1996_Motorola_Master_Selection_Guide 1996 Motorola Master Selection Guide
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®
SG73/D
MOTOROL.A
MOTOROLA SEMICONDUCTOR
MASTER SELECTION GUIDE
REV 10
Introduction
Semicustom Application Specific Ifl
Integrated Circuits (ASIC) L!J
Microcomputer Components
[2J
Logic: Standard, Special
and Programmable
I3l
Analog and Interface
Integrated Circuits
141
~
~
Communications, Power and Ii:l
Signal Technologies Group Products ~
Product Literature and 'E)l
Technical Training ~
Device Index and 'fl
Subject Index LLJ
MOTOROLA
Master Selection Guide
The information in this book has been carefully checked and is believed to be accurate; however, no responsibility is assumed
for inaccuracies. Furthermore, this information does not convey to the purchaser of semiconductor devices any license under the
patent rights to the manufacturer.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty.
representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters,
including ''Typicals'' must be validated for each customer application by customer's technical experts. Motorola does not convey
any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use
as components in systems intended for surgical implant Into the body, or other applications intended to support or sustain life, or
for any other application in which the failure of the Motorola product could create a situation where personal injury or death may
occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall
indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design
or manufacture of the part. Motorola and ® are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
-NOTEREV. 9 WAS PUBLISHED ELECTRONICALLY ONLY
NO BOOKS WERE PRINTED
© Motorola, Inc. 1996
Previous EdHion © 1995
"All Ri9hts Reserved"
Printed in U.S.A.
Motorola Master Selection Guide
Introduction
ALExiS, Buffalo, Bullet-Proof, BurstRAM, CDA, CMTL, Ceff-PGA, Customer Defined Array, DECAL, Designer's, DIMMIC,
DSPRAM, ECLinPS, ECLinPS LITE, ECL300, E-FETs, EpiBase, Epicap, FIRsT, GEL-PAK, GEMFET, GlobalOptoisolator,
GreenLine, HDC, HDTMOS, H4C Series, H4C Plus, HYPERformance, ICePAK, L2TMOS, MAACPAC, MCML, MDTL, MECL,
MECL 10K, MECL 10H, MECL III, MEGAHERTZ, MCCS, Media Engine, Memorist, MHTL, MicroCool, MicroSIMM, MiniMOS,
MONOMAX, MOSAIC I, MOSAIC II, MOSAIC III, MOSAIC IV, MOSAIC V, MOSFET, Mosorb, MRTL, MTTL, Multi-Pak, MUSCLE,
Mustang, IlSIMM, OACS, OnCE, PHACT, Predix, PowerBase, POWER OPTO, POWERTAP, PRISMCard, QUIL, Rail-To-Rail,
SCANSWITCH, SENSEFET, SLEEPMODE, SMARTDISCRETES, SMARTMOS, SMARTswitch, SORF,
Surmetic,
SWITCH MODE, Symmetric Superscalar, TestPAS, Thermopad, Thermopad II, Thermowatt, TMOS V, Unibloc, UNIT/PAK,
VECOMP, X-Ducer, Z-Switch and ZIP R TRIM are trademarks of Motorola, Inc.
C-QUAM, MOSAIC and TMOS are registered trademarks of Motorola, Inc.
Apollo is a registered trademark of Hewlett Packard Inc.
AutoLogic, NetEd, QuickSim II, QuickPath and Falcon Framework are trademarks of Mentor Graphics Corp.
Concept, Gate Ensemble, Verilog-XL, Veritime and Dracula are trademarks of Cadence Design Systems, Inc.
Daisy is a trademark of Daisy Systems Corporation.
DDCMP and VAX are trademarks of Digital Equipment Corporation.
Design Compiler, HDL Compiler, Test Compiler and DesignWave are trademarks of Synopsys, Inc.
Echelon, LON and NEURON are registered trademarks of Echelon Corporation.
ETHERNET is a trademark of Xerox Corporation.
FACT and FAST are trademarks of National Semiconductor Corporation.
FIDE is a trademark of Aptronix.
GED is a trademark of Valid Logic Systems Inc.
HP/Apolio is a registered trademark of Hewlett-Packard Inc.
i486 and Pentium are registered trademarks of Intel Corporation.
InterTools is a trademark of Intermetrics, Inc.
IBM, IBM PC, PowerPC and SDLC are trademarks of International Business Machines Corporation.
Isotop is a trademark of SGS-Thomson Microelectronics.
LONBuILDER, LONTALK and LONWORKS are trademarks of Echelon Corporation.
Macintosh is a trademark of Apple Computer, Inc.
Mentor Graphics is a trademark of Mentor Graphics Corporation.
Micro8 is a trademark of International Rectifier.
MOTIVE is a registered trademark of Quad Design.
NeXT is a trademark of NeXT Computer, Inc.
ROM68K and SmartROM are trademarks of Integrated Systems, Inc.
SPARC is a trademark of SPARC International, Inc.
Sun-4 is a trademarks of Sun Microsystems Inc.
Thermal Clad is a trademark of the Bergquist Company.
UNIX is a registered trademark of XlOpen Company, Ltd.
All brand names and product names appearing in this document are registered trademarks or trademarks of their
respective holders.
Introduction
Mctcrda Master Se!e~jl)n
GlJi('l~
Master Selection Guide
Where We Stand ...
How To Use This Guide . ..
Total Customer Success
This Selection guide is arranged to provide three-way
assistance to engineers and technicians in making a
first-order selection of components best suited for a specific
circuit or system design.
Service, speed and facility of response, product quality and
reliability are the goals to which we are dedicated. Our
commitment to progress such as Six Sigma performance and
Cycle lime Reduction are symbolic of a culture in which Total
Customer Success is, overwhelmingly, our primary objective.
In today's highly competitive market, selecting the most
effective semiconductor components for a given application
poses a significant challenge. The range of available functions
and the sheer number of components within each unique
product line is staggering. Add to this the number of vendors
capable of satisfying a portion of the overall system demands
and the selection of a cost-effective component complement
can be as time consuming as the design of the system itself.
This is where Motorola occupies a unique position among
semiconductor manufacturers - one that can significantly shorten
the product selection cycle. Please consider these facts:
As a manufacturer of semiconductors since the very
beginning of the technology, Motorola has emerged as a
leading supplier of such components to the world market.
Motorola's product line is the broadest in the industry,
capable of filling 75--80% of the many applications for
semiconductor devices.
In each of its various product categories, Motorola is a
recognized leader, with leading edge products as well as
commodity products for mass applications.
Motorola's vast network of sales offices and distributors,
augmented by manufacturing centers throughout the world,
not only ensures easy communications, cost-effective
pricing and rapid service, but guarantees a continuing
stream of state-of-the-art products based on world-wide
experience and demand.
Motorola Master Selection Guide
If you have a device number that needs identification or
if you want to know if Motorola manufactures a particular
device type:
1. Turn to the Device Index for a complete listing of Motorola
products, and the page numbers where more detailed
information is given for these products.
If you have a device name or acronym and wish to know
if Motorola makes such a device:
2. Look for it in the Subject Index.
If you want an overview of Motorola products for
specific product category:
a
3. Refer to the quick-reference product line guide located at
the front of this publication or use the table of contents
located at the front of each section.
Telephone ASSistance, North America Only
For literature requests or general product information, call
toll-free any weekday, 8:00 a.m. to 4:00 p.m., MST.
To order technical literature by specific document title, i.e.,
SGXXlD or DLXXXlD, or by part number only, call
1--800-441-2447
Non-North American Locations
Please contact your local Motorola Sales Office or
Authorized Distributor.
iii
Introduction
Table of Contents
Semicustom Application Specific
Integrated Circuits .......... 1.0-1
ASIC Preview ...............................
Bipolar .....................................
ECl & ETl Series Arrays ............. " ....
CMOS .....................................
1.0 Micron HDC Series
Sub-Micron H4C & H4CPlus Series. . . . . . . ..
Design Automation Software (OACSTM) .........
Advanced Packaging .........................
Architecture for the 90's CDATM
(Customer Defined Arrays) ...................
CDA- The Architecture of the '90s .........
Bipolar ECl & ETl Series Arrays .................
Third Generation ............................
ETl Series Arrays Extend Design Flexibility. ..
ETl Series Features Mixed ECl-TTl Interface
CMOS ........................................
1.0 Micron CMOS HDCTM Series ..............
Triple-layer Metal ........................
Sub-Micron CMOS H4CTM Series ....... . . . . ..
CDNM Architecture .. . . . . . . . . . . . . . . . . . . . . ..
Sub-Micron CMOS H4CPlus™ Series
Mixed 3.3 V/5.0 V levels .....................
Design Automation Software .....................
The Open Architecture CAD System™ ..........
OACSTM 2.2 and 3.1M Features ................
Advanced Packaging ...........................
Quad Flat Pack Molded Carrier Ring
(QFP-MCR) ................................
MicroCoolTM Quad Flat Pack ...................
Over-Molded Pad Array Carrier (OMPACTM) .....
Literature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
ASIC Regional Design Centers - United States . . ..
ASIC Regional Design Centers - International . . . ..
The M68000 Family ............... 2.2-1
Microprocessors ............................... 2.2-2
Embedded Controllers .......................... 2.2-5
Integrated Processors. . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-7
Coprocessors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-9
DMA Controllers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-9
Network Devices ............................... 2.2-9
Data Communication Devices ...... " ........... 2.2-10
General Purpose I/O .............. " ........... 2.2-11
Fiber Distributed Data Interface ................. 2.2-11
DevelopmentTools ............................ 2.2-12
Support Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-12
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-2
1.1-2
1.1-2
1.1-2
1.1-3
1.1-3
1.1-3
1.1-4
1.1-4
The M88000 RISC Family ......... 2.3-1
Architecture, Performance,
and Software Compatibility . . . . . . . . . . . . . . . . . . . . .. 2.3-2
Microprocessors ............................... 2.3-2
Cache/Memory Management Units ............... 2.3-3
The PowerPC RISC Family
Microprocessors ................. 2.4-1
PowerPCTM RISC Microprocessors . . . . . . . . . . . . . . .. 2.4-2
MPC601 RISC Microprocessor. . . . . . . . . . . . . . . . . .. 2.4-2
MPC602 RISC Microprocessor . . . . . . . . . . . . . . . . . .. 2.4-3
MPC603 RISC Microprocessor. . . . . . . . . . . . . . . . . .. 2.4-3
MPC603e RISC Microprocessor. . . . . . . . . . . . . . . . .. 2.4-6
MPC604 RISC Microprocessor. . . . . . . . . . . . . . . . . .. 2.4-9
MPC604e RISC Microprocessor . . . . . . . . . . . . . . . . .. 2.4-9
MPC620 RISC Microprocessor ................. , 2.4-13
MPC105 PCI Bridge/Memory Controller .......... 2.4-15
MPC106 PCI Bridge/Memory Controller .......... 2.4-16
1.1-5
1.1-6
1.1-6
1.1-6
1.1-7
1.1-7
1.1-7
1.1-7
1.1-8
1.1-8
1.1-8
Single-Chip Microcontrollers (CSIC)
Microcomputer Components .. 2.0-1
Single-Chip Microcontrollers (AMCU) . 2.6-1
M68HC11 Family ............................... 2.6-2
Modular Microcontroller ........................ 2.6-12
The M68HC16 Family ....................... 2.6-14
The M68300 Family ......................... 2.6-19
Development Tools .. ' ......................... 2.6-23
Fuzzy logic .................................. 2.6-26
On-Line Help ................................. 2.6-26
Third-Party Support ........................... 2.6-27
Digital Signal Processors ......... 2.1-1
DSP56100 -l6-Bit Digital Signal Processors .. 2.1-2
DSP56800 -16-Bit Digital Signal Processors .. 2.1-3
DSP56000 - 24-Bit Digital Signal Processors .. 2.1-3
DSP56300 - 24-Bit Digital Signal Processors .. 2.1-6
DSP96002 - 32-Bit Digital Signal Processors ., 2.1-9
DSP56ADC16 - The Analog-To--Digital Converter 2.1-10
DSP Development Tools ........................ 2.1-10
Application Development Systems ............ 2.1-10
Graphical User Interface ..................... 2.1-12
DSP Development Software .................... 2.1-12
Design-In Software Packages . . . . . . . . . . . . . . .. 2.1-12
C-Compiler Packages ....................... 2.1-13
C-Compiler Upgrades . . . . . . . . . . . . . . . . . . . . . .. 2.1-13
'T_L..I _ _ I.
1"" __ .. __ .....
ICUJIICl VI VVlllgll~
2.5-1
M68HC05 CSIC Family ......................... 2.5--2
M68HC08 Family .............................. 2.5--13
Development Tools ........................... 2.5-14
On-Line Help ....... . . . . . . . . . . . . . . . . . . . . . . . . .. 2.5-22
LonWorks Products .............. 2.7-1
NEURON CHIPS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
lONWORKS Technology Overview and Architecture ..
lONBulLDER Developer's Workbench ..............
lONWORKS Support Tools . . . . . . . . . . . . . . . . . . . . . . ..
lONWORKS Literature ........... '" " ............
!v
2.7-2
2.7-5
2.7-6
2.7-7
2.7-9
Motorola Master Selection Guide
Table of Contents
Microcomputer Components (continued)
Power Supply Circuits (continued)
Memory Products ................ 2.8-1
Voltage Regulator/Supervisory. . . . . . . . . . . . . . . .. 4.2-5
SCSI Regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.2-8
Switching Regulator Control Circuits
Single-Ended ............................... 4.2-9
Single-Ended with On-Chip Power Switch ..... 4.2-11
Very High Voltage Single-Ended with
On-Chip Power Switch ..................... 4.2-11
Double-Ended ............................. 4.2-12
High Voltage Switching Regulator ............. 4.2-13
Special Switching Regulator Controllers
Dual Channel .............................. 4.2-15
Universal Microprocessor .................... 4.2-15
Power Factor ............................... 4.2-15
SuperviSOry Circuits
Overvoltage Crowbar Sensing ................ 4.2-18
Over/Undervoltage Protection ................ 4.2-18
Undervoltage Sensing ....................... 4.2-19
Universal Voltage Monitor. . . . . . . . . . . . . . . . . . .. 4.2-20
Battery Management Circuits
Battery Charger ICs ......................... 4.2-21
Battery Pack ICs . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.2-23
MOSFET/IGBT Drivers
High Speed Dual Drivers. . . . . . . . . . . . . . . . . . . .. 4.2-25
Single IGBT Driver. . . . . . . . . . . . . . . . . . . . . . . . .. 4.2-25
Package Overview ............................ 4.2-26
Fast Static RAMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Introduction .................................
Application Specific Static RAMs. . . . . . . . . . . . . ..
Asynchronous 6 to 15 ns 5 V Fast Static RAMs ..
Asynchronous 12 to 35 ns 5 V Fast Static RAMs.
Fast Static RAM Modules .....................
Dynamic RAMs ................................
Introduction .................................
DRAM Modules .............................
Dynamic RAMs (HCMOS) ....................
2.8-2
2.8-2
2.8-2
2.8-3
2.8-3
2.8-4
2.8-5
2.8-5
2.8-5
2.8-6
Logic: Standard, Special
and Programmable .......... 3.0-1
Motorola Logic Families: Which Is Best for You? .... 3.1-1
Motorola Programmable Arrays (MPA) ............ 3.1-5
Selection by Function
Logic Functions ............................ 3.1-13
Device Index .................................. 3.1-40
Ordering Information ........................... 3.1-49
Case Outlines ................................. 3.1-53
Packaging Information ......................... 3.1-86
Surface Mount ............................. 3.1-86
Pin Conversion Tables ....................... 3.1-86
Tape and Reel .............................. 3.1-87
Logic Literature Listing ......................... 3.1-88
Power/Motor Control Circuits ..... 4.3-1
Power Controllers .............................. 4.3-2
Zero Voltage Switches . . . . . . . . . . . . . . . . . . . . . . .. 4.3-2
Zero Voltage Controller ....................... 4.3-3
High-Side Driver Switch ...................... 4.3-4
Motor Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.3-4
Brushless DC Motor Controllers ............... 4.3-4
Closed-Loop Brushless Motor Adapter ......... 4.3-7
DC Servo Motor Controller/Driver .............. 4.3-8
Stepper Motor Driver . . . . . . . . . . . . . . . . . . . . . . . .. 4.3-9
Universal Motor Speed Controllers ............ 4.3-10
Triac Phase Angle -Controller ................ 4.3-11
Package Overview ............................ 4.3-12
Analog and Interface
Integrated Circuits .......... 4.0-1
Amplifiers and Comparators ...... 4.1-1
Operational Amplifiers ...........................
Single ......................................
Dual .......................................
Quad .......................................
High Frequency Amplifiers .......................
AGC .......................................
Miscellaneous Amplifiers ........................
Bipolar .....................................
CMOS .....................................
Comparators ...................................
Single ......................................
Dual .......................................
Quad .......................................
Package Overview .............................
4.1-2
4.1-2
4.1-3
4.1-4
4.1-5
4.1-5
4.1-6
4.1-6
4.1-6
4.1-7
4.1-7
4.1-7
4.1-7
4.1-8
Voltage References. . . . . . . . . . . . . .. 4.4-1
Precision Low Voltage References . . . . . . . . . . . . . . .. 4.4-2
Package Overview ............................. 4.4-2
Data Conversion ................. 4.5-1
Data Conversion ...............................
A-D Converters .............................
CMOS ...................................
Bipolar. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Sigma-Delta .............................
D-A Converters .............................
CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Sigma-Delta .............................
Package Overview .............................
Power Supply Circuits ............ 4.2-1
Linear Voltage Regulators
Fixed Output ................................ 4.2-2
Adjustable Output. . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.2-4
Special Regulators ............................. 4.2-5
Motorola Master Selection Guide
v
4.5-2
4.5-2
4.5-2
4.5-2
4.5--2
4.5--3
4.5--3
4.5--3
4.5-4
Table of Contents
Table of Contents
Analog and Interface
Integrated Circuits (continued)
Communication Circuits (continued)
Voice Switched Speakerphone with
J.lProcessor Interface .....................
Voice Switched Speakerphone Circuit .......
Family of Speakerphone ICs ...............
Telephone Accessory Circuits
Audio Amplifier ...........................
Current Mode Switching Regulator .........
300 Baud FSK Modems ...................
ADPCM Transcoder ......................
Calling Line Identification (CLiD) Receiver ...
CVSD Modulator/Demodulator .............
Summary of Bipolar Telecommunications
Circuits ................................
Phase-Locked Loop Components ...............
PLL Frequency Synthesizers .................
Phase-Locked Loop Functions ...............
Package Overview ............................
Interface Circuits ................. 4.6-1
High Performance Decoder Driver/Sink Driver . . . . .. 4.6-3
ISO 8802-3[IEEE 802.3]1 OBASE-T Transceiver ... 4.6-3
Hex EIA-485 Transceiver with
Three-State Outputs ........................... 4.6-4
5.0 V, 200 M-BitlSec PR-IV Hard Disk
Drive Read Channel ........................... 4.6-5
Line Receivers ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
EIA Standard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
Line Drivers ................................... 4.6-7
EIA Standard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
Line Transceivers . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
EIA-232-E/V.28 CMOS Drivers/Receivers ...... 4.6-8
Peripheral Drivers ........................... 4.6-8
IEEE 802.3 Transceivers. . . . . . . . . . . . . . . . . . . . .. 4.6-8
ReadlWrite Channel ............................ 4.6-8
Drive Read Channel ...... : . . . . . . . . . . . . . . . . . .. 4.6-8
CMOS Display Drivers .......................... 4.6-9
Package Overview ............................ 4.6-10
4.7-30
4.7-30
4.7-31
4.7-31
4.7-32
4.7-33
4.7-34
4.7-36
4.7-36
4.7-37
4.7-39
Consumer Electronic Circuits ..... 4.8-1
Entertainment Radio Receiver Circuits ............ 4.8-2
Entertainment Receiver RFIIF ................. 4.8-2
C-Quam® AM Stereo Decoders ... . . . . . . . . . . .. 4.8-2
Audio Amplifiers ............................. 4.8-2
Video Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.8-3
Encoders ................................... 4.8-3
TV Decoders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.8-3
Video Capture Chip Sets. . . . . . . . . . . . . . . . . . . . .. 4.8-3
TV Picture-in-Picture ........................ 4.8-3
Comb Filters ................................ 4.8-3
Deflection .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.8-3
TV IF Circuits ............................... 4.8-3
Tuner PLL Circuits ........................... 4.8-4
Modulators ................................ ;. 4.8-4
Video Data Converters ....................... 4.8-4
Monitor Subsystem .......................... 4.8-4
Sound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.8-4
Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.8-4
Circuit Descriptions and Diagrams ............. 4.8-5
Package Overview ............................ 4.8-25
Communication Circuits . ......... 4.7-1
RF Communications
Wideband IFs ............................... 4.7-2
Wideband Single Conversion Receivers ........ 4.7-2
Narrowband Single Conversion Receivers ....... 4.7-2
Narrowband Dual Conversion Receivers ........ 4.7-3
Universal Cordless Phone Subsystem IC ....... 4.7-3
Transmitters ................................ 4.7-3
Balanced Modulator/Demodulator .............. 4.7-4
Infrared Transceiver .......................... 4.7-4
Telecommunications
Subscriber Loop Interface Circuit ............. 4.7-11
PBX Architecture (Analog Transmission)
PCM Mono-Circuits ...................... 4.7-12
Dual Tone Multiple Frequency Receiver ..... 4.7-15
ISDN Voice/Data Circuits
Integrated Services Digital Network ......... 4.7-15
Second Generation U-Interface Transceiver .. 4.7-16
Second Generation SIT-Interface Transceiver 4.7-16
Dual Data Link Controller .................. 4.7-17
Voice/Data Communication (Digital Transmission) 4.7-18
Universal Digital Loop Transceiver ........... 4.7-18
ISDN Universal Digital Loop Transceiver II ... 4.7-19
Electronic Telephone Circuit .................. 4.7-19
Tone Ringers ............................... 4.7-20
Speech Networks ........................... 4.7-21
Speakerphone
Voice Switched Speakerphone Circuit ....... 4.7-25
Table of Contents
4.7-27
4.7-28
4.7-29
Automotive Electronic Circuits .... 4.9-1
Voltage Regulators ............................. 4.9-2
Electronic Ignition .............................. 4.9-2
Special Functions .............................. 4.9-3
Package Overview ........................ , ... 4.9-12
Other Analog Circuits ........... 4.10-1
liming Circuits
Singles .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Duals .....................................
Multipliers ....................................
Linear Four-Quadrant Multipliers . . . . . . . . . . . . ..
Smoke Detectors (CMOS) ......................
Package Overview ............................
vi
4.10-2
4.10-2
4.10-2
4.10-2
4.10-3
4.1 Q-4
Motorola Master Selection Guide
Table of Contents
TMOS Power MOSFETs Products .. 5.4-1
Analog and Interface
Integrated Circuits (continued)
TMOS Power MOSFETs ........................ 5.4-1
TMOS Power MOSFETs Numbering System .... 5.4-2
HDTMOSTM Power MOSFETs ................. 5.4-3
TMOS V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.4-5
SMARTDISCRETES Products ................. 5.4-7
N-Channel MOSFETs " . . . . . . . . . . . . . . . . . . . . .. 5.4-8
SO-8 MiniMOS ........................... 5.4-8
S0-8 EZFET . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.4-9
Micro8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.4-9
SOT-223 ................................ 5.4-9
DPAK .................................. 5.4-10
D2PAK ................................. 5.4-11
D3PAK ................................. 5.4-12
TO-220AB .............................. 5.4-13
TO-247 ................................. 5.4-15
TO-264 ...................... , ..... , .... 5.4-16
P-Channel MOSFETs ....................... 5.4-17
SO-8 MiniMOS .......................... 5.4-17
Micro8 .................................. 5.4-17
SOT-223 ............................... 5.4-18
DPAK .................................. 5.4-18
D2PAK ................................. 5.4-19
TO-220AB .............................. 5.4-19
Logic Level MOSFETs ....................... 5.4-20
SOT-223 ............................... 5.4-20
DPAK .................................. 5.4-20
D2PAK ................................. 5.4-21
TO-220AB .............................. 5.4-21
Insulated Gate Bipolar Transistors (IGBTs) ..... 5.4-22
N-Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.4-22
Ignition IGBTs . . . . . . . . . . . . . . . . . . . . . . . .. 5.4-22
Standard and Copackaged IGBTs ........ 5.4-22
Tape and Reel Options .......... 4.11-1
Tape and Reel ................................ 4.11-2
AnalogMPQTable ............................. 4.11-4
Communications, Power and
Signal Technologies Group
Products .................. 5.0-1
Small Signal Transistors, FETs
and Diodes ...................... 5.1-1
Bipolar Transistors .............................. 5.1-2
Plastic-Encapsulated Transistors .............. 5.1-2
Plastic-Encapsulated Multiple Transistors . . . . . .. 5.1-8
Plastic-Encapsulated Surface
Mount Transistors .......................... 5.1-10
Metal-Can Transistors ...................... 5.1-17
Field-EffectTransistors ........................ 5.1-19
JFETs ..................................... 5.1-19
MOSFETs ................................. 5.1-21
Surface Mount FETs ........................ 5.1-22
Tuning and Switching Diodes ................... 5.1-24
Tuning Diodes - Abrupt Junction ............. 5.1-24
Tuning Diodes - Hyper-Abrupt Junction ...... 5.1-28
Hot-Carrier (Schottky) Diodes .. . . . . . . . . . . . . .. 5.1-32
Switching Diodes ........................... 5.1-34
Multiple Switching Diodes .................... 5.1-38
GreenLine Devices ............................ 5.1-40
TVSlZeners
Transient Voltage Suppressors I Zener
Regulator and Reference Diodes .. 5.2-1
Bipolar Power Transistors ........ 5.5-1
TVS (Transient Voltage Suppressors) ............. 5.2-2
General-Purpose . . . . . . . . . . . . . . . . . .. . . . . . . . .. 5.2-2
Axial Leaded for Through-hole Designs ...... 5.2-2
Surface Mount Packages ..................... 5.2-9
Overvoltage Transient Suppressors ........... 5.2-15
Zener Diodes ................................. 5.2-16
Voltage Regulator Diodes . . . . . . . . . . . . . . . . . . .. 5.2-16
Notes - Axial Leaded Chart ................. 5.2-20
Notes - Surface Mount Chart . . . . . . . . . . . . . . .. 5.2-23
Voltage Reference Diodes ................... 5.2-31
Current Regulator Diodes ... . . . . . . . . . . . . . . . .. 5.2-31
Bipolar Power Transistors ....................... 5.5-2
Selection by Package ........................ 5.5-2
Plastic TO-220AB . . . . . . . . . . . . . . . . . . . . . . . .. 5.5-3
Plastic T0-218 Type ...................... 5.5-6
Plastic TO-247 Type ...................... 5.5-7
Large Plastic T0-264 . . . . . . . . . . . . . . . . . . . . .. 5.5-8
Plastic T0-225AA Type
(Formerly T0-126 Type) .................. 5.5-8
DPAK - Surface Mount Power Packages .... 5.5-10
Metal T0-204AA (Formerly T0-3).
T0-204AE ............................. 5.5-11
Audio ..................................... 5.5-15
Electronic Lamp Ballasts . . . . . . . . . . . . . . . . . . . .. 5.5-16
Hybrid Power Module Operation .. 5.3-1
Integrated Power Stage IGBT .................... 5.3-2
Motorola Master Selection Guide
vii
Table of Contents
Table of Contents
Communications, Power and
Signal Technologies Group
Products (continued)
Sensors (continued)
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.9-3
Typical Electrical Characteristic Curves ......... 5.9-4
Unibody Cross-sectional Drawings. . . . . . . . . . . .. 5.9-4
Pressure Side Identification ................... 5.9-5
Selector Guide .............................. 5.9-6
Reference Table ............................ 5.9-11
Packaging Options .......................... 5.9-12
Rectifiers ........................ 5.6-1
Rectifier Numbering System ..................... 5.6-2
Application Specific Rectifiers .................... 5.6-3
Low VF Schottky ............................ 5.6-3
MEGAHERTZ ... . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.6-3
SCANSWITCH .............................. 5.6-3
Automotive Transient Suppressors ............. 5.6-3
SWITCHMODETM Rectifiers . . . . . . . . . . . . . . . . . . . . .. 5.6-4
Surface Mount Schottky ...................... 5.6-4
Axial Lead Schottky .. . . . . . . . . . . . . . . . . . . . . . . .. 5.6-6
TG-220 Type Schottky ....................... 5.6-7
TG-218 Types and TG-247 Schottky ........... 5.6-8
POWERTAP II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.6-9
Ultrafast Rectifiers ............................. 5.6-10
Surface Mount Ultrafast ...................... 5.6-10
Axial Lead Ultrafast ......................... 5.6-10
TG-220 Type Ultrafast ...................... 5.6-11
TG-218 Types and TG-247 Ultrafast .......... 5.6-12
POWERTAP II .............................. 5.6-12
Fast Recovery Rectifiers/General
Purpose Rectifiers ....................... 5.6-13
GaAs Rectifiers Power Manager™ ............... 5.6-14
RF Products .................... 5.10-1
RF Discrete Transistors ........................ 5.10-2
RF Power MOSFETs .......... . . . . . . . . . . . . .. 5.10-4
RF Power Bipolar Transistors. . . . . . . . . . . . . . . .. 5.10-6
HF Transistors . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.10-6
VHF Transistors ......................... 5.10-6
UHF Transistors ......................... 5.10-7
900 MHz Transistors ..................... 5.1o-a
1.5 GHz Transistors ..................... 5.10-10
Microwave Transistors ................... 5.10-10
Linear Transistors ....................... 5.10-12
RF Small Signal Transistors ................. 5.10-14
Selection by Package .................... 5.10-15
Plastic SOE Case .................... 5.10-15
Ceramic SOE Case ................... 5.10-17
Selection by Application .................. 5.10-18
Low Noise ........................... 5.10-18
CATV, MATV and Class A Linear ....... 5.10-19
RF Monolithic Integrated Circuits ............... 5.10-20
Switching ................................. 5.10-21
Antenna Switches .. . . . . . . . . . . . . . . . . . . . .. 5.10-21
Receiver Functions ........................ 5.10-21
General Purpose Integrated Circuits ....... 5.10-21
900 MHz Front End. . . . . . . . . . . . . . . . . . . . .. 5.10-21
1.5-2.2 GHz Front End .................. 5.10-21
2.4 GHz Front End ...................... 5.10-22
Transmitter Functions ...................... 5.10-22
General Purpose Integrated Circuits ....... 5.10-22
900 MHz Transmit Chain .... . . . . . . . . . . . .. 5.10-23
1.5-2.2 GHz Transmit Chain ............. 5.10-24
2.4 GHz Transmit Chain .................. 5.10-25
RF Amplifiers ................................ 5.10-26
High Power ............................... 5.10-28
Land Mobile/Portable .................... 5.10-28
TV Transmitters ......................... 5.10-29
Low Power ................................ 5.10-30
CATV Distribution ....................... 5.10-30
CRT Drivers ............................ 5.10-35
Fiber Optic Receivers. . . . . . . . . . . . . . . . . . .. 5.10-35
Thyristors and Triggers ........... 5.7-1
Silicon Controlled Rectifiers ...................... 5.7-2
TRIACs ....................................... 5.7-7
General Purpose ............................ 5.7-7
Thyristor Triggers .............................. 5.7-14
SIDACs ................................... 5.7-14
Programmable Unijunction Transistors - PUT .. 5.7-14
Silicon Bidirectional Switch (SBS) ............. 5.7-14
High Voltage Bidirectional TVS Devices ........ 5.7-14
Optoelectronic Devices ........... 5.8-1
Optoisolators .................................. 5.8-2
Safety Standard Approvals for 6-Pin
Optoisolators ............................... 5.8-2
Regulatory Approval Certification Index ......... 5.8-2
VDE Approved Optoisolators .................. 5.8-3
6-Pin Dual In-line Package. . . . . . . . . . . . . . . . . . . . .. 5.8-6
Small Outline - Surface Mount .................. 5.8-9
POWER OPTO Isolators ....................... 5.8-10
Sensors ......................... 5.9-1
Introduction .................................
The Basic Structure ..........................
Motorola's Patented X-ducer . . . . . . . . . . . . . . . . ..
Linearity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Table of C"'Alntents
5.9-2
5.9-2
5.9-2
5.9-3
Surface Mount Information ...... 5.11-1
Information for Using Surface Mount Packages .... 5.11-2
Footprints for Soldering ........................ 5.11-5
viii
Motorola Master Selection Guide
Table of Contents
Product Literature
and Technical Training ....... 6.0-1
Communications, Power and
Signal Technologies Group
Products (continued)
Technical Data Services .........................
Motorola Semiconductor Master Selection Guide ..
Semiconductor Data Update Magazine .........
Mfax- Touch-Tone Fax .....................
Internet Server ..............................
Motorola Data and Application Literature ...........
Motorola Application Literature .............. '"
Technical Training ..............................
Tape and Reel Specifications
and Packaging Specifications .... 5.12-1
Tape and Reel Specifications ................... 5.12-2
Embossed Tape and Reel Ordering Information. 5.12-3
Embossed Tape and Reel Data for Discretes ... 5.12-4
Lead Tape Packaging Standards
for Axial-Lead Components ................. 5.12-6
Packaging Specifications ....................... 5.12-7
T0-92 EIA Radial Tape in Fan Fold Box
oronReel ................................. 5.12-7
Fan Fold Box Styles ......................... 5.12-9
Adhesion Pull Tests ......................... 5.12-9
Reel Styles ............................... 5.12-10
Motorola Master Selection Guide
6.1-1
6.1-1
6.1-1
6.1-1
6.1-1
6.1-2
6.1-6
6.1-7
Device Index
and Subject Index ........... 7.0-1
Device Index ................................... 7.1-1
General Index .............. , ...... '" .... , ..... 7.2-1
Subject Index .................................. 7.2-9
ix
Table of Contents
Table of Contents
x
Motorola Master Selection Guide
Semicustom Application Specific
Integrated Circuits
In Brief ...
Motorola
supports
strategic
programs
and
co--development partnerships to accelerate the availability
of advanced processes (CMOS, BiCMOS, Bipolar),
packaging and CAD technology. Extensive research,
manufacturing and financial resources are focused to
develop and maintain leading edge capabilities.
Motorola Master Selection Guide
ASIC Preview ...............................
Bipolar .....................................
ECl& ETlSeriesArrays ...................
CMOS .....................................
1.0 Micron HDC Series
Sub-Micron H4C & H4CPlus Series. . . . . . . ..
Design Automation Software (OACSTM) .........
Advanced Packaging .........................
Architecture for the 90's CDATM
(Customer Defined Arrays) ...................
CDA - The Architecture of the '90s .........
Bipolar ECl & ETl Series Arrays .................
Third Generation ............................
ETl Series Arrays Extend Design Flexibility . ..
ETl Series Features Mixed ECl-TTL Interface
CMOS ........................................
1.0 Micron CMOS HDCTM Series ..............
Triple-layer Metal ........................
Sub-Micron CMOS H4CTM Series .............
CDATMArchitecture ........................
Sub-Micron CMOS H4CPlus™ Series
Mixed 3.3 V/5.0 V levels .....................
DeSign Automation Software .....................
The Open Architecture CAD System™ ..........
OACSTM 2.2 and 3.1 M Features . . . . . . . . . . . . . . ..
Advanced Packaging ...........................
Quad Flat Pack Molded Carrier Ring
(QFP-MCR) ................................
MicroCoolTM Quad Flat Pack. . . . . . . . . . . . . . . . . ..
Over-Molded Pad Array Carrier (OMPACTM) .....
Literature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
ASIC Regional DeSign Centers - United States ....
ASIC Regional Design Centers - International .....
1.0-1
Page
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-1
1.1-2
1.1-2
1.1-2
1.1-2
1.1-3
1.1-3
1.1-3
1.1-4
1.1-4
1.1-5
1.1-6
1.1-6
1.1-6
1.1-7
1.1-7
1.1-7
1.1-7
1.1-8
1.1-8
1.1-8
Application Specific Integrated Circuits (ASICs)
Application Specific Integrated Circuits (ASICs)
1.0-2
rviotoroia iviH:Sier Seiectlofi Guide
ASIC Preview
Architecture for the 90's CDA™
(Customer Defined Arrays)
Bipolar
ECl & ETl Series Arrays
Performance, density and power dissipation are critical
issues for next generation ASIC designs. The integration of
large diffused blocks and embedded memory enhances
intra-chip communication and saves board area. The
Customer Defined Array (CDA) concept lets designers
combine array-based, cell based, and full custom logic with
diffused memory blocks on a die. The concept equally
supports Bipolar and CMOS, each with the capability to
incorporate BiCMOS modules.
Motorola's MOSAIC IIITM technology features modified
transistor structures to reduce series base resistance and
collector-base junction capacitance. The result is enhanced
switching speed. Mixed ECLfITL interface compatibility and
high frequency (over 2.5 GHz) operation highlights the ETL
Series.
CMOS
1.0 Micron HOC Series
Sub-Micron H4C & H4CPlus Series
COA -
High density CMOS arrays (HOC Series) are built on 1.0
micron drawn, triple-layer-metal CMOS process. By utilizing
three layers of metal for signal routing, designers can achieve
greater utilization on a channelless architecture.
The sub-micron (0.7IlLeff) H4C Series enables densities
over 300 K gates with 365 picosecond typical gate delay
performance. It's available in Custom Defined Architecture
(CDA).
Motorola's highest performance 0.6 micron CMOS arrays,
the H4CPlus Series, are targeted for mixed 3.3 V and 5 V
applications. The H4CPlus arrays range in density from
28,400 to 178,000 available gates with packages ranging from
128 QFP to 313 OMPAC.
Architecture
The Architecture of the '90s
Methodology
Technology
I
I PROG~~~~ABLEH,_.P.AL_. .
BIPOLAR
Customer
Defined Arrays
CMOS
Design Automation Software
(OACSTM)
Motorola's Open Architecture CAD System (OACS)
provides a complete ASIC development environment using
industry-standard workstations and leading third-party
design and verification tools. The OACS system integrates
sophisticated ASIC design software tools to handle high
performance designs and has the required flexibility to support
future technology advances.
Benefits
• Time-to-market through integration of functional
building blocks and ASIC design methodology.
• Customers can create application specific arrays.
• Diffused RAM optimized for performance and denSity.
• Fixed die sizes for ease of manufacturing.
Advanced Packaging
OMPAC: (Over-Molded Pad Array Carrier), a surface
mount plastic package with solder bumps instead of traditional
pins for interfacing to printed circuit boards.
QFP-MCR: Quad Flat Package in lead counts from 64 to 304
in optional Molded Carrier Ring which provides coplanarity and
lead protection during manufacturing, testing and shipping.
MicroCool QFP: A new QFP-compatible plastic package
with heat slug attached for improved heat dissipation capacity.
Motorola Master Selection Guide
1.1-1
Application Specific Integrated Circuits (ASICs)
Bipolar
Eel & Ell Series Arrays
Third Generation
ETL Series Arrays
Extend Design Flexibility
The ETl Series is flexible enough to simplify translation
between high speed logic families.
Three. base arrays:
MCA750ETl, MCA3200ETl, MCA6200ETl
•
•
•
•
•
•
•
•
•
•
848 to 6915 Equivalent Gates
Channelled Architecture for up to 100% Utilization
Input and Internal ECl Gate Delays - 0.20 ns (Typical)
TIL Input'Translation Cell Delay - 0.55 ns (Typical)
Up to 168 Universal I/O Signal Ports
Bidirectional ECl and TIL I/O Macros
ECl 100 K, Pseudo ECl and TIL logic Interfaces
Programmable Speed/Power levels
Three-level Series Gated Macros
MCA2 and MCA3 ECl Series Library Compatible
Figure 1. MCA6200ETl In Multi-Layer Ceramic
224 Pln-Grld-Array Designed for High Frequency,
Mlxed-Mode Applications
Motorola's MOSAIC III bipolar process offers unexcelled
mixed TIUECl interface capability in a high performance,
mature technology.
ETL Series Features
Mixed ECL-TTL Interface
lOOK
ECLOR PECL
INPUT BUFFERS
The ETl Series offers mixed ECl, PECl (pseudo ECl) and
TIL compatible Interfaces. The Series combines 200 ps typical
gate delays with 2500 MHz operating frequencies. Any signal
pin can be programmed for input, output, or bidirectional
signals in ECl, TIL or PECl logic. MOSAIC III process
technology, combined with innovative design, extensive
macroceli library and versatile I/O structure adds up to
superior performance and flexibility.
TTL INPUT
TRANSLATORS
f---
---
MACRO
CELLS
M-CELLS
-...
lOOK
ECLOR PECL
OUTPUT BUFFERS
-...
TTL OUTPUT
TRANSLATORS
Figure 2. ETl Series Block Diagram
Table 1. ECl & ETl Series Features
Array
Features
MCA
2200ECL
MCA
10000ECL
Technology
Equivalent Gates
MCA
750ETL
MCA
3200ETL
MCA
6200ETL
3570
6915
110
225
M08AICIII
2412
12402
848
24
Internal (Major) Cells
68
414
1/08ignais
108
256
Input/Interface Cells
96
224
Output (0) Cells
96
200
Max Gate Delay (ns)
0.175
0.175
0.2
0.2
0.2
Max 1/0 Frequency (MHz)
1500
1200
2500
2500
2500
Typical Power Dissipation 0Nl
3-6
lQ-30
1-2
4-7
7-12
Application Specific Integrated Circuits (ASiCsj
i.i-2
Universal 1/0 Ports
42
120
168
MQtoiQla Mast6i Selection Guide
CMOS
1.0 Micron CMOS
HDCTM Series
Triple-Layer Metal
Built on a 1.0 micron, triple-layer metal CMOS process, the
HDC Series represents a significant advancement in
microchip technology. By utilizing three layers of metal for
signal routing and power distribution, designers can achieve
maximum utilization on a channelless architecture having
minimum chip dimensions. The result is high performance
combined with 1/0 flexibility and density.
The HDC Series is available in a wide variety of plastic
surface mount packages. The diversity of package style and
pin count lets the designer best match system size, cost and
performance requirements.
Figure 3. Triple-Layer Metal Signal Routing
Enhances Utilization
Features
•
•
•
•
•
•
•
•
•
•
•
•
3,000 to 49,OOO available gates
Up to 70% utilization
Channelless Sea-Of-Gates architecture
1.0 micron drawn gate length (0.8 ~Leff)
Triple layer metal routing and power distribution
Eight transistor, fully utilizable, oxide isolated primary cell
475 picosecond typical gate delay (2-input NAND)
Fixed RAM blocks (single, dual and quad)
5 V CMOS and TTL compatible 1/0 options
Low power consumption of 6 ~W/gate IMHz
110 cells can be paralleled on-chip for 48 mA drive
Pin functions are 100% programmable as 1/0 or power
on plastic packages
• 1000 V ESD protection, latchup immunity to 100 mA
• Comprehensive workstation based CAD support
QFP-MCR
MOLDED CARRIER RING
64-208 PINS
Figure 4. Typical HOC Series Packages
Table 2. HOC Series Features
Available
Gates
#of Die Pads
(Wirebond)
HDC003
3,036
76
HDC006
5,670
96
HDC008
8,208
108
HDC011
11,208
120
Array
Die Size
(mils square)
Package
Pins
88
136
28-68
120
168
28-84
144
182
28-100
168
202
28-100
Available
If0 Cells
HDC016
16,416
136
204
232
68-128
HDC027
27,270
168
264
282
84-160
HDC031
31,290
180
280
295
68-160
HDC049
49,368
216
352
354
160-208
Motorola Master Selection Guide
1.1-3
Application Specific Integrated Circuits (ASICs)
Sub-Micron CMOS
H4CTM Series
¥"" FIXED I/O RING
B
CDA Architecture
RAM
The H4C Series of CMOS Customer Defined ArraysTht (CDA)
provides a new generation of ASICs to capture the functionality
of the sub-micron process. The new fabrication process of the
H4C Series supports speed requirements of 60 MHz processors
with a power dissipation of only 3 !!WIMHzlgate.
The CDA architecture offers the versatility and efficiency of
system design on a single chip by providing large, full~iffused
architectural blocks such as user configurable SRAMs.
Additionally, to ensure high quality ASIC system designs, several
design-for-test implementations and clock skew management
schemes are available.
U
I/OCELLS--
~
>-
MEGAFUNCTIONSI
EMBEDDED BLOCKS
D
GATE ARRAY
STRUCTURE
Figure 5. The CDA Concept: Megafunctions and
Embedded Blocks Within a Gate Array
Features
• 18,080 to 317,968 available gates
• Compatible channelless, Sea-ot-Gates and
CDA architectures
• 0.7 micron effective gate length
• Triple-layer-metal signal routing and power distribution
• Up to 70% gate utilization (smaller arrays)
• 365 picosecond typical gate delay (2-input NAND)
• User configurable, fully diffused SRAM blocks
up to 256K bits
• Low power consumption - 3 !!w/MHzlgate
• 3.3 V and 5.0 V CMOS and TIL compatible I/O cells
• BIST, JTAG (IEEE 1149.1) and LSSD/ESSD scan supported
• Digital PLL to manage clock skew
• Boundary scan embedded in periphery
• Extended workstation-based CAD support for
embedded functions
• Clock tree synthesis and clock skew management
OMPAC
~
....
'
.~
..
MicroCool QFP
Figure 6. Typical H4C Series Packages
Table 3. H4C Series Features
Array
Available Gates
#ofDie Pads
110 Cells
Package Pins
H4C018
18,080
136
160
80-120
H4C027
27,048
160
196
80-128
H4C035
35,392
176
224
80-160
H4C057
57,368
216
284
80-225
H4C086
85,956
256
344
120-225
H4C123
123,136
304
416
160-313
H4C161
161,364
344
476
160-313
H4C195
195,452
376
524
160-375
H4C267
266,832
432
612
447
H4C318
317,968
468
668
447
Application Specific Integrated Circuits (A::il(;s)
;.i-4
Motoiola Mastei Selection Guide
Product Preview
SELF-TERMINATING
DIFFERENTIAL
Sub-Micron CMOS
H4CPluS™ Series
Mixed 3.3 V/S.O V Levels
ENABLE
DATA OUT
DATA IN
The new sub-rnicron CMOS H4CPlus Series is targeted for
mixed 3.3 V and 5 V applications, as well as low-power 3.3 V
systems. The H4CPlus arrays range in density from 28,400 to
178,000 available gates with packages initially ranging from 128
QFP to 313 OMPAC.
A key feature of this family is a powerful I/O buffer aimed at
meeting the requirement for GTl VO levels and capable of
driving backplanes of 50 n transmission lines in today's
high-performance RISC/CISC microprocessor-based systems.
For the highest possible chip--to-chip operating frequencies,
the H4CPlus family introduces Current Mode Transceiver
logic™ (CMTUM) buffers. This new self-terminating I/O method
permits CMOS chip--to-chip interface speeds (using typical
differential or single-ended inputs) to 250 MHz, at low power
dissipation. It also provides a differential interface directly to
industry standard ECLinPSTM logic when used with a +5 V rail.
HIGH-SPEED
OUTPUT
HIGH-SPEED
INPUT
HIGH-SPEED
INPUT
HIGH-SPEED
OUTPUT
SELF-TERMINATED
SINGLE-ENDED
Figure 7. Interfacing H4CPlus Series with Current
Mode Transceiver Logic
OFP-MCR
MOLDED CARRIER
RING
Features:
•
•
•
•
•
•
•
•
•
•
•
0.6 micron effective gate length
Typical gate delay of 280 ps for a NAN2, FO 2 at 5 V
Power dissipation of 1 IlW/gate/MHz at 3.3 V
Standard 5 V high performance or 2.7 V to 3.6 V low
power configurations, with mixed 3.3 V and 5 V
combinations
Single I/O site, 2 rnA to 24 rnA drive, TTL and CMOS
output macros
PECl input buffer macros supporting inputs
to 250 MHz Typical
Current Mode Transceiver logic I/O buffer for
self-terminated, high-speed differential or single-€nded
interfacing to 250 MHz
Separate 5 V and 3.3 V power bussing
Embedded analog Pll' macros for up to 125 MHz clocks
Industry standard JTAG boundary scan built into I/O
macros
DFT methodology support (JTAG, SIST, lSSD, ESSD)
=
d
4
~
...
"
"
...........
......
~ .. J> I> "
.
'* ~
.. J> ..
: :::: :::::;:;;;
...........
".
...... " ,., " .... .,
....................
.. . . . .. . .. ...... " ..
..
I>
........ ~
"
f! . . . . . . . ..
~
"
OMPAC
BALL GRID ARRAY
~
; : ; : : : : : : : ; : :~!
"
. . . '" .. ., . . . f ~ ........
. . . 1> • • • • • 1 • • • •
,'I \
>
"<
,.
MicroCool
OFP
Figure 8. Typical H4CPlus Series Packages
Table 4. H4CPlus Series Features
Available Gates
Die Size
(milS/side)
Die Pads
Wirebond
I/O Cells
Package Pins
H4CP028
28,400
239
176
160
128-169
H4CP048
48,100
287
216
208
128-225
H4CP075
74,520
337
256
256
128-225
H4CP109
109,368
391
304
312
160-313
H4CP146
145,544
438
344
360
160-313
H4CP178
178,000
476
376
400
160-313
Array Name
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Motorola Master Selection Guide
1.1-5
Application Specific Integrated Circuits (ASICs)
Design Automation Software
Motorola has worked closely with several leading
CAD/CAE vendors to integrate the best design tools in the
industry into one system. In many cases, Motorola has been
instrumental in the definition and refining of key third-party
design tools.
To satisfy specific CAD requirements, Motorola has
developed several design tools to perform netlisting and
translation, rule checking, delay and timing calculation, fault
grading and automatic test pattern generation, floorplanning,
test vector analysis and processing.
The OACS 2.2 and 3.1 M features chart briefly describes
Motorola's OACSTM ASIC design system options.
The Open Architecture CAD
System™
The Open Architecture CAD System (OACS) offers a highly
versatile and powerful design environment for the design of
Motorola's H4CPlus, HC4 Series, and HOC Series CMOS
arrays. The OACS integrates several of the industry's most
powerful design tools with Motorola's high-performance tools
Open Architecture
CAD System
into a standard EDIF based CAD environment. The release of
this Design Reference Guide corresponds to the release of
two major versions of OACS: OACS 2.2 and OACS 3.1 M.
OACS 2.2 is Motorola's point tool CAE solution based on
Cadence's ConceptTM schematic editor, Synopsys' synthesis
tools, and Cadence's Verilog™ logic simulator.
OACS 3.1 M is Motorola'S framework based CAE solution
using Mentor's Falcon Framework™. This solution provides
support of Mentor's design entry tools and QuickSim II logic
simulation.
OACSTM 2.2 and 3.1 M Features:
• EDIF 2.0.0 backplane approach to providing an open
design environment
• Supports the following third-party design tools:
• Synopsys' Design Compiler™, HDL Compiler™, Test
Compiler™ (optional) and Design Wave™
• Cadence's Concept™ schematic capture (2.2)
• Cadence's Verilog XLTM simulator and Veritime™ static
timing analysis (2.2)
• Quad Design's MOTIVE® static timing analysis
(optional) (2.2)
• Mentor Graphics' Falcon Framework™ (3.1 M)
• Mentor Graphics' QuickSim IITM simulator and
QuickPath™ static timing analysis (3.1 M)
• Mentor Graphics' AutoLogic™ design synthesis tool
• Cadence's Gate Ensemble™ and Dracula™ phYSical
layout and verification tools (factory only)
• Motorola design tools:
• Memorist™ diffused SRAM compiler (optional)
• Mustang™ automatic test pattern generation (optional)
AtJJJii(;aliun Specific liitegiated Ciicuits (AS!C::;)
•
•
•
•
•
1.1-6
• TestPASTM test vector validation and extraction
• ERC and MARV comprehensive electrical and
manufacturing rules checking
• PrediXTM floorplanning (optional)
Testability support: ESSDILSSD scan, JTAG boundary
scan, BIST, and scan synthesis
Sophisticated delay and timing limits calculations for
accurate simulation and timing analysiS
• Estimated and actual (back-annotated) wire
capacitances
• Includes intrinsic, riselfall time, output pin loading and
distributed RC delays
• Continuous process, temperature, and voltage variation
Clock skew management: clock-tree synthesis, PLL,
timing driven layout
Supports multiple technologies: HDCMOS, H4C,
H4C-CDA-1C, H4CPlus
Supported on HP9000nXX and SUN-4 SPARC®
workstations
Motorola Master Selection Guide
Advanced Packaging
Low cost, high performance systems require excellence in
ASIC packaging technology. MicroCool, QFP-MCR (Quad
Flat Pack in an optional Molded Carrier Ring), and
Over-Molded Pad Array Carrier (OM PAC) packages illustrate
cost effective manufacturing solutions for high lead count,
high frequency applications.
Quad Flat Pack Molded
Carrier Ring (MCR-QFP)
Motorola currently offers the popular EIAJ standard Plastic
Quad Flat Package (QFP) in lead counts from 64 to 240 pins.
The Molded Carrier Ring (MCR) is a coplanarity and lead
protection device for QFP packages. The ring provides lead
protection during manufacturing/testing and shipping.
Standard ring sizes simplify manufacturing across the
range of packages and improve component testability.
Figure 10. 169-lead OverMolded Pad Array Carrier
(OM PAC) Saves Board Space and
Improves Manufacturing Yields
Over-Molded Pad
Array Carrier (OMPACTM)
MicroCooiTMQuad Flat Pack
The MicroCool QFP is a new QFP compatible plastic
package with improved heat dissipation capacity. It has a heat
slug attached to a printed circuit board which supports a
copper lead frame. The package incorporates a molded
carrier ring to maintain pin coplanarity. Lead counts range from
64 to 304 pOints. MicroCool packaging is cost-effective and
capable of meeting high power dissipation (up to 5 W, depending
on temperature and ambient conditions).
OMPAC consists of a thin double metal printed circuit
board, overmolded with plastic. The integrated circuit is
attached to a gold-plated die flag on the substrate with a
silver-filled epoxy. Electrical connections to the integrated
circuits are made using conventional gold ball bonding
techniques.
Primary Advantages Over QFP
Features:
•
•
•
•
•
•
•
•
• Thermally improved footprint compatible version of
MCR-QFP package
• Constructed using PCB with attached leadframe and heat
slug. The die is attached to the slug which is exposed on
the package top surface
• Coplanarity less than 4 mils using MCR techniques-(PCB
material aids good coplanarity by cutting bowing of
plastic)
Eliminates concerns with lead coplanarity
Improved electrical performance
Comparable or better thermal performance
Requires less costly PCB pitch
Smaller size
No risk of lead damage
Improved manufacturing yields
Competitive pricing
DIE ATTACH
EPOXY
GOLD PLATED
DIE ATTACH
SOLDER BALL
Figure 11. Simplified Cross-Sectional View of OMPAC
Figure 9. MicroCool Quad Flat-Pack in
Molded Carrier Ring Lowers Board Cost and
Improves Thermal Performance
Motorola Master Selection Guide
1.1-7
Application Specific Integrated Circuits (ASICs)
Literature
To order any literature item, call or write:
Motorola Semiconductor Products
Literature Distribution Center
P.O. Box 20912, Phoenix, Arizona 85036
(602) 994-6561
Order Number
Description
Order Number
Design Manuals
H4CDM/D
H4CPDM/D
HDCDM/D
MCA3ECUD
MCA3ETlDM/D
MC92005UM/D
H4C Seri.es CMOS Arrays
H4CPlus Series CMOS Arrays
HDC Series CMOS Arrays
MCA3 ECl Series Arrays
MCA3 ETl Series Arrays
SBus Interface Controller
AN1093/D
AN 1095/D
AN1096/D
AN1099/D
Data Sheets
ETUD
H4C/D
H4CP/D
HDC/D
MCA2200ECUD
MCA10000ECUD
MC92005/D
AN1500
MCA3 ETl Series Macrocell Arrays
Sub-micron H4C Series
CMOS Arrays
H4CPlus Series CMOS Arrays
HDC Series CMOS Arrays
MCA2200ECl Macrocell Array
MCA 1OOOOECl Macrocell Array
Slave Interface Controller
AN1502lD
AN1508/D
AN1509/D
AN15121D
AN1514/D
BrochureslSelector Guides/Misc.
SG367/D
BR916/D
BR931/D
BR1400/D
BR1417/D
Description
Application Notes/Article Reprints
ASIC Product Overview
Packaging Manual for ASIC Arrays
Symbols to Silicon (C_LAN)
Open Architecture CAD SystemOACS2.x
Open Architecture CAD System OACS3.xM
AR518/D
AR5221D
AR524/D
ASIC Regional Design Centers -
United States
California, San Jose
(408) 749-{)510
Illinois, Chicago
(708) 490-9500
ASIC Regional Design Centers -
International
European Headquarters,
Germany, Munich
(089) 92103-{)
England, Aylesbury, Bucks
(0296) 395252
Holland, Eindhoven
(04998) 61211
Hong Kong, Silicon Harbour, Tai Po
(852) 666-8333
Japan, Tokyo
(03) 440-3311
Sweden, Stockholm
(08) 734-8800
Appiication Specific Intsgiat6d Ciicuits (AS!Cs)
1.1-8
Delay and TIming Methods for
CMOS ASICs
Clock Distribution
Guidelines for USing the
Mustang™ ATPG System
Test Methodology for
HDC Series Arrays
JTAG Boundary Scan for
H4C/H4CPlus Arrays
Embedded RAM/BIST
High Frequency Design Techs
& Guidelines for Bipolar
Gate Arrays
ASIC Clock Distribution
USing Pll
TestPAS Primer
H4CPlus Series 3.3 VIS V Design
Considerations
Gate Arrays Simplify Translation
between High Speed Logic
Families
Ranking of Gate Array Vendors
ASIC Package Selection
Massachusetts, Marlborough
(508) 481-8100
France, Velizy
(01) 34635900
Italy, Milan
(02) 82201
Motorola Master Selection Guide
Microcomputer Components
In Brief ...
Motorola continues to be a leading supplier of components
for microcomputer systems. The product portfolio includes
digital signal processors; CISC and RISC and PowerPC
advanced microprocessors and complementary fulHunction
peripherals; a comprehensive selection of high-performance
microcontrollers; VLSI functions for Local Operating Network
applications; and a broad range of fast static RAM and dynamic
RAM chips and modules.
Our commitment is to provide state-of-the-art devices
as well as continuing support of established products, with
six-sigma quality and total customer satisfaction.
Motorola Master Selection Guide
Digital Signal Processors ....................... .
The M68000 Family ........................... .
The M88000 RISC Family ...................... .
The PowerPC RISC Family Microprocessors ...... .
Single-Ghip Microcontrollers (CSIC) ............. .
Single-Chip Microcontrollers (AMCU) ........... .
LonWorks Products ............................ .
Memory Products ............................. .
2.0-1
Page
2.1-1
2.2-1
2.3-1
2.4--1
2.5-1
2.6--1
2.7-1
2.8-1
Microcomputer Components
Micfucumputsi Components
2.0-2
Motorola Master Selection Guide
Digital Signal Processors
In Brief ...
Drawing on both design excellence and expertise in
manufacturing, Motorola has created a range of
architecturally compatible Digital Signal Processing chips.
The philosophy behind the DSP families has been to create
compatibility between products as well as conformance to
international standards.
Motorola offers a complete portfolio of 16- and 24-bit
fixed point and 32-bit floating point DSPs.
In addition, we offer a comprehensive array of
development tools to give the designer access to the full
power and versatility of the DSPs with minimum fuss. All the
tools were designed for ease of use and functionality. They
provide a low-cost means of evaluation and greatly simplify
the design and development phase of a DSP project.
Motorola Master Selection Guide
DSP56100 - 16-Bit Digital Signal Processors
DSP56800 - 16-Bit Digital Signal Processors
DSP56000 - 24-Bit Digital Signal Processors
DSP56300 - 24-Bit Digital Signal Processors
DSP96002 - 32-Bit Digital Signal Processors
DSP56ADC16 - The Analog-To-Digital
Converter ................................ .
DSP Development Tools ....................... .
Application Development Systems ........... .
Graphical User Interface .................... .
DSP Development Software ................... .
Design-In Software Packages ............... .
C-Compiler Packages ...................... .
C-Compiler Upgrades ...................... .
2.1-1
Page
2.1-2
2.1-3
2.1-3
2.1-6
2.1-9
2.1-10
2.1-10
2.1-10
2.1-12
2.1-12
2.1-12
2.1-13
2.1-13
Digital Signal Processors
16-/24-/32-Bit Families -Your Complete DSP Solution
DSP56100 - 16-Bit
Digital Signal Processors
The DSP56100 family of HCMOS, low-power, 16--bit
fixed-point general-purpose digital signal processors (DSP)
is ideal for high end speech coding, telecommunications and
control applications. The first DSP56100 family member, the
DSP56156, combines the high-speed core with 8K bytes
RAM, two serial ports, one parallel port, codec, phase-locked
loop (PLL) and On-Chip Emulation (OnCETM). The
DSP56166, the second member of the DSP561 00 family, has
identical package and pinout to the DSP56156 with different
memory configuration and peripherals.
DSP56156 BENCHMARKS
Benchmark
Host
Control
or
Port B 1/0
HG--H7
or
PortBIlO
Instruction Cycles
Real FIR Filter with Data Shift
1 per Tap
LMS Adaptive Real FIR Filter
2 per Tap
Double Integration Sinewave Generation
2 per Sample
Complex FIR Filter with Data Shift
4 per Tap
General Lattice Filter
4 per Tap
Real Cascaded IIR Biquad
Filter Sections (4 coetl.)
5 per Section
PIDLoop
5
Double Precision Multiply
6
[1x3][3x3] Matrix Multiplication
21
DSP56100 Features
AG--A15 ,;.:==~
• Up to 30 Million Instructions per Second (MIPS) at 60
MHz - 33.3 ns Instruction cycle
• Single-cycle 16 x 16--bit parallel Multiply-Accumulate
• 2 x 4G-bit accumulators with extension byte
• Fractional and integer arithmetic with support for
multi precision arithmetic
• Highly parallel instruction set with unique DSP addressing
modes
• Nested hardware DO loops including infinite loops and
DO zero loop
• Two instruction LMS adaptive filter loop
• Fast auto-return interrupts
• Three external interrupt request pins
• Three 16--bit internal data and three 16-bit internal
address buses
• Individual programmable wait states on the external bus
for program, data, and peripheral memory spaces
• Off-chip memory-mapped peripheral space with
programmable access time and separate peripheral
enable pin
• On-chip memory-mapped peripheral registers
• Low Power Wait and Stop modes
• On-Chip Emulation(OnCE) for unobtrusive, processor
speed independent debugging
• Operating frequency down to DC
• 5 V single power supply
• Low Power (HCMOS)
28erial
Interfaces
8810&
8811
or
PortCl/O
DD-D15 '';;.=0.=-1
Timer or
Tout}
Tin
PortCl/O
Power
Ground
1°1>-[l3CIOci< ou;ae::
1«1"'
~~~
~~QICl
< '" ° e:: and jou;
888 PLL ~Cl
:::; :::; :::;
'---v---J
Interrupt and
Mode Control
'---v---J
OnCETM
PART NUMBERS
Part
Description
XC56156FV40
40 MHz in TQFP
XC56156FV50
50 MHz in TQFP
XC56156FE60
60 MHz in CQFP
XC56166FV60
60 MHz in TQFP
Digital Signal Processors
2.1-2
Motorola Master Selection Guide
DSP56800 -
16-Bit Digital Signal Processors
The DSP56800 core family is the first architecture
designed to enable digital signal processing and embedded
microcontroller functionality. This multi-functional approach
supports applications requiring both signal processing and
control functionality, such as wireless messaging, digital
answering machines, feature phones and low-cost wireline
modems.
The first two DSP56800 family members, the DSP56L811
and DSP56L812 are identical except for memory
configuration. The DSP56L811 contains 1K of program RAM
and 2K of data RAM. The DSP56L812 features 22K of
program ROM, 2K of data ROM and 2K of data RAM.
DSP56800 Features
•
•
•
•
•
•
•
•
20 MIPS at 40 MHz
3.3 Volts
Three 16-bit Timers
Two Serial Peripheral Interfaces (SPls)
Serial Synchronous Interface (SSI)
JTAG OnCPM Port
Phase-Locked Loop
16 - 32 general purpose input/output pins. (16 dedicated
and 16 shared with peripherals)
• External bus interface to allow for additional memory
• Support for high-level C and C++ programming
languages
• Streamlined instruction set featuring frequently used DSP
and microcontroller codes, as well as control extensions
On-Chip
Expansion
PART NUMBERS (4Q '96 Availability)
Part
Description
XC56L811 BU40
40 MHz in TOFP
XC56L812BU40
40 MHz in TOFP
DSP56000 - 24-Bit Digital Signal Processors
The DSP56000 Family of 24-bit, fixed-point,
general-purpose digital signal processors is Motorola's
original DSP family and has set the standard for high end DSP
devices with its triple Harvard architecture of seven internal
buses and three parallel execution units - Data ALU,
Address Generation Unit, and Program Controller. Motorola
has retained architectural compatibility with the 24-bit family
into the 16-bit DSP56100 and 32-bit DSP96002 products
helping to preserve our customer software investment.
The DSP56000 Family of HCMOS, 24-bit DSP devices
consists of the DSP56002, DSP56L002, DSP56004,
DSP56005, DSP56007, DSP56L007, DSP56009 and the
transitional DSP56001A. All these products are source code
compatible and are used extenSively in telecommunications,
control and audio applications. The DSP56000 Family's
unique 24-bit architecture has made these products the
industry standard for CD-quality digital audio processing.
The DSP56L002 and DSP56L007 low-voltage devices
operate at 3.3 volts which effectively extends the battery life
Motorola Master Selection Guide
of portable applications up to three times longer than 5 volt
systems.
2.1-3
Digital Signal Processors
DSP56002 BENCHMARKS
Benchmark
Instruction Cycles
Real FIR Filter with Data Shift
1 per Tap
Two Dimensional Convolution
(3x3 coell. mask)
1 per Output
LMS Adaptive Real FIR Filter
3 per Tap
Real Cascaded IIR Biquad
Filter Sections (4 coell.)
4 per Section
Complex FIR Filter with Data Shift
4 per Tap
[1x3][3x3] Matrix Multiplication
17
Division
28
Leroux-Gueguen LPC Analysis:
8th Order
10th Order
16th Order
473
622
1203
Digital Signal Processors
2.1-4
Motorola Master Selection Guide
DSP56000 -
24-Bit Digital Signal Processors (continued)
HO-H70r
PortBllO
Host Control or
PortBllO
• Double buffered peripherals
• Power-saving Wait and Stop modes
DSP56002 F'eatures
• 512 x 24-bit on-chip program RAM and 64 x 24-bit
bootstrap ROM
• Two 256 x 24-bit on-Chip data RAMs
• Two 256 x 24-bit on--chip data ROMs containing sine,
A-law, and ~-Iaw tables
• External memory expansion with 16-bit address and
24-bit data buses
• Bootstrap loading from external data bus, Host Interface,
or Serial Communications Interface
• Byte-wide Host Interface (HI) with Direct Memory Access
(DMA) support
Synchronous Serial Interface (SSI) to communicate with
codecs and synchronous serial devices
- 8-, 12-, 16-, 24-bit word sizes
- Up to 32 software-selectable time slots in network
mode
- Serial Communication Interface (SCI) for full-duplex
asynchronous communications
- 24-bit Timer/Event Counter also generates and
measures digital waveforms
- Up to 25 general-purpose 110 (GPIO) pins
- Three external interrupt request pins; one
non-maskable
- 3.3 V (DSP56L002) and 5 V (DSP56002) power
supply options
AO-A15
RXD} Note
TXD
SCLK
2
DSP56002
ig~}Note
Bus
Control
SCK
SRD
STD
3
PINIT~Note
PLOCK
CKP
4
L,-r-T"""'1r-r-r--r,...r-PCAP
I'"ol~-IF-~ i:!:-'-' 't!:.$l-;ff'
-'
1«o~~g~~><
Cl (/)
880
~
Interrupt and Mode Control
NOTES:
1. On-Chip Emulator Port (OnCE'M)
2. SCI Serial or Port CliO
3. SSI Serial or Port CliO
4. Phase-Locked Loop
DSP56004/DSP56007 Features
• Serial Audio Interface (SAl) includes 2 receivers and
3 transmitters, master or slave capability, and
implementation of 12 S, Sony, and Matshushita audio
protocols; two sets of SAl interrupt vectors
• Serial Host Interface (SHI) features single master
capability, lo-word receive FIFO, and support for 8-,
16-, and 24-bit words
• External Memory Interface (EMI) peripheral providing
glueless connection to DRAM, SRAM, and/or EPROM for
audio delay buffering
• Four dedicated, independent, programmable General
Purpose 110 (GPIO) lines
• DSP56004 memory: 512 words PRAM, 2 x 256 words
data RAM, 2 x 256 words data ROM
• DSP56007 memory: 6400 words PROM, 3200 words
data RAM, 1024 words data ROM
• 3.3 V power supply option available (DSP56L007)
• Bootstrap loading via 12 C, SPI, or byte-wide memory
modes available
• Up to 25 general-purpose 1/0 (GPIO) pins
DSP56000 Family Features
• On--chip Harvard architecture permitting simultaneous
accesses to program and two data memories
• Two 56-bit accumulators including extension byte
• Parallel 24 x 24-bit multiply-accumulate in 1 instruction
cycle (2 clock cycles)
• Double precision 48 x 48-bit multiply with 96-bit result in
6 instruction cycles
• 56-bit addition/subtraction in 1 instruction cycle
• Fractional arithmetic with support for multiprecision
arithmetic
• Hardware support for block-floating point FFT
• Hardware nested DO loops
• Zero-overhead fast interrupts (2 instruction cycles)
• On-Chip Emulation (OnCE) port for unobtrusive,
processor speed-independent debugging
• Software-programmable, Phase-Locked Loop (PLL)
based frequency synthesizer for the core clock
• On-chip peripheral registers memory mapped in data
memory space
Motorola Master Selection Guide
2.1-5
Digital Signal Processors
DSP56000 -
24-Bit Digital Signal Processors (continued)
DSP56005 Features
• Bootstrap loading from Serial Host Interface or External
Memory Interface
'These ROMs may be factory programmed with
data/program provided by the application developer.
• Five Pulse Width Modulators (PWM)
• 24-bit timer/event counter also generates and measures
digital waveforms
- Three with alternate outputs; two with open drain or
TTL outputs
- 9-bit to 16-bit data width
- Alternate outputs independently selectable as active
high or active low
• 16-bit Watchdog tirner
• 4608 x 24-bit on-Chip program RAM and 96 x 24-bit
bootstrap ROM
• Two 256 x 24-bit on-chip data RAMs
• Two 256 x 24-bit on-chip data ROMs containing sine and
arc-tangent tables
• External memory expansion with 16-bit address and
24-bit data buses
• Bootstrap loading from external data bus, Host Interface,
or Serial Communications Interface
PART NUMBERS
Part
Description
XC56001ARC27 Transitional Device. DSP56002 recommended
for new designs
XC56001ARC33 Transitional Device. DSP56002 recommended
for new designs
XC56001AFE27
Transitional Device. DSP56002 recommended
for new designs
XC56001AFE33
Transitional Device. DSP56002 recommended
for new designs
XC56001AFC27
Transitional Device. DSP56002 recommended
for new designs
XC56001AFC33
Transitional Device. DSP56002 recommended
for new designs
DSP56009 Features
DSP56002RC40
40 MHz RAM-based in 132-pin PGA
The memory configurations available differentiate this DSP
from the other family members. The DSP core is fed by a large
program ROM, two independent data RAMs, two data ROMs,
a Serial Audio Interface, Serial Host Interface, External
Memory
Interface,
dedicated
1/0
lines,
on-chip
Phase-Locked Loop (PLL), and On-Chip Emulation
(OnCEm) port.
• Completely pin compatible with DSP56004 and
DSP56007 for easy upgrades
• 5 V power supply
• On-chip Harvard architecture permitting simultaneous
accesses to program and two data memories
• 10240 x 24-bit on-chip program ROM'
• 4608 x 24-bit on-chip X-data RAM and 3072 x 24-bit
on-chip X-data ROM'
• 4352 x 24-bit on-chip Y-data RAM and 1792 x 24-bit
on-chip Y-data ROM'
• 512 x 24-bit on-chip program RAM and 64 x 24-bit
bootstrap ROM
• Up to 2304 x 24-bit from X and V data RAM can be
switched to program RAM giving a total of 2816 x 24-bits
of program RAM
DSP56002FC40
40 MHz RAM-based in 132-pin PQFP
DSP56300 -
66 MHz RAM-based in 132-pin PQFP
40 MHz RAM-based in 144-pin TQFP
XC56002PV66
66 MHz RAM-based in 144-pin TQFP
XCP56002PV80
80 MHz RAM-based in 144-pin TQFP
DSP56L002FC40 Low power 40 MHz RAM-based
PQFP
i~
132-pin
XC56L002PV40
Low power 40 MHz RAM-based in 144-pin
TQFP
XC56004FJ50
50 MHz RAM-based in 8O-pin QFP
XC56004FJ66
66 MHz RAM-based in 80-pin QFP
XC56005PV50
50 MHz RAM-based in 144-pin TQFP
XC56007FJ50
50 MHz ROM-based in 80-pin QFP
XC56007FJ66
66 MHz ROM-based in 80-pin QFP
XC56L007FJ40
Low-power 40 MHz ROM-based in 80-pin
QFP
XC56009PV80
80 MHz ROM-based in 80-pin QFP
24-Bit Digital Signal Processors
The first programmable Motorola DSP product to provide
a true single clock-cycle execution, the DSP56300 core
effectively doubles the number of instructions executed
without increasing clock speed, providing 80 MIPS of
performance at 80 MHz while retaining code compatibility with
the rest of the Motorola DSP offerings. The DSP56300 family
offers a new level of performance in MIPS, a rich instruction
set and low power dissipation, enabling a new generation of
products in wireless, telecommunications, and multimedia.
Digital Signal Processors
DSP56002FC66
XC56002PV40
2.1-6
Several significant architectural enhancements include a
barrel shifter, 24-bit addressing, instruction cache and DMA
functionality. The DSP56301 offers 66/80 MIPS using an
internal 66/80 MHz clock at 3.0 - 3.6 V.
DSP56301 Features
• 66/80 MIPS with a 66180 MHz internal clock at 3.0 - 3.6
volts
• Single clock per instruction execution
• Code compatible with the DSP56000 family
Motorola Master Selection Guide
• Fully-static logic with operation to DC
• Wait, stop and intelligent power control circuitry powers
down unused memories, peripherals and core logic on
each individual instruction
Motorola Master Selection Guide
2.1-7
Digital Signal Processors
DSP56300 -
24-Bit Digital Signal Processors (continued)
• OnCE with added JTAG support for system debugging
and testing
• On-chip PLL
• ALU Enhancements over DSP56000
- Fully pipelined barrel shifter supports bit stream
parsing and generation
- Conditional ALU instruction
-16-bit arithmetic supports cellular and videotelephony
standards
• Address Generation Unit Enhancements over DSP56000
- 24-bit addressing provides 16M word addressing for
Program, X and Y memories
- Program Counter relative addressing improves
operating system and compiler efficiency
- Immediate offset addressing
• Program Controller Enhancements over DSP56000
- Hard stack extension in data memory allows unlimited
stack depth without programmer overhead
- Support for instruction code
• Direct Memory Access Unit
- 6 channel fully concurrent DMA supports 120
Mbytes/sec transfers at 80 MHz
- Dedicated address and data buses support
concurrent memory accesses
- Supports peripheral interrupts, internal and external
memory reads/writes
• Two Enhanced Serial Synchronous Interface modules
• Three independent Timer modules
• Glueless interface to SRAM, Synchronous SRAM, DRAM
and memory mapped peripherals
• Off--<:hip expansion to 224 words for program, X, and Y
memory
DSP56301 On-Chip Memories
•
•
•
•
•
On--<:hip
On-Chip
On--<:hip
On-chip
On-Chip
2048 x 24-bit X data RAM
2048 x 24-bit Y data RAM
3072 x 24-bit Program RAM
1024 x 24-bit Instruction Cache/Program RAM
192 x 24 bit Bootstrap ROM
DSP56302 Features
• 8-bit parallel host port
• 34K words on--<:hip RAM
• 144-pin QFP
DSP56303 Features
• Cost effective version of 56301
• 8-bit parallel host port
• 144-pin QFP
PART NUMBERS
Part
Description
DSP56301 PeripheralsJExternal Buses
XC56301 PW66
66 MHz in 208 TQFP
• Modular peripheral and memory design
• Glueless interface to PCI, ISA, and other DSP56301
buses
• One Serial Communication Interface module
XC56302PV60
60 MHz in 144-pin QFP
XC56303PV66
66 MHz in 144-pin QFP
Digital Signal Processors
2.1-8
Motorola Master Selection Guide
DSP96002 - 32-Bit Digital Signal Processors
The DSP96002 has full architecture compatibility with the
16-bit DSP56100 and 24-bit DSP56000 Families. The
DSP96002 is the first in a family of 32-bit IEEE floating-point
DSP devices. The DSP96002 has two identical memory
expansion ports simplifying network configurations for
multiprocessor and DSP96002 communications. These ports
interface to SRAM, DRAM (operating in their fast access
modes), video RAM or directly to other processors with host
interface logic.
Although designed primarily for image processing, other
proven applications include communications, spectrum
analysis, instrumentation, speech processing and pattern
recognition.
OnCE'M
~
(/) ~
oQ ()
en Ci5 wla:::
Cl Cl
Cl Cl
DSP96002 BENCHMARKS
Benchmark
Real
FIR Filter with Data Shift
V=V'S + V
Lattice Filter with Data Shift
Cascaded IIR Biquad Filter
Sections (4 coel!.)
1024-pOint FFT and bit reversal
Complex
V=V'V+V
FIR Filter with Data Shift
1024-point FFT and bit reversal
Graphics/Image Processing
Divide (32-bit accuracy)
Square Root (32-bit accuracy)
Bezier Cubic Evaluation for
Font Compilation
[4x4][4x4] = [4x4]
Interrupt and
Mode Control
~
I~I~I~
\.....
;;;: C3 <3
~Cl 0 0
wOO 0
a::2:2:2
Instruction Cycles
1 per Tap
2
3 per Tap
4 per Section
12880
4
4 per Tap
20931
7
12
13
67
DSP96002 Features
14
Port A
• DSP96000 family architecture
- Full IEEE Standard 754 compatible for 32-bit (SP)
and 44-bit (SEP) arithmetic
- 20 MIPS, 50 ns instruction cycle at 40 MHz
- 60 million floating-point operations per second
(MFLOPS) at 40 MHz
- Single cycle 32 x 32 --7 96-bit multiply/accumulate
- Ten 96-bit general-purpose data registers
- Zero-overhead nested DO loops
- Two instruction--<:ycle fast interrupts
- Low-power Wait and Stop Modes
- On-Chip Emulation for unobtrusive, fuli-speed
debugging
- 4K byte instruction cache
- Integer mode available
- Single precision mode available
- Timer/Event Counter
• DSP96002 peripherals
- Two 32-bit address and data host ports
- Dual channel DMA controller
• DSP96002 memories
- 1024 x 32 program RAM
- 2 x 512 x 32 data RAM
- 2 x 512 x 32 data ROM (sine and cosine tables)
14
PortB
Control
Control
3
PortA
PortB
Host
Interface
and Control
Host
Interlace
and Control
""
--'
0
PART NUMBERS
Part
Description
XC96002RC33
33 MHz in PGA
XC96002RC40
40MHzin PGA
Motorola Master Selection Guide
2.1-9
Digital Signal Processors
DSP56ADC16 -
The Analog-To-Digital Converter
The
DSP56ADC16
is
a
single--chip,
linear
analog-to--digital (AID) converter. It is an ideal choice for
high-performance digital audio systems, voiclrbandwidth
communication and control applications. It does not require
antialiasing filters and sample-and-hold circuitry because they
are an inherent part of the sigma-delta technology. The
DSP56ADC16 can be easily interfaced to the DSP56001 and
other host processors using its flexible serial interface.
Key Features
•
•
•
•
•
•
16-bit output resolution at 100 kHz from FI R filter
12-bit output resolution at 400 kHz from Comb filter
96-dB dynamic range
9O-dB signal-to-THD ratio
9O-dB signal-to-noise ratio
In-band ripple: <0.001 dB
• Maximum output sample rates:
- FIR filter-l00 kHz
- Comb filter - 400 kHz
• Maximum input sample rate is 6.4 MHz
• Maximum internal clock rate is 12.8 MHz
• DC stability is lO-bits
• Supply voltage is single +5V (±10%)
• Supply current is <100 mA
• Linear-phase imalog front end and internal digital filters
• Simple serial interface to host microprocessors
• Fully differential inputs
PART NUMBERS
Part
Description
DSP56ADC16S
16...iJit in Ceramic DIP
DSP Development Tools
Application Development Systems
Every member of the Motorola Family of 16-, 24- and
32-bit DSPs is supported by a multi-component Application
Development System (ADS) which acts as a tool for
designing, debugging and evaluating real-time DSP target
system equipment. The ADS simplifies evaluation of the
user's prototype hardware/software product by making all of
the essential timing and I/O circuitry easily accessible. Using
an IBM PCTM, Macintosh™ II, a Sun-4™, or Hewlett-Packard
Series 700 as a medium between the user and the DSP
hardware significantly reduces the overall complexity and cost
of development while increasing the capabilities of the
system. With the ADS, DSP programs can be executed in
real-time, single instruction traced or multiple instruction
stepped with registers and/or memory block contents
displayed. The ADS is fully compatible with the CLAS
design-in software package for each product and may act as
an accelerator for testing DSP algorithms.
All Application Development Systems offer an On-Chip
Emulation (OnCETM) circuit for unobtrusive, processor speed
independent debugging. The ADS takes full advantage of this
circuit to allow the user non-intrusive control of the target.
General ADS Features
Soitware• Single/multiple stepping through DSP object programs
• Conditional/unconditional software and hardware
breakpOints
• Program patching using a single-line
assembler/disassembler
• Session and/or command logging for later reference
• Loading and saving of files to/from ADM memory
• Macro command definition and execution
• Display enable/disable of registers and memory
• Debug commands which support multiple DSP
development
Digital Signal Processors
• Hexadecimal/decimal/binary calculator
• Multiple inpuVoutput file access from DSP object
programs
• On-line help screens for each command and register
Hardware• Full speed operation
• Multiple ADM support with programmable ADM
addressing
• Stand-alone operation of ADM after initial development
DSP56156ADS Features
• System commands from within ADS user
interface program
• 16K words of configurable static RAM expandable
to 64Kwords
DSP56002ADS Features
• Host operating system commands from within ADS user
interface program
• 8K132K words of configurable RAM for DSP56002 code
development
• 96-pin euro-card connector for accessing all
DSP56000/1 pins
• 1K words of monitor ROM expandable to 4K words
• Separate connectors for accessing serial or
hosVDMA ports
DSP96000ADS Features
• System commands from within ADS user interface
program
• 128K words of configurable static RAM expandable to
512Kwords
• 2K words of EPROM with sockets expandable to 64K
words
• Full support of multiple data memory maps
2.1-10
Motorola Master Selection Guide
• Two sets of 96-pin connectors provide access to all
DSP96002 pins
• 2K words of EPROM with sockets expandable
to 16K words
Motorola Master Selection Guide
2.1-11
Digital Signal Processors
DSP Development Tools (continued)
Graphical User Interface
For DSP Application Development
Systems and Simulators
PART NUMBERS
Development
Systems
Host Machine
DSP56100ADSA'
IBM PC
DSP56100ADSB
Macintosh II
DSP56100ADSF'
Sun-4
A number of Motorola's DSP development systems and
simulators come with graphical user interface software to
ease working on applications based on our product families.
User Friendly
DSP56100ADSH' Hewlett-Packard Series 700
DSP96000ADSA •
IBM PC
DSP96000ADSB
Macintosh II
DSP96000ADSF'
Sun-4
• GUI works native to three operation systems
-SunOS
- Windows 3.1
-HPUX
• Multiple overlapping windows for the display of debugging
information, command input registers, memory, and
programs
• Pull down menus for ease of use
- Dialog boxes for selecting options of complex
commands
- Tool bar will provide fast access to commonly
performed actions
- Keyboard accelerators will be defined for commonly
executed commands
- Help viewer will be provided for viewing pre-defined
help on selected topics
DSP96000ADSH • Hewlett-Packard Series 700
DSP56002ADSA •
IBM PC
DSP56002ADSB
Macintosh II
DSP56002ADSF •
Sun-4
DSP56002ADSH • Hewlett-Packard Series 700
DSP56004ADSA •
IBM PC
DSP56004ADSB
Macintosh II
DSP56004ADSF •
Sun-4
DSP56004ADSH •
Hewlett-Packard Series 700
DSP56005ADSA *
IBM PC
DSP56005ADSB
Macintosh II
DSP56005ADSF •
Sun-4
DSP56005ADSH •
Hewlett-Packard Series 700
DSP56005ADPTR
Adapter Board
DSP56301ADSA'
IBM PC
DSP56301ADSF'
Sun-4
Debugging Capabilities for C Language and Assembly
• Assembly language symbolic or C Language source code
debugging capabilities
DSP Development Software
DSP56301 ADSH • Hewletl-Packard Series 700
DSP56002ADM
ADM Board for 56002
DSP56004ADM
ADM Board for 56004
DSP56156ADM
ADM Board for 56156
DSP56166ADM
ADM Board for 56166
DSP96000ADM
ADM Board for 96000
DSPPCHOST*
PC compatible host board and interface
software
DSPMACHOST
Macintosh II host board and interface
software
DSPSUN4HOST *
Sun-4 host board and interface software
DSPCOMMAND
16-,24-, 32-bit Command Converter
board and software
DSP56002EVM
Evaluation board and software for
DSP56002
DSP56007EVM
Evaluation board and software for
DSP56007
DSP56009EVM
Evaluation board and software for
DSP56009
-
Design-In Software Packages
The SimulatorlMacro-Assembler/Linker/Librarian software
package is a development system support tool. The Simulator
program imitates the operation of the DSP on a clock-cycle by
clock-cycle basis and gives an accurate measurement of
code execution time. All on-chip peripheral operations,
memory and register updates and exception processing
activities may be functionally simulated.
The full-featured Macro Cross Assembler translates one
or more source files containing instruction mnemonics,
operands, and assembler directives into a Common Object
File Format (COFF) file which is directly loadable by the
Simulator. It supports the full instruction set, memory spaces,
and parallel transfer fields of the DSP.
The Linker relocates and links relocatable COFF object
modules from the Assembler to create an absolute load file
which can be loaded directly into the Simulator. The Librarian
utility will merge separate, relocatable object modules into a
single file allowing frequently used modules to be grouped for
convenient linking and storing.
The assembler and linker now provide support for
assembly language source-level debugging via the simulator.
Global symbols, symbols local to sections, and even
underscore labels may be referenced with all scoping
'Supported by Graphical User Interface
Digital Signal Processors
2.1-12
Motorola Master Selection Guide
constructs intact. In addition, the assembler generates
information about included files and macros. The assembler
and linker also support numbered counters ranging from 0 to
65535.
PART NUMBERS
Simulator/Assembler/
Linker/Library
Host Machine
DSP56100CLASA'
IBM PC
DSP56100CLASB
Macintosh II (consult factory)
DSP56100CLASF'
Sun-4
PART NUMBERS
IGNU C Compiler
IHost Machine
DSP56100 Family
DSP561CCCA
IBM PC
DSP561CCCF
Sun-4
DSP561CCCH
Hewlett-Packard Series 700
DSP56000 Family
DSP56KCCA
IBM PC
DSP56KCCF
Sun-4
DSP56KCCH
Hewlett-Packard Series 700
DSP56100CLASH'
Hewlett-Packard Series 700
DSP56000CLASA •
IBM PC
DSP56000CLASB
Macintosh II (consult factory)
DSP53000 Family
DSP56000CLASF *
Sun-4
DSP563CCA
IBM PC
DSP56000CLASH *
Hewlett-Packard Series 700
DSP563CCF
Sun-4
DSP56300CLASA *
IBM PC
DSP563CCH
Hewlett-Packard Series 700
DSP56300CLASF *
Sun-4
DSP56300CLASH *
Hewlett-Packard Series 700
DSP96000CLASA *
IBM PC
DSP96000CLASB
Macintosh II (consult factory)
DSP96000CLASF *
Sun-4
DSP96000CLASH *
Hewlett-Packard Series 700
-
DSP96000 Family
IBM PC
DSP96KCCF
Sun-4
DSP96KCCH
Hewlett-Packard Series 700
C-Compiler Upgrades
'Supported by Graphical User Interface
Registered users of the earlier versions of the Motorola
OSP C compiler can upgrade to the latest GNU C compiler for
$120. To order, contact a Motorola sales representative or
distributor. Have your registration number ready.
C-Compiler Packages
A full ANSI C compliant compiler, based on GNU
technology, provides higher efficiency and implements more
than 20 major optimization techniques. It has improved in-line
assembly capability and an ANSI C preprocessor. The
package includes the C Compiler, a new COFF Assembler,
Linker, complete ANSI C Libraries, and a new C source level
debugger as well as expanded user's reference manual. The
software package is available for various host computers
listed.
Motorola Master Selection Guide
DSP96KCCA
PART NUMBERS
IGNU C Compiler
DSP56000 Family
I
2.1-13
DSP56KCCAJ
DSP56KCCFJ
IHost Machine
I
IBM PC
Sun-4
Digital Signal Processors
Digital Signal Processors
2.1-14
Motorola Master Selection Guide
The M68000 Family
.. . the Upward Compatible 8-/16-/32-Bit Microprocessor Family
In Brief ...
Page
Microprocessors ............................... 2.2-2
Embedded Controllers .......................... 2.2-5
Integrated Processors. . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-7
Coprocessors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-9
DMA Controllers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2.2-9
Network Devices ............................... 2.2-9
Data Communication Devices . . . . . . . . . . . . . . . . . .. 2.2-10
General Purpose 110 ........................... 2.2-11
Fiber Distributed Data Interface ................. 2.2-11
Development Tools ............................ 2.2-12
Support Software .. . .. .. . .. .. . .. .. . .. . .. . .. . ... 2.2-12
An MPU For All Functions
To designers of the most advanced microcomputer
systems, the Motorola M68000 Family of microprocessors
needs no introduction. Products based on its members have
become the standard for systems utilizing the UNIX
operating system and for CAD/CAM engineering
workstations. They are invading the next generation designs
of personal computers and color graphics systems, and they
find widespread implementation in multi-user/multi-tasking
applications and in small business systems. M68000 MPUs
are found in the leading products in fault-tolerant systems
requiring high performance and parallel processing, and
they are the preferred components for artificial intelligence
engines requiring large linear addressing capabilities.
Control applications include graphics, numerical controllers,
robotics, telecommunications switching and PBX voice/data
transmission.
Upward Compatibility
The M68000 MPU Family consists of a line of processors
based on a 32-bit flexible register set, a large linear address
space, a simple yet powerful instruction set and flexible
addreSSing modes. The intemal architecture of the 8-, 16-, and
32-bit MPU versions, and the common instruction set, provide
software compatibility and offer an easy upward migration path
for products requiring increasing levels of processing power.
A Host of Peripherals
A large selection of full--function peripheral chips
complements the processor family. Compatible LSI and VLSI
chips for memory management, data communications, DMA
control, network control, system interfacing, general 110 and
graphics, all simplify system design and reduce design and
manufacturing cost while improving system performance.
Motorola Master Selection Guide
2.2-1
The M68000 Family
Microprocessors
The 68K Family of Microprocessors has revolutionized virtually every segment of the electronic industry. They have set the
standard for performance while still maintaining binary software compatibility from generation to generation. The combination of
low cost and high performance (measured in $/system MIPS) makes every member of the FamiJy a price performance leader. The
M68000 Family provides the widest range of price and performance with choices from 1.6 MIPS to over 100 MIPS.
Table 1.
68000
68020
68030
68040
68060
1.6
5.5
12
35
100
-
0.25
0.5
3.5
15
16M Byte
4G Byte
4G Byte
4G Byte
4G Byte
MIPS
MFLOPS
Address Range
Data Bus
16 bit
32 bit
32 bit
32 bit
32 bit
Clock Speed (MHz)
8-16
16-33
16-50
25-40
50-66
Instruction Cache
-
256 Byte
256 Byte
4K Byte
8K
Data Cache
-
-
256 Byte
4K Byte
8K
Burst Mode
-
-
16 Byte R
16 Byte RIW
16 Byte RIW
General Purpose Registers
16
16
16
16
16
Address Modes
14
18
18
18
18
No
No
Yes
Yes'
Yes'
68881
68882
68882
On-Chip
On-Chip
On-Chip MMU
Floating-Point Solution
*Separate Instruction/Data
-
INTEGER UNIT
INSTRUCTION FETCH CONTROLLER
IA
GENERATE
INSTRUCTION
CACHE - - - , /
FETCH
'--EARLY
DECODE
r--- /'--
I
BRANCH~
INSTRUCTION
ATC
INSTRUCTION
CACHE
fl"
fl"
INSTRUCTION
BUFFER
"'7
DECODE
U
INSTRUCTION
ADDRESS
)
I
B
U
S
C
V
0
N
T
R
DECODE
FLOATINGPOINT
EA
EA
UNIT
GENERATE
GENERATE
EA
EA
EA
FETCH
FETCH
FETCH
FP
INT
INT
EXECUTE
EXECUTE
EXECUTE
INSTRUCTION EXECUTION CONTROLLER
~
INSTRUCTION
CACHE CONTROLLER
I
{}
I
<=
=:>
U
I
I
DATA
CACHE CONTROLLER
V
DATA
ATC
D
DATA
CACHE
0
I
L
L
E
R
I
CONTROL
)
DATA AVAILABLE
WRITE-BACK
II
DATA
ADDRESS
I
OPERAND END BUS
'---
Figure 1. MC68060 Block Diagram
The M68000 Family
2.2-2
Motorola Master Selection Guide
controller activity. Additionally, the integer unit is optimized for
high-level language environments. The MC68040 is
user-object--code compatible with previous members of the
M68000 Family and is specifically optimized to reduce the
execution time of compiler-generated code. The MC68040 is
implemented in Motorola's latest HCMOS technology,
providing an ideal balance between speed, power, and
physical device size.
Instruction execution is pipelined in both the integer unit
and FPU. Independent data and instruction MMUs control the
main caches and the address translation caches (ATCs). The
ATCs speed up logical-to-physical address translations by
storing recently used translations. The bus snooper circuit
ensures cache coherency in multimaster and multiprocessing
applications. The MC68040 FPU is user-object--code
compatible with the MC68882 floating-point coprocessor.
The FPU has been optimized to execute the most commonly
used subset of the MC68882 instruction set, and includes
additional
instruction
formats
for
singleand
double-precision rounding of results.
The MMUs support multiprocessing, virtual memory
systems by translating logical addresses to physical
addresses using translation tables stored in memory. Each
MMU has two transparent translation registers available that
define a one-to-one mapping for address space segments
ranging in size from 16 Mbytes to 4 Gbytes each. The
instruction and data caches operate independently from the
rest of the machine, storing information for fast access by the
execution units. Each cache resides on its own internal
address bus and internal data bus, allowing simultaneous
access to both. The data cache provides writethrough or
copyback write modes that can be configured on a
page-by-page basis.
The MC68040 bus controller supports a high-speed,
nonmultiplexed, synchronous external bus interface, which
allows the following transfer sizes: byte, word (2 bytes), long
word (4 bytes), and line (16 bytes). Line accesses are
performed using burst transfers for both reads and writes to
provide high data transfer rates.
MC68060
Superscalar 32-Bit Microprocessor
The MC68060 is fully compatible with all previous
members of the M68000 family. The MC68060 features dual
on--chip caches, fully independent demand-paged memory
management units (MMUs) for both instructions and data,
dual integer execution pipelines, on--chip floating-point unit
(FPU) and a branch target cache. A high degree of instruction
execution parallelism is achieved through the use of a full
internal Harvard architecture, multiple internal buses,
independent execution units, and dual instruction issue within
the instruction controller. Power management is also a key
part of the MC68060 architecture. The MC68060 offers a
low-power mode of operation that is accessed through the
LPSTOP instruction, allowing for full power-down capability.
The MC68060 design is fully static so that when circuits are
not in use, they do not draw power. Each unit can be disabled
so that power is used only when the unit is enabled and
executing an instruction.
Complete code compatibility with the M68000 family allows
the designer to draw on existing code and past experience to
bring products to market quickly. There is also a broad base
of established development tools, including real-time kernels,
operating systems, languages and applications, to assist in
product design. The functionality provided by the MC68060
makes it the ideal choice for a range of high-performance
computing applications as well as many portable applications
that require low power and high performance.
MC68040
Third-Generation 32-Bit
Microprocessor
The MC68040 is Motorola's third generation of M680OQcompatible, high-performance, 32-bit microprocessors. The
MC68040 is a virtual memory microprocessor employing
multiple, concurrent execution units and a highly integrated
architecture to provide very high performance in a monolithic
HCMOS device. On a single chip, the MC68040 integrates an
MC6803O--compatible integer unit, an IEEE 754--compatible
floating-point unit (FPU), and fully independent instruction
and data demand-paged memory management units
(MMUs), including independent 4K-byte instruction and data
caches. A high degree of instruction execution parallelism is
achieved through the use of multiple independent execution
pipelines, multiple internal buses, and a full internal Harvard
architecture, including separate physical caches for both
instruction and data accesses. The MC68040 also directly
supports cache coherency in multi master applications with
dedicated on-chip bus snooping logiC.
The MC68040 is an enhanced, 32-bit, HCMOS
microprocessor that combines the integer unit processing
capabilities of the MC68030 microprocessor with independent
4K-byte data and instruction caches and an on--chip FPU.
The MC68040 maintains the 32-bit registers available with
the entire M68000 Family as well as the 32-bit address and
data paths, rich instruction set, and versatile addressing
modes. Instruction execution proceeds in parallel with
accesses to the internal caches, MMU operations, and bus
Motorola Master Selection Guide
MC68030
The Second Generation 32-Bit MPU
The 030 started with a high performance 020 core and
added many performance improvement features including
increased internal parallelism, dual on--chip caches with a
burst fillable mode, dual internal data and address buses,
improved bus interface, and on--chip paged memory
management unit.
Two independent 32-bit address buses and two 32-bit
data buses allow the CPU, caches, MMU, and the bus
controller to operate in parallel, so the 030 can, for example,
simultaneously access an instruction from the instruction
cache, data from the data cache and instruction/data from
external memory.
Performance is further enhanced by on--chip instruction
and data caches. Separate 256-byte data and instruction
caches reduce the access time and increase CPU throughput
by providing data and instructions on--chip.
2.2-3
The M68000 Family
MC68030 (continued)
Overall bus requirements are reduced and multiple
processors can run more efficiently thanks to increased
bandwidth of the 030 bus, achieved by the enhanced bus
controller allowing high speed fills of both data and instruction
caches.
The on-chip paged memory management unit translates
logical address to the corresponding physical address in 1/2
the time required by the 020 and MC68851 Paged Memory
Management Unit. Pipelining permits this translation to be
performed in parallel with other functions so that no translation
time is added to any bus cycle.
MC68HC001
Low Power HCMOS 8-/16-/32-Bit
Microprocessor
The MC68HC001 provides a functional extension of the
MC68HCOOO HCMOS 16-/32-bit microprocessor with the
addition of statically selectable 8- or 16-bit data bus
operation. The MC68HC001 is object-code compatible with
the MC68HCOOO, and code written for the MC68HC001 can
be migrated without modification to any member of the
M68000 Family. This is possible because the user
programming model is identical for all members olthe M68000
Family and the instruction sets are proper subsets for the
complete architecture.
MC68020
The Original 32-Bit Performance
Standard
The MC68020, oh twenty, is the industry's leading 32-bit
microprocessor because of high performance, architecture,
ease of design-in, and long-range compatible growth path.
The 020 has a full 32-bit internal and 32-bit external,
regular, symmetrical architecture designed with the customer
in mind. It offers all the functionality of the other M68000
Family MPUs, and maintains software user-code
compatibility which controls the expense of your product
migration.
Programmers appreciate the large general purpose
register set, simple yet powerful instruction set and the many
flexible M68000 addressing modes. The unique on-chip
instruction cache helps provide burst-mode operation to 12.5
MIPS.
The 020 is the proven leader in high performance systems
in office automation, engineering workstations, fault tolerant
computers, parallel processors, telephone switching systems,
and intelligent controllers.
MC68010
A Virtual Memory Enhancement
The MC68010 offers the advantage of Virtual Memory. A
high-speed loop mode operation executes tight software
loops faster to enhance performance. Its instruction
continuation feature has made it the choice for fault-tolerant
and parallel processing systems. The MC68010 can support
a governing operating system which handles the supervisory
chores of any number of subordinate operating systems.
MC68HCOOO
A Micropower Alternative
HCMOS design gives the MC68HCOOO all the functions
and performance of its MC68000 predecessors . . . at
one-tenth of the operating power requirements. With a
maximum power dissipation of only 0.175 watts, the
MC68HCOOO is ideal for high-performance computer
peripherals, industrial controllers, instrumentation and
communications equipment.
The M68000 Family
2.2-4
MC68000
The 16-Bit Foundations
As the first member of the M68000 family, the stateof-the-art technology and advance circuit design concepts
of the MC68000 16-bit MPU started a new trend in
microprocessor architecture. Its seventeen 32-bit data and
address registers permit rapid internal execution of its
powerful yet simple instruction set. It is designed for large
multiprocessing systems and realUme applications with
vectored interrupts, seven priority levels and a 16 megabyte
linear addressing space. It offers mainframe--like performance,
supporting high-level languages and sophisticated operating
systems.
The MC68000 MPU has been joined by more advanced
products with even greater capabilities, yet it satisfies a large .
segment of the existing applications. It is extremely cost
competitive and it remains one of the major growth products
in the entire MPU line.
MC68008
An 8-Bit Compatible Competitor
With an 8-bit data bus and 32-bit internal architecture, the
MC68008 offers performance that competes with a number of
16-bit MPUs. It has the same register set, same instructions,
and the same functionality as the MC68000 with extensive
exception processing. Large modular programs can be
developed and executed efficiently because of the large,
1-megabit non-segmented, linear address space. It is the
choice for high performance, cost effective, 8-bit deSigns,
particularly those requiring a migration path to 16-bit or full
32-bit operation.
Motorola Master Selection Guide
Embedded Controllers
The principle elements of this popular microprocessor family have now been redesigned specifically for embedded applications.
The new 68 ECOxO family including the 68ECOOO, EC020, EC030 and EC040 MPUs are all optimized for cost-sensitive embedded
control designs. The 68ECOxO family offers the high performance of the 680xO family, yet streamlines the feature sets for
embedded applications. The 68ECOxO family completes the triad forming the M68000 family of compatible products: the 680xO
family of computer-class central processing units; the 68300 family of integrated processors; and now, the 68ECOxO family of
embedded microprocessors.
Table 2.
MIPS
Address Range
Data Bus
Clock Speeds
68ECOOO
68EC02O
68EC030
2.5
6.5
10.7
68EC040
29
16M Byte
16M Byte
4G Byte
4G Byte
16 bit
32 bit
32 bit
32 bit
8,10,12,16 MHz
16,25 MHz
25,40 MHz
20, 25, 33* MHz
-
256 Byte
256 Byte
4K Byte
-
256 Byte
4K Byte
Instruction Cache
Data Cache
Burst Fill Caches
-
-
16 Bytes
16 Bytes
General Purpose Registers
16
16
16
16
Address Modes
14
18
18
18
68881168882
68881168882
68881168882
68040
PLCC
PPGA, PQFP
PPGA, CQFP
PGA, CQFP*
Floating Point Hardware
Packages
* Available in the future
This impressive performance is a result of a six-level
pipelined integer unit, independent four-way set-associative
instruction and data caches, and a very high level of on-chip
parallelism. The EC040 also supports multi master and
multiprocessor systems with bus snooping.
By integrating all these features into the EC040, the
microprocessor is able to perform the vast majority of work
on-chip, limiting external memory accesses to allow for higher
system performance with less expensive DRAMs. The result
is virtual immunity to the effects of memory wait states.
MC68EC040
32-Bit High-Performance
Embedded Controller
The 68EC040 is the newest addition to Motorola's
embedded microprocessor family. It is the performance leader
for top-of-the-line embedded applications. The EC040 is
capable of delivering 29 MIPS of sustained performance at 1.2
cycles per instruction with a system cost that is unattainable
by competing architectures.
Motorola Master Selection Guide
2.2-5
The M68000 Family
Embedded Controllers (continued)
MC68EC030
MC68EC020
32-Bit Enhanced Embedded
Controller
32-Bit Embedded Controller
The MC68EC030 is a 32-bit embedded controller that
streamlines the functionality of an MC68030 for the
requirements of embedded control applications. The
MC68EC030 is optimized to maintain performance while
using cost-effective memory subsystems. The rich instruction
set and addressing mode capabilities of the MC68020,
MC68030, and MC68040 have been maintained, allowing a
clear migration path for M68000 systems. The MC68EC030
is object-code compatible with the MC68020, MC68030, and
earlier M68000 microprocessors. Burst-mode bus interface is
provided for efficient DRAM access.
The MC68EC030 has an on--chip data cache and on-chip
instruction cache with 256 bytes each. Dynamic bus sizing is
available for direct interfacing to 8-, 16-, and 32-Bit Devices.
The MC68EC030 includes 32-bit nonmultiplexed address
and data buses, sixteen 32-bit general-purpose data and
address registers, and two 32-bit supervisor stack pOinters
and eight special-purpose control registers. The EC030
provides complete support for coprocessors with the M68000
coprocessor interface. There are two access control registers
that allow blocks to be defined for cacheability protection. The
pipelined architecture, along with increased parallelism,
allows internal caches accesses in parallel with bus transfers
and overlapped instruction execution. The enhanced bus
controller supports asynchronous bus cycles (three clocks
minimum), synchronous bus cycles (two clocks minimum),
and burst data transfers (one clock).
The M68000 Family
2.2-6
The 68EC020, with a complete 32-bit intemal
implementation, has a 32-bit data bus and an on--chip instruction
cache to provide dramatically increased performance over 8and 16-bit microprocessors. In addition, upward migration to
the EC020 is made simple with dynamic bus sizing, allowing
8, 16 and 32-bit peripherals to communicate with the
microprocessor.
Other performance features include advanced bit
manipulation capabilities that provide multiple bit shift operations
in a single instruction cycle. This capability greatly simplifies
and accelerates the bit operations required in graphics
processing and optical recognition applications.
MC68ECOOO
Low-Powered HCMOS
Embedded Controller
The 68ECOOO is a low-power HCMOS derivative of the
68000 optimized for cost-effective embedded processing.
The ECOOO has a flexible data bus that can operate in either
8- or 16-bit modes and a 24-bit address bus that provides
16 Mbytes of memory addressing capability. Electrical
characteristics of the 68ECOOO have been optimized to
ensure easy access to low--cost memories.
The 68ECOOO represents the lowest cost entry point to any
32-bit architecture. Coupled with efficient support for
high-level languages and real-time operating systems, the
68ECOOO provides unparalleled compatible migration paths to
higher performance.
Motorola Master Selection Guide
Each member of the 68300 family contains a core
processor based on the 68000 family, a System Integration
Module (SIM), an on--chip bus and various peripheral
modules. The SIMs include support circuitry such a clock
generation, external chip selects, system protection, timers
and JTAG. The on--chip intermodule bus (1MB) on the
CPU-based 68300s creates a standard interface over which
the CPU and each of the modules communicate. The
peripheral modules include specialized processors, system
controllers, traditional peripherals and memory. Because the
peripheral modules are independent from each other, they can
appear in multiple 68300 devices. With so many major
features incorporated into a single 68300 device, a system
designer can realize improved reliability along with significant
savings in design time, power consumption, cost, board
space, pin count and program development. In a 68300
device, the major functions and glue logiC are all properly
connected, internally timed with the same fast clock, fully
tested and consistently documented.
Integrated Processors
Powerful solutions to cost-, space-, and power-sensitive
embedded applications are provided by the 68300 family of
integrated microprocessors and microcontrollers. The 68300
family combines two of Motorola's greatest strengths - the
32-bit microprocessor architecture of the 68000 family and a
proliferation of peripheral circuits offering a growing family of
integrated solutions.
The 68000 family is based on a proven, expandable
architecture that spans the performance range from 1 to over
29 MIPS. This architecture offers the industry's highest level
of compatibility for both hardware and software. Motorola's
single-chip microcomputers and microcontrollers provide the
industry's broadest selection of peripheral combinations,
insurance that one will fit the need of practically any
application. The 683000 family embraces both of these
concepts.
Table 3
68302
68306
68330
68331
68332
68333
68334
68340
Core Processor
68000
680ECOO
CPU32
CPU32
CPU32
CPU32
CPU32
CPU32
Speeds (MHz)
16,20
16
16,25
16
16
16
16
16,25
DMA
Yes
-
-
-
-
-
Serial Processor
Yes
-
-
-
-
-
Time Processor Unit
-
-
-
-
Yes
Yes
Flash EEPROM
-
-
-
-
-
64K
Yes
Yes
Yes
Yes
-
Yes
Yes
Yes
Timers
1
-
-
1
-
-
AID Converter
-
-
-
-
-
Yes
Yes
1K
Serial 1/0
SRAM
1K
-
-
-
2K
4K
DRAM Controlier
-
Yes
-
-
-
-
Glue Logic (SIM)
Yes
Yes
Yes
Yes
Yes
Yes
-
-
-
-
-
-
3.3 Volts Available
2
Yes
Yes
Yes
combination of architectural and programmable features
concurrent operation of different protocols (HDLC/SDLCTM,
UART, BISYNC, DDCMpTM, or transparent modes) can easily
be achieved. Data concentrators, modems, line cards,
bridges, and gateways are examples of suitable applications
for this device.
The IMP is a Complementary Metal-Oxide Semiconductor
(CMOS) device conSisting of an M68000/MC68008
microprocessor core, a system integration block (SIB), and a
Communications Processor (CP). By integrating the
microprocessor core with the serial ports (in the CP) and the
system peripherals (in the SIB), the IMP is capable of handling
complex tasks such as all ISDN basic rate (2B+D) access
tasks.
MC68302
Integrated Multiprotocol Processor
The MC68302 integrated multiprotocol processor (IMP) is
a very large-scale integration (VLSI) device incorporating the
main building blocks needed for the design of a wide variety
of controllers used in the communications industry. The IMP
is the first device to offer the benefits of a closely coupled,
industry-standard M68000/MC68008 microprocessor core
and a flexible communications architecture. The
three--channel communications device may be configured to
support a number of popular industry interfaces, including
those for the Integrated Services Digital Network (!SDN) basic
rate and terminal adaptor applications. Through a
Motorola Master Selection Guide
Yes
2.2-7
The M68000 Family
Integrated Processors (continued)
storage RAM and dual time bases. In addition to the TPU and
CPU32, the 68332 features the QSM, a 81M and 2-Kbytes of
standby static RAM.
MC68306
Integrated 68ECOO Processor
The 68306 integrated ECOOO processor includes many of
the features commonly found in 68000-based designs. The
68306 includes a 68ECOOO core processor, a 68681 Dual
Universal Asynchronous Receiver Transmitter (DUART),
system integration functions, and a DRAM controller. The
on-chip DRAM controller gives the 68306 the family's
simplest interface to DRAM-based designs. The DRAM
controller easily accommodates 64 Mbytes of memory. The
68306 saves time in the design cycle by providing valuable
68000 system components pre-packaged in one chip.
MC68330
Integrated CPU32 Processor
The 68330 is ideal for applications requiring 32-bit
microprocessor performance without the additional expense
inherent in 32-bit memory systems. The 68330 is the simplest
and lowest priced member of the CPU32-based 68300 family.
The 68330 allows the designer access to the high
performance of the CPU32 along with minimized external glue
logic, while allowing the greatest freedom in selecting needed
peripherals, ASICs or gate arrays.
MC68331
32-Bit Microcontroller
32-Bit Microcontroller
The 68F333 provides the highest level of integration
available to high-performance timing applications such as
avionics and automotive engine control. The 68F333 contains
the CPU32, the TPU and the QSM. It also adds two banks of
flash EEPROM totaling 64-Kbytes, a total of 4-Kbytes of
SRAM (512 bytes separately powered) and an 8-channel,
10-bit analog-to-digital converter. The Single-Chip
Integration Module (SCIM) allows 18 of the external address
and data pins to be converted to I/O pins, resulting in a
single-chip solution suitable for many applications.
MC68334
32-Bit Microcontroller
The 68334 is a streamlined version of the 68332, taking
advantage of the powerful TPU. The 68334 includes the
CPU32 core processor, the TPU, a SIM, 1-Kbyte of SRAM, a
1Q-bit analog-to-digital converter and up to 47 discrete I/O
lines.
MC68340
The 68331 is well suited to applications requiring simple
serial communications and general timing needs. The 68331
contains the CPU32, a SIM, a General Purpose Timer (GPT)
and a Queued Serial Module (QSM). The general purpose
timer is a simple yet flexible timer that provides four modes of
operation with multiple channels for some operations. The
QSM provides two modes of communication: an
asynchronous channel that provides up to 524-Kbits per
second transfer rate and a serial peripheral interface with
separate 16-word receiveitransmit queues.
MC68332
32-Bit Microcontroller
The 68332 is especially suited for high-performance timing
applications such as automotive engine control, precision
motor control and industrial robotics. The powerful Time
Processor Unit (TPU) distinguishes the 68332 providing
optimum performance in controlling time-related activity. It
drastically reduces the need for CPU intervention with its
dedicated execution unit, tri-level prioritized scheduler, data
The M68000 Family
MC68F333
2.2-8
Integrated Multiprotocol Processor
with DMA
The 68340 is excellent for applications requiring
high-speed or block data transfers, such as disk drives and
navigation systems. The combination of general peripherals
and the extremely low power consumption possibilities of the
68340 make it ideal for many battery powered, portable
applications such as hand held computers and data
acquisition systems.
The most distinguishing 68340 feature is the high speed
two channel, 32-bit Direct Memory Access (DMA) controller.
Incorporating the CPU32 and DMA on the same chip
eliminates the usual bus arbitration and synchronization
delays, maximizing data throughout (25-Mbytes per second
on a 16-bit bus).
In addition to the CPU32, a SIM and the DMA, the 68340
contains a 68681/2681-compatible DUART. The 68340 also
has two identical, versatile counter/timers, each with a 16-bit
counter and an 8-bit prescaler with 80 ns resolution.
Motorola Master Selection Guide
Coprocessors
MC68440
MC68851
Dual Direct Memory Access
Controller, DDMA
Paged Memory Management Unit,
PMMU
The DDMA complements the performance capabilities of
M68000 microprocessors by moving blocks of data in a quick,
efficient manner with a minimum of intervention from the MPU.
The DDMA performs memory-to-memory, peripheral-to-memory, and memory-to--peripheral transfers through each
of two completely independent DMA channels. The DDMA
also offers two interrupt vectors per channel and supports both
8-bit and 16-bit data transfers.
The PMMU is a 32-bit memory manager which provides
full support for a demand paged virtual environment with the
68010 or MC68020. It supports a 4-gigabyte addressing
space when used as a coprocessor with the MC68020. An
on-chip address translation cache minimizes translation
delays and maximizes system performance.
MC68881
Network Devices
A Floating Point Coprocessor
MC68824
Designed specifically for arithmetic expansion of the
MC68020 MPUI, this powerful coprocessor can also be used
as a peripheral to all other M68000 family members, and with
non-M68000 processors as well. It performs floating point
math calculations in strict conformance to a full implementation
olthe IEEE Standard for Binary Floating Point Arithmetic (754)
and, in addition to the basic add, subtract, multiply, and divide
functions, it handles full selection of transcendental and
non-transcendental operations. These operations include
root values,
trigonometric functions,
exponentials,
hyperbolics, and logs. All functions are calculated to 80 bits of
extended precision in hardware.
Token Bus Controller, TBC
The TBC is the industry's first single--chip VLSI device to
implement the IEEE 802.4 Media Access Control Sublayer of
the ISO Data Link Layer, as specified by General Motors
Manufacturing Automation Protocol, MAP. The TBC supports
serial data rates of 1, 5, and 10 Mbps and relieves the host
processor of the frame formatting and token management
functions. For efficient transfer of data frames, to and from
memory, the TBC features an on--chip four--channel DMA with
bus master capability, a 32-bit address range, an 8- or 16-bit
data bus, and a 4O-byte FIFO. The MC68824 also offers
support options for network bridges, real-time support and
network monitoring services.
MC68882
MC68184
Enhanced Floating Point
Coprocessor
Broadband Interface Controller
The MC68882 is pin-to-pin hardware and software
compatible with the MC68881 Floating Point Coprocessor and
implements a variety of performance enhancements including
dual-ported registers and an advanced pipeline. Additional
circuitry allows execution of multiple instructions in parallel for
more than twice the Floating Point performance of the
trail-blazing MC68881. Where higher performance
requirements indicate, the MC68882 is a drop-in replacement
for the MC68881.
The MC68184 Broadband Interface Controller (BIC) is a
high--performance interface device for use with the MC68824
Token Bus Controller (TBC) to implement the digital portion of
the physical layer of a broadband IEEE 802.4 token bus node.
The BIC manipulates both data and control for RF transmitter
circuitry and RF receiver circuitry. The CMOS BIC supports
data rates up to 10 Mbps using a duo-binary modulation
technique and provides 20 lines for receiverltransmitter
control with 13 user-defined outputs.
The BIC performs the digital functions of the physical layer
when implementing a broadband token bus node. The modem
side of the BIC provides data and control for the RF
transmitter/receiver circuitry. A standard serial interface is
used to connect the BIC to the MC68824 TBC. The TBC
performs the media access control (MAC) function. The
MC68184 has the ability to scramble and descramble data.
DMA Controllers
MC68450
DMA Controller, DMAC
The DMAC maintains high-performance data movement
for complex M68000 MPU-based systems. While pin
compatible with the MC68440 DDMA, the DMAC offers four
completely independent DMA channels. In addition to all the
features of the DDMA, the DMAC also provides very
sophisticated manipulation of data through sequential and
linked array--chained addressing capabilities.
Motorola Master Selection Guide
MC68185
Twisted-Pair Modem
The MC68185 Twisted-Pair Modem (TPM) is used in
conjunction with a MC68824 Token Bus Controller (TBC), an
RS485 transceiver, and a twisted--pair media to implement a
2.2-9
The M68000 Family
Network Devices: MC68185 -
Twisted-Pair Modem (continued)
low--cost area network (LAN). The MC68824 TBC implements
the layer 2 media access control (MAC) portion of the IEEE
802.4 LAN station and receiver portion for the IEEE 802.2
logical link control (LLC) type 3 as well as providing support for
LLC type 1 and type 2. The TPM interfaces directly to the TBC,
providing physical layer management, including MAC symbol
encoding/decoding at data rates up to 2 Mbps.
The TPM contains an 32 kHz to 20 MHz on--chip crystal
oscillator that generates a transmit clock without external
circuitry. The physical layer management includes local
loopback mode, transmitter enable, and reset. An on-Chip
digital filter provides for noise reduction of received data.
MC68194
X.2S Protocol Controller, XPC
The XPC implements the 1984 CCITT X.25
Recommendation Data Link Procedure (level 2) LAPB. In
addition to handling the lower level communications functions
(HDLC framing, CRC generation/checking, and zero
insertion/deletion), the XPC also independently ha.ndles
higher level communications functions (frame sequencing,
retransmission, flow control, retries limit and timeout
conditions). This allows the host to operate almost totally
isolated from the task of ensuring error-free transmission and
reception of data.
MC68606
Carrierband Modem
The bipolar LSI MC68194Carrierband Modem (CBM),
when combined with the MC68824 Token Bus Controller
(TBC) , provides an IEEE 802.4 single-channel,
phase-coherent carrierband, Local Area Network (LAN)
connection. The CBM performs the physical layer function,
including symbol encoding/decoding, signal transmission and
reception, and phYSical management.
The CBM provides the three basic functions of the physical
layer: data transmission to the coaxial cable, data reception
from the cable, and management of the physical layer. For
standard data mode (also called MAC mode), the CBM
receives a serial transmit data stream from the TBC (called
symbols or atomic symbols), encodes, modulates the carrier,
and transmits the signal to the coaxial cable. Also in the data
mode, the CBM receives a signal from the cable, demodulates
the Signal, recovers the data, and sends the received data
symbols to the TBC. End-of-transmission receiver blanking
as required by IEEE 802.4 is supported. Communication
between the TBC and CBM is through a standardized serial
interface consistent with the IEEE 802.4 DTE-DCE interface.
MC68195
Multi-Link LAPD Controller CCITT
Q.920/Q.921, LAPD
The MC68606 Multi-link LAPD (MLAPD) Protocol
Controller fully implements CCITT Recommendation
0.920/0.921 Link Layer Access Procedure (LAPD) protocol
for ISDN networks. The MLAPD is designed to handle both
signalling and data links in high-performance ISDN primary
rate applications.
This VLSI device provides a cOst-effective solution to
ISDN link-level processing with simultaneous support for up
to 8K logical links. The MC68606 is an intelligent
communications protocol controller compatible with AT&T
specifications for ISDN devices and features low power
consumption and high performance, with an aggregate data
rate in excess of 2.048 Mbps.
Data Communication Devices
MC68681
MC2681
Dual Universal Asynchronous
ReceiverlTransmitter, DUART
Local Talk Adaptor
The MC68195 LocalTalk adaptor (LA) is used in
conjunction with the MC68302 Integrated Multiprotocol
Processor (IMP) to build a network interface to LocalTalk™,
also known as AppleTalk™. LocalTalk refers to the 230.4-kbps
Local Area Network (LAN) that connects multiple Maclntosh™
computers and printers.
The LA provides LocalTalk support for any twp of the three
IMP serial channels. Combinations of multiple LA and/or IMP
devices may be used to support additional LocalTalk
channels. Non-LocalTalk applications can use the LA device
with the IMP to build proprietary HDLC-based LANs at up to
2.5 Mbps using bi-phase space (FMO) encoding.
The M68000 Family
MC68605
2.2-10
The MC68681 features two completely independent
full-duplex asynchronous receiver/transmitter channels that
interface directly to the M68000 microprocessor bus.
Receiver data registers are quadruple buffered and
transmitter data registers are double buffered for minimum
MPU intervention. Each has its own independently selectable
baud rate. Multifunction 6'-bit input port and 8-bit output port,
a 16-bit programmable counter/timer, interrupt handling
capabilities, and a maximum one-megabyte per second
transfer rate make the DUART an extremely powerful device
for complex data communication applications. Full device
functionality with an M6800 bus interface is provided by the
MC2681.
Motorola Master Selection Guide
General Purpose 1/0
MC68230
Parallel InterfacelTimer, PIIT
The PlfT provides versatile double-buffered parallel
interfaces and a system--oriented timer for M68000 systems.
The parallel interfaces operate either in a unidirectional or
bidirectional mode, either 8-- or 16--bit wide. The timer is 24
bits with full programmability and a 5-bit prescaler. The PlfT
has a complete M68000 bus interface and is fully compatible
with the MC68450 DMAC.
MC68901
Multifunction Peripheral, MFP
The MFP provides basic microcomputer function
requirements as a single companion chip to the M68000
Family of Microprocessors. Features provided via a direct
M68000 system bus interface include a full-function,
single--channel
Universal
Serial
Asynchronous
ReceiverfTransmitter (USART) for data communication, an
8--source interrupt controller, eight parallel I/O lines, and four
8--bit timers.
Fiber Distributed
Data Interface
Fiber Distributed Data Interface (FDDI) is defined as a dual
fiber-optic token ring LAN (Local Area Network) that can
support rates up to 100 Mbps. It can accommodate rings with
1,000 stations. Two kilometers between stations, and up to
200 kilometers in total length. This technology is driven by the
need to support high performance distributed computer
systems which are becoming faster and more powerful, thus
imposing a greater need for network speed and bandwidth.
Other uses for FDDI include backbone networks connecting
Ethernet, Token Bus, and Token Ring segments and back end
networks connecting high-speed peripherals. FDDI is an
American National Standards Institute (ANSI) standard.
Motorola's FDDI chip set includes the MC68836, MC6883?,
MC68838, and MC68839.
MC68836
FOOl Clock Generator
The MC68836 FDDI Clock Generator (FCG) implements
part of the Physical Layer (PHY) functions of the FDDI
standard including clock recovery, data recovery, and NRZI
Motorola Master Selection Guide
2.2-11
conversions. The FCG also does a five-bit parallel to serial
conversion during transmission, and a serial to five-bit parallel
conversion during reception. The FCG uses the five-bit
parallel interface to communicate with the MC6883? device.
The FCG directly connects to fiber optic modules through
differential driver/receiver pins. Features include full duplex
operations, 125 MHz clock recovery from incoming serial
NRZI data stream, and 125 MHz transmit clock generation.
MC68837
Elasticity Buffer and Link Manager
The Elasticity Buffer and Link Manager (ELM) implements
the remaining of the PHY functions of the FDDI standard
including data framing, elasticity buffer, encoding, decoding,
smoothing, line state detection, and repeatfilter. The ELM also
implements some Station Management (SMT) functions such
as the Connection Management (CMT), PhYSical Connection
Management (PCM), Physical Connection Insertion (PCI),
and Link Error Monitor (LEM).
MC68838
Media Access Controller
The Media Access Controller (MAC) implements the MAC
portion of the FDDI standard. The MAC protocol is the lower
sub-layer of the ISO OSI data link layer and provides for fair
and deterministic sharing of the phYSical medium, address
recognition, frame check sequence generation and
verification, frame insertion, frame repetition, frame removal,
token generation, and certain error recovery procedures.
Features on the MC68838 include independent receive and
transmit data paths and state machines, bridging support
including a bit order reversal option, a count and void frame
bridge stripping algorithm, and CRC appendage on a per
frame basis. The MAC also contains an interface to Content
Addressable Memory (CAM) for individual and multicast
address recognition.
MC68839
FOOl System Interface
The FDDI System Interface (FSI) is a high performance
interface device which can easily connect to any bus including
high speed processors, little- and big--endian busses, and
multiplexed/non-multiplexed address data busses. Its
primary purpose is to interface the FDDI protocol devices to
the user system bus. FSI features include support for a ring
buffer structure, addressing flexibility, programmable
partitioned 8K bytes internal RAM for temporary data storage,
two 32-bit ports, the ability to sustain up to 250 j.1S bus
latencies, support for synchronous and asynchronous frames,
and the ability to chain multiple buffers per frame.
The M68000 Family
Development Tools
Application Development System
The M68302AOS is a stand-alone board developed by
Motorola that includes software modules (driver code, LAPB,
LAPO, and X.25), a real-time kernel, and a monitor/debugger.
The board consists of the MC68302, memory (512K bytes of
RAM expandable to 1M bytes, 256 bytes of EPROM and
EEPROM), and an MC68681 OUART (to allow all MC68302
serial ports to be available to the user). It is an inexpensive,
ideal platform for software development and testing.
M68ECOxOlDP
Evaluation Boards for Embedded
Controllers
The M68000 family lOP is a board set designed to provide
a low-cost evaluation platform, yet flexible environment for
developing both software and hardware for the family
products. The platform provides the means for M68000
microprocessor and tool evaluation which enables users to
properly select the microprocessor and associated tools for
their next application. Because the turnkey development
system requires the user to do very little to power up the
system and begin development, significant time savings is
realized by reducing the overall time that the product takes to
get to market.
The lOP consists of an M68000 Family microprocessor--based
CPU module as well as a generic lOP motherboard designed
to support each CPU module. The lOP also includes two
software debug monitor programs: Integrated Systems'
ROM68J(TM and Intermetrics' SmartROMTM. This configuration
allows the user to take advantage of an entire suite offeatures,
including
tracing,
assembling,
disassembling
and
downloading, that are offered by the monitors. Optional
software is available to expand the development environment
of the lOP by allowing the user to design, debug and evaluate
the M68000 microprocessor-based applications in real-time
and non-real-time operating system environments. The lOP
also functions as a tool for final test or fault analysis of user
target systems.
The lOP only requires a user-supplied power supply and
an R8-332 ASCII terminal or host computer with an RS-232
serial port. Although the lOP will function using a terminal, the
preferred communication device is a host computer.
Operating the lOP with a host computer allows the user to
develop, compile and debug code using one of many optional
software tools. Once code is developed, the program can be
saved and downloaded to the lOP from the host computer.
M68340EVS
Evaluation System
The M68340EVS is an inexpensive three-board
evaluation and development system which allows the user to
design, debug and evaluate 6834D-based applications. It
interfaces easily to traditional emulation tools and includes its
own software debugger.
Support Software
M68KESW-PC1
M68040FPSP
This Intermetrics software package is for the 68K Family
(68000, 68008, 68HC001, 68010, 68020, 68030, 68EC030,
68040, 683xx). The M68KESW InterTools package includes
C compiler, assemblerllinker, run-time libraries, and one year
of support from Intermetrics.
This software provides 68040 floating point emulation of
unimplemented 68881/68882 functions. Contact factory for
license agreement.
Table 4. Selector Guide
Device Number
MC68000
Package
Speeds
Device Type
64-Lead L', P
68-Lead R, RC', FN
8,10,12,12F'
8,10,12,12F'
Microprocessor
MC68ECOOO
68-LeadFN
8, 10, 12, 16
Embedded Controller
MC68HCOOO
6Head P
68-Lead R, RC', FN
68--Lead FC
8,10,12, 12F', 16
8,10,12,16
8,10,12,16
Microprocessor
MC68l-1cOOl
68--lead R, RC',FN
8,10,12,16
MC68008
48-Lead P
52-Lead FN
8, 10
8, 10
Microprocessor
MC6801 0
64-LeadP
68--Lead R, RC', FN
8,10,12
8,10,12
Microprocessor
.
Not recommended for new deSIgn
All package/speed combinations may not be valid - consu~ factory to verify
The M68000 Family
2.2-12
Motorola Master Selection Guide
Table 4. Selector Guide (continued)
Device Number
MC68020
Package
Speeds
Device Type
114-Lead RC
132-Lead FE'
114-Lead RP
132-Lead FC
12,16,20,25,33
16,20,25
16,20,25
16,20,25
Microprocessor
10D-Lead FG, RP
16,25
Embedded Controller
MC68030
128-Lead RC
124-Lead RP
132-Lead FE
16,20,25,33,40,50
16,20,25,33
16,20,25,33
Microprocessor
MC68EC030
124-Lead RP
132-Lead FE
25,40
25,40
Embedded Controller
MC68040
179--Lead RC
25,33,40
Microprocessor
MC68EC040
179-Lead RC
184-Lead FE
20,25,33
20,25
Embedded Controller
MC68LC040
179-Lead RC
184-Lead FE
20,25,33
20,25
Microprocessor
MC68EC020
MC68040V
184-Lead FE
25,33
Microprocessor
MC68060
223-LeadRC
TBD-Lead FE
50,66
50,66
Microprocessor
MC68184
4D-Lead P, L
-
Network
MC68185
44-Lead FN
68-Lead RC
-
Network
MC68194
52-Lead FJ
-
MC68195
44-Lead FN
-
Network
MC68230
48-Lead P
52-Lead FN
8, 10
8, 10
General Purpose I/O
MC68302
132-Lead RC, FE, FC, FD
16,20
Integrated Processor
MC68306
128-Lead FC
132-Lead FG
16
16
Integrated Processor
MC68330
132-Lead FC
16,25
8,16 @3.3V
Integrated Processor
Network
MC68331
132-Lead FC
16
Integrated Processor
MC68332
132-Lead FC
16
Integrated Processor
MC68340
144-Lead FE
145-Lead RP
16,25
16,25
Integrated Processor
MC68340V
144-Lead FE
145-Lead RP
8,16 @3.3V
8,16@3.3V
Integrated Processor
MC68360
24D-Lead FC
241-Lead RC
0-25
0-25
Integrated Communication
Controller
MC68440
68-Lead L, P
68-Lead R, FN
8,10
8,10
DMA Controller
MC68450
68-Lead L, P
68-Lead R, FN
8,10
8, 10
DMA Controller
MC68605
84-Lead R, RC
84-Lead FN
10,12,16
10,12,16
Network
MC68606
84-LeadRC
84-Lead FN
12, 16
12,16
Network
'I< Not recommended for new design
All package/speed combinations may not be valid - consult factory to verify
Motorola Master Selection Guide
2.2-13
The M68000 Family
Table 4. Selector Guide (continued)
Package
Speeds
Device Type
MC2681
Device Number
40--lead P, L'
44-LeadFN
-
Data Communication
MC68681
4Q-Lead P, L'
44-Lead FN
-
-
Data Communication
MC68824
84-Lead R, RC
84-Lead FN
10,12,16
10,12,16
Network
MC68836
52-LeadFN
MC68837
12Q-LeadKB
12Q-Lead FC
MC68838
120--lead KB
12Q-Lead FC
MC68839
-
-
-
Fiber Distributed Data
Interface
Fiber Distributed Data
Interface
-
Fiber Distributed Data
Interface
184-LeadRC
184-Lead FE
-
Fiber Distributed Data
Interface
MC68851,
132-Lead RC
12,16,20
CoProcessor
MC68881
68-Lead RC, FN
12,16,20
CoProcessor
MC68882
68-Lead RC
68-LeadRN
16,20,25,33,40,50
16,20,25,33,40
CoProcessor
MC68901
48-Lead P
52-Lead FN
-
Genera(Purpose I/O
FC = Plastic Quad (Gull Wing)
FN = Plastic Quad Pack (PLCC)
P = Plastic DIP
FD = Plastic Quad w/Molded Carrier Ring
KB = Ceramic PGA w/Ceramic Lid
R = Pin Grid Array, Solder Lead Finish
FE = Ceramic Quad (Gull Wing)
L = Ceramic DIP
RC = Ceramic PGA, Gold Lead Finish
FG = Plastic Quad Flat Pack (PQFP)
LC = Ceramic DIP, Gold Lead Finish
RP = Plastic Pin Grid Array
• Not recommended for new design
All package/speed combinations may not be valid - consu~ factory to verify
The M68000 Family
2.2-14
Motorola Master Selection Guide
The M88000 RiSe Family
In Brief ...
Page
Architecture, Performance,
and Software Compatibility ..................... . 2.3-2
Microprocessors .............................. . 2.3-2
Cache/Memory Management Units .............. . 2.3-3
Motorola's 88000 Family comes from the only company
committed to long-term upward software compatibility
through such features as hardware interlocked and
protected pipelines. Our goal is to make sure each
generation of the 88000 RISC family delivers a high
performance level while maintaining software compatibility.
Motorola Master Selection Guide
2.3-1
The M88000 RiSe Family
Motorola's 88000 RiSe Microprocessors
... a performance architecture
Architecture, Performance, and
Software Compatibility
The 88000 RISC was designed from the start for
superscaler implementations. In fact, the design of the second
generation 88110 microprocessor is a unique superscaler
implementation called Symmetric Superscalar™. The
Symmetric Superscaler design allows you to execute multiple
instructions in a single clock cycle without any restrictions on
instruction ordering. So there are no wait states or
performance penalties because of out of order instructions.
Also, while other RISC microprocessors may be limited in
the instructions they can execute in a single clock cycle,
members of the 88000 are able to execute multiple
instructions per clock cycle, thus providing the performance
edge required for next generation system designs.
Performance Plus Software
Compatibility
Although high performance is recognized as a key feature
for systems design, software compatibility is also important.
Motorola's 88000 Family comes from the only company
committed to long term upward software compatibility through
such features as hardware interlocked and protected
pipelines. Our goal is to make sure each generation of the
88000 RISC family delivers a high performance level while
maintaining software compatibility. This gives the opportunity
for designing one of the industry's highest performance
systems, while leveraging your largest dollar investment in
new systems, your software.
Software compatibility is also promoted through standards
to provide an open systems environment benefitting system
companies, software developers, and end users because
88000 based systems from different vendors will run all of the
same software.
Microprocessors
MC88100RC
32-Bit RISC Microprocessor
The MC881 00 is the first processor in the 88000 Family of
RISC (reduced instruction set computer) microprocessors.
Implemented with Motorola's HCMOS technology, the
MC88100 incorporates 32-bit registers, data paths, and
addresses. In designing the MC881 00, Motorola has
incorporated a high degree of fine-grain parallelism; four
independent execution units maintain separate, fully
concurrent execution pipelines. Most instructions operate in
one machine cycle or effective concurrent execution can be
accomplished through internal pipelines in one machine cycle.
The M88000 RiSe Family
2.3-2
A common register file provides data sharing and
synchronization control among the execution units through
register scoreboarding.
The MC88100 addresses a variety of applications
reqUiring
high operational
speeds
and
effiCient,
fast-execution architectures. All data manipulation
instructions are nondestructive register to register or register
with immediate operations, allowing both fast operand access
and operand reuse. IEEE 754 floating-point arithmetic is
supported in the processor. Instruction and data memory
space are accessed through separate memory ports, allowing
simultaneous access to dedicated memory areas. The 88000
Family includes the MC88200 CMMU (cache/memory
management unit), which adds high-speed memory caching,
two-level, demand-paged memory management, and
support for shared-memory multiprocessing. The 88000
Family also includes a full line of highly optimizing compilers,
operating systems, development boards, and development
tools.
MC88110RC
32-Bit RISC Microprocessor
The MC8811 0 is the second implementation of the 88000
family of reduced instruction set computer (RISC)
microprocessors. The MC88110 is a Symmetric Superscalar
machine capable of issuing and retiring two instructions per
clock without any special alignment, ordering, or type
restrictions on the instruction stream. Instructions are issued
to multiple execution units, execute in parallel, and can
complete out of order, with the machine automatically keeping
results in the correct program sequence. The SymmetriC
Superscalar design allows sustained performance to
approach the peak performance capability.
The MC88110 uses dual instruction issue and simple
instructions with extremely rapid execution times to yield
maximum efficiency and throughput for 88000 systems.
Instructions either execute in one clock cycle, or effective one
clock cycle execution is achieved through internal pipelining.
Ten independent execution units communicate with a general
register file and an extended register Ii Ie through multiple
80-bit internal buses. Each of the register files has sufficient
bandwidth to supply four operands and receive two results per
clock cycle. Each of the pipelined execution units, including
those that execute floating-point and data movement
instructions, can accept a new instruction and retire a previous
instruction on every clock cycle.
In a single chip implementation, the MC88110 integrates
the central processing unit, floating point unit, graphics
processing unit, virtual memory address translation,
instruction cache, and data cache. The MC88110 maintains
compatibility with MC88100 user application software.
Motorola Master Selection Guide
maintained by MC88204 hardware. The block address
translation cache (BATC) is a 1D-entry cache, loaded by
software, containing translations for 512K-byte memory
blocks. The BATC translations are used for operating system
software or for other memory-resident instructions and data.
In addition, the MMU provides access control for the two
logical address spaces. The CMMU data cache is a 64K-byte,
four-way set-associative cache for instruction or data
storage. The cache incorporates memory-update policies
and
cache--coherency
mechanisms
that
support
multiprocessor applications. The MC88204 CMMU also
includes an MC8810O--compatible processor bus (P bus)
interface and memory bus (M bus) interface.
The MC88204 CMMU is completely software and pin-level
compatible with the MC88200 16K-byte CMMU. The
functionality of the MC88204 is identical to that of the
MC88200. With board layout constraints in mind, a central
processing unit (CPU) may use up to two MC88204 CMMUs
on the data P bus and up to two MC88204 CMMUs on the
instruction P bus to increase data cache and ATC sizes.
Cache/Memory
Management Units
MC88200RC
16-Kilobyte Cache/Memory
Management Unit (CMMU)
The MC88200 CMMU is a high-performance, HCMOS
VLSI device providing zero-wait-state memory management
and data caching. The MMU (memory management unit)
efficiently supports a demand-paged virtual memory
environment
with
two
logical
address
ranges
(user/supervisor) of 4 gigabytes each. Translated addresses
are provided by one oftwo ATCs (address translation caches),
providing address translation in one clock cycle for most
memory accesses. The PATC (page address translation
cache) is a 56-entry, fully associative cache containing
recently used translations for 4-kilobyte memory pages and
is maintained by MC88200 hardware. The BATC (block
address translation cache) is a 1D-entry cache, loaded by
software, containing translations for 512-kilobyte memory
blocks. The BATC translations are used for operating system
software or for other memory-resident instructions and data.
In addition, the MMU provides access control for the two
logical address spaces. The CMMU data cache is a
16-kilobyte, four-way, set-associative cache for instruction
or data storage. The cache incorporates memory-update
policies and cache-coherency mechanisms that support
multiprocessor applications. The MC88200 CMMU also
includes an MC88100--compatible P bus (processor bus)
interface and an M bus (memory bus) interface. A processor
may use two or more CMMUs for increased data cache and
ATC sizes.
MC88410
Secondary Cache Controller
The MC88410 is a highly integrated secondary cache
controller for the MC88110 microprocessor that reduces
memory latency and extends multiprocessing capability for
those seeking the highest level of system performance. Used
with the MCM6211 0 Fast Static RAM, it provides a functionally
complete secondary cache solution for both uniprocessor and
multiprocessor environments. The MC88410 provides tag,
control and buffering for 1/4, 1/2, and 1 Mbyte secondary
cache configurations, all in a single chip cache controller. The
MC88410 eliminates external logic between the processor
and the secondary cache, provides bus arbitration for the
MC88110, and requires no external programming.
The MC88410 and MCM62110 are optimized to provide
low latency memory access to the MC8811 0 processor. Initial
accesses incur only one wait state. Subsequent transactions
in a burst incur zero wait states. Data streaming to the
processor reduces the penalty on secondary cache misses.
The MC88410 expands the MC88110's system flexibility
by providing a choice of secondary cache line size, burst byte
ordering, and system clock frequency. The MC8841 0 extends
the MC88110 multiprocessing capability by significantly
reducing system bandwidth consumption. This increased
available bandwidth, along with the MC88410's hardware
enforced cache
coherency protocol, enable the
implementation of dual bus systems and scalable shared-bus
multiprocessing systems.
MC88204RC
64K-Byte Cache/Memory
Management Unit (CMMU)
The MC88204 CMMU is a high-performance, HCMOS
VLSI device providing zero-wait-state memory management
and data caching. The memory management unit (MMU)
efficiently supports a demand-paged virtual memory
environment with two logical address ranges (user/
supervisor) of 4 Gbytes each. Translated addresses are
provided by one of two address translation caches (ATCs),
providing address translation in one clock cycle for most
memory accesses. The page address translation cache
(PATC) is a 56--entry, fully associative cache containing
recently used translations for 4K-byte memory pages and is
Motorola Master Selection Guide
2.3-3
The M88000 RiSe Family
The M88000 RiSe Family
2.3-4
Motorola Master Selection Guide
The PowerPCTM RISC Family
Microprocessors
In Brief ...
Page
PowerPCTM RISC Microprocessors. . . . . . . . . . . . . . .. 2.4-2
MPC601 RISC Microprocessor. . . . . . . . . . . . . . . . . .. 2.4-2
MPC602 RISC Microprocessor . . . . . . . . . . . . . . . . . .. 2.4-3
MPC603 RISC Microprocessor .. . . . . . . . . . . . . . . . .. 2.4-3
MPC603e RISC Microprocessor. . . . . . . . . . . . . . . . .. 2.4-6
MPC604 RISC Microprocessor . . . . . . . . . . . . . . . . . .. 2.4-9
MPC604e RISC Microprocessor. . . . . . . . . . . . . . . . .. 2.4-9
MPC620 RISC Microprocessor .................. 2.4-13
MPC105 PCI Bridge/Memory Controller .......... 2.4-15
MPC106 PCI Bridge/Memory Controller .......... 2.4-16
The PowerPC architecture is derived from the IBM
Performance Optimized with Enhanced RISC (POWER)
architecture. The PowerPC architecture shares all of the
benefits of the POWER architecture but is optimized for
single-chip implementations. The architecture design
emphasizes parallel instruction execution and high
throughput and allows for exceptional floating-point
performance. The PowerPC architecture is powerful
today and is scalable from palmtops to mainframes.
Motorola Master Selection Guide
2.4-1
The PowerPC RISC Family Microprocessor
PowerPCTM RISC
Microprocessors
The PowerPC Architecture™, developed jointly by
Motorola, IBM, and Apple, is based on the POWER
Architecture™ implemented by the RISC Systeml6000™
family of computers. The PowerPC architecture takes
advantage of recent technological advances in such areas as
process technology, compiler design, and RISC (reduced
instruction set computer) microprocessor design to provide
software compatibility across a diverse family of
implementations, primarily single-chip microprocessors,
intended for a wide range of systems, including
battery-powered personal computers, embedded controllers,
high-end scientific and graphics workstations, and
multiprocessing, microprocessor-based mainframes.
To provide a single architecture for such a broad
assortment of processor environments, the PowerPC
architecture is both flexible and scalable.
The flexibility of the PowerPC architecture offers many
price/performance options. Designers can choose whether to
implement architecturally-defined features in hardware or in
software. For example, a processor designed for a high-end
workstation has greater need for the performance gained from
implementing
floating-point
normalization
and
denormalization in hardware than a battery-powered,
general-purpose computer might.
The PowerPC architecture is scalable to take advantage of
continuing technological advances - for example, the
continued miniaturization of transistors makes it more feasible
to implement more execution units and a richer set of
optimizing features without being constrained by the
architecture.
The PowerPC architecture defines the following features:
• Separate 32-entry register files for integer and
floating-point instructions. The general-purpose registers
(GPRs) hold source and target data for integer arithmetic
instructions, and the floating-point registers (FPRs) hold
source and target data for floating-point arithmetic
instructions.
• Instructions for loading and storing data between the
memory system and either the FPRs or GPRs.
• Uniform-length instructions to allow simplified instruction
pipelining and parallel processing instruction dispatch
mechanisms.
• Nondestructive use of registers for arithmetic instructions
in which the second, third, and sometimes the fourth
operand, typically specify source registers for calculations
whose results are typically stored in the target register
specified by the first operand.
• A precise exception model (with the option of treating
floating-point exceptions imprecisely).
• Floating-point support that includes IEEE-754
floating-point operations.
• The ability to perform both single- and double-precision
floating-point operations.
The PowerPC RISC Family Microprocessor
2.4-2
• A flexible architecture definition that allows certain
features to be performed in either hardware or with
assistance from implementation-specific software
depending on the needs of the processor design.
• User-level instructions for explicitly storing, flushing, and
invalidating data in the on-chip caches. The architecture
also defines special instructions (cache block touch
instructions) for speculatively loading data before it is
needed, potentially reducing the effect of memory latency.
• Definition of a memory model that allows weakly-ordered
memory accesses. This allows bus operations to be
reordered dynamically, which improves overall
performance and in particular reduces the effect of
memory latency on instruction throughput.
• Support for separate instruction and data caches
(Harvard architecture) and for unified caches.
• Support for both big- and little-endian addressing modes.
• Support for 64-bit addressing. The architecture supports
both 32-bit or 64-bit implementations. This document
typically describes the architecture in terms of the 64-bit
implementations in those cases where the 32-bit subset
can be easily deduced.
MPC601 RISC
Microprocessor
The MPC601 is the first implementation of the PowerPC
architecture. The MPC601 implements the 32-bit portion of
the PowerPC architecture, which provides 32-bit effective
(logical) addresses, integer data types of 8, 16, and 32 bits,
and floating-point data types of 32 and 64 bits. For 64-bit
PowerPC implementations, the PowerPC architecture
provides 64-bit integer data types, 64-bit addressing, and
other features required to complete the 64-bit architecture.
The MPC601 is a superscalar processor capable of issuing
and retiring three instructions per clock, one to each of three
execution units. Instructions can complete out of order for
increased performance; however, the MPC601 makes
execution appear sequential.
The MPC601 integrates three execution units-an integer
unit (IU), a branch processing unit (BPU), and a floating-point
unit (FPU). The ability to execute three instructions in parallel
and the use of simple instructions with rapid execution times
yield high efficiency and throughput for MPC601-based
systems. Most integer instructions execute in one clock cycle.
The FPU is pipelined so a single-precision multiply-add
instruction can be issued every clock cycle.
The MPC601 includes an on-Chip, 32-Kbyte, eight-way
set-associative, phYSically addressed, unified instruction and
data cache and an on-chip memory management unit (MMU).
The MMU contains a 256-entry, two-way set-associative,
unified translation look-aside buffer (UTLB) and provides
support for demand paged virtual memory address translation
and variable-sized block translation. Both the UTLB and the
cache use least recently used (LRU) replacement algorithms.
Motorola Master Selection Guide
The MPC601 has a 64-bit data bus and a 32-bit address
bus. The MPC601 interface protocol allows multiple masters
to compete for system resources through a central external
arbiter. Additionally, on-chip snooping logic maintains cache
coherency in multiprocessor applications. The MPC601
supports single-beat and burst data transfers for memory
accesses; it also supports both memory-mapped I/O and I/O
controller interface addressing.
The MPC601 uses an advanced, 3.6--volts (601) or 2.5
volts (601v) CMOS process technology and maintains full
interface compatibility with TTL devices.
The MPC602 has a single bus interface used for
transferring both 32-bit addresses and either 32- or 64-bit
data. This bus is time-multiplexed. The MPC602 interface
protocol allows multiple masters to compete for system
resources through a central external arbiter. The MPC602
provides a three-state coherency protocol that supports the
modified, exclusive, and invalid (MEl) cache states. This
protocol is a compatible subset of the MESI
(modified/exciusive/shared/invalid) four-state protocol and
operates coherently in systems that contain four-state
caches.
The MPC602 uses an advanced, 3.3-V CMOS process
technology and maintains full interface compatibility with TTL
devices.
Block Diagram
Figure 1 provides a block diagram of the MPC601 that
illustrates how the execution units - IU, FPU, and BPU operate independently and in parallel.
Block Diagram
The MPC602 block diagram in Figure 2 illustrates how the
execution units - IU, FPU, BPU, and LSU - operate
independently and in parallel.
MPC602 RISC
Microprocessor
MPC603 RISC
Microprocessor
The MPC602 is a low-cost, low-power implementation of
the PowerPC RISC architecture. The MPC602 implements
the 32-bit portion of the PowerPC architecture, which
provides 32-bit effective addresses, integer data types of 8,
16, and 32 bits, and floating-point data types of 32 and 64 bits.
Floating-point operations involving either 32- or 64-bit data
types in single--precision format are supported; however,
floating;>oint operations involving 64-bit data types in
double-precision format are not implemented in hardware
and are instead trapped for emulation in software.
The MPC602 has four execution units-an integer unit (IU),
a floating;>oint unit (FPU), a branch processing unit (BPU),
and a load/store unit (LSU). The ability to execute four
instructions in parallel and the use of simple instructions with
rapid execution times yield high efficiency and throughput for
MPC602-based systems. Most integer instructions execute
in one clock cycle. The FPU is pipelined such that typically
when the FPU pipeline is full, a single-precision instruction
can complete every clock cycle.
The MPC602 provides dynamic and static power-saving
modes. The three static modes nap, doze, and
sleep - progressively reduce the amount of power
dissipated by the processor.
The MPC602 provides independent on-chip, 4-Kbyte,
two-way set-associative, physically addressed caches for
instructions and data and on-chip instruction and data
memory management units (MMUs). The MPC602 MMUs
contain 32-entry, two-way set-associative, data and
instruction translation lookaside buffers (DTLB and ITLB). The
MPC602 provides an additional memory protection
mechanism not defined by the PowerPC architecture. The
602's protection--only mode can control whether instructions
can be fetched from 4-Kbyte instruction pages and whether
data can be written to 4-Kbyte data pages.
Motorola Master Selection Guide
The MPC603 is the first low-power implementation of the
PowerPC architecture. The MPC603 implements the 32-bit
portion of the PowerPC architecture, which provides 32-bit
effective (logical) addresses, integer data types of 8, 16, and
32 bits, and floating-point data types of 32 and 64 bits. For
64-bit PowerPC implementations, the PowerPC architecture
provides 64-bit integer data types, 64-bit addressing, and
other features required to complete the 64-bit architecture.
The MPC603 provides four software controllable
power-saving modes. Three of the modes (the nap, doze, and
sleep modes) are static in nature, and progressively reduce
the amount of power dissipated by the processor. The fourth
is a dynamic power management mode that causes the
functional units in the MPC603 to automatically enter a
low-power mode when the functional units are idle without
affecting operational performance, software execution or any
external hardware.
The MPC603 is a superscalar processor capable of issuing
and retiring a maximum of three instructions per clock.
Instructions can execute out of order for increased
performance; however, the MPC603 makes completion
appear sequential.
The MPC603 integrates five execution units - an integer
unit (IU), a floating-point unit (FPU), a branch processing unit
(BPU), a load/store unit (LSU) and a system register unit
(SRU). The ability to execute five instructions in parallel and
the use of simple instructions with rapid execution times yield
high efficiency and throughput for MPC603--based systems.
Most integer instructions execute in one clock cycle. The FPU
is pipelined so a single-precision multiply-add instruction can
be issued every clock cycle.
2.4-3
The PowerPC RISC Family Microprocessor
64-8IT DATA BUS
32-BIT DATA BUS
Figure 1. MPC601 Block Diagram
The PowerPC RISC Family Microprocessor
2.4-4
Motorola Master Selection Guide
32 BIT
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Figure 2. MPC602 Block Diagram
Motorola Master Selection Guide
2.4--5
The PowerPC RISC Family Microprocessor
The MPC603 provides independent on--chip, 8-Kbyte,
two-way set-associative, physically addressed caches for
instructions and data and on--chip instruction and data
memory management units (MMUs). The MMUs contain
64-entry, two-way set-associative, data and instruction
translation lookaside buffers (DTLB and ITLB) that provide
support for demand-paged virtual memory address
translation and variable-sized block translation.
The MPC603 has a selectable 32- or 64-bit data bus and
a 32-bit address bus. The MPC603 interface protocol allows
multiple masters to compete for system resources through a
central extemal arbiter. The MPC603 provides a three-state
coherency protocol that supports the Exclusive, Modified, and
Invalid cache states. This protocol is a compatible subset of
the MESI four-state protocol and operates coherently in
systems that contain four-state caches. The MPC603
supports single-beat and burst data transfers for memory
accesses; it also supports both memory-mapped I/O and I/O
controller interface addressing.
The MPC603 uses an advanced, 3.3-V CMOS process
technology and maintains full interface compatibility with TTL
devices.
Block Diagram
Figure 3 provides a block diagram of the MPC603 that
illustrates how the execution units -IU, FPU, BPU, LSU, and
SRU - operate independently and in parallel.
The MPC603 provides address translation and protection
facilities, including an ITLB, DTLB, and instruction and data
BAT arrays. Instruction fetching and issuing is handled in the
instruction unit. Translation of addresses for cache or external
memory accesses are handled by the MMUs.
MPC603e RISC
Microprocessor
The MPC603e is a low-power implementation of the
PowerPC RISC architecture. The MPC603e implements the
32-bit portion of the PowerPC architecture, which provides
32-bit effective addresses, integer data types of 8, 16, and 32
bits, and floating-point data types of 32 and 64 bits.
The MPC603e provides four software controllable
power-saving modes. Three of the modes (the nap, doze, and
sleep modes) are static in nature, and progressively reduce
The PowerPC RISC Family Microprocessor
2.4-6
the amount of power dissipated by the processor. The fourth
is a dynamic power management mode that causes the
functional units in the MPC603e to automatically enter a
low-power mode when the functional units are idle without
affecting operational performance, software execution, or any
external hardware.
The MPC603e is a superscalar processor capable of
issuing and retiring as many as three instructions per clock.
Instructions can execute out of order for increased
performance; however, the MPC603e makes completion
appear sequential.
The MPC603e integrates five execution units - an integer
unit (IU), a floating-point unit (FPU), a branch processing unit
(BPU), a load/store unit (LSU), and a system register unit
(SRU). The ability to execute five instructions in parallel and
the use of simple instructions with rapid execution times yield
high efficiency and throughput for MPC603e-based systems.
Most integer instructions execute in one clock cycle. The FPU
is pipelined so a single-precision multiply-add instruction can
be issued every clock cycle.
The MPC603e provides independent on--chip, 16-Kbyte,
four-way set-associative, physically addressed caches for
instructions and data and on--chip instruction and data
memory management units (MMUs). The MMUs contain
64-entry, two-way set-associative, data and instruction
translation lookaside buffers (DTLB and ITLB) that provide
support for demand-paged virtual memory address
translation and variable-sized block translation.
The MPC603e has a selectable 32- or 64-bit data bus and
a 32-bit address bus. The MPC603e interface protocol allows
multiple masters to compete for system resources through a
central external arbiter. The MPC603e provides a three-state
coherency protocol that supports the exclusive, modified, and
invalid cache states. This protocol is a compatible subset of
the MESI (modified/exclusive/shared/invalid) four-state
protocol and operates coherently in systems that contain
four-state caches. The MPC603e supports single-beat and
burst data transfers for memory accesses, and supports
memory-mapped I/O accesses.
The MPC603e uses an advanced CMOS process
technology and maintains full interface compatibility with TTL
devices. The MPC603e is implemented in both a 2.5-V
version (PID7V--603e) and a 3.3-V version (PID6--603e).
Block Diagram
Figure 4 provides a block diagram of the MPC603e that
illustrates how the execution units-IU, FPU, BPU, LSU, and
SRU - operate independently and in parallel.
Motorola Master Selection Guide
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Motorola Master Selection Guide
2.4-7
The PowerPC RISC Family Microprocessor
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Figure 4. MPC603e Block Diagram
The PowerPC RISC Family Microprocessor
2.4-8
Motorola Master Selection Guide
MPC604 RISC
Microprocessor
MPC604e RISC
Microprocessor
The MPC604 is an implementation of the PowerPC family
of RISC microprocessors. The MPC604 implements the
PowerPC architecture as it is specified for 32-bit addressing,
which provides 32-bit effective (logical) addresses, integer
data types of 8, 16, and 32 bits, and floating-point data types
of 32 and 64 bits (single-precision and double-precision). For
64-bit PowerPC implementations, the PowerPC architecture
provides additional 64-bit integer data types, 64-bit
addressing, and related features.
The MPC604 is a superscalar processor capable of issuing
four instructions simultaneously. As many as six instructions
can finish execution in parallel. The MPC604 has six
execution units that can operate in parallel-floating-point
unit (FPU), branch processing unit (BPU), load/store unit
(LSU), two single-cycle integer units (SCI Us), and one
multiple-cycle integer unit (MCIU).
This parallel design, combined with the PowerPC
architecture's specification of uniform instructions that allows
for rapid execution times, yields high efficiency and
throughput. The MPC604's rename buffers, reservation
stations, dynamic branch prediction, and completion unit
increase instruction throughput, guarantee in-order
completion, and ensure a precise exception model. (Note that
the PowerPC architecture specification refers to all exceptions
as interrupts.)
The MPC604 has separate memory management units
(MMUs) and separate 18-Kbyte on-chip caches for
instructions and data. The MPC604 implements two
128-entry, two-way set (64-entry per set) associative
translation lookaside buffers (TLBs), one for instructions and
one for data, and provides support for demand-paged virtual
memory address translation and variable-sized block
translation. The TLBs and the cache use least-recently used
(LRU) replacement algorithms.
The MPC604 has a 64-bit external data bus and a 32-bit
address bus. The MPC604 interface protocol allows multiple
masters to compete for system resources through a central
external arbiter. Additionally, on-chip snooping logic
maintains data cache coherency for multiprocessor
applications. The MPC604 supports single-beat and burst
data transfers for memory accesses and memory-mapped
I/O accesses.
The MPC604 uses an advanced, 3.3--V CMOS process
technology and is fully compatible with TTL devices.
The MPC604e is an implementation of the PowerPC family
of RISC microprocessors. The MPC604e implements the
PowerPC architecture as it is specified for 32-bit addreSSing,
which provides 32-bit effective (logical) addresses, integer
data types of 8, 16, and 32 bits, and floating-point data types
of 32 and 64 bits (single-precision and double-precision). For
64-bit PowerPC implementations, the PowerPC architecture
provides additional 64-bit integer data types, 64-bit
addressing, and related features.
The MPC604e is a superscalar processor capable of
issuing four instructions simultaneously. As many as seven
instructions can finish execution in parallel. The MPC604e has
seven
execution
units
that
can
operate
in
parallel - floating-point unit (FPU), branch processing unit
(BPU), condition register unit(CRU), load/store unit (LSU), two
single-cycle integer units (SCI Us), and one multiple-cycle
integer unit (MCIU).
This parallel deSign, combined with the PowerPC
architecture's specification of uniform instructions that allows
for rapid execution times, yields high efficiency and
throughput. The MPC604e's rename buffers, reservation
stations, dynamic branch prediction, and completion unit
increase instruction throughput, guarantee in-order
completion, and ensure a precise exception model. (Note that
the PowerPC architecture specification refers to all exceptions
as interrupts.)
The MPC604e has separate memory management units
(MMUs) and separate 32-Kbyte on-chip caches for
instructions and data. The MPC604e implements two
128-entry, two-way set associative translation lookaside
buffers (TLBs), one for instructions and one for data, and
provides support for demand-paged virtual memory address
translation and variable-sized block translation. The TLBs
and the cache use least-recently used (LRU) replacement
algorithms.
The MPC604e has a 64-bit external data bus and a 32-bit
address bus. The MPC604e interface protocol allows multiple
masters to compete for system resources through a central
external arbiter. Additionally, on--chip snooping logic
maintains data cache coherency for multiprocessor
applications. The MPC604e supports single-beat and burst
data transfers for memory accesses and memory-mapped
I/O accesses.
The MPC604e uses an advanced, 2.5-V CMOS process
technology and is fully compatible with TTL devices.
Block Diagram
Figure 5 provides a block diagram showing features of the
MPC604. Note that this is a conceptual block diagram
intended to show the basic features rather than an attempt to
show how these features are physically implemented on the
chip.
Motorola Master Selection Guide
Block diagram
Figure 6 provides a block diagram of the MPC604e.
2.4-9
The PowerPC RISC Family Microprocessor
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New Features of the MPC604e
Features of the MPC604e that are not implemented in the
MPC604 are as follows:
• Additional special-purpose registers
- HID1 provides four read-only Pll_CFG bits for
indicating the processor/bus clock ratio.
- Three additional registers support the performance
monitor-MMCR1 is a second control register that
includes bits to support the use of two additional
counter registers, PMC3 and PMC4.
• Instruction execution
- Separate units for branch and condition register (CR)
instructions. The BPU is now split into a CR logical
unit and a branch unit, which makes it possible for
branch instructions to execute and resolve before
preceding CR logical instructions. The MPC604e can
still only dispatch one CR logical or branch instruction
per cycle, but it can execute both branch and CR
logical instructions at the same time.
- Branch correction in decode stage. Branch correction
in the decode stage can now predict branches whose
target is taken from the count or link registers if no
updates of the count and link register are pending.
This saves at least one cycle on branch correction
when the mtspr instruction can be sufficiently
separated from the branch that uses the SPR as a
target address.
- Ability to disable the branch target address cache
(BTAC)-HIDO[30] has been defined to allow the
BTAC to be disabled. When HIDO[30] is set, the BTAC
contents are invalidated and the BTAC behaves as if it
were empty. New entries cannot be added until the
BTAC is enabled.
• Improvements to cache implementation
- 32-Kbyte split data and instruction caches. Like the
604, both caches are four-way set associative;
however, each cache has twice as many sets,
logically separated into 128 sets of odd lines and 128
sets of even lines.
- Data cache line-fill buffer forwarding. In the 604 only
the critical double word of a burst operation was made
available to the requesting unit at the time it was burst
into the line-fill buffer. Subsequent data was
unavailable until the cache block was filled. On the
MPC604e, subsequent data is also made available as
it arrives in the line-fill buffer.
- Additional cache copyback buffers. The MPC604e
implements three copyback write buffers (as opposed
to one in the 604). Having multiple copyback buffers
provides the ability for certain instructions to take fuller
The PowerPC RISC Family Microprocessor
2.4-12
advantage of the pipelined system bus to provide
more efficient handling of cache copyback, block
invalidate operations caused by the data cache block
flush (debf) instruction, and cache block clean
operations resulting from the data cache block store
(debst) instruction.
- Coherency support for instruction fetching. Instruction
fetching coherency is controlled by HIOO[23]. In the
default mode, HIOO[23] is 0, GBl is not asserted for
instruction accesses, as is the case with the 604. If
the bit is set, and instruction translation is enabled
(MSR[IR] 1), the GBl signal is set to reflect the M bit
for this page or block. If instruction translation is
disabled (MSR[IR] 0), the GBl signal is asserted.
• System interface operation
- The MPC604e has the same pin configuration as the
MPC604; however, on the MPC604e VOD and AVOD
must be connected to 2.5 Vdc and OVOD must be
connected to 3.3 Vdc. The MPC604e uses split
voltage planes, and for replacement compatibility,
MPC604/MPC604e designs should provide both
2.5-V and 3.3-V planes and the ability to connect
those two planes together and disable the 2.5-V
plane for operation with an MPC604.
- Support for additional processor/bus clock ratios (5:2
and 4:1). Configuration of the processorlbus clock
ratios is displayed through a new MPC604e-specific
register, HID1.
- To support the changes in the cloc!illllLconfiguration,
different precharge timings for the ABB, DBB, ARTRY,
and SHO Signals are implemented internally by the
processor. The precharge timings for ARTRY and
SHO can be disabled by setting HIOO[7].
- No-ORTRY mode. In addition to the normal and fast
l2 modes implemented on the 604, a no-DRTRY
mode is implemented on the MPC604e that improves
performance on read operations for systems that do
not use the DRTRY signal. No-DRTRY mode makes
read data available to the processor one bus clock
cycle sooner than in normal mode. In no-ORTRY
mode, the DRTRY signal is no longer sampled as part
of a qualified bus grant.
• Full hardware support for little-endian accesses.
Little-endian accesses take alignment exceptions for
only the same set of causes as big-end ian accesses.
Accesses that cross a word boundary require two
accesses with the lower-addressed word accessed first.
• Additional enhancements to the performance monitor.
=
=
Motorola Master Selection Guide
MPC620 RISC
Microprocessor
The MPC620 is an implementation ofthe PowerPCTM family
of RISC microprocessors. The MPC620 implements the
PowerPC architecture as it is specified for 64-bit addressing,
which provides 64-bit effective (logical) addresses, integer
data types of 8, 16, 32, and 64 bits, and floating-point data
types of 32 and 64 bits (single-precision and
double-precision). The MPC620 is software compatible with
the 32-bit versions of the PowerPC microprocessor family.
The MPC620 is a superscalar processor capable of issuing
four instructions simultaneously. As many as six instructions
can finish execution in parallel. The MPC620 has six
execution units that can operate in parallel - floating-point
unit (FPU), branch processing unit (BPU), load/store unit
(LSU), two single-cycle integer units (SCIUs), and one
multiple-cycle integer unit (MCIU).
This parallel design, combined with the PowerPC
architecture's specification of uniform instructions that allows
for rapid execution times, yields high efficiency and
throughput. The MPC620's rename buffers, reservation
stations, dynamic branch prediction, and completion unit
increase instruction throughput, guarantee in-order
completion, and ensure a precise exception model.
Motorola Master Selection Guide
The MPC620 has separate memory management units
(MMUs) and separate 32-Kbyte on-chip caches for
instructions and data. The MPC620 implements a 128-entry,
two-way set-associative translation lookaside buffer (TLB)
for instructions and data, and provides support for
demand-paged virtual memory address translation and
variable-sized block translation. The TLB and the cache use
least-recently used (LRU) replacement algorithms.
The MPC620 has a 40-bit address bus, and can be
configured with either a 64- or 128-bit data bus. The MPC620
interface protocol allows multiple masters to compete for
system resources through a central external arbiter.
Additionally, on-chip snooping logic maintains data cache
coherency for multiprocessor applications. The MPC620
supports single-beat and burst data transfers for memory
accesses and memory-mapped I/O accesses.
The MPC620 uses an advanced, 3.3-V CMOS process
technology and is compatible with 3.3-V CMOS devices.
2.4-13
Block Diagram
Figure 7 provides a block diagram showing features of the
MPC620. Note that this is a conceptual block diagram
intended to show the basic features rather than an attempt to
show how these features are physically implemented on the
chip.
The PowerPC RISC Family Microprocessor
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Bridge/Memory Controller
The MPC105 PCI bridge/memory controller (PCIS/MC)
provides a PowerPC reference platform---compliant bridge
between the PowerPC microprocessor family and the
peripheral component interconnect (PCI) bus. PCI support
allows system designers to rapidly design systems using
peripherals already designed for PCI and the other standard
interfaces available in the personal computer hardware
environment. The MPC105 integrates secondary cache
control and a high-performance memory controller that
supports DRAM, SDRAM, ROM, and Flash ROM. The
MPC105 uses an advanced, 3.3-V CMOS process
technology and is fully compatible with TTL devices.
The MPC105 provides an integrated high bandwidth, high
performance, TTL---compatible interface between a 60x
processor, a secondary (L2) cache or secondary 60x
processor, the PCI bus, and main memory.
The MPC105 supports a programmable interface to a
variety of PowerPC microprocessors operating at various bus
speeds. The 60x processor interface uses a subset of the 60x
bus protocol, which enables the interface between the
processor and MPC1 05 to be optimized for performance. The
MPC105's 60x interface allows for a variety of system
configurations by providing support for either a
direct-mapped, lookaside, L2 cache or a secondary 60x
processor. The L2 cache interface generates the arbitration
and support signals necessary to maintain a write-through or
write-back L2 cache. The L2 cache interface supports either
burst SRAMs or asynchronous SRAMs, and L2 data a
per-byte basis. The MPC1 05 features on-chip byte decoding
for L2 data write enables or can be configured to use external
logic for data write enable generation.
The PCI interface connects the processor and memory
buses to the PCI bus, to which 1/0 components are connected,
without the need for "glue" logic. This interface acts as both a
master and slave device.
The memory interface controls processor and PCI
interactions to main memory. It is capable of supporting a
variety of DRAM or SDRAM, and ROM or Flash ROM
configurations as main memory. The maximum supported
memory size is 1 Gbyte of DRAM or SDRAM, with 16 Mbytes
of ROM or 1 Mbyte of Flash ROM.
The MPC1 05 provides hardware support for four levels of
power reduction; the doze, nap, and sleep modes are invoked
by register programming, and the suspend mode is invoked by
assertion of an external signal. The design of the MPC105 is
fully static, allowing internal logic states to be preserved during
all power saving modes. The following sections describe the
programmable power modes provided by the MPC1 05.
Block Diagram
Figure 8 shows the MPC105 in a typical system
implementation. The major functional units within the MPC1 05
are also shown in Figure 1. Note that this is a conceptual block
diagram intended to show the basic features rather than an
attempt to show how these features are physically
implemented on the device.
CONTROL
L2 CACHE
OR
SECONDARY
60X
PROCESSOR
Figure 8. System Implementation and Block Diagram
Motorola Master Selection Guide
2.4-15
The PowerPC RISC Family Microprocessor
MPC106 PCI
Bridge/Memory Controller
The MPC106 provides a PowerPC common hardware
reference platform (CHRP). compliant bridge between the
PowerPC microprocessor family and the Peripheral
Component Interconnect (PC I) bus. PCI support allows
system designers to rapidly design systems using peripherals
already designed for PCI and the other standard interfaces
available in the personal computer hardware environment.
The MPC106 integrates secondary cache control and a
high-performance memory controller. The MPC106 uses an
advanced, 3.3-V CMOS process technology and is fully
compatible with TTL devices.
The MPC106 provides an integrated high-bandwidth,
high-performance, TTL--compatible interface between a 60x
processor, a secondary (L2) cache or secondary 60x
processor, the PCI bus, and main memory.
60x Processor Interface
The MPC106 supports a programmable interface to a
variety of PowerPC microprocessors operating at select bus
speeds. The 60x processor interface of the MPC106 uses a
subset of the 60x bus protocol, supporting single-beat and
burst data transfers. The address bus is 32 bits wide and the
data bus is 64 bits wide. The address and data buses are
decoupled to support pipelined transactions. PCI bus
accesses to system memory space are passed to the 60x
processor bus for snoo~poses. Two signals on the
MPC106, LBCLAIM, and DBGLB, are provided for an optional
local bus slave. The local bus slave must be capable of
generating AACK and TA signals to interact with the 60x
processor(s). Depending on the system implementation, the
processor(s) may operate at the PCI bus clock rate, or at two
orthree times the PCI bus clock rate. The bus is synchronous,
with all timing relative to the rising edge of the bus clock.
