1996_National_SCAN_Databook 1996 National SCAN Databook
User Manual: 1996_National_SCAN_Databook
Open the PDF directly: View PDF .
Page Count: 338
Download | ![]() |
Open PDF In Browser | View PDF |
SCAN DATABOOK 1996 Edition Design for Test Solutions with Boundary Scan Description of Boundary Scan Device Description and Characteristics Loading Specifications, Waveforms, Quality and Reliability Characterization Data •• •• • ••II III [II Boundary Scan Design Support Application Notes SCAN CMOS Test Access Logic Datasheets SCAN ABT Test Access LogiC Datasheets System Test Support Datasheets Ordering Information and Physical Dimensions III http://www.national.com I TRADEMARKS Following is the most current list of National Semiconductor Corporation's trademarks and registered trademarks. ABiCTM Abuseable™ AirShare™ AnadigTM APPSTM ARi 1TM ASPECTTM AT/LANTICTM Auto-Chem DefiasherTM BCPTM BI-FETTM BI-FET IITM BI-LiNETM BIPLANTM BLCTM BLXTM BMACTM Boomer® Brite-Lite™ BSITM BSI-2TM CDDTM CDLTM CGSTM CIMTM CIMBUSTM CLASICTM COMBO® COMBO ITM COMBO IITM CompactRISCTM CompactSPEECHTM COPSTM microcontrollers COP8TM CRDTM CROSS VOL pM CSNITM CTITM CYCLONETM DA4TM DENSPAKTM DIBTM DISCERNTM DISTILLTM DNR® DPVMTM E2CMOSTM ELSTARTM Embedded System Processor™ EPTM E-Z-LlNKTM FACTTM FACT Quiet Series™ FAIRCADTM FairtechTM FAST® FastLockTM FASTr™ GENIXTM GNXTM GTOTM HEX3000TM HiSeCTM HPCTM HyBal™ 13L® ICMTM IntegrallSETM IntelisplayTM Inter-LERICTM Inter-RICTM ISETM ISEIO6™ ISE/08TM ISEI16™ ISE32TM ISOPLANARTM ISOPLANAR-ZTM LERICTM LMCMOSTM M2CMOSTM Macrobus™ Macrocomponent™ MACSITM MAPLTM MAXI-ROM® Microbus™ data bus MICRO-DACTM /JoPotTM /Jotalker™ Microtalker™ MICROWIRETM MICROWIRE/PLUSTM MOLETM MPATM MSTTM Naked-8TM National® National Semiconductor® National Semiconductor Corp.® NAX800™ NeuFuz™ Nitride PIUS™ Nitride Plus Oxide™ NMLTM NOBUSTM NS486™ NSC800™ NSCISETM NSX-16TM NS-XC-16TM NTERCOMTM NURAMTM OPALTM Overture™ OXISSTM p2CMOSTM Perfect Watch™ PLANTM PLANARTM PLAYERTM PLAYER+TM PLLatinum™ Plus-2TM Polycraft™ POPTM Power + ControlTM POWERplanar™ QSTM QUAD3000™ Quiet Series™ QUIKLOOKTM RATTM RICTM RICKITTM RTX16TM SCENICTM SCXTM SERIESI800™ Series 32000® SIMPLE SWITCHER® SNITM SNICTM SofChek™ SONICTM SpeechPro™ SPiKe™ SPIRETM Staggered Refresh™ STARTM Starlink™ STARPLEXTM ST-NICTM SuperATTM Super-BlockTM SuperChipTM SuperScriptTM Switchers Made Simple® SYS32TM TapePak® TDSTM TeleGate™ The National Anthem® TinyPak™ TLCTM Trapezoidal™ TRI-CODETM TRI-POLYTM TRI-SAFETM TRI-STATE® TROPICTM Tropic Pele/™ Tropic ReefTM TURBOTRANSCEIVERTM TWISTERTM VIPTM VR32™ WATCHDOGTM XMOSTM XPUTM ZSTARTM 883B/RETSTM 883S/RETSTM 29KTM and AM29200TM are trademarks of Advanced Micro Devices, Inc. AMD® and MACH®465 are registered trademarks of Advanced Micro Devices, Inc. BTPGTM is a trademark of JTAG Technologies. IBM® and PC® are registered trademarks of International Business Machines Corp. VICTORYTM is a trademark of Teradyne, Inc. Windows® is a registered trademark of Microsoft Corporation. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITIEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life support 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be reasonably expected to cause the failure of the life support deor (b) support or sustain life, and whose failure to pervice or system, or to affect its safety or effectiveness. form, when properly used in accordance with instructions for use provided in the labeling, can be reasonably ex· pected to result in a significant injury to the user. NatlonalSemlconductorCorporatlon 2900 Semiconductor Drive, P.O. Box 58090, Santa Clara, California 95052·8090 1·800·272·9959 TWX (910) 339·9240 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied. and National reserves the right, at any time without notice, to change said circuitry or specifications. http://www.national.com ~ C" Table of Contents CD o - National Semiconductor's SCAN Data Book offers Design for Test Solutions to improve R&D development cycle time, reduce test development and manufacturing cost and improve a customer's end system uptime. Designers, test engineers and engineering management using concurrent engineering practices will see life-cycle cost of ownership go down for systems designed with boundary scan. The SCAN Family of IEEE 1149.1 (JTAG) compliant devices simplify integration of design and test. SCAN Data Book Product Index and Selection Guide The Product Index is a numerical list of all device types contained in this book. The Selection Guide groups the products by function and by family. Section 1 Design for Test Solutions with Boundary Scan ................................ 1-1 Describes OFT and boundary scan and why it affects the lifecycle cost of ownership of complex systems. Describes failure modes identified with boundary scan in board and system level implementations as well as embedded, on-board test. Section 2 Description of Boundary Scan ........ 2-1 Describes boundary scan architecture: Test Access Port, TAP controller, and TDI, TOO, TMS, TCK signals; registers and state diagram; mode of operation. Section 3 Device Description and Characteristics ...................... 3-1 CMOS and BiCMOS characteristics of SCAN ABT and SCAN CMOS 18-bit Test Access Logic are described, including design architecture and performance attributes. Section 4 Loading SpeCifications, Waveforms, Quality and Reliability ................ 4-1 Section 5 Characterization Data ................ 5-1 Graphs depicting the propagation performance of the SCAN CMOS buffers and transceivers. Section 6 Boundary Scan Design Support ....... 6-1 How to obtain BSDL models and other simulation models. Sources of information. iii http://www.national.com oo ::::s CD ::::s ( I) -o r---------------------------------------------------------------------------------, C CD C Section 7 Application Notes ............ 7-1 -:c Section 8 SCAN CMOS Test Access Logic Datasheets . ................. . 8-1 o o o CD ~ Datasheets for 18-bit CMOS devices feature low power consumption, - 48 mA/64 mA drivers used for surrounding clusters of non-1149.1 compliant devices in order to make a board fully 1149.1 compliant. Section 9 SCAN ABT Test Access Logic Datasheets .................. . 9-1 Datasheets for 18-bit SiCMOS devices. They are used along the card edge going into a backplane to provide live insertion/removal capability. Their 250 series resistors on the output eliminate an external damping resistor and reduce ringing (noise). Section 10 System Test Support Datasheets ................ 10-1 These are true "system support" products. These devices extend boundary scan features from the single board environment to several boards. The Embedded Boundary Scan Controller, SCANPSC100F, allows creation of an on-board embedded test environment. It provides the interface from a target system's microprocessor and memory to the IEEE 1149.1 Test Access Port. The Hierarchical and Multidrop Addressable JTAG Port, SCANPSC110F Bridge, provides access to multiple boards within a system for simultaneous testing of like boards as well as system partitioning to better isolate test faults. SCAN EASE in a suite of software tools that enables test vectors to be embedded within an 1149.1 system; compiles and compresses vectors; controls and applies tests; reports failures; and includes a graphical user interface. Section 11 Ordering Information and Physical Dimensions . ...... . 11-1 Functional description of the ordering codes, package outlines, (JJA information and Dry Pack handling procedures. http://www.national.com iv ..."Uo c. -c IfINational Semiconductor n CJ) D) c en Product Status Definitions -o· C CD S· ::;: ::::s Definition of Terms ! en Data Sheet Identification Product Status Advance Information Formative or In Design This data sheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This data sheet contains preliminary data, and supplementary data will be published at a later date. National Semiconductor Corporation reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. No Identification Noted Full Production This data sheet contains final specifications. National Semiconductor Corporation reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Obsolete Not In Production This data sheet contains specifications on a product that has been discontinued by National Semiconductor Corporation. The data sheet is printed for reference information only. • • I , i Definition National Semiconductor Corporation reserves the right to make changes without further notice to any products herein to improve reliability, function or design. National does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. v http://www.national.com Alpha-Numeric Index ADC0851 8-Bit Analog Data Acquisition and Monitoring System ...........................•.... 7-54 ADC0858 8-Bit Analog Data Acquisition and Monitoring System ................................ 7-54 AN-881 Design Considerations for Fault Tolerant Backplanes .............................•.... 7-26 AN-889 Design of a Parallel Bus-to-Scan Test Port Converter .............................•.... 7-30 AN-891 Non-Contact Test Access for Surface Mount Technology ..........................•.... 7-22 AN-1003 G.Host JTAG Interface for Graphics Host Reference Design ......................•.... 7-34 AN-1022 Boundary Scan Silicon and Software Enable System Level Embedded Test ............... 7-8 AN-1023 Structural System Test via IEEE Std. 1149.1 with SCANPSC110F Hierarchical & Multidrop Addressable JTAG Port ......................................................... 7-3 AN-1037 Embedded IEEE 1149.1 Test Application Example ................................... 7-13 SCAN EASE SCAN Embedded Application Software Enabler .................................. 10-54 SCAN18245T Non-Inverting Transceiver with TRI-STATE Outputs .........................•..... 8-3 SCAN18373T Transparent Latch with TRI-STATE Outputs ................................ _.... 8-17 SCAN18374T D Flip-Flop with TRI-STATE Outputs ......................................•.... 8-29 SCAN18540T Inverting Line Driver with TRI-STATE Outputs .............................. _.... 8-41 SCAN18541T Non-Inverting Line Driver with TRI-STATE Outputs .......................... _.... 8-52 SCAN182245A Non-Inverting Transceiver with 250 Series Resistor Outputs ...................... 9-3 SCAN 182373A Transparent Latch with 25!l Series Resistor Outputs ............................ 9-18 SCAN182374A D Flip-Flop with 25!l Series Resistor Outputs .............................•.... 9-31 SCAN182541 A Non-Inverting Line Driver with 250 Series Resistor Outputs .................•.... 9-44 SCANPSC100F Embedded Boundary Scan Controller (IEEE 1149.1 Support) ..................... 10-3 SCANPSC11 OF SCAN Bridge Hierarchical and Multidrop Addressable JTAG Port (IEEE 1149.1 System Test Support) ...................................................... 10-26 vi en o :t> Z t(JNational Semiconductor ... "'tJ o Co c(') en SCAN Products Selection Guide en (I) -o· CD (') ::::J Function I Device I BitWidth C) C Features I c: (I) TRANSCEIVERS Non-Inverting SCAN18245T 18-bit • • • • • • Non-Inverting SCAN182245A 18-bit • High performance BiCMOS technology (tpo < 4 ns, typ) • 25n series resistors in outputs eliminate the need for external terminating resistors • Dual output enable control signals • TRI-STATE outputs for bus-oriented applications • 25 mil pitch SSOP (Shrink Small Outline Package) • IEEE 1149.1 (JTAG) Compliant • Includes CLAMP, IDCODE and HIGHZ instructions D SCAN18374T 18-bit • • • • • • D SCAN 182374A 18-bit • • • • • • • Dual Output Enable Control Signals IEEE 1149.1 (JTAG) Compliant Includes CLAMP and HIGHZ Instructions 9-Bit Data Busses for Parity Applications TRI-STATE@ Outputs for Bus-Oriented Applications Reduced-Swing Outputs source 32 rnA/sink 64 rnA (Comm), and source 24 mA/sink 48 mA (Military) • Guaranteed to Drive 50n Transmission Line to TTL Input Levels of O.8V and 2.0V • TTL Compatible Inputs • 25 mil Pitch SSOP (Shrink Small Outline Package) FLIP-FLOPS Buffered Positive Edge-Triggered Clock IEEE 1149.1 (JTAG) Compliant Includes CLAMP and HIGHZ Instructions 9-Bit Data Busses for Parity Applications TRI-STATE Outputs for Bus-Oriented Applications Reduced-Swing Outputs source 32 mA/sink 64 mA (Comm), and source 24 mA/sink 48 mA (Military) • Guaranteed to Drive 50n Transmission Line to TTL Input Levels of O.8V and 2.0V • TTL Compatible Inputs • 25 mil Pitch SSOP (Shrink Small Outline Package) High performance BiCMOS technology (TPO < 4 ns, typical) 25n series resistor outputs eliminate need for external terminating resistors Buffered positive edge-triggered clock TRI-STATE outputs for bus-oriented applications 25 mil pitch SSOP (Shrink Small Outline Package) IEEE 1149.1 (JTAG) Compliant Includes CLAMP, IDCODE and HIGHZ instructions vii http://www.national.com CD "C ·s C!J Function c o ;:; Device I Blt- Features I Width I LATCHES Co) CD Ci) Transparent SCAN18373T 18-bit • • • • • • Transparent SCAN182373A 18-bit • • • • • • • Inverting SCAN18540T 18-bit (Same Features of the SCAN 18541 T) Non-Inverting SCAN18541T 18-bit • • • • • • Non-Inverting SCAN 182541 A 18-bit • • • • • • • -... CJ) U) Co) ::::s "C o D. ZFeatures Z SYSTEM SUPPORT Embedded Boundary Scan Controller SCANPSC100F • Compatible with the IEEE Std. 1149.1 (JTAG) Test Access Port and Boundary Scan Architecture • Interfaces up to Two 1149.1 Scan Rings • Fabricated in FACTTM 1.5JJ- CMOS Process • Generic Parallel Interface Synchronizes Processor Signals with the SCANPSC1 OaF Operation Clock, SCK • 16-Bit Serial Signature Compaction (SSG) at the Test Data in (TOI) Port • Automatically produces Pseudo-Random Patterns at the Test Data Out (TOO) Port • 25 MHz Operation • TTL Compatible Inputs, Outputs are Full-Swing CMOS with 24 mA Source/Sink Capability "tJ .... o c. o-· r:::: (") en en (I) CD (") :::s G) r:::: c: (I) Hierarchical and Multidrop Addressable JTAG Port SCANPSC110F • True IEEE1149.1 Hierarchical and Multidrop Addressable Capability • The 6 Slot Inputs Support Up to 59 Unique Addresses, a Broadcast Address, and 4 Multi-cast Group Addresses • 3 IEEE 1149.1-Compatible Configurable Local Scan Ports • Mode Register Allows Local TAPs to be Bypassed, Selected for Insertion into the Scan Chain Individually, or Serially in Groups of Two or Three • 32-bit TCK Counter • 16-bit LFSR Signature Compactor • Local TAPs Can Be TRI-STATE Via the OE Input to Allow an Alternate Test Master to Take Control of the Local TAPs SCAN SCAN EASE • Processor independent-runs on big/little endian and memory- and I/O-mapped architectures • Compatible with Teradyne VICTORYTM ATPG and JTAG Technology BTPGTM tools (others supported upon request) • Provides automated translation, application and evaluation of ATPG-generated tests in an embedded system environment • Includes a Scan Function Library and National's Embedded Boundary Scan Controller SCANPSC1 OaF device driver to support custom or non-ATPG generated vector applications • Supports embedded test data log for diagnostic processing • Includes Microsoft Windows GUI and serial communication tool for system administration and remote testing • Supports SCANPSC110F Hierarchical and Multidrop JTAG Addressable Port architecture Embedded Application Software Enabler ix http://www.national.com Section 1 Design for Test Solutions with Boundary Scan II http://www.national.com Section 1 Contents What is DFT? .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Board Development ................................................................ Board Manufacturing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Field Service. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The Economics of Design for Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Where the Failures Are. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Boundary Scan Fundamentals .......... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System-Level Embedded Test ....................................................... The Impact of PC and Communications Technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 1-3 1-3 1-4 1-4 1-5 1-5 1-7 1-9 1-10 1-11 c (I) tn cO' -... t!lNational Semiconductor :::J o -I (I) tn Design for Test Solutions with Boundary Scan en o -O· C :::J tn What is OFT? Design for Test, or OFT, is being used by many companies to lower the overall cost of development, manufacturing, test and field service. Some companies call it "Concurrent Engineering" and it replaces the "Over-the-wall" method of product development. In each stage of the product life-cycle, a consideration for testing is made in the earliest stages of design. Adding boundary scan to a board does add cost and time to the design cycle due to the increased cost of boundary scan compliant components and initial time investment required to understand the boundary scan architecture and tools. However, these costs are easily justified when viewing the benefits and cost savings boundary scan provides at every stage of a product's life cycle. What was originally developed as a manufacturing test tool offers benefits before, during and after manufacturing. National employs boundary scan technology to enable not just chip testing, but also board testing, system testing, and in-field service testing. ~ ;:;: :r' m o c :::J C. s:u - - - + - T " " " - - - - - - - - - - . IN T~S Boundary Scan J6~~ 0 SELECT ! -t--I Registers I TCK TEST CLOCK TOO D~M : 0 o-t===-_________ ~-_+_-_'_---...J TLIF/11587-9 FIGURE 5. 1149.1 Device Hardware 1-7 http://www.national.com II C as (,) en ~ as c ::::s o "C m - .c ";: U) c o ;:; ::::s "0 en U) Q) l- I.. o c en "iii Q) C r---------------------------------------------------------------------------------------~ TCK/TMS: All devices in the chain are connected in parallel to the TCK and TMS signals. This means that all the devices' TAP controllers are in the exact same state and transition simultaneously. The instruction register allows each device to include different data registers in the scan chain and perform different scan operations. In like fashion as the chip, the boundary scan chain is extended to the board in a serial scan chain. Boards in systems can also be linked in a scan chain. When placed on a printed circuit board, each 1149.1 component is connected together to form a chain of boundary scan devices. In Figure 6, note the scan chain connections: TOI/TOO: The tester's serial test data out pin is connected to the first device's TDI. The test data is passed from the first device to the second device via the TOO pin which connects to the second device's TOI pin. This chain formation continues until the last device's TOO pin is connected back to the tester. Therefore, shifting data into a device's instruction or data registers requiies that the data passes through every JTAG device which is connected ahead of the device in the scan chain. Additionally, as the data is shifted into the device, the data previously stored in the selected instruction or data register is shifted out of the chain. The tester software either reads and evaluates the returning data or masks it out. The Bypass register is included to shorten the chain when shifting data through devices which are not participating in a given scan operation. Dala from Tesler Tesler elK ____ .. ________________ !_______ ~----------------------------- ___ 1 : ---~--------------~-----------------------. TLlF/11587-10 FIGURE 6. 1149.1 Boundary Scan Chain http://www.national.com 1-8 c Implementing boundary scan on every component on the board provides the maximum benefit in terms of reduced tester cost, test development times and concurrent engineering. However, boundary scan can also complement an ICT in testing structural faults. See Figure 7. This was fully recognized by ICT tester companies when they developed their ICT systems and most ICT's now have a connector dedicated for boundary scan testing. Additionally, these tester companies included the option of mixing boundary scan and ICT in their ATPG tools by using ICT component libraries for non-scan products and BSDL for scan products. For example, vectors can be automatically generated to drive signals with boundary scan and compare results using physical test probes. Many companies have already invested millions of dollars in ICTs and may want to use boundary scan only where required for inaccessible nodes, non-library parts, etc. or as a means of cutting ICT fixture costs. Figure 7 shows two examples of ICT and boundary scan working together. The lower of the two graphics shows cluster testing. Cluster testing is the testing of a group of devices by applying data to the inputs of the group or cluster and evaluating the results on the output of the group or cluster. Cluster testing can vary from testing the interconnects between the components in the cluster to testing the internal nodes of each component within the cluster. System Test National supports the needs of the system design architect by: en cO' ::::J .,o -I CD en en o C O· ::::J en • Acknowledging the need for live insertion on the backplane ;::;: == • Fully complying to IEEE 1149.1 (board test) o ::J' OJ • Addressing the 1149.5 standard (system test) While boundary scan diagnostics are particularly useful for telecommunications and workstations, their benefits also extend to board manufacturers that want to reduce the timeto-market of their products. For smaller companies or companies in the process of purchasing new ICT equipment, implementing boundary scan may provide a way to reduce the required ICT features like number of channels providing a tremendous reduction in the tester cost where cost ranges from $200K up to $1 M. CD For small companies, we provide the option to expensive $1 million test equipment. With help from our software and hardware partners (such as Corelis and JTAG Technologies), National can support total system test solutions with PC-based boundary scan devices, software, and hardware solutions. C ::::J a. D) - .co "'C c::: ::l o m o c::: o :;::; C- 0': (.) U) (I) c system logic, the 1149.1 user can logically extend the internal system logic to the EXT EST function. This feature is available during the EXTI;:ST instructions for these products because the state of the outputs is captured along with the state of the inputs during the rising edge of TCK in the CAPTURE-DR state. Note that this is contrary to a recommendation of capturing fixed values on the outputs during EXTEST, but it provides for a feature that would otherwise not exist. sarily in its function. The BYPASS register consists of a single shift register stage in order to shorten the board-level serial scan chain by bypassing some devices while accessing others. This feature is intended to reduce the software overhead in applying and retrieving serial test data by permitting a shortcut between TDI and TOO of any given integrated circuit in order to expedite access to others. The BYPASS register must capture a logic low value upon the rising edge of TCK in the SHIFT-DR state provided that it is selected by the current instruction. This feature is designed to accompany those devices which incorporate the 32-bit device identification register. (The BYPASS register is a test data register whose least significant bit is a fixed logic high.) Upon an initial scan of the data registers connected across the board, all devices will either connect the BYPASS register or the optional device IDENTIFICATION register in its test data register scan path between TDI and TDO while in the SHIFT-DR state. (This condition is a result of power-up or a logic low assertion to TRST to initialize each 1149.1 device on board.) By shifting the data registers the retrieval of each logic zero indicates a BYPASS register connection until the first logic high is read. The logic high will be the framing bit of a device IDENTIFICATION register which would then indicate that the following thirty-one bits are identifiers to the specific device at that location of the scan chain. The requirement that the BYPASS register capture a logic low value is intended to form the background for the device IDENTIFICATION register framing bit. Additionally, the logic low value is opposite the value to be produced in the case of an undriven TDI input pin. While these cells are sufficient to observe the logic state of the signal in which they are placed, they have a limitation in observing the activity of such a signal as in the specific case of a three-stated output. To determine the activity as well as the logic state of such an output, two such scan cells are required. One in the data signal path and another in the output enable signal path. By observing at both locations the drive activity and/or logic value can be inferred. In thecase of a single output enable signal controlling more than one output data path, the output enable signal may be observable and controllable at a single location rather than at each specific output without loss of functional intent provided that the specific location retain control over all the data outputs in unison. This provision is included to reduce the hardware overhead as in the case of a device where such output enable signals are organized byte-wide. The order of the required scan cells in the Boundary-Scan register is undefined by the 1149.1 Standard and hence can be device specific even if the system function of that device be identical to another 1149.1-compliant device. In other words, even if two identical system function devices are 1149.1-compliant there is no guarantee that such devices will be identical in the structure of the Boundary-Scan register. A description of the Boundary Scan Register for each device is included in its datasheet. Device Identification Register The device identification register is a 32-bit, read only register compliant with IEEE Std. 1149.1. When the IDCODE instruction is active, the identification register is loaded with a fixed, unique value upon leaving the Capture-DR state. The 10 code register contains information pertaining to the device manufacturer, part number and revision. It is used to ensure the correct device is properly placed in the correct location within a boundary scan chain. An identification (ID) register is included within the National SCAN ABT Test Access Logic devices. The specific ID register value is provided in the associated device datasheets. Input Boundary-Scan Register (SCAN ABT only) The Input Boundary-Scan register operates in a manner analogous to the full length Boundary-Scan register. Output Boundary-Scan register (SCAN ABT only) The Output Boundary-Scan register operates in a manner analogous to the full length Boundary-Scan register. Please refer to the device datasheet for a description of its input and output Boundary-Scan Registers. BYPASS REGISTER The BYPASS register is also a test data register and therefore must comply with the definitions surrounding test data register operation; but its advantage is in its size, not neces- http://www.national.com 2-10 Section 3 Device Description and Characteristics http://www.national.com Section 3 Contents Family Comparison Chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BiCMOS and CMOS Family Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCAN ABT Test Access Logic................ .............................. ...... ... SCAN ABT Live Insertion and Power Cycling Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . ABT Circuit and Design Architecture ....................................... . . . . . . . . . Threshold and Noise Margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dynamic System Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ABT Process Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCAN CMOS Test Access Logic..................................................... Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Noise Immunity .................................................................. Noise Characteristics ..... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Characteristics ............................................................ Circuit Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3·2 3-3 3-3 3-4 3-4 3-6 3-9 3-9 3-11 3-12 3-12 3-12 3-12 3-13 3-13 cCD < 5° /fINational Semiconductor CD c CD en (') -. iSo 0° - Device Description and Characteristics :l D) :l Co o:l" Family Comparison Chart D) Depending on system architecture and purpose, devices are selected to optimize system performance. National offers CMOS and BiCMOS SCAN families, and the comparison chart is provided to assist you with your selection criteria. Speed, power, noise drive, etc. may weight differently in importance depending on whether the end system requires computing speed, low standby power, low EMI to meet FCC regulations or must meet anyone of many bus standards. Significance BICMOS CMOS 6.5 8.5 Guaranteed Speed-tplH ns (A - . B) Faster system performance Static Power ICCl (Outputs Low) Lower quiescent supply current, less power consumption, and less cooling required 65mA 0.8mA Guaranteed Dynamic Power ICCD (mA/MHz) Lower system power consumption under heavier loading conditions 0.2 (Note 3) not specified Ground Bounce VOlP (5V, 25°C) Less data disruption, especially when switching multiple outputs at one time not specified 1.5 0.8 0.8 Dynamic Threshold (5V, 25°C) VllD Capacitance Compatible with 16-bit wide pinout CIN(pF) ESD(Note4) Lower capacitance means less bus loading, notwithstanding frequency 2.0 2.0 SSOP SSOP 5.9 4.0 13.7 20 IOl 15 64 IOH -32 -32 >2000V >2000V ClIO (pF) Output Drive (mA) Less data disruption, especially when connected to a bus VIHD Packaging Easier handling NG = Not Guaranteed; NA = Not Available; NS = Not Specified Assumptions: Device is SCAN16245T CMOS and SCAN162245A BiCMOS Note 1: VOLP is measured on '244 function. Note 2: Specified with 6 outputs switching and no load. Note 3: ICCD measured 1 bit toggling, OV to 5V, 50% duty cycle, outputs loaded with 50 pF, no resistor. Note 4: Typical values for HBM ESD. 3-3 (') CD -. (ii" (=)0 en BiCMOS and CMOS Family Comparison Criteria ~ - http://www.national.com (I) u ;:; (I) 0i: Q) u ~ ca .c o "C - Live insertion - Removal of boards without having to power down the system C This saves time and eliminates those unwelcome sparks! o - 25fl series resistors on the outputs reduce ringing (noise) and eliminate the need for an external "damping" resistor. In the past, this was used to reduce noise on CMOS or FCT products. - SCAN ABT will power up in TRI-STATE®. Beyond allowing live insertion and board removal, it enables system power partitioning by electronically switching them offline to save on power. This is particularly beneficial in remote locations that experience power shortages. - SCAN ABT has reduced power during power-up and power-down TRI-STATE. This reduces the loading on the bus to which it is attached, taking less time to charge up all of the capacitance on the circuit using SCAN ABT, and allowing the bus to run faster. ca c ;:; Co 0i: SCAN ABT is intended to serve in live insertion backplane applications. It provides 2nd Levellsolation 1 which indicates that while external circuitry to control the output enable pin is unnecessary, there may be a need to implement differentiallength backplane connector pins for Vee and GND. As well, pre-bias circuitry for backplane pins may be necessary to avoid capacitive loading effects during live insertion. Here are other SCAN ABT features: U (I) Q) c SCAN ABT Live Insertion and Power Cycling Characteristics SCAN ABT Test Access Logic When these functions are added to the card edge going into the backplane, users gain these benefits: Q) u oS; Q) C SCAN ABT provides control of output enable pins during power cycling via the circuit in Figure 1. It essentially controls the G n pin until Vee reaches a known level. During power-up, when Vee ramps through the O.OV to O.7V range, all internal device circuitry is inactive, leaving output and I/O pins of the device in high impedance. From approximately O.8V to 1.8V Vee, the Power-an-Reset circuitry, (PaR), in Figure 1 becomes active and maintains device high impedance mode. The paR does this by providing a low from its output that resets the flip-flop The output, Q, of the flip-flop then goes high and disables the NOR gate from an incidental low input on the G n pin. After 1.8V Vee, the paR circuitry becomes inactive and ceases to control the flip-flop. To bring the device out of high impedance, the G n input must receive an inactive-to-active transition, a high-tolow transition on G n in this case to change the state of the flip-flop. With a low on the Q output of the flip-flop, the NOR gate is free to allow propagation of a G n signal. For more information on power-up and power-down characteristics refer to Application Note AN-881, "Design Considerations for Fault Tolerant Backplanes, "found in Section 7. TO INTERNAL TRI-STATE CIRCUITRY elK QI----.... RESET POWER ON RESET TLIF/12133-2 FIGURE 1 1Section 7, Design Considerations for Fault Tolerant Backplanes, Application Note AN-881. http://www.national.com 3-4 cCD < (=)' SCAN ABT Live Insertion and Power Cycling Characteristics (Continued) During power-down, the Power-an-Reset circuitry will become active and reset the flip-flop at approximately 1.BV Vee. Again, the Q output of the flip-flop returns to a high and disables the NOR gate from inputs from the Gn pin. The device will then remain in high impedance for the remaining ramp down from 1.BV to O.OV Vee. CD C Some suggestions to help the designer with live insertion issues: CD • The Gn pin can float during power-up until the Power-OnReset circuitry becomes inactive. -C' 0' • The Gn pin can float on power-down only after the Power-an-Reset has become active. The description of the functionality of the Power-an-Reset circuitry can best be described in the diagram of Figure 2. en (") -. :::s D) :::s Co o ::r D) Dl (") CD -. - I I I I I I I I POWER-ON RESET CIRCUIT OFF :-.. DEVICE IN HIGH ~ IMPEDANCE MODE VCC (V) iii' (=)' en I I I I I I I ALL CIRCUIT _ _-=--t:l'I~ ELEMENTS INACTIVE RAMP-UP AND RAMP-DOWN TIME POWER DOWN CYCLE POWER UP CYCLE TL/F/12133-3 FIGURE 2. SCAN ABT Includes Additional Power-On Reset Circuitry Not Otherwise Included in ABT Devices 3-5 http://www.national.com ~ u :;:; ~ - "i: CD u f! CO .c o "'C C co c o :;:; C. "i: U ~ CI) c CD u ":; CD C r---------------------------------------------------------------------------~ ABT Circuit and Design Architecture SCAN ABT performs as ABT devices, except as where noted. The circuitry for an ABT non-inverting Buffer with TRISTATE control logic is shown in Figure 3. Robust bipolar components form the dual rail ESO protection networks for both input and output structures. The 06 and 06 ESO circuits provide protection to the Vee rail and have a high enough breakdown voltage rating to remain high impedance (12Z < 100 /LA) during powered-down applications. The Schottky transistors 05, 07 and 08 provide protection to the Ground rail and double functionally as highly conductive undershoot clamps. The TRI-STATE output structure is formed with Bipolar components to produce high drive (IOL = 64 mA; IOH = -32 mAl and high speed TTL compatible logic swings. The pull-up stage utilizes cascaded emitter followers 03 and 04 to provide high source current drive for the charging of capacitive loads. The no-load TTL compatible VOH level is one forward-biased VBE (03) drop and one forward-biased VFD Schottky diode (04) drop below the Vee rail yielding typical 3.SV VOH at 5V Vee, 25°C and 10 /LA source current. The ON source impedance of this pull-up stage is typically less than 10n for source currents between -5 mA to -40 mA at 25°C. This initial low impedance turn-on characteristic allows the pull-up stage to easily provide a VOH level of 2V minimum at IOH source current of -32 mA over the operating Vee and temperature ranges. At 25°C and source currents above - 50 mA, the pull-up stage becomes limited by voltage drop across the Rlos resistor and the effective source impedance becomes 25n typically. Schottky diodes 03, 04 and 05 also provide blocking to insure that the pull-up stage remains high impedance during power down applications. When the output is enabled by a logic low on the OE input and a logic high is on the Data input, the base of 03 is driven to the Vee rail by the CMOS inverter in the data path. The open drain CMOS NAND gate is logic high-open (nonconducting) and allows the base of 04 to be driven ON by 03. The CMOS NOR gate goes low turning 01 OFF and turning ON the CMOS AC/OC Miller Killer circuitry which grounds the base of 02, quickly turning it OFF. This circuitry provides an active shunt for any charge coupled by the Miller Effect of the 02 collector-base capacitance during the low to high output transition. Use of this active circuitry improves output rise time and serves to reduce simultaneous conduction of pull-up and pull-down stages during LH transitions. The AC/OC Miller Killer circuit is also active when the output goes to TRI-STATE to prevent 02 base injection by the LH transitions of other outputs on a bus, therefore dynamic bus loading will be capacitive only. Power Down Miller Killer circuitry at the base of 02 is inactive when Vee is applied. When Vee is powered down, the Power Down Miller Killer circuitry provides an active shunt to transient energy coupled to the 02 base by its collector base capacitance. This prevents momentary turn-on of 02 during LH transitions in partial power down bus applications and maintains the powered off output as only a Hi-Z light capacitive load (Izz < 100 /LA) to the bus. Note that 01 drives only the 02 pull-down stage and does not function as the Phase Splitter driver typical of TTL logic. The pull-up stage is controlled by CMOS logic independent of 01. This feature allows the input threshold voltages for the CMOS logic driving the pull-up stage to be set independent of the logic driving the pull-down stage. Blocking Sub 1-micron CMOS logic for very low power and fast delays r""'----------------------------..".....O::::::::'-.., High impedance CMOS inputs, BiPolar ESO Structures ABT TRI-STATE Buffer Schematic diodes high for impedance during power-off Proven BiPolar Output Stage for high drive, smooth edges ·open drain TlIF/12133-1 FIGURE 3. Basic ABT TRI-STATE Buffer Schematic http://www.national.com 3-6 c(1) < ABT Circuit and Design Architecture (Continued) n' (1) The transfer function for the non-inverting ABT Buffer shown in Figure 4 indicates that the data input switching threshold for the pull-down stage is approximately 200 mV lower than the pull-up stage. As the Data input is swept from logic LOW to logic HIGH, the output switches from active LOW to high impedance at an input threshold of about 1.3V at 25·C and a Vee of 5.0V. When the input reaches about 1.5V, the output switches from high impedance to HIGH. This design feature serves to reduce simultaneous conduction of the stages during switching. Also, the 200 mV offset in Data input switching thresholds acts like hysteresis and causes the buffer to be very tolerant of slow data input edge rates, i.e., edge rates slower than 10 nslV can easily be tolerated without output oscillation. The switching threshold is proportional to Vee as indicated in Figure 5 and is quite stable as a function of temperature as indicated by Figure 6. c(1) 5.0 en Vee = 5.0 VDe r NO LOAD -4.0 I. r => 3.0 o::r Q) .., Q) (') a.. ..... => 0 (1) .., I ( 1.4 1.6 INPUT VOLTAGE, VIN VOL" '\. L 1.4 1.6 INPUT VOLTAGE, VIN 2.0 1.8 TL/F/12133-4 FIGURE 4, Buffer Transfer Function @ Room Temperature Vee = 5V, T A = 25·C, No Load 1.8 400 "< -5 2.0 _6 300 -4.0 f0- If r r i Vee =5.50V r u -- I ~ o > 25 200 vee =-4.50V ..... 150 ::::> 100 ~ o 50 ..... ~ 2.0 ::> I ~ -""'iL 25°C Ir , J.'/ II 0.4 f0- -+85°C 0 ~ g III V AI / Vee = 5.0 VDC 350 ....: TA = 25 0 e r NO LOAD Vee =5.0"'1. o I With the output enabled by a LOW on the OE input, a LOW on the Data input forces active LOWS on both the CMOS inverter and the open drain CMOS NAND gate outputs, which then simultaneously turn OFF 03 and 04. The CMOS NOR gate output goes HIGH, turning the AC/DC Miller Killer circuitry OFF and 01 ON to drive 02 ON. 02 is designed to easily sink 64 mA IOL' at VOL < O.55V. During HL output transitions, Schottky diode 01 assists the pull-down stage in providing a low impedance discharge path for the output load capacitance. As the stage turns on, part of the charge on the output load passes through 01 and 01 to momentarily increase the base drive to Q2 and increase 02's current sink capability. See output characteristics in Figure 7, IOL vs VOL· 1.0 3.0 I FIGURE 6, Transfer Function vs Temperature Vee = 5V DC, No Load r '" - en' n ' en 1.0 .rVOH r t:: a. TL/F/12133-6 Vee = 5.0V rTA = 25 0 e NO LOAD 5. 0 Q) ::::J ..... 2.0 => 1.2 1.2 ::::J =-40 o e ~> 5.0 -4.0 - is' 0' "'- f-TA =25°e ~ TA >0 .... C> .., (') JI TA =+85 o e 0.8 II / 'l If/ j / "- -40°C 1.2 1.6 2.0 2.4 2.8 OUTPUT LOW VOLTAGE, VOL (V) 1.0 TL/F/12133-7 FIGURE 7, Output Low Characteristics Vee = 5VDC r I 1.2 1.-4 1.6 INPUT VOLTAGE, VIN I 1.8 2.0 TLlF/12133-5 FIGURE 5, Transfer Function vs Vee T A = 25·C, No Load 3-7 http://www.national.com fI) u = ".:::; fI) Q) ABT Circuit and Design Architecture (Continued) u ~ ABT is designed to be tolerant of controlled live insertion at the PCB level. Controlled means that the insertion or removal methodology is accomplished in such a way that power to the PCB is applied in a preferred sequence and that control signals are provided to the PCB also in the preferred sequence such that output control is asserted to prevent contention of outputs attached to a bus during the power up or down sequence. Yee =5.0 YDe a:s .c o "'C C ca c o = c. ".:::; (,) fI) Q) c Q) (,) "S; 1. -401----J----J_---,H.,hl.---t_---l :I: _0 .... ~ -80 Tolerant means that ABT is designed and guaranteed to behave in a predictable manner during controlled PCB live insertion in systems requiring fault-tolerant or noninterruptable applications. Additionally, ABT has features which facilitate design of systems which must utilize power partitioning for redundant circuitry or for powering saving of inactive circuits. :z: '-" ;;: -1201----J--7~-J_---+---t_--_I .... ....0.. ~ ~ o Q) c 1.0 2.0 3.0 4.0 All ABT input, output, and I/O pins are protected with robust Bipolar components with respect to both Vee and Ground rails. This circuitry is designed to withstand 2000V (Human Body Model) and also to provide clamping action for voltage undershoot while preserving low capacitive loading of the pin. The clamping action by the undershoot clamp begins aggressively at voltages more negative than - 0.5V relative to Ground, but this clamp remains non-conductive at voltages up to 7V. Relative to the Vee rail, the ESO circuitry begins clamping only at voltages greater than 5.5V above Vee. These ESO circuits remain high impedance and non-conductive for applied input or output voltages between -O.4V to 5.5V with Vee = OV to 5.5V. 5.0 OUTPUT HIGH VOLTAGE. YOH TL/F/12133-8 FIGURE 8" Output High Characteristics Vee = 5VDC When the output is disabled by a HIGH on the OE input, the enable CMOS logic quickly overrides the Data path logic and cuts off drive to whichever stage is ON. In the case of an LZ transition, the CMOS NOR gate is driven LOW turning OFF 01 and turning ON the AC/OC Miller Killer circuitry to insure 02 is quickly turned off. In the case of a HZ transition, the CMOS inverter goes hard LOW to turn off 03 and quickly discharge the base of 04 through Schottky diodes 07 and 08. The effect of disable time (tpLZ, tpHZ) being typically faster than enable time (tpZL' tpZH) inherently helps avoid bus contention. ABT CMOS input stages are Hi-Z with or without Vee applied. The IlL, IIH, and IBVI datasheet specification guarantees high DC impedance for inputs with Vee applied. The VIO specification guarantees Hi-Z inputs with Vee = OV. High impedance output and I/O pins are capable of maintaining Hi-Z status with Vee = 0 and during the application or removal of Vee. The ABT data sheet parameters IOZH and IOZl guarantee < 50 p,A output leakage for applied VOUT voltages of 2.7V or 0.5V at any Vee between 5.5V and OV with the output disabled and with the appropriate logic input voltage maintained on the OE input pin. An additional Izz bus drainage specification guarantees < 100 p,A output leakage at VOUT = 5.5V with Vee = OV. Therefore, ABT outputs are guaranteed to remain glitch-free during the power cycle and at power down Vee = OV. Refer to Application Section for a more detailed discussion of live insertion and powerup/down TRI-STATE capabilities of ABT. Since the CMOS Enable logic remains active to Vee's well below 2V, high impedance control can be maintained to Vee voltages below the turn-on Vee thresholds of the Bipolar output stage. This insures the capability for glitch free power ON/OFF high impedance outputs with the provision that the OE input is maintained logic HIGH at or greater than the data sheet specified 2.0V minimum VIH during the Vee power ramp. However, since the CMOS logic switching threshold varies proportional to Vee, a practical worst case OE logic high of 2.0V or 50% of Vee, will maintain the power ON/OFF TRI-STATE condition during the Vee transition. http://www.national.com 3-8 Total power consumption under AC conditions comes from three sources; quiescent power, internal dynamic power, and output dynamic power. Threshold and Noise Margin Figure 9 describes the input signal voltage levels for use with ABT products. The AC testing input levels follow industry convention which require O.OV for a logic LOW and 3.0V level for a logic HIGH. DC input levels are typically O.OV to Vll, and high input levels are typically VIH to VCC. DC testing uses a combination of threshold and hard levels to assure datasheet guarantees. Input threshold levels are usually guaranteed through VOL and VOH tests. In other words: PTOTAl = POO Where: POINT + POOUT POO = Quiescent Power Dissipation = Internal Dynamic Power Dissipation - POOUT = Output Power Dissipation Co First the Quiescent power can be derived from the following equation. [IC~l. NOOl • vcc] + (1) c(1) ... POINT POO = 5" en () -Co 0" :::s 0) :::s = Total Power Dissipation PTOTAl High level noise immunity is the difference between VOH and VIH and low level noise immunity is the difference between Vil and VOL. Noise-free VIH or Vil levels should not induce a switch on the appropriate output of an ABT device. When testing in an automated environment, extreme caution should be taken to ensure that input levels plus noise do not go into the transition region. + c(1) < [DICC· NOIH • Vcc] + o:::s- ... ... Cir O) -n" 0) () (1) [lc~H • NOOH • Vcc] Dynamic System Power Dissipation en Where: One of several advantages to using BiCMOS logic is its low power when compared to bipolar technologies. As well, it has reduced dynamic output power because of the reduced output swing in comparison to CMOS devices. In the static or quiescent high state, SCAN ABT will consume power like a pure CMOS device, and in the quiescent low state all power goes to driving the bipolar output pull-down transistor. POO = Quiescent Power Dissipation ICCH = Quiescent Power Supply Current with All Out- ICCl = Quiescent Power Supply Current with All Out- puts High puts Low NOOl = Number of Quiescent Outputs Low NOOH = Number of Quiescent Outputs High NOIH = Number of Quiescent Inputs High N = Number of Active Outputs Dice = Power Supply Current for Input with VIN other than Vcc DC AC • LOGIC (1) INPUT RANGE ....-'V'I o > --------]-- 2.5 __ LOGIC (1) NOISE f.lARGIN D 1 0.8 __ LOGIC (0) NOISE 0.4 __ T:N~ITlON REGION f.I~R~ ] - LOGIC TofiNPuTRANGE o TLlF/12133-9 FIGURE9 3-9 http://www.national.com U) (.) ;:: U) -e 'i: G) () m .c o "C c::: m c::: o Dynamic System Power Dissipation (Continued) ICCl ] [ (N*NS*DL)*Vcc + [(Icco*f*NS)*Vccl C. 'i: c G) (.) 'S: G) c 1. Vcc = 5V 2. The data and control inputs are being driven with OV and 3.4V voltages for logic levels. 3. Data input frequency = 16 MHz @ 50% duty cycle. 4. Cl = 50 pF 5. There are no DC loads on the outputs, Le., outputs are either unterminated or terminated with an AC shunt termination. 6. Since the output high voltage is produced by a Darlington transistor pair, the output voltage swing will be assumed to be Vcc - 1.6V or 5.0 - 1.6V = 3.4V. Therefore VS = 3.4V with Vcc = 5.0V. For quiescent current, all data inputs and outputs are switching leaving only the 2 OE inputs static low. POINT = [(Dlcc*DH*NS)*Voo] + ;:: () U) G) Assumptions: Secondly, a SCAN ABT device will dissipate power internally by charging and discharging internal capacitiance. The following equation takes into account the duty cycle of inputs and outputs and current due to the internal switching of capacitances. Where: POINT = Internal Dynamic Power Dissipation Vcc = Power Supply Voltage Dlcc = Power Supply Current for Input with VIN other than Vcc (For example, a typical TTL input voltage is considered to be 3.4V) Note: The farther away an input (VIN) is from threshold (1.5V), the less power supply current the Ie will consume. N DH DL ICCl lcCl ] Poa = [ N*NaOl *Vcc + [Dl cc*NaIH*Vcc1 + = = = = Number of Active Outputs Duty Cycle for Switching Inputs High Duty Cycle for Switching Outputs Low Data book specification for power supply current with all outputs low Icco = Power consumption coefficient (rnA/MHz) for 1-bit toggling = Frequency of Outputs NS = Number of Outputs Switching Finally, at high frequencies a significant amount of current is consumed by a device to drive its output load. SCAN ABT has an advantage here because of its reduced output swing compared to CMOS devices. For a simple case, if we assume only capacitive components to the load, we can use the following equation. [IC~H*NaOH*Vcc ] =0+0+0=0 Internal Dynamic Current ICCl POINT = [(Dlcc*NS*DH)*Voo] + [(N*NS*DL)*Vcc1 + [(lcco*f*NS)*Vcc1 POINT = [(2.5e-3*18*0.5)*5.0] = 5.60 + 1.66 + 144 = 151.3 mW Finally the Output Current POUT = [Cl * VS * f] * Vcc POUT = [50.e-12*3.4V*16e6] * 5.0 = [2.72e-3]*5 = 13.5 mW Where: Output Power Dissipation Load Capacitance Output Voltage Swing Output Operating Frequency Power Supply Voltage PTOTAl = Poa + POINT + POOUT = 0 + 151.3 mW + 13.5 mW PTOTAl = 164.8 mW Take for an example a SCAN182244A with all 18 outputs switching at 16 MHz. How much power would be consumed by the IC in this case? http://www.national.com 30e-3 [(----;s-*8*0.5)*5.0] + [(0.1*16*18)*5.0] POUT = [Cl * VS * f] * Vcc POOUT = = Cl = VS = f = Vcc + 3-10 c CD < ABT Process Characteristics C:;' PROCESS CHARACTERISTICS CD PROCESS FLOW National's 1.0 jJ.m BCT process combines bipolar and CMOS transistors in a single process to achieve high speed, high drive characteristics while maintaining low tri-state power and the ability to control noise. National's 1.0 jJ.m BCT process provides a suitable platform for migration to higher performance levels with minor technology enhancements planned for the near future. In its present form, the technology supports Interface, Digital, Bus and Telecom products from National Semiconductor. 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 PROCESS FEATURES • 18 masking layers using stepper lithography • 100% ion implantation utilized for dopant placement • Localized retrograde wells tailored for high performance • Optimized recessed and field isolation sequence for CMOS/bipolar • NMOS LDD (Lightly Doped Drain), PMOS Halo architecture • 150A gate oxide • Self aligned bipolar contact set utilizing minimum geometries C Buried Layer P-Well N-Well Isolation Sink Active Active Strip Poly Base Bipolar Contact Emitter P+ Source/Drain N+ Source/Drain Contact Metal 1 Via Metal 2 Passivation CD en (') ... - -6' 0' m ::J c. ::J o ::T m DJ n ... CD en' C:;. en PROCESS PARAMETERS • Bipolar Performance: 10 GHz Ft with gains greater than 100 • Localized retrograde sub-emitter collector • Advanced planarization on all topographies • CMOS Performance: 0.5 jJ.m min Left • PtSi Schottky diodes, all contacts use platinum for resistance reduction • Platinum Schottky diodes for TTL • Typical ESD Performance: Method • Barrier metal of TiW • Dual layer metal of AI-Cu 0.3% for long term reliability > 2000V, Human Body • Robust latch-up and punch-through protection with retrograde wells • Metal pitch of 3.5 microns • Advanced interconnect supports superior temperature cycle performance ISOLATION OX CHANNEL STOP N-WELL P-WELL CHANNEL STOP ~ BIPOLAR __--------J ~--------~v ~--------~v---------~ PMOS NMOS TL/F/12133-10 FIGURE 10. 1.0 jJ.m BCT Process Cross SectIon 3-11 http://www.national.com (I) u :;::: (I) -... "i: CD U m m .c o "ccca o :;::: a. "i: u (I) CD C CD U "S; CD C 3. Terminate all inputs and outputs to ensure proper loading of the outputs and that the input levels are at the correct voltage. SCAN CMOS Test Access Logic SCAN CMOS features low power consumption. Products are used in board test by surrounding clusters of nonboundary scan devices to create a fully 1149.1 compliant board. SCAN CMOS provides adequate drive and buffering for microprocessors, too. For more information on Advanced CMOS devices, refer to the FACT Databook. 4. Set VOO to 5.0V. 5. Set the word generator to toggle all but one output at a frequency of 1 MHz. Greater frequencies will increase DUT heating and affect the results of the measurement. 6. Set the word generator input levels at OV LOW and 3V HIGH. Verify levels with a digital volt meter. SCAN CMOS logic is manufactured on a 1.3 Ilm process and offers a good combination of high speed, low power dissipation, high noise immunity, wide fanout capability and high reliability. VOLP/VOLV and VOHPIVOHV: • Determine the quiet output pin that demonstrates the greatest noise levels. The worst case pin will usually be the furthest from the ground pin. Monitor the output voltages using a 50n coaxial cable plugged into a standard 5MB type connector on the test fixture. Do not use an active FET probe. Characteristics Meets or Exceeds JEDEC Standards for 74ACXX Family High - Performance Outputs Common Output Structure Output Sink/Source Current of -24/48 rnA Transmission Line Driving 50n (Commercial)175n (Military) Guaranteed Temperature Range - Commercial - Military ACTIVE OUTPUTS J ______ X,.--J • OH V • '-----VOL QUIET OUTPUT -40°C to + 85°C - 55°C to + 125°C UNDER TEST Improved ESD Protection Network ~~~ ~~~ ~ ~ ~ ~~ ===: ~~~P .-----------------.~~ High Current Latch-Up Immunity TL/F/12133-11 FIGURE 11" Quiet Output Noise Voltage Waveforms Patented Noise Suppression Circuitry Note A: VOHV and VOLP are measured with respect to ground reference. Noise Immunity Note B: Input pulses have the following characteristics: f 3 ns, tf = 3 ns, skew < 150 ps. The DC noise immunity of a logic family is also an important equipment cost factor in terms of decoupling components, power supply dynamic resistance and regulation as well as layout rules for PC boards and signal cables. 1 MHz, tr = • Measure VOlP and VOlV on the quiet output LOW during the HL transition. Measure VOHP and VOHV on the quiet output HIGH during the LH transition. The input threshold of a device and the output voltage, IVIL - voLl/iVlH - vOHI at 4.5V Voo, for SCAN CMOS is 1.25V/1.25V. • Verify that the GND reference recorded on the oscilloscope has not drifted to ensure the accuracy and repeatability of the measurements. Noise Characteristics VllO and VIHO: • Monitor one of the switching outputs using a 50n coaxial cable plugged into a standard 5MB type connector on the test fixture. Do not use an active FET probe. The setup of a noise characteristics measurement is critical to the accuracy and repeatability of the tests. The following is a brief description of the setup used to measure the noise characteristics of SCAN CMOS. • First increase the input LOW voltage level, VIL, until the output begins to oscillate. Oscillation is defined as noise on the output LOW level that exceeds VIL limits, or on output HIGH levels that exceed VIH limits. The input LOW voltage level at which oscillation occurs is defined as VILO. • Next decrease the input HIGH voltage level on the word generator, VIH until the output begins to oscillate. Oscillation is defined as noise on the output LOW level that exceeds VIL limits, or on output HIGH levels that exceed VIH limits. The input HIGH voltage level at which oscillation occurs is defined as VIHO. Equipment: Hewlett Packard Model 8180A Word Generator PC-163A Test Fixture or Equivalent Tektronics Model 7854 Oscilloscope or Equivalent Procedure: 1. Verify Test Fixture Loading: Standard Load 50 pF, 500n. 2. Deskew the word generator so that no two channels have greater than 150 ps skew between them. This requires that the oscilloscope be deskewed first. Swap out the channels that have more than 150 ps of skew until all channels being used are within 150 ps. It is important to deskew the word generator channels before testing. This will ensure that the outputs switch simultaneously. http://www.national.com = • Verify that the GND reference recorded on the oscilloscope has not drifted to ensure the accuracy and repeatability of the measurements. 3-12 cCD Noise Characteristics (Continued) < c;" CD C CD en (') DUT HP8180A WORD GENERATOR - -a"" TEK 7854 Oscilloscope Inputs 0 0" :l son D) :l C. o 450n :l" 50 pF GND is supplied via a copper plane '1' ~ \! L D) Probes are grounded as close to DUT pins as possible. OJ (') Load capacitors are placed as close to DUT as possible. CD TLlF/12133-12 FIGURE 12" Simultaneous Switching Test Circuit "" iii" c;" (I) Secondly, a SCAN CMOS device will dissipate power dynamically by charging and discharging internal capacitance. This can be calculated by using the following formula: Output Characteristics All SCAN CMOS outputs are buffered to ensure consistent output voltage and current specifications. Two clamp diodes are internally connected to the output pin to suppress voltage overshoot and undershoot in noisy system applications which can result from impedance mismatching. The balanced output design allows for controlled edge rates and equal rise and fall times. Eq.2. POINT = [(lOOT· DH • NT) • VOO] + [ (CpO • Vs • f) .VOO] POINT = Internal Dynamic Power Dissipation lOOT = Power Supply Current for a TTL HIGH Input (VIN = 3.4V) DH = Duty Cycle for TTL Inputs HIGH NT = Number of TTL Inputs at DH VOO = Power Supply Voltage Cpo = Device Power Dissipation Capacitance Vs = Output Voltage Swing f = Internal Frequency of Operation All SCAN CMOS devices are guaranteed to source 48 rnA and sink - 24 rnA. Commercial devices are capable of driving 50n transmission lines. Circuit Characteristics POWER DISSIPATION One advantage to using CMOS logic is its extremely low power consumption. But DC power consumption is not the whole picture. Any circuit will have AC power consumption, whether it is built with CMOS or bipolar technologies. CPO values are specified for each device and are measured per JEDEC standards as described in this section. On device data sheets, Cpo is a typical value and is given either for the package or for the individual stages with the device. Vs and Voo are the same value and can be replaced by V002 in the formula. Total power dissipation of SCAN CMOS device under AC conditions is a function of three basic sources, quiescent power, internal dynamic power, and output dynamic power dissipation. Thirdly, a SCAN CMOS device will dissipate power dynamically by charging and discharging any load capacitance. This can be calculated by using the following formula: Firstly, a SCAN CMOS device will dissipate power in the quiescent or static condition. This can be calculated by using the formula: (Note: In many datasheets 100, ~Ioo, lOOT, and Voo are referred to as Icc, ~Icc, ICCT' and Vcc, respectively. There are no differences.) Eq. 1 PDQ = PDQ 100 VOO Eq. 3 100 • VOO = Quiescent Power Dissipation = Quiescent Power Supply Current Drain = Power Supply Voltage 3-13 PDOUT = PDOUT CL Vs f Voo (CL • Vs • f) • Voo Output Power Dissipation Load Capacitance Output Voltage Swing Output Operating Frequency = Power Supply Voltage = = = = http://www.national.com II o ~---------------------------------------------------------------------------------------, Co) ;; o "i: Circuit Characteristics (Continued) -e In many cases the output frequency is the same as the internal operation frequency. Also Vs is similar to VOO and can be replaced by V002. The 100 calculations are as follows: 100 Total = o The total device power dissipation is the sum of the quiescent power and all of the dynamic power dissipation. This is best described as: Input 100 = (lOOT) CD Co) ca .c "C C ca C o ;; a. "i: Co) o CD C CD Co) "S; CD C PDTOTAL = PDQ + PDOYNAMIC or P~OTAL = PDQ + POINT + PDOUT The following is an exercise in calculating total dynamic 100 for SCAN CMOS. The device used as an example is the SCAN18245T. Static 100, lOOT and CPO numbers can be found in the datasheet. 