PIC32 Flash Programming Specification Intel Computer Hardware LXD972M 60001145N

User Manual: Intel Computer Hardware LXD972M

Open the PDF directly: View PDF .
Page Count: 78

Download
Open PDF In Browser	View PDF

PIC32
PIC32 Flash Programming Specification
1.0

DEVICE OVERVIEW

This document defines the Flash programming
specification for the PIC32 family of 32-bit
microcontrollers.
This programming specification is designed to guide
developers of external programmer tools. Customers
who are developing applications for PIC32 devices
should use development tools that already provide
support for device programming.
The major topics of discussion include:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•

Section 1.0 “Device Overview”
Section 2.0 “Programming Overview”
Section 3.0 “Programming Steps”
Section 4.0 “Connecting to the Device”
Section 5.0 “EJTAG vs. ICSP”
Section 6.0 “Pseudo Operations”
Section 7.0 “Entering 2-Wire Enhanced ICSP
Mode”
Section 8.0 “Check Device Status”
Section 9.0 “Erasing the Device”
Section 10.0 “Entering Serial Execution Mode”
Section 11.0 “Downloading the Programming
Executive (PE)”
Section 12.0 “Downloading a Data Block”
Section 13.0 “Initiating a Page Erase”
Section 14.0 “Initiating a Flash Row Write”
Section 15.0 “Verify Device Memory”
Section 16.0 “Exiting Programming Mode”
Section 17.0 “The Programming Executive”
Section 18.0 “Checksum”
Section 19.0 “Configuration Memory and Device
ID”
Section 20.0 “TAP Controllers”
Section 21.0 “AC/DC Characteristics and Timing
Requirements”
Appendix A: “PIC32 Flash Memory Map”
Appendix B: “Hex File Format”
Appendix C: “Device IDs”
Appendix D: “Revision History”

 2007-2017 Microchip Technology Inc.

2.0

PROGRAMMING OVERVIEW

When in development of a programming tool, it is
necessary to understand the internal Flash program
operations of the target device and the Special
Function Registers (SFRs) used to control Flash
programming, as these same operations and registers
are used by an external programming tool and its
software. These operations and control registers are
described in the “Flash Program Memory” chapter in
the specific device data sheet, and the related “PIC32
Family Reference Manual” section. It is highly
recommended that these documents be used in
conjunction with this programming specification.
An external tool programming setup consists of an
external programmer tool and a target PIC32 device.
Figure 2-1 illustrates a typical programming setup. The
programmer tool is responsible for executing
necessary programming steps and completing the
programming operation.

FIGURE 2-1:

PROGRAMMING SYSTEM
SETUP
Target PIC32 Device

External
Programmer

CPU

On-Chip Memory

DS60001145U-page 1

PIC32
2.1

Devices with Dual Flash Panel and
Dual Boot Regions

The PIC32MKXXXXXXD/E/F/K/L/M and PIC32MZ
families of devices incorporate several features useful
for field (self) programming of the device. These
features include dual Flash panels with dual boot
regions, an aliasing scheme for the boot regions
allowing automatic selection of boot code at start-up
and a panel swap feature for Program Flash. The two
Flash panels and their associated boot regions can be
erased and programmed separately. Refer to the
Section
48.
“Memory
Organization
and
Permissions” (DS60001214) of the “PIC32 Family
Reference Manual” for a detailed explanation of these
features.
A development tool used for production programming
will not be concerned about most of these features with
the following exceptions:
• Ensuring the SWAP bit (NVMCON<7>) is in the
proper setting. The default setting is ‘0’ for no swap
of panels. The development tool should assume the
default setting when generating source files for the
programming tool.
• Proper handling of the aliasing of the boot memory
in the checksum calculation. The aliased sections
will be duplicates of the fixed sections. See
Section 18.0 “Checksum” for more information on
checksum calculations with aliased regions
• For PIC32MK devices, using the Erase/Retry
feature when an attempt to erase a Flash page fails
and needs to be retried. See Section 13.0
“Initiating a Page Erase” for more information.

2.2

Programming Interfaces

All PIC32 devices provide two physical interfaces to the
external programmer tool:
• 2-wire In-Circuit Serial Programming™ (ICSP™)
• 4-wire Joint Test Action Group (JTAG)
See Section 4.0 “Connecting to the Device” for
more information.
Either of these methods may use a downloadable
Programming Executive (PE). The PE executes from
the target device RAM and hides device programming
details from the programmer. It also removes overhead
associated with data transfer and improves overall data
throughput. Microchip has developed a PE that is
available for use with any external programmer, see
Section 17.0 “The Programming Executive” for
more information.
Section 3.0 “Programming Steps” describes highlevel programming steps, followed by a brief
explanation of each step. Detailed explanations are
available in corresponding sections of this document.
More information on programming commands, EJTAG,
and DC specifications are available in the following
sections:
• Section 19.0 “Configuration Memory and
Device ID”
• Section 20.0 “TAP Controllers”
• Section 21.0 “AC/DC Characteristics and
Timing Requirements”

2.3

Enhanced JTAG (EJTAG)

The 2-wire and 4-wire interfaces use the EJTAG
protocol to exchange data with the programmer. While
this document provides a working description of this
protocol as needed, advanced users are advised to
refer to the Imagination Technologies Limited web site
(www.imgtec.com) for more information.

2.4

Data Sizes

Data sizes are defined as follows:
•
•
•
•

DS60001145U-page 2

One word: 32 bits
One-half word: 16 bits
One-quarter word: 8 bits
One Byte: 8 bits

 2007-2017 Microchip Technology Inc.

PIC32
3.0

PROGRAMMING STEPS

All tool programmers must perform a common set of
steps, regardless of the actual method being used.
Figure 3-1 shows the set of steps to program PIC32
devices.

FIGURE 3-1:

The following sequence lists the programming steps
with a brief explanation of each step. More detailed
information about these steps is available in the
subsequent sections.
1.

To ensure successful programming, all required
pins must be connected to appropriate signals.
See Section 4.0 “Connecting to the Device”
for more information.

PROGRAMMING FLOW
Start

Connect to the target device.

Place the target device in programming mode.
For 2-wire programming methods, the target
device must be placed in a special programming
mode (Enhanced ICSP™) before executing any
other steps.

Enter Enhanced ICSP™
(Only required for 2-wire)

Note:

For the 4-wire programming methods,
Step 2 is not applicable.

See Section 7.0 “Entering 2-Wire Enhanced
ICSP Mode” for more information.

Check Device Status

Check the status of the device.
Checks the status of the device to ensure it is
ready to receive information from the
programmer.

Erase Device

See Section 8.0 “Check Device Status” for
more information.

Enter Serial Exec Mode

Erase the target device.
If the target memory block in the device is not
blank, or if the device is code-protected, an
erase step must be performed before
programming any new data.

Download the PE
(Optional)

See Section 9.0 “Erasing the Device” for
more information.
Download a Data Block

Enter programming mode.
Verifies that the device is not code-protected
and boots the TAP controller to start sending
and receiving data to and from the PIC32 CPU.

Initiate Flash Write

See Section 10.0 “Entering Serial Execution
Mode” for more information.

Done
Yes

Verify Device

Exit Programming Mode

Done

 2007-2017 Microchip Technology Inc.

DS60001145U-page 3

PIC32
6.

Download the Programming Executive (PE).
The PE is a small block of executable code that
is downloaded into the RAM of the target device.
It will receive and program the actual data.
Note:

If the programming method being used
does not require the PE, Step 6 is not
applicable.

See
Section 11.0
“Downloading
the
Programming Executive (PE)” for more
information.
7.

Download the block of data to program.
All methods, with or without the PE, must
download the desired programming data into a
block of memory in RAM.
See Section 12.0 “Downloading a Data
Block” for more information.

Initiate Flash Write.
After downloading each block of data into RAM,
the programming sequence must be started to
program it into the target device’s Flash
memory.
See Section 14.0 “Initiating a Flash Row
Write” for more information.

Repeat Step 7 and Step 8 until all data blocks
are downloaded and programmed.
10. Verify the program memory.
After all programming data and Configuration
bits are programmed, the target device memory
should be read back and verified for the
matching content.
See Section 15.0 “Verify Device Memory” for
more information.
11. Exit the programming mode.
The newly programmed data is not effective until
either power is removed and reapplied to the
target device or an exit programming sequence
is performed.
See Section 16.0 “Exiting
Mode” for more information.

DS60001145U-page 4

Programming

 2007-2017 Microchip Technology Inc.

PIC32
4.0

CONNECTING TO THE DEVICE

The PIC32 family provides two possible physical
interfaces for connecting and programming the
memory contents, see Figure 4-1. For all programming
interfaces, the target device must be powered and all
required signals must be connected. In addition, the
interface must be enabled, either through its
Configuration bit, as in the case of the JTAG 4-wire
interface, or though a special initialization sequence, as
is the case for the 2-wire ICSP interface.
The JTAG interface is enabled by default in blank
devices shipped from the factory.
Enabling ICSP is described in Section 7.0 “Entering
2-Wire Enhanced ICSP Mode”.

FIGURE 4-1:

One possible interface is the 4-wire JTAG (IEEE
1149.1) port. Table 4-1 lists the required pin
connections. This interface uses the following four
communication lines to transfer data to and from the
PIC32 device being programmed:
•
•
•
•

Test Clock Input (TCK)
Test Mode Select Input (TMS)
Test Data Input (TDI)
Test Data Output (TDO)

Refer to the specific device data sheet for the
connection of the signals to the device pins.

4.1.1

4.1.2

PIC32

4-wire
JTAG

TEST CLOCK INPUT (TCK)

TEST MODE SELECT INPUT (TMS)

TMS is the control signal for the TAP controller. This
signal is sampled on the rising edge of TCK.

+ MCLR, VDDCORE(1), VDDR1V8(1),
VDDIO, VSS, VSS1V8(1)
Note 1:

4-wire Interface

TCK is the clock that controls the updating of the TAP
controller and the shifting of data through the Instruction or selected Data registers. TCK is independent of
the processor clock with respect to both frequency and
phase.

PROGRAMMING
INTERFACES
2-wire
ICSP™

Programmer

4.1

4.1.3

TEST DATA INPUT (TDI)

TDI is the test data input to the Instruction or selected
Data register. This signal is sampled on the rising edge
of TCK for some TAP controller states.

This pin is not available on all devices.
Refer to the “Pin Diagrams” or “Pin
Tables” section in the specific device data
sheet to determine availability.

4.1.4

TEST DATA OUTPUT (TDO)

TDO is the test data output from the Instruction or Data
registers. This signal changes on the falling edge of
TCK. TDO is only driven when data is shifted out,
otherwise the TDO is tri-stated.

TABLE 4-1:

4-WIRE INTERFACE PINS
Device Pin Name

Pin
Type

Pin Description

I
Programming Enable
MCLR
ENVREG(2)
I
Enable for On-Chip Voltage Regulator
VDD, VDDIO, VDDCORE(2), VDDR1V8(2), VBAT(2),
P
Power Supply
and AVDD(1)
P
Ground
VSS, VSS1V8(2), and AVSS(1)
VCAP(2)
P
CPU logic filter capacitor connection
TDI
I
Test Data In
TDO
O
Test Data Out
TCK
I
Test Clock
TMS
I
Test Mode State
Legend: I = Input
O = Output
P = Power
Note 1: All power supply and ground pins must be connected, including analog supplies (AVDD) and ground (AVSS).
2: This pin is not available on all devices. Refer to the “Pin Diagrams” or “Pin Tables” section in the specific
device data sheet to determine availability.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 5

PIC32
4.2

4.2.1

2-wire Interface

Another possible interface is the 2-wire ICSP port.
Table 4-2 lists the required pin connections. This
interface uses the following two communication lines to
transfer data to and from the PIC32 device being
programmed:
• Serial Program Clock (PGECx)
• Serial Program Data (PGEDx)

TABLE 4-2:

PGECx is the clock that controls the updating of the
TAP controller and the shifting of data through the
Instruction or selected Data registers. PGECx is
independent of the processor clock, with respect to
both frequency and phase.

4.2.2

These signals are described in the following two
sections. Refer to the specific device data sheet for the
connection of the signals to the chip pins.

SERIAL PROGRAM CLOCK
(PGECX)

SERIAL PROGRAM DATA (PGEDX)

PGEDx is the data input/output to the Instruction or
selected Data Registers, it is also the control signal for
the TAP controller. This signal is sampled on the falling
edge of PGECx for some TAP controller states.

2-WIRE INTERFACE PINS
Device
Pin Name

Programmer
Pin Name

Pin Type

Pin Description

MCLR
P
Programming Enable
MCLR
(2)
N/A
I
Enable for On-Chip Voltage Regulator
ENVREG
VDD, VDDIO, VBAT(2), and AVDD(1)
VDD
P
Power Supply
VDDCORE(2) and VDDR1V8(2)
N/A
P
Power Supply for DDR Interface
(1)
(2)
VSS, VSS1V8 , and AVSS
VSS
P
Ground
VCAP(2)
N/A
P
CPU Logic Filter Capacitor Connection
PGECx
PGEC
I
Primary Programming Pin Pair: Serial Clock
PGEDx
PGED
I/O
Primary Programming Pin Pair: Serial Data
Legend: I = Input
O = Output
P = Power
Note 1: All power supply and ground pins must be connected, including analog supplies (AVDD) and ground (AVSS).
2: This pin is not available on all devices. Refer to either the “Pin Diagrams” or “Pin Tables” section in the
specific device data sheet to determine availability.

DS60001145U-page 6

 2007-2017 Microchip Technology Inc.

PIC32
4.3

PIC32MX Power Requirements

Devices in the PIC32MX family are dual voltage
supply designs. There is one supply for the core and
another for peripherals and I/O pins. All devices
contain an on-chip regulator for the lower voltage
core supply to eliminate the need for an additional
external regulator. There are three implementations
of the on board regulator:
• The first version has an internal regulator that can
be disabled using the ENVREG pin. When disabled,
an external power supply must be used to power the
core. If enabled, a low-ESR filter capacitor must be
connected to the VCAP pin, see Figure 4-2.
• The second version has an internal regulator that
cannot be disabled. A low-ESR filter capacitor must
always be connected to the VCAP pin.
• The third version has an internal regulator that
cannot be disabled and does not require a filter
capacitor
Refer to Section 21.0 “AC/DC Characteristics and
Timing Requirements” and the “Electrical
Characteristics” chapter in the specific device data
sheet for the power requirements for your device.

FIGURE 4-2:

INTERNAL REGULATOR
ENABLE/DISABLE
OPTIONS
Regulator Enabled(2)
(ENVREG tied to VDD)
3.3V
PIC32MX
VDD
ENVREG

PIC32MX With VBAT Pin Power
Requirements

Some devices in the PIC32MX family provide a VBAT
pin which can be connected to the VDD power supply
during programming. See Figure 4-3.

FIGURE 4-3:

PIC32MX WITH VBAT PIN
POWER CONNECTIONS
3.3V(1)
PIC32MX XLP
VDD
VBAT
VCAP
VSS

Note

4.5

This is typical operating voltage. Refer to
Section 21.0 “AC/DC Characteristics and Timing
Requirements” for the full operating range of VDD.

PIC32MZ EC and PIC32MZ EF
Power Requirements

Devices in the PIC32MZ EC and PIC32MZ EF families
are also dual voltage supply designs like PIC32MX
devices. However, the internal regulator does not
require the external filter capacitor, and there is no corresponding VCAP or ENVREG pins. See Figure 4-4.
Refer to Section 21.0 “AC/DC Characteristics and
Timing Requirements” and the “Electrical
Characteristics” chapter in the specific device data
sheet for the power requirements for your device.

FIGURE 4-4:

VCAP
CEFC
(10 F typical)

4.4

VSS

PIC32MZ EC/EF POWER
CONNECTIONS

3.3V(1)
PIC32MZ EC/EF

(2)

Regulator Disabled
(ENVREG tied to ground)
1.8V(1)

VDD

3.3V(1)
PIC32MX

VSS

VDD
ENVREG
VCAP
VSS

Note

This is typical operating voltage. Refer to
Section 21.0 “AC/DC Characteristics and Timing
Requirements” for the full operating range of VDD.

These are typical operating voltages. Refer to
Section 21.0 “AC/DC Characteristics and Timing
Requirements” for the full operating ranges of VDD
and VCAP.
Regulator Enabled and Regulator Disabled mode
are not available on all devices. Refer to the specific
device data sheet to determine availability.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 7

PIC32
4.6

PIC32MZ DA Power Requirements

Devices in the PIC32MZ DA family are quadruple
voltage supply designs. Two of the voltage supplies are
identical to the PIC32MZ EC and PIC32MZ EF voltage
supplies. The third voltage supply is for the DDR
memory interface, and requires a 1.8 volt supply. The
fourth voltage supply is for the VBAT pin, but it can be
connected to the VDD power supply. See Figure 4-5.
Refer to Section 21.0 “AC/DC Characteristics and
Timing Requirements” and the “Electrical
Characteristics” chapter in the specific device data
sheet for the power requirements for your device.

FIGURE 4-5:
1.8V(1)

PIC32MZ DA POWER
CONNECTIONS
3.3V(1)
PIC32MZ DA

5.0

EJTAG vs. ICSP

Programming is accomplished through the EJTAG
module in the CPU core. EJTAG is connected to either
the full set of JTAG pins, or a reduced 2-wire to 4-wire
EJTAG interface for ICSP mode. In both modes,
programming of the PIC32 Flash memory is
accomplished through the ETAP controller. The TAP
Controller uses the TMS pin to determine if Instruction
or Data registers should be accessed in the shift path
between TDI and TDO, see Figure 5-1.
The basic concept of EJTAG that is used for
programming is the use of a special memory area
called DMSEG (0xFF200000 to 0xFF2FFFFF), which
is only available when the processor is running in
Debug mode. All instructions are serially shifted into an
internal buffer, and then loaded into the Instruction
register and executed by the CPU. Instructions are fed
through the ETAP state machine in 32-bit groups.

VDDIO
VBAT

FIGURE 5-1:

TAP CONTROLLER

VDDCORE and VDDR1V8
VSS1V8

Tap Controller

VSS

TMS
Note

4.7

These are typical operating voltages. Refer to
Section 21.0 “AC/DC Characteristics and Timing
Requirements” for the full operating ranges of
VDDIO, VBAT, VDDCORE, and VDDR1V8.

PIC32MK Power Requirements

Devices in the PIC32MK family are triple voltage supply
designs. Two of the voltage supplies are identical to the
PIC32MZ EC and PIC32MZ EF voltage supplies. The
third voltage supply is for the VBAT pin, but it can be
connected to the VDD power supply. See Figure 4-6.

FIGURE 4-6:

TCK
TDO
TDI
Instruction, Data,
and Control Registers

PIC32MK POWER
CONNECTIONS
3.3V(1)
PIC32MK
VDD
VBAT

VSS

Note

These are typical operating voltages. Refer to
Section 21.0 “AC/DC Characteristics and Timing
Requirements” for the full operating ranges of VDD
and VBAT.

DS60001145U-page 8

 2007-2017 Microchip Technology Inc.

PIC32
5.1

Programming Interface

Figure 5-2 shows the basic programming interface in
PIC32 devices. Descriptions of each interface block are
provided in subsequent sections.

FIGURE 5-2:

BASIC PIC32 PROGRAMMING INTERFACE BLOCK DIAGRAM

TMS
TCK

Common
ETAP

VDD/VDDIO/VDD1V8CORE
VBAT/VDDR1V8

CPU

TDI

VSS/VSS1V8

TDO
MTAP

Flash
Controller

2-wire
to
4-wire

Memory

MCLR

or
PGECx
PGEDx

5.1.1

ETAP

Flash

5.1.4

CPU

This block serially feeds instructions and data into the
CPU.

The CPU executes instructions at 8 MHz through the
internal oscillator.

5.1.2

5.1.5

MTAP

In addition to the EJTAG TAP (ETAP) controller, the
PIC32 device uses a second proprietary TAP controller
for additional operations. The Microchip TAP (MTAP)
controller supports two instructions relevant to
programming: MTAP_COMMAND and TAP switch
Instructions. See Table 20-1 for a complete list of
Instructions. The MTAP_COMMAND instruction provides
a mechanism for a JTAG probe to send commands to
the device through its Data register.
The programmer sends commands by shifting in the
MTAP_COMMAND instruction through the SendCommand
pseudo operation, and then sending the MTAP_COMMAND DR commands through the XferData pseudo
operation, see Table 20-2 for specific commands.
The probe does not need to issue a MTAP_COMMAND
instruction for every command shifted into the Data
register.

5.1.3

2-WIRE TO 4-WIRE

This block converts the 2-wire ICSP interface to the
4-wire JTAG interface.

 2007-2017 Microchip Technology Inc.

FLASH CONTROLLER

The Flash controller controls erasing and programming
of the Flash memory on the device.

5.1.6

FLASH MEMORY

The PIC32 device Flash memory is divided into two
logical Flash partitions consisting of the Boot Flash
Memory (BFM) and Program Flash Memory (PFM).
The BFM begins at address 0x1FC00000, and the PFM
begins at address 0x1D000000. Each Flash partition is
divided into pages, which represent the smallest block
of memory that can be erased. Depending on the
device, page sizes are 256 words (1024 bytes), 1024
words (4096 bytes), or 4096 words (16,384 bytes).
Row size indicates the number of words that are
programmed with the row program command. There
are always 8 rows within a page; therefore, devices
with 256, 1024, and 4096 word page sizes have 32,
128, and 512 word row sizes, respectively. Table 5-1
shows the PFM, BFM, row, and page size of each
device family.
Memory locations of the BFM are reserved for the
device Configuration registers, see Section 19.0
“Configuration Memory and Device ID” for more
information.