L2 Cache/Multiple Processor Interface
The MPC106 provides support for the following
configurations of 60x processors and L2 cache:
• A single 60x processor with no l2 cache
• A single 60x processor plus a direct-mapped, lookaside,
l2 cache
• A single 60x processor plus an external l2 cache
controller or integrated L2 cache module such as the
Motorola MPC2604GA integrated L2 lookaside cache
• Two 60x processors with no L2 cache
• Two 60x processors plus an externall2 cache controller
or integrated L2 cache module such as the Motorola
MPC2604GA integrated l2 lookaside cache
The PowerPC RISC Family Microprocessor
2.4-16
The internal L2 cache controller generates the arbitration
and support signals necessary to maintain a write-through or
write-back l2 cache. The internal l2 cache controller
supports either asynchronous SRAMs, pipelined burst
SRAMs, or synchronous burst SRAMs, using byte parity for
data error detection. When a second 60x ·processor is used,
three signals of the L2 interface (BR1, BG1, and DBG1)
change their functions to allow for arbitration between the 60x
processors. AII60x interface signals of the MPC106, except
the bus request, bus grant, and data bus grant signals, are
shared by the 60x processors. When an external L2 controller
(or integrated L2 cache module) is used, three signals of the
l2 interface (BRl2, BGl2, and DBGL2) changetheirfunctions
to allow the MPC106 to arbitrate between the external cache
and the 60x processor(s).
Memory Interface
The memory interface controls processor and PCI
interactions to main memory and is capable of supporting a
variety of DRAM, or extended data-out (EDO) DRAM and
ROM or Flash ROM configurations as main memory. The
maximum supported memory size is 1 Gbyte of DRAM or EDO
DRAM, with 16 Mbytes of ROM or Flash ROM. The memory
controller of the MPC1 06 supports the various memory sizes
through software initialization of on--chip configuration
registers. Parity or ECC is provided for error detection.
PCI Interface
The MPC106's PCI interface is compliant with the PCI
Local Bus Specification, Revision 2.1, and follows the
guidelines in the PCI System Design Guide, Revision 1.0for
host bridge architecture. The PCI interface connects the
processor and memory buses to the PCI bus, to which I/O
components are connected. The PCI bus uses a 32-bit
multiplexed address/data bus, plus various control and error
signals.
Figure 9 shows the major functional units within the
MPC106. Note that this is a conceptual block diagram
intended to show the basic features rather than an attempt to
show how these features are physically implemented on the
device.
Motorola Master Selection Guide
L2 CACHE
INTERFACE
MEMORY
INTERFACE
L2
60x PROCESSOR
INTERFACE
MEMORY
60x BUS
POWER MANAGEMENT
ERROR/INTERRUPT
CONTROL
CONFIGURATION
REGISTERS
Figure 9. MPC106 Block Diagram
Motorola Master Selection Guide
2.4-17
The PowerPC RISC Family Microprocessor
The PowerPC RISC Family Microprocessor
2.4-18
Motorola Master Selection Guide
Single-Chip
Microcontrollers (CSIC)
In Brief ...
Page
M68HCOS CSIC Family ......................... 2.S-2
M68HC08 Family .............................. 2.S-13
Development Tools ........................... 2.5-14
On-Line Help ........ . . . . . . . . . . . . . . . . . . . . . . . .. 2.S-22
Motorola offers the most comprehensive selection of
high-performance single-chip control systems available
from a single source. Microcontroller device families range
from industry-standard 8-bit controllers to state-of-the-art
16- and 32-bit modular controllers. Within the price and
performance categories of each family, there are a variety of
on-chip capabilities to match specific applications.
Motorola device families are structured so that upward
migration need not involve complete code development.
The M68HC11 Family is upward code compatible with
M6800 and M6801 software, while the M68HC16 family is
source-code compatible with the M68HC11 family.
Motorola's newest 8-bit MCU product line, the M68HC08
family, is fully upward object code compatible with the
M68HCOS and M680S families. In addition, M68300 and
M68HC 16 devices share standard internal modules and
bus configurations.
Motorola Master Selection Guide
2.5-1
Single-Chip Microcontrollers (CSIC)
M68HC05 CSIC Family
It all started with the 68HC05 Family, and Motorola's CSIC
(Customer-Specified Integrated Circuits) approach to
microcontroller design. Today, customers can selectfrom over
70 mask ROM 68HC05 devices and over 30 one-time
programmable (OTP) 68HC705 devices - and that number
is growing all the time, as Motorola continues to develop
derivatives of the 68HC05 based on customer demand.
With so many standard 68HC05 microcontrollers from
which to choose, most customers will find the right device for
an application among these existing devices. For some
high-volume applications, however, a customer may opt for
Motorola to develop a new derivative to meet an application's
precise requirements. The result is a new microcontroller
which can then be added to the selection of standard devices.
M68HC05 Industry Solutions
Motorola's 68HC05 and 68HC08 Families consist of a
variety of microcontroller designs to meet the requirements of
a broad range of applications. The 68HC05 Family, already
over 100 devices strong, offers a wide range of standard
products from which to choose, while the flagship 68HC08
offers a large library of modules from which derivatives can be
developed.
68HC05 General-Purpose
M icrocontrollers
68HC05 C-Family. These flexible, general-purpose
devices feature a wide variety of memory options capable of
handling complex programs. On-Chip SCI provides
asynchronous communications, with software-selectable
baud rates from 75 Hz to 131 kHz. The high-speed,
synchronous 4-wire serial system SPI is ideal for driving
off-chip displays and peripherals.
All C-Family devices include a powerful 16-bit
free-running programmable counter in conjunction with input
capture and output compare functions for simultaneous input
waveform measurement and output waveform generation. A
watchdog timer guards against runaway software in noisy
environments.
The high-packing density of Motorola's HCMOS process
allows standard devices to run at bus frequencies up to
2.1 MHz. Motorola also offers high-speed versions which run
at frequencies up to 4.2 MHz from an 8.4 MHz crystal or
external clock. Low-voltage versions are available for
applications requiring extremely low power consumption to
extend battery life or rninirnize heat dissipation.
68HC05 J-Family. This 20-pin family provides a low-cost,
low pin count, 8-bit upgrade for existing 4-bit applications. It
combines a powerful 68HC05 CPU with a flexible, 15-stage
multifunction timer and real-tirne interrupt capability.
68HC05 K-Family. Our lowest-cost family offers a 16-pin
count and is appropriate for logic replacement.
Single-Chip Microcontroliers (CSIC)
2.5-2
68HC05 P-Family. Born out of the CSIC design concept,
this farnily offers an extrernely cost-cornpetitive 28-lead
family of microcontrollers with a variety of ROM sizes and
special features such as Serial Input/Output Port (SlOP) to
control display drivers and comrnunicate with other
peripherals. Other options include AID input and on-chip
EEPROM for non-volatile data storage. Low-voltage and
high-speed versions are also available.
The flagship 68HC(7)08XL36 OTP and ROM versions are
the first two devices in the 68HC08 Family and are intended
for general purpose uses.
Low-Voltage Microcontrollers
The 68HC05 Family has been capable of 3.0 V operation
since 1980 and includes some 2.2 V selections. Recently,
Motorola announced several 68HC05 microcontrollers
capable of 1.8 Vdc and 500 kHz operation. This new
low-voltage capability affords a greater than threefold power
savings over 3.0 V versions of the same chips, a significant
design consideration for any portable electronic application.
The new devices are collectively designated 68HCL05 and
include the following versions: 68HCL05C4, C8, C12, J1A,
KO, PI, and P4. They are designed to provide lower-power
control technology to accommodate trends in portable
applications toward compactness, lightweight deSign, and
extended battery life.
Automotive
68HC05 B-Family. EEPROM memory in these devices
makes it possible to store information that must be retained
after the power is removed. Applications include electric seat
control (storage of seat positions) and audio systerns (storage
of radio stations).
68HC05 C- and O-Families. These general-purpose
microcontrollers are used for cruise control, ignition systems,
and in-car entertainment systems.
68HC05 J-, K-, and P-Families. With their low pin count
and low cost, these devices are ideal for automotive
applications such as car alarms, power windows, keyless
entry, and air bags.
68HC05 V- and X-Families. Both these groups contain
integrated automotive multiplex interfaces that allow them to
talk to other electronic modules within a vehicle. The V series
adds an on-chip voltage regulator.
Computer
68HC05 BO-Family. These devices are ideal for computer
monitor applications. They include a horizontal and vertical
sync processor as well as 16 channels of pulse-width
modulation.
68HC05 C-Family. These are general purpose devices for
keyboard and monitor control.
Motorola Master Selection Guide
68HC05 J-, P-, and E-Families. These low-cost, low pin
count devices are appropriate for applications like a cordless
PC mouse and trackball.
68HC05 C-Family. This group of microcontrollers has
proven useful as a general-·purpose device for
communications applications.
68HC05 E-Family. Like the 68HC05 B-Series devices
E-Series devices are ideal for number storage and keyboard
interrupt applications.
68HC05 F-Family. These devices - except for the F5,
which features an integrated DTMF receiver - include an
on-chip Dual-Tone Multi-Frequency Generator (DTMG) for
digital transmission and reception, as well as an LED drive for
user information. These features make the F-Family suitable
for a number of telecommunications applications, including
auto dialing, number storage, and display control.
68HC05 J- and P-Families. These low pin count,
low-cost
microcontrollers
have
a
variety
of
telecommunications uses, with features ranging from
EEPROM to multifunction timers.
68HC05 L-Family. With its large LCD driving capability
and low power consumption, this series is well-suited to
applications in hand-held communication equipment. The
on-chip tone generator and display functions can be used in
pager systems to alert users to incoming messages.
Consumer
68HC05 C- and D-Families. The multiple communication
lines (I/O ports, SCI and SPI) and free-running timer in this
group of devices make it possible to execute several tasks in
parallel. These features are used in consumer products like
CD players, automotive entertainment systems, and remote
controls.
68HC05 J-, K-, and P-Families. The free-running timer
in these cost-effective microcontrollers allows multitasking in
applications such as washing machines, oven controls, and
remote controls.
68HC05 L-Family. These low-power, small-footprint
devices can drive large LCD displays, making them ideal for
hand-held consumer products like portable CD players.
Industrial
68HC05 B-Family. On-chip features include EEPROM;
8-channel, 8-bit AID converter; and Pulse Length Modulated
outputs. Typical industrial applications include Programmable
Logic Controllers (PLC) and data acquisition systems.
68HC05 C- and D-Families. These general-purpose
devices can be used in applications such as process control
systems where multiple I/O lines and LED outputs are
required.
68HC05 J- and P-Families. These devices are popular in
low-cost industrial applications such as smoke detectors,
security devices, thermostats, and furnace ignition systems.
68HC05 L-Family. Multi-port controllers with LCD driver,
16-bit timer and watchdog timer on board. Excellent for
display panels requiring tone output and low power
consumption such as thermostats and alarms.
68HC705MC4. This device is intended for use in industrial
motor control and power supply applications.
68HC05 X-Family. These devices have Controlled Area
Network (CAN) controllers with 4K thru 32K ROM for
integrated messaging on factory automation, sensor, and
switch applications.
Television and Video
68HC05 B-Family. These devices are ideal for EEPROM
storage, with 256 bytes of EEPROM to store TV or satellite
channel frequencies and preset volume or brightness levels.
Features include Analog-to-Digital (AID) conversion and
PWM.
68HC05 C- and D-Families. With up to 32K of user ROM,
these devices can be used in the television and video market
as general-purpose microcontrollers.
68HC05 CC-Family. Evolved from the T-Series,
CC-Series devices feature closed-caption Data Slicer (DSL)
and enhanced OSD features for decoding and displaying
closed captions.
68HC05CO. This device has no on-chip user ROM, but is
capable of addressing up to 64K of external memory, making
it ideal for applications that require large amounts of operating
code, like televisions. The 12C bus module and 4 MHz internal
bus speed also allow interconnection with standard TV
peripherals.
68HC05 K- and RC-Families. These devices are used in
remote control applications.
68HC05 T-Family. All T-Family devices have On Screen
Display (OSD) modules that can overlay graphical images
onto television screens. They also contain D/A converters that
can drive analog outputs like volume control, and AID
converters that can be used to automatically adjust the fine
tuning. Some members of the T-Series have 12C interfaces
that can communicate with industry-standard TV peripherals.
Telecommunications
68HC05 B-Family. These devices can
store
user-programmable telephone numbers in 256 bytes of
non-volatile EEPROM memory. They can also communicate
with analog inputs like battery life in hand-held equipment,
using the AID module. The D/A module can be used to control
analog outputs such as telephone volume and line cards.
Motorola Master Selection Guide
2.5-3
Single-Chip Microcontrollers (CSIC)
«
0::
USER ROM-1248 BYTES
LU
I(JJ
a
LU
0::
USER RAM - 64 BYTES
z
0
F
()
«
b:
0
a.
LU
0::
is
~
'"
PA7'
PA6'
PAS'
PA4'
PA3"
PA2"
PAl"
PAO"
'8 rnA SINK CAPABILITY
"EXTERNAL INTERRUPT CAPABILITY
CPU CONTROL
ARITHMETIC/LOGIC
UNIT
ACCUMULATOR
IRQ
M68HCOS
MCU
RESET
11 111 11 1
1
11 111 1 11
LU
1
t;:;
a
LU
0::
Z
STACK POINTER
101010101010101011111
H)
2ch
(IH:>H)
24 Vo
t/
Comments
Packages
56SDIP-B
52 PLCC-FN
64QFP-FU
8i
20
MC68HC05B6
6K
176
256
l6-bit:
(2IC,20C)
8CI+
8ch
(IH:>H)
2ch
(IH:>II)
24 Vo
8i
20
t/
On-Chip Charge Pump
EEPROM Write Protect
56SDIP-B
52 PLCC- FN
64QFP-FU
MC6BHC05B8
7.2SK
176
256
16-bil:
(2IC,20C)
SCI+
8ch
(IH:>H)
2ch
(IH:>II)
24 Va
8i
20
t/
On-Ghip Charge Pump
EEPROM Write Protect
56SDIP-B
52 PLCC- FN
64QFP-FU
MC6BHC05B16
15K
352
256
l6-bit:
(2IC,20C)
SCI+
Bch
(IH:>H)
2ch
(IH:>H)
24 Va
t/
On-Ghip Charge Pump
EEPROM Write Protect
S6SDIP-B
52 PLCC-FN
64 QFP- FU
16ch
(lH:>it)
24 Va
t/
Horizontal and Vertical Sync
Signal Processor
t/
KBI (8 pins)
1 High Current Pin (5 rnA sink)
Mask Option Pullups
High Speed Option (HSCOSC4A)
Low Power Option (HCLOSC4A)
(1.8 V minimum)
40 DIP- P
44 PLCC-FN
44 QFP- FB
42SDIP-B
8i
20
MC68HCOSBD3
3.7SK
12B
MFT, RTI
12C
MC6BHC05C4A
4K
176
16-bit:
(1IC, WC)
SPI
SCI
24 Vo
16-blt:
(1IC,10C)
SlOP
32 Vo
t/
8 High Current Pins (10 rnA
sink) LV?I, On-Chip Charge
Pump
40DIP-P
44 PLCC-FN
16-blt:
(1IC,10C)
SPI
SCI
24 Vo
t/
KBI (8 pins)
1 High Current Pin (5 rnA sink)
Mask Option Pullups
High Speed Option (HSC05CBA)
Low Power Option (HCL05CBA)
(1.8 V minimum)
40DIP-P
44 PLCC- FN
44 QFP- FB
42SDIP-B
MC68HC05C5
5K
176
MC68HC05C8A
BK
176
128
7i
7i
40DIP-P
42SDIP-B
MC68HC05C9A
16K
352
l6-bit:
(1IC, WC)
SPI
SCI
24 Va
7i
t/
KBI (B pins)
1 High Current Pin (5 rnA sink)
Mask Option Pullups
High Speed Option (HSC05C9A)
Low Power Option (HCL05C9A)
40DIP-P
44 PLCC-FN
44QFP-FB
42 SDIP- B
MC68HC05C12
12K
176
16-bit:
(1IC,10C)
SCI
SPI
24 Vo
t/
1 High Current Pin (20 rnA sink)
KBI (8 pins)
Mask Option Pullups (8 pins)
High Speed Option (HSC05C12)
Low Power Option (HCL05C12):
(1.8 V minimum)
4ODIP-P
44 PLCC-FN
44QFP-FB
42 SDIP-B
IH:>H:
Pulse
Accum.
MFT
12C
MC6BHCOSCC1
16K
544
MC68HC05CC2
31.5K
92B
IH:>H:
Pulse
Accum,
MFT
12C
MC68HC05CJ4
4K
224
16-bit:
(1IC, WC)
MFT
SPI
SCI
12C
MC68HC05D9
16K
352
11H:>H:
(1IC.10C)
SCI
MC68HC05D24
24K
352
16-b~:
7i
1 ch
(5-bH)
(6-b~)
1 ch
(5-bit)
8ch
(IH:>H)
32K
352
16-bH:
(1IC,1OG)
MCBBHC05E1
4K
368
MFT. RTI
MCBBHC05E6
6K
12B
160
Single-Chip Microcontrollers (CSIC)
16-bit:
(1IC, WC)
MFT, RTI
OSD
(127 Char
ROM)
31 Vo
Closed Caption Television
NTSC Data Slicer w/int Sync Sep
28 MHz PLL
8 Open Drain 1/0 Pins, 5 V Only
40 DIP-P
42SDIP-B
OSD
(127 Char
ROM)
31 ilo
Closed Caption Television
NTSC Data Slicer wlint Sync Sep
32 MHz PLL
8 Open Drain 1/0 Pins, 5 V Only
42SDIP-B
40DIP-P
24 Va
t/
12C (Slave Only)
44 QFP- FB
Sch
(6-bit)
31 Vo
t/
8 High Current Pins (25 rnA sink)
30 kHz PWM
40DIP-P
44 PLCC- FN
SCI
5ch
(6-bit)
31 Va
t/
8 High Current Pins (24 rnA sink)
30kHz PWM
4ODIP-P
44PLCC-FN
SCI
5ch
(IH:>H)
31 Vo
t/
8 High Current Pins (24 rnA sink)
30 kHz PWM
40 DIP-P
44 PLCC-FN
201/0
t/
32 kHz PLL Clock Synthesizer
28DIP-P
28S0IC-DW
32 i/o
4i
t/
KBI (B pins)
Pin for Extemal LVI
44 QFP- FB
2BSOIC-DW
(1IC.10C)
XC6BHCOSD32
8ch
4ch
(8-bH)
2.5-6
Motorola Master Selection Guide
Table 5. 68HC05 Microcontrollers (continued)
Motorola
Part
EEPROM
(Bytes)
Display
Drive
ROM
(Bytes)
RAM
(Bytes)
MC68HC05F5
5K
224
MFT, RTI
MC68HC05F6
4K
320
16-bit:
(1IC, WC)
SPI
26 ilo
4I
20
MC68HC05F8
8K
320
16-bit:
SPI
50 ilo
Number
Timer
Serial
AID
PWM
(1IC, WC)
I/O
COP
30 ilo
11
01
Mask IRQ
42SDIP-B
44QFP - FB
01
DTMF Generator
KBI (8 pins)
Manchester Encoder/Decoder
a High Current Pins (10 rnA sink)
64 QFP - FU
40 i/o
8I
01
32 kHz PLL - Standby modes
56SDIP-B
64 QFP - FU
48 i/o
16 i
01
KBI (8 pins)
Dual Oscillators - Selectable
Clock
Dual IRQ
80 QFP- FU
20
auto
8K
16-bit:
(1IC, WC)
176
SPI
4 ch
(8--bit)
Dual
SPI
8 ch
(8--bll)
Packages
40 DIP - P
44 PLCC - FN
DTMF Generator
8 High Current Pins (10 rnA sink)
KBI (6 pins)
16-bit:
MC68HC05G1
Comments
DTMF Receiver
RTC
MC68HC05G3
24K
768
16-bit:
(1IC, WC)
B-bit:
Event Cntr
4 ch
(8-btt)
40
12K
64
MFT, RTI
14 i/o
01
KBI (4 pins)
4 High Current Pins (8 rnA sink)
Mask Option Pulldowns (14 pins)
High Speed Version (HSC05J 1A)
Low Power Version (HCL05J1A):
(1.8 V minimum)
20 DIP - P
20S0IC-OW
MC68HC05J3
2K
128
16-bit:
(1IC, tOC)
MFT, RTI
14 ilo
01
14 High Current Pins (8 mA sink)
KBI (4 pins)
20DIP-P
20S01C- DW
MC68HC05KO
O.5K
32
MFT, RTI
10 i/o
01
4 High Current Pins (8 mA sink)
Programmable Pulldowns
(10 pins)
Low Voltage Reset Mask Option
Low power version (HCL05KO):
(1.8 V minimum)
16 DIP - P
16S0IC-DW
MC68HC05K1
O.5K
32
MFT, RTI
10 ilo
01
4 High Current Pins (8 mA sink)
PEP (64 bits)
Programmable Pulldowns
(10 pins)
Low Voltage Reset Mask Option
16DIP-P
16 SOIC-DW
XC68HC05K3
920
64
MFT, RTI
10 i/o
01
KBI (4 pins),
Programmable Pulldowns
(10 pins)
4 High Current Pins (8 mA sink)
On-Chip Charge Pump
1.8 V Operating Voltage
16 DIP - P
16S0IC-DW
MC68HC05L1
4K
128
l6-bit:
(2IC,20C)
6 ch
(8--bit)
64 Segment
LCD:
(3/4 x 12116)
17 i/o
15 i
20
MC68HC05L2
2K
96
16-bit:
(tlC,IOC)
MFT, RTI
I ch
(8--bit)
45 Segment
LCD:
(3 xiS)
13 i/o
01
Programmable Pullups (13 pins)
42SDIP-B
MC68HC05L5
8K
256
16..-.bit:
(1IC, tOC)
RTI
B-bit:
(1IC,10C)
SlOP
156 Segment
LCD:
(1-4 x 27-39)
14 ilo
10i
150
01
KBI (8 pins), Dual Oscillators
8 High Current Pins (10 mA sink)
Programmable Putlups (24 pins),
Open Drain (31 pins), 2.2 V
80 QFP - FU
MC68HC05L7
6K
176
16-bit:
(tiC, WC)
RTC
SCI
960 Segment
LCD:
(8116 x 60)
15 i/o
Mux EBI (13..-.bit Address),
32 kHz PLL, KBI (8 pins),
LVI Tone Generator
128 QFP - FT
Die
MC68HC05L9
6K
176
16-bit:
(1IC,10C)
RTC
SCI
640 Segment
LCD:
(8116 x 40)
27 i/o
2I
Mux EBI (16..-.bit Address),
32 kHz PLL, KBI (8 pins),
LVI Expand LCD to 3K Segments
w/68HC68L9, Tone Generator
128 QFP - FT
Die
MC68HC05L 10
13K
352
l6-bit:
(lIC,10C)
RTC
SPI
SCI
5K - 20K Pixel
LCD
28 ilo
Mux EBI w/MMU (20-bit
Address)
4 Chip Selects, KBI (8 pins)
Tone Generator/OTMF, 32 kHz
PLL
LCD Expansion w/MC141511
128 QFP- FT
Die
MC68HC05J1A
16 PEEP
Motorola Master Selection Guide
2.5-7
56SDIP-B
64 QFP - FU
Single-Chip Microcontrollers (CSIC)
Table 5. 68HC05 Microcontrollers (continued)
Motorola
Part
Number
MC68HC05L 11
MC68HC05L 16
ROM
(Bytes)
RAM
(Bytes)
3K
448
16K
EEPROM
(Bytes)
512
Timer
Serial
16-bit:
(1IC, toC)
RTC
SPI
SCI
l6-bit:
(1IC, toG)
RTI
8-bil:
(1IC, toG)
SlOP
MC68HC05M4
4K
128
l6-bit:
(1IC, toC)
8-bit
Modulo
MC68HC05P1A
2K
128
16-bit:
(1IC, laC)
MC68HC05P3
3K
128
MC68HC05P4
4K
176
128
PWM
Display
Drive
Up to 4QK
Pixel LCD
110
COP
38 i/o
Comments
Mux ESI w/MMU {23-bit
Packages
100 QFP- FU
Address)
4 Chip Selects, KBf (8 pins)
Tone Generator/DTMF, 32 kHz
PLL
LCD Expansion with MC141512
+ MC141514
156 Segment
LCD:
(1-4 x 27-39)
16 i/o
8i
150
'"
KBI (8 pins), Dual Oscillators
8 High Current Pins (10 rnA sink)
80QFP-FU
Programmable Pullups (24 pins)
Open Drain (31 pins), 2.2 V
Operation
6 ch
(8--lJit)
VFD (24 lines)
l6-bit:
(1IC, toG)
MFT, RTI
16-bit:
(1IC, laC)
SlOP
MC68HC05P6
4.5K
176
16-bit:
(1IC, toG)
SlOP
MC68HC05P7
2K
128
16-bit:
(1IC, toC)
SlOP
MC68HC05P8
2K
112
MC68HC05P9
2K
128
l6-bit:
(1IC, toG)
MC68HC05PEO
2K
128
l6-bit:
(tiC, toG)
XC68HC05RC16
16K
350
Infrared
Timer
MC68HC05SCll
6K
128
MC68HC05SC21
6K
128
MC68HC05SC24
3K
MC68HC05SC27
32
AID
MFT, RTI
4 ch
(8-bit)
32 i/o
8i
'"
20 ilo
Ii
'"
2 High Current Pins (20 mAl
22 i/o
'"
KBI (6 pins)
On-Chip Charge Pump
28 DIP - P
28 SOIC-DW
20 i/o
Ii
'"
High Speed Option
28DIP-P
28S0IC-DW
20 Vo
Ii
'"
'"
20 ilo
Ii
4 ch
(8--bit)
16 i/o
4i
4 ch
(8-bit)
20 i/o
Ii
5 V Only
52 PLCC- FN
KBI (8 pins)
28 DIP - P
28 SOIC-DW
Mask Option Pullups (8 pins)
(68HSC05P4)
Low Power Option
(68HCL05P4):
(1.8 V minimum)
28 DIP- P
28 SOIC-DW
28 DIP- P
28S0IC-DW
28DIP-P
28S0IC-DW
'"
'"
LVPI Option on EEPROM
On-Chip Charge Pump
20 ilo
'"
1 High Current Pin (20 mA sink)
PEP (64 bits), KBI (8 pins)
Mask Option Pulldowns (8 pins)
RC Oscillator Option
28DIP-P
28 SOIC- DW
12 i/o
'"
Mask Option Pullups (12 pins)
KBI (12 pins), Low Power Stop
Pin
28 DIP- P
28 SOIC- DW
5 i/o
Security Features, 8K EPROM
Smartcard Applications, 5 V Only
Die
16DIP-P
20S0IC-DW
3K
5 i/o
Security Features
On-Chip Charge Pump
Smartcard Applications
Die
16DIP-P
20S0IC-DW
128
lK
5 ilo
Security Features
On-Chip Charge Pump
Smartcard Applications
Die
16DIP-P
20S0IC-DW
16K
240
3K
5 ilo
'"
Security Features
On-Chip Charge Pump
Smartcard Applications
High Speed Option
Die
l6DIP-P
20 SOIC-DW
XC68HC05SC28
12K
256
8K
5 i/o
'"
Security Features,
On-Chip Charge Pump
Smartcard Applications
High Speed Option
Die
44 PLCC- FN
MC68HC05Tl
8K
320
16-bit
(1IC, lOG)
SlOP
1 ch
(6--bit)
9 ch
(6--bit)
OSD
(64 Char
ROM)
29 ilo
Ii
Open Drain PWM Outputs
5 V Only
40 DIP- P
42 SDIP- B
XC68HC05T2
15K
320
l6-bit:
(1IC, toC)
SlOP
1 ch
(6-bit)
9 ch
(6-bit)
OSD
(64 Char
ROM)
29 ilo
Ii
'"
'"
Open Drain PWM Outputs
5 V Only
40 DIP- P
42SDIP-B
MC68HC05Tl0
12K
320
l6-bit:
(1IC, toG)
RTC
12C
1 ch
(8--lJit)
8 ch
(&-bit)
1 ch
(14--lJit)
OSD
(64 Char
ROM)
20i/o
4i
Open Drain PWM Outputs
KBI (8 pins)
5 VOnly
56SDIP-B
Single-Chip Microcontrollers (CSIC)
SlOP
2,5--8
28DIP-P
28 SOIC-DW
Motorola Master Selection Guide
Table 5. 68HC05 Microcontrollers (continued)
Motorola
Part
Number
MC68HC05T16
ROM
(Bytes)
RAM
(Bytes)
24K
320
EEPROM
(Bytes)
Timer
Serial
AID
PWM
16--bit:
12C
2ch
(5-bil)
9 ch
(7-bn)
1 ch
(14-hit)
(1IC,20C)
8-bitPAC
Display
Drive
OSO
(128 Char
EPROM)
VO
COP
40 Vo
tI'
Comments
12 V Open Drain 1/0 lines
(up to 22)
Packages
56 SDlP-B
4 row aso buffer
Timer output compare functions
do not have output pins
MC68HC05X1
12K
336
16--bit:
SSI
24 i/o
tI'
KBI (8 pins)
SAE Jl850 Serial Mux Interface
5 V Operation Only
44 PLCC-FN
16 i/o
tI'
CAN (Controller Area Network)
KBI (t6 pins)
28S0IC-OW
64QFP-FU
(1IC,20C)
MFT, RTI
l6-bit:
(1IC, tOC)
MFT, RT!
MC68HC05X4
4K
176
MC68HC05X16
15K
352
255
16-bit:
(2IC,20C)
SCI+
8ch
(8-bit)
2 ch
(8-bit)
32 i/o
tI'
CAN (Controller Area Network)
KBI (8 pins)
EEPROM Write Protect
MC68HC05X32
32K
528
255
16-bit:
(2IC,20C)
SCI+
8ch
(8-bit)
2 ch
(8-bit)
32 i/o
tI'
CAN (Controller Area Network)
KBI (8 pins)
EEPROM Write Protect
On-Chip Charge Pump
64QFP-FU
On-Chip Charge Pump
Motorola Master Selection Guide
2.5-9
Single-Chip Microcontrollers (CSIC)
ONE-TIME PROGRAMMABLE (OTP) I EMULATOR MCUs
All 68HC705 products have a standard operating voltage range from 3 V to 5.5 V unless noted in Comments.
All 68HC705 products have a standard operating temperature range from 0 - 70°C.
Contact a Motorola Sales Office for availability of extended temperature versions.
Table 6. One-Time Programmable (OTP)/Emulator MCUs
Motorola
Part
EPROM
(Bytes)
RAM
(Byles)
MC68HC70585
6K
176
MC68HC705B16
15K
352
Number
EEPROM
(Bytes)
255
Serial
AID
PWM
16-blt:
(2IC,20C)
SCI+
8ch
(S-bit)
2ch
(S-bit)
24 Va
8i
20
16-bit:
SCI+
8ch
(8-bit)
2ch
(8-bit)
32 Va
8ch
(8-bit)
2ch
(S-bit)
32 Vo
16ch
(S-bit)
24i1o
(2IC,20C)
XC68HC705B32
32K
528
MC68HC70SBD3
7.75K
256
MC68HC705C4A
4K
255
176
Display
Drive
11mer
16-bit:
(2IC,20C)
SCI+
MFT, ATI
12C
16-bit:
(1IC,10C)
UO
20
24 i/o
SPI
SCI
7i
COP
Comments
'"
'"
'"
'"
Programmable Pul1downs
(16 pins)
EPROM Write Protect
'"
Mask Option Register Pullups
(8 pins)
KBI (8 pins)
On-Chip Charge Pump
EEPROM Write Protect
52PLCC-FN
*52 Cerquad-FS
64 QFP- FU
On-Chip Charge Pump
EEPROM Write Protect
52 PLCC-FN
56SDIP-B
64QFP- FU
Horizontal and Vertical Sync
Signal Processor
8K
304
16-bit:
(1IC,10C)
SPI
SCI
24 i/o
7i
'"
42 SDIP-B
*42 Cersdip - K
40DIP-P
*40Cerdip-S
1 High Current Pin (20 rnA sink)
EPROM Security
MC68HC705CBA
Packages
56SDIP-B
52PLCC-FN
Mask Option Pullups (8 pins)
KBI (8 pins)
1 High Current Pin (20 rnA sink)
High Speed Option (HSC705C8A)
Superset of ROM GSA with more
RAM
40 DIP- P
44PLCC-FN
42 SDIP-B
44 QFP- FB
40 DIP- P
44PLCC-FN
*40 Cerdip-S
42 SDIP- B
44 QFP- FB
*44 Cerquad - FS
EPROM Security
MC68HC705C9A
16K
352
1S-b.:
(1IC,1OC)
SPI
SCI
31 ilo
'"
Mask Option Pullups (8 pins)
KBI (8 pins)
1 High Current Pin (20 rnA sink)
EPROM Security
40 DIP- P
"40 Cerdip-S
"44 Cerquad-FS
44PLCC-FN
42 SDIP- B
44QFP-FB
MC68HC705CJ4
4K
224
16-bit:
(1IC,10C)
MFT
SPI
SCI
12C
29 Vo
3i
8 High Current Pins (lOrnA sink)
12C (Slave Only)
44QFP-FB
XC68HC705D9
16K
352
16-bit:
(1IC,1OC)
SCI
8 High Current Pins (25 rnA sink)
30 kHz PWM
40DIP-P
'44 Cerquad- FS
44 PLCC- FN
MC68HC705E1
4K
368
MFT, ATC
RTI
'"
'"
'"
XC68HC705F6
4K
320
16-bit:
(1IC,10C)
SPI
26 Vo
4i
MC68HC705F8
8K
320
16-bit:
(1IC.1OC)
16-bit:
auto
SPI
50 ilo
20
MC68HC705G1
12K
176
16-b.:
(1IC,1OC)
ATC
SPI
4 ch
(8-bit)
MC68HC705G4
32K
1024
16-bit:
(1IC,10C)
6-bit:
Event Cntr
Dual
SPI
8ch
(S-bit)
MC68HC705J1A
MC68HC705J2
5ch
(6-bit)
31 Vo
20 Vo
4ch
(S-bit)
32 kHz PLL Clock Synthesizer
*28Cerdip-S
28 DIP- P
28S0IC-DW
DTMF Generator
8 High Current Pins (10 rnA sink)
KBI (6 pins)
42 SDIP- B
*42 Cersdip - K
64 QFP-FU
'64CQFP-FZ
'"
DTMF Generator
KBI (8 pins)
8 High Current Pins (10 rnA sink)
Manchester Encoder/Decoder
64 QFP-FU
'64CQFP-FZ
40 Vo
8i
'"
32 kHz PLL
56SDIP- B
*56 Cersdip - K
64QFP- FU
'64 CQFP- FZ
48Vo
'"
KBI (8 pins)
Dual IRQ
Dual Oscillators, Selectable Clock
80QFP-FU
'80CQFP-FZ
KBI (4 pins), EPROM Security
Feature
4 High Current Pins (8 rnA sink)
Mask Option Pulldowns (14 pins)
20DIP-P
20SOIC-DW
'20 Cerdip-S
16i
40
1.2K
64
MFT, RTI
14 Vo
'"
2K
112
MFT. ATI
14 Vo
'"
Single-Chip Microcontrollers (CSIC)
2.5-10
20DIP-P
2OSOIC-DW
*20Cerdip-S
Motorola Master Selection Guide
Table 6, One-Time Programmable (OTP)/Emulator MCUs (continued)
Motorola
Part
Number
MC68HC705K1
EPROM
(Bytes)
RAM
(Bytes)
0.5K
32
EEPROM
(Bytes)
Timer
Serial
AID
Display
Drive
PWM
"0
10 Vo
MFT, RTI
COP
Comments
Packages
'"
4 High Current Pins (8 rnA sink)
PEP (64 bits)
16DIP-P
16S0IC-DW
Programmable Pulldowns (10 pins)
*16Cerdip-S
Low Voltage Reset Mask Option
XC68HC705L1
6K
16-bit:
(2IC,20C)
128
64 Segment
6 ch
(8-bn)
LCD:
(314 x 12116)
17 ilo
15i
20
56SDIP-B
64 QFP- FU
'64CQFP-FZ
*56 Cersdip - K
MC68HC705l5
MC68HC705L16
8K
16K
256
512
16-bit:
(1IC, WC)
RTI
8-bit:
(1IC, WC)
SlOP
16-1>~:
SlOP
156 Segment
LCD:
(1-4 x 27-39)
14 i/o
10 i
KBI (8 pins), Dual Oscillators
8 High Current Pins (10 rnA sink)
SOQFP-FU
'SOCQFP-FZ
Programmable Pullups (24 pins)
150
Open Drain (31 pins)
156 Segment
LCD:
(1-4 x 27-39)
(HC,10C)
RTI
16 ilo
8i
150
'"
KBI (8 pins), Dual Oscillators
B High Current Pins (10 rnA sink)
Programmable Pullups (24 pins)
80QFP- FU
'SO CQFP- FZ
Open Drain (31 pins)
8-I>~:
(HC, WC)
MC68HC705P6
4.5K
16--bit:
176
SlOP
(HC, WC)
MC68HC705P9
MC68HC705T10
2K
12K
128
320
16--bit:
(HC, WC)
SlOP
l6-bit:
(HC, WC)
RTC
12C
16-1>~:
12C
4ch
20 ilo
(8-1>0)
1;
4ch
20 ilo
1i
(a-b~)
1 ch
(8-1>~)
OSD
(64 Char
EPROM)
20 ilo
OSD
(128 Char
EPROM)
40 i/o
8ch
(6-1>it)
1 ch
'"
28DIP-P
2BS01C-DW
*28 Cerdip - S
'"
28DIP-P
28SOIC-DW
"'28 Cerdip-S
Open Drain PWM Outputs
4i
KBI (8 pins)
56 SDIP-B
*56 Cersdip - K
5 V Only
(14-b~)
MC68HC705T16
24K
320
2ch
(HC,20C)
a-bit PAC
(5-bIT)
9 ch
(7-1>it)
1 ch
(14-bit)
'"
12 V Open Drain 110 Lines
(Up to 22)
4 Row aso Buffer
Timer output compare functions
"
LVR, On Chip Charge Pump,
56 SDIP- B
*56 Cersdip - K
do not have output pins
XC68HC705V8
12K
512
128
16-1>~:
SPI
8ch
(B-b~)
(HC, WC)
MFT, RTI
XC68HC705X4
4K
176
1 ch
(6-1>it)
22 ilo
16i1a
16-bit:
(HC, WC)
MFT, ATI
'"
MOLe (Message Datalink
Control)
56 SDIP-B
68 PLCC- FN
68CLCC-FS
5 V Regulator, KBt (16 pins)
56 Cersdip - K
CAN (Controller Area Network)
28SOIC-DW
KBI (16 pins)
"
'Wlndowed packages available only In sample quantities.
Package Definitions
Definitions
CAN
CCTV
COP
DTMF
EBI
IC
12C
IDE
-
ilo
i
-
KBI
LCD
LVI
LVPI
LVR
MDLC
MFT
-
Controller Area Network
Closed Caption Television
Computer Operating Properly (Watch Dog Timer)
Duat-Tone Multi-Frequency
External Bus Interface
Input Capture
Inter-Integrated Circuit
Integrated Device Electronics (18M PCIAT Type)
Bidirectional Input and Output Port Pins
Input Only Port Pins
Key Board Interrupt
Liquid Crystal Display
low Voltage Interrupt
Low Voltage Program Inhibit
Low VoHage Reset
Message Data Link Controller (J1850)
Multi Function Timer
Output Only Port Pins
Motorola Master Selection Guide
oc
OSD
PEEP
PEP
PIO
PLL
PWM
RTC
RTI
SCI
SCI+
SIO
SlOP
SPI
VFD
VREG
WDOG
-
Output Compare
On-Screen Display
Personality EEPROM
Personality EPROM
-
Parallel Input Output (IBM PC/AT Type)
-
Phase-Lock Loop
Pulse-Width Modulation
ReaJ-TIme Clock
Real-Time Interrupt
Serial Communications Interface (asynchronous)
Serial Communications Interface (async. and sync.)
-
Serial Input Output (IBM PC/AT Type)
-
Simple Serial 1/0 Port
Serial Peripheral Interface
Vacuum Fluorescent Display
Voltage Regulator
Watch Dog TImer
2,5-11
8
DW
FA
FB
FE
FN
FS
FT
FU
FZ
K
L
P
S
-
Shrink DIP (70 mil spacing)
Small Outline (Wide-Body SOIC)
7 x 7 mm Quad Flat Pack (OFP)
10 x 10 mm Quad Flat Pack (OFP)
CQFP (windowed) - Samples Only
Plastic Quad (PLCC)
CLCC (windowed) - Samples Only
28 x 28 mm Quad Flat Pack (QFP)
-
t 4 x 14 mm Quad Flat Pack (QFP)
-
COFP (windowed) - Samples Only
Cersdip (windowed) - Samples Only
Ceramic Sidebraze
Dual-in-Line Plastic
Cerdip (windowed) - Samples Only
Single-Chip Microcontroliers (CSIC)
MCU NEW PRODUCTS
All 68HCOS and 68HC70S products have a standard operating voltage range from 3 V to S.S V unless noted in Comments.
All 68HCOS and 68HC70S products have a standard operating temperature range from 0 to 70°C.
Contact a Motorola Sales Office for availability of the following MCUs:
Table 7. MCU New Products
Motorola
Part
Number
RaMI
EPROM
(Bytes)
RAM
(Bytes)
EEPROM
(Bytes)
68HCOSB32
32K
528
256
BBHCOSBD5
7.7SK
68HC05CO
68HCOSE16
Display
Drive
Timer
Serial
AID
PWM
va
COP
16-bit:
(2IC,20C)
SCI+
8ch
(B-bit)
2ch
(B-btt)
32 Vo
II'
On--Chip Charge Pump
EEPROM Wrne Protect
256
MFT, ATI
12C
16ch
(B-btt)
24 i/o
II'
Horizontal and Vertical Sync Signal
Processor
0
512
16-bit:
(lIC, lOG)
MFT
SCI+
18 Vo
II'
Mux or Non-Mux EBI (16-bit)
3 Chip selects, KBI (8 pins)
Programmable Pullups (8 pins)
1 High Current Pin (20 rnA sink)
44PLCC-FN
40 DIP- P
42 SDlP-B
16K
352
320
16-btt:
(2IC,20C)
MFT, RT1
Dual
12C
47 Vo
2i
II'
KBI (8 pins)
LVI
32 kHz Programmable PLL
Perodic Interrupt (0.25, 0.5, 1 s)
440FP-FB
64 OFP- FU
56SDIP-B
64
920
16PEEP
MFT, ATI
10ilo
II'
KBI (4 pins), Programmable
Pulldowns (10 pins), 4 High Current
Pins (8 rnA sink), On-Chip Charge
Pump, 1.8 V EE Read
16DIP-P
16S0IC-DW
20 Vo
II'
KBI (8 pins)
2 High Current Pins
(15mA sink)
28 DIP- P
28S0IC-DW
20ilo
II'
KBI (8 pins)
28 DIP- P
28S0IC-DW
68HC80SK3
68HCOSP7A
2K
128
68HC05P9A
2K
128
16-bit:
(1IC,10C)
SlOP
16-bit:
SlOP
(1IC,10C)
BBHCOSSC26
6K
224
1024
68HC05V7
10K
384
128
68HC705E5
5K
68HC705MC4
4ch
(B-blt)
4 ch
(B-bH)
2 High Current Pins
(15 mAsink)
4ODIP-P
42 SDIP-B
Silo
II'
Smartcard Security Features
On-Chip Charge Pump
High Speed Option
die
44PLCC-FN
22 ito
16i
II'
MDLC (Message Datalink Control)
5 V Power Regulator
KBI (16 pins)
LVR
56SDIP-B
BBPLCC-FN
20 Vo
II'
32 kHz PLL Clock Synthesizer
28 DIP- P
'28 Cerdip-S
28S0IC-DW
22 i/o
II'
1 8-Bit High Current Port
(10 mA Source Pin, 20 mA Max/Port)
1 High Sink Current Pin (10 mAl
Low EMI Pinout
Commutation Mux for PWM
Industrial Motor Control
28DIP-P
'28 Cerdip - S
28S0IC-DW
SPI
384
MFT, ATI
12C
3.5K
176
16-bit:
(2lCor
lIC,10C)
MFT, ATI
SCI
68HC705RC16
16K
350
Infrared
Timer
12 ilo
II'
Mask Option Pullups (12 pins)
KBI (12 pins)
28DIP-P
'28 Cerdip - S
28S0IC-DW
68HC70SRC17
16K
350
Infrared
Timer
12 ito
II'
Mask Option Pullups (12 pins)
KBI (12 pins)
Phase-Locked Loop (PLL)
28DIP-P
*28 Cerdip - S
28S0IC-DW
68HC705SR3
4K
192
8-bitTimer
(7-hit
prescaler)
Mask Option Pullups (24 pins)
KBI (8 pins), LED Drive (8 pins), LVR
40DIP-P
*40 Cerdip - S
42SDIP-B
440FP-FB
68HC70SX32
32K
528
BBHC08XL36
36K
68HC708XL36
36K
2 hi sp
(B-bH
24kHz
Max)
24 Vo
4ch
(B-bit)
32 Va
II'
CAN (Controller Area Network)
640FP-FU
SCI
SPI
43 Vo
II'
8 MHz Intemal Bus (5 V)
Direct Memory Access Module (3 ch)
Programmable PLL, LVIILYR
KBI (8 pins),
Programmable Pullups (8 pins)
56SDIP-B
640FP-FU
SCI
SPI
43 Vo
II'
8 MHz Internal Bus (5 V)
Direct Memory Access Module (3 ch)
Programmable PLL, LVI/LVR
KBI (8 pins),
Programmable Pullups (8 pins)
56SDIP-B
*56 Cersdip - K
64 OFP-FU
'64CQFP-FE
16-bit:
(21C,20C)
SCI+
lK
4 ch 16-bit:
(IC,OC,or
PWM)
lK
4 ch 16-bit:
(IC,OC,or
PWM)
Single-Chip Microcontrollers (CSIC)
6ch
(B-bit)
1 ch
(6-bit)
Packages
52PLCC-FN
56SDIP-B
640FP-FU
lB-bH:
(lIC, lOC)
MFT, RTI
255
8ch
(8-bH)
Comments
8ch
(B-bit)
2ch
(8-bit)
2.5-12
Motorola Master Selection Guide
M68HC08 Family
V"-~
The M68HC08 Family offers a unique combination of
high-speed, low-power, enhanced processing performance
for cost-sensitive 8-bit applications. Full upward object code
compatibility with the world's leading 8-bit microcontroller
allows current M68HC05 users to leverage their resource and
time investment. M68HC08 modular design utilizes a growing
library of on--chip peripherals. The flagship 68HC(7)08X36
OTP and ROM versions for general purpose use are the first
two devices in the family.
i'rrv'
~::>
Features
SERIAL
COMMUNICATIONS
INTERFACE
RAM
• Architecturally Enhanced 8-Bit CPU
• 8 MHz bus speed yields 125 ns minimum instruction
cycle
• 18-bit stack with stack pointer operations and
addressing modes
• 16-bit index register
• 78 new instructions including advanced looping control
• Eight new addressing modes
• Fully upward object code compatible with the M68HC05
and M6805 families
• Direct Memory Access Module
• Memory-ta-memory transfer
• Peripheral-ta-memory and memory-ta-peripheral
transfer
• Timing Interface Module
• Four independently programmable channels
• Input capture, output compare, buffered, and
unbuffered PWM configurations
• Interface Modules
• Serial Communications Interface (UART)
• Serial Peripheral Interface
• System Interface Module
• System Control Modules
• Low Voltage Inhibit, PLL, COP, and System
Integration Module
• Clock Generator Module
• Generates two different clock signals from a
user-selected source
Motorola Master Selection Guide
SERIAL
PERIPHERAL
INTERFACE
ROM/EPROM
K==>
TIMING
INTERFACE
MODULE
CPU08
e
CLOCK
GENERATOR
MODULE
~r
(
V
SYSTEM
CONTROL
MODULE
DIRECT
MEMORY
ACCESS
MODULE
Figure 3. Block Diagram of Typical M68HC08 MCU
2.5-13
Single-Chip Microcontrollers (CSIC)
process. Or, create an MMDS system to add
high-performance, advanced emulation features such as
real-time, dual-ported memory and a real-time bus state
analyzer with an 8K trace buffer. In addition, the MMDS
includes a built-in power supply and is fully enclosed in a
metal case. Both the MMEVS and MMDS include a
host-based Integrated Development Environment (IDE)
comprised of an editor, assembler, and hardware debugger.
M68HC05 Microcontroller
Development Tools
Motorola now offers two fully modular development system
choices: the new Motorola Modular Evaluation System
(MMEVS) and our popular, high-performance Motorola
Modular Development System (MMDS). You can now build a
customized MMEVS or MMDS to emulate the MCU in your
target design in four simple steps. First, order the MMEVS or
MMDS system platform (M68MMPFB0508 or M68MMDS05).
Second, select and order the emulation module (EM) that
contains circuitry specific to emulating the particular HC05/08
MCU in your target application. Third, complete the system by
ordering target cable accessories to connect the MMEVS or
MMDS to your target MCU socket. Finally, select the
appropriate parallel programmer to program your prototype
devices.
Modular Architecture Benefits
The MMEVS replaces Motorola's older-style EVS and
EVM development tool products. A proper subset of the
MMDS architecture, the new MMEVS is fully compatible with
all EM products supported by the MMDS. The MMEVS
extends the emulation performance beyond that of the EVS
and EVM by supporting full, real-time, non-intrusive,
in-circuit emulation for the new high-speed devices
(68HSC05) in the HC05 Family and the new HC08
architecture. The MMEVS also extends emulation support to
all low-voltage HC05/HC08 derivatives. The common
hardware, firmware, and software design of the MMEVS and
MMDS also provide greater flexibility in mixing and matching
Motorola hardware tools with the ever-increasing variety of C
compilers, assemblers, and integrated development
environment product offerings from Motorola's third party
developer companies.
Choosing Between the MMEVS
and MMDS
Build an economical MMEVS system to perform traditional
debugging activities such as executing code in run or step
mode; setting breakpoints; monitoring or modifying CPU
registers, memory and application variables; and creating log
or script files to record test results or automate the testing
CONFIGURATION AND ORDER INFORMATION FOR MMDS/MMEVS
Table 8. Configuration and Order Information for MMOSIMMEVS
In-Circuit Target Cable
Devices
Platform
Emulation
Modules
68HC05A16
68HC705A24
M68MMPFB0508 QB
M68MMDS05
M68EM05A24
68HC05B4IB6/B8/B161B32
68HC705B5/B161B32
M68MMPFB0508 OR
M68MMDS05
M68EM05B32
68HC05BD3IBD5
68HC705BD3IBD5
M68MMPFB0508 OR
M68MMDS05
M68EM05BD3
68HC05BS8
68HC705BS8
M68MMPFB0508 OR
M68MMDS05
M68EM05BS8
68HC05CO
M68MMPFB0508 QB
M68MMDS05
M68EM05CO
68HC05C5
68HC705C5
Package Type
Low Noise
Flexcable
Target Head
Adapter
56SDIP- B
M68CBL05B
M68TB05A24B56
56 SDIP- B
M68CBL05B
M68TB05B32B56
640FP-FU
M68CBL05C
M68TC05B32FU64
52 PLCC-FN
M68CBL05C
M68TC05B32FN52
40 DIP-P
M68CBL05B
M68TB05BD3P40
42SDIP-B
M68CBL05B
M68TB05BD3B42
440FP- FB
M68CBL05C
M68TC05BS8FB44
52 PLCC-FN
M68CBL05B
M68TB05BS8FN52
40 DIP-P
M68CBL05B
M68TB05COP40
42 SDIP-B
M68CBL05B
M68TB05COB42
44PLCC-FN
M68CBL05
M68TC05COFN44
440FP- FB
M68CBL05C
M68TC05COFB44
Surface Mount
Adapter
M68TOS064SAGIt
M68TOP064SAIt
M68TOS044SAGlt
M68TOP044SAMOIt
M68TOS044SAGlt
M68TOP044SAMOIt
Refer to the Configuration and Order Information for Other Motorola Development Tools Section to select a development tool for
the 68HC05C5/68HC705C5.
Single-Chip Microcontrollers (CSIC)
2.5-14
Motorola Master Selection Guide
Table 8. Configuration and Order Information for MMDSIMMEVS (continued)
In-Circuit Target Cable
Platform
Devices
68HC05C4IC4A1C8A1C12A
68HC705C4A1705CBA
68HC05C9/C9A
68HC705C9
M68MMPFB0508 QE!
M68MMDS05
M68MMPFB0508 Q.B
M68MMDS05
Emulation
Modules
M68EM05C9
M68EM05C9
Package Type
Low Noise
Flexcable
Target Head
Adapter
40 DIP-P
M68CBL05B
M68TB05C9P40
44PLCC-FN
M68CBL05C
M68TC05C4FN44
440FP- FB
M68CBL05C
M68TC05C9FB44
42SDIP-B
M68CBL05B
M68TB05C9B42
40 DIP-P
M68CBL05B
M68TB05C9P40
44PLCC-FN
M68CBL05C
M68TC05C9FN44
42SDIP-B
M68CBL05B
M68TB05C9B42
44 OFP-FB
M68CBL05C
M68TC05C9FB44
Surface Mount
Adapter
M68TOS044SAG1t
M68TOP044SAM01t
M68TOS044SAG1t
M68TOP044SAM01t
68HC05CCV
68HC705CCV
Refer to the Configuration and Order Information for Other Motorola Development Tools Section to select a development tool for
the 68HCOSCCV/68HC705CCV.
68HC05CJ4
68HC705CJ4
M68MMPFB0508 QE!
M68MMDS05
M68EM05CJ4
68HC05D9/D241D32
M68MMPFB0508 OR
M68MMDS05
M68HC05D32EM
68HC705D9
68HC05E6
68HC705E6
68HC05F4
68HC705F4
68HC05F6
68HC705F6
M68MMPFB0508 OR
M68MMDS05
M68MMPFB0508 QE!
M68MMDS05
M68MMPFB0508 OR
M68MMDS05
M68EM05E6
M68EM05F4
M68EM05F6
440FP- FB
M68CBL05C
M68TC05CJ4FB44
M68TOS044SAG1t
M68TOP044SAM01t
40DIP-P
M68CBL05B
M68TB05C9P40
44PLCC-FN
M68CBL05C
M68TC05C9FN44
44 OFP- FB
M68CBL05C
M68TC05C9FB44
M68TOS044SAG1t
M68TOP044SAM01t
28S0IC-DW
M68CBL05C
M68TC05E6P28
M68DIP28S0lC
440FP-FB
M68CBL05C
M68TC05E6FB44
M68TOS044SAG1t
M68TOP044SAM01t
M68TC05E6P28
28 DIP-P
M68CBL05C
28S0IC-DW
M68CBL05C
M68TC05E6P28
M68DIP28S0lC
44 OFP-FB
M68CBL05C
M68TC05E6FB44
M68TOS044SAG1
M68TOP044SAM01t
42 SDIP-B
M68CBL05B
M68TB05F6842
440FP-FB
M68CBL05C
M68TC05F6FB44
M68TOS044SAG1t
M68TOP044SAM01t
64 OFP- FU
M68CBL05C
M68TC05F6FU64
M68TQS064SAG1t
M68TQP064SAM01t
68HC05F8
68HC705F8
Refer to the Configuration and Order Information for Other Motorola Development Tools Section to select a development tool for
the 68HC05F8I68HC705F8.
68HC05G1
68HC705G1
M68MMPFB0508 QE!
M68MMDS05
M68EM05G1
68HC05G3
68HC705G4
M68MMPFB0508 OR
M68MMDS05
M68EM05G4
68HC05J1
68HC705J2
M68MMPFB0508 QE!
M68MMDS05
M68HC05JPEM
68HC05J1A
68HC705J1A
M68MMPFB0508 OR
M68MMDS05
M68EM05J1A
68HC05J3
68HC705J3
M68MMPFB0508 OR
M68MMDS05
M68EM05J3
68HC05KO/K1/K3
68HC705K1
M68MMPFB0508 QE!
M68MMDS05
M68EM05K3
68HC05L1
68HC705L1
M68MMPFB0508 QE!
M68MMDS05
M68EM05L1
68HC05L2
68HC705L2
M68MMPFB0508 QE!
M68MMDS05
M68HC05L2EM
Motorola Master Selection Guide
56 SDIP- B
M68CBL05B
M68TB05G1 B56
64QFP- FU
M68CBL05C
M68TC05G1 FU64
M68TOS064SAG1t
M68TQP064SAM01t
80 OFP- FU
M68CBL05E
M68TE05G4FU80
M68TQS080SBG1t
M68TOP080SBM01t
20DIP-P
M68CBL05A
M68TA05J2P20
20S0IC-DW
M68CBL05A
M68TA05J2P20
20 DIP-P
M68CBL05A
M68TA05J2P20
20S0IC-DW
M68CBL05A
M68TA05J2P20
M68DIP20S0lC
20DIP-P
M68CBL05A
M68TA05J2P20
M68DIP20S0lC
20S0IC-DW
M68CBL05A
M68TA05J2P20
M68DIP20S0lC
16 DIP-P
M68CBL05A
M68TA05K1 P16
16S0IC-DW
M68CBL05A
M68TA05K1 P16
M68DIP16S0lC
56 SDIP-B
M68CBL05B
M68TB05L1B56
M68TQS064SAG1t
640FP-FU
M68CBL05C
M68TC05L1FU64
M68TOP064SAM01t
42 SDIP-B
42-SDIP ribbon cable assembly included with M68HC05L2EM.
2.5-15
Single-Chip Microcontrollers (CSIC)
Table 8. Configuration and Order Information for MMDSJMMEVS (continued)
In-Circuit Target Cable
Devices
Platform
Emulation
Modules
Package Type
Flexceble
Target Head
Adapter
Surface Mount
Adapter
M68EML05L16
80 QFP- FU
M68CBL05E
M68TEOSL16FU80
M68TQS080SBG1t
M68TQP080SBM01t
Low Noise
68HC05L5IL16
68HC70SLS/L 16
M68MMPFB0508 OR
M68MMDSOS
68HCOSL7/L9
68HC705L10
68HCOSL11
68HCOSM4
Refer to the Configuration and Order Information for Other Motorola Development Tools Section to select a development tool for
the 68HCOSL7/L9, 68HCOSL 10, 68HC05L11, or 66HCOSM4.
68HCOSP3
M68MMPFBOS08 OR
M68MMDSOS
M68EMOSP3
28 DIP-P
M68CBLOSA
M68TAOSX4P28
28S0IC-DW
M68CBLOSA
M68TAOSX4P28
28 DIP- P
M68CBLOSA
M68TAOSP8P28
28S0IC-DW
68HC05P8
M68MMPFB0508
M68HCOSJPEM
M68CBLOSA
M68TAOSP8P28
68HC05P1/P4IP6/P7/P9
68HC70SP6/70SP9
M68MMPFBOS08 OR
M68MMDSOS
M68HC05P9EM
(Included with
MMDS)
28 DIP-P
M68CBLOSA
M68TAOSP9P28
28S0IC-DW
M68CBL05A
M68TAOSP9P28
M68EM05RC16
28 DIP- P
M68CBL05A
M68TA05RC16P28
28S0IC-DW
M68CBLOSA
M68TA05RC16P28
68HC05RC16
68HC705RC16
M68MMPFB0508 OR
M68MMDS05
68HC05SC11/SC21/SC241
SC27
CONTACT
SALES OFFICE
M68EM05SR3
M68DIP28S0lC
M68DIP28S0lC
M68DIP28S0lC
M68DIP28S0lC
ISO Adapter Included w/EM.
die/card
40 DIP-P
M68CBL05B
M68TB05SR3P40
44 QFP- FB
M68CBL05C
M68TC05SR3FB44
42SDIP-B
M68CBL05B
M68TB05SR3B42
68HC05SR3
68HC705SR3
M68MMPFB0508 OR
M68MMDS05
68HCOST11T2
Refer to the Configuration and Order Information for Other Motorola Development Tools Section to select a development tool for
the 68HC05T11T2.
68HC05T10
68HC70ST10
M68MMPFB0508 QB
M68MMDS05
M68EM05T7
68HCOSV7
68HC70SV8
M68MMPFBOS08 OR
M68MMDS05
M68EMOSV8
68HCOSX4
68HC70SX4
M68MMPFBOS08 OR
M68MMDSOS
M68EM05X4
68HC05X16/X32
68HC70SX32
M68MMPFBOS08 OR
M68MMDSOS
M68EML05X32
56SDIP-B
M68CBL05B
M68TQS044SAG1t
M68TQP044SAM01t
M68TB05T7B56
56 SDIP-B
M68CBLOSB
M68TBOSV8BS6
68 PLCC- FN
M68CBLOSB
M68TBOSV8FN68
M68TA05X4P28
28DIP-P
M66CBL05A
28S0IC-DW
M68CBLOSA
M68TAOSX4P28
M68DIP28S0lC
64QFP-FU
M68CBLOSE
M68TE05X32FU64
M68TQS064SAG1t
M68TQP064SA1t
..
• Development tools that are scheduled for availability dUring 1Q96.
t To support more than one QFP target system, separate purchase of additional TQPACKs is required. Contact your Motorola representative for details.
Each QFP target head includes one TQSOCKET with guides (M68TQSOxxSyG1) and one TQPACK disposable surface mount adapter (M68TQPOxxSy1 (1.2 mm lead
length) or M68TQPOxxSyM01 (1.6 mm lead length». Order additional TQSOCKETs and TQPACKs using part numbers referenced in the Surface Mount Adapters
column to support multiple target systems. Contact your Motorola representative for details.
Single-Chip Microcontroliers (CSIC)
2.5-16
Motorola Master Selection Guide
CONFIGURATION AND ORDER INFORMATION FOR OTHER MOTOROLA
DEVELOPMENT TOOLS (EVM/EVS/ICS)
Table 9. Configuration and Order Information for Other Motorola Development Tools (EVM/EVSJICS)
In-Circuit Target Cable
Low Noise
Devices
68HC05C5
68HC705C5
68HC05CCV
68HC705CCV
68HC05J1A
68HC705J1A
Comments
M68HC05C5EVS
40 DIP-P
Not Available
For DIP package user must
supply a ribbon cable assembly
to interlace to user's target
system.
44 PLCC- P
Not Available
For PLCC package, user has
the option to order
44PLCC05M, which is the
old-iltyle ribbon cable assembly
with PLCC target adapter.
Order
M68HC05CCVEM
and M68HC05PFB
M68HC705JICS
M68HC705KICS
Flexcable
Surface Mount
Adapter
Package Type
42 SDIP-B
M68CBL05B
M68TB05CCVB42
44 QFP- FB
M68CBL05C
M68TC05CCVFB44
20 DIP- P
20S0IC-DW
68HC05KO/KI
68HC705Kl
Target Head
Adapter
Development Tool
16 DIP-P
16S0IC-DW
M68TQS044SAGIt
M68TQP044SAMOlt
20 DIP Ribbon Cable Assembly Included With M68HC705JICS
M68DIP20S0lC
See Above
16 DIP Ribbon Cable Assembly Included With M68HC705KICS
See Above
M68DIP16S0lC
M68HC705KICS In-Circuit
Simulator
For the SOIC package, user
may order M68DIP20S0IC,
which is a 2o-pin DIP to SOIC
adapter.
M68HC705KICS In-Circuit
Simulator
For the SOIC package, user
may order M68DIPI 6S01C,
which is a 16 pin DIP to SOIC
adapter.
68HC05L7/L9
M68HC05L9EVM2
128QFP-FT
Not Available
68HC05Ll0
M68HC05L 1OEVM
128QFP-FT
Not Available
68HC05Lli
M68HC05LtI EVM
100QFP-FU
Not Available
68HC05M4
M68HC05M4EVM
52 PLCC-FN
Not Available
For PLCC package, user has
the option to order 52PLCCU,
which is the old-style ribbon
cable assembly with PLCC
target adapter.
68HC05Tt IT2
M68HC05T2EVS
40 DIP- P
Not Available
For DIP/SDIP package, user
must supply a ribbon cable
assembly to intertace to user's
target system.
Motorola Master Selection Guide
42 SDIP-B
Not Available
44 PLCC- FN
Not Available
2.5-17
For PLCC package, user has
the option to order
44PLCC05M, which is the
old--iltyle ribbon cable assembly
with PLCC target adapter.
Single·Chip Microcontroliers (CSIC)
CONFIGURATION AND ORDER INFORMATION FOR PROGRAMMERS
Table 10. Configuration and Order Informat/on for Programmers
Devices
Comments
Packages Supported
Programmer Boards
52 PLCC- FN
56SDIP-B
M68HC05BPGMR
For QFP package, order M68HC705X32PGMR.
40 DIP- P
42SDIP-B
M68HC705UPGMR
M68HC705UPGMR requires package adapter.
For 40 DIP - P, order M68UPA05BD3P40.
For 42 SDIP - B, order M68UPA05BD3B42.
68HC705C4NC5IC8/C8NC9
40 DIP-PIS
44 PLCC - FNiFS
M68HC05PGMR-2
Order M68ADT05P40FB44 adapter to program
44QFP-FB.
68HC705D9
40 DIP-PIS
44 PLCC - FNiFS
M68HC05PGMR-2
Order M68ADT05P40FB44 adapter to program
44QFP-FB.
68HC705E6
44QFP-FB
28S0IC-DW
M68HC705E6PGMR
68HC705F6
64 QFP - FU/FZ
42SDIP-B/K
M68HC705F6PGMR64
68HC705F8
64 QFP - FU/FZ
M68HC705F8PGMR
68HC705G1
56SDIP-B
64QFP-FU
M68HC705G1 PGMR
68HC705J1A
20DIP-P
M68HC70SJICS
M68HC705JICS In-<:ireuit simulator.
SOIC requires user supplied socket or adapter. (Available
from Yamaichi, part number IC51-Q282-334-1)
68HC705J2IJ3
20 DIP-PIS
M68HC70SJ2PGMR
SOIC requires user supplied socket or adapter. (Available
from Yamaichi, part number IC51-Q282-334-1)
68HC705K1
16DIP-P/S
M68HC705KICS
M68HC705K1GANG
M68HC705K1 GANG Programs up to 8 68HC705K1 S or P.
16S0IC-DW··
M68HC705K1 GANGY
M68HC705K1GANGY Programs up to 8 68HC705K1 S, P,
or OW.
68HC705L1
56 SDIP-BIK
64 QFP - FU/FZ
M68HC705L1PGMR
68HC705L5/L16
80 QFP - FU/FZ
M68HC705L5PGMR
28DIP-P
28S0IC-DW
M68HC705E6PGMR
68HC705B5IB161B32
68HC705BD3
68HC705P3
68HC705P6IP9
28 DIP-PIS
M68HC705P9PGMR
68HC705SR3
40 DIP- P
42 SDIP-B
44QFP-FB
M68HC05SR3PGMRSG
68HC705T10
56 SDIP-B/K
M68HC705T10PGMR
68HC705X4
28 DIP-PIS
28S0IC-DW
M68HC705X4PGMR
68HC705V8
56 SDIP-B
68PLCC-FN
M68HC705V8PGMR
68HC705X32
64QFP-FU
68 PLCC-FN
M68HC705X32PGMR
SOIC requires user supplied socket or adapter.
M68HC05SR3PGMRSG requires package adapter.
For 40 DIP - P, order M68HC05SR3PAP40.
For 42 SDIP - B, order M68HC05SR3PAB42.
For 44 QFP - FB, order M68HC05SR3PAFB44.
..
'Development tools that are scheduled for availability dunng 1096.
··SOIC on M68HC705K1 GANGY only.
Single-Chip Microcontroliers (CSIC)
2.5--18
Motorola Master Selection Guide
THIRD PARTY DEVELOPERS FOR 68HC05 AND 68HC705 FAMILY MCUs
Table 11. Third Party Developers for 68HCOS and 68HC70S Family MCUs
I
Programmers
Sunrise Electronics
USA
USA
Advin Systems Inc.
USA
System General
Corporation
Canada:
Eastern
Western
France
Germany
UK
Hong Kong
Ascend Systems Inc.
USA
Austria!
Germany
France
BP Microsystems
USA
Canada
UK
France
Germany
Hong Kong
Tokyo
Bytek
USA
Netherlands,
UK, Belgium
France
Germany
Hong Kong
Circuit Equipment
Corporation
USA
UK
France
Data 110
USA
Canada
France
Germany
Hong Kong
Japan
Netherlands
UK
E.E. Tools Inc.
Emulation
Technology, Inc.
USA
Canada
Mexico
France
Germany
Japan
France
USA
UK
Germany
(408)243-7000
(800)627-2456
(514) 337-0723
(604) 986-1286
+3313961-1414
+497459-1271
+44 1332-32651
(852)833-5188
(510) 606-2000
(800) 541-3526
+432772-54581
TECI (The Engineers
Collaborative Inc.)
USA
Tribal Microsystems, Inc. USA
Asia
(510) 623-8859
886-2-764-0215
Vel Electronic
+49851-751427
Germany
ICElEvaluation Boards
+33148619528
(800) 225-2102
(713) 688-4600
(905) 602-8550
+441280-700262
+3316941-2801
+49-8856-832616
852-234-166-11
81-3-3817-4980
American Arium
USA
Ashling Microsystems
USA
France
Germany
Dr. Krohn & Stiller
Germany
UK
USA
Emulation Technology,
Inc.
France
USA
UK
Germany
iSystem GmbH
(216) 951-8840
+44 1734-575666
+336185-5767
(206) 88Hl444
(800) 426-1045
(905) 678-Q761
+35 80502-3300
+33-31956-8131
49-89-858-580
81-3-3779-2151
+31-402-582-911
+44-1734-440011
(408) 734-8184
Nash Electronics
USA
Needham's Electronics
USA
(501) 289-6111
(916) 924-8037
Germany
USA
+441628-773070
+3314666-2750
+49 8233-32681
+49896100-0022
+441235-861461
(320) 617 9400
+3316941-2801
(408) 982-0660
+44 1234-266455
+441962-733140
+49 89460-2071
+498104-7044
+498131-25083
(408) 982-0660
(Emulation
Technology Inc)
France
+3362-072-954
(ISIT Societe)
MetaLink Corporation
USA
UK
Canada
Hong Kong
Germany
France
(602) 926-0797
+441491-455907
(613) 226-2365
896-2-501-6699
+498091-55950
+331-39-3956-8131
Orion Instruments
USA
Canada
(408) 747-0440
(416) 609-8396
France
+331-30-54-2222
(Multitest Elect Inc.)
52-5-705-7422
+33 16930-2880
+49 89834-3047
81-538-322822
+3316941-2801
(408) 982-0660
+44 1234 266455
+441962-733140
+49 89-4602071
+4981-047044
(800) 331-7766
(508) 366-3220
. UK
+33 16930-2880
496181-75041
852 29198282
USA
(714) 731-1661
(Eastern Systems)
(407) 994-3520
+3116248-Ql00
Logical Devices
Motorola Master Selection Guide
Japan
France
Germany
(909) 595-7774
(800) 967-4776
(408) 263-6667
81-3-3441-1510
+332015-1133
+41 1982-2050
(800)-336-8321
(802) 525-3458
(BSO France SA)
Pentica Systems
USA
UK
Germany
Sophia Systems
Japan
USA
Vel Electronic
Germany
Yokogawa Digital
Computer Corp
Japan
USA
(800) PENTICA
(617) 275-4419
+44 0734-792101
+497147-3085
(044) 989-7000
(800) 824-9294
+4985175-1427
81-422-56-9101
(408) 747-0400
(Orion Instruments)
2.5-19
Single-Chip Microcontrollers (CSIC)
AssemblerslLinkers/Debuggers
2500 Software Inc.
USA
France
UK
(719) 395-8683
+33 7443-8045
(CK Electronique)
+336185-1914
(Societe L.S.I.T.)
+44 1364-654100
(Greymatter)
+4417183-31022
(System Science)
American Arium
USA
(714) 731-1661
Archimedes Software,
Inc.
USA
(206) 822-8300
Avocet Systems, Inc.
USA
(207) 236-9055
(800) 448-8500
BSOTasking
USA
France
UK
Germany
(617) 894-7800
(800) 458-8276
+33 1-3054-2222
+441252-510014
+49 71-5222090
Byte Craft Ltd.
USA
(519) 888-6511
Cosmic Software
USA
Europe/lntnl
UK
(617) 932-2556
+33 143-995390
+44 1734-880241
HIWARE
USA
(206) 827-4832
(Archimedes)
+33 16013-3668
(CK Electronique Avnet
Group)
+4161331-7151
(HIWARE)
+497031-2895-38
(Diessner)
+44 1734-792101
(Pentica)
+44 1962-733140
(Nohau)
81 3-3293-4716
(Lifeboat)
France
Germany
UK
Japan
IAR Systems
Introl Corp.
USN
Canada
Germany
UK
France
Hong Kong
Japan
USA
UK
France
Japan
Germany
Single-Chip Microcontrollers (CSIC)
P & E Microcomputer
Systems, Inc
USA
(617) 353-9206
PseudoCorp
USA
(541) 683-9173
Software Development
Systems (SDS)
USA
UK
Japan
Asia-Pac.
Germany
(708) 368-0400
+44 1442-876065
+81 (0) 3 3493 7981
+61 (0) 3 720 5344
+49 2534-800170
(H S PGmbH)
TECI (The Engineers
Collaborative Inc.)
USA
(802) 525-3458
(800) 336-8321
Compiler/Real-Time Kernel
Archimedes Software,
Inc.
USA
(206) 822-6300
Avocet Systems, Inc.
USA
(207) 236-9055
(800) 448-8500
BSO Tasking
USA
France
UK
Germany
(617) 894-7800
(800) 458-8276
+33 1-30542222
+44 1252-510014
+49 71-5222090
Byte Craft Ltd.
USA
(519) 888-6511
Cosmic Software
USA
Europe/lntnl
UK
(617) 932-2556
+33 143-995390
+44 1734-880241
Embedded System
Products, Inc.
USA
Europe
(713) 728-9688
+33-143-995-390
(Cosmic Software)
Hi-Tech
(distributed by Avocet
in USA)
UK
Germany
+44-0734-792-101
(Pentica)
+49-7147-3085
(Pentica)
HIWARE
USA
France
(415)-765-5500
Germany
+49 89470-6022
+44 171924-3334
+1-39-61-14-14
2687-1931
03-293-4711
(Lifeboat)
UK
(414) 327-7171
(800) 327-7171
+44171-8331022
(System SCience)
+33 7443-8045
(CK Electronique)
+33 14622-9988
(Micro Sigma SA)
(81) 3 256 5881
(Soft Mart Inc.)
+49 81 04-9074
(Lauterbach GmbH)
Japan
2.5-20
(206) 827-4832
(Archimedes)
+33 16013-3668
(CK Electronique Avnet
Group)
+4161331-7151
(HIWARE)
+497031-2895-38
(Diessner)
+441734-792101
(Pentica)
+44 1962-733140
(Nohau)
81 33293-4716
(Lifeboat)
Motorola Master Selection Guide
Miscellaneous Software and Hardware Support
AMP Incorporated
Canada
Mexico
Europe
Asia/Pacific
(717) 564-0100
(800) 522-6752
(905) 475-6222
(525) 729-0400
+44 1753-676-800
(81) 44-613-8502
Aptronix
(fuzzy logic dev.)
USA
(408) 428-1888
McKenzie (now part of
Berg Electronics)
(adapters, sockets)
USA
Germany
(510) 6512700
+4989150-1001
France
+33 14594-1424
UK
+44 1295-271777
USA
(sockets)
Emulation
Technology, Inc.
(adapters)
France
USA
UK
Germany
+3316941-2801
(408) 982-0660
+44 1234 266455
+441962-733140
+49 89-4602071
+4981-047044
USAR Incorporated
(keyboard encoders)
USA
(212) 226-2042
Yamaichi Elec. Inc.
(sockets)
USA
(408) 456-0797
(Infratron GmbH)
(Green Components)
(Toby Electronics)
+441501-44434
(Neltronic Ltd.)
Motorola Master Selection Guide
2.5-21
Single-Chip Microcontrollers (CSIC)
On-Line Help
Freeware Bulletin Board
CSIC Microcontroller Division
World Wide Web Site
http://design-net.com/csiclCSIC_home.html
The CSIC WWW pages provide a direct line to the latest
information and software for 68HC05 and 68HC08
microcontrollers. The web site provides access to:
The Freeware Data Services are now mirrored on the CSIC
WWW site for easy access. Customers unable to access the
Internet can still access the Freeware development software
and applications software by dial-up modem at 2400 to 9600
baud. To log in:
1. Make sure to set character format to 8-bits, no parity,
1 stop bit
The Latest News and Press Releases
2. Dial (512) 891-FREE (512-891-3733)
Product, Market, and Development Tool Overviews
3. Follow directions from the system
On-Line MCU and Development Tool Selector Guides
The Freeware files are also accessible by anonymous FTP
server:
On-Line Datasheets and Application Notes
freeware.aus.mot.com
(use email address for password)
Development Tool Software Upgrades
Free Development Software
Applications Software
3rd Party Development Tool Information
On-Line Technical Support
Single-Chip Microcontrollers (CSIC)
2.5-22
Motorola Master Selection Guide
Single-Chip
Microcontrollers (AMCU)
In Brief ...
Page
M68HCll Family ............................... 2.6-2
Modular Microcontroller ........................ 2.6-12
The M68HC16 Family ....................... 2.6-14
The M68300 Family ......................... 2.6-19
Development Tools ........................... 2.6-23
Fuzzy Logic .................................. 2.6-26
On-Line Help . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2.6-26
Third-Party Support ........................... 2.6-27
Motorola offers the most comprehensive selection of
high-performance single-chip control systems available
from a single source. Microcontroller device families range
from industry-standard 8-bit controllers to state-<>f-the-art
16- and 32-bit modular controllers. Within the price and
performance categories of each family, there are a variety of
on-chip capabilities to match specific applications.
Motorola device families are structured so that upward
migration need not involve complete code development.
The M68HC11 Family is upward code compatible with
M6800 and M6801 software, while the M68HC16 family is
source-code compatible with the M68HC11 family.
Motorola's newest 8-bit MCU product line, the M68HC08
family, is fully upward object code compatible with the
M68HC05 and M6805 families. In addition, M68300 and
M68HC16 devices share standard internal modules and
bus configurations.
Motorola Master Selection Guide
2.6-1
Single-Chip Microcontrollers (AMCU)
M68HC11 Family
The M68HC11 Family incorporates a flexible central
processing unit and a large number of control-oriented
on-chip peripherals. M68HC11 MCU are upward code
compatible with M6800, M6801, and M68HCOS software.
eight input channels, and most offer 8-bit resolution, although
some provide 1G-bit resolution. A 2 channel, 8-bit DIA is also
available.
Pulse-Width Modulation
Central Processing Unit
The M68HC11 CPU is optimized for low power
consumption and high-performance operation at bus
frequencies up to 4 MHz. Key features include:
• Two 8-bit or one 16-bit accumulator
• Two 16-bit index registers
• Powerful bit-manipulation instructions
• Six powerful addressing modes
• Immediate, Extended, Direct, Indexed, Inherent, and
Relative
• Power saving STOP and WAIT modes
• Memory mapped 1/0 and special functions
• 16x16 Integer and Fractional Divides
• 8x8 Multiply
Some M68HCII Family members have up to six channels
of 8-bit PWM. At a 4 MHz bus frequency, signals can be
produced from 40 KHz to less than 10Hz. PWM signals with
a period greater than one minute are possible in the 16-bit
mode.
Serial Communication
M68HC11 timer architecture is based on a 16-bit free
running counter driven through a software-programmable
prescaler. Features include multiple Input Captures, Output
Compares, Real-Time Interrupt, Pulse· Accumulator, and
Watchdog functions.
All members of the M68HCll Family include a Serial
Peripheral Interface (SPI) and a Serial Communications
Interface (SCI). These on--chip peripherals are designed to
minimize CPU intervention during data transfer.
• The SCI is a full duplex UART-type asynchronous
system that uses standard Non-Return-to-Zero (NRZ)
data format. An on-chip Baud rate generator derives
standard rates from the microcontroller oscillator. Both
transmitter and receiver are double buffered.
• The SPI is a four-wire synchronous communications
interface used for high-speed communication with
specialized peripheral devices and other microcontrollers.
Data is transmitted and received simultaneously; the
Baud rate is software programmable.
On-Chip Memory
Digital
Since its introduction, the M68HC11 Family has provided
versatile combinations of popular memory technologies,
including the first EEPROM on a CMOS microcontroller. The
family has a memory option to fit virtually any application.
• ROM sizes range from 0 to 32K bytes. ROM is typically
factory programmed to contain custom software.
ROMless versions of most M68HC11 Family members
are also available.
• RAM sizes range from 192 bytes to 1.2SK bytes.
M68HCII RAM utilizes a fully static design, and all
devices feature a standby power supply pin for battery
back-up of RAM contents.
• EPROM sizes range from 4K to 32K bytes. EPROM is
especially suited to prototype development and small
production runs. EPROM versions are available in both
windowed and OTP packaging.
• EEPROM sizes range from 0 to 2K bytes. EEPROM is
ideal for storage of calibration, diagnostic, data logging,
and security information. Each M68HC11 device with
EEPROM includes an on-chip charge pump to facilitate
single-supply programming and erasing.
M68HC11 Family I/O is extremely flexible, allowing pins to
be configured to match application requirements. Most I/O
lines are controlled by bits in a Data Direction Register (DDR)
which can configure pins for either input or output. Most lines
have a dedicated port data latch.
Some M68HC11 Family members include a 4--channel
Direct Memory Access (DMA) and a Memory Management
Unit (MMU). The DMA provides fast data transfer between
memories and registers, and includes externally mapped
memory in the expanded mode. The MMU allows up to 1
megabyte of address space in a physical 64 kbyte allocation.
Integrated chip selects help to reduce glue logic.
Several members of the M68HC11 Family also include
programmable chip select circuits. These circuits can be used
to enable external peripherals whenever an access to a
predefined block of memory addresses is made. These
circuits help to reduce extemallogic requirements.
Timer
Digital-to-Analog Conversion
The M68HCII Family provides powerful, on-chip,
multi-channel AID converter systems. Multi-conversion and
multi--channel options allow single or continuous conversion
on single or multiple channels. M68HC11 AID systems have
Single-Chip Microcontrollers (AMCU)
2.6-2
va and .Special Functions
Math Coprocessor
New M68HCll Family members offer a 16-bit on--chip
math coprocessor that accelerates multiply and divide
operations by as much as 10 times. The coprocessor
functions independently of the CPU and requires no special
instructions. The coprocessor is well-suited to low-bandwidth
DSP functions such as closed loop control, servo positioning,
and signal conditioning.
Motorola Master Selection Guide
PULSE ACCUMULATOR
0
ROM-8K BYTES
TIMER
PERIODIC INTERRUPT
RAM-2S6 BYTES
COP WATCHDOG
EEPR0M-512 BYTES
PE7
PES
PES
PE4
PE3
PE2
PE1
PEO
I
L
()
PAl
OC2
OC3
-0:
Ii:
OC4
OCS
IC1
IC2
IC3
~
PA7
PA6
PAS
PA4
PA3
PA2
PA1
PAO
SPI
PDS
PD4
PD3
PD2
SCI
PD1
PD~
UJ
Ii:
0
a..
ND
CONVERTER
M68HC11 CPU
VRH
VRL
RESET
XIRQ
IRQ
XTAL
EXTAL
E
M.QQA
(LlR)
MODB
(VSTBY)
r
I
I
I
I
I
I
I
I
I
I
I
I
a.. a.. a.. a.. a.. a.. a.. a..
~~~~~~~~
1-1-
~-------------------~~
Figure 4. MC68HC11A8 Block Diagram
Motorola Master Selection Guide
2.6-3
Single-Chip rVlicrocontroliers (AMCU)
MODA
(LlR)
MODB
(VSTBY)
XTAL EXTAL
E
IRQ
RESET
INTERRUPT
LOGIC
MODE CONTROL
TIMER
SYSTEM
XIRQ
12 KBYTES ROM
EEPROM 512 BYTES
M68HC11 CPU
RAM 512 BYTES
L
SERIAL
COMMUNICATION
INTERFACE
SCI
VDD
Vss
I
...L
....--_---l
-VRH
-
VRL
AID CONVERTER
~
C>
00
0.. 0..
,....., ->Il:z
00
0..0
~
OC1
OC2/0C1
OC3/0C1
OC4/0C1
IC4/0C5/0C1
IC3
IC2
IC1
I
CHIP
SELECT
r--
~g
>- fIl:z
00
0..0
CSO-CS10
BR
BG
BGACK
FCO
FC1
FC2
I---
GPT
SIM
"--
RXD
TXD
PCSO/SS
PSC1
PSC2
PSC3
SCK
MISO
MOSI
-
r - - r---
U
ADAO
ADA1
ADA2
ADA3
ADA4
ADA5
ADA6
ADA7
DSACKO
AVEC
PF3
OS
EBI
VRH
VRL
Ai':
1MB
0--'
b:g:
~8
--
R/W
r-r-
ADC
A
SRAM
IR011:71
CPU16
--'
Ou..
Il:f>-Il:
Zo
80..
MODCK
~~
CLOCK
DSCLK
DSO
DSI
IPIPE1
IPIPEO
BKPT
TEST
~
I
VSTBY
2.6-14
TSC
TSTME
QUOT
-
Figure 7. MC68HC16Z1 Block Diagram
Single-Chip Microcontroliers (AMCU)
OS
AS
SIZO
SIZ1
~
ADAO
ADA1
ADA2
ADA3
ADA4
ADA5
ADA6
ADA7
~
0
Il:
fZ
0
0
DSACK1
AVEC
~~
'--
IPIPEO/DSO
IPIPE1/DSI
BKPTlDSCLK
Il:ff-Il:
Zo
00..
0
[)i':Ar.KO
DATA [0:15]
~
--'
--'
Ow
_SilO
SIZ1
~
...:0
-~
DS~CK1
--
-
ADDR 0:18
-'
VDDA
VSSA
-
OSM
~-
VSS
--'
0
Il:
>-0
z>Oil:
00
0..
ArR119:23]
TXD
PCSO
PSC1
PSC2
PSC3
SCK
MISO
MOO
SS
VDD
~
BRiCSO
BGlCS1
BGACKlCS2
FCO/CS3
FC1/GS!
FC2/CS5
ADDR19/CSfi
ADDR20/W
ADDR21/.csa
ADDR22LCS9
ADDR23/CS10
FREEZE
r-
RESET
HA
BERR
MODCK
IR01
IR02
IR03
IR04
IR05
IR06
IRQ7
CLKOUT
XTAL
EXTAL
XFC
VDDSYN
--
TSTMEfTSC
FREEZE/OUOT
--'
0
Il:
fz
0
0
-
Motorola Master Selection Guide
CSBOOT
PWMA
PWMB
PCLK
PAl
IC1IPGPO
IC2IPGPl
IC3/PGP2
OCl/PGP3
OC2IOC1/PGP4
OC3/0Cl/PGP5
OC4/0Cl/PGP6
IC4/0C5/0Cl/PGP7
,,,---'
(!:lo
li:g:
OZ
,,-8
ICl
IC2
IC3
OCl
OC2IOCl
OC3/0Cl
OC4/0Cl
IC4IOC5/0Cl
~
,
CHIP
SELECT
,~g
Ii:!z
:;(8
SIM
UI
MISO
MOSI
SCK
QSM
E'CS.l
--
~
PCS3
TxD
EBI
---.J
DSACKO
DSACKl
AVEC
PE3
OS
AS
SIZO
SIZl
1MB
---=t.
r - - .--- .----
ADDR~9/PC6
~DDR23/CSl O/ECLK.
v "-
...---'
OUJ
g:1i:
Zo
8"-
-
DS/PE4
AS/PE5
SIZO/PE6
SIZ1/PE7
~-
DATA [0:15]
...--
05
IPIPEO/DSO
CHIP
SELECTS
BGLCSM.BGACKlCSE
FC2
FCI
FCO
TPUCH[15:0]
T2CUK
VSTBY
CSBOOT
B8!CSQ
VSTBY
ADDR23/GS.1.0/ECLK
ADDR221CS91PC6
ADDR21/CS91PC5
ADDR20lCSllPC4
ADDB19JCS6/PC3
FC2ICS5/PC2
FCl/Eill
FCO/CS3JPCO
CPU16
PADA7/AN7
PADA6/AN6
PADAS/AN5
PADA4IAN4
PADA3/AN3
PADA2/AN2
PADAlIANI
PADAO/ANO
ADDR[l B:l1YPA[7:0]
ADDR[23:0]
TPU
2 KBYTES
STBRAM
ADDR[10:3]/PB[7:0]
2KBYTES
TPURAM
ADC
ADDR[2:0]
VRH
VRL
SIZ1/PE7
S1Z01PE6
AS/PE5
DS/PE4
VDOA
VSSA
EEL
AllECIff2
DSACK1IPEI
DSACKO/PEO
VDD~
VSS~
1MB
EBI
DATA[15:B]/PG[7:0]
-=-
DATA[7:0yPH[7:0]
GPT
PGP7/1C4/0C5/0Cl
PGP6/0C4IOCI
PGP5/0C3IOCI
PGP4IOC2IOCI
PGP3IOCI
PGP2IIC3
PGP111C2
PGPOIICI
IlLW-
IC4IOC5IOCI
OC4/0Cl
OC3/0Cl
OC2/0Cl
OCI
IC3
IC2
ICI
BESET
IJAI..L
BERR
4BKBYTES
FLASH
EEPROM
MCCI
PWMA
PWMB
PCLK
PAl
PMC7ITXDA
PMC6/RXDA
PMC5ITXDB
PMC4IRXDB
PMC3JSS
PMC2/SCK
PMCl/MOSI
PMCO/MISO
PWMA
PWMB
PCLK
PAl
o~
",0
Ii: ~
28
CLOCK
TXDA
RXDA
TXDB
BlmB
SS
SCK
MOSI
MISO
TEST
TSC
QUOT
FREEZE
lBQZIPF7
lBQ6/PF6
lBQ5/PF5
JBQ4/PF4
lBQliPF3
lBQ2/PF2
IRQ1/PFl
MODCLKlPFO
CLKOUT
XTAL
EXTAL
XFC
VDDSYN
TSC
FREEZE/QUOT
vPP
Figure 10. MC68HC916Y1 Block Diagram
Motorola Master Selection Guide
2.6-17
Single-Chip Microcontrollers (AMCU)
Table 18. M68HC16 Family Modular Microcontrollers
Part
Number
ROM
SRAM
EEPROM
Timer
I/O
Serial
ADC
Integration
Module
Package
Comments
MC68HC16Z1
-
lK
-
GPT
46
QSM
8Ch,
lo-Bit
SIM
132-FC
132-FD
144-FM
144-FV
MC68HC16Z2
8K
2K
-
GPT
46
QSM
8Ch,
lo-Bit
SIM
132-FC
132-FD
20 Address Lines,
12 Chip Selects,
Synthesized Clock
MC68HC16Yl
48K
2K
-
TPU+GPT
95
MCCI
8Ch,
lo-Bit
SCIM
16o-FT
16o-FM
20 Address Lines,
9 Chip Selects, Single
Chip or Expanded Mode
lK
2KBEFIash
48KFIash
GPT
70
QSM
8Ch,
IO-Bit
RPSCIM
12o-TH
20 Address Lines,
5 Chip Selects, Single
Chip or Expanded Mode
4K
48K Flash
TPU +GPT
95
MCCI
8Ch,
IO-Bit
SCIM
16o-FT
16o-FM
20 Address Lines,
9 Chip Selects, Single
Chip or Expanded Mode
XC68HC916Xl
XC68HC916Yl
-
Single-Chip Microcontroliers (AMCU)
2.6-18
20 Address Lines,
12 Chip Selects,
Synthesized Clock
Motorola Master Selection Guide
The M68300 Family
The high-performance M68300 family is designed for
embedded control applications. Each M68300 MCU
incorporates a 32-bit M68000-based CPU module (CPU32),
a sophisticated integration module, and a number of
dedicated special-purpose modules. In addition to utilizing a
bus protocol similar to that of the M68020, the system
integration module generates external bus-control signals for
-G0::
~
$1
0..
I-
~l
~
M6800 devices, and provides a variety of programmable
chip-select functions. M68300 devices can be placed in
low-power stop mode to minimize power consumption during
periods of inactivity. The M68300 family provides great design
flexibility, performance, and compatibility with exiting
hardware and software.
CHIP
SELECTS
RAM
--
CSO-CS1
:;:=:::
.BE
agou =:
~
BGACK
FCO
FC1
F2
TPU
~li:
u~
EBI
1MB
-
=:
~
AD-A23
DSACK'
DSACK1
AVEC
RMC
DS
AS
SIZO
SIZ1
=:
CSBGGT
BRieso
BG/CS1BGACKICS2
FCOlCS3
FC1/CS4
FC2ICS5
A19/CSS
A20/cr,2
A21/CS8
A22/CS9A23/CS10
r__
AD-A1B)
-'
Ow
"'l-
1-",
20
80..
:::::
:::::
--
OSACKO
DSACK1
mE
BMC
OS
AS
SIZO
SIZ1
DD-D15
R/W
RFf;FT
lAI
BERR
QSM
IRD1-R
MODCK
-
CPU32
CLOCK
TEST
~LKOUT
XTAl
EXTAl
XFC
Vnn~vN
~
TSTME
DUOT
8", eng
ou
uu
'" en
xen
en ~~ ~:iE IgJ
N
~
1-0.. 0..0..
~
II~ I~
~I
1BQ1
l8Q2
a
?go :=:::::
JBQ3.
IIlQ4
~::::: JB.Q5
lBQ6
IRQ?
r::;
~I-- TSTMEITSC
~I--
u
FREEZE/QUaT
L-
aNTRal
CONTROL
PORTD
IgJ
N
'" uu
8~
ou
enu
xen
1-0.. ~~ 0.. en
:5
uo
en en Ci51~
0 0 o!!:
-8
----
r - _ MOOCK
oen r:s
~ft.l
::;;::;;
~I~ ~
I~ ~ I~
Figure 11. MC68332 Block Diagram
Motorola Master Selection Guide
2.6-19
Single-Chip Microcontrollers (AMCU)
VFPE16K
TPUCHAN15-TPUCHANO
T2CLK
VSTBY
CHIP
SELECTS
RXD
...IXQfOS7
ECS3/QS6
ECS2IOS5
CS800T
llI3ICS!L
8GICSM-
-----ECS1JQS4
PCSOISSlOS3
SCKlOS2
MOSI/OS1
MISO/OSO
BGACKlCSE
FC2
FC1
FCO
OSM
512
BYTES
SRAM
3.5
KBYTES
SRAM
TPU
16KBYTES
FLASH
EEPROM
ADDR23JCSWIECLK
ADDR22!CS9IPC6
ADDR21/CSBIPCS
ADDR20/CS1IPC4
ADDB19iCS6IPC3
FC2/CS5IPC2
FClIEl::1
FCO/CS3JPCO
ADDR[18:11]/PA[7:0]
ADDR[23:0]
ADDR[10:3]IPB[7:0]
ADDR[2:0]
SIZ1/PE7
SJZOIPE6
ASlPE5
IlSIEE4
BMCIPE3
AllEC.lEE2
DSACKlIPE1
DSACKOIPEO
1MB
EBI
DATA[15:8]IPG[7:0]
AN7/PADA7
AN6/PADA6
AN5/PADA5
AN4IPADM
AN3JPADA3
AN2/PADA2
AN1IPADA1
ANO/PADAO
VRH
VRL
PADB7
PADB6
PADB5
PADB4
PADB3
PADB2
PADB1
PADBO
DATA[7:0YPH[7:0]
BlW.-
BESET
HAlT
BERRISCENB
ADC
In
c
-
APPLICATIONS
1/0:
~
GENERAL
1/0
APPLICATION
PROCESSOR
1010
PARAllEL
PORT
SERIAL
PORT
RAM
1K12K BYTES
100
2TIMERJ
COUNTERS
EEPROM
51212K BYTES
ROM
10K BYTES
"-
"\.
CLOCKING
AND
CONTROL
ClK1
ClK2
SERVICE
RESET
Figure 13. MC143120 (32-Lead SOG)
LONWORKS Products
2.7-2
Motorola Master Selection Guide
NEURON CHIPS (continued)
MC143150 Features
application program. The NEURON IC supports a maximum
clock rate of 10 MHz.
Both NEURON CHIPS have eleven I/O pins (10.0 - 10.10)
to provide flexible interfacing to external hardware and access
to two internal timers/counters. 10.4 - 10.7 have optional
pull-up resistors. Pins 10.0 - 10.3 have high current sink
capability (20 mA @ 0.8 V) while the others have a standard
sink capability of 1.4 mA @ 0.4 V. All I/O pins have TTL-level
inputs with hysteresis.
There are two versions of the MC143150 NEURON IC that
offer different cost and technical advantages. The
MC143150FU operates up to a maximum clock rate of 10 MHz
over a temperature range of -40 to +85°C. The
MC143150FUl is a lower cost device that operates up to
5 MHz over the same temperature range and consumes less
power. The key difference between the two ICs is in the cost
saving gained by using an external 200 ns EPROM memory
device with the MC143150FUl as opposed to a 90 ns memory
device for a 10 MHz clock rate with the MC143150FU.
The MC143150 conlains an additionallKofon-chip RAM
(2K total) but no on-board ROM. An external memory
interface allows the system designer to use 42K of the
available 64K of address space for application program
storage. The remaining address space is reserved for
LONTALK communications protocol, operation system, and up
to 34 I/O models which are supplied with the LON BUILDER
Developer's Workbench or NODEBulLDER Development Tool.
The protocol and application code can be located in external
ROM, EEPROM, NVRAM, or battery-backup static RAM. The
MC143150 is available in a 64-pin QFP.
Shared Strengths
Of the three processors on-board each NEURON CHIP, two
(MAC and Network processors) implement a communication
subsystem, enabling the automatic transfer of information
from node to node. The remaining processor handles the
Integrated Circuits
Motorola
Part No.
Description
LeadsPackage
Samples
Production
Document#
MC143120DW
NEURON IC lK RAM/512 EEPROM/10K ROM, 10 MHz, 1.2 11m
32-50G
PhaseOut
Phase Out
MC143120B1DW
NEURON IC lK RAM/512 EEPROM/10K ROM, 10 MHz, 0.8 11m
32--50G
Now
Now
BRl134/D
DL159/D
MC143150FU
NEURON IC 2K RAM/512 EEPROM, 10 MHz, 1.2 11m
64-POFP
Phase Out
Phase Out
MC143150FUl
NEURON IC 2K RAM/512 EEPROM, 5 MHz, 1.2 11m
64-POFP
Now
Now
MC143150B1FU
NEURON IC 2K RAM/512 EEPROM, 10 MHz, 0.8 11m
64-POFP
Phase Out
Phase Out
MC143150B1FUl
NEURON IC 2K RAM/512 EEPROM, 10 MHz, 0.8 11m
32-S0G
1095
1095
MC143120E2DW
NEURON IC 2K RAM/2K EEPROM, 10 MHz, 0.71 11m
32-S0G
4095
1096
Motorola Master Selection Guide
2.7-3
LONWORKS Products
'"'-
r'CP4
MAC
PROCESSOR
en
en
::>
CD
NETWORK
PROCESSOR
en
en
UJ
ex:
Cl
Cl
«
::>
CD
NETWORK
COMM.
PORT
~
Cl
CP3
CP2
CP1
CPO
!:::
CD
a,
!:::
;
APPLICATIONS
1/0:
GENERAL
1/0
APPLICATION
PROCESSOR
1010
PARALLEL
PORT
SERIAL
PORT
RAM
2K BYTES
100
2TIMERI
COUNTERS
EEPROM
512 BYTES
ADDRESS
DATA
"-
""-
RIV!'
CLOCKING
AND
CONTROL
CLK1
CLK2
SERVICE
RESET
E
Figure 14. MCl43150 (64-Lead PQFP)
LONWORKS
Products
2.7-4
Motorola Master Selection Guide
LONWORKS
Technology Overview and Architecture
LONWORKS technology is a complete solution for
implementing distributed control networks. These networks
consist of nodes that communicate with one another over a
variety of communications media using LONTALK protocol, a
common, message-based communications protocol. In a
LONWORKS application, nodes sense, monitor, count,
measure time, manage switches and relays, and respond to
conditions reported by other smart nodes.
LONWORKS technology includes all of the hardware and
firmware functions needed to process data within nodes and
to communicate information among nodes through a variety
of network physical layers. In one convenient package,
designers can now access all the elements required to design,
install, and support control networks. Those elements include:
the MC143150 and MC143120 NEURON CHIPS, LONWORKS
transceivers, the LON BUILDER Developer's Workbench, and
LONTALK protocol.
LONTALK protocol features seven layers, each optimized for
control networks, and is based on the OSI reference model.
LONTALK protocol is embedded within the firmware of
Motorola's NEURON CHIPS and is the foundation of the
LONWORKS technology networking solution.
Networking Medium (Twisted Pair, RF, Power Line, etc.)
Figure 15. MC143150 in a Typical Node Block Diagram
Network Transmission Medium
LONWORKS
Router
Network Transmission Medium
Figure 16. The MC143150 or MC143120 in a LONWORKS Network
Motorola Master Selection Guide
2.7-5
LONWORKS Products
LONBulLDER
Developer's Workbench(1)
Thanks to Echelon's LON BUILDER and NODEBulLDER tools, as
well as Motorola's extensive technical support network, both
system and device manufacturers can.now develop control
networks quickly and inexpensively. These tools provide
developers with everything needed to begin building
LONWoRKs-based products immediately. The NODE BUILDER
Development Tool is used to design individual LONWORKS
products while the LON BUILDER Developer's Workbench
features the tools required to develop systems consisting of
multiple LONWORKS nodes. Best of all, technical support for
LONWORKS technology is available worldwide through
Motorola's 30 LONWORKS design centers.
LON BUILDER Developer's Workbench combines three
development tools - a multi-node development system, a
network manager, and a protocol analyzer - into an
integrated hardware and software development environment.
This development system provides the tools to create
software applications and prototype hardware on a network
ranging from two to hundreds of nodes. The network manager
installs and configures nodes during development, making
them easy to connect, define, and build. The protocol analyzer
monitors the network and interprets its activity.
The LON BUILDER Developer's Workbench includes two PC
interface cards, two LONWORKS transceivers, an expandable
development station with two NEURON CHIP emulator cards,
DOS-based software for compiling, loading, integrating and
testing LONWORKS applications, and Windows-based
software for monitoring and controlling a LONWORKS
application.
The LONWORKS NODE BUILDER Development Tool is used to
design LONWORKS nodes. The NODEBulLDER tool does not
include the system integration and test tools incorporated into
the LON BUILDER Developer's Workbench, but does include all
the tools required to compile, load, and test code for a
LONWORKS node. NODEBulLDER includes Windows-based
software, a PC interface card, a prototype LONWORKS node,
and two LONWORKS transceivers that are used to develop and
test LONWORKS nodes.
The LON BUILDER development tool requires a PC with an
available 8- or 16-bit slot, DOS 3.3 or higher, 64K bytes of
RAM, mouse, and a hard disk with 10M bytes of available
storage. The NODE BUILDER tool requires a Microsoft®
Windows-compatible PC with an available 16-bit slot,
8M bytes of RAM, mouse, and a hard disk.
(1) Motorola supports these tools, but they should be purchased through Echelon Corporation (1-800-258-4566).
LONWORKS Products
2.7-6
Motorola Master Selection Guide
LONWORKS
Support Tools
Motorola's LONBulLDER support tools offer the user a quick
and flexible means to demonstrate or test a LONWORKS based
product which was developed and debugged on the
LONBulLDER Developer's Workbench. The family of tools
consist of NEURON CHIP based development boards, 1/0
application boards, a Differential Direct Connect Transceiver
Board (for the LONBulLDER Developer's Workbench), and a
RJ45
M143204EVK
DIFFERENTIAL
DIRECT
CONNECT
TRANSCEIVER
I/O
GIZMO 4
M143207EVK
I/O INTERFACE
BOARD
RJ45
GIZMO 3
MC143120
M143206EVK
I/O INTERFACE
BOARD
NEURON CHIP
EVALUATION BOARD
RJ45
MC143120/50
sockets
sockets
111~ ~ too
ll
{~:~"d':f:'.{
:"::; i .:;: : x: ':
~! : : .:.
MEMORY
P3~~.~.1
.'d . .
1;31~il
I/O
M143205EVK
NEURON CHIP
M143208EVK
I/OTESBOARD
TEST/PROGRAMMING
BOARD
Figure 17. Evaluation and I/O Interface Boards
Motorola Master Selection Guide
2.7-7
LON WORKS Products
NEURON CHIP Test/Programming Board. The unique
. advantages that these tools offer are:
• The boards all have RJ45 connectors allowing ease of
connectivity.
• The NEURON CHIP boards contain a 5 volt regulator
allowing for a wider range of power supply voltages.
• A common 2 x 10 connector for interface to the NEURON
CHIP I/O pins.
Motorola Support Tools for
• A library of application functions are available from
Motorola .
• An inexpensive means of demonstrating LONWORKS
based products.
This document covers a brief detail on each of the boards.
For further information, contact Motorola'S LONWORKS
applications support team in Austin, Texas at 512-505-8330
or FAX 512-505-8312.
LONWORKS
Motorola
Part No.
Description
Production
M143120EVK
143120 NEURON IC Custom Node Development Board with Socket, Supports all
MC143120 NEURON Chips
M143120B1EVBU
MC143120B1 DW NEURON IC Custom Node Development Board
M143150EVK
MC143150FU NEURON IC Custom Node Development Board
M143150B1EVBU
MC143150B1FU NEURON IC Custom Node Development Board
M143204EVK
Direct Connect Transceiver Board
M143206EVK
NEURON IC I/O Interface Board (Gizmo 3)
M143207EVK
NEURON IC I/O Interface Board (Gizmo 4)
M143208EVK
NEURON IC I/O Interface Test Board (Gizmo 5)
M143213EVK5
NEURON IC RF Radio with EIA-232 Interface (US Version)
M143213EVK6
NEURON IC RF Radio with EIA-232 Interface (European Version)
M143214EVK5
NEURON IC RF Radio with I/O Interface (US Version)
M143214EVK6
NEURON IC RF Radio with I/O Interface (European Version)
M143215EVK5
RF Radio for Router Interface (US Version)
M143215EVK6
RF Radio for Router Interface (European Version)
M143221EVK
EIA-232 EVBU Interface Board
M143222EVK
Intelligent Neuron IC Cards (5 Cards, to be used
M143223EVK
NEURON Chip Card Reader Board (to be used with M143222EVK Cards)
M143226EVK
Intelligent NEURON IC Kit with UART Port
M143232EVK
ADPCM Voice Application Kit
LONWORKS Products
2.7-8
w~h
Document#
BR1139
M143223EVK Card Reader)
Motorola Master Selection Guide
LONWoRKS Literature
Motorola
Document No.
Echelon
No.
Description
LONWORKS Technology Device Data
NEURON CHIP Product Overview
LONWORKS Support Tools
DL159/D
BR1134/D
BR1139/D
Current versions (Q4/95) of the following Engineering Bulletins and Application Notes are incorporated into Motorola
publication DL 159/0, LON WORKS Technology Device Data.
AN1208lD
AN1211/D
AN1216/D
AN 1225/0
AN1247/D
AN1248/D
AN1250/D
AN1251/D
AN 125210
EB146/D
EB147/D
EB148/D
EB149/D
EB150/D
EB151/D
EB1521D
EB153/D
EB155/D
EB157/D
EB159/D
EB161/D
EB167/D
EB168/D
EB169/D
EB170/D
EB171/D
EB1721D
EB173/D
EB174/D
EB175/D
Parallel I/O Interface to the NEURON CHIP
Interfacing DACs and ADCs to the NEURON IC
Setback Thermostat Design Using the NEURON IC
Fuzzy Logic and the NEURON CHIP
MC683XX to NEURON CHIP Parallel I/O Interface
Interfacing the PSD3XX to the MC143150
Low-Cost PC Interface to LONWORKS Based Nodes
Programming the MC143120 NEURON CHIP
MIP Guidelines and Design Issues
005-0003-01 A
005-0006-01B
005-0001-01B
005-0011-01 A
005-0009-01 A
005-o004-D1A
005-0002-01 A
005-0014-01B
005-o019-01B
005-o016-01B
005-o022-o1B
005-0017-01 B
005-0043-01 A
005-o006-01C
005-0032-o1C
005-0010-01 A
005-0013-01 B
005-0024-D1 A
005-0027-o1F
005-0023-01 A
005-007-01G
NEURON CHIP Quadrature Input Function Interface
LONWORKS Installation Overview
Enhanced Media Access Control with Echelon's LONTALK Protocol
Optimizing LONTALK Response Time
NEURON CHIP EIA-485 Transceiver
Scanning a Keypad with the NEURON CHIP
How to Use SNVTs in LONWORKS Applications
Driving a Seven-Segment Display with the NEURON CHIP
Analog-to-Digital Conversion with the NEURON CHIP
Creating Applications with the LON BUILDER Multi-Function I/O Kit
NEURON CHIP-Based Installation of LONWORKS Networks
LONTALK Protocol
A Hybrid System for Fast Synchronized Response
EIA-232C Serial Interfacing with the NEURON CHIP
LONWORKS 78 kbps Self-Healing Ring Architecture
LONTALK Response Time Measurements
NEURON 3150 CHIP External Memory Interface
LONWORKS Custom Node Development
The SNVT Master List and Programmer's Guide
Junction Box and Wiring Guidelines for Twisted Pair LONWORKS Networks
NEURON C Extended Arithmetic Support
The following documents can be ordered from Echelon Corporation.
078-0001-01 A
076-0002-01
076-0140-01
Lon Builder User's Guide
NEURON C Programmer's Guide
NEURON C Reference Guide
Contact Motorola or Echelon (415-855-7400) for additional documentation.
Motorola Master Selection Guide
2.7-9
LONWORKS Products
LoNWORKS Products
2.7-10
Motorola Master Selection Guide
Memory Products
In Brief ...
Motorola's memory product portfolio has been expanded
to support a broad range of engineering applications.
Included in this portfolio are asynchronous devices with
access times of 6 ns at 256K-bit density, 6 ns at 5 V 1
Megabit density, 8 ns at 3.3 V 1 Megabit density, as well as
synchronous FSRAMs with access times as fast as 6 ns and
8.5 ns.
Motorola's Fast Static RAM Division goal is simple:
speed. All of our SRAMs are designed to provide the highest
performance, cost efficient solutions available.
The Dynamic Memory Products Division utilizes
alliances as a vehicle for global customer support in the
DRAM and memory module markets. The product portfolio
consists of high-density DRAMs, standard and custom
memory modules, and PCMCIA Flash cards.
Motorola Master Selection Guide
Fast Static RAMs ... , ............... , .......... .
Introduction ................................ .
Application Specific Static RAMs .............. .
Asynchronous 6 to 15 ns 5 V Fast Static RAMs ..
Asynchronous 12 to 35 ns 5 V Fast Static RAMs.
Fast Static RAM Modules .................... .
Dynamic RAMs ............................... .
Introduction ................................ .
DRAM Modules ............................ .
Dynamic RAMs (HCMOS) ................... .
2.8-1
Page
2.8-2
2.8-2
2.8-2
2.8-3
2.8-3
2.8-4
2.8-5
2.8-5
2.8-5
2.8-6
Memory Products
Fast Static RAMs
Introduction
Mgtorola is designing the fastest, most technologically
advanced fast SRAMs. From 0.8 11m to 0.5 11m with access
times as fast as 5 V 6 ns 256K, 6 ns 1M, 13ns 4M, and
8 ns 3.3 V 1M, these devices are progressively smaller,
faster, and lower cost. These SRAMs are designed to provide
the highest performance, cost efficient solutions available.
Selected fast SRAMs are also available on 2M and 8M
memory modules.
Application specific memories are designed for
high-performance microprocessors that require more
specialization from memory cache than is available from
standard devices. Products include those for use with digital
signal processors as well as a variety of popular
microprocessors.
SYNCHRONOUS
APPLICATION SPECIFIC FAST STATIC RAMs (5 to 35 ns)
3.3 V Supply
OrganiDescription
zatlon
BurstRAMsTM
32Kx32
Packaging
(ns Max)
Technology
Production
MCM63P532
100
(TO) TOFP
7/8/9
HCMOS
1096
Pipelined BurstRAM for PowerPCTM /Pentiumnt MPUs.
Flow-through BurstRAM for PowerPC/Pentium MPUs.
Access Time
Comments
MCM69F536A
100
(TO) TOFP
8.519110112
BiCMOS
Now
MCM69P538A
100
(TO) TOFP
5/617
BiCMOS
Now
Pipelined BurstRAM for PowerPc/Pentium MPUs.
64Kx18
MCM69F618A
100
(TO) TOFP
8.519/10/12
BiCMOS
Now
Row-through BurstRAM tor PowerPClPentium MPUs.
MCM69P618A
100
(TO) TOFP
5/617
BiCMOS
Now
Pipelined BurstRAM for PowerPC/Pentium MPUs.
64Kx18
MCM69T618
119
(ZP) PBGA
5/617
BiCMOS
2096
100 MHz Cache Tag RAM.
32Kx36
Tag RAM
Pin
Count
Motorola
Part Number
SV Supply
Organi-
Motorola
Pin
Pro-
zatio"
Part Number
Count
Packaging
AccessTlme
(nsMax)
Tech-
Description
nology
duct'on
Comments
Integrated
Cache
32Kx36
MPC2604GA
357
(ZP) PBGA
66 MHz
BiCMOS
1096
Integrated L2 cache for PowerPC processors.Two components
for 256KB solution. and four for 512KB.
Solutions
BurstRAMs
64Kx18
32Kx18
MCM67B618A
52
(FN) PLCC
9/10112
BiCMOS
Now
BurstRAM (flow-through) for 4861Pentium. 3.3 V output levels.
MCM67C618A
52
(FN) PLCC
517
BiCMOS
Now
BurstRAM (pipelined) for 4861Pentium. 3.3 V output levels.
MCM67H61BA
52
(FN) PLCC
9110112
BiCMOS
Now
Supports Pentium pipelined address mode.
MCM67J618A
52
(FN) PLCC
517
BiCMOS
Now
Supports Pentium pipelined address mode.
MCM67M61BA
52
(FN) PLCC
9/10112
BiCMOS
Now
BurstRAM (flow-through) for PowerPC. 3.3 V output levels.
MCM67B518
52
(FN) PLCC
9/10/12
BiCMOS
Now
BurstRAM (flow-through) for 486/Pentium. 3.3 V output levels.
Not recommended for new designs.
MCM67C518
52
(FN) PLCC
617/9
BiCMOS
Now
BurstRAM (pipelined) for 486/Pentium. 3.3 V output levels. Not
recommended for new designs.
MCM67H518
52
(FN) PLCC
9/10/12
BiCMOS
Now
Supports Pentium pipelined address mode. Not recommended
for new designs.
MCM67J518
52
(FN) PLCC
617/9
BiCMOS
Now
Supports Pentium pipelined address mode. Not recommended
for new designs.
MCM67M518
52
(FN) PLCC
9/11/14
BiCMOS
Now
BurstRAM (flow-through) for PowerPC. 3.3 V output levels.
Not recommended for new designs.
DSPRAMTM
8Kx24
MCM56824A
52
(FN) PLCC
20125/35
HCMOS
Now
Designed for DSP56001 applications. replaces 3 8Kx8's.
General
Synchronous
128Kx9
MCM670709
B6
(ZP) PBGA
516
BiCMOS
Now
General synchronous separate 1/0 with write pass through.
3.3 V output levels.
256Kx4
MCM670B04
38
400 (WJ) SOJ
5/6
BiCMOS
Now
Graphics; general RISC. Register to register. Revolutionary
pinout. 3.3 V output leve~. Write pass through. Separate I/O.
16Kx16
MCM62990A
52
(FN) PLCC
12/15120125
HCMOS
Now
Designed for advanced RISC-CSIC cache applications
MPC27T416
80
(TO) TOFP
9/10112
BiCMOS
2096
14 tag bits. 2 status bits. Sampling 2096.
8Kx8
MCM62X3OB
28
300 (J) SOJ
15/17
HCMOS
Now
Une buffer for processing digital data.
4Kx12
MCM62973A
44
(FN) PLCC
18/20
HCMOS
Now
Pipelined SRAM with chip select.
MCM62974A
44
(FN) PLCC
18/20
HCMOS
Now
Pipe lined SRAM with output enable.
MCM62975A
44
(FN) PLCC
25130
HCMOS
Now
Output enable.
Memory Products
2.8-2
Motorola Master Selection Guide
ASYNCHRONOUS
6 to 15 ns FAST STATIC RAMS
3.3 V Supply
OrganiDensity
zatian
1M
128Kx8
256Kx4
Count
Packaging
Package width In mils
Access Time
(ns Max)
Technology
Production
MCM6926
32
400 (WJ) SOJ
8110/12115
BiCMOS
1096
Revolutionary pinout.
MCM6929
32
400 (WJ)SOJ
8110/12115
BiCMOS
1096
Revolutionary pinout.
Pin
Count
Packaging
Package width in mils
Access Time
(ns Max)
Technology
Production
Motorola
Part Number
Pin
Comments
5VSupply
OrganiDensity
zalion
Motorola
Part Number
1M
64Kx18
MCM67A618A
52
(FN) PLCC
10112115
SiCMOS
Now
General asynchronous, latched address and data.
128Kx8
MCM6726B
32
400 (WJ) SOJ
8110/12
BiCMOS
Now
Use for new quais and design. Revolutionary
MCM6726C
32
400 (WJ) SOJ
6f7
BiCMOS
Now
Revolutionary pinout.
MCM6729B
32
400 (WJ)SOJ
8110/12
SiCMOS
Now
Use for new quais and design. With output enable.
Revolutionary pinout.
MCM6729C
32
400 (WJ) SOJ
6f7
BiCMOS
Now
Revolutionary pinout.
MCM6706B
28
300 (J) SOJ
8110
BiCMOS
Now
Not recommended for new designs. Potential
substitute MCM6706BR.
MCM6706BR
32
300 (J) SOJ
6m8
BiCMOS
Now
Revolutionary pinout.
Pin
Count
Packaging
Package width in mils
ACC8ssTlme
(ns Max)
Tool>-
Pro-
nology
duction
400 (J) SOJ
12115
HCMOS
2096
Comments
pinout.
256Kx4
256K
32Kx8
12 to 35 ns FAST STATIC RAMS
3.3 V Supply
Density
Organizatlon
1M
64Kx16
MCM6323
44
128KxB
MCM6326
32
400 (J) SOJ
12115
HCMOS
3096
Revolutionary pinout. Samples 2096.
32KxB
MCM6306D
28
300 (J) SOJ
15120/25
HCMOS
Now
3.3 V Fast SRAM
Pin
Count
Packaging
Package width in mils
Access Time
(ns Max)
Technology
duction
36
400 (WJ) SOJ
20/25135
HCMOS
Now
Output enable. Revolutionary pinout.
256K
Motorola
Part Number
Comments
Revolutionary pinout. Samples 1096.
5V Supply
Organizatlon
4M
512KxB
MCM6246
lMx4
MCM6249
32
400 (WJ) SOJ
20/25135
HCMOS
Now
Output enable. Revolutionary pinout.
1M
64Kx16
MCM6223
44
400 (J) SOJ
12/15
HCMOS
2096
Revolutionary pinout. Samples 1096. 3.3 V lias.
128Kx8
MCM62268
32
400 (WJ) SOJ
15117/20/25
HCMOS
Now
Not for new designs. Suggest MCM6226BB.
MCM62268A
32
400 (WJ) SOJ
17120125
HCMOS
Now
Not for new designs. Suggest MCM6226BB.
MCM6226BB
32
300 (J), 400 (WJ) SOJ
15117120/25
HCMOS
1096
Samples 4095.
MCM6326
32
400 (J) SOJ
12/15
HCMOS
3096
Revolutionary pinout. Samples 2096. 3.3 V lIas.
MCM62298
28
400 (WJ) SOJ
15117/20/25
HCMOS
Now
Not for new designs. Suggest MCM6229BB.
256Kx4
256K
Motorola
Part Number
Pro-
Density
Comments
MCM62298A
28
400 (WJ) SOJ
17120/25
HCMOS
Now
Not for new designs. Suggest MCM6229BB.
MCM6229BB
28
300 (J), 400 (WJ) SOJ
15/17120125
HCMOS
1096
Samples 4095.
lMxl
MCM62278
28
300 (J), 400 (WJ) SOJ
15117/20/25
HCMOS
Now
Separate 110. Replaces 6227A
16Kx16
MCM62996
52
(FN) PLCC
12115120125
HCMOS
Now
Choice of 5 V or 3.3 V power supplies for output
buffers. For wide bus applications.
MCM62995A
52
(FN) PLCC
12115120125
HCMOS
Now
DSP96000 and RISC applications. Latched address
inputs.
Replaces MCM6206D.
32Kx8
MCM6206BA
28
300 (J) SOJ
12115/20/25
HCMOS
Now
32Kx9
MCM620S0
32
300 (J) SOJ
15120/25
HCMOS
Now
Motorola Master Selection Guide
2.8-3
Memory Products
j
DEVICEIPART NUMBER DESIGNATORS
SYNCHRONOUS DEVICE
ASYNCHRONOUS DEVICE
~~~~~enl
!fC]7
MC=Oualified
SC= Special
Memory
62=5VCMOS
63 = 3.3 V CMOS
67 = 5 V BiCMOS
69 = 3.3 V BiCMOS
I
B
MotorolaCompone~ntM
~t
Die
Speed (ns)
Pacl\age" (WJ = Wide SOJ,
J = SOJ, FN = PLCC,
TB = TAB)
(Qualified)
Memory
Revi::~~lutiOnary Pinout*
Blank =First qualified Motorola device
= First die size change/spec change
B =Second die size change/spec change
SA = First qualified foundry device
A
Density:
=256K
2=IM
4=4M
6= 16K
8=64K
o
Width:
5=x9
A
B
C
Width:
04=x4
08=x8
09=x9
16=x 16
18=x18
24=x24
32=x32
36=x36
Async w/Address and
Data Latch
= x86 Burst COunt
x86 Burst Count and
Output Register
Dual 110
Flow-Through BurstRAM
x86 Burst Count with Address
Disable
x86 Burst Count with Address Disable
and Output Register
MolOroIa (PowerPC) Bursl Count
Pipellned BurstRAM
Sep.1I0
Cache Tag
Line Buffer
M
P
o
T
" These deSignators apply to current products - future products will not necessarily
follow this scheme.
Ole Revision
=
F
H
NOTE: There are some exceptions to these device numbering schemes, i.e.,
MCM62990A is a CMOS 16Kx 16 and NOT a 512Kx 90 device. MPC designates
devices designed to work with PowerPC microprocessors and support chips.
Pacl\age (WJ = WIde SOJ,
FN = PLCC, J = SOJ,
ZP = PBGA, TO = TOFP)
.
62=5V CMOS
63 = 3.3 V CMOS
67 = 5 V BiCMOS
69 = 3.3 V BiGMOS
o
6""x8
7=x1
8=x4
9=x4withOE
PL¥-~
X
' - - - - - Deplh:
3 = 8K Address Depth
4 = 16K Address Depth
5 = 32K Address Depth
6 = 64K Address Depth
7 = 128K Address Deplh
8 = 256K Address Depth
FAST STATIC RAM MODULES (Contact Fast Static RAM Marketing for Custom Fast SRAM Modules)
PowerPC Processor Applications
Description
Chip Sot
Functionality
Cache Size
Access Time
(Max)
Productlon
Packaging
Motorola
Part Number
PowerPOM Cache
Modules
Motorola MPC105,
Motorola MPC106
Flow-Through Burst
512KB Cache
66 MHz
1096
136 Pin DIMM (SG)
MPC21 03
Asynchronous
256KB Cache
15 ns
1096
PowerPC Cache
Modules with 16K x 15
CacheTag
Motorola MPC105,
Motorola MPC106
Flow-Through Burst
256KB Cache
66 MHz
TBD
182 Pin Card Edge (SG)
MPC2104
Flow-Through Burst
512KB Cache
66 MHz
1096
MPC2105
Flow-Through Burst
1MB
66 MHz
1096
MPC2106
Asynchronous
256KB Cache
15ns
TBD
MPC2107
MPC2101
Pentium and other x86 Processor Applications
Description
ChipSet
Functionality
Cache Size
Accessl1me
(Max)
Production
Packaging
Pentium™ L2 Cache
Modules
Inlel 62430 FX
Triton chip set
Piped Burst
512KB Cache
66 MHz
Now
160 Pin Card Edge (SG)
256KB Cache
66 MHz
Now
Asynchronous
256KB Cache
15 ns
Now
160 Pin Card Edge (SG)
MCM64AF32
Flow-Through Burst
512KB Cache
60/66 MHz
Now
136 Pin DIMM Fonn Factor. (SG)
MCM72BA64
256KBCache
60/66 MHz
Now
Flow-Through Burst
512KB Cache
60166 MHz
Now
Intel 82430 PCI
chip set
Motorola
Part Number
MCM72JG64
MCM64PA32
MCM72BA32
160 Pin Card Edge (SG)
MCM72BF64
VLSI82C590
Asynchronous
256KB Cache
15 ns
Now
160 Pin Card Edge (SG)
MCM64AG32
Corollary, Ross
Computer
Piped Burst
512KB Cache
66 MHz
Now
160 Pin Card Edge (SG)
MCM72CB64
RISC Processor Applications
Description
R4000
Secondary Cache
Modules
Cache Size
Access Time
(Max)
Motorola
Production
Packaging
Part Number
Comments
4MB
12/15/17 ns
Now
80 Pin SIMM (SG)
4MB cache using 4 modules. all Tag options
available.
1MB
12/15/17ns
Now
60 Pin SIMM (SG)
1MB cache using 4 modules, all Tag options
availabte.
MCM44256 Series
MCM4464 Series
Networking and Buffer Applications
Description
Organization
Accessl1me
(Max)
Production
Packaging
Slandard FSRAM
Modules
lMx32
20/25 ns
Now
72 Pin SIMM (SG)
Uses eight 4M SRAMs
MCM321 024
512Kx32
20125 ns
Now
72 Pin SIMM (SG)
Uses four 4M SRAMs
MCM32515
Memory Products
2.8-4
Comments
Motorola
Part Number
Motorola Master Selection Guide
Dynamic RAMs
Introduction
DRAMs offer the lowest cost per bit of any memory.
Because of this, they are popular for a wide range of
applications, particularly in the computing environment.
Motorola's Dynamic Memory Products include DRAM
components, memory modules, and PCMCIA Flash cards.
The 4 and 16 MByte DRAM components are offered in
various organizations and surface mount packaging.
Motorola's DRAM Memory Modules include densities up to
64 MByte in both standard and custom configurations.
All devices are fabricated using HCMOS technology and
operate in a 5-volt power supply. However, specific DRAM
products are designed for use in either a 3.3 Volt or 5-Volt
power supply.
The 68-pin Flash ATA card is fully PCMCIA compatible. It
is available in capacities from 1.8 MBytes to 40 MBytes and
capacities can be doubled using data compression
software.
DRAM MODULES (Contact DRAM Marketing for Custom DRAM Modules)
Motorola
Organi-
Byte
Part
zation
Density
Number
Pin
Count
1MxB
1MB
MCM81430
30
(S)
4Mx8
4MB
MCM84000
30
(AS)
MCM84430
30
(S)
MCM84T430
30
(S)
"~~'
·.•.• J.MfI.: •.•
4Mx9
4MB
'1Mx,18 . . ,2MB
~~~2~~1>81<~',~
tMy~~~4~, .•• 1:::3~.:: I:~SI' 1':.0,..
Access Time
(ns Max)
Operating
Current
(rnA Max)
duction
60/70
240/200
Now
60/70
50/60/70
960/800
Now
30---pad SIMM package
260/220/190
Now
30-pad SIMM package; 2--chlp version
50/60/70
260/220/190
Now
3D-pad SIMM package; 2--chip TSOP version
IP \' ')1 1:\, ~:io~~ (I] Lrf
'
:'"
Comments
3D-pad SIMM package; 2-chip version
~r. j>antxapi'l~a!iOn; 3~ip
:~.~> ,,~~Jl'l7~IMN)ac~i\9'>
.ve\s",.~· •• " .• ,
'" ". ":'" '. ". .... '. '. . ' •
MCM94000
30
(AS). (SC)
60/70
1080/900
Now
30 pad SIMM package for parity application
MCM94430
30
(S)
60/70
340/290
Now
30-pad SIMM package; 3-chip version
MCM94T430
30
(S)
60/70
340/290
Now
I (AP). (AS,S) :!>;!. f",j
•. M<:;t..ff8;>ao .. •. I,.•::~;: •.:: .($).,1ii.<3),.'
i I~il ~!;;~~:
'M9M1810.0
·"··1M i:h.
8O
Pro-
\, r::rr~:,:' ifti,SIM"tj>acki'.9.,'fQ~1,&b,i~p~,"y ;;Pl?,I~'IO" '.
,!",j>ad.J?tI<1.M P'\ck"~,fQ' le'.i''R?MYi'Pl?,)icatlq~
4Mx18
8MB
MCM18400
72
(AS). (AS<3)
60/70
680/580
Now
72 pad SIMM package for 16 bit panty application
8Mx18
16MB
MCM1880a
72
(AS), (ASS)
60/70
6921592
Now
72-pad SIMM package for 16 bit parity application
1Mx32
4MB
MCM3210a
72
(OS)
60/70
960/800
Now
Small outline DIMM package,S V
MCM32103
72
(OG)
80
480
Now
Small outline DIMM package, 3.3 V - TSOP
MCM32Ll03
72
(OG)
80
480
Now
Small outline DIMM package, 3.3 V Low power
TSOP
MCM32116
72
(S).(SS)
60/70
370/310
Now
72-pad SIMM package; Uses 1M x 16 SOJ DRAM
MCM32T116
72
(SH)
60170
370/310
Now
72-pad StMM package; Uses 1M x 16 TSOP DRAM
MGM32130
72
(SH). (SHG). (SSH)
60/70
960/800
Now
72-pad SIMM package; SOJ version
MCM32Tl00
72
(S).(SS)
60/70
960/800
Now
72-pad SIMM package; TSOP version
MGM32216
72
(S). (SG)
60/70
374/314
Now
72-pad SIMM package; Uses 1M x 16 SOJ DRAM
MGM32T216
72
(SH)
60/70
374/314
Now
72-pad SIMM package; Uses 1M x 16 TSOP DRAM
MCM32230
72
(SH). (SHG)
60/70
976/816
Now
72-pad SIMM package; SOJ version
72
(S).(SG)
976/816
Now
72-pad SIMM package; TSOP verSion
72
(ASH). (ASHG)
1040/880/760
Now
2Mx32
8MB
MCM32T200
4Mx32
16MB
MGM32400
'.H3MB,.'.
... 4MX$.2"
4Mx32
16MB
8Mx32
32MB
~X3~.: r<·,\~~"
1Mx36
"MCr..j324'p ..
.
'~',?2,'\
4MB
60/70
50/60/70
r.q tll;~1Y!ln
",1'·(5)',.19.<3)."'.,
LJ
i!384q73;'OO" •••• o>"+~t:Jay.t~,o
TSOP
72-pad SIMM package; SOJ version
.pqiJtJl"",slQ(!d.•mQ,dv.!I>VSi~g ~M,D~A!!A'.·'
MGM32420
72
(AOG)
50/60/70
1040/880/760
Now
MGM32400 small outline package, 5.0 V
MGM32423
72
(AOG)
60/70
880/760
Now
MGM32400 small outline package, 3.3 V - TSOP
MCM32800
72
(ASH). (ASHG)
50/60/70
1056/896/776
Now
72-pad SIMM package; SOJ version
MGM32TaoO
72
(ASH). (ASHG)
50/60flO
1056/896/776
Now
72-pad SIMM package; TSOP version
~:~'4;l.~'~~'.~",' I,,'T,",
MCM36104
....2~k~~,. ". '~Ml"""
'
Packaging
··.MQM{l~OQ··
72
, '72.. '"
>
(Aq).·(ASG). f!;l~"l
,iASH$),'
"
(S). (SG)
"" ',A"'i{/(!OlGj.
(S). (SG)
f\.·;.:;':'lr~: ( tIl il:.f'f'2Q<," ":~~< 1"~;~~,,,a.S:M~~C::?~L. ~f:::!"t :-'::
60/70
I';; i. ~\ tlIll!fO
2Mx36
8MB
MCM36204
72
4Mx36
16MB
MCM36400
72
(AS). (ASG). (ASH).
(ASHG)
MGM36404
72
(ASH). (ASHG)
TSOP
60/70
Jii i
1080/900
Now
·11344(U.44." "
'.>l'l!bV(\,
1098/918
Now
. ,l2c;i>"d'l!II4Mp"l''''l~•• o( 'P".lity'l>ppJicet}''''l. "'.
72 pad SIMM package for EGG pinout parity
application; SOJ version
60/70
1360/1160
Now
50/60170
1170/990/855
Now
72-pad SIMM package for parity application; SOJ
version
EGG pinouts, for parity application; SOJ version
60/70
1384/1184
Now
72-pad SIMM package for parity application; SOJ
version
BMx36
32MB
MCM36800
72
(AS). (ASG)
MGM36804
72
(ASH), (ASHG)
50/60/70
1188/1008/873
Now
EGG pinouts, for parity application; SOJ version
1Mx40
4MB
for EDG
MCM40100
72
(AS). (ASG)
60/70
1200/1000
Now
72 pad SIMM package for EGG application; SOJ
version
2Mx40
8MB
for EDG
MGM40200
72
(AS). (ASG)
60/70
1220/1020
Now
72-pad SIMM package for EGC application; SOJ
version
4Mx40
16MB
forEDC
MCM40400
72
50/60/70
1300/1100/900
Now
Replaces MGM40420; SOJ version
.. ':,::
(SH). (SHG)
;:,>:~~~~~~,,::: r:::;:;~:"::'" :~~,i~~~ tF:! t"i fit ,:.:!;:f!:
':"
8Mx40
':>:>":'
( tl i!:rr\)O~:< ,:.~~;::;. ':-::~\~"". "':""~.~pn,,G~~Q~<,"·
..'\.'
MCM40800
72
(SH). (SHG)
1320/1120/970
Now
72-pad SIMM for EGG application; SOJ version
MGM64100
168
(OG)
60/70
2050/1715
Now
16B-pad DIMM package; SOJ version
MCM64Tl00
168
(AOG)
60/70
828/700
Now
166-pad DIMM package; Using 16M DRAM
50/60/70
...:'
.'.'
72 pad SIMM package for EGG, and parity
application; SOJ version
forEDG
lMx64
8MB
Motorola Master Selection Guide
2.8-5
Memory Products
Organization
Byte
Density
Motorola
Part
Number
Pin
Count
MCM64T116
168
Packaging
Access Time
(ns Max)
Operating
Current
(mAMax)
Production
60/70
828/700
4095
lOG)
2Mx64
16MB
MCM64T216
168
lOG)
60/70
TBO
4095
4Mx64
32M
MCM64400
168
lOG)
60/70
2050/1715
1H96
Comments
16S-pad DIMM package; Uses 1M x 16 TSOP
ORAM
16S-pad DIMM package; Uses 1M x 16 TSOP
ORAM
16S-pad DIMM package
NOTE: Package suffixes are enclosed by ( ) in packaging column
AD/ADG = DIMM/Gold Pad DIMM (Board Rev.)
AS =SIMM (Board Revision)
ASG = Gold Pad SIMM (Board Revision)
ASH = Low Profile SIMM
ASHG = Low Profile Gold Pad SIMM
D/DG =Duallnline Module/Duallnline Gold Pad Module
S = SIMM
SC = Industrial Temperature SIMM
SG = Gold Pad SIMM
SH = Short Height SIMM
SSH = Super Short Height SIMM
SHG = Short Height Gold Pad SIMM
DYNAMIC RAMs (HCMOS) (Contact DRAM Marketing)
1Mx4
Memory Products
MCM4L4100C
20/26
300 SOIN)
60/70
110/100
1096
Low power
MCM54100A
20/26
300 SOIN), 300 IT)SOP
60/70
120/100
Now
Fast page mode cycle time
MCM5L4100A
20/26
300 SOIN), 300 IT)SOP
60/70
120/100
Now
Low power
MCM54100A-C
20/26
300 SOJIN), 300 IT)SOP
70/80
100/85
Now
3.3 V Fast page mode cycle time
MCM54100A-V
20/26
300 SOJIN), 300 IT)SOP
70/80
70/60
Now
3.3 V Fast page mode cycle time
MCM5L4100A-V
=45/45 ns
=45/50 ns
=45/50 ns
20/26
300 SOJIN), 300 IT)SOP
70/80
70/60
Now
Low power, 3.3 V
MCM44400B
20/26
300 SOIN)
60/70
110/100
Now
Fast page mode cycle time = 40/45 ns
MCM4L4400B
20/26
300 SOIN)
60/70
110/100
Now
Low power
=45/45 ns
MCM54400A
20/26
300 SOJIN), 300 IT)SOP
60/70
120/100
Now
Fast page mode cycle time
MCM5L4400A
20/26
300 SOJIN), 300 IT)SOP
60/70
120/100
Now
Low power
Industrial temp range (- 40 to + 85°C)
MCM54400A-C
20/26
300 SOIN)
70/80
100/85
Now
MCM5L4400A-C
20/26
300 SOJIN), 300 IT)SOP
70
100
Now
Low power, industrial temp range (--40 to + 85°C)
MCM54400A-V
20/26
300 SOJIN), 300 IT)SOP
70/80
70/60
Now
3.3 V Fast page mode cycle time = 45/50 ns
MCM5L4400A-V
20/26
300 SOJIN), 300 IT)SOP
70/80
70/60
Now
Low power, 3.3 V
MCM518160B
44/50
60/70
180/150
2096
MCM518165B
44/50
60/70
180/150
2096
1K refresh, EDO, 10 row, 10 column
MCM518165BV
42
70/80
145/120
3096
MCM518165BV
44/50
70/80
145/120
3096
3.3 V version of MCM518165B
3.3 V version of MCM518165B
4001T)SOP
2,8-6
1K refresh, FPM, 10 row, 10 column
Motorola Master Selection Guide
Logic: Standard, Special
and Programmable
In Brief ...
Page
Motorola Logic Families: Which Is Besllor You? .... 3.1-1
Motorola Programmable Arrays (MPA) ............ 3.1-5
Selection by Function
Logic Functions ............................ 3.1-13
Device Index .................................. 3.1-40
Ordering Information ........................... 3.1-49
Case Outlines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 3.1-53
Packaging Information ......................... 3.1-86
Surface Mount ............................. 3.1-86
Pin Conversion Tables. . . . . . . . . . . . . . . . . . . . . .. 3.1-86
Tape and Reel. . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 3.1-87
Logic Literature Listing ......................... 3.1-88
This selector guide is a quick reference to Motorola's vast
offering of standard logic integrated circuits. In TTL, popular
due to its ease of use, low cost, medium-to-high speed
operation and good output drive capability, Motorola offers
both LS and FAST. Motorola's CMOS portfolio includes
MC14000B standard CMOS series devices, High-Speed
CMOS consisting of a full line of products that are pinoutcompatible with many LSTTL and MC14000B standard
CMOS logic devices which offers designers a solution to the
long-standing combined barrier - high speed and low
power. Motorola's Emitter Coupled Logic (MECL) is a
non-saturated form of digital logic which eliminates
transistor storage time permitting very high speed operation.
Motorola offers five versions of MECL: MECL 10K, MECL
1OH, MECL III, and the recently introduced families ECLinPS
(ECL in picoseconds) and ECLinPS Lite. Also included are
timing solution products such as clock drivers, clock
generators and programmable delay chips, high
performance and communications products such as VCO's,
prescalers, and synthesizers, and a wide variety of
translators, low-voltage bus interface and serial data
transmission devices. Field programmable logic and in
particular, field programmable arrays, have become the
solution of choice for logic design implementation in
applications where time to market is a critical product
development factor. In addition, reconfigurable arrays have
been used to enhance Customer product flexibility in ways
that no other technology can match.
The Logic I.C. Division publishes a New Product Calendar
quarterly that reflects any recent device releases and the
approximate dates new devices are expected to be released.
This New Product Calendar, BR13321D, can be ordered from
your nearest Motorola Sales Office or from the Motorola
Literature Distribution Center.
Motorola Master Selection Guide
3.0-1
Logic: Standard, Special and Programmable
Logic: Standard. Special and Programmable
3.0-2
Motorola Master Selection Guide
Motorola Logic Families, Which Is Best for You?
By Gary Tharalson, Motorola, Chandler, AZ
Introduction
By selecting the family whose parameters most closely fit
your needs, you can save many future headaches. Obviously,
before selecting a specific device, a detailed review of the
vendor's data sheet specifications is recommended.
When a logic designer is faced with developing a new
product requiring performance significantly different from the
past, it might be well to examine various logic family
alternatives. Selecting a logic family for a new design from
today's rapidly changing semiconductor technologies can be
a perilous task. With the many choices available, it is easy to
under-kill or over-kill an application with inadequate or
excessive capabilities.
Family Comparison
Table 24. compares some typical characteristics of
several popular logic families available in the market today.
The following sections provide brief explanations of the
various parameters.
Table 24. Logic Family Comparison
Logic Families
Typical Commercial
Parameters
(0° to +70°C)
CMOS
TTUABT
ECL
LS
ALS
ABT
FAST
MG
HC
FACT
LVC
LCX
10KH
lOOK
ECLinPS3
E-Lite
9
33
6
7
45
3
2.7
200
3
3
125
2
25
4
100
8
45
4
5
160
2
3.3
200
3.7
3.5
200
3.6
1
330
1
0.75
400
0.70
0.33
1000
0.50
0.22
2800
0.25
5
5
1.2
1.2
0.005
1.0
12.5
12.5
0.0006
0.04
0.003
0.6
0.003
0.8
0.0001
0.6
lE-04
0.3
25
25
50
50
25
25
73
73
+4.5
to 5.5
+4.5
to 5.5
+4.5
to 5.5
+4.5
to 5.5
+3
to 18
+2
t06
+2
t06
+1.2
t03.6
+2
to 3.6
--4.5
to-5.5
--4.2
to --4.8
--4.2 to
-5.5
--4.5
to-5.5
8
8
32164
20
1
4
24
24
24
500
load
500
load
500
load
50Q
load
N/A
N/A
N/A
N/A
N/A
N/A
N/A
NlA
NlA
NlA
N/A
N/A
N/A
YES
NO
YES
YES
N/A
N/A
N/A
N/A
NlA
NlA
N/A
N/A
22
10
22
10
22
10
22
10
30
30
30
30
30
30
30
30
30
30
28
31
41
31
31/31
33
33
YES
YES
NO
NO
NO
YES
YES
YES
YES
NO
YES
YES
NO
YES
NO
YES
YES
YES
YES
NO
YES
YES
NO
NO
YES
YES
YES
NO
YES
YES
YES
YES
YES
YES
YES
NO
YES
NO
YES
YES
NO
YES
NO
YES
YES
YES
NO
YES
NO
NO
YES
NO
NO
NO
NO
NO
NO
YES
NO
NO
NO
YES
NO
NO
NO
Functional Device Types
190
210
50
110
125
103
80
35
272
64
44
48
40
Relative 1-25 Price/Gate
0.9
1
1.6
1
0.9
0.9
1.4
1.8
1.8
2
10
25
32
Speed
OR Gate Prop Delay (tpLH) ns
D Flip-Flop Toggle Rate
MHz
Output Edge Rate
ns
Power Consumption (Per Gate)
Quiescent
Operating (1 MHz)
Supply Voltage
Output Drive
mW
mW
V
mA
5VToierant
Inputs
Outputs
N/A
DC Noise Margin1
High Input
low Input
%
%
28141
Packaging4
DIP
SO
lCC
SSOP
TSSOP
NOTES:
1. Typical noise margin expressed as a percentage of typical output voltage
swing.
2. Announced plans for Motorola offering.
3. ECLinPS is Available in both 10KH and lOOK compatible versions.
4. A "YES" may not include all devices within a family.
VENDORS REFERENCED (DATA BOOK):
lS
Motorola low power Schottky TTL (DL121)
AlS
Texas Instruments Advanced low power Schottky TTL
(SDAD001B)
ABT
Philips Semiconductor (IC23)
FAST
Motorola Advanced Schottky TTL (DL121)
Motorola 14000 Series Metal Gate CMOS (DlI31)
MG
HC
Motorola High-Speed Silicon Gate CMOS (DlI29)
FACT
lCX
lVC
10KH
lOOK
ECLinPS
E-Lite
Motorola Advanced CMOS (DlI38)
Motorola low-Voltage CMOS (BRI339)
Philips low-Voltage CMOS (IC24)
Motorola 10KH Series ECl (DlI22)
National 1OOK Series ECl (FlOOK)
Motorola Advanced ECl (DlI40)
Motorola (ECLinPS Lite) Advanced ECl (DlI4O)
ECLinPS and ECLinPS Lite are trademarks of Motorola, Inc.
FAST and FACT are trademarks of National Semiconductor Corp.
Motorola Master Selection Guide
3.1-1
logic: Standard, Special and Programmable
Logic Families
CMOS
Although there are many family technologies available,
they can be divided into roughly three broad categories:
Transistor-Transistor Logic (TTL), Complementary MetalOxide Semiconductor logic (CMOS), and Emitter-Coupled
Logic (ECL). TTL and ECL are bipolar technologies differing
in implementation techniques, while CMOS (an MOS
technology) differs in fundamental transistor structure and
operation.
Complementary Metal-Oxide Semiconductor (CMOS)
field--effect transistors differ from bipolar both in structure and
operation. The primary advantages of CMOS are its low power
dissipation and small physical geometry. Advances in design
and fabrication have brought CMOS devices into the same
speed and output drive capability as TTL. Again,
enhancements have resulted in the evolvement of additional
classifications: MG (Metal-Gate CMOS), HC (High-speed
silicon-gate CMOS), and FACl'M (Advanced CMOS).
The most recent evolution in CMOS logic has been in
reducing supply voltage without sacrificing performance. The
new LCX family is one outgrowth of this trend. This family
results from the joint efforts of a triumvirate of companies
including Motorola, National, and Toshiba. Although each
company has done its own design and fabrication, they have
mutually agreed to provide identical performance
specifications. In addition to the 3V operating voltage, LCX
inputs and outputs are tolerant of interfacing with 5V devices.
TTL
The designation "bipolar" essentially refers to the basic
component utilized to build this family of integrated circuits, the
bipolar transistor. By employing a bipolar transistor in a logic
function's output driver as well as the input buffer, it results in
a Transistor-to-Transistor (TTL) direct connection. Older
technologies were interconnected via passive components
such as resistors or diodes.
Since the original TTL design, several enhancements have
been employed to reduce power and increase speed.
Common to these has been the use of Schottky diodes which,
ironically, no longer result in strictly TTL connections.
Consequently, the two names, Schottky and TTL, are used in
combination: LS (Low power Schottky), ALS (Advanced Low
power Schottky), and FAST'M (Advanced Schottky) TTL.
The superior characteristics of TTL compared to CMOS, in
the past, have been its relatively high speed and high output
drive; these advantages are rapidly diminishing as described
in the next section. One family of devices, ABT (Advanced
BiCMOS Technology), utilizes TTL circuitry at the inputs and
outputs, and CMOS technology in between-attempting to
combine the advantages of both bipolar and CMOS.
TYPICAL OF ALL OUTPUTS
TTL
VCC
EQUIVALENT OF EACH INPUT
VCC
OUTPUT
INPUT --.-~I-+-...
INPUTS
CMOS
VSS
Logic: Standard, Special and Programmable
3.1-2
Motorola Master Selection Guide
Eel
---1----1--0
OUTPUT
A. B
Ao-~-------+----~
INPUTS
Bo--+-t-{
VEEO-~--~--------~------4-----------~----~
ECl
(edge) rate is highly load dependent, and again, data sheet
specifics must be compared.
Emitter-coupled logic (ECl) derives its name from the
differential-amplifier configuration in which one side of the
diff-amp consists of multiple-input bipolar transistors with
their emitters tied together. An input bias on the opposite side
of the diff-amp causes the amplifier to operate continuously in
the active mode. Consequently, ECl consumes a relatively
substantial amount of power in both states (one or zero) but
also results in the fastest switching speeds of all logic families.
An inherent benefit of ECl is the narrow switching level swing
between devices (approximately 800 mY) which helps to
reduce noise generation.
Power Consumption
The amount of power an application consumes (and the
subsequent heat generated) is frequently of prime
importance. One of the major differences between the three
families, the power parameter may also limit the designer's
choices.
TTL consumes a moderate amount of power and is nearly
constant over operating frequencies up to about 10 MHz;
above 10 MHz it begins to climb rapidly. Although only a few
milliwatts are consumed by each device, in a complete system
a substantial amount of power may be used.
There have also been many evolutionary advancements in
ECl, the following being some of the most prominent: 100K
(1975), 10KH (1981), and ECLinPSTM (1987). Of most recent
vintage is the ECLinPS Lite™ family of single function devices.
By focusing on simplicity, this family achieves very high
performance, while at the same time reducing package size.
CMOS power consumption, on the other hand, is highly
frequency dependent. In quiescent mode (zero frequency), it
consumes almost no power at all, being measured in
microwatts/device. However, its consumption grows almost
linearly with frequency so that at maximum operating
frequency it may be several milliwatts/device. The great power
reduction advantage of CMOS derives from the fact, that in
most applications, the percentage of the total number of
devices operating at high frequencies at any given time is
small; consequently, the average total power consumed by
the system is greatly diminished.
Since power consumption is proportional to the square of
supply voltage, simply redUCing the operating voltage will
have desirable effects. Unfortunately, speed generally falls off
as well. By designing the lCX family specifically for a lower
supply voltage, it was possible to maintain high overall
performance. The lCX family is also designed to interface with
five volt devices, being tolerant of the differences in I/O levels.
Because of its inherent deSign, ECl is the highest power
consumer at frequencies below approximately 50 MHz;
however, at higher frequencies, TTL and CMOS power
consumption can exceed ECL. The amount of power used by
ECl is fairly constant over its entire operating frequency
range. DeSigners of large, high performance ECl systems
may have to employ somewhat more complex cooling and
power distribution techniques.
Speed
Speed is typically the first parameter at which a designer
looks, and when design engineers are asked what features of
a logic family they would like enhanced, usually they want
more speed. But increased speed often brings along many
potential problems such as: increased noise generation,
higher power consumption, increased component and system
cost, more difficult board layout, etc. An assessment of the
other family parameters is usually required before a final
selection is possible.
In Table 24. ,family speed is compared for three
parameters using typical values: propagation delay through a
simple OR gate, flip-flop toggle frequency, and output
switching time. Typical values can be misleading as they are
frequently specified according to different vendor's criteria, but
they are usually close to an average of min and max values.
For final assessment of a particular component's
performance, the min/max spec's provided in most vendor's
data sheets should be examined. Furthermore, switching
Motorola Master Selection Guide
3.1-3
logic: Standard, Special and Programmable
Supply Voltage
Packaging
The power supply voltage required for TTL and ECL is
restricted to fixed values; only a narrow voltage variation is
allowed for the device to remain within specifications. Since
these families also consume substantial amounts of power,
there is a large current flow through the power lines. To avoid
unacceptable voltage fluctuation, various preventive
measures may be necessary such as remote sensing by the
supply regulator, beefing up power buses and filters, and
utilizing multi-layer PC boards with separate power and
ground planes. Typically, a high-speed energy storage
capacitor is required near each logic device; this capacitor
maintains the correct device voltage during high-current
switching.
An important advantage of CMOS is the large range of
supply voltage over which operation is specified. By allowing
systems to be operated at voltages as low as 2V, not only is
power consumption lowered, but noise generation from fast
signal switching is reduced. It must be noted, however, that
operating speed drops off rapidly as the voltage is reduced. As
mentioned previously, this was a significant reason for
developing the LCX family.
Output Drive
An important characteristic of a logic device is its ability to
drive relatively large loads without significant speed
degradation. The older families within TTL, and especially
CMOS, had only limited drive capability (below 10 mAl. All
advanced logic family versions have significantly increased
drive capacity, and several (FACT, LCX and all ECL) are
capable of driving 50 ohm transmission lines directly.
Furthermore, because of the symmetrical sink/source
capability of FACT and LCX, their rise and fall times are nearly
equal, resulting in balanced delay times.
5V Tolerant Input/Output
Because of the limited number of functions available in the
new low voltage CMOS families, a designer might might have
to mix 3V and 5V devices, each operating from 3V and 5V rails,
respectively. Unless the 3V device was specifically designed
with proper protection to tolerate 5V at its input or output, it may
not survive.
Noise Margin
Noise immunity refers to the resistance of a logic device to
undesired switching. Depending on the input level, a noise
glitch that causes a transient across the input switch pointfrom
either a high or low level can result in erroneous operation.
Clearly, the more voltage difference there is between the
switch point and the normal input high and low levels, the more
immunity a logic family has to erroneous switching. In
Table 24. ,these differences are expressed as a percentage
of the swing between typical output high and low voltage logic
levels. High input noise margin is calculated from the formula:
HNM =
VOH - VIH
, and for low input noise margin,
VOH - VOL
LNM =
VIL - VOL
VOH - VOL
Logic: Standard, Special and Programmable
3.1-4
The venerable Dual-Inline package (DIP) is rapidly being
replaced by Small Outline (SO), Shrink Small Outline (SSOP),
Thin Shrink Small Outline (TSSOP), and Leadless Chip
Carrier (LCG) packages for surface mounting. Savings in
footprint area of up to 90% are possible with these newer
packages.
Device Types
In general, the older the family the larger the quantity of
differentfunctional devices available. This is only natural since
it takes time (and substantial resource investment) to design
and reliably manufacture increaSingly more complex devices.
The newer TTL and CMOS families will undoubtedly grow, but
because of competition from higher integrated devices, will be
more limited in scope.
Cost
Here again, the age of a family has a substantial bearing on
its relative selling price. The older families have benefited
longer from manufacturing learning and volume curve cost
reductions. Newer technologies, because of their inherently
more complex process requirements, increased performance
improvements, and higher cost of production, are priced
higher but should decline over time.
Mix and Match
Many designers have found that the best approach to
achieving their particular application performance goal is to
combine devices from several families. The obvious
advantage of this is to optimize the requirements of selected
portions of a design, whether it is for speed, power
consumption, output drive, cost, etc. Some disadvantages are
that devices must be analyzed and tested for compatibility,
inventories may increase, and some performance parameters
may be compromised.
Conclusion
The diversity of logic families available to today's logic
designer may be likened to a bad news/good news scenario.
The bad news is that you have huge ratios between the
highest and lowest performance values-speeds of 500:1,
power at 100,000:1, output drive at 24:1, etc. The good news
is that you have lots of choices-it wasn't too many years ago
that there were very few. By examining and comparing each
family's parameters, an optimal selection can result.
A few potential users of standard logic devices may worry,
that because of the trends towards higher-integration chips,
some vendors will abandon the older product lines. This may
eventually happen; however, the current demand, prOjected
for at least the next decade, indicates that these families have
a very solid future. The diverse applications that keep arising
for semiconductor products that are inexpensive and reliable
continue to mount. Until some totally revolutionary
development should occur, these "oldies, but goodies" will be
around for a long time to come.
Motorola Master Selection Guide
INTRODUCTION TO
MOTOROLA PROGRAMMABLE ARRAYS
Field programmable logic and in particular, field
programmable arrays, have become the solution of choice
for logic design implementation in applications where time to
market is a critical product development factor. In addition,
reconfigurable arrays have been used to enhance
Customer product flexibility in ways that no other technology
can match.
To reduce design cycles, designers have also turned
towards high level design languages and logic synthesis
tools. Many programmable logic solutions are poorly suited
to this design methodology, however. An incompatibility
exists between logic synthesis algorithms originally
developed for gate level deSign and the block-like
structures found on many programmable logic devices. This
can result in significant under utilization or degraded
performance. In either case a more expensive device is
required. Real gate level programmable devices are ideally
suited to this design methodology.
When schematic based design methods are used, some
programmable logic solutions impose significant constraints
on design implementation to insure satisfactory results. This
imposition tends to bind the design to a particular
programmable device and requires a significant learning
investment. Any design specification changes which impact
design decisions made to fit this imposed structure can
have disastrous effects on utilization and performance and
potentially require a more expensive device or even a costly
redesign. Gate level programmable devices coupled with
sophisticated, timing driven, implementation tools minimize
device specific optimization.
Any design process includes a significant amount of
learning. Usually engineers spend most of this time learning
about product requirements or prototyping critical portions of
the design to prove implementation feasibility. Many
programmable logic solutions are not push bullon; time
must be spent learning programmable device architecture or
implementation tool quirks. Worse yet, the design may
require modification or manual component placement to
meet design targets. The cost? Time to market.
The reconfigurable Motorola Programmable Array (MPA)
and MPA design system maximize application flexibility and
minimize time to market by delivering a gate level, push
bUllon, programmable logic solution.
Microprocessors have traditionally been used to satisfy
time to market and end product flexibility needs. This
solution may not meet performance constraints and lacks
the concurrency possible in an unconstrained hardware
design. Typical design processes, therefore, reach a pOint
where the overall design is partitioned into hardware and
software components. An interface is defined and the
design process continues along two parallel paths.
Sometime later, the software and hardware components
must be integrated. Problems usually develop at this point
because of interface misinterpretation or partitioning that
cannot meet design requirements. This impacts the
hardware, the software and the schedule. If the hardware
design is realized in programmable logic, the hardware can
be manipulated as easily as the software.
Products which adapt to the end users particular
requirements through self directed or end user directed
reconfiguration are becoming more prevalent. As the
number of modes of operation increases, mode specific
hardware becomes a less cost effective solution. In the case
where the end user is truly directing the adaptation,
predetermined hardware solutions become untenable.
Reconfigurable logic enables design solutions where
dynamic hardware-software repartitioning is possible.
Programmable logic not only vastly improves the time
necessary to implement a static design, but significant time
to market and product feature benefits can be realized when
hardware can be dynamically altered as easily as software.
MPA1016
621621
1EEIEE
Motorola Master Selection Guide
MPA1036
MPA1064
IEmIEmI
MPAll00
11111
11111
§!II§!I
3.1-5
Logic: Standard, Special and Programmable
MPA1000
Programmable Arrays
Motorola Programmable Array (MPA) products are a high density, high
performance, low cost, solution for your reconfigurable logic needs. When
used with our automatic high performance design tools, MPA delivers
custom logic solutions in minutes rather than weeks. And the low cost
keeps those solutions competitive throughout the product lifecycle.
The MPA architecture has solved the historical problems associated
with fine grain devices without sacrificing re-programmability, reliability, or
cost. MPA1000 devices are reprogrammable SRAM based products
manufactured on a standard 0.511 Leff CMOS process with logic
capacities from 3,500 to more than 22,000 equivalent FPGA gates. MPA
Logic resources hold a single gate or storage element providing a highly
efficient, adaptable, design implementation medium. Gate level logic
resources, abundant hierarchical interconnection resources and
automatic, timing driven, tools work together to quickly provide design
implementations that meet timing constraints without sacrificing device
utilization.
Staying focused on end product design rather than implementation
tools or device architecture gets the design done faster and, unlike other
programmable solutions, without programmable logic device specificity to
impede future design migration efforts. The combination of automatic
tools and gate level architecture is ideal for traditional schematic driven or
high level language based design methodologies. In fact, logiC synthesis
tools were originally designed for and produce the most efficient results
when targeting gate level devices.
High MPA1000 register count and controlled clock skew is ideal for
designs employing pipelining techniques such as communications. The
unique set of MPA1000 I/O programming options make these devices
suitable for industrial and computer InterfaCing circuits.
MPA1016
MPA1036
MPA1064
MPA1100
PROGRAMMABLE ARRAY
3,500 to 22,000 GATES
•
•
•
•
•
•
•
•
Multiple I/O from 80-200 I/O Pins
Programmable 3V/5V I/O at Any Site
Multiple Packaging Options
Fine Grain Structure Is Optimized for
Logic SyntheSis
Programmable Output Drive,
6/12mA @ 5.0V
High Register Count, with 560-2,900
Flip-Flops
IEEE 1149.1 JTAG Boundary Scan
Eight Low-Skew «1ns) Clocks
MPA1000 Family Members
FPGA
Gates
Part No.
Logic
Cells
Internal
Flip-Flops
I/O Cell
Flip-Flops
Signal I/O
Pads Max.
Packages
Availability
3500
MPA1016FN
MPA1016DD
1600
400
160
80
84-Pin PLCC
128-Pin POFP
April 1996
April 1996
8000
MPA1036FN
MPA1036DD
MPA1036DH
MPA1036HI
3600
900
240
120
84-Pin PLCC
128-Pin POFP
16o-Pin POFP
181-Pin PGA
NOW
April 1996
NOW
NOW
14200
MPA1064DH
MPA1064DK
MPA1064KE
6400
1600
320
160
16o-Pin POFP
208-Pin POFP
224-Pin PGA
April 1996
2096
1096
22000
MPA1100DK
MPAll00HV
10000
2500
400
200
208-Pin POFP
299-PinPGA
3096
3096
Logic: Standard, Special and Programmable
3.1-6
Motorola Master Selection Guide
MPA1000 Design System Product Description
Overview
The Motorola Programmable Array (MPA) design system is a bridge between a design capture environment and Motorola
field programmable arrays. The MPA design system automatically transforms designs into device configurations which, when
loaded into an MPA device, realize a design. A design is automatically analyzed, optimized, transformed into MPA cells,
partitioned, placed and routed based on timing constraints for every path in the design. MPA design tools understand and
optimally utilize the MPA device ·architecture; this eliminates the need to learn a new set of rules and makes these tools ideally
suited for use with logic synthesis. Full incremental design support reduces design implementation time and powerful library
retargeting capabilities allow you to reuse designs which may have been implemented on less capable devices. The MPA
design system operates on existing hardware platforms and supports design capture and simulation tools from more than 10
vendors. All these features plus on-line, hypermedia, help make the MPA design system a powerful yet extremely easy to use
design implementation engine.
Features
• Push Button Implementation
• Layout Delay extraction for post layout simulation
• Optimal Use of MPA Device Resources
• Optimal Results with Gate Level Design Input
• Layout viewer
• Incremental design support
• Library of Common MSI Functions
• On-line, hypermedia, documentation
• Design Flow Manager
• Supports all popular design capture and simulation tools
• Design Retargeter
• Timing Driven with Integrated Static Timing Analysis
• Lowest cost FPGA development systems.
• Instant access; Downloading via the internet (WWW, tip).
Design Importation
•
•
•
•
•
Read Appropriate Rules File
Retarget to MPA Primitives
Macro Expansion
Design Optimization
Design Rule Checks
Constraint Generation
• Read User Constraints
• Path Enumeration
• Path Constraint Generation
Timing Driven Autolayout
•
•
•
•
•
Partition Design Into Clusters
Assign Clusters to Zones
Global Place & Route
Zonal Place & Route
Continuous Slack
Redistribution
1---++---1
Configuration
• Read Stored Layout
• Construct Bitstream
MPA
Device
Motorola Master Selection Guide
3.1-7
Logic: Standard, Special and Programmable
Push Button Design Implementation
The MPA design system minimizes training investment
and automatically generates design implementations which
meet timing constraints.
The gate level logic and abundant hierarchical routing
resources of the MPA device present a rich implementation
media for design implementation. MPA design tools
understand and optimally utilize the MPA device resources
so there are no elaborate rules to learn or design
modifications required to begin design capture. Staying
focused on end product design rather than implementation
tools or device architecture gets the design done faster and,
unlike other programmable solutions, without programmable
logic device specificity to impede future design migration
efforts. The combination of automatic tools and gate level
architecture is ideal for traditional schematic driven or high
level language based design capture methods. In fact, logic
synthesis tools were originally designed for and produce the
most efficient results for targeting gate level devices.
A design is analyzed, optimized, transformed into MPA
cells, partitioned, placed and routed based on timing
constraints for all paths in the design - automatically. A
netlist from one of the popular design capture systems or an
existing XNF or LPM netlist is imported into the MPA design
system. The logic is mapped to a series of MPA cells and
the entire resulting nellist is optimized and checked. Based
on a Simple clock specification, the MPA design system
generates timing constraints for all paths in the design.
During automatic partitioning, placement and routing path
slack time is constantly redistributed insuring only the
resources required to meet timing requirements are
consumed. Because MPA tools implement the design
according to constraints, tool induced design iterations are
virtually eliminated. Completed layouts can be transformed
into device configurations, as well as annotated simulation
netlists. A layout browser is also available.
The MPA design system also includes complete on-line,
hypermedia, help covers the device, the design system and
the integration kits. Integration kits for Viewlogic, Exemplar,
VHDL (1076), Verilog (OVI) and OrCAD are included
(contact your vendor for additional kits).AII these features
add up to a powerful yet extremely easy to use design
implementation engine for the MPA product family.
Design Importation
Designs can be captured using schematics, a high level
language, or a combination of these entry methods using
commercially available design capture and logic synthesis
software and the appropriate interface kit. Alternatively,
existing designs can be retargeted from other
programmable logic devices to the MPA device using
commercial logic synthesis tools or the powerful retargetting
capabilities provided with MPA design system.
DeSign importation begins with a netlist and an optional
clock specification file. The clock specification file provides a
mechanism for the user or design capture tools to document
system level timing requirements. In addition, a rich set of
attributes can be attached to specific components or nets
Logic: Standard, Special and Programmable
3.1-8
within the design to specify timing and design pinout
constraints.
A retargetting rules file is read and the input netlist is
transformed into a series of MPA cells and associated
interconnections. Rules files provide a mechanism to
perform attribute mapping, cell mapping and macro
expansion. By creating custom rule files, the user can
extend the importation process from arbitrary sources. The
MPA design system comes with rules for it's native
library/EDIF. The resulting netlist is optimized to clip unused
logic and remove redundant logic. For example: each MPA
cell has programmable input inversion capability. All
Inverters or non-inverting buffers can be removed from the
nellist and replaced with signal sense information attached
to each input.
A series of design rule checks are performed to insure
design integrity before the layout process begins.
Constraint Generation
Timing constraints, the optimized MPA nellist and static
timing analysis is used to generate path slack constraints for
all paths in the design. Each unique signal pathway
between a register output and a register input throughout
the design are enumerated. The total logic and estimated or
real wire delays along the path are summed. The time
between the active upstream register clock edge and the
next active downstream clock edge minus the downstream
register setup time is subtracted from the total path delay.
This difference is called path slack. If any path in the design
has a negative slack value, the implementation will not
function at the required clock rate(s).
Path constraints are utilized throughout the layout
process to insure that a design implementation which meets
timing constraints is automatically generated. If no clock or
timing specifications are provided, the MPA design system
uses the fastest possible clock based on very small net
delay estimates to generate the path constraints. This
usually results in the best possible implementation, but may
take longer than the time required to generate a satisfactory
rather than best possible result.
Contrast this to other programmable logic design tools
which only provide manual net constraint annotation or net
criticality assignment. In these cases significant effort is
necessary to generate constraints and many costly
iterations are required to tune these constraints for a given
design. If any changes are made to the deSign, another
costly round of iterations is required.
Autolayout
The autolayout process makes use of the hierarchical
organization of the MPA device to minimize run time and
deliver implementations that meet timing requirements.
Designs which have diverse timing requirements are ideally
implemented because path slack estimates are refined
throughout the autolayout process insuring only the
resources required to meet timing requirements are
consumed.
The process begins by flattening the design and
partitioning it into small component groups of approximately
the same size called clusters. A cluster boundary delay
Motorola Master Selection Guide
estimation is applied to pull the most tightly constrained
paths into a minimum number of clusters. The clusters are
then assigned to zones talking into account zonal boundary
delay cost and relative zone placement delay costs. Other
costs like total number of port connections per zone and are
also considered. As assignment proceeds, cluster and zone
boundary delay costs are added to each path and slack is
recomputed.
transformed into an appropriately formatted delay
annotation file or annotated nellist quickly and easily. The
annotated delay information represents the worst case
delays for a given device speed grade.
Chipview
While the MPA design system provides a rich set of
reports describing the implementation of a deSign, a
graphical view of the implementation can be indispensable
for reviewing overall layout quality. Chipview provides a
graphical view of a completed layout. Chipview can be
useful during initial design iterations to visually verify I/O pin
placements before commencing PCB layout, for example.
Next global placement and routing is done. Global routes
begin and end on either I/O cells or port cells. Intrazone
placement and routing is deferred to a later phase. During
global routing all the port cell and I/O cell locations are fixed
and the connections between them established. High fanout
nets are constructed in a highly regular manner to insure
efficient resource utilization. As in partitioning, slack
estimates are refined throughout global routing.
Configuration
A layout can be transformed into a device configuration
which, when loaded into the appropriate MPA device,
produces a physical design realization. Many formatting
options are available. The MPA download pod can be used
to emulate a serial PROM. Using the pod, device
configuration files can be downloaded to a device directly
from the PC or workstation development environment.
Finally the intrazonal placement and routing is done. Cells
assigned to a particular zone are placed and routed to other
zone cells or zone port cells. Port cells and core cells are
constructed to allow port swapping. Core cells can be
routed through if necessary. Allowing core cells to act as
routing cells allows dynamic adjustment of routing resources
within the zone. Dynamic resource adjustment is a powerful
design specific adaptation mechanism.
Integration Kits
The MPA design system can be used with a large number
of commercial electronic design automation software. Figure
X-X shows the currently supported vendors and tools. For
each supported vendor, an integration kit is provided which
facilitates MPA design within that vendors' environment.
Many of these kits are available from Motorola and included
at no charge on the MPA design system CD-ROM. Other
kits can be acquired directly from the vendor. Refer to the
MPA Design System Product List for more irformation.
This process produces a layout from which device
configurations, delay back annotations, and chipviews can
be generated.
Incremental Design Support
When
specification
changes
necessitate design
iterations, simply push the button again. Constraints are
automatically recalculated and auto layout only reworks
those portions of the design which have changed. Full
incremental design support means simple design changes
to facilitate design verification can be made quickly and
easily.
Low Cost, Easy Access
MPA Design systems are easy to use, competitively
priced and widely available. Copies of MPA deSign system
software supporting up to 8000 gates can be downloaded
from
the
World
Wide
Web
(WWW)
@
hUp://Design-NET.com/fpga. Complete kits including
download pod, evaluation board, MPA device, CD-ROM
and documentation can be ordered from your local
authorized Motorola distributor or Motorola sales
representative (see appendix Z).
Delay Back Annotation
Designs can be verified through numerous methods. One
particularly useful method is the annotation of device and
implementation specific delays back into the original
simulation environment to improve system or device level
simulation accuracy. A MPA device layout can be
F~, ~~'~W~H~'NI~.
T~/4
Motorola Master Selection Guide
HPAt
3.1-9
Logic: Standard, Special and Programmable
c8
~.
W
::J
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SOFTWARE FLOWS - WORKSTATION and PC
Pen
16o
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0-
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to
til
3
3
§.
iD
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ien
2000 Volts
• 8-Pin PDIP and SOIC; 2o-Pin PLCC Packages
• Commercial (0 to +70°C) and Industrial (-40 to +85°C)
PSUFFIX
PLASTIC PACKAGE
CASE 626-05
8-Lead Pinouts
(Top View)
8~
1
DSUFFIX
PLASTIC SOIC PACKAGE
CASE 751--05
•
3
2D-Lead Pinout
(Top View)
NC Vpp
NC
4
FNSUFFIX
PlCC PACKAGE
CASE 775--02
NC CEO
NC
NC
VCC
NC
NC
NC
DATA
Vss
NC
NC
PIN NAMES
Pins
Function
DATA
ClK
BESETIOE
CE
Data 1/0
Clock
Reset Input and Output Enable
Chip Enable Input
Ground
Chip Enable Output
Programming Voltage Supply
+4.5 to 6.0V Power Supply
Not Connected
~
CEO
VPP
VCC
NC
ClK NC RESETI NC CE
OE
logic: Standard, Special and Programmable
3.1-12
Motorola Master Selection Guide
Selection by Function
In order to better serve our customers, we have made some modifications to the Selection by Function portion of the Logic
Selector Guide. For easy selection of Logic's newer, more complex functions, as well as standard family functions, refer to the
subject index below. Within the Selection by Function tables on the next 23 pages, you will find functions sorted by these broad
subjects, and then broken down alphabetically into more precise functions.
Logic Functions
ARITHMETIC OPERATORS .................
BOUNCE ELIMINATOR .....................
BUFFERS .................................
BUFFERS, 3-8TATE ........................
BUS INTERFACE ...........................
CBM ......................................
CLOCK DISTRIBUTION CHiPS ..............
CLOCK DRiVERS ..........................
COAX CABLE DRiVERS ....................
COMPARATORS ...........................
CONVERTERS .............................
COUNTERS ...............................
DECODER/DEMULTiPLEXERS ..............
DETECTORS ..............................
DISPLAY DECODE DRiVERS ................
DiViDERS .................................
DRiVER ...................................
EDACs ....................................
ENCODERS ...............................
ENCODER/DECODERS .....................
EXPANDERS ..............................
FLiP-FLOPS ...............................
GATES, AND/NAND ........................
GATES, COMPLEX .........................
GATES, EXCLUSIVE OR/EXCLUSIVE NOR ...
GATES, NOR ..............................
GATES, OR ................................
Motorola Master Selection Guide
3.1-14
3.1-14
3.1-14
3.1-14
3.1-14
3.1-17
3.1-17
3.1-17
3.1-18
3.1-18
3.1-19
3.1-19
3.1-21
3.1-21
3.1-22
3.1-22
3.1-22
3.1-22
3.1-22
3.1-22
3.1-22
3.1-23
3.1-25
3.1-27
3.1-27
3.1-28
3.1-28
3.1-13
INDUSTRIAL CONTROL UNIT ...............