100 numbers used will be worstcase commercial guarantees. Room temperature power will be less. These are approximate worst-case calculations. Eq.4 x (number of TTL inputs) Cycle) = (2 x 10- 3 ) x (1) x (0.50) = + Output x (Duty 1.0 mA per input being toggled at TTL levels Internal 100 = (VSWING) x (CPO) x (CP freq) = (5.0) x (41 x 10- 12) x (16 x 10+ 6) = 3.28 per mA per input being toggled by CP Output 100 = (VSWING X (CO CL = 50 pF = (5.0) x (50 The following assumptions have been made: = 1. 100 will be calculated per input/output (as per JEDEC Cpo calculations). The total for the SCAN18245T will be the calculated 100 x 18. 2. Worst case conditions and JEDEC would require that the data is being toggled at the clock frequency in order to change the outputs at the maximum rate (% CP). x (Q freq) x 10- 12) x (8 x 10+ 6) 2 mA per output toggled at % CP Adding Input, Internal and Output 100 together and multiplying by 18 1/0 per SCAN18245T, the approximate worstcase 100 calculations are as follows: CL = 50 pF 100 total = 100.48 mA or 502.4 mW· at a CP of 16 MHz ("Power is obtained by multiplying 100 by Voo) 3. The data and clock input signals are derived from TTL level drivers (OV to 3.0V swing) at 50% duty cycle. 4. The clock frequency is 16 MHz. 5. 100 will be calculated for CL = 50 pF. 6. VOO = 5V. 7. Total POWER dissipation can be obtained by multiplying total 100 by Voo (5.0V). 8. Quiescent 100 will be neglected in the total 100 calculation because it is 1000 times less than dynamic 100. 9. There is no DC load on the outputs, i.e. outputs are either unterminated or terminated with series or AC shunt termination. http://www.national.com Input 100 + Internal Switching 100 Switching (AC load) 100 3-14 Section 4 Loading Specifications, Waveforms, Quality and Reliability htto:/Iwww.naiional.r.nm Section 4 Contents Definition of Terms ................................................................. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Loading and Waveforms ......................................................... Waveforms-Normal Operation ...................................................... Waveforms-Scan Test Operation......................... ........................... Quiet Output Noise ...................................... . . . . . . . . . . . . . . . . . . . . . . . . . . . Skew Definitions and Examples ........................... . . . . . . . . . . . . . . . . . . . . . . . . . . . Definition of Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Characterization and Test Specifications .............................................. Philosophy ........................................... . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Dynamic (Noise) Characteristics..................... ........................... DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power.......................................................................... Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality Information and Communication (QUIC) System.... ........................... Wafer Level Reliability (WLR) ........................... . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrostatic Discharge Sensitivity (ESD) ............................................ Power Sensitivities for Minimum Geometry Products .................................. Latchup Testing....... ................................ ........................... 4-2 4-3 4-3 4-4 4-4 4-5 4-6 4-6 4-7 4-8 4-9 4-9 4-9 4-9 4-9 4-9 4-1 0 4-10 4-10 4-1 0 4-11 4-11 4-12 4-14 4-14 (fINational Semiconductor Loading Specifications, Waveforms, Quality and Reliability Definition of Terms DC Characteristics 10ZH Currents: Positive current is defined as conventional current flow into a device. Negative current is defined as current flow out of a device. All current limits are specified as absolute values. Voltages: All voltages are referenced to the ground pin. All voltage limits are specified as absolute values. ISVI Input HIGH Current (Breakdown Test). The current flowing into an input when a specified Absolute MAX HIGH voltage is applied to that inD'It. ISVIT 1/0 Pin HIGH Current (Breakdown Te~ The current flowing into a disabled (output is high impedance) 1/0 pin when a specified Absolute MAX HIGH voltage is applied to that 1/0 pin. ICEX Output HIGH Leakage Current. The current flowing into a HIGH output due to the application of a specified HIGH voltage to that output. ICCH The current flowing into the Vce supply terminal when the outputs are in the HIGH state. ICCl The current flowing into the Vce supply terminal when the outputs are in the LOW state. ICCT Iccz III IIH 10H 10l los 10Zl Izz Vcc VCD VID VIH VIHD Vil Additional Icc due to TIL HIGH levels forced on CMOS inputs. The current flowing into the Vcc supply terminal when the outputs are disabled (high impedance). Input LOW Current. The current flowing out of an input when a specified LOW voltage is applied to that input. Input HIGH Current. The current flowing into an input when a specified HIGH voltage is applied to that input. Output HIGH Current. The current flowing out of an output which is in the HIGH state. Output LOW Current. The current flowing into an output which is in the LOW state. Output Short Circuit Current. The current flowing out of an output in the HIGH state when that output is shorted to ground (or other specified potential). Output OFF current (LOW). The current flowing out of a disabled TRI-STATE® output when a specified LOW voltage is applied to that output. VllD VOH VOHV VOL VOlP VOlV 4-3 Output OFF current (HIGH). The current flowing into a disabled TRI-STATE output when a specified HIGH voltage is applied to that output. Bus Drainage. The current flowing into an output or 1/0 pin when a specified HIGH level is applied to the output or 1/0 pin of a power-down device. Supply Voltage. The range of power supply voltages over which the device is guaranteed to operate. Input Clamp Diode Voltage. The voltage on an input ( -) when a specified current is pulled from that input. Input Breakdown Voltage. The voltage on an input of a powered-down device when a specified current is forced into that input. Input HIGH Voltage. The minimum input voltage that is recognized as a DC HIGH-level. Dynamic Input HIGH Voltage. The minimum input voltage that is recognized as a HIGH-level during a Multiple Output Switching (MaS) operation. Input LOW Voltage. The maximum input voltage that is recognized as a DC LOW-level. Dynamic Input LOW Voltage. The maximum input voltage that is recognized as a LOW-level during Multiple Output Switching (MaS) operation. Output HIGH Voltage. The voltage at an output conditioned HIGH with a specified output load and Vcc supply voltage. Minimum (valley) voltage induced on a static HIGH high output during switching of other outputs. Output LOW Voltage. The voltage at an output conditioned LOW with a specified output load and Vcc supply voltage. Maximum (peak) voltage induced on a static LOW output during switching of other outputs. Minimum (valley) voltage induced on a static LOW output during switching of other outputs. http://www.national.com ~r-------------------------------------------------------------------------------' ~ :c AC Characteristics 1i> ft Maximum Transistor Operating Frequency-The frequency at which the gain of the transistor has dropped by three decibels. .~ a:: "C c co ~ :!:: "iii ::s o ur ...E o Q) ~ 3= ur c o :;:; CO (.) ;;:: .(3 Q) c. en C) c =cCO o -I tPZH Output Enable Time (of a TRI-STATE Output) to a HIGH Level-The time between the 1.5V levels of the input and output voltage waveforms with the TRI-STATE output changing from a high impedance (OFF) state to a HIGH level. f max Toggle Frequency/Operating Frequency-The maximum rate at which clock pulses may be applied to a sequential circuit. Above this frequency the device may cease to function. tpZL Output Enable Time (of a TRI-STATE Output) to a LOW Level-The time between the 1.5V levels of the input and output voltage waveforms with the TRI-STATE output changing from a high impedance (OFF) state to a LOW levels. tpLH Propagation Delay Time-The time between the specified reference points, normally 1.5V on the input and output voltage waveforms, with the output changing from the defined LOW level to the defined HIGH level. tree Recovery Time-The time between the 1.5V level on the trailing edge of an asynchronous input control pulse and the same level on a synchronous input (clock) pulse such that the device will respond to the synchronous input. tpHL Propagation Delay Time-The time between the specified reference points, normally 1.5V on the input and output voltage waveforms, with the output changing from the defined HIGH level to the defined LOW level. AC Loading and Waveforms tw Pulse Width-The time between 1.5V amplitude points of the leading and trailing edges of a pulse. th Hold Time-The interval immediately following the active transition of the timing pulse (usually the clock pulse) or following the transition of the control input to its latching level, during which interval the data to be recognized must be maintained at the input to ensure its continued recognition. A negative hold time indicates that the correct logic level may be released prior to the active transition of the timing pulse and still be recognized. ts Setup Time-The interval immediately preceding the active transition of the timing pulse (usually the clock pulse) or preceding the transition of the control input to its latching level, during which interval the data to be recognized must be maintained at the input to ensure its recognition. A negative setup time indicates that the correct logic level may be initiated sometime after the active transition of the timing pulse and still be recognized. For Normal Operation Figures 1 and 2 show waveforms for all propagation delay and pulse width measurements while Figures:3 and 4 show waveforms for TRI-STATE enable and disable times. The waveforms shown in Figure 5 describe setup, hold and recovery times. These diagrams define all input and output measure points used in testing devices in the Normal Operation Mode. For SCAN Test Operation, Figure 8 shows propagation delay waveforms; Figures 9 and 10, TRI-STATE enable and disable times waveforms; Figure 11 Set up, hold, and recovery time waveforms and Figure 12, Pulse Width waveform. Figure 6 shows the AC loading circuit used in characterizing and specifying propagation delays of all devices, unless otherwise specified in the data sheet of a specific device. The value of the capacitive load (Cd is variable and is defined in the AC Electrical Characteristics. The 500n resistor to ground in Figure 6 is intended to slightly load the output and limit the quiescent HIGH-state voltage to about + 3.5V. Also shown in Figure 6 is a second 500n resistor from the device output to a switch. For most measurements this switch is open; it is closed for measuring a device with open-collector outputs and for measuring one set of the Enable/Disable parameters (LOW-to-OFF and OFF-to-LOW) of a TRI-STATE output. With the switch closed, the pair of 500n resistors and the + 7.0V supply establishes a quiescent HIGH level of + 3.5V, which correlates with the HIGH level discussed in the preceding paragraph. Figures 7a and 7b describe the input pulse requirements necessary when testing circuits. tpHZ Output Disable Time (of a TRI-STATE Output) from HIGH Level-The time between the 1.5V level on the input and a voltage 0.3V below the steady state output HIGH level with the TRI-STATE output changing from the defined HIGH level to a high impedance (OFF) state. tpLZ Output Disable Time (of a TRI-STATE Output) from LOW Level-The time between the 1.5V level on the input and a voltage 0.3V above the steady state output LOW level with the TRI-STATE output changing from the defined LOW level to a high impedance (OFF) state. http://www.national.com 4-4 r- oQ) Waveforms c.. S· Normal Operation cc en DATA~g v. lN~b2:k CONTROL --~II,..-"";;--"I~--IN n ::::;; C=;. Q) DATA OUT "C CD Vmo CLOCK ___ ~ ________ ~JI'~~ . TlIF/12134-1 o· ::s gJ FIGURE 1. Waveform for Inverting and Non-Inverting Functions :E Q) OUTPUT TL/F/12134-2 FIGURE 2. Propagation Delay, Pulse Width and tree Waveforms . tp:kL c~U,TiR~i ~8 ~~Tt Vmo TL/F/12134-4 FIGURE 4. TRI-STATE Output Low Enable and Disable Times FIGURE 3. TRI-STATE Output High Enable and Disable Times 3 gJ ;:::;: VOL +O.3V VOL TL/F/12134-3 < CD o "ce!. V..;,;m;.;..i_ _ ~ ZL -... '< Q) ::s c.. :xl ~ iii· g ;:::;: '< DATA eo'T::L INPUT r-:~ OPEN ----'Sj? ~ .J ALL OTHER ~,-...;m~I_ __ £~ts,.;.; *re,; .,c_ _ __ MR OR CLEAR soon ...V~m~i_ _ _ __ TL/F/12134-5 soon Vmi = 1.5V Vmo = 1.5V FIGURE 5. Setup Time, Hold Time and Recovery Time TL/F/12134-6 ·Includes jig and probe capacitance FIGURE 6. Standard AC Test Load t - - - - - tw ----~ AMP (v) 1'----------'1 -+--- OV 1_-------,,1 --+--- AMP (v) OV ~---- tw ----~ TlIF/12134-7 FIGURE 7a. Test Input Signal Levels FIGURE 7b. Test Input Signal Requirements 4-5 http://www.national.com ~ :s Waveforms a; Scan Test Operation .!2 (Continued) a: TCK ______-'I'-~______________ "C c ca ~ 'iij TOO, Data _______________n"'V... o ______ m... ::J a TLlF/12134-8 FIGURE 8. Propagation Delay u) ...o E CD > ~ u) TOO. c o :;::: ca Co) D~: ~!~HZ ~ ~: TCKJ}£bC _0.3V ~Z~t:. I ~LZ ~ TDO.D.t. TLlF/12134-9 kv , '0.3V D VOL Tl/F/12134-10 FIGURE 9. TRI-STATE Output High Enable and Disable Times FIGURE 10. TRI·STATE Output Low Enable and Disable Times :;:: 'uCD c. en Q c =cca o ..J Tl/F/12134-11 Tl/F/12134-12 FIGURE 11. Setup Time, Hold Time and Recovery Time Vmi V mo FIGURE 12. Pulse Width = 1.5V = 1.5V ou~~~i~ ______.JX,,____________.JX:~~~~~~~ ::: QUIET OUTPUT UNDER TEST ~- - - - - - - - - - - - - - - - - - - VOlP --------------~l - - - - - - - - - - - - - - - - - - - VOlV FIGURE 13. Quiet Output Noise Voltage Waveforms Note A: VOHV and VOlP are measured with respect to ground reference. Note B: Input pulses have the following characteristics: f http://www.national.com = 1 MHz, tr = 3 ns, t, = 4-6 3 ns, skew < 150 ps. Tl/F/12134-13 Skew Definitions and Examples Minimizing output skew is a key design criteria in today's high-speed clocking schemes, and National has incorporated skew specifications into the SCAN CMOS family of devices. Example: If signal appears at out # 1 in 3 ns and in 4 ns at output # 5, the skew is 1 ns. Without skew specifications, a designer must approximate timing uncertainties. Skew specifications have been created to help clock designers define output propagation delay differences within a given device, duty cycle and device-to-device delay differences. This section provides general definitions and examples of skew. CLOCK SKEW Skew is the variation of propagation delay differences between output clock signal(s). See Figure 15. 7-lnputs HP8180A WORD GENERATOR 450n TEK 7854 Oscilloscope 50n Inputs ~50PF 50 pF ''GND is supplied via a copper plane \! Probes are grounded as close to OUT pins as possible. Load capacitors are placed 8S close to OUT 8S possible. TLlF/12134-14 FIGURE 14. Simultaneous Switching Test Circuit J\..F : : "\...J/ CLOCCIN 5~ ~: :.... SKEW DUE TO DELAY UNCERTAINTY TL/F/12134-15 FIGURE 15. Clock Output Skew SOURCES OF CLOCK SKEW Total system clock skew includes intrinsic and extrinsic skew. Intrinsic skew is defined as the differences in delays between the outputs of device(s). Extrinsic skew is defined as the differences in trace delays and loading conditions. INTRINSIC SKEW EXTRINSIC SKEW OUT SKEW DUE TO DEVICE AND TRACE/LOAD DELAYS TL/F/12134-16 FIGURE 16. Sources of Clock Skew Example: 50 MHz Clock signal distribution on a PC Board. 50 MHz signals produces 20 ns clock cycles Total system skew budget = 10% of clock cycle" = 2ns If extrinsic skew = 1 ns ~ ~ 2 ns - 1 ns Device skew (intrinsic skew) must be less than 1 nsf ~ 1 ns 'Clock Design Rule of thumb. 4-7 http://www.national.com Skew Definitions and Examples (Continued) CLOCK DUTY CYCLE • Clock Duty Cycle is a measure of the amount of time a signal is High or Low in a given clock cycle. T I i : ~; r--irLJ , , --I, Duty Cycle TLIF/12134-17 = tiT • 100% FIGURE 17. Duty Cycle Calculation Clock Signal ~ ~ CLOCK CYCLE Example: tHIGH and tLOW are each 50% of the clock cycle therefore the clock signal has a Duty Cycle of 50/50%. TLIF/12134-1B FIGURE 18. Clock Cycle Clock + • Clock skew effects the Duty Cycle of a signal. Skew Example: 50 MHz clock distribution on a PC board. TLIF/12134-19 Skew must be guaranteed less than 1 ns at 50 MHz to achieve 55/45% Duty Cycle requirements of core silicon! FIGURE 19. Clock Skew TABLE I System Frequency Skew tHIGH tLOW Duty Cycle 50MHz 50 MHz 50 MHz o ns 10 ns 12 ns 11 ns 10 ns 8 ns 9 ns 50/50% 60/40% 55/45% +0- Ideal Duty Cycle (50/50%) occurs for zero skew. 2ns 1 ns 33 MHz 2 ns 17 ns 15 ns 55/45% +0- Note that at lower frequencies, the skew budget is not as tight and skew does not effect the Duty Cycle as severely as seen at higher frequencies. Definition of Parameters tOSLH. tOSHL (Common Edge Skew) tOSHL and tOSLH are parameters which describe the delay from one driver to another on the same chip. This specification is the worst-case number of the delta between the fastest to the slowest path on the same chip. An example of where this parameter is critical is the case of the cache controller and the CPU, where both units use the same transition of the clock. In order for the CPU and the controller to be synchronized, toSLH/HL needs to be minimized. Definition Example tOSHL. tOSLH (Output Skew for High-to-Low Transitions): CLOCK INPUT tOSHL = ItPHLMAX - tPHLMINI Output Skew for Low-to-High Transitions: OUTPUT 1 tOSLH = ItPLHMAX - tpLHMINI Propagation delays are measured across the outputs of any given device. OUTPUT 2 I I ~ TLIF/12134-20 FIGURE 20. tOSLH. tOSHL http://www.national.com 4-8 rPulse Width (synchronous logic) Pulse Width testing is used to define the minimum pulse duration that a flip-flop or latch input will accept and still function properly. This test is package and test environment sensitive. Characterization and Test Specifications Philosophy During the product introduction process for National logic IC's, a new IC design will undergo a rigorous characterization to baseline its performance. This data is required to correlate with simulation models, determine product specifications, compare performance to other product, provide a feedback mechanism to the fabrication process, and for customer information. National's Logic IC characterizations are designed to get as much information as possible about the product and potential customer application performance. F-Toggle (asynchronous logic) F-Toggle is the minimum frequency at which the IC is guaranteed to function under multiple outputs switching condition with outputs operating in phase. This test is package and test environment sensitive. National's logic IC characterization methodology uses past knowledge of design performance, simulation, and process parametrics to determine what electrical parameters to characterize. Characterization samples are selected so that they have key process parametrics (e.g., Drive, Beta, Vtn, Vtp Left, etc.) which have been shown to significantly affect device electrical parameters. Data is acquired and processed using statistical analysis software. Manufacturing test limits are then set using the knowledge of variations due to fabrication, package, tester, Vee, temperature, and condition. This allows product to be shipped on demand without problems or delays. Measured parameters with 50 pF loading relate the amount that a static conditioned output will change in voltage under multiple outputs switching condition with outputs operating in phase. They are heavily influenced by the magnitude that Vee and Ground move internal to the IC. tpLH tpHL Active Propagation Delays tPZH tPZL Enable Propagation Delays This test is performed to determine what minimum edge rate can be applied to an input and have the corresponding output transition with no abnormalities such as glitches or oscillations. DC Electrical Characteristics Automated Test Equipment (ATE) DC Tests DC test data gathered show the performance of an IC to statically applied voltages and currents. Functional Shmoo The function shmoo shows the function operational window of an IC at a wide range of Vee's and temperatures. Power Up & Power Down Output Shmoo Similar to the function shmoo, the power up and power down output shmoo shows the DC operation of an output during power up and power down conditions. Multiple (Simultaneous) Output Switching Propagation Delays These tests are used to ensure compliance to the extended databook specifications and include active propagation delays, disable and enable times at 50 pF and 250 pF output loads. Transfer Characteristic (VIN/Vour) Input Traces (VIN/lIN) Output Traces (VOL/lOL, VOH/lOH) Multiple Output Switching Skew Performance data from the Multiple Output Switching propagation delay testing is analyzed to obtain information regarding output skew of an IC. Power Power-Up Icc Traces Shows how the supply current reacts to various input conditions during power up. FMAX (synchronous logic) FMAX determines the minimum frequency at which the device is guaranteed to operate for a clocked IC. This test is package and test environment sensitive. Icc vs VIN Traces Traces of lee vs VIN show how the supply current changes with input voltage. 4-9 Il.) 0' :l ~ o ..... 3 ~ o c::: e!. ;:::;: '< Il.) :l Co Input Edge Rate Disable Propagation Delays tpHZ Also included are input timing parameters ts Setup Time tH Hold Time n c;' < Dynamic threshold measures the shift of an IC's input threshold due to noise generated while under multiple outputs switching condition with outputs operating in phase. This test is package and test environment sensitive. tpLZ (1) :::;: Il.) VILO, VIHo-Dynamlc Threshold Single Output Switching propagation delays Testing includes measured propagation delays at 50 pF and 250 pF output load capacitances. en "C (1) VOLP, VOLV-Ground Bounce (Quiet Output Switching) AC Electrical Characteristics Co 5' (C ::E AC Dynamic (Noise) Characteristics The following are brief summaries of characterization tests performed. o Il.) http://www.national.com :xJ ~ iii' g ;:::;: '< ~ :c .~ "'C ICeD (DynamiC IcC> Determines the amount of current an IC will consume at frequency. >- CapaCitance Cii a: c ca :!:: ca::s o Reliability Tests - LatCh-Up ...o CI) > ca 3: uf c o :;:::: ca u ~ '(3 CI) a. UJ C) c =cca o ..J As a matter of policy, it is NSC's goal to design and manufacture product that is 100% defect-free and capable of surviving the qualification tests with zero failures. This policy is not interpreted as a directive to abandon a qualification program when failures occur or to delay new product releases until perfection has been achieved. Rather, the policy is intended to focus engineering resources on the identification and elimination of the design, process, or workmanship deficiencies that are the root causes of the failures and then to engineer a solution to correct those deficiencies. Input/Output Capacitance (CIN/COUT) uf E cess, or package, share a joint responsibility for demonstrating that the product does conform to NSC standards and to the standards and expectations of NSC's customers. Power (Continued) Testing determines if an IC is susceptible to latch-up from over-current or over-voltage stresses per MIL-STD-883 JEDEC method 17. Results from the initial qualification for the SCAN ABT Advanced Logic families are published in Self Qualification handbooks. Additional stress testing is performed regularly as a reliability monitor as part of the Fast Reaction Program and Long Term Audit Program. The Self Qualification handbook contains the data typically requested by customers as part of joint qualification programs in addition to detailed explanations of all tests performed. The Logic self qualification handbook may be obtained by contacting the Customer Response Center at 1-800-272-9959. HBM Electrostatic Discharge, Human Body Model Per MIL-STD-883C method 3015.6. Quality and Reliability Introduction Product qualification is a disciplined, team activity which focuses on demonstrating, through the acquisition and analysis of engineering data, that a device design, fab process, or package design meets or exceeds minimum standards of performance. In most cases, this involves running samples of product through a series of tests which expose the samples to operating stresses far in excess of those which would be encountered in even the most severe "real life" operating environment. These tests are called either accelerated stress tests or accelerated life tests. A properly designed qualification test sequence exposes, within a matter of days or weeks, those design, materials, or workmanship defects which would lead to device failure in the customer's application after months or even years of operation. TABLE II. Qualification Requirements for Logic Integrated Circuits Test In order to be considered a "world class" supplier of semiconductor devices, NSC designs and manufactures products which are capable of meeting the reliability expectations of its most demanding customers. While customer requirements and expectations vary on the subject of reliability requirements for devices, virtually all large users have general procurement specifications which establish failure rate goals or objectives for the suppliers of the components used in their products. Test Method Test/Stress Conditions Sample Size Each Lot Operating Life SOP-5-049-RA 1000 Hours Method 107 @TA = 125·C 77 High Temperature Storage SOP-5-049-RA 1000 Hours @150·C Method 103 45 Temperature Cycle SOP-5-049-RA 1000 Cycles - 65·C to + 150·C Method 105 77 Temperature Cycle with Preconditioning SOP-5-049-RA 1000 Cycles - 65·C to + 150·C Method 105 TemperatureHumidity-Bias SOP-5-049-RA 1000 Hours 85·C@85%RH Method 104 77 77 TemperatureHumidity-Bias with Preconditioning Method 112 Method 104 Precondition plus 100 hours 85·C to 85%RH Failure rate goals for infant mortality and long-term-failurerate-in-service have been established for all NSC product lines. These goals are published internally at the beginning of each fiscal half-year (usually June and December). The actual performance of the product against these goals is measured monthly using life test data gathered from various sources including the Fast Reaction and Long Term Audit Program. Performance is reviewed every six (6) months by Reliability and Product Group management and adjusted as necessary to reflect customer expectations, competitive data, and/or historical performance trends. Autoclave Method 101 500 hours 121·C @15 psig 45 Thermal Shock Method 106 100 Cycles - 65·C to + 150·C 22 Salt Atmosphere Method 209 25 Hours 35·C Resistance to Solvents Method 207 4 Solvents Lead Integrity Method 205 Condition as Appropriate to Package Given that product reliability is an overriding corporate objective, and that any deficiency in design, materials, procedures, or workmanship, has a potential for adversely affecting the reliability of the product, Manufacturing and Engineering organizations within NSC, its subsidiaries, and its sub-contractors, involved in introducing a new device, pro- Solderability Method 203 8 Hour Steam 5 secs @260·C 22 Solder Heat Method 204 12 secs 260·C 22 http://www.national.com 4-10 77 22 3 Each Solvent 22 Leads As device complexity increases, the testing sample size required to ensure infant mortality ppm levels in the 0-10 ppm range will quickly deplete reliability test capacity. While burn-in eliminates inferior devices, it can also substantially shorten the lifetimes of "good" devices to an unacceptable level, creating an expensive and somewhat risky procedure. New technology advances which minimize geometry, have moved our device lifetime distributions closer to our customer's expected system life. As device geometries shrink, resulting in higher current densities, electric fields, and chip temperatures, tighter fab process control and instant feedback become critical. Quality Information and Communication (QUIC) System BACKGROUND National's Quality Assurance Systems Development group (QASD) maintains a variety of data tracking systems such as: Electronic Reliability Data Management (ERDM), Failure Analysis (F/A), Burn-in Board Inventory, and a number of others. QUIC users will find a user friendly, menu-driven, real-time system that gives them a simultaneous-user environment with timely data inputs from sites around the world. QUIC is programmed to recognize each individual user of the system at the point of logging on to the mainframe, and provides an appropriate list of menu options consistent with the user's level of access requirements. THE GOAL OF WAFER-LEVEL-RELIABILITY TESTINGPROCESS RELIABILITY Wafer-level-reliability testing represents a proactive, correlation and control approach to ensuring device reliability. WLR is not meant to replace classical reliability testing. Instead it is used to supplement existing methods. National grants access to QUIC by customers that provides a sufficient level of security over the entire system, thus precluding the possibility of accidental access (or even damage) to various files. WLR testing is used to: 1. Identify shifts in On-Line Process Controls (fab monitors) which affect product reliability. HOW A CUSTOMER LINKS TO QUIC 2. Reduce process qualification cycle time. 1. Check to make sure you have the hardware components listed below. (An attached printer is desirable but not imperative.) 3. Improve process qualification success rate. 4. Assess reliability trends of production processes. IBM/PC compatible computer with at least 128k memory. 5. Quantify the reliability impact of process modifications. Hayes compatible 1200 baud modem (or 2400,4800 or 9600). WLR provides faster feedback for fab process control. The collection of WLR test data during and at the end of wafer fab processing provide a reliability baseline for each of our fab processes. Shifts in WLR test results, whether intentional (a process change or qualification) or unintentional (a process control problem), signal an increase or decrease in product reliability risk. WLR monitoring of production processes using Statistical Quality Control (SQC) techniques provides engineering with the information required to find and fix process control problems faster, and to determine the effectiveness of on-line process controls from a reliability standpoint. In this way, WLR testing is used to link on-line process controls to the traditional accelerated life testing methods. Touch tone phone. 2. Request access to QUIC by contacting your National sales representative or Customer Service Center at 1-800-272-9959, who will coordinate all activities necessary to provide access for your company and arrange training (usually handled over the telephone). 3. Identify the person who will be your company's main contact and user of the QUIC system. This person will assume responsibility for the USERID assigned to your company and will receive training on how to access and use the QUIC system. 4. National will provide a USERID, password and account number with appropriate menus and a communications software package called EXECULlNK, which allows the customer's PC to talk with NSC's host computer and also turns the PC into a virtual host terminal, with full-screen editing capability and full use of program function (PF) keys. EXECULINK also provides for file transferring between host and PC and spooling of print files to a PC-attached printer. NATIONAL'S WLR PROGRAM National developed a corporate-wide WLR program which continues to implement powerful, new test techniques. WLR testing has been used effectively to help understand how process variability affects product reliability. It is also used to help build-in reliability at the design stage for new process technologies. WLR tests and test structures have been designed to increase the likelihood and predict a rate of a reliability failure mechanism occurrence. In addition, National has developed a partnership with a leading parametric test system supplier. Working together, a WLR test system was designed and developed to meet the unique requirements of Wafer-LevelReliability testing. These systems are capable of testing to the voltage, current, and temperature extremes required for inducing the desired failure mechanisms in a short period of time. Some examples of the reliability failure mechanisms that are monitored using WLR techniques include: ONGOING IMPROVEMENTS As we receive feedback from the users of QUIC, we (QASD) will continue to enhance the "User Friendliness" of the system and add new features which, we hope, will help promote a true sense of teamwork between us and our customers. Wafer Level Reliability (WLR) BACKGROUND Interlayer Dielectric Integrity The conventional methods of reliability screening, that of short-term burn-in to eliminate infant mortalities and longterm life tests at high temperature, will soon become impractical for many devices. The reasons for this are tighter infant mortality ppm requirements, higher costs, and shortened lifetimes. Unique high voltage testing (to 1500V) is used to test for dielectric particles, metal hillocks or contamination, and poor dielectric stop coverage. Designed experiments 4-11 http://www.national.com Wafer Level Reliability (WLR) (Continued) Hot Electron Degradation Two wafer level tests are performed to indicate device susceptibility to hot electron damage. First, the maximum substrate current is measured to indicate the level of impact ionization occurring at the drain edge. Second, gate current measurements are taken to gauge the magnitude of electron injection during device operation. Long-term DC stressing of transistors at peak substrate current conditions is also monitored. Electromlgratlon A Standard Wafer Electromigration Accelerated Test (SWEAT) technique is used to measure the sensitivity of a metal line to electromigration failures. SWEAT is used as a relative test of the reliability of a line. Contact Electromlgration Risk of failures due to contact spiking and solid phase epitaxial growth (SPEG) are monitored by forcing current through specially designed test structures, and monitoring increases in resistance and substrate leakage. have been successful in correlating the high voltage WLR test results to fab process monitors (such as deposition temperature and etch selectivity), and to accelerated life test results (Op-life, Temp Cycle, and Thermal Shock). Metal Step Coverage High current testing of large area metal serpentine structures is performed to detect restrictions in the conducting stripe. Designed experiments have been successful in correlating the high current WLR test results to fab process monitors such as metal thickness, critical dimensions, and via size. Mobile Ions A 200·C hot chuck is used with custom-built high temperature probe cards to accurately measure transistor threshold voltage shifts for a variety of oxide layers. Other methods for detecting mobile ion contamination include the use of self-heated polysilicon gate test structures and Triangular Voltage Sweep (TVS) test techniques. Metal Stress Voids High current resistance measurements are taken before and after wafers are processed through a series of heating and cooling cycles. This heat treatment is designed to mimic the high temperature processing incurred during device assembly (such as a seal-dip furnace), and it has been shown to accelerate metal void formation when the stress of the overlying film is high enough. Significant increases in the final resistance indicate the formation of metal stress voids. Gate Oxide Integrity: JEDEC JRAMP, VRAMP and OBO test techniques are used to monitor gate oxide quality. The WLR tester is also used to perform very sensitive leakage current measurements, using a specially designed picoammeter module, which allows us to detect subtle differences in gate oxide quality. Passivation Integrity A novel wafer-level-autoclave test technique has been developed which allows us to quantify the level of protection the passivation film provides when the wafer is subjected to a high temperature, high humidity environment. Electrostatic Discharge Sensitivity (ESD) BICMOS LOGIC National BiCMOS Logic has designed special dual-rail ESD protection circuitry to increase its level of ESD performance over non-protected inputs and outputs. This protection is standard on all BiCMOS Logic designs and was first used in National's family. By design, this circuitry limits product vulnerability to both positive and negative Human Body Model (HBM) ESD and Electrical Overstress (EOS) voltages by protecting inputs and outputs connected to Vee as well as ground. Protection to ground is provided through the transistor 02 and diode D2, standard Schottky clamp. The path to Vee is protected through the BVCEO breakdown mechanism of 01. Diode D1 ensures isolation of the input or output from Vee leakages. The device design and layout ensures dependable turn-on characteristics as well as robustness. ESO protection was achieved with no appreciable affect on speed or increase in capacitance. 01 01 INTERNAL CIRCUITRY INPUT 0 - -....- - - -....- 0 OUTPUT 02 GND GND Figure 21. ESD Protection Circuit http://www.nationai.com 4-12 TL/F/12134-21 r- o Electrostatic Discharge Sensitivity (ESD) (Continued) I» C. CMOS Logic Circuits which show excellent resistance to ESD-type damage are classified as category "B" of MIL-STD-883C, test method 3015, and withstand in excess of 4000V typically. It is guaranteed to have 2000V ESD immunity on all inputs and outputs. Parts do not require any special handling procedures, however, normal handling precautions should be observed as in the case of any semiconductor device. ABT and SCAN ABT logic ESD sensitivity is guaranteed greater than 2000V, using the MIL-STD-883C, test method 3015 for Human Body Model (HBM) ESD. Rl = 10 M!l 1 = 1500!l R2 ~~ HIGH VOLTAGE POWER 1 SUP{LY C1 = 100 pF Figure 23 shows the ESD test circuit used in the sensitivity analysis for this specification. Figure 24 is the pulse waveform required to perform the sensitivity test. J OUT High Voltage R2 ~ < - ;::;: '< = 1500!l I» :::J C. Relay Ch"~ Regulated High Voltage Supply - o:::J· In "ce!. = 800 k!l 1---------0 n' I» o.... 3 In Normal handling precautions should be observed as in the case of any semiconductor. (min) 3G!l (max) CD (') :::;: CD TL/F/12134-22 Figure 22. HBM Test Circuit R1 S· en "'C (C 1, DC Voltmeter :::JJ Calibrate o;"h",. !!. iii' g Test = lOOp' OUT Waveform Terminals ;::;: '< TLlF/12134-25 FIGURE 23. ESD Test Circuit 100%;----",......... ., 90% '" taECAY :5 350 ns a. E (R2 + R3 ) C1 2: 300 ns III ~ISE :5 15 ns "0 36.8%-f--I----- 10% TIME TlIF/12134-26 FIGURE 24. ESD Pulse Waveform 4-13 http://www.national.com ~r-----------------------------------------------------------------------------------~ == :is .!! 'iii a: "C c co ~ ~ "iii ::::s "Euf ... o G) ~ ==uf c o ca (,) :;:; i;::: 'u G) Q. U) c:n c ca o ;:; ...J Latchup Testing Power Sensitivities for Minimum Geometry Products Latchup in CMOS and bipolar circuits can vary in severity from being a temporary condition of excessive Icc current and functional failure, to total destruction requiring a new unit. The latchup condition is usually caused by applying a stimulus that is able to cause a regenerative condition in a PNP-NPN structure. For a more detailed description of definitions and causes of latchup, see National Semiconductor Application Note 600 (located in the "FACT Advanced CMOS Logic Data book" Lit. # 40019). The demand for high performance process technology capable of sub 4 ns speeds, minimal noise and lower operating voltages drives the microelectronics industry towards decreasing layout geometries. Advanced process technology minimizes gate widths, gate oxide thickness and junction depths to improve gate switching speeds. In contrast, the decreased geometries reduce the ability of the devices built on advanced processes to resist electrical overstresses. As geometries decrease, emphasis shifts towards the reduction of environmentally induced electrical overstresses to ensure system and component reliability. Market trends continue to drive the need for smaller geometries with reduced power supply voltages. Current 5.0V technologies are migrating towards 3.0V technologies while 3.0V technologies have shown a greater sensitivity to electrical overstresses. Sensitivities to electrical overstresses have been observed in as large as 1.0 J-Lm geometries. Device damage from electrical overstresses vary and the categories include, but are not limited to: Electrical-OverStress (EOS) due to excessive current or voltage exposure and Electro-Static-Discharge (ESD) be it exposure by Human Body Model, Charged Device Model or Machine Model. Sources of electrically induced overstresses are difficult to determine; however, investigation of failures from small geometry devices may show that environmental hazards such as unregulated and unconditioned power supplies in the field exceed "Absolute Maximum Ratings" causing unrecoverable device damage. BICMOS Logic National has characterized its Advanced BiCMOS logic for robustness using the JEDEC 17 method and an IMCS 4600 Automated Latchup Test System. The automated test eqUipment approach to latchup provides a repeatable test setup and application of test conditions, reduces the amount of time for evaluation, and provides a more comprehensive set of vectors and stimuli over a shorter period of time. The JEDEC 17 method is a standard measurement procedure for the characterization of CMOS integrated circuit latchup susceptability/immunity, measured under static conditions. The method allows for overcurrentl overvoltage stressing of inputs and outputs to detect latchup. In short, the JEDEC 17 method follows a sequence of: 1. 2. 3. 4. 5. 6. Advanced processes such as BiCMOS include small dimension current density limited geometries that are sensitive to electrically induced overstresses. The combination of internal bipolar and CMOS gates provides current capabilities for maximum device performance. In an unconditioned supply environment, the bipolar section of a BiCMOS circuit can source excessive current through the CMOS section and cause damage due to the CMOS circuit's current density limited geometries. In an effort to resolve device sensitivities to electrical overstresses, designers and engineers can reference device databooks. Databook specifications include "Absolute Maximum Ratings" and adherence to this specification is essential in ensuring component and system level reliability. The time for each parameter as well as the temperature is critical for correlation of latchup. National characterizes latchup on the Advanced BiCMOS family at 125°C and with the critical timing parameters on Table III. Close correlation can only be accomplished by using the same trigger duration, Vee, test temperature, and magnitude of trigger stimulus. TABLE III. Critical Timing Parameters Symbol 1. A. Amerasekera, A. Chatterjee, ':4n Investigation of BiCMOS ESD Protec· tion Circuit Elements and Applications in Submicron Technologies", EOS/ESD Symposium, p5B.6.1. http://www.national.com Apply power Setup I/O conditions to place device in desired state Apply trigger source for desired duration Measure supply current Remove power supply if lec ~ test limit Inspect for electrical damage 4-14 Parameter Time Tw Trigger Duration 500 J-Ls teool Cool Down Time 10 ms Latchup Testing (Continued) TABLE IV. Supply and Stimulus Values For BiCMOS ABT products, logic states are checked for a susceptability to latchup witil all outputs high, all outputs low and all outputs in TRI-STATE. If the device is a bidirectional device, then the logic states are tested in each direction. All inputs and outputs are tested for each logic state and direction. TRIGGER SOURCE (v /1) Parameter PVT Positive Voltage Trigger NIT Negative Current Trigger Vee 7.0V Stimulus en "'C Vee + 3V (10V) (1) (") ~ o· D) 7.0V -500 mA Verification of any unusual observations is performed with a curve tracer manually. For example, when ABT outputs are brought below ground, the NMOS transistor feeding current to the bipolar output will turn on and current from Vee will come out of the output pull-down device. This condition is unavoidable by design and is not latchup. Thus good analysis of observations will tell one whether latchup has occurred. Due to the high trigger stresses, devices used for latchup testing should be discarded and not used for design, production, or other tests. Latchup testing is potentially destructive and may limit the life of a device. Finally all inputs and outputs have clamp diodes, requiring a negative current trigger as a stimulus for latchup. The clamp diodes are designed to allow current flow into ground without injecting carriers into the substrate that could cause a parasitic PNP-NPN. Supply and stimulus values used by National for latchup testing the ABT family are in Table IV. '? Stimulus o· ::J Forcing a current in the positive direction overstresses the inputs and outputs by causing a breakdown. Such breakdowns consume enough power in the breakdown area to cause the junction permanent damage. PVT stresses the inputs and output while keeping the input and output devices out of any breakdown region. ov S· CC Because the ABT and SCAN ABT family is designed for live insertion, a Positive Voltage Trigger (PVT) and a Negative Current Trigger (NIT) is applied to the inputs and outputs to check for latchup. vee roD) a. ~rn =e D) < (1) .,o 3 In "ce!.. ::;: '< D) ::J a. ::D , 7.0Y, Il\ ~! H : : tw SEQUENCE , !!.. Dr ... ~ g ::;: '< ... ~ teooL ·1 TLIF/12134-23 FIGURE 25. • 4-15 http://www.nationai.com Latchup Testing (Continued) CMOS Logic The test procedure is as follows; five pulses, each of at least 2000V, are applied to every combination of pins with a five second cool-down period between each pulse. The polarity is then reversed and the same procedure, pulse and pin combination used for an additional five discharges. Continue until all pins have been tested. If none of the devices from the sample population fails the DC and AC test characteristics, the device shall be classified as category B of MILSTD-883C, TM-3015. Devices that result in ESD immunity in the 2000V-3999V range are listed as ESD Class 2. Devices that result in ESD immunity in the 4000 + V range are listed as ESD Class 3. In the past a major problem with CMOS has been its sensitivity to latch-up, usually attributed to high parasitic gains and high input impedance. SCAN CMOS logic is guaranteed not to latch-up with dynamic currents of 300 rnA forced into or out of the inputs or the outputs under worst case conditions (TA = 125°C and Voo = 5.5 Voc). At room temperature the parts can typically withstand dynamic currents of close to 1A. For most designs, latch-up will not be a problem, but the designer should be aware of its causes and how to prevent it. SCAN CMOS devices have been specifically designed to reduce the possibility of latch-up occurring; National Semiconductor accomplished this by lowering the gain of the parasitic transistors, reducing substrate and p-well resistivity to increase external drive current required to cause a parasitic to turn ON, and careful design and layout to minimize the substrate-injected current coupling to other circuit areas. P-Channel MOS For further specifications of TM-3015, refer to the relevant standard. The voltage is increased and the testing procedure is again performed; this entire process is repeated until all pins fail. This is done to thoroughly evaluate all pins. Input N-Channel MOS N + Substrate 0.008-0.25 ohm-em TLIF/12134-24 FIGURE 26. Advanced CMOS EPI Process Cross Section with Latch-up Circuit Model http://www.national.com 4-16 Section 5 Characterization Data http://www.national.com Section 5 Contents Propagation Delay vs. Temperature, Capacitive Loading and Switching Output............. SCAN 18245T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCAN18373T. ... ......... ..................................................... .... SCAN18374T............. ......................................................... SCAN18540T...................................................................... SCAN18541T...................................................................... Typical Icc vs. Frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . .. . . . . . . . . . . . . . . . . . . . . 5-2 5-3 5-3 5-5 5-8 5-10 5-12 5-14 o::r ...mm n ... N' - tflNational Semiconductor CD m O· Propagation Delay vs Temperature Capacitive Loading and Switching Outputs ::s - C m OJ SCAN18245T tpHL (A to BIB to A) vs Temperature CL = 50 pF, 1 Output Switching tpHL (A to BIB to A) vs # Outputs Switching CL = 50 pF, TA = +25'C tpHL (A to BIB to A) vs Temperature CL = 50 pF, 18 Outputs Switching 12 -.- ~ITIIlt~X.I 10 : ·1· Tli!..u:::... T~~ ~ b'jbv' J o~~~~~~~~--~ O~~~~~~~~~~ -55 -55 -~5 -15 5 25 45 65 85 105 125 -~5-15 Temperature (C) 5 r o 25 45 65 85 105125 18 1 Temperature (C) tpHL (A to BIB to A) vs Load Capacitance 1 Output Switching, TA = + 25'C Number Outputs Switching tpLH (A to BIB to A) vs Temperature CL = 50 pF, 18 Outputs Switching tpLH (A to BIB to A) vs Temperature CL = 50 pF, 1 Output Switching 14r---------,---~~__, 12 12~--------+---,~,~~'-'~ 10 t.lAX , " . ---- - - - - _+A~ T~P J4.L O~--------.L-----------' 50 250 150 O~~~~~~~~~~ -55 -~5-15 5 25 45 65 85 105125 Temperature (C) Capacitance (pr) tpLH (A to BIB to A) vs # Outputs Switching CL = 50 pF, TA = +25'C 12 ,. ~~x __ f-f-' 1 ... f- sf ,..... -55-35-15 5 2545 65 851~5125 tPZH (~ to An/Sn) vs Temperature CL = 50 pF, 1 Output Switching .... MAX .". ... - .. .. .... .... 10r-------. .~..~~..- ..------; ~ii"H: ... f- i- f-- Temperature (C) tpLH (A to BIB to A) vs Load Capacitance 1 Output Switching, T A = + 25'C 12 10 o -- ::;lrl - - - - - - - -~t.lt f---" f-- Hrt71V II r o 1 Number Outputs Switching ---- ------~I~ OL-________L -______ 18 50 150 Capacitance (prJ ~ 250 -55-35-15 5 25 45 65 85105125 Temperature (e) TL/F/11576-1 5-3 http://www.national.com ca as C c SCAN 18245T (Continued) o *' tpZH (0£ to An/Sn) vs Temperature CL = 50 pF, 18 Outputs Switching ;:: ~ tpZH (OE to An/Sn) vs Outputs Switching CL = SOpF, TA = +2So C 'i: 12 1:) 10 tPZL (OE to An/Sn) vs Temperature CL = 50 pF, 1 Output Switching Illll~x CD f! as 111111 10 f-t--+--+--t---1- TL"t:lil~ .c o TYP @ 5.5V llllll 1IIIn o o~~~~~~~~--~ -55 -35 -15 5 25 45 65 85 105125 1 o~~~~~-L~~~~ 18 Temperature (c) -55 -35-15 5 25 45 65 85 105125 Temperatur. (c) Number Outputs Switching *' tpZL (0£ to An/Sn) vs Temperature CL = 50 pF, 18 Outputs Switching (oe tPZL (OE to An/Sn) vs Outputs Switching CL = 50 pF, TA = +2So C 12f-+--+--t-~-+-+~--~ 12 10 f-+-+-+--+---1- 10 10 .+HHtx II II ~~ tpHZ to An/Sn> vs Temperature CL = 50 pF, 1 Output Switching TYP @ 4.5V - - I LUll I- L,I TYP@ 5'n III r'~ o O~~~~~~~~--~ -55 -35 -15 5 25 45 65 85 105 125 Temperature (C) ' .. _- *' -- -- ~ I- - I-- I-- 10 T~P J4JV -- I-- 10- T rp ~. ;v YP -: ~ ::: .v I ~IN o n ~ o -55 -35 -15 5 25 45 65 85 105125 1 18 Temperature (C) o 1~x ~ L1Jv i~ --~ ~p~dv ~IN -55 -35-15 5 25 45 65 85 105125 *' 'Ux T~~ JUvi qv; TYP@ TYP @ 5. V T II n I 1'N o -1t~x T Temperature (C) (oe 10 -- - - tpLZ to An/Sn) vs Outputs Switching CL = 50 pF, TA = +2So C 12 10 .. - .. - - - - - - _. _. -. Number Outputs Switching tpLZ (OE to An/Sn) vs Temperature CL = 50 pF, 18 Outputs Switching 5. iV ~IN '. -"I-- .. ~AX ~ YP tpLZ (OE to An/Sn) vs Temperature CL = 50 pF, 1 Output Switching rlJ JtU - -I-- - -- - - ---- 10 ..1~ I I ~ I-" Temperature (C) tpHZ (OE to An/Sn) vs Outputs Switching CL = 50 pF, TA = +2SoC -- "'-I-- - - -t:x - -iA"x T~P J 4.~V - -- --. -55 -35-15 5 25 45 65 85 105125 Number Outputs Switching tpHZ (0£ to An/Sn) vs Temperature CL = 50 pF, 18 Outputs Switching 10 o 18 1 ..... _- ... o -55-35-15 5 25 45 65 85105125 1 T.mperature (c) 18 Number Outputs Switching TL/F/11576-2 http://www.nationai.com 5-4 o ::r D) SCAN18373T .... D) - n CI) tpHL (In to On) VI Temperature CL = 50 pF, 18 Outputl Switching tpHL (In to On) va Temperature CL = 50 pF, 1 Output Switching 12 12 --r-- - - -;t:14 10 i-- I-- 1~X "- 10 !V ~ r-- TYP @ 5.5V --------- -- -- - - - - I T~P J 4~ ~V - r- -~;X TYP@ ------ I TI 'iJ o -55-35-15 5 25 45 65 85105125 16~--------'-----~~~A~X 12~-------.~.~~·-·-·-----1 10 .' .. ' . . . _-r-- 12 10 8 (cl Number Outputs Switching tpHL (LE to On) va Temperature CL = 50 pF, 18 Outputa Switching 14 -- - --"I'"r "--- -- - - - - -i:x AX 12 Tr~ TYP @ 4.5V T~pJ~ 10 m ~ dv ::::: ;;00- .-~ ~ TYP@5.5V 18 1 tpHL (LE to On) VI Temperature CL = 50 pF, 1 Output Switching tpHL (In to On) va Load Capacitance 1 Output Switching, T A = + 25'C 'II o I TYP @ 5.5V I - - - - - - - -tl~ 6F=--------+-------~ _------- ----- --------- MIN T liN o~--------~------~ 50 150 250 o o -55-35-15 5 25 45 65 85105125 -55 -35-15 5 25 45 65 85 105125 Tamperatura Capacitance (pF) tpHL (LE to On) va # Outputa Switching CL = 50pF, TA = +25'C 14 tpHL (LE to On) VI Load Capacitance 1 Output Switching, TA = + 25'C TYP @ 4J.':'." 12 TYP @ 5rl 8_ .....,.........~YP @ 5.5V n _------- 18 "-~- r-- r- r- - -r r T~P ~ dv 10 -- ~ r- - - - - - - - -JI; T~J Jl.U -r- r-r- I -55 -35-15 5 25 45 65 85 105125 Temperature (cl cttmt TYP@ 5rl I 11 l @ 5.~V - - - - - -4I'N o -55 -35 -15 5 25 45 65 85 105 125 (cl tpLH (In to On) va Load CapaCitance 1 Output Switching, T A = + 25'C ~AX 12r---------r-~~~..~--..~ ..... ----_ 10 ...... ... TYP @ 4.5V 6~~ 8 --- OL---------.l....----------' 18 Number Outputs Switching TYP 2 I-r-_ _ 'II 1 m -_-_-_-_-_-_--t--__-_-_-_-__M_IN- ; ~I~ o 1~X Temperature -- ~1·HtMx AX r o 250 tpLH (In to On) VI # Outputa Switching CL = 50 pF, TA = +25'C 12 i~ ~ f- :.- r- I-:.- r- I-- ~ Capacitance (pF) tpLH (In to On) va Temperature CL = 50 pF, 18 Outputa Switching 10 - - -- t.lIN 150 50 Number Outputs Switching 12 ----- 0L-________L -______ -. :.- I-- I-- II 11 1 -r-- TY~ ...... 10 o 12 10 •••1-' (cl tpLH (In to On) va Temperature CL = 50 pF, 1 Output Switching 14r-________~~~·~..- ..~~~A~X Ull 10 Tomperotura 16~--------.-------.~.~ '-~~ 12 (cl 50 150 250 Capacitance (prj TL/F/11576-3 5-5 .... N" D) 0" ::s C D) ~ ~ ~vl- -~IN -55-35-15 5 25 45 65 85105125 14r---------+-----.~.~·~· T~J Jl.U ......... o Temperature ----H ';:x' 10 TYP I (cl 12 dv IN Temperature tpHL (In to On) va # Outputl Switching CL = 50 pF, TA = +25'C http://www.national.com D) Sta SCAN 18373T (Continued) C C o ;: tpLH (LE to On) va Temperature CL = 50 pF, 1 Output Switching ~ 0i: 14 CI) u ~ ta .c 10 '- 12 - tpLH (LE to On) va # Outputl Switching CL = 50 pF, TA = +2SoC tpLH (LE to On) VI Temperature CL = 50 pF, 18 Outputl Switching 10 o 12 .. '~lx T~I ~A! - ---- -m ~ 1-1- #ttt1 -I- ~P @ 5jv I- I- 10 II 1 - - - - - - - -i~ l O~~~~~~~~~~ o -55 -35-15 5 25 45 65 85 105125 -55 -35-15 5 25 45 65 85 105125 (cl Temperature Temperatur. ~I~ rr o 1 18 (cl Number Outputs Switching tPZH (Of to On) VI Temperature CL = SO pF, 1 Output Switching tpLH (LE to On) va Load Capacitance 1 Output Switching, TA = + 25"C l.l. to tpZH (Of to On) VI Temperature CL = SO pF, 18 Outputl Switching 14r---------~------~ 12~------~~C-~-------~;~;~X --_ .. ---- 10~-f-+-~~-+-4~--~ 10 F---------f-- OL---______ 50 ~ _______ _ J 150 250 OL-~~~-L~~~~~ O~~~~~~~~~~ -55-35-15525456585105125 -55 -35-15 5 25 45 65 85 105125 Capacitance (pF) Temperature tpZH (~to On) VB # Outputl Switching CL = SO pF, TA = +25"C 12 1.!~X. 10 JJll !..I 14 12 11 n 18 1 , -- .. ... ~t_~ * --- - -- 10 ~IN -55 -35 -15 5 25 45 65 85 105 125 Temperature ~t! 10 r- II 11 r'~ o 1 Temperature ..~- I TYP@ tpHZ (OE to On) VI Temperature CL = SO pF, 18 Outputl Switching 10 '--- --~- - - - !t~ I - ~ sJv -- - -- - I (el ~ TYP o -55 -35-15 5 25 45 65 85 105125 Tlmperature (el @5.~V I liN _. -~IN 18 Number Outputs Switching ~IN -55 -35-15 5 25 45 65 85 105125 ~ --- - I o MIAX - . ..... TYP @ 4.5V TYP @ 5.5V I - -~5.~V 12 10 II - -- (el 12 12 - - "M~; T~P J4.L I - -:±tC - - - - - -. - -4-- tpHZ (~ to On) VI Temperature CL = 50 pF, 1 Output Switching tpZL (~to On) va # Outputl Switching CL = SOpF, TA = +25"C ' .. _- I-- --~- I- I 1 Number Outputs Switching 14 12 ~v o (el tPZL (O'E to On) VI Temperature CL = SO pF, 18 Outputl Switching 14 l- TYP @ 5jVI o Temperature tpZL (Of to On) VI Temperature CL = 50 pF, 1 Output Switching 10 Trrul~ IIIII (cl o -55 -35-15 5 25 45 65 85 105125 Temperature (cl TL/F/11576-4 http://www.national.com 5-6 o :::r SCAN 18373T (Continued) tpHZ (0£ to On) VI # Outputl Switching CL = 50 pF, TA = +25°C tpLZ (0£ to On) VI Temperature CL = 50 pF, 1 Output Switching 12 12 J~X 10 TYP @ •• TYP @ IIl 12 "( .. ---- - - -rt;r: L 10 10 ...... _- -- -- - - ~ t-" n 18 TYP @ - - - - - - _. o -55 -35-15 5 Number Outputs Switching 5r - .t.t{! 11~ 'i~ bv II I tpLZ (0£ to On) VI Temperature CL = 50 pF, 18 Outputl Switching WIAX 5.5V o D) DJ n TYP I @ 5'r I r -~;N o Temperatur. (C) -55 -35-15 5 25 4S 65 85 105125 Temperature (C) tpLZ (0£ to On) VI # Outputl Switching CL = 50 pF, TA = +25°C 12 JA~ J.~ 10 r ~. " TYP @ 4.5V TYP@ 5n II r'~ o 1 18 Number Outputs Switching TL/F/11576-5 5-7 CD tiD 0" :::I C D) I» --~ 25 45 65 85 105125 -... - http://www.national.com ca ca c SCAN18374T C 0 += CO tpHL (CP to On) vs Temperature CL = 50 pF, 1 Output Switching N -... "i: 12 ( .) 10 CD CO ............. .. . .. I- .. ~ .. -~AX 'j' ca TYP ~ f-- ~ 14 ...... 12 T~ .c 0 tpHL (CP to On) vs Temperature CL = 50 pF, 18 Outputs Switching dv F ------- -- r o -55-35-15 5 ..- -55 -35 -15 5 18r---------,-------__, 12 MAX 14~--------..+..~~..~..-----1 12 ~--_:::._o'..=..-..-+- TYP@4.5V @ o~--------~------~ 150 250 1 " ~U rr l 18 tpLH (CP to On) vs Temperature CL = 50 pF, 18 Outputs Switching n:+-+TYP @ 5. V y ~~I~ I -55 -35 -15 5 25 45 65 85 105125 5 Temperature (e) tpLH (CP to On) vs # Outputs Switching CL = 50 pF, TA = +25'C 'i1x " T~pIJ tU UJ -t~ o Capacitance (pr) 12 ~ TYP Number Outputs Switching - - ----- MIN Hi 25 45 65 85 105125 I-- I-I-- I-- I-I-- I--~ 5.5V ------- 10 5jV Tr~~ .. . T~P.. J-1~ 4.L ........... 10 r..:..-.. -....---l:~:s=~~=__j 50 II 10 tpLH (CP to On) vs Temperature CL = 50 pF, 1 Output Switching 16~--------+-----.. - .. ~~ F"T'yp @ ,~~ 12 Temperature (C) tpHL (CP to On) vs Load Capacitance 1 Output Switching, T A = + 25'C ---= T~P ------- Temperature (C) 10 +lb o 25 45 65 85105125 14 _- -- - - JJ~;X- 10 tpHL (CP to On) vs # Outputs Switching CL = 50 pF, TA = +25'C 25 45 65 85 105125 Temperature (e) tpLH (CP to On) vs Load CapaCitance 1 Output Switching, T A = + 25'C tpZH (OE to On) vs Temperature CL = 50 pF, 1 Output Switching 14r---------,---~~__, 12~--------~~~--__1 10 I-:=_c::.-----+_- 11 TYP @ 5.n "'H ----- l''f o 1 50 150 tpZH (OE to On) vs Temperature CL = 50 pF, 18 Outputs Switching -- - - - - ..M·t! T~P J4.L - I-- I-- UJltix 10 111111 TYP rtll. ~p~ T~~ ~ I'N -55 -35 -15 5 25 45 65 85 105 125 Temperature (C) 12 10 o .. -- 4.5V Uv I-- P I- i ,UHH IIWi - - - - - - - -+- o @ tpZL (OE to On) vs Temperature CL = 50 pF, 1 Output Switching 14 II U II 5+ 25 45 65 85 105125 Temperature (C) tpZH (DE to On) vs # Outputs Switching CL = 50 pF, T A = + 25°C 12 l.- I-- I-1-- 5 250 Capacitance (pF) 12 ... ~-- MIN O~--------~------~ 18 Number Outputs Switching 10 ---- 1 ... . - l.- I-- ~A: - ~ ~lv I-- I I ~IN o 18 Number Outputs Switching " -55 -35 -15 5 25 45 65 85 105 125 Temperature (e) TLlF/11576-6 http://www.national.com 5-8 o ::r' I» SCAN18374T (Continued) tPZL ( E to On) va Temperature CL = 50 pF, 18 Outputa Switching 10 .... _- I-- 12 M{~ ~~ II ~ ~IN ~I~ o 25 45 65 85105125 Temperature (el I II TYP @ 5.n J -55-35-15 5 r TYP @ 5. V ~~x 1 ..:j;-+". 