1995_Motorola_Sensor_Device_Data 1995 Motorola Sensor Device Data
User Manual: 1995_Motorola_Sensor_Device_Data
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Introduction
Data Sheets
Quality and Reliability
Application Notes
Package Outline Dimensions
Appendices
Glossary and Symbols
Device Sample Kits
Index and Cross Reference
Distributors and Sales Offices
Issued Motorola Sensor U.S. Patents: 3858150, 3893228, 3943915, 4100563, 4184189, 4224537, 4243898, 4250452, 4317126,
4326171,4463274,4465075,4480983,4517547, 4526740, 4655088, 4683757, 4686764, 4708012, 4732042, 4733553, 4777716,
4842685,4889590, 4995953, 5027081, 5031461, 5074152, 5110758, 5130276, 5132559.
ICePAK, SENSEFET and X-ducer are trademarks of Motorola, Inc.
TMOS is a registered trademark of Motorola, Inc.
Udel is a registered trademark of Union Carbide.
®
MOTOROLA
Sensor
Device Data
The information in this book has been carefully reviewed and is believed to be accurate; however, no
responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of semiconductor devices any license under the patent rights to the manufacturer.
Motorola reserves the right to make changes without further notice to any products herein. Motorola
makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does Motorola assume any liability arising out of the application or use of any product or
circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters,
including "Typicals" must be validated for each customer application by customer's technical experts.
Motorola does not convey any license under its patent rights nor the rights of others. Motorola products
are not designed, intended, or authorized for use as components in systems intended for surgical implant
into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the Motorola product could create a situation where personal injury or death may occur.
Should Buyer purchase or use Motorola products for any such unintended or unauthorized application,
Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising
out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture
of the part. Motorola and If!) are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
3rd Edition
© Motorola, Inc. 1995
"All Rights Reserved"
Printed in U.S.A.
iii
DATA CLASSIFICATION
Product Preview
This heading on a data sheet indicates that the device is in the formative stages or in design (under
development). The disclaimer at the bottom of the first page reads: "This document contains information
on a product under development. Motorola reserves the right to change or discontinue this product without notice."
Advance Information
This heading on a data sheet indicates that the device is in sampling, preproduction, or first production
stages. The disclaimer at the bottom of the first page reads: "This document contains information on a
new product. Specifications and information herein are subject to change without notice."
Fully Released
A fully released data sheet contains neither a classification heading nor a disclaimer at the bottom of
the first page. This document contains information on a product in full production. Guaranteed limits will
not be changed without written notice to your local Motorola Semiconductor Sales Office.
MOTOROLA DEVICE CLASSIFICATIONS
In an effort to provide up-tO-date information to the customer regarding the status of any given device,
Motorola has classified all devices into three categories: Preferred devices, Current products and Not
Recommended for New Design products.
A Preferred type is a device which is recommended as a first choice for future use. These devices are
"preferred" by virtue of their performance, price, functionality, or combination of attributes which offer the
overall "best" value to the customer. This category contains both advanced and mature devices which
will remain available for the foreseeable future.
Preferred devices in the Data Sheet sections are
identified as a "Motorola Preferred Device."
Device types identified as "current" may not be a first choice for new designs, but will continue to be
available because of the popularity and/or standardization orvolume usage in current production designs.
These products can be acceptable for new designs but the preferred types are considered better alternatives for long term usage.
Any device that has not been identified as a "preferred device" is a "current" device.
Products designated as "Not Recommended for New Design" may become obsolete as dictated by
poor market acceptance, or a technology or package that is reaching the end of its life cycle. Devices
in this category have an uncertain future and do not represent a good selection for new device designs
or long term usage.
The Sensor Data Book does not contain any
"Not Recommended for New Design" devices.
iv
TABLE OF CONTENTS
SECTION ONE -
Reliability Tests for Automotive/Industrial
Pressure Sensors ....................... 3-9
Introduction
Selector Guide Information ................. 1-2
General Product Information ...............
Performance .............................
Accuracy ................................
Unlimited Versatility .......................
Statistical Process Control ................ 3-10
1-3
1-3
1-3
1-3
Electrostatic Discharge Data .............. 3-14
SECTION FOUR -
Integration ................................ 1-4
On-Chip Conditioning ..................... 1-4
Motorola Pressure Sensors ................
The Basic Structure .......................
Motorola's Patented X-ducer ...............
The Basic Elements . . .. . . . . .. .. . .. . . . .. . ..
Operation ................................
SECTION TWO -
Applications Information. . . . . . . . . . . . . . . . . .. 4-2
AN935 Compensating for Nonlinearity in the
MPX10 Series Pressure
Transducer ..................... 4-4
AN936 Mounting Techniques, Lead Forming
and Testing of Motorola's MPX
Series Pressure Sensors ........ 4-11
AN1082 Simple Design for a 4-20 mA
Transmitter Interface Using a
Motorola Pressure Sensor ....... 4-16
AN1097 Calibration-Free Pressure Sensor
System ....................... 4-19
AN1100 Analog to Digital Converter Resolution
Extension Using a Motorola
PressureSensor ............... 4-24
AN1105 A Digital Pressure Gauge Using the
Motorola MPX700 Series Differential
Pressure Sensor ............... 4-27
AN1303 A Simple 4-20 mA Pressure
Transducer Evaluation Board .... 4-32
AN1304 Integrated Sensor Simplifies Bar
Graph Pressure Gauge. . . . . . . . .. 4-37
AN1305 An Evaluation System for Direct
Interface of the MPX5100 Pressure
Sensor with a Microprocessor .. .. 4-42
AN1307 A Simple Pressure Regulator Using
Semiconductor Pressure
Transducers ................... 4-58
AN1309 Compensated Sensor Bar Graph
Pressure Gauge ................ 4-65
AN1315 An Evaluation System Interfacing the
MPX2000 Series Pressure Sensors
to a Microprocessor ............ 4-72
AN1316 Frequency Output Conversion for
MPX2000 Series Pressure
Sensors . . . . . . . . . . . . . . . . . . . . . .. 4-93
AN1318 Interfacing Semiconductor Pressure
Sensors to Microcomputers . . . . .. 4-99
AN1322 Applying Semiconductor Sensors to
Bar Graph Pressure Gauges . . .. 4-109
AN1324 A Simple Sensor Interface
Amplifier ..................... 4-114
AN1325 Amplifiers for Semiconductor
Pressure Sensors ............. 4-118
AN1326 Barometric Pressure Measurement
Using Semiconductor Pressure
Sensors ...................... 4-122
AN1513 Mounting Techniques and Plumbing
Options of Motorola's MPX
Series Pressure Sensors ........ 4-131
1-4
1-4
1-4
1-5
1-5
Data Sheets
Basic Uncompensated
MPX10D, MPX12D Series ................. 2-2
MPX50D Series .......................... 2-6
MPX1 OOD Series ........................ 2-10
MPX200D Series ........................ 2-14
MPX700D Series ........................ 2-18
MPX906 Series . . . . . . .. . . . . .. . . . .. . .. . ... 2-22
Calibrated and Temperature Compensated
MPX2010D, MPX2012D Series ............
MPX2050D, MPX2052D Series ............
MPX2100D, MPX2101D Series ............
MPX2200D, MPX2201 D Series ............
MPX2300D .............................
MPX2700 Series .........................
2-26
2-30
2-34
2-38
2-42
2-44
Signal Conditioned
MPX4100D, MPX4101 Series .............
MPX4115A Series .......................
MPX4250 Series .........................
MPX5010 Series .........................
MPX5050D Series .......................
MPX5100D Series ........................
MPX5500 Series .........................
MPX5700 Series .........................
MPX5999 Series .........................
2-48
2-55
2-59
2-63
2-67
2-72
2-78
2-82
2-86
High Impedance
MPX7050D Series ....................... 2-90
MPX7100D Series ....................... 2-94
MPX7200D Series ....................... 2-98
Temperature Sensor
MTS102, MTS103, MTS105 Devices ...... 2-102
Accelerometer
XMMAS40G10D, XMMAS40G10S ........ 2-106
XMMAS250G10D, XMMAS250G10S ...... 2-109
XMMAS500G10D, XMMAS500G10S ...... 2-112
SECTION THREE -
Application Notes
Quality and Reliability
Quality and Reliability - Overview ......... 3-2
Reliability Issues for Silicon Pressure
Sensors ................................ 3-3
(continued -
v
next page)
Table of Contents (continued)
SECTION FOUR (continued)
AN1516
AN1517
AN1518
AN1525
AN1535
AN1536
Appendix 5
Mounting and Handling Suggestions. . . . . . . .. 6-8
Liquid Level Control Using a
Motorola Pressure Sensor . . . . .. 4-135
Pressure Switch Design with
Semiconductor Pressure
Sensors .... ".................. 4-140
Using a Pulse Width Modulated
Output with Semiconductor
Pressure Sensors ............. 4-146
The A-B-C's of Signal-Conditioning
Amplified Design for Sensor
Applications ................... 4-152
Semiconductor Sensors Provide a
Hot Temperature Sensing Solution
at a Cool Price ................ 4-159
Digital Boat Speedometers ....... 4-166
SECTION FIVE Dimensions
Appendix 6
PressureNacuum Side Identification. . . . . . . .. 6-9
Appendix 7
Connectors for MPX Pressure Sensors ..... 6-10
Appendix 8
Pressure Measurement ... . . . . . . . . . . . . . . .. 6-11
Appendix 9
How the X-ducer Works. . . . . . . . . . . . . . . . . .. 6-12
Appendix 10
Standard Warranty Clause ................ 6-13
SECTION SEVEN - Glossary and
Symbols
Glossary of Terms. . . . . . . . . . . . . . . . . . . . . . . .. 7-2
Package Outline
Symbols, Terms and Definitions ............ 7-5
Package Outline Dimensions ... . . . . . . . . . . .. 6-2
SECTION EIGHT - Device Sample Kits
SECTION SIX -
Sensor Sample Kit Information ............. 8-2
Appendices
Sensor Sample Kit Order Form ............. 8-3
Appendix 1
Device Numbering System for Pressure
Sensors ............................... 6-2
SECTION NINE - Index and
Cross-Reference
Appendix 2
Marking Information for Pressure Sensor
Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 6-3
Pressure Range Index ..................... 9-2
Device Index ... . . . . . . . . . . . . . . . . . . . . . . . . . .. 9-4
Appendix 3
Pinout Diagrams for Pressure and Temperature
Sensors ............................... 6-4
SECTION TEN - Distributors and Sales
Offices ................................. 10-2
Appendix 4
Reference Tables ......................... 6-6
vi
Section One
Introduction
Selector Guide Information . ................. 1-2
General Product Information ................ 1-3
Performance ................................. 1-3
Accuracy .................................... 1-3
Unlimited Versatility ........................... 1-3
Integration . .................................. 1-4
On-Chip Signal Conditioning ................... 1-4
Motorola Pressure Sensors ................. 1-4
The Basic Structure ........................... 1-4
Motorola's Patented X-ducer ................... 1-4
The Basic Elements .......................... 1-5
Operation ................................... 1-5
Motorola Sensor Device Data
I ntraduction
1-1
Selector Guide Information
ELECTRICAL CHARACTERISTICS
Table 1. Uncompensated
Device Series
Pressure·
Range
kPalpsl
(Max)
Over
Pressure
(kPa)
MPX10D
MPX12D
MPX50D
MPX100D,A
MPX200D,A
MPX201D,A
MPX700D
10/45
10/45
5017.3
100/14.5
200/29
200/29
700/100
100
100
200
200
400
400
2100
Offset
mV(Typ)
Full Scale
Span
mV(Typ)
Sensitivity
(mV/kPa) (Typ)
20
20
20
20
20
20
20
35
55
60
60
60
60
60
3.5
5.5
1.2
0.6
0.3
0.3
0.086
-1
0
-0.1
-0.1
-0.25
-0.35
-0.50
1
5
0.1
0.1
0.25
0.35
0.50
25
40
40
40
40
40
2.5
0.8
0.8
0.4
0.2
0.057
-1.0
-0.25
-0.55
-0.25
-0.25
-0.5
1.0
0.25
0.25
0.25
0.25
0.5
Llnearlrr.
%ofFSS 1)
(Min) (Max)
Table 2. Compensated and Calibrated (On-Chip)
MPX2010D
MPX2050D
MPX2052D
MPX2100D,A
MPX2200D,.A
MPX2700D
10/1.45
50/7.3
50/7.3
100/14.5
200/29
700/100
75
200
200
400
400
2800
±0.05
±0.05
±0.1
±0.05
±0.05
±0.05
Temperature
Coefficient
of Span
%/'C (Typ)
Input
Impedance
Ohms (Typ)
-0.19
-0.19
-0.19
-0.19
-0.19
-0.19
-0.18
475
475
475
475
475
475
475
O/OVFSS
1800·
1800
1800
1800
1800
1800
±0.5
±0.5
±D.5
±D.5
±0.5
±0.5
Table 4. Signal Conditioned
Device Series
MPX4100A
MPX4101A
MPX4115A
MPX4250A
MPX5050D
MPX5100A
MPX5100D
MPX5500D
MPX5700D
MPX5999D
Pressure
kPalpsl
(Max)
Voltage
Source
Full Scale
Span
V (Typ)
Sensitivity
(mV/kPa) (Typ)
Accuracy
(0-85'C)
105/15.5
102/15.2
115117
250/35
50/7.3
115/17
100/14.5
500175
700/100
1000/150
5.1
5.1
5.1
5.1
5.0
5.0
5.0
5.0
5.0
5.0
4.59
4.70
4.59
4.69
4.70
4.50
4.50
4.50
4.50
4.50
54
54
54
58
90
45
45
9.0
6.0
5.0
1.5%
1.5%
1.5%
1.5%
2.5%
2.5%
2.5%
2.5%
2.5%
2.5%
Table 5. Temperature Sensors
Device Series
MTS102
MTS105
V(eR~eO
Min dc
VeE
mV(Typ)
AVeE
mV
AT
'c
TC
mV/'C(Typ)
4
4
595
595
3
7
2
5
-2.265
-2.265
(1 lSased on end pOint straight hne fit method. Best fit straight line linearity error is approximately 112 of listed value.
Devices listed in bold, italic are Motorola preferred devices.
Introduction
1-2
Motorola Sensor Device Data
General Product Information
Performance and price advantage all are part of the
technology associated with the MPX transducer series. The
unique design, coupled with computer controlled laser
trimming and semiconductor batch processing techniques,
makes these devices highly cost competitive.
40
_VS~10Vd
:g
35 30
§.
25
The performance of Motorola's MPX series of pressure
sensors is based on its patented strain gauge design. Unlike
the more conventional pressure sensors which utilize four
closely matched resistors in a Wheatstone bridge configuration, the MPX series uses only a single piezoresistive
element ion implanted on an etched silicon diaphragm to
sense the stress induced on the diaphragm by an external
pressure. The extremely linear output is an analog voltage
that is proportional to pressure input and ratiometric with
supply voltage. High sensitivity and excellent long-term
repeatability make these units suitable for the most demanding applications.
ACCURACY
Computer controlled laser trimming of on-chip calibration
and compensation resistors provide the most accurate
pressure measurement over a wide temperature range.
Temperature effect on span is typically ±O.5% of full scale
over a temperature range from 0 to 85°C, while the effect on
offset voltage over a similar temperature range is a maximum
of only ±1 mV.
UNLIMITED VERSATILITY
Choice of Specifications:
MPX pressure sensors are available in pressure ranges to
fit a wide variety of automotive, biomedical, consumer and
industrial applications.
Choice of Measurement:
Devices are available for differential, absolute, or gauge
pressure measurements.
!3
15
10
o
~
TYP,
MA:
~ 20
PERFORMANCE
~
TA·25'C
MPX2100
,
~
-5
,"' ~ ~ ~
~
T
SPAN
RANGE
(TYPJ
~
"MIN
'1
25
3.62
kPa 0
PSI
~
50
7.25
75
10.B7
100 OFFSET
14.5 (TYPJ
Linearity of output and less than ±1 mV variation in Offset over a
temperature range from -40 to 128'C attest to the excellent
performance of the compensated series of MPX pressure sensors.
Output versus Pressure Differential
~
a::
2
1.5
a?
ffi
t;;
1
~
/~
o.5
~
=J
0
~
,
.i... E RORB
",
I
I
SPAN RROR
~
\
-0.5
NDLIMI
FSETE ROR
1
iC
g5 -1.5
a:
a:
w
z
it
en
I
I
-2
-50
'\
-25
RROR AND LIMIT
25
50
75
""'
100
125
150
TEMPERATURE ('OJ
Curves of span and offset errors indicate the accuracy resulting from
on-chip compensation and laser trimming.
Temperature Error Band Limit and Typical Span
and Offset Errors
Choice of Chip Complexity:
MPX pressure sensors are available as the basic sensing
element, with temperature compensation and calibration, or
with full signal conditioning circuitry included on the chip.
Purchase of uncompensated units permits external compensation to any degree desired.
Choice of Packaging:
Buy it as a basic element for custom mounting, or in
conjunction with one or two Motorola designed ports that
provide printed circuit board mounting ease and barbed hose
pressure connections. Alternate packaging material, which
has been designed to meet biomedical compatibility requirements, is also available. Consult factory for information.
Motorola Sensor Device Data
DIFFERENTIAL PORT OPTION
CASE 352
Motorola MPXpressure sensors are available as basice/ements, or with
standard ports that facilitate mounting and media accessibility fordifferential, absolute or gauge pressure measurements.
Packaging Flexibility
Introduction
1-3
Integration
PIN 3
ON-CHIP SIGNAL CONDITIONING
To make the designer's job even easier, Motorola's
integrated devices carry sensor technology one step further.
Besides the on-chip temperature compensation and calibration offered currently on the MPX2000 series, amplifier signal
conditioning has been integrated on-chip in the MPX5000
series to allow interface directly to any microcomputer with an
on-board ND converter.
The signal conditioning is accomplished by means of a
four-stage amplification network, incorporating linear bipolar
processing, thin-film metallization techniques, and interactive
laser trimming to provide the state-of-the-art in sensor
technology.
-'W'r- THIN·FILM RESISTOR
+
LASERTRIMMABLE
RESISTOR
Fully Integrated Pressure Sensor
Introduction to Motorola Pressure Sensors
THE BASIC STRUCTURE
MOTOROLA'S PATENTED X-ducerTM
The Motorola pressure sensor is designed utilizing a
monolithic silicon piezoresistor, which generates a changing
output voltage with variations in applied pressure. The
resistive element, which constitutes a strain gauge, is ion
implanted on a thin silicon diaphragm.
Applying pressure to the diaphragm results in a resistance
change in the strain gauge, which in turn causes a change in
the output voltage in direct proportion to the applied
pressure. The strain gauge is an integral part of the silicon
diaphragm, hence there are no temperature effects due to
differences in thermal expansion of the strain gauge and the
diaphragm. The output parameters of the strain gauge itself
are temperature dependent, however, requiring that the
device be compensated if used over an extensive temperature range. Simple resistor networks can be used for narrow
temperature ranges, i.e., O°C to 85°C. For temperature
ranges from -40°C to + 125°C, more extensive compensation networks are necessary.
Excitation current is passed longitudinally through the
resistor (taps 1 and 3), and the pressure that stresses the
diaphragm is applied at a right angle to the current flow. The
stress establishes a transverse electric field in the resistor
that is sensed as voltage at taps 2 and 4, which are located at
the midpoint of the resistor. The single-element transverse
voltage strain gauge can be viewed as the mechanical
analog of a Hall effect device.
Using a single element eliminates the need to closely
match the four stress and temperature sensitive resistors that
form a Wheatstone bridge design. At the same time, it greatly
simplifies the additional circuitry necessary to accomplish
calibration and temperature compensation. The offset does
not depend on matched resistors but instead on how well the
transverse voltage taps are aligned. This alignment is
accomplished in a single photolithographic step, making it
easy to control, and is only a positive voltage, simplifying
schemes to zero the offset.
1---I
r!
ETCHED
DIAPHRAGM
BOUNDARY
I :~~;~~~~~A1N
i
GAUG'3e
L-'!ltf-~
23
PIN#
1. GROUND
2. +VOUT
3. Vs
4.-VOUT
Figure 1. Basic Uncompensated Sensor Element - Top View
Introduction
1-4
Motorola Sensor Device Data
THE BASIC ELEMENTS
Motorola silicon pressure sensors are available in three
different configurations that permit measurement of absolute,
differential and gauge pressure. Absolute pressure, such as
barometric pressure, is measured with respect to a built-in
vacuum reference. A pressure differential, such as the
pressure drop across a damper or filter in an air duct, is
measured by applying pressure to opposite sides of the
sensor simultaneously. Gauge pressure, as in blood pressure measurement, is a special case of differential pressure,
where atmospheric pressure is used as a reference.
Figure 2 illustrates an absolute pressure sensing die (left)
and a differential or gauge die in the chip carrier package.
The difference in die structure between a differential pressure
sensor and absolute pressure sensor is that the lalter does
not have a hole in the constraint wafer, and the chamber
formed by the etched cavity and the solid constraint wafer
contains the sealed-in reference vacuum.
The cross-section of the differential die in its chip carrier
package shows a silicone gel which isolates the die surface
and wire bonds from harsh environments while allowing a
pressure signal to be transmitted to the silicon diaphragm.
The MPX series pressure sensor operating characteristics
and internal reliability and qualification tests are based on
use of dry air as the pressure media. Media other than dry air
may have adverse effects on sensor performance and long
term stability. Contact the factory for information regarding
media compatibility in your application.
DIFFUSED
STRAIN GAUGE METALLIZATION
SILICONE
DIE COAT
GLASS FRIT
SEAL
SILICON
WAFER
SEALED
REFERENCE
VACUUM
DIE
RTV DIE
BOND
P2
DIFFERENTIAUGAUGE
ABSOLUTE SENSOR DIE
Figure 2. Cross-Sectional Diagrams (Not to Scale)
Operation
Motorola pressure sensors support three types
of pressure measurements: Absolute Pressure,
Differential Pressure and Gauge Pressure.
Absolute Pressure Sensors measure an
external pressure relative to a zero-pressure reference (vacuum) sealed inside the reference
chamber of the die during manufacture. This corresponds to a deflection of the diaphragm equal
to approximately 15 PSI (one atmosphere), generating a quiescent full-scale output for the
MPX100A (15 PSI) sensor, and a half-scale output for the MPX200A (30 PSI) device. Measurement of external pressure is accomplished by
applying a relative negative pressure to the
"Pressure" side of the sensor.
Differential Pressure Sensors measure the
difference between pressures applied simUltaneously to opposite sides of the diaphragm. A
positive pressure applied to the "Pressure" side
generates the same (positive) output as an equal
negative pressure applied to the "Vacuum" side.
Motorola Sensor Device Data
NEGATIVE PRESSURE
VACUUM
POSITIVE PRESSURE
t
•
~~I
~~
NEGATIVE
PRESSURE
I
I Absolute
I Sensor
I
VOS
-------1--
1 ATMPMAX
-INCREASING VACUUM
INCREASING PRESSURE--
VOS
PMAX
DIFFERENTIAL PRESSURE - INCREASING
Motorola sensing elements can withstand pressure inputs as high as four times their rated
capacity, although accuracy at pressures exceeding the rated pressure will be reduced.
When excessive pressure is reduced, the previous linearity will immediately be restored.
Figure 3. Pressure Measurements
Gauge Pressure readings are a special case of differential measurements
in which the pressure applied to the Pressure side is measured against the
ambient atmospheric pressure applied to the Vacuum side through the vent
hole in the chip of the differential pressure sensor elements.
Introduction
1-5
Introduction
1-6
Motorola Sensor Device Data
Section Two
Data Sheets
Basic Uncompensated
MPX10D, MPX12D Series ..................... 2-2
MPX50D Series .............................. 2-6
MPX100D Series ............................ 2-10
MPX200D Series ............................ 2-14
MPX700D Series ............................ 2-18
MPX906 Series ............................. 2-22
Calibrated and Temperature Compensated
MPX2010D, MPX2012D Series ...............
MPX2050D, MPX2052D Series ...............
MPX21 OOD, MPX21 01 D Series ...............
MPX2200D, MPX2201 D Series ...............
MPX2300D ................................
MPX2700 Series ............................
2-26
2-30
2-34
2-38
2-42
2-44
Signal Conditioned
MPX41 OOD, MPX41 01 Series .................
MPX4115A Series ...........................
MPX4250 Series ............................
MPX5010 Series ............................
MPX5050D Series ...........................
MPX51 ODD Series ...........................
MPX5500 Series ............................
MPX5700 Series ............................
MPX5999 Series ............................
2-48
2-55
2-59
2-63
2-67
2-72
2-78
2-82
2-86
High Impedance
MPX7050D Series ........................... 2-90
MPX71 ODD Series ........................... 2-98
MPX7200D Series ........................... 2-98
Temperature Sensor
MTS102, MTS103, MTS105 Devices .......... 2-102
Accelerometer
XMMAS40G10D, XMMAS40G10S ............ 2-106
XMMAS250G10D, XMMAS250G10S ......... 2-109
XMMAS500G1 OD, XMMAS500G1 OS ......... 2-112
Motorola Sensor Device Data
2-1
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 10 kPa (0 to 1.45 PSI)
MPX10
MPX12
SERIES
Uncompensated,
Silicon Pressure Sensors
The MPX10 and MPX12 series device is a silicon piezoresistive pressure sensor
providing a very accurate and linear voltage output - directly proportional to the applied
pressure. This standard, low cost, uncompensated sensor permits manufacturers to
design and add their own external temperature compensating and signal conditioning
networks. Compensation techniques are simplified because of the predictability of
Motorola's single element strain gauge design.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
• ±1.0% (Max) Linearity (MPX10D)
•
Ratiometric to Supply Voltage
•
Easy to Use Chip Carrier Package Options
•
Differential and Gauge Options
Application Examples
• Air Movement Control
•
Environmental Control Systems
•
Level Indicators
•
Leak Detection
•
Medicallnstrumentation
•
Industrial Controls
•
Pneumatic Control Systems
•
Robotics
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~8
CASE352~2
Style 1
Style 1
Pin Number
I
I
1
Ground
MAXIMUM RATINGS
2
+Vout
I
I
3
Vs
I
I
4
-You!
Symbol
Value
Unit
Overpressure(8) (P1 > P2)
Pmax
75
kPa
Burst Pressure(B) (P1 > P2)
Pburs!
100
kPa
Tstg
-50to+150
°C
TA
-40 to +125
°C
Rating
Storage Temperature
Operating Temperature
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure side (P1) relative to the vacuum
side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
PIN2
1..-..,..-----0 + Vou!
PIN4
' - - - - - 0 - Vou!
PIN 1
Figure 1. Uncompensated Pressure
Sensor Schematic
REV3
2-2
Motorola Sensor Device Data
MPX10 MPX12 SERIES
OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, Pl > P2)
Characteristic
Differential Pressure Range(l)
Supply Voltage(2)
Symbol
Min
Typ
Max
POP
0
-
10
kPa
-
3.0
6.0
Vdc
-
6.0
-
20
45
35
55
50
70
0
20
35
-
3.5
5.5
-
mVlkPa
-
1.0
5.0
%VFSS
%VFSS
Vs
Supply Current
10
Full Scale Span(3)
MPX10
MPX12
VFSS
Sensitivity
MPX10
MPX12
AV/AP
Linearity(5)
MPX10
MPX12
-
Offset(4)
Voff
-1.0
0
Unit
mAdc
mV
mV
-
-
±0.1
-
Temperature Hysteresis(5) (-40°C to +125°C)
-
±0.5
-
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-0.22
-
-0.16
%VFSS/oC
Pressure Hysteresis(5) (0 to 10 kPa)
TCVoff
-
±15
Temperature Coefficient of Resistance(5)
TCR
0.21
0.27
%ljnl°C
Input Impedance
lin
400
-
550
lout
750
n
n
%VFSS
Temperature Coefficient of Offset(5)
-
-
1250
Response TIme(6) (10% to 90%)
tR
-
1.0
Offset Stability(5)
-
-
±0.5
-
Symbol
Min
Typ
Max
-
-
2.0
Output Impedance
flV/oC
ms
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element, Case 344)
Warm-Up
Cavity Volume
Volumetric Displacement
Common Mode Line Pressure(7)
Unit
-
Grams
15
-
Sec
-
0.01
IN3
0.001
IN3
690
kPa
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TcOffset:
to 25°C.
• TCR:
lin deviation with minimum rated pressure applied, over the temperature range of -40°C to +125°C,
relative to 25°C.
6. Response TIme is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-3
MPX10 MPX12 SERIES
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature compensation over both -40 to +125°C and 0 to +80°C ranges are
presented in Motorola Applications Note AN840.
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX10 series over temperature.
The X-ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and ollset calibration can be
achieved rather simply with additional resistive components,
80
70
:g
-
60 -
I
I
f- MPX10
f- VS=3Vdc
P1 >P2
gSO
~
40
~ 30
20
~
.-
+2SoC_
~~
~
Z T
~- ~
SPAN
I RANGE
(TYP)
I
10
kPa
1
I
I
I
0.6
0.9
11.2
I .
I
4.0
6.0
8.0
PRESSURE DIFFERENTIAL
sr
g 40
20
10
OFFSET
(VOFF)
°0L-~~~~~~~~~~~~~M~AX7<~POP
PRESSURE (kPA)
Figure 3. Linearity Specification Comparison
Figure 2. Output versus Pressure Differential
SILICONE
DIE COAT
50
!3 30
1.
10
:g
o
(TYP)
0.3
I
2.0
LINEARITY
60
!3
I OFFSET
o
70,------------------------,
~
.....
~~
PSI 0
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
"best case" linearity error (lower numerical value), the calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
STAINLESS STEEL
METAL COVER
DIE
)~12~C;;~=:;~7}~THERMOPLASTIC
--.;
CASE
P2
RTV DIE
BOND
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX1 0 series pressure sensor operating characteris-
2-4
tics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX10 MPX12 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
sure sensor is designed to operate with positive differential
pressure applied, Pl > P2.
The Pressure (Pl) side may be identified by using the table
below:
Motorola designates the two sides of the pressure sensor
as the Pressure (Pl) side and the Vacuum (P2) side. The
Pressure (Pl) side is the side containing silicone gel which
protects the die from harsh media. The Motorola MPX presPart Number
MPX10D
Case Type
Pressure (P1) Side Identifier
MPX12D
344-08
Stainless Steel Cap
MPX10DP
MPX12DP
352-02
Side with Part Marking
MPX10GP
MPX12GP
350-03
Side with Port Attached
MPX10GVP
MPX12GVP
350-04
Stainless Steel Cap
MPX10GS
MPX12GS
371-06
Side with Port Attached
MPX10GVS
MPX12GVS
371-05
Stainless Steel Cap
MPX10GSX
MPX12GSX
371C-02
Side with Port Attached
MPX10GVSX
MPX12GVSX
371D-02
Stainless Steel Cap
ORDERING INFORMATION
MPX10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
Case 344-08
MPX10D
MPX12D
MPX10D
MPX12D
Ported Elements
Differential
Case 352-02
MPX10DP
MPX12DP
MPX10DP
MPX12DP
Case 350-03
MPX10GP
MPX12GP
MPX10GP
MPX12GP
Gauge Vacuum
Case 350-04
MPX10GVP
MPX12GVP
MPX10GVP
MPX12GVP
Gauge Stove Pipe
Case 371-06
MPX10GS
MPX12GS
MPX10D
MPX12D
Gauge Vacuum Stove Pipe
Case 371-05
MPX10GVS
MPX12GVS
MPX10D
MPX12D
Gauge Axial
Case 371 C-02
MPX10GSX
MPX12GSX
MPX10D
MPX12D
Gauge Vacuum Axial
Case 371 D-02
MPX10GVSX
MPX12GVSX
MPX10D
MPX12D
Gauge
Motorola Sensor Device Data
--
2-5
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 50 kPa
(0 to 7.25 PSI)
Uncompensated,
Silicon Pressure Sensors
MPX50
SERIES
The MPX50 silicon piezoresistive pressure sensor provides a very accurate and linear
voltage output - directly proportional to the applied pressure. This standard, low cost,
uncompensated sensor permits manufacturers to design and add their own external
temperature compensating and signal conditioning networks. Compensation techniques
are simplified because of the predictability of Motorola's single element strain gauge
design.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
•
Ratiometric to Supply Voltage
•
Easy to Use Chip Carrier Package Options
•
60 mV Span (typical)
•
Differential and Gauge Options
Application Examples
•
Air Movement Control
•
Environmental Control Systems
•
Level Indicators
•
Leak Detection
•
Medicallnstrumentation
•
Industrial Controls
•
Pneumatic Control Systems
•
Robotics
DIFFERENTIAL
PORT OPTION
CASE 352~2
Style 1
BASIC CHIP
CARRIER ELEMENT
CASE 344~8
Style 1
Pin Number
I
1
I
Ground
2
+Vout
I
3
I
Vs
I
I
4
-Vout
MAXIMUM RATINGS
Rating
Overpressure(8) (P1 > P2)
Burst Pressure(8) (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Pmax
200
kPa
Pburst
500
kPa
Tstg
-50 to +150
TA
-40 to +125
·C
·C
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure side (P1) relative to the vacuum
side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
Unit
PIN2
1..-.".-----0 + You!
PIN 4
' - - - - - 0 ( ) - Vou!
PIN 1
Figure 1. Uncompensated Pressure
Sensor Schematic
REV3
2-6
Motorola Sensor Device Data
MPX50 SERIES
OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25·C unless otherwise noted, PI > P2)
Characteristic
Pressure Range(1)
Symbol
POP
Min
6.0
-
45
60
90
0
20
35
1.2
-
Supply Current
10
VFSS
Voff
AViAP
kPa
50
6.0
-
Sensitivity
Unit
-
Vs
Full Scale Span(3)
Max
3.0
0
Supply Voltage(2)
Offset(4)
Typ
-
Vdc
mAdc
mV
mV
mV/kPa
Linearity(5)
-
-
0.25
%VFSS
Pressure Hysteresis(5) (0 to 50 kPa)
-
±0.1
-
%VFSS
Temperature Hysteresis(5) (- 40·C to + 125·C)
-
-
±0.5
-
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-0.22
-
-0.25
-0.16
%VFSS
%VFSs!·C
TCVoff
-
±15
-
jlV/·C
TCR
0.21
-
0.27
%lin/ C
Input Impedance
lin
400
-
550
Output Impedance
lout
750
-
1800
n
n
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
O
Response Time(6) (10% to 90%)
tR
-
1.0
-
ms
Offset Stability(5)
-
-
±0.5
-
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Weight (Basic Element Case 344)
-
-
2.0
-
Grams
Warm-Up
-
-
15
-
Sec
Cavity Volume
-
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
Common Mode Line Pressure(7)
-
-
-
690
kPa
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25·C.
Output deviation, alter 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85·C, relative to 25·C.
• TeSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative
• TeOffset:
to 25·C.
• TCR:
lin deviation with minimum rated pressure applied, over the temperature range of -40·C to +125·C,
relative to 25·C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-7
MPX50 SERIES
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX50 series over temperature.
The X-ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2050/MPX7050
series sensors.
Several approaches to external temperature compensation over both -40 to +125°C and 0 to +80°C ranges are
presented in Motorola Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 3). There are two basic methods
for calculating nonlir:learity: (1) end point straight line fit or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the ''worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
70r---------------------------,
100
I
MPX50
+25~
70 r-- VS=3Vdc
~ 40
~
0...
~ 30
20
-I
-
+ 125·C.........
..& ~ .........
u 60
50
-c
g
-40.C ,;'
..... ~
...... ~
P1 >P2
0
~
~
~
~
~
a
I
10
2
3
5
I6
4 I
20
30
40
PRESSURE DIFFERENTIAL
71
8
50
30
20
OFFSET
(TYP)
1
ACTUAL
g40
L
10
PSI
kPa 0
50
:if
SPAN
RANGE
(TYP)
~
o0
LINEARITY
60
90
80 f--
10
OFFSET
(VOFF)
°O~~~~~~~~~~~~~~~M~AX~.-PO·p
T
PRESSURE (kPA)
Figure 2. Output versus Pressure Differential
SILICONE
DIE COAT
Figure 3. Linearity Specification Comparison
DIE
P2
RTV DIE
BOND
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX50 series pressure sensor operating characteris-
2-8
tics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX50 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
protects the die from harsh media. The Motorola MPX presPart Number
sure sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Pressure (P1) Side Identifier
MPX50D
344-08
Stainless Steel Cap
MPX50DP
352-02
Side with Part Marking
MPX50GP
350-03
Side with Port Attached
MPX50GVP
350-04
Stainless Steel Cap
MPX50GS
371-06
Side with Port Attached
MPX50GVS
371-05
Stainless Steel Cap
MPX50GSX
371C-02
Side with Port Attached
MPX50GVSX
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX50 series pressure sensors are available in differential and gauge configurations. Devices are available with basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Basic Element
Ported Elements
Options
Differential
Case Type
Order Number
Device Marking
Case 344-08
MPX50D
MPX50D
Differential
Case 352-02
MPX50DP
MPX50DP
Gauge
Case 350-03
MPX50GP
MPX50GP
Gauge Vacuum
Case 350-04
MPX50GVP
MPX50GVP
Gauge Stovepipe
Case 371-06
MPX50GS
MPX50D
Gauge Vacuum Stovepipe
Case 371-05
MPX50GVS
MPX50D
Gauge Axial
Case 371 C-02
MPX50GSX
MPX50D
Gauge Vacuum Axial
Case 3710-02
MPX50GVSX
MPX50D
Motorola Sensor Device Data
2-9
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to
100 kPa (0 to 14.5 PSI)
Uncompensated,
Silicon Pressure Sensors
MPX100
SERIES
The MPX1 00 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output - directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola's single
element strain gauge design.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
•
Low Cost
Patented, Silicon Shear Stress Strain Gauge Design
•
Easy to Use Chip Carrier Package Options
•
Ratiometric to Supply Voltage
•
60 mV Span (typical)
•
Absolute, Differential and Gauge Options
Application Examples
•
Pump/Motor Controllers
•
Robotics
•
Levellndicators
•
Medical Diagnostics
•
Pressure Switching
•
Barometers
•
Altimeters
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~8
CASE352~2
Style 1
Stylet
Pin Number
1
Ground
I
I
I
2
3
I
+Vout
Vs
I
I
4
-Vout
MAXIMUM RATINGS
Symbol
Value
Unit
Overpressure(8) (P1 > P2)
Rating
Pmax
200
kPa
Burst Pressure(8) (PI> P2)
Pburst
2000
kPa
T8 tg
-50 to +150
'C
TA
-40 to +125
'C
Storage Temperature
Operating Temperature
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-in reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure (P1) side relative to the vacuum
(P2) side. Similarly, output voltage increases as increasing vacuum is applied to
the vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
PIN2
"-J"'-----o + Vout
X-ducer
PIN4
1-.-'11'-----0 - Vout
PIN 1
Figure 1. Uncompensated Pressure
Sensor Schematic
REV3
2-10
Motorola Sensor Device Data
MPX100 SERIES
OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, Pl > P2)
Characteristic
Pressure Range(l)
Symbol
Min
Max
Unit
POP
0
-
100
kPa
Typ
Supply Voltage(2)
Vs
-
3.0
6.0
Supply Current
10
-
6.0
-
Full Scale Span(3)
Offset(4)
VFSS
45
60
90
Voff
0
20
35
mV
-
mV/kPa
Sensitivity
I1V/I1P
-
0.6
Linearity(5)
-
-0.25
Pressure Hysteresis(5) (0 to 100 kPa)
-0.1
-
Temperature Hysteresis(5) (-40°C to +125°C)
-
-
±0.5
Temperature Coefficient of Full Scale Span(6)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
Output Impedance
Vdc
mAdc
TCVFSS
-0.22
TCVoff
-
TCR
0.21
Zin
400
Zout
750
±15
-
mV
0.25
%VFSS
0.1
%VFSS
-0.16
0.27
%VFSS
%VFSS/OC
/LV/oC
%Zin/ O C
550
Q
1800
Q
Response Time(6) (10% to 90%)
tR
-
1.0
-
ms
Offset Stability(5)
-
-
±0.5
-
%VFSS
Symbol
Min
Typ
-
2.0
MECHANICAL CHARACTERISTICS
Characteristic
Max
Unit
-
Grams
-
Sec
Weight (Basic Element Case 344)
-
Warm-Up
-
-
15
Cavity Volume
-
-
-
0.01
IN3
Volumetric Displacement
-
0.001
IN3
Common Mode Line Pressure(7)
-
-
-
-
690
kPa
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Ollset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TcOllset:
to 25°C.
Zin deviation with minimum rated pressure applied, over the temperature range of -40°C to +125°C,
• TCR:
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-11
MPX100 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 2). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the ''worse case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
TEMPERATURE COMPENSATION
Figure 3 shows the typical output characteristics of the
MPX1 00 series over temperature.
The X-ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components
or by designing your system using the MPX21 00/MPX71 00
series sensors.
Several approaches to external temperature compensation over both -40 to +125°C and a to +80°C ranges are
presented in Motorola Applications Note AN840.
70,---------------------------,
LINEARITY
60
70
-
60 -
:g
u 50
ACTUAL
:§.40
:;;:
t:::i
t:::i
V
./././
20
./
5
THEORETICAL
"/ ././ - - - - - - - - - - --+--''--
/
,;"
V.
h
~
T
..J.-"']
~ t25'C
....
....
V V
~ 30
./
~
./
v/
.s 40
~ 30
o
r- -40'C / /
P1 >P2
-
50
10
0s ~ 3.~ v~c
SPAN
RANGE
(TYP)
l......t:
t125'C
1
,....
~
o
12.0 4. o,I
1
6.0 8.0 10 1 112 141
10 20 30 40 50 60 70 80 90 100
20
10
"""
OFFSET
(TYP)
O~S8
(VOFF)
°oL-~~~~~~~~~~~~~-MwALX~~POP
PRESSURE (kPA)
PRESSURE DIFFERENTIAL
Figure 2. Linearity Specification Comparison
SILICONE GEL
DIE COAT
0
PSI
kPa
Figure 3. Output versus Pressure Differential
DIFFERENTIAUGAUGE
DIE
DIFFERENTIAUGAUGE ELEMENT
P2
SILICONE GEL ABSOLUTE
DIE COAT
DIE
DIE
BOND
ABSOLUTE ELEMENT
P2
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel helps protect the die
surface and wire bond from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm.
2-12
The MPX1 00 series pressure sensor operating characteristics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX100 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die from harsh media. The differential or
gauge sensor is designed to operate with positive differential
Part Number
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1) Side Identifier
Case Type
MPX100A, MPX100D
344-08
Stainless Steel Cap
MPX100DP
352-02
Side with Part Marking
MPX100AP, MPX100GP
350-03
Side with Port Attached
MPX100GVP
350-04
Stainless Steel Cap
MPX1 OOAS, MPX1 OOGS
371-06
Side with Port Attached
MPX100GVS
371-05
Stainless Steel Cap
MPX100ASX, MPX100GSX
371C-02
Side with Port Attached
MPX100GVSX
371D-02
Stainless Steel Cap
ORDERING INFORMATION
MPX100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the
basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections.
Device Type
Basic Element
Ported Elements
Options
Absolute, Differential
Case Type
MPXSeries
Device Marking
Case 344-08
MPX100A
MPX100D
MPX100A
MPX100D
Differential
Case 352-02
MPX100DP
MPX100DP
Absolute, Gauge
Case 350-03
MPX100AP
MPX100GP
MPX100AP
MPX100GP
Gauge Vacuum
Case 350-04
MPX100GVP
MPX100GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX100AS
MPX100GS
MPX100A
MPX100D
Gauge Vacuum Stove Pipe
Case 371-05
MPX100GVS
MPX100D
Absolute, Gauge Axial
Case 371 C-02
MPX100ASX
MPX100GSX
MPX100A
MPX100D
Gauge Vacuum Axial
Case 371 D-02
MPX100GVSX
MPX100D
Motorola Sensor Device Data
2-13
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 200 kPa
(0 to 29 PSI)
Uncompensated,
Silicon Pressure Sensors
MPX200
SERIES
The MPX200 series device is a silicon piezoresistive pressure sensors provide a very
accurate and linear voltage output - directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola's single
element strain gauge design.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
•
•
•
•
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge
±0.25% (max) Linearity
Full Scale Span 60 mV (Typ)
Easy to Use Chip Carrier Package Options
Ratiometric to Supply Voltage
Absolute, Differential and Gauge Options
Application Examples
• Pump/Motor Controllers
•
•
•
•
•
•
Robotics
Leve"ndicators
Medical Diagnostics
Pressure Switching
Barometers
Altimeters
1
Ground
MAXIMUM RATINGS
Rating
Overpressure(S) (P1 > P2)
Burst Pressure(8) (P1 > P2)
Storage Temperature
Operating Temperature
DIFFERENTIAL
PORT OPTION
BASIC CHIP
CARRIER ELEMENT
CASE 344-GS
Style 1
I
I
CASE352~2
Style 1
Pin Number
2
3
I
Vs
+Vout
I
I
I
4
-Vout
Symbol
Pmax
Value
400
Unit
kPa
Pburst
Tstg
TA
2000
-50 to +150
-40 to +125
kPa
·C
·C
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-in reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure (P1) side relative to the vacuum
(P2) side. Similarly, output voltage increases as increasing vacuum is applied to
the vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
PIN2
"-.,..-----0 + Vou!
PIN4
' - - - - - 0 - Vout
PIN 1
Figure 1. Uncompensated Pressure
Sensor Schematic
REV5
2-14
Motorola Sensor Device Data
MPX200 SERIES
OPERATING CHARACTERISTICS (VS =3.0 Vdc, TA =25'C unless otherwise noted, PI > P2)
Symbol
Min
Typ
Max
Pressure Range(l)
Characteristic
POP
0
-
200
Unit
kPa
Supply Voltage(2)
Vs
-
3.0
6.0
Vdc
-
6.0
-
mAdc
VFSS
45
60
90
mV
Voff
0
20
35
mV
Sensitivity
AV/AP
-
0.3
-
mV/kPa
Linearity(5)
-0.25
-
0.25
-
±0.1
Temperature Hysteresis(5) (-40'C to +125'C)
-
-
±0.5
-
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-0.22
-
-0.16
TCVoff
-
±15
-
I1V/'C
TCR
0.21
0.27
%lin/'C
550
n
n
Supply Current
10
Full Scale Span(3)
Offset(4)
Pressure Hysteresis(5) (0 to 200 kPa)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Inpullmpedance
Output Impedance
Zin
400
Zout
750
±0.5
-
1800
%VFSS
%VFSS
%VFSS
%VFSS/'C
Response Time(6) (10% to 90%)
tR
Offset Stability(5)
-
-
Symbol
Min
Typ
Max
Unit
-
-
2.0
Grams
15
-
-
0.01
IN3
0.001
IN3
690
kPa
1.0
ms
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344)
Warm-Up
Cavity Volume
Volumetric Displacement
Common Mode Line Pressure(7)
-
Sec
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratio metric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25'C.
Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85'C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative
• TcOffset:
to 25'C.
• TCR:
lin deviation with minimum rated pressure applied, over the temperature range of -40'C to +125'C,
relative to 25'C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-15
MPX200 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 2). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the ''worse case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
TEMPERATURE COMPENSATION
Figure 3 shows the typical output characteristics of the
MPX200 series over temperature. The output is directly proportional to the pressure and is essentially a straight line.
The X-ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components
or by designing your system using the MPX2200/MPX7200
series sensors.
Several approaches to external temperature compensation over both -40 to +125°C and 0 to +80°C ranges are
presented in Motorola Applications Note AN840.
70~------------------------~
LINEARITY
60
70
-
:g
60 -
50
-
I I I I
VS=3.0Vdc
Pl >P2
5
g:
1/
.VI
L
l/
I;'""
g40
5
- i-1-4~ocIL ./
- i-- .,I;'""
30
I.<'".:
20
,
10
OFFSET
(VOFF)
°O~~~~~~~~~~~~~~M~AA~r-P·Op
PRESSURE (kPA)
Figure 2. Linearity Specification Comparison
SILICONE GEL
DIE COAT
OIFFERENTIAUGAUGE
STAINLESS STEEL
DIE
METAL COVER
~
I:l""
"'"
+250C
....t""
+125°C
,
1;'""'
="'"
tSPAN
RANGE
(TYP)
1
OFFSET
(TYP)
16 20 1 124 28
30
0 14.0 8.0 1 12
PSI
20 40 60 80 100 120 140 160 180 200
kPa
PRESSURE DIFFERENTIAL
Figure 3. Output versus Pressure Differential
SILICONE GEL ABSOLUTE
DIE COAT
DIE
~~~~:j~=:::~~~ THERMOPLASTIC
CASE
WIRE BOND --:~~?2~;c5::=:::~7J~
~
LL...O:...c.....<:..L.L.L..L..II
DIFFERENTIAUGAUGE ELEMENT
P2
""":...c....<.L.L...c...L.. P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P 1) side may be identified by using the
table below:
Case Type
Pressure (P1) Side Identifier
MPX200A, MPX2000
344-08
Stainless Steel Cap
MPX2000P
352-02
Side with Part Marking
MPX200AP, MPX200GP
350-03
Side with Port Attached
MPX200GVP
350-·04
Stainless Steel Cap
MPX200AS, MPX200GS
371-06
Side with Port Attached
MPX200GVS
371-05
Stainless Steel Cap
MPX200ASX, MPX200GSX
371C-02
Side with Port Attached
MPX200GVSX
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the
basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPXSeries
Device Type
Options
Case Type
Basic Element
Absolute, Differential
Case 344-08
Ported Elements
Differential
Absolute, Gauge
Order Number
Device Marking
MPX200A
MPX200D
MPX200A
MPX200D
Case 352-02
MPX200DP
MPX200DP
Case 350-03
MPX200AP
MPX200GP
MPX200AP
MPX200GP
Gauge Vacuum
Case 350-04
MPX200GVP
MPX200GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX200AS
MPX200GS
MPX200A
MPX200D
Gauge Vacuum Stove Pipe
Case 371-05
MPX200GVS
MPX200D
Absolute, Gauge Axial
Case 371 C-02
MPX200ASX
MPX200GSX
MPX200A
MPX200D
Gauge Vacuum Axial
Case 3710-02
MPX200GVSX
MPX2000
Motorola Sensor Device Data
2-17
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 700 kPa
(0 to 100 PSI)
Uncompensated,
Silicon Pressure Sensors
MPX700
SERIES
The MPX700 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output - directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola's single
element strain gauge design.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
•
Low Cost
Patented, Silicon Shear Stress Strain Gauge Design
•
Linearity to ± 0.5% (Max) Linearity
•
Easy to Use Chip Carrier Package Options
•
Ratiometric to Supply Voltage
•
60 mV Span (typical)
•
Absolute, Differential and Gauge Options
Application Examples
•
Environmental Control Systems
•
Pneumatic Control Systems
•
Appliances
•
Automotive Performance Controls
•
Medicallnstrumentation
•
Industrial Controls
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~B
CASE352~2
Style 1
Style 1
Pin Number
I
I
1
Ground
MAXIMUM RATINGS
Rating
Symbol
2
+Vou!
I
3
I
Vs
I
I
4
-You!
Value
Unit
Overpressure(B) (P1 > P2)
Pmax
2BOO
kPa
Burs! Pressure(B) (P1 > P2)
Pburst
5000
kPa
Tstg
-50to +150
TA
-40to+125
·C
·C
Storage Temperature
Operating Temperature
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-in reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure side (P1) relative to the vacuum
side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
PIN2
1..-."...-----0 + Vou!
PIN4
' - - - - - 0 - Vout
PINl
Figure 1. Uncompensated Pressure
Sensor Schematic
REV3
2-18
Motorola Sensor Device Data
MPX700 SERIES
OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, PI > P2)
Characteristic
Pressure Range(l)
Supply Voltage(2)
Symbol
Min
POP
0
Full Scale Span(3)
Offset(4)
Sensitivity
MPX700D
MPX700A
Unit
700
kPa
3.0
6.0
Vdc
10
6.0
-
mAdc
VFSS
45
60
90
mV
Voff
0
20
35
86
-
/lV/kPa
0.5
1.0
%VFSS
%VFSS
AV/AP
Linearity(5)
Max
-
-
Vs
Supply Current
Typ
-
-0.5
-1.0
-
mV
Pressure Hysteresis(5) (0 to 700 kPa)
-
-
±0.1
-
Temperature Hysteresis(5) (-40°C to +125°C)
-
-
±0.5
-
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-0.21
-0.15
%VFSS/oC
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
Output Impedance
-
TCVoff
-
±15
-
/lV/oC
TCR
0.34
-
0.4
%lin/oC
lin
400
-
550
lout
750
-
1800
n
n
Response TIme(6) (10% to 90%)
tR
-
1.0
-
ms
Offset Stability(5)
-
-
±0.5
-
%VFSS
Min
Typ
-
2.0
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Warm-Up
-
-
Sec
-
-
15
Cavity Volume
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
Common Mode Line Pressure(7)
-
-
-
690
kPa
Weight (Basic Element, Case 344)
-
Grams
NOTES:
1. 1.0 kPa (kiioPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TcOffset:
to 25°C.
• TCR:
lin deviation with minimum rated pressure applied, over the temperature range of -40°C to +125°C,
relative to 25°C.
6. Response TIme is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-19
MPX700 SERIES
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX700 series over temperature.
The X-ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components.
80
I
I
-40'C......
70 r-- r- MPX700
_60 r-- r- Vs = 3 Vdc
P1 >P2
-8
50
g
50
~~
.." ~
I-
:::>
a. 40
~
30
~
20 ~
vy
~ ~25'C "+25'C
I
':?
~
OFFSET
(TYP)
10
o
PSI 0
kPa
T
SPAN
RANGE
I
120
fO
140
280
160
420
ro
560
1~oT
700
PRESSURE DIFFERENTIAL
Figure 2. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAUGAUGE
DIE
DIFFERENTIAUGAUGE ELEMENT
Several approaches to external temperature compensation over both -40 to + 125°C and 0 to + BO°C ranges are
presented in Motorola Applications Note AN84D.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = VOff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
"best case" linearity error (lower numerical value). the calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
70,-------------------------,
LINEARITY
:g-
50
g 40
5
go
is
30
20
10
OFFSET
(VOFF)
°O~~~~~~~~~~~~~~M~AX~~PO~P
PRESSURE (kPA)
Figure 3. Linearity Specification Comparison
SILICONE GEL ABSOLUTE
DIE COAT
DIE
DIE
BOND
ABSOLUTE ELEMENT
P2
P2
Figure 4. Cross-Sectional Diagrams (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX700 series pressure sensor operating character-
2-20
istics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX700 SERIES
PRESSURE (P1)/vACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
protects the die from harsh media. The differential or gauge
sensor is designed to operate with positive differential presPart Number
sure applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table on the below:
Case Type
Pressure (P1) Side Identifier
MPX700A, MPX700D
344-08
Stainless Steel Cap
MPX700DP
352-02
Side with Part Marking
MPX700AP, MPX700GP
350-03
Side with Port Attached
MPX700GVP
350-04
Stainless Steel Cap
MPX700AS, MPX700GS
371-06
Side with Port Attached
MPX700GVS
371-05
Stainless Steel Cap
MPX700ASX, MPX700GSX
371C-02
Side with Port Attached
MPX700GVSX
371D-02
Stainless Steel Cap
ORDERING INFORMATION
MPX700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Absolute, Differential
Case 344-08
MPX700A
MPX700D
MPX700A
MPX700D
Ported Elements
Differential
Case 352-02
MPX700DP
MPX700DP
Absolute, Gauge
Case 350-03
MPX700AP
MPX700GP
MPX700AP
MPX700GP
Gauge Vacuum
Case 350-04
MPX700GVP
MPX700GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX700AS
MPX700GS
MPX700A
MPX700D
Gauge Vacuum Stove Pipe
Case 371-05
MPX700GVS
MPX700D
Absolute, Gauge Axial
Case 371 C-02
MPX700ASX
MPX700GSX
MPX700A
MPX700D
Gauge Vacuum Axial
Case 371 D-02
MPX700GVSX
MPX700D
Motorola Sensor Device Data
2-21
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 6
kPa
Uncompensated,
Silicon Pressure Sensors
MPX906
SERIES
The MPX906D series device is a silicon piezoresistive pressure sensor providing a
very accurate and linear voltage output - directly proportional to the applied pressure.
This standard, low cost, uncompensated pressure sensor permits manufacturers to
design and add their own external temperature compensating and signal conditioning
networks. Compensation techniques are simplified because of the predictability of
Motorola's single element strain gauge design.
It is designed for applications exposing the pressure (P2) side of the device to water,
water vapor and soapy water vapor.
X- P2)
Pmaxl
100
kPa
Overpressure(S) (P2 > Pl)
Pmax2
10
kPa
Tstg
-40 to +125
°C
TA
-4010+125
°C
Storage Temperature
Operating Temperature
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The output voltage of the sensor increases with increasing pressure applied
to the (P2) side relative to the pressure side (Pl).
Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
I
I
6
N/C
PIN5
+ Vou!
~..r------o
PIN3
'-----0 -
voul
PIN2
Figure 1. MPX906 Pressure
Sensor Schematic
2-22
Motorola Sensor Device Data
MPX906 SERIES
OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted)
Characteristic
Pressure Range(1)
Symbol
Min
Typ
Max
POP
0
-
6.0
kPa
3.0
6.0
Vdc
6.0
-
Supply Voltage(2)
Vs
-
Supply Current
10
-
Full Scale Span(3)
Unit
mAdc
VFSS
9.0
20
32
Offset(4)
Voff
-40
-20
0
Sensitivity
VIP
3.3
-
mV/kPa
-
mV
mV
Linearity(5)
-
-0.5
-
2.0
%VFSS
Pressure Hysteresis (0 to 6 kPa) (5)
-
-
0.1
-
%VFSS
Temperature Hysteresis (O°C to +85°C) (5)
-
-
±0.5
-
Temperature Coefficient of Full Scale Span(5)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
Output Impedance
TCVFSS
TCVoff
-0.22
-
TCR
0.25
lin
400
lout
750
-18
0.30
-0.16
-
%VFSS
%VFSS/OC
/lV/oC
0.35
%linl°C
-
550
-
1875
n
n
Response Time (10% to 90%) (6)
tR
-
1.0
-
ms
Offset Stability(5)
-
-
±O.5
-
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
-
Grams
-
Sec
Weight (Basic Element, Case 867)
-
Warm-Up
-
-
15
Cavity Volume
-
-
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
-
4.0
NOTES:
1. 1.0 kPa (kiioPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
• Linearity:
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TcOffset:
to 25°C.
lin deviation with minimum rated pressure applied, over the temperature range of -40°C to + 125°C,
• TCR:
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case--to--Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-23
MPX906 SERIES
TEMPERATURE COMPENSATION
Figure 2 shows the output characteristics of the MPX906D
series at 25°C.
The X-ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components.
Several approaches to external temperature compensation over both -40 to + 125°C and 0 to + BO°C ranges are
presented in Motorola Applications Note ANB40.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voll + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end pOint straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
"best case" linearity error (lower numerical value), the calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
70
0-
i
~
:g
-5
50
g 40
I::>
-10
13 30
I::>
0
LINEARITY
60
O·C
0
-15
20
10
-25 0
~--....L10-0--20....0--3....L0-0- - 4....
00--.....
50-0---'600
PRESSURE DIFFERENTIAL (mmH20)
Figure 2. Output versus Pressure Differential
OFFSET
(VOFF)
-'--'--'--'--'-~~~~~~~~....LM.....
A~X-.-P·OP
°o. .
PRESSURE (kPA)
Figure 3. Linearity Specification Comparison
AMBIENT (P1) SIDE
STAINLESS STEEL
METAL COVER
EPOXY CASE
Figure 4. Cross-Sectional Diagram (not to scale)
2-24
Motorola Sensor Device Data
MPX906 SERIES
SOAPY WATER VAPOR COMPATIBILITY
The compatibility of this product to Soapy Water Vapor has
been verified by the reliability sample test method shown in
Figure 5. Samples were tested with bias for 504 hours and
evaluated to specification after completion of this vapor
exposure. Contact factory for details on liquid exposure
compatibility testing.
OUT
Test Conditions:
TA = 75°C
Vsupply = 6 Volts
Solution: 25 grams detergent and 50 milliliters
bleach per liter of Phoenix tap water.
Detergent and bleach brand names selected
per UL specification #UL2157 Electric Clothes
Washing Machines and Extractors
Devices exposed to vapors 5 cm above liquid.
TA = 75°C
MEDIAUQUID
Figure 5. Vapor Test Method
ORDERING INFORMATION
MPX906D series pressure sensors are available in basic element or ported configurations, which provide printed circuit board
mounting ease and barbed hose pressure connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
Case 867-{)4
MPX906D
MPX906D
Ported Element
Gauge Axial
Case 867H-02
MPX906GVW
MPX906D
Motorola Sensor Device Data
2-25
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 10 kPa
(0 to 1.45 PSI)
On-Chip Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX2010
MPX2012
SERIES
Motorola Preferred Devices
The MPX2010 and MPX2012 series silioon piezoresistive pressure sensors provide a
very .aoourate and linear voltage output - direotly proportional to the applied pressure.
These sensors house a single monolithio silioon die with the strain gauge and thin-film
resistor network integrated on eaoh ohip. The sensor is laser trimmed for preoise span,
offset oalibration and temperature oompensation.
X-ducer™
SILICON
PRESSURE SENSORS
Features
• Temperature Compensated over DOC to +85°C
• Full Soale Span Calibrated to 25 mV (typioal)
• Unique Silioon Shear Stress Strain Gauge
• ± 1.0% (Max) Linearity
• Easy to use Chip Carrier Paokage Options
• Ratiomelrio 10 Supply Voltage
• Differential and Gauge Options
Application Examples
• Respiratory Diagnostios
• Air Movement Control
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~8
CASE352~2
Style 1
Style 1
• Levellndioators
• Controllers
• Pressure Switohing
Pin Number
1
Ground
I
I
I
I
2
+Vout
3
Vs
I
I
4
-Vout
MAXIMUM RATINGS
Rating
Overpressure(S) (Pl > P2)
Symbol
Value
Unit
Pmax
75
kPa
Pburst
100
kPa
Storage Temperature
Tstg
-50 to +150
·C
Operating Temperature
TA
-40to+125
·C
Burst Pressure(S) (Pl > P2)
Vs
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-duoer is direotly proportional to the
differential pressure applied.
The output voltage of the differential or gauge sensor inoreases with
inoreasing pressure applied to the pressure side (P1) relative to the vaouum
side (P2). Similarly, output voltage inoreases as inoreasing vaouum is applied to
the vaouum side (P2) relative to the pressure side (P1).
Figure 1 shows a block diagram of the internal oirouitry on the stand-alone
pressure sensor ohip.
r--
I1
----------,
3
THIN FILM
X- P2)
Symbol
Min
Typ
Max
Unit
Pressure Range(l)
POP
0
-
10
kPa
Supply Voltage(2)
Vs
-
10
16
Supply Current
10
-
6.0
-
mAdc
VFSS
24
25
26
mV
Voff
-1.0
-1.5
-
1.0
1.5
mV
Characteristic
Full Scale Span(3)
Offset(4)
MPX2010
MPX2012
Vdc
Sensitivity
1!"v/IlP
-
2.5
-
mV/kPa
Linearity(5)
-
-1.0
-
1.0
%VFSS
-
±0.1
-
±0.5
-
%VFSS
TCVFSS
-1.0
%VFSS
-1.0
-
1.0
TCVoff
1.0
mV
Input Impedance
Zin
1300
2550
Output Impedance
Zout
1400
-
3000
n
n
%VFSS
Pressure Hysteresis(5) (0 to 10 kPa)
Temperature Hysteresis(5) (-40'C to +125'C)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
%VFSS
Response lime(6) (10% to 90%)
tR
-
1.0
Offset Stability(5)
-
-
±0.5
-
Symbol
Min
Typ
Max
Unit
-
2.0
-
15
-
Grams
Warm-Up
-
Cavity Volume
-
-
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
690
kPa
ms
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344)
Common Mode Line Pressure(?)
Sec
NOTES:
1. 1.0 kPa (kiioPascal) equals 0.145 psi.
2. Device is ratio metric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage atfull rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure. using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25'C.
Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85'C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative
• TcOffset:
to 25'C.
6. Response lime is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
? Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-27
MPX2010 MPX2012 SERIES
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 2 shows the output characteristics of the MPX201 0
series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
I
I
30 r-- Vs =10 Vdc
TA =25°C
25 f-- Pl >P2
1
20
Mk
0..
~
10
5
.....
~~
I
~ 15
a
~
~
-5
kPa
PSI
TYP,
....... ~ ~
~ ;;..-~~
~
'MIN
2.5
0.362
This performance over temperature is achieved by having
both the shear stress strain gauge and the thin-film resistor
circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration
and temperature compensation.
5
0.725
7.5
1.09
STAINLESS STEEL
METAL COVER
StN
RANGE
I
-ra;FSET
10
(TYP)
1.45
Figure 2. Output versus Pressure Differential
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2010 series pressure sensor operating charac-
P2
RTV DIE
BOND
Figure 3. Cross-Sectional Diagram (not to scale)
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange pressure.
PRESSURE (% FULLSCALE)
Figure 4. Linearity Specification Comparison
2-28
Motorola Sensor Device Data
MPX2010 MPX2012 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
protects the die from harsh media. The Motorola MPX pres-
sure sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Part Number
Pressure (P1) Side Identifier
MPX2010D
MPX2012D
344-08
Stainless Steel Cap
MPX2010DP
MPX2012DP
352-02
Side with Part Marking
MPX2010GP
MPX2012GP
350-03
Side with Port Attached
MPX2010GVP
MPX2012GVP
350-04
Stainless Steel Cap
MPX2010GS
MPX2012GS
371-06
Side with Port Attached
MPX2010GVS
MPX2012GVS
371-05
Stainless Steel Cap
MPX2010GSX
MPX2012GSX
371C-02
Side with Port Attached
MPX2010GVSX
MPX2012GVSX
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX2010 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
Case 344-08
MPX2010D
MPX2012D
MPX2010D
MPX2012D
Ported Elements
Differential
Case 352-02
MPX2010DP
MPX2012DP
MPX2010DP
MPX20120P
Gauge
Case 350-03
MPX2010GP
MPX2012GP
MPX2010GP
MPX2012GP
Gauge Vacuum
Case 350-04
MPX2010GVP
MPX2012GVP
MPX2010GVP
MPX2012GVP
Gauge Stove Pipe
Case 371-06
MPX2010GS
MPX2012GS
MPX2010D
MPX2012D
Gauge Vacuum Stove Pipe
Case 371-05
MPX2010GVS
MPX2012GVS
MPX2010D
MPX2012D
Gauge Axial
Case 371 C-02
MPX2010GSX
MPX2012GSX
MPX2010D
MPX2012D
Gauge Vacuum Axial
Case 371 0-02
MPX2010GVSX
MPX2012GVSX
MPX2010D
MPX2012D
Motorola Sensor Device Data
2-29
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 50 kPa
(0 to 7.25 PSI)
On-Chip Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX2050
MPX2052
SERIES
Motorola Preferred Devices
The MPX2050 and MPX2052 series device is a silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output - directly proportional to the
applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain
gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation.
X-ducer™
SILICON
PRESSURE SENSORS
Features
• Temperature Compensated Over O°C to + 85°C
• Unique Silicon Shear Stress Strain Gauge
• Full Scale Span Calibrated to 40 mV (typical)
• Easy to Use Chip Carrier Package Options
• Ratiometric to Supply Voltage
• Differential and Gauge Options
Application Examples
• Pump/Motor Controllers
• Robotics
• Levellndicators
• Medical Diagnostics
• Pressure Switching
• Non-Invasive Blood Pressure Measurement
DIFFERENTIAL
PORT OPTION
CASE 352-02
Style 1
BASIC CHIP
CARRIER ELEMENT
CASE 344-08
Style 1
Pin Number
1
Ground
MAXIMUM RATINGS
Rating
Overpressure(8) (P1 > P2)
Burst Pressure(8) (P1 > P2)
I
I
Symbol
Pmax
I
2
3
I
+Vout
Vs
I
4
I
-Vout
Value
200
Unit
kPa
Pburst
500
kPa
Storage Temperature
Tstg
-50 to +150
°C
Operating Temperature
TA
-40 to +125
·C
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure side (P1) relative to the vacuum
side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a block diagram of the internal circuitry on the stand-alone
pressure sensor chip.
Preferred devices are Motorola recommended choices for future use and best overall value.
Vs
r--
----------,I
3
I
THIN FILM
I
I2
TEMPERATURE
I X-ducer
COMPENSATION
I SENSING
I4
AND
I ELEMENT L-+---1 CALIBRATION
I
I
CIRCUITRY
I1.. _ _ _ _ _ _ _ _ _ _ _ _ .JI
Vout-
1
GND
Figure 1. Temperature Compensated
Pressure Sensor Schematic
REV 4
2-30
Motorola Sensor Device Data
MPX2050 MPX2052 SERIES
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 2S'C unless otherwise noted, P1 > P2)
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
Characteristic
POP
0
-
SO
kPa
Supply Voltage(2)
Vs
-
10
16
Vdc
Supply Current
10
-
6.0
-
mAdc
mV
Full Scale Span(3)
MPX20S0, MPX20S2
VFSS
38.S
40
41.S
Offset(4)
MPX20S0, MPX20S2
Voff
-1.0
-
1.0
0.8
-
Sensitivity
lNIAP
Linearity(S)
MPX20S0
MPX20S2
-
-0.2S
-O.SS
-
0.2S
0.2S
mV
mV/kPa
%VFSS
Pressure Hysteresis(S) (0 to SO kPa)
-
-
±0.1
-
%VFSS
Temperature Hysteresis(S) (-40'C to +12S'C)
-
-
±O.S
-
%VFSS
TCVFSS
-1.0
-
1.0
%VFSS
TCVoff
-1.0
1.0
mV
Zin
1000
2S00
Q
Zout
1400
-
3000
Q
-
1.0
-
ms
±O.S
-
%VFSS
Temperature Effect on Full Scale Span(S)
Temperature Effect on Offset(S)
Input Impedance
Output Impedance
Response TIme(6) (10% to 90%)
tR
Offset Stability(S)
-
MECHANICAL CHARACTERISTICS
Min
Typ
Max
Unit
Weight (Basic Element Case 344)
-
-
2.0
Grams
Characteristic
Symbol
Warm-Up
-
-
1S
-
Cavity Volume
-
-
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
-
690
kPa
Common Mode Line Pressure(?)
Sec
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.14S psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
S. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 2S'C.
Output deviation, after 1000 temperature cycles, - 40 to 12S'C, and 1.S million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 8S'C, relative to 2S'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 8S'C, relative
• TcOffset:
t02S'C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
? Common mode pressures beyond specified may result in leakage at the case-to-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-31
MPX2050 MPX2052 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange pressure.
/1/
/ / /1
V/
/
~
lND POINT
yTRAIGHT LINE FIT
1
OFFSET
1
1
50
PRESSURE (% FULLSCALE)
100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the minimum, maximum and typical output
characteristics of the MPX2050 series at 25°C. The output is
directly proportional to the differential pressure and is essentially a straight line.
:g
§.
5D-
40 r35 I30 r25
20
B1510
kPa
PSI
-5
,
0
Vs =10 Vdc
TA = 25°C
MPX2050
P1 >P2
...-
~
-
TY\
~
MAX,
-0
0-
~
~
"
~
12.5
1.8
l"MIN
25
3.6
37.5
5.4
T
STAINLESS STEEL
METAL COVER
SPAN
RANGE
lrn~
50
7.25
(TYP)
Figure 3. Output versus Pressure Differential
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX2050 series pressure sensor operating charac-
2-32
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating Characteristics.
P2
RTV DIE
BOND
Figure 4. Cross-Sectional Diagram (not to scale)
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX2050 MPX2052 SERIES
PRESSURE (P1)/vACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die. The Motorola MPX pressure sensor is
Part Number
MPX2050D
MPX20510
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Pressure (P1) Side Identifier
MPX2052D
344-08
Stainless Steel Cap
MPX2050DP
MPX20510P
MPX2052DP
352-02
Side with Part Marking
MPX2050GP
MPX2051GP
MPX2052GP
350-03
Side with Port Attached
MPX2050GVP
MPX2051GVP
MPX2052GVP
350-04
Stainless Steel Cap
MPX2050GS
MPX2051GS
MPX2052GS
371-06
Side with Port Attached
MPX2050GVS
MPX2051GVS
MPX2052GVS
371-05
Stainless Steel Cap
MPX2050GSX
MPX2051GSX
MPX2052GSX
371C-02
Side with Port Attached
MPX2050GVSX
MPX2051 GVSX
MPX2052GVSX
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX2050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
344-08
MPX2050D
MPX2051D
MPX2052D
MPX2050D
MPX2051D
MPX2052D
Ported Elements
Differential
352-02
MPX2050DP
MPX2051DP
MPX2052DP
MPX2050DP
MPX2051DP
MPX2052DP
Gauge
350-03
MPX2050GP
MPX2051GP
MPX2052GP
MPX2050GP
MPX2051GP
MPX2052GP
Gauge Vacuum
350-04
MPX2050GVP
MPX2051GVP
MPX2052GVP
MPX2050GVP
MPX2051GVP
MPX2052GVP
Gauge Stove Pipe
371-06
MPX2050GS
MPX2051GS
MPX2052GS
MPX2050D
MPX2051D
MPX2052D
Gauge Vacuum Stove Pipe
371-05
MPX2050GVS
MPX2051GVS
MPX2052GVS
MPX2050D
MPX2051D
MPX2052D
Gauge Axial
371C-02
MPX2050GSX
MPX2051GSX
MPX2052GSX
MPX2050D
MPX2051D
MPX2052D
Gauge Vacuum Axial
371D-02
MPX2050GVSX
MPX2051 GVSX
MPX2052GVSX
MPX2050D
MPX20510
MPX2052D
Motorola Sensor Device Data
2-33
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 100 kPa
(0 to 14.5 PSI)
On-Chip Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX2100
MPX2101
SERIES
Motorola Preferred Devices
The MPX21 00 and MPX21 01 series device is a silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output - directly proportional to the
applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain
gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
Temperature Compensated Over O°C to +85°C
•
Unique Silicon Shear Stress Strain Gauge
•
Full Scale Span Calibrated to 40 mV (typical)
•
Easy to Use Chip Carrier Package Options
•
Available in Absolute, Differential and Gauge
Configurations
•
Ratiometric to Supply Voltage
Application Examples
•
Pump/Motor Controllers
•
•
Robotics
Level Indicators
•
Medical Diagnostics
•
Pressure Switching
•
Barometers
•
Altimeters
BASIC CHIP
CARRIER ELEMENT
CASE34~8
DIFFERENTIAL
PORT OPTION
CASE 352-{)2
Style 1
Style 1
Pin Number
1
Ground
MAXIMUM RATINGS
I
I
I
I
2
+Vout
3
Vs
I
1
4
-Vout
Symbol
Value
Unit
Pmax
400
kPa
Pburst
1000
kPa
Storage Temperature
Tsig
-50to+150
·C
Operating Temperature
TA
-40 to +125
·C
Rating
Overpressure(8) (P1 > P2)
Burst Pressure(8) (P1 > P2)
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-in reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure (P1) side relative to the vacuum
(P2) side. Similarly, output voltage increases as increasing vacuum is applied to
the vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone
pressure sensor chip.
r--
I1
----------,1
3
THIN FILM
TEMPERATURE
X-ducer ---..,----, COMPENSATION
SENSING
AND
ELEMENT
CALIBRATION
I
I
I
I1.. _ _ _ _
12
Vout+
1
I
_ _ _ _ _ _ _ _ .JI
4
Vout-
CIRCUITRY
GND
Preferred devices are Molorola recommended choices for future use and besl overall value.
Figure 1. Temperature Compensated
Pressure Sensor Schematic
REV5
2-34
Motorola Sensor Device Data
MPX2100 MPX2101 SERIES
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure Range(1)
Supply Voltage(2)
Symbol
Min
Typ
Max
POP
0
-
100
kPa
10
16
Vdc
Vs
Supply Current
10
Full Scale Span(3)
MPX2100A, MPX21 000, MPX21 010
MPX2101A
Offset(4)
MPX2100D, MPX21010
MPX2100A
MPX2101A
MPX2100D
MPX2100A
MPX21010
MPX2101A
VFSS
mV
Voff
-1.0
-2.0
-3.0
-
-
1.0
2.0
3.0
mV
-
0.4
-0.25
-1.0
-0.5
-2.0
-
0.25
1.0
0.5
2.0
±0.1
-
%VFSS
±0.5
-
%VFSS
1.0
%VFSS
1.0
mV
2500
n
n
-
-
-
Input Impedance
Output Impedance
mAdc
41.5
42.5
Pressure Hysteresis(5) (0 to 100 kPa)
Temperature Effect on Offset(5)
-
40
40
Temperature Hysteresis(5) (-40°C to +125°C)
Temperature Effect on Full Scale Span(5)
6.0
38.5
37.5
IlV/IlP
Sensitivity
Linearity(5)
-
Unit
-
TCVFSS
-1.0
TCVoff
-1.0
Zin
1000
Zout
1400
-
-
3000
mV/kPa
%VFSS
-
1.0
-
ms
±0.5
-
%VFSS
Symbol
Min
Typ
-
-
Response Time(6) (10% to 90%)
tR
Offset Stability(5)
-
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344)
Max
Unit
-
Grams
15
-
Sec
-
-
0.01
IN3
-
-
-
-
-
Cavity Volume
-
Volumetric Displacement
Common Mode Line Pressure(7)
Warm-Up
2.0
0.001
IN3
690
kPA
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, aiter the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, aiter 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TcOffset:
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-35
MPX2100 MPX2101 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
f
STRAIGHT LINE
DEVIATION
t
OFFSET
50
PRESSURE (% FULLSCALE)
100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
Figure 3 shows the output characteristics of the MPX21 00
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
1
1
.J'
40 VS=10Vdc
~
TA= 25°C
35 1
~ .....
_
:g 30 _ Pl>P2
I- TY~
SPAN
~ .....
I
:§. 25 - I - MAX,
RANGE
~
~ 20
T
~ 15
o 10
5
kPa
PSI
-5
I
~~
c..
,
~
?P
"MIN
'I
I
25
3.62
0
50
75
7.25
10.B7
tOFFSET
100
(TYP)
14.5
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAUGAUGE
DIE
DIFFERENTIAUGAUGE ELEMENT
P2
SILICONE GEL ABSOLUTE
DIE COAT
DIE
ABSOLUTE ELEMENT
P2
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating charac-
2-36
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX2100 MPX2101 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die. The differential or gauge sensor is
designed to operate with positive differential pressure
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MPX2100A
MPX2100D
MPX2101A
MPX2100DP
MPX2100AP
MPX2101DP
MPX2100GP
MPX2101AP
MPX2100GVP
MPX2100AS
MPX2101AS
MPX2100GVS
MPX2100ASX
MPX2101GP
MPX2101GVP
MPX2100GS
MPX2101GS
MPX2101GVS
MXP2100GSX
MPX2101ASX
MPX2100GVSX
Pressure (P1) Side Identifier
Case Type
MPX2101D
MXP2101GSX
MPX2101GVSX
344-08
Stainless Steel Cap
352-02
Side with Part Marking
350-03
Side with Port Attached
350-04
Stainless Steel Cap
371-06
Side with Port Attached
371-05
Stainless Steel Cap
371C-02
Side with Port Attached
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in
the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Absolute, Differential
Case 344-08
MPX2100A
MPX21 000
MPX2101A
MPX2101D
MPX2100A
MPX21 000
MPX2101A
MPX2101D
Ported Elements
Differential
Case 352-02
MPX2100DP
MPX2101DP
MPX2100DP
MPX2101DP
Absolute, Gauge
Case 350-03
MPX2100AP
MPX2100GP
MPX2101AP
MPX2101GP
MPX2100AP
MPX2100GP
MPX2101AP
MPX2101GP
Gauge Vacuum
Case 350-04
MPX2100GVP
MPX2101GVP
MPX2100GVP
MPX2101GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX2100AS
MPX2100GS
MPX2101AS
MPX2101GS
MPX2100A
MPX210DD
MPX2101A
MPX2101D
Gauge Vacuum Stove Pipe
Case 371-05
MPX2100GVS
MPX2101GVS
MPX2100D
MPX21D1D
Absolute, Gauge Axial
Case 371 C-02
MPX21 DOASX
MPX2100GSX
MPX2101ASX
MPX2101GSX
MPX2100A
MPX21DDD
MPX2101A
MPX2101D
Gauge Vacuum Axial
Case 371 0-02
MPX2100GVSX
MPX2101GVSX
MPX2100D
MPX2101D
Motorola Sensor Device Data
2-37
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 200 kPa
(0 to 29 PSI)
On-Chip Temperature
Compensated & Calibrated,
Pressure Sensors
MPX2200
MPX2201
SERIES
Motorola Preferred Devices
The MPX2200 and MPX2201 series device is a silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output - directly proportional to the
applied pressure. The sensor is a single monolithic silicon diaphragm with the strain
gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation. They are designed
for use in applications such as pump/motor controllers, robotics, level indicators, medical
diagnostics, pressure switching, barometers, altimeters, etc.
Features
• Temperature Compensated Over O°C to +85°C
• Patented Silicon Shear Stress Strain Gauge
• ±O.25% Linearity (MPX2200D)
• Easy to Use Chip Carrier Package
• Available in Absolute, Differential and Gauge
Configurations
X-clucer"M
SILICON
PRESSURE SENSORS
Application Examples
• Pump/Motor Controllers
• Robotics
• Levellndicators
• Medical Diagnostics
• Pressure Switching
• Barometers
• Altimeters
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~8
CASE352~2
Style 1
Style 1
Pin Number
1
Ground
MAXIMUM RATINGS
I
I
I
J
2
+Vout
3
j
4
Vs
j
-Vout
Symbol
Value
Unit
Overpressure(8) (PI> P2)
Pmax
400
kPa
Burst Pressure(8) (PI> P2)
Pburst
2000
kPa
Tstg
-50 to +150
TA
-40 to +125
·C
·C
Rating
Storage Temperature
Operating Temperature
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-in reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure (P1) side relative to the vacuum
(P2) side. Similarly, output voltage increases as increasing vacuum is applied to
the vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone
pressure sensor chip.
Vs
r--
I1
X-ducer
1 SENSING
----------,1
3
_..r---.
1ELEMENT '-+--1
1
1
1... _ _ _ _
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
12
Vout.
1
4
1
_ _ _ _ _ _ _ _ .J1
1
GND
Preferred devices are Motorola recommended choices for future use and best overall value.
Figure 1. Temperature Compensated
Pressure Sensor Schematic
REV 6
2-38
Motorola Sensor Device Data
MPX2200 MPX2201 SERIES
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA =25'C unless otherwise noted, P1 > P2)
Characteristics
Pressure Range(1)
Symbol
Min
Typ
Max
Unit
POP
0
-
200
kPa
-
10
16
6.0
-
VFSS
38.5
37.5
40
40
41.5
42.5
mV
Voff
-1.0
-2.0
-3.0
-
-
1.0
2.0
3.0
mV
I!.VII!.P
-
0.2
Supply Voltage
Vs
Supply Current
10
Full Scale Span(3)
MPX2200A, MPX2200D, MPX2201 D
MPX2201A
Offset(4)
MPX2200A, MPX2200D
MPX2200A
MPX2201A
Sensitivity
Linearity(5)
MPX2200D
MPX2200A
MPX2201D
MPX2201A
-
-0.25
-1.0
-0.5
-2.0
-
-
0.25
1.0
0.5
2.0
Vdc
mAdc
mV/kPa
%VFSS
Pressure Hysteresis(5) (0 to 200 kPa)
-
-
±0.1
-
%VFSS
Temperature Hysteresis(5) (-40'C to +125'C)
-
-
±0.5
-
%VFSS
TCVFSS
-1.0
1.0
%VFSS
TCVolt
-1.0
-
1.0
mV
lin
1300
-
2500
Q
lout
1400
-
3000
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
Response Time(6) (10% to 90%)
tR
Offset Slability(5)
-
-
1.0
±0.5
-
Q
ms
%VFSS
MECHANICAL CHARACTERISTICS
Characteristics
Weight, (Basic Element Case 344)
Warm-Up
Cavity Volume
Volumetric Displacement
Common Mode Line Pressure(7)
Symbol
-
Min
-
-
Typ
2.0
15
-
Max
-
Unit
Grams
Sec
0.01
IN3
0.001
IN3
690
kPa
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25'C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85'C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative
• TcOffset:
to 25'C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-39
MPX2200 MPX2201 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the ''worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
f
STRAIGHT LINE
DEVIATION
t
OFFSET
o
100
PRESSURE (% FULLSCALE)
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2200
series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
VS=10Vdc
TA = 25°C
Pl >P2
40
35
:g
g
!3
./
30
25 f - f- Mlx
"20
§ 15
10
~
a:::-
25
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
#
50
7.25
~
~"
TYP,
~~
~
~
100
14.5
125
SPAN
RANGE
J
~IN
75
T
150
21.75
175
L
200
OFFSET
29
PRESSURE
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAUGAUGE
DIE
DIFFERENTIAUGAUGE ELEMENT
P2
SILICONE GEL ABSOLUTE
DIE COAT
DIE
DIE
BOND
ABSOLUTE ELEMENT
P2
DIE
BOND
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from
harsh environments, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2200 seilss Pi6SSUi8 senSOi opsiating chaiac-
2-40
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX2200 MPX2201 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die from harsh media. The differential or
gauge sensor is designed to operate with positive differential
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Part Number
MPX2200A
MPX2200D
MPX2201A
MPX2200GP
MPX2201AP
MPX2200DP
MPX2200AP
MPX2201DP
MPX2200GVP
MPX2200AS
MPX2201GP
MPX2201GVP
MPX2200GS
MPX2201AS
MPX2201GS
MPX2201GVS
MPX2200GVS
MPX2200ASX
MPX2201D
MPX2200GSX
MPX2201ASX
MPX2200GVSX
MPX2201GSX
MPX2201GVSX
344-08
Pressure (P1) Side Identifier
Stainless Steel Cap
352-02
Side with Part Marking
350-03
Side with Port Attached
350-04
Stainless Steel Cap
371-06
Side with Port Attached
371-05
Stainless Steel Cap
371G-02
Side with Port Attached
371D-02
Stainless Steel Cap
ORDERING INFORMATION
MPX2200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in
the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPXSerles
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Absolute, Differential
Case 344-08
MPX2200A
MPX2200D
MPX2201A
MPX2201D
MPX2200A
MPX2200D
MPX2201A
MPX2201D
Ported Elements
Differential
Case 352-02
MPX2200DP
MPX2201DP
MPX2200DP
MPX2201DP
Absolute, Gauge
Case 350-03
MPX2200AP
MPX2200GP
MPX2201AP
MPX2201GP
MPX2200AP
MPX2200GP
MPX2201AP
MPX2201GP
Gauge Vacuum
Case 350-04
MPX2200GVP
MPX2201GVP
MPX2200GVP
MPX2201GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX2200AS
MPX2200GS
MPX2201AS
MPX2201GS
MPX2200A
MPX2200D
MPX2201A
MPX2201D
Gauge Vacuum Stove Pipe
Case 371-05
MPX2200GVS
MPX2201GVS
MPX2200D
MPX2201D
Absolute, Gauge Axial
Case 371 C-02
MPX2200ASX
MPX2200GSX
MPX2201ASX
MPX2201GSX
MPX2200A
MPX2200D
MPX2201A
MPX2201D
Gauge Vacuum Axial
Case 371 0-02
MPX2200GVSX
MPX2201GVSX
MPX2200D
MPX220tD
Motorola Sensor Device Data
2-41
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Chip Pak
High Volume Pressure
Sensor for Disposable,
Backside Pressure Applications
MPX2300D
Motorola has developed a low cost, high volume, miniature pressure sensor package
which is ideal as a sub-module component or a disposable unit. The unique concept of
the Chip Pak allows great flexibility in system design while allowing an economic solution
for the designer. This new chip carrier package uses Motorola's unique sensor die with its
patented, piezoresistive implant technology, along with the added feature of on--chip,
thin-film temperature compensation and calibration.