DS60001145U-page 9

PIC32
TABLE 5-1:

CODE MEMORY SIZE

PIC32 Device

Row Size Page Size
(Words) (Words)

PIC32MX
110/120/130/150/170
210/220/230/350/270
(28/36/44-pin Devices Only)
PIC32MX
120/130/150/170/230/250/
270/530/550/570
(64/100-pin Devices Only)

Boot Flash Memory Address
(Bytes) (See Note 1)

Programming Executive
(See Notes 2 and 3)

0x1FC00000-0x1FC00BFF (3 KB)
32

RIPE_11_aabbcc.hex

256

PIC32MX
15X/17X/25X/27X
(28/44-pin Devices Only)

0x1FC00000-0x1FC02FFF (12 KB)

PIC32MX
330/350/370/430/450/470
PIC32MX
320/340/360/420/440/460

128

1024

0x1FC00000-0x1FC02FFF (12 KB)

RIPE_06_aabbcc.hex

PIC32MK
0512/1024XXD/E/F/K/L/M

128

1024

0x1FC00000-0x1FC04FFF (20 KB)
0x1FC20000-0x1FC24FFF (20 KB)

RIPE_15a_aabbcc.hex

PIC32MK
0256/0512XXG/H

128

1024

0x1FC00000-0x1FC04FFF (20 KB)

RIPE_15a_aabbcc.hex

PIC32MZ
05XX/10XX/20XX

512

4096

0x1FC00000-0x1FC13FFF (80 KB)
0x1FC20000-0x1FC33FFF (80 KB)

RIPE_15_aabbcc.hex

PIC32MX
534/564/664/764
PIC32MX
575/675/695/795

Note 1:

Program Flash Memory address ranges are based on Program Flash size are as follows:
• 0x1D000000-0x1D003FFF (16 KB)
• 0x1D000000-0x1D007FFF (32 KB)
• 0x1D000000-0x1D00FFFF (64 KB)
• 0x1D000000-0x1D01FFFF (128 KB)
• 0x1D000000-0x1D03FFFF (256 KB)
• 0x1D000000-0x1D07FFFF (512 KB)
• 0x1D000000-0x1D0FFFFF (1024 KB)
• 0x1D000000-0x1D1FFFFF (2048 KB)
All Program Flash memory sizes are not supported by each family.

The Programming Executive can be obtained from the related product page on the Microchip web site, or it can
be located in the following MPLAB® X IDE installation folders:
…\Microchip\MPLABX\\mplab_ide\mplablibs\modules\ext\REALICE.jar
…\Microchip\MPLABX\\mplab_ide\mplablibs\modules\ext\ICD3.jar
…\Microchip\MPLABX\\mplab_ide\mplablibs\modules\ext\PICKIT3.jar
The last characters of the file name, aabbcc, vary based on the revision of the file.

DS60001145U-page 10

 2007-2017 Microchip Technology Inc.

PIC32
5.2

4-wire JTAG Details

The 4-wire interface uses standard JTAG (IEEE
1149.1-2001) interface signals.
•
•
•
•

TCK: Test Clock – drives data in/out
TMS: Test Mode Select – selects operational mode
TDI: Test Data Input – data into the device
TDO: Test Data Output – data out of the device

Since only one data line is available, the protocol is
necessarily serial (like SPI). The clock input is at the
TCK pin. Configuration is performed by manipulating a
state machine bit by bit through the TMS pin. One bit of
data is transferred in and out per TCK clock pulse at the
TDI and TDO pins. Different instruction modes can be
loaded to read the chip ID or manipulate chip functions.
Data presented to TDI must be valid for a chip-specific
setup time before, and hold time, after the rising edge
of TCK. TDO data is valid for a chip-specific time after
the falling edge of TCK, refer to Figure 5-3.

FIGURE 5-3:

4-WIRE JTAG INTERFACE

TCK

TMS

‘1’

‘0’

‘1’

TDI

iLSb

iMSb

TDO

oLSb

oMSb

 2007-2017 Microchip Technology Inc.

‘1’

‘0’

DS60001145U-page 11

PIC32
5.3

5.3.2

2-wire ICSP Details

In 2-phase ICSP mode, the TMS and TDI device pins
are multiplexed into PGEDx in two clocks, see
Figure 5-5. The LSb is shifted first; and TDI and TMS
are sampled on the falling edge of PGECx. There is no
TDO output provided in this mode. The 2-phase ICSP
mode was designed to accelerate 2-wire, write-only
transactions.

In ICSP mode, the 2-wire ICSP signals are time
multiplexed into the 2-wire to 4-wire block. The 2-wire
to 4-wire block then converts the signals to look like a
4-wire JTAG port to the TAP controller. The following
are two possible modes of operation:
• 4-phase ICSP
• 2-phase ICSP

5.3.1

Note:

4-PHASE ICSP

In 4-phase ICSP mode, the TDI, TDO and TMS device
pins are multiplexed onto PGEDx in four clocks, see
Figure 5-4. The Least Significant bit (LSb) is shifted
first; and TDI and TMS are sampled on the falling edge
of PGECx, while TDO is driven on the falling edge of
PGECx. The 4-phase ICSP mode is used for both read
and write data transfers.

FIGURE 5-4:

2-PHASE ICSP

The packet is not actually executed until
the first clock of the next packet. To enter
2-wire, 2-phase ICSP mode, the TDOEN
bit (DDPCON<0> or CFGCON<0>) must
be set to ‘0’.

2-WIRE, 4-PHASE

TCK

TMS

‘1’

‘0’

‘1’

TDI

IR0

IR4

TDO

‘0’

PGECx
PGEDx

DS60001145U-page 12

pTDO = 1

TDI = IR0

TMS = 0

nTDO = 0

 2007-2017 Microchip Technology Inc.

PIC32
FIGURE 5-5:

2-WIRE, 2-PHASE

TCK

TMS

‘1’

‘0’

‘1’

TDI

IR0

IR4

TDO

‘0’

PGECx
PGEDx

TMS = 0

SYNCHRONIZATION

When asserting the PGEDx pin high, there may be
contention on the pin as the device may attempt to
drive TDO out onto the pin while the in-circuit emulator
is driving in. This will only occur for a maximum of one
cycle as TMS high will advance the EJTAG state
machine out of a Shift-IR or Shift-DR state.

Some PIC32 devices can Reset the internal EJTAG
state machine if the attached programmer loses synchronization with it. This can occur when noise is present on the PGCx signal.
To achieve resynchronization, the PGEDx pin is held
high for 24 PGECx clock cycles. This forces five TMS
events into the EJTAG controller and will place the
EJTAG state machine into a Test Idle Reset. See
Figure 5-6 for an example of how to achieve
resynchronization.

PGECx

ACHIEVING RESYNCHRONIZATION

PGEDx
TDO Contention

 2007-2017 Microchip Technology Inc.

FIGURE 5-6:

Synchronization in 2-wire, 2-phase mode is not
supported.

5.3.3

TDI = IR0

Synchronization achieved

DS60001145U-page 13

PIC32
6.0

PSEUDO OPERATIONS

6.1

SetMode Pseudo Operation

To simplify the description of programming details, all
operations will be described using pseudo operations.
There are several functions used in the pseudo-code
descriptions. These are used either to make the
pseudo-code
more
readable,
to
abstract
implementation-specific behavior, or both. When
passing parameters with pseudo operation, the
following syntax will be used:

Format:
SetMode (mode)

• 5’h0x03 – send 5-bit hexadecimal value of 3
• 6’b011111 – send 6-bit binary value of 31

Restrictions:
None.

These functions are defined in this section, and include
the following operations:
•
•
•
•
•

Purpose:
To set the EJTAG state machine to a specific state.
Description:
The value of mode is clocked into the device on
signal TMS. TDI is set to a ‘0’ and TDO is ignored.

Example:
SetMode (6’b011111)

SetMode (mode)
SendCommand (command)
oData = XferData (iData)
oData = XferFastData (iData)
oData = XferInstruction (instruction)

FIGURE 6-1:

SetMode 4-WIRE
Mode = 6’b011111
TCK

TMS

‘1’

‘0’

‘1’

TDI

TDO

FIGURE 6-2:

SetMode 2-WIRE
Mode = 6’b011111

PGECx

PGEDx

DS60001145U-page 14

TDI = 0

TMS = 1

TDO = 1

TDI = 0

TMS = 0

TDO = x

 2007-2017 Microchip Technology Inc.

PIC32
6.2

SendCommand Pseudo Operation

Format:
SendCommand (command)
Purpose:
To send a command to select a specific TAP register.
Description (in sequence):
1.
2.
3.

The TMS Header is clocked into the device to
select the Shift IR state
The command is clocked into the device on
TDI while holding signal TMS low.
The last Most Significant bit (MSb) of the
command is clocked in while setting TMS
high.
The TMS Footer is clocked in on TMS to return
the TAP controller to the Run/Test Idle state.

Restrictions:
None.
Example:
SendCommand (5’h0x07)

FIGURE 6-3:

SendCommand 4-WIRE
TMS Header = 1100

Command = 5’h0x07

Command (MSb)
+ TMS = 1

TMS Footer = 10

TCK

‘1’

TMS

‘1’

‘0’

TDI

‘1’

FIGURE 6-4:

‘0’

iMSb

iLSb

TDO

‘1’

SendCommand 2-WIRE (4-PHASE)

TMS Header = 1100

Command (5’h0x07) + TMS = 0 Command (MSb) + TMS = 1

TMS Footer = 10

PGECx
PGEDx

TDI = 0

TMS = 1

TDO = x

 2007-2017 Microchip Technology Inc.

TDI = iLSb TMS = 0

TDO = x

TDI = iMSb TMS = 1

TDO = x

TDI = 0

TMS = 1

TDO = x

DS60001145U-page 15

PIC32
6.3

XferData Pseudo Operation

Format:
oData = XferData (iData)
Purpose:
To clock data to and from the register selected by the
command.
Description (in sequence):
1. The TMS Header is clocked into the device to
select the Shift DR state.
2. The data is clocked in/out of the device on
TDI/TDO while holding signal TMS low.
3. The last MSb of the data is clocked in/out
while setting TMS high.
4. The TMS Footer is clocked in on TMS to return
the TAP controller to the Run/Test Idle state.
Restrictions:
None.
Example:
oData = XferData (32’h0x12)

FIGURE 6-5:

XferData 4-WIRE
TMS Header = 100

Data (32’h0x12) Data (MSb) + TMS =1

TMS Footer = 10

TCK

TMS

‘1’

‘0’

TDI

iLSb

iMSb

TDO

oLSb

oMSb

FIGURE 6-6:

‘0’

‘1’

XferData 2-WIRE (4-PHASE)
TMS Header = 100

PGEC
PGED

TDI = 0 TMS = 1

TDO = X

TDI = 0 TMS = 0

Data (31’h0x12) + TMS = 0

TDI = iLSb TMS = 0

TDI = 0

TDO = X

TMS = 0

TDO = oLSb

Data (MSb) + TMS Footer = 1

TDI = iMSb TMS = 1

TDO =...
oLSb+1

TDO = X

TMS Footer = 10

TDI = 0 TMS = 1

DS60001145U-page 16

TDO = X

TDI = 0

TMS = 0

TDO = X

 2007-2017 Microchip Technology Inc.

PIC32
6.4

XferFastData Pseudo Operation

Restrictions:
The SendCommand (ETAP_FASTDATA) must be sent
first to select the Fastdata register, as shown in
Example 6-1. See Table 20-4 for a detailed descriptions
of commands.

Format:
oData = XferFastData (iData)
Purpose:
To quickly send 32 bits of data in/out of the device.

Note:

Description (in sequence):
1. The TMS Header is clocked into the device to
select the Shift DR state.
Note:

EXAMPLE 6-1:

SendCommand

// Select the Fastdata Register
SendCommand(ETAP_FASTDATA)
// Send/Receive 32-bit Data
oData = XferFastData(32’h0x12)

The input value of the PrAcc bit, which is ‘0’, is
clocked in.
Note:

For 2-wire (4-phase) – on the last clock,
the oPrAcc bit is shifted out on TDO while
clocking in the TMS Header. If the value of
oPrAcc is not ‘1’, the whole operation
must be repeated.

The 2-phase XferData is only used when
talking to the PE. See Section 17.0 “The
Programming Executive” for more
information.

For 2-wire (4-phase) – the TDO during this
operation will be the LSb of output data.
The rest of the 31 bits of the input data are
clocked in and the 31 bits of output data
are clocked out. For the last bit of the input
data, the TMS Footer = 1 is set.

TMS Footer = 10 is clocked in to return the TAP
controller to the Run/Test Idle state.

FIGURE 6-7:

XferFastData 4-WIRE

TMS Header = 100

PrAcc

Data (32’h0x12)

Data (MSb) + TMS = 1

TMS Footer = 10

TCK

TMS

‘1’

‘0’

‘1’

TDI

‘0’

iLSb

iMSb

TDO

‘1’

oLSb

oMSb

FIGURE 6-8:

‘1’

‘0’

XferFastData 2-WIRE (2-phase)
TMS Header = 100

PrAcc

Data (32’h0x12)

Data (MSb) TMS = 1

TMS Footer = 10

PGECx
PGEDx

TDI = X TMS = 1

 2007-2017 Microchip Technology Inc.

TDI = 0 TMS = 0 TDI =
iLSb

TMS = 0

TDI =
MSb

TMS = 1 TDI = X TMS = 1

DS60001145U-page 17

PIC32
FIGURE 6-9:

XferFastData 2-WIRE (4-PHASE)
TMS Header = 100

PGECx
PGEDx

TDI = 0 TMS = 1

TDO = X

TDI = 0

TMS = 0

TDO = X

TDI = 0

Data (31’h12) + TMS = 0

PrAcc

TDI = 0

TMS = 0

TDO = oLSb

TDI = iLSb TMS = 0

TDO = oLSb+1

TMS = 0

TDO = oPrAcc

Data (MSb) + TMS Footer = 1

TDI = iMSb

TMS = 1

TDO = X

TMS Footer = 10

TDI = 0 TMS = 1

DS60001145U-page 18

TDO = X

TDI = 0

TMS = 0

TDO = X

 2007-2017 Microchip Technology Inc.

PIC32
6.5

XferInstruction Pseudo
Operation

Format:
XferInstruction (instruction)
Purpose:
To send 32 bits of data for the device to execute.
Description:
The instruction is clocked into the device and then
executed by CPU.
Restrictions:
The device must be in Debug mode.

EXAMPLE 6-2:

XferInstruction

XferInstruction (instruction)
{
// Select Control Register
SendCommand(ETAP_CONTROL);
// Wait until CPU is ready
// Check if Processor Access bit (bit 18) is set
do {
controlVal = XferData(32’h0x0004C000);
} while( PrAcc(contorlVal<18>) is not ‘1’ );
// Select Data Register
SendCommand(ETAP_DATA);
// Send the instruction
XferData(instruction);
// Tell CPU to execute instruction
SendCommand(ETAP_CONTROL);
XferData(32’h0x0000C000);
}

 2007-2017 Microchip Technology Inc.

DS60001145U-page 19

PIC32
6.6

ReadFromAddress Pseudo
Operation

Format:
oData = ReadFromAddress (address)
Purpose:
To send 32 bits of data to the device memory.
Description:
The 32-bit data is read from the memory at the
address specified in the “address” parameter.
Restrictions:
The device must be in Debug mode.

EXAMPLE 6-3:

ReadFromAddress FOR PIC32MX, PIC32MZ, AND PIC32MK DEVICES

ReadFromAddress (address)
{
// Load Fast Data register address to s3
instruction = 0x3c130000;
instruction |= (0xff200000>>16)&0x0000ffff;
XferInstruction(instruction); // lui s3, - set address of fast
data register
// Load memory address to be read into t0
instruction = 0x3c080000;
instruction |= (address>>16)&0x0000ffff;
XferInstruction(instruction); // lui t0, - set address of data
instruction = 0x35080000;
instruction |= (address&0x0000ffff);
XferInstruction(instruction); // ori t0, - set address of data
// Read data
XferInstruction(0x8d090000); // lw

t1, 0(t0)

// Store data into Fast Data register
XferInstruction(0xae690000); // sw t1, 0(s3) - store data to fast data register
XferInstruction(0); // nop
// Shift out the data
SendCommand(ETAP_FASTDATA);
oData = XferFastData(32'h0x00000000);
return oData;
}

DS60001145U-page 20

 2007-2017 Microchip Technology Inc.

PIC32
6.7

Synchronize Pseudo Operation

Format:
Synchronize ()
Purpose:
To reset the EJTAG state machine into Test Idle
Reset.
Description:
The PGEDx signal is held high for 24 PGECx clock
cycles. All other signals are ignored.
Restrictions:
None.

PGEDx
TDO Contention

 2007-2017 Microchip Technology Inc.

PGECx

ACHIEVING RESYNCHRONIZATION

FIGURE 6-10:

Synchronization achieved

DS60001145U-page 21

PIC32
7.0

ENTERING 2-WIRE ENHANCED
ICSP MODE

The key sequence is a specific 32-bit pattern: ‘0100
1101 0100 0011 0100 1000 0101 0000’ (the
acronym ‘MCHP’, in ASCII). The device will enter
Program/Verify mode only if the key sequence is valid.
The MSb of the Most Significant nibble must be shifted
in first.

To use the 2-wire PGEDx and PGECx pins for programming, they must be enabled. Note that any pair of
programming pins available on a particular device may
be used, however, they must be used as a pair. PGED1
must be used with PGEC1, and so on.
Note:

Once the key sequence is complete, VIH must be
applied to the MCLR pin and held at that level for as
long as the 2-wire Enhanced ICSP interface is to be
maintained. An interval of at least time P19 and P7
must elapse before presenting data on PGEDx. Signals
appearing on PGEDx before P7 has elapsed will not be
interpreted as valid.

If using the 4-wire JTAG interface, the
following procedure is not necessary.

The following steps are required to enter 2-wire
Enhanced ICSP mode:
1.
2.
3.

The MCLR pin is briefly driven high, then low.
A 32-bit key sequence is clocked into PGEDx.
The MCLR pin is then driven high within a
specified period of time and held.

Upon successful entry, the programming operations
documented in subsequent sections can be performed.
While in 2-wire Enhanced ICSP mode, all unused I/Os
are placed in the high-impedance state.
Note:

Refer to Section 21.0 “AC/DC Characteristics and
Timing Requirements” for timing requirements.
The programming voltage applied to the MCLR pin is
VIH, which is essentially VDD, in PIC32 devices. There
is no minimum time requirement for holding at VIH.
After VIH is removed, an interval of at least P18 must
elapse before presenting the key sequence on PGEDx.

FIGURE 7-1:

Entry into ICSP mode places the device in
Reset to prevent instructions from
executing. To release the Reset, the
MCHP_DE_ASSERT_RST command must
be issued.

ENTERING ENHANCED ICSP™ MODE
P20

P6
P14
MCLR

P19

VIH

VDD
Program/Verify Entry Code = 0x4D434850
0
b31

PGEDx

1
b30

0
b29

0
b28

1
...
b27

0
b3

0
b2

0
b1

0
b0

PGECx
P18

DS60001145U-page 22

P1A
P1B

 2007-2017 Microchip Technology Inc.

PIC32
8.0

CHECK DEVICE STATUS

Before a device can be programmed, the programmer
must check the status of the device to ensure that it is
ready to receive information.

FIGURE 8-1:

CHECK DEVICE STATUS

8.1

4-wire Interface

The setup sequence to enter 4-wire JTAG programming should be done while asserting the MCLR pin.
Once the programming mode is entered, the MCLR pin
can be released to allow the processor to execute
instructions or drive ports.
The following steps are required to check the device
status using the 4-wire interface:

Set MCLR low

4-wire

SetMode (6’b011111)

SendCommand (MTAP_SW_MTAP)

Set the MCLR pin low.
SetMode (6’b011111) to force the Chip TAP
controller into Run Test/Idle state.
SendCommand (MTAP_SW_MTAP).
SetMode (6’b011111) to force the Chip TAP
controller into Run Test/Idle state.
SendCommand (MTAP_COMMAND).
statusVal = XferData (MCHP_STATUS).
If CFGRDY (statusVal<3>) is not ‘1’ and
FCBUSY (statusVal<2>) is not ‘0’ GOTO step 5.

1.
2.
3.
4.
5.
6.
7.

Note:
SetMode (6’b011111)

SendCommand (MTAP_COMMAND)

statusVal = XferData (MCHP_STATUS)

FCBUSY = 0
CFGRDY = 1

8.2

2-wire Interface

The following steps are required to check the device
status using the 2-wire interface:
1.

Yes
Done

2.
3.
4.
5.
6.

SetMode (6’b011111) to force the Chip TAP
controller into Run Test/Idle state.
SendCommand (MTAP_SW_MTAP).
SetMode (6’b011111) to force the Chip TAP
controller into Run Test/Idle state.
SendCommand (MTAP_COMMAND).
statusVal = XferData (MCHP_STATUS).
If CFGRDY (statusVal<3>) is not ‘1’ and
FCBUSY (statusVal<2>) is not ‘0’, GOTO
step 4.
Note:

 2007-2017 Microchip Technology Inc.

If using the 4-wire interface, the oscillator
source, as selected by the Configuration
Words, must be present to access the
Flash memory. In an unprogrammed
device, the oscillator source is the internal
FRC allowing for Flash memory access. If
the Configuration Words have been
reprogrammed selecting an external
oscillator source then it must be present
for Flash memory access. See the
“Special Features” chapter in the
specific device data sheet for details
regarding oscillator selection using the
Configuration Word settings.

If the CFGRDY and FCBUSY bits do not
come to the proper state within 10 ms, the
sequence may have been executed
incorrectly or the device is damaged.

DS60001145U-page 23

PIC32
9.0

ERASING THE DEVICE

FIGURE 9-1:

Before a device can be programmed, it must be
erased. The erase operation writes all ‘1s’ to the Flash
memory and prepares it to program a new set of data.
Once a device is erased, it can be verified by
performing a “Blank Check” operation. See
Section 9.1 “Blank Check” for more information.

Select MTAP
SendCommand (MTAP_SW_MTAP)

SetMode (6’b011111)

The procedure for erasing program memory (Program,
boot, and Configuration memory) consists of selecting
the MTAP and sending the MCHP_ERASE command.
The programmer must wait for the erase operation to
complete by reading and verifying bits in the
MCHP_STATUS value. Figure 9-1 illustrates the process
for performing a Chip Erase.
Note:

ERASE DEVICE

Put MTAP in Command Mode
SendCommand (MTAP_COMMAND)

Issue Chip Erase Command
XferData (MCHP_ERASE)

The Device ID memory locations are readonly and cannot be erased. Therefore,
Chip Erase has no effect on these memory
locations.

XferData (MCHP_DE_ASSERT_RST)
Not required for PIC32MX Devices

The following steps are required to erase a target
device:
1.
2.
3.
4.
5.
6.
7.
8.

