.0
76.0 ±1.0
6.1 ±0.7
6.1 ±0.7
2.54 15.010:
2.54 15.010:
B. B. 8. 8. B. B. B..8. 8.
5.5
2.65
20.0 ±1.0
70.0 ±1.0
6.5 ±0.5
2.54
5.0
2.5
24.5 ±1.0
76.0 ±1.0
7.5
2B.0 ±1.0
20.0 ±1.0
9B.0 ±1.0
B6.0 ±1.0
6.1 ±0.7
7.5 ±0.7
2.54
3.0
4.0
6.5 ±0.7
2.54
2.54
13.7
15.0
33.0 ±1.0
98.0 ±1.0
B.O ±0.7
2.54
188.88 'r.:
~~
I B B.BB:
:'-IBBBB ::i'l B BB B:!
,! I B B.Bs=
~:
.. , , '. . . . . .
_,
_
"UI
",.. as.B8S.' 8
... '_ . . .
-..
_ _I
~I BB.B'BiiifB
7.0
B.O
FIP10CW19V
FIP10CW19AV
FIP12AW7VS
10
'1111111111'
lB.5
70.0
12
FIP24BW15VS
FIP4BAW14VS
24
..IIII111.n
FIP60B30T
60
FIP9GB
9
9
r,'
48
",.. aBaBS ;;'"
3.5
9.0
:DZ7.CCCt..JI.r.Cu':C
7.0
71.05
20.0 ±1.0
9B.0 ±1.0
7.5±O.7
2.54
9.5
7.0
7.5
~~-7-:--7-.~
15.0
14.0
72.0
71.3
2B.0 ±1.0
28.0 ±1.0
98.0 ±1.0
102.0 ±1.0
7.5 ±0.7
8.0 ±0.7
2.54
2.54
12.2
13.5
O·
35.0
50.0
55.0 ±1.0
91.0 ±1.0
12.0 max
2.0
4.5
~,....
Notes:
(1) These characteristics are given when the panels are turned on at the recommended electrical ratings and in case of AC filament mode when eb or E
is also supplied from the center tap of the filament transformer.
(2) Green/amber
12-14
ftt{EC
PIPs
Recommended Electrical Ratings
Mode
Mode
FII.
E,
(Vrmsl
I,
(mArmsl
Dper
eb = Ie (Vp.pl
·Eb = Ee
(Vdel
AC
1.7
58
dynamic
24
AC
1.5
75
stalic
18·
01
DC
AC
AC
AC
01
Duly
1/4
H
Ek
(Vdel
Ib/dlg.
(mAl
·ib/l seg
ie/dig.
(mAl
(cd/m21
(H.LI
3
2.0
4.5
860
(250)
1.5
4.0
750
(220)
L
1.5
40
dynamic
22
1/4
2
0.5
1.0
1030
(300)
2.6
53
dynamic
24
1/7.5
3.3
3.2
4.5
690
(200)
2.3
75
stalic
15·
0.4
6.0
860
(250)
2.3
75
stalic
15·
0.4
6.0
860
(250)
AC
2.3
75
slatic
15'
0.4
6.0
860
(250)
AC
2.3
75
dynamic
26
1.8
3.0
690
(200)
AC
AC
AC
3.0
78
static
15·
0.7
10.0
2400/120
(700/35)
3.0
78
static
15·
0.7
10.0
24001120
(700/35)
2.6
78
dynamic
24
1/9
3.5
1.5
2.5
690
(200)
AC
AC
AC
2.3
106
dynamic
26
1/7
4
2.5
4.5
1370
(400)
AC
AC
AC
AC
AC
AC
AC
AC
117
4
2.3
106
dynamic
24
1/9
4
2.5
4.5
890
(260)
4.4
14
dynamic
22
1/12.5
5
1.1
1.8
580
(170)
(280)
2.8
106
dynamic
26
1/10
4
1.3
2.5
960
3.6
135
dynamic
26.5
1/10
5.5
3.0
5.5
690
(200)
3.7
82
dynamic
26.3
1/12.5
5.4
3.0
5.0
1030
(300)
4.1
120
dynamic
28.5
1/11.4
5.8
2.0'
8.0
1030
(300)
3.3
52
static
15·
0.4·
9.0
1030
(300)
3.6
132
static
13"
17.0
1300
(380)
3.7
136
static
14·
0.28"
0.75·
16.0
1370
(400)
2.7
196
dynamic
eb=30
ec = 15
O.g·
10.0
690
(200)
113
3
12-15
IfJI
ttiEC
FIPs
Digital Clock, Timer, Measuring Meter, and Others
Oulline Dimensions (In millimetersl,
Type No.INota 11
No. of
Digits
Character
Character
Format, Symbol
Panel
Height
Width
Height
Lead
Length
Thickness
Pitch Length
2.54
12.5
2.54
6.7
FIP4A6
4
BB: BB
5.5
2.7
20.0 ±1.0
48.0 ±1.0
FIP4B8B
4
7.6
4.0
24.5 ±to
55.4 ±to
7.6
3.6
24.5 ±1.0
55.4 ±to
8.5
5.0
28.5 ±1.0
78.2 ±to
6.5 ±0.7
65+0·5
· -1.0
65+0.5
· -1.0
7.5 ±0.7
FIP4F8S
4
88:88
8.8:8.8
FIP4C9B
4
~ ~8~8~
LD8213/FIP4A 13S
4
BB:BB
12.6
6.6
29.0 max
79.0 max
LD8241/FIP4B13
4
4
mB:Bm.
12.6
6.6
28.0 ±to
78.0 ±1.0
BB:BB
12.5
7.0
28.0 ±to
'BB:BB
l!l. 8.:8. l!l.
12.5
6.8
15.0
15.0
15.0
8.4
7.6
3.6
7.6
7.6
FIP4C13A
FIP4C13C
FIP4F13S
4
FIP4A15A
4
FIP4B15S
4
S.
2.54
8.7
2.54
20.0
7.5 ±to
2.0
10.0
7.5 ±to
2.54
10.0
78.0 ±1.0
8.5 max
2.54
9.7
20.5
28.0 ±to
78.0 ±1.0
7.5±0.7
2.0
8.2
8.4
33.0 ±to
98.0 ±1.0
7.8±0.7
2.54
6.2
8.4
33.0 ±to
98.0 ±1.0
7.8±O.7
2.54
10.5
33.0 ±to
98.0 ±1.0
10.5
55.4 ±to
2.54
10.5
3.6
24.5 ±to
55.4 ±1.0
3.6
24.5 ±1.0
55.4 ±to
7.6
3.6
24.5 ±1.0
55.4 ±to
12.6
6.0
78.2 ±to
780+1.2
7.8 ±O.7
65+0·5
· -1.0
65+0·5
· -1.0
65+0·5
· -1.0
65+0·5
· -1.0
7.5 ±1.0
2.54
24.5 ±to
FIP4C15
4
FIP5A8B
5
FIP5D8S
5
FIP5D8
5
FIP5F8S
5
FIP5B13S
5
BB:BB
'BB:BB
8.8.19.8.8
tIi I e.B 8.
P88B8
: 8 8:8.8
:B8:88
FIP5D13A
5
:18:88.
