EK HSCMA SV 002_HSC_Service_Manual_Dec89 002 HSC Service Manual Dec89

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HSC Service Manual
Order Number EK-HSCMA-SV-002

Digital Equipment Corporation
Maynard, Massachusetts

Second Edition, December 1989
The information in this document is subject to change without notice and should not be construed as a commitment
by Digital Equipment Corporation. Digital Equipment Corporation assumes no responsibility for any errors that may
appear in this document.
The software described in this document is furnished under a license and may be used or copied only in
accordance with the terms of such license.
No responsibility is assumed for the use or reliability of software on equipment that is not supplied by Digital
Equipment Corporation or its affiliated companies.
Restricted Rights: Use, duplication, or disclosure by the U.S. Government is subject to restrictions as set forth in
subparagraph (c){1){ii) of the Rights in Technical Data and Computer Software clause at DFARS 252.227-7013.
Copyright ©1989 by Digital Equipment Corporation

All Rights Reserved.
Printed in U.S.A.

The following are trademarks of Digital Equipment Corporation:
DEC
DEC/CMS
DEC/MMS
DECnet
DECsystem-10
DECSYSTEM-20
DECUS
DECwriter

DIBOL
EduSystem
lAS
MASSBUS
PDP
PDT
RSTS
RSX

UNIBUS
VAX
VAXcluster
VMS
VT

~DmDamDlM

HSC50 ©DEC 1983
Covered by one or more U.S. PAT. Nos.
4,475,212
4,468,035
4,241 ,399
4,450,572

4,434,487
4,543,626
4,338,663

4,413,339
4,592,072
4,349,871
and other patents pending

HSC70 ©DEC 1985
Covered by one or more U.S. PAT. Nos.
4,475,212
4,468,035
4,241 ,399
4,450,572

4,434,487
4,543,626
4,338,663

4,413,339
4,592,072
4,349,871
and other patents pending

This document was prepared using VAX DOCUMENT, Version 1.1

Contents
About This Manual
1

General Information
1.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1

1.2

HSC Cabinet Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-3

1.3

HSC50 Cabinet Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-7

1.4

External Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-11

1.5
HSC Hardware Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5.1
Port Link Module (LINK) Functions. . . . . . . . . . . . . . . . .
1.5.2
Port Buffer Module (PILA) Functions. . . . . . . . . . . . . . . .
1.5.3
Port Processor Module (Kpli) Functions and Interfaces. .
1.5.4
Disk Data Channel Module (K.sdi) Functions. . . . . . . . . .
1.5.5
Tape Data Channel ModUle (Ksti) Functions . . . . . . . . . .
1.5.6
Data Channel Module (Ksi) Functions. . . . . . . . . . . . . . .
1.5.7
110 Control Processor Module (P.ioj/c) Functions. . . . . . . .
1.5.8
Memory Module (M.std2) Functions . . . . . . . . . . . . . . . . .
1.5.9
Memory Module (M.std) Functions . . . . . . . . . . . . . . . . . .

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1-13
1-15
1-16
1-16
1-16
1-17
1-17
1-17
1-18
1-19

HSC Software Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-20

1.7
HSC Maintenance Strategy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .
1.7.1
Maintenance Features ..........................................

1-22
1-22

1.8

1-23

1.6

2

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Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Controls and Indicators
2.1

Introduction ................................................... .

2-1

2.2

Operator Control Panel (OCP) ..................................... .

2-2

2.3

HSC Inside Front Controls and Indicators ............................ .

2-3

2.4

HSC50 Inside Front Door Controls and Indicators ...................... .

2-6

HSC50 Maintenance Access Panel Controls and Connectors ............... .
2.5
HSC50 dc Power Switch ........................................ .
2.5.1
HSC50 Maintenance Panel Connectors ............................. .
2.5.2

2-7
2-8
2-8

iii

iv

3

Contents

2.6

Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-8

2.7

Module Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-11

2.8
881 Power Controller .............................................
2.8.1
Operating Instructions .............. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-17
2-17

2.9
HSC50 Power Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.1
Line Phase Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.2
Fuses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.3
Remote/Off/Local On Switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.4
Circuit Breakers (60 Hz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
2.9.5
Circuit Breakers (50 Hz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.6
Power Controller (60 Hz)--Rear View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9.7
Power Controller (50 Hz)--Rear View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-19
2-20
2-21
2-21
2-22
2-22
2-22
2-23

Removal and Replacement Procedures
3.1

Introduction ................................................... .

3-1

3.2

Safety Precautions .............................................. .

3-2

3.3
Taking the HSC Off Line for Maintenance ............................ .
3.3.1
Single HSC in a Cluster and Clusters Running ULTRIXIUNIX .......... .
3.3.2
Multiple HSCs in a Cluster ...................................... .

3-2
3-2
3-2

3.4
Removing and Replacing Field Replaceable Units .......................
3.4.1
Removing HSC Power ..........................................
3.4.2
Removing HSC50 Power ........................................
3.4.3
Removing Field Replaceable Units ................................
3.4.4
Removing the HSC Cabinet Front Door ............................
3.4.5
Removing the HSC50 Cabinet Front Door ..........................
3.4.6
Removing the HSC Cabinet Back Door .............................

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.
.

3--3
3-3
3-5
3--8
3-9
3-11
3-12

3.5
Removing and Replacing Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1
Removing and Replacing the Port Link Module (LINK) . . . . . . . . . . . . . . . . .
3.5.1.1
Removing the LINK Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1.2
Setting the Replacement LINK Module Switches . . . . . . . . . . . . . . . . . . . .
3.5.1.3
Setting the Replacement LINK Module Jumpers ..... . . . . . . . . . . . . . . .
3.5.1.4
Replacing the LINK Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1.5
Testing the LINK Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.2
Removing and Replacing Port Buffer Module (PILA) .... . . . . . . . . . . . . . . .
3.5.2.1
Removing the PILA Module ..................... . . . . . . . . . . . . . . .
3.5.2.2
Setting the Replacement PILA Module Switches ....................
3.5.2.3
Replacing the PILA Module ....................................
3.5.2.4
Testing the PILA Module ......................................
3.5.3
Removing and Replacing the Port Processor Module (K.pli) . . . . . . . . . . . . . .
3.5.3.1
Removing the Kpli Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.3.2
Setting the Replacement K.pli Module Switches. . . . . . . . . . . . . . . . . . . . .
3.5.3.3
Replacing the Kpli Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.3.4
Testing the Kpli Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-13
3-14
3-14
3-15
3-16
3-20
3-20
3-20
3-20
3-21
3-21
3-21
3-22
3-22
3-22
3-23
3-23

Contents

v

Removing and Replacing the Disk Data Channel Module (K.sdi) ......... .
Removing the Ksdi Module ................................... .
Replacing the Ksdi Module ................................... .
Testing the K.sdi Module ..................................... .
Tape Data Channel Module (Ksti) ................................ .
Removing the K.sti Module .................................... .
Replacing the Ksti Module .................................... .
Testing the K.sti Module ...................................... .
Removing and Replacing the Data Channel Module (Ksi) .............. .
Removing the K.si Module .................................... .
Setting the Replacement Ksi Module Switches .................... .
Configuration of Requestors While Replacing the Ksi Module ......... .
Replacing the K.si Module .................................... .
K.si Module External Loop Test ................................ .
Initializing the K.si Module ................................... .
Correcting K.si Module Configuration Problems .................... .
K.si Module New Boot Microcode ............................... .
Testing the K.si Module (After Initialization) ...................... .
Removing and Replacing the I/O Control Processor Module (P.ioj/c) ....... .
Removing the P.ioj/c Module ................................... .
Setting the Replacement P.ioj/c Module Jumpers ................... .
Replacing the P.iojlc Module ................................... .
Testing the P.ioj/c Module ..................................... .
Removing and~eplacing the HSC Memory Module (M.std2) ............ .
Removing ~e M.std2 Module .................................. .
Replacing the M.std2 Module ............•......................
Testing the M.std2 Module .................................... .
Removing and Replacing the HSC50 Memory Module (M.std) ........... .
Removing the M.std Module ................................... .
Replacing the M.std Module ................................... .
Testing the M.std Module ..................................... .

3-23
3-23
3-24
3-24
3-25
3-25
3-25
3-25
3-26
3-26
3-26
3-27
3-28
3-29
3-30
3-31
3-32
3-33
3-33
3-33
3-34
3-34
3-35
3-35
3-35
3-36
3-36
3-37
3-37
3-37
3-38

3.6
Removing and Replacing Subunits .................................. .
3.6.1
Removing and Replacing the RX33 Disk Drive ....................... .
Removing the RX33 Disk Drive ................................ .
3.6.1.1
Setting the RX33 Disk Drive Jumpers ........................... .
3.6.1.2
Replacing the RX33 Disk Drive ................................. .
3.6.1.3
Testing the RX33 Disk Drive ................................... .
3.6.1.4
Removing and Replacing the TU58 Tape Drive .......... ' ............. .
3.6.2
3.6.2.1
Removing the TU58 Tape Drive ......... '.' ..................... .
Setting the TU58 Tape Drive Jumpers ........................... .
3.6.2.2
Replacing the TU58 Tape Drive ................................ .
3.6.2.3
Testing the TU58 Tape Drive .................................. .
3.6.2.4
Removing and Replacing the HSC Operator Control Panel (OCP) ........ .
3.6.3
Removing the HSC OCP ...................................... .
3.6.3.1
Replacing the HSC OCP ...................................... .
3.6.3.2
Testing the HSC OCP .......... : ............................. .
3.6.3.3

3-38
3-38
3-38
3-41
3-45
3-45
3-45
3-45
3-49
3-50
3-51
3-51
3-51
3-52
3-53

3.5.4
3.5.4.1
3.5.4.2
3.5.4.3
3.5.5
3.5.5.1
3.5.5.2
3.5.5.3
3.5.6
3.5.6.1
3.5.6.2
3.5.6.3
3.5.6.4
3.5.6.5
3.5.6.6
3.5.6.7
3.5.6.8
3.5.6.9
3.5.7
3.5.7.1
3.5.7.2
3.5.7.3
3.5.7.4
3.5.8
3.5.8.1
3.5.8.2
3.5.8.3
3.5.9
3.5.9.1
3.5.9.2
3.5.9.3

vi

Contents

3.6.4
3.6.4.1
3.6.4.2
3.6.4.3
3.6.5
3.6.6
3.6.7
3.6.8
3.6.9
3.6.10
3.6.11
3.6.12
3.6.13
3.6.14

4

3-53
3-53
3-55
3-55
3-56
3-58
3-60
3-62
3-64
3-67
3-69
3-73
3-76
3-79

Initialization Procedures
4.1

5

Removing and Replacing the HSC50 Operator Control Panel (OCP) .......
Removing the HSC50 OCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing the HSC50 OCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing the HSC50 OCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC Airflow Sensor Assembly .............
Removing and Replacing the HSC50 Airflow Sensor Assembly. . . . . . . . . . . .
Removing and Replacing the HSC Blower ................. . . . . . . . . . .
Removing and Replacing the HSC50 Blower. . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the 881 Power Controller ....................
Removing and Replacing the HSC50 Power Controller . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC Main Power Supply .................
Removing and Replacing the HSC50 Main Power Supply. . . . . . . . . . . . . . . .
Removing and Replacing the HSC Auxiliary Power Supply . . . . . . . . . . . . . .
Removing and Replacing the HSC50 Auxiliary Power Supply ............

Introduction ................................................... .

4-1

4.2
Console!Auxiliary Terminal ........................................
4.2.1
Console Terminal Connection ....................................
4.2.2
HSC50 Auxiliary and Maintenance Terminal Connections ..............
4.2.3
LA12 Parameters .............................................

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4-1
4-1
4-2
4-4

4.3
HSC Initialization ...............................................
Init P.io Test (INIPIO) ..........................................
4.3.1
4.3.2
INIPIO Test System Requirements ................................
4.3.3
INIPIO Test Prerequisites .......................................
4.3.4
INIPIO Test Operation .........................................

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4-5
4-7
4-7

4-7
4-7

4.4
HSC50 Initialization ............................................. .
4.4.1
HSC50 Off-line Diagnostics Tape ................................. .
4.4.2
Init P.ioc Diagnostic ........................................... .

4-8
4-8
4-8

4.5

4-9

Fault Code Interpretation ......................................... .

Device Integrity Tests
5.1
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1.1
Device Integrity Tests Common Areas ..............................
5.1.2
Generic Error Message Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5-1
5-1
5-2

5.2
ILRX33 - RX33 Device Integrity Tests ...............................
5.2.1
System Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.2
Operating Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.3
Test Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.4
Parameter Entry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.5
Progress Reports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.6
Test Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2.7
Error Message Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5-2
5-3
5-3
5-3
5-3
5-3
5-4
5-4

Contents

5.2.8

Error Messages ............................................... .

5.3 ILTAPE-TU58 Device Integrity Test .................................
5.3.1
System Requirements ..........................................
5.3.2
Operating Instructions .........................................
5.3.3
Test Termination ..............................................
Error Messages ...............................................
5.3.4

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5.4 ILMEMY - Memory Integrity Tests ................................. .
System Requirements .......................................... .
5.4.1
Operating Instructions ......................................... .
5.4.2
5.4.3
Test Termination .............................................. .
5.4.4
Progress Reports .............................................. '.
Test Sum.maries .............................................. .
5.4.5
Error Message Example ........................................ .
5.4.6
Error Messages ............................................... .
5.4.7
5.5 ILDISK - DISK Drive Integrity Tests ...............................
5.5.1
System Requirements ..........................................
Operating Instructions .........................................
5.5.2
..................................................
Availability
5.5.3
Test Termination ..............................................
5.5.4
Parameter Entry ..............................................
5.5.5
Specifying Requestor and Port ...................................
5.5.6
Progress Reports ..............................................
5.5.7
Test Sum.maries ..............................................
5.5.8
Error Message Example ........................................
5.5.9
5.5.10 Error Messages ...............................................
5.5.11 MSCP Status Codes-ILDISK Error Reports ........................

vii

5-4

5-5

5-5
5-6
5-6
5-6

5-7
5-7
5-7
5-8
5-8
5-8
5-8

5-9

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5-9
5-10
5-10
5-10
5-11
5-11
5-12
5-12
5-12
5-14
5-14
5-22

5.6 ILTAPE - TAPE Device Integrity Tests .............................. .
Operating Instructions ......................................... .
5.6.1
5.6.2
Test Termination .............................................. .
User Dialog .................................................. .
5.6.3
User Sequences ............................................... .
5.6.4
Progress Reports .............................................. .
5.6.5
Test Sum.maries .............................................. .
5.6.6
5.6.6.1
Interface Test Sum.mary ...................................... .
Formatter Test Summary ..................................... .
5.6.6.2
User Sequence Test Summary .................................. .
5.6.6.3
Canned Sequence Test Summary ............................... .
5.6.6.4
Streaming Sequence Test Summary ............................. .
5.6.6.5
Error Message Example ........................................ .
5.6.7
Error Messages ............................................... .
5.6.8

5-23
5-23
5-24
5-24
5-27
5-28
5-28
5-28
5-29
5-29
5-29
5-29
5-29
5-30

5.7 ILTCOM - Tape Compatibility Test ................................. .
System Requirements .......................................... .
5.7.1
Operating Instructions ......................................... .
5.7.2
Test Termination .............................................. .
5.7.3
Parameter Entry .............................................. .
5.7.4

5-32
5-33
5-34
5-34

5-34

viii

Contents

5.7.5
5.7.6
5.7.7

6

Test Summaries .............................................. .
Error Message Example ........................................ .
Error Messages ............................................... .

5-36
5-36
5-36

5.8 ILEXER - Multidrive Exerciser .................................... .
System Requirements .......................................... .
5.8.1
5.8.2
Operating Instructions ......................................... .
Test Termination .............................................. .
5.8.3
Parameter Entry .............................................. .
5.8.4
Disk Drive Prompts ........................................... .
5.8.5
Tape Drive Prompts ........................................... .
5.8.6
Global Prompts ............................................... .
5.8.7
Data Patterns ................................................ .
5.8.8
Setting/Clearing Flags ......................................... .
5.8.9
5.8.10 Progress Reports .............................................. .
5.8.11 Data Transfer Error Report ..................................... .
5.8.12 Performance Summary ......................................... .
5.8.13 Communications Error Report ................................... .
5.8.14 Test Summaries .............................................. .
5.8.15 Error Message Format ......................................... .
5.8.15.1
Prompt Error Format ........................................ .
Data Compare Error Format .................. ' ................. .
5.8.15.2
Pattern Word Error Format ................................... .
5.8.15.3
5.8.15.4
Communications Error Format ................................. .
5.8.16 Error Messages ............................................... .
5.8.16.1
Informa tional Messages ...................................... .
5.8.16.2
Generic Errors ............................................. .
Disk Errors ................................................ .
5.8.16.3
Tape Errors ............................. '................... .
5.8.16.4

5-37
5-37
5-38
5-39
5-39
5-40

5-42
5-43
5-44
5-46
5-46
5-46
5-46
5-48
5-48

5-50
5-50
5-50
5-51
5-51
5-52
5-52
5-52
5-54

5-55

Off-line Diagnostics
6.1 Introduction ................................................... .
6.1.1
Software Requirements ......................................... .
6.1.2
Off-line Diagnostics Load Procedure ............................... .

6-1
6-1
6-1

6.2 ROM Bootstrap ................................................. .
Initialization Instructions ....................................... .
6.2.1
6.2.2
Failures ..................................................... .
6.2.3
Progress Reports .............................................. .
Error Information ............................................. .
6.2.4
6.2.5
Failure Troubleshooting ........................................ .
Bootstrap Test Summaries ...................................... .
6.2.6
6.2.7
Generic Error Message Format ................................... .

6-2
6-2

6.3 ODL-Off-line Diagnostics Loader .................................. .
6.3.1
Loader System Requirements .................................... .
6.3.2
Loader Prerequisites ........................................... .

6-7

6-3
6-3
6-4
6-4
6-4

6-7
6-8
6-8

Contents

ix

Loader Operating Instructions ................................... .
6.3.3
Loader Commands ............................................ .
6.3.4
HELP Command ............................................ .
6.3.4.1
SIZE Command ............................................. .
6.3.4.2
TEST Command ............................................ .
6.3.4.3
LOAD Command ............................................ .
6.3.4.4
START Command ........................................... .
6.3.4.5
EXAMINE and DEPOSIT Commands ............................ .
6.3.4.6
EXAMINE and DEPOSIT Symbolic Addresses ..................... .
6.3.4.7
Repeating EXAMINE and DEPOSIT Commands ................... .
6.3.4.8
Relocation Register .......................................... .
6.3.4.9
EXAMINE and DEPOSIT Qualifiers (Switches) .................... .
6.3.4.10
Setting and Showing Defaults .................................. .
6.3.4.11
Executing INDIRECT Command Files ........................... .
6.3.4.12
Unexpected Traps and Interrupts ................................. .
6.3.5
Trap and Interrupt Vectors .................................... .
6.3.5.1
Help File .................................................. .
6.3.5.2

6-9
6-10
6-10
6-11
6-11
6-12
6-13
6-13
6-13
6-14
6-16

6.4
OFLCXT-Off-line Cache Test ...................................... .
System Requirements .......................................... .
6.4.1
Operating Instructions ......................................... .
6.4.2
Test Termination .............................................. .
6.4.3
Parameter Entry .............................................. .
6.4.4
Progress Reports .............................................. .
6.4.5
Test Summaries .............................................. .
6.4.6
Error Information ............................................. .
6.4.7
Error Messages ............................................... .
6.4.8
Test Troubleshooting ........................................... .
6.4.9

6-16
6-17
6-17
6-17
6-17
6-18
6-18
6-20
6-21
6-23

OBIT-Off-line Bus Interaction Test ................................. .
6.5
System Requirements .......................................... .
6.5.1
Off-line Bus Interaction Test Prerequisites .......................... .
6.5.2
Operating Instructions ......................................... .
6.5.3
Test Termination .............................................. .
6.5.4
Parameter Entry .............................................. .
6.5.5
Progress Reports .............................................. .
6.5.6
Test Summary- ................................................ .
6.5.7
Error Information ............................................. .
6.5.8
Requestor Error Summary ...................................... .
6.5.9
6.5.10 Memory Test Configuration ....................... ; .............. .
6.5.11 Error Messages ....................... '........................ .

6-24
6-24
6-24
6-24
6-25
6-25
6-26
6-26
6-27
6-27
6-28
6-28

OKTS -Off-line K Test Selector ..................................... .
6.6
System Requirements .......................................... .
6.6.1
Operating Instructions ......................................... .
6.6.2
Test Termination .............................................. .
6.6.3
Parameter Entry .............................................. .
6.6.4
Progress Reports .............................................. .
6.6.5

6-30
6-30
6-31
6-31
6-31
6-33

6-8
6-8
6-8
6-9

6-9
6-9

x

Contents

K.ci Path Status Information ....................................
Test Swnmaries ..............................................
Error Infonn.a tion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Messages ...............................................

.
.
.
.

6-33
6-33
6-35
6-35

OKPM-Off-line KIP Memory Test ..................................
6.7
System Requirements ..........................................
6.7.1
Operating Instructions .........................................
6.7.2
Test Termination ..............................................
6.7.3
Parameter Entry ..............................................
6.7.4
Progress Reports ..............................................
6.7.5
Parity Errors .................................................
6.7.6
Test Swnmaries ..............................................
6.7.7
Error InforDlation .............................................
6.7.8
Requestor Error Summary ......................................
6.7.9
6.7.10 Error Messages ...............................................

.
.
.
.
.
.
.
.
.
.
.

&-41
&-41
6-41
&-42
&-42
6-43
6-43
6-44
6-45
6-45
6-45

OMEM-Off-line Memory Test .....................................
6.8
System Requirements ..........................................
6.8.1
Operating Instructions .........................................
6.8.2
Test Termination ..............................................
6.8.3
Parameter Entry ..............................................
6.8.4
Progress Reports ..............................................
6.8.5
Parity Errors .................................................
6.8.6
Test Summaries ..............................................
6.8.7
Error InforDlation .............................................
6.8.8
Error Messages ...............................................
6.8.9

.
.
.
.
.
.
.
.
.
.

6-52
6-52
6-52
6-52
6-52
6-53
6-54
6-54
6-55
6-56

OFLRXE-RX33 Off-line Exerciser .................................. .
6.9
System Requirements .......................................... .
6.9.1
Operating Instructions ......................................... .
6.9.2
Test Termination .............................................. .
6.9.3
Parameter Entry .............................................. .
6.9.4
Progress Reports .............................................. .
6.9.5
Test Swnmaries .............................................. .
6.9.6
Data Patterns ................................................ .
6.9.7
6.9.8
Error Information ............................................. .
Error Messages ............................................... .
6.9.9

&-63
6-63
6-63
6-64
6-64
6-65
6-65
6-66
6-67
6-67

6.10 ORFT-Off-line Refresh Test .......................................
6.10.1 System Requirements ..........................................
6.10.2 Opera ting Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.10.3 Test Termination ..............................................
6.10.4 Parameter Entry ..............................................
6.10.5 Progress Reports ..............................................
6.10.6 Test Summaries ..............................................
6.10.7 Error Information .............................................
6.10.8 Error Messages ...............................................

.
.
.
.
.
.
.
.
.

6-70
6-70
6-70
6-70
6-71

OOCP-Off-line Operator Control Panel (OCP) Test .................... .

~73

6.6.6
6.6.7
6.6.8
6.6.9

6.11

~71
~71

~72
~72

Contents

6.11.1
6.11.2
6.11.3
6.11.4
6.11.5
6.11.6
6.11.7
6.11.8
6.11.8.1
6.11.8.2
6.11.8.3
6.11.8.4

7

System Requirements .................... -...................... .
Opera ting Instructions .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test Termination .............................................. .
Parameter Entry .............................................. .
Test Summaries .............................................. .
Error Information ............................................. .
Error Messages ............................................... .
Troubleshooting Registers and Displays through ODT ................. .
Switch Check through ODT ................................... .
Lamp Bit Check ............................................ .
SecurelEnable Switch Check ................................... .
State LED Check ........................................... .

xi

6-73
6-73
6-73
6-73
6-75
6-77
6-77
6-78
6-78
6-79
6-80
6-81

Utilities
7.1

Introduction

7-1

7.2
DKUTIL - Off-line Disk Utility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.1
Starting DKUTIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.2
Command Syntax. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.3
Command Modifiers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.4
Command Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.4.1
Command Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.4.2
DEFAULT Command ..................... . . . . . . . . . . . . . . . . . . . .
7.2.4.3
DISPLAY Command.. . . . . . . . . . . . . . .. .. . . . . . . . . . . . . . . . . . . . . . . .
7.2.4.4
DUMP Command ........................................... .
7.2.4.5
EXIT Command ................ ; ........................... .
GET Command ............................................. .
7.2.4.6
POP Command ............................................. .
7.2.4.7
PUSH Command ............................................ .
7.2.4.8
REVECTOR Command ....................................... .
7.2.4.9
7.2.4.10
SET Command ............................................. .
7.2.5
Sample Session ............................................... .
Error and Information Messages .................................. .
7.2.6
Error Message Variables ...................................... .
7.2.6.1
Error Message Severity Levels ................................. .
7.2.6.2
Fatal Error Messages ........................................ .
7.2.6.3
Error Messages ............................................. .
7.2.6.4
7.2.6.5
Information Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..

7-1
7-1
7-2
7-2
7-3
7-3
7-4
7-5
7-6
7-7

7-9
7-9
7-9
7-10
7-12
7-12
7-13
7-13
7-13
7-14

7.3
VERIFY - Off-line Disk Verifier Utility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.1
Running VERIFY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.2
Sample Session. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7-15
7-16
7-17

7-8
7-8

xii

Contents

Error and information Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Variable Output Error Fields ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Message Severity Levels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fatal Error Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Warning Messages ...........................................
Information Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7-18
7-18
7-18
7-19
7-19
7-21

FORMAT - Off-line Disk Formatter Utility ........................... .
7.4
Running FORMAT ............................................ .
7.4.1
Sample Session ............................................... .
7.4.2
Error and Information Messages .................................. .
7.4.3
Error Message Variables ...................................... .
7.4.3.1
Message Severity Levels ...................................... .
7.4.3.2
Fatal Error Messages ........................................ .
7.4.3.3
Warning Message ........................................... .
7.4.3.4
Information Messages ........................................ .
7.4.3.5
Error Messages ............................................. .
7.4.3.6
Success Messages ........................................... .
7.4.3.7

7-22
7-23
7-26
7-26
7-26
7-26
7-27
7-27
7-28
7-28

7.5
PATCH - Off-line Load Media Modification Utility .....................
PATCH Commands ............................................
7.5.1
Running PATCH ................ '..............................
7.5.2
Sample Session ...............................................
7.5.3
Error and Information Messages ..................................
7.5.4
Fatal Error Messages ........................................
7.5.4.1
PATCH Error Messages ......................................
7.5.4.2
Warning Messages ..........................................
7.5.4.3
Informational Messages ......................................
7.5.4.4
Success Messages ...........................................
7.5.4.5

.
.
.
.
.
.
.
.
.
.

7-28
7-28
7-29
7-31
7-31
7-32
7-32
7-33
7-33
7-33

8.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8-1

8.2

How To Use This Chapter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8-1

8.3
Initialization Error Indications ..................................... .
OCP Fault Code Displays ....................................... .
8.3.1
Fault Code Interpretation ..................................... .
8.3.1.1
8.3.2
Module LEOs ................................................ .
8.3.2.1
P.ioj/c LEDs ................................................ .
Power-up Sequence of I/O Control Processor LEOs .................. .
8.3.2.2
Memory Module LEOs ....................................... .
8.3.2.3
Data Channel LEOs ......................................... .
8.3.2.4
Host Interface LED .......................................... .
8.3.2.5
Communication Errors .......................................... .
8.3.3
Requestor Status for Nonfailing Requestors ......................... .
8.3.4
HSC Boot Flow and Troubleshooting Chart ......................... .
8.3.5
HSC50 Flow and Troubleshooting Chart ............................ .
8.3.6

8-2
8-2
8-3
8-11
8-12
8-12
8-12
8-13
8-13
8-14
8-14
8-15
8-21

7.3.3
7.3.3.1
7.3.3.2
7.3.3.3
7.3.3.4
7.3.3.5

8

7-24

Troubleshooting Techniques

Contents

8.3.7

Boot Diagnostic Indications ...................................... .

A

8-26

.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.

8-26
8-26
8-26
8-27
8-27
8-27
8-28
8-29
8-30
8-35
8-38
8-39
8-40
8-40
8-42
8-45
8-46
8-46
8-49
8-50
8-52
8-52
8-52
8-53
8-53
8-53
8-53
8-54
8-54
8-54
8-56

Alphabetical Listing of Software Error Messages ....................... .

8-58

Software Error Messages .........................................
8.4
Mass Storage Control Protocol Errors ..............................
8.4.1
MSCPtrMSCP Error Format, Description, and Flags ..................
8.4.2
Error FOrIllat ..............................................
8.4.2.1
8.4.2.2
Error Message Fields ........................................
Format 'JYpe Codes ..........................................
8.4.2.3
Error Flags ................................................
8.4.2.4
Controller Errors ............................................
8.4.2.5
MSCP SDI Errors ...........................................
8.4.2.6
Disk Transfer Errors .........................................
8.4.2.7
Bad Block Replacement Errors (BBR) ..............................
8.4.3
TMSCP Errors ...............................................
8.4.4
STI Communication or Command Errors .........................
8.4.4.1
STI Formatter Error Log .....................................
8.4.4.2
STI Drive Error Log .........................................
8.4.4.3
Breakdown of GEDS Text Field ................................
8.4.4.4
Breakdown of GSS Text Field ..................................
8.4.4.5
GSS Text Field Bit Interpretation ...............................
8.4.4.6
Out-of-Band Errors ............................................
8.4.5
RX.33 Errors ...............................................
8.4.5.1
Disk Functional Errors .......................................
8.4.5.2
Ta pe Functional Errors .......................................
8.4.5.3
Miscellaneous Errors .........................................
8.4.5.4
Traps .......................................................
8.4.6
NXM (Trap through 4) .......................................
8.4.6.1
Reserved Instruction (Trap through 10) ..........................
8.4.6.2
Parity Error (Trap through 114) ................................
8.4.6.3
Level 7 K Interrupt (Trap through 134) ..........................
8.4.6.4
Control Bus Error Conditions (Hardware-Detected) .................
8.4.6.5
Level 7 K Interrupt Example ..................................
8.4.6.6
MMU (Trap through 250) .....................................
8.4.6.7
8.5

xiii

Internal Cabling Diagrams
A.1

Introduction....... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A-I

A.2

HSC Internal Cabling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A-I

A.3

HSC50 Internal Cabling ................... '.' . . . . . . . . . . . . . . . . . . . . . .

A-7

A.4

HSC50 (Modified) Internal Cabling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..

A-14

xiv

B

C

D

E

Contents

Exception Codes and Messages
B.1

Crash Dump Printout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

B-1

B.2

SINI-E Error Printout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

B-2

B.3

Submitting a Software Performance Report. . . . . . . . . . . . . . . . . . . . . . . . . . . .

B-2

B.4

Exception Messages ..............................................

B-4

Generic Error Log Fields
C.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

C-1

C.2

Error flags. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

C-2

C.3

MSCPITMSCP Status or Event Codes ................................

C-2

Interpretation of Status Code Bytes
D.1

Introduction.................. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

D-1

D.2

K-Detected Error Example Examination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

D-2

D.3

K-Detected Failure Code Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

D-3

Revision Matrix Charts
E.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

E-1

E.2

HSC Revision Matrix Chart ........... . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

E-1

E.3

HSC50 (Modified) Revision Matrix Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

E-6

E.4

HSC50 Revision Matrix Chart

E-11

Examples
6-1
6-2

Example HELP file display ........................................ .
Off-line RX33 Exerciser Data Patterns ............................... .
7-1 Example Patch of a File .......................................... .
&-1 MSCPITMSCP Error Message Format ............................... .
&-2 Controller Error Message Example .................................. .
&-3 MSCP SDI Error Example ........................................ .
8-4 Disk Transfer Error Example ...................................... .
&-5 Bad Block Replacement Error Example .............................. .
8-6 STI Communication or Command Error Example ....................... .
&-7 STI Formatter Error Log Example .................................. .
S-8 STI Drive Error Log Example ...................................... .
&-9 Tape Drive Related Error Message .................................. .
&-10 Additional Tape Drive-Related Error Message ......................... .
B-1 Crash Dump Example ............................................ .
B-2 SINI-E Exception Code ........................................... .
C-1 Error Log Fields Example ......................................... .

6-16
6-67
7-31
&-27
&-29
8-30

8-35
8-38
8-40
8-41
8-42
8-45
8-46
B-1
B-2
C-1

Contents

D-1

xv

K-detected Error Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

D-1

Redundant Cluster Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Cabinet Front View ..........................................
HSC Cabinet Inside Front View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Module Utilization Label Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Cabinet Inside Rear View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Cabinet Front View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Cabinet Inside Front View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Module Utilization Label Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Cabinet Rear View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Cabinet Inside Rear View ................ : . . . . . . . . . . . . . . . . . . .
HSC External Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 External Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Subsystem Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory IYlap (M.std2-LOl17) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Map (M.std-L0106) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Internal Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Specifications ..... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operator Control Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ControlslIndicators Inside Front Door. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX33 and dc Power Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 ControlslIndicators Inside Front Door. . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Maintenance Access Panel ...................................
Module LED Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Module Utilization Label Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LOl18 Module (DIP) Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L0107 Module (DIP) Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L0109 Module (DIP) Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
K.si Module (LOl19-YA) Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
881 Power Controller-Front Panel Controls ........................ . . .
881 Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Power Controller (60 Hz)-Front View. . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Power Controller (50 Hz)-Front View. . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Power Controller (60 Hz)-Rear View. . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Power Controller (50 Hz)-Rear View. . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC DC Power Switch. . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC 881 Power Controller Circuit Breaker ............................
HSC50 DC Power Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Line Power Circuit Breakers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC FRU Removal Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 FRU Removal Sequence ....... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC OCP SignallPower Line Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Maintenance Access Panel Connectors. . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Card Cage Cover Removal. . . . . . . . . . .. . . . . . . . . . . . .. . . . . . . . . . . . .

1-2
1-3
1--4
1-5
1-6
1-7
1-8
1-9
1-10
1-11
1-12
1-12
1-14
1-19
1-20
1-21
1-24
2-2

Figures
1-1
1-2
1-3
1--4
1-5
1-6
1-7
1-8
1-9
1-10
1-11
1-12
1-13
1-14
1-15
1-16
1-17
2-1
2-2
2-3
2--4

2-5
2-6

2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
2-15
2-16
2-17
3-1
3-2
3-3

3--4
3-5
3-6

3-7
3-8

3-9

2--4

2-5
2-6

2-7
2-9
2-10
2-13
2-14
2-15
2-16
2-18
2-19
2-20
2-21
2-23
2-24
3--4
3-5
3-6
3-7
3-8
3-9
3-10
3-12
3-13

xvi

Contents

3-10
3-11
3-12
3-13
3-14
3-15
3-16
3-17
3-18
3-19
3-20
3-21
3-22
3-23
3-24
3-25
3-26
3-27
3-28
3-29
3-30
3-31
3-32
3-33
3-34
3-35
3-36
3-37
3-38
3-39
3-40
3-41
3-42
3-43
3-44

3-45
3-46
3-47
3-48
3-49
3-50
3-51
3-52
3-53
3-54
3-55

HSC50 Card Cage Cover Removal ...................................
L0100 Node Address Switches ......................................
L0100-E21L0118 Node Address Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L0100 Jumper Configuration .......................................
L0118-B1 Jumper Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L0118-B2 Jumper Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L0109 Hardware Rev Level Switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L0107 Hardware Rev Level Switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
K.si Switchpack .................................................
L0105 Baud Rate Jumper. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC DC Power Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing the RX33 Cover Plate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX33 Disk Drive Removal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision Al Jumper Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision A3 Jumper Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 DC Power Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing the HSC50 TU58 Bezel Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disconnecting the HSC50 OCP Cables .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disconnecting the HSC50 TU58 Controller Cables . . . . . . . . . . . . . . . . . . . . . . .
TU58 Baud Rate Jumpers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing the HSC OCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing the HSC50 OCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
881 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC Airflow Sensor Assembly ...............
HSC50 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC50 Airflow Sensor Assembly. . . . . . . . . . . . . .
881 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC Main Cooling Blower ..................
HSC50 Power Controller Circuit Breaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC50 Blower. . . . . . . . . . . . . . . . . . . . . . . . . . . .
881 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the 881 Power Controller .............. ;.......
881 Total Off Connector ...........................................
HSC50 Power Controller Circuit Breaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC50 Power Controller . . . . . . . . . . . . . . . . . . . .
881 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Main Power Supply Cables and Test Points. . . . . . . . . . . . . . . . . . . . . . . .
Removing and Replacing the HSC70 Main Power Supply. . . . . . . . . . . . . . . . . .
HSC50 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Main Power Supply Cables and Voltage Test Points . . . . . . . . . . . . . . . .
Removing and Replacing the HSC50 Main Power Supply. . . . . . . . . . . . . . .. ..
881 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Auxiliary Power Supply Cable and Test Points. . . . . . . . . . . . . . . . . . . . ..
Removing and Replacing the HSC Auxiliary Power Supply . . . . . . . . . . . . . . . .
HSC50 Power Controller Circuit Breaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Auxiliary Power Supply Cable and Voltage Test Points .............

3-14
3-15
3-16
3-17
3-18
3-19
3-21
3-22
3-27
3-34
3-39
3-40
3-41
3-43
3-44
3-46
3-47
3-48
3-49
3-50
3-52
3-54
3-56
3-57
3-58
3-59
3-60
3-61
3-62
3-63
3-64

3-65
3-66
3-67
3-68
3-69
3-71
3-72
3-73
3-75
3-76
3-77
3-78
3-79
3-80
3-81

Contents

3-56
4-1
4-2
4-3
6-1
6-2
8-1
8-2
8-3
8-4

8-5
8-6
8-7
8-8
8-9
8-10
8-11
8-12
8-13
8-14
8-15
8-16
8-17
8-18
8-19
8-20
8-21
8-22
8-23
8-24
8-25
8-26
A-l
A-2
A-3
E-l
E-2
E-3

xvii

Removing and Replacing the HSC50 Auxiliary Power Supply ..............
Console Terminal Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Auxiliary or Maintenance Terminal Connection . . . . . . . . . . . . . . . . . . . . . . . . .
Operator Control Panel Fault Code Displays ...........................
P.ioj Switch Display Register Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
P.ioj Control and Status Register Layout ..............................
Operator Control Panel Fault Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 1 . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 26 . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .. . . . . . . . . . . . . . . . .
OCP Fault Code 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Fault Code 33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Boot Flow and Troubleshooting Chart ............................
HSC50 Boot Flow and Troubleshooting Chart. . . . . . . . . . . . . . . . . . . . . . . . . . .
Request Byte Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mode Byte Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Byte Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Controller Byte Field .............................................
GSS Text Field Bits Summary Breakdown. . . . . .. . . . . . . . . . . . . .. . . . . . . . .
RX33 Floppy Controller CSR Breakdown. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX33 Error Message Last Line Breakdown ............................
MMSRO Bit Breakdown ...........................................
HSC Internal Cabling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Internal Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 (Modified) Internal Cabling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
HSC Revision Matrix Chart .... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 (Modified) Revision Matrix Chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC50 Revision Matrix Chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..

3-82
4-2
4-3
4-6
6-79
6-81
8-3
8-4
8-4
8-5
8-5
8-5
8-6
8-6
8-6
8-7
8-7

8-9
8-11
8-11
8-16
8-22
8-32
8-33
8-33
8-34
8-46
8-51
8-52
8-57
A-2
A-8
A-15
E-2
E-7
E-12

Differences Between HSC Models. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HSC Module Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functions of Logic Module LEDs .......... :.........................
Ksi Switchpack Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Physical Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ksi New Microcode Load Conditions ....... . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1
1-14
2-10
3-27
3-28
3-32

8-8
8-8

Tables
1-1
1-2
2-1
3-1
3-2
3-3

xviii

Contents

3-4
5-1
5-2
5-3
6-1
6-2
6-3
7-1
8-1
8-2
8-3
8--4
8-5
8-6
8-7
8-8
8-9
8-10
8-11
8-12
8-13
8-14
8-15
8-16
8-17
8-18
8--19
8-20
8-21
8-22
8-23
8-24
8-25
8-26
8-27
8-28
B-1
C-1
C-2
C-3
D-1
D-2
D-3

RX33 Jumper Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ILTAPE Test Levels ..............................................
ILTCOM Header Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ILTCOM Data Patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RX33 Error Table. . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . .
RX33 Error Code Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trap and Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PATCH Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UPAR Register Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Program Bits ...... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Status of Requestors for Level 7 Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
P.ioj/c LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
M.std2 and M.std LEDs ......................................... . .
K.sdiJK.sti and K.si LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
K.ci (LINK, PI LA, K.pli) LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MSCPtrMSCP Error Message Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . .
MSCPtrMSCP Error Message Format Type Code Numbers. . . . . . . . . . . . . . . .
MSCPtrMSCP Error Flags. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MSCPtrMSCP Controller Error Message Field Descriptions ...............
MSCP SDI Error Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Request Byte Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mode Byte Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Byte Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Controller Byte Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disk Transfer Error Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Original Error Flags Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recovery Flags Field Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bad Block Replacement Error Field Definitions. . . . . . . . . . . . . . . . . . . . . . . . .
Replace Flags Field Bit Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
STI Communication or Command Error Printout Field Descriptions. . . . . . . . .
STI Formatter Error Log Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . .
STI Formatter E Log .............................................
STI Drive Error Log Field Descriptions ...............................
GEDS Text . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
STI Drive Error Log (TA78 Drive Product Specific) ......................
Status Register Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Obtaining Data Structure Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Generic Error Log Fields. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MSCPtrMSCP Status or Event Codes ................................
K.ci Status Code Bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
K.sdi Status Code Bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
K.sti Status Code Bytes ...........................................
D-4 K.si Disk Status Code Bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..
D-5 K.si Tape Status Code Bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..

3-42
5-30
5-32
5-33
6-5
6-6
6-15
7-28
8-9
8-9
8-10
8-12
8-13
8-13
8-13
8--27
8-28
8-28
8--29
8-30
8-32
8-33
8-33
8-35
8-36
8-37
8-37
8-38
8-39
8--40
8-42
8-42
8-43
8-43
8-43
8-51
B-3
C-1
C-2
C-2
D-4
D-7
D-10
D-12
D-13

About This Manual
This manual contains servicing information and procedures for the HSC70, HSC50 (modified),
HSC50, and HSC40 subsystems. In this manual, HSC refers to the HSC70 and HSC40 models.
HSC50 refers to the HSC50 and HSC50 (modified) models. Individual model names are used only
when the information is model specific.
This manual describes HSC controls and indicators, error reporting, field replaceable
units, troubleshooting, and diagnostic procedures. All information in this manual is
informational/instructional and is designed to assist service personnel with HSC maintenance.
Operational theory is included wherever such background is helpful to service personnel.
Installation procedures, most HSC utilities, and detailed technical descriptions are not included in
this manual. For source material on these and other subjects not within the scope of this manual,
refer to the list of related documentation below.
Audience

This manual is intended for use by Level 1 Digital Field Service Engineers and other personnel in
maintaining the components of the HSC controller subsystem.

Scope
This manual is divided into the following chapters:
1. General Information

2. Controls and Indicators
3. Removal and Replacement Procedures
4. Initialization Procedures
5. Device Integrity Tests
6. Offline Diagnostics
7. Utilities
8. Troubleshooting Techniques
9. Appendixes:
A. Internal Cabling Diagrams
B. Exception Codes and Messages
C. Generic Error Log Fields
D. Interpretation of Status Code Bytes
E. Revision Matrix Charts

xix

About This Manual

xx

Related Documentation

Documents related to the HSC are available under the following titles and part numbers:

•

HSC User Guide (AA-GMEAA-TK)

•

HSC Installation Manual (EK-HSCMN-IN)

•

HSC70 illustrated Parts Breakdown (EK-HSC70-IP)

•

HSC50 Illustrated Parts Breakdown (EK-HSC50-IP)

•

HSC50 Device Integrity Tests User Documentation (EK-IHSC5-UG)

•

HSC50 Offline Diagnostics User Documentation (EK-OHS-UG)

•

HSC50 Utilities User Documentation (EK-UHSC5-UG)

•

VT320 Owners Manual (EK-VT320-UG)

•

VT320 Programmer Pocket Guide (EK-VT320-HR)

•

VT320 Installation Guide (EK-VT320-IN)

•

VT220 Owners Manual (EK-VT220-UG)

•

VT220 Programmer Pocket Guide (EK-VT220-HR)

•

VT220 Installation Guide (EK-VT220-IN)

•

Installing and Using the LA50 Printer (EK-OLA50-UG)

•

LA50 Printer Programmer Reference Manual (EK-OLA50-RM)

•

Installing and Using the LA75 Printer (EK-OLA75-UG)

•

LA75 Printer Programmer Reference Manual (EK-OLA75-RM)

•

Star Coupler User Guide (EK-SCOOS-UG)

•

CI7BO User Guide (EK-CI7S0-UG)

•

DECwriter Correspondent Technical Manual (EK-CPL12-TM)

•

TU5B DECtape II User Guide (EK-OTU5S-UG)

These documents (except for the HSC User Guide) can be ordered from Publication and Circulation
Services, 10 Forbes Road, Northboro, Massachusetts 01532 (RCS code: NR12; mail code: NR031W3).
The HSC User Guide can be ordered from the Software Distribution Center, Digital Equipment
Corporation, Northboro, Massachusetts 01532.
NOTE

Please consult the HSC Software Release Notes for the latest hardware revision levels.