PRESSURE SENSORS
Features:
•
•
Low Cost
Patented piezoresistive strain gauge implant, temperature compensation
and calibration all integrated on a single, monolithic sensor die.
•
Pressure Range Available: 0-300 mmHg
•
Polysulfone (Mindell 8-1000) Case Material (Medical, Class VI Approved)
CHIP PAK ELEMENT
CASE 423-03
Style 1
Motorola is offering the Chip Pak option package. Application-specific parts will have an "SPX" prefix, followed by a
four digit number, unique to the specific customer. Devices
will be shipped in a tape and reel packaging.
NOTE: The die and wire bonds are exposed on the front
side of the Chip Pak (pressure is applied to the backside of
the device). Front side die and wire protection must be
provided in the customer's housing. Use caution when
handling the devices during all processes.
Pin Number, Style 1
J
I
1
Vs
MAXIMUM RATINGS
I
3
I
4
I
S-
I
Ground
Pmax
Value
125
Burst Pressure
Pburst
1000
kPa
Supply Voltage
VSmax
10
Vdc
Rating
Overpressure (Backside)
Symbol
2
S+
Unit
PSI
Storage Temperature
Tstg
85
·C
Operating Temperature
TA
+15 to +40
·C
Motorola's MPX2300D Pressure Sensors. Motorola'S
MPX2300D pressure sensor has been designed for medical
usage by combining the performance of Motorola'S shear
stress pressure sensor design and the use of biomedically
approved materials. Materials with a proven history in
medical situations have been chosen to provide a sensor
that can be used with confidence in applications, such as
invasive blood pressure monitoring. It can be sterilized using
ethylene oxide. The portions of the pressure sensor that are
required to be biomedically approved are the rigid housing
and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
A silicone dielectric gel that has been used extensively in
implants covers the silicon piezoresistive sensing element.
The gel is a nontoxic, non allergenic polymer system which
passes pyrogen testing, as well as meeting all USP XX Biological Testing Class VI requirements. The properties of the
gel allow it to transmit pressure uniformly to the diaphragm
surface, while isolating the internal electrical connections
from the corrosive effects of fluids, such as saline solution.
The gel provides electrical isolation sufficient to withstand
defibrillation testing, as specified in the proposed Association
for the Advancement of Medical Instrumentation (AAMI)
Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room
intracutaneous test in rabbits, and system toxicity, USP.
lights from affecting the performance of the sensor.
REV 1
2--42
Motorola Sensor Device Data
MPX2300D
OPERATING CHARACTERISTICS (VS
= 6 Vdc, TA = 25°C unless otherwise noted)
Symbol
Min
Pressure Range
POP
0
-
Supply Voltage(8)
Vs
-
6.0
10
Supply Current
10
-
1.0
-
Characteristics
Typ
Max
Unit
300
mmHg
Vdc
mAdc
Zero Pressure Offset
Voff
-
0.75
mV
Sensitivity
-
4.95
5.0
5.05
f.lVN/mmHg
VFSS
2.976
3.006
3.036
mV
-
-2.0
-
2.0
TCS
-0.1
-
+0.1
%/oC
TCVFSS
-0.1
-
+0.1
%/oC
TCVoff
-9.0
-
+9.0
f.lV/oC
Zin
1800
-
4500
n
Output Impedance
Zout
270
-
330
n
RCAl (150 kn)(9)
RCAl
97
100
103
mmHg
Response Time(5)
(10%t090%)
tR
-
1.0
-
Full Scale Span(1)
Linearity + Hysteresis
Temperature Effect on Sensitivity
Temperature Effect on Full Scale Span
Temperature Effect on Offset(4)
Input Impedance
-0.75
ms
Temperature Error Band
-
0
-
85
°C
Stability(6)
-
-
±0.5
-
%VFSS
Min
Typ
Max
Unit
MECHANICAL CHARACTERISTICS
Characteristics
Weight (Case 423)
Warm-Up
Symbol
-
-
170
-
15
-
mg
Sec
NOTES:
1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset.
2. Maximum deviation from end-point straight line fit at 0 and 300 mmHg.
3. Slope of end-point straight line fit to full scale span at O°C and +85°C relative to +25°C.
4. Slope of end-point straight line fit to zero pressure offset at O°C and +85°C relative to +25°C.
5. For a 0 to 300 mmHg pressure step change.
6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +1 O°C to +85°C after:
a. 1000 temperature cycles, -40°C to +125°C.
b. 1.5 million pressure cycles, 0 to 300 mmHg.
7. Operating characteristics based on positive pressure differential relative to the vacuum side (gauge/differential).
8. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above + 10 V may
induce additional error due to device self-heating.
9. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to Vs and S+ output.
Motorola Sensor Device Data
2-43
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 700 kPa
(0 to 100 PSI)
High Pressure, Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX2700
SERIES
The MPX2700 series device is a silicon piezoresistive pressure sensor providing a
highly accurate and linear voltage output - directly proportional to the applied pressure.
The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film
resistor network Integrated on-chip. The sensor is laser trimmed for precise span and
offset calibration and temperature compensation.
X-ducer™
SILICON
PRESSURE SENSORS
Features
•
Unique Silicon Shear Stress Strain Gauge
•
±0.5% Linearity
•
Full Scale Span Calibrated to 40 mV
•
Easy to Use Chip Carrier Package
•
Basic Element, Single and Dual Ported Devices
Available
•
Available in Differential and Gauge Configurations
Application Examples
•
Pump/Motor Controllers
•
Pneumatic Control
• lire Pressure Gauges
•
Robotics
•
Medical Diagnostics
•
Pressure Switching
•
Hydraulics
DIFFERENTIAL
PORT OPTION
CASE 352-{)2
Style 1
BASIC CHIP
CARRIER ELEMENT
CASE 344-08
Style 1
Pin Number
1
Ground
MAXIMUM RATINGS
Rating
Overpressure(8) (P1
> P2)
Burst Pressure(8) (P1
> P2)
Storage Temperature
Operating Temperature
I
I
I
2
I
3
I
+Voul
Vs
4
I
-Vout
Symbol
Value
Unit
Pmax
2800
kPa
Pbursl
5000
kPa
Tstg
-50 to +150
DC
TA
-4010+125
DC
Vs
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The output vollage of the differential or gauge sensor increases with
increasing pressure applied to the pressure side (P1) relative to the vacuum
side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a block diagram of the internal circuitry on the stand-alone
pressure sensor chip.
----------,I
3
r--
I
I
I X-ducer
I SENSING
I ELEMENT
I
IL. _ _ _ _
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
I2
Vout+
14
I
Vout-
_ _ _ _ _ _ _ _ .JI
1
GND
...._..
~=_
'-I~"'11IW'
I.
"1"_ _ .. "" ......+....... ,..,,_ ... ft"'~""'+ft"
19'1I1...,.... U.WI'IIiii' _""111 .... "" ............-...
Pressure Sensor Schematic
REV1
2-44
Motorola Sensor Device Data
MPX2700 SERIES
OPERATING CHARACTERISTICS (VCC = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
-
700
kPa
Supply Voltage(2)
Vs
-
10
16
Vdc
Supply Current
10
-
6.0
-
mAdc
VFSS
38.5
40
41.5
mV
Voff
-1.0
-
1.0
Sensitivity
tMI:>.P
-
0.057
Linearity(5)
-
-0.5
-
TCVFSS
Characteristic
Full Scale Span(3)
Offset(4)
Pressure Hysteresis(5) (0 to 700 kPa)
Temperature Hysteresis(5) (-40°C to +125°C)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
mV
-
mV/kPa
-
0.5
%VFSS
±0.1
±0.5
-
-1.0
-
1.0
%VFSS
TCVoff
-1.0
-
1.0
mV
Zin
1300
4000
Zout
1400
-
n
n
3000
%VFSS
%VFSS
Response Time(6) (10% to 90%)
tR
-
1.0
-
ms
Offset Stability(5)
-
-
±0.5
-
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344)
Symbol
Min
Typ
-
-
2.0
Max
-
Unit
Grams
Warm-Up
-
-
15
-
Sec
Cavity Volume
-
-
-
0.01
Cubic In
0.001
Cubic In
690
kPa
Volumetric Displacement
Common Mode Line Pressure(7)
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
• Linearity:
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
• TcOffset:
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-45
MPX2700 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit or (2) a least
squares best line fit (see Figure 3). While a least squares fit
gives the "best case" linearity error (lower numerical value),
the calculations required are burdensome.
Conversely, an end point fit will give the ''worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
OFFSET
M
PRESSURE (% FULLSCALE)
1M
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2700
series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
50
I
40 -
I
VS=10V
TA=25°C
P1 >P2
L
/. ~
TYP
MAX.,-
~~
~~
.4i ~
10
4
"
h
~
~
-5
PSI
kPa
20
140
40
280
'"
tiN
60
420
T
SPAN
RANGE
~p-
.tf!P
80
560
I
RTV DIE
BOND
ft
10
700 OFFSET
Figure 3. Output versus Pressure Differential
Figure 4 shows the cross section of the Motorola MPX
pressure sensor die in the chip carrier package. A silicone
gel isolates the die surface and wire bonds from harsh
environments, while allowing the pressure signal to be
transmitted to the silicon diaphragm. MPX2700 series
pressure sensor operating characteristics and internal reli-
2-46
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating Characteristics.
THERMOPLASTIC CASE
Figure 4. Cross-Section of Differential Pressure
Sensor Die in Its Basic Package (Not to Scale)
ability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
Motorola Sensor Device Data
MPX2700 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
protects the die from harsh media. The Motorola MPX presPart Number
sure sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Pressure (PI) Side Identifier
Case Type
MPX2700D
344-08
Stainless Steel Cap
MPX2700DP
352-02
Side with Part Marking
MPX2700GP
350-03
Side with Port Attached
MPX2700GVP
350-04
Stainless Steel Cap
MPX2700GS
371-06
Side with Port Attached
MPX2700GVS
371-05
Stainless Steel Cap
MPX2700GSX
371C-02
Side with Port Attached
MPX2700GVSX
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX27DO series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
Case 344-08
MPX2700D
MPX2700D
Ported Elements
Differential
Case 352-02
MPX2700DP
MPX2700DP
Gauge
Case 350-03
MPX2700GP
MPX2700GP
Gauge Vacuum
Case 350-04
MPX2700GVP
MPX2700GVP
Gauge Stove Pipe
Case 371-06
MPX2700GS
MPX2700D
Gauge Vacuum Stove Pipe
Case 371-05
MPX2700GVS
MPX2700D
Gauge Axial
Case 371 C-02
MPX2700GSX
MPX2700D
Gauge Vacuum Axial
Case 371 D-02
MPX2700GVSX
MPX2700D
Motorola Sensor Device Data
2-47
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Manifold Absolute Pressure Sensor
On-Chip Signal Conditioned,
0.25 V to 4.9 V Output, Temperature
Compensated & Calibrated
MPX4100
MPX4101
SERIES
Motorola Preferred Devices
The Motorola MPX41 00N41 01 A series Manifold Absolute Pressure (MAP) sensor for
engine control is designed to sense absolute air pressure within the intake manifold. This
measurement can be used to compute the amount of fuel required for each cylinder.
Motorola's MAP sensor integrates on-chip, bipolar op amp circuitry and thin film
resistor networks to provide a high output signal and temperature compensation. The
small form factor and high reliability of on-chip integration make the Motorola MAP
sensor a logical and economical choice for the automotive system designer.
4100A: 20-105 kPa
4101A: 15-102 kPa
X-ducer™
SILICON
PRESSURE SENSOR
Features
•
1.8% Maximum Error Over 0-85°C
•
Specifically Designed for Intake Manifold Absolute Pressure Sensing in
Engine Control Systems
•
Ideally Suited for Direct Microprocessor Interfacing
•
Patented Silicon Shear Stress Strain Gauge
•
Temperature Compensated Over -40 to + 125°C
•
Durable Epoxy Unibody Element
•
Ideal for Non-Automotive Applications, Too
CASE 867-{)4
Style 1
MAXIMUM RATINGS (Tc = 25·C unless otherwise noted)
Rating
Overpressure(7) (P1 > P2)
Symbol
Value
Unit
Pmax
400
kPa
Burst Pressure(7) (P1 > P2)
Pburst
1000
kPa
Storage Temperature
Tstg
-50 to +150
·C
Operating Temperature
TA
-40 to +125
·C
The MPX4100N4101A series piezoresistive transducer is a
state-of-the-art, monolithic, signal conditioned, silicon
pressure sensor. This sensor, with its patented X-ducer,
combines advanced micromachining techniques, thin film metallization and bipolar semiconductor processing to provide an
accurate, high level analog output signal that is proportional to
applied pressure. A vacuum is sealed behind the sensor
diaphragm providing a reliable pressure reference. (See
Figure 2.)
Figure 1 shows a block diagram of the internal circuitry
integrated on the stand-alone pressure sensing chip.
Pin Number
I 2 I
Vout I Ground I
I I I
I I I
3
4
5
6
N/C N/C N/C
Vs
NOTE: Pins 4, 5 and 6 are Internal device
connections. Do not connect to external
circuitry or ground.
1
r------I
I
I X-ducer
I SENSING
I ELEMENT
IL.. _ _ _ _
3
----------,I
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
1 VOUI
I
_ _ _ _ _ _ _ _ _ _ _ _ ..1I
2
PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Preferred devices are Motorola recommended choices for fUlure use and best overall value.
REV2
2-48
Motorola Sensor Device Data
MPX4100 MPX4101 SERIES
MPX4100A SERIES OPERATING CHARACTERISTICS (VS = 5 1 Vdc TA = 25'C unless otherwise noted, PI > P2)
Symbol
Min
Max
Unit
POP
20
-
105
kPa
Supply Voltage (1)
Vs
4.85
5.1
5.35
Vdc
Supply Current
10
-
7.0
10
mAdc
V
Characteristic
Pressure Range
Typ
Full Scale Span (2)
(0 to 85'C)
VFSS
4.510
4.591
4.672
Offset (3)
(0 to 85'C)
Voff
0.225
0.306
0.388
t;V/t;P
Sensitivity
Accuracy (4)
(0 to 85'C)
Response Time (5)
Output Source Current at Full Scale Output
-
54
-
V
mV/kPa
-
-
-
tR
-
1.0
-
ms
10+
-
0.1
-
mA
±1.8
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
-
4.0
-
Grams
Warm-Up Time
-
15
-
Sec
Cavity Volume
-
-
0.01
IN3
Volumetric Displacement
-
-
Common Mode Line Pressure (6)
-
-
-
Weight, Basic Element (Case 867)
Max
Unit
0.001
IN3
690
kPa
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25'C.
Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of ato 85'C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of ato 85'C, relative to
• TcOffset:
25'C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25'C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
1. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-49
MPX4100 MPX4101 SERIES
MPX4101A SERIES OPERATING CHARACTERISTICS (VS = 51 Vdc, TA = 25°C unless otherwise noted, PI> P2)
Characteristic
Pressure Range
Supply Voltage (1)
Supply Current
Symbol
Min
Typ
Max
POP
15
-
102
kPa
Vs
4.85
5.1
5.35
Vdc
-
Unit
7.0
10
mAdc
Full Scale Span (2)
(0 to 85°C)
VFSS
4.618
4.700
4.782
V
Offset (3)
(0 to 85°C)
Voff
0.171
0.252
0.333
V
IJ.V/IJ.P
54
-
mV/kPa
-
-
-
±1.8
%VFSS
tR
-
1.0
-
ms
10+
-
0.1
-
mA
Symbol
Min
Typ
Max
Unit
4.0
-
Grams
10
Sensitivity
Accuracy(4)
(0 to 85°C)
Response Time (5)
Output Source Current at Full Scale Output
MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 867)
-
Warm-Up Time
Volumetric Displacement
-
-
Common Mode Line Pressure (6)
-
-
Cavity Volume
15
-
Sec
0.01
IN3
0.001
IN3
690
kPa
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage atfull rated pressure and the output voltage althe
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to
• TcOffset:
25°C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
2-50
Motorola Sensor Device Data
MPX4100 MPX4101 SERIES
SENSOR
OUTPUT
(PIN 1)
FLUORO SILICONE
GELDIE COA
EPOXY
PLASTIC
CASE
LEAD
FRAME
51 k
J,LPROCESSOR
DIE
BOND
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
AID
P2
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Figure 3 shows a typical decoupling circuit for interfacing
Figure 2. Cross Sectional Diagram
(Not to Scale)
Figure 2 illustrates an absolute sensing configuration
package in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh
environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX41 OOA series pressure sensor operating characteristics and internal reliability
and qualification tests are based on use of dry air as the
pressure media. Media other than dry air may have adverse
effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility
in your application.
5.0
~
I -'M1x
TRANSFER FUNCTION:
Vout = Vs' (.01059·P-.152) ± Error
e!~
Vs = 5.1 Vdc
~p
TYP
TEMP = 0 to 85°C
~p
20 kPA TO 105 kPA
MPX4100A
.d.~
4.5
4.0
I
~
>:::>
3.5
3.0
0..
2.5
0
2.0
the output of the integrated map sensor to the AID input of a
microprocessor.
Figures 4 and 5 show the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over a to 85°C temperature
range. (Output may be nonlinear outside of the rated pressure range.)
IA~
1.5
~-r
1.0
0.5
F'"
-
~
e
~;MII
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
6.0
£i'
~
>-
:::>
0..
TRANSFER FUNCTION:
5.0 r- Vout = Vs· (.01 059·P-.l 09) ± Error JMl
"~
Vs = 5.1 Vdc
4.0 TEMP = 0 to 85°C
I- 15 kPA TO 102 kPA
MPX4101A
3.0
1\
I::;;: ~
>:::>
0
2.0
1.0
0.0
I:: 1== ~
I:;;: ~
~~ ~
~
~
~I::::
k:c;
~~
¢ ¢~
~P
~n
~o~o~o~o~o~o~o~o~o~o~
~~NNMMvv~~~w~~oooomm~~
Pressure (ref: to sealed vacuum) in kPa
Figure 5. Output versus Absolute Pressure
Motorola Sensor Device Data
2-51
MPX4100 MPX4101 SERIES
Transfer Function (MPX4100A) - - - - - - - - - - - - - - - - - - - - - - - ,
Nominal Transfer Value: Vout = Vs (P x 0.01059 - 0.1518)
+/- (Pressure Error x Temp. Factor x 0.01059 x VS)
Vs = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4100A Series
4.0
Break Points
3.0
Temperalure
Error
Factor
2.0
Temp
Mulliplier
-40100
01085
85 to 125
3
1
3
1.0
0.0
-40
-20'
0
20
40
60
80
100
120
140
Temperature in C·
Pressure Error Band
Error Limits for Pressure
3.0
2.0
;f
~
g
w
i!!
~
1.0
0.0
20
40
60
80
100
120
Pressure (in kPa)
-1.0
D..
-2.0
-3.0
2-52
Pressure
Error (Max)
20 to 105 (kPa)
± 1.5 (kPa)
Motorola Sensor Device Data
MPX4100 MPX4101 SERIES
Transfer Function (MPX4101A) - - - - - - - - - - - - - - - - - - - - - - - ,
Nominal Transfer Value: Vout = Vs (P x 0.01059 - 0.10941)
+/- (Pressure Error x Temp. Factor x 0.01059 x VS)
Vs = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4101A Series
Break Points
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
-40toO
oto 85
85 to 125
3
1
3
1.0
0.0 _--'-_........_ _'--_...L.-_-'-_--L_ _'-_-'--_--'-_---'_ _"'-40
-20
20
40
60
80
100
120
140
Temperature in ·C
Pressure Error Band
Error Limits for Pressure
3.0
.,
c..
e
g
2.0
1.0
UJ
f!!
:::>
~
0.0
Pressure (in kPa)
15
30
45
60
75
90
105
120
-1.0
-2.0
-3.0
Motorola Sensor Device Data
Pressure
Error (Max)
15 to 102 (kPa)
± 1.5 (kPa)
2-53
MPX4100 MPX4101 SERIES
ORDERING INFORMATION
The MPX41 OOA and 4101 A series MAP silicon pressure sensors are available in the basic element package, or with pressure
port fittings that provide printed circuit board mounting ease and barbed hose pressure connections.
Device Type
Options
Case No.
MPX Series Order No.
Marking
Basic Element
Absolute, Element
867-04
MPX4100A
MPX4101A
MPX4100A
MPX4101A
Ported Elements
Absolute, Ported
8678-03
MPX4100AP
MPX4101AP
MPX4100AP
MPX4101AP
Absolute, Stove Pipe Port
867E-02
MPX4100AS
MPX4101AS
MPX4100A
MPX4101A
Absolute, Axial Port
867F-02
MPX4100ASX
MPX4101 ASX
MPX4100A
MPX4101A
2-54
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
15 to 115 kPa
Altimeter/Barometer Pressure
Sensor, On-Chip Signal Conditioned,
0.2 V to 4.8 V Output, Temperature
Compensated & Calibrated
MPX4115
SERIES
X- P2)
Burst Pressure(7) (PI> P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
Pmax
400
kPa
Pburst
1000
kPa
Tstg
-50 to +150
·C
TA
-40 to +125
·C
Pin Number
I 2 I 3 I4 I5 I6
I N/C I N/C I N/C
Vout I Ground I Vs
1
NOTE: Pins 4, 5 and 6 are Internal device
connections. Do not connect to external
circuitry or ground.
Vs
The MPX4115A series piezoresistive transducer is a
state-of-the-art, silicon pressure sensor. The sensor provides an accurate, high level analog signal that is proportional to applied pressure. A vacuum is sealed behind the sensor
diaphragm providing a reliable pressure reference. (See
Figure 2.)
Figure 1 shows a block diagrarn of the internal circuitry
integrated calibration and signal conditioning.
r-------
I
I
3
---------..,
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
II X-ducer
I SENSING
I ELEMENT
IL... _ _ _ _
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
I
1 Vout
I
_ _ _ _ _ _ _ _ _ _ _ _ ...1I
2
PINS 4,5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
REV 1
Motorola Sensor Device Data
2-55
MPX4115
MPX 4115A SERIES OPERATING CHARACTERISTICS (VS
Characteristic
Pressure Range
~ 5.1 Vdc, TA ~ 25°C unless otherwise noted, PI > P2)
Symbol
Min
POP
15
-
115
kPa
4.85
5.1
5.35
Vdc
mAdc
Typ
Max
Unit
Supply Voltage (1)
Vs
Supply Current
10
-
7.0
10
VFSS
4.521
4.59
4.659
I1V/I1P
-
45.9
Voff
0.135
0.204
0.275
V
-
±1.5
%VFSS
Full Scale Span (2)
(0 to 85°C)
Sensitivity
Offset (3)
(0 to 85°C)
Accuracy (4)
(0 to 85°C)
Response Time (5)
Output Source Current at Full Scale Output
-
-
tR
-
1.0
lot
-
0.1
-
-
V
mVlkPa
ms
mA
MECHANICAL CHARACTERISTICS
Characteristics
Symbol
Min
Typ
-
4.0
Warm-Up Time
-
Cavity Volume
-
Volumetric Displacement
-
Weight, Basic Element (Case 867)
Common Mode Line Pressure (6)
Max
Unit
-
Grams
IN3
-
-
0.01
-
-
0.001
IN3
-
-
690
kPa
15
ms
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to
• TcOffset:
25°C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
2-56
Motorola Sensor Device Data
MPX4115
FLUORO SILICONE
GEL DIE COA
MPX411SA
OUPUT
(PIN 1)
EPOXY
PLASTIC
CASE
SOpF
ILPROCESSOR
SEALED VACUUM REFERENCE
P2
Figure 2. Cross-Sectional Diagram
(Not to Scale)
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 867). A fluoro silicone gel isolates the die
surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4115A series pressure sensor operating
characteristics and internal reliability and qualification tests,
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the output of the integrated map sensor to the AID input of a
microprocessor.
Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are
shown for operation over 0 to 85°C temperature range. (Output may be nonlinear outside of the rated pressure range.)
S.O
4.S
4.0
i....
=>
D..
!3
0
3.S
I I I I I I I I I I I
_I Mix I
TRANSFER FUNCTION:
Vout = Vs' (.009'P-.09S) ± Error
Vs = S.1 Vdc
'4
TEMP = 0 to 8S"C
~
ryp
4~
3.0
~~
2.S
~",
2.0
~\,
1.S
1.0
O.S
~
~re:J
k::!~
A.~
" MIN
I=I=~
PRESSURE (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Motorola Sensor Device Data
2-57
MPX4115
Transfer Function
Nominal Transfer Value: Vout = Vs (P x 0.009 - 0.095)
+/- (Pressure Error x Temp. Factor x 0.009
VS=5.1 V±0.25Vdc
x VS)
Temperature Error Band
MPX4115A Series
4.0
Break Poinls
3.0
Temperalure
Error
Factor
2.0
Temp
Multiplier
-40100
01085
8510125
3
1
3
1.0
0.0
-40
-20
20
40
60
80
120
100
140
Temperature in C·
Pressure Error Band
9.0
6.0
~
o!:.
3.0
~
_-+_...............L...J'-'-...........................-'--'-'-'-""':-...............':,-:"'-'-:--_
~
Pressure in kPa
£ -3.0
-6.0
-9.0
Pressure
Error (Max)
15 to 115 kPa
± 1.5 kPa
Ordering Information
The MPX4115A BAP Sensor is available in the Basic Element package or with pressure port fittings that provide mounting
ease and barbed hose connections.
Device Type
Basic Element
Ported Elements
2-58
Options
Case No.
Absolute, Element Only
Case 867-{J4
Absolute, Ported
Absolute, Stove Pipe Port
Absolute, Axial Port
MPX Series Order No.
Marking
MPX4115A
MPX4115A
Case 8679-03
MPX4115AP
MPX4115AP
Case 867E-02
MPX4115AS
MPX4115A
Case 867F-02
MPX4115ASX
MPX4115A
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
20 to 250 kPa
Manifold Absolute Pressure Sensor,
On-Chip Signal Conditioned,
0.2 V to 4.9 V Output, Temperature
Compensated & Calibrated
MPX4250
SERIES
Motorola Preferred Devices
X-ducer™
SILICON
PRESSURE SENSOR
The Motorola MPX4250 series Manifold Absolute Pressure (MAP) sensor for turbo
boost engine control is designed to sense absolute air pressure within the intake
manifold. This measurement can be used to compute the amount of fuel required for
each cylinder.
Motorola's MAP sensor integrates on-chip, bipolar op amp circuitry and thin film
resistor networks to provide a high level analog output signal and temperature
compensation. The small form factor and high reliability of on-chip integration make the
Motorola MAP sensor a logical and economical choice for the automotive system
designer.
Features
•
1.5% Maximum Error Over 0-85°C
•
Specifically Designed for Intake Manifold Absolute Pressure Sensing in
Engine Control Systems
•
Ideally Suited for Direct Microprocessor Interfacing
•
Patented Silicon Shear Stress Strain Gauge
CASE 867-C4
Style 1
• Temperature Compensated Over - 40 to + 125°C
•
Offers Large Reduction in Weight and Volume Compared to Existing
Hybrid Modules
Pin Number
•
Durable Epoxy Unibody Element
•
Ideal for Non-Automotive Applications, too.
MAXIMUM RATINGS (TC
=
I 2 I
Vout I Ground I
1
25'C unless otherwise noted)
Rating
Overpressure(7) (Pl > P2)
Burst Pressure(7) (Pl > P2)
Symbol
Value
Unit
Pmax
400
kPa
kPa
Pburst
1000
Storage Temperature
Tstg
-50 to +150
°c
Operating Temperature
TA
-40 to +125
'C
3
Vs
I4 I5 I6
IN/C IN/C IN/C
NOTE: Pins 4, 5 and 6 are internal device
connections. Do not connect to external
circuitry or ground.
Vs
The MPX4250 series piezoresistive transducer is a stateof-the-art silicon pressure sensor. The sensor provides an
accurate, high level analog signal that is proportional to
applied pressure. A vacuum is sealed behind the sensor
diaphragm providing a reliable pressure reference. (See
Figure 2.)
Figure 1 shows a block diagram of the internal circuitry
integrated on the stand-alone pressure sensing chip.
r------I
I
I
I
I
IL
----------,I
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
X- P2)
Symbol
Min
Typ
Max
Pressure Range
POP
20
-
250
kPa
Supply Voltage (1)
Vs
4.85
5.1
5.35
Vdc
mAdc
Characteristic
Supply Current
Full Scale Span (2)
(0 to 85·C)
Sensitivity
Unit
10
-
7.0
10
VFSS
4.622
4.692
4.762
V
IMAP
-
20
-
mV/kPa
Offset (3)
(0 to 85·C)
Voff
0.135
0.204
0.275
V
Accuracy (4)
(0 to 85·C)
-
-
-
±1.5
%VFSS
Response Time (5)
tR
-
1.0
-
ms
Output Source Current at Full Scale Output
10+
-
0.1
-
mA
Symbol
Min
Typ
Max
Unit
-
-
4.0
-
Grams
0.01
IN3
MECHANICAL CHARACTERISTICS
Characteristics
Weight, Basic Element (Case 867)
Warm-Up Time
Cavity Volume
Volumetric Displacement
Common Mode Line Pressure (6)
15
-
Sec
0.001
IN3
690
kPa
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) Is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25·C.
Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85·C, relative to 25·C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative to
• TcOffset:
25·C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25·C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
2-60
Motorola Sensor Device Data
MPX4250
STAINLESS STEEL
METAL COVER
DIE
MPX4250A
OUPUT
(PIN 1)
EPOXY
CASE
>-,1
.....---.. . .--1 ND
50PFT
..
51 k ?
11 PROCESSOR
'-----
RTV DIE
BOND
P2
SEALED VACUUM REFERENCE
Figure 2. Cross-Sectional Diagram
(Not to Scale)
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 867). A fluoro silicone gel isolates the die
surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for in-
5.0
4.5
4.0
~
~
.....
3.5
2.5
0
2.0
.....
::>
iR~N~F~RI F~N6T:O~: I
I.!il¢i
~
4~
~
TYP
~
6~
~f(
1.5
4~
1.0
0.5
~
IMlx
I I
Vout = Vs' (.004·P-.004) ± Error
VS=5.1 Vdc
TEMP = 0 to 85'C
3.0
D-
::>
formation regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the output of the integrated map sensor to the AID input of a
microprocessor.
Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation (0 to 85°C) over temperature range.
(Output may be nonlinear outside of the rated pressure
range.)
" MIN
¢
~
PRESSURE (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Motorola Sensor Device Data
2-61
MPX4250
Transfer Function
Nominal Transfer Value: Vout = Vs (P x 0.004 - 0.04)
+/- (Pressure Error x Temp. Factor x 0.004 x VS)
VS=5.1 V±0.25Vdc
Temperature Error Band
MPX4250A Series
4.0
Break Points
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
-40toO
Ot085
85 to 125
3
1
3
1.0
0.0
-40
-20
20
40
60
80
100
120
140
Temperature in Co
Pressure Error Band
9.0
.,
6.0
e
3.0
c..
g
UJ
Pressure in kPa
e
~
a:
-3.0
-6.0
-9.0
Pressure
Error (Max)
20 to 250 kPa
± 3.45 (kPa)
Ordering Information
The MPX4250A series Turbo MAP silicon pressure sensors are available in the basic element package or with pressure port
fittings that provide mounting ease and barbed hose connections.
OevlceType
Basic Element
Ported Elements
2-62
Options
Case No.
MPX Series Order No.
Marking
Absolute, Element
Case 867-Q4
MPX4250A
MPX4250A
Absolute, Ported
Case 8679-03
MPX4250AP
MPX4250AP
Absolute, Stove Pipe Port
Case 867E-Q2
MPX4250AS
MPX4250A
Absolute, Axial Port
Case 867F-02
MPX4250ASX
MPX4250A
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 10 kPa
(0 to 1.45 PSI)
On-Chip Signal Conditioned,
0.2 V to 4.7 V Output, Temperature
Compensated and Calibrated,
Silicon Pressure Sensors
MPX5010
SERIES
Features
•
Temperature Compensated Over 0 to 85°C
•
Ideally Suited for Microprocessor or MicrocontrollerBased Systems
•
Patented Silicon Shear Stress Strain Gauge
•
Available in Differential and Gauge Configurations
•
Durable Epoxy Unibody Element
X-ducer™
SILICON
PRESSURE SENSORS
Pin Number
1
Vout
I
2
I
I Ground I
3
Vs
I
I
4
N/C
I
I
5
N/C
I
I
6
N/C
NOTE: Pins 4, 5 and 6 are internal device connections.
Do not connect to external circuitry or ground.
DIFFERENTIAL
PORT OPTION
CASE 867C-03
Style 1
BASIC CHIP
CARRIER ELEMENT
CASE 867-04
Style 1
MAXIMUM RATINGS (TC = 25'C unless otherwise noted)
Rating
Overpressure(7) (P1 > P2)
Burst Pressure(7) (P1 > P2)
Symbol
Value
Unit
Pmax
75
kPa
Pburst
100
kPa
Tstg
-50 to +125
'C
TA
-40 to +125
'C
Storage Temperature
Operating Temperature
r-------
The MPX5010 series piezoresistive transducer is a
state-of-the-art, low pressure sensor designed for a wide
range of applications.
This sensor with its patented, single element X-ducer,
combines advanced mlcromachining techniques, thinfilm metallization and bipolar semiconductor processing
to provide an accurate, high-level analog output signal
that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal
circuitry integrated on the stand-alone sensing chip.
I
I
I X- P2)
Characteristic
Pressure Range
Supply Voltage (1)
Symbol
Min
Typ
Max
POP
a
-
10
Unit
kPa
Vs
4.75
5.0
5.25
Vdc
mAdc
IS
-
7.0
15
Full Scale Span (2)
(0 to 85·C)
VFSS
4.275
4.5
4.725
V
Offset (3)
(0 to 85·C)
Voff
a
0.2
0.425
V
-
450
-
mV/kPa
-
-
±5.0
%VFSS
tR
-
1.0
-
ms
10+
-
0.1
-
mA
Supply Current
Sensitivity
VIP
Accuracy (4)
(0 to 85·C)
Response Time (5)
Output Source Current at Full Scale Output
MECHANICAL CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 867)
Characteristic
-
-
4.0
Grams
Warm-Up
-
-
15
-
Cavity Volume
-
-
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
Common Mode Line Pressure (6)
-
-
-
690
kPa
Sec
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25·C.
Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of ato 85·C, relative to 25·C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of to 85·C, relative to
• TcOffset:
25·C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25·C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
a
2-64
Motorola Sensor Device Data
MPX5010 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single
monolithic chip.
Figure 2 illustrates the differential or gauge configuration in
the basic chip carrier (Case 867). A fluoro silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the
silicon diaphragm.
The MPX501 0 series pressure sensor operating characteristics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the output of the MPX501 0 to the AID microprocessor. Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation (0 to 85°C) over temperature range.
(Output may be nonlinear outside of the rated pressure
range.)
MPX5010
OUTPUT
(PIN 1)
NO
..,
50 pF
51 k
RTV DIE
BOND
JlPROCESSOR
-=
EPOXY CASE
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interlace
Figure 2. Cross-Sectional Diagram
(Not to Scale)
?!:
f-
=>
5.0
TRANSFER FUNCTION:
4.S Vout. Vs·(0.Og·P+0.04) ± ERROR
4.0 Vs .5.0Vdc
TEMP. 0 to 8SoC
3.5
3.0
c..
=> 2.5
2.0
f-
~
0
1.5
1.0
O.S
MA
/ 0 I'"
......-: ~
~~
o~
o
l/::: --=
~~
l j /'"
~ :;..'
~V
~ICAL
'\
MIN
3
4
5
DIFFERENTIAL PRESSURE (kPa)
9
10
11
Figure 4. Output versus Pressure Differential
Motorola Sensor Device Data
2-65
MPX5010 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P 1) side may be identified by using the table
below:
Pressu re (P1)
Side Identifier
Case Type
MPX50100
867-04
Stainless Steel Cap
MPX50100P
867G-03
Side with Part Marking
MPX5010GP
8679-03
Side with Port Attached
MPX5010GVP
8670-03
Stainless Steel Cap
MPX5010GS
867E-02
Side with Port Attached
MPX5010GVS
867A-03
Stainless Steel Cap
MPX5010GSX
867F-02
Side with Port Attached
MPX5010GVSX
867G-02
Stainless Steel Cap
ORDERING INFORMATION
The MPX5010 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Basic Element
Ported Elements
2-66
Options
Differential
Case Type
867-04
Order Number
MPX5010D
Device Marking
MPX5010D
Differential Dual Ports
867C-03
MPX5010DP
MPX5010DP
Gauge
867B-03
MPX5010GP
MPX5010GP
Gauge Vacuum Port
8670-03
MPX5010GVP
MPX5010GVP
Gauge, Axial
867E-02
MPX5010GS
MPX50100
Gauge Vacuum Axial
867A-03
MPX5010GVS
MPX50100
Gauge, Axial PC Mount
867F-02
MPX5010GSX
MPX5010D
Gauge Vacuum Axial PC Mount
867G-02
MPX5010GVSX
MPX5010D
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 50 kPa
(0 to 7.25 PSI)
On-Chip Signal Conditioned,
0.2 V to 4.7 V Output, Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX5050
SERIES
Motorola Preferred Devices
Features
X-ducer™
SILICON
PRESSURE SENSORS
• 2.5% Maximum Error Over D-85°C
•
Ideally Suited for Microprocessor or Microcontroller Based Systems
• Temperature Compensated Over - 40 to 125°C.
•
Patented Silicon Shear Stress Strain Gauge
•
Easy-te-Use Chip Carrier Package Options
•
Available in Differential and Gauge Configurations
•
Durable Epoxy Unibody Element
Pin Number
1
I 2 I
I Ground I
I
3
4
I
I
I
5
I
6
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE867~4
CASE867C~3
Style 1
Style 1
I
N/C
N/C
Vout
Vs
N/C
NOTE: Pins 4, 5 and 6 are internal device connections. Do not
connect to external circuitry or ground.
MAXIMUM RATINGS (TC = 25°C unless otherwise noted) 1
Symbol
Value
Unit
Overpressure(7) (P1 > P2)
Pmax
200
kPa
Burst Pressure(7) (P1 > P2)
Pburst
700
kPa
Tstg
-50 to +150
°c
TA
-4010 +125
°c
Rating
Storage Temperature
Operating Temperature
Vs
The MPX5050 series piezoresistive transducer is a
state-of-the-art pressure sensor designed for a wide
range of applications. This sensor with its patented, single
element X-ducer, combines advanced micromachining
techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level
analog output signal that is proportional to applied
pressure.
Figure 1 shows a block diagram of the internal circuitry
integrated on the stand-alone pressure sensing chip.
r------I
I
I
----------,
I
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
X-ducer
I SENSING
I ELEMENT
I1... _ _ _ _
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
1 Vout
I
_ _ _ _ _ _ _ _ _ _ _ _ ...1I
2
PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Preferred devices are Motorola recommended choices for future use and best overall value.
REV2
Motorola Sensor Device Data
2-67
MPX5050 SERIES
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25·C unless otherwise noted, PI > P2)
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
0
-
50
kPa
Supply Voltage(l)
Vs
4.75
5.0
5.25
Vdc
Supply Current
10
-
7.0
10.0
mAdc
V
Characteristic
Full Scale Span(2)
(0 to 85·C)
VFSS
4.388
4.5
4.613
Zero Pressure Offset(3)
(0 to 85·C)
Voff
0.088
0.2
0.313
V
90
-
mV/kPa
%VFSS
VIP
-
-
-
-
± 2.5
tR
-
1.0
-
ms
10+
-
0.1
-
mA
Symbol
Min
Typ
Max
-
4.0
Warm-Up
-
-
Cavity Volume
-
-
Volumetric Displacement
-
-
0.001
IN3
Common Mode Line Pressure(6)
-
-
-
690
kPa
Sensitivity
Accuracy(4)
(0 to 85·C)
Response Time(5)
Output Source Current at Full Scale Output
MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 867)
Unit
-
Grams
15
-
Sec
-
0.01
IN3
NOTES:
1. Device is ratio metric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25·C.
Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85·C, relative to 25·C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative to
• TcOllse!:
25·C.
• Variation from nominal: The variation from nominal values, for ollset or full scale span, as a percent of VFSS, at 25·C.
5. Response Time is defined as the time for the Incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-to-Iead Interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
2-68
Motorola Sensor Device Data
MPX5050 SERIES
Transfer Function
Nominal Transfer Value: Vout = Vs (P x 0.018 + 0.04)
+/- (Pressure Error x Temp. Factor x 0.D18 x VS)
Vs = 5.0 V ± 0.25 Vdc
Temperature Error Band
MPX5050 Series
4.0
MultiQlier
TemQ
3.0
Temperature
Error
Factor
-40toO
Ot085
85 to 125
2.0
3
1
3
1.0
0.0
-40
-20
20
40
60
80
100
120
140
Temperature in °C
r-
Pressure Error Band
Error Umits for Pressure
3.02.0-
"'g
~
1.0-
UJ
0.0
l!!
:::J
~
-LO-
I
o
I
I
I
I
I
I
10
20
30
40
50
60
Pressure (in kPa)
a.
-2.0-3.0-
Motorola Sensor Device Data
Pressure
Error (Max)
Oto 50 kPa
± 1.25kPa
2-69
MPX5050 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation over O°C to 85°C. (Device output
may be nonlinear outside of the rated pressure range.)
Figure 3 illustrates the differential or gauge configuration
in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to
the silicon diaphragm.
The MPX5050 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term stability. Contact the factory for information regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the output of the MPX5050 to the AID input of a microprocessor. Proper decoupling of the power supply is recommended.
5.0
?;
f:::J
0..
f:::J
0
TRANSFER FUNCTION:
4.5 Vout =VS·(0.018'P+0.04) ± ERROR
4.0 Vs =5.0 Vdc
TEMP =0 to 85°C
3.5
3.0
2.0
MAX
l'\y ~
1.0
0.5
A
~
~
==
l..d; ~
~ P'"
~P'
2.5
1.5
,
A
~~
TYPI AL
MI~
lIP'
o~
o 5
10
15 20 25
30 35 40
DIFFERENTIAL PRESSURE (kPa)
45
50
55
Figure 2. Output versus Pressure Differential
MPX5050
OUPUT
(PIN 1)
EPOXY
PLASTIC
CASE
DIFFERENTIAUGAUGE ELEMENT
>4~------'-~
ND
50pF
11 PROCESSOR
DIE
BOND
P2
Figure 3. Cross-Sectional Diagram
(Not to Scale)
2-70
Figure 4. Typical Decoupllng Filter for Sensor to
Microprocessor Interface
Motorola Sensor Device Data
MPX5050 SERIES
PRESSURE (P1) I VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Case Type
MPX5050D
867-04
Stainless Steel Cap
MPX5050DP
867C-03
Side with Part Marking
MPX5050GP
867B-03
Side with Port Attached
MPX5050GVP
867D-03
Stainless Steel Cap
MPX5050GS
867E-02
Side with Port Attached
MPX5050GVS
867A-03
Stainless Steel Cap
MPX5050GSX
867F-02
Side with Port Attached
MPX5050GVSX
867G-02
Stainless Steel Cap
ORDERING INFORMATION
The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Basic Element
Ported Elements
Options
Case Type
Order Number
Device Marking
Differential
867-04
MPX5050D
MPX5050D
MPX5050DP
Differential Dual Ports
867C-03
MPX5050DP
Gauge
8678-03
MPX5050GP
MPX5050GP
Gauge Vacuum Port
8670-03
MPX5050GVP
MPX5050GVP
Gauge, Axial
867E-02
MPX5050GS
MPX5050D
Gauge Vacuum Axial
867A-03
MPX5050GVS
MPX5050D
Gauge, Axial PC Mount
867F-02
MPX5050GSX
MPX5050D
Gauge Vacuum Axial PC Mount
867G-02
MPX5050GVSX
MPX5050D
Motorola Sensor Device Data
2-71
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to
100 kPa (0 to 14.5 PSI)
On-Chip Signal Conditioned,
0.2 V to 4.7 V Output, Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX5100
SERIES
Motorola Preferred Devices
Features
•
MPX5100D: 0-100 kPa
MPX5100A: 15-115 kPa
X-ducer™
SILICON
PRESSURE SENSORS
2.5% Maximum Error Over 0-85°C
•
Durable Epoxy Unibody Element
•
Ideally Suited for Microprocessor or Microcontroller
Based Systems
•
Patented Silicon Shear Stress Strain Gauge
•
Easy to use Chip Carrier Package Options
• Available in Absolute, Differential and Gauge
Configurations
Pin Number
1
Vout
I
I
I Ground I
2
3
Vs
I
I
4
N/C
I
I
5
N/C
I
I
6
N/C
NOTE: Pins 4, 5 and 6 are intemal device connections. Do not
connect to external circuitry or ground.
DIFFERENTIAL
PORT OPTION
CASE 867C-{)3
Style 1
BASIC CHIP
CARRIER ELEMENT
CASE 867-{)4
Style 1
MAXIMUM RATINGS (TC = 25'C unless otherwise noted)
Symbol
Value
Unit
Overpressure(7) (P1 > P2)
Pmax
400
kPa
Burst Pressure(7) (P1 > P2)
Pburst
1000
kPa
Tstg
-50 to +150
'C
TA
-40to 125
'C
Rating
Storage Temperature
Operating Temperature
Vs
The MPX5100 series piezoresistive transducer is a
state-of-the-art, monolithic silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with
AID inputs. This patented, single element X-ducer
combines advanced micromachining techniques, thin-film
metallization and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is
proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry
integrated on the stand-alone pressure sensing chip.
r------I
I
I
I
I
IL
3
---------..,I
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
X-ducer
SENSING
ELEMENT
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
1 Vaut
I
_ _ _ _ _ _ _ _ _ _ _ _ ...1I
___ _
PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
Preferred devices are Motorola recommended choices for future use and best overall value.
REV3
2-72
Motorola Sensor Device Data
MPX5100 SERIES
OPERATING CHARACTERISTICS (VS
=5.0 Vdc, TA = 25'C unless otherwise noted, P1
Characteristic
Pressure Range
Gauge, Differential: MPX5100D
Absolute: MPX5100A
Supply Voltage(1)
Supply Current
> P2)
Symbol
Min
Typ
Max
Unit
POP
0
15
-
100
115
kPa
Vs
4.75
5.0
5.25
Vdc
10
-
7.0
10
mAdc
Full Scale Span(2)
(0 to 85'C)
VFSS
4.388
4.5
4.613
V
Offset(3)
(0 to 85'C)
Voff
0.088
0.200
0.313
V
IW/I1P
Sensitivity
Accuracy(4)
(0 to 85'C)
-
-
45
-
-
Response Time(5)
tR
-
1.0
Output Source Current at Full Scale Output
10 +
-
0.1
-
mV/kPa
±2.5
%VFSS
-
mA
ms
MECHANICAL CHARACTERISTICS
Symbol
Min
Typ
Weight, Basic Element (Case 867)
Characteristic
-
4.0
Warm-Up
-
Cavity Volume
-
-
Volumetric Displacement
Common Mode Line Pressure(6)
Max
Unit
-
Grams
-
Sec
-
0.01
IN3
0.001
IN3
-
690
kPa
15
NOTES:
1. Device is ratio metric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25'C.
Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85'C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative to
• TcOffse!:
25'C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25'C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-73
MPX5100 SERIES
Transfer Function (MPX5100D) - - - - - - - - - - - - - - - - - - - - - - - - - - ,
Nominal Transfer Value:
Vout = Vs (P x 0.009 + 0.04)
+/- (Pressure Error x Temp. Factor x 0.009 x VS)
Vs = 5.0 V ± 0.25 Vdc
Temperature Error Band - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ,
MPX5100D Series
Temp
Multiplier
-40100
Ot085
85 to 125
3
4.0
3.0
Temperature
Error
Factor
1
3
2.0
1.0
0.0
-40
-20
20
40
60
100
80
120
140
Temperature in ·C
,..- Pressure Error Band
96-
~
~
g
3-
i
UJ
I
0
i
I
I
II
10
20
30
40
50
60
I
I
_I
80
90
100
Pressure (kPa)
-3-
a.
-6-9-
2-74
Pressure
Error (Max)
010100 kPa
±2.5 kPa
Motorola Sensor Device Data
MPX5100 SERIES
Transfer Function (MPX5100A)
Nominal Transfer Value: Vout = Vs (P x 0.009 - 0.095)
+/- (Pressure Error x Temp. Factor x 0.009 x VS)
Vs = 5.0 V ± 0.25 Vdc
Temperature Error Band - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ,
MPX51 DDA Series
Temp
4.0
3.0
Temperature
Error
Factor
Multiplier
-40toO
Ot085
85 to 125
3
1
3
2.0
1.0
0.0
-40
-20
20
40
60
80
100
120
I
I
I
140
Temperature in·C
.--- Pressure Error Band
96-
""'"g
a.
3-
UJ
I
i!!
10
~
a.
I
I
I
I
I
I
.....!2::!.0_~3::.0_...;4~0:...._~50~---:6~0:....__!:8:::.0_~90"__.....!1.:::00"__....!.:11:::.0_
I
120
Pressure (kPa)
-3-6-9-
Pressure
Error (Max)
15 to 115 kPa ±2.5 kPa
Motorola Sensor Device Data
2-75
MPX5100 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION and SIGNAL CONDITIONING
DIE
BOND
DIFFERENTIAUGAUGE ELEMENT
P2
SEALED VACUUM REFERENCE
P2
Figure 2. Cross-Sectional Diagrams
(Not to Scale)
5.0
MAXi'I
4.5 TRANSFER FUNCTION:
Vout = Vs' (.009'P - .095) ± error
4.0 I'vs = 5.0 Vdc
~~
3.5 TEMP = 0 to 85°C
~~
15
kPa
to
115
kPa
3.0
MPX5100A
~
2.5
~~
TYP
2.0
II
jg
~
I-
=>
a.
~
0
1.5
1.0
0.5
=I!!!
~~
~~
~~~
~
5.0
TRANSFER FUNCTION:.~ MAX
.A. ~
4.5
Vout = Vs' (0.009'P - 0.04) ± error
~~
4.0 Vs = 5.0 Vdc
P"
3.5 TEMP = 0 to 85°C
o
kPa
to
100
kPa
3.0
MPX5100D
~
2.5
TYP
~
2.0
~
1.5
l.d
I
I-
=>
a.
I=>
~~
0
ar
1.0
0.5
I ~I~
...;.J~
A~
MIN
~
00
I
10 20
30
40
50 60
70
80 90 100 110
PRESSURE (ref: to sealed vacuum, in kPa)
DIFFERENTIAL PRESSURE (in kPa)
Figure 3. Output versus
Absolute Pressure
Figure 4. Output versus
Pressure Differential
Figure 2 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 867). A fluoro silicone gel isolates the die
surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX5100A and MPX5100D series pressure sensor
operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media.
Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
SENSOR
OUTPUT
(PIN 1)
information regarding media compatibility in your application.
Figures 3 and 4 show the sensor output signal relative to
pressure input. Typical, minimum and maximum output
curves are shown for operation over DoC to 85°C. (Device
output may be non-linear outside of the rated pressure
range.)
Figure 5 shows a typical decoupling circuit for interfacing
the output of the MPX51 00 to the AID input of a microprocessor. Proper decoupling of the power supply is also recommended.
,"-
NO
50pF*
51 k
I.LPROCESSOR
':'
Figure 5. Typical Decoupling Filter for Sensor to
Microprocessor Interface
2-76
Motorola Sensor Device Data
MPX5100 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (PI) side and the Vacuum (P2) side. The
Pressure (PI) side is the side containing fluoro silicone gel
which protects the die from harsh media. The differential and
gauge sensor is designed to operate with positive differential
Part Number
pressure applied, PI > P2. The absolute sensor is designed
for vacuum on PI side.
The Pressure (PI) side may identified by using the table
below:
Pressure (P1)
Side Identifier
Case Type
MPX5100A, MPX5100D
867-04
Stainless Steel Cap
MPX5100DP
867C-03
Side with Part Marking
MPX5100AP, MPX5100GP
8678-03
Side with Port Attached
MPX5100GVP
867D-03
Stainless Steel Cap
MPX5100AS, MPX5100GS
867E-02
Side with Port Attached
MPX5100GVS
867A-03
Stainless Steel Cap
MPX51 OOASX, MPX5100GSX
867F-02
Side with Port Attached
MPX5100GVSX
867G-02
Stainless Steel Cap
ORDERING INFORMATION:
The MPX5100 pressure sensor is available in absolute, differential and gauge configurations. Devices are available in the
basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections.
MPX Series
Device Type
Options
Basic Element
Absolute
Ported Elements
Motorola Sensor Device Data
Case Type
Order Number
Device Marking
867-04
MPX5100A
MPX5100A
Differential
867-04
MPX5100D
MPX5100D
Differential Dual Ports
867C-03
MPX5100DP
MPX5100DP
Absolute, Single Port
867B-03
MPX5100AP
MPX5100AP
Gauge, Single Port
867B-03
MPX5100GP
MPX5100GP
Gauge Vacuum Port
867D-03
MPX5100GVP
MPX5100GVP
Absolute Axial
867E-02
MPX5100AS
MPX5100A
Gauge, Axial
867E-02
MPX5100GS
MPX5100D
Gauge Vacuum Axial
867A-03
MPX5100GVS
MPX5100D
Absolute Axial PC Mount
867F-02
MPX5100ASX
MPX5100A
Gauge. Axial PC Mount
867F-02
MPX5100GSX
MPX5100D
Gauge Vacuum Axial PC Mount
867G-02
MPX5100GVSX
MPX5100D
2-77
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 500 kPa
(0 to 75 PSI)
On-Chip Signal Conditioned,
0.2 V to 4.7 V Output, Temperature
Compensated and Calibrated,
Silicon Pressure Sensors
MPX5500
SERIES
Features
X-clucer™
SILICON
PRESSURE SENSORS
• Temperature Compensated Over 0 to 85°C
• Ideally Suited for Microprocessor or MicrocontrollerBased Systems
•
Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
• Durable Epoxy Unibody Element
Pin Number
1
Vout
I
2
I
I Ground I
3
Vs
I
I
4
N/C
I
I
5
N/C
I
I
6
N/C
NOTE: Pins 4, 5 and 6 are internal device connections.
Do not connect to external circuitry or ground.
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE867~4
CASE867~3
Style 1
Style 1
MAXIMUM RATINGS (Tc = 25·C unless otherwise noted)
Rating
Symbol
Value
Unit
Overpressure(7) (P1 > P2)
Pmax
2000
kPa
Burst Pressure(7) (P1 > P2)
Pburst
3500
kPa
Tstg
-50 to +125
·C
TA
-40 to +125
·C
Storage Temperature
Operating Temperature
Vs
The MPX5500 series piezoresistive transducer is a
state-of-the-art pressure sensor designed for a wide
range of applications, but particularly for those employing
a microcontroller or microprocessor with AID inputs.
This patented, single element X-ducer combines
advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide
an accurate, high level analog output signal that is
proportional to applied pressure.
Figure 1 shows a block diagram of the internal
circuitry integrated on the stand-alone sensing chip.
r------I
I
I X-ducer
I SENSING
I ELEMENT
IL.. _ _ _ _
3
---------.,I
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
1 Vaul
I
_ _ _ _ _ _ _ _ _ _ _ _ .JI
2
PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
REV 1
2-78
Motorola Sensor Device Data
MPX5500 SERIES
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25'C unless otherwise noted, PI > P2)
Symbol
Min
Typ
Max
Unit
POP
0
-
500
kPa
Supply Voltage (1 )
Vs
4.75
5.0
5.25
Vdc
Supply Current
IS
-
7.0
10
mAdc
Characteristic
Pressure Range
VFSS
4.388
4.5
4.613
V
Voff
0.088
0.2
0.313
V
VIP
-
9.0
-
mV/kPa
-
-
-
±2.50
%VFSS
Response Time (5)
tR
-
1.0
-
ms
Output Source Current at Full Scale Output
10+
-
0.1
-
mA
Symbol
Min
Typ
Max
Unit
-
4.0
-
Grams
Warm-Up
-
Cavity Volume
-
-
0.01
IN3
Volumetric Displacement
-
-
-
0.001
IN3
-
-
1000
kPa
Full Scale Span (2)
(0 to 85'C)
Offset (3)
(0 to 85'C)
Sensitivity
Accuracy (4)
(0 to 85'C)
MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 867)
Common Mode Line Pressure (6)
15
Sec
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Linearity:
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25'C.
Output deviation, after 1000 temperature cycles. - 40 to 125'C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85'C. relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative to
• TcOffset:
25'C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS. at 25'C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-79
MPX5500 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the s'ensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation over O°C to 85°C. (Device output
may be nonlinear outside of the rated pressure range.)
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single
monolithic chip.
Figure 3 illustrates the differential or gauge configuration in
the basic chip carrier (Case 867). Afluoro silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the
silicon diaphragm.
The MPX5500 series pressure sensor operating characteristics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the output of the MPX5500 to the NO microprocessor. Proper decoupling of the power supply is recommended.
5.0
~
5c..
t0
::J
TRANSFER FUNCTION:
4.5 Vout =Vs·(0.001S·P+0.04) ± ERROR
4.0 Vs =5.0Vdc
TEMP =0 10 85'C
3.5
3.0
1.5
A
0~
0
TYPICAL
~~
MIN
~~
1.0
0.5
~
MAX
4
~ P'
~P"
2.5
2.0
A ;;;;;
~~
~
W
50
100 150 200 250 300 350 400
DIFFERENTIAL PRESSURE (kPa)
450
500
550
Figure 2. Output versus Pressure Differential
FLUORO SILICONE
DIE COAT
MPX5500
OUTPUT
(PIN 1)
ND
"
WIRE BOND
50 pF
/
RTV DIE
BOND
LEAD
FRAME
Figure 3. Cross-Sectional Diagram
(Not to Scale)
2-80
'f;
51 k
?Il.PROCESSOR
-=
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Motorola Sensor Device Data
MPX5500 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Pressu re (P1)
Side Identifier
Case Type
MPX5500D
867-04
Stainless Steel Cap
Side with Part Marking
MPX5500DP
867C-03
MPX5500GP
867B-03
Side with Port Attached
MPX5500GVP
867D-03
Stainless Steel Cap
MPX5500GS
867E-02
Side with Port Attached
MPX5500GVS
867A-03
Stainless Steel Cap
MPX5500GSX
867F-02
Side with Port Attached
MPX5500GVSX
867G-02
Stainless Steel Cap
ORDERING INFORMATION
The MPX5500 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
867-04
MPX5500D
MPX5500D
Ported Elements
Differential Dual Ports
867C-03
MPX5500DP
MPX5500DP
Gauge
867B-03
MPX5500GP
MPX5500GP
Gauge Vacuum Port
8670-03
MPX5500GVP
MPX5500GVP
Gauge, Axial
867E-02
MPX5500GS
MPX5500D
Gauge Vacuum Axial
867A-03
MPX5500GVS
MPX5500D
Gauge, Axial PC Mount
867F-02
MPX5500GSX
MPX5500D
Gauge Vacuum Axial PC Mount
867G-02
MPX5500GVSX
MPX5500D
Motorola Sensor Device Data
2-81
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 700 kPa
(0 to 100 PSI)
On-Chip Signal Conditioned,
0.2 V to 4.7 V Output, Temperature
Compensated and Calibrated,
Silicon Pressure Sensors
MPX5700
SERIES
Features
X-ducer™
SILICON
PRESSURE SENSORS
• Temperature Compensated Over 0 to 85°C
•
Ideally Suited for Microprocessor or MicrocontrollerBased Systems
•
Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
•
Durable Epoxy Unibody Element
Pin Number
1
Vout
I
I
I Ground I
3
2
Vs
I
I
4
N/C
I
I
5
N/C
I
I
6
N/C
NOTE: Pins 4, 5 and 6 are internal device connections.
Do not connect to external circuitry or ground.
DIFFERENTIAL
PORT OPTION
CASE 867C-{)3
Style 1
BASIC CHIP
CARRIER ELEMENT
CASE 867-{)4
Style 1
MAXIMUM RATINGS (Tc = 25'C unless otherwise noted)
Rating
Symbol
Value
Unit
Overpressure(7) (Pi> P2)
Pmax
2800
kPa
Burst Pressure(7) (Pi> P2)
Pburst
5000
kPa
Tstg
-50 to +125
'C
TA
-40 to +125
'C
Storage Temperature
Operating Temperature
Vs
The MPX5700 series piezoresistive transducer is a
state-of-the-art pressure sensor designed for a wide
range of applications, but particularly for those employing
a microcontroller or microprocessor with AID inputs.
This patented, single element X-ducer combines
advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide
an accurate, high-level analog output signal that is
proportional to applied pressure.
Figure 1 shows a block diagram of the internal
circuitry integrated on the stand-alone sensing chip.
r-------
I
II
---------..,
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
X-ducer
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
I
I SENSING
I ELEMENT
IL _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ JI
2
1 Vout
PINS 4, 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
REV 1
2-82
Motorola Sensor Device Data
MPX5700 SERIES
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
kPa
POP
0
-
700
Supply Voltage (1)
Vs
4.75
5.0
5.25
Vdc
Supply Current
IS
-
7.0
10
mAdc
V
Pressure Range
Full Scale Span (2)
(0 to 65°C)
VFSS
4.366
4.5
4.613
Zero Pressure Offset (3)
(0 to 65'C)
Voff
.066
0.2
0.313
V
VIP
6.0
-
mV/kPa
%VFSS
-
-
-
±2.50
Response TIme (5)
tR
-
1.0
-
ms
Output Source Current at Full Scale Output
10+
-
0.1
-
rnA
Sensitivity
Accuracy (4)
(0 to 65°C)
MECHANICAL CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 667)
Characteristic
-
-
4.0
-
Grams
Warm-Up
-
-
15
-
Sec
Cavity Volume
-
-
0.01
IN3
Volumetric Displacement
-
-
Common Mode Line Pressure (6)
-
-
0.001
IN3
1000
kPa
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85'C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative to
• TcOffset:
25°C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25'C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-83
MPX5700 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation over O°C to 85°C. (Device output
may be nonlinear outside of the rated pressure range.)
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single
monolithic chip.
Figure 3 illustrates the differential or gauge configuration in
the basic chip carrier (Case 867). A fluoro silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the
silicon diaphragm.
The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the output of the MPX5700 to the ND microprocessor. Proper decoupling of the power supply is recommended.
5.0
TRANSFER FUNCTION:
Vout = Vs'(0.0012858'P+0.04) ± ERROR
4.0 Vs = 5.0 Vdc
3.5 TEMP = 0 to 85°C
~
4.5
~ 3.0
50..
f-
=>
0
A
2.5
...;"!
2.0
1.5
1.0
0.5
M~~
~V
f-
o~
o
100
~
./.
~
;;:-
W
.a~
~
TYPICAL
W"
MIN
200
300
400
500
600
DIFFERENTIAL PRESSURE (kPa)
700
800
Figure 2. Output versus Pressure Differential
FLUORO SILICONE
DIE COAT
MPX5700
OUTPUT
(PIN 1)
,
WIRE BOND
50 PF ....
I
LEAD
FRAME
L.L.~..L..<<.L~'-'
....:..L..<.L~:..L..U-_
P2
RTV DIE
BOND
NO
51 k
~
lJ.PROCESSOR
-=
EPOXY CASE
Figure 3. Cross-Sectional Diagram
(Not to Scale)
2-84
Figure 4. Typical Oecoupling Filter for Sensor to
Microprocessor Interface
Motorola Sensor Device Data
MPX5700 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing !luoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Pressure (P1)
Side Identifier
Case Type
MPX5700D
867-04
MPX5700DP
Stainless Steel Cap
867C-03
Side with Part Marking
MPX5700GP
8678-03
Side with Port Attached
MPX5700GVP
867D-03
Stainless Steel Cap
MPX5700GS
867E-02
Side with Port Attached
MPX5700GVS
867A-03
Stainless Steel Cap
MPX5700GSX
867F-02
Side with Port Attached
MPX5700GVSX
867G-02
Stainless Steel Cap
ORDERING INFORMATION
The MPX5700 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
867-04
MPX5700D
MPX5700D
Ported Elements
Differential Dual Ports
867C-03
MPX5700DP
MPX5700DP
Gauge
867B-03
MPX5700GP
MPX5700GP
Gauge Vacuum Port
867D-03
MPX5700GVP
MPX5700GVP
Gauge, Axial
867E-02
MPX5700GS
MPX5700D
Gauge Vacuum Axial
867A-03
MPX5700GVS
MPX5700D
Gauge, Axial PC Mount
867F-02
MPX5700GSX
MPX5700D
Gauge Vacuum Axial PC Mount
867G-02
MPX5700GVSX
MPX5700D
Motorola Sensor Device Data
2-85
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 1000 kPa
(0 to 150 PSI)
On-Chip Signal Conditioned,
0.2 V to 4.7 V Output, Temperature
Compensated and Calibrated,
Silicon Pressure Sensors
MPX5999
SERIES
Features
•
Temperature Compensated Over 0 to 85°C
•
Ideally Suited for Microprocessor or MicrocontrollerBased Systems
•
Patented Silicon Shear Stress Strain Gauge
•
Available in Differential and Gauge Configurations
•
Durable Epoxy Unibody Element
X-ducerT"
SILICON
PRESSURE SENSORS
Pin Number
1
Vout
I
I
I Ground I
3
2
Vs
I
I
4
N/C
I
I
5
N/C
I
I
6
BASIC CHIP
CARRIER ELEMENT
CASE 867-04
Style 1
N/C
NOTE: Pins 4, 5 and 6 are internal device connections.
Do not connect to external circuitry or ground.
MAXIMUM RATINGS (Tc = 25°C unless otherwise noted)
Symbol
Value
Unit
Overpressure(6) (P1 > P2)
Pmax
4000
kPa
Burst Pressure(6) (P1 > P2)
Pburst
6000
kPa
Storage Temperature
Tstg
-50 to +150
·C
Operating Temperature
TA
-40 to +125
°c
Rating
Vs
The MPX5999 series piezoresistive transducer is a
state-of-the-art pressure sensor designed for a wide
range of applications, but particularly for those employing
a microconlroller or microprocessor with NO inputs.
This patented, single element X-ducer combines
advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide
an accurate, high level analog output signal that is
proportional to applied pressure.
Figure 1 shows a block diagram of the internal
circuitry integrated on the stand-alone sensing chip.
r------I
I
3
---------,I
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
I X-ducer
I SENSING
I ELEMENT
IL.. _ _ _ _
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
I
I
I
1 VOU1
I
_ _ _ _ _ _ _ _ _ _ _ _ JI
2
PINS 4. 5 AND 6 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
REV 1
2-86
Motorola Sensor Device Data
MPX5999
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Symbol
Min
Typ
Max
Unit
POP
0
-
1000
kPa
Supply Voltage (1 )
Vs
4.75
5.0
5.25
Vdc
Supply Current
10
-
7.0
10
mAdc
VFSS
4.388
4.7
4.613
V
Voff
0.088
0.2
0.313
V
VIP
-
mV/kPa
-
-
5.0
-
±2.5
%VFSS
Response Time (5)
IR
-
1.0
-
ms
Output Source Current at Full Scale Output
10+
-
0.1
-
mA
Characteristic
Pressure Range
Full Scale Span (2)
(0 to 85°C)
Zero Pressure Offset (3)
(0 to 85°C)
Sensitivity
Accuracy (4)
(0 to 85°C)
MECHANICAL CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 867)
Characteristic
-
-
4.0
-
Grams
Warm-Up
-
-
15
-
Sec
Cavity Volume
-
-
-
0.01
IN3
-
-
-
0.001
IN3
Volumetric Displacement
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, aI25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with
• Offset Stability:
minimum rated pressure applied.
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to
• TcOffset:
25°C.
• Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface.
7. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-87
MPX5999
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
while allowing the pressure signal to be transmitted to the
silicon diaphragm.
The MPX5999 series pressure sensor operating characteristics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the output of the MPX5999 to the AID microprocessor. Proper decoupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves
are shown for operation over QOC to 85°C. (Device output
may be nonlinear outside of the rated pressure range.)
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single
monolithic chip.
Figure 3 illustrates the differential or gauge configuration in
the basic chip carrier (Case 867). A fluoro silicone gel isolates
the die surface and wire bonds from harsh environments.
5.0
~
....
::>
D....
::>
0
TRANSFER FUNCTION:
4.5 Vout =Vs·(0.000901·P+0.04) ± ERROR
4.0 Vs = 5.0 Vdc
TEMP = Oto85'C
3.5
~V
~ I('
~ V TYPICAL
3.0
2.5
2.0
/
MAX
1.5
100
~
./. ~I'"
I~ ~
1.0
A
~
0.5
~
0
0
~~
l.lj '7
'"
MIN
200 300 400 500 600 700 800
DIFFERENTIAL PRESSURE (kPa)
900 1000 1100
Figure 2. Output versus Pressure Differential
SILICONE
DIE COAT
MPX5999
OUTPUT.>-<.----.......- I
(PIN 1)
WIRE BOND
50pF
/
LEAD
FRAME
1L.«'-L..c...L~:...LJl
.......~<...L..c.....c;..L.<.--
P2
THERMOPLASTIC CASE
Figure 3. Cross-Sectional Diagram
(Not to Scale)
2-88
51 k
NO
I-LPROCESSOR
RTV DIE
BOND
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Motorola Sensor Device Data
MPX5999
PRESSURE (P1) I VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Case Type
MPX5999D
867-04
Stainless Steel Cap
ORDERING INFORMATION
The MPX5999 pressure sensor is available as an element only.
MPXSeries
Device Type
Basic Element
Options
Differential
Motorola Sensor Device Data
Case Type
867-04
Order Number
MPX5999D
L Device Marking
1 MPX5999D
2-89
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 50 kPa
(0 to 7.25 PSI)
High Zin, On-Chip Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX7050
SERIES
The new MPX7050 series pressure sensor incorporates all the innovative features of
Motorola's MPX2000 series family including the patented, single piezoresistive strain
gauge (X-ducer) and on-chip temperature compensation and calibration. In addition, the
MPX7050 series has a high input impedance of typically 10 kQ for those portable, low
power and battery-operated applications. This device is suitable for those systems in
which users must have a dependable, accurate pressure sensor that will not consume
significant power. The MPX7050 series device is a
logical and economical choice for applications such as
portable medical instrumentation, and remote sensing
systems with 4-20 mAmp transmission.
X-ducer™
HIGH lin SILICON
PRESSURE SENSORS
Features
• Temperature Compensated Over DoC to +85°C
•
Unique Silicon Shear Stress Strain Gauge
•
Full Scale Span Calibrated to 40 mV (typical)
•
Easy to Use Chip Carrier Package Options
• Available in Differential and Gauge Configurations
•
Ratiometric to Supply Voltage
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~8
CASE352~2
Style 1
Style 1
Application Examples
•
Portable Medical Instrumentation
•
Remote Sensing Systems
Pin Number
1
Ground
I
I
2
I
3
I
4
+Vout
I
Vs
I
-Vout
MAXIMUM RATINGS
Rating
Overpressure(8) (P1 > P2)
Burst Pressure(8) (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
Pmax
200
kPa
Pburst
500
kPa
Tstg
-50 to +150
TA
-40 to +125
°C
·C
Vs
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure side (P1) relative to the vacuum
side (P2). Similarly, output voltage increases as increasing vacuum is applied to
the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
r-1
1 HIGH
----------,1
3
THIN FILM
TEMPERATURE
12
1 lin '-'..,.----1 COMPENSATION
1 X-ducer
1
AND
4
1 SENSING L-+---1 CALIBRATION
1ELEMENT
I
CIRCUITRY
_ _ _ _ _ _ _ _ .JI
1
1.. _ _ _ _
VOUI.
Vout-
1
GND
Figure 1. Temperature Compensated
Pressure Sensor Schematic
REV2
2-90
Motorola Sensor Device Data
MPX7050 SERIES
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 2S'C unless otherwise noted, P1 > P2)
Characteristics
Symbol
Min
Typ
-
Max
Unit
SO
kPa
Pressure Range(1)
POP
Supply Voltage(2)
Vs
16
Vdc
10
-
10
Supply Current
1.0
-
mAdc
VFSS
38.S
40
41.S
mV
Voff
-1.0
-
1.0
Full Scale Span(3)
Offset(4)
Sensitivity
AV/AP
0
-
Linearity(S)
-
-O.2S
Pressure Hysteresis(S) (0 to SO kPa)
-
Temperature Hysteresis(S) (-40'C to +12S'C)
Temperature Effect on Full Scale Span(S)
Temperature Effect on Offset(S)
Input Impedance
Output Impedance
0.80
-
0.2S
%VFSS
-
-
TCVFSS
-1.0
-
1.0
%VFSS
TCVoff
-1.0
-
1.0
mV
Zin
SOOO
-
1S,000
Q
-
6000
±0.1
±O.S
-
mV
mV/kPa
Zout
2S00
Response Time(6) (10% to 90%)
tR
-
1.0
Offset Stability(S)
-
-
±O.S
Max
%VFSS
%VFSS
Q
ms
%VFSS
MECHANICAL CHARACTERISTICS
Symbol
Min
Typ
Weight (Basic Element Case 344)
Characteristics
-
-
2.0
Warm-Up
-
-
1S
-
-
-
-
0.Q1
IN3
-
-
0.001
IN3
-
-
690
kPa
Cavity Volume
Volumetric Displacement
Common Mode Line Pressure(7)
Unit
Grams
Sec
NOTES:
1. 1.0 kPa (kiioPascal) equals 0.14S psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage althe
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
S. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at2S'C.
• Offset Stability:
Output deviation, after 1000 temperature cycles, - 40 to 12S'C, and 1.S million pressure cycles, with zero
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 8S'C, relative to 2S'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 8S'C, relative
• TcOllse!:
t02S'C.
6. Response Time is defined as the time for the incremental change In the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-91
MPX7050 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
f
STRAIGHT LINE
DEVIATION
t
OFFSET
100
PRESSURE (% FULLSCALE)
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX7050
series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
40
VS-luvac
35 I- TA = 25'C
~ 30 I- P1>P2 I .§. 25
MAX,
i ~~
10
5
"
..dfP
~
~
~
TYP,
~
~
I#'
kPii 5 0
PSI
12.5
1.83
25
3.63
T
SPAN
RANGE
I
~IN
l/
37.5
5.44
The effects of temperature on Full Scale Span and
Offset are very small and are shown under Operating
Characteristics.
ToFFSET
50
(TYP)
7.3
DIFFERENTIAUGAUGE ELEMENT
RTV DIE
BOND
P2
Figure 3. Output versus Pressure Differential
Figure 4. Cross-Sectional Diagram
(not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX7050 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application:
2-92
Motorola Sensor Device Data
MPX7050 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Case Type
MPX70S0D
344-08
Stainless Steel Cap
MPX70S0DP
3S2-02
Side with Part Marking
MPX70S0GP
3S0-03
Side with Port Attached
MPX70S0GVP
3S0-04
Stainless Steel Cap
MPX70S0GS
371-06
Side with Port Attached
MPX70S0GVS
371-0S
Stainless Steel Cap
MPX70S0GSX
371C-02
Side with Port Attached
MPX70S0GVSX
371D-02
Stainless Steel Cap
ORDERING INFORMATION
MPX7050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPXSeries
Device Type
Basic Element
Ported Elements
Options
Case Type
Order Number
Device Marking
Differential
Ca5e344-08
MPX70S0D
MPX70S0D
MPX70S0DP
Differential, Dual Ported
Ca5e3S2-02
MPX70S0DP
Gauge
Case3S0-03
MPX70S0GP
MPX70S0GP
Gauge, Vacuum
Case3S0-04
MPX70S0GVP
MPX70S0GVP
Gauge, Stove Pipe
Case 371-06
MPX70S0GS
MPX70S0D
Gauge, Vacuum Stove Pipe
Case 371-0S
MPX70S0GVS
MPX70S0D
Gauge, Axial
Case 371 C-02
MPX70S0GSX
MPX70S0D
Gauge, Vacuum Axial
Case 371 D-02
MPX70S0GVSX
MPX70S0D
Motorola Sensor Device Data
2-93
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 100 kPa
(0 to 14.5 PSI)
High Zin, On-Chip Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX7100
SERIES
Motorola Preferred Devices
The new MPX71 00 series pressure sensor incorporates all the innovative features of
Motorola's MPX2000 series family including the patented, single piezoresistive strain
gauge (X-ducer) and on--chip temperature compensation and calibration. In addition, the
MPX7100 series has a high input impedance of typically 10 kQ for those portable, low
power and battery-operated applications. This device is suitable for those systems in
which users must have a dependable, accurate pressure sensor that will not consume
significant power. The MPX7100 series device is a
logical and economical choice for applications such as
portable medical instrumentation, remote sensing
systems with 4-20 mAmp transmission and field
barometers/altimeters.
X-ducer™
HIGH Zin SILICON
PRESSURE SENSORS
Features
•
Temperature Compensated Over DoC to +85°C
•
Unique Silicon Shear Stress Strain Gauge
•
Full Scale Span Calibrated to 40 mV (typical)
•
Easy to Use Chip Carrier Package Options
•
Available in Differential and Gauge Configurations
•
Ratiometric to Supply Voltage
BASIC CHIP
CARRIER ELEMENT
DIFFERENTIAL
PORT OPTION
CASE344~S
CASE352~2
Style 1
Style 1
Application Examples
•
Portable Medical Instrumentation
•
Field Altimeters
•
Field Barometers
Pin Number
1
Ground
MAXIMUM RATINGS
Rating
Overpressure(S) (P1 > P2)
Burst Pressure(S) (P1 > P2)
Storage Temperature
Operating Temperature
I
I
I
I
2
+Vout
3
Vs
I
I
4
-Vout
Symbol
Pmax
Value
Unit
400
kPa
Pbur5t
1000
kPa
T5tg
-50 to +150
TA
-40 to +125
'C
'C
Vs
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-In reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure (P1) side relative to the vacuum
(P2) side. Similarly, output voltage increases as increasing vacuum is applied to
the vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
Preferred devices are Motorola recommended choices for future use and best overall value.
r--
I
----------,
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
1 HIGH
1 Zin
1 X..;jucer
I SENSING
1 ELEMENT
1
12
Vout+
1
4
1
Vout-
_ _ _ _ _ _ _ _ .J1
1
L. _ _ _ _
1
GND
Figure 1. Temperature Compensated
Pressure Sensor Schematic
REV2
2-94
Motorola Sensor Device Data
MPX7100 SERIES
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25·C unless otherwise noted, PI > P2)
Characteristic
Pressure Range(l)
Symbol
Min
Typ
Max
POP
0
-
100
kPa
-
10
16
Vdc
1.0
-
VFSS
38.5
40
Voff
-1.0
-2.0
Supply Voltage(2)
Vs
Supply Current
10
Full Scale Span(3)
MPX7100A, MPX7100D
Offset(4)
MPX7100D
MPX7100A
IlV/IlP
Sensitivity
Linearity(5)
MPX7100D
MPX7100A
Pressure Hysteresis(5) (0 to 100 kPa)
Temperature Hysteresis(5) (-40·C to +125·C)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
-
TCVFSS
-
Unit
mAdc
41.5
mV
1.0
2.0
mV
-
0.4
-
mV/kPa
-0.25
-1.0
-
0.25
1.0
%VFSS
-
±0.1
-
±0.5
-
-1.0
-
1.0
%VFSS
-
%VFSS
%VFSS
TCVoff
-1.0
1.0
mV
Zin
5000
10,000
15,000
Q
Zout
2500
3100
6000
-
-
±0.5
-
Symbol
Min
Typ
Max
-
-
2.0
Response Time(6) (10% to 90%)
tR
Offset Stability(5)
1.0
Q
ms
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344)
Warm-Up
-
-
15
Cavity Volume
-
-
-
Volumetric Displacement
Common Mode Line Pressure(7)
-
Unit
Grams
Sec
0.01
IN3
0.001
IN3
690
kPa
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25·C.
Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85·C, relative to 25·C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative
• TcOffset:
to 25·C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-95
MPX7100 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the ''Worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange pressure.
f
STRAIGHT LINE
DEVIATION
t
OFFSET
o
50
PRESSURE (% FULLSCALE)
100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
Figure 3 shows the output characteristics of the MPX71 00
series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
I
I
.JI'
40 I- Vs =10Vdc
~
35 I- TA = 25°C
~
-......:. TYP,
:g 30 I- Pl > P2
10~
I
§. 25
SPAN
MAX,
~
RANGE
~ 20
c..
~~
~ 15
~
o 10
'MIN
T
5
kPa
PSI
-5
k9
~
25
3.62
0
50
7.25
75
10.S7
r
tQFFSET
100
(TYP)
14.5
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAUGAUGE
DIE
DIFFERENTIAUGAUGE ELEMENT
P2
SILICONE GEL ABSOLUTE
DIE COAT
DIE
DIE
BOND
ABSOLUTE ELEMENT
P2
DIE
BOND
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX7100 series pressure sensor operating charac-
2-96
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX7100 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die from harsh media. The differential or
gauge sensor is designed to operate with positive differential
Part Number
MPX7100A
MPX7100D
MPX7100DP
MPX7100AP
MPX7100GP
MPX7100GVP
MPX7100AS
MPX7100GS
MPX7100GVS
MPX7100ASX
MPX7100GSX
MPX7100GVSX
Pressure (P1) Side Identifier
Case Type
344-08
Stainless Steel Cap
352-02
Side with Part Marking
350-03
Side with Port Attached
350-04
Stainless Steel Cap
371-06
Side with Port Attached
371-05
Stainless Steel Cap
371C-02
Side with Port Attached
371D-02
Stainless Steel Cap
ORDERING INFORMATION
MPX7100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in
the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPXSeries
Device Type
Basic Element
Ported Elements
Options
Case Type
Order Number
Device Marking
Absolute, Differential
Case 344-08
MPX7100A
MPX7100D
MPX7100A
MPX7100D
Differential, Dual Ported
Case 352-02
MPX7100DP
MPX7100DP
Absolute, Gauge
Case 350-03
MPX7100AP
MPX7100GP
MPX7100AP
MPX7100GP
Gauge Vacuum
Case 350-04
MPX7100GVP
MPX7100GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX7100AS
MPX7100GS
MPX7100A
MPX7100D
Gauge Vacuum Stove Pipe
Case 371-05
MPX7100GVS
MPX7100D
Absolute, Gauge Axial
Case 371 C-02
MPX7100ASX
MPX7100GSX
MPX7100A
MPX7100D
Gauge Vacuum Axial
Case 371 0-02
MPX7100GVSX
MPX7100D
Motorola Sensor Device Data
2-97
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
o to 200 kPa
(0 to 29 PSI)
High Zin, On-Chip Temperature
Compensated & Calibrated,
Silicon Pressure Sensors
MPX7200
SERIES
Motorola Preferred Devices
The new MPX7200 series pressure sensor incorporates all the innovative features of
Motorola's MPX2000 series family including the patented, single piezoresistive strain
gauge (X- P2)
Symbol
Value
Unit
Pmax
400
kPa
Burst Pressure(8) (P1 > P2)
Pburst
2000
kPa
Supply Voltage
Vs max
16
Vdc
Storage Temperature
Tst9
-50to+150
Operating Temperature
TA
-40 to +125
'C
'C
Vs
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X-ducer is directly proportional to the
differential pressure applied.
The absolute sensor has a built-in reference vacuum. The output voltage will
decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with
increasing pressure applied to the pressure (P1) side relative to the vacuum
(P2) side. Similarly, output voltage increases as increasing vacuum is applied to
the vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a schematic of the internal circuitry on the stand-alone
pressure sensor chip.
Preferred devices are Motorola recommended choices for future use and best overall value.
r--
----------,I
3
I
I HIGH
I lin
I X- P2)
Symbol
Min
Pressure Range(l)
POP
0
Supply Voltage(2)
Vs
Supply Current
10
Characteristic
Full Scale Span(3)
MPX7200A, MPX7200D
Offset(4)
MPX7200D
MPX7200A
Sensitivity
-
Typ
-
Max
Unit
200
kPa
10
16
1.0
-
Vdc
mAdc
VFSS
38.5
40
41.5
mV
Voff
-1.0
-2.0
-
1.0
2.0
mV
-
0.2
-
mV/kPa
0.25
1.0
%VFSS
AV/AP
-
-0.25
-1.0
-
Pressure Hysteresis(5) (0 to 200 kPa)
-
-
±0.1
-
Temperature Hysteresis(5) (-40°C to +125°C)
-
-
±0.5
-
%VFSS
1.0
%VFSS
1.0
mV
15,000
n
n
Linearity(5)
MPX7200D
MPX7200A
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
TCVFSS
-1.0
TCVoff
-1.0
Zin
5000
Zout
2500
-
6000
%VFSS
Response Time(6)
tR
-
1.0
-
ms
Offset Stability(5)
-
-
±0.5
-
%VFSS
Symbol
MECHANICAL CHARACTERISTICS
Characteristic
Min
Typ
-
-
2.0
Volumetric Displacement
-
Common Mode Line Pressure(7)
-
-
Weight (Basic Element Case 344)
Warm-Up
Cavity Volume
15
-
Max
-
Unit
Grams
Sec
0.01
IN3
0.001
IN3
690
kPa
NOTES:
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
2. Device is ratio metric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
• Pressure Hysteresis:
minimum or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero
• Offset Stability:
differential pressure applied.
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25'C.
• TcSpan:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative
• TcOffset:
to 25'C.
6. Response TIme is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
Motorola Sensor Device Data
2-99
MPX7200 SERIES
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange pressure.
f
STRAIGHT LINE
DEVIATION
t
100
PRESSURE (% FULLSCALE)
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
Figure 3 shows the output characteristics of the MPX7200
series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.
:g
>
.....s
::::J
a.
....