INVERTERS ...............................
INVERTER/BUFFERS,2-STATE .............
LATCHES .................................
MEMORY SUPPORT .......................
MISCELLANEOUS .........................
MULTIPLEXER/DATA SELECTORS ...........
MULTIVIBRATORS .........................
OSCiLLATORS .............................
OSCILLATORITIMERS ......................
PARITY CHECKERS ........................
PHASE-LOCKED LOOP ....................
PRESCALERS .............................
PROGRAMMABLE DELAY CHiPS ............
PROMs ...................................
RAMs .....................................
RECEiVERS ...............................
REGiSTERS ...............................
REGISTER FILES ..........................
SCHMITT TRIGGERS .......................
SCSI BUS TERMINATORS ..................
SHIFT REGiSTERS .........................
SyNTHESiZERS ...........................
TRANSCEiVERS ...........................
TRANSLATORS ............................
VCO ......................................
3.1-29
3.1-29
3.1-29
3.1-30
3.1-31
3.1-31
3.1-31
3.1-33
3.1-34
3.1-34
3.1-34
3.1-34
3.1-34
3.1-35
3.1-35
3.F35
3.1-35
3.1-36
3.1-36
3.1-36
3.1-36
3.1-36
3.1-38
3.1-38
3.1-38
3.1-39
Logic: Standard, Special and Programmable
Selection by Function
I
Description
Tech.
Device(s)
Pins
I DIP I SM
ARITHMETIC OPERATORS
TTL
TTL
TTL
TTL
MC74F181
-
24
N
DW
MC74F381
-
20
N
DW
-
20
N
DW
24
N,J
DW
4-Bit Arithmetic logic UniVFunction Generator
ECl
MC10H181
-
24
P,l,
PW,
lW
FN
ECl
MC10181
P,l
TTL
TTL
TTL
MC74F283
-
24
4-Bit Binary Full Adder With Fast Carry
4-Bit Full Adder
CMOS
MC14008B
9's Complementer
CMOS
MC14561B
BCD Rate Multiplier
CMOS
Carry lookahead Generator
TTL
Dual 2-Bit AdderlSubtractor
ECl
MC10H180
4-Bit Arithmetic logic Unit
MC74F382
SN54lS181
SN74lS181
16
N
D
SN54LS83A
SN74lS83A
14
N,J
D
SN54lS283
SN74lS283
16
N,J
D
-
16
P,l
D
-
14
P
D
MC14527B
-
16
P
DW
MC74F182
-
16
N
D
16
P,l
FN
P,l
ECl
MC10180
-
16
look Ahead Carry Block
ECl
MC10H179
16
P,l
FN
NBCDAdder
CMOS
MC14560B
16
P,l
D
Triple Serial Adder (Negative logic)
CMOS
MC14038B
-
16
l
BOUNCE ELIMINATOR
IHex Contact Bounce Eliminator
ICMOS IMCl4490
16
I P,l I DW
BUFFERS
-
1:2 Differential Fanout Buffer
ECl
MC100lVElll
8
D
2:8 Differential Fanout Buffer
ECl
MC100lVE310
MC100E310
28
FN
Dual 1:3 Fanout Buffer
ECl
MC100lVEL13
MC100EL13
20
Expandable Buffer
DTl
MC832
low Voltage Dual 1:4, 1:5 Differential Fanout Buffer, ECUPECl
Compatible
ECl
MC100lVE210
low-Voltage CMOS Octal Buffer, 3-State, Non-Inverting With 5V
Tolerant Inputs and Outputs
CMOS
MC74lCX244
low-Voltage CMOS Octal Buffer, 3-State, Inverting With 5V
Tolerant Inputs and Outputs
CMOS
low-Voltage CMOS Octal Buffer Flow Through Pinout, 3-State,
Non-Inverting With 5V Tolerant Inputs and Outputs
-
14
MC100E210
DW
P,l
28
FN
20
DW,M,
DT
MC74lCX240
-
20
DW,M,
DT
CMOS
MC74lCX541
-
20
DW,M,
DT
low-Voltage CMOS Octal Buffer Flow Through Pinout, 3-State,
Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74lCX540
20
DW,M,
DT
low-Voltage Quiet CMOS Octal Buffer
CMOS
MC74lVQ541
-
20
D,M,
SD,DT
low-Voltage Quiet CMOS Octal Buffer, 3-State, Non-Inverting
CMOS
MC74lVQ244
-
20
DW,M,
SD,DT
low-Voltage Quiet CMOS Octal Buffer, 3-State, Inverting
CMOS
MC74lVQ240
-
20
DW,M,
SD,DT
low-Voltage Quiet CMOS Quad Buffer, 3-State, Non-Inverting
CMOS
MC74LVQ125
-
14
D,M,
SD,DT
TTL
TTL
MC74F828
-
24
N
DW
lQ-Bit Buffer/Line Driver (Non-Inverting), With 3-State Outputs
MC74F827
-
24
N
DW
3-Bit Registered Bus Transceiver, 25Q Cutoff Outputs
ECl
MC10E336
BUFFERS, 3-STATE
BUS INTERFACE
1Q-Bit Buffer/Line Driver (Inverting), With 3-State Outputs
logic: Standard, Special and Programmable
3.1-14
MC100E336
28
FN
Motorola Master Selection Guide
Selection by Function
I
Tech.
Description
Device(s)
Pins
I DIP I SM
BUS INTERFACE
3-Bit Scannable Registered Bus Transceiver
ECl
MC10E337
32-Bit to 32116/8-Bit Dynamic READIWRITE Bus Sizer
CMOS
MC68150"33
MC100E337
CMOS
MC68150"40
9-Bit Bus Interface, NINV, 3 State Outputs
TTL
MC74F823
-
28
FN
68
FN
68
24
FN
N
Bus Driver
ECl
MC10128
-
16
l
Dual Bus Driver/Receiver With 4-to-1 Output Multiplexer (25Q)
ECl
MC10H332
-
20
P,l
Hex 3-State Non-Inverting Buffer With Separate 2-Bit and 4-Bit
Sections
CMOS
MC54HC367
MC74HC367
16
N,J
DW
FN
Hex Buffer 4i2-Bitllnverting With 3-State Outputs
TTL
SN54lS368A
SN74lS368A
16
N,J
Hex Buffer 4/2-BitlNon-lnverting With 3-State Outputs
TTL
SN54lS367A
SN74lS367A
16
N,J
D
Hex Buffer Driver, 4+2-Bit, Inverting, With 3-State Outputs
TTL
MC74F368
16
N
D
-
D
Hex Buffer Gated Enable Inverting With 3-State Outputs
TTL
SN54lS366A
SN74lS366A
16
N,J
D
Hex Buffer Gated Enable Non-Inverting With 3-State Outputs
TTL
SN54lS365A
SN74lS365A
16
N,J
D
Hex Buffer/Driver Gated Enable Inverting, With 3-State Outputs
TTL
MC74F366
16
N
D
Hex Buffer/Driver Gated Enable Non-Inverting, With 3-State
Outputs
TTL
MC74F365
-
16
N
D
-
16
N
D
16
P,l
D
Hex Buffer/Driver, 4+2-Bit, Non-Inverting, With 3-8tate Outputs
TTL
MC74F367
Hex With 3-State Outputs Buffer (Non-Inverting)
CMOS
MC14503B
Hex With 3-State Outputs Inverting Buffer With Common Enables
CMOS
MC54HC366
Hex With 3-State Outputs Inverting Buffer With Separate 2-Bit and
4-Bit Sections
CMOS
MC74HC368
Hex With 3-State Outputs Non-Inverting Buffer With Separate
2-Bitl4-Bit Sections
CMOS
MC54HC365
Octal 3-State Non-Inverting Bus Transceiver With lSTTl
Compatible Inputs
CMOS
MC54HCT245A
Octal Bidirectional Transceiver With 3-State Inputs/Outputs
Octal Bidirectional Transceiver With 3-State Outputs
Octal Bidirectional Transceiver With 8-Bit Parity Generator
Checker, With 3-State Outputs
N,J
N
MC74HC365
16
N,J
DT
MC74HCT245A
20
N,J
DW,
SD,DT
20
N
DW
20
N
DW
20
N
DW
20
N
DW
20
N
DW
20
N
DW
CMOS
MC74AC245
MC74ACT245
CMOS
MC74AC620
CMOS
MC74ACT620
CMOS
MC74AC623
CMOS
MC74ACT623
-
CMOS
MC74AC640
-
20
N
DW
CMOS
MC74ACT640
20
N
DW
CMOS
MC74AC643
20
N
DW
CMOS
MC74ACT643
20
N
DW
TTL
MC74F245
-
20
N
DW
24
N
DW
24
N
DW
20
N
DW
TTL
MC74F657A
MC74F657B
Octal Bidirectional Transceiver, With 3-State Inputs/Outputs
TTL
MC74F1245
Octal Buffer With 3-State Outputs
Motorola Master Selection Guide
16
16
-
CMOS
TTL
Octal Buffer/Line Driver With 3-8tate Outputs
MC74HC366
(81lS95)
TTL
SN54lS795
SN74lS795
20
N,J
DW
(81lS96)
TTL
SN54lS796
SN74lS796
20
N,J
DW
(81lS97)
TTL
SN54lS797
SN74lS797
20
N,J
DW
(81lS98)
TTL
SN54lS798
SN74lS798
20
N,J
DW
TTL
SN54lS244
SN74lS244
20
N,J
DW
TTL
MC74F240
20
N
DW
TTL
MC74F241
20
N
DW
-
TTL
MC74F244
20
N
DW
TTL
SN54lS240
SN74lS240
20
N,J
DW
TTL
SN54lS241
SN74lS241
20
N,J
DW
3.1-15
logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
I DIP I SM
BUS INTERFACE
Octal BufferlLine Driver With 3-State Outputs
Octal Bus Transceiver
TTL
SN54LS540
SN74LS540
20
N,J
DW
TTL
SN54LS541
SN74LS541
20
N,J
DW
CMOS
MC74AC241
20
N
DW
CMOS
MC74AC244
-
20
N
DW
CMOS
MC74ACT244
-
20
N
DW
CMOS
MC74AC540
20
N
DW
20
N
DW
20
N
DW
20
N
DW
20
N
DW
DW
CMOS
MC74ACT540
CMOS
MC74AC541
CMOS
MC74ACT541
CMOS
MC74AC240
-
CMOS
MC74ACT240
-
20
N
CMOS
MC74ACT241
-
20
N
DW
TTL
SN54LS245
SN74LS245
20
N,J
DW
SN74LS623
20
N,J
DW
20
N
DW
20
N,J
DW
DW
TTL
SN54LS623
Octal Bus Transceiver, With 3-State Outputs
TTL
MC74F623
Octal Bus Transceiverllnverting With 3-5tate Outputs
TTL
SN54LS640
TTL
MC74F620
-
20
N
TTL
MC74F640
-
20
N
DW
Octal Bus Transceiver/Non-Inverting With 3-State Outputs
TTL
SN54LS645
20
N,J
DW
Octal Bus Transceiver/Register With 3-State Outputs
Non-Inverting
CMOS
MC74AC652
-
24
N
DW
CMOS
MC74ACT652
N
DW
TTL
MC74F544
24
N
DW
Octal Registered Transceiver Non-Inverting, With 3-State Outputs
TTL
MC74F543
24
N
DW
Octal Transceiver/Register With 3-State Outputs Non-Inverting
CMOS
MC74AC646
24
N
DW
CMOS
MC74ACT646
24
N
DW
CMOS
MC74AC648
24
N
DW
CMOS
MC74ACT648
24
N
DW
Octal Transceiver/Register, With 3-5tate Outputs
TTL
MC74F646
-
24
Octal Registered Transceiver Inverting, With 3-State Outputs
24
N
DW
Octal With 3-State Non-Inverting Buffer/Line Driver/Line Receiver
CMOS
MC54HC241A
MC74HC241A
20
N,J
DW
Octal With 3-State Non-Inverting Buffer/Line Driver/Line Receiver
With LSTTL Compatible Inputs
CMOS
MC54HCT241A
MC74HCT241A
20
N,J
DW
CMOS
MC54HCT244A
MC74HCT244A
20
N,J
DW,
SD,DT
Octal With 3-State Outputs Inverting Buffer/Line Driver/Line
Receiver
CMOS
MC54HC240A
MC74HC240A
20
N,J
DW,
DT
MC74HC540A
20
N,J
DW
20
N
DW,
SD,DT
Octal Transceiver/Register With 3-5tate Outputs Inverting
CMOS
MC54HC540A
Octal With 3-5tate Outputs Inverting Buffer/Line Driver/Line
Receiver With LSTTL Compatible Inputs
CMOS
MC74HCT240A
SN74LS640
SN74LS645
-
Octal With 3-State Outputs Inverting Bus Transceiver
CMOS
MC54HC640A
MC74HC640A
20
N,J
DW
Octal With 3-State Outputs Non-Inverting Buffer/Line Driver/Line
Receiver
CMOS
MC54HC541A
MC74HC541A
20
N,J
DW
Octal With 3-State Outputs Non-Inverting Buffer/Line DriverlLine
Receiver With LSTTL Compatible Inputs
CMOS
MC74HCT541A
20
N
DW
Octal With 3-State Outputs Non-Inverting Buffer/Line DriverlLine
Receiver
CMOS
MC54HC244A
MC74HC244A
20
N,J
DW,
SD,DT
-
Octal With 3-State Outputs Non-Inverting Bus Transceiver
CMOS
MC54HC245A
MC74HC245A
20
N,J
DW
Octal With 3-State Outputs Non-Inverting Bus Transceiver & D
Flip-Flop
CMOS
MC54HC646
MC74HC646
24
N,J
DW
Quad Buffers With 3-State Outputs
TTL
SN54LS125A
SN74LS125A
14
N,J
D
Logic: Standard, Special and Programmable
3.1-16
Motorola Master Selection Guide
Selection by Function
I
Description
Device(s)
Tech.
Pins
I DIP I SM
BUS INTERFACE
Quad 3--State Non-Inverting Buffers
Quad Buffer With 3-State Outputs
CMOS
MC74HC125A
CMOS
MC74HC126A
CMOS
MC74AC125
CMOS
MC74ACT125
CMOS
MC74AC126
-
14
N
14
N
D
14
N
D
14
N
D
14
N
D
14
N
D
14
N
D
14
N
D
14
N,J
D
P,L
FN
D
CMOS
MC74ACT126
TIL
MC74F125
TIL
MC74F126
TIL
SN54lS126A
ECl
MC10192
-
16
Quad Bus Driver/Receiver With 2-t0-1 Output Multiplexer (25f.l)
ECL
MC10H330
P,l
FN
ECl
MC10H334
-
24
Quad Bus Driver/Receiver With Transmit & Receiver Latches
(25f.l)
20
P,L
FN
D
Quad Bus Driver
SN74LS126A
Quad Bus Transceiver/Inverting With 3-State Outputs
TIL
SN54LS242
SN74LS242
14
N,J
Quad Bus Transceiver/Non-Inverting With 3-State Outputs
TIL
SN54lS243
SN74LS243
14
N,J
D
Quad Bus Transceivers With 3--State Outputs
TIL
MC74F242
-
14
N
D
TIL
MC74F243
N
D
MC74HC242
-
14
CMOS
14
N
Quad With 3-8tate Outputs Inverting Bus Transceiver
Triple 3--lnput Bus Driver With Enable (25f.l)
ECL
MC10H423
-
16
P,l
FN
Triple 4-3--3 Input Bus Driver (25f.l)
ECl
MC10H123
16
P,L
FN
ECL
MC10123
-
16
P,L
FN
ISXlG
I MC68194
CBM
ICBM - Carrier Band Modem
*FJ
52
CLOCK DISTRIBUTION CHIPS
1:4 Clock Distribution Chip
ECL
MC10EL15
MC100EL15
16
D
1:5 Clock Distribution Chip
ECL
MC100LVEL14
MC100El14
20
DW
MC100E211
1:6 Differential Clock Distribution Chip
ECL
MC10E211
28
FN
low Voltage 1: 12 Clock Distribution Chip
SXlG
MPC948
-
32
FA
low Voltage 1:9 Clock Distribution Chip
SXlG
MPC947
-
32
FA
Low Voltage 1:9 ECUPECl Clock Distribution Chip
ECL
MC100LVE111
-
28
FN
1:2 Differential Clock Driver
ECl
MC10EL11
1:6 PCI Clock Generator/Fanout Buffer
SXlG
MPC903
SXlG
MPC904
ECl
MC10E111
1 :9 Differential ECUPECl RAMBus Clock Buffer
ECL
MC10E411
1 :9 TIUTTL Clock Distribution Chip
ECl
MC10H645
50 MHz Low Skew CMOS Pll Clock Driver With liP Power Down
CMOS
66 MHz Low Skew CMOS PLl Clock Driver With liP
Power-Down/Power-Up Feature
CLOCK DRIVERS
1:9 Differential Clock Driver With Low Skew, Enable, Vbb
68030/040 PECUTTL Clock Driver
Clock Driver Quad D-Type Flip-Flop w/ Matched Propagation
Delays
CMOS PLL Clock Driver Programmable Frequency, low Skew,
High Fan-Out
Motorola Master Selection Guide
MC100El11
-
8
D
16
D
16
D
28
FN
-
28
FN
-
28
FN
MC88920
-
20
DW
CMOS
MC88921
-
20
DW
MC100E111
ECl
MC10H640
MC100H640
28
FN
ECl
MC10H642
MC100H642
28
FN
ECL
MC10H644
MC100H644
20
TIL
MC74F1803
-
14
N
TIL
MC74F803
N
MC88PL117
-
14
CMOS
52
3.1-17
FN
D
D
FN
Logic: Standard, Special and Programmable
Selection by Function
I
Tech.
Description
Device(s)
CLOCK DRIVERS
Dual Supply ECLfITL 1:8 Clock Driver
ECL
High Frequency PLl Clock Generator
MC10H643
MC12429
MC12439
MC100H643
28
FN
-
28
FN
14
N
14
N
28
FN
CMOS
MC88916*80
160 MHz Version
CMOS
MC88915T*160
133 MHz Version
CMOS
MC88915T'133
-
100 MHz Version
CMOS
MC88915T'100
-
28
FN
70 MHz Version
CMOS
MC88915T*70
28
FN
55 MHz Version
CMOS
MC88915T*55
-
28
FN
low Voltage Pll Clock Driver
SXGL
MPC930
MPC931
32
FA
low Voltage PlL Clock Driver
SXGl
MPC950
MPC951
32
FA
low Voltage PLL Clock Driver
SXGl
MPC956
FA
SXGL
MPC970
-
32
'L:;;;Voitage PLl Clock Driver
ECl
MC10H646
MC100H646
ECl
MC10H641
MC100H641
28
FN
ECL
MC100LVEL38
MC100El38
20
DW
ECl
MC100LVEl39
MC100EL39
20
DW
ECl
MC10El34
MC100EL34
16
D
low Skew CMOS Clock Driver
CMOS
MC88913
low Skew CMOS Clock Driver With Reset
CMOS
MC88914
low Skew CMOS PLl 68060 Clock Driver
CMOS
MC88LV926
low Skew CMOS PLl Clock Driver
CMOS
MC88915*55
CMOS
MC88915*70
CMOS
MC88916*70
Low Skew CMOS Pll Clock Driver With Processor Reset
~kew CMOS Pll Clock Driver
f----.---
PECLfITL to TIL 1: 8 Clock Distribution Chip
r----'
~. Supply PECLfITl 1:9 Clock Distribution Chip
+2, +4/6 Clock Generation Chip (3.3V)
f--'---
+2/4, +4/6 Clock Generation Chip
f---'--_
..
.:.2,4,8 Differential Clock Driver
D
D
20
DW
28
FN
28
FN
20
DW
20
DW
28
FN
28
FN
32
FA
28
FN
COAX CABLE DRIVERS
Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit
300 MBitls LED Driver for FDDI and Fibre Channel
COMPARATORS
4-Bit Magnitude Comparator
-
TIL
MC74F85
CMOS
MC74HC85
TIL
SN54lS85
CMOS
MC14585B
-
5-Bit Magnitude Comparator
ECl
MC10H166
-
ECl
MC10166
8-Bit Equality Comparator
CMOS
MC54HC688
B-Bit Identity Comparator
CMOS
MC74ACT521
TIL
MC74F521
TIL
SN54lS682
TIL
SN74lS85
MC74HC688
-
16
N
D
16
N
DT
16
N,J
D
16
P,l
D
16
P,l
FN
16
P,l
FN
20
N,J
DW
20
N
20
N
DW
SN74lS682
20
N,J
DW
SN54lS684
SN74lS684
20
N,J
DW
TIL
SN54lS688
SN74lS688
20
N,J
DW
9-Bit Magnitude Comparator
ECl
MC10E166
MC100E166
Dual Analog Comparator With Latch
ECl
MC10E1651
Dual Analog Comparator With Latch (Hi-Perf MC1651)
ECl
MC10E1652
B-Bit Magnitude Comparator
logic: Standard, Special and Programmable
3.1-18
-
FN
28
16,20
l
FN
16,20
l
FN
Motorola Master Selection Guide
Selection by Function
I
Description
Tech.
Device(s)
Pins
I DIP I SM
CONVERTERS
4-Bit Parallel to Serial Converter
ECl
MC10E446
MC100E446
28
4-Bit Serial to Parallel Converter
ECl
MC10E445
MC100E445
28
Dual AID Converter
ECl
MC1650
-
16
l
ECl
MC1651
-
16
l
FN
FN
COUNTERS
-
16
P,l
D
MC74HC4040A
16
N,J
D,DT
MC74AC4040
-
16
N
D
MC14020B
16
P,l
D
16
P,l
D
16
N
D,DT
12-Bit Binary Counter
CMOS
MC14040B
12-Stage Binary Ripple Counter
CMOS
MC54HC4040A
CMOS
14-Bit Binary Counter
CMOS
14-Bit Binary Counter and Oscillator
CMOS
MC14060B
14-Stage Binary Ripple Counter
CMOS
MC74HC4020A
14-Stage Binary Ripple Counter With Oscillator
CMOS
MC74AC4020
-
16
N
D
CMOS
MC54HC4060
MC74HC4060
16
N,J
DT
MC74HC4060A
16
N,J
D,DT
-
16
P
DW
CMOS
MC54HC4060A
3-Digit BCD Counter
CMOS
MC14553B
4-Bit BCD Decade Counter, Asynchronous Reset
TTL
TTL
TTL
TTL
TTL
TTL
SN54lS160A
SN74lS160A
16
N,J
D
SN54lS162A
SN74lS162A
16
N,J
D
20
N
DW
20
N
DW
D
4-Bit Bidirectional Binary Counter, With 3-8tate Outputs
4-Bit Bidirectional Decade Counter, With 3-State Outputs
4-Bit Binary Counter
4-Bit Binary Counter, Synchronous Presettable
4-Bit Binary Counter, Synchronous Reset
4-Bit Up/Down Counter With 3-State Outputs
4-Stage Presettable Ripple Counters
4-Stage Synchronous Bidirectional Counter
5 Cascaded BCD Counters
MC74F569
MC74F568
-
SN54lS93
SN74lS93
14
N,J
SN54lS293
SN74lS293
14
N,J
D
16
P,l
FN
16
P
D
16
P
D
16
N,J
D
ECl
MC10H16
CMOS
MC14161B
CMOS
MC14163B
TTL
TTL
TTL
TTL
TTL
TTL
TTL
SN54lS161A
CMOS
MC14534B
SN74lS161A
SN54lS163A
SN74lS163A
16
N,J
D
SN54lS569A
SN74lS569A
20
N,J
DW
SN54lS196
SN74lS196
14
N,J
D
SN54lS197
SN74lS197
14
N,J
D
D
MC74F168
-
16
N
MC74F169
-
16
N
D
24
P,l
DW
6-Bit Universal Counter, (lookahead Carry)
ECl
MC10E136
7-Stage Ripple Counter
CMOS
MC14024B
8-Bit Bidirectional Binary Counter
TTL
TTL
TTL
MC74F269
ECl
MC10E137
MC100E137
28
8-Bit Synchronous Binary Up Counter
ECl
MC10E016
MC100E016
28
BCD Decade Counter, Synchronous Presettable
MC74F160A
BCD Decade Synchronous Bidirectional Counter
TTL
TTL
TTL
Bi-Quinary Counter
ECl
MC10138
Binary Counter
ECl
ECl
TTL
TTL
8-Bit Bidirectional Binary Counter, With 3-State Outputs
8-Bit Ripple Counter
Binary Counter, Synchronous Presettable, 4-Bit
Motorola Master Selection Guide
3.1-19
MC74F579
MC74F779
MC100E136
-
-
28
FN
14
P,l
D
24
N
DW
20
N
DW
16
N
D
FN
FN
16
N
D
16
N
D
16
N,J
D
-
16
P,l
FN
MC10154
-
16
P,l
MC10178
-
16
P,l
FN
MC74F161A
-
16
N
D
16
N
D
MC74F162A
SN54lS168
MC74F163A
SN74lS168
logic: Standard, Special and Programmable
Selection by Function
I
Tech.
Description
I Pins I DIP I
Device(s)
SM
COUNTERS
-
Counter Control logic
ECl
MC12014
16
P,l
Decade Counter
TTL
TTL
SN54lS90
SN74lS90
14
N,J
D
SN54lS290
SN74lS290
14
N,J
D
CMOS
MC14017B
-
16
P,l
D
CMOS
MC74HC4017
-
16
N
D
TTL
TTL
SN54lS92
SN74lS92
14
N,J
D
Dual 4-Stage Binary Counter
SN54lS393
SN74lS393
16
N,J
D
Dual 4-Stage Binary Ripple Counter
CMOS
MC54HC393
MC74HC393
14
N,J
D
MC74HC390
16
N,J
D
16
P,l
DW
Divide By 12 Counter
Dual 4-5tage Binary Ripple Counter W +2, +5 Sections
CMOS
MC54HC390
Dual BCD Up Counter
CMOS
MC14518B
-
Dual Binary Up Counter
CMOS
MC14520B
16
P,l
DW
Dual Decade Counter
TTL
TTL
SN54lS390
SN74lS390
16
N,J
D
SN54lS490
SN74lS490
16
N,J
D
Industrial Time Base Generator
CMOS
MC14566B
16
P
D
Modulo 16 Binary Synchronous Bidirectional Counter
TTL
SN54lS169
16
N,J
D
Octal Counter
CMOS
MC14022B
-
16
P,l
D
Phase Comparator and Programmable Counter
CMOS
MC14568B
-
16
P,l
D
Presettable 4-Bit BCD Down Counter
CMOS
MC14522B
-
16
P
DW
Presettable 4-Bit Binary Down Counter
CMOS
MC14526B
-
16
P,l
DW
Presettable 4-Bit Binary Up/Down Counter
TTL
TTL
SN54lS191
SN74lS191
16
N,J
D
SN54lS193
SN74lS193
16
N,J
D
Presettable BCD Up/Down Counter
CMOS
MC14510B
16
P
D
Presettable BCD/Decade Up/Down Counter
TTL
TTL
SN54lS190
SN74lS190
16
N,J
D
SN54lS192
SN74lS192
16
N,J
D
Presettable Binary Up/Down Counter
CMOS
MC14516B
16
P,l
D
Presettable Binary/BCD Up/Down Counter
CMOS
MC14029B
16
P,l
D
Presettable Counter
CMOS
MC54HC160
MC74HC160
16
N,J
D
CMOS
MC54HC161A
MC74HC161A
16
N,J
D
CMOS
MC54HCT161A
MC74HCT161A
16
N,J
D
CMOS
MC54HC162
MC74HC162
16
N,J
D
CMOS
MC54HCI63A
MC74HC163
16
N,J
D
MC74HCT163A
16
N,J
D
16
P
D
16
P,l
DW
SN74lS169
-
-
CMOS
MC54HCT163A
Presettable Divide-by-N Counter
CMOS
MC14018B
Programmable Dual Binary/BCD Counter
CMOS
MC14569B
Programmable Modulo-N Counters (N=D-9)
ECl
MC4016
-
16
P,l
ECl
MC4018
-
16
P,l
ECl
MC4316
-
16
P,l
Synchronous 4-Bit Up/Down Counter
TTL
SN54lS669
16
N,J
D
Synchronous Presettable Binary Counter
CMOS
MC74AC161
16
N
D
CMOS
MC74ACT161
16
N
D
CMOS
MC74AC163
16
N
D
CMOS
MC74ACT163
16
N
D
CMOS
MC74AC160
-
16
N
D
CMOS
MC74ACT160
-
16
N
D
CMOS
MC74AC162
16
N
D
CMOS
MC74ACT162
16
N
D
ECl
MC10137
-
16
P,l
Synchronous Presettable Binary-Coded-Decimal Decade Counter
Universal Decade Counter
logic: Standard, Special and Programmable
3.1-20
SN74lS669
Motorola Master Selection Guide
Selection by Function
Description
Device(s)
COUNTERS
Universal Hexadecimal Counter
-
16
P,l
FN
16
P,l
FN
16
N
D
-
16
N
D
16
N,J
D
ECl
MC10H136
ECl
MC10136
CMOS
MC74AC190
1-01-10 Decoder
CMOS
MC74HC42
SN54lS42
SN74lS42
1-01-10 Decoder/Driver Open-Collector
SN54lS145
SN74lS145
1-01-10 Decoder, With 3-State Outputs
TTL
TTL
TTL
1-01-16 Decoder/Demultiplexer
CMOS
MC54HC154
1-01-16 Decoder/Demultiplexer With Address latch
CMOS
MC74HC4514
1-01-4 Decoder, With 3-State Outputs
1-01-8 Decoder, With 3-State Outputs
TTL
TTL
1-01-8 Decoder/Demultiplexer
Up/Down Counter With Preset and Ripple Clock
DECODER/DEMULTIPLEXERS
MC74F537
-
MC74HC154
16
N,J
D
20
N
DW
24
N,J
DW
24
N
DW
MC74F539
-
20
N
DW
MC74F538
-
20
N
DW
CMOS
MC74AC138
16
N
D
CMOS
MC74ACT138
-
16
N
D
TTL
MC74F138
-
16
N
D
CMOS
MC54HC138A
MC74HC138A
16
N,J
D
CMOS
MC74HCT138A
-
16
N
D,DT
TTL
SN54lS138
16
N,J
D
CMOS
MC74HC137
-
16
N
D
CMOS
MC74HC237
-
16
N
D
3-Line to 8-Line Decoders/Demultiplexers With Address latches
TTL
SN54lS137
16
N,J
D
4-Bit Transparent latch/4-to-16 Line Decoder (High)
CMOS
MC14514B
24
P,l
DW
24
P,l
DW
16
N,J
D
1-01-8 Decoder/Demultiplexer With Address latch
SN74lS138
SN74lS137
-
4-Bit Transparent latch/4-to-16 Line Decoder (low)
CMOS
MC14515B
B-Bit Addressable Latch/l-01-8 Decoder
CMOS
MC54HC259
BCD-to-Decimal Decoder/Binary-to-Octal Decoder
CMOS
MC14028B
-
16
P,l
D
Binary to 1-4 Decoder (low)
ECl
MC10171
-
16
P,l
FN
Binary to 1-8 Decoder, (High)
ECl
MC10H162
-
16
P,l
FN
ECl
MC10162
-
16
P,l
FN
ECl
MC10H161
16
P,l
FN
ECl
MC10161
-
16
P,l
FN
TTL
TTL
SN54lS155
SN74lS155
16
N,J
D
SN54lS156
SN74lS156
16
N,J
D
Binary to 1-8 Decoder, (low)
Dual 1-01-4 Decoder
Dual 1-01-4 Decoder Open-Collector
MC74HC259
CMOS
MC74AC139
-
16
N
D
CMOS
MC74ACT139
16
N
D
TTL
MC74F139
-
16
N
D
CMOS
MC54HC139A
MC74HC139A
16
N,J
D
TTL
SN54lS139
SN74lS139
16
N,J
D
ECl
MC10H172
-
16
P,l
FN
ECl
MC10172
-
16
P,l
FN
Dual Binary to 1-4 Deyoder (low)
ECl
MC10H171
-
16
P,l
FN
Dual Binary to 1-01-4 Decoder (Active High Outputs)
CMOS
MC14555B
-
16
P
D
Dual Binary to 1-01-4 Decoder (Active low Outputs)
CMOS
MC14556B
-
16
P
low-Voltage Quiet CMOS 1-01-8 Decoder/Demultiplexer
CMOS
MC74lVQ138
-
16
Analog Mixer
ECl
MC12002
P,l
ECl
MC4044
-
14
Phase-Frequency Detector
14
P,l
ECl
MC4344
-
14
P,l
Dual 1-01-4 Decoder/Demultiplexer
Dual 1-01-4 Decoder/Demultiplexer
Dual Binary to 1-4 Decoder (High)
D
D,M,
SD,DT
DETECTORS
Motorola Master Selection Guide
3.1-21
D
logic: Standard, Special and Programmable
Selection by Function
I
Description
I Pins I DIP I SM
Device(s)
Tech.
DETECTORS
Phase-Frequency Detector
DISPLAY DECODE DRIVERS
BCD-to-Seven Segment Decoder
BCD-to-Seven Segment Decoder/Driver
TIL
SN54LS48
CMOS
MC14558B
TIL
SN54LS47
TIL
SN54LS247
TIL
SN54LS248
TIL
SN54LS249
BCD-to-Seven Segment Latch/Decoder/Display Driver
CMOS
MC74HC4511
BCD-to-Seven Segment Latch/Decoder/Driver
CMOS
MC14511B
BCD-to-Seven Segment Latch/Decoder/Driver for Liquid Crystals
CMOS
MC14543B
BCD-to-Seven Segment Latch/Decoder/Driver With Ripple
Blanking
CMOS
MC14544B
CMOS
MC14513B
CMOS
MC14547B
High Current BCD-to-Seven Segment Decoder/Driver
SN74LS48
16
N,J
D
16
P,L
D
SN74LS47
16
N,J
D
SN74LS247
16
N,J
D
SN74LS248
16
N,J
D
SN74LS249
D
-
16
N,J
-
16
N
D
16
P,L
D,DW
16
P,L
D
18
P,L
-
18
P
16
P,L
DW
16
N,J
D
16
P,L
D
16
N,J
D
DIVIDERS
+ 2 Divider
+4 Divider
Coaxial Cable Driver
300MBit/s LED Driver for FDDI and Fibre Channel
Error Detection-Correction Circuit (IBM Code)
Error Detection-Correction Circuit (Motorola Code)
ENCODERS
1D-Line to 4-Line Priority Encoder
TIL
SN54LS147
8-Bit Priority Encoder
CMOS
MC14532B
8-lnput Priority Encoder
TIL
SN54LS348
ECL
MC10H165
-
16
P,L
FN
ECL
MC10165
-
16
P,L
FN
8-lnput Priority Encoder (Glitchless)
TIL
SN54LS848
16
N,J
D
8-Line to 3-Line Priority Encoder
TIL
MC74F148
16
N
D
TIL
SN54LS148
SN74LS148.
16
N,J
D
TIL
SN54LS748
SN74LS748
16
N,J
D
CMOS
MC74HC147
16
N
D
Decimal-to-BCD Encoder
ENCODERIDECODERS
ICMI Encoder/Decoder
SN74LS147
SN74LS348
SN74LS848
-
-
IMC100SX1230
28
FN
EXPANDERS
14
P,L
14
P,L
MC661
-
14
P,L
MC662
-
14
P,L
DTL
MC844
P,L
MC944
-
14
DTL
14
P,L
Dual 4-lput Expander
HTL
MC669
Expandable Dual 4-lnput Gate (Active Pullup)
HTL
MC660
Expandable Dual 4-lnput Gate (Passive Pullup)
HTL
Expandable Dual 4-lnput Line Driver
HTL
Expandable Dual Power Gate
Logic: Standard, Special and Programmable
3.1-22
Motorola Master Selection Guide
Selection by Function
Description
Device(s)
FLIP-FLOPS
3-Bit Differential Flip-Flop
ECL
MC10E431
MC100E431
28
4-Bit D Flip-Flop Individual Clock, Reset Differential Output
ECl
MC10E131
MC100E131
28
4-Bit D Flip-Flop With Enable
TIL
SN54LS379
SN74lS379
16
N,J
4-Bit D-Type Register With With 3-State Outputs
TIL
SN54lS173A
SN74lS173A
16
N,J
5--Bit Differential Register
ECl
MC10E452
MC100E452
28
FN
6-Bit 2:1 Mux-Register With Common Clock, Asynchronous
Master Reset Single Ended
ECl
MC10E167
MC100E167
28
FN
6-Bit D Register With Common Clock, Asynchronous Master
Reset, Differential Outputs
ECl
MC10E151
MC100E151
28
FN
6-Bit D Register, With Differential Inputs, (Data & Clock) , VBB,
Common Reset
ECl
MC10E451
MC100E451
28
FN
6-Bit Parallel D Register With Enable
CMOS
MC74AC378
-
16
N
CMOS
MC74ACT378
-
16
N
9-Bit Hold Register, 700MHz, With Asynchronous Master Reset
ECl
MC10E143
Clocked Flip-Flop
DTl
MC845
Clocked Flip-Flop
DTl
MC945
D Flip-Flop With Set & Reset
ECl
MC10El31
MC100El31
8
D
Differential Clock D Flip-Flop
ECl
MC10El51
MC100El51
8
D
Differential Data & Clock D Flip-Flop
ECl
MC10El52
MC100El52
8
Dual D Flip-Flop
CMOS
MC74AC74
CMOS
MC74ACT74
CMOS
MC14013B
Dual D Flip-Flop With Set and Reset
CMOS
MC54HC74A
Dual D Flip-Flop With Set and Reset With lSTIl Compatible
Inputs
CMOS
MC74HCT74A
Dual D-Type Positive Edge-Triggered Flip-Flop
TIL
MC74F74
TIL
SN54lS74A
SN74lS74A
ECl
MC100lVEl29
MC100EL29
20
Dual Differential Data and Clock D Flip-Flop With Set and Reset
Dual J-K Negative Edge-Triggered Flip-Flop
MC100E143
-
-
FN
FN
28
D
D
D
D
FN
14
P,l
14
P,l
D
14
N
D
14
N
D
14
P,l
D
N,J
D,DT
-
14
,14
N
D
-
14
N
D
16
N,J
MC74HC74A
D
DW
TIL
SN54lS112A
SN74lS112A
16
N,J
D
TIL
SN54lS113A
SN74lS113A
14
N,J
D
TIL
SN54lS114A
SN74lS114A
14
N,J
D
Dual J-K Positive Edge-Triggered Flip-Flop
TIL
SN54lS109A
SN74lS109A
16
N,J
D
Dual J-K Flip-Flop
HTl
MC663
14
P,l
14
N,J
14
P,l
14
P,L
16
N
D
16
N
D
14
N
D
14
N
D
16
N,J
D
16
N
D,DT
16
P,l
D
14
N
D
14
N
D
TIL
SN54lS107A
DTl
MC952
Dual J-K Flip-Flop (Separate Clock and SD, No CD)
DTl
MC953
Dual J-K Flip-Flop Negative Edge Trigger
CMOS
MC74AC112
CMOS
MC74ACT112
CMOS
MC74AC113
CMOS
MC74ACT113
Dual J-K Flip-Flop With Set and Clear
TIL
SN54lS76A
Dual J-K Flip-Flop (Common Clock and CD Separate SD)
Dual J-K Flip-Flop Negative Edge Trigger
Dual J-K Flip-Flop With Set and Reset
CMOS
MC74HC112
Dual J-K Flip-Flop
CMOS
MC14027B
Dual J-K Flip-Flop With Reset
CMOS
MC74HC73
CMOS
MC74HC107
Dual J-K Flip-Flop With Set and Reset
CMOS
MC74HC76
Dual J-K Master-8lave Flip-Flop
ECl
MC10135
ECl
MC10H135
Motorola Master Selection Guide
3.1-23
SN74lS107A
SN74lS76A
-
D
16
N
D
16
P,l
FN
16
P,l
FN
logic: Standard, Special and Programmable
Selection by Function
I
Tech.
Description
I
Device(s)
I I
DIP
SM
16
N
D
14
N,J
D
16
N
D
16
N
D
Pins
FLIP-FLOPS
Dual J-K Negative Edge-Triggered Flip-Flop
Dual J-K Positive Edge-Triggered Flip--:-Flop With Set & Clear
TTL
MC74F112
TTL
SN54LS73A
CMOS
MC74AC109
CMOS
MC74ACT109
Dual J-K Flip--:-Flop With Set and Reset
CMOS
MC74HC109
Dual J-K Positive Edge-Triggered Flip-Flop
TTL
MC74F109
Dual Type-D Master-Slave Flip--:-Flop
ECl
MC10131
ECl
MC10H131
Hex D Flip-Flop
TTL
SN54lS174
Hex D Flip--:-Flop With Enable
TTL
SN54lS378
Hex D Flip-Flop With Master Reset
CMOS
MC74AC174
TTL
CMOS
Hex D Flip--:-Flop
SN74lS73A
-
16
N
D
16
N
D
16
P,l
FN
16
P,l
FN
SN74lS174
16
N,J
D
SN74lS378
16
N,J
D
16
N
D
MC74F174
-
16
N
D
MC74ACT174
-
16
N
D
CMOS
MC14174B
-
16
P,l
D
Hex D Flip--:-Flop With Common Clock & Reset
CMOS
MC54HC174A
MC74HC174A
16
N,J
D
Hex D Flip--:-Flop With Common Clock & Reset
CMOS
MC74HCT174A
N
D
ECl
MC10H176
16
P,l
FN
Hex D Master-8lave Flip--:-Flop With Reset
ECl
MC10H186
16
P,l
FN
ECl
MC10186
16
P,l
FN
Hex D Master-8lave Flip--:-Flop
ECl
MC10176
16
P,l
FN
High Speed Dual D Master-Slave Flip--:-Flop
ECl
MC10231
-
16
Hex D Master-8lave Flip--:-Flop
16
P,l
FN
J-K Flip-Flop
ECl
MC10El35
low-Voltage CMOS Octal D-Type Flip--:-Flop, 3-State,
Non-Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74lCX374
low-Voltage CMOS Octal D-Type Flip--:-Flop Flow Through Pinout,
3-8tate, Non-Inverting With 5V Tolerant Inputs and Outputs
CMOS
low-Voltage Quiet CMOS Octal D-Type Flip--:-Flop
Low-Voltage Quiet CMOS Octal D-Type Flip--:-Flop Flow Through
Pinout
MC100El35
8
D
-
20
DW,M,
MC74lCX574
-
20
DW,M,
DT
CMOS
MC74lVQ374
-
20
DW,M,
SD,DT
CMOS
MC74lVQ574
-
20
DW,M,
SD,DT
Master-8lave Flip--:-Flop
ECl
MC1670
l
HTl
MC664
-
16
Master-Slave R-S Flip-Flop
14
P,l
Octal 3-8tate Inverting D Flip--:-Flop
CMOS
MC54HC534A
MC74HC534A
20
N,J
DW
Octal 3-State Non-Inverting D Flip--:-Flop With lSTTl Compatible
Inputs
CMOS
MC54HCT374A
MC74HCT374A
20
N,J
DW
Octal D Flip Flop, With 3-8tate Outputs
TTL
MC74F374
N
DW
CMOS
MC74AC273
20
N
DW
CMOS
MC74ACT273
-
20
Octal D Flip-Flop
20
N
DW
Octal D Flip-Flop With 3-8tate OutputsiBroadside Pinout, F374
TTL
MC74F574
-
20
N
DW
Octal D Flip--:-Flop With Clear
TTL
SN54lS273
20
N,J
DW
Octal D Flip--:-Flop With Clock Enable
CMOS
MC74AC377
20
N
DW
CMOS
MC74ACT377
-
20
N
DW
Octal D Flip--:-Flop With Common Clock & Reset
CMOS
MC54HC273A
MC74HC273A
20
N,J
DW,
DT
Octal D. Flip--:-Flop With Common Clock and Reset With lSTTl
Compatible Inputs
CMOS
MC74HCT273A
-
20
N
DW
-
20
N
DW
20
N,J
DW
20
N
DW
Octal D Flip--:-Flop With Enable
TTL
MC74F377
Octal D Flip--:-Flop With Enable! Non-Inverting
TTL
SN54lS377
Octal D Type Flip-Flop With 3-State Outputs
CMOS
MC74AC374
logic: Standard, Special and Programmable
3.1-24
DT
SN74lS273
SN74lS377
-
Motorola Master Selection Guide
Selection by Function
Description
Device(s)
FLIP-FLOPS
CMOS
MC74ACT374
-
20
N
DW
TTL
MC74F534
-
20
N
DW
TTL
SN54LS374
20
N,J
DW
CMOS
MC74AC534
-
20
N
DW
Octal D-Type Flip-Flop WITh 3-State Outputs
CMOS
MC74ACT534
-
20
N
OW
Octal D-Type Latch With 3-State Outputs
CMOS
MC74AC564
-
20
N
DW
CMOS
MC74ACT564
-
20
N
DW
CMOS
MC74AC574
-
20
N
DW
CMOS
MC74ACT574
-
20
N
DW
Octal With 3-State Outputs Inverting D Flip-Flop
CMOS
MC74HC564
-
20
N
DW
Octal With 3-State Outputs Non-Inverting D Flip-Flop
CMOS
MC54HC374A
MC74HC374A
20
N,J
DW,
SD,DT
CMOS
MC54HC574A
MC74HC574A
20
N,J
DW
Octal With 3-State Outputs Non-Inverting D Flip-Flop With LSTTL
Compatible Inputs
CMOS
MC54HCT574A
MC74HCT574A
20
N,J
DW
Octal D Type Flip-Flop With 3-State Outputs
Quad D Flip-Flop
Quad D Flip-Flop With Common Clock & Reset
SN74LS374
CMOS
MC74AC175
-
16
N
D
CMOS
MC74ACT175
-
16
N
D
TTL
MC74F175
-
16
N
D
TTL
SN54LS175
16
N,J
D
CMOS
MC14175B
16
P,L
D
SN74LS175
-
CMOS
MC54HC175
MC74HC175
16
N,J
D
CMOS
MC54HC175A
MC74HC175A
16
N,J
D,SD
Quad D-Type Register With 3-State Outputs
CMOS
MC14076B
-
16
P,L
D
Quad Parallel Register With Enable
TTL
MC74F379
-
16
N
D
Quad With 3-State Outputs D Flip-Flop With Common Clock &
Reset
CMOS
MC74HC173
-
16
N
D
Triple D Flip-Flop With Set and Reset
ECL
MC100LVEL30
MC100EL30
20
DW
GATES, AND/NAND
13-lnput NAND Gate
8-lnput NAND Gate
Dual 4-lnput AND Gate
Dual 4-lnput NAND Buffer
Dual 4-lnput NAND Gate
CMOS
MC74HC133
TTL
SN54LS133
-
SN74LS133
-
16
N
D
16
N,J
D
14
N
D
14
N,J
D
CMOS
MC74HC30
TTL
SN54LS30
CMOS
MC14068B
-
14
P
D
TTL
MC74F21
-
14
N
D
14
N,J
D
14
P,L
D
14
N
D
14
N,J
D
TTL
SN54LS21
CMOS
MC14082B
SN74LS30
SN74LS21
-
TTL
MC74F40
TTL
SN54LS40
CMOS
MC74AC20
-
14
N
D
CMOS
MC74ACT20
14
N
D
14
N
D
14
N
D
D
SN74LS40
TTL
MC74F20
-
CMOS
MC74HC20
-
TTL
SN54LS20
SN74LS20
14
N,J
TTL
SN54LS22
SN74LS22
14
N,J
D
CMOS
MC14012B
-
14
P,L
D
-
14
P,L
D
14
P,L
16
P,L
Dual 4-lnput NAND Gate (Unbuffered)
CMOS
MC14012UB
Expandable NAND Gate
DTL
MC830
ECL
MCI 0197~, __
.~<~~~~
~"
Hex AND Gate
Motorola Master Selection Guide
3.1-25
-
L-_,.._=_,___,
"~'~'-I----~--' ~---~
FN --
Logic: Standard, Special and Programmable
Selection by Function
Device(s)
Description
GATES, AND/NAND
Low-Voltage CMOS Quad 2-lnput AND Gate, 5V-Tolerant Inputs
CMOS
MC74LCX08
-
14
D,DT
Low-Voltage CMOS Quad 2-lnput NAND Gate, 5V-Tolerant Inputs
CMOS
MC74LCXOO
-
14
D,DT
Low-Voltage Quiet CMOS Quad 2-lnput NAND Gate
CMOS
MC74LVQOO
-
14
D,M,
DT,SD
Quad 2-lnput AND Gate
CMOS
MC74AC08
-
14
N
D
CMOS
MC74ACT08
-
14
N
D
TTL
MC74F08
-
14
N
D
CMOS
MC54HC08A
MC74HC08A
14
N,J
D,DT
TTL
SN54LS08
SN74LS08
14
N,J
D
TTL
SN54LS09
SN74LS09
14
N,J
D
ECL
MC10Hl04
-
16
P,L
FN
FN
Quad 2-lnput AND Gate
Quad 2-lnput AND Gate With LSTTL-Compatible Inputs
ECL
MC10l04
-
16
P,L
CMOS
MC14081B
-
14
P,L
D
CMOS
MC54HCT08A
MC74HCT08A
14
N,J
D
-
TTL
MC74F37
14
N
D
TTL
SN54LS26
SN74LS26
14
N,J
D
TTL
SN54LS37
SN74LS37
14
N,J
D
Quad 2-lnput NAND Buffer Open-Collector
TTL
MC74F38
14
N
D
Quad 2-lnput NAND Buffer Open-Collector
TTL
SN54LS38
14
N,J
D
Quad 2-lnput NAND Gate
DTL
MC846
-
14
P,L
DTL
MC849
-
14
P,L
DTL
MC946
-
14
P,L
CMOS
MC74ACOO
-
14
N
CMOS
MC74ACTOO
-
14
N
D
TTL
MC74FOO
-
14
N
D
Quad 2-lnput NAND Buffer
Quad 2-lnput NAND Gate
-
SN74LS38
D
CMOS
MC54HCOOA
MC74HCOOA
14
N,J
D,DT
TTL
SN54LSOO
SN74LSOO
14
N,J
D
TTL
SN54LSOI
SN74LSOI
14
N,J
D
TTL
SN54LS03
SN74LS03
14
N,J
D
CMOS
MC14011B
-
14
P,L
D
Quad 2-lnput NAND Gate (Unbuffered)
CMOS
MC14011UB
-
14
P,L
D
Quad 2-lnput NAND Gate With LSTTL-Compatible Inputs
CMOS
MC54HCTOOA
MC74HCTOOA
14
N,J
D
Quad 2-lnput NAND Gate With Open-Drain Outputs
CMOS
MC74HC03A
-
14
N
D,DT
Triple 3-lnput AND Gate
CMOS
MC74ACII
-
14
N
D
CMOS
MC74ACTII
-
14
N
D
TTL
MC74Fli
-
14
N
D
CMOS
MC74HCli
-
14
N
D
TTL
SN54LSli
SN74LSII
14
N,J
D
TTL
SN54LS15
SN74LS15
14
N,J
D
CMOS
MC14073B
-
14
P,L
D
CMOS
MC74AC10
-
14
N
D
CMOS
MC74ACT10
-
14
N
D
TTL
MC74Fl0
-
14
N
D
CMOS
MC74HC10
-
14
N
D
TTL
SN54LS10
SN74LS10
14
N,J
D
TTL
SN54LS12
SN74LS12
14
N,J
D
CMOS
MC14023B
-
14
P,L
D
CMOS
MC14023UB
-
14
P,L
D
Triple 3-lnput NAND Gate
Triple 3-lnput NAND Gate (Unbuffered)
Logic: Standard, Special and Programmable
3.1-26
Motorola Master Selection Guide
Selection by Function
Description
Tech.
GATES, COMPLEX
-MC100El04-'-r-i-" ._- -=-~J
2-lnput AND/NAND Gate
ECl
MC10ElO4
2-lnput Differential AND/NAND Gate
ECl
MC10ElO5
2-lnput XOR/NOR Gate
ECl
MC10ElO7
2-Wide, 2-lnpuV2-Wide, 3-lnput AND-NOR Gate
CMOS
MC74HC51
2-Wide, 2-lnpuV2-Wide, 3-lnput AND-OR Gate
CMOS
MC74HC58
14
N
2-Wide, 4-lnput AND/OR Invert Gate
SN54lS55
SN74lS55
14
N.J
D
SN54lS54
SN74LS54
14
N,J
D
4-2-3-2 Input AND-OR-Invert Gate
TTL
TTL
TTL
MC74F64
-
14
N
D
4-Bit AND/OR Selector
CMOS
MC14519B
-
16
P
D
4-lnput OR/NOR Gate
ECl
MC10ElOl
4-Wide 4-3-3-3 Input OR-AND Gate
ECl
MC10H119
-
16
P,l
FN
4-Wide 4-3-3-3 Input OR-AND Gate
ECl
MC10119
-
16
P.l
FN
4-Wide OR-AND/OR-AND-Invert Gate
ECl
MC10H121
16
P,l
FN
4-Wide OR-AND/OR-AND-Invert Gate
ECl
MC10121
16
P,l
FN
8-lnput NOR/OR Gate
CMOS
MC74HC4078
-
14
N
D
Dual 2 Wide 2-lnpuV3-lnput AND/OR Invert Gate
TTL
SN54lS51
14
N,J
D
Dual 2-Wide 2-3-lnput OR-AND/OR-AND-Invert Gate
ECl
MC10117
16
P,l
FN
ECl
MC10H117
P,L
FN
Dual 2-Wide 2-lnput, 2-Wide 3-lnput AND-OR-Invert Gate
TTL
MC74F51
Dual 2-Wide 3-lnput OR-AND Gate
ECl
MC10H118
-
ECl
MC10118
-
ECl
MC10Hl09
ECl
MC10109
ECl
MC10H209
Dual 4-lnput NAND, 2-lnput NOR/OR, 8-lnput AND/NAND Gate
(Unbuffered)
CMOS
MC1450tUB
-
Dual 4-lnput OR/NOR Gate
ECl
MC1660
Dual 5-lnput Majority logic Gate
CMOS
MC14530B
Dual Expandable AND OR Invert Gate (Unbuffered)
CMOS
MC14506UB
3-2-2-3-lnput AND/OR Invert Gate
Dual 4-5 Input OR/NOR Gate
Hex NAND/NOR/Invert Gate (Unbuffered)
CMOS
MC14572UB
High Speed Dual 3-lnput 3-Output OR/NOR Gate
ECl
MC10212
"
MC100ElO5
8
MC100ElO7
8
-
14
MC100ElOl
~
r--'~-
N
8
SN74lS51
D
-"[)
D-D
D
--~~
-
--
~.
16
14
N
D
16
P,L
FN
16
P,l
FN
16
P,l
FN
16
P.l
FN
16
P,l
FN
16
P
D
16
l
16
P
16
l
16
P
16
P
D
D
Quad 4-lnput OR/NOR Gate
ECl
MC10El0l
MC100El0l
28
Quad Differential AND/NAND Gate
ECl
MC10E404
MC100E404
28
Quad OR/NOR Gate
ECl
MC10Hl01
-
16
P,l
FN
ECl
MC10l0l
-
16
P,l
FN
Quint 2-lnput AND/NAND Gate
ECl
MC10El04
MC100El04
28
Quint 2-lnput XOR/XNOR Gate
ECl
MC10El07
MC100El07
28
Triple 2-3-2 Input OR/NOR Gate
ECl
MC10Hl05
-
16
P,l
FN
ECl
MC10l05
-
16
P,l
FN
ECl
MC10Hl07
16
P.l
FN
ECl
MC10l07
-
16
P,l
FN
CMOS
MC74AC810
N
DW
MC74ACT810
-
14
CMOS
14
N
DW
CMOS
MC74HC7266
-
14
N
D
TTL
SN54lS266
14
N,J
D
Quad Exclusive NOR Gate
CMOS
MC14077B
-
14
P,l
D
Quad 2-lnput Exclusive OR Gate
CMOS
MC74AC86
-
14
N
D
Triple 2-lnput Exclusive OR/Exclusive NOR Gate
FN
FN
FN
FN
GATES, EXCLUSIVE ORlEXCLUSIVE NOR
Quad 2-lnput Exclusive NOR Gate
Motorola Master Selection Guide
3.1-27
SN74lS266
logic: Standard, Special and Programmable
Selection by Function
I
Description
Tech.
Device(s)
Pins
I DIP I SM
GATES, EXCLUSIVE OR/EXCLUSIVE NOR
Quad 2-lnput Exclusive OR Gate
Quad Exclusive OR Gate
CMOS
MC74ACT86
TTL
MC74F86
CMOS
MC54HC86
TTL
TTL
TTL
SN74lS136
ECl
MC10H113
MC74HC86
-
14
N
D
14
N
D
14
N,J
D
14
N,J
D
D
SN54lS386
SN74lS386
14
N,J
SN54lS86
SN74lS86
14
N,J
D
-
16
P,l
FN
16
P,l
FN
14
P,l
D
16
l
-
14
P
D
16
P,l
FN
14
P,l
D
16
P,l
FN
16
P,l
FN
14
N
D
14
P,l
D
14
P,l
D
14
N,J
D
ECl
MC10113
CMOS
MC14070B
ECl
MC1672
8-lnput NOR Gate
CMOS
MC14078B
Dual 3-lnput 3-0utput NOR Gate
ECl
MC10111
Dual 3-lnput NOR Gate + Inverter (Unbuffered)
CMOS
MC14000UB
Dual 3-lnput, 3-0utput NOR Gate
ECl
MC10H211
Dual 3-lnput, 3-Output NOR Gate
ECl
MC10211
Dual 4-lnput NOR Gate
CMOS
MC74HC4002
CMOS
MC14002B
Dual 4-lnput NOR Gate (Unbuffered)
CMOS
MC14002UB
Dual 5-lnput NOR Gate
TTL
SN54lS260
lOW-Voltage CMOS Quad 2-lnput NOR Gate, 5V-Tolerant Inputs
CMOS
MC74lCX02
Quad 2-lnput NOR Buffer
SN54lS28
SN74lS28
14
N,J
D
Quad 2-lnput NOR Buffer
TTL
TTL
SN54lS33
SN74lS33
14
N,J
D
Quad 2-lnput NOR Gate
CMOS
MC74AC02
14
N
D
CMOS
MC74ACT02
14
N
D
TTL
MC74F02
14
N
D
CMOS
MC54HC02A
MC74HC02A
14
N,J
D,DT
TTL
SN54lS02
SN74lS02
14
N,J
D
ECl
MC10H102
16
P,l
FN
ECl
MC10102
16
P,l
FN
ECl
MC1662
16
l
Quad 2-lnput NOR Gate
CMOS
MC14001B
14
P,l
Quad 2-lnput NOR Gate (Unbuffered)
CMOS
MC14001UB
14
P,l
D
Quad 2-lnput NOR Gate With strobe
ECl
MC10H100
16
P,l
FN
ECl
MC10100
16
P,l
FN
Triple 3-lnput NOR Gate
CMOS
MC54HC27
MC74HC27
14
N,J
D
TTL
SN54lS27
SN74lS27
14
N,J
D
CMOS
MC14025B
-
14
P,l
D
Triple 3-lnput NOR Gate (Unbuffered)
CMOS
MC14025UB
-
14
P,l
D
Triple 4-3-3 Input NOR Gate
ECl
MC10H106
16
P,l
FN
ECl
MC10106
-
16
P,l
FN
ECl
MC10110
P,l
FN
MC10H210
16
P,l
FN
ECl
MC10210
16
P,l
FN
Dual 4-lnput OR Gate
CMOS
MC14072B
14
P
low-Voltage CMOS Quad 2-lnput OR Gate, 5V-Tolerant Inputs
CMOS
MC74lCX32
-
16
ECl
Triple 2-lnput Exclusive-OR Gate
GATES, NOR
SN74lS260
-
14
-
-
D,DT
D
GATES, OR
Dual 3-lnput 3-Output OR Gate
logic: Standard, Special and Programmable
3.1-28
14
D
D,DT
Motorola Master Selection Guide
Selection by Function
Description
Device(s)
GATES,OR
Quad 2-lnput OR Gate
Triple 3-lnput OR Gate
-
CMOS
MC74AC32
CMOS
MC74ACT32
TTL
MC74F32
14
N
D
CMOS
MC54HC32A
MC74HC32A
14
N,J
D,DT
D
14
N
D
14
N
D
CMOS
MC54HCT32A
MC74HCT32A
14
N,J
TTL
SN54lS32
SN74LS32
14
N,J
D
ECl
MC10H103
16
P,l
FN
16
P,l
FN
14
P,l
D
14
N
D
14
P,l
D
16
P
DW
14
P,L
ECl
MC10103
CMOS
MC14071B
CMOS
MC74HC4075
CMOS
MC14075B
-
INDUSTRIAL CONTROL UNIT
IIndustrial Control Unit
ICMOS IMC14500B
INVERTERS
Hex Inverter
-
DTl
MC836
DTl
MC837
DTl
MC936
DTl
MC937
DTL
MC840
9-Bit Buffer
ECl
MC10E122
MC100E122
28
Driver
ECl
MC10EL12
MC100El12
8
Dual Complementary Pair Plus Inverter (Unbuffered)
CMOS
MC14007UB
Hex Buffer With Enable
ECl
MC10H188
ECl
MC10188
Hex Buffer/Non-Inverting
CMOS
MC14050B
Hex Inverter
CMOS
Hex Inverter
Hex Inverter (Without Input Diodes)
14
P,l
14
P,l
14
P,l
14
P,l
INVERTERIBUFFERS,2-STATE
FN
D
14
P
D
16
P,l
FN
16
P,l
FN
16
P,l
D
MC74AC04
-
14
N
D
CMOS
MC74ACT04
-
14
N
D
TTL
MC74F04
-
14
N
D
CMOS
MC54HC04A
MC74HC04A
14
N,J
D,SD,
DT
TTL
TTL
SN54lS04
SN74lS04
14
N,J
D
SN54lS05
SN74lS05
14
N,J
D
Hex Inverter Gate (Unbuffered)
CMOS
MC14069UB
14
P,L
D
Hex Inverter With Enable
ECl
MC10H189
16
P,l
FN
16
P,l
FN
14
N
D,DT
14
N
D
14
N
D
14
P,l
ECl
MC10189
Hex Inverter With lSTTl Compatible Inputs
CMOS
MC74HCT04A
Hex Inverter With open Drain Outputs
CMOS
MC74AC05
CMOS
MC74ACT05
Hex Inverter With Strobe (Active Pullup)
HTl
MC677
Hex Inverter With Strobe (Without Output Resistors)
HTl
MC678
-
14
P,l
Hex Inverter/Buffer
ECl
MC10195
-
16
P,l
FN
CMOS
MC14049B
16
P
D
Hex Inverter/Buffer (Unbuffered)
CMOS
MC14049UB
-
16
P,l
D
Hex Inverting Buffer/logic-level Down Converter
CMOS
MC54HC4049
MC74HC4049
16
N,J
D
MC74HC4050
16
N,J
D
14
N
D
Hex Non-Inverting Buffer/logic-level Down Converter
CMOS
MC54HC4050
Hex Unbuffered Inverter
CMOS
MC74HCU04
Motorola Master Selection Guide
3.1-29
-
logic: Standard, Special and Programmable
Selection by Function
I
Tech.
Description
Device(s)
Pins
I DIP I SM
INVERTER/BUFFERS,2-STATE
Low-Voltage CMOS Hex Inverter, With 5V-Tolerant Inputs
CMOS
MC74LCX04
-
14
D,DT
Low-Voltage QUiet CMOS Hex Inverter
CMOS
MC74LVQ04
-
14
D,M,
SD,DT
Quad 2-lnput Gate (Active Pullup)
HTL
MC672
P,L
HTL
MC668
-
14
Quad 2-lnput Gate (Passive Pullup)
14
P,L
Quad Driver
ECL
MC10E112
Strobed Hex InverteriBuffer
CMOS
MC14502B
MC100E112
28
FN
Triple 3-lnput Gate (Active Pullup)
HTL
MC671
-
Triple 3-lnput Gate (Passive Pull up)
HTL
MC670
-
3-Bit 4:1 Mux-Latch (Integrated E156 & E171)
ECL
MC10E256
MC100E256
28
FN
3-Bit 4:1 Mux-Latch, With Common Enable, Asynchronous Master
Reset, Differential Output
ECL
MC10E156
MC100E156
28
FN
16
P,L
14
P,L
14
P,L
DW
LATCHES
4-Bit D Latch
TTL
SN54LS75
SN74LS75
16
N,J
D
TTL
SN54LS77
SN74LS77
14
N,J
D
N,J
TTL
SN54LS375
SN74LS375
16
5-Bit 2: 1 Mux-Latch, With Common Enable, Asynchronous Master
Reset Differential Output
ECL
MC10E154
MC100E154
28
FN
6-Bit 2: 1 Mux-Latch, With Common Enable, Asynchronous Master
Reset Single Ended
ECL
MC10E155
MC100E155
28
FN
6-Bit D Latch
ECL
MC10E150
MC100E150
28
8-Bit Addressable Latch
CMOS
MC74AC259
CMOS
8-Bit Addressable Latch
8-Bit Bus Compatible Addressable Latch
FN
16
N
D
MC74ACT259
-
16
N
D
TTL
MC74F259
-
16
N
D
TTL
SN54LS259
16
N,J
D
CMOS
MC14099B
16
P
DW
CMOS
MC14599B
CMOS
MC14598B
9-Bit Latch, With Parity
ECL
MC10E175
Dual Latch
ECL
MC10H130
Dual 2-Bit Transparent Latch
CMOS
MC74HC75
Dual 4-Bit Addressable Latch
CMOS
MC74AC256
Dual 4-Bit Latch
D
CMOS
MC74ACT256
TTL
MC74F256
TTL
SN54LS256
CMOS
MC14508B
Dual Latch
ECL
MC10130
Low-Voltage CMOS Octal Transparent Latch, 3-State,
Non-Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX373
Low-Voltage CMOS Octal Transparent Latch Flow Through Pinout,
3-State, Non-Inverting With 5V Tolerant Inputs and Outputs
CMOS
Low-Voltage Quiet CMOS Octal Transparent Latch
SN74LS259
MC100E175
18
P
18
P,L
FN
28
-
16
P,L
16
N
D
-
16
N
DW
16
N
DW
-
16
N
D
16
N,J
D
24
P,L
DW
16
P,L
FN
FN
20
DW,M,
DT
MC74LCX573
-
20
DW,M,
SD,DT
CMOS
MC74LVQ373
-
20
DW,M,
SD,DT
Low-Voltage Quiet CMOS Octal Transparent Latch Flow Through
Pinout
CMOS
MC74LVQ573
-
20
DW,M,
SD,DT
Octal 3-State Non-Inverting Transparent Latch With LSTTL
Compatible Inputs
CMOS
MC54HCT373A
MC74HCT373A
20
N,J
DW,
SD,DT
Octal D Latch With 3-State Outputs
CMOS
MC74AC563
N
DW
MC74ACT563
-
20
CMOS
20
N
DW
CMOS
MC74AC573
-
20
N
DW
Logic: Standard, Special and Programmable
3.1-30
Motorola Master Selection Guide
Selection by Function
Description
Device(s)
LATCHES
Octal D latch With 3-State Outputs
CMOS
MC74ACT573
-
20
N
DW
Octal Transparent latch With 3-State Outputs
CMOS
MC74AC373
-
20
N
DW
CMOS
MC74ACT373
-
20
N
DW
TTL
SN54lS373
20
N,J
DW
TTL
MC74F373
-
20
N
DW
TTL
MC74F533
-
20
N
DW
CMOS
MC74AC533
-
20
N
DW
CMOS
MC74ACT533
-
20
N
DW
CMOS
MC54HC533A
MC74HC533A
20
N,J
DW
CMOS
MC54HC563
MC74HC563
20
N,J
DW
CMOS
MC54HC373A
MC74HC373A
20
N,J
DW
CMOS
MC54HC573A
MC74HC573A
20
N,J
DW
Octal With 3-State Outputs Non-Inverting Transparent latch With
lSTTl Compatible Inputs
CMOS
MC74HCT573A
-
20
N
DW
Quad latch
ECl
MC10133
-
16
P,l
FN
ECl
MC10153
-
16
P,l
FN
ECl
MC10168
-
16
P
Octal With 3-State Outputs Inverting Transparent latch
Octal With 3-State Outputs Non-Inverting Transparent latch
Quad NAND R-8 latch
CMOS
MC14044B
Quad NOR R-S latch
CMOS
MC14043B
Quad Set/Reset latch
TTL
SN54lS279
Quad Transparent latch
CMOS
MC14042B
Quint latch
ECl
MC10H175
ECl
MC10175
IECl
I MC10H660
IECl
I MC10E197
SN74LS373
16
P
D
16
P,l
D
16
N,J
D
-
16
P,l
D
-
16
P,l
FN
16
P,l
FN
SN74lS279
MEMORY SUPPORT
I4-Bit ECl-TTl load Reducing DRAM Driver
I MC100H660
28
FN
28
FN
MISCELLANEOUS
I Data Separator
MULTIPLEXERIDATA SELECTORS
CMOS
MC74AC151
-
16
N
CMOS
MC74ACT151
-
16
N
D
16-Channel Analog Multiplexer/Demultiplexer
CMOS
MC14067B
-
24
P
DW
1-01--8 Decoder/Demultiplexer
D
16:1 Multiplexer
ECl
MC10E164
MC100E164
28
FN
2-Bit 8:1 Multiplexer
ECl
MC10E163
MC100E163
28
FN
2:1 Multiplexer
ECl
MC10El58
MC100El58
8
D
3-Bit 4:1 Multiplexer, With Split Select Differential Output
ECl
MC10E171
MC100E171
28
FN
4:1 Differential Multiplexer
ECl
MC10El57
MC100EL57
16
D
5-Bit 2:1 Multiplexer, With Differential Output
ECl
MC10E158
MC100E158
28
FN
8-Channel Analog Multiplexer/Demultiplexer With Address latch
CMOS
MC54HC4351
MC74HC4351
20
N,J
DW
8-Channel Analog Multiplexer/Demultiplexer
CMOS
MC54HC4051
MC74HC4051
16
N,J
D,DW
,DT
D
CMOS
MC14051B
-
16
P,l
8-Channel Data Selector
CMOS
MC14512B
-
16
P,l
D
8-lnput Data Selector/Multiplexer
CMOS
MC74HC151
-
16
N
D
D
8-lnput Data Selector/Multiplexer With 3-State Outputs
CMOS
MC54HC251
B-Input Multiplexer
TTL
MC74F151
TTL
SN54lS151
TTL
SN54lS251
TTL
MC74F251
B-Input Multiplexer With 3-8tate Outputs
Motorola Master Selection Guide
3.1--31
MC74HC251
16
N,J
16
N
D
SN74lS151
16
N,J
D
SN74LS251
16
N,J
D
16
N
D
-
-
logic: Standard, Special and Programmable
Selection by Function
I
Description
Device(s)
Tech.
Pins
I DIP I 8M
MULTIPLEXER/DATA SELECTORS
CMOS
MC74AC251
CMOS
MC74ACT251
8-lnput Data Selector/Multiplexer With Data and Address Latchs
and With 3-State Outputs
CMOS
MC54HC354
8-Line Multiplexer
ECl
MC10H164
ECl
MC10164
Dual 4-Channel Analog Data Selector
CMOS
MC14529B
Dual 4-Channel Analog Multiplexer/Demultiplexer
CMOS
MC74HC4052
CMOS
MC14052B
Dual 4-Channel Data Selector/Multiplexer
CMOS
MC14539B
Dual 4-lnput Data Selector/Multiplexer
CMOS
MC74HC153
8-lnput Multiplexer With 3-State Outputs
MC74HC354
-
16
N
16
N
D
D
20
N,J
DW
16
P,l
FN
16
P,l
FN
16
P
D
16
N
D,DW
16
P,l
D
16
P
D
16
N
D
16
N
D
16
N
D
16
N
D
16
N
DW
16
N
DW
16
N
D
16
N
D
Dual 4-lnput Data Selector/Multiplexer With 3-State Outputs
CMOS
MC74HC253
Dual 4-lnput Multiplexer
CMOS
MC74AC153
CMOS
MC74ACT153
CMOS
MC74AC352
CMOS
MC74ACT352
TTL
MC74F153
TTL
MC74F352
TTL
SN54lS153
SN74lS153
16
N,J
D
TTL
SN54lS352
SN74lS352
16
N,J
D
Dual 4-lnput Multiplexer With 3-State Outputs
Dual 4-lnput Multiplexer With 3-State Outputs
Dual4-to-l Multiplexer
CMOS
MC74AC253
-
16
N
DW
CMOS
MC74ACT253
-
16
N
DW
CMOS
MC74AC353
16
N
D
CMOS
MC74ACT353
-
16
N
D
TTL
SN54lS253
SN74lS253
16
N,J
D
TTL
SN54lS353
SN74lS353
16
N,J
D
TTL
MC74F253
16
N
D
TTL
MC74F353
16
N
D
ECl
MC10H174
16
P,l
FN
16
P,l
ECl
MC10174
Dual Differential 2:1 Multiplexer (3.3V)
ECl
MC100lVEL56
Dual Multiplexer With Latch
ECl
MC10134
Dual Multiplexer With latch and Common Reset
ECl
MC10132
low Voltage 16:1 Multiplexer
ECl
MC100lVE164
Quad 2-lnput Multiplexer With Latch
ECl
MC10H173
-
MC100El56
-
20
FN
DW
16
P,l
FN
16
P,l
FN
P,l
FN
16
P
D
16
N,J
D
-
16
N
D
16
N
D
32
16
FA
Quad 2-Channel Analog Multiplexer/Demultiplexer
CMOS
MC14551B
Quad 2-lnput Data Selector/Multiplexer
CMOS
MC54HC158
Quad 2-lnput Data SelectorlMultiplexer With 3-State Outputs
CMOS
MC74HC257
Quad 2-lnput Data Selector/Multiplexer With lSTTl Compatible
Inputs
CMOS
MC74HCT157A
Quad 2-lnput Data Selectors/Multiplexers
CMOS
MC54HC157A
MC74HC157A
16
N,J
D,DT
Quad 2-lnput Multiplexer
TTL
MC74F157A
-
16
N
D
TTL
MC74F158A
-
16
N
D
TTL
SN54lS157
SN74lS157
16
N,J
D
TTL
SN54lS158
SN74lS158
16
N,J
D
Quad 2-lnput Multiplexer (Inverting)
ECl
MC10159
-
16
P,l
FN
Quad 2-lnput Multiplexer (Non-Inverting)
ECl
MC10158
-
16
P,l
FN
logic: Standard, Special and Programmable
3.1-32
MC74HC158
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
I DIP I SM
MULTIPLEXER/DATA SELECTORS
Quad 2-lnput Multiplexer Inverting With 3-State Outputs
CMOS
MC74AC258
CMOS
MC74ACT258
CMOS
MC74ACT257
CMOS
MC74AC257
SN54lS257B
Quad 2-lnput Multiplexer With Storage
TIL
TIL
SN54lS298
Quad 2-lnput Multiplexer, Inverting
CMOS
MC74AC158
CMOS
MC74ACT158
Quad 2-lnput Multiplexer, Inverting Output
ECl
MC10H159
Quad 2-lnput Multiplexer, Inverting, With 3-3tate Outputs
TIL
SN54lS258B
Quad 2-lnput Multiplexer, Non-Inverting
CMOS
MC74AC157
Quad 2-lnput Multiplexer Non-Inverting With 3-State Outputs
Quad 2-lnput Multiplexer With 3-State Outputs
-
16
N
DW
16
N
DW
16
N
D
16
N
D
SN74lS257B
16
N,J
D
SN74lS298
16
N,J
D
16
N
D
SN74lS258B
CMOS
MC74ACT157
Quad 2-lnput Multiplexer, Non-Inverting Output
ECl
MC10H158
-
Quad 2-lnput Multiplexer, With 3-State Outputs
TIL
TIL
MC74F257A
-
MC74F258A
Quad 2-lnput Multiplexer/latch
ECl
MC10173
Quad 2-Port Register
TIL
TIL
TIL
TIL
MC74F398
-
Quad 2:1 Mux, Individual-Select
Quad Analog Switch/Multiplexer
Quad Analog Switch/Multiplexer/Demultiplexer
MC74F399
SN54lS398
SN74lS398
16
N
D
16
P,l
FN
16
N,J
D
16
N
D
16
N
D
16
P,l
FN
16
N
D
16
N
D
16
P,l
FN
20
N
DW
16
N
D
20
N,J
DW
N,J
SN54lS399
SN74lS399
16
ECl
MC10E157
MC100E157
28
CMOS
MC14016B
CMOS
MC14066B
-
D
FN
14
P,l
D
14
P,l
D
CMOS
MC54HC4016
MC74HC4016
14
N,J
D
CMOS
MC54HC4066
MC74HC4066
14
N,J
D,DT
Quad Analog Switch/Multiplexer/Demultiplexer With Separate
Analog/Digital Power Supplies
CMOS
MC74HC4316
16
N
D
Triple 2-Channel Analog Multiplexer/Demultiplexer
CMOS
MC54HC4053
16
N,J
D,DW
CMOS
MC14053B
16
P,l
D
Triple 2-Channel Analog Multiplexer/Demultiplexer With Address
latch
CMOS
MC54HC4353
MC74HC4353
20
N,J
DW
Triple 2:1 Multiplexer
ECl
MC100El59
DW
ECl
MC100lVEl59
-
20
Triple 2:1 Multiplexer (3.3V)
20
DW
Triple Differential 2:1 Multiplexer
ECl
MC100E457
-
28
FN
ECl
MC10E457
-
28
FN
-
20
P
FN
20
P
FN
14
P,l
-
MC74HC4053
-
MULTIVIBRATORS
130MHz Voltage Controlled Multivibrator
ECl
MC12101
200 MHz Voltage Controlled Multivibrator
ECl
MC12100
Dual Monostable Multivibrator
HTl
MC667
CMOS
MC14528B
16
P,l
D
Dual Monstable Multivibrators With Schmitt Trigger Inputs
TIL
SN54lS221
SN74lS221
16
N,J
D
Dual Precision Monostable Multivibrator Retriggerable, Resettable)
CMOS
MC54HC4538A
MC74HC4538A
16
N,J
0
Dual Precision Monostable Multivibrator
CMOS
MC14538B
16
P,l
D,DW
Dual Voltage-Controlled Multivibrator
ECl
MC4024
14
P,l
Monostable Multivibrator
DTl
MC951
-
14
P,l
ECl
MC10198
-
16
P,l
FN
TIL
TIL
SN54lS122
SN74lS122
14
N,J
D
SN54lS123
SN74lS123
14
N,J
D
Retriggerable Monostable Multivibrators
Motorola Master Selection Guide
3.1-33
logic: Standard, Special and Programmable
Selection by Function
I
Description
IVoltage Controlled Multivibrator
Tech.
MULTIVIBRATORS
I Pins I DIP I SM
Device(s)
IMC1658
16
P,l
D,FN
D
OSCILLATORS
-
14
N
16
P,l
14
P,l
14
P,l
D,FN
-
16
P,l
D
14
P,l
D
16
P,l
DW
16
P,l
DW
-
16
P,l
FN
16
P,l
FN
7-Stage Binary Ripple Counter
CMOS
MC74HC4024
Crystal Oscillator
ECl
MC12061
Dual VoltagiH::ontrolied MuHivibrator
ECl
MC4324
low Power Voltage Controlled Oscillator
ECl
MC12148
Voltage Controlled Oscillator
ECl
MC1648
24-Stage Frequency Divider
CMOS
MC14521B
Programmable Oscillator Timer
CMOS
MC14541B
Programmable Timer
CMOS
MC14536B
Quad Precision Timer/Driver
CMOS
MC14415
ECl
MC10H160
ECl
MC10160
12-Bit Parity Generator/Checker, Register-Shiftable, Dill Output
ECl
MC10E160
12--Bit Parity Tree
CMOS
MC14531B
-
16
P
D
9 + 2-Bit Parity Generator-Ghecker
ECl
MC10170
-
16
P,l
FN
9--Bit Odd/Even Parity Generator/Checker
CMOS
MC74HC280
-
14
N
D
SN54lS280
14
N,J
D
9--Bit Parity Generator/Checker
TTL
TTL
MC74F280
14
N
D
Error Detection and Correction Circuit
ECl
MC10E193
8
D,SD
OSCILLATORITIMERS
PARITY CHECKERS
12--Bit Parity Generator/Checker
PHASE-LOCKED LOOP
IPhase-Locked loop
MC100E160
SN74lS280
MC100E193
ICMOS IMC14046B
28
FN
28
FN
16
P,l
8
P
DW
PRESCALERS
1.1 GHz +10/20/40/80 Prescaler
ECl
MC12080
1 .1 GHz +1261128, +254/256 low Power Dual Modulus Prescaler
ECl
MC12058
1.1 GHz +127/128, +2551256 low Power Dual Modulus Prescaler
ECl
MC12038A
1.1 GHz +6/9, +16117 Dual Modulus Prescaler
ECl
MC12026A
ECl
MC12026B
-
1 .1 GHz +2 low Power Prescaler With Stand-By Mode
ECl
MC12083
-
1.1 GHz +21418 low Power Prescaler With Stand-By Mode
ECl
MC12093
1 .1 GHz +256 Prescaler
ECl
MC12074
1.1 GHz +32133, 434/65 Dual Modulus Prescaler
ECl
MC12028A
-
1.1 GHz +32133, 434/65 Dual Modulus Prescaler
ECl
MC12028B
1.1 GHz 434 Prescaler
ECl
MC12073
1.1 GHz +64165, +1281129 Dual Modulus Prescaler
ECl
MC12022A
ECl
MC12022B
ECl
MC12022SlA
ECl
8
D
D,SD
8
P
8
P
D
8
P
D
8
P
D
8
P
D,SD
D
8
P
D
8
P
D
8
P
D
-
8
P
D
8
P
D
8
P
D
8
P
D
MC12022SlB
-
8
P
D
ECl
MC12022TSA
-
8
P
D
ECl
MC12022TSB
8
P
D
1.1 GHz +64165, +1281129 Dual Modulus Prescaler W~h Stand-By
Mode
ECl
MC12036A
8
P
D
ECl
MC12036B
-
8
P
D
1.1 GHz +64165, +1281129 low Voltage Dual Modulus Prescaler
ECl
MC12022lVA
-
8
P
D
ECl
MC12022lVB
-
8
P
D
logic: Standard, Special and Programmable
3.1--34
Motorola Master Selection Guide
Selection by Function
Description
Device(s)
PRESCALERS
1.1 GHz +64/65, +128/129 low Voltage Dual Modulus Prescaler
8
P
8
P
MC12052A
-
8
D,SD
MC12053A
-
8
D,SD
-
8
P
D
8
P
D
8
P
D
8
P
D
8
P
D
8
P
D
8
P
D
-
8
P
D
8
P
D
-
8
P
D
8
P
D
-
8
ECl
MC12022TVA
ECl
MC12022TVB
1.1 GHz +64165, +128/129 Super low Power Dual Modulus
Prescaler
ECl
1.1 GHz +64/65, + 128/129 Super low Power Dual Modulus
Prescaler With Stand-By Mode
ECl
1.3GHz +64 Prescaler
ECl
MC12075
1.3GHz +256 Prescaler
ECl
MC12076
ECl
MC12078
ECl
MC12034A
ECl
MC12034B
ECl
MC12033A
ECl
MC12033B
ECl
MC12032A
ECl
MC12032B
ECl
MC12031A
ECl
MC12031B
ECl
MC12054A
2.5GHz +2, +4 low Power Prescaler With Satnd-By Mode
ECl
MC12095
2.8GHz +64/128/256 Prescaler
ECl
MC12079
ECl
MC12089
225MHz +20/21 Dual Modulus Prescaler
ECl
MC12019
225M Hz +32/33 Dual Modulus Prescaler
ECl
MC12015
225MHz +40/41 Dual Modulus Prescaler
ECl
MC12016
225MHz +64 Prescaler
ECl
MC12023
225MHz +64/65 Dual Modulus Prescaler
ECl
MC12017
2.0GHz +32/33, +64/65 Dual Modulus Prescaler
2.0GHz +32/33, +64/65 low Voltage Dual Modulus Prescaler
2.0GHz +64/65, +128/129 Dual Modulus Prescaler
2.0GHz +64165, +1281129 low Voltage Dual Modulus Prescaler
2.0GHz +64/65, +128/129 Super low Power Dual Modulus
Prescaler
480MHz +5/6 Dual Modulus Prescaler
ECl
MC12009
520MHz + 128/129 Dual Modulus Prescaler
ECl
MC12018
520MHz +64/65 Dual Modulus Prescaler
ECl
MC12025
550MHz+10111 Dual Modulus Prescaler
ECl
MC12013
550MHz +8/9 Dual Modulus Prescaler
ECl
MC12011
750MHz +2 UHF Prescaler
ECl
MC12090
D
D
D,SD
8
D,SD
8
P
8
P
D
D
8
P,l
D
8
P,l
D
8
P,l
D
8
P
D
8
P,l
D
16
P,l
8
P,l
D
8
P
D
16
P,l
16
P,l
16
P,l
PROGRAMMABLE DELAY CHIPS
Programmable Delay Chip (Dig 80ps Anal. 1.6 Pslmv)
Programmable Delay Chip (Digitally Selectable 20ps Res)
1024-Bil Programmable Read Only Memory
32 X 8-Bit Programmable Read Only Memory
1024 X 1-Bit Random Access Memory
256 X 1-Bit Random Access Memory
RECEIVERS
Differential Receiver
ECl
MC10El16
High Speed Triple Line Receiver
ECl
MC10216
low-Voltage Quad Differential Line Receiver
ECl
MC100lVEL17
Quad Bus Receiver
ECl
MC10129
Motorola Master Selection Guide
3.1-35
MC100El16
MC100EL17
-
8
16
D
P,l
DW
20
16
FN
l
logic: Standard, Special and Programmable
Selection by Function
I
Description
Tech.
Devlce(s)
Pins
I DIP I
SM
16
P,l
FN
16
P,l
FN
16
l
RECEIVERS
Quad Line Receiver
-
ECl
MC10Hl15
ECl
MC10115
ECl
MC1692
ECl
MC10El16
MC100El16
28
ECl
MC10E416
MC100E416
28
ECl
MC10Hl16
ECl
MC10114
ECl
MC10116
16 X 4-Bit Register File (RAM)
ECl
MC10H145
4 X 4 Register File Open Collector
SN54lS170
SN74lS170
4 X 4 Register File With 3-State Outputs
TTL
TTL
SN54lS670
SN74lS670
64-Bit Register File (RAM)
ECl
MCM10145
8 X 2 Multiport Register File (RAM)
ECl
MCM10143
TTL
TTL
MC74F13
Dual Schmitt Trigger
CMOS
MC14583B
Hex Inverter Schmitt Trigger
CMOS
MC74AC14
Quint Differential Line Receiver
Triple Line Receiver
FN
FN
-
16
P,l
D,FN
16
P,l
FN
16
P,l
FN
-
16
P,l
FN
16
N,J
D
16
N,J
D
REGISTERS
4 X 4 Multiport Register
Hex Parallel D Register With Enable
REGISTER FILES
-
16
l
24
l
-
14
N
D
14
N,J
D
16
P
D
14
N
D
14
N
D
14
N
D
14
N,J
D
SCHMITT TRIGGERS
Dual 4-lnput NAND Schmitt Trigger
Hex Schmitt Trigger
Hex Schmitt Trigger Inverter
SN54lS13
SN74lS13
-
CMOS
MC74ACT14
TTL
TTL
MC74F14
CMOS
MC14106B
-
14
P,l
D
CMOS
MC14584B
.-
14
P,l
D
SN54lS14
SN74lS14
CMOS
MC54HC14A
MC74HC14A
14
N,J
D,DT
CMOS
MC54HCT14A
MC74HCT14A
14
N,J
D
Quad 2-lnput NAND Gate With Schmitt Trigger Inputs
CMOS
MC54HC132A
MC74HC132A
14
N,J
D
Quad 2-lnput NAND Schmitt Trigger
CMOS
MC74AC132
14
N
D
14
N
D
14
N
D
14
P,l
D
14
N,J
D
-
CMOS
MC74ACT132
TTL
MC74F132
CMOS
MC14093B
TTL
SN54lS132
18-Bit Active SCSI Bus Terminator
('Also Available in 32-Pin QFP Package)
CMOS
MCCS142235
-
24,32
9-Bit Switchable SCSI Bus Term (1100: Active)
CMOS
MCCS142234
D
CMOS
MCCS142233
20
FN
9-Bit Switchable Active SCSI-2 Bus Term (1100) with Volt Reg
CMOS
MCCS142237
-
16
9-Bit Switchable SCSI Bus Term (2200 & 3300: Passive)
16,20
DW,
DT
Quad 2-lnput Schmitt Trigger NAND Gate
SN74lS132
SCSI BUS TERMINATORS
DW,*F
A
SHIFT REGISTERS
l-t0-64-Bit Variable length Shift Register
CMOS
MC14557B
128-Bit Static Shift Register
CMOS
MC14562B
18-Bit Static Shift Register
CMOS
MC14006B
3-Bit Scannable Registered Address Driver, ECl
ECl
MC10E212
logic: Standard, Special and Programmable
3.1-36
MC100E212
16
P,l
14
P,l
14
P,l
28
DW
D
FN
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
I DIP I
SM
SHIFT REGISTERS
4-Bit Bidirectional Universal Shift Register
CMOS
MC74AC194
-
16
N
D
CMOS
MC74ACT194
-
16
N
D
TTL
MC74F194
N
D
MC74HC194
-
16
CMOS
16
N
16
N,J
D
16
N
D
14
N,J
D
--
16
P,L
D
16
N,J
D
16
N
D
TTL
SN54LS194A
TTL
MC74F195
TTL
SN54LS95B
CMOS
MC14035B
4-Bit Shift Register With 3-State Outputs
TTL
SN74LS395
4-Bit Shifter With 3-State
CMOS
MC74AC350
4-Bit Shift Register
SN74LS194A
SN74LS95B
-
CMOS
MC74ACT350
-
16
N
D
TTL
MC74F350
-
16
N
D
CMOS
MC74HC195
-
N
ECL
MC10H141
_.-
16
-
16
P,L
FN
ECL
MC10141
.-
16
P,L
FN
16
P,L
D
-
20
N
DW
N,J
~~~-
4-Bit Shifter, With 3-State Outputs
4-Bit Universal Shift Register
--
CMOS
MC14194B
8-Bit Bidirectional Universal Shift Register With parallel 1/0
CMOS
MC74HC299
B-Bit Parallel-to-Serial Shift Register
TTL
SN54LS165
SN74LS165
16
8-Bit Scannable Register
ECL
MC10E241
MC100E241
28
8-Bit Serial In-Serial Out Shift Register
TTL
MC74F164
14
N
D
8-Bit Serial or Paraliel-lnpuVSerial-Output Shift Register
CMOS
MC54HC165
MC74HC165
16
N,J
D
B-Bit Serial or Paraliel-lnpuVSerial-Output Shift Register With
3-State Outputs
CMOS
MC54HC589
MC74HC589
16
N,J
D
B-Bit Serial or Paraliel-lnpuVSerial-Output Shift Register With
Input Latch
CMOS
MC54HC597
MC74HC597
16
N,J
D
-
D
FN
B-Bit Serial-ln/Paraliel-Out Shift Register
TTL
SN54LS164
SN74LS164
14
N,J
D
B-Bit Serial-lnpuVParaliel-Output Shift Register
CMOS
MC54HC164
MC74HC164
14
N,J
D
8-Bit Serial-lnpuVSerial or Parallel-Output Shift Register With
Latched 3-State Outputs
CMOS
MC54HC595A
MC74HC595A
16
N,J
D,DT
E~L
MC10E141
MC100E141
2B
TTL
SN54LS166
SN74LS166
16
N,J
D
8-Bit Shift Registers With Sign Extend
TTL
SN54LS322A
SN74LS322A
20
N,J
DW
B-Bit Shift/Storage Register With 3-State Outputs
TTL
SN54LS299
SN74LS299
20
N,J
DW
TTL
SN54LS323
SN74LS323
20
N,J
DW
CMOS
MC14014B
16
P,L
D
CMOS
MC14021B
B-Input Shift/Storage Register WISynchronous Reset and Common
1/0 Pins
TTL
8-lnput Universal Shift/Storage Register With Common Parallel 1/0
Pins: With 3-State Outputs
B-Bit Shift Register
8-Bit Static Shift Register
B-Input Universal Shift/Storage Register With Syn ReseVCommon
Parallel 1/0 Pins: With 3-State Outputs
FN
16
P,L
D
MC74F323
-
20
N
DW
CMOS
MC74AC299
-
20
N
DW
CMOS
MC74ACT299
-
20
N
DW
CMOS
MC74AC323
-
20
N
DW
CMOS
MC74ACT323
20
N
DW
8-lnput Universal Shift/Storage Register, W/Common Parallel 1/0
Pins
TTL
MC74F299
-
20
N
DW
B-Stage Shift/Store Register With 3-State Outputs
CMOS
MC14094B
16
P,L
9-Bit Shift Register, 700MHz, With Asynchronous Master Reset
ECL
MC10E142
Dual 5-Bit Shift Register
CMOS
MC14015B
Dual 64-Bit Static Shift Register
CMOS
MC14517B
Motorola Master Selection Guide
3.1-37
MC100E142
-
2B
D
FN
16
P,L
D
16
P
DW
Logic: Standard, Special and Programmable
Selection by Function
I
Tech.
Description
Device(s)
Pins
I DIP I SM
SHIFT REGISTERS
Successive Approximation Register
-
CMOS
MC14549B
CMOS
MC14559B
TTL
SN54lS195A
1.1 GHz Serial Input Synthesizer With +64/65, + 128/129 Prescaler
ECl
MC12202
-
16,20
D,M,
DT
2.0GHz Serial Input Synthesizer With +64/65, +1281129 Prescaler
ECl
MC12206
D,DT
ECl
MC12210
16,20
D,DT
2.7GHz Frequency Synthesizer
ECl
MC12179
-
16,20
2.5GHz Serial Input Synthesizer With +32133, +64/65 Prescaler
8
D
4-Bit Differential ECl BusITTl Bus Transceiver
ECl
MC10H680
ECLlTTl Inverting Bidirectional Transceivers With latch (4-Bit)
ECl
MC10804
Universal 4-Bit Shift Register
SN74lS195A
16
P,l
DW
16
P,l
DW
16
N,J
D
SYNTHESIZERS
TRANSCEIVERS
ECLlTTl Inverting Bidirectional Transceivers With latch (5-Bit)
ECl
MC10805
Hex ECLlTTl Transceiver With latches
ECl
MC10H681
low-Voltage CMOS Octal Transceiver, 3-State, Non-Inverting
With 5V Tolerant Inputs and Outputs
CMOS
MC74lCX245
low-Voltage Quiet CMOS Octal Transceiver, 3-State,
Non-Inverting
CMOS
low-Voltage Quiet CMOS Octal Transceiver/Registered
Transceiver
MC100H680
MC100H681
28
FN
16
l
20
l
28
FN
-
20
M,DW,
DT
MC74lVQ245
-
20
M,DW,
SD,DT
CMOS
MC74LVQ646
-
24
DW,
SD,DT
low-Voltage Quiet CMOS Octal Transceiver/Registered
Transceiver
CMOS
MC74lVQ652
-
24
DW,
SD,DT
Octal Bus Transceiver/Inverting With Open Collector
TTL
SN54lS642
SN74lS642
20
N,J
DW
Octal Bus Transceiver/Non-Inverting With Open Collector
TTL
SN54lS641
SN74lS641
20
N,J
DW
Quad Futurebus Backplane Transceiver, With 3-State Outputs and
Open Collector
TTL
MC74F3893A
-
20
FN
TRANSLATORS
9-Bit ECLlTTl Translator
ECl
MC10H601
MC100H601
28
FN
9-Bit latch ECLlTTl Translator
ECl
MC10H603
MC100H603
28
FN
9-Bit Latch TTUECl Translator
ECl
MC10H602
MC100H602
28
FN
9-Bit TTUECl Translator
ECl
MC10H600
MC100H600
28
FN
Differential ECLlTTl Translator
ECl
MC10ElT25
MC100ElT25
8
D
Differential PECLlTTl Translator
ECl
MC10ElT21
MC100ElT21
8
D
Dual Differential PECLlTTl Translator
ECl
MC100ElT23
Dual TTUDifferential PECl Translator
ECl
MC10ElT22
ECLlTTl Translator (Single P.S. @+ 5.0V)
ECl
MC10H350
Hex ECUMST Translator
ECl
MC10191
MC100ElT22
Hex TTL OR CMOS/CMOS Hex level Shifter
CMOS
MC14504B
Quad CMOS/ECl Translator (Single P.S. @+ 5.0V)
ECl
MC10H352
Quad MECLlTTl Translator
ECl
MC10H125
ECl
MC10125
-
Quad MST/ECl Translator
ECl
MC10190
Quad TTUECl Translator (ECl Strobe)
ECl
MC10H424
Quad TTUMECl Translator
ECl
Quad TTUMECl Translator, With TTL Strobe Input
8
D
8
D
16
P,l
16
P,l
FN
16
P,l
D
20
P,l
FN
16
P,l
FN
16
P,l
FN
-
16
P
-
16
P,l
FN
MC10124
16
P,l
FN
ECl
MC10H124
-
16
P,l
FN
Quad TTUNM08-to-PECL Translator (Single P.S. @+ 5.0V)
ECl
MC10H351
-
20
P,L
FN
Registered Hex ECLlTTl Translator
ECl
MC10H605
MC100H605
28
FN
Registered Hex PECLlTTl Translator
ECl
MC10H607
MC100H607
28
FN
Registered Hex TTUECl Translator
ECl
MC10H604
MC100H604
28
FN
logic: Standard, Special and Programmable
3.1-38
Motorola Master Selection Guide
Selection by Function
Device(s)
Description
TRANSLATORS
Registered Hex TIUPECl Translator
ECl
MC10H606
Triple MECUNMOS Translator
ECl
MC10177
Triple ECl to PECl Translator
ECl
MC100lVEl90
Triple PECl to lVPECl Translator
ECl
MC100lVEl92
TTUDifferential ECl Translator
ECl
MC10ElT24
TIUDifferential PECl Translator
ECl
TIL to Differential PECUDifferential PECl to TIL Translator
MC100H606
MC100El90
28
16
FN
l
20
DW
20
DW
MC100ElT24
8
D
MC10ElT20
MC100ElT20
8
D
ECl
MC10ElT28
MC100ElT28
8
D
Phase-locked-loop With VCO
CMOS
MC74HC4046A
low Power Voltage Controlled Oscillator Buffer
CMOS
MC12147
low Power Voltage Controlled Oscillator Buffer
CMOS
MC12149
-
veo
Motorola Master Selection Guide
3,1-39
-
16
N
D
8
D,SD
8
D,SD
logic: Standard, Special and Programmable
Device Index
MC100E016
3.1-19
MC100EL12
3.1-29
MC100LVEL14
3.1-17
MC100E101
3.1-27
MC100EL13
3.1-14
MC100LVEL17
3.1-35
MC100E104
3.1-27
MC100EL14
3.1-17
MC100LVEL29
3.1-23
MC100E107
3.1-27
MC100EL15
3.1-17
MC100LVEL30
3.1-25
MC100E111
3.1-17
MC100EL16
3.1-35
MC100LVEL38
3.1-18
MC100E112
3.1-30
MC100EL17
3.1-35
MC100LVEL39
3.1-18
MC100E116
3.1-36
MC100EL29
3.1-23
MC100LVEL56
3.1-32
MC100E122
3.1-29
MC100EL30
3.1-25
MC100LVEL59
3.1-33
MC100E131
3.1-23
MC100EL31
3.1-23
MC100LVEL90
3.1-39
MC100E136
3.1-19
MC100EL32
3.1-22
MC100LVEL92
3.1-39
MC100E137
3.1-19
MC100EL33
3.1-22
MC100SX1230
3.1-22
MC100E141
3.1-37
MC100EL34
3.1-18
MC10100
3.1-28
MC100E142
3.1-37
MC100EL35
3.1-24
MC10101
3.1-27
MC100E143
3.1-23
MC100EL38
3.1-18
MC10102
3.1-28
MC100E150
3.1--30
MC100EL39
3.1-18
MC10103
3.1-29
MC100E151
3.1-23
MC100EL51
3.1-23
MC10104
3.1-26
MC100E154
3.1-30
MC100EL52
3.1-23
MC10105
3.1-27
MC100E155
3.1-30
MC100EL56
3.1-32
MC10106
3.1-28
MC100E156
3.1-30
MC100EL57
3.1-31
MC10107
3.1-27
MC100E157
3.1-33
MC100EL58
3.1--31
MC10109
3.1-27
MC100E158
3.1-31
MC100EL59
3.1-33
MC10110
3.1-28
MC100E160
3.1-34
MC100EL90
3.1--39
MC10111
3.1-28
MC100E163
3.1-31
MC100ELT20
3.1-39
MC10113
3.1-28
MC100E164
3.1-31
MC100ELT21
3.1-38
MC10114
3.1-36
MC100E166
3.1-18
MC100ELT22
3.1-38
MC10115
3.1--36
MC100E167
3.1-23
MC100ELT23
3.1-38
MC10116
3.1-36
MC100E171
3.1-31
MC100ELT24
3.1--39
MC10117
3.1-27
MC100E175
3.1-30
MC100ELT25
3.1-38
MC10118
3.1-27
MC100E193
3.1-34
MC100ELT28
3.1-39
MC10119
3.1-27
MC100E195
3.1-35
MC100H600
3.1-38
MC10121
3.1-27
MC100E196
3.1-35
MC100H601
3.1-38
MC10123
3.1-17
MC100E210
3.1-14
MC100H602
3.1-38
MC10124
3.1-38
MC100E211
3.1-17
MC100H603
3.1-38
MC10125
3.1-38
MC100E212
3.1-36
MC100H604
3.1-38
MC10128
3.1-15
MC100E241
3.1-37
MC100H605
3.1-38
MC10129
3.1-35
MC100E256
3.1-30
MC100H606
3.1-39
MC10130
3.1-30
MC100E310
3.1-14
MC100H607
3.1-38
MC10131
3.1-24
MC100E336
3.1-14
MC100H640
3.1-17
MC10132
3.1-32
MC100E337
3.1-15
MC100H641
3.1-18
MC10133
3.1-31
MC100E404
3.1-27
MC100H642
3.1-17
MC10134
3.1-32
MC100E416
3.1-36
MC100H643
3.1-18
MC10135
3.1-23
MC100E431
3.1-23
MC100H644
3.1-17
MC10136
3.1-21
MC100E445
3.1-19
MC100H646
3.1-18
MC10137
3.1-20
MC100E446
3.1-19
MC100H660
3.1-31
MC10138
3.1-19
MC100E451
3.1-23
MC100H680
3.1-38
MC10141
3.1-37
MC100E452
3.1-23
MC100H681
3.1-38
MC10153
3.1-31
MC100E457
3.1-33
MC100LVE111
3.1-17
MC10154
3.1-19
MC100EL01
3.1-27
MC100LVE164
3.1--32
MC10158
3.1-32
MC100EL04
3.1-27
MC100LVE210
3.1-14
MC10159
3.1--32
MC100EL05
3.1-27
MC100LVE310
3.1-14
MC10160
3.1-34
MC100EL07
3.1-27
MC100LVEL11
3.1-14
MC10161
3.1-21
MC100EL11
3.1-17
MC100LVEL13
3.1-14
MC10162
3.1-21
Logic: Standard, Special and Programmable
3.1-40
Motorola Master Selection Guide
Device Index
MC10163
3.1-22
MC10E157
3.1-33
MC10ELT25
3.1-38
MC10164
3.1-32
MC10E158
3.1-31
MC10ELT28
3.1-39
MC10165
3.1-22
MC10E160
3.1-34
MC10Hl00
3.1-28
MC10166
3.1-18
MC10E163
3.1-31
MC10Hl0l
3.1-27
MC10168
3.1-31
MC10E164
3.1-31
MC10Hl02
3.1-28
MC10170
3.1-34
MC10E1651
3.1-18
MC10Hl03
3.1-29
MC10171
3.1-21
MC10E1652
3.1-18
MC10Hl04
3.1-26
MC10172
3.1-21
MC10E166
3.1-18
MC10Hl05
3.1-27
MC10173
3.1-33
MC10E167
3.1-23
MC10Hl06
3.1-28
MC10174
3.1-32
MC10E171
3.1-31
MC10Hl07
3.1-27
MC10175
3.1-31
MC10E175
3.1-30
MC10H109
3.1-27
MC10176
3.1-24
MC10E193
3.1-34
MC10H113
3.1-28
MC10177
3.1-39
MC10E195
3.1-35
MC10Hl15
3.1-36
MC10178
3.1-19
MC10E196
3.1-35
MC10H116
3.1-36
MC10180
3.1-14
MC10E197
3.1-31
MC10H117
3.1-27
MC10181
3.1-14
MC10E211
3.1-17
MC10Hl18
3.1-27
MC10186
3.1-24
MC10E212
3.1-36
MC10Hl19
3.1-27
MC10188
3.1-29
MC10E241
3.1-37
MC10H121
3.1-27
MC10189
3.1-29
MC10E256
3.1-30
MC10H123
3.1-17
MC10190
3.1-38
MC10E336
3.1-14
MC10H124
3.1-38
MC10191
3.1-38
MC10E337
3.1-15
MC10H125
3.1-38
MC10192
3.1-17
MC10E404
3.1-27
MC10H130
3.1-30
MC10193
3.1-22
MC10E411
3.1-17
MC10H131
3.1-24
MC10195
3.1-29
MC10E416
3.1-36
MC10H135
3.1-23
MC10197
3.1-25
MC10E431
3.1-23
MC10H136
3.1-21
MC10198
3.1-33
MC10E445
3.1-19
MC10H141
3.1-37
MC10210
3.1-28
MC10E446
3.1-19
MC10H145
3.1-36
MC10211
3.1-28
MC10E451
3.1-23
MC10H158
3.1-33
MC10212
3.1-27
MC10E452
3.1-23
MC10H159
3.1-33
MC10216
3.1-35
MC10E457
3.1-33
MC10H16
3.1-19
MC10231
3.1-24
MC10ELOl
3.1-27
MC10H160
3.1-34
MC10804
3.1-38
MC10EL04
3.1-27
MC10H161
3.1-21
MC10805
3.1-38
MC10EL05
3.1-27
MC10H162
3.1-21
MC10E016
3.1-19
MC10EL07
3.1-27
MC10H164
3.1-32
MC10El0l
3.1-27
MC10EL11
3.1-17
MC10H165
3.1-22
MC10El04
3.1-27
MC10EL12
3.1-29
MC10H166
3.1-18
MC10El07
3.1-27
MC10EL15
3.1-17
MC10H171
3.1-21
MC10E111
3.1-17
MC10EL16
3.1-35
MC10H172
3.1-21
MC10El12
3.1-30
MC10EL31
3.1-23
MC10H173
3.1-32
MC10El16
3.1-36
MC10EL32
3.1-22
MC10H174
3.1-32
MC10E122
3.1-29
MC10EL33
3.1-22
MC10H175
3.1-31
MC10E131
3.1-23
MC10EL34
3.1-18
MC10H176
3.1-24
MC10E136
3.1-19
MC10EL35
3.1-24
MC10H179
3.1-14
MC10E137
3.1-19
MC10EL51
3.1-23
MC10H180
3.1-14
MC10E141
3.1-37
MC10EL52
3.1-23
MC10H181
3.1-14
MC10E142
3.1-37
MC10EL57
3.1-31
MC10H186
3.1-24
MC10E143
3.1-23
MC10EL58
3.1-31
MC10H188
3.1-29
MC10E150
3.1-30
MC10EL89
3.1-22
MC10H189
3.1-29
MC10E151
3.1-23
MC10ELT20
3.1-39
MC10H209
3.1-27
MC10E154
3.1-30
MC10ELT21
3.1-38
MC10H210
3.1-28
MC10E155
3.1-30
MC10ELT22
3.1-38
MC10H211
3.1-28
MC10E156
3.1-30
MC10ELT24
3.1-39
MC10H330
3.1-17
Motorola Master Selection Guide
3.1-41
Logic: Standard, Special and Programmable
Device Index
MC10H332
3.1-15
MC12028A
3.1-34
MC14012B
3.1-25
MC10H334
3.1-17
MC12028B
3.1-34
MC14012UB
3.1-25
MC10H350
3.1-38
MC12031A
3.1-35
MC14013B
3.1-23
MC10H351
3.1-38
MC12031B
3.1-35
MC14014B
3.1-37
MC10H352
3.1-38
MC12032A
3.1-35
MC14015B
3.1-37
MC10H423
3.1-17
MC12032B
3.1-35
MC14016B
3.1-33
MC10H424
3.1-38
MC12033A
3.1-35
MC14017B
3.1-20
MC10H600
3.1-38
MC12033B
3.1-35
MC14018B
3.1-20
MC10H601
3.1-38
MC12034A
3.1-35
MC14020B
3.1-19
MC10H602
3.1-38
MC12034B
3.1-35
MC14021B
3.1-37
MC10H603
3.1-38
MC12036A
3.1-34
MC14022B
3.1-20
MC10H604
3.1-38
MC12036B
3.1-34
MC14023B
3.1-26
MC10H605
3.1-38
MC12038A
3.1-34
MC14023UB
3.1-26
MC10H606
3.1-39
MC12040
3.1-22
MC14024B
3.1-19
MC10H607
3.1-38
MC12052A
3.1-35
MC14025B
3.1-28
MC10H640
3.1-17
MC12053A
3.1-35
MC14025UB
3.1-28
MC10H641
3.1-18
MC12054A
3.1-35
MC14027B
3.1-23
MC10H642
3.1-17
MC12058
3.1-34
MC14028B
3.1-21
MC10H643
3.1-18
MC12061
3.1-34
MC14029B
3.1-20
MC10H644
3.1-17
MC12073
3.1-34
MC14035B
3.1-37
MC10H645
3.1-17
MC12074
3.1-34
MC14038B
3.1-14
MC10H646
3.1-18
MC12075
3.1-35
MC14040B
3.1-19
MC10H660
3.1-31
MC12076
3.1-35
MC14042B
3.1-31
MC10H680
3.1-38
MC12078
3.1-35
MC14043B
3.1-31
MC10H681
3.1-38
MC12079
3.1-35
MC14044B
3.1-31
MC10SX1130
3.1-18
MC12080
3.1-34
MC14046B
3.1-34
MClOSX1130
3.1-22
MC12083
3.1-34
MC14049B
3.1-29
MC10SX1189
3.1-18
MC12089
3.1-35
MC14049UB
3.1-29
MC12002
3.1-21
MC12090
3.1-35
MC14050B
3.1-29
MC12009
3.1-35
MC12093
3.1-34
MC14051B
3.1-31
MC12011
3.1-35
MC12095
3.1-35
MC14052B
3.1-32
MC12013
3.1-35
MC12100
3.1-33
MC14053B
3.1-33
MC12014
3.1-20
MC12101
3.1-33
MC14060B
3.1-19
MC12015
3.1-35
MC12147
3.1-39
MC14066B
3.1-33
MC12016
3.1-35
MC12148
3.1-34
MC14067B
3.1-31
MC12017
3.1-35
MC12149
3.1-39
MC14068B
3.1-25
MC12018
3.1-35
MC12179
3.1-38
MC14069UB
3.1-29
MC12019
3.1-35
MC12202
3.1-38
MC14070B
3.1-28
MC12022A
3.1-34
MC12206
3.1-38
MC14071B
3.1-29
MC12022B
3.1-34
MC12210
3.1-38
MC14072B
3.1-28
MC12022LVA
3.1-34
MC12429
3.1-18
MC14073B
3.1-26
MC12022LVB
3.1-34
MC12439
3.1-18
MC14075B
3.1-29
MC12022SLA
3.1-34
MC14000UB
3.1-28
MC14076B
3.1-25
MC12022SLB
3.1-34
MC14001B
3.1-28
MC14077B
3.1-27
MC12022TSA
3.1-34
MC14001UB
3.1-28
MC14078B
3.1-28
MC12022TSB
3.1-34
MC14002B
3.1-28
MC14081B
3.1-26
MC12022TVA
3.1-35
MC14002UB
3.1-28
MC14082B
3.1-25
MC12022TVB
3.1-35
MC14006B
3.1-36
MC14093B
3.1-36
MC12023
3.1-35
MC14007UB
3.1-29
MC14094B
3.1-37
MC12025
3.1-35
MC14008B
3.1-14
MC14099B
3.1-30
MC12026A
3.1-34
MC14011B
3.1-26
MC14106B
3.1-36
MC12026B
3.1-34
MC14011UB
3.1-26
MC14161B
3.1-19
Logic: Standard, Special and Programmable
3.1-42
Motorola Master Selection Guide
Device Index
MC14163B
3.1-19
MC14566B
3.1-20
MC54HC27
3.1-28
MC14174B
3.1-24
MC14568B
3.1-20
MC54HC273A
3.1-24
MC14175B
3.1-25
MC14569B
3.1-20
MC54HC32A
3.1-29
MC14194B
3.1-37
MC14572UB
3.1-27
MC54HC354
3.1-32
MC14415
3.1-34
MC14580B
3.1-36
MC54HC365
3.1-15
MC14490
3.1-14
MC14583B
3.1-36
MC54HC366
3.1-15
MC14500B
3.1-29
MC14584B
3.1-36
MC54HC367
3.1-15
MC14501UB
3.1-27
MC14585B
3.1-18
MC54HC373A
3.1-31
MC14502B
3.1-30
MC14598B
3.1-30
MC54HC374A
3.1-25
MC14503B
3.1-15
MC14599B
3.1-30
MC54HC390
3.1-20
MC14504B
3.1-38
MC1648
3.1-34
MC54HC393
3.1-20
MC14506UB
3.1-27
MC1650
3.1-19
MC54HC4016
3.1-33
MC14508B
3.1-30
MC1651
3.1-19
MC54HC4040A
3.1-19
MC14510B
3.1-20
MC1658
3.1-34
MC54HC4049
3.1-29
MC14511B
3.1-22
MC1660
3.1-27
MC54HC4050
3.1-29
MC14512B
3.1-31
MC1662
3.1-28
MC54HC4051
3.1-31
MC14513B
3.1-22
MC1670
3.1-24
MC54HC4053
3.1-33
MC14514B
3.1-21
MC1672
3.1-28
MC54HC4060
3.1-19
MC14515B
3.1-21
MC1692
3.1-36
MC54HC4060A
3.1-19
MC14516B
3.1-20
MC4016
3.1-20
MC54HC4066
3.1-33
MC14517B
3.1-37
MC4018
3.1-20
MC54HC4351
3.1-31
MC14518B
3.1-20
MC4024
3.1-33
MC54HC4353
3.1-33
MC14519B
3.1-27
MC4044
3.1-21
MC54HC4538A
3.1-33
MC14520B
3.1-20
MC4316
3.1-20
MC54HC533A
3.1-31
MC14521B
3.1-34
MC4324
3.1-34
MC54HC534A
3.1-24
3.1-16
MC14522B
3.1-20
MC4344
3.1-21
MC54HC540A
MC14526B
3.1-20
MC54HCOOA
3.1-26
MC54HC541A
3.1-16
MC14527B
3.1-14
MC54HC02A
3.1-28
MC54HC563
3.1-31
3.1-31
MC14528B
3.1-33
MC54HC04A
3.1-29
MC54HC573A
MC14529B
3.1-32
MC54HC08A
3.1-26
MC54HC574A
3.1-25
MC14530B
3.1-27
MC54HC132A
3.1-36
MC54HC589
3.1-37
MC14531B
3.1-34
MC54HC138A
3.1-21
MC54HC595A
3.1-37
MC14532B
3.1-22
MC54HC139A
3.1-21
MC54HC597
3.1-37
MC14534B
3.1-19
MC54HC14A
3.1-36
MC54HC640A
3.1-16
MC14536B
3.1-34
MC54HC154
3.1-21
MC54HC646
3.1-16
MC14538B
3.1-33
MC54HC157A
3.1-32
MC54HC688
3.1-18
MC14539B
3.1-32
MC54HC158
3.1-32
MC54HC74A
3.1-23
MC14541B
3.1-34
MC54HC160
3.1-20
MC54HC86
3.1-28
MC14543B
3.1-22
MC54HC161A
3.1-20
MC54HCTOOA
3.1-26
MC14544B
3.1-22
MC54HC162
3.1-20
MC54HCT08A
3.1-26
MC14547B
3.1-22
MC54HC163A
3.1-20
MC54HCT14A
3.1-36
MC14549B
3.1-38
MC54HCl64
3.1-37
MC54HCT161A
3.1-20
MC14551B
3.1-32
MC54HC165
3.1-37
MC54HCT163A
3.1-20
MC14553B
3.1-19
MC54HC174A
3.1-24
MC54HCT241A
3.1-16
MC14555B
3.1-21
MC54HC175
3.1-25
MC54HCT244A
3.1-16
MC14556B
3.1-21
MC54HC175A
3.1-25
MC54HCT245A
3.1-15
MC14557B
3.1-36
MC54HC240A
3.1-16
MC54HCT32A
3.1-29
MC14558B
3.1-22
MC54HC241A
3.1-16
MC54HCT373A
3.1-30
MC14559B
3.1-38
MC54HC244A
3.1-16
MC54HCT374A
3.1-24
MC14560B
3.1-14
MC54HC245A
3.1-16
MC54HCT574A
3.1-25
MC14561B
3.1-14
MC54HC251
3.1-31
MC660
3.1-22
MC14562B
3.1-36
MC54HC259
3.1-21
MC661
3.1-22
Motorola Master Selection Guide
3.1-43
Logic: Standard, Special and Programmable
Device Index
MC662
3.1-22
MC74AC259
3.1-30
MC74ACT160
3.1-20
MC663
3.1-23
MC74AC273
3.1-24
MC74ACT161
3.1-20
MC664
3.1-24
MC74AC299
3.1-37
MC74ACT162
3.1-20
MC667
3.1-33
MC74AC32
3.1-29
MC74ACT163
3.1-20
MC668
3.1-30
MC74AC323
3.1-37
MC74ACT174
3.1-24
MC669
3.1-22
MC74AC350
3.1-37
MC74ACT175
3.1-25
MC670
3.1-30
MC74AC352
3.1-32
MC74ACT194
3.1-37
MC671
3.1-30
MC74AC353
3.1-32
MC74ACT20
3.1-25
MC672
3.1-30
MC74AC373
3.1-31
MC74ACT240
3.1-16
MC677
3.1-29
MC74AC374
3.1-24
MC74ACT241
3.1-16
MC678
3.1-29
MC74AC377
3.1-24
MC74ACT244
3.1-16
MC68150'33
3.1-15
MC74AC378
3.1-23
MC74ACT245
3.1-15
MC68150'40
3.1-15
MC74AC4020
3.1-19
MC74ACT251
3.1-32
MC68194
3.1-17
MC74AC4040
3.1-19
MC74ACT253
3.1-32
MC74ACOO
3.1-26
MC74AC533
3.1-31
MC74ACT256
3.1-30
MC74AC02
3.1-28
MC74AC534
3.1-25
MC74ACT257
3.1-33
MC74AC04
3.1-29
MC74AC540
3.1-16
MC74ACT258
3.1-33
MC74AC05
3.1-29
MC74AC541
3.1-16
MC74ACT259
3.1-30
MC74AC08
3.1-26
MC74AC563
3.1-30
MC74ACT273
3.1-24
MC74AC10
3.1-26
MC74AC564
3.1-25
MC74ACT299
3.1-37
MC74AC109
3.1-24
MC74AC573
3.1-30
MC74ACT32
3.1-29
MC74AC11
3.1-26
MC74AC574
3.1-25
MC74ACT323
3.1-37
MC74AC112
3.1-23
MC74AC620
3.1-15
MC74ACT350
3.1-37
MC74AC113
3.1-23
MC74AC623
3.1-15
MC74ACT352
3.1-32
MC74AC125
3.1-17
MC74AC640
3.1-15
MC74ACT353
3.1-32
MC74AC126
3.1-17
MC74AC643
3.1-15
MC74ACT373
3.1-31
MC74AC132
3.1-36
MC74AC646
3.1-16
MC74ACT374
3.1-25
MC74AC138
3.1-21
MC74AC648
3.1-16
MC74ACT377
3.1-24
MC74AC139
3.1-21
MC74AC652
3.1-16
MC74ACT378
3.1-23
MC74AC14
3.1-36
MC74AC74
3.1-23
MC74ACT521
3.1-18
MC74AC151
3.1-31
MC74AC810
3.1-27
MC74ACT533
3.1-31
MC74AC153
3.1-32
MC74AC86
3.1-27
MC74ACT534
3.1-25
MC74AC157
3.1-33
MC74ACTOO
3.1-26
MC74ACT540
3.1-16
MC74AC158
3.1-33
MC74ACT02
3.1-28
MC74ACT541
3.1-16
MC74AC160
3.1-20
MC74ACT04
3.1-29
MC74ACT563
3.1-30
MC74AC161
3.1-20
MC74ACT05
3.1-29
MC74ACT564
3.1-25
MC74AC162
3.1-20
MC74ACT08
3.1-26
MC74ACT573
3.1-31
MC74AC163
3.1-20
MC74ACT10
3.1-26
MC74ACT574
3.1-25
MC74AC174
3.1-24
MC74ACT109
3.1-24
MC74ACT620
3.1-15
MC74AC175
3.1-25
MC74ACT11
3.1-26
MC74ACT623
3.1-15
MC74AC190
3.1-21
MC74ACT112
3.1-23
MC74ACT640
3.1-15
MC74AC194
3.1-37
MC74ACT113
3.1-23
MC74ACT643
3.1-15
MC74AC20
3.1-25
MC74ACT125
3.1-17
MC74ACT646
3.1-16
MC74AC240
3.1-16
MC74ACT126
3.1-17
MC74ACT648
3.1-16
MC74AC241
3.1-16
MC74ACT132
3.1-36
MC74ACT652
3.1-16
MC74AC244
3.1-16
MC74ACT138
3.1-21
MC74ACT74
3.1-23
MC74AC245
3.1-15
MC74ACT139
3.1-21
MC74ACT810
3.1-27
MC74AC251
3.1-32
MC74ACT14
3.1-36
MC74ACT86
3.1-28
MC74AC253
3.1-32
MC74ACT151
3.1-31
MC74FOO
3.1-26
MC74AC256
3.1-30
MC74ACT153
3.1-32
MC74F02
3.1-28
MC74AC257
3.1-33
MC74ACT157
3.1-33
MC74F04
3.1-29
MC74AC258
3.1-33
MC74ACT158
3.1-33
MC74F08
3.1-26
Logic: Standard, Special and Programmable
3.1-44
Motorola Master Selection Guide
Device Index
MC74F10
3.1-26
MC74F352
3.1-32
MC74HC10
3.1-26
MC74F109
3.1-24
MC74F353
3.1-32
MC74HC107
3.1-23
MC74F11
3.1-26
MC74F365
3.1-15
MC74HC109
3.1-24
MC74Fl12
3.1-24
MC74F366
3.1-15
MC74HC11
3.1-26
MC74F1245
3.1-15
MC74F367
3.1-15
MC74HCl12
3.1-23
MC74F125
3.1-17
MC74F368
3.1-15
MC74HC125A
3.1-17
MC74F126
3.1-17
MC74F37
3.1-26
MC74HC126A
3.1-17
MC74F13
3.1-36
MC74F373
3.1-31
MC74HC132A
3.1-36
MC74F132
3.1-36
MC74F374
3.1-24
MC74HC133
3.1-25
MC74F138
3.1-21
MC74F377
3.1-24
MC74HC137
3.1-21
MC74F139
3.1-21
MC74F378
3.1-36
MC74HC138A
3.1-21
MC74F14
3.1-36
MC74F379
3.1-25
MC74HC139A
3.1-21
MC74F148
3.1-22
MC74F38
3.1-26
MC74HC147
3.1-22
MC74F151
3.1-31
MC74F381
3.1-14
MC74HC14A
3.1-36
MC74F153
3.1-32
MC74F382
3.1-14
MC74HC151
3.1-31
MC74F157A
3.1-32
MC74F3893A
3.1-38
MC74HC153
3.1-32
MC74F158A
3.1-32
MC74F398
3.1-33
MC74HC154
3.1-21
MC74F160A
3.1-19
MC74F399
3.1-33
MC74HC157A
3.1-32
MC74F161A
3.1-19
MC74F40
3.1-25
MC74HC158
3.1-32
MC74F162A
3.1-19
MC74F51
3.1-27
MC74HC160
3.1-20
MC74F163A
3.1-19
MC74F521
3.1-18
MC74HC161A
3.1-20
MC74F164
3.1-37
MC74F533
3.1-31
MC74HC162
3.1-20
MC74F168
3.1-19
MC74F534
3.1-25
MC74HC163
3.1-20
MC74F169
3.1-19
MC74F537
3.1-21
MC74HCl64
3.1-37
MC74F174
3.1-24
MC74F538
3.1-21
MC74HC165
3.1-37
MC74F175
3.1-25
MC74F539
3.1-21
MC74HC173
3.1-25
MC74F1803
3.1-17
MC74F543
3.1-16
MC74HC174A
3.1-24
MC74F181
3.1-14
MC74F544
3.1-16
MC74HC175
3.1-25
MC74F182
3.1-14
MC74F568
3.1-19
MC74HC175A
3.1-25
MC74F194
3.1-37
MC74F569
3.1-19
MC74HC194
3.1-37
MC74F195
3.1-37
MC74F574
3.1-24
MC74HC195
3.1-37
MC74F20
3.1-25
MC74F579
3.1-19
MC74HC20
3.1-25
MC74F21
3.1-25
MC74F620
3.1-16
MC74HC237
3.1-21
MC74F240
3.1-15
MC74F623
3.1-16
MC74HC240A
3.1-16
MC74F241
3.1-15
MC74F64
3.1-27
MC74HC241A
3.1-16
MC74F242
3.1-17
MC74F640
3.1-16
MC74HC242
3.1-17
MC74F243
3.1-17
MC74F646
3.1-16
MC74HC244A
3.1-16
MC74F244
3.1-15
MC74F657A
3.1-15
MC74HC245A
3.1-16
MC74F245
3.1-15
MC74F657B
3.1-15
MC74HC251
3.1-31
MC74F251
3.1-31
MC74F74
3.1-23
MC74HC253
3.1-32
MC74F253
3.1-32
MC74F779
3.1-19
MC74HC257
3.1-32
MC74F256
3.1-30
MC74F803
3.1-17
MC74HC259
3.1-21
MC74F257A
3.1-33
MC74F823
3.1-15
MC74HC27
3.1-28
MC74F258A
3.1-33
MC74F827
3.1-14
MC74HC273A
3.1-24
MC74F259
3.1-30
MC74F828
3.1-14
MC74HC280
3.1-34
MC74F269
3.1-19
MC74F85
3.1-18
MC74HC299
3.1-37
MC74F280
3.1-34
MC74F86
3.1-28
MC74HC30
3.1-25
MC74F283
3.1-14
MC74HCOOA
3.1-26
MC74HC32A
3.1-29
MC74F299
3.1-37
MC74HC02A
3.1-28
MC74HC354
3.1-32
MC74F32
3.1-29
MC74HC03A
3.1-26
MC74HC365
3.1-15
MC74F323
3.1-37
MC74HC04A
3.1-29
MC74HC366
3.1-15
MC74F350
3.1-37
MC74HC08A
3.1-26
MC74HC367
3.1-15
Motorola Master Selection Guide
3.1-45
Logic: Standard, Special and Programmable
Device Index
MC74HC368
3.1-15
MC74HCTOOA
3.1-26
MC836
3.1-29
MC74HC373A
3.1-31
MC74HCT04A
3.1-29
MC837
3.1-29
MC74HC374A
3.1-25
MC74HCT08A
3.1-26
MC840
3.1-29
MC74HC390
3.1-20
MC74HCT138A
3.1-21
MC844
3.1-22
MC74HC393
3.1-20
MC74HCT14A
3.1-36
MC845
3.1-23
MC74HC4002
3.1-28
MC74HCT157A
3.1-32
MC846
3.1-26
MC74HC4016
3.1-33
MC74HCT161A
3.1-20
MC849
3.1-26
MC74HC4017
3.1-20
MC74HCT163A
3.1-20
MC88913
3.1-18
MC74HC4020A
3.1-19
MC74HCT174A
3.1-24
MC88914
3.1-18
MC74HC4024
3.1-34
MC74HCT240A
3.1-16
MC88915*55
3.1-18
MC74HC4040A
3.1-19
MC74HCT241A
3.1-16
MC88915*70
3.1-18
MC74HC4046A
3.1-39
MC74HCT244A
3.1-16
MC88915T*100
3.1-18
MC74HC4049
3.1-29
MC74HCT245A
3.1-15
MC88915T*133
3.1-18
MC74HC4050
3.1-29
MC74HCT273A
3.1-24
MC88915T*160
3.1-18
MC74HC4051
3.1-31
MC74HCT32A
3.1-29
MC88915T*55
3.1-18
MC74HC4052
3.1-32
MC74HCT373A
3.1-30
MC88915T*70
3.1-18
MC74HC4053
3.1-33
MC74HCT374A
3.1-24
MC88916*70
3.1-18
MC74HC4060
3.1-19
MC74HCT541A
3.1-16
MC88916*80
3.1-18
MC74HC4060A
3.1-19
MC74HCT573A
3.1-31
MC88920
3.1-17
MC74HC4066
3.1-33
MC74HCT574A
3.1-25
MC88921
3.1-17
MC74HC4075
3.1-29
MC74HCT74A
3.1-23
MC88LV926
3.1-18
MC74HC4078
3.1-27
MC74HCU04
3.1-29
MC88PL117
3.1-17
MC74HC42
3.1-21
MC74LCXOO
3.1-26
MC936
3.1-29
MC74HC4316
3.1-33
MC74LCX02
3.1-28
MC937
3.1-29
MC74HC4351
3.1-31
MC74LCX04
3.1-30
MC944
3.1-22
MC74HC4353
3.1-33
MC74LCX08
3.1-26
MC945
3.1-23
MC74HC4511
3.1-22
MC74LCX240
3.1-14
MC946
3.1-26
MC74HC4514
3.1-21
MC74LCX244
3.1-14
MC951
3.1-33
MC74HC4538A
3.1-33
MC74LCX245
3.1-38
MC952
3.1-23
MC74HC51
3.1-27
MC74LCX32
3.1-28
MC953
3.1-23
MC74HC533A
3.1-31
MC74LCX373
3.1-30
MCCS142233
3.1-36
MC74HC534A
3.1-24
MC74LCX374
3.1-24
MCCS142234
3.1-36
MC74HC540A
3.1-16
MC74LCX540
3.1-14
MCCS142235
3.1-36
MC74HC541A
3.1-16
MC74LCX541
3.1-14
MCCS142237
3.1-36
MC74HC563
3.1-31
MC74LCX573
3.1-30
MCH12140
3.1-22
MC74HC564
3.1-25
MC74LCX574
3.1-24
MCK12140
3.1-22
MC74HC573A
3.1-31
MC74LVQOO
3.1-26
MCM10139
3.1-35
MC74HC574A
3.1-25
MC74LVQ04
3.1-30
MCM10143
3.1-36
MC74HC58
3.1-27
MC74LVQ125
3.1-14
MCM10145
3.1-36
MC74HC589
3.1-37
MC74LVQ138
3.1-21
MCM10146
3.1-35
MC74HC595A
3.1-37
MC74LVQ240
3.1-14
MCM10149*25
3.1-35
MC74HC597
3.1-37
MC74LVQ244
3.1-14
MCM10152
3.1-35
MC74HC640A
3.1-16
MC74LVQ245
3.1-38
MPC903
3.1-17
MC74HC646
3.1-16
MC74LVQ373
3.1-30
MPC904
3.1-17
MC74HC688
3.1-18
MC74LVQ374
3.1-24
MPC930
3.1-18
MC74HC7266
3.1-27
MC74LVQ541
3.1-14
MPC931
3.1-18
MC74HC73
3.1-23
MC74LVQ573
3.1-30
MPC947
3.1-17
MC74HC74A
3.1-23
MC74LVQ574
3.1-24
MPC948
3.1-17
MC74HC75
3.1-30
MC74LVQ646
3.1-38
MPC950
3.1-18
MC74HC76
3.1-23
MC74LVQ652
3.1-38
MPC951
3.1-18
MC74HC85
3.1-18
MC830
3.1-25
MPC956
3.1-18
MC74HC86
3.1-28
MC832
3.1-14
MPC970
3.1-18
Logic: Standard, Special and Programmable
3.1-46
Motorola Master Selection Guide
Device Index
SN54LSOO
3,1-26
SN54LS191
3,1-20
SN54LS373
3,1-31
SN54LS01
3,1-26
SN54LS192
3,1-20
SN54LS374
3,1-25
SN54LS02
3,1-28
SN54LS193
3,1-20
SN54LS375
3,1-30
SN54LS03
3,1-26
SN54LS194A
3,1-37
SN54LS377
3,1-24
SN54LS04
3,1-29
SN54LS195A
3,1-38
SN54LS378
3,1-24
SN54LS05
3,1-29
SN54LS196
3,1-19
SN54LS379
3,1-23
SN54LS08
3,1-26
SN54LS197
3,1-19
SN54LS38
3,1-26
SN54LS09
3,1-26
SN54LS20
3,1-25
SN54LS386
3,1-28
SN54LS10
3,1-26
SN54LS21
3,1-25
SN54LS390
3,1-20
SN54LS107A
3,1-23
SN54LS22
3,1-25
SN54LS393
3,1-20
SN54LS109A
3,1-23
SN54LS221
3,1-33
SN54LS398
3,1-33
SN54LS11
3,1-26
SN54LS240
3,1-15
SN54LS399
3,1-33
SN54LSl12A
3,1-23
SN54LS241
3,1-15
SN54LS40
3,1-25
SN54LSl13A
3,1-23
SN54LS242
3,1-17
SN54LS42
3,1-21
SN54LSl14A
3,1-23
SN54LS243
3,1-17
SN54LS47
3,1-22
SN54LS12
3,1-26
SN54LS244
3,1-15
SN54LS48
3,1-22
SN54LS122
3,1-33
SN54LS245
3,1-16
SN54LS490
3,1-20
SN54LS123
3,1-33
SN54LS247
3,1-22
SN54LS51
3,1-27
SN54LS125A
3,1-16
SN54LS248
3,1-22
SN54LS54
3,1-27
SN54LS126A
3,1-17
SN54LS249
3,1-22
SN54LS540
3,1-16
SN54LS13
3,1-36
SN54LS251
3,1-31
SN54LS541
3,1-16
SN54LS132
3,1-36
SN54LS253
3,1-32
SN54LS55
3,1-27
SN54LS133
3,1-25
SN54LS256
3,1-30
SN54LS569A
3,1-19
SN54LS137
3,1-21
SN54LS2578
3,1-33
SN54LS623
3,1-16
SN54LS138
3,1-21
SN54LS2588
3,1-33
SN54LS640
3,1-16
SN54LS139
3,1-21
SN54LS259
3,1-30
SN54LS641
3,1-38
SN54LS14
3,1-36
SN54LS26
3,1-26
SN54LS642
3,1-38
SN54LS145
3,1-21
SN54LS260
3,1-28
SN54LS645
3,1-16
SN54LS147
3,1-22
SN54LS266
3,1-27
SN54LS669
3,1-20
SN54LS148
3,1-22
SN54LS27
3,1-28
SN54LS670
3,1-36
SN54LS15
3,1-26
SN54LS273
3,1-24
SN54LS682
3,1-18
SN54LS151
3,1-31
SN54LS279
3,1-31
SN54LS684
3,1-18
SN54LS153
3,1-32
SN54LS28
3,1-28
SN54LS688
3,1-18
SN54LS155
3,1-21
SN54LS280
3,1-34
SN54LS73A
3,1-24
SN54LS156
3,1-21
SN54LS283
3,1-14
SN54LS748
3,1-22
SN54LS157
3,1-32
SN54LS290
3,1-20
SN54LS74A
3,1-23
SN54LS158
3,1-32
SN54LS293
3,1-19
SN54LS75
3,1-30
SN54LS160A
3,1-19
SN54LS298
3,1-33
SN54LS76A
3,1-23
SN54LS161A
3,1-19
SN54LS299
3,1-37
SN54LS77
3,1-30
SN54LS162A
3,1-19
SN54LS30
3,1-25
SN54LS795
3,1-15
SN54LS163A
3,1-19
SN54LS32
3,1-29
SN54LS796
3,1-15
SN54LS164
3,1-37
SN54LS322A
3,1-37
SN54LS797
3,1-15
SN54LS165
3,1-37
SN54LS323
3,1-37
SN54LS798
3,1-15
SN54LS166
3,1-37
SN54LS33
3,1-28
SN54LS83A
3,1-14
SN54LS168
3,1-19
SN54LS348
3,1-22
SN54LS848
3,1-22
SN54LS169
3,1-20
SN54LS352
3,1-32
SN54LS85
3,1-18
SN54LS170
3,1-36
SN54LS353
3,1-32
SN54LS86
3,1-28
SN54LS173A
3,1-23
SN54LS365A
3,1-15
SN54LS90
3,1-20
SN54LS174
3,1-24
SN54LS366A
3,1-15
SN54LS92
3,1-20
SN54LS175
3,1-25
SN54LS367A
3,1-15
SN54LS93
3,1-19
SN54LS181
3,1-14
SN54LS368A
3,1-15
SN54LS958
3,1-37
SN54LS190
3,1-20
SN54LS37
3,1-26
SN74LSOO
3,1-26
Motorola Master Selection Guide
3,1-47
Logic: Standard, Special and Programmable
Device Index
SN74LS01
3.1-26
SN74LS191
3.1-20
SN74LS374
3.1-25
SN74LS02
3.1-28
SN74LS192
3.1-20
SN74LS375
3.1-30
SN74LS03
3.1-26
SN74LS193
3.1-20
SN74LS377
3.1-24
SN74LS04
3.1-29
SN74LS194A
3.1-37
SN74LS378
3.1-24
SN74LS05
3.1-29
SN74LS195A
3.1-38
SN74LS379
3.1-23
SN74LS08
3.1-26
SN74LS196
3.1-19
SN74LS38
3.1-26
SN74LS09
3.1-26
SN74LS197
3.1-19
SN74LS386
3.1-28
SN74LS10
3.1-26
SN74LS20
3.1-25
SN74LS390
3.1-20
SN74LS107A
3.1-23
SN74LS21
3.1-25
SN74LS393
3.1-20
SN74LS109A
3.1-23
SN74LS22
3.1-25
SN74LS395
3.1-37
SN74LS11
3.1-26
SN74LS221
3.1-33
SN74LS398
3.1-33
SN74LS112A
3.1-23
SN74LS240
3.1-15
SN74LS399
3.1-33
SN74LS113A
3.1-23
SN74LS241
3.1-15
SN74LS40
3.1-25
SN74LS114A
3.1-23
SN74LS242
3.1-17
SN74LS42
3.1-21
SN74LS12
3.1-26
SN74LS243
3.1-17
SN74LS47
3.1-22
SN74LS122
3.1-33
SN74LS244
3.1-15
SN74LS48
3.1-22
SN74LS123
3.1-33
SN74LS245
3.1-16
SN74LS490
3.1-20
SN74LS125A
3.1-16
SN74LS247
3.1-22
SN74LS51
3.1-27
SN74LS126A
3.1-17
SN74LS248
3.1-22
SN74LS54
3.1-27
SN74LS13
3.1-36
SN74LS249
3.1-22
SN74LS540
3.1-16
SN74LS132
3.1-36
SN74LS251
3.1-31
SN74LS541
3.1-16
SN74LS133
3.1-25
SN74LS253
3.1-32
SN74LS55
3.1-27
SN74LS136
3.1-28
SN74LS257B
3.1-33
SN74LS569A
3.1-19
SN74LS137
3.1-21
SN74LS258B
3.1-33
SN74LS623
3.1-16
SN74LS138
3.1-21
SN74LS259
3.1-30
SN74LS640
3.1-16
SN74LS139
3.1-21
SN74LS26
3.1-26
SN74LS641
3.1-38
SN74LS14
3.1-36
SN74LS260
3.1-28
SN74LS642
3.1-38
SN74LS145
3.1-21
SN74LS266
3.1-27
SN74LS645
3.1-16
SN74LS147
3.1-22
SN74LS27
3.1-28
SN74LS669
3.1-20
SN74LS148
3.1-22
SN74LS273
3.1-24
SN74LS670
3.1-36
SN74LS15
3.1-26
SN74LS279
3.1-31
SN74LS682
3.1-18
SN74LS151
3.1-31
SN74LS28
3.1-28
SN74LS684
3.1-18
SN74LS153
3.1-32
SN74LS280
3.1-34
SN74LS688
3.1-18
SN74LS155
3.1-21
SN74LS283
3.1-14
SN74LS73A
3.1-24
SN74LS156
3.1-21
SN74LS290
3.1-20
SN74LS748
3.1-22
SN74LS157
3.1-32
SN74LS293
3.1-19
SN74LS74A
3.1-23
SN74LS158
3.1-32
SN74LS298
3.1-33
SN74LS75
3.1-30
SN74LS160A
3.1-19
SN74LS299
3.1-37
SN74LS76A
3.1-23
SN74LS161A
3.1-19
SN74LS30
3.1-25
SN74LS77
3.1-30
SN74LS162A
3.1-19
SN74LS32
3.1-29
SN74LS795
3.1-15
SN74LS163A
3.1-19
SN74LS322A
3.1-37
SN74LS796
3.1-15
SN74LS164
3.1-37
SN74LS323
3.1-37
SN74LS797
3.1-15
SN74LS165
3.1-37
SN74LS33
3.1-28
SN74LS798
3.1-15
SN74LS166
3.1-37
SN74LS348
3.1-22
SN74LS83A
3.1-14
SN74LS168
3.1-19
SN74LS352
3.1-32
SN74LS848
3.1-22
SN74LS169
3.1-20
SN74LS353
3.1-32
SN74LS85
3.1-18
SN74LS170
3.1-36
SN74LS365A
3.1-15
SN74LS86
3.1-28
SN74LS173A
3.1-23
SN74LS366A
3.1-15
SN74LS90
3.1-20
SN74LS174
3.1-24
SN74LS367A
3.1-15
SN74LS92
3.1-20
SN74LS175
3.1-25
SN74LS368A
3.1-15
SN74LS93
3.1-19
SN74LS181
3.1-14
SN74LS37
3.1-26
SN74LS95B
3.1-37
SN74LS190
3.1-20
SN74LS373
3.1-31
Logic: Standard, Special and Programmable
3.1-48
Motorola Master Selection Guide
Ordering Information
Device Nomenclatures
LS - Low Power Schottky
SN
ww
VV
xxxx v
~ Package Type
J
T
Range~
• N for Plastic (74 Series Only)
• J for Ceramic
• 0 for 150 mil Plastic SOIC (74 Series Only)
• OW for 300 mil Plastic SOIC (74 Series Only)
Standard Prefix
Temperature
• 74 Series (0 to +70°C)
• 54 Series (-55 to +125°C)
Function Type
Family - - - - - - - - - - - - - - - - - '
• LS = Low Power Schottky
FAST
MC
.-
Circuit Identifier
T
~
w
VV
XXXX
L
1
Temperature Range
• 74 Series (0 to +70°C)
Family - - - - - - - - - - - - - - - - - '
• F= FAST
V
Package Type
• N for Plastic (74 Series Only)
• 0 for 150 mil Plastic SOIC (74 Series Only)
• OW for 300 mil Plastic SOIC (74 Series Only)
Function Type
MECL 10K, MECL 10Hl100H
MC
Motorola
Circuit Identifier
~
WWW
xxx
Package Type
• P for Plastic
• L for Ceramic
• FN for PLCC
---------'1
Temperature Range
• 10 = 10K (-30 to +85°C)
• 10H = 10H (0 to +75°C)
• 100H = lOOK Compatible (0 to +85°C)
Motorola Master Selection Guide
VV
-r=
Function Type
3.1-49
Logic: Standard, Special and Programmable
ECLinPS, ECLinPS Lite
MC
Motorola
Circuit Identifier
WWW
1:
xxx yvy
ZZ
1
----.JT
• MC = Fully Qualified Circuit
• XC = Non Reliability Qualified
Package Type
• FN =PLCC
• D = Plastic SOIC
• L = Ceramic DIP
• P = Plastic DIP
Function Type
• yvy = 3-DigHs for ECLinPS
• yv= 2-Digits for ECLinPS Lite
Compatibility Identifier _ _ _ _ _ _---l
• 10 = 10H Compatible (0 to +85°C)
• 100 = 100K Compatible (0 to +85°C)
' - - - - - - - - - - - ECLinPS Family Identifier
• E = ECLinPS
• EL = ECLinPS Lite
• ELT = ECLinPS Lite Translator
• LVE = Low Voltage ECLinPS
• LVEL = Low Voltage ECLinPS Lite
Metal Gate 14000 Series CMOS
MC
T
14XXX YY
I
Motorola Circuit Identifier _ _ _ _
-r---J
Function Type _ _ _ _ _ _ _ _ _ _ _ _---J.
zz
T
_
Identifier (per JEDEC Standard)
• B (or Blank)= Buffered Outputs
• UB = Unbuffered Outputs
Package and Temperature Range
• CL for Ceramic -55 to + 125°C
• CP for Plastic -55 to +125°C
• D/DW for Small Outline Package (Plastic) -55 to + 125°C
High-Speed CMOS
MC
.-.
VV
I
Circuit Identifier
WWW
Y
XXXX
--c...-
I
Temperature Range
• 74 Series (-55 to +125°C)
• 54 Series (-55 to +125°C)
Package Type
• N for Plastic (74 Series Only)
• J for Ceramic (54 Series Only)
• D for 150 mil Plastic SOIC (74 Series Only)
• DW for 300 mil Plastic SOIC (74 Series Only)
Function Type
• XXIX) Same Function and Pin Configuration as
LSTIL
• 4XXX Same Function and Pin Configuration as
CMOS 14000
• 7XX(X) Variation of LSTIL or CMOS 14000
Device
High-Speed CMOS
Specification Identifier
• HC = Buffered High-Speed CMOS
• HCU = Unbuffered High-Speed CMOS'
• HCT = High-Speed CMOS TIL Compatible
'Not Available On All Devices
._.
Circuit Identifier
FACT
~T
Temperature Range Family
• 74AC = FACT (-40 to +85°C)
• 74ACT = TIL Compatible (-40 to +85°C)
Logic: Standard, Special and Programmable
xxx
YY
-,--
Package Type
• N for Plastic
• D for Narrow SOIC
• DW for Wide SOIC
Function Type
3.1-50
Motorola Master Selection Guide
Other Logic Circuits
MC/MCCS
wwwwww
Motorola
I
Circuit Identifier ----l
• MC = Standard Circuit Identifier
• MCCS = Circuit Chip-Set Identifier
x
VV
Package Type
• N for Plastic
• D for Narrow SOIC
• FNforPlCC
• FJ forClCC
Function Type _ _ _ _ _ _ _ _---l
Option Suffix Indicator
--------------1
Option Type
MECL IIIIHTUDTL
MC
Motorola
Circuit Identifier
XXXX
-----.JT
V
L:
Package Type
• P for Plastic
• l for Ceramic
• D for Narrow SOIC
• FN for PlCC
Function Type
LCX Products
.~.
Circuit Identifier
MC
74
LCX
VVVV
I I
Temperature Range
• 74 = -40 to +85°C
zz
~ Package Type
• D for Plastic Narrow JEDEC SOIC
• DW for Plastic Wide JEDEC SOIC
• M for Plastic EIAJ SOIC
• SD for Plastic SSOP
• DT for Plastic TSSOP
Function Type
Family Identifier
• lCX = 5V-Tolerant low-Voltage CMOS
LVQ Products
MC
.-
Circuit Identifier
74
LVQ
VVVV
I I
Temperature Range
• 74 = -40 to +85°C
zz
~ Package Type
• D for Plastic Narrow JEDEC SOIC
• DW for Plastic Wide JEDEC SOIC
• M for Plastic EIAJ SOIC
• SD for Plastic SSOP
• DT for Plastic TSSOP
Function Type
Family Identifier
• lVQ =low-Voltage Quiet CMOS
Motorola Master Selection Guide
3.1-51
logic: Standard, Special and Programmable
Motorola Programmable Arrays (MPA)
MPA
Motorola Programmable
Array Circuit Identifier
~
1XXXX
Family Identifier
• 1XXX = 1000 Series Programmable Array
• 17XXX = 17000 Series Serial EPROM
vv
C
Z
-I
Temperature Range
• Blank = 0 to + 70'C
• -I
= --40 to +85'C (Planned)
Speed Grade
• Consult Factory
L-_ _ _ _ _ _
Package Types
•
•
•
•
•
P
D
FN
FN
DD
=
=
=
=
=
8-Pin DIP
8-Pin SOIC
20-Pin PLCC
84--Pin PLCC
128-Pin PQFP
• DH =
=
• HI =
• KE =
• HV =
• DK
160-Pin PQFP
208-Pin PQFP
181-Pin PGA
224-Pin PGA
299-Pin PGA
MPA Design System Configuration Numbering
TT
MPA
Motorola Programmable
Array Circuit Identifier
x
I
v
L
Temperature Range
• P= PC
• W = Workstation
Development System Identifier
• E = Entry Series (Includes Full MPAI 016/1 036 Device Support)
• S = Standard Series (Includes All MPA1000 Family Support)
Logic: Standard, Special and Programmable
3.1-52
Motorola Master Selection Guide
Case Outlines
8-Pin Packages
L SUFFIX
CERAMIC DIP PACKAGE
CASE 693-03
ISSUE C
ff1I
OPTIONAL LEAD
CONFIGURATION
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEl.
4. DIMENSION F FOR FULL LEADS. HALF LEADS AT
LEAD POSITIONS 1, 4, 5, AND 8.
5. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM
A
B
C
0
E
F
G
l±l
SEATING
PLANE
J
K
L
M
N
INCHES
MAX
MIN
0.390 0.430
0.245 0.275
0.170 0.200
0.016 0.020
0.050 BSC
0.050 0.065
0.100 BSC
0.008 0.015
0.125 0.160
0.300 BSC
15°
0°
0.020 0.040
MILLIMETERS
MIN
MAX
9.91
10.92
6.22
6.98
4.32
5.08
0.41
0.51
1.27BSC
1.65
1.27
2.54 BSC
0.20
0.38
4.06
3.18
7.62 BSC
15°
0°
0.51
1.02
P SUFFIX
PLASTIC DIP PACKAGE
CASE 626-05
ISSUE K
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1962.
NOTE 2
DIM
A
B
C
0
F
G
H
-TSEATING
PLANE
J
K
L
M
N
H
Motorola Master Selection Guide
3.1-53
MILLIMETERS
MIN
MAX
9.40 10.16
6.10
6.60
3.94
.45
0.38
0.51
1.02
1.78
2.54BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 Bse
10°
0.76
1.01
INCHES
MIN
MAX
0.370 Q.400
0.240 0.260
0.165 0.175
0.Q15 0.020
0.040 0.070
0.100 BSC
0.030 0.050
0.008 0.012
0.115
0.135
0.300 Bse
10°
0.030 0.040
Logic: Standard, Special and Programmable
8-Pin Packages
DSUFFIX
PLASTIC SOIC PACKAGE
CASE 751-Q5
ISSUE N
1 rLJ,c
~MO
m,
RX450
/"
€h"uT
..........
-1 F L
•
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B 00 NOT INCWDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION 0 DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE 0 DIMENSION AT MAXIMUM
MATERIAL CONDIllON
Dill
A
8
C
D
F
J
G
J
K
M
P
R
IIILLIllETERS
MIN
MAX
4.80
5.00
4.00
3.80
1.35
1.75
0.35
0.49
0.40
1.25
1.27BSC
0.18
0.25
0.10
0.25
0°
7°
5.80
6.20
0.25
O~O
INCHES
MIN
!lAX
0.189
.196
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
O.05OBSC
0.007 O. 9
0.004 0.009
0°
7°
0.229 0.244
0.010 0.019
SDSUFFIX
PLASTIC SSOP PACKAGE
CASE 94D-03
ISSUE B
1 1-I 1$10.12(0.005)®lrlu ®lv®1
0.25 (0.010)
8xKREF
ITi8
l_
L
DETAILE
PIN 1
IDENT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1962.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCWDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCWDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDIllON.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
SECTIONN-N
DIM
A
B
C
D
F
G
H
Jl
K
Kl
L
M
H
Logic: Standard, Special and Programmable
3.1-54
MILLIMETERS
MIN
MAX
2.87
3.13
5.38
5.20
1.73
1.99
0.21
0.05
0.63
0.95
O.
0.44
0.60
0.09
0.20
0.09
0.6
0.25
0.38
0.33
0.25
7.65
7.
8°
0°
INCHES
IIIN
MAX
0.113 0.123
0.205 0.212
0.068 0.078
0.002 0.008
0.024 0.037
0.026
001
0.023
0.003 0.008
0.003 0.006
0.010 0.015
0.010 0.013
.301
0.311
0°
8°
Motorola Master Selection Guide
14-Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 632--08
ISSUEY
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
SEA1lNG
PLANE
B
~
C
D
F
G
F:JI: D G
J
K
14PL
1"::;$cTl':'-'0.2":-5(::-0.0:C-:
10"-;)@"I-=-rIrA-;;®"'1
1$10.25(0.010)@lrl B ® 1
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 646-06
ISSUE L
B
!-r'T"TT"T"T"11""T"t"..~7r!---.i
.1
L
M
N
B
C
D
F
G
H
J
K
L
M
N
DSUFFIX
PLASTIC SOIC PACKAGE
CASE 751A--03
ISSUE F
-jGi-
I~~~
PLANE
G
J
1$1 0.25(0.010)@lrl B ® 1A®I
Motorola Master Selection Guide
K
M
P
R
3.1-55
INCHES
MIN
MAX
0.715 0.770
0.240 0.260
0.145 0.185
0.015 0.021
0.040 0.070
O.l00SSC
0.082 0.095
0.008 0.015
0.115 0.135
0.300 SSC
0°
10°
0.Q15 0.039
MILLIMETERS
MIN
MAX
18.16 19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.82 BSC
0°
10°
1.01
0.39
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION 0 DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE 0 DIMENSION AT
MAXIMUM MATERIAL CONDITION
DIM
A
B
C
D
F
c
MILLIMETERS
MIN
MAX
19.05 19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54BSC
0.21
0.38
3.18
4.31
7.82BSC
0°
15°
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL
DIM
A
K
INCHES
MIN
MAX
0.750 0.785
0.245 0.2BO
0.155 0.200
0.Q15 0.020
0.055 0.065
0.100 BSC
0.008 0.Q15
0.125 0.170
0.300 BSC
0°
15°
0.020 0.040
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
127BSC
0.19
0.25
0.10
0.25
0°
7°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 om
0.014 0.019
0.016 0.049
0.050 SSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.Q19
Logic: Standard. Special and Programmable
. 14-Pln Packages
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965-01
ISSUE 0
DETAILP
~i]
-II-b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
YI4.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOUD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE RARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (h) DOES NOT
INCLUOE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE O.OB (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 (O.OIB).
DIM
A
AI
b
VIEWP,
())I
c
D
E
A 1 - .....
e
H.
0.50
L.
M
1-$1 0.13 (0.005)@1
Q
Z
SDSUFFIX
PLASTIC SSOP PACKAGE
CASE 940A-Q3
ISSUE B
1r-
14X K REF
1-$1 0.12(0.005)@ITI u ®I v® 1
fIr"
l ----- I
L
PIN 1
IDENT
0.25 (0.010)
B
A~-L
DETAILE
I-v-I
SECTIONN-N
•
DIM
A
B
C
D
F
J
Jl
K
Kl
L
M
3,1-56
INCitES
MIN
MAX
0.081
0.002 o.oOB
0.014 0.020
0.007
0.011
0.390 0.413
0.201
0.215
0.050 BSC
0291
0.323
0.020 0.033
0.043
0.059
10°
0°
0.02B 0.035
0.056
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
YI4.5M,19B2.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSIONIINTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -'1-/-.
G
H
Logic: Standard, Special and Programmable
MILLIMETERS
MIN
MAX
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
B.20
0.50
0.B5
1.10
1.50
0°
10°
0.70
0.90
1.42
MILLIMETERS
MIN
MAX
6.07
6.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
1.08
1.22
0.09
0.20
0.09
0.16
0.25
0.3B
0.25
0.33
7.65
7.90
BO
0°
INCHES
MIN
MAX
0.238 0249
0.205 0.212
0.06B 0.07B
0.002
O.OOB
0.024 0.037
O.026BSC
0.042 0.048
0.003 0.008
0.003 0.006
0.010 0.015
0.010 0.013
0.301
0.311
BO
0°
Motorola Master Selection Guide
14-Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G-Q1
ISSUE 0
14X K REF
:J:Bl
PIN1
IDENT.
DETAILE
L; }jf
J J1
r
--SECTION N-N
•
NOTES:
1. DIMENSIONING ANDTOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAM BAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
DIM
A
B
C
D
F
G
H
J
Jl
K
Kl
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
120
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 SSC
0'
8'
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
0.047
0.002
0.006
0.020
0.030
0.026BSC
0.020
0.024
0.004 0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0'
8'
16-Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 620-10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
I'S
/1
1/
fjUL
M
J 16 PL
""I
$-'TI""0.2"-5(-0.0-10--:)@"'"'Ir-Tr-IB--:®=:-'
S 11
1$10.25(0.010)@ITIA ®I
Motorola Master Selection Guide
3.1-57
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750 0.785
0.240
0295
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
15'
0'
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
5.08
0.39
0.50
1.27BSC
1.40
1.65
2.54BSC
0.21
0.38
3.18
4.31
7.62 SSC
15'
0'
0.51
1.01
Logic: Standard, Special and Programmable
16-Pin Packages
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 648-08
ISSUE R
-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
.7
0.015
0.021
0.040
0.70
0.100 BSC
0.050BSC
0.Q15
0.008
0.110
0.130
0.295 0.305
0°
10°
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
4.44
0.39
0.53
1.02
1.77
2.54 SSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0°
10°
0.51
1.01
o
SUFFIX
PLASTIC SOIC PACKAGE
CASE 7518-05
ISSUEJ
~---ll±ll---~
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
L±l S~~~~
DIM
A
B
C
D
F
~O
~OD
-j-L- - - -D~Pc
-TT
D 0
G
J
K
M
o 16PL
P
1-EI7IO.25(O.010)@ITIB®IA®1
Logic: Standard, Special and Programmable
R
3.1-58
MILLIMETERS
MIN
MAX
9.80 10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27BSC
0.19
0.25
0.10
0.25
7'
0'
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.229
0.244
0.010
0.019
Motorola Master Selection Guide
16-Pin Packages
DWSUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751G-02
ISSUE A
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.SM,1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIM ENS 10M 0 DOES NOT INCLUDE DAM BAR
PROTRUSION. ALLOWABLE DAM BAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF 0 DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.278SC
0.25
0.32
0.10
0.25
0°
7°
10.05
10.55
0.25
0.75
10.15
INCHES
MIN
MAX
0,411
0.400
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050BSC
0.010
0.012
0.004
0.009
7°
0°
0.395
0.415
0.010
0.029
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966-01
ISSUE a
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M.1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS 0 AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0 46 ( 0 018)
DETAIL P
~r-
VIEWP~
fimt#ml~
-II-b
A
A1
?-,
(JI):
----
c
ll~
T
DIM
A
A
b
c
D
E
e
1$1 0.13(0.005)@ 1
HE
L
L<
M
a
Z
Motorola Master Selection Guide
3.1-59
MILLIMETERS
MIN
MAX
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27BSC
7.40
8.20
0.50
0.85
1.10
1.50
0°
10°
0.70
0.90
0.78
INCHES
MIN
MAX
0.081
0.002
0.008
0.020
0.014
0.007
0.011
0.390
0.413
0.201
0.215
0.050BSC
0.291
0.323
0.020
0.033
0.043
0.059
0°
10°
0.028
0.035
0.031
Logic: Standard, Special and Programmable
16-Pin Packages
SO SUFFIX
PLASTIC SSOP PACKAGE
CASE 9408-03
ISSUE B
1 t-I
16X K REF
1$10.12 (0.005)(01 TI u ® I v ® I
0.25(0.010)
L
PIN1
IDENT
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI YI4.5M. 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
5. DIMENSION K ODES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAM BAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K
DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM
PLANE -W-.
DIM
A
B
C
SECTION N-N
JJ E =s-~
II/ \00
DETAILE~"""
0
F
G
H
J
J1
K
KI
L
M
OTSUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F-01
ISSUE 0
,----,-------,---,----=0
I
INCHES
MIN
MAX
0.238
0.249
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026BSC
0.028
0.035
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0'
8'
,.~
16X KREF
j1$1 0.10(0.004)(0I TI u ®I v®1
1
i=-G"7"7"i1
B
I±I
PIN 1
IDENT.
MILLIMETERS
MIN
MAX
6.07
6.33
5.20
5.38
1.73
1.99
0.21
0.05
0.63
0.95
0.65 BSC
0.73
0.90
0.20
0.09
0.09
0.16
0.25
0.38
0.33
0.25
7.65
7.90
0'
8'
~~J
,---,--------,-~~ ~
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
YI4.5M.1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAM BAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE
ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE -W-.
DIM
A
B
C
[±]
D
F
G
H
J
J1
K
KI
L
M
Logic: Standard, Special and Programmable
3.1-60
MILLIMETERS
MIN
MAX
4.90
5.10
4.50
4.30
1.20
0.15
0.05
0.50
0.75
0.65 SSC
0.18
0.28
0.09
0.20
0.09
0.16
0.30
0.19
0.19
0.25
6.40 BSC
8'
0'
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0'
8'
Motorola Master Selection Guide
18-Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 726-04
ISSUE G
I-
EB
-I
[:::::]~
OPTIONAL LEAD
CONFIGURATION (I, 9,10,18)
DIM
A
B
C
D
F
G
~~~"
~
jt
-------a
SEATING
PLANE
F
D 18:L
J
T
'I$:-iI=--O.:":'25:"'::(O'-.01-0)--=®"I-'TIr-A--:®~I
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1,
9, 10,AND 18.
1$lo.25(O.010)®ITI B ®I
K
L
M
N
INCHES
MIN
MAX
0.880
0.910
0240 0.295
0.200
0.015
0.021
0.055 0.070
0.100 BSC
0.012
0.008
0.125
0.170
0.300 BSC
IS"
0"
0.020
0.040
MILLIMETERS
MIN
MAX
22.35
23.11
6.10
7.49
5.08
0.38
0.53
1.40
1.78
2.54BSC
0.20
0.30
3.18
4.32
7.82 BSC
IS"
0"
0.51
1.02
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE707-Q2
ISSUEC
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
f~ ::::::::IJ
I-
A
-I
DIM
A
B
C
D
F
G
H
J
K
L
M
N
Motorola Master Selection Guide
3.1-61
MILUMETERS
MIN
MAX
22.22 23.24
6.10
6.60
3.56
4.57
0.36
0.56
1.27
1.78
2.54 SSC
1.02
1.52
0.20
0.30
2.92
3.43
7.82 BSC
IS"
0"
0.51
1.02
INCHES
MAX
MIN
0.875 0.915
0.240 0.260
0.140 0.160
0.014 0.022
0.050 0.070
0.100 BSC
0.040 0.060
0.008 0.012
0.115
0.135
0.300 BSC
IS"
0"
0.020 0.040
Logic: Standard, Special and Programmable
2D-Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 732-03
ISSUE E
DIM
A
B
C
0
F
G
H
c
I~~)::
:
:~):t,~
UIPIII
I~'7: '
H- t--ll-D
-
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER. TRUE
POSITION AT SEATING PLANE. AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEl.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
-IG~ K
J
K
L
M
N
SEATING
PLANE
MILLIMETERS
MIN
MAX
23.88
25.15
6.60
7.49
3.81
5.08
0.38
0.56
1.40
1.65
2.54 BSC
0.51
1.27
0.20
0.30
3.18
4.06
7.62 BSC
15°
0°
0.25
1.02
INCHES
MIN
MAX
0.940
0.990
0.260
0.295
0.150
0.200
0.Q15 0.022
0.055 0.065
0.100BSC
0.020 0.050
0.008 0.012
0.125 0.160
0.300 BSC
0°
15°
0.Q10 0.040
-
P,N SUFFIX
PLASTICC DIP PACKAGE
CASE 738-03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSIY14.5M,1962.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEl.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM
A
B
C
0
E
G
J
K
L
M
N
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 7510-04
ISSUE E
-11-1r-:$-rlo-.O-10-(O-.2S--:)®=I-Tr-1A--:®=-Sr-IB--;®"'I
20X
D
DIM
A
B
C
0
F
G
J
3.1--62
MILLIMETERS
MIN
MAX
25.66 27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27BSC
1.27
177
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
15°
0°
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006)
PER SIDE.
5. DIMENSION 0 DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF 0 DIMENSION
AT MAXIMUM MATERIAL CONDITION.
K
M
P
R
Logic: Standard. Special and Programmable
INCHES
MAX
MIN
1.010 1.070
0.240 0.260
0.150 0.180
0.015 0.022
O.osa BSC
0.050 0.070
0.100 BSC
0.008 0.015
0.110 0.140
0.300 BSC
15°
0°
0.020 0.040
MILLIMETERS
MIN
MAX
12.65 12.95
7.40
7.60
2.35
2.65
0.35
0.49
O.sa
0.90
1.27BSC
0.25
0.32
0.10
0.25
0°
7°
10.05 10.55
0.25
0.75
INCHES
MIN
MAX
0.499 0.510
0292 0.299
0.093 0.104
0.014 0.Q19
0.020 0.035
O.osa BSC
0.010 0.012
0.004 0.009
0°
7°
0.395 0.415
0.010 0.029
Motorola Master Selection Guide
2o-Pin Packages
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967-01
ISSUE 0
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M.1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY,
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAM BAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAM BAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0 46 (0018)
DETAILP
DIM
A
A,
b
VIEWP---...
;>-,
c
(;1) :
--
0.13(0.005)@
D
E
•
H.
L
L.
M
Q
Z
SO SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C-03
ISSUE B
DETAILE
Lr-K---J~
W//4
T~K1-1 t
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTER LEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
J1
DIM
A
B
SECTIONN-N
C
D
F
G
H
J
J1
K
K1
L
M
Motorola Master Selection Guide
3.1-63
INCHES
MIN
MAX
0.081
0.002 0.008
0.014 0.020
0.007
0.011
0.486 0.504
0.201
0.215
0.050 SSC
0.291
0.323
0.020
0.033
0.043
0.059
0"
10"
0.028
0.035
0.032
•
0.25 (0.010)
J
MILLIMETERS
MIN
MAX
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35 12.80
5.10
5.45
1.27BSC
7.40
8.20
0.50
0.85
1.10
1.50
0"
10"
0.70
0.90
0.81
MILLIMETERS
MIN
MAX
7.07
7.33
5.20
5.38
1.99
1.73
0.05
021
0.63
0.95
0.65BSC
0.59
0.75
0.09
020
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0"
8"
INCHES
MIN
MAX
0.278 0.288
0.205 0.212
0.068 O.D7B
O.OOB
0.002
0.024
0.037
0.026 BSC
0.023
0.030
0.003
0.008
0.003
0.006
0.015
0.010
0.010
0.013
0.301
0.311
0"
8"
Logic: Standard, Special and Programmable
20-Pin Packages
OTSUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E-02
ISSUE A
SECTION N-N
DETAILE
•
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14,5M,1982,
2, CONTROLLING DIMENSION: MILLIMETER,
3, DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS, MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0,15 (0,006) PER SIDE,
4, DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION, INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0,25
(0,010) PER SIDE,
5, DIMENSION K DOES NOT INCLUDE DAM BAR
PROTRUSION, ALLOWABLE DAM BAR
PROTRUSION SHALL BE 0,08 (0,003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION,
6, TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY,
7, DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-,
DIM
A
B
e
0
F
G
H
J
J1
K
K1
L
M
Logic: Standard, Special and Programmable
3.1-64
MILliMETERS
MIN
MAX
6,60
6.40
4,30
4,50
1.20
0,15
0,05
0,50
0,75
0,65 Bse
0,27
0,37
0,09
0,20
0,09
0,16
0,19
0,30
0,19
0,25
6,40 Bse
0°
8°
INCHES
MIN
MAX
0,252 0,260
0,169 0,177
0,047
0,002 0,006
0,020 0,030
0,026BSC
0,011
0.Q15
0,004 0,008
0,004 0,006
0,007 0,012
0,007 0,010
0,252 BSC
0°
8°
Motorola Master Selection Guide
20-Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775--02
ISSUE C
81$1 O.007(O.180)@ITI L-M® 1N®I
u 1$1 O.007(O.180)@ITI L-M®I N®I
G11$1 O.OI0(O.250)®ITI L-M®I N®I
VIEWD-D
I+----+t---AI$I O.007(O.180)@ITIL-M®IN®1
~-----rt-R 1$1 O.007(O.180)@ITI L-M®I N®I
+
~
HI$lo.007(O.180)@ITIL-M®IN®1
K1
K
~ I- F 1$1 O.007(O.180)@ITI L-M®I N®I
VIEWS
•
Motorola Master Selection Guide
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS RAND U 00 NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0,010
(0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
5. CONTROLLING DiMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAM BAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
3.1-65
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385 0.395
0.385 0.395
0.165
0.180
0.090 0.110
0.013 0.019
0.050BSC
0.02
0.032
0.020
0.025
0.350 0.356
0.350 0.356
0.042 0.048
0.042 0.048
0.042 0.056
0.020
10°
2°
0.310 0.330
0.040
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27BSC
0.66
0.81
0.51
0.84
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
0.50
2°
10°
7.88
8.38
1.02
Logic: Standard, Special and Programmable
22-Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 736-05
ISSUE E
~------~-A-r-------~
~
OPTIONAL
LEAD
CONFIGURATION
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
YI4.5M,1982.
2. CONTROlLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL
4. DIMENSION F FOR FULL LEADS. HALF LEADS
OPTIONAL AT LEAD POSITIONS " 1" 12, AND 22.
5. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
Dill
A
B
C
D
F
G
J
K
L
M
N
INCHES
IIIN
MAX
IILLIMETERS
IIIN
MAX
1.060 1.095
0.360 0.390
0.150 0.215
0.15 0.021
0.050 0.065
0.100 esc
0.008 0.015
0.125 0.170
0.400 BSC
O'
15'
0.20 0.050
2693 27.81
9.15
9.90
3.81
5.46
0.39
0.53
1.27
1.65
2.54BSC
020
0.39
3.18
4.31
10.16SSC
O'
15'
0.51
127
N SUFFIX
PLASTIC DIP PACKAGE
CASE 708-04
ISSUE D
f::::::::::: IJ
NOTES:
1. PDSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MeLD
FLASH.
Dill
iLl
,
,
fl
Logic: Standard. Special and Programmable
3.1-66
A
B
C
D
F
G
H
J
K
L
II
N
MILLIMETERS
IIIN
MAX
27.56 28.32
9.14
8.64
3.94
5.08
0.6
0.56
1.76
1.27
2.54BSC
1.02
1.52
0.20
0.38
2.82
3.43
10.16BSC
O'
IS'
0.51
INCHES
MIN
MAX
1.085 1.115
0.340 0.360
0.155 0.200
0.014 0.022
0.050 0.070
0.100BSC
0.040 0.060
0.008 0.D15
0.115 0.135
0.400BSC
O'
15°
0.020 0.040
Motorola Master Selection Guide
24-Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 758-02
ISSUE A
NOTES:
1, DIMENSIONING AND TOLERANCING PER ANSI
YI4,5M,1982,
2, CONTROLLING DIMENSION: INCH,
3, DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEl.
DIM
A
B
C
D
F
G
J
K
L
N
P
INCHES
MIN
MAX
1.240
1,285
0,285
0,305
0,160
0,200
0,015
0,021
0,045
0,062
0,100BSC
0,008
0,013
0,100
0,185
0,300
0,310
0,020
0,050
0,360
0,400
MILLIMETERS
MIN
MAX
32,64
31,50
7,24
7,75
5,08
4,07
0,53
0,38
1,14
1,57
2,64 BSC
0,20
0,33
2,54
4,19
7,62
7,87
0,51
1,27
9,14
10,16
L,J,JW SUFFIX
CERAMIC DIP PACKAGE
CASE 623-{)5
ISSUE M
13
1
NOTES:
1, DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEl.
2, LEADS WITHIN 0,13 (0,005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION (WHEN FORMED
PARALLEL),
B
~nrnnnnnnnn""TTTTTTrI2~~
A -----+1.1
DIM
A
B
C
D
F
G
J
K
L
N
Motorola Master Selection Guide
3.1-67
MILLIMETERS
MIN
MAX
31,24
32,77
12.70
15,49
4,06
5,59
0,41
0,51
1.27
1,52
2,64BSC
0,20
0,30
3,18
4,06
15,24BSC
0,51
1,27
INCHES
MIN
MAX
1,230
1.290
0,500
0,610
0,160
0,220
0,016
0,020
0,050
0,060
0,100BSC
0,008
0,012
0,125
0,160
0,600 BSC
0°
15°
0,020
0,050
Logic: Standard, Special and Programmable
24-Pln Packages
N SUFFIX
PLASTIC DIP PACKAGE
CASE 709-02
ISSUE C
DIM
A
B
c
C
D
F
G
H
J
H
I"
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
K
L
M
N
lJ
[±]
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
YI4.5M,1982.
