1995_Motorola_Sensor_Device_Data 1995 Motorola Sensor Device Data
User Manual: 1995_Motorola_Sensor_Device_Data
Open the PDF directly: View PDF .
Page Count: 378
Download | ![]() |
Open PDF In Browser | View PDF |
Introduction Data Sheets Quality and Reliability Application Notes Package Outline Dimensions Appendices Glossary and Symbols Device Sample Kits Index and Cross Reference Distributors and Sales Offices Issued Motorola Sensor U.S. Patents: 3858150, 3893228, 3943915, 4100563, 4184189, 4224537, 4243898, 4250452, 4317126, 4326171,4463274,4465075,4480983,4517547, 4526740, 4655088, 4683757, 4686764, 4708012, 4732042, 4733553, 4777716, 4842685,4889590, 4995953, 5027081, 5031461, 5074152, 5110758, 5130276, 5132559. ICePAK, SENSEFET and X-ducer are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Udel is a registered trademark of Union Carbide. ® MOTOROLA Sensor Device Data The information in this book has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of semiconductor devices any license under the patent rights to the manufacturer. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and If!) are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. 3rd Edition © Motorola, Inc. 1995 "All Rights Reserved" Printed in U.S.A. iii DATA CLASSIFICATION Product Preview This heading on a data sheet indicates that the device is in the formative stages or in design (under development). The disclaimer at the bottom of the first page reads: "This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice." Advance Information This heading on a data sheet indicates that the device is in sampling, preproduction, or first production stages. The disclaimer at the bottom of the first page reads: "This document contains information on a new product. Specifications and information herein are subject to change without notice." Fully Released A fully released data sheet contains neither a classification heading nor a disclaimer at the bottom of the first page. This document contains information on a product in full production. Guaranteed limits will not be changed without written notice to your local Motorola Semiconductor Sales Office. MOTOROLA DEVICE CLASSIFICATIONS In an effort to provide up-tO-date information to the customer regarding the status of any given device, Motorola has classified all devices into three categories: Preferred devices, Current products and Not Recommended for New Design products. A Preferred type is a device which is recommended as a first choice for future use. These devices are "preferred" by virtue of their performance, price, functionality, or combination of attributes which offer the overall "best" value to the customer. This category contains both advanced and mature devices which will remain available for the foreseeable future. Preferred devices in the Data Sheet sections are identified as a "Motorola Preferred Device." Device types identified as "current" may not be a first choice for new designs, but will continue to be available because of the popularity and/or standardization orvolume usage in current production designs. These products can be acceptable for new designs but the preferred types are considered better alternatives for long term usage. Any device that has not been identified as a "preferred device" is a "current" device. Products designated as "Not Recommended for New Design" may become obsolete as dictated by poor market acceptance, or a technology or package that is reaching the end of its life cycle. Devices in this category have an uncertain future and do not represent a good selection for new device designs or long term usage. The Sensor Data Book does not contain any "Not Recommended for New Design" devices. iv TABLE OF CONTENTS SECTION ONE - Reliability Tests for Automotive/Industrial Pressure Sensors ....................... 3-9 Introduction Selector Guide Information ................. 1-2 General Product Information ............... Performance ............................. Accuracy ................................ Unlimited Versatility ....................... Statistical Process Control ................ 3-10 1-3 1-3 1-3 1-3 Electrostatic Discharge Data .............. 3-14 SECTION FOUR - Integration ................................ 1-4 On-Chip Conditioning ..................... 1-4 Motorola Pressure Sensors ................ The Basic Structure ....................... Motorola's Patented X-ducer ............... The Basic Elements . . .. . . . . .. .. . .. . . . .. . .. Operation ................................ SECTION TWO - Applications Information. . . . . . . . . . . . . . . . . .. 4-2 AN935 Compensating for Nonlinearity in the MPX10 Series Pressure Transducer ..................... 4-4 AN936 Mounting Techniques, Lead Forming and Testing of Motorola's MPX Series Pressure Sensors ........ 4-11 AN1082 Simple Design for a 4-20 mA Transmitter Interface Using a Motorola Pressure Sensor ....... 4-16 AN1097 Calibration-Free Pressure Sensor System ....................... 4-19 AN1100 Analog to Digital Converter Resolution Extension Using a Motorola PressureSensor ............... 4-24 AN1105 A Digital Pressure Gauge Using the Motorola MPX700 Series Differential Pressure Sensor ............... 4-27 AN1303 A Simple 4-20 mA Pressure Transducer Evaluation Board .... 4-32 AN1304 Integrated Sensor Simplifies Bar Graph Pressure Gauge. . . . . . . . .. 4-37 AN1305 An Evaluation System for Direct Interface of the MPX5100 Pressure Sensor with a Microprocessor .. .. 4-42 AN1307 A Simple Pressure Regulator Using Semiconductor Pressure Transducers ................... 4-58 AN1309 Compensated Sensor Bar Graph Pressure Gauge ................ 4-65 AN1315 An Evaluation System Interfacing the MPX2000 Series Pressure Sensors to a Microprocessor ............ 4-72 AN1316 Frequency Output Conversion for MPX2000 Series Pressure Sensors . . . . . . . . . . . . . . . . . . . . . .. 4-93 AN1318 Interfacing Semiconductor Pressure Sensors to Microcomputers . . . . .. 4-99 AN1322 Applying Semiconductor Sensors to Bar Graph Pressure Gauges . . .. 4-109 AN1324 A Simple Sensor Interface Amplifier ..................... 4-114 AN1325 Amplifiers for Semiconductor Pressure Sensors ............. 4-118 AN1326 Barometric Pressure Measurement Using Semiconductor Pressure Sensors ...................... 4-122 AN1513 Mounting Techniques and Plumbing Options of Motorola's MPX Series Pressure Sensors ........ 4-131 1-4 1-4 1-4 1-5 1-5 Data Sheets Basic Uncompensated MPX10D, MPX12D Series ................. 2-2 MPX50D Series .......................... 2-6 MPX1 OOD Series ........................ 2-10 MPX200D Series ........................ 2-14 MPX700D Series ........................ 2-18 MPX906 Series . . . . . . .. . . . . .. . . . .. . .. . ... 2-22 Calibrated and Temperature Compensated MPX2010D, MPX2012D Series ............ MPX2050D, MPX2052D Series ............ MPX2100D, MPX2101D Series ............ MPX2200D, MPX2201 D Series ............ MPX2300D ............................. MPX2700 Series ......................... 2-26 2-30 2-34 2-38 2-42 2-44 Signal Conditioned MPX4100D, MPX4101 Series ............. MPX4115A Series ....................... MPX4250 Series ......................... MPX5010 Series ......................... MPX5050D Series ....................... MPX5100D Series ........................ MPX5500 Series ......................... MPX5700 Series ......................... MPX5999 Series ......................... 2-48 2-55 2-59 2-63 2-67 2-72 2-78 2-82 2-86 High Impedance MPX7050D Series ....................... 2-90 MPX7100D Series ....................... 2-94 MPX7200D Series ....................... 2-98 Temperature Sensor MTS102, MTS103, MTS105 Devices ...... 2-102 Accelerometer XMMAS40G10D, XMMAS40G10S ........ 2-106 XMMAS250G10D, XMMAS250G10S ...... 2-109 XMMAS500G10D, XMMAS500G10S ...... 2-112 SECTION THREE - Application Notes Quality and Reliability Quality and Reliability - Overview ......... 3-2 Reliability Issues for Silicon Pressure Sensors ................................ 3-3 (continued - v next page) Table of Contents (continued) SECTION FOUR (continued) AN1516 AN1517 AN1518 AN1525 AN1535 AN1536 Appendix 5 Mounting and Handling Suggestions. . . . . . . .. 6-8 Liquid Level Control Using a Motorola Pressure Sensor . . . . .. 4-135 Pressure Switch Design with Semiconductor Pressure Sensors .... ".................. 4-140 Using a Pulse Width Modulated Output with Semiconductor Pressure Sensors ............. 4-146 The A-B-C's of Signal-Conditioning Amplified Design for Sensor Applications ................... 4-152 Semiconductor Sensors Provide a Hot Temperature Sensing Solution at a Cool Price ................ 4-159 Digital Boat Speedometers ....... 4-166 SECTION FIVE Dimensions Appendix 6 PressureNacuum Side Identification. . . . . . . .. 6-9 Appendix 7 Connectors for MPX Pressure Sensors ..... 6-10 Appendix 8 Pressure Measurement ... . . . . . . . . . . . . . . .. 6-11 Appendix 9 How the X-ducer Works. . . . . . . . . . . . . . . . . .. 6-12 Appendix 10 Standard Warranty Clause ................ 6-13 SECTION SEVEN - Glossary and Symbols Glossary of Terms. . . . . . . . . . . . . . . . . . . . . . . .. 7-2 Package Outline Symbols, Terms and Definitions ............ 7-5 Package Outline Dimensions ... . . . . . . . . . . .. 6-2 SECTION EIGHT - Device Sample Kits SECTION SIX - Sensor Sample Kit Information ............. 8-2 Appendices Sensor Sample Kit Order Form ............. 8-3 Appendix 1 Device Numbering System for Pressure Sensors ............................... 6-2 SECTION NINE - Index and Cross-Reference Appendix 2 Marking Information for Pressure Sensor Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 6-3 Pressure Range Index ..................... 9-2 Device Index ... . . . . . . . . . . . . . . . . . . . . . . . . . .. 9-4 Appendix 3 Pinout Diagrams for Pressure and Temperature Sensors ............................... 6-4 SECTION TEN - Distributors and Sales Offices ................................. 10-2 Appendix 4 Reference Tables ......................... 6-6 vi Section One Introduction Selector Guide Information . ................. 1-2 General Product Information ................ 1-3 Performance ................................. 1-3 Accuracy .................................... 1-3 Unlimited Versatility ........................... 1-3 Integration . .................................. 1-4 On-Chip Signal Conditioning ................... 1-4 Motorola Pressure Sensors ................. 1-4 The Basic Structure ........................... 1-4 Motorola's Patented X-ducer ................... 1-4 The Basic Elements .......................... 1-5 Operation ................................... 1-5 Motorola Sensor Device Data I ntraduction 1-1 Selector Guide Information ELECTRICAL CHARACTERISTICS Table 1. Uncompensated Device Series Pressure· Range kPalpsl (Max) Over Pressure (kPa) MPX10D MPX12D MPX50D MPX100D,A MPX200D,A MPX201D,A MPX700D 10/45 10/45 5017.3 100/14.5 200/29 200/29 700/100 100 100 200 200 400 400 2100 Offset mV(Typ) Full Scale Span mV(Typ) Sensitivity (mV/kPa) (Typ) 20 20 20 20 20 20 20 35 55 60 60 60 60 60 3.5 5.5 1.2 0.6 0.3 0.3 0.086 -1 0 -0.1 -0.1 -0.25 -0.35 -0.50 1 5 0.1 0.1 0.25 0.35 0.50 25 40 40 40 40 40 2.5 0.8 0.8 0.4 0.2 0.057 -1.0 -0.25 -0.55 -0.25 -0.25 -0.5 1.0 0.25 0.25 0.25 0.25 0.5 Llnearlrr. %ofFSS 1) (Min) (Max) Table 2. Compensated and Calibrated (On-Chip) MPX2010D MPX2050D MPX2052D MPX2100D,A MPX2200D,.A MPX2700D 10/1.45 50/7.3 50/7.3 100/14.5 200/29 700/100 75 200 200 400 400 2800 ±0.05 ±0.05 ±0.1 ±0.05 ±0.05 ±0.05 Temperature Coefficient of Span %/'C (Typ) Input Impedance Ohms (Typ) -0.19 -0.19 -0.19 -0.19 -0.19 -0.19 -0.18 475 475 475 475 475 475 475 O/OVFSS 1800· 1800 1800 1800 1800 1800 ±0.5 ±0.5 ±D.5 ±D.5 ±0.5 ±0.5 Table 4. Signal Conditioned Device Series MPX4100A MPX4101A MPX4115A MPX4250A MPX5050D MPX5100A MPX5100D MPX5500D MPX5700D MPX5999D Pressure kPalpsl (Max) Voltage Source Full Scale Span V (Typ) Sensitivity (mV/kPa) (Typ) Accuracy (0-85'C) 105/15.5 102/15.2 115117 250/35 50/7.3 115/17 100/14.5 500175 700/100 1000/150 5.1 5.1 5.1 5.1 5.0 5.0 5.0 5.0 5.0 5.0 4.59 4.70 4.59 4.69 4.70 4.50 4.50 4.50 4.50 4.50 54 54 54 58 90 45 45 9.0 6.0 5.0 1.5% 1.5% 1.5% 1.5% 2.5% 2.5% 2.5% 2.5% 2.5% 2.5% Table 5. Temperature Sensors Device Series MTS102 MTS105 V(eR~eO Min dc VeE mV(Typ) AVeE mV AT 'c TC mV/'C(Typ) 4 4 595 595 3 7 2 5 -2.265 -2.265 (1 lSased on end pOint straight hne fit method. Best fit straight line linearity error is approximately 112 of listed value. Devices listed in bold, italic are Motorola preferred devices. Introduction 1-2 Motorola Sensor Device Data General Product Information Performance and price advantage all are part of the technology associated with the MPX transducer series. The unique design, coupled with computer controlled laser trimming and semiconductor batch processing techniques, makes these devices highly cost competitive. 40 _VS~10Vd :g 35 30 §. 25 The performance of Motorola's MPX series of pressure sensors is based on its patented strain gauge design. Unlike the more conventional pressure sensors which utilize four closely matched resistors in a Wheatstone bridge configuration, the MPX series uses only a single piezoresistive element ion implanted on an etched silicon diaphragm to sense the stress induced on the diaphragm by an external pressure. The extremely linear output is an analog voltage that is proportional to pressure input and ratiometric with supply voltage. High sensitivity and excellent long-term repeatability make these units suitable for the most demanding applications. ACCURACY Computer controlled laser trimming of on-chip calibration and compensation resistors provide the most accurate pressure measurement over a wide temperature range. Temperature effect on span is typically ±O.5% of full scale over a temperature range from 0 to 85°C, while the effect on offset voltage over a similar temperature range is a maximum of only ±1 mV. UNLIMITED VERSATILITY Choice of Specifications: MPX pressure sensors are available in pressure ranges to fit a wide variety of automotive, biomedical, consumer and industrial applications. Choice of Measurement: Devices are available for differential, absolute, or gauge pressure measurements. !3 15 10 o ~ TYP, MA: ~ 20 PERFORMANCE ~ TA·25'C MPX2100 , ~ -5 ,"' ~ ~ ~ ~ T SPAN RANGE (TYPJ ~ "MIN '1 25 3.62 kPa 0 PSI ~ 50 7.25 75 10.B7 100 OFFSET 14.5 (TYPJ Linearity of output and less than ±1 mV variation in Offset over a temperature range from -40 to 128'C attest to the excellent performance of the compensated series of MPX pressure sensors. Output versus Pressure Differential ~ a:: 2 1.5 a? ffi t;; 1 ~ /~ o.5 ~ =J 0 ~ , .i... E RORB ", I I SPAN RROR ~ \ -0.5 NDLIMI FSETE ROR 1 iC g5 -1.5 a: a: w z it en I I -2 -50 '\ -25 RROR AND LIMIT 25 50 75 ""' 100 125 150 TEMPERATURE ('OJ Curves of span and offset errors indicate the accuracy resulting from on-chip compensation and laser trimming. Temperature Error Band Limit and Typical Span and Offset Errors Choice of Chip Complexity: MPX pressure sensors are available as the basic sensing element, with temperature compensation and calibration, or with full signal conditioning circuitry included on the chip. Purchase of uncompensated units permits external compensation to any degree desired. Choice of Packaging: Buy it as a basic element for custom mounting, or in conjunction with one or two Motorola designed ports that provide printed circuit board mounting ease and barbed hose pressure connections. Alternate packaging material, which has been designed to meet biomedical compatibility requirements, is also available. Consult factory for information. Motorola Sensor Device Data DIFFERENTIAL PORT OPTION CASE 352 Motorola MPXpressure sensors are available as basice/ements, or with standard ports that facilitate mounting and media accessibility fordifferential, absolute or gauge pressure measurements. Packaging Flexibility Introduction 1-3 Integration PIN 3 ON-CHIP SIGNAL CONDITIONING To make the designer's job even easier, Motorola's integrated devices carry sensor technology one step further. Besides the on-chip temperature compensation and calibration offered currently on the MPX2000 series, amplifier signal conditioning has been integrated on-chip in the MPX5000 series to allow interface directly to any microcomputer with an on-board ND converter. The signal conditioning is accomplished by means of a four-stage amplification network, incorporating linear bipolar processing, thin-film metallization techniques, and interactive laser trimming to provide the state-of-the-art in sensor technology. -'W'r- THIN·FILM RESISTOR + LASERTRIMMABLE RESISTOR Fully Integrated Pressure Sensor Introduction to Motorola Pressure Sensors THE BASIC STRUCTURE MOTOROLA'S PATENTED X-ducerTM The Motorola pressure sensor is designed utilizing a monolithic silicon piezoresistor, which generates a changing output voltage with variations in applied pressure. The resistive element, which constitutes a strain gauge, is ion implanted on a thin silicon diaphragm. Applying pressure to the diaphragm results in a resistance change in the strain gauge, which in turn causes a change in the output voltage in direct proportion to the applied pressure. The strain gauge is an integral part of the silicon diaphragm, hence there are no temperature effects due to differences in thermal expansion of the strain gauge and the diaphragm. The output parameters of the strain gauge itself are temperature dependent, however, requiring that the device be compensated if used over an extensive temperature range. Simple resistor networks can be used for narrow temperature ranges, i.e., O°C to 85°C. For temperature ranges from -40°C to + 125°C, more extensive compensation networks are necessary. Excitation current is passed longitudinally through the resistor (taps 1 and 3), and the pressure that stresses the diaphragm is applied at a right angle to the current flow. The stress establishes a transverse electric field in the resistor that is sensed as voltage at taps 2 and 4, which are located at the midpoint of the resistor. The single-element transverse voltage strain gauge can be viewed as the mechanical analog of a Hall effect device. Using a single element eliminates the need to closely match the four stress and temperature sensitive resistors that form a Wheatstone bridge design. At the same time, it greatly simplifies the additional circuitry necessary to accomplish calibration and temperature compensation. The offset does not depend on matched resistors but instead on how well the transverse voltage taps are aligned. This alignment is accomplished in a single photolithographic step, making it easy to control, and is only a positive voltage, simplifying schemes to zero the offset. 1---I r! ETCHED DIAPHRAGM BOUNDARY I :~~;~~~~~A1N i GAUG'3e L-'!ltf-~ 23 PIN# 1. GROUND 2. +VOUT 3. Vs 4.-VOUT Figure 1. Basic Uncompensated Sensor Element - Top View Introduction 1-4 Motorola Sensor Device Data THE BASIC ELEMENTS Motorola silicon pressure sensors are available in three different configurations that permit measurement of absolute, differential and gauge pressure. Absolute pressure, such as barometric pressure, is measured with respect to a built-in vacuum reference. A pressure differential, such as the pressure drop across a damper or filter in an air duct, is measured by applying pressure to opposite sides of the sensor simultaneously. Gauge pressure, as in blood pressure measurement, is a special case of differential pressure, where atmospheric pressure is used as a reference. Figure 2 illustrates an absolute pressure sensing die (left) and a differential or gauge die in the chip carrier package. The difference in die structure between a differential pressure sensor and absolute pressure sensor is that the lalter does not have a hole in the constraint wafer, and the chamber formed by the etched cavity and the solid constraint wafer contains the sealed-in reference vacuum. The cross-section of the differential die in its chip carrier package shows a silicone gel which isolates the die surface and wire bonds from harsh environments while allowing a pressure signal to be transmitted to the silicon diaphragm. The MPX series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term stability. Contact the factory for information regarding media compatibility in your application. DIFFUSED STRAIN GAUGE METALLIZATION SILICONE DIE COAT GLASS FRIT SEAL SILICON WAFER SEALED REFERENCE VACUUM DIE RTV DIE BOND P2 DIFFERENTIAUGAUGE ABSOLUTE SENSOR DIE Figure 2. Cross-Sectional Diagrams (Not to Scale) Operation Motorola pressure sensors support three types of pressure measurements: Absolute Pressure, Differential Pressure and Gauge Pressure. Absolute Pressure Sensors measure an external pressure relative to a zero-pressure reference (vacuum) sealed inside the reference chamber of the die during manufacture. This corresponds to a deflection of the diaphragm equal to approximately 15 PSI (one atmosphere), generating a quiescent full-scale output for the MPX100A (15 PSI) sensor, and a half-scale output for the MPX200A (30 PSI) device. Measurement of external pressure is accomplished by applying a relative negative pressure to the "Pressure" side of the sensor. Differential Pressure Sensors measure the difference between pressures applied simUltaneously to opposite sides of the diaphragm. A positive pressure applied to the "Pressure" side generates the same (positive) output as an equal negative pressure applied to the "Vacuum" side. Motorola Sensor Device Data NEGATIVE PRESSURE VACUUM POSITIVE PRESSURE t • ~~I ~~ NEGATIVE PRESSURE I I Absolute I Sensor I VOS -------1-- 1 ATMPMAX -INCREASING VACUUM INCREASING PRESSURE-- VOS PMAX DIFFERENTIAL PRESSURE - INCREASING Motorola sensing elements can withstand pressure inputs as high as four times their rated capacity, although accuracy at pressures exceeding the rated pressure will be reduced. When excessive pressure is reduced, the previous linearity will immediately be restored. Figure 3. Pressure Measurements Gauge Pressure readings are a special case of differential measurements in which the pressure applied to the Pressure side is measured against the ambient atmospheric pressure applied to the Vacuum side through the vent hole in the chip of the differential pressure sensor elements. Introduction 1-5 Introduction 1-6 Motorola Sensor Device Data Section Two Data Sheets Basic Uncompensated MPX10D, MPX12D Series ..................... 2-2 MPX50D Series .............................. 2-6 MPX100D Series ............................ 2-10 MPX200D Series ............................ 2-14 MPX700D Series ............................ 2-18 MPX906 Series ............................. 2-22 Calibrated and Temperature Compensated MPX2010D, MPX2012D Series ............... MPX2050D, MPX2052D Series ............... MPX21 OOD, MPX21 01 D Series ............... MPX2200D, MPX2201 D Series ............... MPX2300D ................................ MPX2700 Series ............................ 2-26 2-30 2-34 2-38 2-42 2-44 Signal Conditioned MPX41 OOD, MPX41 01 Series ................. MPX4115A Series ........................... MPX4250 Series ............................ MPX5010 Series ............................ MPX5050D Series ........................... MPX51 ODD Series ........................... MPX5500 Series ............................ MPX5700 Series ............................ MPX5999 Series ............................ 2-48 2-55 2-59 2-63 2-67 2-72 2-78 2-82 2-86 High Impedance MPX7050D Series ........................... 2-90 MPX71 ODD Series ........................... 2-98 MPX7200D Series ........................... 2-98 Temperature Sensor MTS102, MTS103, MTS105 Devices .......... 2-102 Accelerometer XMMAS40G10D, XMMAS40G10S ............ 2-106 XMMAS250G10D, XMMAS250G10S ......... 2-109 XMMAS500G1 OD, XMMAS500G1 OS ......... 2-112 Motorola Sensor Device Data 2-1 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 10 kPa (0 to 1.45 PSI) MPX10 MPX12 SERIES Uncompensated, Silicon Pressure Sensors The MPX10 and MPX12 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output - directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design. X-ducer™ SILICON PRESSURE SENSORS Features • • Low Cost Patented Silicon Shear Stress Strain Gauge Design • ±1.0% (Max) Linearity (MPX10D) • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • Differential and Gauge Options Application Examples • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medicallnstrumentation • Industrial Controls • Pneumatic Control Systems • Robotics BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~8 CASE352~2 Style 1 Style 1 Pin Number I I 1 Ground MAXIMUM RATINGS 2 +Vout I I 3 Vs I I 4 -You! Symbol Value Unit Overpressure(8) (P1 > P2) Pmax 75 kPa Burst Pressure(B) (P1 > P2) Pburs! 100 kPa Tstg -50to+150 °C TA -40 to +125 °C Rating Storage Temperature Operating Temperature VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. PIN2 1..-..,..-----0 + Vou! PIN4 ' - - - - - 0 - Vou! PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic REV3 2-2 Motorola Sensor Device Data MPX10 MPX12 SERIES OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, Pl > P2) Characteristic Differential Pressure Range(l) Supply Voltage(2) Symbol Min Typ Max POP 0 - 10 kPa - 3.0 6.0 Vdc - 6.0 - 20 45 35 55 50 70 0 20 35 - 3.5 5.5 - mVlkPa - 1.0 5.0 %VFSS %VFSS Vs Supply Current 10 Full Scale Span(3) MPX10 MPX12 VFSS Sensitivity MPX10 MPX12 AV/AP Linearity(5) MPX10 MPX12 - Offset(4) Voff -1.0 0 Unit mAdc mV mV - - ±0.1 - Temperature Hysteresis(5) (-40°C to +125°C) - ±0.5 - %VFSS Temperature Coefficient of Full Scale Span(5) TCVFSS -0.22 - -0.16 %VFSS/oC Pressure Hysteresis(5) (0 to 10 kPa) TCVoff - ±15 Temperature Coefficient of Resistance(5) TCR 0.21 0.27 %ljnl°C Input Impedance lin 400 - 550 lout 750 n n %VFSS Temperature Coefficient of Offset(5) - - 1250 Response TIme(6) (10% to 90%) tR - 1.0 Offset Stability(5) - - ±0.5 - Symbol Min Typ Max - - 2.0 Output Impedance flV/oC ms MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element, Case 344) Warm-Up Cavity Volume Volumetric Displacement Common Mode Line Pressure(7) Unit - Grams 15 - Sec - 0.01 IN3 0.001 IN3 690 kPa NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative • TcOffset: to 25°C. • TCR: lin deviation with minimum rated pressure applied, over the temperature range of -40°C to +125°C, relative to 25°C. 6. Response TIme is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-3 MPX10 MPX12 SERIES or by designing your system using the MPX2010D series sensor. Several approaches to external temperature compensation over both -40 to +125°C and 0 to +80°C ranges are presented in Motorola Applications Note AN840. TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX10 series over temperature. The X-ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and ollset calibration can be achieved rather simply with additional resistive components, 80 70 :g - 60 - I I f- MPX10 f- VS=3Vdc P1 >P2 gSO ~ 40 ~ 30 20 ~ .- +2SoC_ ~~ ~ Z T ~- ~ SPAN I RANGE (TYP) I 10 kPa 1 I I I 0.6 0.9 11.2 I . I 4.0 6.0 8.0 PRESSURE DIFFERENTIAL sr g 40 20 10 OFFSET (VOFF) °0L-~~~~~~~~~~~~~M~AX7<~POP PRESSURE (kPA) Figure 3. Linearity Specification Comparison Figure 2. Output versus Pressure Differential SILICONE DIE COAT 50 !3 30 1. 10 :g o (TYP) 0.3 I 2.0 LINEARITY 60 !3 I OFFSET o 70,------------------------, ~ ..... ~~ PSI 0 LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. STAINLESS STEEL METAL COVER DIE )~12~C;;~=:;~7}~THERMOPLASTIC --.; CASE P2 RTV DIE BOND Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX1 0 series pressure sensor operating characteris- 2-4 tics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX10 MPX12 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE sure sensor is designed to operate with positive differential pressure applied, Pl > P2. The Pressure (Pl) side may be identified by using the table below: Motorola designates the two sides of the pressure sensor as the Pressure (Pl) side and the Vacuum (P2) side. The Pressure (Pl) side is the side containing silicone gel which protects the die from harsh media. The Motorola MPX presPart Number MPX10D Case Type Pressure (P1) Side Identifier MPX12D 344-08 Stainless Steel Cap MPX10DP MPX12DP 352-02 Side with Part Marking MPX10GP MPX12GP 350-03 Side with Port Attached MPX10GVP MPX12GVP 350-04 Stainless Steel Cap MPX10GS MPX12GS 371-06 Side with Port Attached MPX10GVS MPX12GVS 371-05 Stainless Steel Cap MPX10GSX MPX12GSX 371C-02 Side with Port Attached MPX10GVSX MPX12GVSX 371D-02 Stainless Steel Cap ORDERING INFORMATION MPX10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 344-08 MPX10D MPX12D MPX10D MPX12D Ported Elements Differential Case 352-02 MPX10DP MPX12DP MPX10DP MPX12DP Case 350-03 MPX10GP MPX12GP MPX10GP MPX12GP Gauge Vacuum Case 350-04 MPX10GVP MPX12GVP MPX10GVP MPX12GVP Gauge Stove Pipe Case 371-06 MPX10GS MPX12GS MPX10D MPX12D Gauge Vacuum Stove Pipe Case 371-05 MPX10GVS MPX12GVS MPX10D MPX12D Gauge Axial Case 371 C-02 MPX10GSX MPX12GSX MPX10D MPX12D Gauge Vacuum Axial Case 371 D-02 MPX10GVSX MPX12GVSX MPX10D MPX12D Gauge Motorola Sensor Device Data -- 2-5 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 50 kPa (0 to 7.25 PSI) Uncompensated, Silicon Pressure Sensors MPX50 SERIES The MPX50 silicon piezoresistive pressure sensor provides a very accurate and linear voltage output - directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design. X-ducer™ SILICON PRESSURE SENSORS Features • • Low Cost Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • 60 mV Span (typical) • Differential and Gauge Options Application Examples • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medicallnstrumentation • Industrial Controls • Pneumatic Control Systems • Robotics DIFFERENTIAL PORT OPTION CASE 352~2 Style 1 BASIC CHIP CARRIER ELEMENT CASE 344~8 Style 1 Pin Number I 1 I Ground 2 +Vout I 3 I Vs I I 4 -Vout MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Value Pmax 200 kPa Pburst 500 kPa Tstg -50 to +150 TA -40 to +125 ·C ·C VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. Unit PIN2 1..-.".-----0 + You! PIN 4 ' - - - - - 0 ( ) - Vou! PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic REV3 2-6 Motorola Sensor Device Data MPX50 SERIES OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25·C unless otherwise noted, PI > P2) Characteristic Pressure Range(1) Symbol POP Min 6.0 - 45 60 90 0 20 35 1.2 - Supply Current 10 VFSS Voff AViAP kPa 50 6.0 - Sensitivity Unit - Vs Full Scale Span(3) Max 3.0 0 Supply Voltage(2) Offset(4) Typ - Vdc mAdc mV mV mV/kPa Linearity(5) - - 0.25 %VFSS Pressure Hysteresis(5) (0 to 50 kPa) - ±0.1 - %VFSS Temperature Hysteresis(5) (- 40·C to + 125·C) - - ±0.5 - Temperature Coefficient of Full Scale Span(5) TCVFSS -0.22 - -0.25 -0.16 %VFSS %VFSs!·C TCVoff - ±15 - jlV/·C TCR 0.21 - 0.27 %lin/ C Input Impedance lin 400 - 550 Output Impedance lout 750 - 1800 n n Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) O Response Time(6) (10% to 90%) tR - 1.0 - ms Offset Stability(5) - - ±0.5 - %VFSS MECHANICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Weight (Basic Element Case 344) - - 2.0 - Grams Warm-Up - - 15 - Sec Cavity Volume - - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 Common Mode Line Pressure(7) - - - 690 kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25·C. Output deviation, alter 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85·C, relative to 25·C. • TeSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative • TeOffset: to 25·C. • TCR: lin deviation with minimum rated pressure applied, over the temperature range of -40·C to +125·C, relative to 25·C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-7 MPX50 SERIES TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX50 series over temperature. The X-ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2050/MPX7050 series sensors. Several approaches to external temperature compensation over both -40 to +125°C and 0 to +80°C ranges are presented in Motorola Applications Note AN840. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 3). There are two basic methods for calculating nonlir:learity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the ''worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 70r---------------------------, 100 I MPX50 +25~ 70 r-- VS=3Vdc ~ 40 ~ 0... ~ 30 20 -I - + 125·C......... ..& ~ ......... u 60 50 -c g -40.C ,;' ..... ~ ...... ~ P1 >P2 0 ~ ~ ~ ~ ~ a I 10 2 3 5 I6 4 I 20 30 40 PRESSURE DIFFERENTIAL 71 8 50 30 20 OFFSET (TYP) 1 ACTUAL g40 L 10 PSI kPa 0 50 :if SPAN RANGE (TYP) ~ o0 LINEARITY 60 90 80 f-- 10 OFFSET (VOFF) °O~~~~~~~~~~~~~~~M~AX~.-PO·p T PRESSURE (kPA) Figure 2. Output versus Pressure Differential SILICONE DIE COAT Figure 3. Linearity Specification Comparison DIE P2 RTV DIE BOND Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX50 series pressure sensor operating characteris- 2-8 tics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX50 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which protects the die from harsh media. The Motorola MPX presPart Number sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPX50D 344-08 Stainless Steel Cap MPX50DP 352-02 Side with Part Marking MPX50GP 350-03 Side with Port Attached MPX50GVP 350-04 Stainless Steel Cap MPX50GS 371-06 Side with Port Attached MPX50GVS 371-05 Stainless Steel Cap MPX50GSX 371C-02 Side with Port Attached MPX50GVSX 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX50 series pressure sensors are available in differential and gauge configurations. Devices are available with basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Basic Element Ported Elements Options Differential Case Type Order Number Device Marking Case 344-08 MPX50D MPX50D Differential Case 352-02 MPX50DP MPX50DP Gauge Case 350-03 MPX50GP MPX50GP Gauge Vacuum Case 350-04 MPX50GVP MPX50GVP Gauge Stovepipe Case 371-06 MPX50GS MPX50D Gauge Vacuum Stovepipe Case 371-05 MPX50GVS MPX50D Gauge Axial Case 371 C-02 MPX50GSX MPX50D Gauge Vacuum Axial Case 3710-02 MPX50GVSX MPX50D Motorola Sensor Device Data 2-9 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 100 kPa (0 to 14.5 PSI) Uncompensated, Silicon Pressure Sensors MPX100 SERIES The MPX1 00 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output - directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design. X-ducer™ SILICON PRESSURE SENSORS Features • • Low Cost Patented, Silicon Shear Stress Strain Gauge Design • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • 60 mV Span (typical) • Absolute, Differential and Gauge Options Application Examples • Pump/Motor Controllers • Robotics • Levellndicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~8 CASE352~2 Style 1 Stylet Pin Number 1 Ground I I I 2 3 I +Vout Vs I I 4 -Vout MAXIMUM RATINGS Symbol Value Unit Overpressure(8) (P1 > P2) Rating Pmax 200 kPa Burst Pressure(8) (PI> P2) Pburst 2000 kPa T8 tg -50 to +150 'C TA -40 to +125 'C Storage Temperature Operating Temperature VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a schematic of the internal circuitry on the stand-alone pressure sensor chip. PIN2 "-J"'-----o + Vout X-ducer PIN4 1-.-'11'-----0 - Vout PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic REV3 2-10 Motorola Sensor Device Data MPX100 SERIES OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, Pl > P2) Characteristic Pressure Range(l) Symbol Min Max Unit POP 0 - 100 kPa Typ Supply Voltage(2) Vs - 3.0 6.0 Supply Current 10 - 6.0 - Full Scale Span(3) Offset(4) VFSS 45 60 90 Voff 0 20 35 mV - mV/kPa Sensitivity I1V/I1P - 0.6 Linearity(5) - -0.25 Pressure Hysteresis(5) (0 to 100 kPa) -0.1 - Temperature Hysteresis(5) (-40°C to +125°C) - - ±0.5 Temperature Coefficient of Full Scale Span(6) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance Vdc mAdc TCVFSS -0.22 TCVoff - TCR 0.21 Zin 400 Zout 750 ±15 - mV 0.25 %VFSS 0.1 %VFSS -0.16 0.27 %VFSS %VFSS/OC /LV/oC %Zin/ O C 550 Q 1800 Q Response Time(6) (10% to 90%) tR - 1.0 - ms Offset Stability(5) - - ±0.5 - %VFSS Symbol Min Typ - 2.0 MECHANICAL CHARACTERISTICS Characteristic Max Unit - Grams - Sec Weight (Basic Element Case 344) - Warm-Up - - 15 Cavity Volume - - - 0.01 IN3 Volumetric Displacement - 0.001 IN3 Common Mode Line Pressure(7) - - - - 690 kPa NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Ollset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative • TcOllset: to 25°C. Zin deviation with minimum rated pressure applied, over the temperature range of -40°C to +125°C, • TCR: relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-11 MPX100 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 2). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the ''worse case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. TEMPERATURE COMPENSATION Figure 3 shows the typical output characteristics of the MPX1 00 series over temperature. The X-ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX21 00/MPX71 00 series sensors. Several approaches to external temperature compensation over both -40 to +125°C and a to +80°C ranges are presented in Motorola Applications Note AN840. 70,---------------------------, LINEARITY 60 70 - 60 - :g u 50 ACTUAL :§.40 :;;: t:::i t:::i V ./././ 20 ./ 5 THEORETICAL "/ ././ - - - - - - - - - - --+--''-- / ,;" V. h ~ T ..J.-"'] ~ t25'C .... .... V V ~ 30 ./ ~ ./ v/ .s 40 ~ 30 o r- -40'C / / P1 >P2 - 50 10 0s ~ 3.~ v~c SPAN RANGE (TYP) l......t: t125'C 1 ,.... ~ o 12.0 4. o,I 1 6.0 8.0 10 1 112 141 10 20 30 40 50 60 70 80 90 100 20 10 """ OFFSET (TYP) O~S8 (VOFF) °oL-~~~~~~~~~~~~~-MwALX~~POP PRESSURE (kPA) PRESSURE DIFFERENTIAL Figure 2. Linearity Specification Comparison SILICONE GEL DIE COAT 0 PSI kPa Figure 3. Output versus Pressure Differential DIFFERENTIAUGAUGE DIE DIFFERENTIAUGAUGE ELEMENT P2 SILICONE GEL ABSOLUTE DIE COAT DIE DIE BOND ABSOLUTE ELEMENT P2 Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel helps protect the die surface and wire bond from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. 2-12 The MPX1 00 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX100 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die from harsh media. The differential or gauge sensor is designed to operate with positive differential Part Number pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX100A, MPX100D 344-08 Stainless Steel Cap MPX100DP 352-02 Side with Part Marking MPX100AP, MPX100GP 350-03 Side with Port Attached MPX100GVP 350-04 Stainless Steel Cap MPX1 OOAS, MPX1 OOGS 371-06 Side with Port Attached MPX100GVS 371-05 Stainless Steel Cap MPX100ASX, MPX100GSX 371C-02 Side with Port Attached MPX100GVSX 371D-02 Stainless Steel Cap ORDERING INFORMATION MPX100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. Device Type Basic Element Ported Elements Options Absolute, Differential Case Type MPXSeries Device Marking Case 344-08 MPX100A MPX100D MPX100A MPX100D Differential Case 352-02 MPX100DP MPX100DP Absolute, Gauge Case 350-03 MPX100AP MPX100GP MPX100AP MPX100GP Gauge Vacuum Case 350-04 MPX100GVP MPX100GVP Absolute, Gauge Stove Pipe Case 371-06 MPX100AS MPX100GS MPX100A MPX100D Gauge Vacuum Stove Pipe Case 371-05 MPX100GVS MPX100D Absolute, Gauge Axial Case 371 C-02 MPX100ASX MPX100GSX MPX100A MPX100D Gauge Vacuum Axial Case 371 D-02 MPX100GVSX MPX100D Motorola Sensor Device Data 2-13 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 200 kPa (0 to 29 PSI) Uncompensated, Silicon Pressure Sensors MPX200 SERIES The MPX200 series device is a silicon piezoresistive pressure sensors provide a very accurate and linear voltage output - directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design. X-ducer™ SILICON PRESSURE SENSORS Features • • • • • • • Low Cost Patented Silicon Shear Stress Strain Gauge ±0.25% (max) Linearity Full Scale Span 60 mV (Typ) Easy to Use Chip Carrier Package Options Ratiometric to Supply Voltage Absolute, Differential and Gauge Options Application Examples • Pump/Motor Controllers • • • • • • Robotics Leve"ndicators Medical Diagnostics Pressure Switching Barometers Altimeters 1 Ground MAXIMUM RATINGS Rating Overpressure(S) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature DIFFERENTIAL PORT OPTION BASIC CHIP CARRIER ELEMENT CASE 344-GS Style 1 I I CASE352~2 Style 1 Pin Number 2 3 I Vs +Vout I I I 4 -Vout Symbol Pmax Value 400 Unit kPa Pburst Tstg TA 2000 -50 to +150 -40 to +125 kPa ·C ·C VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a schematic of the internal circuitry on the stand-alone pressure sensor chip. PIN2 "-.,..-----0 + Vou! PIN4 ' - - - - - 0 - Vout PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic REV5 2-14 Motorola Sensor Device Data MPX200 SERIES OPERATING CHARACTERISTICS (VS =3.0 Vdc, TA =25'C unless otherwise noted, PI > P2) Symbol Min Typ Max Pressure Range(l) Characteristic POP 0 - 200 Unit kPa Supply Voltage(2) Vs - 3.0 6.0 Vdc - 6.0 - mAdc VFSS 45 60 90 mV Voff 0 20 35 mV Sensitivity AV/AP - 0.3 - mV/kPa Linearity(5) -0.25 - 0.25 - ±0.1 Temperature Hysteresis(5) (-40'C to +125'C) - - ±0.5 - Temperature Coefficient of Full Scale Span(5) TCVFSS -0.22 - -0.16 TCVoff - ±15 - I1V/'C TCR 0.21 0.27 %lin/'C 550 n n Supply Current 10 Full Scale Span(3) Offset(4) Pressure Hysteresis(5) (0 to 200 kPa) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Inpullmpedance Output Impedance Zin 400 Zout 750 ±0.5 - 1800 %VFSS %VFSS %VFSS %VFSS/'C Response Time(6) (10% to 90%) tR Offset Stability(5) - - Symbol Min Typ Max Unit - - 2.0 Grams 15 - - 0.01 IN3 0.001 IN3 690 kPa 1.0 ms %VFSS MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344) Warm-Up Cavity Volume Volumetric Displacement Common Mode Line Pressure(7) - Sec NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratio metric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25'C. Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85'C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative • TcOffset: to 25'C. • TCR: lin deviation with minimum rated pressure applied, over the temperature range of -40'C to +125'C, relative to 25'C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-15 MPX200 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 2). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the ''worse case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. TEMPERATURE COMPENSATION Figure 3 shows the typical output characteristics of the MPX200 series over temperature. The output is directly proportional to the pressure and is essentially a straight line. The X-ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX2200/MPX7200 series sensors. Several approaches to external temperature compensation over both -40 to +125°C and 0 to +80°C ranges are presented in Motorola Applications Note AN840. 70~------------------------~ LINEARITY 60 70 - :g 60 - 50 - I I I I VS=3.0Vdc Pl >P2 5 g: 1/ .VI L l/ I;'"" g40 5 - i-1-4~ocIL ./ - i-- .,I;'"" 30 I.<'".: 20 , 10 OFFSET (VOFF) °O~~~~~~~~~~~~~~M~AA~r-P·Op PRESSURE (kPA) Figure 2. Linearity Specification Comparison SILICONE GEL DIE COAT OIFFERENTIAUGAUGE STAINLESS STEEL DIE METAL COVER ~ I:l"" "'" +250C ....t"" +125°C , 1;'""' ="'" tSPAN RANGE (TYP) 1 OFFSET (TYP) 16 20 1 124 28 30 0 14.0 8.0 1 12 PSI 20 40 60 80 100 120 140 160 180 200 kPa PRESSURE DIFFERENTIAL Figure 3. Output versus Pressure Differential SILICONE GEL ABSOLUTE DIE COAT DIE ~~~~:j~=:::~~~ THERMOPLASTIC CASE WIRE BOND --:~~?2~;c5::=:::~7J~ ~ LL...O:...c.....<:..L.L.L..L..II DIFFERENTIAUGAUGE ELEMENT P2 """:...c....<.L.L...c...L..P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P 1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPX200A, MPX2000 344-08 Stainless Steel Cap MPX2000P 352-02 Side with Part Marking MPX200AP, MPX200GP 350-03 Side with Port Attached MPX200GVP 350-·04 Stainless Steel Cap MPX200AS, MPX200GS 371-06 Side with Port Attached MPX200GVS 371-05 Stainless Steel Cap MPX200ASX, MPX200GSX 371C-02 Side with Port Attached MPX200GVSX 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Basic Element Absolute, Differential Case 344-08 Ported Elements Differential Absolute, Gauge Order Number Device Marking MPX200A MPX200D MPX200A MPX200D Case 352-02 MPX200DP MPX200DP Case 350-03 MPX200AP MPX200GP MPX200AP MPX200GP Gauge Vacuum Case 350-04 MPX200GVP MPX200GVP Absolute, Gauge Stove Pipe Case 371-06 MPX200AS MPX200GS MPX200A MPX200D Gauge Vacuum Stove Pipe Case 371-05 MPX200GVS MPX200D Absolute, Gauge Axial Case 371 C-02 MPX200ASX MPX200GSX MPX200A MPX200D Gauge Vacuum Axial Case 3710-02 MPX200GVSX MPX2000 Motorola Sensor Device Data 2-17 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 700 kPa (0 to 100 PSI) Uncompensated, Silicon Pressure Sensors MPX700 SERIES The MPX700 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output - directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design. X-ducer™ SILICON PRESSURE SENSORS Features • • Low Cost Patented, Silicon Shear Stress Strain Gauge Design • Linearity to ± 0.5% (Max) Linearity • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • 60 mV Span (typical) • Absolute, Differential and Gauge Options Application Examples • Environmental Control Systems • Pneumatic Control Systems • Appliances • Automotive Performance Controls • Medicallnstrumentation • Industrial Controls BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~B CASE352~2 Style 1 Style 1 Pin Number I I 1 Ground MAXIMUM RATINGS Rating Symbol 2 +Vou! I 3 I Vs I I 4 -You! Value Unit Overpressure(B) (P1 > P2) Pmax 2BOO kPa Burs! Pressure(B) (P1 > P2) Pburst 5000 kPa Tstg -50to +150 TA -40to+125 ·C ·C Storage Temperature Operating Temperature VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. PIN2 1..-."...-----0 + Vou! PIN4 ' - - - - - 0 - Vout PINl Figure 1. Uncompensated Pressure Sensor Schematic REV3 2-18 Motorola Sensor Device Data MPX700 SERIES OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, PI > P2) Characteristic Pressure Range(l) Supply Voltage(2) Symbol Min POP 0 Full Scale Span(3) Offset(4) Sensitivity MPX700D MPX700A Unit 700 kPa 3.0 6.0 Vdc 10 6.0 - mAdc VFSS 45 60 90 mV Voff 0 20 35 86 - /lV/kPa 0.5 1.0 %VFSS %VFSS AV/AP Linearity(5) Max - - Vs Supply Current Typ - -0.5 -1.0 - mV Pressure Hysteresis(5) (0 to 700 kPa) - - ±0.1 - Temperature Hysteresis(5) (-40°C to +125°C) - - ±0.5 - %VFSS Temperature Coefficient of Full Scale Span(5) TCVFSS -0.21 -0.15 %VFSS/oC Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance - TCVoff - ±15 - /lV/oC TCR 0.34 - 0.4 %lin/oC lin 400 - 550 lout 750 - 1800 n n Response TIme(6) (10% to 90%) tR - 1.0 - ms Offset Stability(5) - - ±0.5 - %VFSS Min Typ - 2.0 MECHANICAL CHARACTERISTICS Characteristic Symbol Max Unit Warm-Up - - Sec - - 15 Cavity Volume - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 Common Mode Line Pressure(7) - - - 690 kPa Weight (Basic Element, Case 344) - Grams NOTES: 1. 1.0 kPa (kiioPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative • TcOffset: to 25°C. • TCR: lin deviation with minimum rated pressure applied, over the temperature range of -40°C to +125°C, relative to 25°C. 6. Response TIme is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-19 MPX700 SERIES TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX700 series over temperature. The X-ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components. 80 I I -40'C...... 70 r-- r- MPX700 _60 r-- r- Vs = 3 Vdc P1 >P2 -8 50 g 50 ~~ .." ~ I- :::> a. 40 ~ 30 ~ 20 ~ vy ~ ~25'C "+25'C I ':? ~ OFFSET (TYP) 10 o PSI 0 kPa T SPAN RANGE I 120 fO 140 280 160 420 ro 560 1~oT 700 PRESSURE DIFFERENTIAL Figure 2. Output versus Pressure Differential SILICONE GEL DIE COAT DIFFERENTIAUGAUGE DIE DIFFERENTIAUGAUGE ELEMENT Several approaches to external temperature compensation over both -40 to + 125°C and 0 to + BO°C ranges are presented in Motorola Applications Note AN84D. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = VOff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value). the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 70,-------------------------, LINEARITY :g- 50 g 40 5 go is 30 20 10 OFFSET (VOFF) °O~~~~~~~~~~~~~~M~AX~~PO~P PRESSURE (kPA) Figure 3. Linearity Specification Comparison SILICONE GEL ABSOLUTE DIE COAT DIE DIE BOND ABSOLUTE ELEMENT P2 P2 Figure 4. Cross-Sectional Diagrams (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX700 series pressure sensor operating character- 2-20 istics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX700 SERIES PRESSURE (P1)/vACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which protects the die from harsh media. The differential or gauge sensor is designed to operate with positive differential presPart Number sure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table on the below: Case Type Pressure (P1) Side Identifier MPX700A, MPX700D 344-08 Stainless Steel Cap MPX700DP 352-02 Side with Part Marking MPX700AP, MPX700GP 350-03 Side with Port Attached MPX700GVP 350-04 Stainless Steel Cap MPX700AS, MPX700GS 371-06 Side with Port Attached MPX700GVS 371-05 Stainless Steel Cap MPX700ASX, MPX700GSX 371C-02 Side with Port Attached MPX700GVSX 371D-02 Stainless Steel Cap ORDERING INFORMATION MPX700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential Case 344-08 MPX700A MPX700D MPX700A MPX700D Ported Elements Differential Case 352-02 MPX700DP MPX700DP Absolute, Gauge Case 350-03 MPX700AP MPX700GP MPX700AP MPX700GP Gauge Vacuum Case 350-04 MPX700GVP MPX700GVP Absolute, Gauge Stove Pipe Case 371-06 MPX700AS MPX700GS MPX700A MPX700D Gauge Vacuum Stove Pipe Case 371-05 MPX700GVS MPX700D Absolute, Gauge Axial Case 371 C-02 MPX700ASX MPX700GSX MPX700A MPX700D Gauge Vacuum Axial Case 371 D-02 MPX700GVSX MPX700D Motorola Sensor Device Data 2-21 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 6 kPa Uncompensated, Silicon Pressure Sensors MPX906 SERIES The MPX906D series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output - directly proportional to the applied pressure. This standard, low cost, uncompensated pressure sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola's single element strain gauge design. It is designed for applications exposing the pressure (P2) side of the device to water, water vapor and soapy water vapor. X- P2) Pmaxl 100 kPa Overpressure(S) (P2 > Pl) Pmax2 10 kPa Tstg -40 to +125 °C TA -4010+125 °C Storage Temperature Operating Temperature VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The output voltage of the sensor increases with increasing pressure applied to the (P2) side relative to the pressure side (Pl). Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. I I 6 N/C PIN5 + Vou! ~..r------o PIN3 '-----0 - voul PIN2 Figure 1. MPX906 Pressure Sensor Schematic 2-22 Motorola Sensor Device Data MPX906 SERIES OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted) Characteristic Pressure Range(1) Symbol Min Typ Max POP 0 - 6.0 kPa 3.0 6.0 Vdc 6.0 - Supply Voltage(2) Vs - Supply Current 10 - Full Scale Span(3) Unit mAdc VFSS 9.0 20 32 Offset(4) Voff -40 -20 0 Sensitivity VIP 3.3 - mV/kPa - mV mV Linearity(5) - -0.5 - 2.0 %VFSS Pressure Hysteresis (0 to 6 kPa) (5) - - 0.1 - %VFSS Temperature Hysteresis (O°C to +85°C) (5) - - ±0.5 - Temperature Coefficient of Full Scale Span(5) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance TCVFSS TCVoff -0.22 - TCR 0.25 lin 400 lout 750 -18 0.30 -0.16 - %VFSS %VFSS/OC /lV/oC 0.35 %linl°C - 550 - 1875 n n Response Time (10% to 90%) (6) tR - 1.0 - ms Offset Stability(5) - - ±O.5 - %VFSS MECHANICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit - Grams - Sec Weight (Basic Element, Case 867) - Warm-Up - - 15 Cavity Volume - - - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 - 4.0 NOTES: 1. 1.0 kPa (kiioPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Output deviation from a straight line relationship with pressure, using end point method, over the specified • Linearity: pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative • TcOffset: to 25°C. lin deviation with minimum rated pressure applied, over the temperature range of -40°C to + 125°C, • TCR: relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case--to--Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-23 MPX906 SERIES TEMPERATURE COMPENSATION Figure 2 shows the output characteristics of the MPX906D series at 25°C. The X-ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components. Several approaches to external temperature compensation over both -40 to + 125°C and 0 to + BO°C ranges are presented in Motorola Applications Note ANB40. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voll + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end pOint straight line fit or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 70 0- i ~ :g -5 50 g 40 I::> -10 13 30 I::> 0 LINEARITY 60 O·C 0 -15 20 10 -25 0 ~--....L10-0--20....0--3....L0-0- - 4.... 00--..... 50-0---'600 PRESSURE DIFFERENTIAL (mmH20) Figure 2. Output versus Pressure Differential OFFSET (VOFF) -'--'--'--'--'-~~~~~~~~....LM..... A~X-.-P·OP °o. . PRESSURE (kPA) Figure 3. Linearity Specification Comparison AMBIENT (P1) SIDE STAINLESS STEEL METAL COVER EPOXY CASE Figure 4. Cross-Sectional Diagram (not to scale) 2-24 Motorola Sensor Device Data MPX906 SERIES SOAPY WATER VAPOR COMPATIBILITY The compatibility of this product to Soapy Water Vapor has been verified by the reliability sample test method shown in Figure 5. Samples were tested with bias for 504 hours and evaluated to specification after completion of this vapor exposure. Contact factory for details on liquid exposure compatibility testing. OUT Test Conditions: TA = 75°C Vsupply = 6 Volts Solution: 25 grams detergent and 50 milliliters bleach per liter of Phoenix tap water. Detergent and bleach brand names selected per UL specification #UL2157 Electric Clothes Washing Machines and Extractors Devices exposed to vapors 5 cm above liquid. TA = 75°C MEDIAUQUID Figure 5. Vapor Test Method ORDERING INFORMATION MPX906D series pressure sensors are available in basic element or ported configurations, which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 867-{)4 MPX906D MPX906D Ported Element Gauge Axial Case 867H-02 MPX906GVW MPX906D Motorola Sensor Device Data 2-25 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 10 kPa (0 to 1.45 PSI) On-Chip Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX2010 MPX2012 SERIES Motorola Preferred Devices The MPX2010 and MPX2012 series silioon piezoresistive pressure sensors provide a very .aoourate and linear voltage output - direotly proportional to the applied pressure. These sensors house a single monolithio silioon die with the strain gauge and thin-film resistor network integrated on eaoh ohip. The sensor is laser trimmed for preoise span, offset oalibration and temperature oompensation. X-ducer™ SILICON PRESSURE SENSORS Features • Temperature Compensated over DOC to +85°C • Full Soale Span Calibrated to 25 mV (typioal) • Unique Silioon Shear Stress Strain Gauge • ± 1.0% (Max) Linearity • Easy to use Chip Carrier Paokage Options • Ratiomelrio 10 Supply Voltage • Differential and Gauge Options Application Examples • Respiratory Diagnostios • Air Movement Control BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~8 CASE352~2 Style 1 Style 1 • Levellndioators • Controllers • Pressure Switohing Pin Number 1 Ground I I I I 2 +Vout 3 Vs I I 4 -Vout MAXIMUM RATINGS Rating Overpressure(S) (Pl > P2) Symbol Value Unit Pmax 75 kPa Pburst 100 kPa Storage Temperature Tstg -50 to +150 ·C Operating Temperature TA -40to+125 ·C Burst Pressure(S) (Pl > P2) Vs VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-duoer is direotly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor inoreases with inoreasing pressure applied to the pressure side (P1) relative to the vaouum side (P2). Similarly, output voltage inoreases as inoreasing vaouum is applied to the vaouum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal oirouitry on the stand-alone pressure sensor ohip. r-- I1 ----------, 3 THIN FILM X- P2) Symbol Min Typ Max Unit Pressure Range(l) POP 0 - 10 kPa Supply Voltage(2) Vs - 10 16 Supply Current 10 - 6.0 - mAdc VFSS 24 25 26 mV Voff -1.0 -1.5 - 1.0 1.5 mV Characteristic Full Scale Span(3) Offset(4) MPX2010 MPX2012 Vdc Sensitivity 1!"v/IlP - 2.5 - mV/kPa Linearity(5) - -1.0 - 1.0 %VFSS - ±0.1 - ±0.5 - %VFSS TCVFSS -1.0 %VFSS -1.0 - 1.0 TCVoff 1.0 mV Input Impedance Zin 1300 2550 Output Impedance Zout 1400 - 3000 n n %VFSS Pressure Hysteresis(5) (0 to 10 kPa) Temperature Hysteresis(5) (-40'C to +125'C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) %VFSS Response lime(6) (10% to 90%) tR - 1.0 Offset Stability(5) - - ±0.5 - Symbol Min Typ Max Unit - 2.0 - 15 - Grams Warm-Up - Cavity Volume - - - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 690 kPa ms MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344) Common Mode Line Pressure(?) Sec NOTES: 1. 1.0 kPa (kiioPascal) equals 0.145 psi. 2. Device is ratio metric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage atfull rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure. using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25'C. Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85'C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative • TcOffset: to 25'C. 6. Response lime is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. ? Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-27 MPX2010 MPX2012 SERIES ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 2 shows the output characteristics of the MPX201 0 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. I I 30 r-- Vs =10 Vdc TA =25°C 25 f-- Pl >P2 1 20 Mk 0.. ~ 10 5 ..... ~~ I ~ 15 a ~ ~ -5 kPa PSI TYP, ....... ~ ~ ~ ;;..-~~ ~ 'MIN 2.5 0.362 This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation. 5 0.725 7.5 1.09 STAINLESS STEEL METAL COVER StN RANGE I -ra;FSET 10 (TYP) 1.45 Figure 2. Output versus Pressure Differential Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010 series pressure sensor operating charac- P2 RTV DIE BOND Figure 3. Cross-Sectional Diagram (not to scale) teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. PRESSURE (% FULLSCALE) Figure 4. Linearity Specification Comparison 2-28 Motorola Sensor Device Data MPX2010 MPX2012 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which protects the die from harsh media. The Motorola MPX pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Part Number Pressure (P1) Side Identifier MPX2010D MPX2012D 344-08 Stainless Steel Cap MPX2010DP MPX2012DP 352-02 Side with Part Marking MPX2010GP MPX2012GP 350-03 Side with Port Attached MPX2010GVP MPX2012GVP 350-04 Stainless Steel Cap MPX2010GS MPX2012GS 371-06 Side with Port Attached MPX2010GVS MPX2012GVS 371-05 Stainless Steel Cap MPX2010GSX MPX2012GSX 371C-02 Side with Port Attached MPX2010GVSX MPX2012GVSX 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX2010 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 344-08 MPX2010D MPX2012D MPX2010D MPX2012D Ported Elements Differential Case 352-02 MPX2010DP MPX2012DP MPX2010DP MPX20120P Gauge Case 350-03 MPX2010GP MPX2012GP MPX2010GP MPX2012GP Gauge Vacuum Case 350-04 MPX2010GVP MPX2012GVP MPX2010GVP MPX2012GVP Gauge Stove Pipe Case 371-06 MPX2010GS MPX2012GS MPX2010D MPX2012D Gauge Vacuum Stove Pipe Case 371-05 MPX2010GVS MPX2012GVS MPX2010D MPX2012D Gauge Axial Case 371 C-02 MPX2010GSX MPX2012GSX MPX2010D MPX2012D Gauge Vacuum Axial Case 371 0-02 MPX2010GVSX MPX2012GVSX MPX2010D MPX2012D Motorola Sensor Device Data 2-29 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 50 kPa (0 to 7.25 PSI) On-Chip Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX2050 MPX2052 SERIES Motorola Preferred Devices The MPX2050 and MPX2052 series device is a silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. X-ducer™ SILICON PRESSURE SENSORS Features • Temperature Compensated Over O°C to + 85°C • Unique Silicon Shear Stress Strain Gauge • Full Scale Span Calibrated to 40 mV (typical) • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • Differential and Gauge Options Application Examples • Pump/Motor Controllers • Robotics • Levellndicators • Medical Diagnostics • Pressure Switching • Non-Invasive Blood Pressure Measurement DIFFERENTIAL PORT OPTION CASE 352-02 Style 1 BASIC CHIP CARRIER ELEMENT CASE 344-08 Style 1 Pin Number 1 Ground MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) I I Symbol Pmax I 2 3 I +Vout Vs I 4 I -Vout Value 200 Unit kPa Pburst 500 kPa Storage Temperature Tstg -50 to +150 °C Operating Temperature TA -40 to +125 ·C VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. Preferred devices are Motorola recommended choices for future use and best overall value. Vs r-- ----------,I 3 I THIN FILM I I2 TEMPERATURE I X-ducer COMPENSATION I SENSING I4 AND I ELEMENT L-+---1 CALIBRATION I I CIRCUITRY I1.. _ _ _ _ _ _ _ _ _ _ _ _ .JI Vout- 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic REV 4 2-30 Motorola Sensor Device Data MPX2050 MPX2052 SERIES OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 2S'C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit Pressure Range(1) Characteristic POP 0 - SO kPa Supply Voltage(2) Vs - 10 16 Vdc Supply Current 10 - 6.0 - mAdc mV Full Scale Span(3) MPX20S0, MPX20S2 VFSS 38.S 40 41.S Offset(4) MPX20S0, MPX20S2 Voff -1.0 - 1.0 0.8 - Sensitivity lNIAP Linearity(S) MPX20S0 MPX20S2 - -0.2S -O.SS - 0.2S 0.2S mV mV/kPa %VFSS Pressure Hysteresis(S) (0 to SO kPa) - - ±0.1 - %VFSS Temperature Hysteresis(S) (-40'C to +12S'C) - - ±O.S - %VFSS TCVFSS -1.0 - 1.0 %VFSS TCVoff -1.0 1.0 mV Zin 1000 2S00 Q Zout 1400 - 3000 Q - 1.0 - ms ±O.S - %VFSS Temperature Effect on Full Scale Span(S) Temperature Effect on Offset(S) Input Impedance Output Impedance Response TIme(6) (10% to 90%) tR Offset Stability(S) - MECHANICAL CHARACTERISTICS Min Typ Max Unit Weight (Basic Element Case 344) - - 2.0 Grams Characteristic Symbol Warm-Up - - 1S - Cavity Volume - - - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 - 690 kPa Common Mode Line Pressure(?) Sec NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.14S psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. S. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 2S'C. Output deviation, after 1000 temperature cycles, - 40 to 12S'C, and 1.S million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 8S'C, relative to 2S'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 8S'C, relative • TcOffset: t02S'C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. ? Common mode pressures beyond specified may result in leakage at the case-to-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-31 MPX2050 MPX2052 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. /1/ / / /1 V/ / ~ lND POINT yTRAIGHT LINE FIT 1 OFFSET 1 1 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the minimum, maximum and typical output characteristics of the MPX2050 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. :g §. 5D- 40 r35 I30 r25 20 B1510 kPa PSI -5 , 0 Vs =10 Vdc TA = 25°C MPX2050 P1 >P2 ...- ~ - TY\ ~ MAX, -0 0- ~ ~ " ~ 12.5 1.8 l"MIN 25 3.6 37.5 5.4 T STAINLESS STEEL METAL COVER SPAN RANGE lrn~ 50 7.25 (TYP) Figure 3. Output versus Pressure Differential Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2050 series pressure sensor operating charac- 2-32 The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. P2 RTV DIE BOND Figure 4. Cross-Sectional Diagram (not to scale) teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX2050 MPX2052 SERIES PRESSURE (P1)/vACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die. The Motorola MPX pressure sensor is Part Number MPX2050D MPX20510 designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPX2052D 344-08 Stainless Steel Cap MPX2050DP MPX20510P MPX2052DP 352-02 Side with Part Marking MPX2050GP MPX2051GP MPX2052GP 350-03 Side with Port Attached MPX2050GVP MPX2051GVP MPX2052GVP 350-04 Stainless Steel Cap MPX2050GS MPX2051GS MPX2052GS 371-06 Side with Port Attached MPX2050GVS MPX2051GVS MPX2052GVS 371-05 Stainless Steel Cap MPX2050GSX MPX2051GSX MPX2052GSX 371C-02 Side with Port Attached MPX2050GVSX MPX2051 GVSX MPX2052GVSX 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX2050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential 344-08 MPX2050D MPX2051D MPX2052D MPX2050D MPX2051D MPX2052D Ported Elements Differential 352-02 MPX2050DP MPX2051DP MPX2052DP MPX2050DP MPX2051DP MPX2052DP Gauge 350-03 MPX2050GP MPX2051GP MPX2052GP MPX2050GP MPX2051GP MPX2052GP Gauge Vacuum 350-04 MPX2050GVP MPX2051GVP MPX2052GVP MPX2050GVP MPX2051GVP MPX2052GVP Gauge Stove Pipe 371-06 MPX2050GS MPX2051GS MPX2052GS MPX2050D MPX2051D MPX2052D Gauge Vacuum Stove Pipe 371-05 MPX2050GVS MPX2051GVS MPX2052GVS MPX2050D MPX2051D MPX2052D Gauge Axial 371C-02 MPX2050GSX MPX2051GSX MPX2052GSX MPX2050D MPX2051D MPX2052D Gauge Vacuum Axial 371D-02 MPX2050GVSX MPX2051 GVSX MPX2052GVSX MPX2050D MPX20510 MPX2052D Motorola Sensor Device Data 2-33 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 100 kPa (0 to 14.5 PSI) On-Chip Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX2100 MPX2101 SERIES Motorola Preferred Devices The MPX21 00 and MPX21 01 series device is a silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. X-ducer™ SILICON PRESSURE SENSORS Features • Temperature Compensated Over O°C to +85°C • Unique Silicon Shear Stress Strain Gauge • Full Scale Span Calibrated to 40 mV (typical) • Easy to Use Chip Carrier Package Options • Available in Absolute, Differential and Gauge Configurations • Ratiometric to Supply Voltage Application Examples • Pump/Motor Controllers • • Robotics Level Indicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters BASIC CHIP CARRIER ELEMENT CASE34~8 DIFFERENTIAL PORT OPTION CASE 352-{)2 Style 1 Style 1 Pin Number 1 Ground MAXIMUM RATINGS I I I I 2 +Vout 3 Vs I 1 4 -Vout Symbol Value Unit Pmax 400 kPa Pburst 1000 kPa Storage Temperature Tsig -50to+150 ·C Operating Temperature TA -40 to +125 ·C Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. r-- I1 ----------,1 3 THIN FILM TEMPERATURE X-ducer ---..,----, COMPENSATION SENSING AND ELEMENT CALIBRATION I I I I1.. _ _ _ _ 12 Vout+ 1 I _ _ _ _ _ _ _ _ .JI 4 Vout- CIRCUITRY GND Preferred devices are Molorola recommended choices for future use and besl overall value. Figure 1. Temperature Compensated Pressure Sensor Schematic REV5 2-34 Motorola Sensor Device Data MPX2100 MPX2101 SERIES OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage(2) Symbol Min Typ Max POP 0 - 100 kPa 10 16 Vdc Vs Supply Current 10 Full Scale Span(3) MPX2100A, MPX21 000, MPX21 010 MPX2101A Offset(4) MPX2100D, MPX21010 MPX2100A MPX2101A MPX2100D MPX2100A MPX21010 MPX2101A VFSS mV Voff -1.0 -2.0 -3.0 - - 1.0 2.0 3.0 mV - 0.4 -0.25 -1.0 -0.5 -2.0 - 0.25 1.0 0.5 2.0 ±0.1 - %VFSS ±0.5 - %VFSS 1.0 %VFSS 1.0 mV 2500 n n - - - Input Impedance Output Impedance mAdc 41.5 42.5 Pressure Hysteresis(5) (0 to 100 kPa) Temperature Effect on Offset(5) - 40 40 Temperature Hysteresis(5) (-40°C to +125°C) Temperature Effect on Full Scale Span(5) 6.0 38.5 37.5 IlV/IlP Sensitivity Linearity(5) - Unit - TCVFSS -1.0 TCVoff -1.0 Zin 1000 Zout 1400 - - 3000 mV/kPa %VFSS - 1.0 - ms ±0.5 - %VFSS Symbol Min Typ - - Response Time(6) (10% to 90%) tR Offset Stability(5) - MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344) Max Unit - Grams 15 - Sec - - 0.01 IN3 - - - - - Cavity Volume - Volumetric Displacement Common Mode Line Pressure(7) Warm-Up 2.0 0.001 IN3 690 kPA NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, aiter the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, aiter 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative • TcOffset: to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-35 MPX2100 MPX2101 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. f STRAIGHT LINE DEVIATION t OFFSET 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. Figure 3 shows the output characteristics of the MPX21 00 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 1 1 .J' 40 VS=10Vdc ~ TA= 25°C 35 1 ~ ..... _ :g 30 _ Pl>P2 I- TY~ SPAN ~ ..... I :§. 25 - I - MAX, RANGE ~ ~ 20 T ~ 15 o 10 5 kPa PSI -5 I ~~ c.. , ~ ?P "MIN 'I I 25 3.62 0 50 75 7.25 10.B7 tOFFSET 100 (TYP) 14.5 Figure 3. Output versus Pressure Differential SILICONE GEL DIE COAT DIFFERENTIAUGAUGE DIE DIFFERENTIAUGAUGE ELEMENT P2 SILICONE GEL ABSOLUTE DIE COAT DIE ABSOLUTE ELEMENT P2 Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2100 series pressure sensor operating charac- 2-36 teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX2100 MPX2101 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Part Number MPX2100A MPX2100D MPX2101A MPX2100DP MPX2100AP MPX2101DP MPX2100GP MPX2101AP MPX2100GVP MPX2100AS MPX2101AS MPX2100GVS MPX2100ASX MPX2101GP MPX2101GVP MPX2100GS MPX2101GS MPX2101GVS MXP2100GSX MPX2101ASX MPX2100GVSX Pressure (P1) Side Identifier Case Type MPX2101D MXP2101GSX MPX2101GVSX 344-08 Stainless Steel Cap 352-02 Side with Part Marking 350-03 Side with Port Attached 350-04 Stainless Steel Cap 371-06 Side with Port Attached 371-05 Stainless Steel Cap 371C-02 Side with Port Attached 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential Case 344-08 MPX2100A MPX21 000 MPX2101A MPX2101D MPX2100A MPX21 000 MPX2101A MPX2101D Ported Elements Differential Case 352-02 MPX2100DP MPX2101DP MPX2100DP MPX2101DP Absolute, Gauge Case 350-03 MPX2100AP MPX2100GP MPX2101AP MPX2101GP MPX2100AP MPX2100GP MPX2101AP MPX2101GP Gauge Vacuum Case 350-04 MPX2100GVP MPX2101GVP MPX2100GVP MPX2101GVP Absolute, Gauge Stove Pipe Case 371-06 MPX2100AS MPX2100GS MPX2101AS MPX2101GS MPX2100A MPX210DD MPX2101A MPX2101D Gauge Vacuum Stove Pipe Case 371-05 MPX2100GVS MPX2101GVS MPX2100D MPX21D1D Absolute, Gauge Axial Case 371 C-02 MPX21 DOASX MPX2100GSX MPX2101ASX MPX2101GSX MPX2100A MPX21DDD MPX2101A MPX2101D Gauge Vacuum Axial Case 371 0-02 MPX2100GVSX MPX2101GVSX MPX2100D MPX2101D Motorola Sensor Device Data 2-37 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 200 kPa (0 to 29 PSI) On-Chip Temperature Compensated & Calibrated, Pressure Sensors MPX2200 MPX2201 SERIES Motorola Preferred Devices The MPX2200 and MPX2201 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc. Features • Temperature Compensated Over O°C to +85°C • Patented Silicon Shear Stress Strain Gauge • ±O.25% Linearity (MPX2200D) • Easy to Use Chip Carrier Package • Available in Absolute, Differential and Gauge Configurations X-clucer"M SILICON PRESSURE SENSORS Application Examples • Pump/Motor Controllers • Robotics • Levellndicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~8 CASE352~2 Style 1 Style 1 Pin Number 1 Ground MAXIMUM RATINGS I I I J 2 +Vout 3 j 4 Vs j -Vout Symbol Value Unit Overpressure(8) (PI> P2) Pmax 400 kPa Burst Pressure(8) (PI> P2) Pburst 2000 kPa Tstg -50 to +150 TA -40 to +125 ·C ·C Rating Storage Temperature Operating Temperature VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. Vs r-- I1 X-ducer 1 SENSING ----------,1 3 _..r---. 1ELEMENT '-+--1 1 1 1... _ _ _ _ THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 12 Vout. 1 4 1 _ _ _ _ _ _ _ _ .J1 1 GND Preferred devices are Motorola recommended choices for future use and best overall value. Figure 1. Temperature Compensated Pressure Sensor Schematic REV 6 2-38 Motorola Sensor Device Data MPX2200 MPX2201 SERIES OPERATING CHARACTERISTICS (VS = 10 Vdc, TA =25'C unless otherwise noted, P1 > P2) Characteristics Pressure Range(1) Symbol Min Typ Max Unit POP 0 - 200 kPa - 10 16 6.0 - VFSS 38.5 37.5 40 40 41.5 42.5 mV Voff -1.0 -2.0 -3.0 - - 1.0 2.0 3.0 mV I!.VII!.P - 0.2 Supply Voltage Vs Supply Current 10 Full Scale Span(3) MPX2200A, MPX2200D, MPX2201 D MPX2201A Offset(4) MPX2200A, MPX2200D MPX2200A MPX2201A Sensitivity Linearity(5) MPX2200D MPX2200A MPX2201D MPX2201A - -0.25 -1.0 -0.5 -2.0 - - 0.25 1.0 0.5 2.0 Vdc mAdc mV/kPa %VFSS Pressure Hysteresis(5) (0 to 200 kPa) - - ±0.1 - %VFSS Temperature Hysteresis(5) (-40'C to +125'C) - - ±0.5 - %VFSS TCVFSS -1.0 1.0 %VFSS TCVolt -1.0 - 1.0 mV lin 1300 - 2500 Q lout 1400 - 3000 Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) tR Offset Slability(5) - - 1.0 ±0.5 - Q ms %VFSS MECHANICAL CHARACTERISTICS Characteristics Weight, (Basic Element Case 344) Warm-Up Cavity Volume Volumetric Displacement Common Mode Line Pressure(7) Symbol - Min - - Typ 2.0 15 - Max - Unit Grams Sec 0.01 IN3 0.001 IN3 690 kPa NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25'C. • Offset Stability: Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85'C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative • TcOffset: to 25'C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-39 MPX2200 MPX2201 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the ''worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. f STRAIGHT LINE DEVIATION t OFFSET o 100 PRESSURE (% FULLSCALE) Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2200 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. VS=10Vdc TA = 25°C Pl >P2 40 35 :g g !3 ./ 30 25 f - f- Mlx "20 § 15 10 ~ a:::- 25 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. # 50 7.25 ~ ~" TYP, ~~ ~ ~ 100 14.5 125 SPAN RANGE J ~IN 75 T 150 21.75 175 L 200 OFFSET 29 PRESSURE Figure 3. Output versus Pressure Differential SILICONE GEL DIE COAT DIFFERENTIAUGAUGE DIE DIFFERENTIAUGAUGE ELEMENT P2 SILICONE GEL ABSOLUTE DIE COAT DIE DIE BOND ABSOLUTE ELEMENT P2 DIE BOND Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2200 seilss Pi6SSUi8 senSOi opsiating chaiac- 2-40 teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX2200 MPX2201 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die from harsh media. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Case Type Part Number MPX2200A MPX2200D MPX2201A MPX2200GP MPX2201AP MPX2200DP MPX2200AP MPX2201DP MPX2200GVP MPX2200AS MPX2201GP MPX2201GVP MPX2200GS MPX2201AS MPX2201GS MPX2201GVS MPX2200GVS MPX2200ASX MPX2201D MPX2200GSX MPX2201ASX MPX2200GVSX MPX2201GSX MPX2201GVSX 344-08 Pressure (P1) Side Identifier Stainless Steel Cap 352-02 Side with Part Marking 350-03 Side with Port Attached 350-04 Stainless Steel Cap 371-06 Side with Port Attached 371-05 Stainless Steel Cap 371G-02 Side with Port Attached 371D-02 Stainless Steel Cap ORDERING INFORMATION MPX2200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSerles Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential Case 344-08 MPX2200A MPX2200D MPX2201A MPX2201D MPX2200A MPX2200D MPX2201A MPX2201D Ported Elements Differential Case 352-02 MPX2200DP MPX2201DP MPX2200DP MPX2201DP Absolute, Gauge Case 350-03 MPX2200AP MPX2200GP MPX2201AP MPX2201GP MPX2200AP MPX2200GP MPX2201AP MPX2201GP Gauge Vacuum Case 350-04 MPX2200GVP MPX2201GVP MPX2200GVP MPX2201GVP Absolute, Gauge Stove Pipe Case 371-06 MPX2200AS MPX2200GS MPX2201AS MPX2201GS MPX2200A MPX2200D MPX2201A MPX2201D Gauge Vacuum Stove Pipe Case 371-05 MPX2200GVS MPX2201GVS MPX2200D MPX2201D Absolute, Gauge Axial Case 371 C-02 MPX2200ASX MPX2200GSX MPX2201ASX MPX2201GSX MPX2200A MPX2200D MPX2201A MPX2201D Gauge Vacuum Axial Case 371 0-02 MPX2200GVSX MPX2201GVSX MPX2200D MPX220tD Motorola Sensor Device Data 2-41 MOTOROLA SEMICONDUCTOR TECHNICAL DATA Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications MPX2300D Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Motorola's unique sensor die with its patented, piezoresistive implant technology, along with the added feature of on--chip, thin-film temperature compensation and calibration. PRESSURE SENSORS Features: • • Low Cost Patented piezoresistive strain gauge implant, temperature compensation and calibration all integrated on a single, monolithic sensor die. • Pressure Range Available: 0-300 mmHg • Polysulfone (Mindell 8-1000) Case Material (Medical, Class VI Approved) CHIP PAK ELEMENT CASE 423-03 Style 1 Motorola is offering the Chip Pak option package. Application-specific parts will have an "SPX" prefix, followed by a four digit number, unique to the specific customer. Devices will be shipped in a tape and reel packaging. NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. Pin Number, Style 1 J I 1 Vs MAXIMUM RATINGS I 3 I 4 I S- I Ground Pmax Value 125 Burst Pressure Pburst 1000 kPa Supply Voltage VSmax 10 Vdc Rating Overpressure (Backside) Symbol 2 S+ Unit PSI Storage Temperature Tstg 85 ·C Operating Temperature TA +15 to +40 ·C Motorola's MPX2300D Pressure Sensors. Motorola'S MPX2300D pressure sensor has been designed for medical usage by combining the performance of Motorola'S shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, A silicone dielectric gel that has been used extensively in implants covers the silicon piezoresistive sensing element. The gel is a nontoxic, non allergenic polymer system which passes pyrogen testing, as well as meeting all USP XX Biological Testing Class VI requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room intracutaneous test in rabbits, and system toxicity, USP. lights from affecting the performance of the sensor. REV 1 2--42 Motorola Sensor Device Data MPX2300D OPERATING CHARACTERISTICS (VS = 6 Vdc, TA = 25°C unless otherwise noted) Symbol Min Pressure Range POP 0 - Supply Voltage(8) Vs - 6.0 10 Supply Current 10 - 1.0 - Characteristics Typ Max Unit 300 mmHg Vdc mAdc Zero Pressure Offset Voff - 0.75 mV Sensitivity - 4.95 5.0 5.05 f.lVN/mmHg VFSS 2.976 3.006 3.036 mV - -2.0 - 2.0 TCS -0.1 - +0.1 %/oC TCVFSS -0.1 - +0.1 %/oC TCVoff -9.0 - +9.0 f.lV/oC Zin 1800 - 4500 n Output Impedance Zout 270 - 330 n RCAl (150 kn)(9) RCAl 97 100 103 mmHg Response Time(5) (10%t090%) tR - 1.0 - Full Scale Span(1) Linearity + Hysteresis Temperature Effect on Sensitivity Temperature Effect on Full Scale Span Temperature Effect on Offset(4) Input Impedance -0.75 ms Temperature Error Band - 0 - 85 °C Stability(6) - - ±0.5 - %VFSS Min Typ Max Unit MECHANICAL CHARACTERISTICS Characteristics Weight (Case 423) Warm-Up Symbol - - 170 - 15 - mg Sec NOTES: 1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset. 2. Maximum deviation from end-point straight line fit at 0 and 300 mmHg. 3. Slope of end-point straight line fit to full scale span at O°C and +85°C relative to +25°C. 4. Slope of end-point straight line fit to zero pressure offset at O°C and +85°C relative to +25°C. 5. For a 0 to 300 mmHg pressure step change. 6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +1 O°C to +85°C after: a. 1000 temperature cycles, -40°C to +125°C. b. 1.5 million pressure cycles, 0 to 300 mmHg. 7. Operating characteristics based on positive pressure differential relative to the vacuum side (gauge/differential). 8. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above + 10 V may induce additional error due to device self-heating. 9. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to Vs and S+ output. Motorola Sensor Device Data 2-43 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 700 kPa (0 to 100 PSI) High Pressure, Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX2700 SERIES The MPX2700 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network Integrated on-chip. The sensor is laser trimmed for precise span and offset calibration and temperature compensation. X-ducer™ SILICON PRESSURE SENSORS Features • Unique Silicon Shear Stress Strain Gauge • ±0.5% Linearity • Full Scale Span Calibrated to 40 mV • Easy to Use Chip Carrier Package • Basic Element, Single and Dual Ported Devices Available • Available in Differential and Gauge Configurations Application Examples • Pump/Motor Controllers • Pneumatic Control • lire Pressure Gauges • Robotics • Medical Diagnostics • Pressure Switching • Hydraulics DIFFERENTIAL PORT OPTION CASE 352-{)2 Style 1 BASIC CHIP CARRIER ELEMENT CASE 344-08 Style 1 Pin Number 1 Ground MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature I I I 2 I 3 I +Voul Vs 4 I -Vout Symbol Value Unit Pmax 2800 kPa Pbursl 5000 kPa Tstg -50 to +150 DC TA -4010+125 DC Vs VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The output vollage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. ----------,I 3 r-- I I I X-ducer I SENSING I ELEMENT I IL. _ _ _ _ THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY I2 Vout+ 14 I Vout- _ _ _ _ _ _ _ _ .JI 1 GND ...._.. ~=_ '-I~"'11IW' I. "1"_ _ .. "" ......+....... ,..,,_ ... ft"'~""'+ft" 19'1I1...,.... U.WI'IIiii' _""111 .... "" ............-... Pressure Sensor Schematic REV1 2-44 Motorola Sensor Device Data MPX2700 SERIES OPERATING CHARACTERISTICS (VCC = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit Pressure Range(1) POP 0 - 700 kPa Supply Voltage(2) Vs - 10 16 Vdc Supply Current 10 - 6.0 - mAdc VFSS 38.5 40 41.5 mV Voff -1.0 - 1.0 Sensitivity tMI:>.P - 0.057 Linearity(5) - -0.5 - TCVFSS Characteristic Full Scale Span(3) Offset(4) Pressure Hysteresis(5) (0 to 700 kPa) Temperature Hysteresis(5) (-40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance mV - mV/kPa - 0.5 %VFSS ±0.1 ±0.5 - -1.0 - 1.0 %VFSS TCVoff -1.0 - 1.0 mV Zin 1300 4000 Zout 1400 - n n 3000 %VFSS %VFSS Response Time(6) (10% to 90%) tR - 1.0 - ms Offset Stability(5) - - ±0.5 - %VFSS MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344) Symbol Min Typ - - 2.0 Max - Unit Grams Warm-Up - - 15 - Sec Cavity Volume - - - 0.01 Cubic In 0.001 Cubic In 690 kPa Volumetric Displacement Common Mode Line Pressure(7) NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Output deviation from a straight line relationship with pressure, using end point method, over the specified • Linearity: pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative • TcOffset: to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-45 MPX2700 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit (see Figure 3). While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the ''worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. OFFSET M PRESSURE (% FULLSCALE) 1M Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2700 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 50 I 40 - I VS=10V TA=25°C P1 >P2 L /. ~ TYP MAX.,- ~~ ~~ .4i ~ 10 4 " h ~ ~ -5 PSI kPa 20 140 40 280 '" tiN 60 420 T SPAN RANGE ~p- .tf!P 80 560 I RTV DIE BOND ft 10 700 OFFSET Figure 3. Output versus Pressure Differential Figure 4 shows the cross section of the Motorola MPX pressure sensor die in the chip carrier package. A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. MPX2700 series pressure sensor operating characteristics and internal reli- 2-46 The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. THERMOPLASTIC CASE Figure 4. Cross-Section of Differential Pressure Sensor Die in Its Basic Package (Not to Scale) ability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX2700 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which protects the die from harsh media. The Motorola MPX presPart Number sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (PI) Side Identifier Case Type MPX2700D 344-08 Stainless Steel Cap MPX2700DP 352-02 Side with Part Marking MPX2700GP 350-03 Side with Port Attached MPX2700GVP 350-04 Stainless Steel Cap MPX2700GS 371-06 Side with Port Attached MPX2700GVS 371-05 Stainless Steel Cap MPX2700GSX 371C-02 Side with Port Attached MPX2700GVSX 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX27DO series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 344-08 MPX2700D MPX2700D Ported Elements Differential Case 352-02 MPX2700DP MPX2700DP Gauge Case 350-03 MPX2700GP MPX2700GP Gauge Vacuum Case 350-04 MPX2700GVP MPX2700GVP Gauge Stove Pipe Case 371-06 MPX2700GS MPX2700D Gauge Vacuum Stove Pipe Case 371-05 MPX2700GVS MPX2700D Gauge Axial Case 371 C-02 MPX2700GSX MPX2700D Gauge Vacuum Axial Case 371 D-02 MPX2700GVSX MPX2700D Motorola Sensor Device Data 2-47 MOTOROLA SEMICONDUCTOR TECHNICAL DATA Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, 0.25 V to 4.9 V Output, Temperature Compensated & Calibrated MPX4100 MPX4101 SERIES Motorola Preferred Devices The Motorola MPX41 00N41 01 A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. Motorola's MAP sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Motorola MAP sensor a logical and economical choice for the automotive system designer. 4100A: 20-105 kPa 4101A: 15-102 kPa X-ducer™ SILICON PRESSURE SENSOR Features • 1.8% Maximum Error Over 0-85°C • Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems • Ideally Suited for Direct Microprocessor Interfacing • Patented Silicon Shear Stress Strain Gauge • Temperature Compensated Over -40 to + 125°C • Durable Epoxy Unibody Element • Ideal for Non-Automotive Applications, Too CASE 867-{)4 Style 1 MAXIMUM RATINGS (Tc = 25·C unless otherwise noted) Rating Overpressure(7) (P1 > P2) Symbol Value Unit Pmax 400 kPa Burst Pressure(7) (P1 > P2) Pburst 1000 kPa Storage Temperature Tstg -50 to +150 ·C Operating Temperature TA -40 to +125 ·C The MPX4100N4101A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor, with its patented X-ducer, combines advanced micromachining techniques, thin film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. A vacuum is sealed behind the sensor diaphragm providing a reliable pressure reference. (See Figure 2.) Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone pressure sensing chip. Pin Number I 2 I Vout I Ground I I I I I I I 3 4 5 6 N/C N/C N/C Vs NOTE: Pins 4, 5 and 6 are Internal device connections. Do not connect to external circuitry or ground. 1 r------I I I X-ducer I SENSING I ELEMENT IL.. _ _ _ _ 3 ----------,I THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I 1 VOUI I _ _ _ _ _ _ _ _ _ _ _ _ ..1I 2 PINS 4, 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic Preferred devices are Motorola recommended choices for fUlure use and best overall value. REV2 2-48 Motorola Sensor Device Data MPX4100 MPX4101 SERIES MPX4100A SERIES OPERATING CHARACTERISTICS (VS = 5 1 Vdc TA = 25'C unless otherwise noted, PI > P2) Symbol Min Max Unit POP 20 - 105 kPa Supply Voltage (1) Vs 4.85 5.1 5.35 Vdc Supply Current 10 - 7.0 10 mAdc V Characteristic Pressure Range Typ Full Scale Span (2) (0 to 85'C) VFSS 4.510 4.591 4.672 Offset (3) (0 to 85'C) Voff 0.225 0.306 0.388 t;V/t;P Sensitivity Accuracy (4) (0 to 85'C) Response Time (5) Output Source Current at Full Scale Output - 54 - V mV/kPa - - - tR - 1.0 - ms 10+ - 0.1 - mA ±1.8 %VFSS MECHANICAL CHARACTERISTICS Characteristic Symbol Min Typ - 4.0 - Grams Warm-Up Time - 15 - Sec Cavity Volume - - 0.01 IN3 Volumetric Displacement - - Common Mode Line Pressure (6) - - - Weight, Basic Element (Case 867) Max Unit 0.001 IN3 690 kPa NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25'C. Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of ato 85'C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of ato 85'C, relative to • TcOffset: 25'C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25'C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 1. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-49 MPX4100 MPX4101 SERIES MPX4101A SERIES OPERATING CHARACTERISTICS (VS = 51 Vdc, TA = 25°C unless otherwise noted, PI> P2) Characteristic Pressure Range Supply Voltage (1) Supply Current Symbol Min Typ Max POP 15 - 102 kPa Vs 4.85 5.1 5.35 Vdc - Unit 7.0 10 mAdc Full Scale Span (2) (0 to 85°C) VFSS 4.618 4.700 4.782 V Offset (3) (0 to 85°C) Voff 0.171 0.252 0.333 V IJ.V/IJ.P 54 - mV/kPa - - - ±1.8 %VFSS tR - 1.0 - ms 10+ - 0.1 - mA Symbol Min Typ Max Unit 4.0 - Grams 10 Sensitivity Accuracy(4) (0 to 85°C) Response Time (5) Output Source Current at Full Scale Output MECHANICAL CHARACTERISTICS Characteristic Weight, Basic Element (Case 867) - Warm-Up Time Volumetric Displacement - - Common Mode Line Pressure (6) - - Cavity Volume 15 - Sec 0.01 IN3 0.001 IN3 690 kPa NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage atfull rated pressure and the output voltage althe minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to • TcOffset: 25°C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. 2-50 Motorola Sensor Device Data MPX4100 MPX4101 SERIES SENSOR OUTPUT (PIN 1) FLUORO SILICONE GELDIE COA EPOXY PLASTIC CASE LEAD FRAME 51 k J,LPROCESSOR DIE BOND ABSOLUTE ELEMENT SEALED VACUUM REFERENCE AID P2 Figure 3. Typical Decoupling Filter for Sensor to Microprocessor Interface Figure 3 shows a typical decoupling circuit for interfacing Figure 2. Cross Sectional Diagram (Not to Scale) Figure 2 illustrates an absolute sensing configuration package in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX41 OOA series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. 5.0 ~ I -'M1x TRANSFER FUNCTION: Vout = Vs' (.01059·P-.152) ± Error e!~ Vs = 5.1 Vdc ~p TYP TEMP = 0 to 85°C ~p 20 kPA TO 105 kPA MPX4100A .d.~ 4.5 4.0 I ~ >:::> 3.5 3.0 0.. 2.5 0 2.0 the output of the integrated map sensor to the AID input of a microprocessor. Figures 4 and 5 show the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over a to 85°C temperature range. (Output may be nonlinear outside of the rated pressure range.) IA~ 1.5 ~-r 1.0 0.5 F'" - ~ e ~;MII Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure 6.0 £i' ~ >- :::> 0.. TRANSFER FUNCTION: 5.0 r- Vout = Vs· (.01 059·P-.l 09) ± Error JMl "~ Vs = 5.1 Vdc 4.0 TEMP = 0 to 85°C I- 15 kPA TO 102 kPA MPX4101A 3.0 1\ I::;;: ~ >:::> 0 2.0 1.0 0.0 I:: 1== ~ I:;;: ~ ~~ ~ ~ ~ ~I:::: k:c; ~~ ¢ ¢~ ~P ~n ~o~o~o~o~o~o~o~o~o~o~ ~~NNMMvv~~~w~~oooomm~~ Pressure (ref: to sealed vacuum) in kPa Figure 5. Output versus Absolute Pressure Motorola Sensor Device Data 2-51 MPX4100 MPX4101 SERIES Transfer Function (MPX4100A) - - - - - - - - - - - - - - - - - - - - - - - , Nominal Transfer Value: Vout = Vs (P x 0.01059 - 0.1518) +/- (Pressure Error x Temp. Factor x 0.01059 x VS) Vs = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4100A Series 4.0 Break Points 3.0 Temperalure Error Factor 2.0 Temp Mulliplier -40100 01085 85 to 125 3 1 3 1.0 0.0 -40 -20' 0 20 40 60 80 100 120 140 Temperature in C· Pressure Error Band Error Limits for Pressure 3.0 2.0 ;f ~ g w i!! ~ 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 D.. -2.0 -3.0 2-52 Pressure Error (Max) 20 to 105 (kPa) ± 1.5 (kPa) Motorola Sensor Device Data MPX4100 MPX4101 SERIES Transfer Function (MPX4101A) - - - - - - - - - - - - - - - - - - - - - - - , Nominal Transfer Value: Vout = Vs (P x 0.01059 - 0.10941) +/- (Pressure Error x Temp. Factor x 0.01059 x VS) Vs = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4101A Series Break Points 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier -40toO oto 85 85 to 125 3 1 3 1.0 0.0 _--'-_........_ _'--_...L.-_-'-_--L_ _'-_-'--_--'-_---'_ _"'-40 -20 20 40 60 80 100 120 140 Temperature in ·C Pressure Error Band Error Limits for Pressure 3.0 ., c.. e g 2.0 1.0 UJ f!! :::> ~ 0.0 Pressure (in kPa) 15 30 45 60 75 90 105 120 -1.0 -2.0 -3.0 Motorola Sensor Device Data Pressure Error (Max) 15 to 102 (kPa) ± 1.5 (kPa) 2-53 MPX4100 MPX4101 SERIES ORDERING INFORMATION The MPX41 OOA and 4101 A series MAP silicon pressure sensors are available in the basic element package, or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. Device Type Options Case No. MPX Series Order No. Marking Basic Element Absolute, Element 867-04 MPX4100A MPX4101A MPX4100A MPX4101A Ported Elements Absolute, Ported 8678-03 MPX4100AP MPX4101AP MPX4100AP MPX4101AP Absolute, Stove Pipe Port 867E-02 MPX4100AS MPX4101AS MPX4100A MPX4101A Absolute, Axial Port 867F-02 MPX4100ASX MPX4101 ASX MPX4100A MPX4101A 2-54 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR TECHNICAL DATA 15 to 115 kPa Altimeter/Barometer Pressure Sensor, On-Chip Signal Conditioned, 0.2 V to 4.8 V Output, Temperature Compensated & Calibrated MPX4115 SERIES X- P2) Burst Pressure(7) (PI> P2) Storage Temperature Operating Temperature Symbol Value Unit Pmax 400 kPa Pburst 1000 kPa Tstg -50 to +150 ·C TA -40 to +125 ·C Pin Number I 2 I 3 I4 I5 I6 I N/C I N/C I N/C Vout I Ground I Vs 1 NOTE: Pins 4, 5 and 6 are Internal device connections. Do not connect to external circuitry or ground. Vs The MPX4115A series piezoresistive transducer is a state-of-the-art, silicon pressure sensor. The sensor provides an accurate, high level analog signal that is proportional to applied pressure. A vacuum is sealed behind the sensor diaphragm providing a reliable pressure reference. (See Figure 2.) Figure 1 shows a block diagrarn of the internal circuitry integrated calibration and signal conditioning. r------- I I 3 ---------.., THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 II X-ducer I SENSING I ELEMENT IL... _ _ _ _ GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I I 1 Vout I _ _ _ _ _ _ _ _ _ _ _ _ ...1I 2 PINS 4,5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic REV 1 Motorola Sensor Device Data 2-55 MPX4115 MPX 4115A SERIES OPERATING CHARACTERISTICS (VS Characteristic Pressure Range ~ 5.1 Vdc, TA ~ 25°C unless otherwise noted, PI > P2) Symbol Min POP 15 - 115 kPa 4.85 5.1 5.35 Vdc mAdc Typ Max Unit Supply Voltage (1) Vs Supply Current 10 - 7.0 10 VFSS 4.521 4.59 4.659 I1V/I1P - 45.9 Voff 0.135 0.204 0.275 V - ±1.5 %VFSS Full Scale Span (2) (0 to 85°C) Sensitivity Offset (3) (0 to 85°C) Accuracy (4) (0 to 85°C) Response Time (5) Output Source Current at Full Scale Output - - tR - 1.0 lot - 0.1 - - V mVlkPa ms mA MECHANICAL CHARACTERISTICS Characteristics Symbol Min Typ - 4.0 Warm-Up Time - Cavity Volume - Volumetric Displacement - Weight, Basic Element (Case 867) Common Mode Line Pressure (6) Max Unit - Grams IN3 - - 0.01 - - 0.001 IN3 - - 690 kPa 15 ms NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to • TcOffset: 25°C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. 2-56 Motorola Sensor Device Data MPX4115 FLUORO SILICONE GEL DIE COA MPX411SA OUPUT (PIN 1) EPOXY PLASTIC CASE SOpF ILPROCESSOR SEALED VACUUM REFERENCE P2 Figure 2. Cross-Sectional Diagram (Not to Scale) Figure 3. Typical Decoupling Filter for Sensor to Microprocessor Interface Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4115A series pressure sensor operating characteristics and internal reliability and qualification tests, are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for in- formation regarding media compatibility in your application. Figure 3 shows a typical decoupling circuit for interfacing the output of the integrated map sensor to the AID input of a microprocessor. Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. (Output may be nonlinear outside of the rated pressure range.) S.O 4.S 4.0 i.... => D.. !3 0 3.S I I I I I I I I I I I _I Mix I TRANSFER FUNCTION: Vout = Vs' (.009'P-.09S) ± Error Vs = S.1 Vdc '4 TEMP = 0 to 8S"C ~ ryp 4~ 3.0 ~~ 2.S ~", 2.0 ~\, 1.S 1.0 O.S ~ ~re:J k::!~ A.~ " MIN I=I=~ PRESSURE (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure Motorola Sensor Device Data 2-57 MPX4115 Transfer Function Nominal Transfer Value: Vout = Vs (P x 0.009 - 0.095) +/- (Pressure Error x Temp. Factor x 0.009 VS=5.1 V±0.25Vdc x VS) Temperature Error Band MPX4115A Series 4.0 Break Poinls 3.0 Temperalure Error Factor 2.0 Temp Multiplier -40100 01085 8510125 3 1 3 1.0 0.0 -40 -20 20 40 60 80 120 100 140 Temperature in C· Pressure Error Band 9.0 6.0 ~ o!:. 3.0 ~ _-+_...............L...J'-'-...........................-'--'-'-'-""':-...............':,-:"'-'-:--_ ~ Pressure in kPa £ -3.0 -6.0 -9.0 Pressure Error (Max) 15 to 115 kPa ± 1.5 kPa Ordering Information The MPX4115A BAP Sensor is available in the Basic Element package or with pressure port fittings that provide mounting ease and barbed hose connections. Device Type Basic Element Ported Elements 2-58 Options Case No. Absolute, Element Only Case 867-{J4 Absolute, Ported Absolute, Stove Pipe Port Absolute, Axial Port MPX Series Order No. Marking MPX4115A MPX4115A Case 8679-03 MPX4115AP MPX4115AP Case 867E-02 MPX4115AS MPX4115A Case 867F-02 MPX4115ASX MPX4115A Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR TECHNICAL DATA 20 to 250 kPa Manifold Absolute Pressure Sensor, On-Chip Signal Conditioned, 0.2 V to 4.9 V Output, Temperature Compensated & Calibrated MPX4250 SERIES Motorola Preferred Devices X-ducer™ SILICON PRESSURE SENSOR The Motorola MPX4250 series Manifold Absolute Pressure (MAP) sensor for turbo boost engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. Motorola's MAP sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high level analog output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Motorola MAP sensor a logical and economical choice for the automotive system designer. Features • 1.5% Maximum Error Over 0-85°C • Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems • Ideally Suited for Direct Microprocessor Interfacing • Patented Silicon Shear Stress Strain Gauge CASE 867-C4 Style 1 • Temperature Compensated Over - 40 to + 125°C • Offers Large Reduction in Weight and Volume Compared to Existing Hybrid Modules Pin Number • Durable Epoxy Unibody Element • Ideal for Non-Automotive Applications, too. MAXIMUM RATINGS (TC = I 2 I Vout I Ground I 1 25'C unless otherwise noted) Rating Overpressure(7) (Pl > P2) Burst Pressure(7) (Pl > P2) Symbol Value Unit Pmax 400 kPa kPa Pburst 1000 Storage Temperature Tstg -50 to +150 °c Operating Temperature TA -40 to +125 'C 3 Vs I4 I5 I6 IN/C IN/C IN/C NOTE: Pins 4, 5 and 6 are internal device connections. Do not connect to external circuitry or ground. Vs The MPX4250 series piezoresistive transducer is a stateof-the-art silicon pressure sensor. The sensor provides an accurate, high level analog signal that is proportional to applied pressure. A vacuum is sealed behind the sensor diaphragm providing a reliable pressure reference. (See Figure 2.) Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone pressure sensing chip. r------I I I I I IL ----------,I THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X- P2) Symbol Min Typ Max Pressure Range POP 20 - 250 kPa Supply Voltage (1) Vs 4.85 5.1 5.35 Vdc mAdc Characteristic Supply Current Full Scale Span (2) (0 to 85·C) Sensitivity Unit 10 - 7.0 10 VFSS 4.622 4.692 4.762 V IMAP - 20 - mV/kPa Offset (3) (0 to 85·C) Voff 0.135 0.204 0.275 V Accuracy (4) (0 to 85·C) - - - ±1.5 %VFSS Response Time (5) tR - 1.0 - ms Output Source Current at Full Scale Output 10+ - 0.1 - mA Symbol Min Typ Max Unit - - 4.0 - Grams 0.01 IN3 MECHANICAL CHARACTERISTICS Characteristics Weight, Basic Element (Case 867) Warm-Up Time Cavity Volume Volumetric Displacement Common Mode Line Pressure (6) 15 - Sec 0.001 IN3 690 kPa NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) Is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25·C. Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85·C, relative to 25·C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative to • TcOffset: 25·C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25·C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. 2-60 Motorola Sensor Device Data MPX4250 STAINLESS STEEL METAL COVER DIE MPX4250A OUPUT (PIN 1) EPOXY CASE >-,1 .....---.. . .--1 ND 50PFT .. 51 k ? 11 PROCESSOR '----- RTV DIE BOND P2 SEALED VACUUM REFERENCE Figure 2. Cross-Sectional Diagram (Not to Scale) Figure 3. Typical Decoupling Filter for Sensor to Microprocessor Interface Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for in- 5.0 4.5 4.0 ~ ~ ..... 3.5 2.5 0 2.0 ..... ::> iR~N~F~RI F~N6T:O~: I I.!il¢i ~ 4~ ~ TYP ~ 6~ ~f( 1.5 4~ 1.0 0.5 ~ IMlx I I Vout = Vs' (.004·P-.004) ± Error VS=5.1 Vdc TEMP = 0 to 85'C 3.0 D- ::> formation regarding media compatibility in your application. Figure 3 shows a typical decoupling circuit for interfacing the output of the integrated map sensor to the AID input of a microprocessor. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation (0 to 85°C) over temperature range. (Output may be nonlinear outside of the rated pressure range.) " MIN ¢ ~ PRESSURE (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure Motorola Sensor Device Data 2-61 MPX4250 Transfer Function Nominal Transfer Value: Vout = Vs (P x 0.004 - 0.04) +/- (Pressure Error x Temp. Factor x 0.004 x VS) VS=5.1 V±0.25Vdc Temperature Error Band MPX4250A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40toO Ot085 85 to 125 3 1 3 1.0 0.0 -40 -20 20 40 60 80 100 120 140 Temperature in Co Pressure Error Band 9.0 ., 6.0 e 3.0 c.. g UJ Pressure in kPa e ~ a: -3.0 -6.0 -9.0 Pressure Error (Max) 20 to 250 kPa ± 3.45 (kPa) Ordering Information The MPX4250A series Turbo MAP silicon pressure sensors are available in the basic element package or with pressure port fittings that provide mounting ease and barbed hose connections. OevlceType Basic Element Ported Elements 2-62 Options Case No. MPX Series Order No. Marking Absolute, Element Case 867-Q4 MPX4250A MPX4250A Absolute, Ported Case 8679-03 MPX4250AP MPX4250AP Absolute, Stove Pipe Port Case 867E-Q2 MPX4250AS MPX4250A Absolute, Axial Port Case 867F-02 MPX4250ASX MPX4250A Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 10 kPa (0 to 1.45 PSI) On-Chip Signal Conditioned, 0.2 V to 4.7 V Output, Temperature Compensated and Calibrated, Silicon Pressure Sensors MPX5010 SERIES Features • Temperature Compensated Over 0 to 85°C • Ideally Suited for Microprocessor or MicrocontrollerBased Systems • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations • Durable Epoxy Unibody Element X-ducer™ SILICON PRESSURE SENSORS Pin Number 1 Vout I 2 I I Ground I 3 Vs I I 4 N/C I I 5 N/C I I 6 N/C NOTE: Pins 4, 5 and 6 are internal device connections. Do not connect to external circuitry or ground. DIFFERENTIAL PORT OPTION CASE 867C-03 Style 1 BASIC CHIP CARRIER ELEMENT CASE 867-04 Style 1 MAXIMUM RATINGS (TC = 25'C unless otherwise noted) Rating Overpressure(7) (P1 > P2) Burst Pressure(7) (P1 > P2) Symbol Value Unit Pmax 75 kPa Pburst 100 kPa Tstg -50 to +125 'C TA -40 to +125 'C Storage Temperature Operating Temperature r------- The MPX5010 series piezoresistive transducer is a state-of-the-art, low pressure sensor designed for a wide range of applications. This sensor with its patented, single element X-ducer, combines advanced mlcromachining techniques, thinfilm metallization and bipolar semiconductor processing to provide an accurate, high-level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip. I I I X- P2) Characteristic Pressure Range Supply Voltage (1) Symbol Min Typ Max POP a - 10 Unit kPa Vs 4.75 5.0 5.25 Vdc mAdc IS - 7.0 15 Full Scale Span (2) (0 to 85·C) VFSS 4.275 4.5 4.725 V Offset (3) (0 to 85·C) Voff a 0.2 0.425 V - 450 - mV/kPa - - ±5.0 %VFSS tR - 1.0 - ms 10+ - 0.1 - mA Supply Current Sensitivity VIP Accuracy (4) (0 to 85·C) Response Time (5) Output Source Current at Full Scale Output MECHANICAL CHARACTERISTICS Symbol Min Typ Max Unit Weight, Basic Element (Case 867) Characteristic - - 4.0 Grams Warm-Up - - 15 - Cavity Volume - - - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 Common Mode Line Pressure (6) - - - 690 kPa Sec NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25·C. Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of ato 85·C, relative to 25·C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of to 85·C, relative to • TcOffset: 25·C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25·C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. a 2-64 Motorola Sensor Device Data MPX5010 SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX501 0 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows a typical decoupling circuit for interfacing the output of the MPX501 0 to the AID microprocessor. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation (0 to 85°C) over temperature range. (Output may be nonlinear outside of the rated pressure range.) MPX5010 OUTPUT (PIN 1) NO .., 50 pF 51 k RTV DIE BOND JlPROCESSOR -= EPOXY CASE Figure 3. Typical Decoupling Filter for Sensor to Microprocessor Interlace Figure 2. Cross-Sectional Diagram (Not to Scale) ?!: f- => 5.0 TRANSFER FUNCTION: 4.S Vout. Vs·(0.Og·P+0.04) ± ERROR 4.0 Vs .5.0Vdc TEMP. 0 to 8SoC 3.5 3.0 c.. => 2.5 2.0 f- ~ 0 1.5 1.0 O.S MA / 0 I'" ......-: ~ ~~ o~ o l/::: --= ~~ l j /'" ~ :;..' ~V ~ICAL '\ MIN 3 4 5 DIFFERENTIAL PRESSURE (kPa) 9 10 11 Figure 4. Output versus Pressure Differential Motorola Sensor Device Data 2-65 MPX5010 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P 1) side may be identified by using the table below: Pressu re (P1) Side Identifier Case Type MPX50100 867-04 Stainless Steel Cap MPX50100P 867G-03 Side with Part Marking MPX5010GP 8679-03 Side with Port Attached MPX5010GVP 8670-03 Stainless Steel Cap MPX5010GS 867E-02 Side with Port Attached MPX5010GVS 867A-03 Stainless Steel Cap MPX5010GSX 867F-02 Side with Port Attached MPX5010GVSX 867G-02 Stainless Steel Cap ORDERING INFORMATION The MPX5010 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Basic Element Ported Elements 2-66 Options Differential Case Type 867-04 Order Number MPX5010D Device Marking MPX5010D Differential Dual Ports 867C-03 MPX5010DP MPX5010DP Gauge 867B-03 MPX5010GP MPX5010GP Gauge Vacuum Port 8670-03 MPX5010GVP MPX5010GVP Gauge, Axial 867E-02 MPX5010GS MPX50100 Gauge Vacuum Axial 867A-03 MPX5010GVS MPX50100 Gauge, Axial PC Mount 867F-02 MPX5010GSX MPX5010D Gauge Vacuum Axial PC Mount 867G-02 MPX5010GVSX MPX5010D Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 50 kPa (0 to 7.25 PSI) On-Chip Signal Conditioned, 0.2 V to 4.7 V Output, Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX5050 SERIES Motorola Preferred Devices Features X-ducer™ SILICON PRESSURE SENSORS • 2.5% Maximum Error Over D-85°C • Ideally Suited for Microprocessor or Microcontroller Based Systems • Temperature Compensated Over - 40 to 125°C. • Patented Silicon Shear Stress Strain Gauge • Easy-te-Use Chip Carrier Package Options • Available in Differential and Gauge Configurations • Durable Epoxy Unibody Element Pin Number 1 I 2 I I Ground I I 3 4 I I I 5 I 6 BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE867~4 CASE867C~3 Style 1 Style 1 I N/C N/C Vout Vs N/C NOTE: Pins 4, 5 and 6 are internal device connections. Do not connect to external circuitry or ground. MAXIMUM RATINGS (TC = 25°C unless otherwise noted) 1 Symbol Value Unit Overpressure(7) (P1 > P2) Pmax 200 kPa Burst Pressure(7) (P1 > P2) Pburst 700 kPa Tstg -50 to +150 °c TA -4010 +125 °c Rating Storage Temperature Operating Temperature Vs The MPX5050 series piezoresistive transducer is a state-of-the-art pressure sensor designed for a wide range of applications. This sensor with its patented, single element X-ducer, combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone pressure sensing chip. r------I I I ----------, I THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X-ducer I SENSING I ELEMENT I1... _ _ _ _ GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I 1 Vout I _ _ _ _ _ _ _ _ _ _ _ _ ...1I 2 PINS 4, 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic Preferred devices are Motorola recommended choices for future use and best overall value. REV2 Motorola Sensor Device Data 2-67 MPX5050 SERIES OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25·C unless otherwise noted, PI > P2) Symbol Min Typ Max Unit Pressure Range POP 0 - 50 kPa Supply Voltage(l) Vs 4.75 5.0 5.25 Vdc Supply Current 10 - 7.0 10.0 mAdc V Characteristic Full Scale Span(2) (0 to 85·C) VFSS 4.388 4.5 4.613 Zero Pressure Offset(3) (0 to 85·C) Voff 0.088 0.2 0.313 V 90 - mV/kPa %VFSS VIP - - - - ± 2.5 tR - 1.0 - ms 10+ - 0.1 - mA Symbol Min Typ Max - 4.0 Warm-Up - - Cavity Volume - - Volumetric Displacement - - 0.001 IN3 Common Mode Line Pressure(6) - - - 690 kPa Sensitivity Accuracy(4) (0 to 85·C) Response Time(5) Output Source Current at Full Scale Output MECHANICAL CHARACTERISTICS Characteristic Weight, Basic Element (Case 867) Unit - Grams 15 - Sec - 0.01 IN3 NOTES: 1. Device is ratio metric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25·C. Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85·C, relative to 25·C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative to • TcOllse!: 25·C. • Variation from nominal: The variation from nominal values, for ollset or full scale span, as a percent of VFSS, at 25·C. 5. Response Time is defined as the time for the Incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-to-Iead Interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. 2-68 Motorola Sensor Device Data MPX5050 SERIES Transfer Function Nominal Transfer Value: Vout = Vs (P x 0.018 + 0.04) +/- (Pressure Error x Temp. Factor x 0.D18 x VS) Vs = 5.0 V ± 0.25 Vdc Temperature Error Band MPX5050 Series 4.0 MultiQlier TemQ 3.0 Temperature Error Factor -40toO Ot085 85 to 125 2.0 3 1 3 1.0 0.0 -40 -20 20 40 60 80 100 120 140 Temperature in °C r- Pressure Error Band Error Umits for Pressure 3.02.0- "'g ~ 1.0- UJ 0.0 l!! :::J ~ -LO- I o I I I I I I 10 20 30 40 50 60 Pressure (in kPa) a. -2.0-3.0- Motorola Sensor Device Data Pressure Error (Max) Oto 50 kPa ± 1.25kPa 2-69 MPX5050 SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over O°C to 85°C. (Device output may be nonlinear outside of the rated pressure range.) Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5050 series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term stability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the output of the MPX5050 to the AID input of a microprocessor. Proper decoupling of the power supply is recommended. 5.0 ?; f:::J 0.. f:::J 0 TRANSFER FUNCTION: 4.5 Vout =VS·(0.018'P+0.04) ± ERROR 4.0 Vs =5.0 Vdc TEMP =0 to 85°C 3.5 3.0 2.0 MAX l'\y ~ 1.0 0.5 A ~ ~ == l..d; ~ ~ P'" ~P' 2.5 1.5 , A ~~ TYPI AL MI~ lIP' o~ o 5 10 15 20 25 30 35 40 DIFFERENTIAL PRESSURE (kPa) 45 50 55 Figure 2. Output versus Pressure Differential MPX5050 OUPUT (PIN 1) EPOXY PLASTIC CASE DIFFERENTIAUGAUGE ELEMENT >4~------'-~ ND 50pF 11 PROCESSOR DIE BOND P2 Figure 3. Cross-Sectional Diagram (Not to Scale) 2-70 Figure 4. Typical Decoupllng Filter for Sensor to Microprocessor Interface Motorola Sensor Device Data MPX5050 SERIES PRESSURE (P1) I VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5050D 867-04 Stainless Steel Cap MPX5050DP 867C-03 Side with Part Marking MPX5050GP 867B-03 Side with Port Attached MPX5050GVP 867D-03 Stainless Steel Cap MPX5050GS 867E-02 Side with Port Attached MPX5050GVS 867A-03 Stainless Steel Cap MPX5050GSX 867F-02 Side with Port Attached MPX5050GVSX 867G-02 Stainless Steel Cap ORDERING INFORMATION The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Basic Element Ported Elements Options Case Type Order Number Device Marking Differential 867-04 MPX5050D MPX5050D MPX5050DP Differential Dual Ports 867C-03 MPX5050DP Gauge 8678-03 MPX5050GP MPX5050GP Gauge Vacuum Port 8670-03 MPX5050GVP MPX5050GVP Gauge, Axial 867E-02 MPX5050GS MPX5050D Gauge Vacuum Axial 867A-03 MPX5050GVS MPX5050D Gauge, Axial PC Mount 867F-02 MPX5050GSX MPX5050D Gauge Vacuum Axial PC Mount 867G-02 MPX5050GVSX MPX5050D Motorola Sensor Device Data 2-71 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 100 kPa (0 to 14.5 PSI) On-Chip Signal Conditioned, 0.2 V to 4.7 V Output, Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX5100 SERIES Motorola Preferred Devices Features • MPX5100D: 0-100 kPa MPX5100A: 15-115 kPa X-ducer™ SILICON PRESSURE SENSORS 2.5% Maximum Error Over 0-85°C • Durable Epoxy Unibody Element • Ideally Suited for Microprocessor or Microcontroller Based Systems • Patented Silicon Shear Stress Strain Gauge • Easy to use Chip Carrier Package Options • Available in Absolute, Differential and Gauge Configurations Pin Number 1 Vout I I I Ground I 2 3 Vs I I 4 N/C I I 5 N/C I I 6 N/C NOTE: Pins 4, 5 and 6 are intemal device connections. Do not connect to external circuitry or ground. DIFFERENTIAL PORT OPTION CASE 867C-{)3 Style 1 BASIC CHIP CARRIER ELEMENT CASE 867-{)4 Style 1 MAXIMUM RATINGS (TC = 25'C unless otherwise noted) Symbol Value Unit Overpressure(7) (P1 > P2) Pmax 400 kPa Burst Pressure(7) (P1 > P2) Pburst 1000 kPa Tstg -50 to +150 'C TA -40to 125 'C Rating Storage Temperature Operating Temperature Vs The MPX5100 series piezoresistive transducer is a state-of-the-art, monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with AID inputs. This patented, single element X-ducer combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone pressure sensing chip. r------I I I I I IL 3 ---------..,I THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X-ducer SENSING ELEMENT GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I 1 Vaut I _ _ _ _ _ _ _ _ _ _ _ _ ...1I ___ _ PINS 4, 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic Preferred devices are Motorola recommended choices for future use and best overall value. REV3 2-72 Motorola Sensor Device Data MPX5100 SERIES OPERATING CHARACTERISTICS (VS =5.0 Vdc, TA = 25'C unless otherwise noted, P1 Characteristic Pressure Range Gauge, Differential: MPX5100D Absolute: MPX5100A Supply Voltage(1) Supply Current > P2) Symbol Min Typ Max Unit POP 0 15 - 100 115 kPa Vs 4.75 5.0 5.25 Vdc 10 - 7.0 10 mAdc Full Scale Span(2) (0 to 85'C) VFSS 4.388 4.5 4.613 V Offset(3) (0 to 85'C) Voff 0.088 0.200 0.313 V IW/I1P Sensitivity Accuracy(4) (0 to 85'C) - - 45 - - Response Time(5) tR - 1.0 Output Source Current at Full Scale Output 10 + - 0.1 - mV/kPa ±2.5 %VFSS - mA ms MECHANICAL CHARACTERISTICS Symbol Min Typ Weight, Basic Element (Case 867) Characteristic - 4.0 Warm-Up - Cavity Volume - - Volumetric Displacement Common Mode Line Pressure(6) Max Unit - Grams - Sec - 0.01 IN3 0.001 IN3 - 690 kPa 15 NOTES: 1. Device is ratio metric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25'C. Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85'C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative to • TcOffse!: 25'C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25'C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-73 MPX5100 SERIES Transfer Function (MPX5100D) - - - - - - - - - - - - - - - - - - - - - - - - - - , Nominal Transfer Value: Vout = Vs (P x 0.009 + 0.04) +/- (Pressure Error x Temp. Factor x 0.009 x VS) Vs = 5.0 V ± 0.25 Vdc Temperature Error Band - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - , MPX5100D Series Temp Multiplier -40100 Ot085 85 to 125 3 4.0 3.0 Temperature Error Factor 1 3 2.0 1.0 0.0 -40 -20 20 40 60 100 80 120 140 Temperature in ·C ,..- Pressure Error Band 96- ~ ~ g 3- i UJ I 0 i I I II 10 20 30 40 50 60 I I _I 80 90 100 Pressure (kPa) -3- a. -6-9- 2-74 Pressure Error (Max) 010100 kPa ±2.5 kPa Motorola Sensor Device Data MPX5100 SERIES Transfer Function (MPX5100A) Nominal Transfer Value: Vout = Vs (P x 0.009 - 0.095) +/- (Pressure Error x Temp. Factor x 0.009 x VS) Vs = 5.0 V ± 0.25 Vdc Temperature Error Band - - - - - - - - - - - - - - - - - - - - - - - - - - - - - , MPX51 DDA Series Temp 4.0 3.0 Temperature Error Factor Multiplier -40toO Ot085 85 to 125 3 1 3 2.0 1.0 0.0 -40 -20 20 40 60 80 100 120 I I I 140 Temperature in·C .--- Pressure Error Band 96- ""'"g a. 3- UJ I i!! 10 ~ a. I I I I I I .....!2::!.0_~3::.0_...;4~0:...._~50~---:6~0:....__!:8:::.0_~90"__.....!1.:::00"__....!.:11:::.0_ I 120 Pressure (kPa) -3-6-9- Pressure Error (Max) 15 to 115 kPa ±2.5 kPa Motorola Sensor Device Data 2-75 MPX5100 SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION and SIGNAL CONDITIONING DIE BOND DIFFERENTIAUGAUGE ELEMENT P2 SEALED VACUUM REFERENCE P2 Figure 2. Cross-Sectional Diagrams (Not to Scale) 5.0 MAXi'I 4.5 TRANSFER FUNCTION: Vout = Vs' (.009'P - .095) ± error 4.0 I'vs = 5.0 Vdc ~~ 3.5 TEMP = 0 to 85°C ~~ 15 kPa to 115 kPa 3.0 MPX5100A ~ 2.5 ~~ TYP 2.0 II jg ~ I- => a. ~ 0 1.5 1.0 0.5 =I!!! ~~ ~~ ~~~ ~ 5.0 TRANSFER FUNCTION:.~ MAX .A. ~ 4.5 Vout = Vs' (0.009'P - 0.04) ± error ~~ 4.0 Vs = 5.0 Vdc P" 3.5 TEMP = 0 to 85°C o kPa to 100 kPa 3.0 MPX5100D ~ 2.5 TYP ~ 2.0 ~ 1.5 l.d I I- => a. I=> ~~ 0 ar 1.0 0.5 I ~I~ ...;.J~ A~ MIN ~ 00 I 10 20 30 40 50 60 70 80 90 100 110 PRESSURE (ref: to sealed vacuum, in kPa) DIFFERENTIAL PRESSURE (in kPa) Figure 3. Output versus Absolute Pressure Figure 4. Output versus Pressure Differential Figure 2 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5100A and MPX5100D series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for SENSOR OUTPUT (PIN 1) information regarding media compatibility in your application. Figures 3 and 4 show the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over DoC to 85°C. (Device output may be non-linear outside of the rated pressure range.) Figure 5 shows a typical decoupling circuit for interfacing the output of the MPX51 00 to the AID input of a microprocessor. Proper decoupling of the power supply is also recommended. ,"- NO 50pF* 51 k I.LPROCESSOR ':' Figure 5. Typical Decoupling Filter for Sensor to Microprocessor Interface 2-76 Motorola Sensor Device Data MPX5100 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (PI) side and the Vacuum (P2) side. The Pressure (PI) side is the side containing fluoro silicone gel which protects the die from harsh media. The differential and gauge sensor is designed to operate with positive differential Part Number pressure applied, PI > P2. The absolute sensor is designed for vacuum on PI side. The Pressure (PI) side may identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5100A, MPX5100D 867-04 Stainless Steel Cap MPX5100DP 867C-03 Side with Part Marking MPX5100AP, MPX5100GP 8678-03 Side with Port Attached MPX5100GVP 867D-03 Stainless Steel Cap MPX5100AS, MPX5100GS 867E-02 Side with Port Attached MPX5100GVS 867A-03 Stainless Steel Cap MPX51 OOASX, MPX5100GSX 867F-02 Side with Port Attached MPX5100GVSX 867G-02 Stainless Steel Cap ORDERING INFORMATION: The MPX5100 pressure sensor is available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Basic Element Absolute Ported Elements Motorola Sensor Device Data Case Type Order Number Device Marking 867-04 MPX5100A MPX5100A Differential 867-04 MPX5100D MPX5100D Differential Dual Ports 867C-03 MPX5100DP MPX5100DP Absolute, Single Port 867B-03 MPX5100AP MPX5100AP Gauge, Single Port 867B-03 MPX5100GP MPX5100GP Gauge Vacuum Port 867D-03 MPX5100GVP MPX5100GVP Absolute Axial 867E-02 MPX5100AS MPX5100A Gauge, Axial 867E-02 MPX5100GS MPX5100D Gauge Vacuum Axial 867A-03 MPX5100GVS MPX5100D Absolute Axial PC Mount 867F-02 MPX5100ASX MPX5100A Gauge. Axial PC Mount 867F-02 MPX5100GSX MPX5100D Gauge Vacuum Axial PC Mount 867G-02 MPX5100GVSX MPX5100D 2-77 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 500 kPa (0 to 75 PSI) On-Chip Signal Conditioned, 0.2 V to 4.7 V Output, Temperature Compensated and Calibrated, Silicon Pressure Sensors MPX5500 SERIES Features X-clucer™ SILICON PRESSURE SENSORS • Temperature Compensated Over 0 to 85°C • Ideally Suited for Microprocessor or MicrocontrollerBased Systems • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations • Durable Epoxy Unibody Element Pin Number 1 Vout I 2 I I Ground I 3 Vs I I 4 N/C I I 5 N/C I I 6 N/C NOTE: Pins 4, 5 and 6 are internal device connections. Do not connect to external circuitry or ground. BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE867~4 CASE867~3 Style 1 Style 1 MAXIMUM RATINGS (Tc = 25·C unless otherwise noted) Rating Symbol Value Unit Overpressure(7) (P1 > P2) Pmax 2000 kPa Burst Pressure(7) (P1 > P2) Pburst 3500 kPa Tstg -50 to +125 ·C TA -40 to +125 ·C Storage Temperature Operating Temperature Vs The MPX5500 series piezoresistive transducer is a state-of-the-art pressure sensor designed for a wide range of applications, but particularly for those employing a microcontroller or microprocessor with AID inputs. This patented, single element X-ducer combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip. r------I I I X-ducer I SENSING I ELEMENT IL.. _ _ _ _ 3 ---------.,I THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I 1 Vaul I _ _ _ _ _ _ _ _ _ _ _ _ .JI 2 PINS 4, 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic REV 1 2-78 Motorola Sensor Device Data MPX5500 SERIES OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25'C unless otherwise noted, PI > P2) Symbol Min Typ Max Unit POP 0 - 500 kPa Supply Voltage (1 ) Vs 4.75 5.0 5.25 Vdc Supply Current IS - 7.0 10 mAdc Characteristic Pressure Range VFSS 4.388 4.5 4.613 V Voff 0.088 0.2 0.313 V VIP - 9.0 - mV/kPa - - - ±2.50 %VFSS Response Time (5) tR - 1.0 - ms Output Source Current at Full Scale Output 10+ - 0.1 - mA Symbol Min Typ Max Unit - 4.0 - Grams Warm-Up - Cavity Volume - - 0.01 IN3 Volumetric Displacement - - - 0.001 IN3 - - 1000 kPa Full Scale Span (2) (0 to 85'C) Offset (3) (0 to 85'C) Sensitivity Accuracy (4) (0 to 85'C) MECHANICAL CHARACTERISTICS Characteristic Weight, Basic Element (Case 867) Common Mode Line Pressure (6) 15 Sec NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Output deviation from a straight line relationship with pressure over the specified pressure range. • Linearity: • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25'C. Output deviation, after 1000 temperature cycles. - 40 to 125'C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85'C. relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative to • TcOffset: 25'C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS. at 25'C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-to-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-79 MPX5500 SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the s'ensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over O°C to 85°C. (Device output may be nonlinear outside of the rated pressure range.) The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). Afluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5500 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the output of the MPX5500 to the NO microprocessor. Proper decoupling of the power supply is recommended. 5.0 ~ 5c.. t0 ::J TRANSFER FUNCTION: 4.5 Vout =Vs·(0.001S·P+0.04) ± ERROR 4.0 Vs =5.0Vdc TEMP =0 10 85'C 3.5 3.0 1.5 A 0~ 0 TYPICAL ~~ MIN ~~ 1.0 0.5 ~ MAX 4 ~ P' ~P" 2.5 2.0 A ;;;;; ~~ ~ W 50 100 150 200 250 300 350 400 DIFFERENTIAL PRESSURE (kPa) 450 500 550 Figure 2. Output versus Pressure Differential FLUORO SILICONE DIE COAT MPX5500 OUTPUT (PIN 1) ND " WIRE BOND 50 pF / RTV DIE BOND LEAD FRAME Figure 3. Cross-Sectional Diagram (Not to Scale) 2-80 'f; 51 k ?Il.PROCESSOR -= Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface Motorola Sensor Device Data MPX5500 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressu re (P1) Side Identifier Case Type MPX5500D 867-04 Stainless Steel Cap Side with Part Marking MPX5500DP 867C-03 MPX5500GP 867B-03 Side with Port Attached MPX5500GVP 867D-03 Stainless Steel Cap MPX5500GS 867E-02 Side with Port Attached MPX5500GVS 867A-03 Stainless Steel Cap MPX5500GSX 867F-02 Side with Port Attached MPX5500GVSX 867G-02 Stainless Steel Cap ORDERING INFORMATION The MPX5500 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential 867-04 MPX5500D MPX5500D Ported Elements Differential Dual Ports 867C-03 MPX5500DP MPX5500DP Gauge 867B-03 MPX5500GP MPX5500GP Gauge Vacuum Port 8670-03 MPX5500GVP MPX5500GVP Gauge, Axial 867E-02 MPX5500GS MPX5500D Gauge Vacuum Axial 867A-03 MPX5500GVS MPX5500D Gauge, Axial PC Mount 867F-02 MPX5500GSX MPX5500D Gauge Vacuum Axial PC Mount 867G-02 MPX5500GVSX MPX5500D Motorola Sensor Device Data 2-81 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 700 kPa (0 to 100 PSI) On-Chip Signal Conditioned, 0.2 V to 4.7 V Output, Temperature Compensated and Calibrated, Silicon Pressure Sensors MPX5700 SERIES Features X-ducer™ SILICON PRESSURE SENSORS • Temperature Compensated Over 0 to 85°C • Ideally Suited for Microprocessor or MicrocontrollerBased Systems • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations • Durable Epoxy Unibody Element Pin Number 1 Vout I I I Ground I 3 2 Vs I I 4 N/C I I 5 N/C I I 6 N/C NOTE: Pins 4, 5 and 6 are internal device connections. Do not connect to external circuitry or ground. DIFFERENTIAL PORT OPTION CASE 867C-{)3 Style 1 BASIC CHIP CARRIER ELEMENT CASE 867-{)4 Style 1 MAXIMUM RATINGS (Tc = 25'C unless otherwise noted) Rating Symbol Value Unit Overpressure(7) (Pi> P2) Pmax 2800 kPa Burst Pressure(7) (Pi> P2) Pburst 5000 kPa Tstg -50 to +125 'C TA -40 to +125 'C Storage Temperature Operating Temperature Vs The MPX5700 series piezoresistive transducer is a state-of-the-art pressure sensor designed for a wide range of applications, but particularly for those employing a microcontroller or microprocessor with AID inputs. This patented, single element X-ducer combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high-level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip. r------- I II ---------.., THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X-ducer GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I I I SENSING I ELEMENT IL _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ JI 2 1 Vout PINS 4, 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic REV 1 2-82 Motorola Sensor Device Data MPX5700 SERIES OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit kPa POP 0 - 700 Supply Voltage (1) Vs 4.75 5.0 5.25 Vdc Supply Current IS - 7.0 10 mAdc V Pressure Range Full Scale Span (2) (0 to 65°C) VFSS 4.366 4.5 4.613 Zero Pressure Offset (3) (0 to 65'C) Voff .066 0.2 0.313 V VIP 6.0 - mV/kPa %VFSS - - - ±2.50 Response TIme (5) tR - 1.0 - ms Output Source Current at Full Scale Output 10+ - 0.1 - rnA Sensitivity Accuracy (4) (0 to 65°C) MECHANICAL CHARACTERISTICS Symbol Min Typ Max Unit Weight, Basic Element (Case 667) Characteristic - - 4.0 - Grams Warm-Up - - 15 - Sec Cavity Volume - - 0.01 IN3 Volumetric Displacement - - Common Mode Line Pressure (6) - - 0.001 IN3 1000 kPa NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85'C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative to • TcOffset: 25°C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25'C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-83 MPX5700 SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over O°C to 85°C. (Device output may be nonlinear outside of the rated pressure range.) The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the output of the MPX5700 to the ND microprocessor. Proper decoupling of the power supply is recommended. 5.0 TRANSFER FUNCTION: Vout = Vs'(0.0012858'P+0.04) ± ERROR 4.0 Vs = 5.0 Vdc 3.5 TEMP = 0 to 85°C ~ 4.5 ~ 3.0 50.. f- => 0 A 2.5 ...;"! 2.0 1.5 1.0 0.5 M~~ ~V f- o~ o 100 ~ ./. ~ ;;:- W .a~ ~ TYPICAL W" MIN 200 300 400 500 600 DIFFERENTIAL PRESSURE (kPa) 700 800 Figure 2. Output versus Pressure Differential FLUORO SILICONE DIE COAT MPX5700 OUTPUT (PIN 1) , WIRE BOND 50 PF .... I LEAD FRAME L.L.~..L..<<.L~'-' ....:..L..<.L~:..L..U-_ P2 RTV DIE BOND NO 51 k ~ lJ.PROCESSOR -= EPOXY CASE Figure 3. Cross-Sectional Diagram (Not to Scale) 2-84 Figure 4. Typical Oecoupling Filter for Sensor to Microprocessor Interface Motorola Sensor Device Data MPX5700 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing !luoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5700D 867-04 MPX5700DP Stainless Steel Cap 867C-03 Side with Part Marking MPX5700GP 8678-03 Side with Port Attached MPX5700GVP 867D-03 Stainless Steel Cap MPX5700GS 867E-02 Side with Port Attached MPX5700GVS 867A-03 Stainless Steel Cap MPX5700GSX 867F-02 Side with Port Attached MPX5700GVSX 867G-02 Stainless Steel Cap ORDERING INFORMATION The MPX5700 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Differential 867-04 MPX5700D MPX5700D Ported Elements Differential Dual Ports 867C-03 MPX5700DP MPX5700DP Gauge 867B-03 MPX5700GP MPX5700GP Gauge Vacuum Port 867D-03 MPX5700GVP MPX5700GVP Gauge, Axial 867E-02 MPX5700GS MPX5700D Gauge Vacuum Axial 867A-03 MPX5700GVS MPX5700D Gauge, Axial PC Mount 867F-02 MPX5700GSX MPX5700D Gauge Vacuum Axial PC Mount 867G-02 MPX5700GVSX MPX5700D Motorola Sensor Device Data 2-85 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 1000 kPa (0 to 150 PSI) On-Chip Signal Conditioned, 0.2 V to 4.7 V Output, Temperature Compensated and Calibrated, Silicon Pressure Sensors MPX5999 SERIES Features • Temperature Compensated Over 0 to 85°C • Ideally Suited for Microprocessor or MicrocontrollerBased Systems • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations • Durable Epoxy Unibody Element X-ducerT" SILICON PRESSURE SENSORS Pin Number 1 Vout I I I Ground I 3 2 Vs I I 4 N/C I I 5 N/C I I 6 BASIC CHIP CARRIER ELEMENT CASE 867-04 Style 1 N/C NOTE: Pins 4, 5 and 6 are internal device connections. Do not connect to external circuitry or ground. MAXIMUM RATINGS (Tc = 25°C unless otherwise noted) Symbol Value Unit Overpressure(6) (P1 > P2) Pmax 4000 kPa Burst Pressure(6) (P1 > P2) Pburst 6000 kPa Storage Temperature Tstg -50 to +150 ·C Operating Temperature TA -40 to +125 °c Rating Vs The MPX5999 series piezoresistive transducer is a state-of-the-art pressure sensor designed for a wide range of applications, but particularly for those employing a microconlroller or microprocessor with NO inputs. This patented, single element X-ducer combines advanced micromachining techniques, thin-film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand-alone sensing chip. r------I I 3 ---------,I THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 I X-ducer I SENSING I ELEMENT IL.. _ _ _ _ GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY I I I 1 VOU1 I _ _ _ _ _ _ _ _ _ _ _ _ JI 2 PINS 4. 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic REV 1 2-86 Motorola Sensor Device Data MPX5999 OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit POP 0 - 1000 kPa Supply Voltage (1 ) Vs 4.75 5.0 5.25 Vdc Supply Current 10 - 7.0 10 mAdc VFSS 4.388 4.7 4.613 V Voff 0.088 0.2 0.313 V VIP - mV/kPa - - 5.0 - ±2.5 %VFSS Response Time (5) IR - 1.0 - ms Output Source Current at Full Scale Output 10+ - 0.1 - mA Characteristic Pressure Range Full Scale Span (2) (0 to 85°C) Zero Pressure Offset (3) (0 to 85°C) Sensitivity Accuracy (4) (0 to 85°C) MECHANICAL CHARACTERISTICS Symbol Min Typ Max Unit Weight, Basic Element (Case 867) Characteristic - - 4.0 - Grams Warm-Up - - 15 - Sec Cavity Volume - - - 0.01 IN3 - - - 0.001 IN3 Volumetric Displacement NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, aI25°C. Output deviation, after 1000 temperature cycles, - 40 to 125°C, and 1.5 million pressure cycles, with • Offset Stability: minimum rated pressure applied. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to • TcOffset: 25°C. • Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Common mode pressures beyond specified may result in leakage at the case-te-Iead interface. 7. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-87 MPX5999 ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5999 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the output of the MPX5999 to the AID microprocessor. Proper decoupling of the power supply is recommended. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over QOC to 85°C. (Device output may be nonlinear outside of the rated pressure range.) The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments. 5.0 ~ .... ::> D.... ::> 0 TRANSFER FUNCTION: 4.5 Vout =Vs·(0.000901·P+0.04) ± ERROR 4.0 Vs = 5.0 Vdc TEMP = Oto85'C 3.5 ~V ~ I(' ~ V TYPICAL 3.0 2.5 2.0 / MAX 1.5 100 ~ ./. ~I'" I~ ~ 1.0 A ~ 0.5 ~ 0 0 ~~ l.lj '7 '" MIN 200 300 400 500 600 700 800 DIFFERENTIAL PRESSURE (kPa) 900 1000 1100 Figure 2. Output versus Pressure Differential SILICONE DIE COAT MPX5999 OUTPUT.>-<.----.......- I (PIN 1) WIRE BOND 50pF / LEAD FRAME 1L.«'-L..c...L~:...LJl .......~<...L..c.....c;..L.<.-- P2 THERMOPLASTIC CASE Figure 3. Cross-Sectional Diagram (Not to Scale) 2-88 51 k NO I-LPROCESSOR RTV DIE BOND Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface Motorola Sensor Device Data MPX5999 PRESSURE (P1) I VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5999D 867-04 Stainless Steel Cap ORDERING INFORMATION The MPX5999 pressure sensor is available as an element only. MPXSeries Device Type Basic Element Options Differential Motorola Sensor Device Data Case Type 867-04 Order Number MPX5999D L Device Marking 1 MPX5999D 2-89 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 50 kPa (0 to 7.25 PSI) High Zin, On-Chip Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX7050 SERIES The new MPX7050 series pressure sensor incorporates all the innovative features of Motorola's MPX2000 series family including the patented, single piezoresistive strain gauge (X-ducer) and on-chip temperature compensation and calibration. In addition, the MPX7050 series has a high input impedance of typically 10 kQ for those portable, low power and battery-operated applications. This device is suitable for those systems in which users must have a dependable, accurate pressure sensor that will not consume significant power. The MPX7050 series device is a logical and economical choice for applications such as portable medical instrumentation, and remote sensing systems with 4-20 mAmp transmission. X-ducer™ HIGH lin SILICON PRESSURE SENSORS Features • Temperature Compensated Over DoC to +85°C • Unique Silicon Shear Stress Strain Gauge • Full Scale Span Calibrated to 40 mV (typical) • Easy to Use Chip Carrier Package Options • Available in Differential and Gauge Configurations • Ratiometric to Supply Voltage BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~8 CASE352~2 Style 1 Style 1 Application Examples • Portable Medical Instrumentation • Remote Sensing Systems Pin Number 1 Ground I I 2 I 3 I 4 +Vout I Vs I -Vout MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit Pmax 200 kPa Pburst 500 kPa Tstg -50 to +150 TA -40 to +125 °C ·C Vs VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. r-1 1 HIGH ----------,1 3 THIN FILM TEMPERATURE 12 1 lin '-'..,.----1 COMPENSATION 1 X-ducer 1 AND 4 1 SENSING L-+---1 CALIBRATION 1ELEMENT I CIRCUITRY _ _ _ _ _ _ _ _ .JI 1 1.. _ _ _ _ VOUI. Vout- 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic REV2 2-90 Motorola Sensor Device Data MPX7050 SERIES OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 2S'C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ - Max Unit SO kPa Pressure Range(1) POP Supply Voltage(2) Vs 16 Vdc 10 - 10 Supply Current 1.0 - mAdc VFSS 38.S 40 41.S mV Voff -1.0 - 1.0 Full Scale Span(3) Offset(4) Sensitivity AV/AP 0 - Linearity(S) - -O.2S Pressure Hysteresis(S) (0 to SO kPa) - Temperature Hysteresis(S) (-40'C to +12S'C) Temperature Effect on Full Scale Span(S) Temperature Effect on Offset(S) Input Impedance Output Impedance 0.80 - 0.2S %VFSS - - TCVFSS -1.0 - 1.0 %VFSS TCVoff -1.0 - 1.0 mV Zin SOOO - 1S,000 Q - 6000 ±0.1 ±O.S - mV mV/kPa Zout 2S00 Response Time(6) (10% to 90%) tR - 1.0 Offset Stability(S) - - ±O.S Max %VFSS %VFSS Q ms %VFSS MECHANICAL CHARACTERISTICS Symbol Min Typ Weight (Basic Element Case 344) Characteristics - - 2.0 Warm-Up - - 1S - - - - 0.Q1 IN3 - - 0.001 IN3 - - 690 kPa Cavity Volume Volumetric Displacement Common Mode Line Pressure(7) Unit Grams Sec NOTES: 1. 1.0 kPa (kiioPascal) equals 0.14S psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage althe minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. S. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at2S'C. • Offset Stability: Output deviation, after 1000 temperature cycles, - 40 to 12S'C, and 1.S million pressure cycles, with zero differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 8S'C, relative to 2S'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 8S'C, relative • TcOllse!: t02S'C. 6. Response Time is defined as the time for the incremental change In the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-91 MPX7050 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. f STRAIGHT LINE DEVIATION t OFFSET 100 PRESSURE (% FULLSCALE) Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX7050 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 VS-luvac 35 I- TA = 25'C ~ 30 I- P1>P2 I .§. 25 MAX, i ~~ 10 5 " ..dfP ~ ~ ~ TYP, ~ ~ I#' kPii 5 0 PSI 12.5 1.83 25 3.63 T SPAN RANGE I ~IN l/ 37.5 5.44 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. ToFFSET 50 (TYP) 7.3 DIFFERENTIAUGAUGE ELEMENT RTV DIE BOND P2 Figure 3. Output versus Pressure Differential Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX7050 series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application: 2-92 Motorola Sensor Device Data MPX7050 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX70S0D 344-08 Stainless Steel Cap MPX70S0DP 3S2-02 Side with Part Marking MPX70S0GP 3S0-03 Side with Port Attached MPX70S0GVP 3S0-04 Stainless Steel Cap MPX70S0GS 371-06 Side with Port Attached MPX70S0GVS 371-0S Stainless Steel Cap MPX70S0GSX 371C-02 Side with Port Attached MPX70S0GVSX 371D-02 Stainless Steel Cap ORDERING INFORMATION MPX7050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Basic Element Ported Elements Options Case Type Order Number Device Marking Differential Ca5e344-08 MPX70S0D MPX70S0D MPX70S0DP Differential, Dual Ported Ca5e3S2-02 MPX70S0DP Gauge Case3S0-03 MPX70S0GP MPX70S0GP Gauge, Vacuum Case3S0-04 MPX70S0GVP MPX70S0GVP Gauge, Stove Pipe Case 371-06 MPX70S0GS MPX70S0D Gauge, Vacuum Stove Pipe Case 371-0S MPX70S0GVS MPX70S0D Gauge, Axial Case 371 C-02 MPX70S0GSX MPX70S0D Gauge, Vacuum Axial Case 371 D-02 MPX70S0GVSX MPX70S0D Motorola Sensor Device Data 2-93 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 100 kPa (0 to 14.5 PSI) High Zin, On-Chip Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX7100 SERIES Motorola Preferred Devices The new MPX71 00 series pressure sensor incorporates all the innovative features of Motorola's MPX2000 series family including the patented, single piezoresistive strain gauge (X-ducer) and on--chip temperature compensation and calibration. In addition, the MPX7100 series has a high input impedance of typically 10 kQ for those portable, low power and battery-operated applications. This device is suitable for those systems in which users must have a dependable, accurate pressure sensor that will not consume significant power. The MPX7100 series device is a logical and economical choice for applications such as portable medical instrumentation, remote sensing systems with 4-20 mAmp transmission and field barometers/altimeters. X-ducer™ HIGH Zin SILICON PRESSURE SENSORS Features • Temperature Compensated Over DoC to +85°C • Unique Silicon Shear Stress Strain Gauge • Full Scale Span Calibrated to 40 mV (typical) • Easy to Use Chip Carrier Package Options • Available in Differential and Gauge Configurations • Ratiometric to Supply Voltage BASIC CHIP CARRIER ELEMENT DIFFERENTIAL PORT OPTION CASE344~S CASE352~2 Style 1 Style 1 Application Examples • Portable Medical Instrumentation • Field Altimeters • Field Barometers Pin Number 1 Ground MAXIMUM RATINGS Rating Overpressure(S) (P1 > P2) Burst Pressure(S) (P1 > P2) Storage Temperature Operating Temperature I I I I 2 +Vout 3 Vs I I 4 -Vout Symbol Pmax Value Unit 400 kPa Pbur5t 1000 kPa T5tg -50 to +150 TA -40 to +125 'C 'C Vs VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-In reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a schematic of the internal circuitry on the stand-alone pressure sensor chip. Preferred devices are Motorola recommended choices for future use and best overall value. r-- I ----------, 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 HIGH 1 Zin 1 X..;jucer I SENSING 1 ELEMENT 1 12 Vout+ 1 4 1 Vout- _ _ _ _ _ _ _ _ .J1 1 L. _ _ _ _ 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic REV2 2-94 Motorola Sensor Device Data MPX7100 SERIES OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25·C unless otherwise noted, PI > P2) Characteristic Pressure Range(l) Symbol Min Typ Max POP 0 - 100 kPa - 10 16 Vdc 1.0 - VFSS 38.5 40 Voff -1.0 -2.0 Supply Voltage(2) Vs Supply Current 10 Full Scale Span(3) MPX7100A, MPX7100D Offset(4) MPX7100D MPX7100A IlV/IlP Sensitivity Linearity(5) MPX7100D MPX7100A Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5) (-40·C to +125·C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance - TCVFSS - Unit mAdc 41.5 mV 1.0 2.0 mV - 0.4 - mV/kPa -0.25 -1.0 - 0.25 1.0 %VFSS - ±0.1 - ±0.5 - -1.0 - 1.0 %VFSS - %VFSS %VFSS TCVoff -1.0 1.0 mV Zin 5000 10,000 15,000 Q Zout 2500 3100 6000 - - ±0.5 - Symbol Min Typ Max - - 2.0 Response Time(6) (10% to 90%) tR Offset Stability(5) 1.0 Q ms %VFSS MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344) Warm-Up - - 15 Cavity Volume - - - Volumetric Displacement Common Mode Line Pressure(7) - Unit Grams Sec 0.01 IN3 0.001 IN3 690 kPa NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25·C. Output deviation, after 1000 temperature cycles, - 40 to 125·C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85·C, relative to 25·C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85·C, relative • TcOffset: to 25·C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-95 MPX7100 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the ''Worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. f STRAIGHT LINE DEVIATION t OFFSET o 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. Figure 3 shows the output characteristics of the MPX71 00 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. I I .JI' 40 I- Vs =10Vdc ~ 35 I- TA = 25°C ~ -......:. TYP, :g 30 I- Pl > P2 10~ I §. 25 SPAN MAX, ~ RANGE ~ 20 c.. ~~ ~ 15 ~ o 10 'MIN T 5 kPa PSI -5 k9 ~ 25 3.62 0 50 7.25 75 10.S7 r tQFFSET 100 (TYP) 14.5 Figure 3. Output versus Pressure Differential SILICONE GEL DIE COAT DIFFERENTIAUGAUGE DIE DIFFERENTIAUGAUGE ELEMENT P2 SILICONE GEL ABSOLUTE DIE COAT DIE DIE BOND ABSOLUTE ELEMENT P2 DIE BOND Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX7100 series pressure sensor operating charac- 2-96 teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX7100 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die from harsh media. The differential or gauge sensor is designed to operate with positive differential Part Number MPX7100A MPX7100D MPX7100DP MPX7100AP MPX7100GP MPX7100GVP MPX7100AS MPX7100GS MPX7100GVS MPX7100ASX MPX7100GSX MPX7100GVSX Pressure (P1) Side Identifier Case Type 344-08 Stainless Steel Cap 352-02 Side with Part Marking 350-03 Side with Port Attached 350-04 Stainless Steel Cap 371-06 Side with Port Attached 371-05 Stainless Steel Cap 371C-02 Side with Port Attached 371D-02 Stainless Steel Cap ORDERING INFORMATION MPX7100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Basic Element Ported Elements Options Case Type Order Number Device Marking Absolute, Differential Case 344-08 MPX7100A MPX7100D MPX7100A MPX7100D Differential, Dual Ported Case 352-02 MPX7100DP MPX7100DP Absolute, Gauge Case 350-03 MPX7100AP MPX7100GP MPX7100AP MPX7100GP Gauge Vacuum Case 350-04 MPX7100GVP MPX7100GVP Absolute, Gauge Stove Pipe Case 371-06 MPX7100AS MPX7100GS MPX7100A MPX7100D Gauge Vacuum Stove Pipe Case 371-05 MPX7100GVS MPX7100D Absolute, Gauge Axial Case 371 C-02 MPX7100ASX MPX7100GSX MPX7100A MPX7100D Gauge Vacuum Axial Case 371 0-02 MPX7100GVSX MPX7100D Motorola Sensor Device Data 2-97 MOTOROLA SEMICONDUCTOR TECHNICAL DATA o to 200 kPa (0 to 29 PSI) High Zin, On-Chip Temperature Compensated & Calibrated, Silicon Pressure Sensors MPX7200 SERIES Motorola Preferred Devices The new MPX7200 series pressure sensor incorporates all the innovative features of Motorola's MPX2000 series family including the patented, single piezoresistive strain gauge (X- P2) Symbol Value Unit Pmax 400 kPa Burst Pressure(8) (P1 > P2) Pburst 2000 kPa Supply Voltage Vs max 16 Vdc Storage Temperature Tst9 -50to+150 Operating Temperature TA -40 to +125 'C 'C Vs VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X-ducer is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a schematic of the internal circuitry on the stand-alone pressure sensor chip. Preferred devices are Motorola recommended choices for future use and best overall value. r-- ----------,I 3 I I HIGH I lin I X- P2) Symbol Min Pressure Range(l) POP 0 Supply Voltage(2) Vs Supply Current 10 Characteristic Full Scale Span(3) MPX7200A, MPX7200D Offset(4) MPX7200D MPX7200A Sensitivity - Typ - Max Unit 200 kPa 10 16 1.0 - Vdc mAdc VFSS 38.5 40 41.5 mV Voff -1.0 -2.0 - 1.0 2.0 mV - 0.2 - mV/kPa 0.25 1.0 %VFSS AV/AP - -0.25 -1.0 - Pressure Hysteresis(5) (0 to 200 kPa) - - ±0.1 - Temperature Hysteresis(5) (-40°C to +125°C) - - ±0.5 - %VFSS 1.0 %VFSS 1.0 mV 15,000 n n Linearity(5) MPX7200D MPX7200A Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance TCVFSS -1.0 TCVoff -1.0 Zin 5000 Zout 2500 - 6000 %VFSS Response Time(6) tR - 1.0 - ms Offset Stability(5) - - ±0.5 - %VFSS Symbol MECHANICAL CHARACTERISTICS Characteristic Min Typ - - 2.0 Volumetric Displacement - Common Mode Line Pressure(7) - - Weight (Basic Element Case 344) Warm-Up Cavity Volume 15 - Max - Unit Grams Sec 0.01 IN3 0.001 IN3 690 kPa NOTES: 1. 1.0 kPa (kilo Pascal) equals 0.145 psi. 2. Device is ratio metric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the • Pressure Hysteresis: minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, - 40 to 125'C, and 1.5 million pressure cycles, with zero • Offset Stability: differential pressure applied. Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25'C. • TcSpan: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85'C, relative • TcOffset: to 25'C. 6. Response TIme is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case-ta-Iead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. Motorola Sensor Device Data 2-99 MPX7200 SERIES LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. f STRAIGHT LINE DEVIATION t 100 PRESSURE (% FULLSCALE) Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. Figure 3 shows the output characteristics of the MPX7200 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. :g > .....s ::::J a. .... ::::J 0 40 35 _ 30 I I VS=10Vdc TA=25°C P1>P2 _ ./ 25 20 15 10 ~ ~ 25 ~~ ~ 50 7.25 ~ TYP" I MAX "- 75 ~ 10 ./ 10- SPAN RANGE I ~IN 100 125 14.5 PRESSURE T 150 21.75 175 t: 200 29 OFFSET Figure 3. Output versus Pressure Differential SILICONE GEL DIE COAT DIFFERENTIAUGAUGE DIE DIFFERENTIAUGAUGE ELEMENT P2 SILICONE GEL ABSOLUTE DIE COAT DIE DIE BOND ABSOLUTE ELEMENT P2 DIE BOND Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX7200 series pressure sensor operating charac- 2-100 teristios and internal reliability and qualifioation tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data MPX7200 SERIES PRESSURE (P1)IVACUUM (P2) SIDE IDENTIFICATION TABLE pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which protects the die from harsh media. The differential and gauge sensor is designed to operate with positive differential Case Type Part Number MPX7200A MPX7200D MPX7200DP MPX7200AP MPX7200GP MPX7200GVP MPX7200AS MPX7200GS MPX7200GVS MPX7200ASX MPX7200GSX MPX7200GVSX Pressure Side (P1) Identifier 344-08 Stainless Steel Cap 352-02 Side with Part Marking 350-03 Side with Port Attached 350-04 Stainless Steel Cap 371-06 Side with Port Attached 371-05 Stainless Steel Cap 371C-02 Side with Port Attached 3710-02 Stainless Steel Cap ORDERING INFORMATION MPX7200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPXSeries Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential Case 344-08 MPX7200A MPX7200D MPX7200A MPX7200D Ported Elements Differential Case 352-02 MPX7200DP MPX7200DP Absolute, Gauge Case 350-03 MPX7200AP MPX7200GP MPX7200AP MPX7200GP Gauge Vacuum Case 350-04 MPX7200GVP MPX7200GVP Absolute, Gauge Stove Pipe Case 371-06 MPX7200AS MPX7200GS MPX7200A MPX7200D Gauge Vacuum Stove Pipe Case 371-05 MPX7200GVS MPX7200D Absolute, Gauge Axial Case 371 C-02 MPX7200ASX MPX7200GSX MPX7200A MPX7200D Gauge Vacuum Axial Case 371 D-02 MPX7200GVSX MPX7200D Motorola Sensor Device Data 2-101 MOTOROLA SEMICONDUCTOR TECHNICAL DATA MTS102 MTS103 MTS105 Silicon Temperature Sensors Designed for use in temperature sensing applications in automotive, consumer and industrial products requiring low cost and high accuracy. • Precise Temperature Accuracy Over Extreme Temperature MTS1 02: ± 2°C from - 40°C to + 150°C • Precise Temperature Coefficient • Fast Thermal Time Constant 3 Seconds - Liquid 8 Seconds - Air SILICON TEMPERATURE SENSORS • Linear VSE versus Temperature Curve Relationship • Other Packages Available ,I 3 CASE 29-04, STYLE 1 T0-226AA (T0-92) Pin Number I 1 MAXIMUM RATINGS Rating Base I I 3 Collector Symbol Value VEB 4.0 Vdc IC 100 mAde TJ, Tstg -55 to +150 ·C Emitter-Base Voltage Collector Current - Continuous(5) Operating and Storage Junction Temperature Range 2 I Emitter Unit 1000...---r-....-,----,;------,-....-,----,-----,--, i I"''''''II~''''''"+---II---+--+--+Ic=O.lmA '-' ~ Base ~ Collector a: ~ 600I--+---t==~~~I--+-+ ~ ~uj 400 CD > TA, AMBIENTTEMPERATURE (·C) Figure 1. Base-Emitter Voltage versus Ambient Temperature REV2 2-102 Motorola Sensor Device Data MTS102 MTS103 MTS105 ELECTRICAL CHARACTERISTICS (TA = 25·C unless otherwise noted) Symbol Min Typ Max Unit Supply Voltage Characteristic Vs -0.2 - 35 Vdc Output Voltage Vout -1.0 - 6.0 Vdc Output Current 10 Emitter-Base Breakdown Voltage (IE = 100 )lAdc, IC = 0) V(BR)EBO 4.0 - VBE 580 595 620 -3.0 -4.0 -7.0 - 3.0 4.0 7.0 -3.0 -3.0 -5.0 - 3.0 3.0 5.0 -2.28 -2.265 -2.26 Base-Emitter Voltage (IC=0.1 rnA) Base-Emitter Voltage Matching(1) (IC = 0.1 rnA, TA = 25·C ±0.05·C) - aVBE MTS102 MTS103 MTS105 Temperature Matching Accuracy(2) (T1 = 40·C, T2= +150·C, TA = 25·C ± 0.05·C) aT MTS102 MTS103 MTS105 Temperature Coefficient (3,4) (VBE = 595 mV, IC = 0.1 rnA) Tc Thermal lime Constant Liquid Flowing Air "fH Dependence ofTC on VBE@25·C(4) (Figure 3) mAdc - Vdc mV mV ·C mV'·C s - aTdaVBE 10 - 3.0 8.0 - - 0.0033 - mV,·C mV THERMAL CHARACTERISTICS Thermal Resistance, Junction to Ambient MECHANICAL CHARACTERISTICS I Weight 87 Grams NOTES: 1. All devices within anyone group or package will be matched for VBE to the tolerance identified in the electrical characteristics table. Each device will be labeled with the mean VBE value for that group. 2. All devices within an individual group, as described in Note 1, will track within the specified temperature accuracy. This includes variations in T C, VBE, and nonlinearity in the range -40 to +150·C. Nonlinearity is typically less than ± 1·C in this range. (See Figure 4) 3. The TC as defined by a least-square linear regression for VBE versus temperature over the range -40 to +150·C for a nominal VBE of 595 mV at 25·C. For other nominal VBE values the value of the TC must be adjusted for the dependence of the TC on VBE (see Note 4). 4. For nominal VBE at 25·C other than 595 mV, the TC must be corrected using the equation TC = -2.265 + 0.003 (VBE - 595) where VBE is in mV and the TC is in mV'·C. The accuracy ofthis TC is typically±0.01 mV'·C. 5. For maximum temperature accuracy, IC should not exceed 2 rnA. (See Figure 2) Or-- r'R" 620 IC I-- I- Or-- rr-- r- t Or-- r- VSE r-- I- ~ II I I I I TA = 2S·C TC = -2.265 + 0.0033 (VSE -S9S) I III III TA=2S.C V V ./ ,/ -- 0 /' / ./ V /' ~ ./ O~ 0.01 i.-,V / 0.02 0.05 0.1 0.2 0.5 1.0 2.0 S.O 10 S80 -2.32 /' -2.28 -2.24 -2.20 -2.16 Ic, COLLECTOR CURRENT (rnA) TC,TEMPERATURE COEFFICIENT (mV/·C) Figure 2. Base-Emitter Voltage versus Collector-Emitter Current Figure 3, Temperature Coefficient versus Base-Emitter Voltage Motorola Sensor Device Data 2-103 MTS102 MTS103 MTS10S 1000 +2. 0 0 / -2. w ....... ~ 800 ~ ...... '" ,/ 0 0 - 1 / / ~ r'\. ~ ~ 400 OJ oV 20 40 60 80 100 TEMPERATURE (oG) 120 140 ........... 1"'--0... ............ r---...... ~ > 0 600 ..u '\ '\ / -40 -20 ....... ~ c:: 160 Figure 4. Linearity Error versus Temperature SloRe = - 2.265 -- ~ 40 80 TA, AMBIENTTEMPERATURE (0G) ...... .......... .... 120 Figure 5. VBE versus Ambient Temperature APPLICATIONS INFORMATION The base and collector leads of the device should be connected together in the operating circuit (pins 2 and 3). They are not internally connected. " VBE The following example describes how to determine the VBE versus temperature relationship for a typical shipment of various VBE groups. EXAMPLE: Given - Customer receives a shipment of MTS102 devices. The shipment consists of three groups of different nominal VBE values. Group 1: VBE (nom) = 595 mV Group 2: VBE (nom) = 580 mV Group 3: VBE (nom) = 620 mV " 2. Determine the VBE value at extremes, - 40°C and +150°C: VBE(TA) = VBE(25°C) + (TC)(TA - 25°C) where VBE(TA) = value of VBE at desired temperature. 3. Plot the VBE versus TA curve using two VBE values: VBE (- 40°C), VBE(25°C), or VBE(+ 150°C) 4. Given any measured VBE, the value of TA (to the accuracy value specified: MTS102 - ±2°C, MTS103± 35°C, MTS105 - ± 5°C) can be read lrom Figure 5 or calculated from equation 2. 1. Determine value of TC: a. If VBE (nom) =595 mV, TC =-2.265 mV/oC from the Electrical Characteristics table. 5. Higher temperature accuracies can be achieved if the collector current, IC, is controlled to react in accordance with and to compensate for the linearity error. Using this concept, practical circuits have been built in which allow these sensors to yield accuracies within ± 0.1 °C and ± 0.01 °C. b. If VBE (nom) is less than or greater than 595 mV determine T C from the relationship described in Note 4. TC -2.265 + 0.0033 (VBE - 595) or see Figure 3. Reference: ''Transistors-A Hot TIp for Accurate Temperature Sensing," Pat O'Neil and Carl Derrington, Electronics 1979. Find - VBE versus temperature Relationship. = 2-104 Motorola Sensor Device Data MTS102 MTS103 MTS105 TYPICAL CIRCUITS 120k(1%) >--<>---oVout >--<>---oVout 100k 50 k 100 k 120 I 15V t2Vdc or Greater I--_--~O (1'/,: +15 Vor Greater NOTE: With 01 at a known temperature, adjust RCAl to set output voltage to Vout = TEMP x 10 mY, Output of MTS102, 3,5 is then converted to Vout = 10 mV/O-(OF, °C or OK) -=- MTS102 NOTE: With 01 and 02 at identical temperature, adjust RCAl for Vout = 0.000 V R =27 kr.! (1 %) for °C or oK R = 15 kf.! (1%) for of Figure 7. Differential Temperature Measurement o To 150°C Figure 6. Absolute Temperature Measurement r - ' \ M r - - - - - - < +9.0 V 470f.! The circuit converts the linear temperaturesensor output to a digital format which may be used for direct connection to an MPU. 2N2646 1.0 k Reference: w.J. Prudhomme Popular Electronics, December 1976, Page 62 5.6 k = 1.0 k Zero Adjust J2 10 6.2 k JUUL Output (to MPU) 10 k 1N821 MTS102 100f.! = All resistors are 10% 1/4 walt except 6.2 k which is 5% 1/4 watt. Figure 8. Temperature Sensor to Digital MPU Circuit Motorola Sensor Device Data 2-105 MOTOROLA SEMICONDUCTOR TECHNICAL DATA Preliminary Information Micromachined Accelerometer XMMAS40G10D XMMAS40G10S ±40g Amplified MICROMACHINED ACCELEROMETER ±40g AMPLIFIED The MMAS40G family of silicon capacitive, micro-machined accelerometers features integral signal amplification, signal conditioning, a 4-pole low-pass filter and temperature compensation. Zero-G offset, full scale span and filter roll-off are factory set and require no external passives. A calibrated self-test feature mechanically displaces the seismic mass with the application of a digital self-test signal. The device is offered in either of two plastic packages, thereby accommodating various axis orientation requirements. The MMAS40G incorporates a single polysilicon seismic mass, suspended between two fixed polysilicon plates (G-cell). The forces of acceleration move the seismic mass, thereby resulting in a change in capacitance. The G-cell is sealed at the die level, creating a particle-free environment. The G-cell features built-in damping and over-range stops to protect it from mechanical shock. MMAS40G accelerometers are ideally suited for automotive crash detection and recording, vibration monitoring, automotive suspension control, appliance control systems, etc. SIP PACKAGE CASE 447-01 DIP PACKAGE CASE 648C-03 Features • PIN NUMBER Full Scale Measurement ±40g • Calibrated, True Self-Test 1 9 N/C(1) • Standard 16-Pin Plastic DIP 2 N/C(1) 10 N/C(1) • Integral Signal Conditioning and 4-Pole Filter 3 N/C(1) 11 N/C(1) • Linear Output 4 Self-Test 12 N/C(1) Robust, High Shock Survivability 5 Output 13 N/C(1) 6 Bypass (2) 14 N/C(1) 7 GND 15 N/C(1) 8 Vs (2) 16 N/C(1) • SIMPLIFIED BLOCK DIAGRAM + N/C(1) NOTES: 1. Internal connections. All N/C must remain floating, except DI P's pin 11 which must be tied to pin 8. 2. Bypass to ground with 0.1 ~F ceramic capacitor to improve noise performance. + r------,~~~~-lL~~---, G-CELL 6 BYPASS ~--------~~----~4<~ :c LOW-PASS FILTER OUTPUT L------------7~----J This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. 2-106 Motorola Sensor Device Data XMMAS40G10D XM MAS40G 1 OS MAXIMUM RATINGS Symbol Value Unit Acceleration (biased each axis) Rating G ±500 g Acceleration (unbiased each axis) G ±2000 g VSmax -0.3 to +7.0 Vdc Tstg -40 to +125 'C TA -40 to +85 'C Supply Voltage Storage Temperature Operating Temperature(6) OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25'C unless otherwise noted) Symbol Min Typ Acceleration Range Characteristic G ±40 - Max - Unit g Output Drive Capability - -0.2 - 0.2 rnA Supply Voltage Vs 4.75 5.0 5.25 V 10 - 5.0 - Full Scale Output Range VFSO 0.3 - 4.7 V Sensitivity (TA = 25'C) (1) (2) f!,vII:!.G 38 40 42 mV/g Sensitivity (over temperature range) (2) (3) Supply Current rnA 6V/I:!.G 36 40 44 mV/g Zero Acceleration Output (TA = 25'C) (4) Voll 2.3 2.5 2.7 V Zero Acceleration Output (over temperature range) (3) (4) Voll 2.1 2.5 2.9 0.5 - %FSO V Linearity - - Transverse Sensitivity - - 1.0 3.0 %FSO Frequency Bandwidth - - 400 - Hz Noise - - 20 50 mVpk Self-Test Output Equivalent (5) GS 22 25 28 g Self-Test Triggering VTH 1.6 - 3.4 V - - 10 - !lA Self-Test Input Current NOTES: 1. The output voltage increases from the Zero Acceleration Output for positive acceleration and decreases for negative acceleration. The typical sensitivity is 40 mV/g. For example, with Vs = 5.0 V, a+20g input will result in a 3.3 Voulput. (Voutput =2.5 + 0.040 x20) and a-20g input will result in a 1.7 V output. 