::::J
0
40 35 _
30
I
I
VS=10Vdc
TA=25°C
P1>P2
_
./
25
20
15
10
~
~
25
~~
~
50
7.25
~
TYP"
I
MAX "-
75
~
10
./
10-
SPAN
RANGE
I
~IN
100
125
14.5
PRESSURE
T
150
21.75
175
t:
200
29
OFFSET
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAUGAUGE
DIE
DIFFERENTIAUGAUGE ELEMENT
P2
SILICONE GEL ABSOLUTE
DIE COAT
DIE
DIE
BOND
ABSOLUTE ELEMENT
P2
DIE
BOND
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX7200 series pressure sensor operating charac-
2-100
teristios and internal reliability and qualifioation tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
MPX7200 SERIES
PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE
pressure applied, P1 > P2. The absolute sensor is designed
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which protects the die from harsh media. The differential and
gauge sensor is designed to operate with positive differential
Case Type
Part Number
MPX7200A
MPX7200D
MPX7200DP
MPX7200AP
MPX7200GP
MPX7200GVP
MPX7200AS
MPX7200GS
MPX7200GVS
MPX7200ASX
MPX7200GSX
MPX7200GVSX
Pressure Side (P1) Identifier
344-08
Stainless Steel Cap
352-02
Side with Part Marking
350-03
Side with Port Attached
350-04
Stainless Steel Cap
371-06
Side with Port Attached
371-05
Stainless Steel Cap
371C-02
Side with Port Attached
3710-02
Stainless Steel Cap
ORDERING INFORMATION
MPX7200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in
the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPXSeries
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Absolute, Differential
Case 344-08
MPX7200A
MPX7200D
MPX7200A
MPX7200D
Ported Elements
Differential
Case 352-02
MPX7200DP
MPX7200DP
Absolute, Gauge
Case 350-03
MPX7200AP
MPX7200GP
MPX7200AP
MPX7200GP
Gauge Vacuum
Case 350-04
MPX7200GVP
MPX7200GVP
Absolute, Gauge Stove Pipe
Case 371-06
MPX7200AS
MPX7200GS
MPX7200A
MPX7200D
Gauge Vacuum Stove Pipe
Case 371-05
MPX7200GVS
MPX7200D
Absolute, Gauge Axial
Case 371 C-02
MPX7200ASX
MPX7200GSX
MPX7200A
MPX7200D
Gauge Vacuum Axial
Case 371 D-02
MPX7200GVSX
MPX7200D
Motorola Sensor Device Data
2-101
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
MTS102
MTS103
MTS105
Silicon Temperature Sensors
Designed for use in temperature sensing applications in automotive,
consumer and industrial products requiring low cost and high accuracy.
•
Precise Temperature Accuracy Over Extreme Temperature MTS1 02: ± 2°C
from - 40°C to + 150°C
•
Precise Temperature Coefficient
•
Fast Thermal Time Constant
3 Seconds - Liquid
8 Seconds - Air
SILICON
TEMPERATURE
SENSORS
•
Linear VSE versus Temperature Curve Relationship
•
Other Packages Available
,I
3
CASE 29-04, STYLE 1
T0-226AA
(T0-92)
Pin Number
I
1
MAXIMUM RATINGS
Rating
Base
I
I
3
Collector
Symbol
Value
VEB
4.0
Vdc
IC
100
mAde
TJ, Tstg
-55 to +150
·C
Emitter-Base Voltage
Collector Current - Continuous(5)
Operating and Storage Junction Temperature Range
2
I
Emitter
Unit
1000...---r-....-,----,;------,-....-,----,-----,--,
i
I"''''''II~''''''"+---II---+--+--+Ic=O.lmA
'-'
~
Base
~
Collector
a:
~ 600I--+---t==~~~I--+-+
~
~uj
400
CD
>
TA, AMBIENTTEMPERATURE (·C)
Figure 1. Base-Emitter Voltage versus Ambient Temperature
REV2
2-102
Motorola Sensor Device Data
MTS102 MTS103 MTS105
ELECTRICAL CHARACTERISTICS (TA = 25·C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Supply Voltage
Characteristic
Vs
-0.2
-
35
Vdc
Output Voltage
Vout
-1.0
-
6.0
Vdc
Output Current
10
Emitter-Base Breakdown Voltage
(IE = 100 )lAdc, IC = 0)
V(BR)EBO
4.0
-
VBE
580
595
620
-3.0
-4.0
-7.0
-
3.0
4.0
7.0
-3.0
-3.0
-5.0
-
3.0
3.0
5.0
-2.28
-2.265
-2.26
Base-Emitter Voltage
(IC=0.1 rnA)
Base-Emitter Voltage Matching(1)
(IC = 0.1 rnA, TA = 25·C ±0.05·C)
-
aVBE
MTS102
MTS103
MTS105
Temperature Matching Accuracy(2)
(T1 = 40·C, T2= +150·C, TA = 25·C ± 0.05·C)
aT
MTS102
MTS103
MTS105
Temperature Coefficient (3,4)
(VBE = 595 mV, IC = 0.1 rnA)
Tc
Thermal lime Constant
Liquid
Flowing Air
"fH
Dependence ofTC on VBE@25·C(4)
(Figure 3)
mAdc
-
Vdc
mV
mV
·C
mV'·C
s
-
aTdaVBE
10
-
3.0
8.0
-
-
0.0033
-
mV,·C
mV
THERMAL CHARACTERISTICS
Thermal Resistance, Junction to Ambient
MECHANICAL CHARACTERISTICS
I Weight
87
Grams
NOTES:
1. All devices within anyone group or package will be matched for VBE to the tolerance identified in the electrical characteristics table. Each
device will be labeled with the mean VBE value for that group.
2. All devices within an individual group, as described in Note 1, will track within the specified temperature accuracy. This includes variations
in T C, VBE, and nonlinearity in the range -40 to +150·C. Nonlinearity is typically less than ± 1·C in this range. (See Figure 4)
3. The TC as defined by a least-square linear regression for VBE versus temperature over the range -40 to +150·C for a nominal VBE of 595
mV at 25·C. For other nominal VBE values the value of the TC must be adjusted for the dependence of the TC on VBE (see Note 4).
4. For nominal VBE at 25·C other than 595 mV, the TC must be corrected using the equation TC = -2.265 + 0.003 (VBE - 595) where VBE is
in mV and the TC is in mV'·C. The accuracy ofthis TC is typically±0.01 mV'·C.
5. For maximum temperature accuracy, IC should not exceed 2 rnA. (See Figure 2)
Or--
r'R"
620
IC
I-- I-
Or-- rr-- r- t
Or-- r- VSE
r-- I- ~
II
I
I
I
I
TA = 2S·C
TC = -2.265 + 0.0033 (VSE -S9S)
I III
III
TA=2S.C
V
V
./
,/
--
0
/'
/
./
V
/'
~
./
O~
0.01
i.-,V
/
0.02
0.05
0.1
0.2
0.5
1.0
2.0
S.O
10
S80
-2.32
/'
-2.28
-2.24
-2.20
-2.16
Ic, COLLECTOR CURRENT (rnA)
TC,TEMPERATURE COEFFICIENT (mV/·C)
Figure 2. Base-Emitter Voltage versus
Collector-Emitter Current
Figure 3, Temperature Coefficient versus
Base-Emitter Voltage
Motorola Sensor Device Data
2-103
MTS102 MTS103 MTS10S
1000
+2. 0
0
/
-2.
w
.......
~ 800
~
......
'"
,/
0
0
-
1
/
/
~
r'\.
~
~ 400
OJ
oV
20
40 60
80
100
TEMPERATURE (oG)
120
140
...........
1"'--0...
............
r---......
~
>
0
600
..u
'\
'\
/
-40 -20
.......
~
c::
160
Figure 4. Linearity Error versus Temperature
SloRe = - 2.265
--
~
40
80
TA, AMBIENTTEMPERATURE (0G)
......
.......... ....
120
Figure 5. VBE versus Ambient Temperature
APPLICATIONS INFORMATION
The base and collector leads of the device should be connected together in the operating circuit (pins 2 and 3). They are not
internally connected.
"
VBE
The following example describes how to determine the
VBE versus temperature relationship for a typical shipment of
various VBE groups.
EXAMPLE:
Given - Customer receives a shipment of MTS102 devices. The shipment consists of three groups of different
nominal VBE values.
Group 1: VBE (nom) = 595 mV
Group 2: VBE (nom) = 580 mV
Group 3: VBE (nom) = 620 mV
"
2. Determine the VBE value at extremes, - 40°C and
+150°C:
VBE(TA) = VBE(25°C) + (TC)(TA - 25°C) where
VBE(TA) = value of VBE at desired temperature.
3. Plot the VBE versus TA curve using two VBE values:
VBE (- 40°C), VBE(25°C), or VBE(+ 150°C)
4. Given any measured VBE, the value of TA (to the accuracy value specified: MTS102 - ±2°C, MTS103± 35°C, MTS105 - ± 5°C) can be read lrom Figure 5
or calculated from equation 2.
1. Determine value of TC:
a. If VBE (nom) =595 mV, TC =-2.265 mV/oC from the
Electrical Characteristics table.
5. Higher temperature accuracies can be achieved if the
collector current, IC, is controlled to react in accordance with and to compensate for the linearity error.
Using this concept, practical circuits have been built in
which allow these sensors to yield accuracies within
± 0.1 °C and ± 0.01 °C.
b. If VBE (nom) is less than or greater than 595 mV determine T C from the relationship described in Note 4.
TC -2.265 + 0.0033 (VBE - 595) or see Figure 3.
Reference: ''Transistors-A Hot TIp for Accurate Temperature
Sensing," Pat O'Neil and Carl Derrington, Electronics 1979.
Find -
VBE versus temperature Relationship.
=
2-104
Motorola Sensor Device Data
MTS102 MTS103 MTS105
TYPICAL CIRCUITS
120k(1%)
>--<>---oVout
>--<>---oVout
100k
50 k
100 k
120 I
15V
t2Vdc
or Greater
I--_--~O
(1'/,:
+15 Vor
Greater
NOTE: With 01 at a known temperature, adjust RCAl to set output voltage
to Vout = TEMP x 10 mY, Output of MTS102, 3,5 is then converted to Vout
= 10 mV/O-(OF, °C or OK)
-=-
MTS102
NOTE: With 01 and 02 at identical temperature, adjust RCAl
for Vout = 0.000 V
R =27 kr.! (1 %) for °C or oK
R = 15 kf.! (1%) for of
Figure 7. Differential Temperature Measurement
o To 150°C
Figure 6. Absolute Temperature Measurement
r - ' \ M r - - - - - - < +9.0 V
470f.!
The circuit converts the linear temperaturesensor output to a
digital format which may be used for direct connection to an
MPU.
2N2646
1.0 k
Reference: w.J. Prudhomme
Popular Electronics, December 1976, Page 62
5.6 k
=
1.0 k
Zero
Adjust
J2
10
6.2 k
JUUL
Output
(to MPU)
10 k
1N821
MTS102
100f.!
=
All resistors are 10% 1/4 walt except 6.2 k which is 5% 1/4 watt.
Figure 8. Temperature Sensor to Digital MPU Circuit
Motorola Sensor Device Data
2-105
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Preliminary Information
Micromachined Accelerometer
XMMAS40G10D
XMMAS40G10S
±40g Amplified
MICROMACHINED
ACCELEROMETER
±40g AMPLIFIED
The MMAS40G family of silicon capacitive, micro-machined accelerometers
features integral signal amplification, signal conditioning, a 4-pole low-pass
filter and temperature compensation. Zero-G offset, full scale span and filter
roll-off are factory set and require no external passives. A calibrated self-test
feature mechanically displaces the seismic mass with the application of a digital
self-test signal. The device is offered in either of two plastic packages, thereby
accommodating various axis orientation requirements.
The MMAS40G incorporates a single polysilicon seismic mass, suspended
between two fixed polysilicon plates (G-cell). The forces of acceleration move
the seismic mass, thereby resulting in a change in capacitance. The G-cell is
sealed at the die level, creating a particle-free environment. The G-cell
features built-in damping and over-range stops to protect it from mechanical
shock.
MMAS40G accelerometers are ideally suited for automotive crash detection
and recording, vibration monitoring, automotive suspension control, appliance
control systems, etc.
SIP PACKAGE
CASE 447-01
DIP PACKAGE
CASE 648C-03
Features
•
PIN NUMBER
Full Scale Measurement ±40g
•
Calibrated, True Self-Test
1
9
N/C(1)
•
Standard 16-Pin Plastic DIP
2
N/C(1)
10
N/C(1)
•
Integral Signal Conditioning and 4-Pole Filter
3
N/C(1)
11
N/C(1)
•
Linear Output
4
Self-Test
12
N/C(1)
Robust, High Shock Survivability
5
Output
13
N/C(1)
6
Bypass (2)
14
N/C(1)
7
GND
15
N/C(1)
8
Vs (2)
16
N/C(1)
•
SIMPLIFIED BLOCK DIAGRAM
+
N/C(1)
NOTES:
1. Internal connections. All N/C must
remain floating, except DI P's pin
11 which must be tied to pin 8.
2. Bypass to ground with 0.1 ~F ceramic
capacitor to improve noise performance.
+
r------,~~~~-lL~~---,
G-CELL
6
BYPASS
~--------~~----~4<~
:c
LOW-PASS FILTER
OUTPUT
L------------7~----J
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
2-106
Motorola Sensor Device Data
XMMAS40G10D XM MAS40G 1 OS
MAXIMUM RATINGS
Symbol
Value
Unit
Acceleration (biased each axis)
Rating
G
±500
g
Acceleration (unbiased each axis)
G
±2000
g
VSmax
-0.3 to +7.0
Vdc
Tstg
-40 to +125
'C
TA
-40 to +85
'C
Supply Voltage
Storage Temperature
Operating Temperature(6)
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25'C unless otherwise noted)
Symbol
Min
Typ
Acceleration Range
Characteristic
G
±40
-
Max
-
Unit
g
Output Drive Capability
-
-0.2
-
0.2
rnA
Supply Voltage
Vs
4.75
5.0
5.25
V
10
-
5.0
-
Full Scale Output Range
VFSO
0.3
-
4.7
V
Sensitivity (TA = 25'C) (1) (2)
f!,vII:!.G
38
40
42
mV/g
Sensitivity (over temperature range) (2) (3)
Supply Current
rnA
6V/I:!.G
36
40
44
mV/g
Zero Acceleration Output (TA = 25'C) (4)
Voll
2.3
2.5
2.7
V
Zero Acceleration Output (over temperature range) (3) (4)
Voll
2.1
2.5
2.9
0.5
-
%FSO
V
Linearity
-
-
Transverse Sensitivity
-
-
1.0
3.0
%FSO
Frequency Bandwidth
-
-
400
-
Hz
Noise
-
-
20
50
mVpk
Self-Test Output Equivalent (5)
GS
22
25
28
g
Self-Test Triggering
VTH
1.6
-
3.4
V
-
-
10
-
!lA
Self-Test Input Current
NOTES:
1. The output voltage increases from the Zero Acceleration Output for positive acceleration and decreases for negative acceleration. The
typical sensitivity is 40 mV/g. For example, with Vs = 5.0 V, a+20g input will result in a 3.3 Voulput. (Voutput =2.5 + 0.040 x20) and a-20g
input will result in a 1.7 V output.
2. Sensitivity is a ratiometric parameter: I:!.V/I:!.G(Vs) = I:!.V/I:!.G(5 V) x (VS/5 V).
3. The compensated temperature range is -40 to + 105'C.
4. Zero Acceleration Output is a ratio metric parameter: VolI(Vs) = VolI(5 V) x (VS/5 V).
5. Equivalent output in response to a Logic Level One on the self-test pin.
6. Additional temperature range available. Consult factory.
ORDERING INFORMATION
Device
Temperature Range
Case No.
Package
XMMAS40G10D
-40 to +85'C
Case 648C-03
Plastic DIP
XMMAS40G10S
-4010 +85'C
Case 447-01
Plastic SIP
Motorola Sensor Device Data
2-107
XMMAS40G10D XMMAS40G10S
POSITIVE ACCELERATION SENSING DIRECTION
t
DIP PACKAGE
SIP PACKAGE
• When positioned as shown, gravity will result in a positive 1g output
SIP PACKAGE DRILLING PATTERN
"00<'~: I I 11~ 111 !r---::::
"0.'OO~.~~~
J ) - - - - - - - - .240
2 x 0 .058
2-108
~ :~~~
-J/
______
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Preliminary Information
Micromachined Accelerometer
XMMAS250G10D
XMMAS250G10S
±250g Amplified
MICRO MACHINED
ACCELEROMETER
±250g AMPLIFIED
The MMAS250G family of silicon capacitive, micro-machined accelerometers features integral signal amplification, signal conditioning, a 4-pole
low-pass filter and temperature compensation. Zero-G offset, full scale span
and filter roll-off are factory set and require no external passives. A calibrated
self-test feature mechanically displaces the seismic mass with the application
of a digital self-test signal. The device is offered in either of two plastic
packages, thereby accommodating various axis orientation requirements.
The MMAS250G incorporates a single polysilicon seismic mass, suspended
between two fixed polysilicon plates (G-cell). The forces of acceleration move
the seismic mass, thereby resulting in a change in capacitance. The G-cell is
sealed at the die level, creating a particle-free environment. The G-cell
features built-in damping and over-range stops to protect it from mechanical
shock.
MMAS250G accelerometers are ideally suited for automotive crash detection
and recording, vibration monitoring, automotive suspension control, appliance
control systems, etc.
DIP PACKAGE
CASE 648C-03
SIP PACKAGE
CASE 447-01
Features
•
PIN NUMBER
Full Scale Measurement ±250g
• Calibrated, True Self-Test
1
N/C(1)
9
N/C (1)
• Standard 16-Pin Plastic DIP
2
N/C(1)
10
N/C (1)
•
Integral Signal Conditioning and 4-Pole Filter
3
N/C(1)
11
N/C(1)
•
Linear Output
4
Self-Test
12
N/C (1)
•
Robust, High Shock Survivability
5
Output
13
N/C(1)
6
Bypass (2)
14
N/C(1)
7
GND
15
N/C(1)
8
Vs (2)
16
N/C (1)
SIMPLIFIED BLOCK DIAGRAM
+
NOTES:
1. Internal connections. All N/C must
remain floating, except DIP's pin
11 which must be tied to pin 8.
2. Bypass to ground with 0.1 IlF ceramic
capacitor to improve noise performance.
+
r------,~~~~-j-~~---,
G-CELL
6
~--------~~----r-~~
LOW-PASS FILTER
BYPASS
OUTPUT
~------------7~---This document contains information on a product under development. Motorola reserves the right 10 change or discontinue Ihis producl wilhout nolice.
Motorola Sensor Device Data
2-109
XMMAS250G10D XMMAS250G10S
MAXIMUM RATINGS
Rating
Acceleration (biased each axis)
Acceleration (unbiased each axis)
Supply Voltage
Storage Temperature
Operating Temperature(6)
Symbol
Value
Unit
G
±500
g
G
±2000
g
VSmax
-0.3 to +7.0
Vdc
Tstg
-40 to +125
°C
TA
-40 to +85
°C
OPERATING CHARACTERISTICS (VS = 5.0 Vdc. TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Acceleration Range
Characteristic
G
±250
-
-
g
Output Drive Capability
-
-0.2
-
0.2
rnA
Supply Voltage
Vs
4.75
5.0
5.25
V
Supply Current
10
5.0
-
rnA
-
Unit
Full Scale Output Range
VFSO
0.3
-
4.7
V
Sensitivity (over temperature range) (1) (2) (3)
AV/AG
5.8
6.5
7.2
mV/g
Zero Acceleration Output (TA = 25°C) (4)
Volt
2.3
2.5
2.7
V
Zero Acceleration Output (over temperature range) (3) (4)
Volt
2.1
2.5
2.9
V
Linearity
-
-
0.5
-
%FSO
Transverse Sensitivity
-
-
1.0
3.0
%FSO
Frequency Bandwidth
-
-
700
-
Hz
Noise
-
-
20
50
mVpk
GS
44
50
56
g
VTH
1.6
-
3.4
V
-
10
-
!lA
Self-Test Output Equivalent (5)
. Self-Test Triggering Voltage
-
Self-Test Input Current
NOTES:
1. The output voltage increases from the Zero Acceleration Output for positive acceleration and decreases for negative acceleration. The
typical sensitivity is 6.5 mV/g. For example. with Vs = 5.0 V. a + 100g input will result in a 3.15 V output. (Voutput = 2.5 + 0.0065 x 100) and
a -1 OOg input will result in a 1.85 V output.
2. Sensitivity is a ratio metric parameter: AV/AG(Vs) = AV/AG(5 V) x (VS/5 V).
3. The compensated temperature range is -40 to +85°C.
4. Zero Acceleration Output is a ratiometric parameter: Volt(Vs) = Volt(5 V) x (VS/5 V).
5. Equivalent output in response to a Logic Level One on the self-test pin.
6. Additional temperature range available. Consult factory.
ORDERING INFORMATION
Device
Temperature Range
Case No.
Package
XMMAS250G10D
-40 to +85°C
Case 648C-03
Plastic DIP
XMMAS250Gl0S
-40 to +85°C
Case 447-01
Plastic SIP
2-110
Motorola Sensor Device Data
XMMAS250G10D XMMAS250G10S
POSITIVE ACCELERATION SENSING DIRECTION
t
DIP PACKAGE
SIP PACKAGE
• When positioned as shown, gravily will result in a posilive 19 output
SIP PACKAGE DRILLING PATTERN
1
l~
111
i-::::
"0.00"::~
"00~ ': ___ I I
SJf---------- .240
2 x 0 .058
~ :~~~ - - - - - - - - ' /
Motorola Sensor Device Data
2-111
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
XMMAS500G10D
XMMAS500G10S
Preliminary Information
Micromachined Accelerometer
±500g Amplified
MICROMACHINED
ACCELEROMETER
±500g AMPLIFIED
The MMAS500G family of silicon capacitive, micro-machined accelerometers features integral signal amplification, signal conditioning, a 4-pole
low-pass filter and temperature compensation. Zero-G offset, full scale span
and filter roll-off are factory set and require no external passives. A calibrated
self-test feature mechanically displaces the seismic mass with the application
of a digital self-test signal. The device is offered in either of two plastic
packages, thereby accommodating various axis orientation requirements.
The MMAS500G incorporates a single polysilicon seismic mass, suspended
between two fixed polysilicon plates (G-cell). The forces of acceleration move
the seismic mass, thereby resulting in a change in capacitance. The G-cell is
sealed at the die level, creating a particle-free environment. The G-cell
features built-in damping and over-range stops to protect it from mechanical
shock.
MMAS500G accelerometers are ideally suited for automotive crash detection
and recording, vibration monitoring, automotive suspension control, appliance
control systems, etc.
DIP PACKAGE
CASE 648C-03
SIP PACKAGE
CASE 447-01
Features
•
•
PIN NUMBER
Full Scale Measurement ±500g
Calibrated, True Self-Test
1
N/C(1)
9
N/C (1)
N/C(1)
10
N/C(1)
•
Standard 16-Pin Plastic DIP
2
•
Integral Signal Conditioning and 4-Pole Filter
3
N/C (1)
11
N/C(1)
•
•
Linear Output
Robust, High Shock Survivability
4
Self-Test
12
N/C (1)
5
Output
13
N/C(1)
6
Bypass (2)
14
N/C(1)
7
GND
15
N/C (1)
8
Vs (2)
16
N/C (1)
SIMPLIFIED BLOCK DIAGRAM
+
r-----I
I
I
4
NOTES:
1. Internal connections. All N/C must
remain floating, except DIP's pin
11 which must be tied to pin 8.
2. Bypass to ground with 0.1 flF ceramic
capacitor to improve noise performance.
+
~E-",::,,-,_jJ~s_--,
G-CELL
+
I
I
I
I
I
6
. .------~~~--~~I~
I
I
I
LOW-PASS FILTER
BYPASS
::;;:
5
OUTPUT
This document contains Information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
2-112
Motorola Sensor Device Data
XMMAS500G1 OD XMMAS500G1 OS
MAXIMUM RATINGS
Symbol
Value
Acceleration (biased each axis)
Rating
G
±1000
g
Acceleration (unbiased each axis)
G
±2000
g
VSmax
-0.3 to +7.0
Vdc
Tstg
-40 to +125
'C
TA
-40 to +85
'C
Supply Voltage
Storage Temperature
Operating Temperature(6)
Unit
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25'C unless otherwise noted)
Characteristic
Typ
Max
-
-
g
-0.2
0.2
rnA
4.75
5.0
5.25
V
5.0
-
rnA
Symbol
Min
Acceleration Range
G
±500
Output Drive Capability
-
Supply Voltage
Vs
Supply Current
10
-
Unit
Full Scale Output Range
VFSO
0.3
-
4.7
V
Sensitivity (over temperature range) (1) (2) (3)
IW/IlG
2.9
3.2
3.6
mV/g
V
Zero Acceleration Output (TA = 25'C) (4)
Voll
2.3
2.5
2.7
Zero Acceleration Output (over temperature range) (3) (4)
Voll
2.1
2.5
2.9
V
Linearity
-
-
0.5
-
%FSO
Transverse Sensitivity
-
-
1.0
3.0
%FSO
Frequency Bandwidth
-
-
700
-
Hz
Noise
-
-
20
50
mVpk
Self-Test Output Equivalent (5)
GS
44
50
56
g
Self-Test Triggering Voltage
VTH
1.6
-
3.4
V
-
10
-
!IA
-
Self-Test Input Current
NOTES:
1. The output voltage increases from the Zero Acceleration Output for positive acceleration and decreases for negative acceleration. The
typical sensitivity is 3.2 mV/g. For example, with Vs = 5.0 V, a +2S0g input will result in a 3.3 V output. (Voutput = 2.5 + 0.0032 x 250) and
a-2S0g input will result in a 1.7 V output.
2. Sensitivity is a ratiometric parameter: IlV/IlG(Vs) = IlV/IlG(S V) x (VS/S V).
3. The compensated temperature range is -40 to +85'C.
4. Zero Acceleration Output is a ratiometric parameter: VolI(Vs) = VolI(5 V) x (VS/5 V).
5. Equivalent output in response to a Logic Level One on the self-test pin.
6. Additional temperature range available. Consult factory.
ORDERING INFORMATION
Device
Temperature Range
Case No.
Package
XMMASSOOG10D
-40 to +85'C
Case 648C-03
Plastic DIP
XMMAS500G10S
-40 to +85'C
Case 447-01
Plastic SIP
Motorola Sensor Device Data
2-113
XMMAS500G10D XM MAS500G 1 OS
POSITIVE ACCELERATION SENSING DIRECTION
t
DIP PACKAGE
SIP PACKAGE
• When positioned as shown, gravity will result in a positive 1g output
SIP PACKAGE DRILLING PATTERN
,,0..0 , :
"0096 '::::
2 x 0 .058
2-114
I I11
~ 111 il----':::
~
j).....---------.240
~ :~~~ - - - - - - - - - ' /
Motorola Sensor Device Data
Section Three
Quality and Reliability
Quality and Reliability - Overview . ......... 3-2
Reliability Issues for Silicon Pressure
Sensors ................................... 3-3
Reliability Tests for Automotive/Industrial
Pressure Sensors ......................... 3-9
Statistical Process Control ................. 3-10
Electrostatic Discharge Data ............... 3-14
Motorola Sensor Device Data
Quality and Reliability
3-1
Quality and Reliability -
Overview
A Major Objective of the Production Cycle
From rigid incoming inspection of piece parts and materials
to stringent outgoing quality verification, the Motorola
assembly and process flow is encompassed by an elaborate
system of test and inspection stations; stations to ensure a
step-by-step adherence to prescribed procedure. This
produces the high level of quality for which Motorola is
known ... from start to finish.
As illustrated in the process flow overview, every major
manufacturing step is followed by an appropriate in-process
QA inspection to insure product conformance to
specification. In addition, Statistical Process Control (S.P.C.)
techniques are utilized on all critical processes to insure
processing equipment is capable of producing the product to
the target specification while minimizing the variability.
Quality control in wafer processing, assembly, and final test
impart Motorola sensor products with a level of reliability that
easily exceeds almost all industrial, consumer, and military
requirements. It is this built-in quality that insures failure-free
shipments of Motorola sensor products.
Compensated Sensor Flow Chart
Quality and Reliability
3-2
Motorola Sensor Device Data
Reliability Issues for Silicon Pressure Sensors
by Theresa Maudie and Bob Tucker, Signal
Products Division, Communications, Power and
Signal Technologies Group
ABSTRACT
Reliability testing for silicon pressure sensors is of greater
importance than ever before with the dramatic increase in
sensor usage. This growth is seen in applications replacing
mechanical systems, as well as new designs. Across all
market segments, the expectation for the highest reliability
exists. While sensor demand has grown across all of these
segments, the substantial increase of sensing applications in
the automotive arena is driving the need for improved reliability and test capability. Unfortunately, sensor reliability is a
subject that has not been widely discussed or publicized.
The purpose of this paper is to take a closer look at these reliability issues for silicon pressure sensors.
INTRODUCTION
Discussing reliability as it pertains to semiconductor electronics is certainly not a new subject. However, when developing new technologies like sensors how reliability testing
will be performed is not always obvious. Pressure sensors
are an intriguing dilemma. Since they are electromechanical
devices, different types of stresses should be considered to
insure the different elements are exercised as they would be
in an actual application. In addition, the very different
package outlines relative to other standard semiconductor
packages require special fixtures and test set-ups. However,
as the sensor marketplace continues to grow, reliability
testing becomes more important than ever to insure that
products being used across all market segments will meet
standard reliability lifetime expectations.
RELIABILITY DEFINITION
Reliability is (1) the probability of a product performing its
intended function over its intended lifetime and under the
operating conditions encountered. The four key elements of
the definition are probability, performance, lifetime, and operating conditions. Probability implies that the reliability lifetime
estimates will be made based on statistical techniques where
samples are tested to predict the lifetime of the manufactured
products. Performance is a key in that the sample predicts
the performance of the product at a given point in time but the
variability in manufacturing must be controlled so that all
devices perform to the same functional level. Lifetime is the
period of time over which the product is intended to perform.
This lifetime could be as small as one week in the case of a
disposable blood pressure transducer or as long as 30 years
as often specified for communication applications. Environment is the area that also plays a key role since the operating
conditions of the product can greatly influence the reliability
of the product.
Environmental factors that can be seen during the lifetime
of any semiconductor product include temperature, humidity,
electric field, magnetic field, current density, pressure differential, vibration, and/or a chemical interaction. Reliability
testing is generally formulated to take into account all of
Motorola Sensor Device Data
these potential factors either individually or in multiple
combinations. Once the testing has been completed predictions can be made for the intended product customer base.
If a failure would be detected during reliability testing, the
cause of the failure can be categorized into one of the
following: design, manufacturing, materials, or user. The
possible impact on the improvements that may need to be
made for a product is influenced by the stage of product
development. If a product undergoes reliability testing early
in its development phase, the corrective action process can
generally occur in an expedient manner and at minimum
cost. This would be true whether the cause of failure was
attributed to the design, manufacturing, or materials. If a
reliability failure is detected once the product is in full
production, changes can be very difficult to make and
generally are very costly. This scenario would sometimes
result in a total redesign.
The potential cause for a reliability failure can also be user
induced. This is generally the area that the least information
is known, especially for a commodity type manufacturer that
achieves sales through a global distribution network. It is the
task of the reliability engineer to best anticipate the multitudes of environments that a particular product might see,
and determine the robustness of the product by measuring
the reliability lifetime parameters. The areas of design,
manufacturing, and materials are generally well understood
by the reliability engineer, but without the correct environmental usage, customer satisfaction can suffer from lack of
optimization.
RELIABILITY STATISTICS
Without standardization of the semiconductor sensor standards the end customer is placed in a situation of possible
jeopardy. If non-standard reliability data is generated and
published by manufacturers, the information can be
perplexing to disseminate and compare. Reliability lifetime
statistics can be confusing for the novice user of the information, "let the buyer beware".
The reporting of reliability statistics is generally in terms of
failure rate, measured in FITs, or failure rate for one billion
device hours. In most cases, the underlying assumption
used in reporting either the failure rate or the MTBF is that the
failures occurring during the reliability test follow an exponentiallife distribution. The inverse of the failure rate is the MTBF,
or mean time between failure. The details on the various life
distributions will not be explored here but the key concern
about the exponential distribution is that the failure rate over
time is constant. Other life distributions, such as the
lognormal or Weibull can take on different failure rates over
time, in particular, both distributions can represent a wear out
or increasing failure rate that might be seen on a product
reaching the limitations on its lifetime or for certain types of
failure mechanisms.
The time duration use for the prediction of most reliability
statistics is of relatively short duration with respect to the
product's lifetime ability and failures are usually not
observed. When a test is terminated after a set number of
hours is achieved, or time censored, and no failures are
observed, the failure rate can be estimated by use of the chi-
Quality and Reliability
3-3
new product and they have put a total of 1 ,000 parts on a
high temperature storage test for 500 hours each, their
corresponding cumulative device hours would be 500,000
device hours. Vendor B has been in the business for several
years on the same product and has tested a total of 500,000
parts for 10 hours each to the same conditions as part of an
in-line burn-in test for a total of 5,000,000 device hours. The
corresponding failure rate for a 60% confidence level for
vendor A would be 1,833 FITs, vendor B would have a FIT
rate of 183 FITs.
square distribution which relates observed and expected
frequencies of an event to established confidence intervals
(4). The relationship between failure rate and the chi-square
distribution is as follows:
A
_ '1.2 (n, d.!.)
L1 -
2t
Where:
A
L1
'1.2
a
d.f.
r =
failure rate
Table 1. Chi-Square Table
lower one side confidence limit
chi-square function
risk, (1-confidence level)
Chi-Square Distribution Function
60% Confidence Level
degrees of freedom = 2 r + 2
number of failures
No. Fails
device hours
Chi-square values for 60% and 90% confidence intervals
for up to 12 failures are shown in Table 1.
As indicated by the table, when no failures occur, an
estimate for the chi-square distribution interval is obtainable.
This interval estimate can then be used to solve for the failure
rate, as shown in the equation above. If no failures occur, the
failure rate estimate is solely a function of the accumulated
device hours. This estimate can vary dramatically as
additional device hours are accumulated.
As a means of showing the influence of device hours with
no failures on the failure rate value, a graphical representation of cumulative device hours versus the failure rate
measured in FITs is shown in Figure 1.
A descriptive example between two potential vendors best
serves to demonstrate the point. If vendor A is introducing a
109
~
108
107
~
~
uj
!;;:
a:
LU
a:
'"11:-'
106
~
!
~
105
~
104
1.833
0
4.605
1
4.045
1
7.779
2
6.211
2
10.645
3
8.351
3
13.362
15.987
10.473
4
12.584
5
18.549
6
14.685
6
21.064
7
16.780
7
23.542
8
18.868
8
25.989
9
20.951
9
28.412
10
23.031
10
30.813
11
25.106
11
33.196
12
27.179
12
35.563
~
~
10
100
.".1,000
...
X2 Quantity
0
4
!
100
10
No. Fails
5
1,000
0.1
90% Confidence Level
X2 Quantity
~
~
~
.
"
CUMULATIVE DEVICE HOURS, It]
Figure 9. Depiction of the Influence on the cumulative device hours with no failures
and the Failure Rate as measured in FITs.
Quality and Reliability
3-4
Motorola Sensor Device Data
One could thus imply that the reliability performance
indicates that vendor B has an order of magnitude improvement in performance over vendor A with neither one seeing
an occurrence of failure during their performance.
The incorrect assumption of a constant failure rate over
time can potentially result in a less reliable device being
designed into an application. The reliability testing assumptions and test methodology between the various vendors
needs to be critiqued to insure a full understanding of the
product performance over the intended lifetime, especially in
the case of a new product.
INDUSTRY RELIABILITY STANDARDS
Reliability standards for large market segments are often
developed by "cross-corporation" committees that evaluate
the requirements for the particular application of interest. It is
the role of these committees to generate documents
intended as guides for technical personnel of the end users
and suppliers, to assist with the following functions: specifying, developing, demonstrating, calibrating, and testing the
performance characteristics for the specific application.
One such committee which has developed a standard for a
particular application is the Blood Pressure Monitoring
Committee of the Association for the Advancement of
Medical Instrumentation (AAMI) (2). Their document, the
"American National Standard for Interchangeability and
Performance of Resistive Bridge Type Blood Pressure
Transducers", has an objective to provide performance
requirements, test methodology, and terminology that will
help insure that safe, accurate blood pressure transducers
are supplied to the marketplace.
In the automotive arena, the Society of Automotive
Engineers (SA E) develops standards for various pressure
sensor applications such as SAE document J 1346, "Guide to
Manifold Absolute Pressure Transducer Representative Test
Method" (3).
While these two very distinct groups have successfully
developed the requirements for their solid-state silicon
pressure sensor needs, no real standard has been set for the
general industrial marketplace to insure products being
offered have been tested to insure reliability under industrial
conditions. Motorola has utilized MIL-STD-750 as a reference document in establishing reliability testing practices for
the silicon pressure sensor, but the differences in the
technology between a discrete semiconductor and a silicon
pressure sensor varies dramatically. The additional tests that
are utilized in semiconductor sensor reliability testing are
based on the worst case operational conditions that the
device might encounter in actual usage.
ESTABLISHED SENSOR TESTING
Motorola has established semiconductor sensor reliability
testing based on exercising to detect failures by the presence
of the environmental stress. Potential failure modes and
mechanisms are developed by allowing tests to run beyond
normal test times, thus stressing to destruction. The typical
reliability test matrix used to insure conformance to
customers end usage is as follows:
Motorola Sensor Device Data
PULSED PRESSURE TEMPERATURE CYCLING
WITH BIAS (PPTCB)
This test is an environmental stress test combined with
cyclic pressure loading in which devices are alternately
subjected to a low and high temperature while operating
under a cyclical pressure load. This test simulates the
extremes in the operational life of a pressure sensor.
Typical Test Conditions: TA = - 40°C to + 125°C, dwell time
15 minutes, transfer time 15 minutes, bias = 100% rated
voltage, pressure = a to full scale, pressure frequency = 2
to 10 seconds, test time = 168 to 1000 hours.
Potential Failure Modes: Open, short, parametric shift.
Potential Failure Mechanisms: Wire bond, wire, die bond,
gel aeration, package failures, parametric stability.
HIGH HUMIDITY, HIGH TEMPERATURE WITH BIAS
(H3TB)
A combined environmental/electrical stress test in which
devices are subjected to an elevated ambient temperature
and humidity while the units are biased.
Typical Test Conditions: TA = 85°C, relative humidity =
85%, bias = 100% rated voltage, test time = 168 to 1000
hours
Potential Failure Modes: Open, short, parametric shift.
Potential Failure Mechanisms: Wire bond, package
failure, parametric stability.
HIGH TEMPERATURE WITH BIAS (HTB)
This operational test exposes the pressure sensor to a
high temperature ambient environment in which the device is
biased to the rated voltage.
Typical Test Conditions: TA =+125°C, bias = 100% rated
voltage, test time = 168 to 1000 hours.
Potential Failure Modes: Parametric shift in offset or
linearity.
Potential Failure Mechanisms: Die stability.
HIGH AND LOW TEMPERATURE STORAGE LIFE
(HTSL AND LTSL)
High and low temperature storage life testing is performed
to simulate the potential storage or operational conditions
that the pressure sensor might encounter in actual usage.
The test also evaluates the devices thermal integrity at worst
case temperature.
Typical Test Conditions: TA = + 125°C or TA = - 40°C, test
time = 168 to 1000 hours.
Potential Failure Modes: Parametric shifts in offset and
linearity.
Potential Failure Mechanisms: Bulk die defects or diffusion defects.
Quality and Reliability
3-5
TEMPERATURE CYCLING (TC)
This is an environmental test in which the pressure sensor
is alternatively subjected to hot and cold temperature
extremes with a short stabilization time at each temperature
in an air medium. This test will stress the devices by
generating thermal mismatches between materials.
Typical Test Conditions: TA = - 40°C to + 125°C, Dwell
time 15 minutes, transfer time 5 minutes, test time = 100 to
1000 cycles.
Potential Failure Modes: Open, parametric shift in offset or
linearity.
Potential Failure Mechanisms: Wire bond, die bond,
package failures, gel aeration.
MECHANICAL SHOCK
This is an environmental test where the sensor device is
tested to determine its ability to withstand a sudden change
in mechanical stress due to an abrupt change in motion. This
test simulates motion that may be seen in handling,
transportation, or actual use.
Typical Test Conditions: Acceleration = 1500 g's, orientation =X 1, X2, Y 1, Z1, Z2 plane,time =0.5 millisecond, blows
=5.
Potential Failure Modes: Open, parametric shift in offset.
Potential Failure Mechanisms: Diaphragm fracture,
package failure, die and wire bonds.
VARIABLE FREQUENCY VARIATION
A test to examine the ability of the' pressure sensor device
to withstand deterioration due to mechanical resonance.
Typical Test Conditions: Frequency = 100 Hz to 2 kHz,
orientation = X 1, X2, Y 1, Z 1, Z2 plane, time = 48 minutes.
Potential Failure Modes: Open, parametric shift in offset.
Potential Failure Mechanisms: Diaphragm fracture,
package failure, die and wire bonds.
SOLDERABILITY
The purpose of this test is to measure the ability of device
leads/terminals to be soldered after an extended period of
storage (shelf life).
Typical Test Conditions: Steam aging = 8 hours, Flux = R,
Solder = SN60, SN63.
Potential Failure Modes: Pin holes, non-wetling, dewetting.
Potential Failure Mechanisms: Poor plating, contaminated leads.
Typical Test Conditions: Pressure = 6 times rated
pressure, blow = 1, time = 15 seconds.
Potential Failure Modes: Open, parametric shift in offset,
span.
Potential Failure Mechanisms: Die bond, package failure.
SALT ATMOSPHERE
A test to simulate a sea coast condition and the ability of
the pressure sensor's packaging to resist corrosion.
Typical Test Conditions: Rate of salt deposited in the test
area is between 50g/m2/day, temperature = 35°C,time = 24
hours.
Potential Failure Modes: Open, parametric shifts in offset,
span.
Potential Failure Mechanisms: Package failure, corrosion, contamination.
A sufficient sample size manufactured over a pre-defined
time interval to maximize process and time variability is
tested based on the guidelines of the matrix shown above.
This test methodology is employed on all new product
introductions and process changes on current products.
Summary statistics from several recent reliability studies
performed on silicon pressure sensors are shown in Table 2.
A silicon pressure sensor has a typical usage environment
of pressure, temperature, and voltage. Unlike the typical
bipolar transistor life tests which incorporate current density
and temperature to accelerate failures, a silicon pressure
sensor's acceleration of its lifetime performance is primarily
based on the pressure and temperature interaction with a
presence of bias. This rationale was incorporated into the
development of the Pulsed Pressure Temperature Cycling
with Bias (PPTCB) test where the major acceleration factor is
the pressure and temperature component. It is also why
PPTCB is the standard sensor operational life test.
Table 2. Summary Data for Recent Reliability Studies
H3TB
PPTCB
HTB
Cum.
Hrs.
Result
FITs
60%
Cum.
Hrs.
Result
FITs
60%
Cum.
Hrs.
Resu~
FITs
60%
2305
50
0
3975
6300
00
0
1455
134028
0
6838
LTSL
HTSL
TC
Cum.
Hrs.
Result
FITs
60%
Cum.
Hrs.
Result
FITs
60%
Cum.
Hrs.
Resu~
FITs
60%
1113
000
0
823
4170
00
0
2198
123550
0
0
742
MECHSHOCK
VARI. FREQ. VIBR.
SALT ATM.
Cum.
Hrs.
Result
Cum.
Hrs.
Result
Cum.
Hrs.
Result
123
0
122
0
83
0
BACK SIDE BLOWOFF
This test is performed to determine the ability of the
pressure sensor element to withstand excessive pressure in
the sensing environment. The test is performed from the
back side by trying to lift the die from the package due to the
positive pressure being applied.
Quality and Reliability
3-6
To insure that silicon pressure sensors are designed and
manufactured for reliability, an in-depth insight into what
mechanisms cause particular failures is required. It is safe to
say that unless a manufacturer has a clear understanding of
everything that can go wrong with the device, it cannot
Motorola Sensor Device Data
design a device for the highest reliability. Figure 2 provides
a look into the sensor operating concerns for a variety of
potential usage applications. This information is utilized when
developing the Failure Mode and Effects Analysis (FMEA).
The FMEA then serves as the documentation that demonstrates all design and process concerns have been
addressed to offer the most reliable approach. By understanding how to design products, control processes, and
eliminate the concerns raised, a reliable product is achieved.
ACCELERATED LIFE TESTING
It is very difficult to access the reliability statistics for a
product when very few or no failures occur. With cost as a
predominant factor in any industrial setting and time of the
utmost importance, the reliability test must be optimized.
Optimization of reliability testing will allow the maximum
amount of information on the product being tested to be
gained in a minimum amount of time, this is accomplished by
using accelerated life testing techniques.
A key underlying assumption in the usage of accelerated
life testing to estimate the life of a product at a lower or
nominal stress is that the failure mechanism encountered at
the high stress is the same as that encountered at the
nominal stress. The most frequently applied accelerated
environmental stress for semiconductors is temperature, it
will be briefly explained here for its utilization in determining
the lifetime reliability statistics for silicon pressure sensors.
SENSOR RELIABILITY CONCERNS
GEL:
Viscosity
Thermal Coefficient of Expansion
Permeability
Changes in Material or Process
Height
Coverage
Uniformity
Adhesive Properties
Media Compatibility
Gel Aeration
Compressibility
PACKAGE:
Integrity
Plating Quality
Dimensions
Thermal Resistance
Mechanical Resistance
Pressure Resistance
BONDING WIRES:
Strength
Placement
Height and Loop
Size
Material
Bimetallic Contamination
(Kirkendall Voids)
Nicking and other damage
General Quality & Workmanship
LEADS:
Materials and Finish
Plating Integrity
Solderability
General Quality
Strength
Contamination
Corrosion
Adhesion
MARKING:
Permanency
Clarity
DIEATIACH:
Uniformity
Resistance to Mechanical Stress
Resistance to Temperature Stress
Wetting
Adhesive Strength
Process Controls
Die Orientation
Die Height
Change in Material or Process
Media Compatibility
Compressibility
DIE
METALLIZATION:
Lifting or Peeling
Alignment
Scratches
Voids
Laser Trimming
Thickness
Step Coverage
Contact Resistance Integrity
}--~--DIAPHRAGM:
Size
Thickness
Uniformity
Pits
Alignment
Fracture
PASSIVATION:
Thickness
Mechanical Defects
Integrity
Uniformity
ELECTRICAL PERFORMANCE:
Continuity and Shorts
Parametric Stability
Parametric Pertormance
Temperature Performance
Temperature Stability
Long Term Reliability
Storage Degradation
Susceptibility to Radiation Damage
Design Quality
DESIGN CHANGES
MATERIAL OR PROCESS
CHANGES
FAB & ASSEMBLY CLEANLINESS
SURFACE CONTAMINATION
FOREIGN MATERIAL
SCRIBE DEFECTS
DIFFUSION DEFECTS
OXIDE DEFECTS
Figure 10. Process and Product Variability Concerns During Reliability Testing
Motorola Sensor Device Data
Quality and Reliability
3-7
The temperature acceleration factor for a particular failure
mechanism can be related by taking the ratio for the reaction
rate of the two different stress levels as expressed by the
Arrhenius type of equation. The mathematical derivation of
the first order chemical reaction rate computes to:
AF
AF
Where:
AF
RT
t
T
ea
k
LS
HS
=
=
(RT)Hs
(RT)Ls
exp l 15500 volts
The code "N/S" signifies a non-sensitive device. "SEN" are
considered sensitive and should be handled according to
ESD procedures. Of the various products manufactured by
the Communications, Power and Signal Technologies Group,
the following examples list general device families by not
sensitive to extremely sensitive.
LINE
CASE
CLASS
PRODUCT DESCRIPTION
MPX10D
XL0010V1
344-08
3-8EN
Uncompensated
MPX10DP
XL0010V1
352-02
3-SEN
Uncompensated
MPX10GP
XL0010V1
350-02
3-SEN
Uncompensated
MPX10GVP
XL0010V1
350-04
3-SEN
Uncompensated
MPX10GS
XL0010V1
371-06
3-8EN
Uncompensated
MPX10GVS
XL0010V1
371-05
3-8EN
Uncompensated
MPX10GSX
XL0010V1
371C-02
3-8EN
Uncompensated
MPX10GVSX
XL0010V1
371D-02
3-8EN
Uncompensated
MPX12D
XLOO12V1
344-08
3-8EN
Uncompensated
MPX12DP
XL0012V1
352-02
3-SEN
Uncompensated
MPX12GP
XLOO12V1
350-02
3-SEN
Uncompensated
MPX12GVP
XLOO12V1
350-04
3-8EN
Uncompensated
MPX12GS
XLOO12V1
371-06
3-8EN
Uncompensated
MPX12GVS
XLOO12V1
371-05
3-SEN
Uncompensated
MPX12GSX
XL0012V1
371G-02
3-SEN
Uncompensated
MPX12GVSX
XLOO12V1
371D-02
3-SEN
Uncompensated
MPX50D
XL0050V3
344-08
3-8EN
Uncompensated
MPX50DP
XL0050V3
352-02
3-8EN
Uncompensated
MPX50GP
XL0050V3
350-02
3-8 EN
Uncompensated
MPX50GVP
XL0050V3
350-04
3-8 EN
Uncompensated
MPX50GS
XL0050V3
371-06
3-SEN
Uncompensated
MPX50GVS
XL0050V3
371-05
3-SEN
Uncompensated
MPX50GSX
XL0050V3
371G-02
3-8EN
Uncompensated
MPX50GVSX
XL0050V3
3710-02
3-8EN
Uncompensated
MPX100A
XL0100V2
344-08
Uncompensated
Mt-'X1OOAt-'
XLOiOOV2
350-02
3-8 EN
,.. ror-,,,
Quality and Reliability
3-14
.J-vl:=l~
Unccmpensated
Motorola Sensor Device Data
DEVICE
LINE
CASE
CLASS
PRODUCT DESCRIPTION
MPX100AS
XL0100V2
371-06
3-SEN
Uncompensated
MPX100ASX
XL0100V2
371C-02
3-SEN
Uncompensated
MPX1000
XL0100V3
344-08
3-SEN
Uncompensated
MPX1000P
XL0100V3
352-02
3-SEN
Uncompensated
MPX100GP
XL0100V3
350-02
3-SEN
Uncompensated
MPX100GVP
XL0100V3
350-04
3-SEN
Uncompensated
MPX100GS
XL0100V3
371-06
3-SEN
Uncompensated
MPX100GVS
XL0100V3
371-05
3-SEN
Uncompensated
MPX100GSX
XL0100V3
371C-02
3-SEN
Uncompensated
MPX100GVSX
XL0100V3
3710-02
3-SEN
Uncompensated
MPX200A
XL0200V2
344-08
3-SEN
Uncompensated
MPX200AP
XL0200V2
350-02
3-SEN
Uncompensated
MPX200AS
XL0200V2
371-06
3-SEN
Uncompensated
MPX200ASX
XL0200V2
371C-02
3-SEN
Uncompensated
MPX2000
XL0200V3
344-08
3-SEN
Uncompensated
MPX2000P
XL0200V3
352-02
3-SEN
Uncompensated
MPX200GP
XL0200V3
350-02
3-8EN
Uncompensated
MPX200GVP
XL0200V3
350-04
3-8EN
Uncompensated
MPX200GS
XL0200V3
371-06
3-SEN
Uncompensated
MPX200GVS
XL0200V3
371-05
3-SEN
Uncompensated
MPX200GSX
XL0200V3
371C-02
3-SEN
Uncompensated
MPX200GVSX
XL0200V3
3710-02
3-SEN
Uncompensated
MPX700A
XL0700V2
344-08
3-SEN
Uncompensated
MPX700AP
XL0700V2
350--02
3-SEN
Uncompensated
MPX700AS
XL0700V2
371.,.06
3-SEN
Uncompensated
MPX700ASX
XL0700V2
371C-02
3-8EN
Uncompensated
MPX7000
XL0700V1
344-08
3-8 EN
Uncompensated
MPX7000P
XL0700V1
352-02
3-8 EN
Uncompensated
MPX700GP
XL0700V1
350-02
3-8 EN
Uncompensated
MPX700GVP
XL0700V1
350-04
3-8EN
Uncompensated
MPX700GS
XL0700V1
371-06
3-8 EN
Uncompensated
MPX700GVS
XL0700V1
371-05
3-8 EN
Uncompensated
MPX700GSX
XL0700V1
371C-02
3-8EN
Uncompensated
MPX700GVSX
XL0700V1
3710-02
3-8EN
Uncompensated
MPX9060
XL0010M1
867-04
3-SEN
Uncompensated
MPX906GVW
XL0010M1
867H-02
3-SEN
Uncompensated
MPX20100
XL2010V5
344-08
1-SEN
Temperature Compensated/Calibrated
MPX20100P
XL2010V5
352-02
1-SEN
Temperature Compensated/Calibrated
MPX2010GP
XL2010V5
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2010GVP
XL2010V5
350-04
1-SEN
Temperature Compensated/Calibrated
MPX2010GS
XL2010V5
371-06
1-SEN
Temperature Compensated/Calibrated
MPX2010GVS
XL2010V5
371-05
1-SEN
Temperature Compensated/Calibrated
MPX2010GSX
XL2010V5
371C-02
1-SEN
Temperature Compensated/Calibrated
MPX2010GVSX
XL2010V5
3710-02
1-8EN
Temperature Compensated/Calibrated
Motorola Sensor Device Data
Quality and Reliability
3-15
DEVICE
LINE
CASE
CLASS
PRODUCT DESCRIPTION
MPX2050D
XL2050V3
344-08
1-SEN
Temperature Compensated/Calibrated
MPX2050DP
XL2050V3
352-02
1-SEN
Temperature Compensated/Calibrated
MPX2050GP
XL2050V3
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2050GVP
XL2050V3
350-04
1-8EN
Temperature Compensated/Calibrated
MPX2050GS
XL2050V3
371-06
1-8EN
Temperature Compensated/Calibrated
MPX2050GVS
XL2050V3
371-05
1-SEN
Temperature Compensated/Calibrated
MPX2050GSX
XL2050V3
371C-02
1-8EN
Temperature Compensated/Calibrated
MPX2050GVSX
XL2050V3
3710-02
1-SEN
Temperature Compensated/Calibrated
MPX2052D
XL2050V3,V1
344-08
1-SEN
Temperature Compensated/Calibrated
MPX2052DP
XL2050V3,V1
352-02
1-SEN
Temperature Compensated/Calibrated
MPX2052GP
XL2050V3,V1
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2052GVP
XL2050V3,V1
350-04
1-SEN
Temperature Compensated/Calibrated
MPX2052GS
XL2050V3,V1
371-06
1-SEN
Temperature Compensated/Calibrated
MPX2052GVS
XL2050V3,V1
371-05
1-SEN
Temperature Compensated/Calibrated
MPX2052GSX
XL2050V3,V1
371C-02
1-SEN
Temperature Compensated/Calibrated
MPX2052GVSX
XL2050V3,V1
3710-02
1-SEN
Temperature Compensated/Calibrated
MPX2100A
XL2100V2
344-08
1-SEN
Temperature Compensated/Calibrated
MPX2100AP
XL2100V2
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2100AS
XL2100V2
371-06
1-SEN
Temperature Compensated/Calibrated
MPX2100ASX
XL2100V2
371C-02
1-SEN
Temperature Compensated/Calibrated
MPX2100D
XL2100V3
344-08
1-SEN
Temperature Compensated/Calibrated
MPX2100DP
XL2100V3
352-02
1-SEN
Temperature Compensated/Calibrated
MPX2100GP
XL2100V3
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2100GVP
XL2100V3
350-04
1-8EN
Temperature Compensated/Calibrated
MPX2100GS
XL2100V3
371-06
1-SEN
Temperature Compensated/Calibrated
MPX2100GVS
XL2100V3
371-05
1-SEN
Temperature Compensated/Calibrated
MPX2100GSX
XL2100V3
371C-02
1-8EN
Temperature Compensated/Calibrated
MPX2100GVSX
XL2100V3
3710-02
1-SEN
Temperature Compensated/Calibrated
MPX2200A
XL2200V2
344-08
1-8EN
Temperature Compensated/Calibrated
MPX2200AP
XL2200V2
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2200AS
XL2200V2
371-06
1-8EN
Temperature Compensated/Calibrated
MPX2200ASX
XL2200V2
371C-02
1-SEN
Temperature Compensated/Calibrated
MPX22000
XL2200V3
344-08
1-SEN
Temperature Compensated/Calibrated
MPX22000P
XL2200V3
352-02
1-SEN
Temperature Compensated/Calibrated
MPX2200GP
XL2200V3
350-02
1-SEN
Temperature Compensated/Calibrated
MPX2200GVP
XL2200V3
350-04
1-8EN
Temperature Compensated/Calibrated
MPX2200GS
XL2200V3
371-06
1-8EN
Temperature Compensated/Calibrated
MPX2200GVS
XL2200V3
371-05
1-8EN
Temperature Compensated/Calibrated
MPX2200GSX
XL2200V3
371C-02
1-SEN
Temperature Compensated/Calibrated
MPX2200GVSX
XL2200V3
3710-02
1-8EN
Temperature Compensated/Calibrated
MPX2300DT1
XL2300C1,01 C1
423-03
1-SEN
Temperature Compensated/Calibrated
MPX2700D
XL2700V1
344-08
1-SEN
Temperature Compensated/Calibrated
MPX2700DP
XL2700V1
352-02
1-SEN
Temperature Compensated/Calibrated
MPX2700GP
XL2700V1
350-02
1-SEN
Temperature Compensated/Calibrated
Quality and Reliability
3-16
Motorola Sensor Device Data
DEVICE
CASE
LINE
CLASS
PRODUCT DESCRIPTION
MPX2700GVP
XL2700V1
350-04
1-SEN
Temperature Compensated/Calibrated
MPX2700GS
XL2700V1
371-06
1-SEN
Temperature Compensated/Calibrated
MPX2700GVS
XL2700V1
371-05
1-SEN
Temperature Compensated/Calibrated
MPX2700GSX
XL2700V1
371C-02
1-SEN
Temperature Compensated/Calibrated
MPX2700GVSX
XL2700V1
371 D-02
1-SEN
Temperature Compensated/Calibrated
MPX4100A
XL4101S2
867-04
1-SEN
Signal-Conditioned
MPX4100AP
XL4101S2
8676-03
1-SEN
Signal-Conditioned
MPX4100AS
XL4101S2
867E-02
1-SEN
Signal-Conditioned
MPX4100ASX
XL4101S2
867F-02
1-SEN
Signal-Conditioned
MPX4101A
XL4101S2
867-04
1-SEN
Signal-Conditioned
MPX4101AP
XL4101S2
8678-03
1-SEN
Signal-Conditioned
MPX4101AS
XL4101S2
867E-02
1-SEN
Signal-Conditioned
MPX4101ASX
XL4101 S2
867F-02
1-SEN
Signal-Conditioned
MPX4115A
XL4101S2
867-04
1-SEN
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
MPX4115AP
XL4101S2
8678-03
1-SEN
MPX4115AS
XL4101S2
867E-02
1-SEN
MPX4115ASX
XL4101S2
867F-02
1-SEN
Signal-Conditioned
MPX4250A
XL4101S2
867-04
1-SEN
Signal-Conditioned
MPX4250AP
XL4101S2
8678-03
1-SEN
Signal-Conditioned
MPX4250AS
XL4101S2
867E-02
1-SEN
Signal-Conditioned
MPX4250ASX
XL4101S2
867F-02
1-SEN
Signal-Conditioned
MPX5010D
XL4010S5
867-04
1-SEN
Signal-Conditioned
MPX5010DP
XL4010S5
867C-03
1-SEN
Signal-Conditioned
MPX5010GP
XL4010S5
8678-03
1-SEN
Signal-Conditioned
MPX5010GVP
XL4010S5
867D-03
1-SEN
Signal-Conditioned
MPX5010GS
XL4010S5
867E-02
1-SEN
Signal-Conditioned
MPX5010GVS
XL4010S5
867A-03
1-SEN
Signal-Conditioned
MPX5010GSX
XL4010S5
867F-02
1-SEN
Signal-Conditioned
MPX5010GVSX
XL4010S5
867G-02
1-SEN
Signal-Conditioned
MPX5050D
XL4051 S1
867-04
1-SEN
Signal-Conditioned
MPX5050DP
XL4051S1
867C-03
1-SEN
Signal-Conditioned
MPX5050GP
XL4051S1
8678-03
1-SEN
Signal-Conditioned
MPX5050GVP
XL4051 S1
867D-03
1-SEN
Signal-Conditioned
MPX5050GS
XL4051S1
867E-02
1-SEN
Signal-Conditioned
MPX5050GVS
XL4051S1
867A-03
1-SEN
Signal-Conditioned
MPX5050GSX
XL4051S1
867F-02
1-SEN
Signal-Conditioned
MPX5050GVSX
XL4051S1
867G-02
1-SEN
Signal-Conditioned
MPX5100A
XL4101S2
867-04
1-SEN
Signal-Conditioned
MpX5100AP
XL4101S2
8678-03
1-SEN
Signal-Conditioned
MPX5100AS
XL4101S2
867E-02
1-SEN
Signal-Conditioned
MPX5100ASX
XL4101S2
867F-02
1-SEN
Signal-Conditioned
MPX5100D
XL4101S1
867-04
1-SEN
Signal-Conditioned
MPX5100DP
XL4101S1
867C-03
1-SEN
Signal-Conditioned
MPX5100GP
XL4101S1
8678-03
1-SEN
Signal-Conditioned
Motorola Sensor Device Data
Quality and Reliability
3-17
DEVICE
LINE
MPX5100GVP
XL4101S1
MPX5100GS
MPX5100GVS
CASE
CLASS
PRODUCT DESCRIPTION
867D-03
1-SEN
Signal-Conditioned
XL4101S1
867E-02
1-5EN
Signal-Conditioned
XL4101S1
867A-03
1-5EN
Signal-Conditioned
MPX5100GSX
XL4101S1
867F-02
1-5EN
Signal-Conditioned
MPX5100GVSX
XL4101S1
867G-02
1-5EN
Signal-Conditioned
MPX5500D
XL4501S1
867-04
1-5EN
Signal-Conditioned
MPX5500DP
XL4501S1
867C-03
1-5EN
Signal-Conditioned
MPX5500GP
XL4501S1
8678-03
1-5EN
Signal-Conditioned
MPX5500GVP
XL4501S1
867D-03
1-5EN
Signal-Conditioned
MPX5500GS
XL4501S1
867E-02
1-5EN
Signal-Conditioned
MPX5500GVS
XL4501S1
867A-03
1-SEN
Signal-Conditioned
MPX5500GSX
XL4501S1
867F-02
1-5EN
Signal-Conditioned
MPX5500GVSX
XL4501S1
867G-02
1-SEN
Signal-Conditioned
MPX5700D
XL4701S1
867-04
1-SEN
Signal-Conditioned
MPX5700DP
XL4701S1
867C-03
1-SEN
Signal-Conditioned
Signal-Conditioned
MPX5700GP
XL4701S1
8678-03
1-SEN
MPX5700GVP
XL4701S1
867D-03
1-5EN
Signal-Conditioned
MPX5700GS
XL4701S1
867E-02
1-SEN
Signal-Conditioned
MPX5700GVS
XL4701S1
867A-03
1-SEN
Signal-Conditioned
MPX5700GSX
XL4701S1
867F-02
1-SEN
Signal-Conditioned
MPX5700GVSX
XL4701S1
867G-02
1-5EN
Signal-Conditioned
MPX5999D
XL4999S1
867-04
1-SEN
Signal-Conditioned
MPX7050D
XL7050V3
344-08
1-SEN
High Impedance
MPX7050DP
XL7050V3
352-02
1-SEN
High Impedance
MPX7050GP
XL7050V3
350-02
1-5EN
High Impedance
MPX7050GVP
XL7050V3
350-04
1-SEN
High Impedance
MPX7050GS
XL7050V3
371-06
1-5EN
High Impedance
MPX7050GVS
XL7050V3
371-05
1-SEN
High Impedance
MPX7050GSX
XL7050V3
371C-02
1-5EN
High Impedance
MPX7050GVSX
XL7050V3
371D-02
1-SEN
High Impedance
MPX7100A
XL7100V2
344-08
1-5EN
High Impedance
MPX7100AP
XL7100V2
350-02
1-SEN
High Impedance
MPX7100AS
XL7100V2
371-06
1-SEN
High Impedance
MPX7100ASX
XL7100V2
371C-02
1-SEN
High Impedance
MPX7100D
XL7100V3
344-08
1-5EN
High Impedance
MPX7100DP
XL7100V3
352-02
1-5EN
High Impedance
MPX7100GP
XL7100V3
350-02
1-5EN
High Impedance
MPX7100GVP
XL7100V3
350-04
1-5EN
High Impedance
MPX7100GS
XL7100V3
371-06
1-SEN
High Impedance
MPX7100GVS
XL7100V3
371-05
1-5EN
High Impedance
MPX7100GSX
XL7100V3
371C-02
1-SEN
High Impedance
MPX7100GVSX
XL7100V3
371D-02
1-SEN
High Impedance
MPX7200A
XL7200V2
344-08
1-SEN
High Impedance
MPX7200AP
XL7200V2
350-02
1-SEN
High Impedance
Quality and Reliability
3-18
Motorola Sensor Device Data
DEVICE
LINE
MPX7200AS
XL7200V2
MPX7200ASX
XL7200V2
MPX7200D
CASE
CLASS
PRODUCT DESCRIPTION
371-06
1-SEN
High Impedance
371C-02
1-SEN
High Impedance
XL7200V3
344-0B
1-SEN
High Impedance
MPX7200DP
XL7200V3
352-02
1-SEN
High Impedance
MPX7200GP
XL7200V3
350-02
1-SEN
High Impedance
MPX7200GVP
XL7200V3
350-04
1-SEN
High Impedance
MPX7200GS
XL7200V3
371-06
1-SEN
High Impedance
MPX7200GVS
XL7200V3
371-05
1-SEN
High Impedance
MPX7200GSX
XL7200V3
371C-02
1-SEN
High Impedance
MPX7200GVSX
XL7200V3
371D-02
1-SEN
High Impedance
MTS102
XLBOO.1
29-04
1-SEN
Temperature Sensor
MTS103
XLBOO.1
29-04
1-SEN
Temperature Sensor
MTS105
XLBOO.1
29-04
1-SEN
Temperature Sensor
XMMAS40G10D
XL040G
64BC-03
1-SEN
Accelerometer
XMMAS40G10S
XL040GS
447-01
1-SEN
Accelerometer
XMMAS250G10D
XL250G
64BC-03
1-SEN
Accelerometer
XMMAS250G10S
XL250GS
447-01
1-SEN
Accelerometer
XMMAS500G10D
XL500G
64BC-03
1-SEN
Accelerometer
XMMAS500G10S
XL500GS
447-01
1-SEN
Accelerometer
Motorola Sensor Device Data
Quality and Reliability
3-19
Quality and Reliability
3-20
Motorola Sensor Device Data
Section Four
Application Notes
Applications Information . ........................ 4-2
AN935
Compensating for Nonlinearity in the
MPX10 Series Pressure Transducer ..... 4-4
AN936
Mounting Techniques, Lead Forming and
Testing of Motorola's MPX Series
Pressure Sensors .................... 4-11
AN1082 Simple Design for a 4-20 mA Transmitter
Interface Using a Motorola Pressure
Sensor .............................. 4-16
AN1097 Calibration-Free Pressure Sensor
System ............................. 4-19
AN1100 Analog to Digital Converter Resolution
Extension Using a Motorola Pressure
Sensor .............................. 4-24
AN1105 A Digital Pressure Gauge Using the
Motorola MPX700 Series Differential
PressureSensor ..................... 4-27
AN1303 A Simple 4-20 mA Pressure Transducer
Evaluation Board ..................... 4-32
AN1304 Integrated Sensor Simplifies Bar Graph
Pressure Gauge ...................... 4-37
AN1305 An Evaluation System for Direct Interface
of the MPX5100 Pressure Sensor with
a Microprocessor ..................... 4-42
AN1307 A Simple Pressure Regulator Using
Semiconductor Pressure
Transducers ......................... 4-58
AN1309 Compensated Sensor Bar Graph
Pressure Gauge ...................... 4-65
AN1315 An Evaluation System Interfacing the
MPX2000 Series Pressure Sensors
to a Microprocessor .................. 4-72
Motorola Sensor Device Data
AN1316
AN1318
AN1322
AN1324
AN1325
AN1326
AN1513
AN1516
AN1517
AN1518
AN1525
AN1535
AN1536
Frequency Output Conversion for
MPX2000 Series Pressure Sensors .... 4-93
Interfacing Semiconductor Pressure
Sensors to Microcomputers ........... 4-99
Applying Semiconductor Sensors to
Bar Graph Pressure Gauges ......... 4-109
A Simple Sensor Interface Amplifier .... 4-114
Amplifiers for Semiconductor Pressure
Sensors . . . . . . . . . . . . . . . . . . . . . . . . . .. 4-118
Barometric Pressure Measurement
Using Semiconductor Pressure
Sensors ........................... 4-122
Mounting Techniques and Plumbing
Options of Motorola's MPX
Series Pressure Sensors ............. 4-131
Liquid Level Control Using a Motorola
Pressure Sensor ................... 4-135
Pressure Switch Design with
Semiconductor Pressure Sensors ..... 4-140
Using a Pulse Width Modulated
Output with Semiconductor Pressure
Sensors ............................ 4-146
The A-B-C's of Signal-Conditioning
Amplified Design for Sensor
Applications ........................ 4-152
Semiconductor Sensors Provide a Hot
Temperature Sensing Solution at a
Cool Price .......................... 4-159
Digital Boat Speedometers ............ 4-166
4-1
Applications Information
Example Circuits
MPX2000 sensors with on-chip compensation can be used
individually or in multiples in research, design, or development
projects to optimize a design. The small size and low cost of
the compensated MPX2000 series of sensors makes these
devices ideally suited for such applications.
Many process control functions can also be served by
MPX2000 sensors handling pressure ranges up to 30 PSI in
gauge, vacuum and differential measurements. Wind tunnel
measurements, vacuum forming or vacuum pickup
monitoring are among the many potential applications.
Several specific applications examples are shown on the
following pages. These are offered as basic suggestions
only; actual component selection and values are
determined by the final circuit requirements.
Fluid Pressure
Circuit
Fluid pressure transducer circuit with inverted output. In this configuration, the circuit
provides a 4 Vdc output with zero pressure
applied, decreasing to 0 Vdc at full rated pressure. An ideal circuit for any type of liquid level
monitoring.
100kn
0.1
444Q
OP AMP IS: LM358
• TRIM TO 4.0 VOUT
WITH 0 PRESSURE IN. (= 100 k)
Fluid Pressure Circuit
t10Vdc
Simple Pressure
Sensor Amplifier
OUT
Q-4 Vdc
A single op-amp circuit which gives a 4 volt
dc output for full-scale pressure input. The circuit is ratiometric, giving 2 Vdc out with a 5 volt
supply. A good, low-cost general-purpose circuit for those applications where ±3% performance is acceptable, it can also be trimmed to
provide ±1.5% accuracy over the 0-85°C temperature range. Multi-turn potentiometers are
suggested for Roff and Rspan.
4-2
Simple Pressure Sensor Amplifier
Motorola Sensor Device Data
Example Circuits (continued)
Portable
Manometer
A DVM circuit used for portable equipment
such as manometers and barometers. Precision performance is achievable using a highgrade instrumentation amplifier and
substituting a precision regulator forthe zener.
r
9.0V
(6.0 rnA)
150n
DVM
0-7.5
199.9rnV
4
1.5.
PSI
R= 114 W. 5% METAL FILM
Portable Manometer
Solid State
Pressure Switch
A low-cost, set-point pressure switch for 115 Vac
motor control applications. This circuit has
I
been used successfully to control compressor
I
and pump motors, as well as heaters in liquid
L - T1 - J
level applications.
MPX2200GP
0-30 PSI
Solid State Pressure Switch
+5Vdc
Microprocessor
Interface Circuit
High level input for an AJD converter. This
circuit offers moderate performance with typical
logic supply. Improved performance over
temperature is possible using metal-film
resistors and an LM158 op-amp. Maximum
output is approximately 4.5 Vdc referenced to
ground.
OUT
22 M
2.2M
1.0k
20 k
-=
GAIN
OFFSET
(OPTIONAL)
Microprocessor Interface Circuit
Motorola Sensor Device Data
4-3
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN935
Compensating for Nonlinearity in the MPX10
Series Pressure Transducer
Prepared by: Carl Demington
Design Engineering
INTRODUCTION
This application note describes a technique to improve the
linearity of Motorola's MPX10 series (i.e., MPX10, MPX11,
and MPX12 pressure sensors) pressure transducers when
they are interfaced to a microprocessor system. The
linearization technique allows the user to obtain both high
sensitivity and good linearity in a cost effective system.
The MPX1 0, MPX11 and MPX12 pressure transducers are
semiconductor devices which give an electrical output signal
proportional to the applied pressure over the pressure range
of 0-10 kPa (0-75 mm Hg). These devices use a unique
transverse voltage-diffused silicon strain-gauge which is
sensitive to stress produced by pressure applied to a thin
silicon diaphragm.
One of the primary considerations when using a pressure
transducer is the linearity of the transfer function, since this
parameter has a direct effect on the total accuracy of the
system, and compensating for nonlinearities with peripheral
circuits is extremely complicated and expensive. The purpose
of this document is to outline the causes of nonlinearity, the
trade-offs that can be made for increased system accuracy,
and a relatively simple technique that can be utilized to
maintain system performance, as well as system accuracy.
ORIGINS OF NONLINEARITY
Nonlinearity in semiconductor strain-gauges is a topic that
has been the target of many experiments and much
discussion. Parameters such as resistor size and orientation,
surface impurity levels, oxide passivation thickness and
growth temperatures, diaphragm size and thickness are all
contributors to nonlinear behavior in silicon pressure
transducers. The Motorola X-ducer was designed to minimize
these effects. This goal was certainly accomplished in the
MPX50, MPX1 00 and MPX200 series which have a maximum
nonlinearity of 0.1% FS. However, to obtain the higher
sensitivity of the MPX10 series, a maximum nonlinearity of
±1 % FS has to be allowed. The primary cause of the additional
nonlinearity in the MPX10 series is due to the stress induced
in the diaphragm by applied pressure being no longer linear.
One of the basic assumptions in using semiconductor
strain-gauges as pressure sensors is that the deflection of the
diaphragm when pressure is applied is small compared to the
thickness of the diaphragm. With devices that are very
sensitive in the low pressure ranges, this assumption is no
longer valid. The deflection olthe diaphragm is a considerable
percentage of the diaphragm thickness, especially in devices
with higher sensitivities (thinner diaphragms). The resulting
stresses do not vary linearly with applied pressure. This
behavior can be reduced somewhat by increasing the area of
the diaphragm and consequently thickening the diaphragm.
Due to the constraint, the device is required to have high
sensitivity over a fairly small pressure range, and the
nonlinearity cannot be eliminated. Much care was given in the
design of the MPX10 series to minimize the nonlinear
behavior. However, for systems which require greater
accuracy, external techniques must be used to accountforthis
behavior.
PERFORMANCE OF AN MPX DEVICE
The output versus pressure of a typical MPX12 along with
an end-point straight line is shown in Figure 1. All nonlinearity
errors are referenced to the end-point straight line (see data
sheet). Notice there is an appreciable deviation from the
end-point straight line at midscale pressure. This shape of
curve is consistent with MPX10and MPX11, as well as MPX12
devices, with the differences between the parts being the
magnitude of the deviation from the end-point line. The major
tradeoff that can be made in the total device performance is
sensitivity versus linearity.
Figure 2 shows the relationship between full scale span and
nonlinearity error for the MPX10 series of devices. The data
shows the primary contribution to nonlinearity is
non proportional stress with pressure, while assembly and
packaging stress (scatter of the data about the line) is fairly
small and well controlled. It can be seen that relatively good
accuracies «0.5% FS) can be achieved at the expense of
reduced sensitivity, and for high sensitivity the nonlinearity
errors increase rapidly. The data shown in Figure 2 was taken
at room temperature with a constant voltage excitation of
3.0 volts.
REV1
4-4
Motorola Sensor Device Data
AN935
90
80
:;-
~~
70
60
.§.
50
~
=> 40
>0
~
30
",
20
10
20
~
30
~
40
~ 'P'
."....
0
In
50
60
70
80
0.5
0.4
0.3 0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
20
BO = 0.1045 - 0.00295·(SPAN)
~
PRESSURE (torr)
fil
u..
~
1%
indicate this technique was not as successful as desired.
4-5
AN935
NO. OF UNITS
%
21.54
LINEARITY ERROR (% FS)
30
19.38
27
24
17.23
General Fit
P = 1/4 FS
Average Error =0.15
Standard Deviation = 0.212
21
15.08
18
12.92
15
10.77
12
8.62
9.0
6.46
6.0
4.31
Figure 6. Linearity Error of General Fit Equation at 1/4 FS
NO. OF UNITS
-
LINEARITY ERROR (% FS)
21 t-
18 15 -
General Fit
P =1/2 FS
Average Error =-0.02
Standard Deviation =0.391
-
6.0
"-
16.15
-
14.54
-
12.92
-11.31
-
12 -
9.0
%
9.69
-8.08
-
6.46
-
4.85
-
3.23
3.0 t-
Figure 7. Linearity Error of General Fit Equation at 1/2 FS
4-6
Motorola Sensor Device Data
AN935
NO. OF UNITS
LINEARITY ERROR (% FS)
%
12.31
16.5
11.08
15
13.5
12
9.85
General Fi1
P = 3/4 FS
Average Error = -0.1 0
Standard Deviation =0.549
8.62
10.5
7.38
9.0
6.15
7.5
4.92
6.0
3.69
4.5
2.46
3.0
1.23
1.5
0:92''-;.0:-'-:~-T;:~7--:!-::-~;-L-;;-';;-'~...1...-;!~-;!-;c-Lt;:-1-;;';;-'+'"",--;;Lz-L-;!-;C-~::-L-f::-''+:''''''''Y-+::--'-;!2.0
Figure 8, Linearity Error of General Fit Equation at 3/4 FS
NO. OF UNITS
19.5
LINEARITY ERROR (% FS)
12.46
18
16.5
15
13.5
12
%
13.85
11.08
General Fit
P = 1 FS
Average Error = 0.11
Standard Deviation =0.809
10.5
9.69
8.31
6.92
9.0
5.54
7.5
4,15
6.0
4.5
2.77
Figure 9. Linearity Error of General Fit Equation'at FS
Motorola Sensor Device Data
4-7
AN935
A second technique that still uses a single pressure
measurement as the input was investigated. In this method,
the sensitivity coefficients are calculated using a piece-wise
linearization technique where the total span variation is
divided into four windows of 10 mV (i.e., 30-39.99, 40-49.99,
etc.) and coefficients calculated for each window. The errors
that arise out of using this method are shown in Figures 10
through 13. This method results in a large majority of the
devices having errors <0.5%, while only one of the devices
was> 1%. The sensitivity coefficients that are substituted into
equation [2] for the different techniques are given in Table 1.
It is important to note that for either technique the only
measurement that is required by the user in order to clearly
determine the sensitivity coefficients is the determination of
the full scale span of the particular pressure transducer.
NO. OF UNITS
LINEARITY ERROR (% FS)
33.92
48
42
30.15
General Fit
P=1f4FS
36
%
37.69
26.38
Average Error = 0.18
Standard Deviation = 0.159
22.62
30
18.85
24
15.08
18
11.31
12
7.54
6.0
3.77
0:92.0 -1.8
Figure 10. Linearity Error of Piece-Wise Linear Fit at 1/4 FS
Table 1. Comparison of Linearization Methods
SPAN WINDOW
BO
B1
B2
GENERAL FIT
0.1045 + 2.95E - 3X
0.2055 + 1.598E - 3X + 1.723E - 4X2
1.293E - 13X5.681
PIECE-WISE LINEAR FIT
30-39.99
0.08209 - 2.246E - 3X
40-49.99
0.1803 - 4.67E - 3X
-0.119+ 1.655E-2X
0.1055 - 3.051E - 3X
-0.355 + 2.126E - 2X
-5.0813 - 3 + 1.116E - 4X
-0.361 + 2.145E - 2X
-5.928E - 3 + 1.259E - 4X
50-59.99
60-69.99
-0.288 + 3.473E - 3X
0.02433 = 1.430E - 2X
-1.961E -4 + 8.816E - 6X
-1.572E - 3 + 4.247E - 5X
x = Full Scale Span
4-8
Motorola Sensor Device Data
AN935
%
20
NO. OF UNITS
LINEARITY ERROR (% FS)
27
18
24
16
General Fit
P = 112 FS
Average Error = 0.02
Standard Deviation = 0.267
21
18
14
12
15
10
12
8.0
9.0
6.0
6.0
4.0
2.0
2.0
Figure 11. Linearity Error of Piece-Wise Linear Fit at 1/2 FS
NO. OF UNITS
%
-16.15
LINEARITY ERROR (% FS)
21-
-14.54
-12.92
t8-
General Fit
P=3/4FS
Average Error =-0.09
Standard Deviation = 0.257
15 r-
-11.31
- 9.69
12C-
- 8.08
9.0 f-
--- 6.46
--- 4.85
6.0 f-
3.0 -
I
I
I
I
n
I
-3.23
rr
0:!l2.0 -1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2
nIn
0.4
0.6 0.8
I
1.0 1.2
I
I
1.4 1.6
I 1.8
1.62
2.0
Figure 12. Linearity Error of Piece-Wise Linear Fit at 3/4 PS
Motorola Sensor Device Data
4-9
AN935
%
NO. OF UNITS
- 38.46
LINEARITY ERROR (% FS)
52.5 r-
- 34.62
45 I-
37.5 -
- 3 0.77
General Fit
P= t FS
Average Error = 0.13
Standard Deviation = 0.186
- 26.92
- 23.08
30 -1 9.23
22.5
-
-1 5.38
-1 1.54
15 r-
-
7.69
-
3.85
7.5 rf-
0~2.0
I
I
I
I
I
~ I
I ~
-1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0
0.2
0.4
I
0.6
I
0.8
I
1.0
I
1.2
I
1.4
I
1.6
I
1.8
2.0
Figure 13. Linearity Error of Piece-Wise Linear Fit at FS
Once the sensitivity coefficients have been determined, a
system can then be built that provides an accurate output
function with pressure. The system shown in Figure 14
consists of a pressure transducer, a temperature
compensation and amplification stage, an AID converter, a
microprocessor, and a display. The display block can be
replaced with a control function if required. Further details on
the temperature compensation and amplification block may
be obtained by consulting Application Note AN840. The AID
converter simply transforms the voltage signal to an input
signal for the microprocessor, in which resides the look-up
table of the transfer function generated from the previously
determined sensitivity coefficients. The microprocessor can
then drive a display or control circuit using standard
techniques.
TEMPERATURE
COMPENSATION
AND AMPLIFICATION
Figure 14. Linearization System Block Diagram
SUMMARY
While at first glance this technique appears to be fairly
complicated, it can be a very cost effective method of building
a high-accuracy, high-sensitivity pressure-monitoring
system for low-pressure ranges.
4-10
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN936
Mounting Techniques, Lead Forming and
Testing of Motorola's MPX Series Pressure Sensors
Prepared by: Randy Frank
Motorola Inc., Semiconductor Products Sector
Phoenix, Arizona
INTRODUCTION
Motorola's MPX series pressure sensors are silicon
piezoresistive strain-gauges offered in a chip-carrier
package (see Figure 1). The exclusive chip-carrier package
was developed to realize the advantages of high-speed,
automated assembly and testing. In addition to high volume
availability and low cost, the chip-carrier package offers users
a number of packaging options. This Application Note
describes several mounting techniques. offers lead forming
recommendations, and suggests means of testing the MPX
series of pressure sensors.
DIFFERENTIAL
PORT OPTION
CASE 352-02
Figure 1. MPX Pressure Sensor In Chip Carrier
Package Shown with Port Options
BASIC ELEMENT
CASE 344
SUFFIX AID
AXIAL VACUUM PORT
CASE 3710
SUFFIX GVSX
GAGE PORT
CASE 350-03
SUFFIX AP/GP
GAGE VACUUM PORT
CASE 350-04
SUFFIX GVP
STOVEPIPE PORT STOVEPIPE VACUUM PORT
CASE 371-05
CASE 371-06
SUFFIX AS/GS
SUFFIXGVS
DUAL PORT
CASE 867C
SUFFIX DP
AXIAL PORT
CASE 867F
SUFFIX ASX/GSX
DUAL PORT
CASE 352
SUFFIX DP
BASIC ELEMENT
CASE 867
SUFFIX AID
AXIAL VACUUM PORT
CASE 867G
SUFFIX GVSX
AXIAL PORT
CASE 371C
SUFFIX ASX/GSX
GAGE PORT
CASE 8678
SUFFIX AP I GP
STOVEPIPE PORT
CASE 867E
SUFFIX AS/GS
GAGE VACUUM PORT
CASE 867D
SUFFIX GVP
STOVEPIPE VACUUM
PORT
CASE 867A
SUFFIX GVS
Figure 2. Chip Carrier and Available Ported Packages
Motorola Sensor Device Data
4-11
AN936
PORT ADAPTERS
rated pressure applied to the port nozzle and checking for air
bubbles will provide a good indication.
Available Packages
Motorola's chip--carrier package and available ports for
attachment of 1/8" 1.0. hose are made from a high
temperature thermoplastic that can withstand temperature
extremes from -50 to 150°C (see Figure 2). The port adapters
were designed for rivet or 5/32" screw attachment to panels,
printed circuit boards or chassis mounting.
Custom Port Adaptor Installation Techniques
The Motorola MPX silicon pressure sensor is available in a
basic chip carrier cell which is adaptable for attachment to
customer specific housings/ports (Case 344 for 4-pin devices
and Case 867 for 6-pin devices). The basic cell has
chamfered shoulders on both sides which will accept an
O-ring such as Parker Seal's silicone O-ring
(p/n#2--Q15-S-469-40).
Refer to Figure 3 for the
recommended O-ring to sensor cell interface dimensions.
The sensor cell may also be glued directly to a custom
housing or port using many commercial grade epoxies or RTV
adhesives which adhere to grade Valox 420, 30% glass
reinforced polyester resin plastic or Union Carbide's Udel®
polysulfone (MPX2040D only). Motorola recommends using
Thermoset EP530 epoxy or an equivalent. The epoxy should
be dispensed in a continuous bead around the cell-to-port
interface shoulder. Refer to Figure 4. Care must be taken to
avoid gaps or voids in the adhesive bead to help ensure that
a complete seal is made when the cell is joined to the port. The
recommended cure conditions for Thermoset EP539 are 15
minutes at 150°C. After cure, a simple test for gross leaks
should be performed to ensure the integrity of the cell to port
bond. Submerging the device in water for 5 seconds with full
.114
!
--+---.075
II.--+-- .037R
'-='--1-0
CELL
---....I
Figure 3. Examples of Motorola Sensors
in Custom Housings
4-12
Pressure Connection
Testing of pressure sensing elements in the chip carrier
package can be performed easily by using a clamping fixture
which has an O-ring seal to attach to the beveled surface.
Figure 8 shows a diagram of the fixture that Motorola uses to
apply pressure or vacuum to unported elements.
