EFD_020207_a SIM 5000 EFD Brochure

User Manual: SIM 5000

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Smart embedded code and data storage

for multimedia mobile handsets

A pioneer and leader in the ﬁeld, SanDisk

designs and manufactures NAND ﬂash

memory, develops the complete system

chip design, state-of-the-art controllers

and advanced ﬂash management software.

Through these capabilities and by working

very closely with customers, partners and

the markets served, SanDisk continually

sets the standard for quality, reliability

and performance.

The SanDisk mDOC H3 and iNAND™

embedded ﬂash drives (EFDs) are designed

to smartly address both system design

complexity and NAND reliability challenges.

Both substantially improve system performance,

reduce power consumption and are available

in a wide range of capacities.

SanDisk® Mobile Handset

Embedded Storage Solutions

Embedded Flash Drives

Standardized architecture

The SanDisk EFD product line advances embedded

ﬂash drive architecture. By building smart ﬂash

management software into its controller as ﬁrmware

and by standardizing the hardware interface,

SanDisk EFDs:

• Ensure device reliability

• Maximize device life expectancy

• Mask inherent raw NAND ﬂaws

Access to the latest NAND ﬂash

By integrating our advanced ﬂash management

technology internally as ﬁrmware, the SanDisk EFD

can help OEMs do away with traditional design

trade-offs. OEMs can now tap into the latest, most

cost-effective NAND ﬂash technologies and minimize

integration-associated risks and delays. SanDisk

EFDs help OEMs meet aggressive time-to-market

schedules, within budget.

Innovation in multimedia handset storage

mDOC H3 and iNAND provide the same package

ball-out, power management, hardware and software

interface throughout their respective capacity ranges,

effectively offering the best handset platform

design-in solution. SanDisk EFDs set the standard

for embedded storage with:

• High capacity – scalable NAND-based solution

with capacity ranging from 128MB to 8GB.*

• Guaranteed reliability – ﬁeld-proven, robust

on-the-ﬂy error correction and patented embedded

ﬂash management technology guaranteeing power-

loss immunity and smart wear leveling.

• High system performance – meeting multimedia

needs, optimized to handle high-resolution photos,

video and music download.

• Smart power management – supporting multiple

power modes, with automatic transitioning to low

power in various scenarios, substantially extend-

ing battery life.

• Security – hardware protection and security-

enabling features to protect code, personal data

and multimedia digital rights technology.

Enhancing the mobile ecosystem

From technology designers, handset vendors and

network operators to content providers and end

users, SanDisk EFDs take into consideration the

demands of all members of the mobile value chain.

• Field-proven – integrated into hundreds of designs

for code and data storage in tens of millions of

mobile handsets.

• Wide chipset support – all major chipsets from TI,

Freescale, Qualcomm, Renesas, ARM and Marvell.

SanDisk mDOC H3 and iNAND

Reliable Embedded Storage

• Patented ﬂash management technology –

compatible with leading OSs, including Symbian,

Microsoft Windows Mobile and Windows CE, Linux,

Linux/JAVA, Montavista, Nucleus and OSE .

• Complete mobile offering – including memory

cards microSD™, miniSD™, Memory Stick Pro Duo™,

Memory Stick Micro™ M2, SIM cards and

TrustedFlash™ technology.

• Supporting tools – unique array of programming,

testing, and development tools further improving

implementation, integration and NPI.

Simplifying and optimizing platform

architectures

Low-capacity storage just isn’t enough. With

the rapidly growing demand for storage-hungry

applications, low-capacity ﬂash technologies no longer

satisfy many of the new consumer requirements.

Consequently, OEMs are faced with a challenging

mission of adding features, functions and more

storage while minimizing form factors and simplifying

platform architectures.

SanDisk MLC NAND-based EFDs with bootable code

and high-capacity data storage simplify handset design

and enhance functionality by utilizing a single, small,

cost-effective device. Featuring high reliability and

system performance, SanDisk EFDs clearly top the

SLC NAND and NOR-based solution value proposi-

tions (see ﬁgures 1, 2).

For enhanced smart-phone architectures, SanDisk

EFDs utilize a simple LP DRAM POP conﬁguration,

reducing design complexity and offering an extremely

cost-effective solution (see ﬁgure 3).

SanDisk mDOC H3

Bootable code and data storage in

one device

mDOC H3 offers handset designers data storage and

XIP boot capabilities in one device. Utilizing industry

standard NOR-like interface together with patented

TrueFFS® ﬂash management technology, mDOC H3

provides a reliable and cost effective solution,

eliminating the need for a separate boot device.