2. Sensitivity is a ratiometric parameter: I:!.V/I:!.G(Vs) = I:!.V/I:!.G(5 V) x (VS/5 V). 3. The compensated temperature range is -40 to + 105'C. 4. Zero Acceleration Output is a ratio metric parameter: VolI(Vs) = VolI(5 V) x (VS/5 V). 5. Equivalent output in response to a Logic Level One on the self-test pin. 6. Additional temperature range available. Consult factory. ORDERING INFORMATION Device Temperature Range Case No. Package XMMAS40G10D -40 to +85'C Case 648C-03 Plastic DIP XMMAS40G10S -4010 +85'C Case 447-01 Plastic SIP Motorola Sensor Device Data 2-107 XMMAS40G10D XMMAS40G10S POSITIVE ACCELERATION SENSING DIRECTION t DIP PACKAGE SIP PACKAGE • When positioned as shown, gravity will result in a positive 1g output SIP PACKAGE DRILLING PATTERN "00<'~: I I 11~ 111 !r---:::: "0.'OO~.~~~ J ) - - - - - - - - .240 2 x 0 .058 2-108 ~ :~~~ -J/ ______ Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR TECHNICAL DATA Preliminary Information Micromachined Accelerometer XMMAS250G10D XMMAS250G10S ±250g Amplified MICRO MACHINED ACCELEROMETER ±250g AMPLIFIED The MMAS250G family of silicon capacitive, micro-machined accelerometers features integral signal amplification, signal conditioning, a 4-pole low-pass filter and temperature compensation. Zero-G offset, full scale span and filter roll-off are factory set and require no external passives. A calibrated self-test feature mechanically displaces the seismic mass with the application of a digital self-test signal. The device is offered in either of two plastic packages, thereby accommodating various axis orientation requirements. The MMAS250G incorporates a single polysilicon seismic mass, suspended between two fixed polysilicon plates (G-cell). The forces of acceleration move the seismic mass, thereby resulting in a change in capacitance. The G-cell is sealed at the die level, creating a particle-free environment. The G-cell features built-in damping and over-range stops to protect it from mechanical shock. MMAS250G accelerometers are ideally suited for automotive crash detection and recording, vibration monitoring, automotive suspension control, appliance control systems, etc. DIP PACKAGE CASE 648C-03 SIP PACKAGE CASE 447-01 Features • PIN NUMBER Full Scale Measurement ±250g • Calibrated, True Self-Test 1 N/C(1) 9 N/C (1) • Standard 16-Pin Plastic DIP 2 N/C(1) 10 N/C (1) • Integral Signal Conditioning and 4-Pole Filter 3 N/C(1) 11 N/C(1) • Linear Output 4 Self-Test 12 N/C (1) • Robust, High Shock Survivability 5 Output 13 N/C(1) 6 Bypass (2) 14 N/C(1) 7 GND 15 N/C(1) 8 Vs (2) 16 N/C (1) SIMPLIFIED BLOCK DIAGRAM + NOTES: 1. Internal connections. All N/C must remain floating, except DIP's pin 11 which must be tied to pin 8. 2. Bypass to ground with 0.1 IlF ceramic capacitor to improve noise performance. + r------,~~~~-j-~~---, G-CELL 6 ~--------~~----r-~~ LOW-PASS FILTER BYPASS OUTPUT ~------------7~---This document contains information on a product under development. Motorola reserves the right 10 change or discontinue Ihis producl wilhout nolice. Motorola Sensor Device Data 2-109 XMMAS250G10D XMMAS250G10S MAXIMUM RATINGS Rating Acceleration (biased each axis) Acceleration (unbiased each axis) Supply Voltage Storage Temperature Operating Temperature(6) Symbol Value Unit G ±500 g G ±2000 g VSmax -0.3 to +7.0 Vdc Tstg -40 to +125 °C TA -40 to +85 °C OPERATING CHARACTERISTICS (VS = 5.0 Vdc. TA = 25°C unless otherwise noted) Symbol Min Typ Max Acceleration Range Characteristic G ±250 - - g Output Drive Capability - -0.2 - 0.2 rnA Supply Voltage Vs 4.75 5.0 5.25 V Supply Current 10 5.0 - rnA - Unit Full Scale Output Range VFSO 0.3 - 4.7 V Sensitivity (over temperature range) (1) (2) (3) AV/AG 5.8 6.5 7.2 mV/g Zero Acceleration Output (TA = 25°C) (4) Volt 2.3 2.5 2.7 V Zero Acceleration Output (over temperature range) (3) (4) Volt 2.1 2.5 2.9 V Linearity - - 0.5 - %FSO Transverse Sensitivity - - 1.0 3.0 %FSO Frequency Bandwidth - - 700 - Hz Noise - - 20 50 mVpk GS 44 50 56 g VTH 1.6 - 3.4 V - 10 - !lA Self-Test Output Equivalent (5) . Self-Test Triggering Voltage - Self-Test Input Current NOTES: 1. The output voltage increases from the Zero Acceleration Output for positive acceleration and decreases for negative acceleration. The typical sensitivity is 6.5 mV/g. For example. with Vs = 5.0 V. a + 100g input will result in a 3.15 V output. (Voutput = 2.5 + 0.0065 x 100) and a -1 OOg input will result in a 1.85 V output. 2. Sensitivity is a ratio metric parameter: AV/AG(Vs) = AV/AG(5 V) x (VS/5 V). 3. The compensated temperature range is -40 to +85°C. 4. Zero Acceleration Output is a ratiometric parameter: Volt(Vs) = Volt(5 V) x (VS/5 V). 5. Equivalent output in response to a Logic Level One on the self-test pin. 6. Additional temperature range available. Consult factory. ORDERING INFORMATION Device Temperature Range Case No. Package XMMAS250G10D -40 to +85°C Case 648C-03 Plastic DIP XMMAS250Gl0S -40 to +85°C Case 447-01 Plastic SIP 2-110 Motorola Sensor Device Data XMMAS250G10D XMMAS250G10S POSITIVE ACCELERATION SENSING DIRECTION t DIP PACKAGE SIP PACKAGE • When positioned as shown, gravily will result in a posilive 19 output SIP PACKAGE DRILLING PATTERN 1 l~ 111 i-:::: "0.00"::~ "00~ ': ___ I I SJf---------- .240 2 x 0 .058 ~ :~~~ - - - - - - - - ' / Motorola Sensor Device Data 2-111 MOTOROLA SEMICONDUCTOR TECHNICAL DATA XMMAS500G10D XMMAS500G10S Preliminary Information Micromachined Accelerometer ±500g Amplified MICROMACHINED ACCELEROMETER ±500g AMPLIFIED The MMAS500G family of silicon capacitive, micro-machined accelerometers features integral signal amplification, signal conditioning, a 4-pole low-pass filter and temperature compensation. Zero-G offset, full scale span and filter roll-off are factory set and require no external passives. A calibrated self-test feature mechanically displaces the seismic mass with the application of a digital self-test signal. The device is offered in either of two plastic packages, thereby accommodating various axis orientation requirements. The MMAS500G incorporates a single polysilicon seismic mass, suspended between two fixed polysilicon plates (G-cell). The forces of acceleration move the seismic mass, thereby resulting in a change in capacitance. The G-cell is sealed at the die level, creating a particle-free environment. The G-cell features built-in damping and over-range stops to protect it from mechanical shock. MMAS500G accelerometers are ideally suited for automotive crash detection and recording, vibration monitoring, automotive suspension control, appliance control systems, etc. DIP PACKAGE CASE 648C-03 SIP PACKAGE CASE 447-01 Features • • PIN NUMBER Full Scale Measurement ±500g Calibrated, True Self-Test 1 N/C(1) 9 N/C (1) N/C(1) 10 N/C(1) • Standard 16-Pin Plastic DIP 2 • Integral Signal Conditioning and 4-Pole Filter 3 N/C (1) 11 N/C(1) • • Linear Output Robust, High Shock Survivability 4 Self-Test 12 N/C (1) 5 Output 13 N/C(1) 6 Bypass (2) 14 N/C(1) 7 GND 15 N/C (1) 8 Vs (2) 16 N/C (1) SIMPLIFIED BLOCK DIAGRAM + r-----I I I 4 NOTES: 1. Internal connections. All N/C must remain floating, except DIP's pin 11 which must be tied to pin 8. 2. Bypass to ground with 0.1 flF ceramic capacitor to improve noise performance. + ~E-",::,,-,_jJ~s_--, G-CELL + I I I I I 6 . .------~~~--~~I~ I I I LOW-PASS FILTER BYPASS ::;;: 5 OUTPUT This document contains Information on a product under development. Motorola reserves the right to change or discontinue this product without notice. 2-112 Motorola Sensor Device Data XMMAS500G1 OD XMMAS500G1 OS MAXIMUM RATINGS Symbol Value Acceleration (biased each axis) Rating G ±1000 g Acceleration (unbiased each axis) G ±2000 g VSmax -0.3 to +7.0 Vdc Tstg -40 to +125 'C TA -40 to +85 'C Supply Voltage Storage Temperature Operating Temperature(6) Unit OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25'C unless otherwise noted) Characteristic Typ Max - - g -0.2 0.2 rnA 4.75 5.0 5.25 V 5.0 - rnA Symbol Min Acceleration Range G ±500 Output Drive Capability - Supply Voltage Vs Supply Current 10 - Unit Full Scale Output Range VFSO 0.3 - 4.7 V Sensitivity (over temperature range) (1) (2) (3) IW/IlG 2.9 3.2 3.6 mV/g V Zero Acceleration Output (TA = 25'C) (4) Voll 2.3 2.5 2.7 Zero Acceleration Output (over temperature range) (3) (4) Voll 2.1 2.5 2.9 V Linearity - - 0.5 - %FSO Transverse Sensitivity - - 1.0 3.0 %FSO Frequency Bandwidth - - 700 - Hz Noise - - 20 50 mVpk Self-Test Output Equivalent (5) GS 44 50 56 g Self-Test Triggering Voltage VTH 1.6 - 3.4 V - 10 - !IA - Self-Test Input Current NOTES: 1. The output voltage increases from the Zero Acceleration Output for positive acceleration and decreases for negative acceleration. The typical sensitivity is 3.2 mV/g. For example, with Vs = 5.0 V, a +2S0g input will result in a 3.3 V output. (Voutput = 2.5 + 0.0032 x 250) and a-2S0g input will result in a 1.7 V output. 2. Sensitivity is a ratiometric parameter: IlV/IlG(Vs) = IlV/IlG(S V) x (VS/S V). 3. The compensated temperature range is -40 to +85'C. 4. Zero Acceleration Output is a ratiometric parameter: VolI(Vs) = VolI(5 V) x (VS/5 V). 5. Equivalent output in response to a Logic Level One on the self-test pin. 6. Additional temperature range available. Consult factory. ORDERING INFORMATION Device Temperature Range Case No. Package XMMASSOOG10D -40 to +85'C Case 648C-03 Plastic DIP XMMAS500G10S -40 to +85'C Case 447-01 Plastic SIP Motorola Sensor Device Data 2-113 XMMAS500G10D XM MAS500G 1 OS POSITIVE ACCELERATION SENSING DIRECTION t DIP PACKAGE SIP PACKAGE • When positioned as shown, gravity will result in a positive 1g output SIP PACKAGE DRILLING PATTERN ,,0..0 , : "0096 ':::: 2 x 0 .058 2-114 I I11 ~ 111 il----'::: ~ j).....---------.240 ~ :~~~ - - - - - - - - - ' / Motorola Sensor Device Data Section Three Quality and Reliability Quality and Reliability - Overview . ......... 3-2 Reliability Issues for Silicon Pressure Sensors ................................... 3-3 Reliability Tests for Automotive/Industrial Pressure Sensors ......................... 3-9 Statistical Process Control ................. 3-10 Electrostatic Discharge Data ............... 3-14 Motorola Sensor Device Data Quality and Reliability 3-1 Quality and Reliability - Overview A Major Objective of the Production Cycle From rigid incoming inspection of piece parts and materials to stringent outgoing quality verification, the Motorola assembly and process flow is encompassed by an elaborate system of test and inspection stations; stations to ensure a step-by-step adherence to prescribed procedure. This produces the high level of quality for which Motorola is known ... from start to finish. As illustrated in the process flow overview, every major manufacturing step is followed by an appropriate in-process QA inspection to insure product conformance to specification. In addition, Statistical Process Control (S.P.C.) techniques are utilized on all critical processes to insure processing equipment is capable of producing the product to the target specification while minimizing the variability. Quality control in wafer processing, assembly, and final test impart Motorola sensor products with a level of reliability that easily exceeds almost all industrial, consumer, and military requirements. It is this built-in quality that insures failure-free shipments of Motorola sensor products. Compensated Sensor Flow Chart Quality and Reliability 3-2 Motorola Sensor Device Data Reliability Issues for Silicon Pressure Sensors by Theresa Maudie and Bob Tucker, Signal Products Division, Communications, Power and Signal Technologies Group ABSTRACT Reliability testing for silicon pressure sensors is of greater importance than ever before with the dramatic increase in sensor usage. This growth is seen in applications replacing mechanical systems, as well as new designs. Across all market segments, the expectation for the highest reliability exists. While sensor demand has grown across all of these segments, the substantial increase of sensing applications in the automotive arena is driving the need for improved reliability and test capability. Unfortunately, sensor reliability is a subject that has not been widely discussed or publicized. The purpose of this paper is to take a closer look at these reliability issues for silicon pressure sensors. INTRODUCTION Discussing reliability as it pertains to semiconductor electronics is certainly not a new subject. However, when developing new technologies like sensors how reliability testing will be performed is not always obvious. Pressure sensors are an intriguing dilemma. Since they are electromechanical devices, different types of stresses should be considered to insure the different elements are exercised as they would be in an actual application. In addition, the very different package outlines relative to other standard semiconductor packages require special fixtures and test set-ups. However, as the sensor marketplace continues to grow, reliability testing becomes more important than ever to insure that products being used across all market segments will meet standard reliability lifetime expectations. RELIABILITY DEFINITION Reliability is (1) the probability of a product performing its intended function over its intended lifetime and under the operating conditions encountered. The four key elements of the definition are probability, performance, lifetime, and operating conditions. Probability implies that the reliability lifetime estimates will be made based on statistical techniques where samples are tested to predict the lifetime of the manufactured products. Performance is a key in that the sample predicts the performance of the product at a given point in time but the variability in manufacturing must be controlled so that all devices perform to the same functional level. Lifetime is the period of time over which the product is intended to perform. This lifetime could be as small as one week in the case of a disposable blood pressure transducer or as long as 30 years as often specified for communication applications. Environment is the area that also plays a key role since the operating conditions of the product can greatly influence the reliability of the product. Environmental factors that can be seen during the lifetime of any semiconductor product include temperature, humidity, electric field, magnetic field, current density, pressure differential, vibration, and/or a chemical interaction. Reliability testing is generally formulated to take into account all of Motorola Sensor Device Data these potential factors either individually or in multiple combinations. Once the testing has been completed predictions can be made for the intended product customer base. If a failure would be detected during reliability testing, the cause of the failure can be categorized into one of the following: design, manufacturing, materials, or user. The possible impact on the improvements that may need to be made for a product is influenced by the stage of product development. If a product undergoes reliability testing early in its development phase, the corrective action process can generally occur in an expedient manner and at minimum cost. This would be true whether the cause of failure was attributed to the design, manufacturing, or materials. If a reliability failure is detected once the product is in full production, changes can be very difficult to make and generally are very costly. This scenario would sometimes result in a total redesign. The potential cause for a reliability failure can also be user induced. This is generally the area that the least information is known, especially for a commodity type manufacturer that achieves sales through a global distribution network. It is the task of the reliability engineer to best anticipate the multitudes of environments that a particular product might see, and determine the robustness of the product by measuring the reliability lifetime parameters. The areas of design, manufacturing, and materials are generally well understood by the reliability engineer, but without the correct environmental usage, customer satisfaction can suffer from lack of optimization. RELIABILITY STATISTICS Without standardization of the semiconductor sensor standards the end customer is placed in a situation of possible jeopardy. If non-standard reliability data is generated and published by manufacturers, the information can be perplexing to disseminate and compare. Reliability lifetime statistics can be confusing for the novice user of the information, "let the buyer beware". The reporting of reliability statistics is generally in terms of failure rate, measured in FITs, or failure rate for one billion device hours. In most cases, the underlying assumption used in reporting either the failure rate or the MTBF is that the failures occurring during the reliability test follow an exponentiallife distribution. The inverse of the failure rate is the MTBF, or mean time between failure. The details on the various life distributions will not be explored here but the key concern about the exponential distribution is that the failure rate over time is constant. Other life distributions, such as the lognormal or Weibull can take on different failure rates over time, in particular, both distributions can represent a wear out or increasing failure rate that might be seen on a product reaching the limitations on its lifetime or for certain types of failure mechanisms. The time duration use for the prediction of most reliability statistics is of relatively short duration with respect to the product's lifetime ability and failures are usually not observed. When a test is terminated after a set number of hours is achieved, or time censored, and no failures are observed, the failure rate can be estimated by use of the chi- Quality and Reliability 3-3 new product and they have put a total of 1 ,000 parts on a high temperature storage test for 500 hours each, their corresponding cumulative device hours would be 500,000 device hours. Vendor B has been in the business for several years on the same product and has tested a total of 500,000 parts for 10 hours each to the same conditions as part of an in-line burn-in test for a total of 5,000,000 device hours. The corresponding failure rate for a 60% confidence level for vendor A would be 1,833 FITs, vendor B would have a FIT rate of 183 FITs. square distribution which relates observed and expected frequencies of an event to established confidence intervals (4). The relationship between failure rate and the chi-square distribution is as follows: A _ '1.2 (n, d.!.) L1 - 2t Where: A L1 '1.2 a d.f. r = failure rate Table 1. Chi-Square Table lower one side confidence limit chi-square function risk, (1-confidence level) Chi-Square Distribution Function 60% Confidence Level degrees of freedom = 2 r + 2 number of failures No. Fails device hours Chi-square values for 60% and 90% confidence intervals for up to 12 failures are shown in Table 1. As indicated by the table, when no failures occur, an estimate for the chi-square distribution interval is obtainable. This interval estimate can then be used to solve for the failure rate, as shown in the equation above. If no failures occur, the failure rate estimate is solely a function of the accumulated device hours. This estimate can vary dramatically as additional device hours are accumulated. As a means of showing the influence of device hours with no failures on the failure rate value, a graphical representation of cumulative device hours versus the failure rate measured in FITs is shown in Figure 1. A descriptive example between two potential vendors best serves to demonstrate the point. If vendor A is introducing a 109 ~ 108 107 ~ ~ uj !;;: a: LU a: '"11:-' 106 ~ ! ~ 105 ~ 104 1.833 0 4.605 1 4.045 1 7.779 2 6.211 2 10.645 3 8.351 3 13.362 15.987 10.473 4 12.584 5 18.549 6 14.685 6 21.064 7 16.780 7 23.542 8 18.868 8 25.989 9 20.951 9 28.412 10 23.031 10 30.813 11 25.106 11 33.196 12 27.179 12 35.563 ~ ~ 10 100 .".1,000 ... X2 Quantity 0 4 ! 100 10 No. Fails 5 1,000 0.1 90% Confidence Level X2 Quantity ~ ~ ~ . " CUMULATIVE DEVICE HOURS, It] Figure 9. Depiction of the Influence on the cumulative device hours with no failures and the Failure Rate as measured in FITs. Quality and Reliability 3-4 Motorola Sensor Device Data One could thus imply that the reliability performance indicates that vendor B has an order of magnitude improvement in performance over vendor A with neither one seeing an occurrence of failure during their performance. The incorrect assumption of a constant failure rate over time can potentially result in a less reliable device being designed into an application. The reliability testing assumptions and test methodology between the various vendors needs to be critiqued to insure a full understanding of the product performance over the intended lifetime, especially in the case of a new product. INDUSTRY RELIABILITY STANDARDS Reliability standards for large market segments are often developed by "cross-corporation" committees that evaluate the requirements for the particular application of interest. It is the role of these committees to generate documents intended as guides for technical personnel of the end users and suppliers, to assist with the following functions: specifying, developing, demonstrating, calibrating, and testing the performance characteristics for the specific application. One such committee which has developed a standard for a particular application is the Blood Pressure Monitoring Committee of the Association for the Advancement of Medical Instrumentation (AAMI) (2). Their document, the "American National Standard for Interchangeability and Performance of Resistive Bridge Type Blood Pressure Transducers", has an objective to provide performance requirements, test methodology, and terminology that will help insure that safe, accurate blood pressure transducers are supplied to the marketplace. In the automotive arena, the Society of Automotive Engineers (SA E) develops standards for various pressure sensor applications such as SAE document J 1346, "Guide to Manifold Absolute Pressure Transducer Representative Test Method" (3). While these two very distinct groups have successfully developed the requirements for their solid-state silicon pressure sensor needs, no real standard has been set for the general industrial marketplace to insure products being offered have been tested to insure reliability under industrial conditions. Motorola has utilized MIL-STD-750 as a reference document in establishing reliability testing practices for the silicon pressure sensor, but the differences in the technology between a discrete semiconductor and a silicon pressure sensor varies dramatically. The additional tests that are utilized in semiconductor sensor reliability testing are based on the worst case operational conditions that the device might encounter in actual usage. ESTABLISHED SENSOR TESTING Motorola has established semiconductor sensor reliability testing based on exercising to detect failures by the presence of the environmental stress. Potential failure modes and mechanisms are developed by allowing tests to run beyond normal test times, thus stressing to destruction. The typical reliability test matrix used to insure conformance to customers end usage is as follows: Motorola Sensor Device Data PULSED PRESSURE TEMPERATURE CYCLING WITH BIAS (PPTCB) This test is an environmental stress test combined with cyclic pressure loading in which devices are alternately subjected to a low and high temperature while operating under a cyclical pressure load. This test simulates the extremes in the operational life of a pressure sensor. Typical Test Conditions: TA = - 40°C to + 125°C, dwell time 15 minutes, transfer time 15 minutes, bias = 100% rated voltage, pressure = a to full scale, pressure frequency = 2 to 10 seconds, test time = 168 to 1000 hours. Potential Failure Modes: Open, short, parametric shift. Potential Failure Mechanisms: Wire bond, wire, die bond, gel aeration, package failures, parametric stability. HIGH HUMIDITY, HIGH TEMPERATURE WITH BIAS (H3TB) A combined environmental/electrical stress test in which devices are subjected to an elevated ambient temperature and humidity while the units are biased. Typical Test Conditions: TA = 85°C, relative humidity = 85%, bias = 100% rated voltage, test time = 168 to 1000 hours Potential Failure Modes: Open, short, parametric shift. Potential Failure Mechanisms: Wire bond, package failure, parametric stability. HIGH TEMPERATURE WITH BIAS (HTB) This operational test exposes the pressure sensor to a high temperature ambient environment in which the device is biased to the rated voltage. Typical Test Conditions: TA =+125°C, bias = 100% rated voltage, test time = 168 to 1000 hours. Potential Failure Modes: Parametric shift in offset or linearity. Potential Failure Mechanisms: Die stability. HIGH AND LOW TEMPERATURE STORAGE LIFE (HTSL AND LTSL) High and low temperature storage life testing is performed to simulate the potential storage or operational conditions that the pressure sensor might encounter in actual usage. The test also evaluates the devices thermal integrity at worst case temperature. Typical Test Conditions: TA = + 125°C or TA = - 40°C, test time = 168 to 1000 hours. Potential Failure Modes: Parametric shifts in offset and linearity. Potential Failure Mechanisms: Bulk die defects or diffusion defects. Quality and Reliability 3-5 TEMPERATURE CYCLING (TC) This is an environmental test in which the pressure sensor is alternatively subjected to hot and cold temperature extremes with a short stabilization time at each temperature in an air medium. This test will stress the devices by generating thermal mismatches between materials. Typical Test Conditions: TA = - 40°C to + 125°C, Dwell time 15 minutes, transfer time 5 minutes, test time = 100 to 1000 cycles. Potential Failure Modes: Open, parametric shift in offset or linearity. Potential Failure Mechanisms: Wire bond, die bond, package failures, gel aeration. MECHANICAL SHOCK This is an environmental test where the sensor device is tested to determine its ability to withstand a sudden change in mechanical stress due to an abrupt change in motion. This test simulates motion that may be seen in handling, transportation, or actual use. Typical Test Conditions: Acceleration = 1500 g's, orientation =X 1, X2, Y 1, Z1, Z2 plane,time =0.5 millisecond, blows =5. Potential Failure Modes: Open, parametric shift in offset. Potential Failure Mechanisms: Diaphragm fracture, package failure, die and wire bonds. VARIABLE FREQUENCY VARIATION A test to examine the ability of the' pressure sensor device to withstand deterioration due to mechanical resonance. Typical Test Conditions: Frequency = 100 Hz to 2 kHz, orientation = X 1, X2, Y 1, Z 1, Z2 plane, time = 48 minutes. Potential Failure Modes: Open, parametric shift in offset. Potential Failure Mechanisms: Diaphragm fracture, package failure, die and wire bonds. SOLDERABILITY The purpose of this test is to measure the ability of device leads/terminals to be soldered after an extended period of storage (shelf life). Typical Test Conditions: Steam aging = 8 hours, Flux = R, Solder = SN60, SN63. Potential Failure Modes: Pin holes, non-wetling, dewetting. Potential Failure Mechanisms: Poor plating, contaminated leads. Typical Test Conditions: Pressure = 6 times rated pressure, blow = 1, time = 15 seconds. Potential Failure Modes: Open, parametric shift in offset, span. Potential Failure Mechanisms: Die bond, package failure. SALT ATMOSPHERE A test to simulate a sea coast condition and the ability of the pressure sensor's packaging to resist corrosion. Typical Test Conditions: Rate of salt deposited in the test area is between 50g/m2/day, temperature = 35°C,time = 24 hours. Potential Failure Modes: Open, parametric shifts in offset, span. Potential Failure Mechanisms: Package failure, corrosion, contamination. A sufficient sample size manufactured over a pre-defined time interval to maximize process and time variability is tested based on the guidelines of the matrix shown above. This test methodology is employed on all new product introductions and process changes on current products. Summary statistics from several recent reliability studies performed on silicon pressure sensors are shown in Table 2. A silicon pressure sensor has a typical usage environment of pressure, temperature, and voltage. Unlike the typical bipolar transistor life tests which incorporate current density and temperature to accelerate failures, a silicon pressure sensor's acceleration of its lifetime performance is primarily based on the pressure and temperature interaction with a presence of bias. This rationale was incorporated into the development of the Pulsed Pressure Temperature Cycling with Bias (PPTCB) test where the major acceleration factor is the pressure and temperature component. It is also why PPTCB is the standard sensor operational life test. Table 2. Summary Data for Recent Reliability Studies H3TB PPTCB HTB Cum. Hrs. Result FITs 60% Cum. Hrs. Result FITs 60% Cum. Hrs. Resu~ FITs 60% 2305 50 0 3975 6300 00 0 1455 134028 0 6838 LTSL HTSL TC Cum. Hrs. Result FITs 60% Cum. Hrs. Result FITs 60% Cum. Hrs. Resu~ FITs 60% 1113 000 0 823 4170 00 0 2198 123550 0 0 742 MECHSHOCK VARI. FREQ. VIBR. SALT ATM. Cum. Hrs. Result Cum. Hrs. Result Cum. Hrs. Result 123 0 122 0 83 0 BACK SIDE BLOWOFF This test is performed to determine the ability of the pressure sensor element to withstand excessive pressure in the sensing environment. The test is performed from the back side by trying to lift the die from the package due to the positive pressure being applied. Quality and Reliability 3-6 To insure that silicon pressure sensors are designed and manufactured for reliability, an in-depth insight into what mechanisms cause particular failures is required. It is safe to say that unless a manufacturer has a clear understanding of everything that can go wrong with the device, it cannot Motorola Sensor Device Data design a device for the highest reliability. Figure 2 provides a look into the sensor operating concerns for a variety of potential usage applications. This information is utilized when developing the Failure Mode and Effects Analysis (FMEA). The FMEA then serves as the documentation that demonstrates all design and process concerns have been addressed to offer the most reliable approach. By understanding how to design products, control processes, and eliminate the concerns raised, a reliable product is achieved. ACCELERATED LIFE TESTING It is very difficult to access the reliability statistics for a product when very few or no failures occur. With cost as a predominant factor in any industrial setting and time of the utmost importance, the reliability test must be optimized. Optimization of reliability testing will allow the maximum amount of information on the product being tested to be gained in a minimum amount of time, this is accomplished by using accelerated life testing techniques. A key underlying assumption in the usage of accelerated life testing to estimate the life of a product at a lower or nominal stress is that the failure mechanism encountered at the high stress is the same as that encountered at the nominal stress. The most frequently applied accelerated environmental stress for semiconductors is temperature, it will be briefly explained here for its utilization in determining the lifetime reliability statistics for silicon pressure sensors. SENSOR RELIABILITY CONCERNS GEL: Viscosity Thermal Coefficient of Expansion Permeability Changes in Material or Process Height Coverage Uniformity Adhesive Properties Media Compatibility Gel Aeration Compressibility PACKAGE: Integrity Plating Quality Dimensions Thermal Resistance Mechanical Resistance Pressure Resistance BONDING WIRES: Strength Placement Height and Loop Size Material Bimetallic Contamination (Kirkendall Voids) Nicking and other damage General Quality & Workmanship LEADS: Materials and Finish Plating Integrity Solderability General Quality Strength Contamination Corrosion Adhesion MARKING: Permanency Clarity DIEATIACH: Uniformity Resistance to Mechanical Stress Resistance to Temperature Stress Wetting Adhesive Strength Process Controls Die Orientation Die Height Change in Material or Process Media Compatibility Compressibility DIE METALLIZATION: Lifting or Peeling Alignment Scratches Voids Laser Trimming Thickness Step Coverage Contact Resistance Integrity }--~--DIAPHRAGM: Size Thickness Uniformity Pits Alignment Fracture PASSIVATION: Thickness Mechanical Defects Integrity Uniformity ELECTRICAL PERFORMANCE: Continuity and Shorts Parametric Stability Parametric Pertormance Temperature Performance Temperature Stability Long Term Reliability Storage Degradation Susceptibility to Radiation Damage Design Quality DESIGN CHANGES MATERIAL OR PROCESS CHANGES FAB & ASSEMBLY CLEANLINESS SURFACE CONTAMINATION FOREIGN MATERIAL SCRIBE DEFECTS DIFFUSION DEFECTS OXIDE DEFECTS Figure 10. Process and Product Variability Concerns During Reliability Testing Motorola Sensor Device Data Quality and Reliability 3-7 The temperature acceleration factor for a particular failure mechanism can be related by taking the ratio for the reaction rate of the two different stress levels as expressed by the Arrhenius type of equation. The mathematical derivation of the first order chemical reaction rate computes to: AF AF Where: AF RT t T ea k LS HS = = (RT)Hs (RT)Ls exp l 15500 volts The code "N/S" signifies a non-sensitive device. "SEN" are considered sensitive and should be handled according to ESD procedures. Of the various products manufactured by the Communications, Power and Signal Technologies Group, the following examples list general device families by not sensitive to extremely sensitive. LINE CASE CLASS PRODUCT DESCRIPTION MPX10D XL0010V1 344-08 3-8EN Uncompensated MPX10DP XL0010V1 352-02 3-SEN Uncompensated MPX10GP XL0010V1 350-02 3-SEN Uncompensated MPX10GVP XL0010V1 350-04 3-SEN Uncompensated MPX10GS XL0010V1 371-06 3-8EN Uncompensated MPX10GVS XL0010V1 371-05 3-8EN Uncompensated MPX10GSX XL0010V1 371C-02 3-8EN Uncompensated MPX10GVSX XL0010V1 371D-02 3-8EN Uncompensated MPX12D XLOO12V1 344-08 3-8EN Uncompensated MPX12DP XL0012V1 352-02 3-SEN Uncompensated MPX12GP XLOO12V1 350-02 3-SEN Uncompensated MPX12GVP XLOO12V1 350-04 3-8EN Uncompensated MPX12GS XLOO12V1 371-06 3-8EN Uncompensated MPX12GVS XLOO12V1 371-05 3-SEN Uncompensated MPX12GSX XL0012V1 371G-02 3-SEN Uncompensated MPX12GVSX XLOO12V1 371D-02 3-SEN Uncompensated MPX50D XL0050V3 344-08 3-8EN Uncompensated MPX50DP XL0050V3 352-02 3-8EN Uncompensated MPX50GP XL0050V3 350-02 3-8 EN Uncompensated MPX50GVP XL0050V3 350-04 3-8 EN Uncompensated MPX50GS XL0050V3 371-06 3-SEN Uncompensated MPX50GVS XL0050V3 371-05 3-SEN Uncompensated MPX50GSX XL0050V3 371G-02 3-8EN Uncompensated MPX50GVSX XL0050V3 3710-02 3-8EN Uncompensated MPX100A XL0100V2 344-08 Uncompensated Mt-'X1OOAt-' XLOiOOV2 350-02 3-8 EN ,.. ror-,,, Quality and Reliability 3-14 .J-vl:=l~ Unccmpensated Motorola Sensor Device Data DEVICE LINE CASE CLASS PRODUCT DESCRIPTION MPX100AS XL0100V2 371-06 3-SEN Uncompensated MPX100ASX XL0100V2 371C-02 3-SEN Uncompensated MPX1000 XL0100V3 344-08 3-SEN Uncompensated MPX1000P XL0100V3 352-02 3-SEN Uncompensated MPX100GP XL0100V3 350-02 3-SEN Uncompensated MPX100GVP XL0100V3 350-04 3-SEN Uncompensated MPX100GS XL0100V3 371-06 3-SEN Uncompensated MPX100GVS XL0100V3 371-05 3-SEN Uncompensated MPX100GSX XL0100V3 371C-02 3-SEN Uncompensated MPX100GVSX XL0100V3 3710-02 3-SEN Uncompensated MPX200A XL0200V2 344-08 3-SEN Uncompensated MPX200AP XL0200V2 350-02 3-SEN Uncompensated MPX200AS XL0200V2 371-06 3-SEN Uncompensated MPX200ASX XL0200V2 371C-02 3-SEN Uncompensated MPX2000 XL0200V3 344-08 3-SEN Uncompensated MPX2000P XL0200V3 352-02 3-SEN Uncompensated MPX200GP XL0200V3 350-02 3-8EN Uncompensated MPX200GVP XL0200V3 350-04 3-8EN Uncompensated MPX200GS XL0200V3 371-06 3-SEN Uncompensated MPX200GVS XL0200V3 371-05 3-SEN Uncompensated MPX200GSX XL0200V3 371C-02 3-SEN Uncompensated MPX200GVSX XL0200V3 3710-02 3-SEN Uncompensated MPX700A XL0700V2 344-08 3-SEN Uncompensated MPX700AP XL0700V2 350--02 3-SEN Uncompensated MPX700AS XL0700V2 371.,.06 3-SEN Uncompensated MPX700ASX XL0700V2 371C-02 3-8EN Uncompensated MPX7000 XL0700V1 344-08 3-8 EN Uncompensated MPX7000P XL0700V1 352-02 3-8 EN Uncompensated MPX700GP XL0700V1 350-02 3-8 EN Uncompensated MPX700GVP XL0700V1 350-04 3-8EN Uncompensated MPX700GS XL0700V1 371-06 3-8 EN Uncompensated MPX700GVS XL0700V1 371-05 3-8 EN Uncompensated MPX700GSX XL0700V1 371C-02 3-8EN Uncompensated MPX700GVSX XL0700V1 3710-02 3-8EN Uncompensated MPX9060 XL0010M1 867-04 3-SEN Uncompensated MPX906GVW XL0010M1 867H-02 3-SEN Uncompensated MPX20100 XL2010V5 344-08 1-SEN Temperature Compensated/Calibrated MPX20100P XL2010V5 352-02 1-SEN Temperature Compensated/Calibrated MPX2010GP XL2010V5 350-02 1-SEN Temperature Compensated/Calibrated MPX2010GVP XL2010V5 350-04 1-SEN Temperature Compensated/Calibrated MPX2010GS XL2010V5 371-06 1-SEN Temperature Compensated/Calibrated MPX2010GVS XL2010V5 371-05 1-SEN Temperature Compensated/Calibrated MPX2010GSX XL2010V5 371C-02 1-SEN Temperature Compensated/Calibrated MPX2010GVSX XL2010V5 3710-02 1-8EN Temperature Compensated/Calibrated Motorola Sensor Device Data Quality and Reliability 3-15 DEVICE LINE CASE CLASS PRODUCT DESCRIPTION MPX2050D XL2050V3 344-08 1-SEN Temperature Compensated/Calibrated MPX2050DP XL2050V3 352-02 1-SEN Temperature Compensated/Calibrated MPX2050GP XL2050V3 350-02 1-SEN Temperature Compensated/Calibrated MPX2050GVP XL2050V3 350-04 1-8EN Temperature Compensated/Calibrated MPX2050GS XL2050V3 371-06 1-8EN Temperature Compensated/Calibrated MPX2050GVS XL2050V3 371-05 1-SEN Temperature Compensated/Calibrated MPX2050GSX XL2050V3 371C-02 1-8EN Temperature Compensated/Calibrated MPX2050GVSX XL2050V3 3710-02 1-SEN Temperature Compensated/Calibrated MPX2052D XL2050V3,V1 344-08 1-SEN Temperature Compensated/Calibrated MPX2052DP XL2050V3,V1 352-02 1-SEN Temperature Compensated/Calibrated MPX2052GP XL2050V3,V1 350-02 1-SEN Temperature Compensated/Calibrated MPX2052GVP XL2050V3,V1 350-04 1-SEN Temperature Compensated/Calibrated MPX2052GS XL2050V3,V1 371-06 1-SEN Temperature Compensated/Calibrated MPX2052GVS XL2050V3,V1 371-05 1-SEN Temperature Compensated/Calibrated MPX2052GSX XL2050V3,V1 371C-02 1-SEN Temperature Compensated/Calibrated MPX2052GVSX XL2050V3,V1 3710-02 1-SEN Temperature Compensated/Calibrated MPX2100A XL2100V2 344-08 1-SEN Temperature Compensated/Calibrated MPX2100AP XL2100V2 350-02 1-SEN Temperature Compensated/Calibrated MPX2100AS XL2100V2 371-06 1-SEN Temperature Compensated/Calibrated MPX2100ASX XL2100V2 371C-02 1-SEN Temperature Compensated/Calibrated MPX2100D XL2100V3 344-08 1-SEN Temperature Compensated/Calibrated MPX2100DP XL2100V3 352-02 1-SEN Temperature Compensated/Calibrated MPX2100GP XL2100V3 350-02 1-SEN Temperature Compensated/Calibrated MPX2100GVP XL2100V3 350-04 1-8EN Temperature Compensated/Calibrated MPX2100GS XL2100V3 371-06 1-SEN Temperature Compensated/Calibrated MPX2100GVS XL2100V3 371-05 1-SEN Temperature Compensated/Calibrated MPX2100GSX XL2100V3 371C-02 1-8EN Temperature Compensated/Calibrated MPX2100GVSX XL2100V3 3710-02 1-SEN Temperature Compensated/Calibrated MPX2200A XL2200V2 344-08 1-8EN Temperature Compensated/Calibrated MPX2200AP XL2200V2 350-02 1-SEN Temperature Compensated/Calibrated MPX2200AS XL2200V2 371-06 1-8EN Temperature Compensated/Calibrated MPX2200ASX XL2200V2 371C-02 1-SEN Temperature Compensated/Calibrated MPX22000 XL2200V3 344-08 1-SEN Temperature Compensated/Calibrated MPX22000P XL2200V3 352-02 1-SEN Temperature Compensated/Calibrated MPX2200GP XL2200V3 350-02 1-SEN Temperature Compensated/Calibrated MPX2200GVP XL2200V3 350-04 1-8EN Temperature Compensated/Calibrated MPX2200GS XL2200V3 371-06 1-8EN Temperature Compensated/Calibrated MPX2200GVS XL2200V3 371-05 1-8EN Temperature Compensated/Calibrated MPX2200GSX XL2200V3 371C-02 1-SEN Temperature Compensated/Calibrated MPX2200GVSX XL2200V3 3710-02 1-8EN Temperature Compensated/Calibrated MPX2300DT1 XL2300C1,01 C1 423-03 1-SEN Temperature Compensated/Calibrated MPX2700D XL2700V1 344-08 1-SEN Temperature Compensated/Calibrated MPX2700DP XL2700V1 352-02 1-SEN Temperature Compensated/Calibrated MPX2700GP XL2700V1 350-02 1-SEN Temperature Compensated/Calibrated Quality and Reliability 3-16 Motorola Sensor Device Data DEVICE CASE LINE CLASS PRODUCT DESCRIPTION MPX2700GVP XL2700V1 350-04 1-SEN Temperature Compensated/Calibrated MPX2700GS XL2700V1 371-06 1-SEN Temperature Compensated/Calibrated MPX2700GVS XL2700V1 371-05 1-SEN Temperature Compensated/Calibrated MPX2700GSX XL2700V1 371C-02 1-SEN Temperature Compensated/Calibrated MPX2700GVSX XL2700V1 371 D-02 1-SEN Temperature Compensated/Calibrated MPX4100A XL4101S2 867-04 1-SEN Signal-Conditioned MPX4100AP XL4101S2 8676-03 1-SEN Signal-Conditioned MPX4100AS XL4101S2 867E-02 1-SEN Signal-Conditioned MPX4100ASX XL4101S2 867F-02 1-SEN Signal-Conditioned MPX4101A XL4101S2 867-04 1-SEN Signal-Conditioned MPX4101AP XL4101S2 8678-03 1-SEN Signal-Conditioned MPX4101AS XL4101S2 867E-02 1-SEN Signal-Conditioned MPX4101ASX XL4101 S2 867F-02 1-SEN Signal-Conditioned MPX4115A XL4101S2 867-04 1-SEN Signal-Conditioned Signal-Conditioned Signal-Conditioned MPX4115AP XL4101S2 8678-03 1-SEN MPX4115AS XL4101S2 867E-02 1-SEN MPX4115ASX XL4101S2 867F-02 1-SEN Signal-Conditioned MPX4250A XL4101S2 867-04 1-SEN Signal-Conditioned MPX4250AP XL4101S2 8678-03 1-SEN Signal-Conditioned MPX4250AS XL4101S2 867E-02 1-SEN Signal-Conditioned MPX4250ASX XL4101S2 867F-02 1-SEN Signal-Conditioned MPX5010D XL4010S5 867-04 1-SEN Signal-Conditioned MPX5010DP XL4010S5 867C-03 1-SEN Signal-Conditioned MPX5010GP XL4010S5 8678-03 1-SEN Signal-Conditioned MPX5010GVP XL4010S5 867D-03 1-SEN Signal-Conditioned MPX5010GS XL4010S5 867E-02 1-SEN Signal-Conditioned MPX5010GVS XL4010S5 867A-03 1-SEN Signal-Conditioned MPX5010GSX XL4010S5 867F-02 1-SEN Signal-Conditioned MPX5010GVSX XL4010S5 867G-02 1-SEN Signal-Conditioned MPX5050D XL4051 S1 867-04 1-SEN Signal-Conditioned MPX5050DP XL4051S1 867C-03 1-SEN Signal-Conditioned MPX5050GP XL4051S1 8678-03 1-SEN Signal-Conditioned MPX5050GVP XL4051 S1 867D-03 1-SEN Signal-Conditioned MPX5050GS XL4051S1 867E-02 1-SEN Signal-Conditioned MPX5050GVS XL4051S1 867A-03 1-SEN Signal-Conditioned MPX5050GSX XL4051S1 867F-02 1-SEN Signal-Conditioned MPX5050GVSX XL4051S1 867G-02 1-SEN Signal-Conditioned MPX5100A XL4101S2 867-04 1-SEN Signal-Conditioned MpX5100AP XL4101S2 8678-03 1-SEN Signal-Conditioned MPX5100AS XL4101S2 867E-02 1-SEN Signal-Conditioned MPX5100ASX XL4101S2 867F-02 1-SEN Signal-Conditioned MPX5100D XL4101S1 867-04 1-SEN Signal-Conditioned MPX5100DP XL4101S1 867C-03 1-SEN Signal-Conditioned MPX5100GP XL4101S1 8678-03 1-SEN Signal-Conditioned Motorola Sensor Device Data Quality and Reliability 3-17 DEVICE LINE MPX5100GVP XL4101S1 MPX5100GS MPX5100GVS CASE CLASS PRODUCT DESCRIPTION 867D-03 1-SEN Signal-Conditioned XL4101S1 867E-02 1-5EN Signal-Conditioned XL4101S1 867A-03 1-5EN Signal-Conditioned MPX5100GSX XL4101S1 867F-02 1-5EN Signal-Conditioned MPX5100GVSX XL4101S1 867G-02 1-5EN Signal-Conditioned MPX5500D XL4501S1 867-04 1-5EN Signal-Conditioned MPX5500DP XL4501S1 867C-03 1-5EN Signal-Conditioned MPX5500GP XL4501S1 8678-03 1-5EN Signal-Conditioned MPX5500GVP XL4501S1 867D-03 1-5EN Signal-Conditioned MPX5500GS XL4501S1 867E-02 1-5EN Signal-Conditioned MPX5500GVS XL4501S1 867A-03 1-SEN Signal-Conditioned MPX5500GSX XL4501S1 867F-02 1-5EN Signal-Conditioned MPX5500GVSX XL4501S1 867G-02 1-SEN Signal-Conditioned MPX5700D XL4701S1 867-04 1-SEN Signal-Conditioned MPX5700DP XL4701S1 867C-03 1-SEN Signal-Conditioned Signal-Conditioned MPX5700GP XL4701S1 8678-03 1-SEN MPX5700GVP XL4701S1 867D-03 1-5EN Signal-Conditioned MPX5700GS XL4701S1 867E-02 1-SEN Signal-Conditioned MPX5700GVS XL4701S1 867A-03 1-SEN Signal-Conditioned MPX5700GSX XL4701S1 867F-02 1-SEN Signal-Conditioned MPX5700GVSX XL4701S1 867G-02 1-5EN Signal-Conditioned MPX5999D XL4999S1 867-04 1-SEN Signal-Conditioned MPX7050D XL7050V3 344-08 1-SEN High Impedance MPX7050DP XL7050V3 352-02 1-SEN High Impedance MPX7050GP XL7050V3 350-02 1-5EN High Impedance MPX7050GVP XL7050V3 350-04 1-SEN High Impedance MPX7050GS XL7050V3 371-06 1-5EN High Impedance MPX7050GVS XL7050V3 371-05 1-SEN High Impedance MPX7050GSX XL7050V3 371C-02 1-5EN High Impedance MPX7050GVSX XL7050V3 371D-02 1-SEN High Impedance MPX7100A XL7100V2 344-08 1-5EN High Impedance MPX7100AP XL7100V2 350-02 1-SEN High Impedance MPX7100AS XL7100V2 371-06 1-SEN High Impedance MPX7100ASX XL7100V2 371C-02 1-SEN High Impedance MPX7100D XL7100V3 344-08 1-5EN High Impedance MPX7100DP XL7100V3 352-02 1-5EN High Impedance MPX7100GP XL7100V3 350-02 1-5EN High Impedance MPX7100GVP XL7100V3 350-04 1-5EN High Impedance MPX7100GS XL7100V3 371-06 1-SEN High Impedance MPX7100GVS XL7100V3 371-05 1-5EN High Impedance MPX7100GSX XL7100V3 371C-02 1-SEN High Impedance MPX7100GVSX XL7100V3 371D-02 1-SEN High Impedance MPX7200A XL7200V2 344-08 1-SEN High Impedance MPX7200AP XL7200V2 350-02 1-SEN High Impedance Quality and Reliability 3-18 Motorola Sensor Device Data DEVICE LINE MPX7200AS XL7200V2 MPX7200ASX XL7200V2 MPX7200D CASE CLASS PRODUCT DESCRIPTION 371-06 1-SEN High Impedance 371C-02 1-SEN High Impedance XL7200V3 344-0B 1-SEN High Impedance MPX7200DP XL7200V3 352-02 1-SEN High Impedance MPX7200GP XL7200V3 350-02 1-SEN High Impedance MPX7200GVP XL7200V3 350-04 1-SEN High Impedance MPX7200GS XL7200V3 371-06 1-SEN High Impedance MPX7200GVS XL7200V3 371-05 1-SEN High Impedance MPX7200GSX XL7200V3 371C-02 1-SEN High Impedance MPX7200GVSX XL7200V3 371D-02 1-SEN High Impedance MTS102 XLBOO.1 29-04 1-SEN Temperature Sensor MTS103 XLBOO.1 29-04 1-SEN Temperature Sensor MTS105 XLBOO.1 29-04 1-SEN Temperature Sensor XMMAS40G10D XL040G 64BC-03 1-SEN Accelerometer XMMAS40G10S XL040GS 447-01 1-SEN Accelerometer XMMAS250G10D XL250G 64BC-03 1-SEN Accelerometer XMMAS250G10S XL250GS 447-01 1-SEN Accelerometer XMMAS500G10D XL500G 64BC-03 1-SEN Accelerometer XMMAS500G10S XL500GS 447-01 1-SEN Accelerometer Motorola Sensor Device Data Quality and Reliability 3-19 Quality and Reliability 3-20 Motorola Sensor Device Data Section Four Application Notes Applications Information . ........................ 4-2 AN935 Compensating for Nonlinearity in the MPX10 Series Pressure Transducer ..... 4-4 AN936 Mounting Techniques, Lead Forming and Testing of Motorola's MPX Series Pressure Sensors .................... 4-11 AN1082 Simple Design for a 4-20 mA Transmitter Interface Using a Motorola Pressure Sensor .............................. 4-16 AN1097 Calibration-Free Pressure Sensor System ............................. 4-19 AN1100 Analog to Digital Converter Resolution Extension Using a Motorola Pressure Sensor .............................. 4-24 AN1105 A Digital Pressure Gauge Using the Motorola MPX700 Series Differential PressureSensor ..................... 4-27 AN1303 A Simple 4-20 mA Pressure Transducer Evaluation Board ..................... 4-32 AN1304 Integrated Sensor Simplifies Bar Graph Pressure Gauge ...................... 4-37 AN1305 An Evaluation System for Direct Interface of the MPX5100 Pressure Sensor with a Microprocessor ..................... 4-42 AN1307 A Simple Pressure Regulator Using Semiconductor Pressure Transducers ......................... 4-58 AN1309 Compensated Sensor Bar Graph Pressure Gauge ...................... 4-65 AN1315 An Evaluation System Interfacing the MPX2000 Series Pressure Sensors to a Microprocessor .................. 4-72 Motorola Sensor Device Data AN1316 AN1318 AN1322 AN1324 AN1325 AN1326 AN1513 AN1516 AN1517 AN1518 AN1525 AN1535 AN1536 Frequency Output Conversion for MPX2000 Series Pressure Sensors .... 4-93 Interfacing Semiconductor Pressure Sensors to Microcomputers ........... 4-99 Applying Semiconductor Sensors to Bar Graph Pressure Gauges ......... 4-109 A Simple Sensor Interface Amplifier .... 4-114 Amplifiers for Semiconductor Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . .. 4-118 Barometric Pressure Measurement Using Semiconductor Pressure Sensors ........................... 4-122 Mounting Techniques and Plumbing Options of Motorola's MPX Series Pressure Sensors ............. 4-131 Liquid Level Control Using a Motorola Pressure Sensor ................... 4-135 Pressure Switch Design with Semiconductor Pressure Sensors ..... 4-140 Using a Pulse Width Modulated Output with Semiconductor Pressure Sensors ............................ 4-146 The A-B-C's of Signal-Conditioning Amplified Design for Sensor Applications ........................ 4-152 Semiconductor Sensors Provide a Hot Temperature Sensing Solution at a Cool Price .......................... 4-159 Digital Boat Speedometers ............ 4-166 4-1 Applications Information Example Circuits MPX2000 sensors with on-chip compensation can be used individually or in multiples in research, design, or development projects to optimize a design. The small size and low cost of the compensated MPX2000 series of sensors makes these devices ideally suited for such applications. Many process control functions can also be served by MPX2000 sensors handling pressure ranges up to 30 PSI in gauge, vacuum and differential measurements. Wind tunnel measurements, vacuum forming or vacuum pickup monitoring are among the many potential applications. Several specific applications examples are shown on the following pages. These are offered as basic suggestions only; actual component selection and values are determined by the final circuit requirements. Fluid Pressure Circuit Fluid pressure transducer circuit with inverted output. In this configuration, the circuit provides a 4 Vdc output with zero pressure applied, decreasing to 0 Vdc at full rated pressure. An ideal circuit for any type of liquid level monitoring. 100kn 0.1 444Q OP AMP IS: LM358 • TRIM TO 4.0 VOUT WITH 0 PRESSURE IN. (= 100 k) Fluid Pressure Circuit t10Vdc Simple Pressure Sensor Amplifier OUT Q-4 Vdc A single op-amp circuit which gives a 4 volt dc output for full-scale pressure input. The circuit is ratiometric, giving 2 Vdc out with a 5 volt supply. A good, low-cost general-purpose circuit for those applications where ±3% performance is acceptable, it can also be trimmed to provide ±1.5% accuracy over the 0-85°C temperature range. Multi-turn potentiometers are suggested for Roff and Rspan. 4-2 Simple Pressure Sensor Amplifier Motorola Sensor Device Data Example Circuits (continued) Portable Manometer A DVM circuit used for portable equipment such as manometers and barometers. Precision performance is achievable using a highgrade instrumentation amplifier and substituting a precision regulator forthe zener. r 9.0V (6.0 rnA) 150n DVM 0-7.5 199.9rnV 4 1.5. PSI R= 114 W. 5% METAL FILM Portable Manometer Solid State Pressure Switch A low-cost, set-point pressure switch for 115 Vac motor control applications. This circuit has I been used successfully to control compressor I and pump motors, as well as heaters in liquid L - T1 - J level applications. MPX2200GP 0-30 PSI Solid State Pressure Switch +5Vdc Microprocessor Interface Circuit High level input for an AJD converter. This circuit offers moderate performance with typical logic supply. Improved performance over temperature is possible using metal-film resistors and an LM158 op-amp. Maximum output is approximately 4.5 Vdc referenced to ground. OUT 22 M 2.2M 1.0k 20 k -= GAIN OFFSET (OPTIONAL) Microprocessor Interface Circuit Motorola Sensor Device Data 4-3 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN935 Compensating for Nonlinearity in the MPX10 Series Pressure Transducer Prepared by: Carl Demington Design Engineering INTRODUCTION This application note describes a technique to improve the linearity of Motorola's MPX10 series (i.e., MPX10, MPX11, and MPX12 pressure sensors) pressure transducers when they are interfaced to a microprocessor system. The linearization technique allows the user to obtain both high sensitivity and good linearity in a cost effective system. The MPX1 0, MPX11 and MPX12 pressure transducers are semiconductor devices which give an electrical output signal proportional to the applied pressure over the pressure range of 0-10 kPa (0-75 mm Hg). These devices use a unique transverse voltage-diffused silicon strain-gauge which is sensitive to stress produced by pressure applied to a thin silicon diaphragm. One of the primary considerations when using a pressure transducer is the linearity of the transfer function, since this parameter has a direct effect on the total accuracy of the system, and compensating for nonlinearities with peripheral circuits is extremely complicated and expensive. The purpose of this document is to outline the causes of nonlinearity, the trade-offs that can be made for increased system accuracy, and a relatively simple technique that can be utilized to maintain system performance, as well as system accuracy. ORIGINS OF NONLINEARITY Nonlinearity in semiconductor strain-gauges is a topic that has been the target of many experiments and much discussion. Parameters such as resistor size and orientation, surface impurity levels, oxide passivation thickness and growth temperatures, diaphragm size and thickness are all contributors to nonlinear behavior in silicon pressure transducers. The Motorola X-ducer was designed to minimize these effects. This goal was certainly accomplished in the MPX50, MPX1 00 and MPX200 series which have a maximum nonlinearity of 0.1% FS. However, to obtain the higher sensitivity of the MPX10 series, a maximum nonlinearity of ±1 % FS has to be allowed. The primary cause of the additional nonlinearity in the MPX10 series is due to the stress induced in the diaphragm by applied pressure being no longer linear. One of the basic assumptions in using semiconductor strain-gauges as pressure sensors is that the deflection of the diaphragm when pressure is applied is small compared to the thickness of the diaphragm. With devices that are very sensitive in the low pressure ranges, this assumption is no longer valid. The deflection olthe diaphragm is a considerable percentage of the diaphragm thickness, especially in devices with higher sensitivities (thinner diaphragms). The resulting stresses do not vary linearly with applied pressure. This behavior can be reduced somewhat by increasing the area of the diaphragm and consequently thickening the diaphragm. Due to the constraint, the device is required to have high sensitivity over a fairly small pressure range, and the nonlinearity cannot be eliminated. Much care was given in the design of the MPX10 series to minimize the nonlinear behavior. However, for systems which require greater accuracy, external techniques must be used to accountforthis behavior. PERFORMANCE OF AN MPX DEVICE The output versus pressure of a typical MPX12 along with an end-point straight line is shown in Figure 1. All nonlinearity errors are referenced to the end-point straight line (see data sheet). Notice there is an appreciable deviation from the end-point straight line at midscale pressure. This shape of curve is consistent with MPX10and MPX11, as well as MPX12 devices, with the differences between the parts being the magnitude of the deviation from the end-point line. The major tradeoff that can be made in the total device performance is sensitivity versus linearity. Figure 2 shows the relationship between full scale span and nonlinearity error for the MPX10 series of devices. The data shows the primary contribution to nonlinearity is non proportional stress with pressure, while assembly and packaging stress (scatter of the data about the line) is fairly small and well controlled. It can be seen that relatively good accuracies «0.5% FS) can be achieved at the expense of reduced sensitivity, and for high sensitivity the nonlinearity errors increase rapidly. The data shown in Figure 2 was taken at room temperature with a constant voltage excitation of 3.0 volts. REV1 4-4 Motorola Sensor Device Data AN935 90 80 :;- ~~ 70 60 .§. 50 ~ => 40 >0 ~ 30 ", 20 10 20 ~ 30 ~ 40 ~ 'P' .".... 0 In 50 60 70 80 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 20 BO = 0.1045 - 0.00295·(SPAN) ~ PRESSURE (torr) fil u.. ~ 1% indicate this technique was not as successful as desired. 4-5 AN935 NO. OF UNITS % 21.54 LINEARITY ERROR (% FS) 30 19.38 27 24 17.23 General Fit P = 1/4 FS Average Error =0.15 Standard Deviation = 0.212 21 15.08 18 12.92 15 10.77 12 8.62 9.0 6.46 6.0 4.31 Figure 6. Linearity Error of General Fit Equation at 1/4 FS NO. OF UNITS - LINEARITY ERROR (% FS) 21 t- 18 15 - General Fit P =1/2 FS Average Error =-0.02 Standard Deviation =0.391 - 6.0 "- 16.15 - 14.54 - 12.92 -11.31 - 12 - 9.0 % 9.69 -8.08 - 6.46 - 4.85 - 3.23 3.0 t- Figure 7. Linearity Error of General Fit Equation at 1/2 FS 4-6 Motorola Sensor Device Data AN935 NO. OF UNITS LINEARITY ERROR (% FS) % 12.31 16.5 11.08 15 13.5 12 9.85 General Fi1 P = 3/4 FS Average Error = -0.1 0 Standard Deviation =0.549 8.62 10.5 7.38 9.0 6.15 7.5 4.92 6.0 3.69 4.5 2.46 3.0 1.23 1.5 0:92''-;.0:-'-:~-T;:~7--:!-::-~;-L-;;-';;-'~...1...-;!~-;!-;c-Lt;:-1-;;';;-'+'"",--;;Lz-L-;!-;C-~::-L-f::-''+:''''''''Y-+::--'-;!2.0 Figure 8, Linearity Error of General Fit Equation at 3/4 FS NO. OF UNITS 19.5 LINEARITY ERROR (% FS) 12.46 18 16.5 15 13.5 12 % 13.85 11.08 General Fit P = 1 FS Average Error = 0.11 Standard Deviation =0.809 10.5 9.69 8.31 6.92 9.0 5.54 7.5 4,15 6.0 4.5 2.77 Figure 9. Linearity Error of General Fit Equation'at FS Motorola Sensor Device Data 4-7 AN935 A second technique that still uses a single pressure measurement as the input was investigated. In this method, the sensitivity coefficients are calculated using a piece-wise linearization technique where the total span variation is divided into four windows of 10 mV (i.e., 30-39.99, 40-49.99, etc.) and coefficients calculated for each window. The errors that arise out of using this method are shown in Figures 10 through 13. This method results in a large majority of the devices having errors <0.5%, while only one of the devices was> 1%. The sensitivity coefficients that are substituted into equation [2] for the different techniques are given in Table 1. It is important to note that for either technique the only measurement that is required by the user in order to clearly determine the sensitivity coefficients is the determination of the full scale span of the particular pressure transducer. NO. OF UNITS LINEARITY ERROR (% FS) 33.92 48 42 30.15 General Fit P=1f4FS 36 % 37.69 26.38 Average Error = 0.18 Standard Deviation = 0.159 22.62 30 18.85 24 15.08 18 11.31 12 7.54 6.0 3.77 0:92.0 -1.8 Figure 10. Linearity Error of Piece-Wise Linear Fit at 1/4 FS Table 1. Comparison of Linearization Methods SPAN WINDOW BO B1 B2 GENERAL FIT 0.1045 + 2.95E - 3X 0.2055 + 1.598E - 3X + 1.723E - 4X2 1.293E - 13X5.681 PIECE-WISE LINEAR FIT 30-39.99 0.08209 - 2.246E - 3X 40-49.99 0.1803 - 4.67E - 3X -0.119+ 1.655E-2X 0.1055 - 3.051E - 3X -0.355 + 2.126E - 2X -5.0813 - 3 + 1.116E - 4X -0.361 + 2.145E - 2X -5.928E - 3 + 1.259E - 4X 50-59.99 60-69.99 -0.288 + 3.473E - 3X 0.02433 = 1.430E - 2X -1.961E -4 + 8.816E - 6X -1.572E - 3 + 4.247E - 5X x = Full Scale Span 4-8 Motorola Sensor Device Data AN935 % 20 NO. OF UNITS LINEARITY ERROR (% FS) 27 18 24 16 General Fit P = 112 FS Average Error = 0.02 Standard Deviation = 0.267 21 18 14 12 15 10 12 8.0 9.0 6.0 6.0 4.0 2.0 2.0 Figure 11. Linearity Error of Piece-Wise Linear Fit at 1/2 FS NO. OF UNITS % -16.15 LINEARITY ERROR (% FS) 21- -14.54 -12.92 t8- General Fit P=3/4FS Average Error =-0.09 Standard Deviation = 0.257 15 r- -11.31 - 9.69 12C- - 8.08 9.0 f- --- 6.46 --- 4.85 6.0 f- 3.0 - I I I I n I -3.23 rr 0:!l2.0 -1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 nIn 0.4 0.6 0.8 I 1.0 1.2 I I 1.4 1.6 I 1.8 1.62 2.0 Figure 12. Linearity Error of Piece-Wise Linear Fit at 3/4 PS Motorola Sensor Device Data 4-9 AN935 % NO. OF UNITS - 38.46 LINEARITY ERROR (% FS) 52.5 r- - 34.62 45 I- 37.5 - - 3 0.77 General Fit P= t FS Average Error = 0.13 Standard Deviation = 0.186 - 26.92 - 23.08 30 -1 9.23 22.5 - -1 5.38 -1 1.54 15 r- - 7.69 - 3.85 7.5 rf- 0~2.0 I I I I I ~ I I ~ -1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 I 0.6 I 0.8 I 1.0 I 1.2 I 1.4 I 1.6 I 1.8 2.0 Figure 13. Linearity Error of Piece-Wise Linear Fit at FS Once the sensitivity coefficients have been determined, a system can then be built that provides an accurate output function with pressure. The system shown in Figure 14 consists of a pressure transducer, a temperature compensation and amplification stage, an AID converter, a microprocessor, and a display. The display block can be replaced with a control function if required. Further details on the temperature compensation and amplification block may be obtained by consulting Application Note AN840. The AID converter simply transforms the voltage signal to an input signal for the microprocessor, in which resides the look-up table of the transfer function generated from the previously determined sensitivity coefficients. The microprocessor can then drive a display or control circuit using standard techniques. TEMPERATURE COMPENSATION AND AMPLIFICATION Figure 14. Linearization System Block Diagram SUMMARY While at first glance this technique appears to be fairly complicated, it can be a very cost effective method of building a high-accuracy, high-sensitivity pressure-monitoring system for low-pressure ranges. 4-10 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN936 Mounting Techniques, Lead Forming and Testing of Motorola's MPX Series Pressure Sensors Prepared by: Randy Frank Motorola Inc., Semiconductor Products Sector Phoenix, Arizona INTRODUCTION Motorola's MPX series pressure sensors are silicon piezoresistive strain-gauges offered in a chip-carrier package (see Figure 1). The exclusive chip-carrier package was developed to realize the advantages of high-speed, automated assembly and testing. In addition to high volume availability and low cost, the chip-carrier package offers users a number of packaging options. This Application Note describes several mounting techniques. offers lead forming recommendations, and suggests means of testing the MPX series of pressure sensors. DIFFERENTIAL PORT OPTION CASE 352-02 Figure 1. MPX Pressure Sensor In Chip Carrier Package Shown with Port Options BASIC ELEMENT CASE 344 SUFFIX AID AXIAL VACUUM PORT CASE 3710 SUFFIX GVSX GAGE PORT CASE 350-03 SUFFIX AP/GP GAGE VACUUM PORT CASE 350-04 SUFFIX GVP STOVEPIPE PORT STOVEPIPE VACUUM PORT CASE 371-05 CASE 371-06 SUFFIX AS/GS SUFFIXGVS DUAL PORT CASE 867C SUFFIX DP AXIAL PORT CASE 867F SUFFIX ASX/GSX DUAL PORT CASE 352 SUFFIX DP BASIC ELEMENT CASE 867 SUFFIX AID AXIAL VACUUM PORT CASE 867G SUFFIX GVSX AXIAL PORT CASE 371C SUFFIX ASX/GSX GAGE PORT CASE 8678 SUFFIX AP I GP STOVEPIPE PORT CASE 867E SUFFIX AS/GS GAGE VACUUM PORT CASE 867D SUFFIX GVP STOVEPIPE VACUUM PORT CASE 867A SUFFIX GVS Figure 2. Chip Carrier and Available Ported Packages Motorola Sensor Device Data 4-11 AN936 PORT ADAPTERS rated pressure applied to the port nozzle and checking for air bubbles will provide a good indication. Available Packages Motorola's chip--carrier package and available ports for attachment of 1/8" 1.0. hose are made from a high temperature thermoplastic that can withstand temperature extremes from -50 to 150°C (see Figure 2). The port adapters were designed for rivet or 5/32" screw attachment to panels, printed circuit boards or chassis mounting. Custom Port Adaptor Installation Techniques The Motorola MPX silicon pressure sensor is available in a basic chip carrier cell which is adaptable for attachment to customer specific housings/ports (Case 344 for 4-pin devices and Case 867 for 6-pin devices). The basic cell has chamfered shoulders on both sides which will accept an O-ring such as Parker Seal's silicone O-ring (p/n#2--Q15-S-469-40). Refer to Figure 3 for the recommended O-ring to sensor cell interface dimensions. The sensor cell may also be glued directly to a custom housing or port using many commercial grade epoxies or RTV adhesives which adhere to grade Valox 420, 30% glass reinforced polyester resin plastic or Union Carbide's Udel® polysulfone (MPX2040D only). Motorola recommends using Thermoset EP530 epoxy or an equivalent. The epoxy should be dispensed in a continuous bead around the cell-to-port interface shoulder. Refer to Figure 4. Care must be taken to avoid gaps or voids in the adhesive bead to help ensure that a complete seal is made when the cell is joined to the port. The recommended cure conditions for Thermoset EP539 are 15 minutes at 150°C. After cure, a simple test for gross leaks should be performed to ensure the integrity of the cell to port bond. Submerging the device in water for 5 seconds with full .114 ! --+---.075 II.--+-- .037R '-='--1-0 CELL ---....I Figure 3. Examples of Motorola Sensors in Custom Housings 4-12 Pressure Connection Testing of pressure sensing elements in the chip carrier package can be performed easily by using a clamping fixture which has an O-ring seal to attach to the beveled surface. Figure 8 shows a diagram of the fixture that Motorola uses to apply pressure or vacuum to unported elements. When performing tests on packages with ports, a high durometertubing is necessary to minimize leaks, especially in higher pressure range sensors. Removal of tubing must be parallel to the port since large forces can be generated to the pressure port which can break the nozzle if applied at an angle. Whether sensors are tested with or without ports, care must be exercised so that force is not applied to the back metal cap or offset errors can result. Standard Port Attach Connection Motorola also offers standard port options designed to accept readily available silicone, vinyl, nylon or polyethylene tubing for the pressure connection. The inside dimension of the tubing selected should provide a snug fit over the port nozzle. Dimensions of the ports may be found in the case outline drawings found in section six. Installation and removal of tubing from the port nozzle must be parallel to the nozzle to avoid undue stress which may break the nozzle from the port base. Whether sensors are used with Motorola's standard ports or customer specific housings, care must be taken to ensure that force is uniformly distributed to the package or offset errors may be induced . .047 - - I - - - \ - - .125 1 TESTING MPX SERIES PRESSURE SENSORS ~- ~ ~ ADHESIVE BEAD ~ Figure 4. Port Adapter Dimensions Motorola Sensor Device Data AN936 ~ 121 = DIAMETER DIMENSIONS IN INCHES ~12I 0.400 3.96 121 0.156 1.6.N 121 0.639 _.LrUL ! 0.063 [~3tO±20 .6.1L I2I I-Hpo.36(0.014)@IAI B@ I c@1 0.250 ~12I 0.156 2 PL 13.66 13.51- /1010.36(0.014) IAIBlcl 0.538 ZONE -D- WITHIN 0.532 ZONE-O- 2.21 2.1L SECTION F F 0.087 - 0.084 Figure 5. Port Adapter Dimensions PIN 1 1$10.136(0.005)@ITI A @I NOTES. 1. DIMENSIONING AND TOLERANCING PER ANSI YI4.SM.19B2. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J L M N R INCHES MIN MAX 0590 0615 0525 0505 0.195 0225 0016 0020 0048 0052 0.100BSC 0.014 0016 0715 0685 30 0 NOM 0.480 0.500 0420 0450 STYLE l' PIN 1. GROUND 2 + OUTPUT 3. + SUPPLY 4. -OUTPUT MILLIMETERS MIN MAX 1499 1562 12.83 13.34 495 572 0.41 0.51 122 132 2.54BSC 0.36 040 1740 1816 30 0 NOM 1219 1270 1067 1143 ( BODOM CLAMP AREA )!I!] ~ Leads should be securely clamped lop and bottom in the area between the plastic body and the form being sure that no stress is being put on plastic body. The area between dotted lines represents surtaces to be clamped. CASE 344-08 All seals to be made on pressure sealing surface. Figure 6. Chip-Carrier Package Motorola Sensor Device Data Figure 7. Leadforming 4-13 AN936 Electrical Connection The MPX series pressure sensor is designed to be installed on a printed circuit board (standard 0.100" lead spacing) or to accept an appropriate connector if installed on a baseplate. The leads of the sensor may be formed at right angles for assembly to the circuit board, but one must ensure that proper leadform tech"iques and tools are employed. Hand or "needlenose" pliers should never be used for leadforming unless they are specifically designed for that purpose. Industrial leadform tooling is available from various companies including Janesville Tool & Manufacturing (608-868-4925). Refer to Figure 7 for the recommended leadform technique. It is also importantthat once the leads are formed, they should not be straightened and reformed without expecting reduced durability. The recommended connector for off-circuit board applications may be supplied by JST Corp. (1-800-292-4243) in Mount Prospect, IL. The part numbers for the housing and pins are listed below. CONCLUSION Motorola's MPX series pressure sensors in the chip carrier package provide the design engineer several packaging alternatives. They can easily be tested with or without pressure ports using the information provided. CONNECTORS FOR CHIP CARRIER PACKAGES MFG.lADDRESS/PHONE CONNECTOR PIN J.S. Terminal Corp. 1200 Business Center Dr. Mount Prospect, IL 60056 (800) 292-4243 4 Pin Housing: SMP-04V-BC 6 Pin Housing: SMP-06V-BC SHF-001T-o.8SS SHF-01T-o.8SS Methode Electronics, Inc. Rolling Meadows, IL 60008 (312) 392-3500 1300-004 Hand crimper YC-12 recommended Requires hand crimper 1400-213 1402-213 1402-214 Reel TERMINAL BLOCKS 4-14 Molex 2222 Wellington Court Lisle, IL 60532 (312) 969-4550 22-18-2043 22-16-2041 Samtec P.O. Box 1147 New Albany, IN 47150 (812) 944-6733 SSW-104-02-G-S-RA SSW-104-Q2-G-S Motorola Sensor Device Data AN936 0.01 x 45° 4 PL For Vacuum -A- --t . 0.648 --~f =-1 0.44 Dla. ±O.OOO 0.311 -0.001 - 0D~~~ . 0.780 Dla. . ±0.002 I0.57~ Dia·1 0.670 Dia. -::~~ ForO-Ring (Parker Seals 2-o1S-S469-40) 1+------1.25 Ref ---+----1 Figure 8. O-Ring Test Fixture Motorola Sensor Device Data 4-15 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1082 Simple Design for a 4-20 mA Transmitter Interface Using a Motorola Pressure Sensor Prepared by: Jean Claude Hamelain Motorola Toulouse Application Lab Manager INTRODUCTION Pressure is a very important parameter in most industrial applications such as air conditioning, liquid level sensing and flow control. In most cases, the sensor is located close to the measured source in a very noisy environment, far away from the receiver (recorder, computer, automatic controller, etc.) The transmission line can be as long as a few hundred meters and is subject to electromagnetic noise when the signal is transmitted as voltage. If the signal is transmitted as a current it is easier to recover at the receiving end and is less affected by the length of the transmission line. The purpose of this note is to describe a simple circuit which can achieve high performance, using standard Motorola pressure sensors, operational amplifiers and discrete devices. PERFORMANCES The following performances have been achieved using an MPX2100DP Motorola pressure sensor and an MC33079 quad operational amplifier. The MPX2100DP is a 100 kPa temperature compensated differential pressure sensor. The load is a 150 ohm resistor at the end of a 50 meter telephone line. The 15 volt power supply is connected at the receiver end. Power Supply +15 Vdc, 30 mA Connecting Line 3 wire telephone cable Load Resistance 150 to 400 Ohms Temperature Range -40 to +85°C (up to +125°C with special hardware) Pressure Range o to 100 kPa Total Maximum Error Better than 2% full scale Basic Circuit The Motorola MPX2100DP pressure sensor is a very high performance piezoresistive pressure sensor. Manufacturing technologies include standard bipolar processing techniques with state of the art metallization and on-chip laser trim for offset and temperature compensation. This unique design, coupled with computer laser trimming, gives this device excellent performance at competitive cost for demanding applications such as automotive, industrial or medical. 4-16 MC33078, 79 operational amplifiers are specially designed for very low input voltage, a high output voltage swing and very good stability versus temperature changes. First Stage The Motorola MPX2100 and the operational amplifier are directly powered by the 15 Vdc source. The first stage is a simple true differential amplifier made with both of the operational amplifiers in the MC33078. The potentiometer, RG, provides adjustment for the output. This first stage is available as a pressure sensor kit, SEK-1 (refer to EB130/D). If using the kit, the resistors must be changed according to the schematic below to provide a full 4-20 mA output. Current Generator The voltage to current conversion is made with a unity gain differential amplifier, one of the four operational amplifiers in an MC33079. The two output connections from the first stage are connected to the input ofthis amplifier through R3 and R5. Good linearity is achieved by the matching between R3, R4, R5 and R6, providing a good common mode rejection. Forthe same reason, a good match between resistors R8 and R9 is needed. The MC33078 or MC33079 has a limited current output; therefore, a 2N2222 general purpose transistor is connected as the actual output current source to provide a 20 mA output. To achieve good performance with a very long transmission line it may be necessary to place some capaCitors (C1, C2) between the power supply and output to prevent oscillations. Calibration The circuit is electrically connected to the 15 Vdc power supply and to the load resistor (receiver). The high pressure is connected to the pressure port and the low pressure (if using a differential pressure sensor), is connected to the vacuum port. It is important to perform the calibration with the actual transmission line connected. The circuit needs only two adjustments to achieve the 4-20 mA output current. 1. With no pressure (zero differential pressure), adjust Roff to read exactly 4 mA on the receiver. 2. Under the full scale pressure, adjust RG to exactly read 20 mA on the receiver. The calibration is now complete. Motorola Sensor Device Data AN1082 VCC = +15 Volts dc I I I I I I I I I L II II II II I I L.......IV'~f'v-AN\r-------r-----.l1 RIO Rll ~---~~~~ R12 OFFSET ADJUST Basic Circuit of SEK-l (See EB130) RG = 47 K Pot. R7 = 1 K Roff=IMPot. Rl0=110K 'Rl =R2=330KR11 =1 M 'R3=R4=27K R12=330K 'R5=R6=27K Cl =C2= 0.1 !iF 'RB = R9 = 150 aI, a2, a3 = 1/4 MC33079 , All resistor pairs must be matched at better than 0.5% -~ Additional Circuit for 4 to 20 mA current loop (Receiver Load Resistance: RL = 150 to 400 Ohms) Note A: If using SEK-l aI, a2, a3 = 1/2 MC33078 RG from 20 Kto 47 K Rl and R2 from 1Mto 330 K NOTICE: THE PRESSURE SENSOR OUTPUT IS RATIOMETRIC TO THE POWER SUPPLY VOLTAGE. THE OUTPUT WILL CHANGE WITH THE SAME RATIO AS VOLTAGE CHANGE. Figure 1. Demo Kit with 4-20 mA Current Loop The output is ratiometric to the power supply voltage. For example, if the receiver reads 18 mA at 80 kPa and 15 V power supply, the receiver should read 16.8 mA under the same pressure with 14 V power supply. For best results it is mandatory to use a regulated power supply. If that is not possible, the circuit must be modified by inserting a 12 V regulator to provide a constant supply to the pressure sensor. When using a Motorola MC78L12AC voltage regulator, the circuit can be used with power voltage variation from 14 to 30 volts. The following results have been achieved using an Motorola Sensor Device Data MPX21 OODP and two MC33078s. The resistors were regular carbon resistors, but pairs were matched at ± 0.3% and capacitors were 0.1 /!F. The load was 150 ohms and the transmission line was a two pair telephone line with the + 15 Vdc power supply connected on the remote receiver side. Note: Best performances in temperature can be achieved using metal film resistors. The two potentiometers must be chosen for high temperatures up to 125°C. The complete circuit with pressure sensor is available under reference TZA120 and can be ordered as a regular Motorola product for evaluation. 4-17 AN1082 22 21 " // 20 ~ V'/ 19 ~/ 18 ~ :/" 17 ~p 16 ~V ~~ 15 "- I- 14 12 ..Q 11 Q. ~ ~V 13 ::> ... ~ ~ 10 ~~ ~ A~ ~ dlff!?' I. ~ Power supply + 15 V dc, 150 Ohm load o 0° +25° .... 85° I 20 I I 40 40 0 I I I 60 80 100 PRESSURE (kPa) Figure 2. Output versus Pressure 2.0 1.5 1.0 .5 ~ eo: - 0 0: 0: w -.5 ~ ~ ~ V ~ ~ I-- -------- -- ----. I-- I-- ---- ~ ~ -2.0 ----- -..... 1--- - r-----o-- r--1-0- t--o--- f.o. -1.0 -1.5 - I I· ~ Reference algorithm lo(mA) =4 + 16 x P(kPa) 85° o +25° I I 20 I .... 0° _40 0 I 40 60 80 100 PRESSURE (kPa) Reference algorithm is the straight from output at 255 0 pressure and output at full pressure Figure 3. Absolute Error Reference to Algorithm 4-18 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1097 Calibration-Free Pressure Sensor System Prepared by: Michel Burri, Senior System Engineer Geneva, Switzerland INTRODUCTION The MPX2000 series pressure transducers are semiconductor devices which give an electrical output signal proportional to the applied pressure. The sensors are a single monolithic silicon diaphragm with strain gauge and thin-film resistor networks on the chip. Each chip is laser trimmed for full scale output, offset, and temperature compensation. The purpose of this document is to describe another method of measurement which should facilitate the life of the designer. The MPX2000 series sensors are available both as unported elements and as ported assemblies suitable for pressure, vacuum and differential pressure measurements in the range of 10 kPa through 200 kPa. The use of the on-chip AID converter of Motorola's MC68HC05B6 HCMOS MCU makes possible the design of an accurate and reliable pressure measurement system. SYSTEM ANALYSIS The measurement system is made up of the pressure sensor, the amplifiers, and the MCU. Each element in the chain has its own device-to-device variations and temperature effects which should be analyzed separately. For instance, the 8-bit AID converter has a quantization error of about ±0.2%. This error should be subtracted from the maximum error specified for the system to find the available errorforthe rest of elements in the chain. The MPX2000 series pressure sensors are designed to provide an output sensitivity of 4.0 mVN excitation voltage with full-scale pressure applied or 20 mV at the excitation voltage of 5.0 Vdc. An interesting property must be considered to define the configuration of the system: the ratiometric function of both the AID converter and the pressure sensor device. The ratiometric function of these elements makes all voltage variations from the power supply rejected by the system. With this advantage, it is possible to design a chain of amplification where the signal is conditioned in a different way. Motorola Sensor Device Data You! PIN4 _ THERMISTOR ~ LASER TRIMMED ON-CHIP = GND Figure 1. Seven Laser-Trimmed Resistors and Two Thermistors Calibrate the Sensor for Offset, Span, Symmetry and Temperature Compensation The op amp configuration should have a good common-mode rejection ratio to cancel the DC component voltage of the pressure sensor element which is about half the excitation voltage value VS. Also, the op amp configuration is important when the designer's objective is to minimize the calibration procedures which cost time and money and often don't allow the unit-to-unit replacement of devices or modules. One other aspect is that most of the applications are not affected by inaccuracy in the region 0 kPa thru 40 kPa. Therefore. the goal is to obtain an acceptable tolerance of the system from 40 kPa through 100 kPa, thus minimizing the inherent offset voltage of the pressure sensor. 