12.5
6.6
28.5 ±to
280+1.5
. -{l.B
7.5 ±1.0
2.54
9.7
FIP5H13S
5
~~/B:BB
12.5
6.8
28.0 ±to
78.0 ±to
7.5 ±0.7
2.0
8.2
FIP5B15
FIP5D15S
5
5
15.0
8.0
33.0 ±to
8.4
33.0 ±to
98.0 ±1.0
98.0 ±to
7.8 ±0.7
15.0
7.8 ±0.7
2.54
2.54
5.2
10.5
FIP5D15AS
5
15.0
8.4
33.0 ±to
98.0±1.0
7.8 ±0.7
2.54
10.5
FIP5E15S
5
15.0
8.4
33.0 ±1.0
98.0 ±1.0
7.8 ±O.7
2.54 8.25
FiP5H15
5
15.0
8.0
33.0 ±to
98.0 ±1.0
7.8 ±0.7
4.0
10.5
FIP5K15S
FIP6F13
5
6
m.SI!I.SS
1118:88
1I18:B8
:1 B: B B.
IR 8.8. 8, Ii.
:aB:BB
15.0
8.0
33.0 ±1.0
98.0 ±to
7.8 ±O.7
6.8
33.0 ±to
98.0 ±to
FIP6l13
6
12.5
6.8
33.0 ±to
98.0 ±to
7.8 ±0.7
78 +1.0
2.54
2.54
10.5
12.5
FIP6C15
FIP6C15A
6
liB.B.B.B.i
15.0
8.0
33.0 ±to
110.0 ±to
FIP6D15A
FIP6D15B
6
:BBBBB
15.0
7.5
33.0 ±1.0
FIP9D7
9
8. B. 8. B. 8. 8. 8. 8. B.
6.5
3.4
20.0 ±to
maaaam
aaaaa,
(Note 2)
. -{l.B
2.54
8.7
2.54
10.8
2.54
8.7
2.0
10.0
· -{l.B
2.54
5.2
10.0
7.8 ±0.7
4.0
10.5
98.0 ±1.0
8.3 ±0.7
2.54
15.0
6.5
86.0 ±1.0
6.1 ±O.7
2.54
6.5
Noles:
(1) These characteristics are given when the panels are turned on at the recommended electrical ratings and in case of AC filament mode when eb or,
is also supplied from the center tap of the filament transformer.
(2) Gray back
12-16
ttlEC
FIPs
Recommended Electrical Ratings
Mode
Mode
01
Fir.
Dper.
eb = Ie IV p.p)
*Eb = Ee
IVdc)
Duty
I-I
Ib/dig.
ImA)
*ib/J sIg
le/dig.
ImA)
Icd/m 21
IH.L)
19
1/4
1.0
1.2
1030
(300)
1/8
If
01
ImArms)
DC
AC
1.5
52
dynamic
1.7
78
dynamic
24
DC
1.7
78
stalic
12*
AC
AC
AC
AC
2.4
75
dynamic
24
2.3
75
sialic
15*
2.3
75
dynamic
30
1/5
2.34
2.4
100
dynamic
26
1/6
AC
AC
AC
AC
DC
118
3.2
4.5
1370
(400)
1.1
6.0
1370
(400)
2.6
4.9
620
(180)
1.0
7.0
690
(200)
6
4.5
6.6
860
(250)
5
3.0
4.5
690
(200)
2
1.3
10.0
690
(200)
4
4.0
7.0
690
(200)
1.5
10.0
750
(220)
(180)
5
3.5
2.4
75
sialic
15*
3.0
75
dynamic
30
3.0
75
slatic
18*
3.0
75
dynamic
25
1/7
4
5.7
7.0
620
1.7
78
dynamic
24
1/5.33
2.5
3.0
4.0
2060
(600)
DC
1.7
78
sialic
12*
0.8
6.0
1370
(400)
AC
1.7
78
dynamic
30
3.2
4.0
1370
(400)
DC
1.7
78
sialic
12*
1.1
6.0
1370
(400)
AC
AC
3.0
58
slatic
24*
1.2
12.0
860
(250)
2.3
75
dynamic
26
3.0
4.0
620
(180)
2
1.3
10.0
690
(200)
4
8.0
15.0
620
(180)
1.5
1.5
1.5
1.5
1.5
10.0
750
(220)
10.0
750
(220)
1.5
15.0
750
(220)
AC
AC
AC
AC
AC
AC
AC
AC
AC
2.4
75
sialic
15*
3.3
100
dynamic
43
3.0
75
slatic
18*
3.0
75
slatic
18*
3.0
75
sialic
18*
115
1.5
1/12
116
1/28
3.2
150
dynamic
30
3.0
75
slatic
18*
3.2
100
dynamic
42
1/21
1/7.5
5
4
5
20.0
20.0
2400
(700)
1.5
1.5
10.0
750
(220)
4
9.5
11.0
1230
(360)
3.0
75
dynamic
26
117.5
6
3.8
4.2
690
(200)
AC
3.7
150
dynamic
30
1/7.5
5
10.0
13.0
2400
(700)
AC
3.3
100
dynamic
35
1/16
5
9.0
11.0
1030
(300)
AC
4.4
23
dynamic
22
1/12.5
5
2.9
2.9
580
(170)
12-17
IfJ
ttiEC
FIPs
ECR and Other.
Outllna Dlmanslons (In mlilimetars)
Type No. (Note 1)
No. 01
olglll
Character
Format. Symbol
Character
Haight
Panel
Laad
Width
Haight
Length
Thickness
Pitch Length
98.0 ±to
108 0 +2.0
· -0.5
98.0 ±1.0
7.8±0.7
4.0
10.5
10.0 max
2.54
10.0
2.54
7.4
2.54
5.2
5.08 10.0
FIP6C13
6
fJ,fJ,fJ,fJ,fJ,fB,
12.5
6.8
33.0 ±to
FIP6A13
6
qt,?,?,?,?,?,
13,0
6,5
39.0 ±to
FIP7B13
7
??????~
13.0
6.0
33.0 ±1.0
FIP8Bll
8
???????~
10.5
5.0
33.0 ±1.0
98.0 ±1.0
LD8217/FIP8All
8
11.0
5.3
31.0 ±1.0
112.0 ±1.5
FIP9J5
FIP9K5A
9
8. 8. 8. 8. 8. 8. 8. 8.
8. 8. 8. 8. 8. 8. 8. 8. 8.
'8.8.8.8.8.8.8.8.8.
8.0 ±0.7
78 +1.2
. -0.7
7.8 ±1.0
5.0
2.4
20.0 ±1.0
65.8 ±1.0
6.5 max
2.54
10.0
9
2.4
4.0
21.0 max
FIP9B8
FIP9B8B
5.0
7.6
24.5 ±1.0
66.0 max
100.0 ±to
6.5 max
8.5 max
2.54
2.54
14.0
16.5
12.5
FIP9F8
9
'B.' B.. 'B. 8.. 'B. ._,{j. 'B. 8.. 'm.
7.6
4.0
26.0 ±1.0
93 0 +1.5
. -0.5
7.8±O.7
2.54 35.0
FIP9Cl0
9
7B,B,B,B,B,B,B,i
9.5
4.0
100.0 ~:~
7.8 ±0.7
2.54 14.0
FIP9Bl0
9
9
8.8.8.8.8. 8. 8. 8. IE
B.B.B.B.B.B.B.!B. E
10.0
112.0 ±1.5
7.8 ±to
2.54 11.0
12.4
4.8
5.2
38 0 +0.8
. -0.3
31.0 ±1.0
31.0 ±1.0
127.0 ±1.5
7.8 ±to
5.08 10.5
3.7
FIP9A13A
9
B. B. B. B. B. B. B. BJlI.
12.5
6.8
33.0 ±1.0
135.0±1.0
FIP9C13
9
$:aa'a8:a8~Uit:
12.5
6.2
39.0 ±1.0
LD8221/FIP10B13
FIP10B13A
10
?,?,???,?,?,'?,?,$,
13.0
6.5
39.0 ±1.0
125.0 ±1.5
160 0 +2.0
· -0.5
75 +1.0
. -0.5
9.0 max
FIP10E13
10
?,?,?,??,????~.