SendCommand (MTAP_SW_MTAP).
SetMode (6’b011111).
SendCommand (MTAP_COMMAND).
XferData (MCHP_ERASE).
XferData (MCHP_DE_ASSERT_RST). This step is
not required for PIC32MX devices.
Delay 10 ms.
statusVal = XferData (MCHP_STATUS).
If CFGRDY (statusVal<3>) is not ‘1’ and
FCBUSY (statusVal<2>) is not ‘0’, GOTO to step
5.
Note:

10 milliseconds Delay

Read Erase Status
statusVal = XferData (MCHP_STATUS)

FCBUSY = 0
CFGRDY = 1

The Chip Erase operation is a self-timed
operation. If the FCBUSY and CFGRDY
bits do not set properly within the specified
Chip Erase time, the sequence may have
been executed incorrectly or the device is
damaged.

Yes
Done

9.1

Blank Check

The term “Blank Check” implies verifying that the
device has been successfully erased and has no
programmed memory locations. A blank or erased
memory location always reads as ‘1’.
The device Configuration registers are ignored by the
Blank Check. Additionally, all unimplemented memory
space should be ignored from the Blank Check.

DS60001145U-page 24

 2007-2017 Microchip Technology Inc.

PIC32
10.0

ENTERING SERIAL
EXECUTION MODE

Before programming a device, it must be placed in
Serial Execution mode. The procedure for entering
Serial Execution mode consists of verifying that the
device is not code-protected. If the device is codeprotected, a Chip Erase must be performed. See
Section 9.0 “Erasing the Device” for details.

FIGURE 10-1:

ENTERING SERIAL
EXECUTION MODE

Select MTAP
SendCommand (MTAP_SW_MTAP)

SetMode (6’b011111)

Put MTAP in Command Mode
SendCommand (MTAP_COMMAND)

Read Code-Protect Status
statusVal = XferData (MCHP_STATUS)

CPS = 1

Cannot Enter
Must Erase First

Yes
Assert Reset
XferData (MCHP_ASSERT_RST)

2-wire

Select ETAP
SendCommand (MTAP_SW_ETAP)

SetMode (6’b011111)

Put CPU in Serial Exec Mode
SendCommand (ETAP_EJTAGBOOT)

Select MTAP
SendCommand (MTAP_SW_MTAP)

Set MCLR High
4-wire

SetMode (6’b011111)

Put MTAP in Command Mode
SendCommand (MTAP_COMMAND)

Release Reset
XferData (MCHP_DE_ASSERT_RST)

Enable Flash
XferData (MCHP_FLASH_EN)
Required for PIC32MX devices

Select ETAP
SendCommand (MCHP_SW_ETAP)

SetMode (6’b011111)
2-wire

 2007-2017 Microchip Technology Inc.

DS60001145U-page 25

PIC32
10.1

4-wire Interface

The following steps are required to enter Serial
Execution mode:
Note:

1.
2.
3.
4.
5.
6.
7.
8.
9.

It is assumed that the MCLR pin has been
driven low from the previous Check
Device Status step (see Figure 8-1).

10.2

The following steps are required to enter Serial
Execution mode:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.

DS60001145U-page 26

2-wire Interface

SendCommand (MTAP_SW_MTAP).
SetMode (6’b011111).
SendCommand (MTAP_COMMAND).
statusVal = XferData (MCHP_STATUS).
If CPS (statusVal<7>) is not ‘1’, the device must
be erased first.
XferData (MCHP_ASSERT_RST).
SendCommand (MTAP_SW_ETAP).
SetMode (6’b011111).
SendCommand (ETAP_EJTAGBOOT).
SendCommand (MTAP_SW_MTAP).
SetMode (6’b011111).
SendCommand (MTAP_COMMAND).
XferData (MCHP_DE_ASSERT_RST).
XferData (MCHP_FLASH_ENABLE). This step is
required for PIC32MX family devices.
SendCommand (MTAP_SW_ETAP).
SetMode (6’b011111).

 2007-2017 Microchip Technology Inc.

PIC32
11.0

DOWNLOADING THE
PROGRAMMING EXECUTIVE
(PE)

The PE resides in RAM memory and is executed by the
CPU to program the device. The PE provides the
mechanism for the programmer to program and verify
PIC32 devices using a simple command set and
communication protocol. There are several basic
functions provided by the PE:
•
•
•
•
•
•

Read memory
Erase memory
Program memory
Blank check
Read executive firmware revision
Get the Cyclic Redundancy Check (CRC) of Flash
memory locations

The PE performs the low-level tasks required for
programming and verifying a device. This allows the
programmer to program the device by issuing the
appropriate commands and data. A detailed
description for each command is provided in
Section 17.2 “The PE Command Set”.

Table 11-1 lists the steps that are required to download
the PE.

TABLE 11-1:

DOWNLOAD THE PE
OP CODES

Operation

Operand

Step 1:

lui
ori
lui
ori
sw

PIC32MX devices only: Initialize BMXCON to
0x1F0040. The instruction sequence executed by
the PIC32 core is:
a0,0xbf88
a0,a0,0x2000 /* address of BMXCON */
a1,0x1f
a1,a1,0x40
/* a1 has 0x1f0040 */
a1,0(a0)
/* BMXCON initialized */

XferInstruction 0x3c04bf88
XferInstruction 0x34842000
XferInstruction 0x3c05001f
XferInstruction 0x34a50040
XferInstruction 0xac850000
Step 2:

li
sw

PIC32MX devices only: Initialize BMXDKPBA to
0x800. The instruction sequence executed by the
PIC32 core is:
a1,0x800
a1,16(a0)

XferInstruction 0x34050800

The PE uses the device’s data RAM for variable
storage and program execution. After the PE has run,
no assumptions should be made about the contents of
data RAM.

XferInstruction 0xac850010

After the PE is loaded into the data RAM, the PIC32
family can be programmed using the command set
shown in Table 17-1.

lw
sw
sw

Step 3:

PIC32MX devices only: Initialize BMXDUDBA
and BMXDUPBA to the value of BMXDRMSZ.
The instruction sequence executed by the PIC32
core is:
a1,64(a0)
/* load BMXDMSZ */
a1,32(a0)
a1,48(a0)

XferInstruction 0x8C850040

FIGURE 11-1:

DOWNLOADING THE PE

XferInstruction 0xac850020
XferInstruction 0xac850030
Step 4:

Write the PE Loader to RAM

Set up PIC32 RAM address for PE. The instruction sequence executed by the PIC32 core is:
lui a0,0xa000
ori a0,a0,0x800
XferInstruction 0x3c04a000
XferInstruction 0x34840800

Load the PE

Step 5:

Loading the PE in the memory is a two step process:
1.

Load the PE loader in the data RAM. (The PE
loader loads the PE binary file in the proper
location of the data RAM, and when done,
jumps to the programming exec and starts
executing it.)
Feed the PE binary to the PE loader.
lui
ori
sw
addiu

Load the PE_Loader. Repeat this step (Step 5)
until the entire PE_Loader is loaded in the PIC32
memory. In the operands field, “” represents the MSbs 31 through 16 of the
PE loader op codes shown in Table 11-2. Likewise, “” represents the LSbs
15 through 0 of the PE loader op codes shown in
Table 11-2. The “++” sign indicates that when
these operations are performed in succession,
the new word is to be transferred from the list of
op codes of the LPE Loader shown in Table 11-2.
The instruction sequence executed by the PIC32
core is:
a2,
a2,a2,
a2,0(a0)
a0,a0,4

XferInstruction (0x3c06 )

 2007-2017 Microchip Technology Inc.

DS60001145U-page 27

PIC32
TABLE 11-1:

DOWNLOAD THE PE
OP CODES (CONTINUED)

Operation

Operand

TABLE 11-2:

PE LOADER OP CODES

Op code

Instruction

0x24840004

addiu

a0, a0, 4

XferInstruction (0x34c6 )

0x1460fffb

bnez

v1,

XferInstruction 0xac860000

0x00000000

nop

XferInstruction 0x24840004

0x1000fff3

Step 6:

0x00000000

nop

0x3c02a000

lui

v0, 0xa000

0x34420900

ori

v0, v0, 0x900

0x00400008

0x00000000

nop

lui
ori
jr
nop

Jump to the PE_Loader. The instruction
sequence executed by the PIC32 core is:
t9,0xa000
t9,t9,0x800
t9

XferInstruction 0x3c19a000
XferInstruction 0x37390800

here3:

XferInstruction 0x03200008
XferInstruction 0x00000000
Step 7:

Load the PE using the PE_Loader. Repeat the
last instruction of this step (Step 7) until the entire
PE is loaded into the PIC32 memory. In this step,
you are given an Intel® Hex format file of the PE
that you will parse and transfer a number of 32-bit
words at a time to the PIC32 memory (refer to
Appendix B: “Hex File Format”). The instruction
sequence executed by the PIC32 is shown in
Table 11-2.

SendCommand

ETAP_FASTDATA

XferFastData

PE_ADDRESS (Address of PE
program block from PE Hex
file)

XferFastData

PE_SIZE (Number of 32-bit
words of the program block
from PE Hex file)

XferFastData

PE software op code from PE
Hex file (PE Instructions)

Step 8:

Jump to the PE. Magic number (0xDEAD0000)
instructs the PE_Loader that the PE is completely
loaded into the memory. When the PE_Loader
sees the magic number, it jumps to the PE.

XferFastData

0x00000000

XferFastData

0xDEAD0000

TABLE 11-2:

PE LOADER OP CODES

Op code

Instruction

0x3c07dead

lui

a3, 0xdead

0x3c06ff20

lui

a2, 0xff20

0x3c05ff20

lui

al, 0xff20

herel:
0x8cc40000

0x8cc30000

a0, 0 (a2)
v1, 0 (a2)

0x1067000b

beq

v1, a3,

0x00000000

nop

0x1060fffb

beqz

0x00000000

nop

0x8ca20000

v0, 0 (a1)

0x2463ffff

addiu

v1, v1, -1

0xac820000

v0, 0 (a0)

v1,

here2:

DS60001145U-page 28

 2007-2017 Microchip Technology Inc.

PIC32
12.0

DOWNLOADING A DATA
BLOCK

To program a block of data to the PIC32 device, it must
be loaded into SRAM.

12.1

Without the PE

To program a block of memory without using the PE,
the block of data must first be written to RAM. This
method requires the programmer to transfer the actual
machine instructions with embedded (immediate) data
for writing the block of data to the devices internal RAM
memory.

FIGURE 12-1:

12.2

With the PE

When using the PE, the steps in Section 12.0 “Downloading a Data Block” and Section 14.0 “Initiating a
Flash Row Write” are handled in two single commands:
ROW_PROGRAM and PROGRAM.
The ROW_PROGRAM command programs a single row of
Flash data, while the PROGRAM command programs
multiple rows of Flash data. Both of these commands
are documented in Section 17.0 “The Programming
Executive”.

DOWNLOADING DATA
WITHOUT THE PE

bufAddr = RAM Buffer Address

Write 32-bit Immediate
Data to bufAddr

Increment bufAddr

No
Done

The following steps are required to download a block of
data:
1.
2.

XferInstruction (op code).
Repeat Step 1 until the last instruction is
transferred to CPU.

TABLE 12-1:
Op code
Step 1:

lui

s0, 0xA000;

Write the entire row of data to be programmed
into system SRAM.

3c08
3508
ae08
Step 3:

Instruction

Initialize SRAM Base Address to 0xA0000000.

3c10a000
Step 2:

DOWNLOAD DATA OP
CODES

lui
t0, ;
ori
t0, t0, ;
sw
t0, (s0);
// OFFSET increments by 4

Repeat Step 2 until one row of data has been
loaded.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 29

PIC32
13.0

INITIATING A PAGE ERASE

An individual page may be erased rather than erasing
all of Flash memory. The PE is not used in this case.
PIC32MK family devices can perform an erase retry on
a page by increasing the internal voltage used to perform the erase.

TABLE 13-1:
Op Code

PAGE ERASE
OP CODES
Instruction

Step 1:

All PIC32 devices: Initialize constants. Registers
a1, a2, and a3 are set for WREN = 1 or
NVMOP<3:0> = 0100, WR = 1 and WREN = 1,
respectively. Registers s1 and s2 are set for the
unlock data values and s0 is initialized to ‘0’.
34054004
ori
a1, $0,0x4004
34068000
ori
a2,$0,0x8000
34074000
ori
a3,$0,0x4000
3c11aa99
lui
s1,0xaa99
36316655
ori
s1,s1,0x6655
3c125566
lui
s2,0x5566
365299aa
ori
s2,s2,0x99aa
3c100000
lui
s0,0x0000
Step 2: PIC32MX family devices only: Set register a0 to
the base address of the NVM register
(0xBF80_F400).
3c04bf80
lui
a0,0xbf80
3484f400
ori
a0,a0,0xf400
Step 3: PIC32MK and PIC32MZ family devices only:
Set register a0 to the base address of the NVM
register (0xBF80_0600). Register s3 is set for the
value used to disable write protection in NVMBPB.
3c04b480
lui
a0,0xbf80
34840600
ori
a0,a0,0x0600
34138080
ori
s3,$0,0x8080
Step 4: PIC32MK and PIC32MZ family devices only:
Unlock and disable Boot Flash write protection.
ac910010
sw
s1,16(a0)
ac920010
sw
s2,16(a0)
ac930090
sw
s3,144(a0)
00000000
nop
Step 5: PIC32MK family devices only: Save the contents
of NVMCON2.
8c9400a0
lw
s4,160(a0)
Step 6: PIC32MK family devices only: Set the initial
programming voltage level and enable page
testing (unlock required).
36953000
ori
s5,s4,0x3000
32b5fcff
andi s5,s5,0xFCFF
here3:
ac910010
sw
s1,16(a0)
ac920010
sw
s2,16(a0)
ac860008
sw
a2,8(a0)
ac9500a0
sw
s5,160(a0)

DS60001145U-page 30

TABLE 13-1:
Op Code

PAGE ERASE
OP CODES (CONTINUED)
Instruction

Step 7:

All PIC32 devices: Set the NVMADDR register
with the address of the Flash page to be erased.
3c08 lui t0,
3508 ori t0,t0,
ac880020
sw t0,32(a0)
Step 8: All PIC32 devices: Set up the NVMCON register
for write operation.
ac850000
sw a1,0(a0)
delay (6 us)
Step 9: PIC32MX devices only: Poll the LVDSTAT
register.
here1:
8c880000
lw
t0,0(a0)
31080800
andi t0,t0,0x0800
1500fffd
bne
t0,$0,here1
00000000
nop
Step 10: All PIC32 devices: Unlock the NVMCON register
and start the write operation.
ac910010
sw
s1,16(a0)
ac920010
sw
s2,16(a0)
ac860008
sw
a2,8(a0)
Step 11: All PIC32 devices: Loop until the WR bit
(NVMCON<15>) is clear.
here2:
8c880000
lw
t0,0(a0)
01064024
and
t0,t0,a2
1500fffd
bne
t0,$0,here2
00000000
nop
Step 12: All PIC32 devices: Wait at least 500 ns after
seeing a ‘0’ in the WR bit (NVMCON<15>) before
writing to any of the NVM registers. This requires
inserting a NOP in the execution. The following
example assumes that the core is executing at
8 MHz; therefore, four NOP instructions equate to
500 ns.
00000000
nop
00000000
nop
00000000
nop
00000000
nop
Step 13: All PIC32 devices: Clear the WREN bit
(NVMCON<14>).
ac870004
sw
a3,4(a0)

 2007-2017 Microchip Technology Inc.

PIC32
TABLE 13-1:
Op Code

PAGE ERASE
OP CODES (CONTINUED)
Instruction

Step 14: PIC32MK family devices only: Check that all
data in the page has been erased. If not, adjust
the voltage and try again. If all voltages levels
have been tried, fail, and go to error procedure.
ac870004
sw a3, 4(a0)
20171000
addi s7, $0, 4096
00005020
add t2, $0, $0
8c880020
lw t0, 32(a0)
01194020
add t0, t0, t9
here5:
8d090000
lw t1, 0(t0)
15200005
bne t1, $0, here6
214a0010
addi t2, t2, 16
11570009
beq t2, s7, here7
00000000
nop
1000fffa
beq $0, $0, here5
21080010
addi t0, t0, 16
here6:
22b50100
addi s5, s5, 256
32b60300
andi s6, s5, 768
16c0ffde
bne s6, $0, here3
00000000
nop
10000005
beq $0, $0, err_proc
00000000
nop
Step 15: PIC32MK family devices only: Restore the
NVMCON2 register.
here7:
ac9400a0
sw
s4,160(a0)
Step 16: All PIC32 devices: Check the WRERR bit
(NVMCON<13>) to ensure that the program
sequence has completed successfully. If an error
occurs, jump to the error processing routine.
8c880000
lw
t0,0(a0)
30082000
andi t0,t0,0x2000
1500 bne
t0,$0,
00000000
nop

 2007-2017 Microchip Technology Inc.

DS60001145U-page 31

PIC32
14.0
Note:

INITIATING A FLASH ROW
WRITE
Certain PIC32 devices have available
ECC memory. When the ECC feature is
used, the Flash memory must be
programmed in groups of four 32-bit
words using four, 32-bit word alignment. If
ECC
is
dynamically
used,
the
programming method determines when
the feature is used. ECC is not enabled
for words programmed with the single
word programming command. ECC is
enabled for words programmed in groups
of four, either with the quad word or row
programming commands. Failure to
adhere to these methods can result in
ECC DED errors during run-time. Refer to
the specific device data sheet for details
regarding ECC use and configuration.

14.2

Without the PE

Flash memory write operations are controlled by the
NVMCON register. Programming is performed by
setting the NVMCON register to select the type of write
operation and initiating the programming sequence by
setting the WR control bit (NVMCON<15>).

FIGURE 14-1:

INITIATING FLASH WRITE
WITHOUT THE PE

Unprotect Control Registers

Select Write Operation

Load Addresses in NVM Registers

Once a row of data has been downloaded into the
device’s SRAM, the programming sequence must be
initiated to write the block of data to the Flash memory.

Unlock Flash Controller

See Table 14-1 for the op code and instructions for
initiating a Flash row write.

Start Operation

14.1

Done

With the PE

When using the PE, the data is immediately written to
the Flash memory from the SRAM. No further action is
required.

In the Flash write procedure (see Table 14-1), the Row
Programming method is used to program the Flash
memory, as it is typically the most expedient. word and
Quad Word programming methods are also available,
depending on the device, and may be used or required
depending on your application. Refer to the “Flash
Program Memory” chapter in the specific device data
sheet and the related section of the “PIC32 Family
Reference Manual” for more information.
The following steps are required to initiate a Flash
write:
1.
2.

DS60001145U-page 32

XferInstruction (op code).
Repeat Step 1 until the last instruction is
transferred to the CPU.

 2007-2017 Microchip Technology Inc.

PIC32
TABLE 14-1:
Op Code
Step 1:

All PIC32 devices: Initialize constants. Registers
a1, a2, and a3 are set for WREN = 1 or
NVMOP<3:0> = 0011, WR = 1 and WREN = 1,
respectively. Registers s1 and s2 are set for the
unlock data values and s0 is initialized to ‘0’.

34054003
34068000
34074000
3c11aa99
36316655
3c125566
365299aa
3c100000
Step 2:

lui t0,
ori t0,t0,
sw t0,32(a0)

lui s0,
ori s0,s0,
sw s0,64(a0)

TABLE 14-1:
Op Code
Step 7:

PIC32MX devices only: Poll the LVDSTAT
register.

8C880000
31080800
1500fffd
00000000
Step 8:

here1:
lw t0,0(a0)
andi t0,t0,0x0800
bne t0,$0,here1
nop

All PIC32 devices: Unlock the NVMCON register
and start the write operation.

ac910010
ac920010
ac860008
Step 9:

INITIATE FLASH ROW WRITE
OP CODES (CONTINUED)
Instruction

sw s1,16(a0)
sw s2,16(a0)
sw a2,8(a0)

All PIC32 devices: Loop until the WR bit
(NVMCON<15>) is clear.

8c880000
01064024
1500fffd
00000000

here2:
lw t0,0(a0)
and t0,t0,a2
bne t0,$0,here2
nop

Step 10: All PIC32 devices: Wait at least 500 ns after
seeing a ‘0’ in the WR bit (NVMCON<15>) before
writing to any of the NVM registers. This requires
inserting a NOP in the execution. The following
example assumes that the core is executing at
8 MHz; therefore, four NOP instructions equate to
500 ns.
00000000
00000000
00000000
00000000

nop
nop
nop
nop

Step 11: All PIC32 devices: Clear the WREN bit
(NVMCONM<14>).
ac870004

sw a3,4(a0)

Step 12: All PIC32 devices: Check the WRERR bit
(NVMCON<13>) to ensure that the program
sequence has completed successfully. If an error
occurs, jump to the error processing routine.
lw t0,0(a0)
8c880000
andi t0,zero,0x2000
30082000
1500 bne t0, $0,
00000000
nop

PIC32MK and PIC32MZ family devices only: Set
the NVMSRCADDR register with the physical
source SRAM address (offset is 112).

3c10
3610
ac900070
Step 6:

sw s1,16(a0)
sw s2,16(a0)
sw s3,144(a0)
nop

PIC32MX devices only: Set the NVMSRCADDR
register with the physical source SRAM address
(offset is 64).

3c10
3610
ac900040
Step 5:

lui a0,0xbf80
ori a0,a0,0x0600
ori s3,$0,0x8080

All PIC32 devices: Set the NVMADDR register
with the address of the Flash row to be
programmed.

3c08
3508
ac880020
Step 5:

lui a0,0xbf80
ori a0,a0,0xf400

PIC32MK and PIC32MZ family devices only:
Unlock and disable Boot Flash write protection.

ac910010
ac920010
ac930090
00000000
Step 4:

a1,$0,0x4003
a2,$0,0x8000
a3,$0,0x4000
s1,0xaa99
s1,s1,0x6655
s2,0x5566
s2,s2,0x99aa
s0,0x0000

PIC32MK and PIC32MZ family devices only: Set
register a0 to the base address of the NVM
register (0xBF80_0600). Register s3 is set for the
value used to disable write protection in NVMBPB.

3c04bf80
34840600
34138080
Step 3:

ori
ori
ori
lui
ori
lui
ori
lui

PIC32MX devices only: Set register a0 to the
base address of the NVM register (0xBF80_F400).

3c04bf80
3484f400
Step 2:

INITIATE FLASH ROW WRITE
OP CODES
Instruction

lui s0,
ori s0,s0,
sw s0,112(a0)

All PIC32 devices: Set up the NVMCON register
for write operation.

ac850000

sw a1,0(a0)
delay (6 μs)

 2007-2017 Microchip Technology Inc.