4-19 AN1097 PRESSURE SENSOR CHARACTERISTICS OP AMP CHARACTERISTICS Figure 2 shows the differential output voltage of the MPX2100 series at +25°C. The dispersion of the output voltage determines the best tolerance that the system may achieve without undertaking a calibration procedure, if any other elements or parameters in the chain do not introduce additional errors. For systems with only one power supply, the instrument amplifier configuration shown in Figure 4 is a good solution to monitor the output of a resistive transducer bridge. The instrument amplifier does provide an excellent CMRR and a symmetrical buffered high input impedance at both non-inverting and inverting terminals. It minimizes the number of the external passive components used to set the gain of the amplifier. Also, it is easy to compensate the temperature variation of the Full Scale Output of the Pressure Sensor by implementing resistors "R!" having a negative coefficient temperature of -250 PPM/oC. The differential-mode voltage gain of the instrument amplifier is: VoudmV) 20 I VS= 5 Vdc TA = 25°C --+---+-~:.."'J,.c....--I Avd = V1-V2 = (1 + 2 Rf) Vs2-Vs4 Rg (1) r-------------------~~---------+Vs 20 40 60 80 100 P (kPa) '>-------~V1 Figure 2. Spread of the Output Voltage versus the Applied Pressure at 25°C The effects of temperature on the full scale output and offset are shown in Figure 3. It is interesting to notice that the offset variation is greater than the full scale output and both have a positive temperature coefficient respectively of +8.0 IlV/degree and +5.0 IlV excitation voltage. That means that the full scale variation may be compensated by modifying the gain somewhere in the chain amplifier by components arranged to produce a negative TC of 250 PPM/oC. The dark area of Figure 3 shows the trend of the compensation which improves the full scale value over the temperature range. In the area of 40 kPa, the compensation acts in the ratio of 40/100 of the value of the offset temperature coefficient. POSITIVE FULL SCALE VARIATION Rg ">----'--~ V2 L-------~-----OV Figure 4. One Power Supply to Excite the Bridge and to Develop a Differential Output Voltage The major source of errors introduced by the op amp is offset voltages which may be positive or negative, and the input bias current which develops a drop voltage AV through the feedback resistance Rf. When the op amp input is composed of PNP transistors, the whole characteristic of the transfer function is shifted below the DC component voltage value set by the Pressure Sensor as shown in Figure 5. The gain of the instrument amplifier is calculated carefully to avoid a saturation of the output voltage, and to provide the maximum of differential output voltage available for the AID Converter. The maximum output swing voltage of the amplifiers is also dependent on the bias current which creates a AV voltage on the feedback resistance Rf and on the Full Scale output voltage of the pressure sensor. P 20 40 60 80 100 (kPa) Figure 3. Output Voltage versus Temperature. The Dark Area Shows the Trend of the Compensation 4-20 Motorola Sensor Device Data AN1097 lib (nA) Vl, V2 veel------,-~5~Vd=C~----_.------~ 600 jl!J-- 450 1/2b_"'"=.....~ vee V V V 300 V - !-'"' ~-- ~IT2 150 VEE '--_ _'--_ _L-_ _...L_ _---L~ VPS o 5 10 15 20 (mV) -50 -25 25 50 75 100 125 T ('e) Figure 7. Input Bias Current versus Temperature Figure 5. Instrument Amplifier Transfer Function with Spread of the Device to Device Offset Variation Figure 5 shows the transfer function of different instrument amplifiers used in the same application. The same sort of random errors are generated by crossing the inputs of the instrument amplifier. The spread of the differential output voltage (V1-V2) and (V2x-V1 x) is due to the unsigned voltage offset and its absolute value. Figures 6 and 7 show the unit-to-unit variations of both the offset and the bias current of the dual op amp MC33078. MCU CONTRIBUTION As shown in Figure 5, crossing the instrument amplifier inputs generated their mutual differences which can be computed by the MCU. Vl Vio(mV) - +2 +1 ... V V UNIt- H ,..... ~-+--~ .--- V2 '------+----- P '----------~----ov UNI 2 Figure 8. Crossing of the Instrument Amplifier Input Using a Port of the MCU UNT3 -1 T -2 -50 -25 25 50 75 100 125 ('e) Figure 6. Input Offset Voltage versus Temperature To realize such a system, the designer must provide a calibration procedure which is very time consuming. Some extra potentiometers must be implemented for setting both the offset and the Full Scale Output with a complex temperature compensation network circuit. The new proposed solution will reduce or eliminate any calibration procedure. Motorola Sensor Device Data Figure 8 shows the analog switches on the front of the instrument amplifier and the total symmetry of the chain. The residual resistance RDS(on) of the switches does not introduce errors due to the high input impedance of the instrument amplifier. With the aid of two analog switch, the MCU successively converts the output signals V1, V2. Four conversions are necessary to compute the final result. First, two conversions of V1 and V2 are executed and stored in the registers R1, R2. Then, the analog switches are commuted in the OPPOSite position and the two last conversions of V2x and V1x are executed and stored in the registers R2x and R1 x. Then, the MCU computes the following equation: RESULT = (R1 - R2) + (R2x - R1 x) (2) 4-21 AN1097 The result is twice a differential conversion. As demonstrated below, all errors from the instrument amplifier are cancelled. Other averaging techniques may be used to improve the result, but the appropriated algorithm is always determined by the maximum bandwidth of the input signal and the required accuracy of the system . .---------------------~--------------~--------------~----~------- +5V VRH MPX2100AP VOO CH1 110 Rf PRESSURE SENSOR SYSTEM Rg MC68HC05B6 P Rf ~ CH2 L---------~~----------------+_--------------~----~------OV Figure 9. Two Channel Input and One Output Port Are Used by the MCU SYSTEM CALCULATION Sensor out 2 Vs2 = a (P) + of2 Sensorout4 Vs4 = b (P) + of4 Amplifier out 1 V1 = Avd (Vs2 + OF1) Amplifier out 2 V2 = Avd (Vs4 + OF2) Inverting of the amplifier input V1x = Avd (Vs4 + OF1) V2x = Avd (Vs2 + OF2) Delta = V1-V2 1st differential result = Avd • (Vs2 of OF1) - Avd • (Vs4 + OF2) Deltax = V2x-V1x 2nd differential result = Avd • (Vs2 + OF2) - Vdc * (Vs4 + OF1) Adding of the two differential results VoutV = Delta + Deltax = Avd*Vs2 + Avd*OF2 + Avd*OF2 - Avd*OF1 + Avd*OF1 - Avd*OF2 + Avd*OF2 - Avd*OF1 = 2 * Avd * (Vs2 -Vs4) = 2 • Avd • [(a (P) + of2) - (b (P) + of4)] = 2 * Avd • [V(P) + Voffset] neglected. That means the system does not require any calibration procedure. The equation of the system transfer is then: count = 2 * Avd * V(P) * 51N where: Avd is the differential-mode gain of the instrument amplifier which is calculated using the equation (1). Then with Rf= 510 kQ and Rg = 9.1 kQ Avd = 113. The maximum counts available in the MCU register at the Full Scale Pressure is: count (Full Scale) = 2' 113' 0.02 V· 51N = 230 knowing that the MPX2100AP pressure sensor provides 20 mV at 5.0 excitation voltage and 100 kPa full scale pressure. The system resolution is 100 kPal230 that give 0.43 kPa per count. +5V Voo There is a full cancellation of the amplifier offset OF1 and OF2. The addition of the two differential results V1-V2 and V2x-V1 X produce a virtual output voltage VoutV which becomes the applied input voltage to the AID converter. The result of the conversion is expressed in the number of counts or bits by the ratiometric formula shows below: 255 count = VoutV * VRH-VRL 255 is the maximum number of counts provided by the AID converter and VRH-VRL is the reference voltage of the ratiometric AID converter which is commonly tied to the 5.0 V supply voltage of the MCU. When the tolerance of the full scale pressure has to be in the range of ± 2.5%, the offset of the pressure sensor may be 4-22 FINE CAL. 1+-------1 VRH 110 --------f------./ CH1 MC68HC05B6 +------+--------1 P --------+-----+1 CH2 VRL -----~-----~-~---- OV Figure 10. Full Scale Output Calibration Using the Reference Voltage VRH-VRL Motorola Sensor Device Data AN1097 When the tolerance of the system has to be in the range of ±1 %, the designer should provide only one calibration procedure which sets the Full Scale Output (counts) at 25°C 100 kPa or under the local atmospheric pressure conditions. +5V MC33078 MPX2100AP P1 1/0 MC68HC0586 CH1 P2 PRESSURE SENSOR SYSTEM L -________~----------------~------------------------~--~------- OV Figure 11. One Channel Input and Two Output Ports are used by the MCU Due to the high impedance input of the AID converter of the MC68HC05B6 MCU, another configuration may be implemented which uses only one channel input as shown in Figure 11. It is interesting to notice that practically any dual op amp may be used to do the job but a global consideration must be made to optimize the total cost of the system according the the requested specification. When the Full Scale Pressure has to be sent with accuracy, the calibration procedure may be executed in different ways. For instance, the module may be calibrated directly using Up/Down push buttons. The gain of the chain is set by changing the VRH voltage of the ratiometric AID converter with the R/2R ladder network circuit which is directly drived by the ports of the MCU. (See Figure 12.) Using a communication bus, the calibration procedure may be executed from a host computer. In both cases, the setting value is stored in the EEROM of the MCU. The gain may be also set using a potentiometer in place of the resistor Rf. But, this component is expensive, taking into account that it must be stable over the temperature range at long term. +5V RO 2R VDD VRH 2R P3 R P2 R/2R LADDER R NETWORK R MC68HC0586 1---------. BUS P1 _---- ---- Vm (to Second Stage) Rg RlO Figure 3. First Stage - Differential Amplifier, Offset Adjust and Gain Adjust Motorola Sensor Device Data 4-25 AN1100 Vm Vm (from first stage) ~ Rll , R12 / - R14 ~ R16 Note: R14 = R12, Rll = R13 R13 ~ R15 V l R17 -= fromD/A Figure 4. Second Stage - FIRST STAGE (Figure 3) The first stage consists of the Motorola pressure sensor; in this case the MPX2200 is used. This sensor typically gives a full scale span output of 40 mV at 200 kPa. The sensor output (VS) is connected to the inputs of amplifier A1 (1/4 of the Motorola MC33079, a Quad Operational Amplifier). The gain, G1, of this amplifier is R7/R6. The sensor has a typical zero pressure offset voltage of 1 mV. Figure 3 shows offset compensation circuitry if it is needed. A1 output is fed to the non-inverting input of A2 amplifier (1/4 of a Motorola MC33079) whose gain, G2, is 1+R1 otR9. G2 should be set to yield 4.5 volts out with full-rated pressure. o J , Vc Difference Amplifier and Gain The theoretical resolution is limited only by the accuracy of the programmable power supply. The Motorola microprocessor used has an integrated AID. The accuracy of this AID is directly related to the reference voltage source stability, which can be self-calibrated by the microprocessor. Vexpanded is the system output that is the sum of the voltage due to the count and the voltage due to the difference between the count voltage and the measured voltage. This is given by the following relation: Vexpanded = Vc + D/G3 therefore, PVexpanded = Vexpanded/S, THE SECOND STAGE (Figure 4) The outputfrom A2 (Vm = G1 xG2 xVs) is connected to the non-inverting input of amplifier A3 (1/4 of a Motorola MC33079) and to the AID where its corresponding (digital) value is stored by the microprocessor. The output of A3 is the amplified difference between Vm, and the digitized/calculated voltage Vc. Amplifier A4 (1/4 of a Motorola MC33079) provides additional gain for an amplified difference output for the desired resolution. This difference output, D, is given by: Pexpanded is the value of pressure (in units of kPa) that results from this improved-resolution system. This value can be outputto a display or used forfurther processing in a control system. CONCLUSION This circuit provides an easy way to have high resolution using inexpensive microprocessors and converters. D = (Vm - V c) x G3 G3 = (R14/ R13)( 1 + ~m where G3 is the gain associated with amplifiers A3 and A4. 4-26 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1105 A Digital Pressure Gauge Using the Motorola MPX700 Series Differential Pressure Sensor Prepared by: Anthony J. Caristi INTRODUCTION This application note describes a solid state digital pressure gauge which is composed of the Motorola MPX series transducer, instrumentation amplifier, AID converter, and LCD readout. Differential, gauge, and vacuum pressure readings from 0 to 100 PSI with resolution of 1 PSI are possible using the MPX700 sensor. The circuit is also capable of measuring and displaying pressures as low as 1 PSI full scale, and resolution as fine as of 0.01 PSI, by using a more sensitive MPX series pressure transducer and full display capability of the AID converter. The Motorola MPX series of pressure transducers is a family of piezoresistive transducers which exhibits a very linear and accurate output voltage relationship that is directly proportional to the applied pressure. The sensor consists of an etched silicon diaphragm upon which a single piezoresistive element is implanted. The resistor senses the stress placed upon the silicon diaphragm by external pressure, and produces a linear output voltage which is proportional to the applied pressure. The output voltage/pressure relationship is ratiometric with the supply voltage feeding the sensor. ETCHED DIAPHRAGM BOUNDARY TRANSVERSE VOLTAGE STRAIN GAUGE application using the MPX700DP differential sensor to measure and display gauge pressure, vacuum (negative pressure), or differential pressure. BASIC STRUCTURE Figure 1 illustrates the top view of the pressure sensor silicon chip, showing the strain-gauge resistor diagonally placed on the edge of the diaphragm. Voltage is applied across pins 1 and 3, while the taps that sense the voltage differential transversely across the pressure sensitive resistor are connected to terminals 2 and 4. An external series resistor is used to provide temperature compensation while reducing the voltage impressed upon the sensor to within its rated value. OPERATION Recommended voltage drive is 3 Vdc, and should not exceed 6 volts under any operating condition. The differential voltage output of the sensor, appearing between terminals 2 and 4, will be positive when the pressure applied to the "pressure" side of the sensor is greater than the pressure applied to the "vacuum" side. Nominal full scale span of the transducer is 60 millivolts when driven by a 3 volt constant voltage source. When zero pressure is applied to the sensor there will be some output voltage, called zero pressure offset. For the MPX700 sensor this voltage is guaranteed to be within the range of zero to 35 millivolts. The zero pressure offset output voltage is easily nulled out by a suitable instrumentation amplifier. The output voltage of the sensor will vary in a linear manner with applied pressure. Figure 2 illustrates output voltage versus pressure differential applied to the sensor, when driven by a 3 volt source. TEMPERATURE COMPENSATION -} DIFFERENTIAl OUTPUT ' - - - - - 1 - - - - - + VOLTAGE R TEMP COMP Figure 1. Sensor Construction Showing Electrical Connections The pressure sensor is available as a differential gauge device in a pressure side ported, vacuum side ported, or differential configuration. The following describes an Motorola Sensor Device Data As illustrated in Figure 2, the output voltage of the sensor will be affected by the temperature of the device. Temperature compensation may easily be accomplished by one of several methods. A full discussion of these methods is covered in Motorola application note AN840. The simplest method oitemperature compensation, placing a resistance (R19 and R20) in series with the sensor driving voltage, is utilized in the schematic diagram illustrated in Figure 3. This provides good results over a temperature span of 0 to 80°C, yielding a 0.5% full scale span compensated device. Since the desired bridge driving voltage is about 3 volts, placing the temperature compensating resistor in series with the bridge circuit has the additional advantage of reducing the power supply voltage, 15 volts, to the desired 3 volt level. 4-27 AN110S so MPX700 Vs = 3 Vdc 70 -4roC +~50C I 60 "~ 50 .s ~ ~ ..... k::::: ~ !; 40 a. !; 30 o j....- II- F:&"c t:;;; ~ 20 t: 0:: 2;~ ifw U)C!l :z t- ~ circuit is less than 80 degrees Celsius, one value of compensating resistance can be used for any sensor resistance over the range of 400 and 550 ohms. In the circuit of Figure 3 the temperature compensating network is composed of two resistors to allow the quiescent voltage of the sensor at pins 2 and 4 to be near the center level (2.5 volts) of the analog and digital circuit that follows. !;~ ~~ 5~ a: I SENSOR AMPLIFIER ti:i- U)a. 10 o 0 1 ~E 20 140 40 2S0 160 420 1100 PSI ISO 560 700 kPa PRESSURE DIFFERENTIAL Figure 2. Output versus Pressure Differential Note that the 15 volt power source must be held to within a tight tolerance, since the output voltage of the transducer is ratiometric with the the supply voltage. In most applications an ordinary fixed 15 volt regulator chip can be used to provide the required stable supply voltage. The series method of compensation requires a series resistor which is equal to 3.577 times the bridge input resistance at 25 degrees Celsius. The range of transducer resistance is between 400 and 550 ohms, so the compensating network will be 1431 to 1967 ohms. If a temperature compensated span of greater than plus or minus 0.5% is satisfactory or the operating temperature range of the IC3MC7SL05 An amplifier is used to convert the low level differential output of the transducer, 60 millivolts at 100 PSI, to a useful level that can drive subsequent circuitry. Additionally, the amplifier must provide means to null out the DC offset output voltage of the transducer when zero pressure is applied. The circuit illustrated in Figure 3 uses three sections of a common op-amp chip, LM324N, for this purpose. The high input impedance of operational amplifiers IC1 A and IC1 B ensures that the circuit does not load the basic transducer. The gain of the instrumentation amplifier is adjusted by means of potentiometer R6 to allow full scale calibration at 100 PSI applied pressure. Using the circuit constants indicated in Figure 3, the gain of the amplifier can be expressed as A = 2(1 + 100KlR) where A = circuit gain R = the total resistance composed of R6 plus R7 1OOK = the circuit value represented by R8, R9, R10and R12. R2 lOOk R1 51.1 +15V--::-;-.,........., R3 10k R4 lOOk DISPl LTD202R-12 .....- - - - - 4 - - - - , FULL SCALE 16 CAL 23 17 22 lS 15 IC2 24 12 13 25 10 I I I~ I~~ 1,2, 6 14 9 10 ~ 14 1 ':' IC1 LM324N 27 CS 0.22 11 21 1.-_ _2,..6_----' ICL7106CPL R15 10k ZERO ADJ Figure 3. Schematic Diagram of Digital Pressure Gauge 4-28 Motorola Sensor Device Data AN1105 As can be seen by the gain equation, the minimum value of gain is 2 when R is infinite. The amplifier is capable of providing a gain of 100 or more by adjustment of R6, and R7, but in this application the required gain is within the range of about 2.6 to 5.3 to accommodate the tolerance of the full scale span of the sensor. A voltage divider composed of R 15, R16, and R 17 provides an adjustable voltage which is fed to the inverting input of ICl B. This voltage, attenuated by the gain of less than 1 of ICl B, is fed to the analog to digital converter chip to negate the effect of the offset voltage produced by the sensor and allows the display of the circuit to read 00 when no pressure is applied. The differential output of the instrumentation amplifier appears between pins 7 and 8 of IC1. This is fed to the analog to digital converter, IC2, to provide a digital readout of the pressure difference impressed upon the transducer. AID CONVERTER The circuit employs a high performance 3 1/2 digit AID converter chip (IC2) which contains all the necessary active devices to convert the differential analog output voltage of the instrumentation amplifier to digital form. A pair of LCD digits is directly driven without multiplexing. Included in IC2 are seven segment decoders, display drivers, backplane frequency generator, reference, and clock. The chip is capable of driving a 3 112 digit LCD non-multiplexed display. In this application the least and most significant digits are not used, but if greater range and/or resolution is desired the unused output terminals of the chip can be wired to drive 1 1/2 additional digits. Full scale output of IC2 (2000 counts) is attained when the analog differential input voltage fed to pins 30 and 31 is equal to twice the reference voltage applied to pins 35 and 36, the differential reference input terminals. In this application the voltage divider composed of R2, R3, and R4, driven by the on-board 5 volt regulator, provides an arbitrary reference 40 voltage of 238 millivolts. Since the maximum desired digital display occurs at 1000 counts (half of AID converter full scale capability) for a display of 00 at 100 PSI, the maximum analog input voltage to IC2 will be 238 millivolts. Thus, nominal amplifier circuit gain must be 238/60, or about 4. The two least significant digits of input pressures exceeding 100 PSI will be displayed by the readout. IC2 responds to both positive and negative analog input voltages, and generates a polarity bit at pin 20. If desired, the circuit can be used to measure both positive and negative differential pressures, with the polarity output bit at pin 20 used to activate a minus sign indicator for negative pressures. The circuit of Figure 4 employs only two digits of the possible 3 1/2 digit capability of IC2. By substituting a 3 1/2 digit LCD display, the resolution of the pressure reading is increased by a factor of ten. Additionally, any input pressure of 100 PSI or greater will result in the most significant digit, "1 ", being displayed. Figure 4 illustrates the connections between the AID converter and the optional 3 1/2 digit LCD display. CIRCUIT ASSEMBLY The terminals of the pressure sensor should be carefully formed to allow insertion into the PC board. Observe the location of pin 1 of the sensor, which is identified by a small notch. Use suitable hardware to mount the unit, being careful not to overtighten the screws and damage the plastic housing. To ensure circuit stability, use metal film resistors throughout the amplifier circuit. The only exception to this are the resistors associated with the AID converter, R5, Rll, and R18, which can be ordinary carbon types. It is recommended to use sockets for ICl and IC2. A small identifier notch is located on the front of the display to identify the location of pin 1, similar to that of a DIP IC chip. This component is constructed of glass and must be handled carefully to avoid breakage. 21 BACKPLANE , I-I I-I I-I - - - , '-I ,-' ,-' 3 10 20 14 18 3-1/2 DIGIT DISPLAY PIN IDENTIFICATION 19 23172218 15 241612132514 10115678 34 21 IC2 Figure 4. IC2 Driving Optional 3-1/2 Digit LCD Display Motorola Sensor Device Data 4-29 AN110S PRESSURE CONNECTIONS For gauge pressure measurements, the port which is closest to pin 4 of the sensor (identified as P1 in Figure 5) is to be used, with the other port left open to the atmosphere. For vacuum measurements, use port P2, with the opposite port open to the atmosphere. When the unit is to be used for differential pressure measurements, both ports are used. Positive pressure readings will be obtained when the pressure applied to the high pressure side, P1, is greater than that applied to the low pressure side P2. Should the pressures be opposite the display will still read the difference in pressure, and the AID converter will output a polarity bit at pin 20 of the chip. Hoses should be attached to the sensor using a suitable clamp. 100 PSI is a substantial pressure and any hose which is not secured properly can suddenly disconnect. CALIBRATION Calibration of the circuit consists of adjustment of the zero set and span adjust potentiometers, R16 and R6 respectively. A pressure source of up to 100 PSI and accurate pressure gauge is required. Figure 6 illustrates the test setup. Since the output voltage of the sensor is dependent upon the magnitude of the power supply voltage, calibration of the circuit must be performed with the circuit being driven by a regulated 15 volt supply. Any variation in the supply voltage will cause a proportional error in calibration. With the circuit operating and no pressure applied to the sensor, adjust R16 for a display of 00. Note that the display will read upscale when R16 is set to either side of zero. Connect the sensor to the pressure source as indicated in Figure 6. Use a reference pressure gauge of known accuracy, and adjust the pressure to 100 PSI. The pressure sensor is capable of withstanding pressures up to 300 PSI without damage. Adjust R6 for a display of 00, indicating 100 PSI. Since the AID converter is capable of displaying readings greater than 100, adjustment of R6 is easily set between a display of 99 and 01. Remove the pressure from the sensor and recheck the setting of the zero set potentiometer. Readjust if necessary for a display of 00. Check the pressure display at 100 PSI. This completes calibration of the circuit. The digital pressure gauge may be checked over its range by applying any pressure between 0 and 100 PSI and comparing the display to the reference gauge. Note that pressures above 100 PSI will be indicated, but with reduced accuracy. PC BOARD Innl uu ACCURATE PRESSURE GAUGE PRESSURE SOURCE Figure 5. Setup to Calibrate Circuit Against a Known Accurate Pressure Gauge 4-30 Motorola Sensor Device Data AN1105 Table 1. Parts List by Component Values and Part Numbers Designators Quantity Description Rating Cl 1 25 volt electrolytiC capacitor 10 J.!Fd C2, C3, C5 C4 3 1 1 50 volt ceramic disc capacitor 50 volt ceramic disc capacitor 50 volt ceramic disc capacitor 0.1 jlFd 100 pF 0.01 jlFd 1 1 50 volt ceramic disc capacitor 50 volt ceramic disc capacitor 0.47 jlFd 0.22jlF C6 C7 CB Tolerance Manufact. Part Number DISP (optional) DISP 1 2 digit LCD readout Amperex 1 3 1/2 digit LCD readout Amperex LTD202R-12 LTD221R-12 ICI 1 Quad operational amplifier Harris Teledyne ICL7106CPL Motorola MC7BL05 Motorola MPX700DP IC2 AID converter IC3 1 100 mA fixed regulator 5 volt Rl R2,R4,RB,R9,Rl0,RI2 1 6 3 2 1 1/4 watt metal film 1/4 watt metal film 1/4 watt metal film 1/4 watt metal film 1/4 watt metal film 1/4 watt metal film 1/4 watt metal film resistor resistor resistor resistor resistor resistor 51.1 Q 100 K 10 K 41.2K 1K 1.5K resistor 200Q R3,RI5,RI7 R7,R14 R13 R19 R20 1 1 1/4 watt carbon resistor 1/4 watt carbon resistor 1/4 watt carbon resistor 100 K 1 megQ R5 Rll RIB 1 1 R6 1 0.3 watt cermet potentiometer, PC mount 500 K R16 1 0.3 watt cermet potentiometer, PC mount 100 K Sensor 1 0-100 psi, uncompensated pressu re sensor Motorola Sensor Device Data 1 47 K 1% 1% 1% 1% 1% 1% % 5'% 5% 5% 4-31 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1303 A Simple 4-20 mA Pressure Transducer Evaluation Board Prepared by: Denise Williams Discrete Applications Engineering INTRODUCTION The two wire 4-20 mA current loop is one olthe most widely utilized transmission signals for use with transducers in industrial applications. A two wire transmitter allows signal and power to be supplied on a single wire-pair. Because the information is transmitted as current, the signal is relatively immune to voltage drops from long runs and noise from motors, relays, switches and industrial equipment. The use of additional power sources is not desirable because the usefulness of this system is greatest when a signal has to be . transmitted over a long distance with the sensor at a remote location. Therefore, the 4 mA minimum current in the loop is the maximum usable current to power the entire control circuitry. An evaluation board designed to meet these requirements is shown in Figure 1. A description of this 4-20 mA Pressure Transducer Evaluation Board, as well as a summary of the information required to use it, are presented here. Figure 2 is a block diagram of a typical 4-20 mA current loop system which illustrates a simple two chip solution to converting pressure to a 4-20 mA signal. This system is designed to be powered with a 24 Vdc supply. Pressure is converted to a differential voltage by the Motorola MPX71 00 pressure sensor. The voltage signal proportional to the monitored pressure is then converted to the 4-20 mA current signal with the Burr-Brown XTR101 Precision Two-Wire Transmitter. The current signal can be monitored by a meter in series with the supply or by measuring the voltage drop across RL. A key advantage to this system is that circuit performance is not affected by a long transmission line. Figure 1. 4-20 mA Pressure Transducer Evaluation Board REV 1 4-32 Motorola Sensor Device Data AN1303 SENSOR PRESSURE PORT PRESSURE SOURCE PRESSURE SENSOR TRANSMITIER CIRCUITRY CURRENT METER 4-20 mA PRESSURE TRANSDUCER Figure 2. System Block Diagram INPUT TERMINALS A schematic of the 4-20 mA Pressure Transducer Evaluation Board is shown in Figure 3. Connections to this evaluation board are made atthe terminals labeled (+) and (-). Because this system utilizes a current signal, the power supply, the load and any current meter must be put in series with the (+) to (-) terminals as indicated in the block diagram. The load for this type of system is typically a few hundred ohms. As described above, a typical use of a 4-20 mA current transmission signal is the transfer of information over long distances. Therefore, a long transmission line can be connected between the (+) and (-) terminals on the evaluation board and the power supply/load. 2mA r----.-.",.,.------<~-I4----O + 4-20 mA OUTPUT XDCR1 MPX7100 C1 0.01J.lF 02 1N4565A 6.4V@0.5mA '-----------+-------0 - RETURN 4-20 mA PRESSURE TRANSDUCER Figure 3. Schematic Diagram PRESSURE INPUT The device supplied on this evaluation board is an MPX7100DP, a high impedance (10 kQ typ) 15 PSI sensor which provides two ports. P1, the positive pressure port, is on top of the sensor and P2, the vacuum port, is on the bottom of the sensor. The system can be supplied up to 15 PSI of Motorola Sensor Device Data positive pressure to P1 or up to 15 PSI of vacuum to P2 or a differential pressure up to 15 PSI between P1 and P2. Any of these pressure applications will create the same results at the sensor output. 4-33 AN1303 CIRCUIT DESCRIPTION The XTR1 01 current transmitter provides two one-milliamp current sources for sensor excitation when its bias voltage is between 12 V and 40 V. The MPX7100 series sensors are constant voltage devices, so a zener, D2, is placed in parallel with the sensor input terminals. Because the MPX71 00 series parts have a high input impedance the zener and sensor combination can be biased with just the two milliamps available from the XTR1 01. The offset adjustment is composed of R4 and R6. They are used to remove the offset voltage at the differential inputs to the XTR101. R6 is set so a zero input pressure will result in the desired output of 4 mAo R3 and R5 are used to provide the full scale current span of 16 mAo R5 is set such that a 15 PSI input pressure results in the desired output of 20 mAo Thus the current signal will span 16 mA from the zero pressure output of 4 mA to the full scale output of 20 mAo To calculate the resistor required to set the full scale output span, the input voltage span must be defined. The full scale output span of the sensor is 24.B mV and is!l.VIN to the XTR101. Burr-Brown specifies the following equation for Rspan. The 40 and 16 mn values are parameters of the XTR101. and R6 and select-in-test resistors R7 and RB for particular applications. OTHER CONSIDERATIONS The 4-20 mA Pressure Transducer Evaluation Board has been designed to demonstrate the performance of the Motorola MPX7100 pressure sensor in conjunction with a 4-20 mA current transmitter. Several design considerations should be considered when actually optimizing for an application. 1. The optional external transistor, Q1, is recommended by Burr-Brown to increase accuracy by reducing temperature change inside the XTR101 package as the output current spans from 4 mA to 20 mAo Also for power supply voltages above 24 V, the 750 n 1/2W resistor, R1, is recommended to limit the power dissipation in the MPSA06 to below its 625 mW rating. 2. Keeping lead lengths short in the portion of the circuit where the span adjust and zero adjust resistors connect to the XTR101 is recommended to reduce noise pick-up and parasitic resistance. 3. C1 is a bypass capacitor and, therefore, should be connected across pins 7 and B of the XTR1 01 as close to the device as possible. Rspan = 40/ [(16 mA / !l.Vin) - 0.016 mhos] = 64 n The XTR101 requires that the differential input voltage at pins 3 and 4, V2 - V1 be less than 1V and that V2 (pin 4) always be greater than V1 (pin 3). Furthermore, this differential voltage is required to have a common mode of 4-6 volts above the reference (pin 7). The sensor produces the differential output with a common mode of approximately 3.1 volts above its reference pin 1. Because the current of both 1 mA sources will go through R2, a total common mode voltage of about 5.1 volts (1 kQ x 2 mA + 3.1 volts = 5.1 volts) is provided. The printed circuit layout and the component layout for the evaluation board are shown in Figures 4a-4c. Table 1 is the parts list for the evaluation board. Some extra pads and the labels R7 and RB were provided on the board to allow replacement of the variable resistors with fixed resistors R5 4-34 CALIBRATION 1. Connect the evaluation board as shown in the block diagram of Figure 2. 2. With no pressure connections to the sensor, adjust R6 so that lout is 4 mAo 3. Supply 15 PSI to the sensor, (either positive pressure to the pressure port or vacuum to the vacuum port) and adjust R5 so that lout is 20 mAo 4. You may need to repeat steps 2 and 3 to ensure proper calibration. CONCLUSION This circuit is an example of how the higher impedance MPX7000 series sensors can be utilized in an industrial application. It provides a simple design alternative where remote pressure sensing is required. Motorola Sensor Device Data AN1303 Table 1. Parts List for 4-20 mA Pressure Transducer Evaluation Board Designator Quantity Description 1 1 4 4 2 2 PC Board (see Figure 3) Input/Output Terminals 1/2" standoffs, Nylon threaded 1/2" screws, Nylon S/8" screws, Nylon 4-40 nuts, Nylon 1 Capacitor 0.01 !IF 01 D2 1 1 Diodes 100V Diode 6.4 V Zener Ql 1 Transistor NPN Bipolar Rl R2 R3 R4 1 1 1 1 Resistors, Fixed 7S0Q 1 kQ 39Q 1 MQ RS R6 1 1 Ul Cl XDCRl Rating Manufacturer Motorola PHXCONT Part Number DEVB126 #1727010 SOV 1A lN4002 lN4S6SA Motorola MPSA06 Resistors, Variable SO Q, one tu rn 100 KQ, one turn Bourns Bourns #3386P-l-S00 #3386P-l-l04 1 Integrated Circuit Two wire current transmitter Burr-Brown XTR10l 1 Sensor High Impedance Motorola MPX7100DP 1/2W lS PSI NOTE: All resistors are 1/4 W with a tolerance of S% unless otherwise noted. All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted. o ~ 4-20 rnA PRESSURE TRANSDUCER ~ o o RB 0 1:_1 .. - + 0 D~O [] 0 0 0 0 0 0 0 O~ Ul o o ~- XDCRl a 0 0 ~~OOQl LJo 0 a (ao)DI Rl 10 0 R~ Cl D I£QL] 0 o ~ o oa~O R70 DEVB1260 OCilD MOTOROLA DISCRETE APPLICATIONS o Figure 4a. Component Layout Motorola Sensor Device Data 4-35 AN1303 10 ° :!: ~ ~ :r:-atllli° O ~oo o 00 19 0 00 0 0 COMPONENT SIDE ~ COO ao ao Oa 0°/ O/~ C2J Figure 4b. Board Layout Component Side ° ' -_ _ _ _ _ _o()R30J02 3012 0 :::J Figure 4c. Board Layout Solder Side (With traces reversed for easy comparison to front side) 4-36 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1304 Integrated Sensor Simplifies Bar Graph Pressure Gauge Prepared by: Warren Schultz Discrete Applications Engineering INTRODUCTION Integrated semiconductor pressure sensors such as the MPX5100 greatly simplify electronic measurement of pressure. These devices translate pressure into a 0.5 to 4.5 volt output range that is designed to be directly compatible with microcomputer AID inputs. The 0.5 to 4.5 volt range also facilitates interface with ICs such as the LM3914, making Bar Graph Pressure Gauges relatively simple. A description of a Bar Graph Pressure Sensor Evaluation Board and its design considerations are presented here. Figure 1. DEVB129 MPX5100 Bar Graph Pressure Gauge Motorola Sensor Device Data 4-37 AN1304 EVALUATION BOARD DESCRIPTION A summary of the information required to use evaluation board number DEVB 129 is presented as follows. A discussion of the design appears under the heading Design Considerations. FUNCTION The evaluation board shown in Figure 1 is designed to provide a 100 kPa full scale pressure measurement. It has two input ports. P1, the pressure port is on the top side of the MPX5100 sensor, and P2, a vacuum port, is on the bottom side. These ports can be supplied up to 100 kPa (15 psi)' of pressure on P1 or up to 100 kPa of vacuum on P2, or a differential pressure up to 100 kPa between P1 and P2. Any of these sources will produce the same output. The primary output is a 10 segment LED bar graph, which is labeled in increments of 10 kPa. If full scale pressure is adjusted for a value other than 100 kPa the bar graph may be read as a percent of full scale. An analog output is also provided. It nominally supplies 0.5 volts at zero pressure and 4.5 volts at 100 kPa. Zero and full scale adjustments are made with potentiometers so labeled at the bottom of the board. Both adjustments are independent of each other. ELECTRICAL CHARACTERISTICS The following electrical characteristics are included to describe evaluation board operation. They are not specifications in the usual sense and are intended only as a guide to operation. Characteristic Power Supply Voltage Symbol Min Typ Max Units B+ 6.B - 13.2 Volts kPa PFS - - 100 PMAX - - 700 kPa VFS - 4.5 - Volts VOFF - 0.5 - Volts Analog Sensitivity SAOUT - 40 - rnV/kPa Quiescent Current ICC - 20 - rnA Full Scale Current IFS - 140 - rnA Full Scale Pressure Overpressure Analog Full Scale Analog Zero Pressure Offset PIN-BY-PIN DESCRIPTION B+: Input power is supplied at the B+ terminal. Minimum input voltage is 6.8 volts and maximum is 13.2 volts. The upper limit is based upon power dissipation in the LM3914 assuming all 10 LED's are lit and ambient temperature is 25°C. The board will survive input transients up to 25 volts provided that power dissipation in the LM3914 does not exceed 1.3 watts. OUT: An analog output is supplied at the OUT terminal. The signal it provides is nominallyO.5 volts at zero pressure and 4.5 volts at 100 kPa. This output is capable of sourcing 100 ~A at full scale output. GND: There are two ground connections. The ground terminal on the left side of the board is intended for use as the power supply return. On the right side of the board, one of the test point terminals is also connected to ground. It provides a convenient place to connect instrumentation grounds. TP1: Test point 1 is connected to the zero pressure reference voltage and can be used for zero pressure calibration. To calibrate for zero pressure, this voltage is adjusted with R6 to match the zero pressure voltage that is measured at the analog output (OUT) terminal. TP2: Test point 2 performs a similar function at full scale. It is connected to the LM3914's reference voltage which sets the trip point for the uppermost LED segment. This voltage is adjusted via R5 to set full scale pressure. P1, P2: Pressure and Vacuum ports P1 & P2 protrude from the MPX51 00 sensor on the right side of the board. Pressure port P1 is on the top and vacuum port P2 is on the bottom. Neither is labeled. Either one or a differential pressure applied to both can be used to obtain full scale readings up to 100 kPa (15 psi). Maximum safe pressure is 700 kPa. CONTENT Board contents are described in the following parts list, schematic, and silk screen plot. A pin by pin circuit description follows in the next section. , 100 kPa = 14.7 psi, 15 psi is used throughout the text for convenience 4-38 Motorola Sensor Device Data AN1304 DESIGN CONSIDERATIONS In this type of an application the design challenge is how to interface a sensor with the bar graph output. MPX5100 Sensors and LM3914 Bar Graph Display drivers fit together so cleanly that having selected these two devices the rest of the design is quite straight forward. A block diagram that appears in Figure 4 shows the LM3914's internal architecture. Since the lower resistor in the input comparator chain is pinned out at RLO, it is a simple matter to tie this pin to a voltage that is approximately equal to the MPX5100's zero pressure output Voltage. In Figure 2, this is accomplished by dividing down the 5 volt regulator's output voltage through R1, R4, and adjustment pot R6. The voltage generated at the wiper of R6 is then fed into RLO which matches the sensor's zero pressure voltage and zeros the bar graph. The full scale measurement is set by adjusting the upper comparator's reference voltage to match the sensor's output at full pressure. An internal regulator on the LM3914 sets this voltage with the aid of resistors R2, R3, and adjustment pot R5 that are shown in Figure 2. The MPX5100 requires 5 volt regulated power that is supplied by an MC78L05. The LED's are powered directly from LM3914 outputs, which are set up as current sources. Output current to each LED is approximately 10 times the reference current that flows from pin 7 through R2, R5, and R3 to ground. In this design it is nominally (4.5 V/4.9K)10 = 9.2 mAo Over a zero to 85°C temperature range accuracy for both the sensor and driver IC are ±2.5%, totaling ±5%. Given a 10 segment display total accuracy is approximately ±(10 kPa +5%). CONCLUSION Perhaps the most noteworthy aspect to the bar graph pressure gauge described here is how easy it is to design. The interface between an MPX5100 sensor, LM3914 display driver, and bar graph output is direct and straight forward. The result is a simple circuit that is capable of measuring pressure, vacuum, or differential pressure; and will also send an analog signal to other control circuitry. S1 +12V ~~--~--------------------~~~~~~~~~~~~--~-, ON/OFF , D1 ,. D2, D3, D4, D5, D6 ,. D7 ,. DB D9 D10 \\ \\ \\ \\ \\ \\ \\ \\ \\ \\ C2 --- I11lF U1 U3 MC7BL05ACP 3 TIC1 -= O.1IlF 1 2 3 4 I~-rG~~'1oIL.~__~__~~__-. I 5 R4 2 .r-± r-+9 1.3K R2 1.2 k U2 MPX5100 I 2 GND ~~~~ ~6 R5 1k 100 LED GND B, RLO SIG RHI REF ADJ MOD LED~ LED 17 LED LED LED LED LED LED 15 14 13 12 11 10 LED~ LM3914 't=t==~~---{) L-----t------+----o >-----0 TP2 (FULL SCALE CALIBRATION) TP1 (ZERO CALIBRATION) GND FULL SCALE CALIBRATION R1 100 ~ R3 2.7 k ~IA~N~AL~O~G~O~UT~------------------------~-=~~ ~ Figure 2. MPX5100 Pressure Gauge Motorola Sensor Device Data 4-39 AN1304 MPX5100 PRESSURE GAUGE 0 PRESSURE kPa 100 90 80 70 60 50 40 30 20 10 0 0 0 0 0 0 0 0 0 0 c:=J c:=J c:=J DEVB129 0 0 0 0 0 0 0 0 0 .... <0 ;::: ~ ::; 0 MOTOROLA DISCRETE APPLICATIONS 0 0 0 0 0 0 0 0 0 D 0 0 0 ....c;; 0 :::'" 0 0 0 0 0 D 0 0 0 0 0 D MPX5100 C2 0 0 B+ CJ oCJ 0 0 raOq U3 OUT 0 gOFF 0 0 o TP2 [§J 0 0 TP1 O~O GND ~oo 0 °C1 0 ~M o 0 0 ZERO o GND 0 0 0 0 FULL SCALE Figure 3. Silk Screen 2X Table 1. Parts List Designators Quant. Description C1 C2 1 1 Ceramic Cap Ceramic Cap Rating Manufacturer Part Number 0.11!F 11!F 01-010 1 Bar Graph LEO R1 R2 R3 R4 R5 R6 1 1 1 1 1 1 1/4 W Film 1/4 W Film 1/4 W Film 1/4 W Film Trimpot Trimpot S1 1 On/Off Switch NKK 12S0P2 U1 U2 U3 1 1 1 Bar Graph IC Pressure Sensor Voltage Regulator National Motorola Motorola LM3914 MPX5100 MC78L05ACP - 1 3 4 4 Terminal Block Test Point Terminal Nylon Spacer 4-40 Nylon Screw Augat Components Corp. 25V03 TP1040104 Resistor Resistor Resistor Resistor GI 100 1.2K 2.7K 1.3K 1K 100 MV57164 Bourns Bourns 3/8" 1/4" Note: All resistors have a tolerance of 5% unless otherwise noted. All capacitors are 50 volt ceramic capacitors with a tolerance of 10% unless otherwise noted. 4-40 Motorola Sensor Device Data AN1304 LED V+ LM3914 /Z)'I /Z)'I /Z)'I /Z)'I /Z)'I REF OUT THIS LOAD DETERMINES LED BRIGHTNESS -= REF ADJ 7+ /Z)'I REFERENCE VOLTAGE SOURCE 1.2SV /Z)'I I /Z)'I 8 /Z)'I /Z)'I I CONTROLS TYPE OF DISPLAY, BAR OR SINGLE LED V-~ I ~ Figure 4. LM3914 Block Diagram Motorola Sensor Device Data 4-41 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1305 An Evaluation System for Direct Interface of the MPX5100 Pressure Sensor with a Microprocessor Prepared by: Bill Lucas Discrete Applications Engineering INTRODUCTION Interfacing pressure sensors to analog-to-digital converters or microprocessors with on-chip AID converters has been a challenge that most engineers do not enjoy accepting. Recent design advances in pressure sensing technology have allowed the engineer to directly interface a pressure sensor to an AID converter with no additional active components. This has been made possible by integrating a temperature compensated pressure sensor element and active linear circuitry on the same die. A description of an evaluation board that shows the ease of interfacing a signal conditioned pressure sensor to an AID converter is presented here. Figure 1. DEVB-114 MPX5100 Evaluation Module 4-42 Motorola Sensor Device Data AN130S offset. The sensor's zero offset voltage with no pressure applied to the sensor is empirically computed each time power is applied to the system and stored in RAM. The sensitivity of the MPX51 00 is repeatable from unit to unit. There is a facility for a small "rubbering" of the slope constant built into the program. It is accomplished with jumpers J1 and J2, and is explained in the Operation section. The board contents are further described in the schematic, silk screen plot, and parts list that appear in Figures 2, 3 and Table 1. PURPOSE This evaluation system, shown in Figure 1, demonstrates the ease of operation and interfacing of the Motorola MPX5100 series pressure sensors with on-chip temperature compensation, calibration and amplification. The board may be used to evaluate the sensor's suitability for a specific application. DESCRIPTION BASIC CIRCUIT The DEVB-114 evaluation board is constructed on a small printed circuit board. It is powered from a single +5 Vdc regulated power supply. The system will display the pressure applied to the MPX5100 sensor in pounds per square inch. The range is 0 PSI through 15 PSI, resolved to 0.1 PSI. No potentiometers are used in the system to adjust the span and The evaluation board consists of three basic subsystems: an MPX5100GP pressure sensor, a four digit liquid crystal display (only three digits and a decimal are used) and a programmed microprocessor with the necessary external circuitry to support the operation of the microprocessor. LCD mm m lEE PART NUMBER LCD5657 OR EQUAL LIQUID CRYSTAL DISPLAY 28 37 6 5 6 734 35 8 31 329 10 11 29 30 49 4748 42 43 44 45 46 12 ~F 2 13 14 3738 32 33 () 152425 16 3435 36 31 IFrl:h I!!~ 222317 18 92021 293024 25 262728 1-4 33 39,38,40 +5 PORTC PORTA PORTB 150HM R5 ~ 50 .f- U1 TDO VRH 1% ~ MC68HC705B5FN VSS VRL OSC1 16 OSC2 17 PD5 5 22pF C3 T J3 GND .. -= ::t C1i 100~F R2 10MEG T J1 I • 4.7K PD4 PD3 PD1 VPP6 PDO VDD PD2 TCAP1 D/A TCAP2 r8_ _ 19110111 12113114 15 ~23 ~~ 10K ...-., R4 +5 IN 34:P- " 1% 2-. R7 -.302 V 30.1 OHM 1% -= J2 C4 -= 11 IRQ 19 R3 10K 22 pF RESET - PD6 PD7 4 3 4MHz .-.jO~ +5.. 453 OHM R6 RDI -4.85 V -= +5 C2 +5 r VCC ~ XDCR1 MPX5100 J.§ND I Figure 2. DEVB-114 System Schematic Motorola Sensor Device Data 4-43 AN1305 Table 1. DEV8-114 Parts List Designators C1 Quant. Description 1 100 ~F Manufacturer Rating Electrolytic Capacitor 25 Vdc Sprague Part Number 513D107M025BB4 C2 1 0.1 ~F Ceramic Capacitor 50Vdc Sprague 1C105Z5U104M050B C3,C4 2 22 pF Ceramic Capacitor 100 Vdc Mepco/Centralab CN15A220K J1, J2 1 Dual Row Straight .025 Pins Arranged On .1" Grid Molex 10-89-1043 LCD 1 Liquid Crystal Display AMPEREX LTD226R-12 R1 1 4.7 k Ohm Resistor R2 1 10 Meg Ohm Resistor R3,R4 2 10k Ohm Resistor R5 1 15 Ohm 1% 1/4 W Resistor R6 1 453 Ohm 1% 1/4 W Resistor R7 1 30.1 Ohm 1% 1/4 W Resistor XDCR1 1 Pressure Sensor Motorola MPX5100GP U1 1 Microprocessor Motorola Motorola MC68HC705B5FN or XC68HC705B5FN Motorola MC34064P-5 U2 1 Under Voltage Detector Y1 1 Crystal (Low Profile) No Designator 1 No Designator No Designator ECS ECS-40-S-4 52 Pin PLCC Socket AMP 821-575-1 2 Jumpers For J1 and J2 Molex 15-29-1025 1 Bare Printed Circuit Board 4.0 MHz Note: All resistors are 1/4 W resistors with a tolerance of 5% unless otherwise noted. All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted. LCD1 [ U1 ~~DD R3 c:::J R41::::J ~~ I==l R1 c::J C2 C3 r-;;:--l C40 U2 0 0 L..1!.......J 0 D0+ R7D C1 ~ ro J'9:"m GND VCC TP1 XDRC OUT TP2 DEVB-114 REV. 0 Figure 3. Silk Screen 4-44 Motorola Sensor Device Data AN1305 Theory of Operation Referring to the schematic, Figure 2, the MPX5100 pressure sensor is connected to PORT 0 bit 5 of the microprocessor. This port is an input to the on-chip 8 bit analog to digital converter. The pressure sensor provides a signal output to the microprocessor of approximately 0.5 Vdc at 0 psi to 4.5 Vdc at 15 psi of applied pressure as shown in Figure 4. The input range of the A to 0 converter is set at approximately 0.3 Vdc to 4.85 Vdc. This compresses the range of the A to 0 converter around the output range of the sensor to maximize the A to 0 converter resolution; 0 to 255 counts is the range of the A to 0 converter. VRH and VRL are the reference voltage inputs to the A to 0 converter. The resolution is defined by the following: The microprocessor section of the system requires certain support hardware to allow it to function. The MC34064P-5 (U2) provides an under voltage sense function which is used to reset the microprocessor at system power-up. The 4 MHz crystal (Y1) provides the external portion of the oscillator function for clocking the microprocessor and provides a stable base for time based functions. Jumpers J1 and J2 are examined by the software and are used to "rubber" the slope constant. Analog-to-digital converter count = [(Vxdcr - VRLl/(VRH - VRLl]' 255 The count at 0 psi = [(.5 - .302)/(4.85 - .302)]. 255 ~ 11 The count at 15 psi = [(4.5 - .302)/(4.85 - .302)]. 255 ~ 235 Therefore the resolution = count @ 15 psi - count @ 0 psi or the resolution is (235 - 11) = 224 counts. This translates to a system that will resolve to 0.1 psi. Vs = 5.0 Vdc -----\----+----,."'7l TA=25°C MPX5100 4.5 0- ~~---+-----4-.~~~+----. >- B"~---+ I 1 SPAN >=> o~---+_-7~~_4----+----_1 TVP FFSET looT 0'----:'::-----'-----'------:" 75 50 25 kPa 0 PSI 3.62 7.25 10.87 14.5 OPERATION The system must be connected to a 5 Vdc regulated power supply. Note the polarity marked on the power terminal J3. Jumpers J1 and J2 must either both be installed or both be removed for the normal slope constant to be used. The pressure port on the MPX5100 sensor must be left open to atmosphere anytime the board is powered-up. As previously stated, the sensor's voltage offset with zero pressure applied is computed at power-up. You will need to apply power to the system. The LCD will display CAL for approximately 5 seconds. After that time, the LCD will then start displaying pressure. To improve upon the accuracy of the system, you can change the constant used by the program that constitutes the span of the sensor. You will need an accurate test gauge to measure the pressure applied to the sensor. Anytime after the display has completed the zero calculation (after CAL is no longer displayed), apply 15.0 PSI to the sensor. Make sure that jumpers J1 and J2 are either both installed or both removed. Referring to Table 2, you can increase the displayed value by installing J1 and removing J2. Conversely, you can decrease the displayed value by installing J2 and removing J1. J1 J2 IN OUT OUT IN OUT IN IN OUT Action USE NORMAL SPAN CONSTANT USE NORMAL SPAN CONSTANT DECREASE SPAN CONSTANT APPROXIMATELY 1.5% INCREASE SPAN CONSTANT APPROXIMATELY 1.5% Table 2. Figure 4. MPX5100 Output versus Pressure Input SOFTWARE The voltage divider consisting of R5 through R7 is connected to the +5 volts powering the system. The output of the pressure sensor is ratiometric to the voltage applied to it. The pressure sensor and the voltage divider are connected to a common supply; this yields a system that is ratiometric. By nature of this ratiometric system, variations in the voltage of the power supplied to the system will have no effect on the system accuracy. The liquid crystal display is directly driven from I/O ports A, B, and C on the microprocessor. The operation of a liquid crystal display requires that the data and backplane pins must be driven by an alternating signal. This function is provided by a software routine that toggles the data and backplane at approximately a 30 Hz rate. Motorola Sensor Device Data The source code, compiler listing, and S-record output for the software used in this system are available on the Motorola Freeware Bulletin Board Service in the MCU directory under the filename OEVB-114.ARC. To access the bulletin board you must have a telephone line, a 300, 1200 or 2400 baud modem and a terminal or personal computer. The modem must be compatible with the Bell 212A standard. Call 1-512-891-3733 to access the Bulletin Board Service. The software for the system consists of several modules. Their functions provide the capability for system calibration as well as displaying the pressure input to the MPX5100 transducer. Figure 5 is a flowchart for the program that controls the system. 4-45 AN1305 INITIALIZE DISPLAY 1/0 PORTS INITIALIZE TIMER REGISTERS ALLOW INTERRUPTS PERFORM AUTO ZERO TIMER INTERRUPT I SERVICE TIMER REGISTERS SETUP COUNTER FOR NEXT INTERRUPT SERVICE LIQUID CRYSTAL DISPLAY RETURN FROM INTERRUPT ACCUMULATE 100 AlD CONVERSIONS COMPUTE INPUT PRESSURE CONVERT TO DECIMAL PLACE IN RESULT OUTPUT BUFFER Figure 5. DEV8-114 Software Flowchart The compiler used in this project was provided by BYTE CRAFT LTD. (519) 888-6911. A compiler listing of the program is included at the end of this document. The following is a brief explanation of the routines: delay() Used to provide approximately a 20 ms loop. read_a2d() Performs one hundred reads on the analog to digital converter on multiplexer channel 5 and returns the accumulation. fixcompare() Services the internal timer for 30 ms timer compare interrupts. TIMERCMP() Alternates the data and backplane for the liquid crystal display. initio() Sets up the microcomputer's I/O ports, timer, allows processor interrupts, and calls adzeroO. adzero() This routine is necessary at power-up time because it delays the power supply and allows the 4-46 transducer to stabilize. It then calls 'read_atodO' and saves the returned value as the sensors output voltage with zero pressure applied. cvt_bin_dec(unsigned long arg) This routine converts the unsigned binary argument passed in 'arg' to a five digit decimal number in an array called 'digit'. It then uses the decimal results for each digit as an index into a table that converts the decimal number into a segment pattern for the display. It is then output to the display. display_psi() This routine is called from 'mainO'. The analog to digital converter routine is called, the pressure is calculated, and the pressure applied to the sensor is dis· played. The loop then repeats. main() This is the main routine called from reset. It calls 'initioO' to set up the system's I/O. 'display_psiO' is called to compute and display the pressure applied to the sensor. Motorola Sensor Device Data AN1305 SOFTWARE SOURCE/ASSEMBLY PROGRAM CODE #pragma option v '" rev 1.1 code rewritten to use the MC68HC70SBS instead of the MC68HC805B6. WLL 6'17'91 THE FOLLOWING 'e' SOURCE CODE IS WRITTEN FOR THE DEVB-114 DEMONSTRATION BOARD. IT WAS COMPILED WITH A COMPILER COURTESY OF: BYTE CRAFT LTD. 421 KING ST. WATERLOO, ONTARIO CANADA N2J 484 (519)888-6911 SOME SOURCE CODE CHANGES MAY BE NECESSARY POR COMPILATION WITH OTHER COMPILERS. BILL LUCAS 8/5/90 MOTOROLA, 0800 1700 0050 0096 lFFE lFFC l.FFA lFFB lFF6 lFF4 1FF2 "' BPS #pragma memory ROMPROG [5888] @ OxCeOD #pragma memory RAMPAGED [150] @ OxOOSO 1* Vector assignments */ #pragma vector _RESET @ Oxlffe #pragma vector _SWI @ Oxlffc @ Oxlffa #pragma vector IRQ #pragma vector TlMERCAP @ Ox1ff8 #pragma vector TlMERCMP @ Oxlff6 @ Oxl.ff4 #pragma vector TlMEROV @ Ox1ff2 #pragma vector SCI #pragma has STOP ; #pragma has WAIT ; #pragma has MOL ; 0000 0001 0002 0003 0004 0005 0006 0007 0008 0009 OOOA OOOB OOOC OOOD OOOE OOOF 0010 Motorola Sensor Device Data ," #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #tpragma "' ", ",", "'"' "'*' Register assignments for the 68HC705B5 microcontroller portrw porta @ OxOO; @ OxOl; portrw portb @ Ox02; portrw portc @ Ox03; portrw portd in ,SS ,seK ,MOSI,MISO, TxD, RxD @ Ox04; portrw ddra Data direction, Port A @ portrw ddrb OxOS; Data direqtion, Port B @ Ox06; portrw ddrc Data direction, Port C (all output) @ Ox07; portrw eeclk eeprom/eclk cntl * I portrw addata @ Ox08; aId data register *1 portrw ads tat @ Ox09; aId stat/control @ OxOa; portrw plma pulse length modulation a @ OxOb; portrw plmb pulse length modulation b @ OxOc; portrw misc miscellaneous register portrw scibaud @ OxOd; sci baud rate register portrw scientll @ OxOe; sci control 1 portrw scientl2 @ OxOf; sci control 2 portrw seistat @ OxlO; sci status reg ,"," ,"," ,"," ," ,"'"," ,"," ,"," ,"," ," "' "'"' "' "'"' "'"' 4-47 AN1305 0011 0012 0013 0014 0015 0016 0017 0018 0019 OOlA OOlB OOle 0010 OOlE OOlF #pragma portrw scidata #pragma portrw tcr #pragma portrw tsr #pragma portrw icaphil @ Oxll; Ox12; Ox13, @ Ox14; #pragma portrw icaplol @ OxlS; #pragma portrw ocmphil #pragma portrw ocmpl.ol @ Ox16, @ Ox17; #pragma portrw tenthi @ OxlS; #pragma #pragma #pragma #pragma #pragma #pragma #pragma @ Ox19; OxlAI portrw portrw portrw portrw portrw portrw portrw @ @ tcntle Bcnthi aentle icaphi2 icapl.o2 ocmphi2 ocmpl02 @ @ @ @ @ @ OxlB; Oxle; Oxld; axle; Oxlf, ,.,. ,.,.,. ,.,. ,.,. ,.,. ,.,. ,.,. SCI Data ., IeIE, CClE. TOlE, 0; 0, O. lEGE. OLVL ICF,OCF,TOF,Q; 0.0, 0, 0 .,., ., ., Input Capture Reg (Hi-Ox14, Lo-Ox15) Input Capture Reg (Hi-Ox14, La-OxlS) Output compare Reg (Hi-Ox16, LO-Ox17) *1 Output Compare Reg (Hi-Ox16, La-Ox17)'*/ Timer Count Reg (Hi-Ox18, Lo-Ox19) Timer Count Reg (Hi-Ox18, Lo-Ox19) Alternate Count Reg (Hi-$lA, Lo-$lB) Al.ternate Count Reg (Hi-$lA, Lo-$lB) Input Capture Reg (Hi-Oxle, Lo-Oxl.d) Input Capture Reg (Hi-Oxle, Lo-Oxld) OUtput Compare Reg (Hi-Oxle, Lo-Oxlf) *1 Output Compare Reg (Hi-Oxle, Lo-Oxlf)*1 .,., .,., .,., 1* put constants and variables here ... they must be global * I lEFE 74 1* * * *.... * .. * * * * .... * .. * * * * .. * ........ * * .... * .... * * ** ............ * .. * ............ * .......... ** * .. * ........ ** .... I #pragma mer @ OxlEFE = Ox74; 1* this disables the watchdog counter and does not add pull-down resistors on ports Band C .. I 0800 FC 30 DA 7A 36 6E E6 38 FE canst char lcdtab[l={Oxfc, Ox30, Oxda,Ox7a,Ox36,Ox6e,Oxe6,Ox38,Oxfe ,Ox3e }1 0809 3E ., 080A 27 10 03 E8 00 64 00 OA 1* lcd pattern table canst long dectable [] 0050 0005 unsigned int digit[5]; 1* buffer to hold results from cvt_bin_dec functio *1 0000 registera ac; 1* processor's A register *1 0055 long atodtemp; 1* temp to accumulate 100 aId readings for smoothing "I 0059 long slope; 1* multiplier for adc to engineering units conversion *1 005B int adcnt; 1* aId converter loop counter *1 005C long xdcr_offset; 1* initial xdcr offset *1 005E 0060 unsigned long i, j; I * counter for loops * I 0062 5 10000, 1000, 100, 10 }; 1* mise variable *1 int k; struet botbbytes { int hi; int 10; ), union isboth long 1; struct bothbytes b; ), 0063 0002 4-48 union isboth q; 1* used for timer set-up *1 Motorola Sensor Device Data AN1305 1'* ***'* '* ** *'* **** '* *'* '* '* ***'************ ****** '*.'*** '*'*'* ********-*** -- -,.-* '* ,.,.,.,. ,.._/ / * code starts here -/ I· * '*. *. '* * '* '* '* '* •• * * * *. '*.* * '*. '* '* * *. *. * * * * * * * *,. * * * * '* * * * '* * * * * * * '* * '* * '** * * * * '* * * * * * * * / 1* these interrupts are not used ... give them a graceful return if for some reason one occurs * 1 lFFC 0812 lFFA 0813 lFF8 0814 1FF4 0815 1FF2 0816 08 80 08 80 08 80 08 80 08 80 12 RTI IRQ () !I 13 RTI TlMERCAF ( ) () 14 RTI TIMEROV () !I 15 RTI BCI() !I 16 RTI 1* '* * * *. * * '* * * * * * * * *. * * * '* * * * '* * •• *. * * * *. *. * * * '* *. * '* * * * *.*. * * * * * * * * ** * '* '* * * '* '* * * * '* / void delay(void) /* just hang around for a while *1 ( 0817 0818 081A 081C 081E 0820 0822 0824 0826 0828 082A 082C 082E 0830 0832 0834 0836 4F 3F B7 B6 B7 B6 B7 B6 AO B6 A2 24 3C 26 3C 20 81 57 58 57 5E 58 SF SF 20 5E 4E 08 SF 02 5E EE CLRA CLR STA LOA STA LOA STA LOA SUB LDA SBC BCC INC BNE INC BRA RTS for (i=0; i<20000; ++i); $57 $58 $57 $5E $58 $sF $sF #$20 $sE #$4E $0836 $sF $0834 $5E $0824 1* * '* * * *,. * * * * '* * * *,. * * * * * '** *. *'* * * *,. * *. * * * * * * * '* * * ** '* * * * * * *. ** '* * '*.*,. * * *'* * * * ** *,. * / read_a2d (void) ( 1* read the aId converter on channel 5 and accumulate the result in atodtemp ,. I 0837 0839 083B 083C 083E 0840 0842 0844 3F 3P 4F B7 B6 A8 A1 24 56 55 5B 5B 80 E4 21 CLR CLR CLRA STA LDA EOR CMP BCC $56 $55 atodtemp=O; 1 * zero for accumulation * / for ( adcnt = 0 ; adcnt = dectable til ) LSLX 08 OB 6A 07 08 OA 69 5C LOA CMP BNB LDA CMP BEQ $080B,X $6A $092B $080A,X $69 $0987 092B BB 6B 0920 58 092E 06 08 OA LoX $6B { 4-52 1 dectable [i] ; LSLX LDA $080A,X Motorola Sensor Device Data AN130S 0931 0933 0936 0938 093A 093C 093E 0940 0942 0944 0946 0948 094B 094E 0950 0952 0954 0956 0958 095A 095C 095E 0960 0962 0964 0966 0969 096B 096D 096F 0971 0973 0975 0977 0979 097B 097D 097F 0981 0983 0985 B7 D6 B7 B6 B7 B6 B7 B6 B7 B6 B7 CD CD BF B7 BE E7 BE E6 3F B7 B6 B7 B6 B7 CD BF B7 33 30 26 3C B6 BB B7 B6 B9 B7 B7 B6 B7 6c 08 6D 6A 58 69 57 6C 66 6D 67 OA OA 57 58 6B 50 6B 50 57 58 6C 66 6D 67 OA 57 58 57 58 02 57 58 6A 58 57 69 57 69 58 6A OB 5E 8F 3F STA LDA STA LDA STA LDA STA LDA STA LDA STA JSR JSR STX STA LDX STA LDX LDA CLR STA LDA STA LDA STA JSR STX STA COM NEG BNE INC LDA ADD STA LDA ADC STA STA LDA STA 0987 3C 6B 0989 20 8A 098B B6 6A 098D B7 58 098F B6 69 0991 B7 57 0993 BE 6B 0995 B6 58 0997 87 50 INC BRA LDA STA LDA STA LDX LDA STA 0999 9B SEI $6C $080B,X $6D $6A $58 $69 $57 $6C $66 $6D $67 $OA5E $OA8F $57 $58 $6B $50,X $6B $50,X $57 $58 $6C $66 $6D $67 $OA3F $57 $58 $57 $58 $0975 $57 $58 $6A $58 $57 $69 $57 $69 $58 $6A $6B $0915 $6A $58 $69 $57 $6B $58 $50,X digit Ii] arg digit [1] arg I 1; arg-(digit[i] * 1); arg; 1* now zero suppress and send the led pattern to the display *1 Motorola Sensor Device Data SEl; 4-53 AN1305 Og9A 3D 50 099C 26 04 TST BNE CLR 099E 3F 02 09AD 2 a 07 BRA 09A2 BE SO 09A4 06 08 00 LOX LOA D9A7 B7 02 STA 09A9 09AB 09AD 09AF 09Bl 09B3 SO 08 51 04 01 07 TST BNE TST BNE CLR BRA 09B5 BE 51 LDX 09B7 09BA 09BC 09BE 09Cl 09C2 09C4 06 B7 BE 06 4C B7 9A LOA STA LOX LDA INCA STA CLI ages CD 08 17 30 26 30 26 3F 20 08 00 01 52 08 00 00 09C8 81 JSR $50 $09A2 $02 $09A9 $50 $0800,X $02 $50 $09B5 $51 $09B5 $01 $09BC $51 $0800,X $01 $52 $0800,X o ) if ( digit [OJ porte = I * leading zero suppression '* I 0; else porte =( lcdtab[digit[O]] ); if ( digit [oJ == 0 && digit [lJ /* laO's digit *1 o ) portb=D; else /* la's digit */ portb ( lcdtab [digit [lJ J ) I porta ( lcdtab[digit[2]J+l ); 1* l's digit + decimal point *1 $00 eLI; $0817 delay() ; RTS 1* '* * '* * * * '* * * * * * * '* '* * '* * '* '* '* '* '* '* '* '* '* '* '* '* '* '* ** * * '* '* * '* * '* '* '* '* * '* * '* '* '* '* '* '* '* '* * * '* *,., '* '* I void display---psi (void) 1* At power-up it is assumed that the pressure port of the sensor is open to atmosphere. The code in initio() delays for the sensor and power to stabilize. One hundred AID conversions are averaged and divided by 100. The result is called xdcr_offset. This routine calls the AID routine which performs one hundred conversions, divides the result by 100 and returns the value. If the value returned is less than or equal to the xdcr_offset, the value of xdcr_offset is substituted. If the value returned is greater than xdcr_offset, xdcr_offset is subtracted from the returned value. That result is multiplied by a constant to yield pressure in PSI * 10 to yield a "decimal point". "{ while (1) { 09C9 3F 59 09CB A6 40 ageD B7 SA 09CF B6 03 0901 A4 co 0903 B7 62 CLR LOA STA LOA AND STA 09D5 Al 80 CMP 0907 0909 090B 0900 BNE CLR LOA STA LDA 26 3F A6 B7 06 59 41 SA 09DF B6 62 4-54 $59 #$40 $5A $03 #$CO $62 #$80 $090F $59 #$U $5A $62 = 64; slope k portd &. OxcO; if ( k == slope = if ( k oxeo 1* this lets us "rubber" the slope to closer fit the slope of the sensor * I 1* J2 removed, J1 installed * I 65; Ox40 ) 1* Jl removed, J2 installed *1 Motorola Sensor Device Data AN1305 09El Ai 40 CMP #$40 09E3 26 06 BNE $09EB 09ES 3F 59 09E7 A6 3F CLR $59 LOA #$3F 09E9 B7 SA STA $5A D9EB 09EE 09FO 09F2 09F4 D9F6 $OB37 3F 55 JSR CLR B7 56 STA $56 BO 50 SUB $50 B7 5B STA $5B $5C #$BO CD OB 37 63; 1* else both jumpers are removed or installed ... don't change the slope *1 atodtemp = read_a2d() i 1* atodtemp = raw aid ( O.. 255 ) *1 $55 B6 5C LOA 09FB AB BO EOR D9FA 09FC 09FE DAOO OAD2 STA $57 B6 55 LOA AB BO EOR $55 #$BO B2 57 SBC $57 BA 5B ORA $58 DAD4 22 08 DAD6 B6 5C DADS B7 55 DADA B6 50 BHI $OAOE LOA STA $5C $55 LOA $50 DADC OADE DA1D DA12 DA14 DA16 DA18 OA1A OA1C OA1E DA2D DA22 OA24 DA26 DA28 OA2A OA2D OA2F OA31 DA34 OA36 B7 56 B6 56 STA LOA $56 B7 57 slope if ( atodtemp <= xdcr_offset atodtemp atodtemp $56 BO 50 SUB $50 B7 56 STA $56 B6 55 LOA $55 B2 5C SBC B7 55 STA $5C $55 B6 56 LOA $56 B7 58 B6 55 STA LOA $58 B7 57 STA $57 B6 59 LOA $59 B7 66 STA $66 B6 SA LOA B7 67 STA $67 CD OA 3F $OA3F BF 55 JSR STX B7 56 STA $56 CO 08 FE JSR $08FE 20 93 BRA $09C9 81 RTS xdcr_offset; xdcr_offset; 1* remove the offset *1 atodtemp *= slope; 1* convert to psi *1 $55 $5A $55 cvt_bin_dec( atodtemp ); 1* convert to decimal and display *1 1 *** * * **** * * * * **** **** ** ** * - * - - - ****** - - *** *-****- -- *****- ** * - ********** * 1 maine) OA37 OA3A DA3C OA3E CD 08 CE JSR $08CE AD 80 BSR $09C9 20 FE 81 BRA $OA3C RTS DA3F BE 58 OA41 B6 67 LOX LOA initio(); 1* set-up the processor's ilo *1 display---psi (); while (1) ; 1* should never get here * / $58 $67 Motorola Sensor Device Data 4-55 AN1305 OA43 42 OM4 OA46 OA48 OMA OA4C OA4D B7 70 BF 71 BE 57 B6 67 42 BB 71 B7 71 BE 58 OA4F OASl. OA53 B6 OA55 42 OA56 BB OA58 B7 OA5A 97 OA5B B6 OA5D 81 66 MOL STA $70 STX LDX LDA $71 $57 $67 MOL ADD STA LDX $71 $71 $58 LDA MOL ADD $66 71 STA TAX $71 70 LDA RTS $70 CLR CLRX CLR $70 CLR INCX LSL ROL ROL ROL $6F OA6E B6 6E OA70 BO 67 OA72 B7 6E LDA SUB STA $6E $67 $6E OA74 OA76 OA78 OA7A OA7C LDA SBC STA BCC LDA $6F $66 $6F $OA89 $67 ADD STA LDA $6E $6E $66 ADC STA SEC $6F $6F 71 OA5E 3F 70 OA60 SF 0A61 OA63 OA65 OA66 OA6S OA6A OA6C 3F 6E 3F 6F 5C 38 58 39 57 39 6E 39 6F B6 B2 B7 24 B6 6F 66 6F OD 67 OA7E BB 6E OA80 B7 6E OAB2 B6 66 OA84 B9 6F OA86 B7 6F OA88 99 OA89 59 OABA 39 70 OA8C 24 D8 OA8E 81 OA8F OMO OA91 OA93 OA94 53 9F BE 70 53 81 lFFE OA 37 4-56 $71 $6E $58 $57 $6E $6F ROLX ROL BCC $70 $OA66 RTS COMX TXA LDX $70 COMX RTS Motorola Sensor Device Data AN130S SYMBOL TABLE LABEL VALUE IRQ 0813 0815 OA3F 0000 001A 0009 0000 0005 0050 0000 0015 0060 0001 TlMEROV _MUL16x16 _STOP acnthi adstat b ddrb digit hi icaplol j 10 ocmphi2 plmb portd scientll. slope tar ~OlE OOOB 0003 OOOE 0059 0013 LABEL VALUE LABEL VALUE LABEL VALUE SCI 0814 0066 l.FPE 0000 005B 0069 08FE TIMERCMP _MUL _STARTUP DaDA delay fixcompare icaphi2 isboth lcdtab oomphil plma 089B 0000 0000 0057 0008 0055 0004 0817 0880 DOle 0002 0800 0016 0816 QASE TlMERCAP _LDIV _RDIV OABF _RESET _SWI 0812 001B _WAIT aentlo adzero bothbytes OBA4 ddrc display-psi i icaplo2 0002 0006 0ge9 DOSE a01D _LongIX adcnt arg evt_bin_dec dectable eeclk icaphil initio k 0062 I 1 main oomplol. porta OA37 q scicnt12 tenth! xdcr_offset MEMORY USAGE MAP ('X' = used, I_' 0017 0000 0063 OOOF 0018 DOSe 0007 0014 DaCE 0000 I mise ocmplo2 portb read_a2d Bcidata tontlo oooe OOlF 0001 0837 0011 0019 _longAC addata atodtemp ddra porte scibaud scistat tor DODA 0002 0000 0010 0012 = Unused) 0100 ---------------- ---------------- ---------------- ---------------- 0140 0180 OleO ---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- --------------x- a8 a0 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 084 a xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx 08 B a XXXXXXXXXXXXXXXX OBCO XXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXX 0900 XXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx. :XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx 0940 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 09 B 0 09CO XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX OAO 0 XXXXXXXXXXXXXXxx. XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX xxxxx----------- ---------------- ------------------------------- ---------------- ---------------- ---------------- OA40 OA80 OACO xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx lPOO ---------------- ---------------- ---------------- ---------------- 1F40 1F80 ---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- ---------------- lFCO ---------------- ---------------- ---------------- --XXXXXXXXXXXXXX All other memory blocks unused. Errors 0 warnings Motorola Sensor Device Data 4-57 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1307 A Simple Pressure Regulator Using Semiconductor Pressure Transducers Prepared by: Denise Williams Discrete Applications Engineering INTRODUCTION Semiconductor pressure transducers offer an economical means of achieving high reliability and performance in pressure sensing applications. The completely integrated MPX5100 (0-15 PSI) series pressure transducer provides a temperature-compensated and calibrated, high-level linear output that is suitable for interfacing directly with many linear control systems. The circuit described herein illustrates how this sensor can be used with a simple pressure feedback system to establish pressure regulation. Figure 1. DEVB-104 MPX5100 Pressure Regulator REV 1 4-58 Motorola Sensor Device Data AN1307 +5V 2 RG ICt - MC33079 RG-tOK POT Figure 2. High Level, Ground Referenced Output Using an MPX2000 Series Transducer THE SENSOR The MPX5100 is the next level of integration beyond the MPX2000 series. The MPX2000 series of pressure transducers already incorporates, on-;:hip, more than a dozen external components needed for temperature compensation and offset calibration. Figure 2 shows the basic circuitry required to create a ground referenced output amplified to a high-level from an MPX2100 (0-15 PSI) transducer. For optimum performance, matched metal film resistor pairs and precision operational amplifiers are required. The MPX5100 goes one step further by adding the differential to ground referenced conversion and the on-;:hip. Therefore, the amplification circuitry eighteen-;:omponent circuit shown in Figure 2 can be reduced to one signal-;:onditioned sensor, as shown in Figure 3. All of the MPX devices contain a single piezoresistive implant which replaces the four-element Wheatstone bridge circuit found in most semiconductor-based transducers. The MPX5100 transducer uses an interactively laser-trimmed, four-stage network to perform signal conditioning. Figure 4 is an internal block diagram of the MPX51 00 showing these four stages. Motorola Sensor Device Data The first stage compensates for the temperature coefficient of offset while the second stage performs the differential to single-ended conversion. Stage three is a precision voltage reference that calibrates the zero pressure offset of the entire system, which comprises the sensor offset and the input offset voltages of the other three operational amplifiers. The final stage provides the full-scale span calibration. The MPX5100 is compensated for operation over 0 to 85°C with a response time (10% to 90%) of 1.0 msec. +5V ~---oVout Figure 3. High Level, Ground Referenced Output Using an MPX5100 4-59 AN1307 PIN3 +5 V SOURCE Rll RG Vp~~----~~----~ Vex VS+ 'VVV THIN FILM RESISTOR .yI, PIN2 LASER TRIMMABLE RESISTOR Figure 4. Fully Integrated Pressure Sensor Schematic Some terms commonly used when discussing pressure sensors are: • VFSS (Full Scale Span) - the output voltage variation between zero differential pressure applied to the sensor and the maximum recommended operating pressure applied to the sensor, with a given supply voltage. • VOFF (Offset) - the voltage output given by a sensor with zero differential pressure applied, with a given supply voltage. • Sensitivity - the amount of output voltage variation per unit pressure input variation. • Linearity - the maximum deviation of the output from a straight line relationship over the operating pressure range. 