General Information

1-1

1
General Information
1.1 Introduction
This chapter includes general information about the Hierarchical Storage Controllers (HSC) mass
storage server, including:

•
•
•
•
•
•

Cabinet layout
Software overview
Subsystem block diagram
Module descriptions
Maintenance features
Specifications

NOTE
In this manual "HSC" refers to the HSC70 and HSC40 models. "HSC50" refers to the
HSC50 and HSC50 (modified) models. Individual model names are used only when the
information is model-specific.

Table 1-1 shows the major differences between the various HSC models. Note that the HSC70
supports a combination of eight disk and tape data channels, the HSC50 supports a combination of
six disk and tape data channels, and the HSC40 supports a combination of three disk and tape data
channels.
Each disk data channel supports four drives over the standard disk interface (SDI). Each tape
data channel supports four tape formatters over the standard tape interface CSTI). Depending upon
which formatter is used, from one to four tape transports can be supported by each formatter.
Table 1-1

Differences Between HSC Models

HSC Contents

HSC70

HSC50
(Modifi.ed)

HSC50

HSC40

I/O control processor

LOllI

L0105

LOI05

L0111-YA

Memory

LOl17

L0105

10105

L0117

Number of data channels (disk +
tape)

8

6

6

3

Load devices

RX33

TU58

TU58

RX33

Power controller

30-24374

30-24374

70--19122

30-24374

Auxiliary power supply

Yes

Yes

No

No

Kit number HSC7X-AA1AB is available to upgrade the HSC40 to an HSC70.
1-1

1-2 General Information

The HSC controller subsystem can interface with multiple hosts using the computer interconnect
(CI) bus. One CI bus is included with the subsystem. In case of bus failure, each CI bus consists
of two paths (path A and path B). See Figure 1-1 for a sample five-node cluster configuration with
two HSCs and three host computers. In this figure, all three hosts access both HSCs over the CI
bus. Through dual-porting, both HSCs can access the tape formatter and the disks.
HOST
HOST
HOST

TERMINAL*

TERMINAL*
HSC

PRINTER

I

,;")/u.

*

HSC

PRINTER

CI INTERFACE
VIDEO OR LA12

Figure 1-1

Redundant Cluster Configuration

CXO-88SB

General Information

1-3

1.2 HSC Cabinet Layout
HSC logic and power systems are housed in a modified H9642 cross-products cabinet with both
front and rear access. Figure 1-2 shows a front view of the cabinet.

- .. -

Figure 1-2

HSC Cabinet Front View

The front of the HSC cabinet contains the operator control panel (OCP) switches and indicators.
Switch operation and indicator functions are described in Chapter 2.

To access the cabinet interior, open the front door with a key. The door key is part of the door-lock
mechanism (part number 12-25411-01). Figure 1-3 shows the HSC cabinet with the front door
open.
The upper right-hand portion of the cabinet houses two RX33 dual drives and connectors for the
OCP.
The HSC70 contains two power supplies. The HSC40 contains one power supply. The power
supplies are housed under the RX33 drives. Each power supply has a fan drawing air from the
front of the cabinet across the power unit and exhausting it through a rear duct.

1-4 General Information

CARD
CAGE

Figure 1-3

AUXILIARY
POWER
SUPPLY

HSC Cabinet Inside Front View

A 14-slot card cage with a corresponding backplane provides housing for the L-series extended hex
HSC logic modules. The card cage occupies the upper left corner of the cabinet. Above the card
cage is a module utilization label indicating the slot location of each module. Figure 1--4 shows a
typical HSC module utilization label. All unassigned slots in the backplane contain baffles.

General Information

1-5

(;
(/)
(/)

(I)
()

~

Q..

ei:
o

::,:0
(1)0
a:::::

Bkhd X
Req

10 9

8

7

6

5

4

3

2

1

CXO-889A

Figure 1-4

HSC Module Utilization Label Example

NOTE

Requester slots A, B, C, D, E, F, M, and N, illustrated in Figure 1-4, are optional tape
or disk data channels. Optional slot labels are blank when no module is present.
Appropriate labels are provided with each data channel option ordered.
Open the cabinet rear door with a 5/32-inch hex key. A rear view of the cabinet with the back
door open is shown in Figure 1-5. The backplane logic modules are cooled by a blower mounted
behind the card cage. Air is drawn in through the front door louver, up through the modules, and
exhausted through the larger duct at the rear.

1--6

General Information

_~"""":IJ..I-,--

BLOWER
BLOWER
OUTLET
DUCT

W~~I1~~~~~~---INTERNAL

CICABLES

EXTERNAL
CICABLES
EXTERNAL
SICABLES
CXO-890B
Figure 1-5

HSC Cabinet Inside Rear View

NOTE

Figure 1-5 shows the blower motor outlet duct for current models. Earlier models have a
smaller blower motor outlet duct.
Two levels of cable connections are found in the HSC: backplane to bulkhead and bulkhead to
outside the cabinet. All connections to the logic modules are made through the backplane. All
cables attach to the backplane with press-on connectors.
The power controller is located in the lower left-hand rear corner of the HSC. The power control
bus, delayed output line, and noise isolation filters are housed in the power controller.
Exterior CI, SDI, and STI buses are shielded up to the HSC cabling bulkhead. These cables are
attached to bulkhead connectors located at the bottom rear of the cabinet. From the interior of the
I/O bulkhead connectors, unshielded cables are routed to the backplane.

General Information

1-7

1.3 HSC50 Cabinet Layout
HSC50 logic and power systems are housed in a modified H9642 cross-products cabinet with both
front and rear access. Figure 1-6 shows the front view of the cabinet.

---

Figure 1-6

HSC50 Cabinet Front View

On the front of the cabinet are the OCP switches and indicators. Switch operation and indicator
functions are described in Chapter 2.
To access the cabinet interior, open the front door with a key (part number 12-14664). Figure 1-7
shows the inside front view of the HSC50. The back of the front door contains two TU58 drives and
slots for tape storage.

1-8 General Information

TU58
DRIVE 0

TU58
DRIVE 1

TU58
RUN LEOs

TU58 TAPE
CARTRIDGE
STORAGE

Figure 1-7

HSC50 Cabinet Inside Front View

A 14-slot card cage with a corresponding backplane provides housing for the HSC50 L-series
extended hex logic modules. The card cage and backplane occupy the lower left corner of the
cabinet. Above the card cage is a module utilization label indicating the slot location of each
module (Figure 1-8). All unassigned slots contain baffles.

General Information

1-9

o

Q)

c
c
C\'l
.:.

Qj

rJ)
rJ)

C\'l

o
o

c
c

CD

0:

.&:.

o

o

<{

>-

cO

C\'l

as

0

;!>~
o CD ._
...JD:O

Bkhd X
Req

1

c

D

E

4

5

6

8

7

6

F

5

4

3

2

1

CXO-283B

Figure 1-8

HSC50 Module Utilization Label Example

NOTE

Requester slots A through F t as shown in Figure 1-8, are optional tape or disk data
channels. Optional slot labels are blank when no module is present. Appropriate labels
are provided with each data channel option ordered.
The upper right-hand portion of the cabinet houses the maintenance access panel. A dc power
on/off switch and connectors for the TU58, the OCp, and the maintenance terminal port are located
on this panel.
Power supply units are housed under the maintenance panel. A basic HSC50-AA/AB contains one
power supply capable of providing power for three data channels. A fourth data channel requires
the addition of an auxiliary power supply. Each power supply has a fan drawing air from the front
of the cabinet across the power unit and exhausting it through a rear duct. Figure 1-9 shows the
back of the HSC50 cabinet. The rear door is opened with a 5/32-inch hex key.

1-10 General Infonnation

=---~---

",,"11"11"""""""'"

""'' ' ' ' ' "',' ,'"'111111111""""",,,,,,'' ' ' ' ' ',',
,,,,,,,,,'111'
"'111""""""",,""111
"""'' ' ' ' ',',',','"' "' "'11"""""",,,,,,,,'' ' ' ' '

""'"""""
"""""""""""""",
"""""""""""""'
"II"""""""""""'""
""""""",,"""",""

!!I!!!!!!!!!!!!!!!!!!!!!

BACK DOOR LATCH
(HEX LOCK)
CXO-004A

Figure 1-9

HSC50 Cabinet Rear View

Logic modules are cooled by a blower mounted behind the card cage as shown in Figure 1-10. Air is
drawn in through the front door louver, up through the modules, and exhausted through the middle
duct at the rear.

General Information

1-11

COOLING
BLOWER

POWER
CONTROLLER
AC LINE
CORD

Figure 1-10

EXTERNAL
CABLES

HSC50 Cabinet Inside Rear View

Two levels of cable connections are found in the HSC50: backplane to bulkhead and bulkhead to
outside the cabinet. All connections to the logic modules are made through the backplane. All
cables attach with press-on connectors to the backplane.
The power controller is in the lower left-hand rear corner of the HSC50. Also at the rear of the
HSC50, the power control bus and delayed output line are connected to noise isolation filters.
Exterior CI, SDI, and STI buses are shielded up to the HSC50 cabling bulkhead. These cables are
attached to bulkhead connectors located at the bottom rear of the cabinet.
From the interior of the I/O bulkhead connectors, unshielded cables are routed to the backplane
and are attached with press-on connectors.

1.4 Externallnterfaces
Figure 1-11 shows the external hardware interface lines used by the HSC, and Figure 1-12 shows
the external hardware interface lines used by the HSC50.

1-12 General Information

CI BUS----ONE OR MORE HOST COMPUTERS
(4 CABLES: 2 PATH A, 2 PATH B)
SOl B U S - - - - DISK DRIVES
(ONE CABLE PER DISK DRIVE)
STI BUS - - - - TAPE FORMATTER
(ONE CABLE PER FORMATTER)
HSC70
CONTROLLER

A S C I I - - - - - CONSOLE TERMINAL
SERIAL LINE
(110 BULKHEAD J60)
ASCII - - - - - (NOT USED)
SERIAL LINE
A S C I I - - - - - (NOT USED)
SERIAL LINE
RX33 DISK DRIVE }
SIGNAL INTERFACE
BACKPLANE J18
RX33 DISK DRIVE
SIGNAL INTERFACE
CXO-928C

Figure 1-11

HSC External Interfaces

CI BUS----ONE OR MORE HOST COMPUTERS
(4 CABLES: 2 PATH A, 2 PATH B)
SOl B U S - - - - DISK DRIVES
(ONE CABLE PER DISK DRIVE)
HSC50
CONTROLLER

STI BUS - - - - TAPE FORMATTER
(ONE CABLE PER FORMATTER)
A S C I I - - - - - LOCAL TERMINAL
SERIAL LINE
ASCII-----TU58 CONTROLLER
SERIAL LINE
A S C I I - - - - - HAND-HELD TERMINAL

CXO-006C

Figure 1-12

HSC50 External Interfaces

General Information

1-13

The external hardware interface lines perform the following flUlctions:
Line

Function

CI bus

Four coaxial cables (BNCIA-xx): two-path (path A and path B) serial
bus with a transmit and receive cable in each path. This is the
communication path between system host(s) and the H8C.

8Dlbus

Four shielded wires for serial communication between the H8C and
the disk drives (one SDI cable per drive per controller) (BC26V-xx).

8TI bus

Four shielded wires for serial communication between the H8C and
the tape formatter (one 8TI cable per formatter) (BC26V-xx).

ASCII serial line

R8-232-C cable for local console terminal communication with the I/O
control processor module.

ASCII serial line

R8-232-C cable in the HSC50 to link the TU58 controller to the
cabinet.

RX33 disk drive signal interface

Cable linking RX33 drives with the RX33 controller on the M.std2
module of the H8C.

ANSII hand held terminal

R8-232-C cable for hand held terminal communications with the I/O
Control Processor module of the H8C50.

1.5 HSC Hardware Overview
The HSC is a multimicroprocessor subsystem with two shared memory structures: one for control
and one for data. In addition, the HSC I/O control processor fetches its own instructions from a
private (Program) memory. Figure 1-13 shows a subsystem block diagram. Each major block is a
module unless otherwise specified.

1-14 General Information

r------------,

I

HOST INTERFACE K.CI

PLI BUS

PORT
PROCESSOR

-

-

INPUT/OUTPUT
CONTROL
PROCESSOR

CONTROL BUS
...

P.IOC/LO 105
OR
P.IOJ/L0111

DATA BUS
K.PLI

-.

PILA

...

-

L0118
OR
L0100

LINK
CI
L--PATH A

,~

- -

~-

'f

r-----

-

CI
-PATH .J
B

I

CI PATH-A

...l

CI PATH B ~ \

SC008
STAR
COUPLER

...

~}OTHER
......

DISK DATA
CHANNEL
MODULE(S)

..

: : .}
~

K.SI/L0119
OR
K.SDI/LO 108-Y A

~

I"""'It"

r-f4-

~
TAPE

TUS8
DRIVE

RX33
DRIVE

..

TAPE
TRANSPORT

......

TAPE
TRANSPORT

DRIVES

K.SI/L0119
OR
K.STI/L01 08-YB

--..

-

---.

MAGTAPE
FORMATTER
TA78, ETC

TERMINAL

OPERATOR
CONTROL
PANEL

--

.....

TAPE DATA
CHANNEL
MODULE(S)

,~--,

-

L

~~

PORT
LINK

III BUS

--

--

-

M.STD/L010S
OR
M.STD2IL0117

L0109

-

_ PROGRAM BUS

MEMORY
MODULE

~

-

-

L0107-YA

PORT
BUFFER

~

ASCII PORT SERIAL
_ LINE INTERFACE
...

OTHER DISK
DRIVES
DISK DRIVE
RA81 , RASO,
ETC

---. TAPE
TRANSPORT
~

TAPE
TRANSPORT
CXO-1929B

Figure 1-13

HSC Subsystem Block Diagram

References to logic modules by their engineering terms appear throughout HSC documentation, as
well as on diagnostic printouts. Refer to Table 1-2 for a cross-reference of HSC module names.
Table 1-2 HSC Module Names
Module
Name

Eugineering
Name

Port link

LINK
or
InterprocessorLINK
Interface (ILl)

Module
Designation

LOIOO, Rev E2
or

LOllS

Port buffer

PILA

LOI09

Port processor

K.pli

LOI07

General Information

Table 1-2 (Cont.)

1-15

HSC Module Names

Module
Name

Engineering
Name

Module
Designation

Disk data channel
or
Data channel

K.sdi
or
K.si

LOI08-YA
or
L0119-YA

Tape data channel
or
Data channel

K.sti
or
K.si

LOI08-YB
or
L0119-YA

Input/output control processor

P.ioj
P.ioj
P.ioc

LOllI (HSC70)
LOIII-YA (HSC40)
LOI05 (HSC50)

Memory

M.std2
M.std

LOl17 (HSC)
LOI06 (HSC50)

Host interface

K.ci

Consists of:
Port link (LINK or ILl),
Port buffer (PlLA), and
Port processor (K.pli) modules

1.5.1 Port Link Module (LINK) Functions
The port link module (LOIOO-E2 or LOl18) is a part of the host interface module set (Kci). With
all configuration switches and jumpers in default positions, the LOl18 is functionally identical with
the LOIOO-E2. The location and default positions are described in Chapter 3. The port link module
performs the following functions.
•

Serializationldeserialization, encoding/decoding, dc isolation- Permits transmission of
a self-clocking stream over the CI. Information transmitted over the CI bus is serialized and
Manchester encoded. The driver circuit includes a transformer for ac coupling the encoded
signal to the coaxial cable. Information received from a CI transmission is decoded and
converted to bit-parallel form. The circuitry also provides carrier detection for determining
when the CI is in use by another node.

•

Cyclic redundancy check (CRe) generation/checking-Checks the 32-bit CRe character
generated and appended to a message packet when it is received. Also generates the 32-bit
CRC character during the transmission of a packet. An incorrect CRC means either errors were
induced by noise or a packet collision occurred.

•

ACKINACK generation-Generates an ACK upon receipt of a packet addressed to the LINK

if the following conditions exist:
Error-free CRC
Buffer space available for the message
Upon receipt of a packet addressed to this node, a NACK is generated if the following conditions
exist:
Error-free CRC
No buffer space available for the message
No response is made if a packet addressed to this node is received with CRC error or the node
address is incorrect.
•

Packet transmission-Performs the following functions:
Executes the CI arbitration algorithm

1-16 General Information

Transmits the packet header
Moves the stored information from the transmit packet buffer to the Manchester encoder
Calculates and appends the CRC to the end of the packet
Receives the expected ACK packet
•

Packet reception-Perfonns the following functions:
Detects the start of the CI transmission
Detects the sync characters
Decodes the packet header information
Checks the CRC
Moves the data from the Manchester decoder
Return.s the appropriate ACK packet

The port link modUle interfaces through line drivers/receivers directly to the CI coaxial cables.
On the HSC interior side, the port link module interfaces to the port buffer module through a set
of interconnect link signals. The port link module also interfaces to the port processor module
(indirectly through the port buffer module) using a set of port link interface (PLI) signals.

1.5.2 Port Buffer Module (PI LA) Functions
The port buffer module (LOI09) provides a limited number of high-speed memory buffers to
accommodate the difference between the burst data rate of the CI bus and HSC internal memory
buses. It also interfaces to the port link (CI link) module through the ILl signals and the port
processor module through portllink interface (PLI) signals.

1.5.3 Port Processor Module (K.pli) Functions and Interfaces
The port processor module (LOI07-YA) performs the following functions:
•

Executes and validates low-level CI protocol

•

Moves command/message packets to/from HSCcontrolmemory and notifies the correct server
process of incoming messages

•

Moves data packets to/from HSC data memory

The port processor module interfaces to three buses:
•

PLI bus interfaces the port buffer and port link modules

•

Control memory bus interfaces HSCcontrolmemory

•

Data memory bus interfaces HSC data memory

1.5.4 Disk Data Channel Module (K.sdi) Functions
Disk data channel module (LOI08-YA) operation is controlled by an onboard microprocessor with
a local programmed read-only memory (PROM). This data channel module performs the following
functions:
•

Transmits control and status information to the disk drives

•

Monitors real-time status information from the disk drives

•

Monitors in real-time the rotational position of all the disk drives attached to it

•

Transmits data between HSC data memory and the disk drives

General Information

•

1-17

Checks the error detection code (EDC) and generates or checks the error correction code (ECC)
during read/write operations.

Commands and responses pass between the disk data channel microprocessor and other internal
HSC processes through control memory. The disk data channel module interfaces to the control
memory bus and to the data memory bus. It can also interface to four disk drives with four
individual SDI buses. Currently, combinations of up to eight disk data channel or tape data
channel modules are possible in the HSC70. The HSC50 supports combinations of up to six disk
data channel or tape data channel modules and the HSC40 supports combinations of up to three
disk data channel or tape data channel modules. Configuration guidelines are found in the HSC
Installation Manual (EK-HSCMN-IN).

1.5.5 Tape Data Channel Module (K.sti) Functions
Tape data channel module (LOl08-YB) operation is controlled by ali onboard microprocessor with
a local programmed read-only memory (PROM). The tape data channel performs the following
functions:
•

Transmits control and status information to the tape formatters

•

Monitors real-time status information from the tape formatters

•

Transmits data between the data memory and the tape formatters

•

Generates an error detection code (EDC) for each 512 bytes during a write operation. The tape
formatter generates and sends an EDC every 512 bytes during a read operation.

Commands and responses pass between the tape data channel microprocessor and other
internal HSC processes through control memory. The tape data channel module interfaces to
thecontrolmemory bus and to the data memory bus.

1.5.6 Data Channel Module (K.si) Functions
Data channel module (LOl19-YA) is an interface between the HSC and the standard disk interface
(SD!) or standard tape interface (ST!) bus and is a direct replacement for the K.sdi or K.sti data
channel modules. The K.si is configured for disk or tape interface when the HSC is initialized (see
Chapter 4). The K.si functions are the same as the functions for the K.sdi or K.sti.

1.5.7 1/0 Control Processor Module (P.ioj/c) Functions
The HSC70 P.ioj module .(LOlll) and the HSC40 P.ioj module (LOlll-YA) use a PDP-11 ISP (J-11)
processor. The HSC50 and HSC50 (modified) both use the P.ioc module (LOl05), with a PDP-11
ISP (F-ll) processor. Both contain memory management and memory interfacing logic. These
processors execute their respective HSC internal software. The input/output (110) control processor
modules also contain the following functional blocks:
•

Bootstrap read-only memory (ROM)

•
•

Arbitration and control logic for the control and data buses
Program-addressable registers for subsystem initialization and OCP communications

• Processes for all parity checking and generation for its accesses to memory

•

Program memory instruction and data cache, 8 Kbytes of direct map high-speed memory (HSC
only)

The 110 control processor modules interface to:
•

Program memory on the Program memory bus

•

Control memory through the signals of the backplane control bus

1-18 General Information

•

Data memory through signals of the backplane Data bus

•

Console tenninal RS-423 compatible signal levels (HSC only)

•

TU58 tape drives (HSC50 only)

•

Auxiliary terminal through an RS-232-C interface (HSC50 only)

1.5.8 Memory Module (M.std2) Functions
The HSC memory module (LO 117) contains three separate and independent system memories, each
residing on a different bus within the HSC. In addition, the memory module contains the RX33
diskette controller. The three memory systems and RX33 diskette controller are known as:
•

Control memory (M.ctl)-Two banks of 256 Kbytes of dynamic RAM for subsystem control
blocks and interprocessor communication structures storage.

•

Data memory (M.dat)-512 Kbytes of status RAM to hold the data from/to a data channel
module.

•

Program memory (M.prog)-l megabyte of RAM for the control program loaded from the
RX33 diskette.
CAUTION

The switch pack on the M.std2 module is factory set to calibrate the RX33 diskette
controller. Do not change the setting of this switch pack; the switch settings
are unique to each module and cannot be restored outside of the manufacturing
environment.
•

RX33 diskette controller (K.rx)-Resides on the Program bus and performs direct memory
access word transfers when reading or writing data to/from the RX33 diskette.

Using .physical addresses, the memory space allocations for the three memories are illustrated in
Figure 1-14.

General Information

1-19

22-BIT ADDRESS ALLOCATION
ADDRESS

SPACE

17777777

110 PAGE

17770000
17767777
17760000
17757777

BUS

CONTROL
WINDOWS

16000000
15777777
14000000
13777777
04000000
03777777

COMMENT

INTERNAL

2KW

INTERNAL REGISTERS

CBUS

2KW

RESERVED ADDRESSES

NONE

248 KW

NOT ACCESSIBLE

CBUS

256 KB (X2)

CONTROL MEMORY

DB US

512 KB

DATA MEMORY

PBUS

2 MB

EXPANSION ROOM

UNDEFINED
'r

17000000
16777777

SIZE

M.CTL

M.DAT

UNUSED

M.PROG
PBUS

PROGRAM MEMORY

00000000
1 MB

0-4000 RESERVED
FOR TRAP VECTORS
CXO-931A

Figure 1-14

Memory Map (M.std2-L0117)

NOTE

Two completely redundant memory banks make up control memory. Only one bank at a
time is usable during functional operation. Bank failure detection and bank swapping
are done at boot time.
The interface to the control memory is through the backplane control bus, and to the data memory
through the backplane Data bus. The interface to the 110 control processor local Program memory
is through a set of backplane signals to the Program memory module. In addition, the memory
module houses the control circuitry for the RX33 disk drives.

1.5.9 Memory Module (M.std) Functions
The memory module (LOI06) used in the HSC50 contains the following three independent and
separate memories:
•

256 Kbytes of Program memory (M.prog}-This is space for the control program loaded from the
TU58.

•

128 Kbytes of control memory (M.ctl}-This is space for the routines initiating data transfer
action.

•

128 Kbytes of data memory (M.dat}-This is space to hold the data from/to a data channel
module.

1-20 General Information

Using physical addresses, the memory space allocations for the three memories are illustrated in
Figure 1-15.
22-BIT ADDRESS ALLOCATION
ADDRESS

SPACE

17777777

1/0 PAGE

17770000
17767777

CONTROL
WINDOWS

17760000
17757777

:
17000000
16777777
16400000
16377777
16000000
15777777
14400000
14377777
14000000
13777777
01000000
00777777

BUS

SIZE

COMMENT

INTERNAL

2KW

INTERNAL REGISTERS

CBUS

2KW

RESERVED ADDRESSES

NONE

248 KW

NOT ACCESSIBLE

CBUS

64KW

EXPANSION ROOM

CBUS

64KW

CONTROL MEMORY

DBUS

192 KW

EXPANSION ROOM

DBUS

64KW

DATA MEMORY

PBUS

1.5 MW

EXPANSION ROOM

PBUS

128 KW

PROGRAM MEMORY

UNDEFINED
:r

UNUSED

M.CTL

UNUSED

M.DAT

UNUSED

M.PROG

00000000
0-4000 RESERVED
FOR TRAP VECTORS
CXO-338B

Figure 1-15

Memory Map (M.std-L0106)

The interface to the control memory is through the backplane control bus, and to the data memory
through the backplane data bus. The interface to the I/O control processor local Program memory
is through a set of backplane signals to the control memory module.

1.6 HSC Software Overview
The HSC subsystem uses inteInal software to perform various tasks and to interface with an
operator through a dedicated terminal. TheHSC Software Release Notes for your version of
software describes the unique features of the software. These software release notes are shipped
with each HSC and with updates of the software. The major HSC software modules are shown at a
block level in Figure 1-16.

General Information

HOST CPUs

TAPES

I

1-21

DISKS

I

I

K.CI

K.STI

K.SDI

CI
MANAGER

STI
MANAGER

SOl
MANAGER

DIAGNOSTIC
SUBROUTINES

UTILITY
PROCESSES

TAPE
I/O
MANAGER

DISK
I/O
MANAGER

DIAGNOSTIC
MANAGER

UTILITIES
MANAGER

MSCP
PROCESSOR

DISK
ERROR
PROCESSOR

CONTROL PROGRAM

TU58 OR
RX33 DRIVES

Figure 1-16

TERMINAL
CXO-1928A

HSC Internal Software

The HSC control prograin is found on the system diskette for the HSC and the system tape
for the HSC50. This module is the lowest level manager of the subsystem, provides a set of
subroutines and services shared by all HSC processes. The HSC control program performs the
following functions:
•

Interprets incoming utility requests

•

Sets up the appropriate subsystem environment for operation of the requested utility

•

Invokes the utility process

•

Returns the subsystem to its normal environment upon completion of the utility execution

•

Initializes and reinitializes the subsystem

•

Executes all auxiliary terminal I/O

•

Schedules processes (both functional and diagnostic) for execution by the P.ioclj

•

Provides a set of system services and system subroutines to HSC processes

•

Manages the RX33 local storage media (HSC only)

•

Manages the TU58 local storage media (HSC50 only)

1-22 Generallnformation

Functional processes within the HSC communicate with each other and the HSC control program.
They communicate through shared data structures and send/receive messages.
The MSCP class server validates, interprets, and routes incoming MSCP commands and
dispatches MSCP completion acknowledgments. The following are part of the MSCP class server:
•

The SDI manager handles the SDI protocol, responds to attention conditions, and manages the
on-lineloff-line status of the disk drives.

•

The disk 110 manager translates logical disk addresses into drive-specific physical addresses,
organizes the data-transfer structures for disk operations, and manages the physical positioning
of the disk heads.

The CI manager handles virtual circuit and server connection activities.
The disk error processor responds to all detected error conditions. It reports errors to the
diagnostic manager and attempts to recover from errors, such as ECC, bad block replacement,
and retries. When recovery is not possible, a diagnostic is run to determine if the subsystem can
function without the failing resource. Then, appropriate action is taken to remove the failing
resource or to terminate subsystem operation.
The TMSCP class server sets up the data transfer structures for tape operations and manages
the physical positioning of the tape. The STI manager is the part of the TMSCP class server that
handles the STI protocol, responds to attention conditions, and manages the on-line/off-line status
of the tape drives.
The diagnostic manager handles all diagnostic requests, error reporting, and error logging. It
also provides decision-making and diagnostic-sequencing functions, and can access a large set of
resource-specific diagnostic subroutines.
The diagnostic subroutines run under the control of the diagnostic manager and are classified as
device integrity tests.
The utility processes perform volume-management functions such as formatting, disk-to-disk
copy, disk-to-tape copy, tape-to-disk restore. They also handle miscellaneous operations required
for modifying subsystem parameters, such as COPY, PATCH, and error dump, and are used in
analyzing subsystem problems.

1.7 HSC Maintenance Strategy
Maintenance of the HSC is accomplished with field replaceable units (FRUs). Procedures for
removal and replacement are described in Chapter 3. Do not attempt to replace or repair
component parts within FRUs.
Isolation of solid failures can be accomplished efficiently due to the logical partitioning of the
modules and extensive internal diagnostics. In addition to the device-resident diagnostics, the
HSC-resident off-line diagnostics are available to support and verify corrective maintenance
decisions.

1.7.1 Maintenance Features
The following features assist in troubleshooting the HSC:
•

Self-contained and self-initiated diagnostics-On initialization, various levels of diagnostics
execute in the HSC. Read-only memory (ROM) diagnostics test each microprocessor in the disk
and tape data channels, port processor, and I/O processor modules. Pressing the HSC lnit
button starts all internal ROM diagnostics.

•

Operator control panel fault code display-The OCP or the console terminal displays any
failures. If further diagnostics are needed, use the terminal to initiate diagnostics stored on the
system boot media or the off-line diagnostic media (RX33 diskettes for the HSC or TU58 tapes
for the HSC50).

General Information

1-23

•

Console terminal-After initialization, the operator can use the console terminal to run on-line
device integrity tests (see Chapter 5) or off-line diagnostic tests (see Chapter 6). Also, certain
resource failure detections can initiate tests automatically.

•

Module LED indicators-All logic modules have at least one LED to indicate board status. See
Chapter 2 for the location of these LEDs.

The HSC subsystem allows logical assignment of a disk drive or tape formatter to the diagnostics.
Device integrity tests allow drive diagnosis, even though other active drives are connected to the
HSC.
Background (periodic) diagnostics test HSC logic not currently in use by the subsystem. Failures
cause the HSC to reboot and execute the initialization diagnostics.
Requestor-detected data memory errors cause an initiation of the in-line memory diagnostics to test
the buffer causing the error. Failures found in any data buffer cause removal of that buffer from
service. If no failure is found, the tested buffer is returned to service. If the same buffer is sent to
test twice, it is retired from service, even though no failure is found.

1.8 Specifications
Figure 1-17 lists the HSC physical and environmental specifications.

1-24 General Information

OPTION DESIGNATION

DESCRIPTION

HSCXX-AA = 60 HZ, 120/180 V

HSC MASS STORAGE SERVER

HSCXX-AB = 50 HZ, 380/415 V
MECHANICAL
WEIGHT

HEIGHT

WIDTH

DEPTH

MOUNTING
CODE

LBS

KG

IN

CM

IN

CM

IN

CM

FS

400

181.2

42

106.7

21.3

54.1

36

91.4

CAB TYPE
(IF USED)
MODIFIED
H9642

POWER (AC)
AC VOLTAGE
TOLERANCE

FREQUENCY AND
TOLERANCE

120/208

104-128/180-222

380/415

331-443

AC VOLTAGE
NOMINAL

PHASE

STEADY-STATE
CURRENT (RMS)

POWER CONSUMPTION
(MAX)

60 HZ :! 1

3

17

2250 WATTS

50 HZ :! 1

3

9

2245 WATTS

POWER (AC)
AMP (MAX) BY PHASE

=1
PHASE B = 12

120 V

PHASE A = 1

380 V

PHASE A

PHASE B = 7

= 12
NEUTRAL = 17

PHASE C = 7

PHASE C

NEUTRAL

=9

POWER (AC)
PLUG TYPE

POWER CORD LENGTH

INTERRUPT TOLERANCE

APPARENT POWER (KVA)

NEMA - L21 - 30P

15 FT (4.5 M)

4 MS (MIN)

3.4 (KVA)

HUBBELL - 520 P6

15 FT (4.5 M)

4 MS (MIN)

3.4 (KVA)

POWER (AC)
HSC OPTION

INRUSH CURRENT

HSCXX - AA

70 AMPS/PHASE

16 MS

HSCXX - AB

70 AMPS/PHASE

20 MS

SURGE DURATION

DEVICE ENVIRONMENT
TEMPERATURE
OPERATING*

RELATIVE HUMIDITY

STORAGE

0

.40 - 151 F

0

.40 - 66 C

59 - 90 F
15 - 32 C

OPERATING

STORAGE

0

0

RATE OF CHANGE

HEAT DISSIPATION

TEMP

HUMIDITY

60 HZ

50 HZ

20%/HR

7676 BTu/HR

8078 KJ/HR

0

20 - 80%

5 - 95%

20 F/HR
0

11 C/HR
DEVICE ENVIRONMENT

AL TlTUDE (MAX)

AIR VOLUME (AT INLET)

OPERATING

STORAGE

8000 FT

30,000 FT

2.4 KM

9.1 KM

AIR QUALITY

FT3/MIN

M3/MIN

PARTICLE COUNT (MAX)

210

5.92

N/A

0

*ALTITUDE CHANGES: DERATE THE MAXIMUM TEMPERATURE 1.8 C PER THOUSAND METERS
0
(1.0 F PER THOUSAND FEET).

Figure 1-17

HSC Specifications

CXO-2023A

Controls and Indicators

2-1

2

Controls and Indicators
2.1

Introduction

This chapter describes the following controls and indicators located in five areas of the HSC and
HSC50:
•

HSC
l.

Operator control panel (OCP)

2.

Inside front door

3. RX33 disk drives
4. Logic modules

5. Power controller

•

HSC50
l.

Operator control panel (OCP)

2. Inside front door (TU58 tape drives)

3. Maintenance access panel
4. Logic modules

5. Power controllers (60 Hz and 50 Hz)

2-1

2-2

Controls and Indicators

2.2 Operator Control Panel (OCP)
Figure 2-1 illustrates the controls and indicators on the OCP.
MOMENTARY
CONTACT
SWITCH

MOMENTARY
CONTACT
SWITCH

ALTERNATE
ACTION
SWITCH

I

\

/

\,

I

@
State

Figure 2-1

0
Power

Operator Control Panel

The OCP controls and indicators are described in the following list:

•

State and Init indicators-Describes the state of the HSC. Under runtime conditions, the
lnit indicator is off while the State indicator is pulsing. During initialization, these indicators
change to reflect the current initialization phase of the subsystem. Refer to the bootstrap
flowchart in Chapter 8 for details on these phases.

•

Init switch-Pushing the Init switch causes the HSC to start its initialization routine. The
SecurelEnable switch must be in the enable position for this switch to be operational. Holding
the lnit switch in causes the console terminal to loop back.

•

Power indicator-Goes off if the dc voltage levels drop below one-third of minimal. The power
indicator is driven from a dc comparator circuit on the I/O Control Processor module (L0111 on
the HSC70, L0111-YA on the HSC40, or L0105 on the HSC50 and HSC50 (modified)), which
constantly monitors the +5, +12, and -5.2 voltages. The power indicator also is driven by a logic
gate that monitors the Power Fail signal from the power supplies. If this signal is asserted, the
power indicator goes off.
NOTE

An on power indicator does not mean these voltages are within specification (:t5
percent).
•

Fault indicator and switch-Comes on when the HSC logic detects a fault. The Fault switch
is also used for the OCP lamp test.
Fault codes-When the Fault switch is pressed and released, the lamps in Init, Online,
Fault, and the two blank switches function as an error display. If the fault code is a hard
fatal error, the fault code blinks on and off until the HSC is powered down or the Fault
switch is pressed again.

Controls and Indicators

2-3

If the displayed fault code is a soft (nonfatal) failure, the fault code clears on subsequent
toggling of the Fault switch. Multiple soft fault codes can be queued in the fault code buffer.
Subsequent toggling of the Fault switch displays each soft fault code until the buffer is
emptied.
Soft fault codes are identified by the Fault indicator on (or displayed fault code) while the
State indicator is pulsing. With soft faults, the HSC continues to operate without use of
the failing resource. Hard fault codes are identified by the fault indicator on (or displayed
fault code) while the HSC State indicator is not pulsing. With hard faults, the HSC does
not continue operation until the failure is remedied.
Error codes associated with the OCP display are defined in Chapter 4 and in Chapter 8.
Lamp test-Pushing and holding the Fault switch causes all the OCP indicators to light
and function as a lamp test. Even if the Fault indicator is already on before the switch is
pushed, the lamp test can be executed.
•

Online switch-Puts the HSC logic in the available state when pushed to the in position and
allows a host to establish a virtual circuit with the HSC. When this switch is released to the
out position, no new virtual circuits can be made.

•

Online indicator-Shows a virtual circuit exists between the HSC and a host CPU when the
Online indicator is on. When this indicator is off, no virtual circuits are established with any
host.

•

Blank indicators-Forms the lowest two bits of a five-bit fault code.

2.3 HSC Inside Front Controls and Indicators
Figure 2-2 shows the controls and indicators available when the front door is opened.

2-4

Controls and Indicators

SECURE/ENABLE
SWITCH

OCP SIGNAL/POWER
LINE CONNECTOR

Figure 2-2

Controls/Indicators Inside Front Door

Controls and Indicators

2-5

The following list describes the controls and indicators found on the HSC inside front door:
•

SecurelEnable switch-Disables the Init switch from the OCP when in the secure position.
Also, the SET utility program cannot run and the break key from the terminal is disabled. With
the SecurelEnable switch in the enable position, the Init switch and all the utility programs can
be used.
The SHOW utility is operable with the SecurelEnable switch in either position.

•

Enable indicator-Indicates the SecurelEnable switch is in the enable position when the
Enable LED is illuminated (all switches can be used). When the Enable indicator is off, the
OCP is secure.

•

RX33 LEDs-When lit, indicates which particular drive is in use. There is an LED on the
front panel of each drive. When not in use, the RX33 diskettes are stored inside the front door
(Figure 2-3).

DRIVE
COVER
PLATE

Figure 2-3

DRIVEIN-USE LEDs

RX33 and de Power Switch

2-6

•

Controls and Indicators

dc power switch-Located on the left side of the RX33 housing (Figure 2-3). When the dc
power switch is in the 0 position, the HSC is without dc power. Moving the switch to the 1
position restores dc power.

2.4 HSC50 Inside Front Door Controls and Indicators
Figure 2-4 shows the controls and indicators on the inside of the front door.

TUSS SELF-TEST
INDICATOR
(VIEWED FROM TOP)

TUSS TAPE
CARTRIDGE
STORAGE

ENABLE
LED

TUSS RUN
LEOs
CXO-003B_S

Figure 2-4

HSC50 Controls/Indicators Inside Front Door

The following list describes the controls and indicators found on the inside of the front door of the
HSC50:
•

SecurelEnable switch-With the SecurelEnable switch in the secure position, the lnit switch
is disabled from the OCP. Also, the SET utility program cannot run and the break key from
the terminal is disabled. With the SecurelEnable switch in the enable position, the lnit switch
and all the utility programs can be used. The SHOW utility is operable with the Secure'Enable
switch in either position.

•

Enable indicator-An illuminated Enable LED indicates the SecurelEnable switch is in
the enable position (all switches can be used). When the Enable indicator is off, the OCP is
secure.

Controls and Indicators

2-7

•

TU58 Run indicators-When a TU58 Run indicator is on, the TU58 is currently moving tape.
Data loss can occur if the tape is removed while this indicator is on. If the indicator is off, tape
is not in motion.

•

TU58 Self-Test indicator-The TU58 Self-Test indicator is found on the TU58 controller
module (Figure 2-4). The controller module is located inside the TU58 housing with the drive
mechanics. Observe the Self-Test indicator by looking down through the TU58 housing vents.
When this indicator is on, the TU58 controller has successfully completed self-diagnostics.

2.5 HSC50 Maintenance Access Panel Controls and Connectors
Removing the maintenance access panel cover reveals the dc power switch and several connectors
available for HSC50 maintenance (Figure 2-5).
DC POWER
SWITCH

OFF POSITION (0)

OCP
CONNECTOR

CONNECTORS
RESERVED FOR
FUTURE USE

MAINTENANCE
ACCESS PANEL

MAINTENANCE
TERMINAL
SIGNAL
CONNECTOR
CXO-014B

Figure 2-5

HSC50 Maintenance Access Panel

2-8

Controls and Indicators

2.5.1 HSC50 dc Power Switch
When the dc power switch is in the 0 position, the HSC50 is without dc power. Moving the switch
to the 1 position restores dc power.

2.5.2 HSC50 Maintenance Panel Connectors
Two of the connectors in the maintenance access panel are used to connect the maintenance
terminal to the HSC50. One connector supplies power to the maintenance terminal and the other
is the signal connector. Additional connectors are:
•

OCP connector

•

TU5S connectors

•

Connectors reserved for future use

2.6 Module Indicators
All logic modules have at least one LED to indicate board status. Figure 2--6 shows the locations
of these LEDs and the module utilization label. Additionally, three of these logic modules contain
specific switches.

Controls and Indicators

2-9

jLABEL

MODULE UTILIZATION

NODEADDRESS----~w.f

SWITCHES

SWITCH S-3
(REV E2)

I

D1 MICRO ODT

D2 SERIAL LINE UNIT

D3 MEMORY OK

D4 SEQUENCING

LINK BOARD
STATUS
INDICATORS

e
o
@

RED
AMBER
GREEN
CXO-933B

Figure 2-6

Module LED Indicators

2-1 0

Controls and Indicators

NOTE

Figure 2-6 and Figure 2-7 shows a typical HSC module configuration. The disk and tape
data channel module combinations vary as follows between the HSC models:
The HSC70 supports up to 8 disk and tape data channel module combinations.
The HSC50 supports up to 6 disk and tape data channel module combinations.
The HSC40 supports up to 3 disk and tape data channel module combinations.
Figure 2-7 shows the HSC slot location for each of the modules.

0

~

i

:::i

m

t:

'5

Q;
t:
t:

Q;
t:
t:

Q)
t:
t:

Qj
t:
t:

Q)
t:
t:

Q)

t:
t:

Qj
t:
t:

.r:.
0

.r:.
0

.r:.
0

.r:.
0

.t:

.r:.
0

.r:.
0

0

as

as

U)
fI)

(I)

0

0

0

Q;
t:
t:

as

a

as

as

m

>:-

as m

->as
I

as m

CiS

C
Ceo
eo
o ".::t; o ".::t;
fI)
' r ' " > f I ) 'r'" >
o
(1).o (1)...JO::C -10::0

Mod

as

as

0

>-

as m
Cii >-

o

as

0

a

.s:::.

as m
as <:
Cii >Cii <:
rl> C ~
o .. ~ 'r'" ••
'r'" >
fI)
o (I) . - 'r'" >

C rl>
C
o ".::t;
o ".::t:
'r'" >
fI)
~ .~
o (1)...JQ:C ..JQ:C

rl>

U)
U)

CD
0

eC

0
E
CD

'r'"
'r'"

0

··0

o ~o

..JQ:C 3~~ ..Ja::::::

A

B

C

D

E

F

M

N

V

2

3

4

5

6

7

8

9

0

10 9

8

7

6

5

4

3

2

1

CXO-889A

Figure 2-7

HSC Module Utilization Label Example

Table 2-1 shows the functions of the various module LEDs.
Table 2-1

Functions of Logic Module LEOs

Module

Color

Function

LINK (LOIOO-E2)
LINK (LOllS)

Green

Board status-Indicates the node is either transmitting or receiving;
dims or brightens relative to the amount of local CI activity.

Red

Board status-Indicates the module is in the internal maintenance
mode.

Green

Board status-Indicates the operating software is running and that
all applicable diagnostics have completed successfully.

Red

Board status-Indicates an inoperable module except during
initialization when it comes on during module testing.

Amber

Always on when the HSC is on (used only for engineering test
purposes).

Green

Board status-Indicates the operating software is running and that
self-test module microdiagnostics have completed successfully.

PILA (LOI09)

K.pli (LOI07-YA)

Controls and Indicators

Table 2-1 (Cont.)
Module

2-11

Functions of Logic Module LEDs
Color

Function

Red

Board status--Indicates an inoperable module, except during
initialization, when it comes on during module testing.

Green

Board status-Indicates the operating software is running and that
self-test module microdiagnostics have completed successfully.

Red

Board status--Indicates an inoperable module, except during
initialization, when it comes on during module testing.

K.si only

Amber
(eight
LEDs)

DI-Offfor PROM load, on for RAM load.
D2 through D8-Upper register #2 contents. When a
microinstruction parity error is detected, the module clocks are
inhibited, which stops the module. The bit content of the upper error
register #2 is displayed on the LEDs. See Figure 2-6 for the location
of the LEDs.

M.std (LOI06)

Green

Board status--Indicates memory cycles are operating.

M.std2 (LOI17)

Green

Board status--Indicates the operating software is running and has
successfully tested this module.

Amber

Indicates Memory Active-Lit during every memory cycle.

Red

Board status--Indicates an inoperable module except during
initialization when it comes on during module testing.

Amber

State indicator (top LED)-Mirrors the OCP State indicator.

Amber

Run indicator (bottom LED)-Pulses at the on-board microprocessor
run rate.