DS60001145U-page 33

PIC32
15.0

VERIFY DEVICE MEMORY

The verify step involves reading back the code memory
space and comparing it with the copy held in the
programmer’s buffer. The Configuration registers are
verified with the rest of the code.
Note:

15.1

Because the Configuration registers
include the device code protection bit,
code memory should be verified immediately after writing (if code protection is
enabled). This is because the device will
not be readable or verifiable if a device
Reset occurs after the code-protect bit
has been cleared.

15.2

Verifying Memory without the PE

Reading from the Flash memory is performed by executing a series of read accesses from the Fastdata register. Table 20-4 shows the EJTAG programming
details, including the address and op code data for performing processor access operations.

FIGURE 15-2:

VERIFYING MEMORY
WITHOUT THE PE
Read Memory Location
using ReadFromAddress
Pseudo Operation

Verifying Memory with the PE

Memory verify is performed using the GET_CRC
command. Table 17-2 lists the op codes and
instructions.

FIGURE 15-1:

Verify Location

VERIFYING MEMORY
WITH THE PE

No
Done

Issue Verify Command

The following steps are required to verify memory:
Receive Response

1.
2.
3.

The following steps are required to verify memory using
the PE:
1.
2.
3.
4.

XferFastData (GET_CRC).
XferFastData (start_Address).
XferFastData (length).
valCkSum = XferFastData (32’h0x00).

Verify that valCkSum matches the checksum of the
copy held in the programmer’s buffer.

XferInstruction (op code).
Repeat Step 1 until the last instruction is
transferred to the CPU.
Verify that valRead matches the copy held in the
programmer’s buffer.
Repeat Steps 1-3 for each memory location.

TABLE 15-1:
Op code
Step 1:

Initialize some constants.

3c13ff20
Step 2:

VERIFY DEVICE OP CODES

Instruction
lui s3, 0xFF20

Read memory Location.

3c08 lui t0,
3508 ori t0, t0,
Step 3:

Write to Fastdata location.

8d090000
ae690000

DS60001145U-page 34

lw t1, 0(t0)
sw t1, 0(s3)

Step 4:

Read data from Fastdata register 0xFF200000.

Step 5:

Repeat Steps 2-4 until all configuration locations
are read.

 2007-2017 Microchip Technology Inc.

PIC32
16.0

EXITING PROGRAMMING
MODE

Once a device is programmed, it must be taken out of
programming mode to start proper execution of its new
program memory contents.

16.1

4-wire Interface

16.2

Exiting programming mode is done by removing VIH
from the MCLR pin, as illustrated in Figure 16-2. The
only requirement for exit is that an interval, P16, should
elapse between the last clock and program signals on
PGECx and PGEDx before removing VIH.

FIGURE 16-2:

Exiting programming mode is done by removing VIH
from the MCLR pin, as illustrated in Figure 16-1. The
only requirement for exit is that an interval, P16, should
elapse between the last clock and program signals
before removing VIH.

FIGURE 16-1:

2-wire Interface

2-WIRE EXIT
PROGRAMMING MODE
P16

P17
VIH

MCLR
VDD/VDDIO

4-WIRE EXIT
PROGRAMMING MODE

PGEDx

P16

VIH

PGECx

MCLR
PGEDx = Input
VDD/VDDIO

Use the following steps to exit programming mode:

TCK
TMS

‘1’

‘0’

TDI
TDO

1.
2.
3.
4.

SetMode (5’b11111).
Assert the MCLR pin.
Issue a clock pulse on PGECx.
Remove power (if the device is powered).

The following steps are required to exit programming
mode:
1.
2.
3.

SetMode (5’b11111).
Assert the MCLR pin.
Remove power (if the device is powered).

 2007-2017 Microchip Technology Inc.

DS60001145U-page 35

PIC32
17.0

THE PROGRAMMING
EXECUTIVE

Note: The Programming Executive (PE) is
included with your installation of MPLAB X
IDE. To download the appropriate PE file
for your device, please visit the related
product page on the Microchip web site
(www.microchip.com).

17.1

PE Communication

The programmer and the PE have a master-slave
relationship, where the programmer is the master
programming device and the PE is the slave.
All communication is initiated by the programmer in the
form of a command. The PE is able to receive only one
command at a time. Correspondingly, after receiving
and processing a command, the PE sends a single
response to the programmer.

17.1.1

2-WIRE ICSP EJTAG RATE

In Enhanced ICSP mode, the PIC32 family devices
operate from the internal Fast RC oscillator, which has
a nominal frequency of 8 MHz.

17.1.2

COMMUNICATION OVERVIEW

The programmer and the PE communicate using the
EJTAG Address, Data and Fastdata registers. In particular, the programmer transfers the command and data
to the PE using the Fastdata register. The programmer
receives a response from the PE using the Address
and Data registers. The pseudo operation of receiving
a response is shown in the GetPEResponse pseudo
operation below:
Format:
response = GetPEResponse()
Purpose:
Enables the programmer to receive the 32-bit
response value from the PE.

EXAMPLE 17-1:

// Wait until CPU is ready
SendCommand(ETAP_CONTROL);
// Check if Proc. Access bit (bit 18) is set
do {
controlVal=XferData(32’h0x0004C000 );
} while( PrAcc(contorlVal<18>) is not ‘1’ );
// Select Data Register
SendCommand(ETAP_DATA);
// Receive Response
response = XferData(0);
// Tell CPU to execute instruction
SendCommand(ETAP_CONTROL);
XferData(32’h0x0000C000);
// return 32-bit response
return response;
}

The typical communication sequence between the
programmer and the PE is shown in Table 17-1.
The sequence begins when the programmer sends the
command and optional additional data to the PE, and
the PE carries out the command.
When the PE has finished executing the command, it
sends the response back to the programmer.
The response may contain more than one response.
For example, if the programmer sent a READ
command, the response will contain the data read.

TABLE 17-1:

COMMUNICATION
SEQUENCE FOR THE PE

Operation
Step 1:

Operand

Send command and optional data from
programmer to the PE.

XferFastData

(Command | data len)

XferFastData..

optional data..

Step 2:

DS60001145U-page 36

GetPEResponse EXAMPLE

WORD GetPEResponse()
{
WORD response;

Programmer reads the response from the PE.

GetPEResponse

response

GetPEResponse...

response...

 2007-2017 Microchip Technology Inc.

PIC32
17.2

The PE Command Set

Table 17-2 provides PE command set details, such
as op code, mnemonic, and short description for
each command. Functional details on each
command
are
provided
in
Section 17.2.3
“ROW_PROGRAM
Command”
through
Section 17.2.14 “CHANGE_CFG Command”.
The PE sends a response to the programmer for each
command that it receives. The response indicates if the
command was processed correctly. It includes any
required response data or error data.

17.2.1

COMMAND FORMAT

All PE commands have a general format consisting of
a 32-bit header and any required data for the
command, see Figure 17-1. The 32-bit header consists
of a 16-bit op code field, which is used to identify the
command, and a 16-bit command Operand field. Use
of the Operand field varies by command.
Note:

Some commands have no Operand
information; however, the Operand field
must be sent and the programming
executive will ignore the data.

TABLE 17-2:
Op code

FIGURE 17-1:

COMMAND FORMAT

16
Op code

0
Operand (optional)

16
Command Data High (if required)

0
Command Data Low (if required)

The command in the op code field must match one of
the commands in the command set that is listed in
Table 17-2. Any command received that does not
match a command the list returns a NACK response,
as shown in Table 17-3.
The PE uses the command Operand field to determine
the number of bytes to read from or to write to. If the
value of this field is incorrect, the command is not be
properly received by the PE.

PE COMMAND SET
Mnemonic

Description

0x0

ROW_PROGRAM(1)

Program one row of Flash memory at the specified address.

0x1

READ

Read N 32-bit words of memory starting from the specified address (N < 65,536).

0x2

PROGRAM

Program Flash memory starting at the specified address.
(3)

0x3

WORD_PROGRAM

0x4

CHIP_ERASE

Chip Erase of entire chip.

0x5

PAGE_ERASE

Erase pages of code memory from the specified address.

0x6

BLANK_CHECK

Blank Check code.

0x7

EXEC_VERSION

Read the PE software version.

0x8

GET_CRC

Get the CRC of Flash memory.

Program one word of Flash memory at the specified address.

0x9

PROGRAM_CLUSTER

Programs the specified number of bytes to the specified address.

0xA

GET_DEVICEID

Returns the hardware ID of the device.

(2)

0xB

CHANGE_CFG

0xC

GET_CHECKSUM

Get the checksum of Flash memory.

0xD

QUAD_WORD_PGRM(4)

Program four words of Flash memory at the specified address.

Used by the probe to set various configuration settings for the PE.

Note 1: Refer to Table 5-1 for the row size for each device.
2: This command is not available in PIC32MX1XX/2XX devices.
3: On the PIC32MZ family devices, which incorporate ECC, the WORD_PROGRAM command will not generate
the ECC parity bits. Reading a location programmed with the WORD_PROGRAM command with ECC enabled
will cause a DED fault.
4: This command is available on PIC32MK and PIC32MZ family devices only.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 37

PIC32
17.2.2

RESPONSE FORMAT

17.2.3

The PE response set is shown in Table 17-3. All PE
responses have a general format consisting of a 32-bit
header and any required data for the response (see
Figure 17-2).

FIGURE 17-2:

RESPONSE FORMAT

16
Last Command

ROW_PROGRAM COMMAND

The ROW_PROGRAM command instructs the PE to
program a row of data at a specified address.
The data to be programmed to memory, located in
command words Data_1 through Data_N, must be
arranged using the packed instruction word format
provided in Table 17-4 (this command expects an
entire row of data).

FIGURE 17-3:
0

ROW_PROGRAM COMMAND

Response Code
31

Op code
16

Data_High_1

Operand

0
Data_Low_1

16
Data_High_N

0
Data_Low_N

17.2.2.1

Response Code

The response code indicates whether the last
command succeeded or failed, or if the command is a
value that is not recognized. The response code values
are shown in Table 17-3.

Op code

RESPONSE VALUES

Mnemonic

0x0

PASS

0x2

FAIL

0x3

17.2.2.3

NACK

0
Addr_Low

Last_Cmd Field

TABLE 17-3:

16
Addr_High

Data_High_1

Last_Cmd is a 16-bit field in the first word of the
response and indicates the command that the PE
processed. It can be used to verify that the PE correctly
received the command that the programmer
transmitted.

17.2.2.2

0
Data_Low_1

16
Data_High_N

0
Data_Low_N

TABLE 17-4:
Field

Optional Data

The response header may be followed by optional data
in case of certain commands such as read. The
number of 32-bit words of optional data varies
depending on the last command operation and its
parameters.

Description

Op code

0x0

Operand

Not used

Addr_High

High 16 bits of 32-bit destination
address

Addr_Low

Low 16 bits of 32-bit destination
address

Description
Command successfully
processed
Command unsuccessfully
processed
Command not known

ROW_PROGRAM FORMAT

Data_High_1 High 16 bits data word 1
Data_Low_1

Low 16 bits data word 1

Data_High_N High 16 bits data word 2 through N
Data_Low_N Low 16 bits data word 2 through N
Expected Response (1 word):

FIGURE 17-4:

ROW_PROGRAM RESPONSE

16
Last Command

0
Response Code

DS60001145U-page 38

 2007-2017 Microchip Technology Inc.

PIC32
17.2.4

READ COMMAND

17.2.5

The READ command instructs the PE to read from
memory. The number of 32-bit words specified in the
Operand field starting from the 32-bit address specified
by the Addr_Low and Addr_High fields. This command
can be used to read Flash memory and Configuration
Words. All data returned in response to this command
uses the packed data format that is provided in
Table 17-5.

FIGURE 17-5:

READ COMMAND

16
Op code

PROGRAM COMMAND

The PROGRAM command instructs the PE to program
the Flash memory, including Configuration Words,
starting from the 32-bit address specified in the
Addr_Low and Addr_High fields. A 32-bit length field
specifies the number of bytes to program.
The address must be aligned to a Flash row size
boundary and the length must be a multiple of a Flash
row size. See Table 5-1 for the correct row size for the
device to be programmed.

PROGRAM COMMAND

FIGURE 17-7:
31

0
Operand

Op code
15

16
Addr_High

Operand
31

0
Addr_Low

TABLE 17-5:

0
Addr_Low

READ FORMAT

Field

Addr_High
15
31

Description

Length_High

Op code

0x1

Operand

N number of 32-bit words to read
(maximum of 65,535)

0
Length_Low

Addr_Low

Low 16 bits of 32-bit source address

Addr_High

High 16 bits of 32-bit source
address

16
Data_High_1

0
Data_Low_1

Expected Response:

16
Data_High_N

FIGURE 17-6:

READ RESPONSE

Data_Low_N

Last Command
15

0
Response Code

0x2

Operand

Not used

Addr_Low

Low 16 bits of 32-bit destination
address

Addr_High

High 16 bits of 32-bit destination
address

Length_Low

Low 16 bits of Length

0
Data_Low_1
Data_High_N

15
Data_Low_N
Note:

Reading unimplemented memory will
cause the PE to Reset. Ensure that only
memory locations present on a particular
device are accessed.

 2007-2017 Microchip Technology Inc.

Description

Op code

Data_High_1

PROGRAM FORMAT

Field
16

TABLE 17-6:

Length_High

High 16 bits Length

Data_Low_N

Low 16 bits data word 2 through N

Data_High_N

High 16 bits data word 2 through N

DS60001145U-page 39

PIC32
The following are three programming scenarios:
• The length of the data to be programmed is the
size of a single Flash row
• The length of the data to be programmed is the
size of two Flash rows
• The length of the data to be programmed is larger
than the size of two Flash rows

If the PE encounters an error in programming any of
the blocks, it sends a failure status to the probe and
aborts the PROGRAM command. On receiving the failure
status, the probe must stop sending data. The PE will
not process any other data for this command from the
probe. The process is illustrated in Figure 17-9.
Note:

When the data length is equal to 512 bytes, the PE
receives the 512-byte block of data from the probe and
immediately sends the response for this command
back to the probe.
The PE will respond for each row of data that it
receives. If the data length of the command is equal to
a single row, a single PE response is generated. If the
data length is equal to two rows, the PE waits to
receive both rows of data, and then sends back-toback responses for each data row. If the data length is
greater than two rows of data, the PE will send the
response for the first row after receiving the first two
rows of data. Subsequent responses are sent after
receiving subsequent data row packets. The
responses will lag the data by one row. When the last
row of data is received, the PE will respond with backto-back responses for the second-to-last data row
followed by the last row.

If the PROGRAM command fails, the
programmer should read the failing row
using the READ command from the Flash
memory. Then the programmer should
compare the row received from the Flash
memory to its local copy, word-by-word, to
determine the address where Flash
programming fails.

The response for this command is a little different than
the response for other commands. The 16 MSbs of the
response contain the 16 LSbs of the destination
address, where the last block is programmed. This
helps the probe and the PE maintain proper
synchronization of sending and receiving data and
responses.
Expected Response (1 word):

FIGURE 17-8:

PROGRAM RESPONSE

LSB 16 bits of the destination address of last block
15

0
Response Code

DS60001145U-page 40

 2007-2017 Microchip Technology Inc.

PIC32
FIGURE 17-9:

PROGRAM COMMAND ALGORITHM
Start

Data is
equal to a
single row

Data is
equal to
two rows

Data
is larger than
two rows

Send one row
of data

Send first row
of data

Receive status
(LSB 16 bits of
Destination Address
Status Value)

Send second row
of data

Receive status
for Row 1

Receive status
for Row 2

Send third row
of data

Receive status
for Row 2

Send Nth row
of data

Receive status
for Row N-1

Receive status
for Row N

Done

 2007-2017 Microchip Technology Inc.

DS60001145U-page 41

PIC32
17.2.6

WORD_PROGRAM COMMAND

17.2.7

CHIP_ERASE COMMAND

The WORD_PROGRAM command instructs the PE to
program a 32-bit word of data at the specified address.

The CHIP_ERASE command erases the entire chip,
including the configuration block.

FIGURE 17-10:

After the erase is performed, the entire Flash memory
contains 0xFFFFFFFF.

WORD_PROGRAM
COMMAND

16
Op code

0
Operand

FIGURE 17-12:

CHIP_ERASE COMMAND

16
Op code

0
Operand

Addr_High
15

0
Addr_Low

TABLE 17-8:
Field

16
Data_High

0
Data_Low

TABLE 17-7:

WORD_PROGRAM FORMAT

Field
0x3

Operand

Not used

Addr_High

High 16 bits of 32-bit destination
address

Addr_Low

Low 16 bits of 32-bit destination
address

Data_High

High 16 bits data word

Data_Low

Low 16 bits data word

Description

Op code

0x4

Operand

Not used

Addr_Low

Low 16 bits of 32-bit destination
address

Addr_High

High 16 bits of 32-bit destination
address

Description

Op code

CHIP_ERASE FORMAT

Expected Response (1 word):

FIGURE 17-13:

CHIP_ERASE RESPONSE

16
Last Command

0
Response Code

Expected Response (1 word):

FIGURE 17-11:

WORD_PROGRAM
RESPONSE

16
Last Command

0
Response Code

DS60001145U-page 42

 2007-2017 Microchip Technology Inc.

PIC32
17.2.8

PAGE_ERASE COMMAND

17.2.9

BLANK_CHECK COMMAND

The PAGE_ERASE command erases the specified
number of pages of code memory from the specified
base address. Depending on the device, the specified
base address must be a multiple of 0x400 or 0x100.

The BLANK_CHECK command queries the PE to
determine whether the contents of code memory and
code-protect Configuration bits (GCP and GWRP) are
blank (contains all ‘1’s).

After the erase is performed, all targeted words of code
memory contain 0xFFFFFFFF.

FIGURE 17-16:

BLANK_CHECK COMMAND

FIGURE 17-14:

PAGE_ERASE COMMAND

Op code

Op code
15

Operand
16

Operand
31

Addr_High
0

Addr_High
15

Addr_Low
16

Addr_Low

TABLE 17-9:

Length_High
15

PAGE_ERASE FORMAT

Field

0
Length_Low

Description

TABLE 17-10: BLANK_CHECK FORMAT

Op code

0x5

Operand

Number of pages to erase

Addr_Low

Low 16 bits of 32-bit destination
address

Op code

0x6

High 16 bits of 32-bit destination
address

Operand

Not used

Address

Address where to start the Blank
Check

Length

Number of program memory locations
to check in terms of bytes

Addr_High

Field

Expected Response (1 word):

FIGURE 17-15:

PAGE_ERASE RESPONSE

16
Last Command

Description

Expected Response (1 word for blank device):

FIGURE 17-17:
0

BLANK_CHECK RESPONSE

Response Code

16
Last Command

0
Response Code

 2007-2017 Microchip Technology Inc.

DS60001145U-page 43

PIC32
17.2.10

EXEC_VERSION COMMAND

GET_CRC COMMAND

17.2.11

EXEC_VERSION queries for the version of the PE
software stored in RAM.

GET_CRC calculates the CRC of the buffer from the
specified address to the specified length, using the
table look-up method. The CRC details are as follows:

FIGURE 17-18:

•
•
•
•

EXEC_VERSION
COMMAND

16
Op code

0
Operand

CRC-CCITT, 16-bit
Polynomial: X^16+X^12+X^5+1, hex 0x00011021
Seed: 0xFFFF
Most Significant Byte (MSB) shifted in first
Note 1: In the response, only the CRC Least
Significant 16 bits are valid.
2: The PE will automatically determine if the
hardware CRC is available and use it by
default. The hardware CRC is not used
on PIC32MX1XX/2XX devices.

TABLE 17-11: EXEC_VERSION FORMAT
Field
Op code
Operand

Description

FIGURE 17-20:

0x7

GET_CRC COMMAND

Not used

16
Op code

Expected Response (1 word):

FIGURE 17-19:

EXEC_VERSION
RESPONSE

0
Operand

16
Addr_High

16
15

Last Command
15

0
Addr_Low

0
Version Number

16
Length_High

0
Length_Low

TABLE 17-12: GET_CRC FORMAT
Field

Description

Op code

0x8

Operand

Not used

Address

Address where to start calculating the
CRC

Length

Length of buffer on which to calculate
the CRC, in number of bytes

Expected Response (2 words):

FIGURE 17-21:

GET_CRC RESPONSE

16
Last Command

0
Response Code

16
CRC_High

0
CRC_Low

DS60001145U-page 44

 2007-2017 Microchip Technology Inc.

PIC32
17.2.12

PROGRAM_CLUSTER COMMAND

17.2.13

PROGRAM_CLUSTER programs the specified number of
bytes to the specified address. The address must be
32-bit aligned, and the number of bytes must be a
multiple of a 32-bit word.

FIGURE 17-22:

PROGRAM_CLUSTER
COMMAND

The GET_DEVICEID command returns the hardware
ID of the device.

FIGURE 17-24:

Op code

16
Op code

0
Operand

TABLE 17-14: GET_DEVICEID FORMAT
16

Addr_High
15

Field

16
Length_High

0
Length_Low

0xA

Operand

Not used

Expected Response (1 word):

FIGURE 17-25:

0x9

Operand

Not used

Last Command
0
Device ID

Address

Start address for programming

Length

Length of area to program in number
of bytes

Note:

Description

Op code

GET_DEVICEID
RESPONSE

TABLE 17-13: PROGRAM_CLUSTER FORMAT
Field

Description

Op code

Addr_Low
31

GET_DEVICEID
COMMAND

31
16

GET_DEVICEID COMMAND

If the PROGRAM_CLUSTER command fails,
the programmer should read the failing row
using the READ command from the Flash
memory. Then the programmer should
compare the row received from the Flash
memory to its local copy word-by-word to
determine the address where Flash
programming fails.

Expected Response (1 word):

FIGURE 17-23:

PROGRAM_CLUSTER
RESPONSE

16
Last Command

0
Response Code

 2007-2017 Microchip Technology Inc.

DS60001145U-page 45

PIC32
17.2.14

CHANGE_CFG COMMAND

17.2.15

GET_CHECKSUM COMMAND

CHANGE_CFG is used by the probe to set various
configuration settings for the PE. Currently, the single
configuration setting determines which of the following
calculation methods the PE should use:

GET_CHECKSUM returns the sum of all the bytes
starting at the address argument up to the length
argument. The result is a 32-bit word.