10 5.tv- o T[P~ Temperature TYP @ 4.5V ~ (el -55 -35-15 5 25 045 65 65 105125 'i~ TYP C tpLZ (c:>E to On) VI # Outputl Switching CL = 50 pF, TA = +25'C - - ___ . rlp JJv- -- :::J I» I» e - - -.ttl ~ Number Outputs Switching 12 0" T 18 1 N" I - - - - - - -;IN o iii o 25 45 65 85105125 "--r-- 10 -- II .... I» tpLZ (c:>E to On) va Temperature CL = 50 pF, 1 Output Switching 12 j~X 10 I -55-35-15 5 Temperature 12 M.{~. CD -55-35-155250456565105125 tpHZ ( E to On) va Temperature CL = 50 pF, 18 Outputa Switching 12 o 16 !:x I ... ~ ~ II 25 45 65 65 105125 Temperatura -- - TYP @ 5.5V I T -55-35-15 5 - - - ... 10 II . 10 ~5~~V o tpHZ ( #define WRITE_PSC (PSC_REG_OFFSET. DATA) outportb ((int) (PSC_BASE + PSC_REG_OFFSET). DATA) #define READ_PSC(PSC_REG_OFFSET) inportb((int) (PSC_BASE + PSC_REG_OFFSET) ) #endif == /* If compiling for Corelis board. use Corelis low level driver for PSC100 */ #if BSM_TYPE CORELIS_BOARD #include ·cortest.h· #define PSC_BASE Ox140 #define WRITE_PSC (PSC_REG_OFFSET. DATA) write_psc(O. PSC_REG_OFFSET. DATA) #define READ_PSC (PSC_REG_OFFSET) read_psc(O. PSC_REG_OFFSET) #endif == These two cases are handled using a conditionally defined macro. This is the only conditional define in the code, and the only thing that may change when compiling for one architecture verses another. Note that the above code also includes an option to define WRITLPSC and READ_PSC to call functions for a Corelis ISA card, PC-1149.1/100F, High Speed PC-AT Bus Boundary-Scan controller. This option was extremely helpful in that it enabled the code development and debug to be performed on a PC, with a SCANPSC100F mounted on an ISA card, using a high level debugger. Once the code was debugged, it could be compiled for the target embedded system resulting in a great reduction in debug time of the embedded environment. such as the Embedded Boundary-Scan Controller, SCANPSC100F, and the Hierarchical and Multidrop Addressable JTAG Port, SCANPSC110F Bridge, that enable system wide embedded scan testing. With the SCAN EASE software described in this paper, the task of implementing embedded scan test has become virtually an "off the shell" solution. REFERENCES [1] IEEE Std. 1149.1-1990, "1£££ Siandard Test Access Port and Boundary-Scan Architecture': IEEE Computer Society, 1990. [2] NSC "SCAN Databook': National Semiconductor, 1996. National [3] NSC, "Scan Tutorial Handbook Volume Semiconductor, 1994. [4] IEEE Std. 1149.1-1990 Sup. B, "Boundary-Scan Description Language': IEEE Computer Society, 1990. [5] EichelbergereLindbloomeWaicukauskieWiliiams, "Structured LogiC Testing': Prentice Hall, 1991. [6] Motorola, "M68000 Microprocessor User's Manual': Motorola 1990. 1': SUMMARY A OFT strategy that utilizes boundary-scan components whenever available, will reduce test development cycletime, increase fault coverage, reduce test time, and enable system level embedded test. Production tests can be reused for embedded (built-in) test and tools are available that automate this process. National provides components http://www.national.com 7-12 » z . Embedded IEEE 1149.1 Test Application Example National Semiconductor Application Note 1037 This application example discusses the implementation of embedded, system level boundary scan test within an actual design, the National boundary scan demonstration system. Its intent is to describe the decisions, actions and results when applying boundary scan and National's SCAN EASE Software within a system. For more information see also AN-1022, "Boundary Scan Silicon and Software Enable System Level Embedded Test." Functionally, the system is designed to display messages and system status information using the LCD display located on each liD card. This message and status information is driven from the processor card, via the system backplane, or from EPROMs local to each liD card. To demonstrate the features and functions of boundary scan, the system also contains LEOs which display the status of boundary scan activity. 004 o W ....... HARDWARE DESCRIPTION TEST OBJECTIVES The National boundary scan demonstration system is comprised of a multidrop backplane which interconnects a processor card to several system I/O cards. The backplane contains a 16-bit data bus, a 16-bit address bus and several control signals routed to six connectors. The processor card consists of a processor core which includes a Motorola 68302 ILP, boot EPROM and working SRAM, a RS232 port for remote communication, a parallel backplane interface and an auxiliary parallel port. The I/O cards, each sharing an identical architecture, include a 16-bit LCD display, an on board EPROM which stores LCD messages, and a backplane interface. Each liD card also contains logic which multiplexes data, from either the backplane or EPROM, to the display. The fundamental test objective for the National demonstration system was to utilize techniques which could be applied over the life of the product, including development, manufacturing and in-field operation. With effective prototyping to ensure functionality and timing performance, printed circuit board (PCB) structural faults, resulting from manufacturing errors or in-system board stress (e.g., temperature changes or mechanical stresses), were the primary focus. Boundary scan was seen as an effective means of detecting and diagnosing printed circuit board failures at all stages of the product's life cycle. A specific area of concern during the development of the test strategy was system level test. Typically, limited tester access forces system test to rely on functional patterns to test for even simple interconnect failures. This leads to very complex test patterns, poor fault coverage and very difficult failure diagnostics. More importantly, the functional test routines depend on sound interconnects between components to be effective. Embedded, system-level boundary scan was perceived as a way to replace many of the functional tests with simple and easily diagnosable tests. The number of liD cards can vary within a given system. While five backplane liD card connectors are available, only 2 of the 5 slots are typically populated with liD cards. The multidrop (Le. parallel) backplane architecture enables cards to populate any of the five connectors and allows connectors to remain empty. Board addressing is used to select cards for functional operation. Con 4 Con 5 Con 6 System Backplane Processor Card TLIF/12146-1 FIGURE 1. Demonstration System Layout 7-13 http://www.national.com ,. ...... C") ....o I Z < SCANPSC100 Embedded B/s Controller BP TAP Brd Addr BP TAP LSP 1 SCANPSCll0F BRIDGE LSP3 ' -_ _ _ _ _ _...1 LSP2 TL/F/12146-2 FIGURE 2. Demonstration Processor Card Boundary scan was viewed as only a part of the complete test solution. Functional test routines were still required to test system memory and confirm effective IlP-to-system peripheral communication. Using the two techniques together maximized test effectiveness while reducing test development efforts. To increase the structural fault coverage on nets connected to devices which are not available with boundary scan, a "cluster test" can be implemented. A cluster test relies on at least two boundary scan components and a functional knowledge of the cluster (Le., cluster of devices) connected between them. Using one 1149.1 compliant component to drive test vectors to the cluster and the other to receive expected data from the cluster, the structural integrity of the cluster can be evaluated. IEEE 1149.1 COMPLIANT SYSTEM ARCHITECTURE To accomplish the boundary scan test objectives, the 1149.1 test strategy covered three aspects of the system: board and backplane boundary scan test points, system level boundary scan access and embedded boundary scan control. As the number and complexity of components increases, the development of test vectors becomes more difficult and diagnostic resolution increases. Within the demo system, a cluster test was implemented on the processor card's auxiliary port (see Figure 2). Board and Backplane Test Points The first step in implementing boundary scan is to integrate 1149.1 compliant components into the functional design. Maximizing the percentage of nets covered by boundary scan reduces the cost of other techniques and equipment like in-circuit testers, while increasing the ability to apply the benefits of boundary scan at later phases of the product's life cycle. In the case of the National demo system, boundary scan was included on nearly every logic IC which populated the processor card and I/O cards. On future demo design revisions, boundary scan will be expanded beyond the logic components to include an 1149.1 compliant microprocessor and programmable device (Le., integrating the separate, non-1149.1 programmable devices into a single 1149.1 FPGA or CPLO). These additions will continue to drive the structural fault coverage towards 100% and also provide non-test capabilities, such as IlP emulation and in-system FPGA programming via the JTAG port. To support backplane interconnect testing, National's 18·bit SCAN ABT Test Access Logic components were implemented at the backplane interface on both the processor card and I/O cards. Using 1149.1 compliant SCAN ABT logic (SCAN182245A) provided the required backplane test points while also creating a hot insertable1 backplane interface. The hot insertable interface allowed failing processor or I/O cards to be removed or inserted without powering down the system. http://www.national.com System Level Boundary Scan Access and Partitioning With the 1149.1 components placed on the processor and I/O cards, the next objective is to interconnect the 1149.1 component TAP signals-TMS, TCK, TOI, TOO and TRST-at both the board and system levels. For the National demo design, this task was accomplished by adding a 5bit bus to the backplane design and placing a National Hierarchical and Multidrop Addressable JTAG Port, 7-14 » z . ..... o w ...... LCD DISPLAY EPROM (2k x B) LCD DISPLAY DATA Brd Addr LSP2 SCANPSC 11 OF BRIDGE Edge Connector BP TAP TL/F/12146-3 FIGURE 3. Demonstration 1/0 Card SCANPSC110F bridge, component at the backplane interface of the processor card and each lID card. The SCANPSC110F bridge provides two key features to efficiently interconnect and partition a 1149.1 compliant system: The ability to partition a board and system using the SCANPSC110F bridge simplifies test development, improves test efficiency and allows failures to be diagnosed to the partition level without using an off-line diagnostics tool. However, these benefits are only realized if the 1149.1 components are intelligently grouped and connected. The objective for testing the demo system was to test each board as a separate entity and to test the interconnects between the boards (I.e., the backplane). Enabling each board to be tested separately was easily accomplished when the SCANPSC110F bridge was placed at each card's backplane interface and connected to a system wide backplane TAP. With this interface, the tester TAP signals could be applied to each board separately. • System Level Partitioning: The SCANPSC11 OF bridge provides an addressable, multidrop interface to a single backplane TAP bus. This multidrop TAP interface is a perfect fit for this application because it preserves the ability for cards to be placed in any of the backplane connectors and for connectors to be left empty without requiring an entirely new set of boundary scan test vectors. Using a 1149.1 protocol, each SCANPSC110F bridge and, in turn, each board, can be addressed to participate in boundary scan test operations. • Board Level Partitioning: Typically, board level boundary scan components are connected to form a single chain. The SCANPSC110F bridge provides three local scan ports (LSPs) which allows board level components to be partitioned into smaller, more manageable chains. Using the SCANPSC110F bridge's internal data registers, the LSPs can be configured to individually connect a single scan chain to the backplane TAP or to simultaneously connect up to three scan chains in series with the backplane TAP. With exclusive access to each board, the next critical task was to select which board components were grouped and connected to the SCANPSC11 OF bridge LSPs. Again, the test objectives were considered. To enable the development of an efficient, backplane specific boundary scan test, the 1149.1 compliant backplane interface components on each card were exclusively assigned to a single LSP. To group and assign the remaining 1149.1 compliant, boardlevel components to the other two SCANPSC11 OF bridge LSPs, each board type was viewed separately. 7-15 http://www.national.com I/O Card 1 lSPl lSP2 ,,", ,,", , I I I I " I' I I I' I I I I , , , I I I/O Card 2 lSP3 rr--- lSPl lSP2 ,,", ,,", , I I I I " I' I I I I I I I I , , , I I lSP3 rr--- " " I/O Card 3 lSPl lSP2 ,,", , ,,", , , , , , lSP3 rr--- I I I I I I I I I I I I I I , I , I ~ local Scan Ports local Scan Ports local Scan Ports PSC110 PSC110 PSC110 Backplane Scan Port Backplane Scan Port Backplane Scan Port Hierarchical Scan Chain CON 6 CON 2 CON 3 TUF/12146-4 FIGURE 4. Backplane-Hierarchical Connection For the processor cards, the remaining compliant components were grouped an an internal logic chain and an auxiliary port logic chain. As with the backplane partition, these groups were selected to enable the development of group specific tests. The auxiliary port is intended to support a connection to a 1149.1 compliant sub-system. Assigning the port's compliant components to a unique LSP allows tests to be generated specifically for this port (and what is connected to it). The internal logic covers all other board level 1149.1 compliant components. A similar component group was implemented for each I/O card. The internal card logic was grouped and assigned to one LSP while the other LSP was connected directly back to the backplane connector in order to provide a hierarchical connection. A hierarchical bridge connection is realized by connecting one SCANPSC110F bridge's LSP to a second SCANPSC110F bridge's backplane interface TAP. Hierarchical connections enable board scan chains to be split into more than the three chains supported by a single bridge. Hierarchical connections also enable a system to be partitioned into addressable sub-systems. In the case of the demonstration design, the hierarchical configuration was implemented to show the concept and addressing scheme required to address a bridge and its LSPs hierarchically. Since each I/O card shares an identical architecture, each I/O card's LSP3 connects directly to the backplane edge connector. The hierarchical connection is then realized using backplane routing between Con 5 and Con 6 (see Figure 4 ). http://www.national.com Embedded Boundary Scan Test Control The final step of a boundary scan hardware design is to provide the means to apply and evaluate the boundary scan test vectors. For boards and systems which are tested using an external tester, the hardware implementation simply involves adding an applicable tester interface; e.g., additional pins on the edge connector, a special purpose connector/ header or vias for ICT probes. For boards and systems which don't permit physical access, and/or require self-test or remote test capability, the test control must be embedded within the system. For designs which require embedded test control, the optimal hardware implementation is one which enables both embedded and external tester access. This allows the design to benefit from the strengths of each method. The external tester offers the best means of developing tests for hardware debug and manufacturing. Using the ATPG and diagnostic tools provided with the external tester, tests can be easily developed and modified. Once the tests have been applied, failures can be diagnosed to the net or pin level automatically. With the tests finalized, and the boards/ system tested, the tests and control are embedded to provide self-test and remote test access capability. The National demo system hardware was designed to support both embedded and external test application. With the ability to address each demo card separately using the SCANPSC11 OF bridge, embedded and external access was only required on the processor card. The processor card then acted as the master to test each card and the backplane. 7-16 • Embedded Test: The embedded test capability for the demo system was implemented using the processor card's J-lP and the National SCANPSC100F Embedded Boundary Scan Controller. The SCANPSC100F provides an efficient, asynchronous interface between the J-lP'S parallel data bus and the serial 1149.1 TAP, and is fully supported by the SCAN EASE software tools. The generic, asynchronous interface allows SCANPSC100F to interface with a wide range of processors and operate independent of the processor's operating frequency. The microprocessor views the SCANPSC1 OOF as a standard I/O device. The processor card provided two options to initiate and evaluate embedded tests. For a power-on or post-reset self test, an LED display block was included with a separate LED for each card in the system. To initiate/evaluate tests remotely, the UART on the microprocessor was configured to provide an RS232 interface and an RS232 connector was added to the processor card. This remote interface also allows new tests to be downloaded and results to be uploaded. • BSDL Selection File: Boundary Scan Description Language files, which are provided by the component vendor or ASIC designer, define the specific implementation of 1149.1 features with an IC (see National SCAN Databook Section 6 Boundary Scan Design Support). With VIP, the user must create a BSDL selection file which provides the directory path to the BSDL file for each 1149.1 component included in a given test. • PCB Net List (in BNET Format): A net list is automatically created by the PCB design and layout tool used to develop the PCB. The user must convert this net list format to a specific format which is read by VIP. This VIP format, called BNET, contains only the boundary scan nets. It also defines the connection of 1149.1 components in each boundary scan chain and associates a tester TAP with each chain. • Connection File: This file defines the connection between each tester TAP (provided in the BNET file) and the SCANPSC11 OF bridges LSPs. It also defines how the SCANPSC110F bridges are connected to the backplane TAP and to each other (e.g., multidrop or hierarchical). • External Test: To provide system level access to an external tester, a connector was added to the processor card. In addition to the required tester signals, this connector included a sense line tied to the output enable pin on the SCANPSC100F. When the external tester was connected, the sense line was pulled high disabling the TAP pins on the SCANPSC100F. This, in turn, disabled the embedded tester and allowed the external tester, alone, to control the system TAP. • Pin Constraint File: This file defines I/O pins in the net list which are pulled to fixed logic levels, I/O pins which must remain in the high-impedance state during a test to avoid bus contention, or system inputs which must maintain a specific logic level during a boundary scan test (e.g., a reset input pin). SCAN EASE Software Tools All three of the tools within SCAN EASE were utilized to develop and test the demonstration system: Figure 2 shows the high level connection between the J-lP, SCANPSC1 OOF and external connector. • EmbedPrep: This tool was used to translate test vectors from the JTAG Technologies pattern format (PAT) to Embedded Vector Format (EVF). EVF is a compacted, A TPG-independent format that is used by the other SCAN EASE tools. EmbedPrep has no dependence on system hardware and is discussed further in the Embedding the Test Vectors section. IEEE 1149.1 TEST EQUIPMENT Hardware A wide range of 1149.1 compliant testers are commercially available, ranging from in-circuit testers to PC-AT cards. For the demo system, the requirements for the tester hardware were low cost and portability. Based on these factors, two testers were selected: the JTAG Technologies PM3705 and the Corelis 1149.1 /100F PC-AT card. • EmbedCom: The EmbedCom tool is a Windows-based GUI which provides a user-friendly interface to the embedded test system. With this GUI, system self-test is initiated, new tests are downloaded to system RAM, pass fail information is displayed and datalogs can be uploaded. The GUI allows a user to test the system with no knowledge of 1149.1 or the embedded test code. The PM3705 is a portable controller box which connects to a PC's parallel I/O port. It provides two 1149.1 TAPs and connects to the demo system via a 10-pin connector. Connectors are placed on each board (per PSC110F bridge LSP) to support board level test and on the processor card to support processor card and system level test. The PM3705 was used primarily for low volume board and system level manufacturing test, and for externally driven infield test using a laptop computer. • EmbedTest: This tool, provided as ANSI C source code, contains functions which communicate with the system hardware and manage the application/evaluation of test data. Three aspects of the code must be considered when integrating EmbedTest into a specific design: integrating the EmbedTest functions with the application's operating system and system application code; mapping the SCANPSC1 OOF addresses within the system; and implementing the drivers to support the J-lP specific UART (if serial communication with the EmbedTest code is required). The Corelis 1149.1/100F PC-AT card is based on National's SCANPSC100F which provides the ideal development platform for developing and debugging SCAN EASE functions. The SCAN EASE source code can be conditionally compiled to run directly on a 1149.1/1 OOF PC-AT card. With a connection to the demo processor card's TAP connector, SCAN EASE was developed and debugged using a commerically available ANSI C debugger. EmbedTest was written as multi-level modules. These levels range from the SCANPSC1 OOF device drivers to a module called PG_CTRL which oversees the execution of tests and initialization of the test hardware. Integration with the system's operating system and application code is performed at the program control level. For the demo system, no operating system was implemented. A simple boot up routine was implemented to initialize the processor card ATPG (Automatic Test Pattern Generation) Software Tool Both the PM3705 and 1149.1/100F PC-AT card are supported by the JTAG Technologies ATPG tool, called VIP (Vector Interface Package). This tool automatically generates system level 1149.1 structural tests using four userprovided input files: 7-17 http://www.national.com » z . ....... o w ....... DESIGN S4A2_ABT hardware and run EmbedTest. A self-test was run immediately after power up (or after a manual system reset button was pressed), then the system polled the RS232 port for further instruction. CHAIN EmbedTest includes three device driver options for mapping the SCANPSC100F. Two of the three drivers, the PSC100F in a memory mapped architecture and the PSC100 in an liD mapped architecture, were included to ensure that the SCANPSC100F could be implemented with any commercially available microprocessor. For the demo, a Motorola 68K fLP was used and, therefore, the memory mapped driver was selected. EmbedTest uses a conditionally defined macro to allow the user to easily specify the driver option. TCK TAPl TCKLl TDI TOILl TDO TMS TOOLl TMSLl TRST IC_LIST SCAN182245A U27 SCAN182541A U31 The third SCANPSC100F driver option was written to supapplication of EmbedTest using the port the SCANPSC100F-based Corelis 1149.1/100F PC-AT card. The demo system was used extensively in the development of the SCAN EASE tools. The Corelis 1149.1/100F PC-AT card enabled the majority of code development to occur on a PC using an ANSI-C debugger. Debugging modifications, prior to embedding the code within the system, minimized the time required to program a new EPROM each time a change to the code was made. U29 END_IC_LIST SCAN182373A END_CHAIN TAP2 CHAIN The final aspect of EmbedTest is the serial communication code. EmbedTest includes two modules which support serial communication. The highest level module interprets the commands entered using the EmbedCom GUI or generic emulator, and calls the appropriate EmbedTest application functions. The other, lower level, module is a UART specific device driver. For the demo, this device driver was specific to the Motorola 68K RS232 UART. The device driver configures and controls the UART hardware. TCK TDI TCKL2 TDO TDOL2 TMS TMSL2 TDIL2 TRST IC_LIST UIO SCAN18541T U16 SCAN18374T U23 SCAN18374T U22 END_IC_LIST TEST DEVELOPMENT SCAN18374T END_CHAIN Developing Test Vectors IPARRALLEL_CONNECTOR_LIST In a previous section, the concept and benefit of systeml board test partitioning was discussed. With the partitions defined in hardware, the next step is to develop tests corresponding to each partition. For the National demo application, separate tests were developed using the JTAG ATPG tool for each card and for the backplane. When applying embedded tests using SCAN EASE, each test is applied and evaluated separately. This enables SCAN EASE to provide passlfail results for each test. For the demo, this level of resolution was enough to allow boards to be replaced and then fully diagnosed later using an external tester. lEND_PARRALLEL_CONNECTOR_LIST NETLIST !NETname ADDISO ADDISl • 1/0 Card: Since all liD cards share identical boundary scan configurations, generating tests to cover every liD card required only one BNET file, one BSDL selection file and one constraint file. A unique Connection File was then created for each I/O card to provide the SCANPSC110F bridge address and LSP configuration. Samples of these files are shown in Figures 5 through 8. Internal Lagle: The internal logic boundary scan test verifies the structural integrity of boundary scan nets within each liD card. Some nets are shared between the internal logic chain (LSP2) and the backplane interface logic chain (LSP1). To access these shared nets, SCANPSC11 OF bridge is configured in the connection file to serially connect LSP1 and LSP2. The ATPG then views the LSP1 and LSP2 chains as a single chain and generates tests accordingly. ADDIS2 ADDIS3 ADDIS4 ADDIS5 ICname PINnumber; U16 42 U23 2 U23 Ul6 15 ; 41 U23 U23 16 ; U16 39 4 U23 5 U23 18 ; U16 38 U23 U23 7 19 ; U16 36 U23 8 U23 U16 21 ; U23 35 10 U23 22; FIGURE 5. Sample BNET File http://www.national.com 7-18 > Z SYNTAX_VERSION 1.2 DESIGN 10_INT_2 REVISION UNKNOWN SYNTAX_VERSION 1.2 DESIGN hierarc REVISION UNKNOWN TESTER_CHANNEL TAPl TESTER_CHANNEL TAP 1 Board address is decimal 2 (00000010) The address is the only item that changes when creating internal net test for each I/O card TAPl and TAP2 chains defined in BNET FROM TESTR (PART, ADDRESS, NAME OF LSPs 1-3) CASCADEl (PSCIIOF, 2, TAP1, TAP2, NONE) END_CHANNEL !FROM TESTR (PART, ADDRESS, NAME OF TAPS 1-3 FOR THIS BRIDGE) CASCADEl (PSCIIOF, 3, NONE, NONE, CASCADE2) CASCADE2 (PSCIIOF, 4, TAP1, TAP2, NONE) END_CHANNEL ..... I o w ........ FIGURE 9. Hierarchical Board Connection File • Processor Card: The processor card includes boundary scan nets, but also serves as the test master for the remainder of the system. This dual role dictates that separate internal processor card tests must be created for applications with an external tester versus application with the embedded tester. When applying embedded tests, the 1149.1 components which access and evaluate the processor's local bus cannot be included in the boundary scan test. Controlling the local bus with boundary scan would prevent the processor from communicating with board resources required to apply the tests. When applying tests with an external tester, the processor communication is not required except with dynamic memory which must be refreshed. Therefore, the local bus boundary scan nets can be tested. FIGURE 6. Sample Connection File PRlMARLIO N; ! input tied to GND - set to sense low OEl SO; ! input tied to Vee - set to sense high DSl S 1; !Reset Pin - must remain high ! during test RSTL D 1; Internal Logic (External Tester): The same process used to generate the internal logic tests for the I/O card was repeated to generate tests for the I/O card's internal logic nets. A BNET was created to include the boundary scan nets including the local bus nets; the selection file was created to point to the BSDL files; a constraint file was created to force or sense specific values; and a connection file was created, in this case, including all three LSPs in the chain. FIGURE 7. Sample Constraint File ! path to BSDL files for ! devices involved in test C:\bst\bstlib\ns182245.dsh C:\bst\bstlib\ns182373.dsh C:\bst\bstlib\ns18374.dsh C:\bst\bstlib\ns18541.dsh C:\bst\bstlib\ns182541.dsh The processor card's auxiliary port logic (LSP3) contains a logic component connected between two boundary scan components. Therefore, testing the nets between these devices requires that signals pass through this component. A special list, called a cluster test, was generated to support this connection. To implement a cluster test, the user must provide a set of functional vectors for the cluster logic, in this case a single component. These functional vectors can range from a full functional vector set to only those vectors required to detect interconnect faults. For the JTAG Technologies ATPG tool, VIP, the functional patterns are passed into a post-process file called the APL file. The APL file is later compiled by the VIP tool to generate the test vectors. FIGURE 8. Sample BSDL Selection File Hierarchical Board Test: (only applies to board populating Con 6): This test verifies the same nets covered in the internal test, but includes an extra SCANPSC11 OF bridge device in the path between the I/O card and the backplane TAP. The extra SCANPSC110F bridge is handled in the connection file and all other input files are unchanged. The connection file is shown in Figure 9. Internal Logic (Internal Tester): This test is a subset of the external tester version. For the embedded test version, boundary scan device outputs which interface the processor local bus were disabled throughout the test. Forcing the boundary scan outputs to a high impedance state was handled in the constraint file. A portion of the constraint file is shown in Figure 10. 7-19 http://www.national.com II PRlMARY-IO N', 1 input tied to GND - set to sense low OEl SO; 1 input tied to Vee - set to sense high DSl S 1; 1 Reset Pin - must remain high during test RSTL D 1; 1 Local bus pin - forced to high impedance Z; CPUDO Z; CPUDl Z; CPUD2 Z; CPUD3 CPUD4 Z; CPUD5 Z; Z; CPUD6 NETLIST lNETname BP_AO BP_Al BP_A2 BP_A3 Configuration file for backplane test. FIGURE 10. Processor Card Internal Logic Constraint File • Backplane: With tests generated for each board, the only remaining step is to develop tests to evaluate the interconnects between boards. For the JTAG Technologies VIP tool, a backplane test is viewed as just another board test. A BNET file for the boundary scan backplane nets and a connection file are created to indicate the SCANPSC110F bridges and LSPs containing components which interface these nets. In the case of the National demo, each card's backplane interface logic was connected to the SCANPSC110F bridges' LSP1. The backplane test connection file and BNET file are shown in Figures 11 and 12. SYNTAX_VERSION 1.2 DESIGN BCKPLN REVISION UNKNOWN TESTER_CHANNEL TAPl lFROM TESTR (PART, ADDRESS, NAME OF TAPS 1-3 lFOR THIS BRIDGE) MULTIDROP1 (PSC110F, 1, TAP1, NONE, NONE) !processor card MULTIDROP2 (PSCnOF, 2, TAP2, NONE, NONE) 1I/0 card 1 MULTIDROP3 (PSCnOF, 3, TAP3, NONE, NONE) lI/O card 2 END_CHANNEL FIGURE 12. Backplane Connection File 1 I/O Card 2 CHAIN TAP3 TCK TCKL3 TDI TDIL3 TDO TDOL3 TMS TMSL3 TRST IC_LIST U324 SCAN182245A SCAN18254LA U328 SCAN182373A U326 END_IC_LIST END_CHAIN lPARRALLEL_CONNECTOR_LIST FIGURE 11. Backplane BNET File http://www.national.com PINnumber; 25 55 55 ; 24 53 53 ; 22 52 52 ; 21 50 FIGURE 11. Backplane BNET File (Continued) continues •••• END_IC_LIST END_CHAIN ICname un U126 U326 un U126 U326 un U126 U326 un U126 Embedding the Test Vectors At this point, the hardware design is complete, the tests have been generated and the SCAN EASE code has been integrated into the system. The last step is to embed the test vectors into the system memory. This action requires two phases. First, the vectors must be converted from the ATPG tool's output file format to EVF. The JTAG Technologies VIP tool generates test patterns in a unique file format, called the pattern format (PAT). To translate the PAT files into EVF files, the SCAN EASE EmbedPrep tool provides a PAT to EVF compiler. The compiler, called PAT2EVF, is an executable file which runs on a PC or workstation. Each PAT file, representing a single test, is entered as an input to the compiler. PAT2EVF also prompts the user for information regarding the test name, test type and date. The test name, test type and date are included in the EVF's file header, which is later used by SCAN EASE to associate pass/fail status with the specific test. 7-20 With each PAT file converted to a corresponding EVF file, the next action required is to actually embed the vectors into memory. For the demo application, an EPROM programmer was used to embed each EVF file into the processor card's EPROM (the same PROM which contained the SCAN EASE EmbedTest code). EmbedTest uses a single locate statement to point to the embedded EVF vectors. Therefore, the separate EVF files must be appended together before programming the EPROM. EmbedTest uses the file header to determine where each separate EVF file starts and ends within this single, appended EVF file. TEST APPLICATION AND FAILURE DIAGNOSTICS At all stages of the demonstration system's life cycle, a combination of external and internal tests were performed. For PCB prototyping and board/system manufacturing test, an external test was applied, followed by an embedded test. For field level test, the opposite order was followed. The system was tested using the embedded tester and then, if necessary, tested using the external tester. The order of testing was dependent on the number of failures expected and the ability to diagnose failures with the embedded versus external test methods. During prototyping and manufacturing, each PCB (cards and backplane) is tested for the first time. Therefore, these stages have the highest occurrence of PCB interconnect failures. For the demo application, external testing provided a quick test application and access to the JTAG Technologies diagnostic tool. With this tool, boundary scan failures were diagnosed automatically to the pin and/or net level. This extremely tight resolution facilitated board repairs. Once the failures were resolved, the embedded tests were applied to confirm correct operation of the embedded test routines and to enable execution of the non-boundary scan, functional test routines. During field level test of the demo system, the objective was to quickly confirm that the interconnects were sound and that the system was functioning. Since the system was already thoroughly tested in manufacturing, the likelihood of a failure was very low. For this reason, the embedded self-test was an ideal method of testing the system. For most field applications, the level of field test resolution is at the board or SUb-system level. The goal in the field is to minimize system down time. If a failure is found, the board or sub-system is removed, replaced and retested. Depending on the cost, the board or SUb-system is discarded or sent back to a repair depot. A similar goal was used for the demo system. With a separate test for each demo card and for the backplane, SCAN EASE was able to provide pass/ fail diagnostics to the card/backplane level. If a failure was found, three options were available: • Card Removal: The most simple option was to replace the card with a spare and diagnose the failure at the factory using an external tester. 7-21 • Embedded Diagnostics: SCAN EASE supports serial communication with the National demo system. With this link, new tests are downloaded to system RAM. These tests offer tighter diagnostic resolution than the card-level tests which are embedded in system ROM and applied during power on self-test. For example, the power on test simply shows that the card is failing. The downloaded tests may view a specific connection between devices on the card to determine which internal card connections are failing. • Off-line, Pin Level Diagnostics: To provide pin level diagnostics for failing demo cards, an external tester and off-line diagnostics tool was utilized. The connection was made on the processor card to disable the embedded tester and provide access to the entire system. Since the embedded and external testers were connected at the same hardware location and since the embedded/external tests were identical, the embedded failures were repeatable on the external tester. For a system which does not provide external tester access, an alternative method of running off-line, pin level diagnostics is to use the datalogging option and serial communication capability provided with SCAN EASE to upload failing vectors to a file. This file is the converted to a format that is readable with an off-line tool. BOUNDARY SCAN BENEFITS REALIZED WITH THE NATIONAL DEMO APPLICATION Prototyplng Boards and System For the initial hardware debug, boundary scan proved to be a tremendous time saver. It eliminated the structural faults which are often very difficult and time consuming to debug using functional techniques. Once we were sure that the components were effectively placed on each PCB, we were able to focus our efforts on the primary objective of debugging functional and timing related problems. Manufacturing Process Verification Boundary scan provided a means of testing the interconnects for the entire system. With the use of the SCANPSC11 OF bridge on each card, tests were applied using a single, system wide tester connector, but partitioned for each card and the backplane. Boundary scan enabled efficient failure detection, diagnosis to the pin/net level and PCB repair. Field Level System Test and Diagnostics The National demonstration system is transported and presented all over the world. Therefore, the ability to test and resolve failures in the field was a key requirement of the test capability. With the ability to embed boundary scan test control within the system, the system interconnects were easily verified prior to each functional presentation. Additionally, remote access to the boundary scan vectors and test application code enabled test downloading and result evaluation to occur using a laptop computer. http://www.national.com • ..... 0') co National Semiconductor Application Note 891 John Andrews :Z Non-Contact Test Access < for Surface Mount Technology IEEE 1149.1-1990 ABSTRACT Mechanical and chemical process challenges initially limited acceptance of surface mount technology (SMT). As those challenges have been overcome, another obstacle has become apparent: electronic test access. Through-hole components on a 100 mil grid allowed physical aceess. SMT which has provided new levels of packing density has also denied physical test access. To overcome this challenge, the Institute of Electrical and Electronics Engineers (IEEE) has sponsored a new standard, IEEE 1149.1-1990, the Standard Test Access Port and Boundary-Scan Architecture. THE SMT ASSEMBLY CHALLENGE The use of SMT has required the refinement of several technologies including: photolithographic improvements in printed circuit etching, computer aided layout to support routing the large number of interconnects, and soldering to allow devices to be attached to first one and then the reverse side of the printed wiring board (PWB) without through-hole mechanical capture. Equipment to pick and place fragile SMT components with adequate alignment to the prepared pad area was needed to assure high yield assembly. Optical alignment systems replaced the open loop equipment used to assemble boards with dual-in-line packages. The technology has matured. SMT has gained wide acceptance. TRADITIONAL DEFECT DETECTION, DEFECT ISOLATION A high yield assembly process, always a target, is important for SMT printed circuit cards because it can be difficult to isolate faults. There is risk of assembly damage during repair. If an incorrect diagnosis results in an unnecessary repair, not only are repair costs higher than necessary, but the risk of damage increases. Bed-of-Nails test fixtures such as shown in Figure 1 have provided test access for over twenty years. These fixtures have at least one test probe per IC pin to provide access for printed circuit continuity checking. Low voltage PWB interconnect continuity tests are usually run before applying full power to the PWB. Each connection point on each network is checked for continuity to all expected connections. In addition, by forcing a sequence of bits onto each output pin with the bed-of-nails and then reading the signal received on every other net, it is possible to detect nets that are shorted together and often to tell which two nets are shorted. Once interconnection defects have been isolated and repaired, it has been common practice to use the bed-of-nails to drive each net of the fully powered board to test each integrated circuit on the assembly. For very simple ICs such test patterns were readily developed. A few microseconds were often adequate to determine that a simple IC was functioning correctly. During these functional tests, the electrical connection of the IC to the printed circuit board was checked as an integral side effect of the test. TL/F/11568-1 FIGURE 1. Traditional Bed-ot-Nails PCB Test Access Method, Now Challenged by Shrinking Physical Contact Possibilities Forcing a net with a bed-of-nails contact often required backdriving an IC's output. It might be necessary to force several hundred milliamperes into an IC's output to force a network to the opposite logic level. Backdriving IC outputs does not improve component lifetime. As IC complexity has grown, it has taken more test vectors and therefore required more time backdriving IC outputs. As SMT allowed packing density to grow, printed circuit layout software began to appear with features that allowed physical access to continue with traditional bed-of-nails testing. Figure 2 shows a portion of a layout that supports continued access. While supporting test access to allow defects to be detected, this defeated the advantage of SMT: higher packaging density. In addition, layout software became more complex as it was used to help overcome access problems. TL/F/11568-2 FIGURE 2. Despite Shrinking Component Sizes, Some Users Have Kept Large Feature-Sized Etch to Continue to Support Physical Access To support physical access some manufactures began using bed-of-nails fixtures that could contact both sides of a PWB. One user, in a personal communication, reported that these fixtures were so fragile that they might need to be repaired after testing as few as ten SMT printed circuit cards. And the time to develop such fixtures often extended beyond system development time and delayed the start of high volume production. Some users have reported that developing an SMT bed-of-nails fixture added 10% to their board development cost. Paper first published at Surface Mount International, 1992. http://www.national.com 7-22 IEEE BOUNDARY-SCAN TEST ACCESS Toward TOO IEEE 1149.1 was defined to replace the test access provided by a bed-of-nails test fixture. Figure 3 shows an idealized concept of what was needed. As shown, a scan cell (SC) is located at each input and at each output pin. An output SC cell must be able, in test mode, to force the logic state of its output pin without regard to the state of the system logic. Similarly, each input SC must be able to monitor the signal on its input pin. IEEE 1149.1 was developed to provide this drive/sense capability using, not external test probes, but internal test circuits. ...., ..., From System logic ~~------------------~--------~, M2 ~ r-f-~I----'---""; I I , - - - ~--~ ___ ! F2 I I , ji'---! Update From TOI TLlF/l1S68-4 Toward TOO From System logic Update From TOI TL/F/l1S68-S TOI TCK TMS FIGURE 4. With IEEE 1149.1 I/O Pins May Capture the Data Arriving at a Pin and They May Be Used to Control Output Pins. Test Circuits Such as These May Also Test Internal System LogiC. Circuits Such as These are Added to All System Pins TOO TLlF/l1S68-3 FIGURE 3. Bed-of-Nails Test Access Has Been Replaced by Adding Embedded Test Probes to Each IC Input and by Providing Test Drivers at Each Output. Driving Outputs and Sampling Inputs is Called EXTEXT data into an instruction register. With the flexibility provided by an instruction register, IEEE 1149.1 is able to support an almost unlimited number of optional test features. As its name implies, boundary scan provides a scan path around the boundary of an IC as shown in Figure 3. Scan test access is a methodology that allows each IC to provide test access from within the IC itself, not from an external array of physical probes. In 1149.1 the ability to drive test values onto output pins and to capture input logic states using the test logic is called EXTEST for external test. Most interconnect faults may be detected. For example, if a surface mount IC has a lead that is not attached to the printed circuit module as shown in Figure 5, the fault can be detected. Assume that this is an output, if the boundary-scan cell at that pin attempts to force the connected network, there will no response on the inputs that should be driven. The input boundary-scan cells of other ICs will detect a defect when they sample their input net. SILICON NAILS Figure 4 shows an example of the kind of simple circuits needed to sample IC inputs and to replace the normal, mission mode drive values with test values. At each input we need a means for capturing the input signal and then shifting it out for external examation by automated test euuipment (ATE). This input circuit has shown in dashed lines some optional logic that will be discussed later. The typical output boundary scan circuit is able, with limited external control signals, to become the source of the logic state that will drive the external interconnections. This is a solution to the simple problem of driving and sensing printed circuit board interconnections to detect process defects. As shown in Figure 3, a test access port (TAP) controller is located in each IC to allow the ATE to control the boundary scan cells. The operation of the TAP controller and the implementation of its instructions have been described in detail in the IEEE standard.(1) The TAP has four dedicated test pins: Test Data In (TOI), Test Data Out (TOO), Test Clock (TCK), and Test Mode Select (TMS). TOI and TOO are used to shift test data in and out of each 1149.1-compliant IC. TL/F/l1S68-6 FIGURE 5. Lifted IC Leads, Not Accessible with Bed-ot-Nalls by the Embedded Probes ot the Driving and Receiving IC, If they Implement Boundary-Scan Before 1149.1, to force the output driver in the IC with the lifted pin required that the automated test equipment generate a sequence of test vectors to force the inputs of the IC. This pattern would indirectly control the IC output. Controlling IC outputs from the inputs requires a complete functional understanding of the IC. This points out another advantage of IEEE 1149.1: PWB interconnect test programs can be developed without a detailed understanding of the function of each IC on the PWB. This simplification has resulted in test development time reductions that have compressed schedules from months to as little as one day'(2) TCK shifts the data through each chip, while TMS controls a 16-state finite state machine in each IC. The state machine determines what each IC is doing. For example, an IC may be sampling its input, shifting data or driving outputs. In fact, the TMS input together with the TAP controller can shift TOI 7-23 http://www.national.com • ..... ~ Z z Co Q) ..... L::::===~-vcc ......- - - - - - - - O l h . r pins Tl/F/11554-1 FIGURE 1 - Isolation Circuitry plane over a range of backplane voltages from O.OV to 5.5V. Isolation circuitry provides another option for board and backplane isolation. Again, this solution will provide the necessary ~ pin biasing to assure a level of 2.0V or to assure OE maintains ~50% of Vee as Vee powers up or down for guaranteed high impedance interface to the backplane. - The design of Circuit-1 below provides> 50% of Vee for the OE pin throughout the Vee ramp then switches to a voltage level of a logic high once the ACOO reaches its turn-on Vee. After board insertion, the MAINT switch is opened and the LOGIC pin becomes the DE control. Live insertion or removal for this solution requires a technician to manually operate the maintenance switch (MAINT) to ensure proper biasing of OE and boardbackplane isolation. VID VID is a voltage that is measured on an input pin at a current loading of 1.9 p.A in a power off condition such as when Vee and the non-measurement pins are at O.OV. The curve of VID vs liD in Figure 2 shows the current leakage of a typical ABT input pin. The ABT inputs limit loading leakage to < 1.9 p.A over an input voltage range from OV to 5.5V. 0.50 0.40 ... 0.30 .3 Clrcult-1 Circuit Board .;! 0.20 • Backplane 0.10 •• 0.00 5k V- I-'- t - ro Io"" r-- TL/F/11554-4 FIGURE 2 LOGIC - "'' 1 ---------------------. The curve of VZZ vs IZZ in Figure 3 shows the current leakage of a typical ABT input/output (1/0) pin and how it loads a bus or backplane over a range of bus voltages from O.OV to 5.5V. 1/0 pin configurations exhibit combined current characteristics from components of the input circuitry and output circuitry. ABT 1/0 pins specify loading leakage at 100 p.A max. with a typical loading leakage at 3 p.A at room temperature. TL/F/11554-2 SPECIFICATIONS AND THEIR CONTRIBUTION TO FAULT TOLERANT SYSTEMS DC specifications and their characteristic input/ output curves help map out the loading effects of an interface device on bus or backplane. The loading characteristics of typical ABT input and output pins are shown in Figures 2-4. National Semiconductor's ABT245 characteristic curves are used for this demonstration. - IZZ IZZ is a current that is measured on an output pin at a voltage of 5.5V during a power off condition such as when Vee and the non-measurement pins are at O.OV. ABT245 10.0 B.O Powered Down Backplane Isolation The power down leakage characteristics of a bus interface device assist the interface board designer in understanding the effects of loading on his backplane. During live insertion, the board is not powered up and the instantaneous loading upon contact would look like the curves of VID and IZZ in Figures 2 and 3. Typically, loading leakages in the + 200 p.A range begin to affect the VOHIVOL levels in a backplane application. The VID and IZZ curves illustrate the loading effects on the back- ... 6.0 _N 4.0 .3 J 2.0 0.0 J/ o 3 vZZ (v) TLlF/11554-5 FIGURE 3 7-27 http://www.national.com fI . ~ co co z :> 5.00 >0 ... 4.95 4.90 -0.5 '---'----L_ _-'---'-_ _' - - - ' - - - ' -_ _.l...-....l....---L---l o 3 o ..... ~ .... ./ " _... K h 3 Vee (V) Vee (V) TL/F/11554-7 TL/F/11554-8 FIGURE 5. Bus High Effects http://www.national.com 1 FIGURE 6. Bus Low Effects 7 -28 l> SUMMARY ABT interface devices offer glitch free power cycling provided that the DE pin is held at the device specified VIH (2.0V)· level. In practice, DE will provide an output high impedance condition if DE maintains a level of :2!50% of Vee through the OV to 5.5V range. In fact, the DE pin circuitry gains control once Vee is :2! 1.0V. Interface device output characteristics for Vee levels before 1.0V are controlled through the isolation circuitry discussed earlier. ABT designs and specifications recognize the need for more fault tolerant interface devices. Uve insertion guarantees such as VID/IZZ, IDZLlH and glitch free power cycling all promote better system uptime, especially for telecom switching environments. Together with extended AC specifications that reduce the need for complex performance evaluations, ABT live insertion guarantees allow designers to spend more time on total system performance features and not worry about the logic. z c» 00 ..... fII 7-29 http://www.national.com ~ co coI Z z ..... MEMORY MAP o o w The G.Host maps functions to memory address in Table I. TABLE I. Memory Map Address Space (hexadecimal) AM29200 Mlcrocontro"er Selection Maximum Size G.Host Assignment AM29200 AM29205 ROM BankO ROM Bank 1 ROM Bank2 Boot Code Application Code Self-Test Port 64 Mbyte Bank Size User Set 12 Mbyte Bank Size User Set DRAM Data Memory 64 Mbyte 12 Mbyte Mapped DRAM Not Used 16 Mbyte 16 Mbyte 6000000063FF FFFF VDRAM Transfers Not Used 64 Mbyte 80000000800000FC Internal Periperal Registers (See the following table for addresses) 9000000090FF FFFF PIA Area 0 Not Used 16 Mbyte 4 Mbyte 9100000091FF FFFF PIA Area 1 Not Used 16 Mbyte 4 Mbyte 9200000092FF FFFF PIA Area 2 Not Used 16 Mbyte 9300000093FF FFFF PIA Area 3 Not Used 16 Mbyte 9400000094FF FFFF PIA Area 4 Not Used 16 Mbyte 9500000090FF FFFF PIA Area 5 Not Used 16 Mbyte A" Others Reserved 0000000003FF FFFF All ROM Banks 4000000043FF FFFF All DRAM Banks 5000000050FF FFFF All Mapped DRAM PIO CONTROL LINE ASSIGNMENTS TABLE II. PIO Control Line Assignments The G.Host assigns the peripheral input/output control lines of the AM29200 family microcontrollers as follows: PIO Line 7-39 G.Host Function Data Direction PI015 Serial Port CTS Input PI014 Serial Port RTS Output PI013-PI08 Spares PI07-PIOO (Not used) (Not yet assigned) http://www.national.com ,. AN·1003 -:r 1 JTAG3[1..7] :I ~ o :I !2. 8 3 Serial S e r I I/o POWER J JTAG1[1 .. 5] • ~T A G 1 GHOSTpwr.sch Data_HI[ 16 .. 31] ADDR[0 .. 23] ADDR[0 .. 23] JTAG2[1..6] JTAG3[1 .. 7] t.4SCctl[I .. 15] Data_HI[ 16 .. 31] , ADDR[0 .. 23] JTAG2[1..6] , , ~ ANALYZER INTERFACE I'" ~ ~ JTAG2[1 .. 6] • ADDR[0 .. 23] : t.4Et.4ctl[ 1.. 16] Data_HI[ 16 .. 31] - t.4B[0 .. 12] ~ I~ t.4Et.4ctl[I .. 16] ~ ADDR[0 .. 23] - GHOST JTG.sch CPU Block Ser_10[1 .. 4] DRAD[0 .. 12] t.4SCctl[ 1.. 15] Data_HI[ 16 .. 31] If' ~ -- , t.4SCctl[I .. 15] t.4Et.4ctl[I .. 16] o I'" t.4Et.4ctl[I .. 16] JTAG2[1..6] ] 4 h t.4Et.4ctl[I .. 16] JTAG1[1 .. 5] • ~5 1 JTAG3[1 .. 7] • DatILHI[ 16 .. 31] 1 JTAG Interface [ J,.. I [ 0 ] I ~ Ser_10[1 .. 4] GHOSTSER.sch System t.4emory Block ~ .t.4B[0 .. 12] ~DATA[0 .. 31] GHOSTt.4Et.4.sch PP[I .. ll] PD[I .. 8] ~Data_LO[0 .. 15] GHOSThpl.SCH t.4ACH I/O Parallel I/o DRAD[0 .. 12] DRAD[0 .. 12] JTAG3[1 .. 7] • t.4B[0 .. 12] ~ ADDR[0 .. 23] ~ t.4B[0 .. 12] DATA[0 .. 31] ~ £ ~ ~ DatILHI[ 16 .. 31] Data_LO[0 .. 15] ~ DatILLO[0 .. 15] ~ HSCctL[ 1.. 15[ t.4Et.4ctl[I .. 16] DATA[0 .. 31] PD[I .. 8] PD[I .. 8] ~ :. PD[I .. 8] " :. DatILLO[0 .. 15] HSCctL[ 1.. 15] PP[I .. 11] pp[ 1..11] pp[ 1.. 11] PIActl[I .. 4] PIActl[1..4] ~ PP[1..11] GHOSTPER.sch PIActl[I .. 4] JTAG3[1 .. 7] ... GHOSTIO.sch GHOSTCPU .sch TL/F/12119-1 FIGURE 2. Top Level Block Diagram ADDR[O .. 23] ~E~ctl[ 1.. 16] Data_HI[ 16 •• 31] Data_LO[O .• lS] 29200 ~ICRO 29205 ADDR[0 .. 23] ... ~ ADDR[0:23] ~EMctl[1:16] ~ ~E~ctl[1..16] ... DatLHI[16 .• 31] --.J I.....( ADDR[O .. 23] ... ~E~ctl[ 1.. 16] ~ICRO Data HI[16:31] DatLHI[16 .. 31] Data LO[0:15]~ DatLLO[O •. lS] ~SCctl[1..1S] ~SCctl[ 1•• 15] ~SCctl[ 1: 15] ~ "'II1II pp[ 1.. 11] PP[1..11] "'II1II PIActl[1..4] PP[l: 11] ~ PIActl[l:4] ~ JTAG2[1:6] ~ Ser_10[1:4] ~ PIActl[1..4] "'II1II JTAG2[1..6] Ser _lOr 1. .4] Ser _lOr 1.. 4] "'II1II GHOST200.sch GHOST20S.sch ,......( ~SCctl[1..1S] PP[ 1..11] PIActl[1..4j ::T i JTAG2[1..6] Ser _lOr 1..4] :::l TLlF/12119-2 0> g- FIGURE 3. CPU Block :::l E1.. (-) o 3 EOO~·N\1 II (f) o o ...- C') z N . I C'> ~ aN~ ftttaN~ IiitaN~ r.tt-< ~~;~ y~al~ Ml008 ¥.!- ~~'J'N sl~nr 9wnr ll~'1r %101- Il~V1r ° I~H~ln ~~ 1 0000 ~~~~ ~ 'l~~1r '" J ... ,1 " ~ ~ '3J~J~31NI ~alY1n~3 http://www.national.com 7-42 i ~ ... I Cl N u.. ....::J .... t ~;:.;:.;:. 0::0::0::0:: ~~ ~ lflH Ii~va Of Iii 6ZIH 1i~IiQ 8ZIH-v~va lZIH ii~Va 9lIH "1"0 SZIH "1"0 tllH If 01 Of 01 Ii~va 01 II ~ I fl 91 v~vo fZIH "1"0 ~ZIH "1"0 IZIH "100 OZIH "100 611H "100 BIIH "100 LlIH "1"0 911H "1"0 BI 61 OZ I~ ~~ fZ H SZ ~ ~ ~ ~ ~ ~ ~~ ~ ~ ~ - _OO'lCIJr-..IOOlO ...... C:O ,.... O'IO'ICIJ~~~~~O'IO'I~~NN ~~~. ,....0000,....00 ...... I~I;;;I~I~I";I";I~I:;:I;;;I~I:;:I~I:;:I:;; ~~~~~ ci~~~~~j~ ~~~'" I~ '" 6~01 B~OI aOI 9lOi S~OI HOI nOI ~~Ol IZOI O~OI 6101 BIOI LIOI 9101 I~g_. I~ .~ • v 7-43 http://www.national.com AN-1003 ';r :::: i ~~L <. PP 1..11 l..ll] M~Lu •• :l ~~ ~~ ~ o ::>::> ::>::>::> ::>::>::> ::>::> _.... "''''' ~;~~ ~~k --- ~ < D_t_ HI 16 .. 31 7- ~ '\ j < D.t. LO 0.• 15 7- HI31 HI30 HI29 HI28 HI27 HI26 HI25 HI24 H 45 18 139 69 Dot •. Oat_ O_t_ D.t. O.t. .t. Dot. _to HI23 HI22 HI 1 HI20 H 19 HI 8 HI17 HI16 201 05 8 06 90 7 3 34 D_t_ L015 014 _t_ 013 D_t_ L012 D_t_ 011 D_t. LO 0 D_t. L09 D.t. 8 61 11 124 137 1 65 175 0 Oat_ D_t_ D.t_ D_t. O_t. D_t. D_t_ Dot. 202 1 6 207 91 10 36 39 ~t. 0;;; -; <> ~ .:J .!l -...I .j,. ~ ADDR 0.. 23 ".. ,6; D_t_ D_t_ O_t_ _t_ Data O_t_ D_t. D.t. L07 L06 LOS L04 0 L02 LOI LOO AODRU ADDR12 ADDR10 ADDR9 ADOR8 ADDR7 ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDRI 16 72 126 165 21 174 49 189 110 60 125 31 136 .y' ~1~l~l~l~l~Ud~kl~l~M~~ ~hl!~ld~§l~ ~ 0.. 0..0..0.. "'.., .... ",,,,N ...."'N "''''' "'''''''' N", """'- "'''' ... O~~1D IV1U ..... V1~V1V1Vl~V'lV13:;I:...J~:;;: r> 'T O-N"'<>-N"'n~O 1>- ~~~~~~~~ '" -- N _NNNN.~~~ DATA 23 DATA22 DATA21 DATA20 DATA19 DATA18 DATA17 ATA16 1015 1014 1013 1012 1011 1010 109 108 015 014 013 012 011 010 09 08 140 102 159 64 171 195 169 108 DATA 15 IlATA14 DATA13 DATA12 DATAll OATA10 OAT19 TA8 07 06 05 04 03 02 01 DO 138 173 162 142 101 141 100 54 OATA7 OATA6 DATA5 OATA4 DATA3 DATA2 DATAl DATAO 114 PIASCO 119 PIASCI 164 PIAOE PIAWE 197 PIAetil PIAell2 PIAel13 PIAel14 a..cn~ CD c:( 107 106 IDS 104 103 102 IDI 100 AU A12 AID A9 A8 A7 A6 AS A4 A3 ~ AI - .., "'c ~~ .... o oooo~occcccccc ~~ ~~~~~~~uuuu '" "''''N "'en ..,.., """'.., Wzo..~ ::Iwcnu ~~~~oooooooooooooooooooooooooooo -N N"'''' "' .... "" _ - '"- '!g1'I11111'l11·""· "'~~1q~q~~1q'iii ~een~ l~l~rrl~! Vce ~;: :;; :::.:::. ::> ::> ::>'" :;:::;:; "'::> :::.'" "'''' ::>::> :::.::> "'''' !! ::E:::::I::::E::::E ::::E::::E::::I::::::E o 8 16 G ADG433 1 = ON ~SCetl[1..15] "\ q 100 kP" ~"'" ~_ J5 r--:- 4 RPSD '-O-NI"") 168 122 6 191 57 8 170 ORAD12 192 ORAOll 66 DAR010 153 ORA09 103 M~ 200 DARD7 149 152 150 118 _000::> ~A~ 148 DRA012 ORADll DRAD10 o 9 G I 10 l=orr ~SCetl16 Vee U18C AOG433 i p...- 1:;;0><_'" g~!g~ i ~~~~~ ~PIAetll ORAD[O .. 12] .. 4 DRAD 0 .. 12 "'"< > JTAG3 1.. 7 > > ~ACH465 I" 3 RP2C JTAG35 '2 2 RP2B '3 I kP 3 1 kP ~~ 6 7 8 > > DATA 0.. 3 PIAetl[I .. 4] DRA09 DRAD8 RAD7 DRAD6 DRAD5 DRA04 DRAD3 DRAD2 g!~g~ 0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z0 z -~. 1..15 48 023 022 021 020 019 018 017 016 CON <,~SCell OATA31 OATA30 OATA29 OATA28 OATA27 OATA26 DATA25 DATA24 1023 1022 1021 1020 1019 1018 1017 1016 ~ O-N ~Et.tctl[I .. 16] 47 133 109 96 113 193 46 1 :g~~ ~~~~ a...~~~~~~ ~~~~~~~~CD~~~~ ~ 0.. 12 DATA[O •• 3] U3 __ >~>S>S>S>~>~>tJ>tl>S>tJ>S>~>S>S>S>S>8>8>S>S>S>tl>S>S CDV1U ..... ~ > ~ o ::> ~ o o 3 UU ADDRI9 ADDRI8 ADDRI7 ADDRI6 ADDRIS ADDRU ADDR13 ADDRI2 ADDRII ADDR I 0 ADDR9 ADDR8 ~~~~~ ADDRS ADDR4 ADDR3 ADDR2 17 48 I 2 3 • 5 6 7 18 19 AI7 AI6 A IS AI4 AI3 AI2 All Al0 A9 A8 A7 A6 ~~~! 22 23 24 25 ~!~ BYTE RESET ~E~ctl[I:16] VCC 12 U.A .5 DOIS/A-I .3 DOl • • , 0013 39 0012 ~3;';6-";;";'T'A?T-. 0011i-'3'"".-";;";'T'.,.DO I 0 """32""'-"'niTA?< 009 "3'""0--;;;;""008 .....,..,.4,....-"";;";"""~ ~~~ :~ A3 A2 AI AO DOS 38 004 "3'""S-";;7T"Q 003 """"33;---;;-;y..-;-• . 