Red

Board status-Indicates an inoperable module except during
initialization when it comes on during module testing.

Green

Board status--Indicates the module has passed all applicable
diagnostics.

DI amber

Micro ODT - Used during J-II power-up microdiagnostics

D2 amber

Terminal port OK-Used during J-II power-up microdiagnostics.

D3 amber

Memory OK-Used during J-II power-up microdiagnostics.

D4 amber

Sequencing indicator-Used during J-II power-up microdiagnostics.

D5 amber

State indicator-Mirrors the OCP State indicator.

D6 amber

Run indicator-Pulses at the on-board microprocessor run rate.

D7red

Board status--Indicates an inoperable module, except during
initialization, when it comes on during module testing.

D8 green

Board status--Indicates the module has passed all applicable
diagnostics.

K.sdi (LOI08-YA)
K.sti (LOI08-YB)
K.si (LOI19-YA)

P.ioc (LOI05)

P.ioj (LOllI or
LOIII-YA)

2.7 Module Switches
Specific switches are found on LINK (LOIOO-E2 or LOl18), port processor (LOl07), and port buffer
(LOl09) modules as follows:
•

CI port LINK module (LOIOO-E2IL0118)-Refer to Figure 2-8 for the CI node address
switches mounted on the LOIOO-E2 or LOl18 module.

2-12

Controls and Indicators

NOTE

Memory module M.std2 (LOl17) contains a switch pack. These switches are factory
set to calibrate the RX33 diskette controller. Do not change the setting of this switch
pack; the switch settings are unique to each module and cannot be restored outside
of the manufacturing environment.

Controls and Indicators

2-13

81

82

83

LINK L0118
MODULE

CXO-2596B

Figure 2-8

L0118 Module (DIP) Switches

Switches must be identically set to avoid CI addressing errors. See Chapter 3 for switch
positions of S1, S2, and S3.

2-14

•

Controls and Indicators

CI port processor and CI port buffer modules (LOI07 and LOI09)-Both the LOI07 and
LOI09 modules have dual in-line pack (DIP) switches to indicate the hardware revision leveI.
DIP switch positions should not be changed, except as directed by a Field Change Order (FCO).
Figure 2-9 shows the location of the LOI07 switches.

L0107 CI PORT BUFFER
MODULE HARDWARE REVISION
LEVEL SWITCHES
(DO NOT CHANGE EXCEPT BY FCO)

CXO-2684A

Figure 2-9

L0107 Module (DIP) Switches

Controls and Indicators

2-15

Figure 2-10 shows the location of the L0109 switches.

L0109 CI PORT BUFFER
MODULE HARDWARE REVISION
LEVEL SWITCHES
(DO NOT CHANGE EXCEPT BY FCO)

CXO-2683A

Figure 2-10

L0109 Module (DIP) Switches

2-16

•

Controls and Indicators

K.si (LOl19-YA) data channel switchpack - Figure 2-11 shows the location of the K.si
module switches.

K.SI DATA CHANNEL
MODULE

NOTE:
ALL SWITCHES
MUST BE OFF FOR
NORMAL OPERATION.

RED STATUS LED
GREEN STATUS LED

CXO-2495A

Figure 2-11

K.si Module (L0119-YA) Switches

Controls and Indicators

•

2-17

P.ioj (LOllllLOlll·YA)-The P.ioj module contains two punch-out connector packs used to
assign an unique value to the P.ioj serial number register. The switch settings should never be
modified in the field.

The P.ioj module serial number is used only when a default HSC SDS-ID is generated. The
SDS-ID is a hexadecimal number uniquely identifying the HSC as a node in the cluster. This
ID is usually generated by initializing the HSC70 (toggling the Init switch on the OCP) while
holding in the OCP Fault switch until the INIPIO banner is printed on the console. For all
other reboot cases, the HSC70 P.ioj serial number is not used.

2.8 881 Power Controller
The 881 power controller is a general-purpose, three-phase controller that controls and distributes
ac power to various ac devices (power supplies, fans, blower motor, and so forth) packaged within
an HSC and HSC50. The 881:
•

Controls large amounts of ac power with low level signals

•

Provides ac power distribution to single-phase loads on a three-phase system

•

Protects data equipment from electrical noise

•

Disconnects ac power for servicing and in case of overload

In addition, the 881 features:
•

Local and remote switching

•

Swi tched receptacles only

•

Convection cooling

•

Rack mounting

•

ac line filtering

•

Power Control bus inputs

•

Power Control bus delayed output (to allow sequencing of other controllers)

2.8.1 Operating Instructions
The two basic controls on the power controller are the circuit breaker and the BUS/OFF/ON
switch. These and all but one of the other controls are located on the front panel of the controller
(Figure 2-12).

2-18

Controls and Indicators

GROMMETED
CORD
OPENING

POWER CONTROL
BUS CONNECTORS

INTERNATIONAL SYMBOLS
DELAYED
(0.5 SEC)

UNDELAYED

f::\ SECONDARY
~

ON

SECONDARY
O• OFF

SERIAL LOGO
LABEL

~

FUSE

L:!.J

REMOTE BUS
CONTROL

POWER
CONNECTOR

CXO-893A

Figure 2-12

881 Power Controller-Front Panel Controls

The operator controls are described in the following list:
•

Power controller circuit breaker-Controls the ac power to all outlets on the controller.
I t also provides overload protection for the ac line loads and is unaffected by switching the
BUS/OFF/ON control.

•

Fuse-Protects the ac distribution system from an overload of the Power Control bus circuitry.
The fuse is located on the front panel of the power controller.

•

Power Control bus connections-Used if Control bus connections to another cabinet are
required. Power Control bus connectors are JIO, JII, J12, and J13. Connectors JIO and Jll are
not delayed. Connectors J12 and Jl3 are delayed.

•

BUS/OFF/ON switch-The three positions of this switch. Assuming the circuit breaker for the
power controller is on, the ac outlets are:
Energized when the BUS/OFF/ON switch is in the on position

Controls and Indicators

-

2-19

De-energized when the BUS/OFF/ON switch is in the off position

NOTE

The BUS position is intended for remote sensing of Digital power control bus
instructions. The switch is left in the on position when the power control bus is
not used.
•

TOTAL OFF connector-A two-pin male connector on the rear panel of the power controller
(Figure 2-13). It removes power from the HSC whenever the air flow sensor detects system airflow loss or an over temperature condition. To reset the TOTAL OFF, cycle the circuit breaker
off and then back on again.

TOTAL OFF
CONNECTOR

CXO-934A

Figure 2-13

881 Rear Panel

2.9 HSC50 Power Controller
The 60 Hz power controller is shown in Figure 2-14 and Figure 2-16. For the 50 Hz unit, refer to
Figure 2-15 and Figure 2-17. A physical description of the power controller follows.

2-20

Controls and Indicators

DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

REMOTEI
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

LINE
POWER
CIRCUIT
BREAKERS

CB1
CB2-4
(SWITCHED)
~::--t-~=::=t

FUSE

CBS
(UNSWITCHED)

CXO-013B

Figure 2-14

HSC50 Power Controller (60 Hz)-Front View

2.9.1 Line Phase Indicators
Three Line Phase indicators display the status of incoming line power. If any phase drops, the
indicator for that phase goes off.

Controls and Indicators

2-21

2.9.2 . Fuses
The three line phases are fused to protect the HSC50 circuitry. These fuses are located beside the
Line Phase indicators as shown in Figure 2-14 and Figure 2-15
DEC POWER
CONTROL BUS
CONNECTOR

DELAYED
OUTPUT
CONNECTOR

REMOTE/
OFF/LOCAL
ON SWITCH

FUSE
LINE
POWER
CIRCUIT
BREAKERS

ACINPUT
LINE PHASE
INDICATOR

o

CB1 I

CXO-013C

Figure 2-15

HSC50 Power Controller (50 Hz)-Front View

2.9.3 Remote/Off/Local On Switch
When this switch is in the off position, the power controller does not route ac line power to the
switched or unswitched outlets.
With the switch in the Local On position, ac power is routed to the power controller switched or
unswitched outlets.

2-22

Controls and Indicators

When the switch is in the Remote position, the routing of ac power is dependent upon the Power
Control bus signals.

2.9.4 Circuit Breakers (60 Hz)
There are five power controller circuit breakers which perform the following functions:
•

CB1-Protects from incoming power surges

•

CB2-4-Protects the switched outlets (refer to Figure 2-13)

•

CB5-Protects the unswitched outlets

2.9.5 Circuit Breakers (50 Hz)
The 50 Hz unit contains one circuit breaker (Figure 2-15). CB1 on this unit protects all circuits.

2.9.6 Power Controller {60 Hz)-Rear View
The switched outlets in Figure 2-16 are protected by CB2-4 (refer to Figure 2-14) and the bottom
(unswitched) by CB5. Both the bottom and top outlets are currently unused.
A three-pin male connector (J8) is located on the back of the power controller (Figure 2-16). It
removes power from the HSC whenever the air flow sensor detects system air-flow loss or an over
temperature condition. To reset the TOTAL OFF, cycle the circuit breaker off and then back on
again.

Controls and Indicators

2-23

UNUSED

BLOWER
OUTLET

MAIN POWER
SUPPLY OUTLET

AUXILIARY POWER
SUPPLY OUTLET

UNSWITCHED

CXO-411A

Figure 2-16

HSC50 Power Controller (60 Hz)-Rear View

2.9.7 Power Controller (50 Hz)-Rear View
Outlets in Figure 2-17 are protected by CB1 (refer to Figure 2-15). Connector J3, shown at the top
of the 50 Hz power controller rear view, connects the air flow sensor.

2-24

Controls and Indicators

J3
Total
Off

BLOWER
OUTLET

MAIN POWER
SUPPLY OUTLET

AUXILIARY POWER
SUPPLY OUTLET

CXO-411B

Figure 2-17

HSC50 Power Controller (50 Hz)-Rear View

Removal and Replacement Procedures 3-1

3

Removal and Replacement Procedures
3.1

Introduction

This chapter emphasizes conditions that must be met when replacing field replaceable units (FRUs),
including the following information:

•

Safety precautions

•
•
•
•

HSC failover

•

FRU overviews
Jumper configurations
Swi tch configurations
Test sequence to perform after FRU replacement

Observe the safety and electrostatic discharge (ESD) precautions in this section before starting
removal and replacement procedures.
This chapter covers the following replaceable HSC subunits and modules:
Modules:
Port link module (LINK)
Port buffer module (PILA)
Port processor module (K. pli)
Disk data channel module (K.sdi)
Tape data channel module (K.sti)
Data channel module (K.si)
110 control processor module (P.ioj and P.ioc)
Memory module (M.std2 and M.std)
Subunits:
RX33 disk drive
TU5S tape drive
Operator control panel
Air flow sensor
Blower
Power controller
Main power supply
Auxiliary power supply

3-1

3-2

Removal and Replacement Procedures

3.2 Safety Precautions
Because hazardous voltages exist inside the HSC, service must be performed only by qualified
people. Serious bodily injury or equipment damage can result from improper servicing. Observe the
following safety steps before servicing the HSC:
1. Turn off the dc and ac power to the HSC before removing or installing internal parts or cables.

2. To ensure absolute safety, disconnect the ac plug from its receptacle after removing power from
the HSC.
3. Remove and replace heavy subunits with care.
4. Use the Velostat (anti-static) kit (part number 29-11762) strap provided when removing and
replacing logic modules.

3.3 Taking the HSC Off Line for Maintenance
This section describes how to take an HSC off line for performing maintenance.

3.3.1 Single HSC in a Cluster and Clusters Running ULTRIXIUNIX
If there is only one HSC in the cluster, or if the cluster is running the ULTRIXIUNIX operating
system, use the following procedure:
1. Notify the system manager that the HSC is being taken off line and the drives attached to it

will not be available.
2. Dismount the drives connected to the HSC or shut down the system.
3. Place the Off-line switch in the out position.
4. Take the HSC off line with one of the following methods:
•

Turn off the dc and ac power to the HSC.

•

Press the Init switch to reboot the HSC.

3.3.2 Multiple HSCs in a Cluster
Most VMS system clusters have primary and secondary paths established between the host and
drives. If the HSC is the primary path, failover to the secondary path occurs and the drives remain
available to the host. Use the following procedure when taking an HSC offline from a cluster with
multiple HSCs:
1. Notify the system manager that you are taking the HSC off line.

2. Use the SETSHO command SHOW TAPE to determine which tape drives are on line to the
HSC. Dismount these tape drives using the appropriate VMS commands.
3. Determine which disk drives are on line to the HSC undergoing maintenance with the SETSHO
command SHOW DISK. The on-line drives must be either be failed over to the alternate HSC
or dismounted.
4. Dismount single-ported disk drives using the appropriate VMS commands.
5. On all dual-ported disk drives, make sure that both A and B port select switches on the drives
are pressed in. De-select the active port on the drive by pressing and releasing the illuminated
port select switch.
. 6. Verify that the illuminated switch turns off and the alternate port switch illuminates. Actual
failover time depends on the server timeout and may require 1 minute or more depending on
activity. When the alternate port light illuminates, failover to the other HSC is successful.

Removal and Replacement Procedures

3-3

7. Use the SETSHO command SHOW DISK to verify that all on-line drives have failed over to the
alternate HSC.
8. If failover did not occur, reselect the ports on the drive and check the connections between the
drives and the HSC.
9. Mter all tapes and disks have been failed over, take the HSC off line using one of the following
methods:
•

Turn off the dc and ac power to the HSC, or

•

Place the Off-line switch in the out position, or

•

Press the Init switch to reboot the HSC.

3.4 Removing and Replacing Field Replaceable Units
The following sections describe procedures for removing and replacing field replaceable units
(FRUs) in an HSC or HSC50:

3.4.1 Removing HSC Power
Before removing/replacing an FRU, turn off the ac power from the HSC. Following are the methods
for removing dc and ac power from the HSC:

3-4 Removal and Replacement Procedures

DC POWER
SWITCH

OCP SIGNAU
POWER LINE
CONNECTOR

Figure 3-1

HSC DC Power Switch

1. Set the dc power switch on the side of the RX.33 housing to the off position (Figure 3-1).

WARNING
Ensure the OCP SignallPower line indicator is connected; otherwise the power
indicator on the OCP can show power off when the power is on.
2. Place the main power switch CBl on the power controller in the off position (Figure 3-2). To
ensure safety precautions, unplug the ac power plug from the ac socket.

Removal and Replacement Procedures

(f)

o

G1

~

:rn rn rn m:
JI3 JI2J11 J1 0

000

o

CIRCUIT
BREAKER

POWER
CONNECTOR

CXO-1117A

Figure 3-2

HSC 881 Power Controller Circuit Breaker

3.4.2 Removing HSC50 Power
Following are the steps for removing dc and ac power from the HSC50:
1. Set the dc power switch on the maintenance access panel to the off position (Figure 3-3).

3-5

~

Removal and Replacement Procedures

DC POWER
SWITCH

OFF POSITION (0)

OCP
CONNECTOR

CONNECTORS
RESERVED FOR
FUTURE USE

MAINTENANCE
ACCESS PANEL

MAINTENANCE
TERMINAL
SIGNAL
CONNECTOR
CXO-014B

Figure 3-3

HSC50 DC Power Switch

2. Place the main power switch CBl on the power controller in the off position (Figure 3-2) for the
HSC50 (modified) and the line power circuit breakers (Figure 3-4) for the HSC50. To ensure
safety precautions, unplug the ac power plug from the ac socket.

Removal and Replacement Procedures

DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

REMOTE/
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

LINE
POWER
CIRCUIT
BREAKERS

CB1
CB2-4
(SWITCHED)
~:::::--t-~;r::;;::=;1

FUSE

CBS
(UN SWITCHED)

CXO-013B

Figure 3-4

HSC50 Line Power Circuit Breakers

3-7

3-8

Removal and Replacement Procedures

3.4.3 Removing Field Replaceable Units
Figure 3-5 shows the sequence for removing field replaceable units (FRUs) in the HSC:

OPEN CABINET FRONT DOOR

I

RX33

MODULES

OCP

OPEN CABINET BACK DOOR

POWER CONTROLLER

BLOWER

AIR FLOW
SENSOR ASSEMBLY
CABINET BACK DOOR
CABINET FRONT DOOR
MAIN POWER SUPPLY
AUXILIARY POWER SUPPLY
CXO-93SB

Figure 3-5

HSC FRU Removal Sequence

Removal and Replacement Procedures

Figure 3-6 shows the FRU removal sequence for an HSC50.

OPEN CABINET FRONT DOOR

I
TU58 DRIVES

MODULES

TU58 CONTROLLER MODULE

OCP

OPEN CABINET BACK DOOR

POWER CONTROLLER

BLOWER

AIR FLOW
SENSOR ASSEMBLY
CABINET BACK DOOR
CABINET FRONT DOOR
MAIN POWER SUPPLY
AUXILIARY POWER SUPPLY
CXO-015C

Figure 3-6

HSC50 FRU Removal Sequence

3.4.4 Removing the HSC Cabinet Front Door
The FRUs accessed through the front door include the RX33 drives, the operator control panel
(OCP), and the logic modules. To remove the front door, use the following procedure:
1. Unlock the cabinet front door and lift the latch to open the door.

3-9

3-10

Removal and Replacement Procedures

CAUTION

When performing the following steps, take care not to damage the front spring
fingers.
2. Remove HSC power by setting the dc power switch to the 0 position.
3. Disconnect the ground wire from the door.
4. Disconnect the OCP signal/power line connector at the bottom of the OCP shield (Figure 3-7).

HSC70
DC POWER
SWITCH

OCP SIGNAU
POWER LINE
CONNECTOR

Figure 3-7

HSC OCP Signal/Power Line Connector

5. Pull down on the spring-loaded rod on the top hinge inside the cabinet to disengage the door,
then lift the door off its bottom pin.
Reverse the removal procedure to replace the front door.

Removal and Replacement Procedures

3-11

3.4.5 Removing the HSC50 Cabinet Front Door
The FRUs accessed through the front door include the TU5S drives, the operator control panel
(OCP), and the logic modules. To remove the front door, use the following procedure:
1.

Open the cabinet front door by turning the key clockwise.
CAUTION

When performing the following steps, take care not to damage the front spring
fingers.
2. Disconnect the ground wire from the door.
3. Remove the maintenance access panel cover by loosening the four captive screws.
NOTE

Some HSC50s have a hinged maintenance access panel with only one captive screw.
4. Remove HSC50 power by setting the dc power switch to the 0 position.
5. Remove the plastic cable duct cover.
6. Disconnect the cables from the maintenance access panel connectors shown in Figure 3-8.

3-12

Removal and Replacement Procedures

DC POWER
SWITCH

ON POSITION (1)

TU58
CONNECTORS

OFF POSITION (0)

OCP
CONNECTOR

CONNECTORS
RESERVED FOR
FUTURE USE

MAINTENANCE
ACCESS PAN EL

MAINTENANCE
TERMINAL
SIGNAL
CONNECTOR
CXO-014B

Figure 3-8

HSC50 Maintenance Access Panel Connectors

7. Pull down on the spring-loaded rod on the top hinge inside the cabinet to disengage the door,
then lift the door off its bottom pin.
Reverse the removal procedure to replace the front door.

3.4.6 Removing the HSC Cabinet Back Door
The FRUs accessed through the back door include the power controller, blower, air flow sensor
assembly, main power supply, and auxiliary power supply. To remove the back door, use the
following procedure:
1. Open the back door with a 5/32-inch hex wrench.
2. Pull down on the spring-loaded rod on the top hinge inside the cabinet to disengage the door,
then lift the door off its bottom pin.
Reverse the removal procedure to replace the back door.

Removal and Replacement Procedures

3-13

3.5 Removing and Replacing Modules
This section contains procedures for removing and replacing modules. Refer to Figure 3-9 for the
HSC and Figure 3-10 for the HSC50 when removing the card cage cover.

DISKETTE
STORAGE
AREA

Figure 3-9

HSC Card Cage Cover Removal

3-14

Removal and Replacement Procedures

NYLON
LATCHES

CARD
CAGE
COVER

CXO-019A

Figure 3-10

HSC50 Card Cage Cover Removal

WARNING:

Because hazardous voltages exist inside the HSC, service must only be performed by
qualified people. Bodily injury or equipment damage can result from improper servicing
procedures.
A Velostat (anti-static) kit (part number 29-11762) must be used during module
removal/replacement.

3.5.1 Removing and Replacing the Port Link Module (LINK)
The port link module (LINK) is a part of the host interface module set (Kci). With all configuration
switches and jumpers in default positions, the LOl18 is functionally identical with the L0100 or
L0100-E2.
3.5.1.1 Removing the LINK Module
Use the following procedure to remove the LINK module. Observe safety and ESD precautions
before starting the module removal procedure.

1. Notify users that the HSC is being taken off line and the drives attached to it will not be
available.
2. Dismount or failover any drives connected to the HSC or shut down the system.
·3. Set the dc power switch to the 0 (off) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.

Removal and Replacement Procedl,Jres

3-15

On the H8C50, the dc power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the card cage cover one-quarter turn.
5. Pull the H8C card cage cover up and out.
6. Locate the LINK module in slot number 14 of the card cage. This can be verified by the module
utilization label.
7. Move the door latch plate attached to the left side of the cabinet frame away from the module
removal path. In the H8C cabinet, the latch plate is swivel mounted. Lift the plate slightly and
press it flat against the cabinet frame. Remove the LINK module.

3.5.1.2 Setting the Replacement LINK Module Switches
81 and 82 are the node address switches on the LINK module. The node address switches on the
replacement module must be set identically to the switch settings on the removed LINK module.
The L0100-E2 and LOllS LINK module also have an additional switch pack (83).
The switch configurations and significance are as follows:
81/82 - Node number
83-1 - Cluster size (GT15), OFF for 16 or less nodes (default); ON for 17 or more nodes
83-2, 83-3 - Delta time/quiet slot (default) = always OFF
83-4 -10 ticks = always ON
Figure 3-11 shows the LINK (L0100) module node address switches.

II

II

2
4
VALUE
OF EACH
SWITCH

3.

8

4

16

5

32

6

64
128

II

2 '

II

8

4

II

16

5

32

6

64

711

4

0
P
E
N

•
711
•

VALUE
OF EACH
SWITCH

128

8

3.
2 '

2

•

0
P
E
N

8 •
0

0

52

S1
DIP SWITCH
(EXAMPLE: OCTAL 10)

CXO-2695A

Figure 3-11

L0100 Node Address Switches

3-16

Removal and Replacement Procedures

Figure 3-12 shows the LINK (L0100-E2ILOl18) module node address switches.

~~

:~~

:~
'~
S1

~~

:~~
:~
'~
S2

S3
CXO-2696A

Figure 3-12

L0100-E2IL0118 Node Address Switches

3.5.1.3 Setting the Replacement LINK Module Jumpers
The LINK jumper configurations are as follows:
W1-Extender head, Default = Not used
W2-Active hub, Default = Not used
W3--Extender ACK timeout, Default = Not used
W4-Cluster size (GT32), Default = Less than 32

Removal and Replacement Procedures

Figure 3-13 shows the LINK (L0100) jumpers.

W3

+
1++1
W1

1++1+

NOTE: BOXES INDICATE THE DEFAULT JUMPER POSITIONS.
CXO-1910B

Figure 3-13

L0100 Jumper Configuration

3-17

3-18

Removal and Replacement Procedures

Figure 3-14 shows the LINK (LOl18-B1) jumpers.

W3

+
1++1
W1

1++1+

W2

1+ +I~

W4

NOTE: BOXES INDICATE THE W1 AND W3 FAULT JUMPER POSITIONS.
THE DEFAULT FOR JUMPERS W2 AND W41S "OUT".
CXO-1911B

Figure 3-14

L0118-B1 Jumper Configuration

Removal and Replacement Procedures

Figure 3-15 shows the LINK (L011S-B2) jumpers.

W3

+
1++1
W1

1++1+

1++1+
W2

W4
NOTE: BOXES INDICATE THE DEFAULT JUMPER POSITIONS.
CXO-1912B

Figure 3-15

L0118·B2 Jumper Configuration

3-19

3-20

Removal and Replacement Procedures

3.5.1.4 Replacing the LINK Module
This section provides the LINK module replacement procedure. Observe safety and ESD
precautions before starting the module replacement procedure.

1.

Install the LINK module in slot number 14 of the card cage. This can be verified by the module
utilization label.

2. Move the door latch plate attached to the left side of the cabinet frame away from the module
installation path. In the HSC cabinet, the latch plate is swivel mounted. Lift the plate slightly
and press it flat against the cabinet frame. Install the LINK module and return the plate to its
locked position.
3.

Pull the card cage cover down and in.

4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Set the dc power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
3.5.1.5 Testing the LINK Module
Perform the following tests to verify correct LINK operation as part of the K.ci host interface
module set.

1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2.

Refer to Chapter 6 for test descriptions and procedures and perform the following tests:
•

Off-line bus interaction test

•

Off-line K test selector

•

Off-line KIP memory test

3.

Place the SecurelEnable switch in the secure position.

4.

Boot the HSC with the system media by pressing and releasing the Init switch.

5.

Bring the HSC on line by pressing and releasing the Online switch.

6.

Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure that both A and B paths
are present to all hosts.

7.

Use the SETSHO command SHOW CI to verify the absence of the RTNDATIDISC datagram.

3.5.2 Removing and Replacing Port Buffer Module (PILA)
The port buffer module (PILA) is a part of the host interface module set (K.ci). The PILA interfaces
with the port link module through a set of interconnect link signals.
3.5.2.1 Removing the PILA Module
Use the following procedure to remove the PILA module. Observe safety and ESD precautions
before starting the module removal procedure.

1. Notify users that the HSC is being taken off line and the drives attached to it will not be
available.
2. Dismount or failover any drives connected to the HSC or shut down the system.

Removal and Replacement Procedures

3-21

3. Set the dc power switch to the 0 (oft) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSCSO, the dc power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the card cage cover up and out.
6. Locate the PILA in slot number 13 of the card cage. This can be verified by the module
utilization label.
7. Remove the PILA module.
3.5.2.2 Setting the Replacement PILA Module Switches

The PILA module has factory-set dual in-line pack (DIP) switches to indicate the hardware revision
level. Do not change DIP switch positions, except as directed by a field change order (FCO).
Figure 3-16 shows the PILA module switch.

I, ~" , " ~r

L0109 CI PORT BUFFER
MODULE HARDWARE REVISION
~ LEVEL SWITCHES
(DO NOT CHANGE EXCEPT BY FCO)

CXO-2698A

Figure 3-16

L0109 Hardware Rev Level Switch

3.5.2.3 Replacing the PILA Module

This section provides the PILA module replacement procedure. Observe safety and ESD precautions
before starting the module replacement procedure.
1. Install the PILA module in slot number 13 of the card cage. This can be verified by the module

utilization label.
2. Pull the card cage cover down and in.
3. Turn the two nylon latches on the module cover plate one-quarter turn.
4. Set the de power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
3.5.2.4 Testing the PILA Module

Perform the following tests to verify correct PlLA operation as part of the K.ci host interface module
set.
1. Boot the HSC with the off-line diagnostic media. Refer to-Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

3-22

Removal and Replacement Procedures

•

Off-line K test selector test

•

Off-line KIP memory test

3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure that both A and B paths
are present to all hosts.

3.5.3 Removing and Replacing the Port Processor Module (K.pli)
The port processor module (Kpli) is a part of the host interface module set (K.ci). The K.pli
interfaces with the port link module indirectly through the post buffer module.
3.5.3.1 Removing the K.pli Module
Use the following procedure to remove the K.pli module. Observe safety and ESD precautions
before starting the module removal procedure.
1. Notify users that the HSC is being taken off line and the drives attached to it will not be
available.

2. Dismount or failover any drives connected to the HSC or shut down the system.
3. Set the dc power switch to the 0 (oft) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the de power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the HSC card cage cover up and out.
6. Locate the K pli module in slot number 12 of the card cage. This c.an be verified by the module
utilization label.
7. Remove the K pli module.
3.5.3.2 Setting the Replacement K.pli Module Switches
The Kpli module has factory-set dual in-line pack (DIP) switches to indicate the hardware revision
level. Do not change DIP switch positions, except as directed by a field change order (FCO).

Figure 3-17 shows the Kpli module switch.

I"'" ,"r

L0107 CI PORT BUFFER
MODULE HARDWARE REVISION
~ LEVEL SWITCHES
(DO NOT CHANGE EXCEPT BY FCO)

CXO-2697A

Figure 3-17

L0107 Hardware Rev Level Switch

Removal and Replacement Procedures

3-23

3.5.3.3 Replacing the K.pll Module

This section provides the Kpli module replacement procedure. Observe safety and ESD precautions
before starting the module replacement procedure.
1. Install the K pli module in slot number 12 of the card cage. This can be verified by the module

utilization label.
2. Replace the K.pli module.
3. Pull the card cage cover down and in.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Set the dc power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
3.5.3.4 Testing the K.pll Module

Run the following tests to verify correct K.pli operation as part of the Kci host interface module
set.
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.

NOTE
The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

•

Off-line K test selector test

•

Off-line KIP memory test

3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to and ensure both A and B paths
are present to all hosts.

3.5.4 Removing and Replacing the Disk Data Channel Module (K.sdi)
The Ksdi data channel interfaces between the HSC and the standard disk interface (SDI). Ksdi
operation is controlled by an on-board microprocessor with a local programmed read-only memory
(PROM). Commands and responses pass between the Ksdi microprocessor and other internal HSC
processes through Control memory.
3.5.4.1 Removing the K.sdl Module

Use the following procedure to remove the Ksdi module. Observe safety and ESD precautions
before starting the module removal procedure.
1. Notify users that the HSC is being taken off line and the drives attached to it will not be

available.
2. Dismount or fallover any drives connected to the HSC.
3. Set the dc power switch to the 0 (off) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.

3-24

Removal,and Replacement Procedures

On the HSC50, the dc power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the card cage cover up and out.
6. Check the module utilization label above the card cage for the location of the Ksdi module. The
module slots are numbered from right to left when viewed from the front.
7. Remove the K.sdi module.
3.5.4.2 Replacing the K.sdi Module

This section provides the K.sdi module replacement procedure. Observe safety and ESD precautions
before starting the module replacement procedure.
1. Check the module utilization label above the card cage for the location of the module. The
module slots are numbered from right to left when viewed from the front.
2. Replace the K.sdi module.
3. Pull the card cage cover down and in.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Set the dc power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
3.5.4.3 Testing the K.sdi Module

Perform the following tests to verify correct K.sdi operation:
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-linfl. diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

•

Off-line K test selector test

•

Off-line KIP memory test

3. Place the Secure!Enable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.
7. Use the SETSHO command SHOW DISK to verify that all applicable drives are present.
S. Perform the disk drive integrity test ILDISK. Refer to Chapter 5 for test description and
procedure.

Removal and Replacement Procedures

3-25

3.5.5 Tape Data Channel Module (K.sti)
The Ksti is an interface between the HSC and the standard tape interface (STI). Ksti operation
is controlled by an on board microprocessor with a local programmed read-only memory (PROM).
Commands and responses pass between the K.sti microprocessor and other internal HSC processes
through control memory.
3.5.5.1 Removing the K.sti Module

Use the following procedure to remove the K.sti module. Observe safety and ESD precautions
before starting the module removal procedure.
1.

Notify users that the HSC is being taken off line and the drives attached to it will not be
available.

2. Dismount or failover any drives connected to the HSC.
3. Set the dc power switch to the 0 (off) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the card cage cover up and out.
6.

Check the module utilization label above the card cage for the location of the module. The
module slots are numbered from right to left when viewed from the front.

7.

Remove the Ksti module.

3.5.5.2 Replacing the K.sti Module
This section provides the K.sti module replacement procedure. Observe safety and ESD precautions
before starting the module replacement procedure.
1.

Check the module utilization label above the card cage for the location of the module. The
module slots are numbered from right to left when viewed from the front.

2. Replace the K.sti module.
3. Pull the card cage cover down and in.
4.

Turn the two nylon latches on the module cover plate one-quarter turn.

5. Set the dc power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
3.5.5.3 Testing the K.sti Module

Perform the following to verify correct K.sti operation:
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

•

Off-line K test selector test

3-26

•

Removal and Replacement Procedures

Off-line KIP memory test

3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the the Online switch.
6.

Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.

7. Run the tape drive integrity test ILTAPE. Refer to Chapter 5 for test description and procedure.

3.5.6 Removing and Replacing the Data Channel Module (K.si)
The K.si (LOl19-YA) data channel module is a direct replacement for the K.sdi (LOI08-YA) disk data
channel or Ksti (LOI08-YB) tape data channel modules.

NOTE
The K.si data channel initializes only with HSe Version 3.90 or higher software. Do
not use the K.si module with HSe system software with a version level lower than 3.90.
Versions lower than 3.90 will cause initialization failure.
3.5.6.1 Removing the K.sl Module
Use the following procedure to remove the K.si module. Observe safety and ESD precautions before
starting the module removal procedure.
1. Notify users that the HSC is being taken off line and the drives attached to it will not be

available.
2. Dismount or failover any drives connected to the HSe.
3. Set the dc power switch to the 0 (oft) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the card cage cover up and out.
6. Check the module utilization label above the card cage for the location of the module. The
module slots are numbered from right to left when viewed from the front.
7. Remove the Ksi, Ksdi, or Ksti module.
3.5.6.2 Setting the Replacement K.si Module Switches
The K.si has a switchpack containing four switches. Table 3-1 describes the names and functions
of the switches. SWI is on the top of the switchpack.

NOTE
The four switches must be in the OFF position to prevent errors during initialization and
normal operation.

Removal and Replacement Procedures

Table 3-1

K.sl Swltchpack Options

Switch
Number

Switch
Name

Function
Description

Normal
Position

SWI

MFG

Provides loop on
error and single port
extemalloop.

Off

SW2

Burn in

Continuous loop.
Assumes external
loop and clock.

Off

SW3

Ext loop

Loops on all ports;
for manufacturing or
field use.

Off

SW4

Ext
clock

Substitutes
external clock; for
manufacturing use
only.

Off

3-27

Figure 3-18 shows the Ksi module switchpack.

CXO-2693A

Figure 3-18

K.sl Switch pack

3.5.6.3 Configuration of Requestors While Replacing the K.sl Module
To obtain maximum performance from the HSC, physically configure the tape and disk requestors
according to the following guidelines:

•

Each Ksi, Ksdi, or Ksi module in the HSC backplane has a requestor priority number
according to its backplane slot. You can greatly enhance the performance of the HSC if the
attached devices are arranged according to their transfer speeds.

•

Attach the slower devices to the lower priority requestors and the faster devices to the higher
priority requestors. Do this while you have the HSC shut down for K.si installation.

•

With the introduction of faster devices, such as the TA90 tape drive and RA90 disk drive,
backplane configuration has become especially important. Failure to configure the devices
properly could result in data bus overrun, EDe errors and, significant performance loss.

3-28

Removal and Replacement Procedures

The following table shows the device relative speeds:
Table 3-2

Physical Configuration

Device

Relative Speed

TA90 tape drive

Fastest

RA90 disk drive
RA82 disk drive
RA81 disk drive
RA60 disk drive
RA70 disk drive
RA80 disk drive
All STI tape drives except TA90

Slowest

Requestor priority in the HSC ascends from Requestor 2 Oowest priority) through the highest
requestor number on the HSC. Note that requestor priority levels are all relative; that is, the
individual requestor numbers have no intrinsic speed characteristic. When configuring, it is
recommended that you leave blank slots where possible to eliminate reconfiguration when adding
requestors in the future.
NOTE
The lowest priority slot is located next to the K.ci module and the highest priority slot is
located next to the P.ioj/c module.

3.5.6.4 Replacing the K.si Module
This section provides the K.si module replacement procedure. Observe safety and ESD precautions
before starting the module replacement procedure.

1. Refer to Table 3-2 and verify that the requestors are arranged according to the transfer speeds
of their attached devices.

2.

Check the module utilization label above the card cage for the location of the module. The
module slots are numbered from right to left when viewed from the front.

3. Replace an existing K.si, K.sdi, or K.sti module with the Ksi. If you are installing a new
requestor, install the K.si in the card cage. Attach the label accompanying the Ksi module to
the appropriate location of the module utilization label charlo
4. If you are planning to run the recommended external loop test, disconnect the SDI cables to
the bulkhead of the requestor slot for the installed Ksi. Instan the loopback connectors (part
number 70-22953-01), and refer to the section on K.si external loop tests.
5. Pull the card cage cover down and in.
6. Turn the two nylon latches on the module cover plate one-quarter turn.
7. Set the dc power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX.33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.

Removal and Replacement Procedures

3-29

3.5.6.5 K.si Module External Loop Test

Run the Ksi External Loop Test before you initialize and configure the Ksi to ensure that there
are no hidden problems with the installation. Loopback connectors (part number 70-22953-01) are
required for this test. These connectors are not included with the HSC.
1. Set SW3 of the K.si switch pack to the ON position. (SW1 is at the top of the switch pack.) All

other switches on the switch pack must be set to OFF.
2. If you have not already done so, open the rear door and remove any SDI cables from the
bulkhead of the requestor slot being tested. The K.si in slot 6, bulkhead E, is being tested in
the example in this section.
3. Install four loopback connectors to the bulkhead.
4. Set the dc power switch to 1 to restore dc power to the card cage.
5. Press and release the Init switch on the operator control panel (OCP) to run the automatic
loopback test as part of the powerup diagnostics. The following system messages appear:
INIPIO-I Booting ...
HSCxx Version V3.90 11-Feb-1988 17:00:41

System HSC009

6. If the HSC shows an error on boot, check that the loopback connectors are seated and that the
Ksi modules are fully seated in the backplane.
7. Remove the system media and insert the off-line diagnostic media into the load device.
8. Press and release the Init switch on the OCP.
The load device drive-in-use LED should light within a few seconds, indicating the bootstrap is
loading the off-line diagnostic loader to program memory.
The off-line diagnostic loader indicates it has been loaded properly by displaying the following:
HSC OFL Diagnostic Loader, Version Vnnn
Radix=Octal,Oata Length=Word,Reloc=OOOOOOOO
OOL>

The off-line loader is now ready to accept commands.
9. Issue the TEST K command and run microdiagnostics 11, 12, 13, and 14. The following example
shows the diagnostics run for requestor 6. Perform these tests for each requestor installed in
your system. The number of passes shown is for this example; you may perform more or less
passes.
OOL> TEST K I RETURN I

The test responds with:
HSC OFL K Test
Requestor "* of
Test 41= (1 thru
"* of passes to

Selector
K (1 thru 9) [] ? 6 I RETURN I
17) (0) [] ? 11 ~
perform (D) [1] ? 10 ~~RE=T=U=RN~

End of Pass

"*

0000001, 00000 Errors, 00000 Total Errors

End of Pass

"*

0000010, 00000 Errors, 00000 Total Errors

3-30

Removal and Replacement Procedures

Re-use parameters (YIN) [Y]
Requestor -# of K (1 thru 9)
Test -# (1 thru 17) (O) [] ?
-# of passes to perform (D)

? N ~
[] ? 6 IRETURN I
12 ~
[1] ? 10 ~IRE=T=U=RN=I

End of Pass -# 0000001, 00000 Errors, 00000 Total Errors

End of Pass -# 0000010, 00000 Errors, 00000 Total Errors
Re-use parameters (YIN) [Y] ? N I RETURN I
Requestor -# of K (1 thru 9) [ ] ? 6 IRETURN I
Test -# (1 thru 17) (0) [ ] ? 13 IRETURN I
-# of passes to perform (D) [1] ? 5 IRETURN I
End
End
End
End
End

of
of
of
of
of

Pass
Pass
Pass
Pass
Pass

-#
-#
-#
-#
-#

0000001,
0000002,
0000003,
0000004,
0000005,

Re-use parameters (YIN) [Y]
Requestor -# of K (1 thru 9)
Test -# (1 thru 17) (0) [ ] ?
-# of passes to perform (D)
End
End
End
End
End

of
of
of
of
of

Pass
Pass
Pass
Pass
Pass

-#
-#
-#
-#
-#

0000001,
0000002,
0000003,
0000004,
0000005,

Re-use parameters (YIN)

00000
00000
00000
00000
00000

Errors,
Errors,
Errors,
Errors,
Errors,

00000
00000
00000
00000
00000

Total
Total
Total
Total
Total

Errors
Errors
Errors
Errors
Errors

Total
Total
Total
Total
Total

Errors
Errors
Errors
Errors
Errors

N IRETURN I
? 6 IRETURN I
14 I RETURN I
[1] ? 5 I RETURN I

?

[]

00000
00000
00000
00000
00000

Errors,
Errors,
Errors,
Errors,
Errors,

00000
00000
00000
00000
00000

[Y] ? N ~

The following output is an example of a loopback test failure message:
Requestor -# of K (1 thru 9) [] ? 6 IRETURN I
Test -# (1 thru 17) (0) [] ? 11 ~
-# of passes to perform (D) [1] ? 5 ~IRE~T=URN~I
OKTS>00:01 T-#OOO E-#OOS U-OOO
K Timed-Out During Init
K-Status = 370
End of Pass -# 0000001, 00001 Errors, 00001 Total Errors

o

10. If you receive a failure message, check that the loopback connectors are securely installed.
Remove the K.si module and try it in a different slot. If these steps fail, replace the K.si. Be
sure to run the tests again after fixing the fault.
11. Set SW3 of the K.si switchpack to the OFF position.
12. Install or replace all SDI cables on the HSC bulkhead.
3.5.6.6 Initializing the K.sl Module
The K.si is by default a disk data channel after initial installation or on first boot of the HSC
software. This default can result in a mismatch between the K.si configuration and the devices
attached to the K.si. The mismatch results in a series of device errors printed on the HSC console,
leading to the mismatched deviceCs) being declared inoperative by the HSC.

This mismatch can happen under the following conditions:
•

Mter initial installation of the K.si and the attached devices are tape drives.

•

Mter initial installation of HSC software.

Removal and Replacement Procedures

3-31

•

When replacing tape formatters with disk drives after the K.si has been configured for tape
formatters.

•

When replacing disk drives with tape formatters after the Ksi has been configured for disk
drives.

3.5.6.7 Correcting K.si Module Configuration Problems

To correct configuration problems, connect the data channel to the proper drive or use the following
procedure to reconfigure the Ksi:
1.

Press the Init switch on the OCP. The HSC prints the following message to signify that
initialization has started:
INIPIO-I Booting ...
HSCxx Version 3.90 11-Feb-1988 17:00:41

System HSC009

NOTE

The term HSCxx refers to the HSC model that is receiving the K.si module.
2. Mter initialization, use the SETSHO command SHOW REQUESTORS to show the status of the
requestors. In the following example, the Ksi modules are in requestors 2, 3, 4,6, and 8; note
that these modules show up as K.sdi modules.
C'1!P:L/Y

HSCxx> SHOW RZQOBSTORS
Req
Status
Type
o
Enabled
P.ioc
1
Enabled
K.ci
2
Enabled
K.sdi
Enabled
K.sdi
3
4
Enabled
K.sdi
Enabled
Empty
5
6
Enabled
K.sdi
Enabled
Empty
7
8
Enabled
K.sdi
Enabled
Empty
9
SETSHO-I Program Exit

~

Version
MCMCMCMC-

43 DSDSDSDS-

2
2
2

MC- 2
MC-

Next Microcode Load

2 Pila-O K.pli-32
4
4
4

DS- 4
2 DS- 4

3. Change the configuration of requestors 2 and 8 to tape data channels. Enter reconfiguring
commands as shown, then re-initialize the system:
NOTE

Ensure the system load media is write enabled.
C'1!P:L/Y

HSCxx> RON SETSHO I~Tmml
SETSHO> BRABLI: RBBOOT IRETURN I
SETSHO-S The HSC will reboot on exit.
SETSHO> SET RZQOBSTOR 2/TYPE=TAPE ""~=T=U=RN=
SETSHO> SET RZQOBSTOR 8/TYPE=TAPE ~
SETSHO> EXIT I~TURNI
SETSHO-Q Rebooting HSC, type Y to continue, CTRL/Y to abort: Y
INIPIO-I Booting ...
HSCxx Version 3.90 11-Feb-1988 17:00:41

System HSC009

This configuration is retained on the boot media to ensure that the K.si module comes up in the
proper data channel configuration when the HSC is rebooted. If you have a K.si configured as a

3-32

Removal and Replacement Procedures

tape data channel and you attach disk drives, you can reconfigure it using the above procedure and
specifying TYPE=DISK
4. Use the SHOW REQUESTORS command again to current configuration of the Ksi modules:
CTRL/Y
HSCxx> SROW REQUESTORS I RETURN I
Next Microcode Load
Req
Status
Type
Version
o
Enabled
P.ioc
K.ci
1
Enabled
MC- 43 DS- 2 Pila-O K.pli-32
2
Enabled
K.sti
MC- 2 DS- 3
K.sdi
MC- 2 DS- 4
3
Enabled
K.sdi
4
Enabled
MC- 2 DS- 4
5
Enabled
Empty
K.sdi
MC- 2 DS- 4
6
Enabled
7
Enabled
Empty
K.sti
MC-2
DS- 3
8
Enabled
9
Enabled
Empty
SETSHO-I Program Exit

3.5.6.8 K.si Module New Boot Microcode

When changing to a new boot media, you must power down the HSe to clear the old microcode from
the K.si. A power-down interval of about 15 seconds is adequate. Mter powering up again, reboot
and use the following procedure:
1. Use the SETSHO command SHOW REQUESTORS to check the existing configuration and
verify necessary changes.
SET REQUESTOR n/TYPE=xxxx
where:
n is the requestor number
xxxx is the requestor type (DISK or TAPE)

2. Repeat the command SET REQUESTOR for each Ksi in the HSe to set the HSe configuration
on the new boot media.
Table 3-3 describes the conditions that determine if new Ksi microcode is loaded.
Table 3-3

K.si New Microcode Load Conditions

Action

New Microcode Load

Using the ENABLE REBOOT and
EXIT commands after using the SET
REQUESTOR ntrYPE=xxxx command.