• Software CRC calculation method
• Hardware calculation method

FIGURE 17-28:

CHANGE_CFG COMMAND

16
Op code

FIGURE 17-26:

CHANGE_CFG COMMAND

16
Op code

Operand
31

0
Operand

Addr_High
15

16
CRCFlag_High

Addr_Low
31

0
CRCFlag_Low

Length_High
15

0
Length_Low

TABLE 17-15: CHANGE_CFG FORMAT
Field

Description

Op code

0xB

Operand

Not used

CRCFlag

If the value is ‘0’, the PE uses the
software CRC calculation method.
If the value is ‘1’, the PE uses the
hardware CRC unit to calculate the
CRC.

TABLE 17-16: GET_CHECKSUM FORMAT
Field

Expected Response (1 word):

FIGURE 17-27:

CHANGE_CFG RESPONSE

Op code

0x0C

Operand

Not used

Addr_High

High-order 16 bits of the 32-bit starting
address of the data to calculate the
checksum for.

Addr_Low

Low-order 16 bits of the 32-bit starting
address of the data to calculate the
checksum for.

Length_High High-order 16 bits of the 32-bit length
of data to calculate the checksum for
in bytes.

Length_Low

Last Command
15
Response Code

Note:

Description

The CHANGE_CFG command is not
available in PIC32MX1XX/2XX devices.

Low-order 16 bits of the 32-bit length
of data to calculate the checksum for
in bytes.

Expected Response (1 word):

FIGURE 17-29:

GET_CHECKSUM
RESPONSE

16
Last Command

0
Response Code

16
Checksum_High

0
Checksum_Low

DS60001145U-page 46

 2007-2017 Microchip Technology Inc.

PIC32
17.2.16

QUAD_WORD_PROGRAM COMMAND

QUAD_WORD_PROGRAM instructs the PE to program
four, 32-bit words at the specified address. The
address must be an aligned four word boundary (bits 01 must be ‘0’). If not, the command will return a FAIL
response value and no data will be programmed.

FIGURE 17-30:

QUAD_WORD_PROGRAM
COMMAND

TABLE 17-17: QUAD_WORD_PROGRAM
FORMAT
Data2_High

High-order 16 bits of data word 2.

Data2_Low

Low-order 16 bits of data word 2.

Data3_High

High-order 16 bits of data word 3.

Data3_Low

Low-order 16 bits of data word 3.

Expected Response (1 word):
16

FIGURE 17-31:

Op code
15

0
Operand

16
Addr_High

QUAD_WORD_PROGRAM
RESPONSE

16
Last Command

0
Response Code

Addr_Low
31

16
Data0_High

0
Data0_Low

16
Data1_High

0
Data1_Low

16
Data2_High

0
Data2_Low

16
Data3_High

0
Data3_Low

TABLE 17-17: QUAD_WORD_PROGRAM
FORMAT
Field

Description

Op code

0x0D

Operand

Not used

Addr_High

High-order 16 bits of the 32-bit starting
address.

Addr_Low

Low -order 16 bits of the 32-bit starting
address.

Data0_High

High-order 16 bits of data word 0.

Data0_Low

Low-order 16 bits of data word 0.

Data1_High

High-order 16 bits of data word 1.

Data1_Low

Low-order 16 bits of data word 1.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 47

PIC32
18.0

CHECKSUM

18.1

Theory

The checksum is calculated as the 32-bit summation of
all bytes (8-bit quantities) in program Flash, Boot Flash
(except device Configuration Words), the Device ID
register with applicable mask, and the device Configuration Words with applicable masks. Then the 2’s
complement of the summation is calculated. This final
32-bit number is presented as the checksum.

18.2

Mask Values

The mask value of a device Configuration is calculated
by setting all the unimplemented bits to ‘0’ and all the
implemented bits to ‘1’.
For example, Register 18-1 shows the DEVCFG0
register of the PIC32MX360F512L device. The mask
value for this register is:
mask_value_devcfg0 = 0x110FF00B

Bit
31/23/15/7

DEVCFG0 REGISTER OF PIC32MX360F512L
Bit
30/22/14/6

Bit
29/21/13/5

Bit
28/20/12/4

Bit
27/19/11/3

Bit
26/18/10/2

Bit
25/17/9/1

Bit
24/16/8/0

r-0

r-1

R/P-1

r-1

R/P-1

—

BWP

r-1

R/P-1

—

PWP19

PWP18

PWP17

PWP16

R/P-1

r-1

PWP15

PWP14

PWP13

PWP12

—

R/P-1

r-1

R/P-1

r-1

—

ICESEL

—

Legend:
R = Readable bit
-n = Value at POR

DS60001145U-page 48

P = Programmable bit
W = Writable bit
‘1’ = Bit is set

DEBUG<1:0>

r = Reserved bit
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown

 2007-2017 Microchip Technology Inc.

PIC32
Table 18-1 lists the mask values of the four device Configuration registers and Device ID registers to be used
in the checksum calculations for PIC32MX, PIC32MZ,
and PIC32MK devices.

TABLE 18-1:

DEVICE CONFIGURATION REGISTER MASK VALUES OF CURRENTLY
SUPPORTED PIC32MX, PIC32MZ, AND PIC32MK DEVICES

Device Family

Flash
Memory
Sizes (KB)

DEVCFG0

DEVCFG1

DEVCFG2

DEVCFG3

DEVCFG4

DEVID

16, 32, 64,
128

0x1100FC1F

0x03DFF7A7

0x00070077

0xF000FFFF

—

0x0FFFFFFF

16, 32, 64,
128

0x1100FC1F

0x03DFF7A7

0x00070077

0xF0000000

—

0x0FFFFFFF

PIC32MX 210/220/230/
16, 32, 64,
250 (28/36/44-pin
128
Devices only)

0x1100FC1F

0x03DFF7A7

0x00078777

0xF0000000

—

0x0FFFFFFF

PIC32MX 15X/17X (28/
128,256
44-pin Devices only)

0x1187F01F

0x03FFF7A7

0xFFB700F7

0x30C00000

—

0x0FFFFFFF

PIC32MX 25X/27X (28/
128,256
44-pin Devices only)

0x1187F01F

0x03FFF7A7

0xFFB787F7

0x70C00000

—

0x0FFFFFFF

PIC32MX110/120/130/
150F0xx
PIC32MX150F128
(28/36/44-pin Devices
only)
PIC32MX130F128/256
PIC32MX150F256
(28/36/44-pin Devices
only)

PIC32MX 320/340/360

32, 64, 128,
256, 512

0x110FF00B

0x009FF7A7

0x00070077

0x0000FFFF

—

0x000FF000

PIC32MX
420/440/460

32, 64, 128,
256, 512

0x110FF00B

0x009FF7A7

0x00078777

0x0000FFFF

—

0x000FF000

64, 128, 256,
0x110FFC1F
512

0x03DFF7A7

0x00070077

—

0x0FFFFFFF

64, 128, 256,
0x110FFC1F
512

0x03DFF7A7

0x00070077

0xF0000000

—

0x0FFFFFFF

64, 128, 256,
0x110FFC1F
512

0x03DFF7A7

0x00078777

0xF000FFFF

—

0x0FFFFFFF

PIC32MX110/120/130/
150F0xx
PIC32MX150F128
PIC32MX170F256
(64/100-pin Devices
only)
PIC32MX130F128/256
PIC32MX150F256
PIC32MX170F512
(64/100-pin Devices
only)
PIC32MX230F0xx
PIC32MX250F128
PIC32MX270F256
(64/100-pin Devices
only)
Note 1:

0xF000FFFF

Applicable only to PIC32MZ DA family devices.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 49

PIC32
TABLE 18-1:

DEVICE CONFIGURATION REGISTER MASK VALUES OF CURRENTLY
SUPPORTED PIC32MX, PIC32MZ, AND PIC32MK DEVICES (CONTINUED)

Device Family

Flash
Memory
Sizes (KB)

DEVCFG0

DEVCFG1

DEVCFG2

DEVCFG3

DEVCFG4

DEVID

64, 128, 256,
0x110FFC1F
512

0x03DFF7A7

0x00078777

0xF0000000

—

0x0FFFFFFF

PIC32MX 330/350/370

64, 128, 256,
0x110FF01F
512

0x03DFF7A7

0x00070077

0x3007FFFF

—

0x0FFFFFFF

PIC32MX 430/450/470

64, 128, 256,
0x110FF01F
512

0x03DFF7A7

0x00078777

0xF007FFFF

—

0x0FFFFFFF

PIC32MX
534/564

64, 128

0x110FF00F

0x009FF7A7

0x00078777

0xC407FFFF

—

0x0FFFF000

PIC32MX
664

64, 128

0x110FF00F

0x009FF7A7

0x00078777

0xC307FFFF

—

0x0FFFF000

PIC32MK
0512/1024XXD/E/F

512, 1024

0x7FFFFFFF 0xFFFFFFFF 0xFFFFFFFF 0xFFFF0000

—

0x0FFFFFFF

PIC32MK
[0512/1024XXK/L/M

512, 1024

0x7FFFFFFF 0xFFFFFFFF 0xFFFFFFFF 0xFFFF0000

0xFFFFFFFF 0x0FFFFFFF

PIC32MK
0256/0512XXG/H

256, 512

0x7FFFFFFF 0xFFFFFFFF 0xFFFFFFFF 0xFFFF0000

0xFFFFFFFF 0x0FFFFFFF

PIC32MX
764

128

0x110FF00F

0x009FF7A7

0x00078777

0xC707FFFF

—

0x0FFFF000

PIC32MX170F256
(28/36/44-pin Devices
only)

256

0x1107FC1F

0x03DFF7A7

0x00070077

0xF000FFFF

—

0x0FFFFFFF

PIC32MX170F512
(28/36/44-pin Devices
only)

256

0x1107FC1F

0x03DFF7A7

0x00070077

0xF0000000

—

0x0FFFFFFF

PIC32MX270F256
(28/36/44-pin Devices
only)

256

0x1107FC1F

0x03DFF7A7

0x00078777

0xF000FFFF

—

0x0FFFFFFF

PIC32MX270F512
(28/36/44-pin Devices
only)

256

0x1107FC1F

0x03DFF7A7

0x00078777

0xF0000000

—

0x0FFFFFFF

PIC32MZ
05XX/10XX/20XX

512, 1024,
2048

0x7FFFFFFF 0xFFFFFFFF 0xFFFFFFFF 0xFFFF0000

PIC32MX
575

256, 512

0x110FF00F

0x009FF7A7

0x00078777

0xC407FFFF

—

0x000FF000

PIC32MX
675/695

256, 512

0x110FF00F

0x009FF7A7

0x00078777

0xC307FFFF

—

0x000FF000

PIC32MX
775/795

256, 512

0x110FF00F

0x009FF7A7

0x00078777

0xC707FFFF

—

0x000FF000

PIC32MX230F128
PIC32MX230F256
PIC32MX250F256
PIC32MX270F512
PIC32MX530
PIC32MX550
PIC32MX570
(64/100-pin Devices
only)

Note 1:

0xFFFFFFFF
0x0FFFFFFF
(see Note 1)

Applicable only to PIC32MZ DA family devices.

DS60001145U-page 50

 2007-2017 Microchip Technology Inc.

PIC32
18.3

Algorithm

Figure 18-1 illustrates an example of a high-level algorithm for calculating the checksum for a PIC32 device to
demonstrate one method to derive a checksum. This is
merely an example of how the actual calculations can be
accomplished, the method that is ultimately used is left to
the discretion of the software developer.
As stated earlier, the PIC32 checksum is calculated as
the 32-bit summation of all bytes (8-bit quantities) in
program Flash, Boot Flash (except device
Configuration Words), the Device ID register with
applicable mask, and the device Configuration Words
with applicable masks.

FIGURE 18-1:

Then the 2’s complement of the summation is
calculated. This final 32-bit number is presented as the
checksum.
The mask values of the device Configuration and
Device ID registers are derived as described in the
previous section, Section 18.2 “Mask Values”.
An arithmetic AND operation of these device
Configuration register values is performed with the
appropriate mask value, before adding their bytes to
the checksum.
Similarly, an arithmetic AND operation of the Device ID
register is performed with the appropriate mask value,
before adding its bytes to the checksum, see
Section 19.0 “Configuration Memory and Device
ID” for more information.

HIGH-LEVEL ALGORITHM FOR CHECKSUM CALCULATION

pic32_checksum

Read Program Flash, Boot Flash (including DEVCFG
registers) and DEVID register in tmpBuffer

Apply DEVCFG and DEVID masks to appropriate
locations in tmpBuffer

tmpChecksum (32-bit quantity) = 0

Finish processing all
bytes (8-bit quantities) in
tmpBuffer?

tmpChecksum = tmpChecksum + Current Byte Value
(8-bit quantity) in tmpBuffer

Yes
Checksum (32-bit quantity) = 2’s complement
of tmpChecksum

Done

 2007-2017 Microchip Technology Inc.

DS60001145U-page 51

PIC32
The formula to calculate the checksum for a PIC32
device is provided in Equation 18-1.

EQUATION 18-1:

CHECKSUM FORMULA
Checksum

2s complement  PF + BF + DCR + DIR 

Where,
PF = 32-bit summation of all bytes in Program Flash
BF = 32-bit summation of all bytes in Boot Flash, except device Configuration registers (see Note 1)
y

X

DCR

32-bit summation of bytes  MASK DEVCFGX & DEVCFGx 
0

Where,
y = 3 for PIC32MX, PIC32MK, PIC32MZ EC, and PIC32MZ EF family devices
y = 4 for all other PIC32MZ family devices
DIR

32-bit summation of bytes  MASK DEVID & DEVID 

MASKDEVCFGX = mask value from Table 18-1
MASKDEVID = mask value from Table 18-1 (see Note 2)
DEVCP = 32-bit summation of bytes (MASKDEVCP & DEVCP)
Where,
MASKDEVCP = 0x10000000 for PIC32MK

Note 1:

For PIC32MZ family devices, the Boot Flash memory that resides at 0x1FCxFF00 through
0x1FCxFFFF is not summed, as these memory locations contain the device configuration and CP
values. For PIC32MK family devices, the Boot Flash memory that resides at 0x1FC03F00 through
0x1FC03FFF is not summed.
For PIC32MZ and PIC32MK family devices, the checksum calculated in MPLAB X IDE only uses
the primary DEVCFGx registers. Neither the alternate nor second Boot Flash (if available)
registers are calculated.

DS60001145U-page 52

 2007-2017 Microchip Technology Inc.

PIC32
18.4

18.4.2

Example of Checksum Calculation

The following five sections demonstrate a checksum
calculation for the PIC32MX360F512L device using
Equation 18-1.

The size of the Boot Flash is 12 KB, which equals
12288 bytes. However, the last 16 bytes are device
Configuration registers, which are treated separately.
Therefore, the number of bytes in Boot Flash that we
consider in this step is 12272. Since the Boot Flash is
assumed to be in erased state, the value of “BF” is
resolved through the following calculation:

The following assumptions are made for the purpose of
this checksum calculation example:
• Program Flash and Boot Flash are in the erased
state (all bytes are 0xFF)
• Device Configuration is in the default state of the
device (no configuration changes are made)

BF = 0xFF + 0xFF + … 12272 times
BF = 0x002FC010 (32-bit number)

Each item on the right side of the equation (PF, BF,
DCR, DIR) is individually calculated. After deriving the
values, the final value of the checksum can be
calculated.

18.4.1

18.4.3

The size of Program Flash is 512 KB, which equals
524288 bytes. Since the program Flash is assumed to
be in erased state, the value of PF is resolved through
the following calculation:

From Table 18-2, the value of “DCR” is:

PF = 0xFF + 0xFF + … 524288 times

DCR = 0x000003D6 (32-bit number)

PF = 0x7F80000 (32-bit number)

CALCULATING FOR “DCR” IN THE
CHECKSUM FORMULA

Since the device Configuration registers are left in their
default state, the value of the appropriate DEVCFG
register – as read by the PIC32 core, its respective
mask value, the value derived from applying the mask,
and the 32-bit summation of bytes (all as shown in
Table 18-2) provide the total of the 32-bit summation of
bytes.

CALCULATING FOR “PF” IN THE
CHECKSUM FORMULA

TABLE 18-2:

CALCULATING FOR “BF” IN THE
CHECKSUM FORMULA

DCR CALCULATION EXAMPLE
POR Default Value

Mask

POR Default Value & 32-Bit Summation of
Mask
Bytes

DEVCFG0

0x7FFFFFFF

0x110FF00B

0x0000011B

DEVCFG1

0xFFFFFFFF

0x009FF7A7

0x0000023D

DEVCFG2

0xFFFFFFFF

0x00070077

0x0000007E

DEVCFG3

0xFFFFFFFF

0x00000000

Total of the 32-bit Summation of Bytes =

 2007-2017 Microchip Technology Inc.

0x000003D6

DS60001145U-page 53

PIC32
18.4.4

CALCULATING FOR “DIR” IN THE
CHECKSUM FORMULA

The value of Device ID register and its mask value, the
value derived from applying the mask, and the 32-bit
summation of bytes are shown in Table 18-3.
From Table 18-3, the value of “DIR” is:
DIR = 0x00000083 (32-bit number.)

TABLE 18-3:

18.4.5

DIR CALCULATION EXAMPLE

POR Default Value

Mask

POR Default Value
& Mask

32-Bit Summation of
Bytes

DEVID

0x00938053

0x000FF000

0x00038000

0x00000083

COMPLETING THE PIC32
CHECKSUM CALCULATION

The values derived in previous sections (PF, BF, DCR,
DIR) are used to calculate the checksum value.
Perform the 32-bit summation of the PF, BF, DCR and
DIR as derived in previous sections and store it in a
variable, called temp, as shown in Example 18-1.

EXAMPLE 18-1:
1.

CHECKSUM CALCULATION PROCESS

First, temp = PF + BF + DCR + DIR, which translates to:
temp = 0x7F80000 + 0x002FC010 + 0x000003D6 + 0x00000083

2.
3.

Adding all four values results in temp being equal to 0x0827C469
Finally, the 2’s complement of temp is the checksum:
Checksum = 2’s complement (temp), which is Checksum = (1’s complement (temp)) + 1, resulting in
0xF7D83B97

18.4.6

CHECKSUM VALUES WHILE
DEVICE IS CODE-PROTECTED

Since the device Configuration Words are not readable
while the PIC32 devices are in code-protected state,
the checksum values are zeros for all devices.

DS60001145U-page 54

 2007-2017 Microchip Technology Inc.

PIC32
19.0

CONFIGURATION MEMORY
AND DEVICE ID

PIC32 devices include several features intended to
maximize application flexibility and reliability, and
minimize cost through elimination of external
components. These features are configurable through
specific Configuration bits for each device.
Refer to the “Special Features” chapter in the specific
device data sheet for a full list of available features,
Configuration bits, and the Device ID register.
Refer to Appendix C: “Device IDs” to locate the
Device ID for a particular PIC32MX, PIC32MZ, or
PIC32MK family of devices.
For the current silicon revision and revision ID for a
particular device, refer to the related Family Silicon
Errata and Data Sheet Clarification. These
documents are available for download from the
Microchip web site: http://www.microchip.com/PIC32
and navigating to: Documentation > Errata.

19.1

Device Configuration

In PIC32 devices, the Configuration Words select
various device configurations that are set at device
Reset prior to execution of any code. These values are
located at the highest locations of the Boot Flash Memory (BFM) and since they are part of the program memory, are included in the programming file along with
executable code and program constants. The names
and locations of these Configuration Words are listed in
Table 19-1 through Table 19-4.
Additionally, Table 19-3 and Table 19-4 include Configuration Words for PIC32MZ and PIC32MK family
devices, respectively, with dual boot and dual panel
Flash. Refer to Section 48. “Memory Organization
and Permissions” (DS60001214) of the “PIC32
Family Reference Manual” for a detailed description of
the dual boot regions.

TABLE 19-1:

TABLE 19-2:

DEVCFG LOCATIONS FOR 28/
36/44-PIN PIC32MX1XX/2XX
AND 64/100-PIN PIC32MX1XX/
2XX/5XX DEVICES ONLY

Configuration Word

Physical Address

DEVCFG0
DEVCFG1
DEVCFG2
DEVCFG3

0x1FC00BFC
0x1FC00BF8
0x1FC00BF4
0x1FC00BF0

On Power-on Reset (POR) or any Reset, the
Configuration Words are copied from the Boot Flash
memory to their corresponding Configuration registers.
A Configuration bit can only be programmed = 0
(unprogrammed state = 1).
During programming, a Configuration Word can be
programmed a maximum of two times for PIC32MX
devices and only one time for PIC32MZ, and PIC32MK
family devices before a page erase must be performed.
After programming the Configuration Words, a device
Reset will cause the new values to be loaded into the
Configuration registers. Because of this, the programmer
should program the Configuration Words just prior to verification of the device. The final step is programming the
code protection Configuration Word.
These Configuration Words determine the oscillator
source. If using the 2-wire Enhanced ICSP mode the
Configuration Words are ignored and the device will
always use the FRC; however, in 4-wire mode this is
not the case. If an oscillator source is selected by the
Configuration Words that is not present on the device
after Reset, the programmer will not be able to perform
Flash operations on the device after it is Reset. See the
“Special Features” chapter in the specific device data
sheet for details regarding oscillator selection using the
Configuration Words.

DEVCFG LOCATIONS FOR
15X/17X/25X/27X AND
PIC32MX3XX/4XX/5XX/6XX/
7XX DEVICES ONLY

Configuration Word

Physical Address

DEVCFG0
DEVCFG1
DEVCFG2
DEVCFG3

0x1FC02FFC
0x1FC02FF8
0x1FC02FF4
0x1FC02FF0

 2007-2017 Microchip Technology Inc.