13.0
6.5
40.0 ±0.7
FIP10A20
10
20.0
10.0
48.0 ±to
FIPllFl0
FIPllA13
11
gggB.'Sa8.a8.i
~ B'8. '8. '8. '8. '8. 'B.'EJ. 'i r
9.6
4.2
11
'B.'B.'B.'B.'B.'B.'B.'B.'B.'/R :
12.5
6.1
FIP11B13
11
??????????~
13.0
6.0
36.0 ±to
FIPllA15
11
B
B. B. '8.'8. B. BB. B. B. ii,
......................
15.0
8.0
FIP12A13
12
13.0
6.0
FIP13Kl0
13
9.5
4.3
FIP13B13
13
.?,?,?,?,?,?,?,?,?,?,?,~,
:: B.B.B. B.B. B. B.B. B.B.,,::
~~;f:'??? ??l1l?:l;l ??'e
39.0 ±to
400 +0.8
. -0.3
39.0 ±1.0
13.0
6.5
39.0 ±to
LD8185/FIP9A12
FIP9A12A
9
B.B.B.'B,'B,'B,'E/,'E/,W,
4.0
10.0
2.54 14.0
10.0 max
5.08 10.0
5.0
160.0 ±O.7
10.0 max
2.54
14.0
196.0 ±t5
14.0 max
4.0
10.0
24.5 ±1.0
113.0±1.0
33.0 ±1.0
147.0 ±1.0
7.5 ±0.7
8.5 max
2.54
4.0
16.0
10.0
147.0 ±1.0
8.0 ±0.7
2.54
7.4
185.0 ±1.0
10.0 ±1.5
4.0
15.0
160.0~:~
10.0 max
2.54 14.0
1380+2.0
· -0.5
166.0 ±t5
12.5 max
2.54 36.0
10.0 max
25.4
5.2
Note:
(1) These characteristics are given when the panels are turned on althe recommended electrical ratings and in case of AC filament mode when eb or I
is also supplied from the center tap of the filament transformer.
12-18
NEe
FIPs
Recommended Electrical Ratings
Mode
of
Fl!.
AC
AC
AC
AC
Ef
(Vrmsl
3.0
If
(mArmsl
100
dynamic
8b = Ie (Vp1I1
"Eb = Ee
(Vdel
26
3.2
120
dynamic
3.3
104
3.0
100
3.5
78
2.4
38
Mode
of
oper.
H
Ek
(Vde)
Ib/dig.
(mAl
"ib/l seg
ie/dig.
(mA)
(cd/m2)
(ilL)
117
4
2.7
4.5
690
(200)
35
1/16
7
5.0
8.0
690
(200)
dynamic
35
1/19
4
5.5
6.5
45
1/29
8
6.0
8.0
860
620
(250)
dynamic
dynamic
42
1116.5
5
5.0
8.0
550
(160)
dynamic
32
1/24
5
1.6
2.2
1030
(300)
Duty
L
(180)
AC
AC
AC
AC
3.0
23
dynamic
24
1/16
3
1.1
2.0
690
(200)
3.2
75
dynamic
25
1/18
5
2.3
4.0
620
1030
(180)
(300)
AC
3.2
75
dynamic
25
1/14
5
3.5
4.5
1030
(300)
AC
3.8
58
dynamic
33
1/30
7
6.0
7.0
750
(220)
AC
AC
3.5
75
dynamic
30
1/16
6
3.2
4.5
580
(170)
54
dynamic
45
1/8
6
6.0
8.0
550
1230
(160)
(360)
1114
4.6
AC
4.6
75
dynamic
45
1/12.5
10
3.6
7.0
690
(200)
AC
AC
3.9
140
dynamic
29
1/16
5
7.5
7.5
690
(200)
5.0
120
dynamic
35
1/16
7
5.0
8.0
690
(200)
AC
AC
AC
AC
AC
AC
AC
5.0
120
dynamic
35
1/16
4.5
5.0
8.0
1200
(350)
6.0
180
dynamic
43
1/16
9
12.0
16.0
860
(250)
4.8
78
dynamic
25
1/15
9.5
4.0
4.0
120
dynamic
35
1/16
7
5.0
7.0
690
690
(200)
4.8
5.5
78
dynamic
35
1/19
7
5.5
6.5
(250)
6.3
125
dynamic
45
1/29
8
11.5
15.5
860
620
5.9
106
dynamic
28
1/16
6
6.5
8.0
1200
(350)
AC
5.5
55
dynamic
30
1/16
5.5
6.0
6.0
1200
(350)
AC
5.2
120
dynamic
42
1/16
7
6.0
12.0
1200
(350)
(200)
(180)
12-19
--
NEe
FIPs
Calculator and Others
Character
Height
Width
Character
Format. Symbol
No. 01
Outline Dimensions lin millimeters)
Panel
Height
Length
Thickness
Lead
Pitch Lengt~
Type No.INOIe 11
Digits
LD8225/FIP8A5
8
~).
Ct. LI. O. Ct. Ct. Ct. 0.
4.5
2.3
17.0 ±to
58.0 ±to
6.5 max
2.54
6.2
LD8228/FIP8B5
8
n;"in,;,i;,;;
fJ. D. 0. O. D. D. D. D.
5.0
2.0
19.0 ±1.0
55.3 ~:~
7.2 max
2.54
7.0
FIP9D5
9
2.3
17.0 ±1.0
62.5 ±to
6.5 max
2.54
6.2
9
8. E:. E:. 8. 8.B. E:. 8. 8.
aEl.aEl.B.8.El.s.8.
'8. B. a B.a 8. 8. 8. 8.
4.5
LD8191/FlpgA5
5.0
2.4
20.0 ±1.0
65.8 ±1.0
6.5 max
2.54
10.0
LD82311FlpgC5
9
FIPllA6A
11
FIPllD6A
11
FIPllF6
11
FIPllB8A
,-, ,..., ,-, ,-, ,-, ,-, ,-, ,-,
5.0
2.4
21.0 max
66.0 max
6.5 max
2.54
15.0
5.5
2.45
22.8 ±to
75.2 ±D.7
7.2 max
2.54
25.0
'8'8'8'8'8'88'88B~
6.01
2.4
20.0 ±to
76.0 ±to
6.1 ±0.5
2.54
16
MilO'-'OClonrJnc.1
6.0
2.4
2.54
21.5
8.0
3.6
9.5 max
2.54
14.0
FIPllC8AI
FIPllC8B
11
8.0
3.6
75.2 ±to
93 0 +1.5
· -0.5
93 0 +1.5
· -0.5
7.5 max
11
22.8 ±1.0
255+1.5
· -1.0
255+1.5
· -1.0
9.5 max
2.54
14.0
36.0
FIPllBl0A
11
9.5
4.0
39.0 ±1.0
12.5 max
2.54
14.0
LD8197A/FIP12A4
12
8.8.8.8.8.8.8.8.8.8.8.8.
4.2
2.08
17.0 ±to
1380+2.0
· -0.5
70.0 ±to
6.5 max
2.54
5.8
FIP12A5AI
FIP12A5B
12
8. 8. 8. 8. a 8. 8. 8. 8. EI:8. 8.
