Intel® Desktop Board DQ77MK Technical Product Specification DQ77MK_Tech Prod Spec01 Tech

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Intel® Desktop Board

DQ77MK

Technical Product Specification

May 2012

Part Number: G54941-001

The Intel Desktop Board DQ77MK may contain design defects or errors known as errata that may cause the product to deviate from published specifications.

Current characterized errata are documented in the Intel Desktop Board DQ77MK Specification Update.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board DQ77MK Technical Product

Specification May 2012

This product specification applies to only the standard Intel® Desktop Board with BIOS identifier

MKQ7710H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS

GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR

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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT

OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN

WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN

WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

All Intel® desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal

computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The

suitability of this product for other PC or embedded non-PC applications or other environments, such as

medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by

Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other

intellectual property rights that relate to the presented subject matter. The furnishing of documents and

other materials and information does not provide any license, express or implied, by estoppel or otherwise,

to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to them.

Intel desktop boards may contain design defects or errors known as errata, which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your

product order.

Intel, 3rd generation Intel Core processor family, and 2nd generation Intel Core processor family are

trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright  2012, Intel Corporation. All rights reserved.

iii

Board Identification Information

Basic Desktop Board DQ77MK Identification Information

AA Revision BIOS Revision Notes

G39642-300 MKQ7710H.86A.0034 1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Q77 processor used on this AA revision consists of the following component:

Device Stepping S-Spec Numbers

Intel Q77 Express Chipset C1 SLJ83

Errata

Current characterized errata, if any, are documented in a separate Specification

Update. See http://developer.intel.com/products/desktop/motherboard/index.htm

for the latest documentation.

Intel Desktop Board DQ77MK Technical Product Specification

iv

v

Preface

This Technical Product Specification (TPS) specifies the board layout, components,

connectors, power and environmental requirements, and the BIOS for Intel® Desktop

Board DQ77MK.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Desktop

Board DQ77MK and its components to the vendors, system integrators, and other

engineers and technicians who need this level of information. It is specifically not

intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on Intel Desktop Board DQ77MK

2

A map of the resources of the Intel Desktop Board

3

The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not

all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DQ77MK Technical Product Specification

vi

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/s Gigabytes per second

Gb/s Gigabits per second

I/O Input/Output

KB Kilobyte (1024 bytes)

Kb Kilobit (1024 bits)

kb/s 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/s Megabytes per second

Mb Megabit (1,048,576 bits)

Mb/s Megabits per second

TDP Thermal Design Power

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

vii

Contents

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Online Support ................................................................................. 16

1.3 Processor ........................................................................................ 16

1.3.1 Graphics Subsystem .............................................................. 17

1.4 System Memory ............................................................................... 19

1.4.1 Memory Configurations .......................................................... 20

1.5 Intel® Q77 Express Chipset ................................................................ 22

1.5.1 Direct Media Interface (DMI) .................................................. 22

1.5.2 Display Interfaces ................................................................. 22

1.5.3 USB ..................................................................................... 24

1.5.4 SATA Interfaces .................................................................... 24

1.6 Real-Time Clock Subsystem ............................................................... 26

1.7 Legacy I/O Controller ........................................................................ 26

1.8 Audio Subsystem .............................................................................. 27

1.8.1 Audio Subsystem Software ..................................................... 27

1.8.2 Audio Connectors and Headers ................................................ 28

1.9 LAN Subsystem ................................................................................ 29

1.9.1 Intel® 82579LM Gigabit Ethernet Controller and

Intel® 82574L Gigabit Ethernet Controller................................. 29

1.9.2 LAN Subsystem Software ....................................................... 30

1.9.3 RJ-45 LAN Connectors with Integrated LEDs ............................. 30

1.10 Hardware Management Subsystem ..................................................... 31

1.10.1 Hardware Monitoring ............................................................. 31

1.10.2 Fan Monitoring ...................................................................... 31

1.10.3 Chassis Intrusion and Detection .............................................. 31

1.10.4 Thermal Monitoring ............................................................... 32

1.11 Intel® Security and Manageability Technologies .................................... 33

1.11.1 Intel® vPro™ Technology ........................................................ 33

1.11.2 Intel Small Business Technology ............................................. 36

1.11.3 Intel® Management Engine (Intel® ME) Software and Drivers ...... 37

1.12 Power Management .......................................................................... 38

1.12.1 ACPI .................................................................................... 38

1.12.2 Hardware Support ................................................................. 40

2 Technical Reference

2.1 Memory Resources ........................................................................... 45

2.1.1 Addressable Memory.............................................................. 45

2.1.2 Memory Map ......................................................................... 47

Intel Desktop Board DQ77MK Technical Product Specification

viii

2.2 Connectors and Headers .................................................................... 47

2.2.1 Back Panel Connectors ........................................................... 48

2.2.2 Component-side Connectors and Headers ................................. 49

2.3 Jumper Block ................................................................................... 61

2.4 Intel® Management Engine BIOS Extension (Intel® MEBX)

Reset Header ................................................................................... 62

2.5 Mechanical Considerations ................................................................. 63

2.5.1 Form Factor .......................................................................... 63

2.6 Electrical Considerations .................................................................... 64

2.6.1 Power Supply Considerations .................................................. 64

2.6.2 Power Supervisor .................................................................. 65

2.6.3 Fan Header Current Capability ................................................ 65

2.6.4 Add-in Board Considerations ................................................... 65

2.7 Thermal Considerations ..................................................................... 65

2.8 Reliability ........................................................................................ 68

2.9 Environmental .................................................................................. 68

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 69

3.2 BIOS Flash Memory Organization ........................................................ 70

3.3 Resource Configuration ..................................................................... 70

3.3.1 PCI Express Autoconfiguration ................................................ 70

3.4 System Management BIOS (SMBIOS) ................................................. 71

3.5 Legacy USB Support ......................................................................... 71

3.6 BIOS Updates .................................................................................. 72

3.6.1 Language Support ................................................................. 72

3.6.2 Custom Splash Screen ........................................................... 73

3.7 BIOS Recovery ................................................................................. 73

3.8 Boot Options .................................................................................... 74

3.8.1 Optical Drive Boot ................................................................. 74

3.8.2 Network Boot ........................................................................ 74

3.8.3 Booting Without Attached Devices ........................................... 74

3.8.4 Changing the Default Boot Device During POST ......................... 74

3.9 Adjusting Boot Speed ........................................................................ 75

3.9.1 Peripheral Selection and Configuration ..................................... 75

3.9.2 BIOS Boot Optimizations ........................................................ 75

3.10 BIOS Security Features ..................................................................... 76

3.11 BIOS Performance Features ............................................................... 77

4 Error Messages and Beep Codes

4.1 Speaker .......................................................................................... 79

4.2 BIOS Beep Codes ............................................................................. 79

4.3 Front-panel Power LED Blink Codes ..................................................... 80

4.4 BIOS Error Messages ........................................................................ 80

4.5 Port 80h Power On Self Test (POST) Codes .......................................... 81

Contents

ix

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 87

5.1.1 Safety Standards................................................................... 87

5.1.2 European Union Declaration of Conformity Statement ................ 88

5.1.3 Product Ecology Statements ................................................... 89

5.1.4 China RoHS .......................................................................... 92

5.1.5 EMC Regulations ................................................................... 93

5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 95

5.1.7 Regulatory Compliance Marks (Board Level) ............................. 96

5.2 Battery Disposal Information .............................................................. 97

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and DIMM Configuration ............................................ 21

4. Back Panel Audio Connectors ............................................................. 28

5. LAN Connectors LED Locations ........................................................... 30

6. Thermal Sensors and Fan Headers ...................................................... 32

7. Location of the Intel ME “M” State LED ................................................ 37

8. Location of the Standby Power LED ..................................................... 43

9. Detailed System Memory Address Map ................................................ 46

10. Back Panel Connectors ...................................................................... 48

11. Component-side Connectors and Headers ............................................ 49

12. Connection Diagram for Front Panel Header ......................................... 58

13. Connection Diagram for Front Panel USB 2.0 Connectors ....................... 60

14. Location of the Jumper Block ............................................................. 61

15. Intel MEBX Reset Header ................................................................... 62

16. Board Dimensions ............................................................................. 63

17. Localized High Temperature Zones ..................................................... 66

18. Intel Desktop Board DQ77MK China RoHS Material Self

Declaration Table .............................................................................. 92

Tables

1. Feature Summary ............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Supported Memory Configurations ...................................................... 19

4. DVI Port Status Conditions................................................................. 23

5. DisplayPort Status Conditions ............................................................. 23

6. Audio Formats Supported by the DisplayPort Interface .......................... 23

7. Audio Jack Support ........................................................................... 27

8. LAN Connector LED States ................................................................. 31

9. Intel ME “M” State LED Behavior ........................................................ 37

10. Effects of Pressing the Power Switch ................................................... 38

11. Power States and Targeted System Power ........................................... 39

Intel Desktop Board DQ77MK Technical Product Specification

x

12. Wake-up Devices and Events ............................................................. 40

13. System Memory Map......................................................................... 47

14. Component-side Connectors and Headers Shown in Figure 11 ................ 50

15. Serial Port Connector ........................................................................ 51

16. Front Panel Audio Header for Intel HD Audio ........................................ 51

17. Front Panel Audio Header for AC ’97 Audio ........................................... 51

18. Front Panel USB 2.0 Connectors ......................................................... 51

19. Front Panel USB 3.0 Connector ........................................................... 52

20. IEEE 1394a Connector ....................................................................... 52

21. Internal Mono Speaker Header ........................................................... 52

22. PCI Express Full-/Half-Mini Card Connector .......................................... 53

23. SATA Connectors .............................................................................. 54

24. S/PDIF Header ................................................................................. 55

25. Chassis Intrusion Header ................................................................... 55

26. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 55

27. LPC Debug Header ............................................................................ 55

28. Processor Core Power Connector ........................................................ 57

29. Main Power Connector ....................................................................... 57

30. Front Panel Header ........................................................................... 58

31. States for a One-Color Power LED ....................................................... 59

32. States for a Two-Color Power LED....................................................... 59

33. Alternate Front Panel Power/Sleep LED Header..................................... 59

34. BIOS Setup Configuration Jumper Settings .......................................... 61

35. Intel MEBX Reset Header Signals ........................................................ 62

36. Recommended Power Supply Current Values (High Power) .................... 64

37. Recommended Power Supply Current Values (Low Power) ..................... 64

38. Fan Header Current Capability ............................................................ 65

39. Thermal Considerations for Components .............................................. 67

40. Tcontrol Values for Components ......................................................... 67

41. Environmental Specifications .............................................................. 68

42. BIOS Setup Program Menu Bar ........................................................... 70

43. BIOS Setup Program Function Keys .................................................... 70

44. Acceptable Drives/Media Types for BIOS Recovery ................................ 73

45. Boot Device Menu Options ................................................................. 74

46. Supervisor and User Password Functions ............................................. 76

47. BIOS Beep Codes ............................................................................. 79

48. Front-panel Power LED Blink Codes ..................................................... 80

49. BIOS Error Messages ........................................................................ 80

50. Port 80h POST Code Ranges .............................................................. 81

51. Port 80h POST Codes ........................................................................ 82

52. Typical Port 80h POST Sequence ........................................................ 86

53. Safety Standards .............................................................................. 87

54. EMC Regulations ............................................................................... 93

55. Regulatory Compliance Marks ............................................................ 96

11

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters])