002 31 a 19 AND 2 N.C. N.C. N.C. N.C. N.C. IS RY!SY 22VIO BWAIT I~ I ROMOE I RCELO 2 3 AI. AI3 AI2 All AIO A9 A8 A7 A6 AS H A3 A2 Al AO 18 19 20 21 22 23 24 2S MBIO JTAG26 DATA31 DATA30 DATA29 DATA28 DATA27 DATA26 DATA2S DATA2. r- Vcc ADDRI6 ADDRIS ADDR14 ADDRI3 ADDR12 ADDRII ADDRIO ADDR9 ADDR8 ADDR7 ADDR6 ADDRS ADDR4 ADDR3 ADDR2 MEMCTL1., 22VIO UIS AI7 A16 A IS ~Gl 12 "5ATAi9 Dllii"8 iiAT"Ai7 .S DATAIS DOIS/A-I 43 DATAU DOU 41 DATA 13 0013 39 OATA12 0012 36 DATAl 1 DQll 3. DATAIO DOlO 32 DATA9 009 30 DATA8 008. DATA7 4 007 42 DATA6 D06 40 OATAS DOS 38 OATH 004 3S DATA3 D03 002 I-=--;;-;"T"'--DOl 000 ~ r-:-::-";':;:':;=~-~'II~ iiAiAi2 "1iAiA2i" DATAiO ~~ J AIO All AI2 AI3 AU AIS AI6 AI7 AlB DATA23 Vcc BYTE RESET - ) ../ RO~CSO (J) 17 .8 I nI ~Et.4ctl[I:16] MBI2 OR2J ;,. ADDRI9 ADDR18 ADDR17 II -< ~ ~B[0:12] 16 18 -..J ::::TL1 ~B[0:12] AOOR[O:23] ~ OATA[O:31J ) U.D DOI"""29-"'niT..-;cDOO 10 13 14 16 I: t; ...f -< iiA'iAi6 LVcc DIRI DIR2 Vcc Vcc Vcc Vcc SCAN1B24ST / WE~ CE. 28 DE V SS VSS - 46 27 At.429r.DOB TLlF/12119-7 FIGURE 8. FLASH Memory ~ ~ JTAG LINK ORAo[a .. 12) IDRADIO •• 12) Vee Vcc '"'" '" i 000 001"1"'0-002 13 003 ......- 16 004 20 DOS 23 006 25 "'I'" "'''' -'" 9 ~ G ~ ~ t\: ViR MB9 / Ull RAS CAS TOO TOI '----~Al0 VSS VSS L.::==::t~! g ~ L.:===:jtl!: '----------';.£-1 A15 N.C. L -_ _ _ _ _--'.l'-! A16 L-_ _ _ _ _ _ N.C. N.C. N.C. ~ Bl0 v ~_ _-!"!lU.l1-...- :111 t-t-----!~cL ::~ ....7;;-_ _~.e..L~ ~:~ ~'----¥!lg.;1-...- A17 ~-----~~~~ f4 ~ !~~ B21 B22 B23 ~ Vce U 13 Vee r~::t:=:m !~~ A27 B25 B26 A28 B28 3 B27 ~~e ~~~ ~O ~~-~!-I!~ gg~ ~~ ~g~:! ~~~ ~~-__+lLl !~ gg~ g~g t\. ~~-~H !~ GZ GND g~g '------"-'-IAI2 ----~AI3 N.C. N.C. N.C. N.C. 25 """&I..il.---l..>4 A7 ~~l!---+!~ A8 """·'lJLL.l...--..J..>4 A9 GND 1-.; ~ ~i8lLI.i...----L::!....IA10 ViR v ~ 1 CAS _.IVSS ~ =s- f 10 kP dvss ~ ~~3~ 14 N'C' 2 ~ ~~3.B 13 10kP -------l--21...I~ A24 _---1--""-'4 A25 ~--I-~~ A26 A27 A28 GZ t\. OIRl 0lR2 '" Vce Vee Vce ~ Vee ~: ~ ~~----!!.8J.!,ZL-' B17 B18 B24 B25 B26 B27 B28 GNO GND GNO eND eND eND eND eND __ '---- ,. ;-- c: L..... t:: 1-.., ~ SCAN 18245T v v. ~ViR ~RAS ~ CAS dvss ~ 3 ~~3~ 10 kP 4~~3?11 12 ~ 10 kP •• IVSS ~ N.C. N.C. N.C. A18 BU t7::----II.!l..Laj~ MCt.l84000 "' '-------< SCANI8245T L::====:ttJ!: ~ L.:======m!g ~\ ~ 1+4==:jlmTI::- :: ~ t-*"7_ _---I.!!ll.aJ1L_ ---!!!BC~AS~2___ r:::==t~t1 m i~~ ~ Ul0 t:: t:: t:: A 10 All VSS ' - -_ _ _ B24 "'-.I TOI VSS m B20~ MC_t.l8_4_000 L-_ _ _----!B::;:C::.:AS:::O_---.J TOO ~ CAS B17 B18 A18 ViR 21 ~RAS ~-----+--~ A20 "'-.I ~I~ D'JO [\. I I 007 MBO t.lB4 U9 N'C' N.C. N.C. N.C. IoICIoI84000 MCM84000 BCASI BCAS3 BRDbR BRD/WR 0.1.[0 .. 31) J ~"r...,oJ" :::l ao· WBr 0 - : 1 i j ) ' WB[0 .. 12j :::l TUF/12119-8 !!!.. o o FIGURE 9. DRAM (Data) Memory 3 eOO~-N\f II AN·1003 a 1 1 RP4A 14 ~ ~ o JTAG3[1:7] :l !!!. 83 Vee Vec ( JTAG3[1 :7] ..... .... '" '" PO[I:8] PO[I:8] ~ ......J!. ~ POI P02 P03 PD4 P05 PD6 PD7 PD8 ~- ~- , 55 53 52 50 49 47 46 44 43 ,...li ...... 1. 0) 42 41 39 38 36 35 33 32 30 AeK PP10 PP9 BUSY HIS TCK f.=.=- Al0 All A12 A13 Bl0 Bll B12 B13 <> A16 A17 A18 PP7 3 26 Vee - : 5 RP3E 10 kP 10 ~ ""it _ tji '"" '"" Q, ::~ B16 B17 B18 A20 A21 A22 A23 :~~ B20 B21 B22 B23 => A26 A27 A28 DIRI DIR2 Vee Vee Vec Vee :;~ B26 B27 B28 GNO GND GND GND GNO GNO GNO GNO a. ",7 PP8 PPll '" PP[I:I1] >- 3 RP4C 12 6 RP4F' 9 4.7 kP 4.7kP ' y L.~ f-o 14 2 .!f.3 ~ ~ 4 f-o J+.5 f-o BPOI BP02 BP03 BP04 BP05 BP06 BPD7 BPD8 2 4 5 7 8 10 11 13 18 6 19 7 20 8 21 9 22 10 23 11 24 ..!.L- Gi ~ G2 PROm 4.7 kP i9 TOO TO! ::~ 4.7 kP AUTom U19 ~ 4.7 kP 5 RP4E 10 '. STROBE ( 4.7 kP 2 RP4B 13 ' y ~ ~ 4 RP40 11 SCAN 18245T STROBE AUTOFD ~ ~ 18 19 ..4 22 ACK BUSY 24 II -hit' 25 13 OB25 Vee Vec "TItr 9 RP3F' 10 kP 1 RP5A 14 :tt I",7 r f-o U":'::"L,/ 6 it" Ta- -- .g. f-o ~ JJ... -- V 4 RP5D 11 UkP 4.7 kP 2 RP5B 13 5 RP5E 10 4.7 kP 4.7 kP 3 RP5C 12 6 RP5F' 9 'y y 4.7 kP , yy 4.7 kP TL/F/12119-9 FIGURE 10. Parallel Interface Vee 0.1 J.LF U5 16 rVee V+ V- Cl C2+ C2- T10UT TllN PI TXD RXD ~ 13 RllN Rl0UT RTS T20UT T21N h 12 Ser _102 10 Ser _103 Ser _104 CTS R21N -...j Ser _101 R20UT 151 J:,. co GND GND JTAG1[1..5] AX202 JTAG 1[ 1:5] Tt.4S JTAGll TDI JTAG12 TCK JTAG13 TDD JTAG14 JTAG15 TRST D825 TUF/12119-10 FIGURE 11. Serial Port :T :::: j :::l acr :::l ~ g 3 eOO~·N\f II AN-1003 '::f' 1 :::l a(:;- l MSCctl[ 1•• 15] MEMctl[1..16] ~ - < MSCctill J2 ~In.. ADDR[0 •• 23] 210-3 h :::l ~ J> 3: 410---- :5 ~ (-) o 3 ~.=. 6~ ;..,:0; 7 ""8 ,.. 9""100..- ~ A - II 5 It-\.. ~ TRST rx TOIB8 TOOB8 TMSB TCKB U4C 1 - 171 1 1 INVERT "'I ~I ~ 3: 3: VI ~ ~ ~ 0- ~ :;::j 5~~6&El0 ~ 5 YO''' 100 kP 1 kP 5~P2El011 Vee -i- vuJ U6 RST - V ADDRO 1/ ADDR1 1/ ADDR2 1/ _ 12 ~ CE_ R/W STB AO A1 A2 DO ~D3 ,. ,.. ,... ,... OND ~~~:C PSC100F CD ~ tJ) CD I I I I :I::I::I::I: ;;~;;~ 26 25 TMSO GND TOO RDY INT D7 D6 D5 D4 23 22 21 F- S1 S2 S3 S4 S5 Vee TRST TMSB TCKB TOIB TOOB GND ~ 0 -vVee JTAG3[1..7] JTAG37 JTAG33 JTAG31 JTAG32 JTAG24 JTAG23 JTAG25 JTAG21 JTAG22 JTAG15 JTAG13 JTAGll JTAG14 J JTAG2 [1..61 ~ ......... JTAG3[1..7] -"'> JTAG2[1..6] "> JTAGl [1..5] ""> / -/ -/ -/_ JTAG1[1..5] ~ 6 ~P2I 9 .. " 1 kP ~ 7 ~P2G 8 ~ 19 18 17 16 15 so <> INTR3 1 kP 1 00 00 !!~ !!~ III III .. III I I I I :I::I: :I::I: ~ L--- < TOI TCK TMS1~ ~~ U4r V OE VI '" PSC110r r~~~ ~~K 4 5 6 7 8 9 10 11 i:/ 6 7 8 9 10 11 12 13 14 28 TDlE§ 27 TCKL3 26 25 TMSL3 24 TOOL3 23 TOIL2 22 TCKL2 GND ~ 20 TMSL2 19 TOOL2 TOIL 1 18 TCKL 1 17 TMSL1 16 TOOL 1 15 z "" 3: - i, (") 22Vl0 ~ ........ MSCctl[ 1..15] ") / I~INVERT 22V10 ~ 4R~2Pll yyy -..J In o L6 I RESET r-+ 22Vl0 Vee AND n U7 L...- VI 17 // U4E 10 I ~ 0 3: '" MEMCLK NN NN o~ N"" ~~ ,V------" Data HI[ 16 •. 31] ....... Data_HI[ 16 •• 31] TL/F/12119-11 FIGURE 12. JTAG Interface +5V Jl Vee l..:.o 1 51 0 2 ~powrR ~1 0 +5V vee r y n Vee vee r Vee Vee -.,J ~ Vee :T 1 TUF/12119-12 :l ao· FIGURE 13. Power Supply :l !!!. oo 3 £OO~-NV II AN-1003 ;;r i ::J ~ < -- t.tSCc\I[1:15) ) t.tEt.tctl[1:16) ) t.tSCc\I[1..15) o ::J "1 I ....... '"'"to,,,] ) ,., !!!. o 3 JP1 < AOOR[O •• 23) TllTl JP2 t.tEt.tdl[1..16) ~ " ~ LI JP5 AOORO AOOR1 ADDR2 ADDR3 ADDR4 ADDR5 ADDR6 ADDR7 ADDRB ADDR9 ADDR10 ADDR11 AD DR 12 ADDR 13 ADDR14 ADDR 15 ~ 1..8) -'PDi1:8l ....... en PO[ I\) JP4 < JP3 ./ JP6 Oa\LLO[O •• 15) Da\LLO[O: 15) ;:. < Da\LHI[ 16 •• 31) t.tS[O •• 12) OatLHI[16:31) ). ( PP[O: 12) > TL/F/12119-13 FIGURE 14. HP Logic Analyzer Interface tfI -o· :;(1) co .... National Semiconductor D) :s o l> Integration of Analog Test :s D) The application illustrated shows an ADC0858 monitoring system heat sink temperature, supply voltage and current limit, the tolerances for each being loaded into the onboard RAM. If an input exceeds its allowed range, an interrupt is triggered prompting the host microprocessor to adjust the tolerances, take other corrective action or simply datalog the failure. In this application, an LP2951 low drop-out regulator supplies reference grade power and the conversion voltage reference for the ADC0858. The four low power Op amps of a CMOS LMC660 scale the inputs to 2.5V and provide a railto-output voltage swing that optimizes the ADC0858's full scale conversion. A ± O.soC temperature accuracy is provided by an LM 135 temperature sensor. The 0.1 n resistor between CH6 and CH7 serves as a current monitor. The IEEE 1149.1 standard is a strictly digital standard and makes no provision for analog test. The IEEE 1149.4 working group has been formed to address the challenging task of developing analog and mixed signal test standards compatible with the existing digital standard. One solution available today is the ADC0858 Data Acquisition and Monitoring System. This device is an 8-bit programmable WATCHDOGTM that sequentially checks the voltage at each of its eight inputs, producing an interrupt when the voltage is outside a programmed window. Digital readings can be serially downloaded for evaluation. Device programming is accomplished through a serial data port. Since both device programming and data downloads are accomplished via their respective serial ports the device can be readily connected to an 1149.1 ring using either an Embedded Boundary Scan Controller, SCANPSC1 OOF or SCAN Hierarchical and Multidrop Addressable JTAG Port, SCANPSC110F Bridge. Vref vee 10kn 1--_ _ _ _-+-_..;T;.;.em;.;;:p~in~CHO (+) Heatsink Temperature Monitor . - - - - - t C H 1 (-) 1.28V T. Min. Adj. AoC08S8 SCANPSC 1oor r-------I 10kn I I Open Collector Data Out I----I~ Tol 2.SV CH2 +SV:l:S% Data In I + - - - - - t TOO 38kn 2.SV CH3 2.SV CH4 2.SV CHS +12V:l:S% Voltage Monitors Cs I + - - - - - t TMS 20kn -SV:l:S% 4.17kn 20kn -12V:l:S% ClK .+-----1 TCK . - - - - - - - - - - - - - - - - - - I C H 6 (+) DC Current t./onitor 0.1 n 1% Current Sense Resistor L . . . - - - - - - - - - - - - - - - - t C H 7 (-) GND TUF/11575-1 ADC0858CMJ/883 Monitors System Temperature, Voltage and Current 7-53 http://www.national.com 0" co -t (1) en - co -Lt) ; ttlNational Semiconductor "C c co ,.... Lt) co o ADC0851 and ADC0858 8-Bit Analog Data Acquisition and Monitoring Systems o c General Description < The ADC0851 and ADC0858 are 2 and 8 input analog data acquisition systems. They can function as conventional multiple input AID converters, automatic scanning AID converters or programmable analog "watchdog" systems. In "watchdog" mode they monitor analog inputs and determine whether these inputs are inside or outside user programmed window limits. This monitoring process takes place independent of the host processor. When any input falls outside of its programmed window limits, an interrupt is automatically generated which flags the processor; the chip can then be interrogated as to exactly which channels crossed which limits. The advantage of this approach is that its frees the processor from having to frequently monitor analog variables. It can consequently save having to insert many AID subroutine calls throughout real time application code. In control systems where many variables are continually being monitored this can significantly free up the processor, especially if the variables are DC or slow varying signals. The Auto AID conversion feature allows the device to scan through selected input channels, performing an AID conversion on each channel without the need to select a new channel after each conversion. Key Specifications • • • • • Resolution Total error Low power Conversion time Limit comparison time 8 Bits ± 112 LSB or ± 1 LSB 50 mW 18 ,...s/Channel 2,...s/Limit Features • Watchdog operation signals processor when any channel is outside user programmed window limits • Frees microprocessor from continually monitoring analog signals and simplifies applications software • 2 (ADC0851) or 8 (ADC0858) analog input channels • Single ended or differential input pairs • COM input for DC offsetting of input voltage • 4 (ADC0851) and 16 (ADC0858), 8-bit programmable limits • NSC MICROWIRETM interface • Power fail detection • Auto AID conversion feature • Single 5V supply • Window limits are user programmable via serial interface Applications • Instrumentation monitoring and process control • Digitizing automotive sensor signals • Embedded diagnostics Simplified Block Diagram RAM HIGH LIMIT lOW LIMIT 1----1 ~ ___ J--L-.L.....f ~ 5 t----I 11 ~:::::~ 13 :pADC0858 ONLY) 10 : ~ . - Vee '-OGNO CONTROL lOGIC SHIFT REGISTERS CS--------------------~~ ClK --------------------~~ DI--------------------~~ OSC~ CONTROL REGISTERS TIMING GENERATOR POWER ON RESET OSC 1 - - - + DO 1 - - - + EOC 1 - - - + iNr TL/H/11021-22 FIGURE 1 http://www.national.com 7-54 l> c oo Connection Diagrams Q) U1 ...&. ADC0858 8-Channel MUX Dual-ln-L1ne Package ADC0851 2-Channel MUX Dual-ln-L1ne Package D) :::l a. l> C 16 OGNO Vee COM PH OSC 19 CH 1 cs 14 COMPl cs 18 CH2 ClK 13 vee OSC 20 CHO ClK 17 CH3 01 CH1 01 16 CH4 DO COM DO 15 CH5 INT AGNO INT 14 CH6 EOC VREF EOC 13 CH7 12 COM OGNO TL/H/ll021-1 VREF Top View oo CHO Q) U1 Q) AGNO 10 TLlH/ll021-2 Top View ADC0858 PLCC Package ADC0851 PLCC Package 1:2 ~ 0 u >u CI Z g ~ 1:2 ::::E 0 u u VI 0 <..> u > a I u - I u CH 2 ClK ClK 18 COMPL NC 17 NC 01 16 CH 0 DO 15 CH 1 INT 14 NC 9 01 17 CH 3 DO 16 CH 4 iNT 15 CH 5 CH 6 EOC 12 10 11 12 13 CI u z u 8 ... CI ..... z >'" -« t:l z ::::E t:l CI 0 U ... CI ..... z >'" -« t:l ::::E r-. 0 U I U TLlH/ll021-4 TL/H/ll021-3 Top View Top View Ordering Information Industrial (-40°C ~ TA ~ +85°C) Package (-55°C Military TA ~ + 125°C) ~ Package ADC0851 BIN, ADC0851CIN N16E,16-Pin Plastic DIP ADC0851CMJ/883 J16A,16-Pin Ceramic DIP ADC0858BIN, ADC0858CIN N20A, 20-Pin Plastic DIP ADC0858CMJ/883 J20A, 20-Pin Ceramic DIP ADC0851 BIV, ADC0851CIV V20A, 20-Lead PLCC ADC0858BIV, ADC0858CIV V20A, 20-Lead PLCC 7-55 http://www.national.com • Section 8 SCAN CMOS Test Access Logic Datasheets http://www.national.com Section 8 Contents SCAN18245T Non-Inverting Transceiver with TRI-STATE Outputs. . . . . . . . . . . . . . . . . . . . . . . . SCAN 18373T Transparent Latch with TRI-STATE Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCAN18374T D Flip-Flop with TRI-STATE Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCAN18540T Inverting Line Driver with TRI-STATE Outputs............................. SCAN18541T Non-Inverting Line Driver with TRI-STATE Outputs. . . . . . . . . . . . . . . . . . . . . . . . . 8·2 8-3 8-17 8-29 8-41 8-52 IfINational Semiconductor SCAN18245T Non-Inverting Transceiver with TRI-STATE® Outputs General Description Features The SCAN18245T is a high speed, low-power bidirectional line driver featuring separate data inputs organized into dual 9-bit bytes with byte-oriented output enable and direction control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary-scan test logic and test access port consisting of Test Data Input (TDI), Test Data Out (TDO), Test Mode Select (TMS), and Test Clock (TCK). • • • • • a • iii • • II IEEE 1149.1 (JTAG) Compliant Dual output enable control signals TRI-STATE outputs for bus-oriented applications 9-bit data busses for parity applications Reduced-swing outputs source 32 mA/sink 64 mA (Comm), source 24 mA/sink 48 mA (Mil) Guaranteed to drive 50n transmission line to TIL input levels of 0.8V and 2.0V TTL compatible inputs 25 mil pitch SSOP (Shrink Small Outline Package) Includes CLAMP and HIGHZ instructions Member of National's SCANTM Products Available as Known Good Die Ordering Code: See Section 11 Connection Diagram Tt.IS- 1 810 - 2 \.J 56 ~ TOI 55 ~ Ala DIR1- 3 54 r- CiT 81, - 4 53r-Al1 81 2 GND - 5 52 ~ A 12 6 51 813 - 7 50 - A13 81. - 8 49 - AI. Vee ~ eND Vee - 9 48 - 81s - 10 47 -Als 816 - 11 46 - GND - 12 45 - eND 817 - 13 44 ~ Pin Names A1(0-8) B1 (0-8) A2(0-8) B2(0-8) G1, G2 DIR1, DIR2 A16 A17 81a- 14 43 r-Ala 820 - 15 42 ~ A20 821 - 16 41 ~A21 GND - 17 40 ~ eND 82 2 - 18 39 I- A22 823 - 19 38 I- A23 Vee - 20 37 82. - 21 36 I- A2. I- Vee 82s - 22 35 I- A2s GND - 23 34 I- eND 82 6 - 24 33 I- A26 82 7 - 25 32 I- A27 DIR2 - 26 311-G2 82a - 27 30 r- A2a TOO - 28 29 Description Side A 1 Inputs or TRI-STATE Outputs Side B1 Inputs or TRI-STATE Outputs Side A21nputs orTRI-STATE Outputs Side B2 Inputs or TRI-STATE Outputs Output Enable Pins Direction of Data Flow Pins Order Number Description SCAN 18245TSSC SCAN 18245TSSCX SCAN18245TFMQB 5962-9311501 MXA SSOP in Tubes SSOP in Tape and Reel Flatpak Military Military SMD# I- TCK TL/F/l0961-1 8-3 http://www.national.com Functional Description Truth Tables Inputs Al (0-8) G1 DIR1 L L L L H L L H H H L H L X Z Inputs G2 DIR2 L L L L H L L H H X A2 (0-8) H L H L Z The SCAN18245 consists of two sets of nine non-inverting bidirectional buffers with TR I-STATE outputs and is intended for bus-oriented applications. Direction pins (DIR1 and DIR2) LOW enables data from B ports to A ports, when HIGH enables data from A ports to B ports. The Output Enable pins (G1 and G2) when HIGH disables both A and B ports by placing them in a high impedance condition. I Bl (0-8) ++~ ~ H L H L Z I B2 (0-8) ++~ ~ H L H L Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance Block Diagrams A1, 81, G1 and DlR1 TYPE1 TYPE1 TLlF/l0961-2 Note: BSR stands for Boundary Scan Register. http://www.national.com 8-4 Block Diagrams (Continued) Tap Controller TO BSR [79] TOI FROt.l BSR [0] BYPASS REGISTER TOO INSTRUCTION REGISTER TMS INSTRUCTION TRI-STATE TCK TUF/l0961-3 A2, 82, G2 and DIR2 TL/F/10961-4 Note: BSR stands for Boundary Scan Register. • 8-5 http://www.national.com Description of Boundary-Scan Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. The INSTRUCTION register is an eight-bit register which captures the value 00111101. The two least significant bits of this captured value (01) are required by IEEE Std 1149.1. The upper six bits are unique to the SCAN18245T device. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a "pseudo 10" code to confirm that the correct device is placed in the appropriate location in the boundary scan chain. Instruction Register Scan Chain Definition TOI Bypass Register Scan Chain Definition Logic 0 TOO lAse Lse TL/F/1 0961-1 0 MSB Instruction Code 00000000 10000001 10000010 00000011 All Others TLlF/10961-9 ~ LSB Instruction EXTEST SAMPLE/PRELOAD CLAMP HIGHZ BYPASS Scan Cell TYPE1 SCAN OUT (to next cell) DATA I N - - - - - . - - - - - - - - - - - - - - - + - - - - - DATA OUT SHIFLOR ----+--t SCAN IN CLOCLOR (from previous cell) TLlF/10961-7 Scan Cell TYPE2 SCAN OUT (to next cell) 1A0DE ------I DATA I N - - - - r - - - - - - - - - - - - - - i - - - - - - - - - - - t DATA OUT SHIFLOR - - - + - - t UPDATE-DR SCAN IN (from previous cell) http://www.national.com TL/F/10961-B 8-6 Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Scan Chain Definition (80 Bits In Length) TOI TOO IN 36 IN IN 37 IN IN 38 IN IN 39 IN IN 40 IN 41 IN IN 42 IN IN 43 IN 44 IN 45 IN IN 46 IN IN 47 IN 48 IN 12 IN 49 IN 13 IN 50 IN 51 IN 52 IN 53 10 11 [I 14 IN 15 16 IN 17 TLlF/l0961-25 8-7 http://www.national.com Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Definition Index Pin No. Pin Type 3 54 76 75 74 73 72 DIR1 G1 AOE1 80E1 DIR2 G2 AOE2 80E2 Input Input Internal Internal Input Input Internal Internal TYPE1 TYPE1 TYPE2 TYPE2 TYPE1 TYPE1 TYPE2 TYPE2 Control Signals 71 70 69 68 67 66 65 64 63 A10 A11 A12 A13 A14 A1s A16 A17 A18 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A1-in 62 61 60 59 58 57 56 55 54 A20 A21 A22 A23 A24 A2s A26 A27 A28 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A2-in 53 52 51 50 49 48 47 46 45 81 0 81 1 81 2 81 3 81 4 81 5 81 6 81 7 81 8 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 81-out 44 43 42 41 40 39 38 37 36 820 82 1 82 2 823 82 4 82 5 826 827 828 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 82-out 35 34 33 32 31 30 29 28 27 81 0 81 1 81 2 81 3 81 4 81 5 81 6 81 7 81 8 2 4 5 7 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 81-in Bit No. 79 78 77 http://www.national.com Pin Name 26 31 8 10 11 13 14 8-8 Scan Cell Type Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Definition Index (Continued) Bit No. Pin Name Pin No. Pin Type Scan Cell Type 26 25 24 23 22 21 20 19 18 82 0 82 1 82 2 823 82 4 82 5 82 6 82 7 82 8 15 16 18 19 21 22 24 25 27 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 82-in 17 16 15 14 13 12 11 10 9 A10 A11 A12 A13 A14 A15 A16 A17 A18 55 53 52 50 49 47 46 44 43 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A1-out 8 7 6 5 4 3 2 1 0 A20 A21 A22 A23 A24 A25 A26 A27 A28 42 41 39 38 36 35 33 32 30 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A2-out 8-9 http://www.national.com Absolute Maximum Ratings (Note 1) If MilitaryI Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (Vee) Storage Temperature DC Output Source/Sink Current (10) -20mA +20mA Recommended Operating Conditions -20mA +20mA Supply Voltage (Vee) SCAN Products -0.5V to Vee +0.5V ±70mA DC Vee or Ground Current Per Output Pin ±70mA Junction Temperature SSOP 2000V Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and outputlinput loading variables. National does not recommend operation of SCAN circuits outside databook specifications. -0.5V to + 7.0V DC Input Diode Current (11K) VI = -0.5V VI = Vee +0.5V DC Output Diode Current (10K) Vo = -0.5V Vo = Vee + 0.5V DC Output Voltage (Vo) - 65°C to + 150°C ESD (Min) 4.5Vto 5.5V Input Voltage (VI) OVtoVee Output Voltage (VO) OVtoVee Operating Temperature (TA) Commercial Military + 140°C -40°C to +85°C - 55°C to + 125°C Minimum Input Edge Rate dV /dt VIN from 0.8V to 2.0V Vee @ 4.5V. 5.5V 125 mV/ns DC Electrical Characteristics Commercial Symbol Parameter Vee (V) TA = +25°C Typ Military TA = -55°C to + 125°C TA Commercial = Conditions -40°C to +85°C Units Guaranteed Limits VIH Minimum High Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = 0.1V or Vee -0.1V VIL Maximum Low Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1V or Vee -0.1V VOH Minimum High Output Voltage 4.5 5.5 3.15 4.15 3.15 4.15 3.15 4.15 V 4.5 5.5 2.4 2.4 2.4 2.4 V 4.5 5.5 2.4 2.4 2.4 2.4 4.5 5.5 0.1 0.1 0.1 0.1 4.5 5.5 0.55 0.55 4.5 5.5 0.55 0.55 0.55 0.55 5.5 ±0.1 ±1.0 VOL liN Maximum Low Output Voltage Maximum Input Leakage Current Maximum Input liN TDI. TMS Leakage IOLD 10HD 5.5 Minimum Input Leakage 5.5 tMinimum Dynamic Output Current 5.5 0.1 0.1 V 0.55 0.55 V V ±1.0 ,..,A = VIL or VIH = -32mA VIN = VIL or VIH 10H = -24mA lOUT = 50,..,A = VIL or VIH = 64mA VIN = VIL or VIH 10L = 48 mA VI = Vee. GND VIN 10L 2.8 3.7 3.6 ,..,A VI -385 -385 ,..,A VI -160 -160 -160 ,..,A VI = = = Vee GND GND 94 63 94 mA VOLD -40 -27 -40 mA VOHD 8-10 -50,..,A VIN 10H -385 tMaximum test duration 2.0 ms, one output loaded at a time. http://www.national.com V = lOUT = 0.8V Max = 2.0V Min DC Electrical Characteristics (Continued) Commercial Symbol Parameter Vee (V) = TA Military +25°C TA = Typ Maximum I/O Leakage Current 10ZT Commercial -55°C to + 125°C TA = -40°C to +85°C Units Conditions p.A VI (OE) = VIL, VIH VI = Vcc, GND Vo = Vcc, GND Guaranteed Limits 5.5 ±0.6 ±11.0 ±6.0 lOS Output Short Circuit Current 5.5 -100 -100 -100 Icc Maximum Quiescent Supply Current 5.5 16.0 168 88 p.A Vo = High TDI, TMS = Vcc 5.5 750 930 820 p.A Vo = High TDI, TMS = GND Maximum Icc Per Input 5.5 2.0 2.0 2.0 rnA VI Icct rnA (min) Vo VI 5.5 2.15 2.15 2.15 = = = OV Vcc-2.1V Vcc-2.1 V TDI/TMS Pin, test rnA one with the other floating ·AII outputs loaded; thresholds associated with output under test. tMaximum test duration 2.0 ms, one output loaded at a time. Noise Specifications Commercial Symbol Vee (V) Parameter TA = Military TA +25°C Typ = Commercial -55°C to + 125°C TA = -40°C to +85°C Units Fig. No. Guaranteed Limits VOLP Maximum High Output Noise (Notes 2, 3) 5.0 1.0 1.5 V 4-13 VOLV Minimum Low Output Noise (Notes 2, 3) 5.0 -0.6 -1.2 V 4-13 VOHP Maximum Overshoot (Notes 1, 3) 5.0 VOH+ 1.0 VOH+ 1.5 V 4-13 VOHV Minimum Vcc Droop (Notes 1, 3) 5.0 VOH-1.0 VOH-1.8 V 4-13 VIHD Minimum High Dynamic Input (Notes 1, 4) Voltage Level 5.5 1.6 2.0 2.0 2.0 V VILD Maximum Low Dynamic Input (Notes 1,4) Voltage Level 5.5 1.4 0.8 0.8 0.8 V Note 1: Worst case package. Note 2: Maximum number of outputs that can switch simultaneously is n. (n-l) outputs are switched LOW and one output held LOW. Note 3: Maximum number of outputs that can switch Simultaneously is n. (n-l) outputs are switched HIGH and one output held HIGH. Note 4: Maximum number of data inputs (n) switching. (n-l) input switching OV to 3V. Input under test switching 3V to threshold (VILD)' AC Electrical Characteristics Normal Operation: See Section 4 Commercial Symbol Parameter Vee* (V) TA = +25°C CL = 50 pF Min tpLH. tpHL Propagation Delay A toB, BtoA tpLZ. tpHZ Disable Time tPZL, tPZH Enable Time Typ Military TA = Commercial - 55°C to + 125°C CL = 50pF TA = -40°C to +85·C CL = 50pF Units Fig. No. Max Min Max Min Max 5.0 1.6 1.6 7.9 7.9 1.6 1.6 9.0 9.3 1.6 1.6 8.5 8.8 ns 4-1,2 5.0 1.2 1.2 8.6 8.5 1.2 1.2 10.0 9.5 1.2 1.2 9.5 9.0 ns 4-3,4 5.0 1.6 1.6 11.0 8.5 1.6 1.6 12.5 10.0 1.6 1.6 12.0 9.5 ns 4-3,4 ·Voltage Range 5.0 is 5.0V ±0.5V. 8-11 http://www.national.com AC Electrical Characteristics Scan Test Operation: See Section 4 Commercial Symbol Parameter Vee· (V) TA = +25°C CL = 50 pF Typ Military TA = Commercial 55°C to + 125°C CL = 50pF - TA = 40°C to + 85°C CL = 50 pF - Units Fig. No. Max Min Max Min Max 5.0 2.8 2.8 13.2 13.2 2.8 2.8 15.8 15.8 2.8 2.8 14.5 14.5 ns 4-8 Disable Time TCKtoTDO 5.0 2.0 2.0 11.5 11.5 2.0 2.0 12.8 12.8 2.0 2.0 11.9 11.9 ns 4-9,10 tpZL, tpZH Enable Time TCKto TDO 5.0 2.4 2.4 14.5 14.5 2.4 2.4 16.7 16.7 2.4 2.4 15.8 15.8 ns 4-9,10 tpLH, tpHL Propagation Delay TCK to Data Out During Update-DR State 5.0 4.0 4.0 18.0 18.0 4.0 4.0 21.7 21.7 4.0 4.0 19.8 19.8 ns 4-8 tpLH, tpHL Propagation Delay TCK to Data Out During Update-IR State 4.0 4.0 18.6 18.6 4.0 4.0 21.2 21.2 4.0 4.0 20.2 20.2 ns 4-8 tpLH, tpHL Propagation Delay TCK to Data Out During Test Logie Reset State 5.0 4.4 4.4 19.9 19.9 4.4 4.4 23.0 23.0 4.4 4.4 21.5 21.5 ns 4-8 tpLZ, tpHZ Propagation Delay TCK to Data Out During Update-DR State 5.0 3.2 3.2 16.4 16.4 3.2 3.2 19.6 19.6 3.2 3.2 18.2 18.2 ns 4-9,10 tpLZ, tpHZ Propagation Delay TCK to Data Out During Update-IR State 5.0 2.8 2.8 18.0 18.0 2.8 2.8 20.9 20.9 2.8 2.8 19.3 19.3 ns 4-9,10 tpLZ, tpHZ Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 2.8 2.8 18.4 18.4 2.8 2.8 21.8 21.8 2.8 2.8 20.0 20.0 ns 4-9,10 tpZL, tpZH Propagation Delay TCK to Data Out During Update-DR State 5.0 4.0 4.0 18.9 18.9 4.0 4.0 22.6 22.6 4.0 4.0 20.9 20.9 ns 4-9,10 tpZL' tPZH Propagation Delay TCK to Data Out During Update-IR State 5.0 3.2 3.2 19.9 19.9 3.2 3.2 23.7 23.7 3.2 3.2 21.7 21.7 ns 4-9,10 tpZL, tPZH Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 3.6 3.6 21.3 21.3 3.6 3.6 24.9 24.9 3.6 3.6 23.3 23.3 ns 4-9,10 Min tpLH, tpHL Propagation Delay TCKtoTDO tpLZ, tpHZ 5.0 'Voltage Range 5.0 is 5.0V ±0.5V. All Propagation Delays involving TCK are measured from the falling edge of TCK. http://www.national.com 8-12 AC Operating Requirements Scan Test Operation: Commercial Symbol Vcc· (V) Parameter See Section 4 Military Commercial Fig. TA = -55°C to + 125°C TA = -40°C to +85°C Units No. CL = 50pF CL = 50pF TA = +25°C CL = 50pF Guaranteed Minimum ts Setup Time, H or L Data to TCK (Note 1) 5.0 0.0 0.0 0.0 ns 4-11 tH Hold Time, H or L TCK to Data (Note 1) 5.0 6.5 7.5 6.5 ns 4-11 ts Setup Time, H or L G 1, G2 to TCK (Note 2) 5.0 0.0 0.0 0.0 ns 4-11 tH Hold Time, H or L TCK to G1, G2 (Note 2) 5.0 4.0 4.0 4.0 ns 4-11 ts Setup Time, H or L DIR1, DIR2 to TCK (Note 4) 5.0 0.0 0.0 0.0 ns 4-11 tH Hold Time, H or L TCK to DIR1, DIR2 (Note 4) 5.0 4.0 4.0 4.0 ns 4-11 ts Setup Time, H or L Internal AOE n , BOEn to TCK (Note 3) 5.0 1.0 1.0 1.0 ns 4-11 5.0 4.0 5.0 4.0 ns 4-11 tH Hold Time, H or L TCK to Internal AOE n , BOEn (Note 3) ts Setup Time, H or L TMStoTCK 5.0 7.0 7.0 7.0 ns 4-11 tH Hold Time, H or L TCKto TMS 5.0 2.0 2.0 2.0 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 1.0 1.0 1.0 ns 4-11 tH Hold Time, H or L TCKto TDI 5.0 3.5 4.5 3.5 ns 4-11 tw Pulse Width 15.0 5.0 15.0 5.0 15.0 5.0 ns 4-12 5.0 H L fmax MaximumTCK Clock Frequency 5.0 25 25 25 MHz Tpu Wait Time, Power Up to TCK 5.0 100 100 100 ns TON Power Down Delay 0.0 100 100 100 ms 'Voltage Range 5.0 is 5.0V ±0.5V. All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: Timing pertains to the TYPEl BSR and TYPE2 BSR after the buffer (BSR 0-8,9-17,18-26,27-35,36-44,45-53,54-62,63-71). Note 2: Timing pertains to BSR 74 and 78 only. Note 3: Timing pertains to BSR 72, 73, 76 and 77 only. Note 4: Timing pertains to BSR 75 and 79 only. 8-13 http://www.national.com IU) ~ N co ,... Extended AC Electrical Characteristics Symbol Parameter TA = Comm Vee = Comm CL = 50pF 18 Outputs Switching (Note 2) TA = Comm Vee = Comm CL = 250pF (Note 3) TA = Mil Vee = Mil CL = 250 pF (Note 3) Units Max Min Max Min Max Min Max tpLH, tpHL Propagation Delay Data to Output 2.5 2.5 10.5 10.5 2.5 2.5 11.0 11.0 3.5 3.5 12.0 13.5 3.5 3.5 13.0 14.5 tpZH, tPZL Output Enable Time 2.5 2.5 10.5 13.5 2.5 2.5 11.0 14.0 (Note 4) (Note 4) ns tpHZ, tpLZ Output Disable Time 2.0 2.0 9.5 10.0 2.0 2.0 10.0 10.5 (Note 5) (Note 5) ns tOSHL (Note 1) Pin to Pin Skew HL Data to Output 0.5 1.0 1.0 ns tOSLH (Note 1) Pin to Pin Skew LH data to Output 0.5 1.0 1.0 ns Min Typ TA = Mil Vee = Mil CL = 50pF 18 Outputs Switching (Note 2) ns Note 1: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH to LOW (toSHU, LOW to HIGH (toSLH), or any combination switching LOW to HIGH and/or HIGH to LOW. Note 2: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all low-to-high, highto-low, etc.) Note 3: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only. Note 4: TRI-STATE delays are load dominated and have been excluded from the datasheet. Note 5: The Output Disable Time is dominated by the RC network (SOOn, 250 pF) on the output and has been excluded from the datasheet. Capacitance Symbol http://www.national.com Parameter Typ Units 4 pF Vee = 5.0V Input/Output Capacitance 20 pF Vee = 5.0V Power Dissipation Capacitance 41 pF Vee = 5.0V CIN Input Pin Capacitance CliO CPO 8·14 Conditions Pad Diagram 56 55 54 53 52 51 50 49 48 10 47 11 46 12 45 13 43 ,"",-,---42 15 ---'-1"'1 16 41 17 40 18 39 19 38 20 37 21 36 22 23 24 25 26 27 26 29 NC 30 8-15 31 32 33 34 35 TL/F/l0961-24 http://www.national.com In ~ ....co SCAN18245T Die Information Z Die Revision DlelD Die Size (X) Die Size (Y) Die Thickness Substrate Bias Backside Coating Y8J245 4310 p'm 4310 p'm 14 mil Vee (optional) None Pad Locations Signal Number Signal Name 1 TMS 2 3 Pad Location· Signal Number Signal Name Pad Location· -8.58,77.81 29 TCK 5.54, -77.81 81 0 -19.94,77.81 30 A28 19.94, -77.81 DIR1 -30.50,77.81 31 G2 30.50, -77.81 4 81 1 -40.98,77.81 32 A27 40.98, -77.81 5 81 2 -53.59,77.81 33 A26 53.59, -77.81 6 GNO -63.73,77.81 34 GNO 63.73, -77.81 7 81 3 -74.47, 77.81 35 A25 74.47, -77.81 8 81 4 -79.73, 62.30 36 A24 79.73, -62.27 9 Vee -79.73,51.55 37 Vee 79.73, -51.50 -79.73,46.28 79.73, -46.23 10 81 5 -79.73,36.05 38 A23 79.73, -36.02 11 81 6 -79.73,27.48 39 A22 79.73, -27.40 12 GND -79.72,19.46 40 GNO 79.73, -19.43 13 81 7 -79.73,10.09 41 A21 79.73, -10.06 14 81 8 -79.73,3.46 42 A20 79.73, -3.43 15 820 -79.73, -3.43 43 A18 79.73,3.46 16 821 -79.73, -10.06 44 A17 79.73, 10.09 17 GNO - 79.72, -19.43 45 GND 79.72,19.46 18 822 -79.73, -27.45 46 A16 79.73,27.43 19 823 -79.73, -36.02 47 A15 79.73,36.05 20 Vee -79.73, -46.24 48 Vee 79.73, 46.26 -79.73, -51.52 79.73,51.54 21 824 -79.73, -62.27 49 A14 22 825 -74.47, -77.81 50 A13 74.47,77.81 23 GNO -63.73, -77.81 51 GND 63.73,77.81 24 826 -53.59, -77.81 52 A12 53.59,77.81 79.73,62.30 25 827 -40.98, -77.81 53 A11 40.98,77.81 26 DIR2 -30.50, -77.81 54 G1 30.50, 77.81 27 828 -19.94, -77.81 55 A10 19.94,77.81 28 TOO -8.58, -77.81 56 TOI 5.54,77.81 ·X, Y coordinates measured in mils from center of die. http://www.national.com 8-16 ~-------------------------------------------------------------------------------------, IfI .. (X) w ~ w -I National Semiconductor SCAN18373T Transparent Latch with TRI-STATE® Outputs General Description Features The SCAN18373T is a high speed, low-power transparent latch featuring separate data inputs organized into dual 9-bit bytes with byte-oriented latch enable and output enable control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary-scan test logic and test access port consisting of Test Data Input (TOI), Test Data Out (TOO), Test Mode Select (TMS), and Test Clock (TCK). • • • • II • III III • a IEEE 1149.1 (JTAG) Compliant Buffered active-low latch enable TRI-STATE outputs for bus-oriented applications 9-bit data busses for parity applications Reduced-swing outputs source 32 mA/sink 64 mA (Comm), source 24 mA/sink 48 mA (Mil) Guaranteed to drive 50.0. transmission line to TTL input levels of 0.8V and 2.0V TTL compatible inputs 25 mil pitch SSOP (Shrink Small Outline Package) Includes CLAMP and HIGHZ instructions Member of National's SCAN Products Ordering Code: See Section 11 Connection Diagram Tt.lS- 1 AOo- 2 "-' 56 I-TOI 55 I-A1o AO£,- 3 54 I-ALE A01A02 - 4 531-Al1 5 52 I-AI2 GNO- 6 51 I-GNO A03 - 7 AO.- 8 50 I-AI3 Vcc A05 - 9 48 I-Vcc 10 47 I-AI5 A06 - 11 46 I-AI6 GNO- 12 49 I-AI. 45 I-GNO AO-,- 13 44 I-AI7 AOa- 14 .3 I-A1a 15 42 I-B1o BO o - B01- 16 GNO- 17 Description Data Inputs Latch Enable Inputs TRI-STATE Output Enable Inputs TRI-STATE Latch Outputs Order Number Description SCAN18373TSSC SCAN 18373TSSCX SCAN 18373TFMQB 5962-9311801MXA SSOP in Tubes SSOP in Tape and Reel Flatpak Military MilitarySMO # 41 t-Bll 40 I-GNO B02 - 18 39 I-BI2 B03 - 19 38 I-BI3 Vcc - 20 BO.- 21 37 I-Vcc B05 - 22 GNO- 23 35 t-B15 24 33 I-BI6 BO-,- 25 32 I-BI7 B06 - Pin Names AI(0-8), BI(0-8) ALE,BLE AOE1, BOE1 AO(0-8), BO(0-8) 36 t-BI. 341-GNO BO£,- 26 311-BLE BOa - 27 TOO- 28 30 I-B1a 291-TCK TLlF/l0962-1 8-17 http://www.national.com Truth Table Functional Description Inputs AO (0-8) ALE AOE1 AI (0-8) X H L L L X Z H H L L H L H AOo BlE BOE1 BI (0-8) X H L L L X Z L H L H BOo X Inputs H H L The SCAN18373T consists of two sets of nine D-type latches with TRI-STATE standard outputs. When the Latch Enable (ALE or BLE) input is HIGH, data on the inputs (AI(0-8) or BI(0-8) enters the latches. In this condition the latches are transparent, i.e., a latch output will change state each time its input changes. When Latch Enable is LOW, the latches store the information that was present on the inputs a set-up time preceding the HIGH-to-LOW transition of the Latch Enable. The TRI-STATE standard outputs are controlled by the Output Enable (AOE1 or BOE1) input. When Output Enable is LOW, the standard outputs are in the 2state mode. When Output Enable is HIGH, the standard outputs are in the high impedance mode, but this does not interfere with entering new data into the latches. BO(0-8) X = = = Z = H L X HIGH Voltage Level LOW Voltage Level Immaterial High Impedance AOo = Previous AO before H-to-L transition of ALE BOo = Previous BO before H-to-L transition of BLE Logic Diagram ALE or BLE AOEt or BOEt ADO or BOO AOt or BOt A02 or B02 A03 or B03 AD, or B04 A05 or B05 A06 or B06 Ao., or Bo., ADa or BOa TLIF/10962-13 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. http://www.national.com 8-18 Block Diagrams Byte-A TYPE2 TYPEl ALE AI [0-8] TL/F/l0962-2 Tap Controller TO BSR [41] FROM BSR [0] BYPASS REGISTER TOI TOO INSTRUCTION REGISTER INSTRUCTION TRI-STA TE TMS TEST ACCESS PORT (TAP) TCK TLlF/l0962-3 Byte-B TYPEl TYPE2 BI [0-8] BO [0-8] TYPEl INSTRUCTION TRI-STATE BlE BOE1 TLlF/l0962-4 Note: BSR stands for Boundary Scan Register. 8-19 http://www.national.com Description of Boundary-Scan Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. The INSTRUCTION register is an eight-bit register which captures the value 00111101. The two least significant bits of this captured value (01) are required by IEEE Std 1149.1. The upper six bits are unique to the SCAN 18373T device. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a "pseudo ID" code to confirm that the correct device is placed in the appropriate location in the boundary scan chain. Instruction Register Scan Chain Definition TOI Bypass Register Scan Chain Definition Logic 0 TOO IotSB LSB TLlF/10962-10 MSB --+ LSB Instruction Code Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP 00000011 HIGHZ All Others BYPASS TL/F/10962-9 Scan Cell TYPE1 SCAN OUT (to next cell) DATA IN SHIFT _OR -----r--------------t----- DATA OUT ----+---1 SCAN IN CLOCK-OR (from previous cell) TL/F/10962-7 Scan Cell TYPE2 SCAN OUT (to next cell) IotOOE -------I --------------+----------I DATA I N - -...... SHIFLDR DATA OUT ---+---t SCAN IN (from previous cell) http://www.national.com TL/F/10962-B 8-20 Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Scan Chain Definition (42 Bits In Length) TOI 41 40 39 38 37 TOO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 TLlF/10962-25 8-21 http://www.national.com Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Definition Index Bit No. Pin Name Pin No. Pin Type 3 54 Input Input Internal Input Input Internal TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in Blo BI1 BI2 BI3 BI4 Bis Bis BI7 Bla 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOo A01 A02 A03 A04 AOs AOs A07 AOa 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 BOo B01 B02 B03 B04 BOs BOs B07 BOa 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 B-out 41 40 39 38 37 36 AOE1 ACP AOE BOE1 BCP BOE 35 34 33 32 31 30 29 28 27 Ala AI1 AI2 AI3 AI4 Ais Ais AI7 Ala 26 25 24 23 22 21 20 19 18 http://www.national.com 26 31 8·22 Scan Cell Type ...... Absolute Maximum Ratings CO W (Note 1) Storage Temperature If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (Vee) DC Input Diode Current (11K) VI = -0.5V VI = Vee + 0.5V DC Output Diode Current (10K) Vo = -0.5V Vo = Vee + 0.5V DC Output Voltage (Vo) DC Output Source/Sink Current (10) -20mA +20mA Recommended Operating Conditions -20mA +20mA Supply Voltage (Vee) SCAN Products -0.5V to Vee + 0.5V ±70mA ±70mA Junction Temperature SSOP 2000V Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of SCANTM circuits outside databook specifications. -0.5V to + 7.0V DC'Vee or Ground Current Per Output Pin - 65°C to + 150°C ESD (Min) 4.5Vto 5.5V Input Voltage (VI) OV to Vee Output Voltage (Vo) OV to Vee Operating Temperature (TA) Commercial Military + 140°C - 40°C to + 85°C - 55°C to + 125°C Minimum Input Edge Rate dV/dt VIN from 0.8V to 2.0V Vee @ 4.5V, 5.5V 125 mV/ns DC Electrical Characteristics Symbol Parameter Vee (V) Commercial Military Commercial TA = + 25°C TA = - 55°C to + 125°C TA = - 40°C to + 85°C Typ Units Conditions Guaranteed Limits VIH Minimum High Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = 0.1V or Vee - 0.1V VIL Maximum Low Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1V or Vee - 0.1V VOH Minimum High Output Voltage 4.5 5.5 3.15 4.15 3.15 4.15 3.15 4.15 V VIN = 4.5 5.5 2.4 2.4 2.4 2.4 V 10H = -32mA 4.5 5.5 2.4 2.4 2.4 2.4 V VIN 10H = = 4.5 5.5 0.1 0.1 0.1 0.1 4.5 5.5 0.55 0.55 4.5 5.5 0.55 0.55 0.55 0.55 ±0.1 ± 1.0 VOL Maximum Low Output Voltage liN Maximum Input Leakage Current 5.5 liN Maximum Input Leakage 5.5 TDI, TMS Minimum Input Leakage 10LD 10HD tMinimum Dynamic Output Current 5.5 5.5 lOUT = -50 p,A VIL or VIH VIL or VIH -24mA = 0.1 0.1 V VIN = VIL or VIH 0.55 0.55 V 10L = 64mA V VIN 10L = = VIL or VIH 48 mA ±1.0 p,A lOUT 50 p,A VI = Vee,GND 2.8 3.7 3.6 p,A VI = Vee -385 -385 -385 p,A VI = GND -160 -160 -160 p,A VI = GND 94 63 94 mA VOLD = 0.8V Max -40 -27 -40 mA VOHD = 2.0V Min , tMaximum test duration 2.0 ms, one output loaded at a time. 8-23 http://www.national.com ....... w -I DC Electrical Characteristics (Continued) Commercial Symbol Vee (V) Parameter TA Military Commercial = +25·C TA = -55·Cto + 125·C TA = -40·Cto + 85·C Units Typ Conditions Guaranteed Limits loz Maximum Output Leakage Current 5.5 ±0.5 ±10.0 ±5.0 los Output Short Circuit Current 5.5 -100 -100 -100 Icc Maximum Quiescent Supply Current 5.5 16.0 168 88 p,A Vo = Open TDI, TMS = Vee 5.5 750 930 820 p,A Vo = Open TDI, TMS = GND Maximum Icc per Input 5.5 2.0 2.0 2.0 mA VI mA VI = Vee - 2.1V TDIITMS Pin, Test One with the Other Floating ICCt 5.5 2.15 2.15 p,A VI (DE) mAMin Vo 2.15 = VIL, VIH = OV = Vee - 2.1V •All outputs loaded; thresholds associated with output under test. tMaximum test duration 2.0 ms, one output loaded at a time. Noise Specifications: See Section 4 Commercial Symbol Parameter Vee (V) TA = +25·C Military TA Typ VOLP VOLV VOHP VOHV VIHD VILD Commercial = -55·C to + 125·C TA = -40·C to +85·C Units Fig. No. Guaranteed Limits Maximum High Output Noise (Notes 2,3) 5.0 1.0 1.5 V 4-13 Minimum Low Output Noise (Notes 2, 3) 5.0 -0.6 -1.2 V 4-13 Maximum Overshoot (Notes 1,3) 5.0 VOH + 1.0 VOH + 1.5 V 4-13 Minimum Vee Droop (Notes 1,3) 5.0 VOH - 1.0 VOH - 1.8 V 4-13 Minimum High Dynamic Input Voltage Level (Notes 1,4) 5.5 1.6 2.0 2.0 2.0 V Maximum Low Dynamic Input Voltage Level (Notes 1,4) 5.5 1.4 0.8 0.8 0.8 V Note 1: Worst case package. Maximum number of outputs that can switch simultaneously is n. (n -1) outputs are switched LOW and one output held LOW. Note 3: Maximum number of outputs that can switch simultaneously is n. (n -1) outputs are switched HIGH and one output held HIGH. Note 4: Maximum number of data inputs (n) switching. (n-1) input switching OV to 3V. Input under test switching 3V to threshold (VILO). Note 2: http://www.national.com 8-24 AC Electrical Characteristics Symbol Parameter Vee· (V) Commercial Military Commercial TA= +25·C CL = 50pF T A = - 55·C to + 125·C CL = 50 pF TA = -40·C to + 85·C CL = 50 pF Propagation Delay, Dto tpLH, tpHL Propagation Delay, LE to tpLZ, tpHZ Disable Time tpZL, tPZH Enable Time a a Units Fig. No. Max Min Max Min Max 5.0 2.5 2.5 9.0 9.0 2.5 2.5 10.5 10.5 2.5 2.5 9.8 9.8 ns 4-1,2 5.0 2.5 2.5 10.0 10.5 2.5 2.5 11.0 12.0 2.5 2.5 10.5 11.3 ns 4-1,2 5.0 1.5 1.5 9.0 9.5 1.5 1.5 10.5 10.3 1.5 1.5 9.5 10.0 ns 4-3,4 5.0 2.0 2.0 10.9 9.0 2.0 2.0 12.8 10.6 2.0 2.0 11.9 9.7 ns 4-3,4 Units Fig. No. Min tpLH, tpHL Normal Operation: See Section 4 Typ 'Voltage Range 5.0 is S.OV ±O.SV. AC Operating Requirements NormalOperation: Symbol Parameter Vee· (V) See Section 4 Commercial Military Commercial TA = +25·C CL = 50pF TA = -55·Cto + 125·C CL = 50 pF TA = -40·C to + 85·C CL = 50 pF Guaranteed Minimum ts Setup Time, H or L Data to LE 5.0 3.0 3.0 3.0 ns 4-5 tH Hold Time, H or L LEto Data 5.0 1.5 1.5 1.5 ns 4-5 tw LE Pulse Width 5.0 5.0 5.0 5.0 ns 4-2 'Voltage Range 5.0 is 5.0V ±O.SV. 8-25 http://www.national.com AC Electrical Characteristics Symbol Parameter Vee· (V) Scan Test Operation: See Section 4 Commercial Military Commercial TA= + 25°C CL = 50pF TA = -55°C to + 125°C CL = 50 pF TA= -40°C to + 85°C CL = 50 pF Units Fig. No. Min Typ Max Min Max Min Max 5.0 3.5 3.5 13.2 13.2 3.5 3.5 15.8 15.8 3.5 3.5 14.5 14.5 ns 4-8 Disable Time TCKto TDO 5.0 2.5 2.5 11.5 11.5 2.5 2.5 12.8 12.8 2.5 2.5 11.9 11.9 ns 4-9.10 tPZL. tpZH Enable Time TCKtoTDO 5.0 3.0 3.0 14.5 14.5 3.0 3.0 16.7 16.7 3.0 3.0 15.8 15.8 ns 4-9.10 tpLH. tpHL Propagation Delay TCK to Data Out during Update-DR State 5.0 ns 4-8 tpLH. tpHL Propagation Delay TCK to Data Out during Update-IR State 5.0 ns 4-8 tpLH. tpHL Propagation Delay TCK to Data Out during Test Logic Reset State 5.0 ns 4-8 tpLZ. tpHZ Propagation Delay TCK to Data Out during Update-DR State 5.0 ns 4-9.10 tpLZ. tpHZ Propagation Delay TCK to Data Out during Update-IR State 5.0 ns 4-9.10 tpLZ. tpHZ Propagation Delay TCK to Data Out during Test Logic Reset State 5.0 ns 4-9.10 tPZL. tpZH Propagation Delay TCK to Data Out during Update-DR State 5.0 ns 4-9.10 tPZL. tpZH Propagation Delay TCK to Data Out during Update-IR State 5.0 ns 4-9.10 tpZL. tPZH Propagation Delay TCK to Data Out during Test Logic Reset State ns 4-9.10 tpLH. tpHL Propagation Delay TCKto TDO tpLZ. tpHZ 5.0 5.0 18.0 5.0 21.7 5.0 19.8 5.0 18.0 5.0 21.7 5.0 19.8 5.0 18.6 5.0 21.2 5.0 20.2 5.0 18.6 5.0 21.2 5.0 20.2 5.5 19.9 5.5 23.0 5.5 21.5 5.5 19.9 5.5 23.0 5.5 21.5 4.0 16.4 4.0 19.6 4.0 18.2 4.0 16.4 4.0 19.6 4.0 18.2 5.0 19.5 5.0 22.4 5.0 20.8 5.0 19.5 5.0 22.4 5.0 20.8 5.0 19.9 5.0 23.3 5.0 21.5 5.0 19.9 5.0 23.3 5.0 21.5 5.0 18.9 5.0 22.6 5.0 20.9 5.0 18.9 5.0 22.6 5.0 20.9 6.5 22.4 6.5 26.2 6.5 24.2 6.5 22.4 6.5 26.2 6.5 24.2 7.0 23.8 7.0 27.4 7.0 25.7 7.0 23.8 7.0 27.4 7.0 25.7 'Voltage Range 5.0 is 5.0V ±0.5V. All propagation delays Involving TCK are measured from the falling edge of TCK. http://www.national.com 8-26 AC Operating Requirements Scan Test Operation: Commercial Symbol Vee· (V) Parameter See Section 4 Military Commercial TA = +25°C TA = -5S·Cto + 125°C TA = -40°C to +85°C CL = 50pF CL = 50 pF CL = SOpF Units Fig. No. Guaranteed Minimum ts Setup Time, Data to TCK (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 tH Hold Time, TCK to Data (Note 2) 5.0 4.5 4.5 4.5 ns 4-11 ts Setup Time, H or L AOE1, BOEl to TCK (Note 4) 5.0 3.0 3.0 3.0 ns 4-11 tH Hold Time, H or L TCK to AOE1, BOEl (Note 4) 5.0 4.5 5.0 4.5 ns 4-11 ts Setup Time, H or L Internal AOE, BOE, to TCK (Note 3) 5.0 3.0 3.0 3.0 ns 4-11 Hold Time, H or L TCK to Internal AOE, BOE (Note 3) 5.0 3.0 3.0 3.0 ns 4-11 ts Setup Time ALE, BLE (Note 1) to TCK 5.0 3.0 3.0 3.0 ns 4-11 tH Hold Time TCK to ALE, BLE (Note 1) 5.0 3.5 4.0 3.5 ns 4-11 ts Setup Time, H or L TMSto TCK 5.0 8.0 8.0 8.0 ns 4-11 tH Hold Time, H or L TCKtoTMS 5.0 2.0 2.0 2.0 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 4.0 4.0 4.0 ns 4-11 tH Hold Time, H or L TCKtoTDI 5.0 4.5 4.5 4.5 ns 4-11 tw Pulse Width TCK 15.0 5.0 15.0 5.0 15.0 5.0 ns 4-12 25 25 25 MHz tH 5.0 H L f max MaximumTCK Clock Frequency Tpu Wait Time, Power Up to TCK 5.0 100 100 100 ns Tdn Power Down Delay 0.0 100 100 100 ms 5.0 ·Voltage Range 5.0 is 5.0V ± 0.5V. All Input Timing Delays Involving TCK are measured from the rising edge of TCK. Note 1: Timing pertains to BSR 37 and 40 only. Note 2: This delay represents the timing relationship between the data Input and TCK at the associated scan cells numbered 0·8,9·17,18·26 and 27·35. Note 3: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Note 4: Timing pertains to BSR 38 and 41 only. 8-27 http://www.national.com ICf) ..... Cf) co ,.... Extended AC Electrical Characteristics: TA = Com Vee Symbol Parameter tpLH Propagation Delay tpHL Latch Enable 4 TA = Mil Vee = Com TA = Com = Mil TA= Mil CL = 50pF CL = 50pF Vee 18 Outputs 18 Outputs CL = 250pF CL = 250 pF Switching Switching (Note 3) (Note 3) (Note 2) Min See Section Typ = Com Vee = Mil Units (Note 2) Max Min Max Min Max Min Max 3.0 3.0 12.0 12.8 3.0 3.0 12.5 13.5 4.0 4.0 13.5 16.0 4.0 4.0 14.5 16.5 3.0 3.0 11.5 11.5 3.0 3.0 12.0 12.0 4.0 4.0 13.0 14.5 4.0 4.0 14.0 15.5 ns to Output tpLH Propagation Delay tpHL Data to Output tPZH Output Enable Time 2.5 2.5 10.5 12.5 2.5 2.5 11.0 13.5 (Note 4) (Note 4) ns Output Disable Time 2.0 2.0 10.5 10.5 2.0 2.0 11.0 11.0 (Note 5) (Note 5) ns tpZL tpHZ tpLZ tOSHL (Note 1) tOSLH (Note 1) Pin to Pin Skew HL Data to Output Pin to Pin Skew LH Data to Output ns 0.5 1.0 1.0 ns 0.5 1.0 1.0 ns Note 1: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH to LOW (toSHU. LOW to HIGH (toSLH). or any combination switching LOW to HIGH. Note 2: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (Le .• alilow-to-high. highto-low. etc.). Note 3: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only. Note 4: TRI-STATE delays are load dominated and have been excluded from the datasheet. Note 5: The Output Disable Time Is dominated by the RC network (SOon. 250 pF) on the output and has been excluded from the datasheet. Capacitance Symbol http://www.national.com Parameter Typ Units Conditions 4.0 pF Vee = 5.0V CIN Input Pin Capacitance COUT Output Pin Capacitance 13.0 pF Vee = 5.0V CPO Power Dissipation Capacitance 34.0 pF Vee = 5.0V 8-28 r---------------------------------------------------------------------------------~ '"-I t;{INational Semiconductor 0l:Io SCAN18374T D Flip-Flop with TRI-STATE® Outputs General Description Features The SCAN18374T is a high speed, low-power D-type flipflop featuring separate D-type inputs organized into dual 9-bit bytes with byte-oriented clock and output enable control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and BOUNDARY-SCAN Architecture with the incorporation of the defined BOUNDARY-SCAN test logic and test access port consisting of Test Data Input (TDI), Test Data Out (TDO), Test Mode Select (TMS), and Test Clock (TCK). • • • • • • • • • • IEEE 1149.1 (JTAG) Compliant Buffered positive edge-triggered clock TRI-STATE outputs for bus-oriented applications 9-bit data busses for parity applications Reduced-swing outputs source 32 rnA/sink 64 rnA (Comm), source 24 rnA/sink 48 rnA (Mil) Guaranteed to drive 50n transmission line to TIL input levels of 0.8V and 2.0V TIL compatible inputs 25 mil pitch SSOP (Shrink Small Outline Package) Includes CLAMP and HIGHZ instructions Member of National's SCAN Products Ordering Code: See Section 11 Connection Diagram TtolS- 1 AOo- 2 A0E,- 3 \....../ 56 54 53 r-AI, A02 - 5 GND- 6 52 r-A1 2 A03 - 7 AO.- 8 50 vec - 9 AOs- 10 48 -Vee 51 r-GND 49 -AI. AOs- 11 GND- 12 45 r-GNO 4<4 -A1 7 AOa- 14 43 ~Ala 8°0- 15 Bo,- 16 42 ~810 GNO- 17 40 t-GNO 8°2- 18 39 r-812 38 r-81 l 80l - 19 37 r-Vcc 8°5- 22 GNO- 23 35 -81 5 80s - 24 33 -81s 8~- 25 32 -81 7 80 a - 27 TOO- 28 Order Number Description SCAN18374TSSC SCAN 18374TSSCX SCAN 18374TFMQB 5962-9320701 MXA SSOP in Tubes SSOP in Tape and Reel Flatpak Military Military SMD # 41 -BI, vec - 20 80.- 21 BOE,- 26 AO(O-B), BO(O-B) Description Data Inputs Clock Pulse Inputs TRI-STATE Output Enable Inputs TRI-STATE Outputs ~All 47 -Al s 46 -Als 13 AI(O-B), BI(O-B) ACP, BCP AOE1, BOE1 ~ACP Ao,- 4 A~- Pin Names ~TDI 55 .... Alo 36 r-81. 3<4 -GNO 31 -8CP 30 t-81a 29 t-TCK TL/F/l0963-1 8-29 -4 Q) Ct.) http://www.national.com Functional Description Truth Tables Inputs AO(O-S) ACP AOE1 AI(O-S) X H L L X Z ....r ....r L H L H BCP BOE1 BI(0-8) X H L L X L H Inputs ....r ....r The SCAN18374 consists of two sets of nine edge-triggered flip-flops with individual D-type inputs and TRI-STATE true outputs. The buffered clock and buffered Output Enable pins are common to all flip-flops. Each set of the nine flipflops will store the state of their individual D inputs that meet the setup and hold time requirements on the LOW-to-HIGH Clock (ACP or BCP) transition. With the Output Enable (AOE1 or BOE1) LOW, the contents of the nine flip-flops are available at the outputs. When the Output Enable is HIGH, the outputs go to the high impedance state. Operation of the Output Enable input does not affect the state of the flipflops. BO(O-S) Z L H = HIGH Voltage Level = LOW Voltage Level = Immaterial Z = High Impedance J" = L·to·H Transition H L X Logic Diagram ACP or BCP AOE, or BOE, TL/F/l0963-13 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Block Diagrams Byte-A TYPE1 TYPE2 TYPE1 ACP INSTRUCTION TRI-STATE AO [o-a] AI [o-a] TL/F/l0963-2 Note: BSR stands for Boundary Scan Register http://www.national.com 8-30 Block Diagrams (Continued) Tap Controller FROM BSR[Oj TO BSR[41j BYPASS REGISTER TDI TOO INSTRUCTION REGISTER INSTRUCTION TRI-STATE TMS TEST ACCESS PORT (TAP) TCK TLlF/l0963-3 Byte-B BI [o-a] BCP BOE1 TL/F/l0963-4 Note: BSR stands for Boundary Scan Register 8-31 http://www.national.com Description of Boundary-Scan Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. The INSTRUCTION register is an eight-bit register which captures the value 00111101. The two least significant bits of this captured value (01) are required by IEEE Std 1149.1. The upper six bits are unique totheSCAN18374Tdevice. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a "pseudo 10" code to confirm that the correct device is placed in the appropriate location in the boundary scan chain. Instruction Register Scan Chain Definition TOO TOI LSB IoISB Bypass Register Scan Chain Definition LogiC 0 TL/F/10963-10 MSB ---+ LSB Instruction Code Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP HIGHZ 00000011 All Others BYPASS TL/F/10963-9 Scan Cell TYPE1 SCAN OUT (to nlxt cIII) DATA IN SHIH _DR ---"""T"--------------t------ DATA OUT ----+---1 SCAN IN CLOCK-DR (from previous cell) TLlF/10963-7 Scan Cell TYPE2 SCAN OUT (to next cell) OATA I N - - . . . . . , . - - - - - - - - - - - - - - f - - - - - - - - - - - t DATA OUT SHIFLDR - - - + - - t SCAN IN CLOCK-DR UPDATE-DR (from previous cell) http://www.national.com TL/F/10963-8 8-32 .-------------------------------------------------------------------------------------------, CD ~ W Description of Boundary-Scan Circuitry (Continued) '" -t ~ Boundary-Scan Register Scan Chain Definition (42 Bits In Length) TOI 41 40 39 38 37 TOO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 TL/F/l0963-25 8-33 _ http://www.national.com Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Definition Index Bit No. Pin No. Pin Type 3 54 Input Input Internal Input Input Internal TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in Blo BI1 BI2 Bla BI4 Bis BI6 BI7 Bla 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOo A01 A02 AOa A04 AOs A06 A07 AOa 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 BOo B01 B02 BOa B04 BOs B06 B07 BOa 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 B-out Pin Name 41 40 39 38 37 36 AOE1 ACP AOE BOE1 BCP BOE 35 34 33 32 31 30 29 28 27 Alo AI1 AI2 Ala AI4 Ais AI6 AI7 Ala 26 25 24 23 22 21 20 19 18 http://www.national.com 26 31 8-34 Scan Cell Type Absolute Maximum Ratings (Note 1) Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of SCANTM circuits outside databook specifications. If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. -0.5Vto +7.0V Supply Voltage (Vee) DC Input Diode Current (11K) VI = -0.5V VI = Vee +0.5V -20mA +20mA DC Output Diode Current (10K) Vo = -0.5V Vo = Vee + 0.5V -20mA +20mA DC Output Voltage (VO) DC Output Source/Sink Current (10) Recommended Operating Conditions Supply Voltage (Vee) SCAN Products -0.5VtoVee +0.5V ±70mA DC Vee or Ground Current Per Output Pin ±70mA Junction Temperature SSOP +140°C Storage Temperature OVtoVee Output Voltage (Vo) OV to Vee Operating Temperature (TA) Commercial Military - 40°C to + 85°C - 55°C to + 125°C Minimum Input Edge Rate dV /dt VIN from O.BV to 2.0V Vee @ 4.5V. 5.5V - 65°C to + 150°C ESD (Min) 4.5Vto 5.5V Input Voltage (VI) 125 mV/ns 2000V DC Electrical Characteristics Commercial Symbol Parameter Vee (V) TA = +25°C Typ Military TA = -55°C to + 125°C TA Commercial = -40°C to +85°C Units Conditions Guaranteed Limits VIH Minimum High Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = 0.1V or Vee -0.1V VIL Maximum Low Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1V or Vee -0.1V VOH Minimum High Output Voltage 4.5 5.5 3.15 4.15 3.15 4.15 3.15 4.15 V 4.5 5.5 2.4 2.4 2.4 2.4 V 4.5 5.5 2.4 2.4 2.4 2.4 4.5 5.5 0.1 0.1 0.1 0.1 4.5 5.5 0.55 0.55 4.5 5.5 0.55 0.55 0.55 0.55 5.5 ±0.1 ±1.0 VOL liN Maximum Low Output Voltage Maximum Input Leakage Current Maximum Input liN TDI. TMS Leakage Minimum Input Leakage 10LO 10HO 5.5 5.5 tMinimum Dynamic 5.5 Output Current V 0.1 0.1 V 0.55 0.55 V V ±1.0 /-LA lOUT = VIL or VIH = -32mA VIN = VIL or VIH 10H = -24mA lOUT = 50/-LA = VIL or VIH = 64 mA VIN = VIL or VIH IOL = 48mA VI = Vee. GND VIN 10L 2.8 3.7 3.6 /-LA VI -385 -385 /-LA VI -160 -160 /-LA -50 J-LA VIN 10H -385 -160 = VI = = = Vee GND GND 94 63 94 mA YOLO -40 -27 -40 mA VOHO = 0.8V Max = 2.0V Min tMaximum test duration 2.0 ms, one output loaded at a time. 8-35 http://www.national.com DC Electrical Characteristics (Continued) Symbol Parameter Commercial Military Commercial Vee TA = -55°C to + 125°C TA = -40°C to +85°C Units (V) TA = +25°C Typ Guaranteed Limits Conditions 102 Maximum Output Leakage Current 5.5 ±0.5 ±10.0 ±5.0 los Output Short Circuit Current 5.5 -100 -100 -100 Icc Maximum Quiescent 5.5 Supply Current 16.0 168 88 itA Vo = Open TDI, TMS = Vcc 5.5 750 930 820 itA Vo = Open TDI, TMS = GND 5.5 2.0 2.0 2.0 mA VI = Vcc - 2.1V 5.5 2.15 2.15 2.15 ICCt Maximum Icc Per Input itA VI (OE) = VIL, VIH mA Vo= OV (min) VI = Vec - 2.1V TDI/TMS Pin, Test One with the Other Floating *AII outputs loaded; thresholds associated with output under test. tMaximum test duration 2.0 ms. one output loaded at a time. Noise Specifications: Symbol Parameter Vee (V) See Section 4 Commercial Military Commercial TA = +25°C TA = -55°C to + 125°C TA = -40°C to +85°C Units Fig. No. Guaranteed Limits Typ Maximum High Output Noise (Notes 2,3) 5.0 1.0 1.5 V 4·13 Minimum Low Output Noise (Notes 2,3) 5.0 -0.6 -1.2 V 4·13 Maximum Overshoot (Notes 1, 3) 5.0 VOH+ 1.0 VOH+1.5 V 4·13 MinimumVcC Droop (Notes 1, 3) 5.0 VOH-1.0 VOH-1.8 V 4·13 VIHD Minimum High Dynamic Input Voltage Level (Notes 1, 4) 5.5 1.6 2.0 2.0 2.0 V VILD Maximum Low Dynamic Input Voltage Level (Notes 1, 4) 5.5 1.4 0.8 0.8 0.8 V VOLP VOLV VOHP VOHV Note 1: Worst case package. Note 2: Maximum number of outputs that can switch simultaneously is n. (n - 1) outputs are switched LOW and one output held LOW. Note 3: Maximum number of outputs that can switch simultaneously is n. (n - 1) outputs are switched HIGH and one output held HIGH. Note 4: Maximum number of data inputs (n) switching. (n - 1) input switching OV to 3V. Input under test switching 3V to threshold (VILO). http://www.national.com 8·36 AC Electrical Characteristics NormalOperation: Commercial Symbol Parameter TA = +25°C CL = 50 pF Vee· (V) Min tpLH, tpHL Propagation Delay CPtoQ tpLZ, tpHZ Disable Time tpZL' tpZH Enable Time Typ See Section 4 Military TA Commercial = -55°C to + 125°C CL = 50pF TA = -40°C to +85°C CL = 50pF Units Fig. No. Max Min Max Min Max 5.0 2.5 2.5 9.5 10.3 2.5 2.5 11.0 12.0 2.5 2.5 10.5 11.5 ns 4-1,2 5.0 1.5 1.5 9.0 9.0 1.5 1.5 10.5 10.3 1.5 1.5 9.5 10.0 ns 4-3,4 5.0 2.0 2.0 10.9 8.9 2.0 2.0 12.6 10.3 2.0 2.0 12.0 9.5 ns 4-3,4 Units Fig. No. ·Voltage Range 5.0 is 5.0V ± 0.5V. AC Operating Requirements Symbol Parameter Vee· (V) Normal Operation: See Section 4 Commercial Military TA = +25°C CL = 50 pF TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to + 85°C CL = 50 pF Guaranteed Minimum ts Setup Time, H or L Data toCP 5.0 3.0 3.0 3.0 ns 4-5 tH Hold Time, H or L CPto Data 5.0 1.5 1.5 1.5 ns 4-5 tw CP Pulse Width 5.0 5.0 5.0 5.0 ns 4-12 f max Maximum ACP/BCP Clock Frequency 5.0 100 70 90 MHz ·Voltage Range 5.0 is 5.0V ± 0.5V. 8-37 http://www.national.com AC Electrical Characteristics Scan Test Operation: Commercial Symbol Parameter Vee· (V) TA = +25·C CL = 50 pF See Section 4 Military TA = Commercial -55·Cto + 125·C CL = 50pF TA = -40·C to +85·C CL = 50 pF Units Fig. No. Min Typ Max Min Max Min Max 5.0 3.5 3.5 13.2 13.2 3.5 3.5 15.8 15.8 3.5 3.5 14.5 14.5 ns 4-8 Disable Time TCKtoTDO 5.0 2.5 2.5 11.5 11.5 2.5 2.5 12.8 12.8 2.5 2.5 11.9 11.9 ns 4-9,10 tpZL, tpZH Enable Time TCKto TDO 5.0 3.0 3.0 14.5 14.5 3.0 3.0 16.7 16.7 3.0 3.0 15.8 15.8 ns 4-9,10 tpLH, tpHL Propagation Delay TCK to Data Out During Update-DR State 5.0 5.0 5.0 18.0 18.0 5.0 5.0 21.7 21.7 5.0 5.0 19.8 19.8 ns 4-8 tpLH, tpHL Propagation Delay TCK to Data Out During Update-IR State 5.0 5.0 5.0 18.6 18.6 5.0 5.0 21.2 21.2 5.0 5.0 20.2 20.2 ns 4-8 tpLH, tpHL Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 5.5 5.5 19.9 19.9 5.5 5.5 23.0 23.0 5.5 5.5 21.5 21.5 ns 4-8 tpLZ, tpHZ Propagation Delay TCK to Data Out During Update-DR State 5.0 4.0 4.0 16.4 16.4 4.0 4.0 19.6 19.6 4.0 4.0 18.2 18.2 ns 4-9,10 tpLZ, tpHZ Propagation Delay TCK to Data Out During Update-IR State 5.0 . 