4. CONTROLLING DIMENSION: INCH.
~c JLJ~-,
. j '~M
1$-1 O.25(O.010)@iTi B @I
o 24PL
1$-1 o.25(o.010)@ITI A @I
P,N,PW SUFFIX
PLASTIC DIP PACKAGE
CASE 649-03
ISSUE D
DIM
A
B
C
D
E
F
G
J
K
L
M
N
DIM
A
B
C
0
F
G
H
c
J
K
L
M
N
P
Q
3.1-68
INCHES
MIN
MAX
1.230 1.265
0.250 0.270
0.145 0.175
0.015 0.020
0.050 BSC
0.040 0.050
0.100 BSC
0.007 0.012
0.110 0.140
0.300 BSC
0°
15°
0.020 0.040
MILUMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
0°
15°
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
Q
Logic: Standard, Special and Programmable
INCHES
MIN
MAX
1.235 1.265
0.540 0.550
0.155 0.200
0.014 0.022
0.040 0.050
O.I00BSG
0.065 0.080
0.008 0.015
0.115
0.135
0.600BSG
0°
15°
0.020 0.040
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 724-03
ISSUE D
1~:::::::::::loo
t
p
MlLUMETERS
MAX
MIN
31.37 32.13
13.72 14.22
5.08
3.94
0.36
0.56
1.02
1.52
2.54BSG
1.65
2.03
0.38
0.20
2.92
3.43
15.24 BSC
0°
15°
0.51
1.02
MILLIMETERS
MIN
MAX
31.50
32.13
13.21
13.72
4.70
5.21
0.38
0.51
1.52
1.02
2.54BSC
1.65
2.16
0.20
0.30
2.92
3.43
14.99 15.49
10
0.51
1.02
0.13
0.38
0.51
0.76
INCHES
MAX
MIN
1.240 1.265
0.520 0.540
0.185 0.205
0.015 0.020
0.040 0.080
0.100BSG
0.065 0.085
0.008 0.012
0.115
0.135
0.590 0.610
10°
0.020 0.040
0.005 0.015
0.020 0.030
Motorola Master Selection Guide
24-Pin Packages
OW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 7S1E-04
ISSUE E
JL
24X
NOTES:
1. OIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0,15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
0
r:1$"1"'=0.""'01"""0("""0.2:-: :5)-;:®: T1::1TI--:-A--;®""'IB--;®~I
DIM
A
B
C
D
F
G
J
K
M
=-~~
l
T::
SEATING
PLANE
I
-.J
22X
G
P
K
R
MILLIMETERS
MIN
MAX
15.25
15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27BSC
0.23
0.32
0.13
0.29
0'
8'
10.05
10.55
0.25
0.75
SO SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D-03
ISSUE B
1 1-I
TT"':
1
L
~
l
PINl
IDENT
Y14.5M,1982.
L
13
r- K--J~
I B T l -W/4
t
J
J1
K1-J
~12~
+---1rU
A~
L-.l...-0-'---'----'---J[±]'------'V-
b
SECTIONN-N
0.25(0.010)
N~~
DETAILE
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAM BAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
DIM
A
B
C
D
F
G
H
J
Jl
K
Kl
L
M
Motorola Master Selection Guide
•
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24X KREF
1$10.12(0.005)®ITlu®lv®1
1124
INCHES
MIN
MAX
0.601
0.612
0.292
0.299
0.093
0.104
0.019
0.014
0.016
0.035
O.osa BSC
0.009
0.013
0.005
0.011
0'
8'
0.395
0.415
0.010
0.029
3,1-69
MILLIMETERS
MIN
MAX
8.07
8.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
0.44
0.60
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0'
8'
INCHES
MIN
MAX
0,317 0.328
0.205
0.212
0.068 0.D78
0,002 0.008
0.024 0.037
0.026 BSC
0,017 0.024
0.003 0.008
0.003 0.006
0.010 0.015
0.010 0.013
0.311
0.301
0'
8'
Logic: Standard, Special and Programmable
24-Pin Packages
DTSUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H-Q1
ISSUE 0
•
24XKREF
--Ir--le-I 0.10(0.004)@ITlu ®lv®1
~~~--~~~~~-,-----
1
B
8B
1bfr=r;=rr=;=;=;=;=;=;="i"Fi"F'FF~J
.1
ri·
-T-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
DIM
A
8
e
D
F
G
H
J
J1
K
K1
L
rot
10 (0.004) I
SEAllNG
PLANE
~I
(t:)
DETAIL
E..-/~
MILUMETERS
MIN
MAX
7.70
7.90
4.30
4.50
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40BSC
0°
8°
INCHES
MIN
MAX
0.303
0.311
0.169 o.m
0.047
0.002 0.006
0.020 0.030
0.026Bse
0.011
0.015
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 Bse
0°
8°
'N~~ '~:~ 1
DETAILE
logic: Standard, Special and Programmable
3.1-70
- ,
Motorola Master Selection Guide
28-Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 733-04
ISSUE C
NOTES:
1. DIMENSIONS A AND S INCLUDES MENISCUS.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. C0tffi10LLING DIMENSION: INCH.
I"
[±]
~I
ruM
A
B
C
D
F
c
;;!;.;."l~L
S
-J l!J
PLANE
~
f-G
G
J
K
L
M
N
D2:PL
INCHES
MIN
MAX
1.490
1.435
0.500
0.605
0.160
0.230
0.015
0.022
0.065
0.050
0.100BSC
0.008
0.012
0.125
0.160
0.600BSC
15°
0°
0.020
0.050
MILLIMETERS
MAX
MIN
37.84
36.45
12.70
15.36
4.06
5.84
0.38
0.55
1.65
1.27
2.54BSC
0.20
0.30
3.18
4.06
15.24 SSC
15°
0°
0.51
1.27
1$10 o.25(o.o10)®ITI A ®I
N SUFFIX
PLASTIC DIP PACKAGE
CASE 710-02
ISSUE B
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
Motorola Master Selection Guide
3.1-71
MILUMETERS
MAX
MIN
37.21
36.45
13.72
14.22
3.94
5.08
0.56
0.36
1.02
1.52
2.54BSC
2.16
1.65
0.20
0.38
2.92
3.43
15.24BSC
0°
15°
0.51
1.02
INCHES
MAX
MIN
1.465
1.435
0.540
0.560
0.200
0.155
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.135
0.115
0.600 BSC
0°
15°
0.040
0.020
Logic: Standard, Special and Programmable
28-Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776-
<>
e<>
-l.-,~o-, -'H
ci
'"
-$- ----!
-$-
DETAIL A
t
C
+
L±l
SEATING
SECTIONB-B
VIEW ROTATED 90 ° CLOCKWISE
PLANE
DETAILC
Motorola Master Selection Guide
NOTES:
1. DIMENSIONING AND TOlERANCING PER ANSI
Y14.5M,1982.
2, CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H-IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -8- AND -0- TO BE DETERMINED
AT DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE-C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0,25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOlD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAM BAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT.
3.1-73
DIM
A
B
C
0
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
X
MILLIMETERS
MIN
MAX
6.95
7.10
6.95
7.10
1.40
1.60
0.273 0.373
1.30
1.50
0.273
0.80BSC
0.20
0.119
0.197
0.33
0.57
5.6 REF
6°
8°
0.119
0.135
0.40 Bse
10°
5°
0.15
0.25
8.85
9.15
0.15
0.25
jjO
5°
8.85
9.15
1.00 REF
INCHES
MIN
MAX
0.274 0.280
0.274 0.280
0.055 0.063
0.010 0.015
0.051
0.059
0.010
0.031 Bse
0.008
O.OOS 0.008
0.013 0.022
0.220 REF
8°
6°
0.005 0.005
0.016Bse
10°
5°
0.006
0.010
0.348 0.360
0.006 0.010
11°
5°
0.348 0.360
0.039 REF
Logic: Standard, Special and Programmable
40-Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 734-04
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5.1973.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND 8 INCLUDE MENISCUS.
4. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
DIM
A
B
C
0
F
G
J
K
L
M
N
MILLIMETERS
MIN
MAX
51.31
53.24
12.70 15.49
4.06
5.84
0.38
0.56
127
1.65
2.54BSC
0.20
0.30
3.18
4.06
15.24 BSC
15°
5°
0.51
1.27
INCHES
MIN
MAX
2.020
2.096
0.500 0.610
0.160 0.230
0,015 0.022
0.050 0.065
0.100BSC
0.008
0.012
0.125 0.160
0.600BSC
15°
5°
0.020 0.050
1$10 o.25(o.o10)®ITI A ® 1
N SUFFIX
PLASTIC DIP PACKAGE
CASE 711-03
ISSUEC
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D). SHALL
BE WrTHlN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION. IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM
A
B
C
0
F
G
H
J
K
L
M
N
Logic: Standard, Special and Programmable
3.1-74
MILLIMETERS
MIN
MAX
51.69 52.45
13.72 14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54BSC
1.65
2.16
0.20
0.38
2.2
3.43
15.24BSC
0°
15°
0.51
1.02
INCHES
MIN
MAX
2.035 2.065
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
.11
0.135
0.600BSC
0°
15°
0.020 0.040
Motorola Master Selection Guide
48-Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 74Q-03
ISSUE B
I-
[±]
"I
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL
I~: : : :1::I:::::IT
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
2.376
2.424
0.576
0.604
0.120
0.127
0.Q15
0.021
0.050 BSC
0.030
0.055
0.100BSC
0.008
0.Q13
0.100
0.165
0.600 BSC
10°
0°
0.040
0.060
MILLIMETERS
MIN
MAX
60.36 61.56
14.64 15.34
4.31
3.05
0.381
0.533
1.27BSC
0.762
1.397
2.54 BSC
0.204 0.330
4.19
2.54
15.24BSC
10°
0°
1.016 1.524
N SUFFIX
PLASTIC DIP PACKAGE
CASE 767--02
ISSUE B
t::::::::::::::::::J +
DETAIL X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARAlLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
A
B
C
D
F
G
H
J
o 32PL
1$10.51 (0.020)@ITI A ® 1
Motorola Master Selection Guide
1$10.25(0.010)@ITIB ®I
3.1-75
K
L
M
N
INCHES
MIN
MAX
2.415 2.445
0.540 0.560
0.155
0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.070 BSC
0.008
0.Q15
0.115
0.150
0.600 BSC
15°
0°
n.n2n
.040
MILLIMETERS
MIN
MAX
61.34 62.10
13.72
14.22
3.94
5.08
0.36
0.55
1.02
1.52
2.54BSC
1.79BSC
0.20
0.38
3.81
2.92
15.24 BSC
15°
0°
1.01
0.51
Logic: Standard, Special and Programmable
52-Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 77B--_Q
''' ....,
~G f
_d~t
FiR
4xe3
PLANE
VIEWAA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H-IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
4. DATUMS-L-,-M-AND-N- TO BE DETERMINED AT
DATUM PLANE-I+-.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING
PLANE-T-.
6. DIMENSIONS A AND B 00 NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010)
PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE ·H·.
7. DIMENSION 0 DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.46 (0.018).
MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD OR PROTRUSION 0.07 (0.003).
MIL
ERS
DIll
A1
B
B1
5.00
).00
5.00
0.05
0.394
0.19:
1.70
0.20
0,20
0.75
0.46
0.22
0.35
0.65BSC
0.07
0.20
0.50 REF
VIEWAA
Logic: Standard, Special and Programmable
•
3.1-78
12.Il!tBSC
6.00BSC
).16
0.09
12.00 BSC
tOOBSC
93
INCI
I
12' REF
13'
0.002
0.06i
0.' 08
0.018
O. GO
).009
0.02 BS'
0.003
0.008
0.020 REF
0.236BSC
0.004 0.008
0.472 BSC
.23IBSC
12' REF
13°
Motorola Master Selection Guide
68-Pin Package
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 779-02
ISSUE C
81$1 0.007(0.18)®ITI L-M® 1N®I
ul$1 0.007(0.18)@ITIL-M®IN®1
YBRK
D
G1
D
VIEWD-D
z,....
1
c"
$10.007(0.18)®ITIL-M®IN®1
o
I.
;:n:-- 'i t' lii1.
J
G1----..{
-T-
004 (0.10) 1
SEATING
PLANE
VIEWS
NOTES:
1. DATUMS -l-. -M-, AND -N- DETERMINED WHERE TOP OF
lEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
2. DIMENSION Gl, TRUE POSITION TO BE MEASURED AT
DATUM - T-, SEATING PLANE.
3. DIMENSIONS RAND U DO NOT INCLUDE MOLD FLASH.
AllOWASlE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOlERANCING PER ANSI Y14.5M,
1982.
5. CONTROlliNG DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMAllER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS
RAND U ARE DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH. TIE BAR BURRS, GATE BURRS AND INTERlEAD
FlASH, BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHAll NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHAll NOT CAUSE THE H DIMENSION TO
BE SMAllER THAN a025 (0 635)
0111
A
B
C
E
F
G
H
J
K
R
U
V
W
I-FI$I 0.007(0.18)@ITIL-M®IN®1
X
Y
Z
Gl
Kl
VIEWS
Motorola Master Selection Guide
3.1-79
1$1 0.010 (0.25)®1 TI L-M®I N®I
INCHES
IIIN
MAX
0.995
0.985
0.985 0.995
0.165 0.180
0.090 0.110
0.013
0.019
0.050 BSC
0.026 0.032
0.020
0.025
0.950 0.956
0.950 0.956
0.042 0.048
0.042 0.048
0.042 0.056
0.020
10°
2°
0.910
0.930
0.040
MilliMETERS
MAX
MIN
25.02 25.27
25.02 25.27
4.20
4.57
2.29
2.79
0.33
0048
1.27BSC
0.66
0.81
0.51
0.64
24.13
24.28
24.13
24.28
1.07
1.21
1.07
1.21
1.42
1.07
0.50
10°
2°
23.12 23.62
1.02
Logic: Standard. Special and Programmable
Programmable Array
84-Pin Package
Figure 18. FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 780-01
ISSUE A
BI*I 0.007(0.18)@lrIL-M®IN®1
ul*l 0.007(0.18)@ITIL-M®IN®1
D
Tt
D
X
G1
1$10.010(0.25)®lrIL-M®IN®1
VIEWD-D
A
1$10.007 (0.18)@lrl L-M®I N®I
R
H
1$1 0.007(0.18)@lrIL-M®IN®1
VIEWS
1*1 0.007(0.18)@ITI L-M®I N®I
K1
[1Jo.o04 (0.10) 1
G1
1*1 0.010 (0.25)®1 TI L-M®I N®I
Logic: Standard, Special and Programmable
T
VIEWS
SEATING
PUNE
NOTES:
1. DATUMS -L-. -M-. -N-. AND-PDETERMINED WHERE TOP OF LEAD
SHOULDER EXITS PACKAGE BODY AT MOLD
PARTING UNE.
2. DIMENSION Gl. TRUE POSITION TO BE
MEASURED AT DATUM -T-. SEATING PLANE.
3. DIMENSIONS RAND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI YI4.5M. 1982.
5. CONTROLUNG DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
10.300). DIMENSIONS RAND UARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BOOY
EXCLUSIVE OF MOLD FLASH. TIE BAR
BURRS. GATE BURRS AND INTERLEAD
FLASH. BUT INCWDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INlRUSION. THE DAMSAR
PROTRUSION(5) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.94). THE DAMBAR INTRUSIONIS) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
3.1-80
l!l!M
A
B
C
INCHES
MAX
r.!!li
1.185
.185
.16
R
U
.1
.11
0.013 0,019
0.050BSC
0.026 0.032
0.020
0.025
1.1
1.1
1.1
1.1
-.lL
.048
E
F
G
H
W
X
Y
Z
Gl
Kl
~
MiLLIMETERS
MIN
MAX
30~5
1~ LaO.l0
1~ ~ ~
~
~
0.042
0.056
2·
1.110
0.040
1•
1.13
4.20
4.7
2.29
2.79
0.33
0.48
1.27BS
-'l.BIl_
0.51
0.64
1
1
1.07
107
1.07
2·
2
1.02
J.81
2.
1.21
1.21
1.42
0.50
1•
7
Motorola Master Selection Guide
Programmable Array
128-Pin Package
Figure 19. DO SUFFIX
PLASTIC QFP PACKAGE
CASE 862A-02
ISSUE B
@
'"
@
----i-i;<)-j-iro.t
Toggle
'1%
Output 4
H-o-+-O_2.5 V/t.O rnA
Output 1
~-O-"-°3.0 V/30 rnA
Output 2
~-O::!:"""°3.0 Vl60 rnA
~==~~~------~,""I
~------~--------------------~O
~----------------------------------~O
~--------------------------------~,""I
MPU
VSS
GaAs Amplifier Supervisory Circuit
MC33169DTB
TA = -40° to +85°C, Case 9488
The MC33169 is a support IC for GaAs
Power Amplifier Enhanced FETs used in
hand portable telephones such as GSM,
PCN, DECT. This,device provides negative
voltages for full depletion of Enhanced
MESFETs as well as a priority management
system of drain switching, ensuring thatthe
negative voltage is always present before
turning "on" the power amplifier. Additional
features include an idle mode input and a
direct drive of the N-Channel drain switch
transistor.
This product is available in two versions,
-2.5 V and -4.0 V. The -4.0 V version is
intended for supplying RF modules for
GSM and DCS1800 application whereas
the -2.5 V version is dedicated for DECT
and PHS systems.
• Negative Regulated Output for Full
Depletion of GaAs MESFETs
• Drain Switch Priority Management
Circuit
• CMOS Compatible Inputs
• Idle Mode Input (Standby Mode) for
Very Low Current Consumption
• Output Signal Directly Drives
N-ChannelFET
• Low Startup and Operating Current
Motorola Master Selection Guide
VBB Double
= VBattery
..L (2.7 to 7.0 V)
~------r---'-------,""
RF
Out
C1
~-----..J~~h
R1
4.2-7
'-L
Analog and Interface Integrated Circuits
SCSI Regulator
Table 5. SCSI Regulator
Vin
(V)
Vout
(V)
Device
MC34268
Min
2.81
I
I
Max
Isink
(mA)
Min
2.89
800
3.9
I
I
Regllne
Regload
Max
(%)
(%)
TJ
(Oe)
Suffix!
Package
20
0.3
0.5
150
D1751 , DT
SCSI-2 Active Terminator Regulator
MC34268D, Dr
TJ = 0° to +125°C, Case 751, 369A
The MC34268 is a medium current, low dropout positive
voltage regulator specifically designed for use in SCSI-2
active termination circuits. This device offers the circuit
designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum. The
regulator consists of a 1.0 V dropout composite PNP/NPN
pass transistor, current limiting, and thermal limiting. These
devices are packaged in the 8-pin SOP-8 and 3-pin DPAK
surface mount power packages.
Applications include active SCSI-2 terminators and post
regulation of switching power supplies.
•
•
•
•
•
•
•
•
2.85 V Output Voltage for SCSI-2 Active Termination
1.0 V Dropout
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.4% Tolerance
No Minimum Load Required
Space Saving DPAK and SOP-8 Surface Mount Power
Packages
Input
Analog and Interface Integrated Circuits
4.2-8
Motorola Master Selection Guide
Switching Regulator Control Circuits
These devices contain the primary building blocks which
are required to implement a variety of switching power
supplies. The product offerings fall into three major categories
consisting of single--ended and double--ended controllers,
plus single--ended les with on-chip power switch transistors.
These circuits operate in voltage, current or resonant modes
and are designed to drive many of the standard switching
topologies. The single--ended configurations include buck,
boost, flyback and forward converters. The double--ended
devices control push-pull, half bridge and full bridge
configurations.
Table 6. Single-Ended Controllers
These single-ended voltage and current mode controllers are designed for use in buck, boost, flyback, and forward
converters. They are cost effective in applications that range from 0.1 to 200 W power output.
Minimum
Operating
Voltage
Range
(V)
Operating
Mode
500
(Uncommitted
Drive Oulpul)
7.01040
Vollage
1000
(Tolem Pole MOSFET
Drive Oulpul)
4.21012
10
(mA)
Max
Reference
(V)
Maximum
Useful
Oscillator
Frequency
(kHz)
Device
(OC)
Suffix!
Package
5.0± 1.5%
200
MC34060A
010+70
D/751 A
MC33060A
-4010+85
D/751 A
MC34129
010 +70
D/751 A
MC33129
-4010+85
D/751 A
UC3842A
010 +70
D/751 A
TA
P/646
P/646
Currenl
1.25±2.0%
300
P/646
P/646
11.51030
5.0±2.0%
111030
5.0± 1.0%
UC2842A
-2510+85
0/751 A
8.21030
5.0±2.0%
UC3843A
010 +70
0/751 A
5.0± 1.0%
UC2843A
-2510+85
0/751 A
UC3844
Oto+70
0/751 A
UC2844
-25 to +85
0/751 A
500
N/626
N/626
N/626
N/626
11.51030
5.0±2.0%
500
(50% Duty
Cvcle Limit)
11 to 30
5.0± 1.0%
8.2 to 30
5.0±2.0%
UC3845
oto +70
D/751 A
5.0± 1.0%
UC2845
-25 to +85
0/751 A
UC3842B
Oto+70
0/751 A
N/626
N/626
Nl626
N/626
11.5t030
Motorola Master Selection Guide
5.0 ± 2.0%
4.2-9
500
(Improved
Oscillator
Specifications
with
Frequency
Guaranteed
at 250 kHz)
01/751
Nl626
UC3842BV
-40 to +105
0/751 A
01/751
Nl626
Analog and Interface Integrated Circuits
Table 6. Single-Ended Controllers (continued)
These single-ended voltage and current mode controllers are designed for use in buck, boost, flyback, and forward
converters. They are cost effective in applications that range from O. t to 200 W power output.
10
(mA)
Max
1000
(Totem Pole MOSFET
Drive Output)
Minimum
Operating
Voltage
Range
(V)
Operating
Mode
Reference
(V)
11 to 30
Current
5.0± 1.0%
8.2 to 30
5.0±2.0%
Maximum
Useful
Oscillator
Frequency
(kHz)
500
(Improved
Oscillator
Specifications
with
Frequency
Guaranteed
at 250 kHz)
Device
TA
("C)
Suffix!
Package
UC2842B
-25 to +85
D/751 A
D1/751
N/626
UC3843B
Oto+70
D/751 A
D1/751
N/626
UC3843BV
--40 to +105
D/751 A
D1/751
N/626
5.0±1.0%
UC2843B
-25 to +85
D/751 A
D1/751
N/626
11.5t030
5.0 ± 2.0%
500
(50% Duty
Cycle Limit)
UC3844B
Oto+70
0/751 A
D1/751
N/626
UC3844BV
--40 to +105
D/751 A
D1/751
N/626
11 to 30
5.0± 1.0%
UC2844B
-25 to +85
D/751 A
D1/751
N/626
8.2 to 30
5.0±2.0%
UC3845B
010+70
D/751 A
D1/751
N/626
UC3845BV
--40 to +105
D/751 A
D1/751
N/626
5.0± 1.0%
UC2845B
-25 to +85
D/751 A
D1/751
Nl626
1000 Source
1500 Sink
(Split Totem Pole
Bipolar Drive Output)
11 to 18
2000
(Totem Pole MOSFET
Drive Output)
9.2 to 30
5.0±6.0%
Current
or
Voltage
5.1 ± 1.0%
MC44602
1000
MC34023
P2I648C
Oto+70
DW/751G
FN1775
P/648
MC33023
--4010 +105
DW1751G
FN/775
P/648
Analog and Interface Integrated Circuits
4.2-10
Motorola Masler Selection Guide
Table 7. Single-Ended Controllers with On-Chip Power Switch
These monolithic power switching regulators contain all the active functions required to implement standard dc-to--dc
converter configurations with a minimum number of external components.
10
(mA)
Max
1500
(Uncommitted
Power Swilch)
Minimum
Operating
Voltage
Range
(V)
Operating
Mode
2.51040
Vollage
Reference
(V)
Maximum
Useful
Oscillator
Frequency
(kHz)
Device
1.25 ± 5.2%(1)
100
IlA78S40
1.25±2.0%
(Oc)
Suffix!
Package
Oto+70
PC/648
-4010 +85
PV/648
TA
MC34063A
010 +70
Dn51
P1/626
MC33063A
-4010 +85
Dn51
P1/626
3400
(Uncommitted
Power Switch)
2.51040
3400(2)
(Dedicated Emitter
Power Swilch)
7.51040
1.25±2.0%
and
5.05±3.0%
5.05±2.0%
72± 12%
Internally
Fixed
5500(3)
(Dedicated Emitter
Power Swilch)
MC34163
010 +70
MC33163
-4010 +85
MC34166
Oto+70
MC33166
-4010+85
MC34167
010 +70
MC33167
-4010+85
P/648C,
DWn51G
D2T/936A,
TH,TV,
T/314D
(1) Tolerance applies over the specified operating temperature range.
(2) Guaranteed minimum. typically 4300 rnA.
(3) Guaranteed minimum, typically 6500 rnA.
Table 8. Very High Voltage Single-Ended Controller with On-Chip Power Switch
This monolithic high voltage switching regulator is specifically designed to operate from a rectified ac line voltage source.
Included are an on--chip high voltage power switch, active off-line startup circuitry and a full featured PWM controller with fault
protection.
Power Switch
Maximum Rating
VOS(V)
lOS (mA)
Startup
Input Max
(V)
500
2000
250
Motorola Master Selection Guide
Operating
Mode
Vollage
(V)
Maximum
Useful
OSCillator
Frequency
(kHz)
Device
TA
(OC)
Suffix!
Package
2.6±3.1%
1000
MC33362
-25 to +125
DWn51N
Feedback
Threshold
4.2-11
Analog and Interface Integrated Circuits
Table 9. Double-Ended Controllers
These double-ended voltage, current and resonant mode controllers are designed for use in push-pull, half-bridge, and
full-bridge converters. They are cost effective in applications that range from 100 to 2000 watts power output.
10
(mA)
Max
500
(Uncommitted
Drive Outputs)
±500
(Totem Pole MOSFET
Drive Outputs)
Minimum
Operating
Voltage
Range
(V)
Operating
Mode
7.0 to 40
Voltage
8.0 to 40
Device
5.0 ± 5.0%(1)
200
TL494
(OC)
Suffix!
Package
o to +70
CN/648
TA
5.0± 1.5%
300
TL594
5.1 ±2.0%
400
SG3525A
-25 to +85
IN/648
Oto+70
CN/648
-25 to +85
IN/648
Oto +70
N/648
SG3527A
±200
(Totem Pole MOSFET
Drive Outputs)
±1500
(Totem Pole MOSFET
Drive Outputs)
Reference
(V)
Maximum
Useful
Oscillator
Frequency
(kHz)
5.0±2.0%
9.6 to 20
Resonant
(Zero
Current)
5.1 ±2.0%
1000
N/648
SG3526
o to +125(2)
Nn07
MC34066
Oto+70
DWn51G
MC33066
-40 to +85
DWn51G
P/648
P/648
Resonant
(Zero
Voltage)
2000
MC34067
Oto +70
DWn51G
MC33067
-40 to +85
DWn51G
MC34025
o to +70
DWn51G
P/648
P/648
2000
(Totem Pole MOSFET
Drive Outputs)
9.2 to 30
Current
or
Voltage
5.1 ±1.0%
1000
FNn75
P/648
MC33025
-40 to +105
DWn51G
FNn75
P/648
(1) Tolerance applies over the specified operating temperature range.
(2) Junction Temperature Range.
Analog and Interface Integrated
Circu~s
4.2-12
Motorola Master Selection Guide
Switching Regulator Control Circuits (continued)
High Voltage Switching Regulator
MC33362DW
TJ = -25 0 to +125°C, Case 751N
The MC33362 is a monolithic high voltage switching
regulator that is specifically designed to operate from a
rectified 120 Vac line source. This integrated circuit features
an on-chip 500 V/2.0 A SenseFET power switch, 250 V active
off-line startup FET, duty cycle controlled oscillator, current
limiting comparator with a programmable threshold and
leading edge blanking, latching pulse width modulator for
double pulse suppression, high gain error amplifier, and a
trimmed internal bandgap reference. Protective features
include cycie-by-cycie current limiting, input undervoltage
lockout with hysteresis, output overvoltage protection, and
thermal shutdown. This device is available in a 16 lead wide
body surface mount package.
• On-Chip 500 V, 2.0 A SenseFET Power Switch
• Rectified 120 Vac Line Source Operation
• On-Chip 250 V Active Off-Line Startup FET
• Latching PWM for Double Pulse Suppression
• Cycie-By-Cycie Current Limiting
• Input Undervoltage Lockout with Hysteresis
• Output Overvoltage Protection Comparator
• Trimmed 1.0% Internal Bandgap Reference
• Internal Thermal Shutdown
20 W Off-Line Converter
AC Input
"'0
Startup Input
.T.
I
I
Motorola Master Selection Guide
4.2-13
.. U::
DC Output
r;"'-''''-'-''"7·-'-- ~ -.--".-.-.-;-:-- - - . - - - - .
Analog and Interface Integrated Circuits
Switching Regulator Control Circuits (continued)
High Voltage Switching Regulator
MC33363DW
TJ = -25° to + 125°C, Case 751 N
The MC33363 is a monolithic high voltage switching
regulator that is specifically designed to operate from a
rectified 240 Vac line source. This integrated circuit features
an on-chip 700 V/l.0 A SenseFET power switch, 450 V active
off-line startup FET, duty cycle controlled oscillator, current
limiting comparator with a programmable threshold and
leading edge blanking, latching pulse width modulator for
double pulse suppression, high gain error amplifier, and a
trimmed internal bandgap reference. Protective features
include cycle-by-cycle current limiting, input undervoltage
lockout with hysteresis, output overvoltage protection, and
thermal shutdown. This device is available in a 16-lead wide
body surface mount package.
• On-Chip 700 V, 1.0 A SenseFET Power Switch
• Rectified 240 Vac Line Source Operation
• On-Chip 450 V Active Off-Line Startup FET
• Latching PWM for Double Pulse Suppression
• Cycle-By-Cycle Current Limiting
• Input Undervoltage Lockout with Hysteresis
• Output Overvoltage Protection Comparator
• Trimmed Internal Bandgap Reference
• Internal Thermal Shutdown
•
DC Output
Analog and Interface Integrated Circuits
4.2-14
Motorola Master Selection Guide
Special Switching Regulator Controllers
These high performance dual channel controllers are
optimized for off-line, ae-to--dc power supplies and dc-to--dc
converters in the flyback topology. They also have
undervoltage lockout voltages which are optimized for off-line
and lower voltage dc-te-dc converters, respectively.
Applications include desktop computers, peripherals,
televisions, games, and various consumer appliances.
Table 10. Dual Channel Controllers
10
(mA)
Max
Minimum
Operating
Voltage
Range
(V)
Operating
Mode
Reference
(V)
Maximum
Useful
Oscillator
Frequency
(kHz)
500
4.0
Voltage
1.25±2.0%
700
Device
TA
(OC)
Suffix!
Package
MC34270
Oto +70
FB/873A
MC34065
Oto +70
DW-Hn51G
MC33065
-40 to +85
DW-Hn51G
MC34065
Oto +70
DW-U751G
MC33065
-40 to +85
DW-U751G
MC34271
±1000
(Totem Pole MOSFET
Drive Outputs)
11 to 20
Current
5.0±2.6%
500
P-H/648
P-H/648
8.2 to 20
P-U648
P-U648
Table 11. Universal Microprocessor Power Supply Controllers
A versatile power supply control circuit for microprocessor-based systems, this device is mainly intended for automotive
applications and battery powered instruments. The circuit provides a power-on reset delay and a Watchdog feature for orderly
microprocessor operation.
Vcc
(V)
Regulated
Outputs
Output
Current (mA)
Min
Max
Reference
(V)
E2PROM Programmable
Output:
24 V (Write Mode)
5.0 V (Read Mode)
150 peak
6.0
35
2.5±3.2%
Key
Supervisory
Features
MPU Reset and
Watchdog
Circuit
Device
TCF5600
TCA5600
TA
(OC)
Package
-40 to +85
707
Table 12. Power Factor Controllers
10
(mA)
Max
±500
(Totem Pole MOSFET
Drive Outputs)
Minimum
Operating
Voltage
Range
(V)
Maximum
Startup
Voltage
(V)
Reference
(V)
9.0 to 30
30
2.5±1.4%
Features
Device
TA
("C)
Undervoltage Lockout,
Internal Startup
Timer
MC34261
Oto+70
Suffix!
Package
Dn51
P/626
MC33261
-4010+85
Dn51
Overvoltage
Comparator,
Undervoltage Lockout,
Internal Startup
Timer
MC34262
Oto+85
Dn51
MC33262
-40 to +105
Dn51
Off-Line High Voltage
Startup Overvoltage
Comparator,
Undervoltage Lockout,
Timer, Low Load Detect
MC33368
-25 to +125
Dn51
P/626
1500
(CMOS Totem Pole
MOSFET Drive
Outputs)
9.0 to 16
Motorola Master Selection Guide
500
5.0± 1.5%
4.2-15
P/626
P/626
Analog and Interface Integrated Circuits
Power Factor Controllers
MC34262D, P
TA =0° to +85°C, Case 751,626
MC33262D, P
TA = 40° to +105°C, Case 751,626
The MC34262, MC33262 series are active power factor
controllers specifically designed for use as a preconverter in
electronic ballast and in off-line power converter applications.
These integrated circuits feature an internal startup timer for
stand alone applications, a one quadrant multiplier for near
unity power factor, zero current detector to ensure critical
conduction operation, transconductance error amplifier,
quickstart circuit for enhanced startup, trimmed internal
bandgap reference, current sensing comparator, and a totem
pole output ideally suited for driving a power MOSFET.
Also included are protective features consisting of an
overvoltage comparator to eliminate runaway output voltage
due to load removal, input .undervoltage lockout with
hysteresis, cycle-by-cycle current limiting, multiplier output
clamp that limits maximum peak switch current, an RS latch
for single pulse metering, and a drive output high state clamp
for MOSFET gate protection. These devices are available in
dual-in-line and surface mount plastic packages.
Vo
330 400 VlO.44 A
Analog and Interface Integrated Circuits
4.2-16
Motorola Master Selection Guide
Power Factor Controllers (continued)
MC33368D
TJ = -25° to +125°C, Case 751 K
The MC33368 is an active power factor controller that
functions as a boost preconverter in off-line power supply
applications. MC33368 is optimized for low power, high
density power supplies requiring minimum board area,
reduced component count, and low power dissipation. The
narrow body SOIC package provides a small footprint.
Integration of the high voltage startup saves approximately
0.7 W of power compared to resistor bootstrapped circuits.
The MC33368 features a watchdog timer to initiate output
switching, a one quadrant multiplier to force the line current to
follow the instantaneous line voltage, a zero current detector
to ensure critical conduction operation, a transconductance
error amplifier, a current sensing comparator, a 5.0 V
reference, an undervoltage lockout (UVLO) circuit which
monitors the VCC supply voltage, and a CMOS driver for
driving MOSFETs. The MC33368 also includes a
programmable output switching frequency clamp. Protection
features include an output overvoltage comparator to
minimize overshoot, a restart delay timer, and cycle-bycycle current limiting.
• Lossless Off-Line Startup
• Output Overvoltage Comparator
• Leading Edge Blanking (LEB) for Noise Immunity
• Watchdog Timer to Initiate Switching
• Restart Delay Timer
D6
1N4934
400 V
RlO
15 k
R5
1.3 M
MTW
14N50E
R2
820 k
C7
~470pF
LEB
9
CS
~
MULT
C8
.001
Rg
10
R7
0.1
Li..>= _ _ _ _
R3
C2
10 k
0.01
Camp
4
~ ~~8
FB
Vref
Vref
Motorola Master Selection Guide
4.2-17
R1
10 k
Analog and Interface Integrated Circuits
Supervisory Circuits
A variety of Power Supervisory Circuits are offered.
Overvoltage sensing circuits which drive "Crowbar" SCRs
are provided in several configurations from a low cost
three-terminal version to 8-pin devices which provide
pin-programmable trip voltages or additional features, such
as an indicator output drive and remote activation capability.
An over/undervoltage protection circuit is also offered.
Overvoltage Crowbar Sensing Circuit
MC3423P1,D
TA = 0° to +70°C, Case 626, 751
This device can protect sensitive
circuitry from power supply transients or
regulator failure when used with an external
"Crowbar" SCR. The device senses
voltage and compares it to an internal 2.6 V
reference. Overvoltage trip is adjustable by
means of an external resistive voltage
divider. A minimum duration before trip is
programmable with an external capacitor.
Other features include a 300 rnA high
current output for driving the gate of a
"Crowbar" SCR, an open-collector
indicator output and remote activation
capability.
Sense 1
Remote
Activation
Over/Undervoltage Protection Circuit
MC3425P1
TA = 0° to +70°C, Case 626
The MC3425 is a power supply
supervisory circuit containing all the
necessary functions required to monitor
over and undervoltage fault conditions.
This device features dedicated over and
undervoltage sensing channels with
independently programmable time delays.
The overvoltage channel has a high current
drive output for use in conjunction with an
external SCR "Crowbar" for shutdown. The
undervoltage channel input comparator
has hysteresis which is externally
programrnable, and an open-collector
output for fault indication.
OV
Sense
UV
Sense
Input Section
Analog and Interface Integrated Circuits
4.2-18
Output Section
Motorola Master Selection Guide
Supervisory Circuits
(continued)
Undervoltage Sensing Circuit
MC34064P-5, D-5
TA = 0° to +70°C, Case 29,751
MC33064P-5, 0-5
TA = -40° to +85°C, Case 29, 751
MC34164P-3,P-5,0-3,0-5
TA
=0° to +70°C, Case 29, 751
Pin numbers in
parenthesis
are for the
D suffix package.
MC33164P-3, P-5, 0-3, 0-5
TA = -40° to +85°C, Case 29,751
The MC34064 and MC34164 are two families of
undervoltage sensing circuits specifically designed for use as
reset controllers in microprocessor-based systems. They
offer the designer an economical solution for low voltage
detection with a single external resistor. Both parts feature a
trimmed bandgap reference, and a comparator with precise
thresholds and built-in hysteresis to prevent erratic reset
operation.
The two families of undervoltage sensing circuits taken
together, cover the needs of the most commonly specified
power supplies used in MCU/MPU systems. Key parameter
specifications of the MC34164 family were chosen to
complement the MC34064 series. The table summarizes
critical parameters of both families. The MC34064 fulfills the
needs of a 5.0 V ± 5% system and features a tighter hysteresis
specification. The MC34164 series covers 5.0 V ± 10% and
3.0 V ± 5% power supplies with significantly lower power
consumption, making them ideal for applications where
extended battery life is required such as consumer products
or hand held equipment.
Applications include direct monitoring of the 5.0 V MPUI
logic power supply used in appliance, automotive, consumer,
and industrial equipment.
The MC34164 is specifically designed for battery powered
applications where low bias current (1/25th of the MC34064's)
is an important characteristic.
Table 13. Undervoltage Sense/Reset Controller Features
MC34X64 devices are specified to operate from 0° to +70°C and MC33X64 devices operate from -40° to +85°C
Device
Standard
Power
Supply
Supported
Typical
Threshold
Voltage
(V)
Typical
Hysteresis
Voltage
(V)
Minimum
Output
Sink
Current (mA)
Power
Supply
Input
Voltage
Range (V)
MC34064IMC33064
5.0V±5%
4.6
0.02
10
1.0to 10
MC34164/MC33164
5.0V±10%
4.3
0.09
7.0
1.0 to 12
3.0V±5%
2.7
0.06
6.0
1.0 to 12
Motorola Master Selection Guide
4.2-19
Maximum
Quiescent
Input
Current
Suffix!
Package
500~
@
P-5/29
Vin=5.0V
0-5/751
20~
@
P-5/29
Vin=5.0V
0-51751
15~
@
P-3129
Yin = 3.0 V
0-31751
Analog and Interface Integrated Circuits
Supervisory Circuits
(continued)
Universal Voltage Monitor
MC34161P, D
TA
MC33161P, D
=0° to +70°C, Case 626,751
TA =-40° to +85°C, Case 626, 751
The MC34161, MC33161 series are universal voltage
monitors intended for use in a wide variety of voltage sensing
applications. These devices offer the circuit designer an
economical solution for positive and negative voltage
detection. The circuit consists of two comparator channels
each with hysteresis, a unique Mode Select Input for channel
programming, a pinned out 2.54 V reference, and two open
collector outputs capable of sinking in excess of 10 mAo Each
comparator channel can be configured as either inverting or
noninverting by the Mode Select Input. This allows over,
under, and window detection of positive and negative
voltages. The minimum supply voltage needed for these
devices to be fully functional is 2.0 V for positive voltage
sensing and 4.0 V for negative voltage sensing.
Applications include direct monitoring of positive and
negative voltages used in appliance, automotive, consumer,
and industrial equipment.
• Unique Mode Select Input Allows Channel Programming
• Over, Under, and Window Voltage Detection
• Positive and Negative Voltage Detection
• Fully Functional at 2.0 V for Positive Voltage Sensing and
4.0 V for Negative Voltage Sensing
• Pinned Out 2.54 V Reference with Current Limit Protection
• Low Standby Current
• Open Collector Outputs for Enhanced Device Flexibility
Vref
Mode
Select
Input 1
Input 2
TRUTH TABLE
Mode Select
Pin7
Input 1
Pin 2
Output 1
Pin6
Input 2
Pin3
Output 2
PinS
GND
0
1
0
0
Channels 1 & 2: Noninverting
1
1
0
1
Vref
0
1
0
1
0
1
1
0
Channell: Noninverting
Channel 2: Inverting
0
1
1
0
1
1
0
Channels 1 & 2: Inverting
'0
VCC (>2.0 V)
Comments
POSITIVE AND NEGATIVE OVERVOLTAGE DETECTOR
InputVS2
Gnd
Output
Voltage
Pins 5, 6
Vee
LED ''On'
Gnd
-VSl
I
I
I
I
VS2
tllJI
--------'
Analog and Interface Integrated Circuits
4.2-20
Motorola Master Selection Guide
Battery Management Circuits
Battery Charger ICs
Battery Fast Charge Controller
MC33340D
TA = -25° to +85°C, Case 751
The MC33340 is a monolithic controllC that is specifically
designed as a fast charge controller for Nickel Cadmium
(NiCd) and Nickel Metal Hydride (NiMH) batteries. This device
features negative slope voltage detection as the primary
means for fast charge termination. Accurate detection is
ensured by an output that momentarily interrupts the charge
current for precise voltage sampling. An additional secondary
backup termination method can be selected that consists of
either a programmable time or temperature limit. Protective
features include battery over- and undervoltage detection,
latched over temperature detection, and power supply input
undervoltage lockout with hysteresis. Provisions for entering
De
Vee 8
Input
Motorola Master Selection Guide
a rapid test mode are available for enhanced end product
testing. This device is available in an economical 8 lead
surface mount package.
• Negative Slope Voltage Detection
• Accurate Zero Current Battery Voltage Sensing
• Programmable 1 to 4 Hour Fast Charge Time Limit
• Programmable Over/Under Temperature Detection
• Battery Over- and Undervoltage Fast Charge Protection
• Rapid System Test Mode
• Power Supply Input Undervoltage Lockout with
Hysteresis
• Operating Voltage Range of 3.0 V to 18 V
4.2-21
Analog and Interface Integrated Circuits
Battery Charger ICs
(continued)
Power Supply
Battery Charger
Regulation Control Circuit
MC33341P, D
TA =-40° to +85°C, Case 626, 751
The MC33341 is a monolithic regulation control circuit that
is specifically designed to close the voltage and current
feedback loops in power supply and battery charger ,
applications. This device features the unique ability to perform
source high-side, load high-side, source low-side, and load
low-side current sensing, each with either an internally fixed
or externally adjustable threshold. The various current
sensing modes are accomplished by a means of selectively
using the internal differential amplifier, inverting amplifier, or a
direct input path. Positive voltage sensing is performed by an
internal voltage amplifier. The voltage amplifier threshold is
internally fixed and can be externally adjusted in all low-side
current sensing applications. An active high drive output is
provided to directly interface with economical optoisolators for
isolated output power systems. This device is available in
8 lead dual-in-line and surface mount packages.
Drive Output
8
Current Sense
Input A
Analog and Interface Integrated Circuits
• Differential Amplifier for High-Side Source and Load
Current Sensing
• Inverting Amplifier for Source Return Low-Side Current
Sensing
• Noninverting Input Path for Load Low-Side Current
Sensing
• Fixed or Adjustable Current Threshold in all Current
Sensing Modes
• Positive Voltage Sensing in all Current Sensing Modes
• Fixed Voltage Threshold in all Current SenSing Modes
• Adjustable Voltage Threshold in all Low-Side Current
SenSing Modes
• Output Driver Directly Interfaces with Economical
Optoisolators
• Operating Voltage Range of 2.3 V to 18 V
Current Sense Input BI
Voltage Threshold Adjust
6
Voltage Sense
Input
Compensation
Gnd
Current
Threshold Adjust
4.2-22
5
Motorola Master Selection Guide
Battery Pack ICs
1 to 4 Cells Lithium Battery Safety IC
MC33344DW
TA
=-40° to +85°C, Case 751 D
The MC33344 is a Lithium Battery Safety Integrated Circuit
designed to control the charge and discharge voltage safety
limits of one to four lithium-ion or lithium polymer
rechargeable cells. This device is designed to be placed inside
the battery pack together with the cells and other external
components, to form a smart battery pack. Its main purpose
is to ensure safe battery pack charging and discharging.
The circuit also protects the integrity of the Li-ion cells. In
effect, it avoids the degradation of the cells in case of
overdischarge by causing the battery pack to go in a zero
current SLEEPMODETM state. This state interrupts any further
leakage of the cells.
Integrated into the MC33344 are two seriesed N-FETs
designed to interrupt the battery charge or discharge current.
• Precision Cell Voltage Measurement with an Accuracy
of 1.0%
• Programmable Voltage and Current Limits
• Automatic Cell Balancing for Optimization of the Charge
of each Cell
Protection Features:
• Zero Current Sleepmode in Order to Avoid the
Degradation of a Cell in the Event of an Undervoltage
Condition
• Overvoltage and Undervoltage Cell Protection
• Overcurrent Protection during Charge and Discharge
Designed for Smart Battery Pack Integration:
• Surface Mount 20 Pin Package
• On-Chip Series N-FETs capable of up to 1.5 A Load
Current
Charge Control:
• Fully programmable for 1 to 4 Lithium-Ion (Li-ion) or
Lithium-Polymer Rechargeable Cells
Ref
Gnd
Motorola Master Selection Guide
Test
Prog1
4.2-23
Prog2
Charge Pump
Output Pin
Analog and Interface Integrated Circuits
Battery Pack ICs
(continued)
1 to 4 Cells Lithium Battery Safety IC
MC33345DTB
TA
=-40° to +85°C, Case 948E
The MC33345 is a Lithium Battery Safety Integrated Circuit
designed to control the charge and discharge voltage safety
limits of one to four lithium-ion or lithium polymer
rechargeable cells. This device is designed to be placed inside
the battery pack together with the cells and other external
components, to form a smart battery pack. Its main purpose
is to ensure safe battery pack charging and discharging.
The circuit also protects the integrity of the Li-ion cells. In
effect, it avoids the degradation of the cells in case of
overdischarge by causing the battery pack to go in a zero
current SLEEPMODpM state. This state interrupts any further
leakage of the cells.
• Precision Cell Voltage Measurement with an Accuracy
of 1.0%
• Programmable Voltage and Curre'lt Limits
• Automatic Cell Balancing for Optimization of the Charge
of each Cell
Protection Features:
• Zero Current Sleepmode in Order to Avoid the
Degradation of a Cell in the Event of an Undervoltage
Condition
• Overvoltage and Undervoltage Cell Protection
• Overcurrent Protection during Charge and Discharge
Charge Control:
Designed for Smart Battery Pack Integration:
• Fully programmable for 1 to 4 Lithium-Ion (Li-ion) or
Lithium-Polymer Rechargeable Cells
• Low Profile 20 Pin Surface Mount Package
Pack +
Over Charge
RC
Over Discharge
RD
VCC
cell 4
V3
cell 3
V2
cell 2
V19-+~
cell 1
Ref
Gnd
Analog and Interface Integrated Circuits
Test
Prog 1 Prog 2
4.2-24
Charge Pump
Output Pin
Motorola Master Selection Guide
MOSFET/IGBT Drivers
High Speed Dual Drivers
(Inverting)
(Noninverting)
MC34151P,D
MC34152P,D
TA = 0° to +70°C, Case 626, 751
TA
MC33151P,D
TA
=0° to +70°C, Case 626, 751
MC33152P,D
=-40° to +85°C, Case 626, 751
TA = -40° to +85°C, Case 626,751
Vcc
These two series of high speed dual MOSFET driver ICs
are specifically designed for applications requiring low current
digital circuitry to drive large capacitive loads at high slew
rates. Both series feature a unique undervoltage lockout
function which puts the outputs in a defined low state in an
undervoltage condition. In addition, the low "on" state
resistance of these bipolar drivers allows significantly higher
output currents at lower supply voltages than with competing
drivers using CMOS technology.
The MC34151 series is pin--compatible with the MMH0026
and DS0026 dual MOS clock drivers, and can be used as
drop-in replacements to upgrade system performance. The
MC34152 noninverting series is a mirror image of the inverting
MC34151 series.
These devices can enhance the drive capabilities of first
generation switching regulators or systems designed with
CMOSnTL logic devices. They can be used in dc-to-dc
converters, motor controllers, capacitor charge pump
converters, or virtually any other application requiring high
speed operation of power MOSFETs.
Logic
Input A
Drive
Output A
Logic
InputB
Drive
OutputB
Single IGBT Driver
MC33153P,D
TA =-40° to +105°C, Case 626, 751
The MC33153 is specifically designed to drive the gate of
an IGBT used for ac induction motors. It can be used with
discrete IGBTs and IBGT modules up to 100 A.
Typical applications are ac induction motor' control,
brushless dc motor control, and uninterruptable power
supplies.
These devices are available in dual-in-line and surface
mount packages and include the following features:
• High Current Output Stage: 1.0 A Source - 2.0 A Sink
• Protection Circuits for Both Conventional and
SenselGBTs
• Current Source for Blanking Timing
• Protection Against Overcurrent and Short Circuit
• Undervoltage Lockout Optimized for IGBT's
• Negative Gate Drive Capability
Motorola Master Selection Guide
Current
Sense
Input
Kelvin
2 Gnd
Blanking
Desatirat
8 opm
Input
4.2-25
Gate
Drive
5 Ouptut
Analog and Interface Integrated Circuits
Power Supply Circuits Package Overview
I
CASE 29
P,ZSUFFIX
CASE 221A
T, KCSUFFIX
CASE 314D
TSUFFIX
CASE 369
DT-1 SUFFIX
CASE 646
PSUFFIX
CASES 648, 648C
N, P, P2 SUFFIX
,
•
•
•
CASE 314A
TH SUFFIX
,
,. ,
•
• •
#-
CASE 751A
D SUFFIX
CASE 751B
D SUFFIX
#
CASE 751K
DSUFFIX
CASE 751N
DWSUFFIX
CASE 936
D2TSUFFIX
CASE 936A
D2TSUFFIX
Analog and Interface Integrated Circuits
,.
CASE 369A
DTSUFFIX
CASE 626
N, P, P1 SUFFIX
CASE 707
N SUFFIX
CASE 751
D, D1 SUFFIX
CASE 751D
DWSUFFIX
CASE 751G
DWSUFFIX
CASE 775
FN SUFFIX
CASE 873A
FB SUFFIX
•
CASE 948B
DTB SUFFIX
4.2-26
CASE 314B
TV SUFFIX
•
•
•
..
CASE 948E
DTB SUFFIX
Motorola Master Selection Guide
Power/Motor Control Circuits
In Brief ...
Page
With the expansion of electronics into more and more
mechanical systems, there comes an increasing demand for
simple but intelligent circuits that can blend these two
technologies. In the past, the task of power/motor control
was once accomplished with discrete devices. But today this
task is being performed by bipolar IC technology due to cost,
size, and reliability constraints. Motorola offers integrated
circuits designed to anticipate the requirements for both
simple and sophisticated control systems, while providing
cost effective solutions to meet the needs of the applications.
Motorola Master Selection Guide
Power Controllers .............................. 4.3-2
Zero Voltage Switch . . . . . . . . . . . . . . . . . . . . . . . . .. 4.3-2
Zero Voltage Controller .. . . . . . . . . . . . . . . . . . . . .. 4.3-3
High-Side Driver Switch ...................... 4.3-4
Motor Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.3-4
Brushless DC Motor Controllers ............... 4.3-4
Closed Loop Brushless Motor Adapter .. . . . . . . .. 4.3-7
DC Servo Motor Controller/Driver .............. 4.3-8
Stepper Motor Driver .... . . . . . . . . . . . . . . . . . . . .. 4.3-9
Universal Motor Speed Controller ............. 4.3-10
Triac Phase Angle Controller ................. 4.3-11
Package Overview ............................ 4.3-12
4.3-1
Analog and Interface Integrated Circuits
Power Controllers
An assortment of battery and ac line-operated controllCs for specific applications are shown. They are designed to enhance
system performance and reduce complexity in a wide variety of control applications.
Zero Voltage Switch
CA3059
TA = -40° to +85°C, Case 646
This device is designed for thyristor control in a variety of
ac power switching applications for ac input voltages of
24 V, 120 V, 208/230 V, and 227 V @ 50160 Hz.
• Protection Circuit (CA3059 only) - A built-in circuit may
be actuated, if the sensor opens or shorts, to remove the
drive circuit from the external triac.
• Limiter-Power Supply - Allows operation directly from
an ac line.
• Differential "On"/"Off" Sensing Amplifier - Tests for
condition of external sensors or input command signals.
Proportional control capability or hysteresis may be
implemented.
• Inhibit Capability (CA3059 only) - Thyristor firing may
be inhibited by the action of an internal diode gate.
• High Power DC Comparator Operation (CA3059 only)
- Operation in this mode is accomplished by connecting
Pin 7 to 12 (thus overriding the action of the
zero-crossing detector).
• Zero-Crossing Detector - Synchronizes the output
pulses to the zero voltage point of the ac cycle.
Eliminates RFI when used with resistive loads.
• Triac Drive - Supplies high current pulses to the external
power controlling thyristor.
AC
Input
Voltage
'NTCSensor
NOTE: Shaded Area Not Included with CA3079.
Analog and Interface Integrated Circuits
Gnd
~------------------------~~--~
4.3-2
Motorola Master Selection Guide
Power Controllers
(continued)
Zero Voltage Controller
UAA1016B
TA = -20° to +1 OO°C, Case 626
This device is designed to drive triacs
with the Zero Voltage technique which
allows RFI free power regulation of
resistive loads. They provide the following
features:
• Proportional Temperature Control Over
an Adjustable Band
220VAC
Temp
Set
Rt
"b
Vref
• Adjustable Burst Frequency (to Comply
with Standards)
• Sensor Fail-Safe
• No DC Current Component Through the
Main Line (to Comply with Standards)
• Negative Output Current Pulses (Triacs
Quadrants 2 and 3)
Load
(NTC)
Temp
Sensor
R3
"b
• Direct AC Line Operation
VAC
• Low External Components Count
Zero Voltage Controller
UAA2016P, D
TA
=-20° to +S5°C, Case 626, 751
The UAA2016 is designed to drive triacs
with the Zero Voltage technique which
allows RFI free power regulation of
resistive loads. Operating directly on the ac
power line, its main application is the
precision regulation of electrical heating
systems such as panel heaters or irons.
A built-in digital sawtooth waveform
permits proportional temperature regulation
action over a ±1 °C band around the set point.
For energy savings there is a programmable
temperature reduction function, and for
security, a sensor failsafe inhibits output
pulses when the sensor connection is
broken. Preset temperature (Le., defrost)
application is also possible. In applications
where high hysteresis is needed, its value
can be adjusted up to 5°C around the set
point. All these features are implemented
with a very low external cornponent count.
Sense Input
Temperature
Reduction
Hysteresis
Adjust
Voltage
Reference
• Zero Voltage Switch for Triacs, up to
2.0 kW (MAC212AS)
• Direct AC Line Operation
• Proportional Regulation of Ternperature
over a 1°C Band
• Programmable Temperature Reduction
• Preset Temperature (Le., Defrost)
• Sensor Failsafe
• Adjustable Hysteresis
• Low External Component Count
Motorola Master Selection Guide
4.3-3
Analog and Interface Integrated Circuits
Power Controllers
(continued)
High-Side Driver Switch
MC3399T,
TJ
=-40
0
ow
to +150°C, Case 3140, 751G
The MC3399T is a high side driver
switch that is designed to drive loads from
the positive side of the power supply. The
output is controlled by a TTL compatible
Enable pin. In the "on" state, the device
exhibits very low saturation voltages for
load currents in excess of 750 mAo The
device also protects the load from positive
or negative-going high voltage transients
by becoming an open circuit and isolating
the transient for its duration from the load.
The MC3399T is fabricated on a Power
BiMOS process which combines the best
features of Bipolar and MOS technologies.
The mixed technology provides higher gain
PNP output devices and results in Power
Integrated Circuits with reduced quiescent
current.
50n
Motor Controllers
This section contains integrated circuits designed for cost effective control of specific motor families. Included are controllers
for brushless, de servo, stepper, and universal type motors.
Brushless DC Motor Controllers
controllers. These ICs provide a choice of control functions
which allow many system features to be easily implemented
at a fraction of the cost of discrete solutions. The following
table summarizes and compares the features of Motorola's
brush less motor controllers.
Advances in magnetic materials technology and integrated
circuits have contributed to the unprecedented rise in
popularity of brush less dc motors. Analog control ICs are
making the many features and advantages of brushless
motors available at a much more economical price. Motorola
offers a family of monolithic integrated brushless dc motor
Table 1. Features Summary for Motorola Brushless DC Motor Controllers
Operating
Voltage Range
(V)
..
iii
E
:!l!0 ..
.cc
al
~:::I
.. j
"1:1"
Output
Drivers
~
ii~~
C"I:I
ai'S
~~
~8
Vee
Ve
Co
:::I...J
".c
.5cn
MC33033
10-30
-
v'
v'
v'
MC33035
10-40
10-30
v'
v'
v'
Device
Analog and Interface Integrated Circuits
l5~f
~!'g :I
~jjjif
60°/300°
and
120°/240°
~
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H
:::Ic
Ow
E
E .. :Ii!
"_0
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8.- a.
~.f!!!. 08~
.."
C
f!
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a.
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c~
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el
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...
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<60
uu
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:::10
!
~=a
I~~
:::I.e-
"U
"Iii>
;a~
.5~ 1fc5 ~
~
..
1D.5
1!S-
Suffix!
Package
v'
v'
v'
v'
Noninv.
Only
v'
-
-
-
P1738,
DWI751D
v'
v'
v'
v'
Noninv.
and Inv.
v'
v'
v'
v'
P1724,
DW1751E
4.3-4
Motorola Master Selection Guide
Motor Controllers
(continued)
MC33033P, OW
TA
=-40° to +85°C, Case 738, 751 D
Because of its low cost, the MC33033 can efficiently be
used to control brush dc motors as well as brush less. A brush
dc motor can be driven using two of the three drive output
phases provided in the MC33033, while the Hall sensor input
pins are selectively tied to Vref or ground. Other features such
as forward/reverse, output enable, speed control, current
limiting, undervoltage lockout and internal thermal shutdown
will still remain functional.
The MC33033 is a lower cost second generation brushless
dc motor controller which has evolved from the full featured
MC33034 and MC33035 controllers. The MC33033 contains
all of the active functions needed to implement a low cost open
loop motor control system. This IC has all of the key control
and protection functions of the two full featured devices with
the following secondary features deleted: separate
drive-circuit supply and ground pins, the brake input, and the
fault output signal. Like its MC33035 predecessor, the
MC33033 has a control pin which allows the user to select
60°/300° or 120°/240° sensor electrical phasings.
r----...,
L ___ _
Motor
vcco---<>-
Speed Set
l
Faster
RT
CT
Motorola Master Selection Guide
4.3-5
Analog and Interface Integrated Circuits
Motor Controllers
(continued)
MC33035P, OW
TA = -40° to +85°C, Case 724, 751 E
60°/300° or 120°/240° sensor electrical phasings, and access
to both inverting and noninverting inputs of the current sense
comparator. The earlier devices had two part numbers which
were needed to support the different sensor phasings, and the
inverting input to the current sense comparator was internally
grounded. All of the control and protection features of the
MC33034 are also provided in the MC33035.
The MC33035 is a second generation high performance
brush less dc motor controller which contains all of the active
functions required to implement a full featured open loop
motor control system. While being pin-{;ompatible with its
MC33034 predecessor, the MC33035 offers additional
features at a lower price. The two additional features provided
by the MC33035 are a pin which allows the user to select
----,
~----lT~iiiiiiiiiiiiiiiiiiiiiiiiiiiiii~~~~~~nJ~i
~~~I
L
I
I
I
I
I
I
____ J
Motor
Speed Set
i
Faster
Analog and Interface Integrated Circuits
4.3-6
Motorola Master Selection Guide
Motor Controllers
(continued)
Closed Loop Brushless Motor Adapter
MC33039P,D
TA = -40° to +85°C, Case 626, 751
detectors, a programmable monostable, and an internal shunt
regulator. Also included is an inverter output for use in systems
that require conversion of sensor phasing. Although this
device is primarily intended for use with the MC33033/35
brushless motor controllers, it can be used cost effectively in
many other closed loop speed control applications.
The MC33039 is a high performance close loop speed
control adapter specifically designed for use in brush less dc
motor control systems. Implementation will allow precise
speed regulation without the need for a magnetic or optical
tachometer. These devices contain three input buffers each
with hysteresis for noise immunity, three digital edge
Vcc
il>A
To Rotor
Position
Sensors
fout
il>B
il>C
Gnd
Motorola Master Selection Guide
4.3-7
Analog and Interface Integrated Circuits
Motor Controllers
(continued)
DC Servo Motor Controller/Driver
MC33030P,
ow
TA = -40° to +85°C, Case 648C, 751G
A monolithic dc servo motor controller providing all active
functions necessary for a complete closed loop system. This
device consists of an on-chip op amp and window comparator
with wide input common mode range, drive and brake logic
with direction memory, a power H switch driver capable of
1.0 A, independently programmable over current monitor and
shutdown delay, and over voltage monitor. This part is ideally
suited for almost any servo positioning application that
requires sensing of temperature, pressure, light, magnetic
flux, or any other means that can be converted to a voltage.
Motor
Vee
Feedback
Position
Vee
Reference
Position
Analog and Interface Integrated Circuits
4.3-8
Motorola Master Selection Guide
Motor Controllers
(continued)
Stepper Motor Driver
MC3479P, FN
TA = 0° to +70°C, Case 648C, 775
SAA1042AV
TA = -30° to +125°C, Case 648C
These Stepper Motor Drivers provide up to 500 mA of drive
per coil for two phase 6.0 V to 24 V stepper motors. Control
logic is provided to accept commands for clockwise, counter
clockwise and half or full step operation. The MC3479 has an
added Output Impedance Control (OIC) and a Phase A drive
state indicator (not available on SAA1042 devices).
ClK
l2
CW/CCW
Vo
l3
Full/Half
Step
l4
OIC'
Phase A'
Bias/Set
Gnd
, MC3479 Only
Motorola Master Selection Guide
4.3-9
Analog and Interface Integrated Circuits
Motor Controllers
(continued)
Universal Motor Speed Controller
TDA108SC, CD
TA
=-10° to +120°C, Case 648, 7518
The TDA 1085C is a phase angle triac controller having all
the necessary functions for universal motor speed control in
washing machines. It operates in closed loop configuration
and provides two ramp possibilities.
• Soft Start
• Load Current Limitation
• Tachogenerator Circuit Sensing
• On-Chip Frequency to Voltage Converter
• Direct Supply from AC Line
• On-Chip Ramps Generator
• Security Functions Peformed by Monitor
(I)
'"<=
(I)
en
"0
(I)
(I)
Cl.
en
;m
.2'
0
~
"OJ
0
Cl.
§
"0
"0
"en
"en
OJ
en
(I)
(I)
~
D-
0
(I)
(I)
Q;
'Eo
.~
80
:::;
1:
(I)
~~
~~
""'
0
a::g
~
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(!)
::;:
il:
Analog and Interface Integrated Circuits
0>
.~
i=
.9
~
(I)
<=
(I)
(!)
Cl.
E
OJ
a:
4.3-10
.~
15
.l!!
en
Cl.
0
.3
"0
~
0
·1
1:
OJ
~
0
.<=
en
Cl.
0
i
en
Q;
<=
<=
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15
.!O:!
0
.<=
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15
e
0
<=
e
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~
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(I)
~
0
Motorola Master Selection Guide
Motor Controllers
(continued)
Triac Phase Angle Controller
TDA1185A
TA
=0° to + 70°C, Case 646
This device generates controlled triac triggering pulses and
allows tach less speed stabilization of universal motors by an
integrated positive feedback function.
• Triac Current Sensed to Allow Inductive Loads
• Low Cost External Components Count
• Low Power Consumption: 1.0 mA
• Soft-Start
• Power Failure Detection and General Circuit Reset
• Optimum Triac Firing (2nd and 3rd Quadrants)
• Repetitive Trigger Pulses when Triac Current is
Interrupted by Motor Brush Bounce
Motorola Master Selection Guide
4.3-11
Analog and Interface Integrated Circuits
Power/Motor Control Circuits Package Overview
•
~
CASE 3140
TSUFFIX
CASE 626
B, PSUFFIX
CASE 646
- • #
CASE 724
PSUFFIX
CASE 738
PSUFFIX
CASE 7510
OW SUFFIX
OW SUFFIX
Analog and Interface Integrated Circuits
~
CASE 751
o SUFFIX
•
CASE 751E
CASE 751G
OW SUFFIX
4.3-12
,
CASE 648, 648C
P, V SUFFIX
CASE 751B
o SUFFIX
•
CASE 775
FN SUFFIX
Motorola Master Selection Guide
Voltage References
In Brief ...
Page
Precision Low Voltage References . . . . . . . . . . . . . . .. 4.4-2
Package Overview ............................. 4.4-2
Motorola's line of precIsion voltage references is
designed for applications requiring high initial accuracy, low
temperature drift, and long term stability. Initial accuracies of
±1.0%, and ±2.0% mean production line adjustments can be
eliminated. Temperature coefficients of 25 ppm/oC max
(typically 10 ppm/oC) provide excellent stability. Uses for the
references include D/A converters, AID converters,
precision power supplies, voltmeter systems, temperature
monitors, and many others.
Motorola Master Selection Guide
4.4-1
Analog and Interface Integrated Circuits
Precision Low Voltage References
A family of precision low voltage bandgap reference devices designed for applications requiring low temperature drift.
Table 1. Precision Low Voltage References
Vout
(V)
Typ
1.235± 12 mV
1.235±25 mV
-400 to +85°C
Regline
(mY)
Max
Regload
(mY)
Max
LM285Z-1.2
(Note 1)
1.0
(Note 2)
10
(mA)
Max
ppm/"C
Max
0° to +70°C
20
80Typ
LM385BZ-1.2
LM385Z-1.2
LM385BZ-2.5
LM385Z-2.5
LM285Z-2.5
-
Voutfl'
2.5±38mV
2.5±75 mV
Device
25
MC1403A
40
MC1403
5.0±50 mV
40
MC1404P5
-
6.25±60 mV
40
MC1404P6
-
10±100mV
40
MC1404P10
-
50Typ
TL431C, AC, BC
TL431I, AI, BI
2.5±25mV
2.5 to 37
10
100
Package
Z,D
2.0
(Note 3)
3.014.5
(Note 4)
10
(Note 5)
D
P
6.0
(Note 6)
Shunt Reference
Dynamic Impedance
(z)';;0.5Q
LP,P,D
Notes: 1. Micropower Reference Diode Dynamic Impedance (z) S 1.0 n at IR = 100 ~A.
2. 10!lA SIR S 1.0 mA.
3. 20!lA S IR S 1.0 mAo
4.4.5 V S Vin S 15 VI15 V S Vin S 40 V.
5.0 mA ~ IL ~ 10 mA.
6. (VOU! + 2.5 V) ~ Vin ~ 40 V.
Voltage References Package Overview
I
CASE 29
LP,ZSUFFIX
Analog and Interface Integrated Circuits
~
~
CASE 626
PSUFFIX
CASE 751
DSUFFIX
4.4-2
Motorola Master Selection Guide
Data Conversion
In Brief ...
Page
Motorola's line of digital-te-analog and analog-to-digital
converters include several well established industry
standards.
The AID converters have 7 and B-bit flash converters
suitable for NTSC and PAL systems, CMOS has 8 to 1O-bit
converters, as well as other high speed digitizing applications.
The D/A converters have 6 and 8-bit devices, video
speed (for NTSC and PAL) devices, and triple video DAC
with on-board color palette for color graphics applications.
Motorola Master Selection Guide
Data Conversion ...............................
A-D Converters .............................
CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Bipolar. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Sigma-Delta .............................
D--A Converters .............................
CMOS ...................................
Sigma-Delta .............................
Package Overview .............................
4.5-1
4.5-2
4.5--2
4.5--2
4.5--2
4.5--2
4.5--3
4.5-3
4.5--3
4.5--4
Analog and Interface Integrated Circuits
Data Conversion
The line of data conversion products which Motorola offers
spans a wide spectrum of speed and resolution/accuracy.
Features, including bus compatibility, minimize extemal parts
count and provide easy interface to microprocessor systems.
Various technologies, such as Bipolar and CMOS, are utilized
to achieve functional capability, accuracy and production
repeatability. Bipolar technology generally results in higher
speed, while CMOS devices offer greatly reduced power
consumption.
Table 1. A-D Converters
Device
Nonlinearity
Max
Conversion
Time/Rate
Input
Voltage
Range
Supplies
(V)
Temperature
Range
('C)
MC145040
±1/2 LSB
1Ol-'S
OtoVDD
+5.0±10%
-40 to +125
Resolution
(Bits)
Suffix!
Package
Comments
CMOS
8
MC145041
MC14549B/
MC14559B
P/738,
DW/751D
Includes Internal
Clock, 11-Ch MUX
2Ol-'S
Successive Approximation
Registers
+3.0 to +18
-40 to +85
P/648
Triple
8-Bit
MC44251
1 LSB
18MHz
1.6to 4.6 V
+5.0±10%
-40 to +85
FN1777
10
MC145050
±1 LSB
211-'s
OtoVDD
+5.0±10%
-40 to +125
P/738,
DW/7510
MC145051
Requires External
Clock, 11-Ch MUX
Compatible with
MC1408 SAR.
8-bit D-A Converter
3 Separate Video
Channels
Requires External
Clock, 11-Ch MUX
Includes Internal
Clock, 11-Ch MUX
441-'s
P/646,
0/751 A
MC145053
8-10
MC14443/
MC14447
±0.5%
Full Scale
300I-'S
Variable
w/Supply
+5.0 to +18
3-1/2 Digit
MC14433
±0.05%
±1 Count
40 ms
±2.0V
±200mV
+5.0 to +8.0
-2.8to-8.0
MC10319
±1 LSB
25 MHz
MC145073
±1 LSB
48 kHz
-40 to +85
Includes Internal
Clock, 5-Ch MUX
I-'P Compatible,
P/648 ,
DW1751G Single Slope,
6-Ch MUX
P/709,
DW1751E
Dual Slope
o to +70
P/709,
DW/751F
Die Form
Video Speed Flash
Converter, Internal
Gray Code
TTL Outputs
-40 to +85
DW/751E
Dual Channel,
Sigma-Delta
architecture
Bipolar
8
Oto 2.0 Vpp
+5.0 and
-3.0to-6.0
Max
Sigma-Delta
16
Analog and Interlace Integrated Circuits
1.9Vpp
4.5-2
4.5 to 5.5
Motorola Master Selection Guide
Table 2. O-A Converters
Device
Accuracy
@25"C
Max
Max
Settling
Time
(± 112 LSB)
Supplies
(V)
Temperature
Range
eC)
MC144110
-
-
+5.0 to +15
o to +85
MC144111
-
-
MC144112
-
-
+2.5 to +5.5
MC44200
±1/2 LSB
30 ns
16,18,20
MC145074
See data
sheet
-
MC145076
See data
sheet
Resolution
(Bits)
Suffix!
Package
Comments
CMOS
6
Triple
8-Bit
P/707,
DW/751D
Serial input, Hex DAC,
6 outputs
P/646,
DW/751G
Serial input, Quad DAC,
4 outputs
-40 to +85
P/646,
D/751 A
Serial input, Quad DAC,
4 outputs
+5.0
±10%
-40 to +85
FU/824A
Triple Video DAC,
55 MHz, TTL
6.0 ns
4.5 to 5.5
-40 to +85
D/751B
Dual Channel,
Sigma-Delta architecture,
MC145076 FIR Filter
available
-
+5.0
-40 to +85
D/751 B
Dual Channel Bit Stream,
144 tap FIR Filter
Sigma-Delta
Motorola Master Selection Guide
4.5-3
Analog and Interface Integrated Circuits
Data Conversion Package Overview
•
-
'"
~
CASE 709
PSUFFIX
CASE 707
PSUFFIX
CASE 751A
DSUFFIX
CASE 751B
DSUFFIX
CASE 751F
DWSUFFIX
CASE 751G
DWSUFFIX
Analog and Interface Integrated CircuHs
CASE 649
PSUFFIX
CASE 648
PSUFFIX
CASE 646
PSUFFIX
CASE 751D
DWSUFFIX
•
CASE 777
FN SUFFIX
4.5-4
-
CASE 738
PSUFFIX
CASE 751E
DWSUFFIX
•
CASE 824A
FUSUFFIX
Motorola Master Selection Guide
Interface Circuits
In Brief ...
Page
Described in this section is Motorola's line of interface
circuits, which provide the means for interfacing with
microprocessor or digital systems and the external world, or
to other systems.
Also included are devices which allow a microprocessor
to communicate with its own array of memory and peripheral
I/O circuits.
The line drivers, receivers, and transceivers permit
communication between systems over cables of several
thousand feet in length, and at data rates of up to several
megahertz. The common EIA data transmission standards,
several European standards, IEEE-488, and IBM 360/370
are addressed by these devices.
The peripheral drivers are designed to handle high
current loads such as relay coils, lamps, stepper motors, and
others. Input levels to these drivers can be TTL, CMOS, high
voltage MOS, or other user defined levels. The display
drivers are designed for LCD or LED displays, and provide
various forms of decoding.
Motorola Master Selection Guide
Enhanced Ethernet Transceiver .................. 4.6-2
High Performance Decoder Driver/Sink Driver . . . . .. 4.6-3
ISO 8802-3[IEEE 802.3]1 OBASE-T Transceiver ... 4.6-3
Hex EIA-485 Transceiver with
Three-State Outputs ... . . . . . . . . . . . . . . . . . . . . . . .. 4.6-4
5.0 V, 200 M-BitlSec PR-IV Hard Disk
Drive Read Channel ........................... 4.6-5
Line Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
EIA Standard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
Line Drivers ................................... 4.6-7
EIA Standard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
Line Transceivers . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-7
EIA-232-E/V.28 CMOS Drivers/Receivers ...... 4.6-8
Peripheral Drivers ........................... 4.6-8
IEEE 802.3 Transceivers ...................... 4.6-8
Read/Write Channel ............................ 4.6-8
Drive Read Channel. . . . . . . . . . . . . . . . . . . . . . . . .. 4.6-8
CMOS Display Drivers .......................... 4.6-9
Package Overview ............................ 4.6-10
4.6-1
Analog and Interface Integrated Circuits
Enhanced Ethernet Transceiver
MC68160FB
TA
= 0° to +70°C, Case 8480
The MC68160 Enhanced Ethernet Interface Circuit is a
BiCMOS device which supports both IEEE 802.3 Access Unit
Interface (AUI) and 10BASE-T Twisted Pair (TP) Interface
media connections through external isolation transformers. It
encodes NRZ data to Manchester data and supplies the
signals which are required for data communication via
10BASE-T or AUI interfaces. The MC68160 gluelessly
interfaces to the Ethernet controller contained in the MC68360
Quad Integrated Communications Controller (QUICC) device.
The MC68160 also interfaces easily to most other
industry-standard IEEE 802.3 LAN controllers. Prior to
twisted pair data reception, Smart Squelch circuitry qualifies
input signals for correct amplitude, pulse width, and sequence
requirements.
RX~--------------~nM~amnCtcM~s~te9rlr
RCLK
Decoder
1+--------------1
ARX+
MFILT .....- - - - - - - - - - - '
ARX-
~~~~~~~~L~~Y---------j
RXLED
RENA_
CLLED
ACX+ w
ACX-
-1
w CLSN .....; = = = ; - - -.......
~TXLED
ATX-
~ TE~~ ~===-.l.rMaiiCheSrterl
~
ATX+
:5
c(
Xt
Twisted
Pair
Polarity
Error
Control
X2 :
TCLK ...f - - - - - -
CSt
CSOIj
CS2
TPEN
APORT
TPAPCE
TPSQEL
TPFULDL
LOOP
~a:
....w~
Mode
Select
TPJABB
Analog and Interface Integrated Circuits
TPTX+ TPTX-
TPLIL
4.6-2
TPSQEL
TPRX-
TPRX+ TPPLR
Motorola Master Selection Guide
High Performance Decoder Driver/Sink Driver
K1
MC34142DW, FN
~to-----------.
..r-,--I:-:;O-::::-:::-:""-~
+H
I
Data In
I
15 I
F..;..UI_ID..,l<:JH-__- t1 Duplex Mode
17'
Select
"I
Duplex Mode
Select
lNKFl H
!
.
VCC .JO\,.J
~t 12!
Collision Test
IITTLICMOS
Collision
Detect TTL/CMOS
Outputs
t
-. I
I
'--
-II Jabber
CI k
Li~o~~::--
,........,
I
OSci~l~tor
TTL/CMOS
41
~Signal
Quality
Error
I 14
I
r- I
•
Gnd
Motorola Master Selection Guide
10 MHz
4.6--3
13 JABB H
I
I
I 22 SQE EN l
TTL/CMOS
I+--t>o-----~
I
L--71-r_19r5-----2&~23~r--------.J
ANA
DIG
CLI(~ !I~t! ClK- ClK
Gnd -=
-= Gnd
20 pF fff 20 pF Out
PWR
SIA
CTlH
b-'''-----.j
TTL/CMOS
~
Link Fail Disable
2knl
-+I
Collision
Announcement
Full Duplex Disable
TXENH
I 4
....---. RX.j
t~ IRX1_61
t
c..s.D~~)l
_
loop l
lOOP:
Back Test
VCC
loop Back
Test Select
5.0 V
~
Duplex
Mode
Select
Analog and Interface Integrated Circuits
Hex EIA-485 Transceiver with Three-State Outputs
MC340S8IS9FTA .
TA = 0° to +70°C, Case 932
The Motorola MC3405819 Hex Transceiver is composed of
six driver/receiver combinations designed to comply with the
EIA-485 standard. Features include three-state outputs,
thermal shutdown for each driver, and current limiting in both
directions. This device also complies with EIA-422 and
CCITT Recommendations V.11 and X.27.
The devices are optimized for balanced multipoint bus
transmission at rates to 20 MBPS (MC34059). The driver
outputsireceiver inputs feature a wide common mode voltage
range, allowing for their use in noisy environments. The
current limit and thermal shutdown features protect the
devices from line fault conditions.
The MC34058/9 is available in a space saving 7.0 mm 48
lead surface mount quad package designed for optimal heat
dissipation.
DE6
• Meets EIA-485 Standard for Party Line Operation
• Meets EIA-422A and CCITT Recommendations V.11 and
X.27
• Operating Ambient Temperature: O°C to +70°C
• Common Mode Driver Output/Receiver Input Range: -7.0
to +12 V
• Positive and Negative Current Limiting
• Transmission Rates to 14 MBPS (MC34058) and 20
MBPS (MC34059)
• Driver Thermal Shutdown at 150°C Junction Temperature
• Thermal Shutdown Active Low Output
• Single +5.0 V Supply, ±10%
• Low Supply Current
• Compact 7.0 mm 48 Lead TQFP Plastic Package
• Skew Specified for MC34059
RE6
DRS
RES
DES
Gnd
36 Gnd
Gnd
35 OAS
OA6
34 OBS
OB6
DR4
DR1
0A4
OA1
OB4
OB1
DE4
DE1
29 RE4
RE1
28 OB3
OB2
10
27 OA3
0A2
11
26 Gnd
Gnd
12
25 Gnd
Gnd
Gnd
Analog and Interface Integrated Circuits
DE2
RE2
RE3
4.~
TSD
Gnd
Motorola Master Selection Guide
5.0 V, 200 M-BitlSec PR-IV Hard Disk Drive Read Channel
MC34250FTA
TA = 0° to +70°C, Case 840F
The Motorola MC34250 is a fully integrated partial
response maximum likelihood disk drive read/write channel
for use in zoned recording applications. This device integrates
the AGC, active filter, 7 tap equalizer, Viterbi detector,
frequency synthesizer, servo demodulator, 8/9 rate (0,4/4)
Encoder/Decoder with write precompensation and power
management in a single 64 pin 10 mm x 10 mm TQFP
package.
• Programmable Asymmetrical Boost of Up to ±40% of
Nominal Filter Group Delay in Both Data and Servo
Modes
FEATURES:
• Fast Acquisition Data Phase locked loop with Zero
Phase Restart
• 7 Tap Continuous Time Transversal Equalizer with 8 Bit
Programmable Tap Weights and Integrated Decision
Directed Sign-Sign least Mean Squared Adaptation
• Internal Offset Cancellation loops
• 50 to 200 MBPS Programmable Data Rate
• Programmable Data Phase locked loop Charge Pump
Current
• 800 mW at 200 MBPS and 5.0 V
• Channel Monitor Output
• Integrated Soft Decision Viterbi Detectors with
Programmable Merge References
• Programmable AGC Charge Pump Currents with
Different Values for Data and Servo Envelope Modes and
Gain Gradient Mode
• Integrated 8/9 Rate (0,4/4) Encoder and Decoder with
Code Scrambler and Descrambler
• Programmable AGC Peak Detector Droop Currents with
Different Values for Data and Servo Envelope Modes
• Programmable 214/8 Bit NRZ Data Interface
• Programmable Write Precompensation Delays locked to
the Frequency Synthesizer
• Separate AGC Charge Pump Outputs for Data and Servo
Modes
• Differential PECl Write Data Outputs
• Programmable Dual Threshold Qualifier or Hysteresis
Comparator Type Pulse Detector for Servo Data
Detection.
• External Write Data Path for DC Erase or Other
Non-Encoded Data
• ERD and Polarity Outputs for Servo Timing and Raw
Encoded Data
• Integrated Write Current DAC
• Integrated 7 pole 0.05° Equiripple Linear Phase Filter with
Programmable Bandwidth from 5.0 MHz to 80 MHz and
Different Values for Both Data and Servo Modes
• Bi-Directional Serial Microprocessor Interface
• Programmable Power Management
• Various Test Modes Controlled Via the Serial
Microprocessor Interface
• Programmable Symmetrical Boost from 0 to 10 dB and
Different Values for Data and Servo Modes
Motorola Master Selection Guide
4.6-5
Analog and Interface Integrated Circuits
»
:J
(f)
!!!.
:g
0
'".,
<
0
Gl
(f)
:z
]23
O
:J
C-
.,~
(f)
(f)
:D
0
.-
m
'"
'"
-u
s::
ttl
ttl
:D
:D
(f)
(f)
(f)
:IJ(J")cn-l-l
CD
ttl
(f)
(f)
:D
(II
b
:D
.....
~
.....
~ ~ .....
-u
~
<:D;gS2Q I
~
I
CDATA~ Mux
CSRVO
8/9 (0,4/4) ENDEC
Synchronization
Byte Detect
h
SYNCDET ~
NRZ(7:0)
C
NRZCLK
~.
READGT
WRITEGT :D
CD
WRITECLK I»
...
C.
0
:::r
I»
::l
::l
Write
Precompensation
SLEEPB U
s:
~
aiii"
s:
irn
I
I
~I
FREF~
Power
Manager
Fre:J,Uency
Synt esizer
g
~
Mode
0
:J
G)
"c:
CD
I
(f)
(f)
I
I
-<
:z
.....
-n
-u
-<
:z
.....
-n
s::
WDATAM
SLATCH
ZoneClk
WCDAC
Data
MCU Interface
J~
::;:
0
z
I
CD
::;:
0
(f)
m
:z
(f)
m
:E
:D
:::;
m
~
c;-
0
:::J
S·
r:::
Coefficients
CD
ii)
g..
WDATAP
tj:gSDATA
SCLK
CD
.s
Line Receivers
Table 1. EIA Standard
S= Single
Ended
D= Differential
Type
of
Output
tprop
Delay
Time
Max (ns)
Party
Line
Operation
Strobe
or
Enable
Power
Supplies
(V)
S
TP
4000
-
-
+5.0
R(1)
85
-
-
MC1489
MC1489A
TP
30
V
V
AM26LS32
PC/648
AM26LS31
MC3486
P/648,
D/751B
MC3487
SN75173
SN75175
N/648,
D/751B
MC75174B
S,D
35
Device
Suffix!
Package
MC14C89B,
AB
P/646,
D/751 A
Receivers
Per
Package
Companion
Drivers
MC1488
MC14C88B
4
Comments
EIA-232-DI
EIA-562
EIA-232-D
EIA-422/423
EIA-422/4231
485
(1) R = Resistor Pull-up, TP = Totem-pole output.
Line Drivers
Table 2. EIA Standard
Output
Current
Capability
(mA)
t prop
Delay
Time
Max (ns)
S= Single
Ended
D= Differential
Party
Line
Operation
Strobe
or
Enable
Power
Supplies
(V)
85
35
D
V
V
+5.0
48
20
15
3500
10
350
60
300
-
S
EIA422 t/
EIA423 -
SID
Device
Suffix!
Package
Drivers
Per
Package
MC75174B
P/648
4
MC3487
P/648,
D1751B
AM26LS31
PC/648
MC26LS31
D1751B
±7.0to
±12
MC14C88B
P/646,
D1751 A
±9.0to
±12
MC1488
±5.0
AM26LS30
PC/648
MC26LS30
D1751B
2 (422)
4(423)
Companion
Receivers
Comments
SN75173
SN75175
EIA-485
MC3486
AM26LS32
EIA-422
with 3-state
outputs
MC14C89B
MC14C89AB
EIA-232-DI
EIA-562
MC1489
MC1489A
EIA-232-D
AM26LS32
MC3486
EIA-422or
EIA-423
Switchable
Table 3. Line Transceivers
Driver
Prop
Delay
(Max ns)
Receiver
Prop
Delay
Max (ns)
20
30
23
23
DE=Driver
Enable
RE =Receiver
Enable
DE,RE
Party
Line
Operation
Power
Supplies
V
+5.0
(V)
Device
MC34050
Drivers
Per
Package
Receivers
Per
Package
D1751B,
P/648
2
2
EIA-4221423
Suffix!
Package
EIA
Standard
DE
MC34051
DE,RE
MC34058
FTAl932
6
6
EIA-485
to 14MBPS
MC34059
FTAl932
6
6
EIA-485
to 20 MBPS
Motorola Master Selection Guide
4.6-7
Analog and Interface Integrated Circuits
Table 4. EIA-232-EIV.28 CMOS Drivers/Receivers
Device
MC145403
MC145404
Suffix!
Package
pn38,
DWn51D
Pins
Drivers
Receivers
Power
SuppUes(V)
20
3
5
±5.0to±12
MC145405
4
4
5
3
MC145406
P/648,
DWn51G,
SD/940B
16
MC145407
pn38,
DWn51D
20
MC145408
pn24,
DWn51E,
SD/940B
24
5
5
±5.0 to±12
MC145583
DWn51F,
VF/940J
28
3
5
+3.3 to +5.0
MC145705
pn38,
DWn51D
20
2
3
+5.0
pn24,
DWn51E
24
MC145706
MC145707
Features
3
+5.0
Charge Pump
On-board ring monitor circuit;
charge pump, power down
Charge Pump, Power Down
2
3
3
Table 5. Peripheral Drivers
Output
Current
Capability
(rnA)
500
Input
Capability
Propagation
Delay Time
Max (Ils)
Output
Clamp
Diode
Off State
Voltage
Max (V)
TTL,CMOS
1.0
V
50
6.0Vt015V
MOS
Device
ULN2803
Drivers
Per
Package
Suffix!
Package
Logic
Function
8
An07
Invert
7
P/648,
Dn51B
ULN2804
TTl,5.0V
CMOS
MC1413, B
(UlN2003A)
8.0Vt018V
MOS
MC1416,B
(UlN2004A)
Table 6. IEEE 802.3 Transceivers
Device
Power
Supply
MC34055
+5.0Vdc
Suffix!
Package
10 BaseT
NRZ
IEEE
Transmit and
Receive over
4 Pins
Raised
ECl,
CMOS
802.3 Type
10BaseT
Transceiver with non-return to zero (NRZ)
interface. Intended for but not restricted to
concentrators and repeator applications.
DW/751E
TTl,CMOS
802.3 Type
10BaseTI
AUI/NRZ
Interfaces gluelessly to Motorola's MC68360
communications controller.
FBl848D
MC68160
Comments
ReadIWrite Channel
Table 7. Hard Disk Drive Read Channel
Device
MC34250
Power
Supply
5.0V
Comments
200 Mbps fully integrated partial response maximum likelihood hard disk
drive read/write channel which equalizes to a PR-IV shape and uses 8/9
rate (0, 4/4) coding.
Analog and Interface Integrated Circuits
4.6-8
TA
(DC)
Suffix!
Package
Oto+70
FTAl840F
Motorola Master Selection Guide
CMOS Display Drivers
range of end equipment such as instruments, automotive
dashboards, home computers, appliances, radios and clocks.
These CMOS devices include digit as well as matrix drivers
for LEOs, LCOs, and VFOs. They find applications over a wide
Table 8. Display Drivers
Display Type
LCD
(Direct Drive)
MuxedLCD
(1/4 Mux)
LED,
Incandescent,
Fluorescent(l )
Muxed LED
(l/4Mux)
Muxed LED
(1/5 Mux)
Input Format
Drive Capability
Per Package
On-Chip
Latch
Display Control
Segment Drive
Current
Device
Parallel BCD
7 Segments
V
Blank
=1.0mA
MC14543B
Blank, Ripple Blank
MC14544B
20 !JA
MC145453
Serial Binary
[Compatible with the
Serial Peripheral
Interface (SPI) on
CMOS MCUsj
33 Segments
or Dots
48 Segments
or Dots
=200 !JA
MC145000
Parallel BCD
7 Segments
MC145001
44 Segments
or Dots
Blank, Lamp Test
25 rnA
Serial Binary
[Compatible with the
Serial Peripheral
Interface (SPI) on
CMOS MCUsj
4 Digits +
Decimals
-
Blank
65 rnA
MC14547B
V
Oscillator
(Scanner)
50 rnA
(Peak)
MC14499
Oscillator (Scanner),
Low Power Mode,
Dimming
Ot035mA
(Peak)
Adjustable
MC14489
10mA(2)
MC14495-1
-
MC14558B
5 Characters +
Decimals or 25
Lamps
LED
(Direct Drive)
Parallel Hex
7 Segments +
A thru F Indicator
(Interfaces to
Display Drivers)
Parallel BCD
7 Segments
MC14511B
MC14513B
Blank, Ripple Blank,
Lamp Test
-
Ripple Blank,
Enable
(1) Absolute maximum working voltage = 18 V.
(2) On--<:hip current-limiting resistor.
Table 9. Functions
Device
MCl4489
Function
Package
Multi-Character LED Display/Lamp Driver
738,7510
648,751G
MC14495-1
Hexadecimal-to-7 Segment Latch/Decoder ROM/Driver
MC14499
4-Digit 7-Segment LED Display Decoder/Driver with Serial Interface
707,7510
MC14511B
BCD-to-7-Segment Latch/Decoder/Driver
648,751G
MC14513B
BCD-to-7-Segment Latch/Decoder/Driver with Ripple Blanking
MC14543B
BCD-to-7-Segment Latch/Decoder/Driver for Liquid Crystals
620,648
MC14544B
BCD-to-7-Segment Latch/Decoder/Driver with Ripple Blanking
726, 707
MC14547B
High-Current BCD-to-7-Segment Decoder/Driver
620,648
MC14558B
BCD-to-7-Segment Decoder
620,648
726,707
MC145000
48-Segment Serial Input Multiplexed LCD Driver (Master)
709, 776
MC145001
44-Segment Serial Input Multiplexed LCD Driver (Slave)
707, 776
MC145453
33-Segment, Non-Multiplexed LCD Driver with Serial Interface
711,777
Motorola Master Selection Guide
4.6-9
Analog and Interface Integrated Circuits
Interface Circuits Package Overview
- • - - - CASE 620
CASE 646
P SUFFIX
CASE 648
N, P, PC SUFFIX
CASE 707
A SUFFIX
CASE 709
PSUFFIX
CASE 724
PSUFFIX
CASE 726
CASE 738
PSUFFIX
CASE 711
PSUFFIX
CASE 751A
o SUFFIX
CASE 7510
OW SUFFIX
CASE 751B
o SUFFIX
• •
• •
CASE 751E
OW SUFFIX
CASE 751G
OW SUFFIX
CASE 776
FNSUFFIX
CASE 777
FNSUFFIX
CASE 8480
FB SUFFIX
CASE 932
FTASUFFIX
CASE 940B
SO SUFFIX
Analog and Interface Integrated Circuits
•
4.6-10
CASE 751F
OW SUFFIX
•
CASE 840F
FTASUFFIX
CASE 940J
VFSUFFIX
Motorola Master Selection Guide
Communication Circuits
In Brief . ..
RF
Page
RF Communications ................................... 4.7-2
Wideband IFs ...................................... 4.7-2
Wideband Single Conversion Receivers ............... 4.7-2
Narrowband Single Conversion Receivers ............. 4.7-2
Narrowband Dual Conversion Receivers ............... 4.7-3
Universal Cordless Phone Subsystem ICs ............. 4.7-3
Transmitters ....................................... 4.7-3
Balanced Modulator/Demodulator ..................... 4.7-4
Infrared Transceiver ................................ 4.7-4
Telecommunications .................................. 4.7-11
Subscriber Loop Interface Circuit .................... 4.7-11
PBX Architecture (Analog Transmission) .............. 4.7-12
PCM Mono-Circuits ............................ 4.7-12
Dual Tone Multiple Frequency Receiver ............ 4.7-15
ISDN Voice/Data Circuits ........................... 4.7-15
Integrated Services Digital Network ............... 4.7-15
Second Generation U-Interface Transceivers ...... 4.7-16
Second Generation SIT-Interface Transceivers ..... 4.7-16
Dual Data Link Controller ........................ 4.7-17
Voice/Data Communication (Digital Transmission) ...... 4.7-18
Universal Digital Loop Transceiver . . . . . . . . . . . . . . .. 4.7-18
ISDN Universal Digital Loop Transceiver II ......... 4.7-19
Electronic Telephone Circuit ......................... 4.7-19
Tone Ringers ..................................... 4.7-20
Speech Networks ................................. 4.7-21
Speakerphones ................................... 4.7-25
Voice Switched Speakerphone Circuit ............. 4.7-25
Voice Switched Speakerphone with
IlProcessor Interface ........................... 4.7-27
Voice Switched Speakerphone Circuit ............. 4.7-28
Family of Speakerphone ICs ..................... 4.7-29
Telephone Accessory Circuits ....................... 4.7-30
Audio Amplifier ................................. 4.7-30
Current Mode Switching Regulator ................ 4.7-30
300 Baud FSK Modems ......................... 4.7-31
ADPCM Transcoder ............................ 4.7-31
Calling Line Identification (CLlD) Receiver ......... 4.7-32
CVSD ModulatorlDemodulator ................... 4.7-33
Summary of Bipolar Telecommunications Circuits ... 4.7-34
Phase-Locked Loop Components ...................... 4.7-36
PLL Frequency Synthesizers ........................ 4.7-36
Phase-Locked Loop Functions ...................... 4.7-37
Package Overview ................................... 4.7-39
Radio communication has greatly expanded its scope in the
past several years. Once dominated by public safety radio, the
30 to 1000 MHz spectrum is now packed with personal and low
cost business radio systems. The vast majority of this
equipment uses FM or FSK modulation and is targeted at short
range applications. From mobile phones and VHF marine
radios to garage door openers and radio controlled toys, these
new systems have become a part of our lifestyle. Motorola
Analog has focused on this technology, adding a wide array of
new products including complete receivers processed in our
exclusive 3.0 GHz MOSAIC® 1.5 process. New surface mount
packages for high density assembly are available for all of
these products, as well as a growing family of supporting
application notes and development kits.
Telephone & Voice/Data
Traditionally, an office environment has utilized two
distinctly separate wired communications systems:
telecommunications and data communications. Each had its
individual hardware components complement, and each
required its own independent transmission line system: twisted
wire pairs for Telecom and relatively high priced coaxial cable
for Datacom. But times have changed. Today, Telecom and
Datacom coexist comfortably on inexpensive twisted wire pairs
and use a significant number of components in common. This
has led to the development and enhancement of PBX (Private
Branch Exchanges) to the point where the long heralded
"office of the future," with simultaneous voice and data
communications capability at each station, is no longer of the
future at all. The capability is here today!
Motorola Semiconductor serves a wide range of
requirements for the voice/data marketplace. We offer both
CMOS and Analog technologies, each to its best advantage,
to upgrade the conventional analog voice systems and
establish new capabilities in digital communications. Early
products, such as the solid-state single--chip crosspoint
switch, the more recent monolithic Subscriber-LoopInterface Circuit (SLlC), a single--chip CodeC/Filter (MonoCircuit), the Universal Digital Loop Transceivers (UDLT),
basic rate ISDN (Integrated Services Digital Network), and
single--chip telephone circuits are just a few examples of
Motorola leadership in the voice/data area.
Motorola Master Selection Guide
4.7-1
Analog and Interface Integrated Circuits
RF Communications
Table 1. Wideband (FMlFSK) IFs
IF
Mute
RSSI
Max
Data
Rate
V
2.0Mb
Wideband Data IF, includes
datashaper
P/648,
DnS1B
10Mb
Video Speed FM IF
Dn51B
Device
Vee
ICC
Sensitivity
(Typ)
MC13055
3-12 V
25mA
20llV
40 MHz
V
MC13155
3-6 V
7.0mA
IOOIlV
250 MHz
-
Notes
Suffix!
Package
Table 2. Wideband Single Conversion Receivers - VHF
Device
Vee
ICC
Sensitivity
(Typ)
MC33S6
3-9 V
2SmA
30llV
200 MHz
10.7MHz
V
MC13156
2-£ V
5.0mA
2.01lV
500 MHz
21.4MHz
-
MC13158
2-£ V
6.0mA
RF
Input
IF
Mute
RSSI
Max
Data
Rate
Notes
V
500 kb
Includes front end mixer/L.O.
pn38,
DWn51D
CT-2 FM/Demodulator
DWn51E,
FB/873
FM IF/Demodulator with
split IF for DECT
FTB/873
>1.2Mb
Suffix!
Package
Table 3. Narrowband Single Conversion Receivers - VHF
Vee
ICC
12 dB
SINAD
Sensitivity
(Typ)
MC3357
4-8 V
5.0mA
5.01lV
MC3359
4-9 V
7.0mA
2.01lV
MC3361C
2-8 V
6.0mA
Device
RF
Input
IF
Mute
RSSI
Max
Data
Rate
45 MHz
455 kHz
V
-
>4.8kb
60 MHz
V
MC3371
Ceramic Quad
Detector/Resonator
P/648,
Dn51B
Scan output option
pn07,
DWnS1D
Lowest cost receiver
P648,
Dn51B
>4.8kb
RSSI
P/648,
Dn51B
RSSI, Ceramic Quad
Detector/Resonator
3-6 V
1.8mA
1.01lV
500 MHz
V
Suffix!
Package
>2.4 kb
MC3372, A
MC13150
Notes
>9.6 kb
Coilless Detector with
Adjustable Bandwidth
FTB/873,
FTA/977
110
dB
Analog and Interface Integrated Circuits
4.7-2
Motorola Master Selection Guide
RF Communications
(continued)
Table 4. Narrowband Dual Conversion Receivers - FM/FSK - VHF
Device
VCC
ICC
12dB
SINAD
Sensitivity
(Typ)
MC3362
2-7 V
3.0mA
0.7~V
4.0mA
0.4 ~V
MC3363
MC3335
0.7~V
MC13135
1.0~V
RF
Input
IFl
180
MHz
10.7
MHz
IF2
(Limiter
In)
Mute
RSSI
455 kHz
-
V
Data
Rate
> 4.8
kb
r---V
r----
-
Notes
Suffix!
Package
Includes buffered
VCOoutput
Pf724,
DWf751E
Includes RF
amp/mute
DWf751F
Low cost version
DWf751D,
Pf738
Voltage buffered
RSSI, LC Quad
Detector
DWf751E,
P/724
Voltage Buffered
RSSI, Ceramic
Quad Detector
MC13136
Table 5. Universal Cordless Phone Subsystem ICs
Device
VCC
ICC
MC13109
2.0--5.5 V
Active Mode
6.7mA
Inactive Mode
MC13110
2.7-5.5 V
Active Mode
8.2mA
Inactive Mode
MC13111
2.7-5.5 V
Active Mode
8.2mA
Inactive Mode
Voice
Scrambler
Low
Battery
Detect
Programmable
Rx. Tx Trim Gain
and LBO Voltage
Reference
V
-
1
-
FB/848B,
FTAl932
V
V
V
2
V
FB/848B
V
V
-
2
V
FB/848B
Dual
Conversion
Receiver
Universal
DualPLL
V
V
V
V
Compander
and Audio
Interface
Suffix!
Package
40~A
60~
60~
Table 6. Transmitters - AM/FM/FSK
MaxRF
Freq
Out
Max
Mod
Freq
Notes
Suffix!
Package
Device
VCC
ICC
Pout
MC2833
3--8 V
10mA
--30 dBm
to
+10dBm
150 MHz
50 kHz
FM transmitter. Includes two frequency
multiplier/amplifier transistors
P/648,
Df751B
MC13175
2-5 V
40mA
8.0dBm
500 MHz
5.0 MHz
AM/FM transmitter. Single frequency PLL
fout = 8 x fref, includes power down function
Df751B
MC13176
Motorola Master Selection Guide
1.0GHz
fout = 32 x fref, includes power down function
4.7--3
Analog and Interface Integrated Circuits
Table 7. Balanced Modulator/Demodulator
Device
Vce
lec
MC1496
3-5 V
lOrnA
Suffix!
Package
Function
General purpose balanced modulator/demodulator for AM, SSB, FM detection
with Carrier Balance >50 dB
P/646,
0/751 A
Table 8. Infrared Transceiver
12 dB
SINAD
Sensitivity
Device
Vee
Ice
(Typ)
MC13173
3-5 V
6.5 rnA
5.01lV
Max
IF Freq
10.7
MHz
Carr Del
RSSI
Data
Rate
V
V
200 kb
Suffix!
Package
Notes
Includes Single Frequency
PLL for Tx Carrier and Rx Lo
FTBl873
Universal Cordless Telephone Subsystem IC
Me13109FB, FTA
TA
=_40° to +85°C, Case 848B, 932
The MC131 09 integrates several of the functions required
for a cordless telephone into a single integrated circuit. This
significantly reduces component count, board space
requirements, and external adjustments. It is designed for use
in both the handset and the base.
• Dual Universal Programmable PLL
- Supports New 25 Channel U.S. Standard with No
External Switches
- Universal Design for Domestic and Foreign CT-1
Standards
- Digitally Controlled Via a Serial Interface Port
- Receive Side Includes 1st LO VCO, Phase Detector,
and 14-Bit Programmable Counter and 2nd LO with
12-Bit Counter
- Transmit Section Contains Phase Detector and 14-Bit
Counter
- MPU Clock Output Eliminates Need for MPU Crystal
• Dual Conversion FM Receiver
- Complete Dual Conversion Receiver - Antenna Input
to Audio Output 80 MHz Maximum Carrier Frequency
- RSSI Output
- Carrier Detect Output with Programmable Threshold
- Comparator for Data Recovery
- Operates with Either a Quad Coil or Ceramic
Discriminator
• Compander
• Supply Voltage Monitor
- Externally Adjustable Trip Point
• 2.0 to 5.5 V Operation with One-Third the Power
Consumption of Competing Devices
- Expandor Includes Mute, Digital Volume Control and
Speaker Driver
- Compressor Includes Mute, ALC and Limiter
Rxln---
Rx
Out
Carrier
Detect
Data
Out
Tx In
SPI
Tx Out
Low
Battery
Indicator
Tx VCO
Analog and Interface Integrated Circuits
4.7-4
Motorola Master Selection Guide
Universal Cordless Telephone Subsystem IC with Scrambler
MC13110FB
TA = -40° to +85°C, Case 848B
The MC1311 0 integrates several of the functions required
for a cordless telephone into a single integrated circuit. This
significantly reduces component count, board space
requirements, and external adjustments. It is designed for use
in both the handset and the base.
• Dual Universal Programmable PLL
- Supports New 25 Channel U.S. Standard with New
External Switches
- Universal Design for Domestic and Foreign CT-1
Standards
- Digitally Controlled Via a Serial Interface Port
- Receive Side Includes 1st LO VCO, Phase Detector,
and 14-Bit Programmable Counter and 2nd LO with
12-Bit Counter
- Transmit Section Contains Phase Detector and 14-Bit
Counter
- MPU Clock Outputs Eliminates Need for MPU Crystal
• Dual Conversion FM Receiver
- Complete Dual Conversion Receiver - Antenna In to
Audio Out 80 MHz Maximum Carrier Frequency
- RSSI Output
- Carrier Detect Output with Programmable Threshold
- Comparator for Data Recovery
- Operates with Either a Quad Coil or Ceramic
Discriminator
• Supply Voltage Monitor
- Provides Two Levels of Monitoring with Separate
Outputs
- Separate, Adjustable Trip Points
• Compander
- Expandor Includes Mute, Digital Volume Control,
Speaker Driver, 3.5 kHz Low Pass Filter, and Programmable Gain Block
- Compressor Includes Mute, 3.5 kHz Low Pass Filter,
Limiter, and Programmable Gain Block
• Frequency Inversion Scrambler/Descrambler
- Can Be Enabled/Disabled Via MPU Interface
- Programmable Carrier Modulation Frequency
• 2.7 to 5.5 V Operation with One-Third the Power
Consumption of Competing Devices
Rxln
Rx PO Out
Rx
Out
Rx PO In
Carrier
Detect
Tx In
Tx Out
Low
Battery
Indicator
Tx VCO
Motorola Master Selection Guide
4.7-5
Analog and Interface Integrated Circuits
Narrowband FM Receiver
MC13135/136P,
ow
TA = -40° to +85°C, Case 724, 751E
The MC13135 is a full dual conversion receiver with
oscillators, mixers, Limiting IF Amplifier, Quadrature
Discriminator, and RSSI circuitry. It is designed for use in
security systems, cordless phones, and VHF mobile and
portable radios. Its wide operating supply voltage range and
low current make it ideal for battery applications. The
Received Signal Strength Indicator (RSSI) has 65 dB of
dynamic range with a voltage output, and an operational
amplifier is included for a dc buffered output. Also, an
improved mixer third order intercept enables the MC13135 to
accommodate larger input signal levels.
• Complete Dual Conversion Circuitry
• Low Voltage: 2.0 to 6.0 Vdc
• RSSI with Op Amp: 65 dB Range
• Low Drain Current: 3.5 mA Typical
• Improved First and Second Mixer 3rd Order Intercept
• Detector Output Impedance: 25 n Typically
Vee
"f 0.t
..
RFin
Audio
Ol!lPut
RSSI
Output
o
Analog and Interface Integrated Circuits
4.7-6
455kHz
Quad Coil
Toko
7MC-0
vDD
V)
.----(j>--t"-:-------t--:-----:----------;-;::-=;:j-~>-=-::::;'"""--:--n-------;:::::;-~-t::>>::-::-~>t,...,.=>~>~:-?!:.,.-:::>
L
>.---".-(;14-- VDG
(Dig. Gnd
r-'........()oo- PDI/8T2
:t~::~~~~~~:l~!=l===~~~~~~~~~~Ff~~Ff~::~F=::~~
"""'.-.,-()01>---
I'
8T1
VAG
(Ana. Gnc
>'-;:::::;:!=;:t:!=t--"9">--.:>:-......--o----l~
TXO
W-~:.::~=~~>-.
RFO
RXI
,-:--'-.....,..-'::--'::-"---'--'-'"""""'"'0-- CF
~6-!:======::::!======~~--_.:.~--"'--....J.
.. >'.
_ _ .i....:. _ _ _ _ _ _ _
____
_ _ _ _ _ _ _ :.;;..i....:..i....:..:,,;,,>
..i....:.>.:.;;. _____ JI
~
~_.
(Battery)
, Indica1es Trimmed Resistor
Motorola Master Selection Guide
4.7-11
Analog and Interface Integrated Circuits
PBX Architecture (Analog Transmission)
PCM Mono-Circuits Codec-Filters (CMOS LSI)
MC145500 Series
MC145554/57/64/67
Case 648, 708, 751G, 776
The Mono-circuits perform the digitizing and restoration of
the analog signals. In addition to these important functions,
Motorola's family of pulse-code modulation mono-circuits
also provides the band-limiting filter functions - all on a single
monolithic CMOS chip with extremely low power dissipation.
The Mono-circuits require no external components. They
incorporate the bandpass filter required for antialiasing and
60 Hz rejection, the AlD-D/A conversion functions for either
U.S. Mu-Law or European A-Law companding formats, the
low-pass filter required for reconstruction smoothing, an
on-board precision voltage reference, and a variety of options
that lend flexibility to circuit implementations. Unique features
of Motorola's Mono-circuit family include wide power supply
range (6.0 to 13 V), selectable on-board voltage reference
(2.5, 3.1, or 3.8 V), and TIL or CMOS I/O interface.
Motorola supplies three versions in this series. The
MC145503 and MC145505 are general-purpose devices in
16 pin packages designed to operate in digital telephone or
line card applications. The MC145502 is the full-feature
device that presents all of the options available on the chip.
This device is packaged in a 22 pin DIP and 28 pin chip carrier
package.
Case 648, 7510, 751G, 738
These per channel PCM Codee-Filters perform the voice
digitization and reconstruction as well as the band limiting and
smoothing required for PCM systems. They are designed to
operate in both synchronous and asynchronous applications
and contain an on-chip precision voltage reference. The
MC145554 (Mu-Law) and MC145557 (A-Law) are general
purpose devices that are offered in 16 pin packages. The
MC145564 (Mu-Law) and MC145567 (A-Law), offered in 20
pin packages, add the capability of analog loop-back and
push-pull power amplifiers with adjustable gain.
All four devices include the transmit bandpass and receive
lowpass filters on-chip, as well as active RC pre-filtering and
post-filtering. Fully differential analog circuit design assures
lowest noise. Performance is specified over the extended
temperature range of -40° to +85°C.
These PCM Codec-Filters accept both industry standard
clock formats. They also maintain compatibility with
Motorola's family of MC3419/MC33120 SLiC products.
Txl------,
TOC
- Tx
+ Tx
TOE
TOO
VAG
CCI
MSI
RXO
RSI
Vref
RxG ....- -.....
ROD
RxO
VSSVOO-
Analog and Interface Integrated Circuits
MC145480P, OW, SO
Case 738, 7510, 940C
This 5.0 V, general purpose per channel PCM Codec-Filter
offers selectable Mu-Law or A-Law companding in 20 pi n 01 P,
SOG and SSOP packages. It performs the voice digitization
and reconstruction as well as the band limiting and smoothing
required for PCM systems. It is deSigned to operate in both
synchronous and asynchronous applications and contains an
on-chip precision reference voltage (1.575 V).
The transmit bandpass and receive lowpass filters, and the
active RC pre-filtering and post-filtering are incorporated, as
well as fully differential analog circuit design for lowest noise.
Push-pull 300 n power drivers with external gain adjust are
also included.
The MC145480 PCM Codec-Filter accepts a variety of
clock formats, including short-frame sync, long-frame sync,
IDL, and GCI timing environments. This device also maintains
compatibility with Motorola's family of Telecom products,
including the
MC145472
U-Interface Transceiver,
MC145474175 SIT-Interface Transceiver, MC145532
ADPCM Transcoder, MC145422126 UDLT-I, MC145421/25
UDLT-II, and MC3419/MC33120 SLiC.
RCE
----
ROC
POI
MulA
VLS
4.7-12
Motorola Master Selection Guide
PBX Architecture (continued)
MC14LC5540P, OW, FU
Case 710, 751F, 873
The MC14LC5540 ADPCM Codec is a single chip
implementation of a PCM Codec-Filter and an ADPCM
encoder/decoder, and therefore provides an efficient solution
for applications requiring the digitization and compression of
voiceband signals. This device is designed to operate over a
wide voltage range, 2.7 V to 5.25 V, and as such is ideal for
battery powered as well as ac powered applications. The
MC14LC5540 ADPCM Codec also includes a serial control
port and internal control and status registers that permit a
microcomputer to exercise many built-in features.
The ADPCM Codec is designed to meet the 32 kbps
ADPCM
conformance
requirements
of
CCITT
Recommendation G.721 (1988) and ANSI T1.301 (1987). It
also meets ANSI T1.303 and CCITT Recommendation G.723
for 24 kbps ADPCM operation, and the 16 kbps ADPCM
standard, CCITT Recommendation G.726. This device also
meets the PCM conformance specification of the CCITT
G.714 Recommendation.
Figure 25. MC14LC5540 ADPCM Codec Block Diagram
Motorola Master Selection Guide
4.7-13
Analog and Interface Integrated Circuits
PBX Architecture (continued)
MC145537EVK
ADPCM Codec Evaluation Kit
The MC145537EVK is the primary tool for evaluation and
demonstration of the MC14LC5540 ADPCM Codec. It
provides the necessary hardware and software interface to
access the many features and operational modes of the
MC14LC5540 ADPCM Codec.
• Provides Stand Alone Evaluation on Single Board
• The kit provides Analog-ta-Analog, Analog-to-Digital or
Digital-to-Analog Connections - with Digital Connections
being 64 kbps PCM, 32 or 24 kbps ADPCM, or 16 kbps
CCITT G.726 or Motorola Proprietary ADPCM
• +5.0 V Only Power Supply, or 5.0 V Plus 2.7 to 5.25 V
Supply
• Easily Interfaced to Test Equipment, Customer System,
Second MC145537EVK or MC145536EVK (5.0 V Only)
for Full Duplex Operation
• Convenient Access to Key Signals
• Piezo Loudspeaker
• EIA-232 Serial Computer Terminal Interface for Control
of the MC14LC5540 ADPCM Codec Features
• Compatible Handset Provided
• Schematics, Data Sheets, and User's Manual Included
Figure 26. MC145537EVK Block Diagram
+5.0 V
- r-
-Gnd
r-
+3.0 V
--
I~I~I~I
Piezo
Speaker
Clock Generation
Circuitry
I
1
5.0 V/3.0 V
Level Shift
I
MC145407
EIA-232 Driver/Receiver
1
Analog
Interface
MC14LC5540
ADPCMCodec
Analog and Interface Integrated Circuits
CIocks
EI A-232
I
SCI
3.0 V/5.0 V
Level Shift
5.0 V/3.0 V
4.7-14
MC68HC705C8
Microcontrolier
Motorola Master Selection Guide
PBX Architecture (continued)
MC145536EVK
ISDN Voice/Data Circuits
Codeo-Filter/ADPCM Transcoder Evaluation Kit
The MC145536EVK is the primary tool for evaluation and
demonstration of the MC145480 Single +5.0 V supply PCM
Codeo-Filter and the MC145532 ADPCM Transcoder (see
"Telephone Accessory Circuits"). The MC145536EVK
provides the necessary hardware needed to evaluate the
many separate operating modes under which the MC145480
and MC145532 are intended to operate.
• Provides Stand Alone Evaluation on a Single Board
• Easily Interfaced to Test Equipment, Customer System,
or Second MC145536EVK
• Convenient Access to Key Signals
• Generous Wire-Wrap Area for Application Development
• The kit provides Analog-to-Analog, Analog-to-Digital, or
Digital-to-Analog Connections - with Digital Connections
Being 64 kbps PCM; 32, 24, or 16 kbps
Motorola Proprietary ADPCM
• Compatible Handset Included
• Schematics, Data Sheets, and User's Manual included
r--------------,
I
I
I
I
I
I
Clocks
Analog
Interlace
Digital
Interlace
I
I
___________ _
IL _
MC145536EVK
Integrated Services Digital Network
ISDN is the revolutionary concept of converting the present
analog telephone networks to an end-to-end global digital
network. ISDN standards make possible a wide variety of
services and capabilities that are revolutionizing
communications in virtually every industry.
Motorola's ISDN product family includes the MC14LC5472
and MC145572 U-Interface Transceivers, the MC145474/75
and MC145574 SIT-Interface Transceivers, MC145488 Dual
Data Link Controller, and the MC68302 Integrated
Multi-Protocol Processor. These are supported by a host of
related devices including the MC145480 +5.0 V PCM
Codeo-Filter, MC145532 ADPCM Transcoder, MC14LC5540
ADPCM Codec, MC145500 family of single-chip
codec/filters, MC145436A DTMF Decoder, MC33120
Subscriber.Loop Interface Circuit, MC34129 Switching Power
Supply Controller, and the MC145406/07 CMOS EIA 232-E
Driverl Receiver family.
Motorola's key ISDN devices fit into four ISDN network
applications: a digital subscriber line card, an NT1 network
termination, an ISDN terminal adapter, and an ISDN terminal.
Digital subscriber line cards are used in central offices, remote
concentrators, channel banks, T1 multiplexers, and other
switching equipment. The NT1 network termination block
illustrates the simplicity of remote U- to SIT-interface
conversion. The ISDN terminal adapter and ISDN terminal
block show how Motorola ICs are used to combine voice and
data in PC compatible boards, digital telephones, and other
terminal equipment. Expanded applications such as a PBX
may include these and other Motorola ISDN circuits. Many
"non-ISDN" uses, such as pairgain applications, are
appropriate for Motorola's ISDN devices as well.
Dual Tone Multiple Frequency Receiver
MC145436AP,
ow
Case 646, 751G
This device contains the filter and decoder for detection of
a pair of tones conforming to the DTMF standard with outputs
in hexadecimal. Switched capacitor filter technology is used
together with digital circuitry for the timing control and output
circuits. The MC145436A provides excellent power-line noise
and dial tone rejection.
Replaces MC145436P, OW.
Motorola Master Selection Guide
4.7-15
Analog and Interface Integrated Circuits
ISDN Voice/Data Circuits (continued)
standard maintenance channel functions. This flexible feature
also allows for easy implementation of proprietary
maintenance functions.
Second Generation
U-Interface Transceivers
MC145572PB
MC145572FN
Second Generation
SIT-Interface Transceivers
Case 777
MC145574PB
The MC145572 fully conforms to ANSI T1.601-1992, the
North American standard for ISDN Basic Access on a single
twisted-wire pair. The transceiver achieves a remarkable 10-7
bit error rate performance on all ANSI specified test loops with
worst-case impairments present. The state-of-the-art 0.65
micron single-chip solution uses advanced design techniques
to combine precision analog signal processing elements with
three digital signal coprocessors to build an adaptively
equalized echo cancelling receiver.
Two modes of handling U-interface maintenance functions
are provided on the MC145572.ln the automatic maintenance
mode the U-interface transceiver handles all ANSI specified
maintenance and channel procedures internally to minimize
your software development effort. Automatic procedures
include generating and monitoring the cyclic redundancy
check, reporting and counting far end block errors (near end
block errors too), handling the ACT and DEA bits, as well as
monitoring and appropriately responding to embedded
operations channel messages.
The MC145572 has 275 mW maximum power dissipation.
It also has an enhanced TDM interface that supports an
on-chip timeslot assigner, GCI and IDL modes of operation.
The optional manual maintenance mode lets you choose
an inexpensive microcontroller, such as a member of
Motorola's MC68HC05 family, to control and augment the
Case 736B
Case 842D
MC145488
DDLC
TA
MC145574
SCP
IDL
MC145574DW
Case 837A
The MC145574 Srr-Interface Transceivers provide a
CCITT 1.430 compatible interface for use in line card, network
termination, and ISDN terminal equipment applications.
Manufactured with Motorola's advanced 0.65 micron CMOS
mixed analog and digital process technology, the MC145574 is
a physical layer device capable of operating in point-to--point
or poinHo-multipoint passive bus arrangements. In addition,
the MC145574 implements the optional NT1 Star topology, NT
terminal mode and TE slave mode.
This
device
features
outstanding
transmission
performance. It reliably transmits over 1 kilometer in a
point-to-point application. Comparable performance is
achieved in all other topologies as well. Other features include
pin selectable terminal or network operating modes, industry
standard microprocessor serial control port, full support of the
multiframing Sand Q channels, a full range of loopbacks, and
low power CMOS operation, with a maximum power
consumption of 90 mW.
The MC145574 has an enhanced TDM interface that
supports GCI, IDL and an on-chip timeslot assigner.
NT1
MC145574
MC145572
GCI
SfT
SIT
Chip
U
Chip
LT
MC145572
IDL
U
Chip
C
SCP
NT1fTA
e
r
a
I
SfT
Chip
MC68302
LT
MC145572
MC145572
IDL
U
Chip
RS232
Analog and Interface Integrated Circuits
o
SCP
4.7-16
f
f
I
c
e
SCP
Motorola Master Selection Guide
ISDN Voice/Data Circuits
(continued)
Dual Data Link Controller
MC14LC5494EVK
U-Interface Transceiver Evaluation Kit discontinued
MCl45488FN
Case 779
The MC145488 features two full-duplex serial HDLC
channels with an on--chip Direct Memory Access (DMA)
controller. The DMA controller minimizes the number of
microprocessor interrupts from the communications
channels, freeing the microprocessor's resources for other
tasks. The DMA controller can access up to 64 kbytes of
memory, and transfers either 8-bit bytes or 16-bit words to or
from memory. The MC145488 DDLC is compatible with
Motorola's MC68000 and other microprocessors.
In a typical ISDN terminal application, one DDLC
communications channel supports the D--channel (LAP D)
while the other supports the B--channel (LAPS). While the
DDLC is ideally suited for ISDN applications, it can support
many other HDLC protocol applications as well.
Some of the powerful extras found on the DDLC include
automatic abort and retransmit of D--channel collisions in
SIT-interface applications, address recognition, automatic
recovery mechanisms for faulty frame correction, and several
system test modes. Address recognition provides a reduction
in the host microprocessor load by filtering data frames not
addressed to the host. The DDLC can compare either SAPI or
TEl fields of LAPD frames. For LAPD (Q.921) applications,
both A and S addresses may be checked.
MC145572EVK
U-Interface Transceiver Evaluation Kit
This kit provides the hardware and software to evaluate the
many configurations under which the MC145572EVK is able
to operate. Used as a whole, it operates as both ends of the
two-wire U interface that extends from the customer premises
(NT1) to the switch line card (LT). The two halves of the b.o~rd
can be physically and functionally separated, providing
independent NT1 and LT evaluation capability.
The kit provides the ability to interactively manipulate
status registers in the MC145572EVK U-Interface transceiver
or in the MC145474n5 SIT-Interface transceiver with the aid
of an external terminal. The device can also be controlled
using the MC68302 Integrated Multiprotocol Processor
application development system to complete a total Sasic
Rate ISDN evaluation solution.
2B1Q U-lnterface
SIT
Interface
IDL.-
NTI Side
IDL
SIT-Interface
Transceiver
I
MC145474
I
__ -.J
1"" - -SCP
LT Side
U-Interface
Transceiver
MCI45572FN
SCP
Gated
Clocks
L---..!f----t---J.. SCP
MCI45572EVK
Motorola Master Selection Guide
4.7-17
Analog and Interface Integrated Circuits
UDLTs utilize a 256 kilobaud Modified Differential Phase
Shift Keyed (MDPSK) burst modulation technique for
transmission to minimize radio frequency, electromagnetic,
and crosstalk interference. Implementation through CMOS
technology takes advantage of
low-power operation,
increased reliability, and the proven capabilities to perform
complex telecommunications functions.
Voice/Data Communication
(Digital Transmission)
2-Wire Universal Digital Loop
Transceiver (UDLT)
MC145422P,
ow Master Station
Case 708, 751 E
MC145426P, OW Slave Station
Case 708, 751E
The UDLT family of transceivers allows the use of existing
twisted-pair telephone lines (between conventional
telephones and a PBX) for the transmission of digital data.
With the UDLT, every voice-only telephone station in a PBX
system can be upgraded to a digital telephone station that
handles the complex voice/data communications with no
increase in cabling costs.
In implementing a UDLT-based system the AID to D/A
conversion function associated with each telset is relocated
from the PBX directly to the telset. The SLiC (or its equivalent
circuit) is eliminated since its signaling information is
transmitted digitally between two UDLTs.
The UDLT master-slave system incorporates the
modulation/demodulation functions that permit data
communications over a distance up to 2 kilometers. It also
provides the sequence control that govems the exchange of
information between master and slave. Specifically, the master
resides on the PBX line card where it transmits and receives
data over the wire pair to the telset. The slave is located in the
telset and interfaces the mono--circuit to the wire pair. Data
transfer occurs in 1Q-bit bursts (8 bits of data and 2 signaling
bits), with the master transmitting first, and the slave responding
in a synchronized half-duplex transmission format.
Functional Features
• Provides Synchronous Duplex 64 kbitslSecond
Voice/Data Channel and Two 8 kbits/Second Signaling
Data Channels Over One 26 AWG Wire Pair Up to 2 km.
• Compatible with Existing and Evolving Telephone Switch
Architectures and Call Signaling Schemes
• Automatic Detection Threshold Adjustment for Optimum
Performance Over Varying Signal Attenuations
• Protocol Independent
• Single 5.0 V to 8.0 V Power Supply
MC145422 Master UDLT
• 2.048 MHz Master Clock
• Pin Controlled Power-Down and Loop-Back Features
• Variable Data Clock - 64 kHz to 2.56 MHz
• Pin Controlled Insertion/Extraction of 8 kbits/Seconds
Channel into LSB of 64 kbitslSecond Channel for
Simultaneous Routing of Voice and Data Through PCM
Voice Path of Telephone Switch
MC145426 Slave UDLT
• Compatible with MC145500 Series and Later PCM
Mono-Circuits
• Automatic Power-Up/Down Feature
• On-Ghip Data Clock Recovery and Generation
• Pin Controlled 500 Hz D3 or CCITT Format PCM Tone
Generator for Audible Feedback Applications
r ______~U::::DL:.!.J_ _ _....
Signaling Input 1
r------------.-
Signaling Input 2
Line
Driver
Output
Receive Data Input
1-----_
\IaIid.Data.
1 - - - -...._
Power Down
T/R Data Clock
1-----1-- I.oop.Sack-
COnvertCi"ock - -
f-----:
I
I Enab~ _
1----- Tone Enable
XTAL In
+
Master
_Only
Slave
Only
XT~~ _ _ _ _ j_
Transmit Enable
Transmit Data
Signal Output 1
Signal Output 2
Analog and Interface Integrated Circuits
4.7-18
Motorola Master Selection Guide
Voice/Data Communication (Digital Transmission)
(continued)
2-Wire ISDN Universal Digital Loop Transceiver II (UDLT II)
MC145421 P,
ow Master
Similar to the MC145422/26 UDLT, but provide
synchronous full duplex 160 kbps voice and data
communication in a 2B + 2D format for ISDN compatibility on
a single twisted pair up to 1 km. Single 5.0 V power supply,
protocol independent.
Case 709,751 E
MC145425P, OW Slave
Case 709, 751 E
Electronic Telephone
The Complete Electronic Telephone Circuit
MC34010P, FN
TA = -20 to +60°C, Case 711,777
0
The conventional transformer-driven telephone handset is
undergoing major innovations. The bulky transformer is
disappearing. So are many of its discrete components,
including the familiar telephone bell. They are being replaced
with integrated circuits that perform all the major handset
functions simply, reliably and inexpensively ... functions such
as 2-to-4 wire conversion, DTMF dialing, tone ringing, and a
variety of related activities.
The culmination of these capabilities is the Electronic
Telephone Circuit, the MC34010. These ICs place all of the
above mentioned functions on a single monolithic chip.
These telephone circuits utilize advanced bipolar analog
(12L) technology and provide all the necessary elements of a
modem tone-dialing telephone. The MC34010 even
incorporates an MPU interface circuit for the indusion of
automatic dialing in the final system .
• DTMF generator uses low cost ceramic resonator with
accurate frequency synthesis technique
• Tone ringer drives piezoelectric transducer and satisfies
EIA-470 requirements
• Speech network provides 2-t0-4 wire conversion with
adjustable sidetone utilizing an electret transmitter
• On-chip regulator insures stable operation over wide
range of loop lengths
• 12L technology provides low 1.4 V operation and high
static discharge immunity
• Microprocessor interface port for automatic dialing features
Also Available
A broad line of additional telephone components for
customizing systems design.
• Provides all basic telephone functions, including DTMF
dialer, tone ringer, speech network and line voltage
regulator
Hook Switch
//r-~
/
Tip
Ring
MC34010
Electret
Microphone
Motorola Master Selection Guide
4.7-19
Analog and Interface Integrated Circuits
Tone Ringers
circuit MUST function when a ringing signal is provided, and
MUST NOT ring when other signals (speech, dialing, noise)
are on the line. The tone ringers described below were
designed to meet those requirements with a minimum of
external components.
The MC34012, MC34017, and MC34117 Tone Ringers are
designed to replace the bulky bell assembly of a telephone,
while providing the same function and performance under a
variety of conditions. The operational requirements spelled
out by the FCC and EIA-470, simply stated, are that a ringer
MC34012P, D
TA = -20° to +60°C, Case 626, 751
• Complete Telephone Bell Replacement
• On-Chip Diode Bridge and Transient
Protection
• Single-Ended Output to Piezo
Transducer
• Input Impedance Signature Meets Bell
and EIA Standards
• Rejects Rotary Dial and Hook Switch
Transients
• Adjustable Base Frequencies
• Output Frequency to Warble Ratio MC34012-1:80
MC34012-2:160
MC34012-3:40
Ring >------<:H!::F-<..........
MC34017P, D
TA = -20° to +60°C, Case 626, 751
• Complete Telephone Bell Replacement
• On-Chip Diode Bridge and Transient
Protection
• Differential Output to Piezo Transducer
for Louder Sound
• Input Impedance Signature Meets Bell
and EIA Standards
• Rejects Rotary Dial and Hook Switch
Transients
• Output Frequency to Warble Ratio MC34017-1:80
MC34017-2:160
MC34017-3:40
Analog and Interface Integrated Circuits
Ring
"">-----<
Pieza
Sound
Element
4.7-20
Motorola Master Selection Guide
Tone Ringers
(continued)
MC34217P, D
TA = -20° to +60°C, Case 626, 751
•
•
•
•
•
•
•
•
•
Complete Telephone Bell Replacement
On-Chip Diode Bridge
Internal Transient Protection
Differential Output to Piezo Transducer
for Louder Sound
Input Impedance Signature Meets Bell
and EIA Standards
Rejects Rotary Dial and Hook Switch
Transients
Base Frequency and Warble
Frequencies are Independently
Adjustable
Adjustable Base Frequency
Reduced Number of Externals
Ring ...----4"':":i~"....,'"'
Speech Networks
Telephone Speech Network with Dialer Interface
MC34114P, DW
TA = -20° to +70°C, Case 707,751 D
•
•
•
•
Regulated 1.7 V Output for Biasing Microphone
Regulated 3.3 V Output for Powering External Dialer
Microphone and Receive Amplifiers Muted During Dialing
Differential Receive Amplifier Output Eliminates Coupling
Capacitor
• Operates with Receiver Impedances of 150 Q and Higher
• Operation Down to 1.2 V
• Adjustable Transmit, Receive, and Sidetone Gains by
External Resistors
• Differential Microphone Amplifier Input Minimizes RFI
• Transmit, Receive, and Sidetone Equalization on both
Voice and DTMF Signals
Tip 0-------,
Ring 0--------'
Motorola Master Selection Guide
4.7-21
Analog and Interface Integrated Circuits
Speech Networks
(continued)
Cordless Universal Telephone Interface
MC34016DW, P
TA
=-20° to +70°C, Case 7510, 738
The MC34016 is a telephone line interface meant for use
in cordless telephone base stations for CTO, CT1, CT2 and
DECT. The circuit forms the interface towards the telephone
line and performs ali speech and line interface functions like
dc and ac line termination, 2-4 wire conversion, automatic
gain control and hookswitch control. Adjustment of
transmission parameters is accomplished by two 8 bit
registers accessible via the integrated serial bus interface and
by external components.
• DC Masks for Voltage and Current Regulation
• Supports Passive or Active AC Set Impedance
Applications
• Double Wheatstone Bridge Sidetone Architecture
• Symmetrical Inputs and Outputs with Large Signal Swing
Capability
• Gain Setting and Mute Function for Tx and Rx Amplifiers
• Very Low Noise Performance
• Serial Bus Interface SPI Compatible
• Operation from 3.0 V to 5.5 V
FEATURES
Line Driver Architecture
• Two DC Masks for Voltage Regulation
• Two DC Masks for Current Regulation
• Passive or Active Set Impedance Adjustment
• Double Wheatstone Bridge Architecture
• Automatic Gain Control Function
Transmit Channel
• Symmetrical Inputs Capable of Handling Large Voltage
Swing
• Gain Select Option via Serial Bus Interface
• Transmit Mute Function, Programmable via Bus
• Large Voltage Swing Capability at the Telephone Line
Receive Channel
• Double Sidetone Architecture for Optimum Line Matching
• Symmetrical Outputs Capable of Producing High Voltage
Swing
• Gain Select Option via Serial Bus Interface
• Receive Mute Function, Programmable via Serial Bus
Serial Bus Interface
• 3-Wire Connection to Microcontrolier
• One Programmable Output Meant for Driving a
Hookswitch
• Two Programmable Outputs Capable of Driving Low
Ohmic Loads
• Two Eight Bit Registers for Parameter Adjustment
Rx
Outputs
Tx
Inputs
A(lip)
' - - - - t - - - B (Ring)
Analog and Interface Integrated Circuits
4.7-22
Motorola Master Selection Guide
Speech Networks
(continued)
Programmable Telephone Line Interface
Circuit with Loudspeaker Amplifier
MC34216DW
TA
=0° to +70°C, Case 751 F
The MC34216 is developed for use in telephone
applications where besides the standard telephone functions
also the group listening-in feature is required. In cooperation
with a microcontroller, the circuit performs all basic telephone
functions including DTMF generation and pulse-dialing. The
listening-in part includes a loudspeaker amplifier, an
anti-howling circuit and a strong supply. In combination with
the TCA3385, the ringing is performed via the loudspeaker.
FEATURES
Line Driver and Supply
•
•
•
•
DC and AC Termination of the Line
Selectable Masks: France, U.K., Low Voltage
Current Protection
Adjustable Set Impedance for Resistive and Complex
Termination
• Efficient Supply Point for Loudspeaker Amplifier and
Peripherals
Dialing and Ringing
•
•
•
•
•
•
Generates DTMF, Pilot Tones and Ring Signal
Interrupter Driver for Pulse-Dialing
Low Current While Pulse-Dialing
Optimized for Ringing via Loudspeaker
Programmable Ring Melodies
Uses Inexpensive 500 kHz Resonator
Loudspeaking Facility
•
•
•
•
•
Integrated Loudspeaker Amplifier
Peak-to-Peak Limiter Prevents Distortion
Programmable Volume
Anti-Howling Circuitry for Group Listening-In
Interfacing for Handsfree Conversation
Application Areas
Handset Operation
•
•
•
•
• Earpiece Gain Increase Switch
• Microphone Squelch Function
• Transmit Amplifier Soft Clipping
•
•
•
•
Transmit and Receive Amplifiers
Adjustable Sidetone Network
Line Length AGC
Microphone and Earpiece Mute
Corded Telephony with Group Listening-In
Cordless Telephony Base Station with Group Listening-In
Telephones with Answering Machines
Fax, Intercom, Modem
Line +
Handset
Earpiece
Handset
Microphone
Base
Loudspeaker
Line-
Motorola Master Selection Guide
4.7-23
Analog and Interface Integrated Circuits
Speech Networks
(continued)
Telephone Line Interface
TCA3388DP, FP
TA = 0° to +70°C, Case 738, 751 D
The TCA3388 is a telephone line interface circuit which
performs the basic functions of a telephone set in combination
with a microcontroller and a ringer. It includes dc and ac line
termination, the hybrid function with 2 adjustable sidetone
networks, handset connections and an efficient supply point.
•
•
•
•
FEATURES
•
•
•
•
Line Driver and Supply
•
•
•
•
DC and AC Termination of the Telephone Line
Selectable DC Mask: France, U.K., Low Voltage
Current Protection
Adjustable Set Impedance for Resistive and Complex
Termination
• Efficient Supply Point for Peripherals
• Hook Status Detection
Handset Operation
• Transmit and Receive Amplifiers
Double Anti-Sidetone Network
Line Length AGC
Microphone and Earpiece Mute
Transmit Amplifier Soft Clipping
Dialing and Ringing
Interrupter Driver for Pulse-Dialing
Reduced Current Consumption During Pulse-Dialing
DTMF InterfaCing
Ringing via External Ringer
Application Areas
• Corded Telephony
• Cordless Telephony Base Station
• Answering Machines
• Fax
• Intercom
• Modem
Line +
Handset
Earpiece
Handset
Microphone
Line-
Analog and Interface Integrated Circuits
4.7-24
Motorola Master Selection Guide
Speakerphones
Voice Switched Speakerphone Circuit
MC34018P,
ow
TA = -20° to +60°C, Case 710, 751F
MC34018 Speakerphone integrated circuit
The
incorporates the necessary amplifiers, attenuators, and
control functions to produce a high quality hands-free
speakerphone system. Included are a microphone amplifier,
a power audio amplifier for the speaker, transmit and receive
attenuators, a monitoring system for background sound level,
and an attenuation control system which responds to the
relative transmit and receive levels as well as the background
level. Also included are all necessary regulated voltages for
both internal and external circuitry, allowing line-powered
operation (no additional power supplies required). A Chip
Select pin allows the chip to be powered down when not in use.
A volume control function may be implemented with an
external potentiometer. MC34018 applications include
speakerphones for household and business uses, intercom
systems, automotive telephones, and others.
• All Necessary Level Detection and Attenuation Controls
for a Hands-Free Telephone in a Single Integrated
Circuit
• Background Noise Level Monitoring with Long Time
Constant
• Wide Operating Dynamic Range Through Signal
Compression
• On-Chip Supply and Reference Voltage Regulation
• Typical 100 mW Output Power (into 25 0) with Peak
Limiting to Minimize Distortion
• Chip Select Pin for Active/Standby Operation
• Linear Volume Control Function
Electret
Microphone
Speaker
Telephon~
Line'9
----'INv--Receive Volume Control
Motorola Master Selection Guide
4.7-25
Analog and Interface Integrated Circuits
Speakerphones
(continued)
Voice Switched Speakerphone Circuit
MC34118P,
ow
TA = -20 to +60°C, Case 710, 751 F
0
The MC34118 Voice Switched Speakerphone circuit
incorporates the necessary amplifiers, attenuators, level
detectors, and control algorithm to form the heart of a high
quality hands-free speakerphone system. Included are a
microphone amplifier with adjustable gain and mute control,
Transmit and Receive attenuators which operate in a
complementary manner, level detectors at input and output of
both attenuators,and background noise monitors for both the
transmit and receive channels. A dial tone detector prevents
the dial tone from being attenuated by the Receive
background noise monitor circuit. Also included are two line
driver amplifiers which can be used to form a hybrid network
in conjunction with an external coupling transformer. A
high-pass filter can be used to filter out 60 Hz noise in the
receive channel, orfor other filtering functions. A Chip Disable
pin permits powering down the entire circuit to conserve power
on long loops where loop current is at a minimum.
The MC34118 may be operated from a power supply, or
it can be powered from the telephone line, requiring typically
5.0 mAo The MC34118 can be interfaced directly to Tip and
Ring (through a coupling transformer) for stand-alone
operation, or it can be used in conjunction with a handset
speech network and/or other features of a featurephone.
• Improved Attenuator Gain Range: 52 dB Between
Transmit and Receive
• Low Voltage Operation for Line-Powered Applications
(3.0 to 6.5 V)
• 4-Point Signal Sensing for Improved Sensitivity
• Background Noise Monitors for Both Transmit and
Receive Paths
• Microphone Amplifier Gain Set by External Resistors Mute Function Included
• Chip Disable for Active/Standby Operation
• On Board Filter Pinned-Out for User Defined Function
• Dial Tone Detector Inhibits Receive Idle Mode During Dial
Tone Presence
• Compatible with MC34119 Speaker Amplifier
(
Ring
Analog and Interface Integrated Circuits
4.7-26
Motorola Master Selection Guide
Speakerphones
(continued)
Voice Switched Speakerphone with ~Processor Interface
MC33218AP,
ow
TA = -40° to +85°C, Case 724, 751E
The MC33218A, Voice Switched Speakerphone circuit
incorporates the necessary amplifiers, attenuators, level
detectors, and control algorithm to form the heart of a high
quality hands-free speakerphone system. Included are a
microphone amplifier with adjustable gain, and mute control,
transmit and receive attenuators which operate in a
complementary manner, and level detectors and background
noise monitors for both paths. A dial tone detector prevents
dial tone from being attenuated by the receive background
noise monitor. A Chip Disable pin permits powering down the
entire circuit to conserve power.
Also included is an 8-bit serial Ilprocessor port for
controlling the receive volume, microphone mute, attenuator
gain, and operation mode (force to transmit, force to receive,
etc.). Data rate can be up to 1.0 MHz. The MC33218A can be
operated from a power supply, or from the telephone line,
requiring typically 3.8 mAo It can also be used in intercoms and
other voice-activated applications.
•
•
•
•
Low Voltage Operation: 2.5 to 6.0 V
2-Point Sensing, Background Noise Monitor in Each Path
Chip Disable Pin for Active/Standby Operation
Microphone Amplifier Gain Set by External Resistors Mute Function Included
• Dial Tone Detector to Inhibit Receive Idle Mode During
Dial Tone Presence
• Microprocessor port for controlling:
• Receive Volume Level (16 Steps)
• Attenuator Range (26 or 52 dB, Selectable)
• Microphone Mute
• Force to Transmit, Receive, Idle or Normal Voice
Switched Operation
• Compatible with MC34119 Speaker Amplifier
Tx Output
Rx Input
Vcc
Chip Disable
Motorola Master Selection Guide
4.7-27
Analog and Interface Integrated Circuits
Speakerphones
(continued)
Voice Switched Speakerphone Circuit
MC33219AP, ADW
TA
=-40° to +85°C, Case 724, 751 E
The MC33219A Voice Switched Speakerphone Circuit
incorporates the necessary amplifiers, attenuators, level
detectors, and control algorithm to form the heart of a high
quality hands-free speakerphone system. Included are a
microphone amplifier with adjustable gain, and mute control,
transmit and receive attenuators which operate in a
complementary manner, and level detectors and background
noise monitors. A dial tone detector prevents dial tone from
being attenuated by the receive background noise monitor. A
Chip Disable pin permits powering down the entire circuit to
conserve power.
The MC33219A may be operated from a power supply, or
it can be powered from the telephone line requiring typically
4.0 mA. The MC33219A can be interfaced directly to Tip and
Ring (through a coupling transformer for stand-alone
operation, or it can be used in conjuction with a handset
speech network and/or other features of a featurephone.
• Low Voltage Operation: 2.7 to 6.0 V
• 2-Point Sensing, Background Noise Monitor in Each Path
• Chip Disable Pin for Active/Standby Operation
• Microphone Amplifier Gain Set by External Resistors Mute Function Included
• Dial Tone Detector to Inhibit Receive Idle Mode During
Dial Tone Presence
• Volume Control Range: 34 dB
• Compatible with MC34119 Speaker Amplifier
Mute
TxOutput
Speaker
Rx Input
VCC
Chip Disable
Wv
Volume
Control
Analog and Interface Integrated Circuits
4.7-28
Motorola Master Selection Guide
Speakerphones (continued)
Table 9. The Motorola Family of Speakerphone Integrated Circuits
MC34018
MC34118
MC33218A
MC33219A
Two point sensing with slow idle,
background noise monitor in T x
path only
Four point sensing with both fast
and slow idle modes,
background noise monitors in
both Rx and T x paths
Two point sensing with slow idle,
background noise monitors in
both Rx and Tx paths
Two point sensing with slow idle,
background noise monitors in
both Rx and T x paths
No dial tone detector in receive
path
Receive path has dial tone
detector
Receive path has dial tone
detector
Receive path has dial tone
detector
Attenuator Characteristics:
• Range: 44 dB
• Tolerance: ±4.0 dB
• Gain tracking not specified
• White noise is constant
Attenuator Characteristics:
• Range: 52 dB
• Tolerance: ±2.0 dB
• Gain Tracking: <1.0 dB
• White noise reduces with
volume
Attenuator Characteristics:
• Range: 52 or 26 dB
(selectable)
• Tolerance: ±3.0 dB
• Gain Tracking: <1.0 dB
• White noise reduces with
volume
Attenuator Characteristics:
• Range: 52 dB
• Tolerance: ±3.0 dB
• Gain Tracking: <1.0 dB
• White noise reduces with
volume
External hybrid required
Hybrid amplifiers on board
External hybrid required
External hybrid required
Speaker amplifier is on board
(34 dB, 100 mW)
Extemal speaker amplifier
required (MC34119)
External speaker amplifier
required (MC34119)
External speaker amplifier
required (MC34119)
Filtering is external
Configurable filter on board
Filtering is external
Filtering is external
Microphone amplifier has fixed
gain and no muting
Microphone amplifier has
adjustable gain and mute input
Microphone amplifier has
adjustable gain, and can be
muted through IlP port
Microphone amplifier has
adjustable gain and a mute input
Supply Voltage: 4.0 V to 11 V
Supply Voltage: 2.8 V to 6.5 V
Supply Voltage: 2.5 V to 6.5 V
Supply Voltage: 2.7 V to 6.5 V
Supply Current: 6.5 mA typ.,
9.0 mA max
Supply Current: 5.5 rnA typ.,
8.0 mA max
Supply Current: 4.0 mA typ.,
5.0 rnA max
Supply Current: 3.0 mA typ.,
5.0 mAmax
Speaker amplifier reduces gain
to prevent clipping
Receive gain is reduced as
supply voltage falls to prevent
clipping
Receive gain is reduced as
supply voltage falls to prevent
clipping
Receive gain is reduced as
supply voltage falls to prevent
clipping
Volume control is linear. Cannot
override voice switched
operation except through
additional circuitry. Attenuator
gain is fixed at 44 dB (slightly
variable). No microphone mute.
Volume control is linear, and
microphone mute has separate
pin. Cannot override voice
switched operation except
through additional circuitry.
Attenuator gain is fixed at 52 dB.
8-bit IlP serial port controls:
• Volume control (16 steps)
• Microphone mute
• Range selection
(26 dB or 52 dB)
• Force to transmit, idle,
receive, or normal
voice switched operation
Volume control is linear, and
microphone mute has separate
pin. Attenuator range fixed at
52 dB. Cannot override voice
switched operation except
through additional circuitry.
28 Pin DIP and SOIC packages
28 Pin DIP and SOIC packages
24 Pin narrow DIP and SOIC
packages
24 Pin narrow DIP and SOIC
packages
External Required:
• 12 Resistors
• 11 Capacitors (';;1.0 IlF)
• 8 CapaCitors (>1.0 IlF)
Extemal Required:
• 14 Resistors
• 12 CapaCitors (';;1.0 IlF)
• 9 Capacitors (>1.0 IlF)
Extemal Required:
• 12 Resistors
• 11 CapaCitors (';;1.0 IlF)
• 4 CapaCitors (> 1.0 IlF)
External Required:
• 12 Resistors
• 11 CapaCitors (';;1.0 IlF)
• 4 Capacitors (>1.0 IlF)
Temperature Range:
-20° to +60°C
Temperature Range:
-20° to +60°C
Temperature Range:
-40° to +85°C
Temperature Range:
-40° to +85°C
Motorola Master Selection Guide
4.7-29
Analog and Interface Integrated Circuits
Telephone Accessory Circuits
Audio Amplifier
MC34119P, D
CI
TA = 0° to +70°C, Case 626, 751
Differential Gain = 2 x
A low power audio amplifier circuit intended (primarily) for
telephone applications, such as speakerphones. Provides
differential speaker outputs to maximize output swing at low
supply voltages (2.0 V min.). Coupling capacitors to the
speaker, and snubbers, are not required. Overall gain is
externally adjustable from 0 to 46 dB. A Chip Disable pin
permits powering-down to mute the audio signal and reduce
power consumption.
~:
Rt
150 k
•
•
•
•
Drives a Wide Range of Speaker Loads (16 to 1000)
Output Power Exceeds 250 mW with 32 0 Speaker
Low Distortion (THD = 0.4% Typical)
Wide Operating Supply Voltage (2.0 V to 16 V) - Allows
Telephone Line Powered Applications.
Low Quiescent Supply Current (2.5 mA Typical)
• Low Power-Down Quiescent Current (60 !LA Typical)
• Optional
Current Mode Switching Regulator
MC34129P, D
TA = 0° to +70°C, Case 646, 751A
r::-,T:: T::-,.""":~.::- T::::- '" -
I' . . .... .
I
High performance current mode switching regulator for
low-power digital telephones. Unique internal fault timer
provides automatic restart for overload recovery. A start/run
comparator is included to implement bootstrapped operation
ofVCC·
Although primarily intended for digital telephone systems,
these devices can be used cost effectively in many other
applications. On-chip functions and features include:
•
•
•
•
•
•
•
Output
eSoft-Start 112"'
Vee
Vrel 1.25 V
Noninverting
Input
Inverting Input
Current Mode Operation to 300 kHz
Automatic Feed Forward Compensation
Latching PWM for Cycle-By-Cycle Current Limiting
Latched-Off or Continuous Retry after Fault Timeout
Soft-Start with Maximum Peak Switch Current Clamp
Internally Trimmed 2% Bandgap Reference
Input Undervoltage Lockout
Analog and Interface Integrated Circuits
::-.",,":,'9
'~gl StarVRun
'1.;-;""'""",""";:''0 Feedback!
PWM Input
.N.,...,..;:...;:.::..;,In
Drive Out
Drive Gnd
~i.;:...::~;""'""",""";l¢ Ramp Input
4.7-30
Motorola Master Selection Guide
Telephone Accessory Circuits
(continued)
The differential line driver is capable of driving 0 dBm into
a 600 n load. The transmit attenuator is programmable in
1.0 dB steps.
300 Baud FSK Modems
MC145442P, ow Modem - CCITT V.21
Case 738, 751 D
ADPCM Transcoder
MC145443P, OW Modem - Bell 103
Case 738, 7510
MC1455320W, L
Case 751G, 620
This powerful modem combines a complete FSK
modulator/demodulator and an accompanying transmit/receive
filter system on a single silicon chip. Designed for bidirectional
transmission over the telephone network, the modem operates
at 300 baud and can be obtained for compatibility with CCITT
V.21 and Bell 103 specifications.
The modem contains an on-board carrier-detect circuit
that allows direct operation on a telephone line (through a
simple transformer), providing simplex, half-duplex, and
full-duplex data communications. A built-in power amplifier is
capable of driving -9.0 dBm onto a 600 n line in the transmit
mode.
CMOS processing keeps power dissipation to a very low
45 mW, with a power-down dissipation of only 1.0 mW ... from
a single 5.0 V power supply. Available in a 20 pin dual-in-line
P suffix, and a wide body surface mount DW suffix.
Carrier
Detect
Adjust
3.579545 MHz
The MC145532 Adaptive Differential Pulse Code
Modulation (ADPCM) Transcoder provides a low cost,
full-duplex, single-channel transcoder to (from) a 64 kbps
PCM channel from (to) either a 16 kbps, 24 kbps, 32 kbps, or
64 kbps channel.
• Complies with CCITT Recommendation G.721
(1988)
• Complies with the American National Standard
(T1.301-1987)
• Full-Duplex, Single-Channel Operation
• Mu-Law or A-Law Coding is Pin Selectable
• Synchronous or Asynchronous Operation
• Easily Interfaces with any Member of Motorola's PCM
Codec-Filter Mono-Circuit Family or Other Industry
Standard Codecs
• Serial PCM and ADPCM Data Transfer Rate from
64 kbps to 5.12 Mbps
• Power Down Capability for Low Cost Consumption
• The Reset State is Automatically Initiated when the
Reset Pin is Released.
• Simple Time Slot Assignment Timing for Transcoder
Applications
• Single 5.0 V Power Supply
• Evaluation Kit MC145536 EVK Supports the MG145532
as well as the MC145480 PCM Godec-Filter. (See PBX
Architecture Pages for More Information.)
MC145444H, OW - CCITT V.21
Case 804, 751D
MC145446AFW - CCITT V.21
Case 751M
This device includes the DTMF generator and call progress
tone detector (CPTD) as well as the other circuitry needed for
full-duplex, half-duplex, or simplex 300 baud data
communication over a pair of telephone lines. It is intended for
use with telemeter system or remote control system
applications.
Motorola Master Selection Guide
4.7-31
Vss-
-VDD
Analog and Interface Integrated Circuits
Telephone Accessory Circuits
(continued)
Calling Line Identification (CLIO) Receiver with Ring Detector
MC145447P,
ow
Case 648, 751 G
The MC145447 is designed to demodulate Bell 202
1200 baud FSK asynchronous data. Its primary application is
in products that will be used to receive and display the calling
number, or the message waiting indicator sent to subscribers
from participating central office facilities of the public switched
telephone network. The device also contains a carrier detect
circuit and telephone ring detector which may be used to
power up the device.
Applications include adjunct boxes, answering machines,
feature phones, fax machines, and computer interface
products.
Tip
Ring
Ring Detector On-Chip
Ring Detect Output for MCU Interrupt
Power-Down Mode Less Than 1.0 I-lA
Single Supply: 3.5 V to 6.0 V
Pin Selectable Clock Frequencies: 3.68 MHz,
3.58 MHz, or 455 kHz
• Two-Stage Power-Up for Power Management Control
, - - - - . Raw Data
Out
Cooked
Data Out
•
•
•
•
•
Clock Select
3.58 MHz, 3.68 MHz,
OR 455 kHz
--0
VSS
Calling Line 10 Receiver Evaluation Kit
MC145460EVK
The MC145460EVK is a low cost evaluation platform for
the MC145447. The MC145460EVK facilitates development
and testing of products that support the Bellcore customer
premises equipment (CPE) data interface, which enables
services such as Calling Number Delivery (CND). The
MC145447 can be easily incorporated into any telephone,
FAX, PBX, key system, answering machine, CND adjunct box
or other telephone equipment with the help of the
MC145460EVK development kit.
• Easy Clip-On Access to Key MC145447 Signals
• Generous Prototype Area
• Configurable for MC145447 Automatic or External Power
Up Control
• EIA-232 and Logic Level Ports for Connection to any PC
or MCU Development Platform
• Carrier Detect, Ring Detect and Data Status LEDs
• Optional Tip and Ring Input Protection Network
• MC145460EVK User Guide, MC145447 Data Sheet, and
Additional MC145447 Sample Included
EIA-232 Level
Output
CD, RD, Data
Logic Level
Output
CD, RD, Data
Analog and Interface Integrated Circuits
4.7-32
Motorola Master Selection Guide
Telephone Accessory Circuits
(continued)
Continuously Variable Slope Delta (CVSD) Modulator/Demodulator
MC34115P, ow
TA 0° to +70°C, Case 648, 751G
=
MC3418P, OW
TA 0° to +70°C, Case 648, 751G
=
Provides the AlD-D/A function of voice communications by
digital transmission. Designed for speech synthesis and
commercial telephone applications. A single IC provides both
encoding and decoding.
• Encode and Decode Functions on the Same Chip with a
Digital Input
• CMOS Compatible Digital Output
• Digital Input Threshold Selectable (VCC/2 reference
provided on Chip)
• MC34115 Has a 3--Bit Algorithm (General
Communications)
• MC3418 Has a 4-Bit Algorithm (Commercial Telephone)
Encolil!
Decode
Clock
15
14
Analog Input
Analog Feedback
Digital Data Input
Digital Threshold
Coincidence Output
Digital Output
Syllablic Filter
Gain Control
VCcJ2 Reference
Analog
Output
Motorola Master Selection Guide
Reference
Input
(+)
4.7-33
Filter
Input
(-)
Analog and Interface Integrated Circuits
Telephone Accessory Circuits
(continued)
Table 10. Summary of Bipolar Telecommunication Circuits
I
Function
Suffix!
I
Features
Package
Device
Subscriber Loop Interface Circuits (SUes)
PBX Applications
All gains externally programmable, most BORSHT functions,
current limit adjustable to 100 mA.
U726
MC3419-1
Central Office, Remote Terminals,
PBX Applications
All gains externally programmable, most BORSHT functions,
current limit adjustable to 50 mA, 58 dB Longitudinal Balance,
-21.6 V to -42 V.
pn38,
FNI776
MC33121
Central Office, Remote Terminals,
PBX Applications
All gains externally programmable, most BORSHT functions,
current limit adjustable to 50 mA, 58 dB Longitudinal Balance,
-42 V to -58 V.
pn38,
FNm6
MC33120
Complete Telephone Circuit
POTS Circuit + MPU Dialing
Speech network, tone ringer, dc loop current interface, DTMF
dialer with serial port control.
Tone Ringers
Adjustable Tone Ringer
Single-ended output, meets FCC requirements, adjustable REN,
different warble rates.
P/626,
Dn51
MC34012-1,
2,3
Adjustable Tone Ringer
Differential output, meets FCC requirements, adjustable REN,
different warble rates.
P/626,
Dn51
MC34017-1,
2,3
Adjustable Tone Ringer
Differential output, meets FCC requirements, adjustable REN,
single warble rates.
P/626,
D/751
MC34217
Basic Phone Line Interface
Loop current interface, speech network, line length
compensation, speech/dialing modes, Bell System compliant.
pn07,
DWn51D
MC34014
Cordless Universal Telephone
Interface
Designed for digital cordless phones, SPI interface, double
sidetone network, low noise and distortion.
pn38,
DWn51D
MC34016
Basic Phone Line Interface
Loop current interface, speech network, line length compensation,
speech/dialing modes, Bell System and foreign countries.
pn07,
DWn51D
MC34114
Programmable Telephone Line
Interface Circuit with Loudspeaker
Amplifier
Group listening-in, DTMF and tones generator, ring generator,
country programmable, SPI interface.
DWn51F
MC34216
Telephone Line Interface
Country programmable, double sidetone network, provides strong
supply point.
DPn38,
FPn51D
TCA3388
Complete Speaker Phone with
Speaker Amplifier
All level detection (2 pt.), attenuators, and switching controls,
mike and speaker amp.
pm 0,
DWn51F
MC34018
Complete Speaker Phone with
Hybrid, Filter
All level detection (4 pt.), attenuators, and switching controls,
mike amp with mute, hybrid, and filter.
P/71 0,
DWn51F
MC34118
Complete Speaker Phone with
MPU Interface
All level detection, attenuators, and switching controls, mike amp,
MPU interface for: volume control, mode selection, mike mute.
pn24,
DWn51E
MC33218A
Basic Low Cost Speakerphone
All level detection, attenuators and switching controls, Mike
amplifier with Mute, low voltage operation.
pn24,
DWn51E
MC33219A
Speech Networks
Speakerphone Circuits
Audio Amplifiers
1 Watt Audio Amp
1.0 W output power into 16 n, 35 V maximum.
Dn51
MC13060
Low Voltage Audio Amp
400 mW, 8.0 to 100 n, 2.0 to 16 V, differential outputs,
chip-
r:::
-=
c:
CD
o
~
CSYNCI
-=
'-'
CGLlNES
..,.
~
"-
::0
8
!
"
- 1 'j'l
FLD
ADDR
DECODER
FLD
LS
SFLP
????
>
::>
!!!.
LINE & FLD
CTR
0
r;:;l
IQ
III
::>
c.
:;
!it
::!.
III
n
CD
1
I
i!l.
CD
c.
0
r;"
r:::
m:
~
LINE AND FLO
DECODERS
11
-------~J:lr~;--~~
HIN
:;
!it
IQ
o
Q
...o
T1::'d:
-=
LOOP
FILTER
-=
17 3 2 18
:i"
.s
Video Circuits
(continued)
Set-Top Block Diagram
r------,
I
I
I
I
I
I
IL
_ _ _ _ _ .J
I
~~-___l~,.)
c--iH-___l~'.)
-+-+....--D>--@
R
G
B
y
C
CB
Channel
314
Oigital Sound Section
• In Development
Analog and Interface Integrated Circuits
4.8-18
Motorola Master Selection Guide
Video Circuits
(continued)
PLL Tuning Circuits with 3-Wire Bus
MC44817BD, D
Case 751B
The MC44817/17B are tuning circuits for TV and VCR
tuner applications. They contain on one chip all the functions
required for PLL control of a VCO. The integrated circuits also
contain a high frequency prescaler and thus can handle
frequencies up to 1.3 GHz.
The MC44817 has programmable 512/1024 reference
dividers while the MC44817B has a fixed reference divider of
1024.
The MC44817/17B are manufactured on a single silicon
chip using Motorola's high density bipolar process, MOSAICTM
(Motorola Oxide Self Aligned Implanted Circuits).
• Complete Single Chip System for MPU Control (3-Wire
Bus). Data and Clock Inputs are IIC Bus Compatible
• Divide-by-8 Prescaler Accepts Frequencies up to
1.3GHz
• 15 Bit Programmable Divider Accepts Input Frequencies
up to 165 MHz
• Reference Divider: Programmable for Division Ratios 512
and 1024. The MC44817B has a Fixed 1024 Reference
Divider
• 3-State Phase/Frequency Comparator
• Operational Amplifier for Direct Tuning Voltage Output
(30 V)
• Four Integrated PNP Band Buffers for 40 mA (VCC1 to
14.4 V)
• Output Options for the Reference Frequency and the
Programmable Divider
• Bus Protocol for 18 or 19 Bit Transmission
• Extra Protocol for 34 Bit for Test and Further Features
• High Sensitivity Preamplifier
• Circuit to Detect Phase Lock
• Fully ESD Protected
Bands Out 30 rnA
(40 rnA at 0° to ao°C)
VTUN
VCC3
5.0V
7
13
12 11
10
14
12V
.-/.it----..-4-o Amp In
2.7V
Lock
EN ~----+_-rL-..-'--'1
~==~;~~~L.-_~~
Data
Clockr~I--1..-.:;:;:~JI
__--.J
XTAL
Preamp 2
Motorola Master Selection Guide
4.8-19
Analog and Interface Integrated Circuits
Video Circuits
(continued)
PLL Tuning Circuit with 12C Bus
MC44818D
Case 751B
The MC44818 is a tuning circuit for TV and VCR tuner
applications. It contains, on one chip, all the functions required
for PLL control of a VCO. This integrated circuit also contains
a high frequency prescaler and thus can handle frequencies
up to 1.3 GHz. The MC44818 is a pin compatible drop-in
replacementforthe MC44817, where the only difference is the
MC44818 has a fixed divide-by-8 prescaler (cannot be
bypassed) and the MC44817 uses the three wire bus.
The MC44818 has programmable 512/1024 reference
dividers and is manufactured on a single silicon chip using
Motorola's high density bipolar process, MOSAICTM (Motorola
Oxide Self Aligned Implanted Circuits).
• Complete Single Chip System for MPU Control (12C Bus).
Data and Clock Inputs are 3-Wire Bus Compatible
• Divide-by-8 Prescaler Accepts Frequencies up to
1.3 GHz
• 15 Bit Programmable Divider Accepts Input Frequencies
up to 165 MHz
• Reference Divider: Programmable for Division Ratios 512
and 1024.
• 3-State Phase/Frequency Comparator
• Operational Amplifier for Direct Tuning Voltage Output
(30 V)
• Four Integrated PNP Band Buffers for 40 rnA (VCC1 to
14.4 V)
• Output Options for the Reference Frequency and the
Programmable Divider
• High Sensitivity Preamplifier
• Circuit to Detect Phase Lock
• Fully ESD Protected
Bands Out 30 mA
(40 mA at 00 to BOaC)
VCC1
5.0V
VTUN
VCC3
7
13
12 11
10
4 Amp In
.........t----1....-o
DTB1
Latches
Lock
XTAL
DTS, EN
Analog and Interface Integrated Circuits
4.8-20
Motorola Master Selection Guide
Video Circuits
(continued)
PLL Tuning Circuits with 12C Bus
MC44824125D
Case 751A, 751B
The MC44824/25 are tuning circuits for TV and VCR tuner
applications. They contain on one chip all the functions
required for PLL control of a VCO. The integrated circuits also
contain a high frequency prescaler and thus can handle
frequencies up to 1.3 GHz.
The MC44824/25 are manufactured on a single silicon chip
using Motorola's high density bipolar process, MOSAICTM
(Motorola Oxide Self Aligned Implanted Circuits).
• Complete Single Chip System for MPU Control (12C Bus).
Data and Clock Inputs are 3-Wire Bus Compatible
• Divide-by-8 Prescaler Accepts Frequencies up to
1.3 GHz
• 15 Bit Programmable Divider
• Reference Divider: Programmable for Division Ratios 512
and 1024
• 3-State Phase/Frequency Comparator
• 4 Programmable Chip Addresses
• 3 Output Buffers (MC44824) respectively; 5 Output
Buffers (MC44825) for 10 mAl15 V
• Operational Amplifier for use with External NPN Transistor
• S0-14 Package for MC44824 and S0-16 for MC44825
• High Sensitivity Preamplifier
• Fully ESD Protected
Vcc
5.0 V
10 (12)
UD
6(6)
-(7)
8(9)
9(10)
-(11)
14(16)
1 (1)
BO
PD
2.7V
Gnd
XTAL1
XTAL2
HF Inputt
HF Input2 u---....,.,
MC44825 Pin Numbers ( )
Motorola Master Selection Guide
4.8-21
Analog and Interface Integrated Circuits
Video Circuits
(continued)
PLL Tuning Circuit with 3-Wire Bus
MC44827DTB
Case 948F
The MC44827 is a tuning circuit for TV and VCR tuner
applications. This device contains on one chip all the functions
required for PLL control of a VCO. This integrated circuit also
contains a high frequency prescaler and thus can handle
frequencies up to 1.3 GHz.
The MC44827 is controlled by a 3-wire bus. It has the
same function as the MC44828 which is 12C bus controlled.
The MC44827 and MC44828 can replace each other to allow
conversion between 3-wire bus and 12C bus control.
The MC44827 is manufactured on a single silicon chip
using Motorola's high density bipolar process, MOSAICTM
(Motorola Oxide Self Aligned Implanted Circuits).
The MC44827 has the same features as MC44817 with the
following differences:
• Lower Power Consumption, 200 mW Typical
• Improved Prescaler with Higher Margins for Sensitivity
and Temperature Range. (A typical device is functional in
a temperature range greater than -40 to 100°C.)
• Lock Detector with Push-Pull Output
• No Bypass of Divide-by-8 Prescaler
• TSSOP Package
PLL Tuning Circuit with 12C Bus
MC44828DTB
Case 948F
The MC44828 is a tuning circuit for TV and VCR tuner
applications. This device contains on one chip all the functions
required for PLL control of a VCO. This integrated circuit also
contains a high frequency prescaler and thus can handle
frequencies up to 1.3 GHz.
The MC44828 is controlled by an 12C bus. It has the same
function as the MC44827 which is 3-wire bus controlled. The
MC44827 and MC44828 can replace each other to allow
conversion between 3-wire bus and 12C bus control.
The MC44828 is manufactured on a single silicon chip
using Motorola's high density bipolar process, MOSAlcrM
(Motorola Oxide Self Aligned Implanted Circuits).
Analog and Interface Integrated Circuits
4.8-22
The MC44828 has the same features as MC44818 with the
following differences:
• Lower Power Consumption, 200 mW Typical
• Improved Prescaler with Higher Margins for Sensitivity
and Temperature Range. (A typical device is functional in
a temperature range greater than -40 to 100°C.)
• Lock Detector with Push-Pull Output
• TSSOP Package
Motorola Master Selection Guide
Video Circuits
(continued)
PLL Tuning Circuit with 12C Bus
MC44829D
Case 751A
The MC44829 is a tuning circuit for TV and VCR tuner
applications. It contains, on one chip, all the functions required
for PLL control of a VCO. This integrated circuit also contains
a high frequency prescaler and thus can handle frequencies
up to 1.3 GHz. The circuit has a band decoder that provides
the band switching signal for the mixer/oscillator circuit. The
decoder is controlled by the buffer bits.
The MC44829 has programmable 512/1024 reference
dividers and is manufactured on a single silicon chip using
Motorola's high density bipolar process, MOSAICTM (Motorola
Oxide Self Aligned Implanted Circuits).
• Complete Single Chip System for MPU Control (12C Bus)
• Divide-by-8 Prescaler Accepts Frequencies up to
1.3 GHz
• 15 Bit Programmable Divider
• Reference Divider: Programmable for Division Ratios 512
and 1024
• 3-State Phase/Frequency Comparator
• Operational Amplifier for Direct Tuning Voltage Output
(30 V)
• Four Programmable Chip Addresses
• Integrated Band Decoder for the Mixer/Oscillator Circuit
• Band Buffers with Low "On" Voltage (0.4 V Maximum at
5.0mA)
• Fully ESD Protected to MIL-STD-883C, Method 3015.7
(2000 V, 1.5 kn, 150 pF)
VTUN
r
Bands Out
8
B6
VCC2
CL
7
14
B5
2.7V
Buffers
PHO
-=T8
Gnd
2
DTB2
POR
CA
SDA
SCL
9
11
10
CL
Data
RL
DTF
T 12pF
D 3.214.0
MHz
l
DTS, EN
Motorola Master Selection Guide
4.8-23
Analog and Interface Integrated Circuits
Video Circuits
(continued)
Advanced PAUNTSC Encoder
MC13077P,
ow
Case 738, 7510
The MC13077 is an economical, high quality, RGB encoder
for PAL or NTSC applications. It accepts red, green, blue and
composite sync inputs and delivers either composite PAL or
NTSC video, and S-Video Chroma and Luma outputs. The
MC13077 is manufactured using Motorola's high density,
bipolar MOSAIC® process.
• Single 5.0 V Supply
• Composite Output
•
•
•
•
•
•
•
•
S-Video Outputs
PAUNTSC Switch able
PAL Squarewave Output
PAL Sequence Resettable
Internal/External Burst Flag
Modulator Angles Accurate to 90°
Burst Position/Duration Determined Digitally
Subcarrier Reference from a Crystal or External Source
Gnd
VCC
i----~---------------------~-----l
3.58/
Divide By Four Ring
Counter
45"
PLL
Off
Divide By 256
0"
4.43 MHz
Latch
I
I
I
I
I
I
I
LPF
3.58/4.43 MHz
In/PLLOff
Rln
Gin
Color
Difference
and
Luma
Matrix
Bin
Analog and Interface Integrated Circuits
4.8-24
Motorola Master Selection Guide
Consumer Electronic Circuits Package Overview
•
CASE 626
PSUFFIX
-
CASE 707
PSUFFIX
CASE 711
PSUFFIX
•
CASE 751
D SUFFIX
CASE 751E
DWSUFFIX
Motorola Master Selection Guide
CASE 646
P SUFFIX
CASE 648
PSUFFIX
CASE 709
PSUFFIX
CASE 710
PSUFFIX
-
CASE 738
H, PSUFFIX
CASE 724
PSUFFIX
CASE 751A
DSUFFIX
CASE 751D
DWSUFFIX
CASE 751B
DSUFFIX
CASE 751F
DWSUFFIX
4.8-25
•
CASE 751G
DWSUFFIX
Analog and Interface Integrated Circuits
Consumer Electronic Circuits Package Overview (continued)
CASE 824, 824A
FBSUFFIX
CASE 824E
FBSUFFIX
•
CASE 859
BSUFFIX
CASE 873
FU SUFFIX
CASE 898
FB, FU, P SUFFIX
•
•
CASE 904
FSUFFIX
Analog and Interface Integrated Circuits
•
•
CASE 777
FN SUFFIX
CASE948F
DTB SUFFIX
4.8-26
Motorola Master Selection Guide
Automotive Electronic Circuits
In Brief ...
Page
Motorola Analog has established itself as a global leader
in custom integrated circuits for the automotive market. With
multiple design centers located on four continents, global
process and assembly sites, and strategically located
supply centers, Motorola serves the global automotive
market needs. These products are key elements in the
rapidly growing engine control, body, navigation,
entertainment, and communication electronics portions of
modern automobiles. Though Motorola is most active in
supplying automotive custom designs, many of yesterday's
proprietary custom devices have become standard products
of today, available to the broad base manufacturers who
support this industry. Today, based on new technologies,
Motorola offers a wide array of standard products ranging
from rugged high current "smart" fuel injector drivers which
control and protect the fuel management system through the
rigors of the underhood environment, to the latest
SMARTMOSTM switches and series transient protectors.