4-60 Motorola specifies linearity using an "end-point straight line" method. Each transducer is laser trimmed to provide the specified VFSS with the supply voltage indicated on the data sheet. For example, VFSS for the MPX5100 is trimmed to 4.0 V with a supply voltage of +5.0 Vdc. For the MPX5100, VOFF = 0.5 V with a 5.0 Vdc supply. Therefore, the output of the sensor varies from 0.5 V to 4.5 V for differential pressures from 0 kPa to 100 kPa, respectively. This is ideal for interfacing directly with many linear devices such as the MC33033 motor controller described in this application note or the AID of a microprocessor controlled system. Motorola Sensor Device Data AN1307 THE CIRCUIT Figure 5 is a block diagram of a simple pressure regulator feedback system. The motor/pump is used to fill a reservoir as required. The pressure created in this reservoir is monitored with a gauge and fed back to the MPX51 00 sensor. The sensor provides an output voltage to the Motor Drive Circuitry which is proportional to the monitored pressure. Figure 5. System Block Diagram The Pressure Select Circuitry allows the user to choose a desired pressure by creating a reference voltage. This reference voltage is equivalent to the sensor output when the desired pressure exists in the system. A comparison is made between the sensor output and the reference voltage. When the system pressure is below the selected pressure, the motor is turned on to increase the pressure. When the system pressure reaches the selected pressure, the motor/pump turns off. Hysteresis is used to set different trip voltages for turn-off and turn-on to allow for noise and pressure fluctuations. For particular applications that only require one fixed regulated pressure, the Pressure Select Circuitry can be reduced to a single voltage reference. Additionally, the Motor Drive Circuitry can be simplified depending on the application requirements and the motor to be used. Since a +5.0 Vdc supply to the sensor provides an output that is ideal for interfacing with an AID converter, this comparison could easily be converted to a software function, allowing for a digital pressure select input as well as controlling a digital display. R2 470 01 114 MPM3002 02 114 MPM3002 MOTOR. MOTOR- 04 1/4 MPM3002 R4 47 R6 24 R13 330 GND Figure 6. MPX5100 Pressure Regulator Motorola Sensor Device Data 4-61 AN1307 DETAILED CIRCUIT DESCRIPTION The Supply Voltage Figure 6 is a schematic of the control electronics for this pressure regulator system. The + 12 Vdc supply is used by the MPM3002 power transistors, the MC33033 motor controller and the MC34272 operational amplifier. In addition, this voltage is regulated down to +5.0 Vdc for the sensor supply. The Pressure Select Circuitry R11, R12 and R13 provide a variable reference from 0.5 V to 4.5 V. By adjusting R 12, the reference voltage can be set to the desired pressure turn-off point. The error amplifier internal to the MC33033, along with R8, R9 and R1 0, is configured as a comparator with hysteresis. The sensor output voltage and the reference voltage are inputs to the comparator and are used to determine when the motor is turned on or turned off. When the sensor output is less than the reference voltage the motor is on. Pressure in the system increases until the sensor output is equal to the reference voltage plus the hysteresis voltage then the motor is turned off. If the pressure decreases while the motor is off, the sensor output will decrease until it is equal to the reference voltage at which time the motor turns on. Hysteresis is set to prevent the motor from turning off and on due to small voltage variations such as noise or small pressure fluctuations in the system. The ratio of R10 to both R8 and R9 can be adjusted to provide the hysteresis required in a particular application. The resistor values shown in Figure 6 provide a ratio of 300 kQ to 10 kn. This corresponds to a hysteresis of 300 mV or 7.5 kPa between the turn-off and turn-on trip pOints. The operational amplifier (MC34272) is used to provide a low impedance output to isolate the divider network from the comparator circuit. The Motor Drive Circuitry In a brush motor drive, the primary function of the controller IC is to translate speed and direction inputs into appropriate drive for the power transistors. This can be done efficiently by using the MC33033 Brushless DC controller as shown in Figure 6. In a brushless application, two of six output transistors are switched on in response to Hall sensor inputs HA, HB and HC. In order to drive a brush motor, all that is required is to select a single Hall code that will drive a four transistor H-bridge in a way that is suitable for brush motors. By using phase A and phase C outputs, a 1-0-0 Hall code produces the correct drive for brush motors. AT, BT and CT are open collector outputs, therefore, a logic 0 represents the on state. Conversely, AS, BS and CB are totem pole drivers, and a logic 1 turns on the corresponding output transistor. Generating the Hall code is easy. Since it is fixed at 1-0-0, tying the Hall inputs to DC levels is sufficient. Logic 1 is obtained from VREF, and logic 0 from ground. The result is the 4-62 connections for pins 4, 5 and 6 that are shown in Figure 6. In addition to providing drive to the output transistors, the MC33033 has a current limit function and controls speed by pulse width modulating the lower output transistors, 03 and 04. The current limit operates on a 100 mV threshold. Once tripped, it latches the lower transistor drive off until the next clock cycle begins. The latching feature prevents high frequency oscillations which would otherwise overheat the power transistors. Compatibility with SENSEFETsTM is provided by the 100 mV threshold and allows the lossless current sensing configuration that is also shown in Figure 6. For low-power, low-voltage motors, level shifting the gate-drain for 01 and 02, the upper output transistors, is not a problem. Open collector tOjrSide outputs in the MC33033 interface directly to P-Channel MOSFETs. All that is required in the way of top-side drive circuitry is gate-to-source resistors on the P-Channel transistors, such as R2 and R3 in Figure 6. Since an H-Bridge motor drive uses four power transistors, a power module can considerably simplify the output stage. The MPM3002 that is shown as 01, 02, 03 and 04 in Figure 6 is ideally suited to fractional horsepower motor drives. It consists of two P-Channel MOSFETs and two N-Channel SENSEFETs connected in an H-Bridge configuration, and housed in an isolated 12-pin, single, in-line package. The P-Channels have a maximum on-resistance of 0.4 ohms, and the N-Channels 0.15 ohms. All four transistors have 100 V breakdown ratings. The MPM3002's P-ChanneI/N-Channel configuration makes interfacing to an MC33033 controllC especially easy. The schematic shows an example. The SENSEFETs are connected to outputs AB and CB through series gate resistors, and the P-Channels are connected directly to AT and CT and tied to the + 12 V rail through pull-up resistors. If the source voltage is greater than + 12 V, a divider can be used to keep gate voltage on the P-Channels within reasonable limits. In the schematic, the mirror outputs of both SENSEFETs are tied together. They are then fed into the MC33033's current limit input through a noise suppression filter consisting of R7 and C3. Since only one SENSEFET is on at any given time, this connection is a logic wired-OR. It provides overcurrent protection for both directions of motor rotation, and does not alter trip pOints for the individual legs. The trip point is calculated with the aid of the following expression. IUMIT=VSENSE (RSENSE - rm(on»/(ra(on) ·RSENSE) Where: VSENSE is sense voltage RSENSE is the mirror-to-source sense resistor rm(on) is mirror-active resistance = 112 ohms ra(on) is source-active resistance = 0.14 ohms Motorola Sensor Device Data U AN1307 o 8 + 81C2 51 000 FIR o o MPX5100 0 0 0 0 (XDCR1) RS R11 R9 R1 '" 0 0 0 @ glCllD ;;; D CIlD ! D : 0 000 C2 R5 0 0 R3 q, O!!!!!Hl!!!!!Hl!!~ MC33033 0 !!!!!!!!!!!l!l!!!!!! CIlD ~ IC3 00 0 0000 R6 ~4 R7 R4 R1 R2 0 0000 0 C;; 0 C5 R12 0 o~O R13 o DODD C100 o~ D D o MPX5100 PRESSURE REGULATOR +12GND+M-M 0 a a a a CIlD CIlD CIlD CIlD o : CIlD : c CIlD ~ a a a !!!!!!!!!!!l!l!!!!!!!!!!!!!!!!!!!!!!!l!l!! o Figure 7. PCB Component Layout •• • • ••• • o PRESSURE !!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!! SELECT ~~~~~~~ DI;~~~TE APPLICATIONS -- •• ••••••••••• 11 •••••••• • ••••••••••••••••••••• Figure 9. PCB Solder Side Artwork • ~~~~:: -• _ t -,-j-r' ~ .................... . ••••••••••••••••••••• Figure 8. PCB Component Side Artwork • Figures 7, 8, and 9 show a printed circuit board and component layout for the electronics portion of this pressure regulator system, and Table 1 is the corresponding parts list. System Performance The entire system draws 4.0 Amps with all but 50 mA used to drive the motor/pump. The pressure sensor provides a sensitivity to regulate well within a few kPa. However, most applications can allow far greater fluctuations in pressure. The system performance, therefore, depends mostly on the motor/pump selected and the hysteresis set in the control circuitry. Using a well-sealed pump will help ensure the motor turns off when the desired pressure is reached. Many pumps are designed to leak to prevent over inflation. In this case, the circuit will turn the motor off until the pressure is reduced, through leakage, by the deSigned hysteresis amount, then turn on and continue cycling to hold the pressure in the desired range. Since the current limit threshold in the MC33033 is 100 mV, current limiting will occur when VSENSE reaches 100 mV. For the circuit in Figure 6, using 100 mV for VSENSE, and with RSENSE R6 24 ohms then: = = ILiMIT = 0.1 (24 +112)/(0.14·24) = 4.1 Amps By using SENSEFETs in the lower half bridge in lieu of a power sense resistor in series with the motor, about 1/2 watt (4.1 A· 0.1 V) of dissipation is saved. Motorola Sensor Device Data 4-63 AN1307 Table 1. Parts List for Pressure Regulator PC Board Reference Designator Qty Description Comments MISCELLANEOUS 1 2 1 4 6 2 1 S1 PC Board InpuVOutput Terminals Heat Sink 1/2" nylon standoffs, threaded 1/2" nylon screws 4-40 nylon nuts switch See Figures 7-9 PHX CONT #1727036 for ICePAKTM SS-12SDP2 RESISTORS, FIXED Comp., ±5%, 1/4 W R1, R4 R2,R3 R5,R8,R9 R6 R7 R10 R11 R13 2 2 3 1 1 1 1 1 47Q 470Q 10k(! 24Q 1 kQ 300kQ 3900Q 330Q R12 1 10 kQ, one turn RESISTORS, VARIABLE 3386P-1-103-T INTEGRATED CIRCUITS IC1 IC2 IC3 01-04 1 1 1 1 Motor Controller Reference Operational Amplifier Integrated H-Bridge XDCR1 1 MPX5100DP C1 C2 C3 C4 C5 1 1 1 1 1 MC33033P 78L05 MC33272P MPM3002 SENSOR CAPACITORS 220I!F, 25 V 0.005 J!F, ceramic, 25 V 0.001 J!F, ceramic, 25 V 1 J!F, ceramic, 50 V 0.01 J!F, ceramic, 25 V CONCLUSION REFERENCE This circuit is one example of how the MPX5100 with its high level output can directly interface with linear systems. It provides a simple design alternative where pressure measurement or control is required. 1. Schultz, Warren. "ICs Simplify Brush DC Motor Drives," Motion, November 1989. 4-64 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1309 Compensated Sensor Bar Graph Pressure Gauge Prepared by: Warren Schultz Discrete Applications Engineering INTRODUCTION Compensated semiconductor pressure sensors such as the MPX2000 family are relatively easy to interface with digital systems. With these sensors and the circuitry described herein, pressure is translated into a 0.5 to 4.5 volt output range that is directly compatible with Microcomputer ND inputs. The 0.5 to 4.5 volt range also facilitates interface with an LM39t 4, making Bar Graph Pressure Gauges relatively simple. Figure 1. DEVB147 Compensated Pressure Sensor Evaluation Board Motorola Sensor Device Data 4--65 AN1309 PIN-BY-PIN DESCRIPTION EVALUATION BOARD DESCRIPTION The information required to use evaluation board number DEVB147 follows, and a discussion of the design appears in the Design Considerations section. FUNCTION The evaluation board shown in Figure 1 is supplied with an MPX2100DP sensor and provides a 100 kPa full scale pressure measurement. It has two input ports. PI, the pressure port, is on the top side of the sensor and P2, a vacuum port, is on the bottom side. These ports can be supplied up to 100 kPa (15 psi) of pressure on PI or up to 100 kPa of vacuum on P2, or a differential pressure up to 100 kPa between PI and P2. Any of these sources will produce the same output. The primary output is a 10 segment LED bar graph, which is labeled in increments of 10% of full scale, or 10 kPa with the MPX2100 sensor. An analog output is also provided. It nominally supplies 0.5 volts at zero pressure and 4.5 volts at full scale. Zero and full scale adjustments are made with potentiometers so labeled at the bottom of the board. Both adjustments are independent of one another. ELECTRICAL CHARACTERISTICS The following electrical characteristics are included as a guide to operation. Characteristic Symbol Min Typ Max Units Power Supply Voltage B+ 6.8 - 13.2 de Volts PFS - - 100 kPa PMAX - - 700 kPa VFS - 4.5 - Volts VOFF - 0.5 - Volts Analog Sensitivity SAOUT - 40 mV/kPa Quiescent Current ICC - 40 - Full Scale Current IFS - 160 - rnA Full Scale Pressure Overpressure Analog Full Scale Analog Zero Pressure Offset mA B+: Input power is supplied at the B+ terminal. Minimum input voltage is 6.8 volts and maximum is 13.2 volts. The upper limit is based upon power dissipation in the LM3914 assuming all 10 LED's are lit and ambient temperature is 25°C. The board will survive input transients up to 25 volts provided that average power dissipation in the LM3914 does not exceed 1.3 watts. OUT: An analog output is supplied at the OUTterminal. The signal it provides is nominally 0.5 volts at zero pressure and 4.5 volts at full scale. Zero pressure voltage is adjustable and set with Rll. This output is designed to be directly connected to a microcomputer AID channel, such as one of the E ports on an MC68HCll. GND: There are two ground connections. The ground terminal on the left side of the board is intended for use as the power supply return. On the right side of the board one of the test point terminals is also connected to ground. It provides a convenient place to connect instrumentation grounds. TP1: Test point 1 is connected to the LM3914's full scale reference voltage which sets the trip point for the uppermost LED segment. This voltage is adjusted via Rl to set full scale pressure. TP2: Test pOint 2 is connected to the +5.0 volt regulator output. It can be used to verify that supply voltage is within its 4.75 to 5.25 volt tolerance. PI, P2: CONTENT Board contents are described in the parts list shown in Table 1. A schematic and silk screen plot are shown in Figures 2 and 6. A pin by pin circuit description follows. 4-66 Pressure and Vacuum ports PI and P2 protrude from the sensor on the right side of the board. Pressure port PI is on the top and vacuum port P2 is on the bottom. Neither port is labeled. Maximum safe pressure is 700 kPa. Motorola Sensor Device Data AN1309 + ON/OFF~ ~~\ ~1~ .,D2 ~ D3, D\ ~5 ~6, ~7, D \\ \~ \\ \\ \~ \\ \\ \\ \\ \\ D9 JJI II'F Q I U3A 3 L....-''--- 2 vMC33274 R6 D2 O.II'F Ul 3 -= I 0 1 MC78L05ACP G 2 R7 75 'A g 2 R8 75 4 1 -'XDCRI MPX2100DP GN[) -= - r R13 ;> 1 k -A~~ 1k RIO "'h ~ .A 200 -= 1~14 1~.r ZERO CAL. rl +MC33274 ~ + -= 1 LED U2 ~ GND 3 S+ 5 RLO SIG 7 RHI ~ REF 7.5 k ~~D ~ R3 LED 17 LED~ LED LED LED LED t§8 "'i FULL SCALE CAL. R4 ~ R2 1k U3C -= -b TP2 +5 VOLTS > R14 ......., ~ 8 "'i 470 011 \ \ MV57124A POWER ON INDICATOR R12 470 " -= R9 .AA 11n GNO ~ 2.7k ~ v-:!:!1 14 13 12 11 TPI (FULL SCALE VOLJAGE) Rl .(> 1 k 6 -MC33274 9 LED~ LM3914N 1.2 k 7 Dl-0l0 MV57164 BAR GRAPH -= 1k ANALOG OUT Figure 2. Compensated Pressure Sensor EVB Schematic n~'~I'F U2B XOCR 1--'-+-_-iMPX2100r----_ _7-l:~ r-+----,-= MC78L05ACP C2 Ill'F R3 R4 1 k GNO PU R5 1k NOTE: For zero pressure voltage independent of sensor common mode R6/R7 = R2IRI 1k 1k R7 VOFFSET o-----J - r VREFL 0.302 V 1 -; VREFH 453 OHMS 1% GND ~ ~_ I':- - PRESSUREI VACUUM " IN ~ MC68HC11 0 _1 _2 _3 _4 _5 _6 _7 PORTE Figure 5. Application Example 0 0 COMPENSATED PRESSURE SENSOR EVB % FULL SCALE 100 D 90 0 0 0 0 0 0 0 0 0 80 70 60 50 40 30 20 10 D D D POWER +~ 0 B+ OUT GND "~g OFF KP~"~ 00 0 0 0 0 0 0 0 0 0 0 0 0 0 0 .... 0 '" ;::: ~ 0 :2 0 0 0 0 o C1 U3 0 0 z..,. 0 gj :2 0 0 0 0 0 0 0 0 D 0 ...J 0 0 0 ::> '"' 0 0 0 0 00 C2 D 0 0 0 D U2 R12 R2 0 0 R3 0 Rl0 R9 R4 0 0 0 R5 0 RS 0 R6 0 SENSOR "'~ o TP2 ~~~~~00~~~ 0 0 0 0 0 0 0000000 0000000 0000000 0 0 R14 R13 0 0 0 TPl 0 DEVB147 ~~~~ o a: a: 0 MOTOROLA DISCRETE APPLICATIONS 0000 0 0 ZERO FULL SCALE GND 0 0 Figure 6. Silk Screen 4-70 Motorola Sensor Device Data AN1309 Table 2. Parts List Designator Qty. Description Value Vendor Part Cl C2 1 1 Ceramic Capacitor Ceramic Capacitor Dl·Dl0 Dll 1 1 Bar Graph LED LED R2 R3 R4,R5,R9,R13 R6 R7,R8 Rl0 R12,R14 Rl Rll 1 1 4 1 2 1 2 1 1 1/4 Watt 1/4 Watt 1/4 Watt 1/4 Watt 1/4 Watt 1/4 Watt 1/4 Watt Trimpot Trimpot Sl 1 Switch NKK 12SDP2 Ul U2 U3 1 1 1 5.0 V Regulator Bar Graph IC OpAmp Motorola National Motorola MC78L05ACP LM3914N MC33274P XDCRl 1 Pressure Sensor Motorola MPX2100DP - 1 1 1 1 Terminal Block Test Point Terminal (Black) Test Point Terminal (Red) Test Point Terminal (Yellow) Augat Components Corp. Components Corp. Components Corp. 2SV03 TPl 0401 00 TPl 0401 02 TPl 0401 04 - Motorola Sensor Device Data Film Film Film Film Film Film Film Resistor Resistor Resistor Resistor Resistor Resistor Resistor 1.01lF O.lIlF 2.7K 1.2K 1.0K 7.5K 75 820 470 1.0K 200 GI GI MV57164 MV57124A Bourns Bourns 3386p·l-l02 3386P-1-201 4-71 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1315 An Evaluation System Interfacing the MPX2000 Series Pressure Sensors to a Microprocessor Prepared by: Bill Lucas Discrete Applications Engineering INTRODUCTION Outputs from compensated and calibrated semiconductor pressure sensors such as the MPX2000 series devices are easily amplified and interfaced to a microprocessor. Design considerations and the description of an evaluation board using a simple analog interface connected to a microprocessor is presented here. PURPOSE The evaluation system shown in Figure 1 shows the ease of operating and interfacing the MOTOROLA MPX2000 series pressure sensors to a quad operational amplifier, which amplifies the sensor's output to an acceptable level for an analog-to-digital converter. The output of the op amp is connected to the AID converter of the microprocessor and that analog value is then converted to engineering units and displayed on a liquid crystal display (LCD). This system may be used to evaluate any of the MPX2000 series pressure sensors for your specific application. DESCRIPTION The DEVB 158 evaluation system is constructed on a small printed circuit board. Designed to be powered from a 12 Vdc power supply, the system will display the pressure applied to the MPX2000 series sensor in pounds per square inch (PSI) on the liquid crystal display. Table 1 shows the pressure sensors that may be used with the system and the pressure range associated with that particular sensor as well as the jumper configuration required to support that sensor. These jumpers are installed at assembly time to correspond with the supplied sensor. Should the user chose to evaluate a different sensor other than that supplied with the board, the jumpers must be changed to correspond to Table 1 for the new sensor. The displayed pressure is scaled to the full scale (PSI) range of the installed pressure sensor. No potentiometers are used in the system to adjust its span and offset. This function is performed by software. Figure 1. DEVB158 2000 Series LCD Pressure Gauge EVB 4-72 Motorola Sensor Device Data AN1315 The signal conditioned sensor's zero pressure offset voltage with no pressure applied to the sensor is empirically computed each time power is applied to the system and stored in RAM. The sensitivity of the MPX2000 series pressure sensors is quite repeatable from unit to unit. There is a facility for a small adjustment of the slope constant built into the program. It is accomplished viajumpersJ4 thru J7, and will be explained in the OPERATION section. Figure 2 shows the printed circuit silkscreen and Figures 3A and 38 show the schematic for the syslem. Table 1. Sensor Type MPX2010 MPX20S0 MPX2100 MPX2200 MPX2700 Jumpers Input Pressure PSI JB J3 J2 J1 0-1.S 0-7.S 0-1S.0 0-30 0-100 IN OUT OUT OUT OUT IN IN IN IN OUT IN IN OUT OUT IN IN OUT IN OUT IN I LCD1 U5 J1§ J2 J3 J5 J40"' J6 J7 P1 DEVB158 2.9" -I Figure 2. Printed Circuit Silkscreen Motorola Sensor Device Data 4-73 AN1315 The analog section of the system can be broken down into two subsections. These sections are the power supply and the amplification section. The power supply section consists of a diode, used to protect the system from input voltage reversal, and two fixed voltage regulators. The 5 volt regulator (U3) is used to power the microprocessor and display. The 8 volt regulator (U4) is used to power the pressure sensor, voltage references and a voltage offset source. The microprocessor section (U5) requires minimal support hardware to function. The MC34064P-5 (U2) provides an under voltage sense function and is used to reset the microprocessor at system power-up. The 4.0 MHz crystal (Y1) provides the external portion of the oscillator function for clocking the microprocessor and providing a stable base for timing functions. Table 2. Parts List Designators Quant. C3, C4, C6 3 Cl, C2, C5 C7,C8 Jl-J3, J8 Description Rating Manufacturer 50Vdc 3 1 !,F Ceramic Cap. 50Vdc muRATA ERIE RPE123Z5Ul05M050V 2 22 pF Ceramic Cap. 100 Vdc Mepco/Centralab CN15A220K 30R4 J4-J7 1 Sprague Part Number 0.1 !,F Ceramic Cap. #22 or #24 AWG lined Copper As Required Dual Row Straight 4 Pos. Arranged On 0.1" Grid AMP lCl05Z5Ul04M050B 87227-2 LCDl 1 Liquid Crystal Display lEE LCD5657 Pl 1 Power Connector Phoenix Contact MKDS 1/2-3.81 Rl 1 6.98K Ohm resistor 1% R2 1 121 Ohm Resistor 1% R3 1 200 Ohm Resistor 1% R4,Rll 2 4.7K Ohm Resistor R7 1 340 Ohm Resistor 1% R5,R6 2 2.0K Ohm Resistor 1% R8 1 23.7 Ohm Resistor 1% R9 1 976 Ohm Resistor 1% Rl0 1 1K Ohm Resistor 1% R12 1 3.32K Ohm Resistor 1% R13 1 4.53K Ohm Resistor 1% R14 1 402 Ohm Resistor 1% R15 1 10 Meg Ohm Resistor RPl 1 47K Ohm x 7 SIP Resistor 2% TPl 1 Test Point Ul 1 Quad Operational Amplifier Motorola MC33274P U2 1 Under Voltage Detector Motorola MC34064P-5 U3 1 5 Volt Fixed Voltage Regulator Motorola MC78L05ACP U4 1 8 Volt Fixed Voltage Regulator Motorola MC78L08ACP US 1 Microprocessor Motorola Motorola MC68HC705B5FN or XC68HC705B5FN XDCR 1 Pressure Sensor Yl 1 Crystal (Low Profile) No Designator 1 No Designator 4 No Designator 1 Bare Printed Circuit Board No Designator 4 Self Sticking Feet Red CTS 770 Series Components Corp. TP-l04-01-{)2 Motorola MPX2xxxDP CTS ATS040SLV 52 Pin PLCC Socket for US AMP 821-575-1 Jumpers For J4 thru J7 Molex 15-29-1025 Fastex 5033-<>1-{)0-5001 4.0 MHz Note: All resistors are 1/4 W resistors with a tolerance of 5% unless otherwise noted. All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted. 4-74 Motorola Sensor Device Data AN1315 OPERATIONAL CHARACTERISTICS PIN-BY-PIN DESCRIPTION The following operational characteristics are included as a guide to operation. +12: Input power is supplied at the +12 terminal. The minimum operating voltage is 10.75 Vdc and the maximum operating voltage is 16 Vdc. Symbol Min Max Unit Power Supply Voltage +12 10.75 16 Volts Operating Current ICC 75 mA The ground terminal is the power supply return for the system. Full Scale Pressure MPX2010 MPX2050 MPX2100 MPX2200 MPX2700 Pis 1.5 7.5 15 30 100 PSI PSI PSI PSI PSI TP1: Test point 1 is connected to the final op amp stage. It is the voltage that is applied to the microprocessor's AID converter. There are two ports on the pressure sensor located at the bottom center of the printed circuit board. The pressure port is on the top left and the vacuum port is on the bottom right of the sensor. Characteristic GND: +12V J8 IS INSTALLED FOR THE MPX2010 ONLY +5V 6.98K +8 +5V +5V e>:,-..JVoV'v---(--' 121 R2 U2 MC34064P-5 PDO 2-A2 GND OUTt-.......--<; CPU_RESET 2-B4 +5V +8 R9 340 RIO 23.7 Jl ~~om{ R7 R8 J2 SELECT ':' J3 J4 J5 VRH 2-D4 PI GROUNO~ SLOPE ADJ. VRL 2-D4 402 R14 PDl 2-A2 PD2 2-A3 P03 2-A3 P04 2-A3 PD5 2-A3 J6 P06 2-A3 J7 PO? 2-A3 ':' ':' Figure 3a. Schematic Motorola Sensor Device Data 4-75 J:. ~ ...Z LCD1 o~ o~1 37 36 5 6 Co) o~ o~ S~ PLN l~_rl 28 ... en l__ ? 734 35 81 31 32 9 10 l= n__ f 11 29 30 12 26 27 13 14 15 24 25 16 22 23 18 17 19 20 21 1 PINS: 2-4, 33, 38-40 JJ "II to· I: 49 Cil 47 0 c.> 42 48 2 1 43 !=T ~ '::r (1) ~ 13 PDl H3 0' ./ c::>---E11 POl H3 ./ ~ PD5 1·E4 "- 5 ~ s:: S a iii" en (1) 5 48 4 38 37 39 3 0 2 PD7 '·E4 3 ./ 3 5 I : F - : J - 29 32 1 7 6 5 4 3 0 r 2 PORTS PORTC en o 3 45 44 6 7 ~~~ 2~ ~ 30 1 7 6 n C * 22pF 17 OSC2 P02 US PD3 R15 10M MC68HC705B5 = c::=:::J 4.00MHz y, PD4 16 OSCl PD5 22 PF] C8 PD6 P07 IRQ' 91 RESET' VPP6 18 1 15 o o 3 PDO Q ~ 4 PDl VDD 10 VSS TCAPl TCAP2 23 D/A RDI TDO VRL VRH 211 :::J o· (1) 5 PORTA ,5V CPU RESET H2- I VRL l-C4 VRH ,.C4 PLMA AN1315 OPERATION Connect the system to a 12 Vdc regulated power supply. (Note the polarity marked on the power terminal Pl.) Depending on the particular pressure sensor being used with the system, wire jumpers Jl through J3 and J8 must be installed at board assembly time. If at some later time it is desirable to change the type of sensor that is installed on the board, jumpers Jl through J3 and J8, must be reconfigured for the system to function properly (see Table 1). If an invalid Jl through J3 jumper combination (Le., not listed in Table 1) is used the LCD will display "SE" to indicate that condition. These jumpers are read by the software and are used to determine which sensor is installed on the board. Wire jumper J8 is installed only when an MPX2010DP pressure sensor is used on the system. The purpose of wire jumper J8 will be explained later in the text. Jumpers J4 through J7 are read by the software to allow the user to adjust the slope constant used for the engineering units calculation (see Table 3). The pressure and vacuum ports on the sensor must be left open to atmosphere anytime the board is powered-up. This is because the zero pressure offset voltage is computed at power-up. When you apply power to the system, the LCD will display CAL for approximately 5 seconds. After that time, pressure or vacuum may be applied to the sensor. The system will then start displaying the applied pressure in PSI. Table 3. J7 J6 J5 J4 Action IN IN IN IN IN IN IN IN OUT OUT OUT OUT OUT OUT OUT OUT IN IN IN IN OUT OUT OUT OUT IN IN IN IN OUT OUT OUT OUT IN IN OUT OUT IN IN OUT OUT IN IN OUT OUT IN IN OUT OUT IN OUT IN OUT IN OUT IN OUT IN OUT IN OUT IN OUT IN OUT Normal Slope Decrease the Slope Approximately 7% Decrease the Slope Approximately 6% Decrease the Slope Approximately 5% Decrease the Slope Approximately 4% Decrease the Slope Approximately 3% Decrease the Slope Approximately 2% Decrease the Slope Approximately 1% Increase the Slope Approximately 1% Increase the Slope Approximately 2% Increase the Slope Approximately 3% Increase the Slope Approximately 4% Increase the Slope Approximately 5% Increase the Slope Approximately 6% Increase the Slope Approximately 7% Normal Slope To improve the accuracy of the system, you can change the constant used by the program that determines the span of the sensor and amplifier. You will need an accurate test gauge (using PSI as the reference) to measure the pressure applied to the sensor. Anytime after the display has completed the zero calculation, (after CAL is no longer displayed) apply the sensor's full scale pressure (see Table 1), to the sensor. Make sure that jumpers J4 through J7 are in the "normal" configuration (see Table 3). Referring to Table 3, you can better "calibrate" the system by changing the configuration of J4 through J7. To "calibrate" the system, compare the display reading againstthat olthe test gauge (with J4 through J7 in the Motorola Sensor Device Data "normal slope" configuration). Change the configuration of J4 through J7 according to Table 3 to obtain the best results. The calibration jumpers may be changed while the system is powered up as they are read by the software before each display update. DESIGN CONSIDERATIONS To build a system that will show how to interface an MPX2000 series pressure sensor to a microprocessor, there are two main challenges. The first is to take a small differential Signal produced by the sensor and produce a ground referenced signal of sufficient amplitude to drive a microprocessor's AID input. The second challenge is to understand the microprocessor's operation and to write software that makes the system function. From a hardware point of view, the microprocessor portion of the system is straight forward. The microprocessor needs power, a clock source (crystal Yl, two capacitors and a reSistor), and a reset signal to make it function. As for the AID converter, external references are required to make itfunction. In this case, the power source for the sensor is divided to produce the voltage references for the AID converter. Accurate results will be achieved since the output from the sensor and the AID references are ratiometric to its power supply voltage. The liquid crystal display is driven by Ports A, Band C of the microprocessor. There are enough I/O lines on these ports to provide drive for three full digits, the backplane and two decimal pOints. Software routines provide the AC waveform necessary to drive the display. The analog portion of the system consists of the pressure sensor, a quad operational amplifier and the voltage references for the microprocessor's AID converter and signal conditioning circuitry. Figure 4 shows an interface circuit that will provide a single ended signal with sufficient amplitude to drive the microprocessor's AID input. It uses a quad operational amplifier and several resistors to amplify and level shift the sensor's output. It is necessary to level shift the output from the final amplifier into the AID. Using single power supplied op amps, the VCE saturation of the output from an op amp cannot be guaranteed to pull down to zero volts. The analog design shown here will provide a signal to the AID converter with a span of approximately 4 volts when zero to full-scale pressure is applied to the sensor. The final amplifier's output is level shifted to approximately 0.7 volts. This will provide a signal that will swing between approximately 0.7 volts and 4.7 volts. The offset of 0.7 volts in this implementation does not have to be trimmed to an exact point. The software will sample the voltage applied to the AID converter at initial power up time and call that value "zero". The important thing to remember is that the span of the signal will be approximately 4 volts when zero to full scale pressure is applied to the sensor. The 4 volt swing in signal may vary slightly from sensor to sensor and can also vary due to resistor tolerances in the analog circuitry. Jumpers J4 through J7 may be placed in various configurations to compensate for these variations (see Table 3). 4-77 AN1315 +12V J8 IS INSTALLED FOR THE MPX2010 ONLY +5V 6.98K +8 PD~ 121 R2 +8 R9 340 Rl0 R7 23.7 R8 Figure 4. Analog Interface Referring to Figure 4, most olthe amplification olthe voltage from the pressure sensor is provided by U1A which is configured as a differential amplifier. U1B serves as a unity gain buffer in order to keep any current that flows through R2 (and R3) from being fed back into the sensor's negative output. With zero pressure applied to the sensor, the differential voltage from pin 2 to pin 4 of the sensor is zero or very close to zero volts. The common mode, or the voltage measured between pins 2 or 4 to ground, is equal to approximately one half of the voltage applied to the sensor, or 4 volts. The zero pressure output voltage at pin 7 of U1A will then be4volts because pin 1 of U1B is also at4 volts, creating a zero bias between pins 5 and 6 of U1A. The four volt zero pressure output will then be level shifted to the desired zero pressure offset voltage (approximately 0.7 volts) by U1 C and U1D. To further explain the operation of the level shifting circuitry, refer again to Figure 4. Assuming zero pressure is applied to the sensor and the common mode voltage from the sensor is 4 volts, the voltage applied to pin 12 of U1D will be 4 volts, implying pin 13 will be at 4 volts. The gain of amplifier U 1D will be (R10/(R8+R9» +1 oragain of2. R7will inject a Voffset{0.7 volts) into amplifier U1 D, thus causing the output at U1 D pin 14tobe 7.3= (4 volts @ U1D pin 12 X 2)-0.7 volts. The gain of U1C is also set at 2 «R5/R6)+1). With 4 volts applied to pin 100f U1C, its output at U1C pin 8will be 0.7 = «4 volts @ U1C pin 10 X 2) - 7.3 volts). For this scheme to work properly, amplifiers U1C and U1D must have a gain of2 and the output of U1 D must be shifted down by the Voffset provided by R7. In this system, the 0.7 volts Voffset was arbitrarily picked and could have been any voltage greater than the Vsat of the op amp being used. The system software will take in account any 4-78 variations of Voffset as it assumes no pressure is applied to the sensor at system power up. The gain of the analog circuit is approximately 117. With the values shown in Figure 4, the gain of 117 will provide a span of approximately 4 volts on U1C pin 8 when the pressure sensor and the 8 volt fixed voltage regulator are at their maximum output voltage tolerance. All of the sensors listed in Table 1 with the exception of the MPX2010DP output approximately 33 mV when full scale pressure is applied. When the MPX2010DP sensor is used, its full scale sensor differential output is approximately 20 mV. J8 must be installed to increase the gain of the analog circuit to still provide the 4 volts span out of U1C pin 8 with a 20 mV differential from the sensor. Diode D2 is used to protect the microprocessor's AID input if the output from U1 C exceeds 5.6 volts. R4 is used to provide current limiting into D4 under failure or overvoltage conditions. SOFTWARE The source code, compiled listing, and S-record output for the software used in this system are available on the Motorola Freeware Bulletin Board Service in the MCU directory under the filename DEVB158.ARC. To access the bulletin board, you must have a telephone line, a 300, 1200 or 2400 baud modem and a personal computer. The modem must be compatible with the Bell 212A standard. Call (512) 891-3733 to access the Bulletin Board Service. Figure 5 is a flowchart for the program that controls the system. The software for the system consists of a number of modules. Their functions provide the capability for system calibration as well as displaying the pressure input to the MPX2000 series pressure sensor. Motorola Sensor Device Data AN1315 ( START) ~ INITIALIZE DISPLAY I/O PORTS INITIALIZE TIMER REGISTERS DETERMINE SENSOR TYPE ENABLE INTERRUPTS TIMER INTERRUPT SERVICE TIMER REGISTERS SETUP COUNTER FOR NEXT INTERRUPT SERVICE LIQUID CRYSTAL DISPLAY I L COMPUTE SLOPE CONSTANT L ACCUMULATE 100 AID CONVERSIONS COMPUTE INPUT PRESSURE CONVERT TO DECIMALJSEGMENT DATA PLACE IN RESULT OUTPUT BUFFER I Figure 5. DEVB-158 Software Flowchart The "C" compiler used in this project was provided by BYTE CRAFT LTD. (519) 888-6911. A compiler listing of the program is included at the end of this document. The following is a brief explanation of the routines: delay() digit decimal number in an array called "digit." It then uses the decimal results for each digit as an index into a table that converts the decimal number into a segment pattern for the display. This is then output to the display. Used to provide a software loop delay. read_a2d() Performs 100 reads on the AID converter on multiplexer channel 0 and returns the accumulation. fixcompare() Services the internal timer for 15 ms. timer compare interrupts. TIMERCMP() Alternates the data and backplane inputs to the liquid crystal display. initioO Sets up the microprocessor's 110 ports, timer and enables processor interrupts. adzeroO This routine is called at powerup time. It delays to let the power supply and the transducer stabilize. It then calls "read_atodO" and saves the returned value as the sensors output voltage with zero pressure applied. cvCbin_dec(unsigned long arg) This routine converts the unsigned binary argument passed in "arg" to a five Motorola Sensor Device Data display_psiO This routine is called from "mainO" never to return. The AID converter routine is called, the pressure is calculated based on the type sensor detected and the pressure applied to the sensor is displayed. The loop then repeats. sensor_typeO This routine determines the type of sensor from reading J1 to J3, setting the full scale pressure for that particular sensor in a variable for use by display_psiO. sensor_slopeO This routine determines the slope constant to be used by display_psiO for engineering units output. mainO This is the main routine called from reset. It calls "initioO" to setup the system's 110. "display_psiO" is called to compute and display the pressure applied to the sensor. 4-79 AN1315 6805 'e' COMPILER V3.48 PAGE 16-0ct-1991 #pragma option fO i '* THE FOLLOWING BOARD. I CI SOURCE CODE IS WRITTEN FOR THE DEVB158 EVALUATION IT WAS COMPILED WITH A COMPILER COURTESY OF: BYTE CRAFT LTD. 421 KING ST. ONTARIO WATERLOO, CANADA N2J 4E4 (519)888-6911 SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER COMPILERS. BILL LUCAS 2/5/92 SPS MOTOROLA, Revision history rev. 1.0 initial release 3/19/92 rev. 1.1 added additional decimal digit to the MPX2010 sensor. Originally resolved the output to .1 PSI. Modified cvt_hin_dec to output PSI resolved to .01 PSI. WLL 9/25/92 *, 0800 1700 0050 0096 IFFE IFFC IFFA IFFB IFF6 IFF4 IFF2 #pragma memory ROMPROG [5888] @ OxOeOD #pragma memory RAMPAGED [150] @ OxOOSO /* #pragma #pragma #pragma #pragma #pragma #pragma #pragma Vector assignments */ vector _RESET @ Oxlffe vector _SWI @ Oxlffc vector IRQ @ Oxlffa vector TlMERCAP @ OxlffB vector TlMERCMP @ Oxlff6 vector TIMEROV @ Oxlff4 vector SCI @ Oxlff2 #pragma has STOP ; #pragma has WAIT ; #pragma has MUL ; /* 0000 0001 0002 0003 0004 0005 0006 0007 0008 0009 OOOA OOOB OOOC OOOD OOOE OOOF 0010 0011 0012 0013 0014 0015 0016 0017 0018 0019 OOlA OOlB OOlC OOlD OOlE OOlF 4-80 #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragrna #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma #pragma Register assignments for the 68HC70SBS microcontroller */ portrw porta @ OxOD; /* */ portrw portb @ OxOl; /* */ portrw portc @ Ox02 i /* */ portrw portd @ Ox03; /* in ,SS ,SCK ,MOSI ,MISO,TxD,RxD */ portrw ddra @ Ox04; /* Data direction, Port A */ portrw ddrb @ OxOS; /* Data direction, Port B */ portrw ddrc @ OX06i /* Data direction, Port C (all output) */ portrw eeclk @ Ox07; /* eeprom/eclk cntl * / portrw addata @ OxOB; /* a/d data register */ portrw ads tat @ Ox09; /* aid stat/control */ portrw pIma @ OxOa; /* pulse length modulation a * / portrw plmb @ OxOb; /* pulse length modulation b * / portrw misc @ OxOc; /* miscellaneous register portrw scibaud @ OxOd; /* sci baud rate register portrw scicntll @ OxOe; /* sci control 1 portrw scicntl2 @ OxOf; /* sci control 2 portrw seistat @ OxIO; /* sci status reg portrw scidata @ Ox1l; /* SCI Data * / @ Oxl2, /* ICIE,QCIE,TOIE,O,O,O,IEGE,OLVL portrw tcr @ Oxl3; portrw tar /* ICF,OCF,TOF,O, 0, 0, 0, 0 @ Oxl4; /* Input Capture Reg (Hi-Ox14, Lo-OxlS) portrw icaphil @ OxlS; *, portrw icaplol /* Input Capture Reg (Hi-Ox14, Lo-OxlS) @ Ox16; /* Output Compare Reg (Hi-Ox16, Lo-Oxl7) portrw ocmphil @ Ox17; /* Output Compare Reg (Hi-Oxl6, Lo-Ox17) portrw oemplol @ Oxl8, portrw tenthi /* Timer Count Reg (Hi-Oxl8, Lo-Ox19) @ Oxl9; portrw tcntlo /* Timer Count Reg (Hi-OxI8, Lo-Oxl9) @ OxlA; /* Alternate Caunt Reg (Hi-$lA, La-$lB) portrw aregnthi @ OxlB; portrw aregntlo /* Alternate Count Reg (Hi-$lA, La-$lB) @ OxIc; /* Input Capture Reg (Hi-Oxlc, La-Oxld) portrw icaphi2 @ Oxld; /* Input Capture Reg (Hi-Oxlc, Lo-Dxld) portrw icaplo2 @ axle; /* OUtput Compare Reg (Hi-Oxle, La-Oxlf) portrw ocmphi2 @ Oxlf; portrw ocmplo2 /* Output Compare Reg (Hi-axle, Lo-Oxlf) *' *' **', *, *, *, *' *' *'*, **', *' *,*' *' *' Motorola Sensor Device Data AN1315 #pragma mer lBFB 74 @ Ox74; /* this disables the watchdog counter and does not add pull-down resistors on ports Band C ... I Oxlefe 1* put constants and variables here .. . they must be global *1 1* '* ••• * ••• ****** '* •• 0800 FC 30 DA 7A 3668 E6 38 FE 0809 3E 'It. ** ... **** **** ****** ** ."'.* ..... ****************** ••••••• ****, const char lcdtab[]={Oxfc,Ox30,Oxda,Ox7a,Ox36,Ox6e,Oxe6,Qx38,Ox£e,Ox3e }; '* led pattern table ., 1 0 DaDA 27 10 03 E8 00 64 00 OA const long dectable [] = 10000, 1000, 100, 10 }; 0050 0005 unsigned int digit[5]; /* buffer to hold results from evt_bin_dec function *1 0812 00 96 00 4B 00 96 DOlE 00 081B 67 const long type [] = { 150, 75. 150. 30. 103 ), 1* MPX2010 MPX20S0 MPX2100 MPX2200 MPX2700 The table above will cause the final results of the pressure to engineering units to display the 1.5, 7.3 and 15.0 devices with a decimal place in the tens position. The 30 and 103 psi devices will display in integer units . ., D81C 0825 082E 0837 01 BO 01 DD C2 01 CB 01 01 B4 01 El A2 01 CF 01 01 A7 01 AB 01 B9 01 BD 01 C6 01 D4 01 D8 01 C2 canst long slope_const [] = { 450,418,423,427,432,436,441,445,454,459, 463,468,472,477,481,450 }; 0000 registera areg; I * processor's A register * I 0055 long atodternp; 1* temp to accumulate 100 aid readings for smoothing *1 0059 long slope; /* multiplier for adc to engineering units conversion * I 005B int adcnt; /* aid converter loop counter *1 005C long xdcr_offset; 1* initial xdcr offset */ 005E 0060 long sensor_model; 1* int sensor_index; I* 0061 0063 unsigned long i, j; / * counter for loops * I 0065 unsigned int k; installed sensor based on J1. .J3 */ determine the location of the decimal pt. *I 1* misc variable *1 struct bothbytes { int hi; int 10; ), union isboth long 1; struct bothbytes b; ); 0066 0002 union ishoth q; 1* used for timer set-up * I '* * * *.,. * * * *.,..,. * *." *. * * * *.".,..,..,. * * * * * * *.,. *. * * *." * * *.,. * *." *.,. * * * * * ** ...... *.* * * * ......... * * ...... * * * * * * , /* variables for add32 0068 0004 006C 0004 0070 0004 unsigned long SUM [2] ; unsigned long ADDEND [2] ; unsigned long AUGEND (2] ; 0074 0004 0078 0004 007C 0004 1* variables unsigned long unsigned long unsigned long for sub32 MINUE [2]; SUBTRA [2] ; DIFF[2}; 0080 0004 0084 0004 0088 0004 1* variables unsigned long unsigned long unsigned long for mu132 MULTP [2]; MTEMP [2]; MULCAN[2]; Motorola Sensor Device Data .,,. " .,",. ,. ,. ., ,.,." result one input second input minuend subtrahend difference .,., ., .,., ., ., multiplier high order 4 bytes at return *1 mul tiplicand at input, low 4 bytes at return ... , 4-81 AN1315 /* variables for div32 unsigned long DVDND [2] ; unsigned long DVSOR [2] ; unsigned long QUO [2] ; unsigned int CNT; Dose 0004 0090 0004 0094 0004 0098 ,",""' ,"," Dividend Divisor Quotient Loop counter "' "'"'*' I'" The code starts here ." I I"'''''''''''''''''''''''''''''''''''''''' ** *."."."."."."."."."."."."."."."",."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."."." **." I void add32 ( ) { #asm ." Add two 32-bit values. Inputs: ADDEND: ADDEND [0 •• 3] AUGEND: AUGEND [0 • • 3] Output: SUM: 083C 86 6F 083E BB 73 0840 B7 6B 0842 0844 0846 0848 SON[O .. 3] LOA ADDEND+3 ADO STA AUGEND+3 HIGH ORDER BYTE IS ADDEND+O HIGH ORDER BYTE IS AUGEND+O HIGH ORDER BYTE IS STIM+O low byte SUM+3 86 6E LOA ADDEND+2 B9 72 B7 6A ADC AUGEND+2 STA St1M+2 B6 60 LOA 084A B9 71 ADC ADDEND+l AUGEND+l 084.C B7 69 084E B6 6C STA LDA ADDEND 0850 B9 70 ADC AUGEND 0852 B7 68 STA SUM 0854 81 RTS medium low byte medium high byte SUM+l high byte done #endasm 0855 81 RTS void sub32 ( ) { #asm ." Subtract two 32-bit values. Input: Minuend: MINUE [0 .. 3] Subtrahend: SUBTRA [0 •• 3] Output: Difference: DIFF[l. .0] *----------------------------------------------------------------------------* * Multiply 32-bit value by a 32-bit value Input: 4-82 Motorola Sensor Device Data AN1315 Multiplier: MULTP[O .. 3] Multiplicand: MULCAN[O .. 3] Output: Product: MTEMP[O •• 3] AND MULCAN[O •• 3] MTEMP[O] IS THE HIGH ORDER BYTE AND MULCAN[3] IS THE LOW ORDER BYTE THIS ROUTINE DOES NOT USE THE MOL INSTRUCTION FOR THE SAKE OF USERS NOT USING THE HC (7 ) 05 SERIES PROCESSORS. 0870 0872 0874 0876 0878 087A 087C 087E 0880 0882 0884 0886 0888 088A 088C OSSE 0890 0892 0894 0896 0898 OB9A 089C 089E 08AO 08A2 08M 08A6 08A8 08AA 08AC 08AD 08AF AE 3F 3F 3F 3F 36 36 36 36 24 B6 BB B7 B6 B9 B7 B6 B9 B7 B6 B9 B7 36 36 36 36 36 36 36 36 SA 26 81 20 84 85 86 87 88 89 8A 8B 18 87 83 87 86 82 86 85 81 85 84 80 84 84 85 86 87 88 89 8A 8B MNEXT ROTATE D3 LDX CLR CLR CLR CLR ROR ROR ROR ROR BCC LDA ADD STA LDA ADC STA LDA ADC STA LDA ADC STA ROR ROR ROR ROR ROR ROR ROR ROR DEX BNE loop counter clean-up for result #32 MTEMP MTEMP+l. MTEMP+2 MTEMP+3 low but to carry, the rest one to the right MULCAN MULCAN+l. MULCAN+2 MOLCAN+3 i f carry is set, do the add ROTATE MTEMP+3 MULTP+3 MTEMP+3 MTEMP+2 MULTP+2 MTEMP+2 MTEMP+l MULTP+l. MTEMP+l. MTEMP MULTP MTBMP else: shift low bit to carry, the rest to the right MTEMP MTEMP+l MTEMP+2 MTBMP+3 MULCAN MULCAN+l. MULCAN+2 MULCAN+3 bump the counter down MNEXT RTS done yet done #endasm 08BO 81 RTS void div32 () ( #asM * Divide 32 bit by 32 bit unsigned integer routine Input: Dividend: Divisor; OUtput: Quotient: DVDND [+0 .. +3] HIGH ORDER BYTE IS DVND+O DVSOR [+0 .. +3] HIGH ORDER BYTE IS DVSOR+O QUO [+0 •• +3] HIGH ORDER BYTE IS QUO+O *----------------------------------------------------------------------------* 08B1 08B3 08B5 08B7 08B9 08BB 08BD 3F 3F 3F 3F A6 3D 2B 94 95 96 97 01 90 OF 08BF 08CO 08C2 08C4 08C6 08C8 4C 38 39 39 39 2B 93 92 91 90 04 CLR CLR CLR CLR LDA TST BMI QUOzero result registers QUO+1 QUO+2 QUO+3 #1 initial loop count DVSOR if the high order bit is set .• no need to shift DVSOR DIV153 DIV151 INCA bump the loop counter ASL DVSOR+3 now shift the divisor until the high order bit = 1 ROL DVSOR+2 ROL DVSOR+l ROL DVSOR BMI DIV153 done if high order bit Motorola Sensor Device Data 4-83 AN1315 oeCA Ai 21 08CC 26 F1 CMP BNE #33 OIV151 have we shifted all possible bits in the DVSOR yet ? no 08CE B7 98 DIViS3 STA CNT save the loop counter so we can do the divide 0800 0802 08D4 0806 0808 OIV163 LOA SUB STA LOA SBC STA LOA SBC STA LOA SBC STA BCC DVDND+3 DVSCR+3 sub 32 bit divisor from dividend 8F 93 8F 8E 92 8E 80 91 80 DaFe B6 8C oaFE B9 90 0900 B7 8C 0902 98 LOA ADD STA LOA ADC STA LOA ADC STA LOA ADC STA CLC DVDND+3 DVSOR+3 0903 0905 0906 0908 BRA SEC ROL ROL ROL ROL LSR ROR ROR ROR DEC BNE DIV16' B6 BO B7 B6 B2 DBDA B7 080e 080E 08EO 08E2 0884 08E6 08E8 B6 B2 B7 B6 B2 B7 24 08BA 08EC 08EE 08FO 08F2 08F4 08F6 08F8 OBFA B6 BB B7 B6 B9 B7 B6 B9 B7 8F 93 8F 8E 92 8E 80 91 80 8C 90 8C 1B DVDND+3 DVDND+2 DVSOR+2 DVDND+2 DVDND+l. DVSOR+l DVDND+l. DVDND DVSOR DVDND DIV165 carry is clear if DVSOR was larger than DVDND add the divisor back ... was larger than the dividend DVDND+3 DVDND+2 DVSOR+2 DVDND+2 DVDND+l. DVSOR+l DVDND+l DVDND DVSOR DVOND this will clear the respective bit in QUO due to the Deed to add DVSOR back to DVND 090A ogoe 090E 0910 0912 0914 0916 0918 091A 20 99 39 39 39 39 34 36 36 36 3A 26 81 01 DIV165 DIV167 97 96 95 94 90 91 92 93 98 B6 QUO+3 this will set the respective bit in QUO set or clear the low order bit in QUO based on above OUO+2 OUO+1 OUO nVSOR divide the divisor by 2 DVSOR+l DVSOR+2 DVSORtl CNT DIV163 bump the loop counter down finished yet ? RTSyes :JI:endasm 091B 81 RTS 1 * •• * * * ••• * '*. * '* '* * *. '* '* * '* '* '*. * •• '*. *. '* '*. '* '* '* '* * '* '* •• '* '* '* '* ••• '*. '* '* '*. '*. *'*. '* * *. '* *. * * * * * * 1 1* These interrupts are not used ... give them a graceful return if for Borne reason one occurs '* 1 1FFC 091C 1FFA 091D lFF8 091E 1FF4 091F lFF2 0920 09 80 09 80 09 80 09 80 09 80 1C RTI 10 IRO() {} RTI 1E TIMERCAP ( ) { } RTI 1F TlMEROV () {} RTI 20 SCI () {} RTI 1'* '* '* '*. * '* * * '* '* '* '* '* '* '* * '* '** '* '* '* '* '* '* '* * * * '* '* '* '* '* •• '* '* * '* * * * '* '* '* *'*. '*.* * '* ••••• ** •• '* '*' '* * *. * '*. * * 1 void sensor_type ( ) { 0921 0923 0925 0927 0929 092B B6 A4 B7 34 B6 A1 4-84 03 OE 65 65 65 04 LOA AND STA LSR LOA CMP $03 #$OE $65 $65 $65 #$04 k = portd & OxOe; k = k » 1; if ( k > 4 1* we only care about bits 1..3 *1 1* right justify the variable • I Motorola Sensor Device Data AN1315 0920 23 OC BLS $093B 092F 0931 0933 0935 0937 0939 3F A6 B7 A6 B7 20 02 6E 01 CE 00 FE CLR LOA STA LOA STA BRA $02 #$6E $01 #$CE $00 $0939 093B 0930 093F 0940 0941 0944 0946 0949 094B B6 B7 97 58 D6 B7 06 B7 81 65 60 LOA STA $65 $60 { 1* we have a set-up error in wire jumpers Jl - J3 */ porte = 0; 1* *1 porth = Ox6e; 1* S '* I = porta Qxce; /* E '*1 while(l) ; } sensor_model TAX 08 12 5E 08 13 SF LSLX LDA STA LDA STA RTS sensor_index = k; type [k] ; $08l2,X $5E $OBl.3,X $5F /.* •••••• ** *** .**.* •• ******** '* ****** ***** ******** ********* **** **** ********** I void sensor_slope ( ) LDA AND STA LSR LSR LSR LSR $03 #$FO $65 $65 $65 $65 $65 k=portd & OxfO; 095A BE 65 LDX $65 slope 095C 0950 0960 0962 0965 0967 LSLX LOA STA LOA STA RTS 094C 094E 0950 0952 0954 0956 0958 B6 A4 B7 34 34 34 34 58 06 B7 06 B7 81 03 FO 65 65 65 65 65 08 1C 59 08 10 SA k» k 4; 1* we only care about bits 4 .. 7 */ 1* right justify the variable *1 slope_ccnst [k] i $081C,X $59 $081D,X $5A 1'* '* '* '* '* * '* '* '* '* '* '* '* * * '* '* '* ** * '* '* '* '* '* '* '* '* * '* * '* '* ** '* '* '* '* '* '* '* '* '* '* '* '* '* * '* * '* '* '* ** '* '* ** '* '* ** '* '* * '* '* '* '* '* '* * I void delay(void) /* just hang around for a while */ ( 0968 096A 096C 096E 0970 0972 0974 0976 0978 097A 097C 097E 3F 3F B6 AD B6 A2 24 3C 26 3C 20 81 62 61 62 20 61 4E 08 62 02 61 EE CLR CLR LDA SUB LDA SBC BCC INC BNE INC BRA $62 $61 $62 #$20 $61 #$4E $097E $62 $097C $61 $096C for (i=O; i<20000; ++1); RTS 1* * ** '* * '* * '* '* * * '* '* '* * '* '* '* * * * * '* '* '* '* '* * * '* '*."." ** *." '* '* '*."." *." * * ** '* '* '*." * *."." * * '*." * * '*."."." * *." * * * *." / rea(La2d{void) ( /* read the aId converter on channel 5 and accumulate the result in atodtemp */ 097F 0981 0983 0985 0987 0989 098B 3F 3F 3F B6 A8 A1 24 56 55 58 5B 80 E4 21 0980 098F 0991 0994 0996 0998 A6 B7 OF B6 3F B7 20 09 09 FO 08 57 58 CLR CLR CLR LDA EOR CMP BCC $56 $55 $5B $5B #$80 #$E4 $09AE LOA #$20 STA $09 BRCLR 7, $09, $0991 LOA $08 CLR $57 STA $58 Motorola Sensor Device Data atodtemp=O; /* zero for accumulation ." / for ( adcnt = 0 ; adcnt = dectable [1] ) LSLX 08 OB 9E 58 90 80 57 08 OA 80 57 LOA SUB STA LOA EOR STA LOA EOR SBC $080B,X $9E $58 $90 #$80 $57 $080A,X #$80 $57 Motorola Sensor Device Data 4-87 AN1315 OA70 SA 58 OA72 22 5C ORA BHI $58 $OADO OA74 BE 9F LOX $9F OA76 58 OA77 06 08 OA7A B7 AO OA7C D6 08 OA7F B7 Al OA81 B6 9E DAB3 B7 58 OAB5 B6 90 OA87 B7 57 OA89 B6 AO DABB B7 9A OA80 B6 Al OA8F B7 9B OA91 CO DB OA94 CO OC 0A97 BF 57 0A99 B7 58 OA9B BE 9F OA9D E7 50 OA9F BE 9F OAAI E6 50 OAA3 3F 57 OAA5 B7 58 OAA7 B6 AO OAA9 B7 9A OAAB B6 Al DAM B7 9B OAAF CD OB OAB2 BF 57 OAB4 B7 58 OAB6 33 57 DABS 30 58 OABA 26 02 OABC 3C 57 OABB 86 58 DACO BB 9E OAe2 B7 58 OAC' B6 57 OAC6 B9 90 OAC8 B7 57 OACA B7 90 DAce 86 58 OACE B7 9E LSLX OADO OAD2 OAD4 OAD6 LDA STA LDA STA LOA STA LOA STA LOA STA LOA STA JSR JSR STX STA LOX STA LOX LDA CLR STA LOA STA LOA STA JSR STX STA COM NEG INC LDA ADO STA LOA ADC STA STA LOA STA $080A,X $AO $080B,X $Al $9E $58 $90 $57 $AO $9A $Al $9B $OBFl $OC22 $57 $58 $9F $50,X $9F $50,X $57 $58 $AO $9A $Al $9B $OB02 $57 $58 $57 $58 $OABE $57 $58 $9E $58 $57 $90 $57 $90 $58 $9E 9F 80 9E 58 90 57 9F 58 50 INC BRA LOA STA LOA STA LOX LDA STA $9F $OA54 $9E $58 $90 $57 $9F $58 $50,X 9B 3052 26 04 3F 02 20 07 BB 52 D6 08 00 B7 02 30 52 26 08 30 53 26 04 3F 01 20 07 BE 53 06 08 00 SEI TST BNE CLR BRA LOX LDA STA TST BNE TST BNE CLR BRA LOX LOA 3C 20 B6 B7 DADS 86 OADA B7 DADe BE DADE 86 OAEO E7 OA OB Fi 22 02 BNE dectable [i] , digit [i] arg digit[i] arg I 1; arg- (digit [1] " 1); argl 1* now zero suppress and send the led pattern to the display OAE2 OAE3 OAE5 OAE7 OAE9 CABB DAED OAFO OAF2 OAF4 OAF6 OAF8 OAFA OAFe OAFE OBOO 4-88 $52 $OAEB $02 $OAF2 $52 $OBOO,X $02 $52 $OAFE $53 $OAFE $01 $OB05 $53 $0800,X SEI; if ( digit [2] == 0 ) /* leading zero suppression "1 porte :c 0; else porte = ( lcdtab[digit [2]] ), i f ( digit [2] *I o && digit [3] '* 100's digit *1 o ) portb=O; else porth ( lcdtab[digit[3]] ); '* 10's digit *' Motorola Sensor Device Data AN1315 OB03 B7 01 OB05 BE 54 STA LDX $01 $54 OB07 D6 08 00 LDA $0800,X OBOA B7 00 STA $00 OBOC B6 60 $60 OBOE AB BO LDA EOR OB10 A1 83 CMP porta (lcdtab[digit[4]l); /* 1.'s digit *1 1* place the decimal point only if the sensor is 15 psi or 7.5 psi * / OB12 24 DB OB14 BE 54 BCC LDX $OB1C $54 OB16 D6 08 00 OB19 4C LDA INCA $0800,X OB1A B7 00 OB1C 3D 60 OB1E 26 OF STA TST $00 $60 BNE $OB2F OB20 OB22 OB25 OB27 OB29 OB2C LDX LDA STA LDX LDA INCA $54 $01 BE D6 B7 BE D6 4C 54 DB 00 00 53 DB 00 OE2D E7 01 STA OB2F 9A CLI OB30 CD 09 6B OB33 B1. JSR RTS if ( sensor_index < 3 ) #$80 #$83 ( lcdtab[digit[4]]+1 ); 1* add the decimal point to the lsd *1 porta if (sensor_index ==0) 1* special case *1 porta (lcdtab[digit[4]]); 1* get rid of the decimal at lsd *1 portb (lcdtab[digit[3]1+1); /* decimal point at middle digit *1 $0800,X $00 $53 $0800, X CLI; delay ( ); $0968 /******* *** * ************** * **** * ***** * ***** *** **************** *** / void display--psi (void) /* At power-up it is assumed that the pressure or vacuum port of the sensor is open to atmosphere. The code in initio() delays for the sensor and power supply to stabilize. One hundred AID conversions are averaged. That result is called xdcr_offset. This routine calls the A/D routine which performs one hundred conversions, divides the result by 100 and returns the value. If the value returned is less than or equal to the xdcr_offset, the value of xdcr_offset is substituted. If the value returned is greater than xdcr_offset, xdcr_offset is subtracted from the returned value. */ while(l) { OB34 CD 09 7F OB37 3F 55 OB39 B7 56 OB3B BO 5D OB3D B7 58 OB3F OB41 OB43 OB45 OB47 OB49 B6 5C AB 80 JSR CLR STA SUB STA LDA B7 57 B6 55 A8 80 EOR STA LDA EOR B2 57 SBC OB4B BA 58 OB4D 22 08 OB4F B6 5C OB51 B7 55 BHI LDA STA ORA $097F $55 $56 $5D $58 $OB57 $5C $55 $5D $56 LDA STA LDA SUB $56 STA LDA SBC STA JSR LDA STA $56 $55 B6 55 B2 5C B7 OB63 CD OB66 B6 OB6B B7 55 09 4C 56 58 OB6A B6 55 OB6C B7 57 OB6E B6 5E LDA STA LDA 1* atodtemp raw aid ( O.. 255 ) *1 if ( atodtemp <= xdcr_offset #$80 $57 $58 OB53 B6 5D OB55 B7 56 BO 5D B7 56 read_a2dO; $5C #$80 $57 $55 DB 57 B6 56 OB59 OB5B OB5D OBSP OB61 atodtemp atodtemp atodtemp xdcr_offset; xdcr_offset; 1* remove the offset *1 $5D $5C $55 $094C $56 $58 $55 sensor_slope (); /* establish the slope constant for this output *1 atodtemp *= sensor_model; $57 $5E Motorola Sensor Device Data 4-89 AN1315 OB70 B7 9A STA $9A 0872 B6 SF LDA $5F OB74 B7 9B STA $9B OB76 CD DB D2 JSR $OBD2 OB79 BF 55 STX $55 OB78 B7 56 STA $56 OB7D 3F 89 OB7F 3F 88 CLR CLR $89 $88 OB81 3F 81 OB83 3F 80 OB85 9F 0886 B7 82 OB88 B6 56 OBSA B7 83 CLR $81 CLR $80 OB8C B6 59 OBBE B7 8A 0890 B6 SA LDA $5A OB92 B7 8B STA $8B OB94 CD 08 70 JSR $0870 3F 90 CLR $90 A6 01 LDA #$01 OB97 0899 0898 OB9D OS9F OBAI OBA3 OBA5 STA $82 LDA $56 STA $83 LDA STA $59 $8A STA $91 A6 86 B7 92 LDA STA #$86 $92 A6 AD B7 93 LDA #$AO STA $93 B6 88 LDA $88 OBA7 B7 8C STA $8C OBA9 B6 89 LDA $89 aBAS B7 8D STA $8D aBAn aBAF OBB1 OBB3 86 8A B7 8E LDA $8A STA $8E B6 8B LDA $8B STA $8F OBB5 CD 08 Bl JSR $08B1 OSB8 B6 96 LDA $96 aBBA B7 55 STA $55 asse B6 97 LDA $97 OBBE B7 56 STA $56 OBCO BE 55 LDX $55 OBC2 CD OA 3F JSR $OA3F ODeS CC DB 34 JMP $OB34 osce RTS 81 MlJLCAN[O] MlJLTP[l] TXA B7 91 B7 8F MULTP[O] 0; atodtemp; slope; MULCAN[l] mu132 (); DVSOR[O] ,. 1* analog value * slope based on Jl through J3 * I now divide by 100000 '* I = 1; DVSOR[l] DVDND[O] Ox86aO; = MULCAN[O]; DVDND[l] MlJLCAN [1] ; div32 (); atodtemp = QUO[l]; 1* convert to psi *1 cvt_bin_dec ( atodtemp ); 1* convert to decimal and display '* / / * * .. * '* '* '* * '* '* * * * .. * * '* ** * '* * '* * '* * '* * * * * '* * '* * '* * * ... * '* * '* ... ** * '* * '* * * * * '* * '* ... ** * * ... '* '* * * '* * '* ** '* * * I void maine) ( OSCg CD OA DC osee CD DB 34 JSR $OAOC JSR $OB34 OBCF 20 FE BRA $OBCF OBD1 81 RTS OBD2 BE 58 LDX $58 ODD4 B6 9B LDA $9B OBD6 42 MOL OBD7 B7 A4 STA $A4 OBD9 SF AS STX $A5 oans BE 57 LDX $57 DaDO B6 9B LDA $9B DSDP 42 MlJL OSEO BB AS ADD $A5 OBE2 B7 AS STA $A5 OBE4 BE 58 LDX $58 OBE6 B6 9A LDA $9A OBE8 42 OBE9 BB AS OBEB B7 AS MUL OBED 97 OBEE B6 A4 OBFO 81 TAX LDA OBF1 3F A4 CLR OBF3 SF OBF4 3F A2 OBF6 3F A3 CLRX OBF8 5C OBF9 38 58 4-90 ADD $A5 STA $A5 initio() ; /* set-up the processor's i/o *1 display--psi ( ) ; while(1) ; 1* should never get back to here ., $A4 RTS $A4 CLR $A2 CLR $A3 INCX LSL $58 Motorola Sensor Device Data AN1315 ROL ROL ROL LOA SUB $57 $A2 $A3 $A2 $9B oeos B7 A2 STA $A2 oe07 B6 A3 LDA $A3 oe09 B2 9A SBC $9A OBFB 39 57 OBFD 39 A2 OBFF 39 A3 oe01 B6 A2 oe03 BO 9B oeOB B7 A3 STA $A3 oeOD 24 OD BCC LOA ADO $OC1C $9B $A2 oeOF B6 9B Dell BB A2 STA $A2 oe1S B6 9A LDA $9A OC1? B9 A3 oe13 B7 A2 ADC $A3 OC19 B7 A3 STA $A3 oelB 99 SEC OC1C 59 ROLX OC1D 39 A4 ROL $A4 OC1F 24 DB Bee $OBF9 OC21 B1 RTS OC22 53 COMX aC23 9F TXA OC26 53 LOX COMX OC27 B1 RTS oe24 BE A4 $A4 1FFE OB C9 SYMBOL TABLE LABEL VALUE LABEL VALUE LABEL VALUE LABEL VALUE ADDEND 00 6C AUGEND 0070 CNT 0098 DIFF 007C DIVl5l OBBF DIVlS3 OBCE DIV163 OBnO DIV165 0905 DIVl67 0906 DVDND OOBC nVSOR 0090 IRQ 091D MINUE 0074 MNEXT OBB2 MTEMP 00B4 MOLCAN OOBB MOLTP OOBO QUO 0094 ROTATE OB9C SCI 0920 SUBTRA TIMEROV 007B 091F SUM _LDIV 006B OBF1 TIMERCAP _LongIX 091E 009A TlMERCMP _MAIN 09E2 OBC9 _MOL 0000 _MOL16x16 OBD2 _RDIV OC22 _RESET 1FFE _STARTUP 0000 _STOP 0000 _SWI 09lC _WAIT 0000 _longAC 0057 adent OOSB add32 OB3C addata ads tat 0009 adzero 09EB aregnthi 001A aregntlo 001B arg 009D atodtemp 0055 b 0000 bothbytes 0002 OOOB evt_hin_dee OA3F ddra 0004 ddrb 0005 ddre 0006 dec table OBOA delay 096B digit 0050 display---psi OB34 div32 OBB1 eeclk 0007 fixeompare 09C7 hi 0061 ieaphil 0014 ieaphi2 001C ieaplo1 ieapl02 001D initio DADe isboth 0002 k 0065 main OBC9 oemphi2 DOlE plmb portd OOOB 0003 scientl1 OOOE sensor_index 0060 0000 0015 0063 0000 ledtab mise OOOC mul32 OBOO OB70 oemplol 0017 oemplo2 OOlF plma porta 0000 portb read_a2d 0001 097F porte 0002 seibaud DODD seient12 OOOF sensor_model OOSE scidata 0011 scistat 0010 sensor_slope 094C sensor_type 0921 I q 0066 10 oemphi1 0001 0016 OOOA slope 0059 slope_const OB1C sub32 OB56 tenthi 0018 tentlo 0019 tcr 0012 tar 0013 type OB12 xdcr_offset Dose MEMORY USAGE MAP ('X' = Used, '-' = Unused) 080 0 XXXXXXXXXXXXXXxx xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 084 a XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXxxxxx XXXXXXXXXXXXXXXX 08 B 0 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXxxxxxxxxxxxxx XXXXXXXXXXXXXXXX OBCO XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 0900 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 094 a XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX 09 B 0 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 09CO XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX OAOO xxxXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX OA40 xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX DAB a XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX OACO XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX Motorola Sensor Device Data 4-91 AN1315 OBO 0 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX OB40 XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX DBS 0 aBeD XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx DC 0 0 XXXXXXXXXXXXXXXX OC40 ---------------- ---------------- ---------------- ---------------- DeBO ---------------- ---------------- ---------------- ---------------- xxxxxxxxxxxxxxxx xxxxxxxx --- ----- -- ---- - - -------- DCCO ---------------- ---------------- ---------------- ---------------- lEOD lE40 lEBO lECO ------------------------------------------------------------- lFOO lF40 ---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- ---------------- lFBO lFCO ---------------- ---------------- ---------------- ------------------------------- ---------------- ---------------- --xxxxxxxxxxxxxx ------------------------------------------------------------- ---------------- ------------------------------- ------------------------------- ------------------------------- --------------x- All other memory blocks unused. Errors Warnings 4-92 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1316 Frequency Output Conversion for MPX2000 Series Pressure Sensors Prepared by: Jeff Baum Discrete Applications Engineering INTRODUCTION Typically, a semiconductor pressure transducer converts applied pressure to a "low-level" voltage signal. Current technology enables this sensor output to be temperature compensated and amplified to higher voltage levels on a single silicon integrated circuit (IC). While on-chip temperature compensation and signal conditioning certainly provide a significant amount of added value to the basic sensing device, one must also consider how this final output will be used and/or interfaced for further processing. In most sensing systems, the sensor signal will be input to additional analog circuitry, control logic, or a microcontroller unit (MCU). MCU--based systems have become extremely cost effective. The level of intelligence which can be obtained for only a couple of dollars, or less, has made relatively simple a-bit microcontrollers the partner of choice for semiconductor pressure transducers. In order for the sensor to communicate its pressure--dependent voltage signal to the microprocessor, the MCU must have an analog-to-digital converter (AID) as an on-chip resource or an additionallC packaged AID. In the latter case, the AID must have a communications interface that is compatible with one of the MCU's communications protocols. MCU's are adept at detecting logic-level transitions that occur at input pins designated for screening such events. As an alternative to the conventional AID sensor/MCU interface, one can measure either a period (frequency) or pulse width of an incoming square or rectangular wave signal. Common MCU timer subsystem clock frequencies permit temporal measurements with resolution of hundreds of nanoseconds. Thus, one is capable of accurately measuring the the frequency output of a device that IS interfaced to such a timer channel. If sensors can provide a frequency modulated signal that is linearly proportional to the applied pressure being measured, then an accurate, inexpensive (no AID) MCU-based sensor system is a viable solution to many challenging sensing applications. Besides the inherent cost savings of such a system, this design concept offers additional benefits to remote sensing applications and sensing in electrically noisy environments. Figure 1. DEVB160 Frequency Output Sensor EVB Motorola Sensor Device Data 4-93 AN1316 The following sections will detail the design issues involved in such a system architecture, and will provide an example circuit which has been developed as an evaluation tool for frequency output pressure sensor applications. DESIGN CONSIDERATIONS Signal Conditioning Motorola's MPX2000 Series sensors are temperature compensated and calibrated - i.e. - offset and full-scale span are precision trimmed - pressure transducers. These sensors are available in full-scale pressure ranges from 10 kPa (1.5 psi) to 700 kPa (100 psi). Although the specifications in the data sheets apply only to a 10 V supply voltage, the output of these devices is ratiometric with the supply voltage. At the absolute maximum supply voltage specified, 16 V, the sensor will produce a differential output voltage of 64 mV at the rated full-scale pressure of the given sensor. One exception to this is that the full-scale span of the MPX201 0 (1 0 kPa sensor) will be only 40 mV due to a slightly lower sensitivity. Since the maximum supply voltage produces the most output voltage, it is evident that even the best case scenario will require some signal conditioning to obtain a usable voltage level. Many different "instrumentation-type" amplifier circuits can satisfy the signal conditioning needs of these devices. Depending on the precision and temperature performance demanded by a given application, one can design an amplifier circuit using a wide variety of operational amplifier (op amp) IC packages with external resistors of various tolerances, or a precision-trimmed integrated instrumentation amplifier IC. In any case, the usual goal is to have a single-ended supply, "rail-to-rail" output (i.e. use as much of the range from ground to the supply voltage as possible, without saturating the op amps). In addition, one may need the flexibility of performing zero-pressure offset adjust and full-scale pressure calibration. The Circuitry or device used to accomplish the voltage-to-frequency conversion will determine if, how, and where calibration adjustments are needed. See Evaluation Board Circuit Description section for details. Voltage-to-Frequency Conversion Since most semiconductor pressure sensors provide a voltage output, one must have a means of converting this voltage signal to a frequency that is proportional to the sensor output voltage. Assuming the analog voltage output of the sensor is proportional to the applied pressure, the resultant 4-94 frequency will be linearly related to the pressure being measured. There are many different timing circuits that can perform voltage-to-frequency conversion. Most of the "Simple" (relatively low number of components) circuits do not provide the accuracy or the stability needed for reliably encoding a signal quantity. Fortunately, many voltage-to-frequency (V/F) converter IC's are commercially available that will satisfy this function. Switching Time Reduction One limitation of some VlF converters is the less than adequate switching transition times that effect the pulse or square-wave frequency signal. The required switching speed will be determined by the hardware used to detect the switching edges. The Motorola family of microcontrollers have input-capture functions that employ "Schmitt trigger-like" inputs with hysteresis on the dedicated input pins. In this case, slow rise and fall times will not cause an input capture pin to be in an indeterminate state during a transition. Thus, CMOS logic instability and significant timing errors will be prevented during slow transitions. Since the sensor's frequency output may be interfaced to other logic configurations, a designer's main concern is to comply with a worst-case timing scenario. For high-speed CMOS logic, the maximum rise and fall times are typically specified at several hundreds of nanoseconds. Thus, it is wise to speed up the switching edges at the output of the VIF converter. A single small-signal FET and a resistor are all that is required to obtain switching times below 100 ns. APPLICATIONS Besides eliminating the need for an AID converter, a frequency output is conducive to applications in which the sensor output must be transmitted over long distances, or when the presence of noise in the sensor environment is likely to corrupt an otherwise healthy signal. For sensor outputs encoded as a voltage, induced noise from electromagnetic fields will contaminate the true voltage signal. A frequency signal has greater immunity to these noise sources and can be effectively filtered in proximity to the MCU input. In other words, the frequency measured at the MCU will be the frequency transmitted at the output of a sensor located remotely. Since high-frequency noise and 50-60 Hz line noise are the two most prominent sources for contamination of instrumentation Signals, a frequency signal with a range in the low end of the kHz spectrum is capable of being well filtered prior to being examined at the MCU. Motorola Sensor Device Data AN1316 Table 1. Specifications Characteristics Max Units 30 Volts -MPX2010 10 kPa -MPX2050 50 kPa -MPX2100 100 kPa - MPX2200 200 kPa -MPX2700 700 Power Supply Voltage Full Scale Pressure Full Scale Output Symbol Min B+ 10 PFS 10 fFS Zero Pressure Offset Sensitivity Quiescent Current kPa kHz fOFF 1 kHz SAOUT 9/PFS kHzlkPa ICC 55 rnA EVALUATION BOARD The following sections present an example of the signal conditioning, including frequency conversion, that was developed as an evaluation tool for the Motorola MPX2000 series pressure sensors. A summary of the information required to use evaluation board number DEVB160 is presented as follows. Description The evaluation board shown in Figure 1 is designed to transduce pressure, vacuum or differential pressure into a single-ended, ground referenced voltage that is then input to a voltage-to-frequency converter. It nominally provides a 1 kHz output at zero pressure and 10kHz at full scale pressure. Zero pressure calibration is made with a trim pot that is located on the lower half olthe left side of the board, while the full scale output can be calibrated via another trimpot just above the offset adjust. The board comes with an MPX2100DP sensor installed, but will accommodate any MPX2000 series sensor. One additional modification that may be required is that the gain of the circuit must be increased slightly when using an MPX2010 sensor. Specifically, the resistor R5 must be increased from 7.5 kQ to 12 kQ. Circuit Description The following pin description and circuit operation corresponds to the schematic shown in Figure 2. Pin-by-Pin Description B+: Input power is supplied althe B+ terminal of connector CN1. Minimum input voltage is 10 V and maximum is 30 V. Fout: A logic-level (5 V) frequency output is supplied at the OUT terminal (CN1). The nominal signal it provides is1 kHz at zero Motorola Sensor Device Data Typ pressure and 10kHz at full scale pressure. Zero pressure frequency is adjustable and set with R12. Full-scale frequency is calibrated via R13. This output is designed to be directly connected to a microcontroller timer system input-capture channel. GND: The ground terminal on connector CN1 is intended for use as the power supply return and signal common. Test pOint terminal TP3 is also connected to ground, for measurement convenience. TP1: Test point 1 is connected to the final frequency output, Fout. TP2: Test point 2 is connected to the +5 V regulator output. It can be used to verify that this supply voltage is within its tolerance. TP3: Test point 3 is the additional ground point mentioned above in the GND description. TP4: Test point 4 is connected to the +8 V regulator output. It can be used to verify that this supply voltage is within its tolerance. P1, P2: Pressure and Vacuum ports P1 and P2 protrude from the sensor on the right side of the board. Pressure port P1 is on the top (marked side of package) and vacuum port P2, if present, is on the bottom. When the board is set up with a dual ported sensor (DP suffix), pressure applied to P1, vacuum applied to P2 or a differential pressure applied between the two all produce the same output voltage per kPa of input. Neither port is labeled. Absolute maximum differential pressure is 700 kPa. 4-95 ~ ...Zw ...en ~ U4 MC78L05ACP "TI cD' c ; ~ C m ...< ; ..a ID 01 0 ~b8L08ACP Sl 2 3 onloff I f~FT OUT IN 1 1 GROUND C2 0.1 11FT 2 c CD :::I I n '< 3 r T TP4 Rl 2400 r R2 1 kO 6200 S. S. D1 MV57124A AD654 2 Xl MPX2100DP UI CD :::I III \, LI\-R5 DI .§. :::I 0 a a UI CD '"Q cCD < o· CD 0 ~ I~ rg ..... ..........4.... ~ :> • C3 O.OlIl F VCC Ct I-~--H-...., Rt +'4n Ct VSS B+ S------1 FULL-SCALE R12 200Q DI 1i> _.. Fout LogCom 5 ID s;::' Ml~' R3 4.3kQ 7.5kQ S! ~ C !!!. 0" U5 , 0 "C TP2 3 11N ~ OFFSET R7 8200 r· . ·f·--... ~ B+ 30 ~~h AN1316 The following is a table of the components that are assembled on the DEVB160 Frequency Output Sensor Evaluation Board. Table 2. Parts List Designators Cl Quantity 1 Description Manufacturer Part Number 1 J.lF Capacitor C2 1 0.1 J.lF Capacitor C3 1 0.01 J.lF Capacitor C4 1 0.1 J.lF Capacitor C5 1 10 J.lF Cap+ C6 1 0.1 J.lF Capacitor CNl 1 .15LS 3 Term PHX Contact 1727023 Dl 1 RED LED Quality Tech. MV57124A Rl 1 240 0 resistor R2,R9 2 1 kO resistor R3 1 4.3 kO resistor tantalum R4 1 1.5 kQ resistor R5 1 7.5 kO resistor R6 1 1200 resistor R7 1 8200 resistor R8 1 6200 resistor Rl0, Rll 2 2 kO resistor R12 1 2000 Trimpot Bourns 3386P-1-201 R13 1 1 kO Trimpot Bourns 3386P-l-l02 Sl 1 SPDT miniature switch NKK SS-12SDP2 TPl 1 YELLOW Testpoint Control Design TP-l04-01-04 TP2 1 BLUE Testpoint Control Design TP-l04-- -------------*-----------~~----------------------------------~ Figure 6. Application Example Beginning with the ramp generator, a timing ramp is generated with current source U5 and capacitor C3. Initialization is provided by 01 which sets the voltage on C3 at approximately ground. With the values shown, 470 ~A flowing into 0.47 ~F provide approximately a 5 msec ramp time from zero to 5 V. Assuming zero pressure on the sensor, inputs to both comparators U2A and U2B are at the same voltage. Therefore, as the ramp voltage sweeps from zero to 5 V, both PAO and PA 1 will go low at the same time when the ramp voltage exceeds the common mode voltage. The processor counts the number of clock cycles between the time that PAO and PA1 go low, reading zero for zero pressure. In this circuit, U4A and U4B form the front end of an instrument amplifier. They differentially amplify the sensor's output. The resulting amplified differential signal is then sampled and held in U1 and U3. The sample and hold function is performed in order to keep input data constant during the conversion process. The stabilized signals coming out of U1 and U3 feed a higher output voltage to U2A than U2B, assuming that pressure is applied to the sensor. Therefore, the ramp will trip U2B before U2A is tripped, creating a time difference between PAO going low and PA1 going low. The processor reads the number of clock cycles between these two events. This number is then linearly scaled with software to represent the amplified output voltage, accomplishing the analog to digital conversion. When the ramp reaches the reference voltage established by R9 and R10, comparator U2C is tripped, and a reset command is generated. To accomplish reset, 01 is turned on Motorola Sensor Device Data with an output from PA7, and the sample and hold circuits are delatched with an output from PB1. Resolution is limited by clock frequency and ramp linearity. With the ramp generator shown in Figure 7 and a clock frequency of 2 MHz; resolution is 11 bits. From a software point of view, the AJD conversion consists of latching the sample and hold, reading the value of the microcomputer's free running counter, turning off 01, and waiting for the three comparator outputs to change state from logic 1 to logic o. The analog input voltage is determined by counting, in 0.5 ~sec steps, the number of clock cycles between PAO and PA1 going low. LONG DISTANCE INTERFACES In applications where there is a significant distance between the sensor and microcomputer, two types of interfaces are typically used. They are frequency output and 4-20 mA loops. In the frequency output topology, pressure is converted into a zero to 5 V digital signal whose frequency varies linearly with pressure. A minimum frequency corresponds to zero pressure and above this, frequency output is determined by a Hz/unit pressure scaling factor. If minimizing the number of wires to a remote sensor is the most important design consideration, 4-20 mA current loops are the topology of choice. These loops utilize power and ground as the 4-20 mA signal line and therefore require only two wires to the sensor. In this topology 4 mA of total current drain from the sensor corresponds to zero pressure, and 20 mA to full scale. 4-103 ! U5 lM334Z-3 ~ +10 0 ( •...z 01 .) , ~I , 1N914 0 14 r'F PA2 +S C3 R4 147 R9 1k RS R6 4.7 5% 1.SkS% r'F __ C7 Rl0 9.09k PA7 :!! cc U7 MC68HC11 E9FN c iil :-I !!! :l cc iii !a .50 R7 • o U4A MC33078 "C CD ~ ~ :l Ii ~ 22kS% PAl lF398A --'WY-- R2402 k XDCR1 MPX2000 SERIES PRESSURE SENSOR 3 -It- 2 C122pF RS 120' 4 C222pF --ifR3 402 k PBl +8.S -8.S - U3 4 S R8 lF398A 22kS% s:: ~ o Pi" (Jl CD C4 O.OlIl F POlYPROP :l en Q oCD < £" ~ III NOTE: UNLESS OTHERWISE SPECIFIED All RESISTORS ARE 1% METAL FilM ...CD CoS I PAO ;;:: 0o o 5l en CD ::J en S! o ~ o· CD o * "T1 ce' I: I iil !Xl "T1 iil ..c I: CD :::l n '< o I: -S S. r C3 ---1E-0.0111 F I R8 120' ZERO CAL. U1 , C T + V S C T FOUT R7 2 k RT R11 4.3 k V S C 0 M 1 Q1 . "'"" R5 1.5 k R31 200 !o VIN R4 7.5 k C/I en U3 AD654 U2A MC33274 "ll g R9 1k XDCR1 MPX2000 SERIES PRESSURE SENSOR iil en en I: iil CD :::l C2 ~ 0.111 F , NOTE: FOR MPX201 0, R8 = 75 OHMS R12 1k FULL SCALE CAL. NOMINAL OUTPUT: 1 kHz @ ZERO PRESSURE 10kHz @ FULL SCALE :nn ~ Z .... Co) .... CXI AN1318 A relatively straightforward circuit for converting pressure to frequency is shown in Figure 8. It consists of three basic parts. The interface amplifier is the same circuit that was described in Figure 4. Its 0.5to 4.5 V output is fed directly into an AD654 voltage-to-frequency converter. On the AD654, C3 sets nominal output frequency. Zero pressure output is calibrated to 1 kHz by adjusting the zero pressure input voltage with R3. Full scale adjustments are made with R12 which sets the full scale frequency to 10kHz. The output of the AD654 is then fed into a buffer consisting of 01 and R10. The buffer is used to clean up the edges and level translate the output to 5 V. Advantages of this approach are that the frequency output is easily read by a microcomputer's timer and transmission over a twisted pair line is relatively easy. Where very long distances are involved, the primary disadvantage is that 3 wires (VCC, ground and an output line) are routed to the sensor. A 4-20 mA loop reduces the number of wires to two. Its output is embedded in the VCC and ground lines as an active current source. A straightforward way to apply this technique to pressure sensing is shown in Figure 9. In this figure an MPX7000 series high impedance pressure sensor is mated to an XTR101 4-20 mA two-wire transmitter. It is set up to pull 4 mA from its power line at zero pressure and 20 mA at full scale. At the receiving end a 240 ohm resistor referenced to signal ground will provide a 0.96 to 4.8 V signal that is suitable for microcomputer AID inputs. 2 rnA 4-20 rnA OUTPUT XOCR1 MPX7000 SERIES SENSOR 01 1N4002 Q1 MPSA06 C1 0.011-1F ,--, 1 11 -'- 1 1 ~ 1 L--------..1_c-::--"}-..J 1 I 240 2 02 1N4565A '--_--1-_ _ _ _---' 6.4V@.5rnA + R1 750 1/2W -=-24V -- ~ T r1~<---)(--)~1 ~ I I I i ' R6 100 k R4 1M RETURN V PLOOP 1- _-; ~~ V R2 1k Figure 9. 4-20 mA Pressure Transducer Bias for the sensor is provided by two 1 mA current sources (pins 10 and 11) that are tied in parallel and run into a 1N4565A 6.4 V temperature compensated zener reference. The sensor's differential output is fed directly into XTR101's inverting and non-inverting inputs. Zero pressure offset is calibrated to 4 mA with R6. Biased with 6.4 V, the sensor's full scale output is 24.8 mV. Given this input R3 + R5 nominally total 64 ohms to produce the 16 mA span required for 20 mA full scale. Calibration is set with R5. The XTRl 01 requires that the differential input voltage at pins 4-106 3 and 4 has a common mode voltage between 4 and 6 V. The sensor's common mode voltage is one half its supply voltage or 3.2 V. R2 boosts this common mode voltage by 1 k· 2 mA or 2 V, establishing a common mode voltage for the transmitter's input of 5.2 V. To allow operation over a 12 to 40 V range, dissipation is off-loaded from the IC by boosting the output with 01 and R1. D1 is also included for protection. It prohibits reverse polarity from causing damage. Advantages of this topology include simplicity and, of course, the two wire interface. Motorola Sensor Device Data s: R5 453% R6 15% ~ R7 30.1 % aiii" en D/A (!) ::::J E en VRH VRL TCAP1 Q o o· (!) 0--- 5 ~ ~ VDD PDO o el. 0--- fPD1 f- III ~ 0--~ ~ ~ ~ PD2 ~ PD3 >PD4 ~ ~ VPP6 0-->--- PCO PC2 PC1 PC7 PC6 PC5 PC4 PC3 '-- IRQ PD5 ~: U1 XDCR1 MPX5100 MC68HC705B5FN ~ R4 R2 10 k I R3 10 k I U2 r MC34064P-5 1 - J1 !o -..J J2 1 C1 22 pF 1 J 1 PAO PA2 PA1 PA7 PA6 PA5 PA4 PA3 PD6 PD7 OSC1 R1 10M C2 9 ..::::L r IEEE LCD 5657 OR EQUIVALENT 12 26 27 13 14 15 24 25 RESET r 6 7 28 33 34 35 36 37 38 39 8 31 32 9 10 11 29 30 PB2 PB1 PB7 PB6 PB5 PB4 PB3 * 4.7k .----- 1 0--- 2 ~3 ~4 TCAP2 ~ 1 LIQUID CRYSTAL DISPLAY 16 22 23 17 18 19 20 21 ' - - - 40 Y1 4MHz OSC2 Vss RDI TDO :r:- ...z ... CO Co) AN1318 DIRECT INTERFACE WITH INTEGRATED SENSORS The simplest interface is achieved with an integrated sensor and a microcomputer that has an on-chip AID converter. Figure 10 shows an LCD pressure gauge that is made with an MPXS100 integrated sensor and MC68HCOS microcomputer. Although the total schematic is reasonably complicated, the interface between the sensor and the micro is a single wire. The MPXS100 has an internal amplifier that outputs a O.S to 4.S V signal that inputs directly to AID port PDS on the HCOS. The software in this system is written such that the processor assumes zero pressure at power up, reads the sensor's output voltage, and stores this value as zero pressure offset. Full scale span is adjustable with jumpers J1 and J2. For this particular system the software is written such that with J1 out and J2 in, span is decreased by 1.S%. Similarly with J 1 in and J2 out, span is increased by 1.S%. Given the ± 2.S% full scale spec on the sensor, these jumpers allow calibration to ± 1% without the use of pots. MIX AND MATCH The circuits that have been described so far are intended to be used as functional blocks. They may be combined in a variety of ways to meet-the particular needs of an application. For example, the Frequency Output Pressure Sensor in Figure 8 uses the sensor interface circuit described in Figure 4 to provide an input to the voltage-te-frequency converter. Alternately, an MPXS100 could be directly connected to pin 4 Precision of the AD6S4 or the output of Figure 3's Instrumentation Amplifier Interface could by substituted in the same way. Similarly, the Pressure Gauge described in Figure 10 could be constructed with any of the interfaces that have been described. 