When performing tests on packages with ports, a high
durometertubing is necessary to minimize leaks, especially in
higher pressure range sensors. Removal of tubing must be
parallel to the port since large forces can be generated to the
pressure port which can break the nozzle if applied at an
angle. Whether sensors are tested with or without ports, care
must be exercised so that force is not applied to the back metal
cap or offset errors can result.
Standard Port Attach Connection
Motorola also offers standard port options designed to
accept readily available silicone, vinyl, nylon or polyethylene
tubing for the pressure connection. The inside dimension of
the tubing selected should provide a snug fit over the port
nozzle. Dimensions of the ports may be found in the case
outline drawings found in section six. Installation and removal
of tubing from the port nozzle must be parallel to the nozzle to
avoid undue stress which may break the nozzle from the port
base. Whether sensors are used with Motorola's standard
ports or customer specific housings, care must be taken to
ensure that force is uniformly distributed to the package or
offset errors may be induced .
.047
- - I - - - \ - - .125
1
TESTING MPX SERIES PRESSURE SENSORS
~-
~
~
ADHESIVE BEAD
~
Figure 4. Port Adapter Dimensions
Motorola Sensor Device Data
AN936
~
121 = DIAMETER
DIMENSIONS IN INCHES
~12I
0.400
3.96 121
0.156
1.6.N 121
0.639
_.LrUL
!
0.063
[~3tO±20
.6.1L I2I I-Hpo.36(0.014)@IAI B@ I c@1
0.250
~12I
0.156
2 PL
13.66
13.51- /1010.36(0.014) IAIBlcl
0.538 ZONE -D- WITHIN
0.532
ZONE-O-
2.21
2.1L
SECTION F F 0.087
- 0.084
Figure 5. Port Adapter Dimensions
PIN 1
1$10.136(0.005)@ITI A @I
NOTES.
1. DIMENSIONING AND TOLERANCING PER ANSI
YI4.SM.19B2.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
J
L
M
N
R
INCHES
MIN
MAX
0590
0615
0525
0505
0.195
0225
0016
0020
0048
0052
0.100BSC
0.014
0016
0715
0685
30 0 NOM
0.480
0.500
0420
0450
STYLE l'
PIN 1. GROUND
2 + OUTPUT
3. + SUPPLY
4. -OUTPUT
MILLIMETERS
MIN
MAX
1499
1562
12.83
13.34
495
572
0.41
0.51
122
132
2.54BSC
0.36
040
1740
1816
30 0 NOM
1219
1270
1067
1143
(
BODOM CLAMP AREA
)!I!]
~
Leads should be securely clamped lop and
bottom in the area between the plastic body
and the form being sure that no stress is being
put on plastic body. The area between dotted
lines represents surtaces to be clamped.
CASE 344-08
All seals to be made on pressure sealing surface.
Figure 6. Chip-Carrier Package
Motorola Sensor Device Data
Figure 7. Leadforming
4-13
AN936
Electrical Connection
The MPX series pressure sensor is designed to be installed
on a printed circuit board (standard 0.100" lead spacing) or to
accept an appropriate connector if installed on a baseplate.
The leads of the sensor may be formed at right angles for
assembly to the circuit board, but one must ensure that proper
leadform tech"iques and tools are employed. Hand or
"needlenose" pliers should never be used for leadforming
unless they are specifically designed for that purpose.
Industrial leadform tooling is available from various
companies including Janesville Tool & Manufacturing
(608-868-4925). Refer to Figure 7 for the recommended
leadform technique. It is also importantthat once the leads are
formed, they should not be straightened and reformed without
expecting reduced durability. The recommended connector
for off-circuit board applications may be supplied by JST
Corp. (1-800-292-4243) in Mount Prospect, IL. The part
numbers for the housing and pins are listed below.
CONCLUSION
Motorola's MPX series pressure sensors in the chip carrier
package provide the design engineer several packaging
alternatives. They can easily be tested with or without
pressure ports using the information provided.
CONNECTORS FOR CHIP CARRIER PACKAGES
MFG.lADDRESS/PHONE
CONNECTOR
PIN
J.S. Terminal Corp.
1200 Business Center Dr.
Mount Prospect, IL 60056
(800) 292-4243
4 Pin Housing: SMP-04V-BC
6 Pin Housing: SMP-06V-BC
SHF-001T-o.8SS
SHF-01T-o.8SS
Methode Electronics, Inc.
Rolling Meadows, IL 60008
(312) 392-3500
1300-004
Hand crimper YC-12 recommended
Requires hand crimper
1400-213
1402-213
1402-214 Reel
TERMINAL BLOCKS
4-14
Molex
2222 Wellington Court
Lisle, IL 60532
(312) 969-4550
22-18-2043
22-16-2041
Samtec
P.O. Box 1147
New Albany, IN 47150
(812) 944-6733
SSW-104-02-G-S-RA
SSW-104-Q2-G-S
Motorola Sensor Device Data
AN936
0.01 x 45°
4 PL
For Vacuum
-A-
--t . 0.648
--~f
=-1
0.44 Dla.
±O.OOO
0.311 -0.001
-
0D~~~
.
0.780 Dla.
.
±0.002
I0.57~ Dia·1
0.670 Dia.
-::~~
ForO-Ring
(Parker Seals
2-o1S-S469-40)
1+------1.25 Ref
---+----1
Figure 8. O-Ring Test Fixture
Motorola Sensor Device Data
4-15
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1082
Simple Design for a 4-20 mA Transmitter
Interface Using a Motorola Pressure Sensor
Prepared by: Jean Claude Hamelain
Motorola Toulouse Application Lab Manager
INTRODUCTION
Pressure is a very important parameter in most industrial
applications such as air conditioning, liquid level sensing and
flow control.
In most cases, the sensor is located close to the measured
source in a very noisy environment, far away from the receiver
(recorder, computer, automatic controller, etc.)
The transmission line can be as long as a few hundred
meters and is subject to electromagnetic noise when the
signal is transmitted as voltage. If the signal is transmitted as
a current it is easier to recover at the receiving end and is less
affected by the length of the transmission line.
The purpose of this note is to describe a simple circuit which
can achieve high performance, using standard Motorola
pressure sensors, operational amplifiers and discrete
devices.
PERFORMANCES
The following performances have been achieved using an
MPX2100DP Motorola pressure sensor and an MC33079
quad operational amplifier. The MPX2100DP is a 100 kPa
temperature compensated differential pressure sensor. The
load is a 150 ohm resistor at the end of a 50 meter telephone
line. The 15 volt power supply is connected at the receiver
end.
Power Supply
+15 Vdc, 30 mA
Connecting Line
3 wire telephone cable
Load Resistance
150 to 400 Ohms
Temperature Range
-40 to +85°C (up to +125°C
with special hardware)
Pressure Range
o to 100 kPa
Total Maximum Error
Better than 2% full scale
Basic Circuit
The Motorola MPX2100DP pressure sensor is a very high
performance piezoresistive pressure sensor. Manufacturing
technologies include standard bipolar processing techniques
with state of the art metallization and on-chip laser trim for
offset and temperature compensation.
This unique design, coupled with computer laser trimming,
gives this device excellent performance at competitive cost
for demanding applications such as automotive, industrial or
medical.
4-16
MC33078, 79 operational amplifiers are specially designed
for very low input voltage, a high output voltage swing and very
good stability versus temperature changes.
First Stage
The Motorola MPX2100 and the operational amplifier are
directly powered by the 15 Vdc source. The first stage is a
simple true differential amplifier made with both of the
operational amplifiers in the MC33078. The potentiometer,
RG, provides adjustment for the output.
This first stage is available as a pressure sensor kit, SEK-1
(refer to EB130/D). If using the kit, the resistors must be
changed according to the schematic below to provide a full
4-20 mA output.
Current Generator
The voltage to current conversion is made with a unity gain
differential amplifier, one of the four operational amplifiers in
an MC33079. The two output connections from the first stage
are connected to the input ofthis amplifier through R3 and R5.
Good linearity is achieved by the matching between R3, R4,
R5 and R6, providing a good common mode rejection. Forthe
same reason, a good match between resistors R8 and R9 is
needed.
The MC33078 or MC33079 has a limited current output;
therefore, a 2N2222 general purpose transistor is connected
as the actual output current source to provide a 20 mA output.
To achieve good performance with a very long transmission
line it may be necessary to place some capaCitors (C1, C2)
between the power supply and output to prevent oscillations.
Calibration
The circuit is electrically connected to the 15 Vdc power
supply and to the load resistor (receiver).
The high pressure is connected to the pressure port and the
low pressure (if using a differential pressure sensor), is
connected to the vacuum port.
It is important to perform the calibration with the actual
transmission line connected.
The circuit needs only two adjustments to achieve the
4-20 mA output current.
1. With no pressure (zero differential pressure), adjust Roff
to read exactly 4 mA on the receiver.
2. Under the full scale pressure, adjust RG to exactly read
20 mA on the receiver. The calibration is now complete.
Motorola Sensor Device Data
AN1082
VCC = +15 Volts dc
I
I
I
I
I
I
I
I
I
L
II
II
II
II
I
I
L.......IV'~f'v-AN\r-------r-----.l1
RIO
Rll
~---~~~~
R12
OFFSET ADJUST
Basic Circuit of SEK-l
(See EB130)
RG = 47 K Pot. R7 = 1 K
Roff=IMPot. Rl0=110K
'Rl =R2=330KR11 =1 M
'R3=R4=27K R12=330K
'R5=R6=27K Cl =C2= 0.1 !iF
'RB = R9 = 150 aI, a2, a3 = 1/4 MC33079
, All resistor pairs must be matched at better than 0.5%
-~
Additional Circuit for 4 to 20 mA current loop
(Receiver Load Resistance: RL = 150 to 400 Ohms)
Note A: If using SEK-l aI, a2, a3 = 1/2 MC33078
RG from 20 Kto 47 K
Rl and R2 from 1Mto 330 K
NOTICE: THE PRESSURE SENSOR OUTPUT IS RATIOMETRIC TO THE POWER SUPPLY
VOLTAGE. THE OUTPUT WILL CHANGE WITH THE SAME RATIO AS VOLTAGE CHANGE.
Figure 1. Demo Kit with 4-20 mA Current Loop
The output is ratiometric to the power supply voltage. For
example, if the receiver reads 18 mA at 80 kPa and 15 V power
supply, the receiver should read 16.8 mA under the same
pressure with 14 V power supply.
For best results it is mandatory to use a regulated power
supply. If that is not possible, the circuit must be modified by
inserting a 12 V regulator to provide a constant supply to the
pressure sensor.
When using a Motorola MC78L12AC voltage regulator, the
circuit can be used with power voltage variation from 14 to
30 volts.
The following results have been achieved using an
Motorola Sensor Device Data
MPX21 OODP and two MC33078s. The resistors were regular
carbon resistors, but pairs were matched at ± 0.3% and
capacitors were 0.1 /!F. The load was 150 ohms and the
transmission line was a two pair telephone line with the
+ 15 Vdc power supply connected on the remote receiver
side.
Note: Best performances in temperature can be achieved
using metal film resistors. The two potentiometers must be
chosen for high temperatures up to 125°C.
The complete circuit with pressure sensor is available
under reference TZA120 and can be ordered as a regular
Motorola product for evaluation.
4-17
AN1082
22
21
"
//
20
~ V'/
19
~/
18
~ :/"
17
~p
16
~V
~~
15
"-
I-
14
12
..Q
11
Q.
~
~V
13
::>
... ~
~
10
~~
~
A~
~
dlff!?'
I.
~
Power supply + 15 V dc, 150 Ohm load
o 0°
+25°
....
85°
I
20
I
I
40
40 0
I
I
I
60
80
100
PRESSURE (kPa)
Figure 2. Output versus Pressure
2.0
1.5
1.0
.5
~
eo:
-
0
0:
0:
w
-.5
~
~
~
V
~
~ I--
--------
--
----.
I--
I--
----
~
~
-2.0
-----
-.....
1---
- r-----o-- r--1-0-
t--o--- f.o.
-1.0
-1.5
-
I
I·
~
Reference algorithm lo(mA) =4 + 16 x P(kPa)
85°
o
+25°
I
I
20
I
....
0°
_40 0
I
40
60
80
100
PRESSURE (kPa)
Reference algorithm is the straight from output at 255 0 pressure and output at full pressure
Figure 3. Absolute Error Reference to Algorithm
4-18
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1097
Calibration-Free Pressure Sensor System
Prepared by: Michel Burri, Senior System Engineer
Geneva, Switzerland
INTRODUCTION
The MPX2000 series pressure transducers are
semiconductor devices which give an electrical output signal
proportional to the applied pressure. The sensors are a single
monolithic silicon diaphragm with strain gauge and thin-film
resistor networks on the chip. Each chip is laser trimmed for
full scale output, offset, and temperature compensation.
The purpose of this document is to describe another method
of measurement which should facilitate the life of the designer.
The MPX2000 series sensors are available both as unported
elements and as ported assemblies suitable for pressure,
vacuum and differential pressure measurements in the range
of 10 kPa through 200 kPa.
The use of the on-chip AID converter of Motorola's
MC68HC05B6 HCMOS MCU makes possible the design of
an accurate and reliable pressure measurement system.
SYSTEM ANALYSIS
The measurement system is made up of the pressure
sensor, the amplifiers, and the MCU. Each element in the
chain has its own device-to-device variations and
temperature effects which should be analyzed separately. For
instance, the 8-bit AID converter has a quantization error of
about ±0.2%. This error should be subtracted from the
maximum error specified for the system to find the available
errorforthe rest of elements in the chain. The MPX2000 series
pressure sensors are designed to provide an output sensitivity
of 4.0 mVN excitation voltage with full-scale pressure applied
or 20 mV at the excitation voltage of 5.0 Vdc.
An interesting property must be considered to define the
configuration of the system: the ratiometric function of both the
AID converter and the pressure sensor device. The
ratiometric function of these elements makes all voltage
variations from the power supply rejected by the system. With
this advantage, it is possible to design a chain of amplification
where the signal is conditioned in a different way.
Motorola Sensor Device Data
You!
PIN4
_
THERMISTOR
~
LASER
TRIMMED
ON-CHIP
=
GND
Figure 1. Seven Laser-Trimmed Resistors and Two
Thermistors Calibrate the Sensor for Offset, Span,
Symmetry and Temperature Compensation
The op amp configuration should have a good
common-mode rejection ratio to cancel the DC component
voltage of the pressure sensor element which is about half the
excitation voltage value VS. Also, the op amp configuration is
important when the designer's objective is to minimize the
calibration procedures which cost time and money and often
don't allow the unit-to-unit replacement of devices or modules.
One other aspect is that most of the applications are not
affected by inaccuracy in the region 0 kPa thru 40 kPa.
Therefore. the goal is to obtain an acceptable tolerance of the
system from 40 kPa through 100 kPa, thus minimizing the
inherent offset voltage of the pressure sensor.
4-19
AN1097
PRESSURE SENSOR CHARACTERISTICS
OP AMP CHARACTERISTICS
Figure 2 shows the differential output voltage of the
MPX2100 series at +25°C. The dispersion of the output
voltage determines the best tolerance that the system may
achieve without undertaking a calibration procedure, if any
other elements or parameters in the chain do not introduce
additional errors.
For systems with only one power supply, the instrument
amplifier configuration shown in Figure 4 is a good solution to
monitor the output of a resistive transducer bridge.
The instrument amplifier does provide an excellent CMRR
and a symmetrical buffered high input impedance at both
non-inverting and inverting terminals. It minimizes the
number of the external passive components used to set the
gain of the amplifier. Also, it is easy to compensate the
temperature variation of the Full Scale Output of the Pressure
Sensor by implementing resistors "R!" having a negative
coefficient temperature of -250 PPM/oC.
The differential-mode voltage gain of the instrument
amplifier is:
VoudmV)
20
I
VS= 5 Vdc
TA = 25°C --+---+-~:.."'J,.c....--I
Avd = V1-V2 = (1 + 2 Rf)
Vs2-Vs4
Rg
(1)
r-------------------~~---------+Vs
20
40
60
80
100
P
(kPa)
'>-------~V1
Figure 2. Spread of the Output Voltage versus the
Applied Pressure at 25°C
The effects of temperature on the full scale output and offset
are shown in Figure 3. It is interesting to notice that the offset
variation is greater than the full scale output and both have a
positive temperature coefficient respectively of +8.0
IlV/degree and +5.0 IlV excitation voltage. That means that
the full scale variation may be compensated by modifying the
gain somewhere in the chain amplifier by components
arranged to produce a negative TC of 250 PPM/oC. The dark
area of Figure 3 shows the trend of the compensation which
improves the full scale value over the temperature range. In
the area of 40 kPa, the compensation acts in the ratio of
40/100 of the value of the offset temperature coefficient.
POSITIVE
FULL SCALE
VARIATION
Rg
">----'--~
V2
L-------~-----OV
Figure 4. One Power Supply to Excite the Bridge
and to Develop a Differential Output Voltage
The major source of errors introduced by the op amp is
offset voltages which may be positive or negative, and the
input bias current which develops a drop voltage AV through
the feedback resistance Rf. When the op amp input is
composed of PNP transistors, the whole characteristic of the
transfer function is shifted below the DC component voltage
value set by the Pressure Sensor as shown in Figure 5.
The gain of the instrument amplifier is calculated carefully
to avoid a saturation of the output voltage, and to provide the
maximum of differential output voltage available for the AID
Converter. The maximum output swing voltage of the
amplifiers is also dependent on the bias current which creates
a AV voltage on the feedback resistance Rf and on the Full
Scale output voltage of the pressure sensor.
P
20
40
60
80
100
(kPa)
Figure 3. Output Voltage versus Temperature. The
Dark Area Shows the Trend of the Compensation
4-20
Motorola Sensor Device Data
AN1097
lib (nA)
Vl, V2
veel------,-~5~Vd=C~----_.------~
600
jl!J--
450
1/2b_"'"=.....~
vee
V V
V
300
V
-
!-'"'
~-- ~IT2
150
VEE '--_ _'--_ _L-_ _...L_ _---L~ VPS
o
5
10
15
20
(mV)
-50
-25
25
50
75
100
125
T
('e)
Figure 7. Input Bias Current versus Temperature
Figure 5. Instrument Amplifier Transfer Function with
Spread of the Device to Device Offset Variation
Figure 5 shows the transfer function of different instrument
amplifiers used in the same application. The same sort of
random errors are generated by crossing the inputs of the
instrument amplifier. The spread of the differential output
voltage (V1-V2) and (V2x-V1 x) is due to the unsigned voltage
offset and its absolute value. Figures 6 and 7 show the
unit-to-unit variations of both the offset and the bias current
of the dual op amp MC33078.
MCU CONTRIBUTION
As shown in Figure 5, crossing the instrument amplifier
inputs generated their mutual differences which can be
computed by the MCU.
Vl
Vio(mV)
-
+2
+1
... V V
UNIt-
H
,.....
~-+--~
.---
V2
'------+----- P
'----------~----ov
UNI 2
Figure 8. Crossing of the Instrument Amplifier
Input Using a Port of the MCU
UNT3
-1
T
-2
-50
-25
25
50
75
100
125
('e)
Figure 6. Input Offset Voltage versus Temperature
To realize such a system, the designer must provide a
calibration procedure which is very time consuming. Some
extra potentiometers must be implemented for setting both the
offset and the Full Scale Output with a complex temperature
compensation network circuit.
The new proposed solution will reduce or eliminate any
calibration procedure.
Motorola Sensor Device Data
Figure 8 shows the analog switches on the front of the
instrument amplifier and the total symmetry of the chain. The
residual resistance RDS(on) of the switches does not introduce
errors due to the high input impedance of the instrument
amplifier.
With the aid of two analog switch, the MCU successively
converts the output signals V1, V2.
Four conversions are necessary to compute the final result.
First, two conversions of V1 and V2 are executed and stored
in the registers R1, R2. Then, the analog switches are
commuted in the OPPOSite position and the two last
conversions of V2x and V1x are executed and stored in the
registers R2x and R1 x. Then, the MCU computes the following
equation:
RESULT = (R1 - R2) + (R2x - R1 x)
(2)
4-21
AN1097
The result is twice a differential conversion. As
demonstrated below, all errors from the instrument amplifier
are cancelled. Other averaging techniques may be used to
improve the result, but the appropriated algorithm is always
determined by the maximum bandwidth of the input signal
and the required accuracy of the system .
.---------------------~--------------~--------------~----~------- +5V
VRH
MPX2100AP
VOO
CH1
110
Rf
PRESSURE
SENSOR
SYSTEM
Rg
MC68HC05B6
P
Rf
~
CH2
L---------~~----------------+_--------------~----~------OV
Figure 9. Two Channel Input and One Output Port Are Used by the MCU
SYSTEM CALCULATION
Sensor out 2
Vs2 = a (P) + of2
Sensorout4
Vs4 = b (P) + of4
Amplifier out 1
V1 = Avd (Vs2 + OF1)
Amplifier out 2
V2 = Avd (Vs4 + OF2)
Inverting of the amplifier input
V1x = Avd (Vs4 + OF1)
V2x = Avd (Vs2 + OF2)
Delta = V1-V2
1st differential result
= Avd • (Vs2 of OF1) - Avd • (Vs4 + OF2)
Deltax = V2x-V1x
2nd differential result
= Avd • (Vs2 + OF2) - Vdc * (Vs4 + OF1)
Adding of the two differential results
VoutV = Delta + Deltax
= Avd*Vs2 + Avd*OF2 + Avd*OF2 - Avd*OF1
+ Avd*OF1 - Avd*OF2 + Avd*OF2 - Avd*OF1
= 2 * Avd * (Vs2 -Vs4)
= 2 • Avd • [(a (P) + of2) - (b (P) + of4)]
= 2 * Avd • [V(P) + Voffset]
neglected. That means the system does not require any
calibration procedure.
The equation of the system transfer is then:
count = 2 * Avd * V(P) * 51N where:
Avd is the differential-mode gain of the instrument amplifier
which is calculated using the equation (1). Then with Rf= 510
kQ and Rg = 9.1 kQ Avd = 113.
The maximum counts available in the MCU register at the
Full Scale Pressure is:
count (Full Scale) = 2' 113' 0.02 V· 51N = 230
knowing that the MPX2100AP pressure sensor provides
20 mV at 5.0 excitation voltage and 100 kPa full scale
pressure.
The system resolution is 100 kPal230 that give 0.43 kPa per
count.
+5V
Voo
There is a full cancellation of the amplifier offset OF1 and
OF2. The addition of the two differential results V1-V2 and
V2x-V1 X produce a virtual output voltage VoutV which
becomes the applied input voltage to the AID converter. The
result of the conversion is expressed in the number of counts
or bits by the ratiometric formula shows below:
255
count = VoutV * VRH-VRL
255 is the maximum number of counts provided by the AID
converter and VRH-VRL is the reference voltage of the
ratiometric AID converter which is commonly tied to the 5.0 V
supply voltage of the MCU.
When the tolerance of the full scale pressure has to be in the
range of ± 2.5%, the offset of the pressure sensor may be
4-22
FINE
CAL.
1+-------1 VRH
110
--------f------./ CH1
MC68HC05B6
+------+--------1 P
--------+-----+1
CH2
VRL
-----~-----~-~----
OV
Figure 10. Full Scale Output Calibration Using the
Reference Voltage VRH-VRL
Motorola Sensor Device Data
AN1097
When the tolerance of the system has to be in the range of
±1 %, the designer should provide only one calibration
procedure which sets the Full Scale Output (counts) at 25°C
100 kPa or under the local atmospheric pressure conditions.
+5V
MC33078
MPX2100AP
P1
1/0
MC68HC0586
CH1
P2
PRESSURE
SENSOR
SYSTEM
L -________~----------------~------------------------~--~-------
OV
Figure 11. One Channel Input and Two Output Ports are used by the MCU
Due to the high impedance input of the AID converter of the
MC68HC05B6 MCU, another configuration may be
implemented which uses only one channel input as shown in
Figure 11. It is interesting to notice that practically any dual op
amp may be used to do the job but a global consideration must
be made to optimize the total cost of the system according the
the requested specification.
When the Full Scale Pressure has to be sent with accuracy,
the calibration procedure may be executed in different ways.
For instance, the module may be calibrated directly using
Up/Down push buttons.
The gain of the chain is set by changing the VRH voltage of
the ratiometric AID converter with the R/2R ladder network
circuit which is directly drived by the ports of the MCU. (See
Figure 12.)
Using a communication bus, the calibration procedure may
be executed from a host computer. In both cases, the setting
value is stored in the EEROM of the MCU.
The gain may be also set using a potentiometer in place of
the resistor Rf. But, this component is expensive, taking into
account that it must be stable over the temperature range at
long term.
+5V
RO
2R
VDD
VRH
2R
P3
R
P2
R/2R
LADDER R
NETWORK
R
MC68HC0586
1---------.
BUS
P1
_--------
Vm (to Second Stage)
Rg
RlO
Figure 3. First Stage - Differential Amplifier, Offset Adjust and Gain Adjust
Motorola Sensor Device Data
4-25
AN1100
Vm
Vm
(from
first
stage)
~
Rll
,
R12
/
-
R14
~
R16
Note: R14 = R12, Rll = R13
R13
~
R15
V
l
R17
-=
fromD/A
Figure 4. Second Stage -
FIRST STAGE (Figure 3)
The first stage consists of the Motorola pressure sensor; in
this case the MPX2200 is used. This sensor typically gives a
full scale span output of 40 mV at 200 kPa. The sensor output
(VS) is connected to the inputs of amplifier A1 (1/4 of the
Motorola MC33079, a Quad Operational Amplifier). The gain,
G1, of this amplifier is R7/R6. The sensor has a typical zero
pressure offset voltage of 1 mV. Figure 3 shows offset
compensation circuitry if it is needed. A1 output is fed to the
non-inverting input of A2 amplifier (1/4 of a Motorola
MC33079) whose gain, G2, is 1+R1 otR9. G2 should be set to
yield 4.5 volts out with full-rated pressure.
o
J
, Vc
Difference Amplifier and Gain
The theoretical resolution is limited only by the accuracy of
the
programmable
power
supply.
The
Motorola
microprocessor used has an integrated AID. The accuracy of
this AID is directly related to the reference voltage source
stability, which can be self-calibrated by the microprocessor.
Vexpanded is the system output that is the sum of the voltage
due to the count and the voltage due to the difference between
the count voltage and the measured voltage. This is given by
the following relation:
Vexpanded = Vc
+ D/G3
therefore, PVexpanded = Vexpanded/S,
THE SECOND STAGE (Figure 4)
The outputfrom A2 (Vm = G1 xG2 xVs) is connected to the
non-inverting input of amplifier A3 (1/4 of a Motorola
MC33079) and to the AID where its corresponding (digital)
value is stored by the microprocessor. The output of A3 is the
amplified difference between Vm, and the digitized/calculated
voltage Vc. Amplifier A4 (1/4 of a Motorola MC33079)
provides additional gain for an amplified difference output for
the desired resolution. This difference output, D, is given by:
Pexpanded is the value of pressure (in units of kPa) that
results from this improved-resolution system. This value can
be outputto a display or used forfurther processing in a control
system.
CONCLUSION
This circuit provides an easy way to have high resolution
using inexpensive microprocessors and converters.
D = (Vm - V c) x G3
G3 = (R14/ R13)( 1
+ ~m
where G3 is the gain associated with amplifiers A3 and A4.
4-26
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1105
A Digital Pressure Gauge Using the Motorola
MPX700 Series Differential Pressure Sensor
Prepared by: Anthony J. Caristi
INTRODUCTION
This application note describes a solid state digital pressure
gauge which is composed of the Motorola MPX series
transducer, instrumentation amplifier, AID converter, and LCD
readout. Differential, gauge, and vacuum pressure readings
from 0 to 100 PSI with resolution of 1 PSI are possible using
the MPX700 sensor. The circuit is also capable of measuring
and displaying pressures as low as 1 PSI full scale, and
resolution as fine as of 0.01 PSI, by using a more sensitive
MPX series pressure transducer and full display capability of
the AID converter.
The Motorola MPX series of pressure transducers is a
family of piezoresistive transducers which exhibits a very
linear and accurate output voltage relationship that is directly
proportional to the applied pressure. The sensor consists of an
etched silicon diaphragm upon which a single piezoresistive
element is implanted. The resistor senses the stress placed
upon the silicon diaphragm by external pressure, and
produces a linear output voltage which is proportional to the
applied pressure. The output voltage/pressure relationship is
ratiometric with the supply voltage feeding the sensor.
ETCHED DIAPHRAGM
BOUNDARY
TRANSVERSE VOLTAGE
STRAIN GAUGE
application using the MPX700DP differential sensor to
measure and display gauge pressure, vacuum (negative
pressure), or differential pressure.
BASIC STRUCTURE
Figure 1 illustrates the top view of the pressure sensor
silicon chip, showing the strain-gauge resistor diagonally
placed on the edge of the diaphragm. Voltage is applied
across pins 1 and 3, while the taps that sense the voltage
differential transversely across the pressure sensitive resistor
are connected to terminals 2 and 4. An external series resistor
is used to provide temperature compensation while reducing
the voltage impressed upon the sensor to within its rated
value.
OPERATION
Recommended voltage drive is 3 Vdc, and should not
exceed 6 volts under any operating condition. The differential
voltage output of the sensor, appearing between terminals 2
and 4, will be positive when the pressure applied to the
"pressure" side of the sensor is greater than the pressure
applied to the "vacuum" side. Nominal full scale span of the
transducer is 60 millivolts when driven by a 3 volt constant
voltage source.
When zero pressure is applied to the sensor there will be
some output voltage, called zero pressure offset. For the
MPX700 sensor this voltage is guaranteed to be within the
range of zero to 35 millivolts. The zero pressure offset output
voltage is easily nulled out by a suitable instrumentation
amplifier. The output voltage of the sensor will vary in a linear
manner with applied pressure. Figure 2 illustrates output
voltage versus pressure differential applied to the sensor,
when driven by a 3 volt source.
TEMPERATURE COMPENSATION
-} DIFFERENTIAl
OUTPUT
' - - - - - 1 - - - - - + VOLTAGE
R TEMP COMP
Figure 1. Sensor Construction Showing
Electrical Connections
The pressure sensor is available as a differential gauge
device in a pressure side ported, vacuum side ported, or
differential configuration. The following describes an
Motorola Sensor Device Data
As illustrated in Figure 2, the output voltage of the sensor
will be affected by the temperature of the device. Temperature
compensation may easily be accomplished by one of several
methods. A full discussion of these methods is covered in
Motorola application note AN840.
The simplest method oitemperature compensation, placing
a resistance (R19 and R20) in series with the sensor driving
voltage, is utilized in the schematic diagram illustrated in
Figure 3. This provides good results over a temperature span
of 0 to 80°C, yielding a 0.5% full scale span compensated
device. Since the desired bridge driving voltage is about 3
volts, placing the temperature compensating resistor in series
with the bridge circuit has the additional advantage of reducing
the power supply voltage, 15 volts, to the desired 3 volt level.
4-27
AN110S
so
MPX700
Vs = 3 Vdc
70
-4roC
+~50C I
60
"~ 50
.s
~
~ .....
k::::: ~
!; 40
a.
!; 30
o
j....- II-
F:&"c
t:;;; ~
20
t:
0::
2;~
ifw
U)C!l
:z
t-
~
circuit is less than 80 degrees Celsius, one value of
compensating resistance can be used for any sensor
resistance over the range of 400 and 550 ohms.
In the circuit of Figure 3 the temperature compensating
network is composed of two resistors to allow the quiescent
voltage of the sensor at pins 2 and 4 to be near the center level
(2.5 volts) of the analog and digital circuit that follows.
!;~
~~
5~
a:
I
SENSOR AMPLIFIER
ti:i-
U)a.
10
o
0
1 ~E
20
140
40
2S0
160
420
1100 PSI
ISO
560
700
kPa
PRESSURE DIFFERENTIAL
Figure 2. Output versus Pressure Differential
Note that the 15 volt power source must be held to within a
tight tolerance, since the output voltage of the transducer is
ratiometric with the the supply voltage. In most applications an
ordinary fixed 15 volt regulator chip can be used to provide the
required stable supply voltage.
The series method of compensation requires a series
resistor which is equal to 3.577 times the bridge input
resistance at 25 degrees Celsius. The range of transducer
resistance is between 400 and 550 ohms, so the
compensating network will be 1431 to 1967 ohms. If a
temperature compensated span of greater than plus or minus
0.5% is satisfactory or the operating temperature range of the
IC3MC7SL05
An amplifier is used to convert the low level differential
output of the transducer, 60 millivolts at 100 PSI, to a useful
level that can drive subsequent circuitry. Additionally, the
amplifier must provide means to null out the DC offset output
voltage of the transducer when zero pressure is applied. The
circuit illustrated in Figure 3 uses three sections of a common
op-amp chip, LM324N, for this purpose. The high input
impedance of operational amplifiers IC1 A and IC1 B ensures
that the circuit does not load the basic transducer.
The gain of the instrumentation amplifier is adjusted by
means of potentiometer R6 to allow full scale calibration at 100
PSI applied pressure. Using the circuit constants indicated in
Figure 3, the gain of the amplifier can be expressed as
A = 2(1 + 100KlR)
where A = circuit gain
R = the total resistance composed of R6 plus R7
1OOK = the circuit value represented by R8, R9,
R10and R12.
R2
lOOk
R1
51.1
+15V--::-;-.,.........,
R3
10k
R4
lOOk
DISPl
LTD202R-12
.....- - - - - 4 - - - - , FULL SCALE
16
CAL
23
17
22
lS
15
IC2
24
12
13
25
10
I
I
I~
I~~
1,2,
6
14
9
10
~
14
1
':'
IC1
LM324N
27
CS
0.22
11
21
1.-_ _2,..6_----'
ICL7106CPL
R15
10k
ZERO
ADJ
Figure 3. Schematic Diagram of Digital Pressure Gauge
4-28
Motorola Sensor Device Data
AN1105
As can be seen by the gain equation, the minimum value of
gain is 2 when R is infinite. The amplifier is capable of
providing a gain of 100 or more by adjustment of R6, and R7,
but in this application the required gain is within the range of
about 2.6 to 5.3 to accommodate the tolerance of the full scale
span of the sensor.
A voltage divider composed of R 15, R16, and R 17 provides
an adjustable voltage which is fed to the inverting input of
ICl B. This voltage, attenuated by the gain of less than 1 of
ICl B, is fed to the analog to digital converter chip to negate the
effect of the offset voltage produced by the sensor and allows
the display of the circuit to read 00 when no pressure is
applied. The differential output of the instrumentation amplifier
appears between pins 7 and 8 of IC1. This is fed to the analog
to digital converter, IC2, to provide a digital readout of the
pressure difference impressed upon the transducer.
AID CONVERTER
The circuit employs a high performance 3 1/2 digit AID
converter chip (IC2) which contains all the necessary active
devices to convert the differential analog output voltage of the
instrumentation amplifier to digital form. A pair of LCD digits is
directly driven without multiplexing.
Included in IC2 are seven segment decoders, display
drivers, backplane frequency generator, reference, and clock.
The chip is capable of driving a 3 112 digit LCD
non-multiplexed display. In this application the least and most
significant digits are not used, but if greater range and/or
resolution is desired the unused output terminals of the chip
can be wired to drive 1 1/2 additional digits.
Full scale output of IC2 (2000 counts) is attained when the
analog differential input voltage fed to pins 30 and 31 is equal
to twice the reference voltage applied to pins 35 and 36, the
differential reference input terminals. In this application the
voltage divider composed of R2, R3, and R4, driven by the
on-board 5 volt regulator, provides an arbitrary reference
40
voltage of 238 millivolts. Since the maximum desired digital
display occurs at 1000 counts (half of AID converter full scale
capability) for a display of 00 at 100 PSI, the maximum analog
input voltage to IC2 will be 238 millivolts. Thus, nominal
amplifier circuit gain must be 238/60, or about 4. The two least
significant digits of input pressures exceeding 100 PSI will be
displayed by the readout.
IC2 responds to both positive and negative analog input
voltages, and generates a polarity bit at pin 20. If desired, the
circuit can be used to measure both positive and negative
differential pressures, with the polarity output bit at pin 20 used
to activate a minus sign indicator for negative pressures.
The circuit of Figure 4 employs only two digits of the
possible 3 1/2 digit capability of IC2. By substituting a 3 1/2
digit LCD display, the resolution of the pressure reading is
increased by a factor of ten. Additionally, any input pressure
of 100 PSI or greater will result in the most significant digit, "1 ",
being displayed. Figure 4 illustrates the connections between
the AID converter and the optional 3 1/2 digit LCD display.
CIRCUIT ASSEMBLY
The terminals of the pressure sensor should be carefully
formed to allow insertion into the PC board. Observe the
location of pin 1 of the sensor, which is identified by a small
notch. Use suitable hardware to mount the unit, being careful
not to overtighten the screws and damage the plastic housing.
To ensure circuit stability, use metal film resistors throughout
the amplifier circuit. The only exception to this are the resistors
associated with the AID converter, R5, Rll, and R18, which
can be ordinary carbon types.
It is recommended to use sockets for ICl and IC2.
A small identifier notch is located on the front of the display
to identify the location of pin 1, similar to that of a DIP IC chip.
This component is constructed of glass and must be handled
carefully to avoid breakage.
21
BACKPLANE
, I-I I-I I-I
-
-
-
, '-I ,-' ,-'
3
10
20
14
18
3-1/2 DIGIT DISPLAY
PIN IDENTIFICATION
19
23172218
15
241612132514
10115678
34
21
IC2
Figure 4. IC2 Driving Optional 3-1/2 Digit LCD Display
Motorola Sensor Device Data
4-29
AN110S
PRESSURE CONNECTIONS
For gauge pressure measurements, the port which is
closest to pin 4 of the sensor (identified as P1 in Figure 5) is
to be used, with the other port left open to the atmosphere. For
vacuum measurements, use port P2, with the opposite port
open to the atmosphere.
When the unit is to be used for differential pressure
measurements, both ports are used. Positive pressure
readings will be obtained when the pressure applied to the
high pressure side, P1, is greater than that applied to the low
pressure side P2. Should the pressures be opposite the
display will still read the difference in pressure, and the AID
converter will output a polarity bit at pin 20 of the chip.
Hoses should be attached to the sensor using a suitable
clamp. 100 PSI is a substantial pressure and any hose which
is not secured properly can suddenly disconnect.
CALIBRATION
Calibration of the circuit consists of adjustment of the zero
set and span adjust potentiometers, R16 and R6 respectively.
A pressure source of up to 100 PSI and accurate pressure
gauge is required. Figure 6 illustrates the test setup. Since the
output voltage of the sensor is dependent upon the magnitude
of the power supply voltage, calibration of the circuit must be
performed with the circuit being driven by a regulated 15 volt
supply. Any variation in the supply voltage will cause a
proportional error in calibration. With the circuit operating and
no pressure applied to the sensor, adjust R16 for a display of
00. Note that the display will read upscale when R16 is set to
either side of zero.
Connect the sensor to the pressure source as indicated in
Figure 6. Use a reference pressure gauge of known accuracy,
and adjust the pressure to 100 PSI. The pressure sensor is
capable of withstanding pressures up to 300 PSI without
damage.
Adjust R6 for a display of 00, indicating 100 PSI. Since the
AID converter is capable of displaying readings greater than
100, adjustment of R6 is easily set between a display of 99 and
01.
Remove the pressure from the sensor and recheck the
setting of the zero set potentiometer. Readjust if necessary for
a display of 00. Check the pressure display at 100 PSI. This
completes calibration of the circuit.
The digital pressure gauge may be checked over its range
by applying any pressure between 0 and 100 PSI and
comparing the display to the reference gauge. Note that
pressures above 100 PSI will be indicated, but with reduced
accuracy.
PC
BOARD
Innl
uu
ACCURATE
PRESSURE GAUGE
PRESSURE
SOURCE
Figure 5. Setup to Calibrate Circuit Against a Known Accurate Pressure Gauge
4-30
Motorola Sensor Device Data
AN1105
Table 1. Parts List by Component Values and Part Numbers
Designators
Quantity
Description
Rating
Cl
1
25 volt electrolytiC capacitor
10 J.!Fd
C2, C3, C5
C4
3
1
1
50 volt ceramic disc capacitor
50 volt ceramic disc capacitor
50 volt ceramic disc capacitor
0.1 jlFd
100 pF
0.01 jlFd
1
1
50 volt ceramic disc capacitor
50 volt ceramic disc capacitor
0.47 jlFd
0.22jlF
C6
C7
CB
Tolerance
Manufact.
Part Number
DISP
(optional) DISP
1
2 digit LCD readout
Amperex
1
3 1/2 digit LCD readout
Amperex
LTD202R-12
LTD221R-12
ICI
1
Quad operational amplifier
Harris Teledyne
ICL7106CPL
Motorola
MC7BL05
Motorola
MPX700DP
IC2
AID converter
IC3
1
100 mA fixed regulator
5 volt
Rl
R2,R4,RB,R9,Rl0,RI2
1
6
3
2
1
1/4 watt metal film
1/4 watt metal film
1/4 watt metal film
1/4 watt metal film
1/4 watt metal film
1/4 watt metal film
1/4 watt metal film
resistor
resistor
resistor
resistor
resistor
resistor
51.1 Q
100 K
10 K
41.2K
1K
1.5K
resistor
200Q
R3,RI5,RI7
R7,R14
R13
R19
R20
1
1
1/4 watt carbon resistor
1/4 watt carbon resistor
1/4 watt carbon resistor
100 K
1 megQ
R5
Rll
RIB
1
1
R6
1
0.3 watt cermet potentiometer,
PC mount
500 K
R16
1
0.3 watt cermet potentiometer,
PC mount
100 K
Sensor
1
0-100 psi, uncompensated
pressu re sensor
Motorola Sensor Device Data
1
47 K
1%
1%
1%
1%
1%
1%
%
5'%
5%
5%
4-31
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1303
A Simple 4-20 mA Pressure Transducer
Evaluation Board
Prepared by: Denise Williams
Discrete Applications Engineering
INTRODUCTION
The two wire 4-20 mA current loop is one olthe most widely
utilized transmission signals for use with transducers in
industrial applications. A two wire transmitter allows signal
and power to be supplied on a single wire-pair. Because the
information is transmitted as current, the signal is relatively
immune to voltage drops from long runs and noise from
motors, relays, switches and industrial equipment. The use of
additional power sources is not desirable because the
usefulness of this system is greatest when a signal has to be
. transmitted over a long distance with the sensor at a remote
location. Therefore, the 4 mA minimum current in the loop is
the maximum usable current to power the entire control
circuitry. An evaluation board designed to meet these
requirements is shown in Figure 1. A description of this
4-20 mA Pressure Transducer Evaluation Board, as well as
a summary of the information required to use it, are presented
here.
Figure 2 is a block diagram of a typical 4-20 mA current
loop system which illustrates a simple two chip solution to
converting pressure to a 4-20 mA signal. This system is
designed to be powered with a 24 Vdc supply. Pressure is
converted to a differential voltage by the Motorola MPX71 00
pressure sensor. The voltage signal proportional to the
monitored pressure is then converted to the 4-20 mA current
signal with the Burr-Brown XTR101 Precision Two-Wire
Transmitter. The current signal can be monitored by a meter
in series with the supply or by measuring the voltage drop
across RL. A key advantage to this system is that circuit
performance is not affected by a long transmission line.
Figure 1. 4-20 mA Pressure Transducer Evaluation Board
REV 1
4-32
Motorola Sensor Device Data
AN1303
SENSOR
PRESSURE
PORT
PRESSURE
SOURCE
PRESSURE
SENSOR
TRANSMITIER
CIRCUITRY
CURRENT
METER
4-20 mA PRESSURE TRANSDUCER
Figure 2. System Block Diagram
INPUT TERMINALS
A schematic of the 4-20 mA Pressure Transducer
Evaluation Board is shown in Figure 3. Connections to this
evaluation board are made atthe terminals labeled (+) and (-).
Because this system utilizes a current signal, the power
supply, the load and any current meter must be put in series
with the (+) to (-) terminals as indicated in the block diagram.
The load for this type of system is typically a few hundred
ohms. As described above, a typical use of a 4-20 mA current
transmission signal is the transfer of information over long
distances. Therefore, a long transmission line can be
connected between the (+) and (-) terminals on the evaluation
board and the power supply/load.
2mA
r----.-.",.,.------<~-I4----O
+ 4-20 mA OUTPUT
XDCR1
MPX7100
C1
0.01J.lF
02
1N4565A
6.4V@0.5mA
'-----------+-------0 -
RETURN
4-20 mA PRESSURE TRANSDUCER
Figure 3. Schematic Diagram
PRESSURE INPUT
The device supplied on this evaluation board is an
MPX7100DP, a high impedance (10 kQ typ) 15 PSI sensor
which provides two ports. P1, the positive pressure port, is on
top of the sensor and P2, the vacuum port, is on the bottom of
the sensor. The system can be supplied up to 15 PSI of
Motorola Sensor Device Data
positive pressure to P1 or up to 15 PSI of vacuum to P2 or a
differential pressure up to 15 PSI between P1 and P2. Any of
these pressure applications will create the same results at the
sensor output.
4-33
AN1303
CIRCUIT DESCRIPTION
The XTR1 01 current transmitter provides two one-milliamp
current sources for sensor excitation when its bias voltage is
between 12 V and 40 V. The MPX7100 series sensors are
constant voltage devices, so a zener, D2, is placed in parallel
with the sensor input terminals. Because the MPX71 00 series
parts have a high input impedance the zener and sensor
combination can be biased with just the two milliamps
available from the XTR1 01.
The offset adjustment is composed of R4 and R6. They are
used to remove the offset voltage at the differential inputs to
the XTR101. R6 is set so a zero input pressure will result in
the desired output of 4 mAo
R3 and R5 are used to provide the full scale current span of
16 mAo R5 is set such that a 15 PSI input pressure results in
the desired output of 20 mAo Thus the current signal will span
16 mA from the zero pressure output of 4 mA to the full scale
output of 20 mAo To calculate the resistor required to set the
full scale output span, the input voltage span must be defined.
The full scale output span of the sensor is 24.B mV and is!l.VIN
to the XTR101. Burr-Brown specifies the following equation
for Rspan. The 40 and 16 mn values are parameters of the
XTR101.
and R6 and select-in-test resistors R7 and RB for particular
applications.
OTHER CONSIDERATIONS
The 4-20 mA Pressure Transducer Evaluation Board has
been designed to demonstrate the performance of the
Motorola MPX7100 pressure sensor in conjunction with a
4-20 mA current transmitter. Several design considerations
should be considered when actually optimizing for an
application.
1. The optional external transistor, Q1, is recommended by
Burr-Brown to increase accuracy by reducing temperature change inside the XTR101 package as the output
current spans from 4 mA to 20 mAo Also for power
supply voltages above 24 V, the 750 n 1/2W resistor, R1,
is recommended to limit the power dissipation in the
MPSA06 to below its 625 mW rating.
2. Keeping lead lengths short in the portion of the circuit
where the span adjust and zero adjust resistors connect
to the XTR101 is recommended to reduce noise pick-up
and parasitic resistance.
3. C1 is a bypass capacitor and, therefore, should be
connected across pins 7 and B of the XTR1 01 as close to
the device as possible.
Rspan = 40/ [(16 mA / !l.Vin) - 0.016 mhos]
=
64
n
The XTR101 requires that the differential input voltage at
pins 3 and 4, V2 - V1 be less than 1V and that V2 (pin 4)
always be greater than V1 (pin 3). Furthermore, this
differential voltage is required to have a common mode of 4-6
volts above the reference (pin 7). The sensor produces the
differential output with a common mode of approximately 3.1
volts above its reference pin 1. Because the current of both 1
mA sources will go through R2, a total common mode voltage
of about 5.1 volts (1 kQ x 2 mA + 3.1 volts = 5.1 volts) is
provided.
The printed circuit layout and the component layout for the
evaluation board are shown in Figures 4a-4c. Table 1 is the
parts list for the evaluation board. Some extra pads and the
labels R7 and RB were provided on the board to allow
replacement of the variable resistors with fixed resistors R5
4-34
CALIBRATION
1. Connect the evaluation board as shown in the block
diagram of Figure 2.
2. With no pressure connections to the sensor, adjust R6 so
that lout is 4 mAo
3. Supply 15 PSI to the sensor, (either positive pressure to
the pressure port or vacuum to the vacuum port) and
adjust R5 so that lout is 20 mAo
4. You may need to repeat steps 2 and 3 to ensure proper
calibration.
CONCLUSION
This circuit is an example of how the higher impedance
MPX7000 series sensors can be utilized in an industrial
application. It provides a simple design alternative where
remote pressure sensing is required.
Motorola Sensor Device Data
AN1303
Table 1. Parts List for 4-20 mA Pressure Transducer Evaluation Board
Designator
Quantity
Description
1
1
4
4
2
2
PC Board (see Figure 3)
Input/Output Terminals
1/2" standoffs, Nylon threaded
1/2" screws, Nylon
S/8" screws, Nylon
4-40 nuts, Nylon
1
Capacitor
0.01 !IF
01
D2
1
1
Diodes
100V Diode
6.4 V Zener
Ql
1
Transistor
NPN Bipolar
Rl
R2
R3
R4
1
1
1
1
Resistors, Fixed
7S0Q
1 kQ
39Q
1 MQ
RS
R6
1
1
Ul
Cl
XDCRl
Rating
Manufacturer
Motorola
PHXCONT
Part Number
DEVB126
#1727010
SOV
1A
lN4002
lN4S6SA
Motorola
MPSA06
Resistors, Variable
SO Q, one tu rn
100 KQ, one turn
Bourns
Bourns
#3386P-l-S00
#3386P-l-l04
1
Integrated Circuit
Two wire current transmitter
Burr-Brown
XTR10l
1
Sensor
High Impedance
Motorola
MPX7100DP
1/2W
lS PSI
NOTE: All resistors are 1/4 W with a tolerance of S% unless otherwise noted. All capacitors are 100 volt, ceramic capacitors with a tolerance
of 10% unless otherwise noted.
o
~
4-20 rnA PRESSURE TRANSDUCER
~
o
o
RB
0
1:_1
..
-
+
0
D~O
[]
0
0
0
0
0
0
0
O~
Ul
o
o
~-
XDCRl
a
0
0
~~OOQl
LJo 0
a (ao)DI Rl 10 0
R~
Cl
D I£QL] 0
o
~
o
oa~O
R70
DEVB1260
OCilD
MOTOROLA DISCRETE APPLICATIONS
o
Figure 4a. Component Layout
Motorola Sensor Device Data
4-35
AN1303
10
°
:!:
~
~
:r:-atllli°
O
~oo
o
00
19
0
00
0
0
COMPONENT
SIDE
~ COO
ao ao
Oa
0°/
O/~
C2J
Figure 4b. Board Layout Component Side
°
' -_ _ _ _ _ _o()R30J02
3012
0
:::J
Figure 4c. Board Layout Solder Side
(With traces reversed for easy comparison to front side)
4-36
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1304
Integrated Sensor Simplifies Bar Graph
Pressure Gauge
Prepared by: Warren Schultz
Discrete Applications Engineering
INTRODUCTION
Integrated semiconductor pressure sensors such as the
MPX5100 greatly simplify electronic measurement of
pressure. These devices translate pressure into a 0.5 to 4.5
volt output range that is designed to be directly compatible
with microcomputer AID inputs. The 0.5 to 4.5 volt range also
facilitates interface with ICs such as the LM3914, making Bar
Graph Pressure Gauges relatively simple. A description of a
Bar Graph Pressure Sensor Evaluation Board and its design
considerations are presented here.
Figure 1. DEVB129 MPX5100 Bar Graph Pressure Gauge
Motorola Sensor Device Data
4-37
AN1304
EVALUATION BOARD DESCRIPTION
A summary of the information required to use evaluation
board number DEVB 129 is presented as follows. A discussion
of the design appears under the heading Design
Considerations.
FUNCTION
The evaluation board shown in Figure 1 is designed to
provide a 100 kPa full scale pressure measurement. It has two
input ports. P1, the pressure port is on the top side of the
MPX5100 sensor, and P2, a vacuum port, is on the bottom
side. These ports can be supplied up to 100 kPa (15 psi)' of
pressure on P1 or up to 100 kPa of vacuum on P2, or a
differential pressure up to 100 kPa between P1 and P2. Any
of these sources will produce the same output.
The primary output is a 10 segment LED bar graph, which
is labeled in increments of 10 kPa. If full scale pressure is
adjusted for a value other than 100 kPa the bar graph may be
read as a percent of full scale. An analog output is also
provided. It nominally supplies 0.5 volts at zero pressure and
4.5 volts at 100 kPa. Zero and full scale adjustments are made
with potentiometers so labeled at the bottom of the board.
Both adjustments are independent of each other.
ELECTRICAL CHARACTERISTICS
The following electrical characteristics are included to
describe evaluation board operation. They are not
specifications in the usual sense and are intended only as a
guide to operation.
Characteristic
Power Supply Voltage
Symbol
Min
Typ
Max
Units
B+
6.B
-
13.2
Volts
kPa
PFS
-
-
100
PMAX
-
-
700
kPa
VFS
-
4.5
-
Volts
VOFF
-
0.5
-
Volts
Analog Sensitivity
SAOUT
-
40
-
rnV/kPa
Quiescent Current
ICC
-
20
-
rnA
Full Scale Current
IFS
-
140
-
rnA
Full Scale Pressure
Overpressure
Analog Full Scale
Analog Zero Pressure
Offset
PIN-BY-PIN DESCRIPTION
B+:
Input power is supplied at the B+ terminal. Minimum input
voltage is 6.8 volts and maximum is 13.2 volts. The upper limit
is based upon power dissipation in the LM3914 assuming all
10 LED's are lit and ambient temperature is 25°C. The board
will survive input transients up to 25 volts provided that power
dissipation in the LM3914 does not exceed 1.3 watts.
OUT:
An analog output is supplied at the OUT terminal. The signal
it provides is nominallyO.5 volts at zero pressure and 4.5 volts
at 100 kPa. This output is capable of sourcing 100 ~A at full
scale output.
GND:
There are two ground connections. The ground terminal on
the left side of the board is intended for use as the power
supply return. On the right side of the board, one of the test
point terminals is also connected to ground. It provides a
convenient place to connect instrumentation grounds.
TP1:
Test point 1 is connected to the zero pressure reference
voltage and can be used for zero pressure calibration. To
calibrate for zero pressure, this voltage is adjusted with R6 to
match the zero pressure voltage that is measured at the
analog output (OUT) terminal.
TP2:
Test point 2 performs a similar function at full scale. It is
connected to the LM3914's reference voltage which sets the
trip point for the uppermost LED segment. This voltage is
adjusted via R5 to set full scale pressure.
P1, P2:
Pressure and Vacuum ports P1 & P2 protrude from the
MPX51 00 sensor on the right side of the board. Pressure port
P1 is on the top and vacuum port P2 is on the bottom. Neither
is labeled. Either one or a differential pressure applied to both
can be used to obtain full scale readings up to 100 kPa (15 psi).
Maximum safe pressure is 700 kPa.
CONTENT
Board contents are described in the following parts list,
schematic, and silk screen plot. A pin by pin circuit description
follows in the next section.
, 100 kPa = 14.7 psi, 15 psi is used throughout the text for convenience
4-38
Motorola Sensor Device Data
AN1304
DESIGN CONSIDERATIONS
In this type of an application the design challenge is how to
interface a sensor with the bar graph output. MPX5100
Sensors and LM3914 Bar Graph Display drivers fit together so
cleanly that having selected these two devices the rest of the
design is quite straight forward.
A block diagram that appears in Figure 4 shows the
LM3914's internal architecture. Since the lower resistor in the
input comparator chain is pinned out at RLO, it is a simple
matter to tie this pin to a voltage that is approximately equal
to the MPX5100's zero pressure output Voltage. In Figure 2,
this is accomplished by dividing down the 5 volt regulator's
output voltage through R1, R4, and adjustment pot R6. The
voltage generated at the wiper of R6 is then fed into RLO which
matches the sensor's zero pressure voltage and zeros the bar
graph.
The full scale measurement is set by adjusting the upper
comparator's reference voltage to match the sensor's output
at full pressure. An internal regulator on the LM3914 sets this
voltage with the aid of resistors R2, R3, and adjustment pot R5
that are shown in Figure 2.
The MPX5100 requires 5 volt regulated power that
is supplied by an MC78L05. The LED's are powered
directly from LM3914 outputs, which are set up as current
sources. Output current to each LED is approximately
10 times the reference current that flows from pin 7 through
R2, R5, and R3 to ground. In this design it is nominally
(4.5 V/4.9K)10 = 9.2 mAo
Over a zero to 85°C temperature range accuracy for both
the sensor and driver IC are ±2.5%, totaling ±5%. Given a 10
segment display total accuracy is approximately ±(10 kPa
+5%).
CONCLUSION
Perhaps the most noteworthy aspect to the bar graph
pressure gauge described here is how easy it is to design. The
interface between an MPX5100 sensor, LM3914 display
driver, and bar graph output is direct and straight forward. The
result is a simple circuit that is capable of measuring pressure,
vacuum, or differential pressure; and will also send an analog
signal to other control circuitry.
S1
+12V
~~--~--------------------~~~~~~~~~~~~--~-,
ON/OFF
, D1 ,. D2, D3, D4, D5, D6 ,. D7 ,. DB
D9
D10
\\ \\ \\ \\ \\ \\ \\ \\ \\ \\
C2
---
I11lF
U1
U3
MC7BL05ACP
3
TIC1
-=
O.1IlF
1
2
3
4
I~-rG~~'1oIL.~__~__~~__-.
I
5
R4
2
.r-±
r-+9
1.3K
R2
1.2 k
U2
MPX5100
I
2
GND
~~~~ ~6
R5
1k
100
LED
GND
B,
RLO
SIG
RHI
REF
ADJ
MOD
LED~
LED
17
LED
LED
LED
LED
LED
LED
15
14
13
12
11
10
LED~
LM3914
't=t==~~---{)
L-----t------+----o
>-----0
TP2 (FULL SCALE CALIBRATION)
TP1 (ZERO CALIBRATION)
GND
FULL SCALE CALIBRATION
R1
100
~
R3
2.7 k
~IA~N~AL~O~G~O~UT~------------------------~-=~~ ~
Figure 2. MPX5100 Pressure Gauge
Motorola Sensor Device Data
4-39
AN1304
MPX5100 PRESSURE GAUGE
0
PRESSURE
kPa
100
90
80
70
60
50
40
30
20
10
0
0
0
0
0
0
0
0
0
0
c:=J
c:=J
c:=J
DEVB129
0
0
0
0
0
0
0
0
0
....
<0
;:::
~
::;
0
MOTOROLA
DISCRETE
APPLICATIONS
0
0
0
0
0
0
0
0
0
D
0
0
0
....c;; 0
:::'" 0
0
0
0
0
D
0
0
0
0
0
D
MPX5100
C2
0 0
B+
CJ
oCJ
0
0
raOq
U3
OUT
0
gOFF
0
0
o
TP2
[§J 0
0
TP1
O~O
GND
~oo
0
°C1
0
~M
o
0
0
ZERO
o
GND
0
0
0
0
FULL SCALE
Figure 3. Silk Screen 2X
Table 1. Parts List
Designators
Quant.
Description
C1
C2
1
1
Ceramic Cap
Ceramic Cap
Rating
Manufacturer
Part Number
0.11!F
11!F
01-010
1
Bar Graph LEO
R1
R2
R3
R4
R5
R6
1
1
1
1
1
1
1/4 W Film
1/4 W Film
1/4 W Film
1/4 W Film
Trimpot
Trimpot
S1
1
On/Off Switch
NKK
12S0P2
U1
U2
U3
1
1
1
Bar Graph IC
Pressure Sensor
Voltage Regulator
National
Motorola
Motorola
LM3914
MPX5100
MC78L05ACP
-
1
3
4
4
Terminal Block
Test Point Terminal
Nylon Spacer
4-40 Nylon Screw
Augat
Components Corp.
25V03
TP1040104
Resistor
Resistor
Resistor
Resistor
GI
100
1.2K
2.7K
1.3K
1K
100
MV57164
Bourns
Bourns
3/8"
1/4"
Note: All resistors have a tolerance of 5% unless otherwise noted.
All capacitors are 50 volt ceramic capacitors with a tolerance of 10% unless otherwise noted.
4-40
Motorola Sensor Device Data
AN1304
LED
V+
LM3914
/Z)'I
/Z)'I
/Z)'I
/Z)'I
/Z)'I
REF
OUT
THIS LOAD
DETERMINES
LED
BRIGHTNESS
-=
REF
ADJ
7+
/Z)'I
REFERENCE
VOLTAGE
SOURCE
1.2SV
/Z)'I
I
/Z)'I
8
/Z)'I
/Z)'I
I
CONTROLS
TYPE OF
DISPLAY, BAR
OR SINGLE
LED
V-~
I
~
Figure 4. LM3914 Block Diagram
Motorola Sensor Device Data
4-41
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1305
An Evaluation System for Direct Interface
of the MPX5100 Pressure Sensor with
a Microprocessor
Prepared by: Bill Lucas
Discrete Applications Engineering
INTRODUCTION
Interfacing pressure sensors to analog-to-digital
converters or microprocessors with on-chip AID converters
has been a challenge that most engineers do not enjoy
accepting. Recent design advances in pressure sensing
technology have allowed the engineer to directly interface a
pressure sensor to an AID converter with no additional active
components. This has been made possible by integrating a
temperature compensated pressure sensor element and
active linear circuitry on the same die. A description of an
evaluation board that shows the ease of interfacing a signal
conditioned pressure sensor to an AID converter is presented
here.
Figure 1. DEVB-114 MPX5100 Evaluation Module
4-42
Motorola Sensor Device Data
AN130S
offset. The sensor's zero offset voltage with no pressure
applied to the sensor is empirically computed each time power
is applied to the system and stored in RAM. The sensitivity of
the MPX51 00 is repeatable from unit to unit. There is a facility
for a small "rubbering" of the slope constant built into the
program. It is accomplished with jumpers J1 and J2, and is
explained in the Operation section. The board contents are
further described in the schematic, silk screen plot, and parts
list that appear in Figures 2, 3 and Table 1.
PURPOSE
This evaluation system, shown in Figure 1, demonstrates
the ease of operation and interfacing of the Motorola
MPX5100 series pressure sensors with on-chip temperature
compensation, calibration and amplification. The board may
be used to evaluate the sensor's suitability for a specific
application.
DESCRIPTION
BASIC CIRCUIT
The DEVB-114 evaluation board is constructed on a small
printed circuit board. It is powered from a single +5 Vdc
regulated power supply. The system will display the pressure
applied to the MPX5100 sensor in pounds per square inch.
The range is 0 PSI through 15 PSI, resolved to 0.1 PSI. No
potentiometers are used in the system to adjust the span and
The evaluation board consists of three basic subsystems:
an MPX5100GP pressure sensor, a four digit liquid crystal
display (only three digits and a decimal are used) and a
programmed microprocessor with the necessary external
circuitry to support the operation of the microprocessor.
LCD
mm m
lEE PART NUMBER LCD5657 OR EQUAL
LIQUID CRYSTAL DISPLAY
28 37 6 5
6
734 35
8
31 329
10
11 29 30
49
4748 42
43
44 45 46
12
~F
2 13 14
3738 32
33
()
152425
16
3435 36
31
IFrl:h
I!!~
222317
18
92021
293024
25
262728
1-4 33
39,38,40
+5
PORTC
PORTA
PORTB
150HM
R5
~
50
.f-
U1
TDO
VRH
1%
~
MC68HC705B5FN
VSS
VRL
OSC1
16
OSC2
17
PD5
5
22pF
C3
T
J3
GND ..
-=
::t
C1i
100~F
R2
10MEG
T
J1
I
•
4.7K
PD4 PD3 PD1 VPP6
PDO
VDD PD2
TCAP1
D/A TCAP2
r8_ _ 19110111 12113114 15
~23
~~
10K
...-.,
R4
+5
IN 34:P-
"
1%
2-.
R7
-.302 V
30.1 OHM
1%
-=
J2
C4
-=
11
IRQ
19
R3
10K
22 pF
RESET
-
PD6 PD7
4
3
4MHz
.-.jO~
+5..
453 OHM
R6
RDI
-4.85 V
-=
+5
C2
+5
r
VCC
~
XDCR1
MPX5100
J.§ND
I
Figure 2. DEVB-114 System Schematic
Motorola Sensor Device Data
4-43
AN1305
Table 1. DEV8-114 Parts List
Designators
C1
Quant.
Description
1
100
~F
Manufacturer
Rating
Electrolytic Capacitor
25 Vdc
Sprague
Part Number
513D107M025BB4
C2
1
0.1 ~F Ceramic Capacitor
50Vdc
Sprague
1C105Z5U104M050B
C3,C4
2
22 pF Ceramic Capacitor
100 Vdc
Mepco/Centralab
CN15A220K
J1, J2
1
Dual Row Straight .025 Pins
Arranged On .1" Grid
Molex
10-89-1043
LCD
1
Liquid Crystal Display
AMPEREX
LTD226R-12
R1
1
4.7 k Ohm Resistor
R2
1
10 Meg Ohm Resistor
R3,R4
2
10k Ohm Resistor
R5
1
15 Ohm 1% 1/4 W Resistor
R6
1
453 Ohm 1% 1/4 W Resistor
R7
1
30.1 Ohm 1% 1/4 W Resistor
XDCR1
1
Pressure Sensor
Motorola
MPX5100GP
U1
1
Microprocessor
Motorola
Motorola
MC68HC705B5FN or
XC68HC705B5FN
Motorola
MC34064P-5
U2
1
Under Voltage Detector
Y1
1
Crystal (Low Profile)
No Designator
1
No Designator
No Designator
ECS
ECS-40-S-4
52 Pin PLCC Socket
AMP
821-575-1
2
Jumpers For J1 and J2
Molex
15-29-1025
1
Bare Printed Circuit Board
4.0 MHz
Note: All resistors are 1/4 W resistors with a tolerance of 5% unless otherwise noted.
All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted.
LCD1
[
U1
~~DD
R3 c:::J
R41::::J
~~ I==l
R1
c::J
C2 C3 r-;;:--l C40 U2
0 0 L..1!.......J 0
D0+
R7D C1
~
ro J'9:"m
GND
VCC
TP1
XDRC OUT
TP2
DEVB-114
REV. 0
Figure 3. Silk Screen
4-44
Motorola Sensor Device Data
AN1305
Theory of Operation
Referring to the schematic, Figure 2, the MPX5100
pressure sensor is connected to PORT 0 bit 5 of the
microprocessor. This port is an input to the on-chip 8 bit
analog to digital converter. The pressure sensor provides a
signal output to the microprocessor of approximately 0.5 Vdc
at 0 psi to 4.5 Vdc at 15 psi of applied pressure as shown in
Figure 4. The input range of the A to 0 converter is set at
approximately 0.3 Vdc to 4.85 Vdc. This compresses the
range of the A to 0 converter around the output range of the
sensor to maximize the A to 0 converter resolution; 0 to 255
counts is the range of the A to 0 converter. VRH and VRL are
the reference voltage inputs to the A to 0 converter. The
resolution is defined by the following:
The microprocessor section of the system requires certain
support hardware to allow it to function. The MC34064P-5
(U2) provides an under voltage sense function which is used
to reset the microprocessor at system power-up. The 4 MHz
crystal (Y1) provides the external portion of the oscillator
function for clocking the microprocessor and provides a stable
base for time based functions. Jumpers J1 and J2 are
examined by the software and are used to "rubber" the slope
constant.
Analog-to-digital converter count =
[(Vxdcr - VRLl/(VRH - VRLl]' 255
The count at 0 psi = [(.5 - .302)/(4.85 - .302)]. 255 ~ 11
The count at 15 psi = [(4.5 - .302)/(4.85 - .302)]. 255 ~ 235
Therefore the resolution = count @ 15 psi - count @ 0 psi or
the resolution is (235 - 11) = 224 counts. This translates to a
system that will resolve to 0.1 psi.
Vs = 5.0 Vdc -----\----+----,."'7l
TA=25°C
MPX5100
4.5
0-
~~---+-----4-.~~~+----.
>-
B"~---+
I
1
SPAN
>=>
o~---+_-7~~_4----+----_1
TVP FFSET
looT
0'----:'::-----'-----'------:"
75
50
25
kPa 0
PSI
3.62
7.25
10.87
14.5
OPERATION
The system must be connected to a 5 Vdc regulated power
supply. Note the polarity marked on the power terminal J3.
Jumpers J1 and J2 must either both be installed or both be
removed for the normal slope constant to be used. The
pressure port on the MPX5100 sensor must be left open to
atmosphere anytime the board is powered-up. As previously
stated, the sensor's voltage offset with zero pressure applied
is computed at power-up.
You will need to apply power to the system. The LCD will
display CAL for approximately 5 seconds. After that time, the
LCD will then start displaying pressure.
To improve upon the accuracy of the system, you can
change the constant used by the program that constitutes the
span of the sensor. You will need an accurate test gauge to
measure the pressure applied to the sensor. Anytime after the
display has completed the zero calculation (after CAL is no
longer displayed), apply 15.0 PSI to the sensor. Make sure
that jumpers J1 and J2 are either both installed or both
removed. Referring to Table 2, you can increase the displayed
value by installing J1 and removing J2. Conversely, you can
decrease the displayed value by installing J2 and removing
J1.
J1
J2
IN
OUT
OUT
IN
OUT
IN
IN
OUT
Action
USE NORMAL SPAN CONSTANT
USE NORMAL SPAN CONSTANT
DECREASE SPAN CONSTANT
APPROXIMATELY 1.5%
INCREASE SPAN CONSTANT
APPROXIMATELY 1.5%
Table 2.
Figure 4. MPX5100 Output versus Pressure Input
SOFTWARE
The voltage divider consisting of R5 through R7 is
connected to the +5 volts powering the system. The output of
the pressure sensor is ratiometric to the voltage applied to it.
The pressure sensor and the voltage divider are connected to
a common supply; this yields a system that is ratiometric. By
nature of this ratiometric system, variations in the voltage of
the power supplied to the system will have no effect on the
system accuracy.
The liquid crystal display is directly driven from I/O ports A,
B, and C on the microprocessor. The operation of a liquid
crystal display requires that the data and backplane pins must
be driven by an alternating signal. This function is provided by
a software routine that toggles the data and backplane at
approximately a 30 Hz rate.
Motorola Sensor Device Data
The source code, compiler listing, and S-record output for
the software used in this system are available on the Motorola
Freeware Bulletin Board Service in the MCU directory under
the filename OEVB-114.ARC. To access the bulletin board
you must have a telephone line, a 300, 1200 or 2400 baud
modem and a terminal or personal computer. The modem
must be compatible with the Bell 212A standard. Call
1-512-891-3733 to access the Bulletin Board Service.
The software for the system consists of several modules.
Their functions provide the capability for system calibration as
well as displaying the pressure input to the MPX5100
transducer.
Figure 5 is a flowchart for the program that controls the
system.
4-45
AN1305
INITIALIZE DISPLAY 1/0 PORTS
INITIALIZE TIMER REGISTERS
ALLOW INTERRUPTS
PERFORM AUTO ZERO
TIMER
INTERRUPT
I
SERVICE TIMER REGISTERS
SETUP COUNTER FOR NEXT INTERRUPT
SERVICE LIQUID CRYSTAL DISPLAY
RETURN FROM INTERRUPT
ACCUMULATE 100 AlD CONVERSIONS
COMPUTE INPUT PRESSURE
CONVERT TO DECIMAL
PLACE IN RESULT OUTPUT BUFFER
Figure 5. DEV8-114 Software Flowchart
The compiler used in this project was provided by BYTE
CRAFT LTD. (519) 888-6911. A compiler listing of the
program is included at the end of this document. The following
is a brief explanation of the routines:
delay() Used to provide approximately a 20 ms loop.
read_a2d() Performs one hundred reads on the analog to
digital converter on multiplexer channel 5 and returns the
accumulation.
fixcompare() Services the internal timer for 30 ms timer
compare interrupts.
TIMERCMP() Alternates the data and backplane for the
liquid crystal display.
initio() Sets up the microcomputer's I/O ports, timer, allows
processor interrupts, and calls adzeroO.
adzero() This routine is necessary at power-up time
because it delays the power supply and allows the
4-46
transducer to stabilize. It then calls 'read_atodO' and saves
the returned value as the sensors output voltage with zero
pressure applied.
cvt_bin_dec(unsigned long arg) This routine converts the
unsigned binary argument passed in 'arg' to a five digit
decimal number in an array called 'digit'. It then uses the
decimal results for each digit as an index into a table that
converts the decimal number into a segment pattern for
the display. It is then output to the display.
display_psi() This routine is called from 'mainO'. The analog to digital converter routine is called, the pressure is
calculated, and the pressure applied to the sensor is dis·
played. The loop then repeats.
main() This is the main routine called from reset. It calls
'initioO' to set up the system's I/O. 'display_psiO' is called
to compute and display the pressure applied to the sensor.
Motorola Sensor Device Data
AN1305
SOFTWARE SOURCE/ASSEMBLY PROGRAM CODE
#pragma option v
'"
rev 1.1 code rewritten to use the MC68HC70SBS instead of the
MC68HC805B6. WLL 6'17'91
THE FOLLOWING 'e' SOURCE CODE IS WRITTEN FOR THE DEVB-114 DEMONSTRATION
BOARD. IT WAS COMPILED WITH A COMPILER COURTESY OF:
BYTE CRAFT LTD.
421 KING ST.
WATERLOO, ONTARIO
CANADA
N2J 484
(519)888-6911
SOME SOURCE CODE CHANGES MAY BE NECESSARY POR COMPILATION WITH OTHER
COMPILERS.
BILL LUCAS 8/5/90
MOTOROLA,
0800 1700
0050 0096
lFFE
lFFC
l.FFA
lFFB
lFF6
lFF4
1FF2
"'
BPS
#pragma memory ROMPROG
[5888]
@
OxCeOD
#pragma memory RAMPAGED
[150]
@
OxOOSO
1*
Vector assignments
*/
#pragma vector _RESET
@ Oxlffe
#pragma vector _SWI
@ Oxlffc
@ Oxlffa
#pragma vector IRQ
#pragma vector TlMERCAP @ Ox1ff8
#pragma vector TlMERCMP @ Oxlff6
@ Oxl.ff4
#pragma vector TlMEROV
@ Ox1ff2
#pragma vector SCI
#pragma has STOP ;
#pragma has WAIT ;
#pragma has MOL ;
0000
0001
0002
0003
0004
0005
0006
0007
0008
0009
OOOA
OOOB
OOOC
OOOD
OOOE
OOOF
0010
Motorola Sensor Device Data
,"
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#tpragma
"' ",
",",
"'"'
"'*'
Register assignments for the 68HC705B5 microcontroller
portrw porta
@ OxOO;
@ OxOl;
portrw portb
@ Ox02;
portrw portc
@ Ox03;
portrw portd
in
,SS ,seK ,MOSI,MISO, TxD, RxD
@ Ox04;
portrw ddra
Data direction, Port A
@
portrw ddrb
OxOS;
Data direqtion, Port B
@ Ox06;
portrw ddrc
Data direction, Port C (all output)
@ Ox07;
portrw eeclk
eeprom/eclk cntl * I
portrw addata @ Ox08;
aId data register *1
portrw ads tat @ Ox09;
aId stat/control
@ OxOa;
portrw plma
pulse length modulation a
@ OxOb;
portrw plmb
pulse length modulation b
@ OxOc;
portrw misc
miscellaneous register
portrw scibaud @ OxOd;
sci baud rate register
portrw scientll @ OxOe;
sci control 1
portrw scientl2 @ OxOf;
sci control 2
portrw seistat @ OxlO;
sci status reg
,","
,","
,","
,"
,"'","
,","
,","
,","
,"
"'
"'"'
"'
"'"'
"'"'
4-47
AN1305
0011
0012
0013
0014
0015
0016
0017
0018
0019
OOlA
OOlB
OOle
0010
OOlE
OOlF
#pragma portrw scidata
#pragma portrw tcr
#pragma portrw tsr
#pragma portrw icaphil
@
Oxll;
Ox12;
Ox13,
@
Ox14;
#pragma portrw icaplol
@
OxlS;
#pragma portrw ocmphil
#pragma portrw ocmpl.ol
@
Ox16,
@
Ox17;
#pragma portrw tenthi
@
OxlS;
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
@
Ox19;
OxlAI
portrw
portrw
portrw
portrw
portrw
portrw
portrw
@
@
tcntle
Bcnthi
aentle
icaphi2
icapl.o2
ocmphi2
ocmpl02
@
@
@
@
@
@
OxlB;
Oxle;
Oxld;
axle;
Oxlf,
,.,.
,.,.,.
,.,.
,.,.
,.,.
,.,.
,.,.
SCI Data
.,
IeIE, CClE. TOlE, 0; 0, O. lEGE. OLVL
ICF,OCF,TOF,Q; 0.0, 0, 0
.,.,
.,
.,
Input Capture Reg (Hi-Ox14, Lo-Ox15)
Input Capture Reg (Hi-Ox14, La-OxlS)
Output compare Reg (Hi-Ox16, LO-Ox17) *1
Output Compare Reg (Hi-Ox16, La-Ox17)'*/
Timer Count Reg (Hi-Ox18, Lo-Ox19)
Timer Count Reg (Hi-Ox18, Lo-Ox19)
Alternate Count Reg (Hi-$lA, Lo-$lB)
Al.ternate Count Reg (Hi-$lA, Lo-$lB)
Input Capture Reg (Hi-Oxle, Lo-Oxl.d)
Input Capture Reg (Hi-Oxle, Lo-Oxld)
OUtput Compare Reg (Hi-Oxle, Lo-Oxlf) *1
Output Compare Reg (Hi-Oxle, Lo-Oxlf)*1
.,.,
.,.,
.,.,
1* put constants and variables here ... they must be global * I
lEFE 74
1* * * *.... * .. * * * * .... * .. * * * * .. * ........ * * .... * .... * * ** ............ * .. * ............ * .......... ** * .. * ........ ** .... I
#pragma mer @ OxlEFE = Ox74; 1* this disables the watchdog counter and does not
add pull-down resistors on ports Band C .. I
0800 FC 30 DA 7A 36 6E E6 38 FE
canst char lcdtab[l={Oxfc, Ox30, Oxda,Ox7a,Ox36,Ox6e,Oxe6,Ox38,Oxfe ,Ox3e }1
0809 3E
.,
080A 27 10 03 E8 00 64 00 OA
1* lcd pattern table
canst long dectable []
0050 0005
unsigned int digit[5]; 1* buffer to hold results from cvt_bin_dec functio *1
0000
registera ac;
1* processor's A register *1
0055
long atodtemp;
1* temp to accumulate 100 aId readings for smoothing "I
0059
long slope;
1* multiplier for adc to engineering units conversion *1
005B
int adcnt;
1* aId converter loop counter *1
005C
long xdcr_offset;
1* initial xdcr offset *1
005E 0060
unsigned long i, j; I * counter for loops * I
0062
5
10000, 1000, 100, 10 };
1* mise variable *1
int k;
struet botbbytes
{ int hi;
int 10;
),
union isboth
long 1;
struct bothbytes b;
),
0063 0002
4-48
union isboth q;
1* used for timer set-up *1
Motorola Sensor Device Data
AN1305
1'* ***'* '* ** *'* **** '* *'* '* '* ***'************ ****** '*.'*** '*'*'* ********-*** -- -,.-* '* ,.,.,.,. ,.._/
/ * code starts here -/
I· * '*. *. '* * '* '* '* '* •• * * * *. '*.* * '*. '* '* * *. *. * * * * * * * *,. * * * * '* * * * '* * * * * * * '* * '* * '** * * * * '* * * * * * * * /
1* these interrupts are not used ... give them a graceful return if for
some reason one occurs * 1
lFFC
0812
lFFA
0813
lFF8
0814
1FF4
0815
1FF2
0816
08
80
08
80
08
80
08
80
08
80
12
RTI
IRQ () !I
13
RTI
TlMERCAF ( ) ()
14
RTI
TIMEROV () !I
15
RTI
BCI() !I
16
RTI
1* '* * * *. * * '* * * * * * * * *. * * * '* * * * '* * •• *. * * * *. *. * * * '* *. * '* * * * *.*. * * * * * * * * ** * '* '* * * '* '* * * * '* /
void delay(void)
/* just hang around for a while *1
(
0817
0818
081A
081C
081E
0820
0822
0824
0826
0828
082A
082C
082E
0830
0832
0834
0836
4F
3F
B7
B6
B7
B6
B7
B6
AO
B6
A2
24
3C
26
3C
20
81
57
58
57
5E
58
SF
SF
20
5E
4E
08
SF
02
5E
EE
CLRA
CLR
STA
LOA
STA
LOA
STA
LOA
SUB
LDA
SBC
BCC
INC
BNE
INC
BRA
RTS
for (i=0; i<20000; ++i);
$57
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$sF
$sF
#$20
$sE
#$4E
$0836
$sF
$0834
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$0824
1* * '* * * *,. * * * * '* * * *,. * * * * * '** *. *'* * * *,. * *. * * * * * * * '* * * ** '* * * * * * *. ** '* * '*.*,. * * *'* * * * ** *,. * /
read_a2d (void)
(
1* read the aId converter on channel 5 and accumulate the result
in atodtemp ,. I
0837
0839
083B
083C
083E
0840
0842
0844
3F
3P
4F
B7
B6
A8
A1
24
56
55
5B
5B
80
E4
21
CLR
CLR
CLRA
STA
LDA
EOR
CMP
BCC
$56
$55
atodtemp=O;
1 * zero for accumulation * /
for ( adcnt = 0 ; adcnt= dectable til )
LSLX
08 OB
6A
07
08 OA
69
5C
LOA
CMP
BNB
LDA
CMP
BEQ
$080B,X
$6A
$092B
$080A,X
$69
$0987
092B BB 6B
0920 58
092E 06 08 OA
LoX
$6B
{
4-52
1
dectable [i] ;
LSLX
LDA
$080A,X
Motorola Sensor Device Data
AN130S
0931
0933
0936
0938
093A
093C
093E
0940
0942
0944
0946
0948
094B
094E
0950
0952
0954
0956
0958
095A
095C
095E
0960
0962
0964
0966
0969
096B
096D
096F
0971
0973
0975
0977
0979
097B
097D
097F
0981
0983
0985
B7
D6
B7
B6
B7
B6
B7
B6
B7
B6
B7
CD
CD
BF
B7
BE
E7
BE
E6
3F
B7
B6
B7
B6
B7
CD
BF
B7
33
30
26
3C
B6
BB
B7
B6
B9
B7
B7
B6
B7
6c
08
6D
6A
58
69
57
6C
66
6D
67
OA
OA
57
58
6B
50
6B
50
57
58
6C
66
6D
67
OA
57
58
57
58
02
57
58
6A
58
57
69
57
69
58
6A
OB
5E
8F
3F
STA
LDA
STA
LDA
STA
LDA
STA
LDA
STA
LDA
STA
JSR
JSR
STX
STA
LDX
STA
LDX
LDA
CLR
STA
LDA
STA
LDA
STA
JSR
STX
STA
COM
NEG
BNE
INC
LDA
ADD
STA
LDA
ADC
STA
STA
LDA
STA
0987 3C 6B
0989 20 8A
098B B6 6A
098D B7 58
098F B6 69
0991 B7 57
0993 BE 6B
0995 B6 58
0997 87 50
INC
BRA
LDA
STA
LDA
STA
LDX
LDA
STA
0999 9B
SEI
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$080B,X
$6D
$6A
$58
$69
$57
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$66
$6D
$67
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$OA8F
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$58
$6B
$50,X
$6B
$50,X
$57
$58
$6C
$66
$6D
$67
$OA3F
$57
$58
$57
$58
$0975
$57
$58
$6A
$58
$57
$69
$57
$69
$58
$6A
$6B
$0915
$6A
$58
$69
$57
$6B
$58
$50,X
digit Ii]
arg
digit [1]
arg I 1;
arg-(digit[i]
*
1);
arg;
1* now zero suppress and send the led pattern to the display *1
Motorola Sensor Device Data
SEl;
4-53
AN1305
Og9A 3D 50
099C 26 04
TST
BNE
CLR
099E 3F 02
09AD 2 a 07
BRA
09A2 BE SO
09A4 06 08 00
LOX
LOA
D9A7 B7 02
STA
09A9
09AB
09AD
09AF
09Bl
09B3
SO
08
51
04
01
07
TST
BNE
TST
BNE
CLR
BRA
09B5 BE 51
LDX
09B7
09BA
09BC
09BE
09Cl
09C2
09C4
06
B7
BE
06
4C
B7
9A
LOA
STA
LOX
LDA
INCA
STA
CLI
ages
CD 08 17
30
26
30
26
3F
20
08 00
01
52
08 00
00
09C8 81
JSR
$50
$09A2
$02
$09A9
$50
$0800,X
$02
$50
$09B5
$51
$09B5
$01
$09BC
$51
$0800,X
$01
$52
$0800,X
o )
if ( digit [OJ
porte
=
I * leading zero suppression '* I
0;
else
porte
=(
lcdtab[digit[O]]
);
if ( digit [oJ == 0 && digit [lJ
/* laO's digit *1
o )
portb=D;
else
/* la's digit */
portb
( lcdtab [digit [lJ J ) I
porta
( lcdtab[digit[2]J+l ); 1* l's digit + decimal point *1
$00
eLI;
$0817
delay() ;
RTS
1* '* * '* * * * '* * * * * * * '* '* * '* * '* '* '* '* '* '* '* '* '* '* '* '* '* '* ** * * '* '* * '* * '* '* '* '* * '* * '* '* '* '* '* '* '* '* * * '* *,., '* '* I
void display---psi (void)
1* At power-up it is assumed that the pressure port of the sensor
is open to atmosphere. The code in initio() delays for the
sensor and power to stabilize. One hundred AID conversions are
averaged and divided by 100. The result is called xdcr_offset.
This routine calls the AID routine which performs one hundred
conversions, divides the result by 100 and returns the value.
If the value returned is less than or equal to the xdcr_offset,
the value of xdcr_offset is substituted. If the value returned
is greater than xdcr_offset, xdcr_offset is subtracted from the
returned value. That result is multiplied by a constant to yield
pressure in PSI * 10 to yield a "decimal point".
