7703_Battery Backed_CMOS_RAM_Card_Aug81 7703 Battery Backed CMOS RAM Card Aug81
7703_Battery-Backed_CMOS_RAM_Card_Aug81 7703_Battery-Backed_CMOS_RAM_Card_Aug81
User Manual: 7703_Battery-Backed_CMOS_RAM_Card_Aug81
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STD 7000
7703
Battery-Backed
CMOS RAM Card
USER'S MANUAL
o
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NOTICE
The information ir.l this document is provided for reference only. Pro-Log does not assume any
liability arising out of the application or use of the information or products described herein.
This document may contain or reference information and products protected by copyrights or
patents and does not convey any license under the patent rights of Pro-Log, nor the rights of
others.
Printed in U.S.A. Copyright © 1981 by Pro-Log Corporation, Monterey, CA 93940. All rights
reserved. However, any part of this document may be reproduced with Pro-Log Corporation
cited as the source.
•
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7703
Battery-Backed CMOS RAM Card
USER'S MANUAL
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FOREWORD
This manual explains how to use Pro-Log's 7703 Battery-Backed CMOS RAM Card. It is structured to reflect
the answers to basic questions that you, the user, might ask yourself about the 7703. We welcome your suggestions on how we can improve our instructions.
o
The 7703 is part of Pro-Log's Series 7000 STD BUS hardware. Our products are modular, and they are designed
and built with second-sourced parts that are industry standards. They provide the industrial manager with the
means of utilizing his own people to control the design, production, and maintenance of the company's
products that use STD BUS hardware.
Pro-Log supports its products with thorough and complete documentation. Also, to provide maximum
assistance to the user, we teach courses on how to design with, and to use, microprocessors and the STD BUS
products.
You may find the following Pro-Log documents useful in your work: Microprocessor User's Guide and the
Series 7000 STO BUS Technical Manual. If you would like a copy of these documents, please submit your
request on your company letterhead.
,
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Contents
o
Page
Foreword ............................................................................................................................................................................ ii
Figures .................................................................................................................................................................................. iv
Section 1 - Purpose and Main Features ...................................................................................................... 1-1
Section 2 - Installation and Specifications ................................................................................................ 2-1
Introduction ........................................................................................................................................................................ 2-1
Mapped Card Addressing ................................................................................................................................................ 2-3
Alternatives to Soldered Wire Jumpers ...................................................................................................................... 2-3
Electrical and Environmental Specifications .............................................................................................................. 2-4
Mechanical Specifications . .............................................................................................................................................. 2-5
. Section 3 - Operation and Programming .................................................................................................... 3-1
Introduction .......................................................................................................................................................................... 3-1
Preparing the 7703 for Initial Use .................................................................................................................................. 3-1
Activati ng the 7703 ............................................................................................................................................................ 3-1
Saving Data When Power Fails ...................................................................................................................................... 3-1
o
7703 Power Monitor .......................................................................................................................................................... 3-3
Removing the 7703 Card without Losing Data .......................................................................................................... 3-3
Section 4 - Operating Software .......................................................................................................................... 4-1
Introduction .......................................................................................................................................................................... 4-1
Memory Addresses ............................................................................................................................................................ 4-1
Diagnostic Use ...................................................................................................~ ................................................................ 4-1
Shakedown (Confidence Level) Test ............................................................................................................................ 4-2
Memory Maps ...................................................................................................................................................................... 4-2
Subroutine (MOVE BLOCK) .......................................................................................................................................... 4-5
Subroutine (-(HL)) ............................................................................................................................................................ 4-7
Subroutine (COMPARE BLOCK) .................................................................................................................................., 4-9
Subroutine (LOAD BLOCK) ........................................................................................................................................ 4-12
Subroutine (LOAD A
Subroutine (VERIFY
= D) .........................................:................................................................................................
A = D) ........................................................................................................................................
4-14
4-16
Program Listing (Subroutines) .................................................................................................................................. 4-19
Demonstration/Test Program .................................................................................................................................... 4-22
Program Listing (Shakedown Test) .......................................................................................................................... 4-27
Section 5 - Maintenance ........................................................................................................................................ 5-1
Reference Drawings .......................................................:.................................................................................................. 5-1
o
Card Layout ........................................................................................................................................................................ 5-4
Read Timing Diagram ........................................................................................................................................................ 5-4
Address Decoding Circuit ................................................................................................................................................ 5-6
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Contents (continued)
Ch i p-Enab Ie Decod in g Ci rc uit ...................................................................................................................................... 5-8
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Data Bus Buffer Circuit ................................................................................................................................................ 5-10
Write-Control Circuit .................................................................................................................................................... 5-11
7703 Save Ci rc uit .......................... .................................................................................................................... ..............
5-12
Power Monitori ng Ci rcuit' ............................................................................................................................................ 5-12
Bac kup Battery C irc uit .................................................................................................................................... ............
5-14
Chang ing the Lith iu m Battery .................................................................................................................................... 5-14
Si g nal G Iossa ry ... ~ ................................~..................................... .... .... ........ ........ ................................ ........ ................ ....
5-15
7703 Internal Sig nals .................................................................................................................................................... 5-16
Return for Repair Procedures .................................................................................................................................... 5-17
Appendix A - Guidelines for Handling Lithium Batteries .............................................................. A-1
Figures
Page
. Figure
1-1
7703 Battery-Backed CMOS RAM Card ................................................................................................ 1-1
1-2
Block Diagram of 7703 Battery-Backed CMOS RAM Card ............................................................ 1-2
2-1
Installation of 7703 Card in STD BUS Card Rack .............................................................................. 2-1
2-2
Standard Configurations of 7703 Card (250ns CMOS RAM) .......................................................... 2-2
2-3
Mappi ng the 7703 Card .............................................................................................................................. 2-2
2-4
Location of RAM Pairs on 7703 Card .................................................................................................... 2-3
2-5
Operating Limits of Electrical and Environmental Parameters for 7703 Card .......................... 2-4
2-6
STD BUS Electrical Specifications Over Recommended Operating Limits ................................. 2-5
2-7
Edge Connector Pin List for 7703 Card ................................................................................................ 3-2
3-1
Flowchart Showing Power Failure Procedure for 7703 Card .......................................................... 3-3
3-2
Flowchart Showing Insertion and Removal Procedure for 7703 Card ........................................ 3-3
4-1
Index of Subroutines for 7703 Card ........................................................................................................ 4-1
4-2
64K Memory Map for 7703 Software Package .................................................................................... 4-2
4-3
16K Memory Map for 7703 Software Package ......................................................... _. __ .. _.... _......... _..... 4-3
4-4
One-Page Memory Map for 7703 Software Package ......... _._ .... _......... _._ ..... _..... _._ .. _.. _...... __ .... _... _._ .... 4-4
4-5
Flowchart-Subroutine (MOVE BLOCK) for 7703 ................... __ ........... _..... _._ ..... _.... _..... _.... _.... _._._._ .... 4-5
4-6
4-7
Register and Memory Allocation for 7703 Subroutine (MOVE BLOCK), Entry 1 and Return 1 4-6
4-8
Flowchart-Subroutine (-(HL)) for 7703 _....... _....................... _......................... _..... _._ .. _.. _....... _.... _._. __ .. _.. 4-7
4-9
Register and Memory Allocation for 7703 Subroutine {-(HL)), Entry 2 and Return 2 ... _..... _.. 4-8
4-10
Characteristics of 7703 Subroutine {-(HL)), Entry 2 and Return 2 .... _........... _.... _..... ___ .. _.... _.... _.. _.. 4-8
4-11
Flowchart-Subroutine (COMPARE BLOCK) for 7703 .... _.. _............ _........ _..... _..... _..... _............... _
4-12
Register and Memory Allocation for 7703 Subroutine (COMPARE BLOCK),
Entry 3 and Retu rn 3 '............................. _.................................................. _........................ _.... _... _...... _ 4-10
4-13
Characteristics of 7703 Subroutine (COMPARE BLOCK), Entry 3 and Return 3 .... _........ _..
iv
Characteristics of 7703 Subroutine (MOVE BLOCK), Entry 1 and Return 1 _.. _.. _.. _... __ .__ ._._._ ...... 4-'6
4-9
4-10
0'
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Figures (continued)
Figure
Page
4-14
Register and Memory Allocation for 7703 Subroutine (COMPARE BLOCK),
Entry 3 and Return 4 .......................................................................................................................... 4-11
4-15
Characteristics of 7703 Subroutine (COMPARE BLOCK), Entry 3 and Return 4 ................ 4-11
4-16
Flowchart-Subroutine (LOAD BLOCK) for 7703 .......................................................................... 4-12
4-17
Register and Memory Allocation for 7703 Subroutine (LOAD BLOCK), Entry 4 and Return 5 4-13
4-18
Characteristics of 7703 Subroutine (LOAD BLOCK), Entry 4 and Return 5 .......................... 4-13
4-19
Flowchart-Subroutine (LOAD A = D) for 7703 ............................................................................ 4-'14
4-20
Register and Memory Allocation for 7703 Subroutine (LOAD A = 0), Entry 5 and Return 6 4-'15
4-21
Characteristics of 7703 Subroutine (LOAD A = 0), Entry 5 and Return 6 ............................