Processor • 3

rd

generation Intel

®

Core processor family and 2

nd

generation Intel

®

Core

processor family processors with up to 95 W TDP in an LGA1155 socket

― One PCI Express* 3.0 x16 graphics interface

― Integrated memory controller with dual channel DDR3 memory support

― Integrated graphics processing (processors with Intel® HD Graphics)

― External graphics interface controller

Memory • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 32 GB of system memory with four DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory

• Support for XMP memory

Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core

processor family processors

Chipset Intel

®

Q77 Express Chipset consisting of the Intel

®

Q77 Express Platform

Controller Hub (PCH)

Graphics • Integrated graphics support for processors with Intel

®

Graphics Technology:

― DisplayPort*

― DVI-I

― DVI-D

• Support for a PCI Express 3.0 x16 add-in graphics card

Note: PCI Express 3.0 is only supported by 3rd generation Intel Core

processor family processors

Audio •

8-channel (6+2) Intel High Definition Audio via the Realtek* ALC892 audio

codec

• 8-channel (7.1) Intel HD Audio via the DisplayPort connector from the PCH

continued

Intel Desktop Board DQ77MK Technical Product Specification

12

Table 1. Feature Summary (continued)

Peripheral

Interfaces

• Four USB 3.0 ports:

― Two USB 3.0 ports are implemented with stacked back panel connectors

(blue)

― Two front panel USB 3.0 ports are implemented through one internal

connector (blue)

• Ten USB 2.0 ports:

― Four ports implemented with stacked back panel connectors (two black and

two orange high current charging ports)

― Four front panel ports implemented through two internal headers (black)

― Two ports are implemented in the PCI Express Full-/Half–Mini Card slot

• Six Serial ATA (SATA) ports:

― Two SATA 6.0 Gb/s interface through the Intel Q77 Express Chipset with

Intel® Rapid Storage Technology RAID support (blue)

― Two internal SATA 3.0 Gb/s interfaces through Intel Q77 Express Chipset

with Intel Rapid Storage Technology RAID support (black)

― One internal SATA connector (multiplexed with an mSATA port, routed to

the PCI Express Full-/Half-Mini Card slot) (gray)

― One external eSATA 3.0 Gb/s interface (red)

• One serial port connector

• Two IEEE 1394a ports:

― One port via a back panel connector

― One port via a front-panel connector (blue)

Expansion

Capabilities

• One PCI Express 3.0 x16 add-in card connector

• One PCI Express 2.0 x4 bus add-in card connector from the PCH

• One PCI Express 2.0 x1 bus add-in card connector from the PCH

• One Conventional PCI bus add-in card connectors from the PCH

• One PCI Express Full-/Half-Mini Card connector from the PCH (supporting

mSATA and USB capabilities)

Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor

family processors

BIOS • Intel® BIOS resident in the SPI Flash device

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

and SMBIOS

Instantly Available

PC Technology

• Support for PCI Express* Revision 3.0

• Suspend to RAM support

•

Wake on PCI, PCI Express, LAN, front panel, serial, and USB ports

LAN Support Two Gigabit (10/100/1000 Mb/s) LAN subsystems using the Intel® 82579LM

Gigabit Ethernet Controller (red connector) and Intel® 82574L Gigabit Ethernet

Controller (black connector)

Legacy I/O Control Nuvoton NCT6776D I/O controller for serial port and hardware management

support

Hardware Monitor

Subsystem

• Hardware monitoring through the Nuvoton I/O controller

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Three fan headers

• Two fan sense inputs used to monitor fan activity

•

Fan speed control

Intel® Security and

Manageability

Technologies

• Intel® vPro™ Technology

• Intel® Active Management Technology (Intel® AMT) 8.0

• Intel® Small Business Technology (Intel® SBT)

• Intel® Virtualization Technology (Intel® VT)

• Intel® Virtualization for Directed I/O (Intel® VT-d)

•

Intel

®

Anti-Theft (Intel

®

AT)

Product Description

13

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DQ77MK.

Figure 1. Major Board Components

Intel Desktop Board DQ77MK Technical Product Specification

14

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item/callout

from Figure 1

Description

A PCI Express x4 add-in card connector

B Conventional PCI add-in card connector

C IEEE 1394 a front panel header

D PCI Express x1 add-in card connector

E PCI Express x16 add-in card connector

F Back panel connectors

G 12 V processor core voltage connector (2 x 2 pin)

H LGA1155 processor socket

I Rear chassis fan header

J Processor fan header

K DIMM 3 (Channel A DIMM 0)

L DIMM 1 (Channel A DIMM 1)

M DIMM 4 (Channel B DIMM 0)

N DIMM 2 (Channel B DIMM 1)

O Front chassis fan header

P Low Pin Count (LPC) Debug header

Q Chassis intrusion header

R Main power connector (2 x 12)

S Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header

T Battery

U Piezoelectric speaker

V Intel® Management Engine “M” state LED

W PCI Express Full-/Half-Mini Card slot

X SATA 6.0 Gb/s connector (multiplexed with an mSATA port, routed to the PCI

Express Full-/Half-Mini Card slot) (gray)

Y SATA 3.0 Gb/s connectors through the PCH (black)

Z Alternate front panel power/sleep LED header

AA Front panel connector

BB Standby power LED

CC BIOS Setup configuration jumper block

DD SATA 6.0 Gb/s connectors through the PCH (blue)

EE Front panel USB 3.0 connector (blue)

FF Intel Q77 Express Chipset

GG Front panel USB 2.0 connector

HH Front panel USB 2.0 connector

II Serial port connector

JJ S/PDIF out header

KK Front panel audio connector

LL Internal mono speaker header

Product Description

15

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

Intel Desktop Board DQ77MK Technical Product Specification

16

1.2 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board DQ77MK http://www.intel.com/products/motherboard/index.htm

Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support

Available configurations for Intel

Desktop Board DQ77MK http://ark.intel.com

Supported processors http://processormatch.intel.com

Chipset information http://www.intel.com/products/desktop/chipsets/index.htm

BIOS and driver updates http://downloadcenter.intel.com

Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

025414.htm

Integration information http://www.intel.com/support/go/buildit

1.3 Processor

The board supports 3rd generation Intel Core processor family and 2nd generation Intel

Core processor family processors.

Other processors may be supported in the future. This board supports processors with

a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed

above are only supported when falling within the wattage requirements of Intel

Desktop Board DQ77MK. See the Intel web site listed below for the most up-to-date

list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors

can damage the board, the processor, and the power supply.

NOTE

This board has specific requirements for providing power to the processor. Refer to

Section 2.6.1 on page 64 for information on power supply requirements for this board.

Product Description

17

1.3.1 Graphics Subsystem

The board supports graphics through either the processor Intel HD Graphics or a PCI

Express x16 add-in graphics card.

1.3.1.1 Processor Graphics

The board supports integrated graphics through the Intel® Flexible Display Interface

(Intel® FDI) for processors with Intel HD Graphics.

1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

• 3D Features

 DirectX* 11 (2nd generation Intel Core processor family processors support

CS4.0 only) support

 OpenGL* 3.0 support

 Shader Model 4.0

• Video

 High-Definition content at up to 1080p resolution

 Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video

formats

 Intel® HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick

Sync Video)

Note: Intel Quick Sync is enabled with the appropriate software application

 Blu-ray* S3D via DisplayPort 1.1a

 Dynamic Video Memory Technology (DVMT) 5.0 support

 Support of up to 1.7 GB Video Memory with 4 GB and above system memory

configuration

Intel Desktop Board DQ77MK Technical Product Specification

18

1.3.1.2 PCI Express x16 Graphics

3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x,

and 1.x and 2nd generation Intel Core processor family processors support PCI

Express 2.x and 1.x:

• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of

1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16

interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of

32 GB/s.

• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of

500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16

interface is 8 GB/s in each direction, simultaneously, for a total bandwidth of

16 GB/s.

• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of

250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16

interface is 4 GB/s in each direction, simultaneously, for a total bandwidth of

8 GB/s.

For information about Refer to

PCI Express technology http://www.pcisig.com

Product Description

19

1.4 System Memory

The board has four DIMM sockets and supports the following memory features:

• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the

voltage to support higher performance DDR3 SDRAM DIMMs.

• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)

• Two independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

DIMMs with x16 organization are not supported.

• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 2.1.1 on page 45 for information on the total amount of addressable

memory.

• Minimum recommended total system memory: 1 GB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs

Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core

processor family processors

• XMP version 1.3 performance profile support for memory speeds of 1600 MHz or

lower

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board

should be populated with DIMMs that support the Serial Presence Detect (SPD) data

structure. This allows the BIOS to read the SPD data and program the chipset to

accurately configure memory settings for optimum performance. If non-SPD memory

is installed, the BIOS will attempt to correctly configure the memory settings, but

performance and reliability may be impacted or the DIMMs may not function under the

determined frequency.

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

DIMM

Capacity

Configuration

(Note)

SDRAM

Density

SDRAM Organization

Front-side/Back-side

Number of SDRAM

Devices

1024 MB

SS

1 Gbit

128 M x8/empty

8

2048 MB

DS

1 Gbit

128 M x8/128 M x8

16

2048 MB

SS

2 Gbit

256 M x8/empty

8

4096 MB

DS

2 Gbit

256 M x8/256 M x8

16

4096 MB SS 4 Gbit 512 M x8/empty 8

8192 MB

DS

4 Gbit

512 M x8/512 M x8

16

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to

single-sided memory modules (containing one row of SDRAM).

Intel Desktop Board DQ77MK Technical Product Specification

20

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb

/CS-025414.htm

1.4.1 Memory Configurations

The 3rd generation Intel Core processor family and 2nd generation Intel Core processor

family processors support the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for

real world applications. Dual channel mode is enabled when the installed memory

capacities of both DIMM channels are equal. Technology and device width can vary

from one channel to the other but the installed memory capacity for each channel

must be equal. If different speed DIMMs are used between channels, the slowest

memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel

bandwidth operation for real world applications. This mode is used when only a

single DIMM is installed or the memory capacities are unequal. Technology and

device width can vary from one channel to the other. If different speed DIMMs are

used between channels, the slowest memory timing will be used.

• Flex mode. This mode provides the most flexible performance characteristics.

The bottommost DRAM memory (the memory that is lowest within the system

memory map) is mapped to dual channel operation; the topmost DRAM memory

(the memory that is nearest to the 8 GB address space limit), if any, is mapped to

single channel operation. Flex mode results in multiple zones of dual and single

channel operation across the whole of DRAM memory. To use flex mode, it is

necessary to populate both channels.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Product Description

21

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

NOTE

For best memory performance always install memory in the blue DIMM sockets if

installing only two DIMMs on your board.

Populate DIMM sockets in the order in which they are numbered.

Intel Desktop Board DQ77MK Technical Product Specification

22

1.5 Intel® Q77 Express Chipset

Intel Q77 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and

Direct Media Interface (DMI) interconnect provides interfaces to the processor and the

display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel Q77 Express

Chipset is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel Q77 chipset http://www.intel.com/products/desktop/chipsets/index.htm

Resources used by the chipset Chapter 2

1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and

PCH. This high-speed interface integrates advanced priority-based servicing allowing

for concurrent traffic and true isochronous transfer capabilities.

1.5.2 Display Interfaces

Display is divided between the processor and the PCH. The processor houses the

memory interface, display planes, and pipes while the PCH has transcoder and display

interface or ports.

The PCH receives the display data over Intel FDI and transcodes the data as per the

display technology protocol and sends the data through the display interface.