Yes.

Booting the system after a total power
failure or after powering down the HSC.

Yes.

Changing requestor modules. (This action
requires powering down.)

Yes.

Using the SET REQUESTOR
ntrYPE=xxxx command.

No.

Changing to new boot media.

No-The new boot media must be updated with the SETSHO
command SET REQUESTOR ntrYPE=xxxx and the HSC must
be rebooted.

Removal and Replacement Procedures

Table 3-3 (Cont.)

3-33

K.si New Microcode Load Conditions

Action

New Microcode Load

Using the SET SCT CLEAR command.

N~The new boot media must be updated with the SETSHO
command SET REQUESTOR ntrYPE=xxxx and the HSC must
be rebooted.

Holding in the Fault button while pushing
in the Init switch. (This action clears the
SCT.)

N~The

boot media must be updated with the SETSHO
command SET REQUESTOR nlTYPE=xxxx and the HSC
must be rebooted.

3.5.6.9 Testing the K.si Module (After Initialization)

The Ksi module is one of the K requestor interface modules. Perform the following to verify correct
Ksi operation:
1.

Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

•

Off-line K test selector test

•

Off-line KIP memory test

3. Place the SecurelEnable switch in the secure position.
4.

Boot the HSC with the system media by pressing and releasing the Init switch.

5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.
7. If the K.si is configured as a disk data channel, run the disk drive integrity test ILDISK. Refer
to Chapter 5 for test description and procedure.
8. If the K.si is configured as a tape data channel, run the tape drive integrity test ILTAPE. Refer
to Chapter 5 for test description and procedure.

3.5.7 Removing and Replacing the 1/0 Control Processor Module (P.ioj/c)
The P.ioj module (LOIIIILOIII-YA) uses a PDP-II ISP (J-II) processor. The P.ioc module (LOI05)
uses a PDP-II ISP (F-II) processor. Both contain memory management and memory interfacing
logic. These processors execute their respective HSC internal software.
3.5.7.1 Removing the P.ioj/c Module

Use the following procedure to remove the P.ioj/c module. Observe safety and ESD precautions
before starting the module removal procedure.
1.

Press CTRLIY to get the HSC> prompt. Use the SETSHO command SHOW SYSTEM and save
the printout for reference.

2. Notify users that the HSC is being taken off line and the drives attached to it will not be
available.
3. Dismount or failover any drives connected to the HSC.

3-34

Removal and Replacement Procedures

4. Set the de power switch to the 0 (off) position.
On the HSC, the de power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
5. Turn the two nylon latches on the module cover plate one-quarter turn.
6. Pull the card cage cover up and out.
7. Locate the P.ioj/c module in slot number 1 of the card cage. This can be verified by the module
utilization label.
8. Remove the P.iojlc module.
3.5.7.2 Setting the Replacement P.ioj/c Module Jumpers

The P.ioj/c modules have factory-set jumpers. Each module has a unique serial number that
matches the pattern of the jumpers. Do not reconfigure these jumpers.
The P.ioc (L0105) also has a baud rate jumper. When the P.ioc is replaced, set the baud rate jumper
W3 to match the console terminal or duplicate the jumper configuration of the P.ioc being replaced.
Figure 3-19 shows the P.ioc module jumper location.

X149
X158

X157~

tj
CXO-2694A

Figure 3-19

L0105 Baud Rate Jumper

Set the baud rate jumper as follows:
For 9600 baud, leave jumper W3 intact.
For 300 baud, cut one elbow angle on the W3 lead and spread slightly to avoid contact with the
cut edges.
3.5.7.3 Replacing the P.loj/c Module

This section provides P.iojlc module replacement procedure. Observe safety and ESD precautions
before starting module replacement procedures.
1. Install the P.ioj/c module in slot number 1 of the card cage. This can be verified by the module
utilization label.

2. Pull the card cage cover down and in.
3. Turn the two nylon latches on the module cover plate one-quarter turn.
4. Set the dc power switch to the 1 (on) position.

Removal and Replacement Procedures

3-35

On the HSC, the dc power switch is located on the side of the RX33 housing.
On the HSC50, the dc power switch is located on the maintenance access panel.
NOTE

Once VAXNMS recognizes an HSC, the HSC's Online indicator may show that the
HSC is alternately going on line and off line. This is because there is a discrepancy
between the nodename or ID of the HSC and the one recognized by the host for that
HSC. The HSC will be allowed to function only if the old nodename is equal to the
new nodename and the old ID is equal to the new ID.
5. Press CTRLIY to get the HSC> prompt, and issue the SETSHO command SHOW SYSTEM.
Compare this printout with the one saved during removal.
If the printout for the NodenamelID is different, use the SETSHO commands SET NAME or
SET ID to change the NodenamelID so it is the same as in the saved printout.
3.5.7.4 Testing the P.ioj/c Module

When booting the HSC with the off-line diagnostic media, the P.iojlc ROM bootstrap verifies the
basic integrity of the P.iojlc module.
Perform the following to verify correct P.ioj operation:
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line cache test (P.ioj only)

•

Off-line bus interaction test

•

Off-line K test selector test

•

Off-line KIP memory test

3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.

3.5.8 Removing and Replacing the HSC Memory Module (M.std2)
Memory module M.std2 (LOl17) is used in the HSC only. It contains three independent systems
memories, each residing on a different bus in the HSC. In addition, the memory module contains
the RX33 diskette controller.
3.5.8.1 Removing the M.std2 Module

Use the following procedure to remove the M.std2 module. Observe safety and ESD precautions
before starting the module removal procedure.
1. Notify users that the HSC is being taken off line and the drives attached to it will not be

available.
2. Dismount or failover any drives connected to the HSC.

3-36

Removal and Replacement Procedures

3. Set the dc power switch to the 0 (of!) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the card cage cover up and out.
6.

Locate the M.std2 module in slot number 2 of the card cage. This can be verified by the moduleutilization label.

7. Remove the M.std2 module.
3.5.8.2 Replacing the M.std2 Module
This section provides the M.std2 module replacement procedure. Observe safety and ESD
precautions before starting the module replacement procedure.
CAUTION

The switch pack on the M.std2 module is factory set to calibrate the RX33 diskette
controller. Do not change the setting of this switch pack; the switch settings are unique
to each module and cannot be restored outside of the manufacturing environment.
1. Install the M.std2 module in slot number 2 of the card cage. This can be verified by the module
utilization label.
2. Replace the M.std2 module.
3. Pull the card cage cover down and in.
4.

Turn the two nylon latches on the module cover plate one-quarter turn.

5. Set the dc power switch to the 1 (on) position.
On the HSC, the dc power switch is located on the side of the RX33 housing.
6.

Press CTRL/C to get the HSC> prompt.

7. Issue the SET MEMORY ENABLE ALL command.
8. Mter the HSC reboots, type the command SHOW MEMORY. Check that the available memory
is equal to the maximum memory, except for 32 (decimal) words, which are disabled for lock
functionality.
3.5.8.3 Testing the M.std2 Module
Perform the following to verify correct M.std2 operation:

1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2.

Refer to Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

•

Off-line KIP memory test

•

Off-line memory test

•

Off-line refresh test

3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the lnit switch.

Removal and Replacement Procedures

3-37

5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS and ensure both A and B paths are
present to all hosts.
7. Run the memory integrity test ILMEMY and refer to Chapter 5 for test description and
procedure.

3.5.9 Removing and Replacing the HSC50 Memory Module (M.std)
The HSC50 memory module (LOI06) contains three separate and independent systems memories,
each residing on a different bus within the HSC50.

3.5.9.1 Removing the M.std Module
Use the following procedure to remove the M.std module. Observe safety and ESD precautions
before starting the module removal procedure.
1. Notify users that the HSC is being taken off line and the drives attached to it will not be
available.
2.

Dismount or failover any drives connected to the HSC.

3. Set the dc power switch to the 0 (off) position.
On the HSC50, the de power switch is located on the maintenance access panel.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Pull the card cage cover up and out.
6. Locate the M.std module in slot number 2 of the card cage. This can be verified by the module
utilization label.
7. Remove the M.std module.

3.5.9.2 Replacing the M.std Module
This section provides the M.std module replacement procedure. Observe safety and ESD
precautions before starting the module replacement procedure.
1. Install the M.std module in slot number 2 of the card cage. This can be verified by the module
utilization label.
2. Replace the M.std module.
3. Pull the card cage cover down and in.
4. Turn the two nylon latches on the module cover plate one-quarter turn.
5. Set the dc power switch to the 1 (on) position.
On the HSC50, the de power switch is located on the maintenance access panel.
6.

Press CTRL/C to get the HSC> prompt.

7.

Issue SET MEMORY ENABLE ALL command.

S. Mter the HSC50 reboots, type the command SHOW MEMORY. Check that the available
memory is equal to the maximum memory, except for 32 (decimal) words, which are disabled for
lock functionality.

3-38

Removal and Replacement Procedures

3.5.9.3 Testing the M.std Module

Run the following tests to verify correct M.std operation.
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Refer to the Chapter 6 for test descriptions and procedures and run the following tests:
•

Off-line bus interaction test

•

Off-line KIP memory test

•

Off-line memory test

•

Off-line refresh test

3. Place the SecurelEnable switch in the secure position.
4.

Boot the HSC with the system media by pressing and releasing the Init switch.

5. Bring the HSC on line by pressing and releasing the the Online switch.
6.

Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.

7.

Run the memory integrity test ILMEMY and refer to Chapter 5 for test description and
procedure.

3.6 Removing and Replacing Subunits
This section contains procedures for removing and replacing subunits.
WARNING:

Because hazardous voltages exist inside the HSC, service must be performed only by
qualified people. Bodily injury or equipment damage can result from improper servicing
procedures.

3.6.1 Removing and Replacing the RX33 Disk Drive
Two RX33 disk drives are used to load the HSC software or off-line diagnostics. The RX33 disk
drives are mounted in the HSC cabinet. A cover plate ensures proper air flow and cooling. When
removing and replacing the RX33, avoid snagging the cables attached to the rear of the drive. After
replacing an RX33, always replace the cover plate.
3.6.1.1 Removing the RX33 Disk Drive

Use the following procedure to remove the RX33 disk drive:
1. Notify users that the HSC is being taken off line and the drives attached to it will not be
available.

2.

Dismount or failover any drives connected to the HSC.

Removal and Replacement Procedures

3. Turn off the de power switch, located on the side of the RX33 housing (Figure 3-20).

HSC70
DC POWER
SWITCH

OCP SIGNAL!
POWER LINE
CONNECTOR

Figure 3-20

HSC DC Power Switch

3-39

3-40

Removal and Replacement Procedures

4. Rotate the four fasteners on the RX33 cover plate one-quarter turn and remove the cover plate
(Figure 3-21).

QUARTER-TURN
FASTENER

\
DRIVE
COVER
PLATE

o
CXO-1118A

Figure 3-21

Removing the RX33 Cover Plate

5. Loosen the two captive screws holding the drive assembly and mounting plate to the cabinet
frame.
CAUTION

Avoid snagging the cables attached to the rear of the drives during the next step_
6. Carefully slide the drive assembly out until the housing is cleared.
7. Support the drive assembly with one hand and remove the fiat ribbon cables and power cables
from the rear of the drives.
8. Determine whether drive 0 or drive 1 should be replaced.

Removal and Replacement Procedures

3-41

9. Loosen the captive screws on the drive to be replaced and remove the drive from the drive
assembly (Figure 3-22).
CAPTIVE
SCREW

RX33

MOUNTING
PLATE

Figure 3-22

RX33 Disk Drive Removal

3.6.1.2 Setting the RX33 Disk Drive Jumpers
Replacement RX33 drives are not configured for the HSC. Two identical jumpers (part number 1218783-00) must be added. If no extra jumpers are available, remove the jumpers from the defective
drive. Correct jumper configuration is necessary for the operation of the replacement RX33 drive.

If replacing drive 0, be sure to insert jumper DSO. If replacing drive 1, be sure to insert jumper
DSl.
The RX33 module may be revision A1 or A3. Table 3-4 shows the jumper differences and
configurations for both revisions when the drive is used in an HSC.

3-42

Removal and Replacement Procedures

Table 3-4

RX33 Jumper Description

Rev A!
Name

RevA3
Name

Description

Status
In or Out

FG

FG

Frame ground

In

HG

Hi gain

In

LG

Lo gain

Out

I

SI

Speed, mode 1
Dual speed

Out

II

II

Speed, mode 2
360 RPM only

In

DSO

DO

Drive select 0

In to select drive 0

DS1

D1

Drive select 1

In to select drive 1

DS2

D2

Drive select 2

Out

DS3

D3

Drive select 3

Out

U1

UO

Selects mode of operation
for loading the heads and
lighting the bezel LED (See
note)

In

U2

U1

See Ul/UO above

In

HL

HL

Not applicable to HSC use

Out

IU

IV

Not applicable to HSC use

Out

ML

Motor enable

Out

Recalibration

Out

DC1

Disk changed on pin 34

Out

DC2

Factory setting

In

DC3

Not applicable to HSC use

Out

DC4

Not applicable to HSC use

Out

RY

Ready on pin 34

In

RE
DC

RY

NOTE

The HSe loads the heads and lights the drive-in-use LED when the DRIVE SELECT n
and READY signals are both true.

Removal and Replacement Procedures

Figure 3-23 shows the jumper locations for RX33 with a revision Ai module.
POWER
CONNECTOR

LG

HG

~
~
II
I
DRIVE SELECT
JUMPERS

DSO

DS1
DS2
DS3

•
•
•
EDGE
CONNECTOR

•
•

00

'--_--' 20

RE
DC
RY

L..-_--'30
L..-_--'32

o
MFD CONTROL
BOARD

RESISTOR
TERMINATION
PACK (INSTALLED)

I. .1 INDICATES JUMPER INSTALLED
CXO-2699A

Figure 3-23

Revision A1 Jumper Configurations

3-43

3-44

Removal and Replacement Procedures

Figure 3-24 shows the jumper locations for RX33 with a revision A3 module.
POWER
CONNECTOR

~
II

IS

IL

KEY

DRIVE SELECT
JUMPERS

U1
UO
DO
D1
D2
D3

I: I
IWI:I:I:I:I

10

OLE

EDGE
CONNECTOR

RY ML IU HL HS

20

Ie •• 11'e e' el
DC4

30

DC3 DC2

DC1

32

0
MFD CONTROL
BOARD

RESISTOR
TERMINATION
PACK (INSTALLED)

,- -, INDICATES
JUMPER
INSTALLED
CXO-2700A

Figure 3-24

Revision A3 Jumper Configurations

Removal and Replacement Procedures

3-45

3.6.1.3 Replacing the RX33 Disk Drive

Use the following procedure to replace the RX33 disk drive assembly:
1. Replace the drive in the drive assembly and tighten the drive captive screws.

2. Support the drive assembly with one hand and attach the flat ribbon cables and power cables to
the rear of the drives.
3.

Carefully slide the drive assembly into the drive housing.

4. Replace the cover plate and tighten the captive screws holding the drive assembly.
5. Replace the ac plug in the wall socket and place the main power switch on the power controller
in the on position.
6. The drive-in-use LED lights while the drive is accessed and extinguishes after the drive access
is completed or after the drive motor stops.
3.6.1.4 Testing the RX33 Disk Drive

Mter replacing the E,X.33, use the following procedure to test the drive:
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2.

Refer to Chapter 6 for a test description and procedure and run the RX33 off-line exerciser
OFLRXE.

3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.
7. Refer to Chapter 5 for test description and procedure and run the RX33 device integnty test
ILRX33.

3.6.2 Removing and Replacing the TU58 Tape Drive
Two TU5S tape drives are used to load the HSC50 software or off-line diagnostics. The TU5S tape
drives are mounted on the rear of the HSC50 front door.
CAUTION

When servicing the TU58, avoid bending the tachometer disk mounted on the drive
motor shaft. If the disk is bent but not creased, it may be straightened. If it cannot be
straightened or if it is creased, the TU58 must be replaced. The disk should not rub
against the optical sensor block or dangling wires.
3.6.2.1 Removing the TU58 Tape Drive
Use the following procedure to remove the TU5S tape drive:

1. Notify users that the HSC is being taken off line and the drives attached to it will not be

available.
2. Dismount or failover any drives connected to the HSC.
3. Remove the maintenance access panel cover by loosening the four captive screws.

3--46

Removal and Replacement Procedures

4. Turn off the de power switch (Figure 3-25).
DC POWER
SWITCH

ON POSITION (1)

TU58
CONNECTORS

OFF POSITION (0)

OCP
CONNECTOR

CONNECTORS
RESERVED FOR
FUTURE USE

MAINTENANCE
ACCESS PANEL

MAINTENANCE
TERMINAL
SIGNAL
CONNECTOR
CXO-014B

Figure 3-25

HSC50 DC Power Switch

Removal and Replacement Procedures

5. Remove the two locknuts on the bottom of the TU58 bezel assembly (Figure 3-26).

•

--- -•

11/32 NUT
DRIVER

Figure 3-26

Removing the HSC50 TU58 Bezel Assembly

6. Push the bezel assembly up about 1 inch to clear the mounting hooks from their slots.
7. Pull the bezel assembly back 3 to 4 inches from the door for clearance.

3-47

3-48

8.

Removal and Replacement Procedures

Support the bezel assembly with one hand and disconnect J3 and J4 from the OCP
(Figure 3-27).
J3
(20 PINS)

OPERATOR
CONTROL
PANEL PCB

PHILLIPS
SCREWS (4)

.-

Figure 3-27

Disconnecting the HSC50 OCP Cables

Removal and Replacement Procedures

3-49

9. Disconnect the cables from the TU58 controller module (Figure 3-28).
DRIVE 1
MECHANICS

SECURE/
ENABLE
SWITCH

DRIVE 0
MECHANICS

HEAD
COVER

CONTROLLER
MODULE
(PARTIALLY
PULLED OUT)

POWER
CONNECTOR"

BAUD RATE
JUMPERS
(FACTORY SET)
OPERATOR
CONTROL
PANEL
CONNECTOR

OPERATOR
CONTROL
PANEL
CONNECTOR
MAINTENANCE
ACCESS PANEL
CONNECTORS
.. CAUTION: CONNECTOR CAN BE REVERSED. OBSERVE PIN USAGE.

Figure 3-28

Disconnecting the HSC50 TU58 Controller Cables

NOTE

The head cover connector shown upper left in Figure 3-28 should be removed during
operation.
10. Slide the TU58 controller module out of the plastic guides.
3.6.2.2 Setting the TU58 Tape Drive Jumpers

The TU58 baud rate jumpers are factory set. Ensure the baud rate jumper setting on the new
module is the same as on the module being replaced.

3-50

Removal and Replacement Procedures

Figure 3-29 shows the TU5S jumper location.

~

L:.:..:..:J

••••••••••••
••••••••••••

BAUD RATE
JUMPERS
(FACTORY SET)

SELF-TEST
INDICATOR
CXO-2692A

Figure 3-29

TU58 Baud Rate Jumpers

3.6.2.3 Replacing the TU58 Tape Drive
Following is the procedure for replacing the TU5S tape drive:
CAUTION

When servicing the TU58, avoid bending the tachometer .disk mounted on the drive
motor shaft. If the disk is bent but not creased, it may be straightened. If it cannot be
straightened or if it is creased, the TU58 must be replaced. The disk should not rub
against the optical sensor block or dangling wires.
1. Slide the controller module into the housing on the plastic guides.

2. Connect the cables to the TU5S controller module.
3. Support the bezel assembly with one hand and connect J3 and J4 to the OCP.
4. Attach the bezel assembly to the mounting hooks.
5. Replace the two locknuts on the bottom of the TU5S bezel assembly.
6. Replace the ac plug in the wall socket and place the main power switch on the power controller
in the on position.

Removal and Replacement Procedures

3-51

3.6.2.4 Testing the TU58 Tape Drive
After replacing the TU58, use the following procedure to test the drive:
1. Place the SecurelEnable switch in the secure position.

2. Boot the HSC with the system media by pressing and releasing the Init switch.
3. Bring the HSC on line by pressing and releasing the the Online switch.
4. Use the SETSHO command SHOW VIRTUAL_CIRCUITS and ensure both A and B paths are
present to all hosts.
5. Run the TU58 device integrity test ILTU58. Refer to Chapter 5 for a description and procedure
for this test.

3.6.3 Removing and Replacing the HSC Operator Control Panel (OCP)
If any OCP lamp fails, replace the entire OCP.

3.6.3.1 Removing the HSC OCP
Use the following procedure to remove the HSC OCP:
1.

Open the front door by turning the key clockwise and lifting the latch.

2. Turn off the dc power switch located on the side of RX33 housing.
3. Remove the four Kepnuts securing the OCP shield to the studs on the front door.
4. Remove the OCP shield.

3-52

5.

Removal and Replacement Procedures

Remove the four screws securing the OCP to the shield (Figure 3-30).
KEPNUTS

OCP CABLE

~

OCP
MOUNTING
SCREWS

"-

INSIDE
FRONT
DOOR

CXO-938A

Figure 3-30

Removing the HSC OCP

6. Remove the two connectors from the printed circuit board on the OCP.
7. Pullout the OCP, carefully allowing for indicator and switch clearance.
3.6.3.2 Replacing the HSC OCP
Following is the procedure for replacing the OCP:
1.

Replace the two connectors from the printed circuit board on the OCP.

2. Secure the OCP to the shield using the four screws that were removed.
3. Replace the OCP shield.
4. Replace the four Kepnuts securing the OCP shield to the studs on the front door.
5. Turn on the dc power switch located on the side of RX33 housing.

Removal and Replacement Procedures

3-53

6. Close and secure the front door by turning the key counter-clockwise.
3.6.3.3 Testing the HSC OCP

Mter replacement, use the following procedure to test the OCP:
1.

Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Run the off-line OCP test. Refer to Chapter 6 for a test description and procedures.
3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.

3.6.4 Removing and Replacing the HSC50 Operator Control Panel (OCP)
OCP indicators are not field replaceable. If any lamp fails, replace the entire OCP.
3.6.4.1 Removing the HSC500CP

Use the following procedure to replace the HSC50 OCP:
1.

Open the front door by turning the key clockwise.

2. Remove dc power.
3. Remove the TU58s (Section 3.6.2).
4. Remove J3 and J4 from the OCP (Figure 3-31).
5. Remove the four screws from the OCP (Figure 3--31).
6. Carefully pullout the OCp, allowing for indicator and switch clearance.

3-54

Removal and Replacement Procedures

J3
(20 PINS)

OPERATOR
CONTROL
PANEL PCB

PHILLIPS
SCREWS (4)

Figure 3-31

Removing the HSC50 OCP

Removal and Replacement Procedures

3-55

3.6.4.2 Replacing the HSC50 OCP

Following is the procedure for replacing the OCP:
1. Carefully replace the OCp, allowing for indicator and switch clearance.

2. Replace the four OCP screws (refer to Figure 3-31).
3. Connect J3 and J4 to the OCP (refer to Figure 3-31).
4. Replace the TU58s (Section 3.6.2).
5. Turn on the dc power.
6. Close the front door by turning the key counterclockwise.
3.6.4.3 Testing the HSC500CP

Mter replacement, use the following procedure to test the OCP:
1. Boot the HSC with the off-line diagnostic media. Refer to Chapter 6 for boot procedures.
NOTE

The off-line diskette must be write protected. Place a write-protect tab over the
diskette write-enable notch.
2. Run the off-line OCP test. Refer to Chapter 6 for a test description and procedure.
3. Place the SecurelEnable switch in the secure position.
4. Boot the HSC with the system media by pressing and releasing the Init switch.
5. Bring the HSC on line by pressing and releasing the the Online switch.
6. Use the SETSHO command SHOW VIRTUAL_CIRCUITS to ensure both A and B paths are
present to all hosts.

3-56

Removal and Replacement Procedures

3.6.5 Removing and Replacing the HSC Airflow Sensor Assembly
Use the following procedure to remove and replace the HSe Airflow Sensor:
1. Open the back door using a 5/32-inch hex wrench.
2. Turn off the ac circuit breaker (CBl) on the 881 power controller (Figure 3--32).
3. Disconnect J70 (Figure 3-33).
4. Remove the Phillips head screw that holds the mounting clamp to the duct (Figure 3-33).

(f)

o

(f)

~

:rn rn rn m:
JI3JI2J11 J10

(;) OD

o

CIRCUIT
BREAKER

POWER
CONNECTOR

CXO-1117A

Figure 3-32

881 Power Controller Circuit Breaker

Removal and Replacement Procedures

3-57

PHILLIPS
SCREW

SENSOR
CLAMP

Figure 3-33

Removing and Replacing the HSC Airflow Sensor Assembly

5. Slide the sensor assembly out of the duct.
6. Reverse the removal procedure to replace the airflow sensor assembly. Align the slots in the
airflow sensor tip horizontally with the floor. Mter turning on ac power to the HSC, test the
new airflow sensor for proper operation by blocking the flow of air.

3-58

Removal and Replacement Procedures

3.6.6 Removing and Replacing the HSC50 Airflow Sensor Assembly
Use the following procedure to remove and replace the HSC50 airflow sensor assembly:
1.

Open the back door using a 5/32-inch hex wrench.

2. Turn off the ac circuit breaker (CBI) on the HSC50 power controller (Figure 3-34).
DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

REMOTE/
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

LINE
POWER
CIRCUIT
BREAKERS

CB1
CB2-4
(SWITCHED)
~:::-1--~:;;;:::;:::::;t

FUSE

CBS
(UNSWITCHED)

CXO-013B

Figure 3-34

HSC50 Power Controller Circuit Breaker

Removal and Replacement Procedures

3-59

3. Disconnect J70 (Figure 3-35).
4. Remove the Phillips head screw that holds the mounting clamp to the duct (Figure 3-35).

~~: ~;r :~':"':

\,', :, :;,:,':

~ ,,:;.::.:~.::.:,:

...

"

AIRFLOW
SENSOR
I

.

"
"
"

Figure 3-35

;:

. t
•• ,

:. :::~
.
. . ..:
':.

Removing and Replacing the HSC50 Airflow Sensor Assembly

5. Slide the sensor assembly out of the duct.
6. Reverse the removal procedure to replace the airflow sensor assembly. Align the slots in the
airflow sensor tip horizontally with the :floor. Ensure sensor operability by blocking the :flow of
air. Pinching the sensor should trip CB1.

3-60

Removal and Replacement Procedures

3.6.7 Removing and Replacing the HSC Blower
The blower, which provides forced air cooling for the cabinet, is removed and replaced with the
following procedure:
1.

Open the back door using a 5/32-inch hex wrench.

2. Turn off the ac circuit breaker (CBl) on the 881 power controller (Figure 3-36).

(f)

o

G)

~

:rn mmm:
JI3JI2J11 J1 0

@OD

o

CIRCUIT
BREAKER

POWER
CONNECTOR

CXO-1117A

Figure 3-36

881 Power Controller Circuit Breaker

Removal and Replacement Procedures

3-61

3. Disconnect the blower power connector (Figure 3-37).
4. Disconnect the airflow sensor power connector (J70) to allow removal of the exhaust duct
(Figure 3-37).
5. Remove the exhaust duct from the bottom of the blower by lifting up the quick release latches
on each side of the duct (Figure 3-37).

PHILLIPS
SCREWS (3)
(SECURE BLOWER
MOUNTING BRACKET)

REMOVABLE
EXHAUST
DUCT
COOLING
BLOWER
POWER
CONNECTOR

AIRFLOW SENSOR
POWER CONNECTOR
(J70)

Figure 3-37

AIRFLOW
SENSOR

Removing and Replacing the HSC Main Cooling Blower

6. Loosen, but do not remove, the three Phillips screws holding the blower mounting bracket to
the cabinet.
7. Lift the blower and bracket up and out of the cabinet.
8. Reverse the removal procedure to replace the cooling blower.

3-62

Removal and Replacement Procedures

3.6.8 Removing and Replacing the HSC50 Blower
The blower, which provides forced air cooling for the cabinet, is removed and replaced with the
following procedure:
1. Open the back door using a 5/32-inch hex wrench.
2. Turn off ac power (CEl on the power controller) (Figure 3-38).
DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

REMOTE/
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

LINE
POWER
CIRCUIT
BREAKERS

CB1
CB2-4
(SWITCHED)
~:::-i--~;;;:::;::::::;-t

FUSE

CBS
(UNSWITCHED)

CXO-013B

Figure 3-38

HSC50 Power Controller Circuit Breaker

Removal and Replacement Procedures

3-63

3. Disconnect the blower power connector (Figure 3-39).
4. Disconnect the airflow sensor power connector (J70) to allow removal of the exhaust duct
(Figure 3-39).
5. Remove the exhaust duct from the bottom of the blower by lifting up the quick release latches
on each side of the duct (Figure 3-39).
6. Loosen, but do not remove, the three Phillips screws holding the blower mounting bracket to
the cabinet (Figure 3-39).

PHILLIPS
SCREWS (3)
(SECURE BLOWER
MOUNTING BRACKET)

REMOVABLE
EXHAUST
DUCT
COOLING
BLOWER
POWER
CONNECTOR

AIRFLOW SENSOR
POWER CONNECTOR
(J70)

Figure 3-39

AIRFLOW
SENSOR

QUICKRELEASE
LATCHES

Removing and Replacing the HSC50 Blower

7. Lift the blower and bracket up and out of the cabinet.
S. Reverse the removal procedure to replace the blower.

3-64

Removal and Replacement Procedures

3.6.9 Removing and Replacing the 881 Power Controller
The power controller must be removed to replace a power supply.
Use the following procedure to remove and replace the 881 power controller:
1.

Open the back door using a 5/32-inch hex wrench.

2. Remove rear door latch to allow clearance for power controller removal.
3. Remove ac power by placing CBl in the off position (Figure 3-40).

(t)

o

(t)

~

:rn rn rn m:
JI3JI2J11 J1 0

(!)O[J

o

CIRCUIT
BREAKER

POWER
CONNECTOR

CXO-1117A

Figure 3-40

881 Power Controller Circuit Breaker

4. Unplug the power controller from the power source (Figure 3-41).
5. Remove the two top screws and then the two bottom screws securing the power controller to the
cabinet (Figure 3-41). While removing the two bottom screws, push up on the power controller
to take the weight off the screws.

Removal and Replacement Procedures

MAIN POWER
SUPPLY LINE
CORD

3-65

COOLING
BLOWER
LINE CORD

01

PHASE DIAGRAM
AUXILIARY
POWER SUPPLY
LINE CORD

POWER

....-=-I CONTROLLER

~

SCREWS

POWER
CONTROLLER
LINE CORD
CXO-941C

Figure 3-41

Removing and Replacing the 881 Power Controller

CAUTION

Do not pull the power controller out too far because cables are connected to the back
and top_

3-66

Removal and Replacement Procedures

6. Pull the power controller towards you and then out.
7. Remove the power control bus cables from connectors JI0, JII, J12, and JI3 at the front of the
power controller (Figure 3-40).
8. Disconnect the total off connector at the rear of the power controller (Figure 3-42).

TOTAL OFF
CONNECTOR

CXO-934A

Figure 3-42

881 Total Off Connector

9. Disconnect all line cords from the top of the power controller.
NOTE

Be sure to rotate the line cord elbow to the vertical position if replacing a defective
power controller with a new one. To rotate the elbow, remove the set screw, rotate
the elbow to the position shown in Figure 3-40, and replace the set screw in the other
hole.
10. Reverse the removal procedure to replace the power controller.
NOTE

To ensure proper phase distribution, reconnect the main power supply, auxiliary
power supply, and cooling blower line cords as shown in Figure 3-41.

Removal and Replacement Procedures

3.6.10 Removing and Replacing the HSC50 Power Controller
The HSC50 power controller must be removed to replace a power supply.
Use the following procedure to remove and replace the HSC50 power controller:
1. Open the back door using a 5/32-inch hex wrench.

2. Remove rear door latch to allow clearance for power controller removal.
3. Turn off ac power (CBl on the power controller) (Figure 3-43).
DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

REMOTE/
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

LINE
POWER
CIRCUIT
BREAKERS

CB1
CB2-4
(SWITCHED)
~::::-t--~;::::;:::~

FUSE

CBS
(UNSWITCHED)

CXO-013B

Figure 3-43

HSC50 Power Controller Circuit Breaker

4. Unplug the power controller from the power source.

3-67

3-68

Removal and Replacement Procedures

5. Remove the two top screws and then the two bottom screws securing the power controller to the
cabinet (Figure 3-44). While removing the two bottom screws, push up on the power controller
to take the weight off the screws.
COLLING
BLOWER
LINE CORD

MAIN
POWER
SUPPLY
, ..
." . ...
! •••

......
- .. ,

.'.:

• - I'

"
~

..,

. '~

'.

.

'.'

::'~;{?~';::" .

MAIN POWER
SUPPLY
LINE CORD
AUXILIARY
POWER
SUPPLY
CONNECTORS
J1,J2, J3

AUXILIARY
POWER SUPPLY
LINE CORD

POWER
CONTROLLER
SCREWS
POWER
CONTROLLER
LINE CORD

Figure 3-44

Removing and Replacing the HSC50 Power Controller

CAUTION

Do not pull the power controller out too far because cables are connected to the back
and top.
6.

Pull the power controller towards you and then out.

7. Remove the power control bus cables from connectors Jl, J2, and J3 at the front of the power
controller (Figure 3-43).
8. Turn off ac power (CBl on the power controller) (Figure 3-43).

Removal and Replacement Procedures

9. Reverse the removal procedure to replace the power controller.

3.6.11 Removing and Replacing the HSC Main Power Supply
Use the following procedure to remove and replace the HSC main power supply:
WARNING
The power supply is heavy. Support it with both hands to avoid dropping it.
1.

Open the back door using a 5/32-inch hex wrench.

2. Turn off ac power (CBl on the power controller) (Figure 3-45).

(±)

o

(±)

~

:rn rn rn rn:
JI3JI2J11 J1 0

000

o

CIRCUIT
BREAKER

POWER
CONNECTOR

CXO-1117A

Figure 3-45

881 Power Controller Circuit Breaker

3. Unplug the power controller from the power source.
4. Remove the front door.
5. Remove the power controller (Section 3.6.9) to access the back of the power supply.

3-69

3-70

Removal and Replacement Procedures

6. Unplug the main power supply line cord at the power controller.
NOTE

While performing 7 through 15, refer to (Figure 3-46).
7. Remove the nut from the -VI stud (ground) on the back of the power supply.
8. Remove the nut from the +VI stud (+5 volts) on the back of the power supply.
9. Remove the nut from the - V2 (ground) stud on the back of the power supply.
10. Remove the nut from the +V2 (-5.2 volts) stud.
11. Unplug J31 (+12 VDC output from the supply to backplane, power fail, and -5 volts sense line).
12. Unplug P32 (+12 VDC sense line and +5 VDC sense line).
13. Unplug J33 (to dc power switch).
14. Unplug J34 (remote on/off jumper to auxiliary power supply).
15. Unplug J35 (+12 VDC power to the airflow sensor).
Figure 3-46 shows the HSC main power supply test points.

Removal and Replacement Procedures

3-71

WIRE LIST
COLOR
PURPLE
PURPLE

SIGNAL

POSITION

12 V

PURPLE

TB1-3-1

12 V SENSE

TBI-3-6

12 V

BLUE

TB1-2-7

ACC

BROWN

AC

GND (12 V)

TB1-2-6

TBI-3-3

GRN/YEL

TB1-2-5

GND

-5 V SENSE

YELLOW

TB1-2-3

ON/OFF (-5, 3 V)

TB1-2-2

-5 V SENSE (52-)

TBI-3-5

BLACK
BLACK
ORANGE

SIGNAL

COLOR

POSITION

TBI-2-2

BLACK

TBI-2-1

GND (-5 V SENSE)

ORANGE

BROWN

TBI-1-4

POWER FAIL

BLUE

TB1-1-3

ON/OFF 5 V

BLACK

TBI-1-2

GND (5 V SENSE)

BLACK

TB1-1-2

GND (5 V SENSE)

RED

TB1-1-1

5 V SENSE

PURPLE

TB1-3-2

12 V

BLACK

TB1-3-4

GND (12 V SENSE)

MAIN POWER SUPPLY - REAR VIEW

POWER FAIL

LINE CORD
CONN ECTIONS

J33 DC
POWER
SWITCH
CONNECTOR

@
J34 AUXILIARY
POWER SUPPLY
CONNECTOR

~

TO BACKPLANE

FLEXBUS
CXO-942B_S

Figure 3-46

HSC Main Power Supply Cables and Test Points

3-72

Removal and Replacement Procedures

16. Turn the four captive screws on the front of the power supply counterclockwise (Figure 3-47).

MAIN POWER
SUPPLY CABLES

CAPTIVE
SCREWS

CXO-1157A

Figure 3-47

Removing and Replacing the HSC70 Main Power Supply

17. Pull the power supply out about an inch. Check the back of the cabinet to ensure the cables
and flexbus connectors are clear and will not snag when the supply is completely removed.
18. Carefully pull the power supply all the way out of the cabinet.
19. Remove the power cord from the failing unit and install it on the new power supply.
NOTE

Spare power supplies are not shipped with a power cord.
20. Reverse the removal procedure to replace the main power supply.

Removal and Replacement Procedures

3.6.12 Removing and Replacing the HSC50 Main Power Supply
Use the following procedure to remove and replace the HSC50 main power supply:

WARNING
The power supply is heavy. Support it with both hands to avoid dropping it.
1.

Open the back door using a 5/32-inch hex wrench.

2. Turn off ac power (CBl on the power controller) (Figure 3-48).
DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

REMOTE/
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

LINE
POWER
CIRCUIT
BREAKERS

CB1
CB2-4
(SWITCHED)
~::::-+--,W~~

FUSE

CBS
(UN SWITCHED)

CXO-013B

Figure 3-48

HSC50 Power Controller Circuit Breaker

3. Unplug the power controller from the power source.
4. Remove the front door.

3-73

3-74

Removal and Replacement Procedures

5. Remove the power controller (Section 3.6.10) to access the back of the power supply.
6. Unplug the main power supply line cord at the power controller.
NOTE

While performing 6 through 14, refer to Figure 3-49, which shows the HSC50 main
power supply test points.
7. Remove the nut from the -V1 stud (ground) on the back of the power supply (Figure 3-49).
8. Remove the nut from the +V1 stud (+5 volts) on the back of the power supply (Figure 3-49).
9. Remove the nut from the -V2 (ground) stud on the back of the power supply (Figure 3-49).
10. Remove the nut from the +V2 (-5.2 volts) stud on the back of the power supply (Figure 3-49).
11. Unplug J31 (+12 VDC output from the supply to backplane, power fail, and -5 volts sense line)
(Figure 3-49).
12. Unplug P32 (+12 VDC sense line and +5 VDC sense line) (Figure 3-49). Ensure the P32 cable
is free to be removed with the power supply.
13. Unplug J33 (to dc power switch) (Figure 3-49).
14. Unplug J34 (remote on/off jumper to auxiliary power supply) (Figure 3-49).
15. Unplug J35 (+12 VDC power to the airflow sensor) (Figure 3-49).

Removal and Replacement Procedures

3-75

BACKPLANE

MAIN POWER SUPPLY - REAR VIEW
POWER TO
AIRFLOW
SENSOR

MAIN POWER
SUPPLY
CONNECTORS

AUXILIARY
POWER SUPPLY
CONNECTORS
LINE CORD
CONNECTIONS
BLACK WIRES
FROM BACKPLANE (4)

Figure 3-49

HSC50 Main Power Supply Cables and Voltage Test Points

16. Turn the four captive screws·on the front of the power supply counterclockwise (Figure 3-50).

3-76

Removal and Replacement Procedures

MAIN POWER
SUPPLY CABLES

CAPTIVE
SCREWS

CXO-02SB

Figure 3-50

Removing and Replacing the HSC50 Main Power Supply

17. Pull the power supply out about an inch. Check the back of the cabinet to ensure the cables are
clear and will not snag when the supply is completely removed.
18. Carefully pull the power supply all the way out of the cabinet.
19. Remove the power cord from the failing unit and install it on the new power supply.
NOTE

Spare power supplies are not shipped with a power cord.
20. Reverse the removal procedure to replace the HSC50 main power supply.

3.6.13 Removing and Replacing the HSC Auxiliary Power Supply
An HSC requires an auxiliary power supply if the total module count in the card cage is more than
eight. The auxiliary power supply is mounted directly beneath the main power supply.
Use the following procedure to remove and replace the HSC auxiliary power supply:
WARNING

This power supply is heavy. When removing the power supply, support it with both
hands to avoid dropping it.
1.

Open the back door using a 5/32-inch hex wrench.

2. Turn off ac power (CB1) on the power controller (Figure 3-51).

Removal and Replacement Procedures

(t)

o

(t)

~

:rn rn rn m:
JI3JI2J11 J10

000

o

CIRCUIT
BREAKER

POWER
CONNECTOR

CXO-1117A

Figure 3-51

881 Power Controller Circuit Breaker

3. Unplug the power controller from the power source.
4. Remove the front door.
5. Remove the power controller to access the back of the power supply (Section 3.6.9).
6. Unplug the auxiliary power supply line cord at the power controller.
NOTE

While performing 7 through 10, refer to Figure 3-52.
7. Remove the nut from the +V1 stud (+5 volt) on the back of the power supply.
8. Remove the nut from the -VI stud (ground) on the back of the power supply.
9. Disconnect J50 (sense line to voltage comparator).
10. Disconnect J51 (dc on/off jumper).

3-77

3-78

Removal and Replacement Procedures

WIRE LIST
SIGNAL

COLOR

POSITION

BLACK

TBI-2

GROUND (5 V SENSE)

RED

TBI-1

5 V SENSE

BROWN

TBI-4

POWER FAIL

BLUE

TBI-7

ACC

BROWN

TBI-6

AC

GRN/YEL

TBI-5

CHASSIS GROUND

BLUE

TBI-3

ON/OFF

BLACK

TBI-2

GROUND (5 V SENSE)

AUXILIARY POWER SUPPLY - REAR VIEW

POWER SUPPLY
TERMINAL STRI~

J51
TO BACKPLANE
J50
TO MAIN
POWER SUPPL Y _ _........1

LINE CORD
TO POWER
CONTROLLER
CXO-943B

Figure 3-52

HSC Auxiliary Power Supply Cable and Test Points

11. Figure 3-52 shows the HSC auxiliary power supply test points.
12. Turn the four captive screws on the power supply counterclockwise (Figure 3-53).

Removal and Replacement Procedures

3-79

AUXILIARY POWER
SUPPLY CABLES

CAPTIVE
SCREWS

AUXILIARY POWER
SUPPLY GUIDANCE
TRACK

Figure 3-S3

AUXILIARY POWER
SUPPLY

CXO-1158A

Removing and Replacing the HSC Auxiliary Power Supply

13. Pull the power supply out about an inch. Check the back of the cabinet to ensure the cables
and flexbus connectors are clear.
14. Carefully slide the power supply out through the front of the HSC.
15. Remove the power cord from the failing unit and install it to the new power supply.
NOTE

Spare supplies are not shipped with a power cord.
16. Reverse the removal procedure to replace the HSC auxiliary power supply.

3.6.14 Removing and Replacing the HSC50 Auxiliary Power Supply
An HSC50 requires an auxiliary power supply if the total module count in the card cage is more
than eight. The auxiliary power supply is mounted directly beneath the main power supply.

Use the following procedure to remove and replace the HSC50 auxiliary power supply:
WARNING

This power supply is heavy. When removing the power supply, support it with both
hands to avoid dropping it.

3-80

Removal and Replacement Procedures

1. Open the back door using a 5/32-inch hex wrench.
2. Turn off the ac circuit breaker (CB1) on the HSC50 power controller (Figure 3-54).
DEC POWER
CONTROL BUS
CONNECTORS

DELAYED
OUTPUT
CONNECTOR

LINE
POWER
CIRCUIT
BREAKERS

REMOTE/
OFF/LOCAL
ON SWITCH

LINE PHASE
INDICATOR

CB1
CB2-4
(SWITCHED)
FUSE

CBS
(UNSWITCHED)

CXO-013B

Figure 3-54

HSC50 Power Controller Circuit Breaker

3. Unplug the power controller from the power source.
4. Remove the front door.
5. Remove the power controller to access the back of the power supply (Section 3.6.10).
6. Unplug the auxiliary power supply line cord at the power controller.
NOTE

While performing 7 through 10, refer to Figure 3-55.

Removal and Replacement Procedures

7.

3-81

Remove the nut from the +VI stud (+5 volt) on the back of the power supply (Figure 3-55).