4-22
Flowchart-Subroutine (VERIFY A = D) for 7703 .......................................................................... 4-16
4-23
Register and Memory Allocation for 7703 Subroutine (VERIFY A = 0), Entry 6 and Return 7 4-17
4-24
Characteristics of 7703 Subroutine (VERIFY A
4-25
Register and Memory Allocation for 7703 Subroutine (VERIFY A = D), Entry 6 and Return 8 4-18
4-26
Characteristics of 7703 Subroutine (VERIFY A
4-27
Program Listing for 7703 Subroutines .............................................................................................. 4-19
4-28
Memory Map for Shakedown (Confidence Level) Test -
4-29
Memory Map for Error Storage Locations 7703 (Shakedown Test) -
4-30
Flowchart-Demonstration/Test Program for 7703 ........................................................................ 4-25
4-31
Program Listing for 7703 Shakedown (Confidence Level) Test ................................................ 4-27
5-1
Schematic for 7703 (Reference Only) .................................................................................................... 5-2
5-2
Assembly for 7703 (Reference Only) ......................... ~ ............................................................................ 5-3
5-3
Locations and Functions of Main Components for 7703 .................................................................. 5-5
5-4
Read Timing Diagram for 7703 ................................................................................................................ 5-5
5-5
Address Decoding Circuit for 7703 ........................................................................................................ 5-7
5-6
Decoding the 7703's 64K Address Space .............................................................................................. 5-7
5-7
Chip-Enable Decoding Circuit for 7703 ................................................................................................ 5-8
5-8
CEX* Signal Selection of 1K Byte RAM Pair to be Accessed - 7703 ............................................ 5-9
5-9
Data Bus Buffer Circuit for 7703 .......................................................................................................... 5-10
5-10
Write-Control Circuit for 7703 .............................................................................................................. 5-11
5-11
Write;"'lnhibit Switches for 7703 ............................................................................................................ 5-11
5-12
Sequence Diagram for 7703's Data-Save Circuit ............................................................................ 5-12
5-13
Power Monitoring Circuit for 7703 ...................................................................................................... 5-13
= D),
4-15
Entry 6 and Return 7 .......................... 4-17
= 0), Entry 6 and
Return 8 .......................... 4-18
7703 ................................................ 4-23
7703 .......................... 4-24
5-14
Battery Backup Circuit for 7703 .......................................................................................................... 5-14
5-15
STD BUS Edge Connector Signals for the 7703 ............................................................................ 5-15
5-16
7703 Internal Signals ............. _................................................................................................................ 5-16
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SECTION 1
Purpose and Main Features
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Purpose
The 7703 Card (Fig. 1-1) provides up to 16,384 bytes of high-speed (250ns), nonvolatile static CMOS RAM. It
has a lithium battery backup that allows it to retain data for a minimum of two years; also, it generates a lowbattery status signal (with an LED indicator) that may be jumpered to the STD nonmaskable interrupt. (See
Fig. 1-2 for the block diagram.)
An onboard, memory-protected circuit in the 7703 monitors the +5V power and automatically generates a
memory-save signal before switching to the lithium battery backup.
Write-protect switches (4K blocks) are available in the 7703 for preserving critical data and for nonvolatile
program execution. The card decodes all 16 address lines. On-board jumpers permit mapping in any consecutive 4K, 8K, or 16K address blocks within 16K boundaries. All 7703 cards are shipped with starting address
COOO.
Main Features
• Up to 16,384 bytes of nonvolatile static CMOS RAM
• Available In five configurations: 1 K, 2K, 4K, 8K, and 16K bytes
• Lithium backup battery (guaranteed to give two years of data retention, five years typical)
• Automatic memory protection upon loss of +5V power
• Transportable without loss of data
• Write-inhibit switches (4K blocks)
o
• Temperature range: 0 to 55°C ambient
• Single +5V power requirements
• Full 64K address decoding
• Industry-standard multisourced components
• LED for replace-battery indication
• Instant operation (no battery-charging time required)
• Universal processor compatibility: Z80, 8085A, 6800, and others.
o
Figure 1-1. 7703 Battery-Backed CMOS RAM Card.
1-1
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DATA BUS 00-07
......
>
ADDRESS BUS A10-A1):
...
...
RD*
M EMRQ*
....
...
WR*
....
....
I
)
:>
••
DATA
BUS
BUFFER
ADDRESS BUS AO-A9
ADDRESS
DECODE
AND
READ/
WRITE
CONTROL
16/
I
/
~~
-
.....
4/
.....
I
MEMORY
PROTECT
CIRCUIT
~r
ADDRESS
BUS
BUFFER
10/
I
-......
RAM
(4K)
10/ ...
7---..0'"
.. ,
RAM
(4K)
....
...
REPLACE
BATTERY
LED
~
NMIRQ*
.....
......
4
I
POWER
CONTROL
~
+
1-=-
-I
II
10/ ...
'
...
RAM
(4K)
,,....
~
4V
I
10/..
/~
RAM
(4K)
~8/..
.....
8/...
....
....... 8/....
~~
+5V
.....-
~~
WRITE
INHIBIT
SWITCHES
:>
..,...
....
4 11
I
~
/~
4 11
I
LITHIUM
BACKUP
BATTERY
--
7703
Active low-level logiC.
Figure 1-2. Block Diagram of 7703 Battery-Backed CMOS RAM Card.
o
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SECTION 2
Installation and Specifications
o
Introduction
The 7703 operates as part of an STD BUS card rack system. You can plug in directly into any card slot on the
motherboard, provided that the slot next to the battery is unoccupied. Optionally, you can plug the 7703 into a
7901 extender card, which in turn may be plugged into any vacant card slot on the motherboard; this configuration allows you to access the 7703 for testing or other purposes.
CAUTION
To prevent possible damage to your STD BUS system, make sure that power is off before inserting a
card into the card rack, or before removing a card from the card rack.
At installation, the 7703's card ejector must be positioned towards the top of the card rack (see Fig. 2-1).
SPACE PROVIDED BY
UNOCCUPIED SLOT TO
ACCOMMODATE BATTERY
SIDE OF CARD
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Figure 2-1. Installation of 7703 Card In STD BUS Card Rack.
2-1
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You may configure the 7703 to operate within anyone ofthefour 16K-byte address ranges available within the
addressable 64K memory space. The 7703's 16K range is subdivided into four 4K blocks. Any combination of
these 4K blocks may be enabled or disabled by appropriate jumpering of the 7703. You may order the 7703 in
any of the standard configurations shown in Fig. 2-2. The boundaries established for each of the standard
configurations for the 1 K, 2K, 4K, 8K, and 16K options are sho",!n in Fig. 2-3.
PRODUCT
NUMBER
7703-1C
7703-2C
7703-4C
7703-8C
7703-16C
[1]
MEMORY
SIZE
1Kx8
2Kx8
4Kx8
8Kx8
16Kx8
'I
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ADDRESS RANGE
AS SHIPPED [1]
COOO
COOO
COOO
COOO
COOO
-
C3FF
C7FF
CFFF
DFFF
FFFF
Address range may be remapped by the user, within any 16K
boundaries.
Figure 2-2. Standard Configurations of 7703 Card (250ns CMOS RAM).
ADDRESS RANGE
START
END
0000
03FF
07FF
OFFF
0000
0000
0000
0000
1FFF
4000
4000
43FF
47FF
4FFF
SFFF
SIZE
BLOCK
1K
2K
4K
RAM PAIRS
ENABLED
(Fig. 2-4)
SY TRACES
TO BE LEFT INTACT
OR CUT (X = CUT TRACE)
1 0
3 2
0
X
X
X
I
I
0-1
X
X
X
I
I
0-3
X
X
X
I
I
8K
16K
0-7
X
X
I
I
I
0-15
I
I
I
I
I
1K
0
X
X
X
I
I
0-1
X
X
X
I
I
0-3
X
X
X
I
I
0-7
X
X
I
I
I
7FFF
2K
4K
8K
16K
0-15
I
I
I
I
I
8000
8000
8000
8000
83FF
87FF
8FFF
1K
2K
4K
0
X
X
X
I
9FFF
8000
BFFF
8K
16K
COOO
COOO
COOO
COOO
COOO
C3FF
4000
4000
4000
3FFF
C7FF
CFFF
DFFF
EFFF
1K
2K
4K
8K
16K
o
I
\,
0-1
X
X
X
I
0-3
X
X
X
I
I
0-7
X
X
I
I
I
0-15
I
I
I
I
I
0
X
X
X
I
I
0-1
X
X
X
I
I
0-3
X
X
X
I
I
0-7
X
X
I
I
I
0-15
I
I
I
I
I
Figure 2-3. Mapping the 7703 Card.
2-2
SX JUMPER
POSITION
2
1 0
3
I
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Mapping Card Addressing
Figure 2-4 shows the location of the SX jumpers, the SY jumpers, and the RAM pairs on the 7703 card. The
CMOS RAMs are NEC 6514-2, with 250nsaccess time. Each RAM device is 1Kx4 bits; therefore, each RAM pair
provides 1Kx8 bits of memory. Up to 32 devices may be placed on the 7703, allowing a maximum of 16K bytes
on one card. Four 7703 cards provide a full backup of 64K bytes of memory.
Alternatives to Soldered Wire Jumpers
If you anticipate making frequent changes in your 7703 memory address mapping, you may replace the wire
jumpers for SX and SY with 0.025 in. (0.635 mm) square posts. These posts are available individually or in
single or double strips that correspond to the 0.001 in. (0.025 mm) grid jumper-pad spacing. You then connect
the posts by wirewrap or by jumper clips. Be sure you check the height that the posts extend above the board to
insure they do ~ot interfere with an adjacent card. The recommended wirewrap square post for SX and SY is
AMP No. 87215-1, or equivalent. The recommended jumper clip is AMP No. 530153-2, or equivalent.
RAM PAIR
RAM PAIR
0
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U8
Select
16K Quadrant
U4
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74LS156
3
~ ~ ~~
I
Open to disable
a 4K block
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(8)
U33
(1)
U17
U25
(9)
U34
U10
(2)
U18
U26
(10)
U35
U11
(3)
U19
U27
(11 )
U36
U12
(4)
U20
U28
(12)
U37
U13
(5)
U21
U29
(13)
U38
U14
(6)
U22
U30
(14)
U39
U15
(7)
U23
U31
(15)
U40
SY
0
U24
U9
SX
0000
U16
Figure 2-4. Location of RAM Pairs on 7703 Card.
2-3
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Electrical and Environmental Specifications
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RECOMMENDED OPERATING LIMITS
PARAMETER
SYMBOL
MIN
TYP
MAX
MIN
MAX
UNIT
4.75
5.00
5.25
0
5.50
V
+25
+55
-20
+70
°C
95
0
95
%RH
Vcc
Supply voltage
TA
Free-air temperature
0
RH
Humidity
5
[1]
ABSOLUTE NONOPERATING LIMITS
-
[1] Noncondensing.
Figure 2-5. Operating Limits of Electrical and Environmental Parameters for 7703 Card.
