IPC 9850 Table Of Contents

User Manual: 9850

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IPC-9850
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES ®

Surface Mount
Placement Equipment
Characterization

Developed by the SMT Component Placement Equipment Subcommittee
(5-41) of the Assembly Equipment Committee (5-40) of IPC

September 16, 2002

Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798

July 2002

IPC-9850

Table of Contents
INTRODUCTION ........................................................ 1

4.3.1

Number of Machines ......................................... 17

1.1
1.2

Scope .................................................................... 1
Purpose ................................................................. 1

4.3.2

Total Number of Placements ............................. 17

4.3.3

Total Pickup Attempts ....................................... 17

1.3
1.3.1
1.4
1.4.1
1.4.2
1.4.3

Background ..........................................................
Future Considerations ..........................................
Implementation ....................................................
Characterization Limitations ...............................
Binding Requirements .........................................
Test Components .................................................

1.4.4
1.4.5

Test Panels ........................................................... 3
Measurement ........................................................ 3

1.5

Forms ................................................................... 4

1.6

1

1
2
2
2
2
2

5

MEASUREMENT CAPABILITY VERIFICATION—
FORM IPC-9850-F3 ................................................ 17

5.1

Gauge Repeatability and Reproducibility
Capability ........................................................... 17

5.2

Accuracy Capability .......................................... 17

6

TEST VEHICLES .................................................... 19

6.1

Placement Verification Panel Specifications ..... 19

6.2

Placement Verification Panel Carrier
Specifications ..................................................... 20

Data Methods ....................................................... 4

6.3

Glass Slug Specifications .................................. 20

1.7

Terms and Definitions ......................................... 4

6.4

Sticky Media Application .................................. 20

1.8

Units of Measurement ......................................... 5

6.5

Placement Program ............................................ 26

6.5.1

1608C Component ............................................. 26

6.5.2

SOIC-16 Component ......................................... 26

6.5.3

QFP-100 and BGA-228 Slugs ........................... 26

6.5.4

QFP-208 Slug .................................................... 26

2

REFERENCED DOCUMENTS ................................. 5

3

PLACEMENT PERFORMANCE METRIC ................ 5

3.1

Machine Performance Form IPC-9850-F1 ......... 5

3.1.1

General Performance ........................................... 5

3.1.2

Performance Validation ........................................ 5

7

3.2

Characterization Methodology ............................ 6

APPENDIX A

.............................................................. 35

3.2.1

Background .......................................................... 6

APPENDIX B

3.3

.............................................................. 36

Machine Performance Parameters ....................... 7

3.3.1

Test Conditions .................................................... 7

APPENDIX C

.............................................................. 37

3.3.2

Time-Based Parameters ....................................... 7

APPENDIX D

.............................................................. 39

3.3.3

CMM Measured Parameters ................................ 9

APPENDIX E

.............................................................. 44

ATTRIBUTE DEFECT RATE AND RELIABILITY
PERFORMANCE METRIC—FORM IPC-9850-F2 . 12

APPENDIX F

.............................................................. 48

4.1

Attribute Defect Rate ......................................... 13

APPENDIX G

.............................................................. 49

4.2

Reliability Parameters ........................................ 14

APPENDIX H

.............................................................. 50

4.2.1

Mean Placements Between Assists (MPBA) .... 15

4.2.2

Mean Time To Recover from Assists
(MTTRa) ............................................................ 15

APPENDIX I

............................................................... 51

APPENDIX J

.............................................................. 52

4.2.3

Mean Placements Between Failures (MPBF) ... 15

4.2.4

Mean Time To Repair Failures (MTTRf) ......... 15

4.2.5

Total Time .......................................................... 15

4.2.6

Non-Scheduled Time ......................................... 15

4.2.7

Operations Time ................................................. 16

4.2.8

Equipment Dependent Uptime .......................... 16

4.2.9

Preventative Maintenance (PM) Time .............. 16

4

FORMS AND DIAGRAMS ...................................... 31

Figures
Figure 3-1

Performance Parameter Description for
a Single Panel .................................................. 8

Figure 3-2

Performance Parameter Description for a
Four-Panel Build ............................................... 8

Figure 3-3

Maximum Lead Tip Error Due to Placement
Machine (Combined Xdev, Ydev and θdev .... 11

4.2.10 Mispick Rate (in PPM) ..................................... 16

Figure 5-1

Accuracy Verification Panel ............................ 18

4.3

Figure 6-1

Placement Verification Panel .......................... 20

Reporting Sites ................................................... 17

iii

IPC-9850

July 2002

Figure 6-2

QFP 100 Slug for White Background for
Leads on Chrome Background (Negative) ..... 21

Figure A-1
Figure H-1

Gauge R&R Spreadsheet Example ............... 50

Figure 6-3

QFP 100 Slug for Chrome Leads With No
Background (Positive) .................................... 22

Figure I-1

Placement Verification Panel Carrier ............. 51

Figure 6-4

QFP 208 Slug for White Background for
Leads on Chrome Background (Negative) ..... 23