"{
while (1)
{
09C9 3F 59
09CB A6 40
ageD B7 SA
09CF B6 03
0901 A4 co
0903 B7 62
CLR
LOA
STA
LOA
AND
STA
09D5 Al 80
CMP
0907
0909
090B
0900
BNE
CLR
LOA
STA
LDA
26
3F
A6
B7
06
59
41
SA
09DF B6 62
4-54
$59
#$40
$5A
$03
#$CO
$62
#$80
$090F
$59
#$U
$5A
$62
= 64;
slope
k
portd &. OxcO;
if ( k ==
slope
=
if ( k
oxeo
1* this lets us "rubber" the slope to closer fit
the slope of the sensor * I
1* J2 removed, J1 installed * I
65;
Ox40 ) 1* Jl removed, J2 installed *1
Motorola Sensor Device Data
AN1305
09El Ai 40
CMP
#$40
09E3 26 06
BNE
$09EB
09ES 3F 59
09E7 A6 3F
CLR
$59
LOA
#$3F
09E9 B7 SA
STA
$5A
D9EB
09EE
09FO
09F2
09F4
D9F6
$OB37
3F 55
JSR
CLR
B7 56
STA
$56
BO 50
SUB
$50
B7 5B
STA
$5B
$5C
#$BO
CD OB 37
63;
1* else both jumpers are removed or installed ... don't change the slope *1
atodtemp = read_a2d() i
1* atodtemp = raw aid ( O.. 255 ) *1
$55
B6 5C
LOA
09FB AB BO
EOR
D9FA
09FC
09FE
DAOO
OAD2
STA
$57
B6 55
LOA
AB BO
EOR
$55
#$BO
B2 57
SBC
$57
BA 5B
ORA
$58
DAD4 22 08
DAD6 B6 5C
DADS B7 55
DADA B6 50
BHI
$OAOE
LOA
STA
$5C
$55
LOA
$50
DADC
OADE
DA1D
DA12
DA14
DA16
DA18
OA1A
OA1C
OA1E
DA2D
DA22
OA24
DA26
DA28
OA2A
OA2D
OA2F
OA31
DA34
OA36
B7 56
B6 56
STA
LOA
$56
B7 57
slope
if ( atodtemp <= xdcr_offset
atodtemp
atodtemp
$56
BO 50
SUB
$50
B7 56
STA
$56
B6 55
LOA
$55
B2 5C
SBC
B7 55
STA
$5C
$55
B6 56
LOA
$56
B7 58
B6 55
STA
LOA
$58
B7 57
STA
$57
B6 59
LOA
$59
B7 66
STA
$66
B6 SA
LOA
B7 67
STA
$67
CD OA 3F
$OA3F
BF 55
JSR
STX
B7 56
STA
$56
CO 08 FE
JSR
$08FE
20 93
BRA
$09C9
81
RTS
xdcr_offset;
xdcr_offset; 1* remove the offset *1
atodtemp *= slope; 1* convert to psi *1
$55
$5A
$55
cvt_bin_dec( atodtemp ); 1* convert to decimal and display *1
1 *** * * **** * * * * **** **** ** ** * - * - - - ****** - - *** *-****- -- *****- ** * - ********** * 1
maine)
OA37
OA3A
DA3C
OA3E
CD 08 CE
JSR
$08CE
AD 80
BSR
$09C9
20 FE
81
BRA
$OA3C
RTS
DA3F BE 58
OA41 B6 67
LOX
LOA
initio(); 1* set-up the processor's ilo *1
display---psi ();
while (1) ;
1* should never get here * /
$58
$67
Motorola Sensor Device Data
4-55
AN1305
OA43 42
OM4
OA46
OA48
OMA
OA4C
OA4D
B7 70
BF 71
BE 57
B6 67
42
BB 71
B7 71
BE 58
OA4F
OASl.
OA53 B6
OA55 42
OA56 BB
OA58 B7
OA5A 97
OA5B B6
OA5D 81
66
MOL
STA
$70
STX
LDX
LDA
$71
$57
$67
MOL
ADD
STA
LDX
$71
$71
$58
LDA
MOL
ADD
$66
71
STA
TAX
$71
70
LDA
RTS
$70
CLR
CLRX
CLR
$70
CLR
INCX
LSL
ROL
ROL
ROL
$6F
OA6E B6 6E
OA70 BO 67
OA72 B7 6E
LDA
SUB
STA
$6E
$67
$6E
OA74
OA76
OA78
OA7A
OA7C
LDA
SBC
STA
BCC
LDA
$6F
$66
$6F
$OA89
$67
ADD
STA
LDA
$6E
$6E
$66
ADC
STA
SEC
$6F
$6F
71
OA5E 3F 70
OA60 SF
0A61
OA63
OA65
OA66
OA6S
OA6A
OA6C
3F 6E
3F 6F
5C
38 58
39 57
39 6E
39 6F
B6
B2
B7
24
B6
6F
66
6F
OD
67
OA7E BB 6E
OA80 B7 6E
OAB2 B6 66
OA84 B9 6F
OA86 B7 6F
OA88 99
OA89 59
OABA 39 70
OA8C 24 D8
OA8E 81
OA8F
OMO
OA91
OA93
OA94
53
9F
BE 70
53
81
lFFE OA 37
4-56
$71
$6E
$58
$57
$6E
$6F
ROLX
ROL
BCC
$70
$OA66
RTS
COMX
TXA
LDX
$70
COMX
RTS
Motorola Sensor Device Data
AN130S
SYMBOL TABLE
LABEL
VALUE
IRQ
0813
0815
OA3F
0000
001A
0009
0000
0005
0050
0000
0015
0060
0001
TlMEROV
_MUL16x16
_STOP
acnthi
adstat
b
ddrb
digit
hi
icaplol
j
10
ocmphi2
plmb
portd
scientll.
slope
tar
~OlE
OOOB
0003
OOOE
0059
0013
LABEL
VALUE
LABEL
VALUE
LABEL
VALUE
SCI
0814
0066
l.FPE
0000
005B
0069
08FE
TIMERCMP
_MUL
_STARTUP
DaDA
delay
fixcompare
icaphi2
isboth
lcdtab
oomphil
plma
089B
0000
0000
0057
0008
0055
0004
0817
0880
DOle
0002
0800
0016
0816
QASE
TlMERCAP
_LDIV
_RDIV
OABF
_RESET
_SWI
0812
001B
_WAIT
aentlo
adzero
bothbytes
OBA4
ddrc
display-psi
i
icaplo2
0002
0006
0ge9
DOSE
a01D
_LongIX
adcnt
arg
evt_bin_dec
dectable
eeclk
icaphil
initio
k
0062 I 1
main
oomplol.
porta
OA37
q
scicnt12
tenth!
xdcr_offset
MEMORY USAGE MAP ('X'
=
used,
I_'
0017
0000
0063
OOOF
0018
DOSe
0007
0014
DaCE
0000
I mise
ocmplo2
portb
read_a2d
Bcidata
tontlo
oooe
OOlF
0001
0837
0011
0019
_longAC
addata
atodtemp
ddra
porte
scibaud
scistat
tor
DODA
0002
0000
0010
0012
= Unused)
0100
---------------- ---------------- ---------------- ----------------
0140
0180
OleO
---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- --------------x-
a8 a0
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
084 a
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx
08 B a
XXXXXXXXXXXXXXXX
OBCO
XXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXX
0900
XXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
xxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx.
:XXXXXXXXXXXXXXXX
xxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx
0940
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
09 B 0
09CO
XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
OAO 0
XXXXXXXXXXXXXXxx. XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXX xxxxx----------- ---------------- ------------------------------- ---------------- ---------------- ----------------
OA40
OA80
OACO
xxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx
lPOO
---------------- ---------------- ---------------- ----------------
1F40
1F80
---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- ----------------
lFCO
---------------- ---------------- ---------------- --XXXXXXXXXXXXXX
All other memory blocks unused.
Errors
0
warnings
Motorola Sensor Device Data
4-57
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1307
A Simple Pressure Regulator Using
Semiconductor Pressure Transducers
Prepared by: Denise Williams
Discrete Applications Engineering
INTRODUCTION
Semiconductor pressure transducers offer an economical
means of achieving high reliability and performance in
pressure sensing applications. The completely integrated
MPX5100 (0-15 PSI) series pressure transducer provides a
temperature-compensated and calibrated, high-level linear
output that is suitable for interfacing directly with many linear
control systems. The circuit described herein illustrates how
this sensor can be used with a simple pressure feedback
system to establish pressure regulation.
Figure 1. DEVB-104 MPX5100 Pressure Regulator
REV 1
4-58
Motorola Sensor Device Data
AN1307
+5V
2
RG
ICt - MC33079
RG-tOK
POT
Figure 2. High Level, Ground Referenced Output Using an MPX2000 Series Transducer
THE SENSOR
The MPX5100 is the next level of integration beyond the
MPX2000 series. The MPX2000 series of pressure
transducers already incorporates, on-;:hip, more than a
dozen external components needed for temperature
compensation and offset calibration. Figure 2 shows the basic
circuitry required to create a ground referenced output
amplified to a high-level from an MPX2100 (0-15 PSI)
transducer. For optimum performance, matched metal film
resistor pairs and precision operational amplifiers are
required.
The MPX5100 goes one step further by adding the
differential to ground referenced conversion and the
on-;:hip.
Therefore,
the
amplification
circuitry
eighteen-;:omponent circuit shown in Figure 2 can be reduced
to one signal-;:onditioned sensor, as shown in Figure 3.
All of the MPX devices contain a single piezoresistive
implant which replaces the four-element Wheatstone bridge
circuit found in most semiconductor-based transducers. The
MPX5100 transducer uses an interactively laser-trimmed,
four-stage network to perform signal conditioning. Figure 4 is
an internal block diagram of the MPX51 00 showing these four
stages.
Motorola Sensor Device Data
The first stage compensates for the temperature coefficient
of offset while the second stage performs the differential to
single-ended conversion. Stage three is a precision voltage
reference that calibrates the zero pressure offset of the entire
system, which comprises the sensor offset and the input offset
voltages of the other three operational amplifiers. The final
stage provides the full-scale span calibration. The MPX5100
is compensated for operation over 0 to 85°C with a response
time (10% to 90%) of 1.0 msec.
+5V
~---oVout
Figure 3. High Level, Ground Referenced
Output Using an MPX5100
4-59
AN1307
PIN3
+5 V SOURCE
Rll
RG
Vp~~----~~----~
Vex
VS+
'VVV THIN FILM RESISTOR
.yI,
PIN2
LASER TRIMMABLE RESISTOR
Figure 4. Fully Integrated Pressure Sensor Schematic
Some terms commonly used when discussing pressure
sensors are:
• VFSS (Full Scale Span) - the output voltage variation between zero differential pressure applied to the sensor and
the maximum recommended operating pressure applied to
the sensor, with a given supply voltage.
•
VOFF (Offset) - the voltage output given by a sensor with
zero differential pressure applied, with a given supply voltage.
•
Sensitivity - the amount of output voltage variation per
unit pressure input variation.
•
Linearity - the maximum deviation of the output from a
straight line relationship over the operating pressure range.
4-60
Motorola specifies linearity using an "end-point straight
line" method.
Each transducer is laser trimmed to provide the specified
VFSS with the supply voltage indicated on the data sheet. For
example, VFSS for the MPX5100 is trimmed to 4.0 V with a
supply voltage of +5.0 Vdc.
For the MPX5100, VOFF = 0.5 V with a 5.0 Vdc supply.
Therefore, the output of the sensor varies from 0.5 V to 4.5 V
for differential pressures from 0 kPa to 100 kPa, respectively.
This is ideal for interfacing directly with many linear devices
such as the MC33033 motor controller described in this
application note or the AID of a microprocessor controlled
system.
Motorola Sensor Device Data
AN1307
THE CIRCUIT
Figure 5 is a block diagram of a simple pressure regulator
feedback system. The motor/pump is used to fill a reservoir as
required. The pressure created in this reservoir is monitored
with a gauge and fed back to the MPX51 00 sensor. The sensor
provides an output voltage to the Motor Drive Circuitry which
is proportional to the monitored pressure.
Figure 5. System Block Diagram
The Pressure Select Circuitry allows the user to choose a
desired pressure by creating a reference voltage. This
reference voltage is equivalent to the sensor output when the
desired pressure exists in the system. A comparison is made
between the sensor output and the reference voltage. When
the system pressure is below the selected pressure, the motor
is turned on to increase the pressure. When the system
pressure reaches the selected pressure, the motor/pump
turns off. Hysteresis is used to set different trip voltages for
turn-off and turn-on to allow for noise and pressure
fluctuations.
For particular applications that only require one fixed
regulated pressure, the Pressure Select Circuitry can be
reduced to a single voltage reference. Additionally, the Motor
Drive Circuitry can be simplified depending on the application
requirements and the motor to be used. Since a +5.0 Vdc
supply to the sensor provides an output that is ideal for
interfacing with an AID converter, this comparison could
easily be converted to a software function, allowing for a digital
pressure select input as well as controlling a digital display.
R2
470
01
114 MPM3002
02
114 MPM3002
MOTOR.
MOTOR-
04
1/4 MPM3002
R4
47
R6
24
R13
330
GND
Figure 6. MPX5100 Pressure Regulator
Motorola Sensor Device Data
4-61
AN1307
DETAILED CIRCUIT DESCRIPTION
The Supply Voltage
Figure 6 is a schematic of the control electronics for this
pressure regulator system. The + 12 Vdc supply is used by the
MPM3002 power transistors, the MC33033 motor controller
and the MC34272 operational amplifier. In addition, this
voltage is regulated down to +5.0 Vdc for the sensor supply.
The Pressure Select Circuitry
R11, R12 and R13 provide a variable reference from 0.5 V
to 4.5 V. By adjusting R 12, the reference voltage can be set to
the desired pressure turn-off point. The error amplifier internal
to the MC33033, along with R8, R9 and R1 0, is configured as
a comparator with hysteresis. The sensor output voltage and
the reference voltage are inputs to the comparator and are
used to determine when the motor is turned on or turned off.
When the sensor output is less than the reference voltage the
motor is on. Pressure in the system increases until the sensor
output is equal to the reference voltage plus the hysteresis
voltage then the motor is turned off. If the pressure decreases
while the motor is off, the sensor output will decrease until it
is equal to the reference voltage at which time the motor turns
on.
Hysteresis is set to prevent the motor from turning off and
on due to small voltage variations such as noise or small
pressure fluctuations in the system. The ratio of R10 to both
R8 and R9 can be adjusted to provide the hysteresis required
in a particular application. The resistor values shown in Figure
6 provide a ratio of 300 kQ to 10 kn. This corresponds to a
hysteresis of 300 mV or 7.5 kPa between the turn-off and
turn-on trip pOints. The operational amplifier (MC34272) is
used to provide a low impedance output to isolate the divider
network from the comparator circuit.
The Motor Drive Circuitry
In a brush motor drive, the primary function of the controller
IC is to translate speed and direction inputs into appropriate
drive for the power transistors. This can be done efficiently by
using the MC33033 Brushless DC controller as shown in
Figure 6. In a brushless application, two of six output
transistors are switched on in response to Hall sensor inputs
HA, HB and HC. In order to drive a brush motor, all that is
required is to select a single Hall code that will drive a four
transistor H-bridge in a way that is suitable for brush motors.
By using phase A and phase C outputs, a 1-0-0 Hall code
produces the correct drive for brush motors. AT, BT and CT are
open collector outputs, therefore, a logic 0 represents the on
state. Conversely, AS, BS and CB are totem pole drivers, and
a logic 1 turns on the corresponding output transistor.
Generating the Hall code is easy. Since it is fixed at 1-0-0,
tying the Hall inputs to DC levels is sufficient. Logic 1 is
obtained from VREF, and logic 0 from ground. The result is the
4-62
connections for pins 4, 5 and 6 that are shown in Figure 6. In
addition to providing drive to the output transistors, the
MC33033 has a current limit function and controls speed by
pulse width modulating the lower output transistors, 03 and
04. The current limit operates on a 100 mV threshold. Once
tripped, it latches the lower transistor drive off until the next
clock cycle begins. The latching feature prevents high
frequency oscillations which would otherwise overheat the
power transistors. Compatibility with SENSEFETsTM is
provided by the 100 mV threshold and allows the lossless
current sensing configuration that is also shown in Figure 6.
For low-power, low-voltage motors, level shifting the
gate-drain for 01 and 02, the upper output transistors, is not
a problem. Open collector tOjrSide outputs in the MC33033
interface directly to P-Channel MOSFETs. All that is required
in the way of top-side drive circuitry is gate-to-source
resistors on the P-Channel transistors, such as R2 and R3 in
Figure 6.
Since an H-Bridge motor drive uses four power transistors,
a power module can considerably simplify the output stage.
The MPM3002 that is shown as 01, 02, 03 and 04 in Figure
6 is ideally suited to fractional horsepower motor drives. It
consists of two P-Channel MOSFETs and two N-Channel
SENSEFETs connected in an H-Bridge configuration, and
housed in an isolated 12-pin, single, in-line package. The
P-Channels have a maximum on-resistance of 0.4 ohms, and
the N-Channels 0.15 ohms. All four transistors have 100 V
breakdown ratings.
The MPM3002's P-ChanneI/N-Channel configuration
makes interfacing to an MC33033 controllC especially easy.
The schematic shows an example. The SENSEFETs are
connected to outputs AB and CB through series gate resistors,
and the P-Channels are connected directly to AT and CT and
tied to the + 12 V rail through pull-up resistors. If the source
voltage is greater than + 12 V, a divider can be used to keep
gate voltage on the P-Channels within reasonable limits.
In the schematic, the mirror outputs of both SENSEFETs are
tied together. They are then fed into the MC33033's current
limit input through a noise suppression filter consisting of R7
and C3. Since only one SENSEFET is on at any given time,
this connection is a logic wired-OR. It provides overcurrent
protection for both directions of motor rotation, and does not
alter trip pOints for the individual legs. The trip point is
calculated with the aid of the following expression.
IUMIT=VSENSE (RSENSE - rm(on»/(ra(on) ·RSENSE)
Where:
VSENSE is sense voltage
RSENSE is the mirror-to-source sense resistor
rm(on) is mirror-active resistance = 112 ohms
ra(on) is source-active resistance = 0.14 ohms
Motorola Sensor Device Data
U
AN1307
o
8
+
81C2 51
000
FIR
o
o
MPX5100 0 0 0 0
(XDCR1) RS R11 R9 R1
'"
0 0 0 @
glCllD
;;; D
CIlD
! D
:
0
000
C2 R5
0
0
R3
q,
O!!!!!Hl!!!!!Hl!!~
MC33033
0 !!!!!!!!!!!l!l!!!!!!
CIlD
~ IC3
00 0 0000
R6 ~4 R7 R4 R1 R2
0
0000
0
C;;
0
C5 R12 0
o~O
R13
o
DODD
C100
o~
D
D
o
MPX5100 PRESSURE REGULATOR
+12GND+M-M
0
a a a a
CIlD
CIlD
CIlD
CIlD
o :
CIlD
:
c
CIlD
~
a a a
!!!!!!!!!!!l!l!!!!!!!!!!!!!!!!!!!!!!!l!l!!
o
Figure 7. PCB Component
Layout
••
•
•
•••
•
o
PRESSURE
!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!
SELECT
~~~~~~~ DI;~~~TE APPLICATIONS
--
••
••••••••••• 11 ••••••••
• •••••••••••••••••••••
Figure 9. PCB Solder
Side Artwork
•
~~~~::
-•
_ t -,-j-r'
~
.................... .
•••••••••••••••••••••
Figure 8. PCB Component
Side Artwork
•
Figures 7, 8, and 9 show a printed circuit board and
component layout for the electronics portion of this pressure
regulator system, and Table 1 is the corresponding parts list.
System Performance
The entire system draws 4.0 Amps with all but 50 mA used
to drive the motor/pump. The pressure sensor provides a
sensitivity to regulate well within a few kPa. However, most
applications can allow far greater fluctuations in pressure. The
system performance, therefore, depends mostly on the
motor/pump selected and the hysteresis set in the control
circuitry. Using a well-sealed pump will help ensure the motor
turns off when the desired pressure is reached. Many pumps
are designed to leak to prevent over inflation. In this case, the
circuit will turn the motor off until the pressure is reduced,
through leakage, by the deSigned hysteresis amount, then
turn on and continue cycling to hold the pressure in the desired
range.
Since the current limit threshold in the MC33033 is 100 mV,
current limiting will occur when VSENSE reaches 100 mV. For
the circuit in Figure 6, using 100 mV for VSENSE, and with
RSENSE R6 24 ohms then:
= =
ILiMIT = 0.1 (24 +112)/(0.14·24) = 4.1 Amps
By using SENSEFETs in the lower half bridge in lieu of a
power sense resistor in series with the motor, about 1/2 watt
(4.1 A· 0.1 V) of dissipation is saved.
Motorola Sensor Device Data
4-63
AN1307
Table 1. Parts List for Pressure Regulator PC Board
Reference Designator
Qty
Description
Comments
MISCELLANEOUS
1
2
1
4
6
2
1
S1
PC Board
InpuVOutput Terminals
Heat Sink
1/2" nylon standoffs, threaded
1/2" nylon screws
4-40 nylon nuts
switch
See Figures 7-9
PHX CONT #1727036
for ICePAKTM
SS-12SDP2
RESISTORS, FIXED
Comp., ±5%, 1/4 W
R1, R4
R2,R3
R5,R8,R9
R6
R7
R10
R11
R13
2
2
3
1
1
1
1
1
47Q
470Q
10k(!
24Q
1 kQ
300kQ
3900Q
330Q
R12
1
10 kQ, one turn
RESISTORS, VARIABLE
3386P-1-103-T
INTEGRATED CIRCUITS
IC1
IC2
IC3
01-04
1
1
1
1
Motor Controller
Reference
Operational Amplifier
Integrated H-Bridge
XDCR1
1
MPX5100DP
C1
C2
C3
C4
C5
1
1
1
1
1
MC33033P
78L05
MC33272P
MPM3002
SENSOR
CAPACITORS
220I!F, 25 V
0.005 J!F, ceramic, 25 V
0.001 J!F, ceramic, 25 V
1 J!F, ceramic, 50 V
0.01 J!F, ceramic, 25 V
CONCLUSION
REFERENCE
This circuit is one example of how the MPX5100 with its
high level output can directly interface with linear systems. It
provides a simple design alternative where pressure
measurement or control is required.
1. Schultz, Warren. "ICs Simplify Brush DC Motor Drives,"
Motion, November 1989.
4-64
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1309
Compensated Sensor Bar Graph
Pressure Gauge
Prepared by: Warren Schultz
Discrete Applications Engineering
INTRODUCTION
Compensated semiconductor pressure sensors such as
the MPX2000 family are relatively easy to interface with digital
systems. With these sensors and the circuitry described
herein, pressure is translated into a 0.5 to 4.5 volt output range
that is directly compatible with Microcomputer ND inputs. The
0.5 to 4.5 volt range also facilitates interface with an LM39t 4,
making Bar Graph Pressure Gauges relatively simple.
Figure 1. DEVB147 Compensated Pressure Sensor Evaluation Board
Motorola Sensor Device Data
4--65
AN1309
PIN-BY-PIN DESCRIPTION
EVALUATION BOARD DESCRIPTION
The information required to use evaluation board number
DEVB147 follows, and a discussion of the design appears in
the Design Considerations section.
FUNCTION
The evaluation board shown in Figure 1 is supplied with an
MPX2100DP sensor and provides a 100 kPa full scale
pressure measurement. It has two input ports. PI, the
pressure port, is on the top side of the sensor and P2, a
vacuum port, is on the bottom side. These ports can be
supplied up to 100 kPa (15 psi) of pressure on PI or up to 100
kPa of vacuum on P2, or a differential pressure up to 100 kPa
between PI and P2. Any of these sources will produce the
same output.
The primary output is a 10 segment LED bar graph, which
is labeled in increments of 10% of full scale, or 10 kPa with the
MPX2100 sensor. An analog output is also provided. It
nominally supplies 0.5 volts at zero pressure and 4.5 volts at
full scale. Zero and full scale adjustments are made with
potentiometers so labeled at the bottom of the board. Both
adjustments are independent of one another.
ELECTRICAL CHARACTERISTICS
The following electrical characteristics are included as a
guide to operation.
Characteristic
Symbol
Min
Typ
Max
Units
Power Supply Voltage
B+
6.8
-
13.2
de Volts
PFS
-
-
100
kPa
PMAX
-
-
700
kPa
VFS
-
4.5
-
Volts
VOFF
-
0.5
-
Volts
Analog Sensitivity
SAOUT
-
40
mV/kPa
Quiescent Current
ICC
-
40
-
Full Scale Current
IFS
-
160
-
rnA
Full Scale Pressure
Overpressure
Analog Full Scale
Analog Zero Pressure
Offset
mA
B+:
Input power is supplied at the B+ terminal. Minimum input
voltage is 6.8 volts and maximum is 13.2 volts. The upper limit
is based upon power dissipation in the LM3914 assuming all
10 LED's are lit and ambient temperature is 25°C. The board
will survive input transients up to 25 volts provided that
average power dissipation in the LM3914 does not exceed 1.3
watts.
OUT:
An analog output is supplied at the OUTterminal. The signal
it provides is nominally 0.5 volts at zero pressure and 4.5 volts
at full scale. Zero pressure voltage is adjustable and set with
Rll. This output is designed to be directly connected to a
microcomputer AID channel, such as one of the E ports on an
MC68HCll.
GND:
There are two ground connections. The ground terminal on
the left side of the board is intended for use as the power
supply return. On the right side of the board one of the test
point terminals is also connected to ground. It provides a
convenient place to connect instrumentation grounds.
TP1:
Test point 1 is connected to the LM3914's full scale
reference voltage which sets the trip point for the uppermost
LED segment. This voltage is adjusted via Rl to set full scale
pressure.
TP2:
Test pOint 2 is connected to the +5.0 volt regulator output.
It can be used to verify that supply voltage is within its 4.75 to
5.25 volt tolerance.
PI, P2:
CONTENT
Board contents are described in the parts list shown in
Table 1. A schematic and silk screen plot are shown in Figures
2 and 6. A pin by pin circuit description follows.
4-66
Pressure and Vacuum ports PI and P2 protrude from the
sensor on the right side of the board. Pressure port PI is on
the top and vacuum port P2 is on the bottom. Neither port is
labeled. Maximum safe pressure is 700 kPa.
Motorola Sensor Device Data
AN1309
+
ON/OFF~
~~\ ~1~ .,D2 ~ D3, D\ ~5 ~6, ~7, D
\\ \~ \\ \\ \~ \\ \\ \\ \\ \\
D9
JJI
II'F
Q I
U3A
3
L....-''---
2 vMC33274
R6
D2
O.II'F
Ul 3
-=
I
0 1
MC78L05ACP
G
2
R7 75
'A
g
2 R8 75
4
1
-'XDCRI
MPX2100DP
GN[)
-=
-
r
R13
;> 1 k
-A~~
1k
RIO
"'h ~
.A
200
-=
1~14
1~.r
ZERO
CAL.
rl
+MC33274
~
+
-=
1 LED U2
~ GND
3 S+
5 RLO
SIG
7 RHI
~ REF
7.5 k
~~D
~ R3
LED 17
LED~
LED
LED
LED
LED
t§8
"'i
FULL SCALE CAL.
R4
~
R2
1k
U3C
-=
-b
TP2 +5 VOLTS
> R14
.......,
~
8
"'i
470
011
\ \ MV57124A
POWER ON INDICATOR
R12
470
"
-=
R9
.AA
11n
GNO
~ 2.7k
~
v-:!:!1
14
13
12
11
TPI (FULL SCALE VOLJAGE)
Rl
.(> 1 k
6 -MC33274
9
LED~
LM3914N
1.2 k
7
Dl-0l0
MV57164
BAR
GRAPH
-=
1k
ANALOG OUT
Figure 2. Compensated Pressure Sensor EVB Schematic
n~'~I'F
U2B
XOCR
1--'-+-_-iMPX2100r----_ _7-l:~
r-+----,-=
MC78L05ACP
C2
Ill'F
R3
R4 1 k
GNO
PU
R5
1k
NOTE:
For zero pressure voltage independent
of sensor common mode R6/R7 = R2IRI
1k
1k
R7
VOFFSET o-----J-
r
VREFL
0.302 V
1
-;
VREFH
453 OHMS
1%
GND
~
~_
I':- -
PRESSUREI
VACUUM
"
IN
~
MC68HC11
0
_1
_2
_3
_4
_5
_6
_7
PORTE
Figure 5. Application Example
0
0
COMPENSATED PRESSURE SENSOR EVB
% FULL SCALE
100
D
90
0
0
0
0
0
0
0
0
0
80
70
60
50
40
30
20
10
D
D
D
POWER
+~
0
B+
OUT
GND
"~g
OFF
KP~"~
00 0
0
0
0
0
0
0
0
0
0
0
0
0
0
.... 0
'"
;:::
~
0
:2
0
0
0
0
o
C1
U3
0
0
z..,.
0
gj
:2 0
0
0
0
0
0
0
0
D
0
...J
0
0
0
::>
'"' 0
0
0
0
00
C2
D
0
0
0
D
U2
R12
R2
0
0
R3
0
Rl0
R9
R4
0
0
0
R5
0
RS
0
R6
0
SENSOR
"'~
o
TP2
~~~~~00~~~
0
0
0
0
0
0
0000000
0000000
0000000
0
0
R14
R13
0
0
0
TPl
0
DEVB147
~~~~
o
a:
a:
0
MOTOROLA DISCRETE APPLICATIONS
0000
0
0
ZERO
FULL SCALE
GND
0
0
Figure 6. Silk Screen
4-70
Motorola Sensor Device Data
AN1309
Table 2. Parts List
Designator
Qty.
Description
Value
Vendor
Part
Cl
C2
1
1
Ceramic Capacitor
Ceramic Capacitor
Dl·Dl0
Dll
1
1
Bar Graph LED
LED
R2
R3
R4,R5,R9,R13
R6
R7,R8
Rl0
R12,R14
Rl
Rll
1
1
4
1
2
1
2
1
1
1/4 Watt
1/4 Watt
1/4 Watt
1/4 Watt
1/4 Watt
1/4 Watt
1/4 Watt
Trimpot
Trimpot
Sl
1
Switch
NKK
12SDP2
Ul
U2
U3
1
1
1
5.0 V Regulator
Bar Graph IC
OpAmp
Motorola
National
Motorola
MC78L05ACP
LM3914N
MC33274P
XDCRl
1
Pressure Sensor
Motorola
MPX2100DP
-
1
1
1
1
Terminal Block
Test Point Terminal (Black)
Test Point Terminal (Red)
Test Point Terminal (Yellow)
Augat
Components Corp.
Components Corp.
Components Corp.
2SV03
TPl 0401 00
TPl 0401 02
TPl 0401 04
-
Motorola Sensor Device Data
Film
Film
Film
Film
Film
Film
Film
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
1.01lF
O.lIlF
2.7K
1.2K
1.0K
7.5K
75
820
470
1.0K
200
GI
GI
MV57164
MV57124A
Bourns
Bourns
3386p·l-l02
3386P-1-201
4-71
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1315
An Evaluation System Interfacing
the MPX2000 Series Pressure Sensors
to a Microprocessor
Prepared by: Bill Lucas
Discrete Applications Engineering
INTRODUCTION
Outputs from compensated and calibrated semiconductor
pressure sensors such as the MPX2000 series devices are
easily amplified and interfaced to a microprocessor. Design
considerations and the description of an evaluation board
using a simple analog interface connected to a
microprocessor is presented here.
PURPOSE
The evaluation system shown in Figure 1 shows the ease
of operating and interfacing the MOTOROLA MPX2000 series
pressure sensors to a quad operational amplifier, which
amplifies the sensor's output to an acceptable level for an
analog-to-digital converter. The output of the op amp is
connected to the AID converter of the microprocessor and that
analog value is then converted to engineering units and
displayed on a liquid crystal display (LCD). This system may
be used to evaluate any of the MPX2000 series pressure
sensors for your specific application.
DESCRIPTION
The DEVB 158 evaluation system is constructed on a small
printed circuit board. Designed to be powered from a 12 Vdc
power supply, the system will display the pressure applied to
the MPX2000 series sensor in pounds per square inch (PSI)
on the liquid crystal display. Table 1 shows the pressure
sensors that may be used with the system and the pressure
range associated with that particular sensor as well as the
jumper configuration required to support that sensor. These
jumpers are installed at assembly time to correspond with the
supplied sensor. Should the user chose to evaluate a different
sensor other than that supplied with the board, the jumpers
must be changed to correspond to Table 1 for the new sensor.
The displayed pressure is scaled to the full scale (PSI) range
of the installed pressure sensor. No potentiometers are used
in the system to adjust its span and offset. This function is
performed by software.
Figure 1. DEVB158 2000 Series LCD Pressure Gauge EVB
4-72
Motorola Sensor Device Data
AN1315
The signal conditioned sensor's zero pressure offset
voltage with no pressure applied to the sensor is empirically
computed each time power is applied to the system and stored
in RAM. The sensitivity of the MPX2000 series pressure
sensors is quite repeatable from unit to unit. There is a facility
for a small adjustment of the slope constant built into the
program. It is accomplished viajumpersJ4 thru J7, and will be
explained in the OPERATION section.
Figure 2 shows the printed circuit silkscreen and Figures 3A
and 38 show the schematic for the syslem.
Table 1.
Sensor Type
MPX2010
MPX20S0
MPX2100
MPX2200
MPX2700
Jumpers
Input Pressure
PSI
JB
J3
J2
J1
0-1.S
0-7.S
0-1S.0
0-30
0-100
IN
OUT
OUT
OUT
OUT
IN
IN
IN
IN
OUT
IN
IN
OUT
OUT
IN
IN
OUT
IN
OUT
IN
I
LCD1
U5
J1§
J2
J3
J5
J40"'
J6
J7
P1
DEVB158
2.9"
-I
Figure 2. Printed Circuit Silkscreen
Motorola Sensor Device Data
4-73
AN1315
The analog section of the system can be broken down into
two subsections. These sections are the power supply and the
amplification section. The power supply section consists of a
diode, used to protect the system from input voltage reversal,
and two fixed voltage regulators. The 5 volt regulator (U3) is
used to power the microprocessor and display. The 8 volt
regulator (U4) is used to power the pressure sensor, voltage
references and a voltage offset source.
The microprocessor section (U5) requires minimal support
hardware to function. The MC34064P-5 (U2) provides an
under voltage sense function and is used to reset the
microprocessor at system power-up. The 4.0 MHz crystal
(Y1) provides the external portion of the oscillator function for
clocking the microprocessor and providing a stable base for
timing functions.
Table 2. Parts List
Designators
Quant.
C3, C4, C6
3
Cl, C2, C5
C7,C8
Jl-J3, J8
Description
Rating
Manufacturer
50Vdc
3
1 !,F Ceramic Cap.
50Vdc
muRATA ERIE
RPE123Z5Ul05M050V
2
22 pF Ceramic Cap.
100 Vdc
Mepco/Centralab
CN15A220K
30R4
J4-J7
1
Sprague
Part Number
0.1 !,F Ceramic Cap.
#22 or #24 AWG lined Copper
As Required
Dual Row Straight 4 Pos.
Arranged On 0.1" Grid
AMP
lCl05Z5Ul04M050B
87227-2
LCDl
1
Liquid Crystal Display
lEE
LCD5657
Pl
1
Power Connector
Phoenix Contact
MKDS 1/2-3.81
Rl
1
6.98K Ohm resistor 1%
R2
1
121 Ohm Resistor 1%
R3
1
200 Ohm Resistor 1%
R4,Rll
2
4.7K Ohm Resistor
R7
1
340 Ohm Resistor 1%
R5,R6
2
2.0K Ohm Resistor 1%
R8
1
23.7 Ohm Resistor 1%
R9
1
976 Ohm Resistor 1%
Rl0
1
1K Ohm Resistor 1%
R12
1
3.32K Ohm Resistor 1%
R13
1
4.53K Ohm Resistor 1%
R14
1
402 Ohm Resistor 1%
R15
1
10 Meg Ohm Resistor
RPl
1
47K Ohm x 7 SIP Resistor 2%
TPl
1
Test Point
Ul
1
Quad Operational Amplifier
Motorola
MC33274P
U2
1
Under Voltage Detector
Motorola
MC34064P-5
U3
1
5 Volt Fixed Voltage Regulator
Motorola
MC78L05ACP
U4
1
8 Volt Fixed Voltage Regulator
Motorola
MC78L08ACP
US
1
Microprocessor
Motorola
Motorola
MC68HC705B5FN or
XC68HC705B5FN
XDCR
1
Pressure Sensor
Yl
1
Crystal (Low Profile)
No Designator
1
No Designator
4
No Designator
1
Bare Printed Circuit Board
No Designator
4
Self Sticking Feet
Red
CTS
770 Series
Components Corp.
TP-l04-01-{)2
Motorola
MPX2xxxDP
CTS
ATS040SLV
52 Pin PLCC Socket for US
AMP
821-575-1
Jumpers For J4 thru J7
Molex
15-29-1025
Fastex
5033-<>1-{)0-5001
4.0 MHz
Note: All resistors are 1/4 W resistors with a tolerance of 5% unless otherwise noted.
All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted.
4-74
Motorola Sensor Device Data
AN1315
OPERATIONAL CHARACTERISTICS
PIN-BY-PIN DESCRIPTION
The following operational characteristics are included as a
guide to operation.
+12:
Input power is supplied at the +12 terminal. The minimum
operating voltage is 10.75 Vdc and the maximum operating
voltage is 16 Vdc.
Symbol
Min
Max
Unit
Power Supply Voltage
+12
10.75
16
Volts
Operating Current
ICC
75
mA
The ground terminal is the power supply return for the system.
Full Scale Pressure
MPX2010
MPX2050
MPX2100
MPX2200
MPX2700
Pis
1.5
7.5
15
30
100
PSI
PSI
PSI
PSI
PSI
TP1:
Test point 1 is connected to the final op amp stage. It is the
voltage that is applied to the microprocessor's AID converter.
There are two ports on the pressure sensor located at the
bottom center of the printed circuit board. The pressure port
is on the top left and the vacuum port is on the bottom right of
the sensor.
Characteristic
GND:
+12V
J8 IS INSTALLED FOR
THE MPX2010 ONLY
+5V
6.98K
+8
+5V
+5V
e>:,-..JVoV'v---(--'
121
R2
U2
MC34064P-5
PDO
2-A2
GND
OUTt-.......--<;
CPU_RESET
2-B4
+5V
+8
R9
340
RIO
23.7
Jl
~~om{
R7
R8
J2
SELECT
':'
J3
J4
J5
VRH
2-D4
PI
GROUNO~
SLOPE ADJ.
VRL
2-D4
402
R14
PDl
2-A2
PD2
2-A3
P03
2-A3
P04
2-A3
PD5
2-A3
J6
P06
2-A3
J7
PO?
2-A3
':'
':'
Figure 3a. Schematic
Motorola Sensor Device Data
4-75
J:.
~
...Z
LCD1
o~
o~1
37
36
5
6
Co)
o~
o~
S~
PLN
l~_rl
28
...
en
l__
?
734
35
81 31
32
9
10
l=
n__ f
11
29
30 12 26
27
13
14
15
24
25
16
22
23
18
17
19
20
21
1
PINS:
2-4, 33, 38-40
JJ
"II
to·
I:
49
Cil
47
0
c.>
42
48
2
1
43
!=T
~
'::r
(1)
~
13
PDl
H3
0'
./
c::>---E11
POl
H3
./
~
PD5
1·E4
"-
5
~
s::
S
a
iii"
en
(1)
5
48
4
38
37
39
3
0
2
PD7
'·E4
3
./
3 5 I : F - : J - 29
32
1
7
6
5
4
3
0
r
2
PORTS
PORTC
en
o
3
45
44
6
7
~~~
2~ ~
30
1
7
6
n
C
*
22pF
17
OSC2
P02
US
PD3
R15
10M
MC68HC705B5
=
c::=:::J 4.00MHz
y,
PD4
16
OSCl
PD5
22 PF] C8
PD6
P07
IRQ'
91
RESET'
VPP6
18 1
15
o
o
3
PDO
Q
~
4
PDl
VDD
10
VSS
TCAPl
TCAP2
23
D/A
RDI
TDO
VRL
VRH
211
:::J
o·
(1)
5
PORTA
,5V
CPU RESET
H2-
I
VRL
l-C4
VRH
,.C4
PLMA
AN1315
OPERATION
Connect the system to a 12 Vdc regulated power supply.
(Note the polarity marked on the power terminal Pl.)
Depending on the particular pressure sensor being used with
the system, wire jumpers Jl through J3 and J8 must be
installed at board assembly time. If at some later time it is
desirable to change the type of sensor that is installed on the
board, jumpers Jl through J3 and J8, must be reconfigured for
the system to function properly (see Table 1). If an invalid Jl
through J3 jumper combination (Le., not listed in Table 1) is
used the LCD will display "SE" to indicate that condition.
These jumpers are read by the software and are used to
determine which sensor is installed on the board. Wire jumper
J8 is installed only when an MPX2010DP pressure sensor is
used on the system. The purpose of wire jumper J8 will be
explained later in the text. Jumpers J4 through J7 are read by
the software to allow the user to adjust the slope constant used
for the engineering units calculation (see Table 3). The
pressure and vacuum ports on the sensor must be left open
to atmosphere anytime the board is powered-up. This is
because the zero pressure offset voltage is computed at
power-up.
When you apply power to the system, the LCD will display
CAL for approximately 5 seconds. After that time, pressure or
vacuum may be applied to the sensor. The system will then
start displaying the applied pressure in PSI.
Table 3.
J7
J6
J5
J4
Action
IN
IN
IN
IN
IN
IN
IN
IN
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
IN
IN
IN
IN
OUT
OUT
OUT
OUT
IN
IN
IN
IN
OUT
OUT
OUT
OUT
IN
IN
OUT
OUT
IN
IN
OUT
OUT
IN
IN
OUT
OUT
IN
IN
OUT
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
Normal Slope
Decrease the Slope Approximately 7%
Decrease the Slope Approximately 6%
Decrease the Slope Approximately 5%
Decrease the Slope Approximately 4%
Decrease the Slope Approximately 3%
Decrease the Slope Approximately 2%
Decrease the Slope Approximately 1%
Increase the Slope Approximately 1%
Increase the Slope Approximately 2%
Increase the Slope Approximately 3%
Increase the Slope Approximately 4%
Increase the Slope Approximately 5%
Increase the Slope Approximately 6%
Increase the Slope Approximately 7%
Normal Slope
To improve the accuracy of the system, you can change the
constant used by the program that determines the span of the
sensor and amplifier. You will need an accurate test gauge
(using PSI as the reference) to measure the pressure applied
to the sensor. Anytime after the display has completed the
zero calculation, (after CAL is no longer displayed) apply the
sensor's full scale pressure (see Table 1), to the sensor. Make
sure that jumpers J4 through J7 are in the "normal"
configuration (see Table 3). Referring to Table 3, you can
better "calibrate" the system by changing the configuration of
J4 through J7. To "calibrate" the system, compare the display
reading againstthat olthe test gauge (with J4 through J7 in the
Motorola Sensor Device Data
"normal slope" configuration). Change the configuration of J4
through J7 according to Table 3 to obtain the best results. The
calibration jumpers may be changed while the system is
powered up as they are read by the software before each
display update.
DESIGN CONSIDERATIONS
To build a system that will show how to interface an
MPX2000 series pressure sensor to a microprocessor, there
are two main challenges. The first is to take a small differential
Signal produced by the sensor and produce a ground
referenced signal of sufficient amplitude to drive a
microprocessor's AID input. The second challenge is to
understand the microprocessor's operation and to write
software that makes the system function.
From a hardware point of view, the microprocessor portion
of the system is straight forward. The microprocessor needs
power, a clock source (crystal Yl, two capacitors and a
reSistor), and a reset signal to make it function. As for the AID
converter, external references are required to make itfunction.
In this case, the power source for the sensor is divided to
produce the voltage references for the AID converter.
Accurate results will be achieved since the output from the
sensor and the AID references are ratiometric to its power
supply voltage.
The liquid crystal display is driven by Ports A, Band C of the
microprocessor. There are enough I/O lines on these ports to
provide drive for three full digits, the backplane and two
decimal pOints. Software routines provide the AC waveform
necessary to drive the display.
The analog portion of the system consists of the pressure
sensor, a quad operational amplifier and the voltage
references for the microprocessor's AID converter and signal
conditioning circuitry. Figure 4 shows an interface circuit that
will provide a single ended signal with sufficient amplitude to
drive the microprocessor's AID input. It uses a quad
operational amplifier and several resistors to amplify and level
shift the sensor's output. It is necessary to level shift the output
from the final amplifier into the AID. Using single power
supplied op amps, the VCE saturation of the output from an op
amp cannot be guaranteed to pull down to zero volts. The
analog design shown here will provide a signal to the AID
converter with a span of approximately 4 volts when zero to
full-scale pressure is applied to the sensor. The final
amplifier's output is level shifted to approximately 0.7 volts.
This will provide a signal that will swing between
approximately 0.7 volts and 4.7 volts. The offset of 0.7 volts in
this implementation does not have to be trimmed to an exact
point. The software will sample the voltage applied to the AID
converter at initial power up time and call that value "zero". The
important thing to remember is that the span of the signal will
be approximately 4 volts when zero to full scale pressure is
applied to the sensor. The 4 volt swing in signal may vary
slightly from sensor to sensor and can also vary due to resistor
tolerances in the analog circuitry. Jumpers J4 through J7 may
be placed in various configurations to compensate for these
variations (see Table 3).
4-77
AN1315
+12V
J8 IS INSTALLED FOR
THE MPX2010 ONLY
+5V
6.98K
+8
PD~
121
R2
+8
R9
340
Rl0
R7
23.7
R8
Figure 4. Analog Interface
Referring to Figure 4, most olthe amplification olthe voltage
from the pressure sensor is provided by U1A which is
configured as a differential amplifier. U1B serves as a unity
gain buffer in order to keep any current that flows through R2
(and R3) from being fed back into the sensor's negative
output. With zero pressure applied to the sensor, the
differential voltage from pin 2 to pin 4 of the sensor is zero or
very close to zero volts. The common mode, or the voltage
measured between pins 2 or 4 to ground, is equal to
approximately one half of the voltage applied to the sensor, or
4 volts. The zero pressure output voltage at pin 7 of U1A will
then be4volts because pin 1 of U1B is also at4 volts, creating
a zero bias between pins 5 and 6 of U1A. The four volt zero
pressure output will then be level shifted to the desired zero
pressure offset voltage (approximately 0.7 volts) by U1 C and
U1D.
To further explain the operation of the level shifting circuitry,
refer again to Figure 4. Assuming zero pressure is applied to
the sensor and the common mode voltage from the sensor is
4 volts, the voltage applied to pin 12 of U1D will be 4 volts,
implying pin 13 will be at 4 volts. The gain of amplifier U 1D will
be (R10/(R8+R9» +1 oragain of2. R7will inject a Voffset{0.7
volts) into amplifier U1 D, thus causing the output at U1 D pin
14tobe 7.3= (4 volts @ U1D pin 12 X 2)-0.7 volts. The gain
of U1C is also set at 2 «R5/R6)+1). With 4 volts applied to pin
100f U1C, its output at U1C pin 8will be 0.7 = «4 volts @ U1C
pin 10 X 2) - 7.3 volts). For this scheme to work properly,
amplifiers U1C and U1D must have a gain of2 and the output
of U1 D must be shifted down by the Voffset provided by R7. In
this system, the 0.7 volts Voffset was arbitrarily picked and
could have been any voltage greater than the Vsat of the op
amp being used. The system software will take in account any
4-78
variations of Voffset as it assumes no pressure is applied to the
sensor at system power up.
The gain of the analog circuit is approximately 117. With the
values shown in Figure 4, the gain of 117 will provide a span
of approximately 4 volts on U1C pin 8 when the pressure
sensor and the 8 volt fixed voltage regulator are at their
maximum output voltage tolerance. All of the sensors listed in
Table 1 with the exception of the MPX2010DP output
approximately 33 mV when full scale pressure is applied.
When the MPX2010DP sensor is used, its full scale sensor
differential output is approximately 20 mV. J8 must be installed
to increase the gain of the analog circuit to still provide the 4
volts span out of U1C pin 8 with a 20 mV differential from the
sensor.
Diode D2 is used to protect the microprocessor's AID input
if the output from U1 C exceeds 5.6 volts. R4 is used to provide
current limiting into D4 under failure or overvoltage conditions.
SOFTWARE
The source code, compiled listing, and S-record output for
the software used in this system are available on the Motorola
Freeware Bulletin Board Service in the MCU directory under
the filename DEVB158.ARC. To access the bulletin board,
you must have a telephone line, a 300, 1200 or 2400 baud
modem and a personal computer. The modem must be
compatible with the Bell 212A standard. Call (512) 891-3733
to access the Bulletin Board Service.
Figure 5 is a flowchart for the program that controls the
system. The software for the system consists of a number of
modules. Their functions provide the capability for system
calibration as well as displaying the pressure input to the
MPX2000 series pressure sensor.
Motorola Sensor Device Data
AN1315
(
START)
~
INITIALIZE DISPLAY I/O PORTS
INITIALIZE TIMER REGISTERS
DETERMINE SENSOR TYPE
ENABLE INTERRUPTS
TIMER
INTERRUPT
SERVICE TIMER REGISTERS
SETUP COUNTER FOR NEXT INTERRUPT
SERVICE LIQUID CRYSTAL DISPLAY
I
L
COMPUTE SLOPE CONSTANT
L
ACCUMULATE 100 AID CONVERSIONS
COMPUTE INPUT PRESSURE
CONVERT TO DECIMALJSEGMENT DATA
PLACE IN RESULT OUTPUT BUFFER
I
Figure 5. DEVB-158 Software Flowchart
The "C" compiler used in this project was provided by BYTE
CRAFT LTD. (519) 888-6911. A compiler listing of the
program is included at the end of this document. The following
is a brief explanation of the routines:
delay()
digit decimal number in an array called "digit." It then uses
the decimal results for each digit as an index into a table
that converts the decimal number into a segment pattern
for the display. This is then output to the display.
Used to provide a software loop delay.
read_a2d() Performs 100 reads on the AID converter on
multiplexer channel 0 and returns the accumulation.
fixcompare() Services the internal timer for 15 ms. timer
compare interrupts.
TIMERCMP() Alternates the data and backplane inputs to
the liquid crystal display.
initioO Sets up the microprocessor's 110 ports, timer and
enables processor interrupts.
adzeroO This routine is called at powerup time. It delays
to let the power supply and the transducer stabilize. It then
calls "read_atodO" and saves the returned value as the
sensors output voltage with zero pressure applied.
cvCbin_dec(unsigned long arg) This routine converts
the unsigned binary argument passed in "arg" to a five
Motorola Sensor Device Data
display_psiO This routine is called from "mainO" never to
return. The AID converter routine is called, the pressure
is calculated based on the type sensor detected and the
pressure applied to the sensor is displayed. The loop
then repeats.
sensor_typeO This routine determines the type of sensor
from reading J1 to J3, setting the full scale pressure for
that particular sensor in a variable for use by display_psiO.
sensor_slopeO This routine determines the slope
constant to be used by display_psiO for engineering units
output.
mainO This is the main routine called from reset. It calls
"initioO" to setup the system's 110. "display_psiO" is called
to compute and display the pressure applied to the
sensor.
4-79
AN1315
6805
'e'
COMPILER V3.48
PAGE
16-0ct-1991
#pragma option fO i
'*
THE FOLLOWING
BOARD.
I
CI
SOURCE CODE IS WRITTEN FOR THE DEVB158 EVALUATION
IT WAS COMPILED WITH A COMPILER COURTESY OF:
BYTE CRAFT LTD.
421 KING ST.
ONTARIO
WATERLOO,
CANADA
N2J 4E4
(519)888-6911
SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER
COMPILERS.
BILL LUCAS 2/5/92
SPS
MOTOROLA,
Revision history
rev. 1.0 initial release 3/19/92
rev. 1.1 added additional decimal digit to the MPX2010 sensor. Originally
resolved the output to .1 PSI. Modified cvt_hin_dec to output PSI resolved
to .01 PSI. WLL 9/25/92
*,
0800 1700
0050 0096
IFFE
IFFC
IFFA
IFFB
IFF6
IFF4
IFF2
#pragma memory ROMPROG
[5888]
@
OxOeOD
#pragma memory RAMPAGED
[150]
@
OxOOSO
/*
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
Vector assignments
*/
vector _RESET
@ Oxlffe
vector _SWI
@ Oxlffc
vector IRQ
@ Oxlffa
vector TlMERCAP @ OxlffB
vector TlMERCMP @ Oxlff6
vector TIMEROV
@ Oxlff4
vector SCI
@ Oxlff2
#pragma has STOP ;
#pragma has WAIT ;
#pragma has MUL ;
/*
0000
0001
0002
0003
0004
0005
0006
0007
0008
0009
OOOA
OOOB
OOOC
OOOD
OOOE
OOOF
0010
0011
0012
0013
0014
0015
0016
0017
0018
0019
OOlA
OOlB
OOlC
OOlD
OOlE
OOlF
4-80
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragrna
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
#pragma
Register assignments for the 68HC70SBS microcontroller
*/
portrw porta
@ OxOD;
/*
*/
portrw portb
@ OxOl;
/*
*/
portrw portc
@ Ox02 i
/*
*/
portrw portd
@ Ox03;
/* in
,SS
,SCK
,MOSI ,MISO,TxD,RxD */
portrw ddra
@ Ox04;
/* Data direction, Port A
*/
portrw ddrb
@ OxOS;
/* Data direction, Port B
*/
portrw ddrc
@ OX06i
/* Data direction, Port C (all output)
*/
portrw eeclk
@ Ox07;
/* eeprom/eclk cntl * /
portrw addata @ OxOB;
/* a/d data register */
portrw ads tat @ Ox09;
/* aid stat/control */
portrw pIma
@ OxOa;
/* pulse length modulation a * /
portrw plmb
@ OxOb;
/* pulse length modulation b * /
portrw misc
@ OxOc;
/* miscellaneous register
portrw scibaud @ OxOd;
/* sci baud rate register
portrw scicntll @ OxOe; /* sci control 1
portrw scicntl2 @ OxOf; /* sci control 2
portrw seistat @ OxIO;
/* sci status reg
portrw scidata
@ Ox1l;
/* SCI Data * /
@ Oxl2,
/* ICIE,QCIE,TOIE,O,O,O,IEGE,OLVL
portrw tcr
@ Oxl3;
portrw tar
/* ICF,OCF,TOF,O, 0, 0, 0, 0
@ Oxl4;
/* Input Capture Reg (Hi-Ox14, Lo-OxlS)
portrw icaphil
@ OxlS;
*,
portrw icaplol
/* Input Capture Reg (Hi-Ox14, Lo-OxlS)
@ Ox16;
/* Output Compare Reg (Hi-Ox16, Lo-Oxl7)
portrw ocmphil
@ Ox17;
/* Output Compare Reg (Hi-Oxl6, Lo-Ox17)
portrw oemplol
@ Oxl8,
portrw tenthi
/* Timer Count Reg (Hi-Oxl8, Lo-Ox19)
@ Oxl9;
portrw tcntlo
/* Timer Count Reg (Hi-OxI8, Lo-Oxl9)
@
OxlA;
/* Alternate Caunt Reg (Hi-$lA, La-$lB)
portrw aregnthi
@ OxlB;
portrw aregntlo
/* Alternate Count Reg (Hi-$lA, La-$lB)
@ OxIc;
/* Input Capture Reg (Hi-Oxlc, La-Oxld)
portrw icaphi2
@ Oxld;
/* Input Capture Reg (Hi-Oxlc, Lo-Dxld)
portrw icaplo2
@ axle;
/* OUtput Compare Reg (Hi-Oxle, La-Oxlf)
portrw ocmphi2
@ Oxlf;
portrw ocmplo2
/* Output Compare Reg (Hi-axle, Lo-Oxlf) *'
*'
**',
*,
*,
*,
*'
*'
*'*,
**',
*'
*,*'
*'
*'
Motorola Sensor Device Data
AN1315
#pragma mer
lBFB 74
@
Ox74; /* this disables the watchdog counter and does
not add pull-down resistors on ports Band C ... I
Oxlefe
1* put constants and variables here .. . they must be global *1
1* '* ••• * ••• ****** '* ••
0800 FC 30 DA 7A 3668 E6 38 FE
0809 3E
'It. ** ... **** **** ****** ** ."'.* ..... ****************** ••••••• ****,
const char lcdtab[]={Oxfc,Ox30,Oxda,Ox7a,Ox36,Ox6e,Oxe6,Qx38,Ox£e,Ox3e };
'*
led pattern table
.,
1
0
DaDA 27 10 03 E8 00 64 00 OA
const long dectable [] =
10000, 1000, 100, 10 };
0050 0005
unsigned int digit[5]; /* buffer to hold results from evt_bin_dec function *1
0812 00 96 00 4B 00 96 DOlE 00
081B 67
const long type [] = {
150,
75.
150.
30.
103
),
1*
MPX2010 MPX20S0 MPX2100 MPX2200 MPX2700
The table above will cause the final results of the pressure to
engineering units to display the 1.5, 7.3 and 15.0 devices with a
decimal place in the tens position. The 30 and 103 psi devices will
display in integer units .
.,
D81C
0825
082E
0837
01
BO
01
DD
C2
01
CB
01
01
B4
01
El
A2
01
CF
01
01 A7 01 AB 01
B9 01 BD 01 C6
01 D4 01 D8 01
C2
canst long slope_const [] = { 450,418,423,427,432,436,441,445,454,459,
463,468,472,477,481,450 };
0000
registera areg;
I * processor's A register * I
0055
long atodternp;
1* temp to accumulate 100 aid readings for smoothing *1
0059
long slope;
/* multiplier for adc to engineering units conversion * I
005B
int adcnt;
/* aid converter loop counter *1
005C
long xdcr_offset;
1* initial xdcr offset */
005E
0060
long sensor_model; 1*
int sensor_index;
I*
0061 0063
unsigned long i, j; / * counter for loops * I
0065
unsigned int k;
installed sensor based on J1. .J3 */
determine the location of the decimal pt.
*I
1* misc variable *1
struct bothbytes
{ int hi;
int 10;
),
union isboth
long 1;
struct bothbytes b;
);
0066 0002
union ishoth q;
1* used for timer set-up * I
'* * * *.,. * * * *.,..,. * *." *. * * * *.".,..,..,. * * * * * * *.,. *. * * *." * * *.,. * *." *.,. * * * * * ** ...... *.* * * * ......... * * ...... * * * * * * ,
/* variables for add32
0068 0004
006C 0004
0070 0004
unsigned long SUM [2] ;
unsigned long ADDEND [2] ;
unsigned long AUGEND (2] ;
0074 0004
0078 0004
007C 0004
1* variables
unsigned long
unsigned long
unsigned long
for sub32
MINUE [2];
SUBTRA [2] ;
DIFF[2};
0080 0004
0084 0004
0088 0004
1* variables
unsigned long
unsigned long
unsigned long
for mu132
MULTP [2];
MTEMP [2];
MULCAN[2];
Motorola Sensor Device Data
.,,.
"
.,",.
,.
,.
.,
,.,."
result
one input
second input
minuend
subtrahend
difference
.,.,
.,
.,.,
.,
.,
multiplier
high order 4 bytes at return *1
mul tiplicand at input, low 4 bytes at return ... ,
4-81
AN1315
/* variables for div32
unsigned long DVDND [2] ;
unsigned long DVSOR [2] ;
unsigned long QUO [2] ;
unsigned int CNT;
Dose 0004
0090 0004
0094 0004
0098
,",""'
,","
Dividend
Divisor
Quotient
Loop counter
"'
"'"'*'
I'" The code starts here ." I
I"'''''''''''''''''''''''''''''''''''''''' ** *."."."."."."."."."."."."."."."",."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."." **." I
void add32 ( )
{
#asm
." Add two 32-bit values.
Inputs:
ADDEND: ADDEND [0 •• 3]
AUGEND: AUGEND [0 • • 3]
Output:
SUM:
083C 86 6F
083E BB 73
0840 B7 6B
0842
0844
0846
0848
SON[O .. 3]
LOA
ADDEND+3
ADO
STA
AUGEND+3
HIGH ORDER BYTE IS ADDEND+O
HIGH ORDER BYTE IS AUGEND+O
HIGH ORDER BYTE IS STIM+O
low byte
SUM+3
86 6E
LOA
ADDEND+2
B9 72
B7 6A
ADC
AUGEND+2
STA
St1M+2
B6 60
LOA
084A B9 71
ADC
ADDEND+l
AUGEND+l
084.C B7 69
084E B6 6C
STA
LDA
ADDEND
0850 B9 70
ADC
AUGEND
0852 B7 68
STA
SUM
0854 81
RTS
medium low byte
medium high byte
SUM+l
high byte
done
#endasm
0855 81
RTS
void sub32 ( )
{
#asm
." Subtract two 32-bit values.
Input:
Minuend: MINUE [0 .. 3]
Subtrahend: SUBTRA [0 •• 3]
Output:
Difference: DIFF[l. .0]
*----------------------------------------------------------------------------*
* Multiply 32-bit value by a 32-bit value
Input:
4-82
Motorola Sensor Device Data
AN1315
Multiplier:
MULTP[O .. 3]
Multiplicand:
MULCAN[O .. 3]
Output:
Product:
MTEMP[O •• 3] AND MULCAN[O •• 3] MTEMP[O] IS THE HIGH
ORDER BYTE AND MULCAN[3]
IS THE LOW ORDER BYTE
THIS ROUTINE DOES NOT USE THE MOL INSTRUCTION FOR THE SAKE OF USERS NOT
USING THE HC (7 ) 05 SERIES PROCESSORS.
0870
0872
0874
0876
0878
087A
087C
087E
0880
0882
0884
0886
0888
088A
088C
OSSE
0890
0892
0894
0896
0898
OB9A
089C
089E
08AO
08A2
08M
08A6
08A8
08AA
08AC
08AD
08AF
AE
3F
3F
3F
3F
36
36
36
36
24
B6
BB
B7
B6
B9
B7
B6
B9
B7
B6
B9
B7
36
36
36
36
36
36
36
36
SA
26
81
20
84
85
86
87
88
89
8A
8B
18
87
83
87
86
82
86
85
81
85
84
80
84
84
85
86
87
88
89
8A
8B
MNEXT
ROTATE
D3
LDX
CLR
CLR
CLR
CLR
ROR
ROR
ROR
ROR
BCC
LDA
ADD
STA
LDA
ADC
STA
LDA
ADC
STA
LDA
ADC
STA
ROR
ROR
ROR
ROR
ROR
ROR
ROR
ROR
DEX
BNE
loop counter
clean-up for result
#32
MTEMP
MTEMP+l.
MTEMP+2
MTEMP+3
low but to carry, the rest one to the right
MULCAN
MULCAN+l.
MULCAN+2
MOLCAN+3
i f carry is set, do the add
ROTATE
MTEMP+3
MULTP+3
MTEMP+3
MTEMP+2
MULTP+2
MTEMP+2
MTEMP+l
MULTP+l.
MTEMP+l.
MTEMP
MULTP
MTBMP
else: shift low bit to carry, the rest to the right
MTEMP
MTEMP+l
MTEMP+2
MTBMP+3
MULCAN
MULCAN+l.
MULCAN+2
MULCAN+3
bump the counter down
MNEXT
RTS
done yet
done
#endasm
08BO 81
RTS
void div32 ()
(
#asM
* Divide 32 bit
by 32 bit unsigned integer routine
Input:
Dividend:
Divisor;
OUtput:
Quotient:
DVDND [+0 .. +3] HIGH ORDER BYTE IS DVND+O
DVSOR [+0 .. +3] HIGH ORDER BYTE IS DVSOR+O
QUO [+0 •• +3]
HIGH ORDER BYTE IS QUO+O
*----------------------------------------------------------------------------*
08B1
08B3
08B5
08B7
08B9
08BB
08BD
3F
3F
3F
3F
A6
3D
2B
94
95
96
97
01
90
OF
08BF
08CO
08C2
08C4
08C6
08C8
4C
38
39
39
39
2B
93
92
91
90
04
CLR
CLR
CLR
CLR
LDA
TST
BMI
QUOzero result registers
QUO+1
QUO+2
QUO+3
#1
initial loop count
DVSOR
if the high order bit is set .• no need to shift DVSOR
DIV153
DIV151 INCA
bump the loop counter
ASL DVSOR+3
now shift the divisor until the high order bit = 1
ROL DVSOR+2
ROL DVSOR+l
ROL DVSOR
BMI DIV153
done if high order bit
Motorola Sensor Device Data
4-83
AN1315
oeCA Ai 21
08CC 26 F1
CMP
BNE
#33
OIV151
have we shifted all possible bits in the DVSOR yet ?
no
08CE B7 98
DIViS3
STA
CNT
save the loop counter so we can do the divide
0800
0802
08D4
0806
0808
OIV163
LOA
SUB
STA
LOA
SBC
STA
LOA
SBC
STA
LOA
SBC
STA
BCC
DVDND+3
DVSCR+3
sub 32 bit divisor from dividend
8F
93
8F
8E
92
8E
80
91
80
DaFe B6 8C
oaFE B9 90
0900 B7 8C
0902 98
LOA
ADD
STA
LOA
ADC
STA
LOA
ADC
STA
LOA
ADC
STA
CLC
DVDND+3
DVSOR+3
0903
0905
0906
0908
BRA
SEC
ROL
ROL
ROL
ROL
LSR
ROR
ROR
ROR
DEC
BNE
DIV16'
B6
BO
B7
B6
B2
DBDA B7
080e
080E
08EO
08E2
0884
08E6
08E8
B6
B2
B7
B6
B2
B7
24
08BA
08EC
08EE
08FO
08F2
08F4
08F6
08F8
OBFA
B6
BB
B7
B6
B9
B7
B6
B9
B7
8F
93
8F
8E
92
8E
80
91
80
8C
90
8C
1B
DVDND+3
DVDND+2
DVSOR+2
DVDND+2
DVDND+l.
DVSOR+l
DVDND+l.
DVDND
DVSOR
DVDND
DIV165
carry is clear if DVSOR was larger than DVDND
add the divisor back ... was larger than the dividend
DVDND+3
DVDND+2
DVSOR+2
DVDND+2
DVDND+l.
DVSOR+l
DVDND+l
DVDND
DVSOR
DVOND
this will clear the respective bit in QUO due to
the Deed to add DVSOR back to DVND
090A
ogoe
090E
0910
0912
0914
0916
0918
091A
20
99
39
39
39
39
34
36
36
36
3A
26
81
01
DIV165
DIV167
97
96
95
94
90
91
92
93
98
B6
QUO+3
this will set the respective bit in QUO
set or clear the low order bit in QUO based on above
OUO+2
OUO+1
OUO
nVSOR
divide the divisor by 2
DVSOR+l
DVSOR+2
DVSORtl
CNT
DIV163
bump the loop counter down
finished yet ?
RTSyes
:JI:endasm
091B 81
RTS
1 * •• * * * ••• * '*. * '* '* * *. '* '* * '* '* '*. * •• '*. *. '* '*. '* '* '* '* * '* '* •• '* '* '* '* ••• '*. '* '* '*. '*. *'*. '* * *. '* *. * * * * * * 1
1* These interrupts are not used ... give them a graceful return if for
Borne reason one occurs '* 1
1FFC
091C
1FFA
091D
lFF8
091E
1FF4
091F
lFF2
0920
09
80
09
80
09
80
09
80
09
80
1C
RTI
10
IRO() {}
RTI
1E
TIMERCAP ( ) { }
RTI
1F
TlMEROV () {}
RTI
20
SCI () {}
RTI
1'* '* '* '*. * '* * * '* '* '* '* '* '* '* * '* '** '* '* '* '* '* '* '* * * * '* '* '* '* '* •• '* '* * '* * * * '* '* '* *'*. '*.* * '* ••••• ** •• '* '*' '* * *. * '*. * * 1
void sensor_type ( )
{
0921
0923
0925
0927
0929
092B
B6
A4
B7
34
B6
A1
4-84
03
OE
65
65
65
04
LOA
AND
STA
LSR
LOA
CMP
$03
#$OE
$65
$65
$65
#$04
k = portd & OxOe;
k = k » 1;
if ( k > 4
1* we only care about bits 1..3 *1
1* right justify the variable • I
Motorola Sensor Device Data
AN1315
0920 23 OC
BLS
$093B
092F
0931
0933
0935
0937
0939
3F
A6
B7
A6
B7
20
02
6E
01
CE
00
FE
CLR
LOA
STA
LOA
STA
BRA
$02
#$6E
$01
#$CE
$00
$0939
093B
0930
093F
0940
0941
0944
0946
0949
094B
B6
B7
97
58
D6
B7
06
B7
81
65
60
LOA
STA
$65
$60
{ 1* we have a set-up error in wire jumpers Jl - J3 */
porte = 0;
1*
*1
porth = Ox6e;
1* S '* I
=
porta
Qxce;
/*
E
'*1
while(l) ;
}
sensor_model
TAX
08 12
5E
08 13
SF
LSLX
LDA
STA
LDA
STA
RTS
sensor_index = k;
type [k] ;
$08l2,X
$5E
$OBl.3,X
$5F
/.* •••••• ** *** .**.* •• ******** '* ****** ***** ******** ********* **** **** ********** I
void sensor_slope ( )
LDA
AND
STA
LSR
LSR
LSR
LSR
$03
#$FO
$65
$65
$65
$65
$65
k=portd & OxfO;
095A BE 65
LDX
$65
slope
095C
0950
0960
0962
0965
0967
LSLX
LOA
STA
LOA
STA
RTS
094C
094E
0950
0952
0954
0956
0958
B6
A4
B7
34
34
34
34
58
06
B7
06
B7
81
03
FO
65
65
65
65
65
08 1C
59
08 10
SA
k»
k
4;
1* we only care about bits 4 .. 7 */
1* right justify the variable *1
slope_ccnst [k]
i
$081C,X
$59
$081D,X
$5A
1'* '* '* '* '* * '* '* '* '* '* '* '* * * '* '* '* ** * '* '* '* '* '* '* '* '* * '* * '* '* ** '* '* '* '* '* '* '* '* '* '* '* '* '* * '* * '* '* '* ** '* '* ** '* '* ** '* '* * '* '* '* '* '* '* * I
void delay(void)
/* just hang around for a while */
(
0968
096A
096C
096E
0970
0972
0974
0976
0978
097A
097C
097E
3F
3F
B6
AD
B6
A2
24
3C
26
3C
20
81
62
61
62
20
61
4E
08
62
02
61
EE
CLR
CLR
LDA
SUB
LDA
SBC
BCC
INC
BNE
INC
BRA
$62
$61
$62
#$20
$61
#$4E
$097E
$62
$097C
$61
$096C
for (i=O; i<20000; ++1);
RTS
1* * ** '* * '* * '* '* * * '* '* '* * '* '* '* * * * * '* '* '* '* '* * * '* '*."." ** *." '* '* '*."." *." * * ** '* '* '*." * *."." * * '*." * * '*."."." * *." * * * *." /
rea(La2d{void)
(
/* read the aId converter on channel 5 and accumulate the result
in atodtemp */
097F
0981
0983
0985
0987
0989
098B
3F
3F
3F
B6
A8
A1
24
56
55
58
5B
80
E4
21
0980
098F
0991
0994
0996
0998
A6
B7
OF
B6
3F
B7
20
09
09 FO
08
57
58
CLR
CLR
CLR
LDA
EOR
CMP
BCC
$56
$55
$5B
$5B
#$80
#$E4
$09AE
LOA
#$20
STA
$09
BRCLR 7, $09, $0991
LOA
$08
CLR
$57
STA
$58
Motorola Sensor Device Data
atodtemp=O;
/* zero for accumulation ." /
for ( adcnt = 0 ; adcnt= dectable
[1]
)
LSLX
08 OB
9E
58
90
80
57
08 OA
80
57
LOA
SUB
STA
LOA
EOR
STA
LOA
EOR
SBC
$080B,X
$9E
$58
$90
#$80
$57
$080A,X
#$80
$57
Motorola Sensor Device Data
4-87
AN1315
OA70 SA 58
OA72 22 5C
ORA
BHI
$58
$OADO
OA74 BE 9F
LOX
$9F
OA76 58
OA77 06 08
OA7A B7 AO
OA7C D6 08
OA7F B7 Al
OA81 B6 9E
DAB3 B7 58
OAB5 B6 90
OA87 B7 57
OA89 B6 AO
DABB B7 9A
OA80 B6 Al
OA8F B7 9B
OA91 CO DB
OA94 CO OC
0A97 BF 57
0A99 B7 58
OA9B BE 9F
OA9D E7 50
OA9F BE 9F
OAAI E6 50
OAA3 3F 57
OAA5 B7 58
OAA7 B6 AO
OAA9 B7 9A
OAAB B6 Al
DAM B7 9B
OAAF CD OB
OAB2 BF 57
OAB4 B7 58
OAB6 33 57
DABS 30 58
OABA 26 02
OABC 3C 57
OABB 86 58
DACO BB 9E
OAe2 B7 58
OAC' B6 57
OAC6 B9 90
OAC8 B7 57
OACA B7 90
DAce 86 58
OACE B7 9E
LSLX
OADO
OAD2
OAD4
OAD6
LDA
STA
LDA
STA
LOA
STA
LOA
STA
LOA
STA
LOA
STA
JSR
JSR
STX
STA
LOX
STA
LOX
LDA
CLR
STA
LOA
STA
LOA
STA
JSR
STX
STA
COM
NEG
INC
LDA
ADO
STA
LOA
ADC
STA
STA
LOA
STA
$080A,X
$AO
$080B,X
$Al
$9E
$58
$90
$57
$AO
$9A
$Al
$9B
$OBFl
$OC22
$57
$58
$9F
$50,X
$9F
$50,X
$57
$58
$AO
$9A
$Al
$9B
$OB02
$57
$58
$57
$58
$OABE
$57
$58
$9E
$58
$57
$90
$57
$90
$58
$9E
9F
80
9E
58
90
57
9F
58
50
INC
BRA
LOA
STA
LOA
STA
LOX
LDA
STA
$9F
$OA54
$9E
$58
$90
$57
$9F
$58
$50,X
9B
3052
26 04
3F 02
20 07
BB 52
D6 08 00
B7 02
30 52
26 08
30 53
26 04
3F 01
20 07
BE 53
06 08 00
SEI
TST
BNE
CLR
BRA
LOX
LDA
STA
TST
BNE
TST
BNE
CLR
BRA
LOX
LOA
3C
20
B6
B7
DADS 86
OADA B7
DADe BE
DADE 86
OAEO E7
OA
OB
Fi
22
02
BNE
dectable [i] ,
digit [i]
arg
digit[i]
arg I 1;
arg- (digit [1] " 1);
argl
1* now zero suppress and send the led pattern to the display
OAE2
OAE3
OAE5
OAE7
OAE9
CABB
DAED
OAFO
OAF2
OAF4
OAF6
OAF8
OAFA
OAFe
OAFE
OBOO
4-88
$52
$OAEB
$02
$OAF2
$52
$OBOO,X
$02
$52
$OAFE
$53
$OAFE
$01
$OB05
$53
$0800,X
SEI;
if ( digit [2] == 0 )
/* leading zero suppression "1
porte :c 0;
else
porte = ( lcdtab[digit [2]] ),
i f ( digit [2]
*I
o
&& digit [3]
'*
100's digit *1
o )
portb=O;
else
porth
( lcdtab[digit[3]]
);
'*
10's digit
*'
Motorola Sensor Device Data
AN1315
OB03 B7 01
OB05 BE 54
STA
LDX
$01
$54
OB07 D6 08 00
LDA
$0800,X
OBOA B7 00
STA
$00
OBOC B6 60
$60
OBOE AB BO
LDA
EOR
OB10 A1 83
CMP
porta
(lcdtab[digit[4]l);
/* 1.'s digit *1
1* place the decimal point only if the sensor is 15 psi or 7.5 psi * /
OB12 24 DB
OB14 BE 54
BCC
LDX
$OB1C
$54
OB16 D6 08 00
OB19 4C
LDA
INCA
$0800,X
OB1A B7 00
OB1C 3D 60
OB1E 26 OF
STA
TST
$00
$60
BNE
$OB2F
OB20
OB22
OB25
OB27
OB29
OB2C
LDX
LDA
STA
LDX
LDA
INCA
$54
$01
BE
D6
B7
BE
D6
4C
54
DB 00
00
53
DB 00
OE2D E7 01
STA
OB2F 9A
CLI
OB30 CD 09 6B
OB33 B1.
JSR
RTS
if ( sensor_index < 3 )
#$80
#$83
( lcdtab[digit[4]]+1 ); 1* add the decimal point to the lsd *1
porta
if (sensor_index ==0) 1* special case *1
porta
(lcdtab[digit[4]]); 1* get rid of the decimal at lsd *1
portb
(lcdtab[digit[3]1+1); /* decimal point at middle digit *1
$0800,X
$00
$53
$0800, X
CLI;
delay ( );
$0968
/******* *** * ************** * **** * ***** * ***** *** **************** *** /
void display--psi (void)
/*
At power-up it is assumed that the pressure or vacuum port of
the sensor is open to atmosphere. The code in initio() delays
for the sensor and power supply to stabilize. One hundred AID
conversions are averaged. That result is called xdcr_offset.
This routine calls the A/D routine which performs one hundred
conversions, divides the result by 100 and returns the value.
If the value returned is less than or equal to the xdcr_offset,
the value of xdcr_offset is substituted. If the value returned
is greater than xdcr_offset, xdcr_offset is subtracted from the
returned value.
*/
while(l)
{
OB34 CD 09 7F
OB37 3F 55
OB39 B7 56
OB3B BO 5D
OB3D B7 58
OB3F
OB41
OB43
OB45
OB47
OB49
B6 5C
AB 80
JSR
CLR
STA
SUB
STA
LDA
B7 57
B6 55
A8 80
EOR
STA
LDA
EOR
B2 57
SBC
OB4B BA 58
OB4D 22 08
OB4F B6 5C
OB51 B7 55
BHI
LDA
STA
ORA
$097F
$55
$56
$5D
$58
$OB57
$5C
$55
$5D
$56
LDA
STA
LDA
SUB
$56
STA
LDA
SBC
STA
JSR
LDA
STA
$56
$55
B6 55
B2 5C
B7
OB63 CD
OB66 B6
OB6B B7
55
09 4C
56
58
OB6A B6 55
OB6C B7 57
OB6E B6 5E
LDA
STA
LDA
1* atodtemp
raw aid ( O.. 255 ) *1
if ( atodtemp <= xdcr_offset
#$80
$57
$58
OB53 B6 5D
OB55 B7 56
BO 5D
B7 56
read_a2dO;
$5C
#$80
$57
$55
DB 57 B6 56
OB59
OB5B
OB5D
OBSP
OB61
atodtemp
atodtemp
atodtemp
xdcr_offset;
xdcr_offset; 1* remove the offset *1
$5D
$5C
$55
$094C
$56
$58
$55
sensor_slope ();
/* establish the slope constant for this output *1
atodtemp *= sensor_model;
$57
$5E
Motorola Sensor Device Data
4-89
AN1315
OB70 B7 9A
STA
$9A
0872 B6 SF
LDA
$5F
OB74 B7 9B
STA
$9B
OB76 CD DB D2
JSR
$OBD2
OB79 BF 55
STX
$55
OB78 B7 56
STA
$56
OB7D 3F 89
OB7F 3F 88
CLR
CLR
$89
$88
OB81 3F 81
OB83 3F 80
OB85 9F
0886 B7 82
OB88 B6 56
OBSA B7 83
CLR
$81
CLR
$80
OB8C B6 59
OBBE B7 8A
0890 B6 SA
LDA
$5A
OB92 B7 8B
STA
$8B
OB94 CD 08 70
JSR
$0870
3F 90
CLR
$90
A6 01
LDA
#$01
OB97
0899
0898
OB9D
OS9F
OBAI
OBA3
OBA5
STA
$82
LDA
$56
STA
$83
LDA
STA
$59
$8A
STA
$91
A6 86
B7 92
LDA
STA
#$86
$92
A6 AD
B7 93
LDA
#$AO
STA
$93
B6 88
LDA
$88
OBA7 B7 8C
STA
$8C
OBA9 B6 89
LDA
$89
aBAS B7 8D
STA
$8D
aBAn
aBAF
OBB1
OBB3
86 8A
B7 8E
LDA
$8A
STA
$8E
B6 8B
LDA
$8B
STA
$8F
OBB5 CD 08 Bl
JSR
$08B1
OSB8 B6 96
LDA
$96
aBBA B7 55
STA
$55
asse B6 97
LDA
$97
OBBE B7 56
STA
$56
OBCO BE 55
LDX
$55
OBC2 CD OA 3F
JSR
$OA3F
ODeS CC DB 34
JMP
$OB34
osce
RTS
81
MlJLCAN[O]
MlJLTP[l]
TXA
B7 91
B7 8F
MULTP[O]
0;
atodtemp;
slope;
MULCAN[l]
mu132 ();
DVSOR[O]
,.
1* analog value * slope based on Jl through J3 * I
now divide by 100000 '* I
= 1;
DVSOR[l]
DVDND[O]
Ox86aO;
= MULCAN[O];
DVDND[l]
MlJLCAN [1] ;
div32 ();
atodtemp = QUO[l]; 1* convert to psi *1
cvt_bin_dec ( atodtemp ); 1* convert to decimal and display
'* /
/ * * .. * '* '* '* * '* '* * * * .. * * '* ** * '* * '* * '* * '* * * * * '* * '* * '* * * ... * '* * '* ... ** * '* * '* * * * * '* * '* ... ** * * ... '* '* * * '* * '* ** '* * * I
void maine)
(
OSCg CD OA DC
osee
CD DB 34
JSR
$OAOC
JSR
$OB34
OBCF 20 FE
BRA
$OBCF
OBD1 81
RTS
OBD2 BE 58
LDX
$58
ODD4 B6 9B
LDA
$9B
OBD6 42
MOL
OBD7 B7 A4
STA
$A4
OBD9 SF AS
STX
$A5
oans BE
57
LDX
$57
DaDO B6 9B
LDA
$9B
DSDP 42
MlJL
OSEO BB AS
ADD
$A5
OBE2 B7 AS
STA
$A5
OBE4 BE 58
LDX
$58
OBE6 B6 9A
LDA
$9A
OBE8 42
OBE9 BB AS
OBEB B7 AS
MUL
OBED 97
OBEE B6 A4
OBFO 81
TAX
LDA
OBF1 3F A4
CLR
OBF3 SF
OBF4 3F A2
OBF6 3F A3
CLRX
OBF8 5C
OBF9 38 58
4-90
ADD
$A5
STA
$A5
initio() ; /* set-up the processor's i/o *1
display--psi ( ) ;
while(1) ;
1* should never get back to here
.,
$A4
RTS
$A4
CLR
$A2
CLR
$A3
INCX
LSL
$58
Motorola Sensor Device Data
AN1315
ROL
ROL
ROL
LOA
SUB
$57
$A2
$A3
$A2
$9B
oeos B7 A2
STA
$A2
oe07 B6 A3
LDA
$A3
oe09 B2 9A
SBC
$9A
OBFB 39 57
OBFD 39 A2
OBFF 39 A3
oe01 B6 A2
oe03 BO 9B
oeOB B7 A3
STA
$A3
oeOD 24 OD
BCC
LOA
ADO
$OC1C
$9B
$A2
oeOF B6 9B
Dell BB A2
STA
$A2
oe1S B6 9A
LDA
$9A
OC1? B9 A3
oe13 B7 A2
ADC
$A3
OC19 B7 A3
STA
$A3
oelB 99
SEC
OC1C 59
ROLX
OC1D 39 A4
ROL
$A4
OC1F 24 DB
Bee
$OBF9
OC21 B1
RTS
OC22 53
COMX
aC23 9F
TXA
OC26 53
LOX
COMX
OC27 B1
RTS
oe24 BE A4
$A4
1FFE OB C9
SYMBOL TABLE
LABEL
VALUE
LABEL
VALUE
LABEL
VALUE
LABEL
VALUE
ADDEND
00 6C
AUGEND
0070
CNT
0098
DIFF
007C
DIVl5l
OBBF
DIVlS3
OBCE
DIV163
OBnO
DIV165
0905
DIVl67
0906
DVDND
OOBC
nVSOR
0090
IRQ
091D
MINUE
0074
MNEXT
OBB2
MTEMP
00B4
MOLCAN
OOBB
MOLTP
OOBO
QUO
0094
ROTATE
OB9C
SCI
0920
SUBTRA
TIMEROV
007B
091F
SUM
_LDIV
006B
OBF1
TIMERCAP
_LongIX
091E
009A
TlMERCMP
_MAIN
09E2
OBC9
_MOL
0000
_MOL16x16
OBD2
_RDIV
OC22
_RESET
1FFE
_STARTUP
0000
_STOP
0000
_SWI
09lC
_WAIT
0000
_longAC
0057
adent
OOSB
add32
OB3C
addata
ads tat
0009
adzero
09EB
aregnthi
001A
aregntlo
001B
arg
009D
atodtemp
0055
b
0000
bothbytes
0002
OOOB
evt_hin_dee
OA3F
ddra
0004
ddrb
0005
ddre
0006
dec table
OBOA
delay
096B
digit
0050
display---psi
OB34
div32
OBB1
eeclk
0007
fixeompare
09C7
hi
0061
ieaphil
0014
ieaphi2
001C
ieaplo1
ieapl02
001D
initio
DADe
isboth
0002
k
0065
main
OBC9
oemphi2
DOlE
plmb
portd
OOOB
0003
scientl1
OOOE
sensor_index 0060
0000
0015
0063
0000
ledtab
mise
OOOC
mul32
OBOO
OB70
oemplol
0017
oemplo2
OOlF
plma
porta
0000
portb
read_a2d
0001
097F
porte
0002
seibaud
DODD
seient12
OOOF
sensor_model OOSE
scidata
0011
scistat
0010
sensor_slope 094C
sensor_type
0921
I q
0066
10
oemphi1
0001
0016
OOOA
slope
0059
slope_const
OB1C
sub32
OB56
tenthi
0018
tentlo
0019
tcr
0012
tar
0013
type
OB12
xdcr_offset
Dose
MEMORY USAGE MAP
('X'
= Used,
'-'
= Unused)
080 0
XXXXXXXXXXXXXXxx xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
084 a
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXxxxxx XXXXXXXXXXXXXXXX
08 B 0
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXxxxxxxxxxxxxx XXXXXXXXXXXXXXXX
OBCO
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
0900
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
094 a
XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX
09 B 0
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
09CO
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
OAOO
xxxXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
OA40
xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
DAB a
XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
OACO
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
Motorola Sensor Device Data
4-91
AN1315
OBO 0
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
OB40
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX
DBS 0
aBeD
XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx
DC 0 0
XXXXXXXXXXXXXXXX
OC40
---------------- ---------------- ---------------- ----------------
DeBO
---------------- ---------------- ---------------- ----------------
xxxxxxxxxxxxxxxx xxxxxxxx --- ----- -- ---- - - --------
DCCO
---------------- ---------------- ---------------- ----------------
lEOD
lE40
lEBO
lECO
-------------------------------------------------------------
lFOO
lF40
---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- ----------------
lFBO
lFCO
---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- --xxxxxxxxxxxxxx
-------------------------------------------------------------
---------------- ------------------------------- ------------------------------- ------------------------------- --------------x-
All other memory blocks unused.
Errors
Warnings
4-92
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1316
Frequency Output Conversion for MPX2000
Series Pressure Sensors
Prepared by: Jeff Baum
Discrete Applications Engineering
INTRODUCTION
Typically, a semiconductor pressure transducer converts
applied pressure to a "low-level" voltage signal. Current
technology enables this sensor output to be temperature
compensated and amplified to higher voltage levels on a
single silicon integrated circuit (IC). While on-chip
temperature compensation and signal conditioning certainly
provide a significant amount of added value to the basic
sensing device, one must also consider how this final output
will be used and/or interfaced for further processing. In most
sensing systems, the sensor signal will be input to additional
analog circuitry, control logic, or a microcontroller unit (MCU).