SYMBOL
PARAMETER
MIN
TYP
MAX
UNIT
145
230
rnA
-
yr
Icc
Vcc supply current
-
-
Data retention
2
5
Battery life (shelf)
-
10
-
STD BUS output load
STD BUS input load
See Fig. 2-7
yr
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See Fig. 2-7
I
See Fig. 2-7
See Fig. 2-7
Figure 2-6. STD BUS Electrical Specifications Over Recommended Operating Limits.
o
2-4
o
PIN NUMBER
PIN NUMBER
OUTPUT (LSTTL DRIVE)
OUTPUT (LSTTL DRIVE)
INPUT (LSTTL LOADS)
INPUT (LSTTL LOADS)
MNEMONIC
MNEMONIC
+5V
Vee
2
1
Vee
GROUND
GND
4
3
GND
6
5
-5V
+5V
GROUND
-5V
D7
1
55
8
7
55
1
D3
D6
1
55
10
9
55
1
D2
D5
1
55
12
11
55
1
D1
D4
1
55
14
13
55
1
DO
A15
1
16
15
1
A7
A14
1
18
17
1
A6
A13
1
20
19
1
A5
A12
1
22
21
1
A4
A11
1
24
23
1
A3
A10
1
26
25
1
A2
A9
1
28
27
1
A1
f'
A8
1
30
29
1
AO
I
RD*
1
32
31
1
WR*
MEMRO*
1
34
33
IORO*
MEMEX
1
36
35
IOEXP
MCSYNC*
38
37
REFRESH*
STATUS 0*
40
39
STATUS 1*
BUSRO*
42
41
BUSAK*
INTRO*
44
43
INTAK*
Ie
NMIRO*
20[1]
46
45
WAITRO*
PBRESET*
OUT
48
47
SYSRESET*
50
49
ClOCK*
52
51
AUX GND
54
53
AUX GND
AUX -V
56
55
AUX +V
CNTRl*
PCI
* Active low-level logic
IN
OUT
PCO
[1] Open-collector driver
Figure 2-7. Edge Connector Pin List for 7703 Card.
Mechanical Specifications
o
The 7703 Card meets all general mechanical specifications of the STD BUS except for battery height, which is
0.678 in. (16.9 mm) maximum above center line of the card thickness. It requires two card slots when mounted
in an STD BUS card rack - one additional open slot next to the component side for clearance of the lithium
battery.
The 7703 is shipped with a Series 7000 insulating shield covering the back side of the card, providing protection
for the CMOS chips on board.
2-5
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SECTION 3
Operation and Programming
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Introduction
This section explains how to operate the 7703. It also describes how to retain or preserve critical data on the
7703 if power fails, and how to remove the card without losing data. The 7703 operates under program control
from the CPU.
Preparing the 7703 for Initial Use
First select the jumpering required for use of your card configuration (1,2,4,8, or 16K) in the desired address
space (see Fig. 2-3). Also, check Fig. 2-3 to determine which SY traces to leave intact and which SY traces to
cut, to enable the various 4K byte memory segments. The last column in the figure specifies which of the SX
jumpers must be activated to select the desired 16K byte segment.
NOTE
SX-3 is default-jumpered on all 7703 boards shipped. This activates the 7703 for operations in
the upper 16K bytes of memory, starting at COOO.
After completing the memory mapping, install the battery activation jumper (jumper A), if it is not already
installed. (This jumper is located in grid 86 of the assembly drawing for the 7703, Fig. 5-2.)
o
To verify that standby memory current is within specification, connect a voltmeter across the test points TP1
and TP2. (These pOints are located in grids 87 and 86, respectively, of the assembly drawing forthe 7703, Fig.
5-2.) The voltage should read not more than 0.003 VDC, although the reading may be considerably less. A
proper reading at this point verifies that the lithium backup battery is properly installed and operating. If the
voltage is more than 0.003, disconnect the battery and return the card to the factory (see "Return for Repair
Procedures" in Section 5.) Set all the write-inhibit switches to the write-enable position (if required), in preparation for using the 7703 (see Section 4). (These switches are located in grid C4 of the assembly drawing for the
7703, Fig. 5-2.)
Activating the 7703
With the 7703 installed as outlined in Section 2:
1. Apply system power.
2. As part of system initialization, perform a memory-read operation or a memory-write operation to a
random address within the address space allocated to the 7703 card. The first time a memory-read or
memory-write operation is performed, memory-inhibit is removed. This "dummy" memory reference step
is extremely important to insure that the system memory is enabled before it is actually referenced. The
memory reference sets the operate flip-flop, which then enables the 7703 card operation. The operate flipflop is reset automatically at power-down and again at power-up to insure data integrity on the 7703.
Further details on this operation are provided in Section 5.
3. Use the write-inhibit switches to inhibit writing to any of the four 4K-byte blocks within the 7703 card
address space. (See Fig. 5-3 for the location of the write-inhibit switches.) Figure 2-3 shows the enablejumpering required for the onboard memory devices.
4. You may now use the software provided in Section 4 to exercise the 7703.
o
Saving Data When Power Falls
The most effective method to insure that essential data is saved in event of system power failure is to store such
data, including the system stack, on the 7703 card. However, the user must provide the hardware for monitoring
system power failure at his +5V power supply.
3-1
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The ci rcuitry and software for detecti ng system power fai lure should mon itor the user's power su pply to detect
any deviation from normal power behavior. The hardware must then generate a nonmaskable interrupt and
allow time for the interrupt software to execute its power failure data-save functions. The interrupt software
should allow all essential CPU register data to be stored and all address and data bus activity to be halted; this
must be accomplished before the system power falls below the minimum operating level. A flowchart for a
suggested power failure system is depicted in Fig. 3-1.
,"II
oil
',I"
I
POWER
FAILURE
NO
SYSTEM
EXECUTION
SAVE REGISTERS
AND ESSENTIAL
DATA IN THE
7703 CARD
o
HALT CPU
NO
POWER-ON
INITIALIZATION
ACTIVATE 7703
OPERATE STATUS.
RESTORE SYSTEM.
o
Figure 3-1. Flowchart Showing Power Failure Procedure for 7703 Card.
3-2
7703 Power Monitor
The 7703 has a "Low Vcc Detect" circuit on board. This circuit generates the LOW Vcc· signal, which is used to
inhibit memory if Vec falls below 4.S2V. The low Vcc detect circuit is used to save the 7703 card memory only,
not the entire system.
o
Removing the 7703 Card without Losing Data
To remove the 7703 card from the card cage without losing data, follow these steps:
1. Halt the CPU.
2. Set all write-inhibit switches to the inhibit position.
3. Power-down the system.
4. Gently remove the 7703 card from the rack. Now the stored data is protected by the card's battery backup.
You may now transport or store the 7703 card for future use. When you do use it again in another system, follow
the installation procedure detailed in Section 2.
Figure 3-2 flowchart shows how to remove and insert the 7703, insuring full data retention.
,--------
---,
7703
REMOVAL
I
NO
o
TURN
OFF
POWER
HALT
CPU
I
ACTIVATE
WRITE-INHIBIT
SWITCHES
INSERT 7703
IN
SYSTEM
I
POWER-DOWN
SYSTEM
POWER-UP
SYSTEM
I
REMOVE 7703
FROM
SYSTEM
DEACTIVATE
WRITE-INHIBIT
SWITCHES
(IF REQUIRED)
I
END
ACTIVATE 7703
OPERATE STATUS
I
I
L _ _ _ _J
BATTERY BACKED DATA
RETENTION TIME
(TWO YEARS MIN.)
EXECUTE
SYSTEM
PROGRAM
o
Figure 3-2. Flowchart Showing Insertion and Removal Procedure for 7703 Card.
3-3
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3-4
SECTION 4
Operating Software
o
Introduction
This section contains hardware-level subroutines fhat can be used for testing the 7703 CMOS RAM card or for
diagnosing malfunctions. They are designed with the user in mind and assume that your 7703 card can be
mapped for use in other than the first 16K quadrant (0000-3FFF). See Fig. 4-1 for the subroutine index.
FUNCTION
SUBROUTINE NAME
o
SEE FIGURES
(MOVE BLOCK)
Moves a block of data from one location in memory to a
user-specified location in RAM.
4-5, 4-6, 4-7
(-(HL»
Forms 2's complement of HL register pair contents.
4-8, 4-9, 4-10
(COMPARE BLOCK)
Compares two blocks of data in memory.
4-11,4-12, 4-13,
4-14,4-15
4-16,4-17,4-18
(LOAD BLOCK)
Loads a designated data word into a specified block of
RAM. (Used with (MOVE BLOCK) and (COMPARE
BLOCK) to test memory's retention and erasure of
particular bit patterns.)
(LOAD A = D)
Loads a specified block of memory with an address
equal to the data format.
4-19,4-20, 4-21
(VERIFY A = D)
Verifies that correct address is contained within specified
data byte. Used in conjunction with (LOAD A = D).
4-22, 4-23, 4-24,
4-25,4-26
( ) Denotes subroutine labels.
Figure 4-1. Index of Subroutines for 7703 Card.
The software in the section can be used without license from Pro-Log. It has been tested and is believed to be
correct; however, we do not represent it to be free from errors or possible copyright infringement, nor is it
represented as being appropriate for any specific application.
The subroutines are written in STD instruction mnemonics, using 8080 assembly codes. They will execute in
8080,8085, Z80, NSC 800, and other 8080 code-compatible microprocessor systems. The coding forms are
grouped at the end of this section (Fig. 4-27), following the subroutine specifications.
Flowcharts are included that do not refer to microprocessor characteristics; thus, they allow the routines to be
easily adapted to other types of microprocessors.
Individual subroutine specifications show memory requirements, entry requirements, and exit characteristics
for each path in the program. Timing and other necessary information are also provided.
Memory Addresses
Full memory addresses are shown in the subroutine documentation. They are the preferred addresses that
allow the subroutines to work with those provided for other Series 7000 STD BUS cards from Pro-Log. The
program addresses correspond to those used by the 7801 and 7803 processor cards for their onboard ROMI
EPROM and RAM devices.