5.2
2.4
20.0 ±1.0
81.0 ±to
8.0 max
2.54
9.5
11.0
FIP13E5A
13
r:2 '8. R8. 8. t=t. fI. 8. Et. B. 8. 8. R
86.0 ±1.5
860 +1.5
· -0.5
113.0 ±1.5
930 +1.5
· -0.5
94.5 max
2.54
35.0
13
20.0 ±1.0
200+1.2
· -0.5
24.5 ±to
255+1.5
· -1.0
250 +0.5
· -0.3
255+1.5
· -0.5
255+1.5
· -1.0
7.5 max
FIP13F5
7.5 max
2.54
34.0
8.5 max
2.54
24.0
9.5 max
2.54
36.0
9.5 max
2.54
34.0
9.5 max
2.54
34.0
7.6 ±1.0
2.54
36.0
14.0
1120+1.5
· -0.5
114.4 ±1.0
9.5 max
2.54
34.0
6.5 ±1.0
2.54
15.5
7.8 ±1.0
2.54
11.0
A.D, U, D, u, u;u, 0, U, 0, U,
5.2
2.4
5.3
2.4
6.5
3.0
7.0
2.8
FIP13A7B
13
FIP13C7
13
FIP13F7
13
6.5
2.9
FIP13B8
13
8.0
3.3
FIP13C81
FIP13C8A
13
~ 'B. 'B. '8. 8. 'B. '8, '8, '8, 'B. 8. 8. '8.
8.0
3.3
FIP13E8
13
~ 8. 8. 8,8. 8. 8. 8. 8. 8. 8. 8. 8.
8.0
3.3
FIP13H8
13
~ 'B 'B 'B 'B 'B 'B 'B 'B 'B 'B 'B
'8 (Note 2) 7.6
3.55
250+1.0
· -0.3
24.5 ±1.0
LD8214/FIP13Al0
13
iBBRBRBHHHBBB
a5
4.3
31.0 ±to
138.0 ±to
FIP13Cl0C
13
~aaaaRaaRaaaR
9.5
4.2
31.0 ±1.0
FIP13Dl0A
13
~aaaaaaaaaaaa
as
4.0
39.0 ±to
FIP13Dl0B
13
nm 'B 'B '8 'B '8 '8 'B 'B '8 '8
9.5
4.0
39.0 ±1.0
FIP13Hl0
13
W
8.8. 8. 8.8. 8. 8. 8. 8. 8.8. 8.
a5
4.2
31.0 ±1.0
LD8232/FIP14A5
14
RRRRRRRR!!RRRR
~2
2.4
20.0 ±1.0
FIP15B7
15
2.9
FIP17A5
17
138.0 ±1.0
138 0 +2.0
· -0.5
1380+2.0
· -0.5
138.0 ±1.0
905 +1.5
· -1.0
1120+1.5
· -0.5
92.0 ±to
LD8230/FIP17Al0
17
164.0 ±2.0
lf8, '8, '8, '8, '8, 'B. '8, 'B. '8. '8. 'B. 'B.
ssaSSBSSRRSRBSBSB
~5
1.9
250+1.0
· -1.0
20.0 ±to
9.5
4.0
30.0 ±1.0
1120+1.5
· -1.0
1120+1.5
· -1.0
7.8 ±0.7
2.54
24.0
9.0±1.0
2.54
36.0
9.0 ±1.0
2.54
36.0
7.8 ±1.0
70+0.5
. -0.7
9.5 max
2.54
24.0
65 +D.5
. -1.0
11.0 max
2.54
10.0
2.54
34.0
2.54
16.0
2.54
10.0
Noles:
(1) These characteristics are given when the panels are turned on at the recommended electrical ratings and in case of AC filament mode when eb (
is also supplied from the center tap of the filament transformer.
(2) Green/amber
12-20
NEe
FIPs
Recommended Electrical Rallngs
Mode
01
Fil.
ImArmsl
Mode
01
Oper.
2.8
12
dynamic
22
1112
3
0.6
0.8
580
(170)
3.0
12
dynamic
24
1/12
3
0.7
0.9
690
(200)
3.2
16
dynamic
22
1/12
3
0.6
0.9
620
(180)
3.4
12
dynamic
24
1112
4
0.8
1.3
580
(170)
3.3
13
dynamic
24
1/12
0.8
1.2
580
(170)
3.9
16.5
dynamic
24
1/16
3
4
1.2
1.4
690
(200)
4.0
18
dynamic
20
1115
5
1.3
1.8
690
(200)
3.5
22
dynamic
24
1/12
4
1.8
1.8
690
(200)
4.5
22
dynamic
26
1/12
4.5
2.0
2.5
750
(220)
AC
4.5
22
dynamic
26
1/14
4
2.5
2.5
690
860
(200)
(250)
AC
5.5
55
dynamic
30
1/16
5.5
2.8
3.6
690
(200)
AC
3.7
16
dynamic
24
1/14
4
0.6
0.9
690
(200)
At
4.5
16
dynamic
22
1/14
4
0.7
1.5
690
(200)
AC
AC
4.0
23
dynamic
24
1/14
4
1.0
2.0
690
(200)
4.2
22
dynamic
24
1/16
4.5
1.5
2.0
860
(250)
AC
AC
5.4
22
dynamic
26
1/16
6
2.0
3.0
580
(170)
4.5
22
dynamic
26
1/14
4
2.0
2.5
860
(250)
AC
4.2
58
dynamic
18
1/16
3.5
2.1
2.0
860
(250)
AC
4.2
55
dynamic
26
1/16
4
3.0
3.0
690
(200)
AC
4.2
55
dynamic
26
1/16
4
3.0
3.0
690
(200)
AC
4.2
55
dynamic
26
1/16
3
3.0
3.0
690
(200)
AC
AC
AC
AC
6.1
5.5
5.5
5.5
23
dynamic
21.5
1117.5
6.5
3.5
3.5
580/60
(170/17)
55
dynamic
30
1/16
5.5
2.8
3.8
580
(170)
55
dynamic
30
1/16
5.5
3.0
4.0
860
(250)
55
dynamic
26
1/16
5
4.0
4.0
690
(200)
AC
5.5
55
dynamic
26
1/16
5
4.0
4.0
690
(200)
AC
AC
5.5
3.8
55
dynamic
30
1116
5.5
3.0
4.0
860
(250)
38
dynamic
24
1117
4
0.7
1.5
580
(170)
AC
4.7
37
dynamic
26
1/18
5
2.0
2.5
690
(200)
AC
4.5
22.4
dynamic
22
1120
7
1.3
1.8
690
(200)
AC
6.0
81
dynamic
38
1/23
6
2.8
5.6
580
(170)
AC
AC
AC
AC
AC
AC
AC
AC
AC
I,
'b/dlg.
L
Duty
(mAl
Ie/dig.
l-I
"Ib/l seg
(mAl
(cd/m21
(It.LI
12-21
t-IEC
FIPs
Dot Type Fluore.cent Indicator Module.