Several devices are targeted to support microprocessor
housekeeping and data line protection. A wide range of
packaging is available including die, flip-chip, and SOICs for
high density layouts, to low thermal resistance multi-pin,
single-in-line types for high power control ICs.
Motorola Master Selection Guide
Voltage Regulators ............................. 4.9-2
Electronic Ignition .............................. 4.9-2
Special Functions .............................. 4.9-3
Package Overview ............................ 4.9-12
4.9-1
Analog and Interface Integrated Circuits
Automotive Electronic Circuits
Table 1. Voltage Regulators
Function
Suffix!
Package
Features
Device
Low Dropout Voltage
Regulator
Positive fixed and adjustable output voltage regulators which
maintain regulation with very low input to output voltage differential.
ZJ29, T/221 A,
T/3140, THl314A,
TV/314B,OT/369A,
OT-1/369,02T/936,
02T/936A,01751
LM2931, C
Low Dropout Dual
Regulator
Positive low voHage differential regulator which features dual 5.0 V
outputs, with currents in excess of 750 mA (switched) and 10 mA
standby, and quiescent current less than 3.0 mA.
T/3140, TH/314A,
TV/314B,02T/936A
LM2935
Automotive Voltage
Regulator
Provides load response control, duty cycle limiting, under/overvoltage
and phase detection, high side MOSFET field control, voltage
regulation in 12 V altemator systems.
OW1751 0
MC33092
Low Dropout Voltage
Regulator
Positive 5.0 V, 500 mA regulator having on-chip power-up-reset
circuit with programmable delay, current limit, and thermal shutdown.
T/3140, TV/314B
MC33267
Low Dropout Voltage
Regulator
Positive 3.3 V, 5.0 V, 12 V, 800 mA regulator.
01751, OT/369A
MC33269
Suffix!
Package
Device
P/626, 01751,
Flip-Chip
MC3334,
MCCF3334
Table 2. Electronic Ignition
Function
Features
Electronic Ignition
Circuit
Used in high energy variable dwell electronic ignition systems with
variable reluctance sensors. Dwell and spark energy are extemally
adjustable. "Bumped" die for inverted mounting to substrate.
Electronic Ignition
Circuit
Used in high energy electronic ignition systems requiring differential
Hall Sensor control. "Bumped" die for inverted mounting to substrate.
OWI751G,
Flip-Chip
MC33093,
MCCF33093
Electronic Ignition
Circuit
Used in high energy electronic ignition systems requiring single Hall
Sensor control. "Bumped" die for inverted mounting to substrate.
OWI751G,
Flip-Chip
MC33094,
MCCF33094
Electronic Ignition
Circuit
Used in high energy electronic ignition systems requiring single Hall
Sensor control. Dwell feedback for coil variation. "Bumped" die for
inverted mounting to substrate.
OWI751G,
Flip-Chip
MC79076,
MCCF79076
Analog and Interface Integrated Circuits
4.9-2
Motorola Master Selection Guide
Table 3. Special Functions
Function
Suffix!
Package
Features
Device
Low Side Protected
Switch
Single automotive low side switch having CMOS compatible input,
1.0 A maximum rating, with overcurrent, overvoltage and thermal
protection.
T/221 A, T-1/314D,
DW/751G
MC3392
Low Current High-Side
Switch
Drives loads from positive side of power supply and protects against
high-voltage transients.
T/314D, DW/751G
MC3399
High-Side TMOS Driver
Designed to drive and protect N-channel power MOSFETs used in
high side swnching applications. Has internal charge pump, externally
programmed timer and fault reporting.
P/626, D/751
MC33091A
MI-Bus Interface
Stepper Motor
Controller
High noise immunity serial communication using MI-Bus protocol to
control relay drivers and motors in harsh environments. Four phase
signals drive two phase motors in either half or full-step modes.
DW/751G
MC33192
Quad Fuel Injector
Driver
Four low side swnches with parallel CMOS compatible input control,
:$ 7.0 rnA quiescent current, 0.25 Q rDS(on) at 25°C independent
outputs with 3.0 A current limiting and internal 65 V clamps.
T/821D, TV/821C
MC33293
Octal Serial Output
Switch
Eight low side switches having 8-bit serial CMOS compatible input
control, serial fault reporting, :$ 4.0 rnA quiescent current, independent
0.45 Q rDS(on) at 25°C outputs with 3.0 A minimum current limiting and
internal 55 V clamps.
P/738, DW/751E
MC33298
Integral Alternator
Regulator
Control device used in conjunction with a Darlington device to monitor
and control the field current in alternator charging systems. "Bumped"
die for inverted mounting to substrate.
D/751A, Flip-Chip
MC33095
MCCF33095
Peripheral Clamping
Array
Protects up to six MPU 1/0 lines against voltage transients.
'/626, D/751
TCF6000
Automotive Direction
Indicator
Detects defective lamps and protects against overvoltage in
automotive turn-signal applications. Replaces UAA1041 B in most
applications.
D/751 , P/626
MC33193
Automotive Wash Wiper
Timer
Standard wiper timer control device that drives a wiper motor relay and
can perform the intermittent, afterwash and continuous wiper timer
functions.
D/751 , P/626
MC33197
Automotive ISO 9141
Serial Link Driver
Interface between the two-wire asynchronous serial communication
interface (SCI) of a microcontroller and a special one-wire care
diagnosis system (DIA).
D/751 A
MC33199
'No Suffix
Motorola Master Selection Guide
4.9-3
Analog and Interface Integrated Circuits
Quad Fuel Injector Driver
MC33293T, MC33293TV
TJ
=-40
0
to +150°C, Case 8210, C
shorted loads, and over temperature condition of outputs. A
shorted load condition will shut off only the specific output
involved while allowing other outputs to operate normally. An
overvoltage condition will shut off all outputs for the
overvoltage duration. A single/dual mode select pin allows
either independent input/output operation or paired output
operation.
The MC33293T is a monolithic quad low-side switching
device having CMOS logic, bipolar/ CMOS analog circuitry,
and OMOS power FETs. All inputs are CMOS compatible.
Each independent output is internally clamped to 65 V, current
limited to ----------_---------- +Vbat
VCC
1 MI
To other
devices
MC33192DW
Osc
Ground
MI-Bus
Ceramic
Resonator
-.e.+-------------------
From MCU
MI-Bus
Automotive Direction Indicator
MC33193P,D
TA = -40° to +125°C, Case 626, 751
The MC33193 is a new generation industry standard
UAA 1041 "Flasher". It has been developed for enhanced EMI
sensitivity, system reliability, and improved wIring
simplification. The MC33193 is pin compatible with the
UAA1041 and UAA 1041 B in the standard application
configuration as shown in Figure 9, without lamp short circuit
detection and using a 20 mO shunt resistor. The MC33193 has
a standby mode of operation requiring very low standby
supply current and can be directly connected to the vehicle's
battery. It includes a RF filter on the Fault detection pin (Pin 7)
Analog and Interface Integrated Circuits
for EMI purposes. Fault detection thresholds are reduced
relative to those of the UAA1041 allowing a lower shunt
resistance value (20 mO) to be use.
• Pin Compatible with the UAA1041
• Defective Lamp Detection Threshold
• RF Filter for EMI Purposes
• Load Dump Protection
• Double Battery Capability for Jump Start Protection
• Internal Free Wheeling Diode Protection
• Low Standby Current Mode
4.9-8
Motorola Master Selection Guide
Automotive Wash Wiper Timer
MC33197D
TA
=-40° to +105°C, Case 751
MC33197P
TA
=-40° to + 125°C, Case 626
The MC33197 is a standard wiper timer control device
designed for harsh automotive applications. The device can
perform the intermittent, after wash, and continuous wiper
timer functions. It is designed to directly drive a wiper motor
relay. The MC33197 requires very few external components
for full system implementation. The intermittent control pin can
be switched to ground or Vbat to meet a large variety of
possible applications. The intermittent timing can be fixed or
adjustable via an external resistor. The MC33197 is built using
bipolar technology and parametrically specified over the
automotive ambient temperature range and 8.0 to 16 V supply
voltage. The MC33197 can operate in both front and rear
wiper applications.
• Adjustable Time Interval of Less Than 500 ms to More
Than 30s
• Intermittent Control Pin Can Be Switched to Ground
or Vbat
• Adjustable After Wipe TIme
• Priority to Continuous Wipe
• Minimum Number of TIming Components
• Integrated Relay Driver With Free Wheeling Protection
Diode
• Operating Voltage Range From 8.0 to 16 V
• For Front Wiper and Rear Wiper Window Applications
R1 =220 Q
R2=22kQ
R3= 1.5 to 22 kQ
R4=4.7kQ
R5=4.7kQ
C1 = 47JlF
C2=100nF
1,.
Switch
Water Pump Motor
1
-=
>--..J\Af.r------,
Gnd
Switch -
Motorola Master Selection Guide
4.9-9
Analog and Interface Integrated Circuits
Automotive ISO 9141 Serial Link Driver
MC33199D
TA
=-40° to +125°C, Case 751A
The MC33199D is a serial interface circuit used in
diagnostic applications. It is the interface between the
microcontroller and the special K and L Lines of the ISO
diagnostic port. The MC33199D has been designed to meet
the "Diagnosis System ISO 9141" specification.
The device has a bi-directional bus K Line driver, fully
protected against short circuits and over temperature. It also
includes the L Line receiver, used during the wake up
sequence in the ISO transmission.
The MC33199 has a unique feature which allows
transmission baud rate up to 200 k baud.
• Electrically Compatible with Specification "Diagnosis
System ISO 9141"
• Transmission Speed Up to 200 k Baud
• Internal Voltage Reference Generator for Line
Comparator Thresholds
• TXD, RXD and LO Pins are 5.0 V CMOS Compatible
• High Current Capability of DIA Pin (K Line)
• Short Circuit Protection for the K Line Input
• Over Temperature Shutdown with Hysteresis
• Large Operating Range of Driver Supply Voltage
• Full Operating Temperature Range
• ESD Protected Pins
Vs
Vee
REF-0UT
LO
REF-IN-L
REF-IN-K
11
RXD
DIA
TXD
Gnd
Analog and Interface Integrated Circuits
4.9-10
Motorola Master Selection Guide
Alternator Voltage Regulator
MC33092DW
TJ = -40° to +125°C, Case 7510
Provides voltage regulation and load response control in
diode rectified 12 V alternator charging systems. Provides
externally programmed load response control of the alternator
output current to eliminate engine speed hunting and vibration
due to sudden electrical loads. Monitors and compares the
system battery voltage to an externally programmed set pOint
value and pulse width modulates an N-channel MOSFET
transistor to control the average alternator field current. In
addition, has duty cycle limiting, under/overvoltage and phase
detection (broken belt) protective features.
Gate
Source
Sense
(Remote)
Lamp
Collector
Supply Reg
(Local)
Lamp Base
Phase
Ground
OscAdjust
Motorola Master Selection Guide
4.9-11
Analog and Interface Integrated Circuits
Automotive Electronic Circuits Package Overview
,
,
CASE 29
ZSUFFIX
CASE 221A
TSUFFIX
-
CASE 314B
TV SUFFIX
, • ,.
CASE 314D
T, T-1 SUFFIX
CASE 369
DT-1 SUFFIX
•
CASE 738
PSUFFIX
~
CASE 314A
TH SUFFIX
CASE 751
DSUFFIX
•
CASE 751G
DWSUFFIX
CASE 369A
DTSUFFIX
~
#
CASE 751 A
DSUFFIX
•
#
CASE 751D
DWSUFFIX
CASE 821C
TV SUFFIX
CASE 751E
DWSUFFIX
CASE 821D
TSUFFIX
•
CASE 936
D2TSUFFIX
Analog and Interface Integrated CircuHs
CASE 626
P, NO SUFFIX
CASE 936A
D2TSUFFIX
4.9-12
Motorola Master Selection Guide
Other Analog Circuits
In Brief ...
A variety of other analog circuits are provided for special
applications with both bipolar and CMOS technologies.
These circuits range from the industry standard analog
timing circuits and multipliers to specialized CMOS smoke
detectors. These products provide key functions in a wide
range of applications, including data transmission,
commercial smoke detectors, and various industrial
controls.
Motorola Master Selection Guide
4.10-1
Page
Timing Circuits .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Singles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
Duals .....................................
Multipliers ....................................
Linear Four-Quadrant Multipliers .. . . . . . . . . . . ..
Smoke Detectors (CMOS) ......................
Package Overview ............................
4.10-2
4.10-2
4.10-2
4.10-2
4.10-2
4.10-3
4.1 Q-4
Analog and Interface Integrated Circuits
Timing Circuits
Multipliers
These highly stable timers are capable of producing
accurate time delays or oscillation. In the time delay mode of
operation, the time is precisely controlled by one external
resistor and capacitor. For a stable operation as an oscillator,
the free-running frequency and the duty cycle are both
accurately controlled with two external resistors and one
capacitor. The output structure can source or sink up to 200 mA
or drive TTL circuits. TIming intervals from microseconds
through hours can be obtained. Additional terminals are
provided for triggering or resetting If desired.
Linear Four-Quadrant Multipliers
Multipliers are designed for use where the output voltage is
a linear product of two input voltages. Typical applications
Include: multiply, divide, square, root-mealHlquare, phase
detector, frequency doubler, balanced modulator/demodulator,
electronic gain control.
Multiplier Transfer Characteristics
Singles
MC1455P1, D
TA = 0° to +70°C, Case 626,751
MC1455BP1, D
TA = -40° to +85°C. Case 626, 751
VCC
8
Threshold
Control
VoHage
-4.0 -2.0
7
Discharge
0
2.0
4.0
VX, INPUT VOLTAGE (V)
MC1494P
TA
= 0° to +70°C, Case 648
This device has all the necessary internal regulation and
references. The single-ended output is referenced to ground.
MC1495D, P
TA = 0° to +70°C, Case 751A, 646
Duals
MC3456P
TA =0° to +70°C, Case 646
NE556N, D
TA = 0° to +70°C, Case 646, 751A
Maximum versatility is assured by allowing the user to
select the level shift method.
MC1495BP
TA
=-40° to +125°C, Case 646
Linearity and offset are actually tested over temperature.
This is an improved specification over previous versions.
Analog and Interface Integrated Circuits
4.10-2
Motorola Master Selection Guide
Smoke Detectors (CMOS)
These smoke detector les require a minimum number of
external components. When smoke is sensed, or a low battery
voltage is detected, an alarm is sounded via an external
piezoelectric transducer. All devices are designed to comply
with UL specifications.
Table 1. Smoke Detectors (CMOS)
Low
Battery
Detector
Piezoelectric
Horn Driver
V
V
-
-
V
V
V
V
V
V
V
V
V
V
Recommended
Power Source
Unique
Feature
Ionization-Type
Smoke Detector
Battery
High Input Impedance
FET Comparator
Ionization-Type
Smoke Detector
with Interconnect
Battery
V
Line
-
Photoelectric-Type
Smoke Detector
with Interconnect
Battery
Function
Line
Photo Amplifier
Battery
Line
Ionization-Type
Smoke Detector
Battery
Ionization-Type
Smoke Detector with
Interconnect
Battery
V
(1)
Line
Photo Amplifier
Temporal Pattern
High Input Impedance
FET Comparator
Temporal Pattern
V
(1)
Complies
with
UL217
and UL268
Device
Number
Suffix!
Package
V
V
V
V
V
MC14467-1
P1/646
MC14578
P/648
V
V
V
V
MC145011
V
MC14468
MC14470
MC145010
P/648,
DW1751G
MC145012
MC145013
MC145017
P/648
MC145018
(1) Low-supply detector.
Motorola Master Selection Guide
4.10-3
Analog and Interface Integrated Circuits
Other Analog Circuits Package Overview
CASE 626
P1 SUFFIX
CASE 751
DSUFFIX
Analog and Interface Integrated Circuits
•
CASE 646
N, P, P1 SUFFIX
CASE 751A
DSUFFIX
4.10-4
•
CASE 648
PSUFFIX
CASE 751G
DWSUFFIX
Motorola Master Selection Guide
Tape and Reel Options
In Brief ...
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick-and-place equipment.
The packaging fully conforms to the latest EIA-481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel-back cover tape.
Motorola Master Selection Guide
Page
Tape and Reel ................................ 4.11-2
Analog MPQTable ............................ 4.11-4
4.11-1
Analog and Interface Integrated Circuits
Tape and Reel
Mechanical Polarization
SOIC DEVICES
PLCC DEVICES
User Direction of Feed
User Direction of Feed
DPAK DEVICES
Typical
User Direction of Feed
Tape Width
(mm)
Devlcell)
per Reel
ReetSlze
(inch)
Device
Suffix
SO-S, SOP--8
S0-14
S0-16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO-16L, SO-S+8L WIDE
SO-20LWIDE
S0-24L WIDE
S0-28L WIDE
S0-28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
PLCC-20
PLCC-28
PLCC-44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC-52
PLCC-68
PLCC-64
32
44
44
500
250
250
13
13
13
R2
R2
R2
T0-226AA (TQ-92)(2)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
2,500
13
RK
Package
(1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
(2) Integrated circuns in T0-226AA packages are available in Styes A and E only, with optional "Ammo Pack" (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering infonnation please contact your local Motorola Semiconductor Sales Office.
Analog and Interface Integrated Circuits
4.11-2
Motorola Master Selection Guide
Tape and Reel
(continued)
TO-92 Reel Styles
STYLE A
(Preferred)
Feed
STYLE E
Feed
~-:::>"':r-------_----.J
Rounded side of transistor and adhesive tape visible.
Flat side of transistor and adhesive tape visible.
TO-92 Ammo Pack Styles
STYLE P
(Preferred)
STYLEM
Adhesive Tape On
TopSide
Adhesive Tape On
Top Side
Rounded Side
Flat Side
Carrier
Strip
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Rounded side of transistor and
adhesive tape visible.
Style P ammo pack is equivalent to Styles A and 8 of reel pack
dependent on feed orientation from box.
Motorola Master Selection Guide
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
4.11-3
Analog and Interface Integrated Circuits
Analog MPQ Table
TapeIReel and Ammo Pack
I
Package Type
Package Code
MPQ
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
5OD/reel
500/reel
Case 751
Case 751A
Case 7518
Case 751G
Case 7510
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
4.11-4
Motorola Master Selection Guide
PLCC
SOIC
T0-92
Analog and Interface Integrated Circuits
Communications, Power and
Signal Technologies Group Products
In Brief . ..
Page
Many leading semiconductor manufacturers have either
de-emphasized or eliminated discrete components from
their product portfolio. At Motorola, exceptional long-term
growth and outstanding customer acceptance of our
portfolio are the most significant effects of Motorola's
superiority in providing bipolar and MOS transistors, diodes,
thyristors, zeners, opto, RF, rectifier, and sensor devices.
Consistent, ongoing improvements in product
development and packaging processing continue to ensure
Motorola's position as the most broad-based discrete
supplier in the world. The increased use of automatic
placement equipment has driven the trend towards surface
mount packaging.
Motorola continues to expand upon a broad offering of
discrete surface mount packages which continue to
advance state-of-the-art designs that cannot be
accomplished with insertion technology. Surface mount
technology is cost effective, allowing users the opportunity
to utilize smaller units and increased functions with less
board space. In many electronic applications, complex
integrated solutions with a multitude of functions can replace
several active and passive components.
SMARTDISCRETES, RF hybrid amplifiers and modules
and RF monolithic integrated circuits, pressure and
temperature sensors, optoelectronics and hybrid power
modules are a few of the exciting new products which
provide more reliable, intelligent discrete devices. Key
initiatives to raise products and services to a Six Sigma
standard (99.9997% defect-free), reduce total cycle time in
all activities, and provide leadership in the areas of product
and manufacturing ensure that Motorola will continue to be
the manufacturer of choice for all your discrete
semiconductor requirements.
Motorola Master Selection Guide
Small Signal Transistors, FETs and Diodes
5.1-1
TVS/Zeners
TranSient Voltage Suppressors
Zener Regulator and Reference Diodes ......... 5.2-1
Hybrid Power Module Operation .................. 5.3-1
TMOS Power MOSFETs Products ................ 5.4-1
Bipolar Power Transistors ....................... 5.5-1
Rectifiers ...................................... 5.6-1
Thyristors and Triggers .......................... 5.7-1
Optoelectronic Devices .......................... 5.8-1
Sensors ....................................... 5.9-1
RF Products .................................. 5.10-1
Surface Mount Information ...................... 5.11-1
Tape and Reel Specifications
and Packaging Specifications .................. 5.12-1
5.0-1
Communications, Power and
Signal Technologies Group Products
Communications. Power and
Signal Technologies Group Products
5.0-2
Motorola Master Selection Guide
Small Signal Transistors,
FETs and Diodes
In Brief ...
New in this revision is Motorola's GreenLine™ portfolio of
devices. They feature energy-conserving traits superior to
those of our existing line of standard parts for the same
usage. GreenLine devices can actually help reduce the
power demands of your products.
Also, this section highlights semiconductors that are
the most popular and have a history of high usage for the
most applications.
It covers a wide range of Small Signal plastic and
metal-can semiconductors.
A large selection of encapsulated plastic transistors,
FETs and diodes are available for surface mount and
insertion assembly technology. Plastic packages include
TO-92 (TO-226M), 1 Watt T0-92 (T0-226AE), SOT-23,
SC-59, SC-70/S0T-323 and SOT-223. Plastic multiples
are available in 14-pin and 16-pin dual in-line packages for
insertion applications: SO-8, S0-14, and S0-16 for
surface mount applications.
Metal-can packages are available for applications
requiring higher power dissipation or having hermetic
requirements in TO-18 (T0-206AA) and T0-39
(T0-205AD).
Motorola Master Selection Guide
Page
Bipolar Transistors ............................. . 5.1-2
Plastic-Encapsulated Transistors ............. . 5.1-2
Plastic-Encapsulated Multiple Transistors ...... . 5.1-8
Plastic-Encapsulated Surface
Mount Transistors .......................... 5.1-10
Metal-Can Transistors ...................... 5.1-17
Field-Effect Transistors ........................ 5.1-19
JFETs ..................................... 5.1-19
MOSFETs ................................. 5.1-21
Surface Mount FETs ........................ 5.1-22
Tuning and Switching Diodes ................... 5.1-24
Tuning Diodes - Abrupt Junction ............. 5.1-24
Tuning Diodes - Hyper-Abrupt Junction ...... 5.1-28
Hot-Carrier (Schottky) Diodes . . . . . . . . . . . . . . .. 5.1-32
Switching Diodes ........................... 5.1-34
Multiple Switching Diodes .................... 5.1-38
GreenLine Devices ............................ 5.1-40
5.1-1
Small Signal Transistors, FETs and Diodes
l
Bipolar Transistors
1
23
ASE 29-05
TQ-226AE
1-WATT (TQ-92)
Plastic-Encapsulated
Transistors
Motorola's Small Signal TO-226 plastic transistors
encompass hundreds of devices with a wide variety of
characteristics for general-purpose, amplifier and switching
applications. The popular high-volume package combines
proven reliability, performance, economy and convenience to
provide the perfect solution for industrial and consumer design
problems. All devices are laser marked for ease of
identification and shipped in antistatic containers, as part of
Motorola's ongoing practice of maintaining the highest
standards of quality and reliability.
1
J
23
ASE29-G4
TQ-226AA
(TQ-92)
Table 1. Plastic-Encapsulated General-Purpose Transistors
These general-purpose transistors are designed for small-signal amplification from dc to low ratio frequencies. They are
also useful as oscillators and general-purpose switches. Complementary devices shown where available (Tables 1-4).
NPN
PNP
V(BR)CEO
Volts
Min
fT@lc
MHz
Min
Case 29-04 - T0-226AA (T0-92)
MPSB099
MPSA06
MPS8599
MPSA56
2N4410
BC546
BC546A
BC546B
MPSA05
BC182
BC237B
BC337
BC547
BC547A
BC547B
BC547C
MPSA20
BC556
BC556B
MPSA55
MPS2907A
BC212
BC307B
BC327
BC557
BC557A
BC557B
BC557C
MPSA70
-
MPS2222A
2N4401
2N4403
2N4400
2N4402
MPS6602
MPS6652
2N3903
2N3905
2N3904
2N3906
BC548
BC548A
BC548B
BC548C
2N4123
2N4124
BC338
BC558B
2N4125
2N4126
BC328
80
80
80
65
65
65
60
60
50
45
45
45
45
45
45
40
40
40
40
40
40
40
30
30
30
30
30
25
25
I
150
100
60
150
150
150
100
200
200(1)
150
210(1)
150
150
150
150
125
300
200
150
100
200
250
300(1)
300(1)
300(1)
300
200
250
210(1)
hFE @IC
mA
IC
mA
Max
Min
10
10
10
10
10
10
10
50
10
10
10
10
10
10
10
5.0
20
20
20
50
10
10
10
10
10
10
10
10
10
500
500
250
100
100
100
500
600
100
100
800
100
100
100
100
100
600
600
600
1000
200
200
100
100
100
100
200
200
800
100
100
60
120
120
180
100
100
120
200
100
120
120
180
380
40
100
100
50
50
50
100
110
120
200
420
50
120
100
I
Max
300
400
450
220
450
-
300
500
460
630
800
220
450
800
400
300
300
150
150
300
800
220
450
800
150
360
630
I
mA
NF
dB
Max
Style
1.0
100
10
2.0
2.0
2.0
100
150
2.0
2.0
100
2.0
2.0
2.0
2.0
5.0
150
150
150
500
10
10
2.0
2.0
2.0
2.0
2.0
2.0
100
10
10
10
10
10
10
10
10
10
6.0
5.0
10
10
10
10
6.0
4.0
-
1
1
1
17
17
17
1
1
14
17
17
17
17
17
17
1
1
1
1
1
1
1
17
17
17
17
1
1
17
(1) Typical
Devices listed in bold, italic are Motorola preferred devices.
Small Signal Transistors, FETs and Diodes
5.1-2
Motorola Master Selection Guide
Plastic-Encapsulated Transistors (continued)
Table 1. Plastic-Encapsulated General-Purpose Transistors (continued)
NPN
PNP
Case 29-05 BDC01D
BDB01C
MPS6717
MPSW06
V(BR)CEO
Volts
Min
". @
MHz
Min
I
IC
hFE @IC
IC
A
rnA
Max
Min
200
200
200
200
200
0.5
0.5
0.5
0.5
0.5
40
40
40
80
80
I
Max
VCE(sat) @ IC @ IB
I
rnA
Volts
Max
100
100
100
50
50
0.7
0.7
0.7
0.5
0.4
I
I
rnA
rnA
Style
100
100
100
10
10
1
14
1
1
1
TO-226AE (1-WATT T0-92)
BDB02D
BDC02D
BDB02C
MPSW56
100
100
80
80
80
50
50
50
50
50
400
400
400
-
1000
1000
1000
250
250
Table 2. Plastic-Encapsulated Low-Noise and Good hFE Linearity
These devices are designed to use on applications where good hFE linearity and low-noise characteristics are required:
Instrumentation, hi-fi preamplifier.
hFE@ IC
NPN
PNP
Case 29--04 -
-
-
MPS6428
BC239
BC550B
BC550C
MPSA18
MPS3904
BC549B
BC549C
2N5088
2N5089(6)
MPS6521
(1)
(2)
(4)
(5)
(7)
(8)
V(BR)CEO
Volts
Min
I
Max
I
rnA
VT(4)
rnV
Typ
NF(5)
dB
Max
".
MHz
Typ
Style
TQ-226AA (TQ-92)
2N5087
2N5086
BC560B
BC560C
MPS3906
MPS4250
BC559B
BC559C
MPS6523
50
50
50
45
45
45
45
40
40
30
30
30
25
25
250
150
250
120
180
380
500
100
250
200
380
350
450
300
800
500
650
800
450
800
0.1
0.1
0.1
2.0
2.0
2.0
1.0
10
10
2.0
2.0
1.0
1.0
2.0
300
450
800
600
7.0(7)
9.5
-
2.0
3.0
3.5(8)
2.0(1)
2.5
2.5
6.5(1)
-
-
5.0
2.0
2.5
2.5
3.0
2.0
3.0
40(2)
40(2)
100(2)
280
250
250
160
200(2)
250
250
50
50
-
1
1
1
17
17
17
1
1
1
17
17
1
1
1
Typical
Min
VT: Total Input Noise Voltage (see BC4131BC414 and BC4151BC416 Data Sheets) at RS = 2.0 kn, IC = 200 )lA, VCE = 5.0 Volts.
NF: Noise Figure at RS = 2.0 k.Q, IC = 200)lA, VCE = 5.0 Votts. f = 30 Hz to 15 kHz.
Rs= 10 kO, BW= 1.0 Hz, f= 100 MHz
Rs = 5000, BW= 1.0 Hz, f = 10 MHz
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.1-3
Small Signal Transistors, FETs and Diodes
Plastic-Encapsulated Transistors (continued)
Table 3. Plastic-Encapsulated Darlington Transistors
Darlington amplifiers are cascade transistors used in applications requiring very high-gain and input impedance. These
devices have monolithic construction.
hFE@IC
NPN
PNP
V(BR)CEO
Volts
IC
Max
Min
I
I
Max
IT @ IC
VCE(sat) @ IC & IB
rnA
Volts
Max
100
100
100
200
100
100
100
100
100
20
1.5
1.1
1.5
1.1
1.5
1.5
1.5
1.5
1.5
1.0
I
rnA
I
rnA
Min
0.1
0.25
0.1
0.2
0.1
0.5
0.5
0.1
0.1
0.1
125
100
150
125
125
125
200(1)
I
rnA
Style
10
100
500
10
10
10
10
1
1
1
17
1
1
1
1
1
17
Case 29-05 - T0-226AE (1-WATT T0-92)
Case 29-04 - T0-226AA (T0-92)
MPSA29
BC373
MPSA27
BC618
2N6427
2N6426
MPSA77
MPSA75
-
-
MPSA14
MPSA64
MPSA13
BC517
MPSA63
-
100
80
60
55
40
40
40
30
30
30
500
1000
500
1000
500
500
500
500
500
1000
160K
50K
200K
300K
-
10K
10K
10K
10K
10K
20K
30K
20K
10K
30K
-
100
250
100
200
100
500
500
100
100
100
Table 4. Plastic-Encapsulated High-Current Transistors
The following table is a listing of devices that are capable of handling a higher current range for small-signal transistors.
NPN
PNP
V(BR)CEO
Volts
Min
IT @ IC
MHz
Min
I
hFE @IC
rnA
IC
rnA
Max
Min
50
10
50
50
10
1000
500
2000
2000
1000
60
40
75
75
60
I I
VCE(sat) @ IC & IB
I
Max
rnA
Volts
Max
400
160
-
100
150
1000
1000
1000
0.3/0.5
0.5
0.5
0.5
0.5
rnA
I
rnA
Style
100
50
200
200
100
17
14
1
1
1
Case 29-05 - T0-226AE (1-WATT T0-92)
Case 29-04 - T0-226AA (TO-92)
BC489
BC639
BC490
BC640
MPS651
MPS751
MPS650
BC368
MPS750
BC369
80
80
60
40
20
200/150(1)
60
75
75
65
1000
500
2000
2000
1000
(1) Typical
Devices listed in bold, ~alic are Motorola preferred devices.
Small Signal Transistors, FETs and Diodes
5.1-4
Motorola Master Selection Guide
Plastic-Encapsulated Transistors (continued)
Table S. Plastic-Encapsulated High-Voltage Amplifier Transistors
These high-voltage transistors are designed for driving neon bulbs and indicator tubes, for direct line operation, and for
other applications requiring high-voltage capability at relatively low collector current. These devices are listed in order of
decreasing breakdown voltage (V(BR)CEO).
Device
Type
V(BR)CEO
Volts
Min
hFE@ IC
IC
Amp
Max
I
Min
rnA
Case 29-0S - TO-226AE (1-WATT TO-92) -
NPN
Case 29-0S - TO-226AE (1-WATT T0-92) -
PNP
IMPSW92 I
300
0.5
25
IT@IC
VCE(sat) @ IC & IB
Volts
Max
I
rnA
I
rnA
MHz
Min
I
Style
rnA
30
0.5
20
2.0
50
10
10
100
30
10
10
10
0.5
0.75
0.3
0.2
0.5
0.15
10
50
10
20
20
10
1.0
5.0
1.0
2.0
2.0
1.0
-
-
40
50
50
100
10
10
10
10
1
1
1
1
1
1
10
30
10
30
10
20
0.3
0.5
0.3
0.2
20
10
20
10
10
2.0
1.0
2.0
1.0
1.0
50
40
50
40
100
10
10
10
10
10
1
1
1
1
1
Case 29-04 - TO-226AA (T0-92) - NPN
BF844
MPSA44
2N6517
BF393
MPSA42
2N5551
400
400
350
300
300
160
0.3
0.3
0.5
0.5
0.5
0.6
50
40
30
40
40
80
Case 29-04 - TO-226AA (TO-92) BF493S
2N6520
MPSA92
2N6519
2N5401
350
350
300
300
150
0.5
0.5
0.5
0.5
0.6
PNP
40
30
40
45
60
Case 29-04 - TO-226AA (TO-92)
NPN
BF420
BF422
PNP
hFE@ IC
IT@lc
VCE(sat) @ IC & IB
V(BR)CEO
Volts
Min
IC
Amp
Cont
Min
rnA
Volts
Max
rnA
rnA
MHz
Min
rnA
Style
300
250
0.5
0.5
50
50
25
25
2.0
2.0
20
20
2.0
2.0
60
60
10
10
14
14
BF421
BF423
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.1-5
Small Signal Transistors, FETs and Diodes
Plastic-Encapsulated Transistors (continued)
Table 6. Plastic-Encapsulated RF Transistors
The RF transistors are designed for small-signal amplification from RF to VHF/UHF frequencies. They are also used as
mixers and oscillators in the same frequency ranges.
Device
Type
hFE@IC
IC
rnA
Max
V(BR)CEO
Volts
Min
Min
Case 29-04 - TO-226AA (T0-92) - NPN
BF224
MPSH24
MPSH20
MPSH07A(9)
MPS3866
MPSH11
MPSH10
BF199
BF959
MPSH17
MPS918
MPS5179
MPS3563
MPS6595
30
30
30
30
30
25
25
25
20
15
15
12
12
12
50
50
100
25
400
I
30
30
25
20
10
60
60
40
40
25
20
25
20
25
-
100
100
-
50
50
50
50
rnA
I
IT
VCE
V
MHz
Typ
10
10
10
10
5.0
10
10
10
10
10
10
1.0
10
5.0
600
400(2)
400(2)
400(2)
500(2)
650(2)
650(2)
750
600(2)
800(2)
600(2)
2000(3)
800
1200(2)
7.0
8.0
4.0
3.0
50
4.0
4.0
7.0
20
5.0
8.0
3.0
8.0
10
CRE/CRB
pF
Max
NF
dB
Typ
f
MHz
0.28
0.36
0.65
0.3
2.5
100
-
-
-
-
3.2(3)
-
0.9
0.65
0.35
0.65
0.9
1.7
100
-
2.5
3.0
6.0(3)
6.0(3)
5.0(3)
6.0(3)
1.7
1.3
35
200
200
60
200
60
-
-
Style
21
2
2
1
1
2
2
21
21
2
1
1
1
1
Case 29-04 - TO-266AA (T0-92) - PNP
Table 7. Plastic-Encapsulated High-Speed Saturated Switching Transistors
ton & toff @ IC
Device
Type
ns
Max
I
ns
Max
I
V(BR)CEO
Volts
Min
rnA
hFE@IC
Min
I
IT @ IC
VCE(sat) @ IC & IB
rnA
Volts
Max
I I
rnA
rnA
MHz
Min
I
rnA
Style
10
10
30
1
1
1
1
Case 29-04 - T0-226AA (TO-92) - NPN
2N4264
2N4265
MPS3646
MPS2369A
25
25
18
12
35
35
28
18
10
10
300
10
15
12
15
15
40
100
30
40
10
10
30
10
0.22
0.22
0.2
0.2
10
10
30
10
1.0
1.0
3.0
1.0
300
300
350
-
-
12
30
50
0.15
10
1.0
700
10
Case 29-04 - T0-226AA (T0-92) - PNP
IMPS4258 I
15
I
20
I
10
I
(2) Min
(3) Max
(9) AGC Capable
Devices listed in bold, ijalic are Motorola preferred devices.
Small Signal Transistors, FETs and Diodes
5.1-6
Motorola Master Selection Guide
Plastic-Encapsulated Transistors (continued)
Table 8. Plastic-Encapsulated Choppers
oeVlces
. are
Isted'In decreaslng vI(BR)EBO.
Device
Type
hFE @ IC
IC
Arnp(1)
Max
V(BR)EBO
Volts
Min
Min
Case 29-04 - TO-226AA (TQ-92) - NPN
I
for@IC
VCE(sat) @ IC & IB
rnA
Volts
Max
-12
-0.2
I
rnA
I
MHz
Min
rnA
I
rnA
Style
Case 29-{)4 - TQ-266AA (TQ-92) - PNP
I
MPS404A
I
-25
I
-150
I
30
-24
1.0
Table 9. Plastic-Encapsulated Telecom Transistors
These devices are special product ranges intended for use in telecom applications.
Device
Type
V(BR)CEO
Volts
PDrnW
25°C
Arnb
IC
rnA
Cont
hFE@IC@VCE
Min
Case 29-{)4 - TO-226AA (TQ-92) - NPN
I
Max
I
rnA
for
I
Volts
MHz
Min
Style
P2N2222A
PBF259,S(10)
Case 29-04 - TQ-226AA (TQ-92) - PNP
P2N2907A
PBF493,S(11)
(1) Typical
(1 0) "S" version, hFE Min 60 @ Ie 20 mA, VeE 10 v.
(ll)"S" version, hFE Min 40 @ Ie = 0.1 mA, veE = 1.0 V.
=
=
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.1-7
Small Signal Transistors, FETs and Diodes
Plastic-Encapsulated
Multiple Transistors
The manufacturing trend has been toward printed circuit
board design with requirements for smaller packages with
more functions. In the case of discrete components the use of
the multiple device package helps to reduce board space
requirements and assembly costs.
Many of the most popular devices are offered in the
standard plastic DIP and surface mount Ie packages. This
includes small-signal NPN and PNP bipolar transistors,
N-channel and P-channel FETs, as well as diode arrays.
1
CASE 646-06
(TO-116)
STYLE 1
CASE 751 B-05
50-16
STYLE 4
Specification Tables
The following short form specifications include Quad and Dual transistors listed in alphanumeric order. Some columns
denote two different types of data indicated by either bold or italic typeface. See key and headings for proper identification.
This applies to Table 10 and 11 of this section only.
KEY
Unit
Subscript
Po
TYPE NO.
10
Watts
One
Die
Only
VCE
Volts
Alphanumeric listing
type numbers
IC
Amp
Max
Gp
--+11---0 2,4
CASE 318E-04
SOT-223
3
STYLE 2
Typical Characteristics
Diode Capacitance versus Reverse Voltage
20
18
~ 16
"
~ 14
z
~ 12
~ 1~
II
w
32
28
z 24
~ 20
.......
I
ct.
.....
«
()
I
II
II
2
o
~
()
TA = 25°C
f= 1 MHz
6
Ci 4
,.:.
()
~
36
I
"'\
I
I
MM8Vl09LTl
MV209
[5
w
8
40
I I
I I
IMMIBV\O~G~~11
to-..
0.3
0.5
i'
2
3
5
10
,.:. 12
-
20
16
()
8
-
"""
3
30
10
30
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Diode Capacitance
Figure 2. Diode Capacitance
Small Signal Transistors, FETs and Diodes
5.1-28
100
Motorola Master Selection Guide
Tuning Diodes -
Hyper-Abrupt Junction (continued)
40
10
"
UJ
a
z
oi"
if
9
\.
~ 32
24
~
w
"
a
z
i\
(§ 16
a
w
o
w
o
a
MMBV809LT1
I".....
.......
3
o
f-
.......
4
a
.........
o
i'..
i"
o
if
«
MMBV409LT1
MV409
,
-
i'--
f-
a
a
o
1
1
o0.5
10
20
VR, REVERSE VOLTAGE (VOLTS)
4 5
Figure 3. Diode Capacitance
40
~
36
32
a
28
w
o~
........
......
24
20
if
«
~
o
f-
a
i"
0
if
f~1
............
r--....
8
I I I I
r--.....
3
5
10
a
0
,.: 10
....... l- i20
.......
a
o1
30
7
Figure 5. Diode Capacitance
Figure 6. Diode Capacitance
Each Die
~
500
.......
~
..........
..........
100
40
MVAM109/MV7005T1
......
z
i"
30
1000
500
w
20
VR, REVERSE VOLTAGE (VOLTS)
MVAM10S
a
10
VR, REVERSE VOLTAGE (VOLTS)
1000
u::s
MHz-
MMBV609LT1
" ......
0
4
1
........
20
w
0.5
r-....
30
«
0.3
40
z
a
TA ~ 25°C
f~ 1 MHz
o
~
w
a
MMBV3102LT1
.........
16
12
8
50
I I I I III
,
15
Figure 4. Diode Capacitance
I II
I II
r--
8 10
VR, REVERSE VOLTAGE (VOLTS)
~
oi"
..........
I'....
UJ
az
100
,
if
(§ 50
.......
f-
a
(§ 50
f-
a
10
10
4
3
7
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance versus Reverse Voltage
Figure S. Capacitance versus Reverse Voltage
Motorola Master Selection Guide
5.1-29
Small Signal Transistors, FETs and Diodes
Tuning Diodes -
Hyper-Abrupt Junction (continued)
MVAM115
MVAM125
1000
1000
500
500
u:::-
.......
.s
.......
w
~
~loo
o
u:::-
,
w
~
~ 100
~
i3
cf
«
<-:f-
"' "-
.s
cf
50
<3,.:.
....... I-
o
10
2
50
r- r-
o
6
10
14
VR. REVERSE VOLTAGE (VOLTS)
10
18
Figure g. Capacitance versus Reverse Voltage
2
.s
~
~
i3
......
.....
.......
100
cf
<3
=
c........
........
J'..
1= 1= MVl405
50 t--
w
~
Cl
,.:.
o
26
TA-25°C
1=1 MHz _
~
200
10
14
18
22
VR. REVERSE VOLTAGE (VOLTS)
Figure 10. Capacitance versus Reverse Voltage
500
u:::- 3O0
6
30 t - - r- MVl403
20
/
'"I" r-...r-.., ..... r-.. ..... r-..,
/
r-..
r-.: r::--
r-.. r-..
1/
I
10 t - - r- MVl404
MV7404Tl
2
3
4
5
6
7
VR. REVERSE VOLTAGE (VOLTS)
10
8
Figure 11. Diode Capacitance versus Reverse Voltage
Table 44. Hyper-Abrupt Tuning Diodes for Telecommunications - Single
The following is a listing of hyper-abrupt tuning diodes intended for high frequency. FM radio. and TV tuner applications.
Or @ VR (f =1.0 MHz)
pF
Min
Device
I I
pF
Max
Cap Ratio @ VR
Volts
Min
25
3.0
3.0
2.0
3.0
3.0
J I
Q
3.0V 150 MHz
Min
Max
Max
Volts
4.0
5.0
1.5
1.8
4.5
6.5
6.5
1.9
2.6
3125
3/25
-
2/8
3/25
200
200
200
300
200
5.0
6.5
3/25
200
V(BR)R
Volts
Device
Marking
Case
Style
CV
Curve
Fig
30
30
20
20
30
M4E
M4A
X5
5K
M4C
8
8
8
8
8
1
2
3
4
5
30
M4A
8
Case 182-02 - TQ-226AC (TQ-92)
MV209
MV409
MMBV105GLT1
MMBV109LTf
MMBV409LT1
MMBV809LT1
MMBV3102LTl
1.5
26
26
4.5
20
2.8
32
32
6.1
25
318
-
Case 419-02 - SC-70/S0T-323
IMBV109T1
I
26
I
32
Devices listed in bold. italic are Motorola preferred devices.
Small Signal Transistors. FETs and Diodes
5.1-30
Motorola Master Selection Guide
Tuning Diodes -
Hyper-Abrupt Junction (continued)
Table 45. Hyper-Abrupt Tuning Diodes for Communications - Dual
=1.0 MHz)
CT @ VR (f
Device
pF
Min
I I
pF
Max
Cap Ratio @ VR
Volts
Min
3.0
1.8
I I
Q
Max
Volls
3.0V
Min
2.4
3/8
250
150MHZ
Max
V(BR)R
Volts
Device
Marking
Case
Style
CV
Curve
Fig
20
5L
9
6
Case 318-08 - TO-236AB (SOT-23)
IMMBV609L-r1
26
32
Table 46. Hyper-Abrupt Tuning Diodes for Low Frequency Applications - Single
The following is a listing of AM, hyper-abrupt tuning diodes that have a large capacity range and are designed for low
frequency circuit applications.
CT@ 1.0 MHz
Device
pF
Min
I
pF
Max
. Case 182-02- TO-226AC (T0-92)
MVAM10B
MVAM109
MVAM115
MVAM125
440
400
440
440
i
560
520
560
560
Cap Ratio@VR
Volts
Min
1.0
1.0
1.0
1.0
15
12
15
15
-'
Volts
V(BR)R
Volts
Style
1.0/8.0
1.0/9.0
1.0/15
1.0/25
12
15
18
28
1
1
1
1
CV
Curve
Figure
7
8
9
10
Table 47. Hyper-Abrupt High Capacitance Voltage Variable Diode - Surface Mount
The following are high capacitance voltage variable diodes intended for low frequency applications and circuits requiring
large tuning capacitance.
CT @ f
Device
Min
pF
IR
nA
V(BR)R
Volls
Case 318E-04- SOT-223
=1.0 MHz
I
Max
pF
Cap Ratio
Min
Q
Min
Slyle
CV
Curve
Figure
Pinout: 1-Anode, 2, 4-Cathode, 3-NC
MV7005T1
MV7404T1
Table 48. Hyper-Abrupt High Capacitance Tuning Diodes - Axial Lead Glass Package
CT@VR
Device
pF
Min
I
pF
Max
Case 51-02 - DO-204AA (00-7)
MV1404
MV1403
MV1405
96
140
200
144
210
300
I
Volls
Cap Ralio
C2IC10
Min
Q
2.0 V, 1.0 MHz
Min
V(BR)R
Volts
Style
CV
Curve
Figure
2.0
2.0
2.0
10
10
10
200
200
200
12
12
12
1
1
1
11
11
11
(26) VR = 1.0VNR =9.0 V
(27) VR = 2.0 VNR = 10 V
(28) VR = 1.0 V, f = 1.0 MHz
(29) VR = 2.0 V, f = 1.0 MHz
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.1--31
Small Signal Transistors, FETs and Diodes
II
Hot-Carrier
(Schottky) Diodes
1
~
STYLE 1
1 0--114----0 2
Cathode
1~3
1
CASE 318-0S
To-236AB
SOT-23
•
10
STYLE 9
STYLE 19
l o
3
COMMON CATHODE
~0.9
~
.90
w
(.)
Z
;'!:
[5
............
0.8
r--.....
ct:
t5
li 0.7
-
l"'t l"' 02
b SERIES
3
2.8
I
- TA = 25°C -
I
2
~
.90
w
(.)
z 1.6
;'!:
----
ct:
100
70
50
30
fi)
16 OHMS
300
....
-
a.
::;;
\ ...... .... i-'
-
30
IIII
~
:::;;..- .......... i-'
fZ
W
a:
a:
40HMS
::>
I
f-
::>
a.
5.0
::>
3.0
'"
a.
«
w
100
"
...... ~ i--'"
... i-'
i-'
(J
a
50
g~MS
10
160HMS
........
f-
30
40HMS
300
500
1000
V" ........ .... ...
V
1.0
10
V'
30
OUTPUT POWER (WAITS)
50
100
300
500
1000
OUTPUT POWER (WAITS)
Another important parameter that must be considered before selecting the output transistors is the
devices must withstand. For a complete discussion see Application Note AN485.
saf~perating
area these
Table 8. Recommended Power Transistors for Audio/Servo Loads
RMS
Power
Output
T025W
25 to 50W
50 to 100W
Over 100W
IT
PD
Watts
NPN
PNP
Case
@25'C
VCEO
hFE@
MinIMax
IC
Amps
MHz
Typ
ISB
Volts/Amps
MJE15030
MJE15031
T0-220
50
150
20 min
4
30
14/3.6
MJE15032
MJE15033
T0-220
50
250
50 min
1
40
50/1
2N3055A
MJ2955A
TO-204
120
120
20170
4
3
60/2
MJ15001
MJ15002
T0-204
200
140
25/150
4
3
40/5
MJ15015
MJ15016
T0-204
180
120
20/70
4
3
60/3
MJ15003
MJ15004
TO-204
250
140
25/150
5
3
100/1
MJ15020
MJ15021
TO-204
150
250
30 min
1
20
50/3
MJ15024
MJ15025
TO-204
250
250
15/60
8
8
80/2.2
MJ3281A
MJL3281A
MJ21194
MJL21194
MJ1302A
MJL1302A
MJ21193
MJL21193
T0-204
340G-Ql
T0-204
340G-Ql
250
150
250
200
200
200
250
200
60/175
60/175
25/75
25/75
7
7
30
30
8
8
7
7
50/4
40/4
100/2
100/2
The Power Transistors shown are provided for reference only and show device capability. The final choice of the Power Transistors used is left to the circuit designer and depends upon the particular safe-operating area required and the mounting and heat
sinking configuration used.
Motorola Master Selection Guide
5.5-15
Bipolar Power Transistors
Electronic Lamp Ballasts
As in many other areas of its semiconductor activity,
Motorola is an industry leader in the fast growing market of
Electronic Ballast Semiconductors. We introduced the first
dedicated devices for this market in 1988. Today, devices
based on advanced technologies such as H2BIP (High Gain,
High Frequency Bipolar) and ZPCMOS (Zero Power Control
MOS) are leading the way in providing benefits for ballast
manufacturers, consumers and the environment.
Two factors make the Electronic Lamp Ballast market grow
at an ever increasing rate - Economics and the Environment.
Lamps based on Electronic Ballasts have long lifetimes
and very low power consumption, so contributing to the
efficient use of energy and to preservation of the environment.
Motorola designs silicon solutions specifically for these
applications.
For this growing ballast market Motorola offers optimized
devices such as Power MOSFETs, Bipolar Transistors, Linear
drive ICs, custom Start-Stop ICs, Diodes and Silicon Bilateral
Switches.
Even more important are our efforts to develop the
technology for tomorrow in close cooperation with the world's
leading manufacturers of Electronic Transformers and Lamp
Ballasts, as well as assisting them today in their choice of
technology.
This capability is driven from our centre of competence
based in Toulouse, France. An importantteam of Applications,
Design, Product, Manufacturing and Marketing Engineers
drives our worldwide dedication to this market.
The intention of this section is to provide you with a
'snapshot' of our bipolar transistor products and capabilities.
It is a document showing Motorola's professionalism in this
area, and illustrating some of the expertise available to youthe Electronic Lamp Ballast manufacturer.
World Lamp Ballast Market
Bipolar Power Transistors
5.5-16
Motorola Master Selection Guide
Cross Reference Transistors for Electronic Lamp Ballasts
Industry
Part Number
2SC4053
2SC4546
2SC4630
2SC4820
BU1706A
BU1708A
BUD43B-1
BUF610
BUF654
BUH100
BUH150
BUH50
BUH51
BUL 146
BUL 146F
BUL147
BUL147F
BUL213
BUL216
BUL381
BUL38D
BUL410
BUL416
BUL43B
BUL44
BUL44D2
BUL44F
BUL45
BUL45D2
BUL45F
BUL48
BUL510
BUL57
BUL67
BUL810
BUL87
BULD215
Motorola
Direct
Replacement
Motorola
Nearest
Replacement
Industry
Part Number
MJE18004
BUL 146F
MJF18004
MJF18002
MJE18604D2
MJE18604D2
BULD50
BULD85
BUT11AF
BUT18
BUT93
BUT93D
BUV46
KSC5021F
KSC5027F
MJD13003-1
MJE13003
MJE13005
MJE13007
MJE13009
MJE18002
MJE18004
MJE18004D2
MJE18006
MJE18008
MJE18009
MJE18204
MJE18206
MJE18604D2
MJF18002
MJF18004
MJF18006
MJF18008
MJF18009
MJF18204
MJF18206
TD13003
TD13004
TE013005D
TE013007
TE013003
TE013005
TE013009
BUD43B-1
MJE18004D2
BUL146
BUH100
BUH1'50
BUH50
BUH51
BUL146
BUL146F
BUL147
BUL147F
MJE18204
MJE18206
BUL45
BUL45D2
MJE18006
MJE18604D2
BUL43B
BUL44
BUL44D2
BUL44F
BUL45
BUL45D2
BUL45F
Motorola Master Selection Guide
MJE18004D2
MJE18004D2
BUL 147
BUL147
BUV48A
BUL147
BUL45D2
5.5-17
Motorola
Direct
Replacement
Motorola
Nearest
Replacement
BUL44D2
BUL45D2
MJF18004
BUH100
BUL45
BUL44D2
MJE18006
MJE18004
MJE18604D2
MJE13003-1
MJE13003
MJE13005
MJE13007
MJE13009
MJE18002
MJE18004
MJE18004D2
MJE18006
MJE18008
MJE18009
MJE18204
MJE18206
MJE18604D2
MJF18002
MJF18004
MJF18006
MJF18008
MJF18009
MJF18204
MJF18206
MJD13003-1
BUF43B-1
BUL44D2-1
MJE13007
MJE13003
MJE13005
MJE13009
Bipolar Power Transistors
Cross Reference Transistors for Electronic Lamp Ballasts
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITIER
4.
COLLECTOR
~~
\~,~,.~
3
(T0-220AB)
Table 9. TO-220AB Bipolar Transistors
Inductive Switching
@ IC Operating
Tsi MiniMax (~s)
Po (Case)
ICCont
Amps
Max
VCEO(sus)
Volts
Min
2
350
650
BUL43B
0.8
9
1.8/3.3
40
400
700
BUL44
0.8
10
2.6/3.8
50
VCES
Volts
Min
OeviceType
IC
Operating
Amps
hFE min
@ IC Operating
VCE= 1 V
Walls
@25'C
400
700
BUL44D2'
0.8
20
2.05/2.35
50
450
1000
MJE18002
1
6
/2.75
50
4
500
800
BUH50
2
8 typ
/2.5
50
5
400
700
BUL45
2
7
2.6/3.8
75
400
700
BUL45D2'
2
10
1.95/2.25
75
450
1000
MJE18004
2
6
/2.5
75
450
1000
MJE18004D2'
2
6
2.1/2.4
75
550
1200
MJE18204
2
5
/2.75
75
600
1600
MJE18604D2'
0.5
15
/1.0
75
100
6
8
10
15
400
700
450
1000
400
700
BUL146
3
8
2.6/3.8
MJE18006
3
6
/3.2
100
BUL147
4.5
8
2.6/3.8
125
450
1000
MJE18008
4.5
6
/3.2
125
550
1200
MJE18206
3
5
/2.75
100
400
700
BUH100
5
/3.0
100
450
1000
MJE18009
7
8
/2.75
150
400
700
BUH150
10
8 typ
/2.75
150
10typ
BUHXXX Senes are specified for Halogen applications.
suffix indicates transistor with built in C-E freewheeling diode and antisaturation network.
* 02
Bipolar Power Transistors
5.5-18
Motorola Master Selection Guide
Cross Reference Transistors for Electronic Lamp Ballasts
I'l.
CASE 2210-02
_.
TO-220~ype
Isolated
UL Recognized
File #E69369
Table 10. Isolated T0-220 Bipolar Transistors
ICCont
Amps
Max
VCEO(sus)
Volts
Min
2
400
700
450
1000
400
700
450
550
5
6
8
10
VCES
Volts
Min
OeviceType
BUL44F
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
1
2
3
IC
Operating
Amps
0.8
@
hFE min
IC Operating
VCE= 1 V
Inductive Switching
@ IC Operating
Tsi MiniMax (~s)
10
Po (Case)
Watts
@25'C
2.6/3.8
25
MJF18002
1
6
BUL45F
2
7
2.6/3.8
/2.75
1000
MJF18004
2
6
/2.5
35
1200
MJF18204
2
5
/2.75
40
25
35
400
700
BUL146F
3
8
2.6/3.8
40
450
1000
MJF18006
3
6
/3.2
40
400
700
BUL 147F
4.5
8
2.6/3.8
45
450
1000
MJF18008
4.5
6
/3.2
45
550
1200
MJF18206
5
6
/2.75
45
450
1000
MJF18009
7
8
/2.75
50
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
Table 11. DPAK Bipolar Transistors
Inductive Switching
@ IC Operating
Tsi MinIMax (~s)
ICCont
Amps
Max
VCEO(sus)
Volts
Min
VCES
Volts
Min
2
350
650
BUD43B-1
0.8
9typ
1.8/3.3
25
400
700
BUD44D2-1*
0.8
20typ
2.05/2.35
25
OeviceType
IC
Operating
Amps
hFEmin
@ IC Operating
VCE= 1 V
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
Po (Case)
Watts
@25'C
STYLE 3:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
~
3 21
Table 12. Case 77 (TO-22S) Bipolar Transistors
CASE 77-08
(TO-225AA)
ICCont
Amps
Max
VCEO(sus)
Volts
Min
VCES
Volts
Min
1.5
400
700
MJE13003
1
6typ
/3.0
40
4
400
700
BUH51
1
8
/3.75
50
OevlceTYpe
IC
Operating
Amps
hFE min
@ IC Operating
VCE= 1 V
Inductive Switching
@ IC Operating
Tsi MinIMax (~s)
Po (Case)
Watts
@25'C
BUHXXX Series are specified for Halogen applications .
• 02 suffix indicates transistor with bui~ in C-E freewheeling diode and antisaturation network.
Motorola Master Selection Guide
5.5-19
Bipolar Power Transistors
Bipolar Power Transistors
5.5-20
Motorola Master Selection Guide
Rectifiers
In Brief ...
Continuing investment in research and development for
discrete products has created a rectifier manufacturing facility
that matches the precision and versatility of the most advanced
integrated circuits. As a result, Motorola's silicon rectifiers span
all high tech applications with quality levels capable of passing
the most stringent environmental tests ... including those for
automotive under-hood applications. Additionally, the
introduction of Motorola's first generation GaAs power devices
is pushing the limits of today's rectifier technology.
Page
Rectifier Numbering System ..................... 5.6-2
Application Specific Rectifiers . . . . . . . . . . . . . . . . . . .. 5.6-3
Low VF Schottky ............................ 5.6-3
MEGAHERTZ ............................... 5.6-3
SCANSWITCH .............................. 5.6-3
Automotive Transient Suppressors ............. 5.6-3
SWITCHMODETM Rectifiers . . . . . . . . . . . . . . . . . . . . .. 5.6-4
Surface Mount Schottky ...................... 5.6-4
Axial Lead Schottky . . . . . . . . . . . . . . . . . . . . . . . . .. 5.6-6
T0-220 Type Schottky ....................... 5.6-7
T0-218 Types and TO-247 Schottky ........... 5.6-8
POWERTAP II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.6-9
Ultrafast Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.6-10
Surface Mount Ultrafast. . . . . . . . . . . . . . . . . . . . .. 5.6-10
Axial Lead Ultrafast ......................... 5.6-10
T0-220 Type Ultrafast ...................... 5.6-11
TO-218 Types and T0-247 Ultrafast .......... 5.6-12
POWERTAP II .............................. 5.6-12
Fast Recovery Rectifiers/General
Purpose Rectifiers ....................... 5.6-13
GaAs Rectifiers Power Manager™ ............... 5.6-14
Product Highlights:
• GaAs Rectifiers Power Manager™ with incredibly soft and
hyperfast «15 ns) reverse recovery are ideally suited for
high frequency power supplies, free wheeling diodes, and
as polarity protection diodes.
• Surface Mount Devices - A major thrust has been the
development and introduction of a broad range of power
rectifiers, Schottky and Ultrafast, 112 amp to 25 amp, 15 to
600 volts.
• Application Specific Rectifiers - MEGAHERlZTM series for high frequency power
supplies and power factor correction.
- Schottky rectifiers having lower forward voltage drop
(0.3 to 0.6 volts) for use in low voltage SMPS outputs
and as ''OR''ing diodes.
- Automotive transient suppressors.
• UHrafast rectifiers having reverse recovery times as low as
25 ns to complement the Schottky devices for higher
voltage requirements in high frequency applications.
• A wide variety of package options to match virtually any
potential requirement.
The rectifier selector section that follows has generally been
arranged by package and technology. The individual tables have
been sorted by voltage and current with the package types for
the devices listed shown above each table. The Application
Specific Rectifiers are also included in their respective tables.
Motorola's comm~ment to Six-Sigma is showing its worth.
Refined processes no longer produce fallout as such and
therefore only Motorola Preferred Devices are listed in the
tables. The non--preferred devices will continue to be offered, but
customers are encouraged to begin designing using the
preferred types.
Motorola Master Selection Guide
5.6-1
Rectifiers
RECTIFIER NUMBERING SYSTEM
xx
PART NUMBER KEY
PREFIX~~
I
10
(TYPE DESIGNATOR)
F = FULLY ISOLATED
S = SURFACE MT (SMB/SMC)
D= DPAK
B = D2PAK
H = MEGAHERTZ
V= D3PAK
xx
I
VR
xxx
II
(X10 EXCEPT
SCHOTIKY)
R = REVERSE
L= LOWVF
E = ENERGY
SUFFIX
(DUAL DESIGNATOR)
PREFIX KEY
MUR =
MBR =
MGR =
MR =
SUFFIX KEY
CT = CENTER TAP (DUAL) TO-220, TO-3, POWERTAP II
PT = CENTER TAP (DUAL) TO-218 PACKAGE
WT = CENTER TAP (DUAL) TO-247 / TO-3P
EXAMPLE:
MOTOROLA ULTRA FAST RECTIFIER
MOTOROLA (SCHOTTKY) BARRIER RECTIFIER
MOTOROLA GaAs RECTIFIER
MOTOROLA STANDARD & FAST RECOVERY
MUR
MOTOROLA ULTRAFAST
EXAMPLE:
MBR
MOTOROLA SCHOTTKY
Rectifiers
30
20
WT
30 AMP
200 V
CENTER TAP (DUAL)
TO-247
30
45
WT
30 AMP
45V
CENTER TAP (DUAL)
TQ-247
5.6-2
Motorola Master Selection Guide
Application Specific Rectifiers
The focus for Rectifier Products continues to be on
Schottky and Ultrafast technologies, with process and
packaging improvements to achieve greater efficiency in high
frequency switching power supplies, and high current
mainframe supplies. Our new product thrust is intended to be
more "application specific" than in the past, while continuing
to strive for broad market acceptance.
Table 1. Low VF Schottky Rectifiers
State of the art geometry is used in low VF Schottky devices for improved efficiency in low voltage, high frequency switching
power supplies, free-wheeling diodes, polarity protection diodes and "OR"ing diodes.
Device
MBR0520LT1
MBRS130LT3
MBRD835L
MBRD1035CTL
MBR2030CTL
MBRB2535CTL
MBR2535CTL
MBRB2515L
MBR2515L
MBRB3030CTL
MBR4015LWT
MBR5025L
MBRP20030CTL
MBRP60035CTL
10
Amps
VRRM
(Volts)
VF@ Rated 10
and Temperature
Volts (Max)
IR @ Rated VRRM
mAmps(Max)
0.5
1
8
10
20
25
25
25
25
30
40
50
200
600
20
30
35
35
30
35
35
15
15
30
15
25
30
35
0.33
0.395
0.41
0.41
0.48
0.41
0.41
0.42
0.42
0.58
0.42
0.58
0.39
0.50
0.25
1
1.4
6
5
10
5
15
15
5
5
0.5
5
10
Package
800-123
5MB
DPAK
DPAK
T0-220
D2pAK
T0-220
D2PAK
TO-220
D2pAK
T0-247
TO-218
POWERTAPII
POWERTAPII
Table 2. MEGAHERTZ Rectifiers
MEGAHERTZ Series - This group of ultrafast rectifiers is designed to provide improved efficiency in very high frequency
switching power supplies and for use in power factor correction circuits.
Maximum
Device
MURH840CTIMURHB840CT
MURH860CT
10
Amps
VRRM
(Volts)
VF@ Rated
10 and Temp.
(Volts)
8
8
400
600
1.7
2.0
IR @ Rated
VRRM
(mAmps)
t"
(Nanosecond)
0.01
0.01
28
28
Table 3. SCANSWITCH Rectifiers
These ultrafast rectifiers are designed for improved performance in very high resolution monitors and work stations where
forward recovery time (tfr) and high voltage (1200-1500 volts) are primary considerations.
Maximum
Device
MURBBOE
MUR10120E
MUR10150E
10
Amps
VRRM
(Volts)
tfr
(Nanoseconds)
8
10
10
800
1200
1500
175
175
-
t,r
(Nanoseconds)
75
175
175
VRFM (6)
(Volts)
14
16
Table 4. Automotive Transient Suppressors
Automotive transient suppressors are designed for protection against over-voltage conditions in the auto electrical system
including the "LOAD DUMP" phenomenon that occurs when the battery open circuits while the car is running.
Device
MR2535L1MR2535S
T
10
Amps
VRRM
(Volts)
V(BR)
(Volts)
IRSM(7)
(Amps)
ee)
35
20
24-32
110
175
(6)VRFM = Maximum Transient Overshoot Voltage.
(7)Time constant = 10 ms, Duty Cycle,; 1%, T C = 25°C.
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.6-3
Rectifiers
SWITCHMODETM Rectifiers
Schottky power rectifiers with the high speed and low
forward voltage drop characteristic of Schottky's metal/silicon
junctions are produced with ruggedness and temperature
performance comparable to silicon-junction rectifiers. Ideal
for use in low-voltage, high-frequency power supplies, and as
very fast clamping diodes, these devices feature switching
times less than 10 ns, and are offered in current ranges from
0.5 to 600 amperes, and reverse voltages to 200 volts.
In some current ranges, devices are available with junction
temperature specifications of 125°C, 150°C and 175°C.
Devices with higher TJ ratings can have significantly lower
leakage currents, but higher forward-voltage specifications.
These parameter tradeoffs should be considered when
selecting devices for applications that can be satisfied by more
than one device type number.
All devices are connected cathode-to-case or
cathode-to-heatsink, where applicable. Contact your
Motorola representative for more information.
Case 425
SOO-123
Case 4038-01
SMA
Cathode = Band
Cathode = Notch
There are many other standard features in Motorola
Schottky rectifiers that give added performance and reliability.
1. GUARDRINGS were pioneered by Motorola and are
included in all Schottky die for reverse voltage stress
protection from high rates of dv/dt to virtually eliminate the
need for snubber networks. The guard ring also operates like
a zener and avalanches when subjected to voltage transients.
2. MOLYBDENUM DISCS on both sides of the die
minimize fatigue from power cycling in all metal products.
Plastic encapsulated devices have a special solder
formulation for the same purpose.
3. QUALITY CONTROL monitors all critical fabrication
operations and performs selected stress tests to assure
constant processes. Motorola'S commitment to six sigma
has provided significant quality improvement.
Case403A
5MB
Case 403
SMC
• •
Cathode = Notch
Cathode = Notch
Table 5. Surface Mount Schottky Rectifiers
VRRM
(Volts)
10(1)
(Amperes)
10 Rating
Condition
Device
20
0.5
TL = 105°C
MBR0520LT1 *
30
0.5
TL = 105°C
MBR0530TH
40
0.5
TL = 110°C
MBR0540TH
30
1
TL = 100°C
MBRA130LT3*
40
1
TL = 100°C
30
1
40
1
100
MaxVF@iF
TC = 25°C
(Volts)
IFSM
(Amperes)
TJ Max
eC)
Package
0.310@0.1 A
0.385 @ 0.5A
5
125
SOO-123
0.375 @0.1 A
0.430 @ 0.5 A
5
125
SOO-123
0.53@ 0.5A
20
150
SOO-123
0.395 @ 1.0 A
-
125
SMA
MBRA140T3*
0.55 @ 1.0 A
-
125
SMA
TL = 120°C
MBRS130LT3
0.395 @ 1.0A
40
125
5MB
TL= 115°C
MBRS140T3
0.6 @ 1.0A
40
125
5MB
1
TL = 120°C
MBRS1100T3
0.75 @ LOA
40
150
5MB
40
3
TL = 100°C
MBRS340T3
0.525 @3.0A
80
125
SMC
60
3
TL = 100°C
MBRS360T3*
0.74 @3.0A
80
125
SMC
(1) 10 is total device current capability.
* New Product
Devices listed in bold, italic are Motorola preferred devices.
Rectifiers
5.6-4
Motorola Master Selection Guide
Case 433-{)1
03PAK
Case 418B
02PAK
Style 3
Case 369A
OPAK
Style 3
"CT" Suffix:
::J-0 4
Non-"CT" Suffix:
:~4
1.4
1~
3
3
Table 5. Surface Mount Schottky Rectifiers (continued)
MaxVF@ iF
TC = 25°C
(Volts)
IFSM
(Amperes)
TJ Max
(OC)
Package
MBRD340
0.60 @ 3.0A
75
150
OPAK
TC=125°C
MBRD360
0.60@ 3.0A
75
150
OPAK
TC = 130°C
MBRD640CT
0.70 @ 3.0A
75
150
OPAK
0.70 @ 3.0A
VRRM
(Volts)
10(1)
(Amperes)
10 Rating
Condition
40
3
TC=125°C
60
3
40
6
Device
60
6
TC = 130°C
MBRD660CT
75
150
OPAK
35
8
TC= 100°C
MBRD835L*
0.40 @ 3.0A
0.51 @ 8.0A
100
125
OPAK
35
10
TC = 90°C
MBRD1035CTU
0.49 @ lOA
100
125
OPAK
45
15
TC= 105°C
MBRB1545CT
0.84 @ 15A
150
150
02PAK
60
20
TC= 110°C
MBRB2060CT
0.95 @20A
150
150
02PAK
100
20
TC= 110°C
MBRB20100CT
0.85 @ 10A
0.95 @20A
150
150
02PAK
200
20
TC= 125°C
MBRB20200CT*
1.0@ 20A
150
150
02PAK
15
25
TC = 90°C
MBRB2515L*
0.45 @ 25 A
150
100
02PAK
35
25
Tc= 110°C
MBRB2535CTL
0.47 @ 12.5 A
0.55 @ 25A
150
125
02PAK
45
25
TC = 130°C
MBRB2545CT
0.82 @30A
150
150
02PAK
30
30
TC=115°C
MBRB3030CT*
0.51 @ 15A
0.62 @ 30A
300
150
02PAK
30
30
Tc = 95°C
MBRB3030CTL*
0.45@ 15A
0.51 @ 30A
150
125
02PAK
30
40
TC = 110°C
MBRB403~
0.46 @ 20 A
0.55 @ 40A
300
150
02PAK
30
70
TC
0.5 @ 35A
0.62 @ 70A
500
150
03PAK
=90°C
MBRV7030CTL
*
(1) 10 is total device current capability.
* New Product
Oevices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.6-5
Rectifiers
Case 26ic-{)~
cas~a;:~
"i
'~!
Cathode = Polarity Band
Cathode = Polarity Band
Table 6. Axial Lead Schottky Rectifiers
MaxVF@iF
TC=25'C
(Volts)
IFSM
(Amperes)
TJMax
('C)
Case
IN5817
0.45 @ 1.0A
25
125
59-04
TA=55'C
RaJA = 80'CIW
IN5818
0.55 @ 1.0A
25
125
59-{)4
1
TA=55'C
RaJA = 80'CIW
IN5819
0.60 @ 1.0A
25
125
59-{)4
60
1
TA=55'C
RaJA = 80'CIW
MBR160
0.75 @ 1.0 A
25
150
59-04
100
1
TA= 120'C
RaJA = 50'CIW
MBRII00
0.79 @ 1.0 A
50
150
59-04
20
3
TA = 76°C
RaJA = 28°CIW
IN5820
0.457 @ 3.0A
80
125
267-{)3
30
3
TA=71°C
RaJA = 28°CIW
IN5821
0.500@3.0A
80
125
267-{)3
40
3
TA=61'C
RaJA = 28'CIW
IN5822
0.525 @3.0A
80
125
267-{)3
40
3
TA=65'C
RaJA = 28'CIW
MBR340
0.600 @3.0A
80
150
267-{)3
60
3
TA=65°C
RaJA = 28'CIW
MBR360
0.740 @3.0A
80
150
267-{)3
100
3
TA= 100'C
RaJA = 28'CIW
MBR3100
0.79 @ 3.0A
150
150
267-{)3
VRRM
(Volts)
10
(Amperes)
10 Rating
Condition
20
1
TA=55'C
RaJA = 80'CIW
30
1
40
Device
Devices listed in bold, italic are Motorola preferred devices.
Rectifiers
5.6-6
Motorola Master Selection Guide
Case 221B
(TO-220AC)
4
S~\~
Case 221 A--u6
(TO-220AB)
I
30.,
. r1~2'/4
0
r
CATHODE
STYLE 6:
PIN 1. ANODE
2. NIA
3. ANODE
2. CATHODE
3. ANODE
4. CATHODE
4. CATHODE
1
Case 221E
1
23
'
a
Case 2210
STYLE 1:
PIN 1. CATHODE
2. N/A
3. ANODE
Jr
~ ST'f,\~t ANODE
..
2. CATHODE
3. ANODE
12'~
1
3
:>2
3
2
Table 7. TO-220 Type Schottky Rectifiers
MaxVF@iF
TC 25°C
(Volts)
=
IFSM
(Amperes)
TJ Max
eC)
15A
150
150
221A--u6
0.52@ lOA
0.58 @ 20A
150
150
221A--u6
VRRM
(Volts)
10
(Amperes)
10 Rating
Condition
45
15
TC = 105°C
MBR1545CT
0.84
30
20
TC= 13JOC
MBR2030CTL*
~
Device
@
Case
45
20
TC = 135°C
MBR2045CT
0.84 @20A
150
150
221A--u6
60
20
TC= 133°C
MBR2060CT
0.85 @ lOA
0.95 @ 20A
150
150
221A--u6
100
20
TC = 133°C
MBR20100cT
0.85@ lOA
0.95 @ 20A
150
150
221A--u6
200
20
TC= 125°C
MBR20200CT
15
25
TC=90°C
MBR2515L*
1.0@ 20A
150
150
221A--u6
0.45 @ 25 A
150
100
221A--u6
221A--u6
35
25
TC = 95°C
MBR2535CTL *
0.55 @ 25A
150
125
45
25
TC= 130°C
MBR2545CT
0.82@ 30A
150
150
221A--u6
45
30
TC = 130°C
MBR3045ST*
0.76 @ 30A
150
150
221A--u6
45
7.5
TC= 105°C
MBR745
0.84@ 15A
150
150
221B
45
10
TC= 135°C
MBR1045
0.84 @ 20A
150
150
221B
60
10
TC= 133°C
MBR1060
0.80@ lOA
150
150
221B
100
10
TC= 133°C
MBR10100
0.80@ lOA
150
150
221B
45
16
TC = 125°C
MBR1645
0.63 @ 16A
150
150
221B
45
15
TC= 105°C
~
MBRF1545CT
0.84@ 15A
150
150
ISOLATED
2210
45
20
TC= 135°C
~
MBRF2045CT
0.84
20A
150
150
ISOLATED
2210
60
20
TC= 133°C
~
MBRF2060CT
0.95 @ 20A
150
150
ISOLATED
2210
100
20
TC= 133°C
~
MBRF20100CT
0.95
20A
150
150
ISOLATED
2210
200
20
TC= 125°C
~
MBRF20200CT
1.0@ 20A
150
150
ISOLATED
2210
45
25
TC= 125°C
~
MBRF2545CT
25A
150
150
ISOLATED
2210
45
7.5
TC = 105°C
MBRF745*
0.84@15A
150
150
ISOLATED
221E
45
10
TC= 135°C
MBRF1045*
0.84@ 20A
150
150
ISOLATED
221E
Indicates UL Recognized -
* New Product
0.82
@
@
@
File #E69369
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.6-7
Rectifiers
Case 340E
(TO-218)
Case 340D
(TQ-218AC)
l::to
2, 4
4
- ,
3
1
2
~f
4
STYLE 2:
PIN 1. ANODE 1
2. CATHODES
3. ANODE 2
4. CATHODES
'"
srr.1:i r3. CATHODE
ANODE
4. CATHODE
l::to
3
"
Case 340F
(TQ-247)
4
srr.7~~:
2.
3.
4.
ANODE 1
CATHODES
ANODE2
CATHODES
(BACK HEATSINK)
1
2
1
3
3
3
Table 8. T0-218 Types and TO-247 Schottky Rectifiers
Device
MaxVF@ iF
TC=2SoC
(Volts)
IFSM
(Amperes)
TJMax
eC)
Case
TC= 105°C
MBR3045PT
0.76@30A
200
150
340D
40
TC= 125°C
MBR4045PT
0.70@20A
0.80@40A
400
150
340D
45
60
TC = 125°C
MBR6045PT*
0.62 @ 30A
0.75 @60A
500
150
340D
25
50
TC = 125°C
MBRS02SL*
0.54 @30A
0.62 @50A
300
150
340E
45
30
TC= 105°C
MBR3045WT
0.76@30A
200
150
340F
15
40
TC= 125°C
MBR401SLWT
0.42 @20A
0.50 @40A
400
150
340F
45
40
TC= 125°C
MBR4045WT
0.70@20A
0.80 @40A
400
150
340F
45
60
TC = 125°C
MBR6045WT
0.62 @ 30A
0.75 @ 60A
500
150
340F
30
70
TC = 135°C
MBR7030WT
0.55 @ 35A
0.72 @ 70A
400
150
340F
VRRM
(Volts)
10
(Amperes)
10 Rating
Condition
45
30
45
* New Product
Devices listed in bold, italic are Motorola preferred devices.
Rectifiers
5.6-8
Motorola Master Selection Guide
Case 357C
POWERTApTM
Cathode = Mounting Plate
Anode = Terminal
Table 9. POWERTAP II
MaxVF@ iF
TC = 25'C
(Volts)
VRRM
(Volts)
10(1)
(Amperes)
10 Rating
Condition
30
200
TC = 125'C
MBRP20030CTL
TC= 125'C
MBRP20045CT
(1)
Device
*
45
200
60
200
TC = 125'C
45
300
TC = 120'C
*
MBRP20060CT*
MBRP30045CT*
60
300
TC= 120'C
MBRP30060CT
35
600
TC= 100'C
MBRP60035CTL
*
*
IFSM
(Amperes)
TJ Max
('C)
0.52 @ 100A
0.60 @200A
1500
150
357C
0.78
Case
100A
1500
175
357C
0.800 @ 100A
1500
175
357C
0.70 @ 150A
0.82 @ 300 A
2500
175
357C
0.79 @ 150A
0.89 @300A
2500
175
357C
0.57 @ 300 A
4000
150
357C
@
10 IS total device current capability.
All POWERTAP devices were converted to the new, more rugged, POWERTAP II configuration beginning January 1994. Contact your Motorola representative
for more details.
* New Product
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.6-9
Rectifit;lrs
Ultrafast Rectifiers
Case403A
5MB
Case 403
SMC
Case 369A
OPAK
Style 3
• •
Cathode = Notch
Case 418B
02PAK
Style 3
"CT" Suffix:
Non-"CT" Suffix:
31~4
~-
Cathode = Notch
Table 10. Surface Mount Ultrafast Rectifiers
Max trr
(ns)
MaxVF@iF
TC=2SoC
(Volts)
IFSM
(Amperes)
TJMax
(OC)
Package
MURS120T3
35
0.875@ 1.0A
40
175
5MB
TL = 150°C
MURS160T3
75
1.25@ 1.0A
35
175
5MB
3
TL= 140°C
MURS320T3
35
0.875 @3.0A
75
175
SMC
600
3
TL=130°C
MURS360T3
75
1.25@3.0A
75
175
SMC
200
3
TL = 158°C
MURD320
35
0.95 @3.0A
75
175
OPAK
200
6
TL = 145°C
MURD620CT
400
8
TL = 120°C
MURHB840CT
200
16
TL = 150°C
600
16
TL=150°C
VRRM
(Volts)
10(1)
(Amperes)
10 Rating
Condition
Device
200
1
TL = 155°C
600
1
200
35
1.0 @ 3.0 A
63
175
OPAK
28
2.2 @4.0A
100
175
02PAK
MURB1620CT
35
0.975@S.OA
100
175
02PAK
MURB1660CT
60
1.5@ 8.0A
100
175
02PAK
*
(1) 10 is total device current capability.
* New Product
cas~a;~~
Case 26ic-O:;
""",
I
Cathode = Polarity Band
Cathode = Polarity Band
Table 11. Axial Lead Ultrafast Rectifiers
Maxtrr
(ns)
MaxVF@iF
TC=2SoC
(Volts)
IFSM
(Amperes)
TJMax
eC)
Case
MUR120
25
0.875 @ LOA
35
175
59-04
TA= 120°C
RaJA = 50°C/W
MUR160
50
1.25 @ 1.0 A
35
175
59-04
1
TA = 95°C
RaJA = 50°C/W
MUR1100E
75
1.75@ 1.0A
35
175
59-04
200
4
TA = 80°C
RaJA = 28°C/W
MUR420
25
0.875 @3.0A
125
175
267-03
600
4
TA = 40°C
RaJA = 28°C/W
MUR460
50
1.25 @ 3.0A
70
175
267-03
1000
4
TA=35°C
RaJA = 28°C/W
MUR4100E
75
1.75 @3.0A
70
175
267-03
VRRM
(Volts)
10
(Amperes)
10 Rating
Condition
200
1
TA= 130°C
RaJA = 50°C/W
600
1
1000
Device
Oevices listed in bold, italic are Motorola preferred devices.
Rectifiers
5.6-10
Motorola Master Selection Guide
Case 221A-06
(TO-220AB)
Case 2218
(T0-220AC)
f
~
1~2'/4
3~ ~
STYLE 1:
PIN; ~;;;HDDE
0
STYLE 6:
PIN 1.
2.
3.
4.
3. ANODE
4. CATHODE
0
!
ANODE
CATHODE
ANODE
CATHODE
::r
2 ,4
STYLE 7:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. ANODE
1
23
1
Case 2210
Case 221E
3
Il,
STYLE1.
PIN 1. CATHODE
'"
2NfA
::r'I
,if ,- 12'~J
2
Il.\'
W
I'"
STYLE 3:
PIN ,. ANODE
2. CATHODE
3. ANODE
3
2
Table 12. TO-220 Type Ultrafast Rectifiers
VRRM
(Volts)
10
(Amperes)
10 Rating
Condition
200
6
TC = 130°C
400
8
TC= 120'C
Max trr
(ns)
MaxVF@ iF
TC=2S'C
(Volts)
IFSM
(Amperes)
TJ Max
('C)
MUR620CT
35
0.975 @ 3.0 A
75
175
MURH840CT
28
2,0 @ 4.0A
100
175
221A-06
Device
Case
221A-D6
600
8
TC= 120'C
MURH860CT
35
2.8 @ 4.0A
100
175
221A-D6
200
16
TC = 150'C
MUR1620CT
35
0.975 @ 8.0 A
100
175
221A-D6
200
16
TC = 160'C
MUR1620CTR
85
1.2 @ 8.0 A
100
175
221A-06
400
16
TC = 150'C
MUR1640CT
60
1.30 @ 8.0 A
100
175
221A-06
600
16
TC = 150°C
MUR1660CT
60
1,5 @ 8.0A
100
175
221A-06
200
8
TC= 150'C
MUR820
35
0.975 @ 8,0 A
100
175
221B
400
8
TC= 150'C
MUR840*
50
1.30 @ 8.0A
100
175
221B
600
8
TC= 150'C
MUR860*
50
1.50 @ 8.0A
100
175
221B
800
8
TC = 175'C
MUR880E
75
1.80 @ 8.0A
100
175
221B
1000
8
TC= 150'C
MUR8100E
75
1.80 @ 8.0A
100
175
221B
1200
10
TC = 125'C
MUR10120E
175
2.2 @ 6.5A
100
125
221B
1500
10
TC= 125'C
MUR10150E
175
2.4 @ 6.5 A
100
125
221B
200
15
TC= 150'C
MUR1520
35
1.05@15A
200
175
221B
400
15
TC = 150'C
MUR1540
60
1.25@ 15A
150
175
221B
600
15
TC = 145'C
MUR1560
60
1.50@ 15A
150
175
221B
200
8
TC= 150'C
MURF820*
25
0.975 @ 8.0 A
100
150
ISOLATED
221E
200
16
TC = 150°C
'M MURF1620CT *
25
0.975 @ 8.0 A
100
150
ISOLATED
2210
600
16
TC = 150'C
'M MURF1660CT*
50
1.50 @ 8.0A
100
150
ISOLATED
2210
~
Indicates UL Recognized -
File #E69369
* New Product
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.6-11
Rectifiers
Case 340D
(TO-21BAC)
1~ 2, 4
3
4
, .
Case 340E
(T0-21B)
2
1~
4 sT'(,j~ 1CATHODE
~f
STYLE 2:
PIN1.ANODEI
2. CATHODES
3. ANODE 2
4. CATHODES
1
Case 340F
(TO-247)
'"
3
3. ANODE
4. CATHODE
'4
~
I
..
•
~
STYLE 2:
PIN 1. ANODE 1
2. CATHODES
~: ~~~~6JES
12
(BACK HEATSINK)
1
3
3
3
Table 13. TO-218 Types and TO-247 Ultrafast Rectifiers
Max trr
(ns)
MaxVF@ iF
TC=2S"C
(Volts)
IFSM
(Amperes)
TJMax
eC)
Case
MUR3020WT
35
1.05@15A
150
175
340F
TC= 145"C
MUR3040WT
60
1.25 @ 15A
150
175
340F
30
TC = 145"C
MUR3060WT
60
1.70@15A
150
175
340F
30
TC = 150"C
MUR3020PT
35
1.12 @ 15A
200
175
340D
VRRM
(Volts)
10
(Amperes)
10 Rating
Condition
200
30
TC = 145"C
400
30
600
200
Device
400
30
TC = 150"C
MUR3040PT
60
1.12@ 15A
150
175
340D
600
30
TC = 145"C
MUR3060PT
60
1.20@ 15A
150
175
340D
400
30
TC = 70"C
MUR3040*
100
1.5 @ 30A
300
175
340E
BOO
30
TC = 70"C
MUR3080*
110
1.90 @ 30A
300
175
340E
400
60
TC = 70"C
MUR6040
100
1.50 @ 60A
600
175
340E
* New Product
Case 357C
POWERTApTM
Cathode = Mounting Plate
Anode = Terminal
Table 14. POWERTAP II
VRRM
(Volts)
10(1)
(Amperes)
10 Rating
Condition
200
200
TC = 130"C
400
200
TC = 100"C
..
Max trr
(ns)
MaxVF@ iF
TC = 25"C
(Volts)
IFSM
(Amperes)
TJMax
('C)
MURP20020CT *
50
1.00 @ 100 A
BOO
175
357C
MURP20040CT *
50
1.30@ 100A
BOO
175
357C
Device
Case
(1) 10 IS total deVice current capability.
All POWERTAP devices were converted to the new, more rugged, POWERTAP II configuration beginning January 1994. Contact your Motorola representative for
more details.
7.5
0.5
-
10x 1012
0806
0805
0804
0860
0113
0160
0832
0883
0831
0110
950
950
0883
-
Optoisolator Component Standard
(obsolete 12131/91)
8.5
0884(4)
-
Optoisolator Component Standard
(replaces VDE0883)
>7.5
-
65
204
-
-
-
0.4
[0]
-
VDE Rating for Motorola 6-pin DIP Optoisolators
All Motorola 6-pin DIP Optoisolators meet or exceed the requirements of above listed VDE and DIN IEC Standards.
• Impulse discharge w~hstand vo~ge.
(1) To satisfy 8.0 mm creepage path on a PC board Motorola offers a special lead bend of 0.4 inch on all6-pin dual in-line optoisolators. Order by attaching "T" to
the end of the Motorola part number.
(2) VDE standards (translated into English language) and IEC standards can be ordered from the American National Standard Inst~ute ANSI, 1430 Broadway, NY.,
N. Y. 10018, Sales Department, 212-642-4900.
(3) Creepage path distances are measured from lead to lead across the top, bottom and ends of the Pllckage body.
(4) VDE 0884 testing is an option; the suffix letter "V" must be added to the standard n.umber.
(5) For more information regarding the use of VDE approved devices, refer to "VDE Circu~ Board Layout Design Rules' in the Applications Information section.
Optoelectronic Devices
5.8-4
Motorola Master Selection Guide
Optoisolators 6-Pin DIP Varieties and Lead Form Options
Transistor
Darlington
1~6
1~6
*
*
5
5
:
4
NC
:
NC
4
CASE 730A-04
Resistor Darlington
::K;IT 0:~
I~C
I~C
*
*
2
3
NC
Schmitt Triggers
1~6
:t II
5
NC
2
4
3
6
5
4
NC
4
1~6
~
2
3
:
NC
Style 3
Style 1
3
6
5
4
30-NC
2
AC Input
Transistor Output
Darlington
Transistor
Zero Crossing
Triac Driver
Random Phase
Triac Driver
:fhIt:4
3t0
1~6
2
5
3
4
Style 6
Style 5
An optoisolator consists of a gallium arsenide infrared
emitting diode, IRED, optically coupled to a monolithic silicon
photodetector in a wide array of standard devices and
encourages the use of special designs and selections for
special applications. All Motorola optoisolators have VISO
rating of 7500 Vac(pk), exceeding all other industry standard
ratings.
Motorola offers global regulatory approvals, including UL,
CSA, AUSTEL, NEMKO, BABT, SETI, SEMKO, and DEMKO.
VDE(1) approved per standard 0884/8.87, with additional
approvals to DIN IEC950 and IEC380NDE 0806,
IEC435NDE 0805, IEC65NDE 0860, VDE 110b, also
covering all other standards with equal or less stringent
requirements, including IEC204NDE 0113, VDE 0160, VDE
0832, VDE 0833.
(1) VOE 0884/8.87 testing is an option; the suffix "YO must be added to the
standard part number (see VOE Approved Optoisolators in Section 3).
AC Input
Resistor-Darlington
Output
Zero Crossing
Circuit
~
CASE
730A-04
~
S
(S) CASE 730C-04
Surface-mountable
gulf-wing option
lfj6
2
3
5
NC
4
StyleS
~
T
(T) CASE 7300-05
Wide-spaced (0.400)
lead form option
Optoisolator
Lead Form Options:
Motorola's 6-pin, dual in-line optoisolators can be
ordered in either a surface-mountable, gull-wing lead
form or a wide-spaced 0.400" through-hole lead form,
which is used to satisfy B mm PC board spacing
requirements. Please first consult factory regarding
availability for your lead form option, prior to
ordering!
• Attach "S" to any Motorola 6-pin, dual in-line part
number for surface-mountable, gull-wing lead form.
• Attach "T" to any Motorola 6-pin, dual in-line part
number for wide-spaced 0.400" through-hole lead
form.
Tape and Reel Options:
• Attach "SR2" suffix to any Motorola 6-pin, dual
in-line part number for tape and reeled,
surface-mountable, gull-wing lead form.
Motorola Master Selection Guide
5.8-5
Optoelectronic Devices
6-Pin Dual In-Line Package
Table 1. Transistor Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-Emitter, 5-Collector, 6-Base (Style 1)
Current Transfer
Ratio (CTR)
Device
TIL111
4N27
4N28
4N38,A
4N25,A
4N26
MCT2
MCT2E
CNY17-1
MCT271
MOC8100
H11A1
H11A550
TIL117
TIL126
SL5501
CNY17-2
MCT275
MCT272
4N35
4N36
4N37
CNY17-3
H11AV1
H11AV2
MCT273
%
Min
@ IF
mA
8
10
10
20
20
20
20
20
40-80
45-90
50
50
50
50
50
45-250
63-125
70-210
75-150
100
100
100
100-200
100-300
50
125-250
16
10
10
20
10
10
10
10
10
10
1
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
VCE
Volts
0.4
10
10
1
10
10
10
10
5
10
5
10
10
10
10
0.4
5
10
10
10
10
10
5
10
10
10
CASE 730A-04
trltf or ton*/toft*
Typ
VCE(sat)
Volts@ IF
IC
Max
mA
mA
lIS
0.4
0.5
0.5
1
0.5
0.5
0.4
0.4
0.4
0.4
0.5
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.3
0.3
0.3
0.4
0.4
0.4
0.4
16
50
50
20
50
50
16
16
10
16
1
10
20
10
10
20
10
16
16
10
10
10
10
20
20
16
2
2
2
4
2
2
2
2
2.5
2
0.1
0.5
2
0.5
1
2
2.5
2
2
0.5
0.5
0.5
2.5
2
2
2
5/5
1.211.3
1.211.3
1.6/2.2
1.211.3
1.211.3
1.211.3
1.211.3
1.6/2.3"
4.9*/4.5*
3.8/5.6
1.211.3
5*/5*
5/5
212
20*/50*
1.6/2.3
4.5*/3.5*
6*/5.5*
3.214.7
3.214.7
3.214.7
1.6/2.3
5*/4*
5*/4*
7.6*/6.6*
@ IC
mA
2
10
10
10
10
10
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
VCC
Volts
RL
10
10
10
10
10
10
5
10
5
5
10
10
10
10
10
5
5
5
5
10
10
10
5
10
10
5
100
100
100
100
100
100
2k
100
75
100
100
100
100
100
100
1k
75
100
100
100
100
100
75
100
100
100
Q
VF
IF
mA
15
10
16
10
10
V(BR)CEO
Volts
Min
Volts@ IF
Max
mA
30
30
30
80
30
30
30
30
70
30
30
30
30
30
30
30
70
80
30
30
30
30
70
70
70
30
1.4
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.65
1.5
1.4
1.5
1.5
1.4
1.4
1.3
1.65
1.5
1.5
1.5
1.5
1.5
1.65
1.5
1.5
1.5
16
10
10
10
10
10
20
20
60
20
1
10
10
16
10
20
60
20
20
10
10
10
60
10
10
20
30
30
30
30
30
30
30
30
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
10
10
10
10
10
10
10
10
Table 2. Transistor Output with No Base Connection
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-Emitter, 5-Collector, 6-Base (Style 3)
MOC8101
MOC8102
MOC8103
MOC8104
MOC8105
MOC8111
MOC8112
MOC8113
50-80
73-117
108-173
160-256
65-133
20
50
100
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
5
5
5
5
5
10
10
10
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
3.2/4.7
3.2/4.7
3.2/4.7
3.2/4.7
3.2/4.7
3.2/4.7
3.214.7
3.214.7
2
2
2
2
2
2
2
2
10
10
10
10
10
10
10
10
100
100
100
100
100
100
100
100
Table 3. AC Input - Transistor Output
Pinout: 1-LED 1 AnodeILED 2 Cathode, 2-LED 1 CathodeILED 2 Anode, 3-N.C., 4-Emitter, 5-Co11ector, &-Base (Style 8)
Current Transfer
Ratio (CTR)
Device
H11AA1
H11AA2
H11AA3
H11AA4
%
Min
20
10
50
100
@
IF
mA
±10
±10
±10
+10
VCE
Volts
10
10
10
10
trltf or ton */toft*
Typ
VCE(sat)
Volts@ IF
Ie
Max
mA
mA
0.4
0.4
0.4
0.4
±10
±10
±10
+10
0.5
0.5
0.5
0.5
I1s
@ IC
mA
Vce
Volts
RL
Q
VF
IF
mA
V(BR)CEO
Volts
Min
30
30
30
30
Volts@ IF
Max
mA
1.5
1.8
1.5
1.5
±10
±10
±10
+10
Devices listed in bold, italic are Motorola preferred devices.
Optoelectronic Devices
5.8-6
Motorola Master Selection Guide
6-Pin Dual In-Line Package (continued)
CASE 730A-{)4
Table 4. Darlington Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-EmiHer, 5-Collector, 6-Base (Style 1)
Current Transfer
Ratio (CTR)
0/0
Device
4N31
4N29.A
4N30
MCA231
TIL113
4N32
4N33
H11B1
MOC8080
Min
50
100
100
200
300
500
500
500
500
@
tr'tf or ton "Iofl*
Typ
VCE(sat)
IF
rnA
VCE
Volts
10
10
10
1
10
10
10
1
10
10
10
10
1
1.25
10
10
5
5
VOlts@ IF
IC
@ IC
rnA
Max
rnA
rnA
I1S
1.2
1
1
1.2
1
1
1
1
1
8
8
8
10
50
8
8
1
1
2
2
2
50
125
2
2
1
1
0.6"'17"
0.6"/17"
0.6"/17"
80
300
0.6"'450.6"/45"
1/2
1/2
VCC
Volts
10
10
10
10
15
10
10
10
10
50
50
50
10
125
50
50
10
VF
RL
n
IF
rnA
200
200
200
V(BR)CEO
Volts
Min
Volts@ IF
Max rnA
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
10
10
10
20
10
10
10
10
10
100
100
5
30
30
30
30
30
30
30
25
55
100
100
100
100
100
10
10
10
10
30
80
50
80
50
1.5
2
2
2
2
10
10
10
10
10
100
100
100
10
10
10
100
80
55
1.5
1.5
1.5
10
10
10
100
100
200
200
Table 5. Darlington Output with No Base Connection
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-EmiHer, 5-Collector, 6-N.C. (Style 3)
MOC119
MOCB030
MOC8020
MOC8050
MOC8021
300
300
500
500
1000
10
10
10
10
10
2
1.5
5
1.5
5
1
10
10
1/2
1/2
1/2
1/2
1/2
2.5
10
50
50
50
50
Table 6. Resistor Darlington Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-EmiHer, 5-Collector, 6-Base (Style 1)
H11G1
H11G2
H11G3
1000
1000
200
10
10
1
1
1
5
1
1
1.2
1
1
50
1
1
20
5-/100"
5-/100"
5-/100-
5
5
5
Table 7. High Voltage Transistor Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-EmiHer, 5-Collector, 6-Base (Style 1)
MOC8204
H11D1
H11D2
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.8-7
Optoelectronic Devices
6-Pin Dual In-Line Package (continued)
Table 8. Triac Driver Output
CASE 730A-()4
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-Main Terminal, S-Substrate, 6-Main Terminal (Style 6)
Device
MOC3010
MOC3011
MOC3012
MOC3021
MOC3022
MOC3023
MOC3051*
MOC3052'
MOC3031
MOC3032
MOC3033
MOC3041
MOC3042
MOC3043
MOC3061
MOC3062
MOC3063
MOC3162*
MOC3163'
MOC3081
MOC3082
MOC3083
Peak Blocking
Voltage
Min
LED Trigger
Current-1FT
(VTM=3V)
mAMax
250
250
250
400
400
400
600
600
250
250
250
400
400
400
600
600
600
600
600
800
800
800
15
10
5
15
10
5
15
10
15
10
5
15
10
5
15
10
5
10
5
15
10
5
Zero Crossing
Inhibit Voltage
(at rated 1FT)
Volts Max
Operating
Voltage
Vae
-
dv/dt
VlIlS Typ
125
125
125
10
10
10
10
10
10
2000
2000
2000
2000
2000
2000
2000
2000
1500
1500
1500
1000
1000
1500
1500
1500
125/280
125/280
125/280
125/280
125/280
20
20
20
20
20
20
20
20
20
15
15
20
20
20
125
125
125
125/280
125/280
125/280
125/280
125/280
125/280
125/280
125/280
125/280/320
125/280/320
125/280/320
• New Device Offering
Table 9. Schmitt Trigger Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-Output, 5-Ground, 6-VCC (Style 5)
Device
H11L1
HllL2
MOCSOO7
MOC5008
MOC5009
Threshold
Current On
mAMax
Threshold
Current Off
mAMin
1.6
10
1.6
4
10
0.3
0.3
0.3
0.3
0.3
IF(offyIF(on)
Min
Max
0.5
0.5
0.5
0.5
0.5
0.9
0.9
0.9
0.9
0.9
t r• tf
vCC
Min
Max
IlsTyp
3
3
3
3
3
16
16
16
16
16
0.1
0.1
0.1
0.1
0.1
Devices listed in bold, ~alic are Motorola preferred devices.
Optoelectronic Devices
5.8-8
Motorola Master Selection Guide
Small Outline -
Surface Mount
CASE 846-01
SO-8 DEVICES
Table 10. Transistor Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-N.C., 5-Emitter, 6-Collector, 7-Base, 8-N.C. (Style 1)
Current Transfer
Ratio (CTR)
Device
MOC205.R2
MOC206,R2
MOC207,R2
MOC211,R2
MOC212,R2
MOC213,R2
MOC215,R2
MOC216,R2
MOC217,R2
Marking
%
Min
205
206
207
211
212
213
215
216
217
40-80
63-125
100-200
20
50
100
20
50
100
@
trltf Typ
VCE(sat)
IF
rnA
VCE
Volts
10
10
10
10
10
10
1
1
1
10
10
10
10
10
10
5
5
5
Volts@ IF
Max
rnA
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
10
10
10
10
10
10
1
1
1
RL
rnA
VCC
Volts
Q
V(BR)CEO
Volts
Min
2
2
2
2
2
2
2
2
2
10
10
10
10
10
10
10
10
10
100
100
100
100
100
100
100
100
100
70
70
70
30
30
30
30
30
30
1.5
1.5
1.5
1.5
1.5
1.5
1.3
1.3
1.3
10
10
10
10
10
10
1
1
1
30
1.5
±10
10
10
10
10
1
@ IC
IC
rnA
Jls
2
2
2
2
2
2
0.1
0.1
0.1
1.6
1.6
1.6
3.2
3.2
3.2
3.2
3.2
3.2
VF
Volts@ IF
Max
rnA
Table 11. Darlington Output
Pinout: 1-Anode, 2-Cathode, 3-N.C., 4-N.C., 5-Emitter, 6-Collector, 7-Base, 8-N.C. (Style 1)
All devices are shipped in tape and reel format. (See Tape and Reel Specifications Section for more information.)
*No Base Connection to Pin 7
Table 12. AC Input - Transistor Output (Single Channel) (Style 2)
IMOC256,R2 I
256
I
20
I ±10 I
10
I 0.4 I±10 I 0.5 I
Table 13. Transistor Output (Dual Channel) (Style 3)
MOCD207,R2
MOCD208,R2
MOCD211,R2
MOCD213,R2
MOCD217,R2
D207
D208
D211
D213
D217
100-200
45-125
20
100
100
10
10
10
10
1
10
10
10
10
5
0.4
0.4
0.4
0.4
0.4
10
10
10
10
1
2
2
2
2
0.1
1.6
1.6
3.2
3.2
3.2
2
2
2
2
2
10
10
10
10
10
100
100
100
100
100
70
70
30
70
30
1.5
1.5
1.5
1.5
1.5
2
5
10
100
30
1.3
Table 14. Darlington Output (Dual Channel) (Style 3)
IMOCD223,R2 I D223 I
500
I
I
5
I
10.5 I
R2 devices are shipped in tape and reel format. (See Tape and Reel Specifications Section for more information.)
Devices listed in bold, italic are Motorola preferred devices.
Motorola Master Selection Guide
5.8-9
Optoelectronic Devices
POWER OPTOTM Isolators
CASE 417-02
PLASTIC PACKAGE
CASE 417A-02
PLASTIC PACKAGE
CASE 417B-01
PLASTIC PACKAGE
Table 15. POWER OPTO Isolator 2 Amp Zero-Cross or Random Phase Triac Outputs
Pinout: (1,4,5,6,8 No Pin), 2 - LED Cathode, 3- LED Anode, 7-Main Terminal, 9-Main Terminal
Device
MOC2A4D-5
MOC2A4D-10
MOC2A60-5
MOC2A6D-10
Peak Blocking
Voltage
(Volts)
Min
Led Trigger
Current If T
(VTM=2V)mA
Max
On State Voltage
VTM (Rated 1FT
ITM = 2 A) (Volts)
Max
Zero Crossing
Inhibit Voltage
(IF = Rated 1FT)
(Volts) Max
Operating
Voltage
Vac Pk (Volts)
dv/dt (static)
v/llS (VIN = 200 V)
(V/IlS)
Min
400
400
600
600
5
10
5
10
1.3
1.3
1.3
1.3
10
10
10
10
125
125
125/220
125/220
400
400
400
400
All devices are shipped in rails.
No suffix = Case 417-02lStyle 2 (Standard Heat Tab),
"F" suffix = Case 417-02lStyle 1 (Flush Mount Heat Tab)
"C" suffix = Case 417B-01/Style 1 (Cut Tab)
Devices listed in bold, italic are Motorola preferred devices.
Optoelectronic Devices
5.8-10
Motorola Master Selection Guide
Sensors
In Brief ...
Pressure Sensors
Page
Introduction ................................. 5.9-2
The Basic Structure .......................... 5.9-2
Motorola's Patented X-ducer . . . . . . . . . . . . . . . . .. 5.9-2
Linearity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.9-3
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.9-3
Typical Electrical Characteristic Curves ......... 5.9-4
Unibody Cross-sectional Drawings. . . . . . . . . . . .. 5.9-4
Pressure Side Identification ................... 5.9-5
Selector Guide .............................. 5.9-6
Reference Table ............................ 5.9-11
Packaging Options .......................... 5.9-12
Combining integrated circuit technology with the most
advanced pressure sensor architecture now offers an
unrivaled combination of performance, reliability and design
adaptability in a single monolithic pressure sensing element
- the Motorola MPX series of pressure transducers.
Available in several versions:
• Fully signal conditioned for high-level output;
• High Impedance, temperature compensated and
calibrated, for low current designs;
• Temperature compensated and calibrated, for simplified
circuit design;
• Uncompensated for unlimited adaptability
This series of sensors provides both electrical and
mechanical design-in options that uniquely fit the varying
requirements of the system designer.
Motorola Master Selection Guide
5.9-1
Sensors
Pressure Sensors
Introduction
Motorola pressure sensors combine advanced piezoresistive sensor architecture with integrated circuit technology to offer a
wide range of pressure sensing devices for automotive, biomedical, consumer and industrial applications. Selection versatility
includes choice of:
Pressure Ranges in PSI
Application Measurements
Absolute, Differential, Gauge
o to 1.45, 0 to 6,0 to 7.3, 0 to 14.5, 0 to 29,0 to 75, 0 to 100,
Oto 150
Sensing Options
Package Options
Uncompensated, Temperature Compensated/Calibrated,
High Impedance, and Signal Conditioned (with on--chip
amplifiers)
Basic Element, Ported Elements for specific measurements
The Basic Structure
Motorola's Patented
X-ducer™
The Motorola pressure sensor is designed utilizing a
monolithic silicon piezoresistor, which generates a changing
output voltage with variations in applied pressure. The
resistive element, which constitutes a strain gauge, is ion
implanted on a thin silicon diaphragm.
Applying pressure to the diaphragm results in a resistance
change in the strain gauge, which in turn causes a change in
the output voltage in direct proportion to the applied pressure.
The strain gauge is an integral part of the silicon diaphragm,
hence there are no temperature effects due to differences in
thermal expansion of the strain gauge and the diaphragm. The
output parameters of the strain gauge itself are temperature
dependent, however, requiring that the device be
compensated if used over an extensive temperature range.
Simple resistor networks can be used for narrow temperature
ranges, i.e., O°C to 85°C. For temperature ranges from -40°C
to +125°C, more extensive compensation networks are
necessary.
r--
PIN#
1. GROUND
2. +VOUT
3. Vs
4.-VOUT
I
I
I
I
L
Excitation current is passed longitudinally through the
resistor (taps 1 and 3), and the pressure that stresses the
diaphragm is applied at a right angle to the current flow. The
stress establishes a transverse electric field in the resistor that
is sensed as voltage at taps 2 and 4, which are located at the
midpoint of the resistor. The single-element transverse
voltage strain gauge can be viewed as the mechanical analog
of a Hall effect device.
Using a Single element eliminates the need to closely match
the four stress and temperature sensitive resistors that form
a Wheatstone bridge design. At the same time, it greatly
simplifies the additional circuitry necessary to accomplish
calibration and temperature compensation. The offset does
not depend on matched resistors but instead on how well the
transverse voltage taps are aligned. This alignment is
accomplished in a single photolithographic step, making it
easy to control, and is only a positive voltage, simplifying
schemes to zero the offset.
ETCHEO
DIAPHRAGM
BOUNDARY
TRANSVERSE
VOlTAGE STRAIN
_'M!t?!!~_
Figure 1. Basic Uncompensated Sensor Element -
Sensors
5.9-2
Top View
Motorola Master Selection Guide
Linearity
Linearity refers to how well a transducer's output follows
the equation: Vout =Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or
(2) a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured atthe midrange pressure.
//
/
///1//
//~I____~~~~~~L-_
/
'/
//
1
~ END POINT
STRAIGHT LINE FIT
///
100
50
PRESSURE (% FULLSCALE)
Figure 2. Linearity Specification Comparison
Operation
NEGATIVE PRESSURE
VACUUM
t
~LI
Motorola pressure sensors support three types
of pressure measurements: Absolute Pressure,
Differential Pressure and Gauge Pressure.
Absolute Pressure Sensors measure an
external pressure relative to a zero-pressure
reference (vacuum) sealed inside the reference
chamber of the die during manufacture. This
corresponds to a deflection of the diaphragm
equal to approximately 14.5 psi (one atmosphere), generating a quiescent full-scale output
for the MPX100A (14.5 psi) sensor, and a
half-scale output for the MPX200A (29 psi)
device. Measurement of external pressure is
accomplished by applying a relative negative
pressure to the "Pressure" side of the sensor.
Differential Pressure Sensors measure the
difference between pressures applied simultaneously to opposite sides of the diaphragm. A
positive pressure applied to the "Pressure" side
generates the same (positive) output as an equal
negative pressure applied to the "Vacuum" side.
Motorola Master Selection Guide
POSITIVE PRESSURE
•
I
I Absolute
I Sensor
I
vos
-------1-1 ATM PMAX
- - - INCREASING VACUUM
INCREASING PRESSURE - -
PMAX
DIFFERENnAL PRESSURE - INCREASING
Motorola sensing elements can withstand pressure inputs as high as four times their rated
capacity, although accuracy at pressures exceeding the rated pressure will be reduced.
When excessive pressure is reduced, the previous linearity will immediately be restored.
Figure 3. Pressure Measurements
Gauge Pressure readings are a special case of differential measurements in which the pressure applied to the "Pressure" side is measured
against the ambient atmospheric pressure applied to the ·Vacuum" side
through the vent hole in the chip of the differential pressure sensor
elements.
5.9--3
Sensors
Typical Electrical Characteristic Curves
~
t~
o
40 r-- VS=10Vdc
TA= 25°C
35 r-- MPX2100
30 f--P1>P2 I 25
MAX "-
20
15
10
~
L
,,~
TVP
"i0'
-0 "
SPAN
kPa
PSI
~
1
~~
~
"'MIN
25
3.62
0
I
>
.s.
I:::J
"-
I:::J
0
100
14.5
30
20
10
O~O~~+-~~~~~~--~--~~
tOFFSET
75
10.87
50
7.25
:g-
RANGE
~
-5
1
100
90
80
70
60
50
40
(TVP)
PSI 0
5.0
TRANSFER FUNCTION:
M~. --:
4.5
Vout = Vs' (0.OO9'P - O.04) ± error
~
4.0 Vs=5.0Vdc
~
3.5 TEMP = 0 to 85°C
~
3.0 MPX51 DOD
P1 > P2
~'" TYP
2.5
~
2.0
~
1.5
_I _
a.
50
~
1.0
0.5
A~
r::r
00
~
20
30
40
PRESSURE DIFFERENTIAL
Figure 5. Typical-Output Voltage versus
Pressure and Temperature for Compensated
and Uncompensated Devices
Figure 4. Output versus Pressure Differential
I5
10
kPa
~
~
--
MIN
I
10 20
30
40
50
60 70
80 90 100 110
DIFFERENTIAL PRESSURE (in kPa)
Figure 6. Signal Conditioned MPX5100
Unibody Cross-sectional Drawings
SILICONE GEL
DIE COAT
DIFFERENTIAUGAUGE STAINLESS STEEL
DIE
METAL COVER
~:;:;~~;;:J '-....=::;;;;:;~/:Il THERMOPLASTIC
CASE
SILICONE GEL ABSOLUTE
DIE COAT
DIE
u
DIFFERENTIAUGAUGE ELEMENT
P2
DIE
BOND
ABSOLUTE ELEMENT
P2
Figure 7. Cross-Sectional Diagrams (not to scale)
Figure 7 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from harsh environments, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
Sensors
5.9-4
The MPX series pressure sensor operating characteristics
and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long term
stability. Contact the factory for information regarding media
compatibility in your application.
Motorola Master Selection Guide
Pressure Side Identification
The absolute sensor is designed for vacuum applied to P1
side.
The Pressure (P1 ) side may be identified by using the table
below.
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicon gel which
protects the die. The differential or gauge sensor is designed
to operate with positive differential pressure applied, P1 > P2.
Table 1. Pressure (P1) I Vacuum (P2) Side Identification
Part Number
MPXxxxxA
MPXxxxxD
Case Type 4 PIN
Positive Pressure Side Identifier
344-08
Stainless Steel Cap
MPXxxxxDP
352-02
Side with Part Marking
MPXxxxxAP
MPXxxxxGP
350-03
Side with Port Attached
MPXxxxxGVP
350-04
Stainless Steel Cap
MPXxxxxAS
MPXxxxxGS
371-06
Side with Port Attached
MPXxxxxGVS
371-05
Stainless Steel Cap
MPXxxxxASX
MPXxxxxGSX
371C-02
Side with Port Attached
MPXxxxxGVSX
3710-02
Stainless Steel Cap
Case Type 6 PIN
Part Number
Positive Pressure Side Identifier
MPXxxxxA
MPXxxxxD
867-04
Stainless Steel Cap
MPXxxxxDP
867C-03
Side with Part Marking
MPXxxxxAP
MPXxxxxGP
867B-03
Side with Port Attached
MPXxxxxGVP
867D-03
Stainless Steel Cap
MPXxxxxAS
MPXxxxxGS
867E-02
Side with Port Attached
MPXxxxxGVS
867A-03
Stainless Steel Cap
MPXxxxxASX
MPXxxxxGSX
867F-02
Side with Port Attached
MPXxxxxGVSX
867G-02
Stainless Steel Cap
MPXxxxxGVW
867H-02
Stainless Steel Cap
Motorola Master Selection Guide
5.9-5
Sensors
PRESSURE SENSOR PRODUCTS
Table 2. Uncompensated
Device
Series
Max Pressure
Rating
psi
kPa
MPX10D
MPX50D
MPX100D,A
MPX200D,A
MPX700A
MPX700D
1.45
7.3
14.5
29
100
100
.10
50
100
200
700
700
MPX906D
0,87
6
Over
Pressure
(kPa)
Offset
mV(Typ)
Full Scale
Span
mV(Typ)
Sensitivity
(mV/kPa)
3s
3.5
60
60
60
60
1.2
0.6
0.3
0.086
0.086
-1.0
-0.25
-0.25
-0.25
-1.0
-0.50
1.0
0.25
0.25
0.25
1.0
0.50
3.3
-0.50
2.0
20
20
20
20
20
20
75
200
200
400
2800
2800
100
Linearity
0/0 of FSS(1)
(Min) (Max)
20
60
20
75
200
200
400
400
400
400
2800
2800
±1.0
±1.0
±0.1
±2.0
±1.0
±1.0
±1.0
±2.0
±1.0
25
40
40
40
40
40
40
40
40
2.5
0.8
0.8
0.4
0.4
0.2
0.2
0.057
0.057
-1.0
-0.25
-0.55
-1.0
-0.25
-1.0
-0.25
-1.0
-0.5
1.0
0.25
0.25
1.0
0.25
1.0
0.25
1.0
0.5
200
400
400
400
400
±1.0
±2.0
±1.0
±2.0
±1.0
40
40
40
40
40
0.8
0.4
0.4
0.2
0.2
-0.25
-1.0
-.0.25
-1.0
-0.25
0.25
1.0
0.25
1.0
0.25
Table 3. Compensated and Calibrated (On-Chip)
MPX2010D
MPX2050D
MPX2052D
MPX2100A
MPX2100D
MPX2200A
MPX2200D
MPX2700A
MPX2700D
1.45
7.3
7..3
14.5
14.5
29
29
100
100
10
50
50
100
100
200
200
700
700
Table 4. High Impedance (On-Chip)
-"
MPX7050D
MPX7100A
MPX7100D
MPX7200A
MPX7200D
7.3
14.5
14.5
29
29
50
100
100
200
200
Table 5. Compensated and Calibrated (On-Chip) Medical Grade
Max Pressure
Rating
Device Series
MPX2300DTl
1
psi
1
5.8
kPa
Supply
Voltage
(Vdc)
Offset
mV(Max)
Sensitivity
(IlVNlmmHg)
Output
Impedance
Ohms (Max)
40
6.0
0.75
5.0
330
Linearity
0/0 of FSS(1)
(Min) (Max)
-2.0
I
2.0
(1 )Sased on end pOint straight line fit method. Best fit straight line linearity error is approximately 1/2 of listed value.
Table 6. Signal Conditioned (On-Chip)
Max Pressure
Rating
Device Series
MPX4100A
MPX4101A
MPX4115A
MPX4250A
MPX5010D
MPX5050D
MPX5100A
MPX5100D
MPX5500D
MPX5700D
MPX5999D
psi
kPa
Over
Pressure
(kPa)
15.2
14.7
16.6
36.2
1.45
7.3
16.6
14.5
72.5
100
150
105
102
115
250
10
50
115
100
500
700
1000
400
400
400
400
75
200
400
400
2000
2800
4000
Full Scale
Span
V (Typ)
Sensitivity
(mVIkPa)
Accuracy
(O-85°C)
0/0 ofVFSS
4.59
4.59
4.59
4.69
4.5
4.5
4.5
4.5
4.5
4.5
4.7
54
54
45.9
20
450
90
45
45
9.0
6.0
5.0
±1.8
±1.8
±1.5
±1.5
±5.0
±2.5
±2.5
±2.5
±2.5
±2.5
±2.5
Table 7. New Products (Pressure)
Device Series
MPXS4100ASeries
MPXS4115A Sertes
MPXT2010G Series
Data Sheet
Engineering
Samples Available
Introduction Date
NOW
NOW
NOW
NOW
NOW
NOW
2196
2/96
2196
Description
Surface Mount, 0-105 kPa Signal-Condnioned
Surface Mount, 15-115 kPa Signal-Conditioned
Top Piston Fn, 0-10 kPa Temperature Compensated
and Calibrated
Bold italic Indicates product Introduced In the last 12 months.
Sensors
5.9-6
Motorola Master Selection Guide
Table 8. MPX10/50/100/200nOO Series (Uncompensated)
Pressure Range
Device
Measurement/Porting
Options
Type
Package
Options
oto 1.45 PSI
oto 7.3 PSI
(0 to 10 kPa)
(0 to 50 kPa)
-
-
o
o
to 14.5 PSI
(0 to 100 kPa)
o
to 29 PSI
(0 to 200 kPa)
to 100 PSI
(0 to 700 kPa)
4-Pin
Absolute
Case 344-12
Basic Elements
Differential
Case 344-12
Ported Elements
Absolute Port
Case 350-05
-
Absolute Stovepipe
Case 371-07
-
Absolute Axial
Case 371 C-03
Differential Port
Case 352-03
MPX10DP
MPX50DP
Gauge
Case 35Q-05
MPX10GP
MPX50GP
Gauge Vacuum
Case 350-06
MPX10GVP
Gauge Stovepipe
Case 371-Q7
MPX10GS
Gauge Vacuum Stovepipe
Case 371-Q8
MPX10GVS
MPX50GVS
MPX100GVS
MPX200GVS
-
Gauge Axial
Case 371 C-03
MPX10GSX
MPX50GSX
MPX100GSX
MPX200GSX
MPX700GSX
Gauge Vacuum Axial
Case 371 D-03
MPX10GVSX
MPX50GVSX
MPX100GVSX
MPX200GVSX
MPX10D
MPX100A
MPX200A
MPX700A
MPX100D
MPX200D
MPX700D
-
MPX100AP
MPX200AP
MPX700AP
-
MPX100AS
MPX200AS
MPX700AS
-
MPX100ASX
MPX200ASX
MPX700ASX
MPX100DP
MPX200DP
MPX700DP
MPX100GP
MPX200GP
MPX700GP
MPX50GVP
MPX100GVP
MPX200GVP
MPX50GS
MPX100GS
MPX200GS
MPX50D
-
MPX700GS
-
Table 9. MPX900 Series (Uncompensated) (Water vapor and soapy water vapor tolerant)
Pressure Range
Device
Measurement
Type
Options
Package
Options
o to 0.87 PSI
(Ot06 kPa)
6-Pin
Basic Element
Differential
Case 867-07
MPX906D
Ported Element
Gauge Axial
Case 867H-03
MPX906GVW
Table 10. MPX2000 Series (Temperature Compensated and Calibrated On-Chip)
Pressure Range
Measurement
Options
Device Type
Package
Options
oto 1.45 PSI
oto 7.3 PSI
(0 to 10 kPa)
(0 to 50 kPa)
-
4-Pin
Absolute
Case 344-12
Basic Elements
Differential
Case 344-12
Ported Elements
Absolute Port
Case 350-05
-
Absolute Stovepipe
Case 371-07
-
-
MPX2010D
-
o
to 14.5 PSI
(0 to 100 kPa)
o
to 29 PSI
(0 to 200 kPa)
o to 100 PSI
(0 to 700 kPa)
MPX2100A
MPX2200A
MPX2700A
MPX2100D
MPX2200D
MPX2700D
-
MPX2100AP
MPX2200AP
MPX2700AP
-
MPX2100AS
MPX2200AS
MPX2700AS
MPX2050D
-
Absolute Axial
Case 371 C-03
MPX2100ASX
MPX2200ASX
MPX2700ASX
Differential Port
Case 352-03
MPX2010DP
MPX2050DP
MPX2100DP
MPX2200DP
MPX2700DP
MPX2700GP
Gauge
Case 350-05
MPX2010GP
MPX2050GP
MPX2100GP
MPX2200GP
Gauge Vacuum
Case 350-06
MPX2010GVP
MPX2050GVP
MPX2100GVP
MPX2200GVP
-
Gauge Stovepipe
Case 371-07
MPX2010GS
MPX2050GS
MPX2100GS
MPX2200GS
-
Gauge Vacuum Stovepipe
Case 371-08
MPX2010GVS
MPX2050GVS
MPX2100GVS
MPX2200GVS
-
Gauge Axial
Case 371 C-03
MPX2010GSX
MPX2050GSX
MPX2100GSX
MPX2200GSX
MPX2700GSX
Gauge Vacuum Axial
Case 371 D-03
MPX2010GVSX
MPX2050GVSX
MPX2100GVSX
MPX2200GVSX
Motorola Master Selection Guide
5.9--7
-
Sensors
Table 11. MPX4000 Series (Signal Conditioned On-Chip)
Pressure Range
Measurement
Device Type
3to15PSI
(20 to 105 kPa)
Package
Options
Options
2.3 to 14.7 PSI
(15 tol02kPa)
2.3 to 16.6 PSI
(15toI15kPa)
3 to 36.2 PSI
(20 to 250 kPa)
6-Pin
Basic Element
Absolute
Case 867-07
MPX4100A
MPX4101A
MPX4115A
MPX4250A
Ported Element
Absolute Port
Case 867E-03
MPX4100AP
MPX4101AP
MPX4115AP
MPX4250AP
Absolute Stovepipe
Case 867F-03
MPX4100AS
MPX4101AS
MPX4115AS
MPX4250AS
Absolute Axial
Case 8678-04
MPX4100ASX
MPX4101ASX
MPX4115ASX
MPX4250ASX
Table 12. MPX5000 Series (Signal Conditioned On-Chip)
Pressure Range
Device
Type
Measurement
Options
Package
Options
o to 1.45 PSI
oto 7.3 PSI
oto 14.5 PSI
(0 to 10 kPa)
(0 to 50 kPa)
(0 to 100 kPa)
-
-
-
o
to 150 PSI
(0 to 1000 kPa)
-
-
MPX5500D
MPX5700D
MPX5999D
-
MPX5100AP
-
-
-
-
-
MPX5100AS
-
-
-
-
-
MPX5100ASX
-
-
-
-
MPX5500DP
MPX5700DP
-
MPX5100GP
-
MPX5500GP
MPX5700GP
-
Case
867-07
Basic
Differential
Case
867-07
Absolute
Port
Case
8678-04
-
-
Absolute
Stovepipe
Case
867E-03
-
Absolute
Axial
Case
867F-03
-
Differential
Port
Case
867C-05
MPX5010DP
MPX5050DP
MPX5100DP
Gauge
Case
MPX5010GP
MPX5050GP
Ported
Element
o
to 100 PSI
(0 to 700 kPa)
-
Absolute
MPX5010D
o
to 75 PSI
(0 to 500 kPa)
-
6-Pin
Element
2.3 to 14.7 PSI
(15 to 115 kPa)
MPX5050D
MPX5100D
MPX5100A
8678-04
Sensors
Gauge
Vacuum
Case
867D-04
MPX5010GVP
MPX5050GVP
MPX5100GVP
-
-
-
-
Gauge
Stovepipe
Case
867E-03
MPX5010GS
MPX5050GS
MPX5100GS
-
MPX5500GS
MPX5700GS
-
Gauge
Vacuum
Stovepipe
Case
867A-04
MPX5010GVS
MPX5050GVS
MPX5100GVS
-
-
-
-
Gauge
Axial
Case
MPX5010GSX
MPX5050GSX
MPX5100GSX
-
MPX5700GSX
-
Gauge
Vacuum
Axial
Case
867G-03
MPX5010GVSX
MPX5050GVSX
MPX5100GVSX
-
-
-
MPX5500GSX
867F-03
5.9-8
-
Motorola Master Selection Guide
Table 13. MPX7000 Series (Temperature Compensated and Calibrated High Impedance On-Chip)
Pressure Range
Measurement
Device Type
Package
Oplions
OpUons
0107.3 PSI
(01050 kPa)
01014.5 PSI
(0 10 100 kPa)
01029PSI
(0 10 200 kPa)
4-Pln
Absolute
Case 344-12
-
MPX7100A
MPX7200A
Basic Elements
Differential
Case 344-12
MPX7050D
MPX7100D
MPX7200D
Ported Elements
Absolute Port
Case 35ORTING OPTION
9
2
4,5
7
Basic Element
Temp Camp & Cal
Signal Condilioned
High Impedance
A
AP
AS
D
DP
GP
GVP
GS
GVS
GSX
GVSX
GVW
Absolute Elemenl
Absolute Ported
Absolute Siovepipe Ported
Differenlial and Gauge Elemenl
Differenlial Dual Ported
Gauge Ported
Gauge Vacuum Ported
Gauge Stovepipe Ported
Gauge Vacuum Siovepipe
Gauge Vacuum Ported, Axial
Gauge Vacuum Stove Ported, Axial
Gauge Vacuum, Water Tolerant
Note: Actual device marking may be abbreviated due to space constraints
but packaging label will reflect full part number.
Motorola Master Selection Guide
5.9-9
Sensors
ACCELERATION SENSOR PRODUCTS
Table 14. Accelerometer Sensor
Device
Range
Sensitivity
Frequencyl
Bandwidth (Hz)
Supply
Current (fJA)
Offset V
±40g
4OJ.lv/g
400
5
2.9
MMAS40G10D
Table 15. New Products (Accelerometer)
Device Series
MMAS250G
Data Sheet
Engineering
Samples Available
Introduction Date
3096
NOW
2096
Description
+/-250 9 Amplified Accelerometer
Device Numbering System for Accelerometers
MMA.s40G 10Q
MOTOROLA
~I
tPACKAGE
MICROMACHINED
ACCELEROMETER
AC SENSITIVITY TOLERANCE
SENSOR--------'
Sensors
5.9--10
' - - - - - RANGE
Motorola Master Selection Guide
EVALUATION TOOLS
Table 16. Sample Kits
Max Pressure Rating
Device
MPX2010DP
MPX2700DP
MPX700DP
MPX5050DP
MPX5100DP
MPX5100AP
MPX7100DP
MPX7200DP
psi
kPa
Description
Order
Information
1.45
100
100
7.3
14.5
14.5
14.5
29
10
700
700
50
100
100
100
200
Device w/Literature
Device w/Literature
Device w/Literature
Device w/Literature
Device w/Literature
Device wlliterature
Device wlliterature
Device wlLiterature
KITNOK29/D
KITMPX2700D/D
KITNOK321D
KITMPX5050D/D
KITMPX5100D/D
KITMPX5100AlD
KITMPX7100D/D
KITMPX7200D/D
Table 17. Evaluation Kits
Max Pressure
Rating
Order
Information
Description
Device
Pressure Sensor with Microprocessor
KITDEVB114/D
KITDEVB1731D
DEVB-114/AN1305/D
DEVB-1731ANI3241D
A Simple Sensor Interface Amplifier
psi
I
kPa
14.5
14.5
I
100
100
Table 18. New Literature
Literature
Description
DL200/D (Rev 2)
AN1516/D
ANI517/D
AN1518/D
BR3005/D
Sensor Device Data Book
Liquid Level Control Using a Motorola Pressure Sensor
Pressure Switch Design with Semiconductor Pressure Sensors
Using a Pulse Width Modulated Output with Semiconductor Pressure Sensors
Senseon Image Brochure - Intelligent Sensor Solutions
REFERENCE TABLE
Table 19. Pressure Unit Conversion Constants
(Most Commonly Used -
Per International Conventions)
PSI(I)
in. H20(2)
in. Hg(3)
KPascal
millibar
cm H20(4)
mm Hg(5)
1.000
27.681
2.036
6.8948
68.948
70.309
51.715
3.6126 x 10- 2
1.000
7.3554 x 10- 2
0.2491
2.491
2.5400
1.8683
in. Hg(3)
0.4912
13.595
1.000
3.3864
33.864
34.532
25.400
K Pascal
0.14504
4.0147
0.2953
1.000
10.000
10.1973
7.5006
millibar
0.01450
0.40147
0.02953
0.100
1.000
1.01973
0.75006
PSI(1)
in. H20(2)
cm H20(4)
1.4223 x Hr2
0.3937
2.8958 x 10-2
0.09806
0.9806
1.000
0.7355
mmHg(5)
1.9337 x 10- 2
0.53525
3.9370 x 10- 2
0.13332
1.3332
1.3595
1.000
Motorola Master Selection Guide
5.9-11
Sensors
PRESSURE PACKAGING OPTIONS
4-PIN
BASIC ELEMENT
CASE 344-12
SUFFIX AID
GAUGE PORT
CASE3SD-oS
SUFFIX AP IGP
MEDICAL CHIP PACK
CASE 423-04
GAUGE VACUUM PORT
CASE3SD-06
SUFFIXGVP
STOVEPIPE PORT
CASE 371-07
SUFFIXGVS
AXIAL VACUUM PORT
CASE 3710-03
SUFFIX GVSX
AXIAL PORT
CASE 371
SUFFIX ASX/GSX
DUAL PORT
CASE 352-03
SUFFIXDP
c-oo
STOVEPIPE VACUUM PORT
CASE 371-08
SUFFIX AS/GS
6-PIN
BASIC ELEMENT
CASE 867-07
SUFFIX AID
AXIAL PORT
CASE 867F-OO
SUFFIX ASX/GSX
GAUGE PORT
CASE 867B-04
SUFFIX AP IGP
AXIAL VACUUM PORT
CASE 867G-03
SUFFIX GVSX
GAUGE VACUUM PORT
CASE 8670-04
SUFFIXGVP
STOVEPIPE PORT
CASE 867E-03
SUFFIX AS/GS
STOVEPIPE VACUUM PORT
CASE 867A-04
SUFFIXGVS
8-PIN
(NEW)
tfij)
DUAL PISTON FIT
CASE 434C-01
DUAL PORT
CASE 867C-OS
SUFFIXDP
SURFACE MOUNT
CASE 432-01
STOVEPIPE MEDIA PORT
CASE 867H-03
SUFFIXGVW
..
TOP PISTON FIT
CASE 434A-03
ACCELEROMETER
PACKAGING
-
DIP PACKAGE
CASE 648C-03
Sensors
5.9-12
Motorola Master Selection Guide
RF Products
In Brief ...
While Motorola is considered to be the supermarket for
semiconductor products, there is not a category in which the
selection is more diverse, or more complete, than in products
designed for RF system applications. From MOS, bipolar
power and signal transistors to integrated circuits, Motorola's
RF components cover the entire spectrum from HF to
microwave to personal communications. Yet, product expansion continues - not only to keep pace with the progressive
needs of the industry, but to better serve the needs of designers
for a reliable and comprehensive source of supply.
How to Use This Selector Guide
This new selector guide combines the RF products of Motorola
Phoenix, Motorola Toulouse (France), and Motorola Hong Kong.
The products in this guide are separated FIRST into major
categories such as Power FETs, Power Bipolar, Small Signal,
Monolithic Integrated Circuits, and Low and High Power
Amplifiers. SECOND, within each category parts are listed by
frequency band, except for small signal transistors and
monolithic integrated circuits, which are divided by
application. Small signal transistor applications are low noise,
linear amplifiers, switches, and oscillators. Monolithic
integrated circuit application groupings are switching, receiver
functions and transmitter functions. THIRD, within a
frequency band, transistors are further grouped by operating
voltage and, finally, output power.
Remember
Applications assistance is only a phone call away - call the
nearest Semiconductor Sales office or 1-800-521-6274.
Motorola Master Selection Guide
5.10-1
Page
RF Discrete Transistors ........................ 5.10-2
RF Power MOSFETs ........................ 5.10-4
RF Power Bipolar Transistors. . . . . . . . . . . . . . . .. 5.10-6
HFTransistors ........................... 5.10-6
VHF Transistors ......................... 5.10-6
UHF Transistors ......................... 5.10-7
900 MHz Transistors ..................... 5.10-8
1.5GHzTransistors ..................... 5.10-10
Microwave Transistors ................... 5.10-10
Linear Transistors ....................... 5.10-12
RF Small Signal Transistors ................. 5.10-14
Selection by Package .................... 5.10-15
Plastic SOE Case .................... 5.10-15
Ceramic SOE Case ................... 5.10-17
Selection by Application . . . . . . . . . . . . . . . . .. 5.10-18
Low Noise ........................... 5.10-18
CATV, MATV and Class A Linear ....... 5.10-19
RF Monolithic Integrated Circuits ............... 5.10-20
Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.10-21
Antenna Switches ....................... 5.10-21
Receiver Functions ........................ 5.10-21
General Purpose Integrated Circuits ....... 5.10-21
900 MHz Front End ...................... 5.10-21
1.5-2.2 GHz Front End .................. 5.10-21
2.4 GHz Front End ...................... 5.10-22
Transmitter Functions ...................... 5.10-22
General Purpose Integrated Circuits ....... 5.10-22
900 MHz Transmit Chain ................. 5.10-23
1.5-2.2 GHz Transmit Chain ............. 5.10-24
2.4 GHz Transmit Chain .................. 5.10-25
RF Amplifiers ................................ 5.10-26
High Power ............................... 5.10-28
Land Mobile/Portable .................... 5.10-28
TV Transmitters ......................... 5.10-29
Low Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5.10-30
CATV Distribution ....................... 5.10-30
CRT Drivers ............................ 5.10-35
Fiber Optic Receivers . . . . . . . . . . . . . . . . . . .. 5.10-35
RF Products
RF Discrete Transistors
In the following pages, the reader will find the most extensive group of RF Discrete Transistors offered by any semiconductor
manufacturer anywhere in the world today.
From Bipolar to FET, from Low Power to High Power, the user can choose from a variety of packages. They include plastic, metal
can and ceramic that are microstrip circuit compatible or surface mountable. Many are designed for automated assembly
equipment.
Major sub-headings are MOSFETs, Power Bipolar and Small Signal.
¥ ¥
~ ~
CASE 145A-09
STYLE 1
(.380" STUD)
CASE 145D-02
STYLE 1
(.380"SOE)
~
>f
~
X
~
CASE 317
STYLE 1, 2
(MACRO-X)
CASE 317D
STYLE 2
CASE 249
STYLE 1, 3
(.280" PILL)
CASE 316-01
STYLE 1, 3
(.500"CQ)
CASE 305
STYLE 1
(.204" STUD)
~ ~
CASE 319B
STYLE 1
~
CASE 333A
STYLE 1, 2
(MAACPAC)
RF Products
CASE 328A-03
STYLE 1
~
CASE305A
STYLE 1, 2
(.204" PILL)
X
~
CASE 319
STYLE 1, 2, 3
(CS-12)
CASE 332A
STYLE 2
(.280" PILL)
Q
CASE 355C
STYLE 1
5.10--2
CASE 319A
STYLE 2
u ~
CASE 332-04
STYLE 1, 2
(.280" STUD)
CASE336E
STYLE 1
CASE305D
STYLE 1
CASE305C
STYLE 1
¥
~
CASE 244
STYLE 1
(.280" STUD)
CASE21H1
STYLE 1, 2
(.500" FLANGE)
CASE 211-07
STYLE 1, 2
(.380" FLANGE)
CASE 333
STYLE 1
~
CASE 355D
STYLE 1
Motorola Master Selection Guide
r-------------------------------------------------------."----.-----"--------------------~
CASE 355E
STYLE 1
CASE355G
STYLE 1
CASE360C
STYLE 1
(Viper)
CASE 368
STYLE 2
(HOG PAC)
CASE 376B
STYLE 1
CASE 376C
STYLE 1
CASE 398
STYLE 1
CASE 430B
STYLE 1
Motorola Master Selection Guide
CASE 400
STYLE 1
CASE 451
STYLE 1
CASE 355H-01
STYLE 1
CASE 375
STYLE 2
CASE 390B
STYLE 1
CASE 360A
STYLE 2
CASE 375A
STYLE 1
CASE 395B
STYLE 1
CASE 360B
STYLE 1
(Micro 250)
CASE 375B
STYLE 2
(Micro 860)
CASE 395C
STYLE 1, 2
CASE 401
STYLE 1
CASE412
STYLE 1
CASE 430
STYLE 2
CASE 458
STYLE 1
CASE744A
STYLE 1, 2
CASE 751
STYLE 1
(S0-8)
5.10-3
RF Products
RF Power MOSFETs
Motorola RF Power MOSFETs are constructed using a planar process to enhance manufacturing repeatability. They are
N-channel field effect transistors with an oxide insulated gate which controls vertical current flow.
Compared with bipolar transistors, RF Power FETs exhibit higher gain,. higher input impedance, enhanced thermal stability and
lower noise. The FETs listed in this section are specified for operation in RF Power Amplifiers and are grouped by frequency range
of operation and type of application. Arrangement within each group is first by order of voltage then by increasing output power.
Table 1. To 54 MHz
Designed for broadband HF & VHF commercial and industrial applications. The high gain and broadband performance of
this device makes it ideal for large-signal, common-source amplifier applications in 12.5 volt mobile and base station
operation.
Pout
Output Power
Watts
Device
VCC
Pin
Input Power
Typical
Watts
G ps (Typ)/Freq.
dBIMHz
Eff., Typ
9JC
%
°CIW
0.8
16/54
45
1.0
T]
Package/Style
= 12.5 Volts, Class AB
IMRF255*
I
55
211-11/2
Table 2. To 150 MHz HF/SSB
For military and commercial HF/SSB fixed, mobile and marine transmitters.
Device
Pout
Output Power
Watts
Pin
Input Power
Typical
Watts
G ps
Typical
Gain dB @
30 MHz
d3
dB
18
17
17
20
-35
-32
-25
-25
TypicailMD
Voo = 28 Volts, Class AB
I
d11
dB
9JC
'C/W
Package/Style
-60
-60
1.5
0.6
0.13
0.13
211-07/2
211-11/2
368/2
368/2
Voo = 50 Volts, Class AB
MRF148
MRF150
MRF154
MRF157
30
150
600
600
0.5
3
12
6
-
Table 3. To 225 MHz VHF AM/FM
For VHF military and commercial aircraft radio transmitters.
Device
Voo
5
15
30
30
80
100
125
150
200
300
150
200
300
T]
Gps (Typ)/Freq.
dB/MHz
Efficiency
Typical
%
9JC
°e/W
0.2
0.38
1.2
0.75
4
4
8.3
15
8
30
14/150
16/150
14/150
16/150
131150
14/225
11.8/150
10/175
14/225
10/175
55
60
54
60
65
65
60
55
65
55
10
3.2
1.8
1.8
0.8
0.65
0.65
0.6
0.44
0.35
211-07/2
211-07/2
319B/l
211-07/2
211-11/2
33311
211-11/2
211-11/2
375/2
375/2
7.5
4
7.5
131175
17/225
16/175
45
55
55
0.6
0.44
0.35
211-11/2
375/2
375/2
Package/Style
= 28 Volts, Class AB
MRFl34
MRF136
MRF136Y
MRF137
MRF173
MRF175LV
MRF174
MRF141
MRF175GV
MRF141G
Voo
Pin
Input Power
Typical
Watts
Pout
Output Power
Watts
=50 Volts, Class AB
MRF151
MRF176GV
MRF151G
* New Product
RF Products
5.10-4
Motorola Master Selection Guide
Table 4. To 500 MHz VHF/UHF AM/FM
For VHF/UHF military and commercial aircraft radio transmitters.
Pout
Output Power
Watts
Device
Voo
I
11
Gps (Typ)IFreq.
dBIMHz
Eft., TYP
%
9JC
°CIW
20/400
17/400
17/400
16.5/400
13/400
10/400
121400
121400
12/400
55
50
55
50
50
55
60
60
55
13.2
7.2
2.5
1.5
1.0
0.65
0.65
0.65
0.44
305A12
249/3
319/3
41211
41211
33311
744A12
390B/1
375/2
14/400
50
0.44
375/2
Package/Style
=28 Volts, Class AB
MRF158
MRF160
MRF166C
MRF164W
MRF166W
MRF175LU
MRF177
MRF177M
MRF175GU
Voo
Pin
Input Power
Typical
Watts
2
4
20
20
40
100
100
100
150
0.02
0.08
0.4
0.4
2
10
6.4
6.4
9.5
=50 Volts, Class AB
MRF176GU
I
6
150
Table 5. To 520 MHz
Designed for broadband VHF & UHF commercial and industrial applications. The high gain and broadband performance of
these devices make them ideal for large-signal, common-source amplifier applications in 12.5 volt mobile and base station
operation.
Device
VCC
Pout
Output Power
Watts
Gps (Typ)IFreq.
dB/MHz
Eft., Typ
%
0.27
0.5
10.5/512
11.5/512
50
55
430/2
430B/1
1.1
6.3
11.5/512
7.51512
55
55
31913
316-01/3
Pin
Input Power
TYpical
Watts
Gps (Typ)lFreq.
dB/MHz
Eft., Typ
%
°CIW
0.15
1.2
1.2
1.8
1.8
1.9
3.4
14/1000
14/1000
14/1000
14/1000
14/1000
15/1000
14/1000
55
55
55
55
55
55
55
4.7
1.5
1.5
1.25
1.25
1.1
0.7
11
9JC
°CIW
Package/Style
=7.5 Volts, Class AB
MRF5003(18a)
MRF5007(18a) *
VCC
Pin
Input Power
TYpical
Watts
3
7
=12.5 Volts, Class AB
MRF5015
MRF5035
15
35
Table 6. To 1.0 GHz
For HFNHF/UHF military and commercial radio transmitters.
Device
Pout
Output Power
Watts
11
9JC
Package/Style
Voo = 28 Volts, Class AB
MRF181 (46a)
MRF182*
MRF182S*
MRF183*
MRF183S*
MRF184(46b)
MRF185(3,46b)
4
30
30
45
45
60
85
458/1
360B/1
360C/1
360B/1
360C/1
360B/1
375B/2
(3)lnternallmpedance Matched Push·Pull Transistors
(18)Tape and Reel Packaging Available by adding suffix: a) R1 =500 units; b) R2=2.500 units; c) T1 =3,000 units; d) T3=10,000 units; e) R2=1,500 units.
(46)To be introduced: a)lst half of 1996; b) 2nd hatl of 1996.
* New Product
Motorola Master Selection Guide
5.10-5
RF Products
RF Power Bipolar Transistors
Motorola's broad line of bipolar RF power transistors are characterized for operation in RF power amplifiers. Typical applications
are in military and commerciallandmobile, avionics and marine radio transmitters. Groupings are by frequency band and type of
application. Within each group, the arrangement of devices is by major supply voltage rating, then in the order of increasing output
power. All devices are NPN polarity except where otherwise noted.
HF Transistors
Table 1. 1.5 - 30 MHz, HF/SSB
Designed for broadband operation, these devices feature specified Interrnodulation Distortion at rated power output.
Applications include mobile, marine, fixed station, and amateur HF/SSB eqUipment, operating from 12.5, 13.6,28, or 50 volt
supplies.
Pout
Output Power
Watts
Device
Pin (Max)
Input Power
Watts
GpE(Min)
Gain@30MHz
dB
0C/W
Package/Style
BJC
VCC = 12.5 or 13.6 Volts, Class AB
IMRF421
I
l00PEP/CW
10
10
0.6
211-1111
25 PEP/CW
150PEP/CW
0.16
15
22
10
2.5
0.6
211-07/1
211-11/1
150PEP/CW
250PEP/CW
7.5
15.7
13
12
0.8
0.6
211-11/1
211-1111
VCC = 28 Volts, Class AB
MRF426
MRF422
VCC = 50 Volts, Class AB
MRF429
MRF448
Table 2. 14 - 30 MHz, CB/Amateur Band
These HF transistors are designed for economical, high-volume use in CW, AM and SSB applications.
VCC
=12.5 or 13.6 Volts, Class AB
MRF455
MRF454
60
80
13
12
1
0.7
211-07/1
211-11/1
Pin (Max)
Input Power
Watts
GpE(Min)
Gain@50MHz
dB
6JC
0c/w
Package/Style
5.6
11
0.7
211-11/1
3
5
Table 3. 27 - 50 MHz, Low-Band FM Band
For use in the FM "Low-Band," for Mobile communications.
Pout
Output Power
Watts
Device
VCC
=12.5 or 13.6 Volts, Class AB
IMRF492
I
70
VHF Transistors
Table 4. 30 - 200 MHz Band
Designed for Military Radio and Commercial Aircraft VHF bands, these 28-volt devices include the all-gold metallized
MRF314/16/17 high-reliability series.
Device
VCC
I
Pout
Output Power
Watts
Pin (Max)
Input Power
Watts
GpE (Min)IFreq.
Power Gain
dB/MHz
BJC
°CIW
Package/Style
3
8
12.5
10/150
10/150
9/150
2.2
0.8
0.65
211-07/1
316-01/1
316-01/1
=28 Volts, Class AB
MRF314
MRF316(2)
MRF317(2)
30
80
100
(2)lntemallmpedance Matched
RF Produc1s
5.10-6
Motorola Master Selec1ion Guide
VHF Transistors
(continued)
Table 5. 136 -174 MHz High Band
The "workhorse" VHF FM High-Band is served by Motorola with the broadest range of devices and package combinations
in the industry.
Device
Pout
Output Power
Watts
Pin (Max)
Input Power
Watts
GpE(Min)
Gain @ 175 MHz
dB
8JC
°C/W
0.016
0.11
0.95
3
3
14.3
5
15
18(19)
125(1)
11.5
12
10
10
4.5
9
7
25
4
1.6
1.8
2.2
2.2
0.7
Package/Style
VCC = 12.5 Volts, Class C
MRF4427(18b)
MRF553
MRF2628
MRF1946
MRF1946A
MRF224
MRF240
MRF247 (2)
1
1.5
15
30
30
40
40
75
751/1
317D/2
244/1
211-07/1
145A-09/1
211-07/1
145A-09/1
316-01/1
UHF Transistors
Table 6. 100 - 400 MHz Band
Stringent requirements of the UHF Military band are met by MRF325, 326, 327, 329 and 2N6439 types, with all-gold nietal
systems, specified ruggedness and programmed wirebond construction, to assure consistent input impedances for internally
matched parts.
Device
Pout
Output Power
Watts
Pin (Max)
Input Power
Watts
GpE(Min)
Gain @ 400 MHz
dB
30
40
60
80
100
125
4.3
5
10
14.9
20
19.8
8.5
9
7.8
7.3
7
8
8JC
°C/W
Package/Style
VCC = 28 Volts, Class C
MRF325(2)
MRF326(2)
2N6439(2)
MRF327(2)
MRF329(2)
MRF392(3)
2.2
1.6
1.2
0.7
0.7
0.7
316-01/1
316-01/1
316-01/1
316-01/1
33311
744A11
Table 7. 400 - 500 MHz Band
Similar to the 100-400 MHz transistors, these devices have bandwidth capabilities operating up to 500 MHz. All have nitride
passivated die, gold metal systems, specified ruggedness and controlled wirebond construction to meet the stringent
requirements of military space applications.
I
Device
Pout
Output Power
Watts
Pin (Max)
Input Power
Watts
GpE (MlnYFreq.
Power Gain
dBIMHz
1
10
20
100
0.03
0.62
2
18
15/400
8JC
°CIW
Package/Style
VCC = 28 Volts, Class C
MRF313
MRF321
MRF323
MRF393(3)
121400
10/400
7.5/500
28.5
6.4
3.2
0.7
305Ail
244/1
244/1
744A11
(1 )RSJA- Thermal Resistance Junction to Ambient.
(2)'ntemallmpedance Matched
(3)'ntemallmpedance Matched Push·Pull Transistors
(18)Tape and Reel Packaging Available by adding suffix: a) Rl =500 units; b) R2=2,500 un~s; c) Tl =3,000 units; d) T3= 10,000 units; e) R2= 1,500 units.
(19)Typical
Motorola Master Selection Guide
5.10-7
RF Products
I
UHF Transistors
(continued)
Table 8. 470 - 512 MHz Band
Higher power output devices in this UHF power transistor series feature internally input-matched construction, are designed
for broadband operation, and have guaranteed ruggedness under output mismatch and RF overdrive conditions. Devices
are specified for handheld, mobile and base station operation.
Device
VCC
Pout
Output Power
Watts
Pin (Max)
Input Power
Watts
GpE (Min)/Freq.
Power Gain
dB/MHz
0c/w
0.6
1.5
5
5
10
10
15
15
25
50
65
0.03
0.15
0.5
0.5
2
2
2.5
2.5
5.9
15.B
25
131500
10/470
10/512
10/512
7/512
7/512
7.8/470
7.B/512
6.21470
5.0/512
4.15/512
40
25
7
7
4
4
4
4
1.7
1.3
1
Package/Style
=12.5 Volts, Class C
MRF5Bl(4)
MRF555
MRF652
MRF652S
MRF653
MRF653S
MRF641 (2)
MRF654(2)
MRF644(2)
MRF650(2)
MRF65B(2)
Device
VCC
9JC
Pout
Output Power
Watts
1.5
15
50
317/2
3170/2
24411
249/1
244/1
24911
316-01/1
244/1
316-01/1
316-01/1
316-01/1
Class
Pin (Max)
Input Power
Watts
GpE (MinVFreq.
Power Gain
dB/MHz
9JC
°C/W
Package/Style
A
AS
AS
0.075
1.2
6
131470
111470
9/470
21
7.0
1.2
249/1
319/2
333A12
= 24 Volts
TP5002S
TP5015
TP5051
900 MHz Transistors
Table 9. 870 - 960 MHz Band
Designed specifically for the 900 MHz mobile radio band, MRF840 through MRF847 devices offer superior gain and
ruggedness, using the unique C8-12 package, which minimizes common-element impedance, and thus maximizes gain
and stability. Devices are listed for mobile and base station applications.
Device
VCC
= 12.5 Volts -
MRF559(5)
MRF5Bl(5)
MRFB37(5)
MRFB372(5) (lBa,b)
MRF557(5)
MRFB39F(5)
MRFB40(2)(6)
MRFB42(2)(6)
MRFB44(2)(6)
MRFB47(2)(6)
Pout
Output Power
Watts
Class C -
Pin (Max)
Input Power
Watts
GpE (MinVFreq.
Power Gain
dB/MHz
O.OB
0.06
0.11
0.11
0.23
0.46
2.5
5
9
16
B/B70
1O(19)/B70
9JC
°C/W
Package/Style
SI Bipolar
0.5
0.6
0.75
0.75
1.5
3
10
20
30
45
B/B70
8/B70
8/B70
8/870
61B70
61B70
5.2/B70
4.5/B70
50
40
40
45
25
9
3.1
1.5
1.5
1
317/2
317/2
317/1
75111
3170/2
319/2
319/1
319/1
319/1
319/1
(2)lnternallrnpedance Matched
(4)Small signal gain. Po is Typ.
(5)Common Emitter Configuration
(6)Common Base Configuration
(18)Tape and Reel Packaging Available by adding suffix: a) R1 = 500 units; b) R2= 2,500 units; c) T1 =3,000 units; d) T3= 10,000 units; e) R2= 1,500 units.
(19)Typical
RF Products
5.10-8
Motorola Master Selection Guide
900 MHz Transistors
(continued)
Table 9. 870 - 960 MHz Band (continued)
I
Device
Vee
=24 Volts -
MRF890
TP3007S
MRF857
MRF857S
MRF896
MRF858
MRF858S
TP3008
MRF891
MRF891S
MRF859*
MRF859S*
TP3021
MRF860
MRF892(2)
MRF861
MRF894(2)
MRF897(3)
MRF897R(3)*
TP3034
MRF862
MRF898(2)
Vee
=26 Volts -
Pout
Output Power
Watts
1
Class
Pin(Max)
Input Power
Watts
Gp (Min)/Freq.
Power Gain
dB/MHz
C
AB
A
A
AB
A
A
AB
AB
AB
A
A
AB
A
C
A
C
AB
AB
AB
A
C
0.25
0.25
0.4
0.4
0.3
0.29
0.29
0.28
0.63
0.63
0.46
0.46
1.0
1.1
2
8
6
3
3
7
4.5
12
9/900
9/960
12.5/900
12.51900
10/900
11/900
11/900
11.5/960
9/900
9/900
11.5/900
11.5/900
10/960
11/900
8.5/900
9.5/900
7/900
10/900
10.5/900
7/960
9/900
7/900
25
21
8.4
8.4
7
6.9
6.9
5
7
7
3.9
3.9
5.0
1.9
3.5
0.92
1.5
1.7
1.7
2.3
0.75
1
30511
305C/l
305/1
305D/l
305/1
319/2
319A12
319/2
319/2
319A12
319/2
319A12
319/2
395B/l
319/1
375A11
319/1
395BI1
395811
319/2
375A11
333A11
AB
AB
AB
12.7
18
24
8.5/900
7.5/960
8/900
1.3
0.7
375A11
375A11
375A11
6JC
'CIW
PackagelStyle
Si Bipolar
2
2
2.1 (CW)
2.1 (CW)
3
3.6 (CW)
3.6 (CW)
4
5
5
6.5W(CW)
6.5W(CW)
10
13.7 (CW)
14
27 (CW)
30
30
30
35
36 (CW)
60
Si Bipolar
MRF880(3)
TP3069
MRF899(3)
90
100
150
0.8
(2)lntemallmpedance Matched
(3)lnternallmpedance Matched Push-Pull Transistors
* New Product
Motorola Master Selection Guide
5.10-9
RF Products
1.5 GHz Transistors
Table 10. 1400 -1640 MHz Band
Device
Pout
Output Power
Watts
Class
6
30
C
C
MRF16006
MRF16030
Pin(Max)
Input Power
Watts
Gp (Mln)lFreq.
Power Gain
dB/MHz
1.09
5.33
9JC
°CIW
6.8
1.7
7.4/1600
7.5/1600
Package/Style
395C/2
395C/2
Microwave Transistors
Table 11. L-Band Pulse Power
These products are designed to operate in short pulse width, 10 !ls, low duty cycle, 1%, power amplifiers operating in the
960-1215 MHz band. All devices have internal impedance matching. The prime application is avionics equipment for
distance measuring (DME), area navigation (TACAN) and interrogation (IFF).
Device
VCC
=18 Volts -
VCC
0.2
0.2
=35 Volts -
Class B & C Common Base
=50 Volts -
Class C Common Base
IMRF1004MA
9JC
°CIW
0.02
0.02
10
10
25
25
332-04/2
0.4
10
25
332-0411
9
25
80
10
7.8
6.7
0.6
0.3
0.12
332-04/1
332-04/1
355G/1
Package/Style
Class A & AB Common Emitter
MRF1000MA
MRF1000MB
VCC
Gp(Min)
Gain @ 1090 MHz
dB
Pin(Max)
Input Power
Watts
Pout
Output Power
Watts
I
MRF1090MA
MRF1150MA
MRF1375
4
90
150
375
332A12
Table 12. L-Band Long Pulse Power
These products are designed for pulse power amplifier applications in the 960-1215 MHz frequency range. They are
capable of handling up to 10!lS pulses in long pulse trains resulting in up to a 50% duty cycle over a 3.5 millisecond interval.
Overall duty cycle is limited to 25% maximum. The primary applications for devices of this type are military systems,
specifically JTIDS and commercial systems, specifically Mode S. Package types are hermetic.
Pout
Output Power
Watts
Device
VCC
=28 Volts -
Class C Common Base
=36 Volts -
Class C Common Base
IMRF10005
VCC
MRF10031
MRF10120
RF Products
I
5
30
120
I
Pln(Max)
Input Power
Watts
GpB(Min)
Gain @ 1215 MHz
dB
9JC
°CIW
0.71
8.5
8
336E/1
3
19
10
8
3
0.6
376B/1
355C/1
5.10-10
Package/Style
Motorola Master Selection Guide
Microwave Transistors
(continued)
Table 12. L-Band Long Pulse Power, Class C Common Base (continued)
Device
VCC
Pout
Output Power
Watts
Pin(Max)
Input Power
Watts
GpB(Min)
Gain @ 1215 MHz
dB
8JC
0c/w
Package/Style
70
150
350
500
500
7
15
10(7)
10(7)
9(7)
9(7)
9(7)
0.4
0.25
0.11
0.12
0.12
376G/l
376B/l
355E/l
3550/1
355H/1
=50 Volts
MRF10070
MRF10150
MRF10350
MRF10500
MRF10501
44
63
63
Table 13. 2 GHz Narrowband CW
The MRW2000 Series of NPN Silicon microwave power transistors are designed for common base service in amplifier or
oscillator applications in the 1-2.3 GHz frequency range.
Pout
Output Power
Watts
Device
VCC = 28 Volts -
Pin(Max)
Input Power
Watts
GpB(Min)
Gain @2GHz
dB
0.13
0.8
9
8
8JC
0c/w
Package/Style
Class B & C Common Base
MRW2001
MRW2005
5
35
8.5
328A11
328A11
Table 14. 3 GHz Narrowband CW, Class B & C Common Base
The MRW3000 Series are the industry's first 100% VSWR tolerant 3 GHz devices. They are common-base configured in
hermetic packages and rated for 28 volt operation.
Device
Pout
Output Power
Watts
Pin(Max)
Input Power
Watts
GpB(Min)
Gain @ 3.0 GHz
dB
3
5
0.2
0.75
1.6
7
6
5
9JC
°CIW
Package/Style
VCC = 28 Volts
MRW3001
MRW3003
MRW3005
(7)Typical
@
35
17
8.5
328A11
328A11
32BAl1
1090 MHz
Motorola Master Selection Guide
5.10-11
RF Products
Linear Transistors
The following sections describe a wide variety of devices specifically characterized for linear amplification. Included are medium
power and high power parts covering frequencies from 100 MHz-4 GHz.
Table 15. To 1 GHz, Class A
These devices offer a selection of performance and price for linear amplification to 1 GHz. The "MRA" prefix parts are input
matched and feature high overdrive and extreme ruggedness capability.
Device
Vee
GSS (MinVFreq.
Small Signal Gain
dB/MHz
(VdcJA)
7
14
9/1000
811000
19/1.2
19/2.4
1.5
6
8/1000
6.5/1000
25/0.2
2510.85
Package/Style
=19 Volts
MRA100G-7L
MRA100G-14L
Vec
Bias
Point
Po @ 1 dB
Comp. Point
Watts
4
2.1
145J)-{)211
145J)-{)211
=25 Volts
MRF1029(9)
MRF1032(9)
12
3.5
244/1
24411
Table 16. To 2 GHz, Class A
These parts offer low cost alternatives to matched devices used primarily as pre-drivers to 2 GHz.
Device
Vec
Po @ 1 dB
Comp. Point
Watts
GSS (MinVFreq.
Small Signal Gain
dBIMHz
(VdcJA)
0.5
0.5
0.8
0.8
1.6
1.6
5
10.5/2000
10.5/2000
9/2000
9/2000
9/2000
9/2000
7/2000
20/0.12
20/0.12
20/0.12
20/0.12
20/0.24
20/0.24
19/0.6
Bias
Point
Package/Style
=20 Volts
MRF3094(9)
MRF31 04(9)
MRF3095(9)
MRF31 05(9)
MRF3096(9)
MRF31 06(9)
MRF200G-5L(10)
40
40
35
35
22
22
10
328A12
305A11
328A12
305A11
328A12
305A11
360Al2
Table 17. UHF Ultra Linear For TV Applications
The following devices have been characterized for ultra-linear applications such as low-power TV transmitters in Band IV
and Band V. Each features diffused ballast resistors and an all-gold metal system to provide enhanced reliability and
ruggedness.
Device
Vcc
Gp (Min)/Freq.
Small Signal Gain
dB/MHz
3 Tone
0.5
1
4
11.5/860
10.5/860
7/860
-58
-58
-60
20
9
5
24411
24411
24411
14
25
20/35(11)
9.5/860
8.5/860
9.5/860
-47
-45
-51/-
2.5
1.5
1.1
395B/1
39811
375A11
8.5/960
1.3
333A12
8.5/860
0.7
398/1
IMO(8)
dB
Package/Style
=20 Volts, Class A
TPV596A
TPV597
TPV598
Vcc
Pref{Min)
Watts
=25 Volts, Class A
TPV695A
TPV7025
TPV6030
Vec = 26 Volts, Class AB
IMRF6414*
Vce
I
=28 Volts, Class AB
ITPV8100B
I
100(11)
(B)Vision Carrier: - B dB; Sound Carrier. - 7 dB; Sideband Carrier: - 16 dB
(9)Forrner Prefix was "RF"
(1 O)Former prefix was "MRA."
(11)Output power at 1 dB compression in Class AB
* New Product
RF Products
5.1G-12
Motorola Master Selection Guide
Linear Transistors
(continued)
Table 18. Microwave Linear For peN Applications
The following devices have been developed for linear amplifiers in the 1.5-2 GHz region and have characteristics
particularly suitable for peN base station applications.
Device
Pout
Watts
0.5
4.5
30
12
30
60
90
60
MRF6401 (12)
MRF6402(13)
MRF6404(16)
MRF6408*
MRF15030
MRF15060(46b)
MRF15090
MRF20060(46b)
Class
Bias
Point
Vdc/mA
Gain (Typ)/Freq
dB/MHz
8JC
°C/W
A
AS
AS
AS
A,AS
A,AS
A,AS
A,AS
20/80
26/40
261150
26/100
26/125
26/200
26/250
26/200
10/1880
10/1880
8.5/1880
8.8/1880
911490
10/1490
7.5/1490
912000
30
5
1.4
2.8
1.4
0.7
0.7
0.7
Package/Style
305C/1
319/2
395C/1
395C/1
395C/1
451/451A11
375A11
451/1
Table 19. Microwave Linear Power
Common emitter microwave devices are offered for a wide variety of uses in small and medium signal, Class A, AS and C
applications up to 4 GHz. The use of ali-gold metal systems, diffused ballast resistors and hermetic packaging results in
devices that display excellent reliability even in a military environment.
GSS (Min) @ Freq.
Small Signal Gain
dB/GHz
1 dB
Compo
Watts
Psat
Watts
-30 dB
IMD
Watts
Emitter
Current
MRW53502
MRW53601
5/3
6/3
1.6
0.8
2
1
1.5
0.8
230
120
401/1
328A11
MRW54001
MRW54601
5/4
6/4
0.5
0.5
0.8
0.8
0.5
0.5
120
120
400/1
328A11
Device
Voo
rnA
Package/Style
=20 Volts
(12)Formerly known as "TP4001 S"
(13)Formerly known as "TP4004"
(16)Formerly known as "TP4035"
(46)To be introduced: a)1 st half of 1996; b) 2nd half of 1996.
* New Product
Motorola Master Selection Guide
5.10-13
RF Products
RF Small Signal
Transistors
,
Motorola's broad line of RF Small Signal Transistors includes
NPN and PNP Silicon Bipolar Transistors characterized for
low noise amplifiers, mixers, oscillators, multipliers,
non-saturated switches and low-power drivers.
CASE 29-04
STYLE 2
(TO-226M)
CASE244A
STYLE 1
CASE 317
STYLE 2
(MACRO-X)
CASE 317A
STYLE 2
(MACRO-T)
CASE 317D
STYLE 2
(POWER MACRO)
CASE 318-08
STYLE 6
(SOT-23)
These devices are available in a wide variety of package
types: plastic Macro-X and Macro-T, ceramic and surface
mounted. Most of these transistors are fully characterized with
s-parameters.
•
CASE 318A
STYLE 1
LOW PROFILE
(SOT-143)
CASE 419
STYLE 3, 6
(SC-70/S0T-323)
CASE 751
STYLE 1
(S0-8)
RF Products
5.10-14
Motorola Master Selection Guide
RF Small Signal Transistors
RF Small Signal Transistor
Gain Characteristics
N
~
b
is
Curve numbers apply to transistors
listed in the subsequent tables.
6 t---t---ct-t-ft---cH'--t---c+--t---\---j--;+--j
~
Selection by Package
c..
5
~
In small-signal RF applications. the package style is often
determined by the end application or circuit construction
technique. To aid the circuit designer in device selection. the
Motorola broad range of RF small-signal amplifier transistors
is organized by package. Devices for other applications such
as oscillators or switches are shown in the appropriate
preceding tables. These devices are NPN polarity unless
otherwise designated.
~ 4r-~r-7t1-~+--r-~~+--~-1--+-~
z
~
-= 3r-+-HI++r-h'-I---;,;;t...,c....+--~-1--+-~
o~_~~_~~_~~_~_~_~~_~
0.1
2.5 5
10
15 20
30
50
75 100
150
IC. COLLECTOR CURRENT (rnA)
Plastic SOE Case
Table 1. Plastic SOE Case
Gain-Bandwidth
@
tr
Typ
Device
GHz
I
IC
mA
Maximum Ratings
Curve
No.
Page
5.1.0-15
NFmin @ f
Typ
dB
I
Typ
MHz
@
Gain
dB
Case 29-0411,2, T0--226AA
I
f
MHz
V(BR)CEO
Volts
IC
mA
LP1001
5
10
-
2.7
500
12.5
1000
15
-
LP1001A
5
10
-
3.2
1000
12.5
1000
15
-
MPS901(29)
4.5
15
7
2.4
900
12
900
15
30
MPS911(29)
7
30
8
1.7
500
16.5
500
12
40
8
50
12
2
500
14
500
10
80
0.8
50
1
-
-
10
400
30
400
MPS571
MPS3866
Package
I
(29)Packaging Options Available in Tape and Reel and Fan Fold Box
Motorola Master Selection Guide
5.10-15
RF Products
Selection by Package
(continued)
Table 1. Plastic SOE Case (continued)
Gain-Bandwidth
@
".
Typ
GHz
Device
Case 317/2 -
MACRo-X
I
IC
mA
Maximum Ratings
Curve
No.
Page
5.10-15
NFmin @
TyP
dB
f
I MHz
Gain @
TyP
dB
I
f
MHz
V(BRlCEO
Vots
IC
mA
MRF901
4.5
15
7
2
1000
12
1000
15
30
MRF941
8
15
15
2.1
2000
12.5
2000
10
50
MRF571
8
50
12
1.5
1000
12
1000
10
70
MRF951
8
30
-
2.1
2000
12.5
2000
10
100
MRF559
3
100
10
-
13
512
18
150
MRF581
5
75
11
2
500
15.5
500
18
200
MRF581A
5
75
11
1.8
500
15.5
500
15
200
MRF837
5
75
11
-
-
10
870
16
200
-
-
-
-
-
13
175
16
500
12.5
470
16
400
9
870
16
400
MMBR521 LT1(17)(18c)
3.4
-35
-
1.5
500
15
500
-10
-70
MMBR931 LT1 (18c)
3
1
6
4.3
1000
10
1000
5
5
MMBR5031 LT1 (18c)
1
5
-
2.5
450
17
450
10
20
-
15
-
15
25
Case 317A12 -
-
Package
X
MACRO-T
BFR90
BFR96
Case 317D/2
MRF553
MRF555
MRF557
Case 318-0816 -
-
~
SOT-23
BFS17LT1(18c)
1.3
25
BFR92ALT1(18c)
4.5
14
-
-
15
MMBR901 LT1 (18c)
4
15
7
1.9
1000
12
BFR93ALT1(18c)
3.4
30
2.5
30
-
MMBR920LT1 (18c)
4.5
14
-
2.4
500
15
MMBR5179LT1(18c)
1.4
5
4
-
-
15
MMBR941 LT1 (18c,d)
8
15
15
2.1
2000
8.5
MMBR941 BLT1(18c,d)
8
15
15
2.1
2000
MMBR911 LT1 (18c)
6
30
8
2
500
MMBR571 LT1 (18c)
8
50
12
2
500
MMBR951 LT1 (18c)
8
30
-
2.1
MMBR951ALT1(18c)
8
30
-
2.1
1000
15
30
12
35
500
15
35
200
12
50
2000
10
50
8.5
2000
10
50
17
500
12
60
16.5
500
10
80
2000
7.5
2000
10
100
2000
7.5
2000
10
100
-
~
(17)PNP
(18)Tapeand Reel Packaging Available by adding suffix: a) R1 ~500 unils; b) R2~2.500 units; c) T1 ~3,OOO units; d) T3~10,OOO units; e) R2~1,500 units.
RF Products
5.10-16
Motorola Master Selection Guide
Selection by Package
(continued)
Table 1. Plastic SOE Case (continued)
Gain-Bandwidth
@
for
Typ
GHz
Device
Case 318A11 - SOT-143
MRF5711 LT1(18c)
8
MRF5211LT1(17)(18c)
4.2
MRF9331 LT1 (18c)
MRF9011LT1(18c)
I
IC
mA
Maximum Ratings
Curve
No.
Page
5.10-15
Gain @
NFmin @ f
Typ
dB
I
MHz
Typ
dB
I
f
MHz
V(BR)CEO
Volts
IC
mA
12
1.6
1000
13.5
1000
10
70
-50
-
2.8
1000
11
1000
-10
-70
5
1
-
2.5
1000
12.5
1000
8
2
3.8
15
7
2.3
1000
10.2
1000
15
30
MRF9411LT1(18c)
8
15
15
2.1
2000
9.5
2000
10
50
MRF9411 BLT1 (18c)
8
15
15
2.1
2000
9.5
2000
10
50
50
MRF0211LT1(18c)
5.5
40
12
1.8
1000
9.5
1000
15
70
MRF5811LT1 (18c)*
5
75
11
2.0
500
18.4
500
18
200
MRF9511 LT1 (18c)
8
30
-
2.1
2000
9
2000
10
100
MRF9511ALT1(18c)
8
30
-
2.1
2000
9
2000
10
100
10
Case 41913 - SC-70/S0T-323
MRF927T1(18c)*
8
5
14
1.7
1000
9.8
1000
10
MRF947T1 (18c,d)
8
15
15
2.1
2000
10.5
1500
10
50
MRF947AT1(18c)
8
15
15
2.1
2000
10.5
1500
10
50
MRF947BT1(18c,d)
8
15
15
2.1
2000
10.5
1500
10
50
MRF957T1 (18c)
8
30
-
2.0
2000
9
1500
10
100
8
15
-
2.1
2000
10.5
1500
10
50
MRF5943(18a,b)
1.5
35
2
3.4
200
12
250
30
400
MRF3866R2(18b)
0.8
50
1
-
10.5
400
30
400
MRF4427(18b)
1.6
50
1
-
-
18
175
20
400
MRF5812(18a,b)
5.5
75
11
2
500
15.5
500
15
200
MRF8372(18a,b)
5
75
11
-
-
10
870
16
200
Case 419/6 - SC-70/S0T-323
MRF947RT3(18d)
Case 75111 - S0-8
Package
•
•
•
~
Ceramic SOE Case
Table 2. Ceramic SOE Case
Maximum Ratings
Gain-Bandwidth
@
for
Device
Typ
GHz
Case 244A11
I
IC
mA
Curve
No.
Page
5.10-15
Typ
dB
N@
f
I
MHz
IMR~'
Gain @
Typ
dB
I
f
MHz
V(BR)CEO
Volts
15
IC
mA
Package
I~I~I
(18)Tape and Reel Packaging Available by adding suffix: a) R1 =500 units; b) R2=2,500 units; c) T1 =3,000 units; d) T3=10,OOO units; e) R2=1,500 units.