If your system cannot use the memory addresses in the 7703's software package, simply change the memory
page addresses, as required, when loading these subroutines into your system. Memory addresses that must
be located in RAM are identified on the program coding forms. Other memory addresses shown are intended to
be ROM locations, but they may also be RAM locations.
o
Diagnostic Use
The error routines place .relevant data in the various registers and set an error flag. The memory location where
the error occurred and the erroneous data can be retrieved by examining the registers containing the error
information.
4-1
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Shakedown (Confidence Level) Test
A flowchart and an example program module are provided to demonstrate a sequence of operations you may
use to perform a quick shakedown or confidence level test of the 7703. (See Figs. 4-28 and 4-29 at the end of
. the section.)
Memory Maps
Figure 4-2 shows a 64K memory map, which is divided into 256-byte pages and gives the location of the 7703's
software package, the location of the stack, and the location of the 7703's memory space, as shipped (COOOFFFF).
.
PAGE
F
0
ox
1X
2X
3X
4X
o
5X
6X
7X
ax
9X
AX
ex
ex
ox
EX
FX
Figure 4-2. 64K Memory Map for 7703 Software Package.
4-2
o
Figure 4-3 displays a 16K memory map, showing the location of the user's programs, the 7703 subroutines, and
the stack. It also shows the locations of the EPROM and RAM memory spaces on the 7801 and 7803 processor
cards.
PAGE
XO
PAGE
0000
I X1 I X2 I X3
I X5 I X6 I X7 xa!
X4
X9
! XA I XB
XC
1
XD
I XE I XF
0800
PROM 0 SOCKET
ox
PROM 1 SOCKET
(-USER's PROGRAM)
J
I
1000
1
I
1
107FF
,
1
1
1
~
1
I
1
I
18001
I
1
I
I
I
I
1
I
10FFF
I
1
1
I
1
11FFF
2COO I
1
I
I
I
1X
I
I
I
I
I
PROM 2 SOCKET
PROM 3 SOCKET
--11880
I
o
2000
o
W
I
1
2400
I
1
1
1
I17FF
I
1
2800 1
I
1
,1
,
II
I
cl
OWl
RAM
RAM
RAM
RAM
~ CI
1st 1K
2nd 1K
3rd 1K
4th 1K
Z~
2X
,I
1
I
:IE ~ I
oO~
CI
~r!
20FFI
3000 1
1
1 23FF
I
I
I
I
127FF
I
1
I
3X
J
I
1
I
128FF
1
I
I
I
,2FFF
I
I
I
I
L
~
NOT USED
\
\
I \
I
I
I
I
I
I
I
I
I
13FFF
NOTES
o
1. 7801 (808SA) and 7303 (Z80) processor cards have sockets for 8K ROM/PROM (sockets labeled PROM 0 - PROM 3).
These cards are shipped with these sockets empty. Also, the cards have sockets for 4K RAM, and the card is shipped with
1st 1K loaded and 2nd, 3rd, and 4th 1K sockets empty.
2. This map shows the 7303 software loaded. in user-supplied PROM 2. Page 20 (memory addresses 2000-20FF) is recommended
for subroutine return address stack.
Figure 4-3. 16K Memory Map for 7703 Software Package.
4-3
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Figure 4-4 illustrates a one-page memory map, subdivided into individual addresses, showing the 7703's subroutines starting at address 1800 and ending at 1880.
18
PAGE ADDRESS
LINE
LINE
LABEL
00
01
02
03
04
05
06
07
08
09
OA
OB
OC
00
OE
OF
10
11
12
13
14
15
16
(MOVE BLOC'2....
-
-
-
-
-
-------.,
--<
-
-----'
17
18
19
1A
1B
~,
1C
10
1E
1F
20
(-(HL» 21
22
23
24
25
26
27
28
29
2A
2B
2C
20
2E
2F
+,(COMPARE BLOCK)
"
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
-
-
-
-
--
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
40
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
50
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
60
6E
6F
70
71
LABEL
-
-
--
-
-
--I
"
----"
-
-
-
(LOAD BLOCKL
-
-
72
73
74
75
76
77
78
79
7A
7B
7C
70
7E
7F
LINE
l'
-
-
-
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
80
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
90
9E
9F
AO
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
BO
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BO
BE
BF
LINE
LABEL
(LOAD A
= D)-
-
-
-
-------'
,
---I
-
-
(VERIFY A
= DL
-
-
-
-
"
-
CO
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
DO
01 '-.
02
03
04
05
06
07
08
09
OA
DB
DC
DO
DE
OF
EO
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
FO
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FO
FE
FF
Figure 4-4. One-Page Memory Map for 7703 Software Package.
4-4
o
LABEL
-
-
-
-
-
-
-
.-
o
-
-
-
-
--
o
o
E1
Subroutine (MOVE BLOCK)
Start Address:
1800
This subroutine moves a specified block of memory to a designated RAM area. The start and end addresses of
the source block and the start address of the destination block must be specified in the calling program as
follows:
ADR
Cx
JS
(MOVE BLOCK)
ADR+1
ADR+2
ADR+3
ADR+4
mL}
mP
Source block start address
ADR+5
ADR+6
mL}
mP
Source block end address
ADR+7
ADR+8
mL}
mP
Destination block start address
Next instruction upon return from (MOVE BLOCK), where mL refers to a
memory line address and mP refers to a memory page address.
ADR+9
(MOVE BLOCK) uses subroutine (-(HL»
o
1800
INITIALIZE
ADDRESS POINTERS
[SOURCE START (BC)
END (HL), DESTINATION START (DE)]
180F
FORM THE 2'8
COMPLEMENT OF
HE SOURCE END
ADDRESS
L L - _ - r -_ _,u
1820
1812
'GET DATA FROM
THE SOURCE
1813
STORE DATA IN
DESTINATION
1817
INCREMENT
ADDRESS
POINTERS
o
Figure 4-5. Flowchart - Subroutine (MOVE BLOCK) for 7703.
4-5
,u."
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: H\Mf1fITliFJi F¥4Kf44fT4h¥¥4!f¥¥4fhiiT4iF¥Mrif;;
iiiiiMiU'
o
REGISTER AND MEMORY ALLOCATION
PARAMETER
ADDRESS
ENTRY
REQUIREMENT
EXIT
CONDITION
Register pair
BC
XX
??
Register pair
DE
XX
??
Register pair
HL
XX
??
Register
A
XX
??
Register
F
XX
??
. ELEMENT
COMMENTS
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-6. Register and Memory Allocation for 7703 Subroutine (MOVE BLOCK), Entry 1 and Return 1.
PROGRAM SPECIFICATIONS
SYMBOL
LIMITS
PARAMETER
MIN
I
UNITS
COMMENTS
0
MAX
Ns
Stack memory
4
Bytes
Np
Program memory
29
Bytes
Npt
Total program memory
39
Bytes
Nr
RAM memory
0
Bytes
Execution time
8085
271 + (N-1)68
Ne
Z80
274 + (N-1)68
Time
states
Uses (-(HL»
Uses (-(HL»
N = total number
of bytes in the block.
Figure 4-7. Characteristics of 7703 Subroutine (MOVE BLOCK), Entry 1 and Return 1.
o
4-6
4
o
E2
Subroutine (-(HL»
Start Address:
1820
This subroutine forms the two's complement of the contents of the HL register pair. Enterthis subroutine with
the 16-bit value that is to be complemented in the HL register pair. The two's complement of the original value
will be in the HL register pair upon exit from (-(HL)).
SAVE
AAND F
REGISTERS
1821
FORM THE 1'8
COMPLEMENT
of (HL)
o
1827
ADD ONE
TO (HL)
1828
RETRIEVE
A AND F
REGISTERS
Figure 4-8. Flowchart - Subroutine (-(HL» for 7703.
o
;!
4-7
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REGISTER AND MEMORY ALLOCATION
PARAMETER
ENTRY
REQUIREMENT
EXIT
CONDITION
16-bit value to be
2's complemented
2's complement
of original value
/
ELEMENT
ADDRESS
Register pair
HL
'I
COMMENTS
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-9. Register and Memory Allocation for 7703 Subroutine (-(HL», Entry. 2 and Return 2.
PROGRAM SPECIFICATIONS
SYMBOL
LIMITS
PARAMETER
MIN
I
MAX
UNITS
Ns
..Stack memory
2
Bytes
Np
Program memory
10
Bytes
Npt
Total program memory
10
Bytes
Nr
RAM memory
0
Bytes
Ne
Execution time
8085
62
Z80
68
Time
states
COMMENTS
o
Figure 4-10. Characteristics of 7703 SubrouUne (-(HL», Entry 2 and Return 2.
1
'1
o
4-8
o
E3
Subroutine (COMPARE BLOCK)
Start Address:
1830
This subroutine compares two blocks of memory. The start and end addresses of one block (the first block)
and the start address of the other block (the second block) must be specified in the calling program as follows:
ADR
JS
Cx
ADR+1
(COMPARE BLOCK)
ADR+2
ADR+3
ADR+4
mL }
mP
First block start address
ADR+5
ADR+6
mL }
mP
First block end address
ADR+7
ADR+8
mL }
mP
Second block start add ress
ADR+9
Next instruction upon return from (COMPARE BLOCK), where mL refers to a
memory line address and mP refers to a memory page address.
(COMPARE BLOCK) uses subroutine (-(HL). It utilizes the carry flag to indicate whether or not the two
blocks of memory are identical. If the two memory blocks are identical, the carry flag is cleared (CO) upon
exit from (COMPARE BLOCK). If the two memory blocks are not the same, the carry flag is set (C1) upon
exit from the subroutine. The BC register pair holds the address of the error location in the first block, the
A register holds the data from the first block's error location, and the HL register pair holds the addressof
the error location in the second block.
0
0
INITIALIZE ADDRESS
POINTERS [FIRST
START (BC), END (HL)
SECOND START (DE))
e
183F
FORM THE 2'.
COMPLEMENT OF
THE BLOCK END
ADDRESS
1820
NO
184C
1853
INCREMENT
ADDRESS
POINTERS
SET CARRY
FLAG
(ERROR)
NO
e
CLEAR CARRY
FLAG
(NO ERROR)
0
e
Figure 4-11. Flowchart - Subroutine (COMPARE BLOCK) for 7703.