Figure J-1

Termination-to-Land Calculation Example ...... 52

Figure 6-5

QFP 208 Slug for Chrome Leads With No
Background (Positive) .................................... 24

Figure 6-6

BGA-228 Slug for White Background for
Leads on Chrome Background (Negative) ..... 25

Figure 6-7

BGA-228 Slug with No Background
(Positive) ......................................................... 26

Figure 6-8

Component Location Layout for 1608C
Components ................................................... 27

Cpk Graphic Representation .......................... 35

Tables
Table 3-1

Cpk for Termination-to-Land Coverag ............... 11

Table 4-1

Component Types
and Quantities for ‘Typical Kit’ .......................... 13

Table 4-2

Calculation Example ......................................... 15

Table 4-3

Terms Definition ................................................ 16
Tool Kit Materials List
for Performance Evaluation .............................. 19

Figure 6-9

Component Location Layout for SOIC 16
Components ................................................... 28

Table 6-1

Figure 6-10

Component Location Layout for QFP-100
and BGA 228 Slug Components .................... 29

Table D-1

Mean and stdev using 2 fiducials ..................... 40

Table D-2

Mean and stdev per method using 4 fiducials .. 40

Figure 6-11

Component Location Layout for QFP-208
Slug Components ........................................... 30

Table D-3

Mean and stdev vs. number of
measured leads ................................................. 42

iv

July 2002

IPC-9850

Surface Mount Placement Equipment Characterization
1 INTRODUCTION

This standard establishes the procedures to
characterize the capability of surface mount assembly
equipment in specification documents, as well as in documentation used to verify a specific machine’s placement
capability conformance to the specification, while maintaining a placement accuracy to placement speed relationship.

1.1 Scope

1.2 Purpose IPC-9850 has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment characterization
parameters. These standardized tools shall be used to
develop and report the information called out in this standard.
1.3 Background With the proliferation of Surface Mount
Technology (SMT), placement equipment users have
struggled with the question of which machine will perform
best in a given manufacturing environment. The advantage
of the SMT assembly process to rapidly place components
in precise alignment to the land patterns on the printed
wiring board (PWB) was the initial yardstick by which
machines were selected. Machines that could place components the quickest and with the least amount of scrap were
considered the best.

Initially, the most common evaluation method was placement yield. For this evaluation, a machine is made to populate a large number of the user product where visible placement errors are counted as defects. Machines with the least
defects and the most robust operation were considered best.
The high yield and reliability of modern SMT placement
systems require that very large amounts of data be collected to meaningfully assess yield and reliability. This
standard provides new tools for gauging the yield and reliability of placement equipment yet presents performance
results in the traditional metrics.
In addition to the high yield and reliability expected of
modern placement equipment, the SMT assembly process
has become significantly more demanding. Components
have decreased in size, component terminations are
smaller, and placement locations have moved closer
together. All this while the number of components on the
PWB and product volumes have increased significantly.
Placement equipment must now place components more
rapidly and with extreme precision to be financially viable.
This has made requirements on placement machines more
demanding.

Historically, placement equipment vendors have selected
their own parameters and methodologies to present the
specification of their machines’ throughput and placement
capabilities. The many representations of this information
have made the comparison between similar types of placement machines very difficult. To obtain comparable data,
users have been forced to conduct on-location evaluations
of various machines under the same conditions. This type
of methodology is very time consuming for users and very
capital intensive for suppliers.
This standard simplifies the evaluation process by standardizing the performance parameters that describe the placement machines’ capabilities. It also couples placement
throughput and placement quality so speed and accuracy
parameters are dependent on each other. This standard also
specifies the methodologies by which the capability parameters are measured. This reduces potential user-vendor friction created when the user believes the equipment is not
functioning properly. The methodologies specified herein
are consistent and verifiable, thus providing commonground-methodologies between users and vendors.
These methodologies were achieved by separating machine
performance from the rest of the SMT process variables,
which include paste printing, component quality, packaging
type and PWB quality. The speed and quality evaluation
methods of this standard specify that measurements will be
made by placement of standardized components into sticky
media on clear glass panels. Experience shows that surface
mount equipment must perform well on sticky media
before it can perform well in production. Furthermore,
improved process capability on sticky tape usually translates into enhanced process capability in production.
Although this method does not provide information that
can be utilized to perfectly predict production quality, this
methodology was selected in order to remove as much of
the variation as possible between facilities, products, process, and operators.
While the ultimate goal is to evaluate a machine’s capability to place components in paste on actual PWBs, it is not
currently possible to make such measurements at the
required precision and speed. It is anticipated that future
in-line inspection systems will improve in their ability to
measure component location and orientation. In the future
it may become possible to use in-line post-placement (prereflow) automatic optical inspection (AOI) systems to measure the placement machine capabilities.
Due to the convergence of high-speed and fine pitch
machines, this standard makes no attempt to separate the
two types of machines. The user is empowered to decide if
1



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