* New Product
Motorola Master Selection Guide
5.10-17
RF Products
Selection by Application
Table 3. Low Noise
The Small-Signal devices listed are designed for low noise and high gain amplifier mixer, and multiplier applications. Each
transistor type is available in various packages. Polarity is NPN unless otherwise noted.
Curve Number (See figure below)
Case
Package
X
~
~
•
•
~
2<17)
Name
Number
1
MACRO-X
317/2
MRF941
MRF951 (20)
To-226AA
29-04/2
SOT-23
318-08/6
-
3
4
5
-
MRF571
MRF581
MRF901
-
MPS571
-
MPS901
MMBR941LT1
MMBR941BLT1 MMBR521LT1 MMBR571LT1
MMBR951 LT1 (20)
SC-70/
SOT-323
419/3,6
MRF927T1
MRF947AT1
MRF947T1
MRF947BT1
MRF947RT3
MRF957T1 (20)
SOT-143
318A11
MRF9411BLT1
MRF9411LT1
MRF9511LT1(20)
MRF9511ALT1
So-a
751/1
-
-
MRF5211LT1
-
-
-
MPS911
MMBR901LT1 MMBR911LTI
-
-
MRF5811LT1
MRF9011LT1
-
MRF5812
-
-
-
MRF5711LT1
MRF0211LT1
-
-
6
(17)PNP
(20)Higher Current Version
24
iD 20
:s
2
46253
1
=~
:;;: 16
c:l
~
0
w
'<
~..,.
en
....2
c:l
~
12
."-
2,4
6iD
5:S
I~ ~ \..
4~
&. i'.
8
w
6/ ~3
1
5 V
i"""
4
c:l
3U::
w
2!G
~
~
1u:
0
0
0.1
0.2
0.3
2
0.5
3
2
10
t, FREQUENCY (GHz)
Gain and Noise Figure versus Frequency
RF Products
5.10-18
Motorola Master Selection Guide
Selection by Application
(continued)
Table 4. CATV, MATV and Class A Linear
For Class A linear CATV/MATV applications. Listed according to increasing gain bandwidth (IT).
Distortion Specifications
Noise Figure
Device
Nominal Test
Conditions
VCEIIC
Volts/rnA
Typ
MHz
MMBR5179LT1(18c)
fT
Typ/Freq.
dB/MHz
2nd
Order
IMD
dBc
3rd
Order
IMD
dBc
12 Ch.
CrossMod.
dBc
Output
Level
dBrnV
V(BR)CEO
V
Package!
Style
318-08/6
6/5
1500
4/450
12
15/50
1500
3.4/200
30
751/1
MMBR5031 LT1 (18c,d)
6/5
2000
1.9/450
10
318-{)8/6
MMBR920LT1 (18c,d)
10/14
4500
2.4/500
15
318-08/6
BFR96
10/50
4500
2/500
15
317N2
BFR90
10/14
5000
2.4/500
15
317N2
MRF581
10175
5000
2.7/300
-65
+50
18
317/2
+50
15
317/2
+50
15
751/1
MRF5943(18a,b)
MRF581A
10/75
5000
1.8/500
-65
MRF5812(18a,b)
10/75
5000
1.8/500
-65
LP1001
5000
2.7/500
15
29-{)4/2
LP1001A
5000
3.211000
15
29-{)4/2
5500
3/500
17
244N1
MRF587
15/90
-52
-72
+50
(17)PNP
(18)Tape and Reel Packaging Available by adding suffix: a) RI =500 units; b) R2 = 2,500 units; c) TI =3,000 unns; d) T3=10,OOO units; e) R2= I ,500 units.
Motorola Master Selection Guide
5.10-19
RF Products
Monolithic
Integrated Circuits
CASE 318A-Q5
(SOT-143)
CASE 751
(SQ-8)
Motorola's RF monolithic integrated circuit devices provide an
integrated solution for the personal communications market.
These devices are available in plastic SOIG-8, SOIC-16,
SOT-143, TSSOP-16, TSSOP-20 or PFP-16 packages.
Evaluation Boards
Evaluation boards are available for RF Monolithic Integrated
Circuits by adding a ''TP' suffix to the device type. For a
complete list of currently available boards and ones in
development for newly introduced poduct, please contact
your local Motorola Distributor or Sales Office.
CASE 751B
(S0-16)
CASE948D
(TSSOP-20)
RF Products
CASE 948C
(TSSOP-16)
CASE 978
(PFP-16)
5.10-20
Motorola Master Selection Guide
RF Monolithic Integrated Circuits
Switching
Antenna Switches
Device
Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
I1A (Typ)
Pin, 1 dB
Compression
dBm(Typ)
TX
Insertion
Loss
dB (Typ)
Isolation
dB (Typ)
Package
System
Applicability
MRFIC2003(18b)
100-1000
2.8-6.0
<10
21
0.5
20
So-a
CT2,ISM
MRFIC1801(18b)
1500-2500
2.7-5.5
300
29
0.6
20
So-a
DECT, PHS,
PCS,ISM
MRFIC0903(18b)*
100-2000
2.7-5.0
60
35.5
0.65
21
So-a
AMPS, Class 4&5 GSM,
DCS1800, PHS, PCS
Receiver Functions
General Purpose Integrated Circuits
General Purpose Cascode Amplifier
Small
Signal
Gain
Device
Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
mA(Typ)
MHz
dB (Typ)
Noise
Figure
dB (Typ)
Reverse
Isolation
dB (Typ)
Package
MRFIC0915(18c)*
100-2000
2.7-5.0
2.2
16.5
1.9
44
SOT-143
AMPS,CT1,CT2,GSM,Is-54,
ISM, DECT, PHS, PCS
MRFIC0916(18c)*
100-2000
2.7-5.0
4.7
18.5
1.9
44
SOT-143
AMPS,CT1,CT2,GSM,Is-54,
ISM, DECT, PHS, PeS
@900
System
Applicability
900 MHz Front End
LNA+ Mixer
Device
MRFIC2001 (18b)
RF Freq.
Range
MHz
IF Freq.
Range
MHz
Supply Volt.
Range
Vdc
Supply
Current
mA(Typ)
Conv.
Gain
dB (Typ)
Output Level,
1 dB Camp.
dBm(Typ)
Package
System
Applicability
500-1000
0-250
2.7-5.0
4.7
23
-10
So-a
CT2,ISM
1.5 - 2.2 GHz Front End
Integrated LNA
Device
Freq.
Range
MHz
Supply Volt.
Range
Vdc
Supply
Current
mA(Typ)
Small Signal
Gain
dB (Typ)
Noise
Figure
dB (Typ)
Reverse
Isolation
dB (Typ)
Package
System
Applicability
DECT, PHS, PCS
MRFIC1501(18b)*
1000-2000
3-5
5.7
18
1.1
26
So-a
MRFICl808(18b)*
1700-2100
2.7-4.5
4.2
17
1.6
37
so-a
(lB)Tape and Reel Packaging Available by adding suffix: a) Rl =500 units; b) R2 =2,500
* New Product
Motorola Master Selection Guide
5.10-21
unns; c) Tl =3,000 units; d) T3=10,OOO units; e)
DECT, PHS, PCS
R2= 1 ,500 unns.
RF Products
Receiver Functions: 1.5 - 2.2 GHz Front End
(continued)
Integrated LNAlDownconverter
RF
Freq.
Range
GHz
IF
Freq.
Range
GHz
Supply
Volt.
Range
Vdc
Supply
Current
RXMode
mA(Typ)
Mixer
Conv.
Gain
dB (Typ)
LNA
Gain
dB (Typ)
LNA
Noise
Figure
dB (Typ)
Package
System
Applicability
1.8-1.925
70-325
2.7-3.3
10
4
14
2.3
So-16
DECT,PHS,PCS
1.8-2.0
70-300
2.7-4.5
10
9
17
2.5
TSSOP-16
DECT,PHS,PCS
System
Applicability
Device
MRFIC1804(18b)
MRFIC1814(18b,46a)
2.4 GHz Front End
Integrated LNAIDownconverter
Device
RF Freq.
Range
MHz
IF Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
mA(Typ)
Conv.
Gain
dB (Typ)
LNA
Noise
Figure
dB (Typ)
Isolation
LotoRF,
Loto IF
dB (Typ)
Package
MRFIC2401 (18b)
2400-2500
100-350
4.75-5.25
9.5
21
1.9
20
So-16
WLAN,
MMDS,ISM
Transmitter Functions
General Purpose Integrated Circuits
Quadrature Modulator
Device
MRFICOOOl (18b)
Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
mA(Typ)
Gain
Control
dB(Typ)
Lo
Leakage
dBm (Typ)
SSB Pout,
1 dB
Compression
dBm(Typ)
Package
50-260
2.7-5.5
10
30
-55
-10
TSSOP-20
Noise
Figure
dB (Typ)
Reverse
Isolation
dB (Typ)
Package
System
Applicability
DCS1800, GSM, NADC
PDC,PHS
General Purpose Cascode Amplifier
Device
Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
mA(Typ)
Small
Signal
Gain
@900
MHz
dB (Typ)
MRFIC0915(18c)*
100-2000
2.7-5.0
2.2
16.5
1.9
44
SOT-143
AMPS,CT1,CT2,GSM,I5-54,
ISM, DECT, PHS, PCS
MRFIC0916(18c)*
100-2000
2.7-5.0
4.7
18.5
1.9
44
SOT-143
AMPS,CT1,CT2, GSM,I5-54,
ISM, DECT, PHS, PCS
System
Applicability
(18)Tape and Reel Packaging Available by adding suffix: a) R1 =500 units; b) R2=2,5oo untts; c) T1 =3,000 units; d) T3=10,OOO units; e) R2=1,500 units.
(46)To be introduced: a)1st half of 1996; b) 2nd haH of 1996.
* New Product
RF Products
5.10-22
Motorola Master Selection Guide
Transmitter Functions (continued)
900 MHz Transmit Chain
Transmit Mixer
RF
Freq.
Range
MHz
IF
Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
mA(Typ)
Standby
Current
!lA(Typ)
Conv.
Gain
dB (Typ)
Output
Level,
1 dBComp.
dBm (Typ)
Package
MRFIC2002(18b)
500-1000
0-250
2.7-5.0
5.5
0.1
10
-18
SO-8
AMPS,CT1 ,CT2,
GSM, IS-54, ISM
MRFIC21 01 (18b)
800-1000
0-250
3-4.75
45
2
26.5
4.5
S0-16
AMPS,CT1,CT2,
GSM, IS-54, ISM
Device
System
Applicability
Driver and Amplifier
Freq.
Range
MHz
Supply
Volt.
Range
Vdc
Supply
Current
mA
(Typ)
Standby
Current
mA(Typ)
Small
Signal
Gain
dB (Typ)
Gain
Control
dB (Typ)
Pout, 1 dB
Compression
dBm (Typ)
Package
800-1000
2.7-4.0
11
0.7
21.5
34
-1
S0-16
AMPS,CT1,CT2,
GSM,ISM
800-1000
2.7-5.0(47)
280
0.05
27
24.5
25.5
SO-16
AMPS,GSM,ISM
Device
MRFIC2004(18b)
MRFIC0904(18b)
*
System
Applicability
Integrated Power Amplifiers
Low Power gOO MHz Power Amplifiers
Device
Freq.
Range
MHz
Supply Volt.
Range
Vdc
Supply
Current
mA(Typ)
Small Signal
Gain
dB (Typ)
Return Loss
Input/Output
dB (Typ)
Pout, 1 dB
Compression
dBm (Typ)
Package
Semiconductor
Technology
MRFIC2006(18b)
500-1000
1.8-4.0
46
23
15
15.5
S0-8
Silicon
Device
Freq.
Range
MHz
Supply Volt.
Range
Vdc
Supply
Current
mA(Typ)
Standby
Current
mA(Typ)
Small Signal
Gain
dB (Typ)
Pout, 1 dB
Compression
dBm(Typ)
Package
Semiconductor
Technology
MRFIC21 01 (18b)
800-1000
3-4.75
38
2
16
18
SO-16
Silicon
Supply Volt.
Vdc
Power
Added
Efficiency
% (Min)
Power
Gain
dB (Min)
Harmonic
Output 2fo
dBc
Pout!Pin
dBm(Min)
Package
Semiconductor
Technology
Analog Cellular
Device
Freq.
Range
MHz
MRFIC0910(18e,46a)
824-905
4.8
50
17.8
-40
30.8/13
PFP-16
LOMaS
MRFIC0911 (18e,46a)
824-905
6.8
50
18.5
-35
31.5/13
PFP-16
LOMaS
MRFIC0912(18e,46a)
824-905
4.6(47)
55
21.8
-20
30.8/9
PFP-16
GaAs
(18)Tape and Reel Packaging Available by adding suffix: a) R1 = 500 units; b) R2 =2.500 units; c) T1 = 3,000 units; d) T3= 10,000 units; e) R2 = 1 ,500 units.
(46)To be introduced: a)1st half of 1996; b) 2nd half of 1996.
(47) Negative supply required
New Product
*
Motorola Master Selection Guide
5.10-23
RF Products
Transmitter Functions: 900 MHz Transmit Chain: Integrated Power Amplifiers
(continued)
GSM Cellular
Supply Volt.
Vdc
Power
Added
Efficiency
% (Min)
Power
Gain
dB (Min)
Harmonic
Output 2fo
dBc
Pout/Pin
dBm(Min)
Package
Semiconductor
Technology
Device
Freq.
Range
MHz
MRFIC0913(18e,46a)
880-915
4.8(47)
50
24.5
-30
34.5/10
PFP-16
GaAs
MRFIC0917(18e,46a)
880-915
3.6(47)
50
24.5
-30
34.5/10
PFP-16
GaAs
Device
Freq.
Range
MHz
Supply Volt.
Vdc
Power
Added
Efficiency
% (Min)
Power
Gain
dB (Min)
Harmonic
Output 2fo
dBc
Pout/Pin
dBm(Min)
Package
Semiconductor
Technology
MRFIC1816(18e,46a)
1.5-1.9
5.8(47)
50
16.5
-30
31.5/15
PFP-16
GaAs
MRFIC1818(18e,46a)
1.7-1.9
4.8(47)
35
30
-30
33/3
PFP-16
GaAs
DCS1800, PCS1900
Two-way Paging, ISM
Device
Freq.
Range
MHz
MRFIC0914(18b)*
890-950
Supply Volt.
Vdc
Power
Added
Efficiency
% (Min)
Power
Gain
dB (Min)
Harmonic
Output 2fo
dBc
Pout/Pin
dBm(Typ)
Package
Semiconductor
Technology
4.8
40
28
-45
30.5/2.5
S0-16
LOMOS
1.5 - 2.2 GHz Transmit Chain
UpMixer, Exciter and LO Amp
RFOulput
Freq.
Range
GHz
Supply
Volt.
Range
Vdc
Supply
Current
TXMode
mA(Typ)
Standby
Current
MRFIC1803(18b)
1.7-2.5
2.7-3.3
28
100
10
70-350
-2
S0-16
OECT,PHS,
PCS
MRFIC1813(18b,46a)
1.7-2.5
2.7-4.5
24
25
15
70-350
2
TSSOP-16
OECT,PHS,
PCS
Device
Conv.
Recommended Pout, 1 dB
IF Input
Compo
Gain
MHz (Typ)
dBm(Typ)
~A(Typ) dB (Typ)
Package
System
Applicability
PA Driver and RAMP
Device
MRFIC1806(18b)
RF Output
Freq.
Range
GHz
Ran~e
Vdc( 7)
Supply
Current
mA(Typ)
1.5-2.5
3.0-5.0
115
Supply
Volt.
Standby
Small
Current Signal Gain
mA(Typ)
dB (Typ)
0.25
23
Pout/Pin
dBm(Typ)
1 dB
Compo
dBm(Typ)
19.5/-3
+21
Pkg
System
Applicability
S0-1
6
OECT,PHS,
PCS
(18)Tape and Reel Packaging Available by adding suffix: a) R1 =500 units; b) R2=2,500 unns; c) T1 =3,000 units; d) T3=10,000 unns; e) R2= 1,500 unns.
(46lTo be introduced: a)1 st haH of 1996; b) 2nd haH of 1996.
(47) Negative supply required
* New Product
RF Products
5.10-24
Motorola Master Selection Guide
Transmitter Functions: 1.5 - 2.2 GHz Transmit Chain
(continued)
Power Amplifier and TXlTR Switch
RF Output
Freq.
Range
GHz
Supply
Volt.
Range
Vdc
PASupply
Current
TX Mode
rnA (Typ)
Standby
Current
rnA
(Typ)
Small
Signal
Gain
dB (Typ)
Insertion
Loss
RxMode
dB (Typ)
Pout, 1 dB
Compression
dBm (Typ)
Package
1.5-2.2
3.0-5.0
325
0.06
8
1
25
SO-16
RF Output
Freq.
Range
GHz
Supply
Volt.
Range
Vdc
Supply
Current
TX Mode
mA(Typ)
Pout, 1 dB
Compo
dBm(Typ)
Package
MRFICI803(18b)
1.7-2.5
2.7-3.3
28
100
10
70-350
-2
SO-16
DECT,PHS,
PCS
MRFICI813(18b,46a)
1.7-2.5
2.7-4.5
24
25
15
70-350
2
TSSOP-16
DECT,PHS,
PCS
Device
MRFICI807(18b)
System
Applicability
DECT, PHS,
PCS
UpMixer, Exciter and LO Amp
Device
Standby Conv.
Recommended
Current
Gain
IF Input
MHz (Typ)
!lA(Typ) dB (Typ)
System
Applicability
2.4 GHz Transmit Chain
Exciter Amplifier
Device
Freq.
Range
GHz
Supply Volt.
Range
Vdc
Supply
Current
rnA (Typ)
Small Signal
Gain
dB (Typ)
Noise
Figure
dB (Typ)
Pout, 1 dB
Compression
dBm (Typ)
Package
MRFIC2404(18b)
2.0-3.0
4.75-5.25
9
17
4.3
5
SO-8
Device
Freq.
Range
MHz
Supply Volt.
Range
Vdc
Supply
Current
rnA (Typ)
MRFIC2403(18b)
2200-2700
4.75-5.25
95
System
Applicability
WLAN,
MMDS, ISM
Power Amplifier
Small Signal Power Control
Pout, 1 dB
Range
Compression
Gain
dB (Typ)
dB (Typ)
dBm(Typ)
23
20
19
Package
SO-16
System
Applicability
WLAN,
MMDS, ISM
UpMixer, Exciter and LO Amp
RF Output
Freq.
Range
GHz
Supply
Volt.
Range
Vdc
Supply
Current
TXMode
mA(Typ)
MRFICI803(18b)
1.7-2.5
2.7-3.3
28
100
10
MRFICI813(18b,46a)
1.7-2.5
2.7-4.5
24
25
15
Device
Recommended
Standby Conv.
IF Input
Current
Gain
MHz (Typ)
!LA (Typ) dB (Typ)
Pout, 1 dB
Compo
dBm (Typ)
Package
70-350
-2
SO-16
DECT,PHS,
PCS
70-350
2
TSSOP-16
DECT,PHS,
PCS
System
Applicability
(1 B)Tape and Reel Packaging Available by adding suffix: a) Rl = 500 units; b) R2 =2,500 units; c) T1 = 3,000 units; d) T3 = 10,000 units; e) R2 = 1,500 units.
(46)To be introduced: a)lst half of 1996; b) 2nd half of 1996.
Motorola Master Selection Guide
5.10-25
RF Products
RF Amplifiers
Motorola's line of RF amplifiers designed and specified for use in land mobile radios, CATV distribution systems and general
purpose wideband amplification applications. They feature small size, matched inputs and outputs, high stability and guaranteed
performance specifications. For the user, they offer the benefits of smaller and less complex system designs in less time and at
lower overall cost.
Each amplifier uses modern transistor chips which are gold metallized and have silicon nitride passivation for increased reliability
and long life. Chip and wire construction features MOS capacitors and laser trimmed nichrome resistors. Circuit substrates and
metallization have been selected for optimum performance cost and reliablity.
,
CASE301AA
STYLE 1
CASE301E
STYLE 1
CASE301AB
STYLE 1
,
,
~
CASE301H
STYLE 2
CASE301J
STYLE 1
CASE301K
STYLE 3
,
,
CASE301F
STYLE 1
,
,
CASE301N
STYLE 1
CASE301R
STYLE 1
CASE30H
STYLE 1
CASE301V
STYLE 1
CASE301Y
STYLE 1
CASE 420
STYLE 1
CASE 420A
STYLE 1
CASE 420L
STYLE 1
CASE 420U
STYLE 1
CASE 429A
STYLE 1
RF Products
CASE 429C
STYLE 1
5.10-26
CASE 429E
STYLE 1
Motorola Master Selection Guide
CASE 431A
STYLE 1
CASE 439
STYLE 1
CASE 455
STYLE 1
CASE 445
STYLE 1
CASE 700
STYLE 2
CASE 714F
STYLE 1
CASE 714G
STYLE 1
CASE 825A
STYLE 2
Motorola Master Selection Guide
5.10-27
RF Products
RF Amplifiers
High Power
Complete amplifiers with 50 ohm in/out impedances are available for a variety of applications including land mobile radios, base
stations, TV transmitters and other uses requiring large-signal amplification, both linear and Class C. Frequencies covered range
from 68-1785 MHz with power levels extending to 180 watts.
Land Mobile/Portable
The advantages of small size, reproducibility and overall lower cost become more pronounced with increasing frequency of
operation. These amplifiers offer a wide range in power levels and gain, with guaranteed performance specifications for bandwidth,
stability and ruggedness.
Table 1. VHF/UHF, Class C
Pin
Input Power
Watts
Pout
Output Power
Watts
Device
Frequency
MHz
Vee
Gp
Power Gain, Min
dB
Supply Voltage
Volts
Package/Style
37
38.4
38.4
38.4
38.4
7.5
7.5
7.5
7.5
7.5
301K13
301K13
301K13
301K13
301K13
68-210 MHz, VHF Band - Class C (Silicon Bipolar Die)
MHW105
MHW607-1
MHW607-2
MHW607-3
MHW607-4
5
7
7
7
7
0.001
0.001
0.001
0.001
0.001
68-88
186-150
146-174
174-195
184-210
400'-512 MHz, UHF Band - Class C (Silicon Bipolar Die)
MHW704-1
MHW704-2
MHW707-1
MHW707-2
MHW707-3
MHW707-4
MHW720A 1(22)
MHW720A2(22)
3
3
7
7
7
7(23)
0.001
0.001
0.001
0.001
0.001
0.001
0.15
0.15
20
20
400-440
440-470
403 - 440
440-470
470-500
490-512
400 - 440
440 - 470
34.8
34.8
38.4
38.4
38.4
38.4(23)
21
21
6.0
6.0
7.5
7.5
7.5
7.5
12.5
12.5
301J/1
301J/1
301J/1
301J/1
301J/1
301J/1
700/2
700/2
806-960 MHz, UHF Band - Class C (Silicon Bipolar Die)
MHW851-1
MHW851-2
MHW851-3
MHW851-4
MHW803-1
MHW803-2
MHW803-3
MHW804-1
MHW806A2(22)
MHW806A4(22)
1.6
1.6
2
1.6
2
2
2
4
6
6
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.03
0.04
820-850
870-905
890-915
915-925
820-850
806-870
870-905
800-870
806-870
870-950
32
32
33
32
33
33
33
36
23
21.7
6
6
6
6
7.5
7.5
7.5
7.5
12.5
12.5
301N/1
301N/1
301N/1
301N/1
301E11
301E11
301E11
301F/1
301H/2
301H12
806 - 960 MHz, UHF Band - (LDMOS Die)
MHW2821-1*
MHW2821-2*
20
18
<0.250
<0.300
806-870
890-950
19
17.9
12.5
12.5
824-849
870-905
24.5
24.5
5.8
5.8
1710-1785
33.2
6.0
824 - 915 MHz, UHF Band - Class C (GaAs FET Die)
MHW9002-1 (22)
MHW9002-2(22)
1.4
1.4
0.005
0.005
1710 - 1785 MHz, UHF Band - (GaAs FET Die)
IMHW9014*
I
2.1
I
0.001
420/1
(22)Designed lor Wide Range Pout Level Control
(23)po @ I = 490 MHz. Po = 6.5 W @ 1= 512 MHz
* New Product
RF Products
5.10-28
Motorola Master Selection Guide
High Power: Land Mobile/Portable
(continued)
Table 2. UHF, Linear
I
Oevice
Pout
Output
Power
Watts
824-849 MHz, UHF Band MHW920*
MHW927B(22)
I
MHW953(22)
MHW954(22)
0.001
0.001
824-849
824-849
0.001
0.1
890-915
890-915
Vee
Supply Voltage
Volts
Package/Style
29
37.8
6
12.5
35.4
15.4
7.2
7.2
21.5
41.4
26.5
12.5
12.5
26
Class AB (LOMaS Silicon FET)
0.1
~--U-----TI
0.001
--
I
Class AB (Silicon Bipolar Die)
3.5
3.5
880-960 MHz (for GSM) MHW913
MHW914(22)
MHW916
Gp
Power Gain, Min
dB
Class AB (Silicon Bipolar Die)
0.8(24)
6(24)
880-960 MHz (for GSM) -
f
Frequency
MHz
Pin
Input Power
Watts
14
14
16
I
0.036
----
880-915
890-915
925-960
-
I
I
301AB/l
301R/l
301AB/l
TV Transmitters
Table 3. UHF Ultra Linear for TV Applications
_._._-
These amplifiers are characterized for ultra-linear applications in Band IV and Band V TV transmitters.
Device
MRFA2600(26)
MRFA2602(28)
RFA8090B
MRFA2604*
Frequency
MHz
470-860
470-860
470-860
470-860
Pref
Watts
20
40
95(11)
180(11)
Gp (Min)/Freq.
Power Gain
dB/MHz
3 Tone(8)
IMOl
dB
3 Tone(25)
IM02
dB
10.5/860
9/860
8/860
8/860
-50
-50
-53
-53
-
-
Vee
Volts
elass
Package/Style
26.5
25.5
28
28
A
A
AB
AB
429Ail
429C/l
429E/l
439/1
(8)Vision Carrier: - 8 dB; Sound Carrier: - 7 dB; Sideband Carrier: - 16 dB
(11)Output power at 1 dB compression in Class AB
(22)Designed for Wide Range Pout Level Control
(24)Average Power; Peak Power is twice average power
(25)Vision Carrier: - 8 dB; Sound Carrier: - 10 dB; Sideband Carrier: - 16 dB
(26)Formerly known as "RFA6031"
(28)Formerly known as "RFA6060"
* New Product
Motorola Master Selection Guide
5.10-29
RF Products
I
Low Power
The following categories describe a wide range of complete amplifier assemblies both hybrid and monolithic for use in CATV
distribution systems, instrumentation, communications and military equipment. A variety of power levels and frequencies of
operation is offered for many applications.
CATV Distribution
Motorola Hybrids are manufactured using the latest generation technology which has set new standards for CATV system
performance and reliability. These hybrids have been optimized to provide premium performance in all CATV systems up to 152
channels.
Table 1. 5-50 MHz Hybrids, VCC = 24 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nominal)
Channel
Loading
Capacity
Composite
Triple Beat
Cross
Modulation
dB
dB
Noise
Figure
@50
MHz
Output
Level
2nd
Order
Test<30)
Max
dBmV
dB
4CH
4CH
Max
Packagel
Style
135
135
135
135
+50
+50
+50
+50
-70
-70
-70
-70
-73
-72
-70
-66
-64
-63
-62
-57
5
5
4.5
4.5
714/1
714/1
714/1
714/1
IDC
dB
mA
dB
Device
Low Current Amplifiers
MHWl184L
MHW1224L
MHW1254L
MHW1304L
4
4
4
4
18
22
25
30
Table 2. 5-200 MHz Hybrids, VCC = 12 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nominal)
Device
24.8
29.8
22
22
Noise
Figure
@200
MHz
Triple
Beat
Test(48)
Test(49)
Test<50)
dB
dB
dB
dB
dB
22CH
26CH
Typ
Max
Package!
Style
-68(19)
-68(19)
-59(19)
-59(19)
-57(19)
-57(19)
-69
-71
-66
-67
-71
-71
5.0
5.0
431Nl
431Nl
dB
MHW1254Lc(46a)
MHW1304Lc{46a)
Composite
Triple Beat<51)
2nd Order
Channel
Loading
Capacity
dB (Typ)
Table 3. 5-200 MHz Hybrids, VCC = 24 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nominal)
Device
Channel
Loading
Capacity
dB
Composite
Triple Beat
Cross
Modulation
dB
dB
Output
Level
2nd
Order
Test(30)
dBmV
dB
22CH
+50
+50
+50
+50
-72
-72
-72
-72
-73
-70
-69
-68
I
26CH
22CH
-71(19)
-70(19)
-68.5(19)
-67.5(19)
-65
I
Noise
Figure
@175
MHz
26CH
dB
Max
Package!
Style
-65(19)
-64(19)
-62(19)
-61(19)
7
5.5
5.5
5
714/1
714/1
714/1
714/1
High-Split Reverse Amplifiers
MHWl134
MHWl184
MHW1224
MHW1244
13
18
22
24
22
22
22
22
-64
-62
-61
(19}Typical
(30)Channels 2 and A @ 7
(46}To be introduced: a}lst half of 1996; b) 2nd half of 1996.
(48 lt2 MHz and 43.25 MHz @ 55.25 MHz, Vout = 50 dBmV/ch
(49}54 MHz and 121.25 MHz @ 175.25 MHz, Vout = 50 dBmV/ch
(50}54 MHz and 145.25 MHz @ 199.25 MHz, VOU! = 50 dBmV/ch
(51}44 dBmV/ch
RF Products
5.10-30
Motorola Master Selection Guide
Low Power: CATV Distribution
Table 4. 40-450 MHz Hybrids, VCC
Hybrid
Gain
(Nominal)
=24 Vdc, Class A -Maximum Distortion Specifications
Channel
Loading
Capacity
dB
Device
(continued)
Composite
Triple Beat
Cross
Modulation
Noise
Figure
@450MHz
Output
Level
2nd Order
Test
dB
dB
dB
dBmV
dB
60CH
60CH
Max
PackagE'!
Style
+46
+46
+46
+46
+46
+46
+46
-74(31)
-74(31)
_72(31)
_72(31)
-68(31)
-68(31)
-64(31)
-61
-60
-61
-60
-59
-59
-59
-62
-62
-59
-59
-60
-59
-59
7
7
6.5
5.5
6.0
6.0
5.0
714/1
714/1
714/1
714/1
714/1
714/1
714/1
7.0
6.0
714/1
714/1
Conventional Hybrids
MHW5142A
MHW5172A
MHW5182A
MHW5222A
MHW5272A
MHW5342A
MHW5382A
14
17
18
22
27
34
38
60
60
60
60
60
60
60
__
--'---.
Power Doubling Hybrids
.-
MHW5185B
MHW5225
Feedforward Hybrids
1MFF124B
1
60
24
-84(31)
+46
-79
-_7_5____L -_ _ _
10
____~.
[
825N2~
Table 5. 40-550 MHz Hybrids, VCC = 24 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nom.)
Device
Channel
Loading
Capacity
Output
Level
2nd
Order
Test
Composite
Triple Beat
Cross
Modulation
Noise
Figure
@550MHz
dB
dB
dB
Max
Package!
Style
-
7.5
7
7
6
6.5
6.5
714/1
714/1
714/1
714/1
714/1
714/1
-
7.5
7.5
7.0
714/1
714/1
714/1
dBmV
dB
77CH
I 87CH
77CH
77
77
77
77
77
77
+44
+44
+44
+44
+44
+44
_72(35)
_72(35)
_72(35)
-66(35)
-64(35)
-64(35)
-59
-59
-58
-57
-57
-57
-
-62
-62
-62
-57
-57
-57
-
77
77
77
+44
+44
+44
-65(36)
-60(36)
-55(36)
-65
-64
-62
-
-68
-67
-60
dB
L87CH
Conventional Hybrids
MHW6142
MHW6172
MHW6182
MHW6222
MHW6272
MHW6342
14
17
18
22
27
34
-
--
Power Doubling Hybrids
MHW6185B
MHW6205
MHW6225
18
20
22
-
Feedforward Hybrids
L..IM_F..,..F_2_24_B_ _--'-I__
24_--'-__
77_--'-_+_4_4---''---_8_6(_35_)--'-_-_.7Q--=-_L~ _ _---.JL--__~._I.~~5N2
(31 )Channels 2 and M13 @ M22
(32)Composile 2nd order; Vout = +46 dBmV/ch
(35)Channels 2 and M30 @ M39
(36)Composite 2nd order; Vout
=+44 dBmV/ch
Motorola Master Selection Guide
5.10-31
RF Products
1
Low Power: CATV Distribution
Table 6. 40-600 MHz Hybrids, VCC
(continued)
=24 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nom.)
Device
Output
Level
Channel
Loading
Capacity
dB
2nd
Order
Test
dBmV
dB
+44
+44
+44
+44
-56(36)
-56(36)
-63(36)
-63(36)
Composite
Triple Beat
Cross
Modulation
Noise
Figure
@600MHz
dB
dB
dB
I 87CH
85CH
'-,::--"
Max
Package!
Style
-55
-56
-55
-55
6
6
6.5
6.5
714/1
714/1
714/1
714/1
-66
-65
7
6.5
714/1
714/1
12.5
825A12
I 87CH
85CH
Conventional Hybrids
'---'-
MHW6182-6
MHW6222-6
MHW6272-6(46a)
MHW6292-6(46a)
18
22
27
29
87
87
87
87
ii--" I
87
87
Feedforward Hybrids
~F3~~""=-.____ 1
Table 7.
40-7~0
24
85
I.
..1
+44
+44
---
-64(36)
-63(36)
--
--
--
--
--
-64
-63
J_~=C==L
-86(38) L-73
+44 ]
--
-57
-56
-57
-57
1-----1 -- I
Power Doublmg Hybrids
MHW6185-mJ
MHW6205-6A *
20
--
--
:...-
-"--------Maximum Distortion Specifications
Noise
Figure
@750MHz
""
Hybrid
Gain
(Nom.)
Device
I
MHz Hybrids, VCC = 24 Vdc, Class A
Channel
Loadin g
Capacity
dB
Output
Level
2nd
Order
Test
MHW7182
18
MHW7222
22
24
MHW7242*
MHW7142 _ _-,-__
14_-"_ _
27
MHW7272*
MHW7292*
29
~ ...---.-""--
1_1!__
Cross
Modulation
dB
dB
_"_.~~"_""_,-~10 ~J2~~~_,-~10 CH
dBmV
Conventional Hybrids
Composite
Triple Beat
L
40
40
0
40
40
0
-60(39)
-62(39)
-55(39)
-60(39)
-60(39)
-60(39)
-----
-62
-62
-60
-60
-60
-60
----
--
-.-
dB
Max
1128 CH
-66
-64
-60
-60
-60
-60
Package!
Style
-
------
RO
6.5
7
7
6.5
6.5
--
714/1
71411
714/1
714/1
714/1
714/1
~-.,
Maximum Distortion Specifications
Hybrid
Gain
(Nom.)
Dev ice
Channel
Loading
Capacity
dB
Cross
Modulation
Noise
Figure
@750MHz
Output
Level
2nd
Order
Test
Composite
Triple Beat
dB
dB
dB
dBmV
dB
110 CH
110CH
Max
Package!
Style
Power Doublers
.----,-------r--------r------~----~_r--------,_--------~--------~--------__,
MHW7185A*
MHW7205A*
~~~~_ _- L_ _ _ _---L------~--
Feed Forward Hybrids
1MFF424B*
I
24
110
+44
__- - L - - -
-70(36)
-65(36)
13
825A12
(36)Composite 2nd order; Vout = + 44 dBmV/ch
(38)Channels 2 and M39 @ M48
(39)Composite 2nd order; Vout = +40 dBmV/ch
(46)To be introduced: a)151 half of 1996; b) 2nd half of 1996.
* New Product
RF Products
5.10-32
Motorola Master Selection Guide
Low Power: CATV Distribution
Table 8. 40-860 MHz Hybrids, VCC
(continued)
=24 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nom.)
Device
Channel
Loading
Capacity
dB
Output
Level
2nd
Order
Test
dBmV
dB
12B
+3B
128
128
128
+38
+38
+38
+38
12B
+3B
-60(40)
_60(40)
-60(40)
-60(40)
-60(40)
-56(40)
Composite
Triple Beat
Cross
Modulation
Noise
Figure
@860MHz
dB
dB
dB
110 CH 1128 CH
110 CH 1128 CH
Max
Package!
Style
Conventional Hybrids
MHWB142
MHWB1B2
MHW8222
MHWB242*
MHW8272*
MHWB292*
14
18
22
24
27
29
12B
-
-61
-60
-60
-60
-60
-60
-
-
-
-66
-60
-60
-60
-60
-60
-
B.O
7
7.5
7.5
7.0
7.0
714/1
714/1
714/1
714/1
714/1
714/1
Power Doubling Hybrids
MHW8185(46b)
MHW8205(46b)
B.5
B.5
20
Feedforward Hybrids
IMFF524B(46a) I
24
128
+40
-70(39)
-70
12.0
825A12
Table 9. 40-860 MHz Hybrids
Gain
dB
Typ
Device
Frequency
Vce
MHz
Volts
2nd Order
IMD
@Vout=
50dBmV/ch
Max
DIN45004B
1=860 MHz
@
dB~V
Min
Noise Figure
@860MHz
dB
Max
Package/
Style
Conventional Hybrids
CA901
CA901A
-60
-64
120
120
CA922
CA922A
-63
-67
123
123
Hybrid Jumper
ICATHRU
I
o
1-1000
Table 10. 40/1000 MHz Hybrids, VCC
75 Ohm Broadband Hybrid Jumper
=24 Vdc, Class A
Maximum Distortion Specifications
Hybrid
Gain
(Nom.)
Device
Channel
Loading
Capacity
dB
714V
Cross
Modulation
Noise
Figure
@860MHz
Output
Level
2nd
Order
Test
Composite
Triple Beat
dB
dB
dB
dBmV
dB
152CH
152CH
Max
-59
-59
-58
-63
-59
-59
Package!
Style
(39)Composite 2nd order; Vout = +40 dBmVlch
(40)Composite 2nd Order; Vout = +38 dBmVlch
(46)To be introduced: a)lst half of 1996; b) 2nd half of 1996.
*New Product
Motorola Master Selection Guide
5.1D-33
RF Products
Low Power: CATV Distribution (continued)
Table 11. General Purpose Wideband Amplifiers
Device
Frequency
Range
Gain
Min!TYp
Supply Voltage
Output Level
1 dB Compression
Noise Figure
@250MHz
MHz
dB
Vdc
MW/@MHz
dB
1-250
1-250
10-400
10-400
34.5/36.5
33.5/35
33134.5
31.5/34
13.6
24
13.6
24
700/100
900/100
600/200
800/200
5
5
5
5
Package!
Style
50-100 n Hybrids
MHW591
MHW592
MHW593
MHW590
714/1
714/1
714/1
714/1
Table 12. Standard Linear Hybrids
This series of RF linear hybrid amplifiers have been optimized for wideband, 50 ohm applications. These amplifiers were
designed for multi-purpose RF applications where linearity, dynamic range and wide bandwidth are of primary concern. Each
amplifier is available in various package options. The MHL series utilizes a new case style that provides microstrip input and
output connections.
Device
CA4812C(41)
CA5815C(41)
CA4815C(41)
MHL8015*
MHL8115*
MHL9125*
CA2830C
CA2833C
CA2842C
CA2810C
CA2818C
CA4800C(41)
CA2832C
CA5800C(41)
CA5801(41)
MHL8018*
MHL8118*
MHL9128*
VCC
(Nom.)
Volts
BW
MHz
Gain
Flatness
Typ
±dB
12
15
15
15
15
15
24
24
24
24
24
24
28
28
28
28
28
28
10-1000
10-1000
10-1000
10-1000
10-1000
800-960
5-200
5-200
10-400
10-450
10-400
10-1000
1-200
10-1000
50-1000
10-1000
10-1000
800-960
1
1
1
1
1
0.5
0.5
0.5
0.5
1.5
0.5
1
0.5
1
1
1
1
0.5
GainlFreq.
Typ
dBlMHz
P1dB
Typ
dBm
NF/Freq.
Typ
dB/MHz
3rd Order
Intercept
PointlFreq.
Typ
dBrnlMHz
17.5/1000
15.5/1000
17.5/1000
18.5/900
17.5/900
20/900
34.5/100
34.5/100
221100
34/50
18.5/50
17.5/1000
35.5/100
15.5/1000
17.5/1000
18.5/900
17.5/900
20/900
26
30
26
26
30
31
29
29
32
30
30
26
33
30
30
26
30
31
7.5/1000
8.5/1000
7.5/1000
7.5/1000
8.5/1000
7.5/960
4.7/200
4.7/200
4/100
5/300
5/200
7.5/1000
5/200
8.5/1000
8.5/1000
7.5/1000
8.5/1000
7.5/960
3811000
40.5/1000
3811000
38/1000
41.5/1000
43/879
46/200
46/200
44/300
43/300
45/200
3811000
47/200
40.5/1000
41.5/1000
38/1000
38/1000
431879
VSWR
Max
son
Vsfls
Typ
V/mA
Case!
Style
2.6
2.6
2.6
2.6
2.6
1.5
2
2
1.5
2
2
2.6
2
2.6
2.6
2.6
2.6
1.5
121380
15nOO
151380
151380
15nOO
15nOO
24/300
24/300
24/230
24/310
24/205
24/220
281435
28/400
281400
28/400
28/200
28/400
714P/3
714P/3
714P/3
448/2
448/2
448/2
714F/l
714G11
714F/l
714F/l
714F/l
714P/2
714F/l
714P/2
714P/2
44811
448/1
44811
(41)Available in thin flange package (714T) by adding suffix "SO after part number, i.e. CA4800CS.
* New Product
RF Products
5.10-34
Motorola Master Selection Guide
CRT Drivers
Table 1. Video Amplifiers
These complete hybrid amplifiers are specifically designed for CRT driver applications requiring high frequency response and
high voltage, such as high resolution color graphics video monitors. Gold metallized die and substrates are used to ensure
high reliability and improved ruggedness.
Device
Vcd nom}
Gain(42)
(Typ)
(Typ) 43)
trlt{.
3dBBW
(Typ)(43)
Volts
VN
nsec
MHz
CR2428
MHW252S(45) *
MHW272S(45)*
MHW362S(45)*
CR342S
MHW352S(45)*
MHW372S(45)*
12
12
12
12
12
12
12
60
60
60
70
SO
SO
SO
2.0
2.S
3.0
2.7
2.2
2.7
2.5
Video
Clock Freq.
MHz
Vout(Max)
290
200
200
240
260
240
240
50P-P
50P-P
50P-P
60P-P
70 P-P
70P-P
70P-P
145
100
100
120
130
120
120
Volts
Load
6
6
6
6
6
6
6
Package/Style
to20pF
to20pF
to20pF
to20pF
to 20 pF
to20pF
to20pF
431A11
445/1
455/1
455/1
431A11
445/1
455/1
Fiber Optic Receivers
Table 1. 40-860 MHz Hybrids
Maximum Distortion Specifications
Hybrid
Responsivity
Min
Flatness
dB
dB
dB
±0.5
-70
Device
IMD2(52)
Fiber Optic Receiver Hybrids
IMHLWSOOO(46b)
I
23.5
I
IMD3(52)
Equivalent Input
Noise
dB
pA/JHz
Max
Package/
Style
--80
7.5
714U/1
(42)lnsertion Gain; 50 n Source
(43)Capacitive Load 8.5 pF, Vout
= 40 V p.p
(45)Triple Video Amplifiers
(46)To be introduced: a)1 st half of 1996; b) 2nd half of 1996.
(52)Two laser test with 0.5 mW optical power at 40% modulation index per lase; fl = 373.25 MHz f2 = 415.25 MHz
* New Product
Motorola Master Selection Guide
5.10--35
RF Products
RF Products
5.10-36
Motorola Master Selection Guide
Surface Mount
Information
In Brief . ..
Page
Surface Mount Technology is now being utilized to offer
answers to many problems that have been created in the
use of insertion technology,
Limitations have been reached with insertion packages
and PC board technology, Surface Mount Technology offers
the opportunity to continue to advance the state-of-the-art
designs that cannot be accomplished with Insertion
Technology,
Surface Mount Packages allow more optimum device
performance with the smaller Surface Mount configuration,
Internal lead lengths, parasitic capacitance and inductance
that placed limitations on chip performance have been
reduced,
The lower profile of Surface Mount Packages allows
more boards to be utilized in a given amount of space, They
are stacked closer together and utilize less total volume than
insertion populated PC boards,
Printed circuit costs are lowered with the reduction of the
number of board layers required, The elimination or
reduction of the number of plated through holes in the board
contribute significantly to lower PC board prices,
Surface Mount assembly does not require the preparation
of components that is common on insertion technology lines,
Surface Mount components are sent directly to the assembly
line, eliminating an intermediate step,
Automatic placement equipment is available that can
place Surface Mount components at the rate of a few
thousand per hour to hundreds of thousands of components
per hour,
Surface Mount Technology is cost effective, allowing the
manufacturer the opportunity to produce smaller units and
offer increased functions with the same size product.
Motorola Master Selection Guide
Information for Using Surface Mount Packages"" 5,11-2
Footprints for Soldering , " " " , " ' , " , , " , , " , ' 5,11-5
5,11-1
Surface Mount Information
INFORMATION FOR USING SURFACE MOUNT PACKAGES
RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint forthe semiconductor packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
The power dissipation for a surface mount device is a
function of the drain/collector pad size. These can vary from
the minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a surface
mount device is determined by TJ(max), the maximum rated
junction temperature of the die, RaJA, the thermal resistance
from the device junction to ambient, and the operating
temperature, TA. USing the values provided on the data sheet,
Po can be calculated as follows:
Po=
TJ(max)-TA
RaJA
160
z
o
Z
~
140
~~
Zt.)
~L
~~
w_
120
-t\
««
-
TA = 25°C
I
o.swaT
+watr
[\ V
:20
ffi I- 100
F=
r-- -l-l
'Mounted on the DPAK footprint
'"
SO
0.0
0.2
I
1
-
r--
0.4
0.6
A, AREA (SQUARE INCHES)
O.S
-
~
1.0
Figure 1. Thermal Resistance versus Drain Pad
Area for the SOT-223 Package (Typical)
Z
o
100
1\
B
z
~
w-_ SO
~~
~L
[\
~V
wI-
fiJrg60
L
\v
40
~
~
'"
Board Material = 0.0625"
G-1 O/FR-4, 2 oz copr - !--TA=25°C
\
....J:2
««
~~
~
___ 1.75Watts
_1
",!Xl
200
3.0Watls
V
5.0 Watts
r--. ~
2
4
6
A, AREA (SQUARE INCHES)
10
Figure 2. Thermal Resistance versus Drain Pad
Area for the DPAK Package (Typical)
z
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad™. USing a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
I
1.5Watls
....J:2
-<:
The 156°CIW for the SOT-223 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 800 milliwatts. There
are other alternatives to achieving higher power dissipation
from the surface mount packages. One is to increase the area
of the drain/collector pad. By increasing the area of the
drain/collector pad, the power dissipation can be increased.
Although the power dissipation can almost be doubled with
this method, area is taken up on the printed circuit board which
can defeat the purpose of using surface mount technology.
For example, a graph of RaJA versus drain pad area is shown
in Figures 1, 2 and 3.
Board Material = 0.0625"
G-l0/FR-4, 2 oz Copper
",!Xl
al
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device. For example, for
a SOT-223 device, Po is calculated as follows.
I
\
B
o
B
z
~
70
IBoard Mktenal :b.0625"
G-1 O/FR-4, 2 oz Copper
60
I
TA = 25°C
/2.5Watls
I
/
I
/,3.5Watts
J
~
\.
, / 5Watls
"'
V
2
I
1
6
S
10
A, AREA (SQUARE INCHES)
12
14
16
Figure 3. Thermal Resistance versus Drain Pad
Area for the D2PAK Package (Typical)
Surface Mount Information
5.11-2
Motorola Master Selection Guide
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. Solder
stencils are used to screen the optimum amount. These stencils
are typically 0.008 inches thick and may be made of brass or
stainless steel. For packages such as the SC-59,
SC-70/S0T-323, SOD-123, SOT-23, SOT-143, SOT-223,
SO-S, S0-14, S0-16, 'Micro8, and SMAlSMBlSMC diode
packages, the stencil opening should be the same as the pad
size or a 1:1 registration. This is not the case with the DPAK,
D2PAK and D3PAK packages. If a 1:1 opening is used to screen
solder onto the drain pad, misalignment and/or '10mbstoning"
may occur due to an excess of solder. For these two packages,
the opening in the stencil for the paste should be approximately
50% of the tab area. The opening for the leads is still a 1:1
registration. Figure 4 shows a typical stencil for the DPAK, 02PAK
and D3PAK packages. The pattern of the opening in the stencil
for the drain pad is not critical as long as it allows approximately
50% of the pad to be covered with paste.
SOLDER PASTE
OPENINGS
D
STENCIL
Figure 4. Typical Stencil for OPAK,
02PAK and 03PAK Packages
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
Motorola Master Selection Guide
5.11-3
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling,
• Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
• Due to shadowing and the inability to set the wave height to
incorporate other surface mount components, the D2PAK is
not recommended for wave soldering.
Surface Mount Information
TYPICAL SOLDER HEATING PROFILE
line on the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this
profile. The type of solder used was 6213612 lin Lead Silver
with a melting point between 177-189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make up
a heating "profile" forthat particular circuit board. On machines
controlled by a computer, the computer remembers these
profiles from one operating session to the next. Figure 5 shows
a typical heating profile for use when soldering a surface
mount device to a printed circuit board. This profile will vary
among soldering systems, but it is a good starting point.
Factors that can affect the profile include the type of soldering
system in use, density and types of components on the board,
type of solder used, and the type of board or substrate material
being used. This profile shows temperature versus time. The
STEP 1
PREHEAT
ZONE 1
" AMP'
STEP 2 STEP 3
VENT
HEATING
"SOAK" ZONES 2 &5
"RAMP'
I
I
STEP 4
HEATING
ZONES 3 &6
"SOAK"
STEP 6
VENT
STEPS
HEATING
ZONES4& ?
'SPIKE"
STEP?
COOLING
DESIRED CURVE FOR HIGH
MASS ASSEMBLIEf
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO ? MINUTES TOTAL)
I
..
TMAX
Figure 5. Typical Solder Heating Profile
Surface Mount Information
5.11-4
Motorola Master Selection Guide
Footprints for Soldering
- m';
~:~ 1- m
" ;: ",': ~1m
0'039
1,0
L
0,094
2.4
~
l
~~~
0,8
035
0'0,9
0079
2,0
L
~~~
(in::s)
~
h
0,8
Cn::s)
6-PIN DIP
GULL-WING
,045 (± ,005)
TD
T~R
~~(m(
-I
(INCHES)
Standard "S" Option
SOT-23
r-- ~~;-,
I f--
0,079
---J I
1.52
lG 'G~I
0,075
1"E
r-
0,071
-I
0,041
""T05
0,108
2,75
J1+I I+l ~3 I
~
1
,8
L--.l~
I"~~I~I~I
1,2
0,8
0,85
rOODD~
IODDDj"
0,275
0,155
I
r-
(inmChmes)
0,050
1,270
50-8, OPTO 50-8,
50-14,50-16
SOT-143
Motorola Master Selection Guide
,300 (± ,005)
~
,040
(± ,005)
SC-59
D D~T
5,11-5
Surface Mount Information
0.089
_ _ _ 0.157 _ _
I_
~
t
I
--+--+-+--+--+--+-1-
"I
2.743
0.0787
L
~2.0
1
2.261
TO D
4.0
I" 0.085 "I
LOO~87 J
2.159
2.0
5MB
SMA
1--QJl1------i
I
4.343
I
.QJ1Q
I
2.54
0.190
I
-
"I
2.794
r- Q118
--1 0.100 1-3.0
4.191
IO
0
L
I"
r ~----J
0~:3 r
-
D~2
( inChes)
\--;;;;;;-
DPAK
r--~--j
8.38
1
r
0.42 - f - 10.66
- ---
r
D~ f
2 032
0.24
- - - - ~ 6096
L
1-3.05
063
17.02
(
I:
0.531
13.5
'::05)
5.11-6
0'864~
21.95
0.197
----I
I
50
I
0.653
L~ ~9JfU-
Surface Mount Information
D
TO.243
f---
SMC
1
1
I
I
I
~8
I---r
I l
I
O.
3.0
0.215
5.45
~~12 .7
Motorola Master Selection Guide
f
0.248
6.3
-.-0.079
2.0
-L
1
0.059
1.5
1
1
0.059 1
1.5
1 0.059 1
1.5
5C-70150T-323
50T-223
1
0.91
0.036
{d@}~rn{r~
1-
D D
--
-t
-,-,
1.22
I
•
~~9:
2.36
_I
0.165
I
.
I
T
Lilli {or
in~:S
424
=M-H=
I
-+I
500-123
Motoroa
I Master Select·ton Guide
I
II I I I
,,'i~,)
~8
r-
I
I
I+-
T
I
5.28
0.65 6X
(0.0256)
MICR08
5.11-7
Surface Mount Information
Surface Mount Information
5.t1-8
Motorola Master Selection Guide
Tape and Reel Specifications
and Packaging Specifications
Page
Tape and Reel Specifications ................... 5.12-2
Embossed Tape and Reel Ordering Information. 5.12-3
Embossed Tape and Reel Data for Discretes ... 5.12-4
Lead Tape Packaging Standards
for Axial-Lead Components ................. 5.12-6
Packaging Specifications ....................... 5.12-7
T0-92 EIA Radial Tape in Fan Fold Box
or on Reel ................................. 5.12-7
Fan Fold Box Styles ......................... 5.12-9
Adhesion Pull Tests ......................... 5.12-9
Reel Styles ............................... 5.12-10
Motorola Master Selection Guide
5.12-1
Tape and Reel Specifications
Tape and Reel Specifications
and Packaging Specifications
Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the
shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure
cavity for the product when sealed with the "peel-back" cover tape.
•
•
•
•
•
• S0-8, Micro8, OPTO SO-8, SOT-223, SMA, 5MB in
12 mmTape
• OPAK, PFP-16, SO-14, SO-16, SMC, TSSOP-16,
TSSOP-20, 430 and 430B in 16 mm Tape
• 02PAK, 03PAK, 6-Pin Optoisolators in 24 mm Tape
Two Reel Sizes Available (7" and 13")
Used for Automatic Pick and Place Feed Systems
Minimizes Product Handling
EIA481,-1,-2
S00-123, SC-59, SC-70/S0T-323, SOT-23, SOT-143
in 8 mm Tape
Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual
reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is
one full reel for each line item, and orders are required to be in increments of the single reel quantity.
SC-59, SC-70/S0T-323, SOT-23
SOO-123
Bmm
SOT-143
Bmm
SOT-223
12mm
OPAK
16mm
Bmm
MicroS, SO-S,
OPTOSo-S
SO-14,16
12mm
16mm
02PAK
03PAK
24mm
24mm
SMA/SMB
SMC
12mm
16mm
6-Pin Optoisolators
24mm
0000000000000000
UUUD
TSSOP-16
16mm
TSSOP-20
16mm
16mm
430, 430B
o
0 0 0 0 0 0 0 0 0
00000
Tape and Reel Specifications
o
0 0 0 0 0 0 0 0
DIRECTION
OF FEED
5.12-2
Motorola Master Selection Guide
EMBOSSED TAPE AND REEL ORDERING INFORMATION
Package
Tape Width
(mm)
Pitch
mm
(inch)
Reel Size
mm
(inch)
Devices Per Reel
and Minimum
Order Quantity
Device
Suffix
OPAK
16
8.0 ± 0.1 (.315 ± .004)
330
(13)
2,500
T4
02PAK
24
16.0 ± 0.1 (.630 ± .004)
330
(13)
800
T4
03PAK
24
24.0 ± 0.1 (.945 ± .004)
330
(13)
500
RL
SC-59
8
4.0±0.1 (.157±.004)
178
(7)
3,000
Tl
SC-70/S0T-323
8
8
4.0±0.1 (.157±.004)
178
330
(7)
(13)
3,000
10,000
Tl
T3
SMA
12
8.0 ± 0.1 (.315 ± .004)
330
(13)
5,000
T3
5MB
12
8.0± 0.1 (.315 ± .004)
330
(13)
2,500
T3
SMC
16
8.0±0.1 (.315±.004)
330
(13)
2,500
T3
S0-8, OPTO SO--8
12
12
8.0±0.1 (.315±.004)
178
330
(7)
(13)
500
2,500
Rl
R2
SO-14
16
16
8.0 ± 0.1 (.315 ± .004)
178
330
(7)
(13)
500
2,500
Rl
R2
SO-16
16
16
8.0 ±0.1 (.315 ± .004)
178
330
(7)
(13)
500
2,500
Rl
R2
SOO-123
8
8
4.0±0.1 (.157±.004)
178
330
(7)
(13)
3,000
10,000
Tl
T3
SOT-23
8
8
4.0±0.1 (.157± .004)
178
330
(7)
(13)
3,000
10,000
Tl
T3
SOT-143
8
8
4.0±0.1 (.157±.004)
178
330
(7)
(13)
3,000
10,000
Tl
T3
SOT-223
12
12
8.0±0.1 (.315±.004)
178
330
(7)
(13)
1,000
4,000
Tl
T3
6--Pin Optoisolators
24
12.0 ± 0.1 (.472 ± .004)
330
(13)
1000
R2
Micro8
12
8.0±0.1 (.315±.003)
330
(13)
4000
R2
PFP-16
16
12.0 ± 0.1 (.471 ± .004)
330
(13)
1,500
R2
TSSOP-16
16
8.0±0.1 (.315±.004)
330
(13)
2,500
R2
TSSOP-20
16
8.0 ± 0.1 (.315 ± .004)
330
(13)
2,500
R2
430, 430B
16
8.0 ± 0.1 (.315 ± .004)
178
(7)
500
Rl
Motorola Master Selection Guide
5.12-3
Tape and Reel Specifications
EMBOSSED TAPE AND REEL DATA FOR DISCRETES
CARRIER TAPE SPECIFICATIONS
10 Pitches Cumulative Tolerance on Tape
±0.2mm
D1
For Components
2.0 mm x 1.2 mm and Larger
For Machine Reference Only
Including Draft and RADII
Concentric Around BO
User Direction of Feed
• Top Cover Tape
Thickness (t1)
0.10mm
(.004") Max.
Bar Code Label
RMin
Tape and Components
Shall Pass Around Radius 'R"
Without Damage
Embossed Carrier
100mm~
r- (3.9371 1 mmMax
Typical Component
Cavity Center Une
Tape
1mm
(.039") Max
250 mm
1 + - - - - - - - - - - - - ' - - ' - - - - (9.843") - - - - - . j
Typical Component
~ Centerline
Camber (Top View)
Allowable Camber To Be 1 mml100 mm Nonaccumulative Over 250 mm
DIMENSIONS
Tape
Size
81 MBX
D
D1
E
F
K
Po
P2
RMln
TMax
WMax
Bmm
4.55mm
(.179")
1.0 Min
(.039")
1.75iO.l mm
(.069 ±.O04")
3.5tO.05mm
(.I3B±.OO2")
2.4mmMax
(.094")
4.0iO.l mm
(.157± .004")
2.0tO.l mm
(.079±.OO2")
25mm
(.98")
0.6mm
(.024")
B.3mm
(.327")
12mm
B.2mm
(.323")
1.5+0.1 mm
-0.0
(.059+.004"
-0.0)
5.5iO.05 mm
(.217± .002")
6.4 mm Max
(.252")
16mm
12.1mm
(.476")
7.5iO.l0 mm
(.295±.004")
7.9mmMax
(.311")
16.3mm
(.642")
24mm
20.1 mm
(.791")
11.5±0.1 mm
(.453i.004")
11.9mm Max
(.468")
24.3mm
(.957")
1.5 mm Min
(.060")
30mm
(1.1B")
12i.30mm
(.470±'o12")
Melnc dImenSIons govem - English are In parentheses for reference only.
NOTE 1: AO, BO, and KO are detenmined by component size. The clearance between the components and the cavity must be within .05 mm min. to .50 mm max.,
the component cannot rotate more than 10° within the detenmined cavity.
NOTE 2: If Bl exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tapefeeders.
NOTE 3: P~ch infonmation is contained in the Embossed Tape and Reel Ordering Information on pg. 5.12-3.
Tape and Reel Specifications
5.12-4
Motorola Master Selection Guide
EMBOSSED TAPE AND REEL DATA FOR DISCRETES
I--I
,~ll--l'5mmMin
/ -1 ~"
(.06")
~,~!. (=~
A
I~" I f \~~"=/J
--
13.0mm±0.5mm
(.512" ± .002")
-~
-t--
TMax
Outside Dimension
Measured at Edge
f
50 mm Min
(1.96p
Full Radius
Inside Dimension
Measured Near Hub
TMax
Size
A Max
8mm
330mm
(12.992")
8.4 mm + 1.5 mm, -0.0
(.33" + .059", -0.00)
14.4 mm
(.56")
12mm
330mm
(12.992")
12.4 mm + 2.0 mm, -0.0
(.49" + .079", -0.00)
18.4 mm
(.72")
16mm
360mm
(14.173")
16.4 mm + 2.0 mm, -0.0
(.646" + .078", -0.00)
22.4 mm
(.882")
24mm
360mm
(14.173")
24.4 mm + 2.0 mm, -0.0
(.961" + .070", -0.00)
30.4 mm
(1.197")
G
Reel Dimensions
Metric Dimensions Govern - English are in parentheses for reference only
Motorola Master Selection Guide
5.12-5
Tape and Reel Specifications
LEAD TAPE PACKAGING STANDARDS FOR AXIAL-LEAD COMPONENTS
Product
Category
Case Type
Device
Title
Suffix
MPQ
Quantity
Per Reel
(Item 3.3.7)
Component
Spacing
A Dimension
Tape
Spacing
BDimenslon
Reel
Dimension
C
Reel
Dimension
D{Max)
Max Off
Alignment
E
4000
0.2 +/- 0.015
2.062 +/- 0.059
3
14
0.047
Case 17-{)2
Surmetic 40 &
600WattTVS
RL
Case 41 A-{)2
1500WattTVS
RL4
1500
0.4+/-0.02
2.062 +/- 0.059
3
14
0.047
Case 51-{)2
DO-7Glass
(For Reference only)
RL
3000
0.2+/-0.02
2.062 +/- 0.059
3
14
0.047
Case 59-{)3
00-41 Glass &
00-41 Surmetic 30
RL
6000
0.2 +/- 0.015
2.062 +/- 0.059
3
14
0.047
Case 59-{)4
500 Watt TVS
RL
5000
0.2 +/-0.02
2.062 +/- 0.059
3
14
0.047
RL
800
0.4+/-0.02
1.875 +/- '0.059
3
14
0.047
Rectifier
Rectifier
Case 194-{)4
110 Amp TVS
(Automotive)
Rectifier
Case 267-{)2
Rectifier
RL
1500
0.4 +/-0.02
2.062 +/- 0.059
3
14
0.047
Case 299-{)2
00-35 Glass
RL
5000
0.2 +/-0.02
2.062 +/- 0.059
3
14
0.047
Table 1. Packaging Details (all dimensions in inches)
Kraft Paper
Item 3.1.1
Max Off
Alignment
E
Container
Item 3.3.5
Both Sides
Tape, WhHe
Item 3.2
(Anode)
I:J
==
+ ..... 1++0.250
02
Item 3.3.2
~O.O 31
Item 3.3.5
Figure 1. Reel Packing
Figure 2. Component Spacing
1.188
.--
3.50ia.
LItem 3.4
Figure 3. Reel Dimensions
Tape and Reel SpecHications
5.12-6
Motorola Master Selection Guide
TO-92 EIA, lEe, EIAJ
Radial Tape in Fan Fold
Box or On Reel
TO-92
RADIAL
TAPE IN
FAN FOLD
BOX OR
ON REEL
Radial tape in fan fold box or on reel of the reliable TO-92 package are
the best methods of capturing devices for automatic insertion in printed
circuit boards. These methods of taping are compatible with various
equipment for active and passive component insertion.
•
•
•
•
•
•
Available in Fan Fold Box
Available on 365 mm Reels
Accommodates All Standard Inserters
Allows Flexible Circuit Board Layout
2.5 mm Pin Spacing for Soldering
EIA-468, IEC 286-2, EIAJ RC1008B
Ordering Notes:
When ordering radial tape in fan fold box or on reel, specify the style per
Figures 3 through 8. Add the suffix "RLR" and "Style" to the device title, i.e.
MPS3904RLRA. This will be a standard MPS3904 radial taped and
supplied on a reel per Figure 9.
Minimum order quantity 1 Box/$200LL.
Fan Fold Box Information Order in increments of 2000.
Reel Information - Minimum order quantity 1 Reel/$200LL.
Order in increments of 2000.
US/European Suffix Conversions
Motorola Master Selection Guide
US
EUROPE
RLRA
RL
RLRE
RL1
RLRM
ZL1
5.12-7
Tape and Reel Specifications
TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
Figure 1. Device Positioning on Tape
Specification
Millimeter
Inches
Symbol
Item
Min
Max
Min
Max
D
Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
Component Lead Pitch
0.0945
0.110
2.4
2.8
.059
.156
1.5
4.0
0.3346
0.3741
8.5
9.5
1.0
Fl, F2
H
Bottom of Component to Seating Plane
HI
Feedhole Location
H2A
Deflection Left or Right
0
0.039
0
H2B
Deflection Front or Rear
0
0.051
0
1.0
0.7086
0.768
18
19.5
16.5
H4
Feedhole to Bottom of Component
H5
Feedhole to Seating Plane
0.610
0.649
15.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
Ll
Lead Wire Enclosure
0.09842
-
2.5
-
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
PI
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T
Adhesive Tape Thickness
0.06
0.08
0.15
0.20
Tl
Overall Taped Package Thickness
-
0.0567
-
T2
Carrier Strip Thickness
0.014
0.027
0.35
1.44
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
WI
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non-<:umulative variation between tape feed holes shall not exceed 1 mm in 20 pijches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
Tape and Reel Specifications
5.12-8
Motorola Master Selection Guide
TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
FAN FOLD BOX STYLES
ADHESIVE TAPE ON
TOPSIDE
Style Mfan fold box is equivalent to styles E and
Fof reel pack dependent on feed orientation from
box.
Figure 2. Style M
ADHESIVE TAPE ON
TOPSIDE
Style P fan fold box is equivalent to styles A and
B of reel pack dependent on feed orientation from
box.
Figure 3. Style P
Figure 4. Fan Fold Box Dimensions
ADHESION PULL TESTS
500 GRAM PULL FORCE
100 GRAM
PULL FORCE
16mm
HOLDING
FIXTURE
The component shall not pull free with a 300 gram
load applied to the leads for 3 ± 1 second.
Figure 5. Test #1
Motorola Master Selection Guide
-+=lI=====I-- ~
(r
'\. \
I HOLDING
\I FIXTURE
~
The component shall not pull free with a 70 gram
load applied to the leads for 3 ± 1 second.
Figure 6. Test #2
5.12-9
I
There shall be no deviation in the leads and
no component leads shall be pulled free of
the tape with a 500 gram load applied to the
component body for 3 ± 1 second.
Figure 7. Test #3
Tape and Reel Specifications
TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
REEL STYLES
ARBOR HOLE DIA.
30.Smm ± O.25mm
MARKING NOTE
•
RECESS DEPTH
9.SmmMIN ~
:.~ 1:1
ts
--1FT
365mm + 3, - Omm
~IT
~
HUB RECESS
76.2mm ± lmm
361mm±lmm
=r
Material used must not cause deterioration of components or degrade lead solderability
Figure 8. Reel Specifications
ADHESIVE TAPE ON REVERSE
Rounded side of transistor and adhesive tape visible.
Flat side of transistor and carrier strip visible
(adhesive tape on reverse side).
Figure 9. Style A
Figure 10. Style B
ADHESIVE TAPE ON REVERSE
Flat side of transistor and adhesive tape visible.
Rounded side of transistor and carrier strip visible
(adhesive tape on reverse side).
Figure 11. Style E
Tape and Reel Specifications
Figure 12. Style F
5.12-10
Motorola Master Selection Guide
Product Literature
and Technical Training
In Brief ...
With the pace of new semiconductor product
introductions, the task of providing an effective and
up-to-date perspective of available components is beyond
the means of any single document. Hence, a
comprehensive Motorola Literature System has been put in
place to keep semiconductor users totally informed of all
aspects of the Motorola product lines - from new product
introductions, to applications, to major changes in directions.
The Motorola technical literature library and associated
services consist of the following:
• An extensive library of Data Books, each containing a
complete selection of data sheets associated with a
particular product line.
• A series of User's Manuals and Design Manuals dealing
with the application of highly complex products.
• A wide range of Application Notes and Article Reprints
detailing the utilization of new and significant products.
• Instructor-led Training for: Digital Signal Processing
(DSP) Family; M68000 Family; Embedded Controllers
(EC); MC68360 QUIC; PowerPC; Microcontroller
(MCU); RISC Family; plus the MC68302, MC68332,
MC68340 and the MC68HC16.
These products and services are described on the
following pages. However, because of different conditions
and standards, some of these may not be available outside
the USA.
Motorola Master Selection Guide
Technical Data Services .........................
Motorola Semiconductor Master Selection Guide ...
Semiconductor Data Update Magazine .........
Mfax- Touch-Tone Fax .....................
Internet Server ..............................
Motorola Data and Application Literature. . . . . . . . . ..
Motorola Application Literature. . . . . . . . . . . . . . . ..
Technical Training ..............................
6.0-1
Page
6.1-1
6.1-1
6.1-1
6.1-1
6.1-1
6.1-2
6.1-6
6.1-7
Product Uterature and Technical Training
Product Literature and Technical Training
6.0-2
Motorola Master Selection Guide
Technical Data Services
Mfax -
Motorola Semiconductor
Master Selection Guide
For the identification and preliminary selection
components for circuit and system designs
of
For the design engineer, the Motorola Master Selection
Guide is perhaps the most important single document for the
identification and preliminary selection of components for
circuit and system designs. Within its pages is a complete
listing and description of Motorola semiconductor devices
currently in general use, and those recommended for new
designs. It serves two purposes:
1. It lists all standard products in the vast Motorola semicon. ductor inventory for rapid identification.
2. It divides this total product offering into a variety of major
product categories, with sufficient technical information to
permit an intelligent first-order evaluation as to the most
suitable devices for a specific application.
How to reach us:
MFAX: RMFAXO@email.sps.com
or (602) 244-6609
Semiconductor Data
Update Magazine
Innovative
new
developments
Semiconductor Products Sector
from
Touch-Tone Fax
Mfaxoffers access to over 30,000 Motorola documents for
faxing to customers worldwide. With menus and voice
instruction, customers can request the documents needed
using their own touch-tone telephones from any location 7
days a week and 24 hours a day.
A number of features are offered within the Mfax system,
including HOT DOCS (4-digit code identifiers for currently
referenced promotional or advertising material), product data
sheets, application notes, engiineering bulletins, article
reprints, selector guides, Literature Order Forms, and
Technical Training Information.
Motorola has a full time staff dedicated to supporting the
Internet service as well as the Mfax Touch-Tone Faxing
service.
Motorola SPS World Marketing
Internet Server
Motorola's
Motorola SPS's Electronic Data Delivery organization has
set up a World Wide Web Server to deliver Motorola SPS's
technical data to the global Internet community.
Technical data such as the complete Master Selection
Guide along with the OEM North American price book are
available on the Internet server with full search capabilities.
Other data on the server include abstracts of databooks,
application notes, selector guides, and textbooks. All have
easy text search capability. Ordering Literature from the
Literature Distribution Center is available on line.
Other features of Motorola SPS's Internet server include the
availability of a searchable press release database, technical
training information with on-line registration capabilities,
complete on-line access to the MFAX system for ordering
faxes, an on-line technical support form to send technical
questions and receive answers through email, information on
product groups, full search capabilities of device models, a
listing of the Domestic and International sales offices, and
links directly to other Motorola world wide web servers.
After accessing the Internet, to locate the Motorola SPS
World Marketing server, use the following URL:
This highly informative periodical is available to all semiconductor users on a free subscription basis. The magazine
provides information on new semiconductor products and
developments and provides a quick-scan insight into newproduct offerings. Concise, informative articles discuss significant new product capabilities as well as newly introduced
services. In short, it represents an overview of the latest and
most important events at Motorola that influence the efficient
implementation and most cost-effective use of semiconductor
devices.
To receive Update Magazine, in the USA, please contact the
Literature Distribution Center by calling 1-800-441-2447.
http://Design-NET.com
For more information on Motorola SPS's Internet server you
can request BR1307/D from MFAX or request a copy from
Literature Distribution Center by calling 1-800-441-2447.
Motorola Master Selection Guide
6.1-1
Product Lijerature and Technical Training
Motorola Data and Application Literature
Complete technical data for the world's most
comprehensive inventory of semiconductor components
To complement the industry's broadest line of
semiconductor products, Motorola offers a complete library of
Data books which detail the electrical characteristics of its
products. These documents are supplemented by User's
Manuals describing the capabilities of the products in circuit
and system design.
Motorola attempts to fill the need for applications
information concerning today's highly complex electronic
components. Each year dozens of authors from colleges and
universities, and from the industry, add their individual
contributions to the collective literature. From these, Motorola
has selected a number of texts which add substantially to the
comprehension and applications of some of the more complex
products. By buying these in large quantities and providing
them to customers at lower than retail cost, Motorola hopes to
foster a more comprehensive acquaintance with these
products at greatly reduced prices.
For complete summaries and prices, order BR10l/D from
the Literature Distribution Center.
Data Books and Handbooks
Selector Guides & Application
Literature (continued)
BR13301D, ECLinPS Lite Single Gate ECL Devices,
Translators and PLL Support Products
BR13331D, Timing Solutions
BR13341D, High Performance Frequency Control Products
DL110/0, RF Device Data
DL111/0, Bipolar. Power Transistor Data
DL11810, Optoelectronics Device Data
DL121ID, FAST and LS TTL Data
DL1221D, MECL Device Data
DL1261D, Small-Signal Transistors, FETs and Diodes
Device Data
DL12810, Linear and Interface Integrated Circuits
DL129ID, High Speed CMOS Data
DL131/D, CMOS Logic Data
DL135ID, TMOS Power MOSFET Transistor Data
DL1361D, Communications Device Data
DL137ID, Thyristor Device Data
DL1381O, FACT Data
DL14010, High Performance ECL Data - ECLin PS and
ECLinPS Lite
DL1501D, TVS/Zener Device Data
DL151/0, Rectifier Device Data
DL15510, Dynamic RAMs & Memory Modules Data
DL15610, Fast Static RAM - Component and Module Data
DL1581D, Multimedia Device Data
DL159/0, LonWorks Technology Device Data
DL2OO1D, Pressure Sensor Device Data
DL201/D, FPGA Data: Field Programmable Gate Arrays
BRll00/D, Microprocessor and Memory Technologies
Group: Reliability and Quality Report
BRlll21D, M68HC05 & M68HC08 Family Customer
Specified Integrated Circuit (CSIC) Microcontroller Unit
(MCU) Literature
BR11331D, HIPPO: High-Performance Internal Product
Portfolio Overview
BRl137/D, The Motorola Explorer's Guide to the World of
Embedded Control Solutions
BRl1381D, 68HC08 -Innovate, Migrate, Accelerate
BRl1431D, Fast Static RAM Cross Reference Guide
BR1202lD, Motorola Quality System Review Guidelines
BR1306/D, CATS - Customer Analysis Tracking System
BR1400/D, OACS (ASIC) - Open Architecture CAD System
BRl437/D, Multichip Module Solutions
CALCPSTGlD, Communications, Power and Signal
Technologies Group: New Product Calendar
CMRQSlD, CSIC Microcontrollers: Reliability and Quality
Monitor Report
CR100/D, Communications, Power and Signal
Technologies Group: Through-Hole to Surface Mount Cross
Reference
CR103/D, Transient Voltage Suppressors, General
Instruments Cross Reference
CR104/D, Generallnstrument-to-Motorola Optoelectronics
Cross Reference
DL408/D, 8-bit MCU Applications Manual
DL409/D, 16/32-bit Applications Manual
DL410/D, Power Applications Manual
DL411/D, Communications Applications Manual
DL4121D, Industrial Control Applications Manual
DL4131D, Radio, RF and Video Applications Manual
DL4141D, FET Applications Manual
DMRQSlD, Microcontroller Technologies Group, DSP
Division: Reliability and Quality Monitor Report
DSPNEWSUD, DSP News
HB205/D, MECL System Design Handbook
HB2141D, Rectifier Applications Handbook
HB215/D, RF Application Reports
MRQSlD, Advanced Microcontroller Division: Reliability and
Quality Monitor Report
Selector Guides & Application
Literature
AJ100ID, Discrete Proceedings - The Journal of CPSTG
Strategic Marketing
BR1281D, Semiconductor Data 'Update' Magazine
BR1351D, Applications Literature Catalog
BR5181D, Reliability & Quality Handbook
BR7241D, 880pen Sourcebook
BR729/D, Motorola 68K Source - Third Party Vendor
Catalog
BR9161D, Packaging Manual for ASIC Arrays
BR9231D, Communications, Power & Signal Technologies
Group - Reliability Audit Report
Product Literature and Technical Training
6.1-2
Motorola Master Selection Guide
Motorola Data and Application Literature:
(continued)
Selector Guides & Application
Literature (continued)
User's Manuals (continued)
DSP56KFAMUM/AD, DSP56000 Digital Signal Processor
Family Manual
DSP56000UMlAD, DSP56000/DSP56001 Digital Signal
Processor User's Manual
DSP56002UMlAD, DSP56002 Digital Signal Processor
User's Manual
DSP56003UMlAD, DSP56003/005 Digital Signal Processor
User's Manual
DSP56004UMlAD, DSP56004 Digital Signal Processor
User's Manual
DSP56100FM/AD, DSP56100 Digital Signal Processor
Family Manual
DSP56156UMlAD, DSP56156 Digital Signal Processor
User's Manual
DSP56166UMlAD, DSP56166 Digital Signal Processor
User's Manual
DSP56300FM/AD, DSP56300 24-Bit Digital Signal
Processor Family Manual
DSP56301 UMlAD, DSP56301 24-Bit Digital Signal
Processor User's Manual
DSP96002UMlAD, DSP960021EEE Floating-Point
Dual-Port Processor User's Manual
GPTRM/AD, Modular Microcontroller Family General
Purpose Timer Reference Manual
H4CDM/D, H4C Series Design Reference Guide
H4CPDMID, H4CPlus Series Design Reference Guide
HC711D3PGMRlAD1, M68HC711D3PGMR Programmer
Board User's Manual
HDCDMID, HDC Series Design Reference Guide
LONUGlAD, LonBuilder User's Guide
LP2IO, Portable Power: The Competitive Edge of the
68HC11 - Low Power Design Guidebook
M5CDMlD, M5C Series Design Reference Guide
M68CPU32BUGlD, CPU32BUG Debug Monitor User's
Manual
M68HC05AGlAD, M68HC05 Applications Guide
M68HC08RGlAD, HC08 Family Reference Guide
M68HC11EVB/D1, M68HC11EVB Evaluation Board User's
Manual
M68HC11 EVBUlAD2, M68HC11 EVBU Universal
Evaluation Board User's Manual
M68HC11 EVM/AD8, M68HC11EVM Evaluation Module
User's Manual
M68HC11RMlAD, M68HC11 Reference Manual
M68PCBUG11ID2, M68HC11 PCbug11 User's Manual
M68PRMID, M6800 Programming Reference Manual
M6809PM/AD, MC6809-MC6809E Microprocessor
Programming Manual (1981)
M68000PMlAD, M68000 Family Programmer's Reference
Manual
M68000UM/AD, M68000 8-/16-/32-bit Microprocessors
User's Manual, Ninth Edition
M68020UM/AD, MC68020/MC68EC020 Microprocessors
User's Manual
SG461D, RF Products Selector Guide & Cross Reference
SG731D, Master Selection Guide
SG961D, Analog/Interface ICs Selector Guide & Cross
Reference
SG140/D, SCANSWITCH Selector Guide
SG146ID, Digital Signal Processors Update
SG1621O, Sensor Products Division
SG165/D, CSIC Microcontrollers Update
SG1661D, Advanced Microcontroller Division Update
SG167ID, High Performance Embedded Systems Fact
Sheet
SG169ID, Mixed Signal Solutions from MOS Digital-Analog
Integrated Circuits Division
SG171ID, Fast Static RAM Product Update
SG1721O, Dynamic Memory Update
SG1731D, CSIC Microcontrollers: Modular Development
Tools
SG1751D, RISC Microprocessor Division: The PowerPC
Microprocessor Family
SG2651D, Power MOSFETs Product Update
SG2661D, Bipolar Power Transistors Product Update
SG267ID, Rectifier Product Update
SG2681D, Thyristor Pr9duct Update
SG271/D, D2pAK Surface Mount Selector Guide
SG2731D, Optoelectronic Operations Selector Guide
SG2741D, Zener Operations Selector Guide
SG2751D, Small-Signal Operations: Surface Mount
Packages
SG365/D, Timing Soutions Selector Guide
SG367/D, High-Performance Gate Arrays
SG370/D, Discrete Surface Mount Selector Guide
SG3721D, Hard Disk Drive Products - Quick Reference,
November
SG375ID, Silicon Solutions for Motion Control
SG417ID, Semiconductor Products for Wireless
Communications
SG4221O, PowerPC Microprocessors Product Overview
SG423/D, TIGER: The Integrated Guide to European RAMs
SG4241D, EAGLES: European Analog Guide for Leading &
Emerging Systems
SG425ID, Lamp Ballast Selector Guide
SG426/D, DINO: Discrete Innovation News Overview
User's Manuals
ADCRMlAD, Analog-to-Digital Converter Reference
Manual
CPU08RMlAD, M68HC08 Central Processor Unit
Reference Manual
CPU16RMlAD, M68HC16 Family Reference Manual
CPU32RMlAD, CPU32 Central Processor Unit Reference
Manual
CTMRMID, Configurable Timer Module Reference Manual
DLE404ID, M6804 MCU Manual
Motorola Master Selection Guide
6.1-3
Product Literature and Technical Training
Motorola Data and Application Literature:
(continued)
User's Manuals (continued)
MC68340UMlAD, MC68340 Integrated Processor User's
Manual
MC68341UMlAD, MC68341 Integrated Processor User's
Manual
.
MC68349UMlAD, MC68349 High Performance Integrated
Processor User's Manual
MC68356UMlAD, MC68356 Signal Processing
Communications Engine User's Manual
MC68360UMlAD, MC68360 Quad Integrated
Communications Controller User's Manual
MC68488UM/AD, MC68488 General Purpose Interface
Adapter User's Manual
MC68605UM/AD, MC68605 X.25 Protocol Controller User's
Manual
MC68606UM/AD, MC68606 Multi-Link LAPD Protocol
Controller User's Manual
MC68824UM/AD, MC68824 Token Bus Products User's
Manual
MC68836UM/AD, MC68836 FOOl User's Manual
MC68837UMlAD, MC68837 FOOl User's Manual
MC68838UM/AD, MC68838 FOOl User's Manual
MC68839UMlAD, MC68839 FOOl System Interface User's
Manual
MC68840UMlAD, MC68840 Integrated Fiber Distributed
Data Interface User's Manual
MC68847UMlAD, MC68847 Quad ELM FOOl User's
Manual
MC68851UMlAD, MC68851 Paged Memory Management
Unit User's Manual, second edition
•
MC68881UMlAD, MC68881/MC68882 Floating-Point
Coprocessor User's Manual, second edition
MC88100UM/AD, MC88100 RISC Microprocessor User's
Manual
MC881101410DH/AD, MC8811O/MC88410 Designer's
Handbook
MC88110UM/AD, MC88110 Second Generation RISC
Microprocessor User's Manual
MC88200UMlAD, MC88200 Cache/Memory Management
Unit User's Manual
MC88410UMlAD, MC88410 Secondary Cache Controller
User's Manual
MC92005UMlD, MC92005 SBus Slave Interface Controller
User's Manual
MCCIRM/AD, Multichannel Communication Interface
Reference Manual
MCF5102UM/AD, MCF5102 ColdFire User's Manual
MCF5200PRMlAD, Cold Fire Programmer's Reference
Manual
MCUDEVTLDIRlD, Motorola Microcontroller Development
Tools Directory
MPCFPElAD, PowerPC Microprocessor Family: The
Programming Environments
MPCTOOLBKlAD, PowerPC Tools - Development Tools
for PowerPC Microprocessors
MPC105UMlAD, PowerPC PCI Bridge/Memory Controller
User's Manual
M68040UMlAD, MC68040, MC68040V, MC68LC040,
MC68EC040, MC68EC040V Microprocessors User's
Manual
M68060UMlAD, MC68060, MC68LC060, MC68EC060
Microprocessors User's Manual
M68332EVKEMlAD1, M68332EVK Evaluation Kit Exercise
Manual
MC68EC030UM/AD, MC68EC030 32-bit Embedded
Controller User's Manual
MC68F333UMlAD, MC68F333 User's Manual
MC68HC05CxRGlAD, MC68HC05Cx HCMOS Single-Chip
Microcontrollers Programming Reference Guide
MC68HC11A8RGlAD, MC68HC11A8 Programming
Reference Guide
MC68HC11CORGlAD, MC68HC11CO Programming
Reference Guide
MC68HC11 D3RGlAD, MC68HC11 D3/MC68HC711 03
Programming Reference Guide
MC68HC11ERGlAD, MC68HC11E Programming
Reference Guide
MC68HC11 F1 RGlAD, MC68HC11 F1 Programming
Reference Guide
MC68HC11 K4RGlAD, MC68HC11 K4IMC68HC711 K4
Programming Reference Guide
MC68HC11 KA4RGlAD, MC68HC11 KA4/MC68HC711 KA4
Programming Reference Guide
MC68HC11 L6RGlAD, MC68HCL6/MC68HC711 L6
Programming Reference Guide
MC68HC11MRGlAD, M68HC11 M Series Programming
Reference Guide
MC68HC11NRGlAD, MC68HC11 N Series Programming
Reference Guide
MC68HC16Y1UMlAD, MC68HC16Y1 User's Manual
MC68HC16Z1UM/AD, MC68HC16Z1 User's Manual
MC68HC16Z2UM/AD, MC68HC16Z2 User's Manual
MC68MH360RM/AD, MC68MH360 QUICC32 Quad
Integrated Multichannel Controller Reference Manual
MC68030UMlAD, MC68030 Enhanced 32-bit MPU User's
Manual, third edition
MC68040DH/AD, MC68040 Designer's Handbook
MC68302UMlAD, MC68302 Integrated Multiprotocol
Processor User's Manual
MC68306UMlAD, MC68306 Integrated ECOOO Processor
User's Manual
MC68307UM/AD, MC68307 Integrated Multiple-Bus
Processor User's Manual
MC68322UM/AD, Bandit: MC68322 Integrated Printer
Processor User's Manual
MC68328UMlAD, MC68328 (Dragonball) Integrated
Processor User's Manual
MC68330UMlAD, MC68330 Integrated CPU32 Processor
Users Manual
MC68331UMlAD, MC68331 User's Manual
MC68332UMlAD, MC68332 User's Manual
Product Literature and Technical Training
6.1-4
Motorola Master Selection Guide
Motorola Data and Application Literature:
User's Manuals
(continued)
Textbooks
(continued)
Textbooks
T8301/0, Basic Microprocessors and the 6800
T8304/0, Pascal Programming Structures for Motorola
Microprocessors
T8309/0, Programming the 6809
TB31210, Introduction to Integrated Circuit Layout
T831810, Microprocessor Systems Design: 68000
Hardware, Software and Interfacing
T8321/0, Practical Switching Power Supply Design
TB323/0, The 68000 Book
Motorola Master Selection Guide
(continued)
TB324/0, Real Time Digital Signal Processing Applications
with Motorola's DSP56000 Family
TB326/0, Radio Frequency Transistors: Principles and
Practical Applications
TB328/0, Programming Microcontrollers in C
TB329/0, Sensor Technology and Devices
TB330/0, PowerPC Computing
TB331/0, Power Supply Cookbook
TB33210, Digital Signal Processing Using the Motorola
DSP Family
TB333/0, Signal Processing, Image Processing and
Graphics Applications with Motorola's DSP96002
Processor. Volume I: Signal Processing
TB334/0, Signal Processing, Image Processing and
Graphics Applications with Motorola's DSP96002
Processor. Volume II: Image Processing and Graphics
Applications
TB335/0, The PowerPC Architecture: A Specification for a
New Family of RISC Processors
TB336/0, Automotive Electronics Handbook
TB337/0, PowerPC Programming for Intel Programmers
MPC601UM/AO, PowerPC 601 - RISC Microprocessor
User's Manual
MPC603eUM/AO, PowerPC 603e RISC Microprocessor
User's Manual
MPC604UM/AO, PowerPC 604 RISC Microprocessor
User's Manual
QSMRM/AO, Queued Serial Module Reference Manual
RCPURMlAO, MPC500 Family: RCPU Reference Manual
SCIMRM/AO, Single-Chip Integration Module Reference
Manual
SIMRM/AO, System Integration Module Reference Manual
SIURM/AO, MPC500 Family: System Integration Unit
Reference Manual
TIM08RM/AO, TIM08 Timer Interface Module Reference
Manual
TPURM/AO, M68300 Family Time Processor Unit
Reference Manual
Technical Data Services
BR1307/0, Motorola SPS World Marketing Internet Server
OK105/0, Scattering Parameter Library
OK106/0, Scattering Parameter Plotting Utility
OK107/0, Impedance Matching Program
SG73/0, Master Selection Guide
SEMIVIO/O, Basic Semiconductor Videos
Dr. BuB, DSP Electronic Bulletin Board Freeware Line,
Microcontroller Electronic Bulletin Board
6.1-5
Product Literature and Technical Training
Motorola Application Literature
Semiconductors in theory and practice
engineering bulletins and article reprints can also be ordered
from our Literature Distribution Center.
Contact the Literature Distribution Center for prices and
ordering information. In addition, there may be an alternative
document available in some countries, contact your local
Motorola Sales Office.
For complete summaries and prices: order BR135/D from
the Literature Distribution Center.
Application Notes, Engineering Bulletins and Article
Reprints are part of a total information system to define the
characteristics and applications of semiconductor devices.
Motorola's library consists of more than 300 such documents
dealing with the applications of all types of semiconductors
from discrete power transistors to the most complex
microprocessors. All are described in an Application Note
Catalog available from our Literature Distribution Center.
Individual application
notes,
application
reports,
DL408/D
DL409/D
DL411/D
8-bit MCU Applications Manual
16/32-bit Applications Manual
Communications Applications Manual
Product Literature and Technical Training
DL412/D
DL413/0
DL414/D
6.1-6
Industrial Control Applications Manual
Radio, RF and Video Applications Manual
FET Applications Manual
Motorola Master Selection Guide
Motorola Technical Training Courses
Registration & Tuition
How to register for open enrollment
courses
MOTOROLA COURSE PRICING
For North American class pricing contact the registrar at:
To enroll in a Motorola Technical Training course, please call
the registrar at (602) 302-8008 from 7:00 a.m to 4:00 p.m.,
MST, Monday through Friday. If you prefer, refer to page
7.1-10 for alternative ways to register.
- (602) 302-8008.
For international training please contact local regional office or
one of the following training departments:
For Ascent Technology offered courses call their registrar at
1-800-410-3601.
- Munich, Germany, (49)-89-92103571
- Velizy Villacoublay Cedex, France, (33)-1-34635894
- Aylesbury, United Kingdom, (44)-1296-380304
For Arnewsh Inc. offered courses call their business number
at (970) 223-1616.
Plan early as classes fill up rapidly and space is limited.
TRAINING PARTNER COURSE
PRICING
Closed courses
Please contact company directly for independent priCing
information:
- AscentTechnologies, 1-800-410-3601
- Arnewsh, Inc., (970) 223-1616
Courses listed can be taught at you r facility and can be tailored
to fit your needs.
Method of payment for Motorola courses
• Customers paying by check or purchase order, please
make payable to Motorola and mail to: ATTN: Technical
Training, 432 N. 44th Street, Suite 200, Phoenix, AZ
85008.
• For your convenience Motorola Technical Training now
accepts credit card payments; VISA, MasterCard or
American Express.
• Motorola employee's department number will be internally
charged.
Confirmation
A written notice confirming your enrollment will be sent to you
prior to the class. If you have not received confirmation one
week prior to the class, call our registrar at (602) 302-8008 for
Motorola courses. Call Arnewsh or Ascent Technologies
directly for independent confirmations.
To ensure a reserved space, payment is required two weeks
prior to class start date. No refund will be given once class
begins; however, the tuition may be applied to a future class.
Note: Please contact Ascent Technology or Arnewsh, Inc.
directly for their independent payment policy.
Motorola Master Selection Guide
6.1-7
Product Literature and Technical Training
Motorola Technical Training Courses (continued)
PowerPCTM 6xx Microprocessor
MC68HC16 Microcontroller
Description: The MPC6xx is primarily targeted for the
desktop marketplace. The PowerPC MPC6xx course details
all publicly announced MPC6xx implementations such as the
MPC601, MPC602, MPC603 and MPC604. This course
contains lecture, labs and exercises.
Prerequisites: The student must have advanced
microprocessor and assembly language knowledge. An
understanding
of
memory
management,
multi-processing/master, and cache concepts is also
beneficial.
Description: In this course the MC68HC16Z1 and
MC68HC16Y1 are covered. In this class the student learns to
design wnh the MC68HC16. The CPU16, general purpose timer,
and analog-to--dignal converter are common to both versions.
The MC68HC16Z1 includes the system integration module,
queued serial module, and standby RAM, while the
MC68HC16Y1 includes the single-chip integration module,
mu~t-channel communications interface, timer processor unit,
and standby RAM with TPU eml,Jlation. Lecture, labs and
exercises are a major part of the leaming process for this course.
Prerequisites: Knowledge of microprocessor fundamentals.
Previous experience with enher MC68HCOS or MC68HC11 is
helpful. Students win be sent a self-study packet upon enrollment.
The pre--work must be completed prior to the course start date.
MPC505 PowerPCTM Microcontroller
Description: In this course the student learns to design with
the embedded PowerPC core, system integration unit (SIU),
and associated components of the MPC505. The course
consists of lecture and exercises.
Prerequisites: The student must have advanced
microprocessor and assembly language knowledge.
PowerPC experience is not required.
DSP5600x Family Microprocessor
Description: In this course the student (with digital signal
processing design experience) learns to design with the
DSP5600x digital signal processor. The course consists of
lecture, labs, and exercises.
Prerequisites: The student must have knowledge of at least
one microprocessor and its assembly language. A prior
understanding of digital signal processing theory is important
for those whose applications are DSP oriented.
DSP561xx Family Microprocessor
Description: In this course the student (with digital signal
processing design experience) learns to design with the
DSP561xx digital signal processor. The course consists of
lecture and exercises.
Prerequisites: The student must have knowledge of at least
one microprocessor and its assembly language. A prior
understanding of digital signal processing theory is important
for those whose applications are DSP oriented.
MC68HC08 Microcontroller
Description: In this course the student learns to design with
the MC68HC08 including the on-chip subsystems. Lecture,
labs, and exercises are a major part of the learning process for
this course.
Prerequisites: Knowledge of microprocessor fundamentals.
Previous experience with either MC68HC05 or MC68HC11 is
helpful. Students will be sent a self-study packet upon
enrollment. The pre-work must be completed prior to the
course start date.
Product Literature and Technical Training
6.1--8
TPU Microcode
Description: The TPU Microcode course is a lab-intensive
course in which the student leams how to write microcode
functions for the TPU. The course is approximately 50% lecture
and exercises and 50% lab time.
Prerequisite: The student must have advanced microprocessor
experience.
MC68356 Signal Processing
Communication Engine
Description: In this course the student leams to design and write
programs for the various chip submodules. This includes the
MC68OOOIMC68008 static core, communication processor (CP),
system integration block (SIB), and 56002 digital signal processor.
Labs are a major part of the leaming process; lecture and
exercises are also a part of the course.
Prerequisites: To benefit most from the course, a SNJ and HIW
understanding of the MC68000 microprocessor is a requirement.
Also, some knowledge of the DSP56002 instructions and
addressing modes will be helpful. Students who need to meet
these requirements will receive a 68000 and/or 56000 pre--work
packet. We highly encourage students to complete the pre-WOrk
packet before coming to class.
MC68360 QUICC-QUad Integrated
Communication Controller
Description: In this course the student learns to design and write
programs for the various chip submodules. This includes the
CPU32+ core, communication processor module (CPM) and
system integration module (SIM60). Labs are a major part of the
learning process; lecture and exercises are also a part of the
course.
Prerequisites: To benefit most from the course, a SNJ and HIW
understanding of the MC68000 microprocessor is a requirement.
Students who need to meet these requirements will receive a
68000 pre-work packet. We highly encourage students to
complete the pre-work packet before coming to class.
Motorola Master Selection Guide
Motorola Technical Training Courses (continued)
Ascent Technologies Course Information
M icrocontrollers
the computer operating properly (COP) watchdog timer. Many
application examples are included.
Prerequisites: Students should have a basic understanding
of embedded system operations and their target application.
MC68HC05 Microcontroller Family
Description: This is an introduction to the MC68HC05
microcontroller family, covering the major features of this
cost-effective microcontroller. Students will understand how
to program and apply all the major subsystems of the
MC68HC05 including discrete I/O, timer functions, serial
communication interfaces and analog to digital conversion.
Many application examples are included.
Prerequisites: No familiarity with microcontrollers is
assumed. Some familiarity with binary and hexadecimal
numbering systems as well as fundamental electronic theory
is helpful.
MC68332 Embedded Controller
Description: This is an intensive introduction to the MC68332
embedded controller family. Students will understand how to
program and apply all the major subsystems of the 68332,
including discrete I/O, timer functions, serial communication
interfaces, analog to digital conversion, computer operating
properly (COP) watchdog timer. Many application examples
are included.
Prerequisites: Students should have a basic understanding
of embedded system operations and their target application.
MC68HC11 Microcontroller Family
Description: This is an introduction to the MC68HC11
microcontroller family, covering the major features of this
industry-standard microcontroller. Students will understand
how to program and apply all the major subsystems of the
MC68HC11 including discrete I/O, timer functions, serial
communication interfaces, analog to digital conversion, and
Motorola Master Selection Guide
Ascent Technologies, an embedded systems training and
engineering services company, is located at 525 Avis Drive,
Suite 15, Ann Arbor, MI481 08. For a current course schedule,
course pricing, to enroll in a course, or to schedule a course
at your location, please call1-80Q--410-3601.
6.1-9
Product Literature and Technical Training
Motorola Technical Training Courses (continued)
Arnewsh, Inc. Course Information
Microprocessors
MC6834x Family Integrated Processor
MC68EC/000 Microprocessor
Description: This course covers both the software and
hardware aspects of the MC68EC/000 processor. The course
will cover programming model, data types, instruction set,
addressing modes, exception processing, signal function and
characteristics.
Prerequisites: A basic understanding of microprocessor
systems, digital logic and memory concepts is required.
Description: In this course the students will learn to design
with the CPU32/CPU32+, DMA channels, timers, serial I/O
modules, and system integration module. The course consists
of lecture, exercises, and labs.
Prerequisites: Students need the software and hardware
understanding of the M68K processor family.
DSP96002 Microprocessor
MC68EC/000 Family Programming
Description: This course presents the software functionality
of all the MC68/ECOxO microprocessors. The course covers
the programming model, data types, instruction set,
addressing modes, exception processing, and an overview of
the caches and memory management unit in 020/030/040.
The course consists of lecture, exercises, and labs.
Prerequisites: A basic understanding of microprocessor
systems and assembly language is required.
MC68EC/040/060 Microprocessors
Description: This course covers all the hardware and system
aspects of both the MC68040 and MC68060 members. The
first one and a half days is used to cover the MC68040 and the
common issues of the MC68060. The last half day is used to
point out MC68060 differences and the new features.
Prerequisites: Students should have complete familiarity
with the software aspects of the M68K family. Students who
also need the software and programming background may
attend the M68K family programming course offered in the
same week.
MC68302 Integrated Multiprotocol
Processor
Description: In this course the students learn to design and
write programs for the various chip submodules. This includes
the 68000 core, communication processor (CP) and system
integration block (SIB). The course consists of lecture,
exercises and labs.
Prerequisites: Students need the software and hardware
understanding of the MC68000 processor.
Product Literature and Technical Training
('330, '340, '341, '349)
6.1-10
Description: This course prepares the student for designing
systems which include the DSP96002.
Prerequisites: This course assumes no prior knowledge of
the DSP56001 device.
CUSTOMIZED COURSES
Arnewsh, Inc. can customize these courses for presentation
at your location. For scheduling and pricing information please
contact Arnewsh, Inc. (970) 223-1616.
SINGLE BOARD COMPUTER
SUPPLIER
Arnewsh, Inc. is also the supplier of a number of single board
computer/evaluation boards which are used in Motorola lab
based courses in which students are able to apply hands-on
experience to their learning process. These boards include:
SBC68K, MC68000 based board
SBC302, MC68302 based board
SBC306, MC68306 based board
SBC360/SBC360EC, MC68360 (and 040) based boards
UDLP1, Universal Design Lab Platform
For information write, call or fax to:
Arnewsh, Inc.
P.O. Box 270352
Fort Collins, CO 80527--0352
Phone: (970) 223-1616
Fax: (970) 223-9573
Motorola Master Selection Guide
Motorola Technical Training Courses (continued)
Call 602-302-8008 for the latest copy
of our Technical Training Catalog and class schedule.
If you are outside of the USA, call your local Technical Training Center
or Sales Office and ask for BR348/D.
Technical Training Centers
International Training Centers
Regional Training Centers
Detroit
Phoenix
Munich, Germany
(49)-89-92103571
41700 Six Mile Road
Nothville, MI 48167
(313) 347-6800
432 N 44th Street
Phoenix, AZ 85008
(602) 302-8008
Velizy Villacoublay Cedex, France
(33)-1-34635894
Aylesbury, United Kingdom
(44)-1296-380304
Provide the following information when registering:
You can also register by:
Email: R17994@email.sps.mot.com
Internet WWWeb, URL: http://Design-NET.com
MOTOROLA
Technical Training. 432 North 44th Street. Suite 200 • Phoenix, AZ 85008
Voice: (602) 302-8008 • FAX: (602) 302-8025
ATTENTION: REGISTRAR
Contact's Name: _ _ _ _ _ _ _ _ _ _ _ _ _ _ __
Contact's Phone Number: _ _ _ _ _ _ _ _ __
Date Faxed: _ _ _ __
Fax Number: _ _ _ _ _ __
Company: _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ __
Street Address: _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ __
Ci~:
_ _ _ _ _ _ _ _ _ _ _ _ _ __
Course Name: _ _ _ _ _ _ _ _ __
State: _ _ _
Zip: _ _ _ _ __
Date: _ _ _ _ Location: _ _ _ __
Note: Payment is due no later than two weeks before class start date, either by purchase order,
check, or money order. If submitting a purchase order, please fax a copy with your registration to
(602) 302-8025.
1. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ __
Student Name(s)
"Mail Stop
Address
"SS#
"Dept.#
Phone
"Badge#
Fax
"Sector#
"REQUIRED BY ALL MOTOROLA EMPLOYEES ONLY
Motorola Master Selection Guide
6.1-11
Product Literature and Technical Training
Product Literature and Technical Training
6.1-12
Motorola Master Selection Guide
Device Index and
Subject Index
In Brief.
Page
Device Index ................................... 7.1-1
General Index .................................. 7.2-1
Subject Index .................................. 7.2-9
Device Index
The following index lists the device numbers of the
products contained in this selector guide and references the
page number where each device is described in greater
detail.(1) The listing is in a numeric sequence organized in a
"computer sort." This means that all the devices listed herein
follow a 39 character alphabet. This "new" alphabet starts
with a Period, a Dash and a Slash (. - /), followed by the 26
letter alphabet (A thru Z), which is then followed by 10
numbers (0 thru 9).
The ranking or hierarchy of this 39 character alphabet is
as follows:
.-/ABC D E FG H IJ KLM NO PO RSTU VWX
YZ0123456789
Therefore, if you are looking for a device starting with a
letter of the alphabet like an MC1741CP, it would appear
before a device starting with a number, such as 2N1132.
To find a device in this index, start with the first character
of the device and find that section of the index; next move
to the second character in the device number, and move to
that character within the same portion of the listing; and so
on until the device number is found. In other words, it is
used just like a dictionary, character by character.
For example, to find the 2N6837, go to that section of the
listing that begins with the number "2" (Notice that the section
follows all devices that begin with a letter of the alphabet or
"1"). Next, find that portion of the listing that begins with "2N"
(Notice it follows those devices that begin with "2K"). Next,
find that portion of the listing that begins with "2N6" (Notice it
follows those devices that begin with "2N5"). Continue
looking for those portions that begin with the next consecutive
character until you have found the entire number.
Because of the way "Computer Sort" works it is not
necessary to be concerned with the absolute value or
number of characters in a part number, just move across the
device part number, left to right, one character at a time until
you find the number.
(1) The device numbers contained in this index are for
reference only and do not necessarily represent the complete
device number necessary to order the device. Contact your
local Sales Office or Authorized Distributor for complete
ordering information.
Subject Index
This listing is intended to simplify the identification of
products where specific device numbers are not known.
Motorola Master Selection Guide
7.0-1
Device Index and Subject Index
Device Index and Subject Index
7.0-2
Motorola Master Selection Guide
Device Index
Device Index
Page
AM26LS30 ................... 4.6-7
AM26LS31 ................... 4.6-7
AM26LS32 ................... 4.6-7
BAL99LT1 ................... 5.1-35
BASl16LT1 .................. 5.1-36
BAS16LT1 ................... 5.1-35
BAS16WT1 .................. 5.1-35
BAS21LT1 ................... 5.1-35
BAV170LT1 .................. 5.1-37
BAV199LT1 .................. 5.1-37
BAV70LT1 ................... 5.1-36
BAV70WT1 .................. 5.1-36
BAV74LT1 ................... 5.1-36
BAV99LT1 ................... 5.1-36
BAW156LT1 ................. 5.1-37
BAW56LT1 .................. 5.1-36
BAW56WT1 ................. 5.1-36
BCP53T1 ................... 5.1-15
BCP56T1 ................... 5.1-15
BCP68T1 ................... 5.1-16
BCP69T1 ................... 5.1-16
BC107 ...................... 5.1-17
BC107B ..................... 5.1-17
BC109C ..................... 5.1-17
BCl77B ..................... 5.1-17
BC182 ....................... 5.1-2
BC212 ....................... 5.1-2
BC237B ...................... 5.1-2
BC239 ....................... 5.1-3
BC307B ...................... 5.1-2
BC327 ....................... 5.1-2
BC328 ....................... 5.1-2
BC337 ....................... 5.1-2
BC338 ....................... 5.1-2
BC368 ....................... 5.1-4
BC369 ....................... 5.1-4
BC373 ....................... 5.1-4
BC489 ....................... 5.1-4
BC490 ....................... 5.1-4
BC517 ....................... 5.1-4
BC546 ....................... 5.1-2
BC546A ...................... 5.1-2
BC546B ...................... 5.1-2
BC547 ....................... 5.1-2
BC547A ...................... 5.1-2
BC547B ...................... 5.1-2
BC547C ...................... 5.1-2
BC548 ....................... 5.1-2
BC548A ...................... 5.1-2
BC548B ...................... 5.1-2
BC548C ...................... 5.1-2
BC549B ...................... 5.1-3
BC549C ...................... 5.1-3
BC550B ...................... 5.1-3
BC550C ...................... 5.1-3
BC556 ....................... 5.1-2
BC556B ...................... 5.1-2
BC557 ....................... 5.1-2
BC557A ...................... 5.1-2
BC557B ...................... 5.1-2
BC557C ...................... 5.1-2
BC558B ...................... 5.1-2
BC559B ...................... 5.1-3
. BC559C ...................... 5.1-3
BC560B ...................... 5.1-3
BC560C ...................... 5.1-3
BC618 ....................... 5.1-4
Motorola Master Selection Guide
Device Index
Page
BC639 ....................... 5.1-4
BC640 ....................... 5.1-4
BC807-16LT1 ............... 5.1-10
BC807-25LT1 ............... 5.1-11
BC807-40LT1 ............... 5.1-11
BC817-16LTl ............... 5.1-10
BC817-25LTl ............... 5.1-10
BC817-40LT1 ............... 5.1-10
BC846ALT1 ................. 5.1-10
BC846AWT1 ................. 5.1-11
BC846BLT1 ................. 5.1-10
BC846BWT1 ................ 5.1-11
BC847ALT1 ................. 5.1-10
BC847AWTl ................. 5.1-11
BC847BLT1 ................. 5.1-10
BC847BWT1 ................ 5.1-11
BC847CLT1 ................. 5.1-10
BC847CWT1 ................ 5.1-11
BC848ALT1 ................. 5.1-10
BC848AWTl ................. 5.1-11
BC848BLT1 ................. 5.1-10
BC848BWT1 ................ 5.1-11
BC848CLTl ................. 5.1-10
BC848CWT1 ................ 5.1-11
BC856ALT1 ................. 5.1-10
BC856AWT1 ................. 5.1-11
BC856BLTl ................. 5.1-10
BC856BWT1 ................ 5.1-11
BC857ALT1 ................. 5.1-11
BC857AWT1 ................. 5.1-11
BC857BLT1 ................. 5.1-11
BC857BWT1 ................ 5.1-11
BC858ALT1 ................. 5.1-11
BC858AWT1 ................. 5.1-11
BC858BLT1 ................. 5.1-11
BC858BWT1 ................ 5.1-11
BC858CLTl ................. 5.1-11
BC858CWT1 ................ 5.1-11
BOB01C ..................... 5.1-3
BOB02C .. " ................. 5.1-3
BOB020 ..................... 5.1-3
BOC01D ..................... 5.1-3
BOC020 ..................... 5.1-3
BOC05 ....................... 5.1-5
BOV64B ..................... 5.5-6
BOV65B ..................... 5.5-6
BOW42 ...................... 5.5-6
BOW47 ...................... 5.5-6
BOX33B ..................... 5.5-5
BOX33C ..................... 5.5-6
BOX34B ..................... 5.5-5
BOX34C ..................... 5.5-6
BOX53B ..................... 5.5-5
BOX53C ..................... 5.5-5
BOX54B ..................... 5.5-5
BOX54C ..................... 5.5-5
B0135 ........ .. .. .. .. .. .. ... 5.5-9
B0136 ....... . . . . . . . . . . . . . . .. 5.5-9
B0137 ........ . . .. .. .. .. .. ... 5.5-9
B0138 .. . . . .. .. .. .. .. .. .. . ... 5.5-9
B0139 ....................... 5.5-9
B0140 ....................... 5.5-9
B0140-10 .................... 5.5-9
B0157 ....... . . . . . . . . . . . . . . .. 5.5-8
B0158 . . . . . . . . . . . . . . . . . . . . . .. 5.5-8
B0159 .......... .. .. .. .. .. ... 5.5-9
B0165 ....................... 5.5-9
7.1-1
Device Index
Page
B0166 ....................... 5.5-9
B0169 ..................... " 5.5-9
B0179 ....................... 5.5-9
B0180 .................... '" 5.5-9
B0237 .................... '" 5.5-9
B0238 ........ . . . . . . . . . . . . . .. 5.5-9
B0241 B . .. .. .. . .. .. .. .. .. .... 5.5-3
B0241 C . . . . . . . . . . . . . . . . . . . . .. 5.5-3
B0242B .. .. .. .. .. .. . . .. .. . . .. 5.5-3
B0242C . . . . . . . . . . . . . . . . . . . . .. 5.5-3
B0243B .. .. .. .. .. .. . . .. .. .... 5.5-4
B0243C .................... " 5.5-4
B0244B . . . . .. . . . . . . . . . . . . . . .. 5.5-4
B0244C . . . . . . . . . . . . . . . . . . . . .. 5.5-4
B0249C .. .. .. . . .. .. . . .. .. . ... 5.5-7
B0250C ...................... 5.5-7
B0437 ........ . .. .. . . . .. .. ... 5.5-9
B0438 ........ . .. .. . . .. .. .... 5.5-9
B0440 ... .. .. .. . .. .. .. .. .. ... 5.5-9
B0441 ....................... 5.5-9
B0442 .............. . . . . . . . .. 5.5-9
B0677 .............. . .. .. . ... 5.5-9
B0677A ...................... 5.5-9
B0678 ........ . .. .. .. . .. .. ... 5.5-9
B0678A .. .. .. .. . . .. .. .. .. .... 5.5-9
B0679 ... .. .. .. . .. .. . .. .. .... 5.5-9
B0679A .................... " 5.5-9
B0680 .................... '" 5.5-9
B0680A .................... " 5.!>-9
B0681 ...................... 5.5-10
B0682 ...................... 5.5-10
B0776 .... . . . . . . . . . . . . . . . . . .. 5.5-9
B0777 .............. . . . . . . . .. 5.5-9
B0778 ..................... " 5.5-9
B0779 ...................... 5.5-10
B0780 ...................... 5.5-10
B0787 .... .. .. .. . .. .. .. .. .... 5.5-9
B0788 ........... . .. .. .. .. ... 5.5-9
B0789 ....................... 5.5-9
B0790 ............... . . . . . . .. 5.5-9
B0791 ...................... 5.5-10
B0792 ...................... 5.5-10
B0801 ....................... 5.5-4
B0802 ........... . . . . . . . . . . .. 5.5-4
B0808 ........ . . . . . . . . . . . . . .. 5.5-5
B0809 ........ . .. .. .. .. .. . ... 5.5-5
B0810 ....................... 5.5-5
BFR90 ............. 5.10--16,5.10--19
BFR92ALT1 ................ 5.10--16
BFR93ALT1 ................ 5.10--16
BFR96 ............. 5.10-16,5.10--19
BFS17LT1 .................. 5.10--16
BF199 ....................... 5.1-6
BF224 ....................... 5.1-6
BF246A ..................... 5.1-20
BF246B ..................... 5.1-20
BF393 ....................... 5.1-5
BF420 ....................... 5.1-5
BF421 ....................... 5.1-5
BF422 ....................... 5.1-5
BF423 ....................... 5.1-5
BF493S ...................... 5.1-5
BF720T1 .................... 5.1-16
BF721T1 .................... 5.1-16
BF844 ....................... 5.1-5
BF959 ....................... 5.1-6
BSP16T1 .................... 5.1-16
Oevice Index
Device Index
Device Index
Page
BSP19AT1 .................. 5.1-16
BSP20AT1 .................. 5.1-16
BSP52T1 .................... 5.1-16
BSP62T1 .................... 5.1-16
BSS123LT1 ................. 5.1-23
BSS63LT1 ................... 5.1-15
BSS64LT1 ................... 5.1-15
BSS73 ...................... 5.1-18
BSS76 ..... , ................ 5.1-18
BSS89 ...................... 5.1-21
BSV52LT1 ................... 5.1-13
BSX20 ...................... 5.1-18
BS107 ...................... 5.1-21
BS107A ..................... 5.1-21
BS170 ...................... 5.1-21
BUD43B-1 .................. 5.5-19
BUD44D2-1 ................. 5.5-19
BUH100 ..................... 5.5-18
BUH150 ..................... 5.5-18
BUH50 ...................... 5.5-18
BUH51 ...................... 5.5-19
BUL146 ............... 5.5-4,5.5-18
BUL146F .................... 5.5-19
BUL147 ............... 5.5-5,5.5-18
BUL147F .................... 5.5-19
BUL43B ..................... 5.5-18
BUL44 ................ 5.5-3,5.5-18
BUL44D2 .................... 5.5-18
BUL44F ..................... 5.5-19
BUL45 ................ 5.5-4,5.5-18
BUL45D2 ................... 5.5-18
BUL45F ..................... 5.5-19
BUS50 ...................... 5.5-14
BUS98 ...................... 5.5-14
BUS98A .................... 5.5-14
BUT33 ...................... 5.5-14
BUT34 ...... '" ............. 5.5-14
BUV11 ...................... 5.5-13
BUV18A .................... 5.5-14
BUV20 ...................... 5.5-14
BUV21 ...................... 5.5-14
BUV22 ...................... 5.5-14
BUV23 ...................... 5.5-14
BUV48 ....................... 5.5-7
BUV48A ..................... 5.5-7
BUV60 ...................... 5.5-14
BUX48 ...................... 5.5-12
BUX48A .................... 5.5-12
BUX85 .. .. .. .. .. .. .. .. .. .. ... 5.5-3
BUX98 ...................... 5.5-14
BUX98A .................... 5.5-14
BUY49P ..................... 5.5-9
BU208A ..................... 5.5-11
BU323A ..................... 5.5-12
BU323AP .................... 5.5-6
BU406 ....................... 5.5-4
BU407 ....................... 5.5-4
BU522B . . . .. . . .. . . . . . . . . . . . .. 5.5-4
BU806 ....................... 5.5-5
BZX55C10RL ................ 5.2-16
BZX55C11RL ................ 5.2-16
BZX55C12RL ................ 5.2-16
BZX55C13RL ................ 5.2-16
BZX55C15RL ................ 5.2-16
BZX55C16RL ................ 5.2-16
BZX55C2V4RL .............. 5.2-16
BZX55C2V7RL .............. 5.2-16
Device Index
Device Index
Page
BZX55C20RL ................ 5.2-17
BZX55C27RL ................ 5.2-17
BZX55C3VORL .............. 5.2-16
BZX55C3V3RL .............. 5.2-16
BZX55C3V6RL .............. 5.2-16
BZX55C3V9RL .............. 5.2-16
BZX55C4V3RL .............. 5.2-16
BZX55C4V7RL .............. 5.2-16
BZX55C5V1RL .............. 5.2-16
BZX55C5V6RL .............. 5.2-16
BZX55C51RL ................ 5.2-17
BZX55C6V2RL .............. 5.2-16
BZX55C6V8RL .............. 5.2-16
BZX55C68RL ................ 5.2-17
BZX55C7V5RL .............. 5.2-16
BZX55C75RL ................ 5.2-17
BZX55C8V2RL .............. 5.2-16
BZX55C82RL ................ 5.2-17
BZX55C9V1RL .............. 5.2-16
BZX55C91RL ................ 5.2-17
BZX79C100RL ............... 5.2-17
BZX79C12RL ................ 5.2-16
BZX79C15RL ................ 5.2-16
BZX79C16RL ................ 5.2-16
BZX79C2V4RL .............. 5.2-16
BZX79C2V7RL .............. 5.2-16
BZX79C3VORL .............. 5.2-16
BZX79C3V3RL .............. 5.2-16
BZX79C3V6RL .............. 5.2-16
BZX79C33RL ................ 5.2-17
BZX79C4V3RL .............. 5.2-16
BZX79C4V7RL .............. 5.2-16
BZX79C5V1RL .............. 5.2-16
BZX79C5V6RL .............. 5.2-16
BZX79C56RL .. .. .. .. .. .. .... 5.2-17
BZX79C6V2RL .............. 5.2-16
BZX79C6V8RL .............. 5.2-16
BZX79C8V2RL .............. 5.2-16
BZX83C12RL ................ 5.2-16
BZX83C3V3RL .............. 5.2-16
BZX83C3V6RL .............. 5.2-16
BZX83C4V7RL .............. 5.2-16
BZX83C5V1RL .............. 5.2-16
BZX83C6V2RL .............. 5.2-16
BZX84C10LT1 ........ 5.2-21,5.2-24
BZX84C11 LT1 ........ 5.2-21,5.2-24
BZX84C12LT1 ........ 5.2-21,5.2-24
BZX84C13LT1 ........ 5.2-21,5.2-24
BZX84C15LT1 ........ 5.2-21,5.2-24
BZX84C16LT1 ........ 5.2-21,5.2-24
BZX84C18LT1 ........ 5.2-21,5.2-24
BZX84C2V4LT1 ....... 5.2-21,5.2-24
BZX84C2V7LT1 ....... 5.2-21,5.2-24
BZX84C20LT1 ........ 5.2-21,5.2-24
BZX84C22LT1 ........ 5.2-21,5.2-24
BZX84C24LTl ........ 5.2-21,5.2-24
BZX84C27LTl ........ 5.2-21,5.2-24
BZX84C3VOLTl ....... 5.2-21,5.2-24
BZX84C3V3LTl ....... 5.2-21,5.2-24
BZX84C3V6LTl ....... 5.2-21,5.2-24
BZX84C3V9LTl .............. 5.2-21
BZX84C30LTl ........ 5.2-22,5.2-24
BZX84C33LT1 ........ 5.2-22,5.2-24
BZX84C36LTl ........ 5.2-22,5.2-24
BZX84C39LTl ........ 5.2-22,5.2-24
BZX84C4V3LT1 ....... 5.2-21,5.2-24
BZX84C4V7LTl ....... 5.2-21,5.2-24
7.1-2
Device Index
Page
BZX84C43LT1 ........ 5.2-22,5.2-24
BZX84C47LT1 ........ 5.2-22,5.2-24
BZX84C5V1 LTl ....... 5.2-21,5.2-24
BZX84C5V6LTl ....... 5.2-21,5.2-24
BZX84C51LTl ........ 5.2-22,5.2-24
BZX84C56LTl ........ 5.2-22,5.2-24
BZX84C6V2LTl ....... 5.2-21,5.2-24
BZX84C6V8LTl ....... 5.2-21,5.2-24
BZX84C62LTl ........ 5.2-22,5.2-24
BZX84C68LT1 ........ 5.2-22,5.2-24
BZX84C7V5LTl ....... 5.2-21,5.2-24
BZX84C75LTl ........ 5.2-22,5.2-24
BZX84C8V2LTl ....... 5.2-21, 5.2-24
BZX84C9V1 LTl ....... 5.2-21, 5.2-24
BZX85Cl0RL ................ 5.2-18
BZX85Cl00RL ............... 5.2-19
BZX85C12RL ................ 5.2-18
BZX85C15RL ................ 5.2-18
BZX85CI8RL ................ 5.2-18
BZX85C22RL ................ 5.2-18
BZX85C24RL ................ 5.2-18
BZX85C27RL ................ 5.2-18
BZX85C3V3RL .............. 5.2-18
BZX85C3V6RL ., ............ 5.2-18
BZX85C3V9RL .............. 5.2-18
BZX85C30RL ................ 5.2-18
BZX85C33RL .. .. .. .. .. .. .... 5.2-18
BZX85C43RL ................ 5.2-18
BZX85C47RL ................ 5.2-18
BZX85C5V1RL .............. 5.2-18
BZX85C5V6RL .............. 5.2-18
BZX85C6V8RL .............. 5.2-18
BZX85C7V5RL .............. 5.2-18
BZX85C75RL ................ 5.2-19
BZX85C8V2RL .............. 5.2-18
CATHRU ................... 5.10-33
CA2810C .................. 5.10-34
CA2818C .................. 5.10-34
CA2830C .................. 5.10-34
CA2832C .................. 5.10-34
CA2833C .................. 5.10-34
CA2842C .................. 5.10-34
CA3059 .. .. .. .. .. .. .. .. .. .... 4.3-2
CA3146 ...................... 4.~
CA4800C .................. 5.10-34
CA4800CS ................. 5.10-34
CA4812C .................. 5.10-34
CA4812CS ................. 5.10-34
CA4815C .................. 5.10-34
CA4815CS ................. 5.10-34
CA5800C .................. 5.10-34
CA5800CS ................. 5.10-34
CA5801 .................... 5.10-34
CA5801S ................... 5.10-34
CA5815C .................. 5.10-34
CA5815CS ................. 5.10-34
CA901 ..................... 5.10-33
CA901A .................... 5.10-33
CA922 ..................... 5.10-33
CA922A .................... 5.10-33
CNYI7-1 .................... 5.8-6
CNY17-2 .................... 5.8-6
CNYI7-3 .................... 5.8-6
CR2428 .................... 5.10-35
CR3428 .................... 5.10-35
Cl06A ....................... 5.7-3
Cl06B ....................... 5.7-3
Motorola Master Selection Guide
Device Index
Device Index
Page
C106D ....................... 5.7-3
C106F ....................... 5.7-3
C106M ....................... 5.7-3
DSPCOMMAND ............. 2.1-12
DSPMACHOST .............. 2.1-12
DSPPCHOST ................ 2.1-12
DSPSUN4HOST ............. 2.1-12
DSP56ADC16S .............. 2.1-10
DSP56KCCA ................ 2.1-13
DSP56KCCAJ ............... 2.1-13
DSP56KCCF ................ 2.1-13
DSP56KCCFJ ............... 2.1-13
DSP56KCCH ................ 2.1-13
DSP56L002FC40 ............. 2.1-6
DSP56000CLASA ............ 2.1-13
DSP56000CLASB ............ 2.1-13
DSP56000CLASF ............ 2.1-13
DSP56000CLASH ............ 2.1-13
DSP56002ADM .............. 2.1-12
DSP56002ADSA ............. 2.1-12
DSP56002ADSB ............. 2.1-12
DSP56002ADSF ............. 2.1-12
DSP56002ADSH ............. 2.1-12
DSP56002EVM .............. 2.1-12
DSP56002FC40 ............... 2.1-6
DSP56002FC66 ............... 2.1-6
DSP56002RC40 .............. 2.1-6
DSP56004ADM .............. 2.1-12
DSP56004ADSA ............. 2.1-12
DSP56004ADSB ............. 2.1-12
DSP56004ADSF ............. 2.1-12
DSP56004ADSH ............. 2.1-12
DSP56005ADPTR ............ 2.1-12
DSP56005ADSA ............. 2.1-12
DSP56005ADSB ............. 2.1-12
DSP56005ADSF ............. 2.1-12
DSP56005ADSH ............. 2.1-12
DSP56007EVM .............. 2.1-12
DSP56009EVM .............. 2.1-12
DSP561CCCA ............... 2.1-13
DSP561CCCF ............... 2.1-13
DSP561CCCH ............... 2.1-13
DSP56100ADSA ............. 2.1-12
DSP56100ADSB ............. 2.1-12
DSP56100ADSF ............. 2.1-12
DSP56100ADSH ............. 2.1-12
DSP56100CLASA ............ 2.1-13
DSP56100CLASB ............ 2.1-13
DSP56100CLASF ............ 2.1-13
DSP56100CLASH ............ 2.1-13
DSP56156ADM .............. 2.1-12
DSP56166ADM .............. 2.1-12
DSP563CCA ................ 2.1-13
DSP563CCF ................. 2.1-13
DSP563CCH ................ 2.1-13
DSP56300CLASA ............ 2.1-13
DSP56300CLASF ............ 2.1-13
DSP56300CLASH ............ 2.1-13
DSP56301ADSA ............. 2.1-12
DSP56301ADSF ............. 2.1-12
DSP56301ADSH ............. 2.1-12
DSP96KCCA ................ 2.1-13
DSP96KCCF ................ 2.1-13
DSP96KCCH ................ 2.1-13
DSP96000ADM .............. 2.1-12
DSP96000ADSA ............. 2.1-12
DSP96000ADSB ............. 2.1-12
Motorola Master Selection Guide
Device Index
Page
DSP96000ADSF ............. 2.1-12
DSP96000ADSH ............. 2.1-12
DSP96000CLASA ............ 2.1-13
DSP96000CLASB ............ 2.1-13
DSP96000CLASF ............ 2.1-13
DSP96000CLASH ............ 2.1-13
DS0026 .... . . . . . . . . . . . . . . . .. 4.2-25
D44C12 . . . . . . . . . . . . . . . . . . . . .. 5.5-4
D44H10 ...................... 5.5-5
D44H11 ...................... 5.5-5
D44H8 . . . . . . . . . . . . . . . . . . . . . .. 5.5-5
D44VH10 .................... 5.5-6
D45C12 . . . . . . . . . . . . . . . . . . . . .. 5.5-4
D45H10 ...................... 5.5-5
D45H11 ...................... 5.5-5
D45H8 . . . . . . . . . . . . . . . . . . . . . .. 5.5-5
D45VH10 .................... 5.5-6
HDC003 ..................... 1.1-3
HDC006 ..................... 1.1-3
HDC008 ..................... 1.1-3
HDC011 ...................... 1.1-3
HDC016 ..................... 1.1-3
HDC027 ..................... 1.1-3
HDC031 ..................... 1.1-3
HDC049 ..................... 1.1-3
H11AA1 ...................... 5.8-6
H11AA2 ...................... 5.8-6
H11AA3 ...................... 5.8-6
H11AA4 ...................... 5.8-6
H11AV1 ...................... 5.8-6
H11AV2 ...................... 5.8-6
H11A1 ....................... 5.8-6
H11A550 ..................... 5.8-6
H11B1 ....................... 5.8-7
H11D1 ....................... 5.8-7
H11D2 ....................... 5.8-7
H11G1 ....................... 5.8-7
H11G2 ....................... 5.8-7
H11G3 ....................... 5.8-7
H11L1 ....................... 5.8-6
H11L2 ....................... 5.8-6
H4CP028 .................... 1.1-5
H4CP048 .................... 1.1-5
H4CP075 .................... 1.1-5
H4CP109 .................... 1.1-5
H4CP146 .................... 1.1-5
H4CP178 .................... 1.1-5
H4C018 ...................... 1.1-4
H4C027 ...................... 1.1-4
H4C035 ...................... 1.1-4
H4C057 ...................... 1.1-4
H4C086 ...................... 1.1-4
H4C123 ...................... 1.1-4
H4C161 ...................... 1.1-4
H4C195 ...................... 1.1-4
H4C267 ...................... 1.1-4
H4C318 ...................... 1.1-4
ICTE-10 ..................... 5.2-6
ICTE-10C .................... 5.2-6
ICTE-12 ..................... 5.2-6
ICTE-12C . . . . . . . . . . . . . . . . . . .. 5.2-6
ICTE-15 ..................... 5.2-6
ICTE-15C .................... 5.2-6
ICTE-18 ..................... 5.2-6
ICTE-18C .................... 5.2-6
ICTE-22 ..................... 5.2-6
ICTE-36 ..................... 5.2-6
7.1-3
Device Index
Page
ICTE-36C . . . . . . . . . . . . . . . . . . .. 5.2-6
ICTE-45 ..................... 5.2-6
ICTE-45C . . . . . . . . . . . . . . . . . . .. 5.2-6
ICTE-5 ...................... 5.2-6
ICTE-8 ...................... 5.2-6
ICTE-8C . . . . . . . . . . . . . . . . . . . .. 5.2-6
J110 ........................ 5.1-20
J111 ........................ 5.1-20
J112 ........................ 5.1-20
J113 ........................ 5.1-20
J202 ........................ 5.1-19
J308 ........................ 5.1-19
J309 ........................ 5.1-19
J310 ........................ 5.1-19
LF347 ....................... 4.1-4
LF347B ...................... 4.1-4
L~~ ....................... ~14
LF353 ....................... 4.1-3
LF411C ...................... 4.1-2
LF412C ...................... 4.1-3
LF441C ...................... 4.1-2
LF442C ...................... 4.1-3
LF444C ...................... 4.1-4
LM11C ....................... 4.1-2
LM11CL ...................... 4.1-2
LM201A ...................... 4.1-2
LM211 ....................... 4.1-7
LM224 ....................... 4.1-4
LM224A ...................... 4.1-4
LM239 ....................... 4.1-7
LM239A ...................... 4.1-7
LM258 ....................... 4.1-3
LM285Z-1.2 .................. 4.4-2
LM285Z-2.5 .................. 4.4-2
LM2900 ...................... 4.1-4
LM2901 ...................... 4.1-7
LM2902 ...................... 4.1-4
LM2903 ...................... 4.1-7
LM2904 . . . . . . . . . . . . . . . . . . . . .. 4.1-3
LM293 ....................... 4.1-7
LM2931 .......... 4.2-2,4.2-3, 4.9-2
LM2931A ..................... 4.2-3
LM2931A-5.0 ................. 4.2-2
LM2931C .............. 4.2-4,4.9-2
LM2935 . . . . . . . . . . . . . . .. 4.2-4, 4.9-2
LM301A ...................... 4.1-2
LM308A ...................... 4.1-2
LM311 ....................... 4.1-7
LM317 ....................... 4.2-5
LM317B ...................... 4.2-5
LM317L . . . . . . . . . . . . . . . . . . . . .. 4.2-4
LM317LB . . . . . . . . . . . . . . . . . . . .. 4.2-4
LM317M ..................... 4.2-5
LM317MB .................... 4.2-5
LM323 ...... . . . . . . . . . . . . . . . .. 4.2-3
LM323A . . . . . . . . . . . . . . . . . . . . .. 4.2-3
LM324 ....................... 4.1-4
LM324A ..................... 4.1-4
LM337 ...... . . . . . . . . . . . . . . . .. 4.2-5
LM337B . . . . . . . . . . . . . . . . . . . . .. 4.2-5
LM337M ..................... 4.2-5
LM337MB .... . . . . . . . . . . . . . . .. 4.2-5
LM339 ....................... 4.1-7
LM339A ...................... 4.1-7
LM340 . . . . . . . . . . . . . . . . . . . . . .. 4.2-3
LM340-24 . . . . . . . . . . . . . . . . . . .. 4.2-3
LM340A-XX . . . . . . . . . . . . . . . . .. 4.2-3
Device Index
Device Index
Device Index
Page
LM348 ..•.................... 4.1-4
LM350 ....................... 4.2-5
LM350B . . . . . . . . . . . . . . . . . . . . .. 4.2-5
LM358 ..............•......•. 4.1-3
LM385BZ-1.2 ................. 4.4-2
LM385BZ-2.5 ................. 4.4-2
LM385Z-1.2 .................. 4.4-2
LM385Z-2.5 ..........••...... 4.4-2
LM3900 ............•......... 4.1-4
LM393 ....•...........•...... 4.1-7
LM393A .......•.............. 4.1-7
LM833 ....................... 4.1-3
LP1001 ............ 5.10-15,5.10-19
LP1001A ........... 5.10-15,5.10-19
LP2950AC ............. 4.2-2, 4.2-4
LP2950C .. .. .. .. .. .. ... 4.2-2, 4.2-4
LP2951AC ................... 4.2-4
LP2951C ..................... 4.2-4
MAC08BT1 ................... 5.7-7
MAC08DT1 ................... 5.7-7
MACOBMT1 .................. 5.7-7
MAC12D .................... 5.7-12
MAC12M .................... 5.7-12
MAC12N .................... 5.7-12
MAC15A10 .................. 5.7-12
MAC15A10FP ............... 5.7-12
MAC15A4 ................... 5.7-12
MAC15A4FP ................ 5.7-12
MAC15A6 ................... 5.7-12
MAC15A6FP ................ 5.7-12
MAC15A8 ................... 5.7-12
MAC15A8FP ................ 5.7-12
MAC15D .................... 5.7-12
MAC15M .................... 5.7-12
MAC15N .................... 5.7-12
MAC15SD ................... 5.7-12
MAC15SM .................. 5.7-12
MAC15SN ................... 5.7-12
MAC16D .................... 5.7-12
MAC16M .................... 5.7-12
MAC16N .................... 5.7-12
MAC210A10 ................. 5.7-11
MAC210A10FP .............. 5.7-11
MAC210A4 .................. 5.7-11
MAC210A4FP ............... 5.7-11
MAC210A6 .................. 5.7-11
MAC210A6FP ............... 5.7-11
MAC210A8 .................. 5.7-11
MAC210A8FP ............... 5.7-11
MAC212A10 ................. 5.7-11
MAC212A10FP .............. 5.7-11
MAC212A4 .................. 5.7-11
MAC212A4FP ............... 5.7-11
MAC212A6 .................. 5.7-11
MAC212A6FP ............... 5.7-11
MAC212A8 ............ 4.3-3,5.7-11
MAC212A8FP ............... 5.7-11
MAC218A10 .................. 5.7-9
MAC218A10FP ............... 5.7-9
MAC218A4 ................... 5.7-9
MAC218A4FP ................ 5.7-9
MAC218A6 ................... 5.7-9
MAC218A6FP ................ 5.7-9
MAC218A8 ................... 5.7-9
MAC218A8FP ................ 5.7-9
MAC223A10 ................. 5.7-13
MAC223A10FP .............. 5.7-13
Device Index
Device Index
Page
MAC223A4 .................. 5.7-13
MAC223A4FP ............... 5.7-13
MAC223A6 .................. 5.7-13
MAC223A6FP ............... 5.7-13
MAC223A8 .................. 5.7-13
MAC223A8FP ............... 5.7-13
MAC224A10 ................. 5.7-13
MAC224A4 .................. 5.7-13
MAC224A6 .................. 5.7-13
MAC224A8 .................. 5.7-13
MAC228A10 ................. 5.7-10
MAC228A10FP .............. 5.7-10
MAC228A4 .................. 5.7-10
MAC228A4FP ............... 5.7-10
MAC228A6 .................. 5.7-10
MAC228A6FP ............... 5.7-10
MAC228A8 .................. 5.7-10
MAC228A8FP ............... 5.7-10
MAC310A10 ................. 5.7-11
MAC310A4 .................. 5.7-11
MAC310A6 .................. 5.7-11
MAC310A8 .................. 5.7-11
MAC320A10 ................. 5.7-13
MAC320A10FP .............. 5.7-13
MAC320A4 .................. 5.7-13
MAC320A4FP ............... 5.7-13
MAC320A6 .................. 5.7-13
MAC320A6FP ................ 5.7-13
MAC320A8 .................. 5.7-13
MAC320A8FP ............... 5.7-13
MAC321-10 ................. 5.7-13
MAC321-4 .................. 5.7-13
MAC321-6 .................. 5.7-13
MAC321-8 .................. 5.7-13
MACBD ...................... 5.7-9
MACBM ...................... 5.7-9
MAC8N ...................... 5.7-9
MACBSD ..................... 5.7-9
MACBSM ..................... 5.7-9
MAC8SN ..................... 5.7-9
MAC9D ...................... 5.7-9
MAC9M ...................... 5.7-9
MAC9N ...................... 5.7-9
MAC97-6 .................... 5.7-7
MAC97-8 .................... 5.7-7
MAC97A6 .................... 5.7-7
MAC97AB .................... 5.7-7
MAD1103P .................. 5.1-39
MAD1107P .................. 5.1-39
MAD110BP .................. 5.1-39
MAD1109P .................. 5.1-39
MAD130P ................... 5.1-39
MBD101 .................... 5.1-32
MBD301 .................... 5.1-32
MBD701 .................... 5.1-32
MBRA130LT3K ............... 5.6-4
MBRA140T3K ................ 5.6-4
MBRB1545CT ................ 5.6-5
MBRB20100CT ............... 5.6-5
MBRB20200CTK .. .. .. .. .. .... 5.6-5
MBRB2060CT ................ 5.6-5
MBRB2515L .................. 5.6-3
MBRB2515LK ................ 5.6-5
MBRB2535CTL ......... 5.6-3, 5.6-5
MBRB2545CT ................ 5.6-5
MBRB3030CTK .. .. .. .. .. .. ... 5.6-5
MBRB3030CTL ............... 5.6-3
7.1-4
Device Index
Page
MBRB3030CTLK .. .. .. .. .. .... 5.6-5
MBRB4030K ................ " 5.6-5
MBRD1035CTL ............... 5.6-3
MBRD1035CTLK .............. 5.6-5
MBRD340 .. .. .. .. .. .. .. .. .... 5.6-5
MBRD360 .. .. .. .. .. .. .. .. .... 5.6-5
MBRD640CT ................. 5.6-5
MBRD660CT ................. 5.6-5
MBRDB35L .. .. .. .. .. .. .. .. ... 5.6-3
MBRD835LK ................. 5.6-5
MBRF1045K ...... ; ........... 5.6-7
MBRF1545CT ................ 5.6-7
MBRF20100CT ............... 5.6-7
MBRF20200CT ............... 5.6-7
MBRF2045CT ................ 5.6-7
MBRF2060CT ................ 5.6-7
MBRF2545CT ................ 5.6-7
MBRF745K ................... 5.6-7
MBRP20030CTL .............. 5.6-3
MBRP20030CTLK . . . . . . . . . . . .. 5.6-9
MBRP20045CTK . .. .. .. .. .. ... 5.6-9
MBRP20060CTK . .. .. .. .. .. ... 5.6-9
MBRP30045CTK .. .. .. . .. .. ... 5.6-9
MBRP30060CTK .. .. .. .. .. .... 5.6-9
MBRP60035CTL .. .. .. .. .. .... 5.6-3
MBRP60035CTLK . . . . . . . . . . . .. 5.6-9
MBRS1100T3 ... : ............. 5.6-4
MBRS130LT3 ........... 5.6-3,5.6-4
MBRS140T3 .................. 5.6-4
MBRS340T3 . . .. . .. .. .. . . .. . .. 5.6-4
MBRS360T3K ................ 5.6-4
MBRV7030CTLK . . . . . . . . . . . . . . 5;6-5
MBR0520LT1 ................ ; 5.6-3
MBR0520LT1 K ................ 5.6-4
MBR0530T1 K . .. . . . .. .. . . . . ... 5.6-4
MBR0540T1 K . .. . .. .. .. . . . .. .. 5.6-4
MBR10100 ................... 5.6-7
MBR1045 .................... 5.6-7
MBR1060 .................... 5.6-7
MBR1100 .................... 5.6-6
MBR1545CT .................. 5.6-7
MBR160 ..................... 5.6-6
MBRl645 .................... 5.6-7
MBR20100CT ................ 5.6-7
MBR20200CT ................ 5.6-7
MBR2030CTL ................ 5.6-3
MBR2030CTLK ............... 5.6-7
MBR2045CT .................. 5.6-7
MBR2060CT . . .. . .. .. . . . . . .. .. 5.6-7
MBR2515L ................... 5.6-3
MBR2515LK .................. 5.6-7
MBR2535CTL ................ 5.6-3
MBR2535CTLK ............... 5.6-7
MBR2545CT . . .. . . .. . . . . . . . . .. 5.6-7
MBR3045PT .. .. .. .. .. .. .. .... 5.6-6
MBR3045STK ................ 5.6-7
MBR3045WT ................. 5.6-6
MBR3100 .................... 5.6-6
MBR340 .. . .. . .. .. .. .. .. .. ... 5.6-6
MBR360 ..................... 5.6-6
MBR4015LWT .......... 5.6-3,5.6-8
MBR4045PT .. .. .. .. .. .. .. .... 5.6-8
MBR4045WT ................. 5.6-8
MBR5025L ................... 5.6-3
MBR5025LK .. .. .. .. .. .. ...... 5.6-8
MBR6045PTK ................ 5.6-8
MBR6045WT ................. 5.6-8
Motorola Master Selection Guide
Device Index
Device Index
Page
MBR7030WT ................. 5.6-8
MBR745 ..................... 5.6-7
MBS4991 ................... 5.7-14
MBS4992 ................... 5.7-14
MBS4993 ................... 5.7-14
MBV109T1 .................. 5.1-30
MCA10000ECL ............... 1.1-2
MCA2200ECL ................ 1.1-2
MCA231 ..................... 5.8-7
MCA3200ETL. ................ 1.1-2
MCA6200ETL. ................ 1.1-2
MCA750ETL .................. 1.1-2
MCCF33093 . . . . . . . . . . . . . . . . .. 4.9-2
MCCF33094 . . . . . . . . . . . . . . . . .. 4.9-2
MCCF33095 . . . . . . . . . . . . . . . . .. 4.9-3
MCCF3334 . . . . . . . . . . . . . . . . . .. 4.9-2
MCCF79076 . . . . . . . . . . . . . . . . .. 4.9-2
MCCS142233 •............... 3.1-36
MCCS142234 ................ 3.1-36
MCCS142235 ................ 3.1-36
MCCS142237 ................ 3.1-36
MCH12140 ........... 3.1-22,4.7-38
MCK12140 ........... 3.1-22,4.7-38
MCM10139 .................. 3.1-35
MCM10143 .................. 3.1-36
MCM10145 .................. 3.1-36
MCM10146 .................. 3.1-35
MCM10149*25 ............... 3.1-35
MCM10152 ...........•...... 3.1-35
MCM18100 ............•...... 2.8-5
MCM18200 . . . . . . . . . . . . . . . . . .. 2.8-5
MCM18400 ................... 2.8-5
MCM18800 ................... 2.8-5
MCM32L103 .................. 2.8-5
MCM32T100 .................. 2.8-5
MCM32T116 .................. 2.8-5
MCM32T200 • . . . . . . . . . . . . . . . .. 2.8-5
MCM32T216 •................. 2.8-5
MCM32T800 .................. 2.8-5
MCM32100 ................... 2.8-5
MCM321024 .................. 2.8-4
MCM32103 ................... 2.8-5
MCM32116 ................... 2.8-5
MCM32130 ................... 2;8-5
MCM32216 ................... 2.8-5
MCM32230 . . . . . . . . . . . . . . . . . .. 2.8-5
MCM32400 . . . . . . . . . . . . . . . . . .. 2.8-5
MCM32410 ................... 2.8-5
MCM32420 • . . . . . . . . . . . . . . . . .. 2.8-5
MCM32423 . . . . . . . . . . . . . . . . . .. 2.8-5
MCM32515 ................... 2.8-4
MCM32800 . . . • • . . . . . . . . . . . . .. 2.8-5
MCM36100 ...••.............. 2.8-5
MCM36104 ................... 2.8-5
MCM36200 . . . . . . . . . . . . . • . . . .. 2.8-5
MCM36204 ................... 2.8-5
MCM36400 . . . . . . . . . . . . . . . . . .. 2.8-5
MCM36404 . . • . . . . . . . . . . . . . . .. 2.8-5
MCM36800 ..•................ 2.8-5
MCM36804 ................... 2.8-5
MCM4L4100B ................ 2.8-6
MCM4L4100C ................ 2.8-6
MCM4L4400B ................ 2.8-6
MCM40100 ................... 2.8-5
MCM40200 . . . . . . . . . . . . . . . . . .. 2.8-5
MCM40400 ................... 2.8-5
MCM40420 . . . . . . . . . . . . . . . . . .. 2.8-5
Motorola Master Selection Guide
Device Index
Page
MCM40800 . . . . . . . . . . . . . . . . . ..
MCM417400 ..................
MCM44100B .................
MCM44100C .................
MCM44256 Series. . . . . . . . . . . ..
MCM44400B .................
MCM4464 Series. . . . . . . . . . . . ..
MCM5L4100A ................
MCM5L4100A-V ..............
MCM5L4260B ................
MCM5L4400A ................
MCM5L4400A-C . . . . . . . . . . . . ..
MCM5L4400A-V ........... . ..
MCM5L4800A ................
MCM5S4260B ................
MCM5V4800A ................
MCM51L1000A ...............
MCM51 L4256A ...............
MCM511000A ................
MCM514256A ................
MCM516400B ................
MCM517400B ................
MCM517400C ................
MCM517400CV ...............
MCM517405C ................
MCM517405CV ...............
MCM518160A ................
MCM518160B ................
MCM518165B ................
MCM518165BV ...............
MCM54100A .................
MCM54100A-C ...............
MCM54100A-V ...............
MCM54260B .................
MCM54260D .................
MCM54265D .................
MCM54400A .................
MCM54400A-C . . . . . . . . . . . . . ..
MCM54400A-V .. . . . . . . . . . . . ..
MCM54800A .................
MCM56824A .................
MCM62X308 .................
MCM6205D ..................
MCM6206BA .................
MCM62110 ...................
MCM6223 . . . . . . . . . . . . . . . . . . ..
MCM6226B . . . . . . . . . . . . . . . . . ..
MCM6226BA .................
MCM6226BB .................
MCM6227B . . . . . . . . . . . . . . . . . ..
MCM6229B . . . . . . . . . . . . . . . . . ..
MCM6229BA .................
MCM6229BB .................
MCM6246 . . . . . . . . . . . . . . . . . . ..
MCM6249 . . . . . . . . . . . . . . . . . . ..
MCM62973A .................
MCM62974A .................
MCM62975A .................
MCM62990A .................
MCM62995A .................
MCM62996 . . . . . . . . . . . . . . . . . ..
MCM63P532 .................
MCM6306D ..................
MCM6323 . . . . . . . . . . . . . . . . . . ..
MCM6326 . . . . . . . . . . . . . . . . . . ..
MCM64AF32 .................
MCM64AG32 .... . . . . . . . . . . . ..
7.1-5
2.8-5
2.8-6
2.8-6
2.8-6
2.8-4
2.8-6
2.8-4
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-6
2.8-2
2.8-2
2.8-3
2.8-3
2.3-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-2
2.8-2
2.8-2
2.8-2
2.8-3
2.8-3
2.8-2
2.8-3
2.8-3
2.8-3
2.8-4
2.8-4
Device Index
Page
MCM64PA32 .................
MCM64T100 ..................
MCM64T116 ..................
MCM64T216 ................ "
MCM64100 ...................
MCM64400 . . . . . . . . . . . . . . . . . ..
MCM67A618A ................
MCM67B518 .................
MCM67B618A ................
MCM67C518 .................
MCM67C618A ............. . ..
MCM67H518 .................
MCM67H618A .............. "
MCM67J518 ..................
MCM67J618A ................
MCM67M518 .................
MCM67M618A ................
MCM67Q709 .................
MCM67Q804 .................
MCM6706B ................. "
MCM6706BR .................
MCM6726B ................. "
MCM6726C ..................
MCM6729B . . . . . . . . . . . . . . . . . ..
MCM6729C ..................
MCM69F536A ................
MCM69P536A ................
MCM69P618A ................
MCM6926 .................. "
MCM6929 .................. "
MCM72BA32 .................
MCM72BA64 .................
MCM72BF64 .................
MCM72CB64 .................
MCM72JG64 .................
MCM81430 ...................
MCM84T430 ..................
MCM84000 . . . . . . . . . . . . . . . . . ..
MCM84430 ................. "
MCM91430 ...................
MCM94T430 ..................
MCM94000 . . . . . . . . . . . . . . . . . ..
MCM94430 . . . . . . . . . . . . . . . . . ..
MCR08BT1 ...................
MCR08DT1 ...................
MCR08MT1 ..................
MCR100-6 ...................
MCR10H ...................
MCR106-2 ...............••..
MCR106-3 .............•.....
MCR106-4 ..............•....
MCR106-6 ...................
MCR106-8 ...................
MCR12D .....................
MCR12LD .................. "
MCR12LM ....................
MCR12LN .................. "
MCR12M .....................
MCR12N .....................
MCR16D .....................
MCR16M .. , ................ "
MCR16N .....................
MCR218-10FP ...............
MCR218-4FP ................
MCR218-6FP ................
MCR216-8FP ................
MCR22-6 ....................
2.8-4
2.8-5
2.8-6
2.8-6
2.8-5
2.8-6
2.8-3
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-2
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-3
2.8-2
2.8-2
2.8-2
2.8-3
2.8-3
2.8-4
2.8-4
2.8-4
2.8-4
2.8-4
2.8-5
2.8-5
2.8-5
2.8-5
2.8-5
2.8-5
2.8-5
2.8-5
5.7-2
5.7-2
5.7-2
5.7-2
5.7-2
5.7-3
5.7-3
5.7-3
5.7-3
5.7-3
5.7-5
5.7-5
5.7-5
5.7-5
5.7-5
5.7-5
5.7-5
5.7-5
5.7-5
5.7-4
5.7-4
5.7-4
5.7-4
5.7-2
Device Index
Device Index
Device Index
Page
MCR22-8 .................... 5.7-2
MCR225-10FP ............... 5.7-6
MCR225--2FP ................ 5.7-6
MCR225-4FP ................ 5.7-6
MCR225-6FP ................ 5.7-6
MCR225-8FP ................ 5.7-6
MCR25D ..................... 5.7-5
MCR25M ..................... 5.7-5
MCR25N ..................... 5.7-5
MCR264-10 .................. 5.7-6
MCR264-4 ................... 5.7-6
MCR264-6 ................... 5.7-6
MCR264-8 ................... 5.7-6
MCR265--10 .................. 5.7-6
MCR265--4 ................... 5.7-6
MCR265-6 ................... 5.7-6
MCR265-8 ................... 5.7-6
MCR310-10 .................. 5.7--4
MCR310-3 ................... 5.7--4
MCR310--4 ................... 5.7--4
MCR310-6 ................... 5.7--4
MCR310-8 ................... 5.7--4
MCR69-2 .................... 5.7-6
MCR69-3 .................... 5.7-6
MCR69-6 .................... 5.7-6
MCR72-10 ................... 5.7-4
MCR72-2 .................... 5.7-4
MCR72-3 .................... 5.7--4
MCR72--4 .................... 5.7-4
MCR72-6 .................... 5.7-4
MCR72-8 .................... 5.7--4
MCR8D ...................... 5.7--4
MCR8M ...................... 5.7--4
MCR8N ...................... 5.7--4
MCR8SD ..................... 5.7--4
MCR8SM .................... 5.7--4
MCR8SN ..................... 5.7--4
MCT1458 .................... 4.1-3
MCT2 ........................ 5.8-6
MCT2E ...................... 5.8-6
MCT271 ..................... 5.8-6
MCT272 ..................... 5.8-6
MCT273 ..................... 5.8-6
MCT275 ..................... 5.8-6
MCT4558C ................... 4.1-3
MC10ELT20 ................. 3.1-39
MC10ELT21 ................. 3.1-38
MC10ELT22 ................. 3.1-38
MC10ELT24 ................. 3.1-39
MC10ELT25 ................. 3.1-38
MClOELT28 ................. 3.1-39
MC10ELOl .................. 3.1-27
MC10EL04 .................. 3.1-27
MC10EL05 .................. 3.1-27
MC10EL07 .................. 3.1-27
MC10ELll .................. 3.1-17
MC10El12 .................. 3.1-29
MC10EL15 .................. 3.1-17
MC10EL16 .................. 3.1-35
MC10EL31 .................. 3.1-23
MC10EL32 .................. 3.1-22
MC10EL33 .................. 3.1-22
MClOEL34 .................. 3.1-18
MC10EL35 .................. 3.1-24
MC10EL51 .................. 3.1-23
MC10EL52 .................. 3.1-23
MC10E157 .................. 3.1-31
Device Index
Device Index
MC10EL58 ..................
MC10EL89 ..................
MC10E016 ..................
MC10El0l ..................
MC10El04 ..................
MC10El07 ..................
MC10Elll ..................
MC10El12 ..................
MC10El16 ..................
MC10E122 ..................
MC10E131 ..................
MC10E136 ..................
MC10E137 ..................
MC10E141 ..................
MC10E142 ..................
MC10E143 ..................
MC10E150 ..................
MC10E151 ..................
MC10E154 ..................
MC10E155 ..................
MC10E156 ..................
MC10E157 ..................
MC10E158 ..................
MC10E160 ..................
MC10E163 ..................
MC10E164 ..................
MC10E1651 .................
MC10E1652 .................
MC10E166 ..................
MC10E167 ..................
MC10E171 ..................
MC10E175 ..................
MC10E193 ..................
MC10E195 ..................
MC10E196 ..................
MC10E197 ..................
MC10E211 ..................
MC10E212 ..................
MC10E241 ..................
MC10E256 ..................
MC10E336 ..................
MC10E337 ..................
MC10E404 ..................
MC10E411 ..................
MC10E416 ..................
MC10E431 ..................
MC10E445 ..................
MC10E446 ..................
MC10E451 ..................
MC10E452 ..................
MC10E457 ..................
MC10Hl00 ..................
MC10Hl0l ..................
MC10Hl02 ..................
MC10Hl03 ..................
MC10Hl04 ..................
MC10Hl05 ..................
MC10Hl06 ..................
MC10Hl07 ..................
MC10Hl09 ..................
MC10Hl13 ..................
MC10H115 ..................
MC10Hl16 ..................
MC10Hl17 ..................
MC10Hl18 ..................
MC10Hl19 ..................
MC10H121 ..................
7.1-6
Page
3.1-31
3.1-22
3.1-19
3.1-27
3.1-27
3.1-27
3.1-17
3.1-30
3.1-36
3.1-29
3.1-23
3.1-19
3.1-19
3.1-37
3.1-37
3.1-23
3.1-30
3.1-23
3.1-30
3.1-30
3.1-30
3.1-33
3.1-31
3.1-34
3.1-31
3.1-31
3.1-18
3.1-18
3.1-18
3.1-23
3.1-31
3.1-30
3.1-34
3.1-35
3.1-35
3.1-31
3.1-17
3.1-36
3.1-37
3.1-30
3.1-14
3.1-15
3.1-27
3.1-17
3.1-36
3.1-23
3.1-19
3.1-19
3.1-23
3.1-23
3.1-33
3.1-28
3.1-27
3.1-28
3.1-29
3.1-26
3.1-27
3.1-28
3.1-27
3.1-27
3.1-28
3.1-36
3.1-36
3.1-27
3.1-27
3.1-27
3.1-27
Device Index
Page
MC10H123 .................. 3.1-17
MC10H124 .................. 3.1-38
MC10H125 .................. 3.1-38
MC10H130 .................. 3.1-30
MC10H131 .................. 3.1-24
MC10H135 .................. 3.1-23
MC10H136 .................. 3.1-21
MC10H141 .................. 3.1-37
MC10H145 .................. 3.1-36
MC10H158 .................. 3.1-33
MC10H159 .................. 3.1-33
MC10H16 ................... 3.1-19
MC10H160 .................. 3.1-34
MC10H161 .................. 3.1-21
MC10H162 .................. 3.1-21
MC10H164 .................. 3.1-32
MC10H165 .................. 3.1-22
MC10H166 .................. 3.1-18
MC10H171 .................. 3.1-21
MClOH172 .................. 3.1-21
MC10H173 .................. 3.1-32
MC10H174 .................. 3.1-32
MC10H175 .................. 3.1-31
MC10H176 .................. 3.1-24
MC10H179 .................. 3.1-14
MC10H180 .................. 3.1-14
MC10H181 .................. 3.1-14
MC10H186 .................. 3.1-24
MC10H188 .................. 3.1-29
MC10H189 .................. 3.1-29
MC10H209 .................. 3.1-27
MC10H210 .................. 3.1-28
MC10H211 .................. 3.1-28
MC10H330 .................. 3.1-17
MC10H332 .................. 3.1-15
MClOH334 .................. 3.1-17
MC10H350 .................. 3.1-38
MC10H351 .................. 3.1-38
MC10H352 .................. 3.1-38
MC10H423 .................. 3.1-17
MC10H424 .................. 3.1-38
MClOH600 .................. 3.1-38
MC10H601 .................. 3.1-38
MC10H602 .................. 3.1-38
MC10H603 .................. 3.1-38
MC10H604 .................. 3.1-38
MC10H605 .................. 3.1-38
MC10H606 .................. 3.1-39
MC10H607 .................. 3.1-38
MC10H640 .................. 3.1-17
MC10H641 .................. 3.1-18
MC10H642 .................. 3.1-17
MC10H643 .................. 3.1-18
MC10H644 .................. 3.1-17
MC10H645 .................. 3.1-17
MClOH646 .................. 3.1-18
MC10H660 .................. 3.1-31
MC10H680 .................. 3.1-38
MC10H681 .................. 3.1-38
MC10SXl130 ......... 3.1-18,3.1-22
MC10SXl189 ................ 3.1-18
MC100ELT20 ................ 3.1-39
MC100ELT21 ................ 3.1-38
MC100ELT22 ................ 3.1-38
MC100ELT23 ................ 3.1-38
MC100ELT24 ................ 3.1-39
MC100ELT25 ................ 3.1-38
Motorola Master Selection Guide
Device Index
Device Index
Page
Device Index
Page
MC100ELT28 ................
MC100ELOl .................
MC100EL04 .................
MC100EL05 .................
MC100EL07 .................
MC100EL11 .................
MC100EL12 .................
MC100EL13 .................
MC100EL14 .................
MC100EL15 .................
MC100EL16 .................
MC100EL17 .................
MC100EL29 .................
MC100EL30 .................
MC100EL31 .................
MC100EL32 .................
MC100EL33 .................
MC100EL34 .................
MC100EL35 .................
MC100EL38 .................
MC100EL39 .................
MC100EL51 .................
MC100El52 .................
MC100El56 .................
MC100EL57 .................
MC100EL58 .................
MC100EL59 .................
MC100EL90 .................
MC100E016 .................
MC100El01 .................
MC100E104 .................
MC100E107 .................
MC100E111 ........ : ........
MC100E112 .................
MC100El16 .................
MC100E122 .................
MC100E131 .................
MC100E136 .................
MC100E137 .................
MC100E141 .................
MC100E142 .................
MC100E143 .................
MC100E150 .................
MC100E151 .................
MC100E154 .................
MC100E155 .................
MC100E156 .................
MC100E157 .................
MC100E158 .................
MC100E160 .................
MC100E163 .................
MC100El64 .................
MC100E166 .................
MC100E167 .................
MC100E171 .................
MC100E175 .................
MC100E193 .................
MC100E195 .................
MC100E196 .................
MC100E210 .................
MC100E211 .................
MC100E212 .................
MC100E241 .................
MC100E256 .................
MC100E310 .................
MC100E336 .................
MC100E337 .................
3.1-39
3.1-27
3.1-27
3.1-27
3.1-27
3.1-17
3.1-29
3.1-14
3.1-17
3.1-17
3.1-35
3.1-35
3.1-23
3.1-25
3.1-23
3.1-22
3.1-22
3.1-18
3.1-24
3.1-18
3.1-18
3.1-23
3.1-23
3.1-32
3.1-31
3.1-31
3.1-33
3.1-39
3.1-19
3.1-27
3.1-27
3.1-27
3.1-17
3.1-30
3.1-36
3.1-29
3.1-23
3.1-19
3.1-19
3.1-37
3.1-37
3.1-23
3.1-30
3.1-23
3.1-30
3.1-30
3.1-30
3.1-33
3.1-31
3.1-34
3.1-31
3.1-31
3.1-18
3.1-23
3.1-31
3.1-30
3.1-34
3.1-35
3.1-35
3.1-14
3.1-17
3.1-36
3.1-37
3.1-30
3.1-14
3.1-14
3.1-15
MC100E404 .................
MC100E416 .................
MC100E431 .................
MC100E445 .................
MC100E446 .................
MC100E451 .................
MC100E452 .................
MC100E457 .................
MC100H600 .................
MC100H601 .................
MC100H602 .................
MC100H603 .................
MC100H604 .................
MC100H605 .................
MC100H606 .................
MC100H607 .................
MC100H640 .................
MC100H641 .................
MC100H642 .................
MC100H643 .................
MC100H644 .................
MC100H646 .................
MC100H660 .................
MC100H680 .................
MC100H681 .................
MC100LVEL11 ...............
MC100LVEL13 ...............
MC100LVEL14 ...............
MC100LVEL17 ...............
MC100LVEL29 ...............
MC100LVEL30 ...............
MC100LVEL38 ...............
MC100LVEL39 ...............
MC100LVEL56 ...............
MC100LVEL59 ...............
MC100LVEL90 ...............
MC100LVEL92 ...............
MC100LVE111 ...............
MC100LVE164 ...............
MC100LVE210 ...............
MC100LVE310 ...............
MC100SX1230 ...............
MC10100 ...................
MC10101 ...................
MC10102 ...................
MC10103 ...................
MC10104 ...................
MC10105 ...................
MC10106 ...................
MC10l07 ...................
MC10l09 ...................
MC10l10 ....................
MC10lll ....................
MC10113 ....................
MC10114 ....................
MC10115 ....................
MC10116 ....................
MC10117 ....................
MC10118 ....................
MC10119 ....................
MC10121 ...................
MC10123 ...................
MC10124 ...................
MC10125 ...................
MC10128 ...................
MC10129 ...................
MC10130 ...................
3.1-27
3.1-36
3.1-23
3.1-19
3.1-19
3.1-23
3.1-23
3.1-33
3.1-38
3.1-38
3.1-38
3.1-38
3.1-38
3.1-38
3.1-39
3.1-38
3.1-17
3.1-18
3.1-17
3.1-18
3.1-17
3.1-18
3.1-31
3.1-38
3.1-38
3.1-14
3.1-14
3.1-17
3.1-35
3.1-23
3.1-25
3.1-18
3.1-18
3.1-32
3.1-33
3.1-39
3.1-39
3.1-17
3.1-32
3.1-14
3.1-14
3.1-22
3.1-28
3.1-27
3.1-28
3.1-29
3.1-26
3.1-27
3.1-28
3.1-27
3.1-27
3.1-28
3.1-28
3.1-28
3.1-36
3.1-36
3.1-36
3.1-27
3.1-27
3.1-27
3.1-27
3.1-17
3.1-38
3.1-38
3.1-15
3.1-35
3.1-30
Motorola Master Selection Guide
7.1-7
Device Index
Page
MC10131 ................... 3.1-24
MC10132 ................... 3.1-32
MC10133 ................... 3.1-31
MC10134 ................... 3.1-32
MC10135 ................... 3.1-23
MC10136 ................... 3.1-21
MC10137 ................... 3.1-20
MC10138 ................... 3.1-19
MC10141 ................... 3.1-37
MC10153 ................... 3.1-31
MC10154 .................... 3.1-19
MC10158 ................... 3.1-32
MC10159 ................... 3.1-32
MC10160 ................... 3.1-34
MC10161 ................... 3.1-21
MC10162 ................... 3.1-21
MC10163 ................... 3.1-22
MC10164 ................... 3.1-32
MC10165 ................... 3.1-22
MC10166 ................... 3.1-18
MC10168 ................... 3.1-31
MC10170 ................... 3.1-34
MC10171 ................... 3.1-21
MC10172 ................... 3.1-21
MC10173 ................... 3.1-33
MC10174 ................... 3.1-32
MC10175 ................... 3.1-31
MC10176 ................... 3.1-24
MC10177 ................... 3.1-39
MC10178 ................... 3.1-19
MC10180 ................... 3.1-14
MC10181 ................... 3.1-14
MC10186 ................... 3.1-24
MC10188 ................... 3.1-29
MC10189 ................... 3.1-29
MC10190 ................... 3.1-38
MC10191 ................... 3.1-38
MC10192 ................... 3.1-17
MC10193 ................... 3.1-22
MC10195 ................... 3.1-29
MC10197 ................... 3.1-25
MC10198 ................... 3.1-33
MC10210 ................... 3.1-28
MC10211 .................... 3.1-28
MC10212 ................... 3.1-27
MC10216 ................... 3.1-35
MC10231 ................... 3.1-24
MC10319 .............. 4.5-2, 4.8-4
MC10804 ................... 3.1-38
MC10805 ................... 3.1-38
MC12002 ............ 3.1-21,4.7-37
MC12009 ............ 3.1-35,4.7-37
MC12011 ............. 3.1-35,4.7-37
MC12013 ............ 3.1-35,4.7-37
MC12014 ............ 3.1-20,4.7-37
MC12015 ............ 3.1-35,4.7-37
MC12016 ............ 3.1-35,4.7-37
MC12017 ............ 3.1-35,4.7-37
MC12018 ............ 3.1-35,4.7-37
MC12019 ............ 3.1-35,4.7-37
MC12022A ........... 3.1-34,4.7-37
MC12022B ........... 3.1-34,4.7-37
MC12022LVA ......... 3.1-34,4.7-38
MC12022LVB ......... 3.1-34,4.7-38
MC12022SLA ......... 3.1-34,4.7-38
MC12022SLB ......... 3.1-34,4.7-38
MC12022TSA ......... 3.1-34,4.7-38
Device Index
Device Index
Device Index
Page
MC12022TS8 ......... 3.1-34,4.7-38
MC12022TVA ......... 3.1-35,4.7-38
MC12022TV8 ......... 3.1-35,4.7-38
MC12023 ............ 3.1-35,4.7-38
MC12025 ............ 3.1-35,4.7-38
MC12026A ........... 3.1-34,4.7-38
MC120268 ........... 3.1-34,4.7-38
MC12028A ........... 3.1-34,4.7-38
MC120288 ........... 3.1-34,4.7-38
MC12031A ........... 3.1-35,4.7-38
MC120318 ........... 3.1-35,4.7-38
MC12032A ........... 3.1-35,4.7-38
MC120328 ........... 3.1-35,4.7-38
MC12033A ........... 3.1-35,4.7-38
MC120338 ........... 3.1-35,4.7-38
MC12034A ........... 3.1-35,4.7-38
MC120348 ........... 3.1-35,4.7-38
MC12036A ........... 3.1-34,4.7-38
MC120368 ........... 3.1-34,4.7-38
MC12038A .................. 3.1-34
MC12040 ............ 3.1-22,4.7-38
MC12052A .................. 3.1-35
MC12053A .................. 3.1-35
MC12054A .................. 3.1-35
MC12058 ................... 3.1-34
MC12061 ............ 3.1-34,4.7-38
MC12073 ............ 3.1-34,4.7-38
MC12074 ............ 3.1-34,4.7-38
MC12075 ................... 3.1-35
MC12076 ............ 3.1-35,4.7-38
MC12078 ............ 3.1-35,4.7-38
MC12079 ............ 3.1-35,4.7-38
MC12080 ............ 3.1-34,4.7-38
MC12083 ............ 3.1-34,4.7-38
MC12089 ............ 3.1-35,4.7-38
MC12090 ............ 3.1-35,4.7-38
MC12093 ................... 3.1-34
MC12095 ................... 3.1-35
MC12100 ............ 3.1-33,4.7-38
MC12101 ............ 3.1-33,4.7-38
MC12147 ................... 3.1-39
MC12148 ............ 3.1-34,4.7-38
MC12149 ................... 3.1-39
MC12179 ................... 3.1-38
MC12202 ................... 3.1-38
MC12206 ................... 3.1-38
MC12210 ................... 3.1-38
MC12429 ................... 3.1-18
MC12439 ................... 3.1-18
MC13020 .................... 4.8-2
MC13022 .................... 4.8-2
MC13022A ................... 4.8-2
MC13024 .................... 4.8-2
MCl3025 .................... 4.8-2
MC13027 .................... 4.8-2
MC13028A ................... 4.8-2
MC13029A ................... 4.8-2
MC13030 .................... 4.8-2
MC13035 .................... 4.8-2
MC13037 .................... 4.8-2
MC13055 .................... 4.7-2
MC13060 ............. 4.7-34,4.8-2
MC13077 ...... , ....... 4.8-3, 4.8-5,
4.8-18,4.8-24
MC13077DW ................ 4.8-24
MC13077P .................. 4.8-24
MC13081X ................... 4.8-4
Device Index
Device Index
Page
MC13109 .............. 4.7-3,4.7-4
MC13109F8 .................. 4.7-4
MC13109FTA ................. 4.7-4
MC13110 ............... 4.7-3,4.7-5
MC13110F8 .................. 4.7-5
MC13111 ..................... 4.7-3
MC13122 .................... 4.8-2
MC13135 .............. 4.7-3,4.7-6
MC13135DW ................. 4.7-6
MC13135P ................... 4.7-6
MC13136 .................... 4.7-3
MC13136DW ................. 4.7-6
MC13136P ................... 4.7-6
MC13150 .............. 4.7-2,4.7-7
MC13150FTA ................. 4.7-7
MC13150FT8 ................. 4.7-7
MC13155 .................... 4.7-2
MC13156 .............. 4.7-2,4.7-8
MC13156DW ................. 4.7-8
MC13156F8 .................. 4.7-8
MC13158 .................... 4.7-2
MC13158FT8 ................. 4.7-9
MC13173 .................... 4.7-4
MC13175 ............. 4.7-3,4.7-10
MC13175D .................. 4.7-10
MC13176 ............. 4.7-3,4.7-10
MC13176D .................. 4.7-10
MC1350 . . . . . . . . . . . . . . .. 4.1-5, 4.8-3
MC1350D .................... 4.1-5
MCl357 ...................... 4.8-4
MC1374 ............... 4.8-4,4.8-18
MC1377 . . . . . . . . . . . . . . . . . . . . .. 4.8-3
MC1378 ...................... 4.8-3
MC1391 ........ " ............ 4.8-3
MC14C888 ................... 4.6-7
MC14C89A8 ................. 4.6-7
MC14C89A8 ................. 4.6-7
MC14C898 ................... 4.6-7
MC14C898 ................... 4.6-7
MC14LC5472 ................ 4.7-15
MC14LC5494EVK ............ 4.7-17
MC14LC5540 .. 4.7-13,4.7-14,4.7-1.5
MC14LC5540DW ............ 4.7-13
MC14LC5540FU ............. 4.7-13
MC14LC5540P .............. 4.7-13
MC14000U8 ................. 3.1-28
MC140018 .................. 3.1-28
MC14001U8 ................. 3.1-28
MC140028 .................. 3.1-28
MC14002U8 ................. 3.1-28
MC140068 .................. 3.1-36
MC14007U8 ................. 3.1-29
MC140088 .................. 3.1-14
MC140118 .................. 3.1-26
MC14011U8 ................. 3.1-26
MC140128 .................. 3.1-25
MC14012U8 ................. 3.1-25
MC140138 .................. 3.1-23
MC140148 .................. 3.1-37
MC140158 .................. 3.1-37
MC140168 .................. 3.1-33
MC140178 .................. 3.1-20
MC140188 .................. 3.1-20
MC140208 .................. 3.1-19
MC140218 .................. 3.1-37
MC140228 .................. 3.1-20
MC140238 .................. 3.1-26
7.1-8
Device Index
Page
MC14023U8 ................. 3.1-26
MC140248 .................. 3.1-19
MC140258 .................. 3.1-28
MC14025U8 ................. 3.1-28
MC140278 .................. 3.1-23
MC140288 .................. 3.1-21
MC140298 .................. 3.1-20
MC1403 ...................... 4.4-2
MC1403A .................... 4.4-2
MC140358 .................. 3.1-37
MC140388 .................. 3.1-14
MC1404Pl0 .................. 4.4-2
MC1404P5 ................... 4.4-2
MCl404P6 ................... 4.4-2
MCl40408 .................. 3.1-19
MC140428 .................. 3.1-31
MC140438 .................. 3.1-31
MC140448 .................. 3.1-31
MC140468 .................. 3.1-34
MC140498 .................. 3.1-29
MC14049U8 ................. 3.1-29
MC140508 .................. 3.1-29
MC140518 .................. 3.1-31
MC140528 .................. 3.1-32
MC140538 .................. 3.1-33
MC140608 .................. 3.1-19
MC140668 .................. 3.1-33
MC140678 .................. 3.1-31
MC140688 .................. 3.1-25
MC14069U8 ................. 3.1-29
MC140708 .................. 3.1-28
MC140718 .................. 3.1-29
MC140728 .................. 3.1-28
MC140738 .................. 3.1~26
MC140758 .................. 3.1-29
MC140768 .................. 3.1-25
MC140778 .................. 3.1-27
MC140788 .................. 3.1-28
MC140818 .................. 3.1-26
MC140828 .................. 3.1-25
MC140938 .................. 3.1-36
MC140948 .................. 3.1-37
MC140998 .................. 3.1-30
MC141068 .................. 3.1-36
MC1413 ...................... 4.6-8
MC14138 .................... 4.6-8
MC1416 ...................... 4.6-8
MC14168 .................... 4.6-8
MC141618 .................. 3.1-19
MC141620 ............. 4.8-3, 4.8~,
4.8-9,4.8-18
MC141621 .................. 4.8-13
MC141621A ............ 4.8-3,4.8-5,
4.8-9,4.8-18
MC141621F8 ................ 4.8-13
MC141622 ............. 4.8-3,4.8-5,
4.8-9,4.8-18
MC141622FU ................ 4.8-14
MC141624 ............. 4.8-3,4.8-5,
4.8-9,4.8-18
MC141627 ............. 4.8-3,4.8-5,
4.8-9,4.8-18
MC141638 .................. 3.1-19
MC141748 .................. 3.1-24
MC141758 .................. 3.1-25
MC141948 .................. 3.1-37
MC143120 ................... 2.7-2
Motorola Master Selection Guide
Device Index
Device Index
Page
MC143120B1DW .............. 2.7-3
MC143120DW ................ 2.7-3
MC143120E2DW .............. 2.7-3
MC143150 ................... 2.7-3
MC143150B1FU .............. 2.7-3
MC143150B1FUl ............. 2.7-3
MC143150FU ................. 2.7-3
MC143150FUl ................ 2.7-3
MC1436 ...................... 4.1-2
MC1436C .................... 4.1-2
MCl44110 ................... 4.5-3
MCl44111 .................... 4.5-3
MC144112 ................... 4.5-3
MC144143 ....... 4.8--4,4.8-5,4.8-9,
4.8-15,4.8-18
MC144143P ................. 4.8-15
MC144144 ....... 4.8--4,4.8-5,4.8-9,
4.8-16,4.8-18
MC144144P ................. 4.8-16
MC14415 ................... 3.1-34
MC14433 .................... 4.5-2
MC14443 .................... 4.5-2
MC14447 .................... 4.5-2
MC14467-1 ................. 4.10--3
MC14468 ................... 4.10--3
MCl4470 ................... 4.10--3
MCl4489 .................... 4.6-9
MC14490 ................... 3.1-14
MCl4495-1 .................. 4.6-9
MCl4499 .................... 4.6-9
MC14500B .................. 3.1-29
MC145000 ................... 4.6-9
MC145001 .......