4-9
,
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REGISTER AND MEMORY ALLOCATION
PARAMETER
ADDRESS
ENTRY
REQUIREMENT
EXIT
CONDITION
Register pair
Be
xx
??
Register pair
DE
XX
??
Register pair
HL
XX
??
Register pair
A
XX
??
Register pair
F
XX
CO
ELEMENT
COMMENTS
The two blocks compared
- no error.
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-12. Register and Memory Allocation for 7703 Subroutine (COMPARE BLOCK), Entry 3 and Return 3.
o
PROGRAM SPECIFICATIONS
SYMBOL
LIMITS
PARAMETER
MIN
I
UNITS
COMMENTS
MAX
Ns
Stack memory
4
Bytes
Np
Program memory
37
Bytes
Npt
Total program memory
47
Bytes
Nr
RAM memory
0
Bytes
Ne
Execution time
8085
290 + (N-1 )83
Z80
296 + (N-1 )86
Time
states
Uses (-(HL»
Uses (-(HL»
N = total number
of bytes in the block.
Figure 4-13. Characteristics of 7703 Subroutine (COMPARE BLOCK), Entry 3 and Return 3.
o
4-10
o
REGISTER AND MEMORY ALLOCATION
PARAMETER
EXIT
CONDITION
ADDRESS
ENTRY
REQUIREMENT
Register pair
Be
xx
Register pair
DE
XX
??
Register pair
HL
XX
Second block error add ress
Register
A
XX
First block error data
Register
F
XX
C1
ELEMENT
COMMENTS
First block error address
Error - discrepancy in
the two blocks.
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-14. Register and Memory Allocation for 7703 Subroutine (COMPARE BLOCK), Entry 3 and Return 4.
o
PROGRAM SPECIFICATIONS
LIMITS
PARAMETER
SYMBOL
MIN
I
MAX
UNITS
Ns
Stack memory
4
Bytes
Np
Program memory
37
Bytes
Npt
Total program memory
47
Bytes
Nr
RAM memory
0
Bytes
Ne
Execution time
-
Time
states
8085
Z80
COMMENTS
Uses (-(HL))
Uses (-(HL))
Execution time depends
on error. No value to user.
Figure 4-15. Characteristics of 7703 Subroutine (COMPARE BLOCK), Entry 3 and Return 4.
o
4-11
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Subroutine (LOAD BLOCK)
E4
Start Address:
1860
This subroutine allows the user to load a designated block of memory with a designated data byte. The start and
end addresses of the memory block and the data byte must be specified in the calling program as follows:
ADR
JS
ADR+1
o
Cx
(LOAD BLOCK)
ADR+2
ADR+3
ADR+4
mL }
mP
Block start address
ADR+5
ADR+6
mL }
mP
Block end address
ADR+7
dd
Data byte to be loaded into memory block
ADR+8
Next instruction upon return from (LOAD BLOCK), where mL refers to a
memory line address and mP refers to a memory page address.
(LOAD BLOCK) uses subroutine (-(HL)).
INITIALIZE ADDRESS
POINTERS [BLOCK
START (BC), END (HL)
AND DATA BYTE (A)
o
1860
~
......
--""""'---~\:::.J
FORM THE 2'5
COMPLEMENT OF
THE BLOCK END
ADDRESS
1870
~
STORE DATA
BYTE AT
CURRENT
_ADDRESS
_ _ _ _...... 1820
1874
INCREMENT
ADDRESS
POINTER
o
Figure 4-16. Flowchart - Subroutine (LOAD BLOCK) for 7703.
4-12
o
REGISTER AND MEMORY ALLOCATION
PARAMETER
ADDRESS
ENTRY
REQUIREMENT
EXIT
CONDITION
Register pair
BC
XX
??
Register pair
DE
XX
??
Register pair
HL
XX
??
Register
A
XX
??
Register
F
XX
??
ELEMENT
COMMENTS
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-17. Register and Memory Allocation for 7703 Subroutine (LOAD BLOCK), Entry 4 and Return 5.
PROGRAM SPECIFICATIONS
SYMBOL
LIMITS
PARAMETER
MIN
I
MAX
UNITS
Ns
Stack memory
4
Bytes
Np
Program memory
25
Bytes
Npt
Total program memory
35
Bytes
Nr
RAM memory
N
Bytes
Execution time
8085
245 + (N-1 )55
Ne
Z80
248 + (N-1 )55
Time
states
?
COMMENTS
Uses (-(HL»
Uses (-(HL»
N = total number
of bytes in the block.
Figure 4-18. Characteristics of 7703 Subroutine (LOAD BLOCK), Entry 4 and Return 5.
o
4-13
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Subroutine (LOAD A = D)
E5
Start Address:
1880
This subroutine loads a designated block of RAM memory with an "address equals data" format. The memory
block's start and end addresses must be specified in the calling program as follows:
ADR
JS
o
ex
(LOAD A = D)
ADR+1
ADR+2
ADR+3
ADR+4
mL }
mP
Memory block start address
ADR+5
ADR+6
mLJ
mP
Memory block end address
ADR+7
Next instruction upon return from (LOAD A= D), where mL refers to a memory
line address and mP refers to a memory page address.
(LOAD A = D) uses subroutine (-(HL».
The data loaded into each memory location is equal to the line address of that location.
INITIALIZE
ADDRESS POINTERS
[BLOCK START (BC),
END (HL))
o
188B
FORM THE 2's
COMPLEMENT OF
THE BLOCK END
ADDRESS
...._ _
......_ _-w 1820
188E
STORE "A = D"
DATA AT
CURRENT
ADDRESS
1893
INCREMENT
ADDRESS
POINTER
o
Figure 4-19. Flowchart - Subroutine (LOAD A = D) for 7703.
4-14
o
REGISTER AND MEMORY ALLOCATION
PARAMETER
ADDRESS
ENTRY
REQUIREMENT
EXIT
CONDITION
Register pair
BC
XX
??
Register pair
DE
XX
??
Register pair
HL
XX
??
Register
A
XX
??
Register
F
XX
??
ELEMENT
COMMENTS
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-20. Register and Memory Allocation for 7703 Subroutine (LOAD A = D), Entry 5 and Return 6.
PROGRAM SPECIFICATIONS
SYMBOL
o
LIMITS
PARAMETER
MIN
I
MAX
UNITS
Ns
Stack memory
4
Bytes
Np
Program memory
24
Bytes
N pt
Total program memory
34
Bytes
Nr
RAM memory
N
Bytes
Execution time
8085
Ne
236 + (N-1 )59
Z80
239 + (N-1 )59
Time
states
COMMENTS
Uses (-(HL))
Uses (-(HL))
N = total number of
bytes in the block.
Figure 4-21. Characteristics of 7703 Subroutine (LOAD A = D), Entry 5 and Return 6.
o
4-15
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Subroutine (VERIFY A
= D)
E6
Start Address:
18AO
This subroutine tests a memory block for "address equals data" format. The start and end addresses of the
memory block must be specified in the calling program as follows:
ADR
JS
o
Cx
(VERI FY A = D)
ADR+1
ADR+2
ADR+3
ADR+4
mL}
mP
Memory block start address
ADR+5
ADR+6
mL}
mP
Memory block end address
ADR+7
Next instruction upon return from (VERIFY A = D), where mL refers to a
memory line address and mP refers to a memory page address.
(VERIFY A = D) uses subroutine {-(HL)). It utilizes the carry flag to indicate whether or not the memory
block is in the "address equals data" format. If the block contains all A = D data, the carry flag is cleared
(CO) upon exit from (VERIFY A = D). If there is a location that does not have the A = D format, the carry
flag is set (C1) upon exit from the subroutine. The BC register pair holds the address of the location
with the error, and the A register holds the error data.
o
INITIALIZE
ADDRESS POINTERS
[BLOCK START (BC),
END (HL)]
t;\
18AB
~-.........- -.... Q
FORM THE 2'8
COMPLEMENT OF
THE BLOCK END
ADDRESS
..---~=::::;r----&.I
1820
18AE
GET CURRENT
DATA BYTE
NO
18BC
INCREMENT
ADDRESS
POINTER
SET CARRY
FLAG
(ERROR)
CLEAR CARRY
FLAG
(NO ERROR)
o
Figure 4-22. Flowchart - Subroutine (VERIFY A = D) for 7703.
4-16
-------~.
--
---------------.------~--
--
REGISTER AND MEMORY ALLOCATION
o
PARAMETER
ADDRESS
ENTRY
REQUIREMENT
EXIT
CONDITION
Register pair
BC
XX
??
Register pair
DE
XX
??
Register pair
HL
XX
??
Register
A
XX
??
Register
F
XX
CO
ELEMENT
COMMENTS
A = D throughout
block - no error.
NOTES
1. For registers not shown, entry contents are not used and remain unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
Figure 4-23. Register and Memory Allocation for 7703 Subroutine (VERIFY A = D), Entry 6 and Return 7.
PROGRAM SPECIFICATIONS
o
SYMBOL
LIMITS
PARAMETER
MIN
I
MAX
UNITS
COMMENTS
Uses (-(HL))
Ns
Stack memory
4
Bytes
Np
Program memory
30
Bytes
Npt
Total program memory
40
Bytes
Nr
RAM memory
0
Bytes
Execution time
8085
247 + (N-1 )66
Ne
Z80
247 + (N-1 )69
Time
states
Uses (-(HL))
N = total number
of bytes in the block.
Figure 4-24. Characteristics of 7703 Subroutine (VERIFY A = D), Entry 6 and Return 7.
!
I
o
4-17
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PARAMETER
ADDRESS
ENTRY
REQUIREMENT
EXIT
CONDITION
Register pair
BC
XX
Address of error location
Register pair
DE
XX
??
Register pair
HL
XX
??
Register
A
XX
Error data (A =F D)
Register
F
XX
C1
ELEMENT
COMMENTS
Error, A =F 0 at same
location.
NOTES
1. For registers not shown, entry contents are not used and remai n unaltered at exit.
2. XX means no specific data required at entry, but entry contents will be lost.
3. ?? means contents are unknown or meaningless.
,I'
Figure 4-25. Register and Memory Allocation for 7703 Subroutine (VERIFY A = D), Entry 6 and Return S.