DS60001145U-page 55

PIC32
TABLE 19-3:

CONFIGURATION WORD LOCATIONS FOR PIC32MZ FAMILY DEVICES
Register Physical Address

Configuration Word
(see Note 1)

Fixed Boot
Region 1

Fixed Boot
Region 2

Active Boot
Alias Region
(see Note 2)

Inactive Boot
Alias Region
(see Note 2)

Boot Sequence Number

0x1FC4FFF0

0x1FC6FFF0

0x1FC0FFF0

0x1FC2FFF0

Code Protection

0x1FC4FFD0

0x1FC6FFD0

0x1FC0FFD0

0x1FC2FFD0

DEVCFG0

0x1FC4FFCC

0x1FC6FFCC

0x1FC0FFCC

0x1FC2FFCC

DEVCFG1

0x1FC4FFC8

0x1FC6FFC8

0x1FC0FFC8

0x1FC2FFC8

DEVCFG2

0x1FC4FFC4

0x1FC6FFC4

0x1FC0FFC4

0x1FC2FFC4

DEVCFG3

0x1FC4FFC0

0x1FC6FFC0

0x1FC0FFC0

0x1FC2FFC0

DEVCFG4 (see Note 3)

0x1FC4FFBC

0x1FC6FFBC

0x1FC0FFBC

0x1FC2FFBC

Alternate Boot Sequence Number

0x1FC4FF70

0x1FC6FF70

0x1FC0FF70

0x1FC2FF70

Alternate Code Protection

0x1FC4FF50

0x1FC6FF50

0x1FC0FF50

0x1FC2FF50

Alternate DEVCFG0

0x1FC4FF4C

0x1FC6FF4C

0x1FC0FF4C

0x1FC2FF4C

Alternate DEVCFG1

0x1FC4FF48

0x1FC6FF48

0x1FC0FF48

0x1FC2FF48

Alternate DEVCFG2

0x1FC4FF44

0x1FC6FF44

0x1FC0FF44

0x1FC2FF44

Alternate DEVCFG3

0x1FC4FF40

0x1FC6FF40

0x1FC0FF40

0x1FC2FF40

Alternate DEVCFG4 (see Note 3)

0x1FC4FF3C

0x1FC6FF3C

0x1FC0FF3C

0x1FC2FF3C

Note 1:

All values in the 0x1FCxFF00-0x1FCxFFFF memory regions should be programmed using the
QUAD_WORD_PROGRAM command to ensure proper ECC configuration. Refer to Section 17.2.16
“QUAD_WORD_PROGRAM Command” for details.
Active/Inactive boot alias selections are assumed for an unprogrammed device where Fixed Region 1 is
active and Fixed Region 2 is inactive. Refer to Section 48. “Memory Organization and Permissions”
(DS60001214) for a detailed description of the alias boot regions.
These Configuration Words are available only on PIC32MZ DA family devices.

TABLE 19-4:

CONFIGURATION WORD LOCATIONS FOR PIC32MKXXXXXXD/E/FXX FAMILY
DEVICES
Register Physical Address

Configuration Word
(see Note 1)
Boot Sequence Number

Fixed Boot
Region 1
0x1FC43FF0

Fixed Boot
Region 2

Active Boot
Alias Region
(see Note 2)

Inactive Boot
Alias Region
(see Note 2)

0x1FC63FF0

0x1FC03FF0

0x1FC23FF0

Code Protection

0x1FC43FD0

0x1FC63FD0

0x1FC03FD0

0x1FC23FD0

DEVCFG0

0x1FC43FCC

0x1FC63FCC

0x1FC03FCC

0x1FC23FCC

DEVCFG1

0x1FC43FC8

0x1FC63FC8

0x1FC03FC8

0x1FC23FC8

DEVCFG2

0x1FC43FC4

0x1FC63FC4

0x1FC03FC4

0x1FC23FC4

0x1FC43FC0

0x1FC63FC0

0x1FC03FC0

0x1FC23FC0

DEVCFG3
Note 1:

If the device has ECC memory, each of the following Configuration Word Groups should be programmed
using the QUAD_WORD_PROGRAM command:
• Boot Sequence Number (single quad word programming operation)
• Code Protection (single quad word programming operation)
• DEVCFG3, DEVCFG2, DEVCFG1, and DEVCFG0 (single quad word programming operation)
Active/Inactive boot alias selections are assumed for an unprogrammed device where Fixed Region 1 is
active and Fixed Region 2 is inactive. Refer to Section 48. “Memory Organization and Permissions”
(DS60001214) for a detailed description of the alias boot regions.

DS60001145U-page 56

 2007-2017 Microchip Technology Inc.

PIC32
TABLE 19-5:

CONFIGURATION WORD LOCATIONS FOR PIC32MKXXXXXXG/H/K/L/MXX FAMILY
DEVICES
Register Physical Address

Configuration Word
(see Note 1)

Fixed Boot
Region 1

Fixed Boot
Region 2

Active Boot
Alias Region
(see Notes 2, 3)

Inactive Boot
Alias Region
(see Notes 2, 3)

Boot Sequence Number

0x1FC43FF0

0x1FC63FF0

0x1FC03FF0

0x1FC23FF0

Code Protection

0x1FC43FD0

0x1FC63FD0

0x1FC03FD0

0x1FC23FD0

DEVCFG0

0x1FC43FCC

0x1FC63FCC

0x1FC03FCC

0x1FC23FCC

DEVCFG1

0x1FC43FC8

0x1FC63FC8

0x1FC03FC8

0x1FC23FC8

DEVCFG2

0x1FC43FC4

0x1FC63FC4

0x1FC03FC4

0x1FC23FC4

DEVCFG3

0x1FC43FC0

0x1FC63FC0

0x1FC03FC0

0x1FC23FC0

DEVCFG4

0x1FC43FBC

Alternate Boot Sequence Number

0x1FC43F70

0x1FC63F70

0x1FC03F70

0x1FC23F70

Alternate Code Protection

0x1FC43F50

0x1FC63F50

0x1FC03F50

0x1FC23F50

Alternate DEVCFG0

0x1FC43F4C

0x1FC63F4C

0x1FC03F4C

0x1FC23F4C

Alternate DEVCFG1

0x1FC43F48

0x1FC63F48

0x1FC03F48

0x1FC23F48

Alternate DEVCFG2

0x1FC43F44

0x1FC63F44

0x1FC03F44

0x1FC23F44

Alternate DEVCFG3

0x1FC43F40

0x1FC63F40

0x1FC03F40

0x1FC23F40

Alternate DEVCFG4

0x1FC43F3C

0x1FC63F3C

0x1FC03F3C

0x1FC23F3C

Note 1:

If the device has ECC memory, each of the following Configuration Word Groups should be programmed
using the QUAD_WORD_PROGRAM command:
• Boot Sequence Number (single quad word programming operation)
• Code Protection (single quad word programming operation)
• DEVCFG3, DEVCFG2, DEVCFG1, and DEVCFG0 (single quad word programming operation)
All values in the 0x1FCxFF00-0x1FCxFFFF memory regions should be programmed using the
QUAD_WORD_PROGRAM command to ensure proper ECC configuration. Refer to Section 17.2.16
“QUAD_WORD_PROGRAM Command” for details.
Active or Inactive boot alias selections are assumed for an unprogrammed device where Fixed Region 1 is
active and Fixed Region 2 is inactive. Refer to the Section 48. “Memory Organization and Permissions” (DS60001214) for a detailed description of the alias boot regions.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 57

PIC32
19.1.1

CONFIGURATION REGISTER
PROTECTION

To prevent inadvertent Configuration bit changes
during code execution, all programmable Configuration
bits are write-once. After a bit is initially programmed
during a power cycle, it cannot be written to again.
Changing a device configuration requires changing the
Configuration data in the Boot Flash memory, and
cycling power to the device.
To ensure integrity of the 128-bit data, a comparison is
made between each Configuration bit and its stored
complement continuously. If a mismatch is detected, a
Configuration Mismatch Reset is generated, which
causes a device Reset.

19.2 Device Code Protection bit (CP)
The PIC32 family of devices feature code protection, which when enabled, prevents reading of the
Flash memory by an external programming device.
Once code protection is enabled, it can only be disabled by erasing the device with the Chip Erase
command (MCHP_ERASE).

19.3 Program Write Protection bits (PWP)
The PIC32 families of devices include write protection
features, which prevent designated boot and program
Flash regions from being erased or written during
program execution.
In PIC32MX devices, write protection is implemented in
Configuration memory by the Device Configuration
Words, while in PIC32MZ and PIC32MK family
devices, this feature is implemented through SFRs in
the Flash controller.
When write protection is implemented by Device
Configuration Words, the write protection register
should only be written when all boot and program Flash
memory has been programmed. Refer to the “Special
Features” chapter in the specific device data sheet for
details.
If write protection is implemented using SFRs, certain
steps may be required during initialization of the device
by the external programmer prior to programming
Flash regions. Refer to the “Flash Program Memory”
chapter in the specific device data sheet for details.

When programming a device that has opted to utilize code protection, the programming device must
perform verification prior to enabling code protection. Enabling code protection should be the last step
of the programming process. Location of the code
protection enable bits vary by device. Refer to the
“Special Features” chapter in the specific device
data sheet for details.
Note:

Once code protection is enabled, the
Flash memory can no longer be read and
can only be disabled by an external
programmer using the Chip Erase
Command (MCHP_ERASE).

DS60001145U-page 58

 2007-2017 Microchip Technology Inc.

PIC32
20.0

TAP CONTROLLERS

TABLE 20-1:
Command

MCHP TAP INSTRUCTIONS
Value

Description

MTAP_COMMAND

5’h0x07

TDI and TDO connected to MCHP Command Shift register (See Table 20-2)

MTAP_SW_MTAP

5’h0x04

Switch TAP controller to MCHP TAP controller

MTAP_SW_ETAP

5’h0x05

Switch TAP controller to EJTAG TAP controller

MTAP_IDCODE

5’h0x01

Select Chip Identification Data register

20.1

Microchip TAP Controllers (MTAP)

20.1.1

MTAP_COMMAND INSTRUCTION

MTAP_COMMAND selects the MCHP Command Shift
register. See Table 20-2 for available commands.

20.1.1.1

MCHP_STATUS INSTRUCTION

MCHP_STATUS returns the 8-bit Status value of the
Microchip TAP controller. Table 20-3 provides the
format of the Status value returned.

20.1.1.2

MCHP_ASSERT_RST INSTRUCTION

MCHP_ASSERT_RST performs a persistent device
Reset. It is similar to asserting and holding the MCLR
pin. Its associated Status bit is DEVRST.

20.1.1.3

MCHP_DE_ASSERT_RST
INSTRUCTION

MCHP_DE_ASSERT_RST removes the persistent
device Reset. It is similar to deasserting the MCLR pin.
Its associated Status bit is DEVRST.

20.1.1.4

MCHP_ERASE INSTRUCTION

MCHP_ERASE performs a Chip Erase. The CHIP_
ERASE command sets an internal bit that requests
the Flash Controller to perform the erase. Once the
controller becomes busy, as indicated by FCBUSY
(Status bit), the internal bit is cleared.

20.1.1.5

MCHP_FLASH_ENABLE
INSTRUCTION

20.1.1.6

MCHP_FLASH_DISABLE
INSTRUCTION

MCHP_FLASH_DISABLE clears the FAEN bit which
controls processor accesses to the Flash memory. The
FAEN bit’s state is returned in the field of the same
name. This command has no effect if CPS = 0. This
command requires a NOP to complete.
Note:

20.1.2

This command is not required for
PIC32MZ and PIC32MK family devices.

MTAP_SW_MTAP INSTRUCTION

MTAP_SW_MTAP switches the TAP instruction set to the
MCHP TAP instruction set.
Each of these commands should be followed with a
SetMode (6'b011111) to force the Chip TAP controller
to the Run Test/Idle state.

20.1.3

MTAP_SW_ETAP INSTRUCTION

MTAP_SW_ETAP effectively switches the TAP
instruction set to the EJTAG TAP instruction set. It does
this by holding the EJTAG TAP controller in the Run
Test/Idle state until a MTAP_SW_ETAP instruction is
decoded by the MCHP TAP controller.
Each of these commands should be followed with a
SetMode (6'b011111) to force the Chip TAP controller
to the Run Test/Idle state.

20.1.4

MTAP_IDCODE INSTRUCTION

MTAP_IDCODE returns the value stored in the DEVID
register.

MCHP_FLASH_ENABLE sets the FAEN bit, which controls processor accesses to the Flash memory. The
FAEN bit’s state is returned in the field of the same
name. This command has no effect if CPS = 0. This
command requires a NOP to complete.
Note:

This command is not required for
PIC32MZ and PIC32MK family devices.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 59

PIC32
TABLE 20-2:

MTAP_COMMAND DR COMMANDS

Command

Value

Description

MCHP_STATUS

8’h0x00

MCHP_ASSERT_RST

8’h0xD1

Requests the Reset controller to assert device Reset.

MCHP_DE_ASSERT_RST

8’h0xD0

Removes the request for device Reset, which causes the reset
controller to deassert device Reset if there is no other source
requesting Reset (i.e., MCLR).

MCHP_ERASE

8’h0xFC

Cause the Flash controller to perform a Chip Erase.

MCHP_FLASH_ENABLE(1)

8’h0xFE

Enables fetches and loads to the Flash (from the processor).

MCHP_FLASH_DISABLE(1)

8’h0xFD

Disables fetches and loads to the Flash (from the processor).

Note 1:

NOP and return Status.

This command is not required for PIC32MK and PIC32MZ family of devices.

TABLE 20-3:

MCHP STATUS VALUE

Bit
Range

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

7:0

CPS

NVMERR(1)

CFGRDY

FCBUSY

FAEN(2)

DEVRST

bit 7

bit 6
bit 5

bit 4
bit 3

bit 2

bit 1

bit 0

Note 1:
2:

CPS: Code-Protect State bit
1 = Device is not code-protected
0 = Device is code-protected
Unimplemented: Read as ‘0’
NVMERR: NVMCON Status bit(1)
1 = An Error occurred during NVM operation
0 = An Error did not occur during NVM operation
Unimplemented: Read as ‘0’
CFGRDY: Code-Protect State bit
1 = Configuration has been read and CP is valid
0 = Configuration has not been read
FCBUSY: Flash Controller Busy bit
1 = Flash controller is busy (Erase is in progress)
0 = Flash controller is not busy (either erase has not started or it has finished)
FAEN: Flash Access Enable bit(2)
This bit reflects the state of CFGCON.FAEN.
1 = Flash access is enabled
0 = Flash access is disabled (i.e., processor accesses are blocked)
DEVRST: Device Reset State bit
1 = Device Reset is active
0 = Device Reset is not active
This bit is not implemented in PIC32MX320/340/360/420/440/460 devices.
This bit is not implemented in PIC32MK and PIC32MZ family devices.

TABLE 20-4:

EJTAG TAP INSTRUCTIONS

Command

Value

Description

ETAP_ADDRESS

5’h0x08

Select Address register.

ETAP_DATA

5’h0x09

Select Data register.

ETAP_CONTROL

5’h0x0A

Select EJTAG Control register.

ETAP_EJTAGBOOT

5’h0x0C

Set EjtagBrk, ProbEn and ProbTrap to ‘1’ as the Reset value.

ETAP_FASTDATA

5’h0x0E

Selects the Data and Fastdata registers.

DS60001145U-page 60

 2007-2017 Microchip Technology Inc.

PIC32
20.2
20.2.1

EJTAG TAP Controller
ETAP_ADDRESS COMMAND

ETAP_ADDRESS selects the Address register. The
read-only Address register provides the address for a
processor access. The value read in the register is
valid if a processor access is pending, otherwise the
value is undefined.
The two or three Least Significant Bytes (LSBs) of the
register are used with the Psz field from the EJTAG
Control register to indicate the size and data position of
the pending processor access transfer. These bits are
not taken directly from the address referenced by the
load/store.

20.2.2

ETAP_DATA COMMAND

ETAP_DATA selects the Data register. The read/write
Data register is used for op code and data transfers
during processor accesses. The value read in the Data
register is valid only if a processor access for a write is
pending, in which case the Data register holds the store
value. The value written to the Data register is only
used if a processor access for a pending read is
finished afterwards; in which case, the data value
written is the value for the fetch or load. This behavior
implies that the Data register is not a memory location
where a previously written value can be read
afterwards.

20.2.3

ETAP_CONTROL COMMAND

ETAP_CONTROL selects the Control register. The
EJTAG Control register (ECR) handles processor Reset
and soft Reset indication, Debug mode indication,
access start, finish and size, and read/write indication.
The ECR also provides the following features:
• Controls debug vector location and indication of
serviced processor accesses
• Allows a debug interrupt request
• Indicates a processor low-power mode
• Allows implementation-dependent processor and
peripheral Resets

20.2.3.1

EJTAG Control Register (ECR)

The EJTAG Control register (see Register 20-1) is not
updated/written in the Update-DR state unless the
Reset occurred; that is ROCC (bit 31) is either already
‘0’ or is written to ‘0’ at the same time. This condition
ensures proper handling of processor accesses after a
Reset.
Reset of the processor can be indicated through the
ROCC bit in the TCK domain a number of TCK cycles
after it is removed in the processor clock domain in
order to allow for proper synchronization between the
two clock domains.
Bits that are Read/Write (R/W) in the register return
their written value on a subsequent read, unless other
behavior is defined.
Internal synchronization ensures that a written value is
updated for reading immediately afterwards, even
when the TAP controller takes the shortest path from
the Update-DR to Capture-DR state.

 2007-2017 Microchip Technology Inc.

DS60001145U-page 61

PIC32
REGISTER 20-1:
Bit
Range
31:24
23:16
15:8
7:0

Bit
31/23/15/7

Bit
30/22/14/6

Bit
29/21/13/5

R/W-0

R-0

Rocc
R-0

bit 17
bit 16
bit 15

bit 14

bit 13
bit 12

bit 11-4
bit 3
bit 2-0
Note 1:

Bit
Bit
28/20/12/4 27/19/11/3

Psz<1:0>

Bit
26/18/10/2

Bit
25/17/9/1

Bit
24/16/8/0
U-0

U-0

—

U-0

R/W-0

R-0

R/W-0

R-0

R/W-0

VPED

Doze

Halt

PerRst

PrnW

PrACC

—

PrRst

R/W-0

U-0

R/W-0

U-0

ProbEn

ProbTrap

—

EjtagBrk

—

U-0

R-0

U-0

—

Legend:
R = Readable bit
-n = Value at POR
bit 31-29
bit 28-24
bit 23-19
bit 18

ECR: EJTAG CONTROL REGISTER

W = Writable bit
‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown

See Note 1
Unimplemented: Read as ‘0’
See Note 1
PrACC: Pending Processor Access and Control bit
This bit indicates a pending processor access and controls finishing of a pending processor access. A write
of ‘0’ finishes processor access if pending. A write of ‘1’ is ignored. A successful FASTDATA access will clear
this bit.
1 = Pending processor access
0 = No pending preprocessor access
Unimplemented: Read as ‘0’
See Note 1
ProbEn: Processor Access Service Control bit
This bit controls where the probe handles accesses to the DMSEG segment through servicing of processor
accesses.
1 = Probe services processor accesses
0 = Probe does not service processor access
ProbTrap: Debug Exception Vector Control Location bit
This bit controls the location of the debug exception vector.
1 = 0xFF200200
0 = 0xBFC00480
Unimplemented: Read as ‘0’
EjtagBrk: Debug Interrupt Exception Request bit
This bit requests a debug interrupt exception to the processor when this bit is written as ‘1’. A write of ‘0’ is
ignored.
1 = A debug interrupt exception request is pending
0 = A debug interrupt exception request is not pending
Unimplemented: Read as ‘0’
See Note 1
Unimplemented: Read as ‘0’
For descriptions of these bits, please refer to the Imagination Technologies Limited web site.
(www.imgtec.com).

DS60001145U-page 62

 2007-2017 Microchip Technology Inc.

PIC32
20.2.4

ETAP_EJTAGBOOT COMMAND

The ETAP_EJTAGBOOT command causes the
processor to fetch code from the debug exception
vector after a Reset. This allows the programmer to
send instructions to the processor to execute, instead
of the processor fetching them from the normal Reset
vector. The Reset value of the EjtagBrk, ProbTrap, and
ProbE bits follows the setting of the internal
EJTAGBOOT indication.
If the EJTAGBOOT instruction has been given, and the
internal EJTAGBOOT indication is active, then the
Reset value of the three bits is set (‘1’), otherwise the
Reset value is clear (‘0’).
The results of setting these bits are:
• Setting the EjtagBrk causes a Debug interrupt
exception to be requested right after the
processor Reset from the EJTAGBOOT instruction
• The debug handler is executed from the EJTAG
memory because ProbTrap is set to indicate
debug vector in EJTAG memory at 0xFF200200
• Service of the processor access is indicated
because ProbEn is set
With this configuration in place, an interrupt exception
will occur and the processor will fetch the handler from
the DMSEG at 0xFF200200. Since ProbEn is set, the
processor will wait for the instruction to be provided by
the probe.

20.2.5

ETAP_FASTDATA COMMAND

The ETAP_FASTDATA command provides a
mechanism for quickly transferring data between the
processor and the probe. The width of the Fastdata
register is one bit. During a fast data access, the
Fastdata register is written and read (i.e., a bit is shifted
in and a bit is shifted out). During a fast data access,
the Fastdata register value shifted in specifies whether
the fast data access should be completed or not. The
value shifted out is a flag that indicates whether the fast
data access was successful or not (if completion was
requested). The FASTDATA access is used for efficient
block transfers between the DMSEG segment (on the
probe) and target memory (on the processor). An
“upload” is defined as a sequence that the processor
loads from target memory and stores to the DMSEG
segment. A “download” is a sequence of processor
loads from the DMSEG segment and stores to target
memory. The “Fastdata area” specifies the legal range
of DMSEG segment addresses (0xFF200000 to
0xFF20000F) that can be used for uploads and
downloads. The Data and Fastdata registers (selected
with the FASTDATA instruction) allow efficient
completion of pending Fastdata area accesses.
During Fastdata uploads and downloads, the
processor will stall on accesses to the Fastdata area.
The PrAcc (processor access pending bit) will be ‘1’
indicating the probe is required to complete the access.
Both upload and download accesses are attempted by
shifting in a zero SPrAcc value (to request access
completion) and shifting out SPrAcc to see if the
attempt will be successful (i.e., there was an access
pending and a legal Fastdata area address was used).
Downloads will also shift in the data to be used to
satisfy the load from the DMSEG segment Fastdata
area, while uploads will shift out the data being stored
to the DMSEG segment Fastdata area.
As indicated, the following two conditions must be true
for the Fastdata access to succeed:
• PrAcc must be ‘1’ (i.e., there must be a pending
processor access)
• The Fastdata operation must use a valid Fastdata
area address in the DMSEG segment
(0xFF200000 to 0xFF20000F)

 2007-2017 Microchip Technology Inc.