8. Remove the nut from the -VI stud (ground) on the back of the power supply (Figure 3-55).
9. Disconnect J50 (sense line to voltage comparator). (Figure 3-55).
10. Disconnect J51 (dc on/off jumper) (Figure 3-55). Refer to Figure 3-55 for the HSC50 auxiliary
power supply test points.
WIRE LIST
COLOR

POSITION

SIGNAL

BLACK

TBI-2

GROUND (5 V SENSE)

RED

TBI-1

5 V SENSE

BROWN

TBI-4

POWER FAIL

BLUE

TBI-7

ACC

BROWN

TBI-6

AC

GRN/YEL

TBI-5

CHASSIS GROUND

BLUE

TBI-3

ON/OFF

BLACK

TBI-2

GROUND (5 V SENSE)

BACKPLANE

OUTSIDE
BACKPLANE BUS

TO MAIN
POWER SUPPLY

INSIDE
BACKPLANE BUS
POWER FAIL
POWER SUPPLY
TERMINAL STRIP

J51
TO BACKPLANE
J50
TO MAIN
POWER SUPPLY

---&ao-/

+5V DC

GROUND

LINE CORD
TO POWER
CONTROLLER
CXO-027C

Figure 3-55

HSC50 Auxiliary Power Supply Cable and Voltage Test Points

3-82

Removal and Replacement Procedures

11. Turn the four captive screws on the power supply counterclockwise (Figure 3-56).

MAIN
POWER
SUPPLY

CAPTIVE
SCREWS

AUXILIARY POWER
SUPPLY GUIDANCE
TRACK

Figure 3-56

AUXILIARY
POWER
SUPPLY

Removing and Replacing the HSC50 Auxiliary Power Supply

12. Pull the power supply out about an inch. Check the back of the cabinet to ensure the cables
and connectors are clear.
13. Carefully slide the power supply out through the front of the HSC50.
14. Remove the power cord from the failing unit and install it to the new power supply.
NOTE

Spare supplies are not shipped with a power cord.
15. Reverse the removal procedure to replace the auxiliary power supply.

Initialization Procedures

4-1

4
Initialization Procedures
4.1 Introduction
This chapter contains procedures for connecting the console terminal on the HSC and the auxiliary
terminal on the HSC50, and initialization procedures for both HSC models.
A malfunction during initialization may be reported by a fault code displayed on the operator
control panel (OCP). These fault codes are explained in Chapter 8.

4.2 Console/Auxiliary Terminal
The console or auxiliary terminal designated for the HSC can be a VT2xx, VT3xx, VTlxx, or an
LA12 DECwriter. An LA75 or LA50 printer for hardcopy output is connected to the VT2xx, VT3xx,
and can be connected to the VT1xx if the VTlxx has the printer port option installed. Detailed
operating information is provided in the appropriate owner manuals accompanying the VTxxx and
LAxx models.
NOTE

The VT3xx series terminal can be connected to an RS-232 compatible port only.
Connection to another type of port will result in initialization failure and FCC violations.

4.2.1 Console Terminal Connection
Figure 4-1 shows the placement of the EIA terminal connectors on the HSC rear bulkhead. The
console terminal connects to the J60 connector as shown.

4-1

4-2

Initialization Procedures

CONNECT
CONSOLE
TERMINAL
TO J60
EIA TERMINAL
CONNECTORS

~

______A_______

CABLE
BULKHEAD

~\

o
J60 CONSOLE J61

o

c=> c=> c=>
N

M

L

00
O~O~O 00
D
1~O~O~D
2~ 0 ~ 0
~ D

3~

0

F@

~

o

o

J62

~ D
E @
o

0

00
00
00
00
00
00
00
Qo

@

K

D
D
0
0
C

00
Qo
00
00
00
00
00
00

J

D
0
0
0

@

00
00
00
00
00
00
00
Qo

H

00 0
00 1
0

B
DATA
CHANNEL
CONNECTIONS

CABLE CONNECTORS
WITHIN A DATA CHANNEL

Figure 4-1

CXO-891B

Console Terminal Connection

Preferably, power is turned off before the console terminal is installed. However, power can be left
on while connecting the terminaL Use the following procedure for installing the console terminal
with power on or off:
1. Put the SecurelEnable switch in the secure position.

2. Change terminal state (plug in, remove power, connect EIA line, and so forth).
3. Put the SecurelEnable switch in the enable position if it is necessary to do so at this point.

NOTE
If this procedure is not followed., the HSC may enter micro-on-line debugging tool (ODT)

mode. This mode is indicated by an
should exit this mode.

@

symbol on the screen. Typing a P (PROCEED)

4.2.2 HSC50 Auxiliary and Maintenance Terminal Connections
Figure 4-2 shows the placement of the two ASCII ports on the HSC50 and HSC50 (modified).
The a:uxiliary terminal can be connected. to either the rear or the front ASCII port. Two terminals
cannot be connected at the same time.

Initialization Procedures

4-3

~ Ill.: I!iI
IWI
t;J
P42 P41 P40

o

MAINTENANCE
TERMINAL
CONNECTOR

m

P45 P44
o
o / .

olli::i::i:l

YV \

CABLING
BULKHEAD

MAINTENANCE
ACCESS PANEL -

o

o

o
TERMINAL

PRINTER

/(QOR,~

AUXILIARY
TERMINAL
CONNECTOR

\
J

I

FROM
} . . - ____ /
EXTERNAL
ACPOWER
/
SOURCE
~-------

Figure 4-2

/

I
l
I

/

Auxiliary or Maintenance Terminal Connection

Preferably, power is turned off before the console terminal is installed. However, power can be left
on while connecting the terminal. Use the following procedure for installing the console terminal
with power on or off:
1. Put the SecurelEnable switch in the secure position.

2. Change terminal state (plug in, remove power, connect EIA line, and so forth).
3. Type three space characters on the terminal keyboard.

4-4

Initialization Procedures

4. If it is necessary to put the SecurelEnable switch in the enable position, do so at this point.
NOTE
If this procedure is not followed, the HSC50 may enter micro-on-line debugging tool

(ODT) mode. This mode is indicated by an
should exit this mode.

@

symbol on the screen. Typing a P (proceed)

4.2.3 LA12 Parameters
Detailed information on LA12 tenninal installation and operation is found in the DECwriter
Correspondent Technical Manual (EK-CPL12-TM).
When an LA12 is used as an auxiliary tenninal, the following parameters must be established:
1.

Communications:

•

Auto - Ansbk

•

Buffer = 1024

= no

= EIA
• Disk - HDX = none
• Echo - Local = no
• Fault = none
•

Comm Port

• G - HDX Start Mode = Rev

• H - Hi Speed (bps) = 9600
• L - Lo Speed (bps) = 300
• M - Line Prot = FDX - Data Leads
• o - Rev Error Ovride = no
• Parity = 71M
• Q - SRTS Polarity = 10
• Restraint =XonIXoff
• S - Speed Select =hi
• Turn Char = none
•

U - Power Up = line

•

V - Frequency = bell 103

2. Keyboard:

•

Auto - Linefeed

•

Break

•
•

C - Keyclick
Keypad

•

Repeat = yes

= no

= no
= no

= normal
• Language = USA

3. Printer:
•

A - GO Char Set

=USA

Initialization Procedures

•
•
•
•
•
•
•
•
•
•

4-5

B - G1 Char Set = USA
C - G2 Char Set = USA
D - G3 Char Set = USA
End-of-line = wrap
Form Length = 264
G - Print Cntrl Chars
Horiz Pitch (CPI) = 10
Newline Char = none
Print Force = hi
Vertical Pitch (LPI) = 6

4.3 HSC Initialization
This section describes the initialization procedures for the HSC using the system diskette. This
diskette also contains the software necessary to execute the device integrity tests and the utilities.
To boot and run the off-line diagnostics from a separate off-line diskette, refer to Chapter 7.
System initialization is started by powering on the unit or (if the unit is already on) by pressing
and releasing the Init switch with the SecurelEnable switch in the enable position. This initiates
the P.io ROM bootstrap tests and then loads the Init P.io test.
NOTE
In order to run the HSC device integrity tests, the system diskette must reside in the

RX33 drive. Customarily, this diskette resides in RX33 drive O. However, drive 1 and
drive 0 are identical, and disk placement is arbitrary.
Logic in the following areas is tested with the Init P.ioj diagnostic:
•

Control processor-The rest of the instruction set not tested by the ROM bootstrap, interrupts,
memory management, and the control memory lock-cycle circuitry are included. Detected
failures result in an error code display on the OCP (Figure 4-3).

•

Memory-Program memory is tested from the 110 control processor. However, the control and
data memories are tested by the highest-numbered available requestor controlled by the 110
control processor. Again, detected failures result in an OCP error code display.

•

Host interface and data channels-Module status is collected and placed in a table for the HSC
operating software initialization process. As each module is enabled, it automatically executes
internal microdiagnostics. These internal diagnostics test the following:
•

ROM (sequencer, checksum, parity, and so forth)

•

Special logic unique to that particular module

Upon completion of diagnostics for each module, a status code is passed to the lIO control processor.
Status codes for the various modules are discussed in Chapter 5.
If the module diagnostics complete successfully, the status code represents the module type and
the green LED is turned on. If the diagnostics fail, the status code indicates the failing microtest.
In addition, detected failures cause a red LED to light on that module. Kci, Ksdi, Ksti, and Ksi
failures are also displayed on the console terminal after the boot is completed.

~

Initialization Procedures

DESCRIPTION

HEX OCT BINARY

K.PLI ERROR **"

01

01

00001

OFF

OFF

OFF

K.SDI/K.SIINCORRECT
VERSION OF MICROCODE **"

02

02

00010

OFF

OFF

OFF

K.STIIK.SI INCORRECT
VERSION OF MICROCODE **"

03

03

00011

OFF

OFF

P.IOJ CACHE FAILURE *

08

10

01000

OFF

K.CI FAILURE"

09

11

01001

OFF

DATA CHANNEL MODULE ERROR *

OA

12

01010

P.IOJ/C MODULE FAILURE

11

21

10001

M.STD2 MODULE FAILURE *****

12

22

10010

BOOT DEVICE FAILURE **

13

23

10011

PORT LINK NODE ADDRESS
SWITCHES OUT OF RANGE

15

25

10101

MISSING FILES REQUIRED ****

16

26

10110

NO WORKING K.CI, K.SDI,
K.STI, OR K.SI IN SUBSYSTEM

18

30

11000

INITIALIZATION FAILURE

19

31

11001

SOFTWARE INCONSISTENCY

1A

32

11010

ILLEGAL CONFIGURATION

1B

33

11011

OFF

OFF

THESE ARE THE SO-CALLED SOFT OR NONFATAL ERRORS.
POSSIBLE MEMORY MODULE/CONTROLLER ON HSC70.
INCORRECT VERSION OF MICROCODE.
**** THIS FAULT CODE WILL ALSO BE DISPLAYED IF THE L0105 MODULE IS NOT AT THE MINIMUM
REV LEVEL.
**'**"SWAP MEMORY MODULE FIRST. IF PROBLEM PERSISTS, TRY THE P.IO MODULE.
CXO-90SD

Figure 4-3

Operator Control Panel Fault Code Displays

NOTE

Lighting of the red LED on the LOIOO or LOllS LINK module does not indicate a failure of
the module.
For a detailed description of the boot process, refer to the HSC Boot Flowchart in Chapter 8.

Initialization Procedures

4-7

4.3.1 Init P.io Test (INIPIO)
The INIPIO test completes the P.ioj module and the HSC memory testing previously started by the
ROM bootstrap tests. All P.ioj logic not tested by the bootstrap is tested by INIPIO. In addition, the
HSC Program, Control, and Data memories are tested.
This test runs in a standalone environment (no other HSC processes are running). If a failure is
detected, the failing module is flagged by illumination of the red LED on the module. If the test
runs without finding any errors, theHSC operational software is loaded and started. The Init P.io
test is not a repair-level diagnostic. If a repair-level test is needed, run the off-line P.io test that
provides standard HSC error messages.

4.3.2 INIPIO Test System Requirements
In order to run this test, the following hardware is required:
•

P.ioj (processor) module with HSC boot ROM

•

K.ci

•

At least one M.std2 (memory) module

•

RX33 controller with at least one working drive

In. addition, an HSC system diskette (RX33 media) is required.

4.3.3 INIPIO Test Prerequisites
The INIPIO test is loaded by the HSC ROM bootstrap program. The bootstrap tests the basic J-l1
instruction set, the lower 2048 bytes of Program memory, an 8 Kword partition in Program memory,
and the RX33 subsystem used by the bootstrap. When the INIPIO test begins to execute, most J-l1
logic has been tested and is considered working. Likewise, the Program memory occupied by the
test and the RX.33 subsystem used to load the test are also considered tested and working. The
RX33 diskette is checked to ensure it contains a bootable image.

4.3.4 INIPIO Test Operation
Follow these steps to start the INIPIO test:
1.

Insert the HSC system diskette in the RX.33 unit 0 drive (left-hand drive).

2.

Power on the HSC or press and release the Init button on the HSC OCP with the SecureJEnable
switch enabled. The Init lamp lights and the following occurs:
•

The RX.33 drive-in-use LED lights within 10 seconds, indicating the bootstrap is loading the
INIPIO test to the Program memory.

•

The I/O State light is on after diskette motion stops and the INIPIO test begins testing.

•

The INIPIO test displays the following message on the HSC console when it begins:
INIPIO-I BOOTING

•

HSC operational software is being loaded when the State light flashes rapidly.

•

HSC operational software indicates it has loaded properly when the State light blinks
slowly.

•

HSC displays its name and version indicating it is ready to perform host 110.

4-8 Initialization Procedures

Once initiated, the INIPIO test is terminated only by halting and rebooting the HSC. If the test
fails to load using the preceding startup procedure, perfonn the next four steps:
1. Check the OCP fault light. If the fault light is on, press the fault light once and check the fault
code (Figure 4-3).
2. Boot the diskette from the RX33 unit 1 drive (right-hand drive).
3. Boot using another diskette. If that diskette boots, the original diskette is probably damaged or
worn..

4. Boot using the HSC Off-line Diagnostic diskette. This diskette contains the off-line P.io test,
which provides extensive error reporting features. A console tenninal must be connected to run
the off-line tests.
The progress of the INIPIO test is displayed in the State LED. Before the test starts, the State
LED is off. When the test starts, the State LED is turned on, and the INIPIO-I BOOTING message
is printed on the HSC console. When the test completes with no fatal errors, the State LED begins
to blink at a steady rate. If the test detects an error, the Fault lamp on the HSC OCP is lit.

4.4 HSC50 Initialization
In order to run the HSC50 device integrity tests and utilities, the HSC50 operating software
must be initialized with both the .system and utilities cassettes loaded in the TU58 drives. Before
inserting the system tape into the TU58 drive, check the black RECORD tab. This tab must be in
the record position (as indicated by an arrow on the tab) to ensure proper system operation. The
utilities tape need not be write-enabled.
NOTE

In order to run the HSC50 device integrity tests, the system tape must reside in the TU5S
drive. Customarily, this tape resides in TU58 drive O. Drive 1 and drive 0 are identical,
and tape placement is arbitrary.

However, the utilities tape does not contain a bootable image, and if drive 0 contains the
utilities tape, the system will try to boot from drive 1.

The HSC50 can be initiated by either powering on the unit if it is powered down or, if power is
already applied, by pressing and releasing the lnit switch with the SecurelEnable switch in the
enable position. This causes the P.ioc bootstrap ROM tests to run and then load the Init P.ioc test.

4.4.1 HSC50 Off-line Diagnostics Tape
The off-line diagnostics tape can be booted in either TU58 drive and need not be write-enabled. The
off-line tape can be booted by either powering on the unit or pressing and releasing the lnit switch
with the SecurelEnable switch in the enable position. This causes the P.ioc bootstrap ROM tests to
run and then load the off-line P.ioc test.

4.4.2 Inlt P.ioc Diagnostic
The Init P.ioc test is loaded by the P.ioc ROM bootstrap test each time the HSC50 system tape is
booted. This diagnostic completes the testing of the P.ioc module and the HSC50 memories. At the
successful completion of these tests, the HSC50 operating software is loaded and started.
Logic in the following areas is tested with the lnit P.ioc diagnostic:
•

Control processor-The rest of the instruction set not tested by the ROM bootstrap, interrupts,
memory management, and the control memory lock-cycle circuitry are included. Detected
failures result in an error code display on the OCP (Figure 4-3).

Initialization Procedures

4-9

•

Memory-Program memory is tested from the 110 Control Processor. However, the control and
data memories are tested by the highest-numbered available requestor controlled by the I/O
control Processor. Again, detected failures result in an OCP error code display.

•

Host interface and data channels-Module status is collected and placed in a table for the
HSC50 operating software initialization process. As each module is enabled, it automatically
executes internal microdiagnostics. These internal diagnostics test the following:
•

ROM (sequencer, checksum, parity, and so forth)

•

Special logic unique to that particular module

Upon completion of diagnostics for each module, a status code is passed to the 110 control processor.
Status codes for the various modules are discussed in Chapter 5.
If the module diagnostics complete successfully, the status code represents the module type and
the green LED is turned on. If the diagnostics fail, the status code indicates the failing microtest.
In addition, detected failures cause a red LED to light on that module. K.ci, Ksdi, Ksti, and K.si
failures are also displayed on the auxiliary terminal after the boot is completed.
NOTE

Lighting of the red LED ·on the·LOIOO or LOllS LINK module does not indicate a failure of
the module.
For a detailed description of the boot process, refer to the HSC50 Boot Flowchart in Chapter 8.

4.5 Fault Code Interpretation
All failures occuni.ng during the lnit P.io test are reported on the OCP LEDs. When the Fault lamp
is lit, pressing the Fault switch results in the display of a failure code in the OCP LEDs. This code
indicates which HSC module is the most probable cause of the detected failure. The failure code
blinks on and off at 1 second intervals until the HSC is rebooted if the fault code represents a fatal
fault. A soft fault code is cleared in the OCP by pressing the Fault switch a second time. To restart
the boot procedure, press the lnit switch. To identify the probable failing module, see Figure 4-3.
For detailed descriptions of OCP fault codes, see Chapter 8.

4-1 0

Initialization Procedures

Device Integrity Tests

5-1

5
Device Integrity Tests
5.1

Introduction

Device integrity tests executing in the HSC do not interfere with normal operation other than with
the device being tested. The device integrity tests can be found on the HSC system media disk or
HSC50 utilities media tape.
The tests described in this chapter are:
•

ILRX33-RX33 integrity tests

•

ILTU58-TU58 integrity tests

•

ILMEMY-Memory integrity tests

•

ILDISK-Disk drive integrity tests

•

ILTAPE-Tape device integrity tests

•

ILTCOM-Tape compatibility tests

•

ILEXER-Multidrive exerciser

5.1.1 Device Integrity Tests Common Areas
Device integrity tests prompts and error messages so that they conform to standard formats. All
prompts issued by these integrity tests use a generic syntax.
•

Prompts requiring user action or input are followed by a question mark.

•

Prompts offering a choice of responses show those choices in parentheses.

•

A capital D in parentheses indicates the response should be in decimal.

•

Square brackets enclose the prompt default or, if empty, indicate no default exists for that
prompt.

5-1

5-2

Device Integrity Tests

5.1.2 Generic Error Message Format
All device integrity tests follow a generic elTor message format, as follows:
XXXXXX>x>tt:tt T#aaa E*bbb


U-ccc

FRU1-dddddd FRU2-dddddd
MA-eeeeee
EXP-yyyyyy
ACT-zzzzzz
Where:
XXXXXX> is the appropriate device integrity test prompt.
x> is the letter indicating the type of integrity test
that was initiated:
0> is the demand integrity test.
A> is the automatic integrity test.
P> is the periodic integrity test
tt:tt is the current'time.
aaa is the decimal number denoting test that failed.
bbb is the decimal number denoting error detected.
ccc is the unit number of drive being tested.
FRUl is the most likely field replaceable unit (FRU).
FRU2 is the next most likely FRU.
dddddd is the name of field replaceable unit.
MA is the media address.
eeeeee is the octal number denoting offset within block.
yyyyyy is the octal number denoting data expected.
zzzzzz is the octal number denoting data actually found.

The first line of the elTor message contains general information about the elTor. The second line
describes the nature of the error. Lines 1 and 2 are mandatory and appear in all error messages.
Line 3 and any succeeding lines display additional information and are optional.
NOTE
If a P.ioj/c or M.std/2 module fails during the periodic ILMEMY tests, the FAClLITY

section of the crash code displays PRMEMY, which indicates the failure occurred during
the periodic tests.
If a Ksdi, Ksti, or Ksi modUle fails during the periodic K tests, the FACILITY section of

the crash code displays PRKSDI, PRKSTI, or PRKSI, which indicates the failure occurred
during the periodic tests.

5.2 ILRX33 - RX33 Device Integrity Tests
The ILRX33 exerciser runs a test of either of the RX33 drives attached to the HSC. ILRX33 runs
concurrently with other HSC processes and uses the services of the HSC control program and the
Diagnostic Execution Monitor (DEMON).
ILRX33 performs several writes and reads to verify the RX33 internal data paths and read/write
electronics.
A scratch diskette is not required. ILRX33 does not destroy any data on the system software.
The exerciser tests only the RX33 and the data path between the P.ioj and the RX33. All other
system hardware is assumed to be working properly.
ILRX33 verifies only a particular RX33 drive and controller combination is working or failing.
Therefore, the test should not be used as a subsystem troubleshooting aid. This test does not
support flags. If the test indicates a drive or controller is not operating cOlTectly, replace the drive
and/or controller. The controller is located on the memory module.

Device Integrity Tests

5-3

5.2.1 System Requirements
Hardware and software requirements include:
•

P.ioj (processor) module with boot ROMs

•

M.std2 memory/disk controller module

•

RX33 controller with at least one working drive

•

HSC system media

•

Console terminal

5.2.2 Operating Instructions
Press CTRLIY to get the HSC> prompt. Next, type either RUN ILRX33 or RUN DXn:ILRX33 to
initiate the tests.
NOTE

The term DXn: refers to the RX33 disk drives (DXO: or DXl:).
If ILRX33 cannot load from the specified diskette, try loading the test from the other diskette. For
example, if RUN ILRX33 fails, try RUN DXn:ILRX33.

5.2.3 Test Termination
ILRX33 can be terminated by pressing CTRLIY. The test automatically terminates after reporting
an error with one exception: if the error displayed is Retries Required, the test continues.

5.2.4 Parameter Entry
The device name of the RX33 drive to be tested is the only parameter sought by this test. When the
test is invoked, the following prompt is displayed:
Device Name of RX33 to test (DXO:, DX1:, LB:)

[] ?

NOTE

The string LB: indicates the RX33 drive last used to boot the HSe control program.
One of the indicated strings must be entered. If one of these strings is not entered, the test prints
lllegal Device Name and the prompt is repeated.

5.2.5 Progress Reports
At the end of the test, the following message is displayed:
ILRX33>D>tt:tt Execution Complete
Where:
tt:tt is the current time.

5-4

Device Integrity Tests

5.2.6 Test Summary
The ILRX33 test summary is contained in the following paragraph.
Test 001, ReadIWrite Test-Verifies that data can be written to the diskette and read back
correctly. All reads and writes access physical block 1 of the RX33 (the RT-11 volume ID block).
This block is not used by the HSC operating software.
Initially, the contents of block 1 are read and saved. Then, three different data pattern.s are written
to block 1, read back, and verified. This checks the read/write electronics in the drive and the
internal data path between the RX33 controller and the drive. Following the read/write test, the
original contents of block 1 are written back to the diskette.
If the data read back from the diskette does not match the data written, a data compare error
is generated. The error report lists the word (MA) in error within the block together with the
EXPected (EXP) and ACTual (ACT) contents of the word.

5.2.7 Error Message Example
All error messages produced by ILRX33 conform to the HSC device integrity test error message
format (Section 5.1.2). Following is a typical ILRX33 error message:
ILRX33>D>00:00 TOOl E 003 U- 50182
ILRX33>D> No Diskette Mounted
ILRX33>D> FRU1-Drive

Other optional lines are found on different error messages.

5.2.8 Error Messages
The following paragraphs list specific information about each of the errors produced by the ILRX33.
Hints about the possible cause of the error are provided where feasible.
•

Error 000, Retries Required-Indicates a Read or Write operation failed when first
attempted, but succeeded on one of the retries performed automatically by the RX33 driver
software. This error normally indicates the diskette media is degrading and the diskette should
be replaced.

•

Error 001, Operation Aborted-Reported if ILRX33 is aborted by pressing CTRUY.

•

Error 002, Write-Protected-Indicates the RX33 drive being tested contains a write-protected
diskette. Write enable the diskette and try again. If the diskette is not write-protected, the
RX33 drive or controller is faulty.

•

Error 003, No diskette Mounted-Indicates the RX33 drive being tested does not contain a
diskette. Insert a diskette before repeating the test. If this error is displayed when the drive
does contain a diskette, the drive or controller is at fault.

•

Error 004, Hard I/O Error-Indicates the program encountered a hard error while attempting
to read or write the diskette.

•

Error 005, Block Number Out of Range-Indicates the RX33 driver detected a request
to read a block number outside the range of legal block numbers (0 through 2399 decimal).
Because the ILRX33 reads and writes disk block 001, it may indicate a software problem.

•

Error 006, Unknown Status STATUS=xxx-Indicates ILRX33 received a status code it
did not recognize. The octal value xxx represents the status byte received. RX33 reads and
writes are performed for ILRX33 by the HSC control program's RX33 driver software. At the
completion of each Read or Write operation, the driver software returns a status code to the
RX33 test, describing the result of the operation. The test decodes the status byte to produce a
description of the error.

Device Integrity Tests

5-5

An unknown status error indicates the status value received from the driver did not match
any of the status values known to the test. The status value returned (xxx) is displayed to
help determine the cause of the problem. Any occurrence of this error should be reported
through a Software Performance Report (SPR). See Appendix B for detailed information on SPR
submission.
•

Error 007 t Data Co:mpare Error-Indicates data subsequently read back.
MA -aaaaaa
EXP-bbbbbb
ACT-cccccc
where:
aaaaaa represents the address of the failing word
within the block (512 bytes) that was read.
bbbbbb represents the data written to the word.
cccccc represents the data read back from the word.

Because this test only reads and writes block 1 of the diskette, all failures occur while trying to
access physical block 1.
•

Error 008, lllegal Device Name-Indicates the user specified an illegal device name when
the program prompted for the name of the drive to be tested. Legal device names include DXO:,
DX1:, and LB:. LB: indicates the drive from which the system was last booted. Mter displaying
this error, the program again prompts for a device name. Enter one of the legal device names
to continue the test.

5.3 ILTAPE-TU58 Device Integrity Test
The ILTU58 tests either of the TU58 drives attached to the HSC50. This test runs concurrently
with other HSC processes and uses the services of the HSC control program and the Diagnostic
Execution Monitor (DEMON). The test can be initiated with only the system tape installed.
Because the HSC50 operating system tests the TU58 every time it is used, ILTU58 performs only
minimal testing. Several read and write operations are performed to test the internal data paths
and the read/write circuitry of the TU58.
A scratch tape is not required. This test does not destroy any data on the system software.
ILTU58 tests only the TU58 and the data path between the P.ioc and the TU58. All other system
hardware is assumed to be working properly.
ILTU58 verifies that only a particular TU58 drive and controller combination is working or failing.
Therefore, the test should not be used as a troubleshooting aid. This test does not support flags.
If the test indicates that a drive or controller is not operating correctly, replace the drive and/or
controller.

5.3.1 System Requirements
Hardware and software requirements include:
P.ioc module with boot ROMs
M.std memory/disk controller module
TU58 controller with at least one working drive
HSC system media

5-6

Device Integrity Tests

5.3.2 Operating Instructions
Press CTRLIY to get the HSC> prompt. Then type RUN ILTU58 or RUN DDn::ILTU58 to initiate
the tests.

5.3.3 Test Termination
ILTU58 can be terminated by pressing CTRLIY.

5.3.4 Error Messages
The following error messages are issued:
•

Retries Required-Indicates a Read or Write operation failed in the first attempt but
succeeded on one of the retries. It may also mean that the tape media is degrading and should
be replaced.

•

Operation Aborted-Reported if the test is interrupted by CTRLIY.

•

Write Protected- Indicates the drive being tested has a write protected tape. Try again with
Write enabled. If the tape is not write-protected, then the drive or controller is faulty.

.•

No Cassette Mounted-Indicates the drive does not have a cassette. Insert a cassette tape
then repeat the test. Otherwise, the drive or the controller is faulty.

•

Hard 110 Error-Indicates the program encountered a hard error while attempting to read or
write the cassette tape.

•

Bad Record-Indicates the program encountered a bad record while attempting to read or
write the cassette tape.

•

Bad Opcode-Indicates the program encountered an illegal opcode.

•

Bad Record-Indicates the program encountered a bad record while attempting to read or
write the cassette tape.

•

Seek Error-Indicates a seek error status was set after a SEEK command.

•

Bad Unit I-Indicates the diagnostic interface could not find the unit number specified. The
drive may have been off line.

•

Failed Self-Test-Indicates the HSC diagnostic interface failed.

•

End of Medium-Indicates the end of the cassette tape.

•

Unknown Status-Indicates the TU58 device integrity test received a status code it did not
recognize. This status code is displayed to help determine the cause of the problem.

•

Data Compare Error-Indicates that data subsequently read back did not match data
written. The test writes a pattern to block 1, then reads block 1 and check that the pattern
read is the same as the pattern written. If the patterns differ, this error message is displayed.
This step is performed three times, each time with a different pattern. The patterns are:
MA -aaaaaa-represents the address of the failing word.
EXP-bbbbbb-represents the data written to the word.
ACT-cccccc-represents the data read back from the word.
Because this test only reads and writes block 1 of the cassette tape, all failures occur while
trying to access physical block 1.

•

Dlegal Device Name-Indicates the user specified an illegal device name when prompted for
the name of the drive to be tested. Mter displaying this error, the program again prompts for a
device name. Enter one of the legal device names to continue the test.

Device Integrity Tests

5-7

5.4 ILMEMY - Memory Integrity Tests
The memory integrity test is designed to test HSC data buffers. This test can be initiated
automatically or on demand. It is initiated automatically to test data buffers that produce a
parity or nonexistent memory (NXM) error when in use by the HSC control program or any of the
Kmodules.
Buffers that fail the memory test are removed from service by sending them to the disabled buffer
queue. The disabled buffer accepts only 16 entries. When the buffer has accepted 16 entries, it acts
as a first-in-first-out (FIFO) buffer.
NOTE

The contents of the disabled buffer queue are lost during a reboot of the HSC. As a result,
all bad memory locations are lost.
Buffers sent twice to this test are also sent to the disabled buffer queue even if they did not fail the
test. Buffers that pass the memory test and have not been tested previously are sent to the free
buffer queue for further use by the HSC control program.
When the test is initiated on demand, any buffers in the disabled buffer queue are tested and the
results of the test are displayed on the terminal from which the test was initiated.
This test runs concurrently with other HSC processes and uses the services of the HSC control
program and the Diagnostic Execution Monitor (DEMON).

5.4.1 System Requirements
Hardware requirements include:
•

P.ioj (processor) module with HSC boot ROMs, or P.ioc (processor) module with HSC50 boot
ROMs.

•

At least one M.std2 memory module (HSC) or the M.std memory module (HSC50).

•

RX33 controller with one working drive (HSC) or TU58 controller with one working drive
(HSC50).

•

A console terminal for demand initiation oniy.

This program only tests Data Buffers located in the HSC Data memory. All other system hardware
is assumed to be working.
Software requirements include:
•

HSC control program (system diskette or tape)

•

Diagnostic Execution Monitor (DEMON)

5.4.2 Operating Instructions
Press CTRIJY to get the attention of the HSC keyboard monitor. The keyboard monitor responds
with the prompt:
HSCxx>

Type RUN dev:ILMEMY to initiate the memory integrity test. This program has no user-supplied
parameters or flags.
NOTE

ILMEMY tests only data memory buffers. Control/program memory errors typically
cause a reboot of the HSC.

5-8 Device Integrity Tests

If the memory integrity test is not contained on the specified device (dev:), an error message is
displayed.

5.4.3 Test Termination
ILMEMY can be terminated at any time by pressing CTRUY.

5.4.4 Progress Reports
Error messages are displayed as needed. At the end of the test, the following message is displayed
(by DEMON):
ILMEMY>D>tt:tt Execution Complete
Where:
tt:tt

=

current time.

5.4.5 Test Summaries
Test 001 receives a queue of buffers for testing. If the ILMEMY is initiated automatically, the
queue consists of buffers from the suspect buffer queue.
When the HSC control program detects a parity or nonexistent memory (NXM) error in a Data
Buffer, the buffer is sent to the suspect buffer queue. While in this queue, the buffer is not used for
data transfers. The HSC periodic scheduler periodically checks the suspect buffer queue to see if it
contains any buffers. If buffers are found on the queue, they are removed and the in-line memory
test is automatically initiated to test those buffers.
If the ILMEMY test is initiated on demand, it retests only buffers already known as disabled.
If the test is initiated automatically and the buffer passes the test, the program checks to see if this

is the second time the buffer was sent to the memory integrity test. If this is the case, the buffer is
probably producing intermittent errors. The buffer is retired from service and sent to the disabled
buffer queue. If this is the first time the buffer is sent to the memory integrity test, it is returned
to the free buffer queue for further use by the HSC control program. In this last case, the address
of the buffer is saved in case the buffer again fails and is sent to the memory integrity test a second
time.
When all buffers on the test queue are tested, the memory integrity test terminates.

5.4.6 Error Message Example
All error messages produced by the memory integrity test conform to the HSC integrity test error
message format (Section 5.1.2). Following is a typical ILMEMY error message:
ILMEMY>A>09:33 TOOl E 000
ILMEMY>A>Tested Twice with no Error (Buffer Retired)
ILMEMY>A>FRU1-M.std2 FRU2ILMEMY>A>Buffer Starting Address (physical)
15743600
ILMEMY>A>Buffer Ending Address
(physical) = 15744776

When all buffers on the test queue are tested, the memory integrity test terminates.

Device Integrity Tests

5-9

5.4.7 Error Messages
The following list shows specific information about each of the errors displayed by the memory
integrity test.
•

Error 000, Tested Twice with No Error-Indicates the buffer under test passed the memory
test. However, this is the second time the buffer was sent to the memory test and passed it.
Because the buffer has a history of two failures while in use by the control program, yet does
not fail the memory test, intermittent failures on the buffer are assumed. The buffer is retired
from service and sent to the disabled buffer queue.

•

Error 001, Returned Buffer to Free Buffer Queue-Indicates a buffer failed during use
by the control program but that the memory integrity test detected no error. Because this is
the first time the buffer was sent to the memory integrity test, it is returned to the free buffer
queue for further use by the HSC control program. The address of the buffer is stored by the
memory integrity test in case the buffer again fails when in use by the control program.

•

Error 002, Memory Parity Error-Indicates a parity error occurred while testing a buffer.
The buffer is retired from service and sent to the disabled buffer queue.

•

Error 003, Memory Data Error-Indicates the wrong data was read while testing a buffer.
The buffer is retired from service and sent to the disabled buffer queue.

•

Error 004, NXM Trap (Buffer Retired) - Indicates an unknown address or memory location
is being referenced.

•

Error 005, Can't Allocate Timer, Test Aborted-Indicates the program failed to allocate a
timer for SLEEP.

5.5 ILDISK - DISK Drive Integrity Tests
ILDISK isolates disk drive-related problems to one of the following three field replaceable units
(FRUs):
1. Disk drive

2. SDI cable
3. HSC disk data channel module
ILDISK runs in parallel with disk 1/0 from a host CPU. However, the drive being diagnosed cannot
be on line to any host. ILDISK can be initiated upon demand through the console terminal or
automatically by the HSC control program when an unrecoverable disk drive failure occurs.
ILDISK is automatically invoked by default whenever a drive is declared inoperative, with one
exception: if a drive is declared inoperative while in use by an integrity test or utility.
Automatic initiation of ILDISK can be inhibited by issuing the SETSHO command SET
AUTOMATIC DIAGNOSTICS DISABLE. If the SET AUTOMATIC DIAGNOSTICS command is
issued and DISABLE is specified, ILMEMY (a test for suspect buffers) is also disabled. For this
reason, leaving ILDISK automatically enabled is preferable.
The tests performed vary, depending on whether the drive is known to the HSC disk server.
1. Drive unknown (to the HSC disk server}-It is either unable to communicate with the HSC
or was declared inoperative when it failed while commwri,cating with the HSC. In this case,
because the drive cannot be identified by unit number, the user must supply the requestor
number and port number of the drive. Then the SDI verification tests can execute. The SDI
verification tests check the-path between the KsdilK.si and the disk drive and command the
drive to run its integrity tests. If the SDI verification tests fail, the most probable FRU is
identified in the error report. If the SDI verification tests pass, presume the drive is the FRU.

5-10

Device Integrity Tests

2. Drive known (to the HSC disk server, that is, identifiable by unit number}-ReadlWrite/Fonnat
tests are perfonned in addition to the SDI verification tests. If an error is detected, the most
probable FRU is identified in the error report. If no errors are detected, presume the FRU is
the drive.

To find the drives known to the Disk and Tape Servers, type the SETSHO command SHOW DISKS
or SHOW TAPES.

5.5.1 System Requirements
The software requirements for this test reside on the system media and include:
•

HSC executive (CRONIC)

•

ILDISKDIA program

•

Diagnostic process (DEMON)

•

KsdilK.si microcode (installed with the KsdilK.si module)

Hardware requirements include:
•

Disk drive

•

Disk data channel, connected -by an SDI cable

The test assumes the I/O Control Processor module and the memory module are working.
Refer to the disk drive documentation to interpret errors that occur in the drive's integrity tests.

5.5.2 Operating Instructions
The following steps are used to initiate ILDISK
NOTE

10 prevent access from another HSC, deselect the alternate port switch on the drive to be
tested. The alternate port switch is the drive port switch allowing alternate HSC access
to the drive.
NOTE

The HSC system RX33 must be present at all times.
1. Press CTRLIY.
2. The following prompt appears:
HSCxx>

3. Type RUN dev:ILDISK and enter a carriage return.
4. Wait until ILDISK is read from the system software load media into the HSC Program memory.
5. Enter parameters after ILDISK is started. Refer to Section 5.5.5.

5.5.3 Availability
If the software media containing ILDISK is not loaded when the RUN ILDISK command is
entered, an error message is displayed. Insert the software media containing ILDISK and repeat
Section 5.5.2.

Device Integrity Tests

5-11

5.5.4 Test Termination
ILDISK is terminated by pressing CTRLIY or CTRLlC. Test termination may not take effect
immediately because certain parts of the program cannot be interrupted. An example would be
during SDI commands. If an SDI DRIVE DIAGNOSE command is in progress, interfering with the
disk drive at this time can cause the program to wait 2 minutes before aborting.

5.5.5 Parameter Entry
Upon demand initiation, ILDISK first prompts:
DRIVE UNIT NUMBER (U)

[] ?

Enter the unit number of the disk drive for test. Unit numbers are in the form Dnnnn, where nnnn
is a decimal number between 0 and 4095 corresponding to the number printed on the drive unit
plug. Terminate the unit number response with a carriage return.
ILDISK attempts to acquire the specified unit through the HSC diagnostic interface. If the unit is
acquired successfully, ILDISK next prompts for the drive integrity test to be executed.
If the acquire fails, one of the following conditions is encountered:
1.

The specified drive is unavailable. This indicates the drive is connected to the HSC, but is
currently on line to a host CPU or an HSC utility. On-line drives cannot be diagnosed. ILDISK
repeats the prompt for the unit number.

2. The specified drive is unknown to the HSC disk functional software. Drives are unknown for
one of the following reasons:
•

The drive and/or disk data channel port is broken and cannot communicate with the disk
functional software.

•

The drive was previously communicating with the HSC but a serious error occurred, and
the HSC has ceased communicating with the drive (marked the drive as inoperative).

In either case, ILDISK prompts for a requestor number and port number. Refer to Section 5.5.6.
Mter receiving the unit number (or requestor and port), ILDISK prompts:
RUN A SINGLE DRIVE DIAGNOSTIC (YIN)

[N] ?

Answering N causes the drive to execute its entire integrity test set. Answering Y executes a single
drive integrity test. If a single drive integrity test is selected, the test prompts:
DRIVE TEST NUMBER (H)

[] ?

Enter a number (in hex) specifying the drive integrity test to be executed. Consult the appropriate
disk maintenance or service manual to determine the number of the test to perform. Entering a
test number not supported by the drive results in an error 13 generated in test 5.
The test prompts for the number of passes to perform:

t

OF PASSES TO PERFORM (1 to 32767)

(D)

[1] ?

Enter a decimal number between 1 and 32767 specifying the number of test repetitions. Pressing
RETURN without entering a number runs the test once.

5-12

Device Integrity Tests

5.5.6 Specifying Requestor and Port
Drives unknown to the HSC disk functional software are tested by specifying the requestor number
and port nl.lInber of the drive. The requestor number is any number 2 through 9 (HSC) or 2 through
7 (HSC50 [modified] or HSC50) specifying the disk data channel connected to the drive under test.
The port number is 0 through 3; it specifies which of four disk data channel ports is connected
to the drive under test. The requestor number and port number can be determined in one of two
ways:

1. By tracing the SDI cable from the desired disk drive to the HSC bulkhead connector, and then
tracing the bulkhead connector to a specific port on one of the disk data channels.
2. By using the SHOW DISKS command to display the requestor and port numbers of all known
drives. To use this method, exit ILDISK by pressing CTRIlY. Type SHOW DISKS in response
to the HSC prompt.
This command displays a list of all known drives including the requestor number and port
number for each dri-ve. Each disk data channel has four possible ports to which a drive can be
connected. By inference, the port number of the unknown unit must be one not listed in the
SHOW DISKS display (assuming the unknown drive is not connected to a defective disk data
channel). A defective disk data channel illuminates the red LED on the lower front edge of the
module. Refer to Chapter 2.
Mter a requestor number and a port number are supplied to ILDISK, the program checks to
ensure the specified requestor and port do not match any drive known to the HSC software. If
the requestor and port do not match a known drive, ILDISK prompts for the number of passes to
perform, as described in Section 5.5.5. If the requestor and port do match a known drive, ILDISK
reports error 08.

5.5.7 Progress Reports
ILDISK produces an end-of-pass report at the completion of each pass of the integrity test. One
pass of the program can take several minutes depending upon the type of drive being diagnosed.

5.5.8 Test Summaries
Test summaries for ILDISK follow.
•

Test 0, Parameter Fetching-Fetches parameters is identified as test O. The user is prompted
to supply a unit number and/or a requestor and port number. This part of ILDISK also prompts
for the number of passes to perform.

•

Test 01, Run KSDI Microdiagnostics--Commands the disk data channel to execute two of
its resident microdiagnostics. If the revision level of the disk data channel microcode is not up
to date, the microdiagnostics are not executed. The microdiagnostics executed are the partial
SDI test (K.sdi test 7) and the SERDESIRSGEN test (K.sdilK.si test 10).

•

Test 02, Check for Clocks and Drive Available-Issues a command to interrogate the
Real-Time Drive State of the drive. This command does not require an SDI exchange, but the
real-time status of the drive is returned to ILDISK. The real-time status should indicate the
drive is supplying clocks and the drive should be in the Available state.

•

Test 03, Drive Initialize Test-Issues a DRIVE INITIALIZE command to the drive under
test. This checks both the drive and the Controller Real-Time State Line of the SDI cable. The
drive should respond by momentarily stopping its clock and then restarting it.

•

Test 04, SDI Echo Test-First ensures the disk data channel microcode supports the ECHO
command. If not, a warning message is issued, and the rest of test 04 is skipped. Otherwise,
the test directs the disk data channel to conduct an ECHO exchange with the drive. An ECHO
exchange consists of the disk data channel sending a frame to the drive and the drive returning

Device Integrity Tests

5-13

it. An ECHO exchange verifies the integrity of the write/command data and the read/response
data lines of the SDI cable.
•

Test 05, Run Drive Integrity Tests-Directs the drive to run its internal integrity test. The
drive is commanded to run a single integrity test or its entire set of integrity tests depending
upon user response to the prompt:
Run a Single Drive Diagnostic ?

Before commanding the drive to run its integrity tests, the drive is brought on line to prevent
the drive from giving spurious Available indications to its other SDI port. The drive integrity
tests are started when the disk data channel sends a DIAGNOSE command to the drive. The
drive does not return a response frame for the DIAGNOSE until it is finished performing
integrity tests. This can require 2 or more minutes. While the disk data channel is waiting for
the response frame, ILDISK cannot be interrupted by a CTRLIY.
•

Test 06, Disconnect From Drive-Sends a DISCONNECT command to the drive and then
issues a GET LINE STATUS internal command to the K.sdiJK.si to ensure the drive is in the
Available state. The test also expects Receiver Ready and Attention are set in drive status and
Read/Write Ready is not set.

•

Test 07, Check Drive Status-Issues a GET STATUS command to the drive to check that
none of the drive's error bits are set. If any error bits are set, they are reported and the test
issues a DRIVE CLEAR command to clear the error bits. If the error bits fail to clear, an error
is reported.

•

Test 08, Drive Initialize--Issues a command to interrogate the Real-Time Drive State of the
drive. The test then issues a DRIVE INITIALIZE command to ensure the previous DIAGNOSE
command did not leave the drive in an undefined state.

•

Test 09, Bring Drive On Line-Issues an ONLINE command to the drive under test. Then
a GET LINE STATUS command is issued to ensure the drive's real-time state is proper for the
On-line state. Read/Write Ready is expected to be true; Available and Attention are expected to
be false.