4-108 CONCLUSION The circuits that have been shown here are intended to make interfacing semiconductor pressure sensors to digital systems easier. They provide cost effective and relatively simple ways of interfacing sensors to microcomputers. The seven different circuits contain many tradeoffs that can be matched to the needs of individual applications. When considering these tradeoffs it is important to throw software into the equation. Techniques such as automatic zero pressure calibration can allow one of the inexpensive analog interfaces to provide performance that could otherwise only be obtained with a more costly precision interface. REFERENCES 1. Baum, Jeff, "Frequency Output Conversion for MPX2000 Series Pressure Sensors," Motorola Application Note AN1316/D. 2. Lucas, William, "An Evaluation System for Direct Interface of the MPXS100 Pressure Sensor with a Microprocessor," Motorola Application Note AN130S. 3. Lucas, William, "An Evaluation System for Interfacing the MPX2000 Series Pressure Sensors to a Microprocessor," Motorola Application Note AN131S. 4. Schultz, Warren, "Compensated Sensor Bar Graph Pressure Gauge," Motorola Application Note AN1309. S. Schultz, Warren, "Interfaced Sensor Evaluation Board," Motorola Application Note AN1312. 6. Schultz, Warren, "Sensor Building Block Evaluation Board," Motorola Application Note AN1313. 7. Williams, Denise, "A Simple 4-20 mA Pressure Transducer Evaluation Board," Motorola Application Note AN1303. Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1322 Applying Semiconductor Sensors to Bar Graph Pressure Gauges Prepared by: Warren Schultz Discrete Applications Engineering INTRODUCTION Bar Graph displays are noted for their ability to very quickly convey a relative sense of how much of something is present. They are particularly useful in process monitoring applications where quick communication of a relative value is more important than providing specific data. Designing bar graph pressure gauges based upon semiconductor pressure sensors is relatively straightforward. The sensors can be interfaced to bar graph display drive IC's, microcomputers and MC33161 voltage monitors. Design examples for all three types are included. BAR GRAPH DISPLAY DRIVER Interfacing semiconductor pressure sensors to a bar graph display IC such as an LM3914 is very similar to microcomputer interface. The same 0.5 to 4.5 V analog signal that a microcomputer's AID converter wants to see is also quite suitable for driving an LM3914. In Figure 1, this interface is provided by dual op amp U2 and several resistors. The op amp interface amplifies and level shifts the sensor's output. To see how this amplifier works, simplify it by grounding the output of voltage divider R3, R5. If the common mode voltage at pins 2 and 4 of the sensor is 4.0 V, then pin 2 of U2A and pin 6 of U2B are also at 4.0 V. This puts 4.0 V across R6. Assuming that the current in R4 is equal to the current in R6, 323 !lA • 100 ohms produces a 32 mV drop across R4 which adds to the 4.0 V at pin 2. The output voltage at pin 1 of U2A is, therefore, 4.032 V. This puts 4.032 - 4.0 V across R2, producing 43 !lA. The same current flowing through R1 again produces a voltage drop of 4.0 V, which sets the output at zero. Substituting a divider output greater than zero into this calculation reveals that the zero pressure output voltage is equal to the output voltage of divider R3, R5. For this DC output voltage to be independent of the sensor's common mode voltage, it is necessary to satisfy the condition that R1/R2 R6/R4. Gain can be determined by assuming a differential output at the sensor and going through the same calculation. To do this assume 100 mV of differential output, which puts pin 2 of = Motorola Sensor Device Data U2A at 3.95 V, and pin 6 of U2B at 4.05 V. Therefore, 3.95 V is applied to R6, generating 319 !lA. This current flowing through R4 produces 31.9 mV, placing pin 1 of U2A at 3950 mV + 31.9 mV = 3982 mV. The voltage across R2 is then 4050 mV - 3982 mV 68 mV, which produces a current of 91 !lA that flows into R1. The output voltage is then 4.05 V + (91 !lA • 93.1 k) 12.5 V. Dividing 12.5 V by the 100mVinputyieidsagain of 125, which provides a 4.0 V span for 32 mV of full scale sensor output. Setting divider R3, R5 at 0.5 V results in a 0.5 V to 4.5 V output that is easily tied to an LM3914. The block diagram that appears in Figure 2 shows the LM3914's internal architecture. Since the lower resistor in the input comparator chain is pinned out at RLO, it is a simple matter to tie this pin to a voltage that is approximately equal to the interface circuit's 0.5 V zero pressure output voltage. Returning to Figure 1, this is accomplished by using the zero pressure offset voltage that is generated at the output of divider R3, R5. Again looking at Figure 1, full scale is set by adjusting the upper comparator's reference voltage to match the sensor's oulput at full pressure. An internal regulator on Ihe LM3914 sets this voltage with the aid of resistors R7, R9, and adjustment pot R8. Eight volt regulated power is supplied by an MC78L08. The LED's are powered directly from LM3914 outputs, which are set up as current sources. Output current to each LED is approximately 10 times the reference current that flows from pin 7 through R7, R8, and R9 to ground. In this design it is nominally (4.5 V/4.9 k)10 = 9.2 mAo Over a zero 10 50°C temperature range combined accuracy for Ihe sensor, interface, and driver IC are ±10%. Given a 10 segment display tolal accuracy for the bar graph readout is approximately ± (10 kPa + 10%). This circuit can be simplified by substituting an MPX5100 integrated sensor for the MPX2100 and the op amp interface. The resulting schematic is shown in Figure 3. In this case zero reference for the bar graph is provided by dividing down the 5 V regulalor with R4, R1 and adjustment pot R6. The vollage at the wiper of R6 is adjusted to match the sensor's zero pressure offset voltage. It is connected to RLO to zero the bar graph. = = 4-109 AN1322 1 []i) Dl ~ C2 1 ~F D2 ~ 3 I MC78L08ACP ~ LED LED LED LED LED LED LED LED LED ---4 1 0 ~ LED GND 3 B+ 4 RLO 5 SIG RHI REF ADJ ...! MOD c.......J:. ~ 2 R3 1.5k 2 XDCRl MPX2000 SERIES 1 SENSOR ~ 1% 8 5 6 _ ~ 7_ ..J ~ R6 0 ~~ 1t?- 12.4k 1% rt Rl U2B 93.1 k 1% MC3327 '-U2A R2 MC33272 750 R5 100 1% ~ D7 ~ D8 D9 Dl0 "" "" -~] MV5716 I U3 2 G D6 D5 BAR GRAPH O.l~F Ul D4 "" ",-" "" I rfI D3 -4 R7 • 1.2 k 18 17 16 15 14 13 12 11 10 LM3914N ~ R8 ~~ 1% R9 2.7k 4 FOR MPX201 0 SENSORS: Rl=150k R4 = 61.9 OHMS ~ R4 ~ Figure 1. Compensated Sensor Bar Graph Pressure Gauge 1001% 121 'lJ' 131 'lJ' 141 'lI' THIS LOAD DETERMINES LED BRIGHTNESS CONTROLS TYPE OF DISPLAY, BAR OR SINGLE LED SIG IN Figure 2. LM3914 Block Diagram 4-110 Motorola Sensor Device Data AN1322 +12 V 1I 01 02 03 04 05 06 07 08 09 010 ..... ..... ..... ..... ..... ..... ..... ..... ..... C2 l~F '- - '---- n U3 Ul Cl 0.1 ~ LEO GNO 3 B+ 4 RLO 5 SIG RHI REF AOJ ,-!MOO ~F 3 I a MC78L05ACP G I 1 rl- ~,~~,oo 2 R4 1.3k [§@>- ~ rJ- R2 1.2k 12 R5 1k ZERO CAL. 1~ 12 11 10 LM3914 FULL SCALE CAL. R3 2.7k Rl 100 I 18 17 16 15 14 ~+-- R6 100 ~ LEO LEO LEO LEO LEO LEO LEO LEO LEO ---+ ~ ~ Fi g ure 3. MPX5100 Bar Gra ph Pressure Ga uge +5>-r------------------r----~======~~~--lr~--,_~--,_~__, • 01 O/A TCAPl TCAP2 VOO POD POl P02 P03 P04 VPP6 IRQ P05 02 03 04 05 ~ ~ ~ ~ ~ MV53214A MV54124A MV54124A MV54124A MV57124A PCO PCl f - - - - - - - - \ Ul MC68HC705B5FN Pc2f-----------1 RESET Rl 10 k Jl PC3 P06 P07 OSCl Cl 22 pF J2 PC4 1 1 OSC2 I C2 22pF Motorola Sensor Device Data ROI TOO Figure 4. Microcomputer Bar Graph Pressure Gauge 4-111 AN1322 B+~--~------------------------------~------------------~--~~----~-----, Cl TI ~ r~ C2 0.1 ~F 11 1 MOC4510A R7 7.5k 01 lN914 02 lN914 R3 6.65 k 1% R2 750 1% R5 1.33k 1% MC33161 R4 100 1% Figure 5. An Inexpensive 3-Segment Processor Monitor r--------------------------------, I I VREF 2.54 V REFERENCE VCC I I I I I I MOOE SELECT I I I IINPUTI I I I I I I I OUT2 I I I I I IINPUT2 :II IL _ _ _ _ _ _ _ _ ~ :II _ - _ GNO ______________________ I ~ Figure 6. MC33161 Block Diagram 4-112 Motorola Sensor Device Data AN1322 MICROCOMPUTER BAR GRAPH Microcomputers with internal AID converters such as an MC68HC05B51end themselves to easily creating bar graphs. Using the AID converter to measure the sensor's analog output voltage and output ports to individually switch LED's makes a relatively straightforward pressure gauge. This type of design is facilitated by a new MDC451 OA gated current sink. The MDC4510A takes one of the processor's logic outputs and switches 10 rnA to an LED. One advantage of this approach is that it is very flexible regarding the number of segments that are used, and has the availability through software to independently adjust scaling factors for each segment. This approach is particularly useful for process monitoring in systems where a microprocessor is already in place. Figure 4 shows a direct connection from an MPX5100 sensor to the microcomputer. Similarto the previous example, an MPX2000 series sensor with the op amp interface that is shown in Figure 1 can be substituted for the MPX5100.ln this case the op amp interface's output at pin 7 ties to port PD5, and its supply needs to come from a source greater than 6.5 V. PROCESS MONITOR For applications where an inexpensive HIGH-LOW-OK process monitor is required, the circuit in Figure 5 does a good job. It uses an MC33161 Universal Voltage Monitor and the same analog interface previously described to indicate high, low or in-range pressure. A block diagram of the MC33161 is illustrated in Figure 6. By tying pin 1 to pin 7 it is set up as a window detector. Whenever input 1 exceeds 1.27 V, two logic ones are placed at the inputs of its exclusive OR gate, turning off output 1. Therefore this output is on unless the lower threshold is exceeded. When 1.27 V is exceeded on input 2, just the opposite occurs. A single logic one appears at its exclusive OR gate, turning on output 2. These two outputs drive LED's through MDC4010A 10 rnA current sources to indicate low pressure and high pressure. Returning to Figure 5, an in-range indication is developed by turning on current source 11 whenever both the high and low outputs are off. This function is accomplished with a discrete gate made from D1, D2 and R7. Its output feeds the Motorola Sensor Device Data input of switched current source 11, turning it on with R7 when neither D1 nor D2 is forward biased. Thresholds are set independently with R8 and R9. They sample the same 4.0 V full scale span that is used in the other examples. However, zero pressure offset is targeted for 1.3 V. This voltage was chosen to approximate the 1.27 V reference at both inputs, which avoids throwing away the sensor's analog output signal to overcome the MC33161's input threshold. In addition, R10 and R11 are selected such that at full scale output, ie., 5.3 V on pin 7, the low side of the pots is nominally at 1.1 V. This keeps the minimum input just below the comparator thresholds of 1.27 V, and maximizes the resolution available from adjustment pots R8 and R9. When level adjustment is not desired, R8 - R11 can be replaced by a simpler string of three fixed resistors. CONCLUSION The circuits that have been shown here are intended to make simple, practical and cost effective bar graph pressure gauges. Their application involves a variety of trade-offs that can be matched to the needs of individual applications. In general, the most important trade-offs are the number of segments required and processor utilization. If the system in which the bar graph is used already has a microprocessor with unused AID channels and 1/0 ports, tying MDC451 OA current sources to the unused output ports is a very cost effective solution. On a stand-alone basis, the MC33161 based process monitor is the most cost effective where only 2 or 3 segments are required. Applications that require a larger number of segments are generally best served by one of the circuits that uses a dedicated bar graph display. REFERENCES 1. Alberkrack, Jade, & Barrow, Stephen; "Power Supply Monitor IC Fills Voltage Sensing Roles," Power Conversion & Intelligent Motion, October 1991. 2. Lucas, William, "An Evaluation System for Direct Interface of the MPX5100 Pressure Sensor with a Microprocessor," Motorola Application Note AN1305. 3. Schultz, Warren, "Integrated Sensor Simplifies Bar Graph Pressure Gauge," Motorola Application Note AN1304. 4. Schultz, Warren, "Compensated Sensor Bar Graph Pressure Gauge," Motorola Application Note AN1309. 4-113 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1324 A Simple Sensor Interface Amplifier Prepared by: Warren Schultz Discrete Applications Engineering INTRODUCTION Compensated semiconductor pressure sensors such as the MPX2000 family are relatively easy to interface with digital systems. With these sensors and the circuitry that is described here, pressure is translated into a 0.5 to 4.5 V output range that is directly compatible with Microcomputer AID inputs. A description of an Evaluation Board and design considerations are presented as follows. Figure 1. DEVB173 Sensor Building Block Evaluation Board 4-114 Motorola Sensor Device Data AN1324 EVALUATION BOARD DESCRIPTION A summary of the information required to use the Sensor Mini Block evaluation board, part number DEVBI73, is presented as follows. A discussion of the design appears under the heading Design Considerations. FUNCTION The evaluation board shown in Figure 1 is designed to translate pressure, vacuum, or differential pressure into a single-ended, ground referenced voltage that is suitable for direct input to microcomputer ND ports. It has two input ports. PI, the pressure port, is on the top side of the sensor and P2, a vacuum port, is on the bottom side. These ports can be supplied pressure on PI or vacuum on P2, or a differential pressure between PI and P2. Any of these sources will produce equivalent outputs. The output is a ground referenced analog signal. It nominally supplies 0.5 V at zero pressure and 4.5 V at full scale. A zero adjustment has been made at the factory with trim resistor R7. Full scale output is approximately 4 V above the zero setting. ELECTRICAL CHARACTERISTICS The following electrical characteristics are included as a guide to operation. Characteristic Symbol Min Typ Max Units Power Supply Voltage B+ 10 - 30 Volts Full Scale Pressure MPX2010 MPX2050 MPX2100 MPX2200 MPX2700 PFS - - 10 50 100 200 700 700 Overpressure Full Scale Output Zero Pressure Offset Sensitivity Quiescent Current kPa - - PMAX - - VFS 4.5 - VOFF - 0.5 - Volts SAOUT - 4V1PFS - V/kPa ICC - 25 - rnA kPa Volts CONTENT Board contents are described in the following parts list and schematic. A pin-by-pin circuit description follows in the next section. Table 1. Parts List Cl 1 Ceramic Capacitor C2 1 Ceramic Capacitor C3 1 Ceramic Capacitor 0.001 Rl" 1 1/4 Watt Film Resistor 93.1 kl% R2 1 1/4 Watt Film Resistor 7501% R3 1 1/4 Watt Film Resistor 39.2 k 1% R4" 1 1/4 Watt Film Resistor 1001% R5 1 1/4 Watt Film Resistor 1.33kl% R6 1 1/4 Watt Film Resistor 11 kl% R7 1 1/4 Watt Film Resistor Trim Ul 1 OpAmp Motorola MC33272P U2 1 8 V Regulator Motorola MC78L08ACP 1 Pressure Sensor Motorola MPX2100DP XDCRI Value Part Qty. "For MPX2010 Sensors Rl Description Vendor Designator 0.2~F 0.2~F ~F =150 k & R4 =61.9 ohms PIN-BY-PIN DESCRIPTION Input power is supplied at the B+ terminal. Minimum input voltage is 6.8 V and maximum is 30 V. GND: The terminal labeled GND is intended for use as the power supply return. It is generally advisable to leave enough bare wire going into this terminal to conveniently provide a connection for instrumentation ground clips. OUT: An analog output is supplied at the OUTterminal. The signal it provides is nominally 0.5 V at zero pressure and 4.5 Vatfull scale. This output is designed to be directly connected to a microcomputer ND channel, such as one of the E ports on an MC68HCll. Motorola Sensor Device Data PI, P2: Pressure and Vacuum ports PI and P2 protrude from the sensor on the right side of the board. Pressure port PI is on the top and vacuum port P2 is on the bottom. Neither port is labeled. Maximum safe pressure is 700 kPa. 4-115 AN1324 3 Ul MC78L08ACP C2 Io.2 I1F 4 U2B MC33272 Rl 2 XDCRI MPX2000 SERIES 1 SENSOR 93.1 k 1% -= C3 R7 TRIM R2 750 1% R3 39.2k NOTES: R7 selected for zero pressure VOUT = 0.5 V For MPX2010 Sensors: Rl =150k R4 =61.9 Ohms -= R6 11 k 1% R5 1.33k 1% O.OOII1F R4 100 1% -= Figure 2. Sensor Mini Block 8 3 4 U2B MC33272 Rl 2 XDCRI MPX2000 SERIES 1 SENSOR 93.1 k R2 1% 750 1% -= V FFSE'[ R6 12.4k 1% R4 100 1% Figure 3. Simplified Schematic 4-116 Motorola Sensor Device Data AN1324 DESIGN CONSIDERATIONS When interfacing semiconductor pressure sensors to microcomputers, the design challenge is how to take a relatively small DC coupled differential signal and produce a ground referenced output that is suitable for driving AID inputs. A very simple interface circuit that will do this job is shown in Figure 2. It uses one dual op amp and several resistors to amplify and level shift the sensor's output. To see how this amplifier works, let's simplify it in Figure 3, and assume VOFFSET is zero. If the common mode voltage at pins 2 and 4 of the sensor is 4.0 V, then pin 2 of U2A and pin 6 of U2B are also at 4.0 V. This puts 4.0 V across R6. Assuming that the current in R4 is equal to the current in R6, 323 ~A x 100 ohms produces a 32 mV drop across R4 which adds to the 4.0 V at pin 2. The output voltage at pin 1 of U2A is, therefore, 4.032 V. This puts 4.032 - 4.0 V across R2, producing 43 ~A. The same current flowing through R1 again produces a voltage drop of 4.0 V, which sets the output at zero. Substituting a value for VOFFSET other than zero into this calculation reveals that the zero pressure output voltage equals VOFFSET Forthis DC output voltage to be independent of the sensor's common mode voltage it is necessary to satisfy the condition that R1/R2 = R6/R4. Gain can be determined by assuming a differential output atthe sensor and going through the same calculation. To do this assume 100 mV of differential output, which puts pin 3 of U2A at 3.95 V, and pin 5 of U2B at 4.05 V. Therefore, 3.95 V is applied to R6, generating 319 ~A. This current flowing through R4 produces 31.9 mY, placing pin 1 of U2A at 3950 mV + 31.9 mV = 3982 mY. The voltage across R2 is then 4050 mV - 3982 mV = 68 mY, which produces a current of 91 ~A that . flows into R 1. The output voltage is then 4.05 V + (91 ~A 0 93.1 k) = 12.5 V. Dividing 12.5 V by the 100 mV input yields again of 125, which providesa4 V spanfor32 mVoffull scale sensor output. Returning to Figure 2, a 0.5 V VOFFSET is generated by the divider consisting of R3, R5, and R7. To keep the input irnpedance looking into pin 2 of U2A at 12.4 k, R6 is chosen as 11 k. The divider impedance is then chosen to nominally be 1.4 k, providing a total of 12.4 k. For purposes of analysis, the complete circuit in Figure 2 is then equivalent to Figure 3 with a VOFFSET input of 0.5 V. The resulting 0.5 V to 4.5 V output from pin 7 of U2B is directly cornpatible with microprocessor AID inputs. Over a zero to 50°C temperature range combined accuracy for the sensor and interface is ±5%. APPLICATION Using the Sensor Mini Block's analog output to provide pressure information to a microcomputer is very straightforward. The output voltage range which goes from 0.5 V at zero pressure to 4.5 V at full scale is designed to make optirnurn use of microcomputer AID inputs. A direct connection from the evaluation board output to an AID input is all that is required. Using the MC68HC11 as an example, the output is connected to any of the E ports, such as port EO. CHANGING SENSORS In order to change pressure ranges, MPX2050, MPX21 00, MPX2200, and MPX2700 pressure sensors can be substituted directly for each other. When one of these sensors is substituted for another, the 4.5 V full scale output will remain the same and correspond to the new sensor's full scale pressure specification. For example, substituting an MPX2200 200 kPa sensor for an MPX2100 100 kPa unit will change the full scale output from 4.5 V at 100 kPa to 4.5 Vat 200 kPa. To make this translation with an MPX2010 requires changing R1 from 93.1 k to 150 k and R4 from 100 ohms to 61.9 ohrns. With R1 at 93.1 k and R4 at 100 ohms, full scale span for an MPX2010 is only 2.5 V, producing a nominal full scale output voltage of 3.0 V. FURTHER SIMPLIFICATION In non-demanding applications the 7 resistor topology that is shown in Figure 2 can be reduced to 5, by eliminating R6 and R7. Without R7 the zero pressure offset is untrimmed. However, in microprocessor based systems it is relatively easy to read the zero pressure offset voltage, store it, and calibrate in software. This can be done automatically when the unit powers up, or as a calibration procedure. R6 can be eliminated (reduced to zero ohms) by directly connecting the R3, R5 divider to pin 2. The output impedance of this divider then needs to be choosen such that its ratio with R4 = R1/R2, in other words [R3 o R5/(R3+R5)]/R4 = R1/R2. Given the values in Figure 2, this would mean R3 = 200 k, R5 = 13.3 k, R6 = 0, and R7 is open. In an untrimmed system, there is no real disadvantage to doing this, provided that the ratios can be sufficiently matched with standard resistor values. The other option is to eliminate R6 and trim R3 with R7. This situation is somewhat different. The trimming operation will throw the ratio off, and reduce common mode rejection. Typically several percent of any change in the sensor's common mode voltage will show up as an output error when this configuration is used. CONCLUSION Perhaps the most noteworthy aspect to the sensor amplifier described here is its simplicity. The interface between an MPX2000 series sensor and a microcomputer AID consists of Motorola Sensor Device Data one dual op amp and a few resistors. The result is a simple and inexpensive circuit that is capable of measuring pressure, vacuum or differential pressure. 4-117 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1325 Amplifiers for Semiconductor Pressure Sensors Prepared by: Warren Schultz Discrete Applications Engineering INTRODUCTION Amplifiers for interfacing Semiconductor Pressure Sensors 10 electronic systems have historically been based upon classic instrumentation 'amplifier designs, Instrumentation amplifiers have been widely used because they are well understood standard building blocks that also work reasonably well. For the specific job of interfacing Semiconductor Pressure Sensors to today's mostly digital systems, other circuits can do a better job, This application note presents an evolution of amplifier design that begins with a classic instrumentation amplifier and ends with a simpler circuit that is better suited to sensor interface. INTERFACE AMPLIFIER REQUIREMENTS Design requirements for interface amplifiers are determined by the sensor's output characteristics, and the zero to 5 V input range that is acceptable to microcomputer AID converters. Since the sensor's full scale output is typically tens of millivolts, the most obvious requirement is gain. Gains from 100 to 250 are generally needed, depending upon bias voltage applied to the sensor and maximum pressure to be measured. A differential to single-ended conversion is also required in order to translate the sensor's differential output into a single ended analog signal. In addition, level shifting is necessary to convert the sensor's 1/2 B+ common mode voltage to an appropriate DC level. For microcomputer AID inputs, generally that level is from 0.3 - 1.0 V. Typical design targets are 0.5 V at zero pressure and enough gain to produce 4.5 V at full scale. The 0.5 V zero pressure offset allows for output saturation voltage in op amps operated with a single supply (VEE 0). At the other end, 4.5 V full scale keeps the output within an AID converter's 5 V range with a comfortable margin for component tolerances, The resulting 0.5 to 4,5 V single-ended analog signal is also quite suitable for a variety of other applications such as bar graph pressure gauges and process monitors. = CLASSIC INSTRUMENTATION AMPLIFIER A classic instrumentation amplifier is shown in Figure 1. This circuit provides the gain, level shifting and differential to single-ended conversion that are required for sensor interface. It does not, however, provide for single supply operation with a zero pressure offset voltage in the desired range. Vcc R41k R31k RB 15k B R5 1k U1C MC33274 -= OUTPUT R2 1k • NOTE: FOR MPX2020 RIO = 150 OHMS Figure 1. Classic Instrumentation Amplifier REV 1 4-118 Motorola Sensor Device Data AN1325 C2 Io.l 1l F R7 7.5 k ::- 14 ZERO ::- R4 ::- RS 15 k GND XDCRl MPX2000 SERIES PRESSURE SENSOR Rl0 240' R3 1 k 1k OUTPUT R9 R5 15 k 1k 1k • NOTE: FOR MPX2010 Rl0 = l500HMS Figure 2. Instrumentation Amplifier Interface To provide the desired DC offset, a slight modification is made in Figure 2. R3 is connected to pin 14 of U1 D, which supplies a buffered offset voltage that is derived from the wiper of R6. This voltage establishes a DC output for zero differential input. The translation is one to one. Whatever voltage appears at the wiper of R6 will, within component tolerances, appear as the zero pressure DC offset voltage at the output. With Rl0 at 240 Q gain is set for a nominal value of 125, providing a 4 V span for 32 mV of full scale sensor output. Setting the offset voltage to 0.75 V, results in a 0.75 V to 4.75 V output that is directly compatible with microprocessor AID inputs. This circuit works reasonably well, but has several notable limitations when made with discrete components. First, it has a relatively large number of resistors that have to be well matched. Failure to match these resistors degrades common mode rejection and initial tolerance on zero pressure offset voltage. It also has two amplifiers in one gain loop, which makes stability more of an issue than it is in the following two alternatives. This circuit also has more of a limitation on zero pressure offset voltage than the other two. The minimum output voltage of U 1D restricts the minimum zero pressure offset voltage that can be accommodated, given component tolerances. The result is a 0.75 V zero pressure offset voltage, compared to 0.5 V for each of the following two circuits. Motorola Sensor Device Data SENSOR SPECIFIC AMPLIFIER The limitations associated with classic instrumentation amplifiers suggest that alternate approaches to sensor interface design are worth looking at. One such approach is shown in Figure 3. It uses one quad op amp and several resistors to amplify and level shift the sensor's output. Most of the amplification is done in U 1A, which is configured as a differential amplifier. It is isolated from the sensor's minus output by U1 B. The purpose of U1 B is to prevent feedback current that flows through R5 and R6 from flowing into the sensor. At zero pressure the voltage from pin 2 to pin 4 on the sensor is zero V. For example, assume that the common mode voltage is 4.0 V. The zero pressure output voltage at pin 1 of U1A is then 4.0 V, since any other voltage would be coupled back to pin 2 via R6 and create a non zero bias across U1 />:s differential inputs. This 4.0 V zero pressure DC output voltage is then level translated to the desired zero pressure offset voltage by U1C and U1D. To see how the level translation works, assume that the wiper of R9 is at ground. With 4.0 V at pin 12, pin 13 is also at 4.0 V. This leaves 4.0 V across (R3+R9), which total essentially 1 kQ. Since no current flows into pin 13, the same current flows through R4, producing approximately 4.0 V across R4, as well. Adding the voltages (4.0 + 4.0) yields 8.0 V at pin 14. Similarly 4.0 V at pin 10 implies 4.0 V at pin 9, and the drop across R2 is 8.0 V - 4.0 = 4.0 V. Again 4.0 V across R2 implies an equal drop across 4-119 AN1325 r4~--------~~--------~------1------------------OTP2+8V C1 l~ XDCR1 MPX2000 SERIES PRESSURE SENSOR GND OUT R8 1.5k R9 200 R4 1 k ZERO CAL . • NOTE: FOR MPX201 0 R5 = 75 OHMS Figure 3. Sensor Specific Amplifier = R1, and the voltage at pin 8 is 4.0 V - 4.0 V 0 V. In practice, the output of U1C will not go all the way to ground, and the voltage injected by R8 at the wiper of R9 is approximately translated into a DC offset. Gain is approximately equal to R6/R5(R1/R2+1), which predicts 125 for the values shown in Figure 3. A more exact calculation can be performed by doing a nodal analysis, which yields 127. Cascading the gains of U1A and U1C using standard op amp gain equations does not give an exact result, because the sensor's negative going differential signal at pin 4 subtracts from the DC level that is amplified by U1 C. Setting offset to 0.5 V results in an analog zero to full scale range of 0.5 to 4.5 V. For this DC output voltage to be independent of the sensor's common mode voltage it is necessary to satisfy the condition that R1/R2 (R3+R9)/R4. This approach to interface amplifier design is an improvement over the classic instrument amplifier in that it uses fewer resistors, is inherently more stable, and provides a zero pressure output voltage that can be targeted at .5 V. It has the same tolerance problem from matching discrete resistors that is associated with classic instrument amplifiers. = SENSOR MINI AMP Further improvements can be made with the circuit that is shown in Figure 4. It uses one dual op amp and several resistors to amplify and level shift the sensor's output. To see how this amplifier works, let's simplify it by grounding the output of voltage divider R3, R5 and assuming that the divider impedance is added to R6, such that R6 = 12.4 k. If the common mode voltage at pins 2 and 4 of the sensor is 4.0 V, 4-120 then pin 2 of U2A and pin 6 of U2B are also at 4.0 V. This puts 4.0 V across R6, producing 3231lA. Assuming thatthe current in R4 is equal to the current in R6, 323 j.tA • 100 Q produces a 32 mV drop across R4 which adds to the 4.0 V at pin 2. The output voltage at pin 1 of U2A is, therefore, 4.032 V. This puts 4.032 - 4.0 V across R2, producing 431lA. The same current flowing through R1 again produces a voltage drop of 4.0 V, which sets the output at zero. Substituting a divider output greater than zero into this calculation reveals that the zero pressure output voltage is equal to the output voltage of divider R3, R5. For this DC output voltage to be independent of the sensor's common mode voltage it is necessary to satisfy the condition that R1/R2 = R6/R4, where R6 includes the divider impedance. Gain can be determined by assuming a differential output at the sensor and going through the same calculation. To do this assume 100 mV of differential output, which puts pin 2 of U2A at 3.95 V, and pin 6 of U2B at 4.05 V. Therefore, 3.95 V is applied to R6, generating 319 uA. This currentflowing through R4 produces 31.9 mV, placing pin 1 of U2A at 3950 mV + 31.9 mV = 3982 mV. The voltage across R2 is then 4050 mV 3982 mV 68 mV, which produces a current of 91 IlA that flows into R1. The output voltage is then 4.05 V + (91 IlA. 93.1 k) = 12.5 V. Dividing 12.5 V by the 100 mVinput yields a gain of 125, which provides a 4 V span for 32 mV of full scale sensor output. Setting divider R3, R5 at 0.5 V results in aO.5 Vto 4.5 Voutputthat is comparable to the other two circuits. This circuit performs the same function as the other two with significantly fewer components and lower cost. In most cases it is the optimum choice for a low cost interface amplifier. = Motorola Sensor Device Data AN1325 B+ OUT XDCR1 MPX2000 SERIES SENSOR R1 93.1 k 1% 4 R3 39.2k R7 TRIM -= 1% U1B MC33272 GND 1 C20.0011lF R2 750 1% R6 R5 1.33 k 11 k 1% 1% NOTES: R71S NOMINALLY 39.2 k AND SELECTED FOR ZERO PRESSURE VOUT = 0.5 V FOR MPX2010 SENSORS R1 = 150 k AND R4 = 61.9 OHMS R4 100 1% Figure 4. Sensor Mini Amp PERFORMANCE Performance differences between the three topologies are minor. Accuracy is much more dependent upon the quality of the resistors and amplifiers that are used and less dependent on which of the three circuits are chosen. For example, input offset voltage error is essentially the same for all three circuits. To a first order approximation, it is equal to total gain times the difference in offset between the two amplifiers that are directly tied to the sensor. Errors due to resistor tolerances are somewhat dependent upon circuit topology. However, they are much more dependent upon the choice of resistors. Choosing 1% resistors rather than 5% resistors has a much larger impact on performance than the minor differences that result from circuit topology. Assuming a zero pressure offset adjustment, any of these circuits with an MPX2000 series sensor, 1% resistors and an MC33274 amplifier results in a ± 5% pressure to voltage translation from 0 to 50° C. Software calibration can significantly improve these numbers and eliminate the need for analog trim. CONCLUSION Although the classic instrumentation amplifier is the best known and most frequently used sensor interface amplifier, it is generally not the optimal choice for inexpensive circuits made from discrete components. The circuit that is shown in Motorola Sensor Device Data Figure 4 performs the same interface function with significantly fewer components, less board space and at a lower cost. It is generally the preferred interface topology for MPX2000 series semiconductor pressure sensors. 4-121 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1326 Barometric Pressure Measurement Using Semiconductor Pressure Sensors Prepared by: Chris Winkler and Jeff Baum Discrete Applications Engineering ABSTRACT The most recent advances in silicon micromachining technology have given rise to a variety of low-cost pressure sensor applications and solutions. Certain applications had previously been hindered by the high-cost, large size, and overall reliability limitations of electromechanical pressure sensing devices. Furthermore, the integration of on-chip temperature compensation and calibration has allowed a significant improvement in the accuracy and temperature stability of the sensor output signal. This technology allows for the development of both analog and microcomputer-based systems that can accurately resolve the small pressure changes encountered in many applications. One particular application of interest is the combination of a silicon pressure sensor and a microcontroller interface in the design of a digital barometer. The focus of the following documentation is to present a low-cost, simple approach to designing a digital barometer system. 11111111 I IJ IJ IJ. . . .I DIGITl DIGIT3 DIGIT2 DIGIT4 MCU SIGNAL CONDITIONING Figure 1. Barometer System 4-122 Motorola Sensor Device Data AN1326 INTRODUCTION Table 1. Altitude versus Pressure Data Figure 1 shows the overall system architecture chosen for this application. This system serves as a building block, from which more advanced systems can be developed. Enhanced accuracy, resolution, and additional features can be integrated in a more complex design. There are some preliminary concerns regarding the rneasurement of barometric pressure which directly affect the design considerations for this system. Barometric pressure refers to the air pressure existing at any pOint within the earth's atrnosphere. This pressure can be measured as an absolute pressure, (with reference to absolute vacuum) or can be referenced to some other value or scale. The meteorology and avionics industries traditionally measure the absolute pressure, and then reference it to a sea level pressure value. This complicated process is used in generating maps of weather systems. The atmospheric pressure at any altitude varies due to changing weather conditions over time. Therefore, it can be difficult to determine the significance of a particular pressure measurement without additional information. However, once the pressure at a particular location and elevation is determined, the pressure can be calculated at any other altitude. Mathematically, atmospheric pressure is exponentially related to altitude. This particular system is designed to track variations in barometric pressure once it is calibrated to a known pressure reference at a given altitude. For simplification, the standard atmospheric pressure at sea level is assumed to be 29.9 in-Hg. "Standard" barometric pressure is rneasured at particular altitude at the average weather conditions for that altitude over time. The system described in this text is specified to accurately measure barometric pressure variations up to altitudes of 15,000 ft. This altitude corresponds to a standard pressure of approximately 15.0 in-Hg. As a result of changing weather conditions, the standard pressure at a given altitude can fluctuate approximately ±1 in-Hg. in either direction. Table 1 indicates standard barometric pressures at several altitudes of interest. Altitude (Ft.) Pressure (in-Hg) 0 29.92 500 29.36 1,000 26.65 6,000 23.97 10,000 20.57 15,000 16.66 SYSTEM OVERVIEW In order to measure and display the correct barometric pressure, this system must perform several tasks. The rneasurement strategy is outlined below in Figure 2. First, pressure is applied to the sensor. This produces a proportional differential output voltage in the millivolt range. This signal must then be amplified and level-shifted to a single-ended, microcontroller (MCU) cornpatible level (0.5 - 4.5 V) by a signal conditioning circuit. The MCU will then sample the voltage at the analog-ta-digital converter (AID) channel input, convert the digital measurement value to inches of mercury, and then display the correct pressure via the LCD interface. This process is repeated continuously. There are several significant performance features implemented into this system design. First, the system will digitally display barometric pressure in inches of mercury, with a resolution of approximately one-tenth of an inch of rnercury. In order to allow for operation over a wide altitude range (015,000 ft.), the system is designed to display barometric pressures ranging from 30.5 in-Hg. to a minimum of 15 ..0 in-Hg. The display will read "10" if the pressure rneasured IS below 30.5 in-Hg. These pressures allow for the system to operate with the desired resolution in the range from sea-level to approximately 15,000 ft. An overview of these features is shown in Table 2. Table 2. System Features Overview Display Units MPX2100AP PRESSURE SENSOR MC6BHC11E9 MICROCONTROLLER CLOCKSYNCH Resolution in-Hg 0.1 in-Hg. System Range 15.0 - 30.5 in-Hg. Altitude Range 0-15,000 ft. DATA .----''----'--.., DESIGN OVERVIEW 4-DIGITLCD & MC145453 DISPLAY DRIVER Figure 2. Barometer System Block Diagram Motorola Sensor Device Data The following sections are included to detail the system design. The overall system will be described by considering the subsystems depicted in the system block diagram, Figure 2. The design of each subsystem and its function in the overall system will be presented. 4 123 AN1326 Table 3. MPX2100AP Electrical Characteristics Characteristic Pressure Range Symbol Minimum POP Supply Voltage Vs Full Scale Span VFSS Zero Pressure Offset Typical Max Unit 100 kPa 10 16 Vdc 40 41.5 mV 0 38.5 ±1.0 VoH Sensitivity S mV 0.4 mvlkPa 0.05 %FSS Temperature EHect on Span 0.5 %FSS Temperature EHect on OHset 0.2 %FSS Linearity Pressure Sensor The first and most important subsystem is the pressure transducer. This device converts the applied pressure into a proportional, differential voltage signal. This output signal will vary linearly with pressure. Since the applied pressure in this application will approach a maximum level of 30.5 in-Hg. (100 kPa) at sea level, the sensor output must have a linear output response over this pressure range. Also, the applied pressure must be measured with respect to a known reference pressure, preferably absolute zero pressure (vacuum). The device should also produce a stable output over the entire operating temperature range. The desired sensor for this application is a temperature compensated and calibrated, semiconductor pressure transducer, such as the Motorola MPX2100A series sensor family. The MPX2000 series sensors are available in full-scale pressure ranges from 10 kPa (1.5 psi) to 200 kPa (30 psi). Furthermore, they are available in a variety of pressure configurations (gauge, differential, and absolute) and porting options. Because of the pressure ranges involved with barometric pressure measurement, this system will employ an MPX2100AP (absolute with single port). This device will produce a linear voltage output in the pressure range of 0 to 100 kPa. The ambient pressure applied to the single port will be measured with respect to an evacuated cavity (vacuum reference). The electrical characteristics for this device are summarized in Table 3. As indicated in Table 3, the sensor can be operated at different supply voltages. The full-scale output of the sensor, which is specified at 40 mV nominally for a supply voltage of 10 Vdc, changes linearly with supply voltage. All non-digital circuitry is operated at a regulated supply voltage of 8 Vdc. Therefore, the full-scale sensor output (also the output of the sensor at sea level) will be approximately 32 mV. (180 x 40 mv) The sensor output voltage at the systems minimum range (15 in-Hg.) is approximately 16.2 mV. Thus, the sensor output over the intended range of operations is expected to vary from 32 to 16.2 mV. These values can vary slightly for each sensor as the offset voltage and full-scale span tolerances indicate. 4-124 Signal Conditioning Circuitry In order to convert the small-signal differential output signal of the sensor to MCU compatible levels, the next subsystem includes signal conditioning circuitry. The operational amplifier circuit is designed to amplify, level-shift, and ground reference the output signal. The signal is converted to a single-ended, 0.5 - 4.5 Vdc range. The schematic for this amplifier is shown in Figure 3. This particular circuit is based on classic instrumentation amplifier design criteria. The differential output signal of the sensor is inverted, amplified, and then level-shifted by an adjustable offset voltage (through Roffset1 ). The offset voltage is adjusted to produce 0.5 volts at the maximum barometric pressure (30.5 in-Hg.). The output voltage will increase for decreasing pressure. If the output exceeds 5.1 V, a zener protection diode will clamp the output. This feature is included to protectthe AID channel input olthe MCU. Using the transfer function for this circuit, the offset voltage and gain can be determined to provide 0.1 in-Hg of system resolution and the desired output voltage level. The calculation of these parameters is illustrated below. In determining the amplifier gain and range of the trimmable offset voltage, it is necessary to calculate the number of steps used in the AID conversion process to resolve 0.1 in-Hg. . steps (30.5 - 15.0)In-Hg· 10 = 155 steps H9 The span voltage can now be determined. The resolution provided by an 8-bit AID converter with low and high voltage references of zero and five volts, respectively, will detect 19.5 mV of change per step. V RH = 5 V, V RL = 0 V = = Sensor Output at 30.5 in-Hg 32.44 mV Sensor Output at 15.0 in-Hg 16.26 mV LlSensor Output = LlSO = 16.18 mV Gain = 3.04 V LlSO = 187 Note: 30.5 in-Hg and 15.0 in-Hg are the assumed maximum and minimum absolute pressures, respectively. Motorola Sensor Device Data AN1326 This gain is then used to determine the appropriate resistor values and offset voltage for the amplifier circuit defined by the transfer function shown below. Vout =- [ a 16-bit timer, an SPI (Serial Peripheral Interface synchronous), and SCI (Serial Communications Interface asynchronous), and a maximum of 40 I/O lines. This device is available in several package configurations and product variations which include additional RAM, EEPROM, and/or I/O capability. The software used in this application was developed using the MC68HC11 EVB development system. The following software algorithm outlines the steps used to perform the desired digital processing. This system will convert the voltage at the AID input into a digital value, convert this measurement into inches of mercury, and output this data serially to an LCD display interface (through the on-board SPI). This process is outlined in greater detail below: :~ + 1]. ~V + V off ~V is the differential output of the sensor. The gain of 187 can be implemented with: R1 ~ R3 121 n R2 ~ R4 22.6 k n. = = Choosing Roffset1to be 1 kn and Roffset2to be 2.5 k n, Vout is 0.5 V at the presumed maximum barometric pressure of 30.5 in-Hg. The maximum pressure output voltage can be trimmed to a value other than 0.5 V, if desired via Roffset1. In addition, the trimmable offset resistor is incorporated to provide offset calibration if significant offset drift results from large weather fluctuations. The circuit shown in Figure 3 employs an MC33272 (Iow-cost, low--drift) dual operational amplifier IC. In order to control large supply voltage fluctuations, an 8 Vdc regulator, MC78L08ACP, is used. This design permits use of a battery for excitation. 1. 2. 3. 4. 5. 6a. 6b. 7. The signal conditioned sensor output signal is connected to pin PE5 (Port E-AID Input pin). The MCU communicates to the LCD display interface via the SPI protocol. A listing of the assembly language source code to implement these tasks is included in the appendix. In addition, the software can be downloaded directly from the Motorola MCU Freeware Bulletin Board (in the MCU directory). Further information is included at the beginning of the appendix. Microcontroller Interface The low cost of MCU devices has allowed for their use as a signal processing tool in many applications. The MCU used in this application, the MC68HC11, demonstrates the power of incorporating intelligence into such systems. The on-chip resources of the MC68HC11 include: an 8 channel, 8-bit AID, +12V Set up and enable AID converter and SPI interface. Initialize memory locations, initialize variables. Make AID conversion, store result. Convert digital value to inches of mercury. Determine if conversion is in system range. Convert pressure into decimal display digits. Otherwise, display range error message. Output result via SPI to LCD driver device. Ul MC78L08ACP VS=8V IN OUT~~~~------~----------------~ U28 MC33272 MPX2100AP GROUNO s- Cl O.3311F S.l V 4 2 ZENER 2 -= R3 Roffsetl 1kQ R4 22.6kQ 1121 Q U2A MC33272 Roffset2 L--+-~'V\Ar=--_--l 2.SkQ R2 22.6 kW Rl 121 Q Figure 3. Signal Conditioning Circuit Motorola Sensor Device Data 4-125 AN1326 LCD Interface In order to digitally display the barometric pressure conversion, a serial LCD interface was developed to communicate with the MCU. This system includes an MC145453 CMOS serial interface/LCD driver, and a 4-digit, non-multiplexed LCD. In order for the MCU to communicate correctly with the interface, it must serially transmit six bytes for each conversion. This includes a start byte, a byte for each of the four decimal display digits, and a stop byte. For formatting purposes, decimal points and blank digits can be displayed through appropriate bit patterns. The control of display digits and data transmission is ,executed in the source code through subroutines BCDCONV, LOOKUP, SPI2LCD, and TRANSFER. A block diagram of this interface is included below. CONCLUSION This digital barometer system described herein is an excellent example of a sensing system using solid state components and software to accurately measure barometric pressure. This system serves as a foundation from which more complex systems can be developed. The MPX2100A series pressure sensors provide the calibration and temperature compensation necessary to achieve the desired accuracy and interface simplicity for barometric pressure sensing applications. +5V -I I I- I I- I I- I BP 20 BP IN VDD BPOUT -I I I- I I- I I- I ------DIGIT1 OSCIN OUT 33 I MC68HC11 MOSI SCK DIGIT2 DIGIT3 DIGIT4 I II MC145453 DATA CLOCK VSS OUT1 Figure 4. LCD Display Interface Diagram 4-126 Motorola Sensor Device Data AN1326 APPENDIX MC68HC11 Barometer Software Available on: Motorola Electronic Bulletin Board MCU Freeware Line 8-bit, no parity, 1 stop bit 1200/300 baud (512) 891-FREE (3733) * BAROMETER APPLICATIONS PROJECT - Chris Winkler '" Developed: October 1st, 1992 - Motorola Discrete Applications * This code will be used to implement an MC68HCll Micro-Controller '" as a processing unit for a simple barometer system. '" The HCII will interface with an MPX2100AP to monitor, store * and display measured Barometric pressure via the a-bit AID channel * The sensor output (32rnv max) will be amplified to .5 - 2.5 V de '" The processor will interface with a 4-digit LCD (FE202) via '" a Motorola LCD driver (MC145453) to display the pressure '" within +/- one tenth of an inch of mercury. * The systems range is 15. a - 30.5 in-Hg AID & CPU Register Assignment This code will use index addressing to access the important control registers. All addressing will be indexed off of REGBASE, the base address for these registers. REGBASE EQU ADCTL ADR2 ADOPT PORTB PORTD DDRD SPCR SPSR SPDR $1000 EQU EQU EQU EQU EQU EQU EQU EQU EQU * $30 $32 $39 $04 $08 $09 $28 $29 $2A register base of control register * offset of AID control register * offset of AID results register * offset for AID option register location * Location of PORTB used for conversion * PORTO Data Register Index * offset of Data Direction Reg. * offset of SPI Control Reg. * offset of SPI Status Reg. * offset of SPI Data Reg. User Variables The following locations are used to store important measurements and calculations used in determining the al ti tude. They are located in the lower 256 bytes of user RAM DIGITI DIGIT2 DIGIT3 DIGIT4 COUNTER POFFSET SENSOUT RESULT FLAG EQU EQU EQU EQU EQU EQU EQU EQU $0001 $0002 $0003 $0004 $0005 $0010 $0012 $0014 EQU * BCD blank dig! t (not used) * BCD tens digit for pressure ·· · storage Location for max pressure offset storage location for previous conversion Storage of Pressure (in Hg) in hex format * Determines if measurement is within range * BCD tenths digit for pressure * BCD ones digit for pressure * Variable to send 5 dummy bytes $0016 MAIN PROGRAM The conversion process involves the following steps: l. 2. 3. 4. 5. b. 6. 7. 8. Set-Up SPI deviceSet-up AID, Constants Read AID, store sample Convert into 1n-Hg Determine FLAG condition IN_HG Display error ContinUe Conversion Can vert hex to BCD format BCDCONV Convert LCD display digits Output via SPI to LCD SPCCNFG SET_UP ADCONV IN_HG ERROR INRANGE LOOKUP SPI2LCD This process is continually repeated as the loop CONVERT runs unconditionally through BRA (the BRANCH ALWAYS statement) Repeats to step 3 indefinitely. Motorola Sensor Device Data 4-127 AN1326 CONVERT BSR ORG scooo LDX #REGBASE BSR SPI_CNFG SET_UP BSR ADCONV BSR BSR DELAY IN_HG * DESIGNATES START OF MEMORY MAP FOR * Location of base register for indirect, adr * USER CODE set-up SPI Module for data x-mit to LCD * power-Up A/D, initialize constants * Calls subroutine to make an AID conversion * Delay routine to prevent LCD flickering * Converts hex format to in of H9 The value of FLAG passed from IN_HG is used to determine If a range error has occurred. The following logical statements are used to either allow further conversion or jump to a routine to display a range error message. LDAB CMPB BEQ BSR BRA * Determines if an range Error has oeurred • If No Error detected (FLAG-SaO) then system will continue conversion process * If error occurs (FLAG<>BO), branch to ERROR * Branches to output ERROR code to display FLAG i$BO INRANGE ERROR OUTPUT No Error Detected, Conversion Process Continues INRANGE JSR BCDCONV JSR LOOKUP * OUTPUT JSR SPI2LCD BRA CONVERT * Output transmission to LCD * continually converts using Branch Always Converts Hex Result to BCD * Uses Look-Up Table for BCD-Decimal Subroutine 5PI_CNFG Purpose is to initialize SPI for transmission and clear the display before conversion. PORTD,X #$20 LDAA ij$38 STAA DDRD,X LDAA STAA SPCR,X LDAA STAA LDAA SPSR,X i$5D i$5 COUNTER * Set SPI 55 Line High to prevent glitch * Initializing Data Direction for Port D * Selecting 55, MOSI, SCK as outputs only * Initialize SPI-Control Register * selecting SPE,M5TR,CPOL,CPHA,CPRO * sets counter to x-mit 5 blank bytes * Must read SPSR to clear SPIF Flag * Transmission of Blank Bytes to LCD CLRA ERASELCD JSR TRANSFER DEC COUNTER BNE ERASELCD * Calls subroutine to transmit RTS SET_UP Subroutine SET_UP purpose is to initialize constants and to power-up AID and to initialize POFFSET used in conversion purposes. LDAA #$90 * selects ADPU bit in OPTION register STAA ADOPT, X * power-up of A/D complete LOO #$0131+$OOlA * Initialize POFFSET STO POFFSET * POFFSET - 305 - 25 in hex LDAA #$00 * or Pmax + offset voltage (5 V) RTS Subroutine DELAY purpose is to delay the conversion process to minimize LCD flickering. DELAY OUTLOOP INLOOP LDB DECB LDA #$FF #$FF BNE DECA BNE RTS INLOOP * Loop for delay of display * Delay - clk/255*255 OUTLOOP Subroutine ADCONV Purpose is to read the AID input, store the conversion into SENSOUT. For conversion purposes later. ADCONV LDX 4-128 * loads base register for indirect addressing #REGBASE LDAA STAA #$25 ADCTL,X * initializes AID cont. register SCAN=l,MULT=O Motorola Sensor Device Data AN1326 WTCONV BRCLR ADCTL, x LDAB CLRA #-$80 WTCONV ADR2, X * STD RTS SENSOU'T * Stores conversion as SENSOUT * Wait for completion of conversion flag Loads conversion result into Accumulator subroutine IN_HG purpose is to convert the measured pressure SENSOUT, into units of in-Hg, represented by a hex value of 305-150 This represents the range 30.5 - 15.0 in-Hg LDD POFFSET * Loads maximum offset for subtraction SUBD SENSOUT * RESULT - POFFSET-SENSOUT in hex format STD * Stores hex result for P, in Hg RESULT CMPD 005 BHI TOHIGH CMPD <150 BLO TOLOW LDAB STAB BRA TOHIGH LDAB '$FF STAB 'rOLOW '$80 FLAG END_CONY BRA FLAG END_CONY LDAB STAB FLAG .$00 END_CONY RT S Subroutine ERROR This subroutine sets the display digits to output an error message having detected an out of range measurement in the main program from FLAG ERROR LDAB '$00 STAB DIGITI DIGIT4 STAB SET_HI * If above range GOTO SET_HI '$OE * ELSE display LO on display * Set DIGIT2=L, DIGIT3=O STAB LDAB STAB DIGIT2 #-$7E DIGIT3 END_ERR LOX IOlV STAB DEY CPX * GOTO exit of subroutine * Set DIGIT2-H, '$30 convert ALTITUDE from hex to BCD HEX-BCD conversion scheme store Remainder, swap Q & R, repeat remainder - o . * Default Digits 2,3,4 to 0 DIGIT2 DIGIT3 DIGIT4 #DIGlT4 RESULT * Conversion starts with lowest digit * Load voltage to be converted * 0, Y Divide hex digit by 10 * Quotient in x, Remainder in D * stores 8 LSB' s of remainder as BCD digit * Determines if last digit stored '$0 XGDX BNE LOX RTS DIGIT3~1 DIGIT3 • $00 LOY LDD '$A if above or below range . DIGIT2 Subroutine BCDCONV purpose is to uses standard Divide HEX/IO process until STAA STAA STAA * • $00 '$37 CONVLP * FLAG is used to determine FLAG BNE BRA LDAA 1, 4 to blanks LDAB CMPB LDAB STAB LDAB STAB BCOCONV * Initialize digits 1< CONVLP #REGBASE * Exchanges remainder & quotient Reloads BASE into main program Subrou tine LOOKUP Motorola Sensor Device Data 4-129 AN1326 purpose is to implement a Look-Up conversion The BCD is used to index off of TABLE where the appropriate hex code to display that decimal digit is contained. DIGIT4, 3,2 are converted only. LOOKUP TABLOOP LDX DEX #DIGITl+4 LDY LDAB ABY LDAA STAA CPX BNE #TABLE O,X O,Y O,X #DIGIT2 * Counter starts at 5 * Start with Digit4 * Loads table base into Y-pointer * Loads current digit into B * Adds to base to index off TABLE 'It Stores HEX segment result in A * Loop condition complete, DIGIT2 Converted TABLOOP RTS Subroutine SPI2LCD purpose is to output dig! ts to LCD via SPI The format for this 1s to send a start byte, four dig! ts, and a stop byte. This system will have 3 significant digits: blank digit and three decimal dig i ts . Sending LCD Start Byte SPI2LCD LDX #REGBASE LDAA LDAA BSR SPSR,X #$02 LDAA ORA STAA DIGIT3 #$80 DIGIT3 LDAA STAA #$00 DIGITl TRANSFER * Reads to clear SPIF flag * Byte, no colon, start bit * Transmit byte In1 tializing decimal point & blank dig! t * Sets MSB for decimal pt. * after digit 3 * Set 1st digit as blank Sending four decimal digits LDY DLOOP LDAA BSR INY CPY BNE #DIGITl 0, Y TRANSFER * Pointer set to send 4 bytes * Loads digit to be x-mitted * Transml t byte * Branch until both bytes sent #DIGIT4+1 DLOOP Sending LCD Stop Byte LDAA BSR #$00 TRANSFER * * end byte requires all 0 I Transmit byte S RTS Subroutine TRANSFER purpose is to send data bits to SPI and wait for conversion complete flag bit to be set. TRANSFER LDX XMIT #REGBASE PORTD,X #$20 BCLR * STAA SPDR,X * BRCLR SPSR,X #$80 XMIT* PORTD,X #$20 BSET * LDAB SPSR,X Assert 55 Line to start x-misssion Load Data into Data Reg. lx-mit Wait for flag DISASSERT 55 Line * Read to Clear SPI Flag RTS Location for FCB memory for look-up table There are 11 possible digits: blank, 0-9 TABLE 4-130 FCB END $7E, $30, $6D, $79, $33, $SB, $SF, $70, $7F, $73, $00 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1513 Mounting Techniques and Plumbing Options of Motorola's MPX Series Pressure Sensors Prepared by: Brian Pickard Sensor Products Division Semiconductor Products Sector INTRODUCTION Motorola offers a wide variety of ported, pressure sensing devices which incorporate a hose barb and mounting tabs. They were designed to give the widest range of design flexibility. The hose barbs are 1/8" (~3 mm) diameter and the tabs have #6 mounting holes. These sizes are very common and should make installation relatively simple. More importantly, and often overlooked, are the techniques used in mounting and adapting the ported pressure sensors. This application note provides some recommendations on types of fasteners for mounting, how to use them with Motorola sensors, and identifies some suppliers. This document also recommends a variety of hoses, hose clamps, and their respective suppliers. This information applies to all Motorola MPX pressure sensors with ported packages, which includes the packages shown in Figure 1. A review of recommended mounting hardware, mounting torque, hose applications, and hose clamps is also provided for reference. MOUNTING HARDWARE Mounting hardware is an integral part of package design. Different applications will call for different types of hardware. When choosing mounting hardware, there are three important factors: • permanent versus removable • application • cost The purpose of mounting hardware is not only to secure the sensor in place, but also to remove the stresses from the sensor leads. In addition, these stresses can be high if the hose is not properly secured to the sensor port. Screws, rivets, push-pins, and clips are a few types of hardware that can be used. Refer to Figure 2. Single Side Port Differential Port Axial Port Stovepipe Port Screw Figure 1. MPX Pressure Sensors with Ported Packages Motorola Sensor Device Data Rivet Push-Pin Figure 2. Mounting Hardware 4-131 AN1513 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI YI4.5M. 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V PLANE SEATING i T- INCHES MIN MAX 1.100 1.200 0.740 0.760 0.635 0.650 0.016 0.020 0.160 0.180 0.048 0.052 0.100BSC 0.014 0.016 0.230 REF 0.070 0.080 0.150 0.160 0.150 0.160 0.445 0.460 0.685 0.715 0840 0.860 0.185 0.195 MILLIMETERS MIN MAX 27.94 3D.48 18.80 19.30 16.13 16.51 0.41 0.50 4.06 4.57 1.22 1.32 2.54BSC 0.36 0.40 5.84 REF 1.78 2.03 381 4.06 3.81 4.06 11.30 11.68 17.40 18.16 21.33 21.84 4.69 4.95 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI YI4.5.1982. 2. CONTROLLING DIMENSION: INCH. R PORTtl POSITIVE PRESSURE -Q- DIM A B C D F G H J K L N P [§@,O.25(O.OI0)@ITla ®I Q F R S G D 4PL U INCHES MIN MAX 1.140 1.180 0.685 0.751 0.305 0.321 0.016 0.020 0.048 0.052 0.100BSC 0.182 0.194 0.014 0.016 0.685 0.715 0.290 0.300 0.420 0.440 0.153 0.158 0.153 0.158 0.231 0.250 0230 REF 0.910BSC MIWMETERS MIN MAX 28.95 29.97 17.39 18.16 7.74 8.15 0.40 0.50 1.21 1.32 2.54BSC 4.82 4.92 0.35 0.40 17.39 18.16 7.34 7.62 10.67 11.12 3.88 4.01 4.01 3.88 5.86 6.35 584 REF 23.11 BSC 1$IO.13(O.005)@ITls ®la®1 Figure 3. Case Outline Drawings Top: Case 371 D-02, Issue B BoHom: Case 350-03, Issue H To mount any of the devices except Case 371-05/06 and 867E) to a flat surface such as a circuit board, the spacing and diameter for the mounting holes should be made according to Figure 3. Mounting Screws Mounting screws are recommended for making a very secure, yet removable connection. The screws can be either metal or nylon, depending on the application. The holes are 0.155" diameter which fits a #6 machine screw. The screw can be threaded directly into the base mounting surface or go through the base and use a flat washer and nut (on a circuit board) to secure to the device. MOUNTING TORQUE The torque specifications are very important. The sensor package should not be over tightened because it can crack, causing the sensor to leak. The recommended torque specification for the sensor packages are as follows: 4-132 Port Style Single side port: port side down port side up Differential port (dual port) Axial side port Torque Range 3-4 in-Ib 6-7 in-Ib 9-10 in-Ib 9-10 in-Ib The torque range is based on installation at room temperature. Since the sensor thermoplastic material has a higher TCE (temperature coefficient of expansion) than common metals, the torque will increase as temperature increases. Therefore, if the device will be subjected to very low temperatures, the torque may need to be increased slightly. If a precision torque wrench is not available, these torques all work out to be roughly 1/2 of a turn past ''finger tight" (contact) at room temperature. lightening beyond these recommendations may damage the package, or affect the performance of the device. Motorola Sensor Device Data AN1513 Nylon Screws Motorola recommends the use of #6-32 nylon screws as a hardware option. However, they should not be torqued excessively. The nylon screw will twist and deform under higher than recommended torque. These screws should be used with a nylon nut. Rivets Rivets are excellent fasteners which are strong and very inexpensive. However, they are a permanent connection. Plastic rivets are recommended because metal rivets may damage the plastic package. When selecting a rivet size, the most important dimension, besides diameter, is the grip range. The grip range is the combined thickness of the sensor package and the thickness of the mounting surface. Package thicknesses are listed below. Port Style Thickness, a Single side port Dual side port Axia[ side port Stovepipe port 0.321" (8.15 mm) 0.420" (10.66 mm) 0.321" (8.15 mm) (Does not apply) listed later in this application note. Two brands of vinyl hose are: Hose Wall Thickness Max. Press. @70'F (24'C) Max. Temp. ('F)J('C) Clippard #3814-1 Herco Clear #0500-037 1/16" 1/16" 105 54 100/(38) 180/(82) Tygon tubing is slight[y more expensive than vinyl, but it is the most common brand, and it is also very f[exible. [t also is recommended for use at room temperature and applications below 50 psig. This tubing is also recommended for applications where the hose may be removed and reattached several times. This tubing should also be used with a hose clamp. Grip Range = a + b Tubing Tygon 6-44-3 Wall Thickness Max. Press. @73'F (2S'C) Max. Temp. ('F)J('C) 1/16" 62 165/(74) Push-Pins Plastic push pins or ITW FasTex "Christmas Tree" pins are an excellent way to make a low cost and easily removable connection. However, these fasteners should not be used for permanent connections. Remember, the fastener should take all of the static and dynamic loads off the sensor leads. This type of fastener does not do this complete[y. Urethane tubing is the most expensive of the four types described herein. [t can be used at higher pressures (up to 100 psig) and temperatures up to 100°F (38°C). It is flexible, although its f[exibility is not as good as vinyl or Tygon. Urethane tubing is very strong and it is not necessary to use a hose clamp, although it is recommended. Two brands of urethane hose are: HOSE APPLICATIONS By using a hose, a sensor can be located in a convenient place away from the actual sensing location which could be a hazardous and difficult area to reach. There are many types of hoses on the market. They have different wall thicknesses, working pressures, working temperatures, material compositions, and media compatibilities. All of the hoses referenced here are 1/8" inside diameter and 1/16" wall thickness, which produces a 1/4" outside diameter. Since all the port hose barbs are 1/8", they require 1/8" inside diameter hose. The intent is for use in air only and any questions about hoses for your specific application should be directed to the hose manufacturer. Four main types of hose are avai[able: • Vinyl • Tygon • Urethane • Ny[on Vinyl hose is inexpensive and is best in applications with pressures under 50 psig and at room temperature. [t is f[exible and durable and should not crack or deteriorate with age. This type of hose should be used with a hose clamp such as those Motoro[a Sensor Device Data Hose Wall Thickness Max. Press. @70'F (24'C) Max. Temp. ('F)/('C) Clippard #3814-6 Herco Clear #0585-037 1/16" 1/16" 105 105 120/(49) 225/(107) Nylon tubing does not work well with Motoro[a's sensors. It is typically used in high pressure applications with metal fittings (such as compressed air). HOSE CLAMPS Hose clamps should be employed for use with all hoses listed above. They provide a strong connection with the sensor which prevents the hose from working itself off, and also reduces the chance of leakage. There are many types of hose clamps that can be used with the ported sensors. Here are some of the most common hose clamps used with hoses. 4-133 AN1513 Crimp-on Clamp Nylon Snap Spring Wire Screw-on The two clamps most recommended by Motorola are the crimp-on clamp and the screw-on, Clippard reusable clamp. The crimp-on type clamp is offered from both Ryan Herco (#0929-007) and Clippard (#5000-2). Once crimped in place, it provides a very secure hold, but it is not easily removed and is not reusable. The Clippard, reusable hose clamp is a brass, self-threading clamp, which provides an equally strong grip as the crimp-on type just described. The drawback is the reusable clamp is considerably more expensive. The nylon snap is also reusable, however the size options do not match the necessary outside diameter. The spring wire clamp, common in the automotive industry, and known for its very low cost and ease of use, also has a size matching problem. Custom fit spring wire clamps may provide some cost savings in particular applications. Figure 4. Hose Clamps SUPPLIER LIST Hoses Norton-Performance Plastics Worldwide Headquarters 150 Dey Road, Wayne, NJ 07470-4599 USA (201) 596-4700 Telex: 710-988-5834 USA P.O. Box 3660, Akron, OH 44309-3660 USA (216) 798-9240 FAX: (216) 791HJ358 Clippard Instrument Laboratory, Inc. 7390 Colerain Rd. Cincinnati, Ohio 45239, USA (513) 521-4261 FAX: (513) 521-4464 Ryan Herco Products Corporation P.O. Box 588 Burbank, CA 91503 1--800-423-2589 FAX: (818) 842-4488 4-134 Spring Wire Clamps RotorClip, Inc. 187 Davidson Avenue Somerset, NJ 0887!Hl461 1-800-631-5857 Ext. 255 Bolts Quality Screw and Nut Company 1331 Jarvis Avenue Elk Grove Village, IL 60007 (312) 593-1600 Rivets and Push-Pins ITW FasTex 195 Algonquin Road Des Plaines, IL 60016 (708) 299-2222 FAX: (708) 390-8727 Crimp-on and Nylon Clamps Ryan Herco Products Corporation P.O. Box 588 Burbank, CA 91503 1--800-423-2589 FAX: (818) 842-4488 Crimp-on and Screw-on Clamps Clippard Instrument Laboratory, Inc. 7390 Colerain Rd. CinCinnati, Ohio 45239, USA (513) 521-4261 FAX: (513) 521-4464 Motorola Sensor Device Data MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1516 Liquid Level Control Using a Motorola Pressure Sensor Prepared by: JC Hamelain Toulouse Pressure Sensor Laboratory Semiconductor Products Sector, Toulouse, France INTRODUCTION Motorola Discrete Products provides a complete solution for designing a low cost system for direct and accurate liquid level control using an ac powered pump or solenoid valve. This circuit approach which exclusively uses Motorola semiconductor parts, incorporates a piezoresistive pressure sensor with on-chip temperature compensation and a new solid-state relay with an integrated power triac, to drive directly the liquid level control equipment from the domestic 110/220 V 50/60 Hz ac main power line. PRESSURE SENSOR DESCRIPTION Depending on the application and pressure range, the sensor may be chosen from the following portfolio. Forthis application the MPX201 ODP was selected. Device Pressure Range MPX2010DP o to 10 kPa o to 50 kPa MPX2050DP MPX2100DP o to 100 kPa MPX2200DP o to 200 kPa * after proper gain adjustment Application Sensitivity* ± 0.01 kPa (1 mm H20) ± 0.05 kPa (5 mm H20) ± 0.1 kPa (10 mm H20) ± 0.2 kPa (20 mm H20) The MPX2000 Series pressure sensor integrates on-chip, laser-trimmed resistors for offset calibration and temperature compensation. The pressure sensitive element is a patented, single piezoresistive implant which replaces the four resistor Wheatstone bridge traditionally used by most pressure sensor manufacturers. Pin 2 r--A,t)(IV------1--<> + Vout Pin 4 '---+------+---0 - Vout BASIC CHIP CARRIER ELEMENT CASE 344 Motorola Sensor Device Data DIFFERENTIAL PORT OPTION CASE 352 ;pi. Laser Trimmed On-Chip Figure 1. Pressure Sensor MPX2000 Series 4-135 AN1516 POWER OPTO ISOLATOR M0C2A60 DESCRIPTION The MOC2A60 is a new Motorola POWER OPTOTM isolator and consists of a gallium arsenide, infrared emitting diode, which is optically coupled to a zero-cross triac driver and a power triac. It is capable of driving a load of up to 2 A (rms) directly from a line voltage of 220 V (50/60 Hz). Device Schematic CASE 417 PLASTIC PACKAGE • Zero Voltage Activate Circuit 1,4,5,6,8. 2. 3. 7. 9. No Pin LED Cathode LED Anode Main Terminal Main Terminal Figure 2. MOC2A60 POWER OPTO Isolator SIGNAL CONDITIONING When a full range pressure is applied to the MPX2010DP, it will provide an output of about 20 mV (at an B V supply). Therefore, for an application using only a few percent of the pressure range, the available signal may be as low as a few hundred microvolts. To be useful, the sensor signal must be amplified. This is achieved via a true differential amplifier (A1 and A2) as shown in Figure 4. The GAIN ADJ (500 ohm) resistor, RG, sets the gain to about 200. The differential output of this stage is amplified by a second stage (A3) with a variable OFFSET resistor. This stage performs a differential to single-ended output conversion and references this output to the adjustable offset voltage. This output is then compared to a voltage (VREF = 4 V at TP2) at the input of the third stage (A4). This last amplifier is used as an inverted comparator amplifier with hysteresis (Schmitt trigger) which provides a logic signal (TP3) within a preset range variation of about 10% of the input (selected by the ratio R9/(R9 + R7). If the pressure sensor delivers a voltage to the input of the Schmitt trigger (pin 13) lower than the reference voltage (pin 12), then the output voltage (pin 14) is high and the drive current for the power stage MOC2A60 is provided. When the 4-136 sensor output increases above the reference voltage, the output at pin 14 goes low and no drive current is available. The amplifier used is a Motorola MC33179. This is a quad amplifier with large current output drive capability (more than 80mA). OUTPUT POWER STAGE For safety reasons, it is important to prevent any direct contact between the ac main power line and the liquid environment or the tank. In order to maintain full isolation between the sensor circuitry and the main power, the solid-state relay is placed between the low voltage circuit (sensor and amplifier) and the ac power line used by the pump and compressor. The output of the last stage of the MC33179 is used as a current source to drive the LED (light emitting diode). The series resistor, RB, limits the current into the LED to approximately 15 mA and guarantees an optimum drive forthe power opto-triac. The LD1 (MFOE76), which is an infrared light emitting diode, is used as an indicator to detect when the load is under power. The MOC2A60 works like a switch to turn ON or OFF the pump's power source. This device can drive up to 2 A for an ac load and is perfectly suited for the medium power motors (less than 500 watts) used in many applications. It consists of an opto-triac driving a power triac and has a zero-crossing detection to limit the power line disturbance problems when fast switching sellic loads. An RC network, placed in parallel with the output of the solid-state relay is not required, but it is good design practice for managing large voltage spikes coming from the inductive load commutation. The load itself (motor or solenoid valve) is connected in series with the solid-state relay to the main power line. EXAMPLE OF APPLICATION: ACCURATE LIQUID LEVEL MONITORING The purpose of the described application is to provide an electronic system which maintains a constant liquid level in a tank (within ± 5 mm H20). The liquid level is kept constant in the tank by an ac electric pump and a pressure sensor which provides the feedback information. The tank may be of any size. The application is not affected by the volume of the tank but only by the difference in the liquid level. Of course, the maximum level in the tank must correspond to a pressure within the operating range of the pressure sensor. LIQUID LEVEL SENSORS Motorola has developed a piezoresistive pressure sensor family which is very well adapted for level sensing, especially when using an air pipe sensing method. These devices may also be used with a bubbling method or equivalent. Motorola Sensor Device Data AN1516 AC Line Open Pipe Before Calibralion \ Reference Level Liquid Level in Ihe Pipe Figure 3. Liquid Level Monitoring LEVEL SENSING THEORY corresponds to the change in the tank level is measured by the pressure sensor. If a pipe is placed vertically, with one end dipped into a liquid and the other end opened, the level in the pipe will be exactly the same as the level in the tank. However, if the upper end of the pipe is closed off and some air volume is trapped, the pressure in the pipe will vary proportionally with the liquid level change in the tank. For example, if we assume that the liquid is water and that the water level rises in the tank by 10 mm, then the pressure in the pipe will increase by that same value (10 mm of water). A gauge pressure sensor has one side connected to the pipe (pressure side) and the other side open to ambient (in this case, atmospheric) pressure. The pressure difference which PRESSURE SENSOR CHOICE In this example, a level sensing of 10 mm of water is desired. The equivalent pressure in kilo pascals is 0.09806 kPa. In this case, Motorola's temperature compensated 0-10 kPa, MPX2010 is an excellent choice. The sensor output, with a pressure of 0.09806 kPa applied, will result in 2.0 mV/kPa x 0.09806 = 0.196 mV. The sensing system is designed with an amplifier gain of about 1000. Thus, the conditioned signal voltage given by the module is 1000 x 0.196 mV = 0.196 V with 10 mm - H20 pressure. Table 1. Liquid Level Sensors METHOD SENSOR ADVANTAGE DISADVANTAGES Magnetoresitive Low power, no active electronic Low resolution, range limited Magnetoresitive Very high resolution Complex electronic Ultrasonic Easy to install Need high power, low accuracy No active electronic No active electronic Low resolution, liquid dependent String potentiometer Potentiometer Low power, no active electronic Poor linearity, corrosion Pressure Silicon sensors Inexpensive good resolution, wide range measurements Active electronic, need power Liquid weight Liquid resistivity Motorola Sensor Device Data 4-137 AN1516 - P TR I~ I I 220VAC Reference ADJ Offset Adjust RIO Roff I I I Rll N MPX2010DP I I I R7 Motorl \ ( TPI \ ) '-./ R6 MOC2A60 RB R4 Dl R5 R C ~ ~ I I I I I ..J TP3 RG = 500n Rl. R2 = 100 k R5. R7 100 k R3. R4 ... R6 = 10 k R9 ... Rll 10 k R8 = 100 Roff= 25 kvar = Figure 4. Electrical Circuit = al ... a4 = 1/4 MC33179 01 = MLE076 MC7808ac REGL 8 VOC TR = TRANSFORMER 220:12 V Cl 40 I'F 40 V = = Liquid Level 4.3V Pressure Sensing (TP1) 7V Trigger Voltage (TP3) Pump Voltage (AC220V) Sensing for minimum level (pumping into the tank) The sensing probe is tied to the positive pressure port of the sensor. The pump is turned on to fill the tank when the minimum level is reached. Figure 5. Functional Diagram 4-138 Motorola Sensor Device Data AN1516 LEVEL CONTROL MODES This application describes two ways to keep the liquid level constant in the tank; first, by pumping the water out if the liquid level rises above the reference, or second, by pumping the water in if the liquid level drops below the reference. If pumping water out, the pump must be OFF when the liquid level is below the reference level. To turn the pump ON, the sensor signal must be decreased to drop the input to the Schmitt trigger below the reference Voltage. To do this, the sensing pipe must be connected to the NEGATIVE pressure port (back or vacuum side) ofthe sensor. In the condition when the pressure increases (liquid level rises), the sensor voltage will decrease and the pump will turn ON when the sensor output crosses the referenced level. As pumping continues, the level in the tank decreases (thus the pressure on the sensor decreases) and the sensor signal increases back up to the trigger point where the pump was turned OFF. In the case of pumping water into the tank, the pump must be OFF when the liquid level is above the reference level. To turn ON the pump, the sensor signal must be decreased to drive the input Schmitt trigger below the reference voltage. To do this, the sensing pipe must be connected to the POSITIVE pressure port (top side) of the sensor. In this configuration when the pressure on the sensor decreases, (liquid level drops) the sensor voltage also decreases and the pump is turned ON when the signal exceeds the reference. As pumping continues, the water level increases and when the maximum level is reached, the Schmitt trigger turns the pump OFF. ADJUSTMENTS The sensing tube is placed into the water at a distance below the minimum limit level anywhere in the tank. The other Motorola Sensor Device Data end of the tube is opened to atmosphere. When the tank is filled to the desired maximum (or minimum) level, the pressure sensor is connected to the tube with the desired port configuration for the application. Then the water level in the tank is the reference. After connecting the tube to the pressure sensor, the module must be adjusted to control the water level. The output voltage at TP1 is preadjusted to about 4 V (half of the supply voltage). When the sensor is connected to the tube, the module output is ON (lighted) or OFF. By adjusting the offset adjust potentiometer the output is just turned into the other state: OFF, if it was ON or the reverse, ON, if it was OFF, (the change in the tank level may be simulated by moving the sensing tube up or down). The reference point TP2 shows the ON/OFF reference voltage, and the switching point of the module is reached when the voltage at TP1 just crosses the value of the TP2 Voltage. The module is designed for about 10 mm of difference level between ON and OFF (hysteresis). CONCLUSION This circuit design concept may be used to evaluate Motorola pressure sensors used as a liquid level switch. This basic circuit may be easily modified to provide an analog signal of the level within the controlled range. It may also be easily modified to provide tighter level control (±2 mm H20) by increasing the gain of the first amplifier stage (decreasing RG resistor). The circuit is also a useful tool to evaluate the performance of the power optocoupler MOC2A60 when driving ac loads directly. 