PROGRAM SPECIFICATIONS
SYMBOL
LIMITS
PARAMETER
MIN
I
MAX
UNITS
Ns
Stack memory
4
Bytes
Np
Program memory
30
Bytes
Npt
Total program memory
40
Bytes
Nr
RAM memory
0
Bytes
Ne
Execution time
SOS5
ZSO
-
Time
states
COMMENTS
o
Uses (-(HL»
Uses (-(HL»
N = total number
of bytes in the block.
Figure 4-26. Characteristics of 7703 Subroutine (VERIFY A = D), Entry 6 and Return S.
o
4-18
~~~~~~~--~~~--------------------~------~----~~-~----------------
o
Program Listing
Figure 4-27 shows the machine language code and the assembly language mnemonics, together with extensive
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Figure 4-27. Program Listing for 7703 Subroutines (continued)
4-21
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Demonstration/Test Program:
Shakedown (Confidence Level) Test
Start Address:
0000
o
This program provides a quick test of the 7703 RAM. It programs all RAM bits with different patterns and tests for
valid data, giving the user a level of confidence in the 7703.
The program loads and tests for a known data pattern in the 7703 RAM, then loads and tests for a new data
pattern, and finally loads and tests for the complement of the second data pattern.
Error routines store any error parameters (address of memory location with error, data contained in the error
location). If there are no errors for a particular segment of the program, the program stores zeros for the error
addresses and data. Error data may be examined with a user-provided routine, which should test the error
storage locations to determine whether an error occurred. The user's routine must provide a means of displaying or communicating any error data.
This program uses all of the subroutines presented in the preceding pages. RAM locations 211 0 through 211 E,
inclusive, are used as error storage locations.
NOTE
This is a demonstration/test program; it is not a subroutine.
o
o
4-22
-------------------------
-------------------
---------
--------------------------------- - - - - - - - - -
o
PAGE ADDRESS
LINE
00
01
02
03
04
05
06
07
08
09
OA
OB
OC
00
OE
OF
10
11
12
13
14
15
16
LINE
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
40
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
50
5E
5F
60
61
62
-
-
-
-
-
17
o
LABEL
TEST
18
19
1A
1B
1C
10
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
20
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
-
-
-
LABEL
-
-
-
-
-
63
64
65
66
67
68
69
6A
6B
6C
60
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
70
7E
7F
-
-
-
-
LINE
-
-
-
-
-
,
-
LABEL
80
81
LINE
-
82
83
84
85
86
87
88
89
8A
8B
8C
80
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
90
9E
9F
AO
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
BO
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BO
BE
BF
00
-
-
-
-
-
-
-
-
ERROR 1 _
r
-
-
ERROR 2
-
-
-
~,
-
-
CO
C1
LABEL
!ERROR 3
-
(;2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
DO
01
02
03
04
05
06
07
08
09
OA
DB
DC
DO
DE
OF
EO
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
FO
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FO
FE
FF
-
-
-
v
(SAVE)
-
-
-
"
-
-
-
-
-
-
-
-
-
o
Figure 4-28. Memory Map for Shakedown (Confidence Level) Test -
7703.
4-23
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PAGE ADDRESS
LINE
00
01
02
03
04
05
06
07
08
09
OA
OB
OC
00
OE
OF
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
10
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
28
2C
20
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
LINE
LABEL
-
-
-
-
-
-
-
ERROR 1 _
DATA
+
-
DATA
-
ERROR 2 _
t
-
ERROR 3 -'--
DATA
"
-
-
-
-
-
-
-
-
-
-
-
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
40
4E
4F
50
51
52
53
54
55
56
57
58
59
SA
5B
5C
50
5E
SF
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
60
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
70
7E
7F
LABEL
LINE
-
-
-
-
-
-
-
--,
-
-
-
-
-
-
-
-
-
-
-
-
-
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
80
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
90
9E
9F
AO
A1
A2
A3
A4
AS
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
BO
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BO
BE
BF
LINE
LABEL
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
.
-
LABEL
CO
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
DO
01
02
03
04
05
06
07
08
09
OA
DB
DC
DO
DE
OF
EO
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
FO
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FO
FE
FF
Figure 4-29. Memory Map for Error Storage Locations (Shakedown Test) - 7703.
4-24
o
21
-
-
-
-
-
-
o
-
-
-
-
--
-
-
o
o
INITIALIZE
SYSTEM
(STACK, MEMORY)
NO
OOC
0006
CLEAR ERROR
STORAGE
LOCATIONS
LOAD MEMORY
WITH
A = D PATTERN
SAVE ERROR DATA
(MEMORY
LOCATIONS
AND DATA)
0078
CHECK
FOR
ERRORS
NO
0
OOAO
~----~-------SAVE ERROR DATA
(MEMORY LOCAToN AND DATA)
CLEAR ERROR
STORAGE
LOCATIONS
0021
LOAD SECOND
PATTERN INTO
HALF OF MEMORY
o
0029
MOVE PATTERN
TO OTHER
HALF OF MEMORY
NO
0080
SAVE ERROR DATA
(MEMORY LOCA TIONS AND DATA)
CLEAR ERROR
STORAGE
LOCATIONS
004E
LOAD COMPLE MENT OF PATTERN
INTO HALF OF
MEMORY
0056
MOVE PATTERN
TO OTHER
HALF OF MEMORY
o
Figure 4-30. Flowchart - Demonstration/Test Program for 7703.
4-25
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SAVE
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PARAMETERS
8
OOC4
8
SAVE
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PARAMETERS
00A6
SAVE
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8 ----SAVE FIRST
BLOCK ERROR
ADDRESS
(PAGE, LINE)
o
0003
SAVE FIRST
BLOCK ERROR
DATA
0005
SAVE SECOND
BLOCK ERROR
ADDRESS
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0009
SAVE SECOND
BLOCK ERROR
DATA
o
Figure 4-30. Flowchart-Demonstration/Test Program for 7703 (continued).
4-26
PRO-LOG CORPORATION
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4-28
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7. ALL RESISTORS ARE
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8. ALL CAPACITORS ARE IN MICROFARADS.
&'6514-2 TYPE DEVICES.
~
MODEL
7703
7703- Ie
7703-2C
7703-4e
7703-8C
7703-I6C
EmTOM VIEW OF
~t------~~_r
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ASSEMBLY PARTS LIST
107036
107037
107078
107078
107081
i07082
107085
107084
107087
107088
106298
106299
~
Figure 5-1. Schematic for 7703 (Reference Only).
o
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&.~: ~~iOj~~ i~~HIMb\:~~I~A~~~~. \IN4!<. MEMORY I3lDtK.
&:. INSTALL JUMPER TO ENIIBlE t;kTTi'R'< Bl'LI'.-UP. REMDVE JlJti'ER
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OF CMO!;' RAM CHIPS.
~ AFER CONFIGURATION IDENT:~Y WITH MODEL
&
NO. DASH "l0.,-10C USING RUb5t:R STAMP.
APPLY INt "\. ATIN; 5iIlEU) Tl' CIRCLn SIDE Of BOARD.
Fhl,)f" T') Af+ll.'A'IOh :.)f ::'HIELO.&.>'\RI) ~'HOLIUIBE
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REFERENCE ONLY
t.c.o. NO. -10700Z -Ibe
SCH!;MATiC NO. - IObZ 97
PARTS U';T NO. - 10"2.99
I!ID~
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Figure 5-2. Assembly for 7703 (Reference Only).
Card Layout
Figure 5-3 shows the physical location of the 7703's main components: the various switches, indicators, and
jumpers on the card. The functions of the various components are identified. Note the position of pin 1 on the
RAM elements and the other ICs. When replacing chips, be careful to insert them only with pin 1 positioned as
shown in the figure; also, make sure that no pins are bent beneath the body of the chip.
o
CAUTION
Remove jumper A from the battery-enable pad before removing or replacing any RAM chips on the
7703 card. After RAM chip removal and/or replacement, replace Jumper A before reinserting card
into the card cage connector. If jumper A is not replaced, the contents of the RAM on the 7703 card
are destroyed.
Read Timing Diagram
Figure 5-4 displays a read timing diagram for a ZaO-based CPU. The timing sequence is based on a 400-ns
clock. Because of slow propagation time through the read and write decoding circuitry, do not use the 7703
with 4-MHz (or faster) CPU cards.
o
o
5-4
---
~~
..
-----~~~~-~---~---~-
o
EACH MEMORY BLOCK (X)
IS A CHIP PAIR 6514-2
4K -4
SELECT
16K
QUADRANT
4K -1
OPEN FOR
UNUSED 4K
BLOCKS
TEST POINTS
TO MONITOR
BATTERY
CURRENT
o·
BATTERY
ENABLE
JUMPER PAD
(JUMPER A)
Figure 5-3. Location and Functions of Main
t,
CPU B
I
X
"
"
""
""
X
CARD SELECT
SX"
4K BLOCK DECODE
X4K",SY"
CHIP SELECT
CEO"-CE1S"
BLOCK SELECTED"
BLOCK READ"
for 7703 .
t3
400n5
X
STO BUS TIMING
/
X
MEMORY CHIP ADDRESS STABLE
/
/
/
7703 CARD
/
/
,~------------------~----_/
DATA BUS ENABLE"
o
•
/ ,--------- }
"
RD"
ADDRESS
AO-A9
400n5
INSTRUCTION ADDRESS STABLE
MEMRQ"
6S14-2
T
400n5
Com~onents
....
t2
--.J
ADDRESS BUS
AO-A1S
REPLACEBATTERY LED
WRITE INHIBIT SWITCHES
UP (OFF): INHIBIT
DOWN: WRITE ENABLE
HIGH
IMPEDANCE
HIGH IMPEDANCE
, . - - - - _ , . -___---..__~.....__~""""'"".......~-"
OUTPUT ---------<-(_..!L~O~W~Z~.JX
VALID RA
DATA OUT
)
®~ CPU READS DATA
Figure 5-4. Read Timing Diagram for 7703 (used with Pro-Log's 7803 2.5-MHz Z80 CPU card).