•

Test 10, Recalibrate and Seek-Issues a RECALIBRATE command to the drive. This ensures
the disk heads start from a known point on the media. Then a SEEK command is issued to the
drive, and the drive's real-time status is checked to ensure the SEEK did not result in an
Attention condition. Then another RECALIBRATE command is issued, returning the heads to
a known position.

•

Test 11, Disconnect From Drive-Issues a DISCONNECT command to return the drive to
the Available state. Then the drive's real-time status is checked to ensure Available, Attention,
and Receiver Ready are true and Read/Wri te Ready is false.

•

Test 12, Bring Drive On Line--Attempts to bring the disk drive to the On-line state. Test 12
is executed only for drives known to the HSC disk functional software. Test 12 consists of the
following steps:
1. GET STATUS-ILDISK issues an SDI GET STATUS command to the disk drive.

2. ONLlNE-ILDISK directs the HSC diagnostic interface to bring the drive on line.
If the GET STATUS and the ONLINE commands succeed, ILDISK proceeds to test 13. If the
GET STATUS and the ONLINE commands fail, ILDISK goes directly to test 17 (termination).
Note the on-line is performed through the HSC diagnostic interface, invoking the same software
operations a host invokes to bring a drive on line. An on-line at this level constitutes more
than just sending a SDI ONLINE command. The FCT and RCT of the drive also are read and
certain software structures are modified to indicate the new state of the drive. If the drive is
unable to read data from the disk media, the on-line operation fails. If test 12 fails, ILDISK
skips the remaining tests and goes to test 17.

5-14

Device Integrity Tests

•

Test 13, Read Only 110 Operations Test-Tests that all read/write heads in the drive can
seek and properly locate a sector on each track in the drive read only DBN space. (DBN space
is an area on all disk media devoted to diagnostic or integrity test use.) Test 13 attempts to
read at least one sector on every track in the read only area of the drive's DBN space. The
sector is checked to ensure it contains the proper data pattern. Bad sectors are allowed, but
there must be at least one good sector on each track in the read only area. Mter each successful
DBN read, ILDISK reads one LBN to further enhance seek testing. This ensures the drive can
successfully seek to and from the DBN area from the LBN area of the disk media. ILDISK
proceeds to test 16 when test 13 completes.

•

Test 14, 110 Operations Test (Read/Write 512 byte format)-Checks to see if the drive
can successfully write a pattern and read it back from at least one sector on every track in the
drive read/write DBN area. (Read/write DBN space is an area on every disk drive devoted to
diagnostic or integrity test read/write testing.) Bad sectors are allowed, but at least one sector
on every track in the read/write area must pass the test. Mter test 14 completes, ILDISK
proceeds to test 17.

•

Test 17, Terminate ILDISK-Is the ILDISK termination routine. The following steps are
performed:
1.

If the drive is unknown to the HSC disk functional software, or if the SDI verification test
failed, proceed to step 5 of this t~st.

2. An SDI CHANGE MODE command is issued to the drive. The CHANGE MODE command
directs the drive to disallow access to the DBN area and changes the sector size (512 or 576
bytes) back to its original state.
3. The drive is released from exclusive integrity test use. This returns the drive to the
Available state.
4. The drive is reacquired for exclusive integrity test use. This is to allow looping if more than
one pass is selected.
5. If more passes are left to perform, the test is reinitiated.

6. If no more passes are left to
acquired, and terminates.

perform~

ILDISK releases the drive, returns all structures

5.5.9 Error Message Example
All error messages produced by the disk drive integrity tests conform to the HSC integrity test
error message format (Section 5.1.2). Following is a typical ILDISK error message.
ILDISK>D>09:35 T 005 E 035 U-D00082
ILDISK>D>Drive Diagnostic Detected Fatal Error
ILDISK>D>FRU1-Drive
FRU2ILDISK>D>Requestor Number 04
ILDISK>D>Port Number 03
ILDISK>D>Test 0025 Error 007F
ILDISK>D>End Of Pass 00001

5.5.10 Error Messages
Messages produced by ILDISK are described in the following list:
•

Error 01, DDUSUB Initialization Failure-The HSC diagnostic interface did not initialize.
Error 01 is not recoverable and is caused by:
1. Insufficient memory to allocate buffers and control structures required by the diagnostic
interface.
2. HSC disk functional software is not loaded.

Device Integrity Tests

5-15

•

Error 02, Unit selected Is Not a Disk-The response to the unit number prompt was not of
the form Dnnnn (refer to Section 5.5.5).

•

Error 03, Drive Unavailable-The selected disk drive is not available for ILDISK.

•

Error 04, Unknown Status from DDUSUB-A call to the diagnostic interface resulted in
the return of an unknown status code. This indicates a software error and should be reported
through a Software Performance Report (SPR). See Appendix B for detailed information on SPR
submission.

•

Error 05, Drive Unknown to Disk Functional Code-The disk drive selected is not known
to the HSC disk functional software. The drive may not be communicating with the HSC, or
the disk functional software may have disabled the drive due to an error condition. ILDISK
prompts the user for the drive's requestor and port. Refer to Section 5.5.6 for information on
specifying requestor and port.

•

Error 06, Invalid Requestor or Port Number Specified-The requestor number given was
not in the range 2 through 9 (HSC) or 2 through 7 (HSC50), or the port number given was not
in the range 0 through 3. Specify a requestor and port within the allowable ranges.

•

Error 07, Requestor Selected Is Not a K.sdi-The requestor specified was not a disk data
channel (K.sdi/K..si). Specify a requestor that contains a disk data channel.

•

Error 08, Specified Post contains a Known Drive-The requestor and port specified contain
a drive known to the HSC disk functional software. The unit number of the drive is supplied in
the report. ILDISK does not allow testing a known drive through requestor number and port
number.

•

Error 09, Drive Can't Be Brought On Line-A failure occurred when ILDISK attempted to
bring the specified drive on line. One of the following conditions occurred:
1.

Unit Is Off Line-The specified unit went to the Off-line state and now cannot communicate
with the HSC.

2.

Unit Is In Use-The specified unit is now marked as in use by another process.

3.

Unit Is a Duplicate-Two disk drives are connected to the HSC, both with the same unit
number.

4. Unknown Status from DDUSUB-The HSC diagnostic interface returned an unknown
status code when ILDISK attempted to bring the drive on line. Refer to error 04 for related
information on this error.
•

Error 10, K.sdi Does Not Support Microdiagnostics-The KsdilKsi connected to the drive
under test does not support microdiagnostics. This indicates the K.sdilK.si microcode is not at
the latest revision level. This is not a fatal error, but the KsdilK.si should probably be updated
with the latest microcode to improve error detection capabilities.

•

Error 11, Change Mode Failed-ILDISK issued an SDI CHANGE MODE command to the
drive and the command failed. The drive is presumed the failing unit because the SDI interface
was previously verified.

•

Error 12, Drive Disabled Bit Set-The SDI verification test issued an SDI GET STATUS
command to the drive under test. The drive disabled bit was set in the status returned by the
drive, indicating the drive detected a serious error and is now disabled.

•

Error 13, Command Failure-The SDI verification test detected a failure while attempting to
send an SDI command to the drive. One of the following occurred.
1. Did Not Complete-The drive did not respond to the command within the allowable time.
Further SDI operations to the drive are disabled.

2. Ksdi Detected Error-The K.sdilK..si detected an error condition while sending the
command or while receiving the response.

5-16

Device Integrity Tests

3. Unexpected Response--The SDI command resulted in an Wlexpected response from the
drive. This error can be caused by a DIAGNOSE command if a single drive integrity test
was selected, and the drive does not support the specified test number.
•

Error 14, Can't Write Any Sector on Track-As part of test 04, ILDISK attempts to write a
pattern to at least one sector of each track in the read/write area of the drive DBN space. (DBN
space is an area on every disk drive reserved for diagnostic use only.) During the write process,
ILDISK detected a track with no sector that passed the read/write test. (ILDISK could not
write a pattern and read it back successfully on any sector on the track.) The error information
for the last sector accessed is identified in the error report. The most probable cause of this
error is a disk media error.
If test 03 also failed, the problem could be in the disk read/write electronics, or the DBN
area of the disk may not be formatted correctly. To interpret the MSCP status code, refer to
Section 5.5.1!'

•

Error 15, ReadlWrite Ready Not Set in On-line Drive-The SDI verification test executed
a command to interrogate the Real-Time Drive State line of the drive. The line status reported
the drive was in the On-line state, but the Read/Write Ready bit was not set in the status.
This could be caused by a failing disk drive, bad RJW logic, or bad software media.

•

Error 16, Error Releasing Drive-ILDISK attempted to release the drive under test. The
release operation failed. One of the following occurred.
1.

Could Not Disconnect-An SDI DISCONNECT command to the drive failed.

2.

Unknown Status from DDUSUB-Refer to error 04.

•

Error 17, Insufficient Memory, Test Not Executed-The SDI verification test could not
acquire sufficient memory for control structures. The SDI verification test could not be
executed. Use the SETSHO command SHOW MEMORY to display available HSC memory.
If any disabled memory appears in the display, consider further testing of the memory module.
If no disabled memory is displayed, and no other integrity test or utility is active on this HSC,
submit an SPR. See Appendix B for detailed information on SPR submission.

•

Error 18, K Microdiagnostic Did Not Complete-The SDI verification test directed the
disk data channel to execute one of its microdiagnostics. The microdiagnostic did not complete
within the allowable time. All drives connected to the disk data channel may now be unusable
(if the microdiagnostic never completes) and the HSC probably must be rebooted. The disk data
channel module is the probable failing FRU.

•

Error 19, K Microdiagnostic Reported Error-The SDI verification test directed the
disk data channel to execute one of its microdiagnostics. The microdiagnostic completed and
reported an error. The disk data channel is the probable FRU.

•

Error 20, DCB Not Returned, K Failed for Unknown Reason-The SDI verification test
directed the disk data channel to execute one of its microdiagnostics. The microdiagnostic
completed without reporting any error, but the disk data channel did not return the dialog
control block (DCB). All drives connected to the disk data channel may now be unusable. The
disk data channel is the probable FRU and the HSC probably will have to be rebooted.

•

Error 21, Error in DCB on Completion-The SDI verification test directed the disk data
channel to execute one of its microdiagnostics. The microdiagnostic completed without reporting
any error, but the disk data channel returned the dialog control block (DCB) with an error
indicated. The disk data channel is the probable FRU.

•

Error 22, Unexpected Item on Drive Service Queue-The SDI verification test directed
the disk data channel to execute one of its microdiagnostics. The microdiagnostic completed
without error, and the disk data channel returned the dialog control block (DCB) with no
errors indicated. However, the disk data channel sent the drive state area to its service queue,
indicating an Wlexpected condition in the disk data channel or drive.

Device Integrity Tests

•

5-17

Error 23, Failed To Reacquire Unit-In order for ILDISK to allow looping, the drive under
test must be released and then reacquired. (This method is required to release the drive from
the On-line state.) The release operation succeeded, but the attempt to reacquire the drive
failed. One of the following conditions occurred:
1. Drive Unknown to Disk Functional Code-A fatal error caused the HSC disk functional
software to declare the drive inoperative, so the drive unit number is not recognized. The
drive must now be tested by specifying requestor and port number.

2. Drive Unavailable-The specified drive is now not available for integrity test use.
3. Unknown Status from DDUSUB-Refer to Error 04.

The drive may be allocated to an alternate HSC. Check the drive port lamp to see if this
caused the error.
•

Error 24, State Line Clock Not Running-The SDI verification test executed a command
to interrogate the Real-Time Drive State of the drive. The returned status indicates the drive
is not sending state line clock to the disk data channel. Either the port, SDI cable, or drive is
defective or the port is not connected to a drive.

•

Error 25, Error Starting I/O Operation-ILDISK detected an error when initiating a disk
Read or Write operation. One of the following conditions occurred:
1. Invalid Header Code-ILDISK did not supply a valid header code to the HSC diagnostic
interface. This indicates a software error and should be reported through a Software
Performance Report (SPR). See Appendix B for detailed information on SPR submission.

2. Could Not Acquire Control Structures-The HSC diagnostic interface could not acquire
sufficient control structures to perform the operation.
3. Could Not Acquire Buffer-The HSC diagnostic interface could not acquire a buffer needed
for the operation.

4. Unknown Status from DDUSUB-The HSC diagnostic interface returned an unknown
status code. Refer to Error 04.
NOTE

Retry ILDISK during lower HSC activity for the second and third problems if these
errors persist.
•

Error 26, Init Did Not Stop State Line Clock-The SDI verification test sent an SDI
INITIALIZE command to the drive. When the drive receives this command, it should
momentarily stop sending state line clock to the disk data channel. The disk data channel
did not see the state line clock stop after sending the initialize. The drive is the most probable
FRU.

•

Error 27, State Line Clock Did Not Start Up After Init-The SDI verification test sent an
SDI INITIALIZE to the drive. When the drive receives this command, it should momentarily
stop sending state clock to the disk data channel. The disk data channel saw the state clock
stop, but the clock never restarted. The drive is the most probable FRU.

•

Error 28, I/O Operation Lost-While ILDISK was waiting for a disk Read or Write operation
to complete, the HSC diagnostic interface notified ILDISK that no I/O operation was in
progress. This error may have been induced by a hardware failure, but it actually indicates
a software problem, and the error should be reported by a software performance report (SPR).
See Appendix B for detailed information on SPR submission.

•

Error 29, Echo Data Error-The SDI verification test issued an SDI ECHO command to the
drive. The command completed but the wrong response was returned by the drive. The SDI set
and the disk drive are the probable FRUs.

5-18

Device Integrity Tests

•

Error 30, Drive Went Off Line-The drive, previously acquired by the integrity test, is now
unknown to the disk functional code. This indicates the drive spontaneously went off line or
stopped sending clocks and is now unknown. The test should be restarted using the requestor
and port numbers instead of drive unit number.

•

Error 31, Drive Acquired But Can't find Control Area-The disk drive was acquired, and
ILDISK obtained the requestor number and port number of the drive from the HSC diagnostic
interface. However, the specified requestor does not have a control area. This indicates a
software problem and should be reported through a Software Performance Report (SPR). See
Appendix B for detailed infonnation on SPR submission.

•

Error 32, Requestor Does Not Have Control Area-ILDISK cannot find a control area for
the requestor supplied by the user. One of the following conditions exists:
1. The HSC does not contain a disk data channel (or other type of requestor) in the specified
requestor position.
2. The disk data channel (or other type of requestor) in the specified requestor position failed
its initialization integrity tests and is not in use by the HSC.
Open the· HSC front door and remove the cover from the card cage. Locate the module slot in
the card cage that corresponds to the requestor. Refer to the module utilization label above the
card cage to help locate the proper requestor. If a blank module (air baffle) is in the module slot,
the HSC does not contain a requestor in the specified position. If a requestor is in the module
slot, check that the red LED on the lower front edge of the module is lit. If so, the requestor
failed and was disabled by the HSC. If the red LED is not lit, a software problem exists and
should be reported through a Software Perfonnance Report (SPR). See Appendix B for detailed
information on SPR submission.

•

Error 33, Can't Read Any Sector on Track-As part of test 03, ILDISK attempts to read
a pattern from at least one sector of each track in the read-only area of the drive DEN space
(DBN space is an area on every disk drive reserved for diagnostic or integrity test use). All
drives have the same pattern written to each sector in the read only DBN space.
During the read process, ILDISK detected a track that does not contain any sector with the
expected pattern. Either ILDISK detected errors while reading or the read succeeded, but the
sectors did not contain the correct pattern. The error information for the last sector accessed
is supplied in the error report. The most likely cause of this error is a disk media error. If test
04 also fails, the problem may be in the disk read/write electronics, or the DBN area of the disk
may not be formatted correctly. To interpret the MSCP status code, refer to Section 5.5.11.

•

Error 34, Drive Diagnostic Detected Error-The SDI verification test directed the disk
drive to run an internal integrity test. The drive indicated the integrity test failed, but the
error is not serious enough to warrant removing the drive from service. The test number and
error number for the drive are displayed (in hex) in the error report. For the exact meaning of
each error, refer to the service documentation for that drive.

•

Error 35, Drive Diagnostic Detected Fatal Error-The SDI verification test directed the
disk drive to run an internal integrity test. The drive indicated the integrity test failed and the
error is serious enough to warrant removing the drive from service. The test and error number
are displayed (in hex) in the error report. For the exact meaning of each error, refer to the
service manual for that drive.

•

Error 36, Error Bit Set in Drive Status Error Byte-The SDI verification test executed an
SDI GET STATUS command to the drive under test. The error byte in the returned status was
nonzero indicating one of the following conditions:
1. Drive error
2. Transmission error
3. Protocol error
4. Initialization integrity test failure

Device Integrity Tests

5-19

5. Write lock error
For the exact meaning of each error, refer to the service manual for that drive.
•

Error 37, Attention Set Mter SEEK-The SDI verification routine issued a SEEK command
to the drive which resulted in an unexpected ATTENTION condition. The drive status is
displayed with the error report. Refer to the service manual for that drive.

•

Error 38, Available Not Set In Available Drive-The SDI verification routine executed a
command to interrogate the Real-Time Drive State Line of the drive. ILDISK found Available
is not set in a drive that should be Available.

•

Error 39, Attention Not Set in Available Drive-The SDI verification routine executed a
command to interrogate the Real-Time Drive State Line of the drive and found Attention is not
asserted even though the drive is Available.

•

Error 40, Receiver Ready Not Set-The SDI verification routine executed a command to
interrogate the Real-Time Drive State Line of the drive. The routine expected to find Receiver
Ready asserted, but it was not.

•

Error 41, ReadlWrite Ready Set in Available Drive-The SDI verification routine executed
a command to interrogate the Real-Time Drive State Line of the drive and found Available
asserted. However, ReadlWrite Ready also was asserted. ReadlWrite Ready should never be
asserted when a drive is in the Available state.

•

Error 42, Available Set in On-line Drive-The SDI verification routine issued an ONLINE
command to the disk drive. Then a command was issued to interrogate the Real Time Drive
State Line of the drive. The line status indicates the drive is still asserting Available.

•

Error 43, Attention Set in On-line Drive-The SDI verification routine issued an ONLINE
command to the drive. The drive entered the On-line state, but an unexpected Attention
condition was encountered.

•

Error 44, Drive Clear Did Not Clear Errors-When ILDISK issued a GET STATUS
command, error bits were set in the drive response. Issuing a DRIVE CLEAR failed to clear the
error bits. The drive is the probable FRU.

•

Error 45, Error Reading LBN-As part of test 14, ILDISK alternates between reading DBNs
and LBNs. This tests the drive's ability to seek properly. The error indicates an LBN read
failed. The drive is the probable FRU.

•

Error 46, Echo Framing Error-The framing code (upper byte) of an SDI ECHO command
response is incorrect. The EXPected and ACTual ECHO frames are displayed with the error
message. The K.sdilK.si cable and the drive are the probable FRUs.

•

Error 47, K.sdi Does Not Support ECHO-The disk data channel connected to the drive
under test does not support the SDI ECHO command because the disk data channel microcode
is not the latest revision level. This is not a fatal error, but the disk data channel microcode
should be updated to allow for improved isolation of drive-related errors.

•

Error 48, ReqIPort Number Information Unavailable-ILDISK was unable to obtain
the requestor number and port number from HSC disk software tables. The drive may have
changed state and disappeared while ILDISK was running. This error also can be caused by
inconsistencies in HSC software structures.

•

Error 49, Drive Spindle Not Up to Speed-ILDISK cannot continue testing the drive
because the disk spindle is not up to speed. If the drive is spun down, it must be spun up before
ILDISK can completely test the unit. If the drive appears to be spinning, it may be spinning
too slowly or the drive may be returning incorrect status information to the HSC.

5-20

Device Integrity Tests

•

Error 50, Can't Acquire Drive State Area-ILDISK cannot perform the low-level SDI tests
because it cannot acquire the Drive State Area for the drive. The Drive State .Area is a section
of the K Control Area used to communicate with the drive through the SDI interface. To
perform the SDI tests, ILDISK must take exclusive control of the Drive State .Area; otherwise,
the HSC operational software may interfere with the tests. The Drive State.Area must be in
an inactive state (no interrupts in progress) before it can be acquired by ILDISK If the drive
is rapidly changing its SDI state and generating interrupts, ILDISK may be unable to find the
drive in an inactive state.

•

Error 51, Failure While Updating Drive STATUS-When in the process of returning the
drive to the same mode as ILDISK originally found it, an error occurred while performing an
SDI GET STATUS command. When a drive is acquired by ILDISK, the program remembers
whether the drive was in 576-byte mode or 512-byte mode (reflected by the S7 bit of the mode
byte in the drive status). When ILDISK releases the drive (once per pass of the program),
the drive mode is returned to the state the drive was in when ILDISK first acquired it. In
order to ensure the HSC disk functional software is aware of this mode change, ILDISK calls
the diagnostic interface routines to perform a GET STATUS to the drive. These routines also
update the disk functional software information on the drive to reflect the new mode.
Error 51 indicates the drive status update failed. The diagnostic interface returns one of three
different status codes with this error:
1. DRIVE ERROR-The GET STATUS command could not be completed due to an error
during the command. If informational error messages are enabled (through a SET ERROR
INFO command), an error message describing the failure should be printed on the console
terminal.

2. BAD UNIT NUMBER-The diagnostic interface could not find the unit number specified.
The drive may have spontaneously transitioned to the Off-line state (no clocks) since the
last ILDISK operation. For this reason, the unit number is unknown when the diagnostic
interface tries to do a GET STATUS command.
3. UNKNOWN STATUS FROM DDUSUB-Refer to Error 04.

•

Error 52, 576-Byte Format Failed-The program attempted to perform a 576-byte format to
the first two sectors of the first track in the read/write DBN area. No errors were detected
during the actual formatting operation, but subsequent attempts to read either of the
reformatted blocks failed. The specific error detected is identified in the error report.

•

Error 53, 512-Byte Format Failed-The program attempted to perform a 512-byte format to
the first two sectors of the first track in the read/write DBN area. No errors were detected
during the actual formatting operation, but subsequent attempts to read either of the
reformatted blocks failed. The specific error detected is identified in the error report.

•

Error 54, Insufficient Resources to Perform Test-This error indicates further testing
cannot complete due to lack of required memory structures. To perform certain drive tests
ILDISK needs to acquire timers, a dialog control block (DCB), free control blocks (FCBs), data
buffers, and enough Control memory to construct two disk rotational access tables (DRATs). If
any of these resources are unavailable, testing cannot be completed. Under normal conditions
these resources should always be available.

•

Error 55, Drive Transfer Queue Not Empty Before Format-ILDISK found a transfer
already queued to the K.sdilK.si when the format test began. ILDISK should have exclusive
access to the drive at this time, and all previous transfers should have been completed before
the drive was acquired. To avoid potentially damaging interaction with some other disk process,
ILDISK aborts testing when this condition is detected.

•

Error 56, K.sdi Detected Error During Format-K.sdilK.si detected an error during a
Format operation. Each error bit set in the fragment request block (FRB) is translated. into a
text message that accompanies the error report.

Device ·Integrity Tests

5-21

•

Error 57, Wrong Structure on Completion Queue-While formatting, ILDISK checks each
structure returned by the K.sdilK.si to ensure the structure was sent to the proper completion
queue. An Error 57 indicates one of these structures was sent to the wrong completion queue.
This type of error indicates a problem with the K.sdilK.si micro sequencer or a Control memory
failure.

•

Error 58, Read Operation Timed Out-To guarantee the disk is on the correct cylinder and
track while formatting, ILDISK queues a Read operation immediately preceding the FORMAT
command. The Read operation did not complete within 16 seconds indicating the KsdiJK.si
is unable to sense sector/index pulses from the disk, or the disk is not in the proper state to
perform a transfer. ILDISK aborts the format test following this error report.

•

Error 59, K.sdi Detected Error in Read Preceding Format-To guarantee the disk is on
the correct cylinder and track while formatting, ILDISK queues a Read operation immediately
preceding the FORMAT command. The Read operation failed, so ILDISK aborts the format
test. Each error bit set in the fragment request block (FRB) is translated into a text message
which accompanies the error report.

•

Error 60, Read DRAT Not Returned to Completion Queue-To guarantee the disk is on
the correct cylinder and track while formatting, ILDISK queues a Read operation immediately
preceding the format command. The Read operation apparently completed successfully because
the fragment request block (FRB) for the read was returned with no error bits set. However,
the Disk Rotational Access Table (DRAT) for the Read operation was not returned indicating a
problem with the K.sdilK.si.

•

Error 61, Format Operation Timed Out-The K.sdilKsi failed to complete a Format
operation. A Format operation consists of a Read followed by a format. The Read completed
successfully, but after waiting a 16-second interval the Format was not complete. A change in
drive state may prevent formatting, the drive may no longer be .sending sector/index information
to the K.sdilK.si, or the K.sdilK.si may be unable to sample the drive state. The format test
aborts on this error to prevent damage to the existing disk format.

•

Error 62, Format DRAT Was Not Returned to Completion Queue-The K.sdilK.si failed
to complete a Format operation. A Format operation consists of a read followed by a format.
The Read completed successfully, and the fragment request block (FRB) for the format was
returned by the K.sdilK.si with no error indicated. However, the disk rotational access table
(DRAT) for the Format operation was never returned, indicating a probable K.sdi.lK.si failure.
Mter reporting this error, the format test aborts.

•

Error 63, Can't Acquire Specified Unit-ILDISK was initiated automatically to test a disk
drive declared inoperative. When initiated by the disk functional software, ILDISK was given
the requestor number, port number, and unit number of the drive to test. ILDISK successfully
acquired the drive by unit number, but the requestor and port number of the acquired drive did
not match the requestor and port given when ILDISK was initiated. This indicates the HSC
is connected to two separate drives with the same unit number plugs. To prevent inadvertent
interaction with the other disk drive, ILDISK performs only the low-level SDI tests on the unit
specified by the disk functional software. Read/write tests are skipped because the drive must
be acquired by unit number to perform read/write transfers.

•

Error 64, Duplicate Unit Detected-At times during the testing sequence, ILDISK must
release, then reacquire, the drive under test. ..After releasing the drive and reacquiring it,
ILDISK noted the requestor and port number of the drive it was originally testing do not
match the requestor and port number of the drive just acquired. This indicates the HSC is
connected to two separate drives with the same unit number. If this error is detected, ILDISK
discontinues testing to prevent inadvertent interaction with the other disk drive.

•

Error 65, Format Tests Skipped Due to Previous Error-To prevent possible damage to
the existing disk format, ILDISK does not attempt to format if any errors were detected in the
tests preceding the format tests. This error message informs the user that formatting tests will
not be performed.

5-22

Device Integrity Tests

•

Error 66, Testing Aborted-ILDISK was automatically initiated to test a disk drive declared
inoperative by the disk functional code of the HSC. The disk drive had previously been
automatically tested at least twice and somehow was returned to service. Because the tests
performed by ILDISK may be causing the inoperative drive to be retu.rn.ed to service, ILDISK
does not attempt to test an inoperative drive more than twice. On all succeeding invocations
of ILDISK, an Error 66 message prints and ILDISK exits without performing any tests on the
drive. This prevents ILDISK from automatically initiating and dropping the drive from the test
over and over again.

•

Error 67, Not Enough Good DBNs for Format-In order to guarantee the disk is on the
proper cylinder and track, all formatting operations are immediately preceded by a Read
operation on the same track where the format is planned. This requires the first track in the
drive's read/write DBN area to contain at least one good block that can be read without error.
An Error 67 indicates a good block was not found on the first track of the read/write DBN area,
so the fonnatting tests are skipped.

5.5.11 MSCP Status Codes-iLDISK Error Reports
This section lists some of the MSCP status codes that may appear in ILDISK error reports. All
status codes are listed in the octal radix. Further information on MSCP status codes is provided in
Appendix C.
007-Compare Error
OlO-Forced Error
052-SERDES Overrun
053-SDI Command Timeout
lO3-Drive Inoperative
llO-Header Compare or Header Sync Timeout
ll2-EDC Error
ll3-Controller Detected Transmission Error
l50-Data Sync Not Found
l52-Internal Consistency Error
l53-Position or Unintelligible Header Error
2l3-Lost ReadlWrite Ready
253-Drive Clock Dropout
3l3-Lost Receiver Ready
350-Uncorrectable ECC Error
353-Drive Detected Error
4l0-0ne Symbol ECC Error
412-Data Bus Overrun
4l3-State or Response Line Pulse or Parity Error
450-Two Symbol ECC Error
452-Data Memory NXM or Parity Error
453-Drive Requested Error Log
5lO-Three Symbol ECC Error
5l3-Response Length or Opcode Error
550-Four Symbol ECC Error
553-Clock Did Not Restart Mter lnit
6lO-Five Symbol ECC Error
6l3-Clock Did Not Stop Mter Init
650-Six Symbol ECC Error
653-Receiver Ready Collision
710-Seven Symbol ECC Error
7l3-Response Overflow
750-Eight Symbol ECC Error

Device Integrity Tests

5-23

5.6 ILTAPE - TAPE Device Integrity Tests
The following tests can be initiated through ILTAPE:
•

Tape formatter-resident integrity tests

•

Functional test of the tape transport

•

Full test of the K.stiIK.si interface
When a full test is selected, the KstilK.si microdiagnostics are executed, line state is verified,
an ECHO test is performed, and a default set of formatter tests is executed. See the DRIVE
UNIT NUMBER prompt in the Section 5.6.3 for information on initiating a full test. Detected
failures result in fault isolation to the FRU level.

Three types of tape transport tests are listed below. See Section 5.6.6 for a summary of each.
Fixed canned sequence
User sequence supplied at the terminal
Fixed streamer sequence
Hardware requirements necessary to run ILTAPE include:
•

HSC subsystem with K.stiIK.si

•

STI-compatible tape formatter

•

TA7B, TAB!, or other DSA tape drive (for transfer commands only)

•

Console terminal

•

RX33 disk drive or equivalent (HSC)

•

TU5B tape device or equivalent (HSC50)

In addition, the 110 control processor, program memory, and control memory must be working.
Software requirements necessary to run ILTAPE include:
•

CRONIC

•

DEMON

•

K.stilK.si microcode (installed with the K.stilK.si module)

5.6.1 Operating Instructions
The following steps outline the procedure for running ILTAPE. The test assumes an HSC is
configured with a terminal and STI interface. If the HSC is not booted, start with step 1. If
the HSC is already booted, proceed to step 2.
1. Boot the HSC.

Press the lnit button on the HSC OCP. The following message appears:
INIPIO-I Booting •..

The boot process takes about 1 minute, and then the following message appears:

ase

Version xxxx Date Time

2. Press CTRI1Y.

System n

5-24

Device Integrity Tests

This causes the KMON prompt:
HSC>

3. Type R DXn:ILTAPE.
This invokes the tape device integrity test program ILTAPE. The DXn is the HSC device name. The
n refers to the unit number of the specific HSC drive. For example, DX1: refers to RX33 Drive 1
(HSC) and DD1: refers to TU58 Drive 1 (HSC50). The following message appears:
ILTAPE>D>hh:mm Execution Starting

5.6.2 Test Termination
The test can be terminated by pressing CTRUC. Certain errors that occur during execution will
cause ILTAPE to terminate automatically.

5.6.3 User Dialog
The following paragraphs describe ILTAPE/user dialog during execution of ILTAPE. Note that the
default values for input parameters appear within the brackets of the prompt. The absence of a
value within the brackets indicates the input parameter is not defaultable.
DRIVE UNIT NUMBER (U)

[]?

To run formatter tests or transport tests, enter Tnnn, where nnn is the MSCP unit number (such
as T316).
For a full interface test, enter Xm, where m is any number. Typing X instead of T requires a
requestor number and slot number. The following two prompts solicit requestor/slot numbers:
ENTER REQUESTOR NUMBER (2-9)

[]?

Enter the requestor number. The range includes numbers 2 through 9, with no default value.
ENTER PORT NUMBER (0-3)

[]?

Enter the port number. The port number must be 0, 1, 2, or 3 with no default value. After this
prompt is answered, ILTAPE executes the K.stilK.si interface test.
EXECUTE FORMATTER DIAGNOSTICS (YN)

[Y]?

Enter RETURN to execute formatter tests. The default is Y. Entering N will not run formatter
tests.
MEMORY REGION NUMBER (H)

[O].?

This prompt appears only if the response to the previous prompt was RETURN. A formatter test is
named according to the formatter memory region where it executes. Enter the memory region (in
hex) in which the formatter test is to execute. ILTAPE continues at the prompt for iterations. Refer
to the appropriate tape drive service manual for more information on formatter tests.
EXECUTE TEST OF TAPE TRANSPORT (YN)

[N]?

To test the tape transport, enter Y (the default is N). If no transport testing is desired, the dialog
continues with the ITERATIONS prompt. Otherwise, the following prompts appear:
IS MEDIA MOUNTED (YN)

[N]?

Device Integrity Tests

5-25

This test writes to the tape transport, requiring a mounted scratch tape. Enter Y if a scratch tape
is already mounted.
FUNCTIONAL TEST SEQUENCE NUMBER (D)

[1]?

Select one of five transport tests. The default is 1 (the canned sequence). Enter 0 if a new user
sequence will be input from the terminal. Enter 2, 3, or 4 to select a user sequence previously input
and stored on the HSC device. User sequences are described in Section 5.6.4. Enter 5 to select the
streaming sequence.
INPUT STEP 00:

This prompt appears only if the response to the previous prompt was
description of user sequences.
ENTER CANNED SEQUENCE RON TIME IN MINUTES (D)

o.

See Section 5.6.4 for a

[1]?

Answering this prompt determines the time limit for the canned sequence. It appears only if the
canned sequence is selected. Enter the total run time limit in minutes. The default is 1 minute.
SELECT DENSITY (O=ALL, 1=1600, 2=6250)

[O]?

This prompt permits selection of the densities used during the canned sequence. It appears only if
the canned sequence is selected. One or all densities may be selected; the default is all.
SELECT DENSITY (1=800, 2=1600, 3=6250)

[3]?

This prompt appears only if a user-defined test sequence was selected. The prompt permits
selection of anyone of the possible tape densities. The default density is 6250 bits per inch (bpi).
Enter 1, 2, or 3 to select the desired tape density.
1 = 800 bpi
2 = 1600 bpi
3 = 6250 bpi
The next series of prompts concerns speed selection. The particular prompts depend upon the type
of speeds supported (fixed or variable). ILTAPE determines the speed types supported and prompts
accordingly.
If fixed speeds are supported, ILTAPE displays a menu of supported speeds, as follows:
Fixed Speeds Available:
(1)
(2)
(3)
(4)

ssss
ssss
ssss
ssss

ips
ips
ips
ips

The supported speed in inches per second is shown as ssss. The maximum number of supported
speeds is 4. Thus, n cannot be greater than 4. The prompt for a fixed speed is:
SELECT FIXED SPEED (D)

[1]?

To select a fixed speed, enter a digit (n) corresponding to one of the above displayed speeds. The
default is the lowest supported speed. ILTAPE continues at the data pattern prompt.

5-26

Device Integrity Tests

If variable speeds are supported, ILTAPE displays the lower and upper bounds of the supported
speeds as follows:
VARIABLE SPEEDS AVAILABLE:
LOWER BOUND
UPPER BOUND

=
=

III ips
uuu ips

NOTE
If only a single speed is supported, ILTAPE does not prompt for speed. It runs at the
single speed supported
To select a variable speed, enter a number within the bounds, inclusively, of the displayed supported

variable speeds. The default is the lower bound. The prompt for a variable speed is:
SELECT VARIABLE SPEED (D)

[0

=

LOWEST]?

The next prompt asks for the data pattern.
DATA PATTERN NUMBER (D)

[3]?

Choose one of five data patterns.
O-User supplied
I-All zeros
z..:-All ones
3-Ripple zeros
4-Ripple ones
The default is 3. If the response is 0, the following prompts appear:
HOW MANY DATA ENTRIES (D)

[]?

Enter the number of unique words in the data pattern. Up to 16 words are permitted.
DATA ENTRY (H)

[]?

Enter the data pattern word (in hex), for example, ABCD. This prompt repeats until the all data
words specified in the previous prompt are exhausted.
SELECT RECORD SIZE (GREATER THAN OR EQUAL TO 1)

(D)

[8192]?

Enter the desired record size in decimal bytes. The default is 8192 bytes. The maximum record
size that can be specified is 12288.

NOTE
This prompt does not appear if streaming is selected.
ITERATIONS (D)

[1]?

Enter the number of times the selected tests are to run. After the number of iterations is entered,
the selected tests begin execution. Errors encountered during execution cause display of appropriate
messages at the terminal.

Device Integrity Tests

5-27

5.6.4 User Sequences
To test/exercise a tape transport, write a sequence of commands at the terminal. This sequence
may be saved on the HSe device and be recalled for execution at a later time. Up to three user
sequences can be saved on the HSC device.

Following is a list of supported user sequence commands:
WRT-Write one record
RDF-Read one record forward
RDFC-Read one record forward with compare
RDB-Read one record backward
RDBC-Read one record backward with compare
FSR-Forward space one record
FSF-Forward space one file
BSR-Backspace one record
BSF-Backspace one file
REW-Rewind
RWE-Rewind with erase
UNL--Unload (after rewind)
WTM-Write tape mark
ERG-Erase gap
Cnnn -Counter set to nnn (0 = 1000.)
Dnnn -Delay nnn ticks (0 = 1000.)
BRnn-Branch unconditionally to step nn
DBnn-Decrement counter and branch if nonzero to step nn
TMnn-Branch on Tape Mark to step nn
NTnn-Branch on no Tape Mark to step nn
ETnn-Branch on EOT to step nn
NEnn-Branch on not EOT to step nn
QillT-Terminate input of sequence steps
To initiate the user sequence dialog, type 0 in response to the prompt:
FUNCTIONAL TEST SEQUENCE NUMBER (D)

[1]?

The following paragraphs describe the ILTAPE user dialog during a new user sequence.
INPUT STEP

nn

Enter one of the user sequence commands listed previously. ILTAPE keeps track of the step
numbers and automatically increments them. Up to 50 steps may be entered. Typing QUIT in
response to the INPUT STEP prompt terminates the user sequence. At that time, the following
prompt appears:
STORE SEQUENCE AS SEQUENCE NUMBER (0,2,3,4)

[OJ?

The sequence entered. at the terminal may be stored on the HSe load device in one of three files. To
select one of these files, type 2, 3, or 4. Once stored, the sequence may be recalled for execution at a
later time by referring to the appropriate file (typing 2, 3, or 4 in response to the sequence number
prompt).
Typing (the default) indicates the user sequence just entered should not be stored. In this
case, the sequence cannot be run at a later time.
An example of entering a user sequence follows:

5-28

Device Integrity Tests

INPUT STEP

00

REW ;Rewind the tape

INPUT STEP

01

C950 ;Set counter to 950

INPUT STEP

02

WRT ;Write one record

INPUT STEP

03

ET07 ;If EOT branch to step 7

INPUT STEP

04

RDB ;Read backward one record

INPUT STEP

05

FSR ;Forward space one record

INPUT STEP

06

DB02 ;Decrement counter, branch
;to step 2 if nonzero

INPUT STEP

07

REW

;Rewind the tape

INPUT STEP

08

QUIT

;Terminate sequence input

STORE SEQUENCE AS SEQUENCE NUMBER (0,2,3,4)

[O]? 3

This sequence writes a record, reads it backwards, and skips forward over it. If an EOT is
encountered prior to writing 950 records, the tape is rewound and the sequence terminates. Note,
the sequence is saved on the HSC device as sequence number 3 and can be recalled at a later
execution of ILTAPE.

5.6.5 Progress Reports
When transport testing is finished, a summary of soft errors appears on the terminal upon
completion of the test. The format of this summary is:
SOFT ERROR SUMMARY:

READ

WRITE

COMPARE

xxxxxx. xxxxxx xxxxxx

Successful completion of a formatter test is indicated by the following message on the terminal:
TEST nnnn DONE

The formatter test number is represented by nnnn.
When an error is encountered, an appropriate error message is printed on the terminal.

5.6.6 Test Summaries
The following sections summarize the tests contained in ILTAPE.
5.6.6.1 Interface Test Summary
This portion of ILTAPE tests the standard tape interface (STI) of a specific tape data channel
and port. It also performs low-level testing of the formatter by interfacing to the K.stilK.si drive
service area (port) and executing various Level 2 STI commands. The testing is limited to dialog
operations; no data transfer is done. The operations performed are DIAGNOSE, READ MEMORY,
GET DRIVE STATUS, and READ LINE STATUS.

K.stilK.si microdiagnostics are executed to verify the tape data channel. A default set of formatter
tests (out of memory region 0) is executed to test the formatter, and an echo test is performed to
test the connection between the port and the formatter.
Failures detected are isolated to the extent possible and limited to tape data channels, the STI set,
or the formatter. The STI set includes a small portion of the K..stilK..si module and the entire STI
(all connectors, cables, and a small portion of the drive). The failure probabilities of the STI set are:
1. STI cables or connectors (most probable)

Device Integrity Tests

5-29

2. Formatter
3. K.sti!K.si (least probable)
When the STI set is identified as the FRU, replacement should be in the order indicated in the
preceding list.
5.6.6.2 Formatter Test Summary
Fonnatter tests are executed out of a formatter memory region selected by the user. Refer to the
tape drive service manual for a description of the formatter tests. Failures detected identify the
fonnatter as the FRU.
5.6.6.3 User Sequence Test Summary
User sequences are used to exercise the tape transport. The particular sequence is totally userdefined. Refer to Section 5.6.4.
5.6.6.4 Canned Sequence Test Summary
The canned sequence is a fixed routine for exercising the tape transport. The canned sequence first
performs a quick verify of the ability to read and write the tape at all supported densities. Using
a user-selected record size, the canned sequence then writes, reads, and compares the data written
over a 200-foot length of tape. Positioning over this length of tape is also performed. Finally,
random record sizes are used to write, read, compare, and position over a 50-foot length of tape.
Errors encountered during the canned sequence are reported at the terminal.
5.6.6.5 Streaming Sequence Test Summary
The streaming sequence is a fixed sequence that attempts to write and read the tape at speed
(without hesitation). The entire tape is written, the tape is rewound, and the entire tape is read
back. Execution may be terminated at any time by pressing CTRUY.
NOTE

In reading the tape, ll..TAPE uses the ACCESS command. This allows the tape to move at
speed.. This is necessary because of the buffer size restrictions existing for test programs.

5.6.7 Error Message Example
ILTAPE conforms to the test generic error message format (Section 5.1.2). An example of an
ILTAPE error message follows:
ILTAPE>D>09:31 T # 011 E # 011 U-T00101
ILTAPE>D>COMMAND FAILURE
ILTAPE>D>MSCP WRITE MULTIPLE COMMAND
ILTAPE>D>MSCP STATUS:
000000
ILTAPE>D>POSITION
001792

The test number reflects the state level where ILTAPE is executing when an error occurs. This
number does not indicate a separate test that can be called. Table 5-1 defines the ILTAPE test
levels.

5-30

Device Integrity Tests

Table &-1

ILTAPE Test Levels

Test Number

ILTAPE State

o

Initialization of tape software interface

1

Device (port, formatter, unit) acquisition

2

STI interface test in execution

3

Formatter tests executing in response to Diagnostic Request (DR) bit

4

Tape transport functional test

5

User-selected formatter test executing

6

Termination and clean-up

The optional text is dependent upon the type of error.

5.6.8 Error Messages
The following list describes ILTAPE error messages.
•

Error 01, Initialization Failure--Tape path software interface cannot be established due to
insufficient resources (buffers, queues, timers, and so forth).

•

Error 02, Selected Unit Not a Tape--Selected drive is not known to the HSC as a tape.

•

Error 08, Invalid RequestorlPort Number--Selected requestor number or port number is
out of range or requestor selected is not known to the system.

•

Error 04, Requestor Not A K.sti-Selected requestor is not known to the system as a tape
data channel.

•

Error 05, Timeout Acquiring Drive Service Area-While attempting to acquire the drive
service area (port) in order to run the STI interface test, a timeout occurred. If this happens,
the tape functional code is corrupted. ILTAPE invokes a system crash.

•

Error 06, Requested Device Unknown-Device requested is not known to the tape
subsystem.

•

Error 07, Requested Device Is Busy-Selected device is on line to another controller or host.

•

Error 08, Unknown Status from Tape Diagnostic Interface--An unknown status was
returned from the test software interface TDUSUB.

•

Error 09, Unable to Release Device--Upon termination of ILTAPE or upon an error
condition, the device(s) could not be returned to the system.

•

Error 10, Load Device Write Error-CHECK IF WRITE LOCKED-An error occurred
while attempting to write a user sequence to the HSC device. Check to see if the HSC load
device is write-protected. The prompt calls for a user sequence number. To break the loop of
reprompts, press CTRUY.

•

Error 11, Command Failure--A command failed during execution of ILTAPE. The command
in error may be one of several types, such as an MSCP or Level 2 STI command. The failing
command is identified in the optional text of the error message. For example:
ILTAPE>D>MSCP READ COMMAND
ILTAPE>D>MSCP STATUS: nnnnnn

Device Integrity Tests

•

5-31

Error 12, Read Memory Byte Count Error-The requested byte count used in the read
(formatter) memory command is different from the actual byte count received.
EXPECTED COUNT: xxxx

ACTUAL COUNT: yyyy --

•

Error 13, Formatter Diagnostic Detected. Error-A test running in the formatter detects
an error. Any error text from the formatter is displayed.