4-139 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1517 Pressure Switch Design with Semiconductor Pressure Sensors Prepared by: Eric Jacobsen and Jeff Baum Sensor Design and Applications Group, Motorola Phoenix, AZ them in overall performance (i.e., switching speed, logiC-level voltages, etc.). INTRODUCTION The Pressure Switch concept is simple, as are the additions to conventional signal conditioning circuitry required to provide a pressure threshold (or thresholds) at which the output switches logic state. This logic-level output may be input to a microcontroller, drive an LED, control an electronic switch, etc. The user-programmed threshold (or reference voltage) determines the pressure at which the output state will switch. An additional feature of this minimal component design is an optional user-defined hysteresis setting that will eliminate multiple output transitions when the pressure sensor voltage is comparable to the threshold voltage. This paper presents the characteristics and design criteria for each of the major subsystems of the pressure switch design: the pressure sensor, the signal conditioning (gain) stage, and the comparator output stage. Additionally, an entire section will be devoted to comparator circuit topologies which employ comparator les and/or operational amplifiers. A window comparator design (high and low thresholds) is also included. This section will discuss the characteristics and design criteria for each comparator circuit, while evaluating BASIC SENSOR OPERATION Motorola's MPX2000 Series sensors are temperature compensated and calibrated (i.e., offset and full-scale span are precision trimmed) pressure transducers. These sensors are available in full-scale pressure ranges from 10 kPa (1.5 psi) to 700 kPa (100 psi). Although the specifications (see Table 1) in the data sheets apply only to a 10 V supply voltage, the output of these devices is ratiometric with the supply voltage. For example, at the absolute maximum supply voltage rating, 16 V, the sensor will produce a differential output voltage of 64 mV at the rated full-scale pressure of the given sensor. One exception to this is that the full-scale span of the MPX2010 (10 kPa sensor) will be only40 mV due to the device's slightly lower sensitivity. Since the maximum supply voltage jJroduces the most output voltage, it is evident that even the best case scenario will require some signal conditioning to obtain a usable voltage level. For this specific deSign, an MPX2100 and 5.0 V supply is used to provide a maximum sensor output of 20 mY. The sensor output is then signal conditioned to obtain a four volt signal swing (span). Table 1. MPX2100 Electrical Characteristics for Vs = 10 V, TA = 25°C Characteristic Symbol Minimum Pressure Range POP a Supply Voltage Vs Full Scale Span VFSS Zero Pressure Offset Sensitivity Typical Max Unit 100 kPa 10 16 Vdc mV 40 41.5 Voff 0.05 0.1 S 0.4 mV/kPa 38.5 mV Linearity 0.05 %FSS Temperature Effect on Span 0.5 %FSS Temperature Effect on Offset 0.2 %FSS REV 1 4-140 Motorola Sensor Device Data AN1517 THE SIGNAL CONDITIONING For this specific design, the gain is set to 201 by setting R6 = 20 kQ and R5 = 100 n. Using these values and setting R6 = R3 and R4 = R5 gives the desired gain without loading the reference voltage divider formed by R1 and Roff. The offset voltage is set via this voltage divider by choosing the value of Roff. This enables the user to adjust the offset for each application's requirements. The amplifier circuitry, shown in Figure 1, is composed of two op-amps. This interface circuit has a much lower component count than conventional quad op amp instrumentation amplifiers. The two op amp design offers the high input impedance, low output impedance, and high gain desired for a transducer interface, while performing a differential to single-ended conversion. The gain is set by the following equation: GAIN = 1 + R6 R5 where R6 = R3 and R4 = R5. r--------------, Comparator Stage I I I I I I I I I I I I I I I I I R7 10.0kQ r---------------,I AmplifIer Stage I I r---~------~R~4----------~~R~6--~1 20kQ R1 12.1 ill U1 + Roft R5 100Q I I I I I I I I I _ _ _ _ _ _ .JI + U1 LM324D r- I I I I I IL _ _ _-=_ _ _ _ ...l I I I I I U1 r---+---j rl-+--\o GND +5V V4 Q1 MMBT3904LT1 RTH 10kQ RH 121 kQ CN1 +--H--toVout + I I I I II I I I IL R10 24.3 kQ 1 I _ _ _ _ _ _ _ _ _ _ _ _ _ _ .J Figure 1. Pressure Switch Schematic Pressure Sensor THE COMPARISON STAGE The comparison stage is the "heart" of the pressure switch design. This stage converts the analog voltage output to a digital output, as dictated by the comparator's threshold. The comparison stage has a few design issues which must be addressed: o o The threshold for which the output switches must be programmable. The threshold is easily set by dividing the supply voltage with resistors R7 and RTH. In Figure 1, the threshold is set at 2.5 V for R7 = RTH = 10 kQ. A method for providing an appropriate amount of hysteresis should be available. Hysteresis prevents multiple transitions from occurring when slow varying signal inputs oscillate about the threshold. The hysteresis can be set by applying positive feedback. The amount of hysteresis is Motorola Sensor Device Data determined by the value of the feedback resistor, RH (refer to equations in the following section). o It is ideal for the comparator's logic level output to swing from one supply rail to the other. In practice, this is not possible. Thus, the goal is to swing as high and low as possible for a given set of supplies. This offers the greatest difference between logic states and will avoid having a microcontroller read the switch level as being in an indeterminate state. o In order to be compatible with CMOS circuitry and to avoid microcontroller timing delay errors, the comparator must switch sufficiently fast. o By using two comparators, a window comparator may be implemented. The window comparator may be used to monitor when the applied pressure is within a set range. By adjusting the input thresholds, the window width can be customized for a given application. As with the single 4-141 AN1517 threshold design, positive feedback can be used to provide hysteresis for both switching points. The window comparator and the other comparator circuits will be explained in the following section. EXAMPLE COMPARATOR CIRCUITS Several comparator circuits were built and evaluated. Comparator stages using the LM311 comparator, LM358 Op-Amp (with and without an output transistor stage), and LM339 were examined. Each comparator was evaluated on output voltage levels (dynamic range), transition speed, and the relative component count required for the complete pressure switch design. This comparison is tabulated in Table 2. LM311 Used In a Comparator Circuit The LM311 chip is designed specifically for use as a comparator and thus has short delay times, high slew rate, and an open collector output. A pull-up resistor at the output is all that is needed to obtain a rail-te-rail output. Additionally, the LM311 is a reverse logic circuit; that is, for an input lower than the reference voltage, the output is high. Likewise, when the input voltage is higher than the reference voltage, the output is low. Figure 2 shows a schematic of the LM311 stage with threshold setting resistor divider, hysteresis resistor, and the open-collector pull-up resistor. Table 2 shows the comparator's performance. Based on its performance, this circuit can be used in many types of applications, including interface to microprocessors. The amount of hysteresis can be calculated by the following equations: VREF = R1 Vee R2 + R2 Vee' neglecting the effect of R H· R1 U1 RpU R1R2 + R2RH V REFH = R1R2 + R1RH + R2RH Vee LM311 Vin >--+--1 Voul R2RH VREFL = R1R2 + R1RH + R2RH Vee HYSTERESIS = V REF - V REFL when the normal state is below V REF , or R2 HYSTERESIS = V REFH - V REF Figure 2. LM311 Comparator Circuit Schematic when the normal state is above V REF' Table 2. Comparator Circuits Performance Characteristics Characteristic LM311 LM358 LM358 wI Trans. Unit Rise Time 1.40 5.58 2.20 IlS Fall Time 0.04 6.28 1.30 IlS VOH 4.91 3.64 5.00 V VOL 61.1 38.0 66.0 mV NEGATIVE NEGATIVE POSITIVE Switching Speeds Output Levels Circuit Logic Type The initial calculation for VREF will be slightly in error due to neglecting the effect of RH. To establish a precise value for VREF (including RH in the circuit), recompute R1 taking into accountthat VREF depends on R 1, R2, and RH. Itturns outthat when the normal state is below VREF, RH is in parallel with R1: V R2 REF - R1 II RH + R2 V ee (WhiCh is identical to the equation for V REFH ) 4-142 Alternately, when the normal state is above VREF, RH is in parallel with R2: V REF = R1 + R211 RH Vee (WhiCh is identical to the equation for V REFd These two additional equations for VREF can be used to calculate a more precise value for VREF- Motorola Sensor Device Data AN1517 TheusershouldbeawarethatVREF, VREFHandVREFLare chosen for each application, depending on the desired switching point and hysteresis values. Also, the user must specify which range (either above or below the reference voltage) is the desired normal state (see Figure 3). Referring to Figure 3, if the normal state is below the reference voltage then VREFL (VREFH is only used to calculate a more precise value for VREF as explained above) is below VREF by the desired amount of hysteresis (use VREFL to calculate RH). Alternately, if the normal state is above the reference voltage then VREFH (VREFL is only used to calculate a more preCise value for VREF) is above VREF by the desired amount of hysteresis (use VREFH to calculate RH). An illustration of hysteresis and the relationship between these voltages is shown in Figure 3. speed is comparable to the LM311's. This enhanced performance does, however, require an additional transistor and base resistor. Referring to Figure 1, note that this comparator topology was chosen for the pressure switch design. The LM324 is a quad op amp that has equivalent amplifier characteristics to the LM358. Vee Rt Ul LM358 Vin } - - l - - - l Vout - - - ; , - - - VAEF (VAEFUW) Hysteresis f R2 Figure 4. LM358 Comparator Circuit Schematic Normal State Vee AI RpU Vout VREFH Hysteresis f _ _...l-_ _ Ql VREF (VAEFLW) MMBT3904LTI Figure 3. Setting the Reference Voltages LM358 Op Amp Used in a Comparator Circuit Figure 4 shows the schematic for the LM358 op amp' comparator stage, and Table 2 shows its performance. Since the LM358 is an operational amplifier, it does not have the fast slew-rate of a comparator IC nor the open collector output. Comparing the LM358 and the LM311 (Table 2), the LM311 is better for logic/switching applications since its output nearly extends from rail to rail and has a sufficiently high switching speed. The LM358 will perform well in applications where the switching speed and logic-state levels are not critical (LED output, etc.). The design of the LM358 comparator is accomplished by using the same equations and procedure presented for the LM311. This circuit is also reverse logic. LM358 Op Amp with a Transistor Output Stage Used in a Comparator Circuit The LM358 with a transistor output stage is shown in Figure 5. This circuit has similar performance to the LM311 comparator: its output reaches the upper rail and its switching Motorola Sensor Device Data R2 Figure 5. LM358 with a Transistor Output Stage Comparator Circuit Schematic Like the other two circuits, this comparator circuit can be deSigned with the same equations and procedure. The values for RB and RPU are chosen to give a 5:1 ratio in 01 's collector current to its base current, in order to insure that 01 is well-saturated (Vout can pull down very close to ground when 01 is on). Once the 5:1 ratio is chosen, the actual resistance values determine the desired switching speed for turning 01 on and off. Also, RpU limits the collector current to be within the maximum specification for the given transistor (see example values in Figure 1). Unlike the other two circuits, this circuit is positive logic due to the additional inversion created at the output transistor stage. 4-143 AN1517 LM339 Used in a Window Comparator Circuit HYSTERESIS = V REFUW - V REFL' Using two voltage references to detect when the input is within a certain range is another possibility for the pressure switch design. The window comparator's schematic is shown in Figure 6. The LM339 is a quad comparator Ie (it has open collector outputs), and its performance will be similar to that of the LM311. Vee Rl where VREFL is chosen to give the desired amount of hysteresis for the application. The initial calculation for VREFUW will be slightly in error due to neglecting the effect of RHU. To establish a precise value for VREFUW (including RHU in the circuit), recompute R1 taking into accountthat VREFUW depends on R2 and R3 and the parallel combination of R1 and RHU. This more precise value is calculated with the following equation: R23 VREFUW = R111 R HU + R23 Vee RpU for the lower window threshold choose the value for VREFLW. 2 Set VREFLW VREFUW where R2 + R3 RHU 1 R2 Vin Voul Ul VREFLW 7+ R5 2 R4 1 R3 2 1 RHL Figure 6. LM339 Window Comparator Circuit Schematic Obtaining the correct amount of hysteresis and the input reference voltages is slightly different than with the other circuits. The following equations are used to calculate the hysteresis and reference voltages. Referring to Figure 3, VREFuwistheupperwindowreferencevoltageandVREFLW is the lower window reference voltage. Remember that reference voltage and threshold voltage are interchangeable terms. = R111 =R23 R3 R HU + R2 + R3 Vee' from above calculation. To calculate the hysteresis resistor: The input to the lower comparator is one half Vin (since R4 = R5) when in the normal state. When VREFLW is above one half of Vin (i.e., the input voltage has fallen below the win· dow), RHL parallels R4, thus loading down Vin. The resulting input to the comparator can be referred to as VINL (a lower input voltage). To summarize, when the input is within the window, the output is high and only R4 is connected to ground from the comparator's positive terminal. This establishes one half of Vin to be compared with VREFLW- When the input voltage is below VREFLW, the output is low, and RHL is effectively in parallel with R4. By voltage division, less olthe input voltage will fall across the parallel combination of R4 and RHL, demanding that a higher input voltage at Vin be required to make the noninverting input exceed VREFLW. Therefore the following equations are established: HYSTERESIS = V REFLW - V INL Choose R4 =R5 to simplify the design. For the upper window threshold: Choose the value forVREFUW and R1 (e.g., 10 kQ). Then, by voltage division, calculate the total resistance of the combination of R2 and R3 (named R23 for identification) to obtain the desired value for VREFUW, neglecting the effect of RHU: R23 VREFUW = R1 + R23 Vee The amount of hysteresis can be calculated by the following equation: VREFL -- R23R Hu R1 R23 + R1 R HU + R23R HU Vee Notice that the upper window reference voltage, VREFUW, is now equal to its VREFL value, since at this moment, the input voltage is above the normal state. 4-144 R4R5(VREFLW - V INL - Vee) RHL = (R4 + R5) ('V INL - VREFLW ) IMPORTANT NOTE: As explained above, because the input voltage is divided in half by R4 and R5, all calculations are done relative to the one half value of Vin. Therefore, for a hysteresis of 200 mV (relative to Vin), the above equations must use one half this hysteresis value (100 mV). Also, if a VREFLW value of 2.0 V is desired (relative to Vin), then 1.0 V for its value should be used in the above equations. The value for VINL should be scaled by one half also. The window comparator design can also be designed using operational amplifiers and the same equations as for the LM339 comparator circuit. For the best performance, however, a transistor output stage should be included in the design. Motorola Sensor Device Data AN1517 TEST/CALIBRATION PROCEDURE 1. Before testing the circuit, the user-defined values for RTH, RH and Roff should be calculated for the desired application. The sensor offset voltage is set by V - V off off - R1 + Roff V CC' Then, the amplified sensor voltage corresponding to a given pressure is calculated by Vsensor =201 x 0.0002 x APPLIED PRESSURE + Voff, where 201 is the gain, 0.0002 is in units of V/kPa and APPLIED PRESSURE is in kPa. The threshold voltage, VTH, at which the output changes state is calculated by determining Vsensoratthe pressure that causes this change of state: VTH = Vsensor (@ pressure threshold) = 4. Connect an additional volt meter to the VTH probe point to verify the threshold voltage. 5. Tum on the supply voltage. 6. With no pressure applied, check to see that Voff is correct by measuring the voltage at the output of the gain stage (the volt meter connected to Pin 4 of CN1).lf desired, Voff can be fine tuned by using a potentiometer for Roff. 7. Check to see that the volt meter monitoring VTH displays the desired voltage for the output to change states. Use a potentiometer for RTH to fine tune VTH, if desired. 8. Apply pressure to the sensor. Monitor the sensor's output via the volt meter connected to pin 4 of CN1. The output will switch from low to high when this pressure sensor voltage reaches or exceeds the threshold voltage. 9. If hysteresis is used, with the output high (pressure sensor voltage greater than the threshold voltage), check to see if VTH has dropped by the amount of hysteresis desired. A potentiometer can be used for RH to fine tune the amount of hysteresis. CONCLUSION RTH If hysteresis is desired, refer to the LM311 Used in a Comparator section to determine RH. 2. To test this design, connect a +5 volt supply between pins 3 and 4 of the connector CN1. 3. Connect a volt meter to pins 1 and 4 of CN1 to measure the output voltage and amplified sensor voltage, respectively. Motorola Sensor Device Data The pressure switch design uses a comparator to create a logic level output by comparing the pressure sensor output voltage and a user-defined reference voltage. The flexibility of this minimal component, high performance design makes it compatible with many different applications. The design presented here uses an op amp with a transistor output stage, yielding excellent logic-level outputs and output transition speeds for many applications. Finally, several other comparison stage designs, including a window comparator, are evaluated and compared for overall performance. 4-145 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1518 Using a Pulse Width Modulated Output with Semiconductor Pressure Sensors Prepared by: Eric Jacobsen and Jeff Baum Sensor Design and Applications Group, Motorola Phoenix, AZ INTRODUCTION For remote sensing and noisy environment applications, a frequency modulated (FM) or pulse width modulated (PWM) output is more desirable than an analog voltage. FM and PWM outputs inherently have better noise immunity for these types of applications. Generally, FM outputs are more widely accepted than PWM outputs, because PWM outputs are restricted to a fixed frequency. However, obtaining a stable FM output is difficult to achieve without expensive, complex circuitry. With either an FM or PWM output, a microcontroller can be used to detect edge transitions to translate the time-domain signal into a digital representation of the analog voltage signal. In conventional voltage-ta-frequency (V/F) conversions, a voltage-controlled oscillator (VCO) may be used in conjunction with a microcontroller. This use of two time bases, one analog and one digital, can create additional inaccuracies. With either FM or PWM outputs, the microcontroller is only concerned with detecting edge transitions. If a programmable frequency, stable PWM output could be obtained with simple, inexpensive circuitry, a PWM output would be a cost-effective solution for noisy environmenVremote sensing applications while incorporating the advantages of frequency outputs. The Pulse Width Modulated Output Pressure Sensor design (Figure 1) utilizes simple, inexpensive circuitry to create an output waveform with a duty cycle that is linear to the applied pressure. Combining this circuitry with a single digital time base to create and measure the PWM signal, results in a stable, accurate output. Two additional advantages of this design are 1) an AID converter is not required, and 2) since the PWM output calibration is controlled entirely by software, circuit-to-circuit variations due to component tolerances can be nullified. The PWM Output Sensor system consists of a Motorola MPX5000 series pressure sensor, a ramp generator (transistor switch, constant current source, and capacitor), a comparator, and an MC68HC05P9 microcontroller. These subsystems are explained in detail below. ,.-----------~-~---....,.--__.----- +5.0V ,.---------+-+----+---1----< Pulse Train r-----~~~~:.. I I I I I I I I I ~ Ql MOC401 OCT1 J. _-I, ~ from Micro , - - PWM Output to Micro ~I I MMBT3904LT,j..J R4 4.75 kQ R5 22.1 kQ C2 1.OJ!F I Cl "- I I r- I II II II --- - 3.31l F I _ L-------------r-.J-t-l_~_l: R3 4.75kQ I I I I I ! Ul r-I-----, I I I I I IL I r'X '<..:l! XI R1 10k!:! I LM3110 I I I I":" I L _ _ _ _ _ _ _ _ .J I MPX51000P I I I ~ I _ _ _ _ _ _ .J R2 10kQ Comparator Stage Pressure Sensor Figure 1. PWM Output Pressure Sensor Schematic REV 1 4-146 Motorola Sensor Device Data AN1518 produces an output of 0.5 V at zero pressure to 4.5 V at full scale pressure. Referring to the schematic of the system in Figure 1, note that the output of the pressure sensor is attenuated to one-half of its value by the resistor divider comprised of resistors R1 and R2. This yields a span of 2.0 V ranging from 0.25 V to 2.25 V at the non-inverting terminal of the comparator. Table 1 shows the electrical characteristics of the MPX51 00. PRESSURE SENSOR Motorola's MPX5000 series sensors are signal conditioned (amplified), temperature compensated and calibrated (Le., offset and full-scale span are precision trimmed) pressure transducers. These sensors are available in full-scale pressure ranges of 50 kPa (7.3 psi) and 100 kPa (14.7 psi). With the recommended 5.0 V supply, the MPX5000 series Table 1. MPX5100DP Electrical Characteristics Characteristic Symbol Min Typ Max Pressure Range POP 0 - 100 kPa Supply Voltage Vs - 5.0 6.0 Vdc Full Scale Span VFSS 3.9 4.0 4.1 V 0.5 0.6 40 - mV/kPa Zero Pressure Offset Voff 0.4 Sensitivity S - Unit V Linearity - -0.5 - 0.5 %FSS Temperature Effect on Span - -1.0 - 1.0 %FSS Temperature Effect on Offset - -50 0.2 50 mV THE RAMP GENERATOR The ramp generator is shown in the schematic in Figure 1. A pulse train output from a microcontroller drives the ramp generator at the base of transistor Q1. This pulse can be accurately controlled in frequency as well as pulse duration via software (to be explained in the microcontroller section). The ramp generator uses a constant current source to charge the capacitor. It is imperative to remember that this current source generates a stable current only when it has approximately 2.5 V or more across it. With less voltage across the current source, insufficient voltage will cause the current to fluctuate more than desired; thus, a design constraint for the ramp generator will dictate that the capacitor can be charged to only approximately 2.5 V, when using a 5.0 V supply. The constant current charges the capacitor linearly by the following equation: IW = ILlt C (1) where Ll.t is the capacitor's charging time and C is the capacitance. Referring to Figure 2, when the pulse train sent by the microcontroller is low, the transistor is off, and the current source charges the capacitor linearly. When the pulse sent by the microcontroller is high, the transistor turns on into saturation, discharging the capacitor. The duration of the high part of the pulse train determines how long the capacitor discharges, and thus to what voltage it discharges. This is how the dc offset of the ramp waveform may be accurately controlled. Since the transistor saturates at approximately 60 mV, very little offset is needed to keep the capaCitor from discharging completely. -In n nl--- Microcontroller Pulse Train - - - - - - - ., I I I I Ramp Waveform - - - - -... I I I I I I I I I .. .. I I I I I I I I I I I I I I t* Ramp Waveform _---'L-_ Offset (100 mV) Figure 2. Ideal Ramp Waveform for the PWM Output Pressure Sensor Motorola Sensor Device Data 4-147 AN1518 The PWM output is most linear when the ramp waveform's period consists mostly of the rising voltage edge (see Figure 2). If the capacitor were allowed to completely discharge (see Figure 3), a flat line at approximately 60 mV would separate the ramps, and these "flat spots" may result in Microcontroller Pulse Train non-linearities of the resultant PWM output (after comparing it to the sensor voltage). Thus, the best ramp waveform is produced when one ramp cycle begins immediately after another, and a slight dc offset disallows the capacitor from discharging completely. • Exaggerated Capacitor Discharge Ramp Waveform Figure 3. Non Ideal Ramp Waveform for the PWM Output Pressure Sensor The flexibility of frequency control of the ramp waveform via the pulse train sent from the microcontroller allows a programmable-frequency PWM output. Using Equation 1 the frequency (inverse of period) can be calculated with a given capacitor so that the capacitor charges to a maximum t'N of approximately 2.5 V (remember that the current source needs approximately 2.5 V across it to output a stable current). The importance of software control becomes evident here since the selected capacitor may have a tolerance of ± 20%. By adjusting the frequency and positive width of the pulse train, the desired ramp requirements are readily obtainable; thus, nullifying the effects of component variances. For this design, the ramp spans approximately 2.4 V from 0.1 V to 2.5 V. At this voltage span, the current source is stable and results in a linear ramp. This ramp span was used for reasons which will become clear in the next section. In summary, complete control of the ramp is achieved by the following adjustments of the microcontroller-created pulse train: • Increase Frequency: Span of ramp decreases. The dc offset decreases slightly. • Decrease Frequency: Span of ramp increases. The dc offset increases slightly. • Increase Pulse Width: The dc offset decreases. Span decreases slightly. • Decrease Pulse Width: The dc offset increases. Span increases slightly. 4-148 THE COMPARATOR STAGE The LM311 chip is designed specifically for use as a comparator and thus has short delay times, high slew rate, and an open-collector output. A pull-up resistor at the output is all that is needed to obtain a rail-to-rail output. As Figure 1 shows, the pressure sensor output voltage is input to the non-inverting terminal of the op amp and the ramp is input to the inverting terminal. Therefore, when the pressure sensor voltage is higher than a given ramp voltage, the output is high; likewise, when the pressure sensor voltage is lower than a given ramp voltage, the output is low (refer to Figure 5). As mentioned in the Pressure Sensor section, resistors R1 and R2 of Figure 1 comprise the voltage divider that attenuates the pressure sensor's signal to a 2.0 V span ranging from 0.25 V to 2.25 V. Since the pressure sensor voltage does not reach the ramp's minimum and maximum voltages, there will be a finite minimum and maximum pulse width for the PWM output. These minimum and maximum pulse widths are design constraints dictated by the comparator's slew rate. The system design ensures a minimum positive and negative pulse width of 20 Ils to avoid nonlinearities at the high and low pressures where the positive duty cycle of the PWM output is at its extremes (refer to Figure 4 ). Depending on the speed of the microcontroller used in the system, the minimum required pulse width may be larger. This will be explained in the next section. Motorola Sensor Device Data AN1518 THE MICROCONTROLLER The microcontroller for this application requires input capture and output compare timer channels. The output capture pin is programmed to output the pulse train that drives the ramp generator, and the input capture pin detects edge transitions to measure the PWM output pulse width. Since software controls the entire system, a calibration routine may be implemented that allows an adjustment of the frequency and pulse width of the pulse train until the desired ramp waveform is obtained. Depending on the speed of the microcontroller, additional constraints on the minimum and maximum PWM output pulse widths may apply. For this design, the software latency incurred to create the pulse train at the output compare pin is approximately 40 Ils. Consequently, the microcontroller cannot create a pulse train with a positive pulse width of less than 40 Ils. Also, the software that measures the PWM output pulse width at the input capture pin requires approximately 20 Ils to execute. Referring to Figure 5, the software interrupt that manipulates the pulse train always occurs near an edge detection on the input capture pin (additional software interrupt). Therefore, the minimum PWM output pulse width that can be accurately detected is approximately 60 Ils (20 Ils + 40 Ils). This constrains the minimum and maximum pulse widths more than the slew rate of the comparator which was discussed earlier (refer to Figure 4). f !>.V Sets Maximum Pulse Width (Period - 60 ~s) !>.V Sets Minimum Pulse Width (60 ~s) f Figure 4. Desired Relationship Between the Ramp Waveform and Pressure Sensor Voltage Spans An additional consideration is the resolution of the PWM output. The resolution is directly related to the maximum frequency olthe pulse train. In our design, 5121ls are required to obtain at least 8-bit resolution. This is determined by the fact that a 4 MHz crystal yields a 2 MHz clock speed in the microcontrolier. This, in turn, translates to 0.51ls per clock tick. There are four clock cycles per timer count. This results in 21ls per timer count. Thus, to obtain 256 timer counts (or 8-bit resolution), the difference between the zero pressure and full scale pressure PWM output pulse widths must be at least 512 Ils (2 Ils x 256). But since an additional 60 Ils is needed at both pressure extremes of the output waveform, the total period must be at least 6321ls. This translates to a maximum frequency for the pulse train of approximately 1.6 kHz. With this frequency, voltage span of the ramp generator, and value of current charging the capacitor, the minimum capacitor value may be calculated with Equation 1. To summarize: The MC68HC705P9 runs off a 4 MHz crystal. The microcontroller internally divides this frequency by two to yield an internal clock speed of 2 MHz. Motorola Sensor Device Data _1_ = > --,--0--,.::..5-"f.l,-,s~ 2 MHz clock cycle And, 4 clock cycles = 1 timer count. Therefore, 0.5 f.ls 4 clock cycles timer count x clock cycle 2 f.ls timer count For 8-bit resolution, 2 f.ls timer count x 256 counts = 512 f.ls Adding a minimum of 60 Ils each for the zero and full scale pressure pulse widths yields 5121ls + 60 Ils + 60 Ils = 6321ls, which is the required minimum pulse train period to drive the ramp generator. Translating this to frequency, the maximum pulse train frequency is thus 63i f.ls = 1.58 kHz. 4-149 AN1518 2.4 V will ensure that the maximum pulse width at full scale pressure will be at least 60 Ils less than the total period. Note that by decreasing the frequency of the pulse train, a dc offset will begin to appear. This may result in the ramp looking nonlinear at the top. 3. If the ramp begins to become nonlinear, increase the pulse width to decrease the dc offset. 4. Repeat steps 2 and 3 until the ramp spans 2.4 V and has a dc offset of approximately 100 mV. The dc offset value is not critical, but the bottom of the ramp should have a "crisp" point at which the capacitor stops discharging and begins charging. Simply make sure that the minimum pulse width at zero pressure is at least 60 Its. Refer to Figures 4 and 5 to determine if the ramp is sufficient for the application. CALIBRATION PROCEDURE AND RESULTS The following calibration procedure will explain how to systematically manipulate the pulse train to create a ramp that meets the necessary design constraints. The numbers used here are only for this design example. Figure 6 shows the linearity performance achieved by following this calibration procedure and setting up the ramp as indicated by Figures 4 and 5. 1. Start with a pulse train that has a pulse width and frequency that creates a ramp with about 100 mV dc offset and a span smaller than required. In this example the initial pulse width is 84 its and the initial frequency is 1.85 kHz. 2. Decrease the frequency of the pulse train until the ramp span increases to approximately 2.4 V. The ramp span of Mic~ ~ t~ ~ ---=:·---1n n nl--I I I I I I I Ramp Waveform Sensor_ Voltage I I I I I I I I I I I I I Exaggerated Capacitor Discharge PWMOutput_ Voltage Figure 5. Relationships Between the PWM Output Pressure Sensor Voltages U> ..=; .<= :§ :;: III :; a. 650 600 550 500 450 400 350 300 250 200 A t50 ~ 100 I,,' 50 o o ./ . / .... " 80 ./ /" /":. . .:,;;:: / ........ . 100 90 //' i--":/ 70 60 .// P C .!!? 50 ~ 40 Cl -5' 30 - - - Pulse Width - - - - Duty Cycle - 20 10 I 20 40 60 Pressure (kPa) 80 100 o Figure 6. PWM Output Pressure Sensor Linearity Data 4-150 Motorola Sensor Device Data AN1518 CONCLUSION The Pulse Width Modulated Output Pressure Sensor uses a ramp generator to create a linear ramp which is compared to the amplified output of the pressure sensor at the input of a comparator. The resulting output is a digital waveform with a duty cycle that is linearly proportional to the input pressure. Although the pressure sensor output has a fixed offset and Motorola Sensor Device Data span, the ramp waveform is adjustable in frequency, dc offset, and voltage span. This flexibility enables the effect of component tolerances to be nullified and ensures that ramp span encompasses the pressure sensor output range. The ramp's span can be set to allow for the desired minimum and maximum duty cycle to guarantee a linear dynamic range. 4-151 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1525 The A-B-C's of Signal-Conditioning Amplifier Design for Sensor Applications Prepared by: Eric Jacobsen and Jeff Baum Sensor Applications Engineering Motorola Signal Products Division Phoenix, AZ INTRODUCTION Although fully signal-conditioned, calibrated, and temperature compensated monolithic sensor IC's are commercially available today, there are many applications where the flexibility of designing custom signal-conditioning is of great benefit. Perhaps the need for a versatile low-level sensor output is best illustrated by considering two particular cases that frequently occur: (1) the user is in a prototyping phase of development and needs the ability to make changes rapidly to the overall transfer function of the combined sensor/amplifier subsystem, (2) the specific desired transfer function does not exist in a fully signal-conditioned, precision-trimmed sensor product (e.g., a signal-conditioned device is precision trimmed over a different pressure range than that of the application of interest). In such cases, it is obvious that there will always be a need for low-level, nonsignal-conditioned sensors. Given this need. there is also a need for sensor interface amplifier circuits that can signal condition the "raw" sensor output to a usable level. These circuits should also be user friendly. simple, and cost effective. Today's unamplified solid-state sensors typically have an output voltage of tens of millivolts (Motorola's basic 10 kPa pressure sensor, MPX10, has a typical full-scale output of 58 mV, when powered with a 5 V supply). Therefore, a gain stage is needed to obtain a signal large enough for additional processing. This additional processing may include digitization by a microcontroller's analog to digital (AID) converter, input to a comparator, etc. Although the signal-conditioning circuits described here are applicable to low-level, differential-voltage output sensors in general, the focus of this paper will be on interfacing pressure sensors to amplifier circuits. This paper presents a basic two operational-amplifier signal-conditioning circuit that provides the desired characteristics of an instrumentation amplifier interface: • High input impedance • Low output impedance • Differential to single-ended conversion of the pressure sensor signal • High gain capability 4-152 For this two op-amp circuit, additional modifications to the circuit allow (1) gain adjustment without compromising common mode rejection and (2) both positive and negative dc level shifts of the zero pressure offset. Varying the gain and offset is desirable since full-scale span and zero pressure offset voltages of pressure sensors will vary somewhat from unit to unit. Thus, a variable gain is desirable to fine tune the sensor's full-scale span, and a positive or negative dc level shift (offset adjustment) of the pressure sensor signal is needed to translate the pressure sensor's signal-conditioned output span to a specific level (e.g., within the high and low reference voltages of an AID converter). For the two op-amp gain stage, this paper will present the derivation of the transfer function and simplified transfer function for pressure sensor applications, the derivation and explanation of the gain stage with a gain adjust feature, and the derivation and explanation of the gain stage with the dc level shift modification. Adding another amplifier stage provides an alternative method of creating a negative dc voltage level shift. This stage is cascaded with the output from the two op-amp stage (Note: gain of the two op-amp stage will be reduced due to additional gain provided by the second amplifier stage). For this three op-amp stage, the derivation of the transfer function, simplified transfer function, and the explanation of the negative dc level shift feature will be presented. GENERAL NOTE ON OFFSET ADJUSTMENT Pressure sensor interface circuits may require either a positive or a negative dc level shiftto adjust the zero pressure offset voltage. As described above, if the signal-conditioned pressure sensor voltage is input to an A/D, the sensor's output dynamic range must be positioned within the high and low reference voltages of the A/D; i.e., the zero pressure offset voltage must be greater than (or equal to) the low reference voltage and the full-scale pressure voltage must be less than (or equal to) the high reference voltage (see Figure 1). Otherwise, voltages above the high reference will be digitally converted as 255 decimal (for 8-bit AID), and voltages below the low reference will be converted as 0. This creates a nonlinearity in the analog-to-digital conversion. Motorola Sensor Device Data AN1525 1 NO HIGH REFERENCE OR HIGH _ _ _....,.... SATURATION LEVEL OF AMPLIFIER w z C!l 1 FULL-SCALE .. OUTPUT VOLTAGE - - - - ",'0: ""a: ~ "">-z :::lW I" w 0 -' "" Oz Q :::Jen ~~ a: W u: en> ::;; "-C!l ::; 00 0.. z w "" en ZERO PRESSURE _ _ _....,.... OFFSET VOLTAGE a: 0 en ~ f NO LOW REFERENCE OR LOW SATURATION LEVEL OF AMPLIFIER ---....,.... f Figure 1. Positioning the Sensor's Full-Scale Span within the AID's or Amplifier's Dynamic Range A similar requirement that warrants the use of a dc level shift is the prevention of the pressure sensor's voltage from extending into the saturation regions of the operational amplifiers. This also would cause a nonlinearity in the sensor output measurements. For example, if an op-amp powered with a single-ended 5 V supply saturates near the low rail of the supply at 0.2 V, a positive dc level shift may be required to position the zero pressure offset voltage at or above 0.2 V. Likewise, if the same op-amp saturates near the high rail of the supply at 4.8 V, a negative dc level shift may be required to position the full-scale pressure voltage at or below 4.8 V. It should be obvious that if the gain of the amplifiers is too large, the span may be too large to be positioned within the 4.6 V window (regardless of ability to level shift dc offset). In such a case, the gain must be decreased to reduce the span. THE TWO OP-AMP GAIN STAGE TRANSFER FUNCTION The transfer function of the two op-amp signal-conditioning stage, shown in Figure 2, can be determined using nodal analysis at nodes 1 and 2. The analysis can be simplified by calculating the transfer function for each of the signals with the other two signals grounded (set to zero), and then employing superposition to realize the overall transfer function. As shown in Figure 2, VIN2 and VIN1 are the differential amplifier input signals (with VIN2 > VIN1), and VREF is the positive dc level adjust point. For a sensor with a small zero pressure offset and operational amplifiers powered from a single-ended supply, it may be necessary to add a positive dc level shift to keep the operational amplifiers from saturating near zero volts. VCC VREF ">---'l.M--"'--I VIN1 :;-----'7 Vo VIN2 ) - - - - - - - - - - - - - - - ' Figure 2. The Two Operational-Amplifier Gain Stage Motorola Sensor Device Data 4-153 AN1525 First, the transfer function for VIN1 is determined by grounding VREF and VIN2 at node 1: V IN1 Va' - V IN1 R1 - R2 (1) and at node 2: (2) APPLICATION TO PRESSURE SENSOR CIRCUITS The previous section showed the derivation of the general transfer function for the two op-amp signal-conditioning circuit. The simplified form of this transfer function, as applied to a pressure sensor application, is derived in this section. For pressure sensors, VIN1 and VIN2 are referred to as Sand S+, respectively. The simplification is obtained by setting R4 R1 R3 = R2 By solving Equations (1) and (2) for Va' and equating the results, Equation (3) is established: (:~ Through this simplification, Equation (7) simplifies to + 1) VIN1 =- : : Vq3) va=(::+1)(S+-S-)+VREF Solving for Va yields va1 =- ::(:~ + 1) VIN1 (4) By examining Equation (8), the differential gain of the signal- conditioning stage is: where Va1 represents the part of Va that VIN1 contributes. To determine the transfer function forVIN2, VIN1 and VREF are grounded, and a similar analysis is used, yielding va2 =(:: + 1) VIN2 (5) where Va2 represents the part of Va that VIN2 contributes. Finally, to calculate the transfer function between Va and VREF, VIN1 and VIN2 are grounded to obtain the following transfer function: R4 R2 VaREF = FIR 3 1 VREF (6) where VaREF represents the part of Va that VREF contributes. Using superposition for the contributions ofVIN1, VIN2, and VREF gives the overall transfer function for the signalconditioning stage. Va = Va1 + Va2 + VaREF Va =- : : + (:~ RR ......1.....£ R3 R 1 (7) Equation (7) is the general transfer function for the signal-conditioning stage. However, the general form is not only cumbersome, but also if no care is taken to match certain resistance ratios, poor common mode rejection results. A simplified form of this equation that provides good common mode rejection is shown in the next section. 4-154 R4 G = - +1 R3 (9) Also, since the differential voltage between S+ and S- is the pressure sensor's actual differential output voltage (VSENSaR), the following equation is obtained for Va: Va = ( : : + 1) VSENSaR + VREF (10) Finally, the term VREF is the positive offset voltage added to the amplified sensor output voltage. VREF can only be positive when using a positive single-ended supply. This offset (dc level shift) allows the user to adjust the absolute range that the sensor voltage spans. For example, if the gain established by R4 and R3 creates a span of four volts and this signal swing is superimposed upon a dc level shift (offset) of 0.5 volts, then a signal range from 0.5 V to 4.5 V results. VREF is typically adjusted by a resistor divider as shown in Figure 3. A few design constraints are required when designing the resistor divider to set the voltage at VREF. • To establish a stable positive dc level shift (VREF), Vee should be regulated; otherwise, VREFWili vary as Vee varies. • When "looking" into the resistor divider from R1, the effective resistance of the parallel combination of the resistors, RREF1 and RREF2, should be at least an order of magnitude smaller than R1's resistance. If the resistance of the parallel combination is not small in comparison to R1, Rfs value will be significantly affected by the parallel combination's resistance. This effect on R 1 will consequently affect the amplifier's gain and reduce the common mode rejection. + 1) VIN1 +(:: + 1) VIN2 VREF (8) Motorola Sensor Device Data AN1525 without additional constraints on the resistor values. To obtain good common mode rejection, use a similar simplification as before; that is, set Vee and RREFl R2 = R3 Rl VREF o--t--~WV-----7 TO Ul Defining the voltage differential between VIN2 and VINI as VSENSOR, the simplified transfer function is RREF2 Vo = ( : : + ~R: + 1) (VSENSOR) + VREF (12) Thus, the gain is Figure 3. A Resistor Divider to Create VREF R4 2R4 G=-+--+1 RS RG THE TWO OP-AMP GAIN STAGE WITH VARIABLE GAIN (IS) and VREF is the positive dc level shift (offset). Varying the gain of the two op-amp stage is desirable for fine-tuning the sensor's signal-conditioned output span. However, to adjust the gain in the two op-amp gain circuit in Figure 2 and to simultaneously preserve the common mode rejection, two resistors must be adjusted. To adjust the gain, it is more desirable to change one resistor. By adding an additional feedback resistor, RG, the gain can be adjusted with this one resistor while preserving the common mode rejection. Figure 4 shows the two op-amp gain stage with the added resistor, RG. Use the following guidelines when determining the value for RG: • By examining the gain equation, RG's resistance should be comparable to R4'S resistance. This will allow fine tuning of the gain established by R4 and RS. If RG is too large (e.g., RG approaches ~), it will have a negligible effect on the gain. If RG is too small (e.g., RG approaches zero), the RG term will dominate the gain expression, thus prohibiting fine adjustment of the gain established via the ratio of R4 and RS· • Use a potentiometer for RG that has a resistance range on the order of R4 (perhaps with a maximum resistance equal to the value of R4).lf a fixed resistor is preferable to a potentiometer, use the potentiometer to adjust the gain, measure the potentiometer's resistance, and replace the potentiometer with the closest 1% resistor value. • To maintain good common mode rejection while varying the gain, RG should be the only resistor that is varied. RG equally modifies both of the resistor ratios which need to be well-matched for good common mode rejection, thus preserving the common mode rejection. Vee NODE 1 R1 VREF >--'\III'v---',....,I~>'---t---'Wr...,:"" VIN1 ) - - - - - - j ::>---~ Vo VIN2 ) -_ _ _ _ _ _ _ _ _....J Figure 4. Two Operational-Amplifier Gain Stage with Variable Gain THE TWO OP-AMP GAIN STAGE WITH VARIABLE GAIN AND NEGATIVE DC LEVEL SHIFT As with the two op-amp gain stage, nodal analysis and superposition are used to derive the general transfer function for the variable gain stage. The last two op-amp circuits both incorporate positive dc level shift capability. Recall that a positive dc level shift is required to keep the operational amplifiers from saturating near the low rail of the supply or to keep the zero pressure offset above (or equal to) the low reference voltage of an AID. This two op-amp stage incorporates an additional resistor, ROFF, to provide a negative dc level shift. A negative dc level shift is useful when the zero pressure offset voltage of the sensor is too high. In this case, the user may be required to level shift the zero pressure offset voltage down (toward zero vOlts). Now, for a specified amount of gain, the full-scale pressure output voltage does not saturate the amplifier at the high rail of the voltage supply, nor is it greater than the AID's high reference voltage. Figure 5 shows the schematic for this amplifier circuit. Vo =(:4 S + :4 + :2:4 + 1) VIN2 G S G R R R R R R ) RS RG RSRG Rl RS - ( -.1+~+~+~ + (R2R4) VREF R1 RS VINI (11) This general transfer function also is quite cumbersome and is susceptible to producing poor common mode rejection Motorola Sensor Device Data 4-155 AN1525 Vee VREF >----'\M--'+-I VIN1 > - - - - - - - 1 VIN2 >--_--~Vo >-____________..J Figure 5. Two Op-Amp Signal-Conditioning Stage with Variable Gain and Negative Dc Level Shift Adjust To derive the general transfer function, nodal analysis and superposition are used: (14) As before, defining the sensor's differential output as VSENSOR, defining VIN2 as S+ for pressure sensor applications, and using the simplification that and R2=R3 obtains the following simplified transfer function: Vo = ( : : + ~~ + 1) (VSENSOR) + VREF • To determine the value of ROFF: 1. Determine the amount of negative dc level shifting required (defined here as V-shift). 2. R4 already should have been determined to set the gain for the desired signal-conditioned sensor output. 3. Although V-shift is dependent on S+, S+ changes only slightly over the entire pressure range. With Motorola's MPX10 powered at a 5 V supply, S+ will have a value of approximately 2.51 Vat zero pressure and will increase as high as 2.53 V at full-scale pressure. This error over the full-scale pressure span of the device is negligible when considering that many applications use an 8-bit AID converter to segment the pressure range. Using an 8-bit AID, the 20 mV (0.02 V) error corresponds to only 1 bit of error over the entire pressure range (1 bit 1255 bits x 100% = 0.4% error). 4. ROFF is then calculated by the following equation: S+ - V ROFF= R + _4-(S+-Vec> ROFF (15) The gain is R4 2R4 G=-+--+1 R3 RG (16) To adjust the gain, refer to the guidelines presented in the section on Two Op-Amp Gain Stage with Variable Gain. VREF is the positive dc level shift, and the negative dc level shift is: R4 V-shift = -R- (S+ - Vee) OFF (17) The following guidelines will help design the circuitry for the negative dc voltage level shift: 4-156 • To establish a stable negative dc level shift, Vee should be regulated; otherwise, the amount of negative level shift will vary as Vee varies. • ROFF should be the only resistor varied to adjust the negative level shift. Varying R4 will change the gain of the two op-amp circuit and reduce the common mode rejection. ee R4 V-s hift (18) An alternative to using this equation is to use a potentiometer for ROFF that has a resistance range on the order of R4 (perhaps 1 to 5 times the value of R4). Use the potentiometer to fine tune the negative dc level shift, while monitoring the zero pressure offset output voltage, VO. As before, if a fixed resistor is preferable, then measure the potentiometer's resistance and replace the potentiometer with the closest 1% resistor value. Important note: The common mode rejection of this amplifier topology will be low and perhaps unacceptable in some applications. (A SPICE model of this amplifier topology showed the common mode rejection to be 28 dB.) However, this circuit is presented as a solution for applications where only two operational amplifiers are available and the common mode rejection is not critical when considering the required Motorola Sensor Device Data AN1525 system performance. Adding a third op-amp to the circuit for the negative dc level shifting capability (as shown in the next section) is a solution that provides good common mode rejection, but at the expense of adding an additional op-amp. First, use the same simplifications as before; that is, set R1 = R4 and R2= R3 THE THREE OP-AMP GAIN STAGE FOR NEGATIVE DC LEVEL SHIFTING Defining the voltage differential between VIN2 and VIN1 as VSENSOR , the simplified transfer function is This circuit adds a third op-amp to the output of the two op-amp gain block (see Figure 6). This op-amp has a dual function in the overall amplifier circuit: • Its non-inverting configuration provides gain via the ratio of R6 and R5. • It has negative dc voltage level shifting capability typically created by a resistor divider at V-shift, as discussed in the section on Application to Pressure Sensor Circuits. Although this configuration requires a third op-amp for the negative dc level shift, it has no intrinsic error nor low common mode rejection associated with the negative level shift (as does the previous two op-amp stage). Depending on the application's accuracy requirement, this may be a more desirable configuration for providing the negative dc level shift. Vo = [1 + :: ] [ (:: + ~R: + 1 )(VSENSOR) R6 + VREF] - R5 V-shift (20) The gain is G =[1 + R6 ] [R4 R5 R3 + 2R4 + 1] RG (21) VREF is the positive dc level shift (offset), and V-shift is the negative dc level shift. Vee RS RS v-SHIFT>---'IIIIIr-_---'w.,...----. R4 >-- .s w 700 (!l !:i~ "- J"'.... 600 _ 4.5 G I- ::;) a.. I........... a: ~ 7 I::;) 0 .......... z w en w ......... ::E V a: ........ J; ;a en 400 ::;) ....... ~ w ,g: 300 ~ 1.5 w / a: ....... r-..,. V / a: 3.0 0 en ........... 500 1/ a.. ::;; 1/ "" V / w I- 200 -40 -20 0.0 100 120 TA, AMBIENT TEMPERATURE (oG) 20 40 60 80 140 160 TEMPERATURE SWITCH APPLICATIONS The Comparison Stage The comparison stage is the "heart" of the temperature switch design. This stage converts the analog voltage output Motorola Sensor Device Data 20 40 60 100 80 Figure 4. Temperature Sensor Output versus Temperature to a digital output, as dictated by the comparator's threshold. The comparison stage has a few design issues which must be addressed (component names and values reference Figure 5): • The threshold for which the output switches must be programmable. In Figure 5, the threshold is easily set by dividing the regulated 5 V supply voltage with resistors R1 and R2. In Figure 5, the threshold is set at 2.5 V for R1 R2 10kO. = = • A method for providing an appropriate amount of hysteresis should be available. Hysteresis prevents multiple transitions from occurring when slow varying signal inputs oscillate about the threshold. The hysteresis can be set by applying positive feedback. The amount of hysteresis is determined by the value of the feedback resistor, RH (refer to equations in the following section). • It is ideal for the comparator's logic level output to swing from one supply rail to the other. In practice, this is not possible. Thus, the goal is to swing as high and low as possible for a given set of supply voltages. This offers the greatest difference between logic states and will avoid having a microcontroller read the switch level as being in an indeterminate state. • In order to be compatible with CMOS circuitry and to avoid microcontroller timing delay errors, the comparator must switch sufficiently fast. • By using two comparators (or op-amps configured as comparators), a window comparator may be implemented. The window comparator may be used to monitor when the current temperature is within a set range. By adjusting the input thresholds, the window width can be customized for a given application. As with the single threshold design, positive feedback can be used to provide hysteresis for both switching points. The window comparator and the other comparator circuits will be explained in the following section. DESIGN CONSIDERATIONS Since the output of the sensor is only on the order of millivolts per degree Celsius (mVl°C) , amplification of the temperature signal is still necessary for this design. Thus, the circuit in Figure 2 will be used to provide the signal-conditioning function in this temperature switch design (see the section on Amplifier Design Considerations). Now that the sensor signal has been amplified to a usable voltage level, it can be compared to a user-programmable threshold voltage that is set at the comparison stage. Depending on the logic chosen, the comparison stage output can be either a low-to-high or high-to-Iow transition when exceeding or falling below the given threshold, i.e., positive logic when ouput goes high to a temperature that exceeds threshold, etc. o TEMPERATURE (oG) Figure 3. VBE versus Ambient Temperature Characteristic Many times, a temperature sensing application only requires information about the current temperature compared to a set threshold. To detect when the temperature has exceeded or fallen below a specified threshold, a logic-level transition can serve as the circuit output. This logic signal is typically an input to a microcontroller 1/0 pin which can detect such a logic-level transition. The interface circuit that can provide this additional functionality is very similar to the analog amplifier interface presented above. In fact, the identical circuit topology will be employed, with the addition of a comparison stage for setting the temperature threshold and providing a "clean" logic-level output. Several comparator circuit topologies which use comparator IC's andlor operational amplifiers will be presented. A window comparator design (high and low thresholds) is also included. The following sections describe the characteristics and design criteria for each comparator circuit, while evaluating them in overall performance (i.e., switching speed, logic-level voltages, etc.). ", 4-161 AN1535 performance, this circuit can be used in many types of applications, including interface to microprocessors. The amount of hysteresis can be calculated by the following equations: EXAMPLE COMPARATOR CIRCUITS Several comparator circuits were built and evaluated. Comparator stages using the LM311 comparator, LM358 Op-Amp (with and without an output transistor stage), and LM339 were examined. Each comparator circuit was evaluated regarding its output voltage levels (dynamic range) and the output transition time, as shown in Table 1. VREF = R1 R2 + R2 VCC' neglecting the effect of RH R1R2 + R2RH V R1R2 + R1RH + R2RH CC The LM311 Used in a Comparator Circuit The LM311 chip is designed specifically for use as a comparator and thus has short delay times, high slew rate, and an open collector output. A pull-up resistor at the output is all that is needed to obtain a "rail-to-rail" output. Additionally, the LM311 is a reverse logic circuit; that is, for an input lower than the reference voltage, the output is high. Likewise, when the input voltage is higher than the reference voltage, the output is low. Figure 5 shows a schematic of the LM311 stage with threshold setting resistor divider, hysteresis resistor, and the open-collector pull-up resistor. Table 1 shows the comparator's performance. Based on its HYSTERESIS = VREF - VREFL when the normal state is below VREF, or HYSTERESIS =VREFH - VREF when the normal state is above VREF An illustration of hysteresis and the relationship between these voltages is shown in Figure 6. Table 2. The comparator circuits' performance characteristics. LM311 LM358 LM358 with Transistor Unit Rise Time 1.40 5.58 2.20 ~s Fall Time 0.04 6.28 1.30 ~s Characteristic Switching Speeds Output Levels VOH 4.91 3.64 5.00 V VOL 61.1 38.0 66.0 mV Circuit Logic Type NEGATIVE NEGATIVE POSITIVE Vee - - , . - - VREF (VREFUW) HYSTERESIS VREFL RpU Ul LM311 NORMAL STATE VIN )------1~--1 >--+--VOUT VREFH HYSTERESIS - Figure 5. The LM311 Comparator Circuit Schematic 4-162 ........- - VREF (VREFLW) Figure 6. Setting the Reference Voltages Motorola Sensor Device Data AN1535 The initial calculation forVREF will be slightly in error due to neglecting the effect of RH. To establish a precise value for VREF (including RH in the circuit), recompute R1 taking into account that VREF depends on R1, R2, and RH. It turns out that when the normal state is belowVREF, RH is in parallel with R1: R2 VCC R111RH + R2 (which is identical to the equation for VREFH) Alternately, when the normal state is above VREF, RH is in parallel with R2: VREF = R2 II RH R1 + R2 II RH VCC (which is identical to the equation for VREFL) These two additional equations for VREF can be used to calculate a more precise value for VREF. TheusershouldbeawarethatVREF, VREFH ,andVREFLare chosen for each application, depending on the desired switching point and hysteresis values. Also, the user must specify which range (either above or below the reference voltage) is the desired normal state (see Figure 6). Referring to Figure 6, if the normal state is below the reference voltage, then VREFL (VREFH is only used to calculate a more precise value for VREF as explained before) is below VREF by the desired amount of hysteresis (use VREFL to calculate RH). Alternately, if the normal state is above the reference voltage, then VREFH (VREFL is only used to calculate a more precise value for VREF) is above VREF by the desired amount of hysteresis (use VREFH to calculate RH). The LM358 Op-Amp Used in a Comparator Circuit Figure 7 shows the schematic for the LM358 op-amp comparator stage, and Table 1 shows its performance. Since the LM358 is an operational amplifier, it does not have the fast slew-rate of a comparator IC nor the open collector output. Comparing the LM358 and the LM311 (Table 1), the LM311 is better for logic/switching applications since its output nearly extends from rail to rail and has a sufficiently high switching speed. The LM358 will perform well in applications where the switching speed and logic-state levels are not critical (LED output, etc.). The design of the LM358 comparator is accomplished by using the same equations and procedure presented for the LM311. This circuit is also reverse logic. The LM358 Op-Amp with a Transistor Output Stage The LM358 with a transistor output stage is shown in Figure 8. This circuit has similar performance to the LM311 comparator; its output reaches the upper rail and its switching speed is comparable to the LM311's. This enhanced performance does, however, require an additional transistor and base resistor. Like the other two circuits, this comparator circuit can be designed with the same equations and procedure. The values for RB and RpU are chosen to give a 5:1 ratio in 01's collector current to its base current, in order to ensure that 01 is well-saturated (VOUT can pull down very close to ground when 01 is on). Once the 5:1 ratio is chosen, the actual resistance values determine the desired switching speed for turning 01 on and off. Also, RpU lirnits the collector current to be within the maximum specification for the given transistor. Unlike the other two Circuits, this circuit is positive logic due to the additional inversion created at the output transistor stage. Vee Vee RpU Ul VOUT LM358 VIN >-----+----l >----1~---1~ VOUT Figure 7. The LM358 Comparator Circuit Schematic Motorola Sensor Device Data Figure 8. The LM358 with a Transistor Output Stage Comparator Circuit 4-163 AN1535 The LM339 Used in a Window Comparator Circuit The amount of hysteresis can be calculated by the following equation: Using two voltage references to detect when the input is within a certain range is another possibility forthe temperature switch design. The window comparator's schematic is shown in Figure 9. The LM339 is a quad comparator IC (it has open collector outputs), and its performance will be similar to that of the LM311. Noticethattheupperwindow reference voltage, VREFUW, is now equal to its VREFL value, since at this moment, the input voltage is above the normal state. HYSTERESIS = VREFUW - VREFL, where VREFL is chosen to give the desired amount of hysteresis for the application. The initial calculation forVREFUwwili be slightly in errordue to neglecting the effect of RHU. To establish a precise value for VREFUW (including RHU in the circuit), recompute Rl taking into account that VREFUW depends on R2 and R3 and the parallel combination of Rl and RHU. This more precise value is calculated with the following equation: Vee RpU Rl Ul LM339 R23 VREFUW = Rl II RHU + R23 VCC For the lower window threshold: VREFUW Choose the value for VREFLW R3 2 Set VREFLW RHU VIN Rl II RHU + R2 + R3 VCC' where R2 + R3 = R23 from above calculation. VOUT R2 = Ul VREFLW RS To calculate the value of the hysteresis resistor: The inputlo the lower comparator is one-half VIN (since R4 = R5), when in the normal state. When VREFLW is above one-half of VIN (i.e., the input voltage has fallen below the window), RHL parallels R4, thus loading down VIN. The resulting input to the comparator can be referred to as VINL (a lower input voltage). To summarize, when the input is within the window, the output is high, and only R4 is connected to ground from the comparator's positive terminal. This establishes one-half of VIN to be compared with VREFLW When the input voltage is belowVREFLW, the output is low, and RHL is effectively in parallel with R4. By voltage division, less of the input voltage will fall across the parallel combination of R4 and RHL, demanding that a higher input voltage at VIN be required to make the noninverting input exceed VREFLW Therefore, the following equations are established: Figure 9. The LM339 Window Comparator Circuit HYSTERESIS = VREFLW - VINL' Choose R4 = R5 to simplify the design. Obtaining the correct amount of hysteresis and the input reference voltages is slightly different than with the other circuits. The following equations are used to calculate the hysteresis and reference voltages. Referring to Figure 9, VREFUW is the upperwindow reference voltage, and VREFLW is the lower window reference voltage. Remember that reference voltage and threshold voltage are interchangeable terms. For the upper window threshold: Choose the valueforVREFUW and Rl (e.g., 10 kQ). Then, by voltage division, calculate the total resistance of the combination of R2 and R3 (named R23 for identification) to obtain the desired value for VREFUW, neglecting the effect of RHU: V 4-164 REFUW - Rl R23 V + R23 CC RHL = R4R5(VREFLW - VINL - VCC) (R4 + R5)(VINL - VREFLW) Important Note: As explained above, because the input voltage is divided in half by R4 and R5, all calculations are done relative to the one-half value of VIN. Therefore, for a hysteresisof200 mV (relative to VIN), the preceding equations must use one-half this hysteresis value (100 mV). Also, if a VREFLwvalue of 2 V is desired (relative to VIN), then 1 Vfor its value should be used in the preceding equations. The value for VINL should be scaled by one-half also. The window comparator design can also be designed using operational amplifiers and the same equations as for the LM339 comparator circuit. For the best performance, however, a transistor output stage should be included in the design. Motorola Sensor Device Data AN1535 CONCLUSION The circuits that have been described herein are intended to demonstrate relatively simple and cost effective ways of interfacing the MTS102/103/105 series of solid-state temperature sensors to digital systems. Several examples of simple signal conditioning the temperature sensor's output have been given for both analog temperature measurements, as well as logic-level switch applications. A means of amplifying and level-shifting the sensor's millivolt-level output to a 4 V signal swing (symmetrical with respect to AID converter range) is demonstrated. The same basic signal Motorola Sensor Device Data conditioning (amplifier) design is used in both types of sensor interfaces. However, the temperature switch design uses an additional comparator stage to create a logic-level output, by comparing the temperature sensor's amplified output voltage to a user-defined reference voltage. The flexibility olthe switch design makes it compatible with many different applications. The principal design presented here uses an op-amp with a transistor output stage, yielding excellent logic-level outputs and output transition speeds for many applications. Finally, several other comparison stage designs, including a window comparator, are evaluated and compared for overall performance. 4-165 MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1536 Digital Boat Speedometers Prepared by: Bill Lucas Industrial Technology Center INTRODUCTION This application note describes a Digital Boat Speedometer concept which uses a monolithic, temperature compensated silicon pressure sensor, analog signal-conditioning circuitry, microcontroller hardware/software and a liquid crystal display. This sensing system converts water head pressure to boat speed. This speedometer design using a 30 psi pressure sensor (Motorola PIN: MPX2200GP) yields a speed range of 5 mph to 45 mph. Calibration of the system is performed using data programmed into the microcontroller's internal memory. A key advantage in all Motorola pressure sensors is the patented X--ducer™, a single piezoresistive implant that replaces the traditional Wheatstone bridge configuration used by competitors. In addition to the X-ducer, Motorola integrates on-chip all necessary temperature compensation, eliminating the need for separate substrates/hybrids. This state-ofthe-art technology yields superior performance and reliability. Motorola pressure sensors are offered in several different port configurations to allow measurement of absolute, differential and gauge pressure. Motorola offers three pressure sensor types: uncompensated, temperature compensated and calibrated or fully signal conditioned. WATER PRESSURE TO BOAT SPEED CONVERSION A typical analog boat speedometer employs a pitot tube, a calibrated pressure gauge/speedometer and a hose to connect the two. The pitot tube, located at the boat transom, provides the pressure signal corresponding to boat speed. This pressure signal is transmitted to the gauge via the hose. Boat speed is related to the water pressure at the pitot tube as described by the following equation: P ex e * (V2/2g) where: V P e g 4-166 speed pressure at pitot tube specific weight of media gravitational acceleration For example, to calculate P in Ib/in2 for an ocean application use: V speed in mph 63.99 Ibs/ft3 at 60°F, seawater e (e will be smaller for fresh water) 32 ftlsec 2 g 15 mph 22 ft/sec 1 ft2 144 in 2 P = (63.99[lb/ft3] / 144[in2/ft2]) (V2[mph]2 (22/15)2[(ft/sec)/mph]2 / 2 (32.2)[ft/sec2]) P[PSI] = (8.~08)2 For example, if the boat is cruising at 30 mph, the impact pressure on the pitot tube is: P = (30/8.208)2 = 13.36 psi. DIGITAL BOAT SPEEDOMETER DESCRIPTION AND OPERATION The MPX2200GP senses the impact water pressure against the pitot tube and outputs a proportional differential voltage signal. This differential voltage signal is then fed (via an analog switch and gain circuitry) to a single slope analog-to--digital converter (AID) which is external to the microcontroller. The AID circuit can complete two separate conversions as well as a reference conversion simultaneously. This AID utilizes the microcontroller's intemal timers as counters and software to properly manipulate the data. The analog switch provides a way to flip the sensor outputs after an AID conversion step, which is necessary to null out the offset effects of the op-amps. This is accomplished by performing an analog conversion, reversing the sensor's differential output signal, performing another analog conversion, summing the two readings, then dividing this sum by two. Any op--amp offset present will be the same polarity regardless of the sensor output polarity, thus the op--amp offset can be mathematically nulled out. The digital representation of any analog signal is ratiometric to the reference voltages of the AID converter. Also, the sensor's output is ratiometric to its excitation voltage. Therefore, if both the sensor and AID reference voltages are connected to the same unregulated supply, the variations in sensor output will be nullified, and system accuracy will be maintained (i.e., systems in which both the AID converter's digital value - due to variations in the AID's reference voltages - and sensor's output voltage are ratio metric to the supply voltage so that a voltage regulator is not necessary). Motorola Sensor Device Data AN1536 Figure 1 shows the pressure sensor (XDCR) connected to the analog switches of the 74HC4053 which feeds the differential signal to the first stage of op-amps. An AID conversion is performed on the two op-amp output signals, Vout1 and Vou t2. The difference (Vout1 - Vout2) is computed and stored in microcontroller memory. The analog switch commutates (op-amp connections switch from YO and Zo to Y 1 and Z 1), reversing the sensor output signals to the two op-amps, and another conversion is performed. This value is then also stored in the microcontroller memory. To summarize, via software, the following computation takes place: Again, because any op-amp offset will remain the same polarity regardless of sensor output polarity, this routine will effectively cancel any amplifier offset. Any offset the sensor may introduce is compensated for by software routines that are invoked when the initial system calibration is done. The single slope AID provides 11 or more unsigned bits of resolution. This capability provides a water pressure resolution to at least 0.05 psi. This translates to a boat speed resolution of 0.1 mph over the entire speed range. Figure 2 describes the pressure versus voltage transfer function of the first op-amp stage. = Step 1: Vfirst Vout1 - Vout2 Step 2: Vsecond Vout2 - Vout1 Step 3: Vresult = =(Vfirst + Vsecond) / 2 +8 74HC4053 2 VO 15 +8 t I I I I I V1 2 ZO VOUlt 7 10 k 316k VOUT2 4 Z1 rh DENOTES ANALOG GROUND -:!:- 11 DENOTES LOGIC GROUND XDCR INPUT REVERSE CONTROL Figure 1. X-ducer, Instrument Amplifier and Analog Switch ------U3-1 (U3-7) ~ <:... ~ ::;~ 2 I o o 10 r- 20 PRESSURE IN t- 30 PSI Figure 2. Instrument Amplifier Transfer Function Motorola Sensor Device Data Figure 3 details the analog circuitry, microcontroller's timer capture registers and I/O port which comprise the single slope AID. The microcontroller's 16-bit free running counter is also employed, but not shown in the figure. Comparators U6A, U6B and U6D of the LM 139A are used to provide the AID function. Constant current source, U7, resistors R13 and R14 and diode D2 provide a linear voltage ramp to the inverting inputs of U6, with about 470 microamps charge current to capacitor C8, with transistor 01 in the off state. C8 will charge to 5 volts in about 5 milliseconds at the given current. 01 is turned on to provide a discharge path for C8 when required. The circuit is designed such that when the voltage to the inverting inputs of the comparators exceeds the voltage to the noninverting comparators, each comparator output will trip from a logic 1 to a logic o. One AID conversion consists of the following steps: (1) setting the pressure sensor output polarity (via software and the analog switches of U4) to the amplifier inputs of the MC33078 (U3), (2) reading the value of the free running 4-167 AN1536 counter, (3) turning off Q1, and (4) charging C8 and waiting for the three (U6) comparator outputs to change from 1 to O. When the comparator outputs change state, the microcontroller free running counter value is clocked into the microcontroller's input capture register. Contained in this register then is the number of counts required to charge C8 to a value large enough to trip the comparators. Via software, the voltage signal from U3 (corresponding to the applied pressure signal) can be compared to the "reference." The boat speed display for this design employs an MC145453 LCD driver and four-digit liquid cyrstal display, of which three digits and a decimal point are used. Figure 4 shows the connections between the display driver and the display. The display driver is connected to the microprocessor's serial peripheral interface (SPI). The software necessary to initialize, format and drive the LCD is included in the software listing contained in this article. LM334Z-3 U7 +8 lN914 >:----1r-...::32=-j ICl (PA2) 13 R13 1470 INPUT CAPTURE REGISTER 1 Rl1 10k 5% R14 1.5k 5% VREF (APPROX. 4.5 V) MC68HC711E9 27 PA7 33 FROM U3-7 14 GENERAL PURPOSE OUTPUT IC2(PA1) INPUT CAPTURE REGISTER 2 IC3 (PAO) INPUT CAPTURE REGISTER 3 Rl0 10k 5% +5 R9 10k 5% 34 FROM U3-1 Figure 3. Analog-to-Digltal Converter Front End with Microcontroller 4-168 Motorola Sensor Device Data s: 9o a iii" en CD ::J LCD en ~ LIQUID CRYSTAL DISPLAY oCD -1- ,,'< ,------I CD ----i=t- o ~ -- ,-1r---- I-- P- ~ Pl 37 36 5 6 7 34 35 8 31 32 9 10 -1- ,-1r-----I I-- r---I P- ( '-- -~ 26 lEE PART NUMBER LCD5657 OR EQUAL r-----I I-- ----i=t- '-,.