Mechanical Characteristics
Character
Heighl
xWldlh
(mml
Characler Pilch
Row x Column
(mml
Dol Pilch
Vertical x
Horizontal
(mml
Dol Size
Wx H(mml
5 x 7 dot,
with cursor
5.05 x 3.55
-x5.2
0.75 x 0.75
0.55 x 0.55
70 x 180 x 20
max
160 typ
FM20X1DB-AC 20 (20 char.,
1 line)
5 x 7 dot
9.0 x 6.3
-x8.3
1.35 x 1.35
~0.9
73 x 240 x20
max
250 typ
FM20X2AA-DA 40 (20 char.,
2 line)
5 x 7 dot
5.05 x 3.55
12.62 x 4.75
0.75 x 0.75
0.55 x 0.55
55 x 146 x 37
max
200 typ
Device
No of Character
Character
Format
No 01 Display
DOIs
Row x Column
Oulllne
Dimensions
Hx Wx 0 (mml
Weight
(gl
Character Type Modules
FM2OX1AA-D
20 (20 char.,
1 line)
FM40X1AA-B
40 (40 char.,
1 line)
5 x 7 dot,
with cursor
5.05 x 3.55
- x 4.75
0.75 x 0.75
0.55 x 0.55
70x25Ox20
max
250 typ
FM40X1FB-B
40 (40 char.,
1 line)
5 x 12 dot
8.80 x 3.55
-x5.2
0.75 x 0.75
0.55 x 0.55
76.2 x 320 x 24
max
300 typ
FM40X2CB-AA 80 (40 char.,
2 line)
5 x 7 dot,
with cursor
5.35 x 3.55
11.94 x 4.75
0.8 x 0.75
0.55 x 0.55
76x294x37
max
360 typ
FM40X6AA-A
240 (40 char.,
6 line)
5 x 7 dot,
with cursor
5.0 x 3.5
8.0 x 4.75
0.75 x 0.75
0.5 x 0.5
110x264x45
max
880 typ
FM80X2AA-A
160 (80 char.,
2 line)
5 x 7 dot,
with cursor
3.5 x 2.05
5.25 x 3.2
0.55 x 0.45
0.25 x 0.25
66x388x43
max
520 typ
0.6
0.4
9Ox2oox45
max
400 typ
Graphic Type Module
FM180GX48BA-A
48 x 180
(total dots
8640)
General Characteristics
Temperature
Range
Device
Brightness
Color
BL cd/m2 (fI-LI (wlthoutlillerl
Operation
Top ·C
Storage
TSTS ·C
Vibration
(10-55 Hzl
G
Relative
Humidily
Shock
G
Operation Storage
RHop% RHSTG %
Mating
Connector
Power
Signal
Character Type Modules
1030 typ (300)
Blue-green
-5 to 60
-20 to 70
2
40
Oto 85
Oto 95
(Note 1)
172083-4
FM20Xl DB-AC 1030 typ (300)
FM20X1AA-D
Blue-green
-5 to 60
-2010 70
2
40
Oto 95
(Note 1)
172083-4
FM20X2AA-DA 856 typ (250)
Blue-green
-5 to 60
-20 to 70
2
40
Oto 95
(Note 1)
172083-4
FM40X1AA-B
685 typ (200)
Blue-green
-5 to 60
-20 to 70
2
40
oto 85
oto 85
oto 85
Oto 95
(Note 1)
172083-4
FM40X1FB-B
685 typ (200)
Blue-green
-5 to 60
-20 to 70
2
40
Oto 85
Oto 95
(Note 1)
172083-5
FM40X2CB-AA 685 typ (200)
Blue-green
-5 to 60
-20 to 70
2
40
oto 85
Oto 95
(Note 1)
172083-5
FM40X6AA-A
685 typ (200)
Blue-green
-5 to 60
-20 to 70
2
25
010 85
(Note 1)
172083-5
FM80X2AA-A .' 514 typ (150)
Graphic Type Modules
Blue-green
-5 to 60
-20 to 70
2
40
oto 85
oto 95
oto 95
(Note 1)
172083-5
FMl80GX48BA-A 685 typ (200)
Blue-green
-5 to 60
-20 to 70
2
40
Oto 85
Oto 95
(Note 1)
172083-4
Note:
(1) Housing 171822-2, pin 170204-2
12-22
ttlEC
FIPs
Dot Type Fluorescent Indicator Modules (cont)
Electrical Characteristics
Display
Vollage
Device
Min
Currenl
Typ
Max
Min
Typ
Max
0.8
Character Type Modules
FM20X1AA-O
4.75
5.0
5.25
O.S
FM20Xl0B-AC
4.75
5.0
5.25
0.8
1.0
FM20X2AA-OA
4.75
5.0
5.25
1.0
1.2
FM40X1AA-B
(Note 1)
4.75
5.0
5.25
1.0
1.2
FM40X1FB-B
4.75
5.0
5.25
1.0
1.5
FM40X2CB-AA
4.75
5.0
5.25
1.3
1.5
FM40XSAA-A
4.75
5.0
5.25
2.5
3.5
FMBOX2AA-A
4.75
5.0
5.25
1.3
1.5
5.0
5.25
1.2
1.8
Graphic Type Modules
FM180GX48BA-A
4.75
Note:
(1) Power polarity is different from other modules.
Display Functions
Device
Reset
Display Blanking
Teat Mode
Data
Data Write
Command Write
Data Read
FM20X1AA-O
CPU data bus
compatible, TTL level
•
•
•
FM20Xl0B-AC
CPU data bus
compatible, TTL level
•
•
FM20X2AA-OA
CPU data bus
compatible, TTL level
•
•
•
FM40X1AA-B
CPU data bus
compatible, TTL level
•
•
•
•
•
•
•
•
FM40X1FB-B
CPU data bus
compatible, four kinds
of serial input,
TTL level
•
•
•
FM40X2CB-AA
CPU data bus
compatible, TTL level
•
•
•
FM40XSAA-A
CPU data bus
compatible, serial
input 1200 baud,
TTL level
•
•
•
•
•
•
FM80X2AA-A
CPU data bus
compatible, serial
input 1200 baud,
TTL level
•
•
•
•
•
•
Refresh Memory
Character Type Modules
•
•
-.
•
•
Graphic Type Modules
FMl80GX4BBA-A
B-bit parallel,
TTL level
•
•
with one frame
memory (RAM)
12-23
fttIEC
FIPs
Chip-in-Glass FIP Modules
Mechanical Characteristics
Device
(Note 1)
No. of
Characters
Character
Format
Character
Height
x Width
(mm)
Character
Pitch, Row
x Column
(mm)
Dot Pitch
Vertical
x Horizontal
(mm)
Dot Size
WxH
(mm)
Outline
Dimensions
HxWxD
(mm)
Weight
(g)
Character Type Modules
FC20X1RA·
AB
20 (20 char,
1 line)
5 x 7 dot
with cursor
5.0x 3.33
- x 4.75
0.75 x 0.70
0.50 x 0.50
26x 161 x 22
80typ
FC20X1SA·
AB
20 (20 char,
1 line)
5 x 7 dot
9.0 x 6.3
-x8.3
1.35 x 1.35
qJO.9
26.5 x 230 x
22
120typ
FC20X2JA·
AB
40 (20 char,
2 line)
5 x 7 dot
with cursor
5.0 x 3.3
12.62 x 4.75
0.75 x 0.70
0.50 x 0.50
34 x 161 x 3
100 typ
FC40X1LA·
liB
40 (40 char,
1 line)
5 x 7 dot
with cursor
5.0 x 3.3
- x 4.75
0.75 x 0.70
0.50 x 0.50
6x56x3
150 typ
FC40X2EA·
AB
80 (40 char,
2 line)
5 x 7 dot
with cursor
5.0 x 3.3
12.62 x 4.75
0.75 x 0.70
0.50 x 0.50
39.5 x 256 x
27
240 typ
General Characteristics
Temperature
Range
Device luminance
cd/m2
(Note 1)
(fL)
Color
(without
filter)
Vibration
(10-55
Hz)
Relative
Humidity
Mating
Connector
Operation
Top·C
Storage
TSTG ·C
Displacement
(mm)
Shock
(G)
Operation
RHop%
Storage
RHSTG%
Power
Signal
(Note 3)
Character Type Modules
FC20X1RA· l000typ
AB
(291)
Green
(505 nm)
-20 to
+70
-40 to
+85
0.5
40
Oto 85
Oto 95
(Note 2)
HIF3BA·
34D·2.54R
FC20X1SA· 1000typ
(291)
AB
Green
(505 nm)
-20 to
+70
-40 to
+85
0.5
40
Oto 85
Oto 95
(Note 2)
HIF3BA·
34D-2.54R
FC20X2JA· 1000 typ
AB
(291)
Green
(505 nm)
-20 to
+70
-40 to
+85
0.5
40
Oto 85
Oto 95
(Note 2)
HIF3BA·
34D-2.54R
FC40Xl LA- 1000 typ
AB
(291)
Green
(505 nm)
-20 to
+70
-40 to
+85
0.5
40
Ot085
Oto 95
(Note 2)
HIF3BA·
34D-2.54R
FC40X2EA· 1000 typ
AB
(291)
Green
(505 nm)
-20 to
+70
-40 to
+85
0.5
40
o to 85
Oto 95
(Note 2)
HIF3BA·
34D-2.54R
Notes:
(1) AA ending is for English and Japanese characters. AB ending is
for English and European characters.