•

Error 14, Formatter Diagnostic Detected Fatal Error-A test running in the formatter
detects a fatal error. Any error text from the formatter is displayed.

•

Error 15, Load Device Read Error-While attempting to read a user sequence from the load
device, a read error was encountered. Ensure a sequence has been stored on the load device as
identified by the user sequence number. The program reprompts for a user sequence number.
To break the loop of reprompts, press CTRLIY.

•

Error 16, Insufficient Resources to Acquire Specified Device-During execution, ILTAPE
was unable to acquire the specified device due to a lack of necessary resources. This condition
is identified to ILTAPE by the tape functional code through the diagnostic interface, TDUSUB.
ILTAPE has no knowledge of the specific unavailable resource.

•

Error 17, K Microdiagnostic Did Not Complete-During the STI interface test, the
requestor microdiagnostic timed out.

•

Error 18, K Microdiagnostic Reported Error-During the STI interface test, an error
condition was reported by the K microdiagnostics.

•

Error 19, DCB Not Returned, K Failed for Unknown Reason-During the STI interface
test, the requestor failed for an undetermined reason and the Diagnostic Control Block (DCB)
was not returned to the completion queue.

•

Error 20, Error in DCB upon Completion-During the STI interface test, an error condition
was returned in the DCB.

•

Error 21, Unexpected Item on Drive Service Queue-During the STI interface test, an
unexpected entry was found on the drive service queue.

•

Error 22, State Line Clock Not Running-During the STI interlace test, execution of an
internal command to interrogate the Real-Time Formatter State line of the drive indicated the
state line clock is not running.

•

Error 23, Init Did Not Stop State Line CLock-During the STI interlace test, after
execution of a formatter INITIALIZE command, the state line clock did not drop for the time
specified in the STI specification.

•

Error 24, State Line Clock Did Not Start Up After Init-During the STI interface test,
after execution of a formatter INITIALIZE command, the state line clock did not start up
within the time specified in the STI specification.

•

Error 25, Formatter State Not Preserved Across lnit-The state of the formatter prior to
a formatter initialize was not preserved across the initialization sequence.

•

Error 26, Echo Data Error-Data echoed across the STI interface was incorrectly returned.

•

Error 27, Receiver Ready Not Set-Mter issuing an ONLINE command to the formatter, the
Receiver Ready signal was not asserted.

•

Error 28, Available Set in On-line Formatter-Mter successful completion of a formatter
ONLINE command to the formatter, the Available signal is set.

•

Error 29, Load Device Errol"-File Not Found-During the user sequence dialog, ILTAPE
was unable to locate the sequence file associated with the specified user sequence number.
Ensure load device media is properly installed. The program reprompts for a user sequence
number. To break the loop of reprompts, press CTRIJY.

5-32

Device Integrity Tests

•

Error 30, Data Compare Error-During execution of the user or canned sequence, ILTAPE
encountered a software compare mismatch on the data written and read back from the tape.
The software compare is actually carried out by a subroutine in the diagnostic interlace,
TDUSUB. The results of the compare are passed to ILTAPE. Informatipn in the text of the error
message identifies the data in error.

•

Error 31, EDe Error-During execution of the user or canned sequence, ILTAPE encountered
an EDC error on the data written and read back from the tape. This error is actually detected
by the diagnostic interface, TDUSUB, and reported to ILTAPE. Information in the text of the
error message identifies the data in error.

•

Error 32, Invalid Multiunit Code from GUS Command-Mter a unit number is input to
ILTAPE and prior to acquiring the unit, ILTAPE attempts to obtain the unit's multiunit code
through the GET UNIT STATUS command. This error indicates a multiunit code of zero was
returned to ILTAPE from the tape functional code. Because a multiunit code of zero is invalid,
this error is equivalent to a device unknown to the tape subsystem.

•

Error 33, Insufficient Resources To Acquire Timer-ILTAPE was unable to acquire a timer
from the system; insufficient buffers are available in the system to allocate timer queues.

•

Error 34, Unit Unknown or On Line to Another Controller-The device identified by the
selected unit number is either unknown to the system or it is on line to another controller.
Verify the selected unit number is correct and run ILTAPE again.

5.7 ILTCOM - Tape Compatibility Test
ILTCOM tests the compatibility of tapes that may have been written on different systems and
different drives with STI compatible drives connected to an HSC through the STI bus. ILTCOM
may generate, modify, read, or list a compatibility tape. Data read from the compatibility tape is
compared to the expected pattern. A compatibility tape consists of file groups (called bunches) of
specific data pattern records.
Each bunch contains a header record and several data records of different sizes and is terminated
by a tape mark. The last bunch on a tape is followed by an additional tape mark (thus forming
logical EOT).
Each bunch contains a total of 199 records: one header record followed by 198 data records. The
header record contains 48 (decimal) bytes of 6 bit-encoded descriptive information, as follows:
Table 5-2

ILTCOM Header Record

Field

Description

Length

Example

1

Drive type
Drive serial number
Processor type
Processor serial number
Date
Comment 1

6 bytes
6 bytes
6 bytes
6 bytes
6 bytes
18 bytes

TA78
123456
HSC
123456
093083
Comment

2
3
4

5
6

lILTCOM can read but cannot generate a comment field.

The data records are arranged as follows:
•

Sixty-six records 24 (decimal) bytes in length. These records sequence through 33 different data
patterns. The 1st and 34th records contain pattern 1, the 2nd and 35th records contain pattern
2, and so forth, through the 33rd and 66th records containing pattern 33.

•

Sixty-six records 528 (decimal) bytes in length. These records sequence through the 33 data
patterns as described above.

Device Integrity Tests

•

5-33

Sixty· six records 12,024 (decimal) bytes in length. These records sequence through the 33 data
patterns in the same manner as the preceding data patterns.

The data patterns used are shown in Table 5-3.
Table 5-3

ILTCOM Data Patterns

Pattern
Number

Pattern

Description

1
2
3
4
5

377
000
274,377,103,000
000,377,377,000
210,104,042,021

Ones
Zeros
Peak shift
Peak shift
Floating one

6
7
8
9
10

273,167,356,333
126,251
065,312
000,377
001

11
12
13
14
15

002
004
010
020
040

Floating zero
Alternate bits
Square pattern
Alternate frames
Track on
Track 1 on
Track 2 on
Track 3 on
Track 4 on
Track 5 on

16
17
18
19
20

100
200
376
375
373

Track 6 on
Track 7 on
Track off
Track 1 off
Track 2 off

21
22
23
25

367
357
337
277
177

Track 3 off
Track 4 off
Track 5 off
Track 6 off
Track 7 off

26
27
28
29
30

207,377,370,377
170,377,217,377
113, 377, 264, 377
035,377,342,377
370,377,207,377

Bit peak shift.

31
32
33

217,377,170,377
264,377,113,377
342,377,035,377

24

°

°

5.7.1 System Requirements
The hardware requirements necessary to run ILTCOM include:
•

An HSC subsystem with KstilK.si

•

STI-compatible tape formatter

•

Tape drive

Because ILTCOM is not diagnostic in nature, all of the necessary hardware is assumed to be
working. EITors are detected and reported, but fault isolation is not a goal of ILTCOM.

5-34

Device Integrity Tests

ILTCOM software requirements include:
•

CRONIC

•

DEMON

•

KstilK.si microcode

•

TFUNCT

•

TDUSUB

5.7.2 Operating Instructions
The following steps outline the procedure for running ILTCOM. ILTCOM assumes the HSC is
configured with a terminal, STI interface, and a TA78 tape drive (or STI-compatible equivalent). If
the HSC is already booted, proceed to step 2. If the HSC needs to be booted, start with step 1.
1. Boot the HSC.

Press the Init button on the OCP of the HSC. The following message appears:
INIPIO-I Booting •..

The boot process can take several minutes, and then the following message appears:
HSC Version xxxx Date Time System n

2. Press CTRLIY.
This causes the KMON prompt to appear:
HSC>

3. 1)rpe R DXn.:ILTCOM. The variable n equals the number of the RX33 drive containing the HSC
system diskette. When running ILTCOM on an HSC50, use DDn: to access the TU58 tape
drive.
This invokes the compatibility test program ILTCOM. The following message appears:
ILTCOM>D>hh:mm Execution Starting

The subsequent program dialog is described in the next section.

5.7.3 Test Termination
ILTCOM is terminated normally by selecting the exit function (EXIT) or by pressing CTRUY or
CTRUC. Certain errors that occur during execution cause ILTCOM to terminate automatically.

5.7.4 Parameter Entry
ILTCOM allows the writing, reading, listing, or modifying of compatibility tapes. The following
describes the user dialog during the execution of ILTCOM.
DRIVE UNIT NUMBER (U)

[]?

Enter the tape drive MSCP unit number (such as T21).
SELECT DENSITY FOR WRITES (1600, 6250)

[]?

Device Integrity Tests

5-35

Enter the write density by typing (up to) four characters of the density desired (1600 for 1600 bpi).
SELECT FUNCTION (WR=WRITE,REA=READ,ER=ERASE,
LI=LIST,REW=REWIND,EX=EXIT) [J?

Enter the function by typing the characters that uniquely identify the desired function (for instance,
REA for read).
The subsequent dialog is dependent upon the function selected.
•

WRITE-The write function writes new bunches on the compatibility tape. Bunches are either
written one at a time or over the entire tape. Bunches are written from the current tape
position. If the write function is selected, the following prompts occur:
PROCEED WITH INITIAL WRITE (YN)

[NJ?

Type Y to proceed with the initial write. The default is no, in which case program control is
continued at the function selection prompt. If the response is yes, the following prompt occurs.
WRITE ENTIRE TAPE (YN)

[NJ?

Type Y if the entire tape is to be written. Writing of bunches begins at the current tape position
and continues to physical EOT. Type the default N if the entire tape is not to be written. rn this
case, only one bunch is written from the current tape position. This prompt only appears on
the initial write selection. Mter the bunch has been written, control continues at the function
selection prompt.
•

READ-The read function reads and compares the data in the bunches with an expected
(predefined) data pattern. As the reads occur, the bunch header information is displayed at the
terminal. The format of the display is shown in the following example:
BUNCH
01 WRITTEN BY TA78 SERIAL NUMBER 002965
ON A HSC SERIAL NUMBER 005993 ON 09-18-84

The number of bunches to be read is user selectable. All reads are from beginning of tape
(BOT). If the read function is selected, the following prompt appears:
READ HOW MANY BUNCHES (D)

[O=ALLJ?

Type the number of bunches to be read. The default (0) causes all bunches to be read. Mter the
requested number of bunches have been read and compared, control continues at the function
selection prompt.
•

LIST-The list function reads and displays the header of each bunch on the compatibility tape
from BOT. The display is the same as the one described under the read function. The data
contents of the bunches are not read and compared. Mter listing the tape bunch headers,
control continues at the function selection prompt.

•

ERASE-The erase function erases a user-specified number of bunches from the current tape
position toward BOT. ILTCOM backs up the specified number of tape marks and writes a second
tape mark (logical EOT). This effectively erases the specified number of bunches from the tape.
Thus, for example, if the current tape position is at bunch 5 and the user wishes to erase two
bunches, three bunches are left on the tape after the ERASE command completes.
ILTCOM does not allow the user to erase all bunches. At least one bunch must remain. For
example, with five bunches on the tape, only four bunches can be erased.
If the erase function is selected, the following prompt appears at the terminal:
ERASE HOW MANY BUNCHES FROM CURRENT POSITION (D)

[OJ?

5-36

Device Integrity Tests

Type the number of bunches to be erased. The default of 0 results in no change in tape contents
or position. Control continues at the function selection prompt.
•

REWIND-The rewind function rewinds the tape to BOT.

•

EXIT-The exit function rewinds the tape and exits the tape compatibility program ILTCOM.

5.7.5 Test Summaries
ILTCOM writes, reads, and compares compatibility tapes upon user selection. The testing that
takes place looks for compatibility of tapes written on different drives (and systems).
As incompatibilities due to data compare errors or unexpected formats are found, they are reported.
ILTCOM makes no attempt to isolate faults during execution; it merely reports incompatibilities
and other errors as they occur.

5.7.6 Error Message Example
ILTCOM conforms to the test generic error message format (Section 5.1.2). An example of an
ILTCOM error message follows:
ILTCOM>D>09:29 T 000 E 003 U-T00100
ILTCOM>D>COMMAND FAILURE
ILTCOM>D>OPTIONAL TEXT
Where:
E nnn is an error number.
U-Txxxxx indicates the Tape MSCP unit number.

The optional text is dependent upon the type of error. Some error messages contain the term object
count in the optional text. Object count refers to tape position (in objects) from BOT.

5.7.7 Error Messages
The following are the ILTCOM error messages.
•

Error 01, Initialization Failure-Tape path cannot be established due to insufficient
resources.

•

Error 02, Selected Unit Not a Tape-User selected a drive not known to the system as a
tape.

•

Error 03, Command Failure-A command failed during execution of ILTCOM. The command
in error may be one of several types (MSCP level, STI Level 2, and so forth). The failing
command is identified in the optional text of the error message. For example:
ILTCOM>D>tt:tt T 000 E 003 U-T00030
ILTCOM>D>COMMAND FAILURE
ILTCOM>D>MSCP READ COMMAND
ILTCOM>D>MSCP STATUS: nnnnnn

•

Error 05, Specified Unit Not Available-The selected unit is on line to another controller.

•

Error 06, Specified Unit Cannot Be Brought On Line-The selected unit is offline or not
available.

•

Error 07, Specified Unit Unknown-The selected unit is unknown to the HSC configuration.

•

Error 08, Unknown Status from TDUSUB-An unknown error condition returned from the
software interface TDUSUB.

Device Integrity Tests

5-37

•

Error 09, Error Releasing Drive-After completion of execution or after an error condition,
the tape drive could not successfully be returned to the system.

•

Error 10, Can't Find End of Bunch-The compatibility tape being read or listed has a bad
format.

•

Error 11, Data Compare Error-A data compare error has been detected. The ACTual and
EXPected data are displayed in the optional text of the error message. For example:
ILTCOM>D>tt:tt T 000 E 011 U-T00030
ILTCOM>D>DATA COMPARE ERROR
ILTCOM>D>EXPECTED DATA: XXXXXX ACTUAL DATA: YYYYYY
ILTCOM>D>NUMBER OF FIRST WORD IN ERROR: nnnnn
ILTCOM>D>NUMBER OF WORDS IN ERROR: mmmmm
ILTCOM>D>OBJECT COUNT = cccccc

•

Error 12, Data EDC Error-An EDC error was detected. ACTual and EXPected values are
displayed in the optional text of the error message.

5.8 ILEXER - Multidrive Exerciser
ILEXER exercises the various disk drives and tape drives attached to the HSC subsystem. The
exerciser is initiated upon demand. Drives to be tested are selected by the operator. The exerciser
issues random READ, WRITE, and COMPARE commands to exercise the drives. The results of the
exerciser are displayed on the terminal from which it was initiated.
The reports given by ILEXER do not provide any analysis of the errors reported, nor explicitly call
out a specific FRU. This is strictly an exerciser.
ILEXER runs with other processes on the HSC subsystem. It is loaded from the RX33 or TU58 and
uses the services of the Diagnostic Execution Monitor (DEMON) and the HSC control software.

5.8.1 System Requirements
In order for the ILEXER program to run, the following hardware and software items must be
available.
1. HSC subsystem:

a. Console terminal

b. P.io
c.

K.sdi, K.sti, or K.si

d. Program, Control, and Data memories
e.

RX33 (HSC) system diskette or TU58 (HSC50) system tape load device

2. SDI compatible disk drive
and/or
3. STI compatible tape drive
4. HSC system software, including:
a. HSC internal operating system

h. DEMON
c.

K.sdilK.si microcode
and/or

5-38

Device Integrity Tests

d. KstilK.si microcode
e. SDI manager
and/or
f.

STI manager or equivalent

g. Disk functional code
and/or
h. Tape functional code
1.

Error Handler

j.

Diagnostic Interface to Disk functional code
and/or

k. Diagnostic Interface to Tape functional code
Tests cannot be performed on drives if their respective interfaces are not available (K.sdi, Ksti, or
Ksi).

5.8.2 Operating Instructions
Perform the following steps to initiate ILEXER:
1.

Press CTRLIY.

2. The HSC responds with:
HSCxx>

3. Type RUN DXO:ILEXER.
DXO: refers to RX33 Drive 1. On an HSC50, DD1: refers to the TU58 Drive 1.
The system loads the program from the specified local HSC load media (any appropriate media with
the image ILEXER in an RT 11 format). When the program is successfully loaded, the following
message is displayed:
ILEXER>D>hh:mm Execution Starting
Where:
hh:mm is the current time.

ILEXER then prompts for parameters. After all prompts are answered, the execution of the test
proceeds. Error reports and performance summaries are returned from ILEXER.
When ILEXER has run for the specified time interval, reported any errors found, and generated a
final performance summary, the exerciser concludes with the following message:
ILEXER>D>hh:mm Execution Complete

Device Integrity Tests

5-39

5.8.3 Test Termination
Upon completion of the exercise on each selected drive, reporting of any errors found, and displaying
of final performance summary, ILEXER terminates normally. All resources, including the drive
being tested, are released. The operator may terminate ILEXER before normal completion by
pressing CTRLIY. The following output is displayed, plus a final performance summary:
ILEXER>D>hh:mm DIAGNOSTIC ABORTED
ILEXER>D>PLEASE WAIT -- CLEARING OUTSTANDING I/O

Certain parts of ILEXER cannot be interrupted, so the CTRLIY may have no effect for a brief
moment and may need repetition. Whenever ILEXER is terminated, whether normally or
by operator abort, ILEXER always completes any outstanding I/O requests and prints a final
performance summary.

5.8.4 Parameter Entry
The parameters in ILEXER follow the format:
PROMPT DESCRIPTION (DATATYPE)

[DEFAULT]?

"","

Where:
•

PROMPT DESCRIPTION explains the type of information ILEXER needs from the operator.

•

The DATATYPE is the form ILEXER expects and can be one of the following:
YIN-Yes/no response
D -Decimal number
U -Unit number (see form below)
H -Number (in hex)

•

DEFAULT is the value used if a carriage return is entered for that particular value. If a default
value is not allowed, it appears as [J.

The next prompt is:
DRIVE UNIT NUMBER (U)

[] ?

Enter the unit number of the drive to be tested. This prompt has no default. Unit numbers are
either in the form Dnnnn or Tnnnn, where nnnn is a decimal number between 0 and 4095 that
corresponds to the number printed on the drive's unit plug. The D or T indicates either a disk
drive or tape drive, respectively. Terminate the unit number with a carriage return. ILEXER
attempts to acquire the specified unit through the HSC Diagnostic Interface. If the unit is acquired
successfully, ILEXER continues with the next prompt. If the acquire fails with an error, one of the
following conditions was encountered:
1. The specified drive is unavailable. This indicates the drive is connected to the HSC but is
currently on line to a host CPU or HSC utility. On-line drives cannot be diagnosed. ILEXER
repeats the prompt for the unit number.

2. The specified drive is unknown to the HSC disk functional software. Drives are unknown for
one of the following reasons:
•

The drive and/or KsdilK.si port is broken and cannot communicate with the disk functional
software.

•

The drive was communicating with the HSC when a serious error occurred and the HSC
ceased communicating with the drive.

5-40

Device Integrity Tests

In either case, ILEXER asks the operator if another drive will be selected. If so, it askS for the
writ number. If not, ILEXER begins to exercise the drives selected. If no drives are selected,
ILEXER terminates.
When a disk drive is specified, one set of prompts is presented. When a tape drive is selected, an
entirely different set of prompts is presented. Pressing CTRUZ at any time during parameter input
selects the default values for the remaining parameters.

Mter a drive is selected and ILEXER has both acquired the drive and brought it on line, or if a
nondefaultable parameter is encountered, the following prompt appears:
ILEXER>D>hh:mm Nondefaultable Parameter

Select up to 12 drives to be exercised: either all disk drives, all tape drives, or a combination of the
two.

5.8.5 Disk Drive Prompts
The following prompts are presented if the drive selected is a disk drive.
ACCESS USER DATA AREA (YIN)

[N]?

Answering Y to this and the next prompt directs ILEXER to perform testing in the user data area.
It is the operator's responsibility to see that the data contained there is either backed up or of no
value. If this prompt is answered with an N or carriage return, testing is confined to the disk area
reserved for diagnostics or integrity tests (DBN area). When testing is confined to the DBN area,
the following five prompts are not displayed.
ARE YOU SURE (YIN)

[N]?

Answering N causes the DBN area to be exercised. Answering Y allows the exercise to take place
in the user data area of the disk.
DO YOU WANT BBR (YIN)

[Y]?

Answer N if the drive is suspected as bad. If you are positive the drive is good, answer Y to enable
BBR.
START BLOCK NUMBER (D)

[OJ?

This value specifies the starting block of the area ILEXER exercises when the user data area is
selected. If block 0 is specified, ILEXER begins with the first LBN on the disk.
END Block NUMBER (D)

[O=MAX]?

This parameter specifies the ending block of the area ILEXER exercises when the user data area
is selected. If block 0 is specified as the ending block, ILEXER exercises up to the last LBN on the
disk.
INITIAL WRITE TEST AREA (YIN)

[N]?

Answering Y to this prompt causes ILEXER to write the entire test area before beginning random
testing. If the prompt is answered with an N or a carriage return, the prompt immediately
following is omitted.
TERMINATE TEST ON THIS DRIVE FOLLOWING INITIAL WRITE

(YIN)

[N]?

Device Integrity Tests

5-41

This question allows an initial write on the drive and terminates the test at that point. The default
answer (N) permits this initial write. After completing the initial write, the test continues to
exercise the drive.
NOTE

The following prompts specify the test sequence for that part of the test following the
initial write portion. That is, even if the operator requests read-only mode, the drive will
not be write-protected until after any initial write has been completed.
SEQUENTIAL ACCESS (YIN)

[N]?

The operator has the option of requesting all disk data access be performed in a sequential manner.
READ ONLY (YIN)

[N]?

If answered N, the operator is asked for both a pattern number and the possibility of write-only
mode. If the answer is Y, ILEXER does not prompt for write-only mode, but only asks for a data
pattern number if an initial write was requested.
DATA PATTERN NUMBER (0-15)

(D)

[15]?

The operator has the option of selecting one of 16 disk data patterns. Selecting data pattern 0
allows selection of a pattern with a maximum of 16 words. The default data pattern (15) is the
factory format data pattern.
WRITE ONLY (YIN)

[N]?

This option permits only Write operations on a disk. This prompt is not displayed if read-only mode
is selected.
DATA COMPARE (YIN)

[N]?

If this prompt is answered with an N or a carriage return, data read from the disk is not checked;
for example, disk data is not compared to the expected pattern. If the prompt is answered with a Y,
the following prompt is issued. The media must have been previously written with a data pattern
in order to do a data compare.
DATA COMPARE ALWAYS (YIN)

[N]?

Answering a Y causes ILEXER to check the data returned by every disk Read operation. Answering
with an N or carriage return causes data compares on 15 percent of the disk reads.
NOTE

Selection of data compares significantly reduces the number of disk sectors transferred
in a given time interval.
ANOTHER DRIVE (YIN)

[]?

Answering with a Y permits selection of another drive for exercising. This prompt has no default.
Answering with an N causes ILEXER to prompt:
MINIMUM DISK TRANSFER LENGTH IN SECTORS (1 TO ,400)
MAXIMUM DISK TRANSFER LENGTH IN SECTORS (1 TO 400)

[10]?
[10J?

These prompts request the range of size in sectors of each data transfer issued to the disk drives.
The default disk transfer length is 10 sectors.
Once the preceding parameters are entered, ILEXER continues with the prompts listed as global
user prompts (Section 5.8.7).

5-42

Device Integrity Tests

5.8.6 Tape Drive Prompts
ILEXER displays the following prompts if the drive selected is a tape drive.
IS A SCRATCH TAPE MOUNTED (YIN)

[N]?

Answering N results in a reprompt for the drive unit number. Answering Y displays the next
prompt.
ARE YOU SURE (YIN)

[N]?

If the answer is N, the operator is reprompted for the drive unit number. If answered with a Y, the
following prompts are displayed.
DATA PATTERN NUMBER (16-22)

(D)

[21]?

Seven data patterns are available for tape. The default pattern (pattern 21) is defined in
Section 5.8.8.
DENSITY (1=800, 2=1600, 3=6250)

(D)

[2] ?

The response to this prompt is 1, 2, or 3. Any other response is illegal, and the prompt is displayed
again. The default is 2 or a density of 1600 bpi.
SELECT AUTOMATIC SPEED MANAGEMENT (YIN)

[N]?

Either Automatic Speed Management (if the feature is supported) or a tape drive speed is selected
at this point. If the choice is Automatic Speed Management, the available speeds are not displayed.
ILEXER>D>FIXED [VARIABLE] SPEEDS AVAILABLE:

This is an informational message identifying the speeds available for the tape drive. If the speeds
are fixed, the value is presented. If the speed is variable within a range, the range is listed, and
the next prompt asks the operator to select a speed. See the tape drive user documentation for
available speeds.
SELECT FIXED [VARIABLE] SPEED (D)

[1]?

This prompt allows selection of the variable speed for the tape drive selected. See the tape drive
user documentation for available speeds.
RECORD LENGTH IN BYTES (1 to 12288)

(D)

[8192)?

Response to this prompt specifies the size in bytes of a tape record. Maximum size is 12K bytes.
The default value is 8192, the standard record-length size for 32-bit systems. Constraints on the
HSC diagnostic interface prohibit selection of the maximum allowable record length of 64K bytes.
DATA COMPARE (YIN)

[N]?

Answering N results in no data compares performed during a read from tape. Answering Y causes
the following prompt:
DATA COMPARE ALWAYS (YIN)

[N]?

Answering Y selects data compares to be performed on every tape Read operation. Answering N
causes data compares to be performed on 15 percent of the tape reads.
ANOTHER DRIVE (YIN)

[]?

Device Integrity Tests

5-43

If answered with Y, the prompts beginning with the prompt for DRIVE UNIT NUMBER are

repeated. If answered with N, the global prompts in Section 5.8.7 are presented. This prompt has
no default, allowing the operator to default all other prompts and to be able to set up another drive
for this pass of ILEXER.

5.8.7 Global Prompts
The following prompts are presented to the operator when no more drives or drive-specific
parameters are to be entered into the testing sequence. These prompts are global in the sense
they pertain to all the drives.
RUN TIME IN MINUTES (1 TO 32767)

[10]?

The minimum time is 1 minute, and the default is 10 minutes. After the exerciser has executed for
that period of time, all testing terminates and a final performance summary is displayed.
HARD

ERROR LIMIT (D)

[20]?

The number of hard errors allowed for the drives being exercised can be specified. The limit can be
set from 0 to 20. When a drive reaches this limit, it is removed from any further exercising on this
pass of ILEXER. Hard errors include the following types of errors:
•

Tape drive BOT encountered unexpectedly

•

Invalid MSCP response received from functional code

•

UNKNOWN MSCP status code returned from functional code

•

Write attempted on write-protected drive

•

Tape formatter returned error

•

Read compare error

•

Read data EDC error

•

Unrecoverable read or write error

•

Drive reported error

•

Tape mark error (ILEXER does not write tape marks)

•

Tape drive truncated data read error

•

Tape drive position lost

•

Tape drive short transfer occurred on Read operation

•

Retry limit exceeded for a tape Read, Write, or Read Reverse operation

•

Drive went OFFLINE or AVAILABLE unexpectedly

The prompt next calls for:
NARROW REPORT (YIN)

[N]?

Answering Y presents a narrow report which displays the performance summaries in 32 columns.
The default display, selected by answering N or carriage return, is 80 columns. The format of this
display is described in further detail in Section 5.8.12. This report format is intended for use by
small hand-held terminals.
ENABLE SOFT ERROR REPORTS (YIN)

[N]?

5-44

Device Integrity Tests

Answering Y enables soft error reports. By default, the operator does not see any soft error reports
specific to the number of retires required on a tape I/O operation.
Answering N results in no soft error report. Soft errors are classified as those errors that eventually
complete successfully after explicit controller-managed retry operations. They include Read, Write,
and Read-Reverse requested retries.
DEFINE PATTERN 0 -- HOW MANY WORDS (16 MAX)

(D)

[16]?

If data pattern 0 was selected for any preceding drive, the size of the data pattern must be defined
at this time. The pattern can contain as many as 16 words (also the default). If a number larger
than 16 is supplied, an error message is displayed and this prompt is presented again. When a
valid response is presented, the following prompt is displayed the specified number of times.
DATA IN HEX (H)

[OJ?

ILEXER expects a 4 character hex value as the answer to this prompt.

5.8.8 Data Patterns
The data patterns available for use with ILEXER are listed in the following sections. Note that
pattern 0 is a user-defined data pattern. Space is available for a repeating pattern of up to 16
words.
The following are data patterns for disks:

Device Integrity Tests

Pattern 0
User Defined

Pattern 1
105613

Pattern 2
031463

Pattern 3
030221

Pattern 4
Shifting 1s
000001
000003
000007
000017
000037
000077
000177
000377
000777
001777
003777
007777
017777
037777
077777
177777

Pattern 5
Shifting Os
177776
177774
177770
177760
177740
177700
177600
177400
177000
176000
174000
170000
160000
140000
100000
000000

Pattern 6
Alter 1s,Os
000000
000000
000000
177777
177777
177777
000000
000000
177777
177777
000000
177777
000000
177777
000000
177777

Pattern 7
B1011011011011001
133331

Pattern 8
Pattern 9
B0101 .. /B1010 .. B110 ...
052525
155554
052525
052525
125252
125252
125252
052525
052525
125252
125252
052525
125252
052525
125252
052525
125252

Pattern 10
26455/151322
026455
026455
026455
151322
151322
151322
026455
026455
151322
151322
026455
151322
026455
151322
026455
151322

Pattern 11

Pattern 12
Ripple 1
000001
000002
000004
000010
000020
000040
000100
000200
000400
001000
002000
004000
010000
020000
040000
100000

Pattern 14
Manufacture
155555
133333
155555
155555
133333
155555
155555
133333
155555
155555
133333
155555
155555
133333
155555
155555

Pattern 15
Patterns
155555
133333
066666
155555
133333
066666
155555
133333
066666
155555

Pattern 13
Ripple 0
177776
177775
177773
177767
177757
177737
177677
177577
177377
176777
175777
173777
167777
157777
137777
077777

066666

133~33

066666
155555
133333
066666
155555

5-45

5-46

Device Integrity Tests

The following are data patterns for tapes:
Pattern 16
Alternating
one and zero
bits
125252
125252

Pattern 17
All ones

Pattern 18
Alternating
bytes of all
ones

Pattern 19
Alternating
bytes of all
ones and all
zeros

Pattern 20
Alternating
two bytes
ones and two
bytes zeros

Pattern 21
Alternating
four bytes
ones and four
bytes zeros

Pattern 22
Alternating
three bytes of
ones and one
byte zeros

Pattern 23
Alternating
bytes of ones
and zeros with
high byte in
pattern number
also zero*

*Pattern 23 is used with odd record sizes.

5.8.9 Setting/Clearing Flags
The Enable Soft Error Report display prompt in Section 5.8.7 allows the operator to inhibit the
display of soft error reports. No other error reports can be inhibited.

5.8.10 Progress Reports
ILEXER has three basic forms of progress reports: the Data Transfer error report, the performance
summary, and the Communication error report.
1. The Data Transfer error report is printed each time an error is encountered in one of the drives

being tested.
2. The Performance summary is printed when ILEXER completes a pass on each drive being
exercised or when the operator terminates the pass through a CTRLIY. This Performance
summary also is printed on a periodic basis during the execution of ILEXER.
3. The Communication error report is sent to the console terminal any time ILEXER is unable to
establish and maintain communications with the drive selected for exercising.

5.8.11 Data Transfer Error Report
The ILEXER Data Transfer error report is printed on the terminal each time a data transfer error
is found during execution of ILEXER. The report describes the nature of the error and all data
pertinent to the error found. The Data Transfer error report is a standard HSC error log message.
It contains all data necessary to identify the error. The only exception to this is when the error
encountered by ILEXER is a data compare error. In this case, ILEXER has performed a check and
found an error during the compare, resulting in an ILEXER error report.

5.8.12 Performance Summary
The Performance summary is printed on the terminal at the end of a manually terminated testing
session, or after the specified number of minutes for the periodic Performance summary. This report
provides statistical data which is tabulated by ILEXER during the execution of this test.
The Performance summary presents the statistics which are maintained on each drive. This
summary contains the drive unit number, the drive serial number, the number of position
commands performed, the number of 0.5 Kbytes read and written, the number of hard errors,
the number of soft errors, and the number of software correctible transfers. For tape drives being
exercised by ILEXER, an additional report breaks down the software correctible errors into eight
different categories.

Device Integrity Tests

5-47

The frequency of report display is altered in the following fashion:
1.

Press CTRL/G during the execution of ILEXER.

2. The following prompt is displayed:
Interval time for performance summary in seconds (D)

[30]?

The format of the Performance summary follows:
PERFORMANCE SUMMARY (DEFAULT)
UNIT
NO
Dddd
Tddd

R

SERIAL
NUMBER

POSI
TION

KBYTE
READ

KBYTE
WRITTEN

HARD SOFT SOFTWARE
ERROR ERROR CORRECTED

HHHHHHHHHHH ddddd dddddddddd dddddddddd ddddd ddddd
HHHHHHHHHHH ddddd dddddddddd dddddddddd ddddd ddddd

ddddd
ddddd

A Performance summary is displayed for each disk drive and tape drive active on the HSC. The
following list explains the performance summary:
•

Unit Number-The unit number of the drive. D is for disk, T is for tape. The nUmber is
reported in decimal.

•

R--The status of the drive. If an asterisk (*) appears in this field, the drive was removed
from the test and the operator was previously informed. If the field is blank, the drive is being
exercised.

•

Serial Number-The serial number (in hex) for each drive.

•

Position-The number of seeks.

•

Kbyte Read-The number of Kbytes read by ILEXER on each drive.

•

Kbyte Written-The number of Kbytes written by ILEXER.

•

Hard Error-The number of hard errors reported by ILEXER for a particular drive.

•

Soft Error-The number of soft tape errors reported by the exerciser if enabled by the operator.

•

Software Corrected-The number of correctible ECC errors encountered by ILEXER. Only
ECC errors above the specific drive ECC error threshold are reported through normal functional
code error reporting mechanisms. ECC errors below this threshold are not reported through an
error log report, but are included in this count maintained by ILEXER.

If any tape drives are exercised, the following summary is displayed within each performance
summary:
UNIT
NO

MEDIA
ERROR

DOUBLE
TRKERR

DOUBLE
TRKREV

SINGLE
TRKERR

SINGLE
TRKREV

Tddd

ddddd

ddddd

ddddd

ddddd

ddddd

OTHER OTHER
ERR A ERR B

OTHER
ERR C

ddddd

ddddd

ddddd

An explanation of the summary columns follows:
•

Media Error-The number of bad spots detected on the recording media.

•

Double TRKERR-The number of double-track errors encountered during a read or write
forward.

•

Double TRKREV-The number of double-track errors encountered during a read reverse or
write reverse.

•

Single TRKERR-The number of single-track errors detected during a read or write in the
forward direction.

5-48

Device Integrity Tests

•

Single TRKREV-The number of single-track errors encountered during a read reverse or
write reverse.

•

Other Err A-C-Reserved for future use.
PERFORMANCE SUMMARY (NARROW)
ILEXER>O>PER SUM
O[T]ddd
SN HHHHHHHHHHHH
P ddddd
R dddddddddd
W dddddddddd
HE ddddd
SE ddddd
SC ddddd

This report is repeated for each drive tested.
If tape drives are being tested, the following report is issued for each tape drive following the disk
drive performance summaries:
ILEXER>O>ERR SUM
ILEXER>O>Tddd
ILEXER>O>ME ddddd
ILEXER>O>OF ddddd
ILEXER>O>OR ddddd
ILEXER>O>SF ddddd
ILEXER>O>SR ddddd
ILEXER>O>OA ddddd
ILEXER>O>OB ddddd
ILEXER>O>OC ddddd

5.8.13 Communications Error Report
Whenever ILEXER encounters an error that prevents it from communicating with one of the drives
to be exercised, ILEXER issues a standard error report. This report gives details enabling the
operator to identify the problem. For further isolation of the problem, the operator should run
another test specifically designed to isolate the failure (ILDISK or ILTAPE).

5.8.14 Test Summaries
The test numbers in ILEXER correspond to the module being executed within ILEXER itself. The
main module is called MDE, and it calls all other modules.

•

Test number It Main Program: MDE-Multidrive Exerciser is the main program within
ILEXER. It is responsible for calling allnther portions of ILEXER. It obtains the buffers and
control structures for the exerciser. It verifies that disk or tape functionalities are available
before allowing ILEXER to continue.

•

Test number 2t INITI-INITT is called to initialize drive statistic tables. It obtains the
parameters and verifies the values of each one entered. This routine calls INICOD to obtain
drive-specific parameters.

•

Test number 3 t INICOD-INICOD is the initialization code for ILEXER. It gets the various
parameters for the drives from the operator and fills in the drive statistic tables with initial
data for each drive. It also verifies the validity of the input for the parameters. INICOD, in
turn, calls ACQUIRE to acquire the disk and/or tape drive.

•

Test number 4 t ACQUIRE-ACQUIRE is responsible for acquiring the drives as specified by
the operator. It brings all selected drives on line to the controller and spins up the disk drives.
Errors reported in this routine cause the removal of the drive from the exercise.

Device Integrity Tests

5-49

•

Test number 5, INITD-INITD initializes the disk drives for the exercise. This routine clears
all disk access control blocks and invokes the initial write.

•

Test number 6, TPINIT-TPINIT initializes the tape drives for the exercise. It rewinds all
acquired tape drives and verifies the drives are at the BOT. If an error occurs, the drive is
removed from the exerciser. TPINIT is also responsible for obtaining buffers for each acquired
tape drive.

•

Test number 7, Exerciser-EXER is the main code of the exerciser. It dispatches to the disk
exerciser (QDISK and CDISK) and the tape exerciser (TEXER). It continuously queues up I/O
commands to disk and tape, and checks for I/O completion. The subroutines EXER calls are
responsible for sending commands and checking. for I/O completion.

•

Test number 8, QDISK-QDISK is part of the disk exerciser that selects commands to send
to the disk drives. If the initial write is still in progress, it returns to EXER. QDISK calls a
routine to select the command to exercise the disk drive. The following scenario is the algorithm
used to select the command:
a. If the drive is read only and data compare is not requested, a Read operation is queued to
the drive.
b. If read only and data compare (occasional) are requested, a Read operation is queued along
with a random choice of compare/not-compare.
c.

If read only and data compare (always) are requested by the operator, a READ-COMPARE
command is queued to the drive.

d. If write only is requested, and data compare is not, then a write request is queued up to the
disk drive.
e.

If write only and data compare (occasional) are requested, a Write operation is queued along
with a random choice of compare/not-compare.

f.

If write only and data compare (always) are requested, a WRITE-COMPARE command is
queued to the drive.

g. If only data compare (occasional) is requested, then a random selection of read/write and
compare/not-compare is done.
h. If only data compare (always) is requested, a COMPARE command is paired with a random
selection of read/write.
QDISK randomly selects the number of blocks for the selected operation.
•

Test number 9, RANSEL-RANSEL is the part of the tape exerciser that is responsible for
sending commands to the tape drives. This routine is called by TEXER, the tape exerciser
routine. RANSEL selects a command for a tape drive using a random number generator.
Following are some constraints for the selection process:
a. No reads when no records exist before or after the current position.
h. No writes when records exist after the current position.
c.

No position of record when no records exist before or after the current position.

d. Reverse commands are permitted on the drive when 16 reverse commands previously
have been selected. That is, lout of every 16 reverse commands are sent to the drive.
Immediately following a reverse command, a position to the end-of-written-tape is
performed. The reason for forward biasing the tape is to prevent thrashing.
The following commands are executed in exercising the tape drives:
1. READ FORWARD

2. WRITE FORWARD

5-50

Device Integrity Tests

3. POSITION FORWARD
4. READ REVERSE

5. REWIND
6. POSITION REVERSE
RANSEL randomly selects the number of records to read, write, or skip.
•

Test number 10, CDISK-CDISK checks for the completion of disk 110 specified by QDISK.
CDISK checks the return status of a completed 110 operation and if any errors occur, they are
reported.

•

Test number 11, TEXER--TEXER is the main tape exerciser which selects random writes,
reads, and position commands. TEXER processes the I/O once it is completed and reports any
errors encountered.

•

Test number 12, EXCEPT-EXCEPT is the ILEXER exception routine. This is the last
routine called by MDE. EXCEPT is called when a fatal error occurs, when ILEXER is stopped
with a CTRUY, or when the program expires its allotted time. It cleans up any outstanding
110, as necessary, returns resources, and returns control to DEMON.

5.8.15 Error Message Format
ILEXER outputs four types of error formats: prompt errors, data compare errors, pattern word
errors, and communication errors. These formats agree with the generic test error message format
(Section 5.1.2).
5.8.15.1 Prompt Error Format
Prompt errors occur when the operator enters the wrong type of data or the data is not within the
specified range for a parameter. The general format of the error message is:
ILEXER>D>error message

The error message is an ASCII string describing the type of error discovered.
5.8.15.2 Data Compare Error Format
A data compare error occurs when an error is detected during the exercise of a particular drive.

The two formats for the data compare error are data word compare error and pattern word error.
A data word compare error occurs when the data read does not match the expected pattern. The
format of the data compare error is:

Device Integrity Tests

5-51

ILEXER>D>hh:mm T ddd E ddd U-uddd
ILEXER>D>Error Description
ILEXER>D>MA -- HHHHHHHHHH
ILEXER>D>EXP -- HHHH
ILEXER>D>ACT -- HHHH
ILEXER>D>MSCP STATUS CODE = HHHH
ILEXER>D>FIRST WORD IN ERROR = ddddd
ILEXER>D>NUMBER OF WORDS IN ERROR = ddddd
Where:
hh:mm is the current system time.
T is the test number in the exerciser.
E corresponds to the error number.
U is the unit number for which the error is being reported.
MA is the media address (block number) where the error occurred.
EXP is the EXPected data.
ACT is the data (or code) actually received.
MSCP STATUS CODE is the code received from the operation.
FIRST WORD IN ERROR describes the number of the first word
found in error.
NUMBER OF WORDS IN ERROR -- Once an error is found, the routine
continues to check the remainder of the data returned and counts
the number of words found in error.

5.8.15.3 Pattern Word Error Format
The format for the pattern word error is slightly different from the data word compare error. A
pattern word error occurs when the first data word in a block is not a valid pattern number. The
format is:
ILEXER>D>hh:mm T ddd E ddd U-uddd
ILEXER>D>Error Description
ILEXER>D>MA -- HHHHHHHHHH
ILEXER>D>EXP
HHHH
ILEXER>D>ACT -- HHHH

The MSCP status code, first word in error, and number of words in error are not relevant for this
type of error. The other fields are as described for the data compare error.
5.8.15.4 Communications Error Format
Communications errors occur when ILEXER cannot establish/maintain communications with a
selected drive. The error message appears in the following format:
ILEXER>D>hh:mm T ddd E ddd U-uddd
ILEXER>D>Error Description
ILEXER>D>Optional Data lines follow here
Where:
hh:mm is the time stamp for the start of ILEXER.
T is the test number in the exerciser.
E corresponds to the error number.
U is the unit number for which the error is being reported.
Error Description is an ASCII string describirig the
error encountered.
Optional Data lines -- A maximum of eight optional lines per report.

5-52

Device Integrity Tests

5.8.16 Error Messages
The following section lists the informational and error messages and explains the cause of the error.
A typical error message is:
ILEXER>D>09.32 T*006 E*204 U-T00100
ILEXER>D>Comm Error: TBUSUB call failed

5.8.16.1 Informational Messages
The informational messages are not fatal to the exerciser and are intended only to:

•

Alert the user to incorrect input to parameters

•

Indicate missing interfaces

•

Provide user information

The following list describes informational messages.
•

Number Must Be Between 0 and IS-Reported when the user entered an erroneous value
for the data pattern on a disk.

•

Pattern Number Must Be Within Specified Bounds-Reported when the operator tries to
specify a disk pattern number for a tape.

•

You May Enter at Most 16 Words in a Data Pattern-Reported if the operator specifies
more than 16 words for a user-defined pattern, and the operator is reprompted for the value.

•

Starting LBN Is Either Larger than Ending LBN or Larger than 'IOtal LBN on DiskReprompts for the correct values. The operator selected a starting block number for the test
which is greater than the ending block number selected, or it is greater than the largest block
number for the disk.

•

Please Mount a Scratch Tape-Appears after an N response to the prompt asking if the
scratch tape is mounted on the tape drive to be tested.

•

Disk Interface Not Available-Indicates the disk functionality is not available to exercise
disk drives. This means the K.sdilK.si is not available or not operable.

•

Tape Interface Not Available-Indicates the tape functionality is not available to exercise
tape drives. This means the K.stilK.si is not available or not operable.

•

Please Wait-Clearing Outstanding I/O-Printed when the operator presses CTRUY to stop
ILEXER. All outstanding 110 commands are aborted at this time.