- 11 29 30 12 26 27 13 14 I-BP -- 15 24 25 16 22 23 17 18 19 20 21 1 "T1 !C' c: iil ". +5 N1C 19 OJ 18 17 16 15 14 13 11 o ~ en "t:I I c- • CD CD o 3 !!l. !!1 c (ii' "t:I 10 9 8 7 6 4 5 3 II 44 43 42 41 40 39 38 37 II 36 31 30 29 28 I II • DATA BIT U1 35 33 32 ~26r IN OUTVCC 21 OSC r-IN MC145453FN VSS DATA CLOCK 25 124 iii' '< OJ o III a. I 0,11 Vss - - - - - . VDD C2 • . 1 CLOCK 2 DATA 1 70 k : 1 70 pF +5 GND J> ! 0> CD ...Z CII Co) en AN1536 Table 1 lists the jumper wire selections needed for calibration and operational modes. The jumper wire junction block (Jl, J2, J3) is connected to the microprocessor, pins PCO, PCl and PC2, respectively as shown in Figure 5. Table 1. Jl J2 J3 OUT OUT OUT OUT IN 100 psi X-ducer installed IN OUT 30 psi X-ducer installed 15 psi X-ducer installed OUT OUT OUT Display speed in mph IN IN OUT IN OUT OUT IN IN OUT Display pressure in psi IN IN IN Display speed in mph IN IN Full scale calibrate Zero calibrate +8 XTAL 1-'7---t--t--..., IA>-....---,,32'"1IGI (PA2) 13 RII 10 k RI9 10MEG 5% 5% 5% 2N7000 +5 +5 4.H1 5% EXTAL 27-1 '1-__+-_____"""""' MC68HC711 E9FN 14 RIO 10k R9 10k 5% IC3 (PAO) 34 45 PEl 42 PBO 52 VRH 51 VRL VREF +5 47 PE2 49 PE3 ~ 0.1* *331'F 44 PE4 +8 R2 1.15k VREF (APPROX. 4.5 V) 46 PE5 48 PE6 50 PE7 NOTES: UNLESS OTHERWISE NOTED, ALL RESISTORS 1% METAL FILM. RI8 ,.....--.. 4.7k RESET~I_7_ _ _5'_~4-~ 33 IC2(PAI) 5% GND t5 PA7 43 PEO RI 4.70 DI 5% + 12 > .....OI-J\II.tIr....~~-.. 6 IN4004 CI + C2 r=---.......--i U5 -= MODB XIRQ 18 19 IRQ 26 VDD RI5 PC2 RI6 II' PCI 10 PCO VSS PAS MODA PDO PDI PD2 PD5 STRA JI I 31 TEST JUMPERS- 20 21 22 25 (PD4) SCK 24 (PD3) MOSI 23 -= 2 t5c~3 1I-4 , US PINS 11-16 (PC2-PC7) ARE CONNECTED HERE FOR TERMINATION PURPOSES. Figure 5. Boat Speedometer Processor Board 4-170 Motorola Sensor Device Data AN1536 The calibration ofthis system is as follows. Refer to Table 1. CAUTION: While installing or changing the proper jumpers described by each step, power must be off. Reapply power to read the display after jumpers have been installed in their proper location for each step. In each step there is a few seconds' delay after switching the power on and before an output is displayed. Steps 1 through 3 must be performed prior to system being operational. Calibration 1. The pressure range of the system must be established. The present software installed in this design supports 15, 30 and 100 psi sensors. Using an MPX2200D sensor (30 psi) for example, only jumper J2 should be installed. After power is applied, the LCD should read "30." Power off the system prior to proceeding to step 2. 2. The total system offset, due to the sensor and AID, must be established for the software routine to effectively calibrate. With power off, jumpers Jl and J3 should be installed. Reapply power, and the LCD should respond Motorola Sensor Device Data with "000." The offset value measured in this step is thus stored for use in circuit operation. Power off the system prior to proceeding to step 3. 3. In this step, the system full scale span is calibrated. With power off, install jumper Jl only. Now apply the full rated pressure (30 psi for MPX2200GP) to the sensor, power on and ensure the display reads "FFF." The full scale span measured in this step is thus stored for use in circuit operation. Power off the system prior to step 4. Operation 4. Ensure power is off, and install jumpers Jl, J2 and J3. The system is now ready for operation. Simply apply power and pressure to the sensor, and the LCD will display the proportional speed above 5 mph, up to the limits of the sensor. REFERENCES Burry, Michael (1989). "Calibration-Free Pressure Sensor System," Motorola Application Note AN1097. 4-171 AN1536 NOTB. THIS WAS COMPILED WITH A COMPILER COURTESY OF: INTROL CORP. 9220 W. HOWARD AVE. MILWAUKEE, WI. 53228 PHONE (414) 327-7734. SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER COMPILERS. THE HEADER FILE io6811.h HAS I/O PORT DEFINITIONS FOR THE 1/0 PORTS PARTICULAR TO THE MC68HC711E9. A TYPICAL ENTRY FOR PORT A WILL FOLLOW. THE FIRST LINE ESTABLISHES A BASE ADDRESS BY WHICH ALL I/O FACILITIES AND COUNTERS ARE BIASED. REFER TO THE MC68HC711E9 DATA FOR MORE INFORMATION RELATIVE TO 1/0 AND TIMER ADDRESSES. #define IOBIAS QxlOOO #define PORTA (* (char *) 1* BASE ADDRESS OF THE I/O FOR THE 68HC11 *1 (IOBIAS + 0» 1* PORT A *1 THE STARTUP ROUTINE NEED ONLY LOAD THE STACK TO THE TOP OF RAM, ZERO THE MICROCONTROLLER' S RAM AND PERFORM A BaR MAIN (BRANCH TO SUBROUTINE "MAIN"). THIS SOURCE CODE, HEADER FILE, COMPILED OBJECT CODE, AND LISTING FILES ARE AVAILABLE ON: THE MOTOROLA FREEWARE LINE AUSTIN, TX. (512) 891-3733. Bill Lucas 6/21/90 THE CODE STARTS HERE #inc1ude */ 1* I/O port definitions *1 /* define locations in the eeprom to store calibration information * / #define EEPROM (char*)Oxb600 1* used by calibration functions */ #define EEBASE Oxb600 1* start address of the eeprom * I #define ADZERO (* ( long int *l ( EEBASE + 0 )} 1* auto zero value *1 #define HIATOD (* ( long int *) ( EEBASE + 4 )} 1* full scale measured input */ #define XDCRMAX (* ( char *) ( EEBASE + 8 » /* full scale input of the xdcr */ union bytes { unsigned long int 1; char b[4]; }; /* ADZERO.l for long word ADZERO.b[O]; for byte *1 const char l.cdtab[] = {95, /* 1cd pattern table const int dectable [) = 6, 59, 47, 102, 109, 125,7, 127, 111, 0 }; 3 5 6 8 9 blank * I 10000, 1000, 100, 10 }; char digit [5]; 1* buffer to hold results from cvt_bin_dec function '* */ fifififi##fifi##fifi####fifi#####fi############fi###fifififi#fi###fifi####fifififi######## /* real time interrupt service routine *' *1 void real_time_interrupt (void) /* hits every 4.096 InS. */ { TFLG2 = Ox40; 1* clear the interrupt flag *1 ) '* '* '* #######################fi############################fi############fifi #fifi#######fi#fi##fi######fififififi#fifi#########fi#fifififi#fi##fi####fifififi######### *' *' write_eeprom(OxA5,EEPROM); write A5h to first byte of EEPROM *1 void write_eeprom(char data, char *address) PPROG = Ox16; *address = Oxff; PPROG = Ox17; delay() , PPROG = OxO; 1* single-byte erase mode "'I 1 * write anything * 1 1* turn on programming voltage * I 1* erase complete *1 I * now program the data * I PPROG = Ox02; 1* set eelat bit *1 "'address = data; /* write data * / PPROG = Ox03; 1* set ee1at and eepgm bits *1 delay() ; PPROG = 0; 1* read mode */ 1* programming complete * / '* ##fi#################fifi#####fifi#######fi#######fi######fi############### *' long lot convert{char polarity) 4-172 Motorola Sensor Device Data AN1536 int cntr; I * free running timer system counter '* I int rO; /* difference between cntr and input capture int rl; /* difference between cntr and input capture int r2; 1* difference between cntr and input capture long difference; 1* the difference between the upper and instrument amplifier outputs unsigned long int pfs; /* result defined as percent of full scale the reference voltage '* I unsigned unsigned unsigned unsigned unsigned *' relative to *' if (polarity == 1) 1* set the hc4053 configuration /* polarity = 1 means + output of sensor */ PORTB &= Oxfe; else PORTB 1= Oxl; delay() , register *1 2 register */ 3 register */ lower /* is connected to the upper opamp '*1 /* this will allow the hc4053 to stabilize and the cap to discharge from the previous conversion *1 TFLG1=OX07; 1* clear the input capture flags *I cntr=TCNTi I * get the current count * I PORTA &= OX7F; 1* turn the fet off *1 while «TFLG1 & OX7) < 7); 1* loop until all three input capture flags are set * I rO TIC1 - cotr; 1* reference voltage *1 1* top side of the inst. amp *1 r1 TIC2 - cotr; 1* lower side of the inst. amp */ r2 TIC3 - cotr; PORTA 1= oxeo; 1* turn the fet on *1 if (polarity == 1) difference = ( r1 + 1000 ) - r2; else difference = ( r2 + 1000 ) - rl; pfs = (difference * 10000) I rO; if (difference> 32767) 1* this will cover up the case where the a to d computes a negative value * I pfs=O; return ( pfs ); atod() 1* computes the aId value in terms of % full scale *1 ( unsigned long int X t Y t z; X = convert(l); 1* normal *1 y = convert (0) ; I * reversed * I z = (x + y»>l 1* 2x difference I 2 *1 return(z); /* z is percent of full scale */ integrate() I_ returns the aId value in terms of % full scale and computes offset from calibration values _ I unsigned long int j; int i; j=O; for (i=O; i<20; ++i) +=atod() ; j = (j/20) - ADZERO; return(j) ; cala2d() 1* null out the xdcr zero input offset *1 1* returns the average of 50 raw aId conversions this is only used by the calibration functions *I unsigned long int j; int i; j=o, for (i=O; i<50; ++i) j +=atod(); j=j/50, return(j) ; / * ################################################################### * / cvt_bin_dec ( unsigned int arg ) char i; for ( i=O; < 6; ++i Motorola Sensor Device Data 4-173 AN1536 diglt[ij 0; i=O; i for 1* put blanks in all digit positions ""1 < 4; ++1 ) if (arg >= dectable [1] ) { digit [1] = arg Ideatable [1]; arg = arg- (digit [1] .,., dec table [i)); digit [1] = arg; } '* H##HH##HHH####HH####HHH##HHUHHHHH####HHH##HH##HHH#H#H###HH####H### *' delay{) { lnt i; for (1=0; i<1000; +-t·i); 1* delay about 1.5 ms. '* @ 8 mhz xtal *1 H###HHH#HHHHHHHHH##HHHHH##HH#H#HHHHHHHHHHHH#HHHHH#HH#HHHHHHHHHHH#HH *' 1* set-up i/o for the single slope aId, initialize the spi port, then initialize the MC145453 for output ""1 init_io(void) { char i; 1* set-up i/o for the aId */ 1= aXeD; 1* make pa7 an output *1 1* turn the fat on */ PORTB &= OX7F; 1* set-up the HC4053 in the YO/ZO connect mode *1 TCTL2 OX2A; 1* capture on falling edge for timer capture 0,1.,2 */ PACTL PORTA 1= oxeD; I TFLGl = aX07 i * clear any pending capture flags .,., I 1* set-up the ilo for the api subsystem * I PORTD=Ox2f; /* set output low before setting the direction register *1 DDRD=Ox38; 1* ss = 1, sck = 1, mosi = 1 * 1 SPCR=Ox51; 1* enable spi, make the cpu the master, E clock 14 *1 1* initialize the led driver *1 for (i=O; i<4; ++i) 1* four bytes of zeros * I { write_spi (2); '* 1* this creates a start bit and data bit 1 for the next write to the me145453 *1 #HHH##HH#HHH#H##HH#H#########H####HH#HH#HH###H#H##HHHHHH###H####HHH *' 1* this is an attempt at the newton square root method *1 sqrt (unsigned long b) { unsigned long xO, xl; if ( b < 4 ) { b=2; return (b); } else xO=4; x1=10; while (xO ! = xl) if ( (x1-xO) ==1 ) break; x1=xO; xO= (b'xO) +xO ) » 1 ); « b=xO; return (b); '* ####H##H##HHH######H###HHHHH#HHH#HH##HHH####H#HH#H###H###H#HHHH# ### 4-174 *' Motorola Sensor Device Data AN1536 write() ( char i; digit[l]=10, if (digit [2] ==0) (digit [2] =10,) if ( digit[2]==10 &to digit[3]==0 (digit [3] =10,1 for 1=1; 1<5; ++1 ) if (i==4) write_spit (lcdtab[digit [ill ) +Ox80), else write_spi (lcdtab [digit [i]]), 1* this creates a start bit and data bit 1 write_Bpi (2); for the next write to the mc1454S3 '* write_Bpi ( char a) write a character to the api port *1 SPDR=ai while ( J ( SPSR & OxBD ) ) {} '* I * '*1 '* loop until the spif = 1 *1 ################################################################### *' This function is called at power-up and will determine the operation of the system. The user must c~lete the system configuration prior to setting the jumper in the first or last two configurations in the table or erroneous operation is guaranteed I test/operation jumper configuration: J3 J2 J1 1 1 1 1 0 1 1 1 = jumper removed display speed in mph reserved 30 psi xdcr installed 15 psi xdcr installed full scale calibrate zero calibrate display pressure in psi display speed in mph *' setconfig{ ) ( char i; for { i=O; i<125; H·i } delay(); 1* to let the charge pump come to life wll *1 = PORTC &. Ox07; 1* and off the unused bits *1 if ( i == 7 ) display_speed ( ) ; i f ( i == 6 ) setup_error(); 1* non-valid pattern output -88- on diaplay*1 if ( i == 5 ) {write_eeprom(30,&'XDCRMAX); 1* xdcr is 30 psi *1 display{30) ; ) if ( i == 4 {write_eeprom(15,&XDCRMAX); 1* xdcr is lS psi *1 display(15) ; ) if(i-=3 fullacale_calibrate() ; if ( i == 2 ) zero_calibrate () 1 if ( i == 1 ) display-pressure (); else display_speed() ; '* ################################################################### *' display(char d) Motorola Sensor Device Data 4-175 AN1536 if (d==30) ( write_Bpi (0); write_Bpi (0); write_spi(47); write_Bpi (95) ; /.,. blank the upper digi t * I /* blank the next to upper digit "'1 /* 3 */ 1* 0 *1 ) if (d==lS) ( write_Bpi (0) ; write_spi(D); write_spi(6); write_Bpi (109) ; 1* /* /* /* blank the upper digit .,. / blank the next to upper digit */ 1 *1 5 *I ) write_Bpi (2); while(l) ; ) '* ################################################################### */ fullscale_calibrate () I int i; long int temp; union bytes average; temp=O; average.1 = cala2d(}; I'll get the average of 50 aId conversions */ for ( i=O; i<4; ++i) write_eeprom(average.b[i) ,EEPROM+i+4); write_spi(O}; write_spi(l13); write_spi(l13); write_spi(113); write_spi(2) ; while(l) ; '* 1'It blank the upper digit *1 1'It P *1 1* F *1 /* F */ ################################################################### *' zero_calibrate ( ) I int i; long int temp; union bytes average; temp=O; average.l = cala2d(); /* get the average of 50 aId conversions */ for ( i=O; i<4; ++i) write_eeprom(average.b[i] ,EEPROM+i}; write_spieD); write_spi(95); write_spi(95}; write_spi(95); write_spi (2) ; 1* blank the upper digit */ 1* 0 */ 1* 1* *1 *1 while(l); ) '* ################################################################### 1* speed=8. 208 (square root (%full scale*transducer full scale» display_speed () I long atod_result; unsigned int j; while(l) *' "'1 { atod_result = integrate (); 1* read the aId *1 atod_result= ( (atod_result*lOOOO) I (HIATOD-ADZERO) ) * XDCRMAX; atod_result=sqrt (atod_result); atod_result= (atod_result"'8208) 110000; j=atod_result; 4-176 Motorola Sensor Device Data AN1536 if (j P2. The Pressure (P1) side may be identified by using the example table below: PRESSURE SENSORS Case Type 4PIN Part Number Positive Pressure (P1) Side Identifier MPXxxxxA 344-08 Stainless Steel Cap MPXxxxxD 344-08 Stainless Steel Cap MPXxxxxDP 352-02 Side with Part Marking MPXxxxxAP 350-03 Side with Port Attached MPXxxxxGP 350-03 Side with Port Attached MPXxxxxGVP 350-04 Stainless Steel Cap MPXxxxxAS 371-06 Side with Port Attached MPXxxxxGS 371-06 Side with Port Attached MPXxxxxGVS 371-05 Stainless Steel Cap MPXxxxxASX 371C-02 Side with Port Attached MPXxxxxGSX 371C-02 Side with Port Attached MPXxxxxGVSX 371D-02 Stainless Steel Cap Case Type 6 PIN Part Number Positive Pressure (P1) Side Identifier MPXxxxxA 867-04 Stainless Steel Cap MPXxxxxD 867-04 Stainless Steel Cap MPXxxxxDP 867C-02 Side with Part Marking MPXxxxxAP 8678-02 Side with Port Attached MPXxxxxGP 8678-02 Side with Port Attached MPXxxxxGVP 867D-02 Stainless Steel Cap MPXxxxxAS 867E-02 Side with Port Attached MPXxxxxGS 867E-02 Side with Port Attached MPXxxxxGVS 867A-02 Stainless Steel Cap MPXxxxxASX 867F-02 Side with Port Attached MPXxxxxGSX 867F-02 Side with Port Attached MPXxxxxGVSX 867G-02 Stainless Steel Cap MPXxxxxGVM 867H-02 Stainless Steel Cap Motorola Sensor Device Data Appendices 6-9 APPENDIX 7 Connectors for MPX Pressure Sensors In some applications connectors are used to interface with the MPX pressure sensor. The following manufacturer can provide off-the-shelf connectors which interface to both 4-pin and 6-pin pressure sensor packages. Manufacturer: JS Terminal Mount Prospect, IL 708-803-3300 Housing information: 4-pin 6-pin SMP-04V-BC SMP-06V-BC Pins: SHF-01T-0.8SS Crimping tool: YC12 Appendices 6-10 Motorola Sensor Device Data APPENDIX 8 Pressure Measurement What is the difference between an absolute, differential and gauge pressure sensor? Absolute Pressure An absolute pressure sensor is a sensor which measures external pressure relative to a zero pressure reference sealed inside the cavity of the chip. The output is proportional to the pressure difference between this reference and pressure applied externally. Sensor Die (Cross-Section) Constraint Wafer Sealed Vacuum Behind Diaphragm Differential Pressure A differential pressure sensor is a sensor which is designed to accept simultaneously two independent pressure sources. The output is proportional to the pressure difference between the two sources. PI Pressure \.. Sensor Die ~ (Cross·Section) / '--_---III c~~\~:nt Diaphragm ~~~'"' Gauge Pressure A gauge pressure sensor is a special case of differential pressure sensor. One side of the sensor is open to atmosphere. PI Pressure j / \.. Sensor Die (Cross-Section) Constraint Wafer Motorola Sensor Device Data 1-.....'----, '--_---I.I .I Diaphragm ~~~O~._fi Appendices 6-11 APPENDIX 9 How the X-ducer Works What is the X-ducer and how does it work? The X-ducer is a patented single element silicon piezoresistor which constitutes a shear stress strain gauge when implanted at a critical point on the edge of a thin silicon micromachined diaphragm. Applying pressure to the diaphragm results in a resistance change in the strain gauge. Unlike the widely used Wheatstone Bridge which is a network of four closely matched and precisely aligned resistors, the X-ducer is highly manufacturable, and it produces extremely accurate and repeatable outputs. The X-ducer optimizes important device characteristics such as linearity and hysteresis. Since the strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in thermal expansion as in other devices. While the output parameters are temperature dependent, the single element X-ducer greatly simplifies compensation techniques required when the device is operated over extensive temperature ranges. Appendices 6-12 Motorola Sensor Device Data APPENDIX 10 Standard Warranty Clause Seller warrants that its products sold hereunder will at the time of shipment be free from defects in material and workmanship, and will conform to Seller's approved specifications. If products are not as warranted, Seller shall, at its option and as Buyer's exclusive remedy, either refund the purchase price, or repair, or replace the product, provided proof of purchase and written notice of nonconformance are received within the applicable periods noted below and provided said nonconforming products are, with Seller's written authorization, returned in protected shipping containers FOB Seller's plant within thirty (30) days after expiration of the warranty period unless otherwise specified herein. If product does not conform to this warranty, Seller will pay for the reasonable cost of transporting the goods to and from Seller's plant. This warranty shall not apply to any products Seller determines have been, by Buyer or otherwise, subjected to improper testing, or have been the subject of mishandling or misuse. THIS WARRANTY EXTENDS TO BUYER ONLY AND MAY BE INVOKED BY BUYER ONLY FOR ITS CUSTOMERS. SELLER WILL NOT ACCEPT WARRANTY RETURNS DIRECTLY FROM BUYER'S CUSTOMERS OR USERS OF BUYER'S PRODUCTS. THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES WHETHER EXPRESS, IMPLIED OR STATUTORY INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Seller's warranty shall not be enlarged, and no obligation or liability shall arise out of Seller's rendering of technical advice and/or assistance. A. Time periods, products, exceptions and other restrictions applicable to the above warranty are: (1) Unless otherwise stated herein, products are warranted for a period of one (1) year from date of shipment. (2) Device ChipslWafers. Seller warrants that device chips or wafers have, at shipment, been subjected to electrical tesUprobe and visual inspection. Warranty shall apply to products returned to Seller within ninety (90) days from date of shipment. This warranty shall not apply to any chips or wafers improperly removed from their original shipping container and/or subjected to testing or operational procedures not approved by Seller in writing. B. Development products and Licensed Programs are licensed on an "AS IS" basis. IN NO EVENT SHALL SELLER BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. Motorola Sensor Device Data Appendices 6-13 Appendices 6-14 Motorola Sensor Device Data Section Seven , ~.-""~.~ ;' ·4;~. ., . ' , ~'.~:~"'::'''.l''' :. ,'f\.. Glossary and Symbols Glossary of Terms ........................... 7-2 Symbols, Terms and Definitions ............. 7-5 Motorola Sensor Device Data Glossary and Symbols 7-1 Glossary of Terms Absolute Pressure Sensor A sensor which measures input pressure in relation to a zero pressure (a total vacuum on one side of the diaphragm) reference. Analog Output An elee!rical output from a sensor that changes proportionately with any change in input pressure. Accuracy - also see Pressure Error A comparison olthe actual output signal of a device to the true value olthe input pressure. The various errors (such as linearity, hysteresis, repeatability and temperature shift) attributing to the accuracy of a device are usually expressed as a percent of full scale output (FSO). Altimetrlc Pressure Trensducer A barometric pressure transducer used to determine altitude from the pressure-altitude profile. Barometric Pressure Transducer An absolute pressure sensor that measures the local ambient atmospheric pressure. Burst Pressure The maximum pressure that can be applied to a transducer without rupture of either the sensing element or transducer case. Calibration A process of modifying sensor output to improve output accuracy. Chip A die (unpackaged semicondue!or device) cut from a silicon wafer, incorporating semiconductor circuit elements such as resistors, diodes, transistors, and/or capacitors. Compensation Added circuitry or materials designed to counteract known sources of error. Diaphragm The membrane of material that remains after etching a cavity into the silicon sensing chip. Changes in input pressure cause the diaphragm to deflee!. Differential Pressure Sensor A sensor which is designed to accept simultaneously two independent pressure sources. The output is proportional to the pressure difference between the two sources. Diffusion A thermochemical process whereby controlled impurities are introduced into the silicon to define the piezoresistor. Compared to ion implantation, it has two major disadvantages: 1) the maximum impurity concentration occurs at the surface of the silicon rendering it subject to surface contamination, and making it nearly impossible to produce buried piezoresistors; 2) control over impurity concentrations and levels is about one thousand times poorer than obtained with ion implantation. Drift An undesired change in output over a period of time, with constant input pressure applied. End Point Straight Line Fit Motorola's method of defining linearity. The maximum deviation of any data point on a sensor output curve from a straight line drawn between the end data points on that output curve. Error The algebraic difference between the indicated value and the true value of the input pressure. Usually expressed in percent offull scale span, sometimes expressed in percentofthe sensor output reading. Error Band The band of maximum deviations of the output values from a specified reference line or curve due to those causes attributable to the sensor. Usually expressed as "± % of full scale output." The error band should be specified as applicable over at least two calibration cycles, so as to include repeatability, and verified accordingly. Excitation Voltage (Current)see Supply Voltage (Current) The external elee!rical voltage and/or current applied to a sensor for its proper operation (often referred to as the supply circuit or voltage). Motorola specifies constant voltage operation only. Full Scale Output The output at full scale pressure at a specified supply voltage. This signal is the sum of the offset signal plus the full scale span. Full Scale Span The change in output over the operating pressure range at a specified supply voltage. The SPAN of a device is the output voltage variation given between zero differential pressure and any given pressure. FULL SCALE SPAN is the output variation between zero differential pressure and when the maximum recommended operating pressure is applied. Hysteresis - also see Pressure Hysteresis and Temperature Hysteresis HYSTERESIS refers to a transducer'S ability to reproduce the same output for the same input, regardless of whether the input is increasing or decreasing. PRESSURE HYSTERESIS is measured at a constant temperature while TEMPERATURE HYSTERESIS is measured at a constant pressure in the operating pressure range. Glossary and Symbols 7-2 Motorola Sensor Device Data Glossary of Terms (continued) Input Impedance (Resistance) The impedance (resistance) measured between the positive and negative (ground) inputterminals at a specified frequency with the output terminals open. For Motorola X-ducer, this is a resistance measurement only. Ion Implantation A process whereby impurity ions are accelerated to a specific energy level and impinged upon the silicon wafer. The energy level determines the depth to which the impurity ions penetrate the silicon. Impingement time determines the impurity concentration. Thus, it is possible to independently control these parameters, and buried piezoresistors are easily produced. Ion implantation is increasingly used throughout the semiconductor industry to provide a variety of products with improved performance over those produced by diffusion. Laser Trimming (Automated) A method for adjusting the value of thin film resistors using a computer-controlled laser system. Leakage Rate The rate at which a fluid is permitted or determined to leak through a seal. The type of fluid, the differential pressure across the seal, the direction of leakage, and the location of the seal must be specified. Linearity Error The maximum deviation of the output from a straight line relationship with pressure over the operating pressure range, the type of straight line relationship (end point, least square approximation, etc.) should be specified. Load Impedance The impedance presented to the output terminals of a sensor by the associated external circuitry. Null The condition when the pressure on each side of the sensing diaphragm is equal. Null Offset The electrical output present, when the pressure sensor is at null. Null Temperature Shift The change in null output value due to a change in temperature. Null Output See ZERO PRESSURE OFFSET Offset See ZERO PRESSURE OFFSET Operating Pressure Range The range of pressures between minimum and maximum pressures at which the output will meet the specified operating characteristics. Operating Temperature Range The range of temperature between minimum and maximum temperature at which the output will meet the specified operating characteristics. Output Impedance The impedance measured between the positive and negative (ground) output terminals at a specified frequency with the input open. Overpressu re The maximum specified pressure which may be applied to the sensing element of a sensor without causing a permanent change in the output characteristics. Plezoreslstance A resistive element that changes resistance relative to the applied stress it experiences (e.g., strain gauge). Pressure Error The maximum difference between the true pressure and the pressure inferred from the output for any pressure in the operating pressure range. Pressure Hysteresis The difference in the output at any given pressure in the operating pressure range when this pressure is approached from the minimum operating pressure and when approached from the maximum operating pressure at room temperature. Pressure Range - also see Operating Pressure Range The pressure limits over which the pressure sensor is calibrated or specified. Pressure Sensor A device that converts an input pressure into an electrical output. Proof Pressure See OVERPRESSURE Ratlometrlc Ratiometricity refers to the ability of the transducer to maintain a constant sensitivity, at a constant pressure, over a range of supply voltage values. Ratlometrlc (Ratlometrlclty Error) At a given supply voltage, sensor output is a proportion of that supply voltage. Ratiometricity error is the change in this proportion resulting from any change to the supply voltage. Usually expressed as a percent of full scale output. Motorola Sensor Device Data Glossary and Symbols 7-3 Glossary of Terms (continued) Range See OPERATING PRESSURE RANGE Repeatability The maximum change in output under fixed operating cond~ions over a specified period of time. Resolution The maximum change in pressure required to give a specified change in the output. Response Time The time required for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Room Conditions Ambient environmental conditions under which sensors most commonly operate. Sensing Element That part of a sensor which responds directly to changes in input pressure. Sensitivity The change in output per unit change in pressure for a specified supply voltage or current. Sensitivity Shift A change in sensitivity resulting from an environmental change such as temperature. Stability The maximum difference in the output at any pressure in the operating pressure range when this pressure is applied consecutively under the same conditions and from the same direction. Storage Temperature Range The range of temperature between minimum and maximum which can be applied without causing the sensor to fail to meet the specified operating characteristics. Strain Gauge A sensing device providing a change in electrical resistance proportional to the level of applied stress. Supply Voltage (Current) The voltage (current) applied to the positive and negative (ground) input terminals. Temperature Coefficient of Full Scale Span The percent change in full scale span per unit change in temperature relative to the full scale span at a specified temperature. Temperature Coefficient of Resistance The percent change in the DC input impedance per unit change in temperature relative to the DC input impedance at a specified temperature. Temperature Error The maximum change in output at any pressure in the operating pressure range when the temperature is changed over a specified temperature range. Temperature Hysteresis The difference in output at any temperature in the operating temperature range when the temperature is approached from the minimum operating temperature and when approached from the maximum operating temperature with zero pressure applied. Thermal Offset Shift See TEMPERATURE COEFFICIENT OF OFFSET Thermal Span Shift See TEMPERATURE COEFFICIENT OF FULL SCALE SPAN Thermal Zero Shift See TEMPERATURE COEFFICIENT OF OFFSET Thin Film A technology using vacuum deposition of conductors and dielectric materials onto a substrate (frequently silicon) to form an electrical circuit. Vacuum A perfect vacuum is the absence of gaseous fluid. Zero Pressure Offset The output at zero pressure (absolute or differential, depending on the device type) for a specified supply voltage or current. Glossary and Symbols 7-4 Motorola Sensor Device Data Symbols, Terms and Definitions The following are the most commonly used letter symbols, terms and definitions associated with solid state silicon pressure sensors. Pburst Burst Pressure The maximum pressure that can be applied to a transducerwilhout ruptureof either the sensing element or transducer case. 10 supply current The current drawn by the sensor from the voltage source. 10+ output source current The current sourcing capability of the pressure sensor. kPa kilopascals Unit of pressure. 1 kPa = 0.145038 PSI. Linearity The maximum deviation of the output from a straight line relationship with pressure over the operaling pressure range, the type of straighl line relationship (end point. least square approximation, etc.) should be specilied. mmHg millimeters of mercury Unit of pressure. 1 mmHg = 0.0193368 PSI. Pm ax overpressure The maximum specified pressure which may be applied to the sensing element without causing a permanent change in the oulput characteristics. POP operating pressure range The range of pressures between minimum and maximum temperature at which the output will meet the specified operating characteristics. Pressure Hysteresis The difference in the output at any given pressure in the operating pressure range when this pressure is approached from the minimum operating pressure and when approached from the maximum operating pressure at room temperature. pounds per square inch Unit of pressure. 1 PSI = 6.89473 kPa. Repeatability The maximum change in oulput under fixed operating conditions over a specified period of time. input resistance The resistance measured between the positive and negative input terminals at a specified frequency with the output terminals open. TA operating temperature The temperature range over which the device may safely operate. TCR temperature coefficient of resistance The percent change in the DC input impedance per unit change in temperature relative to the DC input impedance at a specified temperature (typically +25°C). temperature coeffioient of full scale span The percent change in full scale span per unit change in temperature relative to the full scale span at a specified temperature (typically +25°C). TCVott temperature coefficient of offset The percent change in offset per unit change in temperature relative to the offset at a specified temperature (typically +25°C). Tstg storage temperature The temperature range at which the device, without any power applied, may be stored. tR response time The time required for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Temperature Hysteresis The difference in output at any temperature in the operating temperature range when the temperature is approached from the minimum operating temperature and when approached from the maximum operating temperature with zero pressure applied. PSI Ro VFSS full scale span voltage The change in output over the operating pressure range at a specified supply voltage. VOff offset voltage The output with zero differential pressure applied for a specified supply voltage or current. Vs supply voltage de The dc excitation voltage applied to the sensor. For precise circuit operation, a regulated supply should be used. VS max maximum supply voltage The maximum supply voltage that may be applied to a circuit or connected to the sensor. Zin input impedance The resistance measured between the positive and negative input terminals at a specified frequency with the outputterminals open. For Motorola X-ducer, this is a resistance measurementonly. Zout output impedance The resistance measured between the positive and negative output terminals at a specified frequency with the input terminals open. I1V/I1P sensitivity The change in output per unit change in pressure for a specified supply voltage. Motorola Sensor Device Data Glossary and Symbols 7-5 Glossary and Symbols 7-6 Motorola Sensor Device Data Section Eight Device Sample Kits Sensor Sample Kit Information .............. 8-2 Sensor Sample Kit Order Form .............. 8-3 Motorola Sensor Device Data Device Sample Kits 8-1 Sensor Sample Kits Order No. Pressu re Range Description Cost KITNOK29/D 1.5 PSI One MPX201 ODP, Temperature Compensated, Dual Ported Sensor with Spec Sheet and Literature. FREE KITNOK321D 100PSI One MPX700DP, Uncompensated, Dual Ported Sensor with Spec Sheet and Literature. FREE KITMPX5100ND 15PSI One MPX51 OOAP, Absolute, Signal Conditioned, Single Ported Sensor with Spec Sheet and Literature. $25 KITMPX5100D/D 15PSI One MPX51 OODP, Differential, Signal Conditioned, Dual Ported Sensor with Spec Sheet and Literature. $25 KITMPX7100D/D 15PSI One MPX7100DP, Differential, High Impedance Dual Ported Sensor with Spec Sheet and Literature. FREE KITMPX7200D/D 30 PSI One MPX7200DP, Differential, High Impedance Dual Ported Sensor with Spec Sheet and Literature. FREE Device Sample Kits 8-2 Motorola Sensor Device Data Sensor Sample Kits Order Form Availability Price KITNOK29/D Kit Number MPX2010DP Sample Kit Now Free KITNOK32/D MPX700DP Sample Kit Now Free KITMPX5100ND MPX5100AP Sample Kit Now $25.00 KITMPX5100D/D MPX51 OODP Sample Kit Now $25.00 KITMPX7100D/D MPX71 OODP Sample Kit Now FREE KITMPX7200D/D MPX7200DP Sample Kit Now FREE Kit Title Qty Amount SUBTOTAL $ POSTAGE AND HANDLING $ GRAND TOTAL $ Postage and Handling: United States - Surface Air DHL World Mail- Air $5.00 $7.50 $20.00 Prices are sublecllo change. Documents Will be sent best way surface unless specified for air delivery. Allow 2 to 3 weeks for delivery. Motorola offers three convenient ways to order these kits, check or money order, purchase orders if credit line has previously been established, and credit card (Master Card, Visa and American Express). CreditCard# _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Exp. Date _ _ _ _ _ _ _ _ _ _ _ __ NAME PHONE ________________________ COMPANY TITLE _ _ _ _ _ _ _ _ _ _ _ __ ADDRESS _______________________________________________________________________ CITY _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ STATE ________ ZIP _____________ Mail with remittance to: MOTOROLA SEMICONDUCTOR PRODUCTS INC. P.O. Box 20912 Phoenix, Arizona, U.S.A. 85036-0924 For immediate service call: (800) 441-2447 Fax: (602) 994-6430 Motorola Sensor Device Data Device Sample Kits 8-3 Device Sample Kits 8-4 Motorola Sensor Device Data Section Nine Index and Cross-Reference Pressure Range Index . ...................... 9-2 Device Index . ................................ 9-4 Motorola Sensor Device Data Index and Cross Reference 9-1 Pressure Range Index Pressure Range (kPa/ psi) Device Product Type PRESSURE SENSORS 6/0.9 MPX906D Uncompensated 6/0.9 MPX906GVW Uncompensated Page Number 2-22 2-22 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 MPX10D MPX10DP MPX10GP MPX10GVP MPX10GS MPX10GVS MPX10GSX MPX10GVSX MPX12D MPX12DP MPX12GP MPX12GVP MPX12GS MPX12GVS MPX12GSX MPX12GVSX MPX2010D MPX2010DP MPX2010GP MPX2010GVP MPX2010GS MPX2010GVS MPX2010GSX MPX2010GVSX MPX2012D MPX2012DP MPX2012GP MPX2012GVP MPX2012GS MPX2012GVS MPX2012GSX MPX2012GVSX MPX5010D MPX5010DP MPX5010GP MPX5010GVP MPX5010GS MPX5010GVS MPX5010GSX MPX5010GVSX Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned 2-2 2-2 2-2 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-63 2-63 2-63 2-63 2-63 2-63 2-63 2-63 40/6 MPX2300DTt Temperature Compensated/Calibrated 2-42 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 50/7.25 50/7.25 50/7.25 50/7.25 5017.25 50/7.25 5017.25 5017.25 MPX50D MPX50DP MPX50GP MPX50GVP MPX50GS MPX50GVS MPX50GSX MPX50GVSX MPX2050D MPX2050DP MPX2050GP MPX2050GVP MPX2050GS MPX2050GVS MPX2050GSX MPX2050GVSX MPX2052D MPX2052DP Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-6 2-6 2-6 2-6 2-6 2-6 2-6 2-6 2-30 2-30 2-30 2-30 2-30 2-30 2-30 2-30 2-30 2-30 Index and Cross Reference 9-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 Pressure Range (kPa/ psi) Device Product Type 50/7.25 5017.25 50/7.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 5017.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 5017.25 50/7.25 5017.25 MPX2052GP MPX2052GVP MPX2052GS MPX2052GVS MPX2052GSX MPX2052GVSX MPX5050D MPX5050DP MPX5050GP MPX5050GVP MPX5050GS MPX5050GVS MPX5050GSX MPX5050GVSX MPX7050D MPX7050DP MPX7050GP MPX7050GVP MPX7050GS MPX7050GVS MPX7050GSX MPX7050GVSX Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance 2-30 2-30 2-30 2-30 2-30 2-30 2-66 2-66 2-66 2-66 2-66 2-66 2-66 2-66 2-66 2-66 2-66 2-86 2-86 2-86 2-86 2-86 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 MPX100A MPX100AP MPX100AS MPX100ASX MPX100D MPX100DP MPX100GP MPX100GVP MPX100GS MPX100GVS MPX100GSX MPX100GVSX MPX2100A MPX2100AP MPX2100AS MPX2100ASX MPX2100D MPX2100DP MPX2100GP MPX2100GVP MPX2100GS MPX2100GVS MPX2100GSX MPX2100GVSX MPX5100A MPX5100AP MPX5100AS MPX5100ASX MPX5100D MPX5100DP MPX5100GP MPX5100GVP MPX5100GS MPX5100GVS MPX5100GSX MPX5100GVSX MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned High Impedance High Impedance High Impedance High Impedance High Impedance 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-90 2-90 2-90 2-90 2-90 Page Number Motorola Sensor Device Data Pressure Range Index (continued) Pressure Range (kPa I psi) Device Product Type Page Number PRESSURE SENSORS (continued) 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 MPX7100DP MPX7100GP MPX7100GVP MPX7100GS MPX7100GVS MPX7100GSX MPX7100GVSX High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance 2-90 2-90 2-90 2-90 2-90 2-90 2-90 102/15.3 102/15.3 102/15.3 102/15.3 MPX4101A MPX4101AP MPX4101AS MPX4101ASX Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor 2-48 2-48 2-48 2-48 105/15.5 105/15.5 105/15.5 105/15.5 MPX4100A MPX4100AP MPX4100AS MPX4100ASX Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor 2-48 2-48 2-48 2-48 115/17 115/17 115/17 115/17 MPX4115A MPX4115AP MPX4115AS MPX4115ASX Barometeric Absolute Pressure Sensor Barometeric Absolute Pressure Sensor Barometeric Absolute Pressure Sensor Barometeric Absolute Pressure Sensor 2-55 2-55 2-55 2-55 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 MPX200A MPX200AP MPX200AS MPX200ASX MPX200D MPX200DP MPX200GP MPX200GVP MPX200GS MPX200GVS MPX200GSX MPX200GVSX MPX2200A MPX2200AP MPX2200AS MPX2200ASX MPX2200D MPX2200DP MPX2200GP MPX2200GVP MPX2200GS MPX2200GVS MPX2200GSX MPX2200GVSX MPX7200A MPX7200AP MPX7200AS MPX7200ASX Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature CompensatedlCalibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated High Impedance High Impedance High Impedance High Impedance 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-38 2-38 2-38 2-38 2-38 2-38 2-38 2-38 2-38 2-38 2-38 2-38 2-94 2-94 2-94 2-94 Motorola Sensor Device Data Pressure Range (kPa I psi) Device Product Type 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 MPX7200D MPX7200DP MPX7200GP MPX7200GVP MPX7200GS MPX7200GVS MPX7200GSX MPX7200GVSX High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance 2-94 2-94 2-94 2-94 2-94 2-94 2-94 2-94 250/35 250/35 250/35 250/35 MPX4250A MPX4250AP MPX4250AS MPX4250ASX Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned 2-59 2-59 2-59 2-59 500175 500175 500175 500/75 500175 500175 500175 500175 MPX5500D MPX5500DP MPX5500GP MPX5500GVP MPX5500GS MPX5500GVS MPX5500GSX MPX5500GVSX Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned 2-77 2-77 2-77 2-77 2-77 2-77 2-77 2-77 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 700/100 MPX700A MPX700AP MPX700AS MPX700ASX MPX700D MPX700DP MPX700GP MPX700GVP MPX700GS MPX700GVS MPX700GSX MPX700GVSX MPX2700D MPX2700DP MPX2700GP MPX2700GVP MPX2700GS MPX2700GVS MPX2700GSX MPX2700GVSX MPX5700D MPX5700DP MPX5700GP MPX5700GVP MPX5700GS MPX5700GVS MPX5700GSX MPX5700GVSX Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Temperature Compensated/Calibrated Temperature CompensatedlCalibrated Temperature CompensatedlCalibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature CompensatedlCalibrated Temperature CompensatedlCalibrated Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned 2-18 2-18 2-18 2-18 2-18 2-18 2-18 2-18 2-18 2-18 2-18 2-18 2-44 2-44 2-44 2-44 2-44 2-44 2-44 2-44 2-80 2-80 2-80 2-80 2-80 2-80 2-80 2-80 1000/150 MPX5999D Signal Conditioned 2-83 Page Number Index and Cross Reference 9-3 Device Index Device Pressure Range (kPa/psl) PRESSURE MPX100A MPX100AP MPX100AS MPX100ASX MPX100D MPX100DP MPX100GP MPX100GS MPX100GSX MPX100GVP SENSORS 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated 100/14.5 Uncompensated Product Type Page Number 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 2-10 Device Pressure Range (kPal psi) Product Type Page Number MPX2050GSX MPX2050GVP MPX2050GVS MPX2050GVSX MPX2052D MPX2052DP MPX2052GP MPX2052GS MPX2052GSX MPX2052GVP 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 50/7.25 Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-30 2-30 2-30 2-30 2-30 2-30 2-30 2-30 2-30 2-30 MPX2052GVS MPX2052GVSX MPX2100A MPX2100AP MPX2100AS MPX2100ASX MPX2100D MPX2100DP MPX2100GP MPX2100GS 50/7.25 50/7.25 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-30 2-30 2-34 2-34 2-34 2-34 2-34 2-34 2-34 2-34 MPX2100GSX MPX2100GVP MPX2100GVS MPX2100GVSX MPX2200A MPX2200AP MPX2200AS MPX2200ASX MPX2200D MPX2200DP 100/14.5 100/14.5 100/14.5 100/14.5 200/29 200/29 200/29 200/29 200/29 200/29 Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-34 2-34 2-34 2-34 2-38 2-38 2-38 2-38 2-38 2-38 MPX100GVS MPX100GVSX MPX10D MPX10DP MPX10GP MPX10GS MPX10GSX MPX10GVP MPX10GVS MPX10GVSX 100/14.5 100/14.5 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated 2-10 2-10 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 MPX12D MPX12DP MPX12GP MPX12GS MPX12GSX MPX12GVP MPX12GVS MPX12GVSX MPX200A MPX200AP 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 200/29 200/29 Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-2 2-14 2-14 MPX200AS MPX200ASX MPX200D MPX200DP MPX200GP MPX200GS MPX200GSX MPX200GVP MPX200GVS MPX200GVSX 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 2-14 MPX2200GP MPX2200GS MPX2200GSX MPX2200GVP MPX2200GVS MPX2200GVSX MPX2300DT1 MPX2700D MPX2700DP MPX2700GP 200/29 200/29 200/29 200/29 200/29 200/29 40/6 700/100 700/100 700/100 Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-38 2-38 2-38 2-38 2-38 2-38 2-42 2-44 2-44 2-44 MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX MPX2010GVP MPX2010GVS MPX2010GVSX MPX2012D MPX2012DP 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 10/1.45 1011.45 Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 2-26 MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX MPX4100A MPX4100AP MPX4100AS MPX4100ASX MPX4101A 700/100 Temperature Compensated/Calibrated 700/100 Temperature Compensated/Calibrated 700/100 Temperature Compensated/Calibrated 700/100 Temperature Compensated/Calibrated 700/100 Temperature Compensated/Calibrated 105/15.5 Manifold Absolute Pressure Sensor 105/15.5 Manifold Absolute Pressure Sensor 105/15.5 Manifold Absolute Pressure Sensor 105/15.5 Manifold Absolute Pressure Sensor 102/15.3 Manifold Absolute Pressure Sensor 2-44 2-44 2-44 2-44 2-44 2-48 2-48 2-48 2-48 2-48 MPX2012GP MPX2012GS MPX2012GSX MPX2012GVP MPX2012GVS MPX2012GVSX MPX2050D MPX2050DP MPX2050GP MPX2050GS 10/1.45 10/1.45 10/1.45 10/1.45 1011.45 10/1.45 50/7.25 50/7.25 5017.25 5017.25 Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated Temperature Compensated/Calibrated 2-26 2-26 2-26 2-26 2-26 2-26 2-30 2-30 2-30 2-30 MPX4101AP MPX4101AS MPX4101ASX MPX4115A MPX4115AP MPX4115AS MPX4115ASX MPX4250A MPX4250AP MPX4250AS 102/15.3 102/15.3 102/15.3 115/17 115/17 115/17 115/17 250/35 250/35 250/35 2-48 2-48 2-48 2-55 2-55 2-55 2-55 2-59 2-59 2-59 Index and Cross Reference 9-4 Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor Manifold Absolute Pressure Sensor Barometeric Absolute Pressure Sensor Barometeric Absolute Pressure Sensor Barometeric Absolute Pressure Sensor Barometeric Absolute Pressure Sensor Signal Conditioned Signal Conditioned Signal Conditioned Motorola Sensor Device Data Device Index (continued) Device Pressure Range (kPal psi) PRESSURE MPX4250ASX MPX5010D MPX5010DP MPX5010GP MPX5010GS MPX5010GSX MPX5010GVP MPX5010GVS MPX5010GVSX MPX5050D SENSORS (continued) 250/35 Signal Condilioned 10/1.45 Signal Conditioned Signal Conditioned 10/1.45 10/1.45 Signal Conditioned 10/1.45 Signal Conditioned Signal Conditioned 10/1.45 10/1.45 Signal Conditioned 10/1.45 Signal Conditioned 10/1.45 Signal Conditioned 5017.25 Signal-Condilioned 2-59 2-63 2-63 2-63 2-63 2-63 2-63 2-63 2-63 2-66 Product Type Page Number MPX5050DP MPX5050GP MPX5050GS MPX5050GSX MPX5050GVP MPX5050GVS MPX5050GVSX MPX50D MPX50DP MPX50GP 5017.25 5017.25 50/7.25 50/7.25 50/7.25 50/7.25 5017.25 50/7.25 50/7.25 50/7.25 Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Uncompensated Uncompensated Uncompensated 2-66 2-66 2-66 2-66 2-66 2-66 2-66 2-6 2-6 2-6 MPX50GS MPX50GSX MPX50GVP MPX50GVS MPX50GVSX MPX5100A MPX5100AP MPX5100AS MPX5100ASX MPX5100D 50/7.25 5017.25 50/7.25 50/7.25 50/7.25 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned 2-6 2-6 2-6 2-6 2-6 2-71 2-71 2-71 2-71 2-71 MPX5100DP MPX5100GP MPX5100GS MPX5100GSX MPX5100GVP MPX5100GVS MPX5100GVSX MPX5500D MPX5500DP MPX5500GP 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 500/75 500/75 500175 Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal-Conditioned Signal Conditioned Signal Conditioned Signal Conditioned 2-71 2-71 2-71 2-71 2-71 2-71 2-71 2-77 2-77 2-77 MPX5500GS MPX5500GSX MPX5500GVP MPX5500GVS MPX5500GVSX MPX5700D MPX5700DP MPX5700GP MPX5700GS MPX5700GSX 500175 500175 500/75 500/75 500175 700/100 700/100 700/100 700/100 700/100 Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned 2-77 2-77 2-77 2-77 2-77 2-80 2-80 2-80 2-80 2-80 MPX5700GVP MPX5700GVS MPX5700GVSX MPX5999D MPX700A MPX700AP MPX700AS MPX700ASX MPX700D MPX700DP 700/100 700/100 700/100 1000/150 700/100 700 1100 700 1100 700/100 700 1100 700/100 Signal Conditioned Signal Conditioned Signal Conditioned Signal Conditioned Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated 2-80 2-80 2-80 2-83 2-18 2-18 2-18 2-18 2-18 2-18 Motorola Sensor Device Data Pressure Range (kPal psi) Device Product Type Page Number MPX700GP MPX700GS MPX700GSX MPX700GVP MPX700GVS MPX700GVSX MPX7050D MPX7050DP MPX7050GP MPX7050GS 700/100 700/100 700/100 700/100 700/100 700/100 50/7.25 50/7.25 5017.25 50/7.25 Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated Uncompensated High Impedance High Impedance High Impedance High Impedance 2-18 2-18 2-18 2-18 2-18 2-18 2-86 2-86 2-86 2-86 MPX7050GSX MPX7050GVP MPX7050GVS MPX7050GVSX MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP 50/7.25 50/7.25 5017.25 5017.25 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance 2-86 2-86 2-86 2-86 2-90 2-90 2-90 2-90 2-90 2-90 MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS MPX7100GVSX MPX7200A MPX7200AP MPX7200AS MPX7200ASX 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 100/14.5 200/29 200/29 200/29 200/29 High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance 2-90 2-90 2-90 2-90 2-90 2-90 2-94 2-94 2-94 2-94 MPX7200D MPX7200DP MPX7200GP MPX7200GS MPX7200GSX MPX7200GVP MPX7200GVS MPX7200GVSX MPX906D MPX906GVW 200/29 200/29 200/29 200/29 200/29 200/29 200/29 200/29 6/0.9 6/0.9 High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance High Impedance Uncompensated Uncompensated 2-94 2-94 2-94 2-94 2-94 2-94 2-94 2-94 2-22 2-22 TEMPERATURE SENSORS Device !J. (Max) MTS102 MTS105 3.0 7.0 Product Type Temperature Sensor Temperature Sensor Page Number 2-98 2-98 ACCELEROMETERS Device Acceleration Range (G) Product Type XMMAS40Gl0D XMMAS40Gl0S XMMAS250G 1aD XMMAS250G lOS XMMAS500Gl0D XMMAS500Gl0S 40g 40g 250 g 250 g 500 g 500 g Accelerometer Acoelerometer Accelerometer Accelerometer Accelerometer Accelerometer Page Number 2-t02 2-102 2-105 2-105 2-108 2-108 Index and Cross Reference 9-5 Index and Cross Reference 9-6 Motorola Sensor Device Data Section Ten Distributors and Sales Offices Motorola Sensor Device Data Distributors and Sales Offices 10-1 3/1/95 MOTOROLA DISTRIBUTOR AND WORLDWIDE SALES OFFICES AUTHORIZED NORTH AMERICAN DISTRIBUTORS Woodland Hills UNITED STATES Hamilton Hallmark ...........• (818)594-0404 Richardson Electronics (615)594-5600 ALABAMA Huntsville Arrow/Schweber Electronics (205)837-6955 Future Electronics. . . . • . • . . . .. (205)830-2322 HamiHon Hallmark ......•..... (205)837-8700 Newark. . . . . • . . . . . . . • . • . . . •. (205)837-9091 Time Electronics ...•...•.... 1-800-789-TIME Wyle Laboratories ....•.•..... (205)830-1119 ARIZONA Phoenix Future Electronics. . . . . . • . . . .. (602)968-7140 Hamilton Hallmark ..•...•...... (602)437-1200 Wyle Laboratories. . . . . . • . . . .. (602)437-2088 Tempe Arrow/Schweber Electrmics .... (602)431-0030 Newark .....•.........•.. . •. (602)966-6340 Time Electronics ....••.•.••• 1-800-789-TIME CALIFORNIA Agoura Hills Time Electronics Corporate .... 1-800-789-TIME COLORADO Lakewood Future Electronics. . . . . . . . . . •. (303)232-2008 Denver Newark. . • . . . . . . . . . • . . . • . • •. (303)757-3351 Englewood ArrowlSchweber Electronics (303)799-0258 Hamilton Hallmark •.......... (303)790-1662 Time Electronics •••••.....•. 1-800-789-TIME Thornton Wyle Laboratories. . . . . . . . . . .. (303)457-9953 CONNECTICUT Bloomfield Newark ....•.......•••.•.... (203)243-1731 Cheslre Future Electronics. . • • . • • • • . .. (203)250-0083 Hamilton Hallmark ..•••.•.... (203)271-2844 Belmont Southbury Calabassas Walllngfort Richardson Electronics .•...•. (415)592-9225 ArrowlSchweber Electronics .... (818)880-9686 Wyle Laboratories ....•....... (818)880-9000 Chatsworth Future Electronics ............ (818)865-0040 Time Electronics ............ 1-800-789-TIME Costa Mesa Hamilton Hallmark ............ (714)641-4100 Culver City Hamilton I-fallmark . . . . . . . . . . .. (213)558-2000 Garden Grove Newark ..................... (714-893-4909 Irvine ArrowlSchweber Electronics ... Future Electronics .......•.... Wyle Laboratories Corporate. . .. Wyle Laboratories. . . . . . . . . . .. (714)587-0404 (714)250-4141 (714)753-9953 (714)863-9953 Los Angeles Wyle Laboratories . . . . . . . . . . .. (818)880-9000 Mountain View Richardson Electronics .....•. (415)960-6900 Orange Newark ...............•..... (714)634-8224 Palo Alto Newark .•................... (415)812-6300 Rocklin Hamilton Hallmark ........... (916)624-9781 Sacramento Newark ..................... (916)721-1633 Wyle Laboratories. . • . • . . • • • •. (916)638-5282 San Diego ArrowlSchweber Electronics (619)565-4800 Future Electronics. . . . . . . . . . .. (619)625-2800 Hamitton Hallmark ............ (619)571-7540 Newark ..................•... (619)453-8211 Wyle Laboratories .....•...... (619)565-9171 San Jose ArrowlSchweber Electronics ...• (408)441-9700 ArrowlSchweber Electronics ...• (408)428-6400 Future Electronics ............. (408)434-1122 Santa Clara Wyle Laboratories ............ (408)727-2500 Sunnyvale Hamilton Hallmark ............ (408)435-3500 Time Electronics ............ 1-800-789-TIME Torrance Time Electronics .......•.... 1-800-789-TIME Tustin Time Electronics ....•....... 1-800-789-TIME West Hills Newark. . . . . . . . . . . . . . . . . . . .. (818)888-3718 Time Electronics ...••.•.•... 1-800-789-TIME Arrow!Schweber Electronics ...• (203)265-7741 FLORIDA Altamonte Springs Future Electronics. • . • • . • . • • .• (407)767-8414 Clearwater Future Electronics. . . • . . . . • . .• (813)530-1222 Deerfield Beach Arrow/Schweber Electronics .•.• (305)429-8200 Wyle Laboratories. . . • . • . . . • .• (305)420-0500 Ft. Lauderdale Future Electronics. . • . • . • . . • .• (305)436-4043 Hamilton Hallmark ••.......•.• (305)484-5482 Time Electronics •.•......... 1-800-789-TIME Lake Mary ArrowlSchweber Electronics ...• (407)333-9300 LargolTampalSt. Petersburg HamiHon Hallmark .....•..•... (813)541-7440 Newark ....•.•.....•.•.•.... (813)287-1578 Wyle Laboratories. . . • . • . • . . .• (813)576-3004 Orlando Newark ...... . . . . . . . . • . . . . .• (407)896-8350 Time Electronics ....•.•....• 1-800-789-TIME Plantation Newark. . . . . . . • . • . . . . . . . . • .. (305)424-4400 Winter Park Hamilton Hallmark ........... (407)657-3300 Richardson Electronics (407)644-1453 GEORGIA Atlanta Time Electronics ....•.•..•.• 1-800-789-TIME Wyle Laboratories ...•.....••. (404)441-9045 Duluth Arrow/Schweber Electronics ..•. (404)497-1300 Hamilton Hallmark •••.••••••• (404)623-5475 Norcross Future Electronics •.••••.••.•. (404)441-7676 Newark .••••...•..••.•••.••• (404)448-1300 Wyle Laboratories ..•••.•.•.•. (404)441-9045 ILLINOIS Addison Wyle Laboratories . . . . . . . . . . .. (708)620-0969 Bensenville Hamilton Hallmark ....••....•. (708)860-7780 Chicago Newark Electronics Corp. •.••• (312)764-5100 Hoffman Estates Future Electronics. • • • • • • • • • •• (708)882-1255 Itasca Arrow/Schweber Electronics ... (708)250-0500 LaFox Richardson Electronics ..•.•.. (708)208-2401 Schaumburg Newark. . • . • . . . . . . . • . . . . . • .. (708)31 Q-8980 Time Electronics ..........•. 1-800-789-TIME INDIANA Indianapolis Arrow/Schweber Electronics .... (317)299-2071 Hamilton Hallmark ..•.•.•.•.. (317)872-8875 Newark. • . . • . . . . . . . • . • . • . • .. (317)259-0085 Time Electronics .••.•••••••• 1-800-789-TIME Ft. Wayne Newark ....•.....•.......•.. (219)464-0766 IOWA Cedar Rapids Newark .... . . . . . . . . . . . • . . ... (319)393-3800 Time Electronics ............ 1-8OQ-789-TIME KANSAS Lenexa ArrowlSchweber Electronics •••• (913)541-9542 Hamilton Hallmark ••••••••••• (913)888-4747 Overland Park Future Electronics ••••••••.••. (913)649-1531 Newark .•.......•.••.••.•... (913)677-0727 Time ElectroniCS ••••..••••.. 1-800-789-TIME MARYLAND Columbia Arrow/Schweber Electronics .•.. (301 )596-7800 Future Electronics • . • • • • • • • • •• (410)290-0600 Hamilton Hallmark ......•.•.. (410)988-9800 Time Electronics •••••...•..• 1-800-789-TIME Wyle Laboratories •••••••••••• (410)312-4844 Hanover Newark .....•.•...•••••••••• (410)712-8922 MASSACHUSETTS Boston Arrow/Schweber Electronics .... (617)271-9953 Bolton Future Corporate. • . • . • • • . • . .. (508)779-3000 Burlington Wyle Laboratories •••••••••..• (617)271-9953 Norweli Richardson Electronics ..•••.. (617)871-5162 Peabody Time Electronics .•••.......• 1-800-789-TIME Hamiltion Hallmark •••••....•. (508)532-3701 Woburn Newark. . . . . • . • . . . . . . . . . . . •. (617)935-8350 MICHIGAN Detroit Newark .•.•....••.•••.•.•... (313)967-0600 Grand Rapids Future Electronics .•.••.....•. (616)698-6800 Livonia Arrow/Schweber Electronics •••. (313)462-2290 Future Electronics ......•.•... (313)261-5270 HamiitonHalimark .••........ (313)347-4020 Time Electronics .•.•.•....•. 1-800-789-TIME MINNESOTA Bloomington Wyle Laboratories ••..•........ (612)853-2280 Eden Prairie Arrow!Schweber Electronics •••• (612)941-5280 Future Electronics. • . . . . . • . . •. (612)944-2200 HamlitonHalimark ••...•....• (612)881-2600 Time Electronics •...•.••.... 1-800-789-TIME Minneapolis Newark ......•.•.••.. . . . . . .. (612)331-8350 Earth City Hamilton Hallmark ........... (314)291-5350 3/1/95 AUTHORIZED DISTRIBUTORS - continued UNITED STATES - continued Mayfield Heights MISSOURI st. Louis Solon Arrow/schweber Electronics .... (314)567-6888 FuMe Eleclronics ............ (314)469-6805 Newark ..................... (314)298-2505 Time Eleclronics ............ 1-800-789-TIME NEW JERSEY Cherry Hill Hamillon Hallmark ............ (609)424-0100 East Brunswick Newark . . . . . . . . . . . . . . . . . . . .. (908)937-6600 Marlton Arrow/Schweber Electronics .... (609)596-8000 FuMe Electronics. . . . . . . . . . .. (609)596-4080 Plnebrook Arrow/Schweber Electronics .... (201 )227-7880 Wyle Laboratories ............ (201 )882-8358 Parsippany Future Electronics. . . . . . . . . . .. (201 )299-0400 Hamilton Hallmark ........... (201 )515-1641 Wayne Time Electronics ............ 1-800-789-TIME NEW MEXICO Albuquerque Alliance Electronics ......... . (505)292-3360 Hamilton Hallmark ........... . (505)828-1058 Newark .................... . (505)828-1878 NEW YORK Commack Newark .................... . (516)499-1216 Hauppauge Arrow/Schweber Electronics ... . (516)231-1000 Future Electronics ........... . (516)234-4000 (516)434-7400 Hamilton Hallmark Konkoma Hamilton Hallmark ........... (516)737-0600 Melville Wyle Laboratories. . . . . . . . . . .. (516)293-8446 Pittsford Newark ..................... (716)381-4244 Rochester Arrow/Schweber Electronics .... (716)427-0300 Future Electronics ............. (716)272-1120 Hamifion Hallmark ............ (716)475-9130 Richardson Electronics ........ (716)264-1100 Time Electronics ............ 1-800-789-TIME Future Electronics. . • . . . . . . . .. (216)449-6996 Arrow/schweber Electronics .... (216)248-3990 Hamilton Hallmark .........•.. (216)498-1100 Worthington Hamilton Hallmark .•.......... (918)254-6110 Newark. . . . . . . . . . . . . . . . . . . .. (918)252-5070 Newark .....••.............. (503)297-1984 Time Electronics ............ 1-800-789-TIME PENNSYLVANIA Ft_ Washington Raleigh Arrow/Schweber Electronics .... (919)876-3132 Future Electronics ........•.... (919)790-7111 Hamilton Hallmark ..•........ (919)872-0712 Newark ..................... (919)781-7677 Time Electronics ............ 1-800-789-TIME OHIO Centerville Arrow/schweber Electronics •.•• (513)435-5563 Cleveland Newark .•....•..••.•.•••.•.. (216)391-9330 Time Electronics •.••••.....• 1-800-789-TIME Columbus Newark .•...•............... (614)326-0352 Time Electronics .••••••..... 1-800-789-TIME Dayton Future Electronics ••••....•••• (513)426-0090 Hamilton Hallmark ........... (513)439-6735 Newark. • • • . . . . . • • • • • • . . . . .. (513)294-8980 Time Electronics .........••• 1-800-789-TIME Spokane Arrow/Almac Electronics Corp. .. (509)924-9500 WISCONSIN Brookfield Arrow!Schweber Electronics .... (414)792-0150 Future Electronics .....•...•.. (414)879-0244 Milwaukee Time Electronics ............ 1-800-789-TIME Newark ..................... (215)654-1434 New Berlin Hamilton Hallmark ........... (414)780-7200 Mt. Laurel Wauwatosa Montgomeryville Waukesha Wyle Laboratories ............. (609)439-9110 Richardson Electronics ....... (215)628-0805 Newark. . . . . . . . . . . . • . . . . . . .. (414)453-9100 Wyle Laboratories ............ (414)879-0434 Philadelphia Time Electronics ............ 1-800-789-TIME Wyle Laboratories .....•....... (609)439-9110 Pittsburgh ArrowiSchweber Electronics .... (412)963-6807 Newark ..............•...... (412)788-4790 Time Electronics ........•... 1-800-789-TIME TENNESSEE Franklin Richardson Electronics •...... (615)791-4900 Knoxville Newark. . . . . . . . . . . . . . . . • . . .. (615)588-6493 TEXAS Austin Arrow!Schweber Electronics .... (214)380-6464 Future Electronics ............ (214)437-2437 Hamilton Hallmark ........... (214)553-4300 Richardson Electronics ....... (214)239-3680 Time Electronics .••••.•....• 1-800-789-TIME Wyle Laboratories. . . . . . . . • . .. (214)235-9953 Ft. Worth Allied Electronics. . • • . . . . . . • •. (817)336-5401 Houston ArrowiSchweber Electronics •... (713)530-4700 Future Electronics .•.......•••• (713)785-1155 Hamilton Hallmark .....•••... (713)781-6100 Newark. . . . . . . . . . . . . . . . . . . .. (713)270-4800 Time Electronics •.••.•••••.• 1-800-789-TIME Wyle Laboratories. . . . . . . . . • .. (713)879-9953 Richardson Newark. • • • • • • . . . • • . • • • • • • •• (214)235-1998 UTAH Salt Lake City ArrowiSchweber Electronics .••• Future Electronics. • • • • • • • • . •• Hamifion Hallmark ........•••• Newark ....•••.•.•.......••• Wyle Laboratories .•••••••.••• CANADA ALBERTA All Provinces - Newark ...•... (800)463-9275 Calgary Electro Sonic Inc. ........... (403)255-9550 Future Electronics. . . . . . . . • . .. (403)250-5550 Hamitton/Hallmark •........... (800)663--5500 Edmonton Future Electronics. . . . . . . . . . .• (403)438-2858 Hamilton/Hallmark .......•... (800)663-5500 Saskatchewan Hamilton/Hallmark .•.....•... (800)663-5500 Arrow/Schweber Electronics .•.. (512)835-4180 Future Electronics. . • • . . . • . . .• (512)502-0991 Hamilton Hallmark ..........• (512)258-8818 Newark. . . . . . . . . . . . . . . . . . . .. (512)338-0287 Time Electronics ............ 1-800-789-TIME Wyle Laboratories. • . . . . . . . . •. (512)345-8853 Dallas Future Electronics. . . . . . . • . . .. (704)455-9030 Richardson Electronics •....•• (704)548-9042 Wyle Laboratories....•...•...•. (206)881-1150 (503)629-8090 (503)645-9454 (503)528-6200 (503)643-7900 Portland Syracuse . NORTH CAROLINA Charlotte Hamifion Hallmark .....•..••.. (206)881-6697 Time Electronics .•..•...•... 1-800-789-TIME Wyle Laboratories ............. (206)881-1150 Seattle OREGON Beaverton Carollton Future Electronics ...•........ (315)451-2371 Time Electronics ............ 1-800-789-TIME Future Electronics . . . . . . . . . . .• (206)489-3400 Redmond OKLAHOMA Tulsa Rockville Centre Richardson Electronics ....... (516)872-4400 Almac Electronics Corp. (206)643-9992 Newark .................... . (206)641-9800 Richardson Electronics ...... . (206)646-7224 Bothell Hamilton Hallmark ..........• (614)888-3313 Arrow/Almac Electronics Corp. .. Future Electronics. • • . . . . . • . .. Hamilton Hallmark ........... Wyle Laboratories. . . . . . . . . . .. WASHINGTON Bellevue (801 )973-6913 (801 )467-4448 (801 )266-2022 (801)261-5660 (801)974-9953 West Valley City Time Electronics •...•.•.••.. 1-800-789-TIME Wyle Laboratories •.••.•...••• (801)974-9953 BRITISH COLUMBIA Vancouver Arrow Electronics Electro Sonic Inc. Future Electronics Hamitton/Hallmark ...••....... (604)421-2333 . .•.....•.... (604)273-2911 •..•..•...•.. (604)294-1166 ....•.•...•. (604)420-4101 MANITOBA Winnipeg Electro Sonic Inc. •.••....•.. (204)783-3105 Future Electronics ............ (204)944-1446 Hamifion/Hallmark .•.•......•. (800)663-5500 ONTARIO Ottawa Arrow Electronics ...•.••••... Electro Sonic Inc..•••.....•.• Future Electronics ..••.••••... Hamitton/HaJlmark ••••.....••• (613)226-6903 (613)728-8333 (613)820-8313 (613)226-1700 Toronto Arrow Electronics ••••..•••••. Electro Sonic Inc •••.•.••••... Future Electronics ...••....... Hamifion Hallmark ••••••••.••• Newark ...•..•.•..••........ (905)670-7769 (416)494-1666 (905)612-9200 (905)564-6060 (519)685-4280 (905)67(}-2888 (800)463-9275 Richardson Electronics ....... (905)795-6300 FAI •••.•.•.•.•••.•••••••••.. (905)612-9888 QUEBEC Montreal Arrow Electronics ...•••••.•... (514)421-7411 Future Electronics ...•••••.... (514)694-7710 Hamifion Hallmark ••••..•••••• (514)335-1000 Richardson Electronics •...... (514)748-1770 Quebec City Future Electronics. • • • • • • • • • •• (418)877-8666 3/1195 SALES OFFICES Worthington ••••...•...... (614)431-8492 UNITED STATES ALABAMA, Huntsville ...... (205)464-6800 OHIO, Dayton .............. (513)495-6800 ALASKA, .............•... (800)635-8291 OKLAHOMA, Tulsa ........ (800)544-9496 ARIZONA, Tempe .......... (602)302-8056 OREGON, Portland •....•... (503)641-3681 CALIFORNIA, Agoura Hills ... (818)706-1929 PENNSYLVANIA, Colmar .... (215)997-1020 CALIFORNIA, Los Angeles .. (310)417-8848 Philadelphia/Horsham ..... (215)957-4100 CALIFORNIA, Irvine ••••••.• (714)753-7360 TENNESSEE, Knoxville ....• (615)690-5593 CALIFORNIA, San Diego •... (619)541-2163 TEXAS, Austin •............ (512)502-2100 CALIFORNIA, Sunnyvale .... (408)749-0510 TEXAS, Houston ..•..•....• (800)343-2692 COLORADO, TEXAS, Plano ............. (214)516-5100 Colorado Springs .......•.. (719)599-7497 TEXAS, Seguin ......•...•. (210)372-7620 COLORADO, Denver .....•. (303)337-3434 VIRGINIA, Richmond ....... (804)285-2100 CONNECTICUT, UTAH, CSI @ .............. (801)561-5099 Wallingford ............... (203)949-4100 WASHINGTON, Bellevue .... (206)454-4160 FLORIDA, Maitland •.•....•. (407)628-2636 Seattle Access .•.•....... (206)622-9960 FLORIDA, Pompano Beach! WISCONSIN, Milwaukee! Ft. Lauderdale ...•.•••...• (305)351-6040 Brookfield ...••.•.••.•.... (414)792-0122 FLORIDA, Clearwater ..•... (813)538-7750 Field Applications Engineering Available GEORGIA, Atlanta .••••••.• (404)729-7100 Through All Sales Offices IDAHO, Boise •...•.••••••.• (208)323-9413 CANADA ILLINOIS, Chicago! BRITISH COLUMBIA, Hoffman Estates ......•... (708)413-2500 Vancouver ..••.•......•... (604)293-7650 Shaumburg ..........•... (708)413-2500 ONTARIO, Toronto •........ (416)497-8181 INDIANA, Fort Wayne ..•.•. (219)436-5818 ONTARIO, Ottawa .......... (613)226-3491 INDIANA, Indianapolis ....•. (317)571-0400 QUEBEC, Montreal ......... (514)333-3300 INDIANA, Kokomo ......... (317)455-5100 IOWA, Cedar Rapids .....•. (319)378-0383 INTERNATIONAL AUSTRALIA, Melbourne ... (61-3)887-0711 KANSAS, Kansas City! Mission .................. (913)451-8555 AUSTRALIA, Sydney ....... 61 (2)906-3855 MARYLAND, Columbia ...•. (410)381-1570 BRAZIL, Sao Paulo ....... 55(11)815-4200 CHINA, Beijing. . . . • . . . . . . . .. 86-505-2180 MASSACHUSETTS, Marlborough ...•...•.•..•. (508)481-8100 FINLAND, Helsinki ......• 358-0-351 61191 car phone •.••.........•. 358(49)211501 MASSACHUSETTS, Woburn .................. (617)932-9700 FRANCE, Paris ...........• 33134635900 MICHIGAN, Detroit ....•..•. (313)347-6800 GERMANY, Langenhagenl Hannover •.••........•.. 49(511)786880 MINNESOTA, Minnetonka ..•. (612)932-1500 MISSOURI, St. Louis .....•. (314)275-7380 GERMANY, Munich •....•... 498992103-0 NEW JERSEY, Fairfield •..•. (201)808-2400 GERMANY, Nuremberg .... 4991196-3190 NEW YORK, Fairport .....•. (716)425-4000 GERMANY, Sindelfingen ..•. 49703179710 NEW YORK, Hauppauge .... (516)361-7000 GERMANY, Wiesbaden •••.. 49611 973050 NEW YORK, Fishkill ......•. (914)896-0511 HONG KONG, Kwai Fong .... 852-6106888 Tal Po .................... 852-6668333 NORTH CAROLINA, Raleigh .................. (919)870-4355 INDIA, Bangalore .•.•.•... (91-812)627094 OHIO, Cleveland .....•.•••• (216)349-3100 ISRAEL, Herzlla .•.••••... 972-9-590222 OHIO, Columbus! ITALY, Milan ................. 39(2)82201 JAPAN, Fukuoka ......... 81-92-725-7583 JAPAN, Gotanda .......... 81-3-5487-8311 JAPAN, Nagoya .......... 81-52-232-3500 JAPAN, Osaka ............. 81-6-305-1802 JAPAN, Sendai ........... 81-22-268-4333 JAPAN, Takamatsu ...••... 81-878-37-9972 JAPAN, Tokyo ••.......... 81-3-3440-3311 KOREA, Pusan ........... 82(51)4635-035 KOREA, Seoul .•.•.....•... 82(2)554-5118 MALAYSIA, Penang ......... 60(4)374514 MEXICO, Mexico City ••..••• 52(5)282-0230 MEXICO, Guadalajara ...... 52(36)21-8977 Marketing ................ 52(36)21-2023 Customer Service ..•...•• 52(36)669-9160 NETHERLANDS, Best ...• (31)499861211 PUERTO RICO, San Juan ••• (809)793-2170 SiNGAPORE ............... (65)4818188 SPAIN, Madrid ....•..••.••• 34(1)457-8204 or ....................... 34(1)457-8254 SWEDEN, Solna ..•..••.... 46(8)734-8800 SWITZERLAND, Geneva .. 41(22)7991111 SWITZERLAND, Zurich •.... 41 (1 )730-4074 TAIWAN, Taipei ...•..•.... 886(2)717-7089 THAILAND, Bangkok .•..... 66(2)254-4910 UNITED KINGDOM, Aylesbury ••........•.... 44(296)395-252 FULL LINE REPRESENTATIVES CALIFORNIA, Loomis Galena TechnOlogy Group ... NEVADA, Reno Galena Tech. Group .•..... NEW MEXICO, Albuquerque S&S Technologles,lnc..... UTAH, Salt Lake City . Utah Compo Sales,lnc.•.... WASHINGTON, Spokane Doug Kenley ....•.•••.... (916)652-0268 (702)746-0642 (505)298-7177 (801)561-5099 (509)924-2322 HYBRID/MCM COMPONENT SUPPLI· ERS Chip Supply ...•.•...•...•• Elmo Semiconductor ......•. Minco Technology Labs Inc.•. Semi Dice Inc.••.....•••.•. (407)298-7100 (818)766-7400 (512)834-2022 (310)594-4631 3/1/95 SALES OFFICES INTERNATIONAL MOTOROLA DISTRIBUTOR AND SALES OFFICES AUTHORIZED DISTRIBUTORS AUSTRALIA JAPAN VSI Electronics (NZ) Ltd ........ (64)9579-6603 VSI Promark Elec. Ply Ltd ....... (61)2439-4655 VeltekPtyLtd ...........•..... (61)3808-7511 AUSTRIA EBV Austria .............•.. (43) 222 8941774 Elbatex GmbH ............... (43) 222 86 3211 81-422-54-6800 81-3-3639-8951 81-3-3779-9053 81-3-3814-1411 81-3-5561-7254 81-3-3280-7300 KOREA BENELUX Diode Belgium •...........•.. (32) 2 725 4660 Diode Components BV ....... (31) 340 29 1234 EBV Belgium. . • . . . . . . . . . . • . .. (32) 2 720 9936 EBV Holland •.............•. (31) 3465 623 53 Rodelco Electronics ............ (31) 767 84911 Rodelco N.V. " •........•... " (32) 2 460 0560 CHINA Advanced Electronics Ltd. .•.... (852)305-3633 China EI. App. Corp. Xiamen Co ... (86)592 553-487 Nanco Electronics Supply Ltd. . .... (852) 333-5121 Qing Cheng Enterprises Ltd. .... (852) 493-4202 DENMARK Avnet Nortec NS Denmark ...... (45) 428 42000 EBV Denmark ............•.... (45) 398 905 11 FINLAND Arrow Field OY .....••.•..•.•. (35) 807 775 71 Lite-On Korea Ltd ....•....•.... (82)2858-3853 Lee Ma Industrial Co. Ltd........ (82)2739-5257 Jung Kwang Sa ....••••...... (82)51802-2153 NORWAY Avnet Nortec NS Norway ...... (47) 66646210 SCANDINAVIA ITT Multikomponent AB ........•. (46) 8 830 020 Avnet Nortec (S) . . . . . . . . . . . . .. (46) 8 705 1800 Avnet Nortec (OK) ..•....•.... (45) 42 842 000 Avnet Nortec (N) ................ (47) 6 684 210 SINGAPORE Alexan Commercial ............. (63)2405-952 GEIC ...•....•...••....•...•.. (65) 298-7633 P.T. Ometraco ................. (62)22630-805 Uraco Impex Asia Pte Ltd......... (65)5457811 Shapiphat Ltd..•....•....•..... (66)2221-5384 SPAIN FRANCE Arrow Electronique • . . . . . . . .. Avnet Components. . . . . . . . .. EBV France. • • . • . • . . . . . . . .. Scaib .......•.•.•......... AMSC Co., Ltd................ Marubun Corporation . . . . . . . . .. OM RON Corporation .......... Fuji Electronics Co., Ltd ........ Tokyo Electron Ltd............ Nippon Motorola Micro Elec...... (33) (33) (33) (33) 1 49 78 49 78 1 49652500 1 64688600 1 46 87 23 13 GERMANY Avnet E2000 ...•.......•..... (49) 89 4511001 EBV Germany •..•.........•... (49) 89 4561 00 Future Electronics GmbH ....• (49) 89-957 195-0 Jermyn GmbH ................. (49) 6431-5080 Muetron, Mueller GmbH & Co................ (49) 421-305 60 Sasco GmbH. . . . . . . . . . . . . . . . . .. (49) 89-46110 Spoerle Electronic ............ (49) 6103-304-0 HONG KONG Nanshing Clr. & Chern. Co. Ltd .... (852) :J33.Q121 Wong's Kong King Semi. Ltd..... (852) 357-8888 INDIA Canyon Products Ltd . . . . . • . . . .• (852) 755-2583 ITALY AvnetAdelsySpA •........... (39)238103100 EBV Italy •....•••..••.•...•.. (39) 2 66017111 Silverstar SpA .•. • . . . . . . . • . . . .. (39) 2 66 12 51 Amitron Arrow .....•.......... (34) 1 304 30 40 EBV Spain ....•.•............ (34) 9 358 86 08 Selco S.A.........•.....•.... (34) 1 3594348 SWEDEN Avnet Nortec AB .........••... (48) 8 629 1400 SWITZERLAND EBV Switzerland ....•......... (41) 1 7401090 Elbatex AG .................. (41) 56 275165 TAIWAN Mercuries&Assoc. Ltd ....... (886)2503-1111 Solomon Technology Corp. • .... (886)2 760-5858 Strong Electronics Co. Ltd..•.... (886)2917-9917 UNITED KINGDOM Arrow Electronics (UK) Ltd •.... (44) 234272733 Avnet/Access .......•...•.... (44) 462 480888 Future Electronics Ltd. • ....... (44) 753 687000 Macro Marketing Ltd. . . . . • . . .. (44) 628 604 383 CANADA All Provinces - Newark. . • • . . . •. (800)463-9275 ALBERTA Calgary Electro Sonic Inc. ••.•.••. (403)255-9550 Future Electronics. . . . . • . .. Hamilton/Hallmark ........ Edmonton Future Electronics. . . . . . . .. Hamilton/Hallmark Saskatchewan Hamilton/Hallmark ........ (403)250-5550 (800)663-5500 (403)438-2858 (800)663-5500 (800)663-5500 BRITISH COLUMBIA Vancouver Arrow Electronics ......... (604)421-2333 Electro Sonic Inc.....•.... (604)273-2911 Future Electronics .......... (604)294-1166 Hamilton/Avnet Electronics . (604)420-4101 MANITOBA Winnipeg Electro Sonic Inc. ........ (209)783-3105 Future Electronics .•..... " (204)944-1446 Hamilton/Hallmark ........ (800)663-5500 ONTARIO Ottawa Arrow Electronics ......... Electro Sonic Inc.......... Future Electronics ......... Hamilton/Hallmark ........ (613)226-6903 (613)728-8333 (613)820-8313 (613)226-1700 Toronto Arrow Electronics ......... Electro Sonic Inc.......... Future Electronics ..•...... Hamilton/Hallmark ........ Newark .................. (416)670-7769 (416)494-1666 (905)612-9200 (905)564-6060 (519)685-4280 (905)670-2888 Richardson Electronics .... (905)795-6300 FAI •.......•............. (905)612-9888 QUEBEC Montreal Arrow Electronics ..•....... (514)421-7411 Future Electronics .•....... (514)694-7710 Hamilton/Hallmark ........ (514)335-1000 Richardson ....•.....•.... (514)748-1770 Quebec City Arrow Electronics ..•...... (418)687-4231 Future Electronics. . . . . . . .. (418)682-8092 SI. Laurent Richardson Electronics .•.. (514)748-1770 SALES OFFICES CANADA BRITISH COLUMBIA, Vancouver .••. (604)293-7650 ONTARIO, Toronto •••••••..•••.. (416)497-8181 ONTARIO, Ottawa •••.•..•....•.. (613)226-3491 QUEBEC, Montreal ..••.•.•••..•• (514)333-3300 INTERNATIONAL AUSTRALIA, Melbourne .•••...•• (61-3)887-0711 AUSTRALIA, Sydney. . • • • . . . • • .. 61 (2)906-3855 BRAZIL, Sao Paulo ..••.•.•••••. 55(11)815-4200 CHINA, Beijing ••••••....•......... 86-505-2180 CHINA, Guangzhou .••.•..•••• (86) 20 331-1626 CHINA, Shanghai •.•.••••..••• (86) 21 279-8206 CHINA, Singapore •..••.•..••••.•. (65) 481-8188 CHINA, Tianjin .•...•......... .. (86) 22 506-972 FINLAND, Helsinki ...••..••••.. 358-0-35161191 car phone ••..•••..•••••..•. '" 358(49)211501 FRANCE, Paris ....••.•..•••...•• 33134635900 GERMANY, Langenhagen/ Hannover •..••.•...•••••.••.•• 49(511)786880 GERMANY, Munich •...•••.••••••• 49 89 92103-0 GERMANY, Nuremberg •••.•.••.• 4991196-3190 GERMANY, Sindelfingen ••••.•..• 49703179710 GERMANY, Wiesbaden ..•.•...•• 49611 973050 HONG KONG, Kwai Fang ..••...••. 852-8106888 Tal Po ....•••..•••..•.•••.•••••• 852-6668333 INDIA, Bangalore .••••...••...• (91-812)627094 ISRAEL, Herzlia .••••••.•.•••••• 972-9-590222 ITALY, Milan ..•.•....••............ 39(2)82201 JAPAN, Fukuoka • . • • • • • . • . • . •• 81-92-725-7583 JAPAN, Gotanda .•....••..•••.• 81-3-5487-8311 JAPAN, Nagoya ......•.•.•••.. 81-52-232-3500 JAPAN, Osaka •..••.•.•••••.•••• 81-6-305-1802 JAPAN, Sendai ..••...•••••.•.. 81-22-268-4333 JAPAN, Takamatsu ••••......... 81-878-37-9972 JAPAN, Tokyo ........••..•••.. 81-3-3440-3311 KOREA, Pusan .•.•••...•.•...• 82(51)4635-035 KOREA, Seoul •••...•••..•••...•• 82(2)554-5118 MALAYSIA, Penang ...•....•...... 60(4)374514 MEXICO, Mexico City. • • . . . . • . . .. 52(5)282-0230 MEXICO, Guadalajara .•.....•... 52(36)21-8977 Marketing. . • . . . . • . . . . • • • • . • • •. 52(36)21-2023 Customer Service ••..•••.•.•• 52(36)669-9160 NETHERLANDS,Best ••........ (31)499861211 PHILIPPINES, Manila ...•••...••. (63)2822-0625 PUERTO RICO, San Juan ..••.... (809)793-2170 SINGAPORE •••.•.•••...•••...•.. (65)4818188 SPAIN, Madrid ...............•.. 34(1)457-8204 or .•••.••••..•.•...••....•.... 34(1)457-8254 SWEDEN, Solna •...••....••...• 46(8)734-8800 SWITZERLAND, Geneva ••.••.•• 41 (22)799 11 11 SWITZERLAND,Zurich ......•... 41(1)730-4074 TAIWAN, Taipei ...••...•••..... 886(2)717-7089 THAILAND, Bangkok •••......... 66(2)254-4910 UNITED KINGDOM, Aylesbury ..••• 44"(296)395-252 • Introduction • Data Sheets • Quality and Reliability • Application Notes • Package Outline Dimensions • Appendices • Glossary and Symbols • Device Sample Kits • Index and Cross Reference II Distributors and Sales Offices 2PHX31293S·3 Printed in USA 4195 BANTA CO. MOTO#70 60.000 SENSOR YBAGAA
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.3 Linearized : No XMP Toolkit : Adobe XMP Core 4.2.1-c041 52.342996, 2008/05/07-21:37:19 Create Date : 2017:06:27 18:47:07-08:00 Modify Date : 2017:06:27 19:01:02-07:00 Metadata Date : 2017:06:27 19:01:02-07:00 Producer : Adobe Acrobat 9.0 Paper Capture Plug-in Format : application/pdf Document ID : uuid:895a22d2-058a-124c-9c78-9c143b30387d Instance ID : uuid:5e9193b8-0274-c24e-95db-4219df24caa7 Page Layout : SinglePage Page Mode : UseNone Page Count : 378EXIF Metadata provided by EXIF.tools