1.5.2.1 Intel® Flexible Display Interconnect (Intel® FDI)

Intel FDI connects the display engine in the processor with the display interfaces on

the PCH. The display data from the frame buffer is processed in the display engine of

the processor and sent to the PCH over the Intel FDI where it is transcoded as per the

display protocol and driven to the display monitor.

1.5.2.2 Digital Visual Interface (DVI-D)

The DVI-D port supports only digital DVI displays. The maximum supported resolution

is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the DVI 1.0

specification.

1.5.2.3 Digital Visual Interface (DVI-I)

The DVI-I port supports both digital and analog DVI displays. The maximum

supported resolution is 1900 x 1200 (WUXGA). The DVI port is compliant with the

DVI 1.0 specification. DVI analog output can also be converted to VGA using a DVI-

VGA converter.

Depending on the type of add-in card installed in the PCI Express x16 connector, the

DVI port will behave as described in Table 4.

Product Description

23

Table 4. DVI Port Status Conditions

PCI Express x16 Connector Status DVI Digital (DVI-D)

Port Status DVI Analog (DVI-A)

Port Status (Note 1)

No add-in card installed Enabled Enabled

PCI Express x16 add-in card installed Enabled

(Note 2)

Enabled

(Note 2)

Notes:

1. DVI analog output can also be converted to VGA with a DVI-VGA converter.

2. May require BIOS setup menu changes.

1.5.2.4 DisplayPort

DisplayPort is a digital communication interface that utilizes differential signaling to

achieve a high bandwidth bus interface designed to support connections between PCs

and monitors, projectors, and TV displays. DisplayPort is suitable for display

connections between consumer electronics devices such as high definition optical disc

players, set top boxes, and TV displays. DisplayPort output can also be converted to

HDMI using a DisplayPort-HDMI converter. The DisplayPort interface supports the 1.1a

specification.

DisplayPort’s maximum supported display resolution is 2560 x 1600 at 60 Hz refresh

with a 16:10 aspect ratio (WQXGA).

Table 5. DisplayPort Status Conditions

PCI Express x16 Connector Status DisplayPort Status

No add-in card installed Enabled

PCI Express x16 add-in card installed

Enabled (Note)

Note: May require BIOS setup menu changes.

For information about Refer to

DisplayPort technology http://www.displayport.org

1.5.2.5 Integrated Audio Provided by the DisplayPort Interface

The DisplayPort interface from the PCH supports audio. Table 6 shows the specific

audio technologies supported by the PCH.

Table 6. Audio Formats Supported by the DisplayPort Interface

Audio Formats DisplayPort

AC-3 - Dolby* Digital No

Dolby Digital Plus No

DTS-HD* No

LPCM, 192 kHz/24 bit, 8 Channel Yes

Intel Desktop Board DQ77MK Technical Product Specification

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1.5.3 USB

The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers

that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to

480 Mb/s. All ports are high-speed, full-speed, and low-speed capable.

The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host

controller which supports USB 3.0 ports. This controller allows data transfers up to

5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS),

and low-speed (LS) traffic on the bus.

The board supports up to four USB 3.0 ports and ten USB 2.0 ports.

The Intel Q77 Express Chipset provides the USB controller for the 2.0/3.0 ports. The

port arrangement is as follows:

• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)

• Two front panel USB 3.0 ports are implemented through one internal connector

(blue)

• Four USB 2.0 ports implemented with stacked back panel connectors (two black

and two orange high current charging ports)

• Four USB 2.0 front panel ports implemented through two internal headers (black)

• Two USB 2.0 ports are implemented in the PCI Express Full-/Half–Mini Card slot

NOTE

Computer systems that have an unshielded cable attached to a USB port may not

meet FCC Class B requirements, even if no device is attached to the cable. Use a

shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 10, page 48

The location of the front panel USB headers Figure 11, page 49

1.5.4 SATA Interfaces

The board provides six SATA connectors, through the PCH, which support one device

each:

• Two SATA 6.0 Gb/s interfaces through the Intel Q77 Express Chipset with Intel®

Rapid Storage Technology RAID support (blue)

• Two internal SATA 3.0 Gb/s interfaces through Intel Q77 Express Chipset with Intel

Rapid Storage Technology RAID support (black)

• One internal SATA connector (multiplexed with an mSATA port, routed to the PCI

Express Full-/Half-Mini Card slot) (gray)

• One external eSATA 3.0 Gb/s interface (red)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of

6.0 Gb/s for two port and 3.0 Gb/s for four ports. A point-to-point interface is used for

host-to-device connections.

Product Description

25

The PCH supports the Serial ATA Specification, Revision 3.0. The PCH also supports

several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0

Specification, Revision 1.0 (AHCI support is required for some elements).

The underlying SATA functionality is transparent to the operating system. The SATA

controller can operate in both legacy and native modes. In legacy mode, standard IDE

I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI

Conventional bus resource steering is used. Native mode is the preferred mode for

configurations using the Windows* XP, Windows Vista*, and Windows 7 operating

systems.

NOTE

When an mSATA module is plugged into the PCI Express Full-Mini Card slot, SATA port

4 (colored gray) will be disabled automatically.

NOTE

Many SATA drives use new low-voltage power connectors and require adapters or

power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/.

For information about Refer to

The location of the SATA connectors Figure 11, page 49

Intel Desktop Board DQ77MK Technical Product Specification

26

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When

the computer is not plugged into a wall socket, the battery has an estimated life of

three years. When the computer is plugged in, the standby current from the power

supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at

25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be

notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored

in CMOS RAM (for example, the date and time) might not be accurate. Replace the

battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.7 Legacy I/O Controller

The I/O controller provides the following features:

• One serial port

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a programmable wake-up event interface

• Conventional PCI bus power management support

The BIOS Setup program provides configuration options for the I/O controller.

Product Description

27

1.8 Audio Subsystem

The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The

audio subsystem consists of the following:

• Intel Q77 Express Chipset

• Realtek ALC892 audio codec

The audio subsystem has the following features:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to

recognize the device that is connected to an audio port. The back panel audio

jacks are capable of retasking according to the user’s definition, or can be

automatically switched depending on the recognized device type.

• Front panel Intel HD Audio and AC ’97 audio support.

• 3-port analog audio out stack.

• A signal-to-noise (S/N) ratio of 95 dB.

• Windows 7 Ultimate certification.

Table 7 lists the supported functions of the front panel and back panel audio jacks.

Table 7. Audio Jack Support

Audio Jack Micro-

phone

Headphones Line Out

(Front Spks) Line In

(Surround) Mic-In

(Center/Sub)

Front panel – Green Default

Front panel – Pink Default

Back panel – Blue Default

(ctrl panel)

Back panel – Green (ctrl panel) Default

(ctrl panel)

Back panel – Pink Default

(ctrl panel)

1.8.1 Audio Subsystem Software

The latest audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.2, page 16

Intel Desktop Board DQ77MK Technical Product Specification

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1.8.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back panel and the

component side of the board. The component-side audio headers include front panel

audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio

connectors). The available configurable back panel audio connectors are shown in

Figure 4.

Item Description

A Line in/surround

B Line out/front speakers

C Mic in/center/sub

Figure 4. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified

speakers only. Poor audio quality occurs if passive (non-amplified) speakers are

connected to this output.

For information about Refer to

The locations of the front panel audio header and S/PDIF audio header Figure 11, page 49

The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 51

The back panel audio connectors Section 2.2.1, page 48

1.8.2.1 S/PDIF Header

The S/PDIF header allows connections to coaxial or optical dongles for digital audio

output.

1.8.2.2 Internal Mono Speaker Header

The internal mono speaker header allows connection to an internal, low-power speaker

for basic system sound capability. The subsystem is capable of driving a speaker load

of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).

Product Description

29

1.9 LAN Subsystem

The two LAN subsystems consists of the following:

• Intel 82579LM Gigabit Ethernet Controller and Intel 82574L Gigabit Ethernet

Controller (10/100/1000 Mb/s)

• Intel Q77 Express Chipset

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between the PCH and the LAN controller

• Conventional PCI bus power management

 ACPI technology support

 LAN wake capabilities

• ACPI technology support

• LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

1.9.1 Intel® 82579LM Gigabit Ethernet Controller and

Intel® 82574L Gigabit Ethernet Controller

The ethernet controllers support the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

 PCI Express-based interface for active state operation (S0) state

 SMBUS for host and management traffic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

In addition, the Intel 82579LM Gigabit Ethernet Controller supports Intel AMT, which is

a part of Intel’s vPro™ technology. The associated RJ-45 LAN connector has been

colored red for easy identification.

Intel Desktop Board DQ77MK Technical Product Specification

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1.9.2 LAN Subsystem Software

When Intel AMT is not configured, the LAN controllers support features of Intel®

Advanced Network Services (Intel® ANS). Intel ANS is included in the LAN driver

software and contains support for teaming adapters in:

• Adapter Fault Tolerance

• Switch Fault Tolerance

• Adaptive Load Balancing for both transmit and receive

• Static Link Aggregation

• IEEE 802.3ad Dynamic Link Aggregation.

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers http://downloadcenter.intel.com

Intel® Advanced Network Services and adapter teaming http://www.intel.com/support/ne

twork/sb/cs-009747.htm

1.9.3 RJ-45 LAN Connectors with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connectors (shown in Figure 5).

Item Description

A Link LED (Green)

B Data Rate LED (Green/Yellow)

C Link LED (Green)

D Data Rate LED (Green/Yellow)

Figure 5. LAN Connectors LED Locations

Product Description

31

Table 8 describes the LED states when the board is powered up and the LAN

subsystem is operating.

Table 8. LAN Connector LED States

LED LED Color LED State Condition

Link Green Off LAN link is not established.

On LAN link is established.

Blinking LAN activity is occurring.

Data Rate Green/Yellow Off 10 Mb/s data rate is selected.

Green 100 Mb/s data rate is selected.

Yellow 1000 Mb/s data rate is selected.

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired

for Management (WfM) specification. The board has several hardware management

features, including the following:

• Thermal and voltage monitoring

• Chassis intrusion detection

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Nuvoton

NCT6776D device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +3.3 V, 3.3 Vstandby, V_SM, +VCCP, and

PCH VCC

• SMBus interface

1.10.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Utilities or third-party

software.

For information about Refer to

The functions of the fan headers Section 1.12.2.2, page 41

1.10.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is

removed. The security feature uses a mechanical switch on the chassis that attaches

to the chassis intrusion header. When the chassis cover is removed, the mechanical

switch is in the closed position.

For information about Refer to

The location of the chassis intrusion header Figure 11, page 49

Intel Desktop Board DQ77MK Technical Product Specification

32

1.10.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

Item Description

A Thermal diode, located on the processor die

B Rear chassis fan header

C Processor fan header

D Front chassis fan header

E Thermal diode, located on the Intel Q77 PCH

Figure 6. Thermal Sensors and Fan Headers

Product Description

33

1.11 Intel® Security and Manageability

Technologies

Intel® Security and Manageability Technologies provides tools and resources to help

small business owners and IT organizations protect and manage their assets in a

business or institutional environment.

NOTE

Software with security and/or manageability capability is required to take advantage of

Intel platform security and/or management technologies.