DS60001145U-page 63

PIC32
21.0

AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS

TABLE 21-1:

AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS

Standard Operating Conditions
Operating Temperature: 0ºC to +70ºC. Programming at +25ºC is recommended.
Param.
No.

Symbol

Characteristic

Min.

Max.

Units

Conditions

D111

VDDIO

Supply Voltage During Programming

—

See Note 1

D112a

VDDCORE Core Power Supply Voltage During Programming

—

See Note 1

D112b

VDDR1V8

DDR SDRAM Supply Voltage During Programming

—

See Note 1

D113

IDDP

Supply Current During Programming

—

See Note 1

D114

IPEAK

Instantaneous Peak Current During Start-up

—

See Note 1

D115a

IDDCORE

Core Power Supply Current During Programming

—

See Note 1

D115b

IDDR1V8P

DDR SDRAM Supply Current During Programming

—

See Note 1

D116

VDDVBAT

VBAT Supply Voltage During Programming

—

See Note 1

D117

IDDVBAT

VBAT Supply Current During Programming

—

See Note 1

D031

VIL

Input Low Voltage

—

See Note 1

D041

VIH

Input High Voltage

—

See Note 1

D080

VOL

Output Low Voltage

—

See Note 1

D090

VOH

Output High Voltage

—

See Note 1

D012

CIO

Capacitive Loading on I/O pin (PGEDx)

—

See Note 1

D013

Filter Capacitor Value on VCAP

—

F

See Note 1

TPGC

Serial Clock (PGECx) Period

100

—

P1A

TPGCL

Serial Clock (PGECx) Low Time

—

P1B

TPGCH

Serial Clock (PGECx) High Time

—

TSET2

VDD Setup Time to MCLR 

100

—

THLD2

Input Data Hold Time from MCLR 

500

—

P9a

TDLY4

PE Command Processing Time

—

s

—

P9b

TDLY5

Delay between PGEDx by the PE to PGEDx
Released by the PE

—

s

—

P11

TDLY7

Chip Erase Time

—

See Note 1

P12

TDLY8

Page Erase Time

—

See Note 1

P13

TDLY9

Row Programming Time

—

See Note 1

P14

MCLR Rise Time to Enter ICSP™ mode

—

1.0

s

—

P15

TVALID

Data Out Valid from PGECx 

—

P16

TDLY8

Delay between Last PGECx  and MCLR 

—

P17

THLD3

MCLR to VDD 

—

100

—

P18

TKEY1

Delay from First MCLR to First PGECx for Key
Sequence on PGEDx

—

P19

TKEY2

Delay from Last PGECx for Key Sequence on
PGEDx to Second MCLR 

—

P20

TMCLRH

MCLR High Time

—

500

µs

—

Note 1:

Refer to the “Electrical Characteristics” chapter in the specific device data sheet for the Minimum and
Maximum values for this parameter.

DS60001145U-page 64

 2007-2017 Microchip Technology Inc.

PIC32
APPENDIX A:
FIGURE A-1:

PIC32 FLASH
MEMORY MAP

FLASH MEMORY MAP
0x1D000000

APPENDIX B:

HEX FILE FORMAT

Flash programmers process the standard hexadecimal
(hex) format used by the Microchip development tools.
The format supported is the Intel® HEX32 Format
(INHX32). Refer to the Section 1.75 “Hex file
Formats” in the “MPASM™ Assembler, MPLINK™
Object Linker, MPLIB™ Object Librarian User’s Guide”
(DS33014) for more information about hex file formats.
The basic format of the hex file is:
:BBAAAATTHHHH...HHHHCC

PFM

Each data record begins with a 9-character prefix and
always ends with a 2-character checksum. All records
begin with ‘:’, regardless of the format. The individual
elements are described below.

Program Flash Memory

0x1D007FFF

0x1F000000

BFM

Boot Page 0

Boot Page 1

Note:

Because the Intel hex file format is byte-oriented, and
the 16-bit program counter is not, program memory
sections require special treatment. Each 24-bit
program word is extended to 32 bits by inserting a socalled “phantom byte”. Each program memory
address is multiplied by 2 to yield a byte address.

0x1F001FFF

As an example, a section that is located at 0x100 in
program memory will be represented in the hex file as
0x200.

0x1F002FF0

The hex file will be produced with the following
contents:

Boot Page 2
Debug Page
Configuration Words
(4 x 32 bits)

• BB – is a two-digit hexadecimal byte count
representing the number of data bytes that appear
on the line. Divide this number by two to get the
number of words per line.
• AAAA – is a four-digit hexadecimal address
representing the starting address of the data
record. Format is high byte first followed by low
byte.
• TT – is a two-digit record type that will be ‘00’ for
data records, ‘01’ for end-of-file records and ‘04’
for extended-address record.
• HHHH – is a four-digit hexadecimal data word.
Format is low byte followed by high byte. There
will be BB/2 data words following TT.
• CC – is a two-digit hexadecimal checksum that is
the 2’s complement of the sum of all the
preceding bytes in the line record.

0x1F002FFF

The memory map shown is for reference
only. Refer to the “Memory Organization”
chapter in the specific device data sheet for
the memory map for your device.

 2007-2017 Microchip Technology Inc.

:020000040000fa
:040200003322110096
:00000001FF
The data record (second line) has a load address of
0200, while the source code specified address is
0x100. The data is represented in “little-endian”
format, that is the Least Significant Byte appears first
and the phantom byte appears last, before the
checksum.

DS60001145U-page 65

PIC32
APPENDIX C:
TABLE C-1:

DEVICE IDS

PIC32MX320/340/360/440/460
FAMILY DEVICE IDS

Part Number

Device ID

PIC32MX360F512L

0x0938053

PIC32MX360F256L

0x0934053

PIC32MX340F128L

0x092D053

PIC32MX320F128L

0x092A053

PIC32MX340F512H

0x0916053

PIC32MX340F256H

0x0912053

PIC32MX340F128H

0x090D053

PIC32MX320F128H

0x090A053

PIC32MX320F064H

0x0906053

PIC32MX320F032H

0x0902053

PIC32MX460F512L

0x0978053

PIC32MX460F256L

0x0974053

PIC32MX440F128L

0x096D053

PIC32MX440F256H

0x0952053

PIC32MX440F512H

0x0956053

TABLE C-3:

PIC32MX534/564/664/764
FAMILY DEVICE IDS

Part Number

Device ID

PIC32MX534F064H

0x04400053

PIC32MX564F064H

0x04401053

PIC32MX564F128H

0x04403053

PIC32MX664F064H

0x04405053

PIC32MX664F128H

0x04407053

PIC32MX764F128H

0x0440B053

PIC32MX534F064L

0x0440C053

PIC32MX564F064L

0x0440D053

PIC32MX564F128L

0x0440F053

PIC32MX664F064L

0x04411053

PIC32MX664F128L

0x04413053

PIC32MX764F128L

0x04417053

TABLE C-4:

PIC32MX1XX/2XX 28/36/44PIN FAMILY DEVICE IDS

Part Number

Device ID

PIC32MX440F128H

0x094D053

PIC32MX110F016B

PIC32MX420F032H

0x0942053

PIC32MX110F016C

0x04A09053

PIC32MX110F016D

0x04A0B053

TABLE C-2:

PIC32MX575/675/695/775/795
FAMILY DEVICE IDS

Part Number

Device ID

PIC32MX575F256H

0x04317053

PIC32MX675F256H

0x0430B053

PIC32MX775F256H

0x04303053

PIC32MX575F512H

0x04309053

PIC32MX675F512H

0x0430C053

PIC32MX695F512H

0x04325053

PIC32MX775F512H

0x0430D053

PIC32MX795F512H

0x0430E053

PIC32MX575F256L

0x04333053

PIC32MX675F256L

0x04305053

PIC32MX775F256L

0x04312053

PIC32MX575F512L

0x0430F053

PIC32MX675F512L

0x04311053

PIC32MX695F512L

0x04341053

PIC32MX775F512L

0x04307053

PIC32MX795F512L

0x04307053

DS60001145U-page 66

0x04A07053

PIC32MX210F016B

0x04A01053

PIC32MX210F016C

0x04A03053

PIC32MX210F016D

0x04A05053

PIC32MX120F032B

0x04A06053

PIC32MX120F032C

0x04A08053

PIC32MX120F032D

0x04A0A053

PIC32MX220F032B

0x04A00053

PIC32MX220F032C

0x04A02053

PIC32MX220F032D

0x04A04053

PIC32MX130F064B

0x04D07053

PIC32MX130F064C

0x04D09053

PIC32MX130F064D

0x04D0B053

PIC32MX230F064B

0x04D01053

PIC32MX230F064C

0x04D03053

PIC32MX230F064D

0x04D05053

PIC32MX150F128B

0x04D06053

PIC32MX150F128C

0x04D08053

PIC32MX150F128D

0x04D0A053

PIC32MX250F128B

0x04D00053

PIC32MX250F128C

0x04D02053

PIC32MX250F128D

0x04D04053

PIC32MX170F256B

0x06610053

PIC32MX170F256D

0x0661A053

PIC32MX270F256B

0x06600053

PIC32MX270F256D

0x0660A053

PIC32MX270F256DB

0x0660C053

PIC32MX130F256B

0x06703053

PIC32MX130F256D

0x06705053

PIC32MX230F256B

0x06700053

PIC32MX230F256D

0x06702053

 2007-2017 Microchip Technology Inc.

PIC32
TABLE C-5:

PIC32MX330/350/370/430/450/
470 FAMILY DEVICE IDS

Part Number

Device ID

TABLE C-7:

PIC32MX1XX/2XX/5XX 64/100PIN FAMILY DEVICE IDS

Part Number

Device ID

PIC32MX330F064H

0x05600053

PIC32MX150F256H

PIC32MX330F064L

0x05601053

PIC32MX150F256L

0x06A11053

PIC32MX350F256H

0x05704053

PIC32MX170F512H

0x06A30053

PIC32MX350F256L

0x05705053

PIC32MX170F512L

0x06A31053

PIC32MX430F064H

0x05602053

PIC32MX250F256H

0x06A12053

PIC32MX430F064L

0x05603053

PIC32MX250F256L

0x06A13053

PIC32MX450F256H

0x05706053

PIC32MX270F512H

0x06A32053

PIC32MX450F256L

0x05707053

PIC32MX270F512L

0x06A33053

PIC32MX350F128H

0x0570C053

PIC32MX550F256H

0x06A14053

PIC32MX350F128L

0x0570D053

PIC32MX550F256L

0x06A15053

PIC32MX450F128H

0x0570E053

PIC32MX570F512H

0x06A34053

PIC32MX450F128L

0x0570F053

PIC32MX570F512L

0x06A35053

PIC32MX370F512H

0x05808053

PIC32MX120F064H

0x06A50053

PIC32MX370F512L

0x05809053

PIC32MX130F128H

0x06A00053

PIC32MX470F512H

0x0580A053

PIC32MX130F128L

0x06A01053

PIC32MX470F512L

0x0580B053

PIC32MX230F128H

0x06A02053

PIC32MX450F256HB

0x05710053

PIC32MX230F128L

0x06A03053

PIC32MX470F512LB

0x05811053

PIC32MX530F128H

0x06A04053

PIC32MX530F128L

0x06A05053

TABLE C-6:

PIC32MZ EMBEDDED
CONNECTIVITY (EC) FAMILY
DEVICE IDS

Part Number

Device ID

TABLE C-8:

0x06A10053

PIC32MZ EMBEDDED
CONNECTIVITY WITH FPU
(EF) FAMILY DEVICE IDS

Part Number

Device ID

PIC32MZ1024ECG064

0x05103053

PIC32MZ1024ECH064

0x05108053

PIC32MZ0512EFE064

PIC32MZ1024ECM064

0x05130053

PIC32MZ0512EFF064

0x07206053

PIC32MZ2048ECG064

0x05104053

PIC32MZ0512EFK064

0x0722E053

PIC32MZ2048ECH064

0x05109053

PIC32MZ1024EFE064

0x07202053

PIC32MZ2048ECM064

0x05131053

PIC32MZ1024EFF064

0x07207053

PIC32MZ1024ECG100

0x0510D053

PIC32MZ1024EFK064

0x0722F053

PIC32MZ1024ECH100

0x05112053

PIC32MZ1024EFG064

0x07203053

PIC32MZ1024ECM100

0x0513A053

PIC32MZ1024EFH064

0x07208053

PIC32MZ2048ECG100

0x0510E053

PIC32MZ1024EFM064

0x07230053

PIC32MZ2048ECH100

0x05113053

PIC32MZ2048EFG064

0x07204053

PIC32MZ2048ECM100

0x0513B053

PIC32MZ2048EFH064

0x07209053

PIC32MZ1024ECG124

0x05117053

PIC32MZ2048EFM064

0x07231053

PIC32MZ1024ECH124

0x0511C053

PIC32MZ0512EFE100

0x0720B053

PIC32MZ1024ECM124

0x05144053

PIC32MZ0512EFF100

0x07210053

PIC32MZ2048ECG124

0x05118053

PIC32MZ0512EFK100

0x07238053

PIC32MZ2048ECH124

0x0511D053

PIC32MZ1024EFE100

0x0720C053

PIC32MZ2048ECM124

0x05145053

PIC32MZ1024EFF100

0x07211053

PIC32MZ1024ECG144

0x05121053

PIC32MZ1024EFK100

0x07239053

PIC32MZ1024ECH144

0x05126053

PIC32MZ1024EFG100

0x0720D053

PIC32MZ1024ECM144

0x0514E053

PIC32MZ1024EFH100

0x07212053

PIC32MZ2048ECG144

0x05122053

PIC32MZ1024EFM100

0x0723A053

PIC32MZ2048ECH144

0x05127053

PIC32MZ2048EFG100

0x0720E053

PIC32MZ2048ECM144

0x0514F053

PIC32MZ2048EFH100

0x07213053

PIC32MZ2048EFM100

0x0723B053

 2007-2017 Microchip Technology Inc.

0x07201053

PIC32MZ0512EFE124

0x07215053

PIC32MZ0512EFF124

0x0721A053

DS60001145U-page 67

PIC32
TABLE C-8:

PIC32MZ EMBEDDED
CONNECTIVITY WITH FPU
(EF) FAMILY DEVICE IDS

Part Number

TABLE C-9:

PIC32MZ GRAPHICS (DA)
FAMILY DEVICE IDS

Part Number

Device ID

PIC32MZ1025DAB176

0x05F79053

0x07242053

PIC32MZ1064DAA176

0x05F7B053

PIC32MZ1024EFE124

0x07216053

PIC32MZ1064DAB176

0x05F7C053

PIC32MZ1024EFF124

0x0721B053

PIC32MZ2025DAA176

0x05F81053

PIC32MZ1024EFK124

0x07243053

PIC32MZ2025DAB176

0x05F82053

PIC32MZ1024EFG124

0x07217053

PIC32MZ2064DAA176

0x05F84053

PIC32MZ1024EFH124

0x0721C053

PIC32MZ2064DAB176

0x05F85053

PIC32MZ1024EFM124

0x07244053

PIC32MZ1025DAG176

0x05FAE053

PIC32MZ2048EFG124

0x07218053

PIC32MZ1025DAH176

0x05FAF053

PIC32MZ2048EFH124

0x0721D053

PIC32MZ1064DAG176

0x05FB1053

PIC32MZ2048EFM124

0x07245053

PIC32MZ1064DAH176

0x05FB2053

PIC32MZ0512EFE144

0x0721F053

PIC32MZ2025DAG176

0x05FB7053

PIC32MZ0512EFF144

0x07224053

PIC32MZ2025DAH176

0x05FB8053

PIC32MZ0512EFK144

0x0724C053

PIC32MZ2064DAG176

0x05FBA053

PIC32MZ1024EFE144

0x07220053

PIC32MZ2064DAH176

0x05FBB053

PIC32MZ1024EFF144

0x07225053

PIC32MZ1025DAA288

0x05F5D053

PIC32MZ1024EFK144

0x0724D053

PIC32MZ1025DAB288

0x05F5E053

PIC32MZ1024EFG144

0x07221053

PIC32MZ1064DAA288

0x05F60053

PIC32MZ1024EFH144

0x07226053

PIC32MZ1064DAB288

0x05F61053

PIC32MZ1024EFM144

0x0724E053

PIC32MZ2025DAA288

0x05F66053

PIC32MZ2048EFG144

0x07222053

PIC32MZ2025DAB288

0x05F67053

PIC32MZ2048EFH144

0x07227053

PIC32MZ2064DAA288

0x05F69053

PIC32MZ2048EFM144

0x0724F053

PIC32MZ2064DAB288

0x05F6A053

PIC32MZ0512EFK124

TABLE C-9:

PIC32MZ GRAPHICS (DA)
FAMILY DEVICE IDS

Part Number

Device ID

TABLE C-10:

PIC32MX1XX/2XX 28/44-PIN
XLP FAMILY DEVICE IDS

Part Number

Device ID

PIC32MZ1025DAA169

0x05F0C053

PIC32MX154F128B

0x07800053

PIC32MZ1025DAB169

0x05F0D053

PIC32MX154F128D

0x07804053

PIC32MZ1064DAA169

0x05F0F053

PIC32MX155F128B

0x07808053

PIC32MZ1064DAB169

0x05F10053

PIC32MX155F128D

0x0780C053

PIC32MZ2025DAA169

0x05F15053

PIC32MX174F256B

0x07801053

PIC32MZ2025DAB169

0x05F16053

PIC32MX174F256D

0x07805053

PIC32MZ2064DAA169

0x05F18053

PIC32MX175F256B

0x07809053

PIC32MZ2064DAB169

0x05F19053

PIC32MX175F256D

0x0780D053

PIC32MZ1025DAG169

0x05F42053

PIC32MX254F128B

0x07802053

PIC32MZ1025DAH169

0x05F43053

PIC32MX254F128D

0x07806053

PIC32MZ1064DAG169

0x05F45053

PIC32MX255F128B

0x0780A053

PIC32MZ1064DAH169

0x05F46053

PIC32MX255F128D

0x0780E053

PIC32MZ2025DAG169

0x05F4B053

PIC32MX274F256B

0x07803053

PIC32MZ2025DAH169

0x05F4C053

PIC32MX274F256D

0x07807053

PIC32MZ2064DAG169

0x05F4E053

PIC32MX275F256B

0x0780B053

PIC32MZ2064DAH169

0x05F4F053

PIC32MX275F256D

0x0780F053

PIC32MZ1025DAA176

0x05F78053

DS60001145U-page 68

 2007-2017 Microchip Technology Inc.

PIC32
TABLE C-11:

PIC32MK GENERAL
PURPOSE AND MOTOR
CONTROL (GP/MC) FAMILY
DEVICE IDS

Part Number

Device ID

TABLE C-12:

PIC32MK GENERAL
PURPOSE AND MOTOR
CONTROL (GP/MC) with ECC
FLASH FAMILY DEVICE IDS

Part Number

Device ID

PIC32MK1024MCF100

0x16201053

PIC32MK0512GPK064

PIC32MK1024MCF064

0x16202053

PIC32MK1024GPK064

0x16204053

PIC32MK0512GPK100

0x08B10053

PIC32MK0512MCF064

0x16205053

PIC32MK1024GPK100

0x08B0D053

PIC32MK1024GPE100

0x16207053

PIC32MK0512GPL064

0x08B0B053

0x16208053

PIC32MK1024GPL064

0x08B08053

PIC32MK0512GPE100

0x1620A053

PIC32MK0512GPL100

0x08B0A053

PIC32MK0512GPE064

0x1620B053

PIC32MK1024GPL100

0x08B07053

0x1620D053

PIC32MK0512MCM064

0x08B05053

0x1620E053

PIC32MK1024MCM064

0x08B02053

0x16210053

PIC32MK0512MCM100

0x08B04053

PIC32MK0512GPD064

0x16211053

PIC32MK1024MCM100

0x08B01053

PIC32MK1024MCM100

0x08B01053

PIC32MK1024MCM064

0x08B02053

PIC32MK0512MCM100

0x08B04053

PIC32MK0512MCM064

0x08B05053

PIC32MK1024GPL100

0x08B07053

PIC32MK0512MCF100

PIC32MK1024GPE064

PIC32MK1024GPD100
PIC32MK1024GPD064
PIC32MK0512GPD100

PIC32MK1024GPL064

0x08B08053

PIC32MK0512GPL100

0x08B0A053

PIC32MK0512GPL064

0x08B0B053

PIC32MK1024GPK100

0x08B0D053

PIC32MK1024GPK064

0x08B0E053

PIC32MK0512GPK100

0x08B10053

PIC32MK0512GPK064

0x08B11053

PIC32MK0512MCH064

0x06300053

PIC32MK0512MCH048

0x06301053

PIC32MK0512MCH040

0x06302053

PIC32MK0256MCH064

0x06304053

PIC32MK0256MCH048

0x06305053

PIC32MK0256MCH040

0x06306053

PIC32MK0512GPG064

0x06308053

PIC32MK0512GPG048

0x06309053

PIC32MK0512GPG040

0x0630A053

PIC32MK0256GPG064

0x0630C053

PIC32MK0256GPG048

0x0630D053

PIC32MK0256GPG040

0x0630E053

 2007-2017 Microchip Technology Inc.

0x08B11053
0x08B0E053

DS60001145U-page 69

PIC32
APPENDIX D:

REVISION HISTORY

Revision A (August 2007)
This is the initial released version of the document.

Revision B (February 2008)
Update records for this revision are not available.

Revision C (April 2008)
Update records for this revision are not available.

Revision D (May 2008)
Update records for this revision are not available.