MCU--based systems have become extremely cost
effective. The level of intelligence which can be obtained for
only a couple of dollars, or less, has made relatively simple
a-bit microcontrollers the partner of choice for semiconductor
pressure transducers. In order for the sensor to communicate
its pressure--dependent voltage signal to the microprocessor,
the MCU must have an analog-to-digital converter (AID) as
an on-chip resource or an additionallC packaged AID. In the
latter case, the AID must have a communications interface
that is compatible with one of the MCU's communications
protocols. MCU's are adept at detecting logic-level transitions
that occur at input pins designated for screening such events.
As an alternative to the conventional AID sensor/MCU
interface, one can measure either a period (frequency) or
pulse width of an incoming square or rectangular wave signal.
Common MCU timer subsystem clock frequencies permit
temporal measurements with resolution of hundreds of
nanoseconds. Thus, one is capable of accurately measuring
the the frequency output of a device that IS interfaced to such
a timer channel. If sensors can provide a frequency modulated
signal that is linearly proportional to the applied pressure
being measured, then an accurate, inexpensive (no AID)
MCU-based sensor system is a viable solution to many
challenging sensing applications. Besides the inherent cost
savings of such a system, this design concept offers additional
benefits to remote sensing applications and sensing in
electrically noisy environments.
Figure 1. DEVB160 Frequency Output Sensor EVB
Motorola Sensor Device Data
4-93
AN1316
The following sections will detail the design issues involved
in such a system architecture, and will provide an example
circuit which has been developed as an evaluation tool for
frequency output pressure sensor applications.
DESIGN CONSIDERATIONS
Signal Conditioning
Motorola's MPX2000 Series sensors are temperature
compensated and calibrated - i.e. - offset and full-scale span
are precision trimmed - pressure transducers. These sensors
are available in full-scale pressure ranges from 10 kPa (1.5
psi) to 700 kPa (100 psi). Although the specifications in the
data sheets apply only to a 10 V supply voltage, the output of
these devices is ratiometric with the supply voltage. At the
absolute maximum supply voltage specified, 16 V, the sensor
will produce a differential output voltage of 64 mV at the rated
full-scale pressure of the given sensor. One exception to this
is that the full-scale span of the MPX201 0 (1 0 kPa sensor) will
be only 40 mV due to a slightly lower sensitivity. Since the
maximum supply voltage produces the most output voltage,
it is evident that even the best case scenario will require some
signal conditioning to obtain a usable voltage level.
Many different "instrumentation-type" amplifier circuits can
satisfy the signal conditioning needs of these devices.
Depending on the precision and temperature performance
demanded by a given application, one can design an amplifier
circuit using a wide variety of operational amplifier (op amp)
IC packages with external resistors of various tolerances, or
a precision-trimmed integrated instrumentation amplifier IC.
In any case, the usual goal is to have a single-ended supply,
"rail-to-rail" output (i.e. use as much of the range from ground
to the supply voltage as possible, without saturating the op
amps). In addition, one may need the flexibility of performing
zero-pressure offset adjust and full-scale pressure
calibration. The Circuitry or device used to accomplish the
voltage-to-frequency conversion will determine if, how, and
where calibration adjustments are needed. See Evaluation
Board Circuit Description section for details.
Voltage-to-Frequency Conversion
Since most semiconductor pressure sensors provide a
voltage output, one must have a means of converting this
voltage signal to a frequency that is proportional to the sensor
output voltage. Assuming the analog voltage output of the
sensor is proportional to the applied pressure, the resultant
4-94
frequency will be linearly related to the pressure being
measured. There are many different timing circuits that can
perform voltage-to-frequency conversion. Most of the
"Simple" (relatively low number of components) circuits do not
provide the accuracy or the stability needed for reliably
encoding
a
signal
quantity.
Fortunately,
many
voltage-to-frequency (V/F) converter IC's are commercially
available that will satisfy this function.
Switching Time Reduction
One limitation of some VlF converters is the less than
adequate switching transition times that effect the pulse or
square-wave frequency signal. The required switching speed
will be determined by the hardware used to detect the
switching edges. The Motorola family of microcontrollers have
input-capture functions that employ "Schmitt trigger-like"
inputs with hysteresis on the dedicated input pins. In this case,
slow rise and fall times will not cause an input capture pin to
be in an indeterminate state during a transition. Thus, CMOS
logic instability and significant timing errors will be prevented
during slow transitions. Since the sensor's frequency output
may be interfaced to other logic configurations, a designer's
main concern is to comply with a worst-case timing scenario.
For high-speed CMOS logic, the maximum rise and fall times
are typically specified at several hundreds of nanoseconds.
Thus, it is wise to speed up the switching edges at the output
of the VIF converter. A single small-signal FET and a resistor
are all that is required to obtain switching times below 100 ns.
APPLICATIONS
Besides eliminating the need for an AID converter, a
frequency output is conducive to applications in which the
sensor output must be transmitted over long distances, or
when the presence of noise in the sensor environment is likely
to corrupt an otherwise healthy signal. For sensor outputs
encoded as a voltage, induced noise from electromagnetic
fields will contaminate the true voltage signal. A frequency
signal has greater immunity to these noise sources and can
be effectively filtered in proximity to the MCU input. In other
words, the frequency measured at the MCU will be the
frequency transmitted at the output of a sensor located
remotely. Since high-frequency noise and 50-60 Hz line
noise are the two most prominent sources for contamination
of instrumentation Signals, a frequency signal with a range in
the low end of the kHz spectrum is capable of being well
filtered prior to being examined at the MCU.
Motorola Sensor Device Data
AN1316
Table 1. Specifications
Characteristics
Max
Units
30
Volts
-MPX2010
10
kPa
-MPX2050
50
kPa
-MPX2100
100
kPa
- MPX2200
200
kPa
-MPX2700
700
Power Supply Voltage
Full Scale Pressure
Full Scale Output
Symbol
Min
B+
10
PFS
10
fFS
Zero Pressure Offset
Sensitivity
Quiescent Current
kPa
kHz
fOFF
1
kHz
SAOUT
9/PFS
kHzlkPa
ICC
55
rnA
EVALUATION BOARD
The following sections present an example of the signal
conditioning, including frequency conversion, that was
developed as an evaluation tool for the Motorola MPX2000
series pressure sensors. A summary of the information
required to use evaluation board number DEVB160 is
presented as follows.
Description
The evaluation board shown in Figure 1 is designed to
transduce pressure, vacuum or differential pressure into a
single-ended, ground referenced voltage that is then input to
a voltage-to-frequency converter. It nominally provides a 1
kHz output at zero pressure and 10kHz at full scale pressure.
Zero pressure calibration is made with a trim pot that is located
on the lower half olthe left side of the board, while the full scale
output can be calibrated via another trimpot just above the
offset adjust. The board comes with an MPX2100DP sensor
installed, but will accommodate any MPX2000 series sensor.
One additional modification that may be required is that the
gain of the circuit must be increased slightly when using an
MPX2010 sensor. Specifically, the resistor R5 must be
increased from 7.5 kQ to 12 kQ.
Circuit Description
The following pin description and circuit operation
corresponds to the schematic shown in Figure 2.
Pin-by-Pin Description
B+:
Input power is supplied althe B+ terminal of connector CN1.
Minimum input voltage is 10 V and maximum is 30 V.
Fout:
A logic-level (5 V) frequency output is supplied at the OUT
terminal (CN1). The nominal signal it provides is1 kHz at zero
Motorola Sensor Device Data
Typ
pressure and 10kHz at full scale pressure. Zero pressure
frequency is adjustable and set with R12. Full-scale
frequency is calibrated via R13. This output is designed to be
directly connected to a microcontroller timer system
input-capture channel.
GND:
The ground terminal on connector CN1 is intended for use
as the power supply return and signal common. Test pOint
terminal TP3 is also connected to ground, for measurement
convenience.
TP1:
Test point 1 is connected to the final frequency output, Fout.
TP2:
Test point 2 is connected to the +5 V regulator output. It can
be used to verify that this supply voltage is within its tolerance.
TP3:
Test point 3 is the additional ground point mentioned above
in the GND description.
TP4:
Test point 4 is connected to the +8 V regulator output. It can
be used to verify that this supply voltage is within its tolerance.
P1, P2:
Pressure and Vacuum ports P1 and P2 protrude from the
sensor on the right side of the board. Pressure port P1 is on
the top (marked side of package) and vacuum port P2, if
present, is on the bottom. When the board is set up with a dual
ported sensor (DP suffix), pressure applied to P1, vacuum
applied to P2 or a differential pressure applied between the
two all produce the same output voltage per kPa of input.
Neither port is labeled. Absolute maximum differential
pressure is 700 kPa.
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AN1316
The following is a table of the components that are assembled on the DEVB160 Frequency Output Sensor Evaluation Board.
Table 2. Parts List
Designators
Cl
Quantity
1
Description
Manufacturer
Part Number
1 J.lF Capacitor
C2
1
0.1 J.lF Capacitor
C3
1
0.01 J.lF Capacitor
C4
1
0.1 J.lF Capacitor
C5
1
10 J.lF Cap+
C6
1
0.1 J.lF Capacitor
CNl
1
.15LS 3 Term
PHX Contact
1727023
Dl
1
RED LED
Quality Tech.
MV57124A
Rl
1
240 0 resistor
R2,R9
2
1 kO resistor
R3
1
4.3 kO resistor
tantalum
R4
1
1.5 kQ resistor
R5
1
7.5 kO resistor
R6
1
1200 resistor
R7
1
8200 resistor
R8
1
6200 resistor
Rl0, Rll
2
2 kO resistor
R12
1
2000 Trimpot
Bourns
3386P-1-201
R13
1
1 kO Trimpot
Bourns
3386P-l-l02
Sl
1
SPDT miniature switch
NKK
SS-12SDP2
TPl
1
YELLOW Testpoint
Control Design
TP-l04-01-04
TP2
1
BLUE Testpoint
Control Design
TP-l04---------------*-----------~~----------------------------------~
Figure 6. Application Example
Beginning with the ramp generator, a timing ramp is
generated with current source U5 and capacitor C3.
Initialization is provided by 01 which sets the voltage on C3
at approximately ground. With the values shown, 470 ~A
flowing into 0.47 ~F provide approximately a 5 msec ramp time
from zero to 5 V. Assuming zero pressure on the sensor, inputs
to both comparators U2A and U2B are at the same voltage.
Therefore, as the ramp voltage sweeps from zero to 5 V, both
PAO and PA 1 will go low at the same time when the ramp
voltage exceeds the common mode voltage. The processor
counts the number of clock cycles between the time that PAO
and PA1 go low, reading zero for zero pressure.
In this circuit, U4A and U4B form the front end of an
instrument amplifier. They differentially amplify the sensor's
output. The resulting amplified differential signal is then
sampled and held in U1 and U3. The sample and hold function
is performed in order to keep input data constant during the
conversion process. The stabilized signals coming out of U1
and U3 feed a higher output voltage to U2A than U2B,
assuming that pressure is applied to the sensor. Therefore,
the ramp will trip U2B before U2A is tripped, creating a time
difference between PAO going low and PA1 going low. The
processor reads the number of clock cycles between these
two events. This number is then linearly scaled with software
to represent the amplified output voltage, accomplishing the
analog to digital conversion.
When the ramp reaches the reference voltage established
by R9 and R10, comparator U2C is tripped, and a reset
command is generated. To accomplish reset, 01 is turned on
Motorola Sensor Device Data
with an output from PA7, and the sample and hold circuits are
delatched with an output from PB1. Resolution is limited by
clock frequency and ramp linearity. With the ramp generator
shown in Figure 7 and a clock frequency of 2 MHz; resolution
is 11 bits.
From a software point of view, the AJD conversion consists
of latching the sample and hold, reading the value of the
microcomputer's free running counter, turning off 01, and
waiting for the three comparator outputs to change state from
logic 1 to logic o. The analog input voltage is determined by
counting, in 0.5 ~sec steps, the number of clock cycles
between PAO and PA1 going low.
LONG DISTANCE INTERFACES
In applications where there is a significant distance between
the sensor and microcomputer, two types of interfaces are
typically used. They are frequency output and 4-20 mA loops.
In the frequency output topology, pressure is converted into a
zero to 5 V digital signal whose frequency varies linearly with
pressure. A minimum frequency corresponds to zero pressure
and above this, frequency output is determined by a Hz/unit
pressure scaling factor. If minimizing the number of wires to a
remote sensor is the most important design consideration,
4-20 mA current loops are the topology of choice. These loops
utilize power and ground as the 4-20 mA signal line and
therefore require only two wires to the sensor. In this topology
4 mA of total current drain from the sensor corresponds to zero
pressure, and 20 mA to full scale.
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R12
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NOMINAL OUTPUT:
1 kHz @ ZERO PRESSURE
10kHz @ FULL SCALE
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AN1318
A relatively straightforward circuit for converting pressure to
frequency is shown in Figure 8. It consists of three basic parts.
The interface amplifier is the same circuit that was described
in Figure 4. Its 0.5to 4.5 V output is fed directly into an AD654
voltage-to-frequency converter. On the AD654, C3 sets
nominal output frequency. Zero pressure output is calibrated
to 1 kHz by adjusting the zero pressure input voltage with R3.
Full scale adjustments are made with R12 which sets the full
scale frequency to 10kHz. The output of the AD654 is then fed
into a buffer consisting of 01 and R10. The buffer is used to
clean up the edges and level translate the output to 5 V.
Advantages of this approach are that the frequency output is
easily read by a microcomputer's timer and transmission over
a twisted pair line is relatively easy. Where very long distances
are involved, the primary disadvantage is that 3 wires (VCC,
ground and an output line) are routed to the sensor.
A 4-20 mA loop reduces the number of wires to two. Its
output is embedded in the VCC and ground lines as an active
current source. A straightforward way to apply this technique
to pressure sensing is shown in Figure 9. In this figure an
MPX7000 series high impedance pressure sensor is mated to
an XTR101 4-20 mA two-wire transmitter. It is set up to pull
4 mA from its power line at zero pressure and 20 mA at full
scale. At the receiving end a 240 ohm resistor referenced to
signal ground will provide a 0.96 to 4.8 V signal that is suitable
for microcomputer AID inputs.
2 rnA
4-20 rnA OUTPUT
XOCR1
MPX7000
SERIES
SENSOR
01
1N4002
Q1
MPSA06
C1
0.011-1F
,--,
1
11
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1
1
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1
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1
I 240
2
02
1N4565A '--_--1-_ _ _ _---'
6.4V@.5rnA
+
R1
750
1/2W
-=-24V
-- ~ T
r1~<---)(--)~1 ~
I
I I i '
R6
100 k
R4
1M
RETURN
V
PLOOP
1- _-;
~~
V
R2
1k
Figure 9. 4-20 mA Pressure Transducer
Bias for the sensor is provided by two 1 mA current sources
(pins 10 and 11) that are tied in parallel and run into a 1N4565A
6.4 V temperature compensated zener reference. The
sensor's differential output is fed directly into XTR101's
inverting and non-inverting inputs. Zero pressure offset is
calibrated to 4 mA with R6. Biased with 6.4 V, the sensor's full
scale output is 24.8 mV. Given this input R3 + R5 nominally
total 64 ohms to produce the 16 mA span required for 20 mA
full scale. Calibration is set with R5.
The XTRl 01 requires that the differential input voltage at pins
4-106
3 and 4 has a common mode voltage between 4 and 6 V. The
sensor's common mode voltage is one half its supply voltage
or 3.2 V. R2 boosts this common mode voltage by
1 k· 2 mA or 2 V, establishing a common mode voltage for the
transmitter's input of 5.2 V. To allow operation over a 12 to 40
V range, dissipation is off-loaded from the IC by boosting the
output with 01 and R1. D1 is also included for protection. It
prohibits reverse polarity from causing damage. Advantages of
this topology include simplicity and, of course, the two wire
interface.
Motorola Sensor Device Data
s:
R5
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R6
15%
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13
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24
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34
35
36
37
38
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10
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PB5
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AN1318
DIRECT INTERFACE
WITH INTEGRATED SENSORS
The simplest interface is achieved with an integrated sensor
and a microcomputer that has an on-chip AID converter.
Figure 10 shows an LCD pressure gauge that is made with an
MPXS100 integrated sensor and MC68HCOS microcomputer.
Although the total schematic is reasonably complicated, the
interface between the sensor and the micro is a single wire.
The MPXS100 has an internal amplifier that outputs a O.S to
4.S V signal that inputs directly to AID port PDS on the HCOS.
The software in this system is written such that the
processor assumes zero pressure at power up, reads the
sensor's output voltage, and stores this value as zero
pressure offset. Full scale span is adjustable with jumpers J1
and J2. For this particular system the software is written such
that with J1 out and J2 in, span is decreased by 1.S%. Similarly
with J 1 in and J2 out, span is increased by 1.S%. Given the ±
2.S% full scale spec on the sensor, these jumpers allow
calibration to ± 1% without the use of pots.
MIX AND MATCH
The circuits that have been described so far are intended to
be used as functional blocks. They may be combined in a
variety of ways to meet-the particular needs of an application.
For example, the Frequency Output Pressure Sensor in
Figure 8 uses the sensor interface circuit described in Figure
4 to provide an input to the voltage-te-frequency converter.
Alternately, an MPXS100 could be directly connected to pin 4
Precision
of the AD6S4 or the output of Figure 3's
Instrumentation Amplifier Interface could by substituted in the
same way. Similarly, the Pressure Gauge described in Figure
10 could be constructed with any of the interfaces that have
been described.
4-108
CONCLUSION
The circuits that have been shown here are intended to
make interfacing semiconductor pressure sensors to digital
systems easier. They provide cost effective and relatively
simple ways of interfacing sensors to microcomputers. The
seven different circuits contain many tradeoffs that can be
matched to the needs of individual applications. When
considering these tradeoffs it is important to throw software
into the equation. Techniques such as automatic zero
pressure calibration can allow one of the inexpensive analog
interfaces to provide performance that could otherwise only be
obtained with a more costly precision interface.
REFERENCES
1. Baum, Jeff, "Frequency Output Conversion for
MPX2000 Series Pressure Sensors," Motorola Application Note AN1316/D.
2. Lucas, William, "An Evaluation System for Direct Interface of the MPXS100 Pressure Sensor with a Microprocessor," Motorola Application Note AN130S.
3. Lucas, William, "An Evaluation System for Interfacing the
MPX2000 Series Pressure Sensors to a Microprocessor," Motorola Application Note AN131S.
4. Schultz, Warren, "Compensated Sensor Bar Graph
Pressure Gauge," Motorola Application Note AN1309.
S. Schultz, Warren, "Interfaced Sensor Evaluation Board,"
Motorola Application Note AN1312.
6. Schultz, Warren, "Sensor Building Block Evaluation
Board," Motorola Application Note AN1313.
7. Williams, Denise, "A Simple 4-20 mA Pressure Transducer Evaluation Board," Motorola Application Note
AN1303.
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1322
Applying Semiconductor Sensors to
Bar Graph Pressure Gauges
Prepared by: Warren Schultz
Discrete Applications Engineering
INTRODUCTION
Bar Graph displays are noted for their ability to very quickly
convey a relative sense of how much of something is present.
They are particularly useful in process monitoring applications
where quick communication of a relative value is more
important than providing specific data.
Designing bar graph pressure gauges based upon
semiconductor pressure sensors is relatively straightforward.
The sensors can be interfaced to bar graph display drive IC's,
microcomputers and MC33161 voltage monitors. Design
examples for all three types are included.
BAR GRAPH DISPLAY DRIVER
Interfacing semiconductor pressure sensors to a bar graph
display IC such as an LM3914 is very similar to microcomputer
interface. The same 0.5 to 4.5 V analog signal that a
microcomputer's AID converter wants to see is also quite
suitable for driving an LM3914. In Figure 1, this interface is
provided by dual op amp U2 and several resistors.
The op amp interface amplifies and level shifts the sensor's
output. To see how this amplifier works, simplify it by
grounding the output of voltage divider R3, R5. If the common
mode voltage at pins 2 and 4 of the sensor is 4.0 V, then pin
2 of U2A and pin 6 of U2B are also at 4.0 V. This puts 4.0 V
across R6. Assuming that the current in R4 is equal to the
current in R6, 323 !lA • 100 ohms produces a 32 mV drop
across R4 which adds to the 4.0 V at pin 2. The output voltage
at pin 1 of U2A is, therefore, 4.032 V. This puts 4.032 - 4.0 V
across R2, producing 43 !lA. The same current flowing
through R1 again produces a voltage drop of 4.0 V, which sets
the output at zero. Substituting a divider output greater than
zero into this calculation reveals that the zero pressure output
voltage is equal to the output voltage of divider R3, R5. For this
DC output voltage to be independent of the sensor's common
mode voltage, it is necessary to satisfy the condition that
R1/R2 R6/R4.
Gain can be determined by assuming a differential output
at the sensor and going through the same calculation. To do
this assume 100 mV of differential output, which puts pin 2 of
=
Motorola Sensor Device Data
U2A at 3.95 V, and pin 6 of U2B at 4.05 V. Therefore, 3.95 V is
applied to R6, generating 319 !lA. This current flowing through R4
produces 31.9 mV, placing pin 1 of U2A at 3950 mV + 31.9 mV
= 3982 mV. The voltage across R2 is then 4050 mV - 3982 mV
68 mV, which produces a current of 91 !lA that flows into R1.
The output voltage is then 4.05 V + (91 !lA • 93.1 k) 12.5 V.
Dividing 12.5 V by the 100mVinputyieidsagain of 125, which
provides a 4.0 V span for 32 mV of full scale sensor output.
Setting divider R3, R5 at 0.5 V results in a 0.5 V to 4.5 V
output that is easily tied to an LM3914. The block diagram that
appears in Figure 2 shows the LM3914's internal architecture.
Since the lower resistor in the input comparator chain is
pinned out at RLO, it is a simple matter to tie this pin to a voltage
that is approximately equal to the interface circuit's 0.5 V
zero pressure output voltage. Returning to Figure 1, this is
accomplished by using the zero pressure offset voltage that
is generated at the output of divider R3, R5.
Again looking at Figure 1, full scale is set by adjusting the
upper comparator's reference voltage to match the sensor's
oulput at full pressure. An internal regulator on Ihe LM3914
sets this voltage with the aid of resistors R7, R9, and
adjustment pot R8.
Eight volt regulated power is supplied by an MC78L08. The
LED's are powered directly from LM3914 outputs, which are
set up as current sources. Output current to each LED is
approximately 10 times the reference current that flows from
pin 7 through R7, R8, and R9 to ground. In this design it is
nominally (4.5 V/4.9 k)10 = 9.2 mAo
Over a zero 10 50°C temperature range combined accuracy
for Ihe sensor, interface, and driver IC are ±10%. Given a 10
segment display tolal accuracy for the bar graph readout is
approximately ± (10 kPa + 10%).
This circuit can be simplified by substituting an MPX5100
integrated sensor for the MPX2100 and the op amp interface.
The resulting schematic is shown in Figure 3. In this case zero
reference for the bar graph is provided by dividing down the
5 V regulalor with R4, R1 and adjustment pot R6. The vollage
at the wiper of R6 is adjusted to match the sensor's zero
pressure offset voltage. It is connected to RLO to zero the bar
graph.
=
=
4-109
AN1322
1
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~
C2
1 ~F
D2
~
3
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LED
LED
LED
LED
LED
LED
LED
LED
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1
0
~
LED
GND
3 B+
4 RLO
5 SIG
RHI
REF
ADJ
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c.......J:.
~
2
R3
1.5k
2
XDCRl
MPX2000
SERIES
1 SENSOR
~
1%
8
5
6 _
~
7_ ..J
~
R6
0
~~
1t?-
12.4k
1%
rt
Rl
U2B
93.1 k 1% MC3327
'-U2A
R2
MC33272
750
R5
100
1%
~
D7
~
D8
D9
Dl0
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MV5716
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2
G
D6
D5
BAR
GRAPH
O.l~F
Ul
D4
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D3
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R7 •
1.2 k
18
17
16
15
14
13
12
11
10
LM3914N
~
R8
~~
1%
R9
2.7k
4
FOR MPX201 0 SENSORS:
Rl=150k
R4 = 61.9 OHMS
~
R4
~
Figure 1. Compensated Sensor Bar Graph
Pressure Gauge
1001%
121 'lJ'
131 'lJ'
141 'lI'
THIS LOAD
DETERMINES
LED
BRIGHTNESS
CONTROLS
TYPE OF
DISPLAY, BAR
OR SINGLE
LED
SIG
IN
Figure 2. LM3914 Block Diagram
4-110
Motorola Sensor Device Data
AN1322
+12 V
1I
01
02
03
04
05
06
07
08
09
010
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-
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Ul
Cl
0.1
~
LEO
GNO
3 B+
4 RLO
5 SIG
RHI
REF
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3
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a
MC78L05ACP
G
I
1
rl-
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2
R4
1.3k
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1.2k
12
R5
1k
ZERO CAL.
1~
12
11
10
LM3914
FULL SCALE CAL.
R3
2.7k
Rl
100
I
18
17
16
15
14
~+--
R6
100
~
LEO
LEO
LEO
LEO
LEO
LEO
LEO
LEO
LEO
---+
~
~
Fi g ure 3. MPX5100 Bar Gra ph Pressure Ga uge
+5>-r------------------r----~======~~~--lr~--,_~--,_~__,
•
01
O/A
TCAPl
TCAP2
VOO
POD
POl
P02
P03
P04
VPP6
IRQ
P05
02
03
04
05
~
~
~
~
~
MV53214A
MV54124A
MV54124A
MV54124A
MV57124A
PCO
PCl f - - - - - - - - \
Ul
MC68HC705B5FN
Pc2f-----------1
RESET
Rl
10 k
Jl
PC3
P06
P07
OSCl
Cl
22 pF
J2
PC4
1 1
OSC2
I
C2
22pF
Motorola Sensor Device Data
ROI
TOO
Figure 4. Microcomputer Bar Graph Pressure Gauge
4-111
AN1322
B+~--~------------------------------~------------------~--~~----~-----,
Cl
TI
~
r~
C2
0.1 ~F
11
1 MOC4510A
R7
7.5k
01
lN914
02
lN914
R3
6.65 k
1%
R2
750
1%
R5
1.33k
1%
MC33161
R4
100
1%
Figure 5. An Inexpensive 3-Segment
Processor Monitor
r--------------------------------,
I
I VREF
2.54 V
REFERENCE
VCC
I
I
I
I
I
I MOOE SELECT
I
I
I
IINPUTI
I
I
I
I
I
I
I
OUT2
I
I
I
I
I
IINPUT2
:II
IL _ _ _ _ _ _ _ _
~
:II
_
-
_ GNO
______________________
I
~
Figure 6. MC33161 Block Diagram
4-112
Motorola Sensor Device Data
AN1322
MICROCOMPUTER BAR GRAPH
Microcomputers with internal AID converters such as an
MC68HC05B51end themselves to easily creating bar graphs.
Using the AID converter to measure the sensor's analog
output voltage and output ports to individually switch LED's
makes a relatively straightforward pressure gauge. This type
of design is facilitated by a new MDC451 OA gated current sink.
The MDC4510A takes one of the processor's logic outputs
and switches 10 rnA to an LED. One advantage of this
approach is that it is very flexible regarding the number of
segments that are used, and has the availability through
software to independently adjust scaling factors for each
segment. This approach is particularly useful for process
monitoring in systems where a microprocessor is already in
place.
Figure 4 shows a direct connection from an MPX5100
sensor to the microcomputer. Similarto the previous example,
an MPX2000 series sensor with the op amp interface that is
shown in Figure 1 can be substituted for the MPX5100.ln this
case the op amp interface's output at pin 7 ties to port PD5,
and its supply needs to come from a source greater than
6.5 V.
PROCESS MONITOR
For applications where an inexpensive HIGH-LOW-OK
process monitor is required, the circuit in Figure 5 does a good
job. It uses an MC33161 Universal Voltage Monitor and the
same analog interface previously described to indicate high,
low or in-range pressure.
A block diagram of the MC33161 is illustrated in Figure 6.
By tying pin 1 to pin 7 it is set up as a window detector.
Whenever input 1 exceeds 1.27 V, two logic ones are placed
at the inputs of its exclusive OR gate, turning off output 1.
Therefore this output is on unless the lower threshold is
exceeded. When 1.27 V is exceeded on input 2, just the
opposite occurs. A single logic one appears at its exclusive
OR gate, turning on output 2. These two outputs drive LED's
through MDC4010A 10 rnA current sources to indicate low
pressure and high pressure.
Returning to Figure 5, an in-range indication is developed
by turning on current source 11 whenever both the high and
low outputs are off. This function is accomplished with a
discrete gate made from D1, D2 and R7. Its output feeds the
Motorola Sensor Device Data
input of switched current source 11, turning it on with R7 when
neither D1 nor D2 is forward biased.
Thresholds are set independently with R8 and R9. They
sample the same 4.0 V full scale span that is used in the other
examples. However, zero pressure offset is targeted for 1.3 V.
This voltage was chosen to approximate the 1.27 V reference
at both inputs, which avoids throwing away the sensor's
analog output signal to overcome the MC33161's input
threshold. In addition, R10 and R11 are selected such that at
full scale output, ie., 5.3 V on pin 7, the low side of the pots is
nominally at 1.1 V. This keeps the minimum input just below
the comparator thresholds of 1.27 V, and maximizes the
resolution available from adjustment pots R8 and R9. When
level adjustment is not desired, R8 - R11 can be replaced by
a simpler string of three fixed resistors.
CONCLUSION
The circuits that have been shown here are intended to
make simple, practical and cost effective bar graph pressure
gauges. Their application involves a variety of trade-offs that
can be matched to the needs of individual applications. In
general, the most important trade-offs are the number of
segments required and processor utilization. If the system in
which the bar graph is used already has a microprocessor with
unused AID channels and 1/0 ports, tying MDC451 OA current
sources to the unused output ports is a very cost effective
solution. On a stand-alone basis, the MC33161 based
process monitor is the most cost effective where only 2 or 3
segments are required. Applications that require a larger
number of segments are generally best served by one of the
circuits that uses a dedicated bar graph display.
REFERENCES
1. Alberkrack, Jade, & Barrow, Stephen; "Power Supply
Monitor IC Fills Voltage Sensing Roles," Power Conversion & Intelligent Motion, October 1991.
2. Lucas, William, "An Evaluation System for Direct Interface of the MPX5100 Pressure Sensor with a Microprocessor," Motorola Application Note AN1305.
3. Schultz, Warren, "Integrated Sensor Simplifies Bar
Graph Pressure Gauge," Motorola Application Note
AN1304.
4. Schultz, Warren, "Compensated Sensor Bar Graph
Pressure Gauge," Motorola Application Note AN1309.
4-113
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1324
A Simple Sensor Interface Amplifier
Prepared by: Warren Schultz
Discrete Applications Engineering
INTRODUCTION
Compensated semiconductor pressure sensors such as
the MPX2000 family are relatively easy to interface with digital
systems. With these sensors and the circuitry that is described
here, pressure is translated into a 0.5 to 4.5 V output range that
is directly compatible with Microcomputer AID inputs. A
description of an Evaluation Board and design considerations
are presented as follows.
Figure 1. DEVB173 Sensor Building Block Evaluation Board
4-114
Motorola Sensor Device Data
AN1324
EVALUATION BOARD DESCRIPTION
A summary of the information required to use the Sensor
Mini Block evaluation board, part number DEVBI73, is
presented as follows. A discussion of the design appears
under the heading Design Considerations.
FUNCTION
The evaluation board shown in Figure 1 is designed to
translate pressure, vacuum, or differential pressure into a
single-ended, ground referenced voltage that is suitable for
direct input to microcomputer ND ports. It has two input ports.
PI, the pressure port, is on the top side of the sensor and P2,
a vacuum port, is on the bottom side. These ports can be
supplied pressure on PI or vacuum on P2, or a differential
pressure between PI and P2. Any of these sources will
produce equivalent outputs.
The output is a ground referenced analog signal. It
nominally supplies 0.5 V at zero pressure and 4.5 V at full
scale. A zero adjustment has been made at the factory with
trim resistor R7. Full scale output is approximately 4 V above
the zero setting.
ELECTRICAL CHARACTERISTICS
The following electrical characteristics are included as a
guide to operation.
Characteristic
Symbol
Min
Typ
Max
Units
Power Supply Voltage
B+
10
-
30
Volts
Full Scale Pressure
MPX2010
MPX2050
MPX2100
MPX2200
MPX2700
PFS
-
-
10
50
100
200
700
700
Overpressure
Full Scale Output
Zero Pressure Offset
Sensitivity
Quiescent Current
kPa
-
-
PMAX
-
-
VFS
4.5
-
VOFF
-
0.5
-
Volts
SAOUT
-
4V1PFS
-
V/kPa
ICC
-
25
-
rnA
kPa
Volts
CONTENT
Board contents are described in the following parts list and
schematic. A pin-by-pin circuit description follows in the next
section.
Table 1. Parts List
Cl
1
Ceramic Capacitor
C2
1
Ceramic Capacitor
C3
1
Ceramic Capacitor
0.001
Rl"
1
1/4 Watt Film Resistor
93.1 kl%
R2
1
1/4 Watt Film Resistor
7501%
R3
1
1/4 Watt Film Resistor
39.2 k 1%
R4"
1
1/4 Watt Film Resistor
1001%
R5
1
1/4 Watt Film Resistor
1.33kl%
R6
1
1/4 Watt Film Resistor
11 kl%
R7
1
1/4 Watt Film Resistor
Trim
Ul
1
OpAmp
Motorola
MC33272P
U2
1
8 V Regulator
Motorola
MC78L08ACP
1
Pressure Sensor
Motorola
MPX2100DP
XDCRI
Value
Part
Qty.
"For MPX2010 Sensors Rl
Description
Vendor
Designator
0.2~F
0.2~F
~F
=150 k & R4 =61.9 ohms
PIN-BY-PIN DESCRIPTION
Input power is supplied at the B+ terminal. Minimum input
voltage is 6.8 V and maximum is 30 V.
GND:
The terminal labeled GND is intended for use as the power
supply return. It is generally advisable to leave enough bare
wire going into this terminal to conveniently provide a
connection for instrumentation ground clips.
OUT:
An analog output is supplied at the OUTterminal. The signal
it provides is nominally 0.5 V at zero pressure and 4.5 Vatfull
scale. This output is designed to be directly connected to a
microcomputer ND channel, such as one of the E ports on an
MC68HCll.
Motorola Sensor Device Data
PI, P2:
Pressure and Vacuum ports PI and P2 protrude from the
sensor on the right side of the board. Pressure port PI is on
the top and vacuum port P2 is on the bottom. Neither port is
labeled. Maximum safe pressure is 700 kPa.
4-115
AN1324
3
Ul
MC78L08ACP
C2
Io.2
I1F
4
U2B
MC33272
Rl
2 XDCRI
MPX2000
SERIES
1 SENSOR
93.1 k 1%
-=
C3
R7
TRIM
R2
750
1%
R3
39.2k
NOTES:
R7 selected for zero pressure VOUT = 0.5 V
For MPX2010 Sensors:
Rl =150k
R4 =61.9 Ohms
-=
R6
11 k
1%
R5
1.33k
1%
O.OOII1F
R4
100
1%
-=
Figure 2. Sensor Mini Block
8
3
4
U2B
MC33272
Rl
2 XDCRI
MPX2000
SERIES
1 SENSOR
93.1 k
R2 1%
750
1%
-=
V FFSE'[
R6
12.4k
1%
R4
100
1%
Figure 3. Simplified Schematic
4-116
Motorola Sensor Device Data
AN1324
DESIGN CONSIDERATIONS
When interfacing semiconductor pressure sensors to
microcomputers, the design challenge is how to take a
relatively small DC coupled differential signal and produce a
ground referenced output that is suitable for driving AID
inputs. A very simple interface circuit that will do this job is
shown in Figure 2. It uses one dual op amp and several
resistors to amplify and level shift the sensor's output. To see
how this amplifier works, let's simplify it in Figure 3, and
assume VOFFSET is zero. If the common mode voltage at pins
2 and 4 of the sensor is 4.0 V, then pin 2 of U2A and pin 6 of
U2B are also at 4.0 V. This puts 4.0 V across R6. Assuming
that the current in R4 is equal to the current in R6, 323 ~A x
100 ohms produces a 32 mV drop across R4 which adds to the
4.0 V at pin 2. The output voltage at pin 1 of U2A is, therefore,
4.032 V. This puts 4.032 - 4.0 V across R2, producing 43 ~A.
The same current flowing through R1 again produces a
voltage drop of 4.0 V, which sets the output at zero.
Substituting a value for VOFFSET other than zero into this
calculation reveals that the zero pressure output voltage
equals VOFFSET Forthis DC output voltage to be independent
of the sensor's common mode voltage it is necessary to satisfy
the condition that R1/R2 = R6/R4.
Gain can be determined by assuming a differential output
atthe sensor and going through the same calculation. To do
this assume 100 mV of differential output, which puts pin 3 of
U2A at 3.95 V, and pin 5 of U2B at 4.05 V. Therefore, 3.95 V
is applied to R6, generating 319 ~A. This current flowing
through R4 produces 31.9 mY, placing pin 1 of U2A at 3950 mV
+ 31.9 mV = 3982 mY. The voltage across R2 is then 4050 mV
- 3982 mV = 68 mY, which produces a current of 91 ~A that
. flows into R 1. The output voltage is then 4.05 V + (91 ~A 0
93.1 k) = 12.5 V. Dividing 12.5 V by the 100 mV input yields
again of 125, which providesa4 V spanfor32 mVoffull scale
sensor output.
Returning to Figure 2, a 0.5 V VOFFSET is generated by the
divider consisting of R3, R5, and R7. To keep the input
irnpedance looking into pin 2 of U2A at 12.4 k, R6 is chosen
as 11 k. The divider impedance is then chosen to nominally be
1.4 k, providing a total of 12.4 k. For purposes of analysis, the
complete circuit in Figure 2 is then equivalent to Figure 3 with
a VOFFSET input of 0.5 V.
The resulting 0.5 V to 4.5 V output from pin 7 of U2B is
directly cornpatible with microprocessor AID inputs. Over a
zero to 50°C temperature range combined accuracy for the
sensor and interface is ±5%.
APPLICATION
Using the Sensor Mini Block's analog output to provide
pressure information to a microcomputer is very
straightforward. The output voltage range which goes from 0.5
V at zero pressure to 4.5 V at full scale is designed to make
optirnurn use of microcomputer AID inputs. A direct
connection from the evaluation board output to an AID input
is all that is required. Using the MC68HC11 as an example, the
output is connected to any of the E ports, such as port EO.
CHANGING SENSORS
In order to change pressure ranges, MPX2050, MPX21 00,
MPX2200, and MPX2700 pressure sensors can be
substituted directly for each other. When one of these sensors
is substituted for another, the 4.5 V full scale output will remain
the same and correspond to the new sensor's full scale
pressure specification. For example, substituting an
MPX2200 200 kPa sensor for an MPX2100 100 kPa unit will
change the full scale output from 4.5 V at 100 kPa to 4.5 Vat
200 kPa. To make this translation with an MPX2010 requires
changing R1 from 93.1 k to 150 k and R4 from 100 ohms to
61.9 ohrns. With R1 at 93.1 k and R4 at 100 ohms, full scale
span for an MPX2010 is only 2.5 V, producing a nominal full
scale output voltage of 3.0 V.
FURTHER SIMPLIFICATION
In non-demanding applications the 7 resistor topology that
is shown in Figure 2 can be reduced to 5, by eliminating R6 and
R7. Without R7 the zero pressure offset is untrimmed.
However, in microprocessor based systems it is relatively
easy to read the zero pressure offset voltage, store it, and
calibrate in software. This can be done automatically when the
unit powers up, or as a calibration procedure. R6 can be
eliminated (reduced to zero ohms) by directly connecting the
R3, R5 divider to pin 2. The output impedance of this divider
then needs to be choosen such that its ratio with R4 = R1/R2,
in other words [R3 o R5/(R3+R5)]/R4 = R1/R2. Given the
values in Figure 2, this would mean R3 = 200 k, R5 = 13.3 k,
R6 = 0, and R7 is open. In an untrimmed system, there is no
real disadvantage to doing this, provided that the ratios can be
sufficiently matched with standard resistor values.
The other option is to eliminate R6 and trim R3 with R7. This
situation is somewhat different. The trimming operation will
throw the ratio off, and reduce common mode rejection.
Typically several percent of any change in the sensor's
common mode voltage will show up as an output error when
this configuration is used.
CONCLUSION
Perhaps the most noteworthy aspect to the sensor amplifier
described here is its simplicity. The interface between an
MPX2000 series sensor and a microcomputer AID consists of
Motorola Sensor Device Data
one dual op amp and a few resistors. The result is a simple and
inexpensive circuit that is capable of measuring pressure,
vacuum or differential pressure.
4-117
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1325
Amplifiers for Semiconductor Pressure Sensors
Prepared by: Warren Schultz
Discrete Applications Engineering
INTRODUCTION
Amplifiers for interfacing Semiconductor Pressure Sensors
10 electronic systems have historically been based upon
classic instrumentation 'amplifier designs, Instrumentation
amplifiers have been widely used because they are well
understood standard building blocks that also work
reasonably well.
For the specific job of interfacing
Semiconductor Pressure Sensors to today's mostly digital
systems, other circuits can do a better job, This application
note presents an evolution of amplifier design that begins with
a classic instrumentation amplifier and ends with a simpler
circuit that is better suited to sensor interface.
INTERFACE AMPLIFIER REQUIREMENTS
Design requirements for interface amplifiers are
determined by the sensor's output characteristics, and the
zero to 5 V input range that is acceptable to microcomputer
AID converters. Since the sensor's full scale output is typically
tens of millivolts, the most obvious requirement is gain. Gains
from 100 to 250 are generally needed, depending upon bias
voltage applied to the sensor and maximum pressure to be
measured. A differential to single-ended conversion is also
required in order to translate the sensor's differential output
into a single ended analog signal. In addition, level shifting is
necessary to convert the sensor's 1/2 B+ common mode
voltage to an appropriate DC level. For microcomputer AID
inputs, generally that level is from 0.3 - 1.0 V. Typical design
targets are 0.5 V at zero pressure and enough gain to produce
4.5 V at full scale. The 0.5 V zero pressure offset allows for
output saturation voltage in op amps operated with a single
supply (VEE 0). At the other end, 4.5 V full scale keeps the
output within an AID converter's 5 V range with a comfortable
margin for component tolerances, The resulting 0.5 to 4,5 V
single-ended analog signal is also quite suitable for a variety
of other applications such as bar graph pressure gauges and
process monitors.
=
CLASSIC INSTRUMENTATION AMPLIFIER
A classic instrumentation amplifier is shown in Figure 1.
This circuit provides the gain, level shifting and differential to
single-ended conversion that are required for sensor
interface. It does not, however, provide for single supply
operation with a zero pressure offset voltage in the desired
range.
Vcc
R41k
R31k
RB 15k
B
R5
1k
U1C
MC33274
-=
OUTPUT
R2
1k
• NOTE: FOR MPX2020 RIO = 150 OHMS
Figure 1. Classic Instrumentation Amplifier
REV 1
4-118
Motorola Sensor Device Data
AN1325
C2
Io.l 1l F
R7
7.5 k
::-
14
ZERO
::-
R4
::-
RS 15 k
GND
XDCRl
MPX2000 SERIES
PRESSURE SENSOR
Rl0
240'
R3 1 k
1k
OUTPUT
R9
R5
15 k
1k
1k
• NOTE: FOR MPX2010 Rl0 = l500HMS
Figure 2. Instrumentation Amplifier Interface
To provide the desired DC offset, a slight modification is
made in Figure 2. R3 is connected to pin 14 of U1 D, which
supplies a buffered offset voltage that is derived from the wiper
of R6. This voltage establishes a DC output for zero
differential input. The translation is one to one. Whatever
voltage appears at the wiper of R6 will, within component
tolerances, appear as the zero pressure DC offset voltage at
the output.
With Rl0 at 240 Q gain is set for a nominal value of 125,
providing a 4 V span for 32 mV of full scale sensor output.
Setting the offset voltage to 0.75 V, results in a 0.75 V to 4.75
V output that is directly compatible with microprocessor AID
inputs.
This circuit works reasonably well, but has several notable
limitations when made with discrete components. First, it has
a relatively large number of resistors that have to be well
matched. Failure to match these resistors degrades common
mode rejection and initial tolerance on zero pressure offset
voltage. It also has two amplifiers in one gain loop, which
makes stability more of an issue than it is in the following two
alternatives. This circuit also has more of a limitation on zero
pressure offset voltage than the other two. The minimum
output voltage of U 1D restricts the minimum zero pressure
offset voltage that can be accommodated, given component
tolerances. The result is a 0.75 V zero pressure offset voltage,
compared to 0.5 V for each of the following two circuits.
Motorola Sensor Device Data
SENSOR SPECIFIC AMPLIFIER
The limitations associated with classic instrumentation
amplifiers suggest that alternate approaches to sensor
interface design are worth looking at. One such approach is
shown in Figure 3. It uses one quad op amp and several
resistors to amplify and level shift the sensor's output.
Most of the amplification is done in U 1A, which is configured
as a differential amplifier. It is isolated from the sensor's minus
output by U1 B. The purpose of U1 B is to prevent feedback
current that flows through R5 and R6 from flowing into the
sensor. At zero pressure the voltage from pin 2 to pin 4 on the
sensor is zero V. For example, assume that the common
mode voltage is 4.0 V. The zero pressure output voltage at pin
1 of U1A is then 4.0 V, since any other voltage would be
coupled back to pin 2 via R6 and create a non zero bias across
U1 />:s differential inputs. This 4.0 V zero pressure DC output
voltage is then level translated to the desired zero pressure
offset voltage by U1C and U1D. To see how the level
translation works, assume that the wiper of R9 is at ground.
With 4.0 V at pin 12, pin 13 is also at 4.0 V. This leaves 4.0 V
across (R3+R9), which total essentially 1 kQ. Since no current
flows into pin 13, the same current flows through R4,
producing approximately 4.0 V across R4, as well. Adding the
voltages (4.0 + 4.0) yields 8.0 V at pin 14. Similarly 4.0 V at
pin 10 implies 4.0 V at pin 9, and the drop across R2 is 8.0 V
- 4.0 = 4.0 V. Again 4.0 V across R2 implies an equal drop
across
4-119
AN1325
r4~--------~~--------~------1------------------OTP2+8V
C1
l~
XDCR1
MPX2000 SERIES
PRESSURE SENSOR
GND
OUT
R8
1.5k
R9 200
R4 1 k
ZERO
CAL .
• NOTE: FOR MPX201 0 R5 = 75 OHMS
Figure 3. Sensor Specific Amplifier
=
R1, and the voltage at pin 8 is 4.0 V - 4.0 V 0 V. In practice,
the output of U1C will not go all the way to ground, and the
voltage injected by R8 at the wiper of R9 is approximately
translated into a DC offset.
Gain is approximately equal to R6/R5(R1/R2+1), which
predicts 125 for the values shown in Figure 3. A more exact
calculation can be performed by doing a nodal analysis, which
yields 127. Cascading the gains of U1A and U1C using
standard op amp gain equations does not give an exact result,
because the sensor's negative going differential signal at pin
4 subtracts from the DC level that is amplified by U1 C. Setting
offset to 0.5 V results in an analog zero to full scale range of
0.5 to 4.5 V. For this DC output voltage to be independent of
the sensor's common mode voltage it is necessary to satisfy
the condition that R1/R2 (R3+R9)/R4.
This approach to interface amplifier design is an
improvement over the classic instrument amplifier in that it
uses fewer resistors, is inherently more stable, and provides
a zero pressure output voltage that can be targeted at .5 V. It
has the same tolerance problem from matching discrete
resistors that is associated with classic instrument amplifiers.
=
SENSOR MINI AMP
Further improvements can be made with the circuit that is
shown in Figure 4. It uses one dual op amp and several
resistors to amplify and level shift the sensor's output. To see
how this amplifier works, let's simplify it by grounding the
output of voltage divider R3, R5 and assuming that the divider
impedance is added to R6, such that R6 = 12.4 k. If the
common mode voltage at pins 2 and 4 of the sensor is 4.0 V,
4-120
then pin 2 of U2A and pin 6 of U2B are also at 4.0 V. This puts
4.0 V across R6, producing 3231lA. Assuming thatthe current
in R4 is equal to the current in R6, 323 j.tA • 100 Q produces
a 32 mV drop across R4 which adds to the 4.0 V at pin 2. The
output voltage at pin 1 of U2A is, therefore, 4.032 V. This puts
4.032 - 4.0 V across R2, producing 431lA. The same current
flowing through R1 again produces a voltage drop of 4.0 V,
which sets the output at zero. Substituting a divider output
greater than zero into this calculation reveals that the zero
pressure output voltage is equal to the output voltage of
divider R3, R5. For this DC output voltage to be independent
of the sensor's common mode voltage it is necessary to satisfy
the condition that R1/R2 = R6/R4, where R6 includes the
divider impedance.
Gain can be determined by assuming a differential output at
the sensor and going through the same calculation. To do this
assume 100 mV of differential output, which puts pin 2 of U2A
at 3.95 V, and pin 6 of U2B at 4.05 V. Therefore, 3.95 V is
applied to R6, generating 319 uA. This currentflowing through
R4 produces 31.9 mV, placing pin 1 of U2A at 3950 mV + 31.9
mV = 3982 mV. The voltage across R2 is then 4050 mV 3982 mV 68 mV, which produces a current of 91 IlA that
flows into R1. The output voltage is then 4.05 V + (91 IlA.
93.1 k) = 12.5 V. Dividing 12.5 V by the 100 mVinput yields
a gain of 125, which provides a 4 V span for 32 mV of full
scale sensor output. Setting divider R3, R5 at 0.5 V results
in aO.5 Vto 4.5 Voutputthat is comparable to the other two
circuits.
This circuit performs the same function as the other two with
significantly fewer components and lower cost. In most cases
it is the optimum choice for a low cost interface amplifier.
=
Motorola Sensor Device Data
AN1325
B+
OUT
XDCR1
MPX2000 SERIES
SENSOR
R1 93.1 k 1%
4
R3
39.2k
R7
TRIM
-=
1%
U1B
MC33272
GND
1
C20.0011lF
R2
750
1%
R6
R5
1.33 k
11 k
1%
1%
NOTES:
R71S NOMINALLY 39.2 k AND SELECTED FOR ZERO PRESSURE VOUT = 0.5 V
FOR MPX2010 SENSORS R1 = 150 k AND R4 = 61.9 OHMS
R4
100
1%
Figure 4. Sensor Mini Amp
PERFORMANCE
Performance differences between the three topologies are
minor. Accuracy is much more dependent upon the quality of
the resistors and amplifiers that are used and less dependent
on which of the three circuits are chosen. For example, input
offset voltage error is essentially the same for all three circuits.
To a first order approximation, it is equal to total gain times the
difference in offset between the two amplifiers that are directly
tied to the sensor. Errors due to resistor tolerances are
somewhat dependent upon circuit topology. However, they
are much more dependent upon the choice of resistors.
Choosing 1% resistors rather than 5% resistors has a much
larger impact on performance than the minor differences that
result from circuit topology. Assuming a zero pressure offset
adjustment, any of these circuits with an MPX2000 series
sensor, 1% resistors and an MC33274 amplifier results in a
± 5% pressure to voltage translation from 0 to 50° C. Software
calibration can significantly improve these numbers and
eliminate the need for analog trim.
CONCLUSION
Although the classic instrumentation amplifier is the best
known and most frequently used sensor interface amplifier, it
is generally not the optimal choice for inexpensive circuits
made from discrete components. The circuit that is shown in
Motorola Sensor Device Data
Figure 4 performs the same interface function with
significantly fewer components, less board space and at a
lower cost. It is generally the preferred interface topology for
MPX2000 series semiconductor pressure sensors.
4-121
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1326
Barometric Pressure Measurement Using
Semiconductor Pressure Sensors
Prepared by: Chris Winkler and Jeff Baum
Discrete Applications Engineering
ABSTRACT
The most recent advances in silicon micromachining
technology have given rise to a variety of low-cost pressure
sensor applications and solutions. Certain applications had
previously been hindered by the high-cost, large size, and
overall reliability limitations of electromechanical pressure
sensing devices. Furthermore, the integration of on-chip
temperature compensation and calibration has allowed a
significant improvement in the accuracy and temperature
stability of the sensor output signal. This technology allows for
the development of both analog and microcomputer-based
systems that can accurately resolve the small pressure
changes encountered in many applications. One particular
application of interest is the combination of a silicon pressure
sensor and a microcontroller interface in the design of a digital
barometer. The focus of the following documentation is to
present a low-cost, simple approach to designing a digital
barometer system.
11111111
I IJ IJ IJ. . . .I
DIGITl
DIGIT3
DIGIT2
DIGIT4
MCU
SIGNAL CONDITIONING
Figure 1. Barometer System
4-122
Motorola Sensor Device Data
AN1326
INTRODUCTION
Table 1. Altitude versus Pressure Data
Figure 1 shows the overall system architecture chosen for
this application. This system serves as a building block, from
which more advanced systems can be developed. Enhanced
accuracy, resolution, and additional features can be
integrated in a more complex design.
There are some preliminary concerns regarding the
rneasurement of barometric pressure which directly affect the
design considerations for this system. Barometric pressure
refers to the air pressure existing at any pOint within the earth's
atrnosphere. This pressure can be measured as an absolute
pressure, (with reference to absolute vacuum) or can be
referenced to some other value or scale. The meteorology and
avionics industries traditionally measure the absolute
pressure, and then reference it to a sea level pressure value.
This complicated process is used in generating maps of
weather systems. The atmospheric pressure at any altitude
varies due to changing weather conditions over time.
Therefore, it can be difficult to determine the significance of a
particular pressure measurement without additional
information. However, once the pressure at a particular
location and elevation is determined, the pressure can be
calculated at any other altitude. Mathematically, atmospheric
pressure is exponentially related to altitude. This particular
system is designed to track variations in barometric pressure
once it is calibrated to a known pressure reference at a given
altitude.
For simplification, the standard atmospheric pressure at
sea level is assumed to be 29.9 in-Hg. "Standard" barometric
pressure is rneasured at particular altitude at the average
weather conditions for that altitude over time. The system
described in this text is specified to accurately measure
barometric pressure variations up to altitudes of 15,000 ft. This
altitude corresponds to a standard pressure of approximately
15.0 in-Hg. As a result of changing weather conditions, the
standard pressure at a given altitude can fluctuate
approximately ±1 in-Hg. in either direction. Table 1 indicates
standard barometric pressures at several altitudes of interest.
Altitude (Ft.)
Pressure (in-Hg)
0
29.92
500
29.36
1,000
26.65
6,000
23.97
10,000
20.57
15,000
16.66
SYSTEM OVERVIEW
In order to measure and display the correct barometric
pressure, this system must perform several tasks. The
rneasurement strategy is outlined below in Figure 2. First,
pressure is applied to the sensor. This produces a proportional
differential output voltage in the millivolt range. This signal
must then be amplified and level-shifted to a single-ended,
microcontroller (MCU) cornpatible level (0.5 - 4.5 V) by a
signal conditioning circuit. The MCU will then sample the
voltage at the analog-ta-digital converter (AID) channel input,
convert the digital measurement value to inches of mercury,
and then display the correct pressure via the LCD interface.
This process is repeated continuously.
There are several significant performance features
implemented into this system design. First, the system will
digitally display barometric pressure in inches of mercury, with
a resolution of approximately one-tenth of an inch of rnercury.
In order to allow for operation over a wide altitude range (015,000 ft.), the system is designed to display barometric
pressures ranging from 30.5 in-Hg. to a minimum of 15 ..0
in-Hg. The display will read "10" if the pressure rneasured IS
below 30.5 in-Hg. These pressures allow for the system to
operate with the desired resolution in the range from sea-level
to approximately 15,000 ft. An overview of these features is
shown in Table 2.
Table 2. System Features Overview
Display Units
MPX2100AP
PRESSURE
SENSOR
MC6BHC11E9
MICROCONTROLLER
CLOCKSYNCH
Resolution
in-Hg
0.1 in-Hg.
System Range
15.0 - 30.5 in-Hg.
Altitude Range
0-15,000 ft.
DATA
.----''----'--..,
DESIGN OVERVIEW
4-DIGITLCD
& MC145453
DISPLAY DRIVER
Figure 2. Barometer System Block Diagram
Motorola Sensor Device Data
The following sections are included to detail the system
design. The overall system will be described by considering
the subsystems depicted in the system block diagram, Figure
2. The design of each subsystem and its function in the overall
system will be presented.
4 123
AN1326
Table 3. MPX2100AP Electrical Characteristics
Characteristic
Pressure Range
Symbol
Minimum
POP
Supply Voltage
Vs
Full Scale Span
VFSS
Zero Pressure Offset
Typical
Max
Unit
100
kPa
10
16
Vdc
40
41.5
mV
0
38.5
±1.0
VoH
Sensitivity
S
mV
0.4
mvlkPa
0.05
%FSS
Temperature EHect on Span
0.5
%FSS
Temperature EHect on OHset
0.2
%FSS
Linearity
Pressure Sensor
The first and most important subsystem is the pressure
transducer. This device converts the applied pressure into a
proportional, differential voltage signal. This output signal will
vary linearly with pressure. Since the applied pressure in this
application will approach a maximum level of 30.5 in-Hg. (100
kPa) at sea level, the sensor output must have a linear output
response over this pressure range. Also, the applied pressure
must be measured with respect to a known reference pressure,
preferably absolute zero pressure (vacuum). The device should
also produce a stable output over the entire operating
temperature range.
The desired sensor for this application is a temperature
compensated and calibrated, semiconductor pressure
transducer, such as the Motorola MPX2100A series sensor
family. The MPX2000 series sensors are available in
full-scale pressure ranges from 10 kPa (1.5 psi) to 200 kPa
(30 psi). Furthermore, they are available in a variety of
pressure configurations (gauge, differential, and absolute)
and porting options. Because of the pressure ranges involved
with barometric pressure measurement, this system will
employ an MPX2100AP (absolute with single port). This
device will produce a linear voltage output in the pressure
range of 0 to 100 kPa. The ambient pressure applied to the
single port will be measured with respect to an evacuated
cavity (vacuum reference). The electrical characteristics for
this device are summarized in Table 3.
As indicated in Table 3, the sensor can be operated at
different supply voltages. The full-scale output of the sensor,
which is specified at 40 mV nominally for a supply voltage of
10 Vdc, changes linearly with supply voltage. All non-digital
circuitry is operated at a regulated supply voltage of 8 Vdc.
Therefore, the full-scale sensor output (also the output of the
sensor at sea level) will be approximately 32 mV.
(180 x 40 mv)
The sensor output voltage at the systems minimum range
(15 in-Hg.) is approximately 16.2 mV. Thus, the sensor output
over the intended range of operations is expected to vary from
32 to 16.2 mV. These values can vary slightly for each sensor
as the offset voltage and full-scale span tolerances indicate.
4-124
Signal Conditioning Circuitry
In order to convert the small-signal differential output signal
of the sensor to MCU compatible levels, the next subsystem
includes signal conditioning circuitry. The operational
amplifier circuit is designed to amplify, level-shift, and ground
reference the output signal. The signal is converted to a
single-ended, 0.5 - 4.5 Vdc range. The schematic for this
amplifier is shown in Figure 3.
This particular circuit is based on classic instrumentation
amplifier design criteria. The differential output signal of the
sensor is inverted, amplified, and then level-shifted by an
adjustable offset voltage (through Roffset1 ). The offset voltage
is adjusted to produce 0.5 volts at the maximum barometric
pressure (30.5 in-Hg.). The output voltage will increase for
decreasing pressure. If the output exceeds 5.1 V, a zener
protection diode will clamp the output. This feature is included
to protectthe AID channel input olthe MCU. Using the transfer
function for this circuit, the offset voltage and gain can be
determined to provide 0.1 in-Hg of system resolution and the
desired output voltage level. The calculation of these
parameters is illustrated below.
In determining the amplifier gain and range of the trimmable
offset voltage, it is necessary to calculate the number of steps
used in the AID conversion process to resolve 0.1 in-Hg.
.
steps
(30.5 - 15.0)In-Hg· 10
= 155 steps
H9
The span voltage can now be determined. The resolution
provided by an 8-bit AID converter with low and high voltage
references of zero and five volts, respectively, will detect 19.5
mV of change per step.
V RH = 5 V, V RL = 0 V
=
=
Sensor Output at 30.5 in-Hg 32.44 mV
Sensor Output at 15.0 in-Hg 16.26 mV
LlSensor Output = LlSO = 16.18 mV
Gain
= 3.04
V
LlSO
= 187
Note: 30.5 in-Hg and 15.0 in-Hg are the assumed
maximum and minimum absolute pressures, respectively.
Motorola Sensor Device Data
AN1326
This gain is then used to determine the appropriate resistor
values and offset voltage for the amplifier circuit defined by the
transfer function shown below.
Vout
=- [
a 16-bit timer, an SPI (Serial Peripheral Interface synchronous), and SCI (Serial Communications Interface asynchronous), and a maximum of 40 I/O lines. This device is
available in several package configurations and product
variations which include additional RAM, EEPROM, and/or
I/O capability. The software used in this application was
developed using the MC68HC11 EVB development system.
The following software algorithm outlines the steps used to
perform the desired digital processing. This system will
convert the voltage at the AID input into a digital value, convert
this measurement into inches of mercury, and output this data
serially to an LCD display interface (through the on-board
SPI). This process is outlined in greater detail below:
:~ + 1]. ~V + V off
~V
is the differential output of the sensor.
The gain of 187 can be implemented with:
R1 ~ R3 121 n
R2 ~ R4 22.6 k n.
=
=
Choosing Roffset1to be 1 kn and Roffset2to be 2.5 k n, Vout
is 0.5 V at the presumed maximum barometric pressure of
30.5 in-Hg. The maximum pressure output voltage can be
trimmed to a value other than 0.5 V, if desired via Roffset1. In
addition, the trimmable offset resistor is incorporated to
provide offset calibration if significant offset drift results from
large weather fluctuations.
The circuit shown in Figure 3 employs an MC33272
(Iow-cost, low--drift) dual operational amplifier IC. In order to
control large supply voltage fluctuations, an 8 Vdc regulator,
MC78L08ACP, is used. This design permits use of a battery
for excitation.
1.
2.
3.
4.
5.
6a.
6b.
7.
The signal conditioned sensor output signal is connected to
pin PE5 (Port E-AID Input pin). The MCU communicates to
the LCD display interface via the SPI protocol. A listing of the
assembly language source code to implement these tasks is
included in the appendix. In addition, the software can be
downloaded directly from the Motorola MCU Freeware
Bulletin Board (in the MCU directory). Further information is
included at the beginning of the appendix.
Microcontroller Interface
The low cost of MCU devices has allowed for their use as
a signal processing tool in many applications. The MCU used
in this application, the MC68HC11, demonstrates the power of
incorporating intelligence into such systems. The on-chip
resources of the MC68HC11 include: an 8 channel, 8-bit AID,
+12V
Set up and enable AID converter and SPI interface.
Initialize memory locations, initialize variables.
Make AID conversion, store result.
Convert digital value to inches of mercury.
Determine if conversion is in system range.
Convert pressure into decimal display digits.
Otherwise, display range error message.
Output result via SPI to LCD driver device.
Ul
MC78L08ACP
VS=8V
IN
OUT~~~~------~----------------~
U28
MC33272
MPX2100AP
GROUNO
s-
Cl
O.3311F
S.l V
4
2 ZENER
2
-=
R3
Roffsetl
1kQ
R4
22.6kQ
1121 Q
U2A
MC33272
Roffset2 L--+-~'V\Ar=--_--l
2.SkQ
R2
22.6 kW
Rl
121 Q
Figure 3. Signal Conditioning Circuit
Motorola Sensor Device Data
4-125
AN1326
LCD Interface
In order to digitally display the barometric pressure
conversion, a serial LCD interface was developed to
communicate with the MCU. This system includes an
MC145453 CMOS serial interface/LCD driver, and a 4-digit,
non-multiplexed LCD. In order for the MCU to communicate
correctly with the interface, it must serially transmit six bytes
for each conversion. This includes a start byte, a byte for each
of the four decimal display digits, and a stop byte. For
formatting purposes, decimal points and blank digits can be
displayed through appropriate bit patterns. The control of
display digits and data transmission is ,executed in the source
code through subroutines BCDCONV, LOOKUP, SPI2LCD,
and TRANSFER. A block diagram of this interface is included
below.
CONCLUSION
This digital barometer system described herein is an
excellent example of a sensing system using solid state
components and software to accurately measure barometric
pressure. This system serves as a foundation from which
more complex systems can be developed. The MPX2100A
series pressure sensors provide the calibration and
temperature compensation necessary to achieve the desired
accuracy and interface simplicity for barometric pressure
sensing applications.
+5V
-I I I- I I- I I- I
BP
20
BP IN
VDD
BPOUT
-I I I- I I- I I- I
------DIGIT1
OSCIN
OUT 33
I
MC68HC11
MOSI
SCK
DIGIT2
DIGIT3
DIGIT4
I II
MC145453
DATA
CLOCK
VSS
OUT1
Figure 4. LCD Display Interface Diagram
4-126
Motorola Sensor Device Data
AN1326
APPENDIX
MC68HC11 Barometer Software Available on:
Motorola Electronic Bulletin Board
MCU Freeware Line
8-bit, no parity, 1 stop bit
1200/300 baud
(512) 891-FREE (3733)
*
BAROMETER APPLICATIONS PROJECT
- Chris Winkler
'" Developed: October 1st, 1992
- Motorola Discrete Applications
* This code will be used to implement an MC68HCll Micro-Controller
'" as a processing unit for a simple barometer system.
'" The HCII will interface with an MPX2100AP to monitor, store
* and display measured Barometric pressure via the a-bit AID channel
* The sensor output (32rnv max) will be amplified to .5 - 2.5 V de
'" The processor will interface with a 4-digit LCD (FE202) via
'" a Motorola LCD driver (MC145453) to display the pressure
'" within +/- one tenth of an inch of mercury.
* The systems range is 15. a - 30.5 in-Hg
AID & CPU Register Assignment
This code will use index addressing to access the
important control registers. All addressing will be
indexed off of REGBASE, the base address for these registers.
REGBASE
EQU
ADCTL
ADR2
ADOPT
PORTB
PORTD
DDRD
SPCR
SPSR
SPDR
$1000
EQU
EQU
EQU
EQU
EQU
EQU
EQU
EQU
EQU
*
$30
$32
$39
$04
$08
$09
$28
$29
$2A
register base of control register
* offset of AID control register
* offset of AID results register
* offset for AID option register location
* Location of PORTB used for conversion
* PORTO Data Register Index
* offset of Data Direction Reg.
* offset of SPI Control Reg.
* offset of SPI Status Reg.
* offset of SPI Data Reg.
User Variables
The following locations are used to store important measurements
and calculations used in determining the al ti tude. They
are located in the lower 256 bytes of user RAM
DIGITI
DIGIT2
DIGIT3
DIGIT4
COUNTER
POFFSET
SENSOUT
RESULT
FLAG
EQU
EQU
EQU
EQU
EQU
EQU
EQU
EQU
$0001
$0002
$0003
$0004
$0005
$0010
$0012
$0014
EQU
* BCD blank dig! t (not used)
*
BCD tens digit for pressure
··
·
storage Location for max pressure offset
storage location for previous conversion
Storage of Pressure (in Hg) in hex format
* Determines if measurement is within range
* BCD tenths digit for pressure
* BCD ones digit for pressure
* Variable to send 5 dummy bytes
$0016
MAIN PROGRAM
The conversion process involves the following steps:
l.
2.
3.
4.
5.
b.
6.
7.
8.
Set-Up SPI deviceSet-up AID, Constants
Read AID, store sample
Convert into 1n-Hg
Determine FLAG condition IN_HG
Display error
ContinUe Conversion
Can vert hex to BCD format BCDCONV
Convert LCD display digits
Output via SPI to LCD
SPCCNFG
SET_UP
ADCONV
IN_HG
ERROR
INRANGE
LOOKUP
SPI2LCD
This process is continually repeated as the loop CONVERT
runs unconditionally through BRA (the BRANCH ALWAYS statement)
Repeats to step 3 indefinitely.
Motorola Sensor Device Data
4-127
AN1326
CONVERT
BSR
ORG
scooo
LDX
#REGBASE
BSR
SPI_CNFG
SET_UP
BSR
ADCONV
BSR
BSR
DELAY
IN_HG
* DESIGNATES START OF MEMORY MAP FOR
* Location of base register for indirect, adr
*
USER CODE
set-up SPI Module for data x-mit to LCD
* power-Up A/D, initialize constants
* Calls subroutine to make an AID conversion
* Delay routine to prevent LCD flickering
* Converts hex format to in of H9
The value of FLAG passed from IN_HG is used to determine
If a range error has occurred. The following logical
statements are used to either allow further conversion or jump
to a routine to display a range error message.
LDAB
CMPB
BEQ
BSR
BRA
* Determines if an range Error has oeurred
• If No Error detected (FLAG-SaO) then
system will continue conversion process
* If error occurs (FLAG<>BO), branch to ERROR
* Branches to output ERROR code to display
FLAG
i$BO
INRANGE
ERROR
OUTPUT
No Error Detected, Conversion Process Continues
INRANGE
JSR
BCDCONV
JSR
LOOKUP
*
OUTPUT
JSR
SPI2LCD
BRA
CONVERT
* Output transmission to LCD
* continually converts using Branch Always
Converts Hex Result to BCD
* Uses Look-Up Table for BCD-Decimal
Subroutine 5PI_CNFG
Purpose is to initialize SPI for transmission
and clear the display before conversion.
PORTD,X #$20
LDAA
ij$38
STAA
DDRD,X
LDAA
STAA
SPCR,X
LDAA
STAA
LDAA
SPSR,X
i$5D
i$5
COUNTER
* Set SPI 55 Line High to prevent glitch
* Initializing Data Direction for Port D
* Selecting 55, MOSI, SCK as outputs only
* Initialize SPI-Control Register
* selecting SPE,M5TR,CPOL,CPHA,CPRO
* sets counter to x-mit 5 blank bytes
*
Must read SPSR to clear SPIF Flag
* Transmission of Blank Bytes to LCD
CLRA
ERASELCD JSR
TRANSFER
DEC
COUNTER
BNE
ERASELCD
* Calls subroutine to transmit
RTS
SET_UP
Subroutine SET_UP
purpose is to initialize constants and to power-up AID
and to initialize POFFSET used in conversion purposes.
LDAA
#$90
* selects ADPU bit in OPTION register
STAA
ADOPT, X
* power-up of A/D complete
LOO
#$0131+$OOlA
* Initialize POFFSET
STO
POFFSET
* POFFSET - 305 - 25 in hex
LDAA
#$00
* or Pmax + offset voltage (5 V)
RTS
Subroutine DELAY
purpose is to delay the conversion process
to minimize LCD flickering.
DELAY
OUTLOOP
INLOOP
LDB
DECB
LDA
#$FF
#$FF
BNE
DECA
BNE
RTS
INLOOP
* Loop for delay of display
* Delay -
clk/255*255
OUTLOOP
Subroutine ADCONV
Purpose is to read the AID input, store the conversion into
SENSOUT. For conversion purposes later.
ADCONV
LDX
4-128
* loads base register for indirect addressing
#REGBASE
LDAA
STAA
#$25
ADCTL,X
* initializes AID cont. register SCAN=l,MULT=O
Motorola Sensor Device Data
AN1326
WTCONV
BRCLR
ADCTL, x
LDAB
CLRA
#-$80 WTCONV
ADR2, X
*
STD
RTS
SENSOU'T
* Stores conversion as SENSOUT
*
Wait for completion of conversion flag
Loads conversion result into Accumulator
subroutine IN_HG
purpose is to convert the measured pressure SENSOUT, into
units of in-Hg, represented by a hex value of 305-150
This represents the range 30.5 - 15.0 in-Hg
LDD
POFFSET
* Loads maximum offset for subtraction
SUBD
SENSOUT
* RESULT - POFFSET-SENSOUT in hex format
STD
* Stores hex result for P, in Hg
RESULT
CMPD
005
BHI
TOHIGH
CMPD
<150
BLO
TOLOW
LDAB
STAB
BRA
TOHIGH
LDAB
'$FF
STAB
'rOLOW
'$80
FLAG
END_CONY
BRA
FLAG
END_CONY
LDAB
STAB
FLAG
.$00
END_CONY RT S
Subroutine ERROR
This subroutine sets the display digits to output
an error message having detected an out of range
measurement in the main program from FLAG
ERROR
LDAB
'$00
STAB
DIGITI
DIGIT4
STAB
SET_HI
* If above range GOTO SET_HI
'$OE
* ELSE display LO on display
* Set DIGIT2=L, DIGIT3=O
STAB
LDAB
STAB
DIGIT2
#-$7E
DIGIT3
END_ERR
LOX
IOlV
STAB
DEY
CPX
*
GOTO exit of subroutine
*
Set DIGIT2-H,
'$30
convert ALTITUDE from hex to BCD
HEX-BCD conversion scheme
store Remainder, swap Q & R, repeat
remainder - o .
* Default Digits 2,3,4 to 0
DIGIT2
DIGIT3
DIGIT4
#DIGlT4
RESULT
*
Conversion starts with lowest digit
* Load voltage to be converted
*
0, Y
Divide hex digit by 10
* Quotient in x, Remainder in D
* stores 8 LSB' s of remainder as BCD digit
* Determines if last digit stored
'$0
XGDX
BNE
LOX
RTS
DIGIT3~1
DIGIT3
• $00
LOY
LDD
'$A
if above or below range .
DIGIT2
Subroutine BCDCONV
purpose is to
uses standard
Divide HEX/IO
process until
STAA
STAA
STAA
*
• $00
'$37
CONVLP
* FLAG is used to determine
FLAG
BNE
BRA
LDAA
1, 4 to blanks
LDAB
CMPB
LDAB
STAB
LDAB
STAB
BCOCONV
* Initialize digits
1<
CONVLP
#REGBASE
*
Exchanges remainder & quotient
Reloads BASE into main program
Subrou tine LOOKUP
Motorola Sensor Device Data
4-129
AN1326
purpose is to implement a Look-Up conversion
The BCD is used to index off of TABLE
where the appropriate hex code to display
that decimal digit is contained.
DIGIT4, 3,2 are converted only.
LOOKUP
TABLOOP
LDX
DEX
#DIGITl+4
LDY
LDAB
ABY
LDAA
STAA
CPX
BNE
#TABLE
O,X
O,Y
O,X
#DIGIT2
* Counter starts at 5
* Start with Digit4
* Loads table base into Y-pointer
* Loads current digit into B
* Adds to base to index off TABLE
'It Stores HEX segment result in A
* Loop condition complete, DIGIT2 Converted
TABLOOP
RTS
Subroutine SPI2LCD
purpose is to output dig! ts to LCD via SPI
The format for this 1s to send a start byte,
four dig! ts, and a stop byte. This system
will have 3 significant digits: blank digit
and three decimal dig i ts .
Sending LCD Start Byte
SPI2LCD
LDX
#REGBASE
LDAA
LDAA
BSR
SPSR,X
#$02
LDAA
ORA
STAA
DIGIT3
#$80
DIGIT3
LDAA
STAA
#$00
DIGITl
TRANSFER
* Reads to clear SPIF flag
* Byte, no colon, start bit
* Transmit byte
In1 tializing decimal point & blank dig! t
* Sets MSB for decimal pt.
* after digit 3
* Set 1st digit as blank
Sending four decimal digits
LDY
DLOOP
LDAA
BSR
INY
CPY
BNE
#DIGITl
0, Y
TRANSFER
* Pointer set to send 4 bytes
* Loads digit to be x-mitted
* Transml t byte
* Branch until both bytes sent
#DIGIT4+1
DLOOP
Sending LCD Stop Byte
LDAA
BSR
#$00
TRANSFER
*
* end byte requires all 0 I
Transmit byte
S
RTS
Subroutine TRANSFER
purpose is to send data bits to SPI
and wait for conversion complete flag bit to be set.
TRANSFER LDX
XMIT
#REGBASE
PORTD,X #$20
BCLR
*
STAA
SPDR,X
*
BRCLR
SPSR,X #$80 XMIT*
PORTD,X #$20
BSET
*
LDAB
SPSR,X
Assert 55 Line to start x-misssion
Load Data into Data Reg. lx-mit
Wait for flag
DISASSERT 55 Line
* Read to Clear SPI Flag
RTS
Location for FCB memory for look-up table
There are 11 possible digits: blank, 0-9
TABLE
4-130
FCB
END
$7E, $30, $6D, $79, $33, $SB, $SF, $70, $7F, $73, $00
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1513
Mounting Techniques and Plumbing Options of
Motorola's MPX Series Pressure Sensors
Prepared by: Brian Pickard
Sensor Products Division
Semiconductor Products Sector
INTRODUCTION
Motorola offers a wide variety of ported, pressure sensing
devices which incorporate a hose barb and mounting tabs.
They were designed to give the widest range of design
flexibility. The hose barbs are 1/8" (~3 mm) diameter and the
tabs have #6 mounting holes. These sizes are very common
and should make installation relatively simple. More
importantly, and often overlooked, are the techniques used in
mounting and adapting the ported pressure sensors. This
application note provides some recommendations on types of
fasteners for mounting, how to use them with Motorola
sensors, and identifies some suppliers. This document also
recommends a variety of hoses, hose clamps, and their
respective suppliers.
This information applies to all Motorola MPX pressure
sensors with ported packages, which includes the packages
shown in Figure 1.
A review of recommended mounting hardware, mounting
torque, hose applications, and hose clamps is also provided
for reference.
MOUNTING HARDWARE
Mounting hardware is an integral part of package design.
Different applications will call for different types of hardware.
When choosing mounting hardware, there are three important
factors:
• permanent versus removable
• application
• cost
The purpose of mounting hardware is not only to secure the
sensor in place, but also to remove the stresses from the
sensor leads. In addition, these stresses can be high if the
hose is not properly secured to the sensor port. Screws, rivets,
push-pins, and clips are a few types of hardware that can be
used. Refer to Figure 2.
Single Side Port
Differential Port
Axial Port
Stovepipe Port
Screw
Figure 1. MPX Pressure Sensors with
Ported Packages
Motorola Sensor Device Data
Rivet
Push-Pin
Figure 2. Mounting Hardware
4-131
AN1513
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI YI4.5M. 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
PLANE
SEATING
i
T-
INCHES
MIN
MAX
1.100 1.200
0.740 0.760
0.635 0.650
0.016 0.020
0.160 0.180
0.048 0.052
0.100BSC
0.014 0.016
0.230 REF
0.070 0.080
0.150 0.160
0.150 0.160
0.445 0.460
0.685 0.715
0840 0.860
0.185 0.195
MILLIMETERS
MIN
MAX
27.94 3D.48
18.80 19.30
16.13 16.51
0.41
0.50
4.06
4.57
1.22
1.32
2.54BSC
0.36
0.40
5.84 REF
1.78
2.03
381
4.06
3.81
4.06
11.30 11.68
17.40 18.16
21.33 21.84
4.69
4.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
YI4.5.1982.
2. CONTROLLING DIMENSION: INCH.
R
PORTtl
POSITIVE
PRESSURE
-Q-
DIM
A
B
C
D
F
G
H
J
K
L
N
P
[§@,O.25(O.OI0)@ITla ®I
Q
F
R
S
G
D 4PL
U
INCHES
MIN
MAX
1.140 1.180
0.685 0.751
0.305 0.321
0.016 0.020
0.048 0.052
0.100BSC
0.182 0.194
0.014 0.016
0.685 0.715
0.290 0.300
0.420 0.440
0.153 0.158
0.153 0.158
0.231 0.250
0230 REF
0.910BSC
MIWMETERS
MIN
MAX
28.95 29.97
17.39 18.16
7.74
8.15
0.40
0.50
1.21
1.32
2.54BSC
4.82
4.92
0.35
0.40
17.39 18.16
7.34
7.62
10.67 11.12
3.88
4.01
4.01
3.88
5.86
6.35
584 REF
23.11 BSC
1$IO.13(O.005)@ITls ®la®1
Figure 3. Case Outline Drawings
Top: Case 371 D-02, Issue B
BoHom: Case 350-03, Issue H
To mount any of the devices except Case 371-05/06 and
867E) to a flat surface such as a circuit board, the spacing and
diameter for the mounting holes should be made according to
Figure 3.
Mounting Screws
Mounting screws are recommended for making a very
secure, yet removable connection. The screws can be either
metal or nylon, depending on the application. The holes are
0.155" diameter which fits a #6 machine screw. The screw can
be threaded directly into the base mounting surface or go
through the base and use a flat washer and nut (on a circuit
board) to secure to the device.
MOUNTING TORQUE
The torque specifications are very important. The sensor
package should not be over tightened because it can crack,
causing the sensor to leak. The recommended torque
specification for the sensor packages are as follows:
4-132
Port Style
Single side port:
port side down
port side up
Differential port (dual port)
Axial side port
Torque Range
3-4 in-Ib
6-7 in-Ib
9-10 in-Ib
9-10 in-Ib
The torque range is based on installation at room
temperature. Since the sensor thermoplastic material has a
higher TCE (temperature coefficient of expansion) than
common metals, the torque will increase as temperature
increases. Therefore, if the device will be subjected to very low
temperatures, the torque may need to be increased slightly. If
a precision torque wrench is not available, these torques all
work out to be roughly 1/2 of a turn past ''finger tight" (contact)
at room temperature.
lightening beyond these recommendations may damage
the package, or affect the performance of the device.
Motorola Sensor Device Data
AN1513
Nylon Screws
Motorola recommends the use of #6-32 nylon screws as a
hardware option. However, they should not be torqued
excessively. The nylon screw will twist and deform under
higher than recommended torque. These screws should be
used with a nylon nut.
Rivets
Rivets are excellent fasteners which are strong and very
inexpensive. However, they are a permanent connection.
Plastic rivets are recommended because metal rivets may
damage the plastic package. When selecting a rivet size, the
most important dimension, besides diameter, is the grip range.
The grip range is the combined thickness of the sensor
package and the thickness of the mounting surface. Package
thicknesses are listed below.
Port Style
Thickness, a
Single side port
Dual side port
Axia[ side port
Stovepipe port
0.321" (8.15 mm)
0.420" (10.66 mm)
0.321" (8.15 mm)
(Does not apply)
listed later in this application note. Two brands of vinyl hose
are:
Hose
Wall
Thickness
Max. Press.
@70'F
(24'C)
Max.
Temp.
('F)J('C)
Clippard #3814-1
Herco Clear #0500-037
1/16"
1/16"
105
54
100/(38)
180/(82)
Tygon tubing is slight[y more expensive than vinyl, but it is
the most common brand, and it is also very f[exible. [t also is
recommended for use at room temperature and applications
below 50 psig. This tubing is also recommended for
applications where the hose may be removed and reattached
several times. This tubing should also be used with a hose
clamp.
Grip Range = a + b
Tubing
Tygon 6-44-3
Wall
Thickness
Max. Press.
@73'F
(2S'C)
Max. Temp.
('F)J('C)
1/16"
62
165/(74)
Push-Pins
Plastic push pins or ITW FasTex "Christmas Tree" pins are
an excellent way to make a low cost and easily removable
connection. However, these fasteners should not be used for
permanent connections. Remember, the fastener should take
all of the static and dynamic loads off the sensor leads. This
type of fastener does not do this complete[y.
Urethane tubing is the most expensive of the four types
described herein. [t can be used at higher pressures (up to 100
psig) and temperatures up to 100°F (38°C). It is flexible,
although its f[exibility is not as good as vinyl or Tygon.
Urethane tubing is very strong and it is not necessary to use
a hose clamp, although it is recommended.
Two brands of urethane hose are:
HOSE APPLICATIONS
By using a hose, a sensor can be located in a convenient
place away from the actual sensing location which could be a
hazardous and difficult area to reach. There are many types
of hoses on the market. They have different wall thicknesses,
working pressures, working temperatures, material
compositions, and media compatibilities. All of the hoses
referenced here are 1/8" inside diameter and 1/16" wall
thickness, which produces a 1/4" outside diameter. Since all
the port hose barbs are 1/8", they require 1/8" inside diameter
hose. The intent is for use in air only and any questions about
hoses for your specific application should be directed to the
hose manufacturer. Four main types of hose are avai[able:
• Vinyl
• Tygon
• Urethane
• Ny[on
Vinyl hose is inexpensive and is best in applications with
pressures under 50 psig and at room temperature. [t is f[exible
and durable and should not crack or deteriorate with age. This
type of hose should be used with a hose clamp such as those
Motoro[a Sensor Device Data
Hose
Wall
Thickness
Max. Press.
@70'F
(24'C)
Max.
Temp.
('F)/('C)
Clippard #3814-6
Herco Clear #0585-037
1/16"
1/16"
105
105
120/(49)
225/(107)
Nylon tubing does not work well with Motoro[a's sensors. It
is typically used in high pressure applications with metal
fittings (such as compressed air).
HOSE CLAMPS
Hose clamps should be employed for use with all hoses
listed above. They provide a strong connection with the sensor
which prevents the hose from working itself off, and also
reduces the chance of leakage. There are many types of hose
clamps that can be used with the ported sensors. Here are
some of the most common hose clamps used with hoses.
4-133
AN1513
Crimp-on Clamp
Nylon Snap
Spring Wire
Screw-on
The two clamps most recommended by Motorola are the
crimp-on clamp and the screw-on, Clippard reusable clamp.
The crimp-on type clamp is offered from both Ryan Herco
(#0929-007) and Clippard (#5000-2). Once crimped in place,
it provides a very secure hold, but it is not easily removed and
is not reusable. The Clippard, reusable hose clamp is a brass,
self-threading clamp, which provides an equally strong grip as
the crimp-on type just described. The drawback is the
reusable clamp is considerably more expensive. The nylon
snap is also reusable, however the size options do not match
the necessary outside diameter. The spring wire clamp,
common in the automotive industry, and known for its very low
cost and ease of use, also has a size matching problem.
Custom fit spring wire clamps may provide some cost savings
in particular applications.
Figure 4. Hose Clamps
SUPPLIER LIST
Hoses
Norton-Performance Plastics
Worldwide Headquarters
150 Dey Road, Wayne, NJ 07470-4599 USA
(201) 596-4700
Telex: 710-988-5834
USA
P.O. Box 3660, Akron, OH 44309-3660
USA
(216) 798-9240
FAX: (216) 791HJ358
Clippard Instrument Laboratory, Inc.
7390 Colerain Rd.
Cincinnati, Ohio 45239, USA
(513) 521-4261
FAX: (513) 521-4464
Ryan Herco Products Corporation
P.O. Box 588
Burbank, CA 91503
1--800-423-2589
FAX: (818) 842-4488
4-134
Spring Wire Clamps
RotorClip, Inc.
187 Davidson Avenue
Somerset, NJ 0887!Hl461
1-800-631-5857 Ext. 255
Bolts
Quality Screw and Nut Company
1331 Jarvis Avenue
Elk Grove Village, IL 60007
(312) 593-1600
Rivets and Push-Pins
ITW FasTex
195 Algonquin Road
Des Plaines, IL 60016
(708) 299-2222
FAX: (708) 390-8727
Crimp-on and Nylon Clamps
Ryan Herco Products Corporation
P.O. Box 588
Burbank, CA 91503
1--800-423-2589
FAX: (818) 842-4488
Crimp-on and Screw-on Clamps
Clippard Instrument Laboratory, Inc.