5.8.16.2 Generic Errors
The following list indicates the error number, text, and cause of errors displayed by ILEXER.

•

Error 01, No Disk or Tape Functionality••.Exerciser Terminated-Neither the K.sdi,
Ksti, nor K.si interfaces are available to run the exercise. This terminates ILEXER.

•

Error 02, Could Not Get Control Block for Timer-Stopping n,EXERr-ILEXER could
not obtain a transmission queue for a timer. This should occur only on a heavily loaded system
and is fatal to ILEXER.

•

Error 03, Could Not Get Timer-Stopping ILEXERr-The exerciser could not obtain a timer.
Two timers are required for ILEXER. This should only occur on a loaded system and is fatal to
ILEXER.

•

Error 04, Disk Functionality Unavailable-Choose Another Drive-The disk interface is
not available. A previous message is printed at the start of ILEXER if any of the interfaces are
missing. This error prints when the operator still chooses a disk drive for the exercise.

Device Integrity Tests

5-53

•

Error 05, Tape Functionality Unavailable-Choose Another Drive-The tape interface is
not available. A previous message is printed at the start of ILEXER if any of the interfaces are
missing. This error prints when the operator still chooses a tape drive for the exercise.

•

Error 06, Couldn't Get Drive Status-Choose Another Drive-ILEXER was unable to
obtain the status of a drive for one of the following conditions:
1. The drive is not communicating with the HSC. Either the formatter or the disk is not on
line.
2. The cables to the Ksdi, K.sti, or Ksi are loose.

•

Error 07, Drive Is Unknown-Choose Another Drive-The drive chosen for the exerciser
is not known to the HSC functional software for that particular drive type. Either the drive is
not communicating with the HSC, or· the functional software has been disabled due to an error
condition on the drive.

•

Error 08, Drive Is Unavailable--Choose Another Drive-This may be the result of:
1. The drive port button is disabled for that port.
2. The drive is on line to another controller.
3. The drive is not able to communicate with the controller on the port selected.

•

Error 09, Drive Cannot Be Brought On Line-ILEXER was unable to bring the selected
drive on line. One of the following conditions occurred:
1. The unit went into an Off-line state and cannot communicate with the HSC.
2. The unit specified is now being used by another process.
3. There are two drives of same type with duplicate unit numbers on the HSC.
4. An unknown status was returned from the HSC diagnostic interface when ILEXER
attempted to bring the drive on line.

•

Error 12, Could Not Return Drive to Available State-The release of the drive from
lLEXER was unsuccessful. This is the result of a drive being taken from the test due to
reaching an error threshold or going off line during the exercise.

•

Error 13, User Requested Write on Write-Protected Unit-The operator should check the
entry of parameters and also check the write protection on the drive to make sure they are
consistent.

•

Error 14, No Tape Mounted on Unit...Mount and Continue-The operator specified a
scratch tape was mounted on the tape drive selected when it was not mounted. Mount a tape
and continue.

•

Error 15, Record Length Larger than 12K or 0 - The record length requested for the
transfer to tape was either greater than 12K or O.

•

Error 16, This Unit Already Acquired-A duplicate unit number was specified for a drive
and the drive has already been acquired.

•

Error 18, Invalid Time EnterecL ••Must Be from 1 to 3599-The user entered an erroneous
value to the performance summary time interval prompt.

•

Error 20, Could Not Get Buffers for Transfers-The buffers required for a tape transfer
could not be acquired.

•

Error 21, Tape Rewind Commands Were Lost - Cannot Continue-The drive was
unloaded during ILEXER execution.

5-54

Device Integrity Tests

5.8.16.3 Disk Errors

The following list includes the error number, text, and cause of ILEXER disk errors.
•

Error 102, Drive Spindle Not Up to Speed-Spin Up Drive and Restart-The disk drive
is not spun up.

•

Error 103, Drive No Longer Exercised-A disk drive reached the hard error limit or the
drive went off line to the HSC during the exercise.

•

Error 104, Couldn't Put Drive in DBN Space - Removed from Test-An error or
communication problem occurred during the delivery of an SDI command to put the drive
in DBN space.

•

Error 105, No DACB Available-Notify Customer Service, Submit SPR-This is reported
if no DACBs can be acquired. If this happens, contact Customer Service as soon as possible and
submit an SPR.

•

Error 106, Some Disk I/O Failed to Complete-An 1/0 transfer did not complete during an
allotted time period.

•

Error 107, Command Failed-Invalid Header Code-ILEXER did not pass a valid header
code to the diagnostic interface for the HSC.

•

Error 108, Command Failed-No Control Structures Available-The diagnostic interface
could not obtain disk access control blocks to run the exercise. The HSC could be overloaded.
Try ILEXER on a quiet system. If the error still occurs, test the HSC memory.

•

Error 109, Command Failed-No Buffer Available-The diagnostic interface could not
obtain buffers to run the exercise. The HSC could be overloaded. Try ILEXER on a quiet
system. If the error still occurs, test the HSC memory.

•

Error 111, Write Requested on Write-Protected Drive-The operator requested an initial
Write operation on a drive that was already write-protected. The operator should pop out the
write-protect button on the drive reporting the error or have ILEXER do a read-only operation
on the drive.

•

Error 112, Data Compare Error-Bad data was detected during a Read operation.

•

Error 113, Pattern Number Error-The first two bytes of each sector, which contain the
pattern number, did not match.

•

Error 114, EDC Error-Error Detection Code error: invalid data was detected during a Read
operation.

•

Error 116, Unknown Unit Number Not Allowed in U,EXER-The operator attempted to
enter in a unit number of the form Xnnnn, which is not accepted by ILEXER.

•

Error 117, Disk Unit Numbers Must Be Between 0 and 4094 decimal-The operator
specified a disk unit number out of the allowed range of values.

•

Error 118, Hard Failure on Disk-A hard error occurred on the disk drive being exercised.
NOTE

The following disk errors identify the function attempted by IT,EXER that caused an
error to occur. Error logs do not indicate the operation attempted.
•

Error 119, Hard Failure on Compare Operation-A hard failure occurred during a compare
of data on the disk drive.

•

Error 120, Hard Failure on Write Operation-A hard fault occurred during a Write
operation on the specified disk drive.

.•

Error 121, Hard failure on Read Operation-A hard failure occurred during a Read
operation on the disk drive being exercised.

Device Integrity Tests

5-55

•

Error 123, Hard Failure on INITIAL WRITE Operation-A hard failure occurred during
the first write to the disk drive.

•

Error 124, Drive No Longer On Line-A drive that was being exercised went into an
Available state. This could be caused by the operator releasing the port button on the drive. A
fatal drive error could also cause the drive to go into this state.

5.8.16.4 Tape Errors
The following list includes the error number, text, and cause of ILEXER tape errors.

•

Error 201, Couldn't Get Formatter Characteristics-A communication problem with the
drive is indicated. It could be caused by the unit not being on line.

•

Error 202, Couldn't Get Unit Characteristics-The drive is not communicating with
ILEXER. The unit could be off line.

•

Error 203, Some.Tape 110 Failed To Complete-The drive or formatter stopped functioning
properly during a data transfer.

•

Error 204, Comm Error: TDUSUB Call Failed-ILEXER cannot communicate with the
drive through interface structures. They have been removed. Either the drive went available
from on line, the drive is offline, or there is a fault.

•

Error 205, Read Data Error-A Read operation failed during a data transfer, and none was
transferred.

•

Error 206, Tape Mark Error...rewinding to restart-ILEXER does not write tape marks. If
this error occurs, it indicates a drive failure.

•

Error 207, Tape Position Lost...rewinding to restart-An error occurred during a data
transfer or a retry of one.

•

Error 209, Data Pattern Word Error Defect-The first two bytes of a record containing the
data pattern did not match.

•

Error 210, Data Read EDC Error-Error Detection Code error; incorrect data was detected.

•

Error 211, Could Not Set Unit Char..•removing from test-The drive is offline and not
communicating.

•

Error 213, Truncated Record Data Error•••rewinding to restart-More data was received
than expected, indicating a drive problem.

•

Error 214, Drive Error...Hard Error-A hard failure occurred with the drive being exercised.

•

Error 215, Unexpected Error Condition.••removing drive from test-This is caused by
MSCP error conditions, which are not allowed (invalid commands, unused codes, write-protected
drive write, and so forth).

•

Error 216, Unexpected BOT Encountered.•.will try to restart-The drive is experiencing
a positioning problem.

•

Error 217, Unrecoverable Write Error.••rewinding to restart-A hard error occurred
during a Write operation. The write did not take place due to this error.

•

Error 218, Unrecoverable Read Error.••rewinding to restart-A hard error occurred
during a Read operation and a data transfer did not take place.

•

Error 219, Controller Error...Hard Error•.rewinding to restart-A communications
problem exists between the controller and the formatter.

•

Error 220, Formatter Error••.Hard Error-A communications problem exists between the
formatter and the controller and/or drive.

5-56

Device Integrity Tests

•

Error 221, Retry Required on Tape Drive-A failed ReadlWrite operation required a retry
before succeeding.

•

Error 222, Hard Error Limit Exceeded. ..removing drive from test-The drive exceeded
the threshold of hard errors determined by a global user parameter (Section 5.8.7). The drive is
then removed from the exercise.

•

Error 224, Drive Went Off Line...removing from test-The drive went off'line during the
exercise. This is caused by the operator taking the drive off line or a hard failure forcing the
drive off line.

•

Error 225, Drive Went Available...removing from test-The drive became available to
ILEXER and was not at the beginning of the exercise.

•

Error 226, Short Transfer Error...rewinding to restart-Less data was received than
transferred.

•

Error 227, Tape Position Discrepancy-The tape position was lost, indicating a hard failure.

Off-line Diagnostics

6-1

6
Off-line Diagnostics
6.1

Introduction

This chapter describes the off~line diagnostics, how to run them, errors that can occur, and
summaries of th~ tests in each diagnostic. Included in the off-line diagnostics are:
•

ODL-Off-line diagnostics loader

•

OFLCXT-Off-line cache test (HSC only)

•

OBIT-Off-line bus interaction test

•

OKTS-Off-line K test selector

•

OKPM-Off-line KIP memory test

•

OMEM-Off-line memory test

•

OFLRXE-Off-line RX33 exerciser (HSC only)

•

ORFT-Off-line refresh test

•

OOCP-Off-line operator control panel (OCP) test

The off-line diagnostics contain specific common characteristics, which are discussed in the following
three sections. These characteristics are listed below:
•

Identical software requirements

•

Common load procedure

•

Identical bootstrap initialization procedures

•

Generic error message format

6.1.1 Software Requirements
All off-line diagnostics require boot media containing a bootable image of the diagnostics software
programs. For an HSC, an RX33 off-line diagnostic diskette is required. For an HSC50, a TU5S
off-line diagnostic tape cassette is required.

6.1.2 Off-line Diagnostics Load Procedure
For the HSC, the off-line diagnostics diskette boots from either RX33 drive and should not be writeenabled. This diskette contains the necessary software to run all the HSC off-line diagnostics.
Booting is done either by powering on or by pressing and releasing the Init switch with the
SecurelEnable switch in the enable position. This causes the P.ioj ROM bootstrap tests to run
followed by the off-line P.ioj test.

6-1

6-2

Off-line Diagnostics

The off-line diagnostics TU58 cassette boots from either TU58 drive and should not be writeenabled. This TU58 contains the necessary software to run all the HSC50 off-line diagnostics.
Booting is accomplished either by powering on or by pressing and releasing the Init switch with
the SecurelEnable switch in the enable position. This causes the P.ioc ROM bootstrap tests to run
followed by the off-line P.ioc test.
NOTE
For off-line diagnostics, the HSe must be booted with the SecurefEnable switch in the
enable position. If a hardware error occurs during boot, the software executes a halt
instruction on certain errors. A halt instruction, even in Kernel mode, is valid only if the
SecurefEnable switch is in the enable position. Otherwise, the result can be an illegal
instruction trap in addition to the error causing the halt.

In order for the bootstrap to complete successfully, the following must be operational:
•

Basic instruction set of the PDP-11

•

First 2048 bytes of program memory plus 8 Kwords of contiguous Program memory below
address 160000

•

RX.33 controller and at least one RX33 drive containing a diskette with a bootable image for the

HSC
•

TU58 controller and at least one TU58 drive containing a cassette with a bootable image for the
HSC50

Before control is turned over to the HSC bootstrap ROMs, internal microcode tests execute in
the J11 (HSC) or F11 (HSC50) chip sets. Refer to Table 2-1 for definitions of the J111F11 module
(P.ioj/c) LEDs.

6.2 ROM Bootstrap
The P.ioj/c ROM bootstrap verifies the basic integrity of the P.ioj/c module, part of the Program
memory, and the boot device. The goal of the bootstrap tests is to test enough of the HSC to allow
further test loading from the boot device.
The bootstrap test is the first step in the HSC initialization process. It is run for every bootstrap or
reload of the HSC operating system (CRONIC). The bootstrap is initiated automatically each time
the HSC is powered on and also is initiated by CRONIC when a software reboot is required.
The bootstrap is a PDP-11 program written to execute in a DCJ11IDCF11 CPU in a standalone
environment. This means no other software processes coexist with the bootstrap.
Bootstrap failures are reported through the fault lamp mechanism, which specifies the module
most likely causing the problem. See Figure 4--3 for the fault code definitions. An error table is
maintained in Program memory addresses 00000400 through 00000412. These addresses contain
the reasons for each load device boot failure.

6.2.1 Initialization Instructions
The following procedure lists the operating instructions for the P.ioj/c ROM bootstrap. Refer to
Section 6.2.4 if this procedure fails.
1. HSC-Insert the off-line diagnostics diskette with a bootable image into the RX33 unit 0 drive
Oeft-hand drive).

2. HSC50-Insert the off-line diagnostics tape with a bootable image into either of the TU58
drives.
3. Turn power ON.

Off-line Diagnostics

6-3

4. Set the SecurelEnable switch to the enable position, then press the Init switch. The bootstrap
initiates automatically.
At this point, the P.ioj/c module executes internal microdiagnostics and then begins to execute from
the boot ROM. The Init lamp lights on the HSC operator control panel (OCP) when the bootstrap
PDP-II tests are done. The load device drive-in-use LED lights within 8 to 10 seconds, indicating
the bootstrap is attempting to load software into Program memory. If the load is successful, the
bootstrap transfers control to the first instruction of the image just loaded from the diskette.

6.2.2 Failures
Most bootstrap failures result in lighting the fault lamp on the HSC OCP. When this happens, press
the Fault switch momentarily, and read the failure code displayed in the OCP lamps. Section 6.2.5
indicates the HSC modules most likely causing the bootstrap failure. Momentarily pressing the Init
switch on the OCP reinitiates the bootstrap.
The microdiagnostic LEDs on the JI11FII module indicate if a hard fault exists causing the JIIIFI1
to hang before control is passed the boot ROM. Section 6.2.5 contains an explanation of these LEDs.
If a failure occurs in the tests of the PDP-II basic instruction set, the fault lamp mechanism does
not report the failure. Instead, the PDP-II executes a Branch dot (BR .) and does not continue the
bootstrap program. A failure of this type is easily detected because the Init lamp does not light.
(The Init lamp does light immediately after the basic PDP-1I tests successfully complete.)
When a console terminal is connected to the P.ioj/c, the exact instruction that failed is determined
by pressing the terminal break key and noting the address displayed on the terminal. With a
bootstrap listing, this address indicates the instruction that failed.
NOTE

The bootstrap does not accept user-modifiable flags.

6.2.3 Progress Reports
The bootstrap does not issue progress reports in the usual sense; however, certain indications of
bootstrap. progress are evident. These indications are given in the following list:
•

Lamps clear-Clears all of the HSC OCP lamps. If the lamps fail to clear immediately after
the bootstrap is initiated, a failure of the P.ioj/c is probable. (Circuitry on the P.ioj/c module is
responsible for initiating the bootstrap program.)

•

Init lamp-Lights as soon as the basic tests of the PDP-II instruction set are finished. These
tests normally complete within milliseconds after the bootstrap is initiated. Failure of the lnit
lamp to light indicates a failure in the P.ioj/c PDP-II processor.

•

RX33 drive-in-use-Lights as the bootstrap tries to load the lnit P.io test (or off-line P.ioj test)
from the RX33 following the test of the PDP-II and Program memory.

•

State lamp-Lights when the bootstrap completes and initiates the lnit P.ioj/c test (or off-line
P.ioj/c test). When the State lamp is ON, the lnit lamp is OFF.

•

Fault lamp-Lights during the boot process if the ROM bootstrap tests have detected a fatal
error.

6-4

Off-line Diagnostics

6.2.4 Error Information
Specific error codes for the P.ioj/c bootstrap (Codes 21, 22, and 23) are described in detail in
Chapter 4.
Because the bootstrap operates in a standalone environment, it does not use the terminal as an
error-reporting mechanism. Instead, the HSC OCP lamps are used to report errors and to indicate
the module most likely causing the error.
When the bootstrap detects an error, it lights the fault lamp on the OCp. When the Fault switch is
pressed, the bootstrap displays a failure code in the OCP lamps. The failure code blinks on and off
at one-half second intervals.

6.2.5 Failure Troubleshooting
The ODT program (built into the PDP-II microcode) contains further information about bootstrap
failures. This information iE' shown in the following list:
•

Init is off, Fault is lit-A failure was detected after control was passed to the bootable image
loaded from the diskette.

•

Init and Fault both lit-The fault code displays when the fault lamp is momentarily pressed.
The program is halted by pressing the break key on the console terminal. If 17772340 is typed,
ODT responds by displaying the contents of address 17772340, the test number. Use the test
number to refer to the appropriate test in Section 6.2.6.

•

Init and Fault lamps are both off-Either the bootstrap program was not automatically
initiated or the bootstrap PDP-II instruction test failed.
Before proceeding, ensure the SecurelEnable switch is set to the enable position. If the
switch was not in the enable position when the Init switch was pressed, the HSC did not
initiate its boot sequence. If the SecurelEnable switch is in the correct position, the JI11Fli
microdiagnostics may have failed.
To check the microdiagnostics, remove the card cage cover and examine the four LEDs on the
central edge of the JIIlFll module. At powerup, set all the LEDs and then turn them off as the
JI11Fli proceeds through its microdiagnostic sequence.

6.2.6 Bootstrap Test Summaries
This section summarizes the bootstrap tests.

•

Test 0, Basic PDP-II Instruction Set-This test verifies the correct operation of a PDP11 instruction subset. This instruction subset includes only those instructions required for
completion of the bootstrap. The following instructions are tested:
a. Single operand instructions (both word and byte mode):
ADC, CLR, COM, INC, DEC, NEG, TST, ROR, ROL, ASR, ASL, SWAB, Nap

h. Double operand instructions (both word and byte modes):
MOV, CMp, BIT, BIC, BIS, ADD, SUB
c.

Branch instructions:
BR, BNE, BEQ, BPL, BMI, BCC (BHIS), BCS (BLO), BGE, BLT, BGT, BLE, BHI, BLOS,
BVC, BVS

d. Jump and miscellaneous instructions:
JMp' JSR, RTS, SOB, MTPS, MFPS, CCC, CLN, CLY, CLZ, SEN, SEY, SEZ

e. Addressing modes:

Off-line Diagnostics

6-5

All eight addressing modes
The PDP-II instruction set test uses two methods of reporting errors. During the initial
part of the test, errors result in an infinite program loop at the location of the detected error.
During the latter part of the test (when enough instructions have been tested), the fault lamp
mechanism is used to report failures. Refer to Section 6.2.2.
•

Test It Program Memory (Swap Bank)-The memory (Swap Bank) HSC memory module
includes special logic that permits changing the address range of Program memory. This
address range is controlled by the Swap Banks bit in the P.ioj/c control and status register
(CSR). This test verifies the Swap Banks bit can be set and cleared. (The actual memory
switching is not tested, only the setting and clearing of the bit is tested.) A failure in this test
indicates the P.ioj/c module must be replaced.

•

Test 2t Program Memory (Vector Area)-In order for the HSC control program to function,
the first 2048 bytes (addresses 00000000 through 00003777) of Program memory must be
working. This test verifies the first part of Program memory is operating properly. If the
test fails, the Swap Banks feature is used, attempting to swap a portion of memory into the
00000000 through. 00093777 address range. If the test still fails after Swap Banks has been
invoked, a Program memory error is reported through the fault lamp mechanism (Section 6.2.2).
A failure in this test indicates the M.std2fM.std module must be replaced.

•

Test 3 t Program Memory (8-Kword Partition)-Mter verifying the first part of Program
memory is working, the bootstrap tries to find an 8-Kword piece of Program memory between
address 00004000 and address 00160000. This partition is used to load the Init P.ioj/c test
from the load device. If insufficient memory is available, a Program memory error is reported
through the fault lamp mechanism.
A failure in this test indicates the M.std2fM.std module must be replaced.

•

Test ~ RX33 Controller Test-This test verifies basic functionality of the control logic on the
M.std2 module. The four controller registers are tested for stuck bits. The DMA hardware is
checked for correct cycling and addressing. The interrupt logic is checked to ensure interrupts
are properly acknowledged. With the control hardware verified, proceed to the next step, and
try to read data from one of the drives.

•

Test 5 t RX33 DrivelInterface Test-The goal of this test is to find a working RX33 drive
containing a diskette with a bootable image. Such an image is identified by a PDP-II NOP
instruction in the first word of the image. The intended drive is checked for DRIVE READY
from the interface. Then RECALIVERIFY commands the drive to seek to track O. This
command then reads the diskette header to verify the RECAL did move the head to track

O.

Mter a suitable drive is found, the first eight blocks of the diskette are loaded into the 8-Kword
partition found in test 3. The eight blocks loaded consist of the first five blocks of the lnit P.ioj/c
test (or Off-line P.ioj/c test), the RT-ll volume ID block, and the first RT-ll directory segment
on the diskette. (The directory blocks are loaded at this time to save directory look-up time in
the Init P.ioj/c test or the Off-line P.ioj/c test.)
RX33 drive 0 is tested first. A failure with drive 0 causes the bootstrap to proceed to drive 1 and
begin the tests again. If neither RX33 drive is working correctly, an RX33 error is displayed by
the fault lamps. An error table is maintained in Program memory addresses 00000400 through
00000412, which remembers why each rejected RX33 drive failed the boot. Table 6-1 shows the
RX33 error table addresses and meanings.
Table 6-1

RX33 Error Table

Address

Meaning

00000400

Contains controller error code (code 1 or code 2)

6-6 Off-line Diagnostics

Table 6-1 (Cont.)

RX33 Error Table

Address

Meaning

00000402

RX33 address being accessed, if applicable

00000404

Expected result

00000406

Actual result

00000410

Drive error code, byte-encoded: drive l/drive 0
(high-byte/low-byte)

NOTE

It is not possible to simultaneously have information in addresses 00000400 and 00000410.
If the boot fails with a RX33 error, the ODT feature of the PDP-II is used to examine the RX33
error table to determine why each RX33 drive failed the test. (Remember, the bootstrap tries both
drives before declaring an error.) Use the following sequence to examine the RX33 error code table.
1. Press the break key on the console terminal.
The terminal displays the address of the current instruction of the bootstrap, then prompts
for input with an @ character.
2. Type the appropriate address, nnn.
The terminal displays the (octal) contents of that address.
3. Press LINEFEED to examine the Table 6-2 controller error and related failure
information.
Table 6-2

RX33 Error Code Table

Controller Error

Failure Information

1

NXM occurred while accessing RX33 registers.

2

A bit was stuck in the registers. See EXPected/ACTual for more information.

3

Force mode interrupt did not occur.

4

DMA test mode hardware error occurred.

5

DMA address counters were wrong after transfer.

6

Incorrect data found after DMA test operation.

7

Data parity was bad after DMA test operation.

10

Drive was not ready (no diskette inserted or door was open).

11

Hard error (CRC or Record Not Found) occurred on RECAUverify.

12

Track 0 bit was not set after RECAL.

13

SEEK command timeout occurred.

14

Seek error (CRC or Record Not Found) occurred.

15

READ SECTOR command timeout.

16

Hard error (CRC or Record Not Found) occurred on read.

17

N onbootable image (non-NOP instruction is the first word).

Failure information for both drives in address 00000410 is possible. In this case, nonzero data
is in both bytes. Only when failures are detected on both drives does the boot ROM generate a
LOADFAL failure code and branch to the fault light routine.

Off-line Diagnostics 6-7

•

Test 6, Transfer Control to Loaded Image-This part of the bootstrap is not actually a test.
However, it is given a test number in case an error occurs in this section of code. The PDP-11
general registers are loaded with certain parameters (CSR and unit of load device, base address,
and size of partition, and so forth). The image loaded from the RX33 is initiated by jumping to
the first instruction. Any errors occurring in this part of the bootstrap are probably unexpected
traps or interrupts caused by intermittent P.ioj/c or M.std2/M.std failures. When the loaded
image is started, the State lamp is lit, and the lnit lamp is turned off.

6.2.7 Generic Error Message Format
All of the diagnostics use a comman method of reporting errors and a common error message
format. All errors are reported on the console terminal as they occur. In all off-line diagnostics,
error messages conform to the HSC diagnostic error message format.
The first line of an error message contains general information concerning the error and is
mandatory. The second line of an error message consists of text describing the error and also is
mandatory. The third and succeeding lines of the message are used for additional information
where required, and are optional.
The generic error message format follows:
XXXXXX>hh:mm Tn En 0000
SEEK error detected during positioning operation
optional line 1
optional line 2
optional line 3
Where:
XXXXXX> is the prompt for the particular diagnostic in question
such as OFLCXT> or OBIT>.
hh:mm is the number of hours and minutes since system boot.
Tn is a test number.
En is an error number with a range of 1 through 77 (octal).
0000 is the unit number.

The final field in the first line appears only in diagnostics where such information is appropriate.
Each error number has a unique text string associated with it. For errors that consist of results
that did not compare with the expected value, the diagnostic uses the optional lines to show
EXPected/ACTual (EXP/ACT) data. Errors on data transfers and SEEK commands use the optional
lines to print out the LBN, track, sector, and side to help isolate problems to the media or the drive.

6.3 ODL-Off-line Diagnostics Loader
The off-line diagnostics loader provides a software environment for the HSC off-line diagnostics.
The loader supports a command language that loads and executes an off-line diagnostic from the
load device into Program memory. The loader command language also permits the display and
modification of any address contents in the HSC Program, Data, or Control memories.
The software environment provided for off-line diagnostics includes a load device driver and a
terminal driver. A standard software interface between the diagnostics and the load device and
terminal devices takes the place of individual interface routines within the diagnostics. The loader
also maintains a timer that keeps track of the relative time since the loader was last booted. This
allows diagnostic error messages to be time-stamped.

6-8 Off-line Diagnostics

6.3.1 Loader System Requirements
Hardware required to run the off-line diagnostics loader includes:
•

110 Control Processor module with HSC Boot ROM

•

At least one memory module

•

RX33 controller with at least one working drive

or
•

TU58 with at least one working drive

•

Terminal connected to 110 Control Processor console interface

6.3.2 Loader Prerequ isites
In the process of loading the off-line diagnostics loader, several diagnostics are run. The ROM
bootstrap tests the basic PDP-II instruction set, tests a partition in Program memory, and tests the
load device used for the boot. Then the bootstrap loads the off-line P.ioj/c test, which completes the
PDP-1I tests and the remainder of the I/O Control Processor module tests.
Mter these tests, the off-line diagnostics loader is loaded from the load device to memory, and
control is passed to the loader. Due to the sequence of tests that precede the loader, the loader
assumes the 110 Control Processor module and the RX.33 are tested and working.

6.3.3 Loader Operating Instructions
Follow these steps to start the off-line loader:
1.

Insert the HSC off-line diagnostics media into the load device.

2.

Power on the HSC, or press and release the Init button on the HSC OCP.

3. The load device drive-in-use LED lights within a few seconds, indicating the bootstrap is loading
the off-line diagnostic loader to Program memory.
4. In less than 30 seconds, the off-line diagnostics loader indicates it has loaded properly by
displaying the following:
HSC OFL Diagnostic Loader, Version Vnnn
Radix=Octal,Data Length=Word,Reloc=OOOOOOOO
ODL>

5. The off-line loader is now ready to accept commands. Section 6.3.4 contains information on the
loader command language.

6.3.4 Loader Commands
The following sections describe the commands recognized by the off-line loader.
6.3.4.1 HELP Command
The HELP command supplies an abbreviated list of all commands the loader recognizes. In
response to the HELP command, the loader reads the file OFLLDR.HLP from the load device
and displays the contents of this file on the HSC console terminal. Section 6.3.5.2 contains a listing
of the loader help file.

Off-line Diagnostics

6-9

6.3.4.2 SIZE Command
The off-line system sizer is invoked by the SIZE command. The sizer determines the sizes of the
HSC Program, Control, and Data memories, and the type of requestor in each HSC requestor
position. The term requestor position refers to the priority of a particular requestor on the Data
and Control memory buses. It does not match the numbering of module slots.
6.3.4.3 TEST Command
The off-line diagnostics loader TEST command is used to invoke the various off-line diagnostics
available on the HSC. The following list shows the particular form of the TEST command used to
invoke each diagnostic. In general, the TEST command format allows specification of the system
component to be tested; for instance, the TEST MEMORY command invokes the off-line memory
test.

•

Off-line Cache Test-Verifies the full functionality of the onboard cache. The off-line cache
test is invoked by the TEST CACHE command.

•

Bus Interaction Test-Invoked by the TEST BUS command. The bus interaction test
generates contention on the HSC Data and Control memory buses by two or more Ks
simultaneously testing different sections of the Control and Data memories. '1Wo or more
working requestOrs are required to run this test (including the K.ci).

•

K Test Selector-Invoked by the TEST K command. The K test selector allows specific
requestor microdiagnostics to run.

•

KIP Memory Test-Invoked by the TEST MEMORY BY K command. The KIP memory test
uses one of the HSC requestors to test either Data or Control memory. This test runs faster
than the off-line memory test because a requestor is- roughly seven times faster than the 110
Control Processor. Program memory cannot be tested using the KIP memory test as the Ks do
not have an interface to the Program memory bus.

•

Off-line Memory Test-Invoked by the TEST MEMORY command. This test uses the 110
Control Processor to test Program, Control, or Data memories.

•

Off-line RX33 Exerciser-A combined hardware diagnostic and exerciser for the M.std.2lRX33
subsystem of the HSC. Invoke the off-line RX33 exerciser by the TEST RX command.

•

Memory Refresh Test-Invoked by the TEST REFRESH command. The memory refresh test
allows the refresh feature of the memories to be tested.

•

OCP Test-Invoked by the TEST OCP command. The OCP test checks the HSC lights and
switches. The test requires manual intervention by an operator.

6.3.4.4 LOAD Command
The LOAD command loads a program into HSC Program memory without starting it. The
command format is LOAD , where  is the name of any file on the HSC
OFFLINE diskette. The loader finds the specified file and loads it into Program memory. This
command is for patching a program image in before starting execution. After the patch is made,
the program can be initiated through the START command.
6.3.4.5 START Command
The START command initiates the loader program currently loaded in Program memory. The
START command can be used in conjunction with the LOAD.command, or it may be used to
reinitiate the last loaded off-line diagnostic. This saves the time required to reload the program
from the load device. For example, you have previously typed SIZE to initiate the off-line system
sizer program and after the sizer completes, you wish to run it again. Typing START restarts the
sizer without reloading the program from the load device, saving many seconds of load time.

6-10 Off-line Diagnostics

6.3.4.6 EXAMINE and DEPOSIT Commands
The EXAMINE and DEPOSIT commands are used to display or modify the contents of any location
in the asc Program, Control, and Data memories. Qualifiers (switches) can be used with these
commands to display bytes, words, long words, or quad words. The radix (octal, decimal, hex) of
the displayed data also can be controlled by qualifiers. Alternately, the SET DEFAULT command
can be used to set the default data length and radix for all EXAMINE and DEPOSIT commands
(Section 6.3.4.11).

EXAMINE Command:
The EXAMINE command is used to display the contents of any location in the asc Program,
Data, or Control memories. The format of the command is: EXAMINE 
. The
can be a string of digits in the current (default) radix. Certain symbolic addresses also are permitted (Section 6.3.4.7). In the following example, the user entered a command to examine the contents of location 14017776. (Notice the EXAMINE command can be abbreviated to a single E.) When the loader displays the contents of location 14017776, the address is preceded by a (D) indicating the location is within Data memory. The display shows the location contains the value 125252. ODL> E 14017776 (D) 14017776 125252 DEPOSIT Command: The DEPOSIT command is used to modify the contents of any location in the asc Program, Control, or Data memories. The format of the command is: DEPOSIT
. The
can be a string of digits in the current (default) radix. Certain symbolic addresses also are permitted (Section 6.3.4.7). In the next example, the user entered a command to store the value 123456 in the contents of address 14017776. The previous contents of this Data memory location are replaced with the value specified in the DEPOSIT command (123456). ODL> D 14017776 123456 6.3.4.7 EXAMINE and DEPOSIT Symbolic Addresses The four symbols used as symbolic addresses in a DEPOSIT or EXAMINE command are described in the following list. • Asterisk (*)-Indicates the loader is to use the same address as used in the last EXAMINE or DEPOSIT command. For example, if the contents of address 16012344 were just examined and the value 1234 is to be deposited into the same address, type DEPOSIT * 1234 instead of typing DEPOSIT 16012344 1234. • Plus sign (+)-This sign also is used as a symbolic address. This symbol means the loader is to use the address following the last address used by an EXAMINE or DEPOSIT command. When the loader sees a plus sign (+) as an address, it takes the last address used by EXAMINE or DEPOSIT and adds an offset, which depends on the current default data length (Section 6.3.4.11). If the current default data length is a byte, the loader adds one to the last address. If the default is a word, the loader adds two to the last address. The offset is four for longword data length and eight for quadword. This feature is useful when examining a number of items stored in successive locations. For example, if you want to examine a table of words beginning at address 14125234, examine the first location by typing EXAMINE 14125234. The next location can now be examined by typing EXAMINE + instead of typing EXAMINE 14125236. Off-line Diagnostics • 6-11 Minus sign (-)-This sign also is used as a symbolic address. It indicates the loader is to use the address preceding the last address used by either command. When the loader sees a minus sign (-) as an address, the loader takes the last address used by an EXAMINE or DEPOSIT and subtracts an offset, which depends on the current default data length (Section 6.3.4.11). If the current default data length is a byte, the loader subtracts one from the last address. If the default is a word, the loader subtracts two from the last address. The loader subtracts four for longword data length and eight for quadword. This feature is useful in the same way as the + symbol, but examines a table starting at the highest address and proceeding down to lower addresses. For example, if a table of words that ends at address 14012346 is to be examined, the operator would examine the last location of the table by typing EXAMINE 14012346. The preceding location in the table could now be accessed by typing EXAMINE - instead of typing EXAMINE 14012344. • At (@)-The @ symbol also is used as a symbolic address. This symbol means the loader uses the data from the last EXAMINE or DEPOSIT command as an address. This feature is useful when following linked lists. For example, first examine location 123434 which contains a pointer to a linked list. Now type EXAMINE @ to examine the location pointed to by the first location. 6.3.4.8 Repeating EXAMINE and DEPOSIT Commands When troubleshooting memory problems, continuously executing an EXAMINE or DEPOSIT command is sometimes useful. The REPEAT command is used for this continuous execution. Type REPEAT EXAMINE or DEPOSIT. To stop a repeated command, type CTRUC. In the following example of repeating a DEPOSIT command, the value 125252 is continuously deposited into address 14017776. The format of the DEPOSIT command does not change. The DEPOSIT command is just preceded by the word REPEAT. Also, the REPEAT command can be abbreviated to RE: REPEAT DEPOSIT 14017776 125252 or BE D 14017776 125252 In the repeating an EXAMINE command example, the contents of address 14017776 can be continuously examined. The format of the EXAMINE command does not change. The EXAMINE command is just preceded by the word REPEAT. REPEAT BXAMDm 14017776 or BE E 14017776 In the examples shown, the contents of location 14017776 are displayed continuously on the terminal. This slows down the repetition of the command and wastes paper on hardcopy devices. Stop output to the terminal by typing a CTRUO. However, the loader also provides a special EXAMINE command qualifier (!INHIBIT) for suppressing output to the terminal. This qualifier is discussed in Section 6.3.4.10. 6.3.4.9 Relocation Register The loader provides a relocation register. It can be used to reduce the number of address digits typed for an EXAMINE or DEPOSIT command when all addresses are in either the Control or Data memories. The contents of the relocation register are added to the address given with an EXAMINE or DEPOSIT command. The relocation register contains a 0 when the loader is initiated, so it normally has no effect on the addresses typed in an EXAMINE or DEPOSIT command. 6-12 Off-line Diagnostics Use the following example to examine many locations in Data memory. ODL> SET RELOCATION:14000000 ODL> EXAMINE 0 (D) 14000000 123432 ODL> EXAMINE 1234 (D) 14001234 154323 Load the relocation register with the address of the first location in Data memory (14000000). When an EXAMINE command with an address of 0 is issued, the loader adds the relocation register to the address given, resulting in the examination of address 14000000. Likewise, when an EXAMINE command with an address of 1234 is issued, the loader displays the contents of location 14001234. The following example shows how to examine many locations in Control memory. ODL> SET RELOCATION:16000000 ODL> EXAMINE 0 (C) 16000000 125252 ODL> EXAMINE 4320 (C) 16004320 125432 The relocation register is loaded with the address of the :first location in Control memory (16000000). When an EXAMINE command is issued with an address of 0, the loader adds the relocation register to the address given, displaying the contents of address 16000000. Likewise, when the user issues an EXAMINE command with an address of 4320, the loader displays the contents of location 16004320. You can stop the display with a CTRUC. 6.3.4.10 EXAMINE and DEPOSIT Qualifiers (Switches) The following list describes the EXAMINE and DEPOSIT qualifiers. • /NEXT-Allows an EXAMINE or DEPOSIT command to work on successive addresses. When used with a valid EXAMINE command, it specifies that after the command location has beeD: displayed, the loader also displays the next number of locations following the first. For example, the command E 10001NEXT:5 results in the display of locations 1000, 1002, 1004, 1006, 1010, and 1012 (assuming the default data length is a word). The number of the argument can be any value in the current default radix that can be contained in 15 binary bits or less. For instance, if the default radix is octal, the number of the argument can be any value between 1 and 77777. The /NEXT qualifier works the same way for the DEPOSIT command, except that the data given with the DEPOSIT command is stored in the location specified and the next number of locations following. • IBYTElWORDILONG/QUAD--These qualifier switches are used to control the data length of examined or deposited data. Normally, the loader uses the default data length (Section 6.3.4.11) when data is examined or deposited. However, the data length qualifiers can be used to override the default for a single examine or deposit. For instance, assume the default data length is currently a word, and a byte quantity at address 16001234 is to be examined. Typing EXAMINE 160012341BYTE would display the proper byte without affecting the default data length. • IOCTAUDECIMAIIIIEX-These qualifier switches can be used with an EXAMINE command to control the radix of the address and data displayed. They are not used to control the radix of the address supplied in the EXAMINE command. The radix of the address and data displayed by an EXAMINE command is usually controlled by the current default radix (Section 6.3.4.11), but the IOCTAlJDECIMAUHEX qualifiers are used to override the default radix for a single EXAMINE command. For example, assume the default radix is octal. Typing EXAMINE 140012341HEX displays the contents of address 14001234(8) in the hexadecimal radix. The Off-line Diagnostics 6-13 EXAMINE display would be as follows: (D) 30029C HHHH. HHHH represents the contents (hex) of the location displayed. The address is also displayed in hex. • /INHIBIT (abbreviated to IINH)-This qualifier switch inhibits the display of examined data when repeating an EXAMINE command. This is useful both for saving paper on hardcopy devices and for speeding up the EXAMINE operation for scope-loop purposes. For example, the command REPEAT EXAMINE 16012346IINH results in the loader continuously reading the contents of location 16012346 without displaying anything at the console. 6.3.4.11 Setting and Showing Defaults The SET DEFAULT command is used to change the default radix and/or data length. The default radix controls the radix of parameters supplied with EXAMINE or DEPOSIT commands and the radix of data displayed by the EXAMINE command. The default data length controls the length (byte, word, long, quad) of data displayed by the EXAMINE command or data stored by a DEPOSIT command. The default radix may be set to octal, decimal, or hexadecimal. When the off-line loader first starts, it sets the default radix to octal. Type SET DEFAULT HEX to set the default radix to hexadecimal. Mter the default radix is set, it remains so until another SET DEFAULT command is issued or the loader is rebooted. The default data length may be set to byte, word, longword, or quadword. When the loader is first started, it sets the default data length to word (16 bits). Type SET DEFAULT LONG to set the default data length to longword (32 bits). Setting the default data length to longword causes an EXAMINE command to display longword quantities and causes the DEPOSIT command to store longword quantities. (Because the loader is executing in a PDP-II, longwords are stored and retrieved as two successive 16-bit words.) After the default data length is set, it remains so until changed by another SET DEFAULT command or until the loader is rebooted. 6.3.4.12 Executing INDIRECT Command Files The loader is capable of executing indirect command files stored on the load device. These command files consist of valid off-line loader commands terminated by a carriage return «CR» and a line feed «LF». Comments may also be placed in indirect command files by preceding a comment line with an exclamation mark (t). Comment lines must also be tenninated with a and . As an example, the Off-line Loader Help file (Section 6.3.5.2) is an indirect command file that contains only comments. Indirect command files cannot be created by the loader or by CRONIC. The command files must be created in RT-ll format and stored on the off-line diagnostics diskette. Any editor that does not insert line numbers in the output files can be used to create command files. 6.3.5 Unexpected Traps and Interrupts When the loader detects an unexpected trap or interrupt, the following message is displayed: Unexpected trap through www, VPC=xxx, PSW=yyy Error Address = zzz Where: www xxx yyy zzz is the address of the trap or interrupt vector. is the virtual PC of the loader at the time of trap. are the contents of PSW at the time of trap. is the address of the location causing NXM or parity trap. The first line of the unexpected trap report is issued for all unexpected traps or interrupts. The second line is issued only if the trap was through vector addresses 000004 (NXM trap) or 000114 (parity trap). The address of the vector is a direct clue to the cause of the trap. Refer to Section 6.3.5.1 for a list of the devices and error conditions associated with each vector. 6-14 Off-line Diagnostics The virtual PC (VPC) of the instruction executing when the trap occurs is sometimes useful in determining the cause of the trap. The VPC can be referenced in the listing to find the instruction causing the trap. The contents of the VPC includes the address of the instruction following the instruction executing when the trap occurred. Notify Customer Service to analyze such failures. NXl\f traps can be caused by EXAMINE or DEPOSIT commands if an address not contained in a particular HSC is specified. For example, if an HSC contains only Data memory from addresses 14000000 through 14177776, and an EXAMINE or DEPOSIT is tried for address 14200000, the loader reports an NXM trap. In this example, the NXM trap would not represent an error condition. Parity traps can be caused by an EXAMINE command if a user examines an address not initialized with good parity. For example, when the HSC memories are powered on, the parity bits are in random states. Thus, if a user examines a location not written since power-on, the location may generate a parity error. This does not constitute an error condition. However, if a location produces a parity error and that location has been written since power-on, a memory error is indicated. . NOTE The 110 Control Processor and Ks have hits allowing them to write had parity for testing the parity circuit. These bits are for diagnostics engineering purposes only. 6.3.5.1 Trap and Interrupt Vectors Table 6-,.3 is a list of trap and interrupt vectors for various devices and error conditions recognized by the 110 Control Processor PDP-II processor. Off-line Diagnostics Table 6-3 Trap and Interrupt Vectors Vector Device or Error Condition 000004 Nonexistent memory, stack overflow, halt in user mode, and odd address trap 000010 illegal instruction 000014 BPI' instruction 000020 lOT instruction 000024 Power fail interrupt 000030 EMT instruction 000034 TRAP instruction 000060 Console terminal-receiver interrupt 000064 Console terminal-transmitter interrupt 000100 Line clock interrupt 000114 Parity trap 000120 Control bus interrupt---level 4 000124 Control bus interrupt---level 5 000130 Control businterrupt---level6 000134 Control bus interrupt---level 7 000230 RX33 interrupt 000250 MMU abort (trap) 000300 SLU (Serial Line Unit) #1, receiver interrupt 000304 SLU (Serial Line Unit) #1, transmitter interrupt 000314 SLU (Serial Line Unit) #2, receiver interrupt 000310 SLU (Serial Line Unit) #2, transmitter interrupt 6-15 6-16 Off-line Diagnostics 6.3.5.2 Help File The help file display is started by entering HELP at the ODL prompt. This file is unique to each version of software, as shown by Vnnn in Example 6-1. This display is the complete help facility for the off-line diagnostics. Exit the help file display by typing a CTRUC. HSC OFL Diagnostic Loader Help File - Vnnn Capital letters = required input, lower case optional Commands (terminated by CR): 'Examine
' ;display data at
specified 'Deposit
' ;deposit to
= digit string in current default radix, or: ,*, use same address as last ex or de '+' use address following last address '-' use address preceding last address '@' use from last ex or de as address 'HElp' ;print this file '@' ;execute indirect command file 'Load ' iload file to diagnostic partition 'REpeat ' ";repeat specified command until AC 'RUN ' i Do implicit LOAD and START of 'SEt Default

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