. ... 4.6-9
MC14501UB ................. 3.1-27
MC145010 .................. 4.10-3
MC145011 .................. 4.10-3
MC145012 .................. 4.10-3
MC145013 .................. 4.10-3
MC145017 .................. 4.10-3
MC145018 .................. 4.10-3
MC14502B .................. 3.1-30
MC14503B .................. 3.1-15
MC14504B .................. 3.1-38
MC145040 ................... 4.5-2
MC145041 ................... 4.5-2
MC145050 ................... 4.5-2
MC145051 ................... 4.5-2
MC145053 ................... 4.5-2
MC14506UB ................. 3.1-27
MC145073 ............. 4.5-2,4.8-5
MC145074 ...... 4.5-3,4.8-5,4.8-18
MC145076 ...... 4.5-3,4.8-5,4.8-18
MC14508B .................. 3.1-30
MC14510B .................. 3.1-20
MC14511B ............ 3.1-22,4.6-9
MC14512B .................. 3.1-31
MC14513B ............ 3.1-22,4.6-9
MC14514B .................. 3.1-21
MC14515B .................. 3.1-21
MC14516B .................. 3.1-20
MC14517B .................. 3.1-37
MC14518B .................. 3.1-20
MC14519B .................. 3.1-27
MC14520B .................. 3.1-20
MC14521B .................. 3.1-34
MC14522B .................. 3.1-20
MC14526B .................. 3.1-20
Motorola Master Selection Guide
Device Index
Page
MC14527B .................. 3.1-14
MC14528B .................. 3.1-33
MC14529B .................. 3.1-32
MC14530B .................. 3.1-27
MC14531B .................. 3.1-34
MC14532B .................. 3.1-22
MC14534B .................. 3.1-19
MC14536B .................. 3.1-34
MC14538B .................. 3.1-33
MC14539B .................. 3.1-32
MC145403 ................... 4.6-8
MC145404 ................... 4.6-8
MC145405 ................... 4.6-8
MC145406 ............ 4.6-8,4.7-15
MC145407 ............ 4.6-8,4.7-15
MC145408 ................... 4.6-8
MC14541B .................. 3.1-34
MC145421 . . ............... 4.7-12
MC145421DW ............... 4.7-19
MC145421P ................. 4.7-19
MC145422 .... 4.7-12,4.7-18,4.7-19
MC145422DW ............... 4.7-18
MC145422P ................. 4.7-18
MC145425 .................. 4.7-12
MC145425DW ............... 4.7-19
MC145425P ................. 4.7-19
MC145426 .... 4.7-12,4.7-18,4.7-19
MC145426DW ............... 4.7-18
MC145426P ................. 4.7-18
MC14543B ............ 3.1-22,4.6-9
MC145436A ................. 4.7-15
MC145436AP ................ 4.7-15
MC145436DW ............... 4.7-15
MC14544B ............ 3.1-22,4.6-9
MC145442DW ............... 4.7-31
MC145442P ................. 4.7-31
MC145443DW ............... 4.7-31
MC145443P ................. 4.7-31
MC145444DW ............... 4.7-31
MC145444 .................. 4.7-31
MC145446AFW .............. 4.7-31
MC145447 .................. 4.7-32
MC145447DW ............... 4.7-32
MC145447P ................. 4.7-32
MC145453 ................... 4.6-9
MC145460EVK .............. 4.7-32
MC14547B ............ 3.1-22,4.6-9
MC145472 .................. 4.7-12
MC145474 .... 4.7-12,4.7-15,4.7-17
MC145475 .... 4.7-12,4.7-15,4.7-17
MC145480 .... 4.7-12,4.7-15,4.7-31
MC145480DW ............... 4.7-12
MC145480P ................. 4.7-12
MC145480SD ................ 4.7-12
MC145488 ........... 4.7-15,4.7-17
MC145488FN ................ 4.7-17
MC14549B ............ 3.1-38,4.5-2
MC1455BPl ................. 4.10--2
MC1455D ................... 4.10-2
MC1455D ................... 4.10-2
MC1455Pl .................. 4.10--2
MC145500 .... 4.7-12,4.7-15,4.7-18
MC145502 ................. 4.7-12
MC145503 .................. 4.7-12
MC145505 .................. 4.7-12
MC14551B .................. 3.1-32
MC14553B .................. 3.1-19
7.1-9
Device Index
Page
MC145532 .... 4.7-12,4.7-15,4.7-31
MCf45532DW ............... 4.7-31
MC145532L ................. 4.7-31
MC145536 .................. 4.7-31
MC145536EVK ....... 4.7-14,4.7-15
MC145537EVK .............. 4.7-14
MC14555B .................. 3.1-21
MC145554 .................. 4.7-12
MC145557 .................. 4.7-12
MC14556B .................. 3.1-21
MC145564 .................. 4.7-12
MC145567 .................. 4.7-12
MC14557B .................. 3.1-36
MC145572 ........... 4.7-15,4.7-16
MC145572EVK .............. 4.7-17
MC145572FN ................ 4.7-16
MC145572PB ................ 4.7-16
MC145S74 ........... 4.7-15,4.7-16
MC145574DW ............... 4.7-16
MC145574PB ................ 4.7-16
MC14558B ............ 3.1-22,4.6-9
MC145583 ................... 4.6-8
MC14559B ............ 3.1-38,4.5-2
MC14560B .................. 3.1-14
MC14561B .................. 3.1-14
MC14562B .................. 3.1-36
MC14566B .................. 3.1-20
MC14568B .................. 3.1-20
MC14569B .................. 3.1-20
MC145705 ................... 4.6-8
MC145706 ................... 4.6-8
MC145707 ................... 4.6-8
MC14572UB ................. 3.1-27
MC14573 .................... 4.1-6
MC14574 .................... 4.1-7
MC14575 .............. 4.1-6,4.1-7
MC14576B ................... 4.1-6
MC14576C ............. 4.1-6,4.8--4
MC14577B ................... 4.1-6
MC14577C ............ 4.1-6,4.8--4
MC14578 ............. 4.1-7,4.10-3
MC1458 ...................... 4.1-3
MC1458C .................... 4.1-3
MC14580B .................. 3.1-36
MC14583B .................. 3.1-36
MC14584B .................. 3.1-36
MC14585B .................. 3.1-18
MC14598B .................. 3.1-30
MC14599B .................. 3.1-30
MC14618 ................... 2.6-11
MC146805E2 ................ 2.6-11
MC146818A ................. 2.6-11
MC146823 .................. 2.6-11
MC1488 ...................... 4.6-7
MC1489 ...................... 4.6-7
MC1489A .................... 4.6-7
MC1490 ...................... 4.1-5
MC1494P ................... 4.10--2
MC1495BP .................. 4.10-2
MC1495D ................... 4.10-2
MC1495P ................... 4.10--2
MC1496 ...................... 4.7-4
MC1648 ..................... 3.1-34
MC1650 ..................... 3.1-19
MC1651 ..................... 3.1-19
MC1658 ..................... 3.1-34
MC1660 ..................... 3.1-27
Device Index
Device Index
Device Index
Page
MCl662 ..................... 3.1-28
MC1670 ..................... 3.1-24
MC1672 ..................... 3.1-28
MC1692 ..................... 3.1-36
MC1723C .................... 4.2-4
MC1741C .................... 4.1-2
MCl776C .................... 4.1-2
MC26LS30 ................... 4.6-7
MC26LS31 ................... 4.6-7
MC2681 ..................... 2.2-14
MC2833 ...................... 4.7-3
MC3301 ...................... 4.1-4
MC3302 ...................... .4.1-7
MC33023 ................... 4.2-10
MC33025 ................... 4.2-12
MC3303 ....................... 4.1-4
MC33030DW ................. 4.3-8
MC33030P ................... 4.3-8
MC33033 ........ 4.3-4,4.3-5,4.3-7
MC33033DW ................. 4.3-5
MC33033P ................... 4.3-5
MC33034 .............. 4.3-5, 4.3-6
MC33035 .. 4.3-4,4.3-5,4.3-6,4.3-7
MC33035DW ................. 4.3-6
MC33035P ................... 4.3-6
MC33039 .................... 4.3-7
MC33039D ................... 4.3-7
MC33039P ................... 4.3-7
MC33060A ................... 4.2-9
MC33063A .................. 4.2-11
MC33064 ................... 4.2-19
MC33064D-5 ................ 4.2-19
MC33064P-5 .. .. .. .. .. .. .... 4.2-19
MC33065 ................... 4.2-15
MC33066 ................... 4.2-12
MC33067 ................... 4.2-12
MC33071 .................... 4.1-2
MC33071A ................... 4.1-2
MC33072 .................... 4.1-3
MC33072A ................... 4.1-3
MC33074 .................... 4.1-4
MC33074A ................... 4.1-4
MC33076 .................... 4.1-3
MC33077 .................... 4.1-3
MC33078 .................... 4.1-3
MC33079 .................... 4.1-5
MC33091A ................... 4.9-3
MC33091AD .................. 4.9-7
MC33091AP .................. 4.9-7
MC33092 .................... 4.9-2
MC33092DW ................ 4.9-11
MC33093 .................... 4.9-2
MC33094 .................... 4.9-2
MC33095 .................... 4.9-3
MC33102 .................... 4.1-3
MC33110 .................... 4.7-35
MC33111 .................... 4.7-35
MC33120 ............ 4.7-11,4.7-12,
4.7-15,4.7-34
MC33120 FN ................ 4.7-11
MC33120P .................. 4.7-11
MC33121 ............ 4.7-11,4.7-34
MC33121FN ................. 4.7-11
MC33121P .................. 4.7-11
MC33128 .............. 4.2-5,4.2-7
MC33128D ................... 4.2-7
MC33129 .................... 4.2-9
Device Index
Device Index
Page
MC33151D .................. 4.2-25
MC33151P .................. 4.2-25
MC33152D .................. 4.2-25
MC33152P .................. 4.2-25
MC33153 ................... 4.2~25
MC33153D .................. 4.2-25
MC33153P .................. 4.2-25
MC33160 .............. 4.2-2, 4.2-5
MC33160DW ................. 4.2-6
MC33160P ................... 4.2-6
MC33161 ................... 4.2-20
MC33161D .................. 4.2-20
MC33161P .................. 4.2-20
MC33163 ................... 4.2-11
MC33164 ................... 4.2-19
MC33164D-3 ................ 4.2-19
MC33164D-5 ................ 4.2-19
MC33164P-3 ................ 4.2-19
MC33164P-5 ................ 4.2-19
MC33166 ................... 4.2-11
MC33167 ................... 4.2-11
MC33169 .............. 4.2-5,4.2-7
MC33169DTB ................ 4.2-7
MC33171 .................... 4.1-2
MC33172 .................. :. 4.1-3
MC33174 .................... 4.1-5
MC33178 .................... 4.1-3
MC33179 .................... 4.1-5
MC33181 .................... 4.1-2
MC33182 .................... 4.1-3
MC33184 .................... 4.1-5
MC3319 ...................... 4.9-8
MC33192 .................... 4.9-3
MC33192DW ................. 4.9-8
MC33193 .............. 4.9-3,4.9-8
MC33193D ................... 4.9-8
MC33193P ................... 4.9-8
MC33197 .............. 4.9-3,4.9-9
MC33197D ................... 4.9-9
MC33197P ................... 4.9-9
MC33199 ............. 4.9-3,4.9-10
MC33199D .................. 4.9-10
MC33201 .................... 4.1-2
MC33202 .................... 4.1-4
MC33204 .................... 4.1-5
MC33206 .................... 4.1-4
MC33207 .................... 4.1-5
MC33218A .... 4.7-27,4.7-29,4.7-34
MC33218AP ................. 4.7-27
MC33218DW ................ 4.7-27
MC33219A .... 4.7-28,4.7-29,4.7-34
MC33219ADW ............... 4.7-28
MC33219AP ................. 4.7-28
MC33261 ................... 4.2-15
MC33262 ............ 4.2-15,4.2-16
MC33262D .................. 4.2-16
MC33262P .................. 4.2-16
MC33267 ........ 4.2-2, 4.2-3, 4.2-5,
4.2-6, 4.9-2
MC33267T ................... 4.2-6
MC33267TV .................. 4.2-6
MC33269 .............. 4.2-5, 4.9-2
MC33269-XX . . . . . . . . . .. 4.2-2, 4.2-3
MC33272A ................... 4.1-3
MC33274A ................... 4.1-5
MC33282 .................... 4.1-3
MC33284 .................... 4.1-5
7.1-10
Device Index
Page
MC33293 .................... 4.9-3
MC33293T ................... 4.9-4
MC33293TV .. .. .. .. .. .. .. .... 4.9-4
MC33298 .............. 4.9-3, 4.9-5
MC33298DW ................. 4.9-5
MC33298P ................... 4.9-5
MC33304 .................... 4.1-5
MC3334 ...................... 4.9-2
MC33340D .................. 4.2-21
MC33341 ................... 4.2-22
MC33341 D .................. 4.2-22
MC33341 P .................. 4.2-22
MC33344DW ................ 4.2-23
MC33345DTB ............... 4.2-24
MC3335 ...................... 4.7-3
MC33362 ............ 4.2-11,4.2-13
MC33362DW ................ 4.2-13
MC33363 ................... 4.2-14
MC33363DW ................ 4.2-14
MC33368 ............ 4.2-15, 4.2-17
MC33368D .................. 4.2-17
MC3346 .. .. .. .. .. .. .. .. .. .... 4.8-4
MC3356 ...................... 4.7-2
MC3357 ...................... 4.7-2
MC3358 . . . .. . . .. .. . . . .. . . .... 4.1-3
MC3359 ...................... 4.7-2
MC3361C .................... 4.7-2
MC3362 ...................... 4.7-3
MC3363 ...................... 4.7-3
MC3371 ...................... 4.7-2
MC3372 . .. . .. .. . .. . .. . . .. .. .. 4.7-2
MC3372A .................... 4.7-2
MC3392 .. . .. .. . . .. .. ... 4.9-3, 4.9-6
MC3392DW .................. 4.9-6
MC3392T .................... 4.9-6
MC3392T-1 .................. 4.9-6
MC3399 .. . .. . . .. .. .. . .. .. .... 4.9-3
MC3399DW .................. 4.3-4
MC3399T .................... 4.3-4
MC34001 .................... 4.1-2
MC34001B ................... 4.1-2
MC34002 .................... 4.1-3
MC34002B ................... 4.1-3
MC34004 .................... 4.1-4
MC34004B ................... 4.1-4
MC34010 .......•.... 4.7-19,4.7-34
MC34010FN ................. 4.7-19
MC34010P .................. 4.7-19
MC34012 ................... 4.7-20
MC34012-1 .......... 4.7-20,4.7-34
MC34012-2 .......... 4.7-20,4.7-34
MC34012-3 .......... 4.7-20,4.7-34
MC34012D .................. 4.7-20
MC34012P .................. 4.7-20
MC34014 ................... 4.7-34
MC34016 ................... 4.7-34
MC34016DW ................ 4.7-22
MC34016P .................. 4.7-22
MC34017 ................... 4.7~20.
MC34017-1 .......... 4.7-20,4.7-34
MC34017-2 .......... 4.7-20,4.7-34
MC34017-3 .......... 4.7-20,4.7-34
MC34017D .................. 4.7-20
MC34017P .................. 4.7-20
MC34018 ..... 4.7-25,4.7-29,4.7-34
MC34018DW ................ 4.7-25
MC34018P .................. 4.7-25
Motorola Master Selection Guide
Device Index
Device Index
Page
MC34023 ................... 4.2-10
MC34025 ................... 4.2-12
MC3403 . . . . . . . . . . . . . . . . . . . . .. 4.1-4
MC3405 ................ 4.1-6,4.1-7
MC34050 .................... 4.6--7
MC34051 .................... 4.6--7
MC34055 .................... 4.6--8
MC34055DW ................. 4.6--3
MC34058 .............. 4.6-4,4.6--7
MC34058FTA . . . . . . . . . . . . . . . .. 4.6-4
MC34059 .............. 4.6-4,4.6--7
MC34059FTA . . . . . . . . . . . . . . . .. 4.6-4
MC34060A ................... 4.2-9
MC34063A .................. 4.2-11
MC34064 ................... 4.2-19
MC34064D-5 . . . . . . . . . . . . . . .. 4.2-19
MC34064P-5 ................ 4.2-19
MC34065 ................... 4.2-15
MC34066 ................... 4.2-12
MC34067 ................... 4.2-12
MC34071 .................... 4.1-2
MC34071A ................... 4.1-2
MC34072 .................... 4.1-3
MC34072A ................... 4.1-3
MC34074 .................... 4.1-4
MC34074A ................... 4.1-4
MC34080B ................... 4.1-2
MC34081B ................... 4.1-2
MC34082 .................... 4.1-3
MC34083B ................... 4.1-3
MC34084 .................... 4.1-4
MC34085B ................... 4.1-4
MC34114 .................... 4.7-34
MC34114DW ................ 4.7-21
MC34114P .................. 4.7-21
MC34115 ............. 4.7-33,4.7-35
MC34115DW ................ 4.7-33
MC34115P .................. 4.7-33
MC34117 .................... 4.7-20
MC34118 ...... 4.7-26,4.7-29,4.7-34
MC34118DW ................ 4.7-26
MC34118P .................. 4.7-26
MC34119 ............ 4.7-26,4.7-27,
4.7-28,4.7-29,4.7-34,4.8--2
MC34119D .................. 4.7-30
MC34119P .................. 4.7-30
MC34129 ...... 4.2-9,4.7-15,4.7-35
MC34129D .................. 4.7-30
MC34129P .................. 4.7-30
MC34142 .................... 4.6-3
MC34142DW ................. 4.6-3
MC34142FN .................. 4.6--3
MC34151 ................... 4.2-25
MC34151D .................. 4.2-25
MC34151P .................. 4.2-25
MC34152 ................... 4.2-25
MC34152D .................. 4.2-25
MC34152P .................. 4.2-25
MC34160 .............. 4.2-5,4.2-6
MC34160DW ................. 4.2-6
MC34160P ................... 4.2-6
MC34161 ................... 4.2-20
MC34161D .................. 4.2-20
MC34161P .................. 4.2-20
MC34163 ................... 4.2-11
MC34164 ................... 4.2-19
MC34164D-3 ................ 4.2-19
Motorola Master Selection Guide
Device Index
Page
MC34164D-5 ................ 4.2-19
MC34164P-3 ................ 4.2-19
MC34164P-5 ................ 4.2-19
MC34166 ................... 4.2-11
MC34167 ................... 4.2-11
MC3418 .............. 4.7-33,4.7-35
MC3418DW ................. 4.7-33
MC3418P ................... 4.7-33
MC34181 .................... 4.1-2
MC34182 .................... 4.1-3
MC3~64 .................... ~1-4
MC3419 ..................... 4.7-12
MC3419-1 .................. 4.7-34
MC34216 ................... 4.7-34
MC34216DW ................ 4.7-23
MC34217 ................... 4.7-34
MC34217D .................. 4.7-21
MC34217P .................. 4.7-21
MC3423D ................... 4.2-18
MC3423P1 .................. 4.2-18
MC3425 . . . . . . . . . . . . . . . . . . . .. 4.2-18
MC3425P1 .................. 4.2-18
MC34250 .................... 4.6--8
MC34250FTA ........... : . . . .. 4.6--5
MC34261 ................... 4.2-15
MC34262 ............ 4.2-15,4.2-16
MC34262D .................. 4.2-16
MC34262P .................. 4.2-16
MC34268 ........ 4.2-2, 4.2-3, 4.2-8
MC34268D .... . . . . . . . . . . . . . .. 4.2-8
MC34268DT . . . . . . . . . . . . . . . . .. 4.2-8
MC34270 ................... 4.2-15
MC34271 ................... 4.2-15
MC3430 ...................... 4.1-7
MC3431 ...................... 4.1-7
MC3432 ...................... 4.1-7
MC3433 ...................... 4.1-7
MC3456P ................... 4.10-2
MC3458 . . . . . . . . . . . . . . . . . . . . .. 4.1-3
MC3476 ...................... 4.1-2
MC3479 . . . . . . . . . . . . . . . . . . . . .. 4.3--9
MC3479FN ................... 4.3--9
MC3479P .................... 4.3--9
MC3486 . . . . . . . . . . . . . . . . . . . . .. 4.6--7
MC3487 ...................... 4.6--7
MC4016 .............. 3.1-20,4.7-37
MC4018 .............. 3.1-20,4.7-37
MC4024 .............. 3.1-33,4.7-37
MC4044 .............. 3.1-21,4.7-37
MC4316 .............. 3.1-20,4.7-37
MC4324 .............. 3.1-34,4.7-37
MC4344 .............. 3.1-21,4.7-37
MC44000 .............. 4.8--6, 4.8-9
MC44001 .................... 4.8--3
MC44002 ....... 4.8-3,4.8-9,4.8--12
MC44002P .................. 4.8--12
MC44007 .................... 4.8--9
MC44011 .. 4.8-3, 4.8--5, 4.8-6, 4.8--18
MC44011 FB .................. 4.8-6
MC44011 FN .................. 4.8-6
MC44131 .................... 4.8--9
MC44140 .............. 4.8-3,4.8--5,
4.8--9, 4.8--12
MC44144 .................... 4.8-4
MC44145 ........ 4.8--3, 4.8-4, 4.8--5
MC44200 ........ 4.5-3, 4.8--3, 4.8-4,
4.8--5, 4.8--7
7.1-11
Device Index
Page
MC44200FB .................. 4.8--7
MC44251 ........ 4.5-2,4.8--3,4.8-4,
4.8--5, 4.8-8, 4.8--18
MC44251 FN .................. 4.8-8
MC44301 .............. 4.8-3, 4.8--5,
4.8--9, 4.8-18
MC44302 ........ 4.8--3, 4.8-5, 4.8--9,
4.8--10,4.8-18
MC44302DW ................ 4.8--10
MC44302P .................. 4.8--10
MC44361 ............. 4.8--5,4.8--18
MC44362 ............. 4.8--5, 4.8--18
MC44365 ............. 4.8--5,4.8-18
MC44460 . . ..... 4.8-3, 4.8--5, 4.8-9,
4.8--11, 4.8--18
MC44460B .................. 4.8-11
MC44461 ....... 4.8--5,4.8--9,4.8--18
MC44462 ....... 4.8-5, 4.8--9, 4.8--18
MC44602 ................... 4.2-10
MC44603 .................... 4.8--9
MC44605 .................... 4.8--9
MC44702 .................... 4.8--5
MC44817 ........ 4.8-4,4.8--5,4.8--9,
4.8--18, 4.8-19, 4.8-20, 4.8--22
MC44817B ............ 4.8-4,4.8--19
MC44817BD ................. 4.8--19
MC44817D .................. 4.8--19
MC44818 ........ 4.8-4,4.8--5, 4.8--9,
4.8--18,4.8--20,4.8--22
MC44818D .................. 4.8--20
MC44824 ........ 4.8-4, 4.8--5, 4.8--9,
4.8-18,4.8-21
MC44824D .... . . . . . . . . . . . . .. 4.8--21
MC44825 ........ 4.8-4, 4.8--5, 4.8--9,
4.8-18,4.8--21
MC44825D .... . . . . . . . . . . . . .. 4.8--21
MC44826 ....... 4.8--5, 4.8-9, 4.8--18
MC44827 ........ 4.8-4, 4.8--5, 4.8--9,
4.8--18, 4.8--22
MC44827DTB ............... 4.8--22
MC44828 ........ 4.8-4, 4.8--5, 4.8--9,
4.8--18, 4.8--22
MC44828DTB ............... 4.8-22
MC44829 ........ 4.8-4, 4.8--5, 4.8--9,
4.8--18, 4.8--23
MC44829D .... . . . . . . . . . . . . .. 4.8-23
MC44864 .............. 4.8-4, 4.8--5,
4.8--9,4.8--18
MC4558AC ................... 4.1-3
MC4558C .................... 4.1-3
MC4741C ............•....... 4.1-4
MC54HCTOOA ............... 3.1-26
MC54HCT08A ............... 3.1-26
MC54HCT14A ............... 3.1-36
MC54HCT161A .............. 3.1-20
MC54HCT163A .............. 3.1-20
MC54HCT241A .............. 3.1-16
MC54HCT244A .............. 3.1-16
MC54HCT245A .............. 3.1-15
MC54HCT32A ............... 3.1-29
MC54HCT373A .............. 3.1-30
MC54HCT374A .............. 3.1-24
MC54HCT574A .............. 3.1-25
MC54HCOOA ................ 3.1-26
MC54HC02A ................ 3.1-28
MC54HC04A ................ 3.1-29
MC54HC08A ................ 3.1-26
Device Index
Device Index
Device Index
Page
MCS4HC132A ...............
MCS4HC138A ...............
MC54HC139A ...............
MCS4HC14A ................
MCS4HC1S4 .................
MCS4HC1S7A ...............
MCS4HC1S8 .................
MC54HC160 .................
MC54HC161A ...............
MCS4HC162 .................
MC54HC163A ...............
MCS4HC164 .................
MC54HC16S .................
MC54HC174A ...............
MCS4HC17S . . . . . . . . . . . . . . . ..
MC54HC17SA ...............
MCS4HC240A ...............
MCS4HC241A ...............
MC54HC244A ...............
MCS4HC245A ...............
MC54HC2S1 .................
MC54HC2S9 .................
MCS4HC27 ..................
MCS4HC273A ...............
MC54HC32A ................
MCS4HC3S4 .................
MC54HC36S .................
MCS4HC366 . . . . . . . . . . . . . . . ..
MCS4HC367 .................
MCS4HC373A ...............
MCS4HC374A ...............
MCS4HC390 .................
MC54HC393 .................
MCS4HC4016 ...............
MCS4HC4040A ..............
MCS4HC4049 ...............
MCS4HC40S0 ...............
MCS4HC40S1 ...............
MCS4HC40S3 ...............
MCS4HC4060 ...............
MCS4HC4060A ..............
MCS4HC4066 ...............
MCS4HC4351 ...............
MCS4HC4353 ...............
MCS4HC4S38A ..............
MCS4HCS33A ...............
MC54HCS34A ...............
MCS4HCS40A ...............
MC54HC541A ...............
MCS4HCS63 .................
MCS4HCS73A ...............
MCS4HCS74A ...............
MC54HC589 .................
MC54HCS9SA ...............
MCS4HCS97 . . . . . . . . . . . . . . . ..
MC54HC640A ............. ;.
MCS4HC646 . . . . . . . . . . . . . . . ..
MCS4HC688 . . . . . . . . . . . . . . . ..
MCS4HC74A ................
MCS4HC86 ..................
MC660 ......................
MC661 ......................
MC662 ......................
MC663 ......................
MC664 . . . . . . . . . . . . . . . . . . . . ..
MC667 . . . . . . . . . . . . . . . . . . . . ..
MC668 ......................
3.1-36
3.1-21
3.1-21
3.1-36
3.1-21
3.1-32
3.1-32
3.1-20
3.1-20
3.1-20
3.1-20
3.1-37
3.1-37
3.1-24
3.1-2S
3.1-2S
3.1-16
3.1-16
3.1-16
3.1-16
3.1-31
3.1-21
3.1-28
3.1-24
3.1-29
3.1-32
3.1-1S
3.1-1S
3.1-1S
3.1-31
3.1-2S
3.1-20
3.1-20
3.1-33
3.1-19
3.1-29
3.1-29
3.1-31
3.1-33
3.1-19
3.1-19
3.1-33
3.1-31
3.1-33
3.1-33
3.1-31
3.1-24
3.1-16
3.1-16
3.1-31
3.1-31
3.1-2S
3.1-37
3.1-37
3.1-37
3.1-16
3.1-16
3.1-18
3.1-23
3.1-28
3.1-22
3.1-22
3.1-22
3.1-23
3.1-24
3.1-33
3.1-30
Device Index
Device Index
Page
MC669 . . . . . . . . . . . . . . . . . . . . .. 3.1-22
MC670 . . . . . . . . . . . . . . . . . . . . .. 3.1-30
MC671 ...................... 3.1-30
MC672 ...................... 3.1-30
MC677 ...................... 3.1-29
MC678 ...................... 3.1-29
MC68BOO ................... 2.6-10
MC68B09 ................... 2.6-10
MC68B09E .................. 2.6-10
MC68B10 ................... 2.6-10
MC68B21 ................... 2.6-10
MC68B40 ................... 2.6-10
MC68B44 ................... 2.6-10
MC68B488 .................. 2.6-10
MC68BSO ................... 2.6-10
MC68BS2 ................... 2.6-10
MC68BS4 ................... 2.6-10
MC68ECOOO ................. 2.2-12
MC68EC020 ................. 2.2-13
MC68EC030 ................. 2.2-13
MC68EC040 ................. 2.2-13
MC68F333 ................. ; 2.6-2S
MC68HCB34 ................ 2.6-10
MC68HCOOO . . . . . . . . . . . . . . . .. 2.2-12
MC68HC001 ................. 2.2-12
MC68HCOS .................. 4.7-16
MC68HCOSBD3 . . . . . . . . . . . . . .. 2.S-6
MC68HCOSB16 ........ 2.5-6,2.6-23
MC68HCOSB4 ......... 2.S-6, 2.6-23
MC68HCOSB6 ......... 2.S-6, 2.6-23
MC68HCOSB8 ......... 2.5-6, 2.6-23
MC68HCOSCC1 ............... 2.5-6
MC68HCOSCC2 .. .. .. .. .. .. ... 2.S-6
MCS8HC05CJ4 ............... 2.5-6
MCS8HCOSC12 ........ 2.5-6,2.6-23
MCS8HCOSC4 ............... 2.6-23
MCS8HCOSC4A ........ 2.5-6, 2.6-23
MCS8HCOSCS ......... 2.5-6, 2.6-23
MC68HCOSC8 ............... 2.6-23
MC68HCOSC8A .. .. .. .. .. .. ... 2.5-6
MCS8HCOSC9 ............... 2.6-23
MCS8HCOSC9A .. .. .. .. .. .. ... 2.S-6
MCS8HCOSD24 ........ 2.5-6, 2.S-23
MC68HCOSD9 ......... 2.5-6, 2.6-23
MCS8HCOSE1 ......... 2.S-6, 2.6-23
MCS8HCOSES ................ 2.S-6
MCS8HCOSFS ................ 2.5-7
MC68HCOSFS ................ 2.S-7
MC68HCOSF8 ................ 2.5-7
MC68HCOSG1 ......... 2.5-7,2.6-23
MCS8HCOSG3 ................ 2.5-7
MCS8HCOSJ1 ................ 2.6-23
MCS8HCOSJ1A ............... 2.5-7
MCS8HC05J3 ................. 2.5-7
MC68HCOSKO ................ 2.5-7
MCS8HCOSK1 ................ 2.S-7
MCS8HCOSL1 ................ 2.5-7
MC68HCOSL10 ........ 2.5-7,2.6-24
MCS8HCOSL11 ............... 2.5-8
MCS8HCOSL1S ............... 2.S-8
MCS8HCOSL2 ................ 2.5-7
MCS8HCOSL5 ......... 2.5-7,2.6-24
MC68HCOSL7 ......... 2.5-7,2.6-24
MCS8HCOSL9 ......... 2.5-7,2.6-24
MCS8HCOSM4 .... .. .. .. .. .... 2.5-8
MCS8HCOSPEO ............... 2.5-8
MCS8HCOSP1 ............... 2.6-24
7.1-12
Device Index
Page
MCS8HCOSP1A ............... 2.5-8
MCS8HCOSP3 ................ 2.5-8
MCS8HC05P4 ......... 2.5-8, 2.6-24
MC68HCOSP6 ......... 2.5-8, 2.6-24
MC68HCOSP7 ......... 2.5-8, 2.6-24
MC68HC05P8 ......... 2.5-8, 2.6-24
MC68HC05P9 ......... 2.5-8, 2.6-24
MC68HC05SC11 .............. 2.5-8
MC68HC05SC21 .............. 2.5-8
MC68HC05SC24 .. .. .. .. .. .... 2.5-8
MC68HC05SC27 .. .. .. .. .. .... 2.5-8
MC68HC05T1 ......... 2.5-8, 2.6-24
MC68HC05T10 ........ 2.5-8,2.6-24
MC68HC05T16 ............... 2.5-9
MC68HC05T7 ............... 2.6-24
MC68HC05X1 ................ 2.5-9
MC68HC05X16 ............... 2.5-9
MC68HC05X32 ............... 2.5-9
MC68HC05X4 ................ 2.5-9
MC68HC11AO ................ 2.6-6
MC68HC11A1 ......... 2.6-6,2.6-24
MC68HC11A7 ................ 2.6-6
MC68HC11A8 ......... 2.6-6,2.6-24
MC68HC11D0 ......... 2.6-6,2.6-24
MC68HC11D3 ......... 2.6-6,2.6-24
MC68HC11EDO ............... 2.6-6
MC68HC11EO ......... 2.6-6,2.6-24
MC68HC11E1 ......... 2.6-6,2.6-24
MC68HC11E2 ............... 2.6-24
MC68HC11E8 ................ 2.6-6
MC68HC11E9 ......... 2.6-6,2.6-24
MC68HC11F1 ......... 2.6-6,2.6-25
MC68HC11GS ............... 2.6-25
MCS8HC11G7 ............... 2.6-25
MCS8HC11KAO ............... 2.6-7
MC68HC11KA1 ............... 2.6-7
MC68HC11KA3 ............... 2.6-7
MC68HC11 KA4 ........ 2.6-7,2.6-25
MC68HC11KO ......... 2.6-7,2.6-25
MCS8HC11K1 ......... 2.6-7,2.6-25
MCS8HC11K3 ................ 2.6-7
MCS8HC11K4 ......... 2.6-7,2.S-25
MC68HC11LO .......... 2.6-7,2.6-25
MCS8HC11L1 .......... 2.6-7,2.6-25
MCS8HC11L5 ................. 2.6-7
MCS8HC11LS .......... 2.6-8,2.6-25
MCS8HC11 M2 ......... 2.6-8,2.6-25
MCS8HC11N4 ............... 2.6-25
MCS8HC11P2 ............... 2.6-25
MCS8HC1SY1 ........ 2.6-18,2.6-25
MCS8HC1SZ1 ........ 2.6-18,2.6-25
MC68HC16Z2 ........ 2.6-18,2.6-25
MCS8HC24 .................. 2.6-10
MCS8HC27 .. .. .. .. .. .. .. .... 2.6-10
MC68HC68L9 ............... 2.6-11
MCS8HC705BD3 ............. 2.5-10
MCS8HC705B16 ...... 2.5-10,2.6-23
MCS8HC70SBS ....... 2.5-10,2.6-23
MCS8HC70SCJ4 ............. 2.5-10
MC68HC70SC4A . . . . . . . . . . . .. 2.5-10
MCS8HC705C8 .............. 2.6-23
MC68HC705C8A ............. 2.5-10
MC68HC705C9A ............. 2.5-10
MCS8HC705D9 .............. 2.6-23
MCS8HC705E1 ....... 2.5-10,2.6-23
MC68HC70SF8 .............. 2.5-10
MC68HC70SG1 .............. 2.5-10
Motorola Master Selection Guide
Device Index
Device Index
Page
MC68HC705G4 .............. 2.5-10
MC68HC705J1A ............. 2.5-10
MC68HC705J2 ....... 2.5-10, 2.6-23
MC68HC705K1 .............. 2.5-11
MC68HC705l16 ............. 2.5-11
MC68HC705L5 ....... 2.5-11, 2.6-24
MC68HC705P6 .............. 2.5-11
MC68HC705P9 .............. 2.5-11
MC68HC705Tl0 ............. 2.5-11
MC68HC705T16 ............. 2.5-11
MC68HC705X16 ............. 2.6-24
MC68HC711D3 .............. 2.6-24
MC68HC711E9 .............. 2.6-24
MC68HC711G5 .............. 2.6-25
MC68HC711 K4 .............. 2.6-25
MC68HC711L6 .............. 2.6-25
MC68HC711M2 .............. 2.6-25
MC68HC711N4 .............. 2.6-25
MC68HC711P2 .............. 2.6-25
MC68HC811A8 .............. 2.6-24
MC68HC811 E2 ........ 2.6-6, 2.6-24
MC68LC040 ................. 2.2-13
MC68000 ............ 2.2-12,4.7-17
MC6801 .............. 2.6-10,2.6-23
MC6801U4 ........... 2.6-10,2.6-23
MC68010 ................... 2.2-12
MC6802 ..................... 2.6-10
MC68020 ................... 2.2-13
MC6803 .............. 2.6-10,2.6-23
MC6803U4 ........... 2.6-10,2.6-23
MC68030 ................... 2.2-13
MC68040 ................... 2.2-13
MC68040V .................. 2.2-13
MC6805P2 .................. 2.6-11
MC6805P6 .................. 2.6-11
MC6805R2 ........... 2.6-11, 2.6-25
MC6805R3 ........... 2.6-11, 2.6-25
MC6805R6 .................. 2.6-11
MC6805S2 .................. 2.6-11
MC6805S3 .................. 2.6-11
MC6805U2 .................. 2.6-11
MC6805U3 .................. 2.6-11
MC68060 ................... 2.2-13
MC68150*33 ................ 3.1-15
MC68150*40 ................ 3.1-15
MC68160 .............. 4.6-2,4.6-8
MC68160FB .................. 4.6-2
MC68184 ................... 2.2-13
MC68185 ................... 2.2-13
MC68194 ............ 2.2-13,3.1-17
MC68195 ................... 2.2-13
MC68230 ................... 2.2-13
MC68302 ..... 2.2-13,4.7-15,4.7-17
MC68306 ................... 2.2-13
MC68330 ................... 2.2-13
MC68331 ..... 2.2-13,2.6-21,2.6-25
MC68332 ..... 2.2-13,2.6-21,2.6-25
MC68340 ................... 2.2-13
MC68340V .................. 2.2-13
MC68360 ....... 2.2-13,4.6-2,4.6-8
MC68440 ................... 2.2-13
MC6845 ..................... 2.6-10
MC68450 ................... 2.2-13
MC68605 ................... 2.2-13
MC68606 ................... 2.2-13
MC68681 ................... 2.2-14
MC68701 ............ 2.6-10,2.6-23
Motorola Master Selection Guide
Device Index
Page
MC68701 U4 .......... 2.6-10,
MC68824 ...................
MC68836 ...................
MC68837 ...................
MC68838 ...................
MC68839 ...................
MC68851 ...................
MC68881 ...................
MC68882 ...................
MC68901 ...................
MC74ACTOO .................
MC74ACT02 .................
MC74ACT04 .................
MC74ACT05 .................
MC74ACT08 .................
MC74ACT10 .................
MC74ACT109 ...............
MC74ACTll .................
MC74ACTl12 ................
MC74ACTl13 ................
MC74ACT125 ...............
MC74ACT126 ...............
MC74ACT132 ...............
MC74ACT138 ...............
MC74ACT139 ...............
MC74ACT14 .................
MC74ACT151 ...............
MC74ACT153 ...............
MC74ACT157 ...............
MC74ACT158 ...............
MC74ACT160 ...............
MC74ACT161 ...............
MC74ACT162 ...............
MC74ACT163 ...............
MC74ACT174 ...............
MC74ACT175 ...............
MC74ACT194 ...............
MC74ACT20 .................
MC74ACT240 ...............
MC74ACT241 ...............
MC74ACT244 ...............
MC74ACT245 ...............
MC74ACT251 ...............
MC74ACT253 ...............
MC74ACT256 ...............
MC74ACT257 ...............
MC74ACT258 ...............
MC74ACT259 ...............
MC74ACT273 ...............
MC74ACT299 ...............
MC74ACT32 .................
MC74ACT323 ...............
MC74ACT350 ...............
MC74ACT352 ...............
MC74ACT353 ...............
MC74ACT373 ...............
MC74ACT374 ...............
MC74ACT377 ...............
MC74ACT378 ...............
MC74ACT521 ...............
MC74ACT533 ...............
MC74ACT534 ...............
MC74ACT540 ...............
MC74ACT541 ...............
MC74ACT563 ...............
MC74ACT564 ...............
MC74ACT573 ...............
2.6-23
2.2-14
2.2-14
2.2-14
2.2-14
2.2-14
2.2-14
2.2-14
2.2-14
2.2-14
3.1-26
3.1-28
3.1-29
3.1-29
3.1-26
3.1-26
3.1-24
3.1-26
3.1-23
3.1-23
3.1-17
3.1-17
3.1-36
3.1-21
3.1-21
3.1-36
3.1-31
3.1-32
3.1-33
3.1-33
3.1-20
3.1-20
3.1-20
3.1-20
3.1-24
3.1-25
3.1-37
3.1-25
3.1-16
3.1-16
3.1-16
3.1-15
3.1-32
3.1-32
3.1-30
3.1-33
3.1-33
3.1-30
3.1-24
3.1-37
3.1-29
3.1-37
3.1-37
3.1-32
3.1-32
3.1-31
3.1-25
3.1-24
3.1-23
3.1-18
3.1-31
3.1-25
3.1-16
3.1-16
3.1-30
3.1-25
3.1-31
7.1-13
Device Index
MC74ACT574 ...............
MC74ACT620 ...............
MC74ACT623 ...............
MC74ACT640 ...............
MC74ACT643 ...............
MC74ACT646 ...............
MC74ACT648 ...............
MC74ACT652 ...............
MC74ACT74 .................
MC74ACT810 ...............
MC74ACT86 .................
MC74ACOO ..................
MC74AC02 ..................
MC74AC04 ..................
MC74AC05 ..................
MC74AC08 ..................
MC74AC10 ..................
MC74AC109 .................
MC74ACll ..................
MC74ACl12 .................
MC74AC113 .................
MC74AC125 .................
MC74AC126 .................
MC74AC132 .................
MC74AC138 .................
MC74AC139 .................
MC74AC14 ..................
MC74AC151 .................
MC74AC153 .................
MC74AC157 .................
MC74AC158 .................
MC74AC160 .................
MC74AC161 .................
MC74AC162 .................
MC74AC163 .................
MC74AC174 .................
MC74AC175 .................
MC74AC190 .................
MC74AC194 .................
MC74AC20 ..................
MC74AC240 .................
MC74AC241 .................
MC74AC244 .................
MC74AC245 .................
MC74AC251 .................
MC74AC253 .................
MC74AC256 .................
MC74AC257 .................
MC74AC258 .................
MC74AC259 .................
MC74AC273 .................
MC74AC299 .................
MC74AC32 ..................
MC74AC323 .................
MC74AC350 .................
MC74AC352 . . . . . . . . . . . . . . . ..
MC74AC353 .................
MC74AC373 .................
MC74AC374 .................
MC74AC377 .................
MC74AC378 .................
MC74AC4020 ................
MC74AC4040 ................
MC74AC533 .................
MC74AC534 .................
MC74AC540 .................
MC74AC541 .................
Page
3.1-25
3.1-15
3.1-15
3.1-15
3.1-15
3.1-16
3.1-16
3.1-16
3.1-23
3.1-27
3.1-28
3.1-26
3.1-28
3.1-29
3.1-29
3.1-26
3.1-26
3.1-24
3.1-26
3.1-23
3.1-23
3.1-17
3.1-17
3.1-36
3.1-21
3.1-21
3.1-36
3.1-31
3.1-32
3.1-33
3.1-33
3.1-20
3.1-20
3.1-20
3.1-20
3.1-24
3.1-25
3.1-21
3.1-37
3.1-25
3.1-16
3.1-16
3.1-16
3.1-15
3.1-32
3.1-32
3.1-30
3.1-33
3.1-33
3.1-30
3.1-24
3.1-37
3.1-29
3.1-37
3.1-37
3.1-32
3.1-32
3.1-31
3.1-24
3.1-24
3.1-23
3.1-19
3.1-19
3.1-31
3.1-25
3.1-16
3.1-16
Device Index
Device Index
Device Index
Page
MC74AC563 ............•....
MC74AC564 .................
MC74AC573 .................
MC74AC574 .................
MC74AC620 .................
MC74AC623 .................
MC74AC640 .................
MC74AC643 .................
MC74AC646 .................
MC74AC648 .................
MC74AC652 .................
MC74AC74 ..................
MC74AC810 .................
MC74AC86 ..................
MC74FOO ...................
MC74F02 ...................
MC74F04 ...................
MC74F08 ...................
MC74F10 ...................
MC74F109 ..................
MC74F11 ...................
MC74F112 ..................
MC74F1245 .................
MC74F125 ..................
MC74F126 ..................
MC74F13 ...................
MC74F132 ..................
MC74F138 ..................
MC74F139 ..................
MC74F14 ...................
MC74F148 ..................
MC74F151 ..................
MC74F153 ..................
MC74F157A .................
MC74F158A .................
MC74F160A .................
MC74F161A .................
MC74F162A .................
MC74F163A .................
MC74F164 ..................
MC74F168 ..................
MC74F169 ....... ; ..........
MC74F174 ..................
MC74F175 ..................
MC74F1803 .................
MC74F181 ..................
MC74F182 ..................
MC74F194 ..................
MC74F195 ..................
MC74F20 ...................
MC74F21 ...................
MC74F240 .............•....
MC74F241 ..................
MC74F242 ..................
MC74F243 ..................
MC74F244 ..................
MC74F245 ..................
MC74F251 ..................
MC74F253 ..................
MC74F256 ..................
MC74F257A .................
MC74F258A .................
MC74F259 ..................
MC74F269 ..................
MC74F280 •.................
MC74F283 ..................
MC74F299 ..................
3.1-30
3.1-25
3.1-30
3.1-25
3.1-15
3.1-15
3.1-15
3.1-15
3.1-16
3.1-16
3.1-16
3.1-23
3.1-27
3.1-27
3.1-26
3.1-28
3.1-29
3.1-26
3.1-26
3.1-24
3.1-26
3.1-24
3.1-15
3.1-17
3.1-17
3.1-36
3.1-36
3.1-21
3.1-21
3.1-36
3.1-22
3.1-31
3.1-32
3.1-32
3.1-32
3.1-19
3.1-19
3.1-19
3.1-19
3.1-37
3.1-19
3.1-19
3.1-24
3.1-25
3.1-17
3.1-14
3.1-14
3.1-37
3.1-37
3.1-25
3.1-25
3.1-15
3.1-15
3.1-17
3.1-17
3.1-15
3.1-15
3.1-31
3.1-32
3.1-30
3.1-33
3.1-33
3.1-30
3.1-19
3.1-34
3.1-14
3.1-37
Device Index
Device Index
Page
MC74F32 .................... 3.1-29
MC74F323 .................. 3.1-37
MC74F350 .................. 3.1-37
MC74F352 .................. 3.1-32
MC74F353 .................. 3.1-32
MC74F365 .................. 3.1-15
MC74F366 .................. 3.1-15
MC74F367 .................. 3.1-15
MC74F368 .................. 3.1-15
MC74F37 ................... 3.1-26
MC74F373 .................. 3.1-31
MC74F374 .................. 3.1-24
MC74F377 .................. 3.1-24
MC74F378 .................. 3.1-36
MC74F379 .................. 3.1-25
MC74F38 ................... 3.1-26
MC74F381 .................. 3.1-14
MC74F382 .................. 3.1-14
MC74F3893A ................ 3.1-38
MC74F398 .................. 3.1-33
MC74F399 .................. 3.1-33
MC74F40 ................... 3.1-25
MC74F51 ................... 3.1-27
MC74F521 .................. 3.1-18
MC74F533 .................. 3.1-31
MC74F534 .................. 3.1-25
MC74F537 .................. 3.1-21
MC74F538 .................. 3.1-21
MC74F539 ................ :. 3.1-21
MC74F543 .................. 3.1-16
MC74F544 .................. 3.1-16
MC74F568 .................. 3.1-19
MC74F569 .................. 3.1-19
MC74F574 .................. 3.1-24
MC74F579 .................. 3.1-19
MC74F620 .................. 3.1-16
MC74F623 .................. 3.1-16
MC74F64 ................... 3.1-27
MC74F640 .................. 3.1-16
MC74F646 .................. 3.1-16
MC74F657A ................. 3.1-15
MC74F657B ................. 3.1-15
MC74F74 ................... 3.1-23
MC74F779 .................. 3.1-19
MC74F803 .................. 3.1-17
MC74F823 .................. 3.1-15
MC74F827 .................. 3.1-14
MC74F828 .................. 3.1-14
MC74F85 ................... 3.1-18
MC74F86 ................... 3.1-28
MC74HCTOOA ............... 3.1-26
MC74HCT04A ............... 3.1-29
MC74HCT08A ............... 3.1-26
MC74HCT138A .............. 3.1-21
MC74HCT14A ............... 3.1-36
MC74HCT157A .............. 3.1-32
MC74HCT161A .............. 3.1-20
MC74HCT163A .............. 3.1-20
MC74HCT174A .............. 3.1-24
MC74HCT240A .............. 3.1-16
MC74HCT241A .............. 3.1-16
MC74HCT244A .............. 3.1-16
MC74HCT245A .............. 3.1-15
MC74HCT273A .............. 3.1-24
MC74HCT32A ............... 3.1-29
MC74HCT373A .............. 3.1-30
MC74HCT374A .........•.... 3.1-24
7.1-14
Device Index
MC74HCT541A ..............
MC74HCT573A .............•
MC74HCT574A ...•........•.
MC74HCT74A ..........•..••
MC74HCU04 ........•.......
MC74HCOOA ................
MC74HC02A ................
MC74HC03A ................
MC74HC04A ..........•....•
MC74HC08A ..........•.....
MC74HC10 ...........•......
MC74HC107 .................
MC74HC109 .................
MC74HC11 ..................
MC74HC112 .................
MC74HC125A ..............•
MC74HC126A ......•.....•..
MC74HC132A ........•......
MC74HC133 .................
MC74HC137 .................
MC74HC138A ...............
MC74HC139A ...............
MC74HC14A .....•..........
MC74HC147 ....•...•.....•..
MC74HC151 ....•............
MC74HC153 ........•........
MC74HC154 ......•..........
MC74HC157A ....•..........
MC74HC158 .....••...•.•..••
MC74HC160 ...•.....••....••
MC74HC161A ...•...........
MC74HC162 ..•..........•...
MC74HC163 .................
MC74HC164 .................
MC74HC165 ...............•.
MC74HC173 ..........•......
MC74HC174A ........•....•.
MC74HC175 .................
MC74HC175A ......•.....•..
MC74HC194 ..•......•.......
MC74HC195 .•...............
MC74HC20 ........•.......•.
MC74HC237 ...•••.•.•.....•.
MC74HC240A ..•••.....•....
MC74HC241A ........•....•.
MC74HC242 .........•.......
MC74HC244A ...........•...
MC74HC245A .....•.........
MC74HC251 •................
MC74HC253 .................
MC74HC257 ..•...••.........
MC74HC259 ..•..............
MC74HC27 ..................
MC74HC273A ...............
MC74HC280 ..............•..
MC74HC299 .................
MC74HC30 ............•..•..
MC74HC32A ................
MC74HC354 ...............•.
MC74HC365 .............•...
MC74HC366 .................
MC74HC367 ............•..•.
MC74HC368 ...........•.....
MC74HC373A .......•...•.•.
MC74HC374A .......•......•
MC74HC390 ..............•..
MC74HC393 .................
Page
3.1-16
3.1-31
3.1-25
3.1-23
3.1-29
3.1-26
3.1-28
3.1-26
3.1-29
3.1-26
3.1-26
3.1-23
3.1-24
3.1-26
3.1-23
3.1-17
3.1-17
3.1-36
3.1-25
3.1-21
3.1-21
3.1-21
3.1-36
3.1-22
3.1-31
3.1-32
3.1-21
3.1-32
3.1-32
3.1-20
3.1-20
3.1-20
3.1-20
3.1-37
3.1-37
3.1-25
3.1-24
3.1-25
3.1-25
3.1-37
3.1-37
3.1-25
3.1-21
3.1-16
3.1-16
3.1-17
3.1-16
3.1-16
3.1-31
3.1-32
3.1-32
3.1-21
3.1-28
3.1-24
3.1-34
3.1-37
3.1-25
3.1-29
3.1-32
3.1-15
3.1-15
3.1-15
3.1-15
3.1-31
3.1-25
3.1-20
3.1-20
Motorola Master Selection Guide
Device Index
Page
Device Index
Page
Device Index
MC74HC4002 ...............
MC74HC4016 ...............
MC74HC4017 ...............
MC74HC4020A ..............
MC74HC4024 ...............
MC74HC4040A ..............
MC74HC4046A ..............
MC74HC4049 ...............
MC74HC4050 ...............
MC74HC4051 ...............
MC74HC4052 ...............
MC74HC4053 ...............
MC74HC4060 ...............
MC74HC4060A ..............
MC74HC4066 ...............
MC74HC4075 ...............
MC74HC4078 ...............
MC74HC42 ..................
MC74HC4316 ...............
MC74HC4351 ...............
MC74HC4353 ...............
MC74HC4511 ................
MC74HC4514 ...............
MC74HC4538A ..............
MC74HC51 ..................
MC74HC533A ...............
MC74HC534A ...............
MC74HC540A ...............
MC74HC541A ...............
MC74HC563 .................
MC74HC564 .................
MC74HC573A ...............
MC74HC574A ...............
MC74HC58 ..................
MC74HC589 .................
MC74HC595A ...............
MC74HC597 .................
MC74HC640A ...............
MC74HC646 .................
MC74HC688 .................
MC74HC7266 ...............
MC74HC73 ..................
MC74HC74A ................
MC74HC75 ..................
MC74HC76 ..................
MC74HC85 ..................
MC74HC86 ..................
MC74LCXOO .................
MC74LCX02 .................
MC74LCX04 .................
MC74LCX08 .................
MC74LCX240 ................
MC74LCX244 ................
MC74LCX245 ................
MC74LCX32 .................
MC74LCX373 ................
MC74LCX374 ................
MC74LCX540 ................
MC74LCX541 ................
MC74LCX573 ................
MC74LCX574 ................
MC74LVQOO .................
MC74LVQ04 .................
MC74LVQ125 ................
MC74LVQ138 ................
MC74LVQ240 ................
MC74LVQ244 ................
3.1-28
3.1-33
3.1-20
3.1-19
3.1-34
3.1-19
3.1-39
3.1-29
3.1-29
3.1-31
3.1-32
3.1-33
3.1-19
3.1-19
3.1-33
3.1-29
3.1-27
3.1-21
3.1-33
3.1-31
3.1-33
3.1-22
3.1-21
3.1-33
3.1-27
3.1-31
3.1-24
3.1-16
3.1-16
3.1-31
3.1-25
3.1-31
3.1-25
3.1-27
3.1-37
3.1-37
3.1-37
3.1-16
3.1-16
3.1-18
3.1-27
3.1-23
3.1-23
3.1-30
3.1-23
3.1-18
3.1-28
3.1-26
3.1-28
3.1-30
3.1-26
3.1-14
3.1-14
3.1-38
3.1-28
3.1-30
3.1-24
3.1-14
3.1-14
3.1-30
3.1-24
3.1-26
3.1-30
3.1-14
3.1-21
3.1-14
3.1-14
MC74LVQ245 ................ 3.1-38
MC74LVQ373 ................ 3.1-30
MC74LVQ374 ................ 3.1-24
MC74LVQ541 ................ 3.1-14
MC74LVQ573 ................ 3.1-30
MC74LVQ574 ................ 3.1-24
MC74LVQ646 ................ 3.1-38
MC74LVQ652 ................ 3.1-38
MC75174B ................... 4.6-7
MC78LXXAB ................. 4.2-2
MC78LXXAC ................. 4.2-2
MC78LXXC . . . . . . . . . . . . . . . . . .. 4.2-2
MC78L24AB . . . . . . . . . . . . . . . . .. 4.2-2
MC78L24AC . . . . . . . . . . . . . . . . .. 4.2-2
MC78L24C ... . . . . . . . . . . . . . . .. 4.2-2
MC78MXXB .................. 4.2-2
MC78MXXC . . . . . . . . . . . . . . . . .. 4.2-2
MC78TXXAC ................. 4.2-3
MC78TXXC .................. 4.2-3
MC78T15AC . . . . . . . . . . . . . . . . .. 4.2-3
MC78T15C ...... . . . . . . . . . . . .. 4.2-3
MC78XXAC .................. 4.2-3
MC78XXB . . . . . . . . . . . . . . . . . . .. 4.2-3
MC78XXC . . . . . . . . . . . . . . . . . . .. 4.2-3
MC7824AC . . . . . . . . . . . . . . . . . .. 4.2-3
MC7824B .................... 4.2-3
MC7824C .................... 4.2-3
MC79LXXAB ................. 4.2-2
MC79LXXAC ................. 4.2-2
MC79LXXC . . . . . . . . . . . . . . . . . .. 4.2-2
MC79L05AB . . . . . . . . . . . . . . . . .. 4.2-2
MC79L05AC . . . . . . . . . . . . . . . . .. 4.2-2
MC79L05C ... . . . . . . . . . . . . . . .. 4.2-2
MC79L24AB . . . . . . . . . . . . . . . . .. 4.2-2
MC79L24AC . . . . . . . . . . . . . . . . .. 4.2-2
MC79L24C ... . . . . . . . . . . . . . . .. 4.2-2
MC79MXXB .................. 4.2-2
MC79MXXC .. . . . . . . . . . . . . . . .. 4.2-2
MC79XXAC .................. 4.2-3
MC79XXC . . . . . . . . . . . . . . . . . . .. 4.2-3
MC79076 .................... 4.9-2
MC7924C .................... 4.2-3
MC8HC705G1 ............... 2.6-23
MC830 . . . . . . . . . . . . . . . . . . . . .. 3.1-25
MC832 ...................... 3.1-14
MC836 ...................... 3.1-29
MC837 ...................... 3.1-29
MC840 ...................... 3.1-29
MC844 ...................... 3.1-22
MC845 ...................... 3.1-23
MC846 . . . . . . . . . . . . . . . . . . . . .. 3.1-26
MC849 ...................... 3.1-26
MC88LV926 ................. 3.1-18
MC88PL117 ................. 3.1-17
MC88100 .................... 2.3-3
MC88100RC .................. 2.3-2
MC88110 ..................... 2.3-3
MC88110RC .................. 2.3-2
MC88200 .............. 2.3-2, 2.3-3
MC88200RC . . . . . . . . . . . . . . . . .. 2.3-3
MC88204RC . . . . . . . . . . . . . . . . .. 2.3-3
MC88410 .................... 2.3-3
MC88913 ................... 3.1-18
MC88914 ................... 3.1-18
MC88915T*100 .............. 3.1-18
MC88915T*133 .............. 3.1-18
MC88915T*160 .............. 3.1-18
Motorola Master Selection Guide
7.1-15
Device Index
Page
MC88915T*55 ............... 3.1-18
MC88915T*70 ............... 3.1-18
MC88915*55 ................ 3.1-18
MC88915*70 ................ 3.1-18
MC88916*70 ................ 3.1-18
MC88916*80 ................ 3.1-18
MC88920 ................... 3.1-17
MC88921 ................... 3.1-17
MC936 . . . . . . . . . . . . . . . . . . . . .. 3.1-29
MC937 ...................... 3.1-29
MC944 ...................... 3.1-22
MC945 ...................... 3.1-23
MC946 ...................... 3.1-26
MC951 ...................... 3.1-33
MC952 ...................... 3.1-23
MC953 ...................... 3.1-23
MFF124B .................. 5.10-31
MFF224B .................. 5.10-31
MFF324B .................. 5.10-32
MFF424B .................. 5.10-32
MFF524B .................. 5.10-33
MGB20N35CL ......... 5.4-7,5.4--22
MGB20N40CL ......... 5.4--7,5.4-22
MGP20N14CL ......... 5.4-7,5.4--22
MGP20N35CL ......... 5.4--7,5.4--22
MGP20N40CL ......... 5.4--7,5.4--22
MGP20N60 .................. 5.4--22
MGP5N60E ................. 5.4--22
MGRB1018K ................ 5.6-14
MGRB2018CTK .............. 5.6-14
MGRB2025CTK .............. 5.6-14
MGR1018K .................. 5.6-14
MGR2018CTK ............... 5.6-14
MGR2025CTK ............... 5.6-14
MGSS150-1 ................. 5.7-14
MGSS150-2 ................. 5.7-14
MGW12N120 ................ 5.4--22
MGW12N120D ............... 5.4--22
MGW20N60D . . . . . . . . . . . . . . .. 5.4--22
MGW30N60 ................. 5.4--22
MGY25N120 ................. 5.4--22
MGY30N60D ................ 5.4--22
MGY40N60 .................. 5.4--22
MGY40N60D ................ 5.4--22
MG8MEVB16Y1 ............. 2.6-25
MHLW8000 ................. 5.10-35
MHL8015 .................. 5.10-34
MHL8018 .................. 5.10-34
MHL8115 ................... 5.10-34
MHL8118 ................... 5.10-34
MHL9125 .................. 5.10-34
MHL9128 .................. 5.10-34
MHPM7A12A120A ............ 5.3-2
MHPM7A15A60A ............. 5.3-2
MHPM7A16A120B ............ 5.3-2
MHPM7A20A60A ............. 5.3-2
MHPM7A25A120B ............ 5.3-2
MHPM7A30A60B ............. 5.3-2
MHPM7A8A120A ............. 5.3-2
MHW105 ................... 5.10-28
MHW1134 .................. 5.10-30
MHW1184 .................. 5.10-30
MHW1184L ................. 5.10-30
MHW1224 .................. 5.10-30
MHW1224L ................. 5.10-30
MHW1244 .................. 5.10-30
MHW1254L ................. 5.10-30
Device Index
Device Index
Device Index
MHW1254LC ...............
MHW1304L. ................
MHW1304LC ...............
MHW2528 ..................
MHW2728 ..................
MHW2821-1 ...............
MHW2821-2 ...............
MHW3528 ..................
MHW3628 ..................
MHW3728 ..................
MHW5142A ................
MHW5172A ................
MHW5182A ................
MHW5185B ................
MHW5222A ................
MHW5225 ..................
MHW5272A ................
MHW5342A ................
MHW5382A ................
MHW590 ...................
MHW591 ...................
MHW592 ...................
MHW593 ...... ; ............
MHW607-1 .................
MHW607-2 .................
MHW607-3 .................
MHW607-4 .................
MHW6142 ..................
MHW6172 ..................
MHW6182 ..................
MHW6182-6 ...............
MHW6185-6A ..............
MHW6185B ................
MHW6205 ..................
MHW6205-6A ..............
MHW6222 ..................
MHW6222-6 ...............
MHW6225 ..................
MHW6272 ..................
MHW6272-6 ...............
MHW6292-6 ...............
MHW6342 ..................
MHW704-1 .................
MHW704-2 .................
MHW707-1 .................
MHW707-2 .................
MHW707-3 .................
MHW707-4 .................
MHW7142 ..................
MHW7182 ..................
MHW7185A ................
MHW720A1 ................
MHW720A2 ................
MHW7205A ................
MHW7222 ..................
MHW7242 ..................
MHW7272 ..................
MHW7292 ..................
MHW803-1 .................
MHW803-2 .................
MHW803-3 .................
MHW804-1 .................
MHW806A2 ................
MHW806A4 ................
MHW8142 ..................
MHW8182 ..................
MHW8185 ..................
Device Index
Page
5.10-30
5.10-30
5.10-30
5.10-35
5.10-35
5.10-28
5.10-28
5.10-35
5.10-35
5.10-35
5.10-31
5.10-31
5.10-31
5.10-31
5.10-31
5.10-31
5.10-31
5.10-31
5.10-31
5.10-34
5.10-34
5.10-34
5.10-34
5.10-28
5.10-28
5.10-28
5.10-28
5.10-31
5.10-31
5.10-31
5.10-32
5.10-32
5.10-31
5.10-31
5.10-32
5.10-31
5.10-32
5.10-31
5.10-31
5.10-32
5.10-32
5.10-31
5.10-28
5.10-28
5.10-28
5.10-28
5.10-28
5.10-28
5.10-32
5.10-32
5.10-32
5.10-28
5.10-28
5.10-32
5.10-32
5.10-32
5.10-32
5.10-32
5.10-28
5.10-28
5.10-28
5.10-28
5.10-28
5.10-28
5.10-33
5.10-33
5.10-33
Device Index
Page
MHW8205 .................. 5.10-33
MHW8222 .................. 5.10-33
MHW8242 .................. 5.10-33
MHW8272 .................. 5.10-33
MHW8292 ................. , 5.10-33
MHW851-1 ................. 5.10-28
MHW851-2 ................. 5.10-28
MHW851-3 ................. 5.10-28
MHW851-4 ................. 5.10-28
MHW9002-1 ............... 5.10-28
MHW9002-2 ............... 5.10-28
MHW9014 .................. 5.10-28
MHW913 ................... 5.10-29
MHW914 ................... 5.10-29
MHW9142 .................. 5.10-33
MHW916 ................... 5.10-29
MHW9182 .................. 5.10-33
MHW920 ................... 5.10-29
MHW9242 .................. 5.10-33
MHW927B ................. 5.10-29
MHW953 ................... 5.10-29
MHW954 ................... 5.10-29
MJD112 ..................... 5.5-11
MJD117 ....... , . '" ......... 5.5-11
MJD122 ..................... 5.5-11
MJD127 ..................... 5.5-11
MJD13003 .................. 5.5-10
MJD200 ..................... 5.5-11
MJD210 ....... , . '" .... " ... 5.5-11
MJD243 ............. , ....... 5.5-11
MJD253 ..................... 5.5-11
MJD2955 .................... 5.5-11
MJD3055 .................... 5.5-11
MJD31 ...................... 5.5-11
MJD31C .................... 5.5-11
MJD32 ........ " .... , ....... 5.5-11
MJD32C .................... 5.5-11
MJD340 ..................... 5.5-10
MJD350 ....... " ......... '" 5.5-10
MJD41C .................... 5.5-11
MJD42C .................... 5.5-11
MJD44E3 ................... 5.5-11
MJD44H11 .................. 5.5-11
MJD47 ...................... 5.5-10
MJD50 ...................... 5.5-10
MJD5731 .................... 5.5-10
MJD6036 .................... 5.5-11
MJD6039 . . . . . . . . . . . . . . . . . . .. 5.5-11
MJE1123 ...... " ............. 5.5-4
MJE13002 .................... 5.5-9
MJE13003 ............. 5.5-9,5.5-19
MJE13005 .................... 5.5-4
MJE13007 .................... 5.5-5
MJE13009 .................... 5.5-6
MJE1320 ..................... 5.5-3
MJE15028 .................... 5.5-5
MJE15029 . . . . . . . . . . . . . . . . . . .. 5.5-5
MJE15030 ............. 5.5-5,5.5-15
MJE15031 ............. 5.5-5,5.5-15
MJE15032 ................... 5.5-15
MJE15033 ................... 5.5-15
MJE16002 ...... '" ......... " 5.5-4
MJE16004 .................... 5.5-4
MJE16106 .................... 5.5-5
MJE16204 .................... 5.5-4
MJE171 ...................... 5.5-9
MJE172 ...................... 5.5-9
7.1-16
Device Index
Page
MJE18002 ............. 5.5-3,5.5-18
MJE18004 ............. 5.5-4,5.5-18
MJE18004D2 ................ 5.5-18
MJE18006 ............. 5.5-4,5.5-18
MJE18008 ............. 5.5-5,5.5-18
MJE18009 ............. 5.5-6,5.5-18
MJE181 ...................... 5.5-9
MJE182 ...................... 5.5-9
MJE18204 ............. 5.5-4,5.5-18
MJE18206 ................... 5.5-18
MJE18604D2 ....... : ........ 5.5-18
MJE200 ..................... 5.5-10
MJE210 ..................... 5.5-10
MJE2360T ................... 5.5-3
MJE2361T ................... 5.5-3
MJE243 ..................... 5.5-10
MJE253 ........... , ..... , ... 5.5-10
MJE270 . . . . . . . . . . . . . . . . . . . . .. 5.5-9
MJE271 ...................... 5.5-9
MJE2955T ................... 5.5-5
MJE3055T ................... 5.5-5
MJE340 .................... " 5.5-6
MJE341 ...................... 5.5-8
MJE3439 ..................... 5.5-8
MJE344 . . . . . . . . . . . . . . . . . . . . .. 5.5-8
MJE350 . . . . . . . . . . . . . . . . . . . . .. 5.5-8
MJE371 ...................... 5.5-9
MJE4342 . . . . . . . . . . . . . . . . . . . .. 5.5-7
MJE4343 . . . . . . . . . . . . . . . . . . . .. 5.5-7
MJE4352 . . . . . . . . . . . . . . . . . . . .. 5.5-7
MJE4353 . . . . . . . . . . . . . . . . . . . .. 5.5-7
MJE521 ...................... 5.5-9
MJE5730 . . . . . . . . . . . . . . . . . . . .. 5.5-3
MJE5731 ........ . . . . . . . . . . . .. 5.5-3
MJE5731A ................... 5.5-3
MJE5740 ...•................. 5.5-5
MJE5741 ..................... 5.5-5
MJE5742 ..................... 5.5-5
MJE5850 . . . . . . . . . . . . . . . . . . . .. 5.5-5
MJE5851 ..................... 5.5-5
MJE5852 ..................... 5.5-5
MJE700 . . . . . . . . . . . . . . .. 5.5-4, 5.5-9
MJE702 ..................... 5.5-10
MJE703 ..................... 5.5-10
MJE800 . . . . . . . . . . . . . . .. 5.5-4, 5.5-9
MJE802 ..................... 5.5-10
MJE803 ..................... 5.5-10
MJE9780 . . . . . . . . . . . . . . . . . . . .. 5.5-3
MJF18002 ................... 5.5-19
MJF18004 ............. 4.8-9,5.5-19
MJF18006 ................. " 5.5-19
MJF18008 ... , ..... , ......... 5.5-19
MJF18009 ................... 5.5-19
MJF18204 ................... 5.5-19
MJF18206 ................... 5.5-19
MJH10012 ................... 5.5-6
MJH11017 .................... 5.5-7
MJH11018 .................... 5.5-7
MJH11019 .................... 5.5-7
MJH11020 .................... 5.5-7
MJH11021 .................... 5.5-7
MJH11022 .................... 5.5-7
MJH16006A .................. 5.5-6
MJH6282 . . . . . . . . . . . . . . . . . . . .. 5.5-7
MJH6284 ..................... 5.5-7
MJH6285 . . . . . . . . . . . . . . . . . . . .. 5.5-7
MJH6287 . . . . . . . . . . . . . . . . . . . .. 5.5-7
Motorola Master Selection Guide
Device Index
Device Index
Page
MJL1302A ............. 5.5--8, 5.5-15
MJL16218 .................... 5.5--8
MJL21193 ............. 5.5--8,5.5-15
MJL21194 ....... . . . . .. 5.5--8, 5.5-15
MJL3281 A ............. 5.5--8, 5.5-15
MJW16010 ................... 5.5-7
MJW16010A .................. 5.5-7
MJW16012 ................... 5.5-7
MJW16018 ................... 5.5-7
MJW16206 ................... 5.5-7
MJW16212 ................... 5.5-7
MJ1000 ..................... 5.5-11
MJ10000 .................... 5.5-13
MJ10005 .................... 5.5-13
MJ10007 .................... 5.5-12
MJ10009 .................... 5.5-13
MJ100l ..................... 5.5-11
MJ10012 .................... 5.5-12
MJ10015 .................... 5.5-14
MJ10016 .................... 5.5-14
MJ10020 .................... 5.5-14
MJ10021 .................... 5.5-14
MJ10022 .................... 5.5-14
MJ10023 .................... 5.5-14
MJll0ll .................... 5.5-13
MJll012 .................... 5.5-13
MJll013 .................... 5.5-13
MJll014 .................... 5.5-13
MJll015 .................... 5.5-13
MJll016 .................... 5.5-13
MJll017 .................... 5.5-12
MJll018 .................... 5.5-12
MJll019 .................... 5.5-12
MJll020 .................... 5.5-12
MJll021 .................... 5.5-12
MJll022 .................... 5.5-12
MJll030 .................... 5.5-14
MJll031 .................... 5.5-14
MJll032 .................... 5.5-14
MJll033 .................... 5.5-14
MJ1302A ............. 5.5-12,5.5-15
MJ13333 .................... 5.5-13
MJ14001 .................... 5.5-14
MJ14002 .................... 5.5-14
MJ14003 .................... 5.5-14
MJ15001 ............. 5.5-12,5.5-15
MJ15002 ............. 5.5-12,5.5-15
MJ15003 ............. 5.5-13,5.5-15
MJ15004 ............. 5.5-13,5.5-15
MJ15011 .................... 5.5-12
MJ15012 .................... 5.5-12
MJ15015 ............. 5.5-12,5.5-15
MJ15016 ............. 5.5-12,5.5-15
MJ15018 .................... 5.5-11
MJ15020 ............. 5.5-11,5.5-15
MJ15021 ............. 5.5-11, 5.5-15
MJ15022 .................... 5.5-13
MJ15023 .................... 5.5-13
MJ15024 ............. 5.5-13,5.5-15
MJ15025 ............. 5.5-13,5.5-15
MJ16010 .................... 5.5-13
MJ16012 .................... 5.5-13
MJ16020 .................... 5.5-14
MJ16022 .................... 5.5-14
MJ16110 .................... 5.5-12
MJ21193 ............. 5.5-13,5.5-15
MJ21194 ............. 5.5-13,5.5-15
Motorola Master Selection Guide
Device Index
Page
MJ2500 ... . . . . . . . . . . . . . . . . .. 5.5-12
MJ2501 ..................... 5.5-12
MJ2955 ..................... 5.5-12
MJ2955A ............. 5.5-12,5.5-15
MJ3000 ..................... 5.5-12
MJ3001 ..................... 5.5-12
MJ3281A ............. 5.5-12,5.5-15
MJ413 ...................... 5.5-12
MJ423 ...................... 5.5-12
MJ4502 ..................... 5.5-13
MJ802 ...................... 5.5-13
MKP1V120 .................. 5.7-14
MKP1V130 .................. 5.7-14
MKP3Vll0 .................. 5.7-14
MKP3V120 .................. 5.7-14
MKP3V130 .................. 5.7-14
MLPl N06CL .................. 5.4-7
MLP2N06CL .................. 5.4-7
MMADll03 .................. 5.1-39
MMADll05 .................. 5.1-39
MMADll06 .................. 5.1-39
MMADll07 .................. 5.1-39
MMADll08 .................. 5.1-39
MMADll09 .................. 5.1-39
MMAD130 ................... 5.1-39
MMAS250G ................. 5.9-10
MMBD1000LTl ....... 5.1-36,5.1-41
MMBD1005LTl ....... 5.1-37,5.1-41
MMBD101LTl ............... 5.1-32
MMBD10l0LTl ....... 5.1-37,5.1-41
MMBD2000T1 ........ 5.1-36,5.1-41
MMBD2005Tl ........ 5.1-37,5.1-41
MMBD2010Tl ........ 5.1-37,5.1-41
MMBD2835LT1 .............. 5.1-36
MMBD2836LTl .............. 5.1-36
MMBD2837LTl .............. 5.1-36
MMBD2838LTl .............. 5.1-36
MMBD3000Tl ........ 5.1-36,5.1-41
MMBD3005Tl ........ 5.1-37,5.1-41
MMBD301LTl ............... 5.1-32
MMBD3010Tl ........ 5.1-37,5.1-41
MMBD330Tl ................ 5.1-33
MMBD352LTl ............... 5.1-32
MMBD353LT1 ............... 5.1-32
MMBD354LTl ............... 5.1-32
MMBD6050LTl .............. 5.1-35
MMBD6100LTl .............. 5.1-36
MMBD7000LT1 .............. 5.1-36
MMBD701LTl ............... 5.1-32
MMBD770Tl ................ 5.1-33
MMBD914LTl ............... 5.1-35
MMBFJ175LTl ............... 5.1-23
MMBFJ177LTl ............... 5.1-23
MMBFJ309LTl ............... 5.1-22
MMBFJ310LTl ............... 5.1-22
MMBFU310LTl .............. 5.1-22
MMBF0201 NLTl ...... 5.1-23,5.1-41
MMBF0202PLTl ...... 5.1-23,5.1-41
MMBF170LTl ................ 5.1-23
MMBF4391LTl ............... 5.1-23
MMBF4392LT1 ............... 5.1-23
MMBF4393LT1 ............... 5.1-23
MMBF4416LTl ............... 5.1-22
MMBF4856LTl ............... 5.1-23
MMBF4860LTl ............... 5.1-23
MMBF5457LTl ............... 5.1-22
MMBF5459LT1 ............... 5.1-22
7.1-17
Device Index
Page
MMBF5460LTl ............... 5.1-22
MMBF5484LTl ............... 5.1-22
MMBF5486LTl ............... 5.1-22
MMBR5031LTl ..... 5.10-16,5.10-19
MMBR5179LT1 ..... 5.10-16,5.10-19
MMBR521LTl ...... 5.10-16,5.10-18
MMBR571LT1 ...... 5.10-16,5.10-18
MMBR901LTl ...... 5.10-16,5.10-18
MMBR911LT1 ....... 5.10-16,5.10-18
MMBR920LTl ...... 5.10-16, 5.10-19
MMBR931LTl .............. 5.10-16
MMBR941BLT1 ..... 5.10-16,5.10-18
MMBR941LTl ...... 5.10-16,5.10-18
MMBR951ALT1 ............. 5.10-16
MMBR951LT1 ...... 5.10-16,5.10-18
MMBTA06LT1 ................ 5.1-15
MMBTA13LT1 ................ 5.1-14
MMBTA14LT1 ................ 5.1-14
MMBTA42LT1 ................ 5.1-15
MMBTA56LT1 ................ 5.1-15
MMBTA64LT1 ................ 5.1-14
MMBTA92LT1 ................ 5.1-15
MMBTH10LT1 ............... 5.1-13
MMBTH24LT1 ............... 5.1-13
MMBTH69LTl ............... 5.1-13
MMBTH81LTl ............... 5.1-13
MMBT1010LT1 ........ 5.1-15,5.1-40
MMBT2222ALTl ............. 5.1-10
MMBT2369ALTl ............. 5.1-13
MMBT2369LT1 ............... 5.1-13
MMBT2484LT1 ............... 5.1-14
MMBT2907ALT1 ............. 5.1-10
MMBT3640LTl ............... 5.1-13
MMBT3904LTl ............... 5.1-10
MMBT3904WTl .............. 5.1-11
MMBT3906LTl ............... 5.1-11
MMBT3906WTl .............. 5.1-11
MMBT404ALTl .............. 5.1-14
MMBT4401LT1 ............... 5.1-10
MMBT4403LT1 ............... 5.1-11
MMBT5087LTl ............... 5.1-14
MMBT5089LTl ............... 5.1-14
MMBT5401LT1 ............... 5.1-15
MMBT5551LT1 ............... 5.1-15
MMBT6428LTl ............... 5.1-14
MMBT6429LTl ............... 5.1-14
MMBT6517LT1 ............... 5.1-15
MMBT6520LT1 ............... 5.1-15
MMBT8599LT1 ............... 5.1-10
MMBT918LT1 ................ 5.1-13
MMBV105GLTl .............. 5.1-30
MMBV109LTl ............... 5.1-30
MMBV2101 LTl .............. 5.1-27
MMBV2103LTl .............. 5.1-27
MMBV2104LTl .............. 5.1-27
MMBV2105LTl .............. 5.1-27
MMBV2107LTl .............. 5.1-27
MMBV2108LTl .............. 5.1-27
MMBV2109LT1 .............. 5.1-27
MMBV3102LT1 .............. 5.1-30
MMBV3401LT1 .............. 5.1-35
MMBV3700LTl .............. 5.1-35
MMBV409LTl ............... 5.1-30
MMBV432LTl ............... 5.1-27
MMBV609LTl ............... 5.1-31
MMBV809LTl ............... 5.1-30
MMBZ15ALTl ................ 5.2-9
Device Index
Device Index
Device Index
Page
MMBZ15VDLTl ............... 5.2-9
MMBZ20ALTl ................ 5.2-9
MMBZ27VCLT1 ............... 5.2-9
MMBZ5V6ALTl ............... 5.2-9
MMBZ5221 BLT1 ...... 5.2-21, 5.2-25
MMBZ5222BLTl ...... 5.2-21,5.2-25
MMBZ5225BLTl ...... 5.2-21,5.2-25
MMBZ5226BLTl ...... 5.2-21,5.2-25
MMBZ5228BLTl ...... 5.2-21,5.2-25
MMBZ5229BLTl ...... 5.2-21,5.2-25
MMBZ5230BLTl ...... 5.2-21,5.2-25
MMBZ5231 BLTl ...... 5.2-21, 5.2-25
MMBZ5232BLTl ...... 5.2-21,5.2-25
MMBZ5233BLTl ...... 5.2-21,5.2-25
MMBZ5234BLTl ...... 5.2-21,5.2-25
MMBZ5235BLT1 ...... 5.2-21, 5.2-25
MMBZ5236BLT1 ...... 5.2-21, 5.2-25
MMBZ5237BLT1 ...... 5.2-21,5.2-25
MMBZ5239BLTl ...... 5.2-21,5.2-25
MMBZ5240BLTl ...... 5.2-21,5.2-25
MMBZ5241 BLT1 ...... 5.2-21, 5.2-25
MMBZ5242BLT1 ...... 5.2-21,5.2-25
MMBZ5243BLT1 ...... 5.2-21, 5.2-25
MMBZ5244BLT1 ...... 5.2-21,5.2-25
MMBZ5245BLTl ...... 5.2-21, 5.2-25
MMBZ5246BLTl ...... 5.2-21, 5.2-25
MMBZ5247BLT1 ...... 5.2-21,5.2-25
MMBZ5248BLT1 ...... 5.2-21, 5.2-25
MMBZ5249BLT1 ...... 5.2-21, 5.2-25
MMBZ5250BLTl ...... 5.2-21,5.2-25
MMBZ5251 BLTl ...... 5.2-21,5.2-25
MMBZ5252BLT1 ...... 5.2-21, 5.2-25
MMBZ5254BLT1 ...... 5.2-21, 5.2-25
MMBZ5255BLT1 ...... 5.2-22, 5.2-25
MMBZ5256BLT1 ...... 5.2-22, 5.2-25
MMBZ5257BLTl ...... 5.2-22, 5.2-25
MMBZ5258BLT1 ...... 5.2-22, 5.2-25
MMBZ5259BLT1 ...... 5.2-22, 5.2-25
MMBZ5261BLT1 ...... 5.2-22,5.2-26
MMBZ5262BLTl ...... 5.2-22, 5.2-26
MMBZ5263BLTl ...... 5.2-22,5.2-26
MMBZ5265BLTl ...... 5.2-22, 5.2-26
MMBZ5266BLTl ...... 5.2-22,5.2-26
MMBZ5268BLT1 ...... 5.2-22, 5.2-26
MMBZ5269BLTl ...... 5.2-22, 5.2-26
MMBZ5270BLTl ...... 5.2-22, 5.2-26
MMBZ6V2ALT1 ............... 5.2-9
MMDFl N05E ........... 5.4-4, 5.4-8
MMDF2COl HD ......... 5.4-4, 5.4-8
MMDF2C02E ........... 5.4-4, 5.4-8
MMDF2C02HD ......... 5.4-4,5.4-8
MMDF2C03HD ......... 5.4-4,5.4-8
MMDF2N02E ........... 5.4-4, 5.4-8
MMDF2P01HD ......... 5.4-4,5.4-17
MMDF2P02E .......... 5.4-4,5.4-17
MMDF2P02HD ......... 5.4-4,5.4-17
MMDF2P03HD ......... 5.4-4,5.4-17
MMDF3N02HD ......... 5.4-4, 5.4-8
MMDF3N03HD ......... 5.4-4, 5.4-8
MMDF3055V ................. 5.4-6
MMDF3055VL ................ 5.4-6
MMDF4NOl HD ......... 5.4-4, 5.4-8
MMDF4N01Z ........... 5.4-4,5.4-9
MMFT1Nl0E ................. 5.4-9
MMFT107Tl ................. 5.1-23
MMFT2N02EL ......... 5.4-9, 5.4-20
MMFT2406T1 ................ 5.1-23
Device Index
Device Index
Page
MMFT2955E ................. 5.4-18
MMFT3055E .. .. . .. .. .. . . .. . .. 5.4-9
MMFT3055EL ......... 5.4-9, 5.4-20
MMFT3055V . .. . . .. . .. . .. . . ... 5.4-6
MMFT3055VL ................ 5.4-6
MMFT6661T1 ................ 5.1-23
MMFT960Tl ................. 5.1-23
MMH0026 .. .. .. .. .. .. .. .. ... 4.2-25
MMPQ2222A ................. 5.1-9
MMPQ2369 .................. 5.1-9
MMPQ2907A ................. 5.1-9
MMPQ3467 .................. 5.1-9
MMPQ3725 .................. 5.1-9
MMPQ3799 .................. 5.1-9
MMPQ3904 .................. 5.1-9
MMPQ3906 .................. 5.1-9
MMPQ6700 .................. 5.1-9
MMQA20VT1 ................ 5.2-10
MMQA5V6Tl ................ 5.2-10
MMSD1000T1 ........ 5.1-36,5.1--41
MMSD101T1 ................ 5.1-33
MMSD301T1 ................ 5.1-33
MMSD701T1 ................ 5.1-33
MMSD914T1 ................ 5.1-35
MMSF2P02E .......... 5.4-4,5.4-17
MMSF3P02HD ......... 5.4-4,5.4-17
MMSF3P02Z .......... 5.4-4,5.4-17
MMSF3P03HD ......... 5.4-4,5.4-17
MMSF4P01HD ......... 5.4-4,5.4-17
MMSF4P01Z .......... 5.4-4,5.4-17
MMSF5N02HD .......... 5.4-4, 5.4-8
MMSF5N03HD .......... 5.4-4, 5.4-8
MMSF5N03Z ................. 5.4-4
MMSF6N01Z ........... 5.4-4,5.4-9
MMSZ10Tl ........... 5.2-21, 5.2-29
MMSZ11T1 ........... 5.2-21,5.2-29
MMSZ12T1 ........... 5.2-21,5.2-29
MMSZ13Tl ........... 5.2-21,5.2-29
MMSZ15T1 ........... 5.2-21,5.2-29
MMSZ16Tl ........... 5.2-21,5.2-29
MMSZ18Tl ........... 5.2-21, 5.2-29
MMSZ2V4T1 ......... 5.2-21,5.2-29
MMSZ2V7Tl ......... 5.2-21, 5.2-29
MMSZ20Tl ........... 5.2-21, 5.2-29
MMSZ22Tl ........... 5.2-21, 5.2-29
MMSZ24T1 ........... 5.2-21, 5.2-29
MMSZ27T1 ........... 5.2-21, 5.2-30
MMSZ3VOT1 ......... 5.2-21, 5.2-29
MMSZ3V3Tl ......... 5.2-21, 5.2-29
MMSZ3V6Tl ......... 5.2-21, 5.2-29
MMSZ3V9T1 ......... 5.2-21, 5.2-29
MMSZ30T1 ........... 5.2-22, 5.2-30
MMSZ33T1 ........... 5.2-22, 5.2-30
MMSZ36T1 ........... 5.2-22, 5.2-30
MMSZ39Tl ........... 5.2-22, 5.2-30
MMSZ4V3Tl ......... 5.2-21, 5.2-29
MMSZ4V7Tl ......... 5.2-21, 5.2-29
MMSZ43Tl ........... 5.2-22, 5.2-30
MMSZ4678Tl ........ 5.2-21, 5.2-28
MMSZ4679T1 ........ 5.2-21,5.2-28
MMSZ4680T1 ........ 5.2-21,5.2-28
MMSZ4681Tl ........ 5.2-21,5.2-28
MMSZ4682Tl ........ 5.2-21, 5.2-28
MMSZ4683Tl ........ 5.2-21, 5.2-28
MMSZ4684Tl ........ 5.2-21, 5.2-28
MMSZ4685Tl ........ 5.2-21, 5.2-28
MMSZ4686Tl ........ 5.2-21, 5.2-28
7.1-18
Device Index
Page
MMSZ4687Tl ........ 5.2-21, 5.2-28
MMSZ4688Tl ........ 5.2-21, 5.2-28
MMSZ4689Tl ........ 5.2-21, 5.2-28
MMSZ4690Tl ........ 5.2-21, 5.2-28
MMSZ4691Tl ........ 5.2-21,5.2-28
MMSZ4692Tl ........ 5.2-21, 5.2-28
MMSZ4693Tl ........ 5.2-21, 5.2-28
MMSZ4694Tl ........ 5.2-21, 5.2-28
MMSZ4695Tl ........ 5.2-21, 5.2-28
MMSZ4696Tl ........ 5.2-21, 5.2-28
MMSZ4697Tl ........ 5.2-21, 5.2-28
MMSZ4698Tl ........ 5.2-21, 5.2-28
MMSZ4699Tl ........ 5.2-21, 5.2-28
MMSZ47Tl ........... 5.2-22, 5.2-30
MMSZ4700Tl ........ 5.2-21,5.2-28
MMSZ4701Tl ........ 5.2-21,5.2-28
MMSZ4702Tl ........ 5.2-21,5.2-28
MMSZ4703Tl ........ 5.2-21,5.2-28
MMSZ4704Tl ........ 5.2-21,5.2-28
MMSZ4705Tl ........ 5.2-21,5.2-28
MMSZ4706T1 ........ 5.2-21,5.2-28
MMSZ4707Tl ........ 5.2-21, 5.2-28
MMSZ4708Tl ........ 5.2-21,5.2-28
MMSZ4709Tl ........ 5.2-21, 5.2-28
MMSZ4710Tl ........ 5.2-21, 5.2-28
MMSZ4711Tl ......... 5.2-21,5.2-28
MMSZ4712T1 ........ 5.2-22,5.2-28
MMSZ4713T1 ........ 5.2-22,5.2-28
MMSZ4714Tl ........ 5.2-22,5.2-28
MMSZ4715T1 ........ 5.2-22,5.2-28
MMSZ4716T1 ........ 5.2-22,5.2-28
MMSZ4717T1 ........ 5.2-22,5.2-28
MMSZ5V1Tl ......... 5.2-21, 5.2-29
MMSZ5V6Tl ......... 5.2-21, 5.2-29
MMSZ51Tl ........... 5.2-22,5.2-30
MMSZ5221 BTl ....... 5.2-21, 5.2-26
MMSZ5222BTl ....... 5.2-21, 5.2-26
MMSZ5223BTl ....... 5.2-21, 5.2-26
MMSZ5224BTl ....... 5.2-21, 5.2-26
MMSZ5225BTl ....... 5.2-21,5.2-26
MMSZ5226BTl ....... 5.2-21, 5.2-26
MMSZ5227BTl ....... 5.2-21, 5.2-26
MMSZ5228BT1 ....... 5.2-21, 5.2-26
MMSZ5229BTl ....... 5.2-21, 5.2-26
MMSZ5230BT1 ....... 5.2-21, 5.2-26
MMSZ5231 BTl ....... 5.2-21,5.2-27
MMSZ5232BTl ....... 5.2-21, 5.2-27
MMSZ5233BT1 ....... 5.2-21, 5.2-27
MMSZ5234BTl ....... 5.2-21, 5.2-27
MMSZ5235BTl ....... 5.2-21, 5.2-27
MMSZ5236BTl ....... 5.2-21, 5.2-27
MMSZ5237BTl ....... 5.2-21, 5.2-27
MMSZ5238BTl ....... 5.2-21, 5.2-27
MMSZ5239BTl ....... 5.2-21, 5.2-27
MMSZ5240BTl ....... 5.2-21, 5.2-27
MMSZ5241BTl ....... 5.2-21,5.2-27
MMSZ5242BTl ....... 5.2-21, 5.2-27
MMSZ5243BTl ....... 5.2-21, 5.2-27
MMSZ5244BTl ....... 5.2-21, 5.2-27
MMSZ5245BT1 ....... 5.2-21, 5.2-27
MMSZ5246BTl ....... 5.2-21, 5.2-27
MMSZ5247BTl ....... 5.2-21,5.2-27
MMSZ5248BTl ....... 5.2-21, 5.2-27
MMSZ5249BTl ....... 5.2-21, 5.2-27
MMSZ5250BTl ....... 5.2-21, 5.2-27
MMSZ5251 BTl ....... 5.2-21,5.2-27
MMSZ5252BTl ....... 5.2-21, 5.2-27
Motorola Master Selection Guide
Device Index
Device Index
Page
MMSZ5253BT1 ....... 5.2-21, 5.2-27
MMSZ5254BT1 ....... 5.2-21, 5.2-27
MMSZ5255BT1 ....... 5.2-22, 5.2-27
MMSZ5256BT1 ....... 5.2-22, 5.2-27
MMSZ5257BT1 ....... 5.2-22, 5.2-27
MMSZ5258BT1 ....... 5.2-22, 5.2-27
MMSZ5259BT1 ....... 5.2-22, 5.2-27
MMSZ5260BT1 ....... 5.2-22, 5.2-27
MMSZ5261BT1 ....... 5.2-22,5.2-27
MMSZ5262BT1 ....... 5.2-22, 5.2-27
MMSZ5263BT1 ....... 5.2-22, 5.2~27
MMSZ5264BT1 ....... 5.2-22, 5.2-27
MMSZ5265BT1 ....... 5.2-22, 5.2-27
MMSZ5266BT1 ....... 5.2-22, 5.2-27
MMSZ5267BT1 ....... 5.2-22, 5.2-27
MMSZ5268BT1 ....... 5.2-22, 5.2-27
MMSZ5269BT1 ....... 5.2-22, 5.2-27
MMSZ5270BT1 ....... 5.2-22, 5.2-27
MMSZ5271 BT1 .............. 5.2-22
MMSZ56T1 ........... 5.2-22, 5.2-30
MMSZ6V2T1 ......... 5.2-21, 5.2-29
MMSZ6V8T1 ......... 5.2-21, 5.2-29
MMSZ62T1 ........... 5.2-22, 5.2-30
MMSZ68T1 ........... 5.2-22, 5.2-30
MMSZ7V5T1 ......... 5.2-21,5.2-29
MMSZ75T1 ........... 5.2-22, 5.2-30
MMSZ8V2T1 ......... 5.2-21,5.2-29
MMSZ9V1T1 ......... 5.2-21, 5.2-29
MMT10V275 ................. 5.7-14
MMT10V400 ................. 5.7-14
MMUN2111LT1 .............. 5.1-12
MMUN2112LT1 .............. 5.1-12
MMUN2113LT1 .............. 5.1-12
MMUN2114LT1 .............. 5.1-12
MMUN2115LT1 .............. 5.1-12
MMUN2116LT1 .............. 5.1-12
MMUN2130LT1 .............. 5.1-12
MMUN2131LT1 .............. 5.1-12
MMUN2132LT1 .............. 5.1-12
MMUN2133LT1 .............. 5.1-12
MMUN2134LT1 .............. 5.1-12
MMUN2211LT1 .............. 5.1-12
MMUN2212LT1 .............. 5.1-12
MMUN2213LT1 .............. 5.1-12
MMUN2214LT1 .............. 5.1-12
MMUN2215LT1 .............. 5.1-12
MMUN2216LT1 .............. 5.1-12
MMUN2230LT1 .............. 5.1-12
MMUN2231LT1 .............. 5.1-12
MMUN2232LT1 .............. 5.1-12
MMUN2233LT1 .............. 5.1-12
MMUN2234LT1 .............. 5.1-12
MOCD207 .. .. .. .. .. .. .. .. .... 5.8-9
MOCD207R2 ................. 5.8-9
MOCD208 .. .. .. .. .. .. .. .. .... 5.8-9
MOCD208R2 ................. 5.8-9
MOCD211 .................... 5.8-9
MOCD211 R2 ................. 5.8-9
MOCD213 .................... 5.8-9
MOCD213R2 ................. 5.8-9
MOCD217 . . . . . . . . . . . . . . . . . . .. 5.8-9
MOCD217R2 ................. 5.8-9
MOCD223 . . . . . . . . . . . . .. . . . . .. 5.8-9
MOCD223R2 ................. 5.8-9
MOC119 ..................... 5.8-7
MOC2A40-10 ............... 5.8-10
MOC2A40-5 ................. 5.8-10
Motorola Master Selection Guide
Device Index
Page
MOC2A60-10 ............... 5.8-10
MOC2A60-5 ................. 5.8-10
MOC205 ..................... 5.8-9
MOC205R2 .. .. .. .. .. .. .. .. ... 5.8-9
MOC206 ..................... 5.8-9
MOC206R2 . . . . . . . . . . . . .. . . . .. 5.8~
MOC207 ...... . . . . . . . . . . . . . .. 5.8-9
MOC207R2 . . . . . . . . . . . . . . . . . .. 5.8-9
MOC211 ..................... 5.8-9
MOC211R2 ................... 5.8-9
MOC212 ..................... 5.8-9
MOC212R2 ................... 5.8-9
MOC213 ..................... 5.8-9
MOC213R2 ................... 5.8-9
MOC215 ..................... 5.8-9
MOC215R2 ................... 5.8-9
MOC216 ..................... 5.8-9
MOC216R2 ................... 5.8-9
MOC217 ..................... 5.8-9
MOC217R2 ................... 5.8-9
MOC223 ..................... 5.8-9
MOC223R2 . . . . . . . . . . . . . . . . . .. 5.8-9
MOC256 ..................... 5.8-9
MOC256R2 .. .. .. .. .. .. .. .. ... 5.8-9
MOC263 ..................... 5.8-9
MOC263R2 .. .. .. .. .. .. .. .. ... 5.8-9
MOC3010 .................... 5.8-8
MOC3011 .................... 5.8-8
MOC3012 .................... 5.8-8
MOC3021 .................... 5.8-8
MOC3022 ... .. .. .. .. .. .. .. ... 5.8-8
MOC3023 ... .. .. .. .. .. .. . .... 5.8-8
MOC3031 .................... 5.8-8
MOC3032 .................... 5.8-8
MOC3033 ..... .. .. .. .. .. .. ... 5.8-8
MOC3041 .................... 5.8-8
MOC3042 .................... 5.8-8
MOC3043 .................... 5.8-8
MOC3051 .................... 5.8-8
MOC3052 ..... .. .. .. .. .. . .... 5.8-8
MOC3061 .................... 5.8-8
MOC3062 .................... 5.8-8
MOC3063 ................ .... 5.8-8
MOC3063S .. .. .. .. .. .. .. . .... 5.8-3
MOC3063SR2V .. .. .. .. .. . .... 5.8-3
MOC3063SV ................. 5.8-3
MOC3063TV ................. 5.8-3
MOC3063V . . . . . . . . . . . . . . . . . .. 5.8-3
MOC3081 .................... 5.8-8
MOC3082 .................... 5.8-8
MOC3083 ....... .. .. .. .. .. ... 5.8-8
MOC3162 .................... 5.8-8
MOC3163 .................... 5.8-8
MOC5007 ....... . . . . .. . . . . ... 5.8-8
MOC5008 ....... .. .. .. .. .. ... 5.8-8
MOC5009 ... .. .. .. .. .. .. .. ... 5.8-8
MOC8020 '" ................ , 5.8-7
MOC8021 .................... 5.8-7
MOC8030 .................... 5.8-7
MOC8050 .................... 5.8-7
MOC8080 ... .. .. .. .. .. .. .. ... 5.8-7
MOC8100 .................... 5.8-6
MOC8101 .................... 5.8-6
MOC8102 .................... 5.8-8
MOC8103 .................... 5.8-8
MOC8104 .................... 5.8-8
MOC8105 .................... 5.8-8
7.1-19
Device Index
Page
MOC8111 .................... 5.8-6
MOC8112 .................... 5.8-6
MOC8113 .................... 5.8-6
MOC8204 .. .. .. .. .. .. .. .. .... 5.8-7
MPC2101 .................... 2.8-4
MPC2103 .................... 2.8-4
MPC2104 .................... 2.8-4
MPC2105 .................... 2.8-4
MPC2106 .................... 2.8-4
MPC2107 .................... 2.8-4
MPC2604GA ................. 2.8-2 .
MPC27T416 .................. 2.8-2
MPC903 .................... 3.1-17
MPC904 .................... 3.1-17
MPC930 .................... 3.1-18
MPC931 .................... 3.1-18
MPC947 .................... 3.1-17
MPC948 .................... 3.1-17
MPC950 .................... 3.1-18
MPC951 .................... 3.1-18
MPC956 .................... 3.1-18
MPC970 .................... 3.1-18
MPF102 ..................... 5.1-19
MPF3821 ................... 5.1-19
MPF4392 ................... 5.1-20
MPF4393 ................... 5.1-20
MPF4856 ............. -...... 5.1-20
MPF4857 ................... 5.1-20
MPF4859 ................... 5.1-20
MPF4860 ................... 5.1-20
MPF4861 ................... 5.1-20
MPF6659 ................... 5.1-21
MPF6660 ................... 5.1-21
MPF6661 ................... 5.1-21
MPF910 ..................... 5.1-21
MPF930 ..................... 5.1-21
MPF960 ..................... 5.1-21
MPF970 ..................... 5.1-20
MPF971 .. .. .. .. .. .. .. . .. .... 5.1-20
MPF990 .. .. .. .. .. .. . . . .. .... 5.1-21
MPN3404 ................... 5.1-35
MPN3700 ................... 5.1-35
MPQ2222A ................... 5.1-9
MPQ2369 .................... 5.1~
MPQ2483 .................... 5.1-9
MPQ2484 .................... 5.1-9
MPQ2907A ................... 5.1-9
MPQ3467 .................... 5.1-9
MPQ3725 .................... 5.1-9
MPQ3762 .................... 5.1-9
MPQ3798 .................... 5.1-9
MPQ3799 .................... 5.1-9
MPQ3904 .................... 5.1-9
MPQ3906 .................... 5.1-9
MPQ6001 .................... 5.1-9
MPQ6002 .................... 5.1-9
MPQ6100A ................... 5.1~
MPQ6426 .................... 5.1~
MPQ6501 .................... 5.1-9
MPQ6502 .................... 5.1~
MPQ6600A1 .................. 5.1-9
MPQ6700 .................... 5.1-9
MPQ6842 .................... 5.1-9
MPQ7042 .................... 5.1-9
MPQ7043 .................... 5.1-9
MPQ7051 .................... 5.1-9
MPQ7093 .................... 5.1-9
Device Index
Device Index
Device Index
Page
MPSA05 ..................... 5.1-2
MPSA06 ..................... 5.1-2
MPSA13 ..................... 5.1-4
MPSA14 ..................... 5.1-4
MPSA16 ..................... 5.1-7
MPSA17 ..................... 5.1-7
MPSA18 ..................... 5.1-3
MPSA20 ..................... 5.1-2
MPSA27 ..................... 5.1-4
MPSA29 ..................... 5.1-4
MPSA42 ..................... 5.1-5
MPSA44 ..................... 5.1-5
MPSA55 ..................... 5.1-2
MPSA56 ..................... 5.1-2
MPSA63 ..................... 5.1-4
MPSA64 ..................... 5.1-4
MPSA70 ..................... 5.1-2
MPSA75 ..................... 5.1-4
MPSA77 ..................... 5.1-4
MPSA92 ..................... 5.1-5
MPSH07A .................... 5.1-6
MPSH10 ..................... 5.1-6
MPSHll ..................... 5.1-6
MPSH17 ..................... 5.1-6
MPSH20 ..................... 5.1-6
MPSH24 ..................... 5.1-6
MPSH69 ..................... 5.1-6
MPSH81 ..................... 5.1-6
MPSW01A ................... 5.1-4
MPSW06 ..................... 5.1-3
MPSW42 ..................... 5.1-5
MPSW45A ................... 5.1-4
MPSW51A ................... 5.1-4
MPSW56 ..................... 5.1-3
MPSW64 ..................... 5.1-4
MPSW92 ..................... 5.1-5
MPS2222A ................... 5.1-2
MPS2369A ................... 5.1-6
MPS2907A ................... 5.1-2
MPS3563 .................... 5.1-6
MPS3646 .................... 5.1-6
MPS3866 ............ 5.1-6,5.10-15
MPS3904 .................... 5.1-3
MPS3906 .................... 5.1-3
MPS404A .................... 5.1-7
MPS4250 .................... 5.1-3
MPS4258 .................... 5.1-6
MPS5179 .................... 5.1-6
MPS571 ........... 5.10-15,5.10-18
MPS6428 .................... 5.1-3
MPS650 ..................... 5.1-4
MPS651 ..................... 5.1-4
MPS6521 .................... 5.1-3
MPS6523 .................... 5.1-3
MPS6595 .................... 5.1-6
MPS6602 .................... 5.1-2
MPS6652 .................... 5.1-2
MPS6715 .................... 5.1-4
MPS6717 .................... 5.1-3
MPS6727 .................... 5.1-4
MPS750 ..................... 5.1-4
MPS751 ..................... 5.1-4
MPS8099 .................... 5.1-2
MPS8599 .....................5.1-2
MPS901 ........... 5.10-15,5.10-18
MPS911 ............ 5.10-15,5.10-18
MPS918 ..................... 5.1-6
Device Index
Device Index
Page
MPTE-l0 ........ : ........... 5.2-6
MPTE-l0C ................... 5.2-6
MPTE-12 .................... 5.2-6
MPTE-12C ................... 5.2-6
MPTE-15 .................... 5.2-6
MPTE-15C ................... 5.2-6
MPTE-18 .................... 5.2-6
MPTE-18C ................... '5.2-6
MPTE-22 .................... 5.2-6
MPTE-36 .................... 5.2-6
MPTE-36C . . . . . . . . . . . . . . . . . .. 5.2-6
MPTE-45 .................... 5.2-6
MPTE-45C . . . . . . . . . . . . . . . . . .. 5.2-6
MPTE-5 ..................... 5.2-6
MPTE-6 ..................... 5.2-6
MPTE-6C .................... 5.2-6
MPXS4100A Series ........... 5.9-6
MPXS4115A Series ............ 5.9-6
MPXT2010G Series ........... 5.9-6
MPX10D ............... 5.9-6,5.9-7
MPX10DP .................... 5.9-7
MPX10GP .................... 5.9-7
MPX10GS .................... 5.9-7
MPX10GSX .................. 5.9-7
MPX10GVP .................. 5.9-7
MPX10GVS .................. 5.9-7
MPX10GVSX ................. 5.9-7
MPX100A .............. 5.9-6,5.9-7
MPX100AP .................. , 5.9-7
MPX100AS ................... 5.9-7
MPX100ASX ................. 5.9-7
MPX100D .............. 5.9-6,5.9-7
MPX100DP ................... 5.9-7
MPX100GP ................... 5.9-7
MPX100GS .............. " ... 5.9-7
MPX100GSX ................. 5.9-7
MPX100GVP ................. 5.9-7
MPX100GVS ................. 5.9-7
MPX100GVSX ................ 5.9-7
MPX200A .............. 5.9-6,5.9-7
MPX200AP .................. , 5.9-7
MPX200AS ................... 5.9-7
MPX200ASX ................. 5.9-7
MPX200D .............. 5.9-6,5.9-7
MPX200DP . . . . . . . . . . . . . . . . . .. 5.9-7
MPX200GP . . . . . . . . . . . . . . . . . .. 5.9-7
MPX200GS ................... 5.9-7
MPX200GSX ................. 5.9-7
MPX200GVP ................. 5.9-7
MPX200GVS ................. 5.9-7
MPX200GVSX ................ 5.9-7
MPX2010D ............. 5.9-6,5.9-7
MPX2010DP .................. 5.9-7
MPX2010GP ................. 5.9-7
MPX2010GS ................. 5.9-7
MPX2010GSX ................ 5.9-7
MPX2010GVP ................ 5.9-7
MPX2010GVS ................ 5.9-7
MPX2010GVSX ............... 5.9-7
MPX2050D ............. 5.9-6,5.9-7
MPX2050DP .................. 5.9-7
MPX2050GP ................. 5.9-7
MPX2050GS ................. 5.9-7
MPX2050GSX ................ 5.9-7
MPX2050GVP ................ 5.9-7
MPX2050GVS ................ 5.9-7
MPX2050GVSX . . . . . . . . . . . . . .. 5.9-7
7.1-20
Device Index
Page
MPX2052D . . . . . . . . . . . . . . . . . .. 5.9-6
MPX2100A ............. 5.9-6,5.9-7
MPX2100AP .................. 5.9-7
MPX2100AS .................. 5.9-7
MPX2100ASX ................ 5.9-7
MPX2100D ............. 5.9-6,5.9-7
MPX2100DP .................. 5.9-7
MPX2100GP ................. 5.9-7
MPX2100GS ................. 5.9-7
MPX2100GSX ................ 5.9-7
MPX2100GVP ................ 5.9-7
MPX2100GVS ................ 5.9-7
MPX2100GVSX . . . . . . . . . . . . . .. 5.9-7
MPX2200A ............. 5.9-6, 5.9-7
MPX2200AP .................. 5.9-7
MPX2200AS .................. 5.9-7
MPX2200ASX ................ 5.9-7
MPX2200D ............. 5.9-6, 5.9-7
MPX2200DP .................. 5.9-7
MPX2200GP ................. 5.9-7
MPX2200GS ................. 5.9-7
MPX2200GSX ................ 5.9-7
MPX2200GVP ................ 5.9-7
MPX2200GVS ................ 5.9-7
MPX2200GVSX . . . . . . . . . . . . . .. 5.9-7
MPX2300DTI .. . . . . . . . . . . . . . .. 5.9-6
MPX2700A ............. 5.9-6, 5.9-7
MPX2700AP . . . . . . . . . . . . . . . . .. 5.9-7
MPX2700AS . . . . . . . . . . . . . . . . .. 5.9-7
MPX2700ASX ................ 5.9-7
MPX2700D . . . . . . . . . . . .. 5.9-6, 5.9-7
MPX2700DP . . . . . . . . . . . . . . . . .. 5.9-7
MPX2700GP ................. 5.9-7
MPX2700GSX ................ 5.9-7
MPX4100A ............. 5.9-6,5.9-8
MPX4100AP .................. 5.9-8
MPX4100AS . . . . . . . . . . . . . . . . .. 5.9-8
MPX4100ASX ................ 5.9-8
MPX4101A ............. 5.9-6,5.9-8
MPX4101AP .................. 5.9-8
MPX4101AS .................. 5.9-8
MPX4101ASX ................ 5.9-8
MPX4115A ............. 5.9-6,5.9-8
MPX4115AP ..............•... 5.9-8
MPX4115AS .................. 5.9-8
MPX4115ASX ................ 5.9-8
MPX4250A ............. 5.9-6,5.9-8
MPX4250AP .................. 5.9-8
MPX4250AS . . . . . . . . . . . . . . . . .. 5.9-8
MPX4250ASX ................ 5.9-8
MPX50D ............... 5.9-6,5.9-7
MPX50DP . . . . . . . . . . . . . . . . . . .. 5.9-7
MPX50GP .................... 5.9-7
MPX50GS .................... 5.9-7
MPX50GSX .................. 5.9-7
MPX50GVP .................. 5.9-7
MPX50GVS .................. 5.9-7
MPX50GVSX ................. 5.9-7
MPX5010D ............. 5.9-6,5.9-8
MPX5010DP .................. 5.9-8
MPX5010GP ................. 5.9-8
MPX5010GS ................. 5.9-8
MPX5010GSX ................ 5.9-8
MPX5010GVP ...............• 5.9-8
MPX5010GVS ................ 5.9-8
MPX5010GVSX . . . . . . . . . . . . . .. 5.9-8
MPX5050D ............. 5.9-6, 5.9-8
Motorola Master Selection Guide
Device Index
Device Index
Page
MPX5050DP . . . . . . . . . . . . . . . . .. 5.9-8
MPX5050GP ................. 5.9-8
MPX5050GS ................. 5.9-8
MPX5050GSX ................ 5.9-8
MPX5050GVP ................ 5.9-8
MPX5050GVS ................ 5.9-8
MPX5050GVSX ............... 5.9-8
MPX5100A ............. 5.9-6,5.9-8
MPX5100AP ................... 5.9-8
MPX5100AS .................. 5.9-8
MPX5100ASX ................ 5.9-8
MPX5100D ............. 5.9-6,5.9-8
MPX5100DP .................. 5.9-8
MPX5100GP .........•....... 5.9-8
MPX5100GS ................. 5.9-8
MPX5100GSX ................ 5.9-8
MPX5100GVP ................ 5.9-8
MPX5100GVS ................ 5.9-8
MPX5100GVSX ............... 5.9-8
MPX5500D . . . . . . . . . . . .. 5.9-6, 5.9-8
MPX5500DP . . . . . . . . . . . . . . . . .. 5.9-8
MPX5500GP ................. 5.9-8
MPX5500GS ................. 5.9-8
MPX5500GSX ................ 5.9-8
MPX5700D . . . . . . . . . . . .. 5.9-6, 5.9-8
MPX5700DP . . . . . . . . . . . . . . . . .. 5.9-8
MPX5700GP ................. 5.9-8
MPX5700GS ................. 5.9-8
MPX5700GSX ................ 5.9-8
MPX5999D . . . . . . . . • . . .. 5.9-6, 5.9-8
MPX700A .............. 5.9-6, 5.9-7
MPX700AP . . . . . . . . . . . . . . . . . .. 5.9-7
MPX700AS . . . . . . . . . . . . . . . . . .. 5.9-7
MPX700ASX ................. 5.9-7
MPX700D .............. 5.9-6, 5.9-7
MPX700DP . . . . . . . . . . . . . . . . . .. 5.9-7
MPX700GP . . . . . . . . . . . . . . . . . .. 5.9-7
MPX700GS . . . . . . . . . . . . . . . . . .. 5.9-7
MPX700GSX ................. 5.9-7
MPX7050D . . . . . . . . . . . .. 5.9-6, 5.9-9
MPX7050DP . . . . . . . . . . . . . . . . .. 5.9-9
MPX7050GP ................. 5.9-9
MPX7050GS ................. 5.9-9
MPX7050GSX ................ 5.9-9
MPX7050GVP ................ 5.9-9
MPX7050GVS ................ 5.9-9
MPX7050GVSX ............... 5.9-9
MPX7100A ............. 5.9-6,5.9-9
MPX7100AP .................. 5.9-9
MPX7100AS .................. 5.9-9
MPX7100ASX ................ 5.9-9
MPX7100D ......•...... 5.9-6,5.9-9
MPX7100DP .................. 5.9-9
MPX7100GP ................. 5.9-9
MPX7100GS ................. 5.9-9
MPX7100GSX ................ 5.9-9
MPX7100GVP ................ 5.9-9
MPX7100GVS ................ 5.9-9
MPX7100GVSX . . . . . . . . . . . . . .. 5.9-9
MPX7200A ............. 5.9-6,5.9-9
MPX7200AP .................. 5.9-9
MPX7200AS .................. 5.9-9
MPX7200ASX ................ 5.9-9
MPX7200D ... . . . . . . . . .. 5.9-6, 5.9-9
MPX7200DP . . . . . . . . . . . . . . . . .. 5.9-9
MPX7200GP ........•.....•.. 5.9-9
MPX7200GS ........•.....•.. 5.9-9
Motorola Master Selection Guide
Device Index
Page
MPX7200GSX ................ 5.9-9
MPX7200GVP ................ 5.9-9
MPX7200GVS ................ 5.9-9
MPX7200GVSX . . . . . . . . . . . . . .. 5.9-9
MPX906D .............. 5.9-6, 5.9-7
MPX906GVW . . . . . . . . . . . . . . . .. 5.9-7
MRA1000-14L .............. 5.10-12
MRA1000-7L ............... 5.10-12
MRA4003 ................... 5.6-13
MRA4004 ................... 5.6-13
MRA4005 ................... 5.6-13
MRA4006 ................... 5.6-13
MRA4007 ................... 5.6-13
MRA4935T3 ................. 5.6-13
MRA4936T3 ................. 5.6-13
MRA4937T3 ................. 5.6-13
MRFA2600 ................. 5.10-29
MRFA2602 ................. 5.10-29
MRFA2604 ................. 5.10-29
MRFIC0001 ................ 5.10-22
MRFIC0903 ................ 5.10-21
MRFIC0904 ................ 5.10-23
MRFIC0910 ................ 5.10-23
MRFIC0911 ................ 5.10-23
MRFIC0912 ................ 5.10-23
MRFIC0913 ................ 5.10-24
MRFIC0914 ................ 5.10-24
MRFIC0915 ........ 5.10-21, 5.10-22
MRFIC0916 ........ 5.10-21, 5.10-22
MRFIC0917 ................ 5.10-24
MRFIC1501 ................ 5.10-21
MRFIC1801 ................ 5.10-21
MRFIC1803 ........ 5.10-24, 5.10-25
MRFIC1804 ................ 5.10-22
MRFIC1806 ................ 5.10-24
MRFIC1807 ................ 5.10-25
MRFIC1808 ................ 5.10-21
MRFIC1813 ........ 5.10-24,5.10-25
MRFIC1814 ................ 5.10-22
MRFIC1816 ................ 5.10-24
MRFIC1818 ................ 5.10-24
MRFIC2001 ................ 5.10-21
MRFIC2002 ................ 5.10-23
MRFIC2003 ................ 5.10-21
MRFIC2004 ................ 5.10-23
MRFIC2006 ................ 5.10-23
MRFIC2101 ................ 5.10-23
MRFIC2401 ................ 5.10-22
MRFIC2403 ................ 5.10-25
MRFIC2404 ................ 5.10-25
MRF0211LT1 ....... 5.10-17,5.10-18
MRF1000MA ............... 5.10-10
MRF1000MB ............... 5.10-10
MRF10005 ................. 5.10-10
MRF10031 ................. 5.10-10
MRF1004MA ............... 5.10-10
MRF10070 ................. 5.10-11
MRF10120 ................. 5.10-10
MRF10150 ................. 5.10-11
MRF1029 .................. 5.10-12
MRF1032 .................. 5.10-12
MRF10350 ................. 5.10-11
MRF10500 ................. 5.10-11
MRF10501 ................. 5.10-11
MRF1090MA ............... 5.10-10
MRF1150MA ............... 5.10-10
MRF134 .................... 5.10-4
7.1-21
Device Index
Page
MRF136 .................... 5.10-4
MRF136Y ................... 5.10-4
MRF137 .................... 5.10-4
MRF1375 .................. 5.10-10
MRF138 .................... 5.10-4
MRF140 .................... 5.10-4
MRF141 .................... 5.10-4
MRF141G ................... 5.10-4
MRF148 .................... 5.10-4
MRF150 .................... 5.10-4
MRF15030 ................. 5.10-13
MRF15060 ................. 5.10-13
MRF15090 ................. 5.10-13
MRF151 .................... 5.10-4
MRF151G ................... 5.10-4
MRF154 .................... 5.10-4
MRF157 .................... 5.10-4
MRF158 .................... 5.10-5
MRF160 .................... 5.10-5
MRF16006 ................. 5.10-10
MRF16030 ................. 5.10-10
MRF164W ................... 5.10-5
MRF166C ................... 5.10-5
MRF166W ................... 5.10-5
MRF173 .................... 5.10-4
MRF174 .................... 5.10-4
MRF175GU ................. 5.10-5
MRF175GV .................. 5.10-4
MRF175LU .................. 5.10-5
MRF175LV .................. 5.10-4
MRF176GU ................. 5.10-5
MRF176GV .................. 5.10-4
MRF177 .................... 5.10-5
MRF177M ................... 5.10-5
MRF181 .................... 5.10-5
MRF182 .................... 5.10-5
MRF182S ................... 5.10-5
MRF183 .................... 5.10-5
MRF183S ................... 5.10-5
MRF184 .................... 5.10-5
MRF185 .................... 5.10-5
MRF1946 ................... 5.10-7
MRF1946A .................. 5.10-7
MRF2000-5L ............... 5.10-12
MRF20060 ................. 5.10-13
MRF224 .................... 5.10-7
MRF240 .................... 5.10-7
MRF247 .................... 5.10-7
MRF255 .................... 5.10-4
MRF2628 ................... 5.10-7
MRF3094 .................. 5.10-12
MRF3095 .................. 5.10-12
MRF3096 .................. 5.10-12
MRF3104 .................. 5.10-12
MRF3105 .................. 5.10-12
MRF3106 .................. 5.10-12
MRF313 .................... 5.10-7
MRF314 .................... 5.10-6
MRF316 .................... 5.10-6
MRF317 .................... 5.10-6
MRF321 .................... 5.10-7
MRF323 .................... 5.10-7
MRF325 .................... 5.10-7
MRF326 .................... 5.10-7
MRF327 .................... 5.10-7
MRF329 .................... 5.10-7
MRF3866R2 ................ 5.10-17
Device Index
Device Index
Device Index
Page
MRF392 .................... 5.10-7
MRF393 .................... 5.10-7
MRF421 .................... 5.10-6
MRF422 .................... 5.10-6
MRF426 ...............•.... 5.10-6
MRF429 .................... 5.10-6
MRF4427 ........... 5.10-7,5.10-17
MRF448 .................... 5.10-6
MRF454 .................... 5.10-6
MRF455 .................... 5.10-6
MRF492 .................... 5.10-6
MRF5003 ................... 5.10-5
MRF5007 ................... 5.10-5
MRF5015 ................... 5.10-5
MRF5035 ................... 5.10-5
MRF5211LT1 ....... 5.10-17,5.10-18
MRF553 ............ 5.10-7,5.10-16
MRF555 ............ 5.10-a, 5:10-16
MRF557 ............ 5.10-a, 5.10-16
MRF559 ............ 5.10-8,5.10-16
MRF571 ........... 5.10-16,5.10-18
MRF5711LT1 ....... 5.10-17,5.10-18
MRF581 ........... 5.10-a, 5.10-16,
5.10-18,5.10-19
MRF581A .......... 5.10-16,5.10-19
MRF5811 LT1 ....... 5.10-17,5.10-18
MRF5812 ......... 5.10-17,5.10-18,
5.10-19
MRF587 ........... 5.10-17,5.10-19
MRF5943 .......... 5.10-17,5.10-19
MRF6401 .................. 5.10-13
MRF6402 .................. 5.10-13
MRF6404 .................. 5.10-13
MRF6408 .................. 5.10-13
MRF641 .................... 5.10-6
MRF6414 .................. 5.10-12
MRF644 .................... 5.10-6
MRF650 .................... 5.10-6
MRF652 .................... 5.10-6
MRF652S ................... 5.10-6
MRF653 .................... 5.10-6
MRF653S ................... 5.10-6
MRF654 .................... 5.10-6
MRF658 .................... 5.10-6
MRF837 ............ 5.10-a, 5.10-16
MRF8372 ........... 5.10-a, 5.10-17
MRF839F ................... 5.10-8
MRF840 .................... 5.10-6
MRF842 .................... 5.10-6
MRF844 .................... 5.10-a
MRF847 .................... 5.10-6
MRF857 .................... 5.10-9
MRF857S ................... 5.10-9
MRF858 .................... 5.10-9
MRF858S ................... 5.10-9
MRF859 .................... 5.10-9
MRF859S ................... 5.10-9
MRF860 .................... 5.10-9
MRF861 .................... 5.10-9
MRF862 .................... 5.10-9
MRF880 .................... 5.10-9
MRF890 .................... 5.10-9
MRF891 .................... 5.10-9
MRF891S ...........•....... 5.10-9
MRF892 ........•........... 5.10-9
MRF894 .................... 5.10-9
MRF896 .................... 5.10-9
Device Index
Device Index
Page
MRF897 .................... 5.10-9
MRF897R ................... 5.10-9
MRF898 .................... 5.10-9
MRF899 .................... 5.10-9
MRF901 ........... 5.10-16,5.10-18
MRF9011LT1 ....... 5.10-17,5.10-18
MRF927T1 ......... 5.10-17,5.10-18
MRF9331LT1 ............... 5.10-17
MRF941 ........... 5.10-16,5.10-18
MRF9411BLT1 ...... 5.10-17,5.10-18
MRF9411LT1 ....... 5.10-17,5.10-18
MRF947AT1 ........ 5.10-17,5.10-18
MRF947BT1 ........ 5.10-17,5.10-18
MRF947RT3 ........ 5.10-17,5.10-18
MRF947T1 ......... 5.10-17,5.10-18
MRF951 ........... 5.10-16,5.10-18
MRF9511ALT1 ...... 5.10-17,5.10-18
MRF9511LT1 ....... 5.10-17,5.10-18
MRF957T1 ......... 5.10-17,5.10-18
MRW2001 .................. 5.10-11
MRW2005 .................. 5.10-11
MRW3001 .................. 5.10-11
MRW3003 .................. 5.10-11
MRW3005 .................. 5.10-11
MRW53502 ................. 5.10-13
MRW53601 ................. 5.10-13
MRW54001 ................. 5.10-13
MRW54601 ................. 5.10-13
MR2504 ..................... 5.6-13
MR2510 ..................... 5.6-13
MR2535L ...... 5.2-15,5.6-3,5.6-13
MR2535S ............. 5.6-3,5.6-13
MR754 ...................... 5.6-13
MR760 ...................... 5.6-13
MR852 ...................... 5.6-13
MR856 ...................... 5.6-13
MSA1022-BT1 ............... 5.1-13
MSA1022-CT1 .............. 5.1-13
MSB1218A-RT1 ............. 5.1-11
MSB709-RT1 ................ 5.1-11
MSB709-ST1 ................ 5.1-11
MSB71O-QT1 ............... 5.1-11
MSB710-RT1 ................ 5.1-11
MSB81T1 ................... 5.1-13
MSC1621T1 ................. 5.1-13
MSC2295-BT1 .............. 5.1-13
MSC2295-CT1 .............. 5.1-13
MSC2404-CT1 .............. 5.1-13
MSC3130T1 ................. 5.1-13
MSC3930-BT1 .............. 5.1-11
MSD1010T1 .......... 5.1-15,5.1-40
MSD1328-RT1 .............. 5.1-11
MSD1819A-RT1 ............. 5.1-11
MSD601-RT1 ............... 5.1-11
MSD601-5T1 ................ 5.1-11
MSD602-RT1 ............... 5.1-11
MTB1N100E ................. 5.4-11
MTB10N40E ................. 5.4-11
MTB15N06V ........... 5.4-6,5.4-11
MTB15N06VL. ................ 5.4-6
MTB16N25E ................. 5.4-11
MTB2P50E .................. 5.4;-19
MTB20N06V . . . . . . . . . . . . . . . . .. 5.4-6
MTB20N20E ................. 5.4-11
MTB23P06E ................. 5.4-19
MTB23P06V . . . . . . . . . . . . . . . . .. 5.4-6
MTB3N100E ................. 5.4-11
7.1-22
Device Index
Page
MTB3N120E ................. 5.4-11
MTB30N06EL. ............... 5.4-11
MTB30N06VL .....•.... 5.4-6, 5.4-21
MTB30P06V . . . . . . . . . . . . . . . . .. 5.4-6
MTB33N10E ................. 5.4-11
MTB36N06V ........... 5.4-6,5.4-11
MTB4N80E .................. 5.4-11
MTB50N06V ........... 5.4-6,5.4-11
MTB50N06VL ... 5.4-6,5.4-11,5.4-21
MTB50P03HDL ....... 5.4-3,5.4-19,
5.4-21
MTB52N06V . . . . . . . . . . . . . . . . .. 5.4-6
MTB6N60E .................. 5.4-11
MTB60N06HD ......... 5.4-3,5.4-11
MTB75N03HDL ........ 5.4-3, 5.4-11,
5.4-21
MTB75N05HD ......... 5.4-3,5.4-11
MTB75N06HD ......... 5.4-3,5.4-11
MTB8N50E .................. 5.4-11
MTB9N25E .................. 5.4-11
MTDF1 N02HD .......... 5.4-4,5.4-9
MTDF1 N03HD .......... 5.4-4, 5.4-9
MTD1N50E .................. 5.4-10
MTD1N60E .................. 5.4-10
MTD1N80E .................. 5.4-10
MTD1P50E .................. 5.4-18
MTD10N05E ................. 5.4-10
MTD10N10EL ........ 5.4-10,5.4-20
MTD15N06V .... 5.4-5,5.4-10,5.4-20
MTD15N06VL ................ 5.4-5
MTD2N40E .................. 5.4-10
MTD2N50E .................. 5.4-10
MTD20N03HDL ....... 5.4-3,5.4-10,
5.4-20
MTD20N06HD ......... 5.4-3,5.4-10
MTD20N06HDL . 5.4-3,5.4-10,5.4-20
MTD20N06V . . . . . . . . . • . . . . . . .. 5.4-5
MTD20P03HDL ....... 5.4-3,5.4-18,
5.4-20
MTD20P06HDL ....... 5.4-3,5.4-18,
5.4-20
MTD2955V ................... 5.4-6
MTD3N25E .................. 5.4-10
MTD30P06V ................. 5.4-19
MTD3055V ............ 5.4-5,5.4-10
MTD3055VL .... 5.4-5,5.4-10,5.4-20
MTD4N20E .................. 5.4-~0
MTD5N10E .................. 5.4-10
MTD5N25E .................. 5.4-10
MTD5P06E .................. 5.4-18
MTD5P06V ............ 5.4-6,5.4-18
MTD6N10E .................. 5.4-10
MTD6N15 ................... 5.4-10
MTD6N20E .................. 5.4-10
MTD6P10E .... ; ............. 5.4-18
MTD8N06E .................. 5.4-10
MTD9N10E .................. 5.4-10
MTP1N100E ................. 5.4-13
MTP1N50E .................. 5.4-13
MTP1N60E .................. 5.4-13
MTP10N10E ................. 5.4-13
MTP10N10EL ......... 5.4-13,5.4-21
MTP10N40E ................. 5.4-13
MTP12N10E ................. 5.4-13
MTP12P10 .................. 5.4-19
MTP15N05EL ......... 5.4-14,5.4-21
MTP15N06V ........... 5.4-5,5.4-14
Motorola Master Selection Guide
Device Index
Device Index
Page
MTP15N06VL ... 5.4-5,5.4-14,5.4-21
MTP16N25E ................. 5.4-13
MTP2N40E .................. 5.4-13
MTP2N50E .................. 5.4-13
MTP2N60E .................. 5.4-13
MTP2P50E .................. 5.4-19
MTP20N06V ........... 5.4-5,5.4-14
MTP20N20E ................ , 5.4-13
MTP23P06V ........... 5.4-6,5.4-19
MTP27N10E ................. 5.4-13
MTP2955V ............ 5.4-6,5.4-19
MTP3N100E ................. 5.4-13
MTP3N120E ................. 5.4-13
MTP3N25E .................. 5.4-13
MTP3N50E .................. 5.4-13
MTP3N60E ............ 4.8-9,5.4-13
MTP30N06EL . . . . . . . . . . . . . . .. 5.4-21
MTP30N06VL ... 5.4-5,5.4-14,5.4-21
MTP30P06V . . . . . . . . . . . . . . . . .. 5.4-6
MTP3055EL ................. 5.4-21
MTP3055V ............ 5.4-5,5.4-14
MTP3055VL .... 5.4-5,5.4-14,5.4-21
MTP33N10E ................. 5.4-13
MTP36N06V ........... 5.4-5,5.4-14
MTP4N40E .................. 5.4-13
MTP4N50E .................. 5.4-13
MTP4NBOE .................. 5.4-13
MTP5N40E .................. 5.4-13
MTP5P06V ............ 5.4-6,5.4-19
MTPSON05EL . . . . . • . . . . . . . . .. 5.4-21
MTP50N06EL. . . . . . . . . . . . . . .. 5.4-21
MTP50N06V ........... 5.4-5,5.4-14
MTP50N06VL ... 5.4-5,5.4-14,5.4-21
MTP50P03HDL ....... 5.4-3,5.4-19,
5.4-21
MTP52N06V ........... 5.4-5,5.4-14
MTP52N06VL ... 5.4-5,5.4-14,5.4-21
MTP6N60E .................. 5.4-13
MTP6P20E .................. 5.4-19
MTP60N06HD ......... 5.4-3,5.4-14
MTP7N20E . . . . . . . . . . . . . . . . .. 5.4-13
MTP75N03HDL ....... 5.4-3,5.4-14,
5.4-21
MTP75N05HD ......... 5.4-3,5.4-14
MTP75N06HD ......... 5.4-3,5.4-14
MTPBN50E .................. 5.4-13
MTP9N25E .................. 5.4-13
MTSF1P02HD ......... 5.4-4,5.4-17
MTSF3N03HD ........ .. 5.4-4, 5.4-9
MTV10N100E ................ 5.4-12
MTV16N50E ................. 5.4-12
MTV20N50E ................. 5.4-12
MTV25N50E ................ , 5.4-12
MTV32N05E .... , ............ 5.4-12
MTV32N20E ................. 5.4-12
MTV6N100E .... , ............ 5.4-12
MTW10N100E ............... 5.4-15
MTW14N50E ................ 5.4-15
MTW16N40E ................ 5.4-15
MTW20N50E ................ 5.4-15
MTW24N40E ................ 5.4-15
MTW32N20E ................ 5.4-15
MTW32N25E ................ 5.4-15
MTW35N15E ................ 5.4-15
MTW45N10E ................ 5.4-15
MTW6N100E .............•.. 5.4-15
MTW7NBOE ................. 5.4-15
Motorola Master Selection Guide
Device Index
Page
MTWBN60E ................. 5.4-15
MTY100N10E ................ 5.4-16
MTY20N50E ................. 5.4-16
MTY25N60E ................. 5.4-16
MTY30N50E ................. 5.4-16
MTY55N20E ................. 5.4-16
MUN2111T1 ................. 5.1-12
MUN2112T1 ................. 5.1-12
MUN2113T1 ................. 5.1-12
MUN2114T1 ................. 5.1-12
MUN2115T1 ................. 5.1-12
MUN2116T1 ................. 5.1-12
MUN2130T1 ................. 5.1-12
MUN2131T1 ................. 5.1-12
MUN2132T1 ................. 5.1-12
MUN2133T1 ................. 5.1-12
MUN2134T1 ................. 5.1-12
MUN2211T1 ................. 5.1-12
MUN2212T1 ................. 5.1-12
MUN2213T1 ................. 5.1-12
MUN2214T1 ................. 5.1-12
MUN2215T1 ................. 5.1-12
MUN2216T1 ................. 5.1-12
MUN2230T1 ................. 5.1-12
MUN2231T1 ................. 5.1-12
MUN2232T1 ................. 5.1-12
MUN2233T1 ................. 5.1-12
MUN2234T1 ................. 5.1-12
MUN5111T1 ................. 5.1-12
MUN5112T1 ................. 5.1-12
MUN5113T1 ................. 5.1-12
MUN5114T1 ................. 5.1-12
MUN5115T1 ................. 5.1-12
MUN5116T1 ................. 5.1-12
MUN5130T1 ................. 5.1-12
MUN5131T1 ................. 5.1-12
MUN5132T1 ................. 5.1-12
MUN5133T1 ................. 5.1-12
MUN5134T1 ................. 5.1-12
MUN5211T1 ................. 5.1-12
MUN5212T1 ................. 5.1-12
MUN5213T1 ................. 5.1-12
MUN5214T1 ................. 5.1-12
MUN5215T1 ................. 5.1-12
MUN5216T1 ................. 5.1-12
MUN5230T1 ................. 5.1-12
MUN5231T1 ................. 5.1-12
MUN5232T1 ................. 5.1-12
MUN5233T1 ................. 5.1-12
MUN5234T1 ................. 5.1-12
MURB1620CT ............... 5.6-10
MURB1660CT ............... 5.6-10
MURD320 ................... 5.6-10
MURD620CT ................ 5.6-10
MURF1620CTK .............. 5.6-11
MURF1660CTK .............. 5.6-11
MURFB20K .................. 5.6-11
MURHBB40CT ................ 5.6-3
MURHBB40CTK ............. 5.6-10
MURHB40CT .......... 5.6-3,5.6-11
MURHB60CT .......... 5.6-3,5.6-11
MURP20020CTK ............. 5.6-12
MURP20040CTK ............. 5.6-12
MURS120T3 ................. 5.6-10
MURS160T3 ................. 5.6-10
MURS320T3 ................. 5.6-10
MURS360T3 ................. 5.6-10
7.1-23
Device Index
Page
MUR10120E ........... 5.6-3,5.6-11
MUR10150E ........... 5.6-3,5.6-11
MUR1100E .................. 5.6-10
MUR120 .................... 5.6-10
MUR1520 ................... 5.6-11
MUR1540 ................... 5.6-11
MUR1560 ................... 5.6-11
MUR160 .................... 5.6-10
MUR1620CT ................ 5.6-11
MUR1620CTR ............... 5.6-11
MUR1640CT ................ 5.6-11
MUR1660CT ................ 5.6-11
MUR3020PT ................. 5.6-12
MUR3020WT ................ 5.6-12
MUR3040K .................. 5.6-12
MUR3040PT ................. 5.6-12
MUR3040WT ................ 5.6-12
MUR3060PT ................. 5.6-12
MUR3060WT ................ 5.6-12
MUR30BOK .................. 5.6-12
MUR4100E .................. 5.6-10
MUR420 .................... 5.6-10
MUR460 .................... 5.6-10
MUR6040 ................... 5.6-12
MUR62OCT .................. 5.6-11
MURB100E .................. 5.6-11
MURB20 .................... 5.6-11
MURB40K .................. , 5.6-11
MURB60K ................... 5.6-11
MUR880E ............. 5.6-3,5.6-11
MVAM10B ................... 5.1-31
MVAM109 ................... 5.1-31
MVAM115 ................... 5.1-31
MVAM125 ................... 5.1-31
MV104 ...................... 5.1-27
MV1403 ..................... 5.1-31
MV1404 ..................... 5.1-31
MV1405 ..................... 5.1-31
MV1620 ..................... 5.1-26
MV1624 ..................... 5.1-26
MV1626 ..................... 5.1-26
MV162B ..................... 5.1-26
MV1630 ..................... 5.1-26
MV1634 ..................... 5.1-26
MV1636 ..................... 5.1-26
MV163B ..................... 5.1-26
MV1640 ..................... 5.1-26
MV1642 ..................... 5.1-26
MV1644 ..................... 5.1-26
MV164B ..................... 5.1-26
MV1650 ..................... 5.1-26
MV209 ...................... 5.1-30
MV2101 ..................... 5.1-26
MV2103 ..................... 5.1-26
MV21 04 ..................... 5.1-26
MV2105 ..................... 5.1-26
MV2107 ..................... 5.1-26
MV210B ..................... 5.1-26
MV2109 ..................... 5.1-26
MV2111 ..................... 5.1-26
MV2113 ..................... 5.1-26
MV2114 ..................... 5.1-26
MV2115 ..................... 5.1-26
MV409 ...................... 5.1-30
MV7005T1 .................. 5.1-31
MV7404T1 .................. 5.1-31
MZD10RL ................... 5.2-1B
Device Index
Device Index
Device Index
Page
MZD100 ....................
MZDllRL ...................
MZDll0 .....................
MZD12RL ...................
MZD120 ....................
MZD13RL ...................
MZD130 ....................
MZD15RL ...................
MZD16RL ...................
MZD18RL ...................
MZD180 ....................
MZD20RL ...................
MZD22RL ...................
MZD24RL ...................
MZD27RL ...................
MZD3.9RL ..................
MZD30RL ...................
MZD33RL ...................
MZD36RL ...................
MZD39RL ...................
MZD4.3RL ..................
MZD4.7RL ..................
MZD43RL ...................
MZD47RL ...................
MZD5.1RL ..................
MZD5.6RL ..................
MZD51 ......................
MZD56 ......................
MZD6.2RL ..................
MZDS.8RL ..................
MZD62 ......................
MZD68 ......................
MZD7.5RL ..................
MZD75 ......................
MZD8.2RL ..................
MZD82 ......................
MZD9.1RL ..................
MZD91 ......................
MZPY10RL ..................
MZPY100RL .................
MZPYllRL ..................
MZPY12RL ..................
MZPY15RL ..................
MZPY18RL ..................
MZPY22RL ..................
MZPY24RL ..................
MZPY27RL ..................
MZPY3.9RL .................
MZPY43RL ..................
MZPY47RL ..................
MZPY5.1RL .................
MZPY5.6RL .................
MZPY6.8RL .................
MZPY7.5RL .................
MZPYB.2RL .................
MZPYB2RL ..................
MZP4728A ..................
MZP4729A ..................
MZP4734A ..................
MZP4735A ..................
MZP4737A ..................
MZP4738A ..................
MZP4740A ..................
MZP4741A ..................
MZP4744A ..................
MZP4745A ..................
MZP4746A ..................
5.2-19
5.2-18
5.2-19
5.2-18
5.2-19
5.2-18
5.2-19
5.2-18
5.2-18
5.2-18
5.2-19
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-1B
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-19
5.2-18
5.2-19
5.2-18
5.2-19
5.2-18
5.2-19
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-19
5.2-18
5.2-18
5.2-1B
5.2-18
5.2-18
5.2-1B
5.2-18
5.2-1B
5.2-1B
5.2-1B
5.2-18
Device Index
Device Index
Page
MZP4749A .................. 5.2-1B
MZP4750A .................. 5.2-1B
MZP4751A .................. 5.2-18
MZP4752A .................. 5.2-1B
MZP4753A .................. 5.2-18
MZ4099 ..................... 5.2-16
MZ4101 ..................... 5.2-16
MZ4104 ..................... 5.2-16
MZ4614 ..................... 5.2-16
MZ4615 ..................... 5.2-16
MZ4616 ..................... 5.2-16
MZ4617 ..................... 5.2-16
MZ461B ..................... 5.2-16
MZ4619 ..................... 5.2-16
MZ4620 .. .. .. .. .. .. .. .. .. ... 5.2-16
MZ4622 .................. '" 5.2-16
MZ4623 ..................... 5.2-16
MZ4624 ..................... 5.2-16
MZ4625 ..................... 5.2-16
MZ4626 ..................... 5.2-16
MZ4627 ..................... 5.2-16
MZ5520B ................... 5.2-16
MZ5521B ................... 5.2-16
MZ5523B ................... 5.2-16
MZ5524B ................... 5.2-16
MZ5525B ................... 5.2-16
MZ5527B ................... 5.2-16
MZ5529B ................... 5.2-16
M1MA141KT1 ............... 5.1-35
M1MA141WATl .............. 5.1-36
M1MA141WKTl ............. 5.1-36
M1MA142KTl ............... 5.1-35
M1MA142WAT1 .............. 5.1-36
M1MA142WKTl ............. 5.1-36
M1MA151ATl ............... 5.1-35
M1MA151KTl ............... 5.1-35
M1MA151WATl .............. 5.1-36
M1MA151WKT1 ............. 5.1-36
M1MA174T1 ................. 5.1-35
M143120B1EVBU ............. 2.7-8
M143120EVK ................. 2.7-8
M143150B1EVBU ............. 2.7-8
M143150EVK ................. 2.7-B
M143204EVK ................. 2.7-B
M143206EVK ................. 2.7-8
Ml43207EVK ................. 2.7-8
M14320BEVK ................. 2.7-8
M143213EVK5 ................ 2.7-B
M143213EVK6 ................ 2.7-8
M143214EVK5 ................ 2.7-8
M143214EVK6 ................ 2.7-8
M143215EVK5 ................ 2.7-8
M143215EVKS ................ 2.7-8
M143221EVK ................. 2.7-8
M143222EVK ................. 2.7-8
M143223EVK ................. 2.7-8
M143226EVK ................. 2.7-B
M143232EVK ................. 2.7-8
M6BCBL05B ................. 2.5-16
MSBCBL05C ................. 2.5-16
MSBHC05BPGMR ............ 2.6-23
M68HC05C5EVS . . . . . . . . . . . .. 2.6-23
M68HC05C9EVS . . . . . . . . . . . .. 2.6-23
M6BHC05D32EVS ........... 2.6-23
M6BHC05El EVS ............. 2.6-23
M6BHC05F6EVM ............ 2.6-23
M68HC05FBEVM ............ 2.6-23
7.1-24
Device Index
Page
M6BHC05Gl EVM ............ 2.6-23
M68HC05Gl0EVM ........... 2.6-23
M6BHC05G9EVM ............ 2.6-23
M68HC05H2EVS . . . . . . . . . . . .. 2.6-23
M68HC0518EVS ............. 2.6-23
M68HC05J3EVS ............. 2.6-23
M6BHC05L1EVM . . . . . . . . . . . .. 2.6-24
M6BHC05L10EVM ........... 2.6-24
M68HC05LllEVM ............ 2.6-24
M68HC05L2EVS . . . . . • . . . . . .. 2.6-24
M6BHC05L4EVS ... . . . . . . . . .. 2.6-24
M68HC05L5EVS . . . . . . . . . . . .. 2.6-24
M6BHC05L9EVM2 ........... 2.6-24
M68HC05M4EVM ............ 2.6-24
M68HC05PGMR-2 ........... 2.6-23
M68HC05P3EVS . . . . . . . . . . . .. 2.6-24
M6BHC05P8EVS ...... 2.6-23, 2.6-24
M68HC05P9EVS . . . . . . . . . . . .. 2.6-24
M68HC05SCEVS ............ 2.6-24
M68HC05T12EVM ........... 2.6-24
M68HC05T2EVS . . . . . . . . . . . .. 2.6-24
M68HC05T4EVM ............ 2.6-24
M68HC05T7EVM ............ 2.6-24
M68HC05X16EVS ..... 2.6-23,2.6-24
M68HC05X4EVS . . . . . . . . . . . .. 2.6-24
M6BHC11EVB ............... 2.6-24
M68HCllEVBU .............. 2.6-24
M68HCllEVB2 .............. 2.6-24
M68HCllEVM ............... 2.6-24
M68HC705F8PGMR . . . . . . . . .. 2.6-23
M6BHC705G1PGMR ......... 2.6-23
M68HC705G9PGMR ......... 2.6-23
M68HC705J2PGMR . . . . . . . . .. 2.6-23
M68HC705KIGANG .......... 2.6-23
M68HC705L2PGMR . . . . . . . . .. 2.6-24
M68HC705L4PGMR ... 2.6-23, 2.6-24
M6BHC705L5PGMR . . . . . . . . .. 2.6-24
M68HC705P9PGMR . . . . . . . . .. 2.6-24
M6BHC705Tl0PGMR .•....... 2.6-24
M68HC705T12PGMR ......... 2.6-24
M68HC705X16PGMR ......... 2.6-24
M68HC705X4PGMR . . . . . . . . .. 2.6-24
M6BHC711D3EVB ............ 2.6-24
M68MEVB16Z1 .............. 2.6-25
M6BMEVB333 ............... 2.6-25
M68TB05SR3B42 ............ 2.5-16
M6BTB05SR3P40 ............ 2.5-16
M68TC05SR3FB44 ........... 2.5-16
M68701 EVM ................. 2.6-23
NE556D ..................... 4.10-2
NE556N ..................... 4.10-2
PBF259 ...................... 5.1-7
PBF259S ..................... 5.1-7
PBF493 ...................... 5.1-7
PBF493S ..................... 5.1-7
PC6BF333 . .. . .. . .. . .. . .. .... 2.6-21
PC68HCllGO ................ 2.6-7
PC68HCllG5 ................ 2.6-7
PC6BHC11G7 ................ 2.6-7
PC68HCllJ6 ................. 2.6-7
PC6BHC711D3 ............... 2.6-8
PC6BHC711E20 .............. 2.6-8
PC6BHC711E9 ................ 2.6-8
PC68HC711G5 ............... 2.6-8
PC68HC711J6 ................ 2.6-8
PC68HC711 K4 ................ 2.6-8
PC68HC711L6 ................ 2.6-8
Motorola Master Selection Guide
Device Index
Device Index
Page
PC6SHC711M2 ............... 2.6-8
PC6SHC711N4 ............... 2.6-8
PZTA14T1 ..................• 5.1-16
PZTA42T1 ................... 5.1-16
PZTA64T1 ................... 5.1-16
PZTA92T1 ..................• 5.1-16
PZTA96T1 ................... 5.1-16
PZT2222AT1 ................ 5.1-16
PZT2907AT1 ................ 5.1-16
PZT651T1 ................... 5.1-16
PZT751T1 ................... 5.1-16
P2N2222A ................... 5.1-7
P2N2907A ..•..............•. 5.1-7
P6KE10A .................... 5.2-4
P6KE10CA ................... 5.2-4
P6KE11A ..................... 5.2-4
P6KE11CA ................... 5.2-4
P6KE12A .................... 5.2-4
P6KE12CA ................... 5.2-4
P6KE120A ................... 5.2-4
P6KE120CA .................. 5.2-4
P6KE13A ...•................ 5.2-4
P6KE13CA ......... . . . . . . . . .. 5.2-4
P6KE130A ................... 5.2-5
P6KE15A .................... 5.2-4
P6KE15CA ... . . . . . . . . . . . . . . .. 5.2-4
P6KE150A ................... 5.2-5
P6KE150CA ......•........... 5.2-5
P6KE16A .................... 5.2-4
P6KE16CA ................... 5.2-4
P6KE160A ................... 5.2-5
P6KE16OCA .................. 5.2-5
P6KE1SA .................... 5.2-4
P6KE1SCA ................... 5.2-4
P6KE1S0A ................... 5.2-5
P6KE1S0CA .................. 5.2-5
P6KE20A .................... 5.2-4
P6KE20CA ................... 5.2-4
P6KE200A ................... 5.2-5
P6KE200CA ................. , 5.2-5
P6KE22A .................... 5.2-4
P6KE22CA ............ . . . . . .. 5.2-4
P6KE24A .................... 5.2-4
P6KE24CA ................... 5.2-4
P6KE27A .................... 5.2-4
P6KE27CA ..... . . . . . . . . . . . . .. 5.2-4
P6KE30A .................... 5.2-4
P6KE30CA ................... 5.2-4
P6KE33A .................... 5.2-4
P6KE33CA ..•................ 5.2-4
P6KE36A .................... 5.2-4
P6KE36CA ................... 5.2-4
P6KE39A .................... 5.2-4
P6KE39CA .......... . . . . . . . .. 5.2-4
P6KE43A .................... 5.2-4
P6KE43CA .......... . . . . . . . .. 5.2-4
P6KE47A .................... 5.2-4
P6KE47CA '" ................ 5.2-4
P6KE51A .................... 5.2-4
P6KE51CA ................... 5.2-4
P6KE56A .................... 5.2-4
P6KE56CA ... . . . . . . . . . . . . . . .. 5.2-4
P6KE6.SA . . . . . . . . . . . . . . . . . . .. 5.2-4
P6KE6.SCA .................. 5.2-4
P6KE62A .................... 5.2-4
P6KE62CA ................... 5.2-4
P6KE68A .................... 5.2-4
Motorola Master Selection Guide
Device Index
Page
P6KE6SCA '" . . . . . . . . . . . . . . .. 5.2-4
P6KE7.5A .................... 5.2-4
P6KE7.5CA .................. 5.2-4
P6KE75A .................... 5.2-4
P6KE75CA .......... . . . . . . . .. 5.2-4
P6KES.2A . . . . . . . . . . . . . . . . . . .. 5.2-4
P6KES.2CA .................. 5.2-4
P6KES2A .................... 5.2-4
P6KES2CA ................... 5.2-4
P6KE9.1A .................... 5.2-4
P6KE9.1CA .................. 5.2-4
P6KE91A .................... 5.2-4
P6KE91 CA ..... . . . . . . . . . . . . .. 5.2-4
P6SMB10AT3 ................ 5.2-12
P6SMB100AT3 .............. 5.2-12
P6SMB110AT3 ............... 5.2-12
P6SMB12AT3 ................ 5.2-12
P6SMB12CAT3 .............. 5.2-12
P6SMB120AT3 .............. 5.2-12
P6SMB13AT3 ................ 5.2-12
P6SMB13CAT3 .............. 5.2-12
P6SMB15AT3 ................ 5.2-12
P6SMB15CAT3 .............. 5.2-12
P6SMB150AT3 .............. 5.2-12
P6SMB16AT3 ................ 5.2-12
P6SMB16CAT3 .............. 5.2-12
P6SMB160AT3 .............. 5.2-12
P6SMB170AT3 .............. 5.2-12
P6SMB1SAT3 ............... , 5.2-12
P6SMB1SCAT3 .............. 5.2-12
P6SMB1S0AT3 .............. 5.2-12
P6SMB20AT3 ................ 5.2-12
P6SMB20CAT3 .............. 5.2-12
P6SMB200AT3 .............. 5.2-12
P6SMB22AT3 ................ 5.2-12
P6SMB22CAT3 .............. 5.2-12
P6SMB24AT3 ................ 5.2-12
P6SMB24CAT3 .............. 5.2-12
P6SMB27AT3 ................ 5.2-12
P6SMB27CAT3 .............. 5.2-12
P6SMB30AT3 ................ 5.2-12
P6SMB30CAT3 .............. 5.2-12
P6SMB33AT3 ................ 5.2-12
P6SMB33CAT3 .............. 5.2-12
P6SMB36AT3 ................ 5.2-12
P6SMB36CAT3 .............. 5.2-12
P6SMB39AT3 ................ 5.2-12
P6SMB39CAT3 .............. 5.2-12
P6SMB47AT3 ................ 5.2-12
P6SMB47CAT3 .............. 5.2-12
P6SMB51AT3 ................ 5.2-12
P6SMB51CAT3 .............. 5.2-12
P6SMB56AT3 ................ 5.2-12
P6SMB56CAT3 .............. 5.2-12
P6SMB6.SAT3 ............... 5.2-12
P6SMB62AT3 ................ 5.2-12
P6SMB62CAT3 .............. 5.2-12
P6SMB6SAT3 ................ 5.2-12
P6SMB6SCAT3 .............. 5.2-12
P6SMB7.5AT3 ............... 5.2-12
P6SMBS2AT3 ................ 5.2-12
P6SMBS2CAT3 .............. 5.2-12
P6SMB9.1AT3 ............... 5.2-12
P6SMB91AT3 ................ 5.2-12
P6SMB91CAT3 .............. 5.2-12
RFAB090B ................. 5.10-29
SAA1042 ............. " ...... 4.3-9
7.1-25
Device Index
Page
SAA1042AV .................. 4.3-9
SA11A ....................... 5.2-2
SA11CA ...................... 5.2-2
SA110A ...................... 5.2-3
SA110CA .................... 5.2-3
SA12A ....................... 5.2-2
SA12CA ..................... 5.2-2
SA13A ....................... 5.2-2
SA13CA ..................... 5.2-2
SA130A ...................... 5.2-3
SA130CA .................... 5.2-3
SA14A ....................... 5.2-2
SA14CA ..................... 5.2-2
SA15A ....................... 5.2-2
SA15CA ..................... 5.2-2
SA16A ....................... 5.2-2
SA16CA ..................... 5.2-2
SA160A ...................... 5.2-3
SA160CA .................... 5.2-3
SA17A ......... " .......... " 5.2-2
SA17CA ..................... 5.2-2
SA 170A .................... " 5.2-3
SA170CA .................... 5.2-3
SA20A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA20CA ..................... 5.2-3
SA24A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA24CA ..................... 5.2-3
SA26A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA26CA ..................... 5.2-3
SA2SA . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA2SCA ..................... 5.2-3
SA30A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA30CA ..................... 5.2-3
SA36A ........•.............. 5.2-3
SA36CA ..................... 5.2-3
SAS.OA ...................... 5.2-2
SA5.0CA .. . . . . . . . . . . . . . . . . . .. 5.2-2
SA51A ....................... 5.2-3
SA51CA ..................... 5.2-3
SA5SA ....................... 5.2-3
SA5SCA ..................... 5.2-3
SA6.0A ...................... 5.2-2
SA6.0CA .. . . . . . . . . . . . . . . . . . .. 5.2-2
SA60A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA60CA ..................... 5.2-3
SA7.0A ...................... 5.2-2
SA7.0CA ..................... 5.2-2
SA75A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA75CA ..................... 5.2-3
SA7SA ....................... 5.2-3
SA7SCA ..................... 5.2-3
SAB.OA ...................... 5.2-2
SAS.OCA .. . . . . . . . . . . . . . . . . . .. 5.2-2
SA90A . . . . . . . . . . . . . . . . . . . . . .. 5.2-3
SA90CA ..................... 5.2-3
SG3525A ................... 4.2-12
SG3526 ..................... 4.2-12
SG3527A ................... 4.2-12
SL5501 ...................... 5.8-6
SN54LSOO .................. 3.1-26
SN54LS01 .................. 3.1-26
SN54LS02 .................. 3.1-2S
SN54LS03 .................. 3.1-26
SN54LS04 .................. 3.1-29
SN54LS05 .................. 3.1-29
SN54LSOS ................•. 3.1-26
SN54LS09 ........•....•.... 3.1-26
Device Index
Device Index
Device Index
Page
SN54LS10 ..................
SN54LS107A ................
SN54LS109A ................
SN54LS11 ...................
SN54LS112A ................
SN54LS113A ................
SN54LS114A ................
SN54LS12 ..................
SN54LS122 .................
SN54LS123 .................
SN54LS125A ................
SN54LS126A ................
SN54LS13 ..................
SN54LS132 .................
SN54LS133 .................
SN54LS137 .................
SN54LS138 .................
SN54LS139 .................
SN54LS14 ..................
SN54LS145 .................
SN54LS147 .................
SN54LS148 .................
SN54LS15 ..................
SN54LS151 .................
SN54LS153 .................
SN54LS155 .................
SN54LS156 .................
SN54LS157 .................
SN54LS158 .................
SN54LS160A ................
SN54LS161A ................
SN54LS162A ................
SN54LS163A ................
SN54LS164 .................
SN54LS165 .................
SN54LS166 .................
SN54LS168 .................
SN54LS169 .................
SN54LS170 .................
SN54LS173A ................
SN54LS174 .................
SN54LS175 .................
SN54LS181 .................
SN54LS190 .................
SN54LS191 .................
SN54LS 192 .................
SN54LS193 .................
SN54LS194A ................
SN54LS195A ................
SN54LS196 .................
SN54LS197 .................
SN54LS20 ..................
SN54LS21 ..................
SN54LS22
...............
SN54LS221 .................
SN54LS240 .................
SN54LS241 .................
SN54LS242 .................
SN54LS243 .................
SN54LS244 .................
SN54LS245 .................
SN54LS247 .................
SN54LS248 .................
SN54LS249 .................
SN54LS251 .................
SN54LS253 .................
SN54LS256 .................
3.1-26
3.1-23
3.1-23
3.1-26
3.1-23
3.1-23
3.1-23
3.1-26
3.1-33
3.1-33
3.1-16
3.1-17
3.1-36
3.1-36
3.1-25
3.1-21
3.1-21
3.1-21
3.1-36
3.1-21
3.1-22
3.1-22
3.1-26
3.1-31
3.1-32
3.1-21
3.1-21
3.1-32
3.1-32
3.1-19
3.1-19
3.1-19
3.1-19
3.1-37
3.1-37
3.1-37
3.1-19
3.1-20
3.1-36
3.1-23
3.1-24
3.1-25
3.1-14
3.1-20
3.1-20
3.1-20
3.1-20
3.1-37
3.1-38
3.1-19
3.1-19
3.1-25
3.1-25
3.1-25
3.1-33
3.1-15
3.1-15
3.1-17
3.1-17
3.1-15
3.1-16
3.1-22
3.1-22
3.1-22
3.1-31
3.1-32
3.1-30
Device Index
Device Index
SN54LS257B ................
SN54LS258B ................
SN54LS259 .................
SN54LS26 ..................
SN54LS260 .................
SN54LS266 .................
SN54LS27 ..................
SN54LS273 .................
SN54LS279 .................
SN54LS28 ............ . ....
SN54LS280 .................
SN54LS283 .................
SN54LS290 .................
SN54LS293 .................
SN54LS298 .................
SN54LS299 .................
SN54LS30 ..................
SN54LS32 ..................
SN54LS322A ................
SN54LS323 .................
SN54LS33 ..................
SN54LS348 .................
SN54LS352 .................
SN54LS353 .................
SN54LS365A ................
SN54LS366A ................
SN54LS367A ................
SN54LS368A ................
SN54LS37 ..................
SN54LS373 .................
SN54LS374 .................
SN54LS375 .................
SN54LS377 .................
SN54LS378 .................
SN54LS379 .................
SN54LS38 ..................
SN54LS386 .................
SN54LS390 .................
SN54LS393 .................
SN54LS398 .................
SN54LS399 .................
SN54LS40 ..................
SN54LS42 ..................
SN54LS47 ..................
SN54LS48 ..................
SN54LS490 .................
SN54LS51 ..................
SN54LS54 ..................
SN54LS540 .................
SN54LS541 .................
SN54LS55 ..................
SN54LS569A ................
SN54LS623 .................
SN54LS640 .................
SN54LS641 .................
SN54LS642 .................
SN54LS645 .................
SN54LS669 .................
SN54LS670 .................
SN54LS682 .................
SN54LS684 .................
SN54LS688 .................
SN54LS73A .................
SN54LS74A .................
SN54LS748 .................
SN54LS75 ..................
SN54LS76A .................
7.1-26
Page
3.1-33
3.1-33
3.1-30
3.1-26
3.1-28
3.1-27
3.1-28
3.1-24
3.1-31
3.1-28
3.1-34
3.1-14
3.1-20
3.1-19
3.1-33
3.1-37
3.1-25
3.1-29
3.1-37
3.1-37
3.1-28
3.1-22
3.1-32
3.1-32
3.1-15
3.1-15
3.1-15
3.1-15
3.1-26
3.1-31
3.1-25
3.1-30
3.1-24
3.1-24
3.1-23
3.1-26
3.1-28
3.1-20
3.1-20
3.1-33
3.1-33
3.1-25
3.1-21
3.1-22
3.1-22
3.1-20
3.1-27
3.1-27
3.1-16
3.1-16
3.1-27
3.1-19
3.1-16
3.1-16
3.1-38
3.1-38
3.1-16
3.1-20
3.1-36
3.1-18
3.1-18
3.1-18
3.1-24
3.1-23
3.1-22
3.1-30
3.1-23
Device Index
SN54LS77 ..................
SN54LS795 .................
SN54LS796 .................
SN54LS797 .................
SN54LS798 .................
SN54LS83A .................
SN54LS848 .................
SN54LS85 ..................
SN54LS86 ..................
SN54LS90 ....... . ......
SN54LS92 ..................
SN54LS93 ..................
SN54LS95B .................
SN74LSOO ..................
SN74LS01 ..................
SN74LS02 ..................
SN74LS03 ..................
SN74LS04 ..................
SN74LS05 ..................
SN74LS08 ..................
SN74LS09 ..................
SN74LS10 ..................
SN74LS107A ................
SN74LS109A ................
SN74LS11 ...................
SN74LS112A ................
SN74LS113A ................
SN74LS114A ................
SN74LS12 ..................
SN74LS122 .................
SN74LS123 .................
SN74LS125A ................
SN74LS126A ................
SN74LS13 ..................
SN74LS132 .................
SN74LS133 .................
SN74LS136 .................
SN74LS137 .................
SN74LS138 .................
SN74LS139 .................
SN74LS14 ..................
SN74LS145 .................
SN74LS147 .................
SN74LS148 .................
SN74LS15 ..................
SN74LS151 .................
SN74LS153 .................
SN74LS155 .................
SN74LS156 .................
SN74LS157 .................
SN74LS158 .................
SN74LS160A ................
SN74LS161A ................
SN74LS162A ................
SN74LS163A ................
SN74LS164 .................
SN74LS165 .................
SN74LS166 .................
SN74LS168 .................
SN74LS169 .................
SN74LS170 .................
SN74LS173A ................
SN74LS174 .................
SN74LS175 .................
SN74LS181 .................
SN74LS190 .................
SN74LS191 .................
Page
3.1-30
3.1-15
3.1-15
3.1-15
3.1-15
3.1-14
3.1-22
3.1-18
3.1-28
3.1-20
3.1-20
3.1-19
3.1-37
3.1-26
3.1-26
3.1-28
3.1-26
3.1-29
3.1-29
3.1-26
3.1-26
3.1-26
3.1-23
3.1-23
3.1-26
3.1-23
3.1-23
3.1-23
3.1-26
3.1-33
3.1-33
3.1-16
3.1-17
3.1-36
3.1-36
3.1-25
3.1-28
3.1-21
3.1-21
3.1-21
3.1-36
3.1-21
3.1-22
3.1-22
3.1-26
3.1-31
3.1-32
3.1-21
3.1-21
3.1-32
3.1-32
3.1-19
3.1-19
3.1-19
3.1-19
3.1-37
3.1-37
3.1-37
3.1-19
3.1-20
3.1-36
3.1-23
3.1-24
3.1-25
3.1-14
3.1-20
3.1-20
Motorola Master Selection Guide
Device Index
Page
Device Index
Page
Device Index
SN74LS192 .................
SN74LS193 .................
SN74LS194A ................
SN74LS195A ................
SN74LS196 .................
SN74LS197 .................
SN74LS20
...........
SN74LS21 ..................
SN74LS22 ..................
SN74LS221 .................
SN74LS240 .................
SN74LS241 .......... :": .....
SN74LS242 .................
SN74LS243 .................
SN74LS244 .................
SN74LS245 .................
SN74LS247 .................
SN74LS248 .................
SN74LS249
.......
SN74LS251
........
SN74LS253
.........
SN74LS257B ................
SN74LS258B ................
SN74LS259 .................
SN74LS26 ..................
SN74LS260 .................
SN74LS266 .................
SN74LS27 ..................
SN74LS273 .................
SN74LS279 .................
SN74LS28 ..................
SN74LS280 .................
SN74LS283 .................
SN74LS290 .................
SN74LS293 .................
SN74LS298 .................
SN74LS299 .................
SN74LS30 ..................
SN74LS32 ..................
SN74LS322A ................
SN74LS323 .................
SN74LS33 ..................
SN74LS348 .................
SN74LS352 .................
SN74LS353 .................
SN74LS365A ................
SN74LS366A ................
SN74LS367A ................
SN74LS368A ................
SN74LS37 ..................
SN74LS373 .................
SN74LS374 .................
SN74LS375 .................
SN74LS377 .................
SN74LS378 .................
SN74LS379 .................
SN74LS38 ..................
SN74LS386 .................
SN74LS390 .................
SN74LS393 .................
SN74LS395 .................
SN74LS398 .................
SN74LS399 .................
SN74LS40 ..................
SN74LS42 ..................
SN74LS47 ..................
SN74LS48 ..................
3.1-20
3.1-20
3.1-37
3.1-38
3.1-19
3.1-19
3.1-25
3.1-25
3.1-25
3.1-33
3.1-15
3.1-15
3.1-17
3.1-17
3.1-15
3.1-16
3.1-22
3.1-22
3.1-22
3.1-31
3.1-32
3.1-33
3.1-33
3.1-30
3.1-26
3.1-28
3.1-27
3.1-28
3.1-24
3.1-31
3.1-28
3.1-34
3.1-14
3.1-20
3.1-19
3.1-33
3.1-37
3.1-25
3.1-29
3.1-37
3.1-37
3.1-28
3.1-22
3.1-32
3.1-32
3.1-15
3.1-15
3.1-15
3.1-15
3.1-26
3.1-31
3.1-25
3.1-30
3.1-24
3.1-24
3.1-23
3.1-26
3.1-28
3.1-20
3.1-20
3.1-37
3.1-33
3.1-33
3.1-25
3.1-21
3.1-22
3.1-22
SN74LS490 ...
3.1-20
SN74LS51 .............
3.1-27
SN74LS54 .................. 3.1-27
SN74LS540 ................. 3.1-16
SN74LS541 ................. 3.1-16
SN74LS55 .................. 3.1-27
SN74LS569A ............
3.1-19
SN74LS623
3.1-16
SN74LS640 ................. 3.1-16
SN74LS641 .............
3.1-38
SN74LS642
3.1-38
SN74LS645 ...........
. .. 3.1-16
SN74LS669 ................. 3.1-20
SN74LS670 ................. 3.1-36
SN74LS682 ................. 3.1-18
SN74LS684 ................. 3.1-18
SN74LS688 ................. 3.1-18
SN74LS73A .........
.. ... 3.1-24
SN74LS74A
.. 3.1-23
SN74LS748 .........
.. ... 3.1-22
SN74LS75 ..........
.. .. 3.1-30
SN74LS76A ................. 3.1-23
SN74LS77 .................. 3.1-30
SN74LS795
......... 3.1-15
SN74LS796 ................. 3.1-15
SN74LS797 ................. 3.1-15
SN74LS798 ................. 3.1-15
SN74LS83A ...
.. ... 3.1-14
SN74LS848 ................. 3.1-22
SN74LS85 .................. 3.1-18
SN74LS86 .................. 3.1-28
SN74LS90 ................. 3.1-20
SN74LS92 .................. 3.1-20
SN74LS93 .................. 3.1-19
SN74LS95B ................. 3.1-37
SN75173 ..................... 4.6-7
SN75175 ..................... 4.6-7
TCA0372 ..................... 4.1-4
TCA3388 .................... 4.7-34
TCA3388DP ................. 4.7-24
TCA3388FP ................. 4.7-24
TCA5600 ..
.. .. .. .. .... 4.2-15
TCF5600 .. . . .. . . .. . .. . . .. . .. 4.2-15
TCF6000 ..................... 4.9-3
TDA1085C .................. 4.3-10
TDA1085CD ................. 4.3-10
TDA1185A .. . ............. 4.3-11
TIL 111 ....................... 5.8-6
TIL113 ....................... 5.8-7
TIL117 ..........
.. ..... 5.8-6
TIL 126 ....................... 5.8-6
TIP102 ....................... 5.5-5
TIP107 ....................... 5.5-5
TIP112
................. 5.5-3
TIP117 ...
.. .... 5.5-3
TIP122..
.. .... 5.5-4
TIP127..
.. ..... 5.5-4
TIP140.......
.. .. 5.5-6
TIP141 ........
.. ..... 5.5-6
TIP142 ....................... 5.5-6
TIP145 ........