(2) Housing AMP 171822·2, Pin AMP 170204-2
(3) Signal connectors: contact Hirose U.S.A.
12-24
NEe
FIPs
Chip-in-Glass FIP Modules (coni)
Electrical Characteristics
Display
Current
Voltage
Device (Note 1)
Min
Typ
Max
Min
Max
Typ
Character Type Modules
FC20X1 RA-AB
4.75
5.0
5.25
0.2
0.4
FC20X1SA-AB
4.75
5.0
5.25
0.5
0.7
FC20X2JA-AA/AB
4.75
5.0
5.25
0.3
0.4
FC40Xl LA-AB
4.75
5.0
5.25
0.4
0.6
FC40X2EA-AB
4.75
5.0
5.25
0.8
1.0
Display Functions
Device (Note 1)
Data
Data
Write
Command
Write
(Parallel)
Luminance
Control
(4-Level)
•
•
•
•
•
Display
Blanking
Test
Mode
•
•
•
•
•
•
•
•
•
•
•
•
Reset
Cursor
Variety
(3-Mode)
User
Character
Registration
•
•
•
•
•
Character Type Modules
FC20Xl RA-AB
FC20X1SA-AB
FC20X2JA-AB
FC40Xl LA-AB
FC40X2EA-AB
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
IfJ
i
12-25
FIPs
12-26
t\'EC
ttlEC
Optoelectronic Devices
Optoelectronic Devices
Section 13. Optoelectronic Devices
Part Numbering System ....................... '" ............ 13-3
ACTIVE DEVICES
Laser Diodes ................................................ 13-4
Light Emitting Diodes ........................................ 13-6
Fiber Optics .............................................. 13-6
Remote Control ........................ , .................. 13-7
Avalanche Photo Diodes ...................................... 13-8
PIN Photo Diodes ............................................ 13-9
Fiber Optics ................................ , .............. 13-9
Remote Control ...................... '" .................. 13-9
Optical Disk .............................................. 13-10
Photo Transistors ......................................... 13-10
Photo ICs .................................................. 13-11
Photo Interrupters •..... , •.•.............................. 13-11
Optical Disk ............ , ..•.......•...................... 13-11
Optoisolators ............................•. '" ........... , .. 13-12
Can Type .................................. " ............ 13-12
Multichannel Type ............ " .......................... 13-12
Surface-Mount Type ...................................... 13-13
6-Pin Type .. , ..................... " ..................... 13-14
High-Speed Type ......................................... 13-15
Ultra-High-Speed Type .................................... 13-15
Photo SCR Coupler ......•........................... '" .. 13-15
Photo Interrupters .......................................... 13-16
Transistor Output Type ...................................... 13-16
IC Output Type ............................................. 13-18
Fiber-Optic Datalinks ....................................... 13-20
PASSIVE DEVICES
Acousto Optics
Modulators .............................................. 13-21
Modulator Drivers ........................................ 13-21
Fiber Optics
Attenuators .............................................. 13-22
Cable Assemblies ........................................ 13-22
Connectors ........................................ , '" .. 13-23
Couplers/SplitterS/Line Monitors ........................... 13-23
SWitches ................................................. 13-23
Termination Equipment and Supplies ...................... 13-24
Wavelength Division Multiplexers/Bandpass Filters .......... 13-24
Optical Isolators ............................................ 13-24
Optoisolator Cross-Reference ................................ 13-25
Sensors and IR Emitters Cross-Reference ..................... 13-27
13-2
ttlEC
ttlEC
Optoelectronic Devices
Part Numbering System
Photo Detector
Optoisolator
PH 3 02 B
PS 25 01
r-
b
r
0
""'"""'"""' """
Optional: Rank (K,L,M)
Optional:
1 = 1-Channel type
2 = 2-Channel type
3 = 3-Channel type
4 = 4-Channel type
E3 or E4 = Taping
' - - - - - - - - Optional:
A, B, ... = Suffix for revision
L = Lead bending type
Identification number
Output type:
1 = Photo transistor
3 = PIN photo diode
' - - - - - - - - - . Identification type
Photo Interrupter
4
1T
-4 -K A
T
Revision(optional): The letters A~ are
designed for changed parameter of
production process.
NEC photo detector device
PS
L
01
L.
L::===
Identification number
Size code:
= Middle size
5 = Small size
6 = Ultra small size
o
Style code:
4 = Interrupter
6 = Reflective sensor
' - - - - - - - - - - - Output type:
10 = Can type
20 = 6 pin standard, 6 pin
or 8 pin highspeed
24 = Multi type
25 = Multi type
26 = 6 pin
27 = 4 pin surface mount
3X = SCR
NEC photo coupler type
NEC photo interrupter device
Optical Semiconductor Devices
Infrared Light Emitting Diodes
S
E
3
03
A-C
T
Revision
The letters A ~ are
designated for changes
in parameter or
production process.
Part Number
Material
Device Type
NDL1XXX
Si
APD
Feature
NDL2XXX
Si
PIN-PO
NDL3XXX
AIGalnP
LD
NDL4XXX
AIGaAs
LED
NDL50XX
InGaAsP
LD
Identification Number
NDL51XX
Ge
APD
Material
3 : GaAs ( Ap = 940 nm)
10: GaAIAs (Ap = 950 nm)
NDL52XX
Ge
PIN-PO
NDL53XX
InGaAsP
LED
NDL54XX
InGaAs
PIN-PO
Color Code
E = Infrared
NDL55XX
InGaAs
APD
NDL56XX
InGaAsP
LD
DFBLD
Type Code
NDL57XX
InGaAsP
LD Module
F-P LD
NDL58XX
InGaAsP
LD
DFBLD
for 2.4 Gb/s
F-P LD
13-3
III
t\'EC
Optoelectronic Devices
ACTIVE DEVICES
Las.r Diodes
Absolute Maximum Ratings (TA
=25°C)
Typical Characteristics (TA
Ith
Po,p,(mW)
Ap
(mA) lop
(nm)
Typ (mA)
Typ Typ
Part
Number
=25°C)
l!J..