Revision E (July 2009)
This version of the document includes the following
additions and updates:
• Minor changes to style and formatting have been
incorporated throughout the document
• Added the following devices:
- PIC32MX565F256H
- PIC32MX575F512H
- PIC32MX675F512H
- PIC32MX795F512H
- PIC32MX575F512L
- PIC32MX675F512L
- PIC32MX795F512L
• Updated MCLR pulse line to show active-high
(P20) in Figure 7-1
• Updated Step 7 of Table 11-1 to clarify repeat of
the last instruction in the step
• The following instructions in Table 13-1 were
updated:
- Seventh, ninth and eleventh instructions in
Step 1
- All instructions in Step 2
- First instruction in Step 3
- Third instruction in Step 4
• Added the following devices to Table 17-1:
- PIC32MX565F256H
- PIC32MX575F512H
- PIC32MX575F512L
- PIC32MX675F512H
- PIC32MX675F512L
- PIC32MX795F512H
- PIC32MX795F512L
• Updated address values in Table 17-2

DS60001145U-page 70

Revision E (July 2009) (Continued)
• Added the following devices to Table 17-5:
- PIC32MX565F256H
- PIC32MX575F512H
- PIC32MX675F512H
- PIC32MX795F512H
- PIC32MX575F512L
- PIC32MX675F512L
- PIC32MX795F512L
• Added Notes 1-3 and the following bits to the
DEVCFG - Device Configuration Word Summary
and the DEVCFG3: Device Configuration Word 3
(see Table 18-1 and Register ):
- FVBUSIO
- FUSBIDIO
- FCANIO
- FETHIO
- FMIIEN
- FPBDIV<1:0>
- FJTAGEN
• Updated the DEVID Summary (see Table 18-1)
• Updated ICESEL bit description and added the
FJTAGEN bit in DEVCFG0: Device Configuration
Word 0 (see Register 16-1)
• Updated DEVID: Device and Revision ID register
• Added Device IDs and Revision table (Table 18-4)
• Added MCLR High Time (parameter P20) to
Table 20-1
• Added Appendix B: “Hex File Format” and
Appendix D: “Revision History”

Revision F (April 2010)
This version of the document includes the following
additions and updates:
• The following global bit name changes were
made:
- NVMWR renamed as WR
- NVMWREN renamed as WREN
- NVMERR renamed as WRERR
- FVBUSIO renamed as FVBUSONIO
- FUPLLEN renamed as UPLLEN
- FUPLLIDIV renamed as UPLLIDIV
- POSCMD renamed as POSCMOD
• Updated the PIC32MX family data sheet
references in the fourth paragraph of Section 2.0
“Programming Overview”
• Updated the note in Section 5.2.2 “2-Phase
ICSP”
• Updated the Initiate Flash Row Write Op Codes and
instructions (see steps 4, 5 and 6 in Table 13-1)

 2007-2017 Microchip Technology Inc.

PIC32
Revision F (April 2010) (Continued)
• Added the following devices:
- PIC32MX534F064H
- PIC32MX534F064L
- PIC32MX564F064H
- PIC32MX564F064L
- PIC32MX564F128H
- PIC32MX564F128L
- PIC32MX575F256L
- PIC32MX664F064H
- PIC32MX664F064L
- PIC32MX664F128H
- PIC32MX664F128L
- PIC32MX675F256H
- PIC32MX675F256L
- PIC32MX695F512H
- PIC32MX605F512L
- PIC32MX764F128H
- PIC32MX764F128L
- PIC32MX775F256H
- PIC32MX775F256L
- PIC32MX775F512H
- PIC32MX775F512L

Revision G (August 2010)
This revision of the document includes the following
updates:
• Updated Step 3 in Table 11-1: Download the PE
• Minor corrections to formatting and text have
been incorporated throughout the document

Revision H (April 2011)
This version of the document includes the following
additions and updates:
• Updates to formatting and minor typographical
changes have been incorporated throughout the
document
• The following devices were added:
- PIC32MX110F016B
- PIC32MX110F016C
- PIC32MX110F016D
- PIC32MX120F032B
- PIC32MX120F032C
- PIC32MX120F032D
- PIC32MX210F016B
- PIC32MX210F016C
- PIC32MX210F016D
- PIC32MX220F032B
- PIC32MX220F032C
- PIC32MX220F032D
• The following rows were added to Table 17-1:
- PIC32MX1X0
- PIC32MX2X0
• Added a new sub section Section 17.4.6
“Checksum Values While Device Is CodeProtected”

 2007-2017 Microchip Technology Inc.

• Removed Register 18-1 through Register 18-5.
• Removed Table 17-2
• Removed Section 17.5 “Checksum for PIC32
Devices” and its sub sections
• The Flash Program Memory Write-Protect
Ranges table was removed (formerly Table 18-4)
• Added DEVCFG Locations for PIC32MX1X0 and
PIC32MX20X Devices Only (see Table 18-3)
• In Section 18.0 “Configuration Memory and
Device ID”, removed Table 18-1 and updated
Table 18-2: DEVID Summary as Table 18-1
• Added the NVMERR bit to the MCHP Status
Value table (see Table 19-3)
• The following Silicon Revision and Revision ID
are added to Table 18-4:
- 0x5 - B6 Revision
- 0x1 - A1 Revision
• Added a note to the Flash Memory Map (see
Figure A-1)
• Added Appendix C: “Flash Program Memory
Data Sheet Clarification”

Revision J (August 2011)
Note:

The revision history in this document
intentionally skips from Revision H to
Revision J to avoid confusing the
uppercase letter “I” (EY) with the
lowercase letter “l” (EL).

This revision includes the following updates:
• All occurrences of VCORE/VCAP have been changed
to VCAP
• Updated the fourth paragraph of Section 2.0
“Programming Overview”
• Removed the column, Programmer Pin Name, from
the 2-Wire Interface Pins table and updated the Pin
Type for MCLR (see Table 4-2)
• Added the following new devices to the Code
Memory Size table (see Table 5-1) and the Device
IDs and Revision table (see Table 18-4):
- PIC32MX130F064B
- PIC32MX130F064C
- PIC32MX130F064D
- PIC32MX150F128B
- PIC32MX150F128C
- PIC32MX150F128D
- PIC32MX230F064B
- PIC32MX230F064C
- PIC32MX230F064D
- PIC32MX250F128B
- PIC32MX250F128C
- PIC32MX250F128D
• Added Row Size and Page Size columns to the
Code Memory Size table (see Table 5-1)

DS60001145U-page 71

PIC32
Revision J (August 2011) (Continued)
• Updated the PGCx signal in Entering Enhanced
ICSP Mode (see Figure 7-1)
• Updated the Erase Device block diagram (see
Figure 9-1)
• Added a new step 4 to the process to erase a target
device in Section 9.0 “Erasing the Device”
• Updated the MCLR signal in 2-Wire Exit Test
Mode (see Figure 15-2)
• Updated the PE Command Set with the following
commands and modified Note 2 (see Table 16-2):
- PROGRAM_CLUSTER
- GET_DEVICEID
- CHANGE_CFG
• Added a second note to Section 16.2.11
“GET_CRC Command”
• Updated the Address and Length descriptions in the
PROGRAM_CLUSTER Format (see Table 16-13)
• Added a note after the CHANGE_CFG Response (see
Figure 16-27)
• Updated the DEVCFG0 and DEVCFG1 values for
All PIC32MX1XX and All PIC32MX2XX devices in
Table 17-1
• The following changes were made to the AC/DC
Characteristics and Timing Requirements
(Table 20-1):
- Updated the Min. value for parameter D111 (VDD)
- Added parameter D114 (IPEAK)
- Removed parameters P2, P3, P4, P4A, P5, P8
and P10
• Removed Appendix C: “Flash Program Memory
Data Sheet Clarification”
• Minor updates to text and formatting were
incorporated throughout the document

• Updated Section 12.2 “With the PE”
• Updated Step 3 in Initiate Flash Row Write Op
Codes (see Table 13-1)
• Updated Step 1 in Verify Device op Codes (see
Table 14-1)
• Updated the interval in Section 15.1 “4-wire
Interface” and Section 15.2 “2-wire Interface”
• Added a note regarding the PE location in
Section 16.0 “The Programming Executive”
• Added references to the Operand field throughout
Section 16.2 “The PE Command Set”
• Updated the PROGRAM Command Algorithm (see
Figure 16-9)
• Updated the mask values for All PIC32MX1XX
and PIC32MX2XX devices, and DEVCFG3 for all
devices (see Table 17-1)
• Updated the DCR value (see Section 17.4.3
“Calculating for “DCR” in the Checksum
Formula” and Table 17-2)
• Updated the Checksum Calculation Process (see
Example 17-1)
• Added these new devices to the Code Memory Size
table (see Table 5-1) and the Device IDs and
Revision table (see Table 18-4):
- PIC32MX420F032H

- PIC32MX450F128L

- PIC32MX330F064H

- PIC32MX440F256H

- PIC32MX330F064L

- PIC32MX450F256H

- PIC32MX430F064H

- PIC32MX450F256L

- PIC32MX430F064L

- PIC32MX460F256L

- PIC32MX340F128H

- PIC32MX340F512H

- PIC32MX340F128L

- PIC32MX360F512H

- PIC32MX350F128H

- PIC32MX370F512H

- PIC32MX350F128L

- PIC32MX370F512L

- PIC32MX350F256H

- PIC32MX440F512H

- PIC32MX350F256L

- PIC32MX460F512L

- PIC32MX440F128H

- PIC32MX470F512H

Revision K (July 2012)

- PIC32MX440F128L

- PIC32MX470F512L

This revision includes the following updates:

- PIC32MX450F128H

• All occurrences of PGC and PGD were changed to:
PGEC and PGED, respectively
• Updated Section 1.0 “Device Overview” with a list
of all major topics in this document
• Added Section 2.3 “Data Sizes”
• Updated Section 4.0 “Connecting to the Device”
• Added Note 2 to Connections for the On-chip
Regulator (see Figure 4-2)
• Added Note 2 to the 4-wire and 2-wire Interface Pins
tables (see Table 4-1 and Table 4-2)
• Updated Section 7.0 “Entering 2-Wire Enhanced
ICSP Mode”
• Updated Entering Serial Execution Mode (see
Figure 10-1)
• Updated step 11 in Section 10.2 “2-wire Interface”

DS60001145U-page 72

• Added a Note to Section 18.2 “Device Code
Protection bit (CP)”
• Added the EJTAG Control Register (see
Register 19-1)
• Updated Section 19.2.4 “ETAP_EJTAGBOOT
Command”
• AC/DC Characteristics and Timing Requirements
updates (see Table 20-1):
- Removed parameter D112
- Replaced Notes 1 and 2 with a new Note 1
- Updated parameters D111, D113, D114, D031,
D041, D080, D090, D012, D013, P11, P12, and
P13
• Minor updates to text and formatting were
incorporated through the document

 2007-2017 Microchip Technology Inc.

PIC32
Revision L (January 2013)

Revision M (September 2013)

This revision includes the following updates:

• The following sections were added or updated:
- Section 2.1 “Devices with Dual Flash
Panel and Dual Boot Regions” (new)
- Section 4.3 “Power Requirements”
- Section 13.0 “Initiating a Flash Row Write”
- Section 16.1.1 “2-wire ICSP EJTAG RATE”
• Updated the Device Configuration Register Mask
Values (see Table 17-1)
• The following devices were added to the Code
Memory Size table and the Device IDs and Revision
table (see Table 5-1 and Table 18-4):

• All references to MIPS Technologies Inc. and
www.mips.com were updated to Imagination
Technologies Limited and www.imgtec.com,
respectively
• Updated Section 2.0 “Programming Overview”
• Updated the last paragraph in Section 5.1.6
“Flash Memory”
• Updated Code Memory Sizes and added Note 3
(see Table 5-1)
• Updated the Erase Device flow diagram (see
Figure 9-1)
• Updated Steps 1, 2, 3, and 5 in Table 11-1
• Added a new paragraph in Section 13.2
“Without the PE”
• Updated Step 2, 3, and 5 in Table 13-1
• Updated the Op code description in Table 16-17
• Updated Device Configuration Mask Values (see
Table 17-1)
• Removed the first sentence in the fourth
paragraph of Section 17.3 “Algorithm”
• Updated Device IDs and Revision (see Table 18-4)

- PIC32MZ0256ECE064

- PIC32MZ1024ECF064

- PIC32MZ0256ECE100

- PIC32MZ1024ECF100

- PIC32MZ0256ECE124

- PIC32MZ1024ECF124

- PIC32MZ0256ECE144

- PIC32MZ1024ECF144

- PIC32MZ0256ECF064

- PIC32MZ1024ECG064

- PIC32MZ0256ECF100

- PIC32MZ1024ECG100

- PIC32MZ0256ECF124

- PIC32MZ1024ECG124

- PIC32MZ0256ECF144

- PIC32MZ1024ECG144

- PIC32MZ0512ECE064

- PIC32MZ1024ECH064

- PIC32MZ0512ECE100

- PIC32MZ1024ECH100

- PIC32MZ0512ECE124

- PIC32MZ1024ECH124

- PIC32MZ0512ECE144

- PIC32MZ1024ECH144

Revision N (April 2014)

- PIC32MZ0512ECF064

- PIC32MZ2048ECG064

- PIC32MZ0512ECF100

- PIC32MZ2048ECG100

This revision includes the following updates:

- PIC32MZ0512ECF124

- PIC32MZ2048ECG124

- PIC32MZ0512ECF144

- PIC32MZ2048ECG144

- PIC32MZ1024ECE064

- PIC32MZ2048ECH064

- PIC32MZ1024ECE100

- PIC32MZ2048ECH100

- PIC32MZ1024ECE124

- PIC32MZ2048ECH124

- PIC32MZ1024ECE144

- PIC32MZ2048ECH144

• Note 3 and Note 4 and the GET_CHECKSUM and
QUAD_WORD_PRGM commands were added to the
PE Command Set (see Table 16-2)
• Added Section 16.2.15 “GET_CHECKSUM
Command”
• Added Section 16.2.16 “QUAD_WORD_PROGRAM Command”
• Updated all addresses in DEVCFG Locations
(see Table 18-1 and Table 18-2)
• Added Configuration Word Locations for
PIC32MZ EC Family Devices (see Table 18-3)
• Updated Section 18.2 “Device Code Protection
bit (CP)”
• Updated Section 18.3 “Program Write Protection
bits (PWP)”
• All references to Test mode were updated to
programming mode throughout the document
• Minor updates to text and formatting were
incorporated through the document

 2007-2017 Microchip Technology Inc.

• Note 2 was updated in TABLE 4-1: “4-wire
Interface Pins”
• Note 2 was updated in TABLE 4-2: “2-wire
Interface Pins”
• The Delay value in Step 5 of Section 9.0
“Erasing the Device” was updated
• The Revision ID and Silicon Revision column
was updated and the following devices were
added to the Device IDs and Revision table (see
Table 18-4):
- PIC32MX170F256B

- PIC32MX350F256H

- PIC32MX170F256D

- PIC32MX350F256L

- PIC32MX270F256B

- PIC32MX430F064H

- PIC32MX270F256D

- PIC32MX430F064L

- PIC32MX330F064H

- PIC32MX450F128H

- PIC32MX330F064L

- PIC32MX450F128L

- PIC32MX350F128H

- PIC32MX450F256H

- PIC32MX350F128L

- PIC32MX450F256L

DS60001145U-page 73

PIC32
Revision P (October 2014)
Note:

The revision history in this document
intentionally skips from Revision N to
Revision P to avoid confusing the
uppercase letter “O” with the number
zero “0”.

The following updates were implemented:
• TABLE 5-1: “Code Memory Size” was updated
to include PIC32MK device information
• TABLE 18-1: “Device Configuration Register
Mask Values of Currently Supported PIC32MX,
PIC32MZ, and PIC32MK Devices” was updated
to include PIC32MK device information
• The original table, Table 18-4: Device IDs and
Revision was removed as this information is
readily available in the current Family Silicon
Errata
• TABLE 19-4: “Configuration Word Locations
for PIC32MK family Devices” was added

Revision Q (July 2015)
This revision includes the following updates:
• Section 14.0 “Initiating a Flash Row Write” was
added
• TABLE 18-1: “Device Configuration Register
Mask Values of Currently Supported PIC32MX,
PIC32MZ, and PIC32MK Devices” was updated to
include DEVCFG4
• EQUATION 18-1: “Checksum Formula” was
updated
• TABLE 19-3: “Configuration Word Locations for
PIC32MZ family Devices” was updated to include
DEVCFG4
• Minor updates to text and formatting were
incorporated throughout the document

Revision R (April 2016)
This revision includes the following updates:
• FIGURE 4-1: “Programming Interfaces” was
updated
• TABLE 4-1: “4-wire Interface Pins” was updated
• TABLE 4-2: “2-wire Interface Pins” was updated
• FIGURE 4-4: “PIC32MZ EC/EF Power
Connections” was updated
• FIGURE 4-5: “PIC32MZ DA Power Connections”
was updated
• TABLE 5-1: “Code Memory Size” was updated
• FIGURE 5-2: “Basic PIC32 Programming
Interface Block Diagram” was updated
• FIGURE 16-1: “4-wire Exit Programming Mode”
was updated
• FIGURE 16-2: “2-wire Exit Programming Mode”
was updated

DS60001145U-page 74

• Parameters D112 (VDD1V8) and D115 (IDD1V8P)
were added to TABLE 21-1: “AC/DC
Characteristics and Timing Requirements”
• Section 4.3 “PIC32MX Power Requirements” was
updated
• Section 4.4 “PIC32MX With VBAT Pin Power
Requirements” was added
• Section 4.5 “PIC32MZ EC and PIC32MZ EF
Power Requirements” was added
• Section 4.6 “PIC32MZ DA Power Requirements”
was added
• Section 4.7 “PIC32MK Power Requirements”
was added
• Section 5.3.3 “Synchronization” was added
• Section 6.7 “Synchronize Pseudo Operation”
was added
• Section 8.1 “4-wire Interface” was updated
• Section 8.2 “2-wire Interface” was updated
• TABLE 13-1: “Page Erase Op Codes” was
updated
• TABLE 18-1: “Device Configuration Register
Mask Values of Currently Supported PIC32MX,
PIC32MZ, and PIC32MK Devices” was updated
• Note 1 in the Checksum Formula was updated
(see Equation 18-1)

Revision S (September 2016)
This revision includes the following updates:
• The Programming Interfaces diagram was
updated (see Figure 4-1)
• The 4-Wire Interface Pins table was updated (see
Table 4-1)
• The 2-Wire Interface Pins table was updated (see
Table 4-2)
• The PIC32MZ DA Power Connections diagram
was updated (see Figure 4-5)
• The Basic PIC32 Programming Interface Block
Diagram was updated (see Figure 5-2)
• The Note in Section 5.3.2 “2-phase ICSP” was
updated
• The AC/DC Characteristics and Timing Requirements were updated (see Table 21-1)
• Device IDs were added (see Table C-1 through
Table C-11 in Appendix C: “Device IDs”)

Revision T (May 2017)
This revision includes the following updates:
•
•
•
•

Updated Table 20-1, Table 4-1, Table 4-2
Updated Figure 4-1, Figure 4-2, Figure 5-2
Added Table C-12
Minor updates to text and formatting were
incorporated throughout the document

 2007-2017 Microchip Technology Inc.

PIC32
Revision U (July 2017)
This revision includes the following updates:
• Updated the PIC32MK devices (see Section 2.1
“Devices with Dual Flash Panel and Dual Boot
Regions”)
• Updated the PIC32MK devices in Code Memory
Size (see Table 5-1)
• Updated the PIC32MK devices in Device Configuration Register Mask Values of Currently Supported PIC32MX, PIC32MZ, and PIC32MK
Devices (see Table 18-1)
• Updated the Configuration Word Locations for
PIC32MK Family Devices (see Table 19-4)
• Added TABLE 19-5: “Configuration Word Locations for PIC32MKXXXXXXG/H/K/L/MXX Family Devices”
• Updated the PIC32MK General Purpose and
Motor Control (GP/MC) Family Device IDs (see
Table C-11)
• In additions, minor updates to text and formatting
were incorporated throughout the document

 2007-2017 Microchip Technology Inc.

DS60001145U-page 75

PIC32
Notes:

DS60001145U-page 76

 2007-2017 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

•

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV

== ISO/TS 16949 ==
 2007-2017 Microchip Technology Inc.

Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2007-2017, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-1969-3

DS60001145U-page 77

Worldwide Sales and Service
AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com

Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon

China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130

Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393

China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049

Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829

India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123

Finland - Espoo
Tel: 358-9-4520-820

Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088

Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500

Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075

China - Dongguan
Tel: 86-769-8702-9880

Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924

China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116

Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078

China - Guangzhou
Tel: 86-20-8755-8029

China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760

France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632

France - Saint Cloud
Tel: 33-1-30-60-70-00

India - Pune
Tel: 91-20-3019-1500

Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400

Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771

Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370

Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934

Germany - Rosenheim
Tel: 49-8031-354-560

Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102

China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256

Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350

Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820

11/07/16

DS60001145U-page 78

 2007-2017 Microchip Technology Inc.

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
Encryption                      : Standard V4.4 (128-bit)
User Access                     : Print, Copy, Annotate, Fill forms, Extract, Print high-res
Author                          : Microchip Technology Inc.
Copyright                       : 2007-2017
Create Date                     : 2017:07:25 10:20:22Z
Keywords                        : PIC32 Flash Programming Specification, PIC32 Flash, PIC, PIC32, Flash, PIC32 Flash Programming Specification, Programming Specification, Flash Programming Specification, PIC32  Programming Specification, DS60001145U, DS60001145B, DS60001145C, DS60001145D, DS60001145E, DS60001145F, DS60001145G, DS60001145H, DS60001145J, DS60001145K, DS60001145L, DS60001145M, DS60001145N, DS60001145P, DS60001145Q, DS60001145, 60001145
Modify Date                     : 2017:07:25 10:43:41+05:30
XMP Toolkit                     : Adobe XMP Core 5.2-c001 63.139439, 2010/09/27-13:37:26
Creator Tool                    : FrameMaker 2015.1
Metadata Date                   : 2017:07:25 10:43:41+05:30
Producer                        : Acrobat Distiller 10.1.16 (Windows)
Format                          : application/pdf
Title                           : PIC32 Flash Programming Specification
Creator                         : Microchip Technology Inc.
Description                     : PIC32 Flash Programming Specification
Subject                         : PIC32 Flash Programming Specification, PIC32 Flash, PIC, PIC32, Flash, PIC32 Flash Programming Specification, Programming Specification, Flash Programming Specification, PIC32, Programming Specification, DS60001145U, DS60001145B, DS60001145C, DS60001145D, DS60001145E, DS60001145F, DS60001145G, DS60001145H, DS60001145J, DS60001145K, DS60001145L, DS60001145M, DS60001145N, DS60001145P, DS60001145Q, DS60001145, 60001145
Document ID                     : uuid:31154224-341b-4aa6-898c-bb49160e578c
Instance ID                     : uuid:9d2e9a6c-e9f4-4333-b6ca-7ceba305c234
Page Mode                       : UseOutlines
Page Count                      : 78

EXIF Metadata provided by EXIF.tools

PIC32 Flash Programming Specification Intel Computer Hardware LXD972M 60001145N

Navigation menu

Versions of this User Manual:

Views

Navigation