.. .... 5.5-6
TIP146 ...................... 5.5-6
TIP147 ....................... 5.5-6
TIP29C ...................... 5.5-3
TIP2955 ...................... 5.5-7
TIP30C ...................... 5.5-3
TIP3055 ...................... 5.5-7
Motorola Master Selection Guide
7.1-27
Device Index
Page
TIP31C ...................... 5.5-3
TIP32C ...................... 5.5-3
TIP33C ...................... 5.5-6
TIP34C ...................... 5.5-6
TIP35A ...................... 5.5-7
TIP35C ...................... 5.5-7
TIP36A ...................... 5.5-7
TIP36C ...................... 5.5-7
TIP41C ...................... 5.5-4
TIP42C ...................... 5.5-4
TIP47 ........................ 5.5-3
TIP48 ........................ 5.5-3
TIP49 ........................ 5.5-3
TIP50 ........................ 5.5-3
TL062AC..
.. ....... 4.1-3
TL062C ...................... 4.1-3
TL062V ...................... 4.1-3
TL064AC ..................... 4.1-4
TL064C ..
.. 4.1-4
TL064V ...................... 4.1-5
TL071AC ..................... 4.1-2
TL071C ...................... 4.1-2
TL072AC ..................... 4.1-3
TL072C ...................... 4.1-3
TL074AC ..................... 4.1-4
TL074C ...................... 4.1-4
TL081AC ..................... 4.1-2
TL081C ...................... 4.1-2
TL082AC ..................... 4.1-3
TL082C ...................... 4.1-3
TL084AC ..................... 4.1-4
TL084C ...................... 4.1-4
TL431AC ..................... 4.4-2
TL431BC ..................... 4.4-2
TL431C ...................... 4.4-2
TL431 I ....................... 4.4-2
TL4311AI ..................... 4.4-2
TL4311BI ..................... 4.4-2
TL494 ...................... 4.2-12
TL594 ...................... 4.2-12
TL780-XXC .................. 4.2-3
TPV596A ................... 5.10-12
TPV597 .................... 5.10-12
TPV598 .................... 5.10-12
TPV6030 ................... 5.10-12
TPV695A ................... 5.10-12
TPV7025 ................... 5.10-12
TPV8100B ................. 5.10-12
TP3007S .. .. . . .. . . . . . . . .. . .. 5.10-9
TP3008 ..................... 5.10-9
TP3021 ..................... 5.10-9
TP3034 ..................... 5.10-9
TP3069 ..................... 5.10-9
TP5002S .................... 5.10-8
TP5015 ..................... 5.10-8
TP5051 ..................... 5.10-8
T2322B ...................... 5.7-7
T2322D ...................... 5.7-7
T2322M ...................... 5.7-7
T2323B ...................... 5.7-8
T2323D ...................... 5.7-8
T2323M ...................... 5.7-8
T2500B ...................... 5.7-8
T2500BFP .................... 5.7-9
T2500D ...................... 5.7-8
T2500DFP ................... 5.7-9
T2500M ...................... 5.7-8
Device Index
Device Index
Device Index
Page
T2500MFP ................... 5.7-9
T2500N ...................... 5.7-8
T2500NFP ................... 5.7-9
T2800B ..................... 5.7-10
T2800D ..................... 5.7-10
T2800M ..................... 5.7-10
UAA1016B ................... 4.3-3
UAA1041 ..................... 4.9-8
UAA1041B ............. 4.9-3,4.9-8
UAA2016 .. .. .. . . .. .. . . .. . . ... 4.3-3
UAA2016D .................... 4.3-3
UAA2016P ................... 4.3-3
UC2842A .................... 4.2-9
UC2842B ................... 4.2-10
UC2843A .................... 4.2-9
UC2843B ................... 4.2-10
UC2844 . . . . . . . . . . . . . . . . . . . . .. 4.2-9
UC2844B ................... 4.2-10
UC2845 .. .. .. .. . . .. . . . . .. . . .. 4.2-9
UC2845B ................... 4.2-10
UC3842A .................... 4.2-9
UC3842B .................... 4.2-9
UC3842BV ................... 4.2-9
UC3843A ...... ............. 4.2-9
UC3843B ................... 4.2-10
UC3843BV .................. 4.2-10
UC3844 .. .. .. .. . . .. . . . . .. . . .. 4.2-9
UC3844B ................... 4.2-10
UC3844BV .................. 4.2-10
UC3845 .. .. .. .. . . .. .. . . .. . . .. 4.2-9
UC3845B ................... 4.2-10
UC3845BV .................. 4.2-10
ULN2003A
.. 4.6-8
ULN2004A ................... 4.6-8
ULN2803 .. .. . .. .. .. .. . . .. . ... 4.6-8
ULN2804 ..................... 4.6-8
VN0300L .................... 5.1-21
VN0610LL ................... 5.1-21
VN10LM .................... 5.1-21
VN1706L .................... 5.1-21
VN2222LL ................... 5.1-21
VN2406L .................... 5.1-21
VN2410L .................... 5.1-21
XCP56002PV80 ............... 2.1-6
XC56L002PV40 ............... 2.1-8
XC56L007FJ40 ............... 2.1-6
XC56L811BU40 ............... 2.1-3
XC56L812BU40 ............... 2.1-3
XC56001AFC27 ............... 2.1-6
XC56001AFC33 ............... 2.1-6
XC56001AFE27 ............... 2.1-6
XC56001AFE33 ............... 2.1-6
XC56001ARC27 .............. 2.1-6
XC56001ARC33 .............. 2.1-6
XC56002PV40 ................ 2.1-6
XC56002PV66 ................ 2.1-6
XC56004FJ50 ................ 2.1-6
XC56004FJ66 ................ 2.1-6
XC56005PV50 ................ 2.1-6
XC56007FJ50 ................ 2.1-6
XC56007FJ66 ................ 2.1-6
XC56009PV80 ................ 2.1-6
XC56156FE60 ................ 2.1-2
XC56156FV40 ................ 2.1-2
XC56156FV50 ................ 2.1-2
XC56166FV60 ................ 2.1-2
XC56301PW66 ............... 2.1-8
Device Index
Device Index
Page
XC56302PV60 ................ 2.1-8
XC56303PV66 ................ 2.1-8
XC68HC05C4 ............... 2.6-23
XC68HC05D32 ........ 2.5-6, 2.6-23
XC68HC05F2 ................ 2.6-23
XC68HC05F6 . . . . . . . . . . . . . . .. 2.6-23
XC68HC05F8 . . . . . . . . . . . . . . .. 2.6-23
XC68HC05G10 .............. 2.6-23
XC68HC05G9 ............... 2.6-23
XC68HC05H2 ............... 2.6-23
XC68HC0518 ................ 2.6-23
XC68HC05J3 . . . . . . . . . . . . . . .. 2.6-23
XC68HC05KO . . . . . . . . . . . . . . .. 2.6-23
XC68HC05K1 ................ 2.6-23
XC68HC05K3 ................. 2.5-7
XC68HC05L1 ................ 2.6-24
XC68HC05L 11 ............... 2.6-24
XC68HC05L2 . . . . . . . . . . . . . . .. 2.6-24
XC68HC05L4 . .. .. . . .. .. . . . .. 2.6-24
XC68HC05M4 ............... 2.6-24
XC68HC05P3 . . . . . . . . . . . . . . .. 2.6-24
XC68HC05RC16 .............. 2.5-8
XC68HC05SC11 ............. 2.6-24
XC68HC05SC21 ............. 2.6-24
XC68HC05SC24 .... . . . . . . . .. 2.6-24
XC68HC05SC27 ..... . . . . . . .. 2.6-24
XC68HC05SC28 .. .. . .. .. . . ... 2.5-8
XC68HC05T12 ............... 2.6-24
XC68HC05T2 .......... 2.5-8,2.6-24
XC68HC05T3 ................ 2.6-24
XC68HC05T4 ................ 2.6-24
XC68HC05X16 .............. 2.6-24
XC68HC05X4. .
. ....... 2.6-24
XC68HC11CO ................. 2.6-6
XC68HC11E20 ................ 2.6-6
XC68HC11N4 ................. 2.6-8
XC68HC11P2 ................. 2.6-8
XC68HC705B32 ............. 2.5-10
XC68HC705C ............... 2.6-23
XC68HC705C5 .............. 2.6-23
XC68HC705D9 .............. 2.5-10
XC68HC705F6 ............... 2.5-10
XC68HC705F8 ............... 2.6-23
XC68HC705G10 ............. 2.6-23
XC68HC705G9 .............. 2.6-23
XC68HC70518 ............... 2.6-23
XC68HC705J3 . . . . . . . . . . . . . .. 2.6-23
XC68HC705K1 .............. 2.6-23
XC68HC705L1 ........ 2.5-11,2.6-24
XC68HC705L2 ............... 2.6-24
XC68HC705L4 ............... 2.6-24
XC68HC705P9 .............. 2.6-24
XC68HC705T10 ............. 2.6-24
XC68HC705T12 ............. 2.6-24
XC68HC705V8 .............. 2.5-11
XC68HC705X4 ....... 2.5-11,2.6-24
XC68HC711P2 ................ 2.6-8
XC68HC916X1 .............. 2.6-18
XC68HC916Y1 .............. 2.6-18
XC68334 .................... 2.6-21
XC96002RC33 ................ 2.1-9
XC96002RC40 ................ 2.1-9
ZPD2.7RL . . . . . . . . . . . . . . . . . .. 5.2-16
ZPD27RL ................... 5.2-17
ZPD3.6RL ................... 5.2-16
ZPD30RL ................... 5.2-17
ZPD4.7RL ................... 5.2-16
7.1-28
Device Index
Page
ZPD5.1 RL . . . . . . . . . . . . . . . . . .. 5.2-16
ZPD6.2RL . . . . . . . . . . . . . . . . . .. 5.2-16
IlA78S40 .................... 4.2-11
1.5KE10A .................... 5.2-7
1.5KE10CA ................... 5.2-7
1.5KE100A ................... 5.2-7
1.5KE100CA .................. 5.2-7
1.5KE11 A .................... 5.2-7
1.5KE11CA ................... 5.2-7
1.5KE110A ................... 5.2-7
1.5KE110CA .................. 5.2-7
1.5KE12A .................... 5.2-7
1.5KE12CA ................... 5.2-7
1.5KE120A ................... 5.2-7
1.5KE120CA .................. 5.2-7
1.5KE13A .................... 5.2-7
1.5KE13CA ................... 5.2-7
1.5KE130A ................... 5.2-7
1.5KE130CA .................. 5.2-7
1.5KE15A .................... 5.2~7
1.5KE15CA ................... 5.2-7
1.5KE150A ................... 5.2-8
1.5KE150CA .................. 5.2-8
1.5KE16A .................... 5.2-7
1.5KE16CA ................... 5.2-7
1.5KE160A ................... 5.2-8
1.5KE160CA .................. 5.2-8
1.5KE170A ................... 5.2-8
1.5KE170CA .................. 5.2-8
1.5KE18A .................... 5.2-7
1.5KE18CA ................... 5.2-7
1.5KE180A ................... 5.2-8
1.5KE180CA. .. .............. 5.2-8
1.5KE20A .................... 5.2-7
1.5KE20CA ................... 5.2-7
1.5KE200A .. .. .. .. .. .. .. .. ... 5.2-8
1.5KE200CA .. .. .. .. .. . .. .. ... 5.2-8
1.5KE22A .................... 5.2-7
1.5KE22CA ................ '" 5.2-7
1.5KE220A .......... .. . . . . . .. 5.2-8
1.5KE220CA .. .. . .. .. .. .. .. ... 5.2-8
1.5KE24A .................... 5.2-7
1.5KE24CA . . . . . . . . . . . . . . . . . .. 5.2-7
1.5KE250A ........ . . . . . . . . . .. 5.2-8
1.5KE250CA .................. 5.2-8
1.5KE27A .................... 5.2-7
1.5KE27CA ................... 5.2-7
1.5KE30A .................... 5.2-7
1.5KE30CA ................... 5.2-7
1.5KE33A ......... .. . . .. .. ... 5.2-7
1.5KE33CA .. . .. . .. .. . . . .. .... 5.2-7
1.5KE36A .................... 5.2-7
1.5KE36CA ................... 5.2-7
1.5KE39A .................... 5.2-7
1.5KE39CA ................... 5.2-7
1.5KE43A .................... 5.2-7
1.5KE43CA ................... 5.2-7
1.5KE47A .................... 5.2-7
1.5KE47CA ................... 5.2-7
1.5KE51A .................... 5.2-7
1.5KE51CA ................... 5.2-7
1.5KE56A .................... 5.2-7
1.5KE56CA ................... 5.2-7
1.5KE6.8A .................... 5.2-7
1.5KE6.8CA .................. 5.2-7
1.5KE62A .................... 5.2-7
1.5KE62CA ................... 5.2-7
Motorola Master Selection Guide
Device Index
Device Index
Page
1.5KE68A .................... 5.2-7
1.5KE68CA ................... 5.2-7
1.5KE7.5A .................... 5.2-7
1.5KE7.5CA .................. 5.2-7
1.5KE75A .................... 5.2-7
1.5KE75CA ................... 5.2-7
1.5KE8.2A .................... 5.2-7
1.5KE8.2CA .................. 5.2-7
1.5KE82A .................... 5.2-7
1.5KE82CA ................... 5.2-7
1.5KE91A .................... 5.2-7
1.5KE91CA ................... 5.2-7
1.5SMC10AT3 ............... 5.2-14
1.5SMC11AT3 ............... 5.2-14
1.5SMC12AT3 ............... 5.2-14
1.5SMC13AT3 ............... 5.2-14
1.5SMC15AT3 ............... 5.2-14
1.5SMC18AT3 ............... 5.2-14
1.5SMC22AT3 ............... 5.2-14
1.5SMC24AT3 ............... 5.2-14
1.5SMC27AT3 ............... 5.2-14
1.5SMC30AT3 ............... 5.2-14
1.5SMC33AT3 ............... 5.2-14
1.5SMC36AT3 ............... 5.2-14
1.5SMC39AT3 ............... 5.2-14
1.5SMC43AT3 ............... 5.2-14
1.5SMC47AT3 ............... 5.2-14
1.5SMC51AT3 ............... 5.2-14
1.5SMC56AT3 ............... 5.2-14
1.5SMC6.8AT3 ............... 5.2-14
1.5SMC62AT3 ............... 5.2-14
1.5SMC68AT3 ............... 5.2-14
1.5SMC75AT3 ............... 5.2-14
1.5SMC8.2AT3 . . . . . . . . . . . . . .. 5.2-14
1.5SMC82AT3 ............... 5.2-14
1.5SMC9.1AT3 ............... 5.2-14
1.5SMC91AT3 ................ 5.2-14
1N4004 ..................... 5.6-13
1N4007 ..................... 5.6-13
1N4370A .................... 5.2-16
1N4371A .................... 5.2-16
1N4372A .................... 5.2-16
1N4678 ..................... 5.2-16
1N4679 ..................... 5.2-16
1N4681 ..................... 5.2-16
1N4682 ..................... 5.2-16
1N4683 ..................... 5.2-16
1N4684 ..................... 5.2-16
1N4685 ..................... 5.2-16
1N4686 ..................... 5.2-16
1N4687 ..................... 5.2-16
1N4688 ..................... 5.2-16
1N4689 ..................... 5.2-16
1N4690 ..................... 5.2-16
1N4691 ..................... 5.2-16
1N4692 ..................... 5.2-16
1N4693 ..................... 5.2-16
1N4694 .. , .................. 5.2-16
1N4695 ..................... 5.2-16
1N4696 ..................... 5.2-16
1N4697 ..................... 5.2-16
1N4698 ..................... 5.2-16
1N4699 ..................... 5.2-16
1N4700 ..................... 5.2-16
1N4702 ..................... 5.2-16
1N4703 ........... " ........ 5.2-16
1N4704 ..................... 5.2-16
Motorola Master Selection Guide
Device Index
Page
1N4705 .....................
1N4707 .....................
1N4708 .....................
1N4728A ....................
1N4729A ....................
1N4730A ....................
1N4731A ....................
1N4732A ....................
1N4733A ....................
1N4734A ....................
1N4735A ....................
1N4736A ....................
1N4737A ....................
1N4738A ....................
1N4739A ....................
1N4740A ....................
1N4741 A ....................
1N4742A ....................
1N4743A ....................
1N4744A ....................
1N4745A ....................
1N4746A ....................
1N4747A ....................
1N4748A ....................
1N4749A ....................
1N4750A ....................
1N4751A ....................
1N4752A ....................
1N4753A ....................
1N4754A ....................
1N4755A ....................
1N4756A ....................
1N4757A ....................
1N4758A ....................
1N4759A ....................
1N4760A ....................
1N4761A ....................
1N4762A ....................
1N4763A ....................
1N4764A ....................
1N4935 .....................
1N4937 .....................
1N5139 .....................
1~1~ .....................
1N5143 .....................
1N5144 .....................
1N5145 .....................
1~1~ .....................
1N5221B ....................
1N5222B ....................
1N5223B ....................
1N5225B ....................
1N5226B ....................
1N5227B ....................
1N5228B ....................
1N5229B ....................
1N5230B ....................
1N5231B ....................
1N5232B ....................
1N5233B ....................
1N5234B ....................
1N5235B ....................
1N5236B ....................
1N5237B ....................
1N5239B ....................
1N5240B ....................
1N5241B ....................
5.2-16
5.2-17
5.2-17
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-19
5.2-19
5.2-19
5.2-19
5.6-13
5.6-13
5.1-25
7.1-29
~1~5
5.1-25
5.1-25
5.1-25
~1-~
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-16
Device Index
1N5242B ....................
1N5243B ....................
1N5244B ....................
1N5245B ....................
1N5246B ....................
1N5247B ....................
1N5248B ....................
1N5249B ....................
1N5250B ....................
1N5251B ....................
1N5252B ....................
1N5254B ....................
1N5255B ....................
1N5256B ....................
1N5257B ....................
1N5258B ....................
1N5259B ....................
1N5260B ....................
1N5261B ....................
1N5262B ....................
1N5263B ....................
1N5264B ....................
1N5265B ....................
1N5266B ....................
1N5267B ....................
1N5270B ....................
lN5271B ....................
1N5272B ....................
1N5273B ....................
1N5274B ....................
1N5275B ....................
1N5276B ....................
1N5279B ....................
1N5281B ....................
1N5283 .....................
1N5287 .....................
1N5297 .....................
1N5298 .....................
1N5305 .....................
1N5309 .....................
1N531 0 .....................
1N5311 .....................
1N5312 .....................
1N5313 .....................
1N5314 .....................
1N5333B ....................
1N5334B ....................
1N5335B ....................
1N5336B ....................
1N5337B ....................
1N5338B ....................
1N5339B ....................
1N5340B ....................
1N5341B ....................
1N5342B ....................
1N5343B ....................
1N5344B ....................
1N5346B ....................
1N5347B ....................
1N5348B ....................
1N5349B . . . . . . . . . . . . . . . . . ...
1N5350B .. .. .. .. .. .. .. .. ....
1N5351B ....................
1N5352B ....................
1N5353B ....................
1N5354B ....................
1N5355B ....................
Page
5.2-16
5.2-16
5.2"-16
5.2-16
5.2-16
5.2-16
5.2-16
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-17
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-31
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
5.2-18
Device Index
Device Index
Device Index
Page
1N5356B .................... 5.2-18
1N5357B .................... 5.2-18
lN5358B .................... 5.2-18
lN5359B .................... 5.2-18
lN5360B .................... 5.2-18
lN5361B ........•........... 5.2-18
lN5362B .................... 5.2-18
lN5363B .................... 5.2-18
lN5364B .................... 5.2-18
1N5365B .................... 5.2-18
lN5366B .................... 5.2-18
lN5367B .................... 5.2-18
lN5368B .................... 5.2-18
lN5369B .................... 5.2-18
lN5370B .................... 5.2-18
lN5371B .................... 5.2-18
lN5372B .................... 5.2-18
lN5373B .................... 5.2-18
lN5374B .................... 5.2-19
1N5375B .................... 5.2-19
lN5377B .................... 5.2-19
1N5378B . . . . . . . . . . . . . . . . . . .. 5.2-19
lN5380B .................... 5.2-19
lN5381B .................... 5.2-19
lN5383B .................... 5.2-19
lN5384B .................... 5.2-19
lN5386B .................... 5.2-19
lN5388B .................... 5.2-19
lN5404 ..................... 5.6-13
lN5406 ..................... 5.6-13
lN5441A .................... 5.1-25
1 N5444A . . . . . . . . . . . . . . . . . . .. 5.1-25
lN5446A .................... 5.1-25
lN5448A .................... 5.1-25
lN5449A .................... 5.1-25
1 N5450A . . . . . . . . . . . . . . . . . . .. 5.1-25
lN5451A .................... 5.1-25
1 N5452A . . . . . . . . . . . . . . . . . . .. 5.1-25
1 N5453A . . . . . . . . . . . . . . . . . . .. 5.1-25
1 N5455A . . . . . . . . . . . . . . . . . . .. 5.1-25
lN5456A .................... 5.1-25
1 N5817 ...................... 5.6-6
1 N5818 ...................... 5.6-6
lN5819 ...................... 5.6-6
1 N5820 ...................... 5.6-6
1N5821 ...................... 5.6-6
1N5822 ...................... 5.6-6
1N5908 ...................... 5.2-6
lN5913B .................... 5.2-18
lN5917B .................... 5.2-18
lN5920B .................... 5.2-18
lN5921B .................... 5.2-18
lN5922B .................... 5.2-18
lN5924B .................... 5.2-18
lN5925B .................... 5.2-18
lN5927B .................... 5.2-18
1 N5929 B ................... 5.2-18
1N5930B . . . . . . . . . . . . . . . . . . .. 5.2-18
lN5931B .................... 5.2-18
1 N5933B . . . . . . . . . . . . . . . . . . .. 5.2-18
1 N5935B . . . . . . . . . . . . . . . . . . .. 5.2-18
lN5938B .................... 5.2-18
1 N5939B .................... 5.2-18
lN5941B .................... 5.2-18
lN5943B .................... 5.2-18
lN5946B .................... 5.2-19
lN5951B .................... 5.2-19
Device Index
Device Index
Page
lN5953B .................... 5.2-19
lN5954B .................... 5.2-19
1 N5955B . . . . . . . . . . . . . . . . . . .. 5.2-19
lN5956B .................... 5.2-19
1N5985B . . . . . . . . . . . . . . . . . . .. 5.2-16
lN5987B .................... 5.2-16
1 N5988B . . . . . . . . . . . . . . . . . . .. 5.2-16
lN5989B .................... 5.2-16
lN5990B .................... 5.2-16
lN5991B .................... 5.2-16
lN5992B .................... 5.2-16
lN5993B .................... 5.2-16
lN5994B .................... 5.2-16
lN5995B .................... 5.2-16
lN5996B .................... 5.2-16
lN5997B .................... 5.2-16
lN5998B .................... 5.2-16
lN5999B .................... 5.2-16
lN6000B .................... 5.2-16
lN6002B .................... 5.2-16
lN6003B .................... 5.2-16
lN6004B .................... 5.2-16
lN6007B .................... 5.2-17
lN6023B .................... 5.2-17
lN6267A ..................... 5.2-7
1N6268A . . . . . . . . . . . . . . . . . . . .. 5.2-7
lN6269A ..................... 5.2-7
lN6271A ..................... 5.2-7
lN6272A ..................... 5.2-7
1N6273A . . . . . . . . . . . . . . . . . . . .. 5.2-7
lN6274A ..................... 5.2-7
lN6275A ..................... 5.2-7
lN6276A ..................... 5.2-7
lN6277A ..................... 5.2-7
lN6278A ..................... 5.2-7
1N6279A . . . . . . . . . . . . . . . . . . . .. 5.2-7
1 N6280A . . . . . . . . . . . . . . . . . . . .. 5.2-7
lN6281A ..................... 5.2-7
1 N6282A . . . . . . . . . . . . . . . . . . . .. 5.2-7
1 N6283A . . . . . . . . . . . . . . . . . . . .. 5.2-7
1 N6284A . . . . . . . . . . . . . . . . . . . .. 5.2-7
1 N6285A . . . . . . . . . . . . . . . . . . . .. 5.2-7
lN6286A ..................... 5.2-7
lN6287A ..................... 5.2-7
lN6288A ..................... 5.2-7
lN6289A ..................... 5.2-7
lN6290A ..................... 5.2-7
lN6291A ..................... 5.2-7
lN6292A ..................... 5.2-7
lN6293A ..................... 5.2-7
lN6294A ..................... 5.2-7
1N6295A . . . . . . . . . . . . . . . . . . . .. 5.2-7
1N6296A . . . . . . . . . . . . . . . . . . . .. 5.2-7
lN6297A ..................... 5.2-7
1N6298A . . . . . . . . . . . . . . . . . . . .. 5.2-7
1 N6299A . . . . . . . . . . . . . . . . . . . .. 5.2-8
1N6300A . . . . . . . . . . . . . . . . . . . .. 5.2-8
lN6301A ..................... 5.2-8
1 N6302A . . . . . . . . . . . . . . . . . . . .. 5.2-8
1 N6303A . . . . . . . . . . . . . . . . . . . .. 5.2-8
1N6373 ...................... 5.2-6
lN6374 ...................... 5.2-6
1N6375 ...................... 5.2-6
1N6376 ...................... 5.2-6
1N6377 ...................... 5.2-6
1N6378 ...................... 5.2-6
1N6379 ...................... 5.2-6
7.1-30
Device Index
Page
1 N6380 ...................... 5.2-6
1 N6381 ...................... 5.2-6
1 N6382 ...................... 5.2-6
1 N6383 ...................... 5.2-6
1 N6384 ...................... 5.2-6
1N6385 ...................... 5.2-6
1 N6386 ...................... 5.2-6
1N6388 ...................... 5.2-6
1N6389 ...................... 5.2-6
lN746A ..................... 5.2-16
lN747A ..................... 5.2-16
lN748A ..................... 5.2-16
lN749A ..................... 5.2-16
1N750A . . . . . . . . . . . . . . . . . . . .. 5.2-16
lN751A ..................... 5.2-16
lN752A ..................... 5.2-16
lN753A ..................... 5.2-16
1N754A . . . . . . . . . . . . . . . . . . . .. 5.2-16
lN755A ..................... 5.2-16
lN756A ..................... 5.2-16
lN757A ..................... 5.2-16
1N758A . . . . . . . . . . . . . . . . . . . .. 5.2-16
lN759A ..................... 5.2-16
1N821 ...................... 5.2-31
lN821A ..................... 5.2-31
1N823 ...................... 5.2-31
1 N823A . . . . . . . . . . . . . . . . . . . .. 5.2-31
1N825 ...................... 5.2-31
1 N825A ..................... 5.2-31
1 N827 ...................... 5.2-31
1 N827A ..................... 5.2-31
1 N829 ...................... 5.2-31
1 N829A ..................... 5.2-31
lN957B ..................... 5.2-16
1 N959B . . . . . . . . . . . . . . . . . . . .. 5.2-16
lN961B ..................... 5.2-16
lN962B ..................... 5.2-16
1N963B ..................... 5.2-16
1N964B ... . . . . . . . . . . . . . . . . .. 5.2-16
1N965B . . . . . . . . . . . . . . . . . . . .. 5.2-16
1N966B . . . . . . . . . . . . . . . . . . . .. 5.2-16
1N967B .... . . . . . . . . . . . . . . . .. 5.2-16
1N968B . . . . . . . . . . . . . . . . . . . .. 5.2-17
lN969B ..................... 5.2-17
1 N970B . . . . . . . . . . . . . . . . . . . .. 5.2-17
lN971B ..................... 5.2-17
1 N972B . . . . . . . . . . . . . . . . . . . .. 5.2-17
lN973B ..................... 5.2-17
lN974B ..................... 5.2-17
lN975B ..................... 5.2-17
1 N976B . . . . . . . . . . . . . . . . . . . .. 5.2-17
1N977B . . . . . . . . . . . . . . . . . . . .. 5.2-17
1N978B . . . . . . . . . . . . . . . . . . . .. 5.2-17
lN980B ..................... 5.2-17
lN981B ..................... 5.2-17
lN982B ..................... 5.2-17
1 N985B . . . . . . . . . . . . . . . . . . . .. 5.2-17
1N986B . . . . . . . . . . . . . . . . . . . .. 5.2-17
1N987B ., . . . . . . . . . . . . . . . . . .. 5.2-17
lN988B ..................... 5.2-17
lN989B ..................... 5.2-17
lN991B ..................... 5.2-17
lN992B ..................... 5.2-17
ISMA5913BT3 ............... 5.2-21
1SMA5914BT3 . . . . . . . . . . . . . .. 5.2-21
ISMA5915BT3 ............... 5.2-21
ISMA5916BT3 ............... 5.2-21
Motorola Master Selection Guide
Device Index
Device Index
Page
Device Index
Page
Device Index
ISMA5917BT3 ...............
ISMA5918BT3 ...............
ISMA5919BT3 ...............
1SMA5920BT3 . . . . . . . . . . . . . ..
ISMA5921BT3 ...............
1SMA5922BT3 . . . . . . . . . . . . . ..
ISMA5923BT3 ...............
1SMA5924BT3 . . . . . . . . . . . . . ..
ISMA5925BT3 ...............
ISMA5926BT3 ...............
ISMA5927BT3 ...............
ISMA5928BT3 ...............
1SMA5929BT3 . . . . . . . . . . . . . ..
ISMA5930BT3 ...............
1SMA5931 BT3 . . . . . . . . . . . . . ..
1SMA5932BT3 . . . . . . . . . . . . . ..
1SMA5933BT3 . . . . . . . . . . . . . ..
ISMA5934BT3 ...............
1SMA5935BT3 . . . . . . . . . . . . . ..
ISMA5936BT3 ...............
1SMA5937BT3 ...............
1SMA5938BT3 ...............
1SMA5939BT3 ...............
1SMA5940BT3 ...............
1SMA5941 BT3 ...............
1SMA5942BT3 ...............
1SMA5943BT3 ...............
1SMA5944BT3 . . . . . . . . . . . . . ..
ISMA5945BT3 ...............
ISMB10AT3 .................
ISMB10CAT3 ...............
ISMB100AT3 ................
ISMBllAT3 .................
ISMBllCAT3 ................
ISMBll0AT3 ................
ISMBI2AT3 .................
ISMB12CAT3 ...............
ISMB120AT3 ................
ISMB13AT3 .................
ISMB13CAT3 ...............
ISMB130AT3 ................
ISMB14AT3 .................
ISMB14CAT3 ...............
ISMB15AT3 .................
ISMB15CAT3 ...............
ISMB150AT3 ................
ISMB16AT3 .................
ISMB16CAT3 ...............
ISMB160AT3 ................
ISMB170AT3 ................
ISMB18AT3 .................
ISMB18CAT3 ...............
ISMB20AT3 .................
ISMB20CAT3 ...............
ISMB22AT3 .................
ISMB22CAT3 ...............
ISMB24AT3 .................
ISMB24CAT3 ...............
ISMB26AT3 .................
ISMB26CAT3 ...............
ISMB28AT3 .................
ISMB28CAT3 ...............
ISMB30AT3 .................
ISMB30CAT3 ...............
ISMB36AT3 .................
ISMB36CAT3 ...............
ISMB40AT3 .................
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
ISMB40CAT3 ...............
ISMB43AT3 .................
ISMB43CAT3 ...............
ISMB45AT3 .................
ISMB45CAT3 ...............
ISMB48AT3 .................
ISMB48CAT3 ...............
ISMB5.0AT3 ................
ISMB51AT3 .................
ISMB51CAT3 ...............
ISMB54AT3 .................
ISMB54CAT3 ...............
ISMB58AT3 .................
ISMB58CAT3 ...............
1SII.1B5913BT3 . . . . . . . . . . . . . ..
15MB5915BT3 . . . . . . . . . . . . . ..
15MB5916BT3 .............. ,
15MB5917BT3 . . . . . . . . . . . . . ..
15MB5918BT3 . . . . . . . . . . . . . ..
15MB5919BT3 . . . . . . . . . . . . . ..
15MB5920BT3 . . . . . . . . . . . . . ..
15MB5921 BT3 . . . . . . . . . . . . . ..
15MB5922BT3 ............. "
15MB5923BT3 . . . . . . . . . . . . . ..
15MB5924BT3 ...............
1 5MB5925BT3 ...............
ISMB5926BT3 ...............
1 5MB5927BT3 ...............
ISMB5928BT3 ...............
15MB5929BT3 ...............
ISMB5930BT3 ...............
15MB5931 BT3 ...............
ISMB5932BT3 ...............
ISMB5934BT3 ...............
15MB5935BT3 . . . . . . . . . . . . . ..
ISMB5936BT3 ...............
15MB5937BT3 . . . . . . . . . . . . . ..
ISMB5938BT3 ...............
15MB5939BT3 . . . . . . . . . . . . . ..
15MB5940BT3 . . . . . . . . . . . . . ..
15MB5941 BT3 . . . . . . . . . . . . . ..
15MB5942BT3 . . . . . . . . . . . . . ..
15MB5943BT3 . . . . . . . . . . . . . ..
15MB5944BT3 . . . . . . . . . . . . . ..
15MB5945BT3 . . . . . . . . . . . . . ..
15MB5946BT3 . . . . . . . . . . . . . ..
ISMB5947BT3 ...............
1 5MB5949BT3 . . . . . . . . . . . . . ..
15MB5950BT3 . . . . . . . . . . . . . ..
ISMB5951BT3 ...............
ISMB5952BT3 ...............
1 5MB5953BT3 . . . . . . . . . . . . . ..
ISMB5954BT3 ................
ISMB6.0AT3 ................
ISMB6.5AT3 ................
ISMB60AT3 .................
ISMB60CAT3 ...............
ISMB64AT3 .................
ISMB64CAT3 ...............
ISMB7.0AT3 ................
ISMB7.5AT3 ................
ISMB70AT3 .................
ISMB70CAT3 ...............
ISMB75AT3 .................
ISMB78AT3 .................
ISMB8.0AT3 ................
ISMB8.5AT3 ................
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-10
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-11
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-21
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
q.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-22
5.2-10
5.2-10
5.2-11
5.2-11
5.2-11
5.2-11
5.2-10
5.2-10
5.2-11
5.2-11
5.2-11
5.2-11
5.2-10
5.2-11
ISMB85AT3 ................. 5.2-11
ISMB9.0AT3 ................ 5.2-11
ISMB90AT3 ................. 5.2-11
ISMC10AT3 ................. 5.2-13
ISMCllAT3 ................. 5.2-13
ISMC12AT3 ................. 5.2-13
ISMC13AT3 ................. 5.2-13
ISMC14AT3 ................. 5.2-13
ISMC15AT3 ................. 5.2-13
ISMC16AT3 ................. 5.2-13
ISMC17AT3 ................. 5.2-13
ISMC18AT3 ................. 5.2-13
ISMC20AT3 ................. 5.2-13
ISMC22AT3 ................. 5.2-13
ISMC24AT3 ................. 5.2-13
ISMC26AT3 ................. 5.2-13
ISMC28AT3 ................. 5.2-13
ISMC30AT3 ................. 5.2-13
ISMC33AT3 ................. 5.2-13
ISMC36AT3 ................. 5.2-13
ISMC40AT3 ................. 5.2-13
ISMC43AT3 ................. 5.2-13
ISMC45AT3 ................. 5.2-13
ISMC48AT3 ................. 5.2-13
ISMC5.0AT3 ................ 5.2-13
ISMC51AT3 ................. 5.2-13
ISMC54AT3 ................. 5.2-13
ISMC58AT3 ................. 5.2-13
ISMC6.0AT3 ................ 5.2-13
ISMC6.5AT3 ................ 5.2-13
ISMC60AT3 ................. 5.2-13
ISMC64AT3 ................. 5.2-13
ISMC7.0AT3 ................ 5.2-13
ISMC7.5AT3 ................ 5.2-13
ISMC70AT3 ................. 5.2-13
ISMC75AT3 ................. 5.2-13
ISMC78AT3 ................. 5.2-13
ISMC8.0AT3 ................ 5.2-13
ISMC8.5AT3 ................ 5.2-13
ISMC9.0AT3 ...... : ......... 5.2-13
2N1893 ..................... 5.1-17
2N2219A .................... 5.1-17
2N2222A .................... 5.1-17
2N2369A .................... 5.1-18
2N2484 ..................... 5.1-18
2N2904A .................... 5.1-17
2N2905A .................... 5.1-17
2N2906A .................... 5.1-17
2N2907A .................... 5.1-17
2N3019 ..................... 5.1-17
2N3020 ..................... 5.1-17
2N3055 ..................... 5.5-12
2N3055A ............. 5.5-12,5.5-15
2N3251A .................... 5.1-17
2N3442 ..................... 5.5-12
2N3467 ..................... 5.1-18
2N3637 ..................... 5.1-18
2N3700 ..................... 5.1-17
2N3715 ..................... 5.5-12
2N3716 ..................... 5.5-12
2N3771 ..................... 5.5-13
2N3772 ..................... 5.5-13
2N3773 ..................... 5.5-13
2N3791 ..................... 5.5-12
2N3792 ..................... 5.5-12
2N3799 ..................... 5.1-18
2N3903 ...................... 5.1-2
Motorola Master Selection Guide
7.1-31
Page
Device Index
Device Index
Device Index
2N3904
2N3905
2N3906
2N3964
2N4032
2N4033
2N4036
2N4123
2N4124
2N4125
2N4126
2N4264
2N4265
2N4398
2N4399
2N4400
2N4401
2N4402
2N4403
2N4410
2N4918
2N4919
2N4920
2N4921
2N4922
2N4923
2N5038
2N5039
2N5086
2N5087
2N5088
2N5089
2N5191
2N5192
2N5194
2N5195
2N5301
2N5302
2N5401
2N5457
2N5458
2N5459
2N5460
2N5461
2N5462
2N5484
2N5485
2N5486
2N5551
2N5555
2N5631
2N5639
2N5640
2N5655
2N5656
2N5657
2N5668
2N5684
2N5685
2N5686
2N5878
2N5879
2N5880
2N5881
2N5882
2N5883
2N5884
Page
...................... 5.1-2
.. : ................... 5.1-2
...................... 5.1-2
..................... 5.1-18
..................... 5.1-17
..................... 5.1-17
..................... 5.1-17
...................... 5.1-2
...................... 5.1-2
...................... 5.1-2
...................... 5.1-2
...................... 5.1-6
...................... 5.1-6
..................... 5.5-13
..................... 5.5-13
...................... 5.1-2
...................... 5.1-2
...................... 5.1-2
...................... 5.1-2
...................... 5.1-2
...................... 5.5-9
...................... 5.5-9
...................... 5.5-9
...................... 5.5-9
...................... 5.5-9
...................... 5.5-9
..................... 5.5-13
..................... 5.5-13
...................... 5.1-3
...................... 5.1-3
...................... 5.1-3
...................... 5.1-3
...................... 5.5-9
...................... 5.5-9
...................... 5.5-9
...................... 5.5-9
..................... 5.5-13
..................... 5.5-13
...................... 5.1-5
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
..................... 5.1-19
...................... 5.1-5
..................... 5.1-20
..................... 5.5-13
..................... 5.1-20
..................... 5.1-20
...................... 5.5-8
...................... 5.5-8
...................... 5.5-9
..................... 5.1-19
..................... 5.5-14
..................... 5.5-14
..................... 5.5-14
..................... 5.5-12
..................... 5.5-12
..................... 5.5-12
..................... 5.5-12
..................... 5.5-12
..................... 5.5-13
..................... 5.5-13
Device Index
Device Index
Page
2N5885 ..................... 5.5-13
2N5886 ..................... 5.5-13
2N6027 ..................... 5.7-14
2N6028 ..................... 5.7-14
2N6031 ..................... 5.5-13
2N6035 ...................... 5.5-9
2N6036 ..................... 5.5-10
2N6038 ...................... 5.5-9
2N6039 ..................... 5.5-10
2N6040 ...................... 5.5-5
2N6041 ...................... 5.5-5
2N6042 ...................... 5.5-5
2N6043 ...................... 5.5-5
2N6044 ...................... 5.5-5
2N6045 ...................... 5.5-5
2N6050 ..................... 5.5-12
2N6051 ..................... 5.5-12
2N6052 ..................... 5.5-12
2N6055 ..................... 5.5-11
2N6056 ..................... 5.5-11
2N6057 ..................... 5.5-12
2N6058 ..................... 5.5-12
2N6059 ..................... 5.5-12
2N6071 ...................... 5.7-8
2N6071A ..................... 5.7-8
2N6071 B ..................... 5.7-8
2N6073 ...................... 5.7-8
2N6073A ..................... 5.7-8
2N6073B ..................... 5.7-8
2N6075 ...................... 5.7-8
2N6075A ..................... 5.7-8
2N6075B ..................... 5.7-8
2N6107 ...................... 5.5-4
2N6109 ...................... 5.5-4
2N6111 ...................... 5.5-4
2N6237 ...................... 5.7-3
2N6238 ...................... 5.7-3
2N6239 ...................... 5.7-3
2N6240 ...................... 5.7-3
2N6241 ...................... 5.7-3
2N6274 ..................... 5.5-14
2N6275 ..................... 5.5-14
2N6277 ..................... 5.5-14
2N6282 ..................... 5.5-13
2N6283 ..................... 5.5-13
2N6284 ..................... 5.5-13
2N6285 ..................... 5.5-13
2N6286 ..................... 5.5-13
2N6287 ..................... 5.5-13
2N6288 ...................... 5.5-4
2N6292 ...................... 5.5-4
2N6328 ..................... 5.5-13
2N6338 ..................... 5.5-13
2N6339 ..................... 5.5-13
2N6340 ..................... 5.5-13
2N6341 ..................... 5.5-13
2N6342 ..................... 5.7-10
2N6343 ..................... 5.7-10
2N6344 ..................... 5.7-10
2N6345 ..................... 5.7-10
2N6346 ..................... 5.7-10
2N6346A .................... 5.7-12
2N6347 ..................... 5.7~10
2N6347A .................... 5.7-12
2N6348 ..................... 5.7-10
2N6348A .................... 5.7-12
2N6349 ..................... 5.7-10
7.1-32
Device Index
Page
2N6349A .................... 5.7-12
2N6379 ..................... 5.5-14
2N6387 ...................... 5.5-5
2N6388 ...................... 5.5-5
2N6426 ...................... 5.1-4
2N6427 ...................... 5.1-4
2N6431 ..................... 5.1-18
2N6436 ..................... 5.5-13
2N6437 ..................... 5.5-13
2N6438 ..................... 5.5-13
2N6439 ..................... 5.10-7
2N6488 ...................... 5.5-6
2N6491 ...................... 5.5-6
2N6497 ...................... 5.5-4
2N6498 ...................... 5.5-4
2N6504 ...................... 5.7-5
2N6505 ...................... 5.7-5
2N6506 ...................... 5.7-5
2N6507 ...................... 5.7-5
2N6508 ...................... 5.7-5
2N6509 ...................... 5.7-5
2N6517 ...................... 5.1-5
2N6519 ...................... 5.1-5
2N6520 ...................... 5.1-5
2N6547 ..................... 5.5-12
2N6576 ..................... 5.5-12
2N6577 ..................... 5.5-12
2N6578 ..................... 5.5-12
2N6609 ...............•..... 5.5-13
2N6667 ...................... 5.5-5
2N6668 ...................... 5.5-5
2N7000 ..................... 5.1-21
2N7002LT1 ................... 5.1-23
2N7008 ..................... 5.1-21
2N930 ...................... 5.1-18
2N930A ..................... 5.1-18
3EZ10D5 .................... 5.2-18
3EZ11D5 .................... 5.2-18
3EZ110D5 ................... 5.2-19
3EZ120D5 ................... 5.2-19
3EZ13D5 .................... 5.2-18
3EZ130D5 ................... 5.2-19
3EZ14D5 .................... 5.2-18
3EZ140D5 ................... 5.2-19
3EZ160D5 ................... 5.2-19
3EZ19D5 .................... 5.2-18
3EZ190D5 ................... 5.2-19
3EZ200D5 ................... 5.2-19
3EZ22D5 .................... 5.2-18
3EZ220D5 . . . . . . . . . . . . . . . . . .. 5.2-19
3EZ240D5 ................... 5.2-19
3EZ27D5 .................... 5.2-18
3EZ28D5 .................... 5;2-18
3EZ33D5 .................... 5.2-18
3EZ330D5 . . . . . . . . . . . . . . . . . .. 5.2-19
3EZ36D5 . . . . . . . . . . . . . . . . . . .. 5.2-18
3EZ4.3D5 ................... 5.2-18
3EZ400D5 ................... 5.2-19
3EZ43D5 .................... 5.2-18
3EZ47D5 .................... 5.2-18
3EZ56D5 .................... 5.2-18
3EZ68D5 .................... 5.2-18
3EZ7.5D5 ................... 5.2-18
3EZ75D5 .................... 5.2-19
3EZ8.2D5 ................... 5.2-18
3EZ9.1D5 ................... 5.2-18
3EZ91D5 .................... 5.2-19
Motorola Master Selection Guide
Device Index
Device Index
Page
4N25 ........................ 5.8-6
4N25A . . . . . . . . . . . . . . . . . . . . . .. 5.8-6
4N26 ........................ 5.8-6
4N27 ........................ 5.8-6
4N28 ........................ 5.8-6
4N29 ........................ 5.8-7
4N29A ....................... 5.8-7
4N30 ........................ 5.8-7
4N31 ........................ 5.8-7
4N32 ........................ 5.8-7
4N33 ........................ 5.8-7
4N35 ........................ 5.8-6
4N36 ........................ 5.8-6
4N37 ........................ 5.8-6
4N38 ........................ 5.8-6
4N38A ....................... 5.8-6
68HC05A16 ................. 2.5-14
68HC05BD3 . . . . . . . . . . . . . . . .. 2.5-14
68HC05BD5 .......... 2.5-12, 2.5-14
68HC05BS8 ................. 2.5-14
68HC05B16 ................. 2.5-14
68HC05B32 ................. 2.5-14
68HC05B32 ................. 2.5-12
68HC05B4 .................. 2.5-14
68HC05B6 .................. 2.5-14
68HC05B8 .................. 2.5-14
68HC05CCV .......... 2.5-15,2.5-17
68HC05CJ4 ................. 2.5-15
68HC05CO ........... 2.5-12,2.5-14
68HC05C12AC .............. 2.5-15
68HC05C4 .................. 2.5-15
68HC05C4A . . . . . . . . . . . . . . . .. 2.5-15
68HC05C5 .................. 2.5-14
68HC05C8A ................. 2.5-15
68HC05C9 .................. 2.5-15
68HC05C9A ................. 2.5-15
68HC05D24 ................. 2.5-15
68HC05D32 ................. 2.5-15
68HC05D9 .................. 2.5-15
68HC05E16 ................. 2.5-12
68HC05E6 .................. 2.5-15
68HC05F4 .................. 2.5-15
68HC05F6 .................. 2.5-15
Motorola Master Selection Guide
Device Index
Page
68HC05F8
.............. 2.5-15
68HC05G1 .................. 2.5-15
68HC05G3 .................. 2.5-15
68HC05J1 ................... 2.5-15
68HC05J1A .......... 2.5-15,2.5-17
68HC05J3 . . .. .. . . .. . . . .. . . .. 2.5-15
68HC05KO
.. 2.5-15,2.5-17
68HC05K1 ........... 2.5-15,2.5-17
68HC05K3 ........... 2.5-15,2.5-17
68HC05L1 ................... 2.5-15
68HC05L 10 ................. 2.5-17
68HC05L11 ........... 2.5-16,2.5-17
68HC05L16 ................. 2.5-16
68HC05L2 . . .. .. . . .. . .. .. . . .. 2.5-15
68HC05L5 . . .. .. . . .. .. . .. . . .. 2.5-16
68HC05L7 ............ 2.5-16,2.5-17
68HC05L9 ............ 2.5-16,2.5-17
68HC05M4 ........... 2.5-16,2.5-17
68HC05P1 .................. 2.5-16
68HC05P3 .................. 2.5-16
68HC05P4 .................. 2.5-16
68HC05P6 .................. 2.5-16
68HC05P7 .................. 2.5-16
68HC05P7A ................. 2.5-12
68HC05P8 .................. 2.5-16
68HC05P9 .................. 2.5-16
68HC05P9A ................. 2.5-12
68HC05RC16 ................ 2.5-16
68HC05SC11 ................ 2.5-16
68HC05SC21 ................ 2.5-16
68HC05SC24 ................ 2.5-16
68HC05SC26 ................ 2.5-12
68HC05SC27 ................ 2.5-16
68HC05SR3 ................. 2.5-16
68HC05T1 ........... 2.5-16,2.5-17
68HC05T10 ................. 2.5-16
68HC05T2 ........... 2.5-16,2.5-17
68HC05V7 ........... 2.5-12,2.5-16
68HC05X16 ................. 2.5-16
68HC05X32 ................. 2.5-16
68HC05X4 .................. 2.5-16
68HC08XL36 ................ 2.5-12
68HC705A24 ................ 2.5-14
7.1-33
Device Index
Page
68HC705BD3 ......... 2.5-14,2.5-18
68HC705BD5 ................ 2.5-14
68HC705BS8 ................ 2.5-14
68HC705B16 ......... 2.5-14,2.5-18
68HC705B32 ......... 2.5-14,2.5-18
68HC705B5 .......... 2.5-14,2.5-18
68HC705CCV
...... 2.5-15,2.5-17
68HC705CJ4 ................ 2.5-15
68HC705C4A ......... 2.5-15,2.5-18
68HC705C5 ... 2.5-14,2.5-17,2.5-18
68HC705C8 .......... 2.5-14,2.5-17
68HC705C8A .. 2.5-15,2.5-17,2.5-18
68HC705C9 ................. 2.5-15
68HC705D9 .......... 2.5-15,2.5-18
68HC705E5 ................. 2.5-12
68HC705E6 .......... 2.5-15,2.5-18
68HC705F4 ................. 2.5-15
68HC705F6 .......... 2.5-15,2.5-18
68HC705F8 .......... 2.5-15,2.5-18
68HC705G1 .......... 2.5-15,2.5-18
68HC705G4 ................. 2.5-15
68HC705J1A .. 2.5-15,2.5-17,2.5-18
68HC705J2 ........... 2.5-15,2.5-18
68HC705J3 ........... 2.5-15,2.5-18
68HC705K1 ... 2.5-15,2.5-17,2.5-18
68HC705L1 .......... 2.5-15,2.5-18
68HC705L 10 ................ 2.5-16
68HC705L16 ......... 2.5-16,2.5-18
68HC705L2 ................. 2.5-15
68HC705L5 .......... 2.5-16,2.5-18
68HC705MC4 ............... 2.5-12
68HC705P3 ................. 2.5-18
68HC705P6 .......... 2.5-16,2.5-18
68HC705P9 .......... 2.5-16,2.5-18
68HC705RC16 ........ 2.5-12,2.5-16
68HC705RC17 . . .. . .. . . . . .... 2.5-12
68HC705SR3 .. 2.5-12,2.5-16,2.5-18
68HC705T10 ......... 2.5-16,2.5-18
68HC705V8 .......... 2.5-16,2.5-18
68HC705X32 .. 2.5-12,2.5-16,2.5-18
68HC705X4 .......... 2.5-16,2.5-18
68HC708XL36 ............... 2.5-12
68HC805K3 ................. 2.5-12
Device Index
Device Index
7.1-34
Motorola Master Selection Guide
General Index
A
B (continued)
A-D Converters ....................................... 4.5-2
Acceleration Sensors ................................. 5.9-10
Bipolar Transistors, Power, RF ................. 5.10-6-5.10-13
Block Erasable Flash EEPROM (BEFLASH) ............. 2.6-13
........................... 3.1-14
Bounce Eliminator
Brushless DC Motor Controllers ..............
. ... 4.3-4
Buffers ......... .
. ... 3.1-14
Buffers, 3-State ..
3.1-14
Bus Interface
.. 3.1-14
Adjustable Output Regulators ......................
.. 4.2-4
. ... 4.7-31
ADPCM Transcoder ..... . ............ .
Advanced Comb Filter-II (ACF-II) .. .
. ............. 4.8-14
Advanced Multistandard TV Video/Sound IF .............. 4.8-10
Advanced NTSC Comb Filter ..
. ............ 4.8-13
Advanced Packaging ............ .
1.1-1,1.1-7
. .... 4.8-24
Advanced PAUNTSC Encoder ....... .
AGC Amplifiers .................... .
Alternator Voltage Regulator.............
c
C-Compiler Packages
2.1-13
.4.8-2
C-Quam AM Stereo Decoders ................. .
Cache/Memory Management Units ...................... 2.3-3
Calling Line ID Receiver Evaluation Kit ...
4.7-32
Calling Line Identification (CLlD) Receiver
with Ring Detector ................... .
4.7-32
Case Outlines, Logic. . . . . . . . . . . . . . . . . . . .
3.1-53
CATV Distribution, RF ........................ 5.10-30-5.10-33
CBM ..........................................
.. 3.1-17
CDA Architecture (Customer Defined Arrays) ........ 1.1-1,1.1-4
Central Processing Unit .................. .
. .... 2.6-2
Central Processing Units ................ .
. .. 2.6-12
Clock Distribution Chips ................ .
. ... 3.1-17
..4.1-5
. ........... 4.9-11
Amplifiers - Miscellaneous .............................. 4.1-6
Amplifiers and Comparators Package Overview ........... 4.1-8
Amplifiers, High Power, RF ................... 5.10-28-5.10-29
Amplifiers, Integrated Power, RF........... . ......... 5.10-23
Amplifiers, Low Power, RF .................... 5.10-30-5.10-34
Amplifiers, RF ............................... 5.10-26-5.10-34
Amplifiers, Video, RF ................
. 5.10-35
Analog Circuits Package Overview .... .
Analog MPQ Table .................. .
.4.10-4
.. ...... 4.11-4
Analog-to-Digital Converter (ADC) .............. .
..2.6-13
Analog-to-Digital Conversion Modules ................... 2.6-13
AND/NAND Gates.............................
.. .. 3.1-25
Application Development System ............... .
..2.2-12
Clock Drivers...............................
.. .. 3.1-17
Closed Loop Brushless Motor Adapter .................... 4.3-7
Closed-Caption Decoder .............................. 4.8-15
CMOS ................................... 1.1-1,1.1-3,3.1-2
CMOS A-D Converters
... 4.5-2
CMOS D-A Converters ................................ 4.5-3
CMOS Display Drivers ................................. 4.6-9
CMOS Dual Programmable Comparators ................. 4.1-6
CMOS Dual Programmable Operational Amplifiers ......... 4.1-6
CMOS Dual Video Amplifiers ............................ 4.1-6
CMOS Quad Programmable Operational Amplifiers ........ 4.1-6
Coax Cable Drivers ................................... 3.1-18
Comb Filters .......................................... 4.8-3
Communication Modules .............................. 2.6-13
Communications Circuits Package Overview ............. 4.7-39
Communications, Power and Signal Technologies Group ... 5.0-1
Comparators ................................... 3.1-18,4.1-7
Complex Gates ...................................... 3.1-27
Configurable Timer Module (CTM) ...................... 2.6-12
Configuration and Order Information for MMDS/MMEVS ... 2.5-14
Configuration and Order Information for Other Motorola
DevelopmentTools (EVM/EVS/ICS) ................... 2.5-17
Configuration and Order Information for Programmers ..... 2.5-18
Consumer Electronic Circuits Package Overview ......... 4.8-25
Application Specific Static RAMs ........................ 2.8-2
Arithmetic Operators .................................. 3.1-14
ASIC Preview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1-1
ASIC Regional Design Centers -
United States
1.1-8
ASIC Regional Design Centers -International.........
1.1-8
Async 12 to 35 ns 5 V Fast Static RAMs .................. 2.8-3
Async 8 to 25 ns 3.3 V Fast Static RAMs ................. 2.8-3
Audio/Servo Loads, Bipolar Power Transistors ............ 5.5-15
Automotive Direction Indicator ........................... 4.9-8
Automotive Electronic Circuits Package Overview ......... 4.9-12
Automotive ISO 9141 Serial Link Driver. . . . .
. .. 4.9-10
Automotive Wash Wiper Timer .......................... 4.9-9
B
Balanced Modulator/Demodulator ..... .
. .......... 4.7-4
Battery Management Circuits .......................... 4.2-21
Bipolar ......................................... 1.1-1,1.1-2
Bipolar A-D Converters ................................ 4.5-2
Bipolar Amplifiers ...................................... 4.1-6
Bipolar Dual Operational Amplifiers ...................... 4.1-6
Bipolar Dual Voltage Comparators ....................... 4.1-6
Bipolar Power Electronic Lamp Ballasts .........
Bipolar Power Transistors ...............
Continuously Variable Slope Delta (CVSD)
Modulator/Demodulator .............................. 4.7-33
Converters .......................................... 3.1-19
Coprocessors.. . ..................................... 2.2-9
Cordless Universal Telephone Interface ................. 4.7-22
Counters ............................................ 3.1-19
CPSTG Surface Mount Information ..................... 5.11-2
CPU16...........
. ............................ 2.6-12
CPU32 .............................................. 2.6-12
CRT Drivers, RF .................................... 5.10-35
. ..... 5.5-16
. ....... 5.5-2
Bipolar Power TranSistors, Audio ....................... 5.5-15
Bipolar Power Transistors, Audio/Servo Loads ............ 5.5-15
Bipolar Power Transistors, DPAK ....................... 5.5-10
Bipolar Power Transistors, Electronic Lamp Ballasts ....... 5.5-16
Bipolar Power TranSistors, Metal ....................... 5.5-11
Bipolar Power Transistors, Plastic ..... 5.5-3, 5.5-6, 5.5-7, 5.5-8
Bipolar Telecommunication Circuit Summary ............. 4.7-34
Motorola Master Selection Guide
7.2-1
General Index
General Index
C (continued)
E (continued)
CSIC Microcontroller Division World Wide Web Site ... . .. 2.5-22
Current Mode Switching Regulator ...................... 4.7-30
ECLinPS .............. _............................. 3.1-50
ECLinPS lite ................................. 3.1-50, 3.1-52
EDACs ............................................. 3.1-22
D
EIA Standard Line Drivers .............................. 4.6--7
D-A Converters ....................................... 4.5-3
EIA Standard Line Receivers ............................ 4.6-7
Data Communication Devices .......................... 2.2-10
EIA-232-EN.28 CMOS Drivers/Receivers ................ 4.6--8
Data Conversion Package Overview .........
. .... 4.5-4
DC Servo Motor Controller/Driver ........................ 4.3-8
Electronic Ignition ..................................... 4.9-2
Decoder ............................................. 3.1-22
Decoder/Demultiplexers ............................... 3.1-21
Decoders ............................. .
Deflection
.......... 3.1-21
...... 4.8-3
Electronic Telephone .................................. 4.7-19
Electronic Telephone Circuits .......................... 4.7-19
Embedded Controllers ................................. 2.2-5
Encoder/Decoder ..................................... 3.1-22
Encoders ...................................... 3.1-22,4.8-3
Demultiplexers .....
..... 3.1-21
Design Automation Software ................. .
Design-In Software Packages ................ .
1.1-1,1.1--6
.... 2.1-12
Enhanced Ethernet Transceiver ......................... 4.6-2
3.1-21
Detectors ............................. .
Developer's Workbench ................................ 2.7-6
Entertainment Radio Receiver Circuits - Audio Amplifiers ... 4.8-2
DevelopmentTools ..........................
Enhanced Closed-Caption Decoder .................... 4.8-16
. ..... 2.2-12
Device Index, Logic ................................... 3.1-40
Device Nomenclatures, logic ...........
. .... 3.1-49
Digital I/O and Special Functions ........................ 2.6-2
Digital Signal Processors ... . . . . . . . . . . . . . . . .
. ........ 2.1-1
Digital-to-Analog Conversion ............................ 2.6-2
Digitally Controlled Video Processor for Multimedia
Applications ......................................... 4.8-6
Direct Memory Access (DMA) .......................... 2.6-13
Discrete Products ........
. . . . . . . . . . . . . . . . ..... 5.0-1
Discrete Transistors, RF ....................... 5.10-2-5.10-19
Display Decode Drivers ..................
Dividers . . . . . . . . . .
.............
Entertainment Radio Receiver Circuits ................... 4.8-2
Entertainment Receiver RF/IF ........................... 4.8-2
ETl Series Arrays ............................... 1.1-1,1.1-2
Evaluation Boards, RF Monolithic Integrated Circuits ..... 5.10-20
Expanders ........................................... 3.1-22
EZFETs, HDTMOS Power MOSFETs .................... 5.4-9
F
FACT ............................................... 3.1-50
Family Wideband General Purpose Amplifiers ............. 4.1-5
FAST ............................................... 3.1-49
Fast Static RAM Modules ............................... 2.8-4
. ...... 3.1-22
. ........ 3.1-22
Fast Static RAMs ...................................... 2.8-2
DMA Controliers ................... . ................. 2.2-9
Fiber Distributed Data Interface ........................ 2.2-11
Double-Ended Controliers ............................. 4.2-12
DPAK .............................................. 5.5-10
DPAK-Surface Mount, Bipolar Power Transistors ......... 5.5-10
DRAM Modules ....................................... 2.8-5
Fiber Optic Receivers, RF ............................ 5.10--35
Driver ............................................... 3.1-22
FETs, TMOS Power MOSFETs .......................... 5.4--1
Field Programmable Gate Arrays (FPGA) ................. 3.1-5
Field-EffectTransistors, Small Signal ............ 5.1-19,5.1-41
5.0 V, 200 M-BitiSec PR-IV Hard Disk Drive
Read Channel ....................................... 4.6--5
DSP Development Tools ............................... 2.1-10
DTlCircuits ......................................... 3.1-51
Dual Bipolar Comparators .............................. 4.1-7
Fixed Voltage Medium and low Dropout Regulators ....... ' 4.2-3
Dual Channel Controllers ... . . . . . . . . . . . . . . . . . . .. . ..... 4.2-15
Dual CMOS Comparators .............................. 4.1-7
Flip-Flops ........................................... 3.1-23
Dual Comparators ..................................... 4.1-7
Dual Data Link Controller .............................. 4.7-17
Freeware Bulletin Board ............................... 2.5-22
Dual Operational Amplifier and Dual Voltage Comparator ... 4.1-6
Dual Operational Amplifiers ............................. 4.1-3
Dual Timing Circuits .................................. 4.10-2
G
Dual Tone Multiple Frequency Receiver ................. 4.7-15
Dual Universal Asynchronous/Synchronous Receiver
Transmitter (DUART) ................................ 2.6-13
Dynamic RAMs ....................................... 2.8-5
Dynamic RAMs (HCMOS) .............................. 2.8-6
Flash EEPROM (FLASH) .............................. 2.6-13
Flip-Flop/Registers ................................... 3.1-23
Footprints for Soldering, CPSTG ....................... 5.11-5
Fuzzy logic ......................................... 2.6--26
GaAs Amplifier Supervisory Circuit ....................... 4.2-7
GaAs Rectifiers Power Manager ........................ 5.6--14
E
Gates
AND/NAND .......................................
Complex .........................................
NOR .............................................
OR ..............................................
XORIXNOR ......................................
ECl ................................................. 3.1-3
General Purpose I/O .................................. 2.2-11
ECl Series Arrays ............................... 1.1-1,1.1-2
General Purpose Timer (GPT) .......................... 2.6-12
General Index
7.2-2
3.1-25
3.1-27
3.1-28
3.1-28
3.1-27
Motorola Master Selection Guide
General Index
H
L (continued)
H4CSeries .................•....•.............. 1.1-1,1.1-4
H4CPlusSeries ......................•.......... 1.1-1,1.1-5
Linear Voltage Regulators .............................. 4.2-2
Linear Voltage Regulators - Adjustable Output ............ 4.2-4
Hard Disk Drive Read Channel .......................... 4.6-8
HDC Series ..................................... 1.1-1,1.1-3
Linear Voltage Regulators - Fixed Output ................. 4.2-2
Logic Device Index ................................... 3.1-40
Logic Devices
CMOS ............................................ 3.1-2
ECL .............................................. 3.1-3
Family Comparison ................................. 3.1-1
HowtoChoose .................................... 3.1-1
TTL ....................... : ....................... 3.1-2
HDTMOS Power MOSFETs ............................. 5.4-3
HDTMOS Power MOSFETs, EZFET .............. 5.4-4,5.4-17
HDTMOS Power MOSFETs, Micr08 ............... 5.4-4, 5.4-17
Hex EIA-485 Transceiver with Three-State Outputs ....... 4.6-4
HF Transistors, RF ................................... 5.10-6
High Cell Density (HDTMOS) ........................... 5.4-3
High Frequency Amplifiers .............................. 4.1-5
High Performance Decoder Driver/Sink Driver ............. 4.6-3
High Side TMOS Driver ................................ 4.9-7
High Voltage Switching Regulator ................ 4.2-13, 4.2-14
Logic Functions ................................ : ..... 3.1-13
Logic Literature Listing ................................ 3.1-88
LonWorks Products .................................... 2.7-1
Low Dropout Regulator ................................. 4.2--6
Low Side Protected Switch ............................. 4.9--6
High-Side Driver Switch ................................ 4.3-4
High-Speed CMOS ................................... 3.1-50
LS - Low Power Schottky ............................. 3.1-49
LVQ ................................................ 3.1-51
Hot-Carrier (Schottky) Diodes, Small Signal ............. 5.1-32
How to Access Freeware .............................. 2.6-26
HTL Circuits ......................................... 3.1-51
M
M6800 Series Microprocessors and Peripherals .......... 2.6-10
Hybrid Power Modules ................................. 5.3-1
M68000 Family ....................................... 2.2-1
M68040FPSP ........................................ 2.2-12
M68300 Family ...................................... 2.6-19
M68340EVS - Evaluation System ..................... 2.2-12
M68ECOxOl DP - Evaluation Boards for Embedded
Controllers ......................................... 2.2-12
M68HC05 CSIC Family ................................ 2.5-2
M68HC05 Industry Solutions ......................... 2.5-2
68HC05 General-Purpose Microcontrollers .......... 2.5-2
Automotive .........•............................ 2.5-2
Computer ....................................... 2.5-2
Consumer ....................................... 2.5-3
Industrial ., ...................................... 2.5-3
Low-Voltage Microcontrollers ...................... 2.5-2
Telecommunications .....••....................... 2.5-3
Television and Video .............................. 2.5-3
ICU ...........•..................................... 3.1-29
IEEE 802.3 Transceivers ............................... 4.6-8
IGBTs (Insulated Gate Bipolar Transistor), Power
MOSFETs ................................... 5.4-7,5.4-22
IGBTs, Hybrid Power Modules ........................... 5.3-2
Ignition IGBTs, Power MOSFETs ....................... 5.4-22
Industrial Control Unit ................................. 3.1-29
Infrared Transceiver ................................... 4.7-4
Insulated Gate Bipolar Transistor, Power MOSFETs . 5.4-7,5.4-22
Insulated Gate Bipolar Transistors, Hybrid Power Modules .. 5.3-2
Integrated Circuits, RF Monolithic .............. 5.10-20-5.10-25
Integrated Circuits, RF Monolithic, Evaluation Boards ..... 5.10-20
M68HC05 Family ..................................... 2.6-22
M68HC05 Microcontroller Development Tools
Choosing Between the MMEVS and MMDS ........... 2.5-14
Modular Architecture Benefits ....................... 2.5-14
M68HC08 Family ..................................... 2.5-13
M68HC11 Family ...........................•... 2.6-2,2.6-22
Integrated Power Amplifiers, RF ....................... 5.10-23
Integrated Power Stage IGBTs, Hybrid Power Modules ..... 5.3-2
Integrated Processors .................................. 2.2-7
Integrated Services Digital Network ..................... 4.7-15
Integration Modules ................................... 2.6-12
Interface Circuits Package Overview .................... 4.6-10
Intermodule Bus Peripherals ........................... 2.6-12
M68HC16 Family ..................................... 2.6-14
M68KESW-PC1 ...................................... 2.2-12
Inverter/Buffers, 2-State ............................... 3.1-29
M88000 RISC Family .................................. 2.3-1
Masked ROM (MRM) ................................. 2.6-13
Math Coprocessor ............•.....•.................. 2.6-2
Inverters ............................................ 3.1-29
ISDN Voice/Data Circuits .............................. 4.7-15
ISO 8802-3[IEEE 802.3]1 OBASE-T Transceiver .......... 4.6-3
MC2681 - Dual Universal Asynchronous
ReceiverlTransmitter, DUART ........................ 2.2-10
L
MC68000 MC68008 MC68010 MC68020 MC68030 MC68040 MC68060 MC68184 MC68185 -
Land Mobile/Portable Amplifiers, RF ........... 5.10-28-5.10-29
Latches .........................•................... 3.1-30
LCX ................................................ 3.1-51
Line Drivers .......................................... 4.6-7
Line Receivers ........................................ 4.6-7
Line Transceivers ..................................... 4.6-7
Linear Four-Quadrant Multipliers ....................... 4.10-2
Linear Transistors, RF ....................... 5.10-12-5.10-13
Motorola Master Selection Guide
7.2-3
The 16-Bit Foundations ..........••.........
An 8-Bit Compatible Competitor ..•........•..
A Virtual Memory Enhancement .............
The Original 32-Bit Performance Standard ....
The Second Generation 32-Bit MPU ..........
Third-Generation 32-Bit Microprocessor .....•.
Superscaler 32-Bit Microprocessor ...........
Broadband Interface Controller ..............
Twisted-Pair Modem .......................
2.2-4
2.2-4
2.2-4
2.2-4
2.2-3
2.2-3
2.2-3
2.2-9
2.2-9
General Index
General Index
M (continued)
M (continued)
MC68194 -
Carrierband Modem .....................•. 2.2-10
MC68195 MC68230 -
LocalTalk Adaptor ......................... 2.2-10
Parallel Interfacemmer, PlfT ............... 2.2-11
MC68302 MC68306 -
Integrated Multiprotocol Processor ........... 2.2-7
Integrated 68ECOO Processor ............... 2.2-8
MC68330 MC68331 -
Integrated CPU32 Processo~ ................ 2.2-8
32-Bit Microcontroller ....................... 2.2-8
MC68332 -
32-Bit Microcontroller ....................... 2.2-8
MC68334 MC68340 -
32-Bit Microcontroller ....................... 2.2-8
Integrated Multiprotocol Processor with DMA .. 2.2-8
MC68440 -
Dual Direct Memory Access Controller, DDMA . 2.2-9
MI-Bus Interface Stepper Motor Controller ...........•.... 4.9-8
Micro8 Products ....................................... 5.4-8
Microcomputer Components, Single-Chip Microcontrollers
(MCU) ........................................ 2.5-1,2.6-1
Microcontroller Development Tools ............... 2.5-14, 2.6-22
Microcontroller Electronic Bulletin Board .........•..•.... 2.6-26
MicroCool OFP (Ouad Flat Package) ............... 1.1-1,1.1-7
Microprocessor Voltage Regulator and SuperviSOry Circuit .. 4.2-8
Microprocessors ................................ 2.2-2, 2.3-2
Microwave Transistors, RF ............. "...... 5.10-10-5.10-11
MiniMOS Products ............................. 5.4-8, 5.4-17
Miscellaneous Logic .................................. 3.1-31
Modular Microcontroller Families ....................•.. 2.6-22
Modular Microcontrollers .............................. 2.6-12
Modulator ............................................ 4.8-4
Monitor Subsystem .................................... 4.8-4
Monolithic Integrated Circuits, RF .............. 5.10-20-5.10-25
MOSAIC III ..................................... 1.1-1,1.1-2
MOSFET/IGBT Drivers ................................ 4.2-25
MC68450 -
DMA Controller, DMAC ..................... 2.2-9
MC68605 -
X.25 Protocol Controller, XPC .............. 2.2-10
MC68606 - Multi-Link LAPD Controller CCITT
0.920/0.921, LAPD ................................. 2.2-10
MC68681 - Dual Universal Asynchronous
ReceiverfTransmitter, DUART ........................ 2.2-10
MC68824 - Token Bus Controller, TBC .................. 2.2-9
MCS883S MCS8837 -
FDDI Clock Generator ..................... 2.2-11
Elasticity Buffer and Link Manager .......... 2.2-11
MCS8838 - Media Access Controller .•................. 2.2-11
MCS8839-FDDI System Interface .................... 2.2-11
MCS8851 - Paged Memory Management Unit, PMMU ..... 2.2-9
MCS8881 - A Floating Point Coprocessor ................ 2.2-9
MCS8882 -
Enhanced Floating Point Coprocessor ........ 2.2-9
MCS8901 - Multifunction Peripheral, MFP .............. 2.2-11
MCS8ECOOO - Low-Powered HCMOS Embedded
Controller ........................................... 2.2-8
MCS8EC020 - 32-Bit Embedded Controller .............. 2.2-8
MCS8EC030 - 32-Bit Enhanced Embedded Controller ..... 2.2-8
MCS8EC040 - 32-Bit High-Performance Embedded
Controller ........................................... 2.2-5
MCS8F333 - 32-Bit Microcontroller ..................... 2.2-8
MCS8HCOOO - A Micropower Alternative ................ 2.2-4
MCS8HC001 - Low Power HCMOS 8-/1S-/32-Bit
Microprocessor ...................................... 2.2-4
MCS8HC05 Microcontrollers ............................ 2.5-8
MC881 OORC -
32-Bit RISC Microprocessor ............... 2.3-2
MC8811 ORC - 32-Bit RISC Microprocessor .............. 2.3-2
MC88200RC - 1S-Kiloby1e Cache/Memory Management
Unit ................................................ 2.3-3
MC88204RC - 64K-By1e Cache/Memory Management
Unit ................................................ 2.3-3
MC88410 -
Secondary Cache Controller ................ 2.3-3
MCA Arrays .......................................... 1.1-2
MECL 10H .......................................... 3.1-49
MECL 10K .......................................... 3.1-49
MECL III ............................................ 3.1-51
Medium Power MOSFETs, TMOS ................ 5.4-9,5.4-18
Memory Modules ..................................... 2.6-13
Memory Products ..................................... 2.8-1
Memory Support ..................................... 3.1-31
Metal ............................................... 5.5-11
Metal Gate 14000 Series CMOS ........................ 3.1-50
Metal TQ-204AA, TQ-204AE, Bipolar Power Transistors .. 5.5-11
Mfax - Touch-Tone FAX for Technical Data ............... S.1-1
General Index
7.2-4
MOSFETs, Power, RF .......................... 5.10-4-5.10-5
MOSFETs, Power, TMOS ............................... 5.4-1
Motor Controllers ...................................... 4.3-4
Motorola Programmable Array (MPA) ....•............... 3.1-5
Motorola SPS World Marketing Internet Server ..•......... 6.1-1
Motorola Technical Training Courses ...•................. S.1-7
MPC105 PCI Bridge/Memory Controller ...........•..... 2.4-15
MPC106 PCI Bridge/Memory Controller .........•....... 2.4-16
MPCS01 RISC Microprocessor .......................... 2.4-2
MPCS02 RISC Microprocessor .......................... 2.4-3
MPCS03 RISC Microprocessor .......................... 2.4-3
MPCS03e RISC Microprocessor •......................•. 2.4-8
MPCS04 RISC Microprocessor .......................... 2.4-9
MPCS04e RISC Microprocessor ...................•..... 2.4-9
MPCS20 RISC Microprocessor ......................... 2.4-13
Multi-Channel Communications Interface (MCCI) .....•... 2.6-13
Multiplexer/Data Selectors .............................
Multipliers ...•••........................•............
Multistandard Videoffimebase Processor .•..............
Multivibrators ........................................
3.1-31
4.10-2
4.8-12
3.1-33
N
NAND Gates ......................................... 3.1-25
Narrowband Dual Conversion Receivers - FMlFSK - VHF .. 4.7-3
Narrowband FM Coilless Detector IF Subsystem ........... 4.7-7
Narrowband FM Receiver .............................. 4.7-8
Narrowband Single Conversion Receivers - VHF .......•.. 4.7-2
Network Devices ...................................... 2.2-9
Neuron Chips ......................................... 2.7-2
NOR Gates .......................................... 3.1-28
o
OACS (Open Architecture CAD System) ..•.•.•..... 1.1-1,1.1-8
Octal Serial Switch .................................... 4.9-5
OMPAC (Over-Molded Pad Array Carrier) .......... 1.1-1,1.1-7
On-Chip Memory ....................................... 2.6-2
On-Line Help ................................. 2.5-22, 2.6-26
Motorola Master Selection Guide
General Index
o (continued)
P (continued)
One-Time Programmable (OTP) / Emulator MCUs ........ 2.5-10
Power/Motor Control Circuits Package Overview .......... 4.3-12
Operational Amplifiers .............•.................... 4.1-2
PowerPC RISC Family ................................. 2.4-1
Precision Low Voltage References ....................... 4.4-2
Prescalers ........................................... 3.1--34
Optoelectronic Devices ................................. 5.8-1
Optoelectronic Devices, 6-Pin Devices ............. 5.8-1, 5.8-5
Pressure Sensors, 4-Pin ................... 5.9-5, 5.9-7, 5.9-9
Pressure Sensors, 6-Pin ................... 5.9-5,5.9-7,5.9-8
Optoelectronic Devices, Optoisolators .............. 5.8-1, 5.8-2
Optoelectronic Devices, POWER OPTO Isolators ... 5.8-1, 5.8-10
Pressure Sensors, Compensated and Calibrated
(On-Chip) .................................... 5.9-6,5.9-7
Optoisolators, Optoelectronic Devices .............. 5.8-1, 5.8-2
Optoisolators, So-a ................................... 5.8-9
OR Gates ........................................... 3.1-28
Pressure Sensors, Compensated and Calibrated,
Medical Grade ....................................... 5.9-6
Ordering Information, Logic ............................ 3.1-49
Parity Checkers ...................................... 3.1--34
Pressure Sensors, High Impedance ...................... 5.9-6
Pressure Sensors, Motorola's Patented X-ducer ........... 5.9-2
Pressure Sensors, Packaging Options .................. 5.9-12
Pressure Sensors, Signal Conditioned .............. 5.9-6, 5.9-8
Pressure Sensors, Uncompensated ...................... 5.9-6
Programmable Logic ................................... 3.1-5
Programmable Telephone Line Interface Circuit with
Loudspeaker Amplifier ............................... 4.7-23
Programmable Delay Chips ............................ 3.1--35
PBX Architecture (Analog Transmission) ................. 4.7-12
PCI (peripheral component interconnect) bus ............. 2.4-15
PROMs, Logic ....................................... 3.1--35
Pulse-Width Modulation ................................ 2.6-2
Oscillatormmers ..................................... 3.1--34
Oscillators ........................................... 3.1--34
Over/Undervoltage Protection Circuit .................... 4.2-18
Overvoltage Crowbar Sensing Circuit ................... 4.2-18
p
Packaging Specifications, CPSTG ...................... 5.12-7
PCM Mono-Circuits Codee-Filters (CMOS LSI) .......... 4.7-12
Q
Peripheral Drivers ..................................... 4.6-8
Peripherals .................................... 2.1-6,2.1-12
QFP-MCR (Quad Flat Package-Molded Carrier Ring) ....... 1.1-1
QFP-MCR (Quad Flat Package-Molded Carrier Ring) ...... 1.1-7
Quad Bipolar Comparators ............................. 4.1-7
Phase-Locked Loop .................................. 3.1--34
Phase-Locked Loop Components ...................... 4.7--36
Picture--in-Picture (PIP) Controller ...................... 4.8-11
Quad CMOS Comparators ..............................
Quad Comparators ....................................
Quad Fuel Injector Driver ...............................
Quad Operational Amplifiers ............................
Quad Programmable Operational Amplifier ................
Pin Conversion, Logic ................................. 3.1-86
PLCC ............................................... 4.11-4
PLL Frequency Synthesizers ........................... 4.7--36
PLL Tuning Circuit with 3-Wire Bus ..................... 4.8-22
4.1-7
4.1-7
4.9-4
4.1-4
4.1-6
Queued Analog-to-Digital Converter (QADC) ............. 2.6-13
Queued Serial Module (QSM) .......................... 2.6-13
PLL Tuning Circuit with 12C Bus .......... 4.8-20, 4.8-22, 4.8-23
PLL Tuning Circuits with 3-Wire Bus .................... 4.8-19
R
PLL Tuning Circuits with 12C Bus ....................... 4.8-21
Power Audio Output Stage ............................. 5.5-15
RAMs, Logic ......................................... 3.1-35
Read/Write Channel ................................... 4.6-8
Power Bipolar Transistors, RF .................. 5.10--6-5.10-13
Power Controllers ..................................... 4.3-2
Receiver Functions, RF ...................... 5.10-21-5.10-22
Receivers ........................................... 3.1--35
Rectifier Numbering System ............................ 5.6-2
Power Factor Controllers ....................... 4.2-15, 4.2-16
Power Management Controller .......................... 4.2-7
Power MOSFETs, D2PAK ............... 5.4-11,5.4-19,5.4-21
Rectifiers ............................................. 5.6-1
Power MOSFETs, D3PAK ............................. 5.4-12
Rectifiers, Application Specific .......................... 5.6-3
Power MOSFETs, DPAK ................ 5.4-10, 5.4-18, 5.4-20
Rectifiers, Automotive Transient Suppressors ............. 5.6-3
Rectifiers, Axial Lead Schottky .......................... 5.6-8
Rectifiers, Axial Lead Ultrafast ......................... 5.6-10
Power MOSFETs, High Power Products ................. 5.4-16
Power MOSFETs, Ignition IGBTs ........................ 5.4-7
Power MOSFETs, Logic Level Packages ......... 5.4-20, 5.4-21
Rectifiers, Fast Recovery .............................. 5.6-13
Rectifiers, GaAs Power Manager ....................... 5.6-14
Power MOSFETs, RF .......................... 5.1 ~.1 (}-5
Power MOSFETs, So-a ......................... 5.4-6,5.4-17
Rectifiers,
Rectifiers,
Rectifiers,
Rectifiers,
Rectifiers,
Power MOSFETs, SOT-223 .............. 5.4-9, 5.4-18, 5.4-20
Power MOSFETs, TMOS ............................... 5.4-1
Power MOSFETs, T0-220AB ............ 5.4-13,5.4-19,5.4-21
Power MOSFETs, T0-247 Isolated Mounting Hole ........ 5.4-15
Power MOSFETs, T0-264 High Power Products ......... 5.4-16
General Purpose ............................ 5.6-13
Low VF Schottky ............................. 5.6-3
MEGAHERTZ ............................... 5.6-3
POWERTAP II ........................ 5.6-9,5.6-12
SCANSWITCH .............................. 5.6-3
POWER OPTO Isolators, Optoelectronic Devices ... 5.8-1, 5.8-10
Rectifiers, Surface Mount Schottky ......................• 5.6-4
Rectifiers, Surface Mount Ultrafast ...................... 5.6-10
Rectifiers, SWITCHMODE .. : ........................... 5.6-4
Power Supply Circuits Package Overview ............... 4.2-26
Rectifiers, T0-218 Types and T0-247 Schottky ........... 5.6-8
Power MOSFETs, T0--3PBL .......•................... 5.4-16
Motorola Master Selection Guide
7.2-5
General Index
General Index
R (continued)
S (continued)
Rectifiers, T0-218 Types Ultrafast .................... " 5.6-12
Single Timing Circuits ............................... :. 4.10-2
Single-Chip Integration Module (SCIM) .................. 2.6-12
Rectifiers, T0-220 Type Schottky ...................... :. 5.6~7
Rectifiers, TO-220 Type Ultrafast ....................... 5.6-11
Rectifiers, T0-247 Ultrafast ............................ 5.6-12
Rectifiers, Ultrafast ................................... 5.6-10
Register Files ........................................ 3.1-36
Registers ............................................ 3.1-36
RF Amplifiers ............ : .................. 5.10-26-5.10-34
RF Communications ................................... 4.7-2
RF CRT Drivers ..................................... 5.10-35
RF Discrete Transistors ....................... 5.10-2-5.10-19
RF HF Transistors .................................... 5.10-6
RF High Power Land Mobile/Portable Amplifiers . 5.10-28-5.10-29
RF High Power TV Transmitters ...................... , 5.10-29
RF Integrated Power Amplifiers ....................... 5.10-23
RF Linear Transistors ........................ 5.10-12-5.10-13
RF Low Power CATV Distribution .............. 5.10-30-5.10-33
RF Microwave Transistors .................... 5.10-10-5.10-11
RF Monolithic Integrated Circuits .............. 5.10-20-5.1'0-25
RF Power Bipolar Power Transistors ............ 5.10-6-5.10-13
RF Power MOSFETs ........................... 5.10-4-5.10-5
RF Products ......................................... 5.10-1
RF Receiver Functions ....................... 5.10-21-5.10-22
RF Small Signal Transistors ................... 5.10-14-5.10-19
RF Switching ....................................... 5.10-21
RF Transmitter Functions ..................... 5.10-22-5.10-24
RF UHF Transistors ........................... 5.10-7-5.10-8
RF VHF Transistors ............................ 5.10~5.10-7
RF, PFP-16 ........................................ 5.10-23
RF, SC-70/S0T-323 ........................ 5.10-17-5.10-18
RF, S0-16 ................................. 5.10-21-5.10-25
RF, So-a .......................... 5.10-8,5.10-17-5.10-25
RF, SOT-143 .............. 5.10-17-5.10-19,5.10-21-5.10-22
RF, SOT-23 ....................... 5.10-16,5.10-18-5.10-19
RF, TSSOP-16 ............ 5.10-21-5.10-22,5.10-24-5.10-25
RF, TSSOP-20 ..................................... 5.10-22
s
Schmitt Triggers ...................................... 3.1-36
SCSI Bus Terminators ................................. 3.1-36
SCSI Regulator ....................................... 4.2--8
Second Generation SIT-Interface Transceivers ........... 4.7-16
Second Generation U-Interface Transceivers ............ 4.7-16
Semicustom Application Specific Integrated Circuits . . . . . . .. 1.0-1
Sensors ............................................. , 5.9-1
Serial Communication .................................. 2.6-2
Shift Registers ....................................... 3.1-36
Sigma-Delta A-D Converters ........................... 4.5-2
Sigma-Delta D-A Converters ........................... 4.5-3
Silicon Controlled Rectifiers (SCRs), Thyristors ............ 5.7-2
Single Bipolar Comparators ............................. 4.1-7
Single CMOS Comparators ............................. 4.1-7
Single Comparators .................................... 4.1-7
Single Operational Amplifiers ........................... 4.1-2
General Index
7.2-6
Single-Ended Controllers ............................. " 4.2-9
Single-Ended Controllers with On-Chip Power Switch ..... 4.2-11
Small Signal Bipolar Transistors .................. 5.1-2,5.1-40
Small Signal GreenLine Devices ........................ 5.1-40
Small
Small
Small
Small
Signal Transistors, RF ., ................ 5.10-14-5.10-19
Signal Transistors .............................. " 5.1-1
Signal Tuning and Switching Diodes. 5.1-24,5.1-34,5.1-41
Signal, D0-204AA (D0-7) ................ 5.1-25,5.1-31
Small
Small
Small
Small
Small
Small
Signal,
Signal,
Signal,
Signal,
Signal,
Signal,
FETs ............................ 5.1-22,5.1-41
HDTMOS ............................... 5.1-41
Hot-Carrier (Schottky) Diodes ............. 5.1-32
JFETs .................................. 5.1-19
S~59 .................... 5.1-11,5.1-35,5.1-41
SC-70/S0T-323 ... 5.1-11,5.1-13,5.1-30,5.1-33,
5.1-35,5.1-41
Small Signal, S0-14 .................................. 5.1-39
SmaIiSignal,S0-16 ............................ 5.1--8,5.1-39
Small Signal, SOO-123 ............................... 5.1-41
Small Signal, SOT-223 ................. 5.1-15,5.1-23,5.1-31
Small Signal, SOT-23 ........... 5.1':10,5.1-22,5.1-27,5.1-30,
5.1-35,5.1-41
Small Signal, TMOS MOSFETs ......................... 5.1-21
Small Signal, T0-116 ........................... 5.1-9,5.1-39
Small Signal, T0-205AD (T0-39) ...................... 5.1-17
SmaIiSignal,T0-206AA(T0-18) ...................... 5.1-17
Small Signal, T0-226AA (T0--82) .. 5.1-2,5.1-19,5.1-21,5.1-27
Small Signal, T0-226AC (T0-92) ....... 5.1-26,5.1-30,5.1-31,
5.1-32, 5.1-35
Small Signal, T0-226AE (T0-92) ................ 5.1-3,5.1-21
Small Signal, TO-236AB ........ 5.1-10,5.1-22,5.1-30,5.1-31,
5.1-32,5.1-33,5.1-35,5.1-41
SMARTDISCRETES Products .......................... 5.4-7
Smoke Detectors (CMOS) ....... ~ ..................... 4.10-3
SO--8, Optoisolators ................................... 5.8-9
SO--8, Thyristors ................................ ; .... 5.7-14
SOE Case, Ceramic, RF ............................. 5.10-17
SOE Case, Plastic, RF ....................... 5.10-15-5.10-17
Software Support ..................................... 2.2-12
SOIC ............................................... 4.11-4
Sound ............................................... 4.8-4
Speakerphone Integrated Circuits ....................... 4:7-29
Speakerphones ...................................... 4.7-25
Special Functions ..................................... 4.9-3
Special Logic Circuits ................................. 3.1-51
Special Regulators .................................... 4.2-5
Special Switching Regulator Controllers ................. 4.2-15
Specialized Control Modules ........................... 2.6-13
Speech Networks .................................... 4.7-21
Standby RAM (SRAM) ................................ 2.6-13
Standby RAM with TPU Emulation (TPURAM) ............ 2.6-13
Stepper Motor Driver ................................... 4.3--8
Sub-Micron CMOS .............................. 1.1-1,1.1-5
Subscriber Loop Interface Circuit (SLlC) ................. 4.7-11
Supervisory Circuits .................................. 4.2-18
Motorola Master Selection Guide
General Index
S (continued)
T (continued)
Surface Mount Information, CPSTG ..................... 5.11-2
Surface Mount Products, Bipolar Power Transistors ....... 5.5-10
TMOS v ............................................. 5.4-5
TO-218, Bipolar Power Transistors ...................... 5.5-6
TO-220AB, Bipolar Power Transistors .................... 5.5-3
TO-220AB, Thyristors ........................... 5.7-4,5.7-8
TO-225AA, Bipolar Power Transistors .................... 5.5-8
TO-225AA, Thyristors ........................... 5.7-3,5.7-7
TQ-226AA (TO-92), Thyristors .................... 5.7-2,5.7-7
TO-247, Bipolar Power Transistors ...................... 5.5-7
TQ-264, Bipolar Power Transistors ...................... 5.5-8
TQ-92 .............................................. 4.11-4
TQ-92, Thyristors .................................... 5.7-14
Tone Ringers ........................................ 4.7-20
Transceivers ......................................... 3.1-38
Transient Voltage Suppressors .......................... 5.2-2
Transient Voltage Suppressors, Axial Leaded for
Through-hole Designs ................................ 5.2-2
Transient Voltage Suppressors, General Purpose .......... 5.2-2
Transient Voltage Suppressors, Mini Mosorb .............. 5.2-2
Transient Voltage Suppressors, Mosorb .................. 5.2-6
Transient Voltage Suppressors, Overvoltage Transient .... 5.2-15
Transient Voltage Suppressors, SMC ................... 5.2-13
Transient Voltage Suppressors, Surface Mount ............ 5.2-9
Transient Voltage Suppressors, Surmetic 40 ....... 5.2-4,5.2-18
Transistors, Discrete, RF ...................... 5.10-2-5.10-19
Transistors, Power Bipolar, RF ................. 5.10-6-5.10-13
Transistors, Power MOSFETs, RF ............... 5.10-4-5.10-5
Transistors, Small Signal, RF ................. 5.to-l4-5.10-19
Translators .......................................... 3.1-38
Transmitter Functions, RF .................... 5.10-22-5.10-24
Transmitters-AM/FM/FSK ............................. 4.7-3
Triac Phase Angle Controller ........................... 4.3-11
TRIACs, Thyristors .................................... 5.7-7
Triple 8-Bit ND Converter .............................. 4.8-8
Triple 8-Bit D/A Converter .............................. 4.8-7
Triple-Layer Metal ............................... 1.1-1,1.1-3
TTL ................................................. 3.1-2
Tuner PLL Circuits ..................................... 4.8-4
TV Decoder .......................................... 4.8-3
TV IF Circuits ......................................... 4.8-3
TV Picture-in-Picture .................................. 4.8-3
TV Transmitters, RF ................................. 5.10-29
TVSlZeners .......................................... 5.2-1
TVSlZeners, DQ-204AA (DO-7) ....................... 5.2-31
TVS/Zeners, DQ-204AH (D0-35) ............... 5.2-16,5.2-31
TVS/Zeners, SMA .................................... 5.2-21
TVS/Zeners, 5MB .................................... 5.2-21
TVS/Zeners, SMC .................................... 5.2-13
TVS/Zeners, SOD-123 ......................... 5.2-21,5.2-26
TVS/Zeners, SOT-23 .................... 5.2-9,5.2-21, 5.2-24
2-Wire ISDN Universal Digital Loop Transceiver II (UDLT II) 4.7-19
2-Wire Universal Digital Loop Transceiver (UDLT) ........ 4.7-18
Surface Mount Products, Optoelectronic Devices .......... 5.8-9
Surface Mount Products, Power MOSFETs . 5.4-8, 5.4-9, 5.4-10,
5.4-11,5.4-12,5.4-17,5.4-18,5.4-19,5.4-20
Surface Mount Products, Rectifiers ...................... 5.6-4
Surface Mount Products, RF ..... . . . .. 5.10-8, 5.10-16-5.10-24
Surface Mount Products, Small Signal ............ 5.1-9,5.1-10,
5.1-22,5.1-27,5.1-31,5.1-35,5.1-36,5.1-40
Surface Mount Products, Thyristors ...................... 5.7-7
Surface Mount Products, TVS/Zeners ............. 5.2-9,5.2-21
Switching Regulator Control Circuits ..................... 4.2-9
SWITCH MODE Rectifiers .............................. 5.6-4
Synchronous Fast Static RAMs .......................... 2.8-2
Synthesizers ......................................... 3.1-38
System Integration Module (SIM) ....................... 2.6-12
T
Tape and Reel ....................................... 4.11-2
Tape and Reel Specifications, CPSTG ................... 5.12-2
Tape and Reel, Logic ................................. 3.1-87
Tape/Reel and Ammo Pack ............................ 4.11-4
Technical Data and Literature ..................... 6.1-2,6.1-6
Technical Data Services ................................ 6.1-1
Technical Training Centers ............................. 6.1-11
Telecommunications .................................. 4.7-11
Telephone Accessory Circuits .......................... 4.7-30
Telephone Accessory Circuits - Audio Amplifiers ......... 4.7-30
Telephone Line Interface .............................. 4.7-24
Telephone Speech Network with Dialer Interface .......... 4.7-21
Terminators, SCSI Bus ................................ 3.1-36
Third Party Developers for 68HC05 and 68HC705
Family MCUs ....................................... 2.5-19
Third-Party Development Tools ......................... 2.6-27
Third-Party Support ................................... 2.6-27
300 Baud FSK Modems ............................... 4.7-31
Thyristors, High Voltage Bidirectional TVS Devices ........ 5.7-14
Thyristors, Programmable Unijunction Transistors ......... 5.7-14
Thyristors, SIDACs ................................... 5.7-14
Thyristors, Silicon Bidirectional Switch ................... 5.7-14
Thyristors, Silicon Controlled Rectifiers ................... 5.7-2
Thyristors, SOT-223 ............................. 5.7-2,5.7-7
Thyristors, TQ-220AB ........................... 5.7-4, 5.7-8
Thyristors, TQ-225AA ........................... 5.7-3,5.7-7
Thyristors, TQ-226AA (TQ-92) .................... 5.7-2, 5.7-7
Thyristors, TRIACs, General Purpose .................... 5.7-7
Thyristors, Triggers ................................... 5.7-14
Time Processor Unit(TPU) ............................ 2.6-12
Timer ................................................ 2.6-2
TimerModule(TM) ................................... 2.6-13
Timers .............................................. 2.6-12
u
Timing Circuits ....................................... 4.10-2
TMOS MOSFETs, Small Signal .................. 5.1-21,5.1-41
TMOS Power MOSFETs ................................ 5.4-1
U-Interface Transceiver Evaluation Kit .................. 4.7-17
UHF Transistors, RF ........................... 5.10-7-5.10-8
UHF, FM/AM Transmitter .............................. 4.7-10
TMOS Power MOSFETs Numbering System .............. 5.4-2
Motorola Master Selection Guide
7.2-7
General Index
General Index
U (continued)
v (continued)
Ultrafast Rectifiers .................................... 5.6-10
Voltage Controlled Oscillator ..•...................•.... 3.1--39
Undervoltage Sensing Circuit .......................... 4.2-19
Voltage References Package Overview ................... 4.4-2
Universal Cordless Phone Subsystem ICs ................ 4.7--3
Universal Cordless Telephone Subsystem IC .............. 4.7-4
Universal Cordless Telephone Subsystem IC with Scrambler 4.7-5
Universal Microprocessor Power Supply Controllers ....... 4.2-15
Universal Motor Speed Controller ....................... 4.3-10
Universal Voltage
Mon~or
............................. 4.2-20
v
VCO ................................................ 3.1--39
Voltage Regulator/Supervisory .......................... 4.2-,.5
Voltage Regulators .................................... 4.9-2
w
Wideband (FM/FSK) IFs ................................ 4.7-2
Wideband FM IF Subsystem ............................ 4.7-9
Wideband FM IF System ............................... 4.7-8
Wideband Single Conversion Receivers - VHF ............ 4.7-2
x
Very High Voltage Single-Ended Controller with
OrK:;hip Power Switch .............................. 4.2-11
XNOR Gates ........................................ 3.1-27
VHF Transistors, RF ........................... 5.10-6-5.10-7
z
XOR Gates .......................................... 3.1-27
Video Amplifiers, RF ................................. 5.10--35
VidElo Capture Chip Sets ............................... 4.8--3
Video Circuits . . . . . . . . . . . .. . . . . . . . . .. . . . . . . . . . . . . . . . . . . 4.8--3
Zener Diodes, Axial Leaded for Through-hole
Designs ..................................... 5.2-2,5.2-16
Zener Diodes, Current Regulator .........•............. 5.2--31
Video Circuits - Miscellaneous .......................... 4.8-4
Zener Diodes, Surmetic 30 ............................ 5.2-18
Video Data Converters ................................. 4.8-4
Zener Diodes, Voltage Reference ....................... 5.2--31
Voice Switched Speakerphone Circuit ..... 4.7-25, 4.7-26, 4.7-28
Zener Diodes, Voltage Regulator ...................•... 5.2-16
Voice Switched Speakerphone with I!Processor Interface .. 4.7-27
Zero Voltage Controller ................................. 4.3--3
Voice/Data Communication (Digital Transmission) ........ 4.7-18
Zero Voltage Switch ................................... 4.3-2
General Index
7.2-8
Motorola Master Selection Guide
Subject Index
A
B (continued)
Amplifiers
RF ............................................. 5.10-26
High Power
Land Mobile/Portable ................. 5.10-28-5.10-29
TV Transmitters .............................. 5.10-29
Integrated Power ............................... 5.10-23
Low Power
CATV Distribution .................... 5.10-30-5.10-33
CRT Drivers ................................. 5.10-35
Video.........................
.. .. 5.10-35
Fiber Optic Receivers ......................... 5.10-35
Bipolar Power Transistors (continued)
TO-220AB ......................... . ...........
T0-225AA ......................................
TO-247 . . .
. ...
T0-264 .
............... .
. ....... " .
Amplifiers and Comparators .•.•...•..••........•••..•
Amplifiers and Comparators Package Overview ........
Comparators .......................................
Dual ............................................
Bipolar .......................................
CMOS ........................................
Quad ...........................................
Bipolar .......................................
CMOS ........................................
Single ..........................................
Bipolar...........
. ...............
CMOS ........................................
High Frequency Amplifiers ...........................
AGC Amplifiers ..................................
Family Wideband General Purpose ...............
Miscellaneous Amplifiers ............................
Bipolar ..........................................
Dual Operational Amplifier and Dual Voltage
Comparator ..................................
CMOS ..........................................
Dual Programmable Operational Amplifier
and Dual Programmable Comparator ............
Dual Video Amplifiers ...........................
Quad Programmable Operational Amplifier ........
Operational Amplifiers ...............................
Dual Operational Amplifiers ........................
Quad Operational Amplifiers .......................
Single Operational Amplifiers ......................
c
Communication Circuits ........•••••......•.•........ 4.7-1
Communications Circuits Package Overview .......... 4.7-39
Electronic Telephone ............................... 4.7-19
The Complete Electronic Telephone Circuit ......... 4.7-19
ISDN Voice/Data Circuits ........................... 4.7-15
Dual Data Link Controller..............
'" 4.7-17
Integrated Services Digital Network ................ 4.7-15
Second Generation SIT-Interlace Transceivers ..... 4.7-16
Second Generation U-Interlace Transceivers ....... 4.7-16
U-Interlace Transceiver Evaluation Kit ............. 4.7-17
Narrowband FM Coilless Detector IF Subsystem ........ 4.7-7
Narrowband FM Receiver ........................... 4.7-6
Phase-Locked Loop Components ................... 4.7-36
Phase-Locked Loop Functions .................... 4.7-37
PLL Frequency Synthesizers ..................... 4.7-36
RF Communications ................. . ............. 4.7-2
Balanced Modulator/Demodulator .................. 4.7-4
Infrared Transceivers ............................. 4.7-4
Narrowband Dual Conversion Receivers
- FM/FSK - VHF ............................... 4.7-3
Narrowband Single Conversion Receivers - VHF ..... 4.7-2
Transmitters - AM/FM/FSK ........................ 4.7-3
Universal Cordless Phone Subsystem ICs ........... 4.7-3
Wideband (FM/FSK) IFs .......................... 4.7-2
Wide band Single Conversion Receivers - VHF ....... 4.7-2
Speakerphones ................................... 4.7-25
The Motorola Family of Speakerphone
Integrated Circuits .................... . ....... 4.7-29
Voice Switched Speakerphone Circuit ............. 4.7-25,
4.7-26, 4.7-28
Voice Switched Speakerphone
with fLProcessor Interlace ....................... 4.7-27
Speech Networks ................................. 4.7-21
Cordless Universal Telephone Interlace ............ 4.7-22
Programmable Telephone Line Interlace Circuit
with Loudspeaker Amplifier ...................... 4.7-23
Telephone Line Interlace ......................... 4.7-24
Telephone Speech Network with Dialer Interlace ..... 4.7-21
Telecommunications ............................... 4.7-11
PBX Architecture (Analog Transmission) ........... 4.7-12
Dual Tone Multiple Frequency Receiver. . . . . . . .. 4.7-15
PCM Mono-Circuits Codec-Filters (CMOS LSI) ... 4.7-12
Subscriber Loop Interlace Circuit (SLlC) ............ 4.7-11
Telephone Accessory Circuits ....................... 4.7-30
300 Baud FSK Modems .......................... 4.7-31
ADPCM Transcoder ............................. 4.7-31
Audio Amplifier .................................. 4.7-30
Calling Line 10 Receiver Evaluation Kit ............. 4.7-32
Calling Line Identification (CLIO) Receiver
with Ring Detector ............................. 4.7-32
Continuously Variable Slope Delta (CVSD)
Modulator/Demodulator ......................... 4.7-33
Current Mode Switching Regulator ................. 4.7-30
Summary of Bipolar Telecommunication Circuits ..... 4.7-34
Tone Ringers ..................................... 4.7-20
UHF, FM/AM Transmitter ........................... 4.7-10
Universal Cordless Telephone Subsystem IC ........... 4.7-4
Universal Cordless Telephone Subsystem IC
with Scrambler ................................... 4.7-5
4.1-1
4.1-8
4.1-7
4.1-7
4.1-7
4.1-7
4.1-7
4.1-7
4.1-7
4.1-7
4.1-7
4.1-7
4.1-5
4.1-5
4.1-5
4.1-6
4.1-6
4.1-6
4.1-6
4.1-6
4.1-6
4.1-6
4.1-2
4.1-3
4.1-4
4.1-2
Automotive Electronic Circuits ........................ 4.9-1
Alternator Voltage Regulator ........................ 4.9-11
Automotive Direction Indicator ........................ 4.9-8
Automotive Electronic Circuits Package Overview ...... 4.9-12
Automotive ISO 9141 Serial Link Driver ............... 4.9-10
Automotive Wash Wiper Timer ....................... 4.9-9
Electronic Ignition .................................. 4.9-2
High Side TMOS Driver ............................. 4.9-7
Low Side Protected Switch .......................... 4.9-6
MI-Bus Interlace Stepper Motor Controller ............. 4.9-8
Octal Serial Switch ................................. 4.9-5
Quad Fuel Injector Driver ............................ 4.9-4
Special Functions .................
. .. 4.9-3
Voltage Regulators ................................. 4.9-2
B
Bipolar Power Transistors ...•.••..................... 5.5-2
Audio..................................
. ..... 5.5-15
Audio/Servo Loads ................................ 5.5-15
DPAK-Surlace Mount .............................. 5.5-10
Electronic Lamp Ballasts ........................... 5.5-16
Metal........
. ................................ 5.5-11
Plastic
T0-218 .... . .................................. 5.5-6
Motorola Master Selection Guide
5.5-3
5.5-8
5.5-7
5.5-8
7.2-9
Subject Index
Subject Index
C (continued)
D (continued)
Communication Circuits (continued)
Voice/Data Communication (Digital Transmission) ...... 4.7-18
2-Wire ISDN Universal Digital Loop Transceiver II
(UDLT II) ..................................... 4.7-19
2-Wire Universal Digital Loop Transceiver (UDLT) ... 4.7-18
Wideband FM IF Subsystem ......................... 4.7-9
Wideband FM IF System ............................ 4.7-8
Communications, Power and Signal
Technologlaa Group •••••••••••••••••••••••••••••••• 5.0-1
Consumer Electronic Circuits ••••••••••••••••••••••••• 4.8-1
Consumer Electronic Circuits Package Overview ...... 4.8-25
Entertainment Radio Receiver Circuits ................ 4.8-2
Audio Amplifiers .................................. 4.8-2
C-Quam AM Stereo Decoders ..................... 4.8-2
Entertainment Receiver RFIIF ...................... 4.8-2
Video Circuits ...................................... 4.8-3
Advanced Comb Filter-II (ACF-II) ................. 4.8-14
Advanced Multistandard TV Video/Sound IF ........ 4.8-10
Advanced NTSC Comb Filter ..................... 4.8-13
Advanced PALINTSC Encoder .................... 4.8-24
Closed-Caption Decoder ......................... 4.8-15
Comb Filters ..................................... 4.8-3
Deflection ....................................... 4.8-3
Digitally Controlled Video Processor
for Multimedia Applications ....................... 4.8-6
Encoders ....................................... 4.8-3
Enhanced Closed-Caption Decoder ............... 4.8-16
Miscellaneous ................................... 4.8-4
Modulator ....................................... 4.8-4
Monitor Subsystem ............................... 4.8-4
Multistandard Videommebase Processor ........... 4.8-12
Picture-ill-Picture (PI P) Controller ................. 4.8-11
PLL Tuning Circuit with 3-Wire Bus ................ 4.8-22
PLL Tuning Circuit with 12C Bus ..... 4.8-20, 4.8-22, 4.8-23
PLL Tuning Circuits with 3-Wire Bus ............... 4.8-19
PLL Tuning Circuits with 12C Bus .................. 4.8-21
Sound .......................................... 4.8-4
Triple 8-Bit AID Converter ......................... 4.8-8
Triple 8-Bit D/A Converter ......................... 4.8-7
Tuner PLL Circuits ............................... 4.8-4
TV Decoder ..................................... 4.8-3
TV IF Circuits .................................... 4.8-3
TV Picture-in-Picture ............................. 4.8-3
Video Capture Chip Sets .......................... 4.8-3
Video Data Converters ............................ 4.8-4
Converters, Digital Signal Processors ••..•.•...•••••••. 2.1-1
Analog-To-Digital .................................. 2.1-10
Development Tools
Digital Signal Processors ............................. 2.1-1
Design-In Software .............................. 2.1-12
LonWorks Products ........................... 2.7-1.2.7-2
Developer's Workbench ........................... 2.7-6
Support Tools .................................... 2.7-7
Discrete Products .................................... 5.0-1
RF .............................................. 5.10-1
D0-204AA (D0-7)
Tuning and Switching Diodes, Small Signal .... 5.1-25,5.1-31
Zener Diodes ..................................... 5.2-31
DO-204AH (00-35), Zener Diodes ••.•..•.•.... 5.2-16,5.2-31
QPAK .................................. 5.4-10,5.5-10,5.6-5
Bipolar Power Transistors .......................... 5.5-10
Rectifiers ................................... 5.6-5,5.6-10
TMOS Power MOSFETs .............. 5.4-10, 5.4-18. 5.4-20
D
D2PAK ....................................... 5.4-11,5.8-5
Rectifiers ................................... 5.6-5,5.6-10
TMOS Power MOSFETs .............. 5.4-11,5.4-19,5.4-21
D3PAK ............................................. 5.4-12
TMOS Power MOSFETs ............................ 5.4-12
Data Conversion .....................................
A-D Converters ....................................
Bipolar ..........................................
CMOS ..........................................
Sigma-Delta ....................................
D-A Converters ....................................
CMOS ....•.....................................
Sigma-Delta ....................................
Data Conversion Package Overview ..•...............
Subject Index
4.5-1
4.5-2
4.5-2
4.5-2
4.5-2
4.5-3
4.5-3
4.5-3
4.5-4
7.2-10
E
Evaluation Boards, RF Monolithic
Integrated Circuits ................................ 5.10-20
E;ZFETs .............................................. 5.4...Q
Power MOSFETs ................................... 5.4-9
F
Fiber Optic Receivers, RF ........................... 5.10-35
Field Programmable Gate Arrays (FPGA) ...•........... 3.1-5
Fleld-SffectTranslstors ••••••••.••••..... 5.1-1,5.1-19,5.4-1
JFETs, Small Signal ............................... 5.1-19
MOSFETs, Small Signal ..................... 5.1-21.5.1-41
Power MOSFETs ................................... 5.4-1
Surface Mount FETs, Small Signal ................... 5.1-22
G
GaAs Rectifiers Power Manager .•.•••.••............. 5.6-14
H
HDTMOS Power MOSFETs
EZFET ..................................... 5.4-4,5.4-17
High Power
D2pAK ......................................... 5.4-3
DPAK ........................................... 5.4-3
T0-220 ........................................ , 5.4-3
Micro8 ..................................... 5.4-4.5.4-17
S0-8 ............................................. 5.4-4
High Cell Density (Power MOSFETs) .•..•••••.•••••.... 5.4-3
Hybrid Power Modules ................................ 5.3-2
Integrated Power Stage IGBTs ....................... 5.3-2
IGBTs ......................................... 5.3-2,5.4-7
Hybrid Power Modules .............................. 5.3-2
Power MOSFETs ............................ 5.4-7.5.4-22
Ignition IGBTs ........................................ 5.4-7
TMOS Power MOSFETs ...................... 5.4-7.5.4-22
Insulated Gate Bipolar Transistors .••............ 5.3-2, 5.4-7
Integrated Power Stage IGBTs, Hybrid Power Modules .. 5.3-2
TMOS ............................................ 5.4-7
Integrated Circuits, MonOlithic
RF ..................................... 5.10-20-5.10-25
Evaluation Boards .............................. 5.10-20
Motorola Master Selection Guide
Subject Index
I (continued)
M (continued)
Interface Circuits, Monolithic: (continued)
Receiver Functions ..................... 5.10-21-5.10-22
Switching ..................................... 5.10-21
Transmitter Functions ................... 5.10-22-5.10-24
Microcomputer Components (continued)
Modules ...................................... 2.8-4
Synchronous .................................. 2.8-2
Microcontroller Development Tools ............ 2.5-14,2.6--22
On-Line Help .............................. 2.5-22, 2.6--26
PowerPC RISC Family .............................. 2.4-1
MPC105 PCI Microprocessor ..................... 2.4-15
MPC106 PCI Microprocessor ..................... 2.4-16
MPC601 RISC Microprocessor ..................... 2.4-2
MPC602 RISC Microprocessor ..................... 2.4-3
MPC603 RISC Microprocessor ..................... 2.4-3
MPC603e RISC Microprocessor .................... 2.4-6
MPC604 RISC Microprocessor ..................... 2.4-9
MPC604e RISC Microprocessor .................... 2.4-9
MPC620 RISC Microprocessor .................... 2.4-13
Single-Chip Microcontrollers (MCU) ............. 2.5-1,2.6--1
Configuration and Order Information
for MMDS/MMEVS ............................ 2.5-14
Configuration and Order Information for Other Motorola
DevelopmentTools (EVM/EVS/ICS) .............. 2.5-17
Configuration and Order Information
for Programmers .............................. 2.5-18
M6800 Series Microprocessors and Peripherals ..... 2.6-10
M68300 Family ................................. 2.6--19
M68HC05 CSIC Family ........................... 2.5-2
M68HC08 Family ................................ 2.5-13
M68HC11 Family ................................. 2.6--2
M68HC16 Family ................................ 2.6--14
MC68HC05 Microcontrollers ....................... 2.5---6
Modular Microcontrollers ......................... 2.6--12
One-Time Programmable (OTP) / Emulator MCUs ... 2.5-10
Third Party Developers for 68HC05 and 68HC705
Family MCUs ................................. 2.5-19
Third-Party Support ................................ 2.6--27
Mini Mosorb ......................................... 5.2-2
Transient Voltage Suppressors .. 5.2-2, 5.2-10, 5.2-12, 5.2-13
MiniMOS Products ............................ 5.4-8,5.4-17
MOSFETs, Power, TMOS .............................. 5.4-1
Mosorb .............................................. 5.2-6
Transient Voltage Suppressors ....................... 5.2-6
Motorola Programmable Array (MPA) ••.•••..•••••••••. 3.1-5
Motorola SPS World Marketing Internet Server •...••.... 6.1-1
Motorola Technical Training Courses •••••••.•..•••••.• 6.1-7
Interface Circuits ••••.••••....•..•.•....••..••......•• 4.6-1
5.0 V, 200 M-BitlSec PR-IV Hard Disk
Drive Read Channel ............................... 4.6-5
CMOS Display Drivers .............................. 4.6--9
Display Drivers .................................. 4.6--9
Functions ....................................... 4.6--9
Enhanced Ethemet Transceiver ...................... 4.6--2
Hex EIA-485 Transceiver with Three-State Outputs .... 4.6--4
High Perfonmance Decoder Driver/Sink Driver .......... 4.6--3
Interface Circuits Package Overview ................. 4.6--10
ISO 8802-3 [IEEE 802.3]1 OBASE-T Transceiver ....... 4.6-3
Line Drivers ....................................... 4.6--7
EIA Standard .................................... 4.6--7
EIA-232-E/V.28 CMOS Drivers/Receivers ........... 4.6--8
IEEE 802.3 Transceivers .......................... 4.6--8
Line Transceivers ................................ 4.6--7
Peripheral Drivers ................................ 4.6--8
Line Receivers ..................................... 4.6--7
EIA Standard .................................... 4.6--7
ReadlWrite Channel ................................ 4.6--8
ReadlWrite Channels, Hard Disk Drive Read Channel ... 4.6--8
L
Logic Integrated Circuits
Motorola Logic Families, Which Is Best for You? ........ 3.1-1
Programmable Logic ................................ 3.1-5
Logic Level Power MOSFETs •••••••••••••••••• 5.4-20, 5.4-21
Logic Literature Listing .............................. 3.1-88
M
Medium Power MOSFETs, TMOS •••••••••••.••• 5.4-9,5.4-18
Mfax - Touch-Tone FAX for Technical Data ••••••••.•••• 6.1-1
MicroS Products ..................................... 5.4-8
Microcomputer Components
Fuzzy Logic ...................................... 2.6--26
M68000 Family
Coprocessors .................................... 2.2-9
Data Communication Devices ..................... 2.2-10
Development Tools .............................. 2.2-12
DMA Controllers ................................. 2.2-9
Embedded Controllers ............................ 2.2-5
Fiber Distributed Data Interface ................... 2.2-11
General Purpose I/O ............................. 2.2-11
Integrated Processors ............................ 2.2-7
Microprocessors ........................... 2.2-1, 2.2-2
Network Devices ................................. 2.2-9
Software Support ................................ 2.2-12
M88000 RISC Family ............................... 2.3-1
CachelMemory Management Units ................. 2.3-3
Microprocessors ................................. 2.3-2
Memory Products .................................. 2.8-1
Dynamic RAMs .................................. 2.8-5
HCMOS ...................................... 2.8--6
Modules ...................................... 2.8-5
Fast Static RAMs ................................ 2.8-2
Application SpecHic ............................ 2.8-2
Async 12 to 35 ns 5 V Fast Static RAMs .......... 2.8-3
Async 8 to 25 ns 3.3 V Fast Static RAMs .......... 2.8-3
Motorola Master Selection Guide
7.2-11
o
Optoelectronic Devices •••.•••••.•.•••••••...•• 5.8-1, 5.8-10
Optoisolators .......................... 5.8-1,5.8-2,5.8-5
POWER OPTO Isolators ..................... 5.8-1, 5.8-10
Optoisolators .................................. 5.8-1,5.8-2
Other Analog Circuits ................................ 4.10-1
Multipliers ........................................ 4.10-2
Linear Four-Quadrant Multipliers .................. 4.10-2
Other Analog Circuits Package Overview ............. 4.10-4
Smoke Detectors (CMOS) .......................... 4.10-3
Timing Circuits .................................... 4.10-2
Duals .......................................... 4.10-2
Singles ........................................ 4.10-2
p
Packaging Specifications, CPSTG
Adhesion Pull Tests ................................ 5.12-9
Fan Fold Box Styles ............................... 5.12-9
Reel Styles ...................................... 5.12-11
Subject Index
Subject Index
P (continued)
P (continued)
Packaging Specifications, CPSTG (continued)
T0-92 EIA Radial Tape ............................ 5.12-7
PFP-16
RF ............................................. 5.10-23
Power MOSFETs, TMOS ••••••••••••••.••••••.•••••••• 5.4-1
PowerlMotor Control Circuits (continued)
Zero Voltage Switch .............................. 4.3-2
PowerlMotor Control Circuits Package Overview ....... 4.3-12
PowerPC RISC Microprocessors •.••••••••••..••..•..• 2.4-2
POWERTAP II, Rectifiers •••••••••••••••.•••••.• 5.6-'1,5.6-12
Processors, Digital Signal Processors •••••••••••••••.• 2.1-1
16-Bit ....................................... 2.1-2,2.1--3
24-Bit ............................................. 2.1--3
32-Bit ............................................. 2.1-9
Peripherals ................................. 2.1-6,2.1-12
POWER OPTO Isolators •••••••••••••••••••••••• 5.8-1,5.8-10
Power Supply Circuits ................................ 4.2-1
Battery Management Circuits ....................... 4.2-21
Battery Charger ICs ............................. 4.2-21
Battery Fast Charge Controller ......•........... 4.2-21
Power Supply, Battery Charger, Regulation
Control Circuit ............................... 4.2-22
Battery Pack ICs ................................ 4.2-23
1 to 4 Cells Lithium Battery Safety IC ..... 4.2-23, 4.2-24
Linear Voltage Regulators ........................... 4.2-2
Adjustable Output ................................ 4.2-4
Adjustable Output Regulators .................... 4.2-4
Fixed Output .................................... 4.2-2
Fixed Voltage Medium and Low
Dropout Regulators ........................... 4.2--3
Linear Voltage Regulators ....................... 4.2-2
MOSFETIIGBT Drivers ............................. 4.2-25
High Speed Dual Drivers ......................... 4.2-25
Inverting •.................................... 4.2-25
Noninverting ................................. 4.2-25
Single IGBT Driver .............................. 4.2-25
Power Supply Circuits Package Overview. . . . . . . . . . • .. 4.2-26
Special Regulators ................................. 4.2-5
SCSI Regulator .................................. 4.2-8
Voltage RegulatorlSupervisory ..................... 4.2-5
Special Switching Regulator Controllers .............. 4.2-15
Dual Channel Controllers ......................... 4.2-15
Power Factor Controllers .................. 4.2-15, 4.2-16
Universal Microprocessor Power Supply Controllers. . 4.2-15
Supervisory Circuits ............................... 4.2-18
OverlUndervoltage Protection Circuit ............... 4.2-18
Overvoltage Crowbar Sensing Circuit .............. 4.2-18
Undervoltage Sensing Circuit ..................... 4.2-19
Universal Voltage Monitor ........................ 4.2-20
Switching Regulator Control Circuits .................. 4.2-9
Doubl~EndedControliers ........................ 4.2-12
High Voltage Switching Regulator .......... 4.2-13, 4.2-14
Singl~Ended Controllers ••...•.•................. 4.2-9
Singl~Ended Controllers with On-Chip
Power Switch ................................. 4.2-11
Very High Voltage Singl~Ended Controller
with On-Chip Power Switch ..................... 4.2-11
Voltage RegulatorlSupervisory
GaAs Amplifier Supervisory Circuit ................. 4.2-7
Low Dropout Regulator ........................... 4.2-6
Microprocessor Voltage Regulator
and Supervisory Circuit .......................... 4.2-6
Power Management Controller ..................... 4.2-7
PowerlMotor Control Circuits ••••••••••••••••••••••••• 4.3-1
Motor Controllers ................................... 4.3-4
Brushless DC Motor Controllers .................... 4.3-4
Closed Loop Brushless Motor Adapter .............. 4.3-7
DC Servo Motor ControlierlDriver ..............•..•. 4.3-8
Stepper Motor Driver ............................. 4.3-9
Triac Phase Angle Controller ...................... 4.3-11
Universal Motor Speed Controller .................. 4.3-10
Power Controllers .................................. 4.3-2
High-Side Driver Switch .......................... 4.3-4
Zero Voltage Controller ........................... 4.3--3
Subject Index
7.2-12
R
Receiver Functions
RF ............................................. 5.10-21
1.5-2.2 GHz Front End ........................ 5.10-21
2.4 GHz Front End ............................. 5.10-22
900 MHz Front End ............................. 5.10-21
Rectifier Numbering System •••••••••••••••••••••••••• 5.6-2
Rectifiers ............................................ 5.8-1
Application Specific ................................. 5.6-3
Automotive Transient Suppressors ................. 5.6-3
Low VF Schottky ................................. 5.6-3
MEGAHERTZ Rectifiers ........................... 5.6-3
SCANSWITCH Rectifiers .......................... 5.6-3
Fast Recovery .................................... 5.6-13
GaAs Rectifiers Power Manager ..................... 5.6-14
General Purpose Rectifiers ......................... 5.6-13
SWITCH MODE Rectifiers ........................... 5.6-4
Axial Lead Schottky .............................. 5.6-6
POWERTAP II ................................... 5.6-9
Surface Mount Schottky ........................... 5.6-4
T0-218 Types and T0-247 Schottky ............... 5.6-8
T0-220 Type Schottky ............................ 5.6-7
Ultrafast Rectifiers ................................. 5.6-10
Axial Lead ...................................... 5.6-10
POWERTAP II .................................. 5.6-12
Surface Mount •................................. 5.6-10
T0-218Types .................................. 5.6-12
T0-220Type ................................... 5.6-11
T0-247 ........................................ 5.6-12
RF Producta ........................................ 5.10-1
s
SC-69
Bipolar Transistors, Small Signal .................... 5.1-11
Switching Diodes, Small Signal ...................... 5.1--35
SC-70/S0T--323
Bipolar Transistors, Small Signal •.•...•............. 5.1-11
Hot-Garrier (Schottky) Diodes, Small Signal .......... 5.1--33
RF ..................................... 5.10-17-5.10-18
Switching Diodes, Small Signal ...................... 5.1--35
Tuning Diodes, Small Signal ........................ 5.1--30
VHFIUHF Amplifiers, Mixers, OSCillators, Small Signal .. 5.1-13
Semlcustom Application Specific
Integrated Circuits ........................... 1.0-1,1.1-1
Advanced Packaging ............................... 1.1-7
MicroCool Quad Flat Pack. . . . . . . . . . . . . . . . . . . . . . . .. 1.1-7
Over-Molded Pad Array Carrier (OMPAC) ........... 1.1-7
Quad Flat Pack Molded Carrier Ring (QFP-MCR) .... 1.1-7
ASIC Preview ...................................... 1.1-1
ASIC Regional Design Centers - United States ........ 1.1-8
ASIC Regional Design Centers -International ......... 1.1-8
Bipolar ............................................ 1.1-2
Motorola Master Selection Guide
Subject Index
S (continued)
S (continued)
Semicustom Application Specific
Integrated Circuits (continued)
ECl & ETl Series Arrays .........................
ETl Series Arrays Extend Design Flexibility. . . . . . . . ..
ETl Series Features Mixed ECl-TTl Interface .......
Third Generation .................................
CMOS ............................................
1.0 Micron CMOS HDC Series .....................
CDA Architecture ................................
Mixed 3.3 V/5.0 V levels ..........................
Sub-Micron CMOS H4C Series ....................
Sub-Micron CMOS H4CPlus Series .................
Triple-layer Metal ................................
Design Automation Software .........................
OACS 2.2 and 3.1 M Features ............... : ......
Open Architecture CAD System ....................
Literature ..........................................
SOT-143
RF .................... 5.10-17-5.10-19,5.10-21-5.10-22
SOT-223
Bipolar Transistors, Small Signal .................... 5.1-15
FETs, Small Signal ......................... 5.1-23,5.1-41
Thyristors ......................................... 5.7-2
Tuning and Switching Diodes, Small Signal ........... 5.1-31
SOT-23
Bipolar Transistors, Small Signal .................... 5.1-10
FETs, Small Signal ......................... 5.1-22,5.1-41
Hot-Carrier (Schottky) Diodes, Small Signal ... 5.1-32, 5.1-33
RF ............................ 5.10-16,5.10-18-5.10-19
Switching Diodes, Small Signal ............... 5.1-36,5.1-41
Tuning Diodes, Small Signal ........................ 5.1-27
TVS/Zeners ................................ 5.2-9, 5.2-24
Surface Mount Information, CPSTG
F00'Erints for Soldering
D PAK ........................................ 5.11-5
D3PAK ........................................ 5.11-5
DPAK .......................................... 5.11-5
MICR08 ....................................... 5.11-5
OPTO S0-8 .................................... 5.11-5
SC-59 ......................................... 5.11-5
SC-70/S0T-323 ................................ 5.11-5
SMA ........................................... 5.11-5
5MB ........................................... 5.11-5
SMC .......................................... 5.11-5
SO-14 ......................................... 5.11-5
SO-16 ......................................... 5.11-5
SO-8 .......................................... 5.11-5
SOD-123 ...................................... 5.11-5
SOT-143 ...................................... 5.11-5
SOT-223 ...................................... 5.11-5
SOT-23 ....................................... 5.11-5
Using Surface Mount Packages ..................... 5.11-2
Surface Mount Products, CPSTG •• 5.1-9,5.2-9,5.4-8,5.5-10,
5.6-4,5.8-5,5.8-9,5.10-8
Bipolar Power Transistors .......................... 5.5-10
DPAK .......................................... 5.5-10
Optoisolators ................................ 5.8-5, 5.8-9
6-Pin Devices ................................... 5.8-5
S0-8 ........................................... 5.8-9
Rectifiers .......................................... 5.6-4
D2pAK .................................. 5.6-5,5.6-10
DPAK .................................... 5.6-5,5.6-10
5MB ..................................... 5.6-4,5.6-10
SMC .................................... 5.6-4,5.6-10
RF .............................................. 5.10-8
PFP-16 ....................................... 5.10-23
SC-70/S0T-323 ....................... 5.10-17-5.10-18
SO-16 ................................ 5.10-21-5.10-25
SO-8 ......................... 5.10-8,5.10-17-5.10-25
SOT-143 ............ 5.10-17-5.10-19,5.10-21-5.10-22
SOT-23 ..................... 5.10-16,5.10-18-5.10-19
TSSOP-16 ........... 5.10-21-5.10-22,5.10-24-5.10-25
TSSOP-20 .................................... 5.10-22
Small Signal ....................................... 5.1-9
SC-59 ........................... 5.1-11,5.1-35,5.1-41
SC-70/S0T-323 ........... 5.1-11,5.1-13,5.1-35,5.1-41
SO-I6 .......................................... 5.1-9
SOD-123 ...................................... 5.1-41
SOT-223 ............................... 5.1-16,5.1-23
SOT-23 ................. 5.1-10,5.1-22,5.1-35,5.1-36
Thyristors, SOT-223 ......... , ...................... 5.7-7
TMOS Power MOSFETs ............................. 5.4-8
1.1-2
1.1-2
1.1-2
1.1-2
1.1-3
1.1-3
1.1-4
1.1-5
1.1-4
1.1-5
1.1-3
1.1-6
1.1-6
1.1-6
1.1-8
Sensors •.•••.••••••••••••••••••••••••••••.••.••••... 5.9-1
Acceleration ...................................... 5.9-10
Pressure .......................................... 5.9-2
Compensated and Calibrated ................ 5.9-6,5.9-7
High Impedance ........................... 5.9-6, 5.9-9
Signal Conditioned ......................... 5.9-6, 5.9-6
Uncompensated ........................... 5.9-6,5.9-7
Silicon Controlled Rectifiers •...••••.•••.••.••••.•.••. 5.7-2
Thyristors ......................................... 5.7-2
SMA .......•.. _••.•.•.•.•••......••..••...•.•.•..... 5.2-21
TVS/Zeners ...................................... 5.2-21
Small Signal Greenline Devices •••••••••..••.••••.••• 5.1-40
Small Signal Transistors ...........••.••..•..••• 5.1-1, 5.1-2
Bipolar Transistors ........................... 5.1-2, 5.1-40
Metal-Can ..................................... 5.1-17
Plastic-Encapsulated ......... 5.1-2,5.1-8,5.1-10,5.1-40
Small Signal Tuning and Switching Diodes ...... 5.1-1,5.1-24
Abrupt Junction ................................... 5.1-24
Hot Carrier (Schottky) .............................. 5.1-32
Hyper-Abrupt Junction ............................. 5.1-28
Multiple Switching ................................. 5.1-38
Switching .................................. 5.1-34,5.1-41
SMARTDISCRETES Products •••••••.•••.••.••••.••••. 5.4-7
Ignition IGBTs ...................................... 5.4-7
T0-220AB ........................................ 5.4-7
5MB
Rectifiers ................................... 5.6-4,5.6-10
TVS/Zeners ............................... 5.2-10,5.2-21
SMC
Rectifiers ................................... 5.6-4, 5.6-10
Transient Voltage Suppressors ...................... 5.2-13
So-14
Multiple Switching Diodes, Small Signal .............. 5.1-39
So-16
Bipolar Transistors, Small Signal ..................... 5.1-9
Multiple Switching Diodes, Small Signal .............. 5.1-39
RF ..................................... 5.10-21-5.10-25
So-a
Optoisolators ...................................... 5.8-9
RF ............................. 5.10-8,5.10-17-5.10-25
Thyristors ........................................ 5.7-14
TMOS Power MOSFETs ...................... 5.4-8,5.4-17
SOD-123
Rectifiers .......................................... 5.6-4
TVSlZeners ............................... 5.2-21,5.2-26
Motorola Master Selection Guide
7.2-13
Subject Index
Subject Index
S (continued)
T (continued)
Surface Mount Products, CPSTG (continued)
D2PAK .......................... 5.4-11,5.4-19,5.4-21
D3PAK ........................................ 5.4-12
DPAK ............................ 5.4-10,5.4-18,5.4-20
So-a .................................... 5.4-8,5.4-17
SOT-223 ......................... 5.4-9,5.4-18,5.4-20
TVS/Zeners ....................................... 5.2-9
SMA ........................................... 5.2-21
5MB ........................................... 5.2-21
SMC .......................................... 5.2-13
SOO-123 ............................... 5.2-21,5.2-26
SOT-23 ...................... " ... 5.2-9, 5.2-21, 5.2-24
Surmetlc30
Zener Diodes ..................................... 5.2-18
Surmetlc40
Transient Voltage Suppressors ................ 5.2-4, 5.2-18
Switching
RF ............................................. 5.10-21
SWITCHMODE Rectifiers
Axial Lead Schottky ................................. 5.6-6
POWERTAP II ..................................... 5.6-9
Surface Mount Schottky ............................. 5.6-4
To-218 Types and To-247 Schottky .•.............•. 5.6-8
To-220 Type Schottky .............................. 5.6-7
TO-116 (continued)
Multiple Switching Diodes, Small Signal .....•........ 5.1--39
T0-205AD (T0-39) .................................. 5.1-17
Bipolar TranSiStors, Small Signal .................... 5.1-17
T0-206AA (T0-18) •••••••• " ••••.••••••••• ~ ••••••••• 5.1-17
Bipolar Transistors, Small Signal .................... 5.1-17
T0-218 .............................................. 5.6-8
Rectifiers ................................... 5.6-8,5.6-12
T0-220 Types ........................................ 5.6-7
Rectifiers ................................... 5.6-7,5.6-11
T0-220AB ................................... 5.4-13,5.4-19
Thyristors ................................... 5.7-4,5.7-8
TMOS Power MOSFETs .............. 5.4-13, 5.4-19, 5.4-21
T0-225AA (TO-126) .................................. 5.7--3
Thyristors ................................... 5.7--3,5.7-7
T0-226AA (TO-ll2)
Bipolar Transistors, Small Signal ..................... 5.1-2
JFETs, Small Signal ............................... 5.1-19
Thyristors ............................ 5.7-2,5.7-7,5.7-14
TMOS MOSFETs, Small Signal ...................... 5.1-21
Tuning and Switching Diodes,
Small Signal ....................... 5.1-24, 5.1-27, 5.1--34
T0-226AC (T0-92)
Hot-Carrier (Schottky) Diodes, Small Signal .......... 5.1-32
Tuning and Switching Diodes,
Small Signal ....................... 5.1-26,5.1--30,5.1--35
T0-226AE (TO-ll2)
Bipolar Transistors, Small Signal ....... '.' ............ 5.1-3
TMOS MOSFETs, Small Signal ...................... 5.1-21
T0-236AB
Bipolar Transistors, Small Signal .................... 5.1-10
FETs, Small Signal ................................ 5.1-22
Hot-Carrier (Schottky) Diodes, Small Signal ... 5.1--32, 5.1--33
Tuning and Switching Diodes,
Small Signal ....................... 5.1-30, 5.1-35, 5.1-41
T0-247 ....................................... 5.4-15,5.6-8
Rectifiers ................................... 5.6-8,5.6-12
TMOS Power MOSFETs ............................ 5.4-15
T0-264 High Power Products ••••••••••••••.••.•••••• 5.4-18
TMOS Power MOSFETs ............................ 5.4-16
TO--3PBL ........................................... 5.4-16
TMOS Power MOSFETs ............................ 5.4-16
Transceivers, Digital Signal Processors .•..••...••.•.•. 2.1-1
Transient Voltage Suppressors •••••••••••••••••••••••• 5.2-2
Axial Leaded for Through-hole Designs ....•.••..•.... 5.2-2
T
Tape and Reel Options ............................... 4.11-1
Analog MPQ Table ................................. 4.11-4
Tape/Reel and Ammo Pack ....................... 4.11-4
PLCC ....................................... 4.11-4
SOIC ........................................ 4.11-4
TQ-92 ............................ : .......... 4.11-4
Tape and Reel .................................... 4.11-2
Tape and Reel Specifications, CPSTG ••••••••••••••••• 5.12-2
Embossed Tape and Reel Data ...................... 5.12-4
Embossed Tape and Reel Ordering Information ........ 5.12--3
Lead Tape Packaging Specifications
for Axial-Lead Components ....................... 5.12-6
Technical Data and Literature ................... 6.1-2,6.1-6
Technical Data Services
Mfax - Touch-Tone FAX ............................. 6.1-1
Motorola SPS World Marketing Intemet Server ......... 6.1-1
Semiconductor Data Update Magazine ................ 6.1-1
Technical Training, Technical Training Centers •••••••• 6.1-11
Thyristors ........................................... 5.7-2
Silicon Controlled Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . .. 5.7-2
General Purpose, Plastic .......................... 5.7-2
TRIACs ........................................... 5.7-7
General Purpose, Plastic .•.•...................... 5.7-7
Triggers
High Voltage Bidirectional TVS Devices .........•.. 5.7-14
Programmable Unijunction Transistors ............. 5.7-14
SIDACs ........................................ 5.7-14
Silicon Bidirectional Switch ....................... 5.7-14
TMOS MOSFETs .................................... 5.1-21
Small Signal ............................... 5.1-21,5.1-41
TMOS Power MOSFETs ••••••••••••••••••••••••••••••• 5.4-1
TMOS Power MOSFETs Numbering System •••••••••••• 5.4-2
TMOS V ............................................. 5.4-6
TO-116
Bipolar Transistors, Small Signal ..................... 5.1-9
Subject Index
7.2-14
Transistors, Discrete
RF .............................................. 5.10-2
Power Bipolar .......................... 5.10-6-5.10-13
1.5GHz .................................... 5.10-10
900 MHz .............................. 5.10-8-5.10-9
HF .......................................... 5.10-6
Linear .............................. 5.10-12-5.10-13
Microwave .......................... 5.10-10-5.10-11
UHF ................................. 5.10-7-5.10-8
VHF .................................. 5.10-6-5.10-7
Power MOSFETs ......................... 5.10-4-5.10-5
Small Signal ........................... 5.10-14-5.10-19
Trsnsmltter Functions
RF ............................................. 5.10-22
1.5 - 2.2 GHz Transmit Chain .......•.... 5.10-24-5.10-25
2.4 GHz Transmit Chain ......................... 5.10-25
900 MHz Transmit Chain •............... 5.10-23-5.10-24
Motorola Master Selection Guide
Subject Index
T (continued)
U (continued)
TRIACs ......••..•.••..•••••.........•..•............ 5.7-7
Thyristors ......................................... 5.7-7
Ultrafast Rectifiers (continued)
Surtace Mount
TO-218 Types.
TO-220Type
TO-247 ...
TSSOP-16
RF .. ...
. ..... 5.10-21-5.10-22,5.10-24-5.10-25
TSSOP-20
RF ............................................. 5.10-22
TVSlZeners ..••.......•.••........................... 5.2-1
. . . . . .. 5.2-2
Transient Voltage Suppressors .........
General-Purpose ...................
. ... 5.2-2
Overvoltage Transient ...
. . 5.2-15
Surtace Mount. . . . . . . . . . . . . . . . . . . . . . . .
. ...... 5.2-9
. ... 5.2-16
Zener Diodes .......................... .
Current Regulator ... . . . . . . . . . . . . . . . . . .
. .. 5.2-31
Voltage Reference. . . . . . . . . . . . . . . . . . .
. ..... 5.2-31
Voltage Regulator ............................... 5.2-16
u
Ultrafast Rectifiers ••.......•.•..•••.•.•............. 5.6-10
.... 5.6-10
Axial Lead ............................. .
. ... 5.6-12
POWERTAPII ......................... .
Motorola Master Selection Guide
7.2-15
........ 5.6-10
. ....... 5.6-12
5.6-11
. ... 5.6··12
v
Video Amplifiers, RF ................................ 5.10-35
Voltage References ................................... 4.4-1
. 4.4-2
Precision Low Voltage References . .
Voltage References Package Overview ................ 4.4-2
z
Zener Diodes
Current Regulator
... 5.2-31
Voltage Reference. . . . . .
. ... 5.2-31
Voltage Regulator
............
. ... 5.2-16
Axial Leaded for Through-hole Designs ...... 5.2-2, 5.2-16
Surtace Mount Packages. . . . . . . . .
. .. 5.2-21
Subject Index
Subject Index
7.2-16
Motorola Master Selection Guide
5/1/96
MOTOROLA AUTHORIZED DISTRIBUTOR & WORLDWIDE SALES OFFICES
NORTH AMERICAN DISTRIBUTORS
UNITED STATES
FAI. . ..................... (408)434-0369
Future Electronics ............ (408)434-1122
ALABAMA
Huntsville
Santa Clara
ArrowlSchwaber Electronics .... (205)837-6955
FAI .......................•. (205)837-9209
Future Electronics ............ (205)83(}-2322
Hamitton/Hallmark ............ (205)837-8700
Newark ..................... (205)837-9091
lime Electronics ........... 1-80(}-789-TIME
Wyle Electronics ............. (205)83(}-1119
ARIZONA
Phoenix
Wyle Electronics .........•.•. (408)727-2500
Sierra Madre
PENSTOCK .......... " ..... (818)355-6775
Sunnyvale
HamiJton/Hailmark ............ (408)435--3500
PENSTOCK ................. (408)730-0300
lime Electronics ........... 1-80(}-789-TIME
Thousand Oaks
Newark ..................... (805)449-1480
FAI ......................... (602)731-4661
Future Electronics ............ (602)968-7140
Hamitton/HaJlmark ............. (602)414-3000
Wyle Eleclronics ............. (602)804-7000
Tempe
Arrow/Schwaber Electronics .... (602)431-0030
Newark .. .................. (602)966-6340
PENSTOCK ................. (602)967-1620
lime Eleclronics ........... 1-60(}-789-TIME
CALIFORNIA
Agoura Hills
Torrance
lime Electronics ........... 1-800-789-TIME
Tustin
Time Electronics ........... 1-80(}-789-TIME
Woodland Hills
Hamilton/Hallmark ............ (818)594-0404
Richardson Electronics ....... (615)594-5600
COLORADO
Lakewood
FAI ......................... (303)237-1400
Future Electronics ............ (303)232-2008
Denver
Future Eleclronics ............ (818)866-0040
lime Electronics Corporate ..• 1-60(}-789-TIME
Belmont
Richardson Electronics ......• (415)592-9225
Calabassas
Arrow/Schweber Electronics .•.. (818)88(}-9686
Wyle Electronics ............. (818)88(}-9000
Chatsworth
Newark ..................... (303)373-4540
Englewood
Arrow/Schweber Electronics .... (303)799-0258
Hamilton/Hallmark ........... (303)79(}-1662
PENSTOCK ................. (303)799-7845
lime Electronics ........... 1-80(}-789-TIME
Thornton
Wyle Electronics ............. (303)457-9953
lime Electronics ........... 1-60(}-789-TIME
Costa Mesa
HamittonIHaJlmark ............ (714)789-4100
CONNECTICUT
Bloomfield
Newark ..................... (203)243-1731
Cheshire
Culver City
Hamiltonll1allmark ..•......... (310)558-2000
Garden Grove
Newark .......••.....•...... (714-893-4909
Irvine
Arrow/Schweber Electronics .•.
FAI .........................
Future Electronics ...•........
Wyle Laboratories Corporate ....
Wyle Electronics .............
(714)587-0404
(714)753-4778
(714)453-1515
(714)753-9953
(714)863-9953
FAI ......................... (203)250-1319
Future Electronics ............ (203)250-0083
Hamilton/Hallmark ........... (203)271-2844
Southbury
Time Electronics ........... 1-80(}-789-TIME
WalUngfort
ArrowlSchweber Electronics .... (203)265--7741
FLORIDA
Altamonte Springs
Future Electronics ............ (407)865-7900
Los Angeles
FAI ......................... (818)879-1234
Wyle Electronics ............. (818)88(}-9000
Man hattan Beach
PENSTOCK ................. (310)546-8953
Mountain View
Richardson Electronics ....... (415)96(}-6900
Newberry Park
Clearwater
FAI ......................... (813)53(}-1665
Future Electronics ............ (813)53(}-1222
Deerfield Beach
ArrowlSchweber Electronics .... (305)429-8200
Wyle Electronics ............. (305)420-0500
Ft. Lauderdale
PENSTOCK ................. (805)375--6680
Palo Alto
Newark ...............•..... (415)812-8300
Riverside
Newark .....•............... (909)784-1101
Rocklin
Hamilton/Hallmark ........•.. (916)632-4500
Sacramento
FAI ... " .....•..•.....•..... (916)762-7882
Newark . . . . . . . . . . . • . . . • . . . .. (916)565--1760
Wyle Electronics ..•.......... (916)638-5282
San Diego
Arrow/Schweber Electronics ...
FAI .........................
Future Electronics ............
Hamitton/HaJlmark ............
Newark .....................
PENSTOCK .................
Wyle Electronics .............
(619)565-4800
(619)623-2888
(619)625--2800
(619)571-7540
(619)453-8211
(619)623-9100
(619)565--9171
San Jose
ArrowlSchweber Electronics •••• (408)441-9700
Arrow/Schwaber Electronics ...• (408)428-6400
FAI ......................... (305)428-9494
Future Electronics ..........•. (305)436-4043
Hamilton/Hallmark ............ (305)484-5482
Newark ................ . . . .. (305)488-1151
Time Electronics ........... 1-80(}-789-TIME
Lake Mary
Arrow/Schweber Electronics .••. (407)333-9300
LargolTampaiSt. Petersburg
Hamitton/Hallmark ............ (813)547-5000
Newark ......•.............. (813)287-1578
Wyle Electronics ............. (813)575--3004
Time Electronics ........... 1-800-789-TIME
Orlando
FAI ...........•............. (407)865-9555
Tellahassee
FAI ......................... (904)668-7772
Tampa
PENSTOCK .•....•.......... (813)247-7556
Winter Park
Hamilton/Hallmark .........•. (407)657-3300
PENSTOCK •....•••.••..•... (407)672-1114
Richardson Electronics ....... (407)644-1453
GEORGIA
Atlanta
FAI ........... '" ........... (404)447-4767
Time Electronics ........... 1-80(}-789-TIME
Wyle Electronics ............. (404)441-9045
Duluth
Arrow/Schweber Electronics .... (404)497-1300
Hamilton/Hallmark ........... (404)623-4400
Norcross
Future Electronics ............
Newark ... . . • . . . . . . . . . . . . . ..
PENSTOCK .................
Wyle Electronics .. . . . . . . . . . ..
(770)441-7676
(770)448-1300
(770)734-9990
(770)441-9045
IDAHO
Boise
FAI ......................... (208)376-6080
ILLINOIS
Addison
Wyle Laboratories . . . . . . . . . . .. (708)620-0969
Bensenville
HamittonIHaJlmark ............ (708)797-7322
Chicago
FAI ......................... (708)843-0034
Newark Electronics Corp...... (312)784-5100
Hoffman Estates
Future Electronics. . . . . . . . . . .. (708)882-1255
Itasca
Arrow/Schwaber Electronics ... (708)250-0500
LaFox
Richardson Electronics ....... (708)208-2401
Palatine
PENSTOCK ................. (708)934-3700
Schaumburg
Newark .......... . . . . . . . . . .. (708)31 0-6980
Time Electronics ........... 1-80(}-789-TIME
INDIANA
Indianapolis
Arrow/Schweber Electronics .•.. (317)299-2071
Hamilton/Hallmark ..••..•.... (317)575--3500
FAI ......................... (317)469-0441
Future Electronics ............ (317)469-0447
Newark ......•••..........•. (317)259-0085
Time Electronics .......•.•. 1-80(}-789-TIME
Ft. Wayne
Newark ..................... (219)484-0766
PENSTOCK ...........•..... (219)432-1277
IOWA
Cedar Rapids
Newark ..................... (319)393-3800
lime Electronics ........... 1-600-789-TIME
KANSAS
Kansas City
FAI ......................... (913)381-6800
Lenexa
ArrowlSchweber Electronics .••• (913)541-9542
Hamilton/Hallmark ........... (913)663-7900
Olethe
PENSTOCK ................. (913)829-9330
Overland Park
Future Electronics ...••••.•... (913)649-1531
Newark .... .. .. . .. . .. .. .. ... (913}677-0727
lime Electronics .......•... 1-80(}-789-TIME
MARYLAND
Baltimore
FAI ......................... (410)312-0833
Columbia
Arrow/Schweber Electronics .... (301}598-7800
Future Electronics ............ (410}290-0600
Hamilton/Hallmark .....•..... (410}72(}-3400
Time Electronics .•..•..•... 1-60(}-789-TIME
PENSTOCK .•...•.........•. (410)290-3746
Wyle Electronics ............. (410)312-4844
Hanover
Newark ..................... (410)712-6922
For changes to this Information contact Technical Publications at FAX (602) 244-6560
6/1/96
AUTHORIZED DISTRIBUTORS - continued
UNITED STATES - continued
MASSACHUSETTS
Boston
Arrow/Schweber Electronics •••• (508)651Hl900
FAI ......................... (508)779-{3111
Bolton
Future Corporete ............. (508)779-{3000
Burlington
PENSiOCK ................. (617)229-9100
Wyle Electronics ............. (617)271-9953
Norwell
Richardson Electronics .•••••• (617)871-5162
Peabody
11me Electronics ........... 1-800-789-TIME
HamiitoniHalimark .•..•..•... (508)532-9893
Woburn
Newark .. .. .. .. .. .. .. .. .. ... (617)935-8350
MICHIGAN
Detroit
NEW MEXICO
Albuquerque
Hamlfton/Hallmark •••.••.••.• (503)528-8200
Wyle Electronics ..•••.•. . . • .• (503)643-7900
Alliance Electronics •....•..•. (505)292-{3360
HaminonlHailmark ..•...•••..• (505)82&-1058
Newark .. • . . . . • • • .. • • • .. • • •• (505)82&-1878
NEW YORK
Bohemia
Newark ..................... (516)567-4200
Hauppauge
Arrow/SchWeber Electronics ....
Future Electronics • • . . • • . • • • ••
HamiitonlHalimark ..••....••.
PENSTOCK ....••...•.•.••••
(516)231-1000
Grand Rapids
Newark ..................... (616)954-6700
Livonia
Arrow/Schweber Electronics •... (810)455-0850
Future Electronics ....•....... (313)261-5270
Hamilton/Hallmark ........... (313)416-5800
11me Electronics ........... 1-800-789-TIME
Troy
Newark ..................... (810)583-2899
MINNESOTA
Bloomington
Wyle Electronics ••••••••••...•• (612)853-2280
Burnsville
PENSTOCK .................. (612)862-7630
Eden Pral rle
Arrow/Sctwieber Electronics •••. (612)941-5280
FAI ......................... (612)947-0909
Future Electronics •••....•.••. (612)944-2200
Hamilton/Hallmark ..........• (612)881-2600
11me Electronics ....•••.•.. 1-800-789-TIME
Minneapolis
Newark ..................... (612)331-8350
Earth City
HamiitonlHalimark ..........• (314)291-5350
MISSOURI
Sl Louis
Arrow/Schweber Electronics ••.. (314)567-8888
Future Electronics ...•.•..•... (314)469-8806
FAI ......................... (314)542-9922
Newark .. .. .. .. .. .. .. .. .. ... (314)453-9400
11me Electronics ........... 1-800-789-TIME
NEW JERSEY
Bridgewater
PEI'l'STOCK ................. (908)576-9490
Cherry HIli
HamilionIHailmark .•.......•.• (609)424-0110
East Brunswick
Newark ..................... (908)937-6600
Fairfield
FAI ......................... (201)331-1133
L~~P. ~~~~~~ ................. (516)348-{3700
Marlton
Arr<:JN/Schweber Electronics .... (609)596-8000
FAI ......................... (609)98&-1500
Future Electronics • • . • • • • • • • •• (609)59&-4080
Arrow/Schweber Electronics .•.. (201 )227-7880
Wyle Electronics. . • • . . . • • • . • .. (201 )882-8358
Parsippany
Future Electronics .•...•....•• (201)299-0400
Hamilton/Hallmark ........... (201)515-1641
PENNSYLVANIA
Coatesville
PENSTOCK ................. (610)383-9536
Ft. Washington
(516)72,4-9580
Mt. Laurel
Konkoma
Hamilton/Hallmark ..•.•...••• (516)737-0600
Melville
Wyle Laboretories ••.•.••..•.. (516)293-8446
Pittsford
Rochester
Arrow/Schweber Electronics .... (716)427-0300
Future Electronics ...••••..•.. (716)387-9550
FAI ......................... (716)387-9600
HaminonlHailmark ...•••...... (716)272-2740
Richardson Electronics ....... (716)264-1100
Time Electronics •.....••... 1-800-789-TIME
Rockville Centre
Richardson Electronics ••..... (516)872-4400
Syracuse
fAI ......................... (315)451-4405
Future Electronics ......•..... (315)451-2371
Newark ..................... (315)457-4873
11me Electronics ••••.•••••• 1-800-789-TIME
NORTH CAROLINA
Charlotte
FAI ......................... (704)548-9503
Future Electronics .......•.... (704)547-1107
Richardson Electronics ..•..•• (704)548-9042
Raleigh
Arrow/Schweber Electronics .... (919)878-{3132
FAI ......................... (919)875-0088
Future Electronics. . • • . • • • . • •. (919)790-7111
Hamilton/Hallmark ........... (919)872-0712
Newark ..................... (919)781-7677
11me Electronics •..•.•.••.• 1-800-789-TIME
OHIO
Centerville
Arrow/Schweber Electronics .... (513)435-5563
Cleveland
FAI ......................... (216)445-0061
Newark ..................... (216)391-9330
11me Electronics ........... 1-800-789-TIME
Columbus
Newark ..................... (614)325-0352
11me Electronics ........... 1-800-789-TIME
D~~~~....................... (513)427-6090
Future Electronics .•.•.••..... (513)425-0090
Hamilton/Hallmark ••.••.•••.• (513)439-8735
Newark .. .. .. .. .. .. .. .. .. ... (513)294-8980
Time Electronics ....••••••• 1-800-789-TIME
Mayfield Heights
Future Electronics ........•••. (216)449-8996
Solon
Arrow/Schweber Electronics •••• (216)248-{3990
Hamilton/Hallmark •.....••••• (216)49&-1100
Worthington
Hamiltol1iHalimark ••••••••••• (614)888-{3313
Plnebrook
FAI ......................... (503)297-5020
Newark ..................... (503)297-1984
PENSTOCK . . . . . . • . • . • • • • . •• (503)64&-1670
11me Electronics •••••••••.. 1-800-789-TIME
(518)234-4000
(516)434-7400
Newark ..................... (716)381-4244
FAI ......................... (313)513-0015
Future Electronics .......••••. (616)698-8800
Portland
OKLAHOMA
Tulsa
FAI ......................... (918)492-1500
Hamilton/Hallmark •.•••....•• (918)459-8000
Newark ..................... (918)252-5070
OREGON
Beaverton
11me Electronics .••.••••••• 1-800-789-TIME
Wayne
Arrow/AJmac Electronics Corp. •• (503)629-8090
Future Electronics . . . . . . . . . • .. (503)646-9454
Newark ..................... (215)654-1434
Wyle Electronics •••... • . • • • •• (809)439-9110
Montgomeryville
Richardson Electronics •••...• (215)625-0805
Philadelphia
11me Electronics .......••.• 1-800-789-TIME
Wyle Electronics ....•.......• (609)439-9110
Pittsburgh
ArrowISChweber Electronics .... (412)963-8807
Newark ..................... (412)78&-4790
11me Electronics ........... 1-800-789-TIME
TENNESSEE
Franklin
Richardson Electronics ••..•.• (615)791-4900
Knoxville
Newark ..................... (615)588-6493
TEXAS
Austin
ArrowISchwaber Electronics .... (512)835-4180
Future Electronics •••••••••••. (512)502-0991
FAI . .. .. . . .. . .. . . . . . . . . . . . .. (512)34&-6426
Hamilton/Hallmark ••••••••••• (512)219-{3700
Newark ..................... (512)33s-0287
PENSTOCK ..•.............• (512)346-9762
11me Electronics •••••••••.• 1-800-789-TIME
Wyle Electronics ••.•••••••••• (512)833-9953
Benbrook
PENSTOCK ................. (817)249-0442
Carollton
Arrow/Schweber Electronics .•.• (214)380-6464
Dallas
FAI ......................... (214)231-7195
Future Electronics •.•••••••••• (214)437-2437
HamiHon/Halimark •...••.•••. (214)553-4300
Newark ..................... (214)45&-2528
Richardson Electronics •.•.••• (214)239-{3680
11me Electronics •••.••••••. 1-800-789-TIME
Wyle Electronics •....•...•... (214)236-9953
EI Paso
FAI ......................... (915)577-9531
Ft. Worth
Allied Electronics ••••••••••••• (817)33&-5401
Houston
Arrow/Schweber Electronics ••.. (713)647-6868
FAI ......................... (713)952-7088
Future Electronics .•••••.••••• (713)785-1155
Hamilton/Hallmark ........... (713)781-8100
Newark ..................... (713)894-9334
11me Electronics ••••••••••• 1-800-789-TIME
Wyle Electronics ••••••••••••• (713)879-9953
Richardson
PENSTOCK ..•....•.....•... (214)479-9215
San Antonio
FAI ......................... (210)738-{3330
UTAH
Salt Lake City
Arrow/Schweber Electronics ••••
FAI .........................
Future Electronics ••••••••••••
HamiHonIHailmark .•••..•.••••
Newark •••••••••••••••••••••
Wyle Electronics ••....... . . •.
(801 )973-6913
(801)467-9696
(801 )467-4448
(801)26&-2022
(801)261-5660
(801 )974-9953
West Valley City
11me Electronics ••......•.. 1-800-789-TIME
Wyle Electronics ............. (801)974-9953
For changes to this Information contact Technical Publications at FAX (602) 244-6560
5/1/96
AUTHORIZED DISTRIBUTORS - continued
WASHINGTON
Bellevue
Almac Electronics Corp. . ... '
Newark . . . . . . . . . . . . . . . . . . . ..
PENSTOCK .................
Richardson Electronics .......
Mlsslssauga
CANADA
ALBERTA
Calgary
UNITED STATES -continued
(206)643-9992
(206)641-9800
(206)454-2371
(206)646-7224
PENSTOCT< ................. (905)403-0724
Ottawa
Electro Sonic Inc. ...........
FAI ........ ..
...
Arrow Electronics... ..... .
Electro Sonic Inc.............
FAI ..................... ...
Future Electronics ............
HamittoniHallmark ............
(403)255-9550
(403)291-5333
BRITISH COLUMBIA
Future Electronics ............ (403)250-5550
Hammon/Hallmark ............ (800)663-5500
Toronto
Edmonton
Bothell
Future Electronics .....••.•.. , (206)489-3400
Redmond
Hamitton/Hallmark .........••. (206)882-7000
Time Electronics ........... 1--800-789-TIME
Wyle Electronics •............ (206)881-1150
Arrow Electronics ............
Electro Sonic Inc. .. ..........
FAI .........................
Future Electronics ............
HamittoniHallmark ............
Newark ....... . .. .. .. .. .. ...
Richardson Electronics .......
FAI ......................... (403)438-5888
Future Electronics ............ (403)438-2858
Hamilton/Hallmark ........... (800)663-5500
Saskatchewan
Hamilton/Hallmark ........... (800)663-5500
Vancouver
Seattle
FAI ......................... (206)485--8616
WyJe Electronics . . . . . . . . . . . . .. (206)881-1150
WISCONSIN
Brookfield
ArrowlSchweber Electronics .... (414)792-0150
Future Electronics ........... , (414)879-0244
Wyle'Electronics ............. (414)521-9333
Milwaukee
FAI ......................... (414)792-9778
Time Electronics ........... 1--800-789-TIME
New Berlin
Hamilton/Hallmark ........... (414)780-7200
Wauwatosa
Newark ..................... (414)453-9100
(613)226-6903
(613)728--8333
(613)820--8244
(613)820--8313
(613)226-1700
Arrow Electronics ............
Electro Sonic Inc. ............
FAI .........................
Future Electronics ............
Hamilton/Hallmark ............
(604)421-2333
(604)273-2911
(604)654-1050
(604)294-;-1166
(604)420-4101
QUEBEC
Montreal
MANITOBA
Winnipeg
Electro S'onic Inc. ...........
FAI .........................
Future Electronics ............
Hamitton/Hallmark ............
(905)670-7769
(416)494-1666
(905)612-9888
(905)612-9200
(905)564-6060
(905)670-2888
(905)795-6300
(204)783-3105
(204)786-3075
(204)944-1446
(800)663-5500
ONTARIO
Kanata
Arrow Electronics ............
FAI .........................
Future Electronics ............
Hamitton/Hallmark ............
Richardson Electronics .......
(514)421-7411
(514)694-6157
(514)694-7710
(514)335-1000
(514)748-1770
Quebec City
Arrow Electronics ............ (418)687-4231
FAI ......................... (418)682~5775
Future Electronics ............ (418)877-6666
PENSTOCK ................. (613)592-6088
INTERNATIONAL DISTRIBUTORS
AUSTRALIA
AVNET VSI Electronics (Australia)(61)2 878-1299
Veltek Australia Pty Ltd ..... (61)3 9574-9300
AUSTRIA
EBV Austria ................. (43) 1 8941774
Elbatex GmbH ................ (43) 1 866420
Spoerle Austria ............. (43) 1 31872700
BELGIUM
Diode Spoerle .............. (32) 2 725 4660
EBV Belgium ............... (32) 2 716 0010
CHINA
Advanced Electronics Ltd. ... (852)2305-3633
AVNET WKK Components Ltd. (852)2357--8888
China EI. App. Corp. Xiamen Co
.. .. .. .. .. .. .. .. .. .. ... . (86)592 513-2489
Nanco Electronics Supply Ltd. (852) 2 333-5121
Qing Cheng Enterprises Ltd .. (852) 2 493-4202
DENMARK
HOLLAND
EBV Holland .............. (31) 3465 623 53
Diode Spoerle BV ............ (31) 4054 5430
HONG KONG
AVNET WKK Components Ltd. (852)2357--8888
Nanshing Clr. & Chern. Co. Ltd (852)2333-5121
INDIA
Canyon Products Ltd ....... (91) 80 558-7758
ESTONIA
P.T.Ometraco ............. (62) 21 619-6166
Avnet Adelsy SpA..... . ..... (39) 2 381901
EBV Italy .................... (39) 2 660961
Silverstar SpA ............... (39) 2 66 12 51
JAPAN
Arrow Field Eesti . . . . . . .. . .... (372) 6503288
Avnet Baltronic ............... (372) 6397000
FINLAND
Arrow Field OY ............. (35) 80777571
Avnet Nortec OY ............. (35) 80613181
FRANCE
Arrow Electronique .. . . • . .. (33) 1 49 78 49 78
Avnet Components. . . . . . .• (33) 1 49 65 25 00
EBV France .... .. .. . .. ... (33) 1 64 68 86 00
Future Electronics ...........• (33)169821111
Newark . . . . . . . . . . • . • . . . . . .. (33) 1-30954060
SEIIScaib .. .. .. .. .. .. .... (33) 1 69 19 89 00
AMSC Co., Ltd .............
Fuji ElectroniCS Co., Ltd.....
Marubun Corporation .......
Nippon Motorola Micro Elec. ..
OMRON Corporation .......
Tokyo Electron Ltd ..........
Arrow Tahonic NS ............ (47)22378440
Avnet Nortec NS Norway ..... (47) 66846210
PHILIPPINES
Alexan Commercial ......... (63) 2241-9493
SINGAPORE
Future Electronics ............. (65) 479-1300
Strong Pte. Ltd ............... (65) 276-3996
Uraco Technologies Pte Ltd ..... (65) 545-7811
SPAIN
Amitron Arrow .............. (34) 1 3043040
EBV Spain ................. (34) 1 804 32 56
Selco S.A. .. ............... (34) 1 637 10 11
SWEDEN
Arrow-Th:s .................. (46) 8 362970
Avnet Nortec AB .. .. ....... (46) 8 629 14 00
SWITZERLAND
INDONESIA
ITALY
Arrow Exatec ............... (45) 44 927000
Avnet Nortec NS ............ (45) 44 880800
EBV Denmark ............... (45) 39690511
GERMANY
Avnet E2000 ............... (49) 89 4511001
EBV Elektronik GmbH ....... (49) 89 99114-0
Future Electronics GmbH .... (49) 89-957270
Jermyn GmbH. ... . . . ... . . .. (49) 6431-5080
Newark .................... (49)2154-70011
SascoSemiconductor ......... (49)89-46110
Spoerle Electronic. . . . . . . . .. (49) 6103-304-0
81-422-54--8800
81-3-3814-1411
81-3-3639--8951
81-3-3280-7300
81-3-3779-9053
81-3-5561-7254
KOREA
Jung Kwang Sa . . . . . . . . . . . . .. (82)2278-5333
Lite-On Korea Ltd ............ (82)2858-3853
Nasco Co. Ltd. . . . . . . . . . . . . .. (82)23772-6800
NEW ZEALAND
AVNET VSI (NZ) Ltd . . . . . . . .. (64)9636-7801
EBV Switzerland ............. (41) 1 7456161
ElbatexAG ................. (41) 56 4375111
Spoerle ..................... (41) 1 8746262
S.AFRICA
Advanced . . .. .. . . . . . .. .. ... (27) 11 4442333
Reuthec Components ....... (27) 11 8233357
THAILAND
Shapiphat Ltd ... (66)2221-0432 or 2221-5384
TAIWAN
Avnet-Mercuries Co., Ltd ... (886)2516-7303
Solomon Technology Corp. ... (886)2788--8989
Strong Electronics Co. Ltd... (886)2917-9917
UNITED KINGDOM
Arrow Electronics (UK) Ltd . (44) 1 234270027
AvnetiAccess .•........... (44) 1 462488500
Future Electronics Ltd ...... (44) 1 753763000
Macro Marketing Ltd. ....... (44) 1 628 60600
Newark .................. (44) 1 420543333
NORWAY
For changes to this Information contact Technical Publications at FAX (602) 244·6560
5/1/96
MOTOROLA WORLDWIDE SALES OFFICES
Colmar ..................... (215)997-1020
Philadelphia/Horsham ........ (215)957-4100
UNITED STATES
ALABAMA
HUn1svilie ..............•.... (205)464--6800
ALASKA .................... (800)635-8291
ARIZONA
Tempe .....................• (602)302-8056
CALIFORNIA
Calabasas ...................
Irvine .......................
Los Angeles .................
San Diego ...................
Sunnyvale ...................
(818)878-8800
(714)753-7360
(818)878-6800
(619)541-2163
(408)749-0510
Milan. . . . . . . • . . . . .. . . . . . . . . . ... 39(2)82201
TENNESSEE
Knoxville ............•.....•. (423)584-4841
TEXAS
Auslin ...................... (512)502-2100
Houslon .................... (713)251-0006
Plano •.•••••.......•.•.•.... (214)518-5100
VIRGINIA
Richmond ................... (804)285-2100
UTAH
CSI Inc......••..•........... (801 )572-401 0
WASHINGTON
COLORADO
Denver ..................... (303)337-3434
CONNECTICUT
Wallingford .................. (203)949-4100
Bellevue .................... (206)454-4160
Seattle Access .............. (206)622-9960
WISCONSIN
Clearwater .................. (813)524-4177
Maitland .................... (407)628-2636
Pompano Beach/Ft. Lauderdale (305)351-6040
GEORGIA
Atlanta ..................... (770)729-7100
IDAHO
Boise.. . .. .. .. .. .. .. .. .. .... (208)323-9413
ILLINOIS
Chicago/Schaumburg ...••.... (847)413-2500
INDIANA
Indianapolis ................. (317)571-0400
Kokomo ................... (317)455-5100
CANADA
BRITISH COLUMBIA
MARYLAND
Columbia ................... (410)381-1570
MASSACHUSETTS
MMborough ..............•.. (508)357-8200
Woburn ..................... (617)932-9700
Detron ...................... (810)347-8800
Literature ................... (800)392-2016
MINNESOTA
Minnetonka .................. (612)932-1500
.
Montreal ..... . . .. .. . . . . . .. .. (514)333-3300
S1. Louis .................... (314)275-7380
Fairfield ..................... (201 )808-2400
NEW YORK
Fairport ..................... (716)425-4000
Fishkill. .. .. . .. . . .. .. .. .. . ... (914)896-0511
Hauppauge ................. (516)361-7000
NORTH CAROLINA
Raleigh ..................... (919)870-4355
OHIO
Cleveland ................... (216)349-3100
Columbus/Worthington ........ (614)431-8492
Dayton ............•........ (513)438-8800
OKLAHOMA
Tulsa ....................... (918)459-4565
OREGON
PENNSYLVANIA
PUERTO RICO
San Juan .. • .. . .. . .. . . .. . .... (809)282-2300
SiNGAPORE .................. (65)4618188
SPAIN
Solna ....................... 46(8)734-8800
Melbourne .•.......•....•.• (61-3)98870711
Sydney .................... (61-2)29661071
BRAZIL
Sao Paulo ................. 55(11)815-4200
Beijing ............••......•
Guangzhou ................
Shanghai ..................
Tianjin ........ .. .. .. .. .. ...
88-10-8437222
88-20-7537888
88-21-3747668
88-22-5325072
Denmark ..................... (45) 43488393
Helsinki ................... 358-0-35161191
carphone ................... 358(49)211501
FRANCE
Paris ........................ 33134 635900
GERMANY
Langenhagen/Hanover ....... 49(511)786880
Munich ..................... 498992103-0
Nuremberg . .. .. .. .. .. .. .... 49 911 96-3190
Sindelfingen ................. 49 7031 79 710
Wiesbaden .. .. .. .. .. .. .. .... 49 611 973050
HONG KONG
Kwai Fong ................. 852-2-810-8888
Tai Po .................... 852-2-866-8333
INDIA
Portland .................... (503)641-3681
PHILIPPINES
SWEDEN
INTERNATIONAL
AUSTRALIA
FINLAND
NEW JERSEY
MEXICO
Madrid ...................... 34(1 )457-8204
or .......................... 34(1 )457-8254
DENMARK
MISSOURI
MALAYSIA
Manila . . . . . . . . . . . . . . . . . . ... (63)2 822-0625
Ottawa ..................... (613)228-3491
Toronto ..................... (416)497-8181
CHINA
MICHIGAN
Pusan •.•••................ 82(51)4635-035
Seoul. . • • .. • . . . . . . . . . . . . . . .. 82(2)554-5118
Best ....................... (31)499861211
ONTARIO
Cedar Rapids ................ (319)378-0383
Kansas City/Mission .......... (913)451-8555
KOREA
NETHERLANDS
Vancouver . . . . . . . . . . . . . . . . . •. (604)293-7650
IOWA
KANSAS
Kyusyu ................... 81-92-725-7583
Gotanda .................. 81-3-5487-8311
Nagoya . . . . • • . . • • • • . . . . . •. 81-52-232-3500
Osaka ........ .. .. .. .. .. ... 81-8-305-1801
Sendal ................... 81-22-268-4333
Takamatsu '" .......•..... 81-878-37-9972
Tokyo .....••............. 81-3-3440-3311
Mexico City ................. 52(5)282-0230
Guadalajara .........•....... 52(36)21-8977
Marketing •••................ 52(36)21-2023
Cuslomer Service ........... 52(36)669-9160
Field Applicalions Engineering Available
Through All Sales Offices
QUEBEC
JAPAN
Penang ...............••.... 60(4)228-2514
Milwaukee/Brookfield ......... (414)792-0122
FLORIDA
Herzlia ..................... 972-9-590222
ITALY
Bangalore .................. 91-80-5598615
ISRAEL
SWITZERLAND
Geneva .................... 41(22)7991111
Zurich ...................... 41(1)730-4074
TAIWAN
Taipei ..................... 886(2)717-7089
THAILAND
Bangkok .................... 66(2)254-4910
UNITED KINGDOM
Aylesbury ................. 44 1 (296)395252
FULL LINE REPRESENTATIVES
CALIFORNIA, Loomis
Galena Technology Group .•.... (916)652-0268
NEVADA, Reno
Galena Tech. Group .......... (702)748-0642
NEW MEXICO, Albuquerque
S&S Technologies,lnc ...•.... (602)414-1100
UTAH, Salt Lake City
Utah Compo Sales, Inc..•••••. (801)561-5099
WASHINGTON, Spokane
Doug Kenley ..........•...•• (509)924-2322
HYBRID/MCM COMPONENT SUPPLIERS
Chip Supply .................
ElmoSemlconductor .........
Minco Technology Labs Inc....
Semi Dice Inc................
For changes to this Information contact Technical Publications at FAX (602) 244-6560
(407)298-7100
(818)768-7400
(512)834--2022
(310)594-4631
Introduction
Semicustom Application Specific
Ifl
L!J Integrated Circuits (ASIC)
[]] Microcomputer Components
f31
Logic: Standard, Special
~ and Programmable
I4l Analog and Interface
~
Integrated Circuits
I"i:l Communications, Power and
L5J
'6l
Signal Technologies Group Products
Product Literature and
~ Technical Training
I-jl Device Index and
L!J Subject Index
1 PHX14226-24 Printed in USA 5196 BANTA CO. MOTO #63 50,000 GENERAL YMAAAA
®
MOTOROLA
How to reach us :
USA/EUROPE / Locations Not Listed : Motorola Literature Distribution ;
P.O. Box 20912; Phoenix, Arizona 85036. 1--B00-441-2447 or 602- 303-5454
JAPAN: Nippon Motorola Ltd.; Tatsumi--SPD--JLDC, 6F Seibu--Butsuryu--Center,
3-14-2 Tatsumi Koto--Ku, Tokyo 135, Japan. 03--B1-3521--B315
MFAX: RMFAXO @email .sps .mot.com- TOUCHTONE 602-244-€609
INTERNET: http ://Desigll-NET.com
ASIA / PACIFIC : Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T. , Hong Kong. 852- 26629298
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