Platform design ﬁt solution

mDOC H3 features small FBGA discrete, MCP and POP

(with LP DRAM) packages, with a wide range of capaci-

ties from 128MB to 4GB, making it a solution for all

platform conﬁgurations. mDOC products feature the

same ball-out, power management, hardware and

software interface for all capacities.

* Note: 1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes.

Some of the listed capacity is used for formatting and other functions, and

thus is not available for data storage.

SanDisk and the Sandisk logo are trademarks of SanDisk Corporation, registered in the US and other countries. iNAND and

TrustedFlash are trademarks of SanDisk Corporation. mDOC and True FFS are trademarks or registered trademarks of SanDisk

Corporation and/or its subsidiaries. Other brand names mentioned herein are for identiﬁcation purposes only and may be

trademarks of their respective holder(s).

mDOC H3 in various form factors USA

tel: +1-408-470-4440

fax: +1-408-470-4470

MHV-USA@sandisk.com

Japan

tel: +81-3-5423-8101

fax: +81-3-5423-8102

MHV-Japan@sandisk.com

Taiwan

tel: +886-2-2515-2522

fax: +886-2-2515-2295

MHV-Asia@sandisk.com

China

tel: +86-755-83595116

fax: +86-755-83485418

MHV-China@sandisk.com

Korea

tel: +82-2-3452-9079

fax: +82-2-3452-9145

MHV-Korea@sandisk.com

Europe

tel: +46-8-6211-367

fax: +46-8-6211-369

MHV-Europe@sandisk.com

Rest of the World

tel: +972-9-764-5000

fax: +972-3-548-8666

MHV@sandisk.com

For more information,please

visit www.sandisk.com

EFD product family

iNAND mDOC H3

Capacity 512MB to 8GB 128MB to 4GB

Flash management technology Embedded in ﬁrmware Embedded in ﬁrmware

NAND ﬂash technology MLC MLC, SLC

Package 12mm x 16mm

12mm x 18mm

9mm x 12mm

10mm x 14mm

12mm x 18mm

XIP boot block By Chipset ROM code 32Kbytes

Data protection Yes Yes

RoHS compliant Yes Yes

Performance

Sustained read** 10MB/sec 10-25MB/sec

Sustained write** 9MB/sec 5-9MB/sec

Power consumption

Core/IO voltage 3.3V/3.3V, 3.3V/1.8V 3.3V/3.3V, 3.3V/1.8V,

1.8V/1.8V

Deep power-down mode 150uA (typ) 45uA (typ)

Power-save mode Yes Yes

Active current 75mA (typ) 30mA (typ)

iNAND

** Based on SanDisk internal testing

Standalone product

(Discrete)

Capacities:

128MB to 4GB

Packages:

• FBGA 9mm x 12mm

• FBGA 10mm x 14mm

• FBGA 12mm x 18mm

MCP

(mDOC H3 and LP-SDR/DDR

in the same package)

Capacities:

mDOC H3:

128MB to 4GB

SDR/DDR SDRAM:

64MB to 128MB

Packages:

• With LP-SDR SDRAM

• FBGA 9mm x 12mm

• FBGA 11mm x 14mm

• With LP-DDR SDRAM

• FBGA 11mm x 14mm

• FBGA 12mm x 18mm

Speciﬁc MCP combinations are

available for volume orders.

Mass storage

High-capacity embedded ﬂash

storage in a small, low-cost,

JEDEC (JC-64.1) compatible

package ball-out with proven

reliability and easy upgrade-

ability to meet the increas-

ingly stringent requirements

of today’s storage-hungry

applications.

Industry-standard interface

SanDisk iNAND uses industry-

standard SD and SPI interfaces

which offer seamless hardware

and software integration, with

a low ball-out count for designs

with tight routing (such as mobile

phones and digital audio players)

to minimize design risk and en-

sure backward compatibility.

POP

(Package-On-Package)

Capacities:

mDOC H3:

256MB to 1GB

DDR SDRAM:

64MB to 128MB

Packages:

• TI: FBGA 14mm x 14mm

• JEDEC: FBGA 15mm x 15mm

Capacities:

512MB to 8GB

Packages:

• FBGA 12mm x 16mm

• FBGA 12mm x 18mm

EFD_020207_a SIM 5000 EFD Brochure

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