5.0 5.0 19.5 19.5 5.0 5.0 22.4 22.4 5.0 5.0 20.8 20.8 ns 4-9,10 tpLZ, tpHZ Propagation Delay TCK to Data Out During Test Logic ResotState 5.0 5.0 5.0 19.9 19.9 5.0 5.0 23.3 23.3 5.0 5.0 21.5 21.5 ns 4-9,10 tpZL, tpZH Propagation Delay TCK to Data Out During Update-DR State 5.0 5.0 5.0 18.9 18.9 5.0 5.0 22.6 22.6 5.0 5.0 20.9 20.9 ns 4-9,10 tpZL, tpZH Propagation Delay TCK to Data Out During Update-IR State 5.0 6.5 6.5 22.4 22.4 6.5 6.5 26.2 26.2 6.5 6.5 24.2 24.2 ns 4-9,10 tpzL, tPZH Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 7.0 7.0 23.8 23.8 7.0 7.0 27.4 27.4 7.0 7.0 25.7 25.7 ns 4-9,10 tpLH, tpHL Propagation Delay TCKto TDO tpLZ, tpHZ ·Voltage Range 5.0 is 5.0V ±0.5V. All Propagation Delays involving TCK are measured from the falling edge of TCK. http://www.national.com 8-38 AC Operating Requirements Scan Test Operation: Commercial Symbol Vcc' (V) Parameter TA = +25°C CL = 50pF See Section 4 Military Commercial TA = -55°C to + 125°C TA = -40°C to +85°C CL = 50 pF CL = 50 pF Units Fig. No. Guaranteed Minimum ts Setup Time, H or L Data to TCK (Note 1) 5.0 3.0 4.5 3.0 ns 4-11 tH Hold Time, H or L TCK to Data (Note 1) 5.0 4.5 5.5 4.5 ns 4-11 ts Setup Time, H or L AOE1, BOE1 to TCK (Note 3) 5.0 3.0 3.5 3.0 ns 4-11 tH Hold Time, H or L TCK to AOE1, BOE1 (Note 3) 5.0 4.5 4.5 4.5 ns 4-11 ts Setup Time, H or L Internal AOE, BOE to TCK (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 Hold Time, H or L TCK to Internal AOE, BOE (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 ts Setup Time ACP, BCP (Note 4) to TCK 5.0 3.0 3.0 3.0 ns 4-11 tH Hold Time TCK to ACP, BCP (Note 4) 5.0 3.5 3.5 3.5 ns 4-11 ts Setup Time, H or L TMStoTCK 5.0 8.0 8.0 8.0 ns 4-11 tH Hold Time, H or L TCKto TMS 5.0 2.0 2.0 2.0 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 4.0 4.0 4.0 ns 4-11 tH Hold Time, H or L TCKtoTDI 5.0 4.5 4.5 4.5 ns 4-11 tw Pulse Width TCK 15.0 5.0 15.0 5.0 15.0 5.0 ns 4-12 tH 5.0 H L fmax MaximumTCK Clock Frequency 5.0 25 25 25 MHz Tpu Wait Time, Power Up toTCK 5.0 100 100 100 ns Tdn Power Down Delay 0.0 100 100 100 ms 'Voltage Range 5.0 is 5.0V ±0.5V. All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: This delay represents the timing relationship between the data Input and TCK at the associated scan cells numbered 0-6,9-17,16-26 and 27-35. Note 2: This delay represents the timing relationship between AOE, BOE and TCK at scan cells 36 and 39 only. Note 3: Timing pertains to BSR 36 and 41 only. Note 4: Timing pertains to BSR 37 and 40 only. 8-39 http://www.national.com Extended AC Electrical Characteristics TA = Mil TA = Com Vee Symbol Vee = Com CL = 50pF = Mil CL = 50pF 18 Outputs Switching Parameter TA = Mil TA = COM Vee 18 Outputs = Com CL = 250 pF Vee = Mil CL = 250 pF Switching (Note 3) (Note 3) (Note 2) (Note 2) Max Min Max Min Max Min Max 3.0 3.0 11.5 12.5 3.0 3.0 12.0 13.0 4.0 4.0 13.5 16.5 4.0 4.0 14.5 17.0 Min Typ Units tpLH, Propagation Delay tpHL Data to Output tpZH, Output Enable Time 2.5 2.5 10.5 12.5 2.5 2.5 11.0 13.5 (Note 4) (Note 4) ns Output Disable Time 2.0 2.0 10.5 10.5 2.0 2.0 11.0 11.0 (Note 5) (Note 5) ns tpZL tpHZ, tpLZ tOSHL (Note 1) tOSLH (Note 1) Pin to Pin Skew HL Data to Output Pin to Pin Skew LH Data to Output ns 0.5 1.0 1.0 ns 0.5 1.0 1.0 ns Note 1: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH to LOW (toSHU, LOW to HIGH (toSLH), or any combination switching LOW to HIGH and/or HIGH to LOW. Note 2: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., alilow-to-high, highto-low, etc.). Note 3: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only. Note 4: TRI-STATE delays are load dominated and have been excluded from the datasheet. Note 5: The Output Disable Time is dominated by the RC network (500n, 250 pF) on the output and has been excludod from the datasheet. Capacitance Symbol CIN COUT CPO Typ Units Input Pin Capacitance 4_0 pF Vee = 5.0V Output Pin Capacitance 13.0 pF Vee = 5.0V Vee = 5.0V Parameter Power Dissipation 34.0 Capacitance http://www.national.com 8-40 pF Conditions ~---------------------------------------------------------------------------------. -4 co (J1 "'" o tflNational Semiconductor -f SCAN18540T Inverting Line Driver with TRI-STATE® Outputs General Description Features The SCAN18540T is a high speed, low-power line driver featuring separate data inputs organized into dual 9-bit bytes with byte-oriented paired output enable control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary-scan test logic and test access port consisting of Test Data Input (TDI), Test Data Out (TOO), Test Mode Select (TMS), and Test Clock (TCK). • • • • • • • • • • IEEE 1149.1 (JTAG) compliant Dual output enable signals per byte TRI-STATE outputs for bus-oriented applications 9-bit data busses for parity applications Reduced-swing outputs source 32 mA/sink 64 mA (Comm), source 24 mA/sink 48 mA (Mil) Guaranteed to drive 50n transmission line to TIL input levels of 0.8V and 2.0V TIL compatible inputs 25 mil pitch SSOP (Shrink Small Outline Package) Includes CLAMP and HIGHZ instructions Member of National's SCAN products Ordering Code: See Section 11 Connection Diagram Description Pin Names TMS- 1 \J 56 I-TOI Aoo - 2 55 I-Alo AO~- 3 54 I-AOE2 53 I-All Ao,-4 Ao2 - 5 GNO- 6 52 I-AI2 Ao3 Ao.- 50 I-AI3 Vee Aos - Ao6 - 7 ~Aoa 800 80;- 51 I-GNO 8 49 -AI. 9 48 -Vee 10 47 -Als 11 46 -A16 45 -GNO GNO- 12 13 44 -A17 14 43 -Ala 15 42 -Bl o 16 40 -GNO 802 803 - 19 391-BI2 381- BI3 Vee - 20 80.8Os - 21 371-Vee 36 t-BI. 22 35 t-Bls GND- 23 34 t-GNO 806 - 24 33 t-B16 32 t-B17 ~- 25 BO~- 26 31 t-BOE2 8Oa - 27 30 t-Bla TOO- 28 Truth Tables Inputs AO(0-8) AOE1 AOE2 AI (0-8) L H X L L X H L H X X L BOE1 BOE2 BI (0-8) L H L X H L H X X L L Z Z H 41 -B11 GNO- 17 18 Input pins, A side AI(O-8) Input pins, B side ~8) AOElo AOE2 TRI-STATE Output Enable Input pins, A side BOE1,BOE2 TRI-STATE Output Enable Input pins, B side Output pins, A side 7\0(0-8) Output pins, B side 00(0-8) Inputs X L H = HIGH Voltage Level X = Immaterial 29 t-TCK TLIF/10964-1 8-41 BO (0-8) L Z Z H L = LOW Voltage Level Z = High Impedance Order Number Description SCAN18540TSSC SCAN 18540TSSCX SCAN 18540TFMOB 5962-9312701 MXA SSOP in Tubes SSOP in Tape and Reel Flatpak Military Military SMD # http://www.national.com b v an co ,.. Block Diagrams Byte-A TYPEl INSTRUCTION TRI-STATE AI [O-B] TLlF/10964-2 Tap Controller TO BSR [41] FROM BSR [0] BYPASS REGISTER TDI TDO INSTRUCTION REGISTER INSTRUCTION TRI-STATE TMS TCK TEST ACCESS PORT (TAP) TLlF/10964-3 Byte-B TL/F/10964-4 Note: BSR stands for Boundary Scan Register http://www.national.com 8·42 Description of BOUNDARY-SCAN Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) The INSTRUCTION register is an 8-bit register which captures the default value of 01001101. The two least significant bits of this captured value (01) are required by IEEE Std 1149.1. The upper six bits are unique to the SCAN18540T device. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a "pseudo 10" code to confirm that the correct device is placed in the appropriate location in the boundary scan chain. Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. Instruction Register Scan Chain Definition The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. TOO TDI Bypass Register Scan Chain Definition Logic 0 IofSB LSB TL/F/l0964-10 MSB~ LSB Instruction Code TLlF/l0964-9 Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP 00000011 HIGH-Z All Others BYPASS Scan Cell TYPE1 SCAN OUT (to next coli) DATA I N - - - " T " " - - - - - - - - - - - - - + - - - - DATA OUT SHIFT-OR - - - i - - t SCAN IN (from provlou. c811) TLlF/l0964-7 Scan Cell TYPE2 SCAN OUT (to noxt coli) IofODE------1 • DATA IN--""T""-------------+--------~ DATA OUT SHIFT-OR - - - i - - I SCAN IN UPDATE-DR (from previous coli) TLlF/l0964-6 8-43 http://www.national.com Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY-SCAN Register Scan Chain Definition (42 Bits In Length) TDI 41 40 39 38 37 TDO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 TLlF/10964-23 http://www.national.com 8·44 Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY-SCAN Register Definition Index Bit No. Pin Name Pin No. Pin Type 3 54 Input Input Internal Input Input Internal TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals Scan Cell Type 41 40 39 38 37 36 AOE1 AOE2 AOE BOE1 BOE2 BOE 35 34 33 32 31 30 29 28 27 Alo AI1 AI2 AI3 AI4 Ais AI6 AI7 Ala 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in 26 25 24 23 22 21 20 19 18 Blo BI1 BI2 BI3 BI4 Bis BI6 BI7 Bla 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOo A01 A02 A03 A04 AOs A06 A07 AOa 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 BOo B01 B02 B03 B04 BOs B06 B07 BOa 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 B-in 26 31 8-45 http://www.national.com Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (Vee) Storage Temperature DC Output Source/Sink Current (10) -20mA +20mA Recommended Operating Conditions -20mA +20mA Supply Voltage (Vee) SCAN Products - 0.5V to Vee + 0.5V ±70mA DC Vee or Ground Current Per Output Pin ±70mA Junction Temperature SSOP 2000V Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met. without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of SCAN circuits outside databook specifications. -0.5V to + 7.0V DC Input Diode Current (11K) VI = -0.5V VI = Vee +0.5V DC Output Diode Current (10K) Vo = -0.5V Vo = Vee +0.5V DC Output Voltage (Vo) - 65°C to + 150°C ESD(Min) 4.5Vto 5.5V Input Voltage (VI) OVtoVee Output Voltage (VO) OVtoVee Operating Temperature (TA) Commercial Military + 140°C - 40°C to + 85°C - 55°C to + 125°C Minimum Input Edge Rate dV Idt VIN from 0.8V to 2.0V Vee @ 4.5V, 5.5V 125mV/ns DC Electrical Characteristics Commercial Symbol Parameter Vee (V) TA = +25°C Typ Military Commercial TA = -55°C to + 125°C TA = -40°C to + 85°C Units Conditions Guaranteed limits VIH Minimum High Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = O.W or Vee -o.w Vil Maximum Low Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = O.W or Vee -0.1V VOH Minimum High Output Voltage 4.5 5.5 3.15 4.15 3.15 4.15 3.15 4.15 V 4.5 5.5 2.4 2.4 4.5 5.5 2.4 2.4 2.4 2.4 4.5 5.5 0.1 0.1 0.1 0.1 4.5 5.5 0.55 0.55 4.5 5.5 0.55 0.55 0.55 0.55 5.5 ±0.1 ±1.0 VOL liN Maximum Low Output Voltage Maximum Input Leakage Current Maximum Input liN TDI,TMS Leakage 10lD 10HD 5.5 Minimum Input Leakage 5.5 tMinimum Dynamic Output Current 5.5 2.4 2.4 V 0.1 0.1 V 0.55 0.55 V VIN = Vil or VIH 10H = -32mA VIN = Vil or VIH 10H = -24mA lOUT = 50,..,A VIN = Vil or VIH 10l = 64mA VIN = Vil or VIH IOL = 48 rnA ±1.0 ,..,A VI = Vee,GND 2.8 3.7 3.6 ,..,A VI = Vee -385 -385 -385 ,..,A VI = GND -160 -160 -160 ,..,A VI = GND 94 63 94 rnA VOlD = 0.8V Max -40 -27 -40 rnA VOHD = 2.0V Min tMaximum test duration 2.0 ms, one output loaded at a time. http://www.national.com V lOUT = -50,..,A 8-46 DC Electrical Characteristics (Continued) Symbol Military Commercial Commercial Vee TA = +2SoC TA = -SsoC to + 12SoC TA = -40°C to +8SoC Units (V) Typ Guaranteed Limits Parameter Conditions VI (OE) = VIL. VIH loz Maximum Output Leakage Current 5.5 ±0.5 ±10.0 ±5.0 los Output Short Circuit Current 5.5 -100 -100 -100 lee Maximum Quiescent Supply Current 5.5 16.0 168 88 JiA Vo = Open TDI, TMS = Vee 5.5 750 930 820 JiA Vo = Open TDI. TMS = GND Maximum lee Per Input 5.5 2.0 2.0 2.0 rnA VI mA VI = Vee- 2.1V TDIITMS Pin, Test One with the other Floating leet 2.15 5.5 JiA mAMin Vo = OV 2.15 2.15 = Vee-2.1V • All outputs loaded; thresholds associated with output under test. tMaximum test duration 2.0 ms, one output loaded at a time. Noise Specifications: See Section 4 Commercial Symbol Parameter Vee (V) TA = +2Soc Military TA Commercial = -SsoC to + 12SoC TA = -40°C to +8SoC Units Fig. No. Guaranteed Limits Typ Maximum High Output Noise (Notes 2,3) 5.0 1.0 1.5 V 4·13 Minimum Low Output Noise (Notes 2,3) 5.0 -0.6 -1.2 V 4·13 Maximum Overshoot (Notes 1, 3) 5.0 VOH+ 1.0 VOH+1.5 V 4·13 Minimum Vee Droop (Notes 1. 3) 5.0 VOH-1.0 VOH-1.8 V 4·13 VIHD Minimum High Dynamic Input Voltage Level (Notes 1, 4) 5.5 1.6 2.0 2.0 2.0 V VILD Maximum Low Dynamic Input Voltage Level (Notes 1,4) 5.5 1.4 0.8 0.8 0.8 V VOLP VOLV VOHP VOHV Worst case package. Maximum number of outputs that can switch simultaneously is n. (n-l) outputs are switched LOW and one output held LOW. Note 3: Maximum number of outputs that can switch simultaneously is n. (n-l) outputs are switched HIGH and one output held HIGH. Note 4: Maximum number of data inputs (n) switching. (n-l) input switching OV to 3V. Input under test switching 3V to threshold (VILO). Note 1: Note 2: 8·47 http://www.national.com I- o "1::1" 11) AC Electrical Characteristics ,.... Normal Operation: See Section 4 CO Symbol Parameter Vee· (V) Min tpLH, tpHL Propagation Delay Data toO tpLZ, tpHZ Disable Time tpZL, tPZH Enable Time Commercial Military Commercial TA = +25°C CL = 50 pF TA = -55°C to + 125°C CL = 50 pF TA = -40°C to +85°C CL = 50pF Fig. No. Max Min Max Min Max 5.0 2.5 2.5 9.0 9.0 2.5 2.5 10.5 10.5 2.5 2.5 9.8 9.8 ns 4-1,2 5.0 1.5 1.5 10.2 10.2 1.5 1.5 11.2 11.2 1.5 1.5 10.7 10.7 ns 4-3,4 5.0 2.0 2.0 11.8 9.5 2.0 2.0 13.5 11.5 2.0 2.0 12.8 10.5 ns 4-3,4 Typ ·Voltage Range 5.0 is 5.0V ± 0.5V. http://www.national.com Units 8-48 AC Electrical Characteristics Symbol Parameter Vcc· (V) Min Scan Test Operation: See Section 4 Commercial Military Commercial TA = +25°C CL = 50 pF TA = -55°C to + 125°C CL = 50 pF T A = - 40°C to + 85°C CL = 50 pF Fig. No. Max Min Max Min Max 5.0 3.5 3.5 13.2 13.2 3.5 3.5 15.8 15.8 3.5 3.5 14.5 14.5 ns 4-8 Disable Time TCKtoTDO 5.0 2.5 2.5 11.5 11.5 2.5 2.5 12.8 12.8 2.5 2.5 11.9 11.9 ns 4-9,10 tpZL, tPZH Enable Time TCKtoTDO 5.0 3.0 3.0 14.5 14.5 3.0 3.0 16.7 16.7 3.0 3.0 15.8 15.8 ns 4-9,10 tpLH, tpHL Propagation Delay TCK to Data Out During Update-DR State 5.0 5.0 5.0 18.0 18.0 5.0 5.0 21.7 21.7 5.0 5.0 19.8 19.8 ns 4-8 tpLH, tpHL Propagation Delay TCK to Data Out During UpdateIR State 5.0 5.0 5.0 18.6 18.6 5.0 5.0 21.2 21.2 5.0 5.0 20.2 20.2 ns 4-8 tpLH, tpHL Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 5.5 5.5 19.9 19.9 5.5 5.5 23.0 23.0 5.5 5.5 21.5 21.5 ns 4-8 tpLZ, tpHZ Propagation Delay TCK to Data Out During UpdateDR State 5.0 4.0 4.0 16.4 16.4 4.0 4.0 19.6 19.6 4.0 4.0 18.2 18.2 ns 4-9,10 tpLZ, tpHZ Propagation Delay TCK to Data Out During UpdateIRState 5.0 5.0 5.0 19.5 19.5 5.0 5.0 22.4 22.4 5.0 5.0 20.8 20.8 ns 4-9,10 tpLZ, tpHZ Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 5.0 5.0 19.9 19.9 5.0 5.0 23.3 23.3 5.0 5.0 21.5 21.5 ns 4-9,10 tpZL, tPZH Propagation Delay TCK to Data Out During UpdateDR State 5.0 5.0 5.0 18.9 18.9 5.0 5.0 22.6 22.6 5.0 5.0 20.9 20.9 ns 4-9,10 tpZL, tPZH Propagation Delay TCK to Data Out During UpdateIRState 5.0 6.5 6.5 22.4 22.4 6.5 6.5 26.2 26.2 6.5 6.5 24.2 24.2 ns 4-9,10 tpZL, tPZH Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 7.0 7.0 23.8 23.8 7.0 7.0 27.4 27.4 7.0 7.0 25.7 25.7 ns 4-9,10 tpLH, tpHL Propagation Delay TCKtoTDO tpLZ, tpHZ Typ Units ·Voltage Range 5.0 is 5.0V ±O.5V. All Propagation Delays involving TCK are measured from the falling edge of TCK. 8-49 http://www.national.com • I- o 0IIIt' Ln CO ,... AC Operating Requirements Scan Test Operation: Symbol Vcc· (V) Parameter See Section 4 Commercial Military Commercial TA = +25°C CL = 50pF TA = -55°C to + 125°C CL = 50pF TA = -40°C to +85°C CL = 50 pF Units Fig. No. Guaranteed Minimum ts Setup Time, H or L Data to TCK (Note 1) 5.0 3.0 3.0 3.0 ns 4-11 tH Hold Time, H or L TCK to Data (Note 1) 5.0 4.5 5.5 4.5 ns 4-11 ts Setup Time, H or L AOE n , BOE n to TCK (Note 3) 5.0 3.0 3.0 3.0 ns 4-11 Hold Time, H or L TCKto AOEn , BOE n (Note 3) 5.0 4.5 4.5 4.5 ns 4-11 Setup Time, H or L Internal AOE, BOE, to TCK (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 Hold Time, H or L TCK to Internal AOE, BOE (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 ts Setup Time, H or L TMSto TCK 5.0 8.0 8.0 8.0 ns 4-11 tH Hold Time, H or L TCKtoTMS 5.0 2.0 2.0 2.0 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 4.0 4.0 4.0 ns 4-11 tH Hold Time, H or L TCKto TDI 5.0 4.5 4.5 4.5 ns 4-11 tw Pulse Width TCK 15.0 5.0 15.0 5.0 15.0 5.0 ns 4-12 tH ts tH 5.0 H L fmax MaximumTCK Clock Frequency 5.0 25 25 25 MHz Tpu Wait Time, Power Up to TCK 5.0 100 100 100 ns TON Power Down Deiay 0.0 100 100 100 ms ·Voltage Range 5.0 Is 5.0V ± 0.5V. All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17,18-26, and 27-35. Note 2: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Note 3: Timing pertains to BSR 37, 38, 40 and 41. http://www.national.com 8-50 ....... Q) Extended AC Electrical Characteristics: Symbol TA = Com Vee = Com CL = 50 pF 18 Outputs Switching (Note 2) Parameter See Section 4 .1:10 o -f TA = Mil Vee = Mil CL = 50 pF 18 Outputs Switching (Note 2) TA = Com Vee = Com CL = 250 pF (Note 3) TA = Mil Vee = Mil CL = 250 pF (Note 3) Units Max Min Max Min Max Min Max tpLH. tpHL Propagation Delay Data to Output 3.0 3.0 11.0 11.0 3.0 3.0 11.5 11.5 4.0 4.0 13.0 15.0 4.0 4.0 14.0 16.0 tpZH. tPZL Output Enable Time 2.5 2.5 11.5 14.0 2.5 2.5 12.5 14.5 (Note 4) (Note 4) ns tpHZ. tpLZ Ouput Disable Time 2.0 2.0 11.5 11.5 2.0 2.0 12.0 12.0 (NoteS) (Note 5) ns tOSHL (Note 1) Pin to Pin Skew HL Data to Output 0.5 1.0 1.0 ns tOSLH (Note 1) Pin to Pin Skew LH Data to Output 0.5 1.0 1.0 ns Min Typ U1 ns Note 1: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH to LOW (toSHU, LOW to HIGH (toSLH), or any combination LOW to HIGH and/or HIGH to LOW. Note 2: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., alilow-to-high, highto-low etc.). Note 3: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only. Note 4: TRI-STATE delays are load dominated and have been excluded from the datasheet. Note 5: The Output Disable TIme is dominated by the RC network (SOOn, 250 pF) on the output and has been excluded from the datasheet. Capacitance Typ Units CIN Symbol Input Pin Capacitance Parameter 4.0 pF Vee Conditions = 5.0V COUT Output Pin Capacitance 13.0 pF Vee = 5.0V CPD Power Dissipation Capacitance 34.0 pF Vee = 5.0V • 8·51 http://www.national.com I,.... ~ ttJNational Semiconductor SCAN18541T Non-Inverting Line Driver with TRI-STATE® Outputs General Description Features The SCAN18541T is a high speed, low-power line driver featuring separate data inputs organized into dual 9-bit bytes with byte-oriented paired output enable control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary-scan test logic and test access port consisting of Test Data Input (TO I), Test Data Out (TOO), Test Mode Select (TMS), and Test Clock (TCK). • • • • • • • • • • IEEE 1149.1 (JTAG) Compliant Dual output enable signals per byte TAl-STATE outputs for bus-oriented applications 9-bit data busses for parity applications Aeduced-swing outputs source 32 mA/sink 64 mA (Comm), source 24 mA/sink 48 mA (Mil) Guaranteed to drive 50n transmission line to TIL input levels of 0.8V and 2.0V TIL compatible inputs 25 mil pitch SSOP (Shrink Small Outline Package) Includes CLAMP and HIGHZ instructions Member of National's SCAN Products Ordering Code: See Section 11 Pin Names Connection Diagram ncs- 1 AOo- 2 A0E,- 3 Ao,- 4 '-' Pin Names 56 .... TOI Input Pins, A Side ~S)__ Input Pins, B Side AOE1, AOE2 TAl-STATE Output Enable Input Pins, A Side BOE1, BOE2 TAl-STATE Output Enable Input Pins, 8 Side AO(O-s) Output Pins, A Side AO(o-S) Output Pins, 8 Side 55 -Alo 54 :-AOE2 53 ~A~ A02 - 5 GNO- 6 52 -A12 51 ~GNO A03 - 7 AO.- 8 50 ~A13 49 ~AI. Vcc - 9 48 ~Vcc A05 A06 - 10 47 ~A15 11 46 ~A16 GNO- 12 45 ~GNO AO-,- 13 44 ~A7 AOa- 14 43 800- 15 42 ~81o 80,- 16 41 ~8~ Description AI(O-S) Truth Tables I--_-.--_In_p_ut-rs_ _- I AO (0-8) AOE2 AI (0-8) L H X ~A18 L i. X H H X H X Z Z L L L GNO- 17 40 ~GNO 802- 18 39 ~812 803- 19 38 ~813 Vcc - 20 37 ~Vcc L L H H 80.- 21 36 ~81. H 8°5- 22 35 ~815 X X Z Z GNO- 23 341-GNO X L X H L L L 8°6- 24 33 1-8~ 80-,- 25 32 ~87 80E,- 26 31 ~80E2 80a- 27 30 ~818 TOO- 28 29 I-TCK I--_-.--_In_p_ut-rs_ _- I BO (0-8) BOE2 BI (0-8) H L X = = Z = TL/F/10965-1 http://www.national.com = HIGH Voltage Level 8-52 LOW Voltage Level Immaterial High Impedance Order Number Description SCAN18541 TSSC SCAN18541TSSCX SCAN18541 TFMQ8 5962-9311601 MXA SSOP in Tubes SSOP in Tape and Aeel Flatpak Military Military SMD# ,-------------------------------------------------------------------------------------------, ~ co U1 Block Diagrams ~ ~ -I Byte A TYPE! AI [0-8] TL/F/l0965-2 Tap Controller TO BSR [41] FROM BSR [0] BYPASS REGISTER TDI TOO INSTRUCTION REGISTER INSTRUCTION TRI-STATE TMS TCK TEST ACCESS PORT (TAP) TLlF/l0965-3 Byte B TL/F/l0965-4 Note: BSR stands for Boundary Scan Register. 8·53 http://www.national.com I,.... "I:t' Ln co ,.... Description of Boundary-Scan Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. The INSTRUCTION register is an 8-bit register which captures the default value of 10000001. The two least significant bits of this captured value (01) are required by IEEE Std 1149.1. The upper six bits are unique to the SCAN18541T device. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a "pseudo 10" code to confirm that the correct device is placed in the appropriate location in the boundary scan chain. Instruction Register Scan Chain Definition TOI TOO MSB Bypass Register Scan Chain Definition Logic 0 lSB TL/F/l0965-10 MSB~LSB Instruction Code TL/F/l0965-9 Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP 00000011 HIGH-Z All Others BYPASS Scan Cell TYPE1 SCAN OUT (to next cell) DATA IN ----r--------------f----- DATA OUT SHIFT _DR ----4---1 SCAN IN CLOCK-DR (from previous cell) TLlF/l0965-7 Scan Cell TYPE2 SCAN OUT (to next cell) DATA I N - - " " " T " - - - - - - - - - - - - - + - - - - - - - - - - I DATA OUT SHIFT _DR ---4---1 SCAN IN UPDATE-DR (from previous cell) http://www.national.com TL/F/l0965-B 8-54 ~----------------------------------------------------------------------------------~ ~ (X) U1 Description of Boundary-Scan Circuitry (Continued) ~ ~ -i Boundary-Scan Register Scan Chain Definition (42 Bits In Length) TDI 41 40 39 38 37 TOO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 2 4 TL/F/10965-23 8·55 http://www.national.com Description of Boundary-Scan Circuitry (Continued) Boundary-Scan Register Definition Index Bit No. Pin Name Pin No. Pin Type 3 54 Input Input Internal Input Input Internal Scan Cell Type TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals 41 40 39 38 37 36 AOE1 AOE2 AOE BOE1 BOE2 BOE 35 34 33 32 31 30 29 28 27 Alo AI1 AI2 AI3 AI4 AI5 Als AI7 Ala 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in 26 25 24 23 22 21 20 19 18 Blo BI1 BI2 BI3 BI4 BI5 Bls 81 7 81a 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOo A01 A02 A03 A04 A05 AOs A07 AOa 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 800 80 1 802 803 804 805 80s 807 80a 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 8-out http://www.national.com 26 31 8-56 Absolute Maximum Ratings (Note 1) - 65·C to + 150·C Storage Temperature ESD(Min) 2000V Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design Is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of SCAN Circuits outside databook specifications. If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (VeC> DC Input Diode Current (11K) VI = -0.5V VI = Vee +0.5V DC Output Diode Current (10K) Vo = -0.5V Vo = Vee +0.5V DC Output Voltage (Vo) DC Output Source/Sink Current (10) -0.5V to + 7.0V -20mA +20mA Recommended Operating Conditions -20mA +20mA -0.5V to Vee + 0.5V ±70mA DC Vee or Ground Current Per Output Pin Junction Temperature SSOP Supply Voltage (VeC> SCAN Products Input Voltage (VI) Output Voltage (VO) Operating Temperature (TA) Commercial Military Minimum Input Edge Rate dV /dt VIN from 0.8V to 2.0V Vee @ 4.5V, 5.5V ±70mA + 140·C 4.5Vto 5.5V OVtoVee OVtoVee -40·C to + 85·C - 55·C to + 125·C 125 mV/ns DC Electrical Characteristics Commercial Symbol Parameter Vee (V) TA Military Commercial = +25·C TA = -55·C to + 125·C TA = -40·C to + 85·C Units Typ Conditions Guaranteed Limits VIH Minimum High Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = O.W or Vee -O.W VIL Maximum Low Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1V or Vee -o.w VOH Minimum High Output Voltage 4.5 5.5 3.15 4.15 3.15 4.15 3.15 4.15 V 4.5 5.5 2.4 2.4 2.4 2.4 V 4.5 5.5 2.4 2.4 2.4 2.4 4.5 5.5 0.1 0.1 0.1 0.1 4.5 5.5 0.55 0.55 4.5 5.5 0.55 0.55 0.55 0.55 5.5 ±0.1 ±1.0 VOL liN Maximum Low Output Voltage Maximum Input Leakage Current Maximum Input liN TDI, TMS Leakage 10LO 10HO 0.1 0.1 V 0.55 0.55 V V ±1.0 p.A = - 50 p.A = VIL or VIH = -32mA VIN = VIL or VIH 10H = -24mA lOUT = 50 p.A VIN IOH = VIL or VIH = 64mA VIN = VIL or VIH 10L = 48 mA VIN IOL VI = Vee,GND 2.8 3.7 3.6 p.A VI -385 -385 -385 p.A VI 5.5 -160 -160 -160 p.A tMinimum Dynamic 5.5 Output Current 94 63 94 mA VOLO -40 -27 -40 mA VOHO Minimum Input Leakage 5.5 V lOUT = Vee = GND VI = GND = 0.8V Max = 2.0V Min tMaximum test duration 2.0 ms, one output loaded at a time. 8-57 http://www.national.com DC Electrical Characteristics (Continued) Commercial Parameter Symbol Vee (V) TA Military Commercial = +2S"C TA = -SS"C to + 12S"C TA = -40"C to +8S"C Units Typ Conditions Guaranteed Limits loz Maximum Output Leakage Current 5.5 ±0.5 ±10.0 ±5.0 lOS Output Short Circuit Current 5.5 -100 -100 -100 IcC Maximum Quiescent 5.5 Supply Current 16.0 168 88 /-LA Vo = Open TDI, TMS = Vcc 5.5 750 930 820 /-LA Va = Open TDI, TMS = GND 5.5 2.0 2.0 2.0 mA VI ICet Maximum Icc Per Input 5.5 2.15 2.15 2.15 /-LA VI (OE) mA Va (min) = VIL, VIH = OV = Vcc- 2.1V VI = Vcc- 2.1V mA TDI/TMS Pin, Test One with the Other Floating outputs loaded; thresholds associated with output under test. tMaxlmum test duration 2.0 ms, one output loaded at a time. "All Noise Specifications: See Section 4 Commercial Symbol Parameter Vee (V) TA = +2S"C Military TA = -SS"C to + 12S"C Typ Commercial TA = -40"C to +8S"C Units Fig. No. Guaranteed Limits Maximum High Output Noise (Notes 2, 3) 5.0 1.0 1.5 V 4-13 Minimum Low Output Noise (Notes 2,3) 5.0 -0.6 -1.2 V 4-13 Maximum Overshoot (Notes 1,3) 5.0 VOH+1.0 VOH+ 1.5 V 4-13 MinimumVcc Droop (Notes 1, 3) 5.0 VOH-1.0 VOH-1.8 V 4-13 VIHD Minimum High Dynamic Input Voltage Level (Notes 1, 4) 5.5 1.6 2.0 2.0 2.0 V VILD Maximum Low Dynamic Input Voltage Level (Notes 1, 4) 5.5 1.4 0.8 0.8 0.8 V VOLP VOLV VOHP VOHV Worst case package. Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched LOW and one output held LOW. Nota 3: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched HIGH and one output held HIGH. Note 4: Maximum number of data Inputs (n) switching. (n-1) input switching ov to 3V. Input under test switching 3V to threshold (VILO). Nota 1: Nota 2: http://www.national.com 8-58 ..... AC Electrical Characteristics Symbol Parameter Vee· (V) tpLH, tpHL tpLZ. tpHZ Disable Time tpZL. tPZH Enable Time ..... Commercial Military Commercial TA = +25°C Cl = 50 pF TA = - 55°C to + 125°C Cl = 50pF TA = - 40°C to + 85°C Cl = 50pF Typ Min Propagation Delay Data toO CD U1 0l:Io Normal Operation: See Section 4 -I Units Fig. No. Max Min Max Min Max 2.5 2.5 10.5 10.5 2.5 2.5 9.8 9.8 ns 4-1.2 5.0 2.5 2.5 9.0 9.0 5.0 1.5 1.5 10.2 10.2 1.5 1.5 11.2 11.2 1.5 1.5 10.7 10.7 ns 4-3.4 5.0 2.0 2.0 11.8 9.5 2.0 2.0 13.5 11.5 2.0 2.0 12.8 10.5 ns 4-3.4 'Voltage Range 5.0 is S.OV ± 0.5V. AC Electrical Characteristics Scan Test Operation: Symbol Parameter Vee· (V) See Section 4 Commercial Military Commercial TA = +25°C Cl = 50 pF TA = -55°C to + 125°C Cl = 50pF TA = -40°C to + 85°C Cl = 50pF Max Min Max 13.2 13.2 3.5 3.5 15.8 15.8 3.5 3.5 14.5 14.5 ns 4-8 2.5 2.5 11.5 11.5 2.5 2.5 12.8 12.8 2.5 2.5 11.9 11.9 ns 4-9.10 5.0 3.0 3.0 14.5 14.5 3.0 3.0 16.7 16.7 3.0 3.0 15.8 15.8 ns 4-9.10 Propagation Delay TCK to Data Out During Update· DR State 5.0 5.0 5.0 18.0 18.0 5.0 5.0 21.7 21.7 5.0 5.0 19.8 19.8 ns 4-8 tpLH. tpHL Propagation Delay TCK to Data Out During Update·IR State 5.0 5.0 5.0 18.6 18.6 5.0 5.0 21.2 21.2 5.0 5.0 20.2 20.2 ns 4-8 tpLH. tpHL Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 5.5 5.5 19.9 19.9 5.5 5.5 23.0 23.0 5.5 5.5 21.5 21.5 ns 4-8 tpLZ. tpHZ Propagation Delay TCK to Data Out During Update·DR State 5.0 4.0 4.0 16.4 16.4 4.0 4.0 19.6 19.6 4.0 4.0 18.2 18.2 ns 4-9.10 tpLZ, tpHZ Propagation Delay TCK to Data Out During Update·IR State 5.0 5.0 5.0 19.5 19.5 5.0 5.0 22.4 22.4 5.0 5.0 20.8 20.8 ns 4-9.10 tPLZ. tpHZ Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 5.0 5.0 19.9 19.9 5.0 5.0 23.3 23.3 5.0 5.0 21.5 21.5 ns 4-9,10 tpZL. tpZH Propagation Delay TCK to Data Out During Update·DR State 5.0 5.0 5.0 18.9 18.9 5.0 5.0 22.6 22.6 5.0 5.0 20.9 20.9 ns 4-9.10 tpLH. tpHL 5.0 3.5 3.5 tpLZ. tpHZ Disable Time TCKtoTDO 5.0 tpZL. tPZH Enable Time TCK to TOO tpLH. tpHL Max Fig. No. Min Min Propagation Delay TCKtoTDO Typ Units 'Voltage Range 5.0 is S.OV ±O.SV. All Propagation Delays involving TCK are measured from the falling edge of TCK. 8·59 http://www.national.com AC Electrical Characteristics Scan Test Operation: Symbol Vee· (V) Parameter See Section 4 (Continued) Commercial Military Commercial TA = +2SOC Cl = SO pF TA = -Ssoc to + 12SOC Cl = SOpF TA = - 40°C to + 8SoC Cl = SOpF Max Min Max Min Max Min Typ Units Fig. No. tpZL, tPZH Propagation Delay TCK to Data Out During Update-IR State S.O 6.5 6.5 22.4 22.4 6.5 6.5 26.2 26.2 6.5 6.5 24.2 24.2 ns 4-9,10 tpZL, tPZH Propagation Delay TCK to Data Out During Test Logic Reset State 5.0 7.0 7.0 23.8 23.8 7.0 7.0 27.4 27.4 7.0 7.0 25.7 25.7 ns 4-9,10 'Voltage Range 5.0 is 5.0V ± 0.5V. All Propagation Delays involving TCK are measured from the falling edge of TCK. AC Operating Requirements Scan Test Operation: Symbol Vee· (V) Parameter See Section 4 Commercial Military Commercial TA = +2SOC Cl = SOpF TA = -Ssoc to + 12SOC Cl = SOpF TA = -40°C to +8SOC Cl = SOpF Units Fig. No. Guaranteed Minimum ts Setup Time, H or L Data to TCK (Note 1) 5.0 3.0 3.0 3.0 ns 4-11 tH Hold Time, H or L TCK to Data (Note 1) 5.0 4.5 5.0 4.5 ns 4-11 ts Setup Time, H or L AOE n , BOEn to TCK (Note 3) 5.0 3.0 3.0 3.0 ns 4-11 Hold Time, H or L TCKto AOE n , BOEn (Note 3) 5.0 4.5 4.5 4.5 ns 4-11 Setup Time, H or L Internal AOE, BOE, to TCK (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 Hold Time, H or L TCK to Internal AOE, BOE (Note 2) 5.0 3.0 3.0 3.0 ns 4-11 ts Setup Time, H or L TMSto TCK 5.0 8.0 8.0 8.0 ns 4-11 tH Hold Time, H or L TCKto TMS 5.0 2.0 2.0 2.0 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 4.0 4.0 4.0 ns 4-11 tH Hold Time, H or L TCKto TDI 5.0 4.5 4.5 4.5 ns 4-11 tw Pulse Width TCK 5.0 15.0 5.0 15.0 5.0 15.0 5.0 ns 4-12 tH ts tH H L http://www.national.com 8-60 AC Operating Requirements Scan Test Operation: See Section 4 (Continued) Commercial Symbol Parameter Military TA = +2SOC CL = SOpF Vee· (V) TA = Commercial -Ssoc to + 12SOC CL = SOpF TA = -40°C to +8SOC CL = SOpF Units Guaranteed Minimum f max MaximumTCK Clock Frequency 5.0 25 25 25 MHz Tpu Wait Time, Power Up toTCK 5.0 100 100 100 ns TON Power Down Delay 0.0 100 100 100 ms ·Voltage Range 5.0 Is 5.0V ±0.5V. All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0·8, 9·17, 18·26 and 27·35. Note 2: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Note 3: Timing pertains to BSR 37, 38, 40 and 41 only. Extended AC Electrical Characteristics Symbol Parameter TA = Com Vee = Com CL = SOpF 18 Outputs Switching (Note 2) Min Typ TA = Mil Vee = Mil CL = SOpF 18 Outputs Switching (Note 2) TA = Com Vee = Com CL = 2S0pF (Note 3) TA = Mil Vee = Mil CL = 2S0 pF (Note 3) Units Max Min Max Min Max Min Max tpLH, tpHL Propagation Delay Data to Output 3.0 3.0 11.0 11.0 3.0 3.0 11.5 11.5 4.0 4.0 13.0 15.0 4.0 4.0 14.0 16.0 tpzH, tPZL Output Enable Time 2.5 2.5 11.5 14.0 2.5 2.5 12.5 14.5 (Note 4) (Note 4) ns tpHZ, tpLZ Output Disable Time 2.0 2.0 11.5 11.5 2.0 2.0 12.0 12.0 (NoteS) (Note 5) ns tOSHL (Note 1) Pin to Pin Skew HL Data to Output 0.5 1.0 1.0 ns tOSLH (Note 1) Pin to Pin Skew LH Data to Output 0.5 1.0 1.0 ns ns Nota 1: Skew Is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH to LOW (toSHU, LOW to HIGH (toSLH), or any combination switching LOW to HIGH and/or HIGH to LOW. Note 2: This specification Is guaranteed but not tested. The limits apply to propagation delays for all paths described switching In phase (I.e., all low· to· high, high· to-low, etc.). Note 3: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load. This specification pertains to single output switching only. Note 4: TRI-STATE delays are load dominated and have been excluded from the datasheet. Note 5: The Output Disable Time Is dominated by the RC network (500n, 250 pF) on the output and has been excluded from the datasheet. Capacitance Symbol Typ Units Input Pin Capacitance 4.0 pF Vee COUT Output Pin Capacitance 13.0 pF Vee CPO Power Dissipation Capacitance 34.0 pF CIN Parameter 8-61 Conditions = 5.0V = 5.0V Vee = 5.0V http://www.national.com Section 9 SCAN ABT Test Access Logic Datasheets http://www.national.com Section 9 Contents SCAN182245A Non-Inverting Transceiver with 25.0 Series Resistor Outputs. . . . . . . . . . . . . . . SCAN 182373A Transparent Latch with 25.0 Series Resistor Outputs. . . . . . . . . . . . . . . . . . . . . . SCAN 182374A 0 Flip-Flop with 25.0 Series Resistor Outputs ............................ SCAN 182541 A Non-Inverting Line Driver with 25.0 Series Resistor Outputs. . . . . . . . . . . . . . . . 9-2 9-3 9-18 9-31 9-44 f}1National Semiconductor SCAN 182245A Non-Inverting Transceiver with 25n Series Resistor Outputs General Description Features The SCAN182245A is a high performance SiCMOS bidirectional line driver featuring separate data inputs organized into dual 9-bit bytes with byte-oriented output enable and direction control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary-scan test logic and test access port consisting of Test Data Input (TOI), Test Data Out (TOO), Test Mode Select (TMS), and Test Clock (TCK). • High performance BiCMOS technology • 250 series resistors in outputs eliminate the need for external terminating resistors • Dual output enable control signals • TRI-STATE® outputs for bus-oriented applications • 25 mil pitch SSOP (Shrink Small Outline Package) • IEEE 1149.1 (JTAG) Compliant • Includes CLAMP, IDCODE and HIGHZ instructions • Additional instructions SAMPLE-IN, SAMPLE-OUT and EXTEST-OUT • Power Up TRI-STATE for hot insert • Member of National's SCAN Products Ordering Code: See Section 11 Connection Diagram Tt.4S - 1 81 0 - 2 \.J 56 to- TOI 55 I- Ala DlRl- 3 54 to- G1 81 , - 4 53 to- A" 81 2 - 5 GND- 6 52 -A1 2 51 - GND 813 - 7 50 - 81. - 8 49 - AI. Vee - 9 48 - Vee 81 5 - 10 47 - A15 816 - 11 46 - A16 GND - 12 45 - GND 81 7 - 13 44 - A '7 81a - 14 43 - Ala A20 82 0 - 15 42 - 82 , - 16 41 -A2, GND - 17 40 - GND 82 2 - 18 39 - A22 82 3 - 19 38 - A23 Vee - 20 37 - Vee 82. - 21 36 - A2. 82 5 - 22 35 I- A25 GND - 23 34 I- GND 82 6 - 24 33 82 7 - 25 32 I- A27 26 31 I- G2 82a - 27 30 I- A2a 29 A1(0-8) B1 (0-8) A2(0_8) B2(0_8) G1,G2 DIR1, DIR2 Description Side A 1 Inputs or TRI-STATE Outputs Side B1 Inputs orTRI-STATE Outputs Side A2 Inputs or TRI-STATE Outputs Side B21nputs orTRI-STATE Outputs Output Enable Pins (Active Low) Direction of Data Flow Pins Order Number Description SCAN 182245ASSC SCAN182245ASSCX SCAN 182245AFMQB SSOP in Tubes SSOP Tape and Reel Flatpak Military to- A26 DIR2 - TOO- 28 Pin Names A '3 to- TCK TL/FI116S7-1 9-3 http://www.national.com Truth Tables Functional Description I Inputs A1(0-8) tG1 DIR1 L L L L H L L H H H L H L X Z ~ ~ ---+ ---+ I A2(0-8) DIR2 L L L L H L L H H H L H L X Z B1(0-8) H L H L Z Inputs tG2 The SCAN182245A consists of two sets of nine non-inverting bidirectional buffers with TRI-STATE outputs and is intended for bus-oriented applications. Direction pins (DIR1 and DIR2) LOW enables data from B ports to A ports, when HIGH enables data from A ports to B ports. The Output Enable pins (G1 and G2) when HIGH disables both A and B ports by placing them in a high impedance condition. ~ ~ ---+ ---+ B2(0-8) H L H L Z H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance t = Inactive·to-Active transition must occur to enable outputs upon power-up. Block Diagrams A1, 81, G1 and DIR1 TYPE1 TYPE1 A1 [0-8] B1 [0-8] TLIF/11657-2 Note: BSR stands for Boundary Scan Register. http://www.national.com 9-4 r-----------------------------------------------------------------------------------------~ Block Diagrams ~ co N (Continued) N 0l:Io U1 » Tap Controller r----., fROM BSR[O] IDCODE REGISTER TOI BYPASS REGISTER TOO INSTRUCTION TRI-STATE TMS TCK TL/F/11657-18 A2, 82, G2 and DIR2 TYPE1 TYPE2 82 [o-a] A2 [o-a] TL/F/11657-3 Note: BSR stands for Boundary Scan Register. 9-5 http://www.national.com Description of BOUNDARY-SCAN Circuitry The INSTRUCTION register is an a-bit register which captures the default value of 10000001 (SAMPLE/PRELOAD) during the CAPTURE-IR instruction command. The benefit of capturing SAMPLE/PRELOAD as the default instruction during CAPTURE-IR is that the user is no longer required to shift in the a-bit instruction for SAMPLE/PRELOAD. The sequence of: CAPTURE-IR ~ EXIT1-IR ~ UPDATE-IR will update the SAMPLE/PRELOAD instruction. For more information refer to the section on instruction definitions. The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data. while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12for a further description of scan cell TYPE2.) Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. Instruction Register Scan Chain Definition TOI TOO The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. t.lSB lSB Bypass Register Scan Chain Definition Logic 0 TL/F/11657-10 MSB Instruction Code ~ LSB Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP TL/F/11657-17 SCAN182245A Product IDCODE (32-BIt Code per IEEE 1149.1) Version Entity 0000 Part Number Manufacturer Required by 1149.1 10 111111 0000000000 00000001111 MSB http://www.national.com 1 LSB 9-6 00000011 HIGH-Z 01000001 SAMPLE-IN 01000010 SAMPLE-OUT 00100010 EXTEST-OUT 10101010 IDCODE 11111111 BYPASS All Others BYPASS ..... CO N Description of BOUNDARY-SCAN Circuitry (Continued) N 0l:Io U1 l> Scan Cell TVPE1 SCAN OUT (to next cell) DATA IN--------,---------------------------------+------------DATAOUT SHIrT _DR -----+---1 SCAN IN (from previous cell) TLlF/11657-11 Scan Cell TVPE2 SCAN OUT (to next cell) MODE --------1 DATAIN------,---------------------------------+---------------------~ DATA OUT SHI rT _ DR - - - - . f - - - f SCAN IN CLOCK-DR (from previous cell) TL/F/11657-12 9·7 http://www.national.com Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY-SCAN Register Scan Chain Definition (80 Bits In Length) TOI 36 IN 37 IN 38 IN 39 IN IN 40 IN IN 41 IN IN 42 IN IN 43 IN IN 44 IN IN 45 IN IN 46 IN 10 IN 47 IN 11 48 IN 12 IN 49 IN 13 IN 50 IN 14 IN IN 51 15 IN 52 IN 16 IN 53 IN 17 TL/F/11657-32 http://www.national.com 9·8 Description of BOUNDARY-SCAN Circuitry (Continued) Input BOUNDARY-SCAN Register Scan Chain Definition (40 Bits In Length) When Sample In Is Active TOI 75 7J. TOO 71 IN 35 IN 70 34 IN 69 33 68 32 67 31 66 30 65 29 IN 64 28 IN 63 IN 62 26 IN 61 25 IN 60 24 IN 59 23 IN 58 IN 22 IN 57 IN 21 IN 56 IN 20 IN 55 IN 19 IN 54 IN 18 IN IN 27 • TL/F/11657-33 9·9 http://www.national.com Description of BOUNDARY-SCAN Circuitry (Continued) Output BOUNDARY-SCAN Register Scan Chain Definition (40 Bits in Length) When Sample Out and EXTEST-Out are Active TOI TYPE2 73 TOO 72 OUT 36 OUT 37 OUT OUT 38 OUT OUT 39 OUT OUT 40 OUT OUT 41 OUT OUT 42 OUT OUT 43 OUT OUT 44 OUT OUT 45 OUT OUT 46 OUT 10 OUT 47 OUT 11 OUT 48 OUT 12 OUT 49 OUT 13 OUT 50 OUT 14 OUT 51 15 OUT 52 16 OUT 53 OUT 17 TLlF/11657-34 http://www.national.com 9-10 Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY·SCAN Register Definition Index Pin No. Pin Type 3 54 76 75 74 73 72 DIR1 G1 AOE1 80E1 DIR2 G2 AOE2 80E2 Input Input Internal Internal Input Input Internal Internal TYPE1 TYPE1 TYPE2 TYPE2 TYPE1 TYPE1 TYPE2 TYPE2 Control Signals 71 70 69 68 67 66 65 64 63 A10 A11 A12 A13 A14 A15 A16 A17 A18 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A1-in 62 61 60 59 58 57 56 55 54 A20 A21 A22 A23 A24 A25 A26 A27 A28 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A2-in 53 52 51 50 49 48 47 46 45 81 0 81 1 81 2 81 3 81 4 81 5 81 6 81 7 81 8 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 81-out 44 43 42 41 40 39 38 37 36 82 0 82 1 82 2 82 3 82 4 82 5 826 827 82 8 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 82-out 35 34 33 32 31 30 29 28 27 81 0 81 1 81 2 81 3 81 4 81 5 81 6 81 7 81 8 2 4 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 81-in Bit No. 79 78 77 Pin Name 26 31 5 7 8 10 11 13 14 9-11 Scan Cell Type http://www.national.com Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY-SCAN Register Definition Index (Continued) Pin No. Pin Type 26 25 24 23 22 21 20 19 18 B20 B21 B22 B23 B24 B25 B26 B27 B28 15 16 18 19 21 22 24 25 27 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B2-in 17 16 15 14 13 12 11 10 9 A10 A11 A12 A13 A14 A15 A16 A17 A18 55 53 52 50 49 47 46 44 43 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A1-out 8 7 6 5 4 3 2 1 0 A20 A21 A22 A23 A24 A25 A26 A27 A28 42 41 39 38 36 35 33 32 30 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A2-out Bit No. http://www.national.com Pin Name 9·12 Scan Cell Type r-------------------------------------------------------------------------------------------, SCAN ABT Live Insertion and Power Cycling Characteristics I\) Go flip-flop. To bring the device out of high impedance. the input must receive an inactive-to-active transition, a high-tolow transition on in this case to change the state of the flip-flop. With a Iowan the Q output of the flip-flop. the NOR gate is free to allow propagation of a Go signal. SCAN ABT is intended to serve in Live Insertion backplane applications. It provides 2nd Levellsolation 1 which indicates that while external circuitry to control the output enable pin is unnecessary, there may be a need to implement differential length backplane connector pins for Vee and GND. As well, pre-bias circuitry for backplane pins may be necessary to avoid capacitive loading effects during live insertion. Go During power-down, the Power-an-Reset circuitry will become active and reset the flip-flop at approximately 1.BV Vee. Again. the Q output of the flip-flop returns to a high and disables the NOR gate from inputs from the Go pin. The device will then remain in high impedance for the remaining ramp down from 1.BV to O.OV Vee. Some suggestions to help the designer with live insertion issues: SCAN ABT provides control of output enable pins during power cycling via the circuit in Figure A. It essentially controls the Gn pin until Vee reaches a known level. During power-up, when Vee ramps through the O.OV to O.7V range, all internal device circuitry is inactive, leaving output and I/O pins 01 the device in high impedance. From approximately O.BV to 1.BV Vee, the Power-an-Reset circuitry, (PaR), in Figure A becomes active and maintains device high impedance mode. The paR does this by providing a low from its output that resets the flip-flop The output, 5, of the flip-flop then goes high and disables the NOR gate from an incidental low input on the Gn pin. After 1.BV Vee, the paR circuitry becomes inactive and ceases to control the Go • The pin can float during power-up until the Power-OnReset circuitry becomes inactive. Go • The pin can float on power-down only after the Power-an-Reset has become active. The description of the functionality of the Power-an-Reset circuitry can best be described in the diagram of Figure B. TO INTERNAL TRI-STATE CIRCUITRY VCC ClK ot--_. . . RESET POWER ON RESET TLlF/11657-19 FIGURE A ~ ~ I I I I I I I DEVICE IN HIGH IMPEDANCE MODE VCC (v) I POWER-ON RESET CIRCUIT OFF I I I I I I I All CIRCUIT --(oi4z!S~~~~----.._--""T""--___r----......_~__........,;--.._--""T""--___r----......_--__...~~~~~ ELEMENTS INACTIVE RAMP-UP AND RAt.4P-DOWN TIME POWER DOWN CYCLE POWER UP CYCLE TLlF/11657-20 FIGURES 1Section 7, "Design Consideration for Fault Tolerant Backplanes", Application Note AN-BB1. SCAN ABT includes additional power-on reset circuitry not otherwise included in ABT devices. 9-13 ~ co I\) http://www.national.com 0l::Io UI l> Absolute Maximum Ratings (Note 1) DC Latchup Source Current Commercial Military If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature -65°C to + 150°C Over Voltage Latchup (lID) Ambient Temperature under Bias - 55°C to + 125°C ESD (HBM) Min. Junction Temperature under Bias Ceramic Plastic - 55°C to + 175°C - 55°C to + 150°C Vee Pin Potential to Ground Pin -0.5V to + 7.0V Input Voltage (Note 2) - 0.5V to + 7.0V Input Current (Note 2) -30 mA to +5.0 mA Voltage Applied to Any Output in the Disabled or Power-Off State in the HIGH State Current Applied to Output in LOW State (Max) -500mA -300 mA 10V 2000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military Commercial -0.5Vto +5.5V -0.5VtoVee - 55°C to + 125°C - 40°C to + 85°C Supply Voltage Military Commercial Twice the Rated IOL (mA) + 4.5V to + 5.5V + 4.5V to + 5.5V (AVI.M) 50 mV/ns 20 mV/ns Minimum Input Edge Rate Data Input Enable Input DC Electrical Characteristics Symbol VIH Vee Parameter Min Typ Max Units Conditions V Recognized HIGH Signal 0.8 V Recognized LOW Signal -1.2 V 2.0 Input HIGH Voltage Vil Input LOW Voltage VeD Input Clamp Diode Voltage Min VOH Output HIGH Voltage Min 2.5 Min 2.0 V 2.0 V Mil VOL IIH V = -18 mA = -3mA IOH = -24mA IOH = -32mA liN IOH Comm Min Mil Min 0.8 V Comm Min 0.8 V Max 5 p.A = 12 mA = 15 mA VIN = 2.7V (Note 1) Max 5 p.A VIN Max 5 p.A VIN Output LOW Voltage Input HIGH Current All Others TMS, TOI IOL IOl Vee VIN = = = VIN = 5.5V = 0.5V (Note 1) IBVI Input HIGH Current Breakdown Test Max 7 p.A IBVIT Input HIGH Current Breakdown Test (1/0) Max 100 p.A IlL Input LOW Current Max -5 p.A VIN Max -5 p.A VIN Max -385 p.A VIN All Others TMS, TOI VID Input Leakage Test 0.0 V 4.75 liD All Other Pins Grounded IIH + IOZH Output Leakage Current Max 50 p.A VOUT Output Leakage Current Max -50 p.A VOUT IOZH Output Leakage Current Max 50 p.A VOUT IOZL Output Leakage Current Max -50 p.A VOUT http://www.national.com 9-14 7.0V = O.OV = O.OV = 1.9 /J-A IlL + IOZl Note 1: Guaranteed not tested. Vee = = = = 2.7V 0.5V 2.7V 0.5V DC Electrical Characteristics (Continued) Vee Min los Output Short-Circuit Current Max -100 ICEX Output HIGH Leakage Current Izz Bus Drainage Test ICCH Power Supply Current Parameter Symbol Typ Max Units -275 rnA Your = O.OV Max 50 p,A Your = Vcc 0.0 100 p,A Your = 5.5V All Others GND Your = Vcc; TDI, TMS = Vcc Conditions Max 250 p,A Max 1.0 rnA Your = Vcc; TDI, TMS = GND ICCl Power Supply Current Max 65 rnA Your = LOW; TDI, TMS = Vcc Max 65.8 rnA Your = LOW; TDI, TMS = GND Iccz Power Supply Current Max 250 p,A TDI, TMS = Vcc Max 1.0 rnA TDI, TMS = GND Iccr Additionallcc/lnput All Other Inputs Max 2.9 rnA VIN = Vcc - 2.1V TDI, TMS inputs Max 3 rnA VIN = Vcc - 2.1V mAl Outputs Open One Bit Toggling, 50% Duty Cycle ICCD No Load Dynamic Icc Max AC Electrical Characteristics Symbol Parameter Vee· (V) Propagation Delay A to B, B toA tpLZ tpHZ Disable Time tpZl tPZH Enable Time MHz NormalOperation: See Section 4 Military Commercial TA = -55°C to + 125°C CL = 50pF TA = -40°C to + 85°C CL = 50 pF Typ Max Units Fig. No. Min Typ Max 5.0 1.0 1.5 3.1 4.4 5.2 6.5 ns 4-1,2 5.0 1.5 1.5 4.8 5.2 8.6 8.9 ns 4-3,4 5.0 1.5 1.5 5.5 4.6 9.1 8.2 ns 4-3,4 Min tplH tpHl 0.2 ·Voltage Range 5.0V ± O.5V 9-15 http://www.national.com BOUNDARY·SCAN Register Scan Chain Definition (42 Bits In Length) TOI 41 40 39 38 37 TOO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 0 TL/F/11544-23 9·23 http://www.national.com • Description of BOUNDARY-SCAN Circuitry (Continued) Input BOUNDARY-SCAN Register Scan Chain Definition (22 Bits In Length) When Sample In Is Active TDI 41 40 P26 TYPE1 38 37 TDO P55 TYPE1 35 18 34 19 33 20 32 21 31 22 30 23 29 24 28 25 27 26 TL/F/11544-24 http://www.national.com 9·24 ~--------------------------------------------------------------------------------. ~ co N Description of BOUNDARY-SCAN Circuitry (Continued) W ....... w l> Output BOUNDARY-SCAN Register Scan Chain Definition (20 Bits In Length) When Sample Out and Extest Out are Active TDI TYPE2 39 TYPE2 TDO 36 17 0 16 15 14 13 12 11 10 TLIF 111544-25 9-25 http://www.nationai.com • Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY·SCAN Register Definition Index Bit No. Pin Name PinNa. Pin Type Input Input Internal Input Input Internal TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals Scan Cell Type 41 40 39 38 37 36 AOE1 ALE AOE BOE1 BLE BOE 3 54 35 34 33 32 31 30 29 28 27 Alo AI1 AI2 Ais AI4 AIS AI6 AI7 Ais 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in 26 25 24 23 22 21 20 19 18 Blo BI1 BI2 Bis BI4 BIS BI6 BI7 Bis 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOO A01 A02 AOs A04 AOs A06 A07 AOs 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 BOo B01 B02 BOs B04 BOS B06 B07 BOa 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 B-out http://www.national.com 26 31 9-26 Absolute Maximum Ratings (Note 1) Over Voltage Latchup (I/O) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/DIstributors for availability and specifications. Storage Temperature - 65°C to + 150°C Ambient Temperature under Bias - 55°C to + 125°C Note 2: Either voltage limit of current limit is sufficient to protect Inputs. Recommended Operating Conditions - 55°C to + 175°C - 55°C to + 150°C Vee Pin Potential to Ground Pin -0.5V to + 7.0V Input Voltage (Note 2) -0.5Vto +7.0V Input Current (Note 2) -30 mA to + 5.0 mA Voltage Applied to Any Output in the Disabled or Power-Off State in the HIGH State Current Applied to Output in LOW State (Max) 2000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Junction Temperature under Bias Ceramic Plastic 10V ESD (HBM) Min Free Air Ambient Temperature Military Commercial - 55°C to + 125°C - 40°C to + 85°C Supply Voltage Military Commercial - 0.5V to + 5.5V -0.5V to Vee + 4.5V to + 5.5V + 4.5V to + 5.5V (~V/~t) Minimum Input Edge Rate Data Input Enable Input 50 mV/ns 20 mV/ns Twice the Rated 10L (mA) DC Latchup Source Current Commercial Military -500 mA -300 mA DC Electrical Characteristics Symbol Vee Parameter Min Typ Max Units Conditions V Recognized HIGH Signal 0.8 V Recognized LOW Signal -1.2 V liN 2.0 VIH Input HIGH Voltage VIL Input LOW Voltage Veo Input Clamp Diode Voltage Min VOH Output HIGH Voltage Min 2.5 V 10H = -3 mA Mil Min 2.0 V 10H = -24 mA Comm Min 2.0 V 10H = -32 mA Mil Min 0.8 V 10L = 12 mA VOL Output LOW Voltage IIH Input HIGH Current Comm All Others TMS, TDI Min 0.8 V 5 IJ-A VIN = 2.7V (Note 1) Max 5 IJ-A VIN = Vee Max 5 IJ-A VIN = Vee Input HIGH Current Breakdown Test Max 7 IJ-A ISVIT Input HIGH Current Breakdown Test (I/O) Max 100 IJ-A IlL Input LOW Current TMS, TDI 10L = 15 mA VIN = 7.0V VIN = 5.5V Max -5 IJ-A VIN = 0.5V (Note 1) Max -5 IJ-A VIN = O.OV Max -385 IJ-A VIN = O.OV VIO Input Leakage Test IIH + 10ZH Output Leakage Current Max 50 Lozl Output Leakage Current Max -50 III + -18 mA Max ISVI All Others = 0.0 V 4.75 /-LA 110 = 1.9 /-LA All Other Pins Grounded VOUT = 2.7V VOUT = 0.5V 10ZH Output Leakage Current Max 50 /-LA VOUT = 2.7V 10ZL Output Leakage Current Max -50 IJ-A VOUT = 0.5V los Output Short-Circuit Current Max -275 mA VOUT = O.OV -100 Note 1: Guaranteed not tested. 9-27 http://www.national.com DC Electrical Characteristics (Continued) Parameter Vee Max Units ICEX Output HIGH Leakage Current Max 50 p.A Izz Bus Orainage Test 0.0 100 p.A leCH Power Supply Current Max 250 p.A VOUT = Vee; TOI, TMS = Vce Max 1.0 mA VOUT = Vee; TOI, TMS = GNO Max 65 mA VOUT = LOW; TOI, TMS = Vee Max 65.8 mA VOUT = LOW; TOI, TMS = GNO Max 250 p.A TOI, TMS Max 1.0 mA TOI, TMS All Other Inputs Max 2.9 mA VIN = Vee -2.1V TOI, TMS Inputs Max 3 mA VIN = Vee -2.1V mAl Outputs Open One Bit Toggling, 50% Outy Cycle Symbol leCl Power Supply Current lecz Power Supply Current leCT leCD Additionallee/lnput No Load Oynamiclee Min Typ 0.2 Max MHz Conditions = Vee VOUT = 5.5V VOUT All Others Grounded = Vee = GNO Note 1: Guaranteed not tested. AC Electrical Characteristics NormalOperation: See Section 4 Military Symbol Parameter Vce· (V) TA Commercial = -55°C to + 125°C CL = 50pF Typ Min Max TA = -40°C to +85°C CL = 50 pF Min Typ Max 3.7 4.5 Units Fig. No. 6.5 7.4 ns 4-1,2 tpLH tpHl Propagation Oelay OtoO 5.0 1.2 2.0 tpLH tpHl Propagation Oelay LEtoO 5.0 1.3 1.8 4.1 4.5 7.4 7.3 ns 4-1,2 tpLZ tpHZ Oisable Time 5.0 1.6 1.8 4.9 6.0 9.0 10.7 ns 4-3,4 tpZl tPZH Enable Time 5.0 1.6 1.0 6.0 5.0 9.5 9.3 ns 4-3,4 ·Voltage Range 5.0V ± O.SV AC Operating Requirements NormalOperation: See Section 4 Military Symbol Parameter Vec· (V) TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to + 85°C CL = 50pF Units Fig. No. Guaranteed Minimum ts Setup Time, H or L Oata to LE 5.0 1.7 ns 4-5 tH Hold Time, H or L LEto Oata 5.0 1.6 ns 4-5 tw LE Pulse Width 5.0 2.3 ns 4-2 ·Voltage Range 5.0V ±O.SV http://www.national.com 9-28 AC Electrical Characteristics Scan Test Operation: Symbol Parameter Vcc· (V) See Section 4 Military Commercial TA = -55°C to + 125°C CL = 50pF TA = -40°C to + 85°C CL = 50pF Min Typ Fig. No. Min Typ Max 5.0 3.6 4.8 5.8 7.4 8.6 10.6 ns 4-8 Disable Time TCKtoTDO 5.0 2.7 4.0 5.6 7.1 9.0 10.9 ns 4-9,10 tPZL tPZH Enable Time TCKto TDO 5.0 5.2 3.6 8.6 6.6 12.5 10.1 ns 4-9,10 tpLH tpHL Propagation Delay TCK to Data Out during Update-DR State 5.0 3.9 5.1 6.4 8.0 9.5 11.6 ns tpLH tpHL Propagation Delay TCK to Data Out during Update-IR State 5.0 4.7 5.7 7.7 9.1 11.3 13.1 ns tpLH tpHL Propagation Delay TCK to Data Out during Test Logic Reset State 5.5 6.7 9.2 10.7 13.6 15.6 ns 5.0 tpLZ tpHZ Disable Time TCK to Data Out during Update-DR State 5.0 4.1 4.7 7.7 8.4 12.1 12.7 ns tpLZ tpHZ Disable Time TCK to Data Out during Update-IR State 5.0 4.2 4.7 8.3 9.0 13.5 14.0 ns tpLZ tpHZ Disable Time TCK to Data Out during Test Logic Reset State 5.5 6.3 10.1 10.8 15.6 16.2 ns 5.0 tpZL tpZH Enable Time TCK to Data Out during Update-DR State 5.0 5.8 4.3 9.6 7.7 14.2 11.7 ns tPZL tpZH Enable Time TCK to Data Out during Update-IR State 5.0 6.1 4.7 11.0 9.0 16.0 13.7 ns tPZL tpZH Enable Time TCK to Data Out during Test Logic Reset State 7.3 5.8 12.5 10.5 18.3 15.8 ns tpLH tpHL Propagation Delay TCKtoTDO tpLZ tpHZ 5.0 Max Units 4-8 4-8 4-8 4-9,10 4-9,10 4-9,10 4-9,10 4-9,10 4-9,10 ·Voltage Range 5.0V ±O.5V 9-29 http://www.nationai.com AC Operating Requirements Scan Test Operation: See Section 4 Military Symbol Vee· (V) Parameter TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to + 85°C CL = 50pF Fig. Units No. Guaranteed Minimum ts Setup Time, Data to TCK (Note 2) 5.0 2.7 ns 4-11 tH Hold Time, Data to TCK (Note 2) 5.0 2.4 ns 4-11 ts Setup Time, H or L AOE1, BOE1 to TCK (Note 1) 5.0 5.1 ns 4-11 tH Hold Time, H or L TCK to AOE1, BOE1 (Note 1) 5.0 1.8 ns 4-11 ts Setup Time, H or L Internal AOE, BOE, to TCK (Note 3) 5.0 3.5 ns 4-11 Hold Time, H or L TCK to Internal AOE, BOE (Note 3) 5.0 1.8 ns 4-11 ts Setup Time ALE, BLE (Note 4) to TCK 5.0 5.1 ns 4-11 tH Hold Time TCK to ALE, BLE (Note 4) 5.0 1.8 ns 4-11 ts Setup Time, H or L TMSto TCK 5.0 7.9 ns 4-11 tH Hold Time, H or L TCKto TMS 5.0 1.8 ns 4-11 ts Setup Time, H or L TDltoTCK 5.0 6.0 ns 4-11 tH Hold Time, H or L TCKto TDI 5.0 3.0 ns 4-11 tw Pulse Width TCK 5.0 10.3 10.3 ns 4-12 f max MaximumTCK Clock Frequency 5.0 50 MHz tpu Wait Time, Power Up to TCK 5.0 100 ns tON Power Down Delay 0.0 100 ms tH H L ·Voltage Range 5.0V ±0.5V. All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: Timing pertains to BSR 38 and 41 only. Note 2: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8,9-17,18-26 and 27-35. Note 3: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Note 4: Timing pertains to BSR 37 and 40 only. Capacitance Parameter Symbol Typ Units Conditions, T A = CIN Input Capacitance 5.8 pF Vee = O.OV COUT (Note 1) Output Capacitance 13.8 pF Vee = 5.0V Note 1: COUT is measured at frequency f ht1p:llwww.national.com = 1 MHz. per MIL-STD-883B, Method 3012 9-30 25°C IfINational Semiconductor SCAN182374A D Flip-Flop with 250 Series Resistor Outputs General Description Features The SCAN182374A is a high performance BiCMOS D·type flip·flop featuring separate D·type inputs organized into dual 9·bit bytes with byte·oriented clock and output enable con· trol signals. This device is compliant with IEEE 1149.1 Stan· dard Test Access Port and Boundary Scan Architecture with the incorporation of the defined boundary·scan test logic and test access port consisting of Test Data Input (TDI), Test Data Out (TDO), Test Mode Select (TMS), and Test Clock (TCK). • IEEE 1149.1 (JTAG) Compliant • High performance BiCMOS technology • 25!l series resistor outputs eliminate need for external terminating resistors • Buffered positive edge·triggered clock • TRI·STATE~ outputs for bus·oriented applications • 25 mil pitch SSOP (Shrink Small Outline Package) • Includes CLAMP, IDCODE and HIGHZ instructions • Additional instructions SAMPLE·IN, SAMPLE·OUT and EXTEST·OUT • Power up TRI·STATE for hot insert • Member of National's SCAN Products Ordering Code: See Section 11 Connection Diagram n.4S- 1 '-../ 56 I-TOI AOo- 2 551- Al o A0E,- 3 54 f-ACP Ao,- 4 53 I-AII A02 - 5 52 r-A1 2 GNO- 6 51 f-GNO A03 A04 Vee - 7 50 I-AI3 8 49 -A1 4 48 -Vee A05 A06 - 9 10 11 47 -A15 46 -Als GNO- 12 45 -GNO A~- 13 44 -A1 7 AOa- 14 43 -Al s 42 -Blo BOa- lS Bo,- 16 GND- 17 18 19 39 -B1 2 38 -B13 Vee B04 - 20 37 -Vee 21 36 -B14 35 f-B15 B0E,- 26 BOs - 27 TOO- 28 30 -Bls 29 i-TCK H B~- 25 Order Number Description Data Inputs Clock Pulse Inputs TRI·STATE Output Enable Inputs TRI·STATE Outputs Description SCAN 182374ASSC SSOP in Tubes SCAN 182374ASSCX SSOP in Tape and Reel SCAN 182374AFMQB Flatpak Military H -GND 33 -Bls 32 -B17 31 -BCP B06 - AO(0-8), BO(0-8) 41 -BII 40 -GND B02 B03 - B05 - 22 GND- 23 Pin Names AI(0-8), BI(0-8) ACP, BCP AOE1, BC5E 1 TL/F/11545-1 9·31 http://www.national.com Truth Tables Functional Description Inputs AO(0-8) ACP tAOE1 AI(0-8) X ....r ....r H L L X L H BCP tBOE 1 BICO-8) X H L L X L H Inputs ....r ....r H L X The SCAN182374A consists of two sets of nine edge-triggered flip-flops with individual Ootype inputs and TRI-STATE true outputs. The buffered clock and buffered Output Enable pins are common to all flip-flops. Each set of the nine flip-flops will store the state of their individual 0 inputs that meet the setup and hold time requirements on the LOW-toHIGH Clock (ACP or BCP) transition. With the Output Enable (AOE1 or BOE1) LOW, the contents of the nine flipflops are available at the outputs. When the Output Enable is HIGH, the outputs go to the high impedance state. Operation of the Output Enable input does not affect the state of the flip-flops. Z L H BO(0-8) Z L H = HIGH Voltage Level = LOW Voltage Level = Immaterial Z = High Impedance .../ = L-to-H Transition t = Inactive-te-active transition must occur to enable outputs upon power-up. Logic Diagram TL/F/11545-2 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Block Diagrams Byte-A TYPE1 TYPE2 ACP AI [o-a] TL/F/II545-3 Note: BSR stands for Boundary Scan Register http://www.national.com 9-32 Block Diagrams (Continued) Tap Controller _---"'I rROt.4 8SR[O] TOI TOO INSTRUCTION TRI-STATE TMS TCK TL/F111545-4 Byte-B TL/F/11545-5 Note: BSR stands for BOUNDARY·SCAN Register 9·33 http://www.national.com Description of BOUNDARY-SCAN Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Agure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) The INSTRUCTION register is an a-bit register which captures the default value of 10000001 (SAMPLE/PRELOAD) during the CAPTURE-IR instruction command. The benefit of capturing SAMPLE/PRELOAD as the default instruction during CAPTURE-IR is that the user is no longer required to shift in the 8-bit instruction for SAMPLE/PRELOAD. The sequence of: CAPTURE-IR ~ EXIT1-IR ~ UPDATE-IR will update the SAMPLE/PRELOAD instruction. For more information refer to the section on instruction definitions. Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. Instruction Register Sscan Chain Definition TDI TOO The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. MSB LSB Bypass Register Scan Chain Definition Logic 0 TLlF/11545-28 MSB Instruction Code ~ LSB Instruction 00000000 EXTEST 10000001 SAMPLE/PRELOAD 10000010 CLAMP 00000011 HIGH-Z TL/F111545-27 SCAN 182374A Product IDCODE (32-Blt Code per IEEE 1149.1) Version Entity 0000 Per Number Manufacturer Required 10 by 1149.1 111111 0000000111 00000001111 MSB http://www.national.com 1 LSB 9-34 01000001 SAMPLE-IN 01000010 SAMPLE-OUT 00100010 EXTEST-OUT 10101010 IDCODE 11111111 BYPASS All Other BYPASS , - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - , -4 co N W Description of BOUNDARY-SCAN Circuitry (Continued) ....... .a:. l> Scan Cell TYPE1 SCAN OUT (to next cell) DATA IN--------,---------------------------------+------------DATAOUT SHIFLDR ----+--4 SCAN IN (from previous cell) TL/F/11545-19 Scan Cell TYPE2 SCAN OUT (to next cell) MODE - - - - - - - 4 DATAIN------~--------------------------------~------------------~ DATA OUT SHIFT _DR ---+---1 SCAN IN CLOCK-DR (from previous cell) TL/F/11545-20 9-35 http://www.national.com Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY-SCAN Register SCAN182374A Scan Chain Definition (42 Bits In Length) TOI 41 40 39 38 37 TOO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 TlIF/11545-26 http://www.national.com 9-36 Description of BOUNDARY-SCAN Circuitry (Continued) Input BOUNDARY·SCAN Register Scan Chain Definition (22 Bits In Length) When Sample In Is Active TDI 41 40 38 37 TDO 35 18 34 19 33 20 32 21 31 22 30 23 29 24 28 25 27 26 TL/F/11545-29 9-37 http://www.national.com Description of BOUNDARY-SCAN Circuitry (Continued) Output BOUNDARY-SCAN Register Scan Chain Definition (20 Bits In Length) When Sample Out and EXTEST Out are Active TOI 39 TOO 36 17 16 15 14 13 12 11 10 TL/F/11S4S-30 http://www.national.com 9-38 Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY·SCAN Register Definition Index Pin No. Pin Type 41 40 39 38 37 36 AOE1 ACP AOE BOE1 BCP BOE 3 54 Input Input Internal Input Input Internal TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals 35 34 33 32 31 30 29 28 27 Alo AI1 AI2 AI3 AI4 Ais AI6 AI7 Ala 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in 26 25 24 23 22 21 20 19 18 Blo BI1 BI2 BI3 BI4 Bis BI6 BI7 Bla 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOo A01 A02 A03 A04 AOs A06 A07 AOa 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 BOo B01 B02 B03 B04 BOs B06 B07 BOa 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 B-out Bit No. Pin Name 26 31 9·39 Scan Cell Type http://www.national.com Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. DC Latchup Source Current Commercial Military Storage Temperature - 65°C to + 150°C Over Voltage Latchup (I/O) Ambient Temperature under Bias - 55°C to + 125°C Junction Temperature under Bias Ceramic Plastic - 55°C to + 175°C - 55°C to + 150°C ESD (HBM) Min. 2000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Vee Pin Potential to Ground Pin -0.5Vto +7.0V Input Voltage (Note 2) -0.5Vto +7.0V Input Current (Note 2) -30 rnA to +5.0 rnA Voltage Applied to Any Output in the Disabled or Power-Off State in the HIGH State Current Applied to Output in LOW State (Max) -500mA -300 rnA 10V Recommended Operating Conditions Free Air Ambient Temperature Military Commercial -0.5V to + 5.5V -0.5VtoVee - 55°C to + 125°C -40°C to + 85°C Supply Voltage Military Commercial Twice the Rated IOl (rnA) + 4.5V to + 5.5V + 4.5V to + 5.5V Minimum Input Edge Rate Data Input Enable Input (dV/dt) 50 mV/ns 20 mV/ns DC Electrical Characteristics Symbol Vee Parameter Min VIH Input HIGH Voltage Vil Input LOW Voltage Veo Input Clamp Diode Voltage Min VOH Output HIGH Voltage Min 2.5 VOL IIH Typ Max Units Conditions V Recognized HIGH Signal 0.8 V Recognized LOW Signal -1.2 V liN V IOH = -3mA 2.0 = -18 mA Mil Min 2.0 V IOH Comm Min 2.0 V IOH = = Mil Min 0.8 V IOl = 12mA Comm Min 0.8 V IOl = 15mA -24mA -32.mA Output LOW Voltage Input HIGH Current All Others TMS, TDI 5 pA VIN 5 IlA VIN = Vee Max 5 Il A VIN = Vee IBVI Input HIGH Current Breakdown Test Max 7 IlA IBVIT Input HIGH Current Breakdown Test(I/O) Max 100 Il A IlL Input LOW Current All Others TMS, TDI = 2.7V (Note 1) Max Max VIN = 7.0V VIN = = 0.5V (Note 1) = O.OV = O.OV Max -5 IlA VIN Max -5 IlA VIN Max -385 IlA VIN 110 = 1.91lA All Other Pins Grounded VIO Input Leakage Test IIH + IOZH Output Leakage Current Max 50 IlA VOUT IlL + IOZl Output Leakage Current Max -50 IlA VOUT 0.0 4.75 V IOZH Output Leakage Current Max 50 Il A IOZl Output Leakage Current Max -50 pA Note 1: Guaranteed not tested. http://www.national.com 9-40 5.5V = 2.7V = 0.5V VOUT = 2.7V VOUT = 0.5V DC Electrical Characteristics (Continued) Vee Min los Output Short·Circuit Current Max -100 ICEX Output High Leakage Current Max Izz Bus Drainage Test ICCH Power Supply Current Symbol ICCl Parameter Power Supply Current Iccz Power Supply Current ICCT Additionallccllnput ICCD Dynamic Icc Typ Max Units -275 mA VOUT = O.OV 50 ,..,A VOUT = Vcc 0.0 100 ,..,A VOUT = 5.5V All Others Grounded Max 250 ,..,A VOUT = Vcc; TDI, TMS = Vcc Max 1.0 rnA VOUT = Vcc; TDI, TMS = GND Max 65 rnA VOUT = LOW; TDI, TMS = Vcc Max 65.8 rnA VOUT = LOW; TDI, TMS Max 250 ,..,A TDI, TMS = Vcc = GND Max 1.0 rnA TDI, TMS Max 2.9 rnA VIN = Vcc - 2.1V TDI, TMS Inputs Max 3 rnA VIN = Vcc - 2.1V mAl Outputs Open One Bit Toggling, 50% Duty Cycle No Load 0.2 Max MHz See Section 4 Military Parameter Vee· (V) TA Propagation Delay CPtoQ tpLZ tpHZ Disable Time tPZl tPZH Enable Time Commercial = -55°C to + 125°C CL = 50pF Typ Max TA = -40°C to +85°C CL = 50 pF Units Fig. No. Min Typ Max 5.0 1.4 2.1 4.6 4.9 6.1 6.8 ns 4·1,2 5.0 1.9 1.8 4.6 4.8 8.0 8.7 ns 4·3,4 5.0 2.0 1.4 6.7 6.0 9.4 8.2 ns 4·3,4 Min tpLH tpHl = GND All Other Inputs AC Electrical Characteristics Normal Operation: Symbol Conditions ·Voltage Range S.OV ±O.SV AC Operating ReqUirements NormalOperation: See Section 4 Military Symbol Parameter Vee· (V) TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to + 85°C CL = 50 pF Units Fig. No. Guaranteed Minimum ts Setup Time, H or L Data to CP 5.0 2.8 ns 4·5 tH Hold Time, H or L CPto Data 5.0 2.4 ns 4·5 tw CP Pulse Width 5.0 0.0 ns 4·2 f max Maximum ACP/BCP Clock Frequency 5.0 50 MHz ·Voltage Range S.O is 5.0V ±O.SV. 9·41 http://www.national.com AC Electrical Characteristics Scan Test Operation: See Section 4 Military Symbol Parameter Vcc· (V) TA = Commercial -55°C to + 125°C CL = 50 pF = -40°C to +85°C CL = 50pF Units Fig. No. Min Typ Max 5.0 2.9 4.0 5.8 7.3 9.5 11.5 ns 4-8 Disable Time TCKto TDO 5.0 1.9 3.0 5.6 7.1 10.0 12.1 ns 4-9,10 tPZL tpZH Enable Time TCKtoTDO 5.0 4.4 2.7 8.4 6.4 13.2 10.9 ns 4-9,10 tpLH tpHL Propagation Delay TCK to Data Out during Update-DR State 5.0 3.4 4.3 6.5 8.1 10.5 12.7 ns tpLH tpHL Propagation Delay TCK to Data Out during Update-IR State 5.0 3.9 4.7 7.8 9.1 12.8 14.5 ns tpLH tpHL Propagation Delay TCK to Data Out during Test Logic Reset State 4.7 5.6 9.5 10.9 15.6 17.4 ns 5.0 tpLZ tpHZ Disable Time TCK to Data Out during Update-DR State 5.0 3.2 3.9 7.8 8.5 13.6 14.2 ns tpLZ tpHZ Disable Time TCK to Data Out during Update-IR State 5.0 3.2 3.8 8.6 9.3 15.0 15.6 ns tpLZ tpHZ Disable Time TCK to Data Out during Test Logic Reset State 4.2 5.0 10.2 11.0 18.0 18.5 ns 5.0 tpZL tpZH Enable Time TCK to Data Out during Update-DR State 5.0 5.0 3.7 9.6 7.7 15.3 13.0 ns tpZL tpZH Enable Time TCK to Data Out during Update-IR State 5.0 5.3 4.0 10.8 9.0 17.4 15.1 ns tPZL tPZH Enable Time TCK to Data Out during Test Logic Reset State 6.2 4.7 12.6 10.7 20.4 18.1 ns Min tpLH tpHL Propagation Delay TCKtoTDO tpLZ tpHZ Typ TA Max 5.0 ·Voltage Range 5.0V ±O.5V http://www.national.com 9-42 4-8 4-8 4-8 4-9,10 4-9,10 4-9,10 4-9,10 4-9,10 4-9,10 AC Operating Requirements Scan Test Operation: See Section 4 Military Vcc· (V) Parameter Symbol TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to +85°C CL = 50pF Units Fig. No. Guaranteed Minimum ts Setup Time Data to TCK (Note 2) 5.0 2.7 ns 4-11 tH Hold Time Data to TCK (Note 2) 5.0 3.1 ns 4-11 ts Setup Time, H or L AOE1, BOEl to TCK (Note 1) 5.0 5.0 ns 4-11 tH Hold Time, H or L TCK to AOE1, BOEl (Note 1) 5.0 1.8 ns 4-11 ts Setup Time, H or L Internal AOE, BOE to TCK (Note 3) 5.0 3.6 ns 4-11 tH Hold Time, H or L TCK to Internal AOE, BOE (Note 3) 5.0 2.1 ns 4-11 ts Setup Time ACP, BCP (Note 4) to TCK 5.0 3.4 ns 4-11 tH Hold Time TCK to ACP, BCP (Note 4) 5.0 1.8 ns 4-11 ts Setup Time, H or L TMStoTCK 5.0 8.7 ns 4-11 tH Hold Time, H or L TCKtoTMS 5.0 1.8 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 6.4 ns 4-11 tH Hold Time, H or L TCKtoTDI 5.0 3.2 ns 4-11 tw Pulse Width TCK 5.0 8.2 11.2 ns 4-12 H L f max MaximumTCK Clock Frequency 5.0 50 MHz tpu Wait Time, Power Up to TCK 5.0 100 ns tON Power Down Delay 0.0 100 ms ·Voltage Range 5.0V ±0.5V All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: Timing pertains to BSR 38 and 41 only. Note 2: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17, 18-26 and 27-35. Note 3: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Note 4: Timing pertains to BSR 37 and 40 only. Capacitance T A = 25°C Symbol CIN COUT (Note 1) Note 1: COUT is measured at frequency f Typ Units Input Capacitance 5.8 pF Vee Output Capacitance 13.8 pF Vee Parameter Conditions = O.OV = 5.0V = 1 MHz, per MIL-STD-883B, Method 3012. 9-43 http://www.national.com < ..... ~ t!lNational Semiconductor SCAN182541A Non-Inverting Line Driver with 250, Series Resistor Outputs General Description Features The SCAN182541A is a high performance BiCMOS line driver featuring separate data inputs organized into dual 9-bit bytes with byte-oriented paired output enable control signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary-Scan architecture with the incorporation of the defined Boundary-Scan test logic and test access port consisting of Test Data Input (TDI), Test Data Out (TOO), Test Mode Select (TMS), and Test Clock (TCK). • IEEE 1149.1 (JTAG) Compliant • High performance BiCMOS technology • 250 series resistor outputs eliminate need for external terminating resistors • Dual output enable signals per byte • TRI-STATE® outputs for bus-oriented applications • 25 mil pitch SSOP (Shrink Small Outline Package) • Includes CLAMP, IDCODE and HIGHZ instructions • Additional instructions SAMPLE-IN, SAMPLE-OUT and EXTEST-OUT • Power up TRI-STATE for hot insert • Member of National's SCAN Products Ordering Code: See Section 11 Connection Diagram Tt.lS- 1 AOo- 2 AO~- 3 Ao,- 4 A02 - 5 GND- 6 \.J 56 rTDI 551-Alo 541-AOE2 531-Al1 521-AI 2 511-GND A03 - 7 AO,- 8 50 rAI3 Vcc - 9 AOs- 10 48 I-Vcc AOs- 11 46 I-Als Order Number 47 rAls 451-GND Ao,- 13 44 rAI7 Description Input Pins, A Side Input Pins, B Side TRI-STATE Output Enable Input Pins, A Side TRI-STATE Output Enable Input Pins, B Side Output Pins, A Side Output Pins, B Side Description SCAN 182541 ASSC SCAN 182541 ASSCX SCAN 182541 AFMQB 49 I-AI, GND- 12 Pin Names AI(O-S) ~S)_ AOE1,AOE2 BOE1, BOE2 AO(O-S) BO(O-S) SSOP in Tubes SSOP in Tape and Reel Flatpak Military Truth Tables Inputs AOs- 14 431- Als BOo - 15 Bo,- 16 421-810 tAOE1 tAOE2 AI(O-S) 41 rBll GND- 17 40l-GND B02 B03 - 18 391-B12 381- BI3 L H X L L X H L H X X L Vcc BO, - 20 37 rVcc 21 361-BI, BOs - 22 351-BI s tBOE1 tBOE2 BI(O-S) L H X L L X H L H X X L 19 GND- 23 341-GND BOs - 24 Bo,- 25 331- BIs BO~- 26 BOs - 27 TDO- 28 AO(O-S) Inputs 321-BI7 311-BOE2 30l-BIs H L 291-TCK TlIF/11543-1 H Z Z L BO(O-S) = HIGH Voltage Level = LOW Voltage Level X = Immaterial Z t = High Impedance = Inactive·to-active transition must occur to enable outputs upon power-up. http://www.national.com H Z Z L 9-44 Block Diagrams Byte A TYPE1 AI [o-a] TLlF/11543-2 Tap Controller TO BSR [41] FROM BSR [0] TOI TOO INSTRUCTION TRI-STATE TMS TCK TL/F/11543-3 ByteB TYPE2 TYPE1 BI [o-a] BO [o-a] TL/F/11543-4 Note: BSR stands for Boundary Scan Register. 9·45 http://www.national.com Description of BOUNDARY-SCAN Circuitry The scan cells used in the BOUNDARY-SCAN register are one of the following two types depending upon their location. Scan cell TYPE1 is intended to solely observe system data, while TYPE2 has the additional ability to control system data. (See IEEE Standard 1149.1 Figure 10-11 for a further description of scan cell TYPE1 and Figure 10-12 for a further description of scan cell TYPE2.) The INSTRUCTION register is an 8-bit register which captures the default value of 10000001 (SAMPLE/PRELOAD) during the CAPTURE-IR instruction command. The benefit of capturing SAMPLE/PRELOAD as the default instruction during CAPTURE-IR is that the user is no longer required to shift in the 8-bit instruction for SAMPLE/PRELOAD. The sequence of: CAPTURE-IR ~ EXIT1-IR ~ UPDATE-IR will update the SAMPLE/PRELOAD instruction. For more information refer to the section on instruction definitions. Scan cell TYPE1 is located on each system input pin while scan cell TYPE2 is located at each system output pin as well as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE controls the activity of the B-outputs. Each will activate their respective outputs by loading a logic high. Instruction Register Scan Chain Definition TDI TOO The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low. ~SB LSB TL/F/11543-26 Bypass Register Scan Chain Definition Logic 0 MSB~LSB Instruction Code 00000000 10000001 10000010 00000011 01000001 01000010 00100010 10101010 11111111 All Others TL/F/11543-17 SCAN182541A Product IDCODE (32-Blt Code per IEEE 1149.1) LSB Instruction EXTEST SAMPLE/PRELOAD CLAMP HIGH-Z SAMPLE-IN SAMPLE-OUT EXTEST-OUT IDCODE BYPASS BYPASS Scan Cell TVPE1 SCAN OUT (to next cell) DATA IN ---,.-------------+----- DATA OUT SHIFLDR - - - - I -..... SCAN IN CLOCK-DR (from previous cell) TLIF111543-30 Scan Cell TVPE2 SCAN OUT (to next cell) M O D E - - - -..... DATA I N - - . . . . , - - - - - - - - - - - - - - + - - - - - - - - - - t DATA OUT SHIFLDR - - - + - - t SCAN IN CLOCK-DR UPDATE.DR (from previous cell) http://www.national.com TL/F/11543-31 9-46 Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY·SCAN Register Scan Chain Definition (42 Bits In Length) TDI 41 40 39 38 37 TDO 36 35 18 17 34 19 16 33 20 15 32 21 14 31 22 13 30 23 12 29 24 11 28 25 10 27 26 TL/F/11543-27 9·47 http://www.national.com • c:r: .... ~ Description of BOUNDARY-SCAN Circuitry (Continued) N ....co Input BOUNDARY-SCAN Register Scan Chain Definition (22 Bits In Length) When SAMPLE-IN Is Active TDI 41 40 P26 TYPE1 38 37 TOO P55 TYPE1 35 18 34 19 33 20 32 21 31 22 30 23 29 24 28 25 27 26 TLlF/11543-28 http://www.national.com 9·48 ..... co N C1I Description of BOUNDARY-SCAN Circuitry (Continued) ~ ..... l> Output BOUNDARY-SCAN Register Scan Chain Definition (20 Bits In Length) When SAMPLE-OUT and EXTEXT Out are Active TDI TYPE2 39 TYPE2 TDO 36 17 16 15 14 13 12 11 10 TL/F/11543-29 9-49 http://www.national.com • Description of BOUNDARY-SCAN Circuitry (Continued) BOUNDARY-SCAN Register Definition Index Bit No. Pin Name PinNa. Pin Type 3 54 Input Input Internal Input Input Internal TYPE1 TYPE1 TYPE2 TYPE1 TYPE1 TYPE2 Control Signals 55 53 52 50 49 47 46 44 43 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 A-in Blo BI1 BI2 BI3 BI4 Bis Bis BI7 Bla 42 41 39 38 36 35 33 32 30 Input Input Input Input Input Input Input Input Input TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 TYPE1 B-in 17 16 15 14 13 12 11 10 9 AOo A01 A02 A03 A04 AOs AOs A07 AOa 2 4 5 7 8 10 11 13 14 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 A-out 8 7 6 5 4 3 2 1 0 BOo B01 B02 B03 B04 BOs BOs B07 BOa 15 16 18 19 21 22 24 25 27 Output Output Output Output Output Output Output Output Output TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 TYPE2 B-out 41 40 39 38 37 36 AOE1 AOE2 AOE BOE1 BOE2 BOE 35 34 33 32 31 30 29 28 27 Ala AI1 AI2 AI3 AI4 Ais Ais AI7 Ala 26 25 24 23 22 21 20 19 18 http://www.national.com 26 31 9-50 Scan Cell Type Absolute Maximum Ratings (Note 1) Over Voltage Latchup (1/0) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature - 65°C to + 150°C Ambient Temperature under Bias - 55°C to + 125°C Junction Temperature under Bias Ceramic Plastic - 55°C to + 175°C - 55°C to + 150°C Vee Pin Potential to Ground Pin -0.5V to + 7.0V Input Voltage (Note 2) -0.5V to + 7.0V Input Current (Note 2) -30 rnA to +5.0 rnA Voltage Applied to Any Output in the Disabled or Power-Off State in the HIGH State Current Applied to Output in LOW State (Max) 2000V Note 1: Absolute Maximum Ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial - 0.5V to + 5.5V -0.5VtoVee - 55°C to + 125°C - 40°C to + 85°C + 4.5V to + 5.5V + 4.5V to + 5.5V Minimum Input Edge Rate Data Input Enable Input Twice the Rated 10L (mA) DC Latchup Source Current Commercial Military 10V EDS (HBM) Min (6. V /6.t) 50 mV/ns 20 mV/ns -500 mA -300 mA DC Electrical Characteristics Symbol Vee Parameter VIH Input HIGH Voltage VIL Input LOW Voltage Veo Input Clamp Diode Voltage Min VOH Output HIGH Voltage Min VOL Output LOW Voltage IIH Input HIGH Current Min Typ Max Units Conditions V Recognized HIGH Signal 0.8 V Recognized LOW Signal -1.2 V liN = -18 mA V 10H = -3mA 10H = -24mA 2.0 2.5 Mil Min 2.0 V Comm Min 2.0 V 10H = -32mA Mil Min 0.8 V 10L = 12mA Comm All Others TMS, TDI Min 0.8 V Max 5 p.A VIN = 2.7V (Note 1) Max 5 p.A VIN = Vee Max 5 p.A 10L = 1SmA VIN = Vee IBVI Input HIGH Current Breakdown Test Max 7 p.A IBVIT Input HIGH Current Breakdown Test (110) Max 100 p.A IlL Input LOW Current Max -5 p.A VIN = O.5V (Note 1) Max -5 p.A VIN = O.OV Max -385 p.A VIN = O.OV All Others TMS, TDI VIO Input Leakage Test 0.0 4.75 V VIN = 7.0V VIN = 5.5V 110 = 1.9 J-LA All Other Pins Grounded IIH + 10ZH Output Leakage Current Max 50 p.A VOUT = 2.7V IlL + LOZL Output Leakage Current Max -50 p.A VOUT = 0.5V 10ZH Output Leakage Current Max 50 p.A VOUT = 2.7V 10ZL Output Leakage Current Max -50 p.A VOUT = 0.5V los Output Short-Circuit Current Max -275 mA VOUT = O.OV -100 Note 1: Guaranteed not tested. 9-51 http://www.national.com DC Electrical Characteristics (Continued) Symbol Parameter Vee Max ICEX Output HIGH Leakage Current Izz Bus Drainage Test ICCH Power Supply Current Icel Power Supply Current Icez Power Supply Current ICCT Additionallee/lnput IceD Dynamic lee Min Typ Max Units Conditions 50 p,A VOUT VOUT = 5.5V All Others Grounded = Vec 0.0 100 p,A Max 250 p,A VOUT Max 1.0 mA VOUT Max 65 mA VOUT Max 65.8 mA VOUT Max 250 p,A TDI, TMS = = Vee; TDI, TMS = = LOW; TDI, TMS Vec; TDI, TMS LOW; TDI, TMS = = = = = = Vee GND Vee GND Vee Max 1.0 mA TDI, TMS All Other Inputs Max 2.9 mA VIN = Vee - 2.1V TDI, TMS Inputs Max 3 mA VIN = Vee - 2.1V 0.2 mAl MHz Outputs Open One Bit Toggling, 50% Duty Cycle No Load Max GND Note 1: Guaranteed not tested. AC Electrical Characteristics NormalOperation: Symbol Parameter Vee" (V) Military Commercial TA = -55°C to + 125°C CL = 50pF TA = -40°C to + 85°C CL = 50 pF Min tplH tpHl Propagation Delay Data toO tplZ tpHZ Disable Time tpZl tPZH Enable Time Typ Max Units Fig. No. Min Typ Max 5.0 1.0 1.9 3.4 4.1 5.2 6.5 ns 4-1 5.0 2.0 1.9 5.2 5.6 8.7 9.2 ns 4-3,4 5.0 2.4 1.6 6.1 5.1 9.6 8.5 ns 4-3,4 'Voltage Range 5.0V ±O.5V http://www.national.com See Section 4 9-52 AC Electrical Characteristics Scan Test Operation: See Section 4 Commercial Military Symbol Parameter Vee· (V) TA = -55°C to + 125°C CL = 50 pF TA = -40°C to +85°C CL = 50 pF Units Fig. No. Min Typ Max 5.0 3.2 4.5 6.0 7.6 9.4 11.3 ns 4-8 Disable Time TCKto TDO 5.0 2.5 3.7 5.8 7.4 9.9 11.8 ns 4-9,10 tpZL tPZH Enable Time TCKtoTDO 5.0 4.9 3.1 8.6 6.7 12.9 10.7 ns 4-9,10 tpLH tpHL Propagation Delay TCK to Data Out during Update-DR State 5.0 3.7 4.9 6.7 8.3 10.3 12.4 ns 4-8 tpLH tpHL Propagation Delay TCK to Data Out during Update-IR State 5.0 4.2 5.3 7.9 9.2 12.2 13.8 ns 4-8 tpLH tpHL Propagation Delay TCK to Data Out during Test Logic Reset State 5.0 5.0 6.2 9.4 10.9 14.6 16.4 ns tpLZ tpHZ Disable Time TCK to Data Out during Update-DR State 5.0 3.7 4.3 7.9 8.7 13.0 13.7 ns tpLZ tpHZ Disable Time TCK to Data Out during Update-IR State 5.0 3.7 4.3 8.5 9.4 14.2 14.8 ns tpLZ tpHZ Disable Time TCK to Data Out during Test Logic Reset State 5.0 4.7 5.5 10.1 10.9 16.6 17.3 ns tPZL tPZH Enable Time TCK to Data Out during Update-DR State 5.0 5.5 4.0 9.8 7.9 14.7 12.5 ns tPZL tPZH Enable Time TCK to Data Out during Update-IR State 5.0 5.8 4.3 10.9 9.0 16.5 14.4 ns tPZL tPZH Enable Time TCK to Data Out during Test Logic Reset State 5.0 6.6 4.9 12.5 10.5 19.1 16.9 ns Min tpLH tpHL Propagation Delay TCKtoTDO tpLZ tpHZ Typ Max 4-8 4-9,10 4-9,10 4-9,10 4-9,10 4-9,10 4-9,10 ·Voltage Range 5.0V ± O.5V • 9-53 http://www.national.com « ,.... ~ II) AC Operating Requirements Scan Test Operation: See Section 4 N co ,.... Military Symbol Vcc· (V) Parameter TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to + 85°C CL = 50pF Units Fig. No. Guaranteed Minimum ts Setup Time Data to TCK (Note 2) 5.0 2.2 ns 4-11 tH Hold Time Data to TCK (Note 2) 5.0 1.8 ns 4-11 Setup Time, H or L BOEn to TCK (Note 1) 5.0 3.7 ns 4-11 tH Hold Time, H or L TCK to ACEn , BOEn (Note 1) 5.0 1.8 ns 4-11 ts Setup Time, H or L Internal AOE n , BOEn , to TCK (Note 3) 5.0 2.7 ns 4-11 Hold Time, H or L TCK to Internal AOE n , BOE n (Note 3) 5.0 1.8 ns 4-11 ts Setup Time, H or L TMStoTCK 5.0 7.5 ns 4-11 tH Hold Time, H or L TCKto TMS 5.0 1.8 ns 4-11 ts Setup Time, H or L TDI toTCK 5.0 5.0 ns 4-11 tH Hold Time, H or L TCKto TDI 5.0 2.0 ns 4-11 tw Pulse Width TCK 5.0 10.0 10.8 ns 4-12 fmax MaximumTCK Clock Frequency 5.0 50 MHz tpu Wait Time, Power Up to TCK 5.0 100 ns tON Power Down Delay 0.0 100 ms ts ADEn, tH H L 'Voltage Range 5.0V ±0.5V All Input Timing Delays involving TCK are measured from the rising edge of TCK. Note 1: Timing pertains to BSR 38 and 41 or BSR 37 and 40. Note 2: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17, 18-26 and 27-35. Note 3: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only. Capacitance Symbol Parameter = 25°C Typ Units CIN Input Capacitance 5.8 pF Vee = O.OV COUT (Note 1) Output Capacitance 13.8 pF Vee = 5.0V Note 1: COUT is measured at frequency f = 1 MHz, per MIL-STD-883B, Method 3012. http://www.national.com 9-54 Conditions, T A Section 10 System Test Support Datasheets http://www.national.com Section 10 Contents SCANPSC100F Embedded Boundary Scan Controller (IEEE 1149.1 Support) .............. SCANPSC110F SCAN Bridge Hierarchical and Multidrop Addressable JTAG Port (IEEE 1149.1 System Test Support). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCAN EASE SCAN Embedded Application Software Enabler ............................ 10-2 10-3 10-26 10-54 "0 tJ) o....... I!fINational Semiconductor o o "T1 SCANPSC100F Embedded Boundary Scan Controller (IEEE 1149.1 Support) General Description Features The SCANPSC100F is designed to interface a generic parallel processor bus to a serial scan test bus. It is useful in improving scan throughput when applying serial vectors to system test circuitry and reduces the software overhead that is associated with applying serial patterns with a parallel processor. The 'PSC100F operates by serializing data from the parallel bus for shifting through the chain of 1149.1 compliant components (Le., scan chain). Scan data returning from the scan chain is placed on the parallel port to be read by the host processor. Up to two scan chains can be directly controlled with the 'PSC100F via two independent TMS pins. Scan control is supplied with user specific patterns which makes the 'PSC100F protocol-independent. Overflow and underflow conditions are prevented by stopping the test clock. A 32-bit counter is used to program the number of TCK cycles required to complete a scan operation within the boundary scan chain or to complete a 'PSC100F Built-In Self Test (BISn operation. SCANPSC100F device drivers and 1149.1 embedded test application code are available with National's SCAN Ease software tools. • Compatible with IEEE Std. 1149.1 (JTAG) Test Access Port and Boundary Scan Architecture • Supported by National's SCAN Ease (Embedded Application Software Enabler) Software a Uses generic, asynchronous processor interface; compatible with a wide range of processors and PCLK frequencies • Directly supports up to two 1149.1 scan chains a 16-bit Serial Signature Compaction (SSG) at the Test Data In (TDI) port • Automatically produces pseudo-random patterns at the Test Data Out (TOO) port • Fabricated on FACTTM 1.5 J.lm CMOS process • Supports 1149.1 test clock (TCK) frequencies up to 25 MHz • TTL-compatible inputs; full-swing CMOS outputs with 24 mA source/sink capability Ordering Code: See Section 11 Connection Diagrams Pin Assignment forLCC 28-Pln SOIC, DIP and Flatpak RST- 1 SCK- 2 \.J 28 rVee '1 271-FRZ [j) !I~l[il 0E-3 26 rTDI cr--4 251-TCK GNO [j] ~ ST8- 6 23 rTMSO 04 @) ~ AO- 7 221-GNO 05 !ill ~ 06 !iII ~ A2- 9 20 I-ROY 00- 10 19 rlNT 01- 11 181-07 02- 12 17 r06 03- 13 161-05 GNO- 1-4 15 rO-4 STB R/W ..................... 2-4I-TMSI 21 rTDO Ao mmliW] 021I11~ 03 Ii] ~ R/W- 5 Al- 8 Do A2 A, ~mcr • • ~ [J] RST ~ ~ Vee • Ill! FRZ • 1m TOI ~ 1m ~ " !Il DE mSCK III II1II II1II II1II II1II II1II II1II. !iID~IilIUlI~H~~ ROY GNO TM TM TCK INT TOO SO SI TL/F/l0968-18 TLlF/l0968-1 10-3 Order Number Description SCANPSC100FSC SCANPSC100FSCX SCANPSC100FFMQB SCANPSC100FDMQB SCANPSC100FLMQB 5962·9475001 QYA 5962·9475001QXA 5962-9475001Q3A SOIC in Tubes SOIC in Tape and Reel Military Fiatpak Military Ceramic DIP Military Leadless Chip Carrier Military SMD#, Flatpak Military SMD#, CDIP Military SMD#, LCC http://www.national.com U. Q Q .... o U) A. Chip Architecture The 'PSC100 is designed to act together with a parallel bus host as a serial test bus master. Parallel data is written by the host to the 'PSC100, which serializes the data for application to a serial test bus. Serial data returning from the target scan chain(s) is placed on the processor port for parallel reads. Several features are included in the 'PSC100 which make scan test communication more convenient and efficient. Test Data In (TDI) receives serial data from the scan chain. A local control block is associated with each Shifter/Buffer to provide shift and load control as well as providing full or empty status. The SSI also provides Test Clock (TCK) Control. TCK is stopped and started depending on the status of the Shifter/Buffers or the 32-bit Counter. By stopping and starting TCK, scan operations will proceed only when the enabled Shifter/Buffers are ready to send and/or receive serial data. Figure 1 shows the major functional blocks of the 'PSC100 design. The Parallel Processor Interface (PPI) is an asynchronous, a-bit parallel interface which is used by the host processor to write and read data. The PPI generates the necessary internal data, address, and control signals to complete internal write and read operations. The 32-bit Counter (CNT32) is a count-down binary counter included to assist in controlling the SSI. The initial state of CNT32 is loaded from the parallel port with four consecutive writes to its address. When enabled, CNT32 is used to program the number of TCKs applied by the SSI to the boundary scan chain(s). The value of CNT32 can also be used to generate interrupts (Le., when CNT32 reaches terminal count) and to trigger 'PSC1 00 features, such as, Auto TMS High (discussed later within this datasheet). The Serial Scan Interface (SSI) consists of a bank of double-buffered parallel/serial shift registers (Le., a 2 x a bit FIFO), or Shifter/Buffers. The double buffering improves efficiency by allowing parallel writes or reads to/from one of the two a-bit FIFOs within the shifter/buffer while the other FIFO is shifting data to/from the scan chain. Three Shifter/ Buffers are provided for outgoing serial data and one for incoming serial data. Test Data Out (TOO) is for scanning out test data while the two Test Mode Select signals (TMSO/1) are used to provide user specific control data. The Mode and Status Registers are used to control and observe the operation of the SSI and CNT32. Each of the Shifter/Buffers and CNT32 have an associated mode bit which enables it for participation in on-going operations. Status bits can be used for polling operations. Serial Scan Interface 0(7:0) TOO Sh ifter/Buffer Read/Write Latches A(2:0) CE STB R/W SCK RST ROY INT Synchronizer and READ/WRITE Control TOI Shifter/Buffer TOI Tt.4S0 Shifter/Buffer Tt.4S0 Tt.4S1 Sh ifter /Buffer t.4ode/Status Registers TCK 32-bit Counter I I ·------------l------f------FRZ DE TLIF 110968-2 FIGURE 1. 'PSC100 Block Diagram http://www.national.com 10-4 "'D en o Pin Descriptions ~ Pin Name o o -n Description RST(lnput) The Reset pin is an asynchronous input that, when low, initializes the 'PSC1 00. Mode bits, Shifter/Buffer and CNT32 control logic, TCK Control, and the PPI are all initialized to defined states. RST has hysteresis for improved noise immunity. SCK (Input) The System Clock drives all internal timing. The test clock, TCK, is a gated and buffered version of SCK. SCK has hysteresis for improved immunity. OE (Input) Output Enable TRI-STATEs all SSI outputs when high. A 20 kn pull-up resistor is connected to automatically TRI-STATE@ these outputs when this signal is floating. CE (Input) Chip Enable, when low, enables the PPI for byte transfers. D(7:0) and RDY are TRI-STATEd if CE is high. CE has hysteresis for improved noise immunity. R/W(lnput) Read/Write defines a PPI cycle-Read when high, Write when low. R/W has hysteresis for improved noise immunity. STB (Input) Strobe is used for timing all PPI byte transfers. D(7:0) are TRI-STATEd when STB is high. All other PPI inputs must meet specified setup and hold times with respect to this signal. STB has hysteresis for improved noise immunity. A(2:0) (Input) The Address pins are used to select the register to be written to or read from. D(7:0) (I/O) Bidirectional pins used to transfer parallel data to and from the 'PSC1 00. INT (Output) Interrupt is used to trigger a host interrupt for any of the defined interrupt events. INT is active high. RDY (TRI-STATE Output) Ready is used to synchronize asynchronous byte transfers between the host and the 'PSC100. When low, RDY signals that the addressed register is ready to be accessed RDY is enabled when CE is low. TDO (TRI-STATE Output) Test Data Out is the serial scan output from the 'PSC100. TDO is enabled when OE is low. TMS(1:0) (TRI-STATE Output) The Test Mode Select pins are serial outputs used to supply control logic to the UUT. TMS(1:0) are enabled when OE is low. TCK (TRI-STATE Output) The Test Clock output is a buffered version of SCK for distribution in the UUT. TCK Control logic starts and stops TCK to prevent overflow and underflow conditions. TCK is enabled when OE is low. TDI (Input) Test Data In is the serial scan input to the 'PSC100. A 20 kn pull-up resistor is connected to force TDI to a logic 1 when the TDO line from the UUT is floating. FRZ (Input) The Freeze pin is used to asynchronously generate a user-specific pulse on TCK. If the FRZ Enable Mode bit is set, TCK will be forced high if FRZ goes high. FRZ has hysteresis for improved noise immunity. 10-5 http://www.national.com LL 0 0 ..... Mode and Status Registers U) MODE REGISTER 0 (MOD EO) 0 a. Blt6 Blt7 TOO Enable TOI Enable Bit 5 BIt4 CNT32 Enable Blt3 TMSO Enable TMS1 Enable This register is purely a mode register. All bits are writeable and readable. The value 00100000 is placed in this register upon RST low or a synchronous reset operation. • Bit 7: • Bit 6: • Bit 5: Blt2 Reserved BitO Auto TMS High Enable LoopAround Enable This bit enables the TMSO shifter/buffer for shift operations. If this bit is set, the TMSO shifter/buffer will cause TCK to stop if it is empty. This bit enables the TMS1 shifter/buffer for shift operations. If this bit is set, the TMS1 shifter/buffer will cause TCK to stop if it is empty. • Bit 4: This bit enables the TOO shifter/buffer for shift operations. If this bit is set, the TOO shifter/buffer will cause TCK to stop if it is empty. This bit enables the TOI shifter/buffer for shift operations. If this bit is set, the TOI shifter/buffer will cause TCK to stop if it is full. This bit enables the 32-bit counter. If this bit is set, the counter will cause TCK to stop if if has not been loaded or if it has reached terminal count. Bit 1 • Bit 3: • Bit 2: This bit is reserved and should remain as a logic 0 during all 'PSC100 operations. • Bit 1: If this bit is set, TMS will be forced high when the 32-bit counter is at state (00000001 )h. • BitO: This bit causes TOI to be connected directly back through TOO for Loop-Around operations. MODE REGISTER 1 (MODE1) Blt7 Blt6 BitS Blt4 Blt3 Blt2 Bit 1 BltO TOO Interrupt Enable TOI Interrrupt Enable CNT32 Interrupt Enable PRPG Enable sse Enable Freeze Pin Enable Test LoopBack Test LoopBack This register is purely a mode register. All bits are writeable and readable. The value 00000000 is placed in this register upon RS'f low or a synchronous reset operation. • Bit 7: If this bit is set and the TOO shifter/buffer is not full (I.e., one or both 8-bit TOO • Bit 6: If this bit is set and the TOI shifter/buffer is not empty (I.e., one or both 8-bit TOI FIFOs are full), the INT pin will go high. • Bit 5: If this bit is set, and the 32-bit counter is not loaded or has reached terminal count, the INT pin will go high. • Bit 4: This bit signifies that the TOO shifter/buffer is reconfigured as a 32-Bit Pseudo Random Pattern Generator. If set, and MOOEO Bit 7 is set, the TOO shifter/buffer will stop TCK until a seed value has been written to all four of the 8-bit LFSR segments. • Bit 3: This bit signifies that the T01 shifter/buffer is reconfigured as a 16-Bit Serial Signature Compactor. If set, and MOOEO Bit 6 is set, the TOI shifter/buffer will cause TCK to stop until a seed value has been written to the two TOI registers. • Bit 2: If this bit is set, a high value on FRZ will force TCK high (see TCK Control Section). • Bits 1 and 0: These bits are used to control Test LoopBack operations according to the following table. FIFOs are empty), the INT pin will go high. http://www.national.com 10·6 MODE1 Bit 1 MODE1 BltO 0 0 Normal Operation 0 1 Loop-Back TOO to TOI 1 0 Loop-Back TMSO to TOI 1 1 Loop Back TMS1 to TOI Function "tJ Mode and Status Registers (Continued) en o MODE REGISTER 2 (MODE2) o o ...&. ." Write: Blt7 Not Used Blt6 Not Used BitS Not Used Bit 3 Bit 4 Not Used Blt2 Continuous Update Update Status Blt3 Blt2 Bit 1 BltO Reset Single Step CNT32 Read: Bit7 TOO Status Blt6 TOI Status Bit 5 CNT32 Status Blt4 TMS1 Status TMSO Status This register contains both mode and status bits. Bits 4-7 are status bits only. Bit 3 is a status bit during read operations and a mode bit during write operations. Bits 0-2 are mode bits only. Upon RST low, or a synchronous reset, the value placed in MOOE2 is 10111000 (Read mode). Latches used to update status bits 3-7 retain their last state upon RST and are in an "unknown" state after power-up. To initialize the latches to a known state, they need to be updated using the Update Status bit (bit 2) or continuous update bit (bit 3). • Bit7: Set high if the TOO shifter/buffer is not full, i.e., one or both B-bit TOO FIFOs are ready to be written to. • Bit 6: Set high if the TOI shifter/buffer is not empty, i.e., one or both B-bit TOI FIFOs are ready to be read from. Set high if the 32-bit counter has not been loaded, or has reached terminal count. • Bit 5: • Bit 4: Set high if the TMSO shifter/buffer is not full, i.e., one or both B-bit TMSO FIFOs are ready to be written to. • Bit3 (Read Cycle): Set high if the TMS1 shifter/buffer is not full, i.e., one or both B-bit TMS1 FIFOs are ready to be written to. • Bit3 (Write Cycle): If set, will cause all status bits to be continuously updated. • Bit2 (Read Cycle): Shows the state of the Continuous Update bit during read operations (Bit 3 during writes). • Bit2 (Write Cycle): If set, will cause a pulse to be issued internally that will update all status bits. This bit will be reset upon completion of the pulse. The state of this bit is not readable. It is reset upon RST low. If set, will cause a synchronous reset of all functions except the parallel interface. The value of this bit will return to zero when the reset operation is complete. • Bit 1: • BitO: Continuous Update Bit 1 BltO Reset Single Step CNT32 shift operations are in progress. The alignment of all registers during shift operations is controlled by a 3-bit counter in the TCK control block. Enabling or disabling a function in the middle of a shift operation may disrupt the logic necessary to keep all shifter/buffers byte-aligned. For example, if the TOO shifter/buffer (already loaded) is enabled while the 3-bit counter value is 3, the shifter/buffer will only shift out only five bits of the first byte loaded. The following bits should not be changed when shift operations are in progress, i.e., when TCK is enabled (see section on TCK Control). • MOOEO(7:3) • MOOE1 (4:3) • MOOE2(0) Parallel Processor Interface (PPI) ADDRESS ASSIGNMENT The following table defines which register is selected for access with the address lines, A(2:0). If set, will cause the 32-bit counter to count for one SCK cycle (no TCK cycle will be generated). The value of this bit will return to zero when the single step operation is complete. PROGRAMMING RESTRICTIONS A2 A1 AD R/W Function 0 0 0 0 TOO Shifter/Buffer 0 0 0 1 Counter Register 1 0 0 1 0 TOI Shifter/Buffer 0 0 1 1 TOI Shifter/Buffer O 1 0 0 TMSO Shifter/Buffer 0 1 0 1 Counter Register 2 0 1 1 0 TMS1 Shifter/Buffer 0 1 1 1 Counter Register 3 1 0 0 0 32-Bit Counter 1 0 0 1 Counter Register 0 1 0 1 0 MODEO 1 0 1 1 MODEO 1 1 0 0 MODE1 1 1 0 1 MODE1 1 1 1 0 MODE2 1 1 1 1 MODE2 Because certain mode bits enable shift operations for certain functions, these mode bits should not be changed when 10-7 http://www.national.com Ll- e e [) Parallel Processor Interface (PPI) (Continued) (J) D.. TIMING WAVEFORMS !------ \'=0 ~IS=O I ,r- R(W -1 lsl -\'11 - STe \ Is2 I \'2=:1 X VALID A(2:0) C X 0(7:0) l>dl I - len 1 -----j I l>d2 IS3 - ~\'3=:1 X VALID - ldiSI -l>d·i VALID ~ =! I L- (SEE NOTE 1) TL/F/l0968-3 FIGURE 2. Write Cycle ---\ -=0 t,=o- I , -\'1=1 1=1'1- I STe \ Is2 I \'2-1 X VALID A(2:0) len3 ten2 ~d3 - I I 0(7:0) (SEE NOTE 2) -Ienl-j l>dl 'Pd2 VALID -~d·1 I -Idi~ -ldis3 - ldiS1 =! VALID TLlF/l0968-4 FIGURE 3. Read Cycle Note 1: Valid data is provided on the ROY line a tpdl after R/W is asserted low or a tpd2 after valid data is decoded on A2:0. The ROY line will remain high until the addressed register is ready to participate in the write operation. This condition only applies when writing to a shifter/buffer and is eliminated (i.e., ROY will go low immediately once valid) when using shifter/buffer status polling (discussed later in this datasheet). Note 2: Valid data will not appear on 07:0 (and ROY will remain high) until the addressed register is ready to participate in the read operation. When the addressed register becomes ready (Le., a byte is available to be read), valid data will be placed on the 07:0 bus and the ROY pin will go low allowing the bus cycle to continue. This read cycle delay only applies when reading the TOI shifter/buffer and is eliminated when using shifter/buffer status poling. http://www.national.com 10-8 "a Parallel Processor Interface (PPI) en o (Continued) ~ o o "TI TIMING WAVEFORMS (Continued) SCK V \~ \ ______~yr------~\~______~y , \~------~V R!W STB ROY TLlF/10968-5 FIGURE 4. Consecutive Read/Writes (best case timing) I SCK V I V \ I :/ \ I I \ I V \ V I R!W t, • NOT ~ET STB \ ROY ~ ~ / / '----I / TLlF/10968-6 FIGURE 5. Consecutive Read/Writes (worst case timing) Figures 4/5: Figure 4 shows the best case bus cycle timing for SCK and STa during consecutive read or write cycles. The riSing edge of strobe occurs a setup time, ts4 or before the falling edge of SCK. This allows the cycle to be completed within 1.5 clock SCK clock cycles. Figure 5 shows the worst case bus cycle timing for SCK and STa during consecutive read or write cycles. The riSing edge of strobe does not meet the ts4 requirement between STa and SCK. Therefore, the propagation of the Internal PSC100 control and reset Signals is delayed until the next falling edge of SCK. The bus cycle Is then completed 1.5 SCK cycles later creating a total bus cycle time of 2.5 SCK cycles. If worst case timing is considered for bus cycle timing. ts4 is not a mandatory timing specification. 10·9 http://www.national.com u.. o o ,... en D. o Parallel Processor Interface (PPI) (Continued) TIMING WAVEFORMS (Continued) ,\----1 SCK R!W __ -JI~ ________ ,\----IV ,'----t ,'---~V ~~-J STB 'Pdl TL/F/l0968-20 FIGURE 6. Read/Write or Write/Read (best case timing) SCK V I , :/ , I V , I I V , :1 R!W '-----l STB RoY ~ '-----l / ,'-----l / TL/F/l0968-7 FIGURE 7. Read/Write or Write/Read (worst case timing) Note: Figures 6/7: This diagram shows the timing for a read followed by a write (or write followed by a read). Separate Read and Write data/address latches and control logic allow consecutive read/write or write/read operations to be overlapped (i.e., do not need to wait 2 or 3 SCK cycles between bus cycles). For the best case timing scenario (Figure 8: rising edge of STB to falling edge of SCK greater than t s4), a new bus cycle can be performed each SCK cycle. For the worst timing scenario (Figure 7: rising edge of STB to falling edge of SCK is less than ts4), a one SCK cycle delay must be included after each back to back read/write or write/ read sequence. Note: Figures 4-7assume that the PSC100 register participating in the bus cycle is ready to accept/provide data. For bus cycles involving a PSC100 shifter/buffer(s), the ready status of a shifter/buffer can be checked using the status bits in Mode Register 2 prior to the start of the bus cycle. Polling is required when the ROY pin is not used to provide a processor "handshake". http://www.national.com 10-10 "0 Parallel Processor Interface (PPI) en o..... (Continued) All read and write cycles will complete within 2.5 SCK cycles (worst case). Therefore, by assuring at least 2.5 cycles occur after the rising edge of STB, bus cycles can be completed without using the ROY "handshake". The critical timing relationship within the PSC100F for write and read operation is between the rising edge of STB and the falling edge of SCK. The rising edge of strobe latches the address/data and also generates the internal signals required to complete read/write within the PSC100F (including a signal with resets the read/write logic and releases the ROY line). The propagation of these internal signals is initiated on the first falling edge of SCK after the STB pin is asserted high. If the rising edge on STB occurs an internal setup time (t s4) or greater before the falling edge of SCK, the bus cycle can be completed within 1.5 SCK cycles (see Figure 4). However, if the internal setup time is not met, the propagation of internal control/reset signals is delayed until the next falling edge of SCK (1 SCK cycle later) which effectively completes the read/write operation and reset the logic for the next bus cycle within 2.5 cycles (see Figure 5). Synchronizing the rising edge of STB with the falling edge of SCK to assure that ts4 is met provides the maximum performance for a read/write operation. However, the asynchronous interface can be used effectively with software delays, hardware delays or programmed wait states (to assure 2.5 SCK cycles are completed) to avoid the need for synchronization. READ AND WRITE CYCLES A Write cycle (see Figure 2) is initiated by asserting CE and R/W low followed by a low on STB a set time later. CE and STB are gated within the PSC100F and may be asserted concurrently (Le., zero setup and hold time). The address is then asserted on A2:0 to indicate which internal address within the PSC100F will be written to by the processor. An address decoder within the PSC100F monitors the address lines for a valid PSC100F register address. Once a valid address has been decoded, the ROY line becomes active (a propagation delay time later). The active ROY line will go low immediately if the addressed register is ready to accept data. If the addressed register is not ready, the ROY pin will remain high preventing the processor from completing the bus cycle. Once the register is ready to receive date (see Table II), the ROY pin will go low and processor can resume the write cycle. The processor then forces a high on STB (a wait time after ROY goes low) which latches the address (A2:0) and data (07:0) completing the bus cycle. The ROY line is forced high a propagation delay later. A Read cycle (see Figure 3) is initiated by asserting CE low and R/W high followed by a low on STB a set time later. CE and STB are gated within the PSC100F and may be asserted concurrently (Le., zero setup and hold time). The address bits (A2:0) are then asserted to indicate which internal address within the PSC1 OOF will be read by the processor. An address decoder within the PSC100F monitors the address lines for a valid PSC100F register address. Once a valid address has been decoded and if the addressed PSC100F register is ready to be read (see Table II), valid data is placed on the Oata lines (07:0) a propagation delay later and the ready line is asserted low. If the addressed register is not ready (e.g., the TOI shifter/buffer is empty), the ready line will remain high and hold the bus cycle until the register contains valid data. ROY will then go low allowing the read cycle to continue. With the high to low edge on ROY line, the processor can successfully read the valid data. However, the bus cycle is not completed within the PSC100F until the rising edge on STB which resets the PSC100F read logic (required prior to the start of the next read cycle). Consecutive Reads and Writes: Separate control logic and data/address latches are used for a read and write operation within the PSC100F. This allows a write to occur after a read (or conversely, a read to occur after a write) prior to the 1.5/2.5 SCK clock cycle requirements described above. The timing for a read (or write) followed by a write (or read) is shown in Figures 5 and 6. SYNCHRONIZATION Writes and reads can be synchronized by using any of three methods: polling, interrupts, or wait state generation: • Status bits may be polled to see if a register is ready to be written to or read from. To stabilize the status bits for read operations, the Update Status bit must be set in MOOE2 to latch the status. Important note concerning the use of ROY: The ROY signal provides a useful "handshake" between the PSC100F and the processor. However, care must be taken when using the PSC100F ROY signal to prevent a large (or indefinite) number of processor generated wait states. For example, if the TOO shifter/buffer is not enabled for shift operations and the processor writes to the TOO shifter/buffer address 3 times, the two registers which make up the TOO shifter/buffer will accept the first two bytes of data, but since the data is not shifting out, the 3rd byte will be held off by the ROY Signal indefinitely. An equally severe problem could result with a finite number of wait states if the application uses dynamic memories. Holding the local bus with the PSC100F ROY line long enough to violate a ORAM refresh time will result in lost data within the dynamic memory. Note: The status bits only provide the state of the shifter/buffers and do not indicate that an internal write or read is complete. Therefore, for applications not using the i"iDY signal to monitor the internal write/read status, timing must be controlled to assure that at least 2.5 SCK cycles are completed between consecutive read or consecutive write cycles. • Any of three different events can be used to generate interrupts by forcing the INT pin high, see Table I. • The ROY pin can be used to hold off the host until the addressed register is ready to be accessed. As described above, this pin can also be used to hold off additional reads/writes until the synchronizer has recovered from the previous read/write. ROY = 0 signifies that the 'PSC100F is ready to complete the current PPI cycle. The logic that determines the state of ROY is summarized in Table II. Writing and Reading without the use of ROY: With use of worst case PSC1 OOF timing, Write and Read cycles can be successfully completed without the use of the ROY signal. Reading from CNT32 can be synchronized for testing by using the Single Step Counter mode bit. 10-11 http://www.national.com o o "'T1 u.. o o ~ o tJ) Parallel Processor Interface (PPI) Q. (Continued) TABLE I. Interrupt Logic MODE1(7) = 1 and TOO Shifter/Buffer Not Full MODE1(6) = 1 and TDI Shifter/Buffer Not Empty 1 X X X 1 X 0 0 MODE1(5) = 1 and CNT32 Not Loaded, or at Terminal Count X X 1 0 INT 1 1 1 0 Note: Interrupts are generated using the INT pin. Three events trigger INT high. Each event has its own mode bit associated with it for masking or enabling these interrupts. R/W 0 0 0 0 Write Synchronizer Busy 1 X X X 0 0 1 1 1 X X X TOO Shifter/Buffer Full and A(2:0) = 0 X 1 X X 0 X X X G .G I TEST-LOGIC RESET f TABLE II. Ready State LogiC TMSO TMS1 Shifter/Buffer Shifter/Buffer Full and Full and A(2:0) = 2 A(2:0) = 3 X X X X 1 X X 1 0 0 X X X X X X Read Synchronizer Busy X X X X X 1 X 0 TOI Shifter/Buffer Empty and A(2:0) = 1 X X X X X X 1 0 I •. 0 RUN-TEST/ IDLE II • f I SEL-DR-SCAN : 1 :: SEL-IR-SCAN ~o r1f CAPTURE-DR r1f I CAPTURE-IR !O ~r-.I SHIFT-DR I 0 ~r-.I SHIFT-IR EXIT1-DR J-L 41 EXIT1-IR PAUSE-DR I 0 I PAUSE-IR EXIT2-DR I ~ EXIT2-IR ~ !1 ... r L UPDATE-IR 0 0 I ~ TLlF/10968-12 FIGURE 8. 1149.1 (JTAG) TAP Controller State Diagram http://www.national.com I !1 UPDATE-DR !1 J-L !1 !1 I 0 !O !1 ~ I !1 !O I I !O !1 41 t!-- ~o 10·12 ROY 1 1 1 1 0 1 1 0 "tJ en o..... Serial Scan Interface (SSI) Data is latched (or "sampled") into the boundary scan registers when the TAP controller (see Figure 8 on previous page) transitions from the Capture-DR state to the Shift-DR state (if SAMPLE/ PRELOAD is the active instruction). Synchronizing this "transition" (rising edge of TCK with TMS at logic low) with a known system state is imperative to an accurate pass/fail assessment. The Freeze Mode provides a means of asynchronously creating the TCK pulse via an external PSC100 pin. When the Freeze Pin Enable bit (bit 2 in Mode Register 1) is set, a logic high on the PSC100 FRZ input pin will cause TCK to go high. Once the transition is complete, the Freeze Mode can be removed (Le. Freeze Pin Enable bit returned to logic 0 or Freeze pin forced low) and the sampled data can be shifted out/evaluated using the "standard" PSC100 protocol. Figure 9 illustrates the logic implementation of the Freeze feature. It should be noted that Freeze mode is simply gated with the TCK output and does not disable shift operations within the shifter/buffers or disable CNT32. Therefore, no shifting or TCK counting using CNT32 should be performed when Freeze mode is enabled. The "standard" mode of TCK control uses CNT32 in conjunction with the status registers to start and stop TCK. For this mode, CNT32 is enabled and loaded with the number of TCK cycles required to shift the desired bits to/from the scan chain. The shifter/buffer(s) participating in the shift operation is enabled and provides the necessary full/empty status to stop TCK for processor writes/reads. This mode of TCK control provides a systematic protocol for managing PSC100 operations (specifically, handling partial bytes). Another option for TCK control relies solely on the status of the shifter/buffers (Le., CNT32 is disabled) to start and stop TCK. This option eliminates the time required to load CNT32, but makes management of partial bytes (see shifter/buffer description section) more cumbersome. TCKCONTROL TCK CONTROL is the central control block that enables or disables shift operations and provides byte alignment for the shifter/buffers. The state of all shifter/buffers and the 32-bit counter (CNT32) is evaluated here and TCK is stopped and started. A clock enable circuit allows the "TCK enable" signal to change only when SCK is low; therefore, TCK always stops low. TCK does not toggle (remains low) under the following conditions: • TOO Shifter/Buffer is enabled and empty. • TOO Shifter/Buffer is enabled in PRPG mode and is not fully loaded. • TDI Shifter/Buffer is enabled and full. • TDI Shifter/Buffer is enabled in SSC mode but is not fully loaded with an initial value. • TMSO Shifter/Buffer is enabled and empty. • TMS1 Shifter/Buffer is enabled and empty. • CNT32 is enabled but not loaded. • CNT32 is enabled and has reached terminal count. Also included within the TCK control block in CNT3, a 3-bit count up counter. CNT3 is included to maintain byte alignment within the shifter/buffers by providing a signal to toggle between the two a-bit FIFOs which comprise the shifter/ buffer. The toggling operation occurs, in an enabled shifter/ buffer, each time CNT3 counts a TCK cycles or when CNT32 reaches terminal count. The CNT3 is reset to 0 when CNT32 reaches terminal count or after a PSC100 reset condition. FREEZE MODE. This mode is included in the TCK control block to support the 1149.1 SAMPLE operation. The intent of the SAMPLE instruction is to allow device input and output levels to be observed during normal system operation. TCK Enable SCK _ _....1...._ _ _--1 TCK TL/F/l0966-9 FIGURE 9. TCK Logic 10-13 http://www.national.com o o ." u. o o ..... o U) Serial Scan Interface (SSI) (Continued) Q. 0(7:0) Auto TMS High Enable _ _.r-_ CNT32=1--~_ TMS TLIF/10968-10 FIGURE 10. TMS Shifter/Buffer Block Diagram other holds its previous state or can accept new parallel data. Shift register selection changes due to the following two events: • CNT3 in TCK Control signals that 8 bits have been shifted. This event is used for basic toggling between each of the two shift registers. TMS(1:0} SHIFTER/BUFFERS The TMS Shifter/Buffer block diagram is shown in Figure 10. These two blocks take parallel data and serialize it for shift operations through the serial port pins TMSO and TMS1. Double-buffering is achieved by configuring the shifter/buffer as a 2 x 8 FIFO. Write and shift operations are controlled by a local state machine that accepts stimulus from the PPI, Mode Registers, CNT32 and TCK Control section. The TMS outputs always change on the falling edge of SCK. The order of shifting is least significant bit first. TMS(1 :0) are forced high upon RST low. TMS(1:0) are TRI-STATEd when DE is high. • CNT32 enabled and at terminal count. This event is used to account for scan lengths which are not multiples of eight. When shift register selection changes due to this signal, any data remaining in the shift register is unused. AUTO TMS HIGH MODE. This feature is included in the TMS shifter/buffer block to improve the efficiency of the PSC100 in supporting shift operations within the 1149.1 devices connected to the SSI. Shifting data and instructions into 1149.1 compliant devices requires that their TAP controllers be sequenced to the Shift-DR or Shift-IR states (see Figure 8). Once in this state, shifting occurs by holding TMS low and clocking TCK. The last bit is shifted when the TAP controller transitions to the EXIT1 state. This transition requires a logic 1 on TMS. The Auto TMS High feature, enabled by setting bit 1 of Mode Register 0, automatically creates a logic 1 on the TMS lines of the PSC1 00 when CNT32 = 1. Consequently, the last bit is shifted out without having to load specific TMS data into the shifter/buffer. Write operations are completed if the shifter/buffer is not full (independent of whether shifter/buffer is enabled or disabled). Otherwise they are ignored. Shifting occurs when the following conditions are all true: • TMS is enabled with its respective mode bit. • TMS shifter/buffer is not empty. • TCK is enabled according to the logic in TCK Control. When shift operations are not enabled, the TMS output retains its last state. During long shift sequences, the TMS shifter/buffer can be disabled and held static so that shift operations are concentrated only on TDI and TOO. The TMS output also retains its last state when Test Loop-Back operations are in progress. Note: Auto TMS High mode creates a logic 1 on both TMS lines (i.e., TMSO and TMS1). Therefore, when using the Auto TMS High feature, all 1149.1 devices connected to the TMS line not partiCipating in the current JTAG test operations should be placed in the Test·Logic·Reset TAP controller state to prevent inadvertent TAP controller transitions. Local select circuitry is used to toggle back and forth between the two registers of the "FIFO" when shifting. At any given time, one register is selected for shift operations. The http://www.nationaLcom 10-14 ""0 Serial Scan Interface (551) en o ..... (Continued) TOO SHIFTER/BUFFER given time, one register is selected for shift operations. The other holds its previous state or can accept new parallel data. Shift register selection changes due to the following two events: The TOO Shifter/Buffer block diagram is shown in Figure 11. This block takes parallel data and serializes it for shift operations through the serial port pin TOO. During normal shift modes, double-buffering is achieved by configuring the shifter/buffer as a 2 x a FIFO. This block can also be configured as a 32-bit Pseudo Random Pattern Generator (PRPG) with two additional a-bit parallel-to-serial shift registers. Write and shift operations are controlled by a local state machine that accepts stimulus from the PPI, Mode Registers, CNT32, and the TCK Control section. The TOO output always changes on the falling edge of SCK. The order of shifting is least significant bit first. TOO is forced high upon RST low. TOO is TRI-STATEd when DE is high. • CNT3 in TCK Control signals that a bits have been shifted. This event is used for basic toggling between each of the two shift registers. • CNT32 enabled and at terminal count. This event is used to account for scan lengths which are not multiples of eight. When shift register selection changes due to this signal, any data remaining in the shift register is unused. PRPG MODE. By setting MOOE1 (4), the TOO Shifter/Buffer is reconfigured as a 32-bit PRPG (Pseudo Random Pattern Generator) using the primitive polynomial: F(X) = X32 + X22 + X2 + X + 1 Write operations are completed if the shifter/buffer is not full (independent of whether shifter/buffer is enabled or disabled). Otherwise they are ignored. The PSC100 was developed to support both 1149.1 and non-1149.1 serial test methodologies. Since 1149.1 compliant devices include boundary scan registers on control pins (Le. DE), which must remain fixed during boundary scan interconnect testing, generating pseudo-random patterns with PRPG mode provides limited usefulness for boundary scan test operations. PRPG mode may provide usefulness in other serial test or non-test related implementations which do not require fixed bits in the serial chain. Figure 12 shows a block diagram of the Linear Feedback Shift Register hookup. Shifting occurs when the fol!owing conditions are all true: • TOO is enabled with its respective mode bit. • TOO shifter/buffer is not empty. • TCK is enabled according to the logic in TCK Control. When shift operations are not enabled, the TOO output retains its last state. The TOO output also retains its last state when Test Loop-Back operations are in progress. Local select circuitry is used to toggle back and forth between the two registers of the "FIFO" when shifting. At any 0(7:0) -------~------pis 8-Bit Shift Register t - + l - - I 8-Bit pis Shift Register .....-i-+--I 8-Bit pis Shift Register 8-Bit pis Shift Register TOO TL/F/l0968-11 FIGURE 11. TOO ShIfter/Buffer Block DIagram RegIster Hookup 10-15 http://www.national.com o o ." LL o o 0r- Serial Scan Interface (SSI) (Continued) O t/) Q. X32 SCK TL/F/10968-14 FIGURE 12. TOO PRPG Block Diagram The PRPG is loaded by four PPI writes to the TOO address. When the PRPG enable bit is set, a pulse is issued internally that initializes the local parallel load logic such that the PRPG is loaded sequentially, least significant byte first, most significant byte last. When in PRPG mode, writes can be completed at any time; however, shift operations will be disabled until the PRPG is fully loaded. shifted to the boundary scan chain. For example, moving the TAP controllers within the boundary scan chain connected to TMSO from the Pause-OR state to the Run-Test! Idle state requires a 3-bit (110) sequence on TMSO. To provide correct 3-bit sequence on TMSO, the partial byte would be written to the TMSO shifter/buffer as: MSB LOOP AROUND MODE. This mode, enabled by setting bit 0 in Mode Register 0, will cause data appearing at the TOI input to be placed directly back on the TOO output. This feature can be used for read-only scan operations where data is shifted into TOI while returning the scan chain to its previous state when shifting is completed. It can also be used to bypass PSC100 devices connected within a boundary scan chain (Le., a PSC100 located within a chain, but not providing the JTAG TAP data). Loop around has limited usefulness in most boundary scan applications since, typically, data in the scan chain is shifted out and evaluated as new data is shifted into the chain for the next test. I x I x I x I x I x I 0 I 1 I 1 I -. TMSO A subsequent enable and load of CNT32 with decimal 3 and enable of the TMSO shifter/buffer will initialize the shift operation. Terminal count on CNT32 will complete the shift operation. Since terminal count on CNT32 will cause the register selection to change within the shifter/buffer, the values labeled as "x" will not be used and are treated as "don't cares". TOI SHIFTER/BUFFER The TOI Shifter/Buffer block diagram is shown in Figure 13. This block shifts in serial data from the TOI port and puts it in parallel form for read operations at the PPI. Ouring normal shift modes, double-buffering is achieved by configuring the shifter/buffer as a 2 x 8 FIFO. This block can also be configured as a 16-bit Serial Signature Compactor (SSC). Write, read, and shift operations are controlled by a local state WRITING A PARTIAL BYTE TO THE TMSO, TMS1 OR TOO SHIFTER/BUFFER. Since the TMSO, TMS1 and TOO shifter/buffers shift out least significant bit first, the valid (meaningful) bits within a partial byte (Le., byte containing <8 valid bits to be shifted to the scan chain) must be stored and written into the shifter/buffer as the least significant bits. This will assure that the desired bits will be accurately http://www.national.com LSB 10-16 "'tI Serial Scan Interface (SSI) en o (Continued) machine that accepts stimulus from the PPI, Mode Registers, CNT32 and the TCK Controi section. The TOI input always shifts in data on the ri3ing edge of SCK. The order of shifting is least significant bit first. The TOI input includes a pull-up resistor to force a logic 1 when the test data signal returning from the scan chain is floating. signal, a partial byte (Le., byte with < eight valid data bits shifted from the scan chain) will exist in the corresponding shift register. The embedded test software functions written to support the evaluation of data read from the TOI shifter/buffer must consider bit placement when reading and evaluating a partial byte. Read operations are completed if the shifter/buffer is not empty and SSC mode is not enabled. Otherwise they are ignored. Write operations are only possible while in SSC mode. Otherwise they are ignored. READING A PARTIAL BYTE FROM THE TDI SHIFTER/ BUFFER. Oata is shifted from the scan chain into each TOI register from most significant bit to least significant bit. Consequently, the valid (Le., meaningful) bits in a partial byte shifted into a TOI register will reside in the upper significant bit locations. For example, if a scan operation involves shifting and evaluating 53 bits returning to TOI, TOI shifter/buffer must be read 7 times (Le., 6 full bytes plus a partial byte containing 5 meaningful bits). If the last 5 bits shifted back to the TOI shifter/buffer are 11010, then upon completion of the shift operation (Le., terminal count on CNT32), the shift register within the TOI shifter/buffer will contain the following partial byte: Shifting occurs when the following conditions are all true: • TOI is enabled with its respective mode bit. • TOI shifter/buffer is not full. • TCK is enabled according to the logic in TCK Control. Local select circuitry is used to toggle back and forth between the two registers of the "FIFO" when shifting. At any given time, one register is selected for shift operations. The other holds its previous state or can accept new serial data. Shift register selection changes due to the following two events: MSB TOI • CNT3 in TCK Control signals that 8 bits have been shifted in. This event is used for basic toggling between each of the two shift registers. ~ LSB x _x-L1_x--.J1 IL--0..J....1-1_0---l...