7390 Colerain Rd.
CinCinnati, Ohio 45239, USA
(513) 521-4261
FAX: (513) 521-4464
Motorola Sensor Device Data
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1516
Liquid Level Control Using a
Motorola Pressure Sensor
Prepared by: JC Hamelain
Toulouse Pressure Sensor Laboratory
Semiconductor Products Sector, Toulouse, France
INTRODUCTION
Motorola Discrete Products provides a complete solution
for designing a low cost system for direct and accurate liquid
level control using an ac powered pump or solenoid valve.
This circuit approach which exclusively uses Motorola
semiconductor parts, incorporates a piezoresistive pressure
sensor with on-chip temperature compensation and a new
solid-state relay with an integrated power triac, to drive
directly the liquid level control equipment from the domestic
110/220 V 50/60 Hz ac main power line.
PRESSURE SENSOR DESCRIPTION
Depending on the application and pressure range, the sensor
may be chosen from the following portfolio. Forthis application
the MPX201 ODP was selected.
Device
Pressure Range
MPX2010DP
o to 10 kPa
o to 50 kPa
MPX2050DP
MPX2100DP o to 100 kPa
MPX2200DP
o to 200 kPa
* after proper gain adjustment
Application Sensitivity*
± 0.01 kPa (1 mm H20)
± 0.05 kPa (5 mm H20)
± 0.1 kPa (10 mm H20)
± 0.2 kPa (20 mm H20)
The MPX2000 Series pressure sensor integrates on-chip,
laser-trimmed resistors for offset calibration and temperature
compensation. The pressure sensitive element is a patented,
single piezoresistive implant which replaces the four resistor
Wheatstone bridge traditionally used by most pressure sensor
manufacturers.
Pin 2
r--A,t)(IV------1--<> + Vout
Pin 4
'---+------+---0 - Vout
BASIC CHIP
CARRIER ELEMENT
CASE 344
Motorola Sensor Device Data
DIFFERENTIAL
PORT OPTION
CASE 352
;pi.
Laser Trimmed On-Chip
Figure 1. Pressure Sensor MPX2000 Series
4-135
AN1516
POWER OPTO ISOLATOR M0C2A60 DESCRIPTION
The MOC2A60 is a new Motorola POWER OPTOTM isolator
and consists of a gallium arsenide, infrared emitting diode,
which is optically coupled to a zero-cross triac driver and a
power triac. It is capable of driving a load of up to 2 A (rms)
directly from a line voltage of 220 V (50/60 Hz).
Device Schematic
CASE 417
PLASTIC
PACKAGE
• Zero Voltage Activate Circuit
1,4,5,6,8.
2.
3.
7.
9.
No Pin
LED Cathode
LED Anode
Main Terminal
Main Terminal
Figure 2. MOC2A60 POWER OPTO Isolator
SIGNAL CONDITIONING
When a full range pressure is applied to the MPX2010DP,
it will provide an output of about 20 mV (at an B V supply).
Therefore, for an application using only a few percent of the
pressure range, the available signal may be as low as a few
hundred microvolts. To be useful, the sensor signal must be
amplified. This is achieved via a true differential amplifier (A1
and A2) as shown in Figure 4. The GAIN ADJ (500 ohm)
resistor, RG, sets the gain to about 200.
The differential output of this stage is amplified by a second
stage (A3) with a variable OFFSET resistor. This stage
performs a differential to single-ended output conversion and
references this output to the adjustable offset voltage. This
output is then compared to a voltage (VREF = 4 V at TP2) at
the input of the third stage (A4).
This last amplifier is used as an inverted comparator
amplifier with hysteresis (Schmitt trigger) which provides a
logic signal (TP3) within a preset range variation of about 10%
of the input (selected by the ratio R9/(R9 + R7).
If the pressure sensor delivers a voltage to the input of the
Schmitt trigger (pin 13) lower than the reference voltage (pin
12), then the output voltage (pin 14) is high and the drive
current for the power stage MOC2A60 is provided. When the
4-136
sensor output increases above the reference voltage, the
output at pin 14 goes low and no drive current is available.
The amplifier used is a Motorola MC33179. This is a quad
amplifier with large current output drive capability (more than
80mA).
OUTPUT POWER STAGE
For safety reasons, it is important to prevent any direct
contact between the ac main power line and the liquid
environment or the tank. In order to maintain full isolation
between the sensor circuitry and the main power, the
solid-state relay is placed between the low voltage circuit
(sensor and amplifier) and the ac power line used by the pump
and compressor.
The output of the last stage of the MC33179 is used as a
current source to drive the LED (light emitting diode). The
series resistor, RB, limits the current into the LED to
approximately 15 mA and guarantees an optimum drive forthe
power opto-triac. The LD1 (MFOE76), which is an infrared
light emitting diode, is used as an indicator to detect when the
load is under power.
The MOC2A60 works like a switch to turn ON or OFF the
pump's power source. This device can drive up to 2 A for an
ac load and is perfectly suited for the medium power motors
(less than 500 watts) used in many applications. It consists of
an opto-triac driving a power triac and has a zero-crossing
detection to limit the power line disturbance problems when
fast switching sellic loads. An RC network, placed in parallel
with the output of the solid-state relay is not required, but it is
good design practice for managing large voltage spikes
coming from the inductive load commutation. The load itself
(motor or solenoid valve) is connected in series with the
solid-state relay to the main power line.
EXAMPLE OF APPLICATION:
ACCURATE LIQUID LEVEL MONITORING
The purpose of the described application is to provide an
electronic system which maintains a constant liquid level in a
tank (within ± 5 mm H20). The liquid level is kept constant in
the tank by an ac electric pump and a pressure sensor which
provides the feedback information. The tank may be of any
size. The application is not affected by the volume of the tank
but only by the difference in the liquid level. Of course, the
maximum level in the tank must correspond to a pressure
within the operating range of the pressure sensor.
LIQUID LEVEL SENSORS
Motorola has developed a piezoresistive pressure sensor
family which is very well adapted for level sensing, especially
when using an air pipe sensing method. These devices may
also be used with a bubbling method or equivalent.
Motorola Sensor Device Data
AN1516
AC Line
Open Pipe Before
Calibralion \
Reference
Level
Liquid Level
in Ihe Pipe
Figure 3. Liquid Level Monitoring
LEVEL SENSING THEORY
corresponds to the change in the tank level is measured by the
pressure sensor.
If a pipe is placed vertically, with one end dipped into a liquid
and the other end opened, the level in the pipe will be exactly
the same as the level in the tank. However, if the upper end of
the pipe is closed off and some air volume is trapped, the
pressure in the pipe will vary proportionally with the liquid level
change in the tank.
For example, if we assume that the liquid is water and that
the water level rises in the tank by 10 mm, then the pressure
in the pipe will increase by that same value (10 mm of water).
A gauge pressure sensor has one side connected to the
pipe (pressure side) and the other side open to ambient (in this
case, atmospheric) pressure. The pressure difference which
PRESSURE SENSOR CHOICE
In this example, a level sensing of 10 mm of water is desired.
The equivalent pressure in kilo pascals is 0.09806 kPa. In this
case, Motorola's temperature compensated 0-10 kPa,
MPX2010 is an excellent choice. The sensor output, with a
pressure of 0.09806 kPa applied, will result in 2.0 mV/kPa x
0.09806 = 0.196 mV.
The sensing system is designed with an amplifier gain of
about 1000. Thus, the conditioned signal voltage given by the
module is 1000 x 0.196 mV = 0.196 V with 10 mm - H20
pressure.
Table 1. Liquid Level Sensors
METHOD
SENSOR
ADVANTAGE
DISADVANTAGES
Magnetoresitive
Low power, no active electronic
Low resolution, range limited
Magnetoresitive
Very high resolution
Complex electronic
Ultrasonic
Easy to install
Need high power, low accuracy
No active electronic
No active electronic
Low resolution, liquid dependent
String potentiometer
Potentiometer
Low power, no active electronic
Poor linearity, corrosion
Pressure
Silicon sensors
Inexpensive good resolution, wide
range measurements
Active electronic, need power
Liquid weight
Liquid resistivity
Motorola Sensor Device Data
4-137
AN1516
-
P
TR
I~
I
I
220VAC
Reference ADJ
Offset Adjust
RIO
Roff
I
I
I
Rll
N
MPX2010DP
I
I
I
R7
Motorl
\
(
TPI
\
)
'-./
R6
MOC2A60
RB
R4
Dl
R5
R
C
~
~
I
I
I
I
I
..J
TP3
RG = 500n
Rl. R2 = 100 k
R5. R7 100 k
R3. R4 ... R6 = 10 k
R9 ... Rll 10 k
R8 = 100
Roff= 25 kvar
=
Figure 4. Electrical Circuit
=
al ... a4 = 1/4 MC33179
01 = MLE076
MC7808ac REGL 8 VOC
TR = TRANSFORMER 220:12 V
Cl 40 I'F 40 V
=
=
Liquid
Level
4.3V
Pressure
Sensing
(TP1)
7V
Trigger
Voltage
(TP3)
Pump
Voltage (AC220V)
Sensing for minimum level (pumping into the tank)
The sensing probe is tied to the positive pressure port of the sensor. The pump is turned on to fill the tank when the minimum level is reached.
Figure 5. Functional Diagram
4-138
Motorola Sensor Device Data
AN1516
LEVEL CONTROL MODES
This application describes two ways to keep the liquid level
constant in the tank; first, by pumping the water out if the liquid
level rises above the reference, or second, by pumping the
water in if the liquid level drops below the reference.
If pumping water out, the pump must be OFF when the liquid
level is below the reference level. To turn the pump ON, the
sensor signal must be decreased to drop the input to the
Schmitt trigger below the reference Voltage. To do this, the
sensing pipe must be connected to the NEGATIVE pressure
port (back or vacuum side) ofthe sensor. In the condition when
the pressure increases (liquid level rises), the sensor voltage
will decrease and the pump will turn ON when the sensor
output crosses the referenced level. As pumping continues,
the level in the tank decreases (thus the pressure on the
sensor decreases) and the sensor signal increases back up
to the trigger point where the pump was turned OFF.
In the case of pumping water into the tank, the pump must
be OFF when the liquid level is above the reference level. To
turn ON the pump, the sensor signal must be decreased to
drive the input Schmitt trigger below the reference voltage. To
do this, the sensing pipe must be connected to the POSITIVE
pressure port (top side) of the sensor. In this configuration
when the pressure on the sensor decreases, (liquid level
drops) the sensor voltage also decreases and the pump is
turned ON when the signal exceeds the reference. As
pumping continues, the water level increases and when the
maximum level is reached, the Schmitt trigger turns the pump
OFF.
ADJUSTMENTS
The sensing tube is placed into the water at a distance
below the minimum limit level anywhere in the tank. The other
Motorola Sensor Device Data
end of the tube is opened to atmosphere. When the tank is
filled to the desired maximum (or minimum) level, the pressure
sensor is connected to the tube with the desired port
configuration for the application. Then the water level in the
tank is the reference.
After connecting the tube to the pressure sensor, the
module must be adjusted to control the water level. The output
voltage at TP1 is preadjusted to about 4 V (half of the supply
voltage). When the sensor is connected to the tube, the
module output is ON (lighted) or OFF. By adjusting the offset
adjust potentiometer the output is just turned into the other
state: OFF, if it was ON or the reverse, ON, if it was OFF, (the
change in the tank level may be simulated by moving the
sensing tube up or down).
The reference point TP2 shows the ON/OFF reference
voltage, and the switching point of the module is reached
when the voltage at TP1 just crosses the value of the TP2
Voltage. The module is designed for about 10 mm of difference
level between ON and OFF (hysteresis).
CONCLUSION
This circuit design concept may be used to evaluate
Motorola pressure sensors used as a liquid level switch. This
basic circuit may be easily modified to provide an analog
signal of the level within the controlled range. It may also be
easily modified to provide tighter level control (±2 mm H20) by
increasing the gain of the first amplifier stage (decreasing RG
resistor).
The circuit is also a useful tool to evaluate the performance
of the power optocoupler MOC2A60 when driving ac loads
directly.
4-139
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1517
Pressure Switch Design with
Semiconductor Pressure Sensors
Prepared by: Eric Jacobsen and Jeff Baum
Sensor Design and Applications Group, Motorola Phoenix, AZ
them in overall performance (i.e., switching speed, logiC-level
voltages, etc.).
INTRODUCTION
The Pressure Switch concept is simple, as are the additions
to conventional signal conditioning circuitry required to
provide a pressure threshold (or thresholds) at which the
output switches logic state. This logic-level output may be
input to a microcontroller, drive an LED, control an electronic
switch, etc. The user-programmed threshold (or reference
voltage) determines the pressure at which the output state will
switch. An additional feature of this minimal component
design is an optional user-defined hysteresis setting that will
eliminate multiple output transitions when the pressure sensor
voltage is comparable to the threshold voltage.
This paper presents the characteristics and design criteria
for each of the major subsystems of the pressure switch
design: the pressure sensor, the signal conditioning (gain)
stage, and the comparator output stage. Additionally, an entire
section will be devoted to comparator circuit topologies which
employ comparator les and/or operational amplifiers. A
window comparator design (high and low thresholds) is also
included. This section will discuss the characteristics and
design criteria for each comparator circuit, while evaluating
BASIC SENSOR OPERATION
Motorola's MPX2000 Series sensors are temperature
compensated and calibrated (i.e., offset and full-scale span
are precision trimmed) pressure transducers. These sensors
are available in full-scale pressure ranges from 10 kPa
(1.5 psi) to 700 kPa (100 psi). Although the specifications (see
Table 1) in the data sheets apply only to a 10 V supply voltage,
the output of these devices is ratiometric with the supply
voltage. For example, at the absolute maximum supply
voltage rating, 16 V, the sensor will produce a differential
output voltage of 64 mV at the rated full-scale pressure of the
given sensor. One exception to this is that the full-scale span
of the MPX2010 (10 kPa sensor) will be only40 mV due to the
device's slightly lower sensitivity. Since the maximum supply
voltage jJroduces the most output voltage, it is evident that
even the best case scenario will require some signal
conditioning to obtain a usable voltage level. For this specific
deSign, an MPX2100 and 5.0 V supply is used to provide a
maximum sensor output of 20 mY. The sensor output is then
signal conditioned to obtain a four volt signal swing (span).
Table 1. MPX2100 Electrical Characteristics for Vs = 10 V, TA = 25°C
Characteristic
Symbol
Minimum
Pressure Range
POP
a
Supply Voltage
Vs
Full Scale Span
VFSS
Zero Pressure Offset
Sensitivity
Typical
Max
Unit
100
kPa
10
16
Vdc
mV
40
41.5
Voff
0.05
0.1
S
0.4
mV/kPa
38.5
mV
Linearity
0.05
%FSS
Temperature Effect on Span
0.5
%FSS
Temperature Effect on Offset
0.2
%FSS
REV 1
4-140
Motorola Sensor Device Data
AN1517
THE SIGNAL CONDITIONING
For this specific design, the gain is set to 201 by setting
R6 = 20 kQ and R5 = 100 n. Using these values and setting
R6 = R3 and R4 = R5 gives the desired gain without loading
the reference voltage divider formed by R1 and Roff. The offset
voltage is set via this voltage divider by choosing the value of
Roff. This enables the user to adjust the offset for each
application's requirements.
The amplifier circuitry, shown in Figure 1, is composed of
two op-amps. This interface circuit has a much lower
component count than conventional quad op amp
instrumentation amplifiers. The two op amp design offers the
high input impedance, low output impedance, and high gain
desired for a transducer interface, while performing a
differential to single-ended conversion. The gain is set by the
following equation:
GAIN = 1
+
R6
R5
where R6 = R3 and R4 = R5.
r--------------,
Comparator Stage
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10.0kQ
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r---~------~R~4----------~~R~6--~1
20kQ
R1
12.1 ill
U1
+
Roft
R5
100Q
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LM324D
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+5V
V4
Q1
MMBT3904LT1
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10kQ
RH
121 kQ
CN1
+--H--toVout
+
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24.3 kQ
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Figure 1. Pressure Switch Schematic
Pressure Sensor
THE COMPARISON STAGE
The comparison stage is the "heart" of the pressure switch
design. This stage converts the analog voltage output to a
digital output, as dictated by the comparator's threshold. The
comparison stage has a few design issues which must be
addressed:
o
o
The threshold for which the output switches must be programmable. The threshold is easily set by dividing the supply voltage with resistors R7 and RTH. In Figure 1, the
threshold is set at 2.5 V for R7 = RTH = 10 kQ.
A method for providing an appropriate amount of hysteresis should be available. Hysteresis prevents multiple transitions from occurring when slow varying signal inputs
oscillate about the threshold. The hysteresis can be set by
applying positive feedback. The amount of hysteresis is
Motorola Sensor Device Data
determined by the value of the feedback resistor, RH (refer
to equations in the following section).
o
It is ideal for the comparator's logic level output to swing
from one supply rail to the other. In practice, this is not possible. Thus, the goal is to swing as high and low as possible
for a given set of supplies. This offers the greatest difference between logic states and will avoid having a microcontroller read the switch level as being in an indeterminate
state.
o
In order to be compatible with CMOS circuitry and to avoid
microcontroller timing delay errors, the comparator must
switch sufficiently fast.
o
By using two comparators, a window comparator may be
implemented. The window comparator may be used to
monitor when the applied pressure is within a set range. By
adjusting the input thresholds, the window width can be
customized for a given application. As with the single
4-141
AN1517
threshold design, positive feedback can be used to provide
hysteresis for both switching points. The window comparator and the other comparator circuits will be explained in the
following section.
EXAMPLE COMPARATOR CIRCUITS
Several comparator circuits were built and evaluated.
Comparator stages using the LM311 comparator, LM358
Op-Amp (with and without an output transistor stage), and
LM339 were examined. Each comparator was evaluated on
output voltage levels (dynamic range), transition speed, and
the relative component count required for the complete
pressure switch design. This comparison is tabulated in
Table 2.
LM311 Used In a Comparator Circuit
The LM311 chip is designed specifically for use as a
comparator and thus has short delay times, high slew rate,
and an open collector output. A pull-up resistor at the output
is all that is needed to obtain a rail-te-rail output. Additionally,
the LM311 is a reverse logic circuit; that is, for an input lower
than the reference voltage, the output is high. Likewise, when
the input voltage is higher than the reference voltage, the
output is low. Figure 2 shows a schematic of the LM311 stage
with threshold setting resistor divider, hysteresis resistor, and
the open-collector pull-up resistor. Table 2 shows the
comparator's performance. Based on its performance, this
circuit can be used in many types of applications, including
interface to microprocessors.
The amount of hysteresis can be calculated by the following
equations:
VREF = R1
Vee
R2
+ R2 Vee'
neglecting the effect of R H·
R1
U1
RpU
R1R2 + R2RH
V REFH = R1R2 + R1RH + R2RH Vee
LM311
Vin
>--+--1
Voul
R2RH
VREFL = R1R2
+ R1RH + R2RH
Vee
HYSTERESIS = V REF - V REFL
when the normal state is below V REF , or
R2
HYSTERESIS = V REFH - V REF
Figure 2. LM311 Comparator Circuit Schematic
when the normal state is above V REF'
Table 2. Comparator Circuits Performance Characteristics
Characteristic
LM311
LM358
LM358 wI Trans.
Unit
Rise Time
1.40
5.58
2.20
IlS
Fall Time
0.04
6.28
1.30
IlS
VOH
4.91
3.64
5.00
V
VOL
61.1
38.0
66.0
mV
NEGATIVE
NEGATIVE
POSITIVE
Switching Speeds
Output Levels
Circuit Logic Type
The initial calculation for VREF will be slightly in error due to
neglecting the effect of RH. To establish a precise value for
VREF (including RH in the circuit), recompute R1 taking into
accountthat VREF depends on R 1, R2, and RH. Itturns outthat
when the normal state is below VREF, RH is in parallel with R1:
V
R2
REF - R1 II RH
+ R2
V
ee
(WhiCh is identical to the equation for V REFH )
4-142
Alternately, when the normal state is above VREF, RH is in
parallel with R2:
V REF = R1
+ R211 RH
Vee
(WhiCh is identical to the equation for V REFd
These two additional equations for VREF can be used to
calculate a more precise value for VREF-
Motorola Sensor Device Data
AN1517
TheusershouldbeawarethatVREF, VREFHandVREFLare
chosen for each application, depending on the desired
switching point and hysteresis values. Also, the user must
specify which range (either above or below the reference
voltage) is the desired normal state (see Figure 3). Referring
to Figure 3, if the normal state is below the reference voltage
then VREFL (VREFH is only used to calculate a more precise
value for VREF as explained above) is below VREF by the
desired amount of hysteresis (use VREFL to calculate RH).
Alternately, if the normal state is above the reference voltage
then VREFH (VREFL is only used to calculate a more preCise
value for VREF) is above VREF by the desired amount of
hysteresis (use VREFH to calculate RH).
An illustration of hysteresis and the relationship between
these voltages is shown in Figure 3.
speed is comparable to the LM311's. This enhanced
performance does, however, require an additional transistor
and base resistor. Referring to Figure 1, note that this
comparator topology was chosen for the pressure switch
design. The LM324 is a quad op amp that has equivalent
amplifier characteristics to the LM358.
Vee
Rt
Ul
LM358
Vin } - - l - - - l
Vout
- - - ; , - - - VAEF (VAEFUW)
Hysteresis
f
R2
Figure 4. LM358 Comparator Circuit Schematic
Normal State
Vee
AI
RpU
Vout
VREFH
Hysteresis
f
_ _...l-_ _
Ql
VREF (VAEFLW)
MMBT3904LTI
Figure 3. Setting the Reference Voltages
LM358 Op Amp Used in a Comparator Circuit
Figure 4 shows the schematic for the LM358 op amp'
comparator stage, and Table 2 shows its performance. Since
the LM358 is an operational amplifier, it does not have the fast
slew-rate of a comparator IC nor the open collector output.
Comparing the LM358 and the LM311 (Table 2), the LM311 is
better for logic/switching applications since its output nearly
extends from rail to rail and has a sufficiently high switching
speed. The LM358 will perform well in applications where the
switching speed and logic-state levels are not critical (LED
output, etc.). The design of the LM358 comparator is
accomplished by using the same equations and procedure
presented for the LM311. This circuit is also reverse logic.
LM358 Op Amp with a Transistor Output Stage
Used in a Comparator Circuit
The LM358 with a transistor output stage is shown in Figure
5. This circuit has similar performance to the LM311
comparator: its output reaches the upper rail and its switching
Motorola Sensor Device Data
R2
Figure 5. LM358 with a Transistor Output Stage
Comparator Circuit Schematic
Like the other two circuits, this comparator circuit can be
deSigned with the same equations and procedure. The values
for RB and RPU are chosen to give a 5:1 ratio in 01 's collector
current to its base current, in order to insure that 01 is
well-saturated (Vout can pull down very close to ground when
01 is on). Once the 5:1 ratio is chosen, the actual resistance
values determine the desired switching speed for turning 01
on and off. Also, RpU limits the collector current to be within the
maximum specification for the given transistor (see example
values in Figure 1). Unlike the other two circuits, this circuit is
positive logic due to the additional inversion created at the
output transistor stage.
4-143
AN1517
LM339 Used in a Window Comparator Circuit
HYSTERESIS = V REFUW - V REFL'
Using two voltage references to detect when the input is
within a certain range is another possibility for the pressure
switch design. The window comparator's schematic is shown
in Figure 6. The LM339 is a quad comparator Ie (it has open
collector outputs), and its performance will be similar to that of
the LM311.
Vee
Rl
where VREFL is chosen to give the desired amount of
hysteresis for the application.
The initial calculation for VREFUW will be slightly in error
due to neglecting the effect of RHU. To establish a precise
value for VREFUW (including RHU in the circuit), recompute
R1 taking into accountthat VREFUW depends on R2 and R3
and the parallel combination of R1 and RHU. This more
precise value is calculated with the following equation:
R23
VREFUW = R111 R HU + R23 Vee
RpU
for the lower window threshold choose the value for VREFLW.
2
Set VREFLW
VREFUW
where R2 + R3
RHU
1
R2
Vin
Voul
Ul
VREFLW
7+
R5
2
R4
1
R3
2
1
RHL
Figure 6. LM339 Window Comparator Circuit Schematic
Obtaining the correct amount of hysteresis and the input
reference voltages is slightly different than with the other
circuits. The following equations are used to calculate the
hysteresis and reference voltages. Referring to Figure 3,
VREFuwistheupperwindowreferencevoltageandVREFLW
is the lower window reference voltage. Remember that
reference voltage and threshold voltage are interchangeable
terms.
= R111
=R23
R3
R HU + R2 + R3 Vee'
from above calculation.
To calculate the hysteresis resistor:
The input to the lower comparator is one half Vin (since
R4 = R5) when in the normal state. When VREFLW is above
one half of Vin (i.e., the input voltage has fallen below the win·
dow), RHL parallels R4, thus loading down Vin. The resulting
input to the comparator can be referred to as VINL (a lower input voltage). To summarize, when the input is within the window, the output is high and only R4 is connected to ground
from the comparator's positive terminal. This establishes one
half of Vin to be compared with VREFLW- When the input voltage is below VREFLW, the output is low, and RHL is effectively
in parallel with R4. By voltage division, less olthe input voltage
will fall across the parallel combination of R4 and RHL, demanding that a higher input voltage at Vin be required to make
the noninverting input exceed VREFLW.
Therefore the following equations are established:
HYSTERESIS = V REFLW - V INL
Choose R4
=R5 to simplify the design.
For the upper window threshold:
Choose the value forVREFUW and R1 (e.g., 10 kQ). Then,
by voltage division, calculate the total resistance of the
combination of R2 and R3 (named R23 for identification) to
obtain the desired value for VREFUW, neglecting the effect of
RHU:
R23
VREFUW = R1 + R23 Vee
The amount of hysteresis can be calculated by the following
equation:
VREFL --
R23R Hu
R1 R23 + R1 R HU + R23R HU
Vee
Notice that the upper window reference voltage, VREFUW,
is now equal to its VREFL value, since at this moment, the
input voltage is above the normal state.
4-144
R4R5(VREFLW - V INL - Vee)
RHL =
(R4
+ R5) ('V INL
- VREFLW
)
IMPORTANT NOTE:
As explained above, because the input voltage is divided in
half by R4 and R5, all calculations are done relative to the one
half value of Vin. Therefore, for a hysteresis of 200 mV (relative
to Vin), the above equations must use one half this hysteresis
value (100 mV). Also, if a VREFLW value of 2.0 V is desired
(relative to Vin), then 1.0 V for its value should be used in the
above equations. The value for VINL should be scaled by one
half also.
The window comparator design can also be designed using
operational amplifiers and the same equations as for the
LM339 comparator circuit. For the best performance,
however, a transistor output stage should be included in the
design.
Motorola Sensor Device Data
AN1517
TEST/CALIBRATION PROCEDURE
1. Before testing the circuit, the user-defined values for
RTH, RH and Roff should be calculated for the desired
application.
The sensor offset voltage is set by
V
-
V off
off - R1
+ Roff
V
CC'
Then, the amplified sensor voltage corresponding to a given
pressure is calculated by
Vsensor
=201 x 0.0002 x APPLIED PRESSURE + Voff,
where 201 is the gain, 0.0002 is in units of V/kPa and
APPLIED PRESSURE is in kPa.
The threshold voltage, VTH, at which the output changes
state is calculated by determining Vsensoratthe pressure that
causes this change of state:
VTH = Vsensor (@ pressure threshold) =
4. Connect an additional volt meter to the VTH probe point
to verify the threshold voltage.
5. Tum on the supply voltage.
6. With no pressure applied, check to see that Voff is correct
by measuring the voltage at the output of the gain stage
(the volt meter connected to Pin 4 of CN1).lf desired, Voff
can be fine tuned by using a potentiometer for Roff.
7. Check to see that the volt meter monitoring VTH displays
the desired voltage for the output to change states. Use a
potentiometer for RTH to fine tune VTH, if desired.
8. Apply pressure to the sensor. Monitor the sensor's output
via the volt meter connected to pin 4 of CN1. The output
will switch from low to high when this pressure sensor
voltage reaches or exceeds the threshold voltage.
9. If hysteresis is used, with the output high (pressure
sensor voltage greater than the threshold voltage), check
to see if VTH has dropped by the amount of hysteresis
desired.
A potentiometer can be used for RH to fine tune the
amount of hysteresis.
CONCLUSION
RTH
If hysteresis is desired, refer to the LM311 Used in a
Comparator section to determine RH.
2. To test this design, connect a +5 volt supply between pins
3 and 4 of the connector CN1.
3. Connect a volt meter to pins 1 and 4 of CN1 to measure
the output voltage and amplified sensor voltage,
respectively.
Motorola Sensor Device Data
The pressure switch design uses a comparator to create a
logic level output by comparing the pressure sensor output
voltage and a user-defined reference voltage. The flexibility
of this minimal component, high performance design makes
it compatible with many different applications. The design
presented here uses an op amp with a transistor output stage,
yielding excellent logic-level outputs and output transition
speeds for many applications. Finally, several other
comparison stage designs, including a window comparator,
are evaluated and compared for overall performance.
4-145
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1518
Using a Pulse Width Modulated Output with
Semiconductor Pressure Sensors
Prepared by: Eric Jacobsen and Jeff Baum
Sensor Design and Applications Group, Motorola Phoenix, AZ
INTRODUCTION
For remote sensing and noisy environment applications, a
frequency modulated (FM) or pulse width modulated (PWM)
output is more desirable than an analog voltage. FM and PWM
outputs inherently have better noise immunity for these types
of applications. Generally, FM outputs are more widely
accepted than PWM outputs, because PWM outputs are
restricted to a fixed frequency. However, obtaining a stable FM
output is difficult to achieve without expensive, complex
circuitry.
With either an FM or PWM output, a microcontroller can be
used to detect edge transitions to translate the time-domain
signal into a digital representation of the analog voltage signal.
In conventional voltage-ta-frequency (V/F) conversions, a
voltage-controlled oscillator (VCO) may be used in
conjunction with a microcontroller. This use of two time bases,
one analog and one digital, can create additional
inaccuracies. With either FM or PWM outputs, the
microcontroller is only concerned with detecting edge
transitions. If a programmable frequency, stable PWM output
could be obtained with simple, inexpensive circuitry, a PWM
output would be a cost-effective solution for noisy
environmenVremote sensing applications while incorporating
the advantages of frequency outputs.
The Pulse Width Modulated Output Pressure Sensor
design (Figure 1) utilizes simple, inexpensive circuitry to
create an output waveform with a duty cycle that is linear to the
applied pressure. Combining this circuitry with a single digital
time base to create and measure the PWM signal, results in
a stable, accurate output. Two additional advantages of this
design are 1) an AID converter is not required, and 2) since the
PWM output calibration is controlled entirely by software,
circuit-to-circuit variations due to component tolerances can
be nullified.
The PWM Output Sensor system consists of a Motorola
MPX5000 series pressure sensor, a ramp generator
(transistor switch, constant current source, and capacitor), a
comparator, and an MC68HC05P9 microcontroller. These
subsystems are explained in detail below.
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Pressure Sensor
Figure 1. PWM Output Pressure Sensor Schematic
REV 1
4-146
Motorola Sensor Device Data
AN1518
produces an output of 0.5 V at zero pressure to 4.5 V at full
scale pressure. Referring to the schematic of the system in
Figure 1, note that the output of the pressure sensor is
attenuated to one-half of its value by the resistor divider
comprised of resistors R1 and R2. This yields a span of 2.0 V
ranging from 0.25 V to 2.25 V at the non-inverting terminal of
the comparator. Table 1 shows the electrical characteristics of
the MPX51 00.
PRESSURE SENSOR
Motorola's MPX5000 series sensors are signal conditioned
(amplified), temperature compensated and calibrated (Le.,
offset and full-scale span are precision trimmed) pressure
transducers. These sensors are available in full-scale
pressure ranges of 50 kPa (7.3 psi) and 100 kPa (14.7 psi).
With the recommended 5.0 V supply, the MPX5000 series
Table 1. MPX5100DP Electrical Characteristics
Characteristic
Symbol
Min
Typ
Max
Pressure Range
POP
0
-
100
kPa
Supply Voltage
Vs
-
5.0
6.0
Vdc
Full Scale Span
VFSS
3.9
4.0
4.1
V
0.5
0.6
40
-
mV/kPa
Zero Pressure Offset
Voff
0.4
Sensitivity
S
-
Unit
V
Linearity
-
-0.5
-
0.5
%FSS
Temperature Effect on Span
-
-1.0
-
1.0
%FSS
Temperature Effect on Offset
-
-50
0.2
50
mV
THE RAMP GENERATOR
The ramp generator is shown in the schematic in Figure 1.
A pulse train output from a microcontroller drives the ramp
generator at the base of transistor Q1. This pulse can be
accurately controlled in frequency as well as pulse duration via
software (to be explained in the microcontroller section).
The ramp generator uses a constant current source to
charge the capacitor. It is imperative to remember that this
current source generates a stable current only when it has
approximately 2.5 V or more across it. With less voltage
across the current source, insufficient voltage will cause the
current to fluctuate more than desired; thus, a design
constraint for the ramp generator will dictate that the capacitor
can be charged to only approximately 2.5 V, when using a
5.0 V supply.
The constant current charges the capacitor linearly by the
following equation:
IW = ILlt
C
(1)
where Ll.t is the capacitor's charging time and C is the
capacitance.
Referring to Figure 2, when the pulse train sent by the
microcontroller is low, the transistor is off, and the current
source charges the capacitor linearly. When the pulse sent by
the microcontroller is high, the transistor turns on into
saturation, discharging the capacitor. The duration of the high
part of the pulse train determines how long the capacitor
discharges, and thus to what voltage it discharges. This is how
the dc offset of the ramp waveform may be accurately
controlled. Since the transistor saturates at approximately
60 mV, very little offset is needed to keep the capaCitor from
discharging completely.
-In n nl---
Microcontroller
Pulse Train - - - - - - -
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Waveform - - - - -...
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Offset (100 mV)
Figure 2. Ideal Ramp Waveform for the PWM Output Pressure Sensor
Motorola Sensor Device Data
4-147
AN1518
The PWM output is most linear when the ramp waveform's
period consists mostly of the rising voltage edge (see
Figure 2). If the capacitor were allowed to completely
discharge (see Figure 3), a flat line at approximately 60 mV
would separate the ramps, and these "flat spots" may result in
Microcontroller
Pulse Train
non-linearities of the resultant PWM output (after comparing
it to the sensor voltage). Thus, the best ramp waveform is
produced when one ramp cycle begins immediately after
another, and a slight dc offset disallows the capacitor from
discharging completely.
•
Exaggerated
Capacitor Discharge
Ramp
Waveform
Figure 3. Non Ideal Ramp Waveform for the PWM Output Pressure Sensor
The flexibility of frequency control of the ramp waveform via
the pulse train sent from the microcontroller allows a
programmable-frequency PWM output. Using Equation 1 the
frequency (inverse of period) can be calculated with a given
capacitor so that the capacitor charges to a maximum t'N of
approximately 2.5 V (remember that the current source needs
approximately 2.5 V across it to output a stable current). The
importance of software control becomes evident here since
the selected capacitor may have a tolerance of ± 20%. By
adjusting the frequency and positive width of the pulse train,
the desired ramp requirements are readily obtainable; thus,
nullifying the effects of component variances.
For this design, the ramp spans approximately 2.4 V from
0.1 V to 2.5 V. At this voltage span, the current source is stable
and results in a linear ramp. This ramp span was used for
reasons which will become clear in the next section.
In summary, complete control of the ramp is achieved by the
following adjustments of the microcontroller-created pulse
train:
•
Increase Frequency: Span of ramp decreases.
The dc offset decreases slightly.
•
Decrease Frequency: Span of ramp increases.
The dc offset increases slightly.
•
Increase Pulse Width: The dc offset decreases.
Span decreases slightly.
•
Decrease Pulse Width: The dc offset increases.
Span increases slightly.
4-148
THE COMPARATOR STAGE
The LM311 chip is designed specifically for use as a
comparator and thus has short delay times, high slew rate,
and an open-collector output. A pull-up resistor at the output
is all that is needed to obtain a rail-to-rail output. As Figure 1
shows, the pressure sensor output voltage is input to the
non-inverting terminal of the op amp and the ramp is input to
the inverting terminal. Therefore, when the pressure sensor
voltage is higher than a given ramp voltage, the output is high;
likewise, when the pressure sensor voltage is lower than a
given ramp voltage, the output is low (refer to Figure 5). As
mentioned in the Pressure Sensor section, resistors R1 and
R2 of Figure 1 comprise the voltage divider that attenuates the
pressure sensor's signal to a 2.0 V span ranging from 0.25 V
to 2.25 V.
Since the pressure sensor voltage does not reach the
ramp's minimum and maximum voltages, there will be a finite
minimum and maximum pulse width for the PWM output.
These minimum and maximum pulse widths are design
constraints dictated by the comparator's slew rate. The
system design ensures a minimum positive and negative
pulse width of 20 Ils to avoid nonlinearities at the high and low
pressures where the positive duty cycle of the PWM output is
at its extremes (refer to Figure 4 ). Depending on the speed of
the microcontroller used in the system, the minimum required
pulse width may be larger. This will be explained in the next
section.
Motorola Sensor Device Data
AN1518
THE MICROCONTROLLER
The microcontroller for this application requires input
capture and output compare timer channels. The output
capture pin is programmed to output the pulse train that drives
the ramp generator, and the input capture pin detects edge
transitions to measure the PWM output pulse width.
Since software controls the entire system, a calibration
routine may be implemented that allows an adjustment of the
frequency and pulse width of the pulse train until the desired
ramp waveform is obtained. Depending on the speed of the
microcontroller, additional constraints on the minimum and
maximum PWM output pulse widths may apply. For this
design, the software latency incurred to create the pulse train
at the output compare pin is approximately 40 Ils.
Consequently, the microcontroller cannot create a pulse train
with a positive pulse width of less than 40 Ils. Also, the
software that measures the PWM output pulse width at the
input capture pin requires approximately 20 Ils to execute.
Referring to Figure 5, the software interrupt that manipulates
the pulse train always occurs near an edge detection on the
input capture pin (additional software interrupt). Therefore, the
minimum PWM output pulse width that can be accurately
detected is approximately 60 Ils (20 Ils + 40 Ils). This
constrains the minimum and maximum pulse widths more
than the slew rate of the comparator which was discussed
earlier (refer to Figure 4).
f
!>.V Sets Maximum
Pulse Width
(Period - 60 ~s)
!>.V Sets Minimum
Pulse Width (60 ~s)
f
Figure 4. Desired Relationship Between the Ramp Waveform
and Pressure Sensor Voltage Spans
An additional consideration is the resolution of the PWM
output. The resolution is directly related to the maximum
frequency olthe pulse train. In our design, 5121ls are required
to obtain at least 8-bit resolution. This is determined by the
fact that a 4 MHz crystal yields a 2 MHz clock speed in the
microcontrolier. This, in turn, translates to 0.51ls per clock tick.
There are four clock cycles per timer count. This results in 21ls
per timer count. Thus, to obtain 256 timer counts (or 8-bit
resolution), the difference between the zero pressure and full
scale pressure PWM output pulse widths must be at least
512 Ils (2 Ils x 256). But since an additional 60 Ils is needed
at both pressure extremes of the output waveform, the total
period must be at least 6321ls. This translates to a maximum
frequency for the pulse train of approximately 1.6 kHz. With
this frequency, voltage span of the ramp generator, and value
of current charging the capacitor, the minimum capacitor value
may be calculated with Equation 1.
To summarize:
The MC68HC705P9 runs off a 4 MHz crystal. The
microcontroller internally divides this frequency by two to yield
an internal clock speed of 2 MHz.
Motorola Sensor Device Data
_1_ = > --,--0--,.::..5-"f.l,-,s~
2 MHz
clock cycle
And,
4 clock cycles = 1 timer count.
Therefore,
0.5 f.ls
4 clock cycles
timer count x clock cycle
2 f.ls
timer count
For 8-bit resolution,
2 f.ls
timer count x 256 counts = 512 f.ls
Adding a minimum of 60 Ils each for the zero and full scale
pressure pulse widths yields
5121ls + 60 Ils + 60 Ils = 6321ls,
which is the required minimum pulse train period to drive the
ramp generator.
Translating this to frequency, the maximum pulse train
frequency is thus
63i
f.ls = 1.58 kHz.
4-149
AN1518
2.4 V will ensure that the maximum pulse width at full
scale pressure will be at least 60 Ils less than the total
period. Note that by decreasing the frequency of the
pulse train, a dc offset will begin to appear. This may
result in the ramp looking nonlinear at the top.
3. If the ramp begins to become nonlinear, increase the
pulse width to decrease the dc offset.
4. Repeat steps 2 and 3 until the ramp spans 2.4 V and has
a dc offset of approximately 100 mV. The dc offset value
is not critical, but the bottom of the ramp should have a
"crisp" point at which the capacitor stops discharging and
begins charging. Simply make sure that the minimum
pulse width at zero pressure is at least 60 Its. Refer to
Figures 4 and 5 to determine if the ramp is sufficient for
the application.
CALIBRATION PROCEDURE AND RESULTS
The following calibration procedure will explain how to
systematically manipulate the pulse train to create a ramp that
meets the necessary design constraints. The numbers used
here are only for this design example. Figure 6 shows the
linearity performance achieved by following this calibration
procedure and setting up the ramp as indicated by Figures 4
and 5.
1. Start with a pulse train that has a pulse width and
frequency that creates a ramp with about 100 mV dc
offset and a span smaller than required. In this example
the initial pulse width is 84 its and the initial frequency is
1.85 kHz.
2. Decrease the frequency of the pulse train until the ramp
span increases to approximately 2.4 V. The ramp span of
Mic~ ~ t~ ~
---=:·---1n n nl--I I
I I
I I
I
Ramp
Waveform
Sensor_
Voltage
I I
I I
I I
I
I I
I I
I I
Exaggerated
Capacitor Discharge
PWMOutput_
Voltage
Figure 5. Relationships Between the PWM Output Pressure Sensor Voltages
U>
..=;
.<=
:§
:;:
III
:;
a.
650
600
550
500
450
400
350
300
250
200
A
t50
~
100
I,,'
50
o
o
./
. / .... "
80
./ /"
/":.
.
.:,;;:: / ........
.
100
90
//'
i--":/
70
60
.//
P
C
.!!?
50
~
40
Cl
-5'
30
- - - Pulse Width - - - - Duty Cycle -
20
10
I
20
40
60
Pressure (kPa)
80
100
o
Figure 6. PWM Output Pressure Sensor Linearity Data
4-150
Motorola Sensor Device Data
AN1518
CONCLUSION
The Pulse Width Modulated Output Pressure Sensor uses
a ramp generator to create a linear ramp which is compared
to the amplified output of the pressure sensor at the input of
a comparator. The resulting output is a digital waveform with
a duty cycle that is linearly proportional to the input pressure.
Although the pressure sensor output has a fixed offset and
Motorola Sensor Device Data
span, the ramp waveform is adjustable in frequency, dc offset,
and voltage span. This flexibility enables the effect of
component tolerances to be nullified and ensures that ramp
span encompasses the pressure sensor output range. The
ramp's span can be set to allow for the desired minimum and
maximum duty cycle to guarantee a linear dynamic range.
4-151
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1525
The A-B-C's of Signal-Conditioning Amplifier
Design for Sensor Applications
Prepared by: Eric Jacobsen and Jeff Baum
Sensor Applications Engineering
Motorola Signal Products Division
Phoenix, AZ
INTRODUCTION
Although fully signal-conditioned, calibrated, and
temperature compensated monolithic sensor IC's are
commercially available today, there are many applications
where the flexibility of designing custom signal-conditioning
is of great benefit. Perhaps the need for a versatile low-level
sensor output is best illustrated by considering two particular
cases that frequently occur: (1) the user is in a prototyping
phase of development and needs the ability to make changes
rapidly to the overall transfer function of the combined
sensor/amplifier subsystem, (2) the specific desired transfer
function does not exist in a fully signal-conditioned,
precision-trimmed sensor product (e.g., a signal-conditioned
device is precision trimmed over a different pressure range
than that of the application of interest). In such cases, it is
obvious that there will always be a need for low-level,
nonsignal-conditioned sensors. Given this need. there is also
a need for sensor interface amplifier circuits that can signal
condition the "raw" sensor output to a usable level. These
circuits should also be user friendly. simple, and cost effective.
Today's unamplified solid-state sensors typically have an
output voltage of tens of millivolts (Motorola's basic 10 kPa
pressure sensor, MPX10, has a typical full-scale output of
58 mV, when powered with a 5 V supply). Therefore, a gain
stage is needed to obtain a signal large enough for additional
processing. This additional processing may include
digitization by a microcontroller's analog to digital (AID)
converter,
input to a comparator, etc. Although the
signal-conditioning circuits described here are applicable to
low-level, differential-voltage output sensors in general, the
focus of this paper will be on interfacing pressure sensors to
amplifier circuits.
This paper presents a basic two operational-amplifier
signal-conditioning circuit that provides the desired
characteristics of an instrumentation amplifier interface:
•
High input impedance
•
Low output impedance
•
Differential to single-ended conversion of the pressure
sensor signal
•
High gain capability
4-152
For this two op-amp circuit, additional modifications to the
circuit allow (1) gain adjustment without compromising
common mode rejection and (2) both positive and negative dc
level shifts of the zero pressure offset. Varying the gain and
offset is desirable since full-scale span and zero pressure
offset voltages of pressure sensors will vary somewhat from
unit to unit. Thus, a variable gain is desirable to fine tune the
sensor's full-scale span, and a positive or negative dc level
shift (offset adjustment) of the pressure sensor signal is
needed to translate the pressure sensor's signal-conditioned
output span to a specific level (e.g., within the high and low
reference voltages of an AID converter).
For the two op-amp gain stage, this paper will present the
derivation of the transfer function and simplified transfer
function for pressure sensor applications, the derivation and
explanation of the gain stage with a gain adjust feature, and
the derivation and explanation of the gain stage with the dc
level shift modification.
Adding another amplifier stage provides an alternative
method of creating a negative dc voltage level shift. This
stage is cascaded with the output from the two op-amp stage
(Note: gain of the two op-amp stage will be reduced due to
additional gain provided by the second amplifier stage). For
this three op-amp stage, the derivation of the transfer
function, simplified transfer function, and the explanation of
the negative dc level shift feature will be presented.
GENERAL NOTE ON OFFSET ADJUSTMENT
Pressure sensor interface circuits may require either a
positive or a negative dc level shiftto adjust the zero pressure
offset voltage. As described above, if the signal-conditioned
pressure sensor voltage is input to an A/D, the sensor's
output dynamic range must be positioned within the high and
low reference voltages of the A/D; i.e., the zero pressure
offset voltage must be greater than (or equal to) the low
reference voltage and the full-scale pressure voltage must
be less than (or equal to) the high reference voltage (see
Figure 1). Otherwise, voltages above the high reference will
be digitally converted as 255 decimal (for 8-bit AID), and
voltages below the low reference will be converted as 0. This
creates a nonlinearity in the analog-to-digital conversion.
Motorola Sensor Device Data
AN1525
1
NO HIGH REFERENCE OR HIGH _ _ _....,....
SATURATION LEVEL OF AMPLIFIER
w
z
C!l
1
FULL-SCALE
..
OUTPUT VOLTAGE - - - -
",'0:
""a:
~
"">-z
:::lW
I"
w
0
-'
""
Oz
Q
:::Jen
~~
a:
W
u:
en>
::;;
"-C!l
::;
00
0..
z
w
""
en
ZERO PRESSURE _ _ _....,....
OFFSET VOLTAGE
a:
0
en
~
f
NO LOW REFERENCE OR LOW
SATURATION LEVEL OF AMPLIFIER ---....,....
f
Figure 1. Positioning the Sensor's Full-Scale Span within the AID's or Amplifier's Dynamic Range
A similar requirement that warrants the use of a dc level
shift is the prevention of the pressure sensor's voltage from
extending into the saturation regions of the operational
amplifiers. This also would cause a nonlinearity in the sensor
output measurements. For example, if an op-amp powered
with a single-ended 5 V supply saturates near the low rail of
the supply at 0.2 V, a positive dc level shift may be required
to position the zero pressure offset voltage at or above 0.2 V.
Likewise, if the same op-amp saturates near the high rail of
the supply at 4.8 V, a negative dc level shift may be required
to position the full-scale pressure voltage at or below 4.8 V.
It should be obvious that if the gain of the amplifiers is too
large, the span may be too large to be positioned within the
4.6 V window (regardless of ability to level shift dc offset). In
such a case, the gain must be decreased to reduce the span.
THE TWO OP-AMP GAIN STAGE
TRANSFER FUNCTION
The transfer function of the two op-amp signal-conditioning
stage, shown in Figure 2, can be determined using nodal
analysis at nodes 1 and 2. The analysis can be simplified by
calculating the transfer function for each of the signals with the
other two signals grounded (set to zero), and then employing
superposition to realize the overall transfer function. As shown
in Figure 2, VIN2 and VIN1 are the differential amplifier input
signals (with VIN2 > VIN1), and VREF is the positive dc level
adjust point. For a sensor with a small zero pressure offset
and operational amplifiers powered from a single-ended
supply, it may be necessary to add a positive dc level shift to
keep the operational amplifiers from saturating near zero
volts.
VCC
VREF ">---'l.M--"'--I
VIN1
:;-----'7
Vo
VIN2 ) - - - - - - - - - - - - - - - '
Figure 2. The Two Operational-Amplifier Gain Stage
Motorola Sensor Device Data
4-153
AN1525
First, the transfer function for VIN1 is determined by
grounding VREF and VIN2 at node 1:
V IN1
Va' - V IN1
R1 -
R2
(1)
and at node 2:
(2)
APPLICATION TO PRESSURE
SENSOR CIRCUITS
The previous section showed the derivation of the general
transfer function for the two op-amp signal-conditioning
circuit. The simplified form of this transfer function, as applied
to a pressure sensor application, is derived in this section.
For pressure sensors, VIN1 and VIN2 are referred to as Sand S+, respectively. The simplification is obtained by setting
R4 R1
R3 = R2
By solving Equations (1) and (2) for Va' and equating the
results, Equation (3) is established:
(:~
Through this simplification, Equation (7) simplifies to
+ 1) VIN1 =- : : Vq3)
va=(::+1)(S+-S-)+VREF
Solving for Va yields
va1 =-
::(:~ + 1) VIN1
(4)
By examining Equation (8), the differential gain of the
signal- conditioning stage is:
where Va1 represents the part of Va that VIN1 contributes.
To determine the transfer function forVIN2, VIN1 and VREF
are grounded, and a similar analysis is used, yielding
va2 =(:: + 1) VIN2
(5)
where Va2 represents the part of Va that VIN2 contributes.
Finally, to calculate the transfer function between Va and
VREF, VIN1 and VIN2 are grounded to obtain the following
transfer function:
R4 R2
VaREF =
FIR
3 1
VREF
(6)
where VaREF represents the part of Va that VREF
contributes.
Using superposition for the contributions ofVIN1, VIN2, and
VREF gives the overall transfer function for the signalconditioning stage.
Va = Va1 + Va2 + VaREF
Va =- : :
+
(:~
RR
......1.....£
R3 R 1
(7)
Equation (7) is the general transfer function for the
signal-conditioning stage. However, the general form is not
only cumbersome, but also if no care is taken to match certain
resistance ratios, poor common mode rejection results. A
simplified form of this equation that provides good common
mode rejection is shown in the next section.
4-154
R4
G = - +1
R3
(9)
Also, since the differential voltage between S+ and S- is the
pressure sensor's actual differential output voltage
(VSENSaR), the following equation is obtained for Va:
Va = ( : : + 1) VSENSaR + VREF
(10)
Finally, the term VREF is the positive offset voltage added to
the amplified sensor output voltage. VREF can only be positive
when using a positive single-ended supply. This offset (dc
level shift) allows the user to adjust the absolute range that the
sensor voltage spans. For example, if the gain established by
R4 and R3 creates a span of four volts and this signal swing
is superimposed upon a dc level shift (offset) of 0.5 volts, then
a signal range from 0.5 V to 4.5 V results.
VREF is typically adjusted by a resistor divider as shown in
Figure 3. A few design constraints are required when
designing the resistor divider to set the voltage at VREF.
•
To establish a stable positive dc level shift (VREF), Vee
should be regulated; otherwise, VREFWili vary as Vee varies.
•
When "looking" into the resistor divider from R1, the effective resistance of the parallel combination of the resistors,
RREF1 and RREF2, should be at least an order of magnitude smaller than R1's resistance. If the resistance of the
parallel combination is not small in comparison to R1, Rfs
value will be significantly affected by the parallel combination's resistance. This effect on R 1 will consequently affect
the amplifier's gain and reduce the common mode rejection.
+ 1) VIN1 +(:: + 1) VIN2
VREF
(8)
Motorola Sensor Device Data
AN1525
without additional constraints on the resistor values. To obtain
good common mode rejection, use a similar simplification as
before; that is, set
Vee
and
RREFl
R2 = R3
Rl
VREF o--t--~WV-----7 TO Ul
Defining the voltage differential between VIN2 and VINI as
VSENSOR, the simplified transfer function is
RREF2
Vo = ( : : +
~R: + 1) (VSENSOR) + VREF
(12)
Thus, the gain is
Figure 3. A Resistor Divider to Create VREF
R4
2R4
G=-+--+1
RS
RG
THE TWO OP-AMP GAIN STAGE WITH
VARIABLE GAIN
(IS)
and VREF is the positive dc level shift (offset).
Varying the gain of the two op-amp stage is desirable for
fine-tuning the sensor's signal-conditioned output span.
However, to adjust the gain in the two op-amp gain circuit in
Figure 2 and to simultaneously preserve the common mode
rejection, two resistors must be adjusted. To adjust the gain,
it is more desirable to change one resistor. By adding an
additional feedback resistor, RG, the gain can be adjusted with
this one resistor while preserving the common mode rejection.
Figure 4 shows the two op-amp gain stage with the added
resistor, RG.
Use the following guidelines when determining the value for
RG:
•
By examining the gain equation, RG's resistance should
be comparable to R4'S resistance. This will allow fine tuning of the gain established by R4 and RS. If RG is too large
(e.g., RG approaches ~), it will have a negligible effect on
the gain. If RG is too small (e.g., RG approaches zero), the
RG term will dominate the gain expression, thus prohibiting fine adjustment of the gain established via the ratio of
R4 and RS·
•
Use a potentiometer for RG that has a resistance range on
the order of R4 (perhaps with a maximum resistance equal
to the value of R4).lf a fixed resistor is preferable to a potentiometer, use the potentiometer to adjust the gain, measure
the potentiometer's resistance, and replace the potentiometer with the closest 1% resistor value.
•
To maintain good common mode rejection while varying
the gain, RG should be the only resistor that is varied. RG
equally modifies both of the resistor ratios which need to be
well-matched for good common mode rejection, thus preserving the common mode rejection.
Vee
NODE 1
R1
VREF >--'\III'v---',....,I~>'---t---'Wr...,:""
VIN1 ) - - - - - - j
::>---~ Vo
VIN2 ) -_ _ _ _ _ _ _ _ _....J
Figure 4. Two Operational-Amplifier Gain Stage with
Variable Gain
THE TWO OP-AMP GAIN STAGE WITH VARIABLE
GAIN AND NEGATIVE DC LEVEL SHIFT
As with the two op-amp gain stage, nodal analysis and
superposition are used to derive the general transfer function
for the variable gain stage.
The last two op-amp circuits both incorporate positive dc
level shift capability. Recall that a positive dc level shift is
required to keep the operational amplifiers from saturating
near the low rail of the supply or to keep the zero pressure
offset above (or equal to) the low reference voltage of an AID.
This two op-amp stage incorporates an additional resistor,
ROFF, to provide a negative dc level shift. A negative dc level
shift is useful when the zero pressure offset voltage of the
sensor is too high. In this case, the user may be required to
level shift the zero pressure offset voltage down (toward zero
vOlts). Now, for a specified amount of gain, the full-scale
pressure output voltage does not saturate the amplifier at the
high rail of the voltage supply, nor is it greater than the AID's
high reference voltage. Figure 5 shows the schematic for this
amplifier circuit.
Vo =(:4
S
+ :4 + :2:4 + 1) VIN2
G
S G
R
R
R R
R R )
RS
RG
RSRG
Rl RS
- ( -.1+~+~+~
+ (R2R4) VREF
R1 RS
VINI
(11)
This general transfer function also is quite cumbersome
and is susceptible to producing poor common mode rejection
Motorola Sensor Device Data
4-155
AN1525
Vee
VREF >----'\M--'+-I
VIN1 > - - - - - - - 1
VIN2
>--_--~Vo
>-____________..J
Figure 5. Two Op-Amp Signal-Conditioning Stage with Variable Gain and Negative Dc Level Shift Adjust
To derive the general transfer function, nodal analysis and
superposition are used:
(14)
As before, defining the sensor's differential output as
VSENSOR, defining VIN2 as S+ for pressure sensor
applications, and using the simplification that
and
R2=R3
obtains the following simplified transfer function:
Vo = ( : : +
~~ + 1) (VSENSOR) + VREF
• To determine the value of ROFF:
1. Determine the amount of negative dc level shifting required (defined here as V-shift).
2. R4 already should have been determined to set the gain
for the desired signal-conditioned sensor output.
3. Although V-shift is dependent on S+, S+ changes only
slightly over the entire pressure range. With Motorola's
MPX10 powered at a 5 V supply, S+ will have a value of
approximately 2.51 Vat zero pressure and will increase
as high as 2.53 V at full-scale pressure. This error over
the full-scale pressure span of the device is negligible
when considering that many applications use an 8-bit
AID converter to segment the pressure range. Using an
8-bit AID, the 20 mV (0.02 V) error corresponds to only
1 bit of error over the entire pressure range (1 bit 1255
bits x 100% = 0.4% error).
4. ROFF is then calculated by the following equation:
S+ - V
ROFF=
R
+ _4-(S+-Vec>
ROFF
(15)
The gain is
R4
2R4
G=-+--+1
R3
RG
(16)
To adjust the gain, refer to the guidelines presented in the
section on Two Op-Amp Gain Stage with Variable Gain.
VREF is the positive dc level shift, and the negative dc level
shift is:
R4
V-shift = -R- (S+ - Vee)
OFF
(17)
The following guidelines will help design the circuitry for the
negative dc voltage level shift:
4-156
• To establish a stable negative dc level shift, Vee should be
regulated; otherwise, the amount of negative level shift will
vary as Vee varies.
• ROFF should be the only resistor varied to adjust the
negative level shift. Varying R4 will change the gain of the
two op-amp circuit and reduce the common mode rejection.
ee R4
V-s hift
(18)
An alternative to using this equation is to use a
potentiometer for ROFF that has a resistance range on the
order of R4 (perhaps 1 to 5 times the value of R4). Use the
potentiometer to fine tune the negative dc level shift, while
monitoring the zero pressure offset output voltage, VO. As
before, if a fixed resistor is preferable, then measure the
potentiometer's resistance and replace the potentiometer
with the closest 1% resistor value.
Important note: The common mode rejection of this amplifier
topology will be low and perhaps unacceptable in some
applications. (A SPICE model of this amplifier topology
showed the common mode rejection to be 28 dB.) However,
this circuit is presented as a solution for applications where
only two operational amplifiers are available and the common
mode rejection is not critical when considering the required
Motorola Sensor Device Data
AN1525
system performance. Adding a third op-amp to the circuit for
the negative dc level shifting capability (as shown in the next
section) is a solution that provides good common mode
rejection, but at the expense of adding an additional op-amp.
First, use the same simplifications as before; that is, set
R1 = R4
and
R2= R3
THE THREE OP-AMP GAIN STAGE
FOR NEGATIVE DC LEVEL SHIFTING
Defining the voltage differential between VIN2 and VIN1 as
VSENSOR , the simplified transfer function is
This circuit adds a third op-amp to the output of the two
op-amp gain block (see Figure 6). This op-amp has a dual
function in the overall amplifier circuit:
•
Its non-inverting configuration provides gain via the ratio
of R6 and R5.
•
It has negative dc voltage level shifting capability typically
created by a resistor divider at V-shift, as discussed in the
section on Application to Pressure Sensor Circuits. Although this configuration requires a third op-amp for the
negative dc level shift, it has no intrinsic error nor low common mode rejection associated with the negative level shift
(as does the previous two op-amp stage). Depending on
the application's accuracy requirement, this may be a more
desirable configuration for providing the negative dc level
shift.
Vo = [1
+ :: ] [ (:: +
~R: +
1 )(VSENSOR)
R6
+ VREF] - R5 V-shift
(20)
The gain is
G =[1
+
R6 ] [R4
R5
R3
+ 2R4 + 1]
RG
(21)
VREF is the positive dc level shift (offset), and V-shift is the
negative dc level shift.
Vee
RS
RS
v-SHIFT>---'IIIIIr-_---'w.,...----.
R4
>--
.s
w
700
(!l
!:i~
"- J"'....
600
_ 4.5
G
I-
::;)
a..
I...........
a:
~
7
I::;)
0
..........
z
w
en
w
.........
::E
V
a:
........
J;
;a
en 400
::;)
.......
~
w
,g: 300
~ 1.5
w
/
a:
....... r-..,.
V
/
a: 3.0
0
en
...........
500
1/
a..
::;;
1/
""
V
/
w
I-
200
-40 -20
0.0
100 120
TA, AMBIENT TEMPERATURE (oG)
20
40
60
80
140
160
TEMPERATURE SWITCH APPLICATIONS
The Comparison Stage
The comparison stage is the "heart" of the temperature
switch design. This stage converts the analog voltage output
Motorola Sensor Device Data
20
40
60
100
80
Figure 4. Temperature Sensor Output versus
Temperature
to a digital output, as dictated by the comparator's threshold.
The comparison stage has a few design issues which must
be addressed (component names and values reference
Figure 5):
• The threshold for which the output switches must be
programmable. In Figure 5, the threshold is easily set by
dividing the regulated 5 V supply voltage with resistors R1
and R2. In Figure 5, the threshold is set at 2.5 V for R1 R2
10kO.
=
=
•
A method for providing an appropriate amount of hysteresis should be available. Hysteresis prevents multiple
transitions from occurring when slow varying signal inputs
oscillate about the threshold. The hysteresis can be set by
applying positive feedback. The amount of hysteresis is
determined by the value of the feedback resistor, RH (refer
to equations in the following section).
•
It is ideal for the comparator's logic level output to swing
from one supply rail to the other. In practice, this is not
possible. Thus, the goal is to swing as high and low as
possible for a given set of supply voltages. This offers the
greatest difference between logic states and will avoid
having a microcontroller read the switch level as being in
an indeterminate state.
•
In order to be compatible with CMOS circuitry and to avoid
microcontroller timing delay errors, the comparator must
switch sufficiently fast.
•
By using two comparators (or op-amps configured as
comparators), a window comparator may be implemented.
The window comparator may be used to monitor when the
current temperature is within a set range. By adjusting the
input thresholds, the window width can be customized for
a given application. As with the single threshold design,
positive feedback can be used to provide hysteresis for
both switching points. The window comparator and the
other comparator circuits will be explained in the following
section.
DESIGN CONSIDERATIONS
Since the output of the sensor is only on the order of
millivolts per degree Celsius (mVl°C) , amplification of the
temperature signal is still necessary for this design. Thus, the
circuit in Figure 2 will be used to provide the
signal-conditioning function in this temperature switch design
(see the section on Amplifier Design Considerations). Now
that the sensor signal has been amplified to a usable voltage
level, it can be compared to a user-programmable threshold
voltage that is set at the comparison stage. Depending on the
logic chosen, the comparison stage output can be either a
low-to-high or high-to-Iow transition when exceeding or
falling below the given threshold, i.e., positive logic when
ouput goes high to a temperature that exceeds threshold, etc.
o
TEMPERATURE (oG)
Figure 3. VBE versus Ambient Temperature
Characteristic
Many times, a temperature sensing application only
requires information about the current temperature compared
to a set threshold. To detect when the temperature has
exceeded or fallen below a specified threshold, a logic-level
transition can serve as the circuit output. This logic signal is
typically an input to a microcontroller 1/0 pin which can detect
such a logic-level transition. The interface circuit that can
provide this additional functionality is very similar to the analog
amplifier interface presented above. In fact, the identical
circuit topology will be employed, with the addition of a
comparison stage for setting the temperature threshold and
providing a "clean" logic-level output. Several comparator
circuit topologies which use comparator IC's andlor
operational amplifiers will be presented. A window comparator
design (high and low thresholds) is also included. The
following sections describe the characteristics and design
criteria for each comparator circuit, while evaluating them in
overall performance (i.e., switching speed, logic-level
voltages, etc.).
",
4-161
AN1535
performance, this circuit can be used in many types of
applications, including interface to microprocessors.
The amount of hysteresis can be calculated by the following
equations:
EXAMPLE COMPARATOR CIRCUITS
Several comparator circuits were built and evaluated.
Comparator stages using the LM311 comparator, LM358
Op-Amp (with and without an output transistor stage), and
LM339 were examined. Each comparator circuit was
evaluated regarding its output voltage levels (dynamic range)
and the output transition time, as shown in Table 1.
VREF = R1
R2
+ R2 VCC' neglecting the effect of RH
R1R2 + R2RH
V
R1R2 + R1RH + R2RH CC
The LM311 Used in a Comparator Circuit
The LM311 chip is designed specifically for use as a
comparator and thus has short delay times, high slew rate,
and an open collector output. A pull-up resistor at the output
is all that is needed to obtain a "rail-to-rail" output.
Additionally, the LM311 is a reverse logic circuit; that is, for an
input lower than the reference voltage, the output is high.
Likewise, when the input voltage is higher than the reference
voltage, the output is low. Figure 5 shows a schematic of the
LM311 stage with threshold setting resistor divider, hysteresis
resistor, and the open-collector pull-up resistor. Table 1
shows the comparator's performance. Based on its
HYSTERESIS = VREF - VREFL when the normal state is
below VREF, or
HYSTERESIS =VREFH - VREF when the normal state is
above VREF
An illustration of hysteresis and the relationship between
these voltages is shown in Figure 6.
Table 2. The comparator circuits' performance characteristics.
LM311
LM358
LM358 with Transistor
Unit
Rise Time
1.40
5.58
2.20
~s
Fall Time
0.04
6.28
1.30
~s
Characteristic
Switching Speeds
Output Levels
VOH
4.91
3.64
5.00
V
VOL
61.1
38.0
66.0
mV
Circuit Logic Type
NEGATIVE
NEGATIVE
POSITIVE
Vee
- - , . - - VREF (VREFUW)
HYSTERESIS
VREFL
RpU
Ul
LM311
NORMAL STATE
VIN )------1~--1
>--+--VOUT
VREFH
HYSTERESIS
-
Figure 5. The LM311 Comparator Circuit Schematic
4-162
........- - VREF (VREFLW)
Figure 6. Setting the Reference Voltages
Motorola Sensor Device Data
AN1535
The initial calculation forVREF will be slightly in error due to
neglecting the effect of RH. To establish a precise value for
VREF (including RH in the circuit), recompute R1 taking into
account that VREF depends on R1, R2, and RH. It turns out
that when the normal state is belowVREF, RH is in parallel with
R1:
R2
VCC
R111RH + R2
(which is identical to
the equation for VREFH)
Alternately, when the normal state is above VREF, RH is in
parallel with R2:
VREF =
R2 II RH
R1
+
R2 II RH
VCC (which is identical to
the equation for VREFL)
These two additional equations for VREF can be used to
calculate a more precise value for VREF.
TheusershouldbeawarethatVREF, VREFH ,andVREFLare
chosen for each application, depending on the desired
switching point and hysteresis values. Also, the user must
specify which range (either above or below the reference
voltage) is the desired normal state (see Figure 6). Referring
to Figure 6, if the normal state is below the reference voltage,
then VREFL (VREFH is only used to calculate a more precise
value for VREF as explained before) is below VREF by the
desired amount of hysteresis (use VREFL to calculate RH).
Alternately, if the normal state is above the reference voltage,
then VREFH (VREFL is only used to calculate a more precise
value for VREF) is above VREF by the desired amount of
hysteresis (use VREFH to calculate RH).
The LM358 Op-Amp Used in a
Comparator Circuit
Figure 7 shows the schematic for the LM358 op-amp
comparator stage, and Table 1 shows its performance. Since
the LM358 is an operational amplifier, it does not have the fast
slew-rate of a comparator IC nor the open collector output.
Comparing the LM358 and the LM311 (Table 1), the LM311 is
better for logic/switching applications since its output nearly
extends from rail to rail and has a sufficiently high switching
speed. The LM358 will perform well in applications where the
switching speed and logic-state levels are not critical (LED
output, etc.). The design of the LM358 comparator is
accomplished by using the same equations and procedure
presented for the LM311. This circuit is also reverse logic.
The LM358 Op-Amp with a Transistor Output Stage
The LM358 with a transistor output stage is shown in Figure
8. This circuit has similar performance to the LM311
comparator; its output reaches the upper rail and its switching
speed is comparable to the LM311's. This enhanced
performance does, however, require an additional transistor
and base resistor.
Like the other two circuits, this comparator circuit can be
designed with the same equations and procedure. The values
for RB and RpU are chosen to give a 5:1 ratio in 01's collector
current to its base current, in order to ensure that 01 is
well-saturated (VOUT can pull down very close to ground
when 01 is on). Once the 5:1 ratio is chosen, the actual
resistance values determine the desired switching speed for
turning 01 on and off. Also, RpU lirnits the collector current to
be within the maximum specification for the given transistor.
Unlike the other two Circuits, this circuit is positive logic due to
the additional inversion created at the output transistor stage.
Vee
Vee
RpU
Ul
VOUT
LM358
VIN
>-----+----l
>----1~---1~ VOUT
Figure 7. The LM358 Comparator Circuit Schematic
Motorola Sensor Device Data
Figure 8. The LM358 with a Transistor Output Stage
Comparator Circuit
4-163
AN1535
The LM339 Used in a Window
Comparator Circuit
The amount of hysteresis can be calculated by the following
equation:
Using two voltage references to detect when the input is
within a certain range is another possibility forthe temperature
switch design. The window comparator's schematic is shown
in Figure 9. The LM339 is a quad comparator IC (it has open
collector outputs), and its performance will be similar to that of
the LM311.
Noticethattheupperwindow reference voltage, VREFUW, is
now equal to its VREFL value, since at this moment, the input
voltage is above the normal state.
HYSTERESIS = VREFUW - VREFL,
where VREFL is chosen to give the desired amount of hysteresis for the application.
The initial calculation forVREFUwwili be slightly in errordue
to neglecting the effect of RHU. To establish a precise value for
VREFUW (including RHU in the circuit), recompute Rl taking
into account that VREFUW depends on R2 and R3 and the
parallel combination of Rl and RHU. This more precise value
is calculated with the following equation:
Vee
RpU
Rl
Ul
LM339
R23
VREFUW = Rl II RHU
+
R23 VCC
For the lower window threshold:
VREFUW
Choose the value for VREFLW
R3
2
Set VREFLW
RHU
VIN
Rl II RHU
+
R2
+
R3 VCC'
where R2 + R3 = R23 from above calculation.
VOUT
R2
=
Ul
VREFLW
RS
To calculate the value of the hysteresis resistor:
The inputlo the lower comparator is one-half VIN (since R4
= R5), when in the normal state. When VREFLW is above
one-half of VIN (i.e., the input voltage has fallen below the
window), RHL parallels R4, thus loading down VIN. The
resulting input to the comparator can be referred to as VINL (a
lower input voltage). To summarize, when the input is within
the window, the output is high, and only R4 is connected to
ground from the comparator's positive terminal. This
establishes one-half of VIN to be compared with VREFLW
When the input voltage is belowVREFLW, the output is low, and
RHL is effectively in parallel with R4. By voltage division, less
of the input voltage will fall across the parallel combination of
R4 and RHL, demanding that a higher input voltage at VIN be
required to make the noninverting input exceed VREFLW
Therefore, the following equations are established:
Figure 9. The LM339 Window Comparator Circuit
HYSTERESIS
=
VREFLW - VINL'
Choose R4 = R5 to simplify the design.
Obtaining the correct amount of hysteresis and the input
reference voltages is slightly different than with the other
circuits. The following equations are used to calculate the
hysteresis and reference voltages. Referring to Figure 9,
VREFUW is the upperwindow reference voltage, and VREFLW
is the lower window reference voltage. Remember that
reference voltage and threshold voltage are interchangeable
terms.
For the upper window threshold:
Choose the valueforVREFUW and Rl (e.g., 10 kQ). Then, by
voltage division, calculate the total resistance of the combination of R2 and R3 (named R23 for identification) to obtain the
desired value for VREFUW, neglecting the effect of RHU:
V
4-164
REFUW -
Rl
R23
V
+ R23 CC
RHL =
R4R5(VREFLW - VINL - VCC)
(R4 + R5)(VINL - VREFLW)
Important Note: As explained above, because the input
voltage is divided in half by R4 and R5, all calculations are
done relative to the one-half value of VIN. Therefore, for a
hysteresisof200 mV (relative to VIN), the preceding equations
must use one-half this hysteresis value (100 mV). Also, if a
VREFLwvalue of 2 V is desired (relative to VIN), then 1 Vfor its
value should be used in the preceding equations. The value
for VINL should be scaled by one-half also.
The window comparator design can also be designed using
operational amplifiers and the same equations as for the
LM339 comparator circuit. For the best performance,
however, a transistor output stage should be included in the
design.
Motorola Sensor Device Data
AN1535
CONCLUSION
The circuits that have been described herein are intended
to demonstrate relatively simple and cost effective ways of
interfacing the MTS102/103/105 series of solid-state
temperature sensors to digital systems. Several examples of
simple signal conditioning the temperature sensor's output
have been given for both analog temperature measurements,
as well as logic-level switch applications. A means of
amplifying and level-shifting the sensor's millivolt-level
output to a 4 V signal swing (symmetrical with respect to AID
converter range) is demonstrated. The same basic signal
Motorola Sensor Device Data
conditioning (amplifier) design is used in both types of sensor
interfaces. However, the temperature switch design uses an
additional comparator stage to create a logic-level output,
by comparing the temperature sensor's amplified output
voltage to a user-defined reference voltage. The flexibility
olthe switch design makes it compatible with many different
applications. The principal design presented here uses an
op-amp with a transistor output stage, yielding excellent
logic-level outputs and output transition speeds for many
applications. Finally, several other comparison stage
designs, including a window comparator, are evaluated and
compared for overall performance.
4-165
MOTOROLA
SEMICONDUCTOR APPLICATION NOTE
AN1536
Digital Boat Speedometers
Prepared by: Bill Lucas
Industrial Technology Center
INTRODUCTION
This application note describes a Digital Boat Speedometer
concept which uses a monolithic, temperature compensated
silicon pressure sensor, analog signal-conditioning circuitry,
microcontroller hardware/software and a liquid crystal display.
This sensing system converts water head pressure to boat
speed. This speedometer design using a 30 psi pressure
sensor (Motorola PIN: MPX2200GP) yields a speed range of
5 mph to 45 mph. Calibration of the system is performed using
data programmed into the microcontroller's internal memory.
A key advantage in all Motorola pressure sensors is the
patented X--ducer™, a single piezoresistive implant that
replaces the traditional Wheatstone bridge configuration used
by competitors. In addition to the X-ducer, Motorola integrates
on-chip all necessary temperature compensation, eliminating the need for separate substrates/hybrids. This state-ofthe-art technology yields superior performance and
reliability. Motorola pressure sensors are offered in several
different port configurations to allow measurement of
absolute, differential and gauge pressure. Motorola offers
three pressure sensor types: uncompensated, temperature
compensated and calibrated or fully signal conditioned.
WATER PRESSURE TO BOAT SPEED
CONVERSION
A typical analog boat speedometer employs a pitot tube, a
calibrated pressure gauge/speedometer and a hose to
connect the two. The pitot tube, located at the boat transom,
provides the pressure signal corresponding to boat speed.
This pressure signal is transmitted to the gauge via the hose.
Boat speed is related to the water pressure at the pitot tube as
described by the following equation:
P ex e * (V2/2g)
where:
V
P
e
g
4-166
speed
pressure at pitot tube
specific weight of media
gravitational acceleration
For example, to calculate P in Ib/in2 for an ocean application
use:
V
speed in mph
63.99 Ibs/ft3 at 60°F, seawater
e
(e will be smaller for fresh water)
32 ftlsec 2
g
15 mph
22 ft/sec
1 ft2
144 in 2
P = (63.99[lb/ft3] / 144[in2/ft2]) (V2[mph]2
(22/15)2[(ft/sec)/mph]2 / 2 (32.2)[ft/sec2])
P[PSI] =
(8.~08)2
For example, if the boat is cruising at 30 mph, the impact
pressure on the pitot tube is:
P = (30/8.208)2 = 13.36 psi.
DIGITAL BOAT SPEEDOMETER DESCRIPTION
AND OPERATION
The MPX2200GP senses the impact water pressure
against the pitot tube and outputs a proportional differential
voltage signal. This differential voltage signal is then fed (via
an analog switch and gain circuitry) to a single slope
analog-to--digital converter (AID) which is external to the
microcontroller. The AID circuit can complete two separate
conversions as well as a reference conversion simultaneously. This AID utilizes the microcontroller's intemal timers as
counters and software to properly manipulate the data. The
analog switch provides a way to flip the sensor outputs after
an AID conversion step, which is necessary to null out the
offset effects of the op-amps. This is accomplished by
performing an analog conversion, reversing the sensor's
differential output signal, performing another analog conversion, summing the two readings, then dividing this sum by two.
Any op--amp offset present will be the same polarity
regardless of the sensor output polarity, thus the op--amp
offset can be mathematically nulled out. The digital
representation of any analog signal is ratiometric to the
reference voltages of the AID converter. Also, the sensor's
output is ratiometric to its excitation voltage. Therefore, if both
the sensor and AID reference voltages are connected to the
same unregulated supply, the variations in sensor output will
be nullified, and system accuracy will be maintained (i.e.,
systems in which both the AID converter's digital value - due
to variations in the AID's reference voltages - and sensor's
output voltage are ratio metric to the supply voltage so that a
voltage regulator is not necessary).
Motorola Sensor Device Data
AN1536
Figure 1 shows the pressure sensor (XDCR) connected to
the analog switches of the 74HC4053 which feeds the
differential signal to the first stage of op-amps. An AID
conversion is performed on the two op-amp output signals,
Vout1 and Vou t2. The difference (Vout1 - Vout2) is computed and stored in microcontroller memory. The analog
switch commutates (op-amp connections switch from YO and
Zo to Y 1 and Z 1), reversing the sensor output signals to the two
op-amps, and another conversion is performed. This value is
then also stored in the microcontroller memory. To summarize,
via software, the following computation takes place:
Again, because any op-amp offset will remain the same
polarity regardless of sensor output polarity, this routine will
effectively cancel any amplifier offset. Any offset the sensor
may introduce is compensated for by software routines that
are invoked when the initial system calibration is done.
The single slope AID provides 11 or more unsigned bits of
resolution. This capability provides a water pressure
resolution to at least 0.05 psi. This translates to a boat speed
resolution of 0.1 mph over the entire speed range.
Figure 2 describes the pressure versus voltage transfer
function of the first op-amp stage.
=
Step 1: Vfirst Vout1 - Vout2
Step 2: Vsecond Vout2 - Vout1
Step 3: Vresult
=
=(Vfirst + Vsecond) / 2
+8
74HC4053
2 VO
15
+8
t
I
I
I
I
I
V1
2
ZO
VOUlt
7
10 k
316k
VOUT2
4
Z1
rh DENOTES ANALOG GROUND
-:!:-
11
DENOTES LOGIC GROUND
XDCR INPUT REVERSE CONTROL
Figure 1. X-ducer, Instrument Amplifier and Analog Switch
------U3-1 (U3-7)
~
<:...
~
::;~
2
I
o
o
10
r-
20
PRESSURE IN
t-
30
PSI
Figure 2. Instrument Amplifier Transfer Function
Motorola Sensor Device Data
Figure 3 details the analog circuitry, microcontroller's timer
capture registers and I/O port which comprise the single slope
AID. The microcontroller's 16-bit free running counter is also
employed, but not shown in the figure.
Comparators U6A, U6B and U6D of the LM 139A are used
to provide the AID function. Constant current source, U7,
resistors R13 and R14 and diode D2 provide a linear voltage
ramp to the inverting inputs of U6, with about 470 microamps
charge current to capacitor C8, with transistor 01 in the off
state. C8 will charge to 5 volts in about 5 milliseconds at the
given current. 01 is turned on to provide a discharge path for
C8 when required. The circuit is designed such that when the
voltage to the inverting inputs of the comparators exceeds the
voltage to the noninverting comparators, each comparator
output will trip from a logic 1 to a logic o.
One AID conversion consists of the following steps:
(1) setting the pressure sensor output polarity (via software
and the analog switches of U4) to the amplifier inputs of the
MC33078 (U3), (2) reading the value of the free running
4-167
AN1536
counter, (3) turning off Q1, and (4) charging C8 and waiting for
the three (U6) comparator outputs to change from 1 to O.
When the comparator outputs change state, the
microcontroller free running counter value is clocked into the
microcontroller's input capture register. Contained in this
register then is the number of counts required to charge C8 to
a value large enough to trip the comparators. Via software, the
voltage signal from U3 (corresponding to the applied pressure
signal) can be compared to the "reference."
The boat speed display for this design employs an
MC145453 LCD driver and four-digit liquid cyrstal display, of
which three digits and a decimal point are used. Figure 4
shows the connections between the display driver and the
display. The display driver is connected to the
microprocessor's serial peripheral interface (SPI). The
software necessary to initialize, format and drive the LCD is
included in the software listing contained in this article.
LM334Z-3
U7
+8
lN914
>:----1r-...::32=-j ICl (PA2)
13
R13
1470
INPUT CAPTURE
REGISTER 1
Rl1
10k
5%
R14
1.5k
5%
VREF
(APPROX. 4.5 V)
MC68HC711E9
27 PA7
33
FROM U3-7
14
GENERAL PURPOSE
OUTPUT
IC2(PA1)
INPUT CAPTURE
REGISTER 2
IC3 (PAO)
INPUT CAPTURE
REGISTER 3
Rl0
10k
5%
+5
R9
10k
5%
34
FROM U3-1
Figure 3. Analog-to-Digltal Converter Front End with Microcontroller
4-168
Motorola Sensor Device Data
s:
9o
a
iii"
en
CD
::J
LCD
en
~
LIQUID CRYSTAL DISPLAY
oCD
-1-
,,'<
,------I
CD
----i=t-
o
~
--
,-1r----
I--
P-
~
Pl
37 36 5
6
7
34 35
8
31
32 9
10
-1-
,-1r-----I
I--
r---I
P-
(
'--
-~
26
lEE PART NUMBER LCD5657 OR EQUAL
r-----I
I--
----i=t-
'-,.-
11
29 30
12
26 27 13
14
I-BP
--
15
24 25
16
22 23 17
18
19
20 21
1
"T1
!C'
c:
iil
".
+5
N1C
19
OJ
18 17 16
15
14 13 11
o
~
en
"t:I
I
c-
•
CD
CD
o
3
!!l.
!!1
c
(ii'
"t:I
10
9
8
7
6
4
5
3
II
44
43 42 41
40
39
38 37
II
36
31
30
29 28
I
II
•
DATA BIT
U1
35 33 32
~26r
IN OUTVCC
21
OSC r-IN
MC145453FN
VSS
DATA
CLOCK
25
124
iii'
'<
OJ
o
III
a.
I
0,11
Vss - - - - - .
VDD
C2
•
.
1
CLOCK
2
DATA
1
70 k
:
1
70 pF
+5
GND
J>
!
0>
CD
...Z
CII
Co)
en
AN1536
Table 1 lists the jumper wire selections needed for
calibration and operational modes. The jumper wire junction
block (Jl, J2, J3) is connected to the microprocessor, pins
PCO, PCl and PC2, respectively as shown in Figure 5.
Table 1.
Jl
J2
J3
OUT
OUT
OUT
OUT
IN
100 psi X-ducer installed
IN
OUT
30 psi X-ducer installed
15 psi X-ducer installed
OUT
OUT
OUT
Display speed in mph
IN
IN
OUT
IN
OUT
OUT
IN
IN
OUT
Display pressure in psi
IN
IN
IN
Display speed in mph
IN
IN
Full scale calibrate
Zero calibrate
+8
XTAL 1-'7---t--t--...,
IA>-....---,,32'"1IGI (PA2)
13
RII
10 k
RI9
10MEG
5%
5%
5%
2N7000
+5
+5
4.H1
5%
EXTAL
27-1
'1-__+-_____"""""'
MC68HC711 E9FN
14
RIO
10k
R9
10k
5%
IC3 (PAO)
34
45 PEl
42 PBO
52
VRH
51
VRL
VREF
+5
47 PE2
49 PE3
~ 0.1* *331'F
44 PE4
+8
R2
1.15k
VREF
(APPROX. 4.5 V)
46 PE5
48 PE6
50 PE7
NOTES:
UNLESS OTHERWISE NOTED, ALL RESISTORS 1% METAL FILM.
RI8 ,.....--..
4.7k
RESET~I_7_ _ _5'_~4-~
33 IC2(PAI)
5%
GND
t5
PA7
43 PEO
RI
4.70
DI
5%
+ 12 > .....OI-J\II.tIr....~~-..
6 IN4004
CI
+ C2
r=---.......--i
U5
-=
MODB
XIRQ 18
19
IRQ
26
VDD
RI5
PC2
RI6
II'
PCI 10
PCO
VSS
PAS
MODA
PDO
PDI
PD2
PD5
STRA
JI
I
31
TEST
JUMPERS-
20
21
22
25
(PD4) SCK 24
(PD3) MOSI 23
-=
2
t5c~3
1I-4
, US PINS 11-16 (PC2-PC7) ARE CONNECTED HERE FOR
TERMINATION PURPOSES.
Figure 5. Boat Speedometer Processor Board
4-170
Motorola Sensor Device Data
AN1536
The calibration ofthis system is as follows. Refer to Table 1.
CAUTION: While installing or changing the proper jumpers
described by each step, power must be off. Reapply power to
read the display after jumpers have been installed in their
proper location for each step. In each step there is a few
seconds' delay after switching the power on and before an
output is displayed. Steps 1 through 3 must be performed prior
to system being operational.
Calibration
1. The pressure range of the system must be established.
The present software installed in this design supports 15,
30 and 100 psi sensors. Using an MPX2200D sensor
(30 psi) for example, only jumper J2 should be installed.
After power is applied, the LCD should read "30." Power
off the system prior to proceeding to step 2.
2. The total system offset, due to the sensor and AID, must
be established for the software routine to effectively
calibrate. With power off, jumpers Jl and J3 should be
installed. Reapply power, and the LCD should respond
Motorola Sensor Device Data
with "000." The offset value measured in this step is thus
stored for use in circuit operation. Power off the system
prior to proceeding to step 3.
3. In this step, the system full scale span is calibrated. With
power off, install jumper Jl only. Now apply the full rated
pressure (30 psi for MPX2200GP) to the sensor, power
on and ensure the display reads "FFF." The full scale
span measured in this step is thus stored for use in circuit
operation. Power off the system prior to step 4.