(nm)
Max
t,Ij
(n's)
Typ
Remarks
Package Style
100
3.0
60
5.0
670
Ith +30
8.0
1300
4.0
0.5/0.7
Ith +30
8.0
1300
4.0
0.5/0.7
-55 to +125 20
Ith +30
8.0
1300
4.0
0.5/0.7
-40 to +70
20
Ith +30
2.5
1300
4.0
0.5/0.7
10.0 -20to+60
-5510+125 20
Ith +30
7.0
1200
4.0
0.5/0.7
2
15.0 -10to+70
-55 to +125 20
Ith +30
8.0
1310
4.0
0.2
fe = 1.2 GHz Min
Can
2
15.0 -40 to +70
-55 to +125 20
Ith +30
8.0
1310
4.0
0.2 ,
Chip on carrier
Surface mount
15.0 -40 to +70
-55 to +125 20
Ith +30
8.0
1310
4.0
0.2
Chip on carrier
10.0 -40 to +60
-55 to + 125 20
4.0
0.5/0.7
With Ball Lens
Can
NDL5060
-40 to +70
-55 to +125 20
Ith +25 5.0. 1 1300
250. 3 50.0. 1 1310
10.0
0.5/0.7
With Ball Lens
Can
NDL5061
-40to+70
-55to+125 20
400. 3 90.0. 1 1310
10.0
0.5/0.7
With Ball Lens
Can
NDL5070
-40 to +70
-55 to +125 40
250. 3 30.0. 1 1550
20.0
0.5/0.7
With Ball Lens
Can
NDL5071
-40 to +70
-55 to +125 40
400.3 50.0. 1 1550
20.0
0.5/0.7
With Ball Lens
Can
5.0
-40to+70
-5510+125 20
3.0
1310
30.0
0.5/0.7
Small package
Can
NDL5081
5.0
-4010+70
-55to+125 20
3.0
1310
30.0
0.5/0.7
Small package
L30
NDL5082
10.0 -40to+70
-5510+125 20
Ith+20
5.0
1310
10.0
0.2
Small package
L30
NDL5083
10.0 -40 to +70
-5510 +125 20
Ith +20
5.0
1310
10.0
0.2
Small package
L30
NDL5084
10.0 -40 to +70
-5510 +125 20
Ith +20
5.0
1310
10.0
0.2
Small package
L37
15.0 -4010+70
-5510+100 15
Ith +30
8.0
1310
0.1
0.2
DFB
Can
15.0 -40to+70
Surface mount
NDL3200
2
4.0 -1010 +50
NDL5003
2
10.0 -40to+70
-55to+125 20
NDL5003D
2
15.0 -40to+70
-55 to +125 20
NDL5004
2
10.0 -40to+70
NDL5004P
2
4.0 -20 to +60
NDL500B
2
NDL5009
NDL5009D
6.0 -10to+50
NDL3210
NDL5009Dl
NDL5021
NDL5080
2
150
2
NDL5600
2
NDL5600D
2
NDL5603P
-40 to +85
90
-40to+85
50
670
With monilor PD
Can
Wilh monitor PD
Can
Chip on carrier
Surface mount
Can
Can
With GI-50/125
Pigtail
Can
-55to+l00 15
Ith +30
8.0
1310
0.1
0.2
Chip on carrier
150
-20 to +65
-40 to +70
15
Ith+30
1.2
1310
0.1
0.3
With SMF, isolator
L40
Ith+50
-20 to +65
-40 to +70
15
Ith +25
1.2
1310
DFB, no isolator
14-Pin DIP
Chip on carrier
Surface mount
0.3/0.4
NDL5601lP
2
NDL5650
2
10.0 -40 to +70
-55to+l00 20
Ith+30
5.0
1550
0.1
0.2
NDL5650D
2
10.0 -40to+70
-55to+l00 20
Ith +30
5.0
1550
0.1
0.2
-20 to +65
-40 to +70
20
Ith +35
1.2
1550
0.3/0.4
WithSMF
14-Pin DIP
NDL5707P
2
Ith +50
-20 to +65
-40 to +70
20
Ith +30
3.0
1300
2.0.2
0.5/0.7
With GI-50/125
14-Pin DIP
NDL5717P
2
Ith +50
-20 to +65
-40 to +70
20
Ith +30
2.0
1310
2.0.2
0.5/0.7
With SMF
14-Pin DIP
NDL5730P
2 Ith +50
-20 to +65
-40 to +70
20
Ith +30
2.0
1310
2.0.2
0.210.3
With SMF
14-Pin Butterfly
NDL5731 P
2 Ith+50
-20 to +65
2.0
1310
0.3/0.4
WithSMF
14-Pin DIP
NDL5735P
2
Ith+50
1300
6.0
0.5/0.7
With SMF, w/o TEC 14-Pin DIP
2
0.2
1300
6.0
0.5/0.7
With SMF, w/o TEC 14-Pin DIP
NDL5762P
2
Ith +50
600. 3
oto +65
oto +65
oto +60
0.7
NDL5736P
-40 to +70
20
400.3
30.0 1310
20.0
0.5/0.7
With SMF, w/o PD
NDL5772P
2
600.3
Oto+60
-40 to +70
40
400.3
15.0 1550
40.0
0.5/0.7
With SMF, w/o PO
14-Pin DIP
NDL5765P
oto +60
-40 to +85
30
600.2
25.0 1310
20.0
0.8
With SMF, w/o PD
L41A
NDL5765Pl
010 +60
-40 to +85
30
600. 2
25.0 1310
20.0
0.8
With SMF, flange,
w/o PD
L42
NDL5766P
-20 to +65
-40 to +70
30
800. 2
70.0 1310
15.0
0.8
With SMF, w/o PO
L34
.IMin .2Typ .3Pulse Drive (PW =1 ms, Duty =1%) .4Max
13-4
Can
14-Pin DIP
ttlEC
Optoelectronic Devices
Laser Diodes (cont)
Absolute Maximum Ratings (TA = 25°C)
Typical Characteristics (TA
Po,Pf(mW)
Part
Number
VR
IF
(V) (mA)
Po
(mW)
Tc
(OC)
Tst~
(OC
Ith
(mA) lop
Typ (mA)
=25°C)
Ap
/),.J..
Typ
(nm)
Typ
(nm)
Max
(ns)
Typ
I""
Remarks
Package Style
NDL5775P
1000.2
oto +60
-40 to +85
40
600.2
20.0
1550
20.0
0.8
With SMF, w/o PO
L41A
NDL5775P1
1000.2
010 +60
-4010 +85
40
600.2
20.0
1550
20.0
0.8
With SMF, flange,
w/oPD
L42
NDL5776P
1000.2
-20 to +65
-40 to +70
40
800.2
45.0
1550
20.0
0.8
With SMF, w/o PO
L34
oto +60
oto +60
010 +70
25
Ith+30
5.0
1550
0.1
0.1/0.17
Chip on sub-carrier
oto +70
25
Ith +30
5.0
1550
0.1
0.1/0.17
Chip on sub-carrier L27
150
-20 to +60
-40 to +70
25
Ith+30
1.0
1550
0.1
0.1/0.17
With SMF, isolator
L40
oto +55
oto +55
-20 to +70
30
Ith +45
2.0
1310 50 MHz 100/200ps
DFB With isolator
14-Pin Butterfly
-20 to +70
30
Ith +45
1.5
1550 50 MHz 100/200ps
DFB With isolator
14-Pin Butterfly
10.0
NDL5850C
NDL5850D
10.0
NDL5851P
008335
2
100
008336
2
100
.IMin .2Typ .3Pulse Drive (PW = 1 ms, Duty = 1%) .4Max
13-5
fttIEC
Optoelectronic Devices
Light Emitting Diodes
Fiber Optics
Absolute Maximum Ratings (TA = 25°C)
Part
Number
NDL4103A
typical Characteristics (TA = 25°C)
IF
(mA)
t, t,
Typ
Ap
(nm)
Typ
SA
(nm)
Max
(n's)
Typ
2.0
850
60
10
2
150
-40 to +80 -55 to +125
100
NDL4103Ll
2
150
-40to+70
-40to+90
100
1.2
850
60
10
NDL4103P
2
150
-20 to +60
-40 to +70
100
50.0.4
850
60
10
NDL4105A
2
150
-40 to +70
-40 to +90
100
3.5
850
NDL41 05-78
2
150
-40 to +70
-40 to +90
100
3.5
780
NDL41 05-88
2
150
-40 to +70
-40 to +90
100
3.5
NDL4105B
2
150
-40 to +70
-40 to +90
100
NDL4105L1