1.11.1 Intel® vPro™ Technology

Intel® vPro™ Technology is a collection of platform capabilities that support enhanced

manageability, security, virtualization and power efficiency. The key platform

capabilities include:

• Intel® Turbo Boost Technology for increased performance and power efficiency

• Intel® Hyper-Threading Technology (Intel® HT) for higher performance

• Intel® Active Management Technology (Intel® AMT)

• Intel® Virtualization (Intel® VT)

• Intel® Virtualization for Directed I/O (Intel® VT-d)

• Intel® Trusted Execution Technology (Intel® TXT)

• Intel® Identity Protection Technology (Intel® IPT)

• Intel® Anti-Theft Technology (Intel® AT)

For information about Refer to

Intel vPro Technology http://support.intel.com/support/vpro/

1.11.1.1 Intel® Active Management Technology

When used with third-party management and security applications, Intel Active

Management Technology (Intel AMT) allows business owners and IT organizations to

better discover, heal, and protect their networked computing assets.

Some of the features of Intel AMT include:

• Out-of-band (OOB) system access, to discover assets even while PCs are

powered off

• Remote trouble-shooting and recovery, which allows remote diagnosis and

recovery of systems after OS failures

• Hardware-based agent presence checking that automatically detects and alerts

when critical software agents have been stopped or are missing

• Proactive network defense, which uses filters to block incoming threats while

isolating infected clients before they impact the network

• Remote hardware and software asset tracking, helping to track computer assets

and keep virus protection up-to-date

Intel Desktop Board DQ77MK Technical Product Specification

34

• Keyboard, video and mouse (KVM) remote control, which allows redirection of a

managed system’s video to a remote console which can then interact with it

using the console’s own mouse and keyboard.

NOTE

Intel AMT requires the computer system to have an Intel AMT-enabled chipset,

network hardware and software, as well as connection with a power source, a

corporate network connection, and an Intel AMT-enabled remote management console.

Setup requires additional configuration of the platform.

For information about Refer to

Intel Active Management Technology http://www.intel.com/technology/platform-

technology/intel-amt/index.htm

1.11.1.2 Intel® Virtualization Technology

Intel® Virtualization Technology (Intel® VT) is a hardware-assisted technology that,

when combined with software-based virtualization solutions, provides maximum

system utilization by consolidating multiple environments into a single server or

client.

NOTE

A processor with Intel VT does not guarantee that virtualization will work on your

system. Intel VT requires a computer system with a chipset, BIOS, enabling software

and/or operating system, device drivers, and applications designed for this feature.

For information about Refer to

Intel Virtualization Technology http://www.intel.com/technology/virtualization/tec

hnology.htm

1.11.1.3 Intel® Virtualization Technology for Directed I/O

Intel® Virtualization Technology for Directed I/O (Intel® VT-d) allows addresses in

incoming I/O device memory transactions to be remapped to different host addresses.

This provides Virtual Machine Monitor (VMM) software with:

• Improved reliability and security through device isolation using hardware assisted

remapping

• Improved I/O performance and availability by direct assignment of devices.

For information about Refer to

Intel Virtualization Technology for Directed I/O http://www.intel.com/technology/itj/2006/v10i3/2-io/4-

virtualization-techniques.htm

Product Description

35

1.11.1.4 Intel® Trusted Execution Technology

Intel® Trusted Execution Technology (Intel® TXT) is a hardware security solution that

protects systems against software-based attacks by validating the behavior of key

components at startup against a known good source. It requires that Intel VT be

enabled and the presence of a TPM.

For information about Refer to

Intel Trusted Execution Technology http://www.intel.com/content/www/us/en/architecture-

and-technology/trusted-execution-technology/malware-

reduction-general-technology.html

1.11.1.5 Intel® Identity Protection Technology

Intel® Identity Protection Technology (Intel® IPT) provides a simple way for websites

and enterprises to validate that a user is logging in from a trusted computer. This is

accomplished by using the Intel Manageability Engine embedded in the chipset to

generate a six-digit number that, when coupled with a user name and password, will

generate a One-Time Password (OTP) when visiting Intel IPT-enabled websites. Intel

IPT eliminates the need for the additional token or key fob required previously for

two-factor authentication.

For information about Refer to

Intel Identity Protection Technology http://ipt.intel.com

1.11.1.6 Intel Anti-Theft Technology

Intel® Anti-Theft (Intel® AT) provides local, tamper-resistant defense that works like

a poison pill that disables the computer and access to its data even if the operating

system (OS) is reimaged, a new hard drive is installed, or the computer is

disconnected from the network.

NOTE

No computer system can provide absolute security under all conditions. Intel AT

requires the computer system to have an Intel® AT-enabled chipset, BIOS, firmware

release, software, and an Intel AT-capable Service Provider/ISV application and

service subscription. The detection (triggers), response (actions), and recovery

mechanisms only work after the Intel® AT functionality has been activated and

configured. Certain functionality may not be offered by some ISVs or service

providers and may not be available in all countries. Intel assumes no liability for lost

or stolen data and/or systems or any other damages resulting thereof.

For information about Refer to

Intel Anti-Theft http://antitheft.intel.com/welcome.aspx

Intel Desktop Board DQ77MK Technical Product Specification

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1.11.2 Intel Small Business Technology

Intel® Small Business Technology (Intel® SBT) provides small businesses with security

and productivity capabilities to help keep their PCs up-to-date, protected and running

well. Intel SBT is the firmware component of Intel® Small Business Advantage (Intel®

SBA) and includes this hardware functionality:

• Local Maintenance Timer – Enables applications to “wake-up” the host platform

when it is powered down or in a sleep state.

• Local Software Monitor – Provides a common reporting mechanism to monitor

applications running on the host operating system.

NOTE

Systems configured for use with Intel SBA will not be configurable for Intel AMT, and

vice versa. To change from one usage to the other, the system must first be

unprovisioned back to factory defaults. This may be done by entering BIOS Setup

Configuration Mode.

For information about Refer to

Intel Small Business Advantage http://www.intel.com/go/SBA

Entering BIOS Setup Configuration Mode Section 2.3 on page 61

Product Description

37

1.11.3 Intel® Management Engine (Intel® ME) Software

and Drivers

Intel ME software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining Intel ME software and drivers Section 1.2 on page 16

1.11.3.1 Intel® Management Engine “M” State LED

The board has a blue-colored Intel ME “M” state LED (see Figure 7). The “M” state is

based on Intel ME status, as follows:

• M0 = Intel ME is in full control in S0

• M3 = Intel ME is in full control in S3-S5 for “out of bound” Intel manageability

• Moff = Intel ME is in sleep state after Intel ME timeout has occurred

Table 9 shows expected behavior of the “M” state LED.

Table 9. Intel ME “M” State LED Behavior

Sx/M3 Sx/Moff S0/M0

LED blinks Off On

Figure 7. Location of the Intel ME “M” State LED

Intel Desktop Board DQ77MK Technical Product Specification

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1.12 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:

 Power connector

 Fan headers

 LAN wake capabilities

 Instantly Available PC technology

 Wake from USB

 Power Management Event signal (PME#) wake-up support

 PCI Express WAKE# signal support

 Wake from serial port

 Wake from S5

 +5 V Standby Power Indicator LED

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug

and Play functions of a computer. The use of ACPI with this board requires an

operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power-on/standby

sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events (see Table 12 on page 40)

• Support for a front panel power and sleep mode switch

Table 10 lists the system states based on how long the power switch is pressed,

depending on how ACPI is configured with an ACPI-aware operating system.

Table 10. Effects of Pressing the Power Switch

If the system is in this

state…

…and the power switch is

pressed for

…the system enters this state

Off

(ACPI G2/G5 – Soft off) Less than four seconds Power-on

(ACPI G0 – working state)

On

(ACPI G0 – working state)

Less than four seconds Soft-off/Standby

(ACPI G1 – sleeping state)

On

(ACPI G0 – working state)

More than six seconds Fail safe power-off

(ACPI G2/G5 – Soft off)

Sleep

(ACPI G1 – sleeping state)

Less than four seconds Wake-up

(ACPI G0 – working state)

Sleep

(ACPI G1 – sleeping state) More than six seconds Power-off

(ACPI G2/G5 – Soft off)

Product Description

39

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state

transitions. The operating system puts devices in and out of low-power states based

on user preferences and knowledge of how devices are being used by applications.

Devices that are not being used can be turned off. The operating system uses

information from applications and user settings to put the system as a whole into a

low-power state.

Table 11 lists the power states supported by the board along with the associated

system power targets. See the ACPI specification for a complete description of the

various system and power states.

Table 11. Power States and Targeted System Power

Global States

Sleeping States Processor

States

Device States Targeted System

Power (Note 1)

G0 – working

state S0 – working C0 – working D0 – working

state. Full power > 30 W

G1 – sleeping

state S3 – Suspend to

RAM. Context

saved to RAM.

No power D3 – no power

except for

wake-up logic.

Power < 5 W (Note 2)

G1 – sleeping

state S4 – Suspend to

disk. Context

saved to disk.

No power D3 – no power

except for

wake-up logic.

Power < 5 W (Note 2)

G2/S5 S5 – Soft off.

Context not saved.

Cold boot is

required.

No power D3 – no power

except for

wake-up logic.

Power < 5 W (Note 2)

G3 –

mechanical off

AC power is

disconnected

from the

computer.

No power to the

system. No power D3 – no power for

wake-up logic,

except when

provided by

battery or

external source.

No power to the system.

Service can be performed

safely.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals

powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

Intel Desktop Board DQ77MK Technical Product Specification

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1.12.1.2 Wake-up Devices and Events

Table 12 lists the devices or specific events that can wake the computer from specific

states.

Table 12. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

Power switch S3, S4, S5 (

Note)

RTC alarm S3, S4, S5 (Note)

LAN S3, S4, S5

(Note)

USB S3

PME# signal S3, S4, S5

(Note)

WAKE# S3, S4, S5 (Note)

Serial port S3

Note: S4 implies operating system support only.

NOTE

The use of these wake-up events from an ACPI state requires an operating system

that provides full ACPI support. In addition, software, drivers, and peripherals must

fully support ACPI wake events.

1.12.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake

capabilities and Instantly Available PC technology features are used. Failure to do so

can damage the power supply. The total amount of standby current required depends

on the wake devices supported and manufacturing options.

The board provides several power management hardware features, including:

• Power connector

• Fan headers

• LAN wake capabilities

• Instantly Available PC technology

• Wake from USB

• Power Management Event signal (PME#) wake-up support

• PCI Express WAKE# signal support

• Wake from serial port

• Wake from S5

• +5 V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the

+5 V standby line.

NOTE

The use of Wake from USB from an ACPI state requires an operating system that

provides full ACPI support.

Product Description

41

1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system

control. When an ACPI-enabled system receives the correct command, the power

supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it

was in before power was interrupted (on or off). The computer’s response can be set

using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main power connector Figure 11, page 49

The signal names of the main power connector Table 29, page 57

1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 state

• The fans are off when the board is off or in the S3, S4, or S5 state

• Each fan header is wired to a fan tachometer input of the hardware monitoring and

fan control ASIC

• All fan headers support closed-loop fan control that can adjust the fan speed or

switch the fan on or off as needed

• All fan headers have a +12 V DC connection

• The fan headers are controlled by Pulse Width Modulation

For information about Refer to

The location of the fan headers Figure 11, page 49

The location of the fan headers and sensors for thermal monitoring Figure 6, page 32

1.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable

of providing adequate +5 V standby current. Failure to provide adequate standby

current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network.

The LAN subsystem PCI bus network adapter monitors network traffic at the Media

Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem

asserts a wake-up signal that powers up the computer. Depending on the LAN

implementation, the board supports LAN wake capabilities with ACPI in the following

ways:

• The PCI Express WAKE# signal

• By Ping

• Magic Packet

• The onboard LAN subsystem

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1.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must

be capable of providing adequate +5 V standby current. Failure to provide adequate

standby current when implementing Instantly Available PC technology can damage the

power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-

RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the

power supply is off, and the front panel LED is amber if dual colored, or off if single

colored.) When signaled by a wake-up device or event, the system quickly returns to

its last known wake state. Table 12 on page 40 lists the devices and events that can

wake the computer from the S3 state.