Operation
4. Ensure power is off, and install jumpers Jl, J2 and J3.
The system is now ready for operation. Simply apply
power and pressure to the sensor, and the LCD will
display the proportional speed above 5 mph, up to the
limits of the sensor.
REFERENCES
Burry, Michael (1989). "Calibration-Free Pressure Sensor
System," Motorola Application Note AN1097.
4-171
AN1536
NOTB. THIS
WAS COMPILED WITH A COMPILER COURTESY OF:
INTROL CORP.
9220 W. HOWARD AVE.
MILWAUKEE, WI. 53228
PHONE (414) 327-7734.
SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER COMPILERS.
THE HEADER FILE io6811.h HAS I/O PORT DEFINITIONS FOR THE 1/0 PORTS PARTICULAR TO THE MC68HC711E9. A TYPICAL ENTRY FOR
PORT A WILL FOLLOW. THE FIRST LINE ESTABLISHES A BASE ADDRESS BY WHICH ALL I/O FACILITIES AND COUNTERS ARE BIASED.
REFER TO THE MC68HC711E9 DATA FOR MORE INFORMATION RELATIVE TO 1/0 AND TIMER ADDRESSES.
#define
IOBIAS QxlOOO
#define PORTA (* (char *)
1* BASE ADDRESS OF THE I/O FOR THE 68HC11 *1
(IOBIAS + 0»
1* PORT A *1
THE STARTUP ROUTINE NEED ONLY LOAD THE STACK TO THE TOP OF RAM, ZERO
THE MICROCONTROLLER' S RAM AND PERFORM A BaR MAIN (BRANCH TO SUBROUTINE "MAIN").
THIS SOURCE CODE, HEADER FILE, COMPILED OBJECT CODE, AND LISTING FILES ARE AVAILABLE ON:
THE MOTOROLA FREEWARE LINE
AUSTIN, TX.
(512) 891-3733.
Bill Lucas 6/21/90
THE CODE STARTS HERE
#inc1ude
*/
1*
I/O port definitions *1
/* define locations in the eeprom to store calibration information * /
#define EEPROM (char*)Oxb600 1* used by calibration functions */
#define EEBASE Oxb600 1* start address of the eeprom * I
#define ADZERO (* ( long int *l ( EEBASE + 0 )} 1* auto zero value *1
#define HIATOD (* ( long int *) ( EEBASE + 4 )} 1* full scale measured input */
#define XDCRMAX (* ( char *) ( EEBASE + 8 » /* full scale input of the xdcr */
union bytes {
unsigned long int 1;
char b[4];
}; /* ADZERO.l for long word
ADZERO.b[O]; for byte *1
const char l.cdtab[] = {95,
/*
1cd pattern table
const int dectable [) =
6,
59,
47, 102, 109, 125,7, 127, 111,
0
};
3
5
6
8
9 blank * I
10000, 1000, 100, 10 };
char digit [5]; 1* buffer to hold results from cvt_bin_dec function
'*
*/
fifififi##fifi##fifi####fifi#####fi############fi###fifififi#fi###fifi####fifififi########
/* real time interrupt service routine
*'
*1
void real_time_interrupt (void) /* hits every 4.096
InS.
*/
{
TFLG2 = Ox40;
1* clear the interrupt flag *1
)
'*
'*
'*
#######################fi############################fi############fifi
#fifi#######fi#fi##fi######fififififi#fifi#########fi#fifififi#fi##fi####fifififi#########
*'
*'
write_eeprom(OxA5,EEPROM);
write A5h to first byte of EEPROM *1
void write_eeprom(char data, char *address)
PPROG = Ox16;
*address = Oxff;
PPROG = Ox17;
delay() ,
PPROG = OxO;
1* single-byte erase mode "'I
1 * write anything * 1
1* turn on programming voltage * I
1* erase complete *1
I * now program the data * I
PPROG = Ox02;
1* set eelat bit *1
"'address = data;
/* write data * /
PPROG = Ox03;
1* set ee1at and eepgm bits *1
delay() ;
PPROG = 0;
1* read mode */
1* programming complete * /
'*
##fi#################fifi#####fifi#######fi#######fi######fi###############
*'
long lot convert{char polarity)
4-172
Motorola Sensor Device Data
AN1536
int cntr;
I * free running timer system counter '* I
int rO;
/* difference between cntr and input capture
int rl;
/* difference between cntr and input capture
int r2;
1* difference between cntr and input capture
long difference; 1* the difference between the upper and
instrument amplifier outputs
unsigned long int pfs; /* result defined as percent of full scale
the reference voltage '* I
unsigned
unsigned
unsigned
unsigned
unsigned
*'
relative to
*'
if (polarity == 1)
1* set the hc4053 configuration
/* polarity = 1 means + output of sensor */
PORTB &= Oxfe;
else PORTB 1= Oxl;
delay() ,
register *1
2 register */
3 register */
lower
/* is connected to the upper opamp '*1
/* this will allow the hc4053 to stabilize and the cap
to discharge from the previous conversion *1
TFLG1=OX07;
1* clear the input capture flags
*I
cntr=TCNTi
I * get the current count * I
PORTA &= OX7F;
1* turn the fet off *1
while «TFLG1 & OX7) < 7); 1* loop until all three input capture
flags are set * I
rO
TIC1 - cotr;
1* reference voltage *1
1* top side of the inst. amp *1
r1
TIC2 - cotr;
1* lower side of the inst. amp */
r2
TIC3 - cotr;
PORTA 1= oxeo;
1* turn the fet on *1
if (polarity == 1)
difference = ( r1 + 1000 ) - r2;
else difference = ( r2 + 1000 ) - rl;
pfs = (difference * 10000) I rO;
if (difference> 32767) 1* this will cover up the case
where the a to d computes a
negative value * I
pfs=O;
return ( pfs );
atod()
1* computes the aId value in terms of % full scale *1
(
unsigned long int X t Y t z;
X = convert(l);
1* normal *1
y = convert (0) ;
I * reversed * I
z = (x + y»>l
1* 2x difference I 2 *1
return(z);
/* z is percent of full scale */
integrate() I_ returns the aId value in terms of % full scale and computes
offset from calibration values _ I
unsigned long int j;
int i;
j=O;
for (i=O; i<20; ++i)
+=atod() ;
j = (j/20) - ADZERO;
return(j) ;
cala2d()
1* null out the xdcr zero input offset *1
1* returns the average of 50 raw aId conversions this is only
used by the calibration functions
*I
unsigned long int j;
int i;
j=o,
for (i=O; i<50; ++i)
j +=atod();
j=j/50,
return(j) ;
/ * ################################################################### * /
cvt_bin_dec ( unsigned int arg )
char i;
for ( i=O;
< 6; ++i
Motorola Sensor Device Data
4-173
AN1536
diglt[ij
0;
i=O; i
for
1* put blanks in all digit positions ""1
< 4; ++1 )
if (arg
>= dectable [1]
)
{
digit [1] = arg Ideatable [1];
arg = arg- (digit [1] .,., dec table [i));
digit [1] = arg;
}
'*
H##HH##HHH####HH####HHH##HHUHHHHH####HHH##HH##HHH#H#H###HH####H###
*'
delay{)
{
lnt i;
for (1=0; i<1000; +-t·i); 1* delay about 1.5 ms.
'*
@
8 mhz xtal *1
H###HHH#HHHHHHHHH##HHHHH##HH#H#HHHHHHHHHHHH#HHHHH#HH#HHHHHHHHHHH#HH
*'
1* set-up i/o for the single slope aId, initialize the spi port, then
initialize the MC145453 for output ""1
init_io(void)
{
char i;
1* set-up i/o for the aId */
1= aXeD;
1* make pa7 an output *1
1* turn the fat on */
PORTB &= OX7F;
1* set-up the HC4053 in the YO/ZO connect mode *1
TCTL2
OX2A;
1* capture on falling edge for timer capture 0,1.,2 */
PACTL
PORTA 1= oxeD;
I
TFLGl = aX07 i
*
clear any pending capture flags .,., I
1* set-up the ilo for the api subsystem * I
PORTD=Ox2f;
/* set output low before setting the direction register *1
DDRD=Ox38;
1* ss = 1, sck = 1, mosi = 1 * 1
SPCR=Ox51;
1* enable spi, make the cpu the master, E clock 14 *1
1* initialize the led driver *1
for (i=O; i<4; ++i)
1* four bytes of zeros * I
{
write_spi (2);
'*
1* this creates a start bit and data bit 1
for the next write to the me145453 *1
#HHH##HH#HHH#H##HH#H#########H####HH#HH#HH###H#H##HHHHHH###H####HHH
*'
1* this is an attempt at the newton square root method *1
sqrt (unsigned long b)
{
unsigned long xO, xl;
if ( b < 4 ) { b=2; return (b); }
else
xO=4;
x1=10;
while (xO ! = xl)
if ( (x1-xO) ==1 ) break;
x1=xO;
xO=
(b'xO) +xO ) » 1 );
«
b=xO;
return (b);
'*
####H##H##HHH######H###HHHHH#HHH#HH##HHH####H#HH#H###H###H#HHHH# ###
4-174
*'
Motorola Sensor Device Data
AN1536
write()
(
char i;
digit[l]=10,
if (digit [2] ==0)
(digit [2] =10,)
if ( digit[2]==10 &to digit[3]==0
(digit [3] =10,1
for
1=1; 1<5; ++1 )
if (i==4)
write_spit (lcdtab[digit [ill ) +Ox80),
else
write_spi (lcdtab [digit [i]]),
1* this creates a start bit and data bit 1
write_Bpi (2);
for the next write to the mc1454S3
'*
write_Bpi ( char a)
write a character to the api port *1
SPDR=ai
while ( J ( SPSR & OxBD ) ) {}
'*
I
*
'*1
'*
loop until the spif = 1 *1
###################################################################
*'
This function is called at power-up and will determine the operation
of the system. The user must c~lete the system configuration prior
to setting the jumper in the first or last two configurations in the
table or erroneous operation is guaranteed I
test/operation jumper configuration:
J3
J2
J1
1
1
1
1
0
1
1
1
=
jumper removed
display speed in mph
reserved
30 psi xdcr installed
15 psi xdcr installed
full scale calibrate
zero calibrate
display pressure in psi
display speed in mph
*'
setconfig{ )
(
char i;
for { i=O; i<125; H·i }
delay();
1* to let the charge pump come to life wll *1
= PORTC &. Ox07; 1* and off the unused bits *1
if ( i == 7 )
display_speed ( ) ;
i f ( i == 6 )
setup_error();
1* non-valid pattern output -88- on diaplay*1
if ( i == 5 )
{write_eeprom(30,&'XDCRMAX); 1* xdcr is 30 psi *1
display{30) ;
)
if ( i
== 4
{write_eeprom(15,&XDCRMAX); 1* xdcr is lS psi *1
display(15) ;
)
if(i-=3
fullacale_calibrate() ;
if ( i == 2 )
zero_calibrate () 1
if ( i == 1 )
display-pressure ();
else
display_speed() ;
'*
###################################################################
*'
display(char d)
Motorola Sensor Device Data
4-175
AN1536
if (d==30)
(
write_Bpi (0);
write_Bpi (0);
write_spi(47);
write_Bpi (95) ;
/.,. blank the upper digi t * I
/* blank the next to upper digit "'1
/* 3 */
1* 0 *1
)
if (d==lS)
(
write_Bpi (0) ;
write_spi(D);
write_spi(6);
write_Bpi (109) ;
1*
/*
/*
/*
blank the upper digit .,. /
blank the next to upper digit */
1 *1
5 *I
)
write_Bpi (2);
while(l) ;
)
'* ################################################################### */
fullscale_calibrate ()
I
int i;
long int temp;
union bytes average;
temp=O;
average.1
= cala2d(}; I'll get the average of 50 aId conversions */
for ( i=O; i<4; ++i)
write_eeprom(average.b[i) ,EEPROM+i+4);
write_spi(O};
write_spi(l13);
write_spi(l13);
write_spi(113);
write_spi(2) ;
while(l) ;
'*
1'It blank the upper digit *1
1'It P *1
1* F *1
/* F */
###################################################################
*'
zero_calibrate ( )
I
int i;
long int temp;
union bytes average;
temp=O;
average.l = cala2d();
/* get the average of 50 aId conversions */
for ( i=O; i<4; ++i)
write_eeprom(average.b[i] ,EEPROM+i};
write_spieD);
write_spi(95);
write_spi(95};
write_spi(95);
write_spi (2) ;
1* blank the upper digit */
1* 0 */
1*
1*
*1
*1
while(l);
)
'*
###################################################################
1* speed=8. 208 (square root (%full scale*transducer full scale»
display_speed ()
I
long atod_result;
unsigned int j;
while(l)
*'
"'1
{
atod_result = integrate (); 1* read the aId *1
atod_result= ( (atod_result*lOOOO) I (HIATOD-ADZERO) ) * XDCRMAX;
atod_result=sqrt (atod_result);
atod_result= (atod_result"'8208) 110000;
j=atod_result;
4-176
Motorola Sensor Device Data
AN1536
if (j P2. The Pressure (P1) side may be identified by using the example table below:
PRESSURE SENSORS
Case Type
4PIN
Part Number
Positive Pressure (P1)
Side Identifier
MPXxxxxA
344-08
Stainless Steel Cap
MPXxxxxD
344-08
Stainless Steel Cap
MPXxxxxDP
352-02
Side with Part Marking
MPXxxxxAP
350-03
Side with Port Attached
MPXxxxxGP
350-03
Side with Port Attached
MPXxxxxGVP
350-04
Stainless Steel Cap
MPXxxxxAS
371-06
Side with Port Attached
MPXxxxxGS
371-06
Side with Port Attached
MPXxxxxGVS
371-05
Stainless Steel Cap
MPXxxxxASX
371C-02
Side with Port Attached
MPXxxxxGSX
371C-02
Side with Port Attached
MPXxxxxGVSX
371D-02
Stainless Steel Cap
Case Type
6 PIN
Part Number
Positive Pressure (P1)
Side Identifier
MPXxxxxA
867-04
Stainless Steel Cap
MPXxxxxD
867-04
Stainless Steel Cap
MPXxxxxDP
867C-02
Side with Part Marking
MPXxxxxAP
8678-02
Side with Port Attached
MPXxxxxGP
8678-02
Side with Port Attached
MPXxxxxGVP
867D-02
Stainless Steel Cap
MPXxxxxAS
867E-02
Side with Port Attached
MPXxxxxGS
867E-02
Side with Port Attached
MPXxxxxGVS
867A-02
Stainless Steel Cap
MPXxxxxASX
867F-02
Side with Port Attached
MPXxxxxGSX
867F-02
Side with Port Attached
MPXxxxxGVSX
867G-02
Stainless Steel Cap
MPXxxxxGVM
867H-02
Stainless Steel Cap
Motorola Sensor Device Data
Appendices
6-9
APPENDIX 7
Connectors for MPX Pressure Sensors
In some applications connectors are used to interface with the MPX pressure sensor. The following
manufacturer can provide off-the-shelf connectors which interface to both 4-pin and 6-pin pressure
sensor packages.
Manufacturer:
JS Terminal
Mount Prospect, IL
708-803-3300
Housing information:
4-pin
6-pin
SMP-04V-BC
SMP-06V-BC
Pins:
SHF-01T-0.8SS
Crimping tool:
YC12
Appendices
6-10
Motorola Sensor Device Data
APPENDIX 8
Pressure Measurement
What is the difference between an absolute, differential and gauge
pressure sensor?
Absolute Pressure
An absolute pressure sensor is a sensor which measures external pressure relative to a zero
pressure reference sealed inside the cavity of the chip. The output is proportional to the pressure
difference between this reference and pressure applied externally.
Sensor Die
(Cross-Section)
Constraint
Wafer
Sealed Vacuum
Behind Diaphragm
Differential Pressure
A differential pressure sensor is a sensor which is designed to accept simultaneously two
independent pressure sources. The output is proportional to the pressure difference between the two
sources.
PI Pressure
\..
Sensor Die ~
(Cross·Section)
/
'--_---III
c~~\~:nt
Diaphragm
~~~'"'
Gauge Pressure
A gauge pressure sensor is a special case of differential pressure sensor. One side of the sensor
is open to atmosphere.
PI Pressure
j /
\..
Sensor Die
(Cross-Section)
Constraint
Wafer
Motorola Sensor Device Data
1-.....'----,
'--_---I.I .I
Diaphragm
~~~O~._fi
Appendices
6-11
APPENDIX 9
How the X-ducer Works
What is the X-ducer and how does it work?
The X-ducer is a patented single element silicon piezoresistor which constitutes a shear stress strain
gauge when implanted at a critical point on the edge of a thin silicon micromachined diaphragm.
Applying pressure to the diaphragm results in a resistance change in the strain gauge. Unlike the
widely used Wheatstone Bridge which is a network of four closely matched and precisely aligned
resistors, the X-ducer is highly manufacturable, and it produces extremely accurate and repeatable
outputs. The X-ducer optimizes important device characteristics such as linearity and hysteresis.
Since the strain gauge is an integral part of the silicon diaphragm, there are no temperature effects
due to differences in thermal expansion as in other devices. While the output parameters are
temperature dependent, the single element X-ducer greatly simplifies compensation techniques
required when the device is operated over extensive temperature ranges.
Appendices
6-12
Motorola Sensor Device Data
APPENDIX 10
Standard Warranty Clause
Seller warrants that its products sold hereunder will at the time of shipment be free from defects in
material and workmanship, and will conform to Seller's approved specifications. If products are not
as warranted, Seller shall, at its option and as Buyer's exclusive remedy, either refund the purchase
price, or repair, or replace the product, provided proof of purchase and written notice of
nonconformance are received within the applicable periods noted below and provided said
nonconforming products are, with Seller's written authorization, returned in protected shipping
containers FOB Seller's plant within thirty (30) days after expiration of the warranty period unless
otherwise specified herein. If product does not conform to this warranty, Seller will pay for the
reasonable cost of transporting the goods to and from Seller's plant. This warranty shall not apply
to any products Seller determines have been, by Buyer or otherwise, subjected to improper testing,
or have been the subject of mishandling or misuse.
THIS WARRANTY EXTENDS TO BUYER ONLY AND MAY BE INVOKED BY BUYER ONLY FOR
ITS CUSTOMERS. SELLER WILL NOT ACCEPT WARRANTY RETURNS DIRECTLY FROM
BUYER'S CUSTOMERS OR USERS OF BUYER'S PRODUCTS. THIS WARRANTY IS IN LIEU
OF ALL OTHER WARRANTIES WHETHER EXPRESS, IMPLIED OR STATUTORY INCLUDING
IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Seller's warranty shall not be enlarged, and no obligation or liability shall arise out of Seller's
rendering of technical advice and/or assistance.
A. Time periods, products, exceptions and other restrictions applicable to the above warranty are:
(1) Unless otherwise stated herein, products are warranted for a period of one (1) year from date
of shipment.
(2) Device ChipslWafers. Seller warrants that device chips or wafers have, at shipment, been
subjected to electrical tesUprobe and visual inspection. Warranty shall apply to products
returned to Seller within ninety (90) days from date of shipment. This warranty shall not apply
to any chips or wafers improperly removed from their original shipping container and/or
subjected to testing or operational procedures not approved by Seller in writing.
B. Development products and Licensed Programs are licensed on an "AS IS" basis. IN NO EVENT
SHALL SELLER BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES.
Motorola Sensor Device Data
Appendices
6-13
Appendices
6-14
Motorola Sensor Device Data
Section Seven
,
~.-""~.~
;'
·4;~.
.,
.
'
,
~'.~:~"'::'''.l'''
:.
,'f\..
Glossary and Symbols
Glossary of Terms ........................... 7-2
Symbols, Terms and Definitions ............. 7-5
Motorola Sensor Device Data
Glossary and Symbols
7-1
Glossary of Terms
Absolute Pressure Sensor
A sensor which measures input pressure in relation to a zero pressure (a total vacuum on one side of
the diaphragm) reference.
Analog Output
An elee!rical output from a sensor that changes proportionately with any change in input pressure.
Accuracy - also see
Pressure Error
A comparison olthe actual output signal of a device to the true value olthe input pressure. The various
errors (such as linearity, hysteresis, repeatability and temperature shift) attributing to the accuracy of
a device are usually expressed as a percent of full scale output (FSO).
Altimetrlc Pressure
Trensducer
A barometric pressure transducer used to determine altitude from the pressure-altitude profile.
Barometric Pressure
Transducer
An absolute pressure sensor that measures the local ambient atmospheric pressure.
Burst Pressure
The maximum pressure that can be applied to a transducer without rupture of either the sensing element or transducer case.
Calibration
A process of modifying sensor output to improve output accuracy.
Chip
A die (unpackaged semicondue!or device) cut from a silicon wafer, incorporating semiconductor circuit elements such as resistors, diodes, transistors, and/or capacitors.
Compensation
Added circuitry or materials designed to counteract known sources of error.
Diaphragm
The membrane of material that remains after etching a cavity into the silicon sensing chip. Changes
in input pressure cause the diaphragm to deflee!.
Differential Pressure Sensor
A sensor which is designed to accept simultaneously two independent pressure sources. The output
is proportional to the pressure difference between the two sources.
Diffusion
A thermochemical process whereby controlled impurities are introduced into the silicon to define the
piezoresistor. Compared to ion implantation, it has two major disadvantages: 1) the maximum impurity concentration occurs at the surface of the silicon rendering it subject to surface contamination,
and making it nearly impossible to produce buried piezoresistors; 2) control over impurity concentrations and levels is about one thousand times poorer than obtained with ion implantation.
Drift
An undesired change in output over a period of time, with constant input pressure applied.
End Point Straight Line Fit
Motorola's method of defining linearity. The maximum deviation of any data point on a sensor output
curve from a straight line drawn between the end data points on that output curve.
Error
The algebraic difference between the indicated value and the true value of the input pressure.
Usually expressed in percent offull scale span, sometimes expressed in percentofthe sensor output
reading.
Error Band
The band of maximum deviations of the output values from a specified reference line or curve due
to those causes attributable to the sensor. Usually expressed as "± % of full scale output." The
error band should be specified as applicable over at least two calibration cycles, so as to include
repeatability, and verified accordingly.
Excitation Voltage (Current)see Supply Voltage (Current)
The external elee!rical voltage and/or current applied to a sensor for its proper operation (often referred
to as the supply circuit or voltage). Motorola specifies constant voltage operation only.
Full Scale Output
The output at full scale pressure at a specified supply voltage. This signal is the sum of the offset signal
plus the full scale span.
Full Scale Span
The change in output over the operating pressure range at a specified supply voltage. The SPAN of
a device is the output voltage variation given between zero differential pressure and any given
pressure. FULL SCALE SPAN is the output variation between zero differential pressure and when the
maximum recommended operating pressure is applied.
Hysteresis - also see Pressure
Hysteresis and Temperature
Hysteresis
HYSTERESIS refers to a transducer'S ability to reproduce the same output for the same input,
regardless of whether the input is increasing or decreasing. PRESSURE HYSTERESIS is measured
at a constant temperature while TEMPERATURE HYSTERESIS is measured at a constant pressure
in the operating pressure range.
Glossary and Symbols
7-2
Motorola Sensor Device Data
Glossary of Terms (continued)
Input Impedance (Resistance)
The impedance (resistance) measured between the positive and negative (ground) inputterminals
at a specified frequency with the output terminals open. For Motorola X-ducer, this is a resistance
measurement only.
Ion Implantation
A process whereby impurity ions are accelerated to a specific energy level and impinged upon the
silicon wafer. The energy level determines the depth to which the impurity ions penetrate the silicon.
Impingement time determines the impurity concentration. Thus, it is possible to independently
control these parameters, and buried piezoresistors are easily produced. Ion implantation is
increasingly used throughout the semiconductor industry to provide a variety of products with
improved performance over those produced by diffusion.
Laser Trimming (Automated)
A method for adjusting the value of thin film resistors using a computer-controlled laser system.
Leakage Rate
The rate at which a fluid is permitted or determined to leak through a seal. The type of fluid, the
differential pressure across the seal, the direction of leakage, and the location of the seal must be
specified.
Linearity Error
The maximum deviation of the output from a straight line relationship with pressure over the
operating pressure range, the type of straight line relationship (end point, least square
approximation, etc.) should be specified.
Load Impedance
The impedance presented to the output terminals of a sensor by the associated external circuitry.
Null
The condition when the pressure on each side of the sensing diaphragm is equal.
Null Offset
The electrical output present, when the pressure sensor is at null.
Null Temperature Shift
The change in null output value due to a change in temperature.
Null Output
See ZERO PRESSURE OFFSET
Offset
See ZERO PRESSURE OFFSET
Operating Pressure Range
The range of pressures between minimum and maximum pressures at which the output will meet
the specified operating characteristics.
Operating Temperature Range
The range of temperature between minimum and maximum temperature at which the output will
meet the specified operating characteristics.
Output Impedance
The impedance measured between the positive and negative (ground) output terminals at a specified frequency with the input open.
Overpressu re
The maximum specified pressure which may be applied to the sensing element of a sensor without
causing a permanent change in the output characteristics.
Plezoreslstance
A resistive element that changes resistance relative to the applied stress it experiences (e.g., strain
gauge).
Pressure Error
The maximum difference between the true pressure and the pressure inferred from the output for
any pressure in the operating pressure range.
Pressure Hysteresis
The difference in the output at any given pressure in the operating pressure range when this
pressure is approached from the minimum operating pressure and when approached from the
maximum operating pressure at room temperature.
Pressure Range - also see
Operating Pressure Range
The pressure limits over which the pressure sensor is calibrated or specified.
Pressure Sensor
A device that converts an input pressure into an electrical output.
Proof Pressure
See OVERPRESSURE
Ratlometrlc
Ratiometricity refers to the ability of the transducer to maintain a constant sensitivity, at a constant
pressure, over a range of supply voltage values.
Ratlometrlc
(Ratlometrlclty Error)
At a given supply voltage, sensor output is a proportion of that supply voltage. Ratiometricity error
is the change in this proportion resulting from any change to the supply voltage. Usually expressed
as a percent of full scale output.
Motorola Sensor Device Data
Glossary and Symbols
7-3
Glossary of Terms (continued)
Range
See OPERATING PRESSURE RANGE
Repeatability
The maximum change in output under fixed operating cond~ions over a specified period of time.
Resolution
The maximum change in pressure required to give a specified change in the output.
Response Time
The time required for the incremental change in the output to go from 10% to 90% of its final value
when subjected to a specified step change in pressure.
Room Conditions
Ambient environmental conditions under which sensors most commonly operate.
Sensing Element
That part of a sensor which responds directly to changes in input pressure.
Sensitivity
The change in output per unit change in pressure for a specified supply voltage or current.
Sensitivity Shift
A change in sensitivity resulting from an environmental change such as temperature.
Stability
The maximum difference in the output at any pressure in the operating pressure range when this
pressure is applied consecutively under the same conditions and from the same direction.
Storage Temperature Range
The range of temperature between minimum and maximum which can be applied without causing
the sensor to fail to meet the specified operating characteristics.
Strain Gauge
A sensing device providing a change in electrical resistance proportional to the level of applied
stress.
Supply Voltage (Current)
The voltage (current) applied to the positive and negative (ground) input terminals.
Temperature Coefficient of
Full Scale Span
The percent change in full scale span per unit change in temperature relative to the full scale span
at a specified temperature.
Temperature Coefficient of
Resistance
The percent change in the DC input impedance per unit change in temperature relative to the DC
input impedance at a specified temperature.
Temperature Error
The maximum change in output at any pressure in the operating pressure range when the temperature is changed over a specified temperature range.
Temperature Hysteresis
The difference in output at any temperature in the operating temperature range when the temperature is approached from the minimum operating temperature and when approached from the
maximum operating temperature with zero pressure applied.
Thermal Offset Shift
See TEMPERATURE COEFFICIENT OF OFFSET
Thermal Span Shift
See TEMPERATURE COEFFICIENT OF FULL SCALE SPAN
Thermal Zero Shift
See TEMPERATURE COEFFICIENT OF OFFSET
Thin Film
A technology using vacuum deposition of conductors and dielectric materials onto a substrate
(frequently silicon) to form an electrical circuit.
Vacuum
A perfect vacuum is the absence of gaseous fluid.
Zero Pressure Offset
The output at zero pressure (absolute or differential, depending on the device type) for a specified supply voltage or current.
Glossary and Symbols
7-4
Motorola Sensor Device Data
Symbols, Terms and Definitions
The following are the most commonly used letter symbols, terms and definitions associated with solid state silicon pressure
sensors.
Pburst
Burst Pressure
The maximum pressure that can be applied to a transducerwilhout ruptureof either the sensing
element or transducer case.
10
supply current
The current drawn by the sensor from the voltage source.
10+
output source current
The current sourcing capability of the pressure sensor.
kPa
kilopascals
Unit of pressure. 1 kPa = 0.145038 PSI.
Linearity
The maximum deviation of the output from a straight line relationship with pressure over the
operaling pressure range, the type of straighl line relationship (end point. least square
approximation, etc.) should be specilied.
mmHg
millimeters of mercury
Unit of pressure. 1 mmHg = 0.0193368 PSI.
Pm ax
overpressure
The maximum specified pressure which may be applied to the sensing element without
causing a permanent change in the oulput characteristics.
POP
operating pressure range
The range of pressures between minimum and maximum temperature at which the output
will meet the specified operating characteristics.
Pressure Hysteresis
The difference in the output at any given pressure in the operating pressure range when
this pressure is approached from the minimum operating pressure and when approached
from the maximum operating pressure at room temperature.
pounds per square inch
Unit of pressure. 1 PSI = 6.89473 kPa.
Repeatability
The maximum change in oulput under fixed operating conditions over a specified period of
time.
input resistance
The resistance measured between the positive and negative input terminals at a specified
frequency with the output terminals open.
TA
operating temperature
The temperature range over which the device may safely operate.
TCR
temperature coefficient
of resistance
The percent change in the DC input impedance per unit change in temperature relative to the
DC input impedance at a specified temperature (typically +25°C).
temperature coeffioient
of full scale span
The percent change in full scale span per unit change in temperature relative to the full scale
span at a specified temperature (typically +25°C).
TCVott
temperature coefficient
of offset
The percent change in offset per unit change in temperature relative to the offset at a specified temperature (typically +25°C).
Tstg
storage temperature
The temperature range at which the device, without any power applied, may be stored.
tR
response time
The time required for the incremental change in the output to go from 10% to 90% of its
final value when subjected to a specified step change in pressure.
Temperature Hysteresis
The difference in output at any temperature in the operating temperature range when the
temperature is approached from the minimum operating temperature and when approached
from the maximum operating temperature with zero pressure applied.
PSI
Ro
VFSS
full scale span voltage
The change in output over the operating pressure range at a specified supply voltage.
VOff
offset voltage
The output with zero differential pressure applied for a specified supply voltage or current.
Vs
supply voltage de
The dc excitation voltage applied to the sensor. For precise circuit operation, a regulated
supply should be used.
VS max
maximum supply voltage
The maximum supply voltage that may be applied to a circuit or connected to the sensor.
Zin
input impedance
The resistance measured between the positive and negative input terminals at a specified
frequency with the outputterminals open. For Motorola X-ducer, this is a resistance measurementonly.
Zout
output impedance
The resistance measured between the positive and negative output terminals at a specified frequency with the input terminals open.
I1V/I1P
sensitivity
The change in output per unit change in pressure for a specified supply voltage.
Motorola Sensor Device Data
Glossary and Symbols
7-5
Glossary and Symbols
7-6
Motorola Sensor Device Data
Section Eight
Device Sample Kits
Sensor Sample Kit Information .............. 8-2
Sensor Sample Kit Order Form .............. 8-3
Motorola Sensor Device Data
Device Sample Kits
8-1
Sensor Sample Kits
Order No.
Pressu re Range
Description
Cost
KITNOK29/D
1.5 PSI
One MPX201 ODP, Temperature Compensated,
Dual Ported Sensor with Spec Sheet and Literature.
FREE
KITNOK321D
100PSI
One MPX700DP, Uncompensated, Dual Ported Sensor
with Spec Sheet and Literature.
FREE
KITMPX5100ND
15PSI
One MPX51 OOAP, Absolute, Signal Conditioned,
Single Ported Sensor with Spec Sheet and Literature.
$25
KITMPX5100D/D
15PSI
One MPX51 OODP, Differential, Signal Conditioned,
Dual Ported Sensor with Spec Sheet and Literature.
$25
KITMPX7100D/D
15PSI
One MPX7100DP, Differential, High Impedance Dual
Ported Sensor with Spec Sheet and Literature.
FREE
KITMPX7200D/D
30 PSI
One MPX7200DP, Differential, High Impedance Dual
Ported Sensor with Spec Sheet and Literature.
FREE
Device Sample Kits
8-2
Motorola Sensor Device Data
Sensor Sample Kits Order Form
Availability
Price
KITNOK29/D
Kit Number
MPX2010DP Sample Kit
Now
Free
KITNOK32/D
MPX700DP Sample Kit
Now
Free
KITMPX5100ND
MPX5100AP Sample Kit
Now
$25.00
KITMPX5100D/D
MPX51 OODP Sample Kit
Now
$25.00
KITMPX7100D/D
MPX71 OODP Sample Kit
Now
FREE
KITMPX7200D/D
MPX7200DP Sample Kit
Now
FREE
Kit Title
Qty
Amount
SUBTOTAL
$
POSTAGE AND HANDLING
$
GRAND TOTAL
$
Postage and Handling:
United States - Surface
Air
DHL World Mail- Air
$5.00
$7.50
$20.00
Prices are sublecllo change. Documents Will be sent best way surface unless specified for air delivery. Allow 2 to 3 weeks for delivery.
Motorola offers three convenient ways to order these kits, check or money order, purchase orders if credit line has previously been established, and
credit card (Master Card, Visa and American Express).
CreditCard# _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Exp. Date _ _ _ _ _ _ _ _ _ _ _ __
NAME
PHONE ________________________
COMPANY
TITLE _ _ _ _ _ _ _ _ _ _ _ __
ADDRESS _______________________________________________________________________
CITY _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ STATE ________ ZIP _____________
Mail with remittance to:
MOTOROLA SEMICONDUCTOR PRODUCTS INC.
P.O. Box 20912
Phoenix, Arizona, U.S.A. 85036-0924
For immediate service call:
(800) 441-2447
Fax: (602) 994-6430
Motorola Sensor Device Data
Device Sample Kits
8-3
Device Sample Kits
8-4
Motorola Sensor Device Data
Section Nine
Index and
Cross-Reference
Pressure Range Index . ...................... 9-2
Device Index . ................................ 9-4
Motorola Sensor Device Data
Index and Cross Reference
9-1
Pressure Range Index
Pressure
Range
(kPa/ psi)
Device
Product Type
PRESSURE SENSORS
6/0.9
MPX906D
Uncompensated
6/0.9
MPX906GVW
Uncompensated
Page
Number
2-22
2-22
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
MPX10D
MPX10DP
MPX10GP
MPX10GVP
MPX10GS
MPX10GVS
MPX10GSX
MPX10GVSX
MPX12D
MPX12DP
MPX12GP
MPX12GVP
MPX12GS
MPX12GVS
MPX12GSX
MPX12GVSX
MPX2010D
MPX2010DP
MPX2010GP
MPX2010GVP
MPX2010GS
MPX2010GVS
MPX2010GSX
MPX2010GVSX
MPX2012D
MPX2012DP
MPX2012GP
MPX2012GVP
MPX2012GS
MPX2012GVS
MPX2012GSX
MPX2012GVSX
MPX5010D
MPX5010DP
MPX5010GP
MPX5010GVP
MPX5010GS
MPX5010GVS
MPX5010GSX
MPX5010GVSX
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
2-2
2-2
2-2
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-63
2-63
2-63
2-63
2-63
2-63
2-63
2-63
40/6
MPX2300DTt
Temperature Compensated/Calibrated
2-42
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
50/7.25
50/7.25
50/7.25
50/7.25
5017.25
50/7.25
5017.25
5017.25
MPX50D
MPX50DP
MPX50GP
MPX50GVP
MPX50GS
MPX50GVS
MPX50GSX
MPX50GVSX
MPX2050D
MPX2050DP
MPX2050GP
MPX2050GVP
MPX2050GS
MPX2050GVS
MPX2050GSX
MPX2050GVSX
MPX2052D
MPX2052DP
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-6
2-6
2-6
2-6
2-6
2-6
2-6
2-6
2-30
2-30
2-30
2-30
2-30
2-30
2-30
2-30
2-30
2-30
Index and Cross Reference
9-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
Pressure
Range
(kPa/ psi)
Device
Product Type
50/7.25
5017.25
50/7.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
5017.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
5017.25
50/7.25
5017.25
MPX2052GP
MPX2052GVP
MPX2052GS
MPX2052GVS
MPX2052GSX
MPX2052GVSX
MPX5050D
MPX5050DP
MPX5050GP
MPX5050GVP
MPX5050GS
MPX5050GVS
MPX5050GSX
MPX5050GVSX
MPX7050D
MPX7050DP
MPX7050GP
MPX7050GVP
MPX7050GS
MPX7050GVS
MPX7050GSX
MPX7050GVSX
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
2-30
2-30
2-30
2-30
2-30
2-30
2-66
2-66
2-66
2-66
2-66
2-66
2-66
2-66
2-66
2-66
2-66
2-86
2-86
2-86
2-86
2-86
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
MPX100A
MPX100AP
MPX100AS
MPX100ASX
MPX100D
MPX100DP
MPX100GP
MPX100GVP
MPX100GS
MPX100GVS
MPX100GSX
MPX100GVSX
MPX2100A
MPX2100AP
MPX2100AS
MPX2100ASX
MPX2100D
MPX2100DP
MPX2100GP
MPX2100GVP
MPX2100GS
MPX2100GVS
MPX2100GSX
MPX2100GVSX
MPX5100A
MPX5100AP
MPX5100AS
MPX5100ASX
MPX5100D
MPX5100DP
MPX5100GP
MPX5100GVP
MPX5100GS
MPX5100GVS
MPX5100GSX
MPX5100GVSX
MPX7100A
MPX7100AP
MPX7100AS
MPX7100ASX
MPX7100D
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-90
2-90
2-90
2-90
2-90
Page
Number
Motorola Sensor Device Data
Pressure Range Index (continued)
Pressure
Range
(kPa I psi)
Device
Product Type
Page
Number
PRESSURE SENSORS (continued)
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
MPX7100DP
MPX7100GP
MPX7100GVP
MPX7100GS
MPX7100GVS
MPX7100GSX
MPX7100GVSX
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
2-90
2-90
2-90
2-90
2-90
2-90
2-90
102/15.3
102/15.3
102/15.3
102/15.3
MPX4101A
MPX4101AP
MPX4101AS
MPX4101ASX
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
2-48
2-48
2-48
2-48
105/15.5
105/15.5
105/15.5
105/15.5
MPX4100A
MPX4100AP
MPX4100AS
MPX4100ASX
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
2-48
2-48
2-48
2-48
115/17
115/17
115/17
115/17
MPX4115A
MPX4115AP
MPX4115AS
MPX4115ASX
Barometeric Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
2-55
2-55
2-55
2-55
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
MPX200A
MPX200AP
MPX200AS
MPX200ASX
MPX200D
MPX200DP
MPX200GP
MPX200GVP
MPX200GS
MPX200GVS
MPX200GSX
MPX200GVSX
MPX2200A
MPX2200AP
MPX2200AS
MPX2200ASX
MPX2200D
MPX2200DP
MPX2200GP
MPX2200GVP
MPX2200GS
MPX2200GVS
MPX2200GSX
MPX2200GVSX
MPX7200A
MPX7200AP
MPX7200AS
MPX7200ASX
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature CompensatedlCalibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
High Impedance
High Impedance
High Impedance
High Impedance
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-38
2-38
2-38
2-38
2-38
2-38
2-38
2-38
2-38
2-38
2-38
2-38
2-94
2-94
2-94
2-94
Motorola Sensor Device Data
Pressure
Range
(kPa I psi)
Device
Product Type
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
MPX7200D
MPX7200DP
MPX7200GP
MPX7200GVP
MPX7200GS
MPX7200GVS
MPX7200GSX
MPX7200GVSX
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
2-94
2-94
2-94
2-94
2-94
2-94
2-94
2-94
250/35
250/35
250/35
250/35
MPX4250A
MPX4250AP
MPX4250AS
MPX4250ASX
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
2-59
2-59
2-59
2-59
500175
500175
500175
500/75
500175
500175
500175
500175
MPX5500D
MPX5500DP
MPX5500GP
MPX5500GVP
MPX5500GS
MPX5500GVS
MPX5500GSX
MPX5500GVSX
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
2-77
2-77
2-77
2-77
2-77
2-77
2-77
2-77
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
700/100
MPX700A
MPX700AP
MPX700AS
MPX700ASX
MPX700D
MPX700DP
MPX700GP
MPX700GVP
MPX700GS
MPX700GVS
MPX700GSX
MPX700GVSX
MPX2700D
MPX2700DP
MPX2700GP
MPX2700GVP
MPX2700GS
MPX2700GVS
MPX2700GSX
MPX2700GVSX
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GVP
MPX5700GS
MPX5700GVS
MPX5700GSX
MPX5700GVSX
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Temperature Compensated/Calibrated
Temperature CompensatedlCalibrated
Temperature CompensatedlCalibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature CompensatedlCalibrated
Temperature CompensatedlCalibrated
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
2-18
2-18
2-18
2-18
2-18
2-18
2-18
2-18
2-18
2-18
2-18
2-18
2-44
2-44
2-44
2-44
2-44
2-44
2-44
2-44
2-80
2-80
2-80
2-80
2-80
2-80
2-80
2-80
1000/150
MPX5999D
Signal Conditioned
2-83
Page
Number
Index and Cross Reference
9-3
Device Index
Device
Pressure
Range
(kPa/psl)
PRESSURE
MPX100A
MPX100AP
MPX100AS
MPX100ASX
MPX100D
MPX100DP
MPX100GP
MPX100GS
MPX100GSX
MPX100GVP
SENSORS
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
100/14.5 Uncompensated
Product Type
Page
Number
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
2-10
Device
Pressure
Range
(kPal psi)
Product Type
Page
Number
MPX2050GSX
MPX2050GVP
MPX2050GVS
MPX2050GVSX
MPX2052D
MPX2052DP
MPX2052GP
MPX2052GS
MPX2052GSX
MPX2052GVP
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
50/7.25
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-30
2-30
2-30
2-30
2-30
2-30
2-30
2-30
2-30
2-30
MPX2052GVS
MPX2052GVSX
MPX2100A
MPX2100AP
MPX2100AS
MPX2100ASX
MPX2100D
MPX2100DP
MPX2100GP
MPX2100GS
50/7.25
50/7.25
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-30
2-30
2-34
2-34
2-34
2-34
2-34
2-34
2-34
2-34
MPX2100GSX
MPX2100GVP
MPX2100GVS
MPX2100GVSX
MPX2200A
MPX2200AP
MPX2200AS
MPX2200ASX
MPX2200D
MPX2200DP
100/14.5
100/14.5
100/14.5
100/14.5
200/29
200/29
200/29
200/29
200/29
200/29
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-34
2-34
2-34
2-34
2-38
2-38
2-38
2-38
2-38
2-38
MPX100GVS
MPX100GVSX
MPX10D
MPX10DP
MPX10GP
MPX10GS
MPX10GSX
MPX10GVP
MPX10GVS
MPX10GVSX
100/14.5
100/14.5
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
2-10
2-10
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
MPX12D
MPX12DP
MPX12GP
MPX12GS
MPX12GSX
MPX12GVP
MPX12GVS
MPX12GVSX
MPX200A
MPX200AP
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
200/29
200/29
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-2
2-14
2-14
MPX200AS
MPX200ASX
MPX200D
MPX200DP
MPX200GP
MPX200GS
MPX200GSX
MPX200GVP
MPX200GVS
MPX200GVSX
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
2-14
MPX2200GP
MPX2200GS
MPX2200GSX
MPX2200GVP
MPX2200GVS
MPX2200GVSX
MPX2300DT1
MPX2700D
MPX2700DP
MPX2700GP
200/29
200/29
200/29
200/29
200/29
200/29
40/6
700/100
700/100
700/100
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-38
2-38
2-38
2-38
2-38
2-38
2-42
2-44
2-44
2-44
MPX2010D
MPX2010DP
MPX2010GP
MPX2010GS
MPX2010GSX
MPX2010GVP
MPX2010GVS
MPX2010GVSX
MPX2012D
MPX2012DP
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
10/1.45
1011.45
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
2-26
MPX2700GS
MPX2700GSX
MPX2700GVP
MPX2700GVS
MPX2700GVSX
MPX4100A
MPX4100AP
MPX4100AS
MPX4100ASX
MPX4101A
700/100 Temperature Compensated/Calibrated
700/100 Temperature Compensated/Calibrated
700/100 Temperature Compensated/Calibrated
700/100 Temperature Compensated/Calibrated
700/100 Temperature Compensated/Calibrated
105/15.5 Manifold Absolute Pressure Sensor
105/15.5 Manifold Absolute Pressure Sensor
105/15.5 Manifold Absolute Pressure Sensor
105/15.5 Manifold Absolute Pressure Sensor
102/15.3 Manifold Absolute Pressure Sensor
2-44
2-44
2-44
2-44
2-44
2-48
2-48
2-48
2-48
2-48
MPX2012GP
MPX2012GS
MPX2012GSX
MPX2012GVP
MPX2012GVS
MPX2012GVSX
MPX2050D
MPX2050DP
MPX2050GP
MPX2050GS
10/1.45
10/1.45
10/1.45
10/1.45
1011.45
10/1.45
50/7.25
50/7.25
5017.25
5017.25
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
Temperature Compensated/Calibrated
2-26
2-26
2-26
2-26
2-26
2-26
2-30
2-30
2-30
2-30
MPX4101AP
MPX4101AS
MPX4101ASX
MPX4115A
MPX4115AP
MPX4115AS
MPX4115ASX
MPX4250A
MPX4250AP
MPX4250AS
102/15.3
102/15.3
102/15.3
115/17
115/17
115/17
115/17
250/35
250/35
250/35
2-48
2-48
2-48
2-55
2-55
2-55
2-55
2-59
2-59
2-59
Index and Cross Reference
9-4
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
Manifold Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
Barometeric Absolute Pressure Sensor
Signal Conditioned
Signal Conditioned
Signal Conditioned
Motorola Sensor Device Data
Device Index (continued)
Device
Pressure
Range
(kPal psi)
PRESSURE
MPX4250ASX
MPX5010D
MPX5010DP
MPX5010GP
MPX5010GS
MPX5010GSX
MPX5010GVP
MPX5010GVS
MPX5010GVSX
MPX5050D
SENSORS (continued)
250/35
Signal Condilioned
10/1.45
Signal Conditioned
Signal Conditioned
10/1.45
10/1.45
Signal Conditioned
10/1.45
Signal Conditioned
Signal Conditioned
10/1.45
10/1.45
Signal Conditioned
10/1.45
Signal Conditioned
10/1.45
Signal Conditioned
5017.25
Signal-Condilioned
2-59
2-63
2-63
2-63
2-63
2-63
2-63
2-63
2-63
2-66
Product Type
Page
Number
MPX5050DP
MPX5050GP
MPX5050GS
MPX5050GSX
MPX5050GVP
MPX5050GVS
MPX5050GVSX
MPX50D
MPX50DP
MPX50GP
5017.25
5017.25
50/7.25
50/7.25
50/7.25
50/7.25
5017.25
50/7.25
50/7.25
50/7.25
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Uncompensated
Uncompensated
Uncompensated
2-66
2-66
2-66
2-66
2-66
2-66
2-66
2-6
2-6
2-6
MPX50GS
MPX50GSX
MPX50GVP
MPX50GVS
MPX50GVSX
MPX5100A
MPX5100AP
MPX5100AS
MPX5100ASX
MPX5100D
50/7.25
5017.25
50/7.25
50/7.25
50/7.25
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
2-6
2-6
2-6
2-6
2-6
2-71
2-71
2-71
2-71
2-71
MPX5100DP
MPX5100GP
MPX5100GS
MPX5100GSX
MPX5100GVP
MPX5100GVS
MPX5100GVSX
MPX5500D
MPX5500DP
MPX5500GP
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
500/75
500/75
500175
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal-Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
2-71
2-71
2-71
2-71
2-71
2-71
2-71
2-77
2-77
2-77
MPX5500GS
MPX5500GSX
MPX5500GVP
MPX5500GVS
MPX5500GVSX
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GS
MPX5700GSX
500175
500175
500/75
500/75
500175
700/100
700/100
700/100
700/100
700/100
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
2-77
2-77
2-77
2-77
2-77
2-80
2-80
2-80
2-80
2-80
MPX5700GVP
MPX5700GVS
MPX5700GVSX
MPX5999D
MPX700A
MPX700AP
MPX700AS
MPX700ASX
MPX700D
MPX700DP
700/100
700/100
700/100
1000/150
700/100
700 1100
700 1100
700/100
700 1100
700/100
Signal Conditioned
Signal Conditioned
Signal Conditioned
Signal Conditioned
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
2-80
2-80
2-80
2-83
2-18
2-18
2-18
2-18
2-18
2-18
Motorola Sensor Device Data
Pressure
Range
(kPal psi)
Device
Product Type
Page
Number
MPX700GP
MPX700GS
MPX700GSX
MPX700GVP
MPX700GVS
MPX700GVSX
MPX7050D
MPX7050DP
MPX7050GP
MPX7050GS
700/100
700/100
700/100
700/100
700/100
700/100
50/7.25
50/7.25
5017.25
50/7.25
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
Uncompensated
High Impedance
High Impedance
High Impedance
High Impedance
2-18
2-18
2-18
2-18
2-18
2-18
2-86
2-86
2-86
2-86
MPX7050GSX
MPX7050GVP
MPX7050GVS
MPX7050GVSX
MPX7100A
MPX7100AP
MPX7100AS
MPX7100ASX
MPX7100D
MPX7100DP
50/7.25
50/7.25
5017.25
5017.25
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
2-86
2-86
2-86
2-86
2-90
2-90
2-90
2-90
2-90
2-90
MPX7100GP
MPX7100GS
MPX7100GSX
MPX7100GVP
MPX7100GVS
MPX7100GVSX
MPX7200A
MPX7200AP
MPX7200AS
MPX7200ASX
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
100/14.5
200/29
200/29
200/29
200/29
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
2-90
2-90
2-90
2-90
2-90
2-90
2-94
2-94
2-94
2-94
MPX7200D
MPX7200DP
MPX7200GP
MPX7200GS
MPX7200GSX
MPX7200GVP
MPX7200GVS
MPX7200GVSX
MPX906D
MPX906GVW
200/29
200/29
200/29
200/29
200/29
200/29
200/29
200/29
6/0.9
6/0.9
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
Uncompensated
Uncompensated
2-94
2-94
2-94
2-94
2-94
2-94
2-94
2-94
2-22
2-22
TEMPERATURE SENSORS
Device
!J.
(Max)
MTS102
MTS105
3.0
7.0
Product Type
Temperature Sensor
Temperature Sensor
Page
Number
2-98
2-98
ACCELEROMETERS
Device
Acceleration
Range (G) Product Type
XMMAS40Gl0D
XMMAS40Gl0S
XMMAS250G 1aD
XMMAS250G lOS
XMMAS500Gl0D
XMMAS500Gl0S
40g
40g
250 g
250 g
500 g
500 g
Accelerometer
Acoelerometer
Accelerometer
Accelerometer
Accelerometer
Accelerometer
Page
Number
2-t02
2-102
2-105
2-105
2-108
2-108
Index and Cross Reference
9-5
Index and Cross Reference
9-6
Motorola Sensor Device Data
Section Ten
Distributors and
Sales Offices
Motorola Sensor Device Data
Distributors and Sales Offices
10-1
3/1/95
MOTOROLA DISTRIBUTOR AND WORLDWIDE SALES OFFICES
AUTHORIZED NORTH AMERICAN DISTRIBUTORS
Woodland Hills
UNITED STATES
Hamilton Hallmark ...........• (818)594-0404
Richardson Electronics
(615)594-5600
ALABAMA
Huntsville
Arrow/Schweber Electronics
(205)837-6955
Future Electronics. . . . • . • . . . .. (205)830-2322
HamiHon Hallmark ......•..... (205)837-8700
Newark. . . . . • . . . . . . . • . • . . . •. (205)837-9091
Time Electronics ...•...•.... 1-800-789-TIME
Wyle Laboratories ....•.•..... (205)830-1119
ARIZONA
Phoenix
Future Electronics. . . . . . • . . . .. (602)968-7140
Hamilton Hallmark ..•...•...... (602)437-1200
Wyle Laboratories. . . . . . • . . . .. (602)437-2088
Tempe
Arrow/Schweber Electrmics .... (602)431-0030
Newark .....•.........•.. . •. (602)966-6340
Time Electronics ....••.•.••• 1-800-789-TIME
CALIFORNIA
Agoura Hills
Time Electronics Corporate .... 1-800-789-TIME
COLORADO
Lakewood
Future Electronics. . . . . . . . . . •. (303)232-2008
Denver
Newark. . • . . . . . . . . . • . . . • . • •. (303)757-3351
Englewood
ArrowlSchweber Electronics
(303)799-0258
Hamilton Hallmark •.......... (303)790-1662
Time Electronics •••••.....•. 1-800-789-TIME
Thornton
Wyle Laboratories. . . . . . . . . . .. (303)457-9953
CONNECTICUT
Bloomfield
Newark ....•.......•••.•.... (203)243-1731
Cheslre
Future Electronics. . • • . • • • • . .. (203)250-0083
Hamilton Hallmark ..•••.•.... (203)271-2844
Belmont
Southbury
Calabassas
Walllngfort
Richardson Electronics .•...•. (415)592-9225
ArrowlSchweber Electronics .... (818)880-9686
Wyle Laboratories ....•....... (818)880-9000
Chatsworth
Future Electronics ............ (818)865-0040
Time Electronics ............ 1-800-789-TIME
Costa Mesa
Hamilton Hallmark ............ (714)641-4100
Culver City
Hamilton I-fallmark . . . . . . . . . . .. (213)558-2000
Garden Grove
Newark ..................... (714-893-4909
Irvine
ArrowlSchweber Electronics ...
Future Electronics .......•....
Wyle Laboratories Corporate. . ..
Wyle Laboratories. . . . . . . . . . ..
(714)587-0404
(714)250-4141
(714)753-9953
(714)863-9953
Los Angeles
Wyle Laboratories . . . . . . . . . . .. (818)880-9000
Mountain View
Richardson Electronics .....•. (415)960-6900
Orange
Newark ...............•..... (714)634-8224
Palo Alto
Newark .•................... (415)812-6300
Rocklin
Hamilton Hallmark ........... (916)624-9781
Sacramento
Newark ..................... (916)721-1633
Wyle Laboratories. . • . • . . • • • •. (916)638-5282
San Diego
ArrowlSchweber Electronics
(619)565-4800
Future Electronics. . . . . . . . . . .. (619)625-2800
Hamitton Hallmark ............ (619)571-7540
Newark ..................•... (619)453-8211
Wyle Laboratories .....•...... (619)565-9171
San Jose
ArrowlSchweber Electronics ...• (408)441-9700
ArrowlSchweber Electronics ...• (408)428-6400
Future Electronics ............. (408)434-1122
Santa Clara
Wyle Laboratories ............ (408)727-2500
Sunnyvale
Hamilton Hallmark ............ (408)435-3500
Time Electronics ............ 1-800-789-TIME
Torrance
Time Electronics .......•.... 1-800-789-TIME
Tustin
Time Electronics ....•....... 1-800-789-TIME
West Hills
Newark. . . . . . . . . . . . . . . . . . . .. (818)888-3718
Time Electronics ...••.•.•... 1-800-789-TIME
Arrow!Schweber Electronics ...• (203)265-7741
FLORIDA
Altamonte Springs
Future Electronics. • . • • . • . • • .• (407)767-8414
Clearwater
Future Electronics. . . • . . . . • . .• (813)530-1222
Deerfield Beach
Arrow/Schweber Electronics .•.• (305)429-8200
Wyle Laboratories. . . • . • . . . • .• (305)420-0500
Ft. Lauderdale
Future Electronics. . • . • . • . . • .• (305)436-4043
Hamilton Hallmark ••.......•.• (305)484-5482
Time Electronics •.•......... 1-800-789-TIME
Lake Mary
ArrowlSchweber Electronics ...• (407)333-9300
LargolTampalSt. Petersburg
HamiHon Hallmark .....•..•... (813)541-7440
Newark ....•.•.....•.•.•.... (813)287-1578
Wyle Laboratories. . . • . • . • . . .• (813)576-3004
Orlando
Newark ...... . . . . . . . . • . . . . .• (407)896-8350
Time Electronics ....•.•....• 1-800-789-TIME
Plantation
Newark. . . . . . . • . • . . . . . . . . • .. (305)424-4400
Winter Park
Hamilton Hallmark ........... (407)657-3300
Richardson Electronics
(407)644-1453
GEORGIA
Atlanta
Time Electronics ....•.•..•.• 1-800-789-TIME
Wyle Laboratories ...•.....••. (404)441-9045
Duluth
Arrow/Schweber Electronics ..•. (404)497-1300
Hamilton Hallmark •••.••••••• (404)623-5475
Norcross
Future Electronics •.••••.••.•. (404)441-7676
Newark .••••...•..••.•••.••• (404)448-1300
Wyle Laboratories ..•••.•.•.•. (404)441-9045
ILLINOIS
Addison
Wyle Laboratories . . . . . . . . . . .. (708)620-0969
Bensenville
Hamilton Hallmark ....••....•. (708)860-7780
Chicago
Newark Electronics Corp. •.••• (312)764-5100
Hoffman Estates
Future Electronics. • • • • • • • • • •• (708)882-1255
Itasca
Arrow/Schweber Electronics ... (708)250-0500
LaFox
Richardson Electronics ..•.•.. (708)208-2401
Schaumburg
Newark. . • . • . . . . . . . • . . . . . • .. (708)31 Q-8980
Time Electronics ..........•. 1-800-789-TIME
INDIANA
Indianapolis
Arrow/Schweber Electronics .... (317)299-2071
Hamilton Hallmark ..•.•.•.•.. (317)872-8875
Newark. • . . • . . . . . . . • . • . • . • .. (317)259-0085
Time Electronics .••.•••••••• 1-800-789-TIME
Ft. Wayne
Newark ....•.....•.......•.. (219)464-0766
IOWA
Cedar Rapids
Newark .... . . . . . . . . . . . • . . ... (319)393-3800
Time Electronics ............ 1-8OQ-789-TIME
KANSAS
Lenexa
ArrowlSchweber Electronics •••• (913)541-9542
Hamilton Hallmark ••••••••••• (913)888-4747
Overland Park
Future Electronics ••••••••.••. (913)649-1531
Newark .•.......•.••.••.•... (913)677-0727
Time ElectroniCS ••••..••••.. 1-800-789-TIME
MARYLAND
Columbia
Arrow/Schweber Electronics .•.. (301 )596-7800
Future Electronics • . • • • • • • • • •• (410)290-0600
Hamilton Hallmark ......•.•.. (410)988-9800
Time Electronics •••••...•..• 1-800-789-TIME
Wyle Laboratories •••••••••••• (410)312-4844
Hanover
Newark .....•.•...•••••••••• (410)712-8922
MASSACHUSETTS
Boston
Arrow/Schweber Electronics .... (617)271-9953
Bolton
Future Corporate. • . • . • • • . • . .. (508)779-3000
Burlington
Wyle Laboratories •••••••••..• (617)271-9953
Norweli
Richardson Electronics ..•••.. (617)871-5162
Peabody
Time Electronics .•••.......• 1-800-789-TIME
Hamiltion Hallmark •••••....•. (508)532-3701
Woburn
Newark. . . . . • . • . . . . . . . . . . . •. (617)935-8350
MICHIGAN
Detroit
Newark .•.•....••.•••.•.•... (313)967-0600
Grand Rapids
Future Electronics .•.••.....•. (616)698-6800
Livonia
Arrow/Schweber Electronics •••. (313)462-2290
Future Electronics ......•.•... (313)261-5270
HamiitonHalimark .••........ (313)347-4020
Time Electronics .•.•.•....•. 1-800-789-TIME
MINNESOTA
Bloomington
Wyle Laboratories ••..•........ (612)853-2280
Eden Prairie
Arrow!Schweber Electronics •••• (612)941-5280
Future Electronics. • . . . . . • . . •. (612)944-2200
HamlitonHalimark ••...•....• (612)881-2600
Time Electronics •...•.••.... 1-800-789-TIME
Minneapolis
Newark ......•.•.••.. . . . . . .. (612)331-8350
Earth City
Hamilton Hallmark ........... (314)291-5350
3/1/95
AUTHORIZED DISTRIBUTORS - continued
UNITED STATES - continued
Mayfield Heights
MISSOURI
st. Louis
Solon
Arrow/schweber Electronics .... (314)567-6888
FuMe Eleclronics ............ (314)469-6805
Newark ..................... (314)298-2505
Time Eleclronics ............ 1-800-789-TIME
NEW JERSEY
Cherry Hill
Hamillon Hallmark ............ (609)424-0100
East Brunswick
Newark . . . . . . . . . . . . . . . . . . . .. (908)937-6600
Marlton
Arrow/Schweber Electronics .... (609)596-8000
FuMe Electronics. . . . . . . . . . .. (609)596-4080
Plnebrook
Arrow/Schweber Electronics .... (201 )227-7880
Wyle Laboratories ............ (201 )882-8358
Parsippany
Future Electronics. . . . . . . . . . .. (201 )299-0400
Hamilton Hallmark ........... (201 )515-1641
Wayne
Time Electronics ............ 1-800-789-TIME
NEW MEXICO
Albuquerque
Alliance Electronics ......... . (505)292-3360
Hamilton Hallmark ........... . (505)828-1058
Newark .................... . (505)828-1878
NEW YORK
Commack
Newark .................... . (516)499-1216
Hauppauge
Arrow/Schweber Electronics ... . (516)231-1000
Future Electronics ........... . (516)234-4000
(516)434-7400
Hamilton Hallmark
Konkoma
Hamilton Hallmark ........... (516)737-0600
Melville
Wyle Laboratories. . . . . . . . . . .. (516)293-8446
Pittsford
Newark ..................... (716)381-4244
Rochester
Arrow/Schweber Electronics .... (716)427-0300
Future Electronics ............. (716)272-1120
Hamifion Hallmark ............ (716)475-9130
Richardson Electronics ........ (716)264-1100
Time Electronics ............ 1-800-789-TIME
Future Electronics. . • . . . . . . . .. (216)449-6996
Arrow/schweber Electronics .... (216)248-3990
Hamilton Hallmark .........•.. (216)498-1100
Worthington
Hamilton Hallmark .•.......... (918)254-6110
Newark. . . . . . . . . . . . . . . . . . . .. (918)252-5070
Newark .....••.............. (503)297-1984
Time Electronics ............ 1-800-789-TIME
PENNSYLVANIA
Ft_ Washington
Raleigh
Arrow/Schweber Electronics .... (919)876-3132
Future Electronics ........•.... (919)790-7111
Hamilton Hallmark ..•........ (919)872-0712
Newark ..................... (919)781-7677
Time Electronics ............ 1-800-789-TIME
OHIO
Centerville
Arrow/schweber Electronics •.•• (513)435-5563
Cleveland
Newark .•....•..••.•.•••.•.. (216)391-9330
Time Electronics •.••••.....• 1-800-789-TIME
Columbus
Newark .•...•............... (614)326-0352
Time Electronics .••••••..... 1-800-789-TIME
Dayton
Future Electronics ••••....•••• (513)426-0090
Hamilton Hallmark ........... (513)439-6735
Newark. • • • . . . . . • • • • • • . . . . .. (513)294-8980
Time Electronics .........••• 1-800-789-TIME
Spokane
Arrow/Almac Electronics Corp. .. (509)924-9500
WISCONSIN
Brookfield
Arrow!Schweber Electronics .... (414)792-0150
Future Electronics .....•...•.. (414)879-0244
Milwaukee
Time Electronics ............ 1-800-789-TIME
Newark ..................... (215)654-1434
New Berlin
Hamilton Hallmark ........... (414)780-7200
Mt. Laurel
Wauwatosa
Montgomeryville
Waukesha
Wyle Laboratories ............. (609)439-9110
Richardson Electronics ....... (215)628-0805
Newark. . . . . . . . . . . . • . . . . . . .. (414)453-9100
Wyle Laboratories ............ (414)879-0434
Philadelphia
Time Electronics ............ 1-800-789-TIME
Wyle Laboratories .....•....... (609)439-9110
Pittsburgh
ArrowiSchweber Electronics .... (412)963-6807
Newark ..............•...... (412)788-4790
Time Electronics ........•... 1-800-789-TIME
TENNESSEE
Franklin
Richardson Electronics •...... (615)791-4900
Knoxville
Newark. . . . . . . . . . . . . . . . • . . .. (615)588-6493
TEXAS
Austin
Arrow!Schweber Electronics .... (214)380-6464
Future Electronics ............ (214)437-2437
Hamilton Hallmark ........... (214)553-4300
Richardson Electronics ....... (214)239-3680
Time Electronics .••••.•....• 1-800-789-TIME
Wyle Laboratories. . . . . . . . • . .. (214)235-9953
Ft. Worth
Allied Electronics. . • • . . . . . . • •. (817)336-5401
Houston
ArrowiSchweber Electronics •... (713)530-4700
Future Electronics .•.......•••• (713)785-1155
Hamilton Hallmark .....•••... (713)781-6100
Newark. . . . . . . . . . . . . . . . . . . .. (713)270-4800
Time Electronics •.••.•••••.• 1-800-789-TIME
Wyle Laboratories. . . . . . . . . • .. (713)879-9953
Richardson
Newark. • • • • • • . . . • • . • • • • • • •• (214)235-1998
UTAH
Salt Lake City
ArrowiSchweber Electronics .•••
Future Electronics. • • • • • • • • . ••
Hamifion Hallmark ........••••
Newark ....•••.•.•.......•••
Wyle Laboratories .•••••••.•••
CANADA
ALBERTA
All Provinces - Newark ...•... (800)463-9275
Calgary
Electro Sonic Inc. ........... (403)255-9550
Future Electronics. . . . . . . . • . .. (403)250-5550
Hamitton/Hallmark •........... (800)663--5500
Edmonton
Future Electronics. . . . . . . . . . .• (403)438-2858
Hamilton/Hallmark .......•... (800)663-5500
Saskatchewan
Hamilton/Hallmark .•.....•... (800)663-5500
Arrow/Schweber Electronics .•.. (512)835-4180
Future Electronics. . • • . . . • . . .• (512)502-0991
Hamilton Hallmark ..........• (512)258-8818
Newark. . . . . . . . . . . . . . . . . . . .. (512)338-0287
Time Electronics ............ 1-800-789-TIME
Wyle Laboratories. • . . . . . . . . •. (512)345-8853
Dallas
Future Electronics. . . . . . . • . . .. (704)455-9030
Richardson Electronics •....•• (704)548-9042
Wyle Laboratories....•...•...•. (206)881-1150
(503)629-8090
(503)645-9454
(503)528-6200
(503)643-7900
Portland
Syracuse
. NORTH CAROLINA
Charlotte
Hamifion Hallmark .....•..••.. (206)881-6697
Time Electronics .•..•...•... 1-800-789-TIME
Wyle Laboratories ............. (206)881-1150
Seattle
OREGON
Beaverton
Carollton
Future Electronics ...•........ (315)451-2371
Time Electronics ............ 1-800-789-TIME
Future Electronics . . . . . . . . . . .• (206)489-3400
Redmond
OKLAHOMA
Tulsa
Rockville Centre
Richardson Electronics ....... (516)872-4400
Almac Electronics Corp.
(206)643-9992
Newark .................... . (206)641-9800
Richardson Electronics ...... . (206)646-7224
Bothell
Hamilton Hallmark ..........• (614)888-3313
Arrow/Almac Electronics Corp. ..
Future Electronics. • • . . . . . • . ..
Hamilton Hallmark ...........
Wyle Laboratories. . . . . . . . . . ..
WASHINGTON
Bellevue
(801 )973-6913
(801 )467-4448
(801 )266-2022
(801)261-5660
(801)974-9953
West Valley City
Time Electronics •...•.•.••.. 1-800-789-TIME
Wyle Laboratories •.••.•...••• (801)974-9953
BRITISH COLUMBIA
Vancouver
Arrow Electronics
Electro Sonic Inc.
Future Electronics
Hamitton/Hallmark
...••....... (604)421-2333
. .•.....•.... (604)273-2911
•..•..•...•.. (604)294-1166
....•.•...•. (604)420-4101
MANITOBA
Winnipeg
Electro Sonic Inc. •.••....•.. (204)783-3105
Future Electronics ............ (204)944-1446
Hamifion/Hallmark .•.•......•. (800)663-5500
ONTARIO
Ottawa
Arrow Electronics ...•.••••...
Electro Sonic Inc..•••.....•.•
Future Electronics ..••.••••...
Hamitton/HaJlmark ••••.....•••
(613)226-6903
(613)728-8333
(613)820-8313
(613)226-1700
Toronto
Arrow Electronics ••••..•••••.
Electro Sonic Inc •••.•.••••...
Future Electronics ...••.......
Hamifion Hallmark ••••••••.•••
Newark ...•..•.•..••........
(905)670-7769
(416)494-1666
(905)612-9200
(905)564-6060
(519)685-4280
(905)67(}-2888
(800)463-9275
Richardson Electronics ....... (905)795-6300
FAI •••.•.•.•.•••.•••••••••.. (905)612-9888
QUEBEC
Montreal
Arrow Electronics ...•••••.•... (514)421-7411
Future Electronics ...•••••.... (514)694-7710
Hamifion Hallmark ••••..•••••• (514)335-1000
Richardson Electronics •...... (514)748-1770
Quebec City
Future Electronics. • • • • • • • • • •• (418)877-8666
3/1195
SALES OFFICES
Worthington ••••...•...... (614)431-8492
UNITED STATES
ALABAMA, Huntsville ...... (205)464-6800 OHIO, Dayton .............. (513)495-6800
ALASKA, .............•... (800)635-8291 OKLAHOMA, Tulsa ........ (800)544-9496
ARIZONA, Tempe .......... (602)302-8056 OREGON, Portland •....•... (503)641-3681
CALIFORNIA, Agoura Hills ... (818)706-1929 PENNSYLVANIA, Colmar .... (215)997-1020
CALIFORNIA, Los Angeles .. (310)417-8848
Philadelphia/Horsham ..... (215)957-4100
CALIFORNIA, Irvine ••••••.• (714)753-7360 TENNESSEE, Knoxville ....• (615)690-5593
CALIFORNIA, San Diego •... (619)541-2163 TEXAS, Austin •............ (512)502-2100
CALIFORNIA, Sunnyvale .... (408)749-0510 TEXAS, Houston ..•..•....• (800)343-2692
COLORADO,
TEXAS, Plano ............. (214)516-5100
Colorado Springs .......•.. (719)599-7497 TEXAS, Seguin ......•...•. (210)372-7620
COLORADO, Denver .....•. (303)337-3434 VIRGINIA, Richmond ....... (804)285-2100
CONNECTICUT,
UTAH, CSI @ .............. (801)561-5099
Wallingford ............... (203)949-4100 WASHINGTON, Bellevue .... (206)454-4160
FLORIDA, Maitland •.•....•. (407)628-2636
Seattle Access .•.•....... (206)622-9960
FLORIDA, Pompano Beach!
WISCONSIN, Milwaukee!
Ft. Lauderdale ...•.•••...• (305)351-6040
Brookfield ...••.•.••.•.... (414)792-0122
FLORIDA, Clearwater ..•... (813)538-7750
Field Applications Engineering Available
GEORGIA, Atlanta .••••••.• (404)729-7100
Through All Sales Offices
IDAHO, Boise •...•.••••••.• (208)323-9413
CANADA
ILLINOIS, Chicago!
BRITISH COLUMBIA,
Hoffman Estates ......•... (708)413-2500
Vancouver ..••.•......•... (604)293-7650
Shaumburg ..........•... (708)413-2500
ONTARIO, Toronto •........ (416)497-8181
INDIANA, Fort Wayne ..•.•. (219)436-5818
ONTARIO, Ottawa .......... (613)226-3491
INDIANA, Indianapolis ....•. (317)571-0400
QUEBEC, Montreal ......... (514)333-3300
INDIANA, Kokomo ......... (317)455-5100
IOWA, Cedar Rapids .....•. (319)378-0383 INTERNATIONAL
AUSTRALIA, Melbourne ... (61-3)887-0711
KANSAS, Kansas City!
Mission .................. (913)451-8555 AUSTRALIA, Sydney ....... 61 (2)906-3855
MARYLAND, Columbia ...•. (410)381-1570 BRAZIL, Sao Paulo ....... 55(11)815-4200
CHINA, Beijing. . . . • . . . . . . . .. 86-505-2180
MASSACHUSETTS,
Marlborough ...•...•.•..•. (508)481-8100 FINLAND, Helsinki ......• 358-0-351 61191
car phone •.••.........•. 358(49)211501
MASSACHUSETTS,
Woburn .................. (617)932-9700 FRANCE, Paris ...........• 33134635900
MICHIGAN, Detroit ....•..•. (313)347-6800 GERMANY, Langenhagenl
Hannover •.••........•.. 49(511)786880
MINNESOTA, Minnetonka ..•. (612)932-1500
MISSOURI, St. Louis .....•. (314)275-7380 GERMANY, Munich •....•... 498992103-0
NEW JERSEY, Fairfield •..•. (201)808-2400 GERMANY, Nuremberg .... 4991196-3190
NEW YORK, Fairport .....•. (716)425-4000 GERMANY, Sindelfingen ..•. 49703179710
NEW YORK, Hauppauge .... (516)361-7000 GERMANY, Wiesbaden •••.. 49611 973050
NEW YORK, Fishkill ......•. (914)896-0511 HONG KONG, Kwai Fong .... 852-6106888
Tal Po .................... 852-6668333
NORTH CAROLINA,
Raleigh .................. (919)870-4355 INDIA, Bangalore .•.•.•... (91-812)627094
OHIO, Cleveland .....•.•••• (216)349-3100 ISRAEL, Herzlla .•.••••... 972-9-590222
OHIO, Columbus!
ITALY, Milan ................. 39(2)82201
JAPAN, Fukuoka ......... 81-92-725-7583
JAPAN, Gotanda .......... 81-3-5487-8311
JAPAN, Nagoya .......... 81-52-232-3500
JAPAN, Osaka ............. 81-6-305-1802
JAPAN, Sendai ........... 81-22-268-4333
JAPAN, Takamatsu ...••... 81-878-37-9972
JAPAN, Tokyo ••.......... 81-3-3440-3311
KOREA, Pusan ........... 82(51)4635-035
KOREA, Seoul .•.•.....•... 82(2)554-5118
MALAYSIA, Penang ......... 60(4)374514
MEXICO, Mexico City ••..••• 52(5)282-0230
MEXICO, Guadalajara ...... 52(36)21-8977
Marketing ................ 52(36)21-2023
Customer Service ..•...•• 52(36)669-9160
NETHERLANDS, Best ...• (31)499861211
PUERTO RICO, San Juan ••• (809)793-2170
SiNGAPORE ............... (65)4818188
SPAIN, Madrid ....•..••.••• 34(1)457-8204
or ....................... 34(1)457-8254
SWEDEN, Solna ..•..••.... 46(8)734-8800
SWITZERLAND, Geneva .. 41(22)7991111
SWITZERLAND, Zurich •.... 41 (1 )730-4074
TAIWAN, Taipei ...•..•.... 886(2)717-7089
THAILAND, Bangkok .•..... 66(2)254-4910
UNITED KINGDOM,
Aylesbury ••........•.... 44(296)395-252
FULL LINE REPRESENTATIVES
CALIFORNIA, Loomis
Galena TechnOlogy Group ...
NEVADA, Reno
Galena Tech. Group .•.....
NEW MEXICO, Albuquerque
S&S Technologles,lnc.....
UTAH, Salt Lake City
. Utah Compo Sales,lnc.•....
WASHINGTON, Spokane
Doug Kenley ....•.•••....
(916)652-0268
(702)746-0642
(505)298-7177
(801)561-5099
(509)924-2322
HYBRID/MCM COMPONENT SUPPLI·
ERS
Chip Supply ...•.•...•...••
Elmo Semiconductor ......•.
Minco Technology Labs Inc.•.
Semi Dice Inc.••.....•••.•.
(407)298-7100
(818)766-7400
(512)834-2022
(310)594-4631
3/1/95
SALES OFFICES
INTERNATIONAL MOTOROLA DISTRIBUTOR AND SALES OFFICES
AUTHORIZED DISTRIBUTORS
AUSTRALIA
JAPAN
VSI Electronics (NZ) Ltd ........ (64)9579-6603
VSI Promark Elec. Ply Ltd ....... (61)2439-4655
VeltekPtyLtd ...........•..... (61)3808-7511
AUSTRIA
EBV Austria .............•.. (43) 222 8941774
Elbatex GmbH ............... (43) 222 86 3211
81-422-54-6800
81-3-3639-8951
81-3-3779-9053
81-3-3814-1411
81-3-5561-7254
81-3-3280-7300
KOREA
BENELUX
Diode Belgium •...........•.. (32) 2 725 4660
Diode Components BV ....... (31) 340 29 1234
EBV Belgium. . • . . . . . . . . . . • . .. (32) 2 720 9936
EBV Holland •.............•. (31) 3465 623 53
Rodelco Electronics ............ (31) 767 84911
Rodelco N.V. " •........•... " (32) 2 460 0560
CHINA
Advanced Electronics Ltd. .•.... (852)305-3633
China EI. App. Corp. Xiamen Co ... (86)592 553-487
Nanco Electronics Supply Ltd. . .... (852) 333-5121
Qing Cheng Enterprises Ltd. .... (852) 493-4202
DENMARK
Avnet Nortec NS Denmark ...... (45) 428 42000
EBV Denmark ............•.... (45) 398 905 11
FINLAND
Arrow Field OY .....••.•..•.•. (35) 807 775 71
Lite-On Korea Ltd ....•....•.... (82)2858-3853
Lee Ma Industrial Co. Ltd........ (82)2739-5257
Jung Kwang Sa ....••••...... (82)51802-2153
NORWAY
Avnet Nortec NS Norway ...... (47) 66646210
SCANDINAVIA
ITT Multikomponent AB ........•. (46) 8 830 020
Avnet Nortec (S) . . . . . . . . . . . . .. (46) 8 705 1800
Avnet Nortec (OK) ..•....•.... (45) 42 842 000
Avnet Nortec (N) ................ (47) 6 684 210
SINGAPORE
Alexan Commercial ............. (63)2405-952
GEIC ...•....•...••....•...•.. (65) 298-7633
P.T. Ometraco ................. (62)22630-805
Uraco Impex Asia Pte Ltd......... (65)5457811
Shapiphat Ltd..•....•....•..... (66)2221-5384
SPAIN
FRANCE
Arrow Electronique • . . . . . . . ..
Avnet Components. . . . . . . . ..
EBV France. • • . • . • . . . . . . . ..
Scaib .......•.•.•.........
AMSC Co., Ltd................
Marubun Corporation . . . . . . . . ..
OM RON Corporation ..........
Fuji Electronics Co., Ltd ........
Tokyo Electron Ltd............
Nippon Motorola Micro Elec......
(33)
(33)
(33)
(33)
1 49 78 49 78
1 49652500
1 64688600
1 46 87 23 13
GERMANY
Avnet E2000 ...•.......•..... (49) 89 4511001
EBV Germany •..•.........•... (49) 89 4561 00
Future Electronics GmbH ....• (49) 89-957 195-0
Jermyn GmbH ................. (49) 6431-5080
Muetron, Mueller
GmbH & Co................ (49) 421-305 60
Sasco GmbH. . . . . . . . . . . . . . . . . .. (49) 89-46110
Spoerle Electronic ............ (49) 6103-304-0
HONG KONG
Nanshing Clr. & Chern. Co. Ltd .... (852) :J33.Q121
Wong's Kong King Semi. Ltd..... (852) 357-8888
INDIA
Canyon Products Ltd . . . . . • . . . .• (852) 755-2583
ITALY
AvnetAdelsySpA •........... (39)238103100
EBV Italy •....•••..••.•...•.. (39) 2 66017111
Silverstar SpA .•. • . . . . . . . • . . . .. (39) 2 66 12 51
Amitron Arrow .....•.......... (34) 1 304 30 40
EBV Spain ....•.•............ (34) 9 358 86 08
Selco S.A.........•.....•.... (34) 1 3594348
SWEDEN
Avnet Nortec AB .........••... (48) 8 629 1400
SWITZERLAND
EBV Switzerland ....•......... (41) 1 7401090
Elbatex AG .................. (41) 56 275165
TAIWAN
Mercuries&Assoc. Ltd ....... (886)2503-1111
Solomon Technology Corp. • .... (886)2 760-5858
Strong Electronics Co. Ltd..•.... (886)2917-9917
UNITED KINGDOM
Arrow Electronics (UK) Ltd •.... (44) 234272733
Avnet/Access .......•...•.... (44) 462 480888
Future Electronics Ltd. • ....... (44) 753 687000
Macro Marketing Ltd. . . . . • . . .. (44) 628 604 383
CANADA
All Provinces - Newark. . • • . . . •. (800)463-9275
ALBERTA
Calgary
Electro Sonic Inc. ••.•.••. (403)255-9550
Future Electronics. . . . . • . ..
Hamilton/Hallmark ........
Edmonton
Future Electronics. . . . . . . ..
Hamilton/Hallmark
Saskatchewan
Hamilton/Hallmark ........
(403)250-5550
(800)663-5500
(403)438-2858
(800)663-5500
(800)663-5500
BRITISH COLUMBIA
Vancouver
Arrow Electronics ......... (604)421-2333
Electro Sonic Inc.....•.... (604)273-2911
Future Electronics .......... (604)294-1166
Hamilton/Avnet Electronics . (604)420-4101
MANITOBA
Winnipeg
Electro Sonic Inc. ........ (209)783-3105
Future Electronics .•..... " (204)944-1446
Hamilton/Hallmark ........ (800)663-5500
ONTARIO
Ottawa
Arrow Electronics .........
Electro Sonic Inc..........
Future Electronics .........
Hamilton/Hallmark ........
(613)226-6903
(613)728-8333
(613)820-8313
(613)226-1700
Toronto
Arrow Electronics .........
Electro Sonic Inc..........
Future Electronics ..•......
Hamilton/Hallmark ........
Newark ..................
(416)670-7769
(416)494-1666
(905)612-9200
(905)564-6060
(519)685-4280
(905)670-2888
Richardson Electronics .... (905)795-6300
FAI •.......•............. (905)612-9888
QUEBEC
Montreal
Arrow Electronics ..•....... (514)421-7411
Future Electronics .•....... (514)694-7710
Hamilton/Hallmark ........ (514)335-1000
Richardson ....•.....•.... (514)748-1770
Quebec City
Arrow Electronics ..•...... (418)687-4231
Future Electronics. . . . . . . .. (418)682-8092
SI. Laurent
Richardson Electronics .•.. (514)748-1770
SALES OFFICES
CANADA
BRITISH COLUMBIA, Vancouver .••. (604)293-7650
ONTARIO, Toronto •••••••..•••.. (416)497-8181
ONTARIO, Ottawa •••.•..•....•.. (613)226-3491
QUEBEC, Montreal ..••.•.•••..•• (514)333-3300
INTERNATIONAL
AUSTRALIA, Melbourne .•••...•• (61-3)887-0711
AUSTRALIA, Sydney. . • • • . . . • • .. 61 (2)906-3855
BRAZIL, Sao Paulo ..••.•.•••••. 55(11)815-4200
CHINA, Beijing ••••••....•......... 86-505-2180
CHINA, Guangzhou .••.•..•••• (86) 20 331-1626
CHINA, Shanghai •.•.••••..••• (86) 21 279-8206
CHINA, Singapore •..••.•..••••.•. (65) 481-8188
CHINA, Tianjin .•...•......... .. (86) 22 506-972
FINLAND, Helsinki ...••..••••.. 358-0-35161191
car phone ••..•••..•••••..•. '" 358(49)211501
FRANCE, Paris ....••.•..•••...•• 33134635900
GERMANY, Langenhagen/
Hannover •..••.•...•••••.••.•• 49(511)786880
GERMANY, Munich •...•••.••••••• 49 89 92103-0
GERMANY, Nuremberg •••.•.••.• 4991196-3190
GERMANY, Sindelfingen ••••.•..• 49703179710
GERMANY, Wiesbaden ..•.•...•• 49611 973050
HONG KONG, Kwai Fang ..••...••. 852-8106888
Tal Po ....•••..•••..•.•••.•••••• 852-6668333
INDIA, Bangalore .••••...••...• (91-812)627094
ISRAEL, Herzlia .••••••.•.•••••• 972-9-590222
ITALY, Milan ..•.•....••............ 39(2)82201
JAPAN, Fukuoka • . • • • • • . • . • . •• 81-92-725-7583
JAPAN, Gotanda .•....••..•••.• 81-3-5487-8311
JAPAN, Nagoya ......•.•.•••.. 81-52-232-3500
JAPAN, Osaka •..••.•.•••••.•••• 81-6-305-1802
JAPAN, Sendai ..••...•••••.•.. 81-22-268-4333
JAPAN, Takamatsu ••••......... 81-878-37-9972
JAPAN, Tokyo ........••..•••.. 81-3-3440-3311
KOREA, Pusan .•.•••...•.•...• 82(51)4635-035
KOREA, Seoul •••...•••..•••...•• 82(2)554-5118
MALAYSIA, Penang ...•....•...... 60(4)374514
MEXICO, Mexico City. • • . . . . • . . .. 52(5)282-0230
MEXICO, Guadalajara .•.....•... 52(36)21-8977
Marketing. . • . . . . • . . . . • • • • . • • •. 52(36)21-2023
Customer Service ••..•••.•.•• 52(36)669-9160
NETHERLANDS,Best ••........ (31)499861211
PHILIPPINES, Manila ...•••...••. (63)2822-0625
PUERTO RICO, San Juan ..••.... (809)793-2170
SINGAPORE •••.•.•••...•••...•.. (65)4818188
SPAIN, Madrid ...............•.. 34(1)457-8204
or .•••.••••..•.•...••....•.... 34(1)457-8254
SWEDEN, Solna •...••....••...• 46(8)734-8800
SWITZERLAND, Geneva ••.••.•• 41 (22)799 11 11
SWITZERLAND,Zurich ......•... 41(1)730-4074
TAIWAN, Taipei ...••...•••..... 886(2)717-7089
THAILAND, Bangkok •••......... 66(2)254-4910
UNITED KINGDOM, Aylesbury ..••• 44"(296)395-252
•
Introduction
•
Data Sheets
•
Quality and Reliability
•
Application Notes
•
Package Outline Dimensions
•
Appendices
•
Glossary and Symbols
•
Device Sample Kits
•
Index and Cross Reference
II
Distributors and Sales Offices
2PHX31293S·3 Printed in USA 4195 BANTA CO. MOTO#70 60.000 SENSOR YBAGAA
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