2
150
-40 to +70
-40 to +90
NDL4201A
2
80
-40 to +70
NDL4201B
2
80
-4010 +70
NDL5300
2
NDL5300P
2
Remarks
Package Style
TO-18 Can
"With ~-Lens
L38
With GI-50/125
Pigtail
50
le= 35 MHz
TO-18 Can
50
Ie =35 MHz
TO-18 Can
880
50
Ie = 35 MHz
TO-18 Can
2.0
850
50
With Ball Lens
Ie = 35 MHz
Header mount
100
2.0
850
50
With~-Lens
Ie = 35 MHz
L38
-4010 +90
50
1.0
850
50
Ie = 35 MHz
Header mount
-4010 +90
50
0.7
850
50
With Ball Lens
Ie = 35 MHz
150
-4010 +80 -5510 +125
100
1.0
1300
140
12/18
Header mounl
TO-18 Can
150
-2010 +60
-4010 +70
100
30.0. 4
1300
140
12/18
NDL5302
150
-40to+80 -5510+125
100
0.8
1300
160
2/3
NDL5302Ll
150
-4010 +80 -5510 +125
100
0.5
1300
160
2/3
Wilh ~-Lens lor
GI-50
NDL5302L2
150
-4010 +80 -5510 +125
100
0.5
1300
160
2/3
Wilh ~-Lens lor
GI-62.5
L38
NDL5302P
150
-20 to +60
-4010 +70
100
25.0.4
1300
160
2/3
With GI-50/125
Piglail
NDL5303P
150
-4010 +65
-4010 +70
100
25.0. 4
1300
160
2/3
Wilh GI-50/125
14-Pin DIP
NDL5303PFC
150
-40 to +65
-4010 +70
100
25.0.4
1300
160
2/3
Wilh GI-50,
FC connector
Wilh GI-50/125
Pigtail
TO-18 Can
L38
L23
NDL5310
2
120
-40 to +80 -5510 +125
80
1,5
1300
150
4/8
NDL5310P
2
120
-20 to +60
-40 to +70
80
40.0. 4
1300
150
4/8
With GI-50/125
Piglail
NDL5311P
2
120
-40 to +65
-4010 +70
80
40.0.4
1300
150
4/8
Wilh GI-50/125
14-Pin DIP
NDL5312
2
120
-40to+80 -5510+125
80
1,0
1300
150.5
1/2
NDL5312P
2
120
-20 to +60
-40 to +70
80
30,0.4
1300
150.5
1/2
With GI-50/125
Pigtail
NDL5313P
2
120
-4010 +65
-4010 +70
80
30.0.4
1300
150.5
1/2
With GI-50/125
14-Pin DIP
NDL5314
2
120
-40 to +80 -55 10 +125
80
0.8
1300
150.5 0.8/1.5
NDL5314P
2
120
-2010+60
80
25.0.4
1300
150.5 0.8/1.5
13-6
-4010+70
TO-18 Can
TO-18 Can
TO-18 Can
WithGI-50/125
Pigtail
tttfEC
Optoelectronic Devices
Light Emitting Diodes (cont)
Remote Control
Absolute Maximum Ratings
(TA= 25'C)
Part
Number
Material
SE301A
GaAs
SE302A
Features
Typical Characteristics (T A = 25'C)
VF Typ (V)
(IF=30 mAl
1ft Typ (PA)
(VR=3 V)
Ap Typ (nm) Po Typ (mW)
(IF=30 mAl
(IF=30mA)
Pd(mW)
IF (mA)
Tstl! ('C)
High output
High reliability
150
100
-65 to +125
1.2
(IF=50 rnA)
0.01
GaAs
Mini size
75
50
-30 to +80
1.2
SE303A·C
GaAs
High output
Wide radiation angle
150
100
1.25
-40 to +100
(IF=50 rnA)
SE304
GaAs
Lateral direction output
100
50
-40 to +100
1.2
0.01
940
1.5
SE306
GaAs
Lateral direction output
with a lens
100
50
-40 to +100
1.1
(IF=10 rnA)
0.01
940
(IF=10 rnA)
0.5 mW/sr
(IF=10 rnA)
SE307·C
GaAs
ULTRA High output
Narrow radiation angle
150
100
-40 to +100
1.25
(IF=50 rnA)
0.01
(VR=5V)
940
(IF=50 rnA)
30 mW/sr
(IF=50 rnA)
SE308
GaAs
Small package
Lateral direction output
100
50
-40 to +100
1.14
(IF=20 rnA)
0.01
940
(IF=20 rnA)
0.85 mW/sr
(IF=20 rnA)
SE310
GaAs
High output
Small package
150
60
-40 to +100
1.25
(IF=50 rnA)
0.01
(VR=5 V)
940
(IF=50 rnA)
11 mW/sr
(IF=50 rnA)
SE313
GaAs
ULTRA High output
Middle radiation angle
150
100
-40 to +100
1.25
(IF=50 rnA)
0.01
(VR=5 V)
940
(IF=50 rnA)
25 mW/sr
(I F=50 rnA)
ULTRA High output
Wide radiation angle
150
100
-40 to +100
1.27
(IF=50 rnA)
0.01
(VR=5 V)
950
(IF=50 rnA)
20 mW/sr
(IF=50 rnA)
SE1003·C
GaAIAs
on GaAs
6
940
(IF=50 rnA)
(IF=50 rnA)
0.01
940
1.5
0.01
(VR=5 V)
940
(IF=50 rnA)
8
(IF=50mA)
13·7
t-IEC
Optoelectronic Devices
Avalanche Photo Diodes
Absolute Maximum
Ratings
(TA = 25°C)
Typical Characteristics (TA= 25°C)
Detecting
Area Size
(11 m)
Typ
V(BR)R
(V)
VR
Typ
(V)
-65 to +150
30
35
NDL5102C 50
0.5
-55to+125
30
NDL5103P
50
0.5
-40 to +85
NDL5104P 50
0.5
NDL5104Pl 50
Package Style
TO-18 Can
TO-18 Can
TO-18 Can
Surface mount
40
1300
75
0.5
50
1300
75
0.3
35
50
1300
75
0.3
Chip on carrier
Surface mount
35
50
1300
75
0.3
With SMF
Pigtail
30
35
50
1300
70
0.5
With SMF, flange
L45
NDL5500
10
0.5
-55 to +100
1000:1
<170 ns
(beam waist 800 pm)
Rise time
<40ns
(beam waist 150 pm)
<80%
(at 633 nm)
Deflection efficiency
Temperature stability
0.1%/·C
8% (5-50·C)
Input imped~mce
500
TTL
Weight
45g
60g
Acousto·Optic Modulator Drivers
Type
008802G
008802A
Carrier frequency
008802F
RF output power
008802K
80 MHz
>1.3W
>0.8W
Impedance
Input interface>
008802C
008802B
140 MHz
>0.6W
500
TTL
Carrier leakage
TTL
A
A
A
<-30dB
AC100V
<25VA
DC+24V
<0.5A
DC +24V
<0.5A
W148
H 100
D230mm
W67
H 30
D87mm
W67
H30
o 87mm
<2.5kg
<500g
<500g
Rise time, Fall time
<-30dB
<15ns
Power Supply
Dimensions
Weight
Input connector
BNC
Output connector
BNC
Recommended
modulators
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.3 Linearized : No XMP Toolkit : Adobe XMP Core 4.2.1-c041 52.342996, 2008/05/07-21:37:19 Create Date : 2017:07:25 16:49:51-08:00 Modify Date : 2017:07:25 18:25:08-07:00 Metadata Date : 2017:07:25 18:25:08-07:00 Producer : Adobe Acrobat 9.0 Paper Capture Plug-in Format : application/pdf Document ID : uuid:5892cb35-7d07-f749-8c28-ff44a875174f Instance ID : uuid:3967ca8a-f85d-bb42-a214-d8b4d401148f Page Layout : SinglePage Page Mode : UseNone Page Count : 194EXIF Metadata provided by EXIF.tools