The board supports the PCI Bus Power Management Interface Specification. Add-in

boards that also support this specification can participate in power management and

can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and

PCI Express add-in cards and drivers.

1.12.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes

from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.12.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from

an ACPI S3, S4, or S5 state.

1.12.2.8 Wake from Serial Port

Serial port activity wakes the computer from an ACPI S3 state.

1.12.2.9 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake

from an ACPI S5 state.

Product Description

43

1.12.2.10 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the

computer appears to be off. Figure 8 shows the location of the standby power LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit,

disconnect the power cord before installing or removing any devices connected to the

board. Failure to do so could damage the board and any attached devices.

Figure 8. Location of the Standby Power LED

Intel Desktop Board DQ77MK Technical Product Specification

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45

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 32 GB of addressable system memory. Typically the address space

that is allocated for Conventional PCI bus add-in cards, PCI Express configuration

space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM

(total system memory). On a system that has 32 GB of system memory installed, it is

not possible to use all of the installed memory due to system address space being

allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (96 Mb)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• PCI Express configuration space (256 MB)

• PCH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI

Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the

memory mapped I/O logical address space. The board remaps physical memory from

the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical

address range located just above the 4 GB boundary. Figure 9 shows a schematic of

the system memory map. All installed system memory can be used when there is no

overlap of system addresses.

Intel Desktop Board DQ77MK Technical Product Specification

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Figure 9. Detailed System Memory Address Map

Technical Reference

47

2.1.2 Memory Map

Table 13 lists the system memory map.

Table 13. System Memory Map

Address Range

(decimal) Address Range

(hex) Size Description

1024 K - 33550336 K 100000 – 7FFC00000 32764 MB Extended memory

960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS

896 K - 960 K E0000 - EFFFF 64 KB Reserved

800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS

memory (open to the PCI

Conventional bus). Dependent on

video adapter used.

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS

639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

memory manager software)

512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory

0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel

and front panel USB, as well as IEEE 1394a.

The other internal connectors and headers are not overcurrent protected and should

connect only to devices inside the computer’s chassis, such as fans and internal

peripherals. Do not use these connectors or headers to power devices external to the

computer’s chassis. A fault in the load presented by the external devices could cause

damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB or 1394a header single wire connectors may

eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into

these groups:

• Back panel I/O connectors

• Component-side connectors and headers (see page 49)

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2.2.1 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

Item Description

A USB 2.0 high current charging ports

B eSATA connector

C IEEE 1394a connector

D LAN port

E USB 2.0 ports

F DisplayPort connector

G DVI-I connector

H DVI-D connector

I LAN port

J USB 3.0 ports

K Line in/surround

L Line out/front speakers

M Mic-in/center/subwoofer

Figure 10. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified

speakers only. Poor audio quality occurs if passive (non-amplified) speakers are

connected to this output.

Technical Reference

49

2.2.2 Component-side Connectors and Headers

Figure 11 shows the locations of the component-side connectors and headers.

Figure 11. Component-side Connectors and Headers

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Table 14 lists the component-side connectors and headers identified in Figure 11.

Table 14. Component-side Connectors and Headers Shown in Figure 11

Item/callout f

rom Figure 11

Description

A PCI Express x4 add-in card connector

B Conventional PCI add-in card connector

C IEEE 1394a front panel connector

D PCI Express x1 add-in card connector

E PCI Express x16 add-in card connector

F 12 V processor core voltage connector (2 x 2 pin)

G Rear chassis fan header

H Processor fan header

I Front chassis fan header

J LPC Debug header

K Chassis intrusion header

L Main power connector (2 x 12)

M Intel MEBX reset header

N PCI Express Full-/Half-Mini Card slot

O SATA 6.0 Gb/s connector (multiplexed with an mSATA port, routed to the PCI

Express Full-/Half-Mini Card slot) (gray)

P SATA 3.0 Gb/s connectors through the PCH (black)

Q Alternate front panel power/sleep LED header

R Front panel connector

S SATA 6.0 Gb/s connectors through the PCH (blue)

T Front panel USB 3.0 connector (blue)

U Front panel USB 2.0 connector

V Front panel USB 2.0 connector

W Serial port connector

X S/PDIF out header

Y Front panel audio connector

Z Internal mono speaker header

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51

2.2.2.1 Signal Tables for the Connectors and Headers

Table 15. Serial Port Connector

Pin Signal Name Pin Signal Name

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)

3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)

5 Ground 6 DSR (Data Set Ready)

7 RTS (Request To Send) 8 CTS (Clear To Send)

9 RI (Ring Indicator) 10 Key (no pin)

Table 16. Front Panel Audio Header for Intel HD Audio

Pin Signal Name Pin Signal Name

1 [Port 1] Left channel 2 Ground

3 [Port 1] Right channel 4 PRESENCE# (Dongle present)

5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN

7 SENSE_SEND (Jack detection) 8 Key (no pin)

9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN

Table 17. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Pin Signal Name

1 MIC 2 AUD_GND

3 MIC_BIAS 4 AUD_GND

5 FP_OUT_R 6 FP_RETURN_R

7 AUD_5V 8 KEY (no pin)

9 FP_OUT_L 10 FP_RETURN_L

Table 18. Front Panel USB 2.0 Connectors

Pin Signal Name Pin Signal Name

1 +5 V DC 2 +5 V DC

3 D- 4 D-

5 D+ 6 D+

7 Ground 8 Ground

9 KEY (no pin) 10 No Connect

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Table 19. Front Panel USB 3.0 Connector

Pin Signal Name Description

1 Vbus Power

2 IntA_P1_SSRX− USB3 ICC Port1 SuperSpeed Rx−

3 IntA_P1_SSRX+ USB3 ICC Port1 SuperSpeed Rx+

4 GND Ground

5 IntA_P1_SSTX− USB3 ICC Port1 SuperSpeed Tx−

6 IntA_P1_SSTX+ USB3 ICC Port1 SuperSpeed Tx+

7 GND Ground

8 IntA_P1_D− USB3 ICC Port1 D− (USB2 Signal D−)

9 IntA_P1_D+ USB3 ICC Port1 D+ (USB2 Signal D+)

10 ID Over Current Protection

11 IntA_P2_D+ USB3 ICC Port2 D+ (USB2 Signal D+)

12 IntA_P2_D− USB3 ICC Port2 D− (USB2 Signal D−)

13 GND Ground

14 IntA_P2_SSTX+ USB3 ICC Port2 SuperSpeed Tx+

15 IntA_P2_SSTX− USB3 ICC Port2 SuperSpeed Tx−

16 GND Ground

17 IntA_P2_SSRX+ USB3 ICC Port2 SuperSpeed Rx+

18 IntA_P2_SSRX− USB3 ICC Port2 SuperSpeed Rx+

19 Vbus Power

20 Key No pin

Table 20. IEEE 1394a Connector

Pin Signal Name Pin Signal Name

1 Data A (positive) 2 Data A (negative)

3 Ground 4 Ground

5 Data B (positive) 6 Data B (negative)

7 +12 V DC 8 +12 V DC

9 Key (no pin) 10 Ground

Table 21. Internal Mono Speaker Header

Pin Signal Name

1 −

2 +

Technical Reference

53

Table 22. PCI Express Full-/Half-Mini Card Connector

Pin Signal Name Additional Signal Name

1 WAKE#

2 +3.3 V aux

3 Reserved

4 GND

5 Reserved

6 1.5 V

7 CLKREQ#

8 Reserved

9 GND

10 Reserved

11 REFCLK-

12 Reserved

13 REFCLK+

14 Reserved

15 GND

16 Reserved

17 Reserved

18 GND

19 Reserved

20 Reserved

21 GND

22 PERST#

23 PERn0

24 +3.3 V aux

25 PERp0

26 GND

27 GND

28 +1.5 V

29 GND

30 SMB_CLK

31 PETn0

32 SMB_DATA

33 PETp0

34 GND

35 GND

36 USB_D-

37 GND (mSATA) GND

38 USB_D+

continued

Intel Desktop Board DQ77MK Technical Product Specification

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Table 22. PCI Express Full-/Half-Mini Card Connector (continued)

Pin Signal Name Additional Signal Name

39 +3.3 V aux (mSATA) 3.3 V

40 GND

41 +3.3 V aux (mSATA) 3.3 V

42 LED_WWAN#

43 Reserved NC (mSATA indicator)

44 LED_WLAN#

45 Reserved

(mSATA) Vendor;

(Intel AMT) C-Link_CLK*

46 LED_WPAN#

47 Reserved

(mSATA) Vendor

(Intel AMT) C-Link_DAT*

48 +1.5V

49 Reserved

(mSATA) DA/DSS

(Intel AMT) C-Link_RST*

50 GND

51 Reserved (mSATA) Presence Detection

52 +3.3 V aux

NOTE

The Intel AMT C-Link signals are routed to the PCIe full-/half-mini card connector

to support Intel AMT Wake-on-LAN for wireless cards.

Table 23. SATA Connectors

Pin Signal Name

1 Ground

2 TXP

3 TXN

4 Ground

5 RXN

6 RXP

7 Ground

Technical Reference

55

Table 24. S/PDIF Header

Pin Signal Name

1 Ground

2 S/PDIF out

3 Key (no pin)

4 +5 V DC

Table 25. Chassis Intrusion Header

Pin Signal Name

1 Intruder#

2 Ground

Table 26. Processor, Front, and Rear Chassis

(4-Pin) Fan Headers

Pin Signal Name

1 Ground (Note)

2 +12 V

3 FAN_TACH

4 FAN_CONTROL

Note: These fan headers use Pulse Width Modulation control for fan speed.

Table 27. LPC Debug Header

Pin Signal Name Pin Signal Name

1 CK_33M_DEBUG 2 GND

3 PLTRST# 4 LFRAME#

5 LAD0 6 LAD1

7 LAD2 8 LAD3

9 GND 10 GND

11 +3.3 V 12 +3.3 V

13 Key (no pin) 14 +3.3 V

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2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• One PCI Express x16 (3.0/2.x/1.x)

• One PCI Express x4 (2.x/1.x)

• One PCI Express x1 (2.x/1.x)

• One Conventional PCI (rev 2.3)

Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connector is bus master capable.

• SMBus signals are routed to the Conventional PCI bus connector. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on

the desktop board. The specific SMBus signals are as follows:

 The SMBus clock line is connected to pin A40.

 The SMBus data line is connected to pin A41.

NOTE

PCI Express 3.0 is only supported by 3rd generation Intel Core processor family

processors.

Technical Reference

57

2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10

connectors previously used on Intel Desktop boards. The board supports the use

of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When

using a power supply with a 2 x 10 main power cable, attach that cable to the main

power connector, leaving pins 11, 12, 23, and 24 unconnected.

• Processor core power – a 2 x 2 connector. This connector provides power

directly to the processor voltage regulator and must always be used. Failure to do

so will prevent the board from booting.