-----'-_L-----'-, Following a read of a partial byte, the embedded test software must adjust the position of the valid bits read from the TOI shifter/buffer or the position of the expected data to assure that an accurate comparison is made (and the nonmeaningful bits are masked). • CNT32 enabled and at terminal count. This event is used to account for scan lengths which are not multiples of eight. When shift register selection changes due to this TOI TOO 1t.l50 1t.l51 LF5R t.lode LoopBack t.lode TL/F/l0968-8 FIGURE 13. TDI Shifter/Buffer Block Diagram 10-17 http://www.national.com ...&. o o ." u.. o o .... o Serial Scan Interface (SSI) (Continued) (/) D.. X12 X16;::l Serial Data SCK TL/F/l0968-13 FIGURE 14. TDI SSC Block Diagram SSC MODE. By setting MOOE1 (3), the TOI Shifter/Buffer is reconfigured as a 16-bit SSC (Serial Signature Compactor) using the primitive polynomial: F(X) = X16 + X12 + X3 + X + 1 chain(s) must be considered when developing Loop-Back test vectors to prevent undesired shifting of data or TAP controller transitions within the scan chain. Within a chain of 1149.1 compliant devices, there are typically one or more input pins which are driven by uncontrolled signals (Le., signals which are not driven to known logic levels during a boundary scan CAPTURE operation). These signals are masked during the evaluation of data returning from the scan chain. The SSC within the PSC100 does not provide masking capabilities and, therefore, provides limited usefulness for boundary scan test operations. SSC mode may provide usefulness in other serial test or non-test related implementations which contain predictable data returning into the TOI shifter/buffer. Figure 14 shows a block diagram of the Linear Feedback Shift Register hookup. CNT32 is a 32-bit, count-down binary counter arranged in four 8-bit segments. CNT32 can be loaded independent of its enable/disable status. Loading requires four consecutive writes to its address (least significant byte first). These four writes must not be interleaved with writes to any other address or the CNT32 write control logic will be re-initialized. This re-initialization will result in a partially filled counter with an undesired value. CNT32 is reset each time the counter hits terminal count or by asserting the RST pin. A synchronous reset condition (setting Mode2(1» does not reset the counter and a new value must be written to CNT32 to provide the desired number of TCK cycles. 32·BIT COUNTER (CNT32) SINGLE STEP MODE: All four 8-bit registers are readable for testability; however, there are no update latches similar to the ones used for the status bits. To stabilize the counter for read operations during on-board test, the Single Step Mode has been added. This allows the user to place CNT32 in any state and then count for one SCK cycle (TCK will not toggle when in singled step mode). The result can then be read from the PPI. The counter can be tested by loading it with values at its boundary conditions, and then clocking for one cycle to see the results. For example, the counter could be loaded with the value: 00000001 00000000 00000000 00000000 The SSC is loaded by two PPI writes to the TOI address. When the SSC enable bit is set, a pulse is issued internally that initializes the local parallel load logic such that the SSC is loaded sequentially, most significant byte first, least significant byte last. When in SSC mode, writes can be completed at any time; however, shift operations will be disabled until the SSC is fully loaded. PPI reads from TOI are ignored while in SSC mode. Upon leaving SSC mode an internal pulse causes the TOI shifter/buffer to be full. Also, local read select logic is initialized such that the signature is read most-significant byte first. The next step is to set the Single Step Mode bit so that the counter counts down to the next state and stops. The next value is: TEST LOOP·BACK MODES. This feature provides a means for testing 'PSC100 functionality by looping data appearing at the output of an outgoing shifter/buffer (Le., TMSO, TMS1 or TOO) back to the input of the TOI shifter/buffer. The loop back function is accomplished with a simple multiplexer (see Figure 13) whose path selection is determined by setting the mode bits in MOOE1 (1 :0). Loop back does not disable TCK or prevent shifting of data in the shifter/buffers to the scan chain(s) connected to the PSC100. Therefore, the state and operation of the TAP controllers within the scan http://www.national.com 00000000 11111111 11111111 11111111 Four read cycles using the PPI will reveal the results of the test. Note: CNT32 will not wrap from terminal count (i.e., OOOOOOOOh decremented by 1 will remain unchanged and will not wrap to FFFFFFFFh). Therefore, CNT32 should be loaded with a non-zero value prior to a Single Step Mode Operation. 10-18 ""C C/) o Serial Scan Interface (551) (Continued) -o o '"T1 TIMING WAVEFORMS I I SCK J r:~d5TCK TOO TMS - - '----'f -- -- " 1\ ~d5 '\I J t::1 ~d6 ~ ~~ tpd8 ~ )( I ten4 ::J t dis4 ~ tpd7 )( I t:. It,5 ts5 -- ~ TOI ~d8 - t::. ~ - J" FRZ "' " TL/F/10968-15 FIGURE 15. Serial Scan Interface Timing Embedded Test Software Support an IEEE 1149.1 compatible system. SCAN EASE is written to run on a wide range of processor and memory architectures. SCAN EASE includes the source code (ANSI C) and is modular to allow user modification based on application specific needs. A SCANPSC100 device driver is provided by National to supply functions for performing write, read and shift operations. National also offers a suite of software tools (called SCAN EASE) which enables ATPG or custom generated test vectors to be embedded, applied and evaluated within 10-19 http://www.national.com u. o o ..... o U) D.. Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (Vee) DC Input Diode Current VI = -0.5V VI = vee + 0.5V Supply Voltage (Vee) 'PSC100F -0.5Vto +7.0V (Iud -20mA +20mA DC Input Voltage (VI) -0.5V to Vee + O.5V DC Output Source/Sink Current (10) ±50 mA DC Vee or Ground Current per Output Pin ±50 mA DC Latchup Source or Sink Current OVto Vee -40°C to +85°C - 55°C to + 125°C Minimum Input Edge Rate dV /dt SCAN "F" Series Devices VIN from 0.8V to 2.0V Vee @ 4.5V, 5.5V -20mA +20mA DC Output Voltage (Vo) OVto Vee Output Voltage (Vo) Operating Temperature (TA) Commercial Military -0.5V to Vee +O.5V DC Output Diode Current (10K) Vo = -0.5V Vo = Vee + 0.5V 4.5Vto 5.5V Input Voltage (VI) 125 mV/ns ±300 mA Junction Temperature SOIC + 140°C Storage Temperature - 65°C to + 150°C ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met. without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. National does not recommend operation of SCANTM outside of recommended operation conditions. DC Electrical Characteristics Commercial TA = + 25°C Military = Commercial = Parameter Vee (V) VIH Minimum High Input Voltage 4.5 5.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = O.Wor Vee - 0.1V VIL Maximum Low Input Voltage 4.5 5.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1Vor Vee - O.W VOH Minimum High Output Voltage 4.5 5.5 4.4 5.4 4.4 5.4 4.4 5.4 V 4.5 5.5 3.86 4.86 3.70 4.70 3.76 4.76 V 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 V 4.5 5.5 0.36 0.36 0.50 0.50 0.44 0.44 V Symbol Typ VOL Maximum Low Output Voltage TA -55°C to + 125°C TA -40°C to +85°C Units Conditions Guaranteed limits lOUT = - 50 p,A VIN = Vil or VIH 10H = -24mA All Outputs Loaded lOUT = - 50 p,A VIN = Vil or VIH IOL = 24mA All Outputs Loaded VIN = Vee for TDI. OE VIN = Vee. GND for All Others liN Maximum Input Leakage Current 5.5 ±0.1 ±1.0 ±1.0 p,A IllR Maximum Input Leakage Current 5.5 -385 -385 -385 p,A VIN = GNDfor TDI. OE Only IOLD Minimum Dynamic Output Current 50 75 mA VOlD = 1.65V Max Maximum Test Duration 2.0 ms. One Output Loaded at a Time http://www.national.com 5.5 10-20 = "'C rn o--. o o DC Electrical Characteristics (Continued) Military Commercial Symbol Vee TA (V) Parameter = TA +25°C Typ 10HD Minimum Dynamic Output Current loz Maximum TRI-STATE Leakage Current 10ZT Maximum 1/0 Leakage Current Commercial = -55°Cto TA + 125°C ." = -40°Cto Units + 85°C Guaranteed Limits 5.5 ±0.5 ±0.6 -50 -75 mA VOHD = 3.85V Min Maximum Test Duration = 2.0 ms, One Output Loaded at a Time ± 10.0 ±5.0 p.A VIN = Vcc, GND VIN (OE, R/W, CE, STB) p.A VIN = Vcc, GND Vo = Vcc, GND VIN(R/W, GE, STB) ± 11.0 ±6.0 Icc Maximum Quiescent Supply Current 5.5 8 160 80 p.A Icc max Maximum Quiescent Supply Current 5.5 768 920 840 p.A ICCT Maximum Icc/Input ICCTA Maximum Icc/Input ICCD Dynamic Power Supply Current (Note 1) Conditions = = VIL, VIH TDI, DE Float TDI,DElow 5.5 0.6 1.60 1.50 mA VIN = Vcc - 2.1V Float: TDI, OE 5.5 0.65 1.65 1.65 mA VIN = Vcc -2.1V TDI and OE Only Float Untested Pin 5.5 1.70 2.30 2.30 VIH = Vcc, VIL = 0, mAl Vcc = Max, Outputs Open, MHz FSCK = 25 MHz 2.30 VIL, VIH Note 1: This parameter is not directly testable. but is derived for use in Total Power Supply calculations. AC Electrical Characteristics/Operating Requirements Commercial Symbol Parameter Military TA = +25°C CL = 50 pF Vee· (V) Min Typ TA = Commercial -55°C to + 125°C CL = 50 pF TA = -40°C to + 85°C CL = 50pF Max Min Max Min Max Units Fig. No. PARALLEL PROCESSOR INTERFACE (PPI) tpd1 Prop Delay R/Wto ROY 5.0 5.0 14.0 19.5 5.0 24.0 5.0 24.0 ns 2,3,4 tpd2 Prop Delay AtoRDY 5.0 5.0 14.0 19.5 5.0 24.0 5.0 24.0 ns 2,3 tpd3 Prop Delay Ato 0 5.0 5.0 14.0 19.5 5.0 24.0 5.0 24.0 ns 3 tpd4 Prop Delay STB to ROY 5.0 8.0 14.5 19.0 7.0 24.0 8.0 20.5 ns 2-4,6 ten1 Enable Time GEto ROY 5.0 2.0 7.0 10.0 2.0 13.0 2.0 11.0 ns 2,3 tdis1 Disable Time GEto ROY 5.0 1.0 5.5 8.0 1.5 10.0 1.0 9.0 ns 2,3 ten2 Enable Time GEtoD 5.0 3.0 9.5 13.5 1.5 16.5 3.0 14.5 ns 3 tdis2 Disable Time GEtoD 5.0 2.5 7.5 11.0 2.5 14.5 2.5 12.0 ns 3 'Voltage Range 5.0 is S.OV ±O.SV. 10-21 http://www.national.com LL. o ....o o en a. AC Electrical Characteristics/Operating Requirements Symbol Vcc' (V) Parameter (Continued) Commercial Military Commercial TA = +25°C CL = 50pF TA = -55°C to + 125°C CL = 50 pF TA = -40°C to +85°C CL = 50pF Min Typ Max Min Max Min Max Units Fig. No. PARALLEL PROCESSOR INTERFACE (PPI) (Continued) t en 3 Enable Time R/Wto D 5.0 3.0 10.0 14.0 3.0 17.5 3.0 15.0 ns 3 tdis3 Disable Time R/Wto D 5.0 3.0 8.5 12.5 3.0 16.0 3.0 13.5 ns 3 th1 Hold Time, R/WtoSTB 5.0 0.5 0.0 0.5 0.5 ns 2-4,6 ts1 Setup Time R/WtoSTB 5.0 1.0 0.0 1.0 1.0 ns 2-4,6 th2 Hold Time, AtoSTB 5.0 4.0 2.5 4.5 4.0 ns 2,3 ts2 Setup Time, AtoSTB 5.0 4.0 1.5 5.0 4.0 ns 2,3 th3 Hold Time, DtoSTB 5.0 4.0 2.5 4.5 4.0 ns 2 ts3 Setup Time, DtoSTB 5.0 0.0 -2.0 0.0 0.0 ns 2 ts4 Setup Time, STB t toSCK 5.0 7.0 5.0 7.5 7.0 ns 4-7 19.5 12.0 20.0 19.5 ns 4,6 18.5 14.0 20.0 18.5 4,6 t t t t ! Clock Pulse Width SCK(L) SCK (H) 5.0 tW1 Pulse Width STB (H or L) 5.0 5.5 2.0 6.0 5.5 ns f max Maximum Frequency Clock 5.0 25 35 25 25 MHz tw 'Voltage Range 5.0 is 5.0V ±0.5V. http://www.nationai.com 10-22 "tJ AC Electrical Characteristics/Operating Requirements Symbol Parameter Vcc· (V) en o ...... (Continued) Commercial Military Commercial TA = +25°C CL = 50 pF TA = -55°C to + 125°C CL = 50pF TA = -40°C to +85°C CL = 50 pF Min Typ Max Min Max Min Max o o "T1 Units Fig. No. SERIAL SCAN INTERFACE (551) tpd5 Prop Delay SCKto TCK 5.0 3.0 B.O 11.0 3.0 14.0 3.0 12.0 ns 15 tpd6 Prop Delay SCKtoTDO 5.0 5.5 12.0 16.0 5.5 19.5 5.5 17.5 ns 15 tpd7 Prop Delay SCKtoTMS 5.0 4.5 11.0 14.5 4.5 1B.5 4.5 15.5 ns 15 tpd8 Prop Delay FRZtoTCK 5.0 3.0 B.O 10.5 3.0 13.5 3.0 11.5 ns 15 ten4 Enable Time OEtoJTAG 5.0 2.0 7.0 10.0 2.0 13.0 2.0 11.0 ns 14 tdis4 Disable Time OEtoJTAG 5.0 1.0 6.0 9.0 2.0 11.0 1.0 10.0 ns 14 th5 Hold Time, H or L TDI to SCK (Note 1) 5.0 ts5 Setup Time, H or L TDI to SCK (Note 1) 5.0 0.5 -1.5 0.5 0.5 0.0 -2.0 0.0 0.0 5.0 3.0 5.5 5.0 6.5 3.5 7.5 6.5 ns ns - 15 15 15 r--15 RST RELATED TIMING tpd Prop Delay RSTtoD 5.0 B.O 17.5 24.0 B.O 29.5 B.O 25.5 ns tpd Prop Delay RSTtoRDY 5.0 B.O 19.5 25.5 B.O 31.0 B.O 28.0 ns tphl Prop Delay RSTto INT 5.0 7.0 16.5 24.5 7.0 28.0 7.0 24.5 ns tplh Prop Delay RSTto TDO 5.0 5.5 12.5 17.0 5.5 21.0 5.5 18.5 ns tplh Prop Delay RSTtoTMS 5.0 5.5 12.0 16.0 5.5 20.0 5.5 17.5 ns tWR Pulse Width RST(L) 5.0 6.0 4.0 6.5 6.0 ns tREe Recovery Time SCKfrom RST 5.0 1.0 -0.5 1.0 1.0 ns Note 1: sse Mode 'Voltage Range 5.0 is 5.0V ±O.5V. 10·23 http://www.national.com LL <:) <:) .... Application Note en c.. SCK MINIMUM PULSE WIDTH CALCULATION o a SHIFT-ENABLE signal which is generated internal to the 'PSC100, based on the status of the TDI buffer and the Mode Registers. The SCANPSC100 Parallel to Serial Converter is intended to act as the interface between a processor and an IEEE 1149.1 boundary scan chain. When used in this configuration, there is a critical timing situation that is not obvious. This timing involves the system clock rate at which data from the scan ring is being read into the 'PSC100's TDI pin (target TAP controllers in SHIFT-DR or SHIFT-IR states). We now see the three major timing components which limit the duration of the SCK pulse width low. There are two minor additional delays which should be noted. The TCK signal from the 'PSC100 needs to arrive at the target device to be recognized, and this takes a finite amount of time depending on the signal trace length and impedance. Similarly, the TDO signal of the last target in the chain needs to reach the TDI pin of the 'PSC1 00, taking a finite amount of time as well. These two trace delays can be minimized by making the target device closest to the 'PSC100 the last device in the chain. See Figure 17. To fully understand the events which are taking place during this critical period, it is useful to view the waveforms of interest as they relate in time. See Figure 16. The TCK is derived internally to the 'PSC100 based on the system clock (SCK) and clock gating control. The result is that when TCK is running, it is at the same frequency as SCK but delayed in time by the SCK-TCK propagation delay. PROGRAMMING RESTRICTIONS The TCK signal from the 'PSC100 drives all of the IEEE 1149.1 target devices. On the rising edge of TCK, data present at each scan cell is clocked into it. On the falling edge, this data is presented at the output of the same scan cell for the next adjacent cell to read. With regards to the last cell in a particular target, the falling edge of TCK presents the data in the last scan cell to the TDO pin, a TCK-TDO propagation delay later. Because certain mode bits enable shift operations for certain functions, these mode bits should not be changed when shift operations are in progress. The alignment of all registers during shift operations is controlled by a three bit counter in the TCK control block. Enabling or disabling a function in the middle of a shift operation may disrupt the logic necessary to keep all shifter/buffers byte-aligned. For example, if the TDO shifter/buffer (already loaded) is enabled while the three bit counter value is three, the shifter/buffer will only shift out 5 bits of the first byte loaded. At the 'PSC100, data shifted in through the TDI pin is clocked in on the rising edge of SCK, not TCK. The reason for this is that TCK is generated internal to the 'PSC1 00 and intended to control the boundary scan targets. The 'PSC1 00 is controlled by SCK, therefore the signal to be shifted into the TDI pin needs to be referenced to SCK not TCK. New TDI data must be present a TDI-SCK set-up time prior to the rising edge of SCK in order to guarantee validity. Although SCK is usually continuous, the TDI buffer is controlled by The following bits should not be changed when shift operations are in progress, i.e., when TCK is enabled (see TCK control section): • MODEO(7:3) • MODE1 (4:3) • MODE2(0) 'PSC100 Pw(L) SCK ~\- -JI __ I ---""1"""""\ ' :Td~~_~ TCK SCK-TCK~ , I I I TOI TSIJ I I I TCI-SCK ,- , ___ J~ X _____I---J ,'--________ (From 1149.1 Device) I I. .1 Tdl·--'I I --Td2· I' I TCK-TCO:~ 1149.1 Device I TCK (From PSC 100) I TOO --------------JX'--------·Trace Delays Pw(L) minimum = Tpd1 + Td1 + Tpd2 + Td2 + Tsu FIGURE 16. System Clock Timing for Accurate TDI Data http://www.national.com 10-24 TLlF/10968-16 "tJ en ...... o (') o "T1 - Tt.lS TDI I - - r- Tt.lS TOI W - :::J :::J :::J :::J 1149.1 Device r TOO PSC100 Tt.lS TDI R/W TCK STB Tt.lS TCK 1149.1 Device r r- TOO I -------- - -- .....- Tt.lS TDI J ..... Tt.lS TCK I- rJ TOO , / / / 00-07 1149.1 Device 1149.1 Device AO-A2 -------- - TOO TCK ------------------- I I - TOO TCK f-< TL/F110968-17 Note: - - - - - Minimize the lengths of these two traces. FIGURE 17. SCANPSC100 Location Relative to Targets 10-25 http://www.national.com LL o ~ tflNational Semiconductor SCANPSC110F SCAN Bridge Hierarchical and Multidrop Addressable JTAG Port (IEEE1149.1 System Test Support) General Description Features The SCANPSC110F Bridge extends the IEEE Std. 1149.1 test bus into a multidrop test bus environment. The advantage of a hierarchical approach over a single serial scan chain is improved test throughput and the ability to remove a board from the system and retain test access to the remaining modules. Each SCANPSC110F Bridge supports up to 3 local scan rings which can be accessed individually or combined serially. Addressing is accomplished by loading the instruction register with a value matching that of the Slot inputs. Backplane and inter-board testing can easily be accomplished by parking the local TAP Controllers in one of the stable TAP Controller states via a Park instruction. The 32-bit TCK counter enables built in self test operations to be performed on one port while other scan chains are simultaneously tested. • True IEEE1149.1 hierarchical and multidrop addressable capability • The 6 slot inputs support up to 59 unique addresses, a Broadcast Address, and 4 Multi-cast Group Addresses • 3 IEEE 1149.1-compatible configurable local scan ports • Mode Register allows local TAPs to be bypassed, selected for insertion into the scan chain individually, or serially in groups of two or three • 32-bit TCK counter • 16-bit LFSR Signature Compactor • Local TAPs can be tri-stated via the OE input to allow an alternate test master to take control of the local TAPs Ordering Code: See Section 11 Connection Diagrams 28·Pin SOIC, CDiP and Flatpak 0E-1 \...../ 28 f-Vcc 50 51 - 2 27 f-TDb 3 26 f-TCK1.3 52 - 4 25 f-TM\3 53 - 5 5.- 6 24 f- 1Oo1.3 55 - 7 22 ~TC~2 Vcc - 8 TR5T- 9 20 f-m5 l2 23 ~TDll2 21 ~GND TM5B- 10 TCKB- 11 18 f-1Oll1 1OI B- 12 17 f-TCK l1 TDOg- 13 16 f-TM5 11 15 f-1O<\ 1 GND- 14 Pin Assignment for LCC 19 f-1O<\2 TLlF/11570-2 Pin Names TL/F/11570-1 Order Number Description SCANPSC110FSC SCANPSC110FSCX SCANPSC110FFMQB SCANPSC110FOMQB SCANPSC110FLMQB SOIC in Tubes SOIC in Table and Reel Military Flatpak MilitaryOIP Military Leadless Chip Carrier http://www.national.com TCKS ™Ss TOls TOOs TRST S(0.5) OE TCKL(1-3) TMSL(1-3) TOIL(1-3) TO°L(1-3) 10-26 Description Backplane Test Clock Input Backplane Test Mode Select Input Backplane Test Oata Input Backplane Test Oata Output Asynchronous Test Reset Input (Active low) Address Select Port Local Scan Port Output Enable (Active low) Local Port Test Clock Output Local Port Test Mode Select Output Local Port Test Oata Input Local Port Test Oata Output -a en o.... Table of Contents GLOSSARY OF TERMS .......................... 10-27 REGISTER DESCRiPTIONS ...................... 10-38 DETAILED PIN DESCRIPTION TABLE ............ 10-28 SPECIAL FEATURES ............................ 10-40 OVERVIEW OF SCAN BRIDGE FUNCTIONS ....... 10-29 BIST Support .................................. 10-40 SCANPSC110F Bridge Architecture .............. 10-29 RESET ....................................... 10-40 SCANPSC110F Bridge State Machines ........... 10-29 Port Synchronization ........................... 10-40 TESTERISCANPSC110F BRIDGE INTERFACE .... 10-32 ABSOLUTE MAXIMUM RATINGS ................. 10-42 REGISTER SET ................................. 10-33 RECOMMENDED OPERATING CONDITIONS ...... 10-42 ADDRESSING SCHEME ......................... 10-33 DC ELECTRICAL CHARACTERISTICS ............ 10-42 HIERARCHICAL TEST SUPPORT ................. 10-33 AC ELECTRICAL CHARACTERISTICS ............ 10-45 LEVEL 1 PROTOCOL ............................ 10-34 AC WAVEFORMS ............................... 10-48 Addressing Modes ............................. 10-34 APPENDIX ..................................... 10-50 Direct Addressing .............................. 10-34 State Diagram for Boundary-Scan TAP Controller .. 10-50 Broadcast Addressing .......................... 10-35 APPLICATIONS EXAMPLE ....................... 10-51 Multi-Cast Addressing .......................... 10-35 LEVEL 2 PROTOCOL ............................ 10-36 Level 2 Instruction Types ....................... 10-36 Individual Level 2 Instruction Descriptions ......... 10-36 TABLE I. Glossary of Terms LFSR Linear Feedback Shift Register. When enabled, will generate a 16-bit signature of sampled serial test data. LSP Local Scan Port. A four signal port that drives a "local" (Le. non-backplane) scan chain. (e.g., TCKL1, TMSL1, TDOL1, TDIL1) Local Local is used to describe IEEE Std. 1149.1 compliant scan rings and the SCANPSC11 OF Bridge Test Access Port that drives them. The term "local" was adopted from the system test architecture that the 'PSC11 OF Bridge will most commonly be used in; namely, a system test backplane with a 'PSC11 OF Bridge on each card driving up to 3 "local" scan rings per card. (Each card can contain multiple 'PSC11 OFs, with 3 local scan ports per 'PSC11 OF.) Park/Unpark Park, parked, unpark, and unparked, are used to describe the state of the LSP controller and the state of the local TAP controllers (the "local TAP controllers" refers to the TAP controllers of the scan components that make up a local scan ring). Park is also used to describe the action of parking a LSP (transitioning into one of the Parked LSP controller states). It is important to understand that when a LSP controller is in one of the parked states, TMSL is held constant, thereby holding or "parking" the local TAP controllers in a given state. TAP Test Access Port as defined by IEEE Std. 1149.1 Selected/Unselected Selected and Unselected refers to the state of the 'PSC11 OF Bridge Selection Controller. A selected 'PSC11 OF has been properly addressed and is ready to receive Level 2 protocol. Unselected 'PSC11 OFs monitor the system test backplane, but do not accept Level 2 protocol (except for the GOTOWAIT instruction). The data registers and LSPs of unselected 'PSC11 OFs are not accessible from the system test master. Active Scan Chain The Active Scan Chain refers to the scan chain configuration as seen by the test master at a given moment. When a 'PSC110F is selected with all of its LSPs parked, the active scan chain is the current scan bridge register only. When a LSP is unparked, the active scan chain becomes: TDls ~ the current 'PSC11 OF register ~ the local scan ring registers ~ a PAD bit ~ TDOs. Refer to Table IV for Unparked configurations of the LSP network. Level 1 Protocol Level 1 is the protocol used to address a 'PSC110F. Level 2 Protocol Level 2 is the protocol that is used once a 'PSC11 OF is selected. Level 2 protocol is IEEE Std. 1149.1 compliant when an individual'PSC11 OF is selected. PAD A one bit register that is placed at the end of each local scan port scan-chain. The PAD bit eliminates the prop delay that would be added by the 'PSC11 OF LSPN logic between TDILn and TDOL(n+ 1) or TDOs by buffering and synchronizing the TOIL inputs to the falling edge of TCKs, thus allowing data to be scanned at higher frequencies without violating set-up and hold times. LSB Least Significant Bit, the right-most position in a register (bit 0) MSB Most Significant Bit, the left-most position in a register 10-27 http://www.national.com .... o ." u. ........o o en D.. TABLE II. Detailed Pin Description Table I/O' Name Pin # (SOIC & LCC) Description ™Ss TTL Input w/Pull-Up Resistor 10 BACKPLANE TEST MODE SELECT: Controls sequencing through the TAP Controller of the SCANPSC11 OF Bridge. Also controls sequencing of the TAPs which are on the three (3) local scan chains. TDls TTL Input w/Pull-Up Resistor 12 BACKPLANE TEST DATA INPUT: All backplane scan data is supplied to the 'PSC11 OF through this input pin. TDOs TRI-STATEable, 32 mAl64 rnA Drive, Reduced-Swing, Output 13 BACKPLANE TEST DATA OUTPUT: This output drives test data from the 'PSC110F and the local TAPs, back toward the scan master controller. TCKs TTL Schmitt Trigger Input 11 TEST CLOCK INPUT FROM THE BACKPLANE: This is the master clock signal that controls all scan operations of the 'PSC11 OF and of the three (3) local scan ports. TRST TTL Input w/Pull-Up Resistor 9 TEST RESET: An asynchronous reset signal (active low) which initializes the 'PSC11 OF logic. S(0-5) TTL Inputs 2,3,4, 5,6,7 SLOT IDENTIFICATION: The configuration of these six (6) pins is used to identify (assign a unique address to) each 'PSC11 OF on the system backplane. OE TTL Input 1 OUTPUT ENABLE for the Local Scan Ports, active low. When high, this activelow control signal TRI-STATEs all three local scan ports on the 'PSC110F, to enable an alternate resource to access one or more of the three (3) local scan chains. TDOL(1-3) TRI-STATEable, 24 mAl24mA Drive Outputs 15,19, 24 TEST DATA OUTPUTS: Individual output for each of the three (3) local scan ports. TDIL(1-3) TTL Inputs w/Pull-Up Resistors 18,23, 27 TEST DATA INPUTS: Individual scan data input for each of the three (3) local scan ports. TMSL(1-3) TRI-STATEable, 24mAl24 mA Drive Outputs 16,20, 25 TEST MODE SELECT OUTPUTS: Individual output for each of the three (3) local scan ports. TMSL does not provide a pull-up resistor (which is assumed to be present on a connected TMS input, per the IEEE 1149.1 requirement) TCKL(1-3) TRI-STATEable, 24mAl24 mA Drive Output 17,22, 26 LOCAL TEST CLOCK OUTPUTS: Individual output for each of the three (3) local scan ports. These are buffered versions of TCKs. Vee Power Supply Voltage 8,28 Power supply pins, S.OV ± 10%. GND Ground potential 14,21 Power supply pins OV. 'All pins are active HIGH unless otherwise noted. http://www.national.com 10-28 "'C en Overview of SCANPSC110F Bridge Functions 0 ...... ...... OE TDO a lOlLl lO~1 TMS L 1 TCKL 1 TMSa~~~----------~~~1 TCKa ---~----------""--4~1 TRST-....- - -... JTAG TAP CONTROLLER TDIL2 lO~2 TMSL2 TCK L2 . So ~ • S2 - - - - - - - - -.......~I SCAN BRIDGE S3 • SELECTION CONTROL S4---------.. . . ~1 S5 -------i~L_ _r_-..J TDI8 - CLOCKS AND CONTROL TDb TDOL3 TMS u TCKu .....- -...- - - - -.... MULTi-CAST GROUP REGISTER INSTRUCTiON REGISTER 32-BIT COUNTER REGISTER 16-BIT LINEAR FEEDBACK SHIFT REGISTER LFSR SAMPLES DATA RETURNED FROM LSPN TLlF/11570-3 FIGURE 1. SCANPSC110F Bridge Architecture instruction register, mode register, and the TAP controller. Each local port contains all four (4) boundary scan signals needed to interface with the local TAPs. SCANPSC110F BRIDGE ARCHITECTURE Figure 1 shows the basic architecture of the 'PSC110F. The device's major functional blocks are illustrated here. The TAP Controller, a 16-state state machine, is the central control for the device. The instruction register and various test data registers can be scanned to exercise the various functions of the 'PSC110F (these registers behave as defined in IEEE Std. 1149.1). SCANPSC110F BRIDGE STATE MACHINES The 'PSC11 OF is IEEE 1149.1-compatible, in that it supports all required 1149.1 operations. In addition, it supports a higher level of protocol, (Level 1), that extends the IEEE 1149.1 Std. to a multi-drop environment. In multi-drop scan systems, a scan tester can select individual 'PSC110Fs for participation in upcoming scan operations. 'PSC110F "selection" is accomplished by simultaneously scanning a device address out to multiple 'PSC11 OFs. Through an on-chip address matching process, only those 'PSC110Fs whose statically-assigned address matches the scanned-out address become selected to receive further instructions from the scan tester. 'PSC110F selection is done using a "Level-1" protocol, while follow-on instructions are sent to selected 'PSC110Fs by using a "Level-2" protocol. The 'PSC11 OF selection controller provides the functionality that allows the 1149.1 protocol to be used in a multi-drop environment. It primarily compares the address input to the slot identification and enables the 'PSC11 OF for subsequent scan operations. The Local Scan Port Network (LSPN) contains multiplexing logic used to select different port configurations. The LSPN control block contains the Local Scan Port Controllers (LSPC) for each Local Scan Port (LSP1, LSP2, and LSP3). This control block receives input from the 'PSC110F 10-29 http://www.national.com 0 'T1 LL o ,.... ,.... o U) Overview of SCANPSC110F Bridge Functions (Continued) a.. SCANPSC 11 OF Bridge-selection state-machine '''''-1 Pro\,,,' { A State K'f State ... TAP Control state-machine 7' Scan port configuration state-machines (3 total) '''''-, Pro\,,,' { A State 'f TLlF/11S70-4 FIGURE 2. SCANPSC110F Bridge State Machines these scan port-selection state-machines allows individual local ports to be inserted into and removed from the 'PSC110Fs overall scan chain. The 'PSC11 OF contains three distinct but coupled state-machines (see Figure 2). The first of these is the TAP-control state-machine, which is used to drive the 'PSC110Fs scan ports in conformance with the 1149.1 Standard (see Figure 17 of appendix). The second is the 'PSC110F-selection state-machine (Figure 3). The third state-machine actually consists of three identical but independent state-machines (see Figure 4), one per 'PSC11 OF local scan port. Each of The 'PSC110F selection state-machine performs the address matching which gives the 'PSC110F its multi-drop capability. That logic supports single-'PSC11 OF access, multicast, and broadcast. The 'PSC110F-selection state-machine implements the chip's Level-1 protocol. RESET AD DR :p SLOT & ADDR :#: BROADCAST & ADDR:p MULTI-CAST (MCGR) GOTOWAIT + RESET Address = SLOT KEY + = OR GOTOWAIT + RESET & = AND ADDR = 6-bit address in the Instruction Register SLOT = Static address In the 'PSC11 OF Selection Controller TL/F/11S70-S FIGURE 3. State Machine for SCANPSC110F Bridge Selection Controller http://www.national.com 10-30 "tJ en ....o Overview of SCANPSC110F Bridge Functions (Continued) ....o -n TLIF/11570-12 FIGURE 4. Local SCANPSC110F Bridge Port Configuration State Machine The 'PSC110F's scan port-configuration state-machine is used to control the insertion of local scan ports into the overall scan chain, or the isolation of local ports from tile chain. From the perspective of a system's (single) scan controller, each 'PSC11 OF presents only one scan chain to the master. The 'PSC11 OF architecture allows one or more of the 'PSC11 OF's local ports to be included in the active scan chain. PARKRTI instruction, the Local Port controller enters the Parked-RTI state in which TMSLn will be held low until the port is later unparked. While TMSLn is held low, all devices on that local scan chain remain in their current TAP State (the RT/TAP controller state in this example). The 'PSC11 OF's scan port-configuration state-machine implements part of the 'PSC11 OF's Level-2 protocol. In addition, the 'PSC110F provides a number of Level-2 instructions for functions other than local scan port confguration. These instructions provide access to and control of various registers within the 'PSC110F. This set instructions includes: Each local port can be "parked" in one of four stable states (Parked- TLR, Parked-RT!, Parked-Pause-DR or ParkedPause-IR), either individually or simultaneously with other local ports. Parking a chain removes that local chain from the active scan chain. Conversely, a parked chain can be "unparked", causing the corresponding local port to be inserted into the active scan chain. BYPASS EXTEST SAMPLE/PRELOAD IDCODE MODESEL MCGRSEL LFSRSEL As shown in Figure 4, the 'PSC110F's three scan port-configuration state-machines allow each of the part's local ports to occupy a different state at any given time. For example, some ports may be parked, perhaps in different states, while other ports participate in scan operations. The state-diagram shows that some state transitions depend on the current state of the TAP-control state-machine. As an example, a local port which is presently in the Parked-RTI state does not become unparked (Le., enter the Unparked state) until the 'PSC110F receives an UNPARK instruction and the 'PSC110F's TAP state-machine enters the RunTest/Idle state. CNTRSEL LFSRON LFSROFF CNTRON CNTROFF GOTOWAIT Figure 5 illustrates how the 'PSC11 OF's state-machines interact. The 'PSC110F-selection state-machine enables or disables operation of the chip's three port-selection statemachines. In 'PSC11 OFs which are selected via Level-1 protocol (either as individual 'PSC110Fs or as members of broadcast or multi-cast groups), Level-2 protocol commands can be used to park or unpark local scan ports. Note that most transitions of the port-configuration state-machines are gated by particular states of the 'PSC110F's TAP-control state-machine, as shown in Figures 4 and 5. Similarly, certain transitions of the scan port-configuration state-machine can force the 'PSC11 OF's TAP-control statemachine into specific states. For example, when a local port is in the Unparked state and the 'PSC110F receives a 10-31 http://www.national.com II. ........o o Overview of SCANPSC110F Bridge Functions (Continued) U) D. SCANPSC110F Bridge - Selection State - Machine RESET - - i -......r GOTO,!(AlT+ RESET GOTO,!(AlT Local Scan Port Configuration State - Machines (1 per Local Port) TLlF/llS70-6 FIGURE 5. Relationship Between SCANPSC110F Bridge State Machines When the instruction register is updated with the address data, the 'PSC110F's address-recognition logic compares the six least-significant bits of the instruction register with the 6-bit assigned address which is statically present on the S(0-5) inputs. Simultaneously, the scanned-in address is compared with the reserved Broadcast and Multi-cast addresses. If an address match is detected, the 'PSC11 OF-selection state-machine enters one of the two selected states. If the scanned address does not match a valid single-slot address or one of the reserved broadcast/multi-cast addresses, the 'PSC11 OF-selection state-machine enters the Unselected state. Note that the SLOT inputs should not be set to a value corresponding to a mUlti-cast group, or to the broadcast address. Also note that the single-'PSC110F selection process must be performed for all 'PSC110Fs which are subsequently to be addressed in mUlti-cast mode. This is required because each such device's Multi-cast Group Register (MCGR) must be programmed with a multi-cast group number, and the MCGR is not accessible to the test controller until that 'PSC110F has first entered the Selected-Single'PSC110F state. Following a hardware reset, the TAP controller state-machine is in the Test-Logie-Reset (TLR) state; the 'PSC11 OFselection state-machine is in the Wait-For-Address state; and each of the three port-selection state-machines is in the Parked- TLR state. The 'PSC11 OF is then ready to receive Level-1 protocol, followed by Level-2 protocol. TesterlSCANPSC110F Bridge Interface An IEEE 1149.1 system tester sends instructions to a 'PSC110F via that 'PSC110F's backplane scan-port. Following test logic reset, the 'PSC11 OF's selection state-machine is in the Wait-For-Address state. When the 'PSC110F's TAP controller is sequenced to the Shift-IR state, data shifted in through the TDls input is shifted into the 'PSC11 OF's instruction register. Note that prior to successful selection of a 'PSC11 OF, data is not shifted out of the instruction register and out through the 'PSC110F's TDOs output, as it is during normal scan operations. Instead, as each new bit enters the instruction register's most-significant bit, data shifted out from the least-significant bit is discarded. http://www.national.com Once a 'PSC110F has been selected, Level-2 protocol is used to issue commands and to access the chip's various registers. 10-32 "tJ en o...... Register Set The SCANPSC11 OF Bridge includes a number of registers which are used for 'PSC11 OF selection and configuration, scan data manipulation, and scan-support operations. These registers can be grouped as shown in Table III. Note that when any of these registers is selected for insertion into the 'PSC110F's scan-chain, scan data enters through that register's most-significant bit. Similarly, data that is shifted out of the register is fed to the scan input of the next-downstream device in the scan-chain. The specific fields and functions of each of these registers are detailed in the section of this document titled "Data Register Descriptions". TABLE III. Registers Register Name BSDLName Description Instruction Register INSTRUCTION 'PSC11 OF addressing and instruction-decode IEEE Std. 1149.1 required register Boundary-Scan Register BOUNDARY IEEE Std. 1149.1 required register Bypass Register BYPASS IEEE Std. 1149.1 required register Device Identification Register IDCODE IEEE Std. 1149.1 optional register Multi-Cast Group Register MCGR 'PSC11 OF-group address assignment Mode Register MODE 'PSC110F local-port configuration and control bits Linear-Feedback Shift Register LFSR 'PSC110F scan-data compaction (signature generation) TCK Counter Register CNTR Local-port TCK clock-gating (for BISn Addressing Scheme Hierarchical Test Support The SCANPSC11 OF Bridge architecture extends the functionality of the IEEE 1149.1 Standard by supplementing that protocol with an addressing scheme which allows a test controller to communicate with specific 'PSC11 OFs within a network of 'PSC11 OFs. That network can include both mUltidrop and hierarchical connectivity. In effect, the 'PSC11 OF architecture allows a test controller to dynamically select specific portions of such a network for participation in scan operations. This allows a complex system to be partitioned into smaller blocks for testing purposes. Multiple SCANPSC11 OF Bridges can be used to assemble a hierarchical boundary-scan tree. In such a configuration, the system tester can configure the local ports of a set of 'PSC110Fs so as to connect a specific set of local scanchains to the active scan chain. Using this capability, the tester can selectively communicate with specific portions of a target system. The tester's scan port is connected to the backplane scan port of a "root" layer of 'PSC11 OFs, each of which can be selected using multi-drop addressing. A second tier of 'PSC110Fs can be connected to this root layer, by connecting a local port (LSP) of a root-layer 'PSC110F to the backplane port of a second-tier 'PSC110F. This process can be continued to construct a mUlti-level scan hierarchy. The 'PSC11 OF provides two levels of test-network partitioning capability. First, a test controller can select entire individual 'PSC110Fs, specific sets of 'PSC110Fs (multi-cast groups), or all 'PSC110Fs (broadcast). This 'PSC110F-selection process is supported by a "Level-1" communication protocol. Second, within each selected 'PSC110F, a test controller can select one or more of the chip's three local scan-ports. That is, individual local ports can be selected for inclusion in the (single) scan-chain which a 'PSC11 OF presents to the test controller. This mechanism allows a controller to select specific terminal scan-chains within the overall scan network. The port-selection process is supported by a "Level-2" protocol. 'PSC110F local ports which are not cascaded into higherlevel'PSC11 OFs can be thought of as the terminal "leaves" of a scan "tree". The test master can select one or more target leaves by selecting and configuring the local ports of an appropriate set of 'PSC11 OFs in the test tree. 10-33 http://www.national.com ...... o ." U. o ....o.... U) D. r-----------------------------------------------------------------------------------------~ Level 1 Protocol ADDRESSING MODES The SCANPSC110F Bridge supports "single" and "multipie" modes of addressing a 'P5C110F. The "single" mode will select one 'P5C110F and is called Direct Addressing. More than one 'PSC110F device can be selected via the Broadcast and Multi-Cast Addressing modes. TABLE IV. SCANPSC110F Bridge Address Modes Address Types Direct Address Hex Address· Binary Address·· TDOa State 00 to 3A XXOOOOOO to XX111 01 0 Normal IEEE Std. 1149.1 Always TRI-5TATED Broadcast Address 3B XX111011 Multi-Cast Group 0 3C XX111100 Always TRI-STATED Multi-Cast Group 1 3D XX111101 Always TRI-STATED Multi-Cast Group 2 3E XX111110 Always TRI-STATED Multi-Cast Group 3 3F XX111111 Always TRI-STATED • Hex address '7X', 'SX', or 'FX' may be used instead of '3X· . •• Only the six (6) LSS's of the address is compared to the 5(0-5) inputs. The two (2) MSS's are "don't cares". DIRECT ADDRESSING register match the address on the S(0-5) inputs, (see Figure 6) the 'PSC11 OF becomes selected, and is ready to receive Level 2 Protocol (Le., further instructions). When the 'PSC110F is selected, its device identification register is inserted into the active scan chain. The 'PSC11 OF enters the Wait-For-Address state when: 1. its TAP Controller enters the Test-Logic-Reset state, or 2. its instruction register is updated with the GOTOWAITinstruction (while either selected or unselected). Each 'PSC110F within a scan network must be statically configured with a unique address via its S(0-5) inputs. While the 'PSC110F controller is in the Wait-For-Address state, data shifted into bits 5 through 0 of the instruction register is compared with the address present on the 5(0-5) inputs in the Update-IR state. If the six (6) LSBs of the instruction I x COMPARE rrrrr All 'P5C110Fs whose 5(0-5) address does not match the instruction register address become unselected. They will remain unselected until either their TAP Controller enters the Test-Logic-Reset state, or their instruction register is updated with the GOTOWAIT instruction. I ,..------, COMPARES ASSIGNED SLOT VALUE TO THE SELECT IF SCANNED-IN SLOT VALUE. IF THEY ARE EQUAL, EQUAL THEN THIS SPECIFIC SCANPSC 11 OF BRIDGE IS L--_ _....... SELECTED. I I I I I I I I X a-BIT INSTRUCTION REGISTER TLlF/11570-7 FIGURE 6. Direct Addressing: Device Address Loaded Into Instruction Register http://www.national.com 10-34 "'tJ Level 1 Protocol en o (Continued) ~ BROADCAST ADDRESSING ~ MULTI-CAST ADDRESSING The Broadcast Address allows a tester to simultaneously select all 'PSC110Fs in a test network. This mode is useful in testing systems which contain multiple identical boards. To avoid bus contention between scan-path output drivers on different boards, each 'PSC110F's TDOs buffer is always tri-stated while in Broadcast mode. In this configuration, the on-chip Linear Feedback Shift Register (LFSR) can be used to accumulate a test result signature for each board that can be read back later by direct-addressing each board's 'PSC11 OF. o As a way to make the broadcast mechanism more selective, the 'PSC110F provides a "Multi-cast" addressing mode. A 'PSC110F's multi-cast group register (MCGR) can be programmed to assign that 'PSC110F to one of four (4) MultiCast groups. When 'PSC110Fs in the Wail-For-Address state are updated with a Multi-Cast address, all 'PSC110Fs whose MCGR matches the Multi-Cast group will become selected. As in Broadcast mode, TDOs is always tri-stated while in Multi-cast mode. BROADCAST ADDRESS SELECTS ALL SCANPSCll0F BRIDGES SIMULTANEOUSLY 8-BIT INSTRUCTION REGISTER TL/F/11570-8 FIGURE 7. Broadcast Addressing: Address Loaded Into Instruction Register I Multi-Cast Group 0: Multi-Cast Group Register (MCGR) OR I Multi-Cast Group 1 : OR I Multi-Cast Group 2: OR Multi-Cast Group 3 : WHEN MULTiCASTING (CODE=llll), SELECT BRIDGES WHOSE MCGR VALUE MATCHES GROUP-SELECT FIELD IN SCANNED-IN ADDRESS (Multi-Cast Code) TLlF/11570-9 FIGURE 8. Multi-Cast Addressing: Address Loaded Into Instruction Register 10-35 http://www.national.com "T1 u.. c ..... ..... o U) Q. Level 2 Protocol isters (UNPARK, PARKTRL, PARKRTI, PARKPAUSE, SOFTRESET, LFSRON, LFSROFF, GOTOWAIT, CNTRON, CNTROFF). These instructions, along with any other yet undefined Op-Codes, will cause the device identification register to be inserted into the active scan chain. Once the SCANPSC11 OF Bridge has been successfully addressed and selected, its internal registers may be accessed via Level-2 Protocol. Level-2 Protocol is compliant to IEEE Std. 1149.1 TAP protocol with one exception: if the 'PSC110F is selected via the Broadcast or Multi-Cast address, TDOB will always be TRI-STATED. (The TDOB buffer must be implemented this way to prevent bus contention.) LEVEL 2 INSTRUCTION DESCRIPTIONS BYPASS: The BYPASS instruction selects the bypass register for insertion into the active scan chain when the 'PSC110F is selected. Upon being selected, (Le., the 'PSC11 OF Selection controller transitions from the Wait-For-Address state to one of the Selected states), each of the local scan ports (LSP1, LSP2, LSP3) remains parked in one of the following four TAP Controller states: Test-Logie-Reset, Run- Test/Idle, Pause-DR, or Pause-IR and the active scan chain will consist of: TDIB through the instruction register (or the IDCODE register) and out through TDOB. EXTEST: The EXTEST instruction selects the boundaryscan register for insertion into the active scan chain. The boundary-scan register consists of seven "sample only" shift cells connected to the S(0-5) and OE inputs. On the 'PSC11 OF, the EXTESTinstruction performs the same function as the SAMPLE/PRELOAD instruction, since there aren't any scannable outputs on the device. TDIB ~ Instruction Register ~ TDOB The UNPARK instruction (described later) is used to insert one or more local scan ports into the active scan chain. Table IV describes which local ports are inserted into the chain, and in what order. SAMPLE/PRELOAD: The SAMPLE/PRELOAD instruction selects the boundary-scan register for insertion into the active scan chain. The boundary-scan register consists of seven "sample only" shift cells connected to the S(0-5) and OE inputs. LEVEL 2 INSTRUCTION TYPES There are two types of instructions (reference Table V): IDCODE: The IDCODE instruction selects the device identification register for insertion into the active scan chain. When IDCODE is the current active instruction the device identification "OFCOE01 F" Hex is captured upon exiting the Capture-DR state. 1. Instructions that insert a 'PSC11 OF register into the active scan chain so that the register can be captured or updated (BYPASS, SAMPLE/PRELOAD, EXTEST, IDCODE, MODESEL, MCGRSEL, LFSRSEL, CNTRSEL). 2. Instructions that configure local ports or control the operation of the linear feedback shift register and counter reg- TABLE V. Level 2 Protocol and Op-Codes Hex Op-Code Binary Op-Code BYPASS FF 11111111 Bypass Register Boundary-Scan Register Instructions Data Register EXTEST 00 00000000 SAMPLE/PRELOAD 81 10000001 Boundary-Scan Register IDCODE AA 10101010 Device Identification Register UNPARK E7 11100111 Device Identification Register PARKTLR C5 11000101 Device Identification Register PARKRTI 84 10000100 Device Identification Register PARKPAUSE C6 11000110 Device Identification Register GO TOWA IT'" C3 11000011 Device Identification Register MODESEL 8E 10001110 Mode Register MCGRSEL 03 00000011 Multi-Cast Group Register SOFTRESET 88 10001000 Device Identification Register LFSRSEL C9 11001001 Linear Feedback Shift Register LFSRON OC 00001100 Device Identification Register LFSROFF 8D 10001101 Device Identification Register CNTRSEL CE 11001110 32-Bit TCK Counter Register CNTRON OF 00001111 Device Identification Register CNTROFF 90 10010000 Device Identification Register TBD TBD Device Identification Register Other Undefined ·The GOTOWAIT instruction returns both selected and unselected 'PSC11 OFs to the Wait-For-Address state. All other instructions act on selected 'PSC11 OFs only. http://www.national.com 10-36 "U Level 2 Protocol en o...... (Continued) UNPARK: This instruction un parks the Local Scan Port Network and inserts it into the active scan chain as configured by the Mode register (see Table IV). Unparked LSPs are sequenced synchronously with the 'PSC110F's TAP controller. When a LSP has been parked in the Test-Logie-Reset or Run-Test/Idle state, it will not become unparked until the 'PSC110F's TAP Controller enters the Run- Test/Idle state following the UNPARK instruction. If an LSP has been parked in one of the stable pause states (Pause-DR or Pause-/RJ, it will not become unparked until the 'PSC11 OF's TAP Controller enters the respective pause state. (See Figures 9, 10, 11, and 12). in the Pause-DR state, as the 'PSC110F TAP controller is sequenced into the Update-DR state. When a LSP is parked, it is removed from the active scan chain. GO TO WAIT: This instruction is used to return all 'PSC110Fs to the Wait-For-Address state. All unparked LSPs will be parked in the Test-Logie-Reset TAP controller state (see Figure 5). MODESEL: The MODESEL instruction inserts the mode register into the active scan chain. The mode register determines the LSPN configuration. Bit 7 of the mode register is a read-only counter status flag. MCGRSEL: This instruction inserts the multi-cast group register (MCGR) into the active scan chain. The MCGR is used to group 'PSC110Fs into multi-cast groups for parallel TAP sequencing (Le., to simultaneously perform identical scan operations). PARKTLR: This instruction causes all unparked LSPs to be parked in the Test-Logie-Reset TAP controller state and removes the LSP network from the active scan chain. The LSP controllers keep the LSPs parked in the Test-Logie-Reset state by forcing their respective TMSL output with a constant logic" 1" while the LSP controller is in the Parked- TLR state (see Figure 4 ). SOFTRESET: This instruction causes all 3 Port configuration controllers (Figure 4) to enter the Parked- TLR state, which forces TMSLn high; this parks each local port in the Test-Logie-Reset state within 5 TCKs cycles. PARKRTI: This instruction causes all unparked LSPs to be parked in the Run- Test/Idle state. When a LSP n is active (unparked), its TMSL signals follow TMSs and the LSP n controller state transitions are synchronized with the TAP Controller state transitions of the 'PSC110F. When the instruction register is updated with the PARKRTI instruction, TMSL will be forced to a constant logic "0", causing the unparked local TAP Controllers to be parked in the RunTest/Idle state. When an LSPn is parked, it is removed from the active scan chain. LFSRSEL: This instruction inserts the linear feedback shift register (LFSR) into the active scan chain, allowing a compacted signature to be shifted out of the LFSR during the Shift-DR state. (The signature is assumed to have been computed during earlier LFSRON shift operations.) This instruction disables the LFSR register's feedback circuitry, turning the LFSR into a standard 16-bit shift register. This allows a signature to be shifted out of the register, or a seed value to be shifted into it. LFSRON: Once this instruction is executed, the linear feedback shift register samples data from the active scan path (including all unparked TDILn) during the Shift-DR state. Data from the scan path is shifted into the linear feedback shift register and compacted. This allows a serial stream of data to be compressed into a 16-bit signature that can subsequently be shifted out using the LFSRSEL instruction. The linear feedback shift register is not placed in the scan chain during this mode. Instead, the register samples the active scan-chain data as it flows from the LSPN to TDOs. PARKPAUSE: The PARKPAUSE instruction has dual functionality. It can be used to park unparked LSPs or to unpark parked LSPs. The instruction places all unparked LSPs in one of the TAP Controller pause states. A local port does not become parked until the 'PSC110F's TAP Controller is sequenced through Exit1-DR/IR into the Update-DR/IR state. When the 'PSC110F TAP Controller is in the Exitl-DR or Exit1-IR state and TMSs is high, the LSP controller forces a constant logic 'a" onto TMSL thereby parking the port in the Pause-DR or Pause-IR state respectively (see Figure 4). Another instruction can then be loaded to reconfigure the local ports or to deselect the 'PSC11 OF (Le., MODESEL, GOTOWAIT; etc.). LFSROFF: This instruction terminates linear feedback shift register sampling. The LFSR retains its current state after receiving this instruction. CNTRSEL: This instruction inserts the 32-bit TCK counter shift register into the active scan chain. This allows the user to program the number of "n" TCK cycles to send to the parked local ports once the CNTRON instruction is iss~ed (e.g., for BIST operations). Note that to ensure completion of count-down, the 'PSC110F should receive at least "n" TCKs pulses. CNTRON: This instruction enables the TCK counter. The counter begins counting down on the first rising edge of TCKs following the Update-IR TAP controller state and is decremented on each rising edge of TCKs thereafter. When the TCK counter reaches terminal count, "00000000" Hex, TCKL of all parked LSP's is held low. The CNTROFF instruction must be Issued before unparking the LSPs of a 'PSC110F whose counter has reached terminal count. This function over-rides the mode register TCK control bit (bit-3). If the PARKPAUSE instruction is given to a bridge whose LSPs are parked in Pause-/R or Pause-DR, the parked LSPs will become unparked when the 'PSC11 OF's TAP controller is sequenced into the respective Pause state. The PARKPAUSE instruction was implemented with this dual functionality to enable backplane testing (interconnect testing between boards) with simultaneous Updates and Captures. Simultaneous Update and Capture of several boards can be performed by parking LSPs of the different boards in the Pause-DR TAP controller state, after shifting the data to be updated into the boundary registers of the components on each board. The broadcast address is used to select all 'PSC110Fs connected to the backplane. The PARKPAUSE instruction is scanned into the selected 'PSC11 OFs and the 'PSC11 OF TAP controllers are sequenced to the Pause-DR state where the LSPs of all 'PSC11 OFs become unparked. The local TAP controllers are then sequenced through the Update-DR, Select-DR, Capture-DR, Exit1-DR, and parked CNTROFF: This instruction disables the TCK counter, and TCKL control is returned to the mode register (bit-3). 10-37 http://www.national.com ...... o "11 LL o ,.... ,.... o en a.. Level 2 Protocol BACKPLANE TAP LOCAL TAP (Continued) Exit 1-/R Test-Logie-Reset TL/F/11570-10 FIGURE 9. Local Scan Port Synchronization from Parked-TLR Instruction BACKPLANE TAP LOCAL TAP Exit 1-IR Run- Test/Idle TLlF/11570-11 FIGURE 10. Local Scan Port Synchronization from Parked-RTIState Register Descriptions Boundary-Scan Register The boundary-scan register is a "sample only" shift register containing cells from the S(0-5) and DE inputs. The register allows testing of circuitry external to the 'PSC11 OF. It permits the signals flowing between the system pins to be sampled and examined without interfering with the operation of the on-chip system logic. Instruction Register The instruction shift register is an 8-bit register that is in series with the scan chain whenever the TAP Controller of the SCANPSC11 OF Bridge is in the Shift-IR state. Upon exiting the Capture-IR state, the value "XXXXXX01" is captured into the instruction register, where "XXXXXX" represents the value on the S(0-5) inputs. When the 'PSC110F controller is in the Wait-For-Address state, the instruction register is used for 'PSC11 OF selection via address matching. In addressing individual 'PSC11 OFs, the chip's addressing logic performs a comparison between a statically-configured (hard-wired) value on that 'PSC110F's slot inputs, and an address which is scanned into the chip"s instruction register. Binary address codes "000000" through "111010" ("00" through "3A" Hex) are reserved for addressing individual 'PSC110Fs. Address "3B" Hex is for Broadcast mode. In doing mUlti-cast (group) addressing, a scanned-in address is compared against the (previously scanned-in) contents of a 'PSC11 OF's Multi-Cast Group register. Binary address codes "111110" through "111111" ("3A" through "3F" Hex) are reserved for multi-cast addressing, and should not be assigned as 'PSC11 OF slot-input values. http://www.national.com The scan chain is arranged as follows: TOls ~ OE ~ S5 ~ S4 ~ S3 ~S2~S1 ~So~ LSPN~TOOs Bypass Register The bypass register is a 1-bit register that operates as specified in IEEE Std. 1149.1 once the 'PSC11 OF has been selected. The register provides a minimum length serial path for the movement of test data between TOls and the LSPN. This path can be selected when no other test data register needs to be accessed during a board-level test operation. Use of the bypass register shortens the serial access-path to test data registers located in other components on a board-level test data path. 10-38 "tJ Register Description U) o (Continued) Multi-Cast Group Register 2. Scan out the multi-cast group address through the TOls input of a/l'PSC110Fs. Note that this occurs in parallel, resulting in the selection of only those 'PSC11 OFs whose MCGR was previously programmed with the matching multi-cast group code. "Multi-cast" is a method of simultaneously communicating with more than one selected 'PSC11 OF. The multi-cast group register (MCGR) is a 2-bit register used to determine which multi-cast group a particular 'PSC110F is assigned to. Four addresses are reserved for multi-cast addressing. When a 'PSC11 OF is in the Wait-For-Address state and receives a mUlti-cast address, and if that 'PSC110F's MCGR contains a matching value for that multicast address, the 'PSC110F becomes selected and is ready to receive Level 2 Protocol (Le., further instructions). TABLE VI. Multi-Cast Group Register Addressing The MCGR is initialized to "00" upon entering the Test-Logic-Reset state. The following actions are used to perform mUlti-cast addressing: MCGR Bits 1,0 Hex Address Binary Address 00 3C XX111100 01 3D XX111101 10 3E XX111110 11 3F XX111111 1. Assign all target 'PSC11 OFs to a mUlti-cast group by writing each individual target 'PSC110F's MCGR with the same multi-cast group code (see Table VI). This configuration step must be done by individually addressing each target 'PSC11 OF, using that chip's assigned slot value. TABLE VII. Mode Register Control of LSPN Mode Register Scan Chain Configuration (If unparked) XXXOXOOO TDis ---. Register ---. TOOs XXXOXOO1 TOls ---. Register ---. LSP1 ---. PAD ---. TOOs XXXOX010 TOls ---. Register ---. LSP2 ---. PAD ---. TOOs XXXOX011 TOls ---. Register ---. LSP1 ---. PAD ---. LSP2 ---. PAD ---. TOOs XXXOX100 TOls ---. Register ---. LSP3 ---. PAD ---. TOOs XXXOX101 TOls ---. Register ---. LSP1 ---. PAD ---. LSP3 ---. PAD ---. TOOs XXXOX110 TOls ---. Register ---. LSP2 ---. PAD ---. LSP3 ---. PAD ---. TOOs XXXOX111 TDis ---. Register ---. LSP1 ---. PAD ---. LSP2 ---. PAD ---. LSP3 ---. PAD ---. TOOs XXX1XXXX TOls ---. Register ---. TOOB (Loopback) x = don't care Register = 'PSC1l0F instruction register or any of the 'PSC1l0F test data registers PAD = insertion of a l·bit register for synchronization Mode Register Bit 3 is normally set to logic "0" so that TCKL is free-running when the local scan ports are parked. When the local ports are parked, bit 3 can be programmed with logic "1 ", forcing all of the LSP TCKL'S to stop. This feature can be used in power sensitive applications to reduce the power consumed by the test circuitry in parts of the system that are not under test. Bit 3 of the mode register must be reset to logic "0" before the UNPARK instruction is executed. The mode register is an a-bit data register used primarily to configure the Local Scan Port Network. The mode register is initialized to "00000001" binary upon entering the TestLogic-Reset state. Bits 0, 1, 2, and 4 are used for scan chain configuration as described in Table VII. When the UNPARKinstruction is executed, the scan chain configuration will be as shown in Table VII above. When all LSPs are parked, the scan chain configuration will be TOls ---. 