5-5
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Address Decoding Circuit
0
See Fig. 5-5. Address lines A15 and A14 are decoded by U4 to select the 16K memory space in which the 7703
operates. A15 and A14 decode the 64K address space as shown in Fig. 5-6.
The 16K address range that the 7703 will respond to is determined by the jumpering of SX as indicated in Fig.
5-6 and as specified in Section 2. Jumper SX is in the X3 position when the 7703 is initially shipped to you
from the factory.
Address lines A13 and A12 are decoded by U5 to select the active 4K block from the 16K bank controlled by
A 15 and A 14. The outputs from one-half of U5 are wire-ORed together to form the SY* signal, which must be
active to access the selected 4K block. The unused 4K block or-blocks are disabled by cutting one or more of
the traces at SYO, SY1, SY2, or SY3. The outputs from the other half of U5 are used in the chip-enable
decoding operation.
o
o
5-6
0
+5V
CARD
DECODER
R2-6
74LS156
ADDRESS RANGE
4
+5V
1G
1V3
1C
1Y2
5
2
MEMEX
A15
3
A14
13
U4
B
6
X2
8000-BFFF
X1
7
1YO
4K BLOCK
DECODER
4000-7FFF
1Y1
A
+5V
COOO-FFFF
R1
22K
74LS156
XO
0OOO-3FFF
+5V
+5V
1C
1Y2
B
1 V1
3
A13
74LS156
1Y3
2
SX*
4K BLOCK DECODER
1G
R2-4
14
13
2G
2Y3
A12
1YO
A
U5
2Y2
2C
US
A13
3
A12
13
BUS CONTROL
ENABLE
(4K BLOCKS)
2Y1
B
A
2YO
U5
0
TO CHIP-ENABLE
DECODERS
~
Figure 5-5. Address Decoding Circuit for 7703.
ADDRESS
LINE
A15
ADDRESS
LINE
A14
MEMORY
ADDRESS
RANGE
SX
JUMPERS
0
0
0OOO-3FFF
XO
0
1
4000-7FFF
X1
1
0
8000-BFFF
X2
1
1
COOO-FFFF
X3
o
Figure 5-6. Decoding the 7703's 64K Address Space.
5-7
,
LU-fl'!_tL .. l_il'-Q!iLBU_PLiI1RAkWKjdJl'_AI LL.
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-
0
Chip-Enable Decoding Circuit
See Fig. 5-7. The block enables generated by U5 (04K, 14K, 24K, and 34K) are decoded (with address lines A 11
and A10) by U6 and U7. The CEX· signals select the 1K byte RAM pair that is to be accessed. (Fig. 5-8).
Signal OP is derived from the operate flip-flop, which is reset by power failure, or by power-up and power-down
of the system. U6 and U7 are open collector devices and are pulled up to CMOS +5V.
FROM
4K BLOCK
DE CODER
V
CMOS+5V
CHIP ENABLE
DECODERS
A~
74LS15S
~r
~
OP
34K*
1
-
1G
5
1
us
3
A11'- B
A10'
1
...
1Y2
1C
-2.:..
CE15*
.....
CE14*
R10-3
..A.A.A
.....
R11
S
1Y1
~
~
7
A
.........
.A.A.A
1Y3 Ioiio..
r-t"
2
'-I
R19-3
4
1YO
~
...
l.
.........
CE13*
R9-4
............
J..
"""
•••
CE12*
CMOS+5V
OP*
-
'"
24K*
12
14
'-I
-'"
2Y3 ~
2G
15
A11'~
13
A10'-
2Y2
2C
B
....11
'"10
"
us
2Y1 ;:
9
A"
2YO
.. '"
R9-S
....
~
All
A.A .....
1
-
CE11*
R7-S
..A.A .....
J..
."''''
CE10*
..
.. '"
RS-5
..A ..........
1
-
J.
-
'"
CE9*
R5-2
...........
CE8*
22K(TYP)
CMOS+5V
74LS15S
~
'"
OP
1
14K*
-
1G
4
1Y3 ~
1C
....
5
2
'-I
3
A11'13
A10'-
1Y2
U7
B
1Y1
'""
....I'-'S
7
A
1YO
iI-I.
""
R10-5
A ........
J.
1
...
J.
-
.L
-
A~
."''''
CE7*
.. '"
R10-2
A ..........
CES*
R5-S
.........
•••
CE5*
RS-3
A.A.A
•••
CE4*
04K*
-
-""
12
iI-I.
2Y3 r-
2G
11
15
'"
A11'-..!
A10'-.-!!
2C
2Y2
U7
B
A
'"
~
"""
10
2Y1" n
"""9
n.
2YO IV
.L
...
...
l.
R9-5
.........
.........
R7-5
.A.A.A
•••
-
...1
CE2*
RS-4
.........
.A.A ...
..L
CE3*
R5-3
..........
.... '"
11K(TYP)
CE1*
CEO*
'"
''""
'"
~,
Figure 5-7. Chip-Enable Decoding Circuit for 7703.
5-8
o
j~
74LS15S
14
''""
''""
''""
!.
~
22K(TYP)
CMOS+5V
OP*
'"
~
22K(TYP)
74LS15S
'"
TO CHIP-ENABLE
PINS (#8) OF EACH
1 K PAIR OF MEMORY
CHIPS.
o
o
OPERATE
SIGNAL
X4K
OP* - 0
04K
CEO*-3 *
Lowest
OP -1
14K
CE4*-7 *
Next lowest
OP* - 0
24K
CE8*-11 *
Next to highest
OP -1
34K
CE12*-15*
Highest
CEX*
4K SELECTED
Figure 5-8. CEX* Signal Selection of 1K Byte RAM Pair to be Accessed - 7703.
o
o
5-9
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__
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Data Bus Buffer Circuit
See Fig. 5-9. The 7703 data bus buffering and directional control are provided by U1, which is a three-state
bidirectional bus controller. When the read (RD*) signal is active and when SY* and MEMRQ* are both active,
U1 is enabled to pass data from the 7703 card to the STD BUS (Le., read operation). When the RD* signal is
inactive and when WR*, SY*, and MEMRQ* are all active, U1 allows data to be transferred from the STD BUS to
the 7703 card (write operation). Otherwise, U1 is in a high impedance state.
o
TO DATA LINES
OF ALL MEMORY
CHIPS
DATA BUS BUFFER
8
FROM srD
DATA BUS ----------------~--+---.---------------~
15
EN·
74LS32
5
RD'--------------
Figure 5-13. Monitoring Circuit for 7703.
Backup Battery Circuit
See Fig. 5-14. The backup battery is a lithium primary cell rated at 3V, 1 ampere hour. The battery's shelf life is
10 years and its operating range is from -40 to 70°C. A Schottky diode protects the battery from system power.
You can monitor the battery current by measuring the voltage drop across the 100-0 resistor (R4) that is in
series with the battery. Battery drain or back leakage should never exceed 30ILA. See Appendix A for guidelines
on handling lithium batteries.
+5V----------~~----~
~------__----------__---------~CMOS+'5V
01
MPS6534
CR1
1NS518
TO "REPLACE
BATTERY"
....- - - - - - -..... INDICATOR
CIRCUIT
R12-1
2.2K
LOW Vee·
o
=
BAT 1
3V/1AH
- - LITHIUM
CR2
R12-4
2.2K
1N4148
C4-7
.1J.LF
50V
R12-2
2.2K
1000
1%
o
02
2N4123
R12-3
2.2K
CR3
1N4148
A
GND---------------~------------_4~--------------_.~-----------~-----------------------_1J) TP-1
NOTE: Short circuit of traces or exposure of the card to strong radiation shortens data retention and necessitates early battery replacement.
Figure 5-14. Battery Backup Circuit for 7703.
Changing the Lithium Battery
To change the lithium battery on the 7703 card, follow these steps:
1. Remove the battery activation jumper (jumper A).
2. Desolder the battery's leads from the card. DO NOT TRY TO REMOVE THE LEADS FROM THE BATTERY!
3. Remove the battery.
4. Place the new battery in position, checking for proper polarity.
5. Solder the battery leads to the card at the appropriate pads.
6. Replace jumper A.
7. Connect a voltmeter across the test points TP1 anq TP2. The voltage should not be more than 0.003V,
although it may be considerably less. A proper reading at this point verifies that the lithium battery is
properly installed and operating. If the voltage is more than 0.003V, disconnect the battery and call the
Customer Service department at Pro-Log (see "Return for Repair Procedures").
5-14
0'
,I
,
I
o
Signal Glossary
MNEMONIC
MEANING
PIN(S)
FUNCTION
00-07
Data bus
7-14
High-active
8-bit, 3-state bidirectional data bus
A15, A14
Address bus
16,18
High-active
Decode 64K address space through
16K bank decoder
A13, A12
Address bus
20,22
High-active
Select active 4K block from 16K bank
controlled by A 15 and A 14
A11, A10
Address bus
24,26
High-active
Decode block enables
AO-AS
Address bus
15,17, 19
21,23,25
27,28,29,30
High-active
Address bus for 1Kx8 CMOS RAM
MEMEX
Memory
expansion
36
High-active
Expands or enables memory add ressi ng
WR*
Write
31
Low-active
Indicates that the bus holds valid data
to be written in addressed memory
MEMRQ*
Memory
address select
34
Low-active
Indicates address bus holds valid address for memory read/write operations
RD*
Read
32
Low-active
+5V
Voltage
(bused)
2
-
~
o
DESCRIPTION
.. -
Indicates that processor is reading data
from memory
Provides main logic voltage
Note: Unused pins are open; pads are provided on some unused pins for user signals.
Figure 5-15. STD BUS Edge Connector Signals for the 7703. (See also edge connector pin list, Fig. 2-7.)
o
5-15
M-.UiiHiFdiiiGiiiiUlWIdJ_WfHiM:;mJGiIJIM!ii1&&lU&MMiI1AAUllia;;itMU,UllJllM1MW.dfW;;;;4t14444,t,tilJ, OCr
,
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";;4;,Y4m,';#JPi;MI;,Q~4FftlI1¥f.'\f1iii • .LP.4.'fIH\
";,
7703 Internal Signals
o
SCHEMATIC
GRID
LOCATION
MEANING
SX*
0-6
16K bank select
User-selectable. Oefines 16K address range by
decoding A15, A14. Block decode enable.