Table 28. Processor Core Power Connector

Pin Signal Name Pin Signal Name

1 Ground 2 Ground

3 +12 V 4 +12 V

Table 29. Main Power Connector

Pin Signal Name Pin Signal Name

1 +3.3 V 13 +3.3 V

2 +3.3 V 14 -12 V

3 Ground 15 Ground

4 +5 V 16 PS-ON# (power supply remote on/off)

5 Ground 17 Ground

6 +5 V 18 Ground

7 Ground 19 Ground

8 PWRGD (Power Good) 20 No connect

9 +5 V (Standby) 21 +5 V

10 +12 V 22 +5 V

11 +12 V (Note) 23 +5 V (Note)

12 2 x 12 connector detect (Note) 24 Ground (Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

For information about Refer to

Power supply considerations Section 2.6.1 on page 64

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2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 30 lists the signal

names of the front panel header. Figure 12 is a connection diagram for the front panel

header.

Table 30. Front Panel Header

Pin Signal Name Description Pin Signal Name Description

1 HDD_POWER_LED Pull-up resistor

(750 Ω) to +5V 2 POWER_LED_MAIN [Out] Front panel LED

(main color)

3 HDD_LED# [Out] Hard disk

activity LED 4 POWER_LED_ALT [Out] Front panel LED

(alt color)

5 GROUND Ground 6 POWER_SWITCH# [In] Power switch

7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground

9 +5V_DC Power 10 Key No pin

Figure 12. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is

being read from or written to a hard drive. Proper LED function requires a SATA hard

drive or optical drive connected to an onboard SATA connector.

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type

switch that is normally open. When the switch is closed, the board resets and runs the

POST.

Technical Reference

59

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 31 shows the

possible states for a one-color LED. Table 32 shows the possible states for a two-color

LED.

Table 31. States for a One-Color Power LED

LED State Description

Off Power off/sleeping

Steady Green Running

Table 32. States for a Two-Color Power LED

LED State Description

Off Power off

Steady Green Running

Steady Yellow Sleeping

NOTE

The colors listed in Table 31 and Table 32 are suggested colors only. Actual LED colors

are chassis-specific.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The

switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power

supply to switch on or off. (The time requirement is due to internal debounce circuitry

on the board.) At least two seconds must pass before the power supply will recognize

another on/off signal.

2.2.2.5 Alternate Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel

header.

Table 33. Alternate Front Panel Power/Sleep LED Header

Pin Signal Name Description

1 POWER_LED_MAIN [Out] Front panel LED (main color)

2 Key (no pin)

3 POWER_LED_ALT [Out] Front panel LED (alt color)

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2.2.2.6 Front Panel USB 2.0 Connectors

Figure 13 is a connection diagram for the front panel USB 2.0 connectors.

NOTE

• The +5 V DC power on the USB connectors is fused.

• Use only a front panel USB connector that conforms to the USB 2.0 specification for

high-speed USB devices.

Figure 13. Connection Diagram for Front Panel USB 2.0 Connectors

Technical Reference

61

2.3 Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the

power cord from the computer before changing a jumper setting. Otherwise, the

board could be damaged.

Figure 14 shows the location of the jumper block. The 3-pin jumper block determines

the BIOS Setup program’s mode. Table 34 describes the jumper settings for the three

modes: normal, configure, and recovery. When the jumper is set to configure mode

and the computer is powered-up, the BIOS compares the processor version and the

microcode version in the BIOS and reports if the two match.

Figure 14. Location of the Jumper Block

Table 34. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration

Normal 1-2 The BIOS uses current configuration information and passwords

for booting.

Configure 2-3 After the POST runs, Setup runs automatically. The

maintenance menu is displayed.

Note that this Configure mode is the only way to clear the

BIOS/CMOS settings. Press F9 (restore defaults) while in

Configure mode to restore the BIOS/CMOS settings to their

default values.

Recovery None The BIOS attempts to recover the BIOS configuration. A

recovery CD or flash drive is required.

Intel Desktop Board DQ77MK Technical Product Specification

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2.4 Intel® Management Engine BIOS Extension

(Intel® MEBX) Reset Header

The Intel® MEBX reset header (see Figure 15) allows you to reset the Intel ME

configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper

(not supplied) will accomplish the following:

• Return all Intel ME parameters to their default values.

• Reset the Intel MEBX password to the default value (admin).

CAUTION

Always turn off the power and unplug the power cord from the computer before

installing an MEBX reset jumper. The jumper must be removed before reapplying

power. The system must be allowed to reach end of POST before reset is complete.

Otherwise, the board could be damaged.

NOTE

After using the MEBX Reset, a “CMOS battery failure” warning will occur during the

next POST. This is expected and does not indicate a component failure.

Figure 15. Intel MEBX Reset Header

Table 35. Intel MEBX Reset Header Signals

Pin Function

1 PCH_RTCRST_PULLUP

2 Ground

3 No connection

Technical Reference

63

2.5 Mechanical Considerations

2.5.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the

mechanical form factor for the board. Dimensions are given in inches [millimeters].

The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters]. Location of the I/O connectors and mounting holes are in

compliance with the ATX specification.

Figure 16. Board Dimensions

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64

2.6 Electrical Considerations

2.6.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate

+5 V standby current. Failure to do so can damage the power supply. The total

amount of standby current required depends on the wake devices supported and

manufacturing options.

Additional power required will depend on configurations chosen by the integrator.

The power supply must comply with the indicated parameters of the ATX form factor

specification.

• The potential relation between 3.3 V DC and +5 V DC power rails

• The current capability of the +5 VSB line

• All timing parameters

• All voltage tolerances

For example, for a high power system consisting of a supported 95 W processor (see

Section 1.3 on page 16 for a list of supported processors), 4 GB DDR3 RAM, one high

end video card, one hard disk drive, one optical drive, and all board peripherals

enabled, the minimum recommended power supply is 460 W. Table 36 lists possible

recommended power supply current rail values.

Table 36. Recommended Power Supply Current Values (High Power)

Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB

Current 22 A 20 A 20 A 20 A 0.3 A 2.5 A

For example, for a low power system consisting of a supported 45 W processor (see

Section 1.3 on page 16 for a list of supported processors), 2 GB DDR3 RAM, integrated

graphics, one SSD, one optical drive, and no extra onboard peripherals enabled, the

minimum recommended power supply is a 320 W. Table 37 lists possible

recommended power supply current rail values. Note: If the correct power supply and

system configuration is used, a smaller power supply will work.

Table 37. Recommended Power Supply Current Values (Low Power)

Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB

Current 20 A 20 A 15 A 15 A 0.3 A 1.5 A

For information about Refer to

Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb

/CS-026472.htm

Technical Reference

65

2.6.2 Power Supervisor

This board supports a version of the Power Supervisor feature which adds protection to

the 5 VSB power rail by limiting potential electrical overstress events to a non-

destructive level.

2.6.3 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan

header. Connecting the processor fan to a chassis fan header may result in onboard

component damage that will halt fan operation.

Table 38 lists the current capability of the fan headers.

Table 38. Fan Header Current Capability

Fan Header Maximum Available Current

Processor fan 2.0 A

Front chassis fan 1.5 A

Rear chassis fan 1.5 A

2.6.4 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from

the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board

(all three expansion slots filled) must not exceed the system’s power supply +5 V

maximum current or 14 A in total.

2.7 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan

inlet is a requirement. Use a processor heat sink that provides omni-directional airflow

to maintain required airflow across the processor voltage regulator area.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the

processor and/or voltage regulator or, in some instances, damage to the board. For a

list of chassis that have been tested with Intel desktop boards please refer to the

following website:

http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design

remains solely with the reader. Intel makes no warranties or representations that

merely following the instructions presented in this document will result in a system

with adequate thermal performance.

Intel Desktop Board DQ77MK Technical Product Specification

66

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating

temperature. Failure to do so could cause components to exceed their maximum case

temperature and malfunction. For information about the maximum operating

temperature, see the environmental specifications in Section 2.9.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit.

Failure to do so may result in damage to the voltage regulator circuit. The processor

voltage regulator area (shown in Figure 17) can reach a temperature of up to 120 oC in

an open chassis.

Figure 17 shows the locations of the localized high temperature zones.

Item Description

A Processor voltage regulator area

B Processor

C Intel Q77 Express Chipset

Figure 17. Localized High Temperature Zones

Technical Reference

67

Table 39 provides maximum case temperatures for the components that are sensitive

to thermal changes. The operating temperature, current load, or operating frequency

could affect case temperatures. Maximum case temperatures are important when

considering proper airflow to cool the board.

Table 39. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel Q77 Express Chipset 104 oC

To ensure functionality and reliability, the component is specified for proper operation

when Case Temperature is maintained at or below the maximum temperature listed in

Table 39. This is a requirement for sustained power dissipation equal to Thermal

Design Power (TDP is specified as the maximum sustainable power to be dissipated by

the components). When the component is dissipating less than TDP, the case

temperature should be below the Maximum Case Temperature. The surface

temperature at the geometric center of the component corresponds to Case

Temperature.

It is important to note that the temperature measurement in the system BIOS is a

value reported by embedded thermal sensors in the components and does not directly

correspond to the Maximum Case Temperature. The upper operating limit when

monitoring this thermal sensor is Tcontrol.

Table 40. Tcontrol Values for Components

Component Tcontrol

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel Q77 Express Chipset 104 oC

For information about

Refer to

Processor datasheets and specification updates Section 1.2, page 16

Intel Q77 Express Chipset http://www.intel.com/products/desktop/

chipsets/

Intel Desktop Board DQ77MK Technical Product Specification

68

2.8 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using parts count

method. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3

50% electrical stress, 50 ºC ambient. The MTBF prediction is used to estimate repair

rates and spare parts requirements. The MTBF data is calculated from predicted data

at 50 ºC. The MTBF for the Intel Desktop Board DQ77MK is 211,190 hours.

2.9 Environmental

Table 41 lists the environmental specifications for the board.

Table 41. Environmental Specifications

Parameter Specification

Temperature

Non-Operating -20 °C to +70 °C

Operating 0 °C to +55 °C

Shock

Unpackaged 50 g trapezoidal waveform

Velocity change of 170 inches/s²

Packaged Half sine 2 millisecond

Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)

<20 36 167

21-40 30 152

41-80 24 136

81-100 18 118

Vibration

Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

69

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash

Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash

contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN

EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision

code. The initial production BIOSs are identified as MKQ7710H.86A.

When the BIOS Setup configuration jumper is set to configure mode and the computer

is powered-up, the BIOS compares the CPU version and the microcode version in the

BIOS and reports if the two match.

The BIOS Setup program can be used to view and change the BIOS settings for the

computer. The BIOS Setup program is accessed by pressing the <F2> key after the

Power-On Self-Test (POST) memory test begins and before the operating system boot

begins. The menu bar is shown below.

Maintenance Main Configuration Performance Security Power Boot Exit

NOTE

The maintenance menu is displayed only when the board is in configure mode.

Section 2.3 on page 61 shows how to put the board in configure mode.

Intel Desktop Board DQ77MK Technical Product Specification

70

Table 42 lists the BIOS Setup program menu features.

Table 42. BIOS Setup Program Menu Bar

Maintenance

Main Configura-

tion

Performance

Security

Power

Boot

Exit

Clears

passwords and

displays

processor

information

Displays

processor

and memory

configuration

Configures

advanced

features

available

through the

chipset

Configures

Memory, Bus

and Processor

overrides

Sets

passwords

and

security

features

Configures

power

management

features and

power supply

controls

Selects

boot

options

Saves or

discards

changes to

Setup

program

options

Table 43 lists the function keys available for menu screens.