'PSC11 OF-register ---. TDOB. Bit 3 is used for TCKLn configuration, see Table VIII. Bit 7 is a status bit for the TCK counter. When the counter is on and has reached terminal count (Zero) Bit 7 of the mode register will be high (logic "1"). Bit 7 is read-only and will be low in all other conditions. TABLE VIII. Test Clock Configuration Bits 5 and 6 are reserved for future use. Bit 3 1 LSP n Parked TCKLn Device Identification Register Stop The device identification register (IOREG) is a 32-bit register compliant with IEEE Std. 1149.1. When the IDCODEinstruction is active, the identification register is loaded with the value "OFCOE01 F" Hex upon leaving the Capture-DR state (on the rising edge of the TCKB). 0 Parked Run 1 Unparked Run 0 Unparked Run 10-39 http://www.national.com -4 -4 o 'T1 u. o..... ..... o t/) D. 7. Bit 7 of the Mode register can be scanned to check the status of the TCK counter, (MODESEL instruction followed by a Shift-DR). Bit 7 logic "0" means the counter has not reached terminal count, logic "1" means that the counter has reached terminal count and the BIST operation has completed. 8. Execute the CNTROFF instruction. 9. Unpark the LSP and scan out the result of the BIST operation (the CNTROFFinstruction must be executed before unparking the LSP). Register Descriptions (Continued) TABLE IX. Detailed Device Identification (Binary) Bits 27-12 Bits 11-1 BltO Part Number Manufacturer Identity 1 1111 1100 0000 1110 00000001 111 1 Bits 31-28 Version 0000 Linear Feedback Shift Register The 'PSC110F contains a "signature compactor" which supports test result evaluation in a multi-chain environment. The signature compactor consists of a 16-bit linear-feedback shift register (LFSR) which can monitor local-port scan data as it is shifted "upstream" from the 'PSC110F's local-port network. Once the LFSR is enabled, the LFSR's state changes in a reproducible way as each local-port data bit is shifted in from the local-port network. When all local-port data has been scanned in, the LFSR contains a 16-bit signature value which can be compared against a signature computed for the expected results vector. The LFSR uses the following feedback polynomial: F(x) = X16 + X12 + X3 + X + 1 The Self test will begin on the rising edge of TCKs following the Update-DR TAP controller state. RESET Reset operations can be performed at three levels. The highest level resets all 'PSC110F registers and all of the local scan chains of selected and unselected 'PSC110Fs. This "Level 1" reset is performed whenever the 'PSC11 OF TAP Controller enters the Test-Logie-Resetstate. Test-Logie-Reset can be entered synchronously by forcing TMSs high for at least five (5) TCKs pulses, or asynchronously by asserting the TRST pin. A "Level 1" reset forces all 'PSC110Fs into the Wait-For-Address state, parks all local scan chains in the Test-Logie-Reset state, and initializes all 'PSC110F registers. This signature compactor is used to compress serial data shifted in from the local scan chain, into a 16-bit signature. This signature can then be shifted out for comparison with an expected value. This allows users to test long scan chains in parallel, via Broadcast or Multi-Cast addressing modes, and check only the 16-bit signatures from each module. The LFSR is initialized with a value of "0000" Hex upon reset. 32-Blt TCK Counter Register: The 32-bit TCK counter register enables BIST testing that requires "n" TCK cycles, to be run on a parked LSP while another 'PSC11 OF port is being tested. The CNTRSEL instruction can be used to load a count-down value into the counter register via the active scan chain. When the counter is enabled (via the CNTRON instruction), and the LSP is parked, the local TCKs will stop and be held low when terminal count is reached. The TCK counter is initialized with a value of "00000000" Hex upon reset. TABLE X. Reset Configurations for Registers Register Initial Hex Value 2 0 Instruction AA (IDCODElnstruction) Mode 8 8 LFSR 16 0000 32-Bit Counter 32 00000000 01 The SOFTRESETinstruction is provided to perform a "Level 2" reset of all LSP's of selected 'PSC110Fs. SOFTRESETforces all TMSL signals high, placing the corresponding local TAP Controllers in the Test-Logie-Reset state within five (5) TCKs cycles. The third level of reset is the resetting of individual local ports. An individual LSP can be reset by parking the port in the Test-Logie-Reset state via the PARKTLR instruction. To reset an individual LSP that is parked in one of the other parked states, the LSP must first be un parked via the UNPARK instruction. Special Features PORT SYNCHRONIZATION When a LSP is not being accessed, it is placed in one of the four TAP Controller states: Test-Logie-Reset, Run- Test/ Idle, Pause-DR, or Pause-IR. The 'PSC11 OF is able to park a local chain by controlling the local Test Mode Select outputs (TMSL(1-3) (see Figure 4). TMSLn is forced high for parking in the Test-Logic-Reset state, and forced low for parking in Run- Test/Idle, Pause-IR, or Pause-DR states. Local chain access is achieved by issuing the UNPARK instruction. The LSPs do not become un parked until the 'PSC110F TAP Controller is sequenced through a specified synchronization state. Synchronization occurs in the RunTest/Idle state for LSPs parked in Test-Logie-Reset or RunTest/Idle; and in the Pause-DR or Pause-IR state for ports parked in Pause-DR or Pause-IR, respectively. BIST SUPPORT The sequence of instructions to run BIST testing on a parked SCANPSC11 OF Bridge port is as follows: 1. Pre-load the Boundary register of the device under test if needed. 2. Initialize the TCK counter to 00000000 Hex. Note that the TCK counter is initialized to 00000000 Hex upon TestLogic-Reset, so this step may not be necessary. 3. Issue the CNTRON instruction to the 'PSC110F, to enable the TCK counter. 4. Shift the PARKRTI instruction into the 'PSC11 OF instruction register and 51ST instruction into the instruction register of the device under test. Figures 11 and 12 show the waveforms for synchronization of a local chain that was parked in the Test-Logie-Reset state. Once the UNPARK instruction is received in the instruction register, the LSPC forces TMSL low on the falling edge of TCKs. 5. Issue the CNTRSEL instruction to the 'PSC11 OF. 6. Load the TCK counter (Shift the 32-bit value representing the number of TCKL cycles needed to execute the BIST operation into the TCK counter register). http://www.national.com Bit Width MCGR 10-40 -a en o ..... Special Features (Continued) ..... o "'11 TL/F/11570-15 FIGURE 11. Local Scan Port Synchronization on Second Pass This moves the local chain TAP Controllers to the synchronization state (Run- Test/Idle), where they stay until synchronization occurs. If the next state of the 'PSC110F TAP Controller is Run-Test/Idle, TMSL is connected to TMSs and the local TAP Controllers are synchronized to the 'PSC110F TAP Controller as shown in Figure 12. If the next state after Update-IR were Select-DR, TMSL would remain low and synchronization would not occur until the 'PSC11 OF TAP Controller entered the Run- Test/Idle state, as shown in Figure 11. The LSPN can be unparked in one of seven different configurations, as specified by bits 0-2 of the mode register. Using multiple ports presents not only the task of synchronizing the 'PSC11 OF TAP Controller with the TAP Controllers of an individual local port, but also of synchronizing the individual local ports to one another. When multiple local ports are selected for access, it is possible that two ports are parked in different states. This could occur when previous operations accessed the two ports separately and parked them in the two different states. The LSP Controllers handle this situation gracefully. Figure 12 shows the UNPARKinstruction being used to access LSP1, LSP2, and LSP3 in series (mode register = "XXXOX111" binary). LSP1 and LSP2 become active as the 'PSC110F controller is sequenced through the Run-Test/Idle state. LSP3 remains parked in the Pause-DR state until the 'PSC11 OF TAP Controller is sequenced through the PauseDR state. At that point, all three local ports are synchronized for access via the active scan chain. Each local port has its own Local Scan Port Controller. This is necessary because the LSPN can be configured in any one of eight (8) possible combinations. Either one, some, or all of the local ports can be accessed simultaneously. Configuring the LSPN is accomplished with the mode register, in conjunction with the UNPARK instruction. BACKPLANE TAP LSP1 HISS TMSLl TMSU --------~~------+-- __________________________________________________- - J TL/F/11570-14 FIGURE 12. Synchronization of the Three Local Scan Ports (LSP1. LSP2. and LSP3) 10-41 http://www.national.com u. c ,... ,... o U) D.. Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (VeC> -0.5V to + 7.0V DC Input Diode Current (Ill) -20mA VI = -0.5V +20mA VI = Vee +0.5V DC Input Voltage (VI) - 0.5V to Vee + 0.5V DC Output Diode Current (10K) -20mA Vo = -0.5V +20mA Vo = Vee + 0.5V DC Output Voltage (Vo) -0.5V to Vee +0.5V DC Output Source/Sink Current (10) ± 50 mA DC Vee or Ground Current ± 50 mA per Output Pin DC Latchup Source or Sink Current ± 300 mA Junction Temperature SOIC +140°C Storage Temperature - 65°C to + 150°C 4000V ESO Last Passing Voltage (Min) Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply temperature, and output/input loading variables. National does not recom· mended operation of SCAN outside of recommended operation conditions. Recommended Operating Conditions Supply Voltage (VeC> SCANPSC110F 4.5V to 5.5V Input Voltage (VI) OVtoVee Output Voltage (Vo) Operating Temperature (TA) Commercial Military OVtoVee -40°C to + 85°C - 55°C to + 125°C Minimum Input Edge Rate dV/dt SCAN "F" Series Devices VIN from 0.8V to 2.0V Vee @ 4.5V. 5.5V 125 mV/ns DC Electrical Characteristics Commercial Symbol Parameter Military Commercial Vee (V) Conditions Typ Guaranteed Limits Minimum High Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 v VOUT = 0.1Vor Vee -0.1V Maximum Low Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1Vor Vee -0.1V VOH (TCKLn. TMSLn, TOOLn) Minimum High Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 4.4 5.4 V lOUT = -50/-LA VIN (TOls. TMSS. TCKs) = VIH VOH (TCKLn. TMSLn. TOOLn) Minimum High Output Voltage 4.5 5.5 3.86 4.86 3.7 4.7 3.76 4.76 V VOH (TOOs) Minimum High Output Voltage 4.5 5.5 3.15 4.15 3.15 4.15 3.15 4.15 V VOH (TOOs) Minimum High Output Voltage 4.5 5.5 2.4 2.4 2.4 2.4 V lOUT = -32mA All Outputs Loaded VOH (TOOs) Minimum High Output Voltage 4.5 5.5 2.4 2.4 2.4 2.4 V lOUT = -24mA All Outputs Loaded VOL (TCKLn. TMSLn. TOOLn) Maximum Low Output Voltage 4.5 5.5 0.1 0.1 0.1 0.1 V lOUT = +50/-LA VIN (TOls. ™Ss. TCKs) = VIL http://www.national.com 0.001 0.001 10-42 0.1 0.1 lOUT = -24mA VIN on 8(0.5) and TOI(1-3) = VIH. VIL All Outputs Loaded lOUT = -50/-LA "0 en o ..... ..... DC Electrical Characteristics (Continued) Commercial Symbol Parameter Vee (V) TA = 25°C Typ Military "T1 TA = TA = Units -55°C to + 125°C - 40°C to + 85°C Conditions Guaranteed Limits Maximum Low VOL (TCKLn .TMSLn. Output Voltage TOOLn) 4.5 5.5 0.36 0.36 0.50 0.50 0.44 0.44 VOL (TOOs) Maximum Low Output Voltage 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 VOL (TOOs) Maximum Low Output Voltage 4.5 5.5 0.55 0.55 0.55 0.55 VOL (TOOs) Maximum Low Ouput Voltage 4.5 5.5 0.55 0.55 liN (OE. TCKs.S(0-5» Maximum Input Leakage Current 5.5 ±0.1 IIN,MAX (TRST. TOILn. TDis. ™Ss) Maximum Input Leakage Current 5.5 IIN,MAX (TRST. TOILn. TOls. TMSs) Maximum Input Leakage Current IIN,MIN (TOls. TMSs. TRST. TOILn) V V lOUT = +24 mA VIN on S(0-5) and TOI(1-3) = VIH. VIL All Outputs Loaded lOUT = + 50 p.A V lOUT = +48mA All Outputs Loaded 0.55 0.55 V lOUT = +64mA All Outputs Loaded ±1.0 ±1.0 p.A 2.8 3.7 3.6 ,Il-A 5.5 -385 -385 -385 p.A Minimum Input Leakage Current 5.5 -160 -160 -160 p.A 5.5 1.6 1.5 ICCT Maximum Iccllnput ICCT (TOls. TMSs. TRST.TOIU Maximum Icc/Input Icc Maximum Quiescent 5.5 Supply Current ICC, MAX Maximum Quiescent 5.5 Supply Current 5.5 Minimum Dynamic IOLD (TCKLn. TMSLn. Output Current TOOLn) IOLD (TOOs) o Commercial Minimum Dynamic Output Current 0.6 = = Vcc or GNO VIN = Vcc VIN = GNO VIN = GNO mA VIN = Vcc -2.1V 1.75 1.65 rnA VIN = Vcc -2.1V Test one at a time with others floating 16 168 88 p.A TOls. TMSs. TRST. TOIL = Vcc 2.35 2.5 2.4 rnA TOls. TMSs. TRST. TOIL = GNO 50 75 rnA YOLO = 1.65V max VIN (DE) = VIL (Note 2) 63 94 rnA YOLO = 0.8V VIN (TRSn = VIH (Note 2) 0.6 5.5 5.5 VIN VIN 94 10-43 http://www.nationaLcom u.. .... .... o o DC Electrical Characteristics (Continued) en a. Commercial Parameter Symbol Vee (V) TA Military = 25°C Typ Minimum Dynamic 10HD (TCKln. ™Sln• Output Current TDOln) Commercial TA = TA = Units -55°C to + 125°C - 40°C to + 85°C Conditions Guaranteed Limits 5.5 -50 -75 rnA VOHD = 3.85V max (Note 2) VOHD = 2.0V max (Note 2) 10HD (TDOs) Minimum Dynamic Output Current 5.5 -40 -27 -40 mA loz Maximum TRI·STATE® Leakage Current 5.5 ±0.5 ±10.0 ±5.0 JlA VIN (OE) = VIH VIN (TRST) = Vil Vo = Vee. GND -100 -100 -100 mA min Vo = O.OV (Note 3) los (TDOs) Output Short Circuit Current 5.5 Note 2: Maximum test duration of 2 ms. One output loaded at a time. Note 3: Maximum test duration not to exceed 1 second. Noise Specifications Commercial Symbol Parameter Vee (V) TA = +25°C Military TA Type VOlP VOlV VOHP VOHV VIHD VllD Commerlcal = -55°C to + 125°C TA = -40°C to + 85°C Units Conditions Guaranteed Limits Quiet Output Maximum Dynamic 5.0 VOL 0.3 0.6 V Figure 14 (Note 4) Quiet Output Minimum Dynamic VOL 0.3 -0.6 V Figure 14 (Note 4) Quiet Output Maximum Dynamic 5.0 VOH + 0.5 VOH + 1.0 VOH V Figure 14 (Note 5) Quiet Output Minimum Dynamic VOH 5.0 VOH - 0.7 VOH - 1.2 V Minimum High Dynamic Input Voltage Level 5.5 1.9 2.2 2.2 2.2 V (Note 6) Maximum Low Dynamic Input Voltage Level 5.5 1.4 0.8 0.8 0.8 V (Note 6) 5.0 Figure 14 Note 4: Maximum number of outputs that can switch simultaneously is n. (n -1) outputs are switched LOW and one output held LOW. Note 5: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched HIGH and one output held HIGH. Note 6: Maximum number of data inputs (n) switching. (n -1) input switching OV to 3V. Input under test switching 3V to threshold (VILO). http://www.national.com 10·44 (Note 5) AC Electrical Characteristics Symbol tpHL. tpLH tpHL. tpLH tpHL. tpLH Parameter Propagation Delay TCKs J- to TCKLn TCKs i to TCKLn Vee (V) Commercial Military (Preliminary) TA = +25°C Cl = 50pF TA = -55°C to + 125°C CL = 50pF Commercial TA = -40°C to + 85°C CL = 50 pF Units Fig. No. Min Typ Max Min Max Min Max 5.0 3.0 2.5 8.5 8.5 12.5 12.5 3.0 2.5 15.0 15.0 3.0 2.5 13.5 13.5 ns 13 5.0 3.0 3.0 10.0 10.0 14.0 14.5 3.0 3.0 16.5 17.0 3.0 3.0 15.0 15.5 ns 13 5.0 3.5 4.5 15.0 14.5 23.0 21.5 3.5 4.5 26.5 24.5 3.5 4.5 25.0 23.0 ns 13 3.0 2.5 9.5 9.0 14.5 13.5 3.0 2.5 17.0 16.5 3.0 2.5 15.5 15.0 ns 13 Propagation Delay TCKs TCKs JJ- to TDOLn to TDOLn Propagation Delay TCKs TCKs J- to TMSLn J- to TMSLn tpHL. tpLH Propagation Delay TCKs J- to TDOs TCKs J- to TDOs 5.0 tpHL. tpLH Propagation Delay TMSs to TMSLn 5.0 2.5 1.5 8.0 7.5 12.0 12.0 2.5 1.5 14.5 14.5 2.5 1.5 13.0 13.0 ns 13 tpLH Propagation Delay TRST to TMSLn 5.0 4.5 19.0 26.5 4.5 30.0 4.5 28.5 ns 15 tpZL. tpZH Enable Time TCKs J- to TDOLn TCKs J- to TDOLn 5.0 4.0 3.0 12.5 11.0 18.5 15.5 4.0 3.0 22.5 19.0 4.0 3.0 20.5 17.0 ns 5.0 1.5 2.0 7.5 8.5 12.0 14.0 1.5 2.0 15.5 17.0 1.5 2.0 13.5 15.0 ns 5.0 4.0 2.5 12.0 9.0 17.0 13.5 4.0 2.5 20.5 16.5 4.0 2.5 18.5 14.5 ns TCKs J- to TDOs TCKs J- to TDOs 5.0 2.0 2.0 9.0 9.5 13.0 14.0 2.0 2.0 16.5 17.5 2.0 2.0 14.5 15.5 ns tpZL. tpZH Enable Time OEtoTDOLn 5.0 3.0 3.0 10.0 10.0 15.0 14.0 3.0 3.0 19.5 17.0 3.0 3.0 17.5 15.0 ns 16 tpLZ. tpHZ Disable Time OE toTDOLn 5.0 1.0 1.0 7.0 8.0 11.0 13.0 1.0 1.0 14.0 15.5 1.0 1.0 12.0 13.5 ns 16 tpZL. tpZH Enable Time OE toTMSLn 5.0 2.0 1.5 8.0 6.5 11.5 10.0 2.0 1.5 14.5 13.0 2.0 1.5 12.5 11.0 ns 16 tpLZ. tpHZ Disable Time OE toTMSLn 5.0 1.0 1.0 5.0 6.0 9.0 10.0 1.0 1.0 12.0 12.5 1.0 1.0 10.0 10.5 ns 16 tpZL. tpZH Enable Time OEtoTCKLn 5.0 2.0 1.5 8.0 6.5 11.5 10.0 2.0 1.5 14.5 13.0 2.0 1.5 12.5 11.0 ns 16 tpLZ. tpHZ Disable Time OE to TCKLn 5.0 1.0 1.0 5.0 6.0 9.0 10.0 1.0 1.0 12.0 12.5 1.0 1.0 10.0 10.5 ns 16 tpLZ. tpHZ Disable Time TRSTtoTDOs 5.0 2.5 3.0 11.0 12.0 16.5 16.5 2.5 3.0 20.0 20.0 2.5 3.0 18.0 18.0 ns 15 tpLZ. tpHZ Disable Time TRST to TDOLn 5.0 2.5 1.5 11.5 11.5 17.5 17.5 2.5 1.5 21.0 21.0 2.5 1.5 19.0 19.0 ns 15 tpLZ. tpHZ tPZL. tpZH tpLZ. tpHZ Disable Time TCKs J- to TDOLn TCKs J- to TDOLn Enable Time TCKs J- to TDOs TCKs J- to TDOs Disable Time 10·45 http://www.national.com u.. o ......- oU) AC Electrical Characteristics (Continued) D. Symbol Parameter Vee (V) Commercial Military (Preliminary) Commercial TA = +25°C Cl = 50 pF TA = -55°C to + 125°C Cl = 50pF TA = -40°C to + 85°C Cl = 50pF Typ Units Fig. No. Guaranteed Minimum ts Setup Time TMSs to TCKs t 5.0 3.5 B.O B.O B.O ns 13 tH Hold Time TMSs to TCKs t 5.0 -0.5 4.0 4.0 4.0 ns 13 ts Setup Time TOls to TCKs t 5.0 1.5 6.0 6.0 6.0 ns 13 tH Hold Time Tdls to TCKs t 5.0 1.0 4.0 4.0 4.0 ns 13 ts Setup Time Sn to TCKs J, (in Update-DR state) 5.0 7.5 12.5 12.5 12.5 ns Hold Time Sn to TCKs J, (in Update-DR state) 5.0 -3.0 0.0 0.0 0.0 ns Setup Time Sn to TCKs (in Capture-DR or Capture-fR state) 5.0 0.0 4.0 4.0 4.0 ns Hold Time Sn to TCKs (in Capture-DR or Capture-fR state) 5.0 1.5 6.0 6.0 6.0 ns ts Setup Time TOILn to TCKs t 5.0 -1.5 2.0 2.0 2.0 ns 13 tH Hold Time TOILn to TCKs t 5.0 2.0 6.0 6.0 6.0 ns 13 ts Setup Time OEtoTCKs (in Capture-DR state) 5.0 0.0 4.0 4.0 4.0 ns Hold Time OEtoTCKs (in Capture-DR State) 5.0 0.0 4.0 4.0 4.0 ns tw Clock Pulse Width TCKs (H or L) 5.0 16.0 20.0 24.0 24.0 ns 13 tWl Clock Pulse Width TRST(L) 5.0 6.0 10.0 10.0 10.0 ns 15 tH ts tH tH t t t t http://www.national.com 10-46 "tJ en o AC Electrical Characteristics (Continued) Symbol Vee (V) Parameter -10 -10 Commercial Military (Preliminary) Commercial TA = +25°C CL = 50pF TA = -55°C to + 125°C CL = 50 pF TA = -40°C to +S5°C CL = 50 pF Typ tREe Recover Time TCKs i from TRST 5.0 tOSHL. tosLH Output-to-Output Skew TCKLn tOSHL. tOSLH FMAX -2.0 o '11 Units Fig. No. Guaranteed Minimum 2.0 2.0 2.0 ns 15 5.0 1.0 1.0 1.0 ns (Note 7) Output-to-Output Skew TMSLn (unparked) 5.0 2.0 2.0 2.0 ns (Note 7) Maximum Clock Frequency 5.0 25 MHz Note 7: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device. The specification applies to any outputs switching HIGH to LOW (toSHU. or LOW to HIGH (toSLH)' The specification is guaranteed but not tested. CapaCitance Typ Units Conditions CIN Symbol Input Pin Capacitance Parameter 5.0 pF Vee is Open COUT Output Pin Capacitance 6.5 pF Vee is Open CPO Power Dissipation Capacitance 50 pF Vee = 5.0V 10-47 http://www.national.com LL C ,... ,... o AC Waveforms U) )1' D.. tw ts ::J< I '''" )K: \i ts * * ~ TCKt.n ~ I 0-- tpD )K ~ ts )K )K -----------------~--\i TDctn I-tpD Tl/F/11570-16 FIGURE 13. Waveforms for an Unparked SCANPSC110F Bridge In the SHIFT-DR (IR) TAP Controller State X. .______,.,x'---- o:r~~i~ ____ - V_-_- ~ ~ ~ ~ ~~~P QUIET OUTPUT UNDER TEST YaH " ' - - - - YOl OHV ~~ ~~~~ ~ ~ ~== ===~ ~~~P OlV Note A: VOHV and VOlP are measured with respect to ground reference. :s: 150 ps. FIGURE 14. Quiet Output Noise Voltage Waveform Note B: Input pulses have the following characteristics: f = 1 MHz, tr = 3 ns, tf = 3 ns, skew http://www.national.com 10·48 Tl/F/11570-13 "'tJ AC Waveforms en o .... (Continued) .... o 1-------twL-----~ "T1 TRST lODt.n lODe TCKS TL/F/11S70-1B FIGURE 15. Reset Waveforms ". \. _I loiS --I tEN .1 I , '\I I f - 101 \I c::::1 tEN I I , '\I I I· I-Iols ~N ." TCl < m Board #2 3 "C LSP3 LSP1 LSP3 CD LSP1 '0 o ;:!. 5° c m I ...... o &. c.l 1 I Bridge #1 SCANPSCll0 f 1000001 SLOT 5:0 1 LSP2 J Parallel Bus Interface Logic 1 SCAN 182245A 1 ~ I So .. I Bridge #2 SCANPSCll0 f J 1000010 1 I LSP2 • • • • Boards #3 - #8 Parallel Bus Interface Logic 1SCAN 182245A 1 SLOT 5:0 I TRST TCK Backplane wiring to slots # 3 - # 10 HAS TOO TOI TUF/11570-21 FIGURE 19. Testing the Backplane Interconnections :::T 1 ::I aci" ::I !!!. 83 m :lOU:lSd w U) c( w z t!lNational Semiconductor ~ U) SCAN EASE SCAN Embedded Application Software Enabler General Description Features National Semiconductor SCAN EASE, a suite of software tools, enables ATPG or custom generated test vectors to be embedded within an IEEE 1149.1 compatible system, administers test control and provides remote access. EmbedPrep-Embedded Test Preparation includes embedded test development tools that convert ATPG output files, like SVF or PAT, into Embedded Vector Format (EVF) for use with EmbedTest. EmbedTest-Embedded Test application code includes high level code that controls the test flow and communications between the embedded system and a remote system test administrator. It includes function libraries for controlling IEEE 1149.1 compliant boundary scan chains (SCAN LI B), and reading test vectors stored in EVF (EVFLlB). EmbedTest compiles to run on any microprocessor supporting ANSI-C. EmbedComm-Embedded Test Communication provides a Windows$ GUI for remote access to EmbedTest running on an embedded system. • Processor independent-runs on big/little end ian and memory- and lID-mapped architectures • Compatible with Teradyne VICTORYTM ATPG and JTAG Technology BTPGTM tools (others supported upon request) • Provides automated translation, application and evaluation of ATPG-generated tests in an embedded system environment • Includes a Scan Function Library and National's Embedded Boundary Scan Controller SCANPSC100F device driver to support custom or non-ATPG generated vector applications • Supports embedded test data log for diagnostic processing • Includes Microsoft Windows GUI and serial communication code for system administration and remote testing • Supports SCANPSC110F Hierarchical and Multidrop JTAG Addressable Port architecture Order Number Description SCANEASEV100BSW SCANEASEV100CSW SCANEASEV100MSW Basic Software License Corporate License Maintenance Contract Embedded Test Hardware SCAN EASE Software • EmbedPrep .uP Compliers C ATPG Output file to Embedded Vector File (EVF) • EmbedTest ANSI C Portable Embedded Test and Serial Communication Code ,.. ROM 1== t--11 -.1...1.---1 I:::::: I L.....-----I • EmbedComm Windows GUI for Remote Access to Embedded System RAM 1..-_ _....~ SCAN PSC100F t +1149.1 Bus TL/F/12120-1 FIGURE 1. SCAN EASE Enables ATPG Test Vectors to be Embedded http://www.national.com 10-54 ~----------------------------------------------------------------~~ (') Functional Description bedTest commands, such as configuration, reporting test results, downloading new tests and uploading data logs, are performed over this serial interface. SCAN EASE does much of the programming work required by programmers to convert a tester manufacturer's test vectors into embedded test vectors; manages and executes the test; and provides communications code to download and initiate tests remotely. SCAN EASE has a user-friendly Windows GUI interface to simplify test administration. Compatibility Embedded Application Software Enabler ~r--~~--..,/'re.... ~ ~ "JTAG Toch. 81PON) m Designed for portability and flexibility, both EmbedTest and EVF run on both big endian and little endian memory architectures; the SCANPSC100F can be either I/O-mapped or memory-mapped. This flexibility allows same code and test vectors to run on various machines simply by recompiling with a C-compiler for the target machine. EmbedTest also provides a set of functions that enable communication between the embedded system and a serial interface for a system administrator or remote computer. Em- ATPG (e.g., Teradyne VictoryTM ~ Supporting Hardware Several of the board level EVF files can be concatenated to create a system level test. Partitioning tests enables EmbedTest to isolate and report pass/fail information to the partitioned level-board, module, etc.-without running diagnostic software. EVF test files can be placed in ROM for power-up self test or down loaded to RAM. and m » The SCANPSC100F Embedded Boundary Scan Controller is a 28·lead IC designed to provide a simple, efficient interface between a microprocessor and the 1149.1 Test Access Port (TAP) signals. Its 8-bit asynchronous interface connects directly to the local bus of many popular processors and allows the test clock (TCK) to run at a different clock speed than the local bus. The SCANPSC100F supports TCK frequencies up to 25 MHz. The test development process for embedded system test begins with generating tests using an off-the-shelf ATPG tool. A separate set of tests for each board type in the system is created during manufacturing test development. These tests can be reused for embedded test, too. National's SCAN EASE tools compile test vectors stored in Serial Vector Format (SVF) or Pattern Format (PAD into EVF, a compact binary format appropriate for embedded applications. ~ » z EmbedComm Windows™ GUI for Remote Access or ~~ commU!ication Link ~ EmbedTest on Embedded System TL/F/12120-2 FIGURE 2. SCAN EASE Works with Existing Board Test Vectors m 10·55 http://www.national.com U.I ~ U.I Z c:( o U) System Level Test Support Partitioning tests is important to achieve built-in fault isolation. A natural place to partition tests is at the board or module interface. Design boards with a 100% scannable interface to the system back plane by buffering all back plane signals with boundary scan compliant components like National's 18-bit wide SCAN Test Access Logic CMOS and ABT devices. A 100% scannable interface enables ATPG to generate 100% fault coverage on the back plane. The SCAN ABT Test Access Logic interface with power-up TRI-STATE~ for live insertion allows board level tests to be performed without disturbing back plane signals, too. The Hierarchical and Multidrop JTAG Addressable Port SCANPSC110F provides an interface from a single IEEE 1149.1 TAP to "local TAPs" on boards or modules that reside within a system. This enables boards to be pulled or added to the system without breaking the serial scan chain, and makes it possible to perform an interrogating infrastructure test to determine the system configuration before applying board-level tests. The SCANPSC11 OF facilitates partitioning of boards and modules within the system for improved fault isolation. ~ ~ IEEEE Std. 1149.1 Multi-Dropped System Test Bus TlIF/12120-3 FIGURE 3. Embedding SCAN EASE for System Level Test More Detailed Information about SCAN EASE An application note is available on National's Web Site (http://www.nsc.com). and through the National Technical Support Center (1-800-272-9959) to provide more detailed information on the SCAN EASE architecture and API (applications programming interface). The SCAN EASE product includes a reference manual to detail the EVF format, embedded code architecture and functions which comprise the SCAN EASE tool set. http://www.national.com 10·56 Section 11 Ordering Information and Physical Dimensions III http://www.national.com Section 11 Contents Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSOP Package Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dry Pack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Drawings and Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bookshelf Distributors Worldwide Sales Offices 11-2 11-3 11-3 11-4 11-5 t1 o... Co ...S· CD Nati ona I Semiconductor ca S" o 3 -... -o· Ordering Information and Physical Dimensions Ordering Information SCAN S.dally C"t"II.d Access Network T J 18 ~~ T SS -r- m L C ::::I m ::::I Co X -a ::::I" ~ c:;. Sp";" V";a",,, X = Tape and Reel OB = Military grade device with environmental and burn-in processing 18-Bit Test Access logic Function Type Technology /Designator T = TTL Input TTL Output CMOS Device C = CMOS Input/Output CMOS Device B = Bipolar TTL Device E = ECl Device A = BiCMOS Device F = TTL Input/CMOS Output Ct.40S Device !!. IC 3· Temperature Range C = Commercial (-40 0 C to +85°C) M Military (-55 0 C to + 125 O C) CD ::J Package Code SS = 25 mil Pitch (JEDEC) SSOP f = 25 mil Pitch Ceramic Flatpak en en o· ::J = TUF/11596-9 SCAN Serially Controlled Access Network T Part Number PSC 100 = Embedded Boundary Scan Controller PSC 11 0 Hierarchical and Multidrop Addressable JTAG Port PSC100 F XXXX ~ J = Technology /Designator T = TTL Input/TTL Output Ct.40S Device C = CMOS Input/Output CMOS Device B = Bipolar TTL Device E = ECl Device A = BiCMOS Device f = TTL Input/CMOS Output CMOS Device Package/Temp Designator = 50 ml Pitch (JEDEC) SOIC SC Temperature Range -40°C to +85°C DMOB = Ceramic DIP, t.4ilitary Temperature Range, 883 Processing lMOB = leadless Chip Carrier, Military Temperature Range, 883 Processing FMOB = f1atpak, t.4i1itary Temperature Range, 883 Processing TL/F/11596-10 SSOP Package Thermal Information THERMAL RESISTANCE FOR SSOP PACKAGES Package Paddle Dimensions (mils) 8JA 8JA 8JA 8JA OLFPM 500LFPM ("C/W) 900LFPM (OC/W) 8JC (OC/W) 225 LFPM ("C/W) N/A 20LD SSOP 110x144 127.0 99.4 90.1 78.5 24LDSSOP 98 x 106 117.0 91.4 82.7 73.5 N/A 24LDSSOP 120 x 150 100.8 81.3 72.1 65.7 25.7 48LDSSOP 190 x 190 75.5 58.0 51.5 44.0 21.5 56LDSSOP 190 x 190 67.8 53.0 47.4 42.1 18.5 THERMAL RESISTANCES FOR THE MILITARY FLATPAK PACKAGES Cavity Dimensions (mils) 8JA 8JA 8JA 8JA OLFPM ("C/W) 225LFPM ("C/W) 500LFPM ("C/W) 900 LFPM 48LD 250x250 74.4 58.1 50.0 43.9 6.6 56LD 250x250 59.8 47.9 39.0 35.1 3.4 Package 11-3 8JC ("C/W) http://www.national.com II o C o "iii c r------------------------------------------------------------------------------------, CD E is ca u "~ .c Dry Pack Dry Pack is moisture proof packing that is used to store SSOP devices to reduce the susceptibility of the "popcorn effect". Humidity collects inside the package by seeping through the plastic. If moisture is inside the device when the unit goes through a solder machine, the heat quickly changes the moisture to steam, and the pressurized steam pops open the package ... thus the popcorn effect. The Dry Pack bag is hermetically sealed and contains a small bag of desiccant which further helps to reduce moisture. All of the SCAN 5S-pin SSOP devices will be shipped in Dry Pack bags. Included with the devices will be the following warning label and instructions for rebake: D. "C C CO Dry Pack Warning Label for Surface Mount Packages C o as :;= ... E o .5 en tfI Nat ion a I S em i con due tor A '0 ELECTROSTATIC SENSITIVE DEVICES Require Proper Handling Procedures c "i: CD ... o "C CAUTION This Bag Contains MOISTURE SENSITIVE DEVICES 1. Shelf life in sealed bag: 24 months at <40°C and <90% Relative Humidity (RH). 2. Upon opening this bag, devices to be subjected to I.R., V.P.R. or equivalent process must be: a. Mounted within 48 hours at factory conditions of <30°C/SO% RH, or b. Stored at < 10% RH. 3. Devices require baking, before mounting, if: a. Humidity Indicator Card is > 20% when read at 23°C ± 5°C. b. 2a or 2b are not met. 4. If baking is required, devices may be baked for: a. 19 hours at 40°C + 5°C/ - O°C and < 5 % RH for low temperature device containers, or b. 8 hours at 125°C ± 5°C for high temperature device containers. Dry-Pack Seal Date: _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ __ (IF BLANK, SEE BAR CODE LABEL) BAG SN 045317 Please follow these instructions carefully to avoid the popcorn effect. http://www.national.com 11-4 MFRLOTNo. C32729 ,------------------------------------------------------------------------------------, ~ ::r '< en (;' IfINational Semiconductor e!- o 3' CD ::l 28 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E28A All dimensions are in inches r 0.015 MIN TYP PIN # 1 INDEX 450 x 0.015;1:0.010 I 1.0.300;1:0.005 TYP· - 1"'i"'V 26 .,...,. ...... I - - -+--- - - II 4- 0•075 1 ,.. ,.. ,.. 0.063 r 0.003 MIN TYP I ~JO.015 MAX iU-l.l-r TYP -1 0.022 MAX TYP ! 1'006 "'" ~ ~ ~ I [ I 4 ~ , en 0' ::l en T TYP DETAIL A SIDE VIEW TOP VIEW E28A (REV 0) 28 Lead Ceramic Dual-in-Line Package NS Package Number J28A All dimensions are in inches (millimeters) 1.49D (37.846) MAX I ---------------J.-----P";~~' ) I .A"LASS D.025 (D.635) RAD D.514-0.526 ~~~~~~~~~~~~~~~~~~~-'~3.3" D.D3D-D.055 (D.762-1.397) RAD TYP D.18D (4.572) MAX 0.225 (5.715) LrT"""-------·------+-+-----~::::=::::1 950 '-5" Il---' D.D08-D.012_ (D.2D3-D.3D5) ---lI D685 +D.D25 -D.D6D +D.635) ( 17 .4D -1.524 II D.D6D-D.l0D 11.524-2.540) I ----j II D.l0D !D.01D (2.54D -D.254) 11~rj D.018 -D.DD2 (0.457 ;0.5D8) D.125 (3.175) MIN I 11-5 http://www.national.com o o "iii cQ) C r---------------------------------------------------------------------------~ 28 Lead (O.300" Wide) Molded Small Outline Package, JEDEC NS Package Number M28B E C All dimensions are in inches (millimeters) 1U u "~ .c INDEX AREA A. 0.420 (10.65) 0.393 (10.00) ! I' 0.030 (0.75)x45 0 0.009 (0.25) -I 0.713 (18.10) 0.696 (17.70) (0'~32) --1~tl 0.013 0.009 (0.23)(;,,:::::====:::::;::+==~" L ! \Jl~: 0.050 (1.27) BSC 0.020 (0.49) 0.013 (0.35) =-_ 0.105 (2.65) 0.092 (2.35) 0.012 (0.30) L 0.003 (0.10) 0.050 (1.27) 0.015 (0.40) W28B (REV A) 56 Lead (O.300" Wide) Molded Shrink Small Outline Package, JEDEC NS Package Number MS56A All dimensions are in inches [millimeters] f 0.395 0.420 [10.04-10.66] LEAD # 1 IDENT 1-910.010[0.25]1 D 1 AMI BM 1 II 0.008 - 0.012 TYP --I j.1 [0.21 - 0.30] .. --I j.- 0.025 [0.63] TYP GAUGE PL:j 0.010 [0.25] 1-0-10.010[0.25] @IDIAM IBM 1 91 I 0.005 - 0.009 [0.13 - 0.22] 1]."0-0.0" [0.51 - 1.01] DETAIL E TYP [2~::: ~:~~j ij 45 0 x 0.015-0.025 SEATING PLANE ~[0'39 - 0.63] . t -QOJlQ.OJUltlOAOAOJ1lUtOJUUtOJ1lUtOP . 0.025 TYP [0.64] http://www.national.com 0.008 - 0.016 TYP [0.21 - 0.40] - D- - C00 - 80 TYP 11·6 ~S56A (REV A) 28 Lead Cerpack NS Package Number WA28D ~ _ All dimensions are in inches [millimeters] I: 0.740 ~----[18.80]t.AAX 0.045-0.090 [1.14-2.29] t-r-0.026-0.045 I I [0.66-1.14] - r- [0.13] 0.005 MIN TYP 28 15 f 0.250-0.370 o.1".....&.I.. . . &.I.I. &. I. . . ",.'" " . L.L.u. .&.&. I~ ""\~'·'OI ....... [10.16] t.AAX ) 0.340-0.380 GlL,","""'I"I""lI"'l""f""""""~""""""'I"I""'I"'I""I',.....,,~'·651 I- ~~'II / PIN # 1 II 0.250-0.370 [6.35-9.40] ~ IDENT ~ ~ 0.004-0.009 [0.1 0-0.23] 1 __ I 14 I I I 0.050 -1 j+- [1.27] 0.005-0.018 [0.13-0.46] -~ TYP WA28D [REV Al _ I-- 0.015-0.022 TYP [0.38-0.56] 56 Lead Cerpack NS Package Number WA56A All dimensions are in inches [millimeters] -- 10 11 0.070-0.100 [1.78-2.54] 0.040-0.054 _ [1.02-1.37] 0.740 t.AAX [18.80] ~ 0.005 t.AIN TYP 56 [0.13] J n 29 0.250-0.350 [6.35-8.89] I'" ~ I'" 0.400 [10.16] MAX GLASS D 0.376-0.384 [9.55-9.75] -i L~ PIN #1 IDENT /lI 0.250-0.350 [6.35-8.89] II 0.004-0.009 TYP 1~l -11-[0.10-0.23] -l11 ~ ~ 0.006-0.0 [0.15-0.25] 0.008-0.012 TYP [0.20-0.30] 11-7 I I ~ 28 II - 0.025 TYP -l1--[0.64] III WA56A [REV Al http://www.national.com NOTES NOTES NOTES NOTES NOTES NOTES NOTES NOTES NOTES NOTES NOTES NOTES NOTES t!JNational Semiconductor Bookshelf of Technical Support Information National Semiconductor Corporation recognizes the need to keep you informed about the availability of current technical literature. This bookshelf is a compilation of books that are currently available. The listing that follows shows the publication year and section contents for each book. For datasheets on new products and devices still in production but not found in a databook, please contact the National Semiconductor Customer Support Center at 1-800-272-9959. We are interested in your comments on our technical literature and your suggestions for improvement. Please send them to: Technical Communications Dept. M/S 16-300 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 ADVANCED BiCMOS LOGIC (ABT, BiCMOS SCAN, LOW VOLTAGE BiCMOS, EXTENDED TTL TECHNOLOGY) DATABOOK-1996 ABT Description and Family Characteristics • ABT Ratings, Specifications and Waveforms ABT Applications and Design Considerations • Quality and Reliability SCAN18xxxA BiCMOS 5V Logic with Boundary Scan. 74LVT Low Voltage 8iCMOS Logic VME Extended TTL Technology for Backplanes. Advanced BiCMOS Clock Generation and Support ADVANCED BIPOLAR LOGIC FAST®, FASTr™, ALS, AS DATABOOK-1995 Introduction to Advanced Bipolar Logic Families • FAST /FASTr/ ALS/ AS. Family Characteristics Ratings, Specifications and Waveforms • Design Considerations • Datasheets • Ordering and Packaging Information APPLICATION SPECIFIC ANALOG PRODUCTS DATABOOK-1995 Audio Circuits • Video Circuits • Automotive • Special Functions • Surface Mount ASIC DESIGN MANUAL/GATE ARRAYS & STANDARD CELLS-1987 SSI/MSI Functions • Peripheral Functions • LSIIVLSI Functions • Design Guidelines. Packaging CLOCK GENERATION AND SUPPORT (CGS) DESIGN DATABOOK-1995 Low Skew Clock Buffers/Drivers • Video Clock Generators • Low Skew PLL Clock Generators Crystal Clock Oscillators COP8™ DATABOOK-1994 COP8 Family • COP8 Applications • MICROWIRE/PLUS Peripherals • COP8 Development Support CROSSVOLTTM LOW VOLTAGE LOGIC SERIES DATABOOK AND DESIGN GUIDE-1996 LCX Family. LVX Translator Family. LVX Bus Switch Family. LVX Family. LVQ Family. LVT Family ALCX Family • GTL Family DATA ACQUISITION DATABOOK-1995 Data Acquisition Systems • Analog-to-Digital Converters • Digital-to-Analog Converters • Voltage References Temperature Sensors. Active Filters. Analog Switches/Multiplexers. Surface Mount DATA ACQUISITION DATABOOK SUPPLEMENT-1992 New devices released since the printing of the 1989 Data Acquisition Linear Devices Databook. http://www.national.com DISCRETE SEMICONDUCTOR PRODUCTS DATABOOK-1989 Selection Guide and Cross Reference Guides • Diodes • Bipolar NPN Transistors Bipolar PNP Transistors. JFET Transistors. Surface Mount Products. Pro-Electron Series Consumer Series • Power Components • Transistor Datasheets • Process Characteristics DRAM MANAGEMENT HANDBOOK-1993 Dynamic Memory Control • CPU Specific System Solutions • Error Detection and Correction Microprocessor Applications EMBEDDED CONTROllERS DATABOOK-1992 COP400 Family • COP800 Family • COPS Applications • HPC Family • HPC Applications MICROWIRE and MICROWIRE/PLUS Peripherals • Microcontroller Development Tools ETHERNET DATABOOK-1996 Integrated Network Interface Controller Products. 10 Mb/s Physical Layer Transceivers and ENDECs 10 Mb/s Repeater Interface Controller Products. 100 Mb/s Fast Ethernet Protocol Products Glossary and Acronyms FDDI DATABOOK-1994 Datasheets • Application Notes F100K ECl lOGIC DATABOOK & DESIGN GUIDE-1992 Family Overview • 300 Series (Low-Power) Datasheets • 100 Series Datasheets • 11 C Datasheets Design Guide. Circuit Basics • Logic Design. Transmission Line Concepts • System Considerations Power Distribution and Thermal Considerations. Testing Techniques. 300 Series Package Qualification Quality Assurance and Reliability • Application Notes FACTTM ADVANCED CMOS lOGIC DATABOOK-1993 Description and Family Characteristics • Ratings, Specifications and Waveforms Design Considerations. 54AC174ACXXX. 54ACT174ACTXXX. Quiet Series: 54ACQ174ACQXXX Quiet Series: 54ACTQ174ACTQXXX. 54FCT174FCTXXX. FCTA: 54FCTXXXAl74FCTXXXAlB FAST® APPLICATIONS HANDBOOK-1990 Reprint of 1987 Fairchild FAST Applications Handbook Contains application information on the FAST family: Introduction. Multiplexers. Decoders. Encoders Operators. FIFOs • Counters • TTL Small Scale Integration • Line Driving and System Design FAST Characteristics and Testing • Packaging Characteristics HIGH-PERFORMANCE BUS INTERFACE DATABOOK-1994 QuickRing. Futurebus+ /BTL Devices. BTL Transceiver Application Notes. Futurebus+ Application Notes High Performance TTL Bus Drivers • PI·Bus • Futurebus + /BTL Reference IBM DATA COMMUNICATIONS HANDBOOK-1992 IBM Data Communications • Application Notes INTERFACE DATABOOK-1996 LVDS Circuits, Bus Circuits, Data Transmission Circuits, System Design Guide liNEAR APPLICATIONS HANDBOOK-1994 The purpose of this handbook is to provide a fully indexed and cross-referenced collection of linear integrated Circuit applications using both monolithic and hybrid circuits from National Semiconductor. Individual application notes are normally written to explain the operation and use of one particular device or to detail various methods of accomplishing a given function. The organization of this handbook takes advantage of this innate coherence by keeping each application note intact, arranging them in numerical order, and providing a detailed Subject Index. lOW VOLTAGE DATABOOK-1992 This databook contains information on National's expanding portfolio of low and extended voltage products. Product datasheets included for: Low Voltage Logic (lVQ), Linear, EPROM, EEPROM, SRAM, Interface, ASIC, Embedded Controllers, Real Time Clocks, and Clock Generation and Support (CGS). http://www.national.com MASS STORAGE HANDBOOK-1989 Rigid Disk Pulse Detectors • Rigid Disk Data Separators/Synchronizers and ENDECs Rigid Disk Data Controller • SCSI Bus Interface Circuits • Floppy Disk Controllers • Disk Drive Interface Circuits Rigid Disk Preamplifiers and Servo Control Circuits • Rigid Disk Microcontroller Circuits • Disk Interface Design Guide MEMORY DATABOOK-1994 FLASH. CMOS EPROMs • CMOS EEPROMs • PROMs • Application Notes MEMORY APPLICATIONS HANDBOOK-1994 FLASH • EEPROMs • EPROMs • Application Notes OPERATIONAL AMPLIFIERS DATABOOK-1995 Operational Amplifiers. Buffers. Voltage Comparators. Active Matrix/LCD Display Drivers Special Functions • Surface Mount PACKAGING DATABOOK-1993 Introduction to Packaging. Hermetic Packages. Plastic Packages. Advanced Packaging Technology Package Reliability Considerations • Packing Considerations • Surface Mount Considerations POWER IC's DATABOOK-1995 Linear Voltage Regulators • Low Dropout Voltage Regulators • Switching Voltage Regulators Motion Control • Surface Mount PRODUCTS FOR WIRELESS COMMUNICATIONS-1996 Radio Transceiver Components • Baseband Processing Components • Control and Signal Processing Components Non-Volatile Memory • Audio Interface Components • Support Circuitry • Power Management Complete Cordless Phone Solution PROGRAMMABLE LOGIC DEVICE DATABOOK AND DESIGN GUIDE-1993 Product Line Overview • Datasheets • Design Guide: Designing with PLDs • PLD Design Methodology PLD Design Development Tools • Fabrication of Programmable Logic. Application Examples REAL TIME CLOCK HANDBOOK-1993 3-Volt Low Voltage Real Time Clocks • Real Time Clocks and Timer Clock Peripherals • Application Notes RELIABILITY HANDBOOK-1987 Reliability and the Die. Internal Construction. Finished Package. MIL-STD-883. MIL-M-38510 The Specification Development Process • Reliability and the Hybrid Device • VLSIIVHSIC Devices Radiation Environment • Electrostatic Discharge • Discrete Device • Standardization Quality Assurance and Reliability Engineering • Reliability and Documentation • Commercial Grade Device European Reliability Programs • Reliability and the Cost of Semiconductor Ownership Reliability Testing at National Semiconductor. The Total Military/Aerospace Standardization Program 883B/RETSTM Products. MILS/RETSTM Products. 883/RETSTM Hybrids. MIL-M-38510 Class B Products Radiation Hardened Technology. Wafer Fabrication. Semiconductor Assembly and Packaging Semiconductor Packages. Glossary of Terms. Key Government Agencies. AN/ Numbers and Acronyms Bibliography. MIL-M-38510 and DESC Drawing Cross Listing SCAN DATABOOK-1996 Design for Test Solutions. Description of Boundary SCAN • SCAN ABT Test Access Logic • SCAN CMOS Test Access Logic System Test Devices and Software. Application Notes TELECOMMUNICATIONS-1994 COMBO and SUC Devices • ISDN • Digital Loop Devices • Analog Telephone Components • Software • Application Notes VHC ADVANCED CMOS LOGIC DATABOOK-1996 This databook introduces National's Very High Speed CMOS (VHC) and Very High Speed TTL Compatible CMOS (VHCT) designs. The databook includes Description and Family Characteristics • Ratings, Specifications and Waveforms Design Considerations • VHC Family Datasheets • VHC Specialty Function Datasheets and related Application Notes. The topics discussed are the advantages of VHCIVHCT AC Performance, Low Noise Characteristics and Improved Interface Capabilities. http://www.national.com NATIONAL SEMICONDUCTOR CORPORATION DISTRIBUTORS ALABAMA Huntsville Anthem Electronics (205) 890·0302 Future Electronics Corp. (205) 830·2322 Hamilton/Hallmark (205) 837·8700 Pioneer Technology (205) 837·9300 Time Electronics (205) 721·1134 ARIZONA Phoenix Future Electronics Corp. (602) 968·7140 Hamilton/Hallmark (602) 437·1200 Scottsdale Alliance Electronics Inc. (602) 483·9400 Tempe Anthem Electronics (602) 966·6600 Bell Industries (602) 966·3600 Pioneer Standard (602) 350·9335 Time Electronics (602) 967·2000 CALIFORNIA Agoura Hills Future Electronics Corp. (818) 865·0040 Pioneer Standard (818) 865·5800 Time Electronics (818) 707·2890 Chatsworth Anthem Electronics (818) 775·1333 Costa Mesa Hamilton/Hallmark (714) 641·4100 Irvine Anthem Electronics (714) 768·4444 Bell Industries (714) 727·4500 Future Electronics Corp. (714) 453·1515 Pioneer Standard (714) 753·5090 Zeus Elect. an Arrow Co. (714) 581·4622 Rocklin Anthem Electronics (916) 624·9744 Bell Industries (916) 652·0418 Roseville Future Electronics Corp. (916) 783·7877 Hamilton/Hallmark (916) 624·9781 San Diego Anthem Electronics (619) 453·9005 Bell Industries (619) 576·3294 Future Electronics Corp. (619) 625·2800 Hamilton/Hallmark (619) 571·7540 Pioneer Standard (619) 514·7700 Time Electronics (619) 674·2800 San Jose Anthem Electronics (408) 453·1200 Future Electronics Corp. (408) 434·1122 http://www.national.com San Jose (Continued) Hamilton/Hallmark (408) 435·3500 Pioneer Technology (408) 954·9100 Zeus Elect. an Arrow Co. (408) 629·4789 Sunnyvale Bell Industries (408) 734·8570 Time Electronics (408) 734·9890 Tustin TIme Electronics (714) 669·0216 Westlake Village Bell Industries (805) 373·5600 Woodland Hills Hamilton/Hallmark (818) 594·0404 Time Electronics (818) 593·8400 COLORADO Denver Bell Industries (303) 691·9270 Englewood Anthem Electronics (303) 790-4500 Hamilton/Hallmark (303) 790·1662 Pioneer Technology (303) 773·8090 Time Electronics (303) 799·5400 Lakewood Future Electronics Corp. (303) 232·2008 CONNECTICUT Cheshire Future Electronics Corp. (203) 250-0083 Hamilton/Hallmark (203) 271·2844 Meriden Bell Industries (203) 639·6000 Shelton Pioneer Standard (203) 929·5600 Wallingford Advent Electronics (800) 982·0014 Waterbury Anthem Electronics (203) 575·1575 FLORIDA Altamonte Springs Anthem Electronics (407) 831·0007 Bell Industries (407) 339-0078 Future Electronics Corp. (407) 865·7900 Pioneer Technology (407) 834·9090 Deerfield Beach Future Electronics Corp. (305) 426·4043 Pioneer Technology (305) 428·8877 Fort Lauderdale Hamilton/Hallmark (305) 484·5482 Time Electronics (305) 484·1864 Indialantic Advent Electronics (800) 975-8669 Lake Mary Zeus Elect. an Arrow Co. (407) 333·9300 Largo Future Electronics Corp. (813) 530·1222 Hamilton/Hallmark (813) 541·7440 Orlando Chip Supply "Die Distributor" (407) 298·7100 Time Electronics (407) 841·6566 Winter Park Hamilton/Hallmark (407) 657·3300 GEORGIA Duluth Anthem Electronics (404) 931·9300 Hamilton/Hallmark (404) 623·4400 Pioneer Technology (404) 623·1003 Time Electronics (404) 623·5455 Norcross Future Electronics Corp. (404) 441·7676 ILLINOIS Addison Pioneer Standard (708) 495·9680 Arlington Heights Hamilton/Hallmark (708) 797·7300 Des Plaines Advent Electronics (800) 323·1270 Elk Grove Village Bell Industries (708) 640·1910 Hoffman Estates Future Electronics Corp. (708) 882·1255 Itasca Zeus Elect. an Arrow Co. (708) 595·9730 Schaumburg Anthem Electronics (708) 884·0200 Time Electronics (708) 303·3000 INDIANA Carmel Hamilton/Hallmark (317) 575·3500 Fort Wayne Bell Industries (219) 422·4300 Indianapolis Advent Electronics Inc. (800) 732·1453 Bell Industries (317) 875·8200 Future Electronics Corp. (317) 469·0447 Pioneer Standard (317) 573·0880 IOWA Cedar Rapids Advent Electronics (800) 397·8407 Hamilton/Hallmark (319) 393·0033 KANSAS Lenexa Hamilton/Hallmark (913) 888·4747 Overland Park Future Electronics Corp. (913) 649·1531 KENTUCKY Lexington Hamilton/Hallmark (606) 288·4911 MARYLAND Columbia Anthem Electronics (410) 995·6640 Bell Industries (410) 290·5100 Future Electronics Corp. (410) 290·0600 Hamilton/Hallmark (410) 988·9800 Seymour Electronics (410) 992·7474 Time Electronics (410) 720·3600 Gaithersburg Pioneer Technology (301) 921·0660 MASSACHUSETTS Andover Bell Industries (508) 474·8880 Bolton Future Electronics Corp. (508) 779·3000 Lexington Pioneer Standard (617) 861·9200 Newburyport Rochester Electronics "Obsolete Products" (508) 462·9332 Norwood Gerber Electronics (617) 769·6000 Peabody Hamilton/Hallmark (508) 532·3701 Time Electronics (508) 532·9777 Wilmington Anthem Electronics (508) 657·5170 Zeus Elect. an Arrow Co. (508) 658·0900 MICHIGAN Farmington Hills Advent Electronics (800) 572·9329 Grand Rapids Future Electronics Corp. (616) 698·6800 Pioneer Standard (616) 698·1800 Livonia Future Electronics Corp. (313) 261·5270 O'Fallon Advent Electronics (800) 888·9588 Plymouth Hamilton/Hallmark (313) 416·5800 Pioneer Standard (313) 416·2157 MINNESOTA Bloomington Hamilton/Hallmark (612) 881·2600 Eden Prairie Anthem Electronics (612) 944·5454 Future Electronics Corp. (612) 944·2200 Pioneer Standard (612) 944·3355 Minnetonka Time Electronics (612) 931·2131 Thief River Falls Digi·Key Corp. "Catalog Sales Only" (800) 344·4539 NATIONAL SEMICONDUCTOR CORPORATION DISTRIBUTORS (Continued) MISSOURI Earth City Hamilton/Hallmark (314) 291-5350 Manchester Time Electronics (314) 230-7500 St. Louis Future Electronics Corp. (314) 469-6805 NEW JERSEY Camden Advent Electronics (800) 255-4771 Cherry Hill Hamilton! Hallmark (609) 424-0110 Fairfield Bell Industries (201) 227-6060 Pioneer Standard (201) 575-3510 Marlton Future Electronics Corp. (609) 596-4080 Time Electronics (609) 596-1286 Mount Laurel Bell Industries (609) 439-8860 Seymour Electronics (609) 235-7474 Parsippany Future Electronics Corp. (201) 299-0400 Hamilton/ Hallmark (201) 515-1641 Pine Brook Anthem Electronics (201) 227-7960 Wayne Time Electronics (201) 785-8250 NEW MEXICO Albuquerque Bell Industries (505) 292-2700 Hamilton/Hallmark (505) 828-1058 NEW YORK Binghamton Pioneer Standard (607) 722·9300 Commack Anthem Electronics (516) 864·6600 Fairport Pioneer Standard (716) 381-7070 Hauppauge Future Electronics Corp. (516) 234·4000 Hamilton/Hallmark (516) 434·7400 Time Electronics (516) 273·01 00 Port Chester Zeus Elect. an Arrow Co. (914) 937·7400 Rochester Future Electronics Corp. (716) 387·9550 Hamilton/Hallmark (800) 475·9130 Syracuse Future Electronics Corp. (315) 451·2371 Time Electronics (315) 434·9837 Woodbury Pioneer Standard (516) 921·9700 TEXAS Austin Anthem Electronics Seymour Electronics (512) 388·0049 (516) 496·7474 Future Electronics Corp. NORTH CAROLINA Charlotte Future Electronics Corp. (704) 547·1107 Morrisville Pioneer Technology (919) 460·1530 Raleigh Anthem Electronics (919) 782·3550 Future Electronics Corp. (919)790·7111 Hamilton/Hallmark (919) 872·0712 OHIO Beavercreek Future Electronics Corp. (513) 426·0090 Cleveland Pioneer Standard (216) 587·3600 Columbus Time Electronics (614) 794·3301 Dayton Bell Industries (513) 435·5922 Bell Industries·Military (513) 434·8231 Hamilton/Hallmark (513) 439·6735 Pioneer Standard (513) 236·9900 Mayfield Heights Future Electronics Corp. (216) 449·6996 Solon Bell Industries (216) 498·2002 Hamilton/Hallmark (216) 498·1100 Worthington Hamilton/Hallmark (614) 888·3313 OKLAHOMA Tulsa Hamilton/Hallmark (918)254·6110 Pioneer Standard (918) 665·7840 Radio Inc. (918) 587·9123 OREGON Beaverton Anthem Electronics (503) 643·1114 Bell Industries (503) 644·3444 Future Electronics Corp. (503) 645·9454 Hamilton/Hallmark (503) 526·6200 Pioneer Technology (503) 626·7300 Portland Time Electronics (503) 684·3780 PENNSYLVANIA Horsham Anthem Electronics (215) 443·5150 Pioneer Technology (215) 674·4000 Pittsburgh Pioneer Standard (512) 502·0991 Hamilton/Hallmark (512) 258·8848 New Berlin Hamilton/Hallmark (414) 780·7200 Waukesha Bell Industries (414) 547·8879 West Allis Advent Electronics Minco Technology Labs. "Die Distributor" (800) 500·0441 CANADA (512) 834·2022 WESTERN PROVINCES Burnaby Hamilton/Hallmark Pioneer Standard (512) 835·4000 Time Electronics (512) 219·3773 Carrollton Zeus Elect. an Arrow Co. (214) 380·4330 Dallas Hamilton/Hallmark (214) 553·4300 Pioneer Standard (214) 386·7300 Houston Future Electronics Corp. (713) 785·1155 Hamilton/Hallmark (713) 781·6100 (604) 420·4101 Calgary Electro SoniC Inc. (403) 255·9550 Future Electronics Corp. (403) 250·5550 Zentronics/Pioneer (403) 295·8838 Edmonton Future Electronics Corp. (403) 438·2858 Zentronics/Pioneer (403) 482·3038 Richmond Electro Sonic Inc. Pioneer Standard (604) 273·2911 (713) 495·4700 Zentronics/ Pioneer Richardson Anthem Electronics (214) 238·7100 Bell Industries (214) 690·9096 Future Electronics Corp. (214) 437·2437 Time Electronics (214) 480·5000 UTAH Midvale Bell Industries (801) 255·9691 Salt Lake City Anthem Electronics (801) 973·8555 (604) 273·5575 Vancouver Future Electronics Corp. (604) 294·1166 EASTERN PROVINCES Mississauga Future Electronics Corp. (905) 612·9200 Hamilton/Hallmark (905) 564·6060 Time Electronics (905) 712·3277 Zentronics/Pioneer (905) 405·8300 Nepean Hamilton/Hallmark Future Electronics Corp. (613) 226·1700 (801) 467·4448 Zentronics/Pioneer Hamilton/Hallmark (801) 266·2022 West Valley City Time Electronics (801) 973·0208 WASHINGTON Bellevue Bell Industries (206) 646·8750 Pioneer Technology (206) 644·7500 Bothell Anthem Electronics (206) 483·1700 Future Electronics Corp. (206) 489·3400 Kirkland Time Electronics (206) 820-1525 Redmond Hamilton/Hallmark (206) 881·6697 WISCONSIN Brookfield Future Electronics Corp. (414) 879·0244 Pioneer Standard (613) 226·8840 Ottawa Electro Sonic Inc. (613) 728·8333 Future Electronics Corp. (613) 820·8313 Pointe Claire Future Electronics Corp. (514) 694·7710 Quebec Future Electronics Corp. (418) 877-6666 Ville St. Laurent Hamilton/Hallmark (514) 335·1000 Zentronics/Pioneer (514) 737·9700 Willowdale Electro Sonic Inc. (416) 494·1666 Winnipeg Electro Sonic Inc. (204) 783·3105 Future Electronics Corp. (204) 944·1446 Zentronics/Pioneer (204) 694·1957 (414) 784·3480 Mequon Taylor Electric (414) 241-4321 (412) 782·2300 ht1p:llwww.national.com IfINational Semiconductor WORLDWIDE SALES OFFICES AUSTRALIA National Semiconductor (Australia) Pty. Ltd. Bldg. 16 Business Park Dr. Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel: (39) 558·9999 Fax: (39) 558·9998 BRAZIL National Semlconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120·3A Sao Paulo·SP Brazil 05418·000 Tel: (55·11) 212·5066 Fax: (55·11) 212·1181 CANADA National Semiconductor (Canada) 5925 Airport Road, Suite 615 Mississauga, Ontario L4V lWl Tel: (416) 678·2920 Fax: (416) 678·2837 National Semiconductor (Canada) 39 Robertson Road, Suite 101 Nepean, Ontario K2H 8R2 Tel: (613) 596·0411 Fax: (613) 596·1613 National Semiconductor (Canada) 1870 Boul Des Sources, Suite 101 Pointe Claire, Quebec H2R 5N4 Tel: (514) 426·2992 Fax: (514) 426·2710 CHINA . National Semiconductor Beijing China Liaison Office Room 613 & 614 Sinochem Mansion No. A2 Fuxingmenwai Avenue Beijing 100046, PRC China Tel: 86·10-8568601 Fax: 86·10·8568606 National Semiconductor Shanghai China Liaison Office B702, Universal Mansion No. 172, Yuyuan Road Shanghai 200040, PRC China Tel: 86·21·2496062 Fax: 86·21-2496063 http://www.national.com FINLAND National Semiconductor (U.K.) Ltd. Mekaanikonkatu 13 SF·00810 Helsinki Finland Tel: (0) 759·1855 Fax: (0) 759·1393 FRANCE National Semiconductor S.A. Parc d'Affaires Technopolis 3, Avenue Du Canada Bat. ZETA· L.P. 821 Les Ulis F·91974 Courtaboeuf Cedex France Tel: (1) 6918 37 00 Fax: (1) 69 183769 GERMANY National Semiconductor GmbH Livry·Gargan·Strasse. 10 D·82256 Fiirstenfeldbruck Germany Tel: (0·81·41) 35·0 Fax: (0-81·41) 35-15·06 HONG KONG National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block Ocean Centre 5 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737·1600 Fax: (852) 2736-9960 INDIA National Semiconductor India Liaison Office 1109, 11th Floor, West Wing Raheja Towers, M.G. Road Bangalore 560001 India Tel: 91-80-559·9467 Fax: 91·80·559·9468 ISRAEL National Semiconductor Ltd. Maskit Street PO Box 3007 Herzlia B. 46104 Israel Tel: (09) 59 4255 Fax: (09) 55 83 22 ITALY National Semiconductor S.p.A. Strada 7, Palazzo R/3 1·20089 Rozzano·Milanofiori Italy Tel: (02) 57 50 03 00 Fax: (02) 57 50 04 00 JAPAN National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 8F 1·7·1, Nakase, Mihama·Ku Chiba·City, Chiba Prefecture 261 Japan Tel: 81·043·299·2300 Fax: 81·043·299·2500 KOREA National Semiconductor (Far East) Ltd. 13th Floor, Dai Han Life Insurance 63 Building 60 Yoido·Dong Youngdeungpo·KU Seoul Korea 150·763 Tel: (02) 784·8051/3 (02) 785-0696/8 Fax: (02) 784·8054 MALAYSIA National Semiconductor SdnBhd Bayan Lepas Free Trade Zone 11900 Penang Malaysia Tel: 4-644-9061 Fax: 4-644·9073 MEXICO Electronlca NSC de Mexico SA Juventino Rosas No. 118-2 Col Guadalupe Inn Mexico, 01020 D.E. Mexico Tel: (525) 661·7155 Fax: (525) 661-6905 PUERTO RICO National Semiconductor (Puerto Rico) La Electronica Bldg. Suite 312, A.D. #1 KM 14.5 RioPiedias Puerto Rico 00927 Tel: (809) 758·9211 Fax: (809) 763-6959 SINGAPORE National Semiconductor Asia Pacific Pte. Ltd. 200 Cantonment Road # 13·01 South point Singapore 0208 Tel: (65) 225·2226 Fax: (65) 225·7080 SPAIN National Semiconductor GmbH Calle Almendralejos, 4 28140 Fuente el Saz del Jarama Madrid, Spain Tel: (01) 620 1425 Fax: (01) 620 0612 SWEDEN National Semiconductor AB P.o. Box 1009 Grosshandlarv!lgen 7 S·12123 Johanneshov, Sweden Tel: (08) 7 22 80 50 Fax: (08) 7 22 90 95 SWITZERLAND National Semiconductor (U.K.) Ltd. Alte Winterthurerstrasse 53 CH-8304 Wallisellen-Ziirich Switzerland Tel: (01) 8·30·27·27 Fax: (01) 8·30·19-00 TAIWAN National Semiconductor (Far East) Ltd. 9/F, No. 44 Section 2 Chungshan North Road Taipei, Taiwan, A.O.C. Tel: (02) 521·3288 Fax: (02) 561-3054 U.K. AND IRELAND National Semiconductor (U.K.) Ltd. 1st Floor Milford House Milford Street Swindon, Wiltshire SNllDW United Kingdom Tel: (07·93) 614141 Fax: (07-93) 52 21 80 Telex: 444674 UNITED STATES National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: (800) 272·9959 Fax: (800) 737·7018
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Create Date : 2015:11:12 10:37:05-08:00 Modify Date : 2015:11:12 10:31:45-08:00 XMP Toolkit : Adobe XMP Core 4.2.1-c041 52.342996, 2008/05/07-21:37:19 Metadata Date : 2015:11:12 10:31:45-08:00 Producer : Adobe Acrobat 9.0 Paper Capture Plug-in Format : application/pdf Document ID : uuid:95e6c274-b653-e34c-80d0-7474837cf53d Instance ID : uuid:19e015f6-9eb0-6c4c-b50f-02ff43fa269b Page Layout : SinglePage Page Mode : UseNone Page Count : 338EXIF Metadata provided by EXIF.tools