Sy*
0-5
4K block select
Indicates that one of the 4K banks has been selected
by decoding A13, A12 qualified by SX*. BUS control
enable.
34K*
0-6
Block 3 selected
Enables decoding circuitry for memory block 3 (RAM
pairs 12-15) by decoding A13, A12 qualified by SX*.
24K*
0-6
Block 2 selected
Enables decoding circuitry for memory block 2 (RAM
pairs 8-11) by decoding A13, A12 qualified by 8X*.
14K*
0-6
Block 1 selected
Enables decoding circuitry for memory block 1 (RAM
pairs 4-7) by decoding A13, A12 qualified by SX*.
04K*
0-6
Block 0 selected
Enables decoding circuitry for memory block 0 (RAM·
pairs 0-3) by decoding A 13, A 12 qualified by SX*.
BLOCK
SELECTED*
0-5,4
Block selected
Qualified with MEMRQ* to indicate that a memory
block has been selected.
BLOCK
SELECTED
0~4,3
Block selected
Complement of above signal. Used to set the operate
flip-flop upon a memory reference (enable memory).
BLOCKREAD*
0-4
Read strobe
Provides direction control for the data bus buffer.
BLOCK
WRITE*
0-4
Write strobe
Provides direction control for the data bus buffer.
Provides write-enable signals via the write-inhibit
switches.
OP
0-3
Chip-enable
decode strobe
Acts as strobe to the chip-enable decoder
(Blocks 1 and 3).
OP*
0-3
Chip-enable
decode strobe
Acts as strobe to the chip-enable decoder
(Blocks 0 and 2). Also, qualifies BLOCK WRITE*
to generate the write-enable signals.
WE3*
0-2
Write-enable
blocks
Provides write-enable for memory block 3 (RAM
pairs 12-15). 81-4 must be closed.
WE2*
0-2
Write-enable
block 2
Provides write-enable for memory block 2 (RAM
pairs 8-11). S1-3 must be closed.
WE1*
0-2
Write-enable
block 1
Provides write-enable for memory block 1 (RAM
pairs 4-7). 81-2 must be closed.
MNEMONIC
DESCRIPTION/FUNCTION
Figure 5-16. 7703 Internal Signal8 (8ee Schematic, Fig. 5-1, for reference).
5-16
o
o
o
7703 Internal Signals (Cont.)
MNEMONIC
o
SCHEMATIC
GRID
LOCATION
MEANING
DESCRIPTION/FUNCTION
WEO·
0-2
Write-enable
block 1
Provides write enable for memory block 0 (RAM
pairs 0-3). S1-2 must be closed.
CE15*
C-6
Chip-enable
RAM pair 15
Provides chip enable to RAM pair 15 by decoding
A11, A10 qualified by 34K* and OP.
CEO*
8-6
Chip-enable
RAM pair 0
Provides chip enable to RAM pair 0 by decoding
A 11, A 10 qualified by 04K* and OP*.
2.5 REF
A-7
2.5V reference
voltage
Reference voltage used in the power monitor circuit
(to test Vcc) and in the circuit that monitors the battery.
LOWVCC*
A-6
Low Vcc voltage
Used to clear the operate flip-flop when Vcc (+5V) is
too low (power-down <4.52V, power-up <4.663V).
Disables memory.
CMOS +5V
8-4
CMOS voltage
supply
Voltage supply for the CMOS devices. Alternate power
source to allow data retention when system power is
not provided.
Figure 5-16. 7703 Internal Signals (continued).
Return for Repair Procedures
Domestic Customers:
1. Call our factory direct at (408) 372-4593, and ask for CUSTOMER SERVICE.
2. Explain the problem and we may be able to solve it on the phone. If not, we will give you a Customer
Return Order (CRO) number.
Mark the CRO number on the shipping label, packing slip, and other paperwork accompanying the
return. We cannot accept returns without a CRO.
3. Please be sure to enclose a packing slip with CRO number, serial number of the equipment, if applicable,
reason for return, and the name and telephone number of the person we should contact (preferably the
user), if we have any further questions.
4. Package the equipment in a solid cardboard box secured with packing material.
CAUTION: Loose MOS integrated circuits, or any product containing CMOS integrated circuits, must
be protected from electrostatic discharge during shipment. Use conductive foam pads or conductive
plastic bags, and never place MOS or CMOS circuitry in contact with Styrofoam materials.
5. Ship prepaid and insured to:
o
Pro-Log Corporation
2411 Garden· Road
Monterey, California 93940
Reference CRO # _ _ _ _ __
5-17
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International Customers:
Equipment repair is handled by your local Pro-Log Distributor. If you need to contact Pro-Log, the factory
can be reached at any time by TWX at 910-360-7082.
o
Limited Warranty: Seller warrants that the articles furnished hereunder are free from defects in material
and workmanship and perform to applicable, published Pro-Log specifications for one year from date of
shipment. This warranty is in lieu of any other warranty expressed or implied. In no event will Seller be
liable for special or consequential damages as a result of any alleged breach of this warranty provision.
The liability of Seller hereunder shall be limited to replacing or repairing, at its option, any defective units
which are returned F.O.B. Seller's plant. Equipment or parts which have been subject to abuse, misuse,
accident, alteration, neglect, unauthorized repair or installation are not covered by warranty. Seller shall
have the right of final determination as to the existence and cause of defect. As to items repaired or
replaced, the warranty shall continue in effect for the remainder of the warranty period, or for ninety (90)
days following date of shipment by Seller or the repaired or replaced part whichever period is longer. No
liability is assumed for expendable items such as lamps and fuses. No warranty is made with respect to
custom equipment or products produced to Buyer's specifications except as specifically stated in
writing by Seller and contained in the contract.
o
o
5-18
APPENDIX A
Guidelines for Handling Lithium Batteries
o
NOTE
The information in this appendix is provided for reference only. Pro-Log does not assume any liability
that may arise out of the application or use of the information that follows.
Introduction
This appendix provides guidelines for utilizing lithium batteries. Lithium cells utilize lithium organic electrolytes, which produce much higher energy densities (capacity) than do conventional primary cells (carbon zinc).
This high capacity and the use of lithium require handling procedures more stringent than those required for
conventional cells. The cells used by Pro-Log are equipped with a pressure-sensitive vent mechanism
designed to safely deactivate a cell under the most abusive thermal environment, test, or operating condition.
CAUTION
To prevent recharge, short circuit, and puncture or exposure to high temperature or incineration, do
not store, test, or handle lithium cells near flammable solvents or materials.
Exposure to Short Circuit Conditions
Any cell that has been exposed to short circuit conditions should not be used in shippable equipment. The
cells should be hand inserted and soldered. No special precautions are required.
o
NOTE
If a wire breaks loose from the body of the lithium cell, do not attempt to resolder it.
The accidental short circuiting of a lithium cell will cause the internal temperature of the lithium cell to rise. If
the short remains long enough, one of the two following conditions will occur:
Either
Dissipated heat, burning, or glowing electrical connections will be evident with an accompanying loss of cell
output voltage.
Action: Remove the cause of the short circuit as soon as possible. Allow the cell to cool and remove it from
service. For disposal, see disposal recommendations on page A-2.
Or
40-50% of the cell's fumes will vent due to the internal temperature buildup. NOTE: Upon venting, the cell
chemistry will stop and the cell will become inactive.
Action: Remove the cause of the short circuit immediately, if possible without exposure to the venting fumes.
Evacuate the immediate area until venting has stopped. Move the cell or assembly to a dry ventilated area and
let it stabilize for 24 hours. After stabilization, dispose of the-cell (see disposal recommendations on page A-2).
Electrolyte Leakage
Characteristics: A leaking and/or vented cell can be readily detected by the presence of sulfur dioxide and
residual electrolyte solvents. The electrolyte consists primarily of sulfur dioxide, a highly irritating, nonflammable, colorless gas at room temperature and atmospheric pressure.
~I'(
0
Toxicity: Gaseous sulfur dioxide is highly irritating and is practically irrespirable. It is readily detected in
concentrations of 3-5 ppm and thus provides ample warning of its presence. Acute exposure to sulfur dioxide
has the following effects: throat irritation, coughing, constriction of the chest, tearing and smarting of the
eyes. There are no systemic effects of acute exposure to sulfur dioxide.
A-1
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Action: Electrically disconnect the suspected cell if it is under load. Store the cell or hardware in a ventilated,
dry area under ambient thermal conditions. After the concentrations of sulfur dioxide are reduced to a tolerable
value (approximately 5 ppm, i.e., when the irritating odor is significantly diminished), carefully unpack the
suspected cell or hardware and-visually examine it to determine the source of electrolyte leakage. Segregate
acceptable cells and get rid of the unacceptable ones (see disposal recommendations below).
0
Disposal Recommendations
1. Prepare the cell for disposal by packaging it in a suitable container that will prevent short circuiting or
crushing of the cell.
2. Dispose of low quantities of cells (10 or less) in the same manner as carbon zinc cells (flashlight batteries)
are disposed of.
CAUTION
Do not incinerate or compact the cells!
3. Dispose of larger quantities of cells as follows:
To effect the most environmentally safe disposal, place the cells in secured landfills ordisposal ponds with
provisions for leachate control and monitoring, documentation, and runoff control.
Sanitary landfills or special landfills can be used, where the cells can be dispersed in large quantities of
solid waster. When transporting the used cells or batteries for disposal, handle them in a safe manner to
prevent short circuiting.
CAUTION
Do not incinerate or compact the cells!
Shipping the Product
o
Shipping regulation requirements: Quantities less than 200 units/shipment are exempt from domestic regulation DOT-E-7042 and International Reg u lation lATA and may be sh ipped unrestricted. The sh i ppi ng package
should prevent short circuit or crushing the product.
Quantities greater than 200 units require that the following label be affixed:
Lithium - not restricted per DOT-E-7042, Section 173.206, Par. F; or lATA, Section 10.
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USER'S MANUAL
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2411 Garden Road
Monterey, California 93940
Telephone: (408) 372-4593
TWX: 910-360-7082
1 06293A
8/81
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