Table 43. BIOS Setup Program Function Keys

BIOS Setup Program

Function Key

Description

<←> or <→> Selects a different menu screen (Moves the cursor left or right)

<↑> or <↓> Selects an item (Moves the cursor up or down)

<Tab> Selects a field (Not implemented)

<Enter> Executes command or selects the submenu

<F9> Load the default configuration values for the current menu

<F10> Save the current values and exits the BIOS Setup program

<Esc> Exits the menu

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 96 Mbit

(12288 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI Express Autoconfiguration

The BIOS can automatically configure PCI Express devices. PCI Express devices may

be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI

Express cards without having to configure the system. When a user turns on the

system after adding a PCI Express card, the BIOS automatically configures interrupts,

the I/O space, and other system resources. Any interrupts set to Available in Setup

are considered to be available for use by the add-in card.

Overview of BIOS Features

71

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing

computers in a managed network.

The main component of SMBIOS is the Management Information Format (MIF)

database, which contains information about the computing system and its

components. Using SMBIOS, a system administrator can obtain the system types,

capabilities, operational status, and installation dates for system components. The

MIF database defines the data and provides the method for accessing this information.

The BIOS enables applications such as third-party management software to use

SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the

SMBIOS information. The BIOS supports an SMBIOS table interface for such operating

systems. Using this support, an SMBIOS service-level application running on a

non-Plug and Play operating system can obtain the SMBIOS information. Additional

board information can be found in the BIOS under the Additional Information header

under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating

system’s USB drivers are not yet available. Legacy USB support is used to access the

BIOS Setup program, and to install an operating system that supports USB. By

default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to

enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB

keyboards and mice are recognized and may be used to configure the operating

system. (Keyboards and mice are not recognized during this period if Legacy USB

support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB

devices are recognized by the operating system, and Legacy USB support from the

BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel® Integrator

Toolkit.

Intel Desktop Board DQ77MK Technical Product Specification

72

To install an operating system that supports USB, verify that Legacy USB support in

the BIOS Setup program is set to Enabled and follow the operating system’s

installation instructions.

3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on

the Intel World Wide Web site:

• Intel® Express BIOS Update utility, which enables automated updating while in the

Windows environment. Using this utility, the BIOS can be updated from a file on a

hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from

the file location on the Web.

• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this

utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash

drive or a USB hard drive), or a CD-ROM.

Both utilities verify that the updated BIOS matches the target system to prevent

accidentally installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS

update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb

/CS-022312.htm.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the

Intel web site for support.

Overview of BIOS Features

73

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can

be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is

available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom splash screen, it will share space with the Intel branded logo.

For information about Refer to

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/

Additional Intel® software tools http://developer.intel.com/design/motherbd/software.htm

3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption

occurs, the BIOS could be damaged. Table 44 lists the drives and media types that

can and cannot be used for BIOS recovery. The BIOS recovery media does not need

to be made bootable.

Table 44. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?

CD-ROM drive connected to the SATA interface Yes

USB removable drive (a USB Flash Drive, for example) Yes

USB diskette drive (with a 1.44 MB diskette) No

USB hard disk drive No

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/

cs-023360.htm

Intel Desktop Board DQ77MK Technical Product Specification

74

3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical

drive, removable drive, or the network. The default setting is for the optical drive to

be the first boot device, the hard drive second, removable drive third, and the network

fourth.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable

CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the

optical drive is listed as a boot device. Boot devices are defined in priority order.

Accordingly, if there is not a bootable CD in the optical drive, the system will attempt

to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the

onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To

use this key during POST, the User Access Level in the BIOS Setup program's Security

menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing

the POST, the operating system loader is invoked even if the following devices are not

present:

• Video adapter

• Keyboard

• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This

menu displays the list of available boot devices. Table 45 lists the boot device menu

options.

Table 45. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> Selects a default boot device

<Enter> Exits the menu, and boots from the selected device

<Esc> Exits the menu and boots according to the boot priority

defined through BIOS setup

Overview of BIOS Features

75

3.9 Adjusting Boot Speed

These factors affect system boot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

• Enabling the Fast Boot feature

3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:

• Choose a hard drive with parameters such as “power-up to data ready” in less than

eight seconds that minimizes hard drive startup delays.

• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST

execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen

repaints, or mode changes in POST. These features may add time to the boot

process.

• Try different monitors. Some monitors initialize and communicate with the BIOS

more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot menu, enable the settings for Fast Boot. This option will allow BIOS to

skip through various stages of POST and boot quickly to the last detected boot

device.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the

POST does not first seek a diskette drive, which saves about one second from the

POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be

used. This can reduce up to four seconds of option ROM boot time.

NOTE

It is possible to optimize the boot process to the point where the system boots so

quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.

Monitors and hard disk drives with minimum initialization times can also contribute to

a boot time that might be so fast that necessary logo screens and POST messages

cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If

this condition should occur, it is possible to introduce a programmable delay ranging

from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay

feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup

program).

Intel Desktop Board DQ77MK Technical Product Specification

76

3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program

and who can boot the computer. A supervisor password and a user password can be

set for the BIOS Setup program and for booting the computer, with the following

restrictions:

• The supervisor password gives unrestricted access to view and change all the

Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the

BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password

prompt of the BIOS Setup program allows the user restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the

supervisor password or the user password to access Setup. Users have access to

Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password

prompt will be displayed before the computer is booted. If only the supervisor

password is set, the computer boots without asking for a password. If both

passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user

passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to

16 characters in length.

Table 46 shows the effects of setting the supervisor password and user password.

This table is for reference only and is not displayed on the screen.

Table 46. Supervisor and User Password Functions

Password

Set

Supervisor

Mode

User Mode

Setup Options

Password

to Enter

Setup

Password

During

Boot

Neither Can change all

options (Note) Can change all

options (Note) None None None

Supervisor

only Can change all

options Can change a

limited

number of

options

Supervisor Password Supervisor None

User only N/A Can change all

options Enter Password

Clear User Password User User

Supervisor

and user set Can change all

options Can change a

limited

number of

options

Supervisor Password

Enter Password Supervisor or

user Supervisor or

user

Note: If no password is set, any user can change all Setup options.

Overview of BIOS Features

77

NOTE

The BIOS complies with NIST Special Publication 800-147 BIOS Protection Guidelines /

Recommendations of the National Institute of Standards and Technology. Refer to

http://csrc.nist.gov/publications/nistpubs/800-147/NIST-SP800-147-April2011.pdf for

more information.

3.11 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements

when using 3rd generation Intel Core processor family and 2nd generation Intel Core

processor family processors in an LGA1155 socket.

• Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted

down)

• Memory multiplier adjustment

• Memory voltage adjustment

• Graphics multiplier adjustment

Intel Desktop Board DQ77MK Technical Product Specification

78

79

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted speaker provides audible error code (beep code) information

during POST.

For information about Refer to

The location of the onboard speaker Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s

speaker to beep an error message describing the problem (see Table 47).

Table 47. BIOS Beep Codes

Type Pattern Frequency

F2 Setup/F10 Boot Menu

Prompt One 0.5 second beep when BIOS is ready to

accept keyboard input 932 Hz

BIOS update in progress None

Video error On-off (1.0 second each) two times, then

2.5-second pause (off), entire pattern repeats

(beeps and pause) once and the BIOS will

continue to boot.

932 Hz

When no VGA option ROM is

found.

Memory error On-off (1.0 second each) three times, then

2.5-second pause (off), entire pattern repeats

(beeps and pause) until the system is powered

off.

932 Hz

Thermal trip warning Alternate high and low beeps (1.0 second each)

for eight beeps, followed by system shut down. High beep 2000 Hz

Low beep 1500 Hz

Intel Desktop Board DQ77MK Technical Product Specification

80

4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front

panel power LED to blink an error message describing the problem (see Table 48).

Table 48. Front-panel Power LED Blink Codes

Type Pattern Note

F2 Setup/F10 Boot Menu

Prompt None

BIOS update in progress Off when the update begins, then on for

0.5 seconds, then off for 0.5 seconds. The

pattern repeats until the BIOS update is

complete.

Video error On-off (1.0 second each) two times, then

2.5-second pause (off), entire pattern repeats

(blink and pause) until the system is powered

off.

When no VGA option ROM is

found.

Memory error On-off (1.0 second each) three times, then

2.5-second pause (off), entire pattern repeats

(blinks and pause) until the system is powered

off.

Thermal trip warning Each beep will be accompanied by the following

blink pattern: .25 seconds on, .25 seconds off,

.25 seconds on, .25 seconds off. This will result

in a total of 16 blinks.

4.4 BIOS Error Messages

Table 49 lists the error messages and provides a brief description of each.

Table 49. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Replace the battery soon.

CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device Available System did not find a device to boot.

Error Messages and Beep Codes

81

4.5 Port 80h Power On Self Test (POST) Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O

port 80h. If the POST fails, execution stops and the last POST code generated is left

at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes on a medium such as a seven-segment display, requires a

POST card that can interface with the Low Pin Count (LPC) Debug header or a POST

card that can be installed in one of the Conventional PCI connectors. Refer to the

location of the LPC Debug header in Figure 1.

The following tables provide information about the POST codes generated by the BIOS:

• Table 50 lists the Port 80h POST code ranges

• Table 51 lists the Port 80h POST codes themselves

• Table 52 lists the Port 80h POST sequence

NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 50. Port 80h POST Code Ranges

Range Subsystem

0x00 – 0x05 Entering SX states S0 to S5.

0x10, 0x20, 0x30,

0x40, 0x50 Resuming from SX states. 0x10 – S1, 0x20 – S2, 0x30 – S3, etc.

0x08 – 0x0F Security (SEC) phase

0x11 – 0x1F PEI phase pre MRC execution

0x21 – 0x29 MRC Memory detection

0x2A – 0x2F PEI phase post MRC execution

0x31 – 0x35 Recovery

0x36 – 0x3F Platform DXE driver

0x41 – 0x4F CPU Initialization (PEI, DXE, SMM)

0x50 – 0x5F I/O Buses: PCI, USB, ISA, ATA etc. 0x5F is an unrecoverable error. Start with PCI.

0x60 – 0x6F BDS

0x70 – 0x7F Output Devices: All output consoles.

0x80 – 0x8F For future use

0x90 – 0x9F Input devices: Keyboard/Mouse.

0xA0 – 0xAF For future use

0xB0 – 0xBF Boot Devices: Includes fixed media and removable media. Not that critical since

consoles should be up at this point.

0xC0 – 0xCF For future use

0xD0 – 0xDF For future use

0xF0 – 0xFF

Intel Desktop Board DQ77MK Technical Product Specification

82

Table 51. Port 80h POST Codes

Port 80 Code Progress Code Enumeration

ACPI S States

0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state

0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5

Security Phase (SEC)

0x08 Starting BIOS execution after CPU BIST

0x09 SPI prefetching and caching

0x0A Load BSP microcode

0x0B Load APs microcodes

0x0C Platform program baseaddresses

0x0D Wake Up All APs

0x0E Initialize NEM

0x0F Pass entry point of the PEI core

PEI before MRC

PEI Platform driver

0x11 Set bootmode, GPIO init

0x12 Early chipset register programming including graphics init

0x13 Basic PCH init, discrete device init (1394, SATA)

0x14 LAN init

0x15 Exit early platform init driver

PEI SMBUS

0x16 SMBUSriver init

0x17 Entry to SMBUS execute read/write

0x18 Exit SMBUS execute read/write

PEI CK505 Clock Programming

0x19 Entry to CK505 programming

0x1A Exit CK505 programming

PEI Over-Clock Programming

0x1B Entry to entry to PEI over-clock programming

0x1C Exit PEI over-clock programming

Memory

0x21 MRC entry point

0x23 Reading SPD from memory DIMMs

0x24 Detecting presence of memory DIMMs

0x27 Configuring memory

0x28 Testing memory

0x29 Exit MRC driver

continued

Error Messages and Beep Codes

83

Table 51. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration

PEI after MRC

0x2A Start to Program MTRR Settings

0x2B Done Programming MTRR Settings

PEIMs/Recovery

0x31 Crisis Recovery has initiated

0x33 Loading recovery capsule

0x34 Start recovery capsule/ valid capsule is found

CPU Initialization

CPU PEI Phase

0x41 Begin CPU PEI Init

0x42 XMM instruction enabling

0x43 End CPU PEI Init

CPU PEI SMM Phase

0x44 Begin CPU SMM Init smm relocate bases

0x45 Smm relocate bases for APs

0x46 End CPU SMM Init

CPU DXE Phase

0x47 CPU DXE Phase begin

0x48 Refresh memory space attributes according to MTRRs

0x49 Load the microcode if needed

0x4A Initialize strings to HII database

0x4B Initialize MP Support

0x4C CPU DXE Phase End

CPU DXE SMM Phase

0x4D CPU DXE SMM Phase begin

0x4E Relocate SM bases for all APs

0x4F CPU DXE SMM Phase end

IO BUSES

0x50 Enumerating PCI buses

0x51 Allocating resources to PCI bus

0x52 Hot Plug PCI controller initialization

USB

0x58 Resetting USB bus

0x59 Reserved for USB

ATA/ATAPI/SATA

0x5A Resetting PATA/SATA bus and all devices

0x5B Reserved for ATA

continued

Intel Desktop Board DQ77MK Technical Product Specification

84

Table 51. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration

BDS

0x60 BDS driver entry point initialize

0x61 BDS service routine entry point (can be called multiple times)

0x62 BDS Step2

0x63 BDS Step3

0x64 BDS Step4

0x65 BDS Step5

0x66 BDS Step6

0x67 BDS Step7

0x68 BDS Step8

0x69 BDS Step9

0x6A BDS Step10

0x6B BDS Step11

0x6C BDS Step12

0x6D BDS Step13

0x6E BDS Step14

0x6F BDS return to DXE core (should not get here)

Keyboard (PS2 or USB)

0x90 Resetting keyboard

0x91 Disabling the keyboard

0x92 Detecting the presence of the keyboard

0x93 Enabling the keyboard

0x94 Clearing keyboard input buffer

0x95 Instructing keyboard controller to run Self Test (PS2 only)

Mouse (PS2 or USB)

0x98 Resetting mouse

0x99 Detecting mouse

0x9A Detecting presence of mouse

0x9B Enabling mouse

Fixed Media

0xB0 Resetting fixed media

0xB1 Disabling fixed media

0xB2 Detecting presence of a fixed media (IDE hard drive detection etc.)

0xB3 Enabling/configuring a fixed media

continued

Error Messages and Beep Codes

85

Table 51. Port 80h POST Codes (continued)

Port 80 Code Progress Code Enumeration

Removable Media

0xB8 Resetting removable media

0xB9 Disabling removable media

0xBA Detecting presence of a removable media (IDE, CDROM detection

etc.)

0xBB Enabling/configuring a removable media

DXE Core

0xE4 Entered DXE phase

BDS

0xE7 Waiting for user input

0xE8 Checking password

0xE9 Entering BIOS setup

0xEB Calling Legacy Option ROMs

Runtime Phase/EFI OS Boot

0xF8 EFI boot service ExitBootServices ( ) has been called

0xF9 EFI runtime service SetVirtualAddressMap ( ) has been called

Intel Desktop Board DQ77MK Technical Product Specification

86

Table 52. Typical Port 80h POST Sequence

POST Code Description

21 Initializing a chipset component

22 Reading SPD from memory DIMMs

23 Detecting presence of memory DIMMs

25 Configuring memory

28 Testing memory

34 Loading recovery capsule

E4 Entered DXE phase

12 Starting application processor initialization

13 SMM initialization

50 Enumerating PCI buses

51 Allocating resourced to PCI bus

92 Detecting the presence of the keyboard

90 Resetting keyboard

94 Clearing keyboard input buffer

95 Keyboard Self Test

EB Calling Video BIOS

58 Resetting USB bus

5A Resetting PATA/SATA bus and all devices

92 Detecting the presence of the keyboard

90 Resetting keyboard

94 Clearing keyboard input buffer

5A Resetting PATA/SATA bus and all devices

28 Testing memory

90 Resetting keyboard

94 Clearing keyboard input buffer

E7 Waiting for user input

01 INT 19

00 Ready to boot

87

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop

Board DQ77MK:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification markings

5.1.1 Safety Standards

Intel Desktop Board DQ77MK complies with the safety standards stated in Table 53

when correctly installed in a compatible host system.

Table 53. Safety Standards

Standard Title

CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (European Union)

IEC 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (International)

Intel Desktop Board DQ77MK Technical Product Specification

88

5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel®

Desktop Board DQ77MK is in conformity with all applicable essential requirements

necessary for CE marking, following the provisions of the European Council Directive

2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC

(ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for

distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC,

2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,

2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv

2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief

2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja

2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC

määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne

2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie

2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC.

Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak.

Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC.

Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC.

Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem.

Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas.

Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC.

Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC.

Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

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Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,

2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,

2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív

2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,

2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,

2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC

yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns

and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:

lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the

Intel Product Recycling Program to allow retail consumers of Intel’s branded products

to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the

details of this program, including the scope of covered products, available locations,

shipping instructions, terms and conditions, etc.

中文

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品

回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用

处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及

产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel

Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel

Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für

ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,

verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der

http://www.intel.com/intel/other/ehs/product_ecology

Intel Desktop Board DQ77MK Technical Product Specification

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Español

Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los

consumidores al detalle de los productos Intel devuelvan los productos usados en los

lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles

del programa, que incluye los productos que abarca, los lugares disponibles,

instrucciones de envío, términos y condiciones, etc.

Français

Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage

des produits Intel) pour permettre aux consommateurs de produits Intel de recycler

les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en

savoir plus sur ce programme, à savoir les produits concernés, les adresses

disponibles, les instructions d'expédition, les conditions générales, etc.

日本語

インテルでは、環境保護活動の一環として、使い終えたインテル ブランド製品を指定の場所へ返送していただき、リ

サイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、

http://www.intel.com/intel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,

Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan

pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke

lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan

butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi

tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese

Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar

produtos Intel usados para locais selecionados, onde esses produtos são reciclados de

maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)

para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,

os locais disponíveis, as instruções de envio, os termos e condições, etc.

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Russian

В качестве части своих обязательств к окружающей среде, в Intel создана

программа утилизации продукции Intel (Product Recycling Program) для

предоставления конечным пользователям марок продукции Intel возможности

возврата используемой продукции в специализированные пункты для должной

утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке,

положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin

Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri

dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya

koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve

şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin.

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5.1.4 China RoHS

Intel Desktop Board DQ77MK is a China RoHS-compliant product.

The China Ministry of Information Industry (MII) stipulates that a material Self

Declaration Table (SDT) must be included in a product’s user documentation. The SDT

for Intel Desktop Board DQ77MK is shown in Figure 18.

Figure 18. Intel Desktop Board DQ77MK China RoHS Material

Self Declaration Table

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5.1.5 EMC Regulations

Intel Desktop Board DQ77MK complies with the EMC regulations stated in Table 54

when correctly installed in a compatible host system.

Table 54. EMC Regulations

Regulation Title

FCC 47 CFR Part 15,

Subpart B Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio

Frequency Devices. (USA)

ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)

EN55022 Limits and methods of measurement of Radio Interference Characteristics

of Information Technology Equipment. (European Union)

EN55024 Information Technology Equipment – Immunity Characteristics Limits and

methods of measurement. (European Union)

EN55022 Australian Communications Authority, Standard for Electromagnetic

Compatibility. (Australia and New Zealand)

CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of

Information Technology Equipment. (International)

CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and

Methods of Measurement. (International)

VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.

(Japan)

KN-22, KN-24 Korean Communications Commission – Framework Act on

Telecommunications and Radio Waves Act (South Korea)

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) this device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to

radio or television reception, which can be determined by turning the equipment off

and on, the user is encouraged to try to correct the interference by one or more of the

following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

Intel Desktop Board DQ77MK Technical Product Specification

94

• Connect the equipment to an outlet on a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the user’s authority to operate the equipment.

Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from

digital apparatus set out in the Radio Interference Regulations of the Canadian

Department of Communications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les

limites applicables aux appareils numériques de la classe B prescrites dans le

Réglement sur le broullage radioélectrique édicté par le ministére des Communications

du Canada.

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of

the Voluntary Control Council for Interference from Information Technology Equipment

(VCCI). If this is used near a radio or television receiver in a domestic environment, it

may cause radio interference. Install and use the equipment according to the

instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has

acquired electromagnetic conformity registration, so it can be used not only in

residential areas, but also other areas.

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95

5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have

continually revised the ENERGY STAR requirements. Intel has worked directly with

these two governmental agencies in the definition of new requirements.

Intel Desktop Board DQ77MK meets the following program requirements in an

adequate system configuration, including appropriate selection of an efficient power

supply:

• Energy Star v5.0, category A

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP) Lot 6

NOTE

Energy Star compliance is based at the system level not the board level. Use of an

Intel Desktop Board alone does not guarantee Energy Star compliance.

For information about Refer to

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar

Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/

Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/

pg02100300.asp

European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s

ustainable-business/sustainable-

product-policy/ecodesign/index_en.htm

Intel Desktop Board DQ77MK Technical Product Specification

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5.1.7 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DQ77MK has the regulatory compliance marks shown in Table 55.

Table 55. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Recognized Component mark. Includes adjacent UL file

number for Intel Desktop Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive,

Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio

Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel

supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

Korea Certification mark. Includes an adjacent KCC (Korean Communications

Commission) certification number:

KCC-REM-CPU-DQ77MK.

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique

UL recognized manufacturer’s logo, along with a flammability rating (solder

side).

V-0

China RoHS/Environmentally Friendly Use Period Logo: This is an example of

the symbol used on Intel Desktop Boards and associated collateral. The color

of the mark may vary depending upon the application. The Environmental

Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined

to be 10 years.

Regulatory Compliance and Battery Disposal Information

97

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be

recycled where possible. Disposal of used batteries must be in accordance with local

environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les

piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des

piles usagées doit respecter les réglementations locales en vigueur en matière de

protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier

bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i

overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier

bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras

enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on

mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten

mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie

darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen

Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen

des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.

Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per

disfarsi delle pile usate, seguire le istruzioni del produttore.

Intel Desktop Board DQ77MK Technical Product Specification

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PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice

solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del

equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del

fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type

batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het

weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.

As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias

usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.

Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых

акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,

baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními

předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία

λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι

δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με

τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket

lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi

előírásoknak megfelelően kell kiselejtezni.

Regulatory Compliance and Battery Disposal Information

99

AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri

sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi

peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu

baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi

przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.

Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să

respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва.

Батареи должны быть утилизированы по возможности. Утилизация батарей должна

проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.

Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí

vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.

Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri

dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.

Якщо можливо, використані батареї слід утилізувати. Утилізація використаних

батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Intel Desktop Board DQ77MK Technical Product Specification

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小心

如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保

規範來處理使用過的電池。

주의

배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야

하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다.

THẬN TRỌNG

Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể

thực hiện được. Việc thải bỏ pin đã sử dụng phải tuân